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Sample records for solder leach resistance

  1. Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

    Science.gov (United States)

    Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

    2018-06-01

    Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

  2. Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

    Science.gov (United States)

    Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

    2018-03-01

    Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

  3. Leaching of Conductive Species: Implications to Measurements of Electrical Resistivity.

    Science.gov (United States)

    Spragg, R; Jones, S; Bu, Y; Lu, Y; Bentz, D; Snyder, K; Weiss, J

    2017-05-01

    Electrical tests have been used to characterize the microstructure of porous materials, the measured electrical response being determined by the contribution of the microstructure (porosity and tortuosity) and the electrical properties of the solution (conductivity of the pore solution) inside the pores of the material. This study has shown how differences in concentration between the pore solution (i.e., the solution in the pores) and the storage solution surrounding the test specimen leads to significant transport (leaching) of the conductive ionic species between the pore solution and the storage solution. Leaching influences the resistivity of the pore solution, thereby influencing electrical measurements on the bulk material from either a surface or uniaxial bulk resistance test. This paper has three main conclusions: 1.) Leaching of conductive species does occur with concentration gradients and that a diffusion based approach can be used to estimate the time scale associated with this change. 2.) Leaching of ions in the pore solution can influence resistivity measurements, and the ratio of surface to uniaxial resistivity can be used as a method to assess the presence of leaching and 3.) An estimation of the magnitude of leaching for standardized tests of cementitious materials.

  4. Electrical Resistance of Nb$_{3}$Sn/Cu Splices Produced by Electromagnetic Pulse Technology and Soft Soldering

    CERN Document Server

    Schoerling, D; Scheuerlein, C; Atieh, S; Schaefer, R

    2011-01-01

    The electrical interconnection of Nb$_{3}$Sn/Cu strands is a key issue for the construction of Nb$_{3}$Sn based damping ring wigglers and insertion devices for third generation light sources. We compare the electrical resistance of Nb$_{3}$Sn/Cu splices manufactured by solid state welding using Electromagnetic Pulse Technology (EMPT) with that of splices produced by soft soldering with two different solders. The resistance of splices produced by soft soldering depends strongly on the resistivity of the solder alloy at the operating temperature. By solid state welding splice resistances below 10 nOhm can be achieved with 1 cm strand overlap length only, which is about 4 times lower than the resistance of Sn96Ag4 soldered splices with the same overlap length. The comparison of experimental results with Finite Element simulations shows that the electrical resistance of EMPT welded splices is determined by the resistance of the stabilizing copper between the superconducting filaments and confirms that welding of ...

  5. Soldering handbook

    CERN Document Server

    Vianco, Paul T

    1999-01-01

    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  6. Study of the relation between hydrated portland cement composition and leaching resistance

    NARCIS (Netherlands)

    Eijk, van R.J.; Brouwers, H.J.H.

    1998-01-01

    The present paper addresses cement compositions that have an optimal resistance against acid attack and hence, low leaching rates and optimal waste containment. To this end a shrinking core leaching model is used that describes the leaching of metals from a cement sample. This process is directly

  7. Study of hydrated Portland cement composition in regard to leaching resistance

    NARCIS (Netherlands)

    Eijk, van R.J.; Brouwers, H.J.H.

    1997-01-01

    The present paper addresses cement compositions that have an optimal resistance against acid attack and hence, low leaching rates and optimal waste containment. To this end a shrinking core leaching model is used that describes the leaching of metals from a cement sample. This process is directly

  8. Resistance evaluation expanded perlite the leaching acid: variation of parameters concentration, time and leaching agent

    International Nuclear Information System (INIS)

    Almeida, J.M.F. de; Damasceno Junior, E.; Oliveira, E.S.; Fernandes, N.S.

    2016-01-01

    The expanded perlite is an amorphous aluminosilicate which presents in its composition about 75.0% silicon oxide (SiO2), also having other species in the composition as oxides of some metals. Silicas and silicates have been used in the environmental field, in relevant anti-corrosive activity. In this context, materials that exposes too many highly acidic media, require preservation against this type of wear, as this type of damage causes a great financial loss, thereby requiring low-cost, abundant materials, non-toxic and easy to purchase as some silica coating. The study evaluated the perlite expanded resistance against an acid leaching process. With undeniability the use of strong acids and different working conditions were not able to remove the oxides present on the expanded perlite sample, thus demonstrating the high strength of the expanded perlite against acid attacks. (author)

  9. EFFECTS OF MINERAL ADMIXTURE ON THE CARBONIC ACID LEACHING RESISTANCE OF CEMENT-BASED MATERIALS

    Directory of Open Access Journals (Sweden)

    Yun Dong

    2017-07-01

    Full Text Available In order to reveal the degradation process and deterioration mechanism of cement-based materials, this paper analyzes the effects of carbonic acid leaching on the mechanical strength of mortars, as well as relative mass loss, microstructure, and composition of various cement pastes. The results indicate that cement pastes containing less than 20 % fly ash have higher carbonic acid leaching resistance than cement pastes without fly ash. However, after carbonic acid leaching, the compressive strength of the samples with fly ash is lower than that of the cement pastes without fly ash. The leaching resistance is good for samples cured at an early age before leaching. Carbonic acid leaching proceeds from the paste surface to the interior. The incorporation of an appropriate amount of slag powder helps to increase the density of the paste. Due to the pozzolanic activity of fly ash at late-stage leaching, a mixture of fly ash (≤ 20 % and slag powder (≤ 20 % effectively improves carbonic acid leaching resistance. The products of early-stage leaching were mainly CaCO₃ and small amounts of SiO₂ and Fe₂O₃. The C-S-H phase at the paste surface suffered serious damage after long periods of leaching, and the main products of leaching were SiO₂ and Fe₂O₃.

  10. Effect of different glass and zeolite A compositions on the leach resistance of ceramic waste forms

    International Nuclear Information System (INIS)

    Lewis, M.A.; Hash, M.; Glandorf, D.

    1996-01-01

    A ceramic waste form is being developed for waste generated during electrometallurgical treatment of spent nuclear fuel. The waste is generated when fission products are removed from the electrolyte, LiCl-KCl eutectic. The waste form is a composite fabricated by hot isostatic pressing a mixture of glass frit and zeolite occluded with fission products and salt. Normalized release rate is less than 1 g/m 2 d for all elements in MCC-1 leach test run for 28 days in deionized water at 90 C. This leach resistance is comparable to that of early Savannah River glasses. We are investigating how leach resistance is affected by changes in cationic form of zeolite and in glass composition. Composites were made with 3 forms of zeolite A and 6 glasses. We used 3-day ASTM C1220-92 (formerly MCC-1) leach tests to screen samples for development purposes only. The leach test results show that the glass composites of zeolites 5A and 4A retain fission products equally well. Loss of Cs is small (0.1-0.5 wt%), while the loss of divalent and trivalent fission products is one or more orders of magnitude smaller. Composites of 5A retain chloride ion better in these short-term screens than 4A and 3A. The more leach resistant composites were made with durable glasses rich in silica and poor in alkaline earth oxides. XRD show that a salt phase was absent in the leach resistant composites of 5A and the better glasses but was present in the other composites with poorer leach performance. Thus, absence of salt phase corresponds to improved leach resistance. Interactions between zeolite and glass depend on composition of both

  11. Soldering of Nanotubes onto Microelectrodes

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing sold...... bonds were consistently found to be mechanically stronger than the carbon nanotubes.......Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...

  12. Solderability study of RABiTS-based YBCO coated conductors

    International Nuclear Information System (INIS)

    Zhang Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

    2011-01-01

    Study examines the implication of solder and flux selection in YBCO splice joints. Focus is on commercially available RABiTS-based YBCO coated conductors. Solderability varied with solder and flux for three different stabilizations tested. Resistivity of stabilizer was dominant factor in splice joint resistance. Solder materials affected splice joint resistance when solderability was poor. The solderability of commercially available YBa 2 Cu 3 O 7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

  13. Leach and mold resistance of essential oil metabolites

    Science.gov (United States)

    Carol A. Clausen; Vina W. Yang

    2011-01-01

    Purified primary metabolites from essential oils were previously shown to be bioactive inhibitors of mold fungi on unleached Southern pine sapwood, either alone or in synergy with a second metabolite. This study evaluated the leachability of these compounds in Southern pine that was either dip- or vacuum-treated. Following laboratory leach tests, specimens were...

  14. Estimating subsoil resistance to nitrate leaching from easily measurable pedological properties

    Directory of Open Access Journals (Sweden)

    Fábio Keiti Nakagawa

    2012-11-01

    Full Text Available Leaching of nitrate (NO3- can increase the groundwater concentration of this anion and reduce the agronomical effectiveness of nitrogen fertilizers. The main soil property inversely related to NO3- leaching is the anion exchange capacity (AEC, whose determination is however too time-consuming for being carried out in soil testing laboratories. For this reason, this study evaluated if more easily measurable soil properties could be used to estimate the resistance of subsoils to NO3- leaching. Samples from the subsurface layer (20-40 cm of 24 representative soils of São Paulo State were characterized for particle-size distribution and for chemical and electrochemical properties. The subsoil content of adsorbed NO3- was calculated from the difference between the NO3- contents extracted with 1 mol L-1 KCl and with water; furthermore, NO3- leaching was studied in miscible displacement experiments. The results of both adsorption and leaching experiments were consistent with the well-known role exerted by AEC on the nitrate behavior in weathered soils. Multiple regression analysis indicated that in subsoils with (i low values of remaining phosphorus (Prem, (ii low soil pH values measured in water (pH H2O, and (iii high pH values measured in 1 moL L-1 KCl (pH KCl, the amounts of surface positive charges tend to be greater. For this reason, NO3- leaching tends to be slower in these subsoils, even under saturated flow condition.

  15. Spontaneous soldering

    International Nuclear Information System (INIS)

    Percacci, R.

    1984-01-01

    It is proposed that the soldering form of general relativity be treated as a dynamical variable. This gives rise to the possibility of treating the linear connection on (n-dimensional) spacetime and an internal O(k)-Yang-Mills field as different components of the same O(N) gauge field (N= n+k). The distinction between gravitational and Yang-Mills interactions is due to a kind of Higgs mechanism driven by the vacuum expectation value of the soldering form. (orig.)

  16. Weatherability and Leach Resistance of Wood Impregnated with Nano-Zinc Oxide

    Directory of Open Access Journals (Sweden)

    Nami Kartal S

    2010-01-01

    Full Text Available Abstract Southern pine specimens vacuum-treated with nano-zinc oxide (nano-ZnO dispersions were evaluated for leach resistance and UV protection. Virtually, no leaching occurred in any of the nano-ZnO–treated specimens in a laboratory leach test, even at the highest retention of 13 kg/m3. However, specimens treated with high concentrations of nano-ZnO showed 58–65% chemical depletion after 12 months of outdoor exposure. Protection from UV damage after 12 months exposure is visibly obvious on both exposed and unexposed surfaces compared to untreated controls. Graying was markedly diminished, although checking occurred in all specimens. Nano-zinc oxide treatment at a concentration of 2.5% or greater provided substantial resistance to water absorption following 12 months of outdoor exposure compared to untreated and unweathered southern pine. We conclude that nano-zinc oxide can be utilized in new wood preservative formulations to impart resistance to leaching, water absorption and UV damage of wood.

  17. Soldering in electronics assembly

    CERN Document Server

    Judd, Mike

    2013-01-01

    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  18. Densification of salt-occluded zeolite a powders to a leach-resistant monolith

    International Nuclear Information System (INIS)

    Lewis, M.A.; Fischer, D.F.; Murhpy, C.D.

    1993-01-01

    Pyrochemical processing of spent fuel from the Integral Fast Reactor (IFR) yields a salt waste of LiCl-KCl that contains approximately 6 wt% fission products, primarily as CsCl and SrCl 2 . Past work has shown that zeolite A will preferentially sorb cesium and strontium and will encapsulate the salt waste in a leach-resistant, radiation-resistant aluminosilicate matrix. However, a method is sill needed to convert the salt-occluded zeolite powders into a form suitable for geologic disposal. We are thus investigating a method that forms bonded zeolite by hot pressing a mixture of glass frit and salt-occluded zeolite powders at 990 K (717 degree C) and 28 MPa. The leach resistance of the bonded zeolite was measured in static leach tests run for 28 days in 363 K (90 degree C) deionized water. Normalized release rates of all elements in the bonded zeolite were low, 2 d. Thus, the bonded zeolite may be a suitable waste form for IFR salt waste

  19. SMT soldering handbook

    National Research Council Canada - National Science Library

    Strauss, Rudolf

    1998-01-01

    ... 3.2.1 Constituents, melting behaviour and mechanical properties 3.2.2 Composition of solders for use in electronics 3.2.3 Lead-free solders 3.2.4 Solder impurities The soldered joint 3.3.1 Solde...

  20. Leach resistance properties and release processes for salt-occluded zeolite A

    International Nuclear Information System (INIS)

    Lewis, M.A.; Fischer, D.F.; Laidler, J.J.

    1992-01-01

    The pyrometallurgical processing of spent fuel from the Integral Fast Reactor (IFR) results in a waste of LiCl-KCl-NaCl salt containing approximately 10 wt% fission products, primarily CsCl and SrCl 2 . For disposal, this waste must be immobilized in a form that it is leach resistant. A salt-occluded zeolite has been identified as a potential waste form for the salt. Its leach resistance properties were investigated using powdered samples. The results were that strontium was not released and cesium had a low release, 0.056 g/m 2 for the 56 day leach test. The initial release (within 7 days) of alkali metal cations was rapid and subsequent releases were much smaller. The releases of aluminum and silicon were 0.036 and 0.028 g/m 2 , respectively, and were constant. Neither alkali metal cation hydrolysis nor exchange between cations in the leachate and those in the zeolite was significant. Only sodium release followed t 0.5 kinetics. Selected dissolution of the occluded salt was the primary release process. These results confirm that salt-occluded zeolite has promise as the waste form for IFR pyroprocess salt

  1. Features of soldering of molybdenum a lols

    International Nuclear Information System (INIS)

    Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

    1980-01-01

    Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

  2. Factors influencing the survival and leaching of tetracycline-resistant bacteria and Escherichia coli through structured agricultural fields

    DEFF Research Database (Denmark)

    Bech, Tina B.; Rosenbom, Annette E.; Kjaer, Jeanne

    2014-01-01

    Intense use of antibiotics in agricultural production may lead to the contamination of surface and groundwater by antibiotic-resistant bacteria. In the present study, the survival and leaching of E. coli and tetracycline-resistant bacteria were monitored at two well-structured agricultural fields...

  3. Tungsten oxide thin films grown by thermal evaporation with high resistance to leaching

    Energy Technology Data Exchange (ETDEWEB)

    Correa, Diogo S. [Universidade Federal de Pelotas (UFPel), RS (Brazil). Centro de Ciencias Quimicas, Farmaceuticas e de Alimentos; Pazinato, Julia C.O.; Freitas, Mauricio A. de; Radtke, Claudio; Garcia, Irene T.S., E-mail: irene@iq.ufrgs.br [Universidade Federal do Rio Grande do Sul (UFRGS), Porto Alegre, RS (Brazil). Instituto de Quimica; Dorneles, Lucio S. [Universidade Federal de Santa Maria (UFSM), RS (Brazil). Centro de Ciencias Naturais e Exatas

    2014-05-15

    Tungsten oxides show different stoichiometries, crystal lattices and morphologies. These characteristics are important mainly when they are used as photocatalysts. In this work tungsten oxide thin films were obtained by thermal evaporation on (100) silicon substrates covered with gold and heated at 350 and 600 °C, with different deposition times. The stoichiometry of the films, morphology, crystal structure and resistance to leaching were characterized through X-ray photoelectron spectroscopy, micro-Raman spectroscopy, scanning and transmission electron microscopy, X-ray diffractometry, Rutherford backscattering spectrometry and O{sup 16} (α,α')O{sup 16} resonant nuclear reaction. Films obtained at higher temperatures show well-defined spherical nanometric structure; they are composed of WO{sub 3.1} and the presence of hydrated tungsten oxide was also observed. The major crystal structure observed is the hexagonal. Thin films obtained through thermal evaporation present resistance to leaching in aqueous media and excellent performance as photocatalysts, evaluated through the degradation of the methyl orange dye. (author)

  4. Synergistic Effect of Nanosilica Aerogel with Phosphorus Flame Retardants on Improving Flame Retardancy and Leaching Resistance of Wood

    Directory of Open Access Journals (Sweden)

    Xiaodan Zhu

    2014-01-01

    Full Text Available Nanosilica (Nano-SiO2 sol fabricated by a sol-gel process was introduced into wood modification with phosphorus flame retardants to improve the flame retardancy and leaching resistance of wood. The obtained materials were characterized by scanning electron microscopy and energy dispersive spectrometer (SEM-EDS, thermogravimetric analysis (TGA, cone calorimetric (CONE, and infrared spectroscopy (FT-IR. The residual rate of flame retardants before and after leaching was determinated by a leaching resistance. The results showed that the phosphorus flame retardants and SiO2 sol could reside in the poplar wood and are widely distributed in the vessels, pits, wood timber, and the spaces between wood cells of poplar substrate. TGA and CONE results indicated that the introduction of nano-SiO2 aerogel with phosphorus flame retardants had a significantly synergistic effect on improving the flame retardancy and inhibiting the release of smoke and toxic gases. In addition, the leaching resistance test, combined with infrared analysis and EDS analysis, confirmed that the phosphorus flame retardants were able to be fixed by SiO2 aerogel in the wood.

  5. Leaching-resistant carrageenan-based colorimetric oxygen indicator films for intelligent food packaging.

    Science.gov (United States)

    Vu, Chau Hai Thai; Won, Keehoon

    2014-07-23

    Visual oxygen indicators can give information on the quality and safety of packaged food in an economic and simple manner by changing color based on the amount of oxygen in the packaging, which is related to food spoilage. In particular, ultraviolet (UV)-activated oxygen indicators have the advantages of in-pack activation and irreversibility; however, these dye-based oxygen indicator films suffer from dye leaching upon contact with water. In this work, we introduce carrageenans, which are natural sulfated polysaccharides, to develop UV-activated colorimetric oxygen indicator films that are resistant to dye leakage. Carrageenan-based indicator films were fabricated using redox dyes [methylene blue (MB), azure A, and thionine], a sacrificial electron donor (glycerol), an UV-absorbing photocatalyst (TiO2), and an encapsulation polymer (carrageenan). They showed even lower dye leakage in water than conventional oxygen indicator films, owing to the electrostatic interaction of anionic carrageenan with cationic dyes. The MB/TiO2/glycerol/carrageenan oxygen indicator film was successfully bleached upon UV irradiation, and it regained color very rapidly in the presence of oxygen compared to the other waterproof oxygen indicator films.

  6. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Science.gov (United States)

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  7. Geochemical and petrographic studies and the relationships to durability and leach resistance of vitrified products from the in situ vitrification process

    International Nuclear Information System (INIS)

    Timmons, D.M.; Thompson, L.E.

    1996-01-01

    Soil and sludge contaminated with hazardous and radioactive materials from sites in the United States and Australia were vitrified using in situ vitrification. Some of the resulting products were subjected to detailed geochemical, leach and durability testing using a variety of analytical techniques. The leach resistance and durability performance was compared to that of vitrified high level waste with borosilicate composition. Particular attention was given to crystallization behavior, the effects of crystallization on residual melt chemistry and how crystallization influences the behavior of contaminant ions. The results of this work show that the vitrified material studied has superior chemical durability and leach resistance relative to typical borosilicate waste glasses. Crystallization behavior was variable depending upon melt chemistry and cooling history. Crystallization was not observed to adversely affect chemical durability or leach resistance

  8. Lead-free solder technology transfer from ASE Americas

    Energy Technology Data Exchange (ETDEWEB)

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  9. Soldering of copper-clad niobium--titanium superconductor composite

    International Nuclear Information System (INIS)

    Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

    1977-04-01

    When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

  10. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    DEFF Research Database (Denmark)

    High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

  11. Characterization of lead-free solders for electronic packaging

    Science.gov (United States)

    Ma, Hongtao

    creep properties continuously changed with increasing aging time. The creep resistance of SAC alloy was lower than that of Sn-Pb at longer aging durations at elevated temperature. Solder alloys are extremely sensitive to changes in both temperature and strain rate. A linear relationship was found between the temperature and the tensile properties, while a power law relationship was found between strain rate and tensile properties. Constitutive models have also been developed with multiple variables of strain rate and temperature. Creep testing was conducted at different stress levels and temperatures to explore the constitutive modeling. SAC alloy was found to have higher creep resistance and activation energy than the Sn-Pb solder without thermal aging.

  12. Development of a soft-soldering system for aluminum

    Science.gov (United States)

    Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

    1983-03-01

    The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

  13. Xerogel p-anisidinapropilsílica: estudo da estabilidade térmica e da resistência à lixiviação com solventes p-anisidinepropylsilica xerogel: thermal stability and resistance to leaching by solvents

    Directory of Open Access Journals (Sweden)

    Leonardo Franken

    2002-07-01

    Full Text Available The xerogel p-anisidinepropylsilica was obtained. This solid presents some residual paraffin and also a small fraction of high organofunctionalized material that was leached in polar solvent. The xerogel purification could be achieved by exhaustively washing with hexane and dichloromethane solvents, or submitting the xerogel to thermal treatment up to 300 ºC, in vacuum. The resulting purified xerogel material present an appreciable thermal stability and resistance to leaching by solvents.

  14. Corrosion Reliability of Lead-free Solder Systems Used in Electronics

    DEFF Research Database (Denmark)

    Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

    2017-01-01

    humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

  15. Degradation rates and mechanisms of acid-resistant coatings in copper-leaching tanks

    DEFF Research Database (Denmark)

    Møller, Victor Buhl

    coating where the lifetime was estimated to 1:6 ± 0:2 and 1:4 ± 0:1 years, respectively. Part IV A series of newly designed and constructed diffusion cells were used to measure sulfuric acid diffusion rates through the coatings. A mathematical model was developed to simulate the experimental data...... potential in the mineral industry has not yet been thoroughly investigated. This particular industry poses unique challenges, with high operational temperatures (around 75 °C) and combined acidicerosive environments. The use of organic coatings to protect tanks, pipes, and secondary exposure areas, may....... Part I An in-depth literature study was performed to uncover and review uses and limitations ofacid-resistant coatings in the chemical industry, with a comparison to alternative resistant materialsbased on metals and ceramics. In addition, coating degradation phenomena caused by acid exposure, were...

  16. Survival and leaching of Tetracycline resistant bacteria and fecal indicators from manure in field scale experiments

    DEFF Research Database (Denmark)

    Bech, Tina; Amin, Mostofa; Lægdsmand, Mette

    The spreading of manure on agricultural land is an economic and practical solution for improving soil quality; however, animal manure frequently contains zoonotic pathogenic bacteria, such as certain Eschericia coli, Salmonella spp. and Campylobacter spp. The present experiment was conducted...... as a large multidisciplinary project. Pig manure with a natural content of Tetracycline resistant bacteria and fecal indicator organisms was followed in soil columns and a field scale experiment. In the field experiment pig manure was injected into agricultural soil. The distribution and survival of natural...... occurring indicator bacteria around a manure slurry slit in the soil was followed. During a period of two months, sections of soils with different distance to the manure string were assayed to obtain information on survival and spread of bacteriophage, faecal indicators (Enterococci, Bacterioides, E. coli...

  17. On the problem of soldering refractory metals with silver-containing solders

    International Nuclear Information System (INIS)

    Anikeev, E.F.; Andryushchenko, V.I.; Chepelenko, V.N.; Batov, V.M.

    1981-01-01

    The processes of wetting, spreading and interphase interactions of copper-silver liquid alloys alloyed with Ni and Si, with niobium, tantalum, molybdenum, tungsten, 12Kh18N10T steel and nickel are studied. It has been determined that Ni or Si additions into the copper-silver solder improve the wetting and adhesion. When soldering with the alloy containing Ni additions, the strength of a soldered Joint grows with the increase of soldering duration while soldering with the alloy containing Si additions, the strength decreases. That is why Ni-containing solders are preferable for soldering thick-walled structures, and Si-containing solders - for thin-walled structures [ru

  18. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Fan Yang

    2016-01-01

    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  19. Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

    Science.gov (United States)

    Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

    2018-03-01

    In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

  20. Resistance evaluation expanded perlite the leaching acid: variation of parameters concentration, time and leaching agent; Avaliacao da resistencia da perlita expandida a lixiviacao acida: variacao dos parametros concentracao, tempo e agente lixiviante

    Energy Technology Data Exchange (ETDEWEB)

    Almeida, J.M.F. de; Damasceno Junior, E.; Oliveira, E.S.; Fernandes, N.S., E-mail: janielequimicaufrn@gmail.com [Universidade Federal do Rio Grande do Norte (UFRN), Natal, RN (Brazil). Instituto de Quimica. Laboratorio de Quimica Analitica e Meio Ambiente

    2016-07-01

    The expanded perlite is an amorphous aluminosilicate which presents in its composition about 75.0% silicon oxide (SiO2), also having other species in the composition as oxides of some metals. Silicas and silicates have been used in the environmental field, in relevant anti-corrosive activity. In this context, materials that exposes too many highly acidic media, require preservation against this type of wear, as this type of damage causes a great financial loss, thereby requiring low-cost, abundant materials, non-toxic and easy to purchase as some silica coating. The study evaluated the perlite expanded resistance against an acid leaching process. With undeniability the use of strong acids and different working conditions were not able to remove the oxides present on the expanded perlite sample, thus demonstrating the high strength of the expanded perlite against acid attacks. (author)

  1. Bacterial Leaching

    Indian Academy of Sciences (India)

    and studies microbial biotechnology and ... foundation for subsequent research into the role of microorgan- ... are more readily accesible, for example those in solution, rather .... Vat leaching as currently applied to oxide ores involves the.

  2. Solder joint technology materials, properties, and reliability

    CERN Document Server

    Tu, King-Ning

    2007-01-01

    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  3. Physical properties of lead free solders in liquid and solid state

    Energy Technology Data Exchange (ETDEWEB)

    Mhiaoui, Souad

    2007-04-17

    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  4. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    CERN Document Server

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

    2015-01-01

    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  5. Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E...... in a carbon matrix. Nanoscale soldering of multi-walled carbon nanotubes (MWNT) onto microelectrodes was achieved by deposition of a conducting gold line across a contact point between nanotube and electrode. The solderings were found to be mechanically stronger than the carbon nanotubes. We have positioned...... MWNTs to bridge the gap between two electrodes, and formed soldering bonds between the tube and each of the electrodes. All nanotube bridges showed ohmic resistances in the range 10-30 kΩ. We observed no increase in resistance after exposing the MWNT bridge to air for days....

  6. Leaching mechanisms

    International Nuclear Information System (INIS)

    Dougherty, D.R.; Colombo, P.

    1984-01-01

    Sufficient data are lacking to provide a basis for adequately assessing the long term leaching behavior of solidified low level radioactive waste forms in their disposal environment. Although the release of radioactivity from a waste form to an aqueous environment is recognized to be due to one or more mechanisms such as diffusion, dissolution, corrosion or ion exchange, the leaching mechanisms and the factors which control the leaching behavior of waste forms are not fully understood. This study will determine the prevailing mechanisms for a variety of selected LLW solidification agents which are being considered for use by defense and commercial generators and which will cover the broadest possible number of mechanisms. The investigation will proceed by the postulation of mathematical models representative of the prevailing mechanism(s) and the use of statistically designed experiments to test the actual leaching behavior of laborattory samples against the postulated representations. Maximum use of existing leach data in the literature will be made by incorporating literature results into a computerized data base along with the experimental results generated in this task

  7. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    International Nuclear Information System (INIS)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-01-01

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines

  8. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-10-31

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

  9. Handbook of machine soldering SMT and TH

    CERN Document Server

    Woodgate, Ralph W

    1996-01-01

    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  10. Leaching process

    International Nuclear Information System (INIS)

    Heinen, H.J.; McClelland, G.E.; Lindstrom, R.E.

    1982-01-01

    A gold and uranium ore is heap leached in accordance with the process comprising initial agglomeration of fines in the feed by means of a binding agent and cyanide solution. The lixiviant comprises a compatible mixture of sodium cyanide and sodium bicarbonate

  11. Leaching process

    Energy Technology Data Exchange (ETDEWEB)

    Heinen, H J; McClelland, G E; Lindstrom, R E

    1982-10-18

    A gold and uranium ore is heap leached in accordance with the process comprising initial agglomeration of fines in the feed by means of a binding agent and cyanide solution. The lixiviant comprises a compatible mixture of sodium cyanide and sodium bicarbonate.

  12. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Directory of Open Access Journals (Sweden)

    Yee Mei Leong

    2016-06-01

    Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

  13. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Science.gov (United States)

    Leong, Yee Mei; Haseeb, A.S.M.A.

    2016-01-01

    Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

  14. Spectroscopic investigation of oxidized solder surfaces

    International Nuclear Information System (INIS)

    Song, Jenn-Ming; Chang-Chien, Yu-Chien; Huang, Bo-Chang; Chen, Wei-Ting; Shie, Chi-Rung; Hsu, Chuang-Yao

    2011-01-01

    Highlights: → UV-visible spectroscopy is successfully used to evaluate the degree of discoloring of solders. → The surface oxides of solders can also be identified by UV-visible absorption spectra. → The discoloration of solder surface can be correlated with optical characterization of oxides. → A strategy against discoloring by alloying was also suggested. - Abstract: For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV-vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible region. A trace of P can effectively depress the discoloration of solders under both solid and semi-solid states through the suppression of SnO.

  15. Soldering of Mg Joints Using Zn-Al Solders

    Science.gov (United States)

    Gancarz, Tomasz; Berent, Katarzyna; Skuza, Wojciech; Janik, Katarzyna

    2018-04-01

    Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 °C, 450 °C, 475 °C, and 500 °C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.

  16. Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

    International Nuclear Information System (INIS)

    Zhang, Liang; Han, Ji-guang; Guo, Yong-huan; He, Cheng-wen

    2014-01-01

    With the addition of 0.03 wt% rare earth Ce, in our previous works, the properties of SnAgCu solder were enhanced obviously. Based on the Garofalo–Arrhenius creep constitutive model, finite element method was used to simulate the stress–strain response during thermal cycle loading, and combined with the fatigue life prediction models, the fatigue life of SnAgCu/SnAgCuCe solder joints was calculated respectively, which can demonstrate the effect of the rare earth Ce on the fatigue life of SnAgCu solder joints. The results indicated that the maximum stress–strain can be found on the top surface of the corner solder joint, and the warpage of the PCB substrate occurred during thermal cycle loading. The trends obtained from modeling results have a good agreement with the experimental data reported in the literature for WLCSP devices. In addition, the stress–strain of SnAgCuCe solder joints is lower than that of SnAgCu solder joints. The thermal fatigue lives of solder joints calculated based on the creep model and creep strain energy density model show that the fatigue life of SnAgCuCe solder joints is higher than the SnAgCu solder joints. The fatigue life of SnAgCuCe solder joints can be enhanced significantly with the addition of Ce, is 30.2% higher than that of SnAgCu solder joints, which can be attributed to the CeSn 3 particles formed resisting the motion of dislocation; moreover, the refinement of microstructure and the IMC sizes also contribute to the enhancement of fatigue life, which elucidates that SnAgCuCe solder can be utilized in electronic industry with high reliability replacing the SnAgCu solder

  17. Lead free solder mechanics and reliability

    CERN Document Server

    Pang, John Hock Lye

    2012-01-01

    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  18. Effect of gamma radiation on micromechanical hardness of lead-free solder joint

    Energy Technology Data Exchange (ETDEWEB)

    Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

    2015-09-25

    Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

  19. Nano-soldering to single atomic layer

    Science.gov (United States)

    Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  20. Safer Soldering Guidelines and Instructional Resources

    Science.gov (United States)

    Love, Tyler S.; Tomlinson, Joel

    2018-01-01

    Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

  1. Laser beam soldering of micro-optical components

    Science.gov (United States)

    Eberhardt, R.

    2003-05-01

    MOTIVATION Ongoing miniaturisation and higher requirements within optical assemblies and the processing of temperature sensitive components demands for innovative selective joining techniques. So far adhesive bonding has primarily been used to assemble and adjust hybrid micro optical systems. However, the properties of the organic polymers used for the adhesives limit the application of these systems. In fields of telecommunication and lithography, an enhancement of existing joining techniques is necessary to improve properties like humidity resistance, laserstability, UV-stability, thermal cycle reliability and life time reliability. Against this background laser beam soldering of optical components is a reasonable joining technology alternative. Properties like: - time and area restricted energy input - energy input can be controlled by the process temperature - direct and indirect heating of the components is possible - no mechanical contact between joining tool and components give good conditions to meet the requirements on a joining technology for sensitive optical components. Additionally to the laser soldering head, for the assembly of optical components it is necessary to include positioning units to adjust the position of the components with high accuracy before joining. Furthermore, suitable measurement methods to characterize the soldered assemblies (for instance in terms of position tolerances) need to be developed.

  2. Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    McNally, K.M.; Sorg, B.S.; Welch, A.J.; Dawes, J.M.; Owen, E.R.

    1999-01-01

    Low-strength anastomoses and thermal damage of tissue are major concerns in laser tissue welding techniques where laser energy is used to induce thermal changes in the molecular structure of the tissues being joined, hence allowing them to bond together. Laser tissue soldering, on the other hand, is a bonding technique in which a protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. The addition of protein solders to augment tissue repair procedures significantly reduces the problems of low strength and thermal damage associated with laser tissue welding techniques. Investigations were conducted to determine optimal solder and laser parameters for tissue repair in terms of tensile strength, temperature rise and damage and the microscopic nature of the bonds formed. An in vitro study was performed using an 808 nm diode laser in conjunction with indocyanine green (ICG)-doped albumin protein solders to repair bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The efficacy of temperature feedback control in enhancing the soldering process was also investigated. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the repairs. A reduction in dye concentration from 2.5mgml -1 to 0.25mgml -1 was also found to result in an increase in tensile strength. Increasing the laser irradiance and thus surface temperature resulted in an increased severity of histological injury. Thermal denaturation of tissue collagen and necrosis of the intimal layer smooth muscle cells increased laterally and in depth with higher temperatures. The strongest repairs were produced with an irradiance of 6.4Wcm -2 using a solid protein solder composed of 60% BSA and 0.25mgml -1 ICG. Using this combination of laser and solder parameters, surface temperatures were observed to reach 85±5 deg. C with a

  3. The constitutive response of three solder materials

    International Nuclear Information System (INIS)

    Perez-Bergquist, Alejandro G.; Cao Fang; Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T.

    2012-01-01

    Highlights: ► The full constitutive response of three solder materials. ► Test temperatures from −196 °C to 60 °C and strain rates from 10 −3 to >10 3 s −1 . ► Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (−196 °C to 60 °C) and strain rate (10 −3 to >10 3 s −1 ). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  4. The constitutive response of three solder materials

    Energy Technology Data Exchange (ETDEWEB)

    Perez-Bergquist, Alejandro G., E-mail: alexpb@lanl.gov [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States); Cao Fang [Exxon Mobil Research and Engineering Company, Annadale, NJ 08801 (United States); Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T. [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States)

    2012-05-25

    Highlights: Black-Right-Pointing-Pointer The full constitutive response of three solder materials. Black-Right-Pointing-Pointer Test temperatures from -196 Degree-Sign C to 60 Degree-Sign C and strain rates from 10{sup -3} to >10{sup 3} s{sup -1}. Black-Right-Pointing-Pointer Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196 Degree-Sign C to 60 Degree-Sign C) and strain rate (10{sup -3} to >10{sup 3} s{sup -1}). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  5. Optimal parameters for laser tissue soldering

    Science.gov (United States)

    McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

    1998-07-01

    Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

  6. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

    National Research Council Canada - National Science Library

    Reuse, Rolando

    2005-01-01

    .... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

  7. Nano-soldering of magnetically aligned three-dimensional nanowire networks

    International Nuclear Information System (INIS)

    Gao Fan; Gu Zhiyong

    2010-01-01

    It is extremely challenging to fabricate 3D integrated nanostructures and hybrid nanoelectronic devices. In this paper, we report a simple and efficient method to simultaneously assemble and solder nanowires into ordered 3D and electrically conductive nanowire networks. Nano-solders such as tin were fabricated onto both ends of multi-segmented nanowires by a template-assisted electrodeposition method. These nanowires were then self-assembled and soldered into large-scale 3D network structures by magnetic field assisted assembly in a liquid medium with a high boiling point. The formation of junctions/interconnects between the nanowires and the scale of the assembly were dependent on the solder reflow temperature and the strength of the magnetic field. The size of the assembled nanowire networks ranged from tens of microns to millimeters. The electrical characteristics of the 3D nanowire networks were measured by regular current-voltage (I-V) measurements using a probe station with micropositioners. Nano-solders, when combined with assembling techniques, can be used to efficiently connect and join nanowires with low contact resistance, which are very well suited for sensor integration as well as nanoelectronic device fabrication.

  8. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Science.gov (United States)

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2004-10-01

    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  9. Thermomechanical fatigue life prediction for several solders

    Science.gov (United States)

    Wen, Shengmin

    Since solder connections operate at high homologous temperature, solders are high temperature materials. This feature makes their mechanical behavior and fatigue phenomena unique. Based on experimental findings, a physical damage mechanism is introduced for solders. The mechanism views the damage process as a series of independent local damage events characterized by the failure of individual grains, while the structural damage is the eventual percolation result of such local events. Fine's dislocation energy density concept and Mura's microcrack initiation theory are adopted to derive the fatigue formula for an individual grain. A physical damage metric is introduced to describe the material with damage. A unified creep and plasticity constitutive model is adopted to simulate the mechanical behavior of solders. The model is cast into a continuum damage mechanics framework to simulate material with damage. The model gives good agreement with the experimental results of 96.5Pb-3.5Sn and 96.5Sn-3.5Ag solders under uniaxial strain-controlled cyclic loading. The model is convenient for implementation into commercial computational packages. Also presented is a fatigue theory with its failure criterion for solders based on physical damage mechanism. By introducing grain orientation into the fatigue formula, an m-N curve (m is Schmid factor) at constant loading condition is suggested for fatigue of grains with different orientations. A solder structure is defined as fatigued when the damage metric reaches a critical threshold, since at this threshold the failed grains may form a cluster and percolate through the structure according to percolation theory. Fatigue data of 96.5Pb-3.5Sn solder bulk specimens under various uniaxial tension tests were analyzed. Results show that the theory gives consistent predictions under broad conditions, while inelastic strain theory does not. The theory is anisotropic with no size limitation to its application, which could be suitable for

  10. The Shear Strength and Fracture Behavior of Sn-Ag- xSb Solder Joints with Au/Ni-P/Cu UBM

    Science.gov (United States)

    Lee, Hwa-Teng; Hu, Shuen-Yuan; Hong, Ting-Fu; Chen, Yin-Fa

    2008-06-01

    This study investigates the effects of Sb addition on the shear strength and fracture behavior of Sn-Ag-based solders with Au/Ni-P/Cu underbump metallization (UBM) substrates. Sn-3Ag- xSb ternary alloy solder joints were prepared by adding 0 wt.% to 10 wt.% Sb to a Sn-3.5Ag alloy and joining them with Au/Ni-P/Cu UBM substrates. The solder joints were isothermally stored at 150°C for up to 625 h to study their microstructure and interfacial reaction with the UBM. Single-lap shear tests were conducted to evaluate the mechanical properties, thermal resistance, and failure behavior. The results show that UBM effectively suppressed intermetallic compound (IMC) formation and growth during isothermal storage. The Sb addition helped to refine the Ag3Sn compounds, further improving the shear strength and thermal resistance of the solders. The fracture behavior evolved from solder mode toward the mixed mode and finally to the IMC mode with increasing added Sb and isothermal storage time. However, SnSb compounds were found in the solder with 10 wt.% Sb; they may cause mechanical degradation of the solder after long-term isothermal storage.

  11. Study of silicon chip soldering in high-power transistor housing

    Directory of Open Access Journals (Sweden)

    Vasily S. Anosov

    2017-09-01

    We experimentally assessed the effect of outer housing layer materials and back side chip metallization. For lead-silver soldering of silicon chips, the best housing is that with a nickel outer layer rather than with a gold-plated one, because the resultant thermal resistance is lower and the absence of gold makes the technology cheaper. We obtained a 0.6 K/W thermal resistance for a 24 mm2 chip area.

  12. High temperature soldering of graphite

    International Nuclear Information System (INIS)

    Anikin, L.T.; Kravetskij, G.A.; Dergunova, V.S.

    1977-01-01

    The effect is studied of the brazing temperature on the strength of the brazed joint of graphite materials. In one case, iron and nickel are used as solder, and in another, molybdenum. The contact heating of the iron and nickel with the graphite has been studied in the temperature range of 1400-2400 ged C, and molybdenum, 2200-2600 deg C. The quality of the joints has been judged by the tensile strength at temperatures of 2500-2800 deg C and by the microstructure. An investigation into the kinetics of carbon dissolution in molten iron has shown that the failure of the graphite in contact with the iron melt is due to the incorporation of iron atoms in the interbase planes. The strength of a joint formed with the participation of the vapour-gas phase is 2.5 times higher than that of a joint obtained by graphite recrystallization through the carbon-containing metal melt. The critical temperatures are determined of graphite brazing with nickel, iron, and molybdenum interlayers, which sharply increase the strength of the brazed joint as a result of the formation of a vapour-gas phase and deposition of fine-crystal carbon

  13. Microstructure evolution and thermomechanical fatigue of solder materials

    NARCIS (Netherlands)

    Matin, M.A.

    2005-01-01

    The microelectronics industry is confronted with the new challenge to produce joints with lead-free solder materials replacing classical tin-lead solders in devices used in many fields (e.g. consumer electronics, road transport, aviation, space-crafts, telecommunication). In service, solder

  14. Efforts to Develop a 300°C Solder

    Energy Technology Data Exchange (ETDEWEB)

    Norann, Randy A [Perma Works LLC

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  15. A novel method for direct solder bump pull testing using lead-free solders

    Science.gov (United States)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  16. Interface between Sn-Sb-Cu solder and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

    2011-07-15

    Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

  17. A Hodge dual for soldered bundles

    International Nuclear Information System (INIS)

    Lucas, Tiago Gribl; Pereira, J G

    2009-01-01

    In order to account for all possible contractions allowed by the presence of the solder form, a generalized Hodge dual is defined for the case of soldered bundles. Although for curvature the generalized dual coincides with the usual one, for torsion it gives a completely new dual definition. Starting from the standard form of a gauge Lagrangian for the translation group, the generalized Hodge dual yields precisely the Lagrangian of the teleparallel equivalent of general relativity, and consequently also the Einstein-Hilbert Lagrangian of general relativity

  18. Visual detection of defects in solder joints

    Science.gov (United States)

    Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

    1995-03-01

    The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

  19. Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

    Directory of Open Access Journals (Sweden)

    Shuye Zhang

    2018-01-01

    Full Text Available Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile electronic applications. However, crack formation of the solder joint crack was occurred at low temperature curable acrylic polymer resins after bonding processes. In this study, the mechanism of SnBi58 solder joint crack at low temperature curable acrylic adhesive was investigated. In addition, SnBi58 solder joint cracks can be significantly removed by increasing the storage modulus of adhesives instead of coefficient of thermal expansion. The first approach of reducing the amount of polymer rebound can be achieved by using an ultrasonic bonding method to maintain a bonding pressure on the SnBi58 solder joints cooling to room temperature. The second approach is to increase storage modulus of adhesives by adding silica filler into acrylic polymer resins to prevent the solder joint from cracking. Finally, excellent acrylic based SnBi58 solder joints reliability were obtained after 1000 cycles thermal cycling test.

  20. Laser assisted soldering: microdroplet accumulation with a microjet device.

    Science.gov (United States)

    Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

    1998-01-01

    We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

  1. Heap leaching for uranium

    International Nuclear Information System (INIS)

    1988-01-01

    Denison Mines Ltd. is using two bacterial leaching processes to combat the high cost of extracting uranium from low grade ore in thin reefs. Both processes use thiobacillus ferro-oxidans, a bacterium that employs the oxidation of ferrous iron and sulphur as its source of energy for growth. The first method is flood leaching, in which ore is subjected to successive flood, drain and rest cycles. The second, trickle leaching, uses sprinklers to douse the broken muck continuously with leaching solution. In areas where grades are too low to justify the expense of hauling the ore to the surface, the company is using this biological process underground to recover uranium. In 1987 Denison recovered 840 000 lb of uranium through bacterial heap leaching. It plans to have biological in-place leaching contribute 25% of the total uranium production by 1990. (fig.)

  2. Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

    Science.gov (United States)

    Boesenberg, Adam J.; Anderson, Iver E.; Harringa, Joel L.

    2012-07-01

    Of Pb-free solder choices, an array of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic ( T eut = 217°C) composition have emerged with potential for broad use, including ball grid array (BGA) joints that cool slowly. This work investigated minor substitutional additions of Al (0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2- μm to 5- μm faceted Cu-Al particles, identified as Cu33Al17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness. Clustering of Cu33Al17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface. Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance.

  3. Fluxless flip-chip bonding using a lead-free solder bumping technique

    Science.gov (United States)

    Hansen, K.; Kousar, S.; Pitzl, D.; Arab, S.

    2017-09-01

    With the LHC exceeding the nominal instantaneous luminosity, the current barrel pixel detector (BPIX) of the CMS experiment at CERN will reach its performance limits and undergo significant radiation damage. In order to improve detector performance in high luminosity conditions, the entire BPIX is replaced with an upgraded version containing an additional detection layer. Half of the modules comprising this additional layer are produced at DESY using fluxless and lead-free bumping and bonding techniques. Sequential solder-jetting technique is utilized to wet 40-μm SAC305 solder spheres on the silicon-sensor pads with electroless Ni, Pd and immersion Au (ENEPIG) under-bump metallization (UBM). The bumped sensors are flip-chip assembled with readout chips (ROCs) and then reflowed using a flux-less bonding facility. The challenges for jetting low solder volume have been analyzed and will be presented in this paper. An average speed of 3.4 balls per second is obtained to jet about 67 thousand solder balls on a single chip. On average, 7 modules have been produced per week. The bump-bond quality is evaluated in terms of electrical and mechanical properties. The peak-bump resistance is about 17.5 mΩ. The cross-section study revealed different types of intermetallic compounds (IMC) as a result of interfacial reactions between UBM and solder material. The effect of crystalline phases on the mechanical properties of the joint is discussed. The mean shear strength per bump after the final module reflow is about 16 cN. The results and sources of yield loss of module production are reported. The achieved yield is 95%.

  4. Nitrate Leaching Management

    Science.gov (United States)

    Nitrate (NO3) leaching is a significant nitrogen (N) loss process for agriculture that must be managed to minimize NO3 enrichment of groundwater and surface waters. Managing NO3 leaching should involve the application of basic principles of understanding the site’s hydrologic cycle, avoiding excess ...

  5. Nitrate leaching index

    Science.gov (United States)

    The Nitrate Leaching Index is a rapid assessment tool that evaluates nitrate (NO3) leaching potential based on basic soil and climate information. It is the basis for many nutrient management planning efforts, but it has considerable limitations because of : 1) an oversimplification of the processes...

  6. Immobilized waste leaching

    International Nuclear Information System (INIS)

    Suarez, A.A.

    1989-01-01

    The main mechanism by which the immobilized radioactive materials can return to biosphere is the leaching due to the intrusion of water into the repositories. Some mathematical models and experiments utilized to evaluate the leaching rates in different immobilization matrices are described. (author) [pt

  7. In situ leaching of uranium

    International Nuclear Information System (INIS)

    Martin, B.

    1980-01-01

    A process is described for the in-situ leaching of uranium-containing ores employing an acidic leach liquor containing peroxymonosulphuric acid. Preferably, additionally, sulphuric acid is present in the leach liquor. (author)

  8. Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

    National Research Council Canada - National Science Library

    Chung, Kohn C

    2006-01-01

    .... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

  9. Chlorination leaching of cadmium

    International Nuclear Information System (INIS)

    Lach, E.; Pajak, I.; Bojanowska, A.

    1978-01-01

    The results of the investigations on chlorination leaching of cadmium from dust coming from dry dust collector of sinter belt, that is leaching with water saturated with gaseous chlorine and leaching with solutions of ammonium chloride and sodium chloride were given. The optimum conditions for these processes were established. It was found, that the method of leaching in the presence of gaseous chlorine is more effective, as it allows to report into the solution over 90% cadmium contained in dust. Owing to technical difficulties, environmental protection and safety conditions more advantageous seems to be the use as leaching agent of the ammonium chloride solutions. When applying 20% NH 4 Cl and temperature of 60 0 C, the time of 2 hours and the ratio of solid to liquid of 1:5, 70% cadmium contained in the dust can be reported into the solution. (auth.)

  10. Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements

    Science.gov (United States)

    Gadag, Shiva P.; Patra, Susant

    2000-12-01

    Solder joint interconnects are mechanical means of structural support for bridging the various electronic components and providing electrical contacts and a thermal path for heat dissipation. The functionality of the electronic device often relies on the structural integrity of the solder. The dimensional stability of solder joints is numerically predicted based on their mechanical properties. Algorithms to model the kinetics of dissolution and subsequent growth of intermetallic from the complete knowledge of a single history of time-temperature-reflow profile, by considering equivalent isothermal time intervals, have been developed. The information for dissolution is derived during the heating cycle of reflow and for the growth process from cooling curve of reflow profile. A simple and quick analysis tool to derive tensile stress-strain maps as a function of the reflow temperature of solder and strain rate has been developed by numerical program. The tensile properties are used in modeling thermal strain, thermal fatigue and to predict the overall fatigue life of solder joints. The numerical analysis of the tensile properties as affected by their composition and rate of testing, has been compiled in this paper. A numerical model using constitutive equation has been developed to evaluate the interfacial fatigue crack growth rate. The model can assess the effect of cooling rate, which depends on the level of strain energy release rate. Increasing cooling rate from normalizing to water-quenching, enhanced the fatigue resistance to interfacial crack growth by up to 50% at low strain energy release rate. The increased cooling rates enhanced the fatigue crack growth resistance by surface roughening at the interface of solder joint. This paper highlights salient features of process modeling. Interfacial intermetallic microstructure is affected by cooling rate and thereby affects the mechanical properties.

  11. Effect of Solder Flux Residues on Corrosion of Electronics

    DEFF Research Database (Denmark)

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

    2009-01-01

    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... testing and use in the field, consequences and recommendations are given. Failures, caused by harsh[1] customer environments, are not covered in this paper....

  12. Mechanical properties of soldered joints of niobium base alloys

    International Nuclear Information System (INIS)

    Grishin, V.L.

    1980-01-01

    Mechanical properties of soldered joints of niobium alloys widely distributed in industry: VN3, VN4, VN5A, VN5AE, VN5AEP etc., 0.6-1.2 mm thick are investigated. It is found out that the usage of zirconium-vanadium, titanium-tantalum solders for welding niobium base alloys permits to obtain soldered joints with satisfactory mechanical properties at elevated temperatures

  13. Evaluation on the characteristics of tin-silver-bismuth solder

    Science.gov (United States)

    Xia, Z.; Shi, Y.; Chen, Z.

    2002-02-01

    Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

  14. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Directory of Open Access Journals (Sweden)

    Mohd Nizam Ab. Rahman

    2014-12-01

    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  15. Solder bond requirement for large, built-up, high-performance conductors

    International Nuclear Information System (INIS)

    Willig, R.L.

    1981-01-01

    Some large built-up conductors fabricated for large superconducting magnets are designed to operate above the maximum recovery current. Because the stability of these conductors is sensitive to the quality of the solder bond joining the composite superconductor to the high-conductivity substrate, a minimum bond requirement is necessary. The present analysis finds that the superconductor is unstable and becomes abruptly resistive when there are temperature excursions into the current sharing region of a poorly bonded conductor. This abrupt transition, produces eddy current heating in the vicinity of the superconducting filaments and causes a sharp reduction in the minimum propagating zone (MPZ) energy. This sensitivity of the MPZ energy to the solder bond contact area is used to specify a minimum bond requirement. For the superconducting MHD magnet built for the Component Development Integration Facility (CDIF), the minimum bonded surface area is .68 cm/sup 2//cm which is 44% of the composite perimeter. 5 refs

  16. Bicarbonate leaching of uranium

    International Nuclear Information System (INIS)

    Mason, C.

    1998-01-01

    The alkaline leach process for extracting uranium from uranium ores is reviewed. This process is dependent on the chemistry of uranium and so is independent on the type of mining system (conventional, heap or in-situ) used. Particular reference is made to the geochemical conditions at Crownpoint. Some supporting data from studies using alkaline leach for remediation of uranium-contaminated sites is presented

  17. Bicarbonate leaching of uranium

    Energy Technology Data Exchange (ETDEWEB)

    Mason, C.

    1998-12-31

    The alkaline leach process for extracting uranium from uranium ores is reviewed. This process is dependent on the chemistry of uranium and so is independent on the type of mining system (conventional, heap or in-situ) used. Particular reference is made to the geochemical conditions at Crownpoint. Some supporting data from studies using alkaline leach for remediation of uranium-contaminated sites is presented.

  18. Facile preparation of ZIF-8@Pd-CSS sandwich-type microspheres via in situ growth of ZIF-8 shells over Pd-loaded colloidal carbon spheres with aggregation-resistant and leach-proof properties for the Pd nanoparticles

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Tong; Lin, Lu [State Key Laboratory of Fine Chemicals, School of Chemical Engineering, Dalian University of Technology, Dalian, 116024 (China); Zhang, Xiongfu, E-mail: xfzhang@dlut.edu.cn [State Key Laboratory of Fine Chemicals, School of Chemical Engineering, Dalian University of Technology, Dalian, 116024 (China); Liu, Haiou; Yan, Xinjuan [State Key Laboratory of Fine Chemicals, School of Chemical Engineering, Dalian University of Technology, Dalian, 116024 (China); Liu, Zhang; Yeung, King Lun [Department of Chemical and Biomolecular Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR (China)

    2015-10-01

    Graphical abstract: - Highlights: • Uniform-sized colloidal carbon spheres were synthesized from low-cost glucose. • Pd nanoparticles were loaded onto the carbon spheres via self-reduction method. • A layer of ZIF-8 shell was in situ grown over the Pd-loaded carbon spheres. • The ZIF-8@Pd-CCS showed leach-proof and aggregation-resistant properties of Pd. - Abstract: Aiming to enhance the stability of noble metal nanoparticles that are anchored on the surface of colloidal carbon spheres (CCSs), we designed and prepared a new kind of sandwich-structured ZIF-8@Pd-CCS microsphere. Typically, uniform CCSs were first synthesized by the aromatization and carbonization of glucose under hydrothermal conditions. Subsequently, noble metal nanoparticles, herein Pd nanoparticles, were attached to the surface of CCSs via self-reduction route, followed by in situ assembly of a thin layer of ZIF-8 over the Pd nanoparticles to form the sandwich-type ZIF-8@Pd-CCS microspheres. X-ray diffraction (XRD) patterns and Fourier transform infrared spectroscopy (FTIR) spectra confirmed the presence of crystalline ZIF-8, while TEM analysis revealed that the ZIF-8 shells were closely bound to the Pd-loaded CCSs. The shell thickness could be tuned by varying the ZIF-8 assembly cycles. Further, liquid-phase hydrogenation of 1-hexene as the probe reaction was carried out over the ZIF-8@Pd-CCS microspheres and results showed that the prepared microspheres exhibited excellent agglomeration-resistant and leach-proof properties for the Pd nanoparticles, thus leading to the good reusability of the ZIF-8@Pd-CCS microspheres.

  19. Laser-activated protein solder for peripheral nerve repair

    Science.gov (United States)

    Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

    1995-05-01

    A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

  20. Glass leaching performance

    International Nuclear Information System (INIS)

    Chick, L.A.; Turcotte, R.P.

    1983-05-01

    Current understanding of the leaching performance of high-level nuclear waste (HLW) glass is summarized. The empirical model of waste glass leaching behavior developed shows that at high water flow rates the glass leach rate is kinetically limited to a maximum value. At intermediate water flow rates, leaching is limited by the solution concentration of silica and decreases with decreasing water flow rates. Release of soluble elements is controlled by silica dissolution because silica forms the binding network of the glass. At low water flow rates, mass loss rates reach values controlled by formation rates of alteration minerals, or by diffusion of dissolution products through essentially stagnant water. The parameters reviewed with respect to their quantifiable influence on leaching behavior include temperature, pH, leachant composition, glass composition, thermal history, and radiation. Of these, temperature is most important since the rate of mass loss approximately doubles with each 10 0 C increase in dilute solutions. The pH has small effects within the 4 to 10 range. The chemical composition of the leachant is most important with regard to its influence on alteration product formation. Glass composition exhibits the largest effects at high flow rates where improved glasses leach from ten to thirty times slower than glass 76 to 68. The effects of the thermal history (devitrification) of the glass are not likely to be significant. Radiation effects are important primarily in that radiolysis can potentially drive pH values to less than 4. Radiation damage to the glass causes insignificant changes in leaching performance

  1. Integration of environmentally compatible soldering technologies for waste minimization

    International Nuclear Information System (INIS)

    Hosking, F.M.

    1992-01-01

    There has been a concentrated effort throughout the international microelectronics industry to phase out chlorofluorocarbon (CFC) materials and alleviate the serious problem of ozone depletion created by the release of CFCS. The development of more environmentally compatible manufacturing technologies is the cornerstone of this effort. Alternative materials and processes for cleaning and soldering have received special attention. Electronic. soldering typically utilizes rosin-based fluxes to promote solder wettability. Flux residues must be removed from the soldered parts when high product reliability is essential. Halogenated or CFC solvents have been the principle chemicals used to clean the residues. With the accelerated push to eliminate CFCs in the US by 1995, CFC-free solvents, aqueous-based cleaning, water soluble or ''no clean'' fluxes, and fluxless soldering technologies are being developed and quickly integrated into manufacturing practice. Sandia's Center for Solder Science and Technology has been ch g a variety of fluxless and alternative soldering technologies for DOE's waste minimization program. The work has focused on controlled atmosphere, laser, and ultrasonic fluxless soldering, protective metallic and organic coatings, and fluxes which have water soluble or low solids-based chemistries. With the increasing concern that Pb will also be banned from electronic soldering, Sandia has been characterizing the wetting, aging, and mechanical properties of Pb-fire solder alloys. The progress of these integrated studies will be discussed. Their impact on environmentally compatible manufacturing will be emphasized. Since there is no universal solution to the various environmental, safety, and health issues which currently face industry, the proposed technologies offer several complementary materials and processing options from which one can choose

  2. Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

    Science.gov (United States)

    2015-05-05

    under bump metallurgy and solder joint geometry on Sn grain morphology in Pb free solder joints were examined. SnAgCu solder joints were examined for...free solder interconnects”, Sci. Technol. Weld . Join. 13, 732 (2008). [3.25] Terashima, S., Takahama, K., Nozaki, M., and Tanaka, M. Recrystallization

  3. Development of improved leaching techniques for vitrified radioactive waste products

    International Nuclear Information System (INIS)

    Vaswani, G.A.; Yeotikar, R.G.; Rastogi, R.C.; Sunder Rajan, N.S.

    1979-01-01

    A critical review of the current techniques for evaluating the leach resistance of vitrified radioactive wastes has been made. Inadequacy of the available leaching techniques, with respect to their adoption as standard technique on an international scale, has been brought out for the three broad catagories of aqueous attack viz., (i) simple contact with leachant at a particular temperature, (ii) once-through or recirculatory flow of leachant at variable temperatures and flow rates, and (iii) contact with freshly distilled hot water in soxhelet type of extractor. In an effort to evolve a standard leaching technique in the latter two categories of aqueous attack, development of two leaching units viz., 'Dynamic Leaching Unit' and 'Modified Soxhlet Unit' is described. Both these units offer good control and wide flexibility on the important parameters affecting leaching such as leachant temperature, flow rate of residence time of leachant and ratio of leachant volume to sample surface area. The dynamic leaching units also offers a good control and flexibility on the two additional parameters viz., the composition and pH of the leachant. In the modified soxhlet unit the composition and pH of the leachant remains near to that of distilled water. The leach rate results have been found to be reproducible. A need for framing the set of standard conditions for adoption of these units in evolution of standard leaching techniques has been indicated. (auth.)

  4. Long-term leach testing of solidified radioactive waste forms (International Standard Publication ISO 6961:1982)

    International Nuclear Information System (INIS)

    Stefanik, J.

    2001-01-01

    Processes are developed for the immobilization of radionuclides by solidification of radioactive wastes. The resulting solidification products are characterized by strong resistance to leaching aimed at low release rates of the radionuclides to the environment. To measure this resistance to leaching of the solidified materials: glass, glass-ceramics, bitumen, cement, concrete, plastics, a long-term leach test is presented. The long-term leach test is aimed at: a) the comparison of different kinds or compositions of solidified waste forms; b) the intercomparison between leach test results from different laboratories on one product; c) the intercomparison between leach test results on products from different processes

  5. Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/ Pd/ Au surface finishes

    International Nuclear Information System (INIS)

    NorAkmal, F.; Ourdjini, A.; Azmah Hanim, M.A.; Siti Aisha, I.; Chin, Y.T.

    2007-01-01

    Flip chip technology provides the ultimate in high I/ O-density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) which is widely used in electronics packaging as surface finish for flip-chip application nowadays. In this research, field emission scanning electron microscopy (FESEM) analysis was conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between the SAC lead-free solder with Cu surface finish after reflow were mainly (Cu, Ni) 6 Sn 5 and Cu 6 Sn 5 . While the main IMCs formed between lead-free solder on ENEPIG surface finish are (Ni, Cu) 3 Sn 4 and Ni 3 Sn 4 . The results from FESEM with energy dispersive x-ray (EDX) have revealed that isothermal aging at 150 degree Celsius has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated was found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. (author)

  6. Measurement of leached hulls

    International Nuclear Information System (INIS)

    Reilly, T.D.

    1979-07-01

    Leached hulls are the short lengths of fuel rod cladding and fuel element hardware which constitute a major waste product of a reprocessing plant employing a chop-and-leach head-end process. The small, undissolved fuel residue (0.1 to 1.0% of original fuel content) which is discarded with this waste must be measured for safeguards, material accountability, and process control reasons. This report gives a critical analysis of hull measurement techniques involving the analysis of fission product gamma rays, spontaneous fission neutrons from curium, and delayed neutron activation. Major emphasis is given to the measurement of 2186-keV gamma rays from 144 Ce-- 144 Pr. A detailed description of typical leached hull characteristics is presented at the beginning of the report. An extensive review of experience gained from existing hull measurement systems in the United Kingdom, France, Japan, Germany, Italy, and the United States is presented

  7. Soldering formalism in noncommutative field theory: a brief note

    International Nuclear Information System (INIS)

    Ghosh, Subir

    2004-01-01

    In this Letter, I develop the soldering formalism in a new domain--the noncommutative planar field theories. The soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair of noncommutative Maxwell-Chern-Simons theories, having opposite signs in their respective topological terms, can be consistently soldered to yield the Proca model (Maxwell theory with a mass term) with corrections that are at least quadratic in the noncommutativity parameter. We further argue that this model can be thought of as the noncommutative generalization of the Proca theory of ordinary spacetime. It is well known that abelian noncommutative gauge theory bears a close structural similarity with non-abelian gauge theory. This fact is manifested in a non-trivial way if the present Letter is compared with existing literature, where soldering of non-abelian models are discussed. Thus the present work further establishes the robustness of the soldering programme. The subtle role played by gauge invariance (or the lack of it), in the above soldering process, is revealed in an interesting way

  8. Utilization of Pb-free solders in MEMS packaging

    Science.gov (United States)

    Selvaduray, Guna S.

    2003-01-01

    Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

  9. Fatigue and thermal fatigue of Pb-Sn solder joints

    International Nuclear Information System (INIS)

    Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

    1987-01-01

    This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55 0 C and 125 0 C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb

  10. Accelerated leach test development program

    International Nuclear Information System (INIS)

    Fuhrmann, M.; Pietrzak, R.F.; Heiser, J.; Franz, E.M.; Colombo, P.

    1990-11-01

    In FY 1989, a draft accelerated leach test for solidified waste was written. Combined test conditions that accelerate leaching were validated through experimental and modeling efforts. A computer program was developed that calculates test results and models leaching mechanisms. This program allows the user to determine if diffusion controls leaching and, if this is the case, to make projections of releases. Leaching mechanisms other than diffusion (diffusion plus source term partitioning and solubility limited leaching) are included in the program is indicators of other processes that may control leaching. Leach test data are presented and modeling results are discussed for laboratory scale waste forms composed of portland cement containing sodium sulfate salt, portland cement containing incinerator ash, and vinyl ester-styrene containing sodium sulfate. 16 refs., 38 figs., 5 tabs

  11. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

  12. Manipulation and soldering of carbon nanotubes using atomic force microscope

    International Nuclear Information System (INIS)

    Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

    2008-01-01

    Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

  13. Urananite leaching: literature survey

    Energy Technology Data Exchange (ETDEWEB)

    Grisham, G.F.; Bryant, E.A.; Williams, K.E.

    1979-04-01

    A literature survey was undertaken to provide background materials for a series of experiments involving the interaction of spent uranium dioxide fuel with various environments. Notes and references pertaining to the basic properties of UO/sub 2/ as produced and after reactor exposure are presented. The use of computerized literature searches is illustrated with specific topics related to leaching experiments. 57 references.

  14. Urananite leaching: literature survey

    International Nuclear Information System (INIS)

    Grisham, G.F.; Bryant, E.A.; Williams, K.E.

    1979-04-01

    A literature survey was undertaken to provide background materials for a series of experiments involving the interaction of spent uranium dioxide fuel with various environments. Notes and references pertaining to the basic properties of UO 2 as produced and after reactor exposure are presented. The use of computerized literature searches is illustrated with specific topics related to leaching experiments. 57 references

  15. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

    Science.gov (United States)

    Lee, Sang-Yeob; Lee, Jong-Hyuk

    2010-12-01

    The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

  16. Leach testing of SYNROC and glass samples at 85 and 200/degree/C

    International Nuclear Information System (INIS)

    Oversby, V.M.; Ringwood, A.E.

    1981-01-01

    Leach tests were conducted on 0.5 g disc samples of SYNROC and two glass types using distilled water at 85 and 200/degree/C. No leaching was detected for SYNROC at either temperature. Thus, the upper limit on leach rate for SYNROC is <0.005 g/m/sup 2/d. Waste glass PNL 76-68 had leach rates of 1.4 g/m/sup 2/ d at 85/degree/C and 8.9 g/m/sup 2/ d at 200/degree/C, while 73-1 glass frit had a leach rate of 41 g/m/sup 2/ d at 200/degree/C. The leach tests were repeated in the presence of rock powders. Again, no leaching was measurable for SYNROC. PNL 76-68 glass had leach rates between 4 and 23 g/m/sup 2/ d at 200/degree/C and 73-1 frit leached at rates between 29 and 176 g/m/sup 2/ d at 200/degree/C. Tests were also conducted on crushed glass samples (PNL 76-68, 100-200 /mu/m size fraction). Bulk leach rates were calculated based on measurement of Ca, Cs, and U in the leach solutions. The results of the leach tests show that SYNROC is several orders of magnitude more resistant to leaching than glass

  17. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Directory of Open Access Journals (Sweden)

    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  18. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  19. In-situ uranium leaching

    International Nuclear Information System (INIS)

    Dotson, B.J.

    1986-01-01

    This invention provides a method for improving the recovery of mineral values from ore bodies subjected to in-situ leaching by controlling the flow behaviour of the leaching solution. In particular, the invention relates to an in-situ leaching operation employing a foam for mobility control of the leaching solution. A foam bank is either introduced into the ore bed or developed in-situ in the ore bed. The foam then becomes a diverting agent forcing the leaching fluid through the previously non-contacted regions of the deposit

  20. Strength of joints brazed with two-phase solders

    International Nuclear Information System (INIS)

    Shnyakin, N.S.; Parfenova, L.V.; Ekatova, A.S.; Prilepskaya, I.V.

    1976-01-01

    Dependence of the structure and strength of soldered joints upon a gap size in case of 1Kh18N10T stainless steel soldering with a double-phase solder of Ni-Zn-Cu system is described. Butt and lap joints have been subjected to soldering with gas-flame and induction heating. The optimum conditions of the solder crystallization are determined with wedge-gap samples. The studies show that the character of distribution of a fusible β-phase in metal depends upon a gap size. With gaps up to 0.1 mm the β-phase enriched with a fusible component (zinc) runs as a continuous thin interlayer in the middle of the seam. As a result of zinc evaporation from the β-phase this interlayer becomes internally oxidized. After the sample is broken an oxidized fracture gives one the impression of a poor fusion in the middle part of the joint. The ultimate strength of butt joints is 15-20 kgf/sq.mm. A value of thermal expansion of 1Kh18N10T steel samples, 1-5 mm thick, has been experimentally determined for butt soldering. The elongation of two halves of the sample is measured by an indicator and proved to be 0.89 mm for a 50x50x2 mm sample at a soldering temperature of 1.100 deg C. The paper presents methods for the calculation of an optimal gap value for butt soldering with a local gas-flame and induction heating

  1. Leaching Mechanisms Program. Annual report

    International Nuclear Information System (INIS)

    Dougherty, D.; Colombo, P.; Doty, R.; Fuhrmann, M.

    1984-09-01

    The primary goal of this work is to determine the leaching mechanisms of a variety of matrix materials either in use or being considered for the solidification of low-level radioactive wastes by defense and commercial waste generators. Since this program is new and did not formally begin until May of FY 84, the results reported here are few and preliminary. Efforts were concentrated in the following activities: (1) The literature search for leaching data and proposed leaching models and mechanisms for low-level waste. (2) Data base development for leaching data being compiled from the literature and from the leaching experiments in this program. (3) The selection of solidification agents for the experimental part of the program. (4) Fabrication of leach samples and initiation of leach testing. 28 references, 9 figures, 4 tables

  2. Characteristics of solder joints under fatigue loads using piezomechanical actuation

    Science.gov (United States)

    Shim, Dong-Jin; Spearing, S. Mark

    2003-07-01

    Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

  3. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2009-03-01

    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  4. Tensile strength of two soldered alloys (Minalux and Verabond2

    Directory of Open Access Journals (Sweden)

    Mir Mohammad Rezaee S

    2002-07-01

    Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

  5. Production of an impermeable composite of irradiated graphite and glass by hot isostatic pressing as a long term leach resistant waste form

    Energy Technology Data Exchange (ETDEWEB)

    Fachinger, Johannes; Muller, Walter [FNAG ZU Hanau, Hanau (Germany); Marsat, Eric [FNAG SAS Le Pont de Claix (France); Grosse, Karl-Heinz; Seemann, Richard [ALD Hanau (Germany); Scales, Charlie; Easton, Michael Mark [NNL, Workington (United Kingdom); Anthony Banford [NNL, Warrington (United Kingdom); University of Manchester, Manchester (United Kingdom)

    2013-07-01

    negligible porosity and a water impermeable structure. Structural analysis shows that the glass in the composite has replaced the pores in the graphite structure. The typical pore volume of a graphite material is in the range of 20 vol.%. Therefore no volume increase will occur in comparison with the former graphite material. This IGM material will allow the encapsulation of graphite with package densities larger than 1.5 ton per cubic meter. Therefore a huge volume saving can be achieved by such an alternative encapsulation method. Disposal performance is also enhanced since little or no leaching of radionuclides is observed due to the impermeability of the material NNL and FNAG have proved that IGM can be produced by hot isostatic pressing (HIP) which has several advantages for radioactive materials over the HVP process. - The sealed HIP container avoids the release of any radionuclides. - The outside of the waste package is not contaminated. - The HIP process time is shorter than the HVP process time. The isostatic press avoids anisotropic density distributions. - Simple filling of the HIP container has advantages over the filling of an axial die. (authors)

  6. Production of an impermeable composite of irradiated graphite and glass by hot isostatic pressing as a long term leach resistant waste form

    International Nuclear Information System (INIS)

    Fachinger, Johannes; Muller, Walter; Marsat, Eric; Grosse, Karl-Heinz; Seemann, Richard; Scales, Charlie; Easton, Michael Mark; Anthony Banford

    2013-01-01

    negligible porosity and a water impermeable structure. Structural analysis shows that the glass in the composite has replaced the pores in the graphite structure. The typical pore volume of a graphite material is in the range of 20 vol.%. Therefore no volume increase will occur in comparison with the former graphite material. This IGM material will allow the encapsulation of graphite with package densities larger than 1.5 ton per cubic meter. Therefore a huge volume saving can be achieved by such an alternative encapsulation method. Disposal performance is also enhanced since little or no leaching of radionuclides is observed due to the impermeability of the material NNL and FNAG have proved that IGM can be produced by hot isostatic pressing (HIP) which has several advantages for radioactive materials over the HVP process. - The sealed HIP container avoids the release of any radionuclides. - The outside of the waste package is not contaminated. - The HIP process time is shorter than the HVP process time. The isostatic press avoids anisotropic density distributions. - Simple filling of the HIP container has advantages over the filling of an axial die. (authors)

  7. Features of Pd-Ni-Fe solder system for vacuum brazing of low alloy steels

    International Nuclear Information System (INIS)

    Radzievskij, V.N.; Kurochko, R.S.; Lotsmanov, S.N.; Rymar', V.I.

    1975-01-01

    The brazing solder of the Pd-Ni-Fe alloyed with copper and lithium, in order to decrease the melting point and provide for a better spreading, when soldered in vacuum ensures a uniform strength of soldered joints with the base metal of low-alloyed steels of 34KHNIM-type. The properties of low-alloyed steel joints brazed with the Pd-Ni-Fe-system solder little depend on the changes in the soldering parameters. The soldered joint keeps a homogeneous structure after all the stages of heat treatment (annealing, quenching and tempering)

  8. Leaching materials from cavities

    International Nuclear Information System (INIS)

    Hodgson, T.D.; Jordan, T.W.J.

    1980-01-01

    A material is leached from a cavity by contacting the material with a liquid and subjecting the liquid to a number of pressure cycles, each pressure cycle involving a decrease in pressure to cause boiling of the liquid, followed by a rise in pressure to inhibit the boiling. The method may include the step of heating the liquid to a temperature near to its boiling point. The material may be nuclear fuel pellets or calcium carbonate pellets. (author)

  9. Analysis of some components of resistance in the hybrids of banana FHIA-23 and plantain FHIA-21 to black (Mycosphaerella fijiensis Morelet) and yellow (M. musicola Leach) sigatokas

    International Nuclear Information System (INIS)

    Guzman Piedrahita, Oscar Adrian; Castano Zapata, Jairo

    2009-01-01

    It was determined the performance of FHIA-20 and FHIA-23 to both Mycosphaerella fijiensis and M. musicola. The study was conducted in a screen house at the Montelindos farm of the University of Caldas, at 1010 most, average temperature 22.8 Celsius degrade, annual precipitation 2200 mm, and relative humidity 76%. Conidia of Paracercospora fijiensis and Pseudocercospora musae, and mixture of both, were inoculated to seedlings having between 4 and 6 leaves. It was evaluated incubation period (IP) of both pathogens, times of evolution of symptoms (TES) and disease development (TDD), also, lesions per leaf (NLL). In FHIA-20, P. musae, P. fijiensis and P. musae+P. fijiensis, had a longer IP than in Dominico Harton, being 3, 20 and 10 days longer, respectively; in addition, the TES of yellow and black sigatokas and the combination of both diseases, was more prolonged in FHIA-20, in 5, 49 and 26 days, respectively, than in local material. In FHIA-23, P. musae, P. fijiensis and P. musae + P. fijiensis, had 2, 6 and 3 more days of IP, respectively, than in Gros Michel; furthermore, FHIA-23 had a TES of yellow and black sigatokas and the combination of both, higher than in Gros Michel, in 9, 16 and 11 days, respectively. In general, FHIA-23 behaved as highly resistant and tolerant to black and yellow sigatokas, respectively, and FHIA-23, resistant.

  10. Electrochemical Behavior of Sn-9Zn- xTi Lead-Free Solders in Neutral 0.5M NaCl Solution

    Science.gov (United States)

    Wang, Zhenghong; Chen, Chuantong; Jiu, Jinting; Nagao, Shijo; Nogi, Masaya; Koga, Hirotaka; Zhang, Hao; Zhang, Gong; Suganuma, Katsuaki

    2018-05-01

    Electrochemical techniques were employed to study the electrochemical corrosion behavior of Sn-9Zn- xTi ( x = 0, 0.05, 0.1, 0.2 wt.%) lead-free solders in neutral 0.5M NaCl solution, aiming to figure out the effect of Ti content on the corrosion properties of Sn-9Zn, providing information for the composition design of Sn-Zn-based lead-free solders from the perspective of corrosion. EIS results reveal that Ti addition was involved in the corrosion product layer and changed electrochemical interface behavior from charge transfer control process to diffusion control process. The trace amount of Ti addition (0.05 wt.%) can refine the microstructure and improve the corrosion resistance of Sn-9Zn solder, evidenced by much lower corrosion current density ( i corr) and much higher total resistance ( R t). Excess Ti addition (over 0.1 wt.%) led to the formation of Ti-containing IMCs, which were confirmed as Sn3Ti2 and Sn5Ti6, deteriorating the corrosion resistance of Sn-9Zn- xTi solders. The main corrosion products were confirmed as Sn3O(OH)2Cl2 mixed with small amount of chlorine/oxide Sn compounds.

  11. Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2018-04-01

    Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

  12. Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

    Science.gov (United States)

    Mukherjee, S.; Chauhan, P.; Osterman, M.; Dasgupta, A.; Pecht, M.

    2016-07-01

    Mechanistic microstructural models have been developed to capture the effect of isothermal aging on time dependent viscoplastic response of Sn3.0Ag0.5Cu (SAC305) solders. SnAgCu (SAC) solders undergo continuous microstructural coarsening during both storage and service because of their high homologous temperature. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long term reliability of microelectronic packages. It is well documented that isothermal aging degrades the creep resistance of SAC solder. SAC305 alloy is aged for (24-1000) h at (25-100)°C (~0.6-0.8 × T melt). Cross-sectioning and image processing techniques were used to periodically quantify the effect of isothermal aging on phase coarsening and evolution. The parameters monitored during isothermal aging include size, area fraction, and inter-particle spacing of nanoscale Ag3Sn intermetallic compounds (IMCs) and the volume fraction of micronscale Cu6Sn5 IMCs, as well as the area fraction of pure tin dendrites. Effects of microstructural evolution on secondary creep constitutive response of SAC305 solder joints were then modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs in the eutectic phase; and (2) load sharing between pro-eutectic Sn dendrites and the surrounding coarsened eutectic Sn-Ag phase and microscale Cu6Sn5 IMCs. The coarse-grained polycrystalline Sn microstructure in SAC305 solder was not captured in the above model because isothermal aging does not cause any significant change in the initial grain size and orientation of SAC305 solder joints. The above mechanistic model can successfully capture the drop in creep resistance due to the influence of isothermal aging on SAC305 single crystals. Contribution of grain boundary sliding to the creep strain of

  13. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    /methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base...... titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

  14. Mechanical properties of Bi-In-Zn/ Cu solder joint system

    International Nuclear Information System (INIS)

    Ervina Efzan Mohd Noor; Mohammed Noori Ridha; Ahmad Badri Ismail; Nurulakmal Mohd Sharif; Kuan Yew Cheong; Tadashi Ariga; Zuhailawati Hussain

    2009-01-01

    Full text: In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry; the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this works, microstructure and mechanical properties of different reflow temperature (80, 100, 120 and 140 degree Celsius) for solder joints on shear strength of Bi-In-Zn lead free solder with low melting temperature of 60 degree Celsius on Cu solder joint has been investigated. This paper will compared the mechanical properties of the Bi-In-Zn lead-free solder alloys with current lead-free solder, Sn-Ag-Cu solder alloy. The fracture surface analyses have been observed by Optical Microscope and were investigated by Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX) and proved it by X-ray diffraction (XRD). (author)

  15. Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

    Directory of Open Access Journals (Sweden)

    Molnar A.

    2017-06-01

    Full Text Available In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

  16. Leaching From Biomass Gasification Residues

    DEFF Research Database (Denmark)

    Allegrini, Elisa; Boldrin, Alessio; Polletini, A.

    2011-01-01

    The aim of the present work is to attain an overall characterization of solid residues from biomass gasification. Besides the determination of chemical and physical properties, the work was focused on the study of leaching behaviour. Compliance and pH-dependence leaching tests coupled with geoche......The aim of the present work is to attain an overall characterization of solid residues from biomass gasification. Besides the determination of chemical and physical properties, the work was focused on the study of leaching behaviour. Compliance and pH-dependence leaching tests coupled...

  17. Commentary: Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    Menovsky, T.; Beek, J.F.; Gemert, M.J.C. van

    1999-01-01

    Full text: Laser tissue welding is the process of using laser energy to join tissues without sutures or with a reduced number of sutures. Recently, diode lasers have been added to the list of fusion lasers (Lewis and Uribe 1993, Reali et al 1993). Typically, for tissue welding, deep penetrating diode lasers emitting at 800-810 nm are used, in combination with a strong absorbing protein solder containing the dye indocyanine green. Indocyanine green has a maximum absorption coefficient at 805 nm and binds preferentially with proteins (Sauda et al 1986). The greatest advantage of diode lasers is their compact size, easy use and low cost. In this issue of Physics in Medicine and Biology (pp 983-1002, 'Photothermal effects of laser tissue soldering'), in an in vitro study, McNally et al investigate the optimal laser settings and welding temperatures in relation to the tensile strength and thermal damage of bovine aorta specimens. An interesting statement in their introduction is that the low strength of laser produced anastomoses can lead to aneurysm formation. The increased chance of aneurysm formation may merely be due to the thermal effect of the laser on the vascular wall, especially on the adventitia and media layers, which become necrotic after thermal injury. Subsequent haemodynamic stress exerted on a damaged vascular wall is a significant contributing factor for aneurysmal initiation. Also interesting is the remark that 'by the application of wavelength-specific chromophores in tissue welding ... the requirement for precise focusing and aiming of the laser beam may be removed'. Though perhaps not yet fully justified, this statement, if true, would facilitate surgical procedures. While the experiments are conducted in a proper manner, the use of bovine aorta specimens, which were stored at -70 deg. C and subsequently thawed for the tissue welding experiments, may not be the most appropriate for studying tissue effects or tensile strength measurements, as the

  18. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

  19. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

  20. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

  1. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan

    2009-01-01

    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work...

  2. Leaching Test Relationships, Laboratory-to-Field Comparisons and Recommendations for Leaching Evaluation using the Leaching Environmental Assessment Framework (LEAF)

    Science.gov (United States)

    This report presents examples of the relationships between the results of laboratory leaching tests, as defined by the Leaching Environmental Assessment Framework (LEAF) or analogous international test methods, and leaching of constituents from a broad range of materials under di...

  3. Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

    Science.gov (United States)

    Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

    2018-03-01

    The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

  4. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  5. Effects of Pregnant Leach Solution Temperature on the Permeability of Gravelly Drainage Layer of Heap Leaching Structures

    Directory of Open Access Journals (Sweden)

    mehdi amini

    2013-12-01

    Full Text Available In copper heap leaching structures, the ore is leached by an acidic solution. After dissolving the ore mineral, the heap is drained off in the acidic solution using a drainage system (consisting of a network of perforated polyethylene pipes and gravelly drainage layers and is, then, transferred to the leaching plant for copper extraction where the copper is extracted and the remaining solution is dripped over the ore heap for re-leaching. In this process, the reaction between the acidic solution and copper oxide ore is exothermal and the pregnant leach solution (PLS, which is drained off the leaching heap, has a higher temperature than the dripped acidic solution. The PLS temperature variations cause some changes in the viscosity and density which affect the gravelly drainage layer's permeability. In this research, a special permeability measuring system was devised for determining the effects of the PLS temperature variations on the permeability coefficient of the gravelly drainage layer of heap leaching structures. The system, consisting of a thermal acid resistant element and a thermocouple, controls the PLS temperature, which helps measure the permeability coefficient of the gravelly drainage layer. The PLS and gravelly drainage layer of Sarcheshmeh copper mine heap leaching structure No. 1 were used in this study. The permeability coefficient of the gravelly soil was measured against the PLS and pure water at temperatures varying between 3°C to 60°C. Also, the viscosity and density of the PLS and pure water were measured at these temperatures and, using existing theoretical relations, the permeability coefficient of the gravel was computed. A comparison between the experimental and theoretical results revealed a good conformity between the two sets of results. Finally, a case (Taft heap leaching structure, Yazd, Iran was studied and its gravelly drainage layer was designed based on the results of the present research.

  6. Automation of experimental research of waveguide paths induction soldering

    Science.gov (United States)

    Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

    2018-05-01

    The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

  7. Optimization of the soldering process by the DMAIC methodology

    Directory of Open Access Journals (Sweden)

    Michał Zasadzień

    2016-06-01

    Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

  8. Drinking Water Contamination Due To Lead-based Solder

    Science.gov (United States)

    Garcia, N.; Bartelt, E.; Cuff, K. E.

    2004-12-01

    The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

  9. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan

    2017-08-10

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  10. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong

    2017-01-01

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  11. Defining Effective Salt Leaching Regions Between Drains

    OpenAIRE

    ANAPALI, Ömer; ŞAHİN, Üstün; ÖZTAŞ, Taşkın; HANAY, Abdurrahman

    2014-01-01

    The application of sufficient amounts of leaching water by means of an effective method is very important in the management and reclamation of saline and sodic soils. Reclamation cannot be achieved with insufficient leaching water application, while excess water application may cause severe problems in soil. Knowledge of the leaching regions and intensities may help to control the amounts of leaching water through effective leaching methods in areas of limited leaching. This study was und...

  12. Thermomechanical behavior of tin-rich (lead-free) solders

    Science.gov (United States)

    Sidhu, Rajen Singh

    In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local

  13. To accelerate technology of in situ leaching and heap leaching for mining mineral resources of China

    International Nuclear Information System (INIS)

    Luo Mei

    1999-01-01

    Recently, in situ leaching and heap leaching are the most advanced technology for mining low-grade mineral resources in the world. The author briefly expounds the basic concept and advantages of in situ leaching and heap leaching and deals with the main research content of the hydrometallurgical technology of in situ leaching and heap leaching, its development and present application at home and abroad. Having expounded the gap existing between China's technology of in situ leaching and heap leaching and the foreign technology, the author forecasts the prospects of accelerating the mining of China's mineral resources by using the technology of in situ leaching and heap leaching

  14. Soldered Power Arm: An Easy and Effective Method for Intrusion and Retraction of Anterior Teeth

    Directory of Open Access Journals (Sweden)

    Ketan K Vakil

    2014-01-01

    Full Text Available The orthodontic correction of deep overbite can be achieved with several mechanisms that will result in true intrusion of anterior teeth, extrusion of posterior teeth, or a combination of both. For the orthodontic correction of bimaxillary dentoalveolar protrusion with deep bite, there are several treatment modalities like segmented arch approach, retraction and intrusion utility arches, temporary anchorage devices. Though not a novel therapeutic concept, the use of miniscrew implants to obtain absolute anchorage has recently become very popular in clinical orthodontic approaches. To allow the use of sliding mechanics for bodily retraction with intrusion of anterior teeth, we devised a soldered power arm (SPA on standard molar tube. It is simple, stable, precise and effective in cases where anterior teeth need to be simultaneously retracted and intruded. A power arm can be readily fabricated from 20 gauge stainless steel wire and soldered on the molar buccal tube so as to avoid any distortion or loosening of power arm from molar tube during the course of the treatment. The SPA works efficiently with the molar being stabilized in all three planes of space. The resultant force vector is directed more apically toward the center of resistance of the anchor unit, which resulted in the treatment outcome of retraction and intrusion of the anterior teeth and correction of the deep bite.

  15. Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

    Energy Technology Data Exchange (ETDEWEB)

    Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

    1999-11-01

    Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

  16. Influence of solder joint length to the mechanical aspect during the thermal stress analysis

    Science.gov (United States)

    Tan, J. S.; Khor, C. Y.; Rahim, Wan Mohd Faizal Wan Abd; Ishak, Muhammad Ikman; Rosli, M. U.; Jamalludin, Mohd Riduan; Zakaria, M. S.; Nawi, M. A. M.; Aziz, M. S. Abdul; Ani, F. Che

    2017-09-01

    Solder joint is an important interconnector in surface mount technology (SMT) assembly process. The real time stress, strain and displacement of the solder joint is difficult to observe and assess the experiment. To tackle these problems, simulation analysis was employed to study the von Mises stress, strain and displacement in the thermal stress analysis by using Finite element based software. In this study, a model of leadless electronic package was considered. The thermal stress analysis was performed to investigate the effect of the solder length to those mechanical aspects. The simulation results revealed that solder length gives significant effect to the maximum von Mises stress to the solder joint. Besides, changes in solder length also influence the displacement of the solder joint in the thermal environment. The increment of the solder length significantly reduces the von Mises stress and strain on the solder joint. Thus, the understanding of the physical parameter for solder joint is important for engineer prior to designing the solder joint of the electronic component.

  17. Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

    2008-04-24

    The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes.

  18. Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

    Science.gov (United States)

    This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

  19. Cement based grouts - longevity laboratory studies: leaching behaviour

    International Nuclear Information System (INIS)

    Onofrei, M.; Gray, M.; Roe, L.

    1991-12-01

    This report describes a series of laboratory tests carried out to determine the possible leaching behaviour of cement-based grouts in repository environments. A reference high-performance cement-based grout, comprised of Canadian Type 50 (U.S. Type V) Sulphate Resisting Portland Cement, silica fume, potable water and superplasticizer, and a commercially available cement grout were subjected to leaching in distilled water and three simulated groundwaters of different ionic strength. Hardened, monolithic specimens of the grout were leached in static, pulsed-flow and continuous flow conditions at temperatures from 10 degrees C to 150 degrees C for periods of up to 56 days. The changes in concentration of ions in the leachants with time were determined and the changes in the morphology of the surfaces of the grout specimens were examined using electron microscopy. After a review of possible mechanisms of degradation of cement-based materials, the data from these experiments are presented. The data show that the grouts will leach when in contact with water through dissolution of more soluble phases. Comparison of the leaching performance of the two grouts indicates that, while there are some minor differences, they behaved quite similarly. The rate of the leaching processes were found to tend to decrease with time and to be accompanied by precipitation and/or growth of an assemblage of secondary alteration phases (i.e., CaCO 3 , Mg(OH) 2 ). The mechanisms of leaching depended on the environmental conditions of temperature, groundwater composition and water flow rate. Matrix dissolution occurred. However, in many of the tests leaching was shown to be limited by the precipitated/reaction layers which acted as protective surface coatings. (37 refs.) (au)

  20. Disposal of leached residual in heap leaching by neutralization

    International Nuclear Information System (INIS)

    Wang Jingmin

    1993-01-01

    The disposal results of leached residual with lime are described. Using the ratio of residual to lime being 100 : 1 the ideal disposal results were obtained with the effluent of the neutralized residual close to neutral

  1. Mechanism for elevated temperature leaching

    International Nuclear Information System (INIS)

    Kenna, B.T.; Murphy, K.D.

    1979-01-01

    Long-term, elevated temperature leaching and subsequent electron microprobe analysis of simulated waste glass and ceramic materials have been completed. A cyclic leaching pattern was found in all systems over a 20-month period. It appears that the leaching of mobile ions by simple diffusional processes is modified by more complex chemical interactions. The release of immobile ions is primarily a function of their chemical interactions in the matrix which suggests that these ions may be complex species when released into solution. A mechanism is proposed which incorporates these ideas and the cyclic phenomenon observed

  2. Leaching of concrete : the leaching process : extrapolation of deterioration : effect on the structural stability

    OpenAIRE

    Fagerlund, Göran

    2000-01-01

    The leaching process when water attacks concrete, and the effect of leaching on the strength and durability of a concrete structure, is analysed theoretically. Technique for prediction of the future leaching and structural stability is outlined. The analysis is to a certain extent supported by data from literature. The leaching process is divided in five different types: 1: Pure surface leaching 2: Surface leaching involving erosion 3: Homogeneous leaching over the entire structure 4...

  3. Flotation-nitric acid leach procedure for increasing uranium recovery from a refractory ore

    International Nuclear Information System (INIS)

    Carnahan, T.G.; Lei, K.P.V.

    1979-01-01

    The Bureau of Mines investigated a flotation-nitric acid leach procedure as part of the goal to maximize minerals and metals recovered from primary and secondary domestic resources. Studies were conducted on an ore that contained carbon-bearing and sulfide mineralization that rendered a portion of the ore refractory (resistant) to conventional leaching technology. The procedure investigated for treating the ore consisted of the following: (1) separation by flotation of the carbonaceous and sulfidic components from the ore, (2) leaching the flotation concentrate with nitric acid at 100 0 to 110 0 C, (3) leaching the flotation tailings with sulfuric acid, and (4) processing the combined leached slurries in a conventional manner to recover yellow cake. In step 2, HNO 3 is converted to gaseous products from which it is regenerated by reacting these products with air and water for further leaching. An overall uranium extraction of 96% was achieved by this procedure

  4. Horizon shells and BMS-like soldering transformations

    Energy Technology Data Exchange (ETDEWEB)

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

    2016-03-07

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  5. Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

    International Nuclear Information System (INIS)

    Liu, X.W.; Plumbridge, W.J.

    2003-01-01

    The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

  6. Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

    2017-07-27

    Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integrated with attractive fabrication techniques for thermoelectric modules, such as screen printing, suggesting the potential of these solders in the rational design of printable and moldable thermoelectrics.

  7. Effects of PCB thickness on adjustable fountain wave soldering

    Indian Academy of Sciences (India)

    hybrid circuit assembly, component lead tinning, and wire tinning. .... The mesh model was built and optimized with 599920 hybrid nodes as shown in figure 9. ... conducted to track the fluid motions of the two phases (i.e., molten solder and air).

  8. Corrosion Damage Investigation of Silver-Soldered Stainless Steel Orthodontic Appliances Used in Vivo / Ocena Zniszczeń Korozyjnych Używanych In Vivo Stałych Aparatów Ortodontycznych O Połączeniach Lutowanych Na Bazie Srebra

    Directory of Open Access Journals (Sweden)

    Łępicka M.

    2015-12-01

    Full Text Available Processes of destruction of products used in orthodontic treatment, e.g. fixed orthodontic appliances, microimplants or dental prostheses considerably limit its operational lifetime and comfort and safety of patients. The objective of the research was to evaluate and assess corrosion damage to silver-soldered stainless steel rapid palatal expansion Hyrax devices. Used in vivo for 2 or 6 months, respectively, RPE (rapid palatal expansion devices were analyzed macroscopically and in a scanning electron microscope with an energy X-ray analyzer for signs of corrosion. The evaluated appliances showed discernible differences between the overall condition of the noble solders and the stainless steel elements. The Ag-rich solders were chiefly covered in corrosion pits, whereas stainless steel wires, molar bands and Hyrax screws presented corrosion-free surfaces. What is more, the EDS analysis showed differential element composition of the solders. According to the results, noble materials, such as Ag-rich solders, can corrode in a salivary environment when coupled with stainless steel. The selective leaching processes are observed.

  9. Comparison of leaching tests and study of leaching mechanisms

    International Nuclear Information System (INIS)

    Amarantos, S.G.; Papadokostaki, K.G.; Petropoulos, J.H.

    1985-10-01

    The present work is concerned first with the study of certain aspects of the leaching kinetics of Cs + and Sr ++ embedded in cement, as Cs 2 SO 4 and SrSO 4 , and in particular: (a) the comparative evaluation of leaching in (i) stagnant, (ii) stirred and (iii) continuously flowing (modified Soxhlet) water, (b) the effect of atmospheric CO 2 on elution, (c) the effect of temperature changes during leaching. Secondly, model kinetic studies were carried out using cellulose acetate incorporating SrSO 4 , CaSO 4 or NaCl. The main results obtained were: (1) Cs leaching rates were not significantly affected by the leaching method or by the presence of atmospheric CO 2 . The embedded Cs exists in relatively easily leachable and less rapidly leachable (most probably located within the gel regions) forms. (2) Elution of Sr is retarded by stagnant and infrequently renewed leachant (method (i)) and by the presence of atmospheric CO 2 ; leaching method (iii), which tends to minimize both of these effects, gave the highest elution rates. (3) The observed elution kinetics in the case of cellulose acetate-CaSO 4 or SrSO 4 conform to the Higuchi model, but a more elaborate theory is needed for the cellulose acetate-NaCl system. (author)

  10. LEACH-A: An Adaptive Method for Improving LEACH Protocol

    Directory of Open Access Journals (Sweden)

    Jianli ZHAO

    2014-01-01

    Full Text Available Energy has become one of the most important constraints on wireless sensor networks. Hence, many researchers in this field focus on how to design a routing protocol to prolong the lifetime of the network. The classical hierarchical protocols such as LEACH and LEACH-C have better performance in saving the energy consumption. However, the choosing strategy only based on the largest residue energy or shortest distance will still consume more energy. In this paper an adaptive routing protocol named “LEACH-A” which has an energy threshold E0 is proposed. If there are cluster nodes whose residual energy are greater than E0, the node of largest residual energy is selected to communicated with the base station; When all the cluster nodes energy are less than E0, the node nearest to the base station is select to communication with the base station. Simulations show that our improved protocol LEACH-A performs better than the LEACH and the LEACH-C.

  11. Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement

    Energy Technology Data Exchange (ETDEWEB)

    Li, Yi, E-mail: yili64-c@my.cityu.edu.hk [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong); Luo, Kaiming; Lim, Adeline B.Y.; Chen, Zhong [School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798 (Singapore); Wu, Fengshun [School of Materials Science and Engineering, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan (China); Chan, Y.C. [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong)

    2016-07-04

    Sn57.6Bi0.4Ag solder has been reinforced successfully through the addition of tungsten (W) nanoparticles at a concentration of 0.5 wt%. With the addition of W nanoparticles, the solder matrix lamellar interphase spacing was reduced by 31.0%. Due to the dispersion of W nanoparticles and the consequently refined microstructure, the mechanical properties of the solder alloy were enhanced, as indicated by a 6.2% improvement in the microhardness. During the reflow of solder on Au/Ni/Cu pads, the entire Au layer dissolved into the molten solder rapidly and a large number of (Au,Ni)(Sn,Bi){sub 4} particles were formed. The fracture path of the as-reflowed joint was within the solder region, showing ductile characteristic, and the shear strength was reinforced by 8.2%, due to the enhanced mechanical properties of the solder. During the subsequent aging process, the Au migrated back towards the interface and a thick layer of interfacial (Au,Ni)(Sn,Bi){sub 4} IMC was formed, leading to the shift of the fracture path to the interfacial IMC region, the transformation to brittle fracture and the deterioration of the strength of the joint, due to Au embrittlement. By adding W nanoparticles, the migration of Au was mitigated and the thickness of the (Au,Ni)(Sn,Bi){sub 4} layer was reduced significantly, which reduced the Au embrittlement-induced deterioration of the strength of the joint. During electromigration, the segregation of the Bi-rich and Sn-rich phases and the accumulation of the (Au,Ni)(Sn,Bi){sub 4} layer at cathode interface were mitigated by the addition of W nanoparticles, which improved the electromigration resistance.

  12. Next Generation of Leaching Tests

    Science.gov (United States)

    A corresponding abstract has been cleared for this presentation. The four methods comprising the Leaching Environmental Assessment Framework are described along with the tools to support implementation of the more rigorous and accurate source terms that are developed using LEAF ...

  13. Leaching of radionuclides out of some novelly formed products extracted from the reactor zone of the 4th unit of Chernobyl NPP

    International Nuclear Information System (INIS)

    Rogozin, Yu.M.; Smirnova, E.A.; Savonenko, V.G.; Krivokhatskij, A.S.; Avdeev, V.A.; Sagajdachenko, E.Yu.

    1991-01-01

    Data are presented on leaching of radionuclides from two samples of glass-like products (brown and gree glass) by 0.01 mol/l solution of sodium chloride. The level and rate of radionuclide leaching are determined. It is ascertained that green glass features a higher resistance to leaching

  14. Pressure leaching of chalcopyrite concentrate

    Science.gov (United States)

    Aleksei, Kritskii; Kirill, Karimov; Stanislav, Naboichenko

    2018-05-01

    The results of chalcopyrite concentrate processing using low-temperature and high-temperature sulfuric acid pressure leaching are presented. A material of the following composition was used, 21.5 Cu, 0.1 Zn, 0.05 Pb, 0.04 Ni, 26.59 S, 24.52 Fe, 16.28 SiO2 (in wt.%). The influence of technological parameters on the degree of copper and iron extraction into the leach solution was studied in the wide range of values. The following conditions were suggested as the optimal for the high-temperature pressure leaching: t = 190 °C, PO2 = 0.5 MPa, CH2SO4 = 15 g/L, L:S = 6:1. At the mentioned parameters, it is possible to extract at least 98% Cu from concentrate into the leaching solution during 100 minutes. The following conditions were suggested as optimal for the low-temperature pressure leaching: t = 105 °C, PO2 = 1.3-1.5 MPa, CH2SO4 = 90 g/L, L:S = 10:1. At the mentioned parameters, it is possible to extract up to 83% Cu from the concentrate into the leach solution during 300-360 minutes.

  15. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Haiyan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Peng, Jianke [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Fu, Li, E-mail: fuli@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Wang, Xincheng [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Xie, Yan [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China)

    2016-04-15

    Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  16. Effects of soldering methods on tensile strength of a gold-palladium metal ceramic alloy.

    Science.gov (United States)

    Ghadhanfari, Husain A; Khajah, Hasan M; Monaco, Edward A; Kim, Hyeongil

    2014-10-01

    The tensile strength obtained by conventional postceramic application soldering and laser postceramic welding may require more energy than microwave postceramic soldering, which could provide similar tensile strength values. The purpose of the study was to compare the tensile strength obtained by microwave postceramic soldering, conventional postceramic soldering, and laser postceramic welding. A gold-palladium metal ceramic alloy and gold-based solder were used in this study. Twenty-seven wax specimens were cast in gold-palladium noble metal and divided into 4 groups: laser welding with a specific postfiller noble metal, microwave soldering with a postceramic solder, conventional soldering with the same postceramic solder used in the microwave soldering group, and a nonsectioned control group. All the specimens were heat treated to simulate a normal porcelain sintering sequence. An Instron Universal Testing Machine was used to measure the tensile strength for the 4 groups. The means were analyzed statistically with 1-way ANOVA. The surface and fracture sites of the specimens were subjectively evaluated for fracture type and porosities by using a scanning electron microscope. The mean (standard deviation) ultimate tensile strength values were as follows: nonsectioned control 818 ±30 MPa, microwave 516 ±34 MPa, conventional 454 ±37 MPa, and laser weld 191 ±39 MPa. A 1-way ANOVA showed a significant difference in ultimate tensile strength among the groups (F3,23=334.5; Ptensile strength for gold and palladium noble metals than either conventional soldering or laser welding. Conventional soldering resulted in a higher tensile strength than laser welding. Under the experimental conditions described, either microwave or conventional postceramic soldering would appear to satisfy clinical requirements related to tensile strength. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

  17. Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

    Science.gov (United States)

    Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

    2017-10-01

    Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

  18. Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

    Science.gov (United States)

    Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

    2004-04-01

    Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

  19. Study on Mitigation Method of Solder Corrosion for Crystalline Silicon Photovoltaic Modules

    Directory of Open Access Journals (Sweden)

    Ju-Hee Kim

    2014-01-01

    Full Text Available The corrosion of 62Sn36Pb2Ag solder connections poses serious difficulties for outdoor-exposed photovoltaic (PV modules, as connection degradation contributes to the increase in series resistance (RS of PV modules. In this study, we investigated a corrosion mitigation method based on the corrosion mechanism. The effect of added sacrificial metal on the reliability of PV modules was evaluated using the oxidation-reduction (redox reaction under damp heat (DH conditions. Experimental results after exposure to DH show that the main reason for the decrease in power was a drop in the module’s fill factor. This drop was attributed to the increase of RS. The drop in output power of the PV module without added sacrificial metal is greater than that of the sample with sacrificial metal. Electroluminescence and current-voltage mapping analysis also show that the PV module with sacrificial metal experienced less degradation than the sample without sacrificial metal.

  20. The metallurgical approach on the solder voids behaviour in surface mount devices

    International Nuclear Information System (INIS)

    Mohabattul Zaman Bukhari

    1996-01-01

    Solder voids are believed to cause poor heat dissiption in the Surface Mount devices and reduce the reliability of the devices at higher operating services. There are a lot of factors involved in creating voids such as gas/flux entrapment, wettability, outgasseous, air bubbles in the solder paste, inconsistency of solder coverage and improper metal scheme selection. This study was done to observe the behaviour of the solder voids in term of flux entrapmentt and wettability. It is believed that flux entrapment and wettability are verify this hypothesis. Two types of metal scheme were chosen which are Nickel (Ni) plated and Tin (Sn) plated heatsink. X-ray techniques such as Radiographic Inspection Analysis and EDAX were used to detect the minute solder voids. The solder voids observed on the heatsinks and Copper shims after the reflow process are believed to be a non contact voids that resulted from some portion of the surface not wetting properly

  1. Interfacial reaction of Sn-based solder joint in the package system

    Science.gov (United States)

    Gu, Huandi

    In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

  2. A new method for soldering particle-reinforced aluminum metal matrix composites

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Jinbin; Mu, Yunchao [Zhongyuan University of Technology, Zhengzhou 450007 (China); Luo, Xiangwei [Zhengzhou University, Zhengzhou 450002 (China); Niu, Jitai, E-mail: niujitai@163.com [Zhongyuan University of Technology, Zhengzhou 450007 (China)

    2012-12-01

    Highlights: Black-Right-Pointing-Pointer Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. Black-Right-Pointing-Pointer The nickel plating is required on the surface of the composites before soldering. Black-Right-Pointing-Pointer Low welding temperature is set to avoid overheating of the matrix. Black-Right-Pointing-Pointer Chemical and metallurgical bonding of composites and Kovar is carried out. Black-Right-Pointing-Pointer High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al-SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe-Ni-Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn-Cd-Ag-Cu) with a melting point of about 400 Degree-Sign C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)-Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al-SiC composite.

  3. A new method for soldering particle-reinforced aluminum metal matrix composites

    International Nuclear Information System (INIS)

    Lu, Jinbin; Mu, Yunchao; Luo, Xiangwei; Niu, Jitai

    2012-01-01

    Highlights: ► Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. ► The nickel plating is required on the surface of the composites before soldering. ► Low welding temperature is set to avoid overheating of the matrix. ► Chemical and metallurgical bonding of composites and Kovar is carried out. ► High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al–SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe–Ni–Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn–Cd–Ag–Cu) with a melting point of about 400 °C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)–Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al–SiC composite.

  4. Laser tissue welding mediated with a protein solder

    Science.gov (United States)

    Small, Ward, IV; Heredia, Nicholas J.; Celliers, Peter M.; Da Silva, Luiz B.; Eder, David C.; Glinsky, Michael E.; London, Richard A.; Maitland, Duncan J.; Matthews, Dennis L.; Soltz, Barbara A.

    1996-05-01

    A study of laser tissue welding mediated with an indocyanine green dye-enhanced protein solder was performed. Freshly obtained sections of porcine artery were used for the experiments. Sample arterial wall thickness ranged from two to three millimeters. Incisions approximately four millimeters in length were treated using an 805 nanometer continuous- wave diode laser coupled to a one millimeter diameter fiber. Controlled parameters included the power delivered by the laser, the duration of the welding process, and the concentration of dye in the solder. A two-color infrared detection system was constructed to monitor the surface temperatures achieved at the weld site. Burst pressure measurements were made to quantify the strengths of the welds immediately following completion of the welding procedure.

  5. Quality Analysis of Welded and Soldered Joints of Cu-Nb Microcomposite Wires

    Directory of Open Access Journals (Sweden)

    Nikolaj VIŠNIAKOV

    2011-03-01

    Full Text Available Quality analysis of welded and soldered joints of Cu-Nb microcomposite wires has been performed. Quality and mechanical characteristics of joints as ultimate tensile stress limit and elongation at break were measured with an universal testing machine and controlled visually using an optical microscope. Two wires joints were soldered with silver and copper solders and put into steel and copper sleeve respectively. Another two wires joints were soldered with silver solder and welded without any reinforcement. Joints soldered with the silver solder and steel sleeve have demonstrated the best mechanical characteristics: ultimate tensile stress limit of 650 MPa and elongation at break of 0.85 %. Joints soldered with the copper sleeve have no advantages comparing with the soldered butt joint. Ultimate tensile stress limit and elongation at break were in 300 MPa - 350 MPa and in 0.35 % - 0.45 % ranges respectively. Two welded joints had ultimate tensile stress limit of 470 MPa and elongation at break of 0.71 %. In all joints the microstructure of Nb filaments was destroyed and mechanical properties have been specified by mechanical strength of copper and sleeve materials only.http://dx.doi.org/10.5755/j01.ms.17.1.242

  6. Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Kita, T; Mukaibo, N; Ando, K; Moriyama, M [Honda R and D Co. Ltd., Tokyo (Japan)

    1997-10-01

    Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

  7. The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

    Science.gov (United States)

    Mayappan, R.; Salleh, A.; Andas, J.

    2017-09-01

    Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

  8. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Directory of Open Access Journals (Sweden)

    Saliza Azlina O.

    2016-01-01

    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  9. Scalable Manufacturing of Solderable and Stretchable Physiologic Sensing Systems.

    Science.gov (United States)

    Kim, Yun-Soung; Lu, Jesse; Shih, Benjamin; Gharibans, Armen; Zou, Zhanan; Matsuno, Kristen; Aguilera, Roman; Han, Yoonjae; Meek, Ann; Xiao, Jianliang; Tolley, Michael T; Coleman, Todd P

    2017-10-01

    Methods for microfabrication of solderable and stretchable sensing systems (S4s) and a scaled production of adhesive-integrated active S4s for health monitoring are presented. S4s' excellent solderability is achieved by the sputter-deposited nickel-vanadium and gold pad metal layers and copper interconnection. The donor substrate, which is modified with "PI islands" to become selectively adhesive for the S4s, allows the heterogeneous devices to be integrated with large-area adhesives for packaging. The feasibility for S4-based health monitoring is demonstrated by developing an S4 integrated with a strain gauge and an onboard optical indication circuit. Owing to S4s' compatibility with the standard printed circuit board assembly processes, a variety of commercially available surface mount chip components, such as the wafer level chip scale packages, chip resistors, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating the versatile and modular nature of S4s. Tegaderm-integrated S4 respiration sensors are tested for robustness for cyclic deformation, maximum stretchability, durability, and biocompatibility for multiday wear time. The results of the tests and demonstration of the respiration sensing indicate that the adhesive-integrated S4s can provide end users a way for unobtrusive health monitoring. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  10. NEXT GENERATION LEACHING TESTS FOR EVALUATING LEACHING OF INORGANIC CONSTITUENTS

    Science.gov (United States)

    In the U.S. as in other countries, there is increased interest in using industrial by-products as alternative or secondary materials, helping to conserve virgin or raw materials. The LEAF and associated test methods are being used to develop the source term for leaching or any i...

  11. Research Activities at IPT, DTU on Resistance Projection Welding

    DEFF Research Database (Denmark)

    Bay, Niels

    2000-01-01

    Resistance welding processes and among these especially the resistance projection welding is considered an industrially strategic process with increasing applications as alternative to other welding processes, soldering, brazing and mechanical assembling. This is due to increasing requirements...... as regards quality assurance and the special possibilities of joining complex metal combinations and geometries using resistance projection welding....

  12. In Situ Monitoring of Pb2+ Leaching from the Galvanic Joint Surface in a Prepared Chlorinated Drinking Water.

    Science.gov (United States)

    Ma, Xiangmeng; Armas, Stephanie M; Soliman, Mikhael; Lytle, Darren A; Chumbimuni-Torres, Karin; Tetard, Laurene; Lee, Woo Hyoung

    2018-02-20

    A novel method using a micro-ion-selective electrode (micro-ISE) technique was developed for in situ lead monitoring at the water-metal interface of a brass-leaded solder galvanic joint in a prepared chlorinated drinking water environment. The developed lead micro-ISE (100 μm tip diameter) showed excellent performance toward soluble lead (Pb 2+ ) with sensitivity of 22.2 ± 0.5 mV decade -1 and limit of detection (LOD) of 1.22 × 10 -6 M (0.25 mg L -1 ). The response time was less than 10 s with a working pH range of 2.0-7.0. Using the lead micro-ISE, lead concentration microprofiles were measured from the bulk to the metal surface (within 50 μm) over time. Combined with two-dimensional (2D) pH mapping, this work clearly demonstrated that Pb 2+ ions build-up across the lead anode surface was substantial, nonuniform, and dependent on local surface pH. A large pH gradient (ΔpH = 6.0) developed across the brass and leaded-tin solder joint coupon. Local pH decreases were observed above the leaded solder to a pH as low as 4.0, indicating it was anodic relative to the brass. The low pH above the leaded solder supported elevated lead levels where even small local pH differences of 0.6 units (ΔpH = 0.6) resulted in about four times higher surface lead concentrations (42.9 vs 11.6 mg L -1 ) and 5 times higher fluxes (18.5 × 10 -6 vs 3.5 × 10 -6 mg cm -2 s -1 ). Continuous surface lead leaching monitoring was also conducted for 16 h.

  13. Effect of uniaxially pressing ordinary Portland cement pastes containing metal hydroxides on porosity, density, and leaching

    International Nuclear Information System (INIS)

    Cheeseman, C.R.; Asavapisit, S.; Knight, J.

    1998-01-01

    Synthetic metal hydroxide wastes containing Zn and Pb have been mixed with partially hydrated cement and uniaxially pressed. The effect on porosity, pore size distribution, and bulk and skeletal densities has been characterized using mercury intrusion porosimetry. Ca(OH) 2 formation has been determined using differential thermal analysis and metal leaching has been assessed in a series of static leach tests completed on monolithic samples. Pressed solidified materials have increased density, reduced porosity, and reduced Ca(OH) 2 . They exhibit increased resistance to acid attack in terms of sample weight loss during leaching due to reduced release of alkalis. Leaching of Zn and Pb is primarily determined by pH. A peak observed in Zn leaching from pressed samples is due to the effect of changing leachate pH on the dominant Zn species present

  14. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-11-25

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

  15. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    International Nuclear Information System (INIS)

    Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-01-01

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

  16. Implementation of the Leaching Environmental Assessment Framework

    Science.gov (United States)

    New leaching tests are available in the U.S. for developing more accurate source terms for use in fate and transport models. For beneficial use or disposal, the use of the leaching environmental assessment framework (LEAF) will provide leaching results that reflect field condit...

  17. Standard leach tests for nuclear waste materials

    International Nuclear Information System (INIS)

    Strachan, D.M.; Barnes, B.O.; Turcotte, R.P.

    1980-01-01

    Five leach tests were conducted to study time-dependent leaching of waste forms (glass). The first four tests include temperature as a variable and the use of three standard leachants. Three of the tests are static and two are dynamic (flow). This paper discusses the waste-form leach tests and presents some representative data. 4 figures

  18. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

  19. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    Science.gov (United States)

    Sorg, Brian S.; Welch, Ashley J.

    2001-05-01

    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  20. Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Andersson, D.; Hoo, N.; Pearce, J.; Watson, A.; Dinsdale, A.; Mucklejohn, S.

    2012-01-01

    Roč. 21, č. 5 (2012), s. 629-637 ISSN 1059-9495 Institutional support: RVO:68081723 Keywords : lead-free soldering, * materials for high-temperature LF * new technologies for HT lead-free soldering Subject RIV: BJ - Thermodynamics Impact factor: 0.915, year: 2012

  1. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    Science.gov (United States)

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

    2015-08-01

    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

  2. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

    Science.gov (United States)

    Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

    2017-08-01

    Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

  3. Reliability and microstructure of lead-free solder joints in industrial electronics after accelerated thermal aging

    NARCIS (Netherlands)

    Scaltro, F.; Biglari, M.H.; Kodentsov, A.; Yakovleva, O.; Brom, E.

    2009-01-01

    The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface component/solder together with the formation of fractures. The evolution, the morphology and the elemental

  4. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    DEFF Research Database (Denmark)

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

    2017-01-01

    with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  5. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    International Nuclear Information System (INIS)

    Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

    2010-01-01

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  6. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

    2010-02-18

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  7. Polarization and EIS studies to evaluate the effect of aluminum concentration on the corrosion behavior of SAC105 solder alloy

    Directory of Open Access Journals (Sweden)

    Liyana N. K.

    2018-03-01

    Full Text Available This paper presents an investigation on corrosion behavior of Sn-1.0Ag-0.5Cu-XAl (X = 0, 0.1, 0.5, 1.0 by means of polarization and electrochemical impedance spectroscopy (EIS measurements in 3.5 wt.% NaCl solution. The results show that addition of aluminum into SAC105 shifts the corrosion current density and passivation current density towards more positive values. It is also found that with an increase in aluminum concentration in SAC105 solder alloy, the corrosion current density increases and polarization resistance decreases. This suggests that SAC105 with the highest concentration of Al has the lowest corrosion resistance. In this case, the corrosion behavior seems to be attributed to anodic dissolution of aluminum and Sn-matrix.

  8. Measurement of leach rates: a review

    International Nuclear Information System (INIS)

    Mendel, J.E.

    1982-01-01

    A historical perspective of the techniques that can be used to measure the leach rate of radioactive waste forms is presented. The achievement of leach rates that are as low as possible has been an important goal ever since the development of solidification processes for liquid radioactive wastes began in the 1950's. Leach tests can be divided into two major categories, dynamic and static, based on whether or not the leachant in contact with the test specimen is changed during the course of the test. Both types of tests have been used extensively. The results of leach tests can be used to compare waste forms, and that has been a major purpose of leach data heretofore; increasingly, however, the data now are needed for predicting long-term leaching behavior during geologic disposal. This requirement is introducing new complexities into leach testing methodology. 3 figures, 2 tables

  9. An Approach for Impression Creep of Lead Free Microelectronic Solders

    Science.gov (United States)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  10. Transected sciatic nerve repair by diode laser protein soldering.

    Science.gov (United States)

    Fekrazad, Reza; Mortezai, Omid; Pedram, MirSepehr; Kalhori, Katayoun Am; Joharchi, Khojasteh; Mansoori, Korosh; Ebrahimi, Roja; Mashhadiabbas, Fatemeh

    2017-08-01

    Despite advances in microsurgical techniques, repair of peripheral nerve injuries (PNI) is still a major challenge in regenerative medicine. The standard treatment for PNI includes suturing and anasthomosis of the transected nerve. The objective of this study was to compare neurorraphy (nerve repair) using standard suturingto diode laser protein soldering on the functional recovery of transected sciatic nerves. Thirty adult male Fischer-344 Wistar rats were randomly assigned to 3 groups: 1. The control group, no repair, 2. the standard of care suture group, and 3. The laser/protein solder group. For all three groups, the sciatic nerve was transected and the repair was done immediately. For the suture repair group, 10.0 prolene suture was used and for the laser/protein solder group a diode laser (500mW output power) in combination with bovine serum albumen and indocyanine green dye was used. Behavioral assessment by sciatic functional index was done on all rats biweekly. At 12weeks post-surgery, EMG recordings were done on all the rats and the rats were euthanized for histological evaluation of the sciatic nerves. The one-way ANOVA test was used for statistical analysis. The average time required to perform the surgery was significantly shorter for the laser-assisted nerve repair group compared to the suture group. The EMG evaluation revealed no difference between the two groups. Based on the sciatic function index the laser group was significantly better than the suture group after 12weeks (pneurorraphy using standard suturing methods. Copyright © 2017 Elsevier B.V. All rights reserved.

  11. Trend towards reverse leach process

    International Nuclear Information System (INIS)

    Anon.

    1975-01-01

    The South African gold mining industry is making notable strides in improving recovery methods for both gold and uranium with significant additions to profits because of higher efficiencies and reductions in costs in the recovery processes. The most notable step on the gold side recently is the adoption of the reverse leach process at Buffelsfontein and Western Deep Levels. This process was pioneered at Hartebeesfontein as far back as 1975 and when introduced there resulted in a two and a half per cent improvement in recovery efficiencies. The essence of reverse leaching under which the uranium is recovered before the gold is the fact that the gold partly coated with iron oxide or locked in uranite, is exposed to be recovered later by cyanidation

  12. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  13. Pressure brazing of ceramics to metals with copper solder

    International Nuclear Information System (INIS)

    Pavlova, M.A.; Metelkin, I.I.

    1986-01-01

    The effect on the quality of joints brazed with copper of different non metallized aluminooxide dielectrics with metals and alloys of a series of technological parameters (temperature, pressure, holding, and medium) in the course of pressure brazing is investigated. It is shown that in case of brazing with kovar and nickel the character of dependences is identical, however in all cases the joints with nickel are more durable. For the ceramics - molybdenum system characterized by weak interaction with copper solder kinetic dependences have no maximum and only under holding of more than 20 min the constant strength of 150-190 MPa is attained

  14. Uranium leaching by fungal metabolite

    International Nuclear Information System (INIS)

    Wang Yongdong; Li Guangyue; Ding Dexin; Hu Nan

    2012-01-01

    To explore new means of bioleaching, one strain of high-yielding fungi-Aspergillus niger which could produce organic acids was separated and purified from soil samples of uranium mine. The influence of cultural temperature, initial pH value, inoculum sizes on its growth characteristics were carried out. And the tests of uranium leaching of metabolin of Aspergillus niger were operated. On these tests, the effects of metabolin of Aspergillus niger with different pH value produced in the diverse culture temperature on uranium leaching were investigated. The results show that this strain of Aspergillus niger can grow best under the following conditions: the temperature is 37℃, the initial pH value is 7.0, the inoculum sizes is 2% (the OD value of the spores solution is 0.06). The uranium extraction effects relative to the final pH value of the cultures. and the maximum leaching rates is 83.05% when the pH value is 2.3. (authors)

  15. Albumin solder covalently bound to a polymer membrane: New approach to improve binding strength in laser tissue soldering in-vitro.

    Science.gov (United States)

    Hiebl, B; Ascher, L; Luetzow, K; Kratz, K; Gruber, C; Mrowietz, C; Nehring, M E; Lendlein, A; Franke, R-P; Jung, F

    2018-01-01

    Laser tissue soldering (LTS) based on indocyanine green (ICG)-mediated heat-denaturation of proteins might be a promising alternative technique for micro-suturing, but up to now the problem of too weak shear strength of the solder welds in comparison to sutures is not solved. Earlier reports gave promising results showing that solder supported by carrier materials can enhance the cohesive strength of the liquid solder. In these studies, the solder was applied to the carriers by dip coating. Higher reliability of the connection between the solder and the carrier material is expected when the solder is bound covalently to the carrier material. In the present study a poly(ether imide) (PEI) membrane served as carrier material and ICG-supplemented albumin as solder substrate. The latter was covalently coupled to the carrier membrane under physiological conditions to prevent structural protein changes. As laser source a diode continuous-wave laser emitting at 808 nm with intensities between 250 mW and 1500 mW was utilized. The albumin functionalized carrier membrane was placed onto the tunica media of explanted pig thoracic aortae forming an overlapping area of approximately 0.5×0.5 cm2. All tests were performed in a dry state to prevent laser light absorption by water. Infrared spectroscopy, spectro-photometrical determination of the secondary and primary amine groups after acid orange II staining, contact angle measurements, and atomic force microscopy proved the successful functionalization of the PEI membrane with albumin. A laser power of 450 mW LTS could generate a membrane-blood vessel connection which was characterized by a shear strength of 0.08±0.002 MPa, corresponding to 15% of the tensile strength of the native blood vessel. Theoretically, an overlapping zone of 4.1 mm around the entire circumference of the blood vessel could have provided shear strength of the PEI membrane-blood vessel compound identical to the tensile strength of the native

  16. Bacterial leaching of waste uranium materials.

    Science.gov (United States)

    Barbic, F F; Bracilović, D M; Krajincanić, B V; Lucić, J L

    1976-01-01

    The effect of ferrobacteria and thiobacteria on the leaching of waste uranium materials from which 70-80% of uranium was previously leached by classical chemical hydrometallurgical procedure has been investigated. The bacteria used are found in the ore and the mine water of Zletovska River locality, Yugoslavia. Parameters of biological leaching were examined in the laboratory. Leaching conditions were changed with the aim of increasing the amount of uranium leached. The effect of pyrite added to the waste materials before the beginning of leaching has also been examined. Uranium leaching is directly proportional to the composition and number of ferrobacteria and thiobacteria, and increased by almost twice the value obtained from the same starting materials without using bacteria. Increased sulphuric acid concentrations stimulate considerably the rate of leaching. Uranium leaching is increased up to 20% while sulphuric acid consumption is simultaneously decreased by the addition of pyrite. Uranium concentrations in starting waste materials used for leaching were extremely low (0.0278 and 0.372% U) but about 60% recovery of uranium was obtained, with relatively low consumption of sulphuric acid.

  17. Bacterial leaching of waste uranium materials

    International Nuclear Information System (INIS)

    Barbic, F.F.; Bracilovic, D.M.; Krajincanic, B.V.; Lucic, J.L.

    1976-01-01

    The effect of ferrobacteria and thiobacteria on the leaching of waste uranium materials from which 70-80% of uranium was previously leached by classical chemical hydrometallurgical procedure has been investigated. The bacteria used are found in the ore and the mine water of Zletovska River locality, Yugoslavia. Parameters of biological leaching were examined in the laboratory. Leaching conditions were changed with the aim of increasing the amount of uranium leached. The effect of pyrite added to the waste materials before the beginning of leaching has also been examined. Uranium leaching is directly proportional to the composition and number of ferrobacteria and thiobacteria, and increased by almost twice the value obtained from the same starting materials without using bacteria. Increased sulphuric acid concentrations stimulate considerably the rate of leaching. Uranium leaching is increased up to 20% while sulphuric acid consumption is simultaneously decreased by the addition of pyrite. Uranium concentrations in starting waste materials used for leaching were extremely low (0.0278 and 0.0372% U) but about 60% recovery of uranium was obtained, with relatively low consumption of sulphuric acid. (author)

  18. Development of Pb-Free Nanocomposite Solder Alloys

    Directory of Open Access Journals (Sweden)

    Animesh K. Basak

    2018-04-01

    Full Text Available As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1 Al2O3 or (2 Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys.

  19. Impurity Effects in Electroplated-Copper Solder Joints

    Directory of Open Access Journals (Sweden)

    Hsuan Lee

    2018-05-01

    Full Text Available Copper (Cu electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl disulfide (SPS with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

  20. A flip chip process based on electroplated solder bumps

    Science.gov (United States)

    Salonen, J.; Salmi, J.

    1994-01-01

    Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

  1. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

    Science.gov (United States)

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-12-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

  2. Application of percolation leaching in Fuzhou uranium mine

    International Nuclear Information System (INIS)

    Jiang Lang; Wang Haita; He Jiangming

    2006-01-01

    In order to solve these problems such as high cost by conventional agitation leaching, low permeability and low leaching rate by heap leach, a percolation leaching method was developed. Two-year's production results show that leaching rate of uranium is up to 90% by this method. Compared with conventional agitation leaching, the power, sulfuric acid and lime consumption by the percolation leaching decreased by 60%, 27% and 77% respectively. (authors)

  3. Laser-tissue soldering with biodegradable polymer films in vitro: film surface morphology and hydration effects.

    Science.gov (United States)

    Sorg, B S; Welch, A J

    2001-01-01

    Previous research introduced the concept of using biodegradable polymer film reinforcement of a liquid albumin solder for improvement of the tensile strength of repaired incisions in vitro. In this study, the effect of creating small pores in the PLGA films on the weld breaking strength is studied. Additionally, the effect of hydration on the strength of the reinforced welds is investigated. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with an 806-nm CW diode laser. A poly(DL-lactic-co-glycolic acid) (PLGA) film was used to reinforce the solder (the controls had solder but no reinforcement). Breaking strengths were measured acutely and after hydration in saline for 1 and 2 days. The data were analyzed by ANOVA (P < 0.05) and multiple comparisons of means were performed using the Newman-Keuls test. The creation of pores in the PLGA films qualitatively improved the film flexibility without having an apparent adverse effect on the breaking strength, while the actual technique of applying the film and solder had more of an effect. The acute maximum average breaking strengths of some of the film reinforced specimens (114.7 g-134.4 g) were significantly higher (P < 0.05) than the acute maximum average breaking strength of the unreinforced control specimens (68.3 g). Film reinforced specimens were shown to have a statistically significantly higher breaking strength than unreinforced controls after 1- and 2-day hydration. Reinforcement of liquid albumin solders in laser-assisted incision repair appears to have advantages over conventional methods that do not reinforce the cohesive strength of the solder in terms of acute breaking strength and after immersion in moist environments for short periods of time. Using a film with the solder applied to one surface only may be advantageous over other techniques.

  4. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Energy Technology Data Exchange (ETDEWEB)

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

    2013-06-01

    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  5. The structure of leached sodium borosilicate glass

    International Nuclear Information System (INIS)

    Bunker, B.C.; Tallant, D.R.; Headley, T.J.; Turner, G.L.; Kirkpatrick, R.J.

    1988-01-01

    Raman spectroscopy, solid state 29 Si, 11 B, 17 O, and 23 Na nuclear magnetic resonance spectroscopy, and transmission electron microscopy have been used to investigate how the structures of sodium borosilicate glasses change during leaching in water at pH 1, 9, and 12. Results show that the random network structure present prior to leaching is transformed into a network of small condensed ring structures and/or colloidal silica particles. The restructuring of leached glass can be rationalised on the basis of simple hydrolysis (depolymerisation) and condensation (repolymerisation) reactions involving Si-O-Si and Si-O-B bonds. The structural changes that occur during leaching influence the properties of the leached layer, including leaching kinetics, crazing and spalling, and slow crack growth. (author)

  6. The Danish Pesticide Leaching Assessment Programme

    DEFF Research Database (Denmark)

    Rosenbom, Annette Elisabeth; Brüsch, Walter Michael; Juhler, Rene K.

    In 1998, the Danish Parliament initiated the Pesticide Leaching Assessment Programme (PLAP), an intensive monitoring programme aimed at evaluating the leaching risk of pesticides under field conditions. The objective of the PLAP is to improve the scientific foundation for decision......-making in the Danish regulation of pesticides. The specific aim is to analyse whether pesticides applied in accordance with current regulations leach to groundwater in unacceptable concentrations. The programme currently evaluates the leaching risk of 41 pesticides and 40 degradation products at five agricultural......, thiamethoxam, tribenuronmethyl, and triasulfuron) did not leach during the 1999-2009 monitoring period. 13 of the applied pesticides exhibited pronounced leaching of the pesticide and/or their degradation product(-s) 1 m b.g.s. in yearly average concentrations exceeding 0.1 μg/l (maximum allowable...

  7. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Directory of Open Access Journals (Sweden)

    Xiuyun Zhou

    2015-10-01

    Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  8. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

  9. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

  10. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    DEFF Research Database (Denmark)

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

    2009-01-01

    of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

  11. The leaching characteristics of vitrified slag

    International Nuclear Information System (INIS)

    Zhang, Jinlong; Li, Yaojian; Tian, Junguo; Sheng, Hongzhi; Xu, Yongxiang

    2010-01-01

    Full Text: Plasma-arc technology was developed to fix the heavy metal of flying ash by the Institute of Mechanics, Chinese Academy of Sciences (CAS-IMECH). A direct current (DC) experimental facility of 30 kW with plasma-arc technology was setup to form vitrified slag. The additives (CaO, SiO 2 ) were added into the reactor to form vitrified slag and fix the heavy metal (Cr, Pb), under dissimilar condition (long and short heating-up time, natural and water cooling). Vitrified slag was broken into different particle size, from 0.1 mm to 1 cm. The particles with different specific surface area were used to study the leaching of heavy metals in vitrified slag rate of speed. The pH value of leaching solution are from 2 to 12, the experiment was kept at different external temperature, from 4 degree Celsius to 70 degree celsius, for 1 week to 1 month. Heavy metal leaching concentration was used to measure the chemical stability of vitrified slag. The results show that the higher specific surface area, the higher heavy metal leaching concentration, but when the specific surface area reaches a certain value, little change in leaching concentration. The impact of temperature on leaching concentration was not significant, from 4 degree Celsius to 70 degree Celsius. The leaching concentration increases with decreasing of the pH value of leaching solution when the pH value of leaching solution less than 7, and little change in concentration increases with pH value when the pH value of leaching solution more than 7. Compared with the leaching concentration after 1 month, the leaching concentration after 1 week has not changed significantly. (Author)

  12. A New Generation of Leaching Tests – The Leaching Environmental Assessment Framework

    Science.gov (United States)

    Provides an overview of newly released leaching tests that provide a more accurate source term when estimating environmental release of metals and other constituents of potential concern (COPCs). The Leaching Environmental Assessment Framework (LEAF) methods have been (1) develo...

  13. URANIUM LEACHING AND RECOVERY PROCESS

    Science.gov (United States)

    McClaine, L.A.

    1959-08-18

    A process is described for recovering uranium from carbonate leach solutions by precipitating uranium as a mixed oxidation state compound. Uranium is recovered by adding a quadrivalent uranium carbon;te solution to the carbonate solution, adjusting the pH to 13 or greater, and precipitating the uranium as a filterable mixed oxidation state compound. In the event vanadium occurs with the uranium, the vanadium is unaffected by the uranium precipitation step and remains in the carbonate solution. The uranium-free solution is electrolyzed in the cathode compartment of a mercury cathode diaphragm cell to reduce and precipitate the vanadium.

  14. Effect of the leaching of calcium hydroxide from cement paste on mechanical and physical properties

    International Nuclear Information System (INIS)

    Carde, C.; Francois, R.

    1997-01-01

    This paper deals with the effect of the leaching process of cement based materials on their mechanical and physical properties. In order to characterize this effect, the authors have performed experiments on cement paste samples. The leaching process was achieved by the use of a 50% concentrate solution of ammonium nitrate. Both compression tests and water porosity tests were conducted on micro-cylinder samples (10, 12, 14 and 20 mm of diameter) because of the slow kinetics of degradation due to the leaching. The deterioration of the cement paste and the mortar exposed to the action of the ammonium nitrate was manifested by a peripheral zone of less resistance. This process induces mainly a total leaching of Ca(OH) 2 and a progressive decalcification of C-S-H which leads to a gradient of C/S ratio in the leaching zone. Both mechanical tests and water porosity tests show that there is a linear variation of the loss of strength and the increase in porosity in relation to the ratio of degraded area over total area of the sample A d /A t . It means that both compressive resistance and water porosity of the leaching zone are constant whatever the size of the degraded zone and then whatever the time of exposure to the chemical attack. So the authors could venture the hypothesis that the dissolution of calcium hydroxide is the essential parameter governing both decrease in strength and increase in porosity

  15. Uranium extraction history using pressure leaching

    International Nuclear Information System (INIS)

    Fraser, K.S.; Thomas, K.G.

    2010-01-01

    Over the past 60 years of uranium process development only a few commercial uranium plants have adopted a pressure leaching process in their flowsheet. The selection of acid versus alkaline pressure leaching is related to the uranium and gangue mineralogy. Tetravalent (U"+"4) uranium has to be oxidized to hexavalent (U"+"6) uranium to be soluble. Refractory tetravalent uranium requires higher temperature and pressure, as practised in pressure leaching, for conversation to soluble hexavalent uranium. This paper chronicles the history of these uranium pressure leaching facilities over the past 60 years, with specific details of each design and operation. (author)

  16. A new Leaching System, Sheta Extractor

    International Nuclear Information System (INIS)

    Sheta, M.E.

    2008-01-01

    Moving of crushed solid ores against leaching solution in a continuous countercurrent arises a true technical problem. This invented system introduces a practical solution for such problem. Inside the system, the crushed ore is driving against gravity, whereas the leaching solution moves in the opposite direction. Contact between the two phases occurs with gentle stirring. After contact, discharging of the processed phases takes place automatically out the system. The system was investigated for uranium leaching from a coarse grained fraction (+2 --- -- -30 mm) of uranium mineralized granite sample. Uranium leaching percent reached to nearly 50% using sulfuric acid

  17. Heap leaching procedure for the Uranium extraction

    International Nuclear Information System (INIS)

    Shishahbore, M. R.

    2002-01-01

    Heap leaching of Uranium ores is currently in use in several countries. Before taking any decision for construction of heap in industrial scale, it is necessary to obtain the main factors that influence the heap leaching process, such as acid construction, acid solution flowrate, temperature of reaction, or size, ration of liquid to solid, permeability and suitable oxidant. To achieve the above parameters, small scale column leaching is usually recommended. In this project column leaching were carried out in 6 plexiglass column with 43.5 cm an height and 7.4 cm inner diameter. In each column closely 2.00 kg Uranium ore were leached by sulfuric acid. Leaching operation on Iranian ores from two different anomalies from the same area were investigated. In this project, six column were leached at different flowrate of eluent and effect of oxidant were investigated. Acid consumption were in the range of 60 - 144 kg per ton ore and recovery between 73.07% - 99.97%. Finally according to the results obtained, investigated that over are suitable to heap leaching technique. Al tough, to enforce of heap leaching project need to more experiments

  18. Method of continuous pressure leaching of ores

    International Nuclear Information System (INIS)

    Fiala, P.; Baloun, S.; Polansky, M.

    1987-01-01

    Ore leaching, especially suspensions of ground ore or fine ore fractions from physical treatment was divided into two operations. The former, i.e., ore mixing with technical grade concentrated sulfuric acid proceeded in a separate mixer. The mixture was then transported into an autoclave where the actual leaching proceeded for 2 to 4 hours. The extracted mixture was discharged through the autoclave bottom. The leaching autoclave used can be without any inner structures. The separation of mixing from the actual leaching allows processing ores with high levels of clay components, increasing operating reliability of the facility, reducing consumption of special structural materials and energy, and increasing process efficiency. (E.S.)

  19. Mass spectrographic analysis of selected chemical elements by microbial leaching of zircon

    International Nuclear Information System (INIS)

    Becker, S.; Dietze, H.J.; Bullmann, M.; Iske, U.

    1986-01-01

    Spark source mass spectrometry is a useful method for chemical element analysis of geological and biological samples. This sensitive technique (detection limit down to the ppb-range) is used to analyze leaching processes by means of several microorganisms. The problem of microbial leaching of chemical resistent materials was tested under laboratory conditions with regard to possible analytical and technical applications. Leaching of metals with chemolithotrophic and heterotrophic, organic acids producing microorganisms has been investigated with zircon from the Baltic Shield containing 0.7% rare earth elements and 1.67% hafnium. When zircon is leached with strains of thiobacillus ferrooxidans about 80% of the rare earth elements, Hf, Th and U can be recovered. (orig.) [de

  20. Investigations on microbial leaching of zircon by means of spark source mass spectrometry

    International Nuclear Information System (INIS)

    Becker, S.; Dietze, H.J.; Bullmann, M.; Iske, U.

    1985-01-01

    Spark source mass spectrometry is a useful method for chemical element analysis of geological and biological samples. This sensitive technique (detection limit down to the ppb-range) is used to analyze leaching processes by means of several microorganisms. The problem of microbial leaching of chemical resistent materials was tested under laboratory condition with regard to possible analytical and technical applications. Leaching of metalls with chemolithotrophic and heterotrophic, organic acids producing microorganisms has been investigated with zircon from Baltic Shield containing 0.7% rare earth elements and 1.67% hafnium. When zircon is leached with strains of Thiobacillus ferroxidans the rare earth elements, Hf, Th, and U mostly (about 80%) can be recovered. (author)

  1. Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu

    Science.gov (United States)

    Lee, Hwa-Teng; Huang, Kuo-Chen

    2016-12-01

    Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

  2. A review on solder reflow and flux application for flip chip

    Science.gov (United States)

    Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Visvanathan, Susthitha Menon; Retnasamy, Vithyacharan

    2017-09-01

    This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

  3. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    Science.gov (United States)

    Rolin, T. D.; Hodge, R. E.

    2008-01-01

    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  4. Laser welding of vas deferens in rodents: initial experience with fluid solders.

    Science.gov (United States)

    Trickett, R I; Wang, D; Maitz, P; Lanzetta, M; Owen, E R

    1998-01-01

    This study evaluates the use of sutureless laser welding for vasovasostomy. In 14 rodents, the left vas deferens underwent vasovasostomy using an albumin-based solder applied to the adventitia of the vas deferens. The solder contained the dye, indocyanine green, to allow selective absorption and denaturation by a fiber-coupled 800-nm diode laser. The right vas deferens served as a control, receiving conventional layered microsurgical repair. We used a removable 4/0 nylon stent and microclamps to appose the vas deferens during repair, with no need for stay sutures. The mean time to perform laser solder repair (23.5 min) and conventional repair (23.3 min) were not significantly different (P=0.91). However, examination after 8 weeks showed that granuloma formation (G) and patency (P) rates for the conventional suture technique (G, 14%; P, 93%) were significantly better than observed for the laser solder technique (G, 57%; P, 50%).

  5. Effects of rework on adhesion of Pb-In soldered gold thick films

    International Nuclear Information System (INIS)

    Gehman, R.W.; Becka, G.A.; Losure, J.A.

    1982-02-01

    The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au 9 In 4 . It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing

  6. Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

    Science.gov (United States)

    Hasnine, M.; Tolla, B.; Vahora, N.

    2018-04-01

    This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

  7. A wireless intraocular pressure monitoring device with a solder-filled microchannel antenna

    International Nuclear Information System (INIS)

    Varel, Çağdaş; Shih, Yi-Chun; Otis, Brian P; Böhringer, Karl F; Shen, Tueng S

    2014-01-01

    This paper presents the prototype of an intraocular pressure sensor as a major step toward building a device that can be permanently implanted during cataract surgery. The implantation will proceed through an incision of 2–3 mm using an injector, during which the complete device must be folded into a cross-section of 2 mm × 1 mm. The device uses radio frequency (RF) for wireless power and data transfer. The prototype includes an antenna, an RF chip and a pressure sensor assembled on a printed circuit board with several circuit components used for testing and calibration. The antenna is fabricated and integrated with the circuit using a fabrication method employing solder-filled microchannels embedded in an elastomer. The monitoring device is powered at 2.716 GHz from a distance of 1–2 cm. The prototype has undergone electrical and mechanical tests for antenna and sensor performance. The flexible antenna can withstand a stress of 33.4 kPa without any electrical disconnection. It did not show a significant increase in electrical resistance after 50 bending cycles with a maximum applied stress of 116 kPa. Transmitted pressure data shows an averaged sensitivity of 16.66 Hz (mm-Hg) –1 . (paper)

  8. Joining technologies for the 1990s: Welding, brazing, soldering, mechanical, explosive, solid-state, adhesive

    Science.gov (United States)

    Buckley, John D. (Editor); Stein, Bland A. (Editor)

    1986-01-01

    A compilation of papers presented in a joint NASA, American Society for Metals, The George Washington University, American Welding Society, and Society of Manufacturing Engineers Conference on Welding, Bonding, and Fastening at Langley Research Center, Hampton, VA, on October 23 to 25, 1984 is given. Papers were presented on technology developed in current research programs relevant to welding, bonding, and fastening of structural materials required in fabricating structures and mechanical systems used in the aerospace, hydrospace, and automotive industries. Topics covered in the conference included equipment, hardware and materials used when welding, brazing, and soldering, mechanical fastening, explosive welding, use of unique selected joining techniques, adhesives bonding, and nondestructive evaluation. A concept of the factory of the future was presented, followed by advanced welding techniques, automated equipment for welding, welding in a cryogenic atmosphere, blind fastening, stress corrosion resistant fasteners, fastening equipment, explosive welding of different configurations and materials, solid-state bonding, electron beam welding, new adhesives, effects of cryogenics on adhesives, and new techniques and equipment for adhesive bonding.

  9. Inductive Soldering of the Junctions of the Main Superconducting Busbars of the LHC

    CERN Document Server

    Jacquemod, A; Schauf, F; Skoczen, Blazej; Tock, J P

    2004-01-01

    The Large Hadron Collider (LHC) is the next world-facility for the high energy physics community, presently under construction at CERN, Geneva. The LHC will bring into collisions intense beams of protons and ions. The main components of the LHC are the twin-aperture high-field superconducting cryomagnets that will be installed in the existing 26.7-km long tunnel. They are powered in series by superconducting Nb-Ti cables. Along the machine, about 60 000 joints between superconducting cables must be realised in-situ during the installation. Ten thousands of them, rated at 13 000 A, are involved in the powering scheme of the main dipoles and quadrupoles. To meet the requirements of the cryogenic budget, an electrical resistance at operating temperature (1.9 K) lower than 0.6 nW has to be achieved. The induction soldering technology was selected for this purpose. After a brief introduction to the LHC project, the constraints and requirements are listed. Then, the applied solution is detailed. The splices of the ...

  10. Processing and characterization of device solder interconnection and module attachment for power electronics modules

    Science.gov (United States)

    Haque, Shatil

    This research is focused on the processing of an innovative three-dimensional packaging architecture for power electronics building blocks with soldered device interconnections and subsequent characterization of the module's critical interfaces. A low-cost approach termed metal posts interconnected parallel plate structure (MPIPPS) was developed for packaging high-performance modules of power electronics building blocks (PEBB). The new concept implemented direct bonding of copper posts, not wire bonding of fine aluminum wires, to interconnect power devices as well as joining the different circuit planes together. We have demonstrated the feasibility of this packaging approach by constructing PEBB modules (consisting of Insulated Gate Bipolar Transistors (IGBTs), diodes, and a few gate driver elements and passive components). In the 1st phase of module fabrication with IGBTs with Si3N 4 passivation, we had successfully fabricated packaged devices and modules using the MPIPPS technique. These modules were tested electrically and thermally, and they operated at pulse-switch and high power stages up to 6kW. However, in the 2nd phase of module fabrication with polyimide passivated devices, we experienced significant yield problems due to metallization difficulties of these devices. The under-bump metallurgy scheme for the development of a solderable interface involved sputtering of Ti-Ni-Cu and Cr-Cu, and an electroless deposition of Zn-Ni-Au metallization. The metallization process produced excellent yield in the case of Si3N4 passivated devices. However, under the same metallization schemes, devices with a polyimide passivation exhibited inconsistent electrical contact resistance. We found that organic contaminants such as hydrocarbons remain in the form of thin monolayers on the surface, even in the case of as-received devices from the manufacturer. Moreover, in the case of polyimide passivated devices, plasma cleaning introduced a few carbon constituents on the

  11. The creep behavior of In-Ag eutectic solder joints

    International Nuclear Information System (INIS)

    Reynolds, H.L.; Kang, S.H.; Morris, J.W. Jr.; Univ. of California, Berkeley, CA

    1999-01-01

    The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90 C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the In-rich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems

  12. Nanoconstruction by welding individual metallic nanowires together using nanoscale solder

    International Nuclear Information System (INIS)

    Peng, Y; Inkson, B J; Cullis, A G

    2010-01-01

    This work presents a new bottom-up nanowelding technique enabling building blocks to be assembled and welded together into complex 3D nanostructures using nanovolumes of metal solder. The building blocks of gold nanowires, (Co 72 Pt 28 /Pt) n multilayer nanowires, and nanosolder Sn 99 Au 1 alloy nanowires were successfully fabricated by a template technique. Individual metallic nanowires were picked up and assembled together. Conductive nanocircuits were then welded together using similar or dissimilar nanosolder material. At the weld sites, nanoscale volumes of a chosen metal are deposited using nanosolder of a sacrificial nanowire, which ensures that the nanoobjects to be bonded retain their structural integrity. The whole nanowelding process is clean, controllable and reliable, and ensures both mechanically strong and electrically conductive contacts.

  13. Soldered Contact and Current Risetime Effects on Negative Polarity Wire Array Z-pinches

    International Nuclear Information System (INIS)

    Chalenski, D. A.; Kusse, B. R.; Greenly, J. B.; Blesener, I. C.; McBride, R. D.; Hammer, D. A.; Knapp, P. F.

    2009-01-01

    The Cornell University COBRA pulser is a nominal 1 MA machine, capable of driving up to 32 wire cylindrical Z-pinch arrays. COBRA can operate with variable current risetimes ranging from 100 ns to 200 ns (short and long pulse, respectively). Wires are typically strung with a ''press'' contact to the electrode hardware, where the wire is loosely pulled against the hardware and held there to establish electrical contact. The machine is normally negative, but a bolt-on convolute can be used to modify the current path and effectively produce positive polarity operation at the load.Previous research with single wires on a 1-5 kA pulser has shown that soldering the wire, thereby improving the wire/electrode contact, and operating in positive polarity can improve the energy deposition into the wire and enhance wire core expansion. Negative polarity showed no difference. Previous experiments on the negative polarity, 20 MA, 100 ns Z accelerator have shown that improving the contact improved the x-ray yield.Cornell data were collected on 16-wire Aluminum Z-pinch arrays in negative polarity. Experiments were conducted with both short and long current pulses with soldered and no-soldered wire/electrode contacts. The initiation, ablation, implosion and stagnation phases were compared for these four conditions. Time dependent x-ray signals were measured using diodes and diamond detectors. An inductive voltage monitor was used to infer minimum current radius achieved, as defined by a uniform shell of current moving radially inward, producing a time dependent inductance. Total energy data were collected with a metal-strip bolometer. Self-emission data were collected by an XUV 4-frame camera and an optical streak camera.In negative polarity and with short pulses, soldering appeared to produce a smaller radius pinch and decrease variations in the x-ray pulse shape. The bolometer, laser backlighter, 4-frame and streak cameras showed negligible differences in the initiation ablation

  14. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Directory of Open Access Journals (Sweden)

    Benabou Lahouari

    2014-06-01

    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  15. Investigation into mechanical properties of joints of heterogeneous materials brazed with high-temperature solders

    International Nuclear Information System (INIS)

    Lomenko, V.I.; Merkushev, V.P.; Borodina, L.M.; Sycheva, T.S.; Tokhtina, O.A.; Frolov, N.N.

    1988-01-01

    Mechanical properties of copper joints with copper, 12Kh18M10T steel and KhD50 composite obtained by vacuum brazing by copper-titanium solder as compared with properties of joints brazed by PSr 72 and PMFOTsr 6-4-0.03 solders in hydrogen are studied. Dependences of joints strength on temperature of contact - reactive vacuum brazing are obtained. Possible applications of joints of dissimilar materials in electrovacuum devices subjected to the effect of dynamic loadings are established

  16. Dye-enhanced protein solders and patches in laser-assisted tissue welding.

    Science.gov (United States)

    Small, W; Heredia, N J; Maitland, D J; Da Silva, L B; Matthews, D L

    1997-01-01

    This study examines the use of dye-enhanced protein bonding agents in 805 nm diode laser-assisted tissue welding. A comparison of an albumin liquid solder and collagen solid-matrix patches used to repair arteriotomies in an in vitro porcine model is presented. Extrinsic bonding media in the form of solders and patches have been used to enhance the practice of laser tissue welding. Preferential absorption of the laser wavelength has been achieved by the incorporation of chromophores. Both the solder and the patch included indocyanine green dye (ICG) to absorb the 805 nm continuous-wave diode laser light used to perform the welds. Solder-mediated welds were divided into two groups (high power/short exposure and low power/long exposure), and the patches were divided into three thickness groups ranging from 0.1 to 1.3 mm. The power used to activate the patches was constant, but the exposure time was increased with patch thickness. Burst pressure results indicated that solder-mediated and patched welds yielded similar average burst strengths in most cases, but the patches provided a higher success rate (i.e., more often exceeded 150 mmHg) and were more consistent (i.e., smaller standard deviation) than the solder. The strongest welds were obtained using 1.0-1.3 mm thick patches, while the high power/short exposure solder group was the weakest. Though the solder and patches yielded similar acute weld strengths, the solid-matrix patches facilitated the welding process and provided consistently strong welds. The material properties of the extrinsic agents influenced their performance.

  17. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others

    1995-06-01

    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  18. Study on Leaching of Hexavalent Chromium from Hardened Concretes Using Tank Leaching Test

    OpenAIRE

    Takahashi, Shigeru; Sakai, Etsuo; Sugiyama, Takafumi

    2007-01-01

    Tank leaching tests were carried out to investigate the behavior of leaching trace elements from monolith samples. This study consists of two series, and the trace element used was hexavalent chromium. In Series I, the influence of the leachant/surface area of the specimen (L/S ratio) on the leaching amount was investigated. The leaching amount was found to increase with the amount of worked water. This shows that any L/S ratio can be selected in the tank leaching test. In Series II, th...

  19. Successful trials on pressure leaching of uranium

    International Nuclear Information System (INIS)

    Pendreigh, R.

    1978-01-01

    High pressure leaching can increase uranium extraction from some low grade ores by ten per cent, and Anglo American Corporation's eighteen months of pilot plant tests point the way to commercial application. Interest in pressure leaching of uranium has been renewed with the recent increase in uranium and gold prices and costs of reagents

  20. Optimizing conditions for an accelerated leach test

    International Nuclear Information System (INIS)

    Pietrzak, R.F.; Fuhrmann, M.; Heiser, J.; Franz, E.M.; Colombo, P.

    1988-01-01

    An accelerated leach test for low-level radioactive waste forms is being developed to provide, in a short time, data that can be extrapolated to long time periods. The approach is to provide experimental conditions that will accelerate leaching without changing the dominant release mechanism. Experimental efforts have focused on combining individual factors that have been observed to accelerate leaching. These include elevated temperature, increased leachant volume, and reduced specimen size. The response of diffusion coefficients to various acceleration factors have been evaluated and provide information on experimental parameters that need to be optimized to increase leach rates. Preliminary modeling using a diffusion mechanism (allowing for depletion) of a finite cylinder geometry indicates that during early portions of experiments (daily sampling intervals), leaching is diffusion controlled and more rapid than later in the same experiments (weekly or greater sampling intervals). For cement waste forms, this reduction in rate may be partially controlled by changes in physical structure and chemistry (sometimes related to environmental influences such as CO 2 ), but it is more likely associated with the duration of the sampling interval. By using a combination of mathematical modeling and by experimentally investigating various leach rate controlling factors, a more complete understanding of leaching processes is being developed. This, in turn, is leading to optimized accelerating conditions for a leach test

  1. Optimizing conditions for an accelerated leach test

    International Nuclear Information System (INIS)

    Pietrzak, R.F.; Fuhrmann, M.; Heiser, J.; Franz, E.M.; Colombo, P.

    1988-01-01

    An accelerated leach test for low-level radioactive waste forms is being developed to provide, in a short time, data that can be extrapolated to long time periods. The approach is to provide experimental conditions that will accelerate leaching without changing the dominant release mechanism. Experimental efforts have focused on combining individual factors that have been observed to accelerate leaching. These include elevated temperature, increased leachant volume, and reduced specimen size. The response of diffusion coefficients to various acceleration factors have been evaluated and provide information on experimental parameters that need to be optimized to increase leach rates. For example, these data show that large volumes of leachant are required when leaching portland cement waste forms at elevated temperatures because of high concentrations of dissolved species. Sr-85 leaching is particularly susceptible to suppression due to concentration effects while Cs-137 leaching is less so. Preliminary modeling using a diffusion mechanism (allowing for depletion) of a finite cylinder geometry indicates that during early portions of experiments (daily sampling intervals), leaching is diffusion controlled and more rapid than later in the same experiments (weekly or greater sampling intervals). For cement waste forms, this reduction in rate may be partially controlled by changes in physical structure and chemistry (sometimes related to environmental influences such as CO 2 ), but it is more likely associated with the duration of the sampling interval. 9 refs., 6 figs

  2. PRESERVATIVE LEACHING FROM WEATHERED CCA-TREATED WOOD

    Science.gov (United States)

    Disposal of discarded CCA-treated wood in landfills raises concerns with respect to leaching of preservative compounds. When unweathered CCA-treated wood is leached using the toxicity characteristic leaching procedure (TCLP), arsenic concentrations exceed the toxicity characteris...

  3. Characterization of the microstructure of tin-silver lead free solder

    Energy Technology Data Exchange (ETDEWEB)

    Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

    2016-07-05

    Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

  4. A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

    Science.gov (United States)

    Wei, Helin; Wang, Kuisheng

    2011-11-01

    Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

  5. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    Directory of Open Access Journals (Sweden)

    Enrico Mick

    2015-07-01

    Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

  6. Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

    International Nuclear Information System (INIS)

    Mallik, S.; Ekere, N.N.; Durairaj, R.; Marks, A.E.; Seman, A.

    2009-01-01

    Solder paste is the most important strategic bonding material used in the assembly of surface mount components in electronics manufacturing. As the trend towards miniaturisation of electronic products continues, there is an increasing demand for better understanding of the flow and deformation that is, the rheological behaviour of solder paste formulations. Wall slip plays an important role in characterising the flow behaviour of solder paste materials. The problem of wall slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. In rheological measurements, slip effects can generally be avoided by using roughened surfaces for measuring geometries. In this paper, a novel technique is developed to study the effect of wall slip in the rheological measurements of lead-free solder paste. The viscosity and oscillatory data obtained for three different solder paste samples (from measuring geometries of different surface roughness) have been analysed and compared. In viscosity measurements, slip effects were dominant at low shear rates and the use of serrated surfaces was found to be quite effective in minimizing slip effects. Oscillatory measurements were also affected by roughening the surfaces of measuring geometries.

  7. The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

    Science.gov (United States)

    Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

    2015-12-01

    Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (ptensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

  8. Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

    International Nuclear Information System (INIS)

    Durairaj, R.; Ramesh, S.; Mallik, S.; Seman, A.; Ekere, N.

    2009-01-01

    Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G') is higher than the liquid characteristic (G'') for the pastes material. In addition, the results from the study showed that the solder paste with a large G' = G'' has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (δ) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.

  9. Study on interfacial reaction between lead-free solders and alternative surface finishes

    International Nuclear Information System (INIS)

    Siti Rabiatul Aisha; Ourdjini, A.; Saliza Osman

    2007-01-01

    This study investigates the interfacial reactions occurring during reflow soldering between Sn-Ag-Cu lead-free solder and two surface finishes: electroless nickel/ immersion gold (ENIG) and immersion silver (IAg). The study focuses on interfacial reactions evolution and growth kinetics of intermetallic compounds (IMC) formed during soldering and isothermal ageing at 150 degree Celsius for up to 2000 hours. Optical and scanning electron microscopy were used to measure IMC thickness and examine the morphology of IMC respectively, whereas the IMC phases were identified by energy dispersive X-ray analysis (EDX). The results showed that the IMC formed on ENIG finish is thinner compared to that formed on IAg finish. For IAg surface finish, Cu 6 Sn 5 IMCs with scallop morphology are formed at the solder/ surface finish interface after reflow while a second IMC, Cu 3 Sn was formed between the copper and Cu 6 Sn 5 IMC after the isothermal ageing treatment. For ENIG surface finish both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 are formed after soldering. Isothermal aging of the solder joints formed on ENIG finish was found to have a significant effect on the morphology of the intermetallics by transforming to more spherical and denser morphology in addition to increase i their thickness with increased ageing time. (author)

  10. Comparative shear tests of some low temperature lead-free solder pastes

    Science.gov (United States)

    Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

    2016-12-01

    The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

  11. Investigation on solder joint strength of nickel tin-plated and CRS tabs with PCB

    International Nuclear Information System (INIS)

    Luay Hussain

    2002-01-01

    Failure analysis on easily peels off Nickel and CRS steel tabs from PCB was carried out. Nickel Tin plated tabs, CRS steel tabs and tube were joined to the PCB using reflow/ convection soldering, in an oven. The solder paste composition is Sn36/Pb35/Ag2. Peel test was conducted and it was found that many tabs could be easily peeled off with low force. Porosities which varies from 0.4 mm to < 0.01mm in diameter, developed during soldering process and solidification was noted. It was found, the number, size and position of these porosities inside the solder layer on both parts of the tabs affect the peel strength. Scanning Electron Microscopy study and EDX analysis were carried out. It was found that the low peel strength values were due to the combination of generation and development of porosities during soldering process which act as stress concentrators and the evolution (growth) of eutectic Sn/Pb and Sn/Ni/Cu brittle grainy phase. Large eutectic microstructure with brittle Sn-Ni-Cu grainy phase enhances the failure with low peeling forces. Sample showing no feature of Sn/Ni/Cu grain gave high peeling strength value. Solder reflow, an important process, can result in strength enhancement (if it was controlled for example in a furnace). (Author)

  12. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Lei Sun

    2015-01-01

    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  13. Leaching of heavy metals from steelmaking slags

    International Nuclear Information System (INIS)

    Gomez, J. F. P.; Pino, C. G.

    2006-01-01

    Leaching tests with EAF and Ladle slags were performed, using a flow through tests and the standard batch test DIN 38414-S4. The previous method was used to simulate the leaching behaviour of steel slags under landfill. the chemical analysis of the leachates during this period shows, in general, for both types of slag, and increase of heavy metal releases with ageing. Standard test method DIN 38414-S4 was used to evaluate leachability of heavy metals by water in unprocessed slags. After more than one year of trials, slang samples submitted to these trials presented very low total leaching levels. The most extracted elements are calcium and magnesium. Nevertheless, in flow-though test, calcium and magnesium leached from solid slags are below 0.5% and all other metals below 0.1%. Leachates obtained with DIN 38414-S4 present, as expected, higher leaching values; however, these are inferior to 5% (Ca) and 1% (other elements). (Author) 12 refs

  14. Leaching behavior of solidified plastics radioactive wastes

    International Nuclear Information System (INIS)

    Yook, Chong Chul; Lee, Byung Hun; Jae, Won Mok; Kim, Kyung Eung

    1986-01-01

    It is highly needed to develope the solidification process to dispose safely the radioactive wastes increasing with the growth of the nuclear industry. The leaching mechanisms of the solidified plastic wastes were investigated and the leaching rates of the plastic wastes were also measured among the many solidification processes. In addition, the transport equation based on the diffusion or the diffusion-dissolution was compared with the empirical equation derived from the experimental data by graphical method. Consequently, leaching process of the solidified plastic wastes is quite well agreed with the mass transport theory, but it may be difficult to simulate leaching process by diffusion dissolution mechanism. But the theoretical equation could be applicable to the cumulative amount of radionuclides leached form the plastic wastes disposed into the environment. (Author)

  15. Leaching of tritium from a cement composite

    International Nuclear Information System (INIS)

    Matsuzuru, Hideo; Ito, Akihiko

    1978-10-01

    Leaching of tritium from cement composites into an aqueous phase has been studied to evaluate the safety of incorporation of the tritiated liquid waste into cement. Leaching tests were performed by the method recommended by the International Atomic Energy Agency. The Leaching fraction was measured as functions of waste-cement ratio (Wa/C), temperature of leachant and curing time. The tritium leachability of cement in the long term test follows the order: alumina cement portland cement slag cement. The fraction of tritium leached increases with increasing Wa/C and temperature and decreasing curing period. A deionized water as a leachant gives a slightly higher leachability than synthetic sea water. The amount leached of tritium from a 200 l drum size specimen was estimated on the basis of the above results. (author)

  16. Bacteria heap leaching test of a uranium ore

    International Nuclear Information System (INIS)

    Liu Hui; Liu Jinhui; Wu Weirong; Han Wei

    2008-01-01

    Column bioleaching test of a uranium ore was carried out. The optimum acidity, spraying intensity, spray-pause time ratio were determined. The potential, Fe and U concentrations in the leaching process were investigated. The effect of bacteria column leaching was compared with that of acid column leaching. The results show that bacteria column leaching can shorten leaching cycle, and the leaching rate of uranium increases by 9.7%. (authors)

  17. Long-term leach rates of glasses containing actual waste

    International Nuclear Information System (INIS)

    Wiley, J.R.; LeRoy, J.H.

    1979-01-01

    Leach rates of borosilicate glasses that contained actual Savannah River Plant waste were measured. Leaching was done by water and by buffer solutions of pH 4, 7, and 9. Leach rates were then determined from the amount of 137 Cs, 90 Sr, and Pu released into the leach solutions. The cumulative fractions leached were fit to a mathematical model that included leaching by diffusion and glass dissolution

  18. Long-term leach rates of glasses containing actual waste

    International Nuclear Information System (INIS)

    Wiley, J.R.; LeRoy, J.H.

    1979-01-01

    Leach rates of borosilicate glasses that contained actual Savannah River Plant waste were measured. Leaching was done by water and by buffer solutions of pH 4, 7, and 9. Leach rates were then determined from the amount of 137 Cs, 90 Sr, and plutonium released into the leach solutions. The cumulative fractions leached were fit to a mathematical model that included leaching by diffusion and glass dissolution. 5 figures, 3 tables

  19. Dynamic leaching test of personal computer components.

    Science.gov (United States)

    Li, Yadong; Richardson, Jay B; Niu, Xiaojun; Jackson, Ollie J; Laster, Jeremy D; Walker, Aaron K

    2009-11-15

    A dynamic leaching test (DLT) was developed and used to evaluate the leaching of toxic substances for electronic waste in the environment. The major components in personal computers (PCs) including motherboards, hard disc drives, floppy disc drives, and compact disc drives were tested. The tests lasted for 2 years for motherboards and 1.5 year for the disc drives. The extraction fluids for the standard toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) were used as the DLT leaching solutions. A total of 18 elements including Ag, Al, As, Au, Ba, Be, Cd, Cr, Cu, Fe, Ga, Ni, Pd, Pb, Sb, Se, Sn, and Zn were analyzed in the DLT leachates. Only Al, Cu, Fe, Ni, Pb, and Zn were commonly found in the DLT leachates of the PC components. Their leaching levels were much higher in TCLP extraction fluid than in SPLP extraction fluid. The toxic heavy metal Pb was found to continuously leach out of the components over the entire test periods. The cumulative amounts of Pb leached out of the motherboards in TCLP extraction fluid reached 2.0 g per motherboard over the 2-year test period, and that in SPLP extraction fluid were 75-90% less. The leaching rates or levels of Pb were largely affected by the content of galvanized steel in the PC components. The higher was the steel content, the lower the Pb leaching rate would be. The findings suggest that the obsolete PCs disposed of in landfills or discarded in the environment continuously release Pb for years when subjected to landfill leachate or rains.

  20. An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation

    Science.gov (United States)

    Chawla, N.; Shen, Y.-L.; Deng, X.; Ege, E. S.

    2004-12-01

    The lap-shear technique is commonly used to evaluate the shear, creep, and thermal fatigue behavior of solder joints. We have conducted a parametric experimental and modeling study, on the effect of testing and geometrical parameters on solder/copper joint response in lap-shear. It was shown that the farfield applied strain is quite different from the actual solder strain (measured optically). Subtraction of the deformation of the Cu substrate provides a reasonable approximation of the solder strain in the elastic regime, but not in the plastic regime. Solder joint thickness has a profound effect on joint response. The solder response moves progressively closer to “true” shear response with increasing joint thickness. Numerical modeling using finite-element analyses were performed to rationalize the experimental findings. The same lap-shear configuration was used in the simulation. The input response for solder was based on the experimental tensile test result on bulk specimens. The calculated shear response, using both the commonly adopted far-field measure and the actual shear strain in solder, was found to be consistent with the trends observed in the lap-shear experiments. The geometric features were further explored to provide physical insight into the problem. Deformation of the substrate was found to greatly influence the shear behavior of the solder.

  1. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    OpenAIRE

    Sun, Lei; Zhang, Liang

    2015-01-01

    SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparti...

  2. Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy

    Science.gov (United States)

    Tikale, Sanjay; Prabhu, K. Narayan

    2018-05-01

    The effect of Al2O3 nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al2O3 nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (T L) and melting temperature range of the SAC305 solder alloy by addition of Al2O3 nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al2O3 nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu6Sn5 IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy.

  3. A kinetics study of acetic acid on cobalt leaching of spent LIBs: Shrinking Core Model

    Directory of Open Access Journals (Sweden)

    Setiawan Hendrik

    2018-01-01

    Full Text Available Lithium-ion batteries (LIBs are secondary rechargeable power sources which increasing production also leads to large amount of waste. In order to environmentally friendly reduce the waste, this work aimed to use acetic acid as a substitute leaching agent to leach Co metals which constitutes about 72.39% wt of the battery cathode. The leaching process was done in a three-necked-flask where calcined LIB cathode powder was mixed with acetic acid solution. The variables of the leaching process under investigation were solution pH, concentration of H2O2 in the solution, S/L ratio, temperature and reaction time. Experimental results showed that only temperature significantly influenced the leaching rate of Co. Since the process was exothermic, the maximum recovery decreased as temperature increased. Conventional shrinking core model that considers diffusion and irreversible surface reaction resistances was found not sufficient to predict the kinetics of the Co leaching with acetic acid. A more representative kinetics model that considers a reversible reaction of Co complex formation needs to be further developed.

  4. Gamma radiolysis effects on leaching behavior of ceramic materials for nuclear fuel waste immobilization containers

    International Nuclear Information System (INIS)

    Onofrei, M.; Raine, D.K.; Hocking, W.H.; George, K.; Betteridge, J.S.

    1986-01-01

    The leaching behavior of ceramic materials for nuclear fuel waste immobilization containers, under the influence of a moderate gamma dose rate (4 Gy/h), has been investigated. Samples of Al/sub 2/O/sub 3/, stabilized ZrO/sub 2/, TiO/sub 2/, cermet (70% Al/sub 2/O-30% TiC), porcelain (with high Al/sub 2/O/sub 3/ content), and concrete (with sulfate-resisting portland cement plus silica fume) have been leached in Standard Canadian Shield Saline Solution (SCSSS), and SCSSS plus clay and sand (components of the disposal system), at 100 0 and 150 0 C for 231 and 987 days, respectively. Leaching solutions were analyzed and the surfaces of the leached samples were investigated by scanning electron microscopy in conjunction with energy dispersive X-ray spectroscopy and secondary ion mass spectrometry. Radiolysis did not appear to enhance the leaching, with or without bentonite and sand in the system. Analysis of the gas phase from sealed capsules showed O/sub 2/ depletion and production of CO/sub 2/ in all experiments containing bentonite. The decrease in O/sub 2/ is attributed to the leaching from the clay of Fe(II) species, which can participate in redox reactions with radicals generated by radiolysis. The CO/sub 2/ is produced from either the organic or inorganic fraction in the bentonite

  5. Analysis of a short beam with application to solder joints: could larger stand-off heights relieve stress?

    Science.gov (United States)

    Suhir, Ephraim

    2015-08-01

    Physically meaningful and easy-to-use analytical (mathematical) stress model is developed for a short beam with clamped and known-in-advance offset ends. The analysis is limited to elastic deformations. While the classical Timoshenko short-beam theory seeks the beam's deflection caused by the combined bending and shear deformations for the given loading, an inverse problem is considered here: the lateral force is sought for the given ends offset. In short beams this force is larger than in long beams, since, in order to achieve the given displacement (offset), the applied force has to overcome both bending and shear resistance of the beam. It is envisioned that short beams could adequately mimic the state of stress in solder joint interconnections, including ball-grid-array (BGA) systems, with large, compared to conventional joints, stand-off heights. When the package/printed-circuit-board (PCB) assembly is subjected to the change in temperature, the thermal expansion (contraction) mismatch of the package and the PCB results in an easily predictable relative displacement (offset) of the ends of the solder joint. This offset can be determined from the known external thermal mismatch strain (determined as the product of the difference in the coefficients of thermal expansion and the change in temperature) and the position of the joint with respect to the mid-cross-section of the assembly. The maximum normal and shearing stresses could be viewed as suitable criteria of the beam's (joint's) material long-term reliability. It is shown that these stresses can be brought down by employing beam-like joints, i.e., joints with an increased stand-off height compared to conventional joints. It is imperative, of course, that, if such joints are employed, there is still enough interfacial real estate, so that the BGA bonding strength is not compromised. On the other hand, owing to the lower stress level, reliability assurance might be much less of a challenge than in the case of

  6. Characterizing the Leaching Behavior of Coal Combustion Residues using the Leaching Environmental Assessment Framework (LEAF) to Inform Future Management Decisions

    Science.gov (United States)

    Abstract for presentation on Characterizing the Leaching Behavior of Coal Combustion Residues using the Leaching Environmental Assessment Framework (LEAF) to Inform Future Management Decisions. The abstract is attached.

  7. Some factors affecting agitation leach test during in-situ leaching of uranium

    International Nuclear Information System (INIS)

    Liao Wensheng; Jiang Yan; Wang Limin; Shi Zhenfeng; Zhao Qiaofu; MARMAR

    2014-01-01

    The agitation leaching test is one of the most fundamental research works in in-situ leaching of uranium. Some factors affecting the test results were analyzed including stirring, leaching time, oxidizer used in alkaline leach, washing solution, the amount and size of ore samples. The results indicate that stirring can enhance diffusion velocity. The leach time l or 2 days is suitable for the samples containing accessible uranium and low acid consumption minerals; whereas 3 or 4 days for those containing refractory ore to leach and slowly acid consuming minerals. For the oxidizer used in alkaline leach, potassium permanganate is better than hydrogen peroxide. Recovery calculated by the leach solution can be directly obtained by its uranium level and the original volume of lixiviant without analyzing and calculating the washing solution. The appropriate amount and size of ore samples for the agitation leaching test are 60 g and <1 mm. By controlling the above factors, the agitation leach test can improve the applicability of the different ore samples and give the more reliable data. (authors)

  8. ESCA studies on leached glass forms

    International Nuclear Information System (INIS)

    Dawkins, B.G.

    1979-01-01

    Electron Spectroscopy for Chemical Analysis (ESCA) results for frit, obsidian, NBS standard, and Savannah River Laboratory (SRL) glass forms that have been subjected to cumulative water leachings of 36 hours show that [Na] exhibits the largest and fastest change of all the elements observed. Leaching of surface Na occurred within minutes. Surface Na depletion increased with leach time. Continuous x-ray irradiation and argon ion milling induced Na mobility, precluding semiquantitative ESCA analysis at normal operating temperatures. However, the sample stage has been equipped with a liquid nitrogen supply and alkali mobility should be eliminated in future work

  9. ALKALINE CARBONATE LEACHING PROCESS FOR URANIUM EXTRACTION

    Science.gov (United States)

    Thunaes, A.; Brown, E.A.; Rabbitts, A.T.

    1957-11-12

    A process for the leaching of uranium from high carbonate ores is presented. According to the process, the ore is leached at a temperature of about 200 deg C and a pressure of about 200 p.s.i.g. with a solution containing alkali carbonate, alkali permanganate, and bicarbonate ion, the bicarbonate ion functionlng to prevent premature formation of alkali hydroxide and consequent precipitation of a diuranate. After the leaching is complete, the uranium present is recovered by precipitation with NaOH.

  10. Column leaching from biomass combustion ashes

    DEFF Research Database (Denmark)

    Maresca, Alberto; Astrup, Thomas Fruergaard

    2015-01-01

    The utilization of biomass combustion ashes for forest soil liming and fertilizing has been addressed in literature. Though, a deep understanding of the ash chemical composition and leaching behavior is necessary to predict potential benefits and environmental risks related to this practice....... In this study, a fly ash sample from an operating Danish power plant based on wood biomass was collected, chemically characterized and investigated for its leaching release of nutrients and heavy metals. A column leaching test was employed. The strongly alkaline pH of all the collected eluates suggested...

  11. Leaching from municipal solid waste incineration residues

    Energy Technology Data Exchange (ETDEWEB)

    Hyks, J.

    2008-02-15

    Leaching of pollutants from Municipal Solid Waste Incineration (MSWI) residues has been investigated combining a range of laboratory leaching experiments with geochemical modeling. Special attention was paid to assessing the applicability of laboratory data for subsequent modeling with respect to presumed full-scale conditions; both sample pretreatment and actual influence of leaching conditions on the results of laboratory experiments were considered. It was shown that sample pretreatment may have large impact on leaching test data. In particular, a significant fraction of Pb was shown mobile during the washing of residues with water. In addition, drying of residues (i.e. slow oxidation) prior to leaching experiments increased the leaching of Cr significantly. Significant differences regarding the leaching behavior of individual elements with respect to (non)equilibrium conditions in column percolation experiments were observed in the study. As a result, three groups of elements were identified based on the predominant leaching control and the influence of (non)equilibrium on the results of the laboratory column experiments: I. Predominantly availability-controlled elements (e.g. Na, K, Cl) II. Solubility-controlled elements (e.g. Ca, S, Si, Al, Ba, and Zn) III. Complexation-controlled elements (e.g. Cu and Ni) With respect to the above groups it was suggested that results of laboratory column experiments can, with consideration, be used to estimate full-scale leaching of elements from Group I and II. However, in order to avoid large underestimations in the assessment of leaching from Group III, it is imperative to describe the time-dependent transport of dissolved organic carbon (DOC) in the tested system or to minimize the physical non-equilibrium during laboratory experiments (e.g. bigger column, slower flow velocity). Forward geochemical modeling was applied to simulate long-term release of elements from a MSWI air-pollution-control residue. Leaching of a

  12. Bacterial leaching of uranium ores - a review

    International Nuclear Information System (INIS)

    Lowson, R.T.

    1975-11-01

    The bacterial leaching of uranium ores involves the bacterially catalysed oxidation of associated pyrite to sulphuric acid and Fe 3+ by autotrophic bacteria and the leaching of the uranium by the resulting acidic, oxidising solution. Industrial application has been limited to Thiobacillus thiooxidans and Thiobacillus ferrooxidans at pH 2 to 3, and examples of these are described. The bacterial catalysis can be improved with nutrients or prevented with poisons. The kinetics of leaching are controlled by the bed depth, particle size, percolation rate, mineralogy and temperature. Current work is aimed at quantitatively defining the parameters controlling the kinetics and extending the method to alkaline conditions with other autotrophic bacteria. (author)

  13. Leaching properties of solidified TRU waste forms

    International Nuclear Information System (INIS)

    Colombo, P.; Neilson, R.M. Jr.

    1979-01-01

    Safety analysis of waste forms requires an estimate of the ability of these forms to retain activity in the disposal environment. This program of leaching tests will determine the leaching properties of TRU contaminated incinerator ash waste forms using hydraulic cement, urea--formaldehyde, bitumen, and vinyl ester--styrene as solidification agents. Three types of leaching tests will be conducted, including both static and flow rate. Five generic groundwaters will be used. Equipment and procedures are described. Experiments have been conducted to determine plate out of 239 Pu, counter efficiency, and stability of counting samples

  14. How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

    Science.gov (United States)

    Suhir, E.; Yi, S.; Ghaffarian, R.

    2017-03-01

    It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

  15. Effect of gap distance on tensile strength of preceramic base metal solder joints.

    Science.gov (United States)

    Fattahi, Farnaz; Motamedi, Milad

    2011-01-01

    In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023), but the differences between other groups were not sig-nificant at a significance level of 0.05. There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints.

  16. The critical oxide thickness for Pb-free reflow soldering on Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)

    2012-06-01

    Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

  17. [Monitoring of water and salt transport in silt and sandy soil during the leaching process].

    Science.gov (United States)

    Fu, Teng-Fei; Jia, Yong-Gang; Guo, Lei; Liu, Xiao-Lei

    2012-11-01

    Water and salt transport in soil and its mechanism is the key point of the saline soil research. The dynamic rule of water and transport in soil during the leaching process is the theoretical basis of formation, flush, drainage and improvement of saline soil. In this study, a vertical infiltration experiment was conducted to monitor the variation in the resistivity of silt and sandy soil during the leaching process by the self-designed automatic monitoring device. The experimental results showed that the peaks in the resistivity of the two soils went down and faded away in the course of leaching. It took about 30 minutes for sandy soil to reach the water-salt balance, whereas the silt took about 70 minutes. With the increasing leaching times, the desalination depth remained basically the same, being 35 cm for sandy soil and 10 cm for the silt from the top to bottom of soil column. Therefore, 3 and 7 leaching processes were required respectively for the complete desalination of the soil column. The temporal and spatial resolution of this monitoring device can be adjusted according to the practical demand. This device can not only achieve the remote, in situ and dynamic monitoring data of water and salt transport, but also provide an effective method in monitoring, assessment and early warning of salinization.

  18. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    Science.gov (United States)

    Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

    2016-12-01

    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

  19. Alternative leaching processes for uranium ores

    International Nuclear Information System (INIS)

    Ring, R.J.

    1979-01-01

    Laboratory studies have been carried out to compare the extraction of uranium from Australian ores by conventional leaching in sulphuric acid with that obtained using hydrochloric acid and acidified ferric sulphate solutions. Leaching with hydrochloric acid achieved higher extractions of radium-226 but the extraction of uranium was reduced considerably. The use of acidified ferric sulphate solution reduced acid consumption by 20-40% without any detrimental effect on uranium extraction. The ferric ion, which is reduced during leaching, can be reoxidized and recycled after the addition of acid makeup. Hydrogen peroxide was found to be an effective oxidant in conventional sulphuric acid leaching. It is more expensive than alternative oxidants, but it is non-polluting, lesser quantities are required and acid consumption is reduced

  20. Leaching of potassium in a lysimeter experiment

    International Nuclear Information System (INIS)

    Gerzabek, M.H.

    1996-11-01

    Leaching of potassium was studied in the lysimeter plant in Seibersdorf/Austria (Pannonian climate). Averaged over three years, gravitational water amounted to 15.7% of the sum of precipitation (mean 485 mm) and irrigation (mean 138 mm). Differences between the four soils with respect to drainage were explained by the specific percentage of the soil skeleton. The average yearly potassium leaching ranged from 3.64 kg K/ha·yr (Dystric-Cambisol) to 22.7 kg K/ha·yr (drained Gleysol). Correlation between gravitational water volume and potassium leaching were only significant for one out of four soil types. No correlation was observed between extractable potassium in the soil profiles and potassium leaching. (author)

  1. Chemical wiring and soldering toward all-molecule electronic circuitry.

    Science.gov (United States)

    Okawa, Yuji; Mandal, Swapan K; Hu, Chunping; Tateyama, Yoshitaka; Goedecker, Stefan; Tsukamoto, Shigeru; Hasegawa, Tsuyoshi; Gimzewski, James K; Aono, Masakazu

    2011-06-01

    Key to single-molecule electronics is connecting functional molecules to each other using conductive nanowires. This involves two issues: how to create conductive nanowires at designated positions, and how to ensure chemical bonding between the nanowires and functional molecules. Here, we present a novel method that solves both issues. Relevant functional molecules are placed on a self-assembled monolayer of diacetylene compound. A probe tip of a scanning tunneling microscope is then positioned on the molecular row of the diacetylene compound to which the functional molecule is adsorbed, and a conductive polydiacetylene nanowire is fabricated by initiating chain polymerization by stimulation with the tip. Since the front edge of chain polymerization necessarily has a reactive chemical species, the created polymer nanowire forms chemical bonding with an encountered molecular element. We name this spontaneous reaction "chemical soldering". First-principles theoretical calculations are used to investigate the structures and electronic properties of the connection. We demonstrate that two conductive polymer nanowires are connected to a single phthalocyanine molecule. A resonant tunneling diode formed by this method is discussed. © 2011 American Chemical Society

  2. Leaching methods for conditioned radioactive waste

    International Nuclear Information System (INIS)

    Carpentiero, R.; Bienvenu, P.; Huebra, A. G. de la; Dale, C.; Grec, D.; Gallego, C.; Rodriguez, M.; Vanderlinden, F.; Voors, P. I.; Welbergen, J.; May, R.; Fays, J.

    2005-01-01

    The physico-chemical characterization of solidified, real or simulated, radioactive waste is essential in determining their long-term stability in conditions close to that which could be encountered during disposal. The evaluation or prediction of the performance of conditioned waste passes through many suitable studies and experiments, according to a documented qualification programme. In this respect the leaching test is among the first important techniques to evaluate the feasibility of a waste form and for comparing and selecting the best waste form. So the leaching behaviour of an immobilized radioactive waste is a relevant property to be studied. The objective of the present report is to collect and describe the most representative leaching methods used in international laboratories, mainly at European level, whether standard or standard-derived. In this instance the work is a summary of the Network knowledge and applications on leaching processes in order to exchange information and scientific and technical experiences in this respect. The focus is to express all the relevant parameters of the test and its field of application. all this background is the needed starting point to clarify the similarities and shortcomings of the methods used in the EN-TRAP laboratories and, subsequently, the possible equalities or differences which can be attributed to the characteristic parameters of the different type of wastes treated. In order to comprise the significance and the effects of the parameters involved in leaching phenomena, an initial discussion on leaching mechanisms and on achievable results is made in this document. The international standardised methods are summarised as being the origin for all the network leaching procedures. This work in a preliminary way represents a comparative review ordered to introduce an unique leaching procedure to be tested in an interlaboratory comparative exercise. Further the unique method would be a quick internal reference

  3. Leaching of irradiated CANDU UO2 fuel

    International Nuclear Information System (INIS)

    Vandergraaf, T.T.; Johnson, L.H.; Lau, D.W.P.

    1980-01-01

    Irradiated fuel, leached at room temperature with distilled water and with slightly chlorinated river water, releases approx. 4% of its cesium inventory over a comparatively sort period of a few days but releases its actinides and rare earths more slowly. The matrix itself dissolves at a rate conservatively calculated to be less than approx. 2 x 10 -6 g UO 2 /cm 2 day and, with time, the leach rates of the various nuclides approach this value

  4. Leaching of nuclear power reactor wastes forms

    International Nuclear Information System (INIS)

    Endo, L.S.; Villalobos, J.P.; Miyamoto, H.

    1986-01-01

    The leaching tests for power reactor wastes carried out at IPEN/CNEN-SP are described. These waste forms consist mainly of spent resins and boric acid concentrates solidified in ordinary Portland cement. All tests were conducted according to the ISO and IAEA recommendations. 3 years leaching results are reported, determining cesium and strontium diffusivity coefficients for boric acid waste form and ion-exchange resins. (Author) [pt

  5. Improvement of the auto wire feeder machine in a de-soldering process

    Directory of Open Access Journals (Sweden)

    Niramon Nonkhukhetkhong

    2016-10-01

    Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

  6. Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits

    Energy Technology Data Exchange (ETDEWEB)

    Huang, Y. T.; Hsu, H. H.; Wu, Albert T., E-mail: atwu@ncu.edu.tw [Department of Chemical and Materials Engineering, National Central University, Jhongli City 320, Taiwan (China)

    2014-01-21

    Because of the miniaturization of electronic devices, the reliability of electromigration has become a major concern when shrinking the solder dimensions in flip-chip joints. Fast reaction between solders and electrodes causes intermetallic compounds (IMCs) to form, which grow rapidly and occupy entire joints when solder volumes decrease. In this study, U-grooves were fabricated on Si chips as test vehicles. An electrode-solder-electrode sandwich structure was fabricated by using lithography and electroplating. Gaps exhibiting well-defined dimensions were filled with Sn3.5Ag solders. The gaps between the copper electrodes in the test sample were limited to less than 15 μm to simulate microbumps. The samples were stressed at various current densities at 100 °C, 125 °C, and 150 °C. The morphological changes of the IMCs were observed, and the dimensions of the IMCs were measured to determine the kinetic growth of IMCs. Therefore, this study focused on the influence of back stress caused by microstructural evolution in microbumps.

  7. Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

    Science.gov (United States)

    Teverovsky, Alexander A.

    2014-01-01

    Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

  8. In vitro conjunctival incision repair by temperature-controlled laser soldering.

    Science.gov (United States)

    Norman, Galia; Rabi, Yaron; Assia, Ehud; Katzir, Abraham

    2009-01-01

    The common method of closing conjunctival incisions is by suturing, which is associated with several disadvantages. It requires skill to apply and does not always provide a watertight closure, which is required in some operations (e.g., glaucoma filtration). The purpose of the present study was to evaluate laser soldering as an alternative method for closing conjunctival incisions. Conjunctival incisions of 20 ex vivo porcine eyes were laser soldered using a temperature-controlled fiberoptic laser system and an albumin mixed with indocyanine green as a solder. The control group consisted of five repaired incisions by a 10-0 nylon running suture. The leak pressure of the repaired incisions was measured. The mean leak pressure in the laser-soldered group was 132 mm Hg compared to 4 mm Hg in the sutured group. There was no statistically significant difference in both the incision's length and distance from the limbus between the groups, before and after the procedure, indicating that there was no severe thermal damage. These preliminary results clearly demonstrate that laser soldering may be a useful method for achieving an immediate watertight conjunctival wound closure. This procedure is faster and easier to apply than suturing.

  9. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    CERN Document Server

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

    2015-01-01

    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  10. Effect of temperature and flux concentration on soldering of base metal.

    Science.gov (United States)

    Lee, S Y; Lin, C T; Wang, M H; Tseng, H; Huang, H M; Dong, D R; Pan, L C; Shih, Y H

    2000-12-01

    The present study used the acoustic emission (AE) technique to evaluate interactions among soldering temperature, flux treatment, and the resultant ultimate tensile strength (UTS). Scanning electron microscopy (SEM) was used to examine fracture surfaces of the solder joints. Specimens were cast from removable partial denture alloy and then placed in a jig with a gap distance of 1.0 mm. A high-frequency soldering machine with an optical pyrometer was used for soldering at 1150 degrees C and 1200 degrees C, respectively. The flux concentrations were 67% and 75%. The soldered specimens were subjected to tensile test at a crosshead speed of 0.05 mm/min. During testing, acoustic emissions in the frequency range of 100--1200 kHz were collected, filtered, recorded, and processed by a sensing device. The results were analysed by ANOVA and Tukey LSD test. UTS at different temperatures showed no significant difference according to either mechanical or acoustic results. But in the 1200 degrees C group, the UTSs and AE counts showed significant differences (Pacoustic signals within the elastic deformation zone, while the 67% flux subgroup produced similar signals within the plastic deformation zone, either beyond the 0.2% yield point or before fracture.

  11. Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi–Sn based lead-free solder alloys

    International Nuclear Information System (INIS)

    Shalaby, Rizk Mostafa

    2013-01-01

    Mechanical properties and indentation creep of the melt-spun process Bi–42 wt%Sn, Bi–40 wt%Sn–2 wt%In, Bi–40 wt%Sn–2 wt%Ag and Bi–38 wt%Sn–2 wt%In–2 wt%Ag were studied by dynamic resonance technique and Vickers indentation testing at room temperature and compared to that of the traditional Sn–37 wt%Pb eutectic alloy. The results show that the structure of Bi–42 wt%Sn alloy is characterized by the presence of rhombohedral Bi and body centered tetragonal β-Sn. The two ternary alloys exhibit additional constituent phases of intermetallic compounds SnIn 19 for Bi–40 wt%Sn–2 wt%In and ε-Ag 3 Sn for Bi–40 wt%Sn–2 wt%Ag alloys. Attention has been paid to the role of intermetallic compounds on mechanical and creep behavior. The In and Ag containing solder alloy exhibited a good combination of higher creep resistance, good mechanical properties and lower melting temperature as compared with Pb–Sn eutectic solder alloy. This was attributed to the strengthening effect of Bi as a strong solid solution element in the Sn matrix and formation of intermetallic compounds β-SnBi, ε-Ag 3 Sn and InSn 19 which act as both strengthening agent and grain refiner in the matrix of the material. Addition of In and Ag decreased the melting temperature of Bi–Sn lead-free solder from 143 °C to 133 °C which was possible mainly due to the existence of InSn 19 and Ag 3 Sn intermetallic compounds. Elastic constants, internal friction and thermal properties of Bi–Sn based alloys have been studied and analyzed.

  12. Method for accelerated leaching of solidified waste

    International Nuclear Information System (INIS)

    Fuhrmann, M.; Heiser, J.H.; Pietrzak, R.F.; Franz, E.M.; Colombo, P.

    1990-11-01

    An accelerated leach test method has been developed to determine the maximum leachability of solidified waste. The approach we have taken is to use a semi-dynamic leach test; that is, the leachant is sampled and replaced periodically. Parameters such as temperature, leachant volume, and specimen size are used to obtain releases that are accelerated relative to other standard leach tests and to the leaching of full-scale waste forms. The data obtained with this test can be used to model releases from waste forms, or to extrapolate from laboratory-scale to full-scale waste forms if diffusion is the dominant leaching mechanism. Diffusion can be confirmed as the leaching mechanism by using a computerized mathematical model for diffusion from a finite cylinder. We have written a computer program containing several models including diffusion to accompany this test. The program and a Users' Guide that gives screen-by-screen instructions on the use of the program are available from the authors. 14 refs., 4 figs., 1 tab

  13. Optimization of the factors that accelerate leaching

    International Nuclear Information System (INIS)

    Fuhrmann, M.; Pietrzak, R.F.; Franz, E.M.; Heiser, J.H. III; Colombo, P.

    1989-03-01

    The prediction of long-term leachability of low-level radioactive waste forms is an essential element of disposal-site performance assessment. This report describes experiments and modeling techniques used to develop an accelerated leach test that meets this need. The acceleration in leaching rates caused by the combinations of two or more factors were experimentally determined. These factors were identified earlier as being able to individually accelerate leaching. They are: elevated temperature, the size of the waste form, the ratio of the volume of leachant to the surface area of the waste form, and the frequency of replacement of the leachant. The solidification agents employed were ones that are currently used to treat low-level radioactive wastes, namely portland type I cement, bitumen, and vinyl ester-styrene. The simulated wastes, sodium sulfate, sodium tetraborate, and incinerator ash, are simplified representatives of typical low-level waste streams. Experiments determined the leaching behavior of the radionuclides of cesium (Cs-137), strontium (Sr-85), and cobalt (Co-60 or Co-57) from several different formulations of solidification agents and waste types. Leaching results were based upon radiochemical and elemental analyses of aliquots of the leachate, and on its total alkalinity and pH at various times during the experiment (up to 120 days). Solid phase analyses were carried out by Scanning/Electron Microscopy and Energy Dispersive Spectroscopy on the waste forms before and after some leaching experiments. 43 refs., 96 figs., 16 tabs

  14. Zinc Leaching from Tire Crumb Rubber

    Science.gov (United States)

    Rhodes, E. P.; Ren, J.; Mays, D. C.

    2010-12-01

    Recent estimates indicate that more than 2 billion scrap tires are currently stockpiled in the United States and approximately 280 million more tires are added annually. Various engineering applications utilize recycled tires in the form of shredded tire crumb rubber. However, the use of tire crumb rubber may have negative environmental impacts, especially when the rubber comes into contact with water. A review of the literature indicates that leaching of zinc from tire crumb rubber is the most significant water quality concern associated with using this material. Zinc is generally used in tire manufacturing, representing approximately 1.3% of the final product by mass. This study will report results from the U.S. Environmental Protection Agency’s (EPA’s) Synthetic Precipitation Leaching Procedure, batch leaching tests, and column leaching tests performed to quantify the process by which zinc leaches from tire crumb rubber into water. Results are interpreted with a first-order kinetic attachment/detachment model, implemented with the U.S. Agricultural Research Service software HYDRUS-1D, in order to determine the circumstances when zinc leaching from tire crumb rubber would be expected to comply with the applicable discharge limits. One potential application for recycled tires is replacing sand with tire crumb rubber in granular media filters used for stormwater pollution control. For this to be a viable application, the total zinc in the stormwater discharge must be below the EPA’s benchmark value of 0.117 mg/L.

  15. Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

    International Nuclear Information System (INIS)

    Chellvarajoo, Srivalli; Abdullah, M.Z.; Samsudin, Z.

    2015-01-01

    Highlights: • Fe 2 NiO 4 nanoparticles added into SAC 305 by mechanical mixing to form nanocomposite solder paste. • Nanoparticles in the composite solder travels with flux to the outermost surface after reflow. • The intermetallics compound reduced with the addition of nanoparticles into solder paste. • The hardness increased with the addition of limited percentage of nanoparticles into SAC 305. - Abstract: This study investigates the effects of the addition of Fe 2 NiO 4 nanoparticles into a SAC-305 lead-free solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper ‘sandwich’ method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5 wt.% of Fe 2 NiO 4 nanoparticles, respectively. If the addition of Fe 2 NiO 4 nanoparticle exceeded 1.5 wt.%, the hardness increased infinitely

  16. Leaching behavior of simulated high-level waste glass

    International Nuclear Information System (INIS)

    Kamizono, Hiroshi

    1987-03-01

    The author's work in the study on the leaching behavior of simulated high-level waste (HLW) glass were summarized. The subjects described are (1) leach rates at high temperatures, (2) effects of cracks on leach rates, (3) effects of flow rate on leach rates, and (4) an in-situ burial test in natural groundwater. In the following section, the leach rates obtained by various experiments were summarized and discussed. (author)

  17. Numerical simulation of vertical infiltration for leaching fluid in situ

    International Nuclear Information System (INIS)

    Li Jinxuan; Shi Weijun; Zhang Weimin

    1998-01-01

    Based on the analysis of movement law of leaching fluid in breaking and leaching experiment in situ, the movement of leaching fluid can be divided into two main stages in the leaching process in situ: Vertical Infiltration in unsaturation zone and horizontal runoff in saturation zone. The corresponding mathematics models are sep up, and the process of vertical infiltration of leaching fluid is numerically simulated

  18. Long-term elevated temperature leaching of solid waste forms

    International Nuclear Information System (INIS)

    Kenna, B.T.; Murphy, K.D.; Levine, H.S.

    1978-01-01

    Long-term soxhlet leaching of simulated waste glass and ceramic materials was initiated to elucidate leaching behavior of complex wasteforms. A cyclic leaching pattern was found in all systems over a 20 month period. Maxima and minima were observed in the leaching rates of all components studied with the minima coinciding. The data suggested several mechanistic features which are described, but they did not conform with reported simple leaching mechanisms

  19. Reliability of Pb free solder alloys. Physical and mechanical properties; Pb free handa no shinraisei. Butsuri kikaiteki shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Sanji, M; Yoshino, M; Ishikawa, J; Takenaka, O [Denso Corp., Aichi (Japan)

    1997-10-01

    Properties of 19 different Pb free solders have been evaluated in comparison with Sn-37Pb eutectic solder. Pb free solders without Bi were on the same level as Sn-37Pb in tensile strength and elongation, and those with Bi had higher strength and lower elongation than Sn-37Pb. As the Bi content increased, strength was higher, and elongation was lower. In torsion fatigue tests, fatigue life of Pb free solders without Bi was longer than Sn-37Pb. The relationships of Coffin-Manson rule and Basquin rule with fatigue life was applicable to Pb free solder. Fatigue life of those is inferred from their tensile strength. 7 refs., 13 figs., 1 tab.

  20. Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

    Energy Technology Data Exchange (ETDEWEB)

    Wolfe, Larry

    2009-04-22

    Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.

  1. Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution

    Science.gov (United States)

    Nordarina, J.; Mohd, H. Z.; Ahmad, A. M.; Muhammad, F. M. N.

    2018-03-01

    The corrosion properties of Sn-9(5Al-Zn), Sn-Cu and SAC305 were studied via potentiodynamic polarization method in an acidic solution of 1 M hydrochloric acid (HCl). Sn-9(5Al-Zn) produced different polarization profile compared with Sn-Cu and SAC305. The morphological analysis showed that small, deep grooves shaped of corrosion product formed on top of Sn-9(5Al-Zn) solder while two distinctive structures of closely packed and loosely packed corrosion product formed on top of Sn-Cu and SAC305 solder alloys. Phase analysis revealed the formations of various corrosion products such as SnO and SnO2 mainly dominant on surface of solder alloys after potentiodynamic polarization in 1 M hydrochloric acid (HCl).

  2. Au-Ge based Candidate Alloys for High-Temperature Lead-Free Solder Alternatives

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure and microhard......Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure...... was primarily strengthened by the refined (Ge) dispersed phase. The distribution of phases played a relatively more crucial role in determining the ductility of the bulk solder alloy. In the present work it was found that among the low melting point metals, the addition of Sb to the Au-Ge eutectic would...

  3. Instantaneous fluxless bonding of Au with Pb-Sn solder in ambient atmosphere

    International Nuclear Information System (INIS)

    Lee, T.K.; Zhang, Sam; Wong, C.C.; Tan, A.C.

    2005-01-01

    A fluxless bonding technique has been developed as a method of flip-chip bonding for microelectronic packaging. The fluxless bonding technique can be achieved instantaneously in an ambient environment between metallic stud bumps and predefined molten solder. This paper describes the mechanics of the bonding action and verifies the effectiveness of this bonding method through wetting balance tests and scanning electron microscope and energy dispersive x-ray analysis. This technique has been demonstrated by using a gold stud bump to break the tin oxide layer over molten solder. This allows for a fast, solid liquid interdiffusion between gold (Au) and the fresh molten eutectic lead-tin (Pb-Sn) solder for joint formation during solidification. This bonding method has been successfully tested with 130-μm-pitch flip-chip bond pads on a joint-in-via flex substrate architecture

  4. Dissolution ad uptake of cadmium from dental gold solder alloy implants

    International Nuclear Information System (INIS)

    Bergman, B.; Bergman, M.; Soeremark, R.

    1977-01-01

    Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium ( 115 Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of 115 Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver. (author)

  5. SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

    Directory of Open Access Journals (Sweden)

    D. Heinemann

    2016-06-01

    Full Text Available Printed Circuit Boards (PCB play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

  6. Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

    Science.gov (United States)

    Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

    2011-01-01

    The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

  7. Comparison of implant-abutment interface misfits after casting and soldering procedures.

    Science.gov (United States)

    Neves, Flávio Domingues das; Elias, Gisele Araújo; da Silva-Neto, João Paulo; de Medeiros Dantas, Lucas Costa; da Mota, Adérito Soares; Neto, Alfredo Júlio Fernandes

    2014-04-01

    The aim of this study was to compare vertical and horizontal adjustments of castable abutments after conducting casting and soldering procedures. Twelve external hexagonal implants (3.75 × 10 mm) and their UCLA abutments were divided according their manufacturer and abutment type: PUN (plastic UCLA, Neodent), PUC (plastic UCLA, Conexão), PU3i (plastic UCLA, Biomet 3i), and PUTN (plastic UCLA with Tilite milled base, Neodent). Three infrastructures of a fixed partial implant-supported bridge with 3 elements were produced for each group. The measurements of vertical (VM) and horizontal (HM) misfits were obtained via scanning electron microscopy after completion of casting and soldering. The corresponding values were determined to be biomechanically acceptable to the system, and the results were rated as a percentage. Statistical analysis establishes differences between groups by chi-square after procedures, and McNeman's test was applied to analyze the influence of soldering over casting (α ≤ .05). For the values of VM and HM, respectively, when the casting process was complete, it was observed that 83.25% and 100% (PUTN), 33.3% and 27.75% (PUN), 33.3% and 88.8% (PUC), 33.3% and 94.35% (PU3i) represented acceptable values. After completing the requisite soldering, acceptable values were 50% and 94.35% (PUTN), 16.6% and 77.7% (PUN), 38.55% and 77.7% (PUC), and 27.75% and 94.35% (PU3i). Within the limitations of this study, it can be concluded that the premachined abutments presented more acceptable VM values. The HM values were within acceptable limits before and after the soldering procedure for most groups. Further, the soldering procedure resulted in an increase of VM in all groups.

  8. In-vitro Investigations of Skin Closure using Diode Laser and Protein Solder Containing Gold Nanoshells

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2010-12-01

    Full Text Available Introduction: Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nanoshells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nanoshells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nanoshells were prepared. A full thickness incision of 2×20 mm2 was made on the surface and after placing 50 μl of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns, and scan velocity (Vs were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nanoshell concentrations. In addition, at constant laser irradiance (I, the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to st = 1610 g/cm2 at I ~ 60 Wcm-2, T ~ 65ºC, Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nanoshells can be used as an indocyanine green dye (ICG alterative for laser tissue soldering.  Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

  9. Leaching of FGD Byproducts Using a CSTX

    Energy Technology Data Exchange (ETDEWEB)

    Kairies, C.L.; Schroeder, K.T.; Cardone, C.R.

    2005-09-01

    Leaching studies of coal utilization byproducts (CUB) are often performed to determine the compatibility of the material in a particular end-use or disposal environment. Typically, these studies are conducted using either a batch or a fixed-bed column technique. Fixed-bed columns offer the advantage of a continuous flow of effluent that provides elution profiles with changing elution volume and pH. Unfortunately, clogs can form in fixed-bed leaching columns, either because of cementitious properties of the material itself, such as is seen for fluidized bed combustion (FBC) fly ash, or because of precipitate formation, such as can occur when a high-calcium ash is subjected to sulfate-containing leachates. Also, very fine-grained materials, such as gypsum, do not provide sufficient permeability for study in a fixed-bed column. A continuous, stirred-tank extractor (CSTX) is being used as an alternative technique that can provide the elution profile of column leaching but without the low permeability problems. The CSTX has been successfully employed in the leaching of flue gas desulfurization products that would not be sufficiently permeable under traditional column leaching conditions. The results indicate that the leaching behavior depends on a number of factors, including (but not limited to) solubility and neutralization capacity of the mineral phases present, sorption properties of these phases, behavior of the solubilized material in the tank, and the type of species in solution. In addition, leaching to near-exhaustion of a wallboard produced from FGD gypsum has allowed the isolation of a highly adsorptive phase. This phase appears to be present in at least some FGD gypsums and accounts for the immobilization of trace metals such as arsenic, cobalt, lead, and mercury.

  10. Leaching kinetics of neodymium in sulfuric acid of rare earth elements (REE) slag concentrated by pyrometallurgy from magnetite ore

    International Nuclear Information System (INIS)

    Yoon, Ho-Sung; Kim, Chul-Joo; Chung, Kyung Woo; Lee, Jin-Young; Shin, Shun Myung; Lee, Su-Jeong; Joe, A-Ram; Lee, Se-Il; Yoo, Seung-Joon

    2014-01-01

    We studied the leaching kinetics of recovering neodymium in sulfuric acid from the rare earth elements (REE) slag concentrated by smelting reduction from a magnetite ore containing monazite. The leaching kinetics on neodymium was conducted at a reactant concentration of 1.5 g REE slag per L of 0.3M H 2 SO 4 , agitation of 750 rpm and temperature ranging from 30 to 80 .deg. C. Neodymium oxide included in the REE slag was completely converted into neodymium sulfate phase (Nd 2 (SO 4 ) 3 ) in H 2 SO 4 after the leaching of 5 h, 80 .deg. C. As a result, the leaching mechanism was determined in a two-stage model based on the shrinking core model with spherical particles. The first step was determined by chemical reaction, and the second step was determined by ash layer diffusion because the leaching of REEs by the first chemical reaction increases the formation of the ash layer affecting as a resistance against the leaching. By using the Arrhenius expression, the apparent activation energy of the first chemical reaction step was found to be 9 kJmol -1 . After the first chemical reaction, leaching reaction rate was determined by the ash layer diffusion. The apparent activation energy of ash layer diffusion was found to be 32 kJmol -1

  11. Leaching kinetics of neodymium in sulfuric acid of rare earth elements (REE) slag concentrated by pyrometallurgy from magnetite ore

    Energy Technology Data Exchange (ETDEWEB)

    Yoon, Ho-Sung; Kim, Chul-Joo; Chung, Kyung Woo; Lee, Jin-Young; Shin, Shun Myung [Korea Institute of Geoscience and Mineral Resources (KIGAM), Daejeon (Korea, Republic of); Lee, Su-Jeong; Joe, A-Ram; Lee, Se-Il; Yoo, Seung-Joon [Seonam University, Asan (Korea, Republic of)

    2014-10-15

    We studied the leaching kinetics of recovering neodymium in sulfuric acid from the rare earth elements (REE) slag concentrated by smelting reduction from a magnetite ore containing monazite. The leaching kinetics on neodymium was conducted at a reactant concentration of 1.5 g REE slag per L of 0.3M H{sub 2}SO{sub 4}, agitation of 750 rpm and temperature ranging from 30 to 80 .deg. C. Neodymium oxide included in the REE slag was completely converted into neodymium sulfate phase (Nd{sub 2}(SO{sub 4}){sub 3}) in H{sub 2}SO{sub 4} after the leaching of 5 h, 80 .deg. C. As a result, the leaching mechanism was determined in a two-stage model based on the shrinking core model with spherical particles. The first step was determined by chemical reaction, and the second step was determined by ash layer diffusion because the leaching of REEs by the first chemical reaction increases the formation of the ash layer affecting as a resistance against the leaching. By using the Arrhenius expression, the apparent activation energy of the first chemical reaction step was found to be 9 kJmol{sup -1}. After the first chemical reaction, leaching reaction rate was determined by the ash layer diffusion. The apparent activation energy of ash layer diffusion was found to be 32 kJmol{sup -1}.

  12. Leaching properties and chemical compositions of calcines produced at the Idaho Chemical Processing Plant

    International Nuclear Information System (INIS)

    Staples, B.A.; Paige, B.E.; Rhodes, D.W.; Wilding, M.W.

    1980-01-01

    No significant chemical differences were determined between retrieved and fresh calcine based on chemical and spectrochemical analyses. Little can be derived from the amounts of the radioisotopes present in the retrieved calcine samples other than the ratios of strontium-90 to cesium-137 are typical of aged fission product. The variations in concentrations of radionuclides within the composite samples of each bin also reflect the differences in compositions of waste solutions calcined. In general the leaching characteristics of both calcines by distilled water are similar. In both materials the radionuclides of cesium and strontium were selectively leached at significant rates, although cesium leached much more completely from the alumina calcine than from the zirconia calcine. Cesium and strontium are probably contained in both calcines as nitrate salts and also as fluoride salts in zirconia calcine, all of which are at least slightly soluble in water. Radionuclides of cerium, ruthenium, and plutonium in both calcines were highly resistant to leaching and leached at rates similar to or less than those of the matrix elements. These elements exist as polyvalent metal ions in the waste solutions before calcination and they probably form insoluble oxides and fluorides in the calcine. The relatively slow leaching of nitrate ion from zirconia calcine and radiocesium from both calcines suggests that the calcine matrix in some manner prevents complete or immediate contact of the soluble ions with water. Whether radiostrontium forms slightly fluoride salts or forms nitrate salts which are protected in the same manner as radiocesium is unknown. Nevertheless, selective leaching of cesium and strontim is retarded in some manner by the calcine matrix

  13. Mechanical performances of lead-free solder joint connections with applications in the aerospace domain

    Directory of Open Access Journals (Sweden)

    Georgiana PADURARU

    2016-03-01

    Full Text Available The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of solder joint in correlation with different pad finishes, there were made some mechanical determinations using a dedicated Share Test System. The theoretical model highlights the link between the experimental results and the influence of gravitational acceleration on the mechanical and functional integrity of the electronic assemblies that works in vibration environment. The paper novelty is provided by the interdisciplinary experiment that offers results that can be used in the mechanical, tribological, electronical and aerospace domains.

  14. A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing the equilib......An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing...

  15. A review of typical thermal fatigue failure models for solder joints of electronic components

    Science.gov (United States)

    Li, Xiaoyan; Sun, Ruifeng; Wang, Yongdong

    2017-09-01

    For electronic components, cyclic plastic strain makes it easier to accumulate fatigue damage than elastic strain. When the solder joints undertake thermal expansion or cold contraction, different thermal strain of the electronic component and its corresponding substrate is caused by the different coefficient of thermal expansion of the electronic component and its corresponding substrate, leading to the phenomenon of stress concentration. So repeatedly, cracks began to sprout and gradually extend [1]. In this paper, the typical thermal fatigue failure models of solder joints of electronic components are classified and the methods of obtaining the parameters in the model are summarized based on domestic and foreign literature research.

  16. Physics of Failure as a Basis for Solder Elements Reliability Assessment in Wind Turbines

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    description of the reliability. A physics of failure approach is applied. A SnAg solder component used in power electronics is used as an example. Crack propagation in the SnAg solder is modeled and a model to assess the accumulated plastic strain is proposed based on a physics of failure approach. Based...... on the proposed model it is described how to find the accumulated linear damage and reliability levels for a given temperature loading profile. Using structural reliability methods the reliability levels of the electrical components are assessed by introducing scale factors for stresses....

  17. Aging treatment characteristics of solder bump joint for high reliability optical module

    International Nuclear Information System (INIS)

    Kim, Kyung-Seob; Yu, Chung-Hee; Yang, Jun-Mo

    2004-01-01

    The joint strength and fracture surfaces of Sn-37 mass% Pb and Au stud bumps for photo diode packages after isothermal aging testing were studied experimentally. Al/Au stud bumps and Cu/Sn-37 mass% Pb solders were adopted, and aged for up to 900 h to analyze the effect of intermetallic compound (IMC). The joint strength decreased with aging time. The diffraction patterns of Cu 6 Sn 5 , scallop-shaped IMCs, and planar-shaped Cu 3 Sn were characterized using transmission electron microscopy (TEM). The formation of Kirkendall voids and the growth of IMCs at the solder were found to be a possible mechanism for joint strength reduction

  18. Low leaching and low LWR photoresist development for 193 nm immersion lithography

    Science.gov (United States)

    Ando, Nobuo; Lee, Youngjoon; Miyagawa, Takayuki; Edamatsu, Kunishige; Takemoto, Ichiki; Yamamoto, Satoshi; Tsuchida, Yoshinobu; Yamamoto, Keiko; Konishi, Shinji; Nakano, Katsushi; Tomoharu, Fujiwara

    2006-03-01

    With no apparent showstopper in sight, the adoption of ArF immersion technology into device mass production is not a matter of 'if' but a matter of 'when'. As the technology matures at an unprecedented speed, many of initial technical difficulties have been cleared away and the use of a protective layer known as top coat, initially regarded as a must, now becomes optional, for example. Our focus of interest has also sifted to more practical and production related issues such as defect reducing and performance enhancement. Two major types of immersion specific defects, bubbles and a large number of microbridges, were observed and reported elsewhere. The bubble defects seem to decrease by improvement of exposure tool. But the other type defect - probably from residual water spots - is still a problem. We suspect that the acid leaching from resist film causes microbridges. When small water spots were remained on resist surface after exposure, acid catalyst in resist film is leaching into the water spots even though at room temperature. After water from the spot is dried up, acid molecules are condensed at resist film surface. As a result, in the bulk of resist film, acid depletion region is generated underneath the water spot. Acid catalyzed deprotection reaction is not completed at this acid shortage region later in the PEB process resulting in microbridge type defect formation. Similar mechanism was suggested by Kanna et al, they suggested the water evaporation on PEB plate. This hypothesis led us to focus on reducing acid leaching to decrease residual water spot-related defect. This paper reports our leaching measurement results and low leaching photoresist materials satisfying the current leaching requirements outlined by tool makers without topcoat layer. On the other hand, Nakano et al reported that the higher receding contact angle reduced defectivity. The higher receding contact angle is also a key item to increase scan speed. The effort to increase the

  19. Electrochemical corrosion behaviour of lead-free Sn-8.5 Zn-X Ag-0.1 Al-0.5 Ga solder in 3.5% NaCl solution

    International Nuclear Information System (INIS)

    Mohanty, Udit Surya; Lin, K.-L.

    2005-01-01

    The electrochemical corrosion behaviour of Pb-free Sn-8.5 Zn-X Ag-0.1 Al-0.5 Ga solder in 3.5% NaCl solution was investigated by using potentiodynamic polarization methods, scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDX) and X-ray photoelectron spectroscopy (XPS) analysis. The results obtained from polarization studies showed that an increase in the Ag content from 0.1 to 1.5 wt% decreased the corrosion current density (I corr ) and shifted the corrosion potential (E corr ) towards more noble values. These changes were also reflected in the linear polarization resistance (LPR), corrosion rate, anodic Tafel slope (b A ) and the cathodic Tafel slope (b c ) values, respectively. Passivation behaviour was noted in the Sn-Zn-X Ag-Al-Ga solders with Ag content > 0.1 wt%. The oxides and hydroxides of zinc were responsible for the formation of passive film. Presence of Ag atoms in the oxide layer also improved the passivation behaviour of solders to a certain extent. X-ray photoelectron spectroscopy revealed that two different oxygen species were formed on the surface films, one was assigned to OH - in Zn(OH) 2 and the other to O 2 - in ZnO. XPS depth profile results revealed that the two species had different depth distribution in the films. SEM and EDX analyses confirmed SnCl 2 as the major corrosion product formed after the electrochemical experiments

  20. Laboratory leach tests of phosphate/sulfate waste grout and leachate adsorption tests using Hanford sediment

    Energy Technology Data Exchange (ETDEWEB)

    Serne, R.J.; Martin, W.J.; McLaurine, S.B.; Airhart, S.P.; LeGore, V.L.; Treat, R.L.

    1987-12-01

    An assessment of the long-term risks posed by grout disposal at Hanford requires data on the ability of grout to resist leaching of waste species contained in the grout via contact with water that percolates through the ground. Additionally, data are needed on the ability of Hanford sediment (soil) surrounding the grout and concrete vault to retard migration of any wastes released from the grout. This report describes specific laboratory experiments that are producing empirical leach rate data and leachate-sediment adsorption data for Phosphate-Sulfate Waste (PSW) grout. The leach rate and adsorption values serve as inputs to computer codes used to forecast potential risk resulting from the use of ground water containing leached species. In addition, the report discusses other chemical analyses and geochemical computer code calculations that were used to identify mechanisms that control leach rates and adsorption potential. Knowledge of the controlling chemical and physical processes provides technical defensibility for using the empirical laboratory data to extrapolate the performance of the actual grout disposal system to the long time periods of interest. 59 refs., 83 figs., 18 tabs.

  1. Laboratory leach tests of phosphate/sulfate waste grout and leachate adsorption tests using Hanford sediment

    International Nuclear Information System (INIS)

    Serne, R.J.; Martin, W.J.; McLaurine, S.B.; Airhart, S.P.; LeGore, V.L.; Treat, R.L.

    1987-12-01

    An assessment of the long-term risks posed by grout disposal at Hanford requires data on the ability of grout to resist leaching of waste species contained in the grout via contact with water that percolates through the ground. Additionally, data are needed on the ability of Hanford sediment (soil) surrounding the grout and concrete vault to retard migration of any wastes released from the grout. This report describes specific laboratory experiments that are producing empirical leach rate data and leachate-sediment adsorption data for Phosphate-Sulfate Waste (PSW) grout. The leach rate and adsorption values serve as inputs to computer codes used to forecast potential risk resulting from the use of ground water containing leached species. In addition, the report discusses other chemical analyses and geochemical computer code calculations that were used to identify mechanisms that control leach rates and adsorption potential. Knowledge of the controlling chemical and physical processes provides technical defensibility for using the empirical laboratory data to extrapolate the performance of the actual grout disposal system to the long time periods of interest. 59 refs., 83 figs., 18 tabs

  2. Analysis of factors affecting the effect of stope leaching

    International Nuclear Information System (INIS)

    Xie Wangnan; Dong Chunming

    2014-01-01

    The industrial test and industrial trial production of stope leaching were carried out at Taoshan orefield of Dabu deposit. The results of test and trial production showed obvious differences in leaching rate and leaching time. Compared with industrial trial production of stope leaching, the leaching rate of industrial test was higher, and leaching time was shorter. It was considered that the blasting method and liquid arrangement were the main factors affecting the leaching rate and leaching time according to analysis. So we put forward the following suggestions: the technique of deep hole slicing tight-face blasting was used to reduce the yield of lump ores, the effective liquid arrangement methods were adopted to make the lixiviant infiltrating throughout whole ore heap, and bacterial leaching was introduced. (authors)

  3. Leaching studies on SYNROC at 950C and 2000C

    International Nuclear Information System (INIS)

    Oversby, V.M.; Ringwood, A.E.

    1982-01-01

    Crushed samples of SYNROC containing 9%, 16% and 20% of simulated high-level nuclear waste were tested for leaching behavior in distilled water at 95 0 C and 200 0 . Leach solutions were analyzed for Cs, Ca, Ba, Sr, Ti, Zr, Nd and U. Results showed that leach rates based on these elements did not change significantly as the waste loading was increased from 9 to 20%. At both temperatures, leach rates showed a decrease as leaching progressed until a plateau level was reached. Plateau leach rates, which were between 10 and 100 times lower than initial leach rates, reflect the expected long term leaching behaviour of the samples. Plateau values of leach rates for SYNROC depend on the element being leached. Highest values are found for Cs and Ba (1 to 2 x 10 -7 g/cm 2 d at 95 0 C) and lowest values for U (5 x 10 -10 g/cm 2 d at 95 0 C). Increasing leaching temperature to 200 0 C produces higher leach rates for all elements except Nd. Comparison of SYNROC leach rate data with that for PNL 76-68 glass shows that at 200 0 C the leach rate for U from SYNROC is 3000 times less than that from glass. (Auth.)

  4. Equilibrium leaching of toxic elements from cement stabilized soil.

    Science.gov (United States)

    Voglar, Grega E; Leštan, Domen

    2013-02-15

    The toxicity characteristics leaching procedure (TCLP) is commonly used to assess the efficiency of solidification/stabilization (S/S) of pollutants in wastes, despite recent objections to this method. In this study, formulations of 7, 10, 15 and 20% (w/w) of calcium aluminate cement (CAC) and sulfate resistant Portland cement (SRC) were used for S/S of soil from brownfield contaminated with 43,149, 10,115, 7631, 6130, 90, 82 mg kg(-1) of Zn, Pb, Cu, As, Cd and Ni, respectively. CAC produced S/S soil monoliths of higher mechanical strength (up to 7.65 N mm(-2)). Mass-transfer analysis indicated surface wash-off as a mechanism of toxic elements release, and equilibrium leaching as a crucial parameter of S/S efficiency assessment. In the expected range of field soil pH after S/S (pH 7-9), the TCLP gave markedly different results than the multi-point pH equilibrium leaching method (using nine targeted pH values): up to 2953-, 94-, 483-, 1.3-, 27- and 1.5-times more Zn, Pb, Cu, As, Cd and Ni, respectively, was determined in the TCLP leachate. S/S with CAC reduced leachability of toxic elements more effectively than SRC. Our results indicate that, under given field conditions, the TCLP significantly underrates the efficiency of S/S of contaminated soil with cementitious binders. Copyright © 2012 Elsevier B.V. All rights reserved.

  5. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    Science.gov (United States)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. PMID:27877786

  6. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    International Nuclear Information System (INIS)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. (review)

  7. Leaching of gallium from gaiter granite, eastern desert, Egypt

    International Nuclear Information System (INIS)

    Zahran, M.A.; Mahmoud, KH.F.; Mahdy, M.A.; Abd El-Hamid, A.M.

    2006-01-01

    Preliminary leaching tests of gallium from some Egyptian granite rocks such as those of Gabal Gattar area was investigated by using 8 M HCl acid and sodium perchlorate as oxidant. To achieve the optimum leaching conditions, the factors affecting the leaching efficiency as the acid type and concentration, oxidant type and amount, leaching temperature, agitation time, solid / liquid ratio and the effect of grain size were studied. The complete chemical analysis of the collected samples was firstly carried out to determine the chemical features of the Gattarian granite. More than 97% of gallium content was leached when applying these optimum leaching conditions

  8. Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Wang Fengjiang [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States); O' Keefe, Matthew [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)], E-mail: mjokeefe@mst.edu; Brinkmeyer, Brandon [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)

    2009-05-27

    The effect of incorporating eutectic Sn-Pb solder with Sn-3.0Ag-0.5Cu (SAC) Pb-free solder on the microstructure and tensile properties of the mixed alloys was investigated. Alloys containing 100, 75, 50, 25, 20, 15, 10, 5 and 0 wt% SAC, with the balance being Sn-37Pb eutectic solder alloy, were prepared and characterized. Optical and scanning electron microscopy were used to analyze the microstructures while 'mini-tensile' test specimens were fabricated and tested to determine mechanical properties at the mm length scale, more closely matching that of the solder joints. Microstructural analysis indicated that a Pb-rich phase formed and was uniformly distributed at the boundary between the Sn-rich grains or between the Sn-rich and the intermetallic compounds in the solder. Tensile results showed that mixing of the alloys resulted in an increase in both the yield and the ultimate tensile strength compared to the original solders, with the 50% SAC-50% Sn-Pb mixture having the highest measured strength. Initial investigations indicate the formation and distribution of a Pb-rich phase in the mixed solder alloys as the source of the strengthening mechanism.

  9. Leaching Behavior of Heavy Metals from Cement Pastes Using a Modified Toxicity Characteristic Leaching Procedure (TCLP).

    Science.gov (United States)

    Huang, Minrui; Feng, Huajun; Shen, Dongsheng; Li, Na; Chen, Yingqiang; Shentu, Jiali

    2016-03-01

    As the standard toxicity characteristic leaching procedure (TCLP) can not exhaust the acid neutralizing capacity of the cement rotary kiln co-processing solid wastes products which is particularly important for the assessment of the leaching concentrations of heavy metals. A modified TCLP was proposed. The extent of leaching of heavy metals is low using the TCLP and the leaching performance of the different metals can not be differentiated. Using the modified TCLP, however, Zn leaching was negligible during the first 180 h and then sharply increased (2.86 ± 0.18 to 3.54 ± 0.26 mg/L) as the acidity increased (pH leaching is enhanced using the modified TCLP. While Pb leached readily during the first 126 h and then leachate concentrations decreased to below the analytical detection limit. To conclude, this modified TCLP is a more suitable method for these cement rotary kiln co-processing products.

  10. Leaching of artificial radionuclide out of minerals

    International Nuclear Information System (INIS)

    Bogdanov, R.V.; Osipova, I.V.; Sergeev, A.S.

    1992-01-01

    Leaching of radionuclides induced by neutron bombardment in natural silicates and silicophosphate of rare earth elements and calcium, is studied using gamma-spectrometry. It is shown that solution of minerals under the effect of artificial subsoil water at 75 deg C is incongruent character: difference in leaching of cobalt and actinides reaches value equal to two magnitudes. Behaviour of lanthanides as analogs of transplutonium elements is of special interest. Essential role of specimen microphase composition is pointed out. The suggested methodological approach is efficient at selection of matricies for fixaton of radioactive wastes

  11. Refractory concentrate gold leaching: Cyanide vs. bromine

    Science.gov (United States)

    Dadgar, Ahmad

    1989-12-01

    Gold extraction, recovery and economics for two refractory concentrates were investigated using cyanide and bromine reagents. Gold extractions for cyanide leaching (24-48 hours) and bromine leaching (six hours) were the same and ranged from 94 to 96%. Gold recoveries from bromine pregnant solutions using carbon adsorption, ion exchange, solvent extraction, and zinc and aluminum precipitation methods were better than 99.9%. A preliminary economic analysis indicates that chemical costs for cyanidation and bromine process are 11.70 and 11.60 respectively, per tonne of calcine processed.

  12. Leaching of nuclear power reactor waste forms

    International Nuclear Information System (INIS)

    Endo, L.S.; Villalobos, J.P.; Miyamoto, H.

    1987-01-01

    The leaching tests for immobilized power reactor wastes carried out at IPEN are described. These wastes forms consist mainly of spent resins and boric acid concentrates solidified in ordinary Portland cement. All tests were conducted according to the ISO and IAEA recommendations. Three years leaching results are reported. The cesium diffuvity coefficients determined out of these results are about 1 x 10 -8 cm 2 /s for boric acid waste form and 9 x 10 -9 cm 2 /s for ion-exchange resin waste. Strontium diffusivity coefficients found are about 3 x 10 -11 cm 2 /s and 9 x 10 -11 cm 2 /s respectively. (Author) [pt

  13. Urban trees reduce nutrient leaching to groundwater.

    Science.gov (United States)

    Nidzgorski, Daniel A; Hobbie, Sarah E

    2016-07-01

    Many urban waterways suffer from excess nitrogen (N) and phosphorus (P), feeding algal blooms, which cause lower water clarity and oxygen levels, bad odor and taste, and the loss of desirable species. Nutrient movement from land to water is likely to be influenced by urban vegetation, but there are few empirical studies addressing this. In this study, we examined whether or not urban trees can reduce nutrient leaching to groundwater, an important nutrient export pathway that has received less attention than stormwater. We characterized leaching beneath 33 trees of 14 species, and seven open turfgrass areas, across three city parks in Saint Paul, Minnesota, USA. We installed lysimeters at 60 cm depth to collect soil water approximately biweekly from July 2011 through October 2013, except during winter and drought periods, measured dissolved organic carbon (C), N, and P in soil water, and modeled water fluxes using the BROOK90 hydrologic model. We also measured soil nutrient pools (bulk C and N, KCl-extractable inorganic N, Brays-P), tree tissue nutrient concentrations (C, N, and P of green leaves, leaf litter, and roots), and canopy size parameters (leaf biomass, leaf area index) to explore correlations with nutrient leaching. Trees had similar or lower N leaching than turfgrass in 2012 but higher N leaching in 2013; trees reduced P leaching compared with turfgrass in both 2012 and 2013, with lower leaching under deciduous than evergreen trees. Scaling up our measurements to an urban subwatershed of the Mississippi River (~17 400 ha, containing ~1.5 million trees), we estimated that trees reduced P leaching to groundwater by 533 kg in 2012 (0.031 kg/ha or 3.1 kg/km 2 ) and 1201 kg in 2013 (0.069 kg/ha or 6.9 kg/km 2 ). Removing these same amounts of P using stormwater infrastructure would cost $2.2 million and $5.0 million per year (2012 and 2013 removal amounts, respectively). © 2016 by the Ecological Society of America.

  14. Life cycle assessment and residue leaching: The importance of parameter, scenario and leaching data selection

    Energy Technology Data Exchange (ETDEWEB)

    Allegrini, E., E-mail: elia@env.dtu.dk [Technical University of Denmark, Department of Environmental Engineering, Building 115, 2800 Lyngby (Denmark); Butera, S. [Technical University of Denmark, Department of Environmental Engineering, Building 115, 2800 Lyngby (Denmark); Kosson, D.S. [Vanderbilt University, Department of Civil and Environmental Engineering, Box 1831 Station B, Nashville, TN 37235 (United States); Van Zomeren, A. [Energy Research Centre of the Netherlands (ECN), Department of Environmental Risk Assessment, P.O. Box 1, 1755 ZG Petten (Netherlands); Van der Sloot, H.A. [Hans van der Sloot Consultancy, Dorpsstraat 216, 1721 BV Langedijk (Netherlands); Astrup, T.F. [Technical University of Denmark, Department of Environmental Engineering, Building 115, 2800 Lyngby (Denmark)

    2015-04-15

    Highlights: • Relevance of metal leaching in waste management system LCAs was assessed. • Toxic impacts from leaching could not be disregarded. • Uncertainty of toxicity, due to background activities, determines LCA outcomes. • Parameters such as pH and L/S affect LCA results. • Data modelling consistency and coverage within an LCA are crucial. - Abstract: Residues from industrial processes and waste management systems (WMSs) have been increasingly reutilised, leading to landfilling rate reductions and the optimisation of mineral resource utilisation in society. Life cycle assessment (LCA) is a holistic methodology allowing for the analysis of systems and products and can be applied to waste management systems to identify environmental benefits and critical aspects thereof. From an LCA perspective, residue utilisation provides benefits such as avoiding the production and depletion of primary materials, but it can lead to environmental burdens, due to the potential leaching of toxic substances. In waste LCA studies where residue utilisation is included, leaching has generally been neglected. In this study, municipal solid waste incineration bottom ash (MSWI BA) was used as a case study into three LCA scenarios having different system boundaries. The importance of data quality and parameter selection in the overall LCA results was evaluated, and an innovative method to assess metal transport into the environment was applied, in order to determine emissions to the soil and water compartments for use in an LCA. It was found that toxic impacts as a result of leaching were dominant in systems including only MSWI BA utilisation, while leaching appeared negligible in larger scenarios including the entire waste system. However, leaching could not be disregarded a priori, due to large uncertainties characterising other activities in the scenario (e.g. electricity production). Based on the analysis of relevant parameters relative to leaching, and on general results

  15. Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

    Science.gov (United States)

    Hammad, A. E.; El-Taher, A. M.

    2014-11-01

    The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

  16. Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

    Science.gov (United States)

    Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R.

    2014-01-01

    A fracture mechanism map (FMM) is a powerful tool which correlates the fracture behavior of a material to its microstructural characteristics in an explicit and convenient way. In the FMM for solder joints, an effective thickness of the interfacial intermetallic compound (IMC) layer ( t eff) and the solder yield strength ( σ ys,eff) are used as abscissa and ordinate axes, respectively, as these two predominantly affect the fracture behavior of solder joints. Earlier, a definition of t eff, based on the uniform thickness of IMC ( t u) and the average height of the IMC scallops ( t s), was proposed and shown to aptly explain the fracture behavior of solder joints on Cu. This paper presents a more general definition of t eff that is more widely applicable to a range of metallizations, including Cu and electroless nickel immersion gold (ENIG). Using this new definition of t eff, mode I FMM for SAC387/Cu joints has been updated and its validity was confirmed. A preliminary FMM for SAC387/Cu joints with ENIG metallization is also presented.

  17. The thermodynamic database COST MP0602 for materials for high-temperature lead-free soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Dinsdale, A.; Watson, A.; Vřešťál, J.; Zemanová, Adéla; Brož, P.

    2012-01-01

    Roč. 48, č. 3 (2012), s. 339-346 ISSN 1450-5339 R&D Projects: GA MŠk LD11024 Institutional support: RVO:68081723 Keywords : CALPHAD method * lead-free solders * thermodynamic database Subject RIV: BJ - Thermodynamics Impact factor: 1.435, year: 2012

  18. Circuit reliability boosted by soldering pins of disconnect plugs to sockets

    Science.gov (United States)

    Pierce, W. B.

    1964-01-01

    Where disconnect pins must be used for wiring and testing a circuit, improved system reliability is obtained by making a permanent joint between pins and sockets of the disconnect plug. After the circuit has been tested, contact points may be fused through soldering, brazing, or welding.

  19. Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

    Energy Technology Data Exchange (ETDEWEB)

    Hamm, Randy; Peterson, Kenneth A.

    2015-10-01

    This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.

  20. Fatigue damage modeling in solder interconnects using a cohesive zone approach

    NARCIS (Netherlands)

    Abdul-Baqi, A.J.J.; Schreurs, P.J.G.; Geers, M.G.D.

    2005-01-01

    The objective of this work is to model the fatigue damage process in a solder bump subjected to cyclic loading conditions. Fatigue damage is simulated using the cohesive zone methodology. Damage is assumed to occur at interfaces modeled through cohesive zones in the material, while the bulk material

  1. Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy

    Directory of Open Access Journals (Sweden)

    Abdoul-Aziz Bogno

    2015-01-01

    Full Text Available The properties and performance of lead-free solder alloys such as fluidity and wettability are defined by the alloy composition and solidification microstructure. Rapid solidification of metallic alloys is known to result in refined microstructures with reduced microsegregation and improved mechanical properties of the final products as compared to normal castings. The rapidly solidified Sn-based solders by melt spinning were shown to be suitable for soldering with low temperature and short soldering duration. In the present study, rapidly solidified Sn–0.7 wt.%Cu droplets generated by impulse atomization (IA were achieved as well as directional solidification under transient conditions at lower cooling rate. This paper reports on a comparative study of the rapidly solidified and the directionally solidified samples. Different but complementary characterization techniques were used to fully analyze the solidification microstructures of the samples obtained under the two cooling regimes. These include X-ray diffractometry (XRD and scanning electron microscopy (SEM. In order to compare the tensile strength and elongation to fracture of the directionally solidified ingot and strip castings with the atomized droplet, compaction and extrusion of the latter were carried out. It was shown that more balanced and superior tensile mechanical properties are available for the hot extruded samples from compacted as-atomized Sn–0.7 wt.%Cu droplets. Further, elongation-to-fracture was 2–3× higher than that obtained for the directionally solidified samples.

  2. Development of high melting point, environmentally friendly solders, using the calphad approach

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2008-01-01

    An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Vario...... tension have also been considered. Special focus has been given to toxicity related issues since the main ideology of looking for an alternative to high lead containing solders is not related to technical issues but due to environmental concerns.......An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Various...... of promising solder alloy candidates. The ternary combinations that satisfied the primary solidification requirement were scrutinized taking into account the commercial interests i.e. availability, cost-effectiveness, recyclability and toxicity issues. Technical issues like manufacturability and surface...

  3. Electrochemical migration of lead-free solder alloys in Na2SO4 environment

    DEFF Research Database (Denmark)

    Medgyes, Balint; Ádám, Sándor; Tar, Lajos

    2017-01-01

    The effect of sulphate ion concentration on electrochemical migration of lead-free solder alloys was investigated with the use of water drop tests, by applying an in-situ optical and electrical inspection system. According to the Mean-Time-To-Failure (MTTF) values it was found that in the case of...

  4. Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

    Directory of Open Access Journals (Sweden)

    Shoudong Gu

    2016-06-01

    Full Text Available To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 μm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within ±3%.

  5. Characterizing performances of solder paste printing process at flexible manufacturing lines

    International Nuclear Information System (INIS)

    Siew, Jit Ping; Low, Heng Chin; Teoh, Ping Chow

    2015-01-01

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter

  6. Characterizing performances of solder paste printing process at flexible manufacturing lines

    Energy Technology Data Exchange (ETDEWEB)

    Siew, Jit Ping; Low, Heng Chin [University of Science Malaysia, 11800 Minden, Penang (Malaysia); Teoh, Ping Chow [Wawasan Open University, 54 Jalan Sultan Ahmad Shah, 10050 Penang (Malaysia)

    2015-02-03

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.

  7. Leaching of vanadium from sulphuric acid manufacture spent catalysts

    Directory of Open Access Journals (Sweden)

    García, Diego Juan

    2001-02-01

    Full Text Available Recovery of vanadium contained in spent catalysts from the manufacture of sulphuric acid has been studied in this work, resulting in an industrial multistage process for the treatment of them avoiding direct deposition or dumping. Characterization of supplied spent catalysts samples, confirmed vanadium levels showed in the literature. The study of variables influencing leaching process: type of leaching agent, leaching agent concentration, S/L ratio, stirring speed and temperature, allows to fix the most advantageous conditions using industrial application criterion and verifying that the process is difusión controlled. The work is completed by developing an industrial leaching cycle simulation with the aim of reproducing real performance of spent catalyst, proposing operating conditions, and verifying the non-toxic character of the final residue obtained.

    En el presente trabajo se ha estudiado la recuperación del vanadio contenido en los catalizadores agotados procedentes de la fabricación del ácido sulfúrico, planteando un proceso industrial multietapa para el tratamiento de estos residuos, evitando su deposición o vertido directos. La caracterización de las muestras de catalizadores agotados disponibles confirmó los valores encontrados en la bibliografía. Se estudiaron las variables que influyen en el proceso de lixiviación (tipo de agente de lixiviación y concentración del mismo, relación S/L, velocidad de agitación y temperatura definiendo las condiciones más adecuadas desde el punto de vista industrial y verificando que el proceso está controlado por mecanismos difusionales. El trabajo se completa con la simulación de un ciclo industrial de lavado del catalizador y la verificación de la nula toxicidad de los lixiviados obtenidos por degradación del residuo final. 24 Aplicación de la resistencia de ruido al estudio de pinturas ricas en zinc Noise resistance applied to the study of zinc rich paints

  8. ALUMINUM AND CHROMIUM LEACHING WORKSHOP WHITEPAPER

    International Nuclear Information System (INIS)

    McCabe, D; Jeff Pike, J; Bill Wilmarth, B

    2007-01-01

    A workshop was held on January 23-24, 2007 to discuss the status of processes to leach constituents from High Level Waste (HLW) sludges at the Hanford and Savannah River Sites. The objective of the workshop was to examine the needs and requirements for the HLW flowsheet for each site, discuss the status of knowledge of the leaching processes, communicate the research plans, and identify opportunities for synergy to address knowledge gaps. The purpose of leaching of non-radioactive constituents from the sludge waste is to reduce the burden of material that must be vitrified in the HLW melter systems, resulting in reduced HLW glass waste volume, reduced disposal costs, shorter process schedules, and higher facility throughput rates. The leaching process is estimated to reduce the operating life cycle of SRS by seven years and decrease the number of HLW canisters to be disposed in the Repository by 1000 [Gillam et al., 2006]. Comparably at Hanford, the aluminum and chromium leaching processes are estimated to reduce the operating life cycle of the Waste Treatment Plant by 20 years and decrease the number of canisters to the Repository by 15,000-30,000 [Gilbert, 2007]. These leaching processes will save the Department of Energy (DOE) billions of dollars in clean up and disposal costs. The primary constituents targeted for removal by leaching are aluminum and chromium. It is desirable to have some aluminum in glass to improve its durability; however, too much aluminum can increase the sludge viscosity, glass viscosity, and reduce overall process throughput. Chromium leaching is necessary to prevent formation of crystalline compounds in the glass, but is only needed at Hanford because of differences in the sludge waste chemistry at the two sites. Improving glass formulations to increase tolerance of aluminum and chromium is another approach to decrease HLW glass volume. It is likely that an optimum condition can be found by both performing leaching and improving

  9. Hypospadias repair using laser tissue soldering (LTS): preliminary results of a prospective randomized study

    Science.gov (United States)

    Kirsch, Andrew J.; Cooper, Christopher S.; Canning, Douglas A.; Snyder, Howard M., III; Zderic, Stephen A.

    1998-07-01

    Purpose: The purpose of this study was to evaluate laser tissue soldering using an 808 nm diode laser and wavelength- matched human albumin solder for urethral surgery in children. Methods: Currently, 30 boys, ages 3 months to 8 years were randomized to standard suturing (n equals 22) or 'sutureless' laser hypospadias repair (n equals 18). Laser soldering was performed with a human albumin solder doped with indocyanine green dye (2.5 mg/ml) using a laser power output of 0.5 W, pulse duration of 0.5 sec, and interval of 0.1 sec. Power density was approximately 16 W/cm2. In the laser group, sutures were used for tissue alignment only. At the time of surgery, neourethral and penile lengths, operative time for urethral repair, and number of sutures/throws were measured. Postoperatively, patients were examined for complications of wound healing, stricture, or fistula formation. Results: Mean age, severity of urethral defect, type of repair, and neourethra length were equivalent between the two groups. Operative time was significantly faster for laser soldering in both simple (1.6 plus or minus 0.21 min, p less than 0.001) and complex (5.4 plus or minus 0.28 min, p less than 0.0001) hypospadias repairs compared to controls (10.6 plus or minus 1.4 min and 27.8 plus or minus 2.9 min, respectively). The mean number of sutures used in the laser group for simple and complex repairs (3.3 plus or minus 0.3 and 8.1 plus or minus 0.64, respectively) were significantly (p less than 0.0001) less than for controls (8.2 plus or minus 0.84 and 20 plus or minus 2.3, respectively). Followup was between 3 months and 14 months. The overall complication rate in the laser group (11%) was lower than the controls (23%). However, statistical significance (p less than 0.05) was achieved only for the subgroup of patients undergoing simple repairs (LTS, 100% success versus suturing, 69% success). Conclusions: These preliminary results indicate that laser tissue soldering for hypospadias repair

  10. Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

    DEFF Research Database (Denmark)

    Conseil, Helene; Verdingovas, Vadimas; Jellesen, Morten Stendahl

    2016-01-01

    No-clean flux systems are used today for the soldering of electronic printed circuit board assemblies assuming that all the aggressive substances of the flux will vanish during the soldering process i.e. evaporate, decompose or being enclosed safely in the residues. However this is not true in most...... that the fluxes do not decompose fully within the temperature regime of the soldering process, leaving behind significant level of weak organic acid residues. The residue depending on the type and amount can be can be very aggressive towards the corrosion on the printed circuit board assemblies. The glutaric acid...

  11. Laser solder welding of articular cartilage: tensile strength and chondrocyte viability.

    Science.gov (United States)

    Züger, B J; Ott, B; Mainil-Varlet, P; Schaffner, T; Clémence, J F; Weber, H P; Frenz, M

    2001-01-01

    The surgical treatment of full-thickness cartilage defects in the knee joint remains a therapeutic challenge. Recently, new techniques for articular cartilage transplantation, such as mosaicplasty, have become available for cartilage repair. The long-term success of these techniques, however, depends not only on the chondrocyte viability but also on a lateral integration of the implant. The goal of this study was to evaluate the feasibility of cartilage welding by using albumin solder that was dye-enhanced to allow coagulation with 808-nm laser diode irradiation. Conventional histology of light microscopy was compared with a viability staining to precisely determine the extent of thermal damage after laser welding. Indocyanine green (ICG) enhanced albumin solder (25% albumin, 0.5% HA, 0.1% ICG) was used for articular cartilage welding. For coagulation, the solder was irradiated through the cartilage implant by 808-nm laser light and the tensile strength of the weld was measured. Viability staining revealed a thermal damage of typically 500 m in depth at an irradiance of approximately 10 W/cm(2) for 8 seconds, whereas conventional histologies showed only half of the extent found by the viability test. Heat-bath investigations revealed a threshold temperature of minimum 54 degrees C for thermal damage of chondrocytes. Efficient cartilage bonding was obtained by using bovine albumin solder as adhesive. Maximum tensile strength of more than 10 N/cm(2) was achieved. Viability tests revealed that the thermal damage is much greater (up to twice) than expected after light microscopic characterization. This study shows the feasibility to strongly laser weld cartilage on cartilage by use of a dye-enhanced albumin solder. Possibilities to reduce the range of damage are suggested. Copyright 2001 Wiley-Liss, Inc.

  12. Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

    Science.gov (United States)

    Coyle, Richard J.; Sweatman, Keith; Arfaei, Babak

    2015-09-01

    Thermal fatigue is a major source of failure of solder joints in surface mount electronic components and it is critically important in high reliability applications such as telecommunication, military, and aeronautics. The electronic packaging industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu alloys first established as replacements for eutectic SnPb. This paper discusses the results from Pb-free solder joint reliability programs sponsored by two industry consortia. The characteristic life in accelerated thermal cycling is reported for 12 different Pb-free solder alloys and a SnPb control in 9 different accelerated thermal cycling test profiles in terms of the effects of component type, accelerated thermal cycling profile and dwell time. Microstructural analysis on assembled and failed samples was performed to investigate the effect of initial microstructure and its evolution during accelerated thermal cycling test. A significant finding from the study is that the beneficial effect of Ag on accelerated thermal cycling reliability (measured by characteristic lifetime) diminishes as the severity of the accelerated thermal cycling, defined by greater ΔT, higher peak temperature, and longer dwell time increases. The results also indicate that all the Pb-free solders are more reliable in accelerated thermal cycling than the SnPb alloy they have replaced. Suggestions are made for future work, particularly with respect to the continued evolution of alloy development for emerging application requirements and the value of using advanced analytical methods to provide a better understanding of the effect of microstructure and its evolution on accelerated thermal cycling performance.

  13. Spent LWR fuel leach tests: Waste Isolation Safety Assessment program

    International Nuclear Information System (INIS)

    Katayama, Y.B.

    1979-04-01

    Spent light-water-reactor (LWR) fuels with burnups of 54.5, 28 and 9 MWd/kgU were leach-tested in deionized water at 25 0 C. Fuel burnup has no apparent effect on the calculated leach rates based upon the behavior of 137 Cs and 239+240 Pu. A leach test of 54.5 MWd/kgU spent fuel in synthetic sea brine showed that the cesium-based leach rate is lower in sea brine than in deionized water. A rise in the leach rate was observed after approximately 600 d of cumulative leaching. During the rise, the leach rate for all the measured radionuclides become nearly equal. Evidence suggests that exposure of new surfaces to the leachant may cause the increase. As a result, experimental work to study leaching mechanisms of spent fuel has been initiated. 22 figures

  14. Process for the leaching of AP from propellant

    Science.gov (United States)

    Shaw, G. C.; Mcintosh, M. J. (Inventor)

    1980-01-01

    A method for the recovery of ammonium perchlorate from waste solid rocket propellant is described wherein shredded particles of the propellant are leached with an aqueous leach solution containing a low concentration of surface active agent while stirring the suspension.

  15. Heap leaching of clay ish uranium ores

    International Nuclear Information System (INIS)

    Gonzalez, E.; Sedano, A.

    1973-01-01

    This paper describes an experimental facility, built near El Lobo mine. In it we study the beneficiation of low-grade uranium ore. The mineral has a great amount of clay and fines. The flow-sheet used has four steps: head leaching, ph-ajustement, ion-exchange and participation. We show, also, the most interesting results. (Author)

  16. Implementation of the Leaching Environmental Assessment ...

    Science.gov (United States)

    LEAF provides a uniform and integrated approach for evaluating leaching from solid materials (e.g., waste, treated wastes such as by solidification/stabilization, secondary materials such as blast furnace slags, energy residuals such as coal fly ash, soil, sediments, mining and mineral processing wastes). Assessment using LEAF applies a stepwise approach that considers the leaching behavior of COPCs in response to chemical and physical factors that control and material properties across a range of plausible field conditions (US EPA, 2010). The framework provides the flexibility to tailor testing to site conditions and select the extent of testing based on assessment objectives and the level of detailed information needed to support decision-making. The main focus will be to discuss the implementation of LEAF in the US and the How to Guide that has recently been completed. To present the How To Guide for the implementation of the leaching environmental assessment framework to an international audience already familiar with comparable leaching tests in use in Europe. Will be meeting with European colleagues on their interest in expanding methods to include organics.

  17. Metal leaching from refinery waste hydroprocessing catalyst.

    Science.gov (United States)

    Marafi, Meena; Rana, Mohan S

    2018-05-18

    The present study aims to develop an eco-friendly methodology for the recovery of nickel (Ni), molybdenum (Mo), and vanadium (V) from the refinery waste spent hydroprocessing catalyst. The proposed process has two stages: the first stage is to separate alumina, while the second stage involves the separation of metal compounds. The effectiveness of leaching agents, such as NH 4 OH, (NH 4 ) 2 CO 3 , and (NH 4 ) 2 S 2 O 8 , for the extraction of Mo, V, Ni, and Al from the refinery spent catalyst has been reported as a function of reagent concentration (0.5 to 2.0 molar), leaching time (1 to 6 h), and temperature (35 to 60°C). The optimal leaching conditions were achieved to obtain the maximum recovery of Mo, Ni, and V metals. The effect of the mixture of multi-ammonium salts on the metal extraction was also studied, which showed an adverse effect for Ni and V, while marginal improvement was observed for Mo leaching. The ammonium salts can form soluble metal complexes, in which stability or solubility depends on the nature of ammonium salt and the reaction conditions. The extracted metals and support can be reused to synthesize a fresh hydroprocessing catalyst. The process will reduce the refinery waste and recover the expensive metals. Therefore, the process is not only important from an environmental point of view but also vital from an economic perspective.

  18. Leaching of Plastic Additives to Marine Organisms

    NARCIS (Netherlands)

    Koelmans, A.A.; Besseling, E.; Foekema, E.M.

    2014-01-01

    It is often assumed that ingestion of microplastics by aquatic species leads to increased exposure to plastic additives. However, experimental data or model based evidence is lacking. Here we assess the potential of leaching of nonylphenol (NP) and bisphenol A (BPA) in the intestinal tracts of

  19. Gold and Silver Extraction from Leach Solutions

    OpenAIRE

    Bagdaulet K. Kenzhaliyev; Renata R. Iskhakova; Zamzagul D. Dosymbaeva; Esen N. Sulejmenov

    2014-01-01

    There has been carried out an investigation on the extraction of gold and silver from thiosulfate solutions: standard test and technological solutions of chemical and electrochemical leaching. The influence of related metals on the process of extracting gold from solution was studied. There has been conducted a comparative study of the IR spectra of solutions after the sorption of gold, silver and related metals.

  20. Leaching of transuranics observed in lysimeter experiments

    International Nuclear Information System (INIS)

    Erikson, A.; Fredriksson, L.

    1994-01-01

    A lysimeter installation, primarily designed for studies on plant uptake of transuranics from a number of Swedish soils, has been used also for studies on leaching of nuclides with drainage water from contaminated top soil layers in lysimeter vessels through 65 cm subsoil layers. Interception by ion exchanging resins simulated the nuclide transfer to a field drainage system. The study dealt with the contamination of agricultural land. The results obtained in the experiments have to be interpreted cautiously with regard to their bearing on field conditions. Also, the experimental period has been short when compared with the expected ecological half time of transuranic elements in the environment. However, the results indicate that over a first decade the leaching to drainage systems of transuranics in equilibrium with soil environments is of the same order as that of the crop uptake. The ranges assessed for leaching with an excess precipitation of 200 mm from a deposit in the plough layer to the drainage system during a decade are: for plutonium - 0.003-0.8%, for americium - 0.004-0.006% and for neptunium - 0.03-0.06%. The values for plutonium and americium are very similar except for the organic soil used which held the former nuclide very loosely bound. The leaching of neptunium seems to be ten times that for the other nuclides. It is higher on sandy soils than on organic and clay soils. (author)

  1. Duality properties of Gorringe Leach equations

    Science.gov (United States)

    Grandati, Yves; Bérard, Alain; Mohrbach, Hervé

    2009-02-01

    In the category of motions preserving the angular momentum direction, Gorringe and Leach exhibited two classes of differential equations having elliptical orbits. After enlarging slightly these classes, we show that they are related by a duality correspondence of the Arnold Vassiliev type. The specific associated conserved quantities (Laplace Runge Lenz vector and Fradkin Jauch Hill tensor) are then dual reflections of each other.

  2. COPPER LEACHING FROM WASTE ELECTRIC CABLES BY BIOHYDROMETALLURGY

    OpenAIRE

    Lambert, Fanny; Bastin, David; Gaydardzhiev, Stoyan; Léonard, Grégoire

    2015-01-01

    This study examines the leaching of copper from waste electric cables by chemical leaching and leaching catalysed by Acidithiobacillus ferrooxidans in terms of leaching kinetics and reagents consumption. Operational parameters such as the nature of the oxidant (Fe3+, O2), the initial ferric iron concentration (0-10 g/L) and the temperature (21-50°C) were identified to have an important influence on the degree of copper solubilisation. At optimal process conditions, copper extraction above 90%...

  3. Enhancements of LEACH Algorithm for Wireless Networks: A Review

    Directory of Open Access Journals (Sweden)

    M. Madheswaran

    2013-12-01

    Full Text Available Low Energy Adaptive Clustering Hierarchy (LEACH protocol is the first hierarchical cluster based routing protocol successfully used in the Wireless Sensor Networks (WSN. In this paper, various enhancements used in the original LEACH protocol are examined. The basic operations, advantages and limitations of the modified LEACH algorithms are compared to identify the research issues to be solved and to give the suggestions for the future proposed routing algorithms of wireless networks based on LEACH routing algorithm.

  4. Acid agglomeration heap leaching: present status, principle and applications

    International Nuclear Information System (INIS)

    Zeng Yijun

    2004-01-01

    For extracting valuable metal from clay-bearing acidic ores of poor permeability, agglomerated acid heap leaching appears to be the most effective method, whereas conventional leaching and general heap leaching bring about unsatisfactory recovery and poor economic returns. The present state of research work on acid agglomeration worldwide and its basic principle are discussed. The first commercial application employing acid agglomeration-heap leaching in China is also introduced

  5. Long-term lessons on pesticide leaching obtained via the Danish Pesticide Leaching Assessment Programme

    DEFF Research Database (Denmark)

    Rosenbom, Anette E.; Olsen, Preben; Plauborg, Finn

    To avoid any unacceptable influence on the environment posed by pesticides and their degradation products, all pesticides used in the European Union needs authorization. The authorization procedure includes assessing the leaching risk of both pesticides and their degradation products...

  6. Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock

    Science.gov (United States)

    Han, Jing; Tan, Shihai; Guo, Fu

    2018-01-01

    Ball grid array (BGA) samples were soldered on a printed circuit board with Sn37Pb solder paste to investigate the recrystallization induced by subgrain rotation during thermal shock. The composition of the solder balls was Sn3.0Ag0.5Cu-Sn37Pb, which comprised mixed solder joints. The BGA component was cross-sectioned before thermal shock. The microstructure and grain orientations were obtained by a scanning electron microscope equipped with an electron back-scattered diffraction system. Two mixed solder joints at corners of the BGA component were selected as the subjects. The results showed that recrystallization occurred at the corner of the solder joints after 200 thermal shock cycles. The recrystallized subgrains had various new grain orientations. The newly generated grain orientations were closely related to the initial grain orientations, which indicated that different subgrain rotation behaviors could occur in one mixed solder joint with the same initial grain orientation. When the misorientation angles were very small, the rotation axes were about Sn [100], [010] and [001], as shown by analyzing the misorientation angles and subgrain rotation axes, while the subgrain rotation behavior with large misorientation angles in the solder joints was much more complicated. As Pb was contained in the solder joints and the stress was concentrated on the corner of the mixed solder joints, concaves and cracks were formed. When the adjacent recrystallized subgrains were separated, and the process of the continuous recrystallization was limited.

  7. The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

    Science.gov (United States)

    Jang, Guh-Yaw; Duh, Jenq-Gong

    2005-01-01

    The eutectic Sn-Ag solder alloy is one of the candidates for the Pb-free solder, and Sn-Pb solder alloys are still widely used in today’s electronic packages. In this tudy, the interfacial reaction in the eutectic Sn-Ag and Sn-Pb solder joints was investigated with an assembly of a solder/Ni/Cu/Ti/Si3N4/Si multilayer structures. In the Sn-3.5Ag solder joints reflowed at 260°C, only the (Ni1-x,Cux)3Sn4 intermetallic compound (IMC) formed at the solder/Ni interface. For the Sn-37Pb solder reflowed at 225°C for one to ten cycles, only the (Ni1-x,Cux)3Sn4 IMC formed between the solder and the Ni/Cu under-bump metallization (UBM). Nevertheless, the (Cu1-y,Niy)6Sn5 IMC was observed in joints reflowed at 245°C after five cycles and at 265°C after three cycles. With the aid of microstructure evolution, quantitative analysis, and elemental distribution between the solder and Ni/Cu UBM, it was revealed that Cu content in the solder near the solder/IMC interface played an important role in the formation of the (Cu1-y,Niy)6Sn5 IMC. In addition, the diffusion behavior of Cu in eutectic Sn-Ag and Sn-Pb solders with the Ni/Cu UBM were probed and discussed. The atomic flux of Cu diffused through Ni was evaluated by detailed quantitative analysis in an electron probe microanalyzer (EPMA). During reflow, the atomic flux of Cu was on the order of 1016-1017 atoms/cm2sec in both the eutectic Sn-Ag and Sn-Pb systems.

  8. Pesticide leaching through sandy and loamy fields - long-term lessons learnt from the Danish Pesticide Leaching Assessment Programme.

    Science.gov (United States)

    Rosenbom, Annette E; Olsen, Preben; Plauborg, Finn; Grant, Ruth; Juhler, René K; Brüsch, Walter; Kjær, Jeanne

    2015-06-01

    The European Union authorization procedure for pesticides includes an assessment of the leaching risk posed by pesticides and their degradation products (DP) with the aim of avoiding any unacceptable influence on groundwater. Twelve-year's results of the Danish Pesticide Leaching Assessment Programme reveal shortcomings to the procedure by having assessed leaching into groundwater of 43 pesticides applied in accordance with current regulations on agricultural fields, and 47 of their DP. Three types of leaching scenario were not fully captured by the procedure: long-term leaching of DP of pesticides applied on potato crops cultivated in sand, leaching of strongly sorbing pesticides after autumn application on loam, and leaching of various pesticides and their DP following early summer application on loam. Rapid preferential transport that bypasses the retardation of the plow layer primarily in autumn, but also during early summer, seems to dominate leaching in a number of those scenarios. Copyright © 2015 Elsevier Ltd. All rights reserved.

  9. Laboratory study on leaching of a sandstone-type uranium deposit for acid in-situ leaching

    International Nuclear Information System (INIS)

    Wen Zhenqian; Yao Yixuan; Zheng Jianping; Jiang Yan; Cui Xin; Xing Yongguo; Hao Jinting; Tang Huazhang

    2013-01-01

    Ore samples were took from in-situ leaching experiment boreholes in a sandstone-type uranium deposit. Technological mineralogy study, agitating leaching and column leaching experiments were carried. The results show that the content of minerals consuming acid and deoxidized minerals is low. When sulfuric acid concentration was 1O g/L, initial uranium content was 0.0224%, and liquid-to-solid ratio was l.91, leaching rate of column leaching experiments is 89.19%, acid consumption is 8.2 kg/t ore, acid consumption is 41.88 t/tU. Acid leaching, technology is recommend for field in-situ leaching experiment, sulfuric acid concentration in confecting solution is 10 g/L, and oxidizing agent is needless during leaching process. (authors)

  10. Leaching of Titanium and Silicon from Low-Grade Titanium Slag Using Hydrochloric Acid Leaching

    Science.gov (United States)

    Zhao, Longsheng; Wang, Lina; Qi, Tao; Chen, Desheng; Zhao, Hongxin; Liu, Yahui; Wang, Weijing

    2018-05-01

    Acid-leaching behaviors of the titanium slag obtained by selective reduction of vanadium-bearing titanomagnetite concentrates were investigated. It was found that the optimal leaching of titanium and silicon were 0.7% and 1.5%, respectively. The titanium and silicon in the titanium slag were firstly dissolved in the acidic solution to form TiO2+ and silica sol, and then rapidly reprecipitated, forming hydrochloric acid (HCl) leach residue. Most of the silicon presented in the HCl leach residue as floccules-like silica gel, while most of the titanium was distributed in the nano-sized rod-like clusters with crystallite refinement and intracrystalline defects, and, as such, 94.3% of the silicon was leached from the HCl leach residue by alkaline desilication, and 96.5% of the titanium in the titanium-rich material with some rutile structure was then digested by the concentrated sulfuric acid. This provides an alternative route for the comprehensive utilization of titanium and silicon in titanium slag.

  11. The Effect of Reflow on Wettability of Sn 96.5 Ag 3 Cu 0.5 Solder

    Directory of Open Access Journals (Sweden)

    Zoltán Weltsch

    2012-11-01

    Full Text Available Surface conditions on Printed Circuit Board (PCB final finishes have an important impact on the wetting behaviour with lead-free solder. The improvement of wettability in liquid Sn 96.5 Ag 3 Cu 0.5 Solder alloy on PCB substrate was measured with a sessile drop method at 523 K temperature. Wetting properties was determined in normal atmospheric air and inert atmosphere. The wetting angles increasing with the number of reflows both atmosphere. The effect of the atmosphere has a huge importance of the oxidation which manifests itself of the measured wetting angles. One of the most important factors to the wetting properties is the amount of oxygen in the soldering atmosphere. Using the inert atmosphere is crucial to Pb-free solders, particularly after reflows.

  12. The effects of large scale processing on caesium leaching from cemented simulant sodium nitrate waste

    International Nuclear Information System (INIS)

    Lee, D.J.; Brown, D.J.

    1982-01-01

    The effects of large scale processing on the properties of cemented simulant sodium nitrate waste have been investigated. Leach tests have been performed on full-size drums, cores and laboratory samples of cement formulations containing Ordinary Portland Cement (OPC), Sulphate Resisting Portland Cement (SRPC) and a blended cement (90% ground granulated blast furnace slag/10% OPC). In addition, development of the cement hydration exotherms with time and the temperature distribution in 220 dm 3 samples have been followed. (author)

  13. Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

    OpenAIRE

    Koo, Ja-Myeong; Jung, Seung-Boo

    2007-01-01

    Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920); International audience; Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafte...

  14. Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

    International Nuclear Information System (INIS)

    Koo, Jahyun; Lee, Changsoo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck Mo

    2015-01-01

    It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu_3_3Al_1_7, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu_6Sn_5 networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu_6Sn_5 IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu_3_3Al_1_7 IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

  15. A FPGA implementation of solder paste deposit on printed circuit boards errors detector based in a bright and contrast algorithm

    OpenAIRE

    De Luca-Pennacchia, A.; Sánchez-Martínez, M. Á.

    2007-01-01

    Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be ...

  16. Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

    Energy Technology Data Exchange (ETDEWEB)

    Koo, Jahyun; Lee, Changsoo [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of); Hong, Sung Jea [MK Electron Co., Ltd., Yongin Cheoin-gu 316-2 (Korea, Republic of); Kim, Keun-Soo, E-mail: keunsookim@hoseo.edu [Department of Display Engineering, Hoseo University, Asan 336-795 (Korea, Republic of); Lee, Hyuck Mo, E-mail: hmlee@kaist.ac.kr [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of)

    2015-11-25

    It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu{sub 33}Al{sub 17}, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu{sub 6}Sn{sub 5} networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu{sub 6}Sn{sub 5} IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu{sub 33}Al{sub 17} IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

  17. Partitioning and Leaching Behavior of Actinides and Rare Earth Elements in a Zirconolite- Bearing Hydrothermal Vein System

    International Nuclear Information System (INIS)

    Payne, Timothy E.; Hart, Kaye P.; Lumpkin, Gregory R.; McGlinn, Peter J.; Giere, Reto

    2007-01-01

    Chemical extraction techniques and scanning electron microscopy were used to study the distribution and behavior of actinides and rare earth elements (REE) in hydrothermal veins at Adamello (Italy). The six samples discussed in this paper were from the phlogopite zone, which is one of the major vein zones. The samples were similar in their bulk chemical composition, mineralogy, and leaching behavior of major elements (determined by extraction with 9 M HCl). However, there were major differences in the extractability of REE and actinides. The most significant influence on the leaching characteristics appears to be the amounts of U, Th and REE incorporated in resistant host phases (zirconolite and titanite) rather than readily leached phases (such as apatite). Uranium and Th are very highly enriched in zirconolite grains. Actinides were more readily leached from samples with a higher content of U and Th, relative to the amount of zirconium. The results show that REE and actinides present in chemically resistant host minerals can be retained under aggressive leaching conditions. (authors)

  18. THE POSSIBILITY OF USING LASER-ULTRASOUND TO MONITOR THE QUALITY SOLDERED CONNECTIONS CHAMBERS OF LIQUID ROCKET ENGINES

    Directory of Open Access Journals (Sweden)

    N. V. Astredinova

    2014-01-01

    Full Text Available During the manufacturing process to the design of modern liquid rocket engines are presented important requirements, such as minimum weight, maximum stiffness and strength of nodes, maximum service life in operation, high reliability and quality of soldered and welded seams. Due to the high quality requirements soldered connections and the specific design of the nozzle, it became necessary in the development and testing of a new non-conventional non-destructive testing method – laser-ultrasound diagnosis. In accordance with regulatory guidelines, quality control soldered connections is allowed to use an acoustic kind of control methods of the reflected light, transmitted light, resonant, free vibration and acoustic emission. Attempts to use traditional methods of non-destructive testing did not lead to positive results. This is due primarily to the size of typical solder joint defects, as well as the structural features of the rocket engine, the data structure is not controllable. In connection with this, a new method that provides quality control soldered connections cameras LRE based on the thermo generation of ultrasound. Methods of ultrasonic flaw detection of photoacoustic effect, in most cases, have a number of advantages over methods that use standard (traditional piezo transducers. In the course of studies have found that the sensitivity of the laser-ultrasonic method and flaw detector UDL-2M can detect lack of adhesion in the solder joints on the upper edges of the nozzle in the sub-header area of the site.

  19. Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

    Directory of Open Access Journals (Sweden)

    Soares D.

    2007-01-01

    Full Text Available Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layers. The effect of the addition of P, at low levels, on the chemical composition of the layers present at the interface was studied. The phases formed at the interface between the Cu or Ni substrate and a molten lead-free solder at 250ºC, were studied for different stage times and alloy compositions. The melting temperatures, of the studied alloys, were determined by Differential Scanning Calorimetry (DSC. Identification of equilibrium phases formed at the interface layer, and the evaluation of their chemical composition were performed by Scanning Electron Microscopy (SEM/EDS. Different interface characteristics were obtained, namely for the alloys containing Zn. The obtained IML layer thickness was compared, for both types of alloy systems.

  20. Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

    International Nuclear Information System (INIS)

    Yang, Ming; Ko, Yong-Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu

    2017-01-01

    Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

  1. Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Ming [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Ko, Yong-Ho [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Bang, Junghwan [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Kim, Taek-Soo [Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Lee, Chang-Woo, E-mail: cwlee@kitech.re.kr [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Li, Mingyu, E-mail: myli@hit.edu.cn [Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055 (China)

    2017-02-15

    Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

  2. Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows

    Science.gov (United States)

    Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

    2016-12-01

    Controlling the size, dispersion, and stability of intermetallic compounds in lead-free solder alloys is vital to creating reliable solder joints regardless of how many times the solder joints are melted and resolidified (reflowed) during circuit board assembly. In this article, the coarsening behavior of Cu x Al y and Cu6Sn5 in two Sn-Cu-Al alloys, a Sn-2.59Cu-0.43Al at. pct alloy produced via drip atomization and a Sn-5.39Cu-1.69Al at. pct alloy produced via melt spinning at a 5-m/s wheel speed, was characterized after multiple (1-5) reflow cycles via differential scanning calorimetry between the temperatures of 293 K and 523 K (20 °C and 250 °C). Little-to-no coarsening of the Cu x Al y particles was observed for either composition; however, clustering of Cu x Al y particles was observed. For Cu6Sn5 particle growth, a bimodal size distribution was observed for the drip atomized alloy, with large, faceted growth of Cu6Sn5 observed, while in the melt spun alloy, Cu6Sn5 particles displayed no significant increase in the average particle size, with irregularly shaped, nonfaceted Cu6Sn5 particles observed after reflow, which is consistent with shapes observed in the as-solidified alloys. The link between original alloy composition, reflow undercooling, and subsequent intermetallic coarsening behavior was discussed by using calculated solidification paths. The reflowed microstructures suggested that the heteroepitaxial relationship previously observed between the Cu x Al y and the Cu6Sn5 was maintained for both alloys.

  3. Life cycle assessment and residue leaching: the importance of parameter, scenario and leaching data selection.

    Science.gov (United States)

    Allegrini, E; Butera, S; Kosson, D S; Van Zomeren, A; Van der Sloot, H A; Astrup, T F

    2015-04-01

    Residues from industrial processes and waste management systems (WMSs) have been increasingly reutilised, leading to landfilling rate reductions and the optimisation of mineral resource utilisation in society. Life cycle assessment (LCA) is a holistic methodology allowing for the analysis of systems and products and can be applied to waste management systems to identify environmental benefits and critical aspects thereof. From an LCA perspective, residue utilisation provides benefits such as avoiding the production and depletion of primary materials, but it can lead to environmental burdens, due to the potential leaching of toxic substances. In waste LCA studies where residue utilisation is included, leaching has generally been neglected. In this study, municipal solid waste incineration bottom ash (MSWI BA) was used as a case study into three LCA scenarios having different system boundaries. The importance of data quality and parameter selection in the overall LCA results was evaluated, and an innovative method to assess metal transport into the environment was applied, in order to determine emissions to the soil and water compartments for use in an LCA. It was found that toxic impacts as a result of leaching were dominant in systems including only MSWI BA utilisation, while leaching appeared negligible in larger scenarios including the entire waste system. However, leaching could not be disregarded a priori, due to large uncertainties characterising other activities in the scenario (e.g. electricity production). Based on the analysis of relevant parameters relative to leaching, and on general results of the study, recommendations are provided regarding the use of leaching data in LCA studies. Copyright © 2014 Elsevier Ltd. All rights reserved.

  4. Leaching behaviour of strontium-90 in cement composites

    International Nuclear Information System (INIS)

    Matsuzuru, H.; Ito, A.

    1977-01-01

    The leaching of 90 Sr from a cement composite into an aqueous phase has been studied by the method recommended by IAEA. The amount leached was measured as functions of waste to cement ratio (Wa/C), salt content of waste, temperature of leachant and curing time of specimens. The leach coefficient of 90 Sr varies from ca. 6 x 10 -8 to 4 x 10 -7 cm 2 /day depending on the composition of specimen and the leaching conditions. The leachability depends on such factors as Wa/C, temperature of leachant and curing time. The Portland cement composite gives a higher leaching fraction than the slag cement one. Additives used have no significant effect on the leachability. The amount leached in deionized water as a leachant is higher than in synthetic sea water. On the basis of the results obtained, the amount of 90 Sr leached from a composite of 200 1 drum size for an extended period was estimated. (author)

  5. Pilot test of bacterial percolation leaching at Fuzhou uranium mine

    International Nuclear Information System (INIS)

    Fan Baotuan; Liu Jian; Jiang Yngqiong; Cai Chunhui; Jiang Lang; Zhou Renhua; Tong Changning; Zhang Hongli

    2006-01-01

    Total 18 t uranium ores of Fuzhou Uranium Mine packed in three or four columns in series were leached by bacterial percolation. The results show that without adding any other chemical oxidant such as sodium chlorate, the leaching rate measured by residue is 91.45%-94.48%, leaching time is 50-60 d, acid consumption is 6.17%-7.75%, and residue grade is 0.0149%-0.0208%. Compared with conventional percolation leaching process, the leaching rate is improved by 3%, leaching time is shorted by 26%, and acid consumption is saved by 34%. Accumulation pattern of ΣFe and F - in the process of leaching is discussed. Influence of F - on bacterial growth, regeneration of barren solution as well as correlative techniques are reviewed. (authors)

  6. Microbial leaching of low grade copper ores

    International Nuclear Information System (INIS)

    Rauf, A.; Ashfaq, M.

    1991-01-01

    Biotechnology is regarded as one of the most promising and revolutionary solution to various problems which are generally faced in the extraction of metals from their ores such as high energy, capital costs and environmental pollution. The paper deals with the study of low grade copper ores for their beneficiation and extraction of copper. The ores used were chalcopyrite and oxidized copper ores. Microorganisms play a vital role in the solubilization of valuable contents from ores such as copper and other metals. Studies have been conducted on the indigenous copper ores by using thiobacillus ferro oxidans and thiobacillus thio oxidans. For comparison purpose some experiments have also been conducted by chemical leaching. The results of bacterial leaching are encouraging. (author)

  7. Leaching of Electronic Waste Using Biometabolised Acids

    Institute of Scientific and Technical Information of China (English)

    M. Saidan; B. Brown; M. Valix

    2012-01-01

    The revolution in information and communication technology has brought huge technical benefits and wealth, but has created a major global problem: the generation of vast amounts of electronic waste, or e-waste through product obsolesce. The challenge in managing e-waste will be in developing sustainable recycling tech- nologies that are able to address the volume and complexity of this waste using cost effective and ecologically sen-sitive methods. In this study, the capability or microorganism metabolic acids in dissolving the metallic tractions from waste printed circuit boards was examined. Several factors were considered in the examination of the activityof the acids-including secondary reactions, solution pH, temperature and the nature of ligands in solutions (or bioacid constituents). The leaching tests were cgnducted ex-situ, using synthetic organic acids. Leaching was performed for periods of up to 6 hat 70-90 ℃ and 1000 r-min-1.

  8. Determining leach rates of monolithic waste forms

    International Nuclear Information System (INIS)

    Gilliam, T.M.; Dole, L.R.

    1986-01-01

    The ANS 16.1 Leach Procedure provides a conservative means of predicting long-term release from monolithic waste forms, offering a simple and relatively quick means of determining effective solid diffusion coefficients. As presented here, these coefficients can be used in a simple model to predict maximum release rates or be used in more complex site-specific models to predict actual site performance. For waste forms that pass the structural integrity test, this model also allows the prediction of EP-Tox leachate concentrations from these coefficients. Thus, the results of the ANS 16.1 Leach Procedure provide a powerful tool that can be used to predict the waste concentration limits in order to comply with the EP-Toxicity criteria for characteristically nonhazardous waste. 12 refs., 3 figs

  9. Leaching from denture base materials in vitro

    Energy Technology Data Exchange (ETDEWEB)

    Lygre, H.; Solheim, E.; Gjerdet, N.R. [School of Medicine, Univ. of Bergen (Norway)

    1995-04-01

    Specimens made from denture base materials were leached in Ringer Solution and in ethanol. The specimens comprised a heat-cured product processed in two different ways and two cold-cured materials. The organic compounds leaching from the specimens to the solutions were separated, identified, and quantified by a combined gas-chromatography and gas-chromatography/mass-spectrometry technique. Additives and degradation products, possibly made by free radical reactions, were released from the denture base materials. In Ringer solution only phthalates could be quantified. In ethanol solvent, biphenyl, dibutyl phthalate, dicyclohexyl phthalate, phenyl benzoate, and phenyl salicylate were quantified. In addition, copper was found in the ethanol solvent from one of the denture base materials. The amount of leachable organic compounds varies among different materials. Processing temperature influences the initial amount of leachable compounds. 36 refs., 7 figs., 1 tab.

  10. Leaching of saltstones containing fly ash

    International Nuclear Information System (INIS)

    Barnes, M.W.; Roy, D.M.; Langton, C.A.

    1985-01-01

    Two types of fly ash were incorporated in saltstones designed for potential encapsulation of Savannah River Plant low level defense waste. These fly ashes have some cementitious properties while at the same time their presence in substitution for cement slows early hydration. Class C fly ash has a high calcium content and is considered cementitious; Class F fly ash has a low calcium content and is not classified as cementitious. Leach tests were performed and physical properties were measured for saltstones containing each class, to see the differences in the effect of the fly ashes. The four waste ions nitrate, nitrite, sodium and sulfate were shown to leach by diffusion. Effective diffusivities were determined for these ions. Data for nitrate, the most important species from the environmental point of view, are shown in Table A. Saltstones made with Class C fly ash have substantially lower leach rates than those made with Class F fly ash. The leach rates, and therefore the square roots of the effective diffusivities, have been found to be proportional to the pore surface area per unit volume (or the ratio of pore volume to pore radius), to the fraction of waste containing solution, and to the inverse of the fraction of calcium in the saltstone. Rates and diffusivities are not proportional to the water to cement ratio, because this number depends on whether the fly ash is counted as cementitious, as in Class C cement, or not cementitious, as in Class F cement. In fact the relatively small amount of calcium in Class F cement contributes to the cementitious properties overall, though not so much as Class C cement. 4 refs., 2 figs., 6 tabs

  11. Gold and Silver Extraction from Leach Solutions

    Directory of Open Access Journals (Sweden)

    Bagdaulet K. Kenzhaliyev

    2014-03-01

    Full Text Available There has been carried out an investigation on the extraction of gold and silver from thiosulfate solutions: standard test and technological solutions of chemical and electrochemical leaching. The influence of related metals on the process of extracting gold from solution was studied. There has been conducted a comparative study of the IR spectra of solutions after the sorption of gold, silver and related metals.

  12. Residues leaching from 'Factory of barren ores'

    International Nuclear Information System (INIS)

    Rakhmatov, N.; Khakimov, N.; Nazarov, Kh.M.; Barotov, A.M.

    2012-01-01

    The objective of the present work is safe management of residues from Factory of Barren Ores, their reprocessing, expenditures reduction for remediation of Istiklol city former uranium tailings. For this purpose, some experiences were adopted - Factory of Barren Ores tailing use for filling up the open pit where water with uranium content 3-5 mg/l is located. Factory of Barren Ores waste are passed through heap leaching and have some amount of uranium salts dissolved in water. Thus, we propose to dissolve uranium from Factory of Barren Ores wastes with uranium bearing water flowing out from gallery and filling up the open-pit by radioactive wastes. In so doing, uranium content flowing out from gallery will increase twice, and further, passing them through apricot's shell, as a sorbent, we will clean the water against radionuclides. Residue samples with uranium content 0,015% from Factory of Barren Ores and uranium bearing waters from gallery 1 with uranium content 0,0025 g/l were used for laboratory tests. After which, a slurry was prepared by means of residue mixing with water in ratio of solid and liquid phases (S:L) - 1:2 and 9,7 ml of sulfuric acid (Ρ=1,82) was added which corresponds consumption by H 2 SO 4 176,54 kg/t. For the first test, leaching was carried out during 4 hours at ph=1,6 at room temperature. For the second test, leaching was carried out at 60 d eg C a nd ph=1,6 during 4 hours. Slurry heating and mixing was carried out by means of magnetic mixer. The basic residue leaching indicators are provided in this article.

  13. Thiosulfate leaching of gold from sulfide wastes

    Energy Technology Data Exchange (ETDEWEB)

    Block-Bolten, A.; Torma, A.E.

    1986-07-01

    The kinetics of gold extraction from lead-zinc sulfide flotation tailings by thiosulfate leachants has been investigated. The order of reaction as well as the overall reaction rate constant were, with respect to thiosulfate concentration, calculated to be n=0.75 and k=1.05 x 10/sup -6/ mol/sup 1/4/ dm/sup 5/4/ min/sup -1/. The apparent activation energy was found to be ..delta..E/sub a/=48.53 kJ and the frequency factor A=7.5 x 10/sup 2/ mol dm/sup -3/ min/sup -1/. This activation energy value suggests chemical control of the reaction mechanism. Optimum leach temperature of 50/sup 0/C was established. Gold extractions as high as 99% have been realized in two step countercurrent leachings. Change in pH throughout the leaching process was found to be an excellent indicator for the progress of the extraction. A preliminary economic evaluation of the process is given.

  14. Economic leaching at Roessing Uranium Limited

    International Nuclear Information System (INIS)

    Johnson, C.C.

    1990-01-01

    In the fourteen years that Roessing Uranium Limited has been in production, the metallurgical operations and controls on the leaching plant have envolved through four basic stages. Initially, the emphasis was placed on the achievement of consistent plant operation by overcoming severe start-up difficulties. The second stage involved the attainment of the design operating targets and also the commissioning of the ferric-leaching reactors in order to achieve a ferric ion concentration of more than 3.0 g/l. Improvements in control then became the priority, with the emphasis on consistently achieving the target concentrations of ferric ions, total iron, and terminal acidity. The latest phase has concentrated on the optimization of costs by means of adjustments to the historically established operating parameters in order to achieve large savings on consumables while maintaining the leaching efficiencies. Apart from the obvious incentive of reducing costs in an inflationary economy and a depressed uranium market, impetus for this work was given by a change in the type of ore from the open pit, which has the effect of reducing the extraction efficiency while increasing the consumption of consumable materials. These problems and their solutions are discussed in detail, and the importance to cost-effective optimization of an accurate up-to-date cost-reporting structure is stressed. 9 figs., 2 tabs

  15. Modeling of facade leaching in urban catchments

    Science.gov (United States)

    Coutu, S.; Del Giudice, D.; Rossi, L.; Barry, D. A.

    2012-12-01

    Building facades are protected from microbial attack by incorporation of biocides within them. Flow over facades leaches these biocides and transports them to the urban environment. A parsimonious water quantity/quality model applicable for engineered urban watersheds was developed to compute biocide release from facades and their transport at the urban basin scale. The model couples two lumped submodels applicable at the basin scale, and a local model of biocide leaching at the facade scale. For the facade leaching, an existing model applicable at the individual wall scale was utilized. The two lumped models describe urban hydrodynamics and leachate transport. The integrated model allows prediction of biocide concentrations in urban rivers. It was applied to a 15 km2urban hydrosystem in western Switzerland, the Vuachère river basin, to study three facade biocides (terbutryn, carbendazim, diuron). The water quality simulated by the model matched well most of the pollutographs at the outlet of the Vuachère watershed. The model was then used to estimate possible ecotoxicological impacts of facade leachates. To this end, exceedance probabilities and cumulative pollutant loads from the catchment were estimated. Results showed that the considered biocides rarely exceeded the relevant predicted no-effect concentrations for the riverine system. Despite the heterogeneities and complexity of (engineered) urban catchments, the model application demonstrated that a computationally "light" model can be employed to simulate the hydrograph and pollutograph response within them. It thus allows catchment-scale assessment of the potential ecotoxicological impact of biocides on receiving waters.

  16. Study of the sulfuric acid leaching and bacterial leaching of low grade uranium ore by orbital shaker experiment

    International Nuclear Information System (INIS)

    Li Guangyue; Liu Yulong; Wang Yongdong; Ding Dexin

    2009-01-01

    The sulphuric acid leaching and bacteria leaching by orbital shaker experiments were conducted for the low grade uranium ore from a uranium mine in Guangdong Province. The results show that, when the concentration of sulphuric acid and that of slurry were 30 g/L and 25%, respectively, the conditions were most favourable for sulphuric acid leaching and the rate of leaching reached 92.92%, that, when pH value was 1.5, inoculation amount, 10%, concentration of slurry, 10%, the conditions were most favourable for bacteria leaching and the rate of leaching reached 95.93%, that, compared with sulphuric acid leaching, bacteria leaching decreased sulphuric acid consumption by 17.2% and increased the rate of leaching by 3%, and that, under the most favourable conditions for suphuric acid leaching, if 1% natrium chlorate was added, the rate of leaching increased to 96.46%, but 10 kg of natrium chlorate was consumed for 1 ton of uranium ore. (authors)

  17. Pesticide leaching through sandy and loamy fields – Long-term lessons learnt from the Danish Pesticide Leaching Assessment Programme

    International Nuclear Information System (INIS)

    Rosenbom, Annette E.; Olsen, Preben; Plauborg, Finn; Grant, Ruth; Juhler, René K.; Brüsch, Walter; Kjær, Jeanne

    2015-01-01

    The European Union authorization procedure for pesticides includes an assessment of the leaching risk posed by pesticides and their degradation products (DP) with the aim of avoiding any unacceptable influence on groundwater. Twelve-year's results of the Danish Pesticide Leaching Assessment Programme reveal shortcomings to the procedure by having assessed leaching into groundwater of 43 pesticides applied in accordance with current regulations on agricultural fields, and 47 of their DP. Three types of leaching scenario were not fully captured by the procedure: long-term leaching of DP of pesticides applied on potato crops cultivated in sand, leaching of strongly sorbing pesticides after autumn application on loam, and leaching of various pesticides and their DP following early summer application on loam. Rapid preferential transport that bypasses the retardation of the plow layer primarily in autumn, but also during early summer, seems to dominate leaching in a number of those scenarios. - Highlights: • Field-results reveal shortcomings in the EU authorization procedure for pesticides. • The plough layer can be bypassed via preferential transport in e.g. wormholes. • Pesticides properties are decisive for leaching pattern on the sandy fields. • The hydrogeological settings control the leaching patterns on the loamy fields. • Pesticide detection frequency seems to be independent of the month of the year. - Long-term lessons learnt from the Danish Pesticide Leaching Assessment Programme reveals shortcomings in the European Union authorization procedure for pesticides

  18. Effect of surface oxide on the melting behavior of lead-free solder nanowires and nanorods

    International Nuclear Information System (INIS)

    Gao Fan; Rajathurai, Karunaharan; Cui, Qingzhou; Zhou, Guangwen; NkengforAcha, Irene; Gu Zhiyong

    2012-01-01

    Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders. By controlling the nanosolder reflow atmosphere using a flux, the surface oxide of the nanowires/nanorods can be effectively removed and complete nanosolder melting can be achieved. The complete melting of the nanosolders leads to the formation of nanoscale to microscale spherical solder balls, followed by Ostwald ripening phenomenon. The contact angle of the microscale solder balls formed on Si substrate was measured by direct electron microscopic imaging. These results provide new insights into micro- and nanoscale phase transition and liquid droplet coalescence from nanowires/nanorods to spheroids, and are relevant to nanoscale assembly and smaller ball grid array formation.

  19. Recovery of Tin and Nitric Acid from Spent Solder Stripping Solutions

    International Nuclear Information System (INIS)

    Ahn, Jae-Woo; Ryu, Seong-Hyung; Kim, Tae-young

    2015-01-01

    Spent solder-stripping solutions containing tin, copper, iron, and lead in nitric acid solution, are by-products of the manufacture of printed-circuit boards. The recovery of these metals and the nitric acid, for re-use has economic and environmental benefits. In the spent solder-stripping solution, a systematic method to determine a suitable process for recovery of valuable metals and nitric acid was developed. Initially, more than 90% of the tin was successfully recovered as high-purity SnO 2 by thermal precipitation at 80 ℃ for 3 hours. About 94% of the nitric acid was regenerated effectively from the spent solutions by diffusion dialysis, after which there remained copper, iron, and lead in solution. Leakage of tin through the anion-exchange membrane was the lowest (0.026%), whereas Pb-leakage was highest (4.26%). The concentration of the regenerated nitric acid was about 5.1 N.

  20. Appendix to the report from the low-residue soldering task force: Phase 2 results

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J.; Huffman, D.D. [and others

    1995-12-01

    The LRSTF report for Phase I of its evaluation of low-residue soldering was issued in June 1995. This Appendix summarizes the results of follow-on testing performed in Phase II and compares electrical test results for both phases. Deliberate decisions were made by the LRSTF in Phase I to challenge the design guideline limits in MILSTD-275, Printed Wiring for Electronic Equipment The LRSTF considered this approach to produce a ``worst case`` design and provide useful information about the robustness of LR soldering processes. As such, good design practices were sometimes deliberately violated in designing the LRSTF board. This approach created some anomalies for both LR boards and RMA/cleaned controls. Phase II testing verified that problems that affected both RMA/cleaned and LR boards in Phase I were design related.

  1. Intense generation of respirable metal nanoparticles from a low-power soldering unit

    Energy Technology Data Exchange (ETDEWEB)

    Gómez, Virginia [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Irusta, Silvia [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain); Balas, Francisco [Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain); Instituto de Carboquímica – Consejo Superior de Investigaciones Científicas (ICB-CSIC), 50018 Zaragoza (Spain); Santamaria, Jesus, E-mail: Jesus.Santamaria@unizar.es [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain)

    2013-07-15

    Highlights: • Intense generation of nanoparticles in the breathing range from a flux-soldering unit is detected. • Coagulation in the aerosol phase leads to 200-nm respirable nanoparticles up to 30 min after operation. • Nanoparticle concentration in the working environment depends on the presence of ambient air. • Metal-containing nanoparticles are collected in TEM grids and filters in the hundreds of nanometer range. -- Abstract: Evidence of intense nanoparticle generation from a low power (45 W) flux soldering unit is presented. This is a familiar device often used in daily life, including home repairs and school electronic laboratories. We demonstrate that metal-containing nanoparticles may reach high concentrations (ca. 10{sup 6} particles/cm{sup 3}) within the breathing range of the operator, with initial size distributions centered at 35–60 nm The morphological and chemical analysis of nanoparticle agglomerates collected on TEM grids and filters confirms their multiparticle structure and the presence of metals.

  2. Intense generation of respirable metal nanoparticles from a low-power soldering unit

    International Nuclear Information System (INIS)

    Gómez, Virginia; Irusta, Silvia; Balas, Francisco; Santamaria, Jesus

    2013-01-01

    Highlights: • Intense generation of nanoparticles in the breathing range from a flux-soldering unit is detected. • Coagulation in the aerosol phase leads to 200-nm respirable nanoparticles up to 30 min after operation. • Nanoparticle concentration in the working environment depends on the presence of ambient air. • Metal-containing nanoparticles are collected in TEM grids and filters in the hundreds of nanometer range. -- Abstract: Evidence of intense nanoparticle generation from a low power (45 W) flux soldering unit is presented. This is a familiar device often used in daily life, including home repairs and school electronic laboratories. We demonstrate that metal-containing nanoparticles may reach high concentrations (ca. 10 6 particles/cm 3 ) within the breathing range of the operator, with initial size distributions centered at 35–60 nm The morphological and chemical analysis of nanoparticle agglomerates collected on TEM grids and filters confirms their multiparticle structure and the presence of metals

  3. Diode Lasers used in Plastic Welding and Selective Laser Soldering - Applications and Products

    Science.gov (United States)

    Reinl, S.

    Aside from conventional welding methods, laser welding of plastics has established itself as a proven bonding method. The component-conserving and clean process offers numerous advantages and enables welding of sensitive assemblies in automotive, electronic, medical, human care, food packaging and consumer electronics markets. Diode lasers are established since years within plastic welding applications. Also, soft soldering using laser radiation is becoming more and more significant in the field of direct diode laser applications. Fast power controllability combined with a contactless temperature measurement to minimize thermal damage make the diode laser an ideal tool for this application. These advantages come in to full effect when soldering of increasingly small parts in temperature sensitive environments is necessary.

  4. Effects of In and Ni Addition on Microstructure of Sn-58Bi Solder Joint

    Science.gov (United States)

    Mokhtari, Omid; Nishikawa, Hiroshi

    2014-11-01

    In this study, the effect of adding 0.5 wt.% and 1 wt.% In and Ni to Sn-58Bi solder on intermetallic compound (IMC) layers at the interface and the microstructure of the solder alloys were investigated during reflow and thermal aging by scanning electron microscopy and electron probe micro-analysis. The results showed that the addition of minor elements was not effective in suppressing the IMC growth during the reflow; however, the addition of 0.5 wt.% In and Ni was effective in suppressing the IMC layer growth during thermal aging. The thickening kinetics of the total IMC layer was analyzed by plotting the mean thickness versus the aging time on log-log coordinates, and the results showed the transition point from grain boundary diffusion control to a volume diffusion control mechanism. The results also showed that the minor addition of In can significantly suppress the coarsening of the Bi phase.

  5. Long-term leaching from MSWI air-pollution-control residues: Leaching characterization and modeling

    DEFF Research Database (Denmark)

    Hyks, Jiri; Astrup, Thomas; Christensen, Thomas Højlund

    2009-01-01

    Long-term leaching of Ca, Fe, Mg, K, Na, S, Al, As, Ba, Cd, Co, Cr, Cu, Hg, Mn, Ni, Pb, Zn, Mo, Sb, Si, Sri, Sr, Ti, V, P, Cl, and dissolved organic carbon from two different municipal solid waste incineration (MSWI) air-pollution-control residues was monitored during 24 months of column percolat......Long-term leaching of Ca, Fe, Mg, K, Na, S, Al, As, Ba, Cd, Co, Cr, Cu, Hg, Mn, Ni, Pb, Zn, Mo, Sb, Si, Sri, Sr, Ti, V, P, Cl, and dissolved organic carbon from two different municipal solid waste incineration (MSWI) air-pollution-control residues was monitored during 24 months of column...... percolation experiments; liquid-to-solid (L/S) ratios of 200-250 L/kg corresponding to more than 10,000 years in a conventional landfill were reached. Less than 2% of the initially present As, Cu, Pb, Zn, Cr, and Sb had leached during the Course of the experiments. Concentrations of Cd, Fe, Mg, Hg, Mn, Ni, Co......, Sn, Ti, and P were generally bellow 1 mu g/L; overall less than 1% of their mass leached. Column leaching data were further used in a two-step geochemical modeling in PHREEQC in order to (i) identify solubility controlling minerals and (ii) evaluate their interactions in a water-percolated column...

  6. Leaching of uranium and thorium from monazite: III. Leaching of radiogenic daughters

    International Nuclear Information System (INIS)

    Olander, D.; Eyal, Y.

    1990-01-01

    The solid-state diffusion model of actinide leaching developed in Part II of this series is applied to leaching of radiogenic daughters of the actinide decay chains. For an untreated natural monazite, the direct leaching component of 228 Th release is larger than that for 232 Th because of enhanced solid-state mobility for 228 Th provided by 228 Ra-recoil tracks. A significant portion of the 228 Th which appears in the leachate, however, is attributed to decay of insoluble 228 Ra which is continually released from the mineral by matrix dissolution and recoil ejection. For a monazite sample that was annealed at 800 degree C prior to leaching, the bulk of the 228 Th in solution was supplied by decay of 228 Ra rejected from the mineral matrix during annealing. The radiogenic 234 U daughter of the 238 U decay chain did not exhibit similarly enhanced leaching because the long half-life of 234 U permitted local radiation damage to be annealed out at ambient temperature prior to 234 U decay

  7. Vacuum tight sodium resistant compound between ThO2 ceramic and metal

    International Nuclear Information System (INIS)

    Reetz, T.

    A method for evaluating the mechanical tensions for metal/ ceramic joinings was applied to the selection of metal components for a highly vacuum tight, sodium-resistant metal/ThO 2 ceramic solder joining. The metal component selected was the iron--nickel alloy Dilasil which is joined to the ceramic using a nickel-based solder. The wetting of the cearamic could be carried out using the titanium hydride technique or after the formation of a W-cerium layer on the surface of this ceramic. (U.S.)

  8. Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys

    Science.gov (United States)

    Lis, Adrian; Nakanishi, Kohei; Matsuda, Tomoki; Sano, Tomokazu; Minagawa, Madoka; Okamoto, Masahide; Hirose, Akio

    2017-07-01

    Solder joints between leads and printed circuit boards in thin small outline packages were produced with conventional Sn1.0Ag0.7Cu (SAC107) and Sn3.0Ag0.7Cu (SAC305) solders as well as various solder alloys with gradually increasing amounts of Bi (up to 3.0 wt.%) and In (up to 1.0 wt.%) within the SAC107 base solder. The reliability of soldered leads in temperature cycle (TC) tests improved most with solder alloys containing both Bi (1.6 wt.%) and In (0.5 wt.%). Microindentation and electron probe microanalysis mappings revealed that the effect originates from a combination of solution and precipitation strengthening of the initial SAC alloy. The distribution of inelastic strain accumulation (ISA), as a measure for degradation, was determined in the solder joints by finite element calculations. It was shown that defects in the solder proximal to the lead (60-75 μm), which was underpinned by similar cracking characteristics along the lead-solder interface. The ISA was confirmed to be lower in SAC+Bi/In alloys owing to their enhanced elasto-plastic properties. Moreover, the addition of a thin Cu coating on the leads could improve the joint reliability, as suggested by the calculation of the ISA and the acceleration factor.

  9. Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

    DEFF Research Database (Denmark)

    Kuhmann, Jochen Friedrich; Preuss, A.; Adolphi, B.

    1998-01-01

    : (1) SnPb; (2) InSn; (3) AuSn. The studies of the oxidation kinetics show that the growth of the native oxide, which covers the solder surfaces from the start of all soldering operations is self-limiting. The rate of oxidation on the molten, metallic solder surfaces is significantly reduced...... and reduction kinetics, are applied to flip-chip (FC) bonding experiments in vacuum with and without the injection of H2. Wetting in vacuum is excellent but the self-alignment during flip-chip soldering is restricted. The desired, perfectly self-aligned FC-bonds have been only achieved, using evaporated...

  10. Leaching behaviour of a glassy slag and derived glass-ceramics from arc-plasma vitrification of hospital wastes

    OpenAIRE

    Romero, Maximina; Hernández, M. S.; Rincón López, Jesús María

    2009-01-01

    The arc-plasma vitrification of a hospital wastes containing metals and inorganic oxides yields to a leach-resistant glassy or vitreous slag, which can be environmentally safe for landfill disposal or could be transformed in glass-ceramic tiles with physical and mechanical properties similar to those showed by marketable products for building applications. Standard methods have been used for testing the leachability of elements from this new type of tiles. The water resistance was evaluated b...

  11. Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint

    Science.gov (United States)

    Darbandi, Payam

    Due to the awareness of the potential health hazards associated with the toxicity of lead (Pb), actions have been taken to eliminate or reduce the use of Pb in consumer products. Among those, tin (Sn) solders have been used for the assembly of electronic systems. Anisotropy is of significant importance in all structural metals, but this characteristic is unusually strong in Sn, making Sn based solder joints one of the best examples of the influence of anisotropy. The effect of anisotropy arising from the crystal structure of tin and large grain microstructure on the microstructure and the evolution of constitutive responses of microscale SAC305 solder joints is investigated. Insights into the effects of key microstructural features and dominant plastic deformation mechanisms influencing the measured relative activity of slip systems in SAC305 are obtained from a combination of optical microscopy, orientation imaging microscopy (OIM), slip plane trace analysis and crystal plasticity finite element (CPFE) modeling. Package level SAC305 specimens were subjected to shear deformation in sequential steps and characterized using optical microscopy and OIM to identify the activity of slip systems. X-ray micro Laue diffraction and high energy monochromatic X-ray beam were employed to characterize the joint scale tensile samples to provide necessary information to be able to compare and validate the CPFE model. A CPFE model was developed that can account for relative ease of activating slip systems in SAC305 solder based upon the statistical estimation based on correlation between the critical resolved shear stress and the probability of activating various slip systems. The results from simulations show that the CPFE model developed using the statistical analysis of activity of slip system not only can satisfy the requirements associated with kinematic of plastic deformation in crystal coordinate systems (activity of slip systems) and global coordinate system (shape changes

  12. Current redistribution in cables made of insulated, soldered, or oxidized strands

    International Nuclear Information System (INIS)

    Turck, B.

    1979-07-01

    Current redistributions are compared in cables made of insulated strands, soldered, or oxidized strands and insulated strands with periodic joints. After discussing the different current redistributions in the cases of a rapidly changing current and a dc current, several particular situations are investigated: what happens if a strand is broken, or if a local normal zone appears that does not affect all the strands equally, the detection of this normal zone, and the influence of short circuits between strands

  13. Life cycle assessment (LCA of lead-free solders from the environmental protection aspect

    Directory of Open Access Journals (Sweden)

    Mitovski Aleksandra M.

    2009-01-01

    Full Text Available Life-cycle assessment (LCA presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equivalent basis, which, in this case, was 1000 cubic centimeters of an alloy. Two of the LCA phases, life-cycle inventory (LCA and life-cycle impact assessment (LCIA, are needed to calculate the environmental impacts. Methodology of LCIA applied in this analysis aligns every input and output influence into 16 different categories, divided in two subcategories. The life-cycle assessment reaserch review of the leadfree solders Sn-Cu, SAC (Sn-Ag-Cu, BSA (Bi-Sb-Ag and SABC (Sn-Ag-Bi-Cu respectively, is given in this paper, from the environmental protection aspect starting from production, through application process and finally, reclamation at the end-of-life, i.e. recycling. There are several opportunities for reducing the overall environmental and human health impacts of solder used in electronics manufacturing based on the results of the LCA, such as: using secondary metals reclaimed through post-industrial recycling; power consumption reducing by replacing older, less efficient reflow assembly equipment, or by optimizing the current equipment to perform at the elevated temperatures required for lead-free soldering, etc. The LCA analysis was done comparatively in relation to widely used Sn-Pb solder material. Additionally, the impact factors of material consumption, energy use, water and air reserves, human health and ecotoxicity have been ALSO considered including

  14. Leaching of heavy metals from steelmaking slags

    Directory of Open Access Journals (Sweden)

    Gomes, J. F. P

    2006-12-01

    Full Text Available Leaching tests with EAF and Ladle slags were performed, using a flow through test and the standard batch test DIN 38414-S4. The previous method was used to simulate the leaching behaviour of steel slags under landfill. The chemical analysis of the leachates during this period shows, in general, for both types of slag, an increase of heavy metal releases with ageing. Standard test method DIN 38414-S4 was used to evaluate leachability of heavy metals by water in unprocessed slags. After more than one year of trials, slag samples submitted to these trials presented very low total leaching levels. The most extracted elements are calcium and magnesium. Nevertheless, in flow-through test, calcium and magnesium leached from solid slags are below 0.5% and all other metals below 0.1%. Leachates obtained with DIN 38414-S4 present, as expected, higher leaching values; however, these are inferior to 5 % (Ca and 1% (other elements.

    Este articulo contiene los resultados obtenidos en ensayos de lixiviación de escorias de acero (horno electrico y cuchara ejecutados siguiendo la metodologia de flujo dinámico así como el ensayo normalizado DIN 38414-S4. El primer ensayo intenta simular el comportamiento de lixiviación de las escorias en vertedero. Para las escorias ensayadas se han complementado los ensayos con el análisis químico de los lixiviados y se ha verificado un aumento de la liberación de metales pesados. El ensayo DIN 38414-S4 se ha utilizado para evaluar la lixiviación por agua de metales pesados, en muestras de escorias originales. Despues de un año de ensayos, se han observado niveles muy bajos de lixiviación. Los elementos mas lixiviados han sido calcio y magnesio. No obstante, en los ensayos de flujo dinámico, el calcio y el magnesio lixiviados de las escorias sólidas era menor de 0,5% y el resto de los otros metales era inferior a 0,1%. Los lixiviados obtenidos con el ensayo DIN 38414-S4 presentan, como era de esperar, valores

  15. The Effect of Initial Irrigation Conditions on Heap Leaching Efficiency

    Science.gov (United States)

    Briseño Arellano, A. D.; Milczarek, M.; Yao, M.; Brusseau, M. L. L.

    2017-12-01

    Heap leaching is an unsaturated flow metal recovery process, in which mined ore is irrigated with a lixiviant to dissolve metal contained in the ore. The metal is then extracted from solution. Large scale operations involve stacking ore to depths of 6 to 18 meters on pads that may be hundreds of hectares in area. Heterogeneities within the stacked ore can lead to uneven wetting and the formation of preferential flow pathways, which reduces solution contact and lowers metal recovery. Furthermore, mineral dissolution can cause alteration of the porous media structure and loss of ore permeability. Many mine operators believe that slow initial irrigation rates help minimize permeability loss and increase metal recovery rates. However, this phenomenon has not been studied in detail. Experiments were conducted to investigate the effect of varying initial irrigation rates on leach ore stability. These were conducted with large columns (1.5 m high, 0.5 m in diameter) packed with crushed ore samples that are known to have permeability constraints. The columns were highly instrumented to assess potential changes in material properties both spatially and temporally. Water content was measured with three different methods: capacitance soil moisture sensors placed at 20-cm intervals; a neutron probe to periodically log every 30 cm from four different directions; and electrical resistivity sensors to create a 2-dimensional tomography profile of water content over time. Tensiometers were paired with the soil moisture sensors to measure matric suction and characterize moisture retention characteristics. A non-reactive tracer was used to characterize advective-dispersive transport under unsaturated conditions. A dye solution was introduced at the end of each experiment to map preferential pathways. Continuous monitoring of settling at the surface assisted in measuring consolidation and loss in permeability.

  16. Evaluation on Dorsey Method in Surface Tension Measurement of Solder Liquids Containing Surfactants

    Science.gov (United States)

    Zhao, Xingke; Xie, Feiming; Fan, Jinsheng; Liu, Dayong; Huang, Jihua; Chen, Shuhai

    2018-06-01

    With the purpose of developing a feasible approach for measuring the surface tension of solders containing surfactants, the surface tension of Sn-3Ag-0.5Cu-xP solder alloys, with various drop sizes as well as different phosphorus (P) content, was evaluated using the Dorsey method based on the sessile drop test. The results show that the accuracy of the surface tension calculations depends on both of sessile drop size and the liquid metal composition. With a proper drop size, in the range of 4.5 mm to 5.3 mm in equivalent spherical diameters, the deviation of the surface tension calculation can be limited to 1.43 mN·m-1 and 6.30 mN·m-1 for SnAgCu and SnAgCu-P, respectively. The surface tension of SnAgCu-xP solder alloys decreases quickly to a minimum value when the P content reaches 0.5 wt% and subsequently increases slowly with the P content further increasing. The formation of a P-enriched surface layer and Sn4P3 intermetallic phases is regarded to be responsible for the decreasing and subsequent increasing of surface tension, respectively.

  17. Liver repair and hemorrhage control by using laser soldering of liquid albumin in a porcine model.

    Science.gov (United States)

    Wadia, Y; Xie, H; Kajitani, M

    2000-01-01

    We evaluated laser soldering by using liquid albumin for welding liver injuries. Major liver trauma has a high mortality because of immediate exsanguination and a delayed morbidity from septicemia, peritonitis, biliary fistulae, and delayed secondary hemorrhage. Eight laceration (6 x 2 cm) and eight nonanatomic resection injuries (raw surface, 6 x 2 cm) were repaired. An 805-nm laser was used to weld 50% liquid albumin-indocyanine green solder to the liver surface, reinforcing it with a free autologous omental scaffold. The animals were heparinized and hepatic inflow occlusion was used for vascular control. All 16 soldering repairs were evaluated at 3 hours. All 16 laser mediated liver repairs had minimal blood loss as compared with the suture controls. No dehiscence, hemorrhage, or bile leakage was seen in any of the laser repairs after 3 hours. Laser fusion repair of the liver is a reliable technique to gain hemostasis on the raw surface as well as weld lacerations. Copyright 2000 Wiley-Liss, Inc.

  18. Investigation of Sn-Pb solder bumps of prototype photo detectors for the LHCb experiment

    CERN Document Server

    Delsante, M L; Arnau-Izquierdo, G

    2004-01-01

    The Large Hadron Collider (LHC) is now under construction at the European Organization for Nuclear Research (CERN). LHCb is one of the dedicated LHC experiments, allowing high energy proton-proton collisions to be exploited. This paper presents the results of the metallurgic studies carried out on Sn-Pb solder bumps of prototype vacuum photo detectors under development for LHCb, and in particular for the ring imaging Cherenkov-hybrid photo diode (RICH-HPD) project. These detectors encapsulate, in a vacuum tube, an assembly made of two silicon chips bonded together by a matrix of solder bumps. Each bump lies on a suitable system of under-bump metallic layers ensuring mechanical and electrical transition between the chip pad and the solder alloy. During manufacturing of the detector, bump-bonded (BB) assemblies are exposed to severe heat cycles up to 400 degree C inducing, in the present fabrication process, a clear degradation of electrical connectivity. Several investigations such as microstructural observati...

  19. Multi-layer SiC ceramics/Mo joints brazed using high-temperature solders

    International Nuclear Information System (INIS)

    Olesinska, W.; Kesik, J.

    2003-01-01

    The paper presents the results of studies on joining SiC ceramics with molybdenum, with the ceramic surface being activated by titanium, chromium or copper. Titanium or chromium were deposited by the sputtering technique, and copper - by the electro-chemical method. The microstructures of the SiC/Mo joints brazed with the CuMn13Ni3 solder and copper in a nitrogen atmosphere were examined and the results discussed. The joints, in which the ceramic surface was activated in addition with chromium, do not contain mechanical defects caused by the joining process, and the ceramic surface is covered with a continuous layer of the solder. A phase analysis of the interface surface identified an MeSiC phase. The mechanical strength of the joints in which the ceramic surface was modified by the Ti, Cr and Cu layers was markedly greater than that of the joints brazed directly to the uncoated ceramics with the use of active solders. (author)

  20. Laser Soldering and Thermal Cycling Tests of Monolithic Silicon Pixel Chips

    CERN Document Server

    Strand, Frode Sneve

    2015-01-01

    An ALPIDE-1 monolithic silicon pixel sensor prototype has been laser soldered to a flex printed circuit using a novel interconnection technique using lasers. This technique is to be optimised to ensure stable, good quality connections between the sensor chips and the FPCs. To test the long-term stability of the connections, as well as study the effects on hit thresholds and noise in the sensor, it was thermally cycled in a climate chamber 1200 times. The soldered connections showed good qualities like even melting and good adhesion on pad/flex surfaces, and the chip remained in working condition for 1080 cycles. After this, a few connections failed, having cracks in the soldering tin, rendering the chip unusable. Threshold and noise characteristics seemed stable, except for the noise levels of sector 2 in the chip, for 1000 cycles in a temperature interval of "10^{\\circ}" and "50^{\\circ}" C. Still, further testing with wider temperature ranges and more cycles is needed to test the limitations of the chi...

  1. Reinforcement of high-risk anastomoses using laser-activated protein solders: a clinical study

    Science.gov (United States)

    Libutti, Steven K.; Bessler, Marc; Chabot, J.; Bass, Lawrence S.; Oz, Mehmet C.; Auteri, Joseph S.; Kirsch, Andrew J.; Nowygrod, Roman; Treat, Michael R.

    1993-07-01

    Anastomotic leakage or breakdown can result in catastrophic complications and significantly increased post-operative morbidity and mortality. Certain anastomoses are subject to a higher incidence of disruption and are therefore termed high risk. In an attempt to decrease the risk of anastomotic leaks, we reinforced sutured anastomoses with a laser activated protein solder in patients undergoing esophagojejunostomies (n equals 2), lung transplantation (n equals 2), and pancreaticojejunostomies (Whipple procedure, n equals 5). The protein solder was composed of 1.0 ml of a 25% human albumin solution, 1.0 ml of sodium hyaluronate, and 0.1 ml of Cardiogreen dye. This composition was applied to the sutured anastomosis and activated with an 860 nm pulsed diode laser. Drains were placed when appropriate and patients were followed for up to 10 months post-operatively and assessed for clinical signs of anastomotic leaks. Results to data demonstrated that there were no immediate complications as a result of the procedure. Operative time was not significantly lengthened. There were no cases of clinically significant leakage from any of the reinforced anastomoses. Laser activated protein solders may help to reduce the incidence of leakage in high risk anastomoses. Large numbers of patients and longer follow-up is needed however, to draw significant conclusions.

  2. Liver repair and hemorrhage control using laser soldering of liquid albumin in a porcine model

    Science.gov (United States)

    Wadia, Yasmin; Xie, Hua; Kajitani, Michio; Gregory, Kenton W.; Prahl, Scott A.

    2000-05-01

    The purpose of this study was to evaluate laser soldering using liquid albumin for welding liver lacerations and sealing raw surfaces created by segmental resection of a lobe. Major liver trauma has a high mortality due to immediate exsanguination and a delayed morbidity and mortality from septicemia, peritonitis, biliary fistulae and delayed secondary hemorrhage. Eight laceration injuries (6 cm long X 2 cm deep) and eight non-anatomical resection injuries (raw surface 6 cm X 2 cm) were repaired. An 805 nm laser was used to weld 53% liquid albumin-ICG solder to the liver surface, reinforcing it with a free autologous omental scaffold. The animals were heparinized to simulate coagulation failure and hepatic inflow occlusion was used for vascular control. For both laceration and resection injuries, eight soldering repairs each were evaluated at three hours. A single suture repair of each type was evaluated at three hours. All 16 laser mediated liver repairs were accompanied by minimal blood loss as compared to the suture controls. No dehiscence, hemorrhage or bile leakage was seen in any of the laser repairs after three hours. In conclusion laser fusion repair of the liver is a quick and reliable technique to gain hemostasis on the cut surface as well as weld lacerations.

  3. Dissolution and uptake of cadmium from dental gold solder alloy implants

    Energy Technology Data Exchange (ETDEWEB)

    Bergman, B; Bergman, M; Soeremark, R [Umeaa Univ. (Sweden); Karolinska Institutet, Stockholm (Sweden))

    1977-01-01

    Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium (/sup 115/Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of /sup 115/Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver.

  4. Process for controlling calcium in a leach operation

    International Nuclear Information System (INIS)

    Habib, E.J.

    1982-01-01

    A method for controlling calcium, e.g. calcite, build-up in the leach solution of a uranium and/or related values recovery operation wherein the leach solution is flowed through a value bearing ore to dissolve the desired values. A soluble fluoride, e.g. sodium fluoride, is added to the leach solution after it has passed through the ore to thereby precipitate calcium fluoride from the leach solution and lower the calcium content of the leach solution. The soluble fluoride may be added to the leach solution before the leach solution passes through the process equipment which is used to remove the values from the leach solution or the soluble fluoride may be added after the leach solution passes through the process equipment. If added before, it is preferable to also add a carbonate/bicarbonate solution along with the soluble fluoride to prevent coprecipitation of uranyl/desired value fluoride or to redissolve coprecipitated fluoride back into the leach solution

  5. Continuous-flow leaching studies of crushed and cored SYNROC

    International Nuclear Information System (INIS)

    Coles, D.G.; Bazan, F.

    1982-01-01

    Both crushed (150- to 300- μm) and cored (1,8- mm-diam) samples of SYNROC have been leached with single-pass continuous-flow leaching equipment. Crushed samples of cesium-hollandite were also leached in a similar experiment. Temperatures used were 25 0 and 75 0 C and leachates were 0.03 N NaHCO 3 and distilled water. Leaching rates from SYNROC-C were ranked cesium > strontium greater than or equal to calcium > barium > zirconium. A comparison of leaching rates is made between crushed SYNROC, cored SYNROC, and Pacific Northwest Laboratory 76-68 glass beads. This comparison depends on how the surface areas are determined for each sample. Based on geometric surface areas for SYNROC cores and glass beads, cesium leach rates from SYNROC compare well with both sodium and neptunium leached from the glass. The other elements leached from SYNROC are lower than sodium and neptunium leached from glass. They also vary for each element, while glass shows nearly the same leach rate for both sodium and neptunium

  6. Continuous-flow leaching studies of crushed and cored SYNROC

    International Nuclear Information System (INIS)

    Coles, D.G.; Bazan, F.

    1981-01-01

    Both crushed (150 to 300 μm) and cored (1.8 mm diameter) samples of SYNROC have been leached with the single-pass continuous-flow leaching equipment. Crushed samples of Cs-hollandite were also leached in a similar experiment. Temperatures used were 25 and 75 0 C and leachates were 0.03 N NaHCO 3 and distilled water. Leaching rates from SYNROC C were ranked Cs > Sr greater than or equal to Ca > Ba > Zr. A comparison of leaching rates is made between crushed SYNROC, cored SYNROC, and PNL 76-68 glass beads. This comparison depends on how the surface areas are determined for each sample. Based on geometric surface areas for SYNROC cores and glass beads Cs leach rates from SYNROC compare well with both Na and Np leached from the glass. The other elements leached from SYNROC are lower than Na and Np leached from glass. They also vary for each element while glass shows nearly the same leach rate for both Na and Np

  7. Groundwater leaching of neutralized and untreated acid-leached uranium-mill tailings

    International Nuclear Information System (INIS)

    Gee, G.W.; Begej, C.W.; Campbell, A.C.; Sauter, N.N.; Opitz, B.E.; Sherwood, D.R.

    1981-01-01

    Tailings neutralization was examined to determine the effect of neutralization on contaminant release. Column leaching of acid extracted uranium mill tailings from Exxon Highland Mill, Wyoming, Pathfinder Gas Hills Mill, Wyoming, and the Dawn Midnite Mill, Washington, resulted in the flushing of high concentrations of salts in the first four pore volumes of leachate, followed by a steady decrease to the original groundwater salt concentrations. Neutralization decreased the concentration of salts and radionuclides leaching from the tailings and decreased the volume of solution required to return the solution to the groundwater pH and EC. Radium-226 and uranium-238 leached quickly from the tailings in the initial pore volumes of both neutralized and unneutralized tailings, and then decreased significantly. 6 figures, 5 tables

  8. Development of an accelerated leaching method for incineration bottom ash correlated to toxicity characteristic leaching protocol.

    Science.gov (United States)

    Lin, Shengxuan; Zhou, Xuedong; Ge, Liya; Ng, Sum Huan; Zhou, Xiaodong; Chang, Victor Wei-Chung

    2016-10-01

    Heavy metals and some metalloids are the most significant inorganic contaminants specified in toxicity characteristic leaching procedure (TCLP) in determining the safety of landfills or further utilization. As a consequence, a great deal of efforts had been made on the development of miniaturized analytical devices, such as Microchip Electrophoresis (ME) and μTAS for on-site testing of heavy metals and metalloids to prevent spreading of those pollutants or decrease the reutilization period of waste materials such as incineration bottom ash. However, the bottleneck lied in the long and tedious conventional TCLP that requires 18 h of leaching. Without accelerating the TCLP process, the on-site testing of the waste material leachates was impossible. In this study, therefore, a new accelerated leaching method (ALM) combining ultrasonic assisted leaching with tumbling was developed to reduce the total leaching time from 18 h to 30 min. After leaching, the concentrations of heavy metals and metalloids were determined with ICP-MS or ICP-optical emission spectroscopy. No statistical significance between ALM and TCLP was observed for most heavy metals (i.e., cobalt, manganese, mercury, molybdenum, nickel, silver, strontium, and tin) and metalloids (i.e., arsenic and selenium). For the heavy metals with statistical significance, correlation factors derived between ALM and TCLP were 0.56, 0.20, 0.037, and 0.019 for barium, cadmium, chromium, and lead, respectively. Combined with appropriate analytical techniques (e.g., ME), the ALM can be applied to rapidly prepare the incineration bottom ash samples as well as other environmental samples for on-site determination of heavy metals and metalloids. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  9. Experimental study on bio-leaching of high sulphuric acid consumption uranium ore by adding sulphide

    International Nuclear Information System (INIS)

    Meng Yunsheng; Zheng Ying; Liu Hui; Cheng Hao; Zhou Lei; Liu Chao; Fan Baotuan; Li Jianhua

    2012-01-01

    In order to decrease acid consumption and increase leaching rate, an experiment on bio-leach-ing of low grade uranium ore by adding sulphide was done. Compared with conventional leaching method, the leaching rate of uranium is improved by 3% and the leaching period was reduced to 60 days from 90 days by bio-leaching method of adding sulphide. In order to decrease acid consumption with bio-leaching by adding sulphide obviously, robust bacteria to sulphide should be chosen. (authors)

  10. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

    2008-07-14

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

  11. Leaching of 210Po in human saliva from smokeless tobacco

    International Nuclear Information System (INIS)

    Syed, U.F.; Bari, A.; Husain, L.; Husain, L.

    2009-01-01

    Use of smokeless tobacco (SLT) is associated with cancer of the oral cavity. 210 Po, a known carcinogen present in SLT may leach into the saliva when the snuff is held in the mouth. Alpha emission from leached 210 Po can cause oral tissue damage, especially in the presence of non healing ulcers seen frequently in snuff users' mouth. Leaching of 210 Po from SLT in human saliva was determined for six popular US snuff brands. 210 Po was leached into human saliva for 30 min, separated radiochemically and its activity was determined by α-counting. Approximately 2-10% of 210 Po present in SLT was observed to leach. Annual exposure from leached 210 Po, based on average daily consumption of 15 g of SLT, was calculated to range from 1.1 to 3.8 Bq year -1 . (author)

  12. Continuous-flow leaching studies of crushed and cored SYNROC

    International Nuclear Information System (INIS)

    Coles, D.G.; Bazan, F.

    1980-01-01

    Both crushed (150 to 300 μm) and cored 1.8 mm diameter) samples of SYNROC have been leached with the single-pass continuous-flow leaching equipment. Crushed samples of Cs-hollandite were also leached in a similar experiment. Temperatures used were 25 0 C and 75 0 C and leachates were 0.03 N NaHCO 3 and distilled water. Leaching rates from SYNROC C were ranked Cs > Sr greater than or equal to Ca > Ba > Zr. A comparison of leaching rates is made between crushed SYNROC, cored SYNROC, and PNL 76-68 glass beads. Problems encountered when comparing the leaching rates of different waste forms are discussed

  13. Comparison of oxidants in alkaline leaching of uranium ore

    International Nuclear Information System (INIS)

    Sreenivas, T.; Rajan, K.C.; Srinivas, K.; Anand Rao, K.; Manmadha Rao, M.; Venkatakrishnan, R.R.; Padmanabhan, N.P.H.

    2007-01-01

    The uranium minerals occurring in various ore deposits consists of predominantly uranous ion (U +4 ), necessitating use of an oxidant and other lixiviants for efficient dissolution during leaching. Unlike acid leaching route, where uranium minerals dissolution could be achieved efficiently with cheaper lixiviants, processing of ores by alkaline leaching route involve expensive lixiviants and drastic leaching conditions. Alkaline leaching of uranium ores becomes economical only upon using cheaper and efficient oxidants and conservation of other reagents by their recycle. The present paper gives efficacy of various oxidants - KMnO 4 , NaOCl, Cu - NH 3 , air and oxygen, in the leaching of uranium from a low-grade dolostone hosted uranium ore of India. A comparison based on technical merits and cost of the oxidant chemicals is discussed. (author)

  14. Chlorine-assisted leaching of Key Lake uranium ore

    International Nuclear Information System (INIS)

    Haque, K.E.

    1981-04-01

    Bench-scale chlorine-assisted leach tests were conducted on the Key Lake uranium ore. Leach tests conducted at 80 0 C on a slurry containing 50% solids during 10 hours of agitation gave the maximum extraction of uranium - 96% and radium-226 - 91%. Chlorine was added at 23.0 Kg Cl 2 /tonne of ore to maintain the leach slurry pH in the range of 1.5-1.0. To obtain residue almost free of radionuclides, hydrochloric acid leaches were conducted on the first stage leach residues. The second stage leach residue still was found to contain uranium - 0.0076% and radium-226 - 200 pCi/g of solids

  15. Leaching of both calcium hydroxide and C-S-H from cement paste: Modeling the mechanical behavior

    International Nuclear Information System (INIS)

    Carde, C.; Torrenti, J.M.; Francois, R.

    1996-01-01

    This paper deals with the effect of the leaching process of cement based materials on their mechanical properties. This process induces mainly a total leaching of Ca(OH) 2 and a progressive decalcification of C-S-H which leads to a gradient of C/S ratio in the leaching zone. In a previous work, the authors venture the hypothesis that the dissolution of calcium hydroxide was the essential parameter governing both decrease in strength and increase in porosity in the case of a paste sample made with an OPC cement which leads to a 20% content of calcium. In order to quantify the effect of the decrease of C/S ratio in C-S-H, the authors have performed experiments on paste samples with the admixture of silica fume to reduce the content of calcium hydroxide and thus emphasize the effect of C/S ratio decrease of the C-S-H. The leaching process was achieved by the use of a 50% concentrate solution of ammonium nitrate. Compression tests were conducted on micro-cylinder samples (10, 12, 14, 20 and 30 mm of diameter) because of the slow kinetics of degradation due to the leaching. The deterioration of the cement paste and the mortar exposed to the action of the ammonium nitrate was indicated by a peripheral zone of less resistance. The experimental results allow the modeling of the mechanical behavior of cement pastes in relation to the ratio of degraded area over total area of the sample A d /A t . The model thus defined allows separation of the effect of calcium hydroxide leaching and C-S-H leaching, and shows the importance of the first one. The current research program tries to characterize the deterioration of the mechanical properties of the concrete surrounding radioactive wastes, due to the water flow during storage

  16. Radionuclide release from simulated waste material after biogeochemical leaching of uraniferous mineral samples

    International Nuclear Information System (INIS)

    Williamson, Aimee Lynn; Caron, François; Spiers, Graeme

    2014-01-01

    Biogeochemical mineral dissolution is a promising method for the released of metals in low-grade host mineralization that contain sulphidic minerals. The application of biogeochemical mineral dissolution to engineered leach heap piles in the Elliot Lake region may be considered as a promising passive technology for the economic recovery of low grade Uranium-bearing ores. In the current investigation, the decrease of radiological activity of uraniferous mineral material after biogeochemical mineral dissolution is quantified by gamma spectroscopy and compared to the results from digestion/ICP-MS analysis of the ore materials to determine if gamma spectroscopy is a simple, viable alternative quantification method for heavy nuclides. The potential release of Uranium (U) and Radium-226 ( 226 Ra) to the aqueous environment from samples that have been treated to represent various stages of leaching and passive closure processes are assessed. Dissolution of U from the solid phase has occurred during biogeochemical mineral dissolution in the presence of Acidithiobacillus ferrooxidans, with gamma spectroscopy indicating an 84% decrease in Uranium-235 ( 235 U) content, a value in accordance with the data obtained by dissolution chemistry. Gamma spectroscopy data indicate that only 30% of the 226 Ra was removed during the biogeochemical mineral dissolution. Chemical inhibition and passivation treatments of waste materials following the biogeochemical mineral dissolution offer greater protection against residual U and 226 Ra leaching. Pacified samples resist the release of 226 Ra contained in the mineral phase and may offer more protection to the aqueous environment for the long term, compared to untreated or inhibited residues, and should be taken into account for future decommissioning. - Highlights: • Gamma counting showed an 84% decrease in 235 U after biogeochemical mineral leaching. • Chemical digestion/ICP-MS analysis also showed an 84% decrease in total U. • Over

  17. Thiosulphate leaching of gold-, silver-, copper flotation concentrates

    International Nuclear Information System (INIS)

    Samikhov, Sh.R.; Zinchenko, Z.A.

    2015-01-01

    Present article is devoted to thiosulphate leaching of gold-, silver-, copper flotation concentrates. For the purpose to improve the process of thiosulphate leaching the ore samples were calcined at temperature 600 ℃ during two hours. During the calcination process of gold-sulphide ores and concentrates the minerals pyrite and arsenopyrite oxidize which lead to opening of gold contains in them. It was defined that thiosulphate leaching can be recommended as an alternative to cyanic process.

  18. Preparation and leaching of radioactive INEL waste forms

    International Nuclear Information System (INIS)

    Schuman, R.P.; Welch, J.M.; Staples, B.A.

    1982-01-01

    The purpose of this study is to prepare and leach test ceramic and glass waste form specimens produced from actual transuranic waste sludges and high-level waste calcines, respectively. Description of wastes, specimen fabrication, leaching procedure, analysis of leachates and results are discussed. The conclusion is that radioactive waste stored at INEL can be readily incorporated in fused ceramic and glass forms. Initial leach testing results indicate that these forms show great promise for safe long-term containment of radioactive wastes

  19. Leaching of DOC, DN, and inorganic constituents from scrap tires.

    Science.gov (United States)

    Selbes, Meric; Yilmaz, Ozge; Khan, Abdul A; Karanfil, Tanju

    2015-11-01

    One concern for recycle and reuse of scrap tires is the leaching of tire constituents (organic and inorganic) with time, and their subsequent potential harmful impacts in environment. The main objective of this study was to examine the leaching of dissolved organic carbon (DOC), dissolved nitrogen (DN), and selected inorganic constituents from scrap tires. Different sizes of tire chips and crumb rubber were exposed to leaching solutions with pH's ranging from 3.0 to 10.0 for 28days. The leaching of DOC and DN were found to be higher for smaller size tire chips; however, the leaching of inorganic constituents was independent of the size. In general, basic pH conditions increased the leaching of DOC and DN, whereas acidic pH conditions led to elevated concentrations of metals. Leaching was minimal around the neutral pH values for all the monitored parameters. Analysis of the leaching rates showed that components associated with the rubbery portion of the tires (DOC, DN, zinc, calcium, magnesium, etc.) exhibited an initial rapid followed by a slow release. On the other hand, a constant rate of leaching was observed for iron and manganese, which are attributed to the metal wires present inside the tires. Although the total amounts that leached varied, the observed leaching rates were similar for all tire chip sizes and leaching solutions. Operation under neutral pH conditions, use of larger size tire chips, prewashing of tires, and removal of metal wires prior to application will reduce the impact of tire recycle and reuse. Copyright © 2015 Elsevier Ltd. All rights reserved.

  20. Commercial application of bacterial heap leaching in Ganzhou uranium mine

    International Nuclear Information System (INIS)

    Liu Jian; Fan Baotuan; Meng Yunsheng; Xiao Jinfeng; Chen Sencai; Wu Jinjing; Liu Chengwu; Wu Yichang; Zeng Ruilong

    2003-01-01

    In this paper the situation of commercial application on bacterial heap leaching in Ganzhou Uranium Mine is introduced, and the construction of biomembrane oxidizing tank, regeneration and recycled utilization of barren solution are summarized. Total five heaps, 18436 t, uranium ore are leached by bacteria during the half of a year. The result is consistent with that of commercial experiment. The technology of bacterial heap leaching is more perfected

  1. Aquifer restoration techniques for in-situ leach uranium mines

    International Nuclear Information System (INIS)

    Deutsch, W.J.; Bell, N.E.; Mercer, B.W.; Serne, R.J.; Shade, J.W.; Tweeton, D.R.

    1984-02-01

    In-situ leach uranium mines and pilot-scale test facilities are currently operating in the states of Wyoming, Texas, New Mexico and Colorado. This report summarizes the technical considerations involved in restoring a leached ore zone and its aquifer to the required level. Background information is provided on the geology and geochemistry of mineralized roll-front deposits and on the leaching techniques used to extract the uranium. 13 references, 13 figures, 4 tables

  2. Extended Leach Testing of Simulated LAW Cast Stone Monoliths

    Energy Technology Data Exchange (ETDEWEB)

    Serne, R. Jeffrey [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Lanigan, David C. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Westsik, Joseph H. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Williams, Benjamin D. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Jung, H. B. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Wang, Guohui [Pacific Northwest National Lab. (PNNL), Richland, WA (United States)

    2016-08-12

    This revision to the original report adds two longer term leach sets of data to the report and provides more discussion and graphics on how to interpret the results from long-term laboratory leach tests. The leach tests were performed at Pacific Northwest National Laboratory (PNNL) for Washington River Protection Solutions (WRPS) to evaluate the release of key constituents from monoliths of Cast Stone prepared with four simulated low-activity waste (LAW) liquid waste streams.

  3. Radiotracer investigation in gold leaching tanks

    Energy Technology Data Exchange (ETDEWEB)

    Dagadu, C.P.K., E-mail: dagadukofi@yahoo.co.uk [Ghana Atomic Energy Commission, P.O. Box LG 80, Legon, Accra (Ghana); Akaho, E.H.K.; Danso, K.A. [Ghana Atomic Energy Commission, P.O. Box LG 80, Legon, Accra (Ghana); Stegowski, Z.; Furman, L. [Faculty of Physics and Applied Computer Science, AGH-UST, 30-059 Krakow (Poland)

    2012-01-15

    Measurement and analysis of residence time distribution (RTD) is a classical method to investigate performance of chemical reactors. In the present investigation, the radioactive tracer technique was used to measure the RTD of aqueous phase in a series of gold leaching tanks at the Damang gold processing plant in Ghana. The objective of the investigation was to measure the effective volume of each tank and validate the design data after recent process intensification or revamping of the plant. I-131 was used as a radioactive tracer and was instantaneously injected into the feed stream of the first tank and monitored at the outlet of different tanks. Both sampling and online measurement methods were used to monitor the tracer concentration. The results of measurements indicated that both the methods provided identical RTD curves. The mean residence time (MRT) and effective volume of each tank was estimated. The tanks-in-series model with exchange between active and stagnant volume was used and found suitable to describe the flow structure of aqueous phase in the tanks. The estimated effective volume of the tanks and high degree of mixing in tanks could validate the design data and confirmed the expectation of the plant engineer after intensification of the process. - Highlights: Black-Right-Pointing-Pointer I-131 radioactive tracer is suitable for tracing the aqueous phase in gold ore slurry. Black-Right-Pointing-Pointer Online data collection is more convenient method for tracer monitoring in industrial process systems. Black-Right-Pointing-Pointer The tanks-in-series model with exchange between active and stagnant zones is suitable to describe the flow behavior of leaching tanks. Black-Right-Pointing-Pointer The radiotracer RTD technique could be used to validate design data after process intensification in gold leaching tanks.

  4. Probable leaching mechanisms for spent fuel

    International Nuclear Information System (INIS)

    Wang, R.; Katayama, Y.B.

    1981-01-01

    At the Pacific Northwest Laboratory, researchers in the Waste/Rock Interaction Technology Program are studying spent fuel as a possible waste form for the Office of Nuclear Waste Isolation. This paper presents probable leaching mechanisms for spent fuel and discusses current progress in identifying and understanding the leaching process. During the past year, experiments were begun to study the complex leaching mechanism of spent fuel. The initial work in this investigation was done with UO 2 , which provided the most information possible on the behavior of the spent-fuel matrix without encountering the very high radiation levels associated with spent fuel. Both single-crystal and polycrystalline UO 2 samples were used for this study, and techniques applicable to remote experimentation in a hot cell are being developed. The effects of radiation are being studied in terms of radiolysis of water and surface activation of the UO 2 . Dissolution behavior and kinetics of UO 2 were also investigated by electrochemical measurement techniques. These data will be correlated with those acquired when spent fuel is tested in a hot cell. Oxidation effects represent a major area of concern in evaluating the stability of spent fuel. Dissolution of UO 2 is greatly increased in an oxidizing solution because the dissolution is then controlled by the formation of hexavalent uranium. In solutions containing very low oxygen levels (i.e., reducing solutions), oxidation-induced dissolution may be possible via a previously oxidized surface, through exposure to air during storage, or by local oxidants such as O 2 and H 2 O 2 produced from radiolysis of water and radiation-activated UO 2 surfaces. The effects of oxidation not only increase the dissolution rate, but could lead to the disintegration of spent fuel into fine fragments

  5. Impact of weather variability on nitrate leaching

    Science.gov (United States)

    Richards, Karl; Premrov, Alina; Hackett, Richard; Coxon, Catherine

    2016-04-01

    The loss of nitrate (NO3 - N) to water via leaching and overland flow contributes to eutrophication of freshwaters, transitional and near coastal waters with agriculture contributing significantly to nitrogen (N) loading to these water. Environmental regulations, such as the Nitrates and Water Framework Directives, have increased constraints on farmers to improve N management in regions at risk of NO3--N loss to water. In addition, farmers also have to manage their systems within a changing climate as the imapcts of climate change begin to impact resulting in more frequent extreme events such as floods and droughts. The objective of this study was to investigate the link between weather volatility and the concentration of leached NO3--N spring barley. Leaching was quantified under spring barley grown on a well-drained, gravelly sandy soil using ceramic cup samplers over 6 drainage years under the same farming practices and treatments. Soil solution NO3--N concentrations under spring barley grown by conventional inversion ploughing and reduced tillage were compared to weather parameters over the period. Weather was recorded at a national Met Eireann weather station on site. Soil solution NO3--N varied significantly between years. Within individual years NO3--N concentrations varied over the drainage season, with peak concentrations generally observed in the autumn time, decreasing thereafter. Under both treatments there was a three-fold difference in mean annual soil solution NO3--N concentration over the 6 years with no change in the agronomic practices (crop type, tillage type and fertiliser input). Soil solution nitrate concentrations were significantly influenced by weather parameters such as rainfall, effective drainage and soil moisture deficit. The impact of climate change in Ireland could lead to increased NO3--N loss to water further exacerbating eutrophication of sensitive estuaries. The increased impact on eutrophication of waters, related to climatic

  6. Radiotracer investigation in gold leaching tanks

    International Nuclear Information System (INIS)

    Dagadu, C.P.K.; Akaho, E.H.K.; Danso, K.A.; Stegowski, Z.; Furman, L.

    2012-01-01

    Measurement and analysis of residence time distribution (RTD) is a classical method to investigate performance of chemical reactors. In the present investigation, the radioactive tracer technique was used to measure the RTD of aqueous phase in a series of gold leaching tanks at the Damang gold processing plant in Ghana. The objective of the investigation was to measure the effective volume of each tank and validate the design data after recent process intensification or revamping of the plant. I-131 was used as a radioactive tracer and was instantaneously injected into the feed stream of the first tank and monitored at the outlet of different tanks. Both sampling and online measurement methods were used to monitor the tracer concentration. The results of measurements indicated that both the methods provided identical RTD curves. The mean residence time (MRT) and effective volume of each tank was estimated. The tanks-in-series model with exchange between active and stagnant volume was used and found suitable to describe the flow structure of aqueous phase in the tanks. The estimated effective volume of the tanks and high degree of mixing in tanks could validate the design data and confirmed the expectation of the plant engineer after intensification of the process. - Highlights: ► I-131 radioactive tracer is suitable for tracing the aqueous phase in gold ore slurry. ► Online data collection is more convenient method for tracer monitoring in industrial process systems. ► The tanks-in-series model with exchange between active and stagnant zones is suitable to describe the flow behavior of leaching tanks. ► The radiotracer RTD technique could be used to validate design data after process intensification in gold leaching tanks.

  7. RMDF leach-field decontamination. Final report

    International Nuclear Information System (INIS)

    Carroll, J.W.; Marzec, J.M.; Stelle, A.M.

    1982-01-01

    The objective of the decontamination effort was to place the Radioactive Materials Disposal Facility (RMDF) leach field in a condition suitable for release for unrestricted use. Radioactively contaminated soil was excavated from the leach field to produce a condition of contamination as low as reasonably achievable (ALARA). The contaminated soil was boxed and shipped to an NRC-licensed burial site at Beatty, Nevada, and to the DOE burial site at Hanford, Washington. The soil excavation project successfully reduced the contamination level in the leach field to background levels, except for less than 0.6 mCi of Sr-90 and trace amounts of Cs-137 that are isolated in cracks in the bedrock. The cracks are greater than 10 ft below the surface and have been sealed with a bituminous asphalt mastic. A pathways analysis for radiation exposure to humans from the remaining radionuclides was performed, assuming intensive home gardening, and the results show that the total first year whole body dose equivalent would be about 0.1 mrem/year. This dose equivalent is a projection for the hypothetical ingestion of vegetables grown on the site. Assuming that an average adult consumes 64 kg of green leafy vegetables per year and that the entire yearly supply could be grown on the site, the amount of ingested Sr-90 and Cs-137 is calculated to be 1100 pCi/year and 200 pCi/year. This ingested quantity would produce a total first year whole body dose equivalent of 0.10 mrem, using the accepted soil-to-plant transfer factors of 0.0172 and 0.010 for Sr-90 and Cs-137, respectively. The whole body dose equivalent exposure value of 0.1 mrem/year is far below the tentative limit established by NRC of 5 mrem/year for areas released for unrestricted use

  8. Essays of leaching in cemented products containing simulated waste from evaporator concentrated of PWR reactor

    International Nuclear Information System (INIS)

    Haucz, Maria Judite A.; Calabria, Jaqueline A. Almeida; Tello, Cledola Cassia O.; Candido, Francisco Donizete; Seles, Sandro Rogerio Novaes

    2011-01-01

    This paper evaluated the results from leaching resistance essays of cemented products, prepared from three distinct formulations, containing simulated waste of concentrated from the PWR reactor evaporator. The leaching rate is a parameter of qualification of solidified products containing radioactive waste and is determined in accordance with regulation ISO 6961. This procedure evaluates the capacity of transfer organic and inorganic substances presents in the waste through dissolution in the extractor medium. For the case of radioactive waste it is reached the more retention of contaminants in the cemented product, i.e.the lesser value of lixiviation rate. Therefore, this work evaluated among the proposed formulation that one which attend the criterion established in the regulation CNEN-NN-6.09

  9. Solubility limits of importance to leaching

    International Nuclear Information System (INIS)

    Ogard, A.; Bentley, G.; Bryant, E.; Duffy, C.; Grisham, J.; Norris, E.; Orth, C.; Thomas, K.

    1981-01-01

    The solubilities of some radionuclides, especially rare earths and actinides, may be an important and controlling factor in leaching of waste forms. These solubilities should be measured accurately as a function of pH and not as a part of a multicomponent system. Individual solubilities should be measured as a function of temperature to determine if a kinetic effect is being observed in the data. A negative temperature coefficient of solubility for actinides and rare earths in water would have important consequences for nuclear reactor safety and for the management of nuclear wastes

  10. The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

    Science.gov (United States)

    Werden, Jesse

    The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the

  11. Leaching of TCIPP from furniture foam is rapid and substantial.

    Science.gov (United States)

    Stubbings, William A; Harrad, Stuart

    2018-02-01

    A series of laboratory experiments were conducted, in which waste furniture polyurethane foam samples containing tris (1-chloro-2-propyl) phosphate (TCIPP) were contacted with a range of leaching fluids, formulated to simulate the composition of landfill leachate. Leaching was examined under a number of different scenarios, such as: dissolved humic matter concentration, pH, and temperature, as well as the effect of agitation, and waste:leaching fluid contact duration. In addition to single batch (no replenishment of leaching fluid), serial batch (draining of leachate and replenishment with fresh leaching fluid at various time intervals) experiments were conducted. Leaching of TCIPP from PUF appears to be a first order process. Concentrations of TCIPP in leachate generated by the experiments in this study ranged from 13 mg L -1 to 130 mg L -1 . In serial batch leaching experiments, >95% of TCIPP was depleted from PUF after 168 h total contact with leaching fluid. Our experiments indicate leaching is potentially a very significant pathway of TCIPP emissions to the environment. Copyright © 2017. Published by Elsevier Ltd.

  12. Accelerated Leach Test(s) Program. Annual report

    International Nuclear Information System (INIS)

    Dougherty, D.R.; Fuhrmann, M.; Colombo, P.

    1985-09-01

    This report summarizes the work performed for the Accelerated Leach Test(s) Program at Brookhaven National Laboratory in Fiscal Year 1985 under the sponsorship of the US Department of Energy's Low-Level Waste Management Program (LLWMP). Programmatic activities were concentrated in three areas, as listed and described in the following paragraphs. (1) A literature survey of reported leaching mechanisms, available mathematical models and factors that affect leaching of LLW forms has been compiled. Mechanisms which have been identified include diffusion, dissolution, ion exchange, corrosion and surface effects. Available mathematical models are based on diffusion as the predominant mechanism. Although numerous factors that affect leaching have been identified, they have been conveniently categorized as factors related to the entire leaching system, to the leachant or to the waste form. A report has been published on the results of this literature survey. (2) A computerized data base of LLW leaching data and mathematical models is being developed. The data are being used for model evaluation by curve fitting and statistical analysis according to standard procedures of statistical quality control. (3) Long-term tests on portland cement, bitumen and vinyl ester-styrene (VES) polymer waste forms are underway which are designed to identify and evaluate factors that accelerate leaching without changing the mechanisms. Results on the effect of temperature on leachability indicate that the leach rates of cement and VES waste forms increase with increasing temperature, whereas, the leach rate of bitumen is little affected

  13. Leach testing of Idaho Chemical Processing Plant final waste forms

    International Nuclear Information System (INIS)

    Schuman, R.P.

    1980-01-01

    A number of pellets and highly durable glasses prepared from nonradioactive-simulated high-level wasste calcines have been leach tested. The leach tests are patterned on the IAEA standard test and the proposed Materials Characterization Center tests. Most tests are made with static distilled water at 25, 70, 95, 250, and 350 0 C and in refluxing distilled water, Soxhlet, at 95 0 C. Leach rates are determined by analyzing the leachate by instrumental activation analysis or spectrochemical analysis and from weight loss. Leaches are run on glass using cast and core drilled cylinders, broken pieces and coarse ground material. Sample form has a considerable effect on leach rates; solid pieces gave higher leach rates than ground glass when expressed in g/cm 2 /day. Cesium, molybdenum and weight loss leach rates of cast glass cylinders in distilled water varied from -7 g/cm 7 /day at 25 0 C to approx. 10 -3 g/cm 2 /day at 250 0 C. The leach rates in static distilled water at 95 0 C were considerably lower than those in refluxing distilled water, Soxhlet, at the same temperature. Even at 25 0 C, sodium, cesium, and molybdenum readily leached from the porous pellets, but the pellets showed no visible attack, even at 250 0 C

  14. Microbial leaching of low grade sandstone uranium ores: column leaching studies

    International Nuclear Information System (INIS)

    Bhatti, T.M.; Malik, K.A.; Khalid, A.M.

    1991-01-01

    Microbial leaching studies on a low-grade sandstone uranium ore from Baghalchur Ore Deposits, D. G. Khan, Pakistan, containing 0.027 % U/sub 3/O/sub 8/ for extraction of uranium, were conducted in columns. Baghalchur sandstone uranium ore which is alkaline in nature, contained 5.0% calcite [CaCo/sub 3/], 2-3 % Fe/sub 2/O/sub 3/ and pyrite [FeS/sub 2/] less than 0.1 %. The ore amended with sulfur and/or sulfur slag as external energy source was found to leach with indigenous microflora mostly belonging to the genus Thiobacillus which are present in the uranium mine water. Column leaching studies revealed that when the ore was amended with elemental sulfur and irrigated with mine water (pH 3.5) 53 % U/sub 3/O/sub 8/ could be solubilized from it. However, when the natural mine water was used as such (pH 7.4) the solubilization of uranium was decreased to 41 % U/sub 3/O/sub 8/ in 90 days under similar conditions of percolation rate and temperature. The addition of (NH/sub 4/)/sub 2/SO/sub 4/ (3.0 g/L) in mine water was found to enhance the uranium leaching to 70 % U/sub 3/O/sub 8/ from the columns containing ore amended with sulfur slag. (author)

  15. Uranium leaching from phosphatic sandstone and shale of Qatrani using citrate as a new leaching reagent

    International Nuclear Information System (INIS)

    Hussein, E.M.

    1997-01-01

    Uranium is found in Qatrani area (Southwest of Cairo and North of lake Qarun) in various forms in sedimentary rocks. Two important ore materials have been chosen for studying the recovery of their uranium contents namely; the phosphatic sandstone and the carbonaceous shale. The main emphasis in this thesis is the choice of an acid that would selectively leach uranium from thesis ores while leaving calcium phosphate and carbonate minerals minerals almost completely intact. Citric acid was indeed found advantageous due primarily to its strong ability to form stable complexes with uranium over a wide range of PH values beside the possibility of controlling thr solubility of calcium-bearing compounds by adding calcium citrate. The latter is actually characterized by its ability to exist in an unionized or associated from in citric acid solutions. From the general leaching characteristics of both uranium and P 2 O 5 from Qatrani phosphatic sandstone by citric acid, it was found that uranium could be completely leached beside the possibility of realizing a differential leaching percent values vs P 2 O 5 which is generally of limited solubility. Such a low solubility of P 2 O 5 has even been completely inhibited by providing calcium citrate to the citric acid solutions in amounts sufficient to exist in an optimum ionized non-associated state. Such a provision would render the solution unable to carry any further calcium ions thus the breakdown of the phosphate mineral was hindered while uranium has completely been selectively

  16. Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

    Directory of Open Access Journals (Sweden)

    Yulong Li

    2018-01-01

    Full Text Available In order to accelerate the growth of interfacial intermetallic compound (IMC layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms and 800 ms, were used for the ultrasonic soldering. The isothermal aging was conducted at 150 °C for 0, 120, 240, and 360 h. The evolution of microstructure, the IMC layer growth mechanism during aging, and the shear strength of the joints after aging were systemically investigated. Results showed the following. (i Formation of intermetallic compounds was accelerated by ultrasonic cavitation and streaming effects, the thickness of the interfacial Cu6Sn5 layer increased with aging time, and a thin Cu3Sn layer was identified after aging for 360 h. (ii The growth of the interfacial IMC layer of the ultrasonically soldered Cu/SAC305/Cu joints followed a linear function of the square root of the aging time, revealing a diffusion-controlled mechanism. (iii The tensile shear strength of the joint decreased to a small extent with increasing aging time, owing to the combined effects of IMC grain coarsening and the increase of the interfacial IMC. (iv Finally, although the fracture surfaces and failure locations of the joint soldered with 400 ms and 800 ms vibration times show similar characteristics, they are influenced by the aging time.

  17. Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

    Science.gov (United States)

    Yoon, Jeong-Won; Noh, Bo-In; Jung, Seung-Boo

    2011-09-01

    Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.

  18. CO2 temperature-controlled laser soldering of pig trachea incisions in vitro using flexible albumin bands

    Science.gov (United States)

    Sharvit, Dan; Vasilyev, Tamar; Vasserman, Irena; Simhon, David; Kariv, Naam; DeRowe, Ari; Katzir, Abraham

    2005-04-01

    Resection of a segment of the trachea is a procedure applied for the removal of cervical tumors invading the trachea, or for the treatment of severe tracheal stenosis. The current method of anastomosis is based on multiple sutures. The main drawbacks of this method are: 1) A long procedure time, 2) An air leakage, and 3) An inflammatory response to the sutures. In this study we evaluated the feasibility and effectiveness of the use of temperature controlled CO2 laser soldering of incisions in pig tracheas in vitro. A transverse incision was made in a separated pig trachea. A flexible albumin band was prepared and was laser soldered with albumin solder to the outer surface of the trachea, covering the incision. The soldered trachea ends were sealed and the burst pressure was measured. In a series of in vitro experiments, the mean burst pressure was found to be 230 mm Hg. These preliminary results demonstrated that laser soldering using a flexible albumin band may be a useful method for sealing an incision in the trachea.

  19. Taoshan uranium ore fields in situ blasting heap leaching rate influence factors to investigate

    International Nuclear Information System (INIS)

    Xie Wangnan; Dong Chunming

    2014-01-01

    Taoshan ore field ore in situ blasting heap leaching out build industrial test and production process, stope leaching rate and leaching cycle is large than that, after analysis, blasting method and cloth liquid way is to affect leaching rate and leaching cycle of the main factors. This paper holds that as far as possible using stratified deep hole blasting of squeezing up ways to reduce the building pile of in-situ leaching ore block rate; Adopting effective cloth tube way, increase the leaching agent and ore contact comprehensive; Introduction of bacterial leaching, and other means to improve leaching rate, shorten production cycle, etc to solve it. (authors)

  20. Experiment on bio-leaching of associated molybdenum and uranium ore

    International Nuclear Information System (INIS)

    Zheng Ying; Fan Baotuan; Liu Jian; Meng Yunsheng; Liu Chao

    2007-01-01

    Column leaching experiment results on associated molybdenum uranium ore by bacteria (T. f) are introduced. The ore are leached for 210 days using bacteria domesticated to tolerate molybdenum, the leaching of uranium is of 98% and leaching of molybdenum is of 41%. Sulphuric acid produced by bio-oxidation of sulfides in ore can meet the demand of ore leaching. (authors)

  1. Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds

    Energy Technology Data Exchange (ETDEWEB)

    Haseeb, A.S.M.A., E-mail: haseeb@um.edu.my; Arafat, M.M., E-mail: arafat_mahmood@yahoo.com; Johan, Mohd Rafie, E-mail: mrafiej@um.edu.my

    2012-02-15

    This work investigates the effects of molybdenum nanoparticles on the growth of interfacial intermetallic compound between Sn-3.8Ag-0.7Cu solder and copper substrate during multiple reflow. Molybdenum nanoparticles were mixed with Sn-3.8Ag-0.7Cu solder paste by manual mixing. Solder samples were reflowed on a copper substrate in a 250 Degree-Sign C reflow oven up to six times. The molybdenum content of the bulk solder was determined by inductive coupled plasma-optical emission spectrometry. It is found that upon the addition of molybdenum nanoparticles to Sn-3.8Ag-0.7Cu solder, the interfacial intermetallic compound thickness and scallop diameter decreases under all reflow conditions. Molybdenum nanoparticles do not appear to dissolve or react with the solder. They tend to adsorb preferentially at the interface between solder and the intermetallic compound scallops. It is suggested that molybdenum nanoparticles impart their influence on the interfacial intermetallic compound as discrete particles. The intact, discrete nanoparticles, by absorbing preferentially at the interface, hinder the diffusion flux of the substrate and thereby suppress the intermetallic compound growth. - Highlights: Black-Right-Pointing-Pointer Mo nanoparticles do not dissolve or react with the SAC solder during reflow. Black-Right-Pointing-Pointer Addition of Mo nanoparticles results smaller IMC thickness and scallop diameter. Black-Right-Pointing-Pointer Mo nanoparticles influence the interfacial IMC through discrete particle effect.

  2. Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction

    Science.gov (United States)

    Takaku, Yoshikazu; Ohnuma, Ikuo; Kainuma, Ryosuke; Yamada, Yasushi; Yagi, Yuji; Nishibe, Yuji; Ishida, Kiyohito

    2006-11-01

    Bismuth and its alloys are candidates for Pb-free high-temperature solders that can be substituted for conventional Pb-rich Pb-Sn solders (melting point (mp) = 573 583 K). However, inferior properties such as brittleness and weak bonding strength should be improved for practical use. To that end, BiCu-X (X=Sb, Sn, and Zn) Pb-free high-temperature solders are proposed. Miscibility gaps in liquid BiCu-X alloys were surveyed using the thermodynamic database ADAMIS (alloy database for micro-solders), and compositions of the BiCu-X solders were designed on the basis of calculation. In-situ composite solders that consist of a Bi-base matrix with fine intermetallic compound (IMC) particles were produced by gas-atomizing and melt-spinning methods. The interfacial reaction between in-situ composite solders and Cu or Ni substrates was investigated. The IMCs at the interface formed a thin, uniform layer, which is an appropriate morphology for a reliable solder joint.

  3. Microstructural effects on constitutive and fatigue fracture behavior of TinSilverCopper solder

    Science.gov (United States)

    Tucker, Jonathon P.

    As microelectronic package construction becomes more diverse and complex, the need for accurate, geometry-independent material constitutive and failure models increases. Evaluations of packages based on accelerated environmental tests (such as accelerated thermal cycling or power cycling) only provide package-dependent reliability information. In addition, extrapolations of such test data to life predictions under field conditions are often empirical. Besides geometry, accelerated environmental test data must account for microstructural factors such as alloy composition or isothermal aging condition, resulting in expensive experimental variation. In this work, displacement-controlled, creep, and fatigue lap shear tests are conducted on specially designed SnAgCu test specimens with microstructures representative to those found in commercial microelectronic packages. The data are used to develop constitutive and fatigue fracture material models capable of describing deformation and fracture behavior for the relevant temperature and strain rate ranges. Furthermore, insight is provided into the microstructural variation of solder joints and the subsequent effect on material behavior. These models are appropriate for application to packages of any geometrical construction. The first focus of the thesis is on Pb-mixed SnAgCu solder alloys. During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of SnPb and SnAgCu often result from either mixed assemblies or rework. Three alloys of 1, 5 and 20 weight percent Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn37Pb components mixed with Sn3.0Ag0.5Cu. Displacement-controlled (constant strain rate) and creep tests were performed at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. Rate-dependent constitutive models for Pb

  4. Leaching of plastic additives to marine organisms

    International Nuclear Information System (INIS)

    Koelmans, Albert A.; Besseling, Ellen; Foekema, Edwin M.

    2014-01-01

    It is often assumed that ingestion of microplastics by aquatic species leads to increased exposure to plastic additives. However, experimental data or model based evidence is lacking. Here we assess the potential of leaching of nonylphenol (NP) and bisphenol A (BPA) in the intestinal tracts of Arenicola marina (lugworm) and Gadus morhua (North Sea cod). We use a biodynamic model that allows calculations of the relative contribution of plastic ingestion to total exposure of aquatic species to chemicals residing in the ingested plastic. Uncertainty in the most crucial parameters is accounted for by probabilistic modeling. Our conservative analysis shows that plastic ingestion by the lugworm yields NP and BPA concentrations that stay below the lower ends of global NP and BPA concentration ranges, and therefore are not likely to constitute a relevant exposure pathway. For cod, plastic ingestion appears to be a negligible pathway for exposure to NP and BPA. - Highlights: • Uptake of plastic additives after plastic ingestion was modeled for worms and fish. • This was done for bisphenol A and nonylphenol. • Uncertainty was accounted for by Monte Carlo simulations. • It appeared that exposure by plastic ingestion was negligible for fish. • Plastic ingestion may occasionally be relevant for marine worms. - Leaching of nonylphenol and bisphenol A from ingested microplastic may be relevant for the lugworm, but is irrelevant for fish like cod

  5. YACON INULIN LEACHING DURING HOT WATER BLANCHING

    Directory of Open Access Journals (Sweden)

    Caroline Fenner Scher

    2015-10-01

    Full Text Available ABSTRACTYacon roots contain inulin, which has prebiotic properties and it may be used as sucrose or fat substitutes. However, inulin is very soluble in water. The loss of this important nutrient during blanching is caused mainly by diffusion or leaching, which might be diminished if blanching temperature - time conditions are correctly employed. The aim of this study was to determine the leaching of the sugars inulin, glucose and fructose, present in yacon roots, during hot water blanching under different time/temperature conditions. The samples were cleaned and peeled and cut into geometric forms of 1.75 ± 0.35 mm thick disks. A complete factorial experimental design was used, and the treatments of the samples were compared using the Tukey test. The results indicated that the time and temperature were significant in the dissolution of the sugars. The lowest inulin losses occurred at temperatures and times lower than 60 ºC and 3 minutes. For all temperatures, the lowest glucose and fructose losses were obtained at time lower than 3 and 5 minutes, respectively.

  6. Low resistivity contact to iron-pnictide superconductors

    Science.gov (United States)

    Tanatar, Makariy; Prozorov, Ruslan; Ni, Ni; Bud& #x27; ko, Sergey; Canfield, Paul

    2013-05-28

    Method of making a low resistivity electrical connection between an electrical conductor and an iron pnictide superconductor involves connecting the electrical conductor and superconductor using a tin or tin-based material therebetween, such as using a tin or tin-based solder. The superconductor can be based on doped AFe.sub.2As.sub.2, where A can be Ca, Sr, Ba, Eu or combinations thereof for purposes of illustration only.

  7. Comparison of leach results from field and laboratory prepared samples

    International Nuclear Information System (INIS)

    Oblath, S.B.; Langton, C.A.

    1985-01-01

    The leach behavior of saltstone prepared in the laboratory agrees well with that from samples mixed in the field using the Littleford mixer. Leach rates of nitrates and cesium from the current reference formulation saltstone were compared. The laboratory samples were prepared using simulated salt solution; those in the field used Tank 50 decontaminated supernate. For both nitrate and cesium, the field and laboratory samples showed nearly identical leach rates for the first 30 to 50 days. For the remaining period of the test, the field samples showed higher leach rates with the maximum difference being less than a factor of three. Ruthenium and antimony were present in the Tank 50 supernate in known amounts. Antimony-125 was observed in the leachate and a fractional leach rate was calculated to be at least a factor of ten less than that of 137 Cs. No 106 Ru was observed in the leachate, and the release rate was not calculated. However, based on the detection limits for the analysis, the ruthenium leach rate must also be at least a factor of ten less than cesium. These data are the first measurements of the leach rates of Ru and Sb from saltstone. The nitrate leach rates for these samples were 5 x 10 -5 grams of nitrate per square cm per day after 100 days for the laboratory samples and after 200 days for the field samples. These values are consistent with the previously measured leach rates for reference formulation saltstone. The relative standard deviation in the leach rate is about 15% for the field samples, which all were produced from one batch of saltstone, and about 35% for the laboratory samples, which came from different batches. These are the first recorded estimates of the error in leach rates for saltstone

  8. Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

    Science.gov (United States)

    Mallik, S.; Bauer, R.; Hübner, F.; Ekere, N. N.

    2011-01-01

    Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

  9. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Dias, Marcelino; Costa, Thiago [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Rocha, Otávio [Federal Institute of Education, Science and Technology of Pará — IFPA, 66093-020 Belém, PA (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos — UFSCar, 13565-905 São Carlos, SP (Brazil); Cheung, Noé, E-mail: cheung@fem.unicamp.br [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil)

    2015-08-15

    Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing.

  10. In-vitro investigations of skin closure using diode laser and protein solder containing gold nano shells

    International Nuclear Information System (INIS)

    Nourbakhsh, M. S.; Etrati Khosroshahi, M.

    2011-01-01

    Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nano shells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nano shells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nano shells were prepared. A full thickness incision of 2*20 mm 2 was made on the surface and after placing 50 μ1 of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nano shell concentrations. In addition, at constant laser irradiance (I), the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to σt = 1610 g/cm 2 at I ∼ 60 W cm-2, T ∼ 65 d egree C , Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nano shells can be used as an indocyanine green dye alterative for laser tissue soldering. Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

  11. Accelerated Leach Test(s) Program: Annual report

    International Nuclear Information System (INIS)

    Dougherty, D.R.; Pietrzak, R.F.; Fuhrmann, M.; Colombo, P.

    1986-09-01

    A computerized data base of LLW leaching data has been developed. Long-term tests on portland cement, bitumen and vinyl ester-styrene (VES) polymer waste forms containing simulated wastes are underway which are designed to identify and evaluate factors that accelerate leaching without changing the mechanisms

  12. Nitrate leaching and pesticide use in energy crops

    DEFF Research Database (Denmark)

    Jørgensen, Uffe

    2006-01-01

    Nitrate leaching measured below willow and miscanthus is very low from the established crops. Pesticide use in energy crops is low as well.......Nitrate leaching measured below willow and miscanthus is very low from the established crops. Pesticide use in energy crops is low as well....

  13. LEACHING BOUNDARY IN CEMENT-BASED WASTE FORMS

    Science.gov (United States)

    Cement-based fixation systems are among the most commonly employed stabilization/solidification techniques. These cement haste mixtures, however, are vulnerable to ardic leaching solutions. Leaching of cement-based waste forms in acetic acid solutions with different acidic streng...

  14. Package characterization by laboratory leaching and diffusion experiments using radionuclides

    International Nuclear Information System (INIS)

    Das, H.A.

    1989-01-01

    The leaching of solid inorganic waste from loaded concrete or cement by incoming water can be described in terms of a steady-state outward diffusion of the saturated solution, formed inside the pores. In this paper, the derived equations permit the prediction of long-term leaching behavior. Radiotracer experiments enable the determination of the parameters involved

  15. Developments of uranium and gold ores heap leaching technologies

    International Nuclear Information System (INIS)

    Tian Yuan; Guan Zibin; Gao Renxi

    1998-01-01

    The author reviews developments in heap leaching of uranium and gold ores at home and abroad, summarises condition of application. The author also presents problems having to be studied and settled urgently in heap leaching of uranium and gold ores in China

  16. Leaching of RA-226 contaminated gravel using different aqueous treatments

    Energy Technology Data Exchange (ETDEWEB)

    Mamoon, A; Abulfaraj, W H; Sohsah, M A [King Abdulaziz University, Jeddah, Saudi Arbabia (Saudi Arabia)

    1997-12-31

    Investigation of the efficiencies of different aqueous leaching treatments was carried out on gravel artificially contaminated with Ra-226. The extent of leaching efficiency was determined in terms of Ra-226 and its daughter Rn-222. Liquid scintillation counting using high efficiency mineral oil based liquid scintillator was the technique adopted for measuring Ra-226 and Rn-222 leached off the contaminated gravel. Water, dilute solutions of barium chloride and HCl were used as leachants. Different masses of gravel were leached with 200 mL of leachant for various contact time periods. The leached Rn-222 activity measured was plotted vs the decay factor e; from which Rn-222 and Ra-226 originally present in the sample were determined. Several leaching parameters were tested; namely type of leachant, leachant volume/gravel mass ratio, leachant contact time, effect of varying Ba Cl{sub 2} concentration, and successive leaching. Optimization of the leaching parameters for desorption of Ra-226 off the contaminated gravel under laboratory conditions may help determine the ideal conditions for remediating soil contaminated with radium or chemically similar radionuclides. 7 figs.

  17. An experimental study on gold precipitation from leach solutions of ...

    African Journals Online (AJOL)

    This paper presents the results of the study dedicated to the determination of the optimum parameters for the electrolytic gold precipitation from thiourea leach solutions. The leaching was carried out using technogenic gold-bearing raw materials (gold-bearing sands) of the Far East of the Russian Federation. The study ...

  18. Static leaching of uraniferous shales on open areas

    International Nuclear Information System (INIS)

    Hernandez Nieto, J.; Cordero, G.; Villarrubia, M.

    1973-01-01

    This report describes the tests on acid heap leaching with conventional (1.400 ppm U 3 O 8 ) crushed uranium ores. We use open circuits with low internal recycled. Using starving acidity in the leaching solutions we obtain a smooth solubilization of uranium and, at the same time, the pregnant liquors are good for the solvent extraction recovery. (Author)

  19. Aqueous-chlorine leaching of typical Canadian uranium ores

    International Nuclear Information System (INIS)

    Haque, K.E.

    1982-01-01

    Laboratory-scale aqueous-chlorine leaches were conducted on quartz-pebble conglomerates, pegmatite and vein-type ores. Optimum leach temperatures, pulp density and retention times were determined. Uranium extraction of 98 per cent was obtained from the Elliot Lake, Madawaska Mines of Bancroft and Rabbit Lake ores, 96 per cent from the Key Lake ore and 86 per cent from the Agnew Lake ore. However, tailings containing 15-20 pCi g -1 of radium-226 were obtained only from the Elliot Lake and Agnew lake quartz-pebble conglomerates and Bancroft pegmatite-type ores by second-stage leaches with HCl. The second-stage leach results indicate that multistage (3 or 4) acid-chloride or salt-chloride leaches might be effective to obtain tailings containing 15-20 pCi 226 Ra g -1 from the high-grade vein-type ores. Comparative reagent-cost estimates show that the sulphuric-acid leach process is far less expensive than aqueous chlorine leaching. Nevertheless, only the aqueous chlorine and acid-chloride leaches in stages are effective in producing tailings containing 15-20 pCi 226 Ra g -1 from the typical Canadian uranium ores. (Auth.)

  20. Manual of acid in situ leach uranium mining technology

    International Nuclear Information System (INIS)

    2001-08-01

    In situ leaching (ISL) technology recovers uranium using two alternative chemical leaching systems - acid and alkaline. This report brings together information from several technical disciplines that are an essential part of ISL technology. They include uranium geology, geohydrology, chemistry as well as reservoir engineering and process engineering. This report provides an extensive description of acid ISL uranium mining technology