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Sample records for solder joints fatigue

  1. Fatigue and thermal fatigue of Pb-Sn solder joints

    International Nuclear Information System (INIS)

    Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

    1987-01-01

    This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55 0 C and 125 0 C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb

  2. Characteristics of solder joints under fatigue loads using piezomechanical actuation

    Science.gov (United States)

    Shim, Dong-Jin; Spearing, S. Mark

    2003-07-01

    Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

  3. Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

    International Nuclear Information System (INIS)

    Liu, X.W.; Plumbridge, W.J.

    2003-01-01

    The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

  4. A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

    Science.gov (United States)

    Wei, Helin; Wang, Kuisheng

    2011-11-01

    Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

  5. A review of typical thermal fatigue failure models for solder joints of electronic components

    Science.gov (United States)

    Li, Xiaoyan; Sun, Ruifeng; Wang, Yongdong

    2017-09-01

    For electronic components, cyclic plastic strain makes it easier to accumulate fatigue damage than elastic strain. When the solder joints undertake thermal expansion or cold contraction, different thermal strain of the electronic component and its corresponding substrate is caused by the different coefficient of thermal expansion of the electronic component and its corresponding substrate, leading to the phenomenon of stress concentration. So repeatedly, cracks began to sprout and gradually extend [1]. In this paper, the typical thermal fatigue failure models of solder joints of electronic components are classified and the methods of obtaining the parameters in the model are summarized based on domestic and foreign literature research.

  6. Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu

    Science.gov (United States)

    Lee, Hwa-Teng; Huang, Kuo-Chen

    2016-12-01

    Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

  7. Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

    Science.gov (United States)

    Coyle, Richard J.; Sweatman, Keith; Arfaei, Babak

    2015-09-01

    Thermal fatigue is a major source of failure of solder joints in surface mount electronic components and it is critically important in high reliability applications such as telecommunication, military, and aeronautics. The electronic packaging industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu alloys first established as replacements for eutectic SnPb. This paper discusses the results from Pb-free solder joint reliability programs sponsored by two industry consortia. The characteristic life in accelerated thermal cycling is reported for 12 different Pb-free solder alloys and a SnPb control in 9 different accelerated thermal cycling test profiles in terms of the effects of component type, accelerated thermal cycling profile and dwell time. Microstructural analysis on assembled and failed samples was performed to investigate the effect of initial microstructure and its evolution during accelerated thermal cycling test. A significant finding from the study is that the beneficial effect of Ag on accelerated thermal cycling reliability (measured by characteristic lifetime) diminishes as the severity of the accelerated thermal cycling, defined by greater ΔT, higher peak temperature, and longer dwell time increases. The results also indicate that all the Pb-free solders are more reliable in accelerated thermal cycling than the SnPb alloy they have replaced. Suggestions are made for future work, particularly with respect to the continued evolution of alloy development for emerging application requirements and the value of using advanced analytical methods to provide a better understanding of the effect of microstructure and its evolution on accelerated thermal cycling performance.

  8. Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

    International Nuclear Information System (INIS)

    Zhang, Liang; Han, Ji-guang; Guo, Yong-huan; He, Cheng-wen

    2014-01-01

    With the addition of 0.03 wt% rare earth Ce, in our previous works, the properties of SnAgCu solder were enhanced obviously. Based on the Garofalo–Arrhenius creep constitutive model, finite element method was used to simulate the stress–strain response during thermal cycle loading, and combined with the fatigue life prediction models, the fatigue life of SnAgCu/SnAgCuCe solder joints was calculated respectively, which can demonstrate the effect of the rare earth Ce on the fatigue life of SnAgCu solder joints. The results indicated that the maximum stress–strain can be found on the top surface of the corner solder joint, and the warpage of the PCB substrate occurred during thermal cycle loading. The trends obtained from modeling results have a good agreement with the experimental data reported in the literature for WLCSP devices. In addition, the stress–strain of SnAgCuCe solder joints is lower than that of SnAgCu solder joints. The thermal fatigue lives of solder joints calculated based on the creep model and creep strain energy density model show that the fatigue life of SnAgCuCe solder joints is higher than the SnAgCu solder joints. The fatigue life of SnAgCuCe solder joints can be enhanced significantly with the addition of Ce, is 30.2% higher than that of SnAgCu solder joints, which can be attributed to the CeSn 3 particles formed resisting the motion of dislocation; moreover, the refinement of microstructure and the IMC sizes also contribute to the enhancement of fatigue life, which elucidates that SnAgCuCe solder can be utilized in electronic industry with high reliability replacing the SnAgCu solder

  9. Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

    Science.gov (United States)

    Barbagallo, C.; Malgioglio, G. L.; Petrone, G.; Cammarata, G.

    2017-05-01

    For power devices, the reliability of thermal fatigue induced by thermal cycling has been prioritized as an important concern. The main target of this work is to apply a numerical procedure to assess the fatigue life for lead-free solder joints, that represent, in general, the weakest part of the electronic modules. Starting from a real multi-chip power module, FE-based models were built-up by considering different conditions in model implementation in order to simulate, from one hand, the worst working condition for the module and, from another one, the module standing into a climatic test room performing thermal cycles. Simulations were carried-out both in steady and transient conditions in order to estimate the module thermal maps, the stress-strain distributions, the effective plastic strain distributions and finally to assess the number of cycles to failure of the constitutive solder layers.

  10. Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

    International Nuclear Information System (INIS)

    Barbagallo, C; Petrone, G; Cammarata, G; Malgioglio, G L

    2017-01-01

    For power devices, the reliability of thermal fatigue induced by thermal cycling has been prioritized as an important concern. The main target of this work is to apply a numerical procedure to assess the fatigue life for lead-free solder joints, that represent, in general, the weakest part of the electronic modules. Starting from a real multi-chip power module, FE-based models were built-up by considering different conditions in model implementation in order to simulate, from one hand, the worst working condition for the module and, from another one, the module standing into a climatic test room performing thermal cycles. Simulations were carried-out both in steady and transient conditions in order to estimate the module thermal maps, the stress-strain distributions, the effective plastic strain distributions and finally to assess the number of cycles to failure of the constitutive solder layers. (paper)

  11. Thermomechanical fatigue life prediction for several solders

    Science.gov (United States)

    Wen, Shengmin

    anisotropic small-scale (micron or nano scale) solder joints. More importantly, the theory is materials science based so that the parameters of the fatigue formula can be worked out by testing of bulk specimens while the formula can be applicable to small-scale structures. The theory suggests metallurgical control in the manufacturing process to optimize the fatigue life of solder structures.

  12. Solder joint technology materials, properties, and reliability

    CERN Document Server

    Tu, King-Ning

    2007-01-01

    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  13. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-11-25

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

  14. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    International Nuclear Information System (INIS)

    Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-01-01

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

  15. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

    Science.gov (United States)

    Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

    2017-08-01

    Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

  16. Soldering of Mg Joints Using Zn-Al Solders

    Science.gov (United States)

    Gancarz, Tomasz; Berent, Katarzyna; Skuza, Wojciech; Janik, Katarzyna

    2018-04-01

    Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 °C, 450 °C, 475 °C, and 500 °C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.

  17. Microstructure evolution and thermomechanical fatigue of solder materials

    NARCIS (Netherlands)

    Matin, M.A.

    2005-01-01

    The microelectronics industry is confronted with the new challenge to produce joints with lead-free solder materials replacing classical tin-lead solders in devices used in many fields (e.g. consumer electronics, road transport, aviation, space-crafts, telecommunication). In service, solder

  18. Visual detection of defects in solder joints

    Science.gov (United States)

    Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

    1995-03-01

    The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

  19. Mechanical properties of soldered joints of niobium base alloys

    International Nuclear Information System (INIS)

    Grishin, V.L.

    1980-01-01

    Mechanical properties of soldered joints of niobium alloys widely distributed in industry: VN3, VN4, VN5A, VN5AE, VN5AEP etc., 0.6-1.2 mm thick are investigated. It is found out that the usage of zirconium-vanadium, titanium-tantalum solders for welding niobium base alloys permits to obtain soldered joints with satisfactory mechanical properties at elevated temperatures

  20. How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

    Science.gov (United States)

    Suhir, E.; Yi, S.; Ghaffarian, R.

    2017-03-01

    It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

  1. Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

    Science.gov (United States)

    Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

    2018-03-01

    In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

  2. Strength of joints brazed with two-phase solders

    International Nuclear Information System (INIS)

    Shnyakin, N.S.; Parfenova, L.V.; Ekatova, A.S.; Prilepskaya, I.V.

    1976-01-01

    Dependence of the structure and strength of soldered joints upon a gap size in case of 1Kh18N10T stainless steel soldering with a double-phase solder of Ni-Zn-Cu system is described. Butt and lap joints have been subjected to soldering with gas-flame and induction heating. The optimum conditions of the solder crystallization are determined with wedge-gap samples. The studies show that the character of distribution of a fusible β-phase in metal depends upon a gap size. With gaps up to 0.1 mm the β-phase enriched with a fusible component (zinc) runs as a continuous thin interlayer in the middle of the seam. As a result of zinc evaporation from the β-phase this interlayer becomes internally oxidized. After the sample is broken an oxidized fracture gives one the impression of a poor fusion in the middle part of the joint. The ultimate strength of butt joints is 15-20 kgf/sq.mm. A value of thermal expansion of 1Kh18N10T steel samples, 1-5 mm thick, has been experimentally determined for butt soldering. The elongation of two halves of the sample is measured by an indicator and proved to be 0.89 mm for a 50x50x2 mm sample at a soldering temperature of 1.100 deg C. The paper presents methods for the calculation of an optimal gap value for butt soldering with a local gas-flame and induction heating

  3. Microstructural effects on constitutive and fatigue fracture behavior of TinSilverCopper solder

    Science.gov (United States)

    Tucker, Jonathon P.

    As microelectronic package construction becomes more diverse and complex, the need for accurate, geometry-independent material constitutive and failure models increases. Evaluations of packages based on accelerated environmental tests (such as accelerated thermal cycling or power cycling) only provide package-dependent reliability information. In addition, extrapolations of such test data to life predictions under field conditions are often empirical. Besides geometry, accelerated environmental test data must account for microstructural factors such as alloy composition or isothermal aging condition, resulting in expensive experimental variation. In this work, displacement-controlled, creep, and fatigue lap shear tests are conducted on specially designed SnAgCu test specimens with microstructures representative to those found in commercial microelectronic packages. The data are used to develop constitutive and fatigue fracture material models capable of describing deformation and fracture behavior for the relevant temperature and strain rate ranges. Furthermore, insight is provided into the microstructural variation of solder joints and the subsequent effect on material behavior. These models are appropriate for application to packages of any geometrical construction. The first focus of the thesis is on Pb-mixed SnAgCu solder alloys. During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of SnPb and SnAgCu often result from either mixed assemblies or rework. Three alloys of 1, 5 and 20 weight percent Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn37Pb components mixed with Sn3.0Ag0.5Cu. Displacement-controlled (constant strain rate) and creep tests were performed at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. Rate-dependent constitutive models for Pb

  4. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  5. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Directory of Open Access Journals (Sweden)

    Mohd Nizam Ab. Rahman

    2014-12-01

    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  6. Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

    Energy Technology Data Exchange (ETDEWEB)

    Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

    1999-11-01

    Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

  7. Influence of solder joint length to the mechanical aspect during the thermal stress analysis

    Science.gov (United States)

    Tan, J. S.; Khor, C. Y.; Rahim, Wan Mohd Faizal Wan Abd; Ishak, Muhammad Ikman; Rosli, M. U.; Jamalludin, Mohd Riduan; Zakaria, M. S.; Nawi, M. A. M.; Aziz, M. S. Abdul; Ani, F. Che

    2017-09-01

    Solder joint is an important interconnector in surface mount technology (SMT) assembly process. The real time stress, strain and displacement of the solder joint is difficult to observe and assess the experiment. To tackle these problems, simulation analysis was employed to study the von Mises stress, strain and displacement in the thermal stress analysis by using Finite element based software. In this study, a model of leadless electronic package was considered. The thermal stress analysis was performed to investigate the effect of the solder length to those mechanical aspects. The simulation results revealed that solder length gives significant effect to the maximum von Mises stress to the solder joint. Besides, changes in solder length also influence the displacement of the solder joint in the thermal environment. The increment of the solder length significantly reduces the von Mises stress and strain on the solder joint. Thus, the understanding of the physical parameter for solder joint is important for engineer prior to designing the solder joint of the electronic component.

  8. Mechanical properties of Bi-In-Zn/ Cu solder joint system

    International Nuclear Information System (INIS)

    Ervina Efzan Mohd Noor; Mohammed Noori Ridha; Ahmad Badri Ismail; Nurulakmal Mohd Sharif; Kuan Yew Cheong; Tadashi Ariga; Zuhailawati Hussain

    2009-01-01

    Full text: In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry; the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this works, microstructure and mechanical properties of different reflow temperature (80, 100, 120 and 140 degree Celsius) for solder joints on shear strength of Bi-In-Zn lead free solder with low melting temperature of 60 degree Celsius on Cu solder joint has been investigated. This paper will compared the mechanical properties of the Bi-In-Zn lead-free solder alloys with current lead-free solder, Sn-Ag-Cu solder alloy. The fracture surface analyses have been observed by Optical Microscope and were investigated by Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX) and proved it by X-ray diffraction (XRD). (author)

  9. Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

    Directory of Open Access Journals (Sweden)

    Molnar A.

    2017-06-01

    Full Text Available In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

  10. Quality Analysis of Welded and Soldered Joints of Cu-Nb Microcomposite Wires

    Directory of Open Access Journals (Sweden)

    Nikolaj VIŠNIAKOV

    2011-03-01

    Full Text Available Quality analysis of welded and soldered joints of Cu-Nb microcomposite wires has been performed. Quality and mechanical characteristics of joints as ultimate tensile stress limit and elongation at break were measured with an universal testing machine and controlled visually using an optical microscope. Two wires joints were soldered with silver and copper solders and put into steel and copper sleeve respectively. Another two wires joints were soldered with silver solder and welded without any reinforcement. Joints soldered with the silver solder and steel sleeve have demonstrated the best mechanical characteristics: ultimate tensile stress limit of 650 MPa and elongation at break of 0.85 %. Joints soldered with the copper sleeve have no advantages comparing with the soldered butt joint. Ultimate tensile stress limit and elongation at break were in 300 MPa - 350 MPa and in 0.35 % - 0.45 % ranges respectively. Two welded joints had ultimate tensile stress limit of 470 MPa and elongation at break of 0.71 %. In all joints the microstructure of Nb filaments was destroyed and mechanical properties have been specified by mechanical strength of copper and sleeve materials only.http://dx.doi.org/10.5755/j01.ms.17.1.242

  11. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

    Science.gov (United States)

    Lee, Sang-Yeob; Lee, Jong-Hyuk

    2010-12-01

    The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

  12. Fatigue damage modeling in solder interconnects using a cohesive zone approach

    NARCIS (Netherlands)

    Abdul-Baqi, A.J.J.; Schreurs, P.J.G.; Geers, M.G.D.

    2005-01-01

    The objective of this work is to model the fatigue damage process in a solder bump subjected to cyclic loading conditions. Fatigue damage is simulated using the cohesive zone methodology. Damage is assumed to occur at interfaces modeled through cohesive zones in the material, while the bulk material

  13. Interfacial reaction of Sn-based solder joint in the package system

    Science.gov (United States)

    Gu, Huandi

    In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

  14. Impurity Effects in Electroplated-Copper Solder Joints

    Directory of Open Access Journals (Sweden)

    Hsuan Lee

    2018-05-01

    Full Text Available Copper (Cu electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl disulfide (SPS with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

  15. Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

    2008-04-24

    The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes.

  16. Investigation into mechanical properties of joints of heterogeneous materials brazed with high-temperature solders

    International Nuclear Information System (INIS)

    Lomenko, V.I.; Merkushev, V.P.; Borodina, L.M.; Sycheva, T.S.; Tokhtina, O.A.; Frolov, N.N.

    1988-01-01

    Mechanical properties of copper joints with copper, 12Kh18M10T steel and KhD50 composite obtained by vacuum brazing by copper-titanium solder as compared with properties of joints brazed by PSr 72 and PMFOTsr 6-4-0.03 solders in hydrogen are studied. Dependences of joints strength on temperature of contact - reactive vacuum brazing are obtained. Possible applications of joints of dissimilar materials in electrovacuum devices subjected to the effect of dynamic loadings are established

  17. The creep behavior of In-Ag eutectic solder joints

    International Nuclear Information System (INIS)

    Reynolds, H.L.; Kang, S.H.; Morris, J.W. Jr.; Univ. of California, Berkeley, CA

    1999-01-01

    The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90 C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the In-rich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems

  18. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  19. Soldering handbook

    CERN Document Server

    Vianco, Paul T

    1999-01-01

    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  20. Reliability and microstructure of lead-free solder joints in industrial electronics after accelerated thermal aging

    NARCIS (Netherlands)

    Scaltro, F.; Biglari, M.H.; Kodentsov, A.; Yakovleva, O.; Brom, E.

    2009-01-01

    The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface component/solder together with the formation of fractures. The evolution, the morphology and the elemental

  1. The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

    Science.gov (United States)

    Mayappan, R.; Salleh, A.; Andas, J.

    2017-09-01

    Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

  2. The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

    Science.gov (United States)

    Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

    2015-12-01

    Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (ptensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

  3. Effect of gamma radiation on micromechanical hardness of lead-free solder joint

    Energy Technology Data Exchange (ETDEWEB)

    Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

    2015-09-25

    Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

  4. Lead free solder mechanics and reliability

    CERN Document Server

    Pang, John Hock Lye

    2012-01-01

    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  5. Aging treatment characteristics of solder bump joint for high reliability optical module

    International Nuclear Information System (INIS)

    Kim, Kyung-Seob; Yu, Chung-Hee; Yang, Jun-Mo

    2004-01-01

    The joint strength and fracture surfaces of Sn-37 mass% Pb and Au stud bumps for photo diode packages after isothermal aging testing were studied experimentally. Al/Au stud bumps and Cu/Sn-37 mass% Pb solders were adopted, and aged for up to 900 h to analyze the effect of intermetallic compound (IMC). The joint strength decreased with aging time. The diffraction patterns of Cu 6 Sn 5 , scallop-shaped IMCs, and planar-shaped Cu 3 Sn were characterized using transmission electron microscopy (TEM). The formation of Kirkendall voids and the growth of IMCs at the solder were found to be a possible mechanism for joint strength reduction

  6. Analysis of a short beam with application to solder joints: could larger stand-off heights relieve stress?

    Science.gov (United States)

    Suhir, Ephraim

    2015-08-01

    conventional joint configuration. By employing beam-like solder joints one can even manage to avoid inelastic deformations of the joints, thereby increasing dramatically their fatigue lifetime. Future work will include, but might not be limited to, the finite-element computations, experimental evaluations (such as, e.g., shear-off testing), and analyses of the occurrence and the role of the inelastic strains, if any. The paper is intended for materials-, reliability- and industrial- physicists and applied scientists.

  7. Mechanical performances of lead-free solder joint connections with applications in the aerospace domain

    Directory of Open Access Journals (Sweden)

    Georgiana PADURARU

    2016-03-01

    Full Text Available The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of solder joint in correlation with different pad finishes, there were made some mechanical determinations using a dedicated Share Test System. The theoretical model highlights the link between the experimental results and the influence of gravitational acceleration on the mechanical and functional integrity of the electronic assemblies that works in vibration environment. The paper novelty is provided by the interdisciplinary experiment that offers results that can be used in the mechanical, tribological, electronical and aerospace domains.

  8. Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

    Directory of Open Access Journals (Sweden)

    Jinhua Mi

    2014-01-01

    Full Text Available Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA and fine-pitch ball grid array (FBGA interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products.

  9. Effect of gap distance on tensile strength of preceramic base metal solder joints.

    Science.gov (United States)

    Fattahi, Farnaz; Motamedi, Milad

    2011-01-01

    In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023), but the differences between other groups were not sig-nificant at a significance level of 0.05. There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints.

  10. Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

    Science.gov (United States)

    Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R.

    2014-01-01

    A fracture mechanism map (FMM) is a powerful tool which correlates the fracture behavior of a material to its microstructural characteristics in an explicit and convenient way. In the FMM for solder joints, an effective thickness of the interfacial intermetallic compound (IMC) layer ( t eff) and the solder yield strength ( σ ys,eff) are used as abscissa and ordinate axes, respectively, as these two predominantly affect the fracture behavior of solder joints. Earlier, a definition of t eff, based on the uniform thickness of IMC ( t u) and the average height of the IMC scallops ( t s), was proposed and shown to aptly explain the fracture behavior of solder joints on Cu. This paper presents a more general definition of t eff that is more widely applicable to a range of metallizations, including Cu and electroless nickel immersion gold (ENIG). Using this new definition of t eff, mode I FMM for SAC387/Cu joints has been updated and its validity was confirmed. A preliminary FMM for SAC387/Cu joints with ENIG metallization is also presented.

  11. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    International Nuclear Information System (INIS)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-01-01

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines

  12. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-10-31

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

  13. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    Science.gov (United States)

    Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

    2016-12-01

    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

  14. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Energy Technology Data Exchange (ETDEWEB)

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

    2013-06-01

    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  15. Fatigue strength of socket welded pipe joint

    International Nuclear Information System (INIS)

    Iida, K.; Matsuda, F.; Sato, M.; Higuchi, M.; Nakagawa, A.

    1994-01-01

    Fully reversed four point bending fatigue tests were carried out of small diameter socket welded joints made of carbon steels. Experimental parameters are pipe diameter, thickness of pipe and socket wall, throat depth and shape of fillet welds, slip-on and diametral gaps in the socket welding, lack of penetration at the root of fillet welds, and peening of fillet welds. In most cases a fatigue crack started from the root of the fillet, but in the case of higher stress amplitude, it tended to start from the toe of fillet. The standard socket welded joint of 50 mm diameter showed relatively low fatigue strength, 46 MPa in stress amplitude at the 10 7 cycles failure life. This value corresponds to about 1/5 of that of the smoothed base metal specimens in axial fatigue. The fatigue strength showed decrease with increasing pipe diameter, and increase with increasing the thickness of pipe and socket wall. The effects of throat depth and shape of fillet welds on fatigue strength were not significant. Contrary to the expectation, the fatigue strength of the socket welded joint without slip-on gap is higher than that of the joint with the normal gap. A lack of penetration at the root deleteriously reduced fatigue strength, showing 14 MPa in stress amplitude at the 10 7 cycles failure life for the 50 mm diameter socket joint. (orig.)

  16. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2011-01-01

    Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is nec......Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components...... to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development...

  17. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

    Directory of Open Access Journals (Sweden)

    John D. Sørensen

    2011-12-01

    Full Text Available Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is necessary to understand the physics of their failure and be able to develop reliability prediction models. Such a model is proposed in this paper for an IGBT power electronic module. IGBTs are critical components in wind turbine converter systems. These are multilayered devices where layers are soldered to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development and propagation processes is discussed. A statistical analysis is performed for appropriate model parameter selection. Based on the proposed model, a layout for component life prediction with crack movement is described in details.

  18. Multi-layer SiC ceramics/Mo joints brazed using high-temperature solders

    International Nuclear Information System (INIS)

    Olesinska, W.; Kesik, J.

    2003-01-01

    The paper presents the results of studies on joining SiC ceramics with molybdenum, with the ceramic surface being activated by titanium, chromium or copper. Titanium or chromium were deposited by the sputtering technique, and copper - by the electro-chemical method. The microstructures of the SiC/Mo joints brazed with the CuMn13Ni3 solder and copper in a nitrogen atmosphere were examined and the results discussed. The joints, in which the ceramic surface was activated in addition with chromium, do not contain mechanical defects caused by the joining process, and the ceramic surface is covered with a continuous layer of the solder. A phase analysis of the interface surface identified an MeSiC phase. The mechanical strength of the joints in which the ceramic surface was modified by the Ti, Cr and Cu layers was markedly greater than that of the joints brazed directly to the uncoated ceramics with the use of active solders. (author)

  19. Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

    Science.gov (United States)

    Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

    2011-01-01

    The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

  20. SMT soldering handbook

    National Research Council Canada - National Science Library

    Strauss, Rudolf

    1998-01-01

    ... 3.2.1 Constituents, melting behaviour and mechanical properties 3.2.2 Composition of solders for use in electronics 3.2.3 Lead-free solders 3.2.4 Solder impurities The soldered joint 3.3.1 Solde...

  1. Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint

    Science.gov (United States)

    Darbandi, Payam

    Due to the awareness of the potential health hazards associated with the toxicity of lead (Pb), actions have been taken to eliminate or reduce the use of Pb in consumer products. Among those, tin (Sn) solders have been used for the assembly of electronic systems. Anisotropy is of significant importance in all structural metals, but this characteristic is unusually strong in Sn, making Sn based solder joints one of the best examples of the influence of anisotropy. The effect of anisotropy arising from the crystal structure of tin and large grain microstructure on the microstructure and the evolution of constitutive responses of microscale SAC305 solder joints is investigated. Insights into the effects of key microstructural features and dominant plastic deformation mechanisms influencing the measured relative activity of slip systems in SAC305 are obtained from a combination of optical microscopy, orientation imaging microscopy (OIM), slip plane trace analysis and crystal plasticity finite element (CPFE) modeling. Package level SAC305 specimens were subjected to shear deformation in sequential steps and characterized using optical microscopy and OIM to identify the activity of slip systems. X-ray micro Laue diffraction and high energy monochromatic X-ray beam were employed to characterize the joint scale tensile samples to provide necessary information to be able to compare and validate the CPFE model. A CPFE model was developed that can account for relative ease of activating slip systems in SAC305 solder based upon the statistical estimation based on correlation between the critical resolved shear stress and the probability of activating various slip systems. The results from simulations show that the CPFE model developed using the statistical analysis of activity of slip system not only can satisfy the requirements associated with kinematic of plastic deformation in crystal coordinate systems (activity of slip systems) and global coordinate system (shape changes

  2. Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

    Science.gov (United States)

    Yoon, Jeong-Won; Noh, Bo-In; Jung, Seung-Boo

    2011-09-01

    Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.

  3. Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock

    Science.gov (United States)

    Han, Jing; Tan, Shihai; Guo, Fu

    2018-01-01

    Ball grid array (BGA) samples were soldered on a printed circuit board with Sn37Pb solder paste to investigate the recrystallization induced by subgrain rotation during thermal shock. The composition of the solder balls was Sn3.0Ag0.5Cu-Sn37Pb, which comprised mixed solder joints. The BGA component was cross-sectioned before thermal shock. The microstructure and grain orientations were obtained by a scanning electron microscope equipped with an electron back-scattered diffraction system. Two mixed solder joints at corners of the BGA component were selected as the subjects. The results showed that recrystallization occurred at the corner of the solder joints after 200 thermal shock cycles. The recrystallized subgrains had various new grain orientations. The newly generated grain orientations were closely related to the initial grain orientations, which indicated that different subgrain rotation behaviors could occur in one mixed solder joint with the same initial grain orientation. When the misorientation angles were very small, the rotation axes were about Sn [100], [010] and [001], as shown by analyzing the misorientation angles and subgrain rotation axes, while the subgrain rotation behavior with large misorientation angles in the solder joints was much more complicated. As Pb was contained in the solder joints and the stress was concentrated on the corner of the mixed solder joints, concaves and cracks were formed. When the adjacent recrystallized subgrains were separated, and the process of the continuous recrystallization was limited.

  4. Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

    OpenAIRE

    Koo, Ja-Myeong; Jung, Seung-Boo

    2007-01-01

    Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920); International audience; Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafte...

  5. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    Science.gov (United States)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. PMID:27877786

  6. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    International Nuclear Information System (INIS)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. (review)

  7. Intergranular stress corrosion in soldered joints of stainless steel 304

    International Nuclear Information System (INIS)

    Zamora R, L.

    1994-01-01

    The intergranular stress cracking of welded joints of austenitic stainless steel, AISI 304, is a serious problem in BWR type reactors. It is associated with the simultaneous presence of three factors; stress, a critical media and sensibilization (DOS). EPR technique was used in order to verify the sensibilization degree in the base metal, and the zone affected by heat and welding material. The characterization of material was done. The objective of this work is the study of microstructure and the evaluation of EPR technique used for the determination of DOS in a welded plate of austenitic stainless steel AISI 304. (Author)

  8. Damage Model for Reliability Assessment of Solder Joints in Wind Turbines

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    environmental factors. Reliability assessment for such type of products conventionally is performed by classical reliability techniques based on test data. Usually conventional reliability approaches are time and resource consuming activities. Thus in this paper we choose a physics of failure approach to define...... damage model by Miner’s rule. Our attention is focused on crack propagation in solder joints of electrical components due to the temperature loadings. Based on the proposed method it is described how to find the damage level for a given temperature loading profile. The proposed method is discussed...

  9. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    International Nuclear Information System (INIS)

    Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

    2010-01-01

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  10. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

    2010-02-18

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  11. Electromigration in 3D-IC scale Cu/Sn/Cu solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Ho, Cheng-En, E-mail: ceho1975@hotmail.com; Lee, Pei-Tzu; Chen, Chih-Nan; Yang, Cheng-Hsien

    2016-08-15

    The electromigration effect on the three-dimensional integrated circuits (3D-IC) scale solder joints with a Cu/Sn(25–50 μm)/Cu configuration was investigated using a field-emission scanning electron microscope (FE–SEM) combined with electron backscatter diffraction (EBSD) analysis system. Electron current stressing for a few days caused the pronounced accumulation of Cu{sub 6}Sn{sub 5} in specific Sn grain boundaries (GBs). The EBSD analysis indicated that both the β-Sn crystallographic orientation and GB orientation play dominant roles in this accumulation. The dependencies of the Cu{sub 6}Sn{sub 5} accumulation on the two above factors (i.e., Sn grain orientation and GB orientation) can be well rationalized via a proposed mathematic model based on the Huntington and Grone's electromigration theory with the Cu anisotropic diffusion data in a β-Sn lattice. - Highlights: • Anisotropic Cu electromigration in the 3D-IC scale microelectronic solder joints. • Pronounced accumulation of Cu{sub 6}Sn{sub 5} intermetallic in specific Sn grain boundaries. • A linear dependence of Cu{sub 6}Sn{sub 5} accumulation over the current stressing time. • β-Sn and grain boundary orientations are the dominant factors in Cu{sub 6}Sn{sub 5} accumulation.

  12. Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

    Directory of Open Access Journals (Sweden)

    Shuye Zhang

    2018-01-01

    Full Text Available Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile electronic applications. However, crack formation of the solder joint crack was occurred at low temperature curable acrylic polymer resins after bonding processes. In this study, the mechanism of SnBi58 solder joint crack at low temperature curable acrylic adhesive was investigated. In addition, SnBi58 solder joint cracks can be significantly removed by increasing the storage modulus of adhesives instead of coefficient of thermal expansion. The first approach of reducing the amount of polymer rebound can be achieved by using an ultrasonic bonding method to maintain a bonding pressure on the SnBi58 solder joints cooling to room temperature. The second approach is to increase storage modulus of adhesives by adding silica filler into acrylic polymer resins to prevent the solder joint from cracking. Finally, excellent acrylic based SnBi58 solder joints reliability were obtained after 1000 cycles thermal cycling test.

  13. Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints

    International Nuclear Information System (INIS)

    Dudek, M.A.; Hunter, L.; Kranz, S.; Williams, J.J.; Lau, S.H.; Chawla, N.

    2010-01-01

    The volume, size, and dispersion of porosity in solder joints are known to affect mechanical performance and reliability. Most of the techniques used to characterize the three-dimensional (3D) nature of these defects are destructive. With the enhancements in high resolution computed tomography (CT), the detection limits of intrinsic microstructures have been significantly improved. Furthermore, the 3D microstructure of the material can be used in finite element models to understand their effect on microscopic deformation. In this paper we describe a technique utilizing high resolution (< 1 μm) X-ray tomography for the three-dimensional (3D) visualization of pores in Sn-3.9Ag-0.7Cu/Cu joints. The characteristics of reflow porosity, including volume fraction and distribution, were investigated for two reflow profiles. The size and distribution of porosity size were visualized in 3D for four different solder joints. In addition, the 3D virtual microstructure was incorporated into a finite element model to quantify the effect of voids on the lap shear behavior of a solder joint. The presence, size, and location of voids significantly increased the severity of strain localization at the solder/copper interface.

  14. Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Kita, T; Mukaibo, N; Ando, K; Moriyama, M [Honda R and D Co. Ltd., Tokyo (Japan)

    1997-10-01

    Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

  15. Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

    Science.gov (United States)

    Mukherjee, S.; Chauhan, P.; Osterman, M.; Dasgupta, A.; Pecht, M.

    2016-07-01

    Mechanistic microstructural models have been developed to capture the effect of isothermal aging on time dependent viscoplastic response of Sn3.0Ag0.5Cu (SAC305) solders. SnAgCu (SAC) solders undergo continuous microstructural coarsening during both storage and service because of their high homologous temperature. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long term reliability of microelectronic packages. It is well documented that isothermal aging degrades the creep resistance of SAC solder. SAC305 alloy is aged for (24-1000) h at (25-100)°C (~0.6-0.8 × T melt). Cross-sectioning and image processing techniques were used to periodically quantify the effect of isothermal aging on phase coarsening and evolution. The parameters monitored during isothermal aging include size, area fraction, and inter-particle spacing of nanoscale Ag3Sn intermetallic compounds (IMCs) and the volume fraction of micronscale Cu6Sn5 IMCs, as well as the area fraction of pure tin dendrites. Effects of microstructural evolution on secondary creep constitutive response of SAC305 solder joints were then modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs in the eutectic phase; and (2) load sharing between pro-eutectic Sn dendrites and the surrounding coarsened eutectic Sn-Ag phase and microscale Cu6Sn5 IMCs. The coarse-grained polycrystalline Sn microstructure in SAC305 solder was not captured in the above model because isothermal aging does not cause any significant change in the initial grain size and orientation of SAC305 solder joints. The above mechanistic model can successfully capture the drop in creep resistance due to the influence of isothermal aging on SAC305 single crystals. Contribution of grain boundary sliding to the creep strain of

  16. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

    2008-07-14

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

  17. Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

    Science.gov (United States)

    Abdelhadi, Ousama Mohamed Omer

    Continuous miniaturization of microelectronic interconnects demands smaller joints with comparable microstructural and structural sizes. As the size of joints become smaller, the volume of intermetallics (IMCs) becomes comparable with the joint size. As a result, the kinetics of bond formation changes and the types and thicknesses of IMC phases that form within the constrained region of the bond varies. This dissertation focuses on investigating combination effects of process parameters and size on kinetics of bond formation, resulting microstructure and the mechanical properties of joints that are formed under structurally constrained conditions. An experiment is designed where several process parameters such as time of bonding, temperature, and pressure, and bond thickness as structural chracteristic, are varied at multiple levels. The experiment is then implemented on the process. Scanning electron microscope (SEM) is then utilized to determine the bond thickness, IMC phases and their thicknesses, and morphology of the bonds. Electron backscatter diffraction (EBSD) is used to determine the grain size in different regions, including the bulk solder, and different IMC phases. Physics-based analytical models have been developed for growth kinetics of IMC compounds and are verified using the experimental results. Nanoindentation is used to determine the mechanical behavior of IMC phases in joints in different scales. Four-point bending notched multilayer specimen and four-point bending technique were used to determine fracture toughness of the bonds containing IMCs. Analytical modeling of peeling and shear stresses and fracture toughness in tri-layer four-point bend specimen containing intermetallic layer was developed and was verified and validated using finite element simulation and experimental results. The experiment is used in conjunction with the model to calculate and verify the fracture toughness of Cu6Sn5 IMC materials. As expected two different IMC phases

  18. Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages

    Science.gov (United States)

    Talebanpour, B.; Huang, Z.; Chen, Z.; Dutta, I.

    2016-01-01

    In 3-dimensional (3D) packages, a stack of dies is vertically connected to each other using through-silicon vias and very thin solder micro-bumps. The thinness of the micro-bumps results in joints with a very high volumetric proportion of intermetallic compounds (IMCs), rendering them much more brittle compared to conventional joints. Because of this, the reliability of micro-bumps, and the dependence thereof on the proportion of IMC in the joint, is of substantial concern. In this paper, the growth kinetics of IMCs in thin Sn-3Ag-0.5Cu joints attached to Cu substrates were analyzed, and empirical kinetic laws for the growth of Cu6Sn5 and Cu3Sn in thin joints were obtained. Modified compact mixed mode fracture mechanics samples, with adhesive solder joints between massive Cu substrates, having similar thickness and IMC content as actual micro-bumps, were produced. The effects of IMC proportion and strain rate on fracture toughness and mechanisms were investigated. It was found that the fracture toughness G C decreased with decreasing joint thickness ( h Joint). In addition, the fracture toughness decreased with increasing strain rate. Aging also promoted alternation of the crack path between the two joint-substrate interfaces, possibly proffering a mechanism to enhance fracture toughness.

  19. An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation

    Science.gov (United States)

    Chawla, N.; Shen, Y.-L.; Deng, X.; Ege, E. S.

    2004-12-01

    The lap-shear technique is commonly used to evaluate the shear, creep, and thermal fatigue behavior of solder joints. We have conducted a parametric experimental and modeling study, on the effect of testing and geometrical parameters on solder/copper joint response in lap-shear. It was shown that the farfield applied strain is quite different from the actual solder strain (measured optically). Subtraction of the deformation of the Cu substrate provides a reasonable approximation of the solder strain in the elastic regime, but not in the plastic regime. Solder joint thickness has a profound effect on joint response. The solder response moves progressively closer to “true” shear response with increasing joint thickness. Numerical modeling using finite-element analyses were performed to rationalize the experimental findings. The same lap-shear configuration was used in the simulation. The input response for solder was based on the experimental tensile test result on bulk specimens. The calculated shear response, using both the commonly adopted far-field measure and the actual shear strain in solder, was found to be consistent with the trends observed in the lap-shear experiments. The geometric features were further explored to provide physical insight into the problem. Deformation of the substrate was found to greatly influence the shear behavior of the solder.

  20. The Shear Strength and Fracture Behavior of Sn-Ag- xSb Solder Joints with Au/Ni-P/Cu UBM

    Science.gov (United States)

    Lee, Hwa-Teng; Hu, Shuen-Yuan; Hong, Ting-Fu; Chen, Yin-Fa

    2008-06-01

    This study investigates the effects of Sb addition on the shear strength and fracture behavior of Sn-Ag-based solders with Au/Ni-P/Cu underbump metallization (UBM) substrates. Sn-3Ag- xSb ternary alloy solder joints were prepared by adding 0 wt.% to 10 wt.% Sb to a Sn-3.5Ag alloy and joining them with Au/Ni-P/Cu UBM substrates. The solder joints were isothermally stored at 150°C for up to 625 h to study their microstructure and interfacial reaction with the UBM. Single-lap shear tests were conducted to evaluate the mechanical properties, thermal resistance, and failure behavior. The results show that UBM effectively suppressed intermetallic compound (IMC) formation and growth during isothermal storage. The Sb addition helped to refine the Ag3Sn compounds, further improving the shear strength and thermal resistance of the solders. The fracture behavior evolved from solder mode toward the mixed mode and finally to the IMC mode with increasing added Sb and isothermal storage time. However, SnSb compounds were found in the solder with 10 wt.% Sb; they may cause mechanical degradation of the solder after long-term isothermal storage.

  1. The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints

    Science.gov (United States)

    Sona, Mrunali; Prabhu, K. Narayan

    2017-09-01

    The failure of solder joints due to imposed stresses in an electronic assembly is governed by shear bond strength. In the present study, the effect of wetting gravity regime on single-lap shear strength of Sn-0.3Ag-0.7Cu and Sn-2.5Ag-0.5Cu solder alloys reflowed between bare copper substrates as well as Ni-coated Cu substrates was investigated. Samples were reflowed for 10 s, T gz (time corresponding to the end of gravity regime) and 100 s individually and tested for single-lap shear strength. The single-lap shear test was also carried out on eutectic Sn-Pb/Cu- and Sn-Pb/Ni-coated Cu specimens to compare the shear strength values obtained with those of lead-free alloys. The eutectic Sn-Pb showed significantly higher ultimate shear strength on bare Cu substrates when compared to Sn-Ag-Cu alloys. However, SAC alloys reflowed on nickel-coated copper substrate exhibited higher shear strength when compared to eutectic Sn-Pb/Ni-coated Cu specimens. All the substrate/solder/substrate lap joint specimens that were reflowed for the time corresponding to the end of gravity regime exhibited maximum ultimate shear strength.

  2. Fatigue properties of dissimilar metal laser welded lap joints

    Science.gov (United States)

    Dinsley, Christopher Paul

    This work involves laser welding austenitic and duplex stainless steel to zinc-coated mild steel, more specifically 1.2mm V1437, which is a Volvo Truck Coiporation rephosphorised mild steel. The work investigates both tensile and lap shear properties of similar and dissimilar metal laser welded butt and lap joints, with the majority of the investigation concentrating on the fatigue properties of dissimilar metal laser welded lap joints. The problems encountered when laser welding zinc-coated steel are addressed and overcome with regard to dissimilar metal lap joints with stainless steel. The result being the production of a set of guidelines for laser welding stainless steel to zinc-coated mild steel. The stages of laser welded lap joint fatigue life are defined and the factors affecting dissimilar metal laser welded lap joint fatigue properties are analysed and determined; the findings suggesting that dissimilar metal lap joint fatigue properties are primarily controlled by the local stress at the internal lap face and the early crack growth rate of the material at the internal lap face. The lap joint rotation, in turn, is controlled by sheet thickness, weld width and interfacial gap. Laser welded lap joint fatigue properties are found to be independent of base material properties, allowing dissimilar metal lap joints to be produced without fatigue failure occurring preferentially in the weaker parent material, irrespective of large base material property differences. The effects of Marangoni flow on the compositions of the laser weld beads are experimentally characterised. The results providing definite proof of the stirring mechanism within the weld pool through the use of speeds maps for chromium and nickel. Keywords: Laser welding, dissimilar metal, Zinc-coated mild steel, Austenitic stainless steel, Duplex stainless steel, Fatigue, Lap joint rotation, Automotive.

  3. Influence of intermetallic growth on the mechanical properties of Zn–Sn–Cu–Bi/Cu solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Xing, Fei; Yao, Jia; Liang, Jingwei; Qiu, Xiaoming, E-mail: qiuxm13@163.com

    2015-11-15

    The formation of intermetallic reaction layers and their influence on shear strength and fractography was investigated between the Zn–Sn–Cu–Bi (ZSCB) and Cu substrate during the liquid state reaction at 450 °C after 10–90 s. Results showed that reliable solder joints could be obtained at 450 °C after 15–30 s of wetting, accompanied by the creation of scallop ε-CuZn{sub 5}, flat γ-Cu{sub 5}Zn{sub 8} and β-CuZn intermetallic layers in ZSCB/Cu interface. However, with excess increase of soldering time, a transient intermetallic ε-CuZn{sub 4} phase was nuclear and grew at ε-CuZn{sub 5}/γ-Cu{sub 5}Zn{sub 8} interface, which apparently deteriorated the shear strength of solder joints from 76.5 MPa to 51.6 MPa. The sensitivity of the fracture proportion was gradually transformed from monotonic ε-CuZn{sub 5} to the mixture of ε-CuZn{sub 4} and ε-CuZn{sub 5} intermetallic cleavage. Furthermore, the growth mechanism of ε-CuZn{sub 4} intermetallic phase at the ZSCB/Cu interface was discussed. - Highlights: • There are four interfacial intermetallic layers formed at the Zn–Sn–Cu–Bi/Cu interface. • The growth mechanism of ε-CuZn{sub 4} intermetallic phase was discussed. • The wetting time of Zn–Sn–Cu–Bi solder in contact with Cu substrate is a key parameter.

  4. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Directory of Open Access Journals (Sweden)

    Benabou Lahouari

    2014-06-01

    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  5. Investigation on solder joint strength of nickel tin-plated and CRS tabs with PCB

    International Nuclear Information System (INIS)

    Luay Hussain

    2002-01-01

    Failure analysis on easily peels off Nickel and CRS steel tabs from PCB was carried out. Nickel Tin plated tabs, CRS steel tabs and tube were joined to the PCB using reflow/ convection soldering, in an oven. The solder paste composition is Sn36/Pb35/Ag2. Peel test was conducted and it was found that many tabs could be easily peeled off with low force. Porosities which varies from 0.4 mm to < 0.01mm in diameter, developed during soldering process and solidification was noted. It was found, the number, size and position of these porosities inside the solder layer on both parts of the tabs affect the peel strength. Scanning Electron Microscopy study and EDX analysis were carried out. It was found that the low peel strength values were due to the combination of generation and development of porosities during soldering process which act as stress concentrators and the evolution (growth) of eutectic Sn/Pb and Sn/Ni/Cu brittle grainy phase. Large eutectic microstructure with brittle Sn-Ni-Cu grainy phase enhances the failure with low peeling forces. Sample showing no feature of Sn/Ni/Cu grain gave high peeling strength value. Solder reflow, an important process, can result in strength enhancement (if it was controlled for example in a furnace). (Author)

  6. Fatigue behavior of thick composite single lap joints

    Energy Technology Data Exchange (ETDEWEB)

    Tang, J.H.; Sridhar, I.; Srikanth, N. [Nanyang Technological Univ., Singapore (Singapore)

    2012-07-01

    In consideration of bondline thickness variability, in bonded joints where thick adherend is adopted, relative thick adhesive layer (2-5 mm) is preferable. This paper aims to give some insight in fatigue strength of adhesively bonded structures involving thick adherend coupled with thick adhesive layer. Single lap joints with nominal adherend thickness of 8 mm and two different nominal thicknesses (2.5 mm and 5.5 mm) were made and tested under fatigue loading. The failure mode exhibits always a tendency for interfacial initiation, followed by interlaminar separation. Fatigue strength for higher adhesive thickness is found to be lower. (Author)

  7. IEA Joint Action. Wind turbine fatigue

    Energy Technology Data Exchange (ETDEWEB)

    Maribo Pedersen, B [ed.

    1996-09-01

    Fatigue research on wind turbine blade material has been an important issue over the years in many countries and in the E.U. As a result of the effort the knowledge on fatigue properties of fibre reinforced materials has been expanded enormously. Practical fatigue design properties are available for constant amplitude tests at ambient temperatures. A lack of knowledge can be shown in several other fields, such as variable amplitude and multi-axial testing and the influence of the environment and carbon fibres. Fatigue is seen as dominant for the blade design, improvements in both the load prediction and material fatigue properties should be strove for. In discussions with blade manufacturers and subsidy agencies (E.U. DGXII, NOVEM, ETSU, etc.) on the importance of continuous materials fatigue research the improvement in reliability should be stressed. (au)

  8. Estimate the thermomechanical fatigue life of two flip chip packages

    International Nuclear Information System (INIS)

    Pash, R.A.; Ullah, H.S.; Khan, M.Z.

    2005-01-01

    The continuing demand towards high density and low profile integrated circuit packaging has accelerated the development of flip chip structures as used in direct chip attach (DCA) technology, ball grid array (BOA) and chip scale package (CSP). In such structures the most widely used flip chip interconnects are solder joints. The reliability of flip chip structures largely depends on the reliability of solder joints. In this work solder joint fatigue life prediction for two chip scale packages is carried out. Elasto-plastic deformation behavior of the solder was simulated using ANSYS. Two dimensional plain strain finite element models were developed for each package to numerically compute the stress and total strain of the solder joints under temperature cycling. These stress and strain values are then used to predict the solder joint lifetime through modified Coffin Manson equation. The effect of solder joint's distance from edge of silicon die on life of the package is explored. The solder joint fatigue response is modeled for a typical temperature cycling of -60 to 140 degree C. (author)

  9. Fatigue strength of a single lap joint SPR-bonded

    International Nuclear Information System (INIS)

    Di Franco, G.; Fratini, L.; Pasta, A.

    2011-01-01

    In the last years, hybrid joints, meaning with this the joints which consist in combining a traditional mechanical joint to a layer of adhesive, are gradually attracting the attention of various sectors of the construction of vehicles and transportation industries, for their better performance compared to just mechanical joints (self-piercing riveting SPR, riveting, and so on) or just to bonded joints.The paper investigates the fatigue behavior of a single lap joint self-piercing riveted (SPR) and bonded throughout fatigue tests. The considered geometric configuration allowed the use of two rivets placed longitudinally; an epoxy resin was used as adhesive. In the first part of the work static characterization of the joints was carried out through tensile tests. Then fatigue tests were made with the application of different levels of load. The fatigue curves were also obtained at the varying the distance between the two rivets in order to better assess the joint strength for a given length of overlap.

  10. Fatigue Life of High-Strength Steel Offshore Tubular Joints

    DEFF Research Database (Denmark)

    Petersen, Rasmus Ingomar; Agerskov, Henning; Lopez Martinez, Luis

    1996-01-01

    In the present investigation, the fatigue life of tubular joints in offshore steel structures is studied. Two test series on full-scale tubular joints have been carried through. One series was on joints in conventional offshore structural steel, and the other series was on joints in high-strength......In the present investigation, the fatigue life of tubular joints in offshore steel structures is studied. Two test series on full-scale tubular joints have been carried through. One series was on joints in conventional offshore structural steel, and the other series was on joints in high......-strength steel with a yield stress of 820-830 MPa and with high weldability and toughness properties. The test specimens of both series had the same geometry. The present report concentrates on the results obtained in the investigation on the high-strength steel tubular joints.The test specimens were fabricated...... from Ø 324-610 mm tubes, and the joints were loaded in in-plane bending. Both fatigue tests under constant amplitude loading and tests with a stochastic loading that is realistic in relation to offshore structures, are included in the investigation.A comparison between constant amplitude and variable...

  11. Methodology for Analyzing Strain States During In-Situ Thermomechanical Cycling in Individual Lead Free Solder Joints Using Synchrotron Radiation

    International Nuclear Information System (INIS)

    Zhou, Bite; Bieler, Thomas R.; Lee, Tae-Kyu; Liu, Kuo-Chuan

    2009-01-01

    To examine how a lead-free solder joint deforms in a thermal cycling environment, both the elastic and plastic stress and strain behavior must be understood. Methods to identify evolution of the internal strain (stress) state during thermal cycling are described. A slice of a package containing a single row of solder joints was thermally cycled from 0 C to 100 C with a period of about 1 h with concurrent acquisition of transmission Laue patterns using synchrotron radiation. These results indicated that most joints are single crystals, with some being multicrystals with no more than a few Sn grain orientations. Laue patterns were analyzed to estimate local strains in different crystal directions at different temperatures during a thermal cycle. While the strains perpendicular to various crystal planes all vary in a similar way, the magnitude of strain varies. The specimens were subsequently given several hundred additional thermal cycles and measured again to assess changes in the crystal orientations. These results show that modest changes in crystal orientations occur during thermal cycling.

  12. SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

    Directory of Open Access Journals (Sweden)

    D. Heinemann

    2016-06-01

    Full Text Available Printed Circuit Boards (PCB play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

  13. Fatigue crack growth in welded joints in seawater

    Energy Technology Data Exchange (ETDEWEB)

    Lambert, S.B.

    1988-01-01

    A pipe-to-plate specimen has been developed to study the influence of seawater on the fatigue behaviour of welded tubular joints. DC potential drop techniques have been used to detect fatigue crack initiation, and to monitor the subsequent growth of fatigue cracks. Results for three specimens, tested in air are compared with similar data for tubular and T-plate joints. These comparisons indicate that the pipe/plate is a reasonable model of a tubular joint. Testing was performed on a further six specimens in artificial seawater; two each with free corrosion, optimum cathodic protection, and cathodic overprotection. Fatigue life reduction factors compared with corresponding tests in air were 1.8 and 2.8 for free corrosion, 1.7 and 1.1 with cathodic protection, and 4.2 and 3.3 with cathodic over-protection. These fatigue life reduction factors were comparable to results on T-plate specimens, and were strongly dependent on crack shape development. Linear elastic fracture mechanics techniques appear suitable for the calculation of fatigue crack propagation life. Three approximate solution techniques for crack tip stress intensity factors show reasonable agreement with experimentally derived values. It is recommended that forcing functions be used to model crack aspect ratio development in welded joints. Such forcing functions are influenced by the initial stress distribution and the environment. 207 refs., 192 figs., 22 tabs.

  14. Influence of Poly(ethylene glycol) Degradation on Voiding Sporadically Occurring in Solder Joints with Electroplated Cu

    Science.gov (United States)

    Wafula, F.; Yin, L.; Borgesen, P.; Andala, D.; Dimitrov, N.

    2012-07-01

    This paper presents a comprehensive study of the effect of poly(ethylene glycol) (PEG) degradation on the void formation known to take place sporadically at the interface between electroplated Cu and Pb-free solder. Thorough chemical analysis of our plating solution, carried out at different times of the deposition process by matrix-assisted laser desorption ionization time-of-flight mass spectroscopy, reveals a dramatic shift in the peaks to lower mass range with time. Scanning electron microscopy cross-sectional images of solder joints with Cu samples that have been plated at different times in the course of solution aging show a decrease in void formation. A decreasing magnitude of the deposition overpotential also seen during aging suggests that, breaking down to lower-molecular-weight fragments, PEG loses its suppression effect and likely has lower impact on the voiding propensity. This indirect correlation is confirmed further by the use of plating solutions containing PEG with preselected molecular weight. We also report on the effect of the surface area-to-solution volume ratio on PEG degradation studied by comparative experiments performed in a 50-mL bath with a rotating disc electrode and in a larger cell (Hull cell) with volume of 267 mL. The results show that, at fixed charge per unit volume, PEG degrades at a greatly accelerated rate in the Hull cell featuring higher electrode surface-to-solution volume ratio. Analysis of solder joints with accordingly grown Cu layers suggests that the voiding decreases faster with the accelerated rate of PEG degradation.

  15. An evaluation of the spring finger solder joints on SA1358-10 and SA2052-4 connector assemblies (MC3617,W87)

    International Nuclear Information System (INIS)

    Kilgo, Alice C.; Vianco, Paul Thomas; Hlava, Paul Frank; Zender, Gary L.

    2006-01-01

    The SA1358-10 and SA2052-4 circular JT Type plug connectors are used on a number of nuclear weapons and Joint Test Assembly (JTA) systems. Prototype units were evaluated for the following specific defects associated with the 95Sn-5Sb (Sn-Sb, wt.%) solder joint used to attach the beryllium-copper (BeCu) spring fingers to the aluminum (Al) connector shell: (1) extended cracking within the fillet; (2) remelting of the solder joint during the follow-on, soldering step that attached the EMR adapter ring to the connector shell (and/or soldering the EMR shell to the adapter ring) that used the lower melting temperature 63Sn-37Pb (Sn-Pb) alloy; and (3) spalling of the Cd (Cr) layer overplating layer from the fillet surface. Several pedigrees of connectors were evaluated, which represented older fielded units as well as those assemblies that were recently constructed at Kansas City Plant. The solder joints were evaluated that were in place on connectors made with the current soldering process as well as an alternative induction soldering process for attaching the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely reflected the different extents to which the connector was mated to its counterpart assembly. In all cases, the spring finger solder joints on the SA1358-10 connectors were remelted as a result of the subsequent EMR adapter ring attachment process. Spalling of the Cd (Cr) overplating layer was also observed for these connectors, which was a consequence of the remelting activity. On the other hand, the SA2052-4 connector did not exhibit evidence of

  16. Fatigue failure of pb-free electronic packages under random vibration loads

    Science.gov (United States)

    Saravanan, S.; Prabhu, S.; Muthukumar, R.; Gowtham Raj, S.; Arun Veerabagu, S.

    2018-03-01

    The electronic equipment are used in several fields like, automotive, aerospace, consumer goods where they are subjected to vibration loads leading to failure of solder joints used in these equipment. This paper presents a methodology to predict the fatigue life of Pb-free surface mounted BGA packages subjected to random vibrations. The dynamic characteristics of the PCB, such as the natural frequencies, mode shapes and damping ratios were determined. Spectrum analysis was used to determine the stress response of the critical solder joint and the cumulative fatigue damage accumulated by the solder joint for a specific duration was determined.

  17. On the problem of soldering refractory metals with silver-containing solders

    International Nuclear Information System (INIS)

    Anikeev, E.F.; Andryushchenko, V.I.; Chepelenko, V.N.; Batov, V.M.

    1981-01-01

    The processes of wetting, spreading and interphase interactions of copper-silver liquid alloys alloyed with Ni and Si, with niobium, tantalum, molybdenum, tungsten, 12Kh18N10T steel and nickel are studied. It has been determined that Ni or Si additions into the copper-silver solder improve the wetting and adhesion. When soldering with the alloy containing Ni additions, the strength of a soldered Joint grows with the increase of soldering duration while soldering with the alloy containing Si additions, the strength decreases. That is why Ni-containing solders are preferable for soldering thick-walled structures, and Si-containing solders - for thin-walled structures [ru

  18. Elbow joint fatigue and bench-press training.

    Science.gov (United States)

    Huang, Yen-Po; Chou, You-Li; Chen, Feng-Chun; Wang, Rong-Tyai; Huang, Ming-Jer; Chou, Paul Pei-Hsi

    2014-01-01

    Bench-press exercises are among the most common form of training exercise for the upper extremity because they yield a notable improvement in both muscle strength and muscle endurance. The literature contains various investigations into the effects of different bench-press positions on the degree of muscle activation. However, the effects of fatigue on the muscular performance and kinetics of the elbow joint are not understood fully. To investigate the effects of fatigue on the kinetics and myodynamic performance of the elbow joint in bench-press training. Controlled laboratory study. Motion research laboratory. A total of 18 physically healthy male students (age = 19.6 ± 0.8 years, height = 168.7 ± 5.5 cm, mass = 69.6 ± 8.6 kg) participated in the investigation. All participants were right-hand dominant, and none had a history of upper extremity injuries or disorders. Participants performed bench-press training until fatigued. Maximal possible number of repetitions, cycle time, myodynamic decline rate, elbow-joint force, and elbow-joint moment. We observed a difference in cycle time in the initial (2.1 ± 0.42 seconds) and fatigue (2.58 ± 0.46 seconds) stages of the bench-press exercise (P = .04). As the participants fatigued, we observed an increase in the medial-lateral force (P = .03) and internal-external moment (P ≤ .04) acting on the elbow joint. Moreover, a reduction in the elbow muscle strength was observed in the elbow extension-flexion (P ≤ .003) and forearm supination-pronation (P ≤ .001) conditions. The results suggest that performing bench-press exercises to the point of fatigue increases elbow-joint loading and may further increase the risk of injury. Therefore, when clinicians design bench-press exercise regimens for general athletic training, muscle strengthening, or physical rehabilitation, they should control carefully the maximal number of repetitions.

  19. Effects of In and Ni Addition on Microstructure of Sn-58Bi Solder Joint

    Science.gov (United States)

    Mokhtari, Omid; Nishikawa, Hiroshi

    2014-11-01

    In this study, the effect of adding 0.5 wt.% and 1 wt.% In and Ni to Sn-58Bi solder on intermetallic compound (IMC) layers at the interface and the microstructure of the solder alloys were investigated during reflow and thermal aging by scanning electron microscopy and electron probe micro-analysis. The results showed that the addition of minor elements was not effective in suppressing the IMC growth during the reflow; however, the addition of 0.5 wt.% In and Ni was effective in suppressing the IMC layer growth during thermal aging. The thickening kinetics of the total IMC layer was analyzed by plotting the mean thickness versus the aging time on log-log coordinates, and the results showed the transition point from grain boundary diffusion control to a volume diffusion control mechanism. The results also showed that the minor addition of In can significantly suppress the coarsening of the Bi phase.

  20. The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder joint

    Energy Technology Data Exchange (ETDEWEB)

    Fleshman, Collin; Chen, Wei-Yu; Chou, Tzu-Ting [Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan (China); Huang, Jia-Hong [Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan (China); Duh, Jenq-Gong, E-mail: jgd@mx.nthu.edu.tw [Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan (China)

    2017-03-01

    In this study, the slow speed shear test in both Sn-3.0Ag-0.5Cu (wt%)/OSP Cu and Sn-3.0Ag-0.5Cu-0.1Ni (wt%)/OSP Cu assembly with the ball heights of 300 μm and the corresponding grain structures were investigated. With the aid of Electron Back Scattering Diffraction (EBSD) analysis, single grain structure was observed in Sn-3.0Ag-0.5Cu/OSP Cu. Besides, Ni was found to control the grain structure in Sn-3.0Ag-0.5Cu-0.1Ni solder balls, showing multiple grains with partially interlaced structure. The grain variation resulted from larger undercooling caused by smaller ball size and Ni-dopant induced tiny intermetallic compounds (IMCs). IMCs serve as heterogeneous nucleation sites for β-tin and thus alter the grain structure of solder balls. The results of shear test reveal that the peak force of solder joints was efficiently enhanced by the addition of Ni. The enhancement of mechanical strength was attributed to the modification of grain structure by the introduction of Ni dopant. It is believed that the smaller grains, tiny intermetallic compounds, and the oriented interlaced area in Ni-doped solder joints became energy barriers for propagation of cracks and dislocations. It is demonstrated that Ni-doped solder joints tend to exhibit better mechanical reliability in advanced electronic packaging. - Highlights: • The grain structure and slow speed shear test performance were investigated. • Doping Ni into solder induce interlaced grain structure. • Interlaced structure can enhance mechanical reliability in BGA packaging.

  1. Multiaxial fatigue of aluminium friction stir welded joints: preliminary results

    Directory of Open Access Journals (Sweden)

    D. G. Hattingh

    2015-07-01

    Full Text Available The aim of the present research is to check the accuracy of the Modified Wöhler Curve Method (MWCM in estimating the fatigue strength of friction stir (FS welded tubular joints of Al 6082-T6 subjected to in-phase and out-of-phase multiaxial fatigue loading. The welded samples being investigated were manufactured by equipping an MTS I-STIR process development system with a retracting tool that was specifically designed and optimised for this purpose. These specimens were tested under proportional and non-proportional tension and torsion, the effect of non-zero mean stresses being also investigated. The validation exercise carried out by using the generated experimental results allowed us to prove that the MWCM (applied in terms of nominal stresses is highly accurate in predicting the fatigue strength of the tested FS welded joints, its usage resulting in estimates falling with the uniaxial and torsional calibration scatter bands.

  2. Hybrid FSWeld-bonded joint fatigue behaviour

    Science.gov (United States)

    Lertora, Enrico; Mandolfino, Chiara; Gambaro, Carla; Pizzorni, Marco

    2018-05-01

    Aluminium alloys, widely used in aeronautics, are increasingly involved in the automotive industry due to the good relationship between mechanical strength and specific weight. The lightening of the structures is the first objective, which allows the decreasing in the weight in motion. The use of aluminium alloys has also seen the introduction of the Friction Stir Welding (FSW) technique for the production of structural overlapping joints. FSW allows us to weld overlap joints free from defects, but with the presence of a structural notch further aggravated by the presence of a "hook" defect near the edge of the weld. Furthermore, FSW presents a weld penetration area connected to the tool geometry and penetration. The experimental activity will be focused on the combination of two different joining techniques, which can synergistically improve the final joint resistance. In particular, the welding and bonding process most commonly known as weld-bonding is defined as a hybrid process, as it combines two different junction processes. In this paper we analyse FSWelded AA6082 aluminium alloy overlapped joint with the aim of quantitatively evaluating the improvement provided by the presence of an epoxy adhesive between the plates. After optimising the weld-bonding process, the mechanical behaviour of welded joints will be analysed by static and dynamic tests. The presence of the adhesive should limit the negative effect of the structural notch inevitable in a FSW overlapped joint.

  3. Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process.

    Science.gov (United States)

    Li, Z L; Dong, H J; Song, X G; Zhao, H Y; Tian, H; Liu, J H; Feng, J C; Yan, J C

    2018-04-01

    Homogeneous (Cu, Ni) 6 Sn 5 intermetallic compound (IMC) joints were rapidly formed in asymmetrical Ni/Sn/Cu system by an ultrasound-induced transient liquid phase (TLP) soldering process. In the traditional TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system consisted of major (Cu, Ni) 6 Sn 5 and minor Cu 3 Sn IMCs, and the grain morphology of (Cu, Ni) 6 Sn 5 IMCs subsequently exhibited fine rounded, needlelike and coarse rounded shapes from the Ni side to the Cu side, which was highly in accordance with the Ni concentration gradient across the joints. However, in the ultrasound-induced TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system only consisted of the (Cu, Ni) 6 Sn 5 IMCs which exhibited an uniform grain morphology of rounded shape with a remarkably narrowed Ni concentration gradient. The ultrasound-induced homogeneous intermetallic joints exhibited higher shear strength (61.6 MPa) than the traditional heterogeneous intermetallic joints (49.8 MPa). Copyright © 2017 Elsevier B.V. All rights reserved.

  4. Designing aluminium friction stir welded joints against multiaxial fatigue

    Directory of Open Access Journals (Sweden)

    L. Susmel

    2016-07-01

    Full Text Available The present paper investigates the accuracy of the Modified Wöhler Curve Method (MWCM in estimating multiaxial fatigue strength of aluminium friction stir (FS welded joints. Having developed a bespoke joining technology, circumferentially FS welded tubular specimens of Al 6082-T6 were tested under proportional and non-proportional tension and torsion, the effect of non-zero mean stresses being also investigated. The validation exercise carried out using the experimental results have demonstrated that the MWCM applied in terms of nominal stresses, notch stresses, and also the Point Method is accurate in predicting the fatigue lifetime of the tested FS welded joints, with its use resulting in life estimates that fall within the uniaxial and torsional calibration scatter bands.

  5. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Lei Sun

    2015-01-01

    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  6. Solderability study of RABiTS-based YBCO coated conductors

    International Nuclear Information System (INIS)

    Zhang Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

    2011-01-01

    Study examines the implication of solder and flux selection in YBCO splice joints. Focus is on commercially available RABiTS-based YBCO coated conductors. Solderability varied with solder and flux for three different stabilizations tested. Resistivity of stabilizer was dominant factor in splice joint resistance. Solder materials affected splice joint resistance when solderability was poor. The solderability of commercially available YBa 2 Cu 3 O 7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

  7. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    OpenAIRE

    Sun, Lei; Zhang, Liang

    2015-01-01

    SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparti...

  8. Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads

    Science.gov (United States)

    Ren, Huai-Hui; Wang, Xi-Shu

    2014-04-01

    This paper studies and compares the effects of pull-pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package. The comparisons are based on experimental investigations using scanning electron microscopy (SEM) in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.

  9. Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements

    Science.gov (United States)

    Gadag, Shiva P.; Patra, Susant

    2000-12-01

    Solder joint interconnects are mechanical means of structural support for bridging the various electronic components and providing electrical contacts and a thermal path for heat dissipation. The functionality of the electronic device often relies on the structural integrity of the solder. The dimensional stability of solder joints is numerically predicted based on their mechanical properties. Algorithms to model the kinetics of dissolution and subsequent growth of intermetallic from the complete knowledge of a single history of time-temperature-reflow profile, by considering equivalent isothermal time intervals, have been developed. The information for dissolution is derived during the heating cycle of reflow and for the growth process from cooling curve of reflow profile. A simple and quick analysis tool to derive tensile stress-strain maps as a function of the reflow temperature of solder and strain rate has been developed by numerical program. The tensile properties are used in modeling thermal strain, thermal fatigue and to predict the overall fatigue life of solder joints. The numerical analysis of the tensile properties as affected by their composition and rate of testing, has been compiled in this paper. A numerical model using constitutive equation has been developed to evaluate the interfacial fatigue crack growth rate. The model can assess the effect of cooling rate, which depends on the level of strain energy release rate. Increasing cooling rate from normalizing to water-quenching, enhanced the fatigue resistance to interfacial crack growth by up to 50% at low strain energy release rate. The increased cooling rates enhanced the fatigue crack growth resistance by surface roughening at the interface of solder joint. This paper highlights salient features of process modeling. Interfacial intermetallic microstructure is affected by cooling rate and thereby affects the mechanical properties.

  10. Accelerated Comparative Fatigue Strength Testing of Belt Adhesive Joints

    Science.gov (United States)

    Bajda, Miroslaw; Blazej, Ryszard; Jurdziak, Leszek

    2017-12-01

    Belt joints are the weakest link in the serial structure that creates an endless loop of spliced belt segments. This affects not only the lower strength of adhesive joints of textile belts in comparison to vulcanized splices, but also the replacement of traditional glues to more ecological but with other strength parameters. This is reflected in the lowered durability of adhesive joints, which in underground coal mines is nearly twice shorter than the operating time of belts. Vulcanized splices require high precision in performance, they need long time to achieve cross-linking of the friction mixture and, above all, they require specialized equipment (vulcanization press) which is not readily available and often takes much time to be delivered down, which means reduced mining output or even downtime. All this reduces the reliability and durability of adhesive joints. In addition, due to the consolidation on the Polish coal market, mines are joined into large economic units serviced by a smaller number of processing plants. The consequence is to extend the transport routes downstream and increase reliability requirements. The greater number of conveyors in the chain reduces reliability of supply and increases production losses. With high fixed costs of underground mines, the reduction in mining output is reflected in the increase in unit costs, and this at low coal prices on the market can mean substantial losses for mines. The paper describes the comparative study of fatigue strength of shortened samples of adhesive joints conducted to compare many different variants of joints (various adhesives and materials). Shortened samples were exposed to accelerated fatigue in the usually long-lasting dynamic studies, allowing more variants to be tested at the same time. High correlation between the results obtained for shortened (100 mm) and traditional full-length (3×250 mm) samples renders accelerated tests possible.

  11. Detection and measurement of fatigue cracks in welded joints

    International Nuclear Information System (INIS)

    Smith, F.C.

    1985-01-01

    A direct current potential drop system was developed for the detection and measurement of very small fatigue cracks that grow from the toes of welds. Measurement of crack growth less than 0.01 mm and of crack growth rates less than 10 -10 m/cycle, even for cracks less than 1.0 mm deep, is made possible by using a high stability measurement apparatus and an adjustment based on initial conditions. Thus far, the measurement system has successfully examined several aspects of fatigue in welded elements. Crack growth results justified the use of a linear elastic expression for the stress intensity factor and provided an evaluation of a growth law which includes the threshold stress intensity factor. Needle peening fillet welded joints did not change the small proportion of crack initiation life to total fatigue life observed for untreated (not improved) welded joints. However, the measurement system demonstrated that needle peening retarded crack growth rates up to 1 mm depth below the weld toe

  12. Fatigue behaviour of friction welded medium carbon steel and austenitic stainless steel dissimilar joints

    International Nuclear Information System (INIS)

    Paventhan, R.; Lakshminarayanan, P.R.; Balasubramanian, V.

    2011-01-01

    Research highlights: → Fusion welding of dissimilar metals is a problem due to difference in properties. → Solid state welding process such as friction welding is a solution for the above problem. → Fatigue life of friction welded carbon steel and stainless steel joints are evaluated. → Effect of notch on the fatigue life of friction welded dissimilar joints is reported. → Formation of intermetallic is responsible for reduction in fatigue life of dissimilar joints. -- Abstract: This paper reports the fatigue behaviour of friction welded medium carbon steel-austenitic stainless steel (MCS-ASS) dissimilar joints. Commercial grade medium carbon steel rods of 12 mm diameter and AISI 304 grade austenitic stainless steel rods of 12 mm diameter were used to fabricate the joints. A constant speed, continuous drive friction welding machine was used to fabricate the joints. Fatigue life of the joints was evaluated conducting the experiments using rotary bending fatigue testing machine (R = -1). Applied stress vs. number of cycles to failure (S-N) curve was plotted for unnotched and notched specimens. Basquin constants, fatigue strength, fatigue notch factor and notch sensitivity factor were evaluated for the dissimilar joints. Fatigue strength of the joints is correlated with microstructure, microhardness and tensile properties of the joints.

  13. Fatigue Crack Growth Behavior of Gas Metal Arc Welded AISI 409 Grade Ferritic Stainless Steel Joints

    Science.gov (United States)

    Lakshminarayanan, A. K.; Shanmugam, K.; Balasubramanian, V.

    2009-10-01

    The effect of filler metals such as austenitic stainless steel, ferritic stainless steel, and duplex stainless steel on fatigue crack growth behavior of the gas metal arc welded ferritic stainless steel joints was investigated. Rolled plates of 4 mm thickness were used as the base material for preparing single ‘V’ butt welded joints. Center cracked tensile specimens were prepared to evaluate fatigue crack growth behavior. Servo hydraulic controlled fatigue testing machine with a capacity of 100 kN was used to evaluate the fatigue crack growth behavior of the welded joints. From this investigation, it was found that the joints fabricated by duplex stainless steel filler metal showed superior fatigue crack growth resistance compared to the joints fabricated by austenitic and ferritic stainless steel filler metals. Higher yield strength and relatively higher toughness may be the reasons for superior fatigue performance of the joints fabricated by duplex stainless steel filler metal.

  14. Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

    Science.gov (United States)

    2015-05-05

    under bump metallurgy and solder joint geometry on Sn grain morphology in Pb free solder joints were examined. SnAgCu solder joints were examined for...free solder interconnects”, Sci. Technol. Weld . Join. 13, 732 (2008). [3.25] Terashima, S., Takahama, K., Nozaki, M., and Tanaka, M. Recrystallization

  15. Fatigue Assessment of High Strength Steel Welded Joints Under Bending Loading

    International Nuclear Information System (INIS)

    Lee, Myeong-Woo; Kim, Yun-Jae; Park, Jun-Hyub

    2014-01-01

    In this study, a fatigue assessment method for vehicle suspension systems having welded geometries was established under a bending loading condition. For the fatigue life estimation of the actual product s welded joints made of different steels, bending fatigue tests were performed on welded specimens with a simplified shape for obtaining the moment-fatigue-life plot. Further, geometry modeling of the simplified welded specimens was conducted. Results of finite element analysis were used to obtain the stress-fatigue-life plot. The analysis results were also used to calculate the stress concentration factors for notch-factor-based fatigue life estimation. The test results were compared with results of the general notch-factor-based fatigue life estimation for improving fatigue assessment. As a result, it was concluded that both the welded fatigue tests and the notch-factor-based fatigue life estimation are necessary for accurate fatigue assessment

  16. Thermomechanical behavior of tin-rich (lead-free) solders

    Science.gov (United States)

    Sidhu, Rajen Singh

    In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local

  17. Fatigue strength of laser welded joint sheet; Laser yosetsu tsugite no hiro kyodo

    Energy Technology Data Exchange (ETDEWEB)

    Fujii, A; Yoshimura, T; Tsuboi, M; Takasago, T; Nishio, T [Toyota Motor Corp., Aichi (Japan)

    1997-10-01

    In this paper, fatigue strength of laser welded butt joint has been investigated. In order to obtain the influence of underfill and pitting, fatigue test was conducted with different sheet thickness and mechanical properties. Fatigue crack initiated at underfill and pitting in the weld metal. Stress concentration factor and hardness of the weld metal were considered to estimate fatigue limit. However, hardness of the weld metal has no significant effect on fatigue strength. As a result, fatigue strength was well estimated by hardness of base metal and stress concentration factor calculated from the shape of underflll and pitting. 7 refs., 9 figs., 5 tabs.

  18. Fatigue Life Prediction of Self-Piercing Rivet Joints Between Magnesium and Aluminum Alloys

    Directory of Open Access Journals (Sweden)

    Kang Hong-Tae

    2018-01-01

    Full Text Available Various light materials including aluminum alloys and magnesium alloys are being used to reduce the weight of vehicle structures. Joining of dissimilar materials is always a challenging task to construct a solid structure. Self-piercing rivet (SPR joint is one of various joining methods for dissimilar materials. Front shock tower structures were constructed with magnesium alloy (AM60 joined to aluminum alloy (Al6082 by SPR joints. To evaluate the durability performance of the SPR joints in the structures, fatigue tests of the front shock tower structures were conducted with constant amplitude loadings. Furthermore, this study investigated fatigue life prediction method of SPR joints and compared the fatigue life prediction results with that of experimental results. For fatigue life prediction of the SPR joints in the front shock tower structures, lap-shear and cross-tension specimens of SPR joint were constructed and tested to characterize the fatigue properties of the SPR joint. Then, the SPR joint was represented with area contact method (ACM in finite element (FE models. The load-life curves of the lap-shear and cross-tension specimens were converted to a structural stress-life (S-N curve of the SPR joints. The S-N curve was used to predict fatigue life of SPR joints in the front shock tower structures. The test results and the prediction results were well correlated.

  19. A study of fatigue life distribution of butt-welded joints

    International Nuclear Information System (INIS)

    Sakai, Tatsuo; Fujitani, Keizo; Kikuchi, Toshiro; Tanaka, Takao.

    1981-01-01

    Various kinds of welded joints are being used in many structures such as ships, bridges and constructions. It is important in reliability analysis of such structures to clarify the statistical fatigue property of the welded joints. In this study, fatigue tests were carried out on the butt-welded joints of SM50A steel and a theoretical interpretation on the fatigue life distribution was attempted, assuming that a butt-welded joint is composed of a number of sliced specimens with different fatigue strengths. Main results obtained are summarized as follows; (1) The median crack initiation life of the butt-welded joint specimens coincided with that of the sliced specimens, when the crack initiation was defined by a 0.2 mm crack in the sliced specimens or the equivalent state of stress intensity factor in the joint specimens. (2) The distribution of crack initiation lives of the butt-welded joints can be theoretically derived by combining the concept of extreme distribution and the distribution model on the number of fatigue cracks. The theoretical distribution of crack initiation lives of the joints is in good agreement with the general trend of the experimental results. (3) If the distribution of crack initiation lives and the crack growth law are given experimentally, one can obtain analytically the distribution of final fatigue lives. The fatigue life distribution of the sliced specimens can be explained by the theory established in this study. (author)

  20. Tensile and fatigue properties of weld-bonded and adhesive-bonded magnesium alloy joints

    International Nuclear Information System (INIS)

    Xu, W.; Liu, L.; Zhou, Y.; Mori, H.; Chen, D.L.

    2013-01-01

    The microstructures, tensile and fatigue properties of weld-bonded (WB) AZ31B-H24 Mg/Mg joints with different sizes of bonding area were evaluated and compared with the adhesive-bonded (AB) Mg/Mg joints. Typical equiaxed dendritic structures containing divorced eutectic Mg 17 Al 12 particles formed in the fusion zone of both WB-1 (with a bonding area of 35 mm×35 mm) and WB-0.5 (with a bonding area of 17.5 mm×35 mm) joints. Less solidification shrinkage cracking was observed in the WB-0.5 joints than WB-1 joints. While the WB-0.5 joints exhibited a slightly lower maximum tensile shear stress than the AB-0.5 joints (with a bonding area of 17.5 mm×35 mm), the energy absorption was equivalent. Although the AB-0.5 joints exhibited a higher fatigue resistance at higher cyclic stress levels, both the AB-0.5 and WB-0.5 joints showed an equivalent fatigue resistance at lower cyclic stress levels. A higher fatigue limit was observed in the WB-0.5 joints than in the WB-1 joints owing to the presence of fewer shrinkage pores. Cohesive failure mode along the adhesive layer in conjunction with partial nugget pull-out from the weld was observed at the higher cyclic loads, and fatigue failure occurred in the base metal at the lower cyclic loads

  1. Effects of the curing pressure on the torsional fatigue characteristics of adhesively bonded joints

    International Nuclear Information System (INIS)

    Hwang, Hui Yun; Kim, Byung Jung; Lee, Dai Gil

    2004-01-01

    Adhesive joints have been widely used for fastening thin adherends because they can distribute the load over a larger area than mechanical joints, require no hole, add very little weight to the structure and have superior fatigue resistance. However, the fatigue characteristics of adhesive joints are much affected by applied pressure during curing operation because actual curing temperature is changed by applied pressure and the adhesion characteristics of adhesives are very sensitive to manufacturing conditions. In this study, cure monitoring and torsional fatigue tests of adhesive joints with an epoxy adhesive were performed in order to investigate the effects of the applied pressure during curing operation. From the experiments, it was found that the actual curing temperature increased as the applied pressure increased, which increased residual thermal stress in the adhesive layer. Therefore, the fatigue life decreased as the applied pressure increased because the mean stress during fatigue tests increased due to the residual thermal stress

  2. High-cycle fatigue properties of small-bore socket-welded pipe joint

    International Nuclear Information System (INIS)

    Maekawa, Akira; Noda, Michiyasu; Suzuki, Michiaki

    2009-01-01

    Piping and equipment in nuclear power plants are structures including many welded joints. Reliability of welded joints is one of high-priority issues to improve the safety of nuclear power plants. However, occurrence of fatigue failures in small-bore socket-welded pipe joints by high-cycle vibrations is still reported. In this study, fatigue experiments on a socket-welded joint of austenitic stainless steel pipe was conducted under excitation conditions similar to those in actual plants to investigate vibration characteristics and fatigue strength. It was found that the natural frequency of pipe with socket-welded joint gradually decreased as fatigue damage developed, according to the Miner rule for fatigue life evaluation. The results indicate that the fatigue life of the welded pipe joint could be estimated by monitoring the decreasing ratio of the natural frequency of the pipe. The evaluation of decreasing ratio of the natural frequency in addition to fatigue damage evaluation by the Miner rule could enhance the accuracy of fatigue life evaluation. (author)

  3. Research on fatigue behavior and residual stress of large-scale cruciform welding joint with groove

    International Nuclear Information System (INIS)

    Zhao, Xiaohui; Liu, Yu; Liu, Yong; Gao, Yuan

    2014-01-01

    Highlights: • The fatigue behavior of the large-scale cruciform welding joint with groove was studied. • The longitudinal residual stress of the large-scale cruciform welding joint was tested by contour method. • The fatigue fracture mechanism of the large-scale cruciform welding joint with groove was analyzed. - Abstract: Fatigue fracture behavior of the 30 mm thick Q460C-Z steel cruciform welded joint with groove was investigated. The fatigue test results indicated that fatigue strength of 30 mm thick Q460C-Z steel cruciform welded joint with groove can reach fatigue level of 80 MPa (FAT80). Fatigue crack source of the failure specimen initiated from weld toe. Meanwhile, the microcrack was also found in the fusion zones of the fatigue failure specimen, which was caused by weld quality and weld metal integrity resulting from the multi-pass welds. Two-dimensional map of the longitudinal residual stress of 30 mm thick Q460C-Z steel cruciform welded joint with groove was obtained by using the contour method. The stress nephogram of Two-dimensional map indicated that longitudinal residual stress in the welding center is the largest

  4. Features that exacerbate fatigue severity in joint hypermobility syndrome/Ehlers-Danlos syndrome - hypermobility type.

    Science.gov (United States)

    Krahe, Anne Maree; Adams, Roger David; Nicholson, Leslie Lorenda

    2018-08-01

    To assess the prevalence, severity and impact of fatigue on individuals with joint hypermobility syndrome (JHS)/Ehlers-Danlos syndrome - hypermobility type (EDS-HT) and establish potential determinants of fatigue severity in this population. Questionnaires on symptoms and signs related to fatigue, quality of life, mental health, physical activity participation and sleep quality were completed by people with JHS/EDS-HT recruited through two social media sites. Multiple regression analysis was performed to identify predictors of fatigue in this population. Significant fatigue was reported by 79.5% of the 117 participants. Multiple regression analysis identified five predictors of fatigue severity, four being potentially modifiable, accounting for 52.3% of the variance in reported fatigue scores. Predictors of fatigue severity were: the self-perceived extent of joint hypermobility, orthostatic dizziness related to heat and exercise, levels of participation in personal relationships and community, current levels of physical activity and dissatisfaction with the diagnostic process and management options provided for their condition. Fatigue is a significant symptom associated with JHS/EDS-HT. Assessment of individuals with this condition should include measures of fatigue severity to enable targeted management of potentially modifiable factors associated with fatigue severity. Implications for rehabilitation Fatigue is a significant symptom reported by individuals affected by joint hypermobility syndrome/Ehlers-Danlos syndrome - hypermobility type. Potentially modifiable features that contribute to fatigue severity in this population have been identified. Targeted management of these features may decrease the severity and impact of fatigue in joint hypermobility syndrome/Ehlers-Danlos syndrome - hypermobility type.

  5. Fatigue behaviour of T welded joints rehabilitated by tungsten inert gas and plasma dressing

    International Nuclear Information System (INIS)

    Ramalho, Armando L.; Ferreira, Jose A.M.; Branco, Carlos A.G.M.

    2011-01-01

    Highlights: → This study addresses the use of improvement techniques for repair T welded joints. → TIG and plasma arc re-melting are applied in joints with fatigue cracks at weld toes. → Plasma dressing provides reasonable repair in joints with cracks greater than 4 mm. → TIG dressing produces a deficient repair in joints with cracks greater than 4 mm. → TIG dressing provides good repair in joints with fatigue cracks lesser than 2.5 mm. -- Abstract: This paper concerns a fatigue study on the effect of tungsten inert gas (TIG) and plasma dressing in non-load-carrying fillet welds of structural steel with medium strength. The fatigue tests were performed in three point bending at the main plate under constant amplitude loading, with a stress ratio of R = 0.05 and a frequency of 7 Hz. Fatigue results are presented in the form of nominal stress range versus fatigue life (S-N) curves obtained from the as welded joints and the TIG dressing joints at the welded toe. These results were compared with the ones obtained in repaired joints, where TIG and plasma dressing were applied at the welded toes, containing fatigue cracks with a depth of 3-5 mm in the main plate and through the plate thickness. A deficient repair was obtained by TIG dressing, caused by the excessive depth of the crack. A reasonable fatigue life benefits were obtained with plasma dressing. Good results were obtained with the TIG dressing technique for specimens with shallower initial defects (depth lesser than 2.5 mm). The fatigue life benefits were presented in terms of a gain parameter assessed using both experimental data and life predictions based on the fatigue crack propagation law.

  6. Effects of residual stress on fatigue strength of small diameter welded pipe joint

    International Nuclear Information System (INIS)

    Yamashita, Tetsuo; Hattori, Takahiro; Nomoto, Toshiharu; Iida, Kunihiro; Sato, Masanobu

    1996-01-01

    A power plant consists of many welded components, therefore, it is essential in establishing the reliability of the power plant to maintain the reliability of all welded components. The fatigue failure caused by mechanical vibrations of small diameter welded joints, which is represented by socket welded joints, is one of the major causes of trouble for the welded parts of the power plant. Here, bending fatigue tests were conducted to investigate the fatigue strength of small diameter socket welded pipe joints. In the most cases of large diameter socket joints, a fatigue crack started from the root of the fillet weld though the stress amplitude at the root was smaller than that at the toe of fillet weld. Additionally, the fatigue strength was affected by the weld bead sequence. The residual stress was considered to be one of the important parameters governing fatigue strength, therefore, its effects were investigated. In several types of pipe joints, the local stress and residual stress distributions were calculated by finite element analysis. The residual stresses were compressive at the toe and tensile at the root of the socket welded joints. Based on these results, the effects of residual stresses on the fatigue strength are discussed for small diameter welded pipe joints in the present work

  7. Fatigue of welded joint in a stainless steel AISI 304 L

    International Nuclear Information System (INIS)

    Kuromoto, N.K.; Guimaraes, A.S.; Miranda, P.E.V. de

    1986-01-01

    The flexion fatigue behavior for the base metal and welded joint of an AISI 304 L stainless steel type, used in the Angra-1 reactor, was determined. An automatic welding process was used with improved procedures in order to assure better welding metallurgy. Fatigue tests samples reinforcements were done to allow the evaluation of metallurgical variables, specially the role played by delta ferrite. The resulting welded joint showed better fatigue life than the base metal. Delta ferrite was found to play an important role on the initiation and propagation processes of the fatigue cracks. (Author) [pt

  8. Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement

    Energy Technology Data Exchange (ETDEWEB)

    Li, Yi, E-mail: yili64-c@my.cityu.edu.hk [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong); Luo, Kaiming; Lim, Adeline B.Y.; Chen, Zhong [School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798 (Singapore); Wu, Fengshun [School of Materials Science and Engineering, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan (China); Chan, Y.C. [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong)

    2016-07-04

    Sn57.6Bi0.4Ag solder has been reinforced successfully through the addition of tungsten (W) nanoparticles at a concentration of 0.5 wt%. With the addition of W nanoparticles, the solder matrix lamellar interphase spacing was reduced by 31.0%. Due to the dispersion of W nanoparticles and the consequently refined microstructure, the mechanical properties of the solder alloy were enhanced, as indicated by a 6.2% improvement in the microhardness. During the reflow of solder on Au/Ni/Cu pads, the entire Au layer dissolved into the molten solder rapidly and a large number of (Au,Ni)(Sn,Bi){sub 4} particles were formed. The fracture path of the as-reflowed joint was within the solder region, showing ductile characteristic, and the shear strength was reinforced by 8.2%, due to the enhanced mechanical properties of the solder. During the subsequent aging process, the Au migrated back towards the interface and a thick layer of interfacial (Au,Ni)(Sn,Bi){sub 4} IMC was formed, leading to the shift of the fracture path to the interfacial IMC region, the transformation to brittle fracture and the deterioration of the strength of the joint, due to Au embrittlement. By adding W nanoparticles, the migration of Au was mitigated and the thickness of the (Au,Ni)(Sn,Bi){sub 4} layer was reduced significantly, which reduced the Au embrittlement-induced deterioration of the strength of the joint. During electromigration, the segregation of the Bi-rich and Sn-rich phases and the accumulation of the (Au,Ni)(Sn,Bi){sub 4} layer at cathode interface were mitigated by the addition of W nanoparticles, which improved the electromigration resistance.

  9. Fatigue strength evaluation of friction stir welded aluminium joints using the nominal and notch stress concepts

    International Nuclear Information System (INIS)

    Barsoum, Z.; Khurshid, M.; Barsoum, I.

    2012-01-01

    Highlights: ► Fatigue testing and evaluation of friction stir welded butt and overlap joints. ► Evaluation based on nominal and effective notch stress concept. ► Comparison with different design recommendations and codes. ► Higher fatigue strength and SN-slopes is observed. ► New fatigue design recommendations proposed for FSW joints. -- Abstract: In this study the fatigue strength is investigated for Friction Stir Welded (FSW) overlap and butt welded joints in different thicknesses based on nominal and effective notch stress concepts. The fatigue test results are compared with fatigue strength recommendations according to EN 1999-1-3 and International Institute of Welding (IIW). The results are also compared with available published data and Finite Element Analysis (FEA) is carried out to investigate the effect of plate thickness and nugget size on the fatigue strength of overlap joints. 3–3 mm butt welded joints shows the highest fatigue strength in comparison with 3–5 mm butt welded and overlap joints. Slopes of the SN-curves for two different joint types differ from the slope recommended by IIW. A specific failure trend is observed in overlap FSW joints. However, the slopes of the SN-curves are in close agreement with slopes found in EN 1999-1-3. The slopes of various published results and test results presented in this study are in good agreement with each other. The suggested fatigue design curves for the nominal and effective notch stress concept have a higher slope than given for fusion welds by IIW.

  10. Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

    International Nuclear Information System (INIS)

    Sun, Peng; Andersson, Cristina; Wei, Xicheng; Cheng, Zhaonian; Shangguan, Dongkai; Liu, Johan

    2007-01-01

    In this paper, the coupling effect in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi solder joint with sandwich structure by long time reflow soldering was studied. It was found that the interfacial compound at the Cu substrate was binary Cu-Sn compound in Sn-Ag-Bi solder joint and Cu 5 Zn 8 phase in Sn-Zn-Bi solder joint. The thickness of the Cu-Zn compound layer formed at the Cu substrate was greater than or equal to that of Cu-Sn compound layer, although the reflow soldering temperature of Sn-Zn-Bi (240 o C) was lower than that of Sn-Ag-Bi (250 o C). The stable Cu-Zn compound was the absolute preferential phase in the interfacial layer between Sn-Zn-Bi and the Cu substrate. The ternary (Cu, Ni) 6 Sn 5 compound was formed at the Sn-Ag-Bi/Ni(P)-Cu metallization interface, and a complex alloy Sn-Ni-Cu-Zn was formed at the Sn-Zn-Bi/Ni(P)-Cu metallization interface. It was noted that Cu atoms could diffuse from the Cu substrate through the solder matrix to the Ni(P)-Cu metallization within 1 min reflow soldering time for both solder systems, indicating that just 30 s was long enough for Cu to go through 250 μm diffusion length in the Sn-Ag-Bi solder joint at 250 o C. The coupling effect between Ni(P)/Cu metallization and Cu substrate was confirmed as the type of IMCs at Ni(P) layer had been changed from Ni-Sn system to Cu-Sn system apparently by the diffusion effect of Cu atoms. The (Cu, Ni) 6 Sn 5 layer at the Ni(P)/Cu metallization grew significantly and its thickness was even greater than that of the Cu-Sn compound on the opposite side, however the growth of the complex alloy including Sn, Ni, Cu and Zn on the Ni(P)/Cu metallization was suppressed

  11. Study on Fatigue Performance of Composite Bolted Joints with Bolt-Hole Delamination

    Science.gov (United States)

    Liu, M. J.; Yu, S.; Zhao, Q. Y.

    2018-03-01

    Fatigue performance of composite structure with imperfections is a challenging subject at present. Based on cohesive zone method and multi-continuum theory, delamination evolution response and fatigue life prediction of a 3D composite single-lap joint with a bolt-hole have been investigated through computer codes Abaqus and Fe-safe. Results from the comparison of a perfect composite bolted joint with another defect one indicates that a relatively small delamination damage around the bolt hole brings about significant degradation of local material performance. More notably, fatigue life of stress concentration region of composite bolted joints is highly sensitive to external loads, as an increase of 67% cyclic load amplitude leads to an decrease of 99.5% local fatigue life in this study. However, the numerical strategy for solving composite fatigue problems is meaningful to engineering works.

  12. Stress analysis of fatigue cracks in mechanically fastened joints : An analytical and experimental investigation

    NARCIS (Netherlands)

    De Rijck, J.J.M.

    2005-01-01

    The two historical fuselage failures, Comet in 1954 and Aloha in 1988, illustrate that similar accidents must be avoided which requires a profound understanding of the fatigue mechanisms involved, including analytical models to predict the fatigue behavior of riveted joints of a fuselage structure.

  13. The Effects of Load Carriage and Muscle Fatigue on Lower-Extremity Joint Mechanics

    Science.gov (United States)

    Wang, He; Frame, Jeff; Ozimek, Elicia; Leib, Daniel; Dugan, Eric L.

    2013-01-01

    Military personnel are commonly afflicted by lower-extremity overuse injuries. Load carriage and muscular fatigue are major stressors during military basic training. Purpose: To examine effects of load carriage and muscular fatigue on lower-extremity joint mechanics during walking. Method: Eighteen men performed the following tasks: unloaded…

  14. Spontaneous soldering

    International Nuclear Information System (INIS)

    Percacci, R.

    1984-01-01

    It is proposed that the soldering form of general relativity be treated as a dynamical variable. This gives rise to the possibility of treating the linear connection on (n-dimensional) spacetime and an internal O(k)-Yang-Mills field as different components of the same O(N) gauge field (N= n+k). The distinction between gravitational and Yang-Mills interactions is due to a kind of Higgs mechanism driven by the vacuum expectation value of the soldering form. (orig.)

  15. Behaviour under fatigue of AISI 304-L stainless steel welded joints

    International Nuclear Information System (INIS)

    Scal, M.W.; Joia, C.J.B.M.; Sousa e Silva, A.S. de

    1979-01-01

    The fatigue behaviour at room temperature of AISI-304-L stainless steel welded joints obtained by two distinct welding methods was studied. The results obtained were compared to those characteristic of the base metal. The welded joint fatigue samples were rectified in order to eliminate the effect of the welded seam geometry. It was concluded that the mechanisms of fatigue crack start in this case is commanded by the austenitic matrix, there being no influence of the delta ferrite rate and distribution present at the melted zone. (Author) [pt

  16. Fatigue Strength Estimation Based on Local Mechanical Properties for Aluminum Alloy FSW Joints

    Directory of Open Access Journals (Sweden)

    Kittima Sillapasa

    2017-02-01

    Full Text Available Overall fatigue strengths and hardness distributions of the aluminum alloy similar and dissimilar friction stir welding (FSW joints were determined. The local fatigue strengths as well as local tensile strengths were also obtained by using small round bar specimens extracted from specific locations, such as the stir zone, heat affected zone, and base metal. It was found from the results that fatigue fracture of the FSW joint plate specimen occurred at the location of the lowest local fatigue strength as well as the lowest hardness, regardless of microstructural evolution. To estimate the fatigue strengths of aluminum alloy FSW joints from the hardness measurements, the relationship between fatigue strength and hardness for aluminum alloys was investigated based on the present experimental results and the available wide range of data from the references. It was found as: σa (R = −1 = 1.68 HV (σa is in MPa and HV has no unit. It was also confirmed that the estimated fatigue strengths were in good agreement with the experimental results for aluminum alloy FSW joints.

  17. Effects Of Welding On The Fatigue Behaviour Of Commercial Aluminum AA-1100 Joints

    Science.gov (United States)

    Uthayakumar, M.; Balasubramanian, V.; Rani, Ahmad Majdi Abdul; Hadzima, Branislav

    2018-04-01

    Friction Stir Welding (FSW) is an budding solid state welding process, which is frequently used for joining aluminum alloys where materials can be joined without melt and recast. Therefore, when welding alloys through FSW the phase transformations occurs will be in the solid state form. The present work is aimed in evaluating the fatigue life of friction stir welded commercial grade aluminum alloy joints. The commercial grade AA1100 aluminum alloy of 12mm thickness plate is welded and the specimens are tested using a rotary beam fatigue testing machine at different stress levels. The stress versus number of cycles (S-N) curves was plotted using the data points. The Fatigue life of tungsten inert gas (TIG) and metal inert gas (MIG) welded joints was compared. The fatigue life of the weld joints was interrelated with the tensile properties, microstructure and micro hardness properties. The effects of the notches and welding processes are evaluated and reported.

  18. Current density redistribution from no current crowding to current crowding in Pb-free solder joints with an extremely thick Cu layer

    International Nuclear Information System (INIS)

    Han, Jung Kyu; Choi, Daechul; Fujiyoshi, Masaru; Chiwata, Nobuhiko; Tu, King-Ning

    2012-01-01

    In order to remove the effect of current crowding on electromigration, thick Cu under-bump metallization has been widely adopted in the electronics industry. Three-dimensional (3-D) integrated circuits, using through Si via Cu column interconnects, is being developed, and it seems that current crowding may not be a reliability issue. However, statistical experiments and 3-D finite element simulation indicate that there is a transition from no current crowding to current crowding, caused by void growth at the cathode. An analysis of the electromigration-induced failure mechanism in solder joints having a very thick Cu layer is presented. It is a unique failure mechanism, different from that in flip chip technology. Moreover, the study of marker displacement shows two different stages of drift velocity, which clearly demonstrates the back-stress effect and the development of compressive stress.

  19. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

    2009-12-01

    Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the Beta-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of Beta-Sn derived from the electromigration data is in good agreement with the calculated value.

  20. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

    2009-05-15

    Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the {beta}-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of {beta}-Sn derived from the electromigration data is in good agreement with the calculated value.

  1. Experimental Investigation on the Fatigue Mechanical Properties of Intermittently Jointed Rock Models Under Cyclic Uniaxial Compression with Different Loading Parameters

    Science.gov (United States)

    Liu, Yi; Dai, Feng; Dong, Lu; Xu, Nuwen; Feng, Peng

    2018-01-01

    Intermittently jointed rocks, widely existing in many mining and civil engineering structures, are quite susceptible to cyclic loading. Understanding the fatigue mechanism of jointed rocks is vital to the rational design and the long-term stability analysis of rock structures. In this study, the fatigue mechanical properties of synthetic jointed rock models under different cyclic conditions are systematically investigated in the laboratory, including four loading frequencies, four maximum stresses, and four amplitudes. Our experimental results reveal the influence of the three cyclic loading parameters on the mechanical properties of jointed rock models, regarding the fatigue deformation characteristics, the fatigue energy and damage evolution, and the fatigue failure and progressive failure behavior. Under lower loading frequency or higher maximum stress and amplitude, the jointed specimen is characterized by higher fatigue deformation moduli and higher dissipated hysteresis energy, resulting in higher cumulative damage and lower fatigue life. However, the fatigue failure modes of jointed specimens are independent of cyclic loading parameters; all tested jointed specimens exhibit a prominent tensile splitting failure mode. Three different crack coalescence patterns are classified between two adjacent joints. Furthermore, different from the progressive failure under static monotonic loading, the jointed rock specimens under cyclic compression fail more abruptly without evident preceding signs. The tensile cracks on the front surface of jointed specimens always initiate from the joint tips and then propagate at a certain angle with the joints toward the direction of maximum compression.

  2. Experimental Investigation and Finite Element Analysis on Fatigue Behavior of Aluminum Alloy 7050 Single-Lap Joints

    Science.gov (United States)

    Zhou, Bing; Cui, Hao; Liu, Haibo; Li, Yang; Liu, Gaofeng; Li, Shujun; Zhang, Shangzhou

    2018-03-01

    The fatigue behavior of single-lap four-riveted aluminum alloy 7050 joints was investigated by using high-frequency fatigue test and scanning electron microscope (SEM). Stress distributions obtained by finite element (FE) analysis help explain the fatigue performance. The fatigue test results showed that the fatigue lives of the joints depend on cold expansion and applied cyclic loads. FE analysis and fractography indicated that the improved fatigue lives can be attributed to the reduction in maximum stress and evolution of fatigue damage at the critical location. The beneficial effects of strengthening techniques result in tearing ridges or lamellar structure on fracture surface, decrease in fatigue striations spacing, delay of fatigue crack initiation, crack deflection in fatigue crack propagation and plasticity-induced crack closure.

  3. Interface between Sn-Sb-Cu solder and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

    2011-07-15

    Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

  4. Experimental Investigation on High-Cycle Fatigue of Inconel 625 Superalloy Brazed Joints

    Science.gov (United States)

    Chen, Jianqiang; Demers, Vincent; Turner, Daniel P.; Bocher, Philippe

    2018-04-01

    The high-cycle fatigue performance and crack growth pattern of transient liquid phase-brazed joints in a nickel-based superalloy Inconel 625 were studied. Assemblies with different geometries and types of overlaps were vacuum-brazed using the brazing paste Palnicro-36M in conditions such as to generate eutectic-free joints. This optimal microstructure provides the brazed assemblies with static mechanical strength corresponding to that of the base metal. However, eutectic micro-constituents were observed in the fillet region of the brazed assembly due to an incomplete isothermal solidification within this large volume of filler metal. The fatigue performance increased significantly with the overlap distance for single-lap joints, and the best performance was found for double-lap joints. It was demonstrated that these apparent changes in fatigue properties according to the specimen geometry can be rationalized when looking at the fatigue data as a function of the local stress state at the fillet radii. Fatigue cracks were nucleated from brittle eutectic phases located at the surface of the fillet region. Their propagation occurred through the bimodal microstructure of fillet and the diffusion region to reach the base metal. High levels of crack path tortuosity were observed, suggesting that the ductile phases found in the microstructure may act as a potential crack stopper. The fillet region must be considered as the critical region of a brazed assembly for fatigue applications.

  5. Soldering in electronics assembly

    CERN Document Server

    Judd, Mike

    2013-01-01

    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  6. Features of Pd-Ni-Fe solder system for vacuum brazing of low alloy steels

    International Nuclear Information System (INIS)

    Radzievskij, V.N.; Kurochko, R.S.; Lotsmanov, S.N.; Rymar', V.I.

    1975-01-01

    The brazing solder of the Pd-Ni-Fe alloyed with copper and lithium, in order to decrease the melting point and provide for a better spreading, when soldered in vacuum ensures a uniform strength of soldered joints with the base metal of low-alloyed steels of 34KHNIM-type. The properties of low-alloyed steel joints brazed with the Pd-Ni-Fe-system solder little depend on the changes in the soldering parameters. The soldered joint keeps a homogeneous structure after all the stages of heat treatment (annealing, quenching and tempering)

  7. A Real-time Evaluation Technique of Fatigue Damage in Adhesively Bonded Composite-Metal Joints

    International Nuclear Information System (INIS)

    Kwon, Oh Yang; Kim, Tae Hyun

    1999-01-01

    One of the problems for practical use of fiber-reinforced plastics is the performance degradation by fatigue damage in the joints. The study is to develop a nondestructive technique for real-time evaluation of adhesively bonded composite-metal joints. From the prior study we confirmed that the bonding strength can be estimated from the correlation between the qualify of bonded parts and AUP's. We obtained a curve showing the correlation between the degree of fatigue damage and AUP's calculated from signals acquired during fatigue loading of single-lap and double-lap joints of CFRP and Al6061. The curve is an analogy to the one showing stiffness reduction (E/Eo) of polymer matrix composites by fatigue damage. From those facts, it is plausible to predict the degree of fatigue damage in real-time. Amplitude and AUP2 appeared to be optimal parameters to provide more reliable results for single-lap joints whereas Amplitude and AUP2 did for double-lap joints. It is recommended to select optimal parameters for different geometries in the application for real structures

  8. A Real-time Evaluation Technique of Fatigue Damage in Adhesively Bonded Composite-Metal Joints

    Energy Technology Data Exchange (ETDEWEB)

    Kwon, Oh Yang; Kim, Tae Hyun [Inha University, Incheon (Korea, Republic of)

    1999-12-15

    One of the problems for practical use of fiber-reinforced plastics is the performance degradation by fatigue damage in the joints. The study is to develop a nondestructive technique for real-time evaluation of adhesively bonded composite-metal joints. From the prior study we confirmed that the bonding strength can be estimated from the correlation between the qualify of bonded parts and AUP's. We obtained a curve showing the correlation between the degree of fatigue damage and AUP's calculated from signals acquired during fatigue loading of single-lap and double-lap joints of CFRP and Al6061. The curve is an analogy to the one showing stiffness reduction (E/Eo) of polymer matrix composites by fatigue damage. From those facts, it is plausible to predict the degree of fatigue damage in real-time. Amplitude and AUP2 appeared to be optimal parameters to provide more reliable results for single-lap joints whereas Amplitude and AUP2 did for double-lap joints. It is recommended to select optimal parameters for different geometries in the application for real structures

  9. Recommendations for fatigue design of welded joints and components

    CERN Document Server

    Hobbacher, A F

    2016-01-01

    This book provides a basis for the design and analysis of welded components that are subjected to fluctuating forces, to avoid failure by fatigue. It is also a valuable resource for those on boards or commissions who are establishing fatigue design codes. For maximum benefit, readers should already have a working knowledge of the basics of fatigue and fracture mechanics. The purpose of designing a structure taking into consideration the limit state for fatigue damage is to ensure that the performance is satisfactory during the design life and that the survival probability is acceptable. The latter is achieved by the use of appropriate partial safety factors. This document has been prepared as the result of an initiative by Commissions XIII and XV of the International Institute of Welding (IIW).

  10. Reliable high-power diode lasers: thermo-mechanical fatigue aspects

    Science.gov (United States)

    Klumel, Genady; Gridish, Yaakov; Szafranek, Igor; Karni, Yoram

    2006-02-01

    High power water-cooled diode lasers are finding increasing demand in biomedical, cosmetic and industrial applications, where repetitive cw (continuous wave) and pulsed cw operation modes are required. When operating in such modes, the lasers experience numerous complete thermal cycles between "cold" heat sink temperature and the "hot" temperature typical of thermally equilibrated cw operation. It is clearly demonstrated that the main failure mechanism directly linked to repetitive cw operation is thermo-mechanical fatigue of the solder joints adjacent to the laser bars, especially when "soft" solders are used. Analyses of the bonding interfaces were carried out using scanning electron microscopy. It was observed that intermetallic compounds, formed already during the bonding process, lead to the solders fatigue both on the p- and n-side of the laser bar. Fatigue failure of solder joints in repetitive cw operation reduces useful lifetime of the stacks to hundreds hours, in comparison with more than 10,000 hours lifetime typically demonstrated in commonly adopted non-stop cw reliability testing programs. It is shown, that proper selection of package materials and solders, careful design of fatigue sensitive parts and burn-in screening in the hard pulse operation mode allow considerable increase of lifetime and reliability, without compromising the device efficiency, optical power density and compactness.

  11. Loading Analysis of Composite Wind Turbine Blade for Fatigue Life Prediction of Adhesively Bonded Root Joint

    Science.gov (United States)

    Salimi-Majd, Davood; Azimzadeh, Vahid; Mohammadi, Bijan

    2015-06-01

    Nowadays wind energy is widely used as a non-polluting cost-effective renewable energy resource. During the lifetime of a composite wind turbine which is about 20 years, the rotor blades are subjected to different cyclic loads such as aerodynamics, centrifugal and gravitational forces. These loading conditions, cause to fatigue failure of the blade at the adhesively bonded root joint, where the highest bending moments will occur and consequently, is the most critical zone of the blade. So it is important to estimate the fatigue life of the root joint. The cohesive zone model is one of the best methods for prediction of initiation and propagation of debonding at the root joint. The advantage of this method is the possibility of modeling the debonding without any requirement to the remeshing. However in order to use this approach, it is necessary to analyze the cyclic loading condition at the root joint. For this purpose after implementing a cohesive interface element in the Ansys finite element software, one blade of a horizontal axis wind turbine with 46 m rotor diameter was modelled in full scale. Then after applying loads on the blade under different condition of the blade in a full rotation, the critical condition of the blade is obtained based on the delamination index and also the load ratio on the root joint in fatigue cycles is calculated. These data are the inputs for fatigue damage growth analysis of the root joint by using CZM approach that will be investigated in future work.

  12. Microstructure and Fatigue Properties of Laser Welded DP590 Dual-Phase Steel Joints

    Science.gov (United States)

    Xie, Chaojie; Yang, Shanglei; Liu, Haobo; Zhang, Qi; Cao, Yaming; Wang, Yuan

    2017-08-01

    In this paper, cold-rolled DP590 dual-phase steel sheets with 1.5 mm thickness were butt-welded by a fiber laser, and the evolution and effect on microhardness, tensile property and fatigue property of the welded joint microstructure were studied. The results showed that the base metal is composed of ferrite and martensite, with the martensite dispersed in the ferrite matrix in an island manner. The microstructure of the weld zone was lath-shaped martensite that can be refined further by increasing the welding speed, while the heat-affected zone was composed of ferrite and tempered martensite. The microhardness increased with increasing welding speed, and the hardness reached its highest value—393.8 HV—when the welding speed was 5 m/min. Static tensile fracture of the welded joints always occurred in the base metal, and the elongation at break was more than 16%. The conditional fatigue limits of the base metal and the weld joints were 354.2 and 233.6 MPa, respectively, under tension-tension fatigue tests with a stress rate of 0.1. After observation of the fatigue fracture morphology, it was evident that the fatigue crack of the base metal had sprouted into the surface pits and that its expansion would be accelerated under the action of a secondary crack. The fatigue source of the welded joint was generated in the weld zone and expanded along the martensite, forming a large number of fatigue striations. Transient breaking, which occurred in the heat-affected zone of the joint as a result of the formation of a large number of dimples, reflected the obvious characteristics of ductile fracture.

  13. Tensile strength and fatigue strength of 6061 aluminum alloy friction welded joints

    Energy Technology Data Exchange (ETDEWEB)

    Ochi, H.; Tsujino, R. [Osaka Inst. of Tech., Asahi-ku Osaka (Japan); Sawai, T. [Osaka Sangyo Univ., Daito (Japan); Yamamoto, Y. [Setsunan Univ., Neyagawa (Japan); Ogawa, K. [Osaka Prefecture Univ., Sakai (Japan); Suga, Y. [Keio Univ., Kohoku-ku, Yokohama (Japan)

    2002-07-01

    Friction welding of 6061 aluminum alloy was carried out in order to examine the relationship between deformation heat input in the upset stage and joint performance. The joint performance was evaluated by tensile testing and fatigue testing. Stabilized tensile strength was obtained when the deformation heat input in the upset stage exceeded 200 J/s. Weld condition at the weld interface and the width of softened area affected fatigue strength more than tensile strength. That is, when the weld condition at the weld interface is good and the softened area is wide, fatigue strength increases. On the other hand, when the weld condition at the weld interface is good and the softened area is narrow, and when the weld condition at the weld interface is somewhat poor in spite of the wide softened area, fatigue strength decreases. The fatigue limit obtained by the fatigue testing revealed that, when the deformation heat input in the upset stage exceeded a certain value, sound joints could be produced. (orig.)

  14. Removal Torque and Biofilm Accumulation at Two Dental Implant-Abutment Joints After Fatigue.

    Science.gov (United States)

    Pereira, Jorge; Morsch, Carolina S; Henriques, Bruno; Nascimento, Rubens M; Benfatti, Cesar Am; Silva, Filipe S; López-López, José; Souza, Júlio Cm

    2016-01-01

    The aim of this study was to evaluate the removal torque and in vitro biofilm penetration at Morse taper and hexagonal implant-abutment joints after fatigue tests. Sixty dental implants were divided into two groups: (1) Morse taper and (2) external hexagon implant-abutment systems. Fatigue tests on the implant-abutment assemblies were performed at a normal force (FN) of 50 N at 1.2 Hz for 500,000 cycles in growth medium containing human saliva for 72 hours. Removal torque mean values (n = 10) were measured after fatigue tests. Abutments were then immersed in 1% protease solution in order to detach the biofilms for optical density and colony-forming unit (CFU/cm²) analyses. Groups of implant-abutment assemblies (n = 8) were cross-sectioned at 90 degrees relative to the plane of the implant-abutment joints for the microgap measurement by field-emission guns scanning electron microscopy. Mean values of removal torque on abutments were significantly lower for both Morse taper (22.1 ± 0.5 μm) and external hexagon (21.1 ± 0.7 μm) abutments after fatigue tests than those recorded without fatigue tests (respectively, 24 ± 0.5 μm and 24.8 ± 0.6 μm) in biofilm medium for 72 hours (P = .04). Mean values of microgap size for the Morse taper joints were statistically signicantly lower without fatigue tests (1.7 ± 0.4 μm) than those recorded after fatigue tests (3.2 ± 0.8 μm). Also, mean values of microgap size for external hexagon joints free of fatigue were statistically signicantly lower (1.5 ± 0.4 μm) than those recorded after fatigue tests (8.1 ± 1.7 μm) (P abutments (Abs630nm at 0.06 and 2.9 × 10⁴ CFU/cm²) than that on external hexagon abutments (Abs630nm at 0.08 and 4.5 × 10⁴ CFU/cm²) (P = .01). The mean values of removal torque, microgap size, and biofilm density recorded at Morse taper joints were lower in comparison to those recorded at external hexagon implant-abutment joints after fatigue tests in a simulated oral environment for 72 hours.

  15. Multiaxial fatigue assessment of welded joints using the notch stress approach

    DEFF Research Database (Denmark)

    Pedersen, Mikkel Melters

    2016-01-01

    This paper presents an evaluation of the safety involved when performing fatigue assessment of multiaxially loaded welded joints. The notch stress approach according to the IIW is used together with 8 different multiaxial criteria, including equivalent stress-, interaction equation- and critical...... plane approaches. The investigation is carried out by testing the criteria on a large amount of fatigue test results collected from the literature (351 specimens total). Subsequently, the probability of achieving a non-conservative fatigue assessment is calculated in order to evaluate the different...

  16. Mean load effect on fatigue of welded joints using structural stress and fracture mechanics approach

    International Nuclear Information System (INIS)

    Kim, Jong Sung; Kim, Cheol; Jin, Tae Eun; Dong, P.

    2006-01-01

    In order to ensure the structural integrity of nuclear welded structures during design life, the fatigue life has to be evaluated by fatigue analysis procedures presented in technical codes such as ASME B and PV Code Section III. However, existing fatigue analysis procedures do not explicitly consider the presence of welded joints. A new fatigue analysis procedure based on a structural stress/fracture mechanics approach has been recently developed in order to reduce conservatism by erasing uncertainty in the analysis procedure. A recent review of fatigue crack growth data under various mean loading conditions using the structural stress/fracture mechanics approach, does not consider the mean loading effect, revealed some significant discrepancies in fatigue crack growth curves according to the mean loading conditions. In this paper, we propose the use of the stress intensity factor range ΔK characterized with loading ratio R effects in terms of the structural stress. We demonstrate the effectiveness in characterizing fatigue crack growth and S-N behavior using the well-known data. It was identified that the S-N data under high mean loading could be consolidated in a master S-N curve for welded joints

  17. Spot weld arrangement effects on the fatigue behavior of multi-spot welded joints

    International Nuclear Information System (INIS)

    Hassanifard, Soran; Zehsaz, Mohammad; Esmaeili, Firooz

    2011-01-01

    In the present study, the effects of spot weld arrangements in multi-spot welded joints on the fatigue behavior of the joints are studied. Three different four-spot welded joints are considered: one-row four-spot parallel to the loading direction, one-row four-spot perpendicular to the loading direction and two-row four-spot weld specimens. The experimental fatigue test results reveal that the differences between the fatigue lives of three spot welded types in the low cycle regime are more considerable than those in the high cycle regime. However, all kinds of spot weld specimens have similar fatigue strength when approaching a million cycles. A non-linear finite element analysis is performed to obtain the relative stress gradients, effective distances and notch strength reduction factors based on the volumetric approach. The work here shows that the volumetric approach does a very good job in predicting the fatigue life of the multi-spot welded joints

  18. Features of soldering of molybdenum a lols

    International Nuclear Information System (INIS)

    Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

    1980-01-01

    Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

  19. A real time evaluation technique of fatigue damage in adhesively bonded composite metal joints

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Tae Hyun; Kwon Oh Yang [Dept. of Mechanical Engineering, Inje Univesity, Kimhae (Korea, Republic of)

    1999-05-15

    One of the problems for practical use of fiber-reinforced composite material is performance degradation by fatigue damage in the joints. The study is to develope a nondestructive technique for real-time evaluation of adhesively bonded composite-metal joints. From the prior study we confirmed that the bonding strength can be estimated from the correlation between quality of bonded parts and AUP's. We obtained a curve showing the correlation between AUP's calculated from signals obtained from single-lap and double-lap joints and the degree of fatigue damage at bonding interface during fatigue test. The curve is an analogy to the one showing stiffness reduction(E/E{sub 0}) of polymer matrix composites by fatigue damage. From those facts, it is possible to predict degree of damage in real-time. Amplitude and AUP2 appeared to be optimal parameters to provide more reliable results for single-lap joint whereas amplitude and AUP1 did for double-lap joints. It is recommended to select optimal parameters for different geometries in the real structure.

  20. A real time evaluation technique of fatigue damage in adhesively bonded composite metal joints

    International Nuclear Information System (INIS)

    Kim, Tae Hyun; Kwon Oh Yang

    1999-01-01

    One of the problems for practical use of fiber-reinforced composite material is performance degradation by fatigue damage in the joints. The study is to develope a nondestructive technique for real-time evaluation of adhesively bonded composite-metal joints. From the prior study we confirmed that the bonding strength can be estimated from the correlation between quality of bonded parts and AUP's. We obtained a curve showing the correlation between AUP's calculated from signals obtained from single-lap and double-lap joints and the degree of fatigue damage at bonding interface during fatigue test. The curve is an analogy to the one showing stiffness reduction(E/E 0 ) of polymer matrix composites by fatigue damage. From those facts, it is possible to predict degree of damage in real-time. Amplitude and AUP2 appeared to be optimal parameters to provide more reliable results for single-lap joint whereas amplitude and AUP1 did for double-lap joints. It is recommended to select optimal parameters for different geometries in the real structure.

  1. Fatigue Damage Monitoring of a Composite Step Lap Joint Using Distributed Optical Fibre Sensors

    Science.gov (United States)

    Wong, Leslie; Chowdhury, Nabil; Wang, John; Chiu, Wing Kong; Kodikara, Jayantha

    2016-01-01

    Over the past few decades, there has been a considerable interest in the use of distributed optical fibre sensors (DOFS) for structural health monitoring of composite structures. In aerospace-related work, health monitoring of the adhesive joints of composites has become more significant, as they can suffer from cracking and delamination, which can have a significant impact on the integrity of the joint. In this paper, a swept-wavelength interferometry (SWI) based DOFS technique is used to monitor the fatigue in a flush step lap joint composite structure. The presented results will show the potential application of distributed optical fibre sensor for damage detection, as well as monitoring the fatigue crack growth along the bondline of a step lap joint composite structure. The results confirmed that a distributed optical fibre sensor is able to enhance the detection of localised damage in a structure. PMID:28773496

  2. Development of fatigue resistance evaluation method for socket-weld-jointed pipes

    International Nuclear Information System (INIS)

    Noguchi, Shinji; Shibayama, Motoaki; Iwata, Masazumi; Matsuura, Masayuki

    2003-01-01

    Vent line, drain line and sampling line in nuclear power station have many socket welded-joints made of austenitic stainless steel. Their slenderness and stagnation yield some potential of vibration-induced cracking and stress corrosion cracking. For the joints under vibration, the authors firstly elucidated their welding-defect-related fatigue strength by using fracture mechanics. It could define the allowable sets of stress amplitude and defect size. Secondly, authors developed an ultra-sonic detecting apparatus by using a focus-type probe and its programmed crawl on socket part. The authors finally measured the stress amplitude and frequency by sticking strain gage on suspected joints, then evaluated the fatigue resistance of the joints. For more efficient procedure, the method of stress amplitude analysis through vibration measurement is being developed. (author)

  3. Re-analysis of fatigue data for welded joints using the notch stress approach

    DEFF Research Database (Denmark)

    Pedersen, Mikkel Melters; Mouritsen, Ole Ø.; Hansen, Michael Rygaard

    2010-01-01

    Experimental fatigue data for welded joints have been collected and subjected to re-analysis using the notch stress approach according to IIW recommendations. This leads to an overview regarding the reliability of the approach, based on a large number of results (767 specimens). Evidently......-welded joints agree quite well with the FAT 225 curve; however a reduction to FAT 200 is suggested in order to achieve approximately the same safety as observed in the nominal stress approach....

  4. Ti–6Al–4V welded joints via electron beam welding: Microstructure, fatigue properties, and fracture behavior

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Xiaoguang [School of Energy and Power Engineering, Beihang University, Beijing 100191 (China); Co-Innovation Center for Advanced Aero-Engine, Beijing 100191 (China); Li, Shaolin [School of Energy and Power Engineering, Beihang University, Beijing 100191 (China); Qi, Hongyu, E-mail: qhy@buaa.edu.cn [School of Energy and Power Engineering, Beihang University, Beijing 100191 (China); Co-Innovation Center for Advanced Aero-Engine, Beijing 100191 (China)

    2014-03-01

    The effect of microstructural characteristics on the fatigue properties of electron beam-welded joints of forged Ti–6Al–4V and its fracture behavior were investigated. Tensile tests and fatigue tests were conducted at room temperature in air atmosphere. The test data were analyzed in relation to microstructure, high-cycle fatigue properties, low-cycle fatigue properties, and fatigue crack propagation properties. The high-cycle fatigue test results indicated that the fatigue strength of the joint welded via electron beam welding was higher than that of the base metal because the former had a high yield strength and all high-cycle fatigue specimens were fractured in the base metal. Although the joint specimens had a lower low-cycle fatigue life than the base metal, they mainly ruptured at the fusion zone of the joint specimen and their crack initiation mechanism is load-dependent. The fatigue crack propagation test results show that the joint had a slower crack propagation rate than the base metal, which can be attributed to the larger grain in the fusion zone.

  5. Probability-based assessment and maintenance of welded joints damaged by fatigue

    International Nuclear Information System (INIS)

    Cremona, C.; Lukic, M.

    1998-01-01

    This paper presents a probabilistic reliability assessment procedure for steel components damaged by fatigue. The study combines the structural reliability theory with a maintenance strategy. The fatigue assessment model is based on a modelisation of the fatigue phenomenon issued from the principles of fracture mechanics theory. The safety margin includes the crack growth propagation and allows to treat fatigue damage in a general manner. Damaging cycles and non damaging cycles are distinguished. The sensitivity study of the different parameters shows that some variables can be taken as deterministic. Applications are made on a welded joint 'stiffener/bottom-plate' of a typical steel bridge. The model is then used for taking into account inspection results. Non destructive inspection (NDI) techniques are also used for updating failure probabilities. The results show their ability to be inserted in a maintenance strategy for optimizing the next inspection time. This has led to define cost functions related to the total maintenance cost; this cost is then minimized for determining the optimal next inspection time. An example of welded joint cracked by fatigue highlights the different concepts. The approach presented in the paper is not only restrained to fatigue problems, but can be applied to a wide variety of degrading phenomena. (orig.)

  6. Recommendations for joint fatigue coefficients for welded P91 junctions at 550 °C

    Energy Technology Data Exchange (ETDEWEB)

    Matheron, P., E-mail: philippe.matheron@cea.fr; Aiello, G.; Ancelet, O.; Forest, L.

    2016-04-15

    Modified 9Cr1Mo steels are potential candidates as structural materials of GEN-IV nuclear reactors. Since the design of structural components is influenced by the presence of the welds, their mechanical properties are also included in the design codes. In the European code RCC-MRx, a weld is considered as a homogeneous (base metal) component with a margin coefficient, called weld coefficient. Currently no values of joint fatigue coefficients for P91 junctions are given in RCC-MRx. After a recall of the weld design rules contained in the code, this work presents the experimental activities carried out to characterize the fatigue behaviour of TIG welded P91 junctions at high temperatures. Finite elements calculations were performed on the basis of the characterization of the base and weld metal. The results of the tests validate the numerical results. Values of the weld joint fatigue coefficients for P91 are proposed for possible inclusion in RCC-MRx.

  7. Reliability Analysis for Adhesive Bonded Composite Stepped Lap Joints Loaded in Fatigue

    DEFF Research Database (Denmark)

    Kimiaeifar, Amin; Sørensen, John Dalsgaard; Lund, Erik

    2012-01-01

    -1, where partial safety factors are introduced together with characteristic values. Asymptotic sampling is used to estimate the reliability with support points generated by randomized Sobol sequences. The predicted reliability level is compared with the implicitly required target reliability level defined......This paper describes a probabilistic approach to calculate the reliability of adhesive bonded composite stepped lap joints loaded in fatigue using three- dimensional finite element analysis (FEA). A method for progressive damage modelling is used to assess fatigue damage accumulation and residual...... by the wind turbine standard IEC 61400-1. Finally, an approach for the assessment of the reliability of adhesive bonded composite stepped lap joints loaded in fatigue is presented. The introduced methodology can be applied in the same way to calculate the reliability level of wind turbine blade components...

  8. Evaluation of fatigue cracks in FSW joints of industrial structural materials by laminography

    International Nuclear Information System (INIS)

    Sano, Yuji; Masaki, Kiyotaka; Kajiwara, Kentaro

    2016-01-01

    Friction stir welding (FSW) is an emerging technology for joining flat and thin metal materials and has been applied in manufacturing in aviation and automotive industries. Fatigue property is one of the most important items to be evaluated for the structural integrity of the products, and therefore, it is necessary to visualize the three-dimensional (3D) behavior of fatigue cracks propagating in the non-homogeneous and anisotropic stirred zone of FSW joints. We have applied laminography with synchrotron radiation of SPring-8 to the FSW joints of aluminum alloy as a typical structural material. The results showed that the fatigue cracks propagated in a unique way depending on the stirred material. (author)

  9. Fatigue Tests on Welded Joints Improved by Grinding

    DEFF Research Database (Denmark)

    Agerskov, Henning; Bjørnbak-Hansen, Jørgen; Olesen, John Forbes

    The present project is a part of an investigation on the fatigue life of the welded structure of large two-stroke diesel engines. Of special interest has been a study of the improvement in fatigue life, due to grinding of the weld toes. The test series carried through showed a significant increase...... without grinding to approx. 6.4 for the test series with grinding. In one of the test series (No. 7), the crack initiation in most tests moved from the weld toe to the non-ground surface between the ground areas at the weld toes, due to the grinding....... in fatigue life due to the grinding, ranging from a factor of approx. 2.8 to infinity, depending on the load level. With the limited number of tests carried out, S-N lines have not been determined. However, the results obtained indicate a change in slope of the S-N line from approx. 3.0 for the test series...

  10. Relationship between Fatigue and Gait Abnormality in Joint Hypermobility Syndrome/Ehlers-Danlos Syndrome Hypermobility Type

    Science.gov (United States)

    Celletti, Claudia; Galli, Manuela; Cimolin, Veronica; Castori, Marco; Albertini, Giorgio; Camerota, Filippo

    2012-01-01

    Ehlers-Danlos syndrome (EDS) is a clinically and genetically heterogeneous group of inherited connective tissue disorders characterised by joint hypermobility, skin hyperextensibility and tissue fragility. It has recently been shown that muscle weakness occurs frequently in EDS, and that fatigue is a common and clinically important symptom. The…

  11. The Fatigue Behaviour of T- and X-Joints Made of Square Hollow Sections

    NARCIS (Netherlands)

    Van Wingerde, A.M.

    1992-01-01

    This work presents the results of experimental and numerical research on the fatigue behaviour of T- and X-joints between square hollow sections of which the brace is welded to the face of the chord, without any additional stiffeners. The work has been carried out in the framework of the CIDECT

  12. Monitoring of fatigue damage in composite lap-joints using guided waves and FBG sensors

    Science.gov (United States)

    Karpenko, Oleksii; Khomenko, Anton; Koricho, Ermias; Haq, Mahmoodul; Udpa, Lalita

    2016-02-01

    Adhesive bonding is being increasingly employed in many applications as it offers possibility of light-weighting and efficient multi-material joining along with reduction in time and cost of manufacturing. However, failure initiation and progression in critical components like joints, specifically in fatigue loading is not well understood, which necessitates reliable NDE and SHM techniques to ensure structural integrity. In this work, concurrent guided wave (GW) and fiber Bragg grating (FBG) sensor measurements were used to monitor fatigue damage in adhesively bonded composite lap-joints. In the present set-up, one FBG sensor was strategically embedded in the adhesive bond-line of a lap-joint, while two other FBGs were bonded on the surface of the adherends. Full spectral responses of FBG sensors were collected and compared at specific intervals of fatigue loading. In parallel, guided waves were actuated and sensed using PZT wafers mounted on the composite adherends. Experimental results demonstrated that time-of-flight (ToF) of the fundamental modes transmitted through the bond-line and spectral response of FBG sensors were sensitive to fatigue loading and damage. Combination of guided wave and FBG measurements provided the desired redundancy and synergy in the data to evaluate the degradation in bond-line properties. Measurements taken in the presence of continuously applied load replicated the in-situ/service conditions. The approach shows promise in understanding the behavior of bonded joints subjected to complex loading.

  13. Continuous Wavelet Transform Analysis of Surface Electromyography for Muscle Fatigue Assessment on the Elbow Joint Motion

    Directory of Open Access Journals (Sweden)

    Triwiyanto Triwiyanto

    2017-01-01

    Full Text Available Studying muscle fatigue plays an important role in preventing the risks associated with musculoskeletal disorders. The effect of elbow-joint angle on time-frequency parameters during a repetitive motion provides valuable information in finding the most accurate position of the angle causing muscle fatigue. Therefore, the purpose of this study is to analyze the effect of muscle fatigue on the spectral and time-frequency domain parameters derived from electromyography (EMG signals using the Continuous Wavelet Transform (CWT. Four male participants were recruited to perform a repetitive motion (flexion and extension movements from a non-fatigue to fatigue condition. EMG signals were recorded from the biceps muscle. The recorded EMG signals were then analyzed offline using the complex Morlet wavelet. The time-frequency domain data were analyzed using the time-averaged wavelet spectrum (TAWS and the Scale-Average Wavelet Power (SAWP parameters. The spectral domain data were analyzed using the Instantaneous Mean Frequency (IMNF and the Instantaneous Mean Power Spectrum (IMNP parameters. The index of muscle fatigue was observed by calculating the increase of the IMNP and the decrease of the IMNF parameters. After performing a repetitive motion from non-fatigue to fatigue condition, the average of the IMNF value decreased by 15.69% and the average of the IMNP values increased by 84%, respectively. This study suggests that the reliable frequency band to detect muscle fatigue is 31.10-36.19Hz with linear regression parameters of 0.979mV^2Hz^(-1 and 0.0095mV^2Hz^(-1 for R^2 and slope, respectively.

  14. An accurate fatigue damage model for welded joints subjected to variable amplitude loading

    Science.gov (United States)

    Aeran, A.; Siriwardane, S. C.; Mikkelsen, O.; Langen, I.

    2017-12-01

    Researchers in the past have proposed several fatigue damage models to overcome the shortcomings of the commonly used Miner’s rule. However, requirements of material parameters or S-N curve modifications restricts their practical applications. Also, application of most of these models under variable amplitude loading conditions have not been found. To overcome these restrictions, a new fatigue damage model is proposed in this paper. The proposed model can be applied by practicing engineers using only the S-N curve given in the standard codes of practice. The model is verified with experimentally derived damage evolution curves for C 45 and 16 Mn and gives better agreement compared to previous models. The model predicted fatigue lives are also in better correlation with experimental results compared to previous models as shown in earlier published work by the authors. The proposed model is applied to welded joints subjected to variable amplitude loadings in this paper. The model given around 8% shorter fatigue lives compared to Eurocode given Miner’s rule. This shows the importance of applying accurate fatigue damage models for welded joints.

  15. Fatigue Strength Assessment of Welded Mild Steel Joints Containing Bulk Imperfections

    Directory of Open Access Journals (Sweden)

    Martin Leitner

    2018-04-01

    Full Text Available This work investigates the effect of gas pores, as bulk imperfections, on the fatigue strength of welded mild steel joints. Two test series containing different butt joint geometries and weld process parameters are included in order to achieve two variable types of pore sizes. Based on the √area-parameter by Murakami, the test series can be grouped into imperfections exhibiting √area < 1000 µm and √area > 1000 µm. Fatigue tests at a load stress ratio of R = 0.1 are performed, which act as comparison for the subsequent fatigue estimation. To assess the fatigue resistance, the approaches by Murakami, De Kazinczy, and Mitchell are utilized, which highlight certain differences in the applicability depending on the imperfection size. It is found that, on one hand, Murakami’s approach is well suitable for both small and large gas pores depending on the applied model parameters. On the other hand, the fatigue concepts by De Kazinczy and Mitchell are preferably practicable for large defects with √area > 1000 µm. In addition, the method by Mitchell incorporates the stress concentration factor of the imperfection, which can be numerically computed considering the size, shape, and location of the gas pore, as presented in this paper.

  16. Resistance to corrosion fatigue fracture in heat resistant steels and their welded joints

    International Nuclear Information System (INIS)

    Timofeev, B.T.; Fedorova, V.A.; Zvezdin, Yu.I.; Vajner, L.A.; Filatov, V.M.

    1987-01-01

    Experimental data on cyclic crack resistance of heat-resistant steels and their welded joints employed for production of the reactor bodies are for the first time generalized and systematized. The formula is suggested accounting for surface and inner defects to calculate the fatigue crack growth in the process of operation. This formula for surface defects regards also the effect of the corrosion factor. Mechanisms of the reactor water effect on the fatigue crack growth rate are considered as well as a combined effect of radiation and corrosive medium on this characteristic

  17. Crack initiation and propagation in welded joints of turbine and boiler steels during low cycle fatigue

    International Nuclear Information System (INIS)

    Lindblom, J.; Sandstroem, R.; Linde, L.; Henderson, P.

    1990-01-01

    Low cycle fatigue (LCF) tests have been performed at 300 and 565 degrees C on welded joints and on microstructures to be found in or near welded joints in a low alloy ferritic steel 0.5 Cr, 0.5 Mo, 0.25 V. The difference in lifetimes between the 300 degrees C and 565 degrees C tests was small comparing the same microstructures and strain ranges, although the stress amplitude was greater at 300 degrees C. Under constant stress conditions the fatigue life depended on the fatigue life of the parent metal but under constant strain conditions the lifetime was governed by that of the bainitic structures. Strain controlled LCF tests have been performed at 750 degrees C on welded joints in the austenitic steel AISI 316 and on different parent and weld metals used in these joints. In continuously cycled samples all cracks were transgranular and initiated at the surface; hold-time samples displayed internally initiated intergranular cracking in the weld metal. Under constant strain conditions the 316 parent and weld metals exhibited similar lifetimes. When considering a constant stress situation the strength of the microsturctures decreased in the following order: Sanicro weld metal, cold deformed parent metal, undeformed parent metal and weld metal (K.A.E.)

  18. Effect of trace solute hydrogen on the fatigue life of electron beam welded Ti-6Al-4V alloy joints

    Energy Technology Data Exchange (ETDEWEB)

    Tao, Junhui; Hu, Shubing, E-mail: 187352581@qq.com; Ji, Longbo

    2017-01-27

    This paper describes an experimental hydrogenating treatment on a Ti-6Al-4V fatigue specimen containing an electron beam welding joint. The effect of trace solute hydrogen on the microstructures and fatigue behavior of welded Ti-6Al-4V alloy joints was investigated using an optical microscope, X-ray diffractometer, scanning electron microscope, transmission electron microscope and other methodologies. The results demonstrated that no hydride formed in the hydrogenated weld joint at a hydrogen concentration of less than 0.140 wt%. Internal hydrogen, which was present in the alloy in the form of solid solution atoms, caused lattice distortion in the β phase. The fatigue properties of the Ti-6Al-4V weld joint hydrogenated with trace solute hydrogen decreased significantly. The solute hydrogen led to an increase in the brittleness of the hydrogenated weld joint. The dislocation densities in the secondary α and β phase were higher. Fatigue cracks nucleated at the α/β interfaces. The effect of solute hydrogen accelerated the separation of the persistent slip bands, which decreased the threshold required for fatigue crack growth. Solute hydrogen also accelerated the fatigue crack growth rate. These two factors contributed to the degradation of the fatigue life in the electron beam welded Ti-6Al-4V alloy joints.

  19. Fatigue

    Science.gov (United States)

    ... to help you find out what's causing your fatigue and recommend ways to relieve it. Fatigue itself is not a disease. Medical problems, treatments, and personal habits can add to fatigue. These include Taking certain medicines, such as antidepressants, ...

  20. Mechanical properties and fatigue strength of high manganese non-magnetic steel/carbon steel welded joints

    International Nuclear Information System (INIS)

    Nakaji, Eiji; Ikeda, Soichi; Kim, You-Chul; Nakatsuji, Yoshihiro; Horikawa, Kosuke.

    1997-01-01

    The dissimilar materials welded joints of high manganese non-magnetic steel/carbon steel (hereafter referred to as DMW joints), in which weld defects such as hot crack or blowhole are not found, were the good quality. Tensile strength of DMW joints was 10% higher than that of the base metal of carbon steel. In the bend tests, the DMW joints showed the good ductility without crack. Charpy absorbed energy at 0(degC) of the DMW joints was over 120(J) in the bond where it seems to be the lowest. Large hardening or softening was not detected in the heat affected zone. Fatigue strength of the DMW joints is almost the same with that of the welded joints of carbon steel/carbon steel. As the fatigue strength of the DMW joints exceeds the fatigue design standard curve of JSSC for carbon steel welded joints, the DMW joints can be treated the same as the welded joints of carbon steel/carbon steel of which strength is lower than that of high manganese non-magnetic steel, from the viewpoint of the fatigue design. (author)

  1. Comparison of Post Weld Treatment of High Strength Steel Welded Joints in Medium Cycle Fatigue

    DEFF Research Database (Denmark)

    Pedersen, Mikkel Melters; Mouritsen, Ole Ø.; Hansen, Michael Rygaard

    2010-01-01

    This paper presents a comparison of three post-weld treatments for fatigue life improvement of welded joints. The objective is to determine the most suitable post-weld treatment for implementation in mass production of certain crane components manufactured from very high-strength steel...... the stress range can exceed the yield-strength of ordinary structural steel, especially when considering positive stress ratios (R > 0). Fatigue experiments and qualitative evaluation of the different post-weld treatments leads to the selection of TIG dressing. The process of implementing TIG dressing...... in mass production and some inherent initial problems are discussed. The treatment of a few critical welds leads to a significant increase in fatigue performance of the entire structure and the possibility for better utilization of very high-strength steel....

  2. IIW recommendations for the HFMI treatment for improving the fatigue strength of welded joints

    CERN Document Server

    Marquis, Gary B

    2016-01-01

    This book of recommendations presents an overview of High Frequency Mechanical Impact (HFMI) techniques existing today in the market and their proper procedures, quality assurance measures and documentation. Due to differences in HFMI tools and the wide variety of potential applications, certain details of proper treatments and quantitative quality control measures are presented generally. An example of procedure specification as a quality assurance measure is given in the Appendix. Moreover, the book presents procedures for the fatigue life assessment of HFMI-improved welded joints based on nominal stress, structural hot spot stress and effective notch stress. It also considers the extra benefit that has been experimentally observed for HFMI-treated high-strength steels. The recommendations offer proposals on the effect of loading conditions like high mean stress fatigue cycles, variable amplitude loading and large amplitude/low cycle fatigue cycles. Special considerations for low stress concentration welded...

  3. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Directory of Open Access Journals (Sweden)

    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  4. Neuromuscular fatigue and tibiofemoral joint biomechanics when transitioning from non-weight bearing to weight bearing.

    Science.gov (United States)

    Schmitz, Randy J; Kim, Hyunsoo; Shultz, Sandra J

    2015-01-01

    Fatigue is suggested to be a risk factor for anterior cruciate ligament injury. Fatiguing exercise can affect neuromuscular control and laxity of the knee joint, which may render the knee less able to resist externally applied loads. Few authors have examined the effects of fatiguing exercise on knee biomechanics during the in vivo transition of the knee from non-weight bearing to weight bearing, the time when anterior cruciate ligament injury likely occurs. To investigate the effect of fatiguing exercise on tibiofemoral joint biomechanics during the transition from non-weight bearing to early weight bearing. Cross-sectional study. Research laboratory. Ten participants (5 men and 5 women; age = 25.3 ± 4.0 years) with no previous history of knee-ligament injury to the dominant leg. Participants were tested before (preexercise) and after (postexercise) a protocol consisting of repeated leg presses (15 repetitions from 10°-40° of knee flexion, 10 seconds' rest) against a 60% body-weight load until they were unable to complete a full bout of repetitions. Electromagnetic sensors measured anterior tibial translation and knee-flexion excursion during the application of a 40% body-weight axial compressive load to the bottom of the foot, simulating weight acceptance. A force transducer recorded axial compressive force. The axial compressive force (351.8 ± 44.3 N versus 374.0 ± 47.9 N; P = .018), knee-flexion excursion (8.0° ± 4.0° versus 10.2° ± 3.7°; P = .046), and anterior tibial translation (6.7 ± 1.7 mm versus 8.2 ± 1.9 mm; P Neuromuscular fatigue may impair initial knee-joint stabilization during weight acceptance, leading to greater accessory motion at the knee and the potential for greater anterior cruciate ligament loading.

  5. Modelling of ultrasonic impact treatment (UIT of welded joints and its effect on fatigue strength

    Directory of Open Access Journals (Sweden)

    K.L. Yuan

    2015-10-01

    Full Text Available Ultrasonic impact treatment (UIT is a remarkable post-weld technique applying mechanical impacts in combination with ultrasound into the welded joints. In the present work, a 3D simulation method including welding simulation, numerical modelling of UIT-process and an evaluation of fatigue crack growth has been developed. In the FE model, the actual treatment conditions and local mechanical characteristics due to acoustic softening are set as input parameters. The plastic deformation and compressive stress layer are found to be more pronounced when acoustic softening takes place. The predicted internal residual stress distributions of welded joint before and after UIT are compared with experimental results, showing a fairly good agreement with each other. Finally, simulated results of fatigue crack growth in various residual stress fields are well compared with test results, so that the proposed model may provide an effective tool to simulate UIT-process in engineering structures.

  6. Systematics of Structural, Phase Stability, and Cohesive Properties of η'-Cu6(Sn,In)5 Compounds Occurring in In-Sn/Cu Solder Joints

    Science.gov (United States)

    Ramos, S. B.; González Lemus, N. V.; Deluque Toro, C. E.; Cabeza, G. F.; Fernández Guillermet, A.

    2017-07-01

    Motivated by the high solubility of In in ( mC44) η'-Cu6Sn5 compound as well as the occurrence of an In-doped η'-intermetallic in the microstructure of Cu/In-Sn/Cu solder joints, a theoretical study has been carried out to investigate the various physical effects of incorporating In at Sn Wyckoff sites of the binary η'-phase. Systematic ab initio calculations using the projected augmented wave method and Vienna Ab initio Simulation Package were used to determine the composition dependence of the structural and cohesive properties of η'-Cu6(Sn,In)5 compounds, compared with those expected from the binary end-member compounds Cu6Sn5 and Cu6In5. The molar volume shows significant deviations from Vegard's law. The predicted composition dependence of the cohesive properties is discussed using two complementary approaches, viz. a valence-electron density approach as well as a bond-number approach, both accounting for the roughly linear dependence of the cohesive energy on the In content. A microscopic interpretation for this general trend is given in terms of the key contributions to chemical bonding in this class of compounds, namely Cu d-electron overlap and hybridization of Cu d-states with In and Sn p-electron states. Moreover, a crystallographic site approach is developed to accurately establish the phase-stabilizing effect of incorporating In at specific Wyckoff positions of the ( mC44) η'-Cu6Sn5 structure.

  7. Effect of pulsed current welding on fatigue behaviour of high strength aluminium alloy joints

    International Nuclear Information System (INIS)

    Balasubramanian, V.; Ravisankar, V.; Madhusudhan Reddy, G.

    2008-01-01

    High strength aluminium alloys (Al-Zn-Mg-Cu alloys) have gathered wide acceptance in the fabrication of light weight structures requiring high strength-to weight ratio, such as transportable bridge girders, military vehicles, road tankers and railway transport systems. The preferred welding processes of high strength aluminium alloy are frequently gas tungsten arc welding (GTAW) process and gas metal arc welding (GMAW) process due to their comparatively easier applicability and better economy. Weld fusion zones typically exhibit coarse columnar grains because of the prevailing thermal conditions during weld metal solidification. This often results inferior weld mechanical properties and poor resistance to hot cracking. In this investigation, an attempt has been made to refine the fusion zone grains by applying pulsed current welding technique. Rolled plates of 6 mm thickness have been used as the base material for preparing single pass welded joints. Single V butt joint configuration has been prepared for joining the plates. The filler metal used for joining the plates is AA 5356 (Al-5Mg (wt%)) grade aluminium alloy. Four different welding techniques have been used to fabricate the joints and they are: (i) continuous current GTAW (CCGTAW), (ii) pulsed current GTAW (PCGTAW), (iii) continuous current GMAW (CCGMAW) and (iv) pulsed current GMAW (PCGMAW) processes. Argon (99.99% pure) has been used as the shielding gas. Fatigue properties of the welded joints have been evaluated by conducting fatigue test using rotary bending fatigue testing machine. Current pulsing leads to relatively finer and more equi-axed grain structure in gas tungsten arc (GTA) and gas metal arc (GMA) welds. In contrast, conventional continuous current welding resulted in predominantly columnar grain structures. Grain refinement is accompanied by an increase in fatigue life and endurance limit

  8. Very High Cycle Fatigue Crack Initiation Mechanism in Nugget Zone of AA 7075 Friction Stir Welded Joint

    Directory of Open Access Journals (Sweden)

    Chao He

    2017-01-01

    Full Text Available Very high cycle fatigue behavior of nugget zone in AA 7075 friction stir welded joint was experimentally investigated using ultrasonic fatigue testing system (20 kHz to clarify the crack initiation mechanism. It was found that the fatigue strength of nugget zone decreased continuously even beyond 107 cycles with no traditional fatigue limits. Fatigue cracks initiated from the welding defects located at the bottom side of the friction stir weld. Moreover, a special semicircular zone could be characterized around the crack initiation site, of which the stress intensity factor approximately equaled the threshold of fatigue crack propagation rate. Finally, a simplified model was proposed to estimate the fatigue life by correlating the welding defect size and applied stress. The predicted results are in good agreement with the experimental results.

  9. Multifrequency Eddy Current Inspection of Corrosion in Clad Aluminum Riveted Lap Joints and Its Effect on Fatigue Life

    Science.gov (United States)

    Okafor, A. C.; Natarajan, S.

    2007-03-01

    Aging aircraft are prone to corrosion damage and fatigue cracks in riveted lap joints of fuselage skin panels. This can cause catastrophic failure if not detected and repaired. Hence detection of corrosion damage and monitoring its effect on structural integrity are essential. This paper presents multifrequency eddy current (EC) inspection of corrosion damage and machined material loss defect in clad A1 2024-T3 riveted lap joints and its effect on fatigue life. Results of eddy current inspection, corrosion product removal and fatigue testing are presented.

  10. Multifrequency Eddy Current Inspection of Corrosion in Clad Aluminum Riveted Lap Joints and Its Effect on Fatigue Life

    International Nuclear Information System (INIS)

    Okafor, A. C.; Natarajan, S.

    2007-01-01

    Aging aircraft are prone to corrosion damage and fatigue cracks in riveted lap joints of fuselage skin panels. This can cause catastrophic failure if not detected and repaired. Hence detection of corrosion damage and monitoring its effect on structural integrity are essential. This paper presents multifrequency eddy current (EC) inspection of corrosion damage and machined material loss defect in clad A1 2024-T3 riveted lap joints and its effect on fatigue life. Results of eddy current inspection, corrosion product removal and fatigue testing are presented

  11. Effect of residual stress on fatigue crack propagation at 200 C in a welded joint austenitic stainless steel - ferritic steel

    International Nuclear Information System (INIS)

    Zahouane, A.I.; Gauthier, J.P.; Petrequin, P.

    1988-01-01

    Fatigue resistance of heterogeneous welded joints between austenitic stainless steels and ferritic steels is evaluated for reactor components and more particularly effect of residual stress on fatigue crack propagation in a heterogeneous welded joint. Residual stress is measured by the hole method in which a hole is drilled through the center of a strain gage glued the surface of the materials. In the non uniform stress field a transmissibility function is used for residual stress calculation. High compression residual stress in the ferritic metal near the interface ferritic steel/weld slow down fatigue crack propagation. 5 tabs., 15 figs., 19 refs [fr

  12. Aluminum 6060-T6 friction stir welded butt joints: fatigue resistance with different tools and feed rates

    International Nuclear Information System (INIS)

    Baragetti, S.; D'Urso, G.

    2014-01-01

    The fatigue behavior of AA6060-T6 friction stir welded butt joints was investigated. The joints were produced by using both a standard and a threaded tri-flute cylindrical-tool with flat shoulder. The friction stir welding process was carried out using different feed rates. Preliminary tensile tests, micrograph analyses and hardness profile measurements across the welds were carried out. Welded and unwelded fatigue samples were tested under axial loading (R = 0.1) with upper limits of 10 4 and 10 5 cycles, using threaded and unthreaded (standard) tools at different feed rates. The best tensile and fatigue performance was obtained using the standard tool at low feed rate.

  13. Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn-Ag-Cu and Sn-Ag Solder Interconnects With and Without Board-Side Ni Surface Finish

    Science.gov (United States)

    Lee, Tae-Kyu; Duh, Jeng-Gong

    2014-11-01

    The combined effects on long-term reliability of isothermal aging and chemically balanced or unbalanced surface finish have been investigated for fine-pitch ball grid array packages with Sn-3.0Ag-0.5Cu (SAC305) (wt.%) and Sn-3.5Ag (SnAg) (wt.%) solder ball interconnects. Two different printed circuit board surface finishes were selected to compare the effects of chemically balanced and unbalanced structure interconnects with and without board-side Ni surface finish. NiAu/solder/Cu and NiAu/solder/NiAu interconnects were isothermally aged and thermally cycled to evaluate long-term thermal fatigue reliability. Weibull plots of the combined effects of each aging condition and each surface finish revealed lifetime for NiAu/SAC305/Cu was reduced by approximately 40% by aging at 150°C; less degradation was observed for NiAu/SAC305/NiAu. Further reduction of characteristic life-cycle number was observed for NiAu/SnAg/NiAu joints. Microstructure was studied, focusing on its evolution near the board and package-side interfaces. Different mechanisms of aging were apparent under the different joint configurations. Their effects on the fatigue life of solder joints are discussed.

  14. Effect of Weld Bead Shape on the Fatigue Behavior of GMAW Lap Fillet Joint in GA 590 MPa Steel Sheets

    Directory of Open Access Journals (Sweden)

    Insung Hwang

    2017-09-01

    Full Text Available In this study, the effect of weld bead shape on the fatigue strength of lap fillet joints using the gas metal arc welding (GMAW process was investigated. The base material used in the experiment was 590 MPa grade galvanealed steel sheet with 2.3 mm and 2.6 mm thickness. In order to make the four types of weld beads with different shapes by factors such as length, angle, and area, the welding process, wire feeding speed, and joint shape were changed. The stress-number of cycles to failure (S–N curve and fatigue strength were obtained from the fatigue test for four types of weld bead, and the cause of the fatigue strength difference was clarified through the analysis of the geometrical factors, such as length, angle, and area of the weld bead. In addition, the relationship between weld bead shape and fatigue strength was discussed.

  15. Soldering of copper-clad niobium--titanium superconductor composite

    International Nuclear Information System (INIS)

    Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

    1977-04-01

    When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

  16. Fatigue affects peak joint torque angle in hamstrings but not in quadriceps.

    Science.gov (United States)

    Coratella, Giuseppe; Bellin, Giuseppe; Beato, Marco; Schena, Federico

    2015-01-01

    Primary aim of this study was to investigate peak joint torque angle (i.e. the angle of peak torque) changes recorded during an isokinetic test before and after a fatiguing soccer match simulation. Secondarily we want to investigate functional Hecc:Qconc and conventional Hconc:Qconc ratio changes due to fatigue. Before and after a standardised soccer match simulation, twenty-two healthy male amateur soccer players performed maximal isokinetic strength tests both for hamstrings and for quadriceps muscles at 1.05 rad · s(‒1), 3.14 rad · s(‒1) and 5.24 rad · s(‒1). Peak joint torque angle, peak torque and both functional Hecc:Qconc and conventional Hconc:Qconc ratios were examined. Both dominant and non-dominant limbs were tested. Peak joint torque angle significantly increased only in knee flexors. Both eccentric and concentric contractions resulted in such increment, which occurred in both limbs. No changes were found in quadriceps peak joint torque angle. Participants experienced a significant decrease in torque both in hamstrings and in quadriceps. Functional Hecc:Qconc ratio was lower only in dominant limb at higher velocities, while Hconc:Qconc did not change. This study showed after specific fatiguing task changes in hamstrings only torque/angle relationship. Hamstrings injury risk could depend on altered torque when knee is close to extension, coupled with a greater peak torque decrement compared to quadriceps. These results suggest the use eccentric based training to prevent hamstrings shift towards shorter length.

  17. The numerical high cycle fatigue damage model of fillet weld joint under weld-induced residual stresses

    Science.gov (United States)

    Nguyen Van Do, Vuong

    2018-04-01

    In this study, a development of nonlinear continuum damage mechanics (CDM) model for multiaxial high cycle fatigue is proposed in which the cyclic plasticity constitutive model has been incorporated in the finite element (FE) framework. T-joint FE simulation of fillet welding is implemented to characterize sequentially coupled three-dimensional (3-D) of thermo-mechanical FE formulation and simulate the welding residual stresses. The high cycle fatigue damage model is then taken account into the fillet weld joints under the various cyclic fatigue load types to calculate the fatigue life considering the residual stresses. The fatigue crack initiation and the propagation in the present model estimated for the total fatigue is compared with the experimental results. The FE results illustrated that the proposed high cycle fatigue damage model in this study could become a powerful tool to effectively predict the fatigue life of the welds. Parametric studies in this work are also demonstrated that the welding residual stresses cannot be ignored in the computation of the fatigue life of welded structures.

  18. Effect of weld metal properties on fatigue crack growth behaviour of gas tungsten arc welded AISI 409M grade ferritic stainless steel joints

    International Nuclear Information System (INIS)

    Shanmugam, K.; Lakshminarayanan, A.K.; Balasubramanian, V.

    2009-01-01

    The effect of filler metals such as austenitic stainless steel, ferritic stainless steel and duplex stainless steel on fatigue crack growth behaviour of the gas tungsten arc welded ferritic stainless steel joints was investigated. Rolled plates of 4 mm thickness were used as the base material for preparing single 'V' butt welded joints. Centre cracked tensile (CCT) specimens were prepared to evaluate fatigue crack growth behaviour. Servo hydraulic controlled fatigue testing machine was used to evaluate the fatigue crack growth behaviour of the welded joints. From this investigation, it was found that the joints fabricated by duplex stainless steel filler metal showed superior fatigue crack growth resistance compared to the joints fabricated by austenitic and ferritic stainless steel filler metals. Higher yield strength, hardness and relatively higher toughness may be the reasons for superior fatigue performance of the joints fabricated by duplex stainless steel filler metal.

  19. Local strain energy density for the fatigue assessment of hot dip galvanized welded joints: some recent outcomes

    Directory of Open Access Journals (Sweden)

    M. Peron

    2017-10-01

    Full Text Available Since in literature only data about the effect of the hot-dip galvanizing coating on fatigue behavior of unnotched specimens are available, whereas very few for notched components and none for welded joints, the aim of this paper is to partially fill this lack of knowledge comparing fatigue strength of uncoated and hot-dip galvanized fillet welded cruciform joints made of structural steel S355 welded joints, subjected to a load cycle R = 0. 34. The results are shown in terms of stress range ?s and of the averaged strain energy density range DW in a control volume of radius R0 = 0.28 mm

  20. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Directory of Open Access Journals (Sweden)

    Saliza Azlina O.

    2016-01-01

    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  1. Joint excitation synchronization characteristics of fatigue test for offshore wind turbine blade

    Science.gov (United States)

    Zhang, Lei-an; Yu, Xiang-yong; Wei, Xiu-ting; Liu, Wei-sheng

    2018-02-01

    In the case of the stiffness of offshore wind turbine blade is relatively large, the joint excitation device solves the problem of low accuracy of bending moment distribution, insufficient driving ability and long fatigue test period in single-point loading. In order to study the synchronous characteristics of joint excitation system, avoid blade vibration disturbance. First, on the base of a Lagrange equation, a mathematical model of combined excitation is formulated, and a numerical analysis of vibration synchronization is performed. Then, the model is constructed via MATLAB/Simulink, and the effect of the phase difference on the vibration synchronization characteristics is obtained visually. Finally, a set of joint excitation platform for the fatigue test of offshore wind turbine blades are built. The parameter measurement scheme is given and the correctness of the joint excitation synchronization in the simulation model is verified. The results show that when the rotational speed difference is 2 r/min, 30 r/min, the phase difference is 0, π/20, π/8 and π/4, as the rotational speed difference and the phase difference increase, the time required for the blade to reach a steady state is longer. When the phase difference is too large, the electromechanical coupling can no longer make the joint excitation device appear self-synchronizing phenomenon, so that the value of the phase difference develops toward a fixed value (not equal to 0), and the blade vibration disorder is serious, at this time, the effect of electromechanical coupling must be eliminated. The research results provide theoretical basis for the subsequent decoupling control algorithm and synchronization control strategy, and have good application value.

  2. Joint excitation synchronization characteristics of fatigue test for offshore wind turbine blade

    Directory of Open Access Journals (Sweden)

    Lei-an Zhang

    2018-02-01

    Full Text Available In the case of the stiffness of offshore wind turbine blade is relatively large, the joint excitation device solves the problem of low accuracy of bending moment distribution, insufficient driving ability and long fatigue test period in single-point loading. In order to study the synchronous characteristics of joint excitation system, avoid blade vibration disturbance. First, on the base of a Lagrange equation, a mathematical model of combined excitation is formulated, and a numerical analysis of vibration synchronization is performed. Then, the model is constructed via MATLAB/Simulink, and the effect of the phase difference on the vibration synchronization characteristics is obtained visually. Finally, a set of joint excitation platform for the fatigue test of offshore wind turbine blades are built. The parameter measurement scheme is given and the correctness of the joint excitation synchronization in the simulation model is verified. The results show that when the rotational speed difference is 2 r/min, 30 r/min, the phase difference is 0, π/20, π/8 and π/4, as the rotational speed difference and the phase difference increase, the time required for the blade to reach a steady state is longer. When the phase difference is too large, the electromechanical coupling can no longer make the joint excitation device appear self-synchronizing phenomenon, so that the value of the phase difference develops toward a fixed value (not equal to 0, and the blade vibration disorder is serious, at this time, the effect of electromechanical coupling must be eliminated. The research results provide theoretical basis for the subsequent decoupling control algorithm and synchronization control strategy, and have good application value.

  3. A structural health monitoring fastener for tracking fatigue crack growth in bolted metallic joints

    Science.gov (United States)

    Rakow, Alexi Schroder

    Fatigue cracks initiating at fastener hole locations in metallic components are among the most common form of airframe damage. The fastener hole site has been surveyed as the second leading initiation site for fatigue related accidents of fixed wing aircraft. Current methods for inspecting airframes for these cracks are manual, whereby inspectors rely on non-destructive inspection equipment or hand-held probes to scan over areas of a structure. Use of this equipment often demands disassembly of the vehicle to search appropriate hole locations for cracks, which elevates the complexity and cost of these maintenance inspections. Improved reliability, safety, and reduced cost of such maintenance can be realized by the permanent integration of sensors with a structure to detect this damage. Such an integrated system of sensors would form a structural health monitoring (SHM) system. In this study, an Additive, Interleaved, Multi-layer Electromagnetic (AIME) sensor was developed and integrated with the shank of a fastener to form a SHM Fastener, a new SHM technology targeted at detection of fastener hole cracks. The major advantages of the SHM Fastener are its installation, which does not require joint layer disassembly, its capability to detect inner layer cracks, and its capability to operate in a continuous autonomous mode. Two methods for fabricating the proposed SHM Fastener were studied. The first option consisted of a thin flexible printed circuit film that was bonded around a thin metallic sleeve placed around the fastener shank. The second option consisted of coating sensor materials directly to the shank of a part in an effort to increase the durability of the sensor under severe loading conditions. Both analytical and numerical models were developed to characterize the capability of the sensors and provide a design tool for the sensor layout. A diagnostic technique for crack growth monitoring was developed to complete the SHM system, which consists of the

  4. A novel method for direct solder bump pull testing using lead-free solders

    Science.gov (United States)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  5. Effects of Ni{sub 3}Sn{sub 4} and (Cu,Ni){sub 6}Sn{sub 5} intermetallic layers on cross-interaction between Pd and Ni in solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Baek, Yong-Ho [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of); Division of Advanced Circuit Interconnect, Samsung Electro-Mechanics Co., Ltd., Suwon 443-743 (Korea, Republic of); Chung, Bo-Mook [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of); Department of Research and Development, KPM TECH, Ansan 425-090 (Korea, Republic of); Choi, Young-Sik [Division of Advanced Circuit Interconnect, Samsung Electro-Mechanics Co., Ltd., Suwon 443-743 (Korea, Republic of); Choi, Jaeho [Department of Advanced Metal and Materials Engineering, Gangneung-Wonju National University, Gangneung 210-702 (Korea, Republic of); Huh, Joo-Youl, E-mail: jyhuh@korea.ac.kr [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of)

    2013-12-05

    alleviate the (Pd,Ni)Sn{sub 4}-related degradation of solder joint reliability.

  6. Low-cycle fatigue of welded joints of alloy AMg5

    International Nuclear Information System (INIS)

    Modestova, R.V.; Borisenko, V.A.; Parfenova, I.N.; Stepanov, S.V.

    1986-01-01

    The authors study the low-cycle fatigue of welded joints of aluminum alloy AMg5 in order to determine the cyclic strength coefficient of welded seams. Tests were carried out on cylindrical specimens of the parent metal, welded specimens, and models of welded vessels. The average values of mechanical properties of the specimens and the parent metal are shown. It is shown that when designing welded vessels of aluminum alloy AMg5, the permissible amplitudes of conventional compressive stresses are recommended to be determined as the lower of the two values calculated using the equations presented

  7. Welding simulation and fatigue assessment of tubular K-joints in high-strength steel

    International Nuclear Information System (INIS)

    Zamiri Akhlaghi, F.

    2014-01-01

    Application of newly developed high strength steel hollow sections is increasing in construction industry – especially for bridge structures – due to their satisfactory material properties and fabrication advantages. These sections allow for longer spans, more slender structures. Savings in weight and volume of material compared to traditional steel grades increase sustainability of construction and compensate for part of higher unit cost of material. Nevertheless, use of high strength steels cannot be promoted unless potential fatigue issues are properly addressed. Two fabrication methods are currently available for the planar Warren trusses made of circular hollow sections (CHS): welding the tubes together, or using cast steel nodes and connecting truss members to them by girth welds. Previous research on tubular bridge trusses indicates that the problematic fatigue cracking sites for the first fabrication method are located at weld toes in the gap region of the truss joints. For the second method, cracking occurs at the root of CHS–cast butt welds. Fatigue performance of these two methods were investigated by constant amplitude fatigue testing of two full scale trusses made of steel grade S690QH and with a geometry similar to previous S355J2H investigation. Fatigue lives of K-joints were in agreement with current recommended code values. For CHS–cast welded connections, no visible cracking was observed up to 2£10"6 cycles. Due to the effect of residual stresses, fatigue cracking was observed in compressive joints as well as tensile joints. Indeed, tensile welding residual stresses keep the crack open during all or part of the compressive load cycle. Their distribution and impact on fatigue life of tubular joints has not been fully investigated before for a complex detail such as Tubular K-joint made of high strength steel. Experimental and numerical methods were utilized for assessment of welding residual stresses. Neutron diffraction experiments were

  8. Fatigue Crack Growth Characteristics of Cold Stretched STS 304 Welded Joint

    Energy Technology Data Exchange (ETDEWEB)

    Lee, Jeong Won; Na, Seong Hyeon; Yoon, Dong Hyun; Kim, Jae Hoon [Chungnam Nat’l Univ., Daejeon (Korea, Republic of); Kim, Young Kyun; Kim, Ki Dong [Korea Gas Coporation R& D Division, Daejeon (Korea, Republic of)

    2017-09-15

    STS 304 steel is used as pressure vessel material, and although it exhibits excellent mechanical characteristics at a low temperature, it is heavier than other materials. To address this issue, a method using cold-stretching techniques for STS 304 can be applied. In this study, a cold-stretching part and welded joint specimen were directly obtained from a cold-stretching pressure vessel manufactured according to ASME code. Fatigue crack propagation tests were carried out at room temperature and -170℃ using the compliance method for stress ratios of 0.1 and 0.5. The results indicate that crack growth rate of the welded joint is higher than that of the cold-stretching part within the same stress intensity factor range. The outcome of this work is expected to serve as a basis for the development of a cold-stretched STS 304 pressure vessel.

  9. Evaluation of local deformation behavior accompanying fatigue damage in F82H welded joint specimens by using digital image correlation

    International Nuclear Information System (INIS)

    Nakata, Toshiya; Tanigawa, Hiroyasu

    2012-01-01

    Highlights: ► In tensile, the TIG welded joint material was concentrated in the THAZ. ► In tensile, fracture occurred at the point where the axial strain converged. ► In fatigue, fracture occurred at the point where the Max. shear strain converged. ► Many macrocracks and cavities formed in the FGHAZ and THAZ of the cross section. - Abstract: By using digital image correlation, the deformation behaviors of local domains of F82H joint specimens welded using tungsten inert gas (TIG) and electron beam (EB) welding were evaluated during tensile and fatigue testing. In the tensile test specimens, the tensile strength decreased in the TIG-welded joints, and ductility decreased in both the EB- and TIG-welded joints. Because axial strain increased in the tempered heat-affected zone (HAZ) and led to the fracture of the TIG-welded joint, the strength was considered to have decreased because of welding. In fatigue testing, the number of cycles to fracture for the welded joint decreased to less than 40–60% of that for the base metal. For both fracture specimens, the largest value of shear strain was observed in the region approximately between the fine-grained HAZ and tempered HAZ; this shear strain ultimately led to fracture. Cavities and macrocracks were observed in the fine-grained HAZ and tempered HAZ in the cross sections of the fracture specimens, and geometrical damage possibly resulted in the reduction of fatigue lifetime.

  10. Texture, microstructure, and fractal features of the low-cycle fatigue failure of the metal in pipeline welded joints

    Science.gov (United States)

    Usov, V. V.; Gopkalo, E. E.; Shkatulyak, N. M.; Gopkalo, A. P.; Cherneva, T. S.

    2015-09-01

    Crystallographic texture and fracture features are studied after low-cycle fatigue tests of laboratory specimens cut from the base metal and the characteristic zones of a welded joint in a pipeline after its longterm operation. The fractal dimensions of fracture surfaces are determined. The fractal dimension is shown to increase during the transition from ductile to quasi-brittle fracture, and a relation between the fractal dimension of a fracture surface and the fatigue life of the specimen is found.

  11. Rate of fatigue crack growth in residual stress fields of welded titanium joints with different contents of embrittling impurities

    International Nuclear Information System (INIS)

    Troshchenko, V.T.; Pokrovskij, V.V.; Yarusevich, V.L.; Mikhajlov, V.I.; Sher, V.A.

    1990-01-01

    Resistance to fatigue crack growth (FCG) has been studied in welded joints of structural titanium alloys contaminated by embrittling impurities. Besides, effect of crack closing has been taken into account what makes it possible to determine the effective coefficient of the stress intensity. The rate of fatigue crack growth is proved to considerably depend on the value and direction of residual stresses. The rate dependence of FCG in welded joints of structural titanium alloys on the swing of effective coefficient of stress intensity is invariant to the value and direction of weld residual stresses

  12. Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2018-04-01

    Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

  13. The lack of penetration effect on fatigue crack propagation resistance of atmospheric corrosion resistant steel welded joints

    International Nuclear Information System (INIS)

    Martins, Geraldo de Paula; Cimini Junior, Carlos Alberto; Godefroid, Leonardo Barbosa

    2005-01-01

    The welding process introduces defects on the welded joints, as lack of fusion and penetration, porosity, between others. These defects can compromise the structures or components, relative to the crack propagation. This engagement can be studied by fatigue crack propagation tests. The efficiency of the structure, when submitted to a cyclic loading can be evaluated by these tests. The aim of this work is to study the behavior of welded joints containing defects as lack of penetration at the root or between welding passes relative to crack propagation resistance properties, and to compare these properties with the properties of the welded joints without defects. This study was accomplished from fatigue crack propagation test results, in specimens containing lack of penetration between welding passes. With the obtained results, the Paris equation coefficients and exponents that relate the crack propagation rate with the stress intensity cyclic factor for welded joints with and without defects were obtained. (author)

  14. Influence of rivet to sheet edge distance on fatigue strength of self-piercing riveted aluminium joints

    OpenAIRE

    Li, Dezhi; Han, Li; Thornton, Martin; Shergold, Mike

    2012-01-01

    Self-piercing riveting (SPR) is one of the main joining methods for lightweight aluminium automotive body structures due to its advantages. In order to further optimise the structure design and reduce the weight but without compromising strength, reduction of redundant materials in the joint flange area can be considered. For this reason, the influence of rivet to sheet edge distance on the fatigue strengths of self-piercing riveted joints was studied. Five edge distances, 5 mm, 6 mm, 8 mm, 1...

  15. Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy

    Science.gov (United States)

    Tikale, Sanjay; Prabhu, K. Narayan

    2018-05-01

    The effect of Al2O3 nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al2O3 nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (T L) and melting temperature range of the SAC305 solder alloy by addition of Al2O3 nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al2O3 nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu6Sn5 IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy.

  16. Reliability of Pb free solder alloys. Physical and mechanical properties; Pb free handa no shinraisei. Butsuri kikaiteki shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Sanji, M; Yoshino, M; Ishikawa, J; Takenaka, O [Denso Corp., Aichi (Japan)

    1997-10-01

    Properties of 19 different Pb free solders have been evaluated in comparison with Sn-37Pb eutectic solder. Pb free solders without Bi were on the same level as Sn-37Pb in tensile strength and elongation, and those with Bi had higher strength and lower elongation than Sn-37Pb. As the Bi content increased, strength was higher, and elongation was lower. In torsion fatigue tests, fatigue life of Pb free solders without Bi was longer than Sn-37Pb. The relationships of Coffin-Manson rule and Basquin rule with fatigue life was applicable to Pb free solder. Fatigue life of those is inferred from their tensile strength. 7 refs., 13 figs., 1 tab.

  17. Evaluation of Kinesiophobia and Its Correlations with Pain and Fatigue in Joint Hypermobility Syndrome/Ehlers-Danlos Syndrome Hypermobility Type

    Directory of Open Access Journals (Sweden)

    Claudia Celletti

    2013-01-01

    Full Text Available Ehlers-Danlos syndrome hypermobility type a. k. a. joint hypermobility syndrome (JHS/EDS-HT is a hereditary musculoskeletal disorder associating generalized joint hypermobility with chronic pain. Anecdotal reports suggest a prominent role for kinesiophobia in disease manifestations, but no study has systematically addressed this point. Objective. To investigate the impact of kinesiophobia and its relationship with pain, fatigue, and quality of life in JHS/EDS-HT. Design. Cross-sectional study. Subjects/Patients. 42 patients (40 female and 2 male with JHS/EDS-HT diagnosis following standardized diagnostic criteria were selected. Methods. Disease features were analyzed by means of specific questionnaires and scales evaluating kinesiophobia, pain, fatigue, and quality of life. The relationships among variables were investigated using the Spearman bivariate analysis. Results. Kinesiophobia resulted predominantly in the patients’ sample. The values of kinesiophobia did not correlate with intensity of pain, quality of life, and (or the single component of fatigue. A strong correlation was discovered between kinesiophobia and general severity of fatigue. Conclusions. In JHS/EDS-HT, the onset of pain-avoiding strategies is related to the presence of pain but not to its intensity. The clear-cut correlation between kinesiophobia and severity of fatigue suggests a direct link between musculoskeletal pain and fatigue. In JHS/EDS-HT, the underlying mechanism is likely to be facilitated by primary disease characteristics, including hypotonia.

  18. Experimental and Numerical Investigations of Fretting Fatigue Behavior for Steel Q235 Single-Lap Bolted Joints

    Directory of Open Access Journals (Sweden)

    Yazhou Xu

    2016-01-01

    Full Text Available This work aims to investigate the fretting fatigue life and failure mode of steel Q235B plates in single-lap bolted joints. Ten specimens were prepared and tested to fit the S-N curve. SEM (scanning electron microscope was then employed to observe fatigue crack surfaces and identify crack initiation, crack propagation, and transient fracture zones. Moreover, a FEM model was established to simulate the stress and displacement fields. The normal contact stress, tangential contact stress, and relative slipping displacement at the critical fretting zone were used to calculate FFD values and assess fretting fatigue crack initiation sites, which were in good agreement with SEM observations. Experimental results confirmed the fretting fatigue failure mode for these specimens. It was found that the crack initiation resulted from wear regions at the contact surfaces between plates, and fretting fatigue cracks occurred at a certain distance away from hole edges. The proposed FFD-N relationship is an alternative approach to evaluate fretting fatigue life of steel plates in bolted joints.

  19. Fatigue

    Science.gov (United States)

    ... sleep. Fatigue is a lack of energy and motivation. Drowsiness and apathy (a feeling of not caring ... Call your provider right away if you have any of the following: Confusion or dizziness Blurred vision Little or no urine, or recent ...

  20. Reactor cooling water expansion joint bellows: The role of the seam weld in fatigue crack development

    International Nuclear Information System (INIS)

    West, S.L.; Nelson, D.Z.; Louthan, M.R. Jr.

    1992-01-01

    The secondary cooling water system pressure boundary of Savannah River Site reactors includes expansion joints utilizing a thin-wall bellows. While successfully used for over thirty years, an occasional replacement has been required because of the development of small, circumferential fatigue cracks in a bellows convolute. One such crack was recently shown to have initiated from a weld heat-affected zone liquation microcrack. The crack, initially open to the outer surface of the rolled and seam welded cylindrical bellows section, was closed when cold forming of the convolutes placed the outer surface in residual compression. However, the bellows was placed in tension when installed, and the tensile stresses reopened the microcrack. This five to eight grain diameter microcrack was extended by ductile fatigue processes. Initial extension was by relatively rapid propagation through the large-grained weld metal, followed by slower extension through the fine-grained base metal. A significant through-wall crack was not developed until the crack extended into the base metal on both sides of the weld. Leakage of cooling water was subsequently detected and the bellows removed and a replacement installed

  1. Experimental Study on Variable-Amplitude Fatigue of Welded Cross Plate-Hollow Sphere Joints in Grid Structures

    Directory of Open Access Journals (Sweden)

    Jin-Feng Jiao

    2018-01-01

    Full Text Available The fatigue stress amplitude of the welded cross plate-hollow sphere joint (WCPHSJ in a grid structure varies due to the random loading produced by suspending cranes. A total of 14 specimens considering three different types of WCPHSJs were prepared and tested using a specially designed test rig. Four typical loading conditions, “low-high,” “high-low,” “low-high-low,” and “high-low-high,” were first considered in the tests to investigate the fatigue behavior under variable load amplitudes, followed by metallographic analyses. The experimental and metallographic analysis results provide a fundamental understanding on the fatigue fracture form and fatigue mechanism of WCPHSJs. Based on the available data from constant-amplitude fatigue tests, the variable-amplitude fatigue life of the three types of WCPHSJs was estimated using the Miner rule and Corten-Dolan theory. Since both accumulative damage theories yield virtually same damaging results, the Miner rule is hence suggested to estimate the fatigue life of WCPHSJs.

  2. High temperature soldering of graphite

    International Nuclear Information System (INIS)

    Anikin, L.T.; Kravetskij, G.A.; Dergunova, V.S.

    1977-01-01

    The effect is studied of the brazing temperature on the strength of the brazed joint of graphite materials. In one case, iron and nickel are used as solder, and in another, molybdenum. The contact heating of the iron and nickel with the graphite has been studied in the temperature range of 1400-2400 ged C, and molybdenum, 2200-2600 deg C. The quality of the joints has been judged by the tensile strength at temperatures of 2500-2800 deg C and by the microstructure. An investigation into the kinetics of carbon dissolution in molten iron has shown that the failure of the graphite in contact with the iron melt is due to the incorporation of iron atoms in the interbase planes. The strength of a joint formed with the participation of the vapour-gas phase is 2.5 times higher than that of a joint obtained by graphite recrystallization through the carbon-containing metal melt. The critical temperatures are determined of graphite brazing with nickel, iron, and molybdenum interlayers, which sharply increase the strength of the brazed joint as a result of the formation of a vapour-gas phase and deposition of fine-crystal carbon

  3. Fatigue limits of titanium-bar joints made with the laser and the electric resistance welding techniques: microstructural characterization and hardness properties.

    Science.gov (United States)

    Degidi, Marco; Nardi, Diego; Morri, Alessandro; Sighinolfi, Gianluca; Tebbel, Florian; Marchetti, Claudio

    2017-09-01

    Fatigue behavior of the titanium bars is of utmost importance for the safe and reliable operation of dental implants and prosthetic constructions based on these implants. To date, however, only few data are available on the fatigue strength of dental prostheses made with electric resistance welding and laser welding techniques. This in-vitro study highlighted that although the joints made with the laser welding approach are credited of a superior tensile strength, joints made with electric resistance welding exhibited double the minimum fatigue strength with respect to the joints made with laser welding (120 vs 60 N).

  4. Influence of Thermal Aging on Tensile and Low Cycle Fatigue Behavior of Type 316LN Austenitic Stainless Steel Weld Joint

    Science.gov (United States)

    Suresh Kumar, T.; Nagesha, A.; Ganesh Kumar, J.; Parameswaran, P.; Sandhya, R.

    2018-05-01

    Influence of short-term thermal aging on the low-cycle fatigue (LCF) behavior of 316LN austenitic stainless steel weld joint with 0.07 wt pct N has been investigated. Prior thermal exposure was found to improve the fatigue life compared with the as-welded condition. Besides, the treatment also imparted a softening effect on the weld metal, leading to an increase in the ductility of the weld joint which had a bearing on the cyclic stress response. The degree of cyclic hardening was seen to increase after aging. Automated ball-indentation (ABI) technique was employed toward understanding the mechanical properties of individual zones across the weld joint. It was observed that the base metal takes most of the applied cyclic strain during LCF deformation in the as-welded condition. In the aged condition, however, the weld also participates in the cyclic deformation. The beneficial effect of thermal aging on cyclic life is attributed to a reduction in the severity of the metallurgical notch leading to a restoration of ductility of the weld region. The transformation of δ-ferrite to σ-phase during the aging treatment was found to influence the location of crack initiation. Fatigue cracks were found to initiate in the base metal region of the joint in most of the testing conditions. However, embrittlement in the weld metal caused a shift in the point of crack initiation with increasing strain amplitude under LCF.

  5. Effect of welding processes and consumables on fatigue crack growth behaviour of armour grade quenched and tempered steel joints

    Directory of Open Access Journals (Sweden)

    G. Magudeeswaran

    2014-03-01

    Full Text Available Quenched and Tempered (Q&T steels are widely used in the construction of military vehicles due to its high strength to weight ratio and high hardness. These steels are prone to hydrogen induced cracking (HIC in the heat affected zone (HAZ after welding. The use of austenitic stainless steel (ASS consumables to weld the above steel was the only available remedy because of higher solubility for hydrogen in austenitic phase. The use of stainless steel consumables for a non-stainless steel base metal is not economical. Hence, alternate consumables for welding Q&T steels and their vulnerability to HIC need to be explored. Recent studies proved that low hydrogen ferritic steel (LHF consumables can be used to weld Q&T steels, which can give very low hydrogen levels in the weld deposits. The use of ASS and LHF consumables will lead to distinct microstructures in their respective welds. This microstructural heterogeneity will have a drastic influence in the fatigue crack growth resistance of armour grade Q&T steel welds. Hence, in this investigation an attempt has been made to study the influence of welding consumables and welding processes on fatigue crack growth behaviour of armour grade Q&T Steel joints. Shielded metal arc welding (SMAW and Flux cored arc welding (FCAW were used for fabrication of joints using ASS and LHF consumables. The joints fabricated by SMAW process using LHF consumable exhibited superior fatigue crack growth resistance than all other joints.

  6. Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

    Science.gov (United States)

    Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

    2017-10-01

    Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

  7. Characterization of lead-free solders for electronic packaging

    Science.gov (United States)

    Ma, Hongtao

    The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

  8. Development of a soft-soldering system for aluminum

    Science.gov (United States)

    Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

    1983-03-01

    The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

  9. Effect of sex and fatigue on muscle stiffness and musculoarticular stiffness of the knee joint in a young active population.

    Science.gov (United States)

    Wang, Dan; De Vito, Giuseppe; Ditroilo, Massimiliano; Delahunt, Eamonn

    2017-08-01

    The purpose of this study was to investigate the influence of sex and fatigue on knee extensor peak torque (PT), muscle stiffness (MS) of the vastus lateralis (VL) and knee joint musculoarticular stiffness (MAS) in young adults. Twenty-two male and 22 female recreational athletes participated. Males were characterised by higher relaxed [pre-: males 364.43 (52.00) N · m -1 , females 270.27 (37.25) N · m -1 ; post-: males 446.75 (83.27) N · m -1 , females 307.39 (38.58) N · m -1 ] and contracted [pre-: males 495.07 (71.04) N · m -1 , females 332.34 (85.42) N · m -1 ; post-: males 546.37 (90.74) N · m -1 , females 349.21 (85.55) N · m -1 ] MS of the VL, and knee joint MAS [pre-: males 1450.11 (507.98) N · m -1 , females 1027.99 (227.33) N · m -1 ; post-: males 1345.81 (404.90) N · m -1 , females 952.78 (192.38) N · m -1 ] than females pre- and post-fatigue. A similar finding was observed in pre-fatigue normalised knee extensor PT [pre-: males 2.77 (0.42) N · m kg -1 , females 2.41 (0.40) N · m kg -1 , post-: males 2.53 (0.54) N · m kg -1 , females 2.26 (0.44) N · m kg -1 ]. After the fatigue protocol, normalised knee extensor PT and knee joint MAS decreased, whilst relaxed and contracted MS of the VL increased in both sexes. These observed differences may contribute to the higher risk of knee injury in females and following the onset of fatigue.

  10. Lamb wave-based damage quantification and probability of detection modeling for fatigue life assessment of riveted lap joint

    Science.gov (United States)

    He, Jingjing; Wang, Dengjiang; Zhang, Weifang

    2015-03-01

    This study presents an experimental and modeling study for damage detection and quantification in riveted lap joints. Embedded lead zirconate titanate piezoelectric (PZT) ceramic wafer-type sensors are employed to perform in-situ non-destructive testing during fatigue cyclical loading. A multi-feature integration method is developed to quantify the crack size using signal features of correlation coefficient, amplitude change, and phase change. In addition, probability of detection (POD) model is constructed to quantify the reliability of the developed sizing method. Using the developed crack size quantification method and the resulting POD curve, probabilistic fatigue life prediction can be performed to provide comprehensive information for decision-making. The effectiveness of the overall methodology is demonstrated and validated using several aircraft lap joint specimens from different manufactures and under different loading conditions.

  11. Effect of micromorphology at the fatigue crack tip on the crack growth in electron beam welded Ti-6Al-4V joint

    International Nuclear Information System (INIS)

    Tao, Junhui; Hu, Shubing; Ji, Longbo

    2016-01-01

    In this paper, we describe experiments on welded joints of Ti-6Al-4V alloy specimens exhibiting fatigue characteristics in the base metal (BM), hot affected zone (HAZ) and fuse zone (FZ). The effect of micromorphology on crack propagation at the tip of the fatigue crack in joints formed by electron beam welding was investigated using an optical microscope, transmission electron microscope and other methodologies. The results demonstrated that the fatigue crack originated in and propagated along α/β boundaries in the BM. In the HAZ, the fatigue crack occurred at the boundary between martensite laths, and propagated through most irregular-equiaxed α phases and a few martensite laths. In the FZ, the fatigue crack originated at the boundaries between the fine crushing phases among martensite laths, and propagated along a majority of α/β boundaries and several narrow martensite laths. The electron beam welded joint of Ti-6Al-4V alloy showed instances of zigzag fatigue cracks that increased in degree from lowest in the HAZ, moderate in the FZ to greatest in the BM. Conversely, fatigue crack growth rate (FCGR) was greatest in the HAZ, less in the FZ and slowest in the BM. - Highlights: •Ti-6Al-4V welded joint exhibits different fatigue characteristics. •The fatigue crack propagates along α/β boundaries in the BM. •The fatigue crack propagates through α phases and martensite laths in the HAZ. •The fatigue crack propagates along α/β boundaries and martensite laths in the FZ. •Fatigue crack growth rate is fastest in the HAZ, less in the FZ, slowest in the BM.

  12. New And Existing Bridge Constructions - Increase of Fatigue Strength of Welded Joints by High Frequency Mechanical Impact Treatment

    Directory of Open Access Journals (Sweden)

    Ummenhofer Thomas

    2013-07-01

    Full Text Available Numerous studies at KIT prove that high frequency mechanical impact (HFMI treatment is an efficient method for increasing the fatigue strength of welded steel structures. Within different research projects it was found that HFMI-methods can be used successfully for new and existing structures in order to extend the fatigue life. This paper gives an overview of the current status of existing steel bridges in Germany regarding aspects like bridge age distributions and traffic loads. Based on that overview welded joints susceptible to fatigue failure are identified. Using component-like small scale specimens, HFMI-methods were investigated within the objective of implementing an effective application for new and existing structures. Applying the fatigue test data observed, existing design proposals are evaluated and design recommendations for HFMI-treated joints are given. As a result of the research work, a transfer into practice has been realized and different applications are illustrated using the example of bridge constructions made of steel.

  13. Estimation of Fatigue Life of Laser Welded AISI304 Stainless Steel T-Joint Based on Experiments and Recommendations in Design Codes

    DEFF Research Database (Denmark)

    Lambertsen, Søren Heide; Damkilde, Lars; Kristensen, Anders Schmidt

    2013-01-01

    In this paper the fatigue behavior of laser welded T-joints of stainless steel AISI304 is investigated experimentally. In the fatigue experiments 36 specimens with a sheet thickness of 1 mm are exposed to one-dimensional cyclic loading. Three different types of specimens are adopted. Three groups...

  14. Thermal fatigue equipment to test joints of materials for high heat flux components

    International Nuclear Information System (INIS)

    Visca, E.; Libera, S.; Orsini, A.; Riccardi, B.; Sacchetti, M.

    2000-01-01

    The activity, carried out in the framework of an ITER divertor task, was aimed at defining a suitable method in order to qualify junctions between armour materials and heat sink of plasma-facing components (PFCs) mock-ups. An equipment able to perform thermal fatigue testing by electrical heating and active water-cooling was constructed and a standard for the sample was defined. In this equipment, during operation cycles, two samples are heated by thermal contact up to a relevant temperature value (350 deg. C) and then the water flow is switched on, thus producing fast cooling with time constants and gradients close to the real operating conditions. The equipment works with a test cycle of about 60 s and is suitable for continuous operation. A complete test consists of about 10000 cycles. After the assembling, the equipment and the control software were optimized to obtain a good reliability. Preliminary tests on mock-ups with flat CFC tiles joined to copper heat sink were performed. Finite-elements calculations were carried out in order to estimate the value of the thermal stresses arising close to the joint under the transient conditions that are characteristic of this equipment

  15. Joint-position sense is altered by football pre-participation warm-up exercise and match induced fatigue.

    Science.gov (United States)

    Salgado, Eduardo; Ribeiro, Fernando; Oliveira, José

    2015-06-01

    The demands to which football players are exposed during the match may augment the risk of injury by decreasing the sense of joint position. This study aimed to assess the effect of pre-participation warm-up and fatigue induced by an official football match on the knee-joint-position sense of football players. Fourteen semi-professional male football players (mean age: 25.9±4.6 years old) volunteered in this study. The main outcome measures were rate of perceived exertion and knee-joint-position sense assessed at rest, immediately after a standard warm-up (duration 25 min), and immediately after a competitive football match (90 minutes duration). Perceived exertion increased significantly from rest to the other assessments (rest: 8.6±2.0; after warm-up: 12.1±2.1; after football match: 18.5±1.3; pfootball match compared to both rest (pfootball match-induced fatigue. Warm-up exercises could contribute to knee injury prevention, whereas the deleterious effect of match-induced fatigue on the sensorimotor system could ultimately contribute to knee instability and injury. Copyright © 2014 Elsevier B.V. All rights reserved.

  16. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Science.gov (United States)

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  17. Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

    Science.gov (United States)

    Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

    2004-04-01

    Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

  18. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Fan Yang

    2016-01-01

    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  19. Experience with the Notch Stress Approach for Fatigue Assessment of Welded Joints

    DEFF Research Database (Denmark)

    Pedersen, Mikkel Melters; Mouritsen, Ole Ø.; Hansen, Michael Rygaard

    2010-01-01

    In this paper, fatigue assessment using the notch stress approach is discussed based on re-analysis of many fatigue test results and experience from practical application. Three topics are treated; evaluation of the fatigue strength for as-welded details (FAT225) in the notch stress system......, problems regarding assessment of mild-SCF details and a novel proposal for extension of the notch stress approach for use with post-weld treated details....

  20. Leg joint power output during progressive resistance FES-LCE cycling in SCI subjects: developing an index of fatigue

    Directory of Open Access Journals (Sweden)

    Faghri Pouran D

    2008-04-01

    Full Text Available Abstract Background The purpose of this study was to investigate the biomechanics of the hip, knee and ankle during a progressive resistance cycling protocol in an effort to detect and measure the presence of muscle fatigue. It was hypothesized that knee power output can be used as an indicator of fatigue in order to assess the cycling performance of SCI subjects. Methods Six spinal cord injured subjects (2 incomplete, 4 complete between the ages of twenty and fifty years old and possessing either a complete or incomplete spinal cord injury at or below the fourth cervical vertebra participated in this study. Kinematic data and pedal forces were recorded during cycling at increasing levels of resistance. Ankle, knee and hip power outputs and resultant pedal force were calculated. Ergometer cadence and muscle stimulation intensity were also recorded. Results The main findings of this study were: (a ankle and knee power outputs decreased, whereas hip power output increased with increasing resistance, (b cadence, stimulation intensity and resultant pedal force in that combined order were significant predictors of knee power output and (c knowing the value of these combined predictors at 10 rpm, an index of fatigue can be developed, quantitatively expressing the power capacity of the knee joint with respect to a baseline power level defined as fatigue. Conclusion An index of fatigue was successfully developed, proportionalizing knee power capacity during cycling to a predetermined value of fatigue. The fatigue index value at 0/8th kp, measured 90 seconds into active, unassisted pedaling was 1.6. This indicates initial power capacity at the knee to be 1.6 times greater than fatigue. The fatigue index decreased to 1.1 at 2/8th kp, representing approximately a 30% decrease in the knee's power capacity within a 4 minute timespan. These findings suggest that the present cycling protocol is not sufficient for a rider to gain the benefits of FES and thus

  1. Leg joint power output during progressive resistance FES-LCE cycling in SCI subjects: developing an index of fatigue.

    Science.gov (United States)

    Haapala, Stephenie A; Faghri, Pouran D; Adams, Douglas J

    2008-04-26

    The purpose of this study was to investigate the biomechanics of the hip, knee and ankle during a progressive resistance cycling protocol in an effort to detect and measure the presence of muscle fatigue. It was hypothesized that knee power output can be used as an indicator of fatigue in order to assess the cycling performance of SCI subjects. Six spinal cord injured subjects (2 incomplete, 4 complete) between the ages of twenty and fifty years old and possessing either a complete or incomplete spinal cord injury at or below the fourth cervical vertebra participated in this study. Kinematic data and pedal forces were recorded during cycling at increasing levels of resistance. Ankle, knee and hip power outputs and resultant pedal force were calculated. Ergometer cadence and muscle stimulation intensity were also recorded. The main findings of this study were: (a) ankle and knee power outputs decreased, whereas hip power output increased with increasing resistance, (b) cadence, stimulation intensity and resultant pedal force in that combined order were significant predictors of knee power output and (c) knowing the value of these combined predictors at 10 rpm, an index of fatigue can be developed, quantitatively expressing the power capacity of the knee joint with respect to a baseline power level defined as fatigue. An index of fatigue was successfully developed, proportionalizing knee power capacity during cycling to a predetermined value of fatigue. The fatigue index value at 0/8th kp, measured 90 seconds into active, unassisted pedaling was 1.6. This indicates initial power capacity at the knee to be 1.6 times greater than fatigue. The fatigue index decreased to 1.1 at 2/8th kp, representing approximately a 30% decrease in the knee's power capacity within a 4 minute timespan. These findings suggest that the present cycling protocol is not sufficient for a rider to gain the benefits of FES and thus raises speculation as to whether or not progressive resistance

  2. Residual stress evaluation and fatigue life prediction in the welded joint by X-ray diffraction

    International Nuclear Information System (INIS)

    Yoo, Keun Bong; Kim, Jae Hoon

    2009-01-01

    In the fossil power plant, the reliability of the components which consist of the many welded parts depends on the quality of welding. The residual stress is occurred by the heat flux of high temperature during weld process. This decreases the mechanical properties as the strength of fatigue and fracture or occurs the stress corrosion cracking and fatigue fracture. The residual stress of the welded part in the recently constructed power plants has been the cause of a variety of accidents. The objective of this study is measurement of the residual stress by X-ray diffraction method and to estimate the feasibility of this application for fatigue life assessment of the high-temperature pipeline. The materials used for the study is P92 steel for the use of high temperature pipe on super critical condition. The test results were analyzed by the distributed characteristics of residual stresses and the Full Width at Half Maximum intensity (FWHM) in x-ray diffraction intensity curve. Also, X-ray diffraction tests using specimens simulated low cycle fatigue damage were performed in order to analyze fatigue properties when fatigue damage conditions become various stages. As a result of X-ray diffraction tests for specimens simulated fatigue damages, we conformed that the ratio of the FWHM due to fatigue damage has linear relationship with fatigue life ratio algebraically. From this relationships, it was suggested that direct expectation of the life consumption rate was feasible.

  3. Evaluation of taper joints with combined fatigue and crevice corrosion testing: Comparison to human explanted modular prostheses

    Energy Technology Data Exchange (ETDEWEB)

    Reclaru, L., E-mail: lucien.reclaru@pxgroup.com [PX Group S.A., Dep R and D Corrosion and Biocompatibility Group, Bd. des Eplatures 42, CH-2304 La Chaux-de-Fonds (Switzerland); Brooks, R.A. [Orthopaedic Research, Addenbrooke' s Hospital, University of Cambridge, Box 180 Hills Road, CB2 0QQ Cambridge (United Kingdom); Zuberbühler, M. [Smith and Nephew Orthopaedics AG, Schachenalle 29, 5001 Aarau (Switzerland); Eschler, P.-Y.; Constantin, F. [PX Group S.A., Dep R and D Corrosion and Biocompatibility Group, Bd. des Eplatures 42, CH-2304 La Chaux-de-Fonds (Switzerland); Tomoaia, G. [University of Medicine and Pharmacy Iuliu Hateganu of Cluj-Napoca, Dept. of Orthopaedics and Traumatology, Cluj-Napoca (Romania)

    2014-01-01

    The requirement for revision surgery of total joint replacements is increasing and modular joint replacement implants have been developed to provide adjustable prosthetic revision systems with improved intra-operative flexibility. An electrochemical study of the corrosion resistance of the interface between the distal and proximal modules of a modular prosthesis was performed in combination with a cyclic fatigue test. The complexity resides in the existence of interfaces between the distal part, the proximal part, and the dynamometric screw. A new technique for evaluating the resistance to cyclic dynamic corrosion with crevice stimulation was used and the method is presented. In addition, two components of the proximal module of explanted Ti6Al4V and Ti6Al7Nb prostheses were investigated by optical and electron microscopy. Our results reveal that: The electrolyte penetrates into the interface between the distal and proximal modules during cyclic dynamic fatigue tests, the distal module undergoes cracking and corrosion was generated at the interface between the two models; The comparison of the explanted proximal parts with the similar prostheses evaluated following cyclic dynamic crevice corrosion testing showed that there were significant similarities indicating that this method is suitable for evaluating materials used in the fabrication of modular prostheses. - Highlights: • Electrochemical crevice corrosion testing combined with fatigue test conducted on Ti6Al7Nb and Ti6Al4V modular prostheses • Cations released from integral prostheses • Comparison of human explanted modular prostheses with the similar prostheses evaluated in cyclic dynamic crevice corrosion.

  4. Account of residual stress effect in estimation of the period of fatigue crack initiation and propagation in joints with poor penetration

    International Nuclear Information System (INIS)

    Babaev, A.V.; Knysh, V.V.; Labunskaya, N.F.

    1985-01-01

    Dependences permitting to determine by calculation method the duration of the stage of fatigue crack propagation in joints with poor penetration and residual stresses are obtained on the basis of criteria of fracture mechanics. It gives a possibility to estimate the resource of these joints using the calculation-experimental method

  5. Fatigue de-bond growth in adhesively bonded single lap joints

    Indian Academy of Sciences (India)

    3Department of Aerospace Engineering, Indian Institute of Science,. Bangalore 560012 ... experimental work, specimens were fabricated and fatigue de-bond growth tests were conducted at a ... such as the stress intensity factor, are related to fatigue crack growth. ..... American Society for Testing and Materials, Philadelphia.

  6. Design rule for fatigue of welded joints in elevated-temperature nuclear components

    International Nuclear Information System (INIS)

    O'Connor, D.G.; Corum, J.M.

    1986-01-01

    Elevated-temperature weldment fatigue failures have occurred in several operating liquid-metal reactor plants. Yet, ASME Code Case N-47, which governs the design of such plants in the United States, does not currently address the Code Subgroup on Elevated Temperature Design recently proposed a fatigue strength reduction factor for austenitic and ferritic steel weldments. The factor is based on a variety of weld metal and weldment fatigue data generated in the United States, Europe, and Japan. This paper describes the factor and its bases, and it presents the results of confirmatory fatigue tests conducted at Oak Ridge National Laboratory on 316 stainless steel tubes with axial and circumferential welds of 16-8-2 filler metal. These test results confirm the suitability of the design factor, and they support the premise that the metallurgical notch effect produced by yield strength variations across a weldment is largely responsible for the observed elevated-temperature fatigue strength reduction

  7. Low Cycle Fatigue Behavior of Alloy 617 Base Metal and Welded Joints at Room Temperature and 850 .deg. C for VHTR Applications

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Seon Jin; Dew, Rando T. [Pukyong National Univ., Busan (Korea, Republic of); Kim, Woo Gon; Kim, Min Hwan [Korea Atomic Energy Research Institute, Daejeon (Korea, Republic of)

    2015-05-15

    Low cycle fatigue (LCF) is an important design consideration for high temperature IHX components. Moreover, some of the components are joined by welding techniques and therefore the welded joints are unavoidable in the construction of mechanical structures. Since Alloy 617 was introduced in early 1970s, many attempts have been made in the past two decades to evaluate the LCF and creep-fatigue behavior in Alloy 617 base metal at room temperature and high temperature. However, little research has focused on the evaluation and characterization of the Alloy 617 welded joints. butt-welded joint specimens was performed at room temperature and 850 .deg. C. Fatigue lives of GTAW welded joint specimens were lower than those of base metal specimens. LCF cracking and failure in welded specimens initiated in the weld metal zone and followed transgranluar dendritic paths for both at RT and 850 .deg. C.

  8. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    CERN Document Server

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

    2015-01-01

    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  9. Stress and fatigue analysis for lower joint of control rod drive mechanisms seal house

    International Nuclear Information System (INIS)

    Shao Xuejiao; Zhang Liping; Du Juan; Xie Hai

    2013-01-01

    Two kinds of seal houses for control rod drive mechanisms which have different thickness of the lower seal ring was analyzed for its stress and fatigue by finite element method. In the fatigue computation, all the transitions were grouped into several groups, and then the elastoplastic strain correction factor was modified by analyzing thermal and mechanical load separately referring the rules of RCC-M 2002. The results show that the structure with thicker seal ring behaves more safely than the other one except in the second condition. Meanwhile, the amplify of the primary and secondary stress as well as fatigue usage factor can be reduced by regrouping the transients. The precision of fatigue usage factor can be elevated using modified K e when the amplify of the primary and secondary stress is large to some extent produced by both thermal and mechanical loads. (authors)

  10. Exercise-induced muscle fatigue in the unaffected knee joint and its influence on postural control and lower limb kinematics in stroke patients

    Directory of Open Access Journals (Sweden)

    Sun Wook Park

    2017-01-01

    Full Text Available This study aimed to investigate the effects of exercise-induced muscle fatigue in the unaffected knee joint on postural control and kinematic changes in stroke patients. Forty participants (20 stroke patients, 20 age-matched healthy participants were recruited. To induce fatigue, maximum voluntary isometric contractions were performed in the unaffected knee joint in a Leg Extension Rehab exercise machine using the pneumatic resistance. We measured static and dynamic balance and lower-limb kinematics during gait. Changes in postural control parameters anteroposterior sway speed and total center of pressure distance differed significantly between the stroke and control groups. In addition, changes in gait kinematic parameters knee and ankle angles of initial contact differed significantly between stroke (paretic and non-paretic and control groups. Muscle fatigue in the unaffected knee and ankle impaired postural control and debilitates kinematic movement of ipsilateral and contralateral lower limbs, and may place the fatigued stroke patients at greater risk for falls.

  11. Soldering of Nanotubes onto Microelectrodes

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing sold...... bonds were consistently found to be mechanically stronger than the carbon nanotubes.......Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...

  12. Intergranular stress corrosion in soldered joints of stainless steel 304.; Corrosion intergranular bajo esfuerzo en uniones soldadas de acero inoxidable 304

    Energy Technology Data Exchange (ETDEWEB)

    Zamora R, L [Instituto Nacional de Investigaciones Nucleares, Mexico City (Mexico)

    1994-12-31

    The intergranular stress cracking of welded joints of austenitic stainless steel, AISI 304, is a serious problem in BWR type reactors. It is associated with the simultaneous presence of three factors; stress, a critical media and sensibilization (DOS). EPR technique was used in order to verify the sensibilization degree in the base metal, and the zone affected by heat and welding material. The characterization of material was done. The objective of this work is the study of microstructure and the evaluation of EPR technique used for the determination of DOS in a welded plate of austenitic stainless steel AISI 304. (Author).

  13. Fatigue life evaluation based on welding residual stress relaxation and notch strain approach for cruciform welded joint

    International Nuclear Information System (INIS)

    Han, Jeong Woo; Han, Seung Ho; Shin, Byung Chun; Kim, Jae Hoon

    2003-01-01

    The fatigue strength of welded joint is influenced by the welding residual stress which is relaxed depending on local stress distributed in vicinity of stress raisers, eg. under cut, overlap and blow hole. To evaluate its fatigue life the geometry of the stress raisers and the welding residual stress should be taken into account. The several methods based on notch strain approach have been proposed in order to consider the two factors above mentioned. These methods, however, have shown considerable differences between analytical and experimental results. It is due to the fact that the amount of the relaxed welding residual stress evaluated by the cyclic stress-strain relationship do not correspond with that occurred in reality. In this paper the residual stress relaxation model based on experimental results was used in order to reduce the discrepancy of the estimated amount of the relaxed welding residual stress. Under an assumption of the superimposition of the relaxed welding residual stress and the local stress, a modified notch strain approach was proposed and verified to the cruciform welded joint

  14. Statistical investigation of the crack initiation lives of piping structural welded joint in low cycle fatigue test of 240 degree C

    International Nuclear Information System (INIS)

    Zhao Yongxiang; Gao Qing; Cai Lixun

    1999-01-01

    A statistical investigation into the fitting of four possible fatigue assumed distributions (three parameter Weibull, two parameter Weibull, lognormal and extreme maximum value distributions) for the crack initiation lives of piping structural welded joint in low cycle fatigue test of 240 degree C is performed by linear regression and least squares methods. The results reveal that the three parameters Weibull distribution may give misleading results in fatigue reliability analysis because the shape parameter is often less than 1. This means that the failure rate decreases with fatigue cycling which is contrary to the general understanding of the behaviour of welded joint. Reliability analyses may also affected by the slightly nonconservative evaluations in tail regions of this distribution. The other three distributions are slightly poor in the total fit effects, but they can be safety assumed in reliability analyses due to the non-conservative evaluations in tail regions mostly and the consistency with the fatigue physics of the structural behaviour of welded joint in the range of engineering practice. In addition, the extreme maximum value distribution is in good consists with the general physical understanding of the structural behaviour of welded joint

  15. Low-cycle fatigue of welded joints: coupled initiation propagation model

    International Nuclear Information System (INIS)

    Madi, Yazid; Recho, Naman; Matheron, Philippe

    2004-01-01

    This paper deals with the low-cycle fatigue (LC) design of welded structures, the aim being the critical analysis of the rule used in the RCC-MR [Design and construction rules for mechanical components of FBR nuclear islands, AFCEN, 1993], for the design and construction of fast breeder reactors. The study takes into account the evolution of the material behavior laws and damage accumulation during the fatigue loading. The adopted model consists of analyzing separately the behavior and the damage evolutions. It allows us to determine the damage ratio corresponding to initiation and propagation of a significant crack in order to determine the life duration. This model suggests the existence of a threshold level of loading, above which micro-cracks initiate. The initiation fatigue life can then be neglected below the threshold level. This work shows also that the RCC-MR rules are valid below this threshold load level

  16. Computed vs. conventional radiography for detecting fatigue cracks in riveted lap joints of aeronautical grade hybrid fiber-metal laminate Glare

    International Nuclear Information System (INIS)

    Tarpani, J.R.; Hideki Shinohara, A.; Da Silva, R.R.; Do Val Lacerda, N.

    2007-01-01

    This study aimed at assessing the capability of three different radiographic approaches (two computed or digital, and one conventional or analogous) for imaging fatigue cracks in riveted lap joints of composite fiber-metal laminate Glare. These structural joints are unique in the sense that fatigue cracks develop mainly at the faying surfaces of Glare sheets, so that visual detection is largely prevented and nondestructive inspection becomes mandatory. For this purpose, a round-robin programme comprising several industrial and research centers that employ X-ray radiography routinely to inspect high-demanding equipments, components and structures was conducted. (authors)

  17. The Effect of Weld Reinforcement and Post-Welding Cooling Cycles on Fatigue Strength of Butt-Welded Joints under Cyclic Tensile Loading.

    Science.gov (United States)

    Araque, Oscar; Arzola, Nelson; Hernández, Edgar

    2018-04-12

    This research deals with the fatigue behavior of butt-welded joints, by considering the geometry and post-welding cooling cycles, as a result of cooling in quiet air and immersed in water. ASTM A-36 HR structural steel was used as the base metal for the shielded metal arc welding (SMAW) process with welding electrode E6013. The welding reinforcement was 1 mm and 3 mm, respectively; axial fatigue tests were carried out to determine the life and behavior in cracks propagation of the tested welded joints, mechanical characterization tests of properties in welded joints such as microhardness, Charpy impact test and metallographic analysis were carried out. The latter were used as input for the analysis by finite elements which influence the initiation and propagation of cracks and the evaluation of stress intensity factors (SIF). The latter led to obtaining the crack propagation rate and the geometric factor. The tested specimens were analyzed, by taking photographs of the cracks at its beginning in order to make a count of the marks at the origin of the crack. From the results obtained and the marks count, the fatigue crack growth rate and the influence of the cooling media on the life of the welded joint are validated, according to the experimental results. It can be concluded that the welded joints with a higher weld reinforcement have a shorter fatigue life. This is due to the stress concentration that occurs in the vicinity of the weld toe.

  18. Fatigue resistance of welded joints in aluminium high-speed craft : A total stress concept

    NARCIS (Netherlands)

    Den Besten, J.H.

    2015-01-01

    Crew transfers, surveillance duties and {security, rescue, interception} operations at sea typically require high-speed craft. Aluminium is quite often selected as hull structure material because of its weight save potential in comparison to steel. The fatigue strength, however, may become a point

  19. Probabilistic model for fatigue crack growth and fracture of welded joints in civil engineering structures

    NARCIS (Netherlands)

    Maljaars, J.; Steenbergen, H.M.G.M.; Vrouwenvelder, A.C.W.M.

    2012-01-01

    This paper presents a probabilistic assessment model for linear elastic fracture mechanics (LEFM). The model allows the determination of the failure probability of a structure subjected to fatigue loading. The distributions of the random variables for civil engineering structures are provided, and

  20. EFECTO DE LA ALTURA DEL MANGUITO EN UNIONES SOLDADAS EN CAÑERÍAS DE COBRE BUSHING HEIGHT EFFECT IN SOLDERED COPPER PIPE JOINTS

    Directory of Open Access Journals (Sweden)

    Víctor Carmona

    2006-12-01

    Full Text Available Se perforó un tubo de cobre de 28,6 mm de diámetro, por el proceso de taladrado por fluencia térmica (TFT. Se prepararon manguitos de diferentes alturas, haciendo un preperforado con brocas convencionales HSS de diferentes diámetros. Se seleccionaron manguitos de dos alturas diferentes. Se determinó la circularidad de la perforación. Se soldó un tubo cobre de ø 12,7 mm en forma perpendicular a un tubo de cobre de ø 28,6 mm y se determinó la resistencia a la tracción de la unión soldada, para lo cual se diseñó un dispositivo mecánico que fue adaptado en la máquina universal de ensayos. Se hicieron ensayos de microdureza y metalografía de la unión. Se concluyó que el manguito de menor altura es suficiente para que la unión alcance la máxima resistencia.Copper tubes were drilled with thermal flow drilling. Conventional HSS drills diameters were used to make pre drilling holes. Different height bushings were made. Two of the bushing heights were selected. The bushing circularity was measured. A ø 12,7 mm tube was welded perpendicularly on a ø 28,6 mm tube. A especial support device was designed and it was adapted to the Universal Test Machine, to determine the tensile stress of the brazing joint. The micro hardness and metallographic test were made in the brazing zone. As a conclusion the lower height bushing is enough to reach the maximum resistance.

  1. Effects of neuromuscular fatigue on perceptual-cognitive skills between genders in the contribution to the knee joint loading during side-stepping tasks.

    Science.gov (United States)

    Khalid, Abdul Jabbar; Harris, Sujae Ian; Michael, Loke; Joseph, Hamill; Qu, Xingda

    2015-01-01

    This study investigated whether neuromuscular fatigue affects the neuromuscular control of an athlete within a sports context setting and whether these effects were more pronounced in the females. Lower limb joint kinetics of 6 male and 6 female inter-varsity soccer players performing side-stepping tasks in non-fatigue versus fatigue and anticipated versus unanticipated conditions were quantified using 10 Motion Analysis Corporation cameras and a Kistler(™) force platform. The Yo-Yo intermittent recovery Level 1 fatigue protocol was employed. Stance foot initial contact and peak forces, and peak joint knee moments of the lower limb were submitted to a 3-way mixed-model repeated measure ANOVA. The results suggested that males tend to elicit significantly higher knee joint loadings when fatigued. In addition, males elicited significantly higher peak proximal tibia anterior/posterior shear force, vertical ground reaction force at initial contact and peak internal rotational moments than females. These findings suggested that males were at greater overall injury risk than females, especially in the sagittal plane. Neuromuscular control-based training programmes/interventions that are designed to reduce the risk of the non-contact ACL injury need to be customised for the different genders.

  2. Stretching and joint mobilization exercises reduce call-center operators' musculoskeletal discomfort and fatigue

    Directory of Open Access Journals (Sweden)

    Denise Helena de Castro Lacaze

    2010-01-01

    Full Text Available AIM: We sought to evaluate musculoskeletal discomfort and mental and physical fatigue in the call-center workers of an airline company before and after a supervised exercise program compared with rest breaks during the work shift. INTRODUCTION: This was a longitudinal pilot study conducted in a flight-booking call-center for an airline in São Paulo, Brazil. Occupational health activities are recommended to decrease the negative effects of the call-center working conditions. In practice, exercise programs are commonly recommended for computer workers, but their effects have not been studied in call-center operators. METHODS: Sixty-four call-center operators participated in this study. Thirty-two subjects were placed into the experimental group and attended a 10-min daily exercise session for 2 months. Conversely, 32 participants were placed into the control group and took a 10-min daily rest break during the same period. Each subject was evaluated once a week by means of the Corlett-Bishop body map with a visual analog discomfort scale and the Chalder fatigue questionnaire. RESULTS: Musculoskeletal discomfort decreased in both groups, but the reduction was only statistically significant for the spine and buttocks (p=0.04 and the sum of the segments (p=0.01 in the experimental group. In addition, the experimental group showed significant differences in the level of mental fatigue, especially in questions related to memory Rienzo, #181ff and tiredness (p=0.001. CONCLUSIONS: Our preliminary results demonstrate that appropriately designed and supervised exercise programs may be more efficient than rest breaks in decreasing discomfort and fatigue levels in call-center operators.

  3. A Study on Fatigue Design Automation of Plug- and Ring-type Gas-welded Joints of STS301L Taking Welded Residual Stress into Account

    International Nuclear Information System (INIS)

    Baek, Seung yeb; Yun, Ki Ho

    2010-01-01

    This paper presents a fatigue design method for plug- and ring-type gas-welded joints, which takes into account the effects of welding residual stress. To develop this method, we simulated the gas-welding process by performing nonlinear finite element analysis (FEA) To validate the FEA results, numerically calculated residual stresses in the gas welds were then compared with experimental results obtained by the hole-drilling method. To evaluate the fatigue strength of plug- and ring-type gas-welded joints influenced by welding residual stresses, the use of stress amplitude (σ a )R, which includes the welding residual stress in gas welds, is proposed (σ a )R on the basis of a modified Goodman equation that includes the residual stress effects. Using the stress amplitude (σ a )R at the hot spot point of gas weld, the relations obtained as the fatigue test results for plug and ring type gas welded joints having various dimensions and shapes were systematically rearranged to obtain the (σ a )R-N f relationship. It was found that more systematic and accurate evaluation of the fatigue strength of plug- and ring-type gas-welded joints can be achieved by using (σ a )R

  4. Fatigue performance of matching and dissimilar joints in aluminium alloys 5083-H111 and 6061-T651 after fully automatic pulsed GAMW using ER5356 filler wire

    CSIR Research Space (South Africa)

    Mutombo, K

    2010-08-31

    Full Text Available The tensile strength and fatigue properties of Al5083-H111 welded with aluminium-magnesium alloyed ER5356 filler wire appeared similar to those of the base metal. This joint failed in the weld metal as a result of a slight reduction in hardness...

  5. Influence of stress relieve heat treatment on fatigue crack propagation in structural steel resistant to atmospheric corrosion welded joints

    Energy Technology Data Exchange (ETDEWEB)

    Martins, Geraldo de Paula; Villela, Jefferson Jose; Rabello, Emerson Giovani [Centro de Desenvolvimento da Tecnologia Nuclear (CDTN/CNEN-MG), Belo Horizonte, MG (Brazil)]. E-mails: gpm@cdtn.br; jjv@cdtn.br; egr@cdtn.br; Cimini Junior, Carlos Alberto[Universidade Federal de Minas Gerais (UFMG), Belo Horizonte, MG (Brazil). Dept. de Engenharia Mecanica]. E-mail: cimini@demet.ufmg.br; Godefroid, Leonardo Barbosa [Universidade Federal de Ouro Preto (UFOP), MG (Brazil). Dept. de Metalurgia]. E-mails: leonardo@demet.em.ufop.br

    2007-07-01

    In this work, the influence of stress relieve heat treatment (SRHT) on the fatigue crack propagation in USI-SAC 50 structural welded joints at the heat affected zone (HAZ) region was studied. Hardness measurements before and after the SRHT were made and crack propagation tests in specimens as welded (AW) and in specimens that were submitted to SRHT, which were accomplished. A reduction in hardness at the regions of HAZ and melted zone (MZ) after the SRHT were observed. It were also verified that the crack propagation rates (da/dN) versus DK on the specimens AW presented regions of retardation on the crack propagation rate, and in the specimens that were submitted to SRHT the crack propagation rate were homogeneous. (author)

  6. The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

    Science.gov (United States)

    Jang, Guh-Yaw; Duh, Jenq-Gong

    2005-01-01

    The eutectic Sn-Ag solder alloy is one of the candidates for the Pb-free solder, and Sn-Pb solder alloys are still widely used in today’s electronic packages. In this tudy, the interfacial reaction in the eutectic Sn-Ag and Sn-Pb solder joints was investigated with an assembly of a solder/Ni/Cu/Ti/Si3N4/Si multilayer structures. In the Sn-3.5Ag solder joints reflowed at 260°C, only the (Ni1-x,Cux)3Sn4 intermetallic compound (IMC) formed at the solder/Ni interface. For the Sn-37Pb solder reflowed at 225°C for one to ten cycles, only the (Ni1-x,Cux)3Sn4 IMC formed between the solder and the Ni/Cu under-bump metallization (UBM). Nevertheless, the (Cu1-y,Niy)6Sn5 IMC was observed in joints reflowed at 245°C after five cycles and at 265°C after three cycles. With the aid of microstructure evolution, quantitative analysis, and elemental distribution between the solder and Ni/Cu UBM, it was revealed that Cu content in the solder near the solder/IMC interface played an important role in the formation of the (Cu1-y,Niy)6Sn5 IMC. In addition, the diffusion behavior of Cu in eutectic Sn-Ag and Sn-Pb solders with the Ni/Cu UBM were probed and discussed. The atomic flux of Cu diffused through Ni was evaluated by detailed quantitative analysis in an electron probe microanalyzer (EPMA). During reflow, the atomic flux of Cu was on the order of 1016-1017 atoms/cm2sec in both the eutectic Sn-Ag and Sn-Pb systems.

  7. Mechanical behaviour of SFR materials: proposition of fatigue weld joint coefficient for MOD9CR-1MO

    International Nuclear Information System (INIS)

    Ancelet, O.; Matheron, Ph.

    2012-01-01

    Mod 9Cr-1Mo steel (T91) is a candidate material for steam generator of SFR (Sodium Fast Reactors). In order to validate this choice, it is necessary, firstly to verify that it is able to withstand the planned environmental and operating conditions, and secondly to check if it is covered by the existing design codes, concerning its procurement, fabrication, welding, examination methods and mechanical design rules. A large R and D program on mod9Cr-1Mo steel has been undertaken at CEA in order to characterize the behavior of this material and of its welded junctions. In this program, the role of the Laboratory for structural Integrity and Standards (LISN) is to develop high temperature defect assessment procedures under fatigue and creep loadings. In this frame, complementary studies are conducted in order to validate the existing methods (developed for the fast reactors) and to get new experimental data on Mod9Cr-1Mo steel. In particular, some new experiments are conducted on specimen with a weld joint and compared with classical experiments on base metal specimen. These results associated with finite element modeling allow to propose a weld joint coefficient at 550 degrees C for the Mod9Cr1Mo steel. (authors)

  8. Fatigue strength of a hybrid joint formed between a PA6-GF60 polymer matrix and a S420MC steel insert

    International Nuclear Information System (INIS)

    Miklavec, M.; Klemenc, J.; Kostanjevec, A.; Fajdiga, M.

    2013-01-01

    Highlights: • Presented is an innovative polymer-metal hybrid joint. • Durability curves and their scatter were calculated using the DASA procedure. • Specimens with the embossed steel insert outperformed in static and dynamic tests. - Abstract: A vehicle’s brake pedal is considered to be one of its most important safety components. In the past, vehicle weight-reduction initiatives resulted in a highly optimized design of steel brake pedal with an increased strength-to-weight ratio. However, any further reduction in the weight of the brake pedal is only possible by using combined, i.e., hybrid, materials. In this case the joint between the two different materials in the hybrid arrangement must be as strong as possible. Many methods for improving the joint between two highly dissimilar materials are known from the literature, but conventional joining techniques lack either the fatigue resistance, because of a poor notch-effect design (shape-based joints), or are unsuitable for low-cost serial production (material-based joints). This article presents an innovative approach to joining the reinforcing insert with a glass-fiber-reinforced polyamide 6 (PA6-GF) base structure, where the reinforcing insert is molded into the PA6-GF. The improved shape of the reinforcing insert contributes the required strength, while the PA6-GF base structure provides the final form of the specimen/product. The innovative shape of the metal insert not only provides the strength of the component; it also ensures the proper joint between the two dissimilar materials. For different types of reinforcing inserts static durability tests as well as fatigue-life tests of the insert-PA6-GF-matrix joints were performed. Our experimental research shows that the most promising shape-based hybrid joints reported in the literature are not the best solution when the hybrid joint’s fatigue life is the decisive criterion for a product’s durability

  9. Fatigue and Damage Tolerance of Friction Stir Welded Joints for Aerospace Applications

    NARCIS (Netherlands)

    Lemmen, H.J.K.

    2010-01-01

    Friction stir welding is a young welding process with high potential to replace riveted joints in aerospace structures like the fuselage. Friction stir welding is a robust process and capable of welding high strength aluminum alloys. Therefore it can lead to both costs and weight savings. To

  10. A multi-feature integration method for fatigue crack detection and crack length estimation in riveted lap joints using Lamb waves

    Science.gov (United States)

    He, Jingjing; Guan, Xuefei; Peng, Tishun; Liu, Yongming; Saxena, Abhinav; Celaya, Jose; Goebel, Kai

    2013-10-01

    This paper presents an experimental study of damage detection and quantification in riveted lap joints. Embedded lead zirconate titanate piezoelectric (PZT) ceramic wafer-type sensors are employed to perform in situ non-destructive evaluation (NDE) during fatigue cyclical loading. PZT wafers are used to monitor the wave reflection from the boundaries of the fatigue crack at the edge of bolt joints. The group velocity of the guided wave is calculated to select a proper time window in which the received signal contains the damage information. It is found that the fatigue crack lengths are correlated with three main features of the signal, i.e., correlation coefficient, amplitude change, and phase change. It was also observed that a single feature cannot be used to quantify the damage among different specimens since a considerable variability was observed in the response from different specimens. A multi-feature integration method based on a second-order multivariate regression analysis is proposed for the prediction of fatigue crack lengths using sensor measurements. The model parameters are obtained using training datasets from five specimens. The effectiveness of the proposed methodology is demonstrated using several lap joint specimens from different manufactures and under different loading conditions.

  11. A multi-feature integration method for fatigue crack detection and crack length estimation in riveted lap joints using Lamb waves

    International Nuclear Information System (INIS)

    He, Jingjing; Guan, Xuefei; Peng, Tishun; Liu, Yongming; Saxena, Abhinav; Celaya, Jose; Goebel, Kai

    2013-01-01

    This paper presents an experimental study of damage detection and quantification in riveted lap joints. Embedded lead zirconate titanate piezoelectric (PZT) ceramic wafer-type sensors are employed to perform in situ non-destructive evaluation (NDE) during fatigue cyclical loading. PZT wafers are used to monitor the wave reflection from the boundaries of the fatigue crack at the edge of bolt joints. The group velocity of the guided wave is calculated to select a proper time window in which the received signal contains the damage information. It is found that the fatigue crack lengths are correlated with three main features of the signal, i.e., correlation coefficient, amplitude change, and phase change. It was also observed that a single feature cannot be used to quantify the damage among different specimens since a considerable variability was observed in the response from different specimens. A multi-feature integration method based on a second-order multivariate regression analysis is proposed for the prediction of fatigue crack lengths using sensor measurements. The model parameters are obtained using training datasets from five specimens. The effectiveness of the proposed methodology is demonstrated using several lap joint specimens from different manufactures and under different loading conditions. (paper)

  12. Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys

    Science.gov (United States)

    Lis, Adrian; Nakanishi, Kohei; Matsuda, Tomoki; Sano, Tomokazu; Minagawa, Madoka; Okamoto, Masahide; Hirose, Akio

    2017-07-01

    Solder joints between leads and printed circuit boards in thin small outline packages were produced with conventional Sn1.0Ag0.7Cu (SAC107) and Sn3.0Ag0.7Cu (SAC305) solders as well as various solder alloys with gradually increasing amounts of Bi (up to 3.0 wt.%) and In (up to 1.0 wt.%) within the SAC107 base solder. The reliability of soldered leads in temperature cycle (TC) tests improved most with solder alloys containing both Bi (1.6 wt.%) and In (0.5 wt.%). Microindentation and electron probe microanalysis mappings revealed that the effect originates from a combination of solution and precipitation strengthening of the initial SAC alloy. The distribution of inelastic strain accumulation (ISA), as a measure for degradation, was determined in the solder joints by finite element calculations. It was shown that defects in the solder proximal to the lead (60-75 μm), which was underpinned by similar cracking characteristics along the lead-solder interface. The ISA was confirmed to be lower in SAC+Bi/In alloys owing to their enhanced elasto-plastic properties. Moreover, the addition of a thin Cu coating on the leads could improve the joint reliability, as suggested by the calculation of the ISA and the acceleration factor.

  13. Probabilistic Fatigue Analysis of Jacket Support Structures for Offshore Wind Turbines Exemplified on Tubular Joints

    OpenAIRE

    Kelma, Sebastian; Schaumann, Peter

    2015-01-01

    The design of offshore wind turbines is usually based on the semi-probabilistic safety concept. Using probabilistic methods, the aim is to find an advanced structural design of OWTs in order to improve safety and reduce costs. The probabilistic design is exemplified on tubular joints of a jacket substructure. Loads and resistance are considered by their respective probability distributions. Time series of loads are generated by fully-coupled numerical simulation of the offshore wind turbine. ...

  14. MICROSTRUCTURE AND FATIGUE PROPERTIES OF DISSIMILAR SPOT WELDED JOINTS OF AISI 304 AND AISI 1008

    Directory of Open Access Journals (Sweden)

    Nachimani Charde

    2013-06-01

    Full Text Available Carbon steel and stainless steel composites are being more frequently used for applications requiring a corrosion resistant and attractive exterior surface and a high strength structural substrate. Spot welding is a potentially useful and efficient jointing process for the production of components consisting of these two materials. The spot welding characteristics of weld joints between these two materials are discussed in this paper. The experiment was conducted on dissimilar weld joints using carbon steel and 304L (2B austenitic stainless steel by varying the welding currents and electrode pressing forces. Throughout the welding process; the electrical signals from the strain sensor, current transducer and terminal voltage clippers are measured in order to understand each and every millisecond of the welding process. In doing so, the dynamic resistances, heat distributions and forging forces are computed for various currents and force levels within the good welds’ regions. The other process controlling parameters, particularly the electrode tip and weld time, remained constant throughout the experiment. The weld growth was noted for the welding current increment, but in the electrode force increment it causes an adverse reaction to weld growth. Moreover, the effect of heat imbalance was clearly noted during the welding process due to the different electrical and chemical properties. The welded specimens finally underwent tensile, hardness and metallurgical testing to characterise the weld growth.

  15. Creep-fatigue evaluation method for weld joint of Mod.9Cr-1Mo steel Part II: Plate bending test and proposal of a simplified evaluation method

    Energy Technology Data Exchange (ETDEWEB)

    Ando, Masanori, E-mail: ando.masanori@jaea.go.jp; Takaya, Shigeru, E-mail: takaya.shigeru@jaea.go.jp

    2016-12-15

    Highlights: • Creep-fatigue evaluation method for weld joint of Mod.9Cr-1Mo steel is proposed. • A simplified evaluation method is also proposed for the codification. • Both proposed evaluation method was validated by the plate bending test. • For codification, the local stress and strain behavior was analyzed. - Abstract: In the present study, to develop an evaluation procedure and design rules for Mod.9Cr-1Mo steel weld joints, a method for evaluating the creep-fatigue life of Mod.9Cr-1Mo steel weld joints was proposed based on finite element analysis (FEA) and a series of cyclic plate bending tests of longitudinal and horizontal seamed plates. The strain concentration and redistribution behaviors were evaluated and the failure cycles were estimated using FEA by considering the test conditions and metallurgical discontinuities in the weld joints. Inelastic FEA models consisting of the base metal, heat-affected zone and weld metal were employed to estimate the elastic follow-up behavior caused by the metallurgical discontinuities. The elastic follow-up factors determined by comparing the elastic and inelastic FEA results were determined to be less than 1.5. Based on the estimated elastic follow-up factors obtained via inelastic FEA, a simplified technique using elastic FEA was proposed for evaluating the creep-fatigue life in Mod.9Cr-1Mo steel weld joints. The creep-fatigue life obtained using the plate bending test was compared to those estimated from the results of inelastic FEA and by a simplified evaluation method.

  16. Creep-fatigue evaluation method for weld joint of Mod.9Cr-1Mo steel Part II: Plate bending test and proposal of a simplified evaluation method

    International Nuclear Information System (INIS)

    Ando, Masanori; Takaya, Shigeru

    2016-01-01

    Highlights: • Creep-fatigue evaluation method for weld joint of Mod.9Cr-1Mo steel is proposed. • A simplified evaluation method is also proposed for the codification. • Both proposed evaluation method was validated by the plate bending test. • For codification, the local stress and strain behavior was analyzed. - Abstract: In the present study, to develop an evaluation procedure and design rules for Mod.9Cr-1Mo steel weld joints, a method for evaluating the creep-fatigue life of Mod.9Cr-1Mo steel weld joints was proposed based on finite element analysis (FEA) and a series of cyclic plate bending tests of longitudinal and horizontal seamed plates. The strain concentration and redistribution behaviors were evaluated and the failure cycles were estimated using FEA by considering the test conditions and metallurgical discontinuities in the weld joints. Inelastic FEA models consisting of the base metal, heat-affected zone and weld metal were employed to estimate the elastic follow-up behavior caused by the metallurgical discontinuities. The elastic follow-up factors determined by comparing the elastic and inelastic FEA results were determined to be less than 1.5. Based on the estimated elastic follow-up factors obtained via inelastic FEA, a simplified technique using elastic FEA was proposed for evaluating the creep-fatigue life in Mod.9Cr-1Mo steel weld joints. The creep-fatigue life obtained using the plate bending test was compared to those estimated from the results of inelastic FEA and by a simplified evaluation method.

  17. Characterization of the microstructure of tin-silver lead free solder

    Energy Technology Data Exchange (ETDEWEB)

    Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

    2016-07-05

    Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

  18. Comparative shear tests of some low temperature lead-free solder pastes

    Science.gov (United States)

    Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

    2016-12-01

    The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

  19. Effects of rework on adhesion of Pb-In soldered gold thick films

    International Nuclear Information System (INIS)

    Gehman, R.W.; Becka, G.A.; Losure, J.A.

    1982-02-01

    The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au 9 In 4 . It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing

  20. Handbook of machine soldering SMT and TH

    CERN Document Server

    Woodgate, Ralph W

    1996-01-01

    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  1. Fatigue strength of the joint between diaphragms and longitudinal ribs in box section girders; Hako danmen keta no diaphragm to shita flange tateribu no kosabu no hiro kyodo

    Energy Technology Data Exchange (ETDEWEB)

    Miki, C.; Shiozaki, M.; Takeishi, K. [Tokyo Institute of Technology, Tokyo (Japan). Faculty of Engineering; Ohashi, H. [Honshu-Shikoku Bridge Authority, Tokyo (Japan)

    1997-04-21

    Discussions were given on crossing joints of diaphragms on hanger fixing sections and U-ribs on lower flanges in reinforcing box girders of a suspension bridge, as to their local stress generating behavior and effects of cope holes on fatigue strength. The test pieces have dimensions and shapes modeling the crossing joints, and the steel materials are SM490YA for upper and lower flanges and webs, and SS400 for U-ribs. The loading test was performed with four-point bending and at loading amplitudes of 30 to 45 tf. Furthermore, stress analysis was conducted by using the finite element method. The following conclusions were obtained as a result: local stress at cope hole tips decreases and fatigue strength increases with the smaller the cope hole diameter; when the cope holes are back-filled completely, deformation is concentrated on welds of the U-ribs and the flanges, generating high local stress; this reduces significantly the fatigue strength of details having no cope holes; and no particular differences are found on effects of boxing of the cope hole tips on the fatigue strength. 7 refs., 10 figs., 3 tabs.

  2. Pressure brazing of ceramics to metals with copper solder

    International Nuclear Information System (INIS)

    Pavlova, M.A.; Metelkin, I.I.

    1986-01-01

    The effect on the quality of joints brazed with copper of different non metallized aluminooxide dielectrics with metals and alloys of a series of technological parameters (temperature, pressure, holding, and medium) in the course of pressure brazing is investigated. It is shown that in case of brazing with kovar and nickel the character of dependences is identical, however in all cases the joints with nickel are more durable. For the ceramics - molybdenum system characterized by weak interaction with copper solder kinetic dependences have no maximum and only under holding of more than 20 min the constant strength of 150-190 MPa is attained

  3. Microstructure characteristics and temperature-dependent high cycle fatigue behavior of advanced 9% Cr/CrMoV dissimilarly welded joint

    Energy Technology Data Exchange (ETDEWEB)

    Wu, Qingjun [Shanghai Key Laboratory of Materials Laser Processing and Modification, Shanghai Jiao Tong University, Shanghai 200240 (China); Lu, Fenggui, E-mail: Lfg119@sjtu.edu.cn [Shanghai Key Laboratory of Materials Laser Processing and Modification, Shanghai Jiao Tong University, Shanghai 200240 (China); Shanghai Key Laboratory of Modern Metallurgy and Materials Processing, Shanghai University, Shanghai 200072 (China); Cui, Haichao [Shanghai Key Laboratory of Materials Laser Processing and Modification, Shanghai Jiao Tong University, Shanghai 200240 (China); Ding, Yuming; Liu, Xia [Shanghai Turbine Plant of Shanghai Electric Power Generation Equipment Co. Ltd., Shanghai 200240 (China); Gao, Yulai, E-mail: ylgao@shu.edu.cn [Shanghai Key Laboratory of Modern Metallurgy and Materials Processing, Shanghai University, Shanghai 200072 (China)

    2014-10-06

    Advanced 9% Cr and CrMoV steels chosen as candidate materials are first welded by narrow-gap submerged arc welding (NG-SAW) to fabricate the heavy section rotor. The present work focuses on studying the high-cycle fatigue (HCF) behavior of advanced 9% Cr/CrMoV dissimilarly welded joint at different temperatures. Conditional fatigue strength of this dissimilarly welded joint was obtained by HCF tests at room temperature (RT), 400 °C and 470 °C. It was observed that the failure occurred at the side of CrMoV base metal (BM), weld metal (WM) and heat affected zone (HAZ) of CrMoV side over 5×10{sup 7} cycles for the specimens tested at RT, 400 °C and 470 °C. The detailed microstructures of BMs, WMs and HAZs as well as fracture appearance were observed by optical microscopy (OM) and scanning electron microscopy (SEM). Precipitation and aggregation of carbides along the grain boundaries were clearly detected with the increase of temperature, which brought a negative effect on the fatigue properties. It is interesting to note that the inclusion size leading to crack initiation became smaller for the HCF test at higher temperature. Therefore, reduction in the inclusion size in a welded joint helps to improve the HCF performance at high temperature.

  4. Microstructure characteristics and temperature-dependent high cycle fatigue behavior of advanced 9% Cr/CrMoV dissimilarly welded joint

    International Nuclear Information System (INIS)

    Wu, Qingjun; Lu, Fenggui; Cui, Haichao; Ding, Yuming; Liu, Xia; Gao, Yulai

    2014-01-01

    Advanced 9% Cr and CrMoV steels chosen as candidate materials are first welded by narrow-gap submerged arc welding (NG-SAW) to fabricate the heavy section rotor. The present work focuses on studying the high-cycle fatigue (HCF) behavior of advanced 9% Cr/CrMoV dissimilarly welded joint at different temperatures. Conditional fatigue strength of this dissimilarly welded joint was obtained by HCF tests at room temperature (RT), 400 °C and 470 °C. It was observed that the failure occurred at the side of CrMoV base metal (BM), weld metal (WM) and heat affected zone (HAZ) of CrMoV side over 5×10 7 cycles for the specimens tested at RT, 400 °C and 470 °C. The detailed microstructures of BMs, WMs and HAZs as well as fracture appearance were observed by optical microscopy (OM) and scanning electron microscopy (SEM). Precipitation and aggregation of carbides along the grain boundaries were clearly detected with the increase of temperature, which brought a negative effect on the fatigue properties. It is interesting to note that the inclusion size leading to crack initiation became smaller for the HCF test at higher temperature. Therefore, reduction in the inclusion size in a welded joint helps to improve the HCF performance at high temperature

  5. Mixed-mode fatigue fracture of adhesive joints in harsh environments and nonlinear viscoelastic modeling of the adhesive

    Science.gov (United States)

    Arzoumanidis, Alexis Gerasimos

    A four point bend, mixed-mode, reinforced, cracked lap shear specimen experimentally simulated adhesive joints between load bearing composite parts in automotive components. The experiments accounted for fatigue, solvent and temperature effects on a swirled glass fiber composite adherend/urethane adhesive system. Crack length measurements based on compliance facilitated determination of da/dN curves. A digital image processing technique was also utilized to monitor crack growth from in situ images of the side of the specimen. Linear elastic fracture mechanics and finite elements were used to determine energy release rate and mode-mix as a function of crack length for this specimen. Experiments were conducted in air and in a salt water bath at 10, 26 and 90°C. Joints tested in the solvent were fully saturated. In air, both increasing and decreasing temperature relative to 26°C accelerated crack growth rates. In salt water, crack growth rates increased with increasing temperature. Threshold energy release rate is shown to be the most appropriate design criteria for joints of this system. In addition, path of the crack is discussed and fracture surfaces are examined on three length scales. Three linear viscoelastic properties were measured for the neat urethane adhesive. Dynamic tensile compliance (D*) was found using a novel extensometer and results were considerably more accurate and precise than standard DMTA testing. Dynamic shear compliance (J*) was determined using an Arcan specimen. Dynamic Poisson's ratio (nu*) was extracted from strain gage data analyzed to include gage reinforcement. Experiments spanned three frequency decades and isothermal data was shifted by time-temperature superposition to create master curves spanning thirty decades. Master curves were fit to time domain Prony series. Shear compliance inferred from D* and nu* compared well with measured J*, forming a basis for finding the complete time dependent material property matrix for this

  6. The critical oxide thickness for Pb-free reflow soldering on Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)

    2012-06-01

    Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

  7. Study on interfacial reaction between lead-free solders and alternative surface finishes

    International Nuclear Information System (INIS)

    Siti Rabiatul Aisha; Ourdjini, A.; Saliza Osman

    2007-01-01

    This study investigates the interfacial reactions occurring during reflow soldering between Sn-Ag-Cu lead-free solder and two surface finishes: electroless nickel/ immersion gold (ENIG) and immersion silver (IAg). The study focuses on interfacial reactions evolution and growth kinetics of intermetallic compounds (IMC) formed during soldering and isothermal ageing at 150 degree Celsius for up to 2000 hours. Optical and scanning electron microscopy were used to measure IMC thickness and examine the morphology of IMC respectively, whereas the IMC phases were identified by energy dispersive X-ray analysis (EDX). The results showed that the IMC formed on ENIG finish is thinner compared to that formed on IAg finish. For IAg surface finish, Cu 6 Sn 5 IMCs with scallop morphology are formed at the solder/ surface finish interface after reflow while a second IMC, Cu 3 Sn was formed between the copper and Cu 6 Sn 5 IMC after the isothermal ageing treatment. For ENIG surface finish both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 are formed after soldering. Isothermal aging of the solder joints formed on ENIG finish was found to have a significant effect on the morphology of the intermetallics by transforming to more spherical and denser morphology in addition to increase i their thickness with increased ageing time. (author)

  8. Fatigue damage evaluation method for the longitudinal welded joint of a FBR main vessel in the vicinity of the sodium surface

    International Nuclear Information System (INIS)

    Tanigawa, Masayuki; Shimokoshi, Minoru; Negishi, Hitoshi; Nagata, Takashi

    1990-01-01

    Metallurgical discontinuities are dominant in the fatigue strength reductions at the welded joints of vessels whose surfaces could be finished. In the welded joints of SUS 304 with TYPE 308 weld metal fatigue strength reductions are caused by strain concentrations as the result of the softening of the weld metal. A combination model of two elastic fully plastic materials is applicable to the structures under thermal stresses where displacements are self-controlled. Metallurgical discontinuities are represented by the difference of the yield strength. The longitudinal welded joint of a large FBR main vessel in the vicinity of the sodium surface was analyzed using this model under various conditions related to the design. Strain concentrations at the welded joint could be evaluated using the elastic follow-up model. The maximum value of the elastic follow-up parameter was 3.0 if the yield stress ratio of the weld metal to the base metal was not less than 0.8. (author)

  9. Instantaneous fluxless bonding of Au with Pb-Sn solder in ambient atmosphere

    International Nuclear Information System (INIS)

    Lee, T.K.; Zhang, Sam; Wong, C.C.; Tan, A.C.

    2005-01-01

    A fluxless bonding technique has been developed as a method of flip-chip bonding for microelectronic packaging. The fluxless bonding technique can be achieved instantaneously in an ambient environment between metallic stud bumps and predefined molten solder. This paper describes the mechanics of the bonding action and verifies the effectiveness of this bonding method through wetting balance tests and scanning electron microscope and energy dispersive x-ray analysis. This technique has been demonstrated by using a gold stud bump to break the tin oxide layer over molten solder. This allows for a fast, solid liquid interdiffusion between gold (Au) and the fresh molten eutectic lead-tin (Pb-Sn) solder for joint formation during solidification. This bonding method has been successfully tested with 130-μm-pitch flip-chip bond pads on a joint-in-via flex substrate architecture

  10. Role of butter layer in low-cycle fatigue behavior of modified 9Cr and CrMoV dissimilar rotor welded joint

    International Nuclear Information System (INIS)

    Wu, Qingjun; Lu, Fenggui; Cui, Haichao; Liu, Xia; Wang, Peng; Tang, Xinhua

    2014-01-01

    Highlights: • Modified 9Cr–CrMoV dissimilar turbine rotor was successfully welded by NG-SAW. • LCF properties of both welded joints were approximate at smaller strain amplitude. • Tempered martensite with amounts of carbides in HAZ contributed to weakest zones. • Matched BL determined LCF properties of whole joint for dissimilar welded rotor. - Abstract: The present work aims at studying the role of butter layer (BL) in low-cycle fatigue (LCF) behavior of modified 9Cr steel and CrMoV steel dissimilar welded joint. The significant difference of the chemical composition of base metals (BMs) makes it a challenge to achieve sound welded joint. Therefore, buttering was considered to obtain a transition layer between the dissimilar steels. The LCF tests of two kinds of specimens without and with butter layer were performed applying strain-controlled cyclic load with different axial strain amplitudes. The test results indicated that the number of cycles at higher strain amplitudes of welded joint without butter layer was greatly higher than that of the joint with butter layer, while the fatigue lifetime to crack initiation (2N f ) became closer to each other at low and middle strain amplitudes. The failure was in the tempered heat affected zone (HAZ) at the CrMoV side for specimens without BL, while the fracture occurred at the tempered HAZ in the BL for specimens with BL. The microstructure details of BM, BL, HAZ and weld metals (WMs) were revealed by optical microscopy (OM). It was found that the tempered martensite was major microstructure for welded joint and much more carbides were observed in tempered HAZ than other parts due to the repeated tempering. Microhardness test indicated a softest zone existing tempered HAZ of BL and also there was a softer zone in tempered HAZ at the CrMoV side due to repeated tempering during welding and post weld heat treatment (PWHT). And scanning electron microscopy (SEM) was applied to observe the fractography. It was

  11. Spectroscopic investigation of oxidized solder surfaces

    International Nuclear Information System (INIS)

    Song, Jenn-Ming; Chang-Chien, Yu-Chien; Huang, Bo-Chang; Chen, Wei-Ting; Shie, Chi-Rung; Hsu, Chuang-Yao

    2011-01-01

    Highlights: → UV-visible spectroscopy is successfully used to evaluate the degree of discoloring of solders. → The surface oxides of solders can also be identified by UV-visible absorption spectra. → The discoloration of solder surface can be correlated with optical characterization of oxides. → A strategy against discoloring by alloying was also suggested. - Abstract: For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV-vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible region. A trace of P can effectively depress the discoloration of solders under both solid and semi-solid states through the suppression of SnO.

  12. Comparative strength analysis and thermal fatigue testing of Be/CuCrZr and Be/GlidCop joints produced by fast brazing

    International Nuclear Information System (INIS)

    Gervash, A.; Mazul, I.; Yablokov, N.; Barabash, V.; Ganenko, A.

    2000-01-01

    Proposing beryllium as plasma facing armour this paper presents the recent results obtained in Russia in the frame of such activities. Last year testing of actively cooled mock-ups produced by fast brazing of Be onto Cu-alloy heat sink allows to consider mentioned Russian method as promising for both PH-copper like CuCrZr and DS-copper like GlidCop. Summarizing recent experimental results with their previous data authors attempt to comparatively investigate a behaviour of Be/CuCrZr and Be/GlidCop joints in ITER relevant conditions. Mechanical properties, brazing zone microstructure and thermal response were taken for comparison. The shear strength for both types of joints was found as 150-200 MPa and did not depend on testing temperature. The brazing zone morphology and microhardness are presented, the thermal fatigue behaviour of investigated joints is described. All main results as well as the nearest future plans are discussed. (orig.)

  13. Fabrication of high-quality brazed joints

    International Nuclear Information System (INIS)

    Orlov, A.V.

    1980-01-01

    Problem of ensuring of joint high-quality when brazing different parts in power engineering is considered. To obtain high-quality joints it is necessary to correctly design brazed joint and to choose a gap width, overlap length and fillet radius; to clean up carefully the surfaces to be brazed and fix them properly one relative to another; to apply a solder so as to provide its flowing into the gap and sticking in it; to exactly regulate thermal conditions of brazing. High quality and reliability of brazed joints are ensured by the application of solders based on noble metals, and cheap solders based on nickel, manganese and copper. Joints brazed with nickel base solders may operate at temperatures as high as 888 deg C

  14. Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits

    Energy Technology Data Exchange (ETDEWEB)

    Huang, Y. T.; Hsu, H. H.; Wu, Albert T., E-mail: atwu@ncu.edu.tw [Department of Chemical and Materials Engineering, National Central University, Jhongli City 320, Taiwan (China)

    2014-01-21

    Because of the miniaturization of electronic devices, the reliability of electromigration has become a major concern when shrinking the solder dimensions in flip-chip joints. Fast reaction between solders and electrodes causes intermetallic compounds (IMCs) to form, which grow rapidly and occupy entire joints when solder volumes decrease. In this study, U-grooves were fabricated on Si chips as test vehicles. An electrode-solder-electrode sandwich structure was fabricated by using lithography and electroplating. Gaps exhibiting well-defined dimensions were filled with Sn3.5Ag solders. The gaps between the copper electrodes in the test sample were limited to less than 15 μm to simulate microbumps. The samples were stressed at various current densities at 100 °C, 125 °C, and 150 °C. The morphological changes of the IMCs were observed, and the dimensions of the IMCs were measured to determine the kinetic growth of IMCs. Therefore, this study focused on the influence of back stress caused by microstructural evolution in microbumps.

  15. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    CERN Document Server

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

    2015-01-01

    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  16. Tensile properties of irradiated and fatigue exposed stainless steel DIN X 6 CrNi 1811 (similar to AISI type 304) plate and welded joints

    International Nuclear Information System (INIS)

    Vries, M.I. de; Schaaf, B. van der; Elen, J.D.

    1979-10-01

    Test specimens of plate metal and welded joints of stainless steel DIN 1.4948, which is similar to AISI type 304, have been irradiated at 723 K and 823 K up to fluences of 1.10 23 n.m -2 and 5.10 24 n.m -2 (E > 0.1 MeV). These are representative conditions for the SNR-300 reactor vessel and inner components after 16 years of operation. High-rate (depsilon/dt = 1 s -1 ) tensile tests were performed after fatigue exposure up to various fractions of fatigue life (D) ranging from 5% to 95% at the same temperatures as the nominal temperatures of the irradiation series

  17. Circuit reliability boosted by soldering pins of disconnect plugs to sockets

    Science.gov (United States)

    Pierce, W. B.

    1964-01-01

    Where disconnect pins must be used for wiring and testing a circuit, improved system reliability is obtained by making a permanent joint between pins and sockets of the disconnect plug. After the circuit has been tested, contact points may be fused through soldering, brazing, or welding.

  18. Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Wang Fengjiang [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States); O' Keefe, Matthew [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)], E-mail: mjokeefe@mst.edu; Brinkmeyer, Brandon [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)

    2009-05-27

    The effect of incorporating eutectic Sn-Pb solder with Sn-3.0Ag-0.5Cu (SAC) Pb-free solder on the microstructure and tensile properties of the mixed alloys was investigated. Alloys containing 100, 75, 50, 25, 20, 15, 10, 5 and 0 wt% SAC, with the balance being Sn-37Pb eutectic solder alloy, were prepared and characterized. Optical and scanning electron microscopy were used to analyze the microstructures while 'mini-tensile' test specimens were fabricated and tested to determine mechanical properties at the mm length scale, more closely matching that of the solder joints. Microstructural analysis indicated that a Pb-rich phase formed and was uniformly distributed at the boundary between the Sn-rich grains or between the Sn-rich and the intermetallic compounds in the solder. Tensile results showed that mixing of the alloys resulted in an increase in both the yield and the ultimate tensile strength compared to the original solders, with the 50% SAC-50% Sn-Pb mixture having the highest measured strength. Initial investigations indicate the formation and distribution of a Pb-rich phase in the mixed solder alloys as the source of the strengthening mechanism.

  19. Nano-soldering to single atomic layer

    Science.gov (United States)

    Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  20. Safer Soldering Guidelines and Instructional Resources

    Science.gov (United States)

    Love, Tyler S.; Tomlinson, Joel

    2018-01-01

    Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

  1. THE POSSIBILITY OF USING LASER-ULTRASOUND TO MONITOR THE QUALITY SOLDERED CONNECTIONS CHAMBERS OF LIQUID ROCKET ENGINES

    Directory of Open Access Journals (Sweden)

    N. V. Astredinova

    2014-01-01

    Full Text Available During the manufacturing process to the design of modern liquid rocket engines are presented important requirements, such as minimum weight, maximum stiffness and strength of nodes, maximum service life in operation, high reliability and quality of soldered and welded seams. Due to the high quality requirements soldered connections and the specific design of the nozzle, it became necessary in the development and testing of a new non-conventional non-destructive testing method – laser-ultrasound diagnosis. In accordance with regulatory guidelines, quality control soldered connections is allowed to use an acoustic kind of control methods of the reflected light, transmitted light, resonant, free vibration and acoustic emission. Attempts to use traditional methods of non-destructive testing did not lead to positive results. This is due primarily to the size of typical solder joint defects, as well as the structural features of the rocket engine, the data structure is not controllable. In connection with this, a new method that provides quality control soldered connections cameras LRE based on the thermo generation of ultrasound. Methods of ultrasonic flaw detection of photoacoustic effect, in most cases, have a number of advantages over methods that use standard (traditional piezo transducers. In the course of studies have found that the sensitivity of the laser-ultrasonic method and flaw detector UDL-2M can detect lack of adhesion in the solder joints on the upper edges of the nozzle in the sub-header area of the site.

  2. Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

    Directory of Open Access Journals (Sweden)

    Yulong Li

    2018-01-01

    Full Text Available In order to accelerate the growth of interfacial intermetallic compound (IMC layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms and 800 ms, were used for the ultrasonic soldering. The isothermal aging was conducted at 150 °C for 0, 120, 240, and 360 h. The evolution of microstructure, the IMC layer growth mechanism during aging, and the shear strength of the joints after aging were systemically investigated. Results showed the following. (i Formation of intermetallic compounds was accelerated by ultrasonic cavitation and streaming effects, the thickness of the interfacial Cu6Sn5 layer increased with aging time, and a thin Cu3Sn layer was identified after aging for 360 h. (ii The growth of the interfacial IMC layer of the ultrasonically soldered Cu/SAC305/Cu joints followed a linear function of the square root of the aging time, revealing a diffusion-controlled mechanism. (iii The tensile shear strength of the joint decreased to a small extent with increasing aging time, owing to the combined effects of IMC grain coarsening and the increase of the interfacial IMC. (iv Finally, although the fracture surfaces and failure locations of the joint soldered with 400 ms and 800 ms vibration times show similar characteristics, they are influenced by the aging time.

  3. Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

    Science.gov (United States)

    Boesenberg, Adam J.; Anderson, Iver E.; Harringa, Joel L.

    2012-07-01

    Of Pb-free solder choices, an array of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic ( T eut = 217°C) composition have emerged with potential for broad use, including ball grid array (BGA) joints that cool slowly. This work investigated minor substitutional additions of Al (0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2- μm to 5- μm faceted Cu-Al particles, identified as Cu33Al17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness. Clustering of Cu33Al17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface. Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance.

  4. Influence of joint line remnant on crack paths under static and fatigue loadings in friction stir welded Al-Mg-Sc alloy

    Directory of Open Access Journals (Sweden)

    Y. Besel

    2016-01-01

    Full Text Available The influence of the joint line remnant (JLR on tensile and fatigue fracture behaviour has been investigated in a friction stir welded Al-Mg-Sc alloy. JLR is one of the microstructural features formed in friction stir welds depending on welding conditions and alloy systems. It is attributed to initial oxide layer on butting surfaces to be welded. In this study, two different tool travel speeds were used. JLR was formed in both welds but its spatial distribution was different depending on the tool travel speeds. Under the tensile test, the weld with the higher heat input fractured partially along JLR, since strong microstructural inhomogeneity existed in the vicinity of JLR in this weld and JLR had weak bonding. Resultantly, the mechanical properties of this weld were deteriorated compared with the other weld. Fatigue crack initiation was not affected by the existence of JLR in all welds. But the crack propagated preferentially along JLR in the weld of the higher heat input, when it initiated on the retreating side. Consequently, such crack propagation behaviour along JLR could bring about shorter fatigue lives in larger components in which crack growth phase is dominant.

  5. Optimal Fatigue Testing

    DEFF Research Database (Denmark)

    Faber, Michael Havbro; Sørensen, John Dalsgaard; Kroon, I. B.

    1993-01-01

    life experiments for the same purpose. The methodology is basedon modern probabilistic concepts amd classical decision theory. The special case where the fatigue life experiments are given in terms of SN curves is considered in Particular. The proposed techniques are illustrated by an example.......This paper considers the reassessment of the reliability of tubular joints subjected to fatigue load. The reassessment is considered in two parts namely the task of utilizing new experimental data on fatigue life to update the reliability of the tubular joint ant the task of planning new fatigue...

  6. Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    McNally, K.M.; Sorg, B.S.; Welch, A.J.; Dawes, J.M.; Owen, E.R.

    1999-01-01

    Low-strength anastomoses and thermal damage of tissue are major concerns in laser tissue welding techniques where laser energy is used to induce thermal changes in the molecular structure of the tissues being joined, hence allowing them to bond together. Laser tissue soldering, on the other hand, is a bonding technique in which a protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. The addition of protein solders to augment tissue repair procedures significantly reduces the problems of low strength and thermal damage associated with laser tissue welding techniques. Investigations were conducted to determine optimal solder and laser parameters for tissue repair in terms of tensile strength, temperature rise and damage and the microscopic nature of the bonds formed. An in vitro study was performed using an 808 nm diode laser in conjunction with indocyanine green (ICG)-doped albumin protein solders to repair bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The efficacy of temperature feedback control in enhancing the soldering process was also investigated. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the repairs. A reduction in dye concentration from 2.5mgml -1 to 0.25mgml -1 was also found to result in an increase in tensile strength. Increasing the laser irradiance and thus surface temperature resulted in an increased severity of histological injury. Thermal denaturation of tissue collagen and necrosis of the intimal layer smooth muscle cells increased laterally and in depth with higher temperatures. The strongest repairs were produced with an irradiance of 6.4Wcm -2 using a solid protein solder composed of 60% BSA and 0.25mgml -1 ICG. Using this combination of laser and solder parameters, surface temperatures were observed to reach 85±5 deg. C with a

  7. Effect of temperature and flux concentration on soldering of base metal.

    Science.gov (United States)

    Lee, S Y; Lin, C T; Wang, M H; Tseng, H; Huang, H M; Dong, D R; Pan, L C; Shih, Y H

    2000-12-01

    The present study used the acoustic emission (AE) technique to evaluate interactions among soldering temperature, flux treatment, and the resultant ultimate tensile strength (UTS). Scanning electron microscopy (SEM) was used to examine fracture surfaces of the solder joints. Specimens were cast from removable partial denture alloy and then placed in a jig with a gap distance of 1.0 mm. A high-frequency soldering machine with an optical pyrometer was used for soldering at 1150 degrees C and 1200 degrees C, respectively. The flux concentrations were 67% and 75%. The soldered specimens were subjected to tensile test at a crosshead speed of 0.05 mm/min. During testing, acoustic emissions in the frequency range of 100--1200 kHz were collected, filtered, recorded, and processed by a sensing device. The results were analysed by ANOVA and Tukey LSD test. UTS at different temperatures showed no significant difference according to either mechanical or acoustic results. But in the 1200 degrees C group, the UTSs and AE counts showed significant differences (Pacoustic signals within the elastic deformation zone, while the 67% flux subgroup produced similar signals within the plastic deformation zone, either beyond the 0.2% yield point or before fracture.

  8. Creep-fatigue propagation of semi-elliptical crack at 650 deg. C in 316L(N) stainless steel plates with or without welded joints

    International Nuclear Information System (INIS)

    Curtit, F.

    2000-01-01

    This study realised in LISN Laboratory of CEA Saclay, deals with the creep fatigue propagation of semi elliptical crack at the temperature of 650 deg C in 316L(N) stainless steel plates with or without welded joints. A vast majority of the studies on creep fatigue propagation models are based on specimen (CT) especially designed for crack propagation study. The PLAQFLU program performed in LISN laboratory deals with the application and adaptation of these models to complex crack shape, which are more representative of the cracks observed in industrial components. In this scope, we use propagation tests realised at the temperature of 650 deg C with wide plates containing semi elliptical defects. For some of them, the initial defect is machined in the middle of a welded joint, which constitute a privileged site for the crack initiation. The approach used in this study is based on global parameters of fracture mechanics. At first, tests on CT specimen are used in order to determine the propagation laws correlating the crack growth rate to the global parameters K or C * . These laws are then supposed to be intrinsic to our materials and are used to analysed the semi elliptical crack propagation. The analysis of the comportment of the crack during the hold time demonstrates the possibility to establish a correlation between the crack propagation both in the deepest and the surface point and the local value of C * . These correlations are coherent in the different points of the crack front for the different applied hold times, and they present a reasonably good agreement with the creep propagation law identified on CT specimen. The simulation of test performed on based metal specimen with a model of summation of both creep and pure fatigue crack growth gives acceptable results when the calculus of the simplified expression of C * s considers a continuous evolution of creep deformations rate during the all test. (author)

  9. The constitutive response of three solder materials

    International Nuclear Information System (INIS)

    Perez-Bergquist, Alejandro G.; Cao Fang; Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T.

    2012-01-01

    Highlights: ► The full constitutive response of three solder materials. ► Test temperatures from −196 °C to 60 °C and strain rates from 10 −3 to >10 3 s −1 . ► Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (−196 °C to 60 °C) and strain rate (10 −3 to >10 3 s −1 ). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  10. The constitutive response of three solder materials

    Energy Technology Data Exchange (ETDEWEB)

    Perez-Bergquist, Alejandro G., E-mail: alexpb@lanl.gov [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States); Cao Fang [Exxon Mobil Research and Engineering Company, Annadale, NJ 08801 (United States); Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T. [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States)

    2012-05-25

    Highlights: Black-Right-Pointing-Pointer The full constitutive response of three solder materials. Black-Right-Pointing-Pointer Test temperatures from -196 Degree-Sign C to 60 Degree-Sign C and strain rates from 10{sup -3} to >10{sup 3} s{sup -1}. Black-Right-Pointing-Pointer Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196 Degree-Sign C to 60 Degree-Sign C) and strain rate (10{sup -3} to >10{sup 3} s{sup -1}). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  11. Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction

    Science.gov (United States)

    Takaku, Yoshikazu; Ohnuma, Ikuo; Kainuma, Ryosuke; Yamada, Yasushi; Yagi, Yuji; Nishibe, Yuji; Ishida, Kiyohito

    2006-11-01

    Bismuth and its alloys are candidates for Pb-free high-temperature solders that can be substituted for conventional Pb-rich Pb-Sn solders (melting point (mp) = 573 583 K). However, inferior properties such as brittleness and weak bonding strength should be improved for practical use. To that end, BiCu-X (X=Sb, Sn, and Zn) Pb-free high-temperature solders are proposed. Miscibility gaps in liquid BiCu-X alloys were surveyed using the thermodynamic database ADAMIS (alloy database for micro-solders), and compositions of the BiCu-X solders were designed on the basis of calculation. In-situ composite solders that consist of a Bi-base matrix with fine intermetallic compound (IMC) particles were produced by gas-atomizing and melt-spinning methods. The interfacial reaction between in-situ composite solders and Cu or Ni substrates was investigated. The IMCs at the interface formed a thin, uniform layer, which is an appropriate morphology for a reliable solder joint.

  12. Optimal parameters for laser tissue soldering

    Science.gov (United States)

    McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

    1998-07-01

    Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

  13. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

    National Research Council Canada - National Science Library

    Reuse, Rolando

    2005-01-01

    .... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

  14. Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

    Directory of Open Access Journals (Sweden)

    Soares D.

    2007-01-01

    Full Text Available Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layers. The effect of the addition of P, at low levels, on the chemical composition of the layers present at the interface was studied. The phases formed at the interface between the Cu or Ni substrate and a molten lead-free solder at 250ºC, were studied for different stage times and alloy compositions. The melting temperatures, of the studied alloys, were determined by Differential Scanning Calorimetry (DSC. Identification of equilibrium phases formed at the interface layer, and the evaluation of their chemical composition were performed by Scanning Electron Microscopy (SEM/EDS. Different interface characteristics were obtained, namely for the alloys containing Zn. The obtained IML layer thickness was compared, for both types of alloy systems.

  15. Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

    International Nuclear Information System (INIS)

    Yang, Ming; Ko, Yong-Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu

    2017-01-01

    Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

  16. Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Ming [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Ko, Yong-Ho [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Bang, Junghwan [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Kim, Taek-Soo [Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Lee, Chang-Woo, E-mail: cwlee@kitech.re.kr [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Li, Mingyu, E-mail: myli@hit.edu.cn [Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055 (China)

    2017-02-15

    Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

  17. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Science.gov (United States)

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2004-10-01

    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  18. An Approach for Impression Creep of Lead Free Microelectronic Solders

    Science.gov (United States)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  19. Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature

    Energy Technology Data Exchange (ETDEWEB)

    Prabhu, K.N., E-mail: prabhukn_2002@yahoo.co.in [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India); Deshapande, Parashuram; Satyanarayan [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India)

    2012-01-30

    Highlights: Black-Right-Pointing-Pointer Effect of cooling rate on tensile and impact properties of Sn-9Zn alloy was assessed. Black-Right-Pointing-Pointer Both DBTT and UTS of the solder alloy increased with increase in cooling rate. Black-Right-Pointing-Pointer An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile-brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn-9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 Degree-Sign C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the

  20. Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature

    International Nuclear Information System (INIS)

    Prabhu, K.N.; Deshapande, Parashuram; Satyanarayan

    2012-01-01

    Highlights: ► Effect of cooling rate on tensile and impact properties of Sn–9Zn alloy was assessed. ► Both DBTT and UTS of the solder alloy increased with increase in cooling rate. ► An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile–brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn–9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 °C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the DBTT.

  1. A flip chip process based on electroplated solder bumps

    Science.gov (United States)

    Salonen, J.; Salmi, J.

    1994-01-01

    Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

  2. Low cycle fatigue behavior of electron beam and friction welded joints of an α-β titanium alloy

    International Nuclear Information System (INIS)

    Mohandas, T.; Varma, V.K.; Banerjee, D.; Kutumbarao, V.V.

    1996-01-01

    Fusion welds in titanium alloys, with intermediate β stabilizing additions, show poor mechanical properties due to large fusion zone grain size coupled with a brittle plate martensitic microstructure and hydrogen induced microporosity. These problems, associated with fusion welding, have been reported to be overcome by friction welding. The alloy used in this study is a Soviet composition (VT9) of the α-β class with the nominal chemical composition Ti-6.5Al-3.3Mo-1.6Zr-0.3 Si (in weight percent), intended to be used as discs and blades in compressor stages of gas turbine engine where low cycle fatigue (LCF) loading is experienced. Electron beam welding of the alloy was largely unsuccessful for the reasons described above. Fatigue properties of such welds had large scatter due to the presence of microporosity. A continuous drive friction welding technique was investigated to overcome this problem These welds showed encouraging results in that microporosity, a problem in the electron beam welding, was not observed and the mechanical properties were at par or better than those of the base metal. This paper deals with the study of stress controlled LCF behavior of friction welds and electron beam welds of the α-β titanium alloy at ambient temperature and the results are compared with those of base metal

  3. Current redistribution in cables made of insulated, soldered, or oxidized strands

    International Nuclear Information System (INIS)

    Turck, B.

    1979-07-01

    Current redistributions are compared in cables made of insulated strands, soldered, or oxidized strands and insulated strands with periodic joints. After discussing the different current redistributions in the cases of a rapidly changing current and a dc current, several particular situations are investigated: what happens if a strand is broken, or if a local normal zone appears that does not affect all the strands equally, the detection of this normal zone, and the influence of short circuits between strands

  4. Ductile fracture mechanism of low-temperature In-48Sn alloy joint under high strain rate loading.

    Science.gov (United States)

    Kim, Jong-Woong; Jung, Seung-Boo

    2012-04-01

    The failure behaviors of In-48Sn solder ball joints under various strain rate loadings were investigated with both experimental and finite element modeling study. The bonding force of In-48Sn solder on an Ni plated Cu pad increased with increasing shear speed, mainly due to the high strain-rate sensitivity of the solder alloy. In contrast to the cases of Sn-based Pb-free solder joints, the transition of the fracture mode from a ductile mode to a brittle mode was not observed in this solder joint system due to the soft nature of the In-48Sn alloy. This result is discussed in terms of the relationship between the strain-rate of the solder alloy, the work-hardening effect and the resulting stress concentration at the interfacial regions.

  5. Creep-fatigue propagation of semi-elliptical crack at 650 deg. C in 316L(N) stainless steel plates with or without welded joints; Propagation de fissures semi-elliptiques en fatigue-fluage a 650 deg. C dans des plaques d'acier 316L(N) avec ou sans joints soudes

    Energy Technology Data Exchange (ETDEWEB)

    Curtit, F

    2000-07-01

    This study realised in LISN Laboratory of CEA Saclay, deals with the creep fatigue propagation of semi elliptical crack at the temperature of 650 deg C in 316L(N) stainless steel plates with or without welded joints. A vast majority of the studies on creep fatigue propagation models are based on specimen (CT) especially designed for crack propagation study. The PLAQFLU program performed in LISN laboratory deals with the application and adaptation of these models to complex crack shape, which are more representative of the cracks observed in industrial components. In this scope, we use propagation tests realised at the temperature of 650 deg C with wide plates containing semi elliptical defects. For some of them, the initial defect is machined in the middle of a welded joint, which constitute a privileged site for the crack initiation. The approach used in this study is based on global parameters of fracture mechanics. At first, tests on CT specimen are used in order to determine the propagation laws correlating the crack growth rate to the global parameters K or C{sup *}. These laws are then supposed to be intrinsic to our materials and are used to analysed the semi elliptical crack propagation. The analysis of the comportment of the crack during the hold time demonstrates the possibility to establish a correlation between the crack propagation both in the deepest and the surface point and the local value of C{sup *}. These correlations are coherent in the different points of the crack front for the different applied hold times, and they present a reasonably good agreement with the creep propagation law identified on CT specimen. The simulation of test performed on based metal specimen with a model of summation of both creep and pure fatigue crack growth gives acceptable results when the calculus of the simplified expression of C{sup *}{sub s} considers a continuous evolution of creep deformations rate during the all test. (author)

  6. Efforts to Develop a 300°C Solder

    Energy Technology Data Exchange (ETDEWEB)

    Norann, Randy A [Perma Works LLC

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  7. A Hodge dual for soldered bundles

    International Nuclear Information System (INIS)

    Lucas, Tiago Gribl; Pereira, J G

    2009-01-01

    In order to account for all possible contractions allowed by the presence of the solder form, a generalized Hodge dual is defined for the case of soldered bundles. Although for curvature the generalized dual coincides with the usual one, for torsion it gives a completely new dual definition. Starting from the standard form of a gauge Lagrangian for the translation group, the generalized Hodge dual yields precisely the Lagrangian of the teleparallel equivalent of general relativity, and consequently also the Einstein-Hilbert Lagrangian of general relativity

  8. Laser assisted soldering: microdroplet accumulation with a microjet device.

    Science.gov (United States)

    Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

    1998-01-01

    We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

  9. Laser solder welding of articular cartilage: tensile strength and chondrocyte viability.

    Science.gov (United States)

    Züger, B J; Ott, B; Mainil-Varlet, P; Schaffner, T; Clémence, J F; Weber, H P; Frenz, M

    2001-01-01

    The surgical treatment of full-thickness cartilage defects in the knee joint remains a therapeutic challenge. Recently, new techniques for articular cartilage transplantation, such as mosaicplasty, have become available for cartilage repair. The long-term success of these techniques, however, depends not only on the chondrocyte viability but also on a lateral integration of the implant. The goal of this study was to evaluate the feasibility of cartilage welding by using albumin solder that was dye-enhanced to allow coagulation with 808-nm laser diode irradiation. Conventional histology of light microscopy was compared with a viability staining to precisely determine the extent of thermal damage after laser welding. Indocyanine green (ICG) enhanced albumin solder (25% albumin, 0.5% HA, 0.1% ICG) was used for articular cartilage welding. For coagulation, the solder was irradiated through the cartilage implant by 808-nm laser light and the tensile strength of the weld was measured. Viability staining revealed a thermal damage of typically 500 m in depth at an irradiance of approximately 10 W/cm(2) for 8 seconds, whereas conventional histologies showed only half of the extent found by the viability test. Heat-bath investigations revealed a threshold temperature of minimum 54 degrees C for thermal damage of chondrocytes. Efficient cartilage bonding was obtained by using bovine albumin solder as adhesive. Maximum tensile strength of more than 10 N/cm(2) was achieved. Viability tests revealed that the thermal damage is much greater (up to twice) than expected after light microscopic characterization. This study shows the feasibility to strongly laser weld cartilage on cartilage by use of a dye-enhanced albumin solder. Possibilities to reduce the range of damage are suggested. Copyright 2001 Wiley-Liss, Inc.

  10. Fluxless flip-chip bonding using a lead-free solder bumping technique

    Science.gov (United States)

    Hansen, K.; Kousar, S.; Pitzl, D.; Arab, S.

    2017-09-01

    With the LHC exceeding the nominal instantaneous luminosity, the current barrel pixel detector (BPIX) of the CMS experiment at CERN will reach its performance limits and undergo significant radiation damage. In order to improve detector performance in high luminosity conditions, the entire BPIX is replaced with an upgraded version containing an additional detection layer. Half of the modules comprising this additional layer are produced at DESY using fluxless and lead-free bumping and bonding techniques. Sequential solder-jetting technique is utilized to wet 40-μm SAC305 solder spheres on the silicon-sensor pads with electroless Ni, Pd and immersion Au (ENEPIG) under-bump metallization (UBM). The bumped sensors are flip-chip assembled with readout chips (ROCs) and then reflowed using a flux-less bonding facility. The challenges for jetting low solder volume have been analyzed and will be presented in this paper. An average speed of 3.4 balls per second is obtained to jet about 67 thousand solder balls on a single chip. On average, 7 modules have been produced per week. The bump-bond quality is evaluated in terms of electrical and mechanical properties. The peak-bump resistance is about 17.5 mΩ. The cross-section study revealed different types of intermetallic compounds (IMC) as a result of interfacial reactions between UBM and solder material. The effect of crystalline phases on the mechanical properties of the joint is discussed. The mean shear strength per bump after the final module reflow is about 16 cN. The results and sources of yield loss of module production are reported. The achieved yield is 95%.

  11. Fatigue strength of field welded joints in I-section girders of thick flange plates with cope hole details; Sukarappu wo yusuru atsuita I gata danmen keta genba yosetsu tsugitebu no hiro kyodo

    Energy Technology Data Exchange (ETDEWEB)

    Minami, K.; Miki, C.; Tateishi, K. [Tokyo Institute of Technology, Tokyo (Japan)

    1997-10-15

    Field welding an I-section girder forms details having scallop at the web, whereas the presence of the scallop causes shear deformation and localized stress concentration. Therefore the details in joints with low fatigue strength are ranked as class G in the fatigue design guideline published by JSSC. With special notice on the effect of shear, the present study has varied the phase by using multiple number of jacks; so loaded that the direction of the shear force will change; assumed field welding of a bridge constructed with a few number of main girders; and verified fatigue strength at thick flange plates. In addition, in order to improve the fatigue strength, elucidation was given on the effect of grinder finish at boxing welds. From these results, items to be considered were made clear when structural details are designed and fabricated, in which I-section girders having scallop are welded in fields. Furthermore, it was considered that stress in web plate jointing welding bead becomes relatively higher than local stress in boxing, which was indicated as a point requiring precaution. 8 refs., 20 figs., 2 tabs.

  12. Fatigue behavior of boxing welded joint under biaxial cyclic loads; 2juku kurikaeshi kajuka ni okeru kakumawashi yosetsu keishu no hiro kyodo

    Energy Technology Data Exchange (ETDEWEB)

    Takahashi, I.; Takada, A.; Akiyama, S.; Ushijima, M.; Maenaka, H. [Ministry of Transportation, Tokyo (Japan)

    1998-12-31

    Various forces such as gravity, wave induced force, inertial force etc. compositely act on a ship body from various directions. Therefore, while discussing strength or life of structural elements of ship body, it is necessary to understand the effects of the composite force condition. In this study, fatigue tests of boxing welded joint under rectangular biaxial cyclic loads are performed, the following results are obtained. Even under he biaxial cyclic loads, it is the same as the uniaxial test, the cracks occurred at the boxing weld toes propagate almost in the straight y-direction, but no oblique propagation of the cracks caused by the lad in the y-direction occurs. That the crack at initial stage of the crack progress is improved in y-direction can be illustrated by the facts that the residual stress in x-direction near the toes reaches to the yield stress, and the stress concentration in the welded toes is bigger in x-direction than that in y-direction. But as for prediction of the progress route, a further study including amplitude ratio of the biaxial loads, effects of width of test specimen is necessary. 4 refs., 12 figs., 4 tabs.

  13. Analysis and test to predict the fatigue life of the ISX-B toroidal field coils' finger joints

    International Nuclear Information System (INIS)

    O'Toole, J.A.; Ojalvo, I.U.; Raynor, G.E.; Zatz, I.J.; Johnson, N.E.; Walls, J.C.; Nelson, B.E.; Cain, W.D.; Walstrom, P.L.; Pearce, J.W.

    1979-01-01

    A new and more rigorous structural evaluation of the ISX toroidal field (TF) coil fingers joints was undertaken to assess the effects of high-/beta/ operation of ISX-B. A new poloidal field (PF) coil set which allows high-/beta/ operation and produces larger out-of-plane loads on the TF coils was installed as part of the change to ISX-B. It was determined that the iron core significantly affects the out-of-plane load distribution and forces were calculated using the GFUN-3D code which considers 3-D iron core effects. These loads were applied to a half-symmetric finite element NASTRAN code model in which the TF coils were modeled as a string of beam elements. 8 refs

  14. Tin-silver and tin-copper alloys for capillarity joining-soft soldering-of copper piping

    International Nuclear Information System (INIS)

    Duran, J.; Amo, J. M.; Duran, C. M.

    2001-01-01

    It is studied the influence of the type of alloy used as filling material on the defects of the soldering joints in copper piping installations, which induce the fluid leak of the systems. The different eutectic temperatures and solidus-liquidus ranges of these alloys, require the setting of the soldering heat input in each case to obtain the suitable capillarity features and alloying temperatures to achieve for the correct formation of the bonding. Most defects in the joints are demonstrated to be generated by bad dossification of thermal inputs, which led depending on the filler alloy used to variations in its fluidity that may produce penetration failures in the bonds or insufficient consistency for the filling of the joints. (Author) 7 refs

  15. The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

    Science.gov (United States)

    Werden, Jesse

    The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the

  16. Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

    National Research Council Canada - National Science Library

    Chung, Kohn C

    2006-01-01

    .... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

  17. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Dias, Marcelino; Costa, Thiago [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Rocha, Otávio [Federal Institute of Education, Science and Technology of Pará — IFPA, 66093-020 Belém, PA (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos — UFSCar, 13565-905 São Carlos, SP (Brazil); Cheung, Noé, E-mail: cheung@fem.unicamp.br [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil)

    2015-08-15

    Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing.

  18. Effect of Solder Flux Residues on Corrosion of Electronics

    DEFF Research Database (Denmark)

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

    2009-01-01

    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... testing and use in the field, consequences and recommendations are given. Failures, caused by harsh[1] customer environments, are not covered in this paper....

  19. Evaluation on the characteristics of tin-silver-bismuth solder

    Science.gov (United States)

    Xia, Z.; Shi, Y.; Chen, Z.

    2002-02-01

    Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

  20. Miniaturization of Micro-Solder Bumps and Effect of IMC on Stress Distribution

    Science.gov (United States)

    Choudhury, Soud Farhan; Ladani, Leila

    2016-07-01

    As the joints become smaller in more advanced packages and devices, intermetallic (IMCs) volume ratio increases, which significantly impacts the overall mechanical behavior of joints. The existence of only a few grains of Sn (Tin) and IMC materials results in anisotropic elastic and plastic behavior which is not detectable using conventional finite element (FE) simulation with average properties for polycrystalline material. In this study, crystal plasticity finite element (CPFE) simulation is used to model the whole joint including copper, Sn solder and Cu6Sn5 IMC material. Experimental lap-shear test results for solder joints from the literature were used to validate the models. A comparative analysis between traditional FE, CPFE and experiments was conducted. The CPFE model was able to correlate the experiments more closely compared to traditional FE analysis because of its ability to capture micro-mechanical anisotropic behavior. Further analysis was conducted to evaluate the effect of IMC thickness on stress distribution in micro-bumps using a systematic numerical experiment with IMC thickness ranging from 0% to 80%. The analysis was conducted on micro-bumps with single crystal Sn and bicrystal Sn. The overall stress distribution and shear deformation changes as the IMC thickness increases. The model with higher IMC thickness shows a stiffer shear response, and provides a higher shear yield strength.

  1. Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows

    Science.gov (United States)

    Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

    2016-12-01

    Controlling the size, dispersion, and stability of intermetallic compounds in lead-free solder alloys is vital to creating reliable solder joints regardless of how many times the solder joints are melted and resolidified (reflowed) during circuit board assembly. In this article, the coarsening behavior of Cu x Al y and Cu6Sn5 in two Sn-Cu-Al alloys, a Sn-2.59Cu-0.43Al at. pct alloy produced via drip atomization and a Sn-5.39Cu-1.69Al at. pct alloy produced via melt spinning at a 5-m/s wheel speed, was characterized after multiple (1-5) reflow cycles via differential scanning calorimetry between the temperatures of 293 K and 523 K (20 °C and 250 °C). Little-to-no coarsening of the Cu x Al y particles was observed for either composition; however, clustering of Cu x Al y particles was observed. For Cu6Sn5 particle growth, a bimodal size distribution was observed for the drip atomized alloy, with large, faceted growth of Cu6Sn5 observed, while in the melt spun alloy, Cu6Sn5 particles displayed no significant increase in the average particle size, with irregularly shaped, nonfaceted Cu6Sn5 particles observed after reflow, which is consistent with shapes observed in the as-solidified alloys. The link between original alloy composition, reflow undercooling, and subsequent intermetallic coarsening behavior was discussed by using calculated solidification paths. The reflowed microstructures suggested that the heteroepitaxial relationship previously observed between the Cu x Al y and the Cu6Sn5 was maintained for both alloys.

  2. The Effects of Shoulder- Girdle Muscles Fatigue on Ground Reaction Force, Elbow and Shoulder Joint Angle, and Accuracy of the Athletic Performance in Handball Penalty Throws

    Directory of Open Access Journals (Sweden)

    Mona Shiravand

    2017-09-01

    Discussion: As the subjects were professional, muscle fatigue did not have a significant effect on postural control, angles and angular velocity; but did affect the reaction force and accuracy of the throws before and after fatigue, which could ultimately affect the performance of athletes and competition results.

  3. Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X = Bi, In) solders with Cu substrate

    International Nuclear Information System (INIS)

    Hodulova, Erika; Palcut, Marian; Lechovic, Emil; Simekova, Beata; Ulrich, Koloman

    2011-01-01

    Highlights: → In substitutes Sn in intermetallic compounds formed at the Cu-solder interface. → Bi and In decrease the parabolic rate constant of Cu 3 Sn layer growth. → In increases the parabolic rate constant of Cu 6 Sn 5 layer growth. → High In concentrations should be avoided since they may lead to a pre-mature solder joint degradation. - Abstract: The effects of Bi and In additions on intermetallic phase formation in lead-free solder joints of Sn-3.7Ag-0.7Cu; Sn-1.0Ag-0.5Cu-1.0Bi and Sn-1.5Ag-0.7Cu-9.5In (composition given in weight %) with copper substrate are studied. Soldering of copper plate was conducted at 250 deg. C for 5 s. The joints were subsequently aged at temperatures of 130-170 deg. C for 2-16 days in a convection oven. The aged interfaces were analyzed by optical microscopy and energy dispersive X-ray spectroscopy (EDX) microanalysis. Two intermetallic layers are observed at the interface - Cu 3 Sn and Cu 6 Sn 5 . Cu 6 Sn 5 is formed during soldering. Cu 3 Sn is formed during solid state ageing. Bi and In decrease the growth rate of Cu 3 Sn since they appear to inhibit tin diffusion through the grain boundaries. Furthermore, indium was found to produce a new phase - Cu 6 (Sn,In) 5 instead of Cu 6 Sn 5 , with a higher rate constant. The mechanism of the Cu 6 (Sn,In) 5 layer growth is discussed and the conclusions for the optimal solder chemical composition are presented.

  4. Laser-activated protein solder for peripheral nerve repair

    Science.gov (United States)

    Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

    1995-05-01

    A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

  5. Fatigue analysis of aluminum drill pipes

    Directory of Open Access Journals (Sweden)

    João Carlos Ribeiro Plácido

    2005-12-01

    Full Text Available An experimental program was performed to investigate the fundamental fatigue mechanisms of aluminum drill pipes. Initially, the fatigue properties were determined through small-scale tests performed in an optic-mechanical fatigue apparatus. Additionally, full-scale fatigue tests were carried out with three aluminum drill pipe specimens under combined loading of cyclic bending and constant axial tension. Finally, a finite element model was developed to simulate the stress field along the aluminum drill pipe during the fatigue tests and to estimate the stress concentration factors inside the tool joints. By this way, it was possible to estimate the stress values in regions not monitored during the fatigue tests.

  6. Integration of environmentally compatible soldering technologies for waste minimization

    International Nuclear Information System (INIS)

    Hosking, F.M.

    1992-01-01

    There has been a concentrated effort throughout the international microelectronics industry to phase out chlorofluorocarbon (CFC) materials and alleviate the serious problem of ozone depletion created by the release of CFCS. The development of more environmentally compatible manufacturing technologies is the cornerstone of this effort. Alternative materials and processes for cleaning and soldering have received special attention. Electronic. soldering typically utilizes rosin-based fluxes to promote solder wettability. Flux residues must be removed from the soldered parts when high product reliability is essential. Halogenated or CFC solvents have been the principle chemicals used to clean the residues. With the accelerated push to eliminate CFCs in the US by 1995, CFC-free solvents, aqueous-based cleaning, water soluble or ''no clean'' fluxes, and fluxless soldering technologies are being developed and quickly integrated into manufacturing practice. Sandia's Center for Solder Science and Technology has been ch g a variety of fluxless and alternative soldering technologies for DOE's waste minimization program. The work has focused on controlled atmosphere, laser, and ultrasonic fluxless soldering, protective metallic and organic coatings, and fluxes which have water soluble or low solids-based chemistries. With the increasing concern that Pb will also be banned from electronic soldering, Sandia has been characterizing the wetting, aging, and mechanical properties of Pb-fire solder alloys. The progress of these integrated studies will be discussed. Their impact on environmentally compatible manufacturing will be emphasized. Since there is no universal solution to the various environmental, safety, and health issues which currently face industry, the proposed technologies offer several complementary materials and processing options from which one can choose

  7. In vitro fatigue tests and in silico finite element analysis of dental implants with different fixture/abutment joint types using computer-aided design models.

    Science.gov (United States)

    Yamaguchi, Satoshi; Yamanishi, Yasufumi; Machado, Lucas S; Matsumoto, Shuji; Tovar, Nick; Coelho, Paulo G; Thompson, Van P; Imazato, Satoshi

    2018-01-01

    The aim of this study was to evaluate fatigue resistance of dental fixtures with two different fixture-abutment connections by in vitro fatigue testing and in silico three-dimensional finite element analysis (3D FEA) using original computer-aided design (CAD) models. Dental implant fixtures with external connection (EX) or internal connection (IN) abutments were fabricated from original CAD models using grade IV titanium and step-stress accelerated life testing was performed. Fatigue cycles and loads were assessed by Weibull analysis, and fatigue cracking was observed by micro-computed tomography and a stereomicroscope with high dynamic range software. Using the same CAD models, displacement vectors of implant components were also analyzed by 3D FEA. Angles of the fractured line occurring at fixture platforms in vitro and of displacement vectors corresponding to the fractured line in silico were compared by two-way ANOVA. Fatigue testing showed significantly greater reliability for IN than EX (pimplant fixture platforms. FEA demonstrated that crack lines of both implant systems in vitro were observed in the same direction as displacement vectors of the implant fixtures in silico. In silico displacement vectors in the implant fixture are insightful for geometric development of dental implants to reduce complex interactions leading to fatigue failure. Copyright © 2017 Japan Prosthodontic Society. Published by Elsevier Ltd. All rights reserved.

  8. Electrical characteristics for Sn-Ag-Cu solder bump with Ti/Ni/Cu under-bump metallization after temperature cycling tests

    Science.gov (United States)

    Shih, T. I.; Lin, Y. C.; Duh, J. G.; Hsu, Tom

    2006-10-01

    Lead-free solder bumps have been widely used in current flip-chip technology (FCT) due to environmental issues. Solder joints after temperature cycling tests were employed to investigate the interfacial reaction between the Ti/Ni/Cu under-bump metallization and Sn-Ag-Cu solders. The interfacial morphology and quantitative analysis of the intermetallic compounds (IMCs) were obtained by electron probe microanalysis (EPMA) and field emission electron probe microanalysis (FE-EPMA). Various types of IMCs such as (Cu1-x,Agx)6Sn5, (Cu1-y,Agy)3Sn, and (Ag1-z,Cuz)3Sn were observed. In addition to conventional I-V measurements by a special sample preparation technique, a scanning electron microscope (SEM) internal probing system was introduced to evaluate the electrical characteristics in the IMCs after various test conditions. The electrical data would be correlated to microstructural evolution due to the interfacial reaction between the solder and under-bump metallurgy (UBM). This study demonstrated the successful employment of an internal nanoprobing approach, which would help further understanding of the electrical behavior within an IMC layer in the solder/UBM assembly.

  9. Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/ Pd/ Au surface finishes

    International Nuclear Information System (INIS)

    NorAkmal, F.; Ourdjini, A.; Azmah Hanim, M.A.; Siti Aisha, I.; Chin, Y.T.

    2007-01-01

    Flip chip technology provides the ultimate in high I/ O-density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) which is widely used in electronics packaging as surface finish for flip-chip application nowadays. In this research, field emission scanning electron microscopy (FESEM) analysis was conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between the SAC lead-free solder with Cu surface finish after reflow were mainly (Cu, Ni) 6 Sn 5 and Cu 6 Sn 5 . While the main IMCs formed between lead-free solder on ENEPIG surface finish are (Ni, Cu) 3 Sn 4 and Ni 3 Sn 4 . The results from FESEM with energy dispersive x-ray (EDX) have revealed that isothermal aging at 150 degree Celsius has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated was found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. (author)

  10. Soldering formalism in noncommutative field theory: a brief note

    International Nuclear Information System (INIS)

    Ghosh, Subir

    2004-01-01

    In this Letter, I develop the soldering formalism in a new domain--the noncommutative planar field theories. The soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair of noncommutative Maxwell-Chern-Simons theories, having opposite signs in their respective topological terms, can be consistently soldered to yield the Proca model (Maxwell theory with a mass term) with corrections that are at least quadratic in the noncommutativity parameter. We further argue that this model can be thought of as the noncommutative generalization of the Proca theory of ordinary spacetime. It is well known that abelian noncommutative gauge theory bears a close structural similarity with non-abelian gauge theory. This fact is manifested in a non-trivial way if the present Letter is compared with existing literature, where soldering of non-abelian models are discussed. Thus the present work further establishes the robustness of the soldering programme. The subtle role played by gauge invariance (or the lack of it), in the above soldering process, is revealed in an interesting way

  11. Utilization of Pb-free solders in MEMS packaging

    Science.gov (United States)

    Selvaduray, Guna S.

    2003-01-01

    Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

  12. FY 1998 report on the waste processing/recycling related technology, 'The R and D of lead-free solder standardization'; 1998 nendo haikibutsu shori recycle kanren gijutsu seika hokokusho. Namari free handa kikakuka nado kenkyu kaihatsu

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2000-03-01

    To reduce the environmental pollution caused by lead eluted from the electronic equipment waste, the R and D on lead-free solder were conducted and the results were summarized. As to the basic characteristics, the evaluation test method was studied in terms of the range of melting temperature, mechanical strength, wettability and joint strength, to select a uniform test method. As the lead-free solder, Sn-Ag alloys were mainly used and mixed in a combination of Cu, Bi and In. Changes in characteristics were made clear by adding trace elements such as Ge, Mn and P. Relating to the applied characteristics, in selection of solder materials, materials were selected for which evaluation of the commercialization is proceeded with from a viewpoint of promotion of commercialization. Concerning the experimental evaluation of characteristics of lead-free solder in mounted substrates, it was indicated that basically lead-free solder can be practically used. Further, it was indicated that the Sn-Ag-Cu-Bi system depends not on solder composition but on active force, printing accuracy and flux characteristic of solder paste, that improvement of solder paste has an effect on mounting characteristics. (NEDO)

  13. Thermal fatigue. Materials modelling

    International Nuclear Information System (INIS)

    Siegele, D.; Fingerhuth, J.; Mrovec, M.

    2012-01-01

    In the framework of the ongoing joint research project 'Thermal Fatigue - Basics of the system-, outflow- and material-characteristics of piping under thermal fatigue' funded by the German Federal Ministry of Education and Research (BMBF) fundamental numerical and experimental investigations on the material behavior under transient thermal-mechanical stress conditions (high cycle fatigue V HCF and low cycle fatigue - LCF) are carried out. The primary objective of the research is the further development of simulation methods applied in safety evaluations of nuclear power plant components. In this context the modeling of crack initiation and growth inside the material structure induced by varying thermal loads are of particular interest. Therefore, three scientific working groups organized in three sub-projects of the joint research project are dealing with numerical modeling and simulation at different levels ranging from atomistic to micromechanics and continuum mechanics, and in addition corresponding experimental data for the validation of the numerical results and identification of the parameters of the associated material models are provided. The present contribution is focused on the development and experimental validation of material models and methods to characterize the damage evolution and the life cycle assessment as a result of thermal cyclic loading. The individual purposes of the subprojects are as following: - Material characterization, Influence of temperature and surface roughness on fatigue endurances, biaxial thermo-mechanical behavior, experiments on structural behavior of cruciform specimens and scatter band analysis (IfW Darmstadt) - Life cycle assessment with micromechanical material models (MPA Stuttgart) - Life cycle assessment with atomistic and damage-mechanical material models associated with material tests under thermal fatigue (Fraunhofer IWM, Freiburg) - Simulation of fatigue crack growth, opening and closure of a short crack under

  14. Adrenal Fatigue

    Science.gov (United States)

    ... Search Featured Resource New Mobile App DOWNLOAD Adrenal Fatigue October 2017 Download PDFs English Editors Irina Bancos, MD Additional Resources Mayo Clinic What is adrenal fatigue? The term “adrenal fatigue” has been used to ...

  15. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

  16. Manipulation and soldering of carbon nanotubes using atomic force microscope

    International Nuclear Information System (INIS)

    Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

    2008-01-01

    Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

  17. A multi-feature integration method for fatigue crack detection and crack length estimation in riveted lap joints using Lamb waves

    Data.gov (United States)

    National Aeronautics and Space Administration — This paper presents an experimental study of damage detection and quantification in riveted lap joints. Embedded lead zirconate titanate piezoelectric (PZT) ceramic...

  18. Evaluación del comportamiento a fatiga de una unión soldada a tope de acero AISI 1015//Evaluation of the fatigue behaviour of a butt welded joint of AISI 1015 steel

    Directory of Open Access Journals (Sweden)

    Pavel Michel Almaguer‐Zaldivar

    2015-01-01

    Full Text Available Las uniones soldadas son un componente importante de una estructura, por lo que siempre es necesario conocer la respuesta de las mismas sometidas a cargas cíclicas. El objetivo de este trabajo es obtener la curva S-N de una unión soldada a tope de acero AISI 1015 y electrodo E6013 como material de aporte. Los ensayos a fatiga se realizaron de acuerdo a la norma ASTM en una máquina universal MTS810. Se utilizaron probetas de sección rectangular. El ciclo de carga fueasimétrico a tracción, con un coeficiente de asimetría de 0,1. Se obtuvo que la unión estudiada tiene un límite de resistencia a la fatiga de 178 MPa, a un punto de corte de 2 039 093 ciclos.Palabras claves: unión soldada, fatiga, curva S-N, AISI 1015, electrodo E6013._______________________________________________________________________________AbstractWelded joints are an important component in structures, by this reason is necessary to know the behaviour of these elements under cyclic loads. The objective of this work is to obtain the S-N curve of the butt welded joint of AISI 1015 steel and electrode E6013 as the contribution material. Fatiguetest was realized within the ASTM standard in the MTS810 testing machine. Rectangular cross section specimens was used. Cyclic loads was asymmetric tensile and the asymmetry ratio used was 0,1. In this study was obtained the fatigue limit equal to 178 MPa, at the cut point of 2 039 093 cycles.Key words: welded joint, fatigue, S-N curve, AISI 1015 steel, electrode E6013.

  19. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  20. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2009-03-01

    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  1. Tensile strength of two soldered alloys (Minalux and Verabond2

    Directory of Open Access Journals (Sweden)

    Mir Mohammad Rezaee S

    2002-07-01

    Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

  2. Lead-free solder technology transfer from ASE Americas

    Energy Technology Data Exchange (ETDEWEB)

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  3. PDS 1-5. Divertor heat sink materials pre- and post-neutron irradiation. Tensile and fatigue tests of brazed joints of molybdenum alloys and 316L stainless steel

    International Nuclear Information System (INIS)

    Lind, Anders.

    1994-01-01

    Tensile specimens from brazed joints of molybdenum alloys (TZM or Mo-5%Re) and Type 316L austenitic stainless steel tubes have been tested at ambient temperature and 127 degrees C before and after neutron irradiation at about 40 degrees C to approximately 0.2 dpa. The unirradiated specimens showed generally ductile behaviour, but the irradiated specimens were notch sensitive and failed in a brittle manner with zero elongation; in all cases the fracture occurred in the molybdenum alloy. The brittle behaviour is consistent with previously published data and results from the increase in strength (radiation hardening) and the associated increase in the ductile-brittle transition temperature (radiation embrittlement) induced in the body-centered-cubic (BCC) molybdenum alloys by irradiation to relatively low displacement doses. The same type of irradiated specimens were also used in fatigue tests. However, the results from the fatigue tests are too limited and complementary studies are needed. During exposure to water locally up to 25% of the wall thickness of the Mo-alloys has corroded away. These observations cast serious doubts on the viability of the molybdenum alloys for divertor applications in fusion systems. 8 refs, 29 figs

  4. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

    International Nuclear Information System (INIS)

    Sujan, G.K.; Haseeb, A.S.M.A.; Afifi, A.B.M.

    2014-01-01

    Lead free solders currently in use are prone to develop thick interfacial intermetallic compound layers with rough morphology which are detrimental to the long term solder joint reliability. A novel method has been developed to control the morphology and growth of intermetallic compound layers between lead-free Sn–3.0Ag–0.5Cu solder ball and copper substrate by doping a water soluble flux with metallic nanoparticles. Four types of metallic nanoparticles (nickel, cobalt, molybdenum and titanium) were used to investigate their effects on the wetting behavior and interfacial microstructural evaluations after reflow. Nanoparticles were dispersed manually with a water soluble flux and the resulting nanoparticle doped flux was placed on copper substrate. Lead-free Sn–3.0Ag–0.5Cu solder balls of diameter 0.45 mm were placed on top of the flux and were reflowed at a peak temperature of 240 °C for 45 s. Angle of contact, wetting area and interfacial microstructure were studied by optical microscopy, field emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. It was observed that the angle of contact increased and wetting area decreased with the addition of cobalt, molybdenum and titanium nanoparticles to flux. On the other hand, wettability improved with the addition of nickel nanoparticles. Cross-sectional micrographs revealed that both nickel and cobalt nanoparticle doping transformed the morphology of Cu 6 Sn 5 from a typical scallop type to a planer one and reduced the intermetallic compound thickness under optimum condition. These effects were suggested to be related to in-situ interfacial alloying at the interface during reflow. The minimum amount of nanoparticles required to produce the planer morphology was found to be 0.1 wt.% for both nickel and cobalt. Molybdenum and titanium nanoparticles neither appear to undergo alloying during reflow nor have any influence at the solder/substrate interfacial reaction. Thus, doping of flux

  5. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sujan, G.K., E-mail: sgkumer@gmail.com; Haseeb, A.S.M.A., E-mail: haseeb@um.edu.my; Afifi, A.B.M., E-mail: amalina@um.edu.my

    2014-11-15

    Lead free solders currently in use are prone to develop thick interfacial intermetallic compound layers with rough morphology which are detrimental to the long term solder joint reliability. A novel method has been developed to control the morphology and growth of intermetallic compound layers between lead-free Sn–3.0Ag–0.5Cu solder ball and copper substrate by doping a water soluble flux with metallic nanoparticles. Four types of metallic nanoparticles (nickel, cobalt, molybdenum and titanium) were used to investigate their effects on the wetting behavior and interfacial microstructural evaluations after reflow. Nanoparticles were dispersed manually with a water soluble flux and the resulting nanoparticle doped flux was placed on copper substrate. Lead-free Sn–3.0Ag–0.5Cu solder balls of diameter 0.45 mm were placed on top of the flux and were reflowed at a peak temperature of 240 °C for 45 s. Angle of contact, wetting area and interfacial microstructure were studied by optical microscopy, field emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. It was observed that the angle of contact increased and wetting area decreased with the addition of cobalt, molybdenum and titanium nanoparticles to flux. On the other hand, wettability improved with the addition of nickel nanoparticles. Cross-sectional micrographs revealed that both nickel and cobalt nanoparticle doping transformed the morphology of Cu{sub 6}Sn{sub 5} from a typical scallop type to a planer one and reduced the intermetallic compound thickness under optimum condition. These effects were suggested to be related to in-situ interfacial alloying at the interface during reflow. The minimum amount of nanoparticles required to produce the planer morphology was found to be 0.1 wt.% for both nickel and cobalt. Molybdenum and titanium nanoparticles neither appear to undergo alloying during reflow nor have any influence at the solder/substrate interfacial reaction. Thus, doping

  6. Fatigue life estimation of welded joints of an aluminium alloy under superimposed random load waves (follow-up report). Effects of high frequency components; Jujo random kajuka ni okeru aluminium gokin yosetsu tsugite no hiro jumyo suitei (zokuho). Koshuha seibun no eikyo

    Energy Technology Data Exchange (ETDEWEB)

    Takahashi, I.; Maenaka, H.; Takada, A. [Ship Research Inst., Tokyo (Japan)

    1996-12-31

    In order to examine fatigue behavior of boxing welded joints of anticorrosion aluminum A 5083 P-O alloy, the residual stress measurements, static loading tests, elastic finite element analyses, constant amplitude fatigue tests, and random fatigue tests were conducted. For a load wave in the random loading fatigue tests, a direct current component, a zero-mean narrow band random process, and a high frequency component were combined and superimposed, to examine the effect of the high frequency component and the effect of the stress cycle count method and the mean stress correction on the life estimation. For the fatigue analysis, a reference stress, such as that considering the structural stress concentration, was proved effective in reducing the amount of scattering in the fatigue test results and in improving the life estimation accuracy. Accordingly, for the actual scale measurements, it is insufficient only to measure the stress at points far from the crack initiation place. It is required to analyze the fatigue by measuring the reference stress same as the basic data acquisition tests in the laboratory. 4 refs., 21 figs., 4 tabs.

  7. Fatigue life estimation of welded joints of an aluminium alloy under superimposed random load waves (follow-up report). Effects of high frequency components; Jujo random kajuka ni okeru aluminium gokin yosetsu tsugite no hiro jumyo suitei (zokuho). Koshuha seibun no eikyo

    Energy Technology Data Exchange (ETDEWEB)

    Takahashi, I; Maenaka, H; Takada, A [Ship Research Inst., Tokyo (Japan)

    1997-12-31

    In order to examine fatigue behavior of boxing welded joints of anticorrosion aluminum A 5083 P-O alloy, the residual stress measurements, static loading tests, elastic finite element analyses, constant amplitude fatigue tests, and random fatigue tests were conducted. For a load wave in the random loading fatigue tests, a direct current component, a zero-mean narrow band random process, and a high frequency component were combined and superimposed, to examine the effect of the high frequency component and the effect of the stress cycle count method and the mean stress correction on the life estimation. For the fatigue analysis, a reference stress, such as that considering the structural stress concentration, was proved effective in reducing the amount of scattering in the fatigue test results and in improving the life estimation accuracy. Accordingly, for the actual scale measurements, it is insufficient only to measure the stress at points far from the crack initiation place. It is required to analyze the fatigue by measuring the reference stress same as the basic data acquisition tests in the laboratory. 4 refs., 21 figs., 4 tabs.

  8. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    /methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base...... titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

  9. Fatigue life assessment of thin-walled welded joints under non-proportional load-time histories by the shear stress rate integral approach

    Directory of Open Access Journals (Sweden)

    A. Bolchoun

    2016-10-01

    Full Text Available Fatigue life tests under constant and variable amplitude loadings were performed on the tube-tube thin-walled welded specimens made of magnesium (AZ31 and AZ61 alloys. The tests included pure axial, pure torsional and combined in-phase and out-of-phase loadings with the load ratio  RR " ", " " 1  . For the tests with variable amplitude loads a Gaußdistributed loading spectrum with S L 4 5 10  cycles was used. Since magnesium welds show a fatigue life reduction under out-of-phase loads, a stress-based method, which takes this behavior into account, is proposed. The out-of-phase loading results in rotating shear stress vectors in the section planes, which are not orthogonal to the surface. This fact is used in order to provide an out-of-phase measure of the load. This measure is computed as an area covered by the shear stress vectors in all planes over a certain time interval, its computation involves the shear stress and the shear stress rate vectors in the individual planes. Fatigue life evaluation for the variable amplitudes loadings is performed using the Palmgren-Miner linear damage accumulation, whereas the total damage of every cycle is split up into two components: the amplitude component and the out-of-phase component. In order to compute the two components a modification of the rainflow counting method, which keeps track of the time intervals, where the cycles occur, must be used. The proposed method also takes into account different slopes of the pure axial and the pure torsional Wöhler-line by means of a Wöhler-line interpolation for combined loadings

  10. Commentary: Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    Menovsky, T.; Beek, J.F.; Gemert, M.J.C. van

    1999-01-01

    Full text: Laser tissue welding is the process of using laser energy to join tissues without sutures or with a reduced number of sutures. Recently, diode lasers have been added to the list of fusion lasers (Lewis and Uribe 1993, Reali et al 1993). Typically, for tissue welding, deep penetrating diode lasers emitting at 800-810 nm are used, in combination with a strong absorbing protein solder containing the dye indocyanine green. Indocyanine green has a maximum absorption coefficient at 805 nm and binds preferentially with proteins (Sauda et al 1986). The greatest advantage of diode lasers is their compact size, easy use and low cost. In this issue of Physics in Medicine and Biology (pp 983-1002, 'Photothermal effects of laser tissue soldering'), in an in vitro study, McNally et al investigate the optimal laser settings and welding temperatures in relation to the tensile strength and thermal damage of bovine aorta specimens. An interesting statement in their introduction is that the low strength of laser produced anastomoses can lead to aneurysm formation. The increased chance of aneurysm formation may merely be due to the thermal effect of the laser on the vascular wall, especially on the adventitia and media layers, which become necrotic after thermal injury. Subsequent haemodynamic stress exerted on a damaged vascular wall is a significant contributing factor for aneurysmal initiation. Also interesting is the remark that 'by the application of wavelength-specific chromophores in tissue welding ... the requirement for precise focusing and aiming of the laser beam may be removed'. Though perhaps not yet fully justified, this statement, if true, would facilitate surgical procedures. While the experiments are conducted in a proper manner, the use of bovine aorta specimens, which were stored at -70 deg. C and subsequently thawed for the tissue welding experiments, may not be the most appropriate for studying tissue effects or tensile strength measurements, as the

  11. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

  12. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

  13. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

  14. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan

    2009-01-01

    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work...

  15. Seafarer fatigue

    DEFF Research Database (Denmark)

    Jepsen, Jørgen Riis; Zhao, Zhiwei; van Leeuwen, Wessel M. A.

    2015-01-01

    Background: The consequences of fatigue for the health and safety of seafarers has caused concern in the industry and among academics, and indicates the importance of further research into risk factors and preventive interventions at sea. This review gives an overview of the key issues relating...... to seafarer fatigue. Materials and methods: A literature study was conducted aiming to collect publications that address risk factors for fatigue, short-term and long-term consequences for health and safety, and options for fatigue mitigation at sea. Due to the limited number of publications that deals...... with seafarers, experiences from other populations sharing the same exposures (e.g. shift work) were also included when appropriate. Results: Work at sea involves multiple risk factors for fatigue, which in addition to acute effects (e.g., impaired cognition, accidents) contributes through autonomic, immunologic...

  16. Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

    Science.gov (United States)

    Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

    2018-03-01

    The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

  17. Automation of experimental research of waveguide paths induction soldering

    Science.gov (United States)

    Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

    2018-05-01

    The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

  18. Optimization of the soldering process by the DMAIC methodology

    Directory of Open Access Journals (Sweden)

    Michał Zasadzień

    2016-06-01

    Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

  19. Drinking Water Contamination Due To Lead-based Solder

    Science.gov (United States)

    Garcia, N.; Bartelt, E.; Cuff, K. E.

    2004-12-01

    The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

  20. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan

    2017-08-10

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  1. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong

    2017-01-01

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  2. The development of a graphite to copper joint for injector diagnostics

    International Nuclear Information System (INIS)

    Baker, D.

    1975-09-01

    A successful method of joining soft graphite to copper, to achieve a high thermal conductivity joint, is described, together with initial attempts and the difficulties experienced. The graphite, after an initial treatment, was flame sprayed with copper. The main copper-to-graphite joint was of silver solder. (U.K.)

  3. Fatigue in Steel Structures under Random Loading

    DEFF Research Database (Denmark)

    Agerskov, Henning

    1999-01-01

    types of welded plate test specimens and full-scale offshore tubular joints. The materials that have been used are either conventional structural steel with a yield stress of ~ 360-410 MPa or high-strength steel with a yield stress of ~ 810-1010 MPa. The fatigue tests and the fracture mechanics analyses......Fatigue damage accumulation in steel structures under random loading is studied. The fatigue life of welded joints has been determined both experimentally and from a fracture mechanics analysis. In the experimental part of the investigation, fatigue test series have been carried through on various...... have been carried out using load histories, which are realistic in relation to the types of structures studied, i.e. primarily bridges, offshore structures and chimneys. In general, the test series carried through show a significant difference between constant amplitude and variable amplitude fatigue...

  4. Fatigue (PDQ)

    Science.gov (United States)

    ... Data Conducting Clinical Trials Statistical Tools and Data Terminology Resources NCI Data Catalog Cryo-EM NCI's Role ... Problems getting enough sleep. Being less active. Other medical conditions. Fatigue is common in people with advanced ...

  5. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    DEFF Research Database (Denmark)

    High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

  6. Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

    Science.gov (United States)

    This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

  7. Multi-scale modeling of elasto-plastic response of SnAgCu lead-free solder alloys at different ageing conditions: Effect of microstructure evolution, particle size effects and interfacial failure

    Energy Technology Data Exchange (ETDEWEB)

    Maleki, Milad; Cugnoni, Joel, E-mail: joel.cugnoni@epfl.ch; Botsis, John

    2016-04-20

    In microelectronics applications, SnAgCu lead-free solder joints play the important role of ensuring both the mechanical and electrical integrity of the components. In such applications, the SnAgCu joints are subjected to elevated homologous temperatures for an extended period of time causing significant microstructural changes and leading to reliability issues. In this study, the link between the change in microstructures and deformation behavior of SnAgCu solder during ageing is explained by developing a hybrid multi-scale microstructure-based modeling approach. Herein, the SnAgCu solder alloy is seen as a three phase metal matrix composite in which Ag{sub 3}Sn and Cu{sub 6}Sn{sub 5} hard intermetallics play the role of reinforcements and Sn the role of a ductile matrix. The hardening of the Sn matrix due to fine intermetallics in the eutectic mixture is modeled by incorporating the mean field effects of geometrically necessary dislocations. Subsequently, a two level homogenization procedure based on micromechanical finite element (FE) models is used to capture the interactions between the different phases. For this purpose, tomographic images of microstructures obtained by Focused Ion Beam (FIB) and synchrotron X-Ray in different ageing conditions are directly used to generate statistically representative volume elements (RVE) using 3D FE models. The constitutive behavior of the solder is determined by sequentially performing two scales of numerical homogenization at the eutectic level and then at the dendrite level. For simplification, the anisotropy of Sn as well as the potential recovery processes have been neglected in the modeling. The observed decrease in the yield strength of solder due to ageing is well captured by the adopted modeling strategy and allows explaining the different ageing mechanisms. Finally, the effects of potential debonding at the intermetallic particle-matrix interface as well as particle fracture on the overall strength of solder are

  8. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Silva, Bismarck L., E-mail: bismarck_luiz@yahoo.com.br [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, 13083-860 Campinas, SP (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil)

    2016-04-15

    Low temperature soldering technology encompasses Sn–Bi based alloys as reference materials for joints since such alloys may be molten at temperatures less than 180 °C. Despite the relatively high strength of these alloys, segregation problems and low ductility are recognized as potential disadvantages. Thus, for low-temperature applications, Bi–Sn eutectic or near-eutectic compositions with or without additions of alloying elements are considered interesting possibilities. In this context, additions of third elements such as Cu and Ag may be an alternative in order to reach sounder solder joints. The length scale of the phases and their proportions are known to be the most important factors affecting the final wear, mechanical and corrosions properties of ternary Sn–Bi–(Cu,Ag) alloys. In spite of this promising outlook, studies emphasizing interrelations of microstructure features and solidification thermal parameters regarding these multicomponent alloys are rare in the literature. In the present investigation Sn–Bi–(Cu,Ag) alloys were directionally solidified (DS) under transient heat flow conditions. A complete characterization is performed including experimental cooling thermal parameters, segregation (XRF), optical and scanning electron microscopies, X-ray diffraction (XRD) and length scale of the microstructural phases. Experimental growth laws relating dendritic spacings to solidification thermal parameters have been proposed with emphasis on the effects of Ag and Cu. The theoretical predictions of the Rappaz-Boettinger model are shown to be slightly above the experimental scatter of secondary dendritic arm spacings for both ternary Sn–Bi–Cu and Sn–Bi–Ag alloys examined. - Highlights: • Dendritic growth prevailed for the ternary Sn–Bi–Cu and Sn–Bi–Ag solder alloys. • Bi precipitates within Sn-rich dendrites were shown to be unevenly distributed. • Morphology and preferential region for the Ag{sub 3}Sn growth depend on Ag

  9. Microstructure characteristics of vacuum glazing brazing joints using laser sealing technique

    Science.gov (United States)

    Liu, Sixing; Yang, Zheng; Zhang, Jianfeng; Zhang, Shanwen; Miao, Hong; Zhang, Yanjun; Zhang, Qi

    2018-05-01

    Two pieces of plate glass were brazed into a composite of glazing with a vacuum chamber using PbO-TiO2-SiO2-RxOy powder filler alloys to develop a new type of vacuum glazing. The brazing process was carried out by laser technology. The interface characteristics of laser brazed joints formed between plate glass and solder were investigated using optical microscope, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD) techniques. The results show that the inter-diffusion of Pb/Ti/Si/O elements from the sealing solder toward the glass and O/Al/Si elements from the glass toward the solder, resulting in a reaction layer in the brazed joints. The microstructure phases of PbTiO3, AlSiO, SiO2 and PbO in the glass/solder interface were confirmed by XRD analysis. The joining of the sealing solder to the glass was realized by the reaction products like fibrous structures on interface, where the wetting layer can help improve the bonding performance and strength between the sealing solder and the plate glass during the laser brazing process.

  10. Fatigue in tension perpendicular to the grain

    DEFF Research Database (Denmark)

    Clorius, Christian Odin; Pedersen, Martin Bo Uhre; Hoffmeyer, Preben

    1999-01-01

    Traditinally fatigue resistance is quantified as number of cycles to failure at a given stress level. A previous study by the authors showed that fatigue in compression parallel to the grain is governed partly by duration of load and partly by an effect of loading, i.e. a combination of a creep...... mechanism and a mechanism connected to damage introduce in the loading sequences. The purpose of the present study is to disentangle the effect of duration of load from the effect of load oscillation in fatigue in tension perpendicular to the grain. Fatigue experiments are made on small specimens...... and on dowel type joints with slotted in steel plates. In series of ten, the small specimens are taken to fatigue failure in uniform tension at square wave shaped load cycles at 0.01 Hz and 0.1 Hz. In order to test the predictive validity of the result from the small tension specimens, fatigue experiments...

  11. Fatigue In Tension Perpendicular to the Grain

    DEFF Research Database (Denmark)

    Clorius, Christian Odin; Pedersen, Martin Uhre; Hoffmeyer, Preben

    2004-01-01

    Traditionally fatigue resistance is quantified as number of cycles to failure at a given stress level. A previous study by the authors showed that fatigue in compression parallel to the grain is governed partly by duration of load and partly by an effect of loading, i.e. a combination of a creep...... mechanism and a mechanism connected to damage introduced in the loading sequences. The purpose of the present study is to disentangle the effect of duration of load from the effect of load oscillation in fatigue in tension perpendicular to the grain. Fatigue experiments are made on small specimens...... and on dowel type joints with slotted in steel plates. In series of ten, the small specimens are taken to fatigue failure in uniform tension at square wave shaped load cycles at 0.01 Hz and 0.1 Hz. In arder to test the predictive validity of the result from the small tension specimens, fatigue experiments...

  12. Horizon shells and BMS-like soldering transformations

    Energy Technology Data Exchange (ETDEWEB)

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

    2016-03-07

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  13. Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

    2017-07-27

    Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integrated with attractive fabrication techniques for thermoelectric modules, such as screen printing, suggesting the potential of these solders in the rational design of printable and moldable thermoelectrics.

  14. Effects of PCB thickness on adjustable fountain wave soldering

    Indian Academy of Sciences (India)

    hybrid circuit assembly, component lead tinning, and wire tinning. .... The mesh model was built and optimized with 599920 hybrid nodes as shown in figure 9. ... conducted to track the fluid motions of the two phases (i.e., molten solder and air).

  15. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Directory of Open Access Journals (Sweden)

    Yee Mei Leong

    2016-06-01

    Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

  16. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Science.gov (United States)

    Leong, Yee Mei; Haseeb, A.S.M.A.

    2016-01-01

    Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

  17. Study of Diffusion Barrier for Solder/ n-Type Bi2Te3 and Bonding Strength for p- and n-Type Thermoelectric Modules

    Science.gov (United States)

    Lin, Wen-Chih; Li, Ying-Sih; Wu, Albert T.

    2018-01-01

    This paper investigates the interfacial reaction between Sn and Sn3Ag0.5Cu (SAC305) solder on n-type Bi2Te3 thermoelectric material. An electroless Ni-P layer successfully suppressed the formation of porous SnTe intermetallic compound at the interface. The formation of the layers between Bi2Te3 and Ni-P indicates that Te is the dominant diffusing species. Shear tests were conducted on both Sn and SAC305 solder on n- and p-type Bi2Te3 with and without a Ni-P barrier layer. Without a Ni-P layer, porous SnTe would result in a more brittle fracture. A comparison of joint strength for n- and p-type thermoelectric modules is evaluated by the shear test. Adding a diffusion barrier increases the mechanical strength by 19.4% in n-type and 74.0% in p-type thermoelectric modules.

  18. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Haiyan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Peng, Jianke [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Fu, Li, E-mail: fuli@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Wang, Xincheng [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Xie, Yan [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China)

    2016-04-15

    Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  19. Effects of soldering methods on tensile strength of a gold-palladium metal ceramic alloy.

    Science.gov (United States)

    Ghadhanfari, Husain A; Khajah, Hasan M; Monaco, Edward A; Kim, Hyeongil

    2014-10-01

    The tensile strength obtained by conventional postceramic application soldering and laser postceramic welding may require more energy than microwave postceramic soldering, which could provide similar tensile strength values. The purpose of the study was to compare the tensile strength obtained by microwave postceramic soldering, conventional postceramic soldering, and laser postceramic welding. A gold-palladium metal ceramic alloy and gold-based solder were used in this study. Twenty-seven wax specimens were cast in gold-palladium noble metal and divided into 4 groups: laser welding with a specific postfiller noble metal, microwave soldering with a postceramic solder, conventional soldering with the same postceramic solder used in the microwave soldering group, and a nonsectioned control group. All the specimens were heat treated to simulate a normal porcelain sintering sequence. An Instron Universal Testing Machine was used to measure the tensile strength for the 4 groups. The means were analyzed statistically with 1-way ANOVA. The surface and fracture sites of the specimens were subjectively evaluated for fracture type and porosities by using a scanning electron microscope. The mean (standard deviation) ultimate tensile strength values were as follows: nonsectioned control 818 ±30 MPa, microwave 516 ±34 MPa, conventional 454 ±37 MPa, and laser weld 191 ±39 MPa. A 1-way ANOVA showed a significant difference in ultimate tensile strength among the groups (F3,23=334.5; Ptensile strength for gold and palladium noble metals than either conventional soldering or laser welding. Conventional soldering resulted in a higher tensile strength than laser welding. Under the experimental conditions described, either microwave or conventional postceramic soldering would appear to satisfy clinical requirements related to tensile strength. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

  20. Mechanics of Suture Joints

    Science.gov (United States)

    Li, Yaning; Song, Juha; Ortiz, Christine; Boyce, Mary; Ortiz Group/DMSE/MIT Team; Boyce Group/ME/MIT Team

    2011-03-01

    Biological sutures are joints which connect two stiff skeletal or skeletal-like components. These joints possess a wavy geometry with a thin organic layer providing adhesion. Examples of biological sutures include mammalian skulls, the pelvic assembly of the armored fish Gasterosteus aculeatus (the three-spined stickleback), and the suture joints in the shell of the red-eared slider turtle. Biological sutures allow for movement and compliance, control stress concentrations, transmit loads, reduce fatigue stress and absorb energy. In this investigation, the mechanics of the role of suture geometry in providing a naturally optimized joint is explored. In particular, analytical and numerical micromechanical models of the suture joint are constructed. The anisotropic mechanical stiffness and strength are studied as a function of suture wavelength, amplitude and the material properties of the skeletal and organic components, revealing key insights into the optimized nature of these ubiquitous natural joints.

  1. Thermal Runaway of the 13 kA Busbar Joints in the LHC

    OpenAIRE

    Verweij, A P

    2010-01-01

    Triggered by the incident in the LHC in September 2008, the thermo-electrical stability of the 10,000 soldered busbar joints in the 13 kA circuits of the LHC has been re-assessed. For this purpose the computer model QP3 has been developed. In this paper the results of some calculations are presented, and it is shown how the results have been used to improve the quench detection system and ensure safe future operation. First the layout of the 13 kA circuits, the geometry of the soldered joints...

  2. Fatigue influences lower extremity angular velocities during a single-leg drop vertical jump

    OpenAIRE

    Tamura, Akihiro; Akasaka, Kiyokazu; Otsudo, Takahiro; Shiozawa, Junya; Toda, Yuka; Yamada, Kaori

    2017-01-01

    [Purpose] Fatigue alters lower extremity landing strategies and decreases the ability to attenuate impact during landing. The purpose of this study was to reveal the influence of fatigue on dynamic alignment and joint angular velocities in the lower extremities during a single leg landing. [Subjects and Methods] The 34 female college students were randomly assigned to either the fatigue or control group. The fatigue group performed single-leg drop vertical jumps before, and after, the fatigue...

  3. The metallurgical approach on the solder voids behaviour in surface mount devices

    International Nuclear Information System (INIS)

    Mohabattul Zaman Bukhari

    1996-01-01

    Solder voids are believed to cause poor heat dissiption in the Surface Mount devices and reduce the reliability of the devices at higher operating services. There are a lot of factors involved in creating voids such as gas/flux entrapment, wettability, outgasseous, air bubbles in the solder paste, inconsistency of solder coverage and improper metal scheme selection. This study was done to observe the behaviour of the solder voids in term of flux entrapmentt and wettability. It is believed that flux entrapment and wettability are verify this hypothesis. Two types of metal scheme were chosen which are Nickel (Ni) plated and Tin (Sn) plated heatsink. X-ray techniques such as Radiographic Inspection Analysis and EDAX were used to detect the minute solder voids. The solder voids observed on the heatsinks and Copper shims after the reflow process are believed to be a non contact voids that resulted from some portion of the surface not wetting properly

  4. A new method for soldering particle-reinforced aluminum metal matrix composites

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Jinbin; Mu, Yunchao [Zhongyuan University of Technology, Zhengzhou 450007 (China); Luo, Xiangwei [Zhengzhou University, Zhengzhou 450002 (China); Niu, Jitai, E-mail: niujitai@163.com [Zhongyuan University of Technology, Zhengzhou 450007 (China)

    2012-12-01

    Highlights: Black-Right-Pointing-Pointer Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. Black-Right-Pointing-Pointer The nickel plating is required on the surface of the composites before soldering. Black-Right-Pointing-Pointer Low welding temperature is set to avoid overheating of the matrix. Black-Right-Pointing-Pointer Chemical and metallurgical bonding of composites and Kovar is carried out. Black-Right-Pointing-Pointer High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al-SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe-Ni-Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn-Cd-Ag-Cu) with a melting point of about 400 Degree-Sign C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)-Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al-SiC composite.

  5. A new method for soldering particle-reinforced aluminum metal matrix composites

    International Nuclear Information System (INIS)

    Lu, Jinbin; Mu, Yunchao; Luo, Xiangwei; Niu, Jitai

    2012-01-01

    Highlights: ► Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. ► The nickel plating is required on the surface of the composites before soldering. ► Low welding temperature is set to avoid overheating of the matrix. ► Chemical and metallurgical bonding of composites and Kovar is carried out. ► High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al–SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe–Ni–Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn–Cd–Ag–Cu) with a melting point of about 400 °C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)–Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al–SiC composite.

  6. The Fatigue Behavior of Steel Structures under Random Loading

    DEFF Research Database (Denmark)

    Agerskov, Henning

    2008-01-01

    Fatigue damage accumulation in steel structures under random loading has been studied in a number of investigations at the Technical University of Denmark. The fatigue life of welded joints has been determined both experimentally and from a fracture mechanics analysis. In the experimental part...... and variable amplitude fatigue test results. Both the fracture mechanics analysis and the fatigue test results indicate that Miner’s rule, which is normally used in the design against fatigue in steel structures, may give results, which are unconservative, and that the validity of the results obtained from...

  7. Laser tissue welding mediated with a protein solder

    Science.gov (United States)

    Small, Ward, IV; Heredia, Nicholas J.; Celliers, Peter M.; Da Silva, Luiz B.; Eder, David C.; Glinsky, Michael E.; London, Richard A.; Maitland, Duncan J.; Matthews, Dennis L.; Soltz, Barbara A.

    1996-05-01

    A study of laser tissue welding mediated with an indocyanine green dye-enhanced protein solder was performed. Freshly obtained sections of porcine artery were used for the experiments. Sample arterial wall thickness ranged from two to three millimeters. Incisions approximately four millimeters in length were treated using an 805 nanometer continuous- wave diode laser coupled to a one millimeter diameter fiber. Controlled parameters included the power delivered by the laser, the duration of the welding process, and the concentration of dye in the solder. A two-color infrared detection system was constructed to monitor the surface temperatures achieved at the weld site. Burst pressure measurements were made to quantify the strengths of the welds immediately following completion of the welding procedure.

  8. Structure-property investigations on a laser beam welded dissimilar joint of aluminium AA6056 and titanium Ti6Al4V for aeronautical applications. Part II: resistance to fatigue crack propagation and fracture

    Energy Technology Data Exchange (ETDEWEB)

    Horstmann, M.; Ventzke, V.; Petrovski, B.; Kocak, M. [GKSS Research Centre Geesthacht, Institute of Materials Research, Materials Mechanics, Geesthacht (Germany); Kocik, R.; Tempus, G. [AIRBUS Deutschland GmbH, Metal Technology, Bremen (Germany); Vaidya, W.V.

    2009-10-15

    Investigations were continued on the dissimilar laser beam welds of AA6056 and Ti6Al4V, fabricated by inserting Ti-sheet into the profiled Al-sheet and melting AA6056 alone. By using microstructure, hardness and strength as the criteria, sites exhibiting non-uniform microstructure and localized plastic deformation due to strength mismatch were investigated in two orientations: crack parallel to the weld and crack perpendicular to the weld for fatigue crack propagation and fracture toughness at room temperature. Effect of temper of AA6056 on these properties was studied for two conditions; welding in T4 followed by post weld heat treatment T6, and welding in T6 and naturally aged for a defined period. The orientation ''crack parallel to the weld'' was investigated in 3 locations on the side of AA6056: the interface and the two changeovers on the Al-side. Firstly, between the fusion zone and the heat affected zone (3 mm from the interface) and secondly, between (primary) heat affected zone and towards the base material (7 mm from the interface). Although brittle intermetallic TiAl{sub 3} had been formed at the interface, uncontrolled separation or debonding at the interface was not observed. Insofar the bond quality of the weld was good. However, the ranking of interface was the lowest since fatigue crack propagation was relatively faster than that in the fusion zone and heat affected zone, and fracture toughness was low. Therefore, unstable fatigue crack propagation is observed when the crack propagates perpendicular to the weld from AA6056 towards Ti6Al4V. The results have shown that the dissimilar joints exhibit improved performance when laser beam welded in the T6 condition. (Abstract Copyright [2009], Wiley Periodicals, Inc.) [German] Teil II: Widerstand gegen Ermuedungsrissausbreitung und Bruch Die Untersuchungen an der laserstrahlgeschweissten Mischverbindung aus AA6056 und Ti6Al4V wurden fortgesetzt. Fuer die Ermuedungsrissausbreitungs

  9. On the Fatigue Analysis of Wind Turbines

    Energy Technology Data Exchange (ETDEWEB)

    Sutherland, Herbert J.

    1999-06-01

    Modern wind turbines are fatigue critical machines that are typically used to produce electrical power from the wind. Operational experiences with these large rotating machines indicated that their components (primarily blades and blade joints) were failing at unexpectedly high rates, which led the wind turbine community to develop fatigue analysis capabilities for wind turbines. Our ability to analyze the fatigue behavior of wind turbine components has matured to the point that the prediction of service lifetime is becoming an essential part of the design process. In this review paper, I summarize the technology and describe the ''best practices'' for the fatigue analysis of a wind turbine component. The paper focuses on U.S. technology, but cites European references that provide important insights into the fatigue analysis of wind turbines.

  10. Laser beam soldering of micro-optical components

    Science.gov (United States)

    Eberhardt, R.

    2003-05-01

    MOTIVATION Ongoing miniaturisation and higher requirements within optical assemblies and the processing of temperature sensitive components demands for innovative selective joining techniques. So far adhesive bonding has primarily been used to assemble and adjust hybrid micro optical systems. However, the properties of the organic polymers used for the adhesives limit the application of these systems. In fields of telecommunication and lithography, an enhancement of existing joining techniques is necessary to improve properties like humidity resistance, laserstability, UV-stability, thermal cycle reliability and life time reliability. Against this background laser beam soldering of optical components is a reasonable joining technology alternative. Properties like: - time and area restricted energy input - energy input can be controlled by the process temperature - direct and indirect heating of the components is possible - no mechanical contact between joining tool and components give good conditions to meet the requirements on a joining technology for sensitive optical components. Additionally to the laser soldering head, for the assembly of optical components it is necessary to include positioning units to adjust the position of the components with high accuracy before joining. Furthermore, suitable measurement methods to characterize the soldered assemblies (for instance in terms of position tolerances) need to be developed.

  11. Scalable Manufacturing of Solderable and Stretchable Physiologic Sensing Systems.

    Science.gov (United States)

    Kim, Yun-Soung; Lu, Jesse; Shih, Benjamin; Gharibans, Armen; Zou, Zhanan; Matsuno, Kristen; Aguilera, Roman; Han, Yoonjae; Meek, Ann; Xiao, Jianliang; Tolley, Michael T; Coleman, Todd P

    2017-10-01

    Methods for microfabrication of solderable and stretchable sensing systems (S4s) and a scaled production of adhesive-integrated active S4s for health monitoring are presented. S4s' excellent solderability is achieved by the sputter-deposited nickel-vanadium and gold pad metal layers and copper interconnection. The donor substrate, which is modified with "PI islands" to become selectively adhesive for the S4s, allows the heterogeneous devices to be integrated with large-area adhesives for packaging. The feasibility for S4-based health monitoring is demonstrated by developing an S4 integrated with a strain gauge and an onboard optical indication circuit. Owing to S4s' compatibility with the standard printed circuit board assembly processes, a variety of commercially available surface mount chip components, such as the wafer level chip scale packages, chip resistors, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating the versatile and modular nature of S4s. Tegaderm-integrated S4 respiration sensors are tested for robustness for cyclic deformation, maximum stretchability, durability, and biocompatibility for multiday wear time. The results of the tests and demonstration of the respiration sensing indicate that the adhesive-integrated S4s can provide end users a way for unobtrusive health monitoring. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  12. Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly

    Energy Technology Data Exchange (ETDEWEB)

    Mostafa Shalaby, Rizk; Kamal, Mustafa [Metal Physics Laboratory, Physics Department, Faculty of Science, Mansoura University, P.O.Box: 35516, Mansoura (Egypt); Ali, Esmail A.M. [Basic Science Department, Faculty of Engineering, University of Science & Technology (Yemen); Gumaan, Mohammed S., E-mail: m.gumaan1@gmail.com [Metal Physics Laboratory, Physics Department, Faculty of Science, Mansoura University, P.O.Box: 35516, Mansoura (Egypt); Basic Science Department, Faculty of Engineering, University of Science & Technology (Yemen)

    2017-04-06

    This paper aims to investigate the reliability of mechanical and creep behavior for the eutectic Sn-Ag and Sn-Ag-Cu Solder joints rapidly solidified after hot compressing (HC) in terms of structural changes and its relationship with thermal behavior, which has been discussed and compared with their properties before HC process by Mustafa et al. (2016) . These solder joints were prepared by melt-spinning technique and tested by HC at 30 MPa pressure and 150 °C for 90 min, their structural, mechanical and thermal properties after HC process have been investigated by X-ray diffraction (XRD), dynamic resonance techniques (DRT) and differential scanning calorimetry (DSC) techniques respectively and compared with these solders before HC. The results revealed that the pressure caused some fractures on the solders morphology surfaces. But some benefits for these solders have been occurred, like eliminating the internal stresses through recrystallization process whose evidence by the particle size increases after they HC, stabilized structure after HC was due to the metastable phases rearrangements, new intermetallic compounds (IMCs) formation, decreasing, melting temperature range (∆T), lattice strains (ƹ) and entropy change (S). These sequential benefits are considered to be the main reasons which lead to decreasing energy loss (Q{sup −1}), creep rate (É›) and thermal stability enhancement. Elastic modulus increment might be due to low elastic lattice distortions after HC, while the stress exponent (n) reduction refers to viscous glide mechanism of deformation after HC instead of climb deformation mechanism before HC.

  13. An overview of fatigue

    International Nuclear Information System (INIS)

    Mc Evily, A.J.

    1987-01-01

    Four topics are briefly discussed in this paper: fatigue crack initiation and growth in a nickel-base superalloy single crystal, the environment effect on near-threshold fatigue crack growth behaviour, the role of crack closure in load-interaction effects in fatigue crack growth, and the nature of creep-fatigue interactions, if any, during fatigue crack growth. (Author)

  14. Complications with computer-aided designed/computer-assisted manufactured titanium and soldered gold bars for mandibular implant-overdentures: short-term observations.

    Science.gov (United States)

    Katsoulis, Joannis; Wälchli, Julia; Kobel, Simone; Gholami, Hadi; Mericske-Stern, Regina

    2015-01-01

    Implant-overdentures supported by rigid bars provide stability in the edentulous atrophic mandible. However, fractures of solder joints and matrices, and loosening of screws and matrices were observed with soldered gold bars (G-bars). Computer-aided designed/computer-assisted manufactured (CAD/CAM) titanium bars (Ti-bars) may reduce technical complications due to enhanced material quality. To compare prosthetic-technical maintenance service of mandibular implant-overdentures supported by CAD/CAM Ti-bar and soldered G-bar. Edentulous patients were consecutively admitted for implant-prosthodontic treatment with a maxillary complete denture and a mandibular implant-overdenture connected to a rigid G-bar or Ti-bar. Maintenance service and problems with the implant-retention device complex and the prosthesis were recorded during minimally 3-4 years. Annual peri-implant crestal bone level changes (ΔBIC) were radiographically assessed. Data of 213 edentulous patients (mean age 68 ± 10 years), who had received a total of 477 tapered implants, were available. Ti-bar and G-bar comprised 101 and 112 patients with 231 and 246 implants, respectively. Ti-bar mostly exhibited distal bar extensions (96%) compared to 34% of G-bar (p overdentures supported by soldered gold bars or milled CAD/CAM Ti-bars are a successful treatment modality but require regular maintenance service. These short-term observations support the hypothesis that CAD/CAM Ti-bars reduce technical complications. Fracture location indicated that the titanium thickness around the screw-access hole should be increased. © 2013 Wiley Periodicals, Inc.

  15. Rolling Contact Fatigue Workshop July 26-27, 2011

    Science.gov (United States)

    2012-08-01

    In July 2011, the Transportation Technology Center, Inc., coordinated the joint Federal Railroad Association/Association of American Railroads Workshop on Rolling Contact Fatigue (RCF). The workshop was held at the Congress Plaza Hotel in Chicago, IL...

  16. Side Effects: Fatigue

    Science.gov (United States)

    Fatigue is a common side effect of many cancer treatments such as chemotherapy, radiation therapy, immunotherapy, and surgery. Anemia and pain can also cause fatigue. Learn about symptoms and way to manage fatigue.

  17. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

  18. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    Science.gov (United States)

    Sorg, Brian S.; Welch, Ashley J.

    2001-05-01

    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  19. Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Andersson, D.; Hoo, N.; Pearce, J.; Watson, A.; Dinsdale, A.; Mucklejohn, S.

    2012-01-01

    Roč. 21, č. 5 (2012), s. 629-637 ISSN 1059-9495 Institutional support: RVO:68081723 Keywords : lead-free soldering, * materials for high-temperature LF * new technologies for HT lead-free soldering Subject RIV: BJ - Thermodynamics Impact factor: 0.915, year: 2012

  20. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    Science.gov (United States)

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

    2015-08-01

    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

  1. Corrosion Reliability of Lead-free Solder Systems Used in Electronics

    DEFF Research Database (Denmark)

    Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

    2017-01-01

    humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

  2. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    DEFF Research Database (Denmark)

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

    2017-01-01

    with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  3. High temperature creep-fatigue design

    International Nuclear Information System (INIS)

    Tavassoli, A. A. F.; Fournier, B.; Sauzay, M.

    2010-01-01

    Generation IV fission and future fusion reactors envisage development of more efficient high temperature concepts where materials performances are key to their success. This paper examines different types of high temperature creep-fatigue interactions and their implications on design rules for the structural materials retained in both programmes. More precisely, the paper examines current status of design rules for the stainless steel type 316L(N), the conventional Modified 9Cr-1Mo martensitic steel and the low activation Eurofer steel. Results obtained from extensive high temperature creep, fatigue and creep-fatigue tests performed on these materials and their welded joints are presented. These include sequential creep-fatigue and relaxation creep-fatigue tests with hold times in tension, in compression or in both. Effects of larger plastic deformations on fatigue properties are studied through cyclic creep tests or fatigue tests with extended hold time in creep. In most cases, mechanical test results are accompanied with microstructural and fractographic observations. In the case of martensitic steels, the effect of oxidation is examined by performing creep-fatigue tests on identical specimens in vacuum. Results obtained are analyzed and their implications on design allowable and creep-fatigue interaction diagrams are presented. While reasonable confidence is found in predicting creep-fatigue damage through existing code procedures for austenitic stainless steels, effects of cyclic softening and coarsening of microstructure of martensitic steels throughout the fatigue life on materials properties need to be taken into account for more precise damage calculations. In the long-term, development of ferritic/martensitic steels with stable microstructure, such as ODS steels, is proposed. (authors)

  4. High temperature creep-fatigue design

    Energy Technology Data Exchange (ETDEWEB)

    Tavassoli, A. A. F.; Fournier, B.; Sauzay, M. [CEA Saclay, DEN DMN, F-91191 Gif Sur Yvette (France)

    2010-07-01

    Generation IV fission and future fusion reactors envisage development of more efficient high temperature concepts where materials performances are key to their success. This paper examines different types of high temperature creep-fatigue interactions and their implications on design rules for the structural materials retained in both programmes. More precisely, the paper examines current status of design rules for the stainless steel type 316L(N), the conventional Modified 9Cr-1Mo martensitic steel and the low activation Eurofer steel. Results obtained from extensive high temperature creep, fatigue and creep-fatigue tests performed on these materials and their welded joints are presented. These include sequential creep-fatigue and relaxation creep-fatigue tests with hold times in tension, in compression or in both. Effects of larger plastic deformations on fatigue properties are studied through cyclic creep tests or fatigue tests with extended hold time in creep. In most cases, mechanical test results are accompanied with microstructural and fractographic observations. In the case of martensitic steels, the effect of oxidation is examined by performing creep-fatigue tests on identical specimens in vacuum. Results obtained are analyzed and their implications on design allowable and creep-fatigue interaction diagrams are presented. While reasonable confidence is found in predicting creep-fatigue damage through existing code procedures for austenitic stainless steels, effects of cyclic softening and coarsening of microstructure of martensitic steels throughout the fatigue life on materials properties need to be taken into account for more precise damage calculations. In the long-term, development of ferritic/martensitic steels with stable microstructure, such as ODS steels, is proposed. (authors)

  5. Aircraft Fatigue - with Particular Emphasis on Australian Operations and Research.

    Science.gov (United States)

    1983-04-01

    its research on the fatigue behaviour of full-scale alluminium -alloy structures by undertaking a major investigation using surplus wings from North...on the corrosion fatigue of Taper-Lok bolted joints in D6AC steel. In March 1973 the RAAF finally took delivery of its first F-IliC, and among the...development of multiple defects, corrosion /stress corrosion , detvrirrat- ion of bonded joints, undetected cracks or damage, inadquate repairs 2r untested

  6. Physical properties of lead free solders in liquid and solid state

    Energy Technology Data Exchange (ETDEWEB)

    Mhiaoui, Souad

    2007-04-17

    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  7. Effects of mental fatigue on the development of physical fatigue: a neuroergonomic approach.

    Science.gov (United States)

    Mehta, Ranjana K; Parasuraman, Raja

    2014-06-01

    The present study used a neuroergonomic approach to examine the interaction of mental and physical fatigue by assessing prefrontal cortex activation during submaximal fatiguing handgrip exercises. Mental fatigue is known to influence muscle function and motor performance, but its contribution to the development of voluntary physical fatigue is not well understood. A total of 12 participants performed separate physical (control) and physical and mental fatigue (concurrent) conditions at 30% of their maximal handgrip strength until exhaustion. Functional near infrared spectroscopy was employed to measure prefrontal cortex activation, whereas electromyography and joint steadiness were used simultaneously to quantify muscular effort. Compared to the control condition, blood oxygenation in the bilateral prefrontal cortex was significantly lower during submaximal fatiguing contractions associated with mental fatigue at exhaustion, despite comparable muscular responses. The findings suggest that interference in the prefrontal cortex may influence motor output during tasks that require both physical and cognitive processing. A neuroergonomic approach involving simultaneous monitoring of brain and body functions can provide critical information on fatigue development that may be overlooked during traditional fatigue assessments.

  8. Transected sciatic nerve repair by diode laser protein soldering.

    Science.gov (United States)

    Fekrazad, Reza; Mortezai, Omid; Pedram, MirSepehr; Kalhori, Katayoun Am; Joharchi, Khojasteh; Mansoori, Korosh; Ebrahimi, Roja; Mashhadiabbas, Fatemeh

    2017-08-01

    Despite advances in microsurgical techniques, repair of peripheral nerve injuries (PNI) is still a major challenge in regenerative medicine. The standard treatment for PNI includes suturing and anasthomosis of the transected nerve. The objective of this study was to compare neurorraphy (nerve repair) using standard suturingto diode laser protein soldering on the functional recovery of transected sciatic nerves. Thirty adult male Fischer-344 Wistar rats were randomly assigned to 3 groups: 1. The control group, no repair, 2. the standard of care suture group, and 3. The laser/protein solder group. For all three groups, the sciatic nerve was transected and the repair was done immediately. For the suture repair group, 10.0 prolene suture was used and for the laser/protein solder group a diode laser (500mW output power) in combination with bovine serum albumen and indocyanine green dye was used. Behavioral assessment by sciatic functional index was done on all rats biweekly. At 12weeks post-surgery, EMG recordings were done on all the rats and the rats were euthanized for histological evaluation of the sciatic nerves. The one-way ANOVA test was used for statistical analysis. The average time required to perform the surgery was significantly shorter for the laser-assisted nerve repair group compared to the suture group. The EMG evaluation revealed no difference between the two groups. Based on the sciatic function index the laser group was significantly better than the suture group after 12weeks (pneurorraphy using standard suturing methods. Copyright © 2017 Elsevier B.V. All rights reserved.

  9. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates

    International Nuclear Information System (INIS)

    Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

    2008-01-01

    The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in

  10. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates.

    Energy Technology Data Exchange (ETDEWEB)

    Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

    2008-09-01

    The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in

  11. Influence of heat treatment on fatigue performances for self-piercing riveting similar and dissimilar titanium, aluminium and copper alloys

    OpenAIRE

    Zhang, Xianlian; He, Xiaocong; Xing, Baoying; Zhao, Lun; Lu, Yi; Gu, Fengshou; Ball, Andrew

    2016-01-01

    The fatigue performances of self-piercing riveting (SPR) joints connecting similar and dissimilar sheets of TA1 titanium alloy (TA1), Al5052 aluminium alloy (Al5052) and H62 copper alloy (H62) were studied in this paper. The specimens of similar TA1 sheets treated with stress relief annealing were prepared to investigate the influence of relief annealing on the mechanical properties of SPR joints. Fatigue tests were conducted to characterize the fatigue lives and failure modes of the joints. ...

  12. Joining technologies for the 1990s: Welding, brazing, soldering, mechanical, explosive, solid-state, adhesive

    Science.gov (United States)

    Buckley, John D. (Editor); Stein, Bland A. (Editor)

    1986-01-01

    A compilation of papers presented in a joint NASA, American Society for Metals, The George Washington University, American Welding Society, and Society of Manufacturing Engineers Conference on Welding, Bonding, and Fastening at Langley Research Center, Hampton, VA, on October 23 to 25, 1984 is given. Papers were presented on technology developed in current research programs relevant to welding, bonding, and fastening of structural materials required in fabricating structures and mechanical systems used in the aerospace, hydrospace, and automotive industries. Topics covered in the conference included equipment, hardware and materials used when welding, brazing, and soldering, mechanical fastening, explosive welding, use of unique selected joining techniques, adhesives bonding, and nondestructive evaluation. A concept of the factory of the future was presented, followed by advanced welding techniques, automated equipment for welding, welding in a cryogenic atmosphere, blind fastening, stress corrosion resistant fasteners, fastening equipment, explosive welding of different configurations and materials, solid-state bonding, electron beam welding, new adhesives, effects of cryogenics on adhesives, and new techniques and equipment for adhesive bonding.

  13. Inductive Soldering of the Junctions of the Main Superconducting Busbars of the LHC

    CERN Document Server

    Jacquemod, A; Schauf, F; Skoczen, Blazej; Tock, J P

    2004-01-01

    The Large Hadron Collider (LHC) is the next world-facility for the high energy physics community, presently under construction at CERN, Geneva. The LHC will bring into collisions intense beams of protons and ions. The main components of the LHC are the twin-aperture high-field superconducting cryomagnets that will be installed in the existing 26.7-km long tunnel. They are powered in series by superconducting Nb-Ti cables. Along the machine, about 60 000 joints between superconducting cables must be realised in-situ during the installation. Ten thousands of them, rated at 13 000 A, are involved in the powering scheme of the main dipoles and quadrupoles. To meet the requirements of the cryogenic budget, an electrical resistance at operating temperature (1.9 K) lower than 0.6 nW has to be achieved. The induction soldering technology was selected for this purpose. After a brief introduction to the LHC project, the constraints and requirements are listed. Then, the applied solution is detailed. The splices of the ...

  14. Thermally Conductive Metal-Tube/Carbon-Composite Joints

    Science.gov (United States)

    Copeland, Robert J.

    2004-01-01

    An improved method of fabricating joints between metal and carbon-fiber-based composite materials in lightweight radiators and heat sinks has been devised. Carbon-fiber-based composite materials have been used in such heat-transfer devices because they offer a combination of high thermal conductivity and low mass density. Metal tubes are typically used to carry heat-transfer fluids to and from such heat-transfer devices. The present fabrication method helps to ensure that the joints between the metal tubes and the composite-material parts in such heat-transfer devices have both (1) the relatively high thermal conductances needed for efficient transfer of heat and (2) the flexibility needed to accommodate differences among thermal expansions of dissimilar materials in operation over wide temperature ranges. Techniques used previously to join metal tubes with carbon-fiber-based composite parts have included press fitting and bonding with epoxy. Both of these prior techniques have been found to yield joints characterized by relatively high thermal resistances. The present method involves the use of a solder (63 percent Sn, 37 percent Pb) to form a highly thermally conductive joint between a metal tube and a carbon-fiber-based composite structure. Ordinarily, the large differences among the coefficients of thermal expansion of the metal tube, solder, and carbon-fiber-based composite would cause the solder to pull away from the composite upon post-fabrication cooldown from the molten state. In the present method, the structure of the solder is modified (see figure) to enable it to deform readily to accommodate the differential thermal expansion.

  15. Fatigue analysis of welding seams in automotive structures

    International Nuclear Information System (INIS)

    Halaszi, C.; Gaier, C.; Dannbauer, H.; Hofwimmer, K.

    2006-01-01

    For lightweight automotive structures, the stiffness and the fatigue behavior is greatly influenced by the properties of the joints. The joining technology used and the number and locations of the joints are of high importance for both engineers and cost accountants. An overview of common computational procedures including European and national standards is given for the assessments of the fatigue behavior of thin sheet structures with arc welds. The influence of the quality and size of finite shell elements on the fatigue results are investigated and it is shown how this influence can be minimized. (author)

  16. Fatigue diminishes motoneuronal excitability during cycling exercise.

    Science.gov (United States)

    Weavil, Joshua C; Sidhu, Simranjit K; Mangum, Tyler S; Richardson, Russell S; Amann, Markus

    2016-10-01

    Exercise-induced fatigue influences the excitability of the motor pathway during single-joint isometric contractions. This study sought to investigate the influence of fatigue on corticospinal excitability during cycling exercise. Eight men performed fatiguing constant-load (80% W peak ; 241 ± 13 W) cycling to exhaustion during which the percent increase in quadriceps electromyography (ΔEMG; vastus lateralis and rectus femoris) was quantified. During a separate trial, subjects performed two brief (∼45 s) nonfatiguing cycling bouts (244 ± 15 and 331 ± 23W) individually chosen to match the ΔEMG across bouts to that observed during fatiguing cycling. Corticospinal excitability during exercise was quantified by transcranial magnetic, electric transmastoid, and femoral nerve stimulation to elicit motor-evoked potentials (MEP), cervicomedullary evoked potentials (CMEP), and M waves in the quadriceps. Peripheral and central fatigue were expressed as pre- to postexercise reductions in quadriceps twitch force (ΔQ tw ) and voluntary quadriceps activation (ΔVA). Whereas nonfatiguing cycling caused no measureable fatigue, fatiguing cycling resulted in significant peripheral (ΔQ tw : 42 ± 6%) and central (ΔVA: 4 ± 1%) fatigue. During nonfatiguing cycling, the area of MEPs and CMEPs, normalized to M waves, similarly increased in the quadriceps (∼40%; P fatiguing cycling. As a consequence, the ratio of MEP to CMEP was unchanged during both trials (P > 0.5). Therefore, although increases in muscle activation promote corticospinal excitability via motoneuronal facilitation during nonfatiguing cycling, this effect is abolished during fatigue. We conclude that the unaltered excitability of the corticospinal pathway from start of intense cycling exercise to exhaustion is, in part, determined by inhibitory influences on spinal motoneurons obscuring the facilitating effects of muscle activation.

  17. Albumin solder covalently bound to a polymer membrane: New approach to improve binding strength in laser tissue soldering in-vitro.

    Science.gov (United States)

    Hiebl, B; Ascher, L; Luetzow, K; Kratz, K; Gruber, C; Mrowietz, C; Nehring, M E; Lendlein, A; Franke, R-P; Jung, F

    2018-01-01

    Laser tissue soldering (LTS) based on indocyanine green (ICG)-mediated heat-denaturation of proteins might be a promising alternative technique for micro-suturing, but up to now the problem of too weak shear strength of the solder welds in comparison to sutures is not solved. Earlier reports gave promising results showing that solder supported by carrier materials can enhance the cohesive strength of the liquid solder. In these studies, the solder was applied to the carriers by dip coating. Higher reliability of the connection between the solder and the carrier material is expected when the solder is bound covalently to the carrier material. In the present study a poly(ether imide) (PEI) membrane served as carrier material and ICG-supplemented albumin as solder substrate. The latter was covalently coupled to the carrier membrane under physiological conditions to prevent structural protein changes. As laser source a diode continuous-wave laser emitting at 808 nm with intensities between 250 mW and 1500 mW was utilized. The albumin functionalized carrier membrane was placed onto the tunica media of explanted pig thoracic aortae forming an overlapping area of approximately 0.5×0.5 cm2. All tests were performed in a dry state to prevent laser light absorption by water. Infrared spectroscopy, spectro-photometrical determination of the secondary and primary amine groups after acid orange II staining, contact angle measurements, and atomic force microscopy proved the successful functionalization of the PEI membrane with albumin. A laser power of 450 mW LTS could generate a membrane-blood vessel connection which was characterized by a shear strength of 0.08±0.002 MPa, corresponding to 15% of the tensile strength of the native blood vessel. Theoretically, an overlapping zone of 4.1 mm around the entire circumference of the blood vessel could have provided shear strength of the PEI membrane-blood vessel compound identical to the tensile strength of the native

  18. Application of fracture mechanics to fatigue in pressure vessels

    International Nuclear Information System (INIS)

    Ghavami, K.

    1982-01-01

    The methods of application of fracture mechanics to predict fatigue crack propagation in welded structures and pressure vessels are described with the following objectives: i) To identify the effect of different variables such as crack tip plasticity, free surface, finite plate thickness, stress concentration and type of the structure, on the magnitude of stress intensity factor K in Welded joint. ii) To demonstrate the use of fracture mechanics for analysing fatigue crack propagation data. iii) To show how a law of fatigue crack propagation based on fracure mechanics, may be used to predict fatigue behavior of welded structures such as pressure vessel. (Author) [pt

  19. Fatigue in Aluminum Highway Bridges under Random Loading

    DEFF Research Database (Denmark)

    Rom, Søren; Agerskov, Henning

    2014-01-01

    Fatigue damage accumulation in aluminum highway bridges under random loading is studied. The fatigue life of welded joints has been determined both experimentally and from a fracture mechanics analysis. In the experimental part of the investigation, fatigue test series on welded plate test...... is normally used in the design against fatigue in aluminum bridges, may give results which are unconservative. The validity of the results obtained from Miner’s rule will depend on the distribution of the load history in tension and compression....

  20. Development of Pb-Free Nanocomposite Solder Alloys

    Directory of Open Access Journals (Sweden)

    Animesh K. Basak

    2018-04-01

    Full Text Available As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1 Al2O3 or (2 Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys.

  1. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

    Science.gov (United States)

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-12-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

  2. The Fatigue Behavior of Steel Structures under Random Loading

    DEFF Research Database (Denmark)

    Agerskov, Henning

    2009-01-01

    of the investigation, fatigue test series with a total of 540 fatigue tests have been carried through on various types of welded plate test specimens and full-scale offshore tubular joints. The materials that have been used are either conventional structural steel or high-strength steel. The fatigue tests......Fatigue damage accumulation in steel structures under random loading has been studied in a number of investigations at the Technical University of Denmark. The fatigue life of welded joints has been determined both experimentally and from a fracture mechanics analysis. In the experimental part...... and the fracture mechanics analyses have been carried out using load histories, which are realistic in relation to the types of structures studied, i.e. primarily bridges, offshore structures and chimneys. In general, the test series carried through show a significant difference between constant amplitude...

  3. Fracture Mechanics Prediction of Fatigue Life of Aluminum Highway Bridges

    DEFF Research Database (Denmark)

    Rom, Søren; Agerskov, Henning

    2015-01-01

    Fracture mechanics prediction of the fatigue life of aluminum highway bridges under random loading is studied. The fatigue life of welded joints has been determined from fracture mechanics analyses and the results obtained have been compared with results from experimental investigations. The fati......Fracture mechanics prediction of the fatigue life of aluminum highway bridges under random loading is studied. The fatigue life of welded joints has been determined from fracture mechanics analyses and the results obtained have been compared with results from experimental investigations...... against fatigue in aluminum bridges, may give results which are unconservative. Furthermore, it was in both investigations found that the validity of the results obtained from Miner's rule will depend on the distribution of the load history in tension and compression....

  4. Laser-tissue soldering with biodegradable polymer films in vitro: film surface morphology and hydration effects.

    Science.gov (United States)

    Sorg, B S; Welch, A J

    2001-01-01

    Previous research introduced the concept of using biodegradable polymer film reinforcement of a liquid albumin solder for improvement of the tensile strength of repaired incisions in vitro. In this study, the effect of creating small pores in the PLGA films on the weld breaking strength is studied. Additionally, the effect of hydration on the strength of the reinforced welds is investigated. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with an 806-nm CW diode laser. A poly(DL-lactic-co-glycolic acid) (PLGA) film was used to reinforce the solder (the controls had solder but no reinforcement). Breaking strengths were measured acutely and after hydration in saline for 1 and 2 days. The data were analyzed by ANOVA (P < 0.05) and multiple comparisons of means were performed using the Newman-Keuls test. The creation of pores in the PLGA films qualitatively improved the film flexibility without having an apparent adverse effect on the breaking strength, while the actual technique of applying the film and solder had more of an effect. The acute maximum average breaking strengths of some of the film reinforced specimens (114.7 g-134.4 g) were significantly higher (P < 0.05) than the acute maximum average breaking strength of the unreinforced control specimens (68.3 g). Film reinforced specimens were shown to have a statistically significantly higher breaking strength than unreinforced controls after 1- and 2-day hydration. Reinforcement of liquid albumin solders in laser-assisted incision repair appears to have advantages over conventional methods that do not reinforce the cohesive strength of the solder in terms of acute breaking strength and after immersion in moist environments for short periods of time. Using a film with the solder applied to one surface only may be advantageous over other techniques.

  5. High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology

    Science.gov (United States)

    Wang, Boxue; Jia, Yangtao; Zhang, Haoyu; Jia, Shiyin; Liu, Jindou; Wang, Weifeng; Liu, Xingsheng

    2018-02-01

    An insulation micro-channel cooling (IMCC) has been developed for packaging high power bar-based vertical stack and horizontal array diode lasers, which eliminates many issues caused in its congener packaged by commercial copper formed micro-channel cooler(MCC), such as coefficient of thermal expansion (CTE) mismatch between cooler and diode laser bar, high coolant quality requirement (DI water) and channel corrosion and electro-corrosion induced by DI water if the DI-water quality is not well maintained The IMCC cooler separates water flow route and electrical route, which allows tap-water as coolant without electro-corrosion and therefore prolongs cooler lifetime dramatically and escalated the reliability of these diode lasers. The thickness of ceramic and copper in an IMCC cooler is well designed to minimize the CTE mismatch between laser bar and cooler, consequently, a very low "SMILE" of the laser bar can be achieved for small fast axis divergence after collimation. In additional, gold-tin hard solder bonding technology was also developed to minimize the risk of solder electromigration at high current density and thermal fatigue under hard-pulse operation mode. Testing results of IMCC packaged diode lasers are presented in this report.

  6. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Directory of Open Access Journals (Sweden)

    Xiuyun Zhou

    2015-10-01

    Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  7. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

  8. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

  9. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    DEFF Research Database (Denmark)

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

    2009-01-01

    of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

  10. A review on solder reflow and flux application for flip chip

    Science.gov (United States)

    Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Visvanathan, Susthitha Menon; Retnasamy, Vithyacharan

    2017-09-01

    This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

  11. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    Science.gov (United States)

    Rolin, T. D.; Hodge, R. E.

    2008-01-01

    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  12. Laser welding of vas deferens in rodents: initial experience with fluid solders.

    Science.gov (United States)

    Trickett, R I; Wang, D; Maitz, P; Lanzetta, M; Owen, E R

    1998-01-01

    This study evaluates the use of sutureless laser welding for vasovasostomy. In 14 rodents, the left vas deferens underwent vasovasostomy using an albumin-based solder applied to the adventitia of the vas deferens. The solder contained the dye, indocyanine green, to allow selective absorption and denaturation by a fiber-coupled 800-nm diode laser. The right vas deferens served as a control, receiving conventional layered microsurgical repair. We used a removable 4/0 nylon stent and microclamps to appose the vas deferens during repair, with no need for stay sutures. The mean time to perform laser solder repair (23.5 min) and conventional repair (23.3 min) were not significantly different (P=0.91). However, examination after 8 weeks showed that granuloma formation (G) and patency (P) rates for the conventional suture technique (G, 14%; P, 93%) were significantly better than observed for the laser solder technique (G, 57%; P, 50%).

  13. Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E...... in a carbon matrix. Nanoscale soldering of multi-walled carbon nanotubes (MWNT) onto microelectrodes was achieved by deposition of a conducting gold line across a contact point between nanotube and electrode. The solderings were found to be mechanically stronger than the carbon nanotubes. We have positioned...... MWNTs to bridge the gap between two electrodes, and formed soldering bonds between the tube and each of the electrodes. All nanotube bridges showed ohmic resistances in the range 10-30 kΩ. We observed no increase in resistance after exposing the MWNT bridge to air for days....

  14. Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

    Science.gov (United States)

    Hasnine, M.; Tolla, B.; Vahora, N.

    2018-04-01

    This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

  15. Fatigue with HIV/AIDS

    Science.gov (United States)

    ... 21, 2014 Select a Language: Fact Sheet 551 Fatigue WHAT IS FATIGUE? IS FATIGUE IMPORTANT? HOW DO ... It can be physical or psychological. With physical fatigue , your muscles cannot do things as easily as ...

  16. Nanoconstruction by welding individual metallic nanowires together using nanoscale solder

    International Nuclear Information System (INIS)

    Peng, Y; Inkson, B J; Cullis, A G

    2010-01-01

    This work presents a new bottom-up nanowelding technique enabling building blocks to be assembled and welded together into complex 3D nanostructures using nanovolumes of metal solder. The building blocks of gold nanowires, (Co 72 Pt 28 /Pt) n multilayer nanowires, and nanosolder Sn 99 Au 1 alloy nanowires were successfully fabricated by a template technique. Individual metallic nanowires were picked up and assembled together. Conductive nanocircuits were then welded together using similar or dissimilar nanosolder material. At the weld sites, nanoscale volumes of a chosen metal are deposited using nanosolder of a sacrificial nanowire, which ensures that the nanoobjects to be bonded retain their structural integrity. The whole nanowelding process is clean, controllable and reliable, and ensures both mechanically strong and electrically conductive contacts.

  17. Soldered Contact and Current Risetime Effects on Negative Polarity Wire Array Z-pinches

    International Nuclear Information System (INIS)

    Chalenski, D. A.; Kusse, B. R.; Greenly, J. B.; Blesener, I. C.; McBride, R. D.; Hammer, D. A.; Knapp, P. F.

    2009-01-01

    The Cornell University COBRA pulser is a nominal 1 MA machine, capable of driving up to 32 wire cylindrical Z-pinch arrays. COBRA can operate with variable current risetimes ranging from 100 ns to 200 ns (short and long pulse, respectively). Wires are typically strung with a ''press'' contact to the electrode hardware, where the wire is loosely pulled against the hardware and held there to establish electrical contact. The machine is normally negative, but a bolt-on convolute can be used to modify the current path and effectively produce positive polarity operation at the load.Previous research with single wires on a 1-5 kA pulser has shown that soldering the wire, thereby improving the wire/electrode contact, and operating in positive polarity can improve the energy deposition into the wire and enhance wire core expansion. Negative polarity showed no difference. Previous experiments on the negative polarity, 20 MA, 100 ns Z accelerator have shown that improving the contact improved the x-ray yield.Cornell data were collected on 16-wire Aluminum Z-pinch arrays in negative polarity. Experiments were conducted with both short and long current pulses with soldered and no-soldered wire/electrode contacts. The initiation, ablation, implosion and stagnation phases were compared for these four conditions. Time dependent x-ray signals were measured using diodes and diamond detectors. An inductive voltage monitor was used to infer minimum current radius achieved, as defined by a uniform shell of current moving radially inward, producing a time dependent inductance. Total energy data were collected with a metal-strip bolometer. Self-emission data were collected by an XUV 4-frame camera and an optical streak camera.In negative polarity and with short pulses, soldering appeared to produce a smaller radius pinch and decrease variations in the x-ray pulse shape. The bolometer, laser backlighter, 4-frame and streak cameras showed negligible differences in the initiation ablation

  18. Riveted Lap Joints in Aircraft Fuselage Design, Analysis and Properties

    CERN Document Server

    Skorupa, Andrzej

    2012-01-01

    Fatigue of the pressurized fuselages of transport aircraft is a significant problem all builders and users of aircraft have to cope with for reasons associated with assuring a sufficient lifetime and safety, and formulating adequate inspection procedures. These aspects are all addressed in various formal protocols for creating and maintaining airworthiness, including damage tolerance considerations. In most transport aircraft, fatigue occurs in lap joints, sometimes leading to circumstances that threaten safety in critical ways. The problem of fatigue of lap joints has been considerably enlarged by the goal of extending aircraft lifetimes. Fatigue of riveted lap joints between aluminium alloy sheets, typical of the pressurized aircraft fuselage, is the major topic of the present book. The richly illustrated and well-structured chapters treat subjects such as: structural design solutions and loading conditions for fuselage skin joints; relevance of laboratory test results for simple lap joint specimens to rive...

  19. Dye-enhanced protein solders and patches in laser-assisted tissue welding.

    Science.gov (United States)

    Small, W; Heredia, N J; Maitland, D J; Da Silva, L B; Matthews, D L

    1997-01-01

    This study examines the use of dye-enhanced protein bonding agents in 805 nm diode laser-assisted tissue welding. A comparison of an albumin liquid solder and collagen solid-matrix patches used to repair arteriotomies in an in vitro porcine model is presented. Extrinsic bonding media in the form of solders and patches have been used to enhance the practice of laser tissue welding. Preferential absorption of the laser wavelength has been achieved by the incorporation of chromophores. Both the solder and the patch included indocyanine green dye (ICG) to absorb the 805 nm continuous-wave diode laser light used to perform the welds. Solder-mediated welds were divided into two groups (high power/short exposure and low power/long exposure), and the patches were divided into three thickness groups ranging from 0.1 to 1.3 mm. The power used to activate the patches was constant, but the exposure time was increased with patch thickness. Burst pressure results indicated that solder-mediated and patched welds yielded similar average burst strengths in most cases, but the patches provided a higher success rate (i.e., more often exceeded 150 mmHg) and were more consistent (i.e., smaller standard deviation) than the solder. The strongest welds were obtained using 1.0-1.3 mm thick patches, while the high power/short exposure solder group was the weakest. Though the solder and patches yielded similar acute weld strengths, the solid-matrix patches facilitated the welding process and provided consistently strong welds. The material properties of the extrinsic agents influenced their performance.

  20. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others

    1995-06-01

    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  1. The positions effect of biarticular muscles on the walking fatigue of bipedal robots

    Directory of Open Access Journals (Sweden)

    Brahim FERNINI

    2016-12-01

    Full Text Available The objective of this paper is to model a bipedal robot with springs like biarticular muscles and to study the positions effect of biarticular muscles on the walking fatigue of bipedal robots through the analysis of the works of the ground reaction force (GRF accumulated at joints and the analysis of the works done by biarticular muscles. We can define the walking fatigue in this paper by the fatigue of joints and muscles caused by the increment of the works accumulated at joints and the increment of the works done by biarticular muscles during the walk period of bipedal robots. It’s found from this study that the position of the muscle biceps femoris (BF has a strong impact on the fatigue of leg joints and the fatigue of the muscle itself during the walk period of bipedal robots.

  2. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    Directory of Open Access Journals (Sweden)

    Enrico Mick

    2015-07-01

    Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

  3. Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

    International Nuclear Information System (INIS)

    Mallik, S.; Ekere, N.N.; Durairaj, R.; Marks, A.E.; Seman, A.

    2009-01-01

    Solder paste is the most important strategic bonding material used in the assembly of surface mount components in electronics manufacturing. As the trend towards miniaturisation of electronic products continues, there is an increasing demand for better understanding of the flow and deformation that is, the rheological behaviour of solder paste formulations. Wall slip plays an important role in characterising the flow behaviour of solder paste materials. The problem of wall slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. In rheological measurements, slip effects can generally be avoided by using roughened surfaces for measuring geometries. In this paper, a novel technique is developed to study the effect of wall slip in the rheological measurements of lead-free solder paste. The viscosity and oscillatory data obtained for three different solder paste samples (from measuring geometries of different surface roughness) have been analysed and compared. In viscosity measurements, slip effects were dominant at low shear rates and the use of serrated surfaces was found to be quite effective in minimizing slip effects. Oscillatory measurements were also affected by roughening the surfaces of measuring geometries.

  4. Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

    International Nuclear Information System (INIS)

    Durairaj, R.; Ramesh, S.; Mallik, S.; Seman, A.; Ekere, N.

    2009-01-01

    Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G') is higher than the liquid characteristic (G'') for the pastes material. In addition, the results from the study showed that the solder paste with a large G' = G'' has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (δ) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.

  5. Fatigue assessment of the ITER TF coil case based on JJ1 fatigue tests

    International Nuclear Information System (INIS)

    Hamada, K.; Nakajima, H.; Takano, K.; Kudo, Y.; Tsutsumi, F.; Okuno, K.; Jong, C.

    2005-01-01

    The material of the TF coil case in the ITER requires to withstand cyclic electromagnetic forces applied up to 3 x 10 4 cycles at 4.2 K. A cryogenic stainless steel, JJ1, is used in high stress region of TF coil case. The fatigue characteristics (S-N curve) of JJ1 base metal and welded joint at 4.2 K has been measured. The fatigue strength of base metal and welded joint at 3 x 10 4 cycles are measured as 1032 and 848 MPa, respectively. The design S-N curve is derived from the measured data taking account of the safety factor of 20 for cycle-to-failure and 2 for fatigue strength, and it indicates that an equivalent alternating stress of the case should be kept less than 516 MPa for the base metal and 424 MPa for the welded joint at 3 x 10 4 cycles. It is demonstrated that the TF coil case has enough margins for the cyclic operation. It is also shown the welded joint should be located in low cyclic stress region because a residual stress affects the fatigue life

  6. Thermal Acoustic Fatigue Apparatus

    Data.gov (United States)

    Federal Laboratory Consortium — The Thermal Acoustic Fatigue Apparatus (TAFA) is a progressive wave tube test facility that is used to test structures for dynamic response and sonic fatigue due to...

  7. Metabolomic markers of fatigue: Association between circulating metabolome and fatigue in women with chronic widespread pain.

    Science.gov (United States)

    Freidin, Maxim B; Wells, Helena R R; Potter, Tilly; Livshits, Gregory; Menni, Cristina; Williams, Frances M K

    2018-02-01

    Fatigue is a sensation of unbearable tiredness that frequently accompanies chronic widespread musculoskeletal pain (CWP) and inflammatory joint disease. Its mechanisms are poorly understood and there is a lack of effective biomarkers for diagnosis and onset prediction. We studied the circulating metabolome in a population sample characterised for CWP to identify biomarkers showing specificity for fatigue. Untargeted metabolomic profiling was conducted on fasting plasma and serum samples of 1106 females with and without CWP from the TwinsUK cohort. Linear mixed-effects models accounting for covariates were used to determine relationships between fatigue and metabolites. Receiver operating curve (ROC)-analysis was used to determine predictive value of metabolites for fatigue. While no association between fatigue and metabolites was identified in twins without CWP (n=711), in participants with CWP (n=395), levels of eicosapentaenoate (EPA) ω-3 fatty acid were significantly reduced in those with fatigue (β=-0.452±0.116; p=1.2×10 -4 ). A significant association between fatigue and two other metabolites also emerged when BMI was excluded from the model: 3-carboxy-4-methyl-5-propyl-2-furanpropanoate (CMPF), and C-glycosyltryptophan (p=1.5×10 -4 and p=3.1×10 -4 , respectively). ROC analysis has identified a combination of 15 circulating metabolites with good predictive potential for fatigue in CWP (AUC=75%; 95% CI 69-80%). The results of this agnostic metabolomics screening show that fatigue is metabolically distinct from CWP, and is associated with a decrease in circulating levels of EPA. Our panel of circulating metabolites provides the starting point for a diagnostic test for fatigue in CWP. Copyright © 2017 The Authors. Published by Elsevier B.V. All rights reserved.

  8. The effect of controlled shot peening on fusion welded joints

    International Nuclear Information System (INIS)

    Lah, Nur Azida Che; Ali, Aidy; Ismail, Napsiah; Chai, Lim Poon; Mohamed, Abdul Aziz

    2010-01-01

    This work examines the effect of controlled shot peening (CSP) treatment on the fatigue strength of an ASTM A516 grade 70 carbon steel welded joint. Metallurgical modifications, hardness, elemental compositions, and internal discontinuities, such as porosity, inclusions, lack of penetration, and undercut found in treated and untreated fusion welded joints, were characterized. The fatigue results of as-welded and peened skimmed joints were compared. It was observed that the effect of the CSP and skimming processes improved the fatigue life of the fusion weld by 50% on MMA-welded, 63% on MIG-welded, and 60% on TIG-welded samples.

  9. Reliability Analysis of Tubular Joints in Offshore Structures

    DEFF Research Database (Denmark)

    Thoft-Christensen, Palle; Sørensen, John Dalsgaard

    1987-01-01

    Reliability analysis of single tubular joints and offshore platforms with tubular joints is" presented. The failure modes considered are yielding, punching, buckling and fatigue failure. Element reliability as well as systems reliability approaches are used and illustrated by several examples....... Finally, optimal design of tubular.joints with reliability constraints is discussed and illustrated by an example....

  10. Life Estimation of Hip Joint Prosthesis

    Science.gov (United States)

    Desai, C.; Hirani, H.; Chawla, A.

    2015-07-01

    Hip joint is one of the largest weight-bearing structures in the human body. In the event of a failure of the natural hip joint, it is replaced with an artificial hip joint, known as hip joint prosthesis. The design of hip joint prosthesis must be such so as to resist fatigue failure of hip joint stem as well as bone cement, and minimize wear caused by sliding present between its head and socket. In the present paper an attempt is made to consider both fatigue and wear effects simultaneously in estimating functional-life of the hip joint prosthesis. The finite element modeling of hip joint prosthesis using HyperMesh™ (version 9) has been reported. The static analysis (load due to the dead weight of the body) and dynamic analysis (load due to walking cycle) have been described. Fatigue life is estimated by using the S-N curve of individual materials. To account for progressive wear of hip joint prosthesis, Archard's wear law, modifications in socket geometry and dynamic analysis have been used in a sequential manner. Using such sequential programming reduction in peak stress has been observed with increase in wear. Finally life is estimated on the basis of socket wear.

  11. Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys

    Science.gov (United States)

    Reeve, Kathlene N.; Anderson, Iver E.; Handwerker, Carol A.

    2015-03-01

    Lead-free solder alloys Sn-Cu (SC) and Sn-Ag-Cu (SAC) are widely used by the microelectronics industry, but enhanced control of the microstructure is needed to improve solder performance. For such control, nucleation and stability of Cu-Al intermetallic compound (IMC) solidification catalysts were investigated by variation of the Cu (0.7-3.0 wt.%) and Al (0.0-0.4 wt.%) content of SC + Al and SAC + Al alloys, and of SAC + Al ball-grid array (BGA) solder joints. All of the Al-modified alloys produced Cu-Al IMC particles with different morphologies and phases (occasionally non-equilibrium phases). A trend of increasing Cu-Al IMC volume fraction with increasing Al content was established. Because of solidification of non-equilibrium phases in wire alloy structures, differential scanning calorimetry (DSC) experiments revealed delayed, non-equilibrium melting at high temperatures related to quenched-in Cu-Al phases; a final liquidus of 960-1200°C was recorded. During cooling from 1200°C, the DSC samples had the solidification behavior expected from thermodynamic equilibrium calculations. Solidification of the ternary alloys commenced with formation of ternary β and Cu-Al δ phases at 450-550°C; this was followed by β-Sn, and, finally, Cu6Sn5 and Cu-Al γ1. Because of the presence of the retained, high-temperature phases in the alloys, particle size and volume fraction of the room temperature Cu-Al IMC phases were observed to increase when the alloy casting temperature was reduced from 1200°C to 800°C, even though both temperatures are above the calculated liquidus temperature of the alloys. Preliminary electron backscatter diffraction results seemed to show Sn grain refinement in the SAC + Al BGA alloy.

  12. Determinants of seafarers’ fatigue

    DEFF Research Database (Denmark)

    Bøggild Dohrmann, Solveig; Leppin, Anja

    2017-01-01

    in the review. The main reason for exclusion was fatigue not being the outcome variable. Results: Most evidence was available for work time-related factors suggesting that working nights was most fatiguing, that fatigue levels were higher toward the end of watch or shift, and that the 6-h on–6-h off watch...

  13. Experimental Investigation of the Influence of Joint Geometric Configurations on the Mechanical Properties of Intermittent Jointed Rock Models Under Cyclic Uniaxial Compression

    Science.gov (United States)

    Liu, Yi; Dai, Feng; Fan, Pengxian; Xu, Nuwen; Dong, Lu

    2017-06-01

    Intermittent joints in rock mass are quite sensitive to cyclic loading conditions. Understanding the fatigue mechanical properties of jointed rocks is beneficial for rational design and stability analysis of rock engineering projects. This study experimentally investigated the influences of joint geometry (i.e., dip angle, persistency, density and spacing) on the fatigue mechanism of synthetic jointed rock models. Our results revealed that the stress-strain curve of jointed rock under cyclic loadings is dominated by its curve under monotonic uniaxial loadings; the terminal strain in fatigue curve is equal to the post-peak strain corresponding to the maximum cyclic stress in the monotonic stress-strain curve. The four joint geometrical parameters studied significantly affect the fatigue properties of jointed rocks, including the irreversible strains, the fatigue deformation modulus, the energy evolution, the damage variable and the crack coalescence patterns. The higher the values of the geometrical parameters, the lower the elastic energy stores in this jointed rock, the higher the fatigue damage accumulates in the first few cycles, and the lower the fatigue life. The elastic energy has certain storage limitation, at which the fatigue failure occurs. Two basic micro-cracks, i.e., tensile wing crack and shear crack, are observed in cyclic loading and unloading tests, which are controlled principally by joint dip angle and persistency. In general, shear cracks only occur in the jointed rock with higher dip angle or higher persistency, and the jointed rock is characterized by lower fatigue strength, larger damage variable and lower fatigue life.

  14. Structural analysis for the joint of the ITER ELM coil

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Shanwen, E-mail: zhangshanwen123@163.com [College of Mechanical Engineering Yangzhou University, Yangzhou 225127 (China); Song, Yuntao; Wang, Zhongwei; Ji, Xiang [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei 200031 (China); Zhang, Jianfeng [College of Mechanical Engineering Yangzhou University, Yangzhou 225127 (China)

    2017-01-15

    Highlights: • The FE sub-model method is feasible and rapid for the joint design. • The components meet the static and fatigue criteria. • Nuclear heat is the key factor for the joint design. - Abstract: The joint is an important component of the Edge Localized Modes (ELM) coils in fusion reactor, which is used to connect the ELM coils. Like the ELM coils, the joints work in an environment with high radiation levels, high temperature and high magnetic field. These joints are mainly subject to nuclear heat from the plasma and cyclic electromagnetic (EM) loads induced by the interaction of ELM coil current with magnetic fields. Take the joint of ITER ELM coil for example. In order to assure the structural integrity of joints under these loads, it is necessary to estimate the strength and fatigue of the joints. As a local model, the joint without ELM coil is investigated by the sub-model method. Results show that the finite element sub-model method is feasible and rapid for the joint design. The maximum magnetic flux intensity occurs in the axial direction for the joint local reference, which parallels with the current and corresponds to the toroidal direction of the ITER. The two areas at the top of the Inconel sleeve appear high temperature. For the joint, the conductor, jacket and sleeve can meet the static and fatigue criteria and the joint design is valid and feasible. The thermal load from the nuclear heat is the key factor for the joint design.

  15. Fatigue Damage in Wood

    DEFF Research Database (Denmark)

    Clorius, Christian Odin; Pedersen, Martin Bo Uhre; Hoffmeyer, Preben

    1996-01-01

    An investigation of fatigue failure in wood subjected to load cycles in compression parallel to grain is presented. Fatigue failure is found to depend both on the total time under load and on the number of cycles.Recent accelerated fatigue research on wood is reviewed, and a discrepancy between...... to 10 Hz are used. The number of cycles to failure is found to be a poor measure of the fatigue performance of wood. Creep, maximum strain, stiffness and work are monitored throughout the fatigue tests. Accumulated creep is suggested identified with damage and a correlation between stiffness reduction...

  16. The relevancy of current environmental issues to solder joints in microelectronic applications

    International Nuclear Information System (INIS)

    Walitsky, P.J.; Yost, F.G.

    1991-01-01

    The technical issues brought about by recent federal mandates are reviewed and discussed. Progress made in the elimination of CFCs is briefly reviewed. The problems, implications, and status of pending anti-lead legislation and taxation are discussed at length. Recommendations are made for the enactment of rational, fair, and orderly legislation and taxation

  17. Comparative study of a muscle stiffness sensor and electromyography and mechanomyography under fatigue conditions.

    Science.gov (United States)

    Han, Hyonyoung; Jo, Sungho; Kim, Jung

    2015-07-01

    This paper proposes the feasibility of a stiffness measurement for muscle contraction force estimation under muscle fatigue conditions. Bioelectric signals have been widely studied for the estimation of the contraction force for physical human-robot interactions, but the correlation between the biosignal and actual motion is decreased under fatigue conditions. Muscle stiffness could be a useful contraction force estimator under fatigue conditions because it measures the same physical quantity as the muscle contraction that generates the force. Electromyography (EMG), mechanomyography (MMG), and a piezoelectric resonance-based active muscle stiffness sensor were used to analyze the biceps brachii under isometric muscle fatigue conditions with reference force sensors at the end of the joint. Compared to EMG and MMG, the change in the stiffness signal was smaller (p fatigue condition changed fatigue conditions. This result indicates that the muscle stiffness signal is less sensitive to muscle fatigue than other biosignals. This investigation provides insights into methods of monitoring and compensating for muscle fatigue.

  18. Biologic interventions for fatigue in rheumatoid arthritis

    DEFF Research Database (Denmark)

    Almeida, Celia; Choy, Ernest H S; Hewlett, Sarah

    2016-01-01

    BACKGROUND: Fatigue is a common and potentially distressing symptom for patients with rheumatoid arthritis (RA), with no accepted evidence-based management guidelines. Evidence suggests that biologic interventions improve symptoms and signs in RA as well as reducing joint damage. OBJECTIVES......: To evaluate the effect of biologic interventions on fatigue in rheumatoid arthritis. SEARCH METHODS: We searched the following electronic databases up to 1 April 2014: Cochrane Central Register of Controlled Trials (CENTRAL), MEDLINE, EMBASE, Cochrane Database of Systematic Reviews, Current Controlled Trials...... and contacted key authors. SELECTION CRITERIA: We included randomised controlled trials if they evaluated a biologic intervention in people with rheumatoid arthritis and had self reported fatigue as an outcome measure. DATA COLLECTION AND ANALYSIS: Two reviewers selected relevant trials, assessed methodological...

  19. Fatigue analysis of HANARO primary cooling system piping

    International Nuclear Information System (INIS)

    Ryu, Jeong Soo

    1998-05-01

    A main form of piping failure which occurring leak before break (LBB) is fatigue failure. The fatigue analysis of HANARO primary cooling system (PCS) piping was performed. The PCS piping had been designed in accordance with ASME Class 3 for service conditions. However fatigue analysis is not required in Class 3. In this study the quantitative fatigue analysis was carried out according to ASME Class 1. The highest stress points which have the largest possibility of ASME class 1. The highest stress points which have the largest possibility of the fatigue were determined from the piping stress analysis for each subsection piping. The fatigue analysis was performed for 3 highest stress points, i.e., branch connection, anchor point and butt welding joint. After calculating the peak stress intensity range the fatigue usage factors were evaluated considering operating cycles and S-N curve. The cumulative usage factors for 3 highest stress points were much less than 1. The results show that the possibility of fatigue failure for PCS piping subjected to thermal expansion and seismic loads is very small. The structural integrity of the HANARO PCS piping for fatigue failure was proved to apply the LBB. (author). 11 tabs., 6 figs

  20. Statistical optimisation techniques in fatigue signal editing problem

    International Nuclear Information System (INIS)

    Nopiah, Z. M.; Osman, M. H.; Baharin, N.; Abdullah, S.

    2015-01-01

    Success in fatigue signal editing is determined by the level of length reduction without compromising statistical constraints. A great reduction rate can be achieved by removing small amplitude cycles from the recorded signal. The long recorded signal sometimes renders the cycle-to-cycle editing process daunting. This has encouraged researchers to focus on the segment-based approach. This paper discusses joint application of the Running Damage Extraction (RDE) technique and single constrained Genetic Algorithm (GA) in fatigue signal editing optimisation.. In the first section, the RDE technique is used to restructure and summarise the fatigue strain. This technique combines the overlapping window and fatigue strain-life models. It is designed to identify and isolate the fatigue events that exist in the variable amplitude strain data into different segments whereby the retention of statistical parameters and the vibration energy are considered. In the second section, the fatigue data editing problem is formulated as a constrained single optimisation problem that can be solved using GA method. The GA produces the shortest edited fatigue signal by selecting appropriate segments from a pool of labelling segments. Challenges arise due to constraints on the segment selection by deviation level over three signal properties, namely cumulative fatigue damage, root mean square and kurtosis values. Experimental results over several case studies show that the idea of solving fatigue signal editing within a framework of optimisation is effective and automatic, and that the GA is robust for constrained segment selection

  1. Statistical optimisation techniques in fatigue signal editing problem

    Energy Technology Data Exchange (ETDEWEB)

    Nopiah, Z. M.; Osman, M. H. [Fundamental Engineering Studies Unit Faculty of Engineering and Built Environment, Universiti Kebangsaan Malaysia, 43600 UKM (Malaysia); Baharin, N.; Abdullah, S. [Department of Mechanical and Materials Engineering Faculty of Engineering and Built Environment, Universiti Kebangsaan Malaysia, 43600 UKM (Malaysia)

    2015-02-03

    Success in fatigue signal editing is determined by the level of length reduction without compromising statistical constraints. A great reduction rate can be achieved by removing small amplitude cycles from the recorded signal. The long recorded signal sometimes renders the cycle-to-cycle editing process daunting. This has encouraged researchers to focus on the segment-based approach. This paper discusses joint application of the Running Damage Extraction (RDE) technique and single constrained Genetic Algorithm (GA) in fatigue signal editing optimisation.. In the first section, the RDE technique is used to restructure and summarise the fatigue strain. This technique combines the overlapping window and fatigue strain-life models. It is designed to identify and isolate the fatigue events that exist in the variable amplitude strain data into different segments whereby the retention of statistical parameters and the vibration energy are considered. In the second section, the fatigue data editing problem is formulated as a constrained single optimisation problem that can be solved using GA method. The GA produces the shortest edited fatigue signal by selecting appropriate segments from a pool of labelling segments. Challenges arise due to constraints on the segment selection by deviation level over three signal properties, namely cumulative fatigue damage, root mean square and kurtosis values. Experimental results over several case studies show that the idea of solving fatigue signal editing within a framework of optimisation is effective and automatic, and that the GA is robust for constrained segment selection.

  2. Upper-limb exoskeleton for human muscle fatigue

    OpenAIRE

    Ali, SK; Tokhi, MO

    2017-01-01

    Human muscle fatigue is identified as one of the causes to musculuskeletal disorder (MSD). The objective of this paper is to investigate the effect of an exoskeleton in dealing with muscle fatigue in a virtual environment. The focus of this work is, for the exoskeleton to provide support as needed by human joint. A (Proportional, Integration and Derivative) controller is used for both human and exoskeleton. Simmechanics and Simulink are used to evaluate the performance of the exoskeleton. Exp...

  3. Experimental Study on Fatigue Behaviour of BFRP-Concrete Bond Interfaces under Bending Load

    Directory of Open Access Journals (Sweden)

    Jianhe Xie

    2018-01-01

    Full Text Available Basalt fiber reinforced polymer (BFRP composites are increasingly being used to retrofit concrete structures by external bonding. For such strengthened members, the BFRP-concrete interface plays the crucial role of transferring stresses. This study aims to investigate the fatigue behaviour of the interface under bending load. A series of tests were conducted on BFRP-concrete bonded joint, including static, fatigue, and postfatigue loading. The fatigue failure modes, the development of deflection, the evolution of BFRP strains, and the propagation of interfacial cracks were analysed. In addition, the debonding-induced fatigue life of BFRP-concrete bonded joints was studied. Finally, a new model of fatigue life was proposed by defining the effective fatigue bond stress. The results showed that the fatigue experience has a significant effect on the BFRP strength especially near the root of concrete transverse crack and on the bond performance of the adhesive near the interface crack tip. There are two main fatigue failure modes: BFRP rupture and BFRP debonding. The fatigue damage development of the bond interface has three stages: rapid, stable, and unstable growth. The proposed model for the debonding-induced fatigue life is more conservative for the BFRP-concrete bonded joints under pure shear load than for those under bending load.

  4. Cognitive and Physical Fatigue Tasks Enhance Pain, Cognitive Fatigue and Physical Fatigue in People with Fibromyalgia

    Science.gov (United States)

    Dailey, Dana L; Keffala, Valerie J; Sluka, Kathleen A

    2014-01-01

    Objective Fibromyalgia is a condition characterized by chronic widespread muscle pain and fatigue. The primary objective of this study was to determine if pain, perceived cognitive fatigue, and perceived physical fatigue were enhanced in participants with fibromyalgia compared to healthy controls during a cognitive fatigue task, a physical fatigue task and a dual fatigue task. Methods Twenty four people with fibromyalgia and 33 healthy controls completed pain, fatigue and function measures. A cognitive fatigue task (Controlled Oral Word Association Test) and physical fatigue task (Valpar peg test) were done individually and combined for a dual fatigue task. Resting pain, perceived cognitive fatigue and perceived physical fatigue were assessed during each task using visual analogue scales. Function was assessed with shoulder range of motion and grip. Results People with fibromyalgia had significantly higher increases in pain, cognitive fatigue and physical fatigue when compared to healthy controls after completion of a cognitive fatigue task, a physical fatigue task, or a dual fatigue task (pfatigue tasks, respectively. Conclusions These data show that people with fibromyalgia show larger increases in pain, perceived cognitive fatigue and perceived physical fatigue to both cognitive and physical fatigue tasks compared to healthy controls. The increases in pain and fatigue during cognitive and physical fatigue tasks could influence subject participation in daily activities and rehabilitation. PMID:25074583

  5. Fatigue in Steel Highway Bridges under Random Loading

    DEFF Research Database (Denmark)

    Agerskov, Henning; Nielsen, J.A.; Vejrum, Tina

    1997-01-01

    on welded plate test specimens have been carried through. The materials that have been used are either conventional structural steel with a yield stress of ~ 400-410 MPa or high-strength steel with a yield stress of ~ 810-840 MPa.The fatigue tests have been carried out using load histories, which correspond......In the present investigation, fatigue damage accumulation in steel highway bridges under random loading is studied. The fatigue life of welded joints has been determined both experimentally and from a fracture mechanics analysis.In the experimental part of the investigation, fatigue test series...... to one week's traffic loading, determined by means of strain gage measurements on the orthotropic steel deck structure of the Farø Bridges in Denmark.The test series which have been carried through show a significant difference between constant amplitude and variable amplitude fatigue test results. Both...

  6. Fatigue in Steel Highway Bridges under Random Loading

    DEFF Research Database (Denmark)

    Agerskov, Henning; Nielsen, Jette Andkjær

    1999-01-01

    have been carried through. The materials that have been used are either conventional structural steel with a yield stress of f(y) similar to 400-410 MPa or high-strength steel with a yield stress of f(y) similar to 810-840 MPa. The fatigue tests have been carried out using load histories, which......Fatigue damage accumulation in steel highway bridges under random loading is studied. The fatigue life of welded joints has been determined both experimentally and from a fracture mechanics analysis. In the experimental part of the investigation, fatigue test series on welded plate test specimens...... correspond to one week's traffic loading, determined by means of strain gauge measurements on the orthotropic steel deck structure of the Faro Bridges in Denmark. The test series carried through show a significant difference between constant amplitude and variable amplitude fatigue test results. Both...

  7. Thermal cycling tests of actively cooled beryllium copper joints

    Energy Technology Data Exchange (ETDEWEB)

    Roedig, M.; Duwe, R.; Linke, J.; Schuster, A.; Wiechers, B. [Forschungszentrum Juelich GmbH (Germany)

    1998-01-01

    Screening tests (steady state heating) and thermal fatigue tests with several kinds of beryllium-copper joints have been performed in an electron beam facility. Joining techniques under investigation were brazing with silver containing and silver-free braze materials, hot isostatic pressing (HIP) and diffusion bonding (hot pressing). Best thermal fatigue performance was found for the brazed samples. (author)

  8. Chemical wiring and soldering toward all-molecule electronic circuitry.

    Science.gov (United States)

    Okawa, Yuji; Mandal, Swapan K; Hu, Chunping; Tateyama, Yoshitaka; Goedecker, Stefan; Tsukamoto, Shigeru; Hasegawa, Tsuyoshi; Gimzewski, James K; Aono, Masakazu

    2011-06-01

    Key to single-molecule electronics is connecting functional molecules to each other using conductive nanowires. This involves two issues: how to create conductive nanowires at designated positions, and how to ensure chemical bonding between the nanowires and functional molecules. Here, we present a novel method that solves both issues. Relevant functional molecules are placed on a self-assembled monolayer of diacetylene compound. A probe tip of a scanning tunneling microscope is then positioned on the molecular row of the diacetylene compound to which the functional molecule is adsorbed, and a conductive polydiacetylene nanowire is fabricated by initiating chain polymerization by stimulation with the tip. Since the front edge of chain polymerization necessarily has a reactive chemical species, the created polymer nanowire forms chemical bonding with an encountered molecular element. We name this spontaneous reaction "chemical soldering". First-principles theoretical calculations are used to investigate the structures and electronic properties of the connection. We demonstrate that two conductive polymer nanowires are connected to a single phthalocyanine molecule. A resonant tunneling diode formed by this method is discussed. © 2011 American Chemical Society

  9. Improvement of the auto wire feeder machine in a de-soldering process

    Directory of Open Access Journals (Sweden)

    Niramon Nonkhukhetkhong

    2016-10-01

    Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

  10. Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

    Science.gov (United States)

    Teverovsky, Alexander A.

    2014-01-01

    Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

  11. In vitro conjunctival incision repair by temperature-controlled laser soldering.

    Science.gov (United States)

    Norman, Galia; Rabi, Yaron; Assia, Ehud; Katzir, Abraham

    2009-01-01

    The common method of closing conjunctival incisions is by suturing, which is associated with several disadvantages. It requires skill to apply and does not always provide a watertight closure, which is required in some operations (e.g., glaucoma filtration). The purpose of the present study was to evaluate laser soldering as an alternative method for closing conjunctival incisions. Conjunctival incisions of 20 ex vivo porcine eyes were laser soldered using a temperature-controlled fiberoptic laser system and an albumin mixed with indocyanine green as a solder. The control group consisted of five repaired incisions by a 10-0 nylon running suture. The leak pressure of the repaired incisions was measured. The mean leak pressure in the laser-soldered group was 132 mm Hg compared to 4 mm Hg in the sutured group. There was no statistically significant difference in both the incision's length and distance from the limbus between the groups, before and after the procedure, indicating that there was no severe thermal damage. These preliminary results clearly demonstrate that laser soldering may be a useful method for achieving an immediate watertight conjunctival wound closure. This procedure is faster and easier to apply than suturing.

  12. Nano-soldering of magnetically aligned three-dimensional nanowire networks

    International Nuclear Information System (INIS)

    Gao Fan; Gu Zhiyong

    2010-01-01

    It is extremely challenging to fabricate 3D integrated nanostructures and hybrid nanoelectronic devices. In this paper, we report a simple and efficient method to simultaneously assemble and solder nanowires into ordered 3D and electrically conductive nanowire networks. Nano-solders such as tin were fabricated onto both ends of multi-segmented nanowires by a template-assisted electrodeposition method. These nanowires were then self-assembled and soldered into large-scale 3D network structures by magnetic field assisted assembly in a liquid medium with a high boiling point. The formation of junctions/interconnects between the nanowires and the scale of the assembly were dependent on the solder reflow temperature and the strength of the magnetic field. The size of the assembled nanowire networks ranged from tens of microns to millimeters. The electrical characteristics of the 3D nanowire networks were measured by regular current-voltage (I-V) measurements using a probe station with micropositioners. Nano-solders, when combined with assembling techniques, can be used to efficiently connect and join nanowires with low contact resistance, which are very well suited for sensor integration as well as nanoelectronic device fabrication.

  13. Clinical neurophysiology of fatigue.

    Science.gov (United States)

    Zwarts, M J; Bleijenberg, G; van Engelen, B G M

    2008-01-01

    Fatigue is a multidimensional concept covering both physiological and psychological aspects. Chronic fatigue is a typical symptom of diseases such as cancer, multiple sclerosis (MS), Parkinson's disease (PD) and cerebrovascular disorders but is also presented by people in whom no defined somatic disease has been established. If certain criteria are met, chronic fatigue syndrome can be diagnosed. The 4-item Abbreviated Fatigue Questionnaire allows the extent of the experienced fatigue to be assessed with a high degree of reliability and validity. Physiological fatigue has been well defined and originates in both the peripheral and central nervous system. The condition can be assessed by combining force and surface-EMG measurements (including frequency analyses and muscle-fibre conduction estimations), twitch interpolation, magnetic stimulation of the motor cortex and analysis of changes in the readiness potential. Fatigue is a well-known phenomenon in both central and peripheral neurological disorders. Examples of the former conditions are multiple sclerosis, Parkinson's disease and stroke. Although it seems to be a universal symptom of many brain disorders, the unique characteristics of the concomitant fatigue also point to a specific relationship with several of these syndromes. As regards neuromuscular disorders, fatigue has been reported in patients with post-polio syndrome, myasthenia gravis, Guillain-Barré syndrome, facioscapulohumeral dystrophy, myotonic dystrophy and hereditary motor and sensory neuropathy type-I. More than 60% of all neuromuscular patients suffer from severe fatigue, a prevalence resembling that of patients with MS. Except for several rare myopathies with specific metabolic derangements leading to exercise-induced muscle fatigue, most studies have not identified a prominent peripheral cause for the fatigue in this population. In contrast, the central activation of the diseased neuromuscular system is generally found to be suboptimal. The

  14. Reliability analysis of different structure parameters of PCBA under drop impact

    Science.gov (United States)

    Liu, P. S.; Fan, G. M.; Liu, Y. H.

    2018-03-01

    The establishing process of PCBA is modelled by finite element analysis software ABAQUS. Firstly, introduce the Input-G method and the fatigue life under drop impact are introduced and the mechanism of the solder joint failure in the process of drop is analysed. The main reason of solder joint failure is that the PCB component is suffering repeated tension and compression stress during the drop impact. Finally, the equivalent stress and peel stress of different solder joint and plate-level components under different impact acceleration are also analysed. The results show that the reliability of tin-silver copper joint is better than that of tin- lead solder joint, and the fatigue life of solder joint expectancy decrease as the impact pulse amplitude increases.