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Sample records for solder joint microstructure

  1. Reliability and microstructure of lead-free solder joints in industrial electronics after accelerated thermal aging

    NARCIS (Netherlands)

    Scaltro, F.; Biglari, M.H.; Kodentsov, A.; Yakovleva, O.; Brom, E.

    2009-01-01

    The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface component/solder together with the formation of fractures. The evolution, the morphology and the elemental

  2. Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

    Science.gov (United States)

    Mukherjee, S.; Chauhan, P.; Osterman, M.; Dasgupta, A.; Pecht, M.

    2016-07-01

    Mechanistic microstructural models have been developed to capture the effect of isothermal aging on time dependent viscoplastic response of Sn3.0Ag0.5Cu (SAC305) solders. SnAgCu (SAC) solders undergo continuous microstructural coarsening during both storage and service because of their high homologous temperature. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long term reliability of microelectronic packages. It is well documented that isothermal aging degrades the creep resistance of SAC solder. SAC305 alloy is aged for (24-1000) h at (25-100)°C (~0.6-0.8 × T melt). Cross-sectioning and image processing techniques were used to periodically quantify the effect of isothermal aging on phase coarsening and evolution. The parameters monitored during isothermal aging include size, area fraction, and inter-particle spacing of nanoscale Ag3Sn intermetallic compounds (IMCs) and the volume fraction of micronscale Cu6Sn5 IMCs, as well as the area fraction of pure tin dendrites. Effects of microstructural evolution on secondary creep constitutive response of SAC305 solder joints were then modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs in the eutectic phase; and (2) load sharing between pro-eutectic Sn dendrites and the surrounding coarsened eutectic Sn-Ag phase and microscale Cu6Sn5 IMCs. The coarse-grained polycrystalline Sn microstructure in SAC305 solder was not captured in the above model because isothermal aging does not cause any significant change in the initial grain size and orientation of SAC305 solder joints. The above mechanistic model can successfully capture the drop in creep resistance due to the influence of isothermal aging on SAC305 single crystals. Contribution of grain boundary sliding to the creep strain of

  3. Effects of In and Ni Addition on Microstructure of Sn-58Bi Solder Joint

    Science.gov (United States)

    Mokhtari, Omid; Nishikawa, Hiroshi

    2014-11-01

    In this study, the effect of adding 0.5 wt.% and 1 wt.% In and Ni to Sn-58Bi solder on intermetallic compound (IMC) layers at the interface and the microstructure of the solder alloys were investigated during reflow and thermal aging by scanning electron microscopy and electron probe micro-analysis. The results showed that the addition of minor elements was not effective in suppressing the IMC growth during the reflow; however, the addition of 0.5 wt.% In and Ni was effective in suppressing the IMC layer growth during thermal aging. The thickening kinetics of the total IMC layer was analyzed by plotting the mean thickness versus the aging time on log-log coordinates, and the results showed the transition point from grain boundary diffusion control to a volume diffusion control mechanism. The results also showed that the minor addition of In can significantly suppress the coarsening of the Bi phase.

  4. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Lei Sun

    2015-01-01

    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  5. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

    2008-07-14

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

  6. Soldering of Mg Joints Using Zn-Al Solders

    Science.gov (United States)

    Gancarz, Tomasz; Berent, Katarzyna; Skuza, Wojciech; Janik, Katarzyna

    2018-04-01

    Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 °C, 450 °C, 475 °C, and 500 °C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.

  7. Solder joint technology materials, properties, and reliability

    CERN Document Server

    Tu, King-Ning

    2007-01-01

    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  8. Fatigue and thermal fatigue of Pb-Sn solder joints

    International Nuclear Information System (INIS)

    Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

    1987-01-01

    This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55 0 C and 125 0 C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb

  9. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    OpenAIRE

    Sun, Lei; Zhang, Liang

    2015-01-01

    SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparti...

  10. Mechanical properties of Bi-In-Zn/ Cu solder joint system

    International Nuclear Information System (INIS)

    Ervina Efzan Mohd Noor; Mohammed Noori Ridha; Ahmad Badri Ismail; Nurulakmal Mohd Sharif; Kuan Yew Cheong; Tadashi Ariga; Zuhailawati Hussain

    2009-01-01

    Full text: In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry; the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this works, microstructure and mechanical properties of different reflow temperature (80, 100, 120 and 140 degree Celsius) for solder joints on shear strength of Bi-In-Zn lead free solder with low melting temperature of 60 degree Celsius on Cu solder joint has been investigated. This paper will compared the mechanical properties of the Bi-In-Zn lead-free solder alloys with current lead-free solder, Sn-Ag-Cu solder alloy. The fracture surface analyses have been observed by Optical Microscope and were investigated by Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX) and proved it by X-ray diffraction (XRD). (author)

  11. Interfacial reaction of Sn-based solder joint in the package system

    Science.gov (United States)

    Gu, Huandi

    In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

  12. Quality Analysis of Welded and Soldered Joints of Cu-Nb Microcomposite Wires

    Directory of Open Access Journals (Sweden)

    Nikolaj VIŠNIAKOV

    2011-03-01

    Full Text Available Quality analysis of welded and soldered joints of Cu-Nb microcomposite wires has been performed. Quality and mechanical characteristics of joints as ultimate tensile stress limit and elongation at break were measured with an universal testing machine and controlled visually using an optical microscope. Two wires joints were soldered with silver and copper solders and put into steel and copper sleeve respectively. Another two wires joints were soldered with silver solder and welded without any reinforcement. Joints soldered with the silver solder and steel sleeve have demonstrated the best mechanical characteristics: ultimate tensile stress limit of 650 MPa and elongation at break of 0.85 %. Joints soldered with the copper sleeve have no advantages comparing with the soldered butt joint. Ultimate tensile stress limit and elongation at break were in 300 MPa - 350 MPa and in 0.35 % - 0.45 % ranges respectively. Two welded joints had ultimate tensile stress limit of 470 MPa and elongation at break of 0.71 %. In all joints the microstructure of Nb filaments was destroyed and mechanical properties have been specified by mechanical strength of copper and sleeve materials only.http://dx.doi.org/10.5755/j01.ms.17.1.242

  13. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-11-25

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

  14. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    International Nuclear Information System (INIS)

    Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-01-01

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

  15. Microstructure evolution and thermomechanical fatigue of solder materials

    NARCIS (Netherlands)

    Matin, M.A.

    2005-01-01

    The microelectronics industry is confronted with the new challenge to produce joints with lead-free solder materials replacing classical tin-lead solders in devices used in many fields (e.g. consumer electronics, road transport, aviation, space-crafts, telecommunication). In service, solder

  16. Characterization of the microstructure of tin-silver lead free solder

    Energy Technology Data Exchange (ETDEWEB)

    Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

    2016-07-05

    Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

  17. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

    Science.gov (United States)

    Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

    2017-08-01

    Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

  18. Visual detection of defects in solder joints

    Science.gov (United States)

    Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

    1995-03-01

    The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

  19. Mechanical properties of soldered joints of niobium base alloys

    International Nuclear Information System (INIS)

    Grishin, V.L.

    1980-01-01

    Mechanical properties of soldered joints of niobium alloys widely distributed in industry: VN3, VN4, VN5A, VN5AE, VN5AEP etc., 0.6-1.2 mm thick are investigated. It is found out that the usage of zirconium-vanadium, titanium-tantalum solders for welding niobium base alloys permits to obtain soldered joints with satisfactory mechanical properties at elevated temperatures

  20. Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

    Science.gov (United States)

    2015-05-05

    under bump metallurgy and solder joint geometry on Sn grain morphology in Pb free solder joints were examined. SnAgCu solder joints were examined for...free solder interconnects”, Sci. Technol. Weld . Join. 13, 732 (2008). [3.25] Terashima, S., Takahama, K., Nozaki, M., and Tanaka, M. Recrystallization

  1. Impurity Effects in Electroplated-Copper Solder Joints

    Directory of Open Access Journals (Sweden)

    Hsuan Lee

    2018-05-01

    Full Text Available Copper (Cu electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl disulfide (SPS with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

  2. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    CERN Document Server

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

    2015-01-01

    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  3. Characteristics of solder joints under fatigue loads using piezomechanical actuation

    Science.gov (United States)

    Shim, Dong-Jin; Spearing, S. Mark

    2003-07-01

    Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

  4. Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Wang Fengjiang [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States); O' Keefe, Matthew [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)], E-mail: mjokeefe@mst.edu; Brinkmeyer, Brandon [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)

    2009-05-27

    The effect of incorporating eutectic Sn-Pb solder with Sn-3.0Ag-0.5Cu (SAC) Pb-free solder on the microstructure and tensile properties of the mixed alloys was investigated. Alloys containing 100, 75, 50, 25, 20, 15, 10, 5 and 0 wt% SAC, with the balance being Sn-37Pb eutectic solder alloy, were prepared and characterized. Optical and scanning electron microscopy were used to analyze the microstructures while 'mini-tensile' test specimens were fabricated and tested to determine mechanical properties at the mm length scale, more closely matching that of the solder joints. Microstructural analysis indicated that a Pb-rich phase formed and was uniformly distributed at the boundary between the Sn-rich grains or between the Sn-rich and the intermetallic compounds in the solder. Tensile results showed that mixing of the alloys resulted in an increase in both the yield and the ultimate tensile strength compared to the original solders, with the 50% SAC-50% Sn-Pb mixture having the highest measured strength. Initial investigations indicate the formation and distribution of a Pb-rich phase in the mixed solder alloys as the source of the strengthening mechanism.

  5. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    Science.gov (United States)

    Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

    2016-12-01

    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

  6. Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock

    Science.gov (United States)

    Han, Jing; Tan, Shihai; Guo, Fu

    2018-01-01

    Ball grid array (BGA) samples were soldered on a printed circuit board with Sn37Pb solder paste to investigate the recrystallization induced by subgrain rotation during thermal shock. The composition of the solder balls was Sn3.0Ag0.5Cu-Sn37Pb, which comprised mixed solder joints. The BGA component was cross-sectioned before thermal shock. The microstructure and grain orientations were obtained by a scanning electron microscope equipped with an electron back-scattered diffraction system. Two mixed solder joints at corners of the BGA component were selected as the subjects. The results showed that recrystallization occurred at the corner of the solder joints after 200 thermal shock cycles. The recrystallized subgrains had various new grain orientations. The newly generated grain orientations were closely related to the initial grain orientations, which indicated that different subgrain rotation behaviors could occur in one mixed solder joint with the same initial grain orientation. When the misorientation angles were very small, the rotation axes were about Sn [100], [010] and [001], as shown by analyzing the misorientation angles and subgrain rotation axes, while the subgrain rotation behavior with large misorientation angles in the solder joints was much more complicated. As Pb was contained in the solder joints and the stress was concentrated on the corner of the mixed solder joints, concaves and cracks were formed. When the adjacent recrystallized subgrains were separated, and the process of the continuous recrystallization was limited.

  7. Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

    International Nuclear Information System (INIS)

    Zhang, Liang; Han, Ji-guang; Guo, Yong-huan; He, Cheng-wen

    2014-01-01

    With the addition of 0.03 wt% rare earth Ce, in our previous works, the properties of SnAgCu solder were enhanced obviously. Based on the Garofalo–Arrhenius creep constitutive model, finite element method was used to simulate the stress–strain response during thermal cycle loading, and combined with the fatigue life prediction models, the fatigue life of SnAgCu/SnAgCuCe solder joints was calculated respectively, which can demonstrate the effect of the rare earth Ce on the fatigue life of SnAgCu solder joints. The results indicated that the maximum stress–strain can be found on the top surface of the corner solder joint, and the warpage of the PCB substrate occurred during thermal cycle loading. The trends obtained from modeling results have a good agreement with the experimental data reported in the literature for WLCSP devices. In addition, the stress–strain of SnAgCuCe solder joints is lower than that of SnAgCu solder joints. The thermal fatigue lives of solder joints calculated based on the creep model and creep strain energy density model show that the fatigue life of SnAgCuCe solder joints is higher than the SnAgCu solder joints. The fatigue life of SnAgCuCe solder joints can be enhanced significantly with the addition of Ce, is 30.2% higher than that of SnAgCu solder joints, which can be attributed to the CeSn 3 particles formed resisting the motion of dislocation; moreover, the refinement of microstructure and the IMC sizes also contribute to the enhancement of fatigue life, which elucidates that SnAgCuCe solder can be utilized in electronic industry with high reliability replacing the SnAgCu solder

  8. Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

    Science.gov (United States)

    Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

    2018-03-01

    In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

  9. Strength of joints brazed with two-phase solders

    International Nuclear Information System (INIS)

    Shnyakin, N.S.; Parfenova, L.V.; Ekatova, A.S.; Prilepskaya, I.V.

    1976-01-01

    Dependence of the structure and strength of soldered joints upon a gap size in case of 1Kh18N10T stainless steel soldering with a double-phase solder of Ni-Zn-Cu system is described. Butt and lap joints have been subjected to soldering with gas-flame and induction heating. The optimum conditions of the solder crystallization are determined with wedge-gap samples. The studies show that the character of distribution of a fusible β-phase in metal depends upon a gap size. With gaps up to 0.1 mm the β-phase enriched with a fusible component (zinc) runs as a continuous thin interlayer in the middle of the seam. As a result of zinc evaporation from the β-phase this interlayer becomes internally oxidized. After the sample is broken an oxidized fracture gives one the impression of a poor fusion in the middle part of the joint. The ultimate strength of butt joints is 15-20 kgf/sq.mm. A value of thermal expansion of 1Kh18N10T steel samples, 1-5 mm thick, has been experimentally determined for butt soldering. The elongation of two halves of the sample is measured by an indicator and proved to be 0.89 mm for a 50x50x2 mm sample at a soldering temperature of 1.100 deg C. The paper presents methods for the calculation of an optimal gap value for butt soldering with a local gas-flame and induction heating

  10. Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

    Science.gov (United States)

    Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R.

    2014-01-01

    A fracture mechanism map (FMM) is a powerful tool which correlates the fracture behavior of a material to its microstructural characteristics in an explicit and convenient way. In the FMM for solder joints, an effective thickness of the interfacial intermetallic compound (IMC) layer ( t eff) and the solder yield strength ( σ ys,eff) are used as abscissa and ordinate axes, respectively, as these two predominantly affect the fracture behavior of solder joints. Earlier, a definition of t eff, based on the uniform thickness of IMC ( t u) and the average height of the IMC scallops ( t s), was proposed and shown to aptly explain the fracture behavior of solder joints on Cu. This paper presents a more general definition of t eff that is more widely applicable to a range of metallizations, including Cu and electroless nickel immersion gold (ENIG). Using this new definition of t eff, mode I FMM for SAC387/Cu joints has been updated and its validity was confirmed. A preliminary FMM for SAC387/Cu joints with ENIG metallization is also presented.

  11. The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

    Science.gov (United States)

    Werden, Jesse

    The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the

  12. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Energy Technology Data Exchange (ETDEWEB)

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

    2013-06-01

    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  13. Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

    Science.gov (United States)

    Coyle, Richard J.; Sweatman, Keith; Arfaei, Babak

    2015-09-01

    Thermal fatigue is a major source of failure of solder joints in surface mount electronic components and it is critically important in high reliability applications such as telecommunication, military, and aeronautics. The electronic packaging industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu alloys first established as replacements for eutectic SnPb. This paper discusses the results from Pb-free solder joint reliability programs sponsored by two industry consortia. The characteristic life in accelerated thermal cycling is reported for 12 different Pb-free solder alloys and a SnPb control in 9 different accelerated thermal cycling test profiles in terms of the effects of component type, accelerated thermal cycling profile and dwell time. Microstructural analysis on assembled and failed samples was performed to investigate the effect of initial microstructure and its evolution during accelerated thermal cycling test. A significant finding from the study is that the beneficial effect of Ag on accelerated thermal cycling reliability (measured by characteristic lifetime) diminishes as the severity of the accelerated thermal cycling, defined by greater ΔT, higher peak temperature, and longer dwell time increases. The results also indicate that all the Pb-free solders are more reliable in accelerated thermal cycling than the SnPb alloy they have replaced. Suggestions are made for future work, particularly with respect to the continued evolution of alloy development for emerging application requirements and the value of using advanced analytical methods to provide a better understanding of the effect of microstructure and its evolution on accelerated thermal cycling performance.

  14. Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint

    Science.gov (United States)

    Darbandi, Payam

    Due to the awareness of the potential health hazards associated with the toxicity of lead (Pb), actions have been taken to eliminate or reduce the use of Pb in consumer products. Among those, tin (Sn) solders have been used for the assembly of electronic systems. Anisotropy is of significant importance in all structural metals, but this characteristic is unusually strong in Sn, making Sn based solder joints one of the best examples of the influence of anisotropy. The effect of anisotropy arising from the crystal structure of tin and large grain microstructure on the microstructure and the evolution of constitutive responses of microscale SAC305 solder joints is investigated. Insights into the effects of key microstructural features and dominant plastic deformation mechanisms influencing the measured relative activity of slip systems in SAC305 are obtained from a combination of optical microscopy, orientation imaging microscopy (OIM), slip plane trace analysis and crystal plasticity finite element (CPFE) modeling. Package level SAC305 specimens were subjected to shear deformation in sequential steps and characterized using optical microscopy and OIM to identify the activity of slip systems. X-ray micro Laue diffraction and high energy monochromatic X-ray beam were employed to characterize the joint scale tensile samples to provide necessary information to be able to compare and validate the CPFE model. A CPFE model was developed that can account for relative ease of activating slip systems in SAC305 solder based upon the statistical estimation based on correlation between the critical resolved shear stress and the probability of activating various slip systems. The results from simulations show that the CPFE model developed using the statistical analysis of activity of slip system not only can satisfy the requirements associated with kinematic of plastic deformation in crystal coordinate systems (activity of slip systems) and global coordinate system (shape changes

  15. Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

    International Nuclear Information System (INIS)

    Liu, X.W.; Plumbridge, W.J.

    2003-01-01

    The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

  16. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Directory of Open Access Journals (Sweden)

    Mohd Nizam Ab. Rahman

    2014-12-01

    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  17. Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

    Energy Technology Data Exchange (ETDEWEB)

    Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

    1999-11-01

    Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

  18. Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints

    International Nuclear Information System (INIS)

    Dudek, M.A.; Hunter, L.; Kranz, S.; Williams, J.J.; Lau, S.H.; Chawla, N.

    2010-01-01

    The volume, size, and dispersion of porosity in solder joints are known to affect mechanical performance and reliability. Most of the techniques used to characterize the three-dimensional (3D) nature of these defects are destructive. With the enhancements in high resolution computed tomography (CT), the detection limits of intrinsic microstructures have been significantly improved. Furthermore, the 3D microstructure of the material can be used in finite element models to understand their effect on microscopic deformation. In this paper we describe a technique utilizing high resolution (< 1 μm) X-ray tomography for the three-dimensional (3D) visualization of pores in Sn-3.9Ag-0.7Cu/Cu joints. The characteristics of reflow porosity, including volume fraction and distribution, were investigated for two reflow profiles. The size and distribution of porosity size were visualized in 3D for four different solder joints. In addition, the 3D virtual microstructure was incorporated into a finite element model to quantify the effect of voids on the lap shear behavior of a solder joint. The presence, size, and location of voids significantly increased the severity of strain localization at the solder/copper interface.

  19. Multi-layer SiC ceramics/Mo joints brazed using high-temperature solders

    International Nuclear Information System (INIS)

    Olesinska, W.; Kesik, J.

    2003-01-01

    The paper presents the results of studies on joining SiC ceramics with molybdenum, with the ceramic surface being activated by titanium, chromium or copper. Titanium or chromium were deposited by the sputtering technique, and copper - by the electro-chemical method. The microstructures of the SiC/Mo joints brazed with the CuMn13Ni3 solder and copper in a nitrogen atmosphere were examined and the results discussed. The joints, in which the ceramic surface was activated in addition with chromium, do not contain mechanical defects caused by the joining process, and the ceramic surface is covered with a continuous layer of the solder. A phase analysis of the interface surface identified an MeSiC phase. The mechanical strength of the joints in which the ceramic surface was modified by the Ti, Cr and Cu layers was markedly greater than that of the joints brazed directly to the uncoated ceramics with the use of active solders. (author)

  20. Microstructural effects on constitutive and fatigue fracture behavior of TinSilverCopper solder

    Science.gov (United States)

    Tucker, Jonathon P.

    As microelectronic package construction becomes more diverse and complex, the need for accurate, geometry-independent material constitutive and failure models increases. Evaluations of packages based on accelerated environmental tests (such as accelerated thermal cycling or power cycling) only provide package-dependent reliability information. In addition, extrapolations of such test data to life predictions under field conditions are often empirical. Besides geometry, accelerated environmental test data must account for microstructural factors such as alloy composition or isothermal aging condition, resulting in expensive experimental variation. In this work, displacement-controlled, creep, and fatigue lap shear tests are conducted on specially designed SnAgCu test specimens with microstructures representative to those found in commercial microelectronic packages. The data are used to develop constitutive and fatigue fracture material models capable of describing deformation and fracture behavior for the relevant temperature and strain rate ranges. Furthermore, insight is provided into the microstructural variation of solder joints and the subsequent effect on material behavior. These models are appropriate for application to packages of any geometrical construction. The first focus of the thesis is on Pb-mixed SnAgCu solder alloys. During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of SnPb and SnAgCu often result from either mixed assemblies or rework. Three alloys of 1, 5 and 20 weight percent Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn37Pb components mixed with Sn3.0Ag0.5Cu. Displacement-controlled (constant strain rate) and creep tests were performed at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. Rate-dependent constitutive models for Pb

  1. Influence of solder joint length to the mechanical aspect during the thermal stress analysis

    Science.gov (United States)

    Tan, J. S.; Khor, C. Y.; Rahim, Wan Mohd Faizal Wan Abd; Ishak, Muhammad Ikman; Rosli, M. U.; Jamalludin, Mohd Riduan; Zakaria, M. S.; Nawi, M. A. M.; Aziz, M. S. Abdul; Ani, F. Che

    2017-09-01

    Solder joint is an important interconnector in surface mount technology (SMT) assembly process. The real time stress, strain and displacement of the solder joint is difficult to observe and assess the experiment. To tackle these problems, simulation analysis was employed to study the von Mises stress, strain and displacement in the thermal stress analysis by using Finite element based software. In this study, a model of leadless electronic package was considered. The thermal stress analysis was performed to investigate the effect of the solder length to those mechanical aspects. The simulation results revealed that solder length gives significant effect to the maximum von Mises stress to the solder joint. Besides, changes in solder length also influence the displacement of the solder joint in the thermal environment. The increment of the solder length significantly reduces the von Mises stress and strain on the solder joint. Thus, the understanding of the physical parameter for solder joint is important for engineer prior to designing the solder joint of the electronic component.

  2. Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

    Directory of Open Access Journals (Sweden)

    Molnar A.

    2017-06-01

    Full Text Available In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

  3. Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature

    Energy Technology Data Exchange (ETDEWEB)

    Prabhu, K.N., E-mail: prabhukn_2002@yahoo.co.in [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India); Deshapande, Parashuram; Satyanarayan [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India)

    2012-01-30

    Highlights: Black-Right-Pointing-Pointer Effect of cooling rate on tensile and impact properties of Sn-9Zn alloy was assessed. Black-Right-Pointing-Pointer Both DBTT and UTS of the solder alloy increased with increase in cooling rate. Black-Right-Pointing-Pointer An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile-brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn-9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 Degree-Sign C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the

  4. Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature

    International Nuclear Information System (INIS)

    Prabhu, K.N.; Deshapande, Parashuram; Satyanarayan

    2012-01-01

    Highlights: ► Effect of cooling rate on tensile and impact properties of Sn–9Zn alloy was assessed. ► Both DBTT and UTS of the solder alloy increased with increase in cooling rate. ► An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile–brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn–9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 °C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the DBTT.

  5. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Dias, Marcelino; Costa, Thiago [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Rocha, Otávio [Federal Institute of Education, Science and Technology of Pará — IFPA, 66093-020 Belém, PA (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos — UFSCar, 13565-905 São Carlos, SP (Brazil); Cheung, Noé, E-mail: cheung@fem.unicamp.br [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil)

    2015-08-15

    Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing.

  6. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

    Science.gov (United States)

    Lee, Sang-Yeob; Lee, Jong-Hyuk

    2010-12-01

    The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

  7. Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

    2008-04-24

    The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes.

  8. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Fan Yang

    2016-01-01

    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  9. Investigation into mechanical properties of joints of heterogeneous materials brazed with high-temperature solders

    International Nuclear Information System (INIS)

    Lomenko, V.I.; Merkushev, V.P.; Borodina, L.M.; Sycheva, T.S.; Tokhtina, O.A.; Frolov, N.N.

    1988-01-01

    Mechanical properties of copper joints with copper, 12Kh18M10T steel and KhD50 composite obtained by vacuum brazing by copper-titanium solder as compared with properties of joints brazed by PSr 72 and PMFOTsr 6-4-0.03 solders in hydrogen are studied. Dependences of joints strength on temperature of contact - reactive vacuum brazing are obtained. Possible applications of joints of dissimilar materials in electrovacuum devices subjected to the effect of dynamic loadings are established

  10. The creep behavior of In-Ag eutectic solder joints

    International Nuclear Information System (INIS)

    Reynolds, H.L.; Kang, S.H.; Morris, J.W. Jr.; Univ. of California, Berkeley, CA

    1999-01-01

    The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90 C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the In-rich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems

  11. Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

    Science.gov (United States)

    Hasnine, M.; Tolla, B.; Vahora, N.

    2018-04-01

    This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

  12. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  13. Soldering handbook

    CERN Document Server

    Vianco, Paul T

    1999-01-01

    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  14. The Shear Strength and Fracture Behavior of Sn-Ag- xSb Solder Joints with Au/Ni-P/Cu UBM

    Science.gov (United States)

    Lee, Hwa-Teng; Hu, Shuen-Yuan; Hong, Ting-Fu; Chen, Yin-Fa

    2008-06-01

    This study investigates the effects of Sb addition on the shear strength and fracture behavior of Sn-Ag-based solders with Au/Ni-P/Cu underbump metallization (UBM) substrates. Sn-3Ag- xSb ternary alloy solder joints were prepared by adding 0 wt.% to 10 wt.% Sb to a Sn-3.5Ag alloy and joining them with Au/Ni-P/Cu UBM substrates. The solder joints were isothermally stored at 150°C for up to 625 h to study their microstructure and interfacial reaction with the UBM. Single-lap shear tests were conducted to evaluate the mechanical properties, thermal resistance, and failure behavior. The results show that UBM effectively suppressed intermetallic compound (IMC) formation and growth during isothermal storage. The Sb addition helped to refine the Ag3Sn compounds, further improving the shear strength and thermal resistance of the solders. The fracture behavior evolved from solder mode toward the mixed mode and finally to the IMC mode with increasing added Sb and isothermal storage time. However, SnSb compounds were found in the solder with 10 wt.% Sb; they may cause mechanical degradation of the solder after long-term isothermal storage.

  15. Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

    Science.gov (United States)

    Abdelhadi, Ousama Mohamed Omer

    Continuous miniaturization of microelectronic interconnects demands smaller joints with comparable microstructural and structural sizes. As the size of joints become smaller, the volume of intermetallics (IMCs) becomes comparable with the joint size. As a result, the kinetics of bond formation changes and the types and thicknesses of IMC phases that form within the constrained region of the bond varies. This dissertation focuses on investigating combination effects of process parameters and size on kinetics of bond formation, resulting microstructure and the mechanical properties of joints that are formed under structurally constrained conditions. An experiment is designed where several process parameters such as time of bonding, temperature, and pressure, and bond thickness as structural chracteristic, are varied at multiple levels. The experiment is then implemented on the process. Scanning electron microscope (SEM) is then utilized to determine the bond thickness, IMC phases and their thicknesses, and morphology of the bonds. Electron backscatter diffraction (EBSD) is used to determine the grain size in different regions, including the bulk solder, and different IMC phases. Physics-based analytical models have been developed for growth kinetics of IMC compounds and are verified using the experimental results. Nanoindentation is used to determine the mechanical behavior of IMC phases in joints in different scales. Four-point bending notched multilayer specimen and four-point bending technique were used to determine fracture toughness of the bonds containing IMCs. Analytical modeling of peeling and shear stresses and fracture toughness in tri-layer four-point bend specimen containing intermetallic layer was developed and was verified and validated using finite element simulation and experimental results. The experiment is used in conjunction with the model to calculate and verify the fracture toughness of Cu6Sn5 IMC materials. As expected two different IMC phases

  16. The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

    Science.gov (United States)

    Mayappan, R.; Salleh, A.; Andas, J.

    2017-09-01

    Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

  17. A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

    Science.gov (United States)

    Wei, Helin; Wang, Kuisheng

    2011-11-01

    Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

  18. The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

    Science.gov (United States)

    Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

    2015-12-01

    Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (ptensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

  19. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Silva, Bismarck L., E-mail: bismarck_luiz@yahoo.com.br [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, 13083-860 Campinas, SP (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil)

    2016-04-15

    Low temperature soldering technology encompasses Sn–Bi based alloys as reference materials for joints since such alloys may be molten at temperatures less than 180 °C. Despite the relatively high strength of these alloys, segregation problems and low ductility are recognized as potential disadvantages. Thus, for low-temperature applications, Bi–Sn eutectic or near-eutectic compositions with or without additions of alloying elements are considered interesting possibilities. In this context, additions of third elements such as Cu and Ag may be an alternative in order to reach sounder solder joints. The length scale of the phases and their proportions are known to be the most important factors affecting the final wear, mechanical and corrosions properties of ternary Sn–Bi–(Cu,Ag) alloys. In spite of this promising outlook, studies emphasizing interrelations of microstructure features and solidification thermal parameters regarding these multicomponent alloys are rare in the literature. In the present investigation Sn–Bi–(Cu,Ag) alloys were directionally solidified (DS) under transient heat flow conditions. A complete characterization is performed including experimental cooling thermal parameters, segregation (XRF), optical and scanning electron microscopies, X-ray diffraction (XRD) and length scale of the microstructural phases. Experimental growth laws relating dendritic spacings to solidification thermal parameters have been proposed with emphasis on the effects of Ag and Cu. The theoretical predictions of the Rappaz-Boettinger model are shown to be slightly above the experimental scatter of secondary dendritic arm spacings for both ternary Sn–Bi–Cu and Sn–Bi–Ag alloys examined. - Highlights: • Dendritic growth prevailed for the ternary Sn–Bi–Cu and Sn–Bi–Ag solder alloys. • Bi precipitates within Sn-rich dendrites were shown to be unevenly distributed. • Morphology and preferential region for the Ag{sub 3}Sn growth depend on Ag

  20. Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy

    Directory of Open Access Journals (Sweden)

    Abdoul-Aziz Bogno

    2015-01-01

    Full Text Available The properties and performance of lead-free solder alloys such as fluidity and wettability are defined by the alloy composition and solidification microstructure. Rapid solidification of metallic alloys is known to result in refined microstructures with reduced microsegregation and improved mechanical properties of the final products as compared to normal castings. The rapidly solidified Sn-based solders by melt spinning were shown to be suitable for soldering with low temperature and short soldering duration. In the present study, rapidly solidified Sn–0.7 wt.%Cu droplets generated by impulse atomization (IA were achieved as well as directional solidification under transient conditions at lower cooling rate. This paper reports on a comparative study of the rapidly solidified and the directionally solidified samples. Different but complementary characterization techniques were used to fully analyze the solidification microstructures of the samples obtained under the two cooling regimes. These include X-ray diffractometry (XRD and scanning electron microscopy (SEM. In order to compare the tensile strength and elongation to fracture of the directionally solidified ingot and strip castings with the atomized droplet, compaction and extrusion of the latter were carried out. It was shown that more balanced and superior tensile mechanical properties are available for the hot extruded samples from compacted as-atomized Sn–0.7 wt.%Cu droplets. Further, elongation-to-fracture was 2–3× higher than that obtained for the directionally solidified samples.

  1. Effect of gamma radiation on micromechanical hardness of lead-free solder joint

    Energy Technology Data Exchange (ETDEWEB)

    Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

    2015-09-25

    Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

  2. How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

    Science.gov (United States)

    Suhir, E.; Yi, S.; Ghaffarian, R.

    2017-03-01

    It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

  3. Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu

    Science.gov (United States)

    Lee, Hwa-Teng; Huang, Kuo-Chen

    2016-12-01

    Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

  4. Intergranular stress corrosion in soldered joints of stainless steel 304

    International Nuclear Information System (INIS)

    Zamora R, L.

    1994-01-01

    The intergranular stress cracking of welded joints of austenitic stainless steel, AISI 304, is a serious problem in BWR type reactors. It is associated with the simultaneous presence of three factors; stress, a critical media and sensibilization (DOS). EPR technique was used in order to verify the sensibilization degree in the base metal, and the zone affected by heat and welding material. The characterization of material was done. The objective of this work is the study of microstructure and the evaluation of EPR technique used for the determination of DOS in a welded plate of austenitic stainless steel AISI 304. (Author)

  5. Aging treatment characteristics of solder bump joint for high reliability optical module

    International Nuclear Information System (INIS)

    Kim, Kyung-Seob; Yu, Chung-Hee; Yang, Jun-Mo

    2004-01-01

    The joint strength and fracture surfaces of Sn-37 mass% Pb and Au stud bumps for photo diode packages after isothermal aging testing were studied experimentally. Al/Au stud bumps and Cu/Sn-37 mass% Pb solders were adopted, and aged for up to 900 h to analyze the effect of intermetallic compound (IMC). The joint strength decreased with aging time. The diffraction patterns of Cu 6 Sn 5 , scallop-shaped IMCs, and planar-shaped Cu 3 Sn were characterized using transmission electron microscopy (TEM). The formation of Kirkendall voids and the growth of IMCs at the solder were found to be a possible mechanism for joint strength reduction

  6. Investigation on solder joint strength of nickel tin-plated and CRS tabs with PCB

    International Nuclear Information System (INIS)

    Luay Hussain

    2002-01-01

    Failure analysis on easily peels off Nickel and CRS steel tabs from PCB was carried out. Nickel Tin plated tabs, CRS steel tabs and tube were joined to the PCB using reflow/ convection soldering, in an oven. The solder paste composition is Sn36/Pb35/Ag2. Peel test was conducted and it was found that many tabs could be easily peeled off with low force. Porosities which varies from 0.4 mm to < 0.01mm in diameter, developed during soldering process and solidification was noted. It was found, the number, size and position of these porosities inside the solder layer on both parts of the tabs affect the peel strength. Scanning Electron Microscopy study and EDX analysis were carried out. It was found that the low peel strength values were due to the combination of generation and development of porosities during soldering process which act as stress concentrators and the evolution (growth) of eutectic Sn/Pb and Sn/Ni/Cu brittle grainy phase. Large eutectic microstructure with brittle Sn-Ni-Cu grainy phase enhances the failure with low peeling forces. Sample showing no feature of Sn/Ni/Cu grain gave high peeling strength value. Solder reflow, an important process, can result in strength enhancement (if it was controlled for example in a furnace). (Author)

  7. Interface between Sn-Sb-Cu solder and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

    2011-07-15

    Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

  8. Mechanical performances of lead-free solder joint connections with applications in the aerospace domain

    Directory of Open Access Journals (Sweden)

    Georgiana PADURARU

    2016-03-01

    Full Text Available The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of solder joint in correlation with different pad finishes, there were made some mechanical determinations using a dedicated Share Test System. The theoretical model highlights the link between the experimental results and the influence of gravitational acceleration on the mechanical and functional integrity of the electronic assemblies that works in vibration environment. The paper novelty is provided by the interdisciplinary experiment that offers results that can be used in the mechanical, tribological, electronical and aerospace domains.

  9. A review of typical thermal fatigue failure models for solder joints of electronic components

    Science.gov (United States)

    Li, Xiaoyan; Sun, Ruifeng; Wang, Yongdong

    2017-09-01

    For electronic components, cyclic plastic strain makes it easier to accumulate fatigue damage than elastic strain. When the solder joints undertake thermal expansion or cold contraction, different thermal strain of the electronic component and its corresponding substrate is caused by the different coefficient of thermal expansion of the electronic component and its corresponding substrate, leading to the phenomenon of stress concentration. So repeatedly, cracks began to sprout and gradually extend [1]. In this paper, the typical thermal fatigue failure models of solder joints of electronic components are classified and the methods of obtaining the parameters in the model are summarized based on domestic and foreign literature research.

  10. Microstructure characteristics of vacuum glazing brazing joints using laser sealing technique

    Science.gov (United States)

    Liu, Sixing; Yang, Zheng; Zhang, Jianfeng; Zhang, Shanwen; Miao, Hong; Zhang, Yanjun; Zhang, Qi

    2018-05-01

    Two pieces of plate glass were brazed into a composite of glazing with a vacuum chamber using PbO-TiO2-SiO2-RxOy powder filler alloys to develop a new type of vacuum glazing. The brazing process was carried out by laser technology. The interface characteristics of laser brazed joints formed between plate glass and solder were investigated using optical microscope, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD) techniques. The results show that the inter-diffusion of Pb/Ti/Si/O elements from the sealing solder toward the glass and O/Al/Si elements from the glass toward the solder, resulting in a reaction layer in the brazed joints. The microstructure phases of PbTiO3, AlSiO, SiO2 and PbO in the glass/solder interface were confirmed by XRD analysis. The joining of the sealing solder to the glass was realized by the reaction products like fibrous structures on interface, where the wetting layer can help improve the bonding performance and strength between the sealing solder and the plate glass during the laser brazing process.

  11. Effect of gap distance on tensile strength of preceramic base metal solder joints.

    Science.gov (United States)

    Fattahi, Farnaz; Motamedi, Milad

    2011-01-01

    In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023), but the differences between other groups were not sig-nificant at a significance level of 0.05. There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints.

  12. Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

    Directory of Open Access Journals (Sweden)

    Jinhua Mi

    2014-01-01

    Full Text Available Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA and fine-pitch ball grid array (FBGA interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products.

  13. Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

    International Nuclear Information System (INIS)

    Koo, Jahyun; Lee, Changsoo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck Mo

    2015-01-01

    It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu_3_3Al_1_7, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu_6Sn_5 networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu_6Sn_5 IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu_3_3Al_1_7 IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

  14. Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

    Energy Technology Data Exchange (ETDEWEB)

    Koo, Jahyun; Lee, Changsoo [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of); Hong, Sung Jea [MK Electron Co., Ltd., Yongin Cheoin-gu 316-2 (Korea, Republic of); Kim, Keun-Soo, E-mail: keunsookim@hoseo.edu [Department of Display Engineering, Hoseo University, Asan 336-795 (Korea, Republic of); Lee, Hyuck Mo, E-mail: hmlee@kaist.ac.kr [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of)

    2015-11-25

    It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu{sub 33}Al{sub 17}, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu{sub 6}Sn{sub 5} networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu{sub 6}Sn{sub 5} IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu{sub 33}Al{sub 17} IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

  15. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    International Nuclear Information System (INIS)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-01-01

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines

  16. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-10-31

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

  17. Multi-scale modeling of elasto-plastic response of SnAgCu lead-free solder alloys at different ageing conditions: Effect of microstructure evolution, particle size effects and interfacial failure

    Energy Technology Data Exchange (ETDEWEB)

    Maleki, Milad; Cugnoni, Joel, E-mail: joel.cugnoni@epfl.ch; Botsis, John

    2016-04-20

    In microelectronics applications, SnAgCu lead-free solder joints play the important role of ensuring both the mechanical and electrical integrity of the components. In such applications, the SnAgCu joints are subjected to elevated homologous temperatures for an extended period of time causing significant microstructural changes and leading to reliability issues. In this study, the link between the change in microstructures and deformation behavior of SnAgCu solder during ageing is explained by developing a hybrid multi-scale microstructure-based modeling approach. Herein, the SnAgCu solder alloy is seen as a three phase metal matrix composite in which Ag{sub 3}Sn and Cu{sub 6}Sn{sub 5} hard intermetallics play the role of reinforcements and Sn the role of a ductile matrix. The hardening of the Sn matrix due to fine intermetallics in the eutectic mixture is modeled by incorporating the mean field effects of geometrically necessary dislocations. Subsequently, a two level homogenization procedure based on micromechanical finite element (FE) models is used to capture the interactions between the different phases. For this purpose, tomographic images of microstructures obtained by Focused Ion Beam (FIB) and synchrotron X-Ray in different ageing conditions are directly used to generate statistically representative volume elements (RVE) using 3D FE models. The constitutive behavior of the solder is determined by sequentially performing two scales of numerical homogenization at the eutectic level and then at the dendrite level. For simplification, the anisotropy of Sn as well as the potential recovery processes have been neglected in the modeling. The observed decrease in the yield strength of solder due to ageing is well captured by the adopted modeling strategy and allows explaining the different ageing mechanisms. Finally, the effects of potential debonding at the intermetallic particle-matrix interface as well as particle fracture on the overall strength of solder are

  18. Control of microstructure in soldered, brazed, welded, plated, cast or vapor deposited manufactured components

    Science.gov (United States)

    Ripley, Edward B.; Hallman, Russell L.

    2015-11-10

    Disclosed are methods and systems for controlling of the microstructures of a soldered, brazed, welded, plated, cast, or vapor deposited manufactured component. The systems typically use relatively weak magnetic fields of either constant or varying flux to affect material properties within a manufactured component, typically without modifying the alloy, or changing the chemical composition of materials or altering the time, temperature, or transformation parameters of a manufacturing process. Such systems and processes may be used with components consisting of only materials that are conventionally characterized as be uninfluenced by magnetic forces.

  19. Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

    Science.gov (United States)

    Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

    2011-01-01

    The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

  20. SMT soldering handbook

    National Research Council Canada - National Science Library

    Strauss, Rudolf

    1998-01-01

    ... 3.2.1 Constituents, melting behaviour and mechanical properties 3.2.2 Composition of solders for use in electronics 3.2.3 Lead-free solders 3.2.4 Solder impurities The soldered joint 3.3.1 Solde...

  1. Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

    Science.gov (United States)

    Yoon, Jeong-Won; Noh, Bo-In; Jung, Seung-Boo

    2011-09-01

    Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.

  2. In situ investigation of SnAgCu solder alloy microstructure

    International Nuclear Information System (INIS)

    Pietrikova, Alena; Bednarcik, Jozef; Durisin, Juraj

    2011-01-01

    Research highlights: → In situ X-ray diffraction investigation enabled detailed analysis of the melting and solidification process of the SAC305 alloy. → It was found that the SAC305 solder melts at 230 deg. C. When cooling from 240 deg. C the SAC305 alloy solidifies at the temperature of 214 deg. C. During solidification β-Sn and Cu 6 Sn 5 is also formed. Formation of Ag 3 Sn occurs at 206 deg. C and the remaining amount of alloy crystallizes approximately at 160 deg. C. → Furthermore, observation of the thermal expansion behaviour of the β-Sn tetragonal unit cell revealed linear dependence of the unit cell volume on temperature. The unit cell parameters a and c also increase linearly with the temperature. Despite the fact that the c parameter is substantially smaller than parameter a, it exhibits a significantly higher linear thermal expansion coefficient. Comparison between data obtained during heating and cooling indicates that the thermal expansion coefficient is slightly greater in the case of cooling. - Abstract: In situ X-ray diffraction experiments, using synchrotron radiation, were employed to analyze microstructure evolution of the 96.5Sn3Ag0.5Cu (wt.%)-SAC305 lead-free solder alloy during heating (30-240 deg. C), isothermal dwell (240 deg. C) and cooling (240-30 deg. C). The special emphasis was placed on the study of the melting and solidification processes, explaining formation, distribution and the order of crystallization of the crystal phases (β-Sn, intermetallic compounds) in the solder alloy. Furthermore, thermal expansion behaviour of the main constituent phase β-Sn was analyzed prior to melting and after the consequent solidification.

  3. Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

    OpenAIRE

    Koo, Ja-Myeong; Jung, Seung-Boo

    2007-01-01

    Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920); International audience; Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafte...

  4. Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement

    Energy Technology Data Exchange (ETDEWEB)

    Li, Yi, E-mail: yili64-c@my.cityu.edu.hk [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong); Luo, Kaiming; Lim, Adeline B.Y.; Chen, Zhong [School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798 (Singapore); Wu, Fengshun [School of Materials Science and Engineering, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan (China); Chan, Y.C. [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong)

    2016-07-04

    Sn57.6Bi0.4Ag solder has been reinforced successfully through the addition of tungsten (W) nanoparticles at a concentration of 0.5 wt%. With the addition of W nanoparticles, the solder matrix lamellar interphase spacing was reduced by 31.0%. Due to the dispersion of W nanoparticles and the consequently refined microstructure, the mechanical properties of the solder alloy were enhanced, as indicated by a 6.2% improvement in the microhardness. During the reflow of solder on Au/Ni/Cu pads, the entire Au layer dissolved into the molten solder rapidly and a large number of (Au,Ni)(Sn,Bi){sub 4} particles were formed. The fracture path of the as-reflowed joint was within the solder region, showing ductile characteristic, and the shear strength was reinforced by 8.2%, due to the enhanced mechanical properties of the solder. During the subsequent aging process, the Au migrated back towards the interface and a thick layer of interfacial (Au,Ni)(Sn,Bi){sub 4} IMC was formed, leading to the shift of the fracture path to the interfacial IMC region, the transformation to brittle fracture and the deterioration of the strength of the joint, due to Au embrittlement. By adding W nanoparticles, the migration of Au was mitigated and the thickness of the (Au,Ni)(Sn,Bi){sub 4} layer was reduced significantly, which reduced the Au embrittlement-induced deterioration of the strength of the joint. During electromigration, the segregation of the Bi-rich and Sn-rich phases and the accumulation of the (Au,Ni)(Sn,Bi){sub 4} layer at cathode interface were mitigated by the addition of W nanoparticles, which improved the electromigration resistance.

  5. Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy

    Science.gov (United States)

    Tikale, Sanjay; Prabhu, K. Narayan

    2018-05-01

    The effect of Al2O3 nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al2O3 nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (T L) and melting temperature range of the SAC305 solder alloy by addition of Al2O3 nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al2O3 nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu6Sn5 IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy.

  6. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    Science.gov (United States)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. PMID:27877786

  7. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    International Nuclear Information System (INIS)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. (review)

  8. Interfacial Microstructure and Shear Strength of Brazed Cu-Cr-Zr Alloy Cylinder and Cylindrical Hole by Au Based Solder

    Directory of Open Access Journals (Sweden)

    Zaihua Li

    2017-07-01

    Full Text Available Au-Ge-Ni solder was chosen for brazing of the Cu-Cr-Zr alloy cylinder and a part with a cylindrical hole (sleeve below 550 °C. The Au based solder was first sintered on the surface of the cylinder and then brazed to the inner surface of the sleeve. The effects of the heating process, the temperature and the holding time at the temperature on the microstructure of the sintered layer on the surface of the cylinder, the brazed interfacial microstructure, and the brazed shear strength between the cylinder and the sleeve were investigated by scanning electron microscope, energy dispersive X-ray spectroscopy analysis, and tensile shear tests. By approach of side solder melt feeding and brazing under proper parameters, the voids and micro cracks due to a lack of enough solder melt feeding are greatly lessened and the brazed shear strength of 100 MPa is ensured even with large clearances around 0.01 mm.

  9. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Directory of Open Access Journals (Sweden)

    Saliza Azlina O.

    2016-01-01

    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  10. Damage Model for Reliability Assessment of Solder Joints in Wind Turbines

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    environmental factors. Reliability assessment for such type of products conventionally is performed by classical reliability techniques based on test data. Usually conventional reliability approaches are time and resource consuming activities. Thus in this paper we choose a physics of failure approach to define...... damage model by Miner’s rule. Our attention is focused on crack propagation in solder joints of electrical components due to the temperature loadings. Based on the proposed method it is described how to find the damage level for a given temperature loading profile. The proposed method is discussed...

  11. Aging effects on the microstructure, surface characteristics and wettability of Cu pretinned with Sn-Pb solders

    Energy Technology Data Exchange (ETDEWEB)

    Linch, Heidi Sue [Univ. of California, Berkeley, CA (United States)

    1993-11-01

    This study investigates effects of aging in air and argon at 170 C on Cu coupons which were pretinned with 75Sn-25Pb, 8Sn-92Pb, and 5Sn-95Pb solders. Coatings were applied using electroplating or hot dipping techniques. The coating thickness was controlled between 3 to 3μm and the specimens were aged for 0 hours, 2 hours, 24 hours and 2 weeks. Wetting balance tests were used to evaluate the wettability of the test specimens. Microstructural development was evaluated using X-ray diffraction, energy dispersive X-ray and Auger spectroscopy, as well as optical and scanning electron microscopy. The wetting behavior of the test specimens is interpreted with respect to observed microstructural changes and as a function of aging time, solder composition, and processing conditions.

  12. Electromigration in 3D-IC scale Cu/Sn/Cu solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Ho, Cheng-En, E-mail: ceho1975@hotmail.com; Lee, Pei-Tzu; Chen, Chih-Nan; Yang, Cheng-Hsien

    2016-08-15

    The electromigration effect on the three-dimensional integrated circuits (3D-IC) scale solder joints with a Cu/Sn(25–50 μm)/Cu configuration was investigated using a field-emission scanning electron microscope (FE–SEM) combined with electron backscatter diffraction (EBSD) analysis system. Electron current stressing for a few days caused the pronounced accumulation of Cu{sub 6}Sn{sub 5} in specific Sn grain boundaries (GBs). The EBSD analysis indicated that both the β-Sn crystallographic orientation and GB orientation play dominant roles in this accumulation. The dependencies of the Cu{sub 6}Sn{sub 5} accumulation on the two above factors (i.e., Sn grain orientation and GB orientation) can be well rationalized via a proposed mathematic model based on the Huntington and Grone's electromigration theory with the Cu anisotropic diffusion data in a β-Sn lattice. - Highlights: • Anisotropic Cu electromigration in the 3D-IC scale microelectronic solder joints. • Pronounced accumulation of Cu{sub 6}Sn{sub 5} intermetallic in specific Sn grain boundaries. • A linear dependence of Cu{sub 6}Sn{sub 5} accumulation over the current stressing time. • β-Sn and grain boundary orientations are the dominant factors in Cu{sub 6}Sn{sub 5} accumulation.

  13. Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

    Directory of Open Access Journals (Sweden)

    Shuye Zhang

    2018-01-01

    Full Text Available Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile electronic applications. However, crack formation of the solder joint crack was occurred at low temperature curable acrylic polymer resins after bonding processes. In this study, the mechanism of SnBi58 solder joint crack at low temperature curable acrylic adhesive was investigated. In addition, SnBi58 solder joint cracks can be significantly removed by increasing the storage modulus of adhesives instead of coefficient of thermal expansion. The first approach of reducing the amount of polymer rebound can be achieved by using an ultrasonic bonding method to maintain a bonding pressure on the SnBi58 solder joints cooling to room temperature. The second approach is to increase storage modulus of adhesives by adding silica filler into acrylic polymer resins to prevent the solder joint from cracking. Finally, excellent acrylic based SnBi58 solder joints reliability were obtained after 1000 cycles thermal cycling test.

  14. Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders

    Science.gov (United States)

    Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

    2016-12-01

    Particles of Cu x Al y in Sn-Cu-Al solders have previously been shown to nucleate the Cu6Sn5 phase during solidification. In this study, the number and size of Cu6Sn5 nucleation sites were controlled through the particle size refinement of Cu x Al y via rapid solidification processing and controlled cooling in a differential scanning calorimeter. Cooling rates spanning eight orders of magnitude were used to refine the average Cu x Al y and Cu6Sn5 particle sizes down to submicron ranges. The average particle sizes, particle size distributions, and morphologies in the microstructures were analyzed as a function of alloy composition and cooling rate. Deep etching of the samples revealed the three-dimensional microstructures and illuminated the epitaxial and morphological relationships between the Cu x Al y and Cu6Sn5 phases. Transitions in the Cu6Sn5 particle morphologies from faceted rods to nonfaceted, equiaxed particles were observed as a function of both cooling rate and composition. Initial solidification cooling rates within the range of 103 to 104 °C/s were found to be optimal for realizing particle size refinement and maintaining the Cu x Al y /Cu6Sn5 nucleant relationship. In addition, little evidence of the formation or decomposition of the ternary- β phase in the solidified alloys was noted. Solidification pathways omitting the formation of the ternary- β phase agreed well with observed room temperature microstructures.

  15. Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction

    Science.gov (United States)

    Takaku, Yoshikazu; Ohnuma, Ikuo; Kainuma, Ryosuke; Yamada, Yasushi; Yagi, Yuji; Nishibe, Yuji; Ishida, Kiyohito

    2006-11-01

    Bismuth and its alloys are candidates for Pb-free high-temperature solders that can be substituted for conventional Pb-rich Pb-Sn solders (melting point (mp) = 573 583 K). However, inferior properties such as brittleness and weak bonding strength should be improved for practical use. To that end, BiCu-X (X=Sb, Sn, and Zn) Pb-free high-temperature solders are proposed. Miscibility gaps in liquid BiCu-X alloys were surveyed using the thermodynamic database ADAMIS (alloy database for micro-solders), and compositions of the BiCu-X solders were designed on the basis of calculation. In-situ composite solders that consist of a Bi-base matrix with fine intermetallic compound (IMC) particles were produced by gas-atomizing and melt-spinning methods. The interfacial reaction between in-situ composite solders and Cu or Ni substrates was investigated. The IMCs at the interface formed a thin, uniform layer, which is an appropriate morphology for a reliable solder joint.

  16. Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2018-04-01

    Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

  17. Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Kita, T; Mukaibo, N; Ando, K; Moriyama, M [Honda R and D Co. Ltd., Tokyo (Japan)

    1997-10-01

    Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

  18. Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

    Science.gov (United States)

    Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

    2017-10-01

    Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

  19. Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages

    Science.gov (United States)

    Talebanpour, B.; Huang, Z.; Chen, Z.; Dutta, I.

    2016-01-01

    In 3-dimensional (3D) packages, a stack of dies is vertically connected to each other using through-silicon vias and very thin solder micro-bumps. The thinness of the micro-bumps results in joints with a very high volumetric proportion of intermetallic compounds (IMCs), rendering them much more brittle compared to conventional joints. Because of this, the reliability of micro-bumps, and the dependence thereof on the proportion of IMC in the joint, is of substantial concern. In this paper, the growth kinetics of IMCs in thin Sn-3Ag-0.5Cu joints attached to Cu substrates were analyzed, and empirical kinetic laws for the growth of Cu6Sn5 and Cu3Sn in thin joints were obtained. Modified compact mixed mode fracture mechanics samples, with adhesive solder joints between massive Cu substrates, having similar thickness and IMC content as actual micro-bumps, were produced. The effects of IMC proportion and strain rate on fracture toughness and mechanisms were investigated. It was found that the fracture toughness G C decreased with decreasing joint thickness ( h Joint). In addition, the fracture toughness decreased with increasing strain rate. Aging also promoted alternation of the crack path between the two joint-substrate interfaces, possibly proffering a mechanism to enhance fracture toughness.

  20. The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints

    Science.gov (United States)

    Sona, Mrunali; Prabhu, K. Narayan

    2017-09-01

    The failure of solder joints due to imposed stresses in an electronic assembly is governed by shear bond strength. In the present study, the effect of wetting gravity regime on single-lap shear strength of Sn-0.3Ag-0.7Cu and Sn-2.5Ag-0.5Cu solder alloys reflowed between bare copper substrates as well as Ni-coated Cu substrates was investigated. Samples were reflowed for 10 s, T gz (time corresponding to the end of gravity regime) and 100 s individually and tested for single-lap shear strength. The single-lap shear test was also carried out on eutectic Sn-Pb/Cu- and Sn-Pb/Ni-coated Cu specimens to compare the shear strength values obtained with those of lead-free alloys. The eutectic Sn-Pb showed significantly higher ultimate shear strength on bare Cu substrates when compared to Sn-Ag-Cu alloys. However, SAC alloys reflowed on nickel-coated copper substrate exhibited higher shear strength when compared to eutectic Sn-Pb/Ni-coated Cu specimens. All the substrate/solder/substrate lap joint specimens that were reflowed for the time corresponding to the end of gravity regime exhibited maximum ultimate shear strength.

  1. Analysis of a short beam with application to solder joints: could larger stand-off heights relieve stress?

    Science.gov (United States)

    Suhir, Ephraim

    2015-08-01

    Physically meaningful and easy-to-use analytical (mathematical) stress model is developed for a short beam with clamped and known-in-advance offset ends. The analysis is limited to elastic deformations. While the classical Timoshenko short-beam theory seeks the beam's deflection caused by the combined bending and shear deformations for the given loading, an inverse problem is considered here: the lateral force is sought for the given ends offset. In short beams this force is larger than in long beams, since, in order to achieve the given displacement (offset), the applied force has to overcome both bending and shear resistance of the beam. It is envisioned that short beams could adequately mimic the state of stress in solder joint interconnections, including ball-grid-array (BGA) systems, with large, compared to conventional joints, stand-off heights. When the package/printed-circuit-board (PCB) assembly is subjected to the change in temperature, the thermal expansion (contraction) mismatch of the package and the PCB results in an easily predictable relative displacement (offset) of the ends of the solder joint. This offset can be determined from the known external thermal mismatch strain (determined as the product of the difference in the coefficients of thermal expansion and the change in temperature) and the position of the joint with respect to the mid-cross-section of the assembly. The maximum normal and shearing stresses could be viewed as suitable criteria of the beam's (joint's) material long-term reliability. It is shown that these stresses can be brought down by employing beam-like joints, i.e., joints with an increased stand-off height compared to conventional joints. It is imperative, of course, that, if such joints are employed, there is still enough interfacial real estate, so that the BGA bonding strength is not compromised. On the other hand, owing to the lower stress level, reliability assurance might be much less of a challenge than in the case of

  2. Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

    Science.gov (United States)

    Barbagallo, C.; Malgioglio, G. L.; Petrone, G.; Cammarata, G.

    2017-05-01

    For power devices, the reliability of thermal fatigue induced by thermal cycling has been prioritized as an important concern. The main target of this work is to apply a numerical procedure to assess the fatigue life for lead-free solder joints, that represent, in general, the weakest part of the electronic modules. Starting from a real multi-chip power module, FE-based models were built-up by considering different conditions in model implementation in order to simulate, from one hand, the worst working condition for the module and, from another one, the module standing into a climatic test room performing thermal cycles. Simulations were carried-out both in steady and transient conditions in order to estimate the module thermal maps, the stress-strain distributions, the effective plastic strain distributions and finally to assess the number of cycles to failure of the constitutive solder layers.

  3. Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

    International Nuclear Information System (INIS)

    Barbagallo, C; Petrone, G; Cammarata, G; Malgioglio, G L

    2017-01-01

    For power devices, the reliability of thermal fatigue induced by thermal cycling has been prioritized as an important concern. The main target of this work is to apply a numerical procedure to assess the fatigue life for lead-free solder joints, that represent, in general, the weakest part of the electronic modules. Starting from a real multi-chip power module, FE-based models were built-up by considering different conditions in model implementation in order to simulate, from one hand, the worst working condition for the module and, from another one, the module standing into a climatic test room performing thermal cycles. Simulations were carried-out both in steady and transient conditions in order to estimate the module thermal maps, the stress-strain distributions, the effective plastic strain distributions and finally to assess the number of cycles to failure of the constitutive solder layers. (paper)

  4. Microstructure and adhesion strength of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

    International Nuclear Information System (INIS)

    Chang, T.-C.; Chou, S.-M.; Hon, M.-H.; Wang, M.-C.

    2006-01-01

    The microstructure and adhesion strength of the Sn-9Zn-xAg lead-free solders wetted on Cu substrates have been investigated by differential scanning calorimetry, optical microscopy, scanning electron microscopy, energy dispersive spectrometry and pull-off testing. The liquidus temperatures of the Sn-9Zn-xAg solder alloys are 222.1, 226.7, 231.4 and 232.9 deg. C for x = 2.5, 3.5, 5.0 and 7.5 wt%, respectively. A flat interface can be obtained as wetted at 350 deg. C at a rate of 11.8 mm/s. The adhesion strength of the Sn-9Zn-xAg/Cu interfaces decreases from 23.09 ± 0.31 to 12.32 ± 1.40 MPa with increasing Ag content from 2.5 to 7.5 wt% at 400 deg. C. After heat treatment at 150 deg. C, the adhesion strength of the Sn-9Zn-xAg/Cu interface decreases with increasing aging time

  5. Influence of intermetallic growth on the mechanical properties of Zn–Sn–Cu–Bi/Cu solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Xing, Fei; Yao, Jia; Liang, Jingwei; Qiu, Xiaoming, E-mail: qiuxm13@163.com

    2015-11-15

    The formation of intermetallic reaction layers and their influence on shear strength and fractography was investigated between the Zn–Sn–Cu–Bi (ZSCB) and Cu substrate during the liquid state reaction at 450 °C after 10–90 s. Results showed that reliable solder joints could be obtained at 450 °C after 15–30 s of wetting, accompanied by the creation of scallop ε-CuZn{sub 5}, flat γ-Cu{sub 5}Zn{sub 8} and β-CuZn intermetallic layers in ZSCB/Cu interface. However, with excess increase of soldering time, a transient intermetallic ε-CuZn{sub 4} phase was nuclear and grew at ε-CuZn{sub 5}/γ-Cu{sub 5}Zn{sub 8} interface, which apparently deteriorated the shear strength of solder joints from 76.5 MPa to 51.6 MPa. The sensitivity of the fracture proportion was gradually transformed from monotonic ε-CuZn{sub 5} to the mixture of ε-CuZn{sub 4} and ε-CuZn{sub 5} intermetallic cleavage. Furthermore, the growth mechanism of ε-CuZn{sub 4} intermetallic phase at the ZSCB/Cu interface was discussed. - Highlights: • There are four interfacial intermetallic layers formed at the Zn–Sn–Cu–Bi/Cu interface. • The growth mechanism of ε-CuZn{sub 4} intermetallic phase was discussed. • The wetting time of Zn–Sn–Cu–Bi solder in contact with Cu substrate is a key parameter.

  6. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    International Nuclear Information System (INIS)

    Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

    2010-01-01

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  7. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

    2010-02-18

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  8. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Directory of Open Access Journals (Sweden)

    Benabou Lahouari

    2014-06-01

    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  9. Microstructure and mechanical properties of Sn-9Zn-xAl2O3 nanoparticles (x=0–1) lead-free solder alloy: First-principles calculation and experimental research

    International Nuclear Information System (INIS)

    Xing, Wen-qing; Yu, Xin-ye; Li, Heng; Ma, Le; Zuo, Wei; Dong, Peng; Wang, Wen-xian; Ding, Min

    2016-01-01

    This paper studies microstructure and mechanical properties of Sn-9Zn-x Al 2 O 3 nanoparticles (x=0–1) lead-free solder alloy. The interface structure, interface energy and electronic properties of Al 2 O 3 /Sn9Zn interface are investigated by first-principle calculation. On the experimental part, in comparison with the plain Sn-9Zn solder, the Al 2 O 3 nanoparticles incorporated into the solder matrix can inhibit the growth of coarse dendrite Sn-Zn eutectic structure and refine grains of the composite solders during the solidification process of the alloys. Moreover, the microhardness and average tensile strength of the solders with addition of Al 2 O 3 nanoparticles increased with the increasing weight percentages of Al 2 O 3 nanoparticles. These improved mechanical properties can be attributed to the microstructure developments and the dispersed Al 2 O 3 nanoparticles.

  10. Methodology for Analyzing Strain States During In-Situ Thermomechanical Cycling in Individual Lead Free Solder Joints Using Synchrotron Radiation

    International Nuclear Information System (INIS)

    Zhou, Bite; Bieler, Thomas R.; Lee, Tae-Kyu; Liu, Kuo-Chuan

    2009-01-01

    To examine how a lead-free solder joint deforms in a thermal cycling environment, both the elastic and plastic stress and strain behavior must be understood. Methods to identify evolution of the internal strain (stress) state during thermal cycling are described. A slice of a package containing a single row of solder joints was thermally cycled from 0 C to 100 C with a period of about 1 h with concurrent acquisition of transmission Laue patterns using synchrotron radiation. These results indicated that most joints are single crystals, with some being multicrystals with no more than a few Sn grain orientations. Laue patterns were analyzed to estimate local strains in different crystal directions at different temperatures during a thermal cycle. While the strains perpendicular to various crystal planes all vary in a similar way, the magnitude of strain varies. The specimens were subsequently given several hundred additional thermal cycles and measured again to assess changes in the crystal orientations. These results show that modest changes in crystal orientations occur during thermal cycling.

  11. SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

    Directory of Open Access Journals (Sweden)

    D. Heinemann

    2016-06-01

    Full Text Available Printed Circuit Boards (PCB play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

  12. Influence of Poly(ethylene glycol) Degradation on Voiding Sporadically Occurring in Solder Joints with Electroplated Cu

    Science.gov (United States)

    Wafula, F.; Yin, L.; Borgesen, P.; Andala, D.; Dimitrov, N.

    2012-07-01

    This paper presents a comprehensive study of the effect of poly(ethylene glycol) (PEG) degradation on the void formation known to take place sporadically at the interface between electroplated Cu and Pb-free solder. Thorough chemical analysis of our plating solution, carried out at different times of the deposition process by matrix-assisted laser desorption ionization time-of-flight mass spectroscopy, reveals a dramatic shift in the peaks to lower mass range with time. Scanning electron microscopy cross-sectional images of solder joints with Cu samples that have been plated at different times in the course of solution aging show a decrease in void formation. A decreasing magnitude of the deposition overpotential also seen during aging suggests that, breaking down to lower-molecular-weight fragments, PEG loses its suppression effect and likely has lower impact on the voiding propensity. This indirect correlation is confirmed further by the use of plating solutions containing PEG with preselected molecular weight. We also report on the effect of the surface area-to-solution volume ratio on PEG degradation studied by comparative experiments performed in a 50-mL bath with a rotating disc electrode and in a larger cell (Hull cell) with volume of 267 mL. The results show that, at fixed charge per unit volume, PEG degrades at a greatly accelerated rate in the Hull cell featuring higher electrode surface-to-solution volume ratio. Analysis of solder joints with accordingly grown Cu layers suggests that the voiding decreases faster with the accelerated rate of PEG degradation.

  13. An evaluation of the spring finger solder joints on SA1358-10 and SA2052-4 connector assemblies (MC3617,W87)

    International Nuclear Information System (INIS)

    Kilgo, Alice C.; Vianco, Paul Thomas; Hlava, Paul Frank; Zender, Gary L.

    2006-01-01

    The SA1358-10 and SA2052-4 circular JT Type plug connectors are used on a number of nuclear weapons and Joint Test Assembly (JTA) systems. Prototype units were evaluated for the following specific defects associated with the 95Sn-5Sb (Sn-Sb, wt.%) solder joint used to attach the beryllium-copper (BeCu) spring fingers to the aluminum (Al) connector shell: (1) extended cracking within the fillet; (2) remelting of the solder joint during the follow-on, soldering step that attached the EMR adapter ring to the connector shell (and/or soldering the EMR shell to the adapter ring) that used the lower melting temperature 63Sn-37Pb (Sn-Pb) alloy; and (3) spalling of the Cd (Cr) layer overplating layer from the fillet surface. Several pedigrees of connectors were evaluated, which represented older fielded units as well as those assemblies that were recently constructed at Kansas City Plant. The solder joints were evaluated that were in place on connectors made with the current soldering process as well as an alternative induction soldering process for attaching the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely reflected the different extents to which the connector was mated to its counterpart assembly. In all cases, the spring finger solder joints on the SA1358-10 connectors were remelted as a result of the subsequent EMR adapter ring attachment process. Spalling of the Cd (Cr) overplating layer was also observed for these connectors, which was a consequence of the remelting activity. On the other hand, the SA2052-4 connector did not exhibit evidence of

  14. Effect of Gold on the Microstructural Evolution and Integrity of a Sintered Silver Joint

    Science.gov (United States)

    Muralidharan, Govindarajan; Leonard, Donovan N.; Meyer, Harry M.

    2017-07-01

    There is a need for next-generation, high-performance power electronic packages and systems employing wide-bandgap devices to operate at high temperatures in automotive and electric grid applications. Sintered silver joints are currently being evaluated as an alternative to Pb-free solder joints. Of particular interest is the development of joints based on silver paste consisting of nano- or micron-scale particles that can be processed without application of external pressure. The microstructural evolution at the interface of a pressureless-sintered silver joint formed between a SiC die with Ti/Ni/Au metallization and an active metal brazed (AMB) substrate with Ag metallization at 250°C has been evaluated using scanning electron microscopy (SEM), x-ray microanalysis, and x-ray photoelectron spectroscopy (XPS). Results from focused ion beam (FIB) cross-sections show that, during sintering, pores in the sintered region near to the Au layer tend to be narrow and elongated with long axis oriented parallel to the interface. Further densification results in formation of many small, relatively equiaxed pores aligned parallel to the interface, creating a path for easy crack propagation. X-ray microanalysis results confirm interdiffusion between Au and Ag and that a region with poor mechanical strength is formed at the edge of this region of interdiffusion.

  15. On the problem of soldering refractory metals with silver-containing solders

    International Nuclear Information System (INIS)

    Anikeev, E.F.; Andryushchenko, V.I.; Chepelenko, V.N.; Batov, V.M.

    1981-01-01

    The processes of wetting, spreading and interphase interactions of copper-silver liquid alloys alloyed with Ni and Si, with niobium, tantalum, molybdenum, tungsten, 12Kh18N10T steel and nickel are studied. It has been determined that Ni or Si additions into the copper-silver solder improve the wetting and adhesion. When soldering with the alloy containing Ni additions, the strength of a soldered Joint grows with the increase of soldering duration while soldering with the alloy containing Si additions, the strength decreases. That is why Ni-containing solders are preferable for soldering thick-walled structures, and Si-containing solders - for thin-walled structures [ru

  16. The Effects of Antimony Addition on the Microstructural, Mechanical, and Thermal Properties of Sn-3.0Ag-0.5Cu Solder Alloy

    Science.gov (United States)

    Sungkhaphaitoon, Phairote; Plookphol, Thawatchai

    2018-02-01

    In this study, we investigated the effects produced by the addition of antimony (Sb) to Sn-3.0Ag-0.5Cu-based solder alloys. Our focus was the alloys' microstructural, mechanical, and thermal properties. We evaluated the effects by means of scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), differential scanning calorimetry (DSC), and a universal testing machine (UTM). The results showed that a part of the Sb was dissolved in the Sn matrix phase, and the remaining one participated in the formation of intermetallic compounds (IMCs) of Ag3(Sn,Sb) and Cu6(Sn,Sb)5. In the alloy containing the highest wt pct Sb, the added component resulted in the formation of SnSb compound and small particle pinning of Ag3(Sn,Sb) along the grain boundary of the IMCs. Our tests of the Sn-3.0Ag-0.5Cu solder alloys' mechanical properties showed that the effects produced by the addition of Sb varied as a function of the wt pct Sb content. The ultimate tensile strength (UTS) increased from 29.21 to a maximum value of 40.44 MPa, but the pct elongation (pct EL) decreased from 48.0 to a minimum 25.43 pct. Principally, the alloys containing Sb had higher UTS and lower pct EL than Sb-free solder alloys due to the strengthening effects of solid solution and second-phase dispersion. Thermal analysis showed that the alloys containing Sb had a slightly higher melting point and that the addition amount ranging from 0.5 to 3.0 wt pct Sb did not significantly change the solidus and liquidus temperatures compared with the Sb-free solder alloys. Thus, the optimal concentration of Sb in the alloys was 3.0 wt pct because the microstructure and the ultimate tensile strength of the SAC305 solder alloys were improved.

  17. Thermomechanical behavior of tin-rich (lead-free) solders

    Science.gov (United States)

    Sidhu, Rajen Singh

    In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local

  18. Microstructure and Tensile Properties of Sn-1Ag-0.5Cu Solder Alloy Bearing Al for Electronics Applications

    Science.gov (United States)

    Shnawah, Dhafer Abdul-Ameer; Said, Suhana Binti Mohd; Sabri, Mohd Faizul Mohd; Badruddin, Irfan Anjum; Hoe, Teh Guan; Che, Fa Xing; Abood, Adnan Naama

    2012-08-01

    This work investigates the effects of 0.1 wt.% and 0.5 wt.% Al additions on bulk alloy microstructure and tensile properties as well as on the thermal behavior of Sn-1Ag-0.5Cu (SAC105) lead-free solder alloy. The addition of 0.1 wt.% Al reduces the amount of Ag3Sn intermetallic compound (IMC) particles and leads to the formation of larger ternary Sn-Ag-Al IMC particles. However, the addition of 0.5 wt.% Al suppresses the formation of Ag3Sn IMC particles and leads to a large amount of fine Al-Ag IMC particles. Moreover, both 0.1 wt.% and 0.5 wt.% Al additions suppress the formation of Cu6Sn5 IMC particles and lead to the formation of larger Al-Cu IMC particles. The 0.1 wt.% Al-added solder shows a microstructure with coarse β-Sn dendrites. However, the addition of 0.5 wt.% Al has a great effect on suppressing the undercooling and refinement of the β-Sn dendrites. In addition to coarse β-Sn dendrites, the formation of large Sn-Ag-Al and Al-Cu IMC particles significantly reduces the elastic modulus and yield strength for the SAC105 alloy containing 0.1 wt.% Al. On the other hand, the fine β-Sn dendrite and the second-phase dispersion strengthening mechanism through the formation of fine Al-Ag IMC particles significantly increases the elastic modulus and yield strength of the SAC105 alloy containing 0.5 wt.% Al. Moreover, both 0.1 wt.% and 0.5 wt.% Al additions worsen the elongation. However, the reduction in elongation is much stronger, and brittle fracture occurs instead of ductile fracture, with 0.5 wt.% Al addition. The two additions of Al increase both solidus and liquidus temperatures. With 0.5 wt.% Al addition the pasty range is significantly reduced and the differential scanning calorimetry (DSC) endotherm curve gradually shifts from a dual to a single endothermic peak.

  19. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

    Directory of Open Access Journals (Sweden)

    John D. Sørensen

    2011-12-01

    Full Text Available Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is necessary to understand the physics of their failure and be able to develop reliability prediction models. Such a model is proposed in this paper for an IGBT power electronic module. IGBTs are critical components in wind turbine converter systems. These are multilayered devices where layers are soldered to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development and propagation processes is discussed. A statistical analysis is performed for appropriate model parameter selection. Based on the proposed model, a layout for component life prediction with crack movement is described in details.

  20. The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder joint

    Energy Technology Data Exchange (ETDEWEB)

    Fleshman, Collin; Chen, Wei-Yu; Chou, Tzu-Ting [Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan (China); Huang, Jia-Hong [Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan (China); Duh, Jenq-Gong, E-mail: jgd@mx.nthu.edu.tw [Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan (China)

    2017-03-01

    In this study, the slow speed shear test in both Sn-3.0Ag-0.5Cu (wt%)/OSP Cu and Sn-3.0Ag-0.5Cu-0.1Ni (wt%)/OSP Cu assembly with the ball heights of 300 μm and the corresponding grain structures were investigated. With the aid of Electron Back Scattering Diffraction (EBSD) analysis, single grain structure was observed in Sn-3.0Ag-0.5Cu/OSP Cu. Besides, Ni was found to control the grain structure in Sn-3.0Ag-0.5Cu-0.1Ni solder balls, showing multiple grains with partially interlaced structure. The grain variation resulted from larger undercooling caused by smaller ball size and Ni-dopant induced tiny intermetallic compounds (IMCs). IMCs serve as heterogeneous nucleation sites for β-tin and thus alter the grain structure of solder balls. The results of shear test reveal that the peak force of solder joints was efficiently enhanced by the addition of Ni. The enhancement of mechanical strength was attributed to the modification of grain structure by the introduction of Ni dopant. It is believed that the smaller grains, tiny intermetallic compounds, and the oriented interlaced area in Ni-doped solder joints became energy barriers for propagation of cracks and dislocations. It is demonstrated that Ni-doped solder joints tend to exhibit better mechanical reliability in advanced electronic packaging. - Highlights: • The grain structure and slow speed shear test performance were investigated. • Doping Ni into solder induce interlaced grain structure. • Interlaced structure can enhance mechanical reliability in BGA packaging.

  1. Characterization of lead-free solders for electronic packaging

    Science.gov (United States)

    Ma, Hongtao

    The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

  2. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2011-01-01

    Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is nec......Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components...... to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development...

  3. Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process.

    Science.gov (United States)

    Li, Z L; Dong, H J; Song, X G; Zhao, H Y; Tian, H; Liu, J H; Feng, J C; Yan, J C

    2018-04-01

    Homogeneous (Cu, Ni) 6 Sn 5 intermetallic compound (IMC) joints were rapidly formed in asymmetrical Ni/Sn/Cu system by an ultrasound-induced transient liquid phase (TLP) soldering process. In the traditional TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system consisted of major (Cu, Ni) 6 Sn 5 and minor Cu 3 Sn IMCs, and the grain morphology of (Cu, Ni) 6 Sn 5 IMCs subsequently exhibited fine rounded, needlelike and coarse rounded shapes from the Ni side to the Cu side, which was highly in accordance with the Ni concentration gradient across the joints. However, in the ultrasound-induced TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system only consisted of the (Cu, Ni) 6 Sn 5 IMCs which exhibited an uniform grain morphology of rounded shape with a remarkably narrowed Ni concentration gradient. The ultrasound-induced homogeneous intermetallic joints exhibited higher shear strength (61.6 MPa) than the traditional heterogeneous intermetallic joints (49.8 MPa). Copyright © 2017 Elsevier B.V. All rights reserved.

  4. Microstructural Characterization of Friction Stir Welded Aluminum-Steel Joints

    Science.gov (United States)

    2013-08-01

    Sterling, R.J. Steel, C.-O. Pettersson. “Microstructure and mechanical properties of friction stir welded SAF 2507 super duplex stainless steel.” Mater...MICROSTRUCTURAL CHARACTERIZATION OF FRICTION STIR WELDED ALUMINUM-STEEL JOINTS By ERIN ELIZABETH PATTERSON A thesis submitted in...for his work producing the dissimilar weld samples used in this study. Without his work, this project would not have been possible. I would also

  5. Effect of P on Microstructure and Mechanical Properties of Sn-Bi Solder

    Directory of Open Access Journals (Sweden)

    WANG Xiao-jing

    2016-07-01

    Full Text Available Micro alloy metals P or P/Cu/Zn were added into Sn-Bi alloy to investigate the doping effects on microstructure, mechanical property, deformation fracture from the function of P in pure tin. The results show that doping 1%( mass fraction, same as below P to pure tin can improve the strength and stiffness, decrease the plasticity. Only 0.1%P additive degenerates the mechanical property of Sn-Bi alloy, this is related to the existing form of element P in the base metal and the microstructure of the base metal. In Sn base alloy, P is distributed in phase or grain boundaries in the form of Sn-P intermetallic compounds (IMC, restricting the diffusion and shifting of deformation. Therefore, Sn-1P alloy, IMC distributed in beta-tin base plays a role of strengthening in pure tin doped situation, in Sn-Bi alloy instead, enhancing the deformation mismatch under loading becoming the weak spots where cracks may initiate and propagate, and leading to brittle fracture . Finally, addition of P/Zn/Cu simultaneously to Sn-Bi alloy, the doping can optimize the microstructure, improve the strength and enhance the ultimate tensile strength (UTS of Sn-Bi alloys.

  6. The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

    Science.gov (United States)

    Jang, Guh-Yaw; Duh, Jenq-Gong

    2005-01-01

    The eutectic Sn-Ag solder alloy is one of the candidates for the Pb-free solder, and Sn-Pb solder alloys are still widely used in today’s electronic packages. In this tudy, the interfacial reaction in the eutectic Sn-Ag and Sn-Pb solder joints was investigated with an assembly of a solder/Ni/Cu/Ti/Si3N4/Si multilayer structures. In the Sn-3.5Ag solder joints reflowed at 260°C, only the (Ni1-x,Cux)3Sn4 intermetallic compound (IMC) formed at the solder/Ni interface. For the Sn-37Pb solder reflowed at 225°C for one to ten cycles, only the (Ni1-x,Cux)3Sn4 IMC formed between the solder and the Ni/Cu under-bump metallization (UBM). Nevertheless, the (Cu1-y,Niy)6Sn5 IMC was observed in joints reflowed at 245°C after five cycles and at 265°C after three cycles. With the aid of microstructure evolution, quantitative analysis, and elemental distribution between the solder and Ni/Cu UBM, it was revealed that Cu content in the solder near the solder/IMC interface played an important role in the formation of the (Cu1-y,Niy)6Sn5 IMC. In addition, the diffusion behavior of Cu in eutectic Sn-Ag and Sn-Pb solders with the Ni/Cu UBM were probed and discussed. The atomic flux of Cu diffused through Ni was evaluated by detailed quantitative analysis in an electron probe microanalyzer (EPMA). During reflow, the atomic flux of Cu was on the order of 1016-1017 atoms/cm2sec in both the eutectic Sn-Ag and Sn-Pb systems.

  7. Microstructure development of welding joints in high Cr ferritic steels

    Energy Technology Data Exchange (ETDEWEB)

    Kubushiro, Keiji; Takahashi, Satoshi; Morishima, Keiko [IHI Corporation (Japan). Research Lab.

    2010-07-01

    Creep failure in high Cr ferritic steels welding joints are Type IV failure. Type IV-failure was ruptured in fine grained region of heat affected zone, microstructure and phase transformation process at welding in fine grained region were very important to clarify. Microstructure difference of heat affected zone was investigated in Gr.91, Gr.92, Gr.122 welding joint. The fraction of 60 degree block boundary, packet boundary, random boundary (including prior gamma boundary) length was compared in three ferritic steels by EBSP(Electron Backscatter Diffraction Pattern) analysis. HAZ was almost fully martensite phase in Gr.122 weld joint. On the other hand, HAZ in Gr.91 welding joint were some equiaxial grain and martensite structure. (orig.)

  8. Solderability study of RABiTS-based YBCO coated conductors

    International Nuclear Information System (INIS)

    Zhang Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

    2011-01-01

    Study examines the implication of solder and flux selection in YBCO splice joints. Focus is on commercially available RABiTS-based YBCO coated conductors. Solderability varied with solder and flux for three different stabilizations tested. Resistivity of stabilizer was dominant factor in splice joint resistance. Solder materials affected splice joint resistance when solderability was poor. The solderability of commercially available YBa 2 Cu 3 O 7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

  9. Systematics of Structural, Phase Stability, and Cohesive Properties of η'-Cu6(Sn,In)5 Compounds Occurring in In-Sn/Cu Solder Joints

    Science.gov (United States)

    Ramos, S. B.; González Lemus, N. V.; Deluque Toro, C. E.; Cabeza, G. F.; Fernández Guillermet, A.

    2017-07-01

    Motivated by the high solubility of In in ( mC44) η'-Cu6Sn5 compound as well as the occurrence of an In-doped η'-intermetallic in the microstructure of Cu/In-Sn/Cu solder joints, a theoretical study has been carried out to investigate the various physical effects of incorporating In at Sn Wyckoff sites of the binary η'-phase. Systematic ab initio calculations using the projected augmented wave method and Vienna Ab initio Simulation Package were used to determine the composition dependence of the structural and cohesive properties of η'-Cu6(Sn,In)5 compounds, compared with those expected from the binary end-member compounds Cu6Sn5 and Cu6In5. The molar volume shows significant deviations from Vegard's law. The predicted composition dependence of the cohesive properties is discussed using two complementary approaches, viz. a valence-electron density approach as well as a bond-number approach, both accounting for the roughly linear dependence of the cohesive energy on the In content. A microscopic interpretation for this general trend is given in terms of the key contributions to chemical bonding in this class of compounds, namely Cu d-electron overlap and hybridization of Cu d-states with In and Sn p-electron states. Moreover, a crystallographic site approach is developed to accurately establish the phase-stabilizing effect of incorporating In at specific Wyckoff positions of the ( mC44) η'-Cu6Sn5 structure.

  10. THE MICROSTRUCTURAL PROPERTIES OF EXPLOSION WELDED Ni/Ti JOINT

    Directory of Open Access Journals (Sweden)

    Kamila Zdrodowska

    2014-06-01

    Full Text Available Explosion welding is one of the ways of bonding materials. This method is used to bond metals which either cannot be joined or they are difficult to bond by other methods. The study investigates the metallographic characteristics of Ni/Ti joints in the form of a plate. Microstructures of the joints are examined and hardness measurements are carried out on the bonded materials and their interfaces. A detailed analysis of the distributions of wave length and width is presented. An average microhardness of the interface is found to be higher than that of the base materials.

  11. High temperature soldering of graphite

    International Nuclear Information System (INIS)

    Anikin, L.T.; Kravetskij, G.A.; Dergunova, V.S.

    1977-01-01

    The effect is studied of the brazing temperature on the strength of the brazed joint of graphite materials. In one case, iron and nickel are used as solder, and in another, molybdenum. The contact heating of the iron and nickel with the graphite has been studied in the temperature range of 1400-2400 ged C, and molybdenum, 2200-2600 deg C. The quality of the joints has been judged by the tensile strength at temperatures of 2500-2800 deg C and by the microstructure. An investigation into the kinetics of carbon dissolution in molten iron has shown that the failure of the graphite in contact with the iron melt is due to the incorporation of iron atoms in the interbase planes. The strength of a joint formed with the participation of the vapour-gas phase is 2.5 times higher than that of a joint obtained by graphite recrystallization through the carbon-containing metal melt. The critical temperatures are determined of graphite brazing with nickel, iron, and molybdenum interlayers, which sharply increase the strength of the brazed joint as a result of the formation of a vapour-gas phase and deposition of fine-crystal carbon

  12. Microstructure and mechanical properties of Sn-9Zn-xAl{sub 2}O{sub 3} nanoparticles (x=0–1) lead-free solder alloy: First-principles calculation and experimental research

    Energy Technology Data Exchange (ETDEWEB)

    Xing, Wen-qing; Yu, Xin-ye; Li, Heng; Ma, Le; Zuo, Wei [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Dong, Peng; Wang, Wen-xian [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Shanxi Key Laboratory of Advanced Magnesium-based Materials, Taiyuan 030024 (China); Key Laboratory of Interface Science and Engineering in Advanced Materials, Ministry of Education, Taiyuan University of Technology, Taiyuan 030024 (China); Ding, Min, E-mail: dingmin@tyut.edu.cn [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Shanxi Key Laboratory of Advanced Magnesium-based Materials, Taiyuan 030024 (China); Key Laboratory of Interface Science and Engineering in Advanced Materials, Ministry of Education, Taiyuan University of Technology, Taiyuan 030024 (China)

    2016-12-15

    This paper studies microstructure and mechanical properties of Sn-9Zn-x Al{sub 2}O{sub 3} nanoparticles (x=0–1) lead-free solder alloy. The interface structure, interface energy and electronic properties of Al{sub 2}O{sub 3}/Sn9Zn interface are investigated by first-principle calculation. On the experimental part, in comparison with the plain Sn-9Zn solder, the Al{sub 2}O{sub 3} nanoparticles incorporated into the solder matrix can inhibit the growth of coarse dendrite Sn-Zn eutectic structure and refine grains of the composite solders during the solidification process of the alloys. Moreover, the microhardness and average tensile strength of the solders with addition of Al{sub 2}O{sub 3} nanoparticles increased with the increasing weight percentages of Al{sub 2}O{sub 3} nanoparticles. These improved mechanical properties can be attributed to the microstructure developments and the dispersed Al{sub 2}O{sub 3} nanoparticles.

  13. Microstructures of a welded joint using an irradiated wrapper tube

    International Nuclear Information System (INIS)

    Hamada, S.; Watanabe, K.; Hishinuma, A.; Takahashi, I.; Kikuchi, T.

    1993-01-01

    The behavior of helium in welded joint fabricated using tungsten inert gas (TIG) welding process for a type 316 stainless steel wrapper tube irradiated in a fast reactor was investigated. The wrapper tube was irradiated to (1.5 - 4.2) x 10 26 n/m 2 (helium level of 3 to 9 appm) at 395 - 410 degrees C. All welded joints fractured in the heat-affected zone (HAZ). The microstructures of each portion of the base metal, the HAZ and the fusion zone in a welded joint were examined through a transmission electron microscope. Small helium bubbles were observed in number density of 2 x 10 20 m -3 in the matrix and rarely found on the grain boundaries of the base metal. In the HAZ, small and large helium bubbles mixed and lined up along the grain boundaries. In particular, some of them elongated along the grain boundary. In the matrix of the fusion zone, delta-ferrite phases and unresolved carbides were scattered. Large cavities were attached to these precipitates and also occurred along grain boundaries. These results suggest that the failure in the HAZ of welded joints is attributed to the preferential growth and coalescence of helium bubbles in the grain boundaries of the HAZ caused by weld heat input and stress during welding

  14. Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

    International Nuclear Information System (INIS)

    Chellvarajoo, Srivalli; Abdullah, M.Z.; Samsudin, Z.

    2015-01-01

    Highlights: • Fe 2 NiO 4 nanoparticles added into SAC 305 by mechanical mixing to form nanocomposite solder paste. • Nanoparticles in the composite solder travels with flux to the outermost surface after reflow. • The intermetallics compound reduced with the addition of nanoparticles into solder paste. • The hardness increased with the addition of limited percentage of nanoparticles into SAC 305. - Abstract: This study investigates the effects of the addition of Fe 2 NiO 4 nanoparticles into a SAC-305 lead-free solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper ‘sandwich’ method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5 wt.% of Fe 2 NiO 4 nanoparticles, respectively. If the addition of Fe 2 NiO 4 nanoparticle exceeded 1.5 wt.%, the hardness increased infinitely

  15. Lead free solder mechanics and reliability

    CERN Document Server

    Pang, John Hock Lye

    2012-01-01

    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  16. Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties

    Energy Technology Data Exchange (ETDEWEB)

    Billah, Md. Muktadir; Shorowordi, Kazi Mohammad; Sharif, Ahmed, E-mail: asharif@mme.buet.ac.bd

    2014-02-05

    Highlights: • Ni-added Sn-Zn-Bi were characterized metallographically, thermally and mechanically. • The volume fraction of α-Zn phase increased with both Bi and Ni in Sn-Zn-Bi alloys. • Micron-sized Ni particles reacted with neither Sn nor Zn to form intermetallics. • Better combination of thermal and mechanical properties can be achieved with Ni. -- Abstract: Micron-sized Ni particle-reinforced Sn–8Zn–3Bi composite solders were prepared by mechanically dispersing Ni particles into Sn–8Zn–3Bi alloy and the bulk properties of the composite solder alloy were characterized metallographically, thermally and mechanically. Different percentage of Ni particle viz. 0.25, 0.5 and 1 wt.% were added in the liquid Sn–8Zn–3Bi alloy and then cast into the metal molds. Melting behavior was studied by differential thermal analyzer (DTA). Microstructural investigation was carried out by both optical and scanning electron microscope. Tensile properties were determined using an Instron Universal Testing Machine at a strain rate 3.00 mm/min. The results indicated that the Ni addition increased the melting temperature of Sn–8Zn–3Bi alloy. The addition of Ni was also found to increase the solidification range. In the Sn–8Zn–3Bi alloy, needle-shaped α-Zn phase was found to be uniformly distributed in the β-Sn matrix. However, it was found that the small amount of Ni addition in Sn–8Zn–3Bi alloy refined the Zn needles throughout the matrix. Also an enhanced precipitation of Zn in the structure was observed with the addition of Ni. All these structural changes improved the mechanical properties like tensile strength and hardness of the newly developed quaternary alloy.

  17. Influence of ZnO nano-particles addition on thermal analysis, microstructure evolution and tensile behavior of Sn–5.0 wt% Sb–0.5 wt% Cu lead-free solder alloy

    Energy Technology Data Exchange (ETDEWEB)

    Fouda, A.N., E-mail: alynabieh@yahoo.com [Physics Department, Faculty of Science, Suez-Canal University, 41522 Ismailia (Egypt); Eid, E.A., E-mail: dr_eid_hti@yahoo.com [Basic Science Department, Higher Technological Institute, 44629 10th of Ramadan City (Egypt)

    2015-04-24

    Sn–5 wt%Sb–0.5 wt%Cu (plain SSC505) and Sn–5 wt%Sb–0.5 wt%Cu–0.5 wt% ZnO (SSC-ZnO) composite solder alloys have been studied. The variation in thermal behavior, microstructure and tensile characteristics associated with mixing of 0.5 wt% ZnO nano-metric particles to plain SSC505 solder were investigated. A slight increment in the melting temperature [ΔT{sub m}=0.89 °C] was recorded using differential scanning calorimetry (DSC) after addition of ZnO. X-Ray diffraction (XRD) analysis confirmed the existence of β-Sn, SbSn and Cu{sub 6}Sn{sub 5} intermetallic compounds (IMCs) beside some of ZnO planes in SSC-ZnO composite solder. Field emission scanning electronic microscope (FE-SEM) investigation of SSC-ZnO composite solder revealed a homogenous uniform distribution, size refinement of IMCs and β-Sn grains. Addition of ZnO nano-metric particles into the plain SSC505 enhanced the yield stress σ{sub YS} by ~12% and improved the ultimate tensile strength σ{sub UTS} by ~13%. In addition, adding ZnO nano-metric particles was found to be effective for reducing ductility by ~43% of the plain solder due to the refinement of β-Sn grains within SSC-ZnO composite solder. - Highlights: • Melting point of SSC505-ZnO composite solder is slightly increased by 0.89 {sup ο}C compared with the plain SSC505 solder. • XRD and EDX analysis reflect the presence of SbSn, Cu{sub 6}Sn{sub 5} IMCs. • EF-SEM images of SSC-ZnO composite solder revealed homogenous uniform distribution of β-Sn grains and fine IMC particles. • A detectable improvement in the Young modulus, ultimate tensile strength and yield strength were observed after addition of 0.5 wt% ZnO nano-metric particles.

  18. Mechanical Properties and Microstructure of Dissimilar Material Welded Joints

    Directory of Open Access Journals (Sweden)

    Ziewiec A.

    2014-10-01

    Full Text Available The paper presents results of the mechanical testing and the microstructure analysis of dissimilar welded joint of the R350HT steel and the high-manganese (Hadfield cast steel using Cr-Ni cast steel spacer. The simulation tests of the welded joint surface deformation were carried out. The macroscopic and microscopic investigation were made using light microscopy (LM and scanning electron microscopy (SEM. Content of the magnetic phase was measured using magnetoscope. The quantitative metallographic investigation was used for assessment of ferrite and martensite contents and X-ray diffraction phase analysis was carried out. The results showed that during cooling of the spacer after welding, the transformation of metastable austenite into martensite proceeded. In addition to work hardening, the phase transformation of austenite into martensite occurs during the process of the superficial deformation of the spacer while simulated exploitation. This leads to a substantial increase of hardness, and at the same time, causes the increase of wear resistance of the welded joints of crossovers.

  19. Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

    International Nuclear Information System (INIS)

    Sun, Peng; Andersson, Cristina; Wei, Xicheng; Cheng, Zhaonian; Shangguan, Dongkai; Liu, Johan

    2007-01-01

    In this paper, the coupling effect in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi solder joint with sandwich structure by long time reflow soldering was studied. It was found that the interfacial compound at the Cu substrate was binary Cu-Sn compound in Sn-Ag-Bi solder joint and Cu 5 Zn 8 phase in Sn-Zn-Bi solder joint. The thickness of the Cu-Zn compound layer formed at the Cu substrate was greater than or equal to that of Cu-Sn compound layer, although the reflow soldering temperature of Sn-Zn-Bi (240 o C) was lower than that of Sn-Ag-Bi (250 o C). The stable Cu-Zn compound was the absolute preferential phase in the interfacial layer between Sn-Zn-Bi and the Cu substrate. The ternary (Cu, Ni) 6 Sn 5 compound was formed at the Sn-Ag-Bi/Ni(P)-Cu metallization interface, and a complex alloy Sn-Ni-Cu-Zn was formed at the Sn-Zn-Bi/Ni(P)-Cu metallization interface. It was noted that Cu atoms could diffuse from the Cu substrate through the solder matrix to the Ni(P)-Cu metallization within 1 min reflow soldering time for both solder systems, indicating that just 30 s was long enough for Cu to go through 250 μm diffusion length in the Sn-Ag-Bi solder joint at 250 o C. The coupling effect between Ni(P)/Cu metallization and Cu substrate was confirmed as the type of IMCs at Ni(P) layer had been changed from Ni-Sn system to Cu-Sn system apparently by the diffusion effect of Cu atoms. The (Cu, Ni) 6 Sn 5 layer at the Ni(P)/Cu metallization grew significantly and its thickness was even greater than that of the Cu-Sn compound on the opposite side, however the growth of the complex alloy including Sn, Ni, Cu and Zn on the Ni(P)/Cu metallization was suppressed

  20. Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits

    Energy Technology Data Exchange (ETDEWEB)

    Huang, Y. T.; Hsu, H. H.; Wu, Albert T., E-mail: atwu@ncu.edu.tw [Department of Chemical and Materials Engineering, National Central University, Jhongli City 320, Taiwan (China)

    2014-01-21

    Because of the miniaturization of electronic devices, the reliability of electromigration has become a major concern when shrinking the solder dimensions in flip-chip joints. Fast reaction between solders and electrodes causes intermetallic compounds (IMCs) to form, which grow rapidly and occupy entire joints when solder volumes decrease. In this study, U-grooves were fabricated on Si chips as test vehicles. An electrode-solder-electrode sandwich structure was fabricated by using lithography and electroplating. Gaps exhibiting well-defined dimensions were filled with Sn3.5Ag solders. The gaps between the copper electrodes in the test sample were limited to less than 15 μm to simulate microbumps. The samples were stressed at various current densities at 100 °C, 125 °C, and 150 °C. The morphological changes of the IMCs were observed, and the dimensions of the IMCs were measured to determine the kinetic growth of IMCs. Therefore, this study focused on the influence of back stress caused by microstructural evolution in microbumps.

  1. Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

    Directory of Open Access Journals (Sweden)

    Yulong Li

    2018-01-01

    Full Text Available In order to accelerate the growth of interfacial intermetallic compound (IMC layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms and 800 ms, were used for the ultrasonic soldering. The isothermal aging was conducted at 150 °C for 0, 120, 240, and 360 h. The evolution of microstructure, the IMC layer growth mechanism during aging, and the shear strength of the joints after aging were systemically investigated. Results showed the following. (i Formation of intermetallic compounds was accelerated by ultrasonic cavitation and streaming effects, the thickness of the interfacial Cu6Sn5 layer increased with aging time, and a thin Cu3Sn layer was identified after aging for 360 h. (ii The growth of the interfacial IMC layer of the ultrasonically soldered Cu/SAC305/Cu joints followed a linear function of the square root of the aging time, revealing a diffusion-controlled mechanism. (iii The tensile shear strength of the joint decreased to a small extent with increasing aging time, owing to the combined effects of IMC grain coarsening and the increase of the interfacial IMC. (iv Finally, although the fracture surfaces and failure locations of the joint soldered with 400 ms and 800 ms vibration times show similar characteristics, they are influenced by the aging time.

  2. Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

    Science.gov (United States)

    Boesenberg, Adam J.; Anderson, Iver E.; Harringa, Joel L.

    2012-07-01

    Of Pb-free solder choices, an array of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic ( T eut = 217°C) composition have emerged with potential for broad use, including ball grid array (BGA) joints that cool slowly. This work investigated minor substitutional additions of Al (0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2- μm to 5- μm faceted Cu-Al particles, identified as Cu33Al17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness. Clustering of Cu33Al17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface. Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance.

  3. Spontaneous soldering

    International Nuclear Information System (INIS)

    Percacci, R.

    1984-01-01

    It is proposed that the soldering form of general relativity be treated as a dynamical variable. This gives rise to the possibility of treating the linear connection on (n-dimensional) spacetime and an internal O(k)-Yang-Mills field as different components of the same O(N) gauge field (N= n+k). The distinction between gravitational and Yang-Mills interactions is due to a kind of Higgs mechanism driven by the vacuum expectation value of the soldering form. (orig.)

  4. Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly

    Energy Technology Data Exchange (ETDEWEB)

    Mostafa Shalaby, Rizk; Kamal, Mustafa [Metal Physics Laboratory, Physics Department, Faculty of Science, Mansoura University, P.O.Box: 35516, Mansoura (Egypt); Ali, Esmail A.M. [Basic Science Department, Faculty of Engineering, University of Science & Technology (Yemen); Gumaan, Mohammed S., E-mail: m.gumaan1@gmail.com [Metal Physics Laboratory, Physics Department, Faculty of Science, Mansoura University, P.O.Box: 35516, Mansoura (Egypt); Basic Science Department, Faculty of Engineering, University of Science & Technology (Yemen)

    2017-04-06

    This paper aims to investigate the reliability of mechanical and creep behavior for the eutectic Sn-Ag and Sn-Ag-Cu Solder joints rapidly solidified after hot compressing (HC) in terms of structural changes and its relationship with thermal behavior, which has been discussed and compared with their properties before HC process by Mustafa et al. (2016) . These solder joints were prepared by melt-spinning technique and tested by HC at 30 MPa pressure and 150 °C for 90 min, their structural, mechanical and thermal properties after HC process have been investigated by X-ray diffraction (XRD), dynamic resonance techniques (DRT) and differential scanning calorimetry (DSC) techniques respectively and compared with these solders before HC. The results revealed that the pressure caused some fractures on the solders morphology surfaces. But some benefits for these solders have been occurred, like eliminating the internal stresses through recrystallization process whose evidence by the particle size increases after they HC, stabilized structure after HC was due to the metastable phases rearrangements, new intermetallic compounds (IMCs) formation, decreasing, melting temperature range (∆T), lattice strains (ƹ) and entropy change (S). These sequential benefits are considered to be the main reasons which lead to decreasing energy loss (Q{sup −1}), creep rate (É›) and thermal stability enhancement. Elastic modulus increment might be due to low elastic lattice distortions after HC, while the stress exponent (n) reduction refers to viscous glide mechanism of deformation after HC instead of climb deformation mechanism before HC.

  5. Microstructural behavior of iron and bismuth added Sn-1Ag-Cu solder under elevated temperature aging

    Energy Technology Data Exchange (ETDEWEB)

    Ali, Bakhtiar, E-mail: engrbakhtiaralikhan@gmail.com; Sabri, Mohd Faizul Mohd, E-mail: faizul@um.edu.my; Jauhari, Iswadi, E-mail: iswadi@um.edu.my [Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, 50603 Kuala Lumpur (Malaysia)

    2016-07-19

    An extensive study was done to investigate the microstructural behavior of iron (Fe) and bismuth (Bi) added Sn-1Ag-0.5Cu (SAC105) under severe thermal aging conditions. The isothermal aging was done at 200 °C for 100 h, 200 h, and 300 h. Optical microscopy with cross-polarized light revealed that the grain size significantly reduces with Fe/Bi addition to the base alloy SAC105 and remains literally the same after thermal aging. The micrographs of field emission scanning electron microscopy (FESEM) with backscattered electron detector and their further analysis via imageJ software indicated that Fe/Bi added SAC105 showed a significant reduction in the IMCs size (Ag{sub 3}Sn and Cu{sub 6}Sn{sub 5}), especially the Cu{sub 6}Sn{sub 5} IMCs, as well as β-Sn matrix and a refinement in the microstructure, which is due to the presence of Bi in the alloys. Moreover, their microstructure remains much more stable under severe thermal aging conditions, which is because of the presence of both Fe and Bi in the alloy. The microstructural behavior suggests that Fe/Bi modified SAC105 would have much improved reliability under severe thermal environments. These modified alloys also have relatively low melting temperature and low cost.

  6. Current density redistribution from no current crowding to current crowding in Pb-free solder joints with an extremely thick Cu layer

    International Nuclear Information System (INIS)

    Han, Jung Kyu; Choi, Daechul; Fujiyoshi, Masaru; Chiwata, Nobuhiko; Tu, King-Ning

    2012-01-01

    In order to remove the effect of current crowding on electromigration, thick Cu under-bump metallization has been widely adopted in the electronics industry. Three-dimensional (3-D) integrated circuits, using through Si via Cu column interconnects, is being developed, and it seems that current crowding may not be a reliability issue. However, statistical experiments and 3-D finite element simulation indicate that there is a transition from no current crowding to current crowding, caused by void growth at the cathode. An analysis of the electromigration-induced failure mechanism in solder joints having a very thick Cu layer is presented. It is a unique failure mechanism, different from that in flip chip technology. Moreover, the study of marker displacement shows two different stages of drift velocity, which clearly demonstrates the back-stress effect and the development of compressive stress.

  7. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

    2009-12-01

    Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the Beta-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of Beta-Sn derived from the electromigration data is in good agreement with the calculated value.

  8. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

    2009-05-15

    Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the {beta}-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of {beta}-Sn derived from the electromigration data is in good agreement with the calculated value.

  9. Soldering in electronics assembly

    CERN Document Server

    Judd, Mike

    2013-01-01

    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  10. Microstructure evolution in dissimilar AA6060/copper friction stir welded joints

    Science.gov (United States)

    Kalashnikova, T. A.; Shvedov, M. A.; Vasilyev, P. A.

    2017-12-01

    Friction stir welding process has been applied for making a dissimilar copper/aluminum alloy joint. The grain microstructure and mechanical properties of the obtained joint were studied. The structure of the cross-section of the FSW compound was analyzed. The microstructural evolution of the joint was examined using optical microscopy. The mechanical properties of the intermetallic particles were evaluated by measuring the microhardness according to the Vickers method. The microhardness of the intermetallic particles was by a factor of 4 lower than that of the particles obtained by fusion welding. The results of the investigations enable using friction stir welding for making dissimilar joints.

  11. Features of Pd-Ni-Fe solder system for vacuum brazing of low alloy steels

    International Nuclear Information System (INIS)

    Radzievskij, V.N.; Kurochko, R.S.; Lotsmanov, S.N.; Rymar', V.I.

    1975-01-01

    The brazing solder of the Pd-Ni-Fe alloyed with copper and lithium, in order to decrease the melting point and provide for a better spreading, when soldered in vacuum ensures a uniform strength of soldered joints with the base metal of low-alloyed steels of 34KHNIM-type. The properties of low-alloyed steel joints brazed with the Pd-Ni-Fe-system solder little depend on the changes in the soldering parameters. The soldered joint keeps a homogeneous structure after all the stages of heat treatment (annealing, quenching and tempering)

  12. The constitutive response of three solder materials

    International Nuclear Information System (INIS)

    Perez-Bergquist, Alejandro G.; Cao Fang; Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T.

    2012-01-01

    Highlights: ► The full constitutive response of three solder materials. ► Test temperatures from −196 °C to 60 °C and strain rates from 10 −3 to >10 3 s −1 . ► Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (−196 °C to 60 °C) and strain rate (10 −3 to >10 3 s −1 ). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  13. The constitutive response of three solder materials

    Energy Technology Data Exchange (ETDEWEB)

    Perez-Bergquist, Alejandro G., E-mail: alexpb@lanl.gov [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States); Cao Fang [Exxon Mobil Research and Engineering Company, Annadale, NJ 08801 (United States); Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T. [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States)

    2012-05-25

    Highlights: Black-Right-Pointing-Pointer The full constitutive response of three solder materials. Black-Right-Pointing-Pointer Test temperatures from -196 Degree-Sign C to 60 Degree-Sign C and strain rates from 10{sup -3} to >10{sup 3} s{sup -1}. Black-Right-Pointing-Pointer Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196 Degree-Sign C to 60 Degree-Sign C) and strain rate (10{sup -3} to >10{sup 3} s{sup -1}). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  14. Features of soldering of molybdenum a lols

    International Nuclear Information System (INIS)

    Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

    1980-01-01

    Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

  15. Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements

    Science.gov (United States)

    Gadag, Shiva P.; Patra, Susant

    2000-12-01

    Solder joint interconnects are mechanical means of structural support for bridging the various electronic components and providing electrical contacts and a thermal path for heat dissipation. The functionality of the electronic device often relies on the structural integrity of the solder. The dimensional stability of solder joints is numerically predicted based on their mechanical properties. Algorithms to model the kinetics of dissolution and subsequent growth of intermetallic from the complete knowledge of a single history of time-temperature-reflow profile, by considering equivalent isothermal time intervals, have been developed. The information for dissolution is derived during the heating cycle of reflow and for the growth process from cooling curve of reflow profile. A simple and quick analysis tool to derive tensile stress-strain maps as a function of the reflow temperature of solder and strain rate has been developed by numerical program. The tensile properties are used in modeling thermal strain, thermal fatigue and to predict the overall fatigue life of solder joints. The numerical analysis of the tensile properties as affected by their composition and rate of testing, has been compiled in this paper. A numerical model using constitutive equation has been developed to evaluate the interfacial fatigue crack growth rate. The model can assess the effect of cooling rate, which depends on the level of strain energy release rate. Increasing cooling rate from normalizing to water-quenching, enhanced the fatigue resistance to interfacial crack growth by up to 50% at low strain energy release rate. The increased cooling rates enhanced the fatigue crack growth resistance by surface roughening at the interface of solder joint. This paper highlights salient features of process modeling. Interfacial intermetallic microstructure is affected by cooling rate and thereby affects the mechanical properties.

  16. An Approach for Impression Creep of Lead Free Microelectronic Solders

    Science.gov (United States)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  17. Microstructure and mechanical properties of resistance upset butt welded 304 austenitic stainless steel joints

    International Nuclear Information System (INIS)

    Sharifitabar, M.; Halvaee, A.; Khorshahian, S.

    2011-01-01

    Graphical abstract: Three different microstructural zones formed at different distances from the joint interface in resistance upset butt welding of 304 austenitic stainless steel. Highlights: → Evaluation of microstructure in resistance upset welding of 304 stainless steel. → Evaluation of welding parameters effects on mechanical properties of the joint. → Introducing the optimum welding condition for joining stainless steel bars. -- Abstract: Resistance upset welding (UW) is a widely used process for joining metal parts. In this process, current, time and upset pressure are three parameters that affect the quality of welded products. In the present research, resistance upset butt welding of 304 austenitic stainless steel and effect of welding power and upset pressure on microstructure, tensile strength and fatigue life of the joint were investigated. Microstructure of welds were studied using scanning electron microscopy (SEM). X-ray diffraction (XRD) analysis was used to distinguish the phase(s) that formed at the joint interface and in heat affected zone (HAZ). Energy dispersive spectroscopy (EDS) linked to the SEM was used to determine chemical composition of phases formed at the joint interface. Fatigue tests were performed using a pull-push fatigue test machine and the fatigue properties were analyzed drawing stress-number of cycles to failure (S-N) curves. Also tensile strength tests were performed. Finally tensile and fatigue fracture surfaces were studied by SEM. Results showed that there were three different microstructural zones at different distances from the joint interface and delta ferrite phase has formed in these regions. There was no precipitation of chromium carbide at the joint interface and in the HAZ. Tensile and fatigue strengths of the joint decreased with welding power. Increasing of upset pressure has also considerable influence on tensile strength of the joint. Fractography of fractured samples showed that formation of hot spots at

  18. Effect of process parameters on microstructure and mechanical properties of friction stir welded joints: A review

    Science.gov (United States)

    Wanare, S. P.; Kalyankar, V. D.

    2018-04-01

    Friction stir welding is emerging as a promising technique for joining of lighter metal alloys due to its several advantages over conventional fusion welding processes such as low thermal distortion, good mechanical properties, fine weld joint microstructure, etc. This review article mainly focuses on analysis of microstructure and mechanical properties of friction stir welded joints. Various microstructure characterization techniques used by previous researchers such as optical microscopes, x-ray diffraction, electron probe microscope, transmission electron microscope, scanning electron microscopes with electron back scattered diffraction, electron dispersive microscopy, etc. are thoroughly overviewed and their results are discussed. The effects of friction stir welding process parameters such as tool rotational speed, welding speed, tool plunge depth, axial force, tool shoulder diameter to tool pin diameter ratio, tool geometry etc. on microstructure and mechanical properties of welded joints are studied and critical observations are noted down. The microstructure examination carried out by previous researchers on various zones of welded joints such as weld zone, heat affected zone and base metal are studied and critical remarks have been presented. Mechanical performances of friction stir welded joints based on tensile test, micro-hardness test, etc. are discussed. This article includes exhaustive literature review of standard research articles which may become ready information for subsequent researchers to establish their line of action.

  19. Evaluation of interfacial microstructures in dissimilar joints of aluminum alloys to steel using nanoindentation technique

    International Nuclear Information System (INIS)

    Ogura, Tomo; Hirose, Akio; Saito, Yuichi; Ueda, Keisuke

    2009-01-01

    The characteristics of interfacial microstructures with additional elements in dissimilar 6000 system aluminum/steel joints were basically evaluated using tensile test, EPMA, TEM and nanoindentation. For Si (and Cu)-added alloy (S1 and SC), EPMA analysis showed that Si (and Cu) was enrichment in the reaction layers, which were formed during diffusion bonding. SAED pattern clarified that the reaction compounds at the interface changed from AlFe intermetalic compounds to AlFeSi intermetalic compounds by Si addition. Nanoindentation technique was successfully applied to the interfacial microstructures to understand directly the nanoscopic mechanical properties in the interfacial microstructures. The hardness and Young's modulus of Al 3 Fe intermetalic compounds was lower than those of Al 2 Fe 5 intermetalic compounds. Moreover, the hardness and Young's modulus of AlFeSi(Cu) compounds were lower than those of Al 3 Fe, indicating that the crystal system changed from orthorhombic structure to cubic structure. Joint strength of SC/steel joints was higher than that of the aluminum alloy with no additional element (Base)/ steel joint, indicating that interfacial microstructure was modified by the addition of Si and Cu to the 6000 system aluminum alloy. These results suggest that the nanoscopic mechanical properties at the interface microstructures affect greatly the macroscopic deformation behavior of the aluminum /steel dissimilar joints.

  20. Novel inspection of welded joint microstructure using magneto-optical imaging technology

    International Nuclear Information System (INIS)

    Gao Xiang-dong; Li Zheng-wen; You De-yong; Katayama, Seiji

    2017-01-01

    A novel method for measuring differences of microstructure by advanced use of the Faraday magneto-optical effect is proposed. Two groups of YAG laser welds on Q235 have been investigated in order to compare MO imaging and traditional methods. Microstructure images have been compared with MO images, and MO diagrams display different colors and gray scales for the base metal, the weld zone, and the heat affected zone. Experimental results indicate that the welded joint microstructure can be inspected by MO imaging without metallographic preparation. (paper)

  1. Microstructure examination and microhardness of friction stir welded joint of (AA7020-O after PWHT

    Directory of Open Access Journals (Sweden)

    Ghada M.F. Essa

    2018-04-01

    Full Text Available This paper studies the microstructure and microhardness of the welded joints of the annealed aluminum alloy AA7020-O produced by friction stir welding (FSW technique. The material was applied to post weld heat treatment (solution treatment and artificially aged, T6. The traverse speed and the rotational speed are the most important process parameters of FSW, and have great influence on the heat input of the welding operation which governs the welded joints quality. To investigate their effect, the welding operation was performed using three traverse speeds, 20, 40 and 60 mm/s with two rotational speeds of 1125 and 1400 rpm, and other welding parameters were kept constant to produce comparable joints. It was found that the two rotational speeds are accepted with lower traverse speeds to produce sound joints. Microstructure of the welded joints was significantly affected by the FSW process parameters, and slight effect was reported for the grain size. Microhardness examination showed high weld joint quality with respect to the base metal hardness, which proves the reprecipitation of the hardening phase in the weld zone. The microhardness profile was strongly dependant on the rotational speed, and the average values of the joints hardness have increased with the decrease in the rotational speed, where it have been slightly affected by the welding speed. Keywords: Friction stir welding, Aluminum alloy, Mechanical properties, Microstructures

  2. Association between condylar morphology and changes in bony microstructure and subsynovial inflammation in experimental temporomandibular joint arthritis

    DEFF Research Database (Denmark)

    Kristensen, Kasper Dahl; Hauge, Ellen Margrethe; Dalstra, Michel

    2010-01-01

    Association between condylar morphology and changes in bony microstructure and subsynovial inflammation in experimental temporomandibular joint arthritis. 86. Congress of the European Orthodontic Society, Slovenien, 2010.......Association between condylar morphology and changes in bony microstructure and subsynovial inflammation in experimental temporomandibular joint arthritis. 86. Congress of the European Orthodontic Society, Slovenien, 2010....

  3. Intergranular stress corrosion in soldered joints of stainless steel 304.; Corrosion intergranular bajo esfuerzo en uniones soldadas de acero inoxidable 304

    Energy Technology Data Exchange (ETDEWEB)

    Zamora R, L [Instituto Nacional de Investigaciones Nucleares, Mexico City (Mexico)

    1994-12-31

    The intergranular stress cracking of welded joints of austenitic stainless steel, AISI 304, is a serious problem in BWR type reactors. It is associated with the simultaneous presence of three factors; stress, a critical media and sensibilization (DOS). EPR technique was used in order to verify the sensibilization degree in the base metal, and the zone affected by heat and welding material. The characterization of material was done. The objective of this work is the study of microstructure and the evaluation of EPR technique used for the determination of DOS in a welded plate of austenitic stainless steel AISI 304. (Author).

  4. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Haiyan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Peng, Jianke [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Fu, Li, E-mail: fuli@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Wang, Xincheng [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Xie, Yan [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China)

    2016-04-15

    Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  5. Research on Microstructure and Properties of Welded Joint of High Strength Steel

    Science.gov (United States)

    Zhu, Pengxiao; Li, Yi; Chen, Bo; Ma, Xuejiao; Zhang, Dongya; Tang, Cai

    2018-01-01

    BS960 steel plates were welded by Laser-MAG and MAG. The microstructure and properties of the welded joints were investigated by optical microscope, micro-hardness tester, universal tensile testing machine, impact tester, scanning electron microscope (SEM) and fatigue tester. By a series of experiments, the following results were obtained: The grain size of the coarse grain zone with Laser-MAG welded joint is 20μm, and that with MAG welded joint is about 32μm, both of the fine grain region are composed of fine lath martensite and granular bainite; the width of the heat affected region with Laser-MAG is lower than that with MAG. The strength and impact energy of welded joints with Laser-MAG is higher than that with MAG. The conditioned fatigue limit of welded joint with Laser-MAG is 280MPa; however, the conditioned fatigue limit of welded joint with MAG is 250MPa.

  6. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Directory of Open Access Journals (Sweden)

    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  7. Microstructure and mechanical properties of the TIG welded joints of fusion CLAM steel

    Energy Technology Data Exchange (ETDEWEB)

    Jiang Zhizhong, E-mail: zhizhongjiang2006@yahoo.com.c [School of Materials Science and Engineering, University of Science and Technology Beijing, Xueyuan Road, Beijing 100083 (China); Ren Litian; Huang Jihua; Ju Xin; Wu Huibin [School of Materials Science and Engineering, University of Science and Technology Beijing, Xueyuan Road, Beijing 100083 (China); Huang Qunying; Wu Yican [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, Anhui 230031 (China)

    2010-12-15

    The CLAM steel plates were butt-welded through manual tungsten inert gas welding (TIG) process, and the following post-welding heat treatment (PWHT) at 740 {sup o}C for 1 h. The microstructure and mechanical properties of the welded joints were measured. The results show that both hardening and softening occur in the weld joints before PWHT, but the hardening is not removed completely in the weld metal and the fusion zone after PWHT. In as-welded condition, the microstructure of the weld metal is coarse lath martensite, and softened zone in heat-affected zone (HAZ) consists of a mixture of tempered martensite and ferrite. After PWHT, a lot of carbides precipitate at all zones in weld joints. The microstructure of softened zone transforms to tempered sorbite. Tensile strength of the weld metal is higher than that of HAZ and base metal regardless of PWHT. However, the weld metal has poor toughness without PWHT. The impact energy of the weld metal after PWHT reaches almost the same level as the base metal. So it is concluded that microstructure and mechanical properties of the CLAM steel welded joints can be improved by a reasonable PWHT.

  8. Microstructural characteristics of the laser welded joint of ITER correction coil sub case

    Energy Technology Data Exchange (ETDEWEB)

    Fang, Chao, E-mail: fangchao@ipp.ac.cn [ASIPP, Shushan Hu Road 350, Hefei, Anhui 230031 (China); Lappeenranta University of Technology, Skinnarilankatu 34, 53850 Lappeenranta (Finland); Song, Yuntao; Wei, Jing; Xin, Jijun [ASIPP, Shushan Hu Road 350, Hefei, Anhui 230031 (China); Wu, Huapeng; Handroos, Hekki; Salminen, Antti [Lappeenranta University of Technology, Skinnarilankatu 34, 53850 Lappeenranta (Finland); Li, Hongwei [ITER China, 15B Fuxing Road, Beijing 100862 (China); Libeyre, Paul; Dolgetta, Nello [ITER Organization, Route de Vinon sur Verdon, 13115 St Paul lez Durance (France)

    2015-10-15

    Highlights: • The multi-pass laser welding was developed for the ITER CC case manufacture. • The laser welding procedure was studied and optimized. • The microstructural characteristic of the welded joint was discussed. - Abstract: The ITER correction coil (CC) case reinforces the winding packs against the electromagnetic loads, minimizes stresses and deformations to the winding pack. The cases are made of high strength and high toughness austenitic stainless steel (316LN) hot rolled heavy plate and have a thickness of 20 mm. Considering the small cross-section and large dimensions of the case, deformation of the case when welding becomes a challenge in the case manufacturing. Therefore, laser welding was developed as the main welding technology for manufacturing. In this paper, multi-pass laser welding technology is used, the laser weldability of a 20 mm thick 316LN austenitic stainless steel plate is studied and the microstructure of the welded joint is analyzed. The welding experiment used an YLS-6000 fiber laser (IPG) and weld filler of 316LMn to match the base metal was used. The result shows that the welded joint has no obvious surface and internal defects based on the optimized welding parameters. The weld joint have a fine austenite microstructure and display columnar dendrites and cellular grains with strong directional characteristics. No apparent heat affected zone is observed and approximately 2 μm an austenite microstructure of the fusion line is clearly presented.

  9. Microstructural characteristics of the laser welded joint of ITER correction coil sub case

    International Nuclear Information System (INIS)

    Fang, Chao; Song, Yuntao; Wei, Jing; Xin, Jijun; Wu, Huapeng; Handroos, Hekki; Salminen, Antti; Li, Hongwei; Libeyre, Paul; Dolgetta, Nello

    2015-01-01

    Highlights: • The multi-pass laser welding was developed for the ITER CC case manufacture. • The laser welding procedure was studied and optimized. • The microstructural characteristic of the welded joint was discussed. - Abstract: The ITER correction coil (CC) case reinforces the winding packs against the electromagnetic loads, minimizes stresses and deformations to the winding pack. The cases are made of high strength and high toughness austenitic stainless steel (316LN) hot rolled heavy plate and have a thickness of 20 mm. Considering the small cross-section and large dimensions of the case, deformation of the case when welding becomes a challenge in the case manufacturing. Therefore, laser welding was developed as the main welding technology for manufacturing. In this paper, multi-pass laser welding technology is used, the laser weldability of a 20 mm thick 316LN austenitic stainless steel plate is studied and the microstructure of the welded joint is analyzed. The welding experiment used an YLS-6000 fiber laser (IPG) and weld filler of 316LMn to match the base metal was used. The result shows that the welded joint has no obvious surface and internal defects based on the optimized welding parameters. The weld joint have a fine austenite microstructure and display columnar dendrites and cellular grains with strong directional characteristics. No apparent heat affected zone is observed and approximately 2 μm an austenite microstructure of the fusion line is clearly presented.

  10. Microstructure and mechanical properties of electron beam welded dissimilar steel to Fe–Al alloy joints

    Energy Technology Data Exchange (ETDEWEB)

    Dinda, Soumitra Kumar; Basiruddin Sk, Md.; Roy, Gour Gopal [Department of Metallurgical and Materials Engineering, Indian Institute of Technology, Kharagpur (India); Srirangam, Prakash, E-mail: p.srirangam@warwick.ac.uk [Warwick Manufacturing Group (WMG), University of Warwick, Coventry CV4 7AL (United Kingdom)

    2016-11-20

    Electron beam welding (EBW) technique was used to perform dissimilar joining of plain carbon steel to Fe–7%Al alloy under three different weld conditions such as with beam oscillation, without beam oscillation and at higher welding speed. The effect of weld parameters on the microstructure and mechanical properties of dissimilar joints was studied using optical microscopy, SEM, EBSD, hardness, tensile and erichsen cup tests. Microstructure results show that the application of beam oscillation resulted in uniform and homogeneous microstructure compared to without beam oscillations and higher welding speed. Further, it was observed that weld microstructure changes from equiaxed to columnar grains depending on the weld speed. High weld speed results in columnar grain structure in the weld joint. Erichsen cup test results show that the application of beam oscillation results in excellent formability as compared to high weld speed. Tensile test results show no significant difference in strength properties in all three weld conditions, but the ductility was found to be highest for joints obtained with the application of weld beam oscillation as compared to without beam oscillation and high weld speed. This study shows that the application of beam oscillations plays an important role in improving the weld quality and performance of EBW dissimilar steel to Fe–Al joints.

  11. Microstructural Characteristics and Mechanical Properties of an Electron Beam-Welded Ti/Cu/Ni Joint

    Science.gov (United States)

    Zhang, Feng; Wang, Ting; Jiang, Siyuan; Zhang, Binggang; Feng, Jicai

    2018-05-01

    Electron beam welding experiments of TA15 titanium alloy to GH600 nickel superalloy with and without a copper sheet interlayer were carried out. Surface appearance, microstructure and phase constitution of the joint were examined by optical microscopy, scanning electron microscopy and x-ray diffraction analysis. Mechanical properties of Ti/Ni and Ti/Cu/Ni joint were evaluated based on tensile strength and microhardness tests. The results showed that cracking occurred in Ti/Ni electron beam weldment for the formation of brittle Ni-Ti intermetallics, while a crack-free electron beam-welded Ti/Ni joint can be obtained by using a copper sheet as filler metal. The addition of copper into the weld affected the welding metallurgical process of the electron beam-welded Ti/Ni joint significantly and was helpful for restraining the formation of Ti-Ni intermetallics in Ti/Ni joint. The microstructure of the weld was mainly characterized by a copper-based solid solution and Ti-Cu interfacial intermetallic compounds. Ti-Ni intermetallic compounds were almost entirely suppressed. The hardness of the weld zone was significantly lower than that of Ti/Ni joint, and the tensile strength of the joint can be up to 282 MPa.

  12. Interfacial microstructure and mechanical properties of brazed aluminum / stainless steel - joints

    Science.gov (United States)

    Fedorov, V.; Elßner, M.; Uhlig, T.; Wagner, G.

    2017-03-01

    Due to the demand of mass and cost reduction, joints based on dissimilar metals become more and more interesting. Especially there is a high interest for joints between stainless steel and aluminum, often necessary for example for automotive heat exchangers. Brazing offers the possibilities to manufacture several joints in one step at, in comparison to fusion welding, lower temperatures. In the recent work, aluminum / stainless steel - joints are produced by induction brazing using an AlSi10 filler and a non-corrosive flux. The mechanical properties are determined by tensile shear tests as well as fatigue tests at ambient and elevated temperatures. The microstructure of the brazed joints and the fracture surfaces of the tested samples are investigated by SEM.

  13. Microstructural Evolution of HSLA ISO 3183 X80M (API 5L X80) Friction Stir Welded Joints

    Science.gov (United States)

    Hermenegildo, Tahiana F. C.; Santos, Tiago F. A.; Torres, Edwar A.; Afonso, Conrado R. M.; Ramirez, Antonio J.

    2018-03-01

    Evaluation was made of friction stir welded joints, identifying conditions that resulted in satisfactory welded joints free from defects and with microstructural characteristics that provided good mechanical properties. Microstructural characterization and cooling curve analysis of the joints with lower and higher heat inputs evidenced deformation below and above the non-recrystallization temperature (Tnr) and dynamic recrystallization during microstructural evolution. Microscopy analyses showed acicular ferrite, bainitic ferrite, and coalesced bainite microstructures in the stir zone of the cold weld (lower heat input), while the stir zone of the hot weld (higher heat input) contained bainitic ferrite, acicular ferrite, coalesced bainite, martensite, and dispersed carbides. Granular bainite and dispersed carbides were observed in all the heat affected zones. Analysis of the microstructural transformations, together with the thermal history of the joints, showed that the variable that had the greatest influence on the morphology of the bainite (granular bainite/bainitic ferrite) was the deformation temperature.

  14. On the microstructure analysis of FSW joints of aluminium components made via direct metal laser sintering

    Science.gov (United States)

    Scherillo, Fabio; Astarita, Antonello; di Martino, Daniela; Contaldi, Vincenzo; di Matteo, Luca; di Petta, Paolo; Casarin, Renzo; Squillace, Antonino; Langella, Antonio

    2017-10-01

    Additive Manufacturing (AM), applied to metal industry, is a family of processes that allow complex shape components to be realized from raw materials in the form of powders. The compaction of the powders can be achieved by local melting of the powder bed or by solid state sintering. Direct Metal Laser Sintering (DMLS) is an additive manufacturing process in which a focalized laser beam is the heat source that allows the powders to be compacted. By DMLS it is possible to realize complex shape components. One of the limits of DMLS, as for every additive layer manufacturing techniques, is the unfeasibility to realize large dimension parts. Due to this limit the study of joining process of parts made via ALM is of great interest. One of the most promising options is the Friction Stir Welding (FSW), a solid state welding technique that has been proven to be very effective in the welding of metals difficult to weld, above all aluminium alloys. Since FSW is a solid-state technique, the microstructure of the various zone of the weld bead depends not only by the process itself but also by the parent microstruct ure of the parts to be welded. Furthermore, parts made of aluminium alloy via DMLS have a particular microstructure that is the result of repeated severe thermal cycles. In the present work the authors, starting from the description of the parent microstructure of parts made of AlSi10Mg aluminium alloy, study the microstructure evolution occurred within the joint made by Friction Stir Welding, analysing in details the microstructure of the main well recognized zone of the weld bead. The structure of the parent material is characterized by the presence of melting pools with a very fine microstructure. In the joint the recrystallization, the grain refinement and, above all, the redistribution of intermetallic phases occurs, resulting in an homogenization of the microstructure and in an increase of micro hardness.

  15. Soldering of copper-clad niobium--titanium superconductor composite

    International Nuclear Information System (INIS)

    Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

    1977-04-01

    When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

  16. Corrosion and microstructural aspects of dissimilar joints of titanium and type 304L stainless steel

    International Nuclear Information System (INIS)

    Mudali, U. Kamachi.; Ananda Rao, B.M.; Shanmugam, K.; Natarajan, R.; Raj, Baldev

    2003-01-01

    To link titanium and zirconium metal based (Ti, Zr-2, Ti-5%Ta, Ti-5%Ta-1.8Nb) dissolver vessels containing highly radioactive and concentrated corrosive nitric acid solution to other nuclear fuel reprocessing plant components made of AISI type 304L stainless steel (SS), high integrity and corrosion resistant dissimilar joints between them are necessary. Fusion welding processes produce secondary precipitates which dissolve in nitric acid, and hence solid-state processes are proposed. In this work, various dissimilar joining processes available for producing titanium-304L SS joints with adequate strength, ductility and corrosion resistance for this critical application are highlighted. Developmental efforts made at IGCAR, Kalpakkam are outlined. The possible methods and the microstructural-metallurgical properties of the joints along with corrosion results obtained with three phase (liquid, vapour, condensate) corrosion testing are discussed. Based on the results, dissimilar joint produced by the explosive joining process was adopted for plant application

  17. Microstructural characterisation of friction stir welding joints of mild steel to Ni-based alloy 625

    Energy Technology Data Exchange (ETDEWEB)

    Rodriguez, J. [Brazilian Nanotechnology National Laboratory (LNNano), P.O. Box 6192, Campinas, SP (Brazil); University of Campinas (UNICAMP), Campinas, SP (Brazil); Ramirez, A.J., E-mail: ramirezlondono.1@osu.edu [Brazilian Nanotechnology National Laboratory (LNNano), P.O. Box 6192, Campinas, SP (Brazil); University of Campinas (UNICAMP), Campinas, SP (Brazil); Department of Materials Science and Engineering, The Ohio State University — OSU, Columbus, OH 43221 (United States)

    2015-12-15

    In this study, 6-mm-thick mild steel and Ni-based alloy 625 plates were friction stir welded using a tool rotational speed of 300 rpm and a travel speed of 100 mm·min{sup −1}. A microstructural characterisation of the dissimilar butt joint was performed using optical microscopy, scanning and transmission electron microscopy, and energy dispersive X-ray spectroscopy (XEDS). Six different weld zones were found. In the steel, the heat-affected zone (HAZ) was divided into three zones and was composed of ferrite, pearlite colonies with different morphologies, degenerated regions of pearlite and allotriomorphic and Widmanstätten ferrite. The stir zone (SZ) of the steel showed a coarse microstructure consisting of allotriomorphic and Widmanstätten ferrite, degenerate pearlite and MA constituents. In the Ni-based alloy 625, the thermo-mechanically affected zone (TMAZ) showed deformed grains and redistribution of precipitates. In the SZ, the high deformation and temperature produced a recrystallised microstructure, as well as fracture and redistribution of MC precipitates. The M{sub 23}C{sub 6} precipitates, present in the base material, were also redistributed in the stir zone of the Ni-based alloy. TMAZ in the steel and HAZ in the Ni-based alloy could not be identified. The main restorative mechanisms were discontinuous dynamic recrystallisation in the steel, and discontinuous and continuous dynamic recrystallisation in the Ni-based alloy. The interface region between the steel and the Ni-based alloy showed a fcc microstructure with NbC carbides and an average length of 2.0 μm. - Highlights: • Comprehensive microstructural characterisation of dissimilar joints of mild steel to Ni-based alloy • Friction stir welding of joints of mild steel to Ni-based alloy 625 produces sound welds. • The interface region showed deformed and recrystallised fcc grains with NbC carbides and a length of 2.0 μm.

  18. Microstructure and mechanical properties of laser-welded joints of TWIP and TRIP steels

    International Nuclear Information System (INIS)

    Mujica, L.; Weber, S.; Pinto, H.; Thomy, C.; Vollertsen, F.

    2010-01-01

    With the aim of investigating a laser-welded dissimilar joint of TWIP and TRIP steel sheets, the microstructure was characterized by means of OM, SEM, and EBSD to differentiate the fusion zone, heat-affected zone, and the base material. OIM was used to differentiate between ferritic, bainitic, and martensitic structures. Compositions were measured by means of optical emission spectrometry and EDX to evaluate the effect of manganese segregation. Microhardness measurements and tensile tests were performed to evaluate the mechanical properties of the joint. Residual stresses and XRD phase quantification were used to characterize the weld. Grain coarsening and martensitic areas were found in the fusion zone, and they had significant effects on the mechanical properties of the weld. The heat-affected zone of the TRIP steel and the corresponding base material showed considerable differences in the microstructure and properties.

  19. TEM study of microstructure in explosive welded joints between Zircaloy-4 and stainless steel

    International Nuclear Information System (INIS)

    Zhou Hairong; Zhou Bangxin

    1996-10-01

    The microstructure of explosive welded joints between Zircaloy-4 and 18/8 stainless steel has been investigated by transmission electron microscopy (TEM). The metallurgical bonding was achieved by combining effect of diffusion and local melting when the explosive parameters were selected correctly. The molten region which consists of amorphous and crystalline with hexagonal crystal structure is hard and brittle. But the welded joints can be pulled, bent and cold rolled without cracks formed on the bonding layer, so as the molten regions are small and distributed as isolated islands. (6 refs., 6 figs., 1 tab.)

  20. Microstructure and mechanical performance of autogenously fibre laser beam welded Ti-6242 butt joints

    Energy Technology Data Exchange (ETDEWEB)

    Kashaev, Nikolai, E-mail: nikolai.kashaev@hzg.de; Pugachev, Dmitry; Ventzke, Volker; Fomin, Fedor; Burkhardt, Irmela; Enz, Josephin; Riekehr, Stefan

    2017-05-10

    This work deals with the effects of laser beam power, focus position and advance speed on the geometry, microstructure and mechanical properties such as the tensile strength and microhardness of autogenously fibre laser beam welded Ti-6Al-2Sn-4Zr-2Mo (denoted as Ti-6242) butt joints used for high temperature applications. The Ti-6242 sheet employed here is characterized by a globular (α+β) microstructure. Laser beam welded butt joints consisted of a martensitic fusion zone, inhomogeneous heat affected zones and equiaxed base materials. The microhardness increased from 330 HV 0.3 in base material to 430 HV 0.3 in fusion zone due to the martensitic transformation. Butt joints showed the base material level of strength in tensile test. The local increase in microhardness provided a shielding effect that protected the Ti-6242 butt joint against mechanical damage during the static tensile load test. The predicted critical total underfill depth that does not reduce the tensile strength of the weld was determined to be 25% of the specimen thickness. - Highlights: • Autogenous fibre LBW of Ti-6242 was successfully achieved. • Butt joints showed low levels of porosity and an appropriate seam geometry. • Base material level of strength achieved for tensile strength. • Predicted critical underfill depth is 25% of the specimen thickness.

  1. Electrical characteristics for Sn-Ag-Cu solder bump with Ti/Ni/Cu under-bump metallization after temperature cycling tests

    Science.gov (United States)

    Shih, T. I.; Lin, Y. C.; Duh, J. G.; Hsu, Tom

    2006-10-01

    Lead-free solder bumps have been widely used in current flip-chip technology (FCT) due to environmental issues. Solder joints after temperature cycling tests were employed to investigate the interfacial reaction between the Ti/Ni/Cu under-bump metallization and Sn-Ag-Cu solders. The interfacial morphology and quantitative analysis of the intermetallic compounds (IMCs) were obtained by electron probe microanalysis (EPMA) and field emission electron probe microanalysis (FE-EPMA). Various types of IMCs such as (Cu1-x,Agx)6Sn5, (Cu1-y,Agy)3Sn, and (Ag1-z,Cuz)3Sn were observed. In addition to conventional I-V measurements by a special sample preparation technique, a scanning electron microscope (SEM) internal probing system was introduced to evaluate the electrical characteristics in the IMCs after various test conditions. The electrical data would be correlated to microstructural evolution due to the interfacial reaction between the solder and under-bump metallurgy (UBM). This study demonstrated the successful employment of an internal nanoprobing approach, which would help further understanding of the electrical behavior within an IMC layer in the solder/UBM assembly.

  2. Microstructure and Mechanical Properties of TIG Weld Joint of ZM5 Magnesium Alloy

    Directory of Open Access Journals (Sweden)

    QIN Ren-yao

    2016-06-01

    Full Text Available The ZM5 magnesium alloy plates were welded by TIG welding method. The microstructural characteristics and mechanical properties of ZM5 magnesium alloy joint were studied by optical microscopy, microhardness and tensile testers. The results show that the TIG weld joint of ZM5 magnesium alloy is composed of heat affected zone, partially melted zone and weld metal. The heat affected zone is consisted of primary α-Mg phase and eutectic phase that is composed of eutectic α-Mg and eutectic β-Mg17Al12 phase and mainly precipitated at grain boundaries. In the partially melted zone, the eutectic phase is not only increasingly precipitated at grain boundaries, but also dispersed in grains, and the growth of the β-Mg17Al12 phase is obviously observed. The microstructure in the weld is the typical dendritic morphology. The dendrites are considered as primary α-Mg phase, and the interdendritic regions are α+β eutectic phase. The difference in the microstructure of the heat affected zone, partially melted zone and weld results in their various microhardness values, and leads to the smaller tensile strength and ductility in the ZM5 alloy weld joint than parent metal.

  3. A novel method for direct solder bump pull testing using lead-free solders

    Science.gov (United States)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  4. Effects of Ni{sub 3}Sn{sub 4} and (Cu,Ni){sub 6}Sn{sub 5} intermetallic layers on cross-interaction between Pd and Ni in solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Baek, Yong-Ho [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of); Division of Advanced Circuit Interconnect, Samsung Electro-Mechanics Co., Ltd., Suwon 443-743 (Korea, Republic of); Chung, Bo-Mook [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of); Department of Research and Development, KPM TECH, Ansan 425-090 (Korea, Republic of); Choi, Young-Sik [Division of Advanced Circuit Interconnect, Samsung Electro-Mechanics Co., Ltd., Suwon 443-743 (Korea, Republic of); Choi, Jaeho [Department of Advanced Metal and Materials Engineering, Gangneung-Wonju National University, Gangneung 210-702 (Korea, Republic of); Huh, Joo-Youl, E-mail: jyhuh@korea.ac.kr [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of)

    2013-12-05

    alleviate the (Pd,Ni)Sn{sub 4}-related degradation of solder joint reliability.

  5. Local microstructures, Hardness and mechanical properties of a stainless steel pipe-welded joint

    International Nuclear Information System (INIS)

    Zhao Yongxiang; Gao Qing; Cai Lixun

    2000-01-01

    An experimental investigation is carefully performed into the local microstructures, hardness values and monotonic mechanical properties of the three zones (the base metal, heat affecting zone and weld metal) of 1Cr18Ni9Ti stainless steel pipe-welded joint. The local microstructures are observed by a metallurgical test and a surface replica technology, the local hardness values are measures by a random Vickers hardness test, and the local mechanical properties are characterized by the Ramberg-Osgood and modified Ramberg-Osgood stress-stain relations. The investigation reveals that there are significant differences of the three zones in the local microstructures, hardness values and monotonic mechanical properties, especially of the three zones in the local microstructure, hardness values and monotonic mechanical properties, especially of the weld metal. The weld metal exhibits the largest heterogeneity of local microstructures and monotonic mechanical properties, and the largest scatter of local hardness values. It is necessary to consider these difference and introduce the reliability method to model the scatter in the pipe analysis. In addition, it is verified that a columnar grain structure, which is made up of matrix-rich δ ferrite bands, can characterize the weld metal and the distance between the neighboring rich δ ferrite bands is an appropriate measurement of the columnar grain structure. This measurement is in accordance with the transition point between the microstructural short crack and physical small crack stages, which are generally used for characterizing the short fatigue crack behavior of materials. This indicates that the microstructure controls the fatigue damage character of the present material

  6. Morphology, microstructure, and mechanical properties of laser-welded joints in GH909 alloy

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Chunming; Cai, Yuanzheng; Hu, Chongjing; Zhang, Xiong; Yan, Fei; Hu, Xiyuan [Huazhong University of Science and Technology, Wuhan (China)

    2017-05-15

    The experimental laser welding of GH909 alloy was conducted in this study. The morphology, microstructure, and mechanical properties of laser-welded joints were analyzed by scanning electron microscopy, energy diffraction spectroscopy, and other techniques. Results revealed that the microstructure of the welded joints mainly consisted of tiny cellular structures, dendritic structures, and equiaxed crystals. Pores appeared in the interdendritic regions because of the insufficient local feeding of molten metal during solidification. Nb segregation in the heat-affected zone caused liquation cracking, whereas C segregation further induced the formation of carbide precipitates along the grain boundaries during the welding thermal cycle. The instability of the keyhole significantly promoted the escape of the metal vapor/plasma from the hole; as a result, porosity defects formed in the weld. The average tensile strength of the test joints was 756 MPa, which is 93.1 % of that of the base metal. The average microhardness of the weld zone (250 HV) was higher than that of the GH909 alloy substrate (208 HV), peaking at 267 HV. Microcracks appeared along the grain boundaries, proving that the grain boundaries were the weakest areas in the joint.

  7. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    DEFF Research Database (Denmark)

    High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

  8. Thermomechanical fatigue life prediction for several solders

    Science.gov (United States)

    Wen, Shengmin

    anisotropic small-scale (micron or nano scale) solder joints. More importantly, the theory is materials science based so that the parameters of the fatigue formula can be worked out by testing of bulk specimens while the formula can be applicable to small-scale structures. The theory suggests metallurgical control in the manufacturing process to optimize the fatigue life of solder structures.

  9. Microstructure evolution of electron beam welded Ti3Al-Nb joint

    International Nuclear Information System (INIS)

    Feng Jicai; Wu Huiqiang; He Jingshan; Zhang Bingang

    2005-01-01

    The microstructure evolution characterization in high containing Nb, low Al titanium aluminide alloy of electron beam welded joints was investigated by means of OM, SEM, XRD, TEM and microhardness analysis. The results indicated that the microstructure of the weld metal made with electron beam under the welding conditions employed in this work was predominantly metastable, retaining ordered β phase (namely B2 phase), and was independent of the welding parameters but independent of the size and the orientation of the weld solidification structures. As the heat input is decreased, the cellular structure zone is significantly reduced, and then the crystallizing morphology of fusion zone presented dendritically columnar structure. There existed grain growth coarsening in heat affected zone (HAZ) for insufficient polygonization. Both fusion zone (FZ) and the HAZ had higher microhardness than the base metal

  10. Microstructure and failure mechanisms of refill friction stir spot welded 7075-T6 aluminum alloy joints

    International Nuclear Information System (INIS)

    Shen, Zhikang; Yang, Xinqi; Zhang, Zhaohua; Cui, Lei; Li, Tielong

    2013-01-01

    Highlights: ► There is a correlation between the void in the weld and the joint strength. ► The preferable mechanical properties can be obtained by lowering rotational speed. ► The alclad has an adverse effect on the mechanical properties. -- Abstract: In this paper, the microstructure and mechanical properties of 7075-T6 aluminum alloy joints joined by refill friction stir spot welding (RFSSW) were investigated. The keyhole was refilled successfully, and the microstructure of the weld exhibited variations in the grain sizes in the width and the thickness directions. There existed defects (hook, voids, bonding ligament, etc.) associated to the material flow in the weld. Mechanical properties of the joint have been investigated in terms of hardness and tensile/shear and cross-tension test, and the fracture mechanisms were observed by SEM (scanning electron microscope). The hardness profile of the weld exhibited a W-shaped appearance in the macroscopic level, which reached the minimum at the boundary of the sleeve and the clamping ring. The variation laws between tensile/shear and cross-tension strength and processing parameters were rather complicated. The void in the weld played an important role in determining the strength of the joint. On the whole, the preferable strength can be obtained at lower rotational speed. Shear fracture mode was observed under tensile–shear loadings, and nugget debonding, plug type fracture (on the upper sheet) and plug type fracture (on the lower sheet) modes were observed under cross-tension loadings. It was also observed that the main feature affecting the mechanical properties of the joint is the alclad between the upper and lower sheets and the connecting qualities between the stir zone and thermo-mechanically affected zone.

  11. Microstructure and Fatigue Properties of Laser Welded DP590 Dual-Phase Steel Joints

    Science.gov (United States)

    Xie, Chaojie; Yang, Shanglei; Liu, Haobo; Zhang, Qi; Cao, Yaming; Wang, Yuan

    2017-08-01

    In this paper, cold-rolled DP590 dual-phase steel sheets with 1.5 mm thickness were butt-welded by a fiber laser, and the evolution and effect on microhardness, tensile property and fatigue property of the welded joint microstructure were studied. The results showed that the base metal is composed of ferrite and martensite, with the martensite dispersed in the ferrite matrix in an island manner. The microstructure of the weld zone was lath-shaped martensite that can be refined further by increasing the welding speed, while the heat-affected zone was composed of ferrite and tempered martensite. The microhardness increased with increasing welding speed, and the hardness reached its highest value—393.8 HV—when the welding speed was 5 m/min. Static tensile fracture of the welded joints always occurred in the base metal, and the elongation at break was more than 16%. The conditional fatigue limits of the base metal and the weld joints were 354.2 and 233.6 MPa, respectively, under tension-tension fatigue tests with a stress rate of 0.1. After observation of the fatigue fracture morphology, it was evident that the fatigue crack of the base metal had sprouted into the surface pits and that its expansion would be accelerated under the action of a secondary crack. The fatigue source of the welded joint was generated in the weld zone and expanded along the martensite, forming a large number of fatigue striations. Transient breaking, which occurred in the heat-affected zone of the joint as a result of the formation of a large number of dimples, reflected the obvious characteristics of ductile fracture.

  12. Microstructural characterization and properties of dissimilar joints between stainless steels done by fusion process

    International Nuclear Information System (INIS)

    Bauly, Julio Cesar

    2000-01-01

    The chemical, mechanical and microstructural characterization of a dissimilar joint between SA-336 class F347 austenitic and SA-479 type 414 martensitic stainless steels were done, welded by GTAW process. The results of the tensile strength of the joint welded with the consumable ER Ni Cr-3, showed higher values compared to those of the base metal SA-336 class F347 of lower resistance in the dissimilar joint. These results were complemented by longitudinal bends tests, susceptibility to intergranular attack tests, hardness tests, optical microscopy, scanning electron microscopy and chemical analysis. That characterization compared to the one of dissimilar joint welded with ER309L consumable, submitted to the same mentioned tests, leads to the conclusion that the consumable of nickel ERNiCr-3 seems to be the best applicable consumable, compared the ER309L. The main welding parameters were also obtained, in order to compose a database for a future qualification of the welding procedure. Besides, situations possible to be joint in this type of joint, were simulated, such as its weldability using the laser processing, joint welded without material addition and without root protection with inert gas. The results of the tensile strength of these welded joint, showed values superior to the base metal SA-336 class F347 of lower resistance in the dissimilar joint. These results were complemented by hardness tests and chemical analysis, also confirming that these simulated situations assist to the values of the strength of the joint, even if diverging with the theoretical studies done with the application of the Schaeffler Diagram as well as with the well known weldability techniques for this type of dissimilar joint. A theoretical discussion was also done, using the Schaeffler Diagram, with base in a review of the literature, where the welding needs was analyzed with or without metal addition, using the values of chemical composition of the base metals and specified

  13. Effect of weld spacing on microstructure and mechanical properties of CLAM electron beam welding joints

    Energy Technology Data Exchange (ETDEWEB)

    Zhai, Yutao; Huang, Bo, E-mail: aufa0007@163.com; Zhang, Junyu; Zhang, Baoren; Liu, Shaojun; Huang, Qunying

    2016-11-15

    Highlights: • The welded joints of CLAM steel with different weld spacings have been fabricated with electron beam welding, and a simplified model of CLAM sheet was proposed. • The microstructure and mechanical properties such as microhardness, impact and tensile were investigated at different welding spacing for both conditions of as-welded and post weld heat treatment (PWHT). • The effect of the welding thermal cycle was significantly when the weld spacings were smaller than 4 mm. • When the weld spacing was small enough, the original microstructures would be fragmented with the high heat input. - Abstract: China low activation martensitic (CLAM) steel has been chosen as the primary structural material in the designs of dual function lithium-lead (DFLL) blanket for fusion reactors, China helium cooled ceramic breeder (HCCB) test blanket module (TBM) for ITER and China fusion engineering test reactor (CFETR) blanket. The cooling components of the blankets are designed with high density cooling channels (HDCCs) to remove the high nuclear thermal effectively. Hence, the welding spacing among the channels are small. In this paper, the welded joints of CLAM steel with different weld spacings have been fabricated with electron beam welding (EBW). The weld spacing was designed to be 2 mm, 3 mm, 4 mm, 6 mm and 8 mm. The microstructure and mechanical properties such as microhardness, impact and tensile were investigated at different welding spacing for both conditions of as-welded and post weld heat treatment (PWHT). The PWHT is tempering at 740 °C for 120 min. The results showed that the grain size in the heat affected zone (HAZ) increased with the increasing weld spacing, and the joint with small weld spacing had a better performance after PWHT. This work would give useful guidance to improve the preparation of the cooling components of blanket.

  14. Corrosion Reliability of Lead-free Solder Systems Used in Electronics

    DEFF Research Database (Denmark)

    Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

    2017-01-01

    humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

  15. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    DEFF Research Database (Denmark)

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

    2017-01-01

    with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  16. Evaluation of Microstructure and Mechanical Properties in Dissimilar Austenitic/Super Duplex Stainless Steel Joint

    Science.gov (United States)

    Rahmani, Mehdi; Eghlimi, Abbas; Shamanian, Morteza

    2014-10-01

    To study the effect of chemical composition on microstructural features and mechanical properties of dissimilar joints between super duplex and austenitic stainless steels, welding was attempted by gas tungsten arc welding process with a super duplex (ER2594) and an austenitic (ER309LMo) stainless steel filler metal. While the austenitic weld metal had vermicular delta ferrite within austenitic matrix, super duplex stainless steel was mainly comprised of allotriomorphic grain boundary and Widmanstätten side plate austenite morphologies in the ferrite matrix. Also the heat-affected zone of austenitic base metal comprised of large austenite grains with little amounts of ferrite, whereas a coarse-grained ferritic region was observed in the heat-affected zone of super duplex base metal. Although both welded joints showed acceptable mechanical properties, the hardness and impact strength of the weld metal produced using super duplex filler metal were found to be better than that obtained by austenitic filler metal.

  17. Effect of heat input on the microstructure and mechanical properties of gas tungsten arc welded AISI 304 stainless steel joints

    International Nuclear Information System (INIS)

    Kumar, Subodh; Shahi, A.S.

    2011-01-01

    Highlights: → Welding procedure is established for welding 6 mm thick AISI 304 using GTAW process. → Mechanical properties of the weld joints are influenced strongly by the heat input. → Highest tensile strength of 657.32 MPa is achieved by joints using low heat input. → Welding parameters affect heat input and hence microstructure of weld joints. → Extent of grain coarsening in the HAZ increases with increase in the heat input. -- Abstract: Influence of heat input on the microstructure and mechanical properties of gas tungsten arc welded 304 stainless steel (SS) joints was studied. Three heat input combinations designated as low heat (2.563 kJ/mm), medium heat (2.784 kJ/mm) and high heat (3.017 kJ/mm) were selected from the operating window of the gas tungsten arc welding process (GTAW) and weld joints made using these combinations were subjected to microstructural evaluations and tensile testing so as to analyze the effect of thermal arc energy on the microstructure and mechanical properties of these joints. The results of this investigation indicate that the joints made using low heat input exhibited higher ultimate tensile strength (UTS) than those welded with medium and high heat input. Significant grain coarsening was observed in the heat affected zone (HAZ) of all the joints and it was found that the extent of grain coarsening in the heat affected zone increased with increase in the heat input. For the joints investigated in this study it was also found that average dendrite length and inter-dendritic spacing in the weld zone increases with increase in the heat input which is the main reason for the observable changes in the tensile properties of the weld joints welded with different arc energy inputs.

  18. The effect of postprocessing on tensile property and microstructure evolution of friction stir welding aluminum alloy joint

    International Nuclear Information System (INIS)

    Hu, Z.L.; Wang, X.S.; Pang, Q.; Huang, F.; Qin, X.P.; Hua, L.

    2015-01-01

    Friction stir welding is an efficient manufacturing method for joining aluminum alloy and can dramatically reduce grain size conferring excellent plastic deformation properties. Consequently, friction stir welding is used to manufacture tailor welded blanks to optimize weight or performance in the final component. In the study, the microstructural evolution and mechanical properties of friction stir welding joint during plastic forming and subsequent heat treatment were investigated. The microstructural characteristics of the friction stir welding joints were studied by Electron Backscattered Diffraction and Transmission Electron Microscopy. The mechanical properties were evaluated by tensile and microhardness tests. It is found that the tensile and yield strengths of friction stir welding joints are significantly improved after severe plastic deformation due to the grain refinement. Following heat treatment, the strength of the friction stir welding joints significantly decrease due to the obvious abnormal grain growth. Careful attention must be given to the processing route of any friction stir welding joint intended for plastic forming, especially the annealing between forming passes. Severe plastic deforming of the friction stir welding joint leads to a high level of stored energy/dislocation density, which causes the abnormal grain growth during subsequent heat treatment, and consequently reduce the mechanical properties of the friction stir welding joint. - Highlights: • Great changes are observed in the microstructure of FSW joint after postprocessing. • Postprocessing shows great effect on the microstructure stability of FSW joint. • The weld shows more significant decrease in strength than the BM due to the AGG. • Attention must be given to the processing route of FSW joint for plastic forming

  19. Thermo-mechanic and Microstructural Analysis of an Underwater Welding Joint

    Directory of Open Access Journals (Sweden)

    Pedro Hernández Gutiérrez

    Full Text Available Abstract The aim of this research is to present a comparative analysis between theoretical and experimental thermal fields as well as a microstructural behaviour and residual stresses applying multiple weld beads in the joint of two API 5L X52 pipe sections. The thermal field, microstructural and residual stresses were numerically modelled through the finite element method (FEM and compared to experimentally. The simulation conditions used in the FEM analysis were similar considerations to the underwater welding conditions. The finite element analysis was carried out, first by a non-linear transient thermal analysis for obtaining the global temperature history generated during the underwater welding process. Subsequently, a microstructural behaviour was determined using the temperatures distribution obtained in the pipe material by calculating the structural transformations of the material during the welding process, and finally a stress analysis was developed using the temperatures obtained from the thermal analysis. It was found that this simulation method can be used efficiently to determinate with accuracy the optimum welding parameters of this kind of weld applications.

  20. Micro-structure of Joints made of Dissimilar Metals using Explosion Welding

    Directory of Open Access Journals (Sweden)

    Juan Ramón Castillo-Matos

    2017-04-01

    Full Text Available The objective of this investigation is to establish the behaviour of the micro-structure of dissimilar joints made of titanium with AISI 1020, 1066 and 1008 steels through explosion welding. A detonation velocity of 2 800 m/s, a charge radius of 0,345 kg and a collision velocity of 1196, 16 m/s with an explosive volume of 600 cm3 and a density of 1,15 g/cm3 were considered. The microstructures obtained were composed of equiaxed ferrite grains, very fine grains of troostitic type and coarse grains with ferrite grid. Fine and aligned grains of ferrite type are observed in the casted area of both base materials. The metal hardness experienced an increase in samples from 120 HV AISI 1008 steel up to 250 HV for AISI 1066 steel. The AISI 1020 steel joint with titanium has an line shaped interface unlike the AISI 1008 steels with 4063 forms waves with uniform width, which provides a higher mechanical resistance associated with the ductility of the AISI 1008 steel.

  1. Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows

    Science.gov (United States)

    Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

    2016-12-01

    Controlling the size, dispersion, and stability of intermetallic compounds in lead-free solder alloys is vital to creating reliable solder joints regardless of how many times the solder joints are melted and resolidified (reflowed) during circuit board assembly. In this article, the coarsening behavior of Cu x Al y and Cu6Sn5 in two Sn-Cu-Al alloys, a Sn-2.59Cu-0.43Al at. pct alloy produced via drip atomization and a Sn-5.39Cu-1.69Al at. pct alloy produced via melt spinning at a 5-m/s wheel speed, was characterized after multiple (1-5) reflow cycles via differential scanning calorimetry between the temperatures of 293 K and 523 K (20 °C and 250 °C). Little-to-no coarsening of the Cu x Al y particles was observed for either composition; however, clustering of Cu x Al y particles was observed. For Cu6Sn5 particle growth, a bimodal size distribution was observed for the drip atomized alloy, with large, faceted growth of Cu6Sn5 observed, while in the melt spun alloy, Cu6Sn5 particles displayed no significant increase in the average particle size, with irregularly shaped, nonfaceted Cu6Sn5 particles observed after reflow, which is consistent with shapes observed in the as-solidified alloys. The link between original alloy composition, reflow undercooling, and subsequent intermetallic coarsening behavior was discussed by using calculated solidification paths. The reflowed microstructures suggested that the heteroepitaxial relationship previously observed between the Cu x Al y and the Cu6Sn5 was maintained for both alloys.

  2. Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn-Ag-Cu and Sn-Ag Solder Interconnects With and Without Board-Side Ni Surface Finish

    Science.gov (United States)

    Lee, Tae-Kyu; Duh, Jeng-Gong

    2014-11-01

    The combined effects on long-term reliability of isothermal aging and chemically balanced or unbalanced surface finish have been investigated for fine-pitch ball grid array packages with Sn-3.0Ag-0.5Cu (SAC305) (wt.%) and Sn-3.5Ag (SnAg) (wt.%) solder ball interconnects. Two different printed circuit board surface finishes were selected to compare the effects of chemically balanced and unbalanced structure interconnects with and without board-side Ni surface finish. NiAu/solder/Cu and NiAu/solder/NiAu interconnects were isothermally aged and thermally cycled to evaluate long-term thermal fatigue reliability. Weibull plots of the combined effects of each aging condition and each surface finish revealed lifetime for NiAu/SAC305/Cu was reduced by approximately 40% by aging at 150°C; less degradation was observed for NiAu/SAC305/NiAu. Further reduction of characteristic life-cycle number was observed for NiAu/SnAg/NiAu joints. Microstructure was studied, focusing on its evolution near the board and package-side interfaces. Different mechanisms of aging were apparent under the different joint configurations. Their effects on the fatigue life of solder joints are discussed.

  3. Microstructure and mechanical properties of weld-bonded and resistance spot welded magnesium-to-steel dissimilar joints

    International Nuclear Information System (INIS)

    Xu, W.; Chen, D.L.; Liu, L.; Mori, H.; Zhou, Y.

    2012-01-01

    Highlights: ► Adhesive reduces shrinkage porosity and stress concentration around the weld nugget. ► Adhesive promotes the formation of intermetallic compounds during weld bonding. ► In Mg/steel joints fusion zone appears only at the Mg side with dendritic structures. ► Weld-bonded Mg/steel joints are considerably stronger than RSW Mg/steel joints. ► Fatigue strength is three-fold higher for weld-bonded joints than for RSW joints. - Abstract: The aim of this study was to evaluate microstructures, tensile and fatigue properties of weld-bonded (WB) magnesium-to-magnesium (Mg/Mg) similar joints and magnesium-to-steel (Mg/steel) dissimilar joints, in comparison with resistance spot welded (RSW) Mg/steel dissimilar joints. In the WB Mg/Mg joints, equiaxed dendritic and divorced eutectic structures formed in the fusion zone (FZ). In the dissimilar joints of RSW and WB Mg/steel, FZ appeared only at Mg side with equiaxed and columnar dendrites. At steel side no microstructure changed in the WB Mg/steel joints, while the microstructure in the RSW Mg/steel joints consisted of lath martensite, bainite, pearlite and retained austenite leading to an increased microhardness. The relatively low cooling rate suppressed the formation of shrinkage porosity but promoted the formation of MgZn 2 and Mg 7 Zn 3 in the WB Mg/steel joints. The added adhesive layer diminished stress concentration around the weld nugget. Both WB Mg/Mg and Mg/steel joints were significantly stronger than RSW Mg/steel joints in terms of the maximum tensile shear load and energy absorption, which also increased with increasing strain rate. Fatigue strength was three-fold higher for WB Mg/Mg and Mg/steel joints than for RSW Mg/steel joints. Fatigue failure in the RSW Mg/steel joints occurred from the heat-affected zone near the notch root at lower load levels, and in the mode of interfacial fracture at higher load levels, while it occurred in the Mg base metal at a maximum cyclic load up to ∼10 kN in

  4. Microstructural Characterization and Mechanical Properties of Electron Beam Welded Joint of High Strength Steel Grade S690QL

    Directory of Open Access Journals (Sweden)

    Błacha S.

    2016-06-01

    Full Text Available In the paper the results of metallographic examination and mechanical properties of electron beam welded joint of quenched and tempered steel grade S690QL are presented. Metallographic examination revealed that the concentrated electron beam significantly affect the changes of microstructure in the steel. Parent material as a delivered condition (quenched and tempered had a bainitic-martensitic microstructure at hardness about 290 HV0.5. After welding, the microstructure of heat affected zone is composed mainly of martensite (in the vicinity of the fusion line of hardness 420 HV0.5. It should be noted, however, that the microstructure of steel in the heat affected zone varies with the distance from the fusion line. The observed microstructural changes were in accordance with the CCT-S transformation diagram for the examined steel.

  5. Microstructure and dynamic tensile behavior of DP600 dual phase steel joint by laser welding

    Energy Technology Data Exchange (ETDEWEB)

    Dong, Danyang, E-mail: dongdanyang@mail.neu.edu.cn [College of Science, Northeastern University, No. 11, Lane 3, WenHua Road, HePing District, Shenyang 110819 (China); Liu, Yang, E-mail: liuyang@mail.neu.edu.cn [Key Laboratory for Anisotropy and Texture of Materials, Ministry of Education, Northeastern University, Shenyang 110819 (China); Yang, Yuling, E-mail: yulingyang@mail.neu.edu.cn [College of Science, Northeastern University, No. 11, Lane 3, WenHua Road, HePing District, Shenyang 110819 (China); Li, Jinfeng, E-mail: lijinfengboda@163.com [College of Science, Northeastern University, No. 11, Lane 3, WenHua Road, HePing District, Shenyang 110819 (China); Ma, Min, E-mail: sharon6789@163.com [College of Science, Northeastern University, No. 11, Lane 3, WenHua Road, HePing District, Shenyang 110819 (China); Jiang, Tao, E-mail: tao.jiang906@yahoo.com [College of Science, Northeastern University, No. 11, Lane 3, WenHua Road, HePing District, Shenyang 110819 (China)

    2014-01-31

    Dual phase (DP) steels have been widely used in the automotive industry to reduce vehicle weight and improve car safety. In such applications welding and joining have to be involved, which would lead to a localized change of the microstructure and property, and create potential safety and reliable issues under dynamic loading. The aim of the present study is to examine the rate-dependent mechanical properties, deformation and fracture behavior of DP600 steel and its welded joint (WJ) produced by Nd:YAG laser welding over a wide range of strain rates (0.001–1133 s{sup −1}). Laser welding results in not only significant microhardness increase in the fusion zone (FZ) and inner heat-affected zone (HAZ), but also the formation of a softened zone in the outer HAZ. The yield strength (YS) of the DP600 steel increases and the ultimate tensile strength (UTS) remains almost unchanged, but the ductility decreases after welding. The DP600 base metal (BM) and WJ are of positive strain rate sensitivity and show similar stress–strain response at all studied strain rates. The enhanced ductility at strain rates ranging from 1 to 100 s{sup −1} is attributed to the retardation of the propagation of plastic strain localization due to the positive strain rate sensitivity and the thermal softening caused by deformation induced adiabatic temperature rise during dynamic tensile deformation. The tensile failure occurs in the inner HAZ of the joint and the distance of failure location from the weld centerline decreases with increasing strain rate. The mechanism for the changing failure location can be related to the different strain rate dependence of the plastic deformation behavior of the microstructures in various regions across the joint. The DP600 WJ absorbs more energy over the whole measured strain rates than that of the BM due to the higher strength at the same strain when the deformation only up to 10% is considered.

  6. The effects of alloying elements on microstructures and mechanical properties of tungsten inert gas welded AZ80 magnesium alloys joint

    Science.gov (United States)

    Li, Hui; Zhang, Jiansheng; Ding, Rongrong

    2017-11-01

    The effects of alloying elements on the macrostructures, microstructures and tensile strength of AZ80 Mg alloy weldments were studied in the present study. The results indicate that with the decrease of Al element content of filler wire, the welding defects of seam are gradually eliminated and the β-Mg17Al12 phases at α-Mg boundaries are refined and become discontinuous, which are beneficial to the improvement of tensile strength. With AZ31 Mg alloy filler wire, the maximum tensile strength of AZ80 weldment is 220 MPa and fracture occurs at the welding seam of joint. It is experimentally proved that robust AZ80 Mg alloy joints can be obtained by tungsten inert gas (TIG) welding process with AZ31 Mg alloy filler wire. However, further study is required to improve the microstructures and reduce welding defects of joint in order to further improve the joining strength of AZ80 Mg alloy joint.

  7. Microstructure and mechanical analysis of W/P91 steel HIP-joint with Ti interlayer

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Ji-chao [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, 230031 (China); Science Island Branch of Graduate School, University of Science & Technology of China, Hefei, 230031 (China); Wang, Wanjing, E-mail: wjwang@ipp.ac.cn [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, 230031 (China); Sun, Zhaoxuan; Wang, Xingli; Wei, Ran [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, 230031 (China); Science Island Branch of Graduate School, University of Science & Technology of China, Hefei, 230031 (China); Xie, Chunyi; Li, Qiang [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, 230031 (China); Luo, Guang-nan [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, 230031 (China); Science Island Branch of Graduate School, University of Science & Technology of China, Hefei, 230031 (China); Hefei Center for Physical Science and Technology, Hefei, 230022 (China); Hefei Science Center of Chinese Academy of Sciences, Hefei, 230027 (China)

    2016-11-15

    Highlights: • W and P91 steel can be joined successfully using the Hot Isostatic Pressing (HIP) method with Ti interlayer. • The experiment was conducted at 760 °C below the P91 steel austenitizing temperature with the pressure 150 MPa for 4 h. • The residual stress concentration is responsible for the fracture of HIP joints under low joining temperature. • Low temperature can reduce the reaction products and improve the mechanical properties of W/Ti/P91 steel joints. - Abstract: W and P91 steel were joined by using the Hot Isostatic Pressing method with Ti interlayer, and the experiments were conducted at 760 °C. The mechanical property, bonding quality and interface microstructure were tested by the Torsion test, Non-Destructive Test, Scanning Electron Microscope and Nano-indentation test. The minimum shear strength of joints was 225 MPa and the failure occurred at the W/Ti interfaces. Metallographic analysis revealed good bonding quality across bonding lines. Almost no reaction products were found in the diffusion region and the Nano-indentation test demonstrated that the solid solution strengthening was caused by inter-diffusion in the diffusion zone. The effect of low joining temperature on reducing reaction products and improving mechanical properties of W/Ti/Steel diffusion bonding were investigated in this paper.

  8. Microstructure and mechanical analysis of W/P91 steel HIP-joint with Ti interlayer

    International Nuclear Information System (INIS)

    Wang, Ji-chao; Wang, Wanjing; Sun, Zhaoxuan; Wang, Xingli; Wei, Ran; Xie, Chunyi; Li, Qiang; Luo, Guang-nan

    2016-01-01

    Highlights: • W and P91 steel can be joined successfully using the Hot Isostatic Pressing (HIP) method with Ti interlayer. • The experiment was conducted at 760 °C below the P91 steel austenitizing temperature with the pressure 150 MPa for 4 h. • The residual stress concentration is responsible for the fracture of HIP joints under low joining temperature. • Low temperature can reduce the reaction products and improve the mechanical properties of W/Ti/P91 steel joints. - Abstract: W and P91 steel were joined by using the Hot Isostatic Pressing method with Ti interlayer, and the experiments were conducted at 760 °C. The mechanical property, bonding quality and interface microstructure were tested by the Torsion test, Non-Destructive Test, Scanning Electron Microscope and Nano-indentation test. The minimum shear strength of joints was 225 MPa and the failure occurred at the W/Ti interfaces. Metallographic analysis revealed good bonding quality across bonding lines. Almost no reaction products were found in the diffusion region and the Nano-indentation test demonstrated that the solid solution strengthening was caused by inter-diffusion in the diffusion zone. The effect of low joining temperature on reducing reaction products and improving mechanical properties of W/Ti/Steel diffusion bonding were investigated in this paper.

  9. Interfacial microstructure and joining properties of Titanium–Zirconium–Molybdenum alloy joints brazed using Ti–28Ni eutectic brazing alloy

    Energy Technology Data Exchange (ETDEWEB)

    Song, X.G., E-mail: songxg@hitwh.edu.cn [State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001 (China); Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209 (China); Tian, X. [State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001 (China); Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209 (China); Zhao, H.Y. [Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209 (China); Si, X.Q.; Han, G.H.; Feng, J.C. [State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001 (China); Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209 (China)

    2016-01-20

    Vacuum brazing of Titanium–Zirconium–Molybdenum (Abbreviated as TZM) alloy using Ti–28Ni (wt%) eutectic brazing alloy was successfully achieved in this study. Reliable TZM brazed joints were obtained at the temperatures ranging from 1000 °C to 1160 °C for 600 s. The interfacial microstructure of TZM joints was characterized by employing SEM, EDS and XRD. The effects of brazing temperature on interfacial microstructure and joining properties were investigated in details. TZM brazed joints mainly consisted of δ-Ti{sub 2}Ni phase and Ti-based solid solution (Ti(s,s)). The interfacial microstructure of TZM joints was influenced obviously by brazing temperature. Both the thickness of brazing seam and the amount of δ-Ti{sub 2}Ni phase was reduced with the increasing brazing temperature, while the Ti(s,s) layer did not change significantly. The maximum average shear strength of TZM joints reached 107 MPa when brazed at 1080 °C. The presence of δ-Ti{sub 2}Ni intermetallic phase and crack-like structure in joints deteriorated the joining properties, which resulted in the formation of brittle fracture after shear test. In addition, fracture locations were related to the brazing temperature. When the brazing temperature was relatively low, cracks initiated and propagated in the continuous δ-Ti{sub 2}Ni layer. However, the fracture locations preferred to locating at the interface between TZM substrate and brazing seam when brazing temperature exceeded 1080 °C.

  10. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

    International Nuclear Information System (INIS)

    Sujan, G.K.; Haseeb, A.S.M.A.; Afifi, A.B.M.

    2014-01-01

    Lead free solders currently in use are prone to develop thick interfacial intermetallic compound layers with rough morphology which are detrimental to the long term solder joint reliability. A novel method has been developed to control the morphology and growth of intermetallic compound layers between lead-free Sn–3.0Ag–0.5Cu solder ball and copper substrate by doping a water soluble flux with metallic nanoparticles. Four types of metallic nanoparticles (nickel, cobalt, molybdenum and titanium) were used to investigate their effects on the wetting behavior and interfacial microstructural evaluations after reflow. Nanoparticles were dispersed manually with a water soluble flux and the resulting nanoparticle doped flux was placed on copper substrate. Lead-free Sn–3.0Ag–0.5Cu solder balls of diameter 0.45 mm were placed on top of the flux and were reflowed at a peak temperature of 240 °C for 45 s. Angle of contact, wetting area and interfacial microstructure were studied by optical microscopy, field emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. It was observed that the angle of contact increased and wetting area decreased with the addition of cobalt, molybdenum and titanium nanoparticles to flux. On the other hand, wettability improved with the addition of nickel nanoparticles. Cross-sectional micrographs revealed that both nickel and cobalt nanoparticle doping transformed the morphology of Cu 6 Sn 5 from a typical scallop type to a planer one and reduced the intermetallic compound thickness under optimum condition. These effects were suggested to be related to in-situ interfacial alloying at the interface during reflow. The minimum amount of nanoparticles required to produce the planer morphology was found to be 0.1 wt.% for both nickel and cobalt. Molybdenum and titanium nanoparticles neither appear to undergo alloying during reflow nor have any influence at the solder/substrate interfacial reaction. Thus, doping of flux

  11. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sujan, G.K., E-mail: sgkumer@gmail.com; Haseeb, A.S.M.A., E-mail: haseeb@um.edu.my; Afifi, A.B.M., E-mail: amalina@um.edu.my

    2014-11-15

    Lead free solders currently in use are prone to develop thick interfacial intermetallic compound layers with rough morphology which are detrimental to the long term solder joint reliability. A novel method has been developed to control the morphology and growth of intermetallic compound layers between lead-free Sn–3.0Ag–0.5Cu solder ball and copper substrate by doping a water soluble flux with metallic nanoparticles. Four types of metallic nanoparticles (nickel, cobalt, molybdenum and titanium) were used to investigate their effects on the wetting behavior and interfacial microstructural evaluations after reflow. Nanoparticles were dispersed manually with a water soluble flux and the resulting nanoparticle doped flux was placed on copper substrate. Lead-free Sn–3.0Ag–0.5Cu solder balls of diameter 0.45 mm were placed on top of the flux and were reflowed at a peak temperature of 240 °C for 45 s. Angle of contact, wetting area and interfacial microstructure were studied by optical microscopy, field emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. It was observed that the angle of contact increased and wetting area decreased with the addition of cobalt, molybdenum and titanium nanoparticles to flux. On the other hand, wettability improved with the addition of nickel nanoparticles. Cross-sectional micrographs revealed that both nickel and cobalt nanoparticle doping transformed the morphology of Cu{sub 6}Sn{sub 5} from a typical scallop type to a planer one and reduced the intermetallic compound thickness under optimum condition. These effects were suggested to be related to in-situ interfacial alloying at the interface during reflow. The minimum amount of nanoparticles required to produce the planer morphology was found to be 0.1 wt.% for both nickel and cobalt. Molybdenum and titanium nanoparticles neither appear to undergo alloying during reflow nor have any influence at the solder/substrate interfacial reaction. Thus, doping

  12. Microstructure and mechanical properties of resistance spot welded dissimilar thickness DP780/DP600 dual-phase steel joints

    International Nuclear Information System (INIS)

    Zhang, Hongqiang; Wei, Ajuan; Qiu, Xiaoming; Chen, Jianhe

    2014-01-01

    Highlights: • We examine changes of microstructure of dissimilar thickness DP600/DP780 joints. • The hardness profile of RSW joints can be predicted by the equation. • Failure modes, peak load and energy describes the mechanical properties of joints. • The nugget diameter is the key factor of transition between the failure modes. - Abstract: In this study, resistance spot welding (RSW) experiments were performed in order to evaluate the microstructure and mechanical properties of single-lap joints between DP780 and DP600. The results show that the weld joints consist of three regions including base metal (BM), heat affected zone (HAZ) and fusion zone (FZ). The grain size and martensite volume fractions increase in the order of BM, HAZ and FZ. The hardness in the FZ is significantly higher than hardness of base metals. Tensile properties of the joints were described in terms of the failure modes and static load-carrying capabilities. Two distinct failure modes were observed during the tensile shear test of the joints: interfacial failure (IF) and pullout failure (PF). The FZ size plays a dominate role in failure modes of the joints

  13. Microstructures and mechanical properties of friction stir welded dissimilar steel-copper joints

    Energy Technology Data Exchange (ETDEWEB)

    Jafari, M.; Abbasi, M.; Poursina, D.; Gheysarian, A. [University of Kashan, Kashan (Iran, Islamic Republic of); Bagheri, B. [Amirkabir University of Technology, Tehran (Iran, Islamic Republic of)

    2017-03-15

    Welding dissimilar metals by fusion welding is challenging. It results in welding defects. Friction stir welding (FSW) as a solid-state joining method can overcome these problems. In this study, 304L stainless steel was joined to copper by FSW. The optimal values of the welding parameters traverse speed, rotational speed, and tilt angle were obtained through Response surface methodology (RSM). Under optimal welding conditions, the effects of welding pass number on the microstructures and mechanical properties of the welded joints were investigated. Results indicated that appropriate values of FSW parameters could be obtained by RSM and grain size refinement during FSW mainly affected the hardness in the weld regions. Furthermore, the heat from the FSW tool increased the grain size in the Heat-affected zones (HAZs), especially on the copper side. Therefore, the strength and ductility decreased as the welding pass number increased because of grain size enhancement in the HAZs as the welding pass number increased.

  14. Properties and Microstructure of Laser Welded VM12-SHC Steel Pipes Joints

    Directory of Open Access Journals (Sweden)

    Skrzypczyk A.

    2016-06-01

    Full Text Available Paper presents results of microstructure and tests of welded joints of new generation VM12-SHC martensitic steel using high power CO2 laser (LBW method with bifocal welding head. VM12-SHC is dedicated to energetic installation material, designed to replace currently used. High content of chromium and others alloying elements improve its resistance and strength characteristic. Use of VM12-SHC steel for production of the superheaters, heating chambers and walls in steam boilers resulted in various weldability researches. In article are presented results of destructive and non-destructive tests. For destructive: static bending and Vickers hardness tests, and for non-destructive: VT, RT, UT, micro and macroscopic tests were performed.

  15. Optimal parameters determination of the orbital weld technique using microstructural and chemical properties of welded joint

    International Nuclear Information System (INIS)

    Miranda, A.; Echevarria, J.F.; Rondon, S.; Leiva, P.; Sendoya, F.A.; Amalfi, J.; Lopez, M.; Dominguez, H.

    1999-01-01

    The paper deals with the study of the main parameters of thermal cycle in Orbital Automatic Weld, as a particular process of the GTAW Weld technique. Also is concerned with the investigation of microstructural and mechanical properties of welded joints made with Orbital Technique in SA 210 Steel, a particular alloy widely use during the construction of Economizers of Power Plants. A number of PC software were used in this sense in order to anticipate the main mechanical and structural characteristics of Weld metal and the Heat Affected Zone (HAZ). The papers also might be of great value during selection of optimal Weld parameters to produce sound and high quality Welds during the construction / assembling of structural components in high requirements industrial sectors and also to make a reliable prediction of weld properties

  16. Creep properties and microstructure evaluation of weld joint of the pipe made of P92 steel

    Energy Technology Data Exchange (ETDEWEB)

    Kasl, Josef; Jandova, Dagmar; Chvostova, Eva [SKODA VYZKUM s.r.o., Plzen (Czech Republic); Folkova, Eva [SKODA POWER a.s., Plzen (Czech Republic)

    2010-07-01

    One-side weld joint of W type was prepared from P92 type steel using GTAW and SMAW method. Creep test to the rupture of smooth cross-weld samples has been carried out at temperatures ranging from 575 to 650 C and at stresses from 70 to 240 MPa. Fractographic analysis, hardness measurement and detailed study of submicrostructure have been performed using light, scanning and transmission electron microscopy. Changes of microstructure were correlated with the creep strength. Increase in size of secondary phases and cavities formation were evident after creep tests at temperatures above 575 C. Voids were concentrated in the fine prior austenite grain heat affected zones, where fracture occurred. In addition, a sporadic occurrence of individual cavities was found out in the base material and the weld metal after tests at 625 and 650 C. During creep exposures at temperatures above 600 C Laves phase precipitated. (orig.)

  17. Influence of microstructure and elemental partitioning on pitting corrosion resistance of duplex stainless steel welding joints

    Science.gov (United States)

    Zhang, Zhiqiang; Jing, Hongyang; Xu, Lianyong; Han, Yongdian; Zhao, Lei; Zhang, Jianli

    2017-02-01

    The influences of microstructure and elemental partitioning on pitting corrosion resistance of duplex stainless steel joints welded by gas tungsten arc welding (GTAW) and flux-cored arc welding (FCAW) with different shielding gas compositions were studied by optical microscopy, electron backscatter diffraction, scanning electron microscopy, transmission electron microscopy, energy dispersive spectroscopy, electron probe microanalysis, and potentiostatic and potentiodynamic polarization methods The adding 2% N2 in shielding gas facilitated primary austenite formation in GTAW weld metal (WM) and suppressed Cr2N precipitation in GTAW weld root. In the HAZ, the banded microstructure disappeared while the coarse ferrite grains maintained same orientation as the banded ferrite in the BM. In the WM, the ferrite had one single orientation throughout a grain, whereas several families of austenite appeared. The austenite both in BM and WM enriched in Ni and nitro`gen, while Cr and Mo were concentrated in the ferrite and thus no element showed clear dendritic distribution in the WM (ER2209 and E2209T1). In addition, the secondary austenite had higher Ni content but lower Cr and Mo content than the primary austenite. The N2-supplemented shielding gas promoted nitrogen solid-solution in the primary and secondary austenite. Furthermore, the secondary austenite had relatively lower pitting resistance equivalent number (PREN) than the ferrite and primary austenite, thereby resulting in its preferential corrosion. The Cr2N precipitation led to relatively poor resistance to pitting corrosion in three HAZs and pure Ar shielding GTAW weld root. The N2-supplemented shielding gas improved pitting corrosion resistance of GTAW joint by increasing PREN of secondary austenite and suppressing Cr2N precipitation. In addition, the FCAW WM had much poorer resistance to pitting corrosion than the GTAW WM due to many O-Ti-Si-Mn inclusions. In the BM, since the austenite with lower PREN compared

  18. Microstructure and mechanical properties of GTAW welded joints of AA6105 aluminum alloy

    Directory of Open Access Journals (Sweden)

    Minerva Dorta-Almenara

    2016-09-01

    Full Text Available Gas Tungsten Arc Welding (GTAW is one of the most used methods to weld aluminum. This work investigates the influence of welding parameters on the microstructure and mechanical properties of GTAW welded AA6105 aluminum alloy joints. AA6105 alloy plates with different percent values of cold work were joined by GTAW, using various combinations of welding current and speed. The fusion zone, in which the effects of cold work have disappeared, and the heat affected zone of the welded samples were examined under optical and scanning electron microscopes, additionally, mechanical tests and measures of Vickers microhardness were performed. Results showed dendritic morphology with solute micro- and macrosegregation in the fusion zone, which is favored by the constitutional supercooling when heat input increases. When heat input increased and welding speed increased or remained constant, greater segregation was obtained, whereas welding speed decrease produced a coarser microstructure. In the heat affected zone recrystallization, dissolution, and coarsening of precipitates occurred, which led to variations in hardness and strength.

  19. Microstructure and mechanical characteristics of a laser welded joint in SA508 nuclear pressure vessel steel

    Energy Technology Data Exchange (ETDEWEB)

    Guo, Wei, E-mail: wei.guo-2@manchester.ac.uk [Laser Processing Research Centre, School of Mechanical, Aerospace and Civil Engineering, University of Manchester, Sackville Street, Manchester, M13 9 PL (United Kingdom); Dong, Shiyun [Laser Processing Research Centre, School of Mechanical, Aerospace and Civil Engineering, University of Manchester, Sackville Street, Manchester, M13 9 PL (United Kingdom); Institute of Laser Engineering, Beijing University of Technology, Beijing 100124 (China); Guo, Wei; Francis, John A.; Li, Lin [Laser Processing Research Centre, School of Mechanical, Aerospace and Civil Engineering, University of Manchester, Sackville Street, Manchester, M13 9 PL (United Kingdom)

    2015-02-11

    SA508 steels are typically used in civil nuclear reactors for critical components such as the reactor pressure vessel. Nuclear components are commonly joined using arc welding processes, but with design lives for prospective new build projects exceeding 60 years, new welding technologies are being sought. In this exploratory study, for the first time, autogenous laser welding was carried out on 6 mm thick SA508 Cl.3 steel sheets using a 16 kW fiber laser system operating at a power of 4 kW. The microstructure and mechanical properties (including microhardness, tensile strength, elongation, and Charpy impact toughness) were characterized and the microstructures were compared with those produced through arc welding. A three-dimensional transient model based on a moving volumetric heat source model was also developed to simulate the laser welding thermal cycles in order to estimate the cooling rates included by the process. Preliminary results suggest that the laser welding process can produce welds that are free of macroscopic defects, while the strength and toughness of the laser welded joint in this study matched the values that were obtained for the parent material in the as-welded condition.

  20. Modelling of microstructural creep damage in welded joints of 316L stainless steel

    International Nuclear Information System (INIS)

    Bouche, G.

    2000-01-01

    Welded joints of 316L stainless steel under service conditions at elevated temperature are known to be preferential sites of creep damage, as compared to the base material. This damage results in the formation of cavities and the development of creep cracks which can lead to a premature failure of welded components. The complex two-phase microstructure of 316L welds was simulated by manually filling a mould with longitudinal deposited weld beads. The moulded material was then aged during 2000 hours at 600 deg. C. High resolution Scanning Electron Microscopy was largely used to examine the microstructure of the simulated material before and after ageing. Smooth and notched creep specimens were cut from the mould and tested at 600 deg. C under various stress levels. A comparison of the lifetime versus nominal stress curves for the base and welded materials shows a greater dependence of the welded material to creep phenomena. Observation and EBSD analysis show that damage is preferentially located along the austenite grain boundaries. The stress and strain fields in the notched specimens were calculated by finite element method. A correlation of this field to the observed damage was made in order to propose a predictive law relating the creep damage to the mechanical conditions applied locally. Further mechanical tests and simulation on CT specimens and mode II tubular specimens allowed validating the model under various multiaxial loading conditions. (author)

  1. Development of a soft-soldering system for aluminum

    Science.gov (United States)

    Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

    1983-03-01

    The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

  2. Microstructure and mechanical properties of resistance-spot-welded joints for A5052 aluminum alloy and DP 600 steel

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Jianbin [College of Automotive Collaborative Innovation Center, Chongqing University, No. 174, Shazheng Street, Shapingba District, Chongqing 400044 (China); Yuan, Xinjian, E-mail: xinjianyuan@yahoo.com [College of Materials Science and Engineering, Chongqing University, No. 174, Shazheng Street, Shapingba District, Chongqing 400044 (China); Hu, Zhan; Sun, Changzheng; Zhang, Yanxin; Zhang, Yuxuan [College of Materials Science and Engineering, Chongqing University, No. 174, Shazheng Street, Shapingba District, Chongqing 400044 (China)

    2016-10-15

    The microstructure and mechanical properties of resistance-spot-welded A5052 aluminum alloy and DP 600 dual-phase steel joint were studied. The fusion zone (FZ) and heat-affected zone (HAZ) of DP 600 exhibited lath martensite and ferrite-martensite structures, respectively. The microstructure of FZ and HAZ in the A5052 side was composed of cellular crystals and the boundary region of FZ exhibited a columnar crystal morphology. A Fe{sub 2}Al{sub 5} intermetallic compound (IMC) layer with 3.3 μm thickness was found adjacent to the DP 600 side, whereas a needle-shaped Fe{sub 4}Al{sub 13} IMC layer with length of 0.67 μm to 15.8 μm was found adjacent to the aluminum alloy side. The maximum tensile shear load of the A5052/DP 600 joint was 5.5 KN, with a corresponding molten nugget diameter of 6.3 mm. The fracture morphology of the optimized A5052/DP 600 joint was mainly an elongated dimple fracture accompanied by cleavage fracture. - Highlights: •A5052 and DP 600 with large gaps in properties were investigated by RSW. •The microstructures of RSW joints in DP 600/A5052 were examined detailedly. •The micro/macro-characteristics and strength relations of joints were analyzed.

  3. Microstructure investigation of bronze/steel brazed joints proposed for HHF components of ITER manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Kalinin, G.M. [Research and Development Institute of Power Engineering, P.O. Box 788, Moscow 101000 (Russian Federation)], E-mail: gmk@nikiet.ru; Krestnikov, N.S. [Research and Development Institute of Power Engineering, P.O. Box 788, Moscow 101000 (Russian Federation); Jarovinskiy, Yu.L.; Makhin, I.D.; Nikolaev, V.V. [Rocket and Space Corporation ' Energia' , Korolev, Lenina Street 4-a, Moscow 141070 (Russian Federation); Skladnov, K.S.; Strebkov, Yu.S.; Zolotarev, V.B. [Research and Development Institute of Power Engineering, P.O. Box 788, Moscow 101000 (Russian Federation)

    2008-12-15

    Brazing is considered as one of the perspective option of high heat flux components of ITER manufacturing. CuCrZr bronze, austenitic steel AISI 321-type and PM-17-type (Ni-Mn-Fe-Si-Sn-B alloy) brazed material were used for the development of brazing technology. Two type of brazing have been studied within the framework of recent investigation: - Hot isostatic pressing (HIP)-assisted brazing. - Furnace-assisted brazing (with uniaxial compression loading). For the hydrostatic pressing (HIP) the brazed components were pressed out for about 175 MPa during 2.5 h at the temperature 1035-1040 deg. C. For the furnace-assisted brazing all components were inserted into the sealed can, vacuumed and heated up to brazing temperature {approx}950 deg. C. Fast cooling and ageing heat treatment (500 deg. C and 4 h) were applied to provide high strength of CuCrZr bronze. Microsections of specimens cut from the joints were studied by optical microscopy and by scanning electron microscopy (SEM). The microstructure, distribution of alloying elements of base metals and of brazed material components were studied in the joints. Results of these studies are discussed in this paper. The data shows that there is a potential for using more simple and cheap (in comparison with common HIP) technologies of bronze to steel joining with satisfactory quality.

  4. The microstructure of aluminum A5083 butt joint by friction stir welding

    International Nuclear Information System (INIS)

    Jasri, M. A. H. M.; Afendi, M.; Ismail, A.; Ishak, M.

    2015-01-01

    This study presents the microstructure of the aluminum A5083 butt joint surface after it has been joined by friction stir welding (FSW) process. The FSW process is a unique welding method because it will not change the chemical properties of the welded metals. In this study, MILKO 37 milling machine was modified to run FSW process on 4 mm plate of aluminum A5083 butt joint. For the experiment, variables of travel speed and tool rotational speed based on capability of machine were used to run FSW process. The concentrated heat from the tool to the aluminum plate changes the plate form from solid to plastic state. Two aluminum plates is merged to become one plate during plastic state and return to solid when concentrated heat is gradually further away. After that, the surface and cross section of the welded aluminum were investigated with a microscope by 400 x multiplication zoom. The welding defect in the FSW aluminum was identified. Then, the result was compared to the American Welding Society (AWS) FSW standard to decide whether the plate can be accepted or rejected

  5. The microstructure of aluminum A5083 butt joint by friction stir welding

    Energy Technology Data Exchange (ETDEWEB)

    Jasri, M. A. H. M.; Afendi, M. [School of Mechatronic Engineering, Universiti Malaysia Perlis, Pauh, 02600, Arau, Perlis (Malaysia); Ismail, A. [UniKL MIMET, JalanPantaiRemis, 32200, Lumut, Perak (Malaysia); Ishak, M. [Faculty of Mechanical Engineering, Universiti Malaysia Pahang, 02600, Pekan, Pahang (Malaysia)

    2015-05-15

    This study presents the microstructure of the aluminum A5083 butt joint surface after it has been joined by friction stir welding (FSW) process. The FSW process is a unique welding method because it will not change the chemical properties of the welded metals. In this study, MILKO 37 milling machine was modified to run FSW process on 4 mm plate of aluminum A5083 butt joint. For the experiment, variables of travel speed and tool rotational speed based on capability of machine were used to run FSW process. The concentrated heat from the tool to the aluminum plate changes the plate form from solid to plastic state. Two aluminum plates is merged to become one plate during plastic state and return to solid when concentrated heat is gradually further away. After that, the surface and cross section of the welded aluminum were investigated with a microscope by 400 x multiplication zoom. The welding defect in the FSW aluminum was identified. Then, the result was compared to the American Welding Society (AWS) FSW standard to decide whether the plate can be accepted or rejected.

  6. Microstructural and mechanical behaviors of nano-SiC-reinforced AA7075-O FSW joints prepared through two passes

    Energy Technology Data Exchange (ETDEWEB)

    Bahrami, Mohsen, E-mail: Mohsen.bahrami@aut.ac.ir [Faculty of Mining and Materials Engineering, Amirkabir University of Technology (AUT), Hafez Aveenue, Tehran (Iran, Islamic Republic of); Farahmand Nikoo, Mohsen [Faculty of Mining and Materials Engineering, Amirkabir University of Technology (AUT), Hafez Aveenue, Tehran (Iran, Islamic Republic of); Besharati Givi, Mohammad Kazem [Department of Mechanical Engineering, University of Tehran, Tehran (Iran, Islamic Republic of)

    2015-02-25

    In this paper, a threaded tapered pin tool was employed to fabricate a 2-pass friction stir welded (FSWed) joint. To investigate the benefits of nano-sized SiC particles on microstructural and mechanical properties of the joint, the experiment was repeated while SiC particles had been inserted along the joint line. In another joint, a square pin tool was applied in the second pass to evaluate the effectiveness of switching pin geometry between passes on the aforementioned properties. Microstructural features including grain size, second phase particles and reinforcement distribution were examined via optical and scanning electron microscopy (SEM) techniques. In addition to satisfactory connections between SiC particles and the matrix, the most homogenous particles distribution was observed in the specimen FSWed with both pin tools. This observation was further supported by atomic force microscopy (AFM) examination. Additionally, the foregoing joint demonstrated the maximum tensile strength which was synonymous with its smallest grain size. During tensile testing, SiC-free joint and SiC-reinforced ones fractured from stir zone (SZ) and base metal, respectively. Moreover, SiC-free joint showed necking phenomenon. SEM results showed that the SiC-reinforced specimens possessed ductile fracture morphologies. On the other hand, SiC-free specimen showed a quasi-cleavage fracture mode confirming its moderate percent elongation. In the meantime, SiC-reinforced specimens exhibited superior hardness level to SiC-free specimen.

  7. Microstructure and Mechanical Property of 3003 Aluminum Alloy Joint Brazed with Al-Si-Cu-Zn Filler Metal

    Directory of Open Access Journals (Sweden)

    LI Xiao-qiang

    2016-09-01

    Full Text Available Al-Si-Cu-Zn filler metal was developed to braze 3003 aluminum alloy. The microstructure and fracture surface of the joint were analyzed by XRD, SEM and EDS, and the effects of brazing temperature on microstructure and property of the joint were investigated. The results show that good joints are obtained at brazing temperature of 540-580℃ for 10min. The brazed joint consists of α(Al solid solution, θ(Al2Cu intermetallic compound, fine silicon phase and AlCuFeMn+Si phase in the central zone of brazed seam, and α(Al solid solution and element diffusion layers at both the sides of brazed seam, and the base metal. The room temperature (RT shear fracture of the joint occurs at the interface between the teeth shape α(Al in the diffusion layer and the center zone of brazed seam, which is mainly characterized as brittle cleavage. As the brazing temperature increases, α(Al solid solution crystals in the diffusion zone grow up, and the interfacial bonding of the joint is in the form of interdigitation. Brazing at 560℃ for 10min, the RT shear strength of the joint reaches the maximum value of 92.3MPa, which is about 62.7% of the base material.

  8. The Microstructure and Gamma Prime Distributions in Inertia Friction Welded Joint of P/M Superalloy FGH96

    Science.gov (United States)

    Zhang, Chi; Shen, Wenfei; Zhang, Liwen; Xia, Yingnan; Li, Ruiqin

    2017-04-01

    A gamma prime ( γ') precipitation ( 35% in volume)-hardened powder metallurgy (P/M) superalloy FGH96 was welded using inertia friction welding (IFW). The microstructure and γ' distributions in the joints in two conditions, hot isostatic pressed state and solution-treated and aged state, were characterized. The recrystallization of grains, the dissolution and re-precipitation of γ' in the joints were discussed in terms of the temperature evolutions which were calculated by finite element model analysis. Regardless of the initial states, fully recrystallized fine grain structure formed at welded zone. Meanwhile, very fine γ' precipitations were re-precipitated at the welded zone. These recrystallized grain structure and fine re-precipitated γ' resulted in increasing hardness of IFW joint while making the hardness dependent on the microstructure and γ' precipitation.

  9. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Science.gov (United States)

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  10. Microstructure and interfacial behaviour of Alumina/Inconel 600 joints prepared by brazing route

    International Nuclear Information System (INIS)

    Laik, A.; Mishra, P.; Bhanumurthy, K.; Kashyap, B.P.

    2010-01-01

    Joining of metals to ceramics remains a technological challenge due to the wide difference in the physical and mechanical properties of the two classes of materials. Attempt was made to produce leak tight joints between Inconel-600 and alumina using the brazing route with Au-Ni brazing alloy. Alumina tubes were metallised following the Mo-Mn route and then coated with Ni. The metallised alumina tubes were brazed to Inconel-600 ferrules using Au-18%Ni brazing alloy under vacuum, at optimised process parameters. In order to study the effect of prolong annealing on the microstructural stability and the micro-chemistry of the brazing zone, brazed joints were subjected to prolong annealing at 400 deg C and 560 deg C for 8000 hrs each. Detailed analysis of the interfacial structure of the brazing zones was done using an electron probe microanalyser (EPMA). X-ray maps of the elements Fe, Ni, Cr, Al, Au, Mo and Mn along with BSE images of the brazing zone are given. These X-ray maps precisely reveal the micro-chemistry of the brazing zones. The various phases formed were identified. The distribution of the various elements across the interfaces was also obtained, which helps to reveal the chemical behaviour of the individual elements during the process of brazing. Two phases appear very distinctly in the brazement, one is rich in Au and the other is rich in Ni. Depending upon their affinity, rest of the elements shows a partitioning in these two phases. While Fe, Cr and Mo get dissolved in the Ni-rich phase, Mn seems to partition in the Au-rich phase. The microstructure and the X-ray maps of the couple annealed at 400 deg C shows that the spatial variation in the composition throughout the brazing zone gets homogenised due to diffusion at high temperatures. This effect is even more pronounced on annealing at 560 deg C. Moreover, the transport of Cr from the Inconel side to the surface of alumina is very evident. On annealing at 560 deg C, a region rich in Cr, was found to

  11. Influence of microstructure and elemental partitioning on pitting corrosion resistance of duplex stainless steel welding joints

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Zhiqiang; Jing, Hongyang [School of Materials Science and Engineering, Tianjin University, Tianjin 300350 (China); Tianjin Key Laboratory of Advanced Joining Technology, Tianjin 300350 (China); Xu, Lianyong, E-mail: xulianyong@tju.edu.cn [School of Materials Science and Engineering, Tianjin University, Tianjin 300350 (China); Tianjin Key Laboratory of Advanced Joining Technology, Tianjin 300350 (China); Han, Yongdian; Zhao, Lei [School of Materials Science and Engineering, Tianjin University, Tianjin 300350 (China); Tianjin Key Laboratory of Advanced Joining Technology, Tianjin 300350 (China); Zhang, Jianli [Welding laboratory, Offshore Oil Engineering (Qing Dao) Company, Qing Dao 266520 (China)

    2017-02-01

    Highlights: • N{sub 2}-supplemented shielding gas promoted nitrogen solid-solution in the austenite. • Secondary austenite had higher Ni but lower Cr and Mo than primary austenite. • Pitting corrosion preferentially occurred at secondary austenite and Cr{sub 2}N. • Adding N{sub 2} in shielding gas improved pitting corrosion resistance of GTAW joint. • E2209T{sub 1} weld metal had very poor pitting corrosion resistance due to inclusions. - Abstract: The influences of microstructure and elemental partitioning on pitting corrosion resistance of duplex stainless steel joints welded by gas tungsten arc welding (GTAW) and flux-cored arc welding (FCAW) with different shielding gas compositions were studied by optical microscopy, electron backscatter diffraction, scanning electron microscopy, transmission electron microscopy, energy dispersive spectroscopy, electron probe microanalysis, and potentiostatic and potentiodynamic polarization methods The adding 2% N{sub 2} in shielding gas facilitated primary austenite formation in GTAW weld metal (WM) and suppressed Cr{sub 2}N precipitation in GTAW weld root. In the HAZ, the banded microstructure disappeared while the coarse ferrite grains maintained same orientation as the banded ferrite in the BM. In the WM, the ferrite had one single orientation throughout a grain, whereas several families of austenite appeared. The austenite both in BM and WM enriched in Ni and nitrogen, while Cr and Mo were concentrated in the ferrite and thus no element showed clear dendritic distribution in the WM (ER2209 and E2209T{sub 1}). In addition, the secondary austenite had higher Ni content but lower Cr and Mo content than the primary austenite. The N{sub 2}-supplemented shielding gas promoted nitrogen solid-solution in the primary and secondary austenite. Furthermore, the secondary austenite had relatively lower pitting resistance equivalent number (PREN) than the ferrite and primary austenite, thereby resulting in its preferential

  12. An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation

    Science.gov (United States)

    Chawla, N.; Shen, Y.-L.; Deng, X.; Ege, E. S.

    2004-12-01

    The lap-shear technique is commonly used to evaluate the shear, creep, and thermal fatigue behavior of solder joints. We have conducted a parametric experimental and modeling study, on the effect of testing and geometrical parameters on solder/copper joint response in lap-shear. It was shown that the farfield applied strain is quite different from the actual solder strain (measured optically). Subtraction of the deformation of the Cu substrate provides a reasonable approximation of the solder strain in the elastic regime, but not in the plastic regime. Solder joint thickness has a profound effect on joint response. The solder response moves progressively closer to “true” shear response with increasing joint thickness. Numerical modeling using finite-element analyses were performed to rationalize the experimental findings. The same lap-shear configuration was used in the simulation. The input response for solder was based on the experimental tensile test result on bulk specimens. The calculated shear response, using both the commonly adopted far-field measure and the actual shear strain in solder, was found to be consistent with the trends observed in the lap-shear experiments. The geometric features were further explored to provide physical insight into the problem. Deformation of the substrate was found to greatly influence the shear behavior of the solder.

  13. Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

    Science.gov (United States)

    Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

    2004-04-01

    Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

  14. Study on microstructure and mechanical properties of Al–Mg–Mn–Er alloy joints welded by TIG and laser beam

    International Nuclear Information System (INIS)

    Yang, Dongxia; Li, Xiaoyan; He, Dingyong; Huang, Hui; Zhang, Liang

    2012-01-01

    Highlights: ► The microstructural characterization of the TIG and laser welded Al–Mg–Mn–Er alloy is studied. ► Transition zone and HAZ are found to disappear near the fusion boundaries in LBW joint. ► Primary Al 3 Er in LBW weld provides more nucleation sites and lead to the grain refinement. ► The evaporation of alloying element Mg in TIG and LBW joints is investigated. ► Reasons for high strength of LBW joint are fine-grain strengthening and solution strengthening. -- Abstract: Al-4.7Mg-0.7Mn-0.3Er alloy plates were welded by laser beam welding (LBW) and tungsten inert gas (TIG). Mechanical properties and microstructures of both welded joints were analyzed. The results showed that the tensile strength of LBW joint was 315 MPa, which was approximately 10% higher than that of TIG welded joint. This was attributed to the fine grains, dispersed primary Al 3 Er phase and low Mg evaporation in LBW weld. Equiaxed grains with average size of 30 μm were obtained in the fusion zone, which were much smaller than that of 90 μm in the fusion zone of TIG joint, due to the low heat input during LBW process. Moreover, finer primary Al 3 Er particles were uniformly distributed in the LBW joints, which resulted in a substantial increase of nucleation rate in LBW welds. In addition, it was also found that Mg concentrations in the fusion zones, in both TIG and LBW joints, were lower than that of the base one tested by EPMA. The burning loss rates of Mg in TIG and LBW joints were 36% and 22%, respectively.

  15. The Optimization of Process Parameters and Microstructural Characterization of Fiber Laser Welded Dissimilar HSLA and MART Steel Joints

    Directory of Open Access Journals (Sweden)

    Celalettin Yuce

    2016-10-01

    Full Text Available Nowadays, environmental impact, safety and fuel efficiency are fundamental issues for the automotive industry. These objectives are met by using a combination of different types of steels in the auto bodies. Therefore, it is important to have an understanding of how dissimilar materials behave when they are welded. This paper presents the process parameters’ optimization procedure of fiber laser welded dissimilar high strength low alloy (HSLA and martensitic steel (MART steel using a Taguchi approach. The influence of laser power, welding speed and focal position on the mechanical and microstructural properties of the joints was determined. The optimum parameters for the maximum tensile load-minimum heat input were predicted, and the individual significance of parameters on the response was evaluated by ANOVA results. The optimum levels of the process parameters were defined. Furthermore, microstructural examination and microhardness measurements of the selected welds were conducted. The samples of the dissimilar joints showed a remarkable microstructural change from nearly fully martensitic in the weld bead to the unchanged microstructure in the base metals. The heat affected zone (HAZ region of joints was divided into five subzones. The fusion zone resulted in an important hardness increase, but the formation of a soft zone in the HAZ region.

  16. Microstructure and mechanical properties of similar and dissimilar joints of aluminium alloy and pure copper by friction stir welding

    Directory of Open Access Journals (Sweden)

    V.C. Sinha

    2016-09-01

    Full Text Available In the present study, the microstructure and mechanical properties of similar and dissimilar friction stir welded joints of aluminium alloy (AlA and pure copper (Cu were evaluated at variable tool rotational speeds from 150 to 900 rpm in steps of 150 rpm at 60 mm/min travel speed and constant tilt angle 2°. The interfacial microstructures of the joints were characterised by optical and scanning electron microscopy. The Al4Cu9, AlCu, Al2Cu and Al2Cu3 intermetallic compounds have been observed at the interface and stir zone region of dissimilar Al/Cu FSWed joints. Variation in the grain size was observed in the stir zone depending upon the heat input value. Axial force, traverse force and torque value were analysed with variation in tool rotational speed. Residual stresses were measured at the stir zone by X-ray diffraction technique. Maximum ultimate tensile strength of ∼75% of AlA strength for AlA–AlA joints has been obtained at 750 rpm and for Cu–Cu joint tensile strength of ∼100% of tensile strength of Cu was obtained at 300 rpm. However, for Cu–AlA joint when processed at 600 rpm tool rotational speed achieved maximum ultimate tensile strength of ∼77% of AlA.

  17. Creep of Two-Phase Microstructures for Microelectronic Applications

    Energy Technology Data Exchange (ETDEWEB)

    Reynolds, Heidi Linch [Univ. of California, Berkeley, CA (United States)

    1998-12-01

    The mechanical properties of low-melting temperature alloys are highly influenced by their creep behavior. This study investigates the dominant mechanisms that control creep behavior of two-phase, low-melting temperature alloys as a function of microstructure. The alloy systems selected for study were In-Ag and Sn-Bi because their eutectic compositions represent distinctly different microstructure.” The In-Ag eutectic contains a discontinuous phase while the Sn-Bi eutectic consists of two continuous phases. In addition, this work generates useful engineering data on Pb-free alloys with a joint specimen geometry that simulates microstructure found in microelectronic applications. The use of joint test specimens allows for observations regarding the practical attainability of superplastic microstructure in real solder joints by varying the cooling rate. Steady-state creep properties of In-Ag eutectic, Sn-Bi eutectic, Sn-xBi solid-solution and pure Bi joints have been measured using constant load tests at temperatures ranging from O°C to 90°C. Constitutive equations are derived to describe the steady-state creep behavior for In-Ageutectic solder joints and Sn-xBi solid-solution joints. The data are well represented by an equation of the form proposed by Dom: a power-law equation applies to each independent creep mechanism. Rate-controlling creep mechanisms, as a function of applied shear stress, test temperature, and joint microstructure, are discussed. Literature data on the steady-state creep properties of Sn-Bi eutectic are reviewed and compared with the Sn-xBi solid-solution and pure Bi joint data measured in the current study. The role of constituent phases in controlling eutectic creep behavior is discussed for both alloy systems. In general, for continuous, two-phase microstructure, where each phase exhibits significantly different creep behavior, the harder or more creep resistant phase will dominate the creep behavior in a lamellar microstructure. If a

  18. Improving contour accuracy and strength of reactive air brazed (RAB) ceramic/metal joints by controlling interface microstructure

    Energy Technology Data Exchange (ETDEWEB)

    Li, Chichi; Kuhn, Bernd; Brandenberg, Joerg; Beck, Tilmann; Singheiser, Lorenz [Forschungszentrum Juelich GmbH, Institute for Energy and Climate Research (IEK), Microstructure and Properties of Materials (IEK-2), 52425 Juelich (Germany); Bobzin, Kirsten; Bagcivan, Nazlim; Kopp, Nils [Surface Engineering Institute (IOT), RWTH Aachen University, Kackertstr. 15, 52072 Aachen (Germany)

    2012-06-15

    The development of high-temperature electrochemical devices such as solid oxide fuel cells, oxygen, and hydrogen separators and gas reformers poses a great challenge in brazing technology of metal/ceramic joints. To maintain the integrity of such equipment, the resulting seals have to be stable and hermetic during continuous and cyclic high temperature operation. As a solution for joining metal and ceramic materials, reactive air brazing has gained increasing interest in recent years. This paper compares joints brazed by different filler alloys: pure Ag, AgCu, and AgAl in three different aspects: contour accuracy, room temperature delamination resistance, and corresponding microstructures of the as-brazed and fractured brazed joints. Discussion focuses on fracture mechanism and associated delamination resistance. AgAl brazed joints exhibit the most promising mechanical properties and contour accuracy. (Copyright copyright 2012 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  19. Mechanical Properties and Microstructure of TIG and FSW Joints of a New Al-Mg-Mn-Sc-Zr Alloy

    Science.gov (United States)

    Xu, Guofu; Qian, Jian; Xiao, Dan; Deng, Ying; Lu, Liying; Yin, Zhimin

    2016-04-01

    A new Al-5.8%Mg-0.4%Mn-0.25%Sc-0.10%Zr (wt.%) alloy was successfully welded by tungsten inert gas (TIG) and friction stir welding (FSW) techniques, respectively. The mechanical properties and microstructure of the welded joints were investigated by microhardness measurements, tensile tests, and microscopy methods. The results show that the ultimate tensile strength, yield strength, and elongation to failure are 358, 234 MPa, and 27.6% for TIG welded joint, and 376, 245 MPa and 31.9% for FSW joint, respectively, showing high strength and superior ductility. The TIG welded joint fails in the heat-affected zone and the fracture of FSW joint is located in stirred zone. Al-Mg-Mn-Sc-Zr alloy is characterized by lots of dislocation tangles and secondary coherent Al3(Sc,Zr) particles. The superior mechanical properties of the TIG and FSW joints are mainly derived from the Orowan strengthening and grain boundary strengthening caused by secondary coherent Al3(Sc,Zr) nano-particles (20-40 nm). For new Al-Mg-Mn-Sc-Zr alloy, the positive effect from secondary Al3(Sc, Zr) particles in the base metal can be better preserved in FSW joint than in TIG welded joint.

  20. Macrostructural and microstructural features of 1 000 MPa grade TRIP steel joint by CO2 laser welding

    Institute of Scientific and Technical Information of China (English)

    Wang Wenquan; Sun Daqian; Kang Chungyun

    2008-01-01

    Bead-on-plate CO2 laser welding of 1 000 MPa grade transformation induced plasticity (TRIP) steel was conducted under different welding powers, welding speeds and shield gases. The macrostructural and microstructural features of the welded joint were investigated. The increase of welding speed reduced the width of the weld bead and the porosities in the weld bead resulting from the different flow mode of melted metal in weld pool. The decrease of welding power or use of shield gas of helium also contributed to the reduction of porosity in the weld bead due to the alleviation of induced plasma formation, thus stabilizing the keyhole. The porosity formation intimately correlated with the evaporation of alloy element Mn in the base metal. The laser welded metal had same martensite microstructure as that of water-quenched base metal. The welding parameters which increased cooling rate all led to fine microstructures of the weld bead.

  1. The Effect of Welding Energy on the Microstructural and Mechanical Properties of Ultrasonic-Welded Copper Joints

    Science.gov (United States)

    Yang, Jingwei; Cao, Biao; Lu, Qinghua

    2017-01-01

    The effects of welding energy on the mechanical and microstructural characteristics of ultrasonic-welded pure copper plates were investigated. Complex dynamic recrystallization and grain growth occurred inside the weld zone during ultrasonic welding. At a low welding energy, a thin band of straight weld interfaces was observed and had an ultra-fine grain structure. With an increase in welding energy, the weld interface progressively changed from flat to sinusoidal, and eventually turned into a convoluted wavy pattern, bearing similarities to shear instabilities, as observed in fluid dynamics. The lap shear load of the joints initially increased and then remained stable as the welding energy increased. The tensile characteristics of the joints significantly depended on the development of plastic deformation at the interface. The influence of the microstructure on the hardness was also discussed. PMID:28772553

  2. Ti–6Al–4V welded joints via electron beam welding: Microstructure, fatigue properties, and fracture behavior

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Xiaoguang [School of Energy and Power Engineering, Beihang University, Beijing 100191 (China); Co-Innovation Center for Advanced Aero-Engine, Beijing 100191 (China); Li, Shaolin [School of Energy and Power Engineering, Beihang University, Beijing 100191 (China); Qi, Hongyu, E-mail: qhy@buaa.edu.cn [School of Energy and Power Engineering, Beihang University, Beijing 100191 (China); Co-Innovation Center for Advanced Aero-Engine, Beijing 100191 (China)

    2014-03-01

    The effect of microstructural characteristics on the fatigue properties of electron beam-welded joints of forged Ti–6Al–4V and its fracture behavior were investigated. Tensile tests and fatigue tests were conducted at room temperature in air atmosphere. The test data were analyzed in relation to microstructure, high-cycle fatigue properties, low-cycle fatigue properties, and fatigue crack propagation properties. The high-cycle fatigue test results indicated that the fatigue strength of the joint welded via electron beam welding was higher than that of the base metal because the former had a high yield strength and all high-cycle fatigue specimens were fractured in the base metal. Although the joint specimens had a lower low-cycle fatigue life than the base metal, they mainly ruptured at the fusion zone of the joint specimen and their crack initiation mechanism is load-dependent. The fatigue crack propagation test results show that the joint had a slower crack propagation rate than the base metal, which can be attributed to the larger grain in the fusion zone.

  3. Effect of friction stir welding parameters on microstructure and mechanical properties of DSS–Cu joints

    Energy Technology Data Exchange (ETDEWEB)

    Shokri, V., E-mail: v.shokri@modares.ac.ir [Department of Mechanical Engineering, Tarbiat Modarres University, Tehran (Iran, Islamic Republic of); Sadeghi, A. [School of Mechanical Engineering, College of Engineering, University of Tehran, Tehran (Iran, Islamic Republic of); Sadeghi, M.H. [Department of Mechanical Engineering, Tarbiat Modarres University, Tehran (Iran, Islamic Republic of)

    2017-05-02

    Dissimilar joining of copper to duplex stainless steel (DSS) is challenging at high temperatures of fusion welding owing to the large difference in physical properties of the base metals. To reduce negative effects of welding at high temperatures, solid state welding at lower temperatures has been proposed. To study different effects of welding parameters (rotation speed, travel speed and tool offset) on weld zone microstructure and mechanical properties butt joints of a copper alloy and duplex stainless steel (DSS) were produced by friction stir welding (FSW). It has been found that heat input generated by the interaction of different welding conditions has a significant effect on the formation of a brittle intermetallic at the interface and eventually the final mechanical properties. At low heat inputs, mixing of the two sides is insufficient and metallurgical bonding is weak; while at high heat inputs, the thickness of the formed intermetallic is too thick which causes stress concentration at the interface and premature failure. An optimum welding condition was found (rotation speed of 1200 rpm, travel speed of 30 mm/min and tool offset of 0.5 mm) which almost reached the mechanical properties of the Cu-alloy monolayer.

  4. Analysis of microstructure and mechanical properties of aluminium-copper joints welded by FSW process

    Science.gov (United States)

    Iordache, M.; Sicoe, G.; Iacomi, D.; Niţu, E.; Ducu, C.

    2017-08-01

    The research conducted in this article aimed to check the quality of joining some dissimilar materials Al-Cu by determining the mechanical properties and microstructure analysis. For the experimental measurements there were used tin alloy Al - EN-AW-1050A with a thickness of 2 mm and Cu99 sheet with a thickness of 2 mm, joined by FSW weld overlay. The main welding parameters were: rotating speed of the rotating element 1400 rev/min, speed of the rotating element 50 mm/min. The experimental results were determined on samples specially prepared for metallographic analysis. In order to prepare samples for their characterization, there was designed and built a device that allowed simultaneous positioning and fixing for grinding. The characteristics analyzed in the joint welded samples were mictrostructure, microhardness and residual stresses. The techniques used to determine these characteristics were optical microscopy, electron microscopy with fluorescence radioactive elemental analysis (EDS), Vickers microhardness line - HV0.3 and X-ray diffractometry.

  5. Investigation on Microstructure and Impact Toughness of Different Zones in Duplex Stainless Steel Welding Joint

    Science.gov (United States)

    Zhang, Zhiqiang; Jing, Hongyang; Xu, Lianyong; Han, Yongdian; Li, Guolu; Zhao, Lei

    2017-01-01

    This paper investigated on microstructure and impact toughness of different zones in duplex stainless steel welding joint. High-temperature heat-affected zone (HTHAZ) contained coarse ferrite grains and secondary precipitates such as secondary austenite, Cr2N, and sigma. Intergranular secondary austenite was prone to precipitation in low-temperature heat-affected zone (LTHAZ). Both in weld metal (WM) and in HTHAZ, the austenite consisted of different primary and secondary austenite. The ferrite grains in base metal (BM) presented typical rolling texture, while the austenite grains showed random orientation. Both in the HTHAZ and in the LTHAZ, the ferrite grains maintained same texture as the ferrite in the BM. The secondary austenite had higher Ni but lower Cr and Mo than the primary austenite. Furthermore, the WM exhibited the highest toughness because of sufficient ductile austenite and unapparent ferrite texture. The HTHAZ had the lowest toughness because of insufficient austenite formation in addition to brittle sigma and Cr2N precipitation. The LTHAZ toughness was higher than the BM due to secondary austenite precipitation. In addition, the WM fracture was dominated by the dimple, while the cleavage was main fracture mode of the HTHAZ. Both BM and LTHAZ exhibited a mixed fracture mode of the dimple and quasi-cleavage.

  6. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    CERN Document Server

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

    2015-01-01

    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  7. The interface microstructure, mechanical properties and corrosion resistance of dissimilar joints during multipass laser welding for nuclear power plants

    Science.gov (United States)

    Li, Gang; Lu, Xiaofeng; Zhu, Xiaolei; Huang, Jian; Liu, Luwei; Wu, Yixiong

    2018-05-01

    This study presents the interface microstructure, mechanical properties and corrosion resistance of dissimilar joints between Inconel 52M overlays and 316L stainless steel during multipass laser welding for nuclear power plants. The results indicate that the microstructure at the interface beside 316L stainless steel consists of cellular with the width of 30-40 μm, which also exhibits numerous Cr and Mo-rich precipitates like flocculent structure and in chains along grain boundaries as a mixed chemical solution for etching. Many dendritic structure with local melting characteristics and Nb-rich precipitates are exhibited at the interface beside Inconel 52M overlays. Such Nb-rich precipitates at the interface beside Inconel 52M overlays deteriorate the tensile strength and toughness of dissimilar joints at room temperature. The tensile strength of 316L stainless steel at 350 °C significantly decreases with the result that dissimilar joints are fractured in 316L stainless steel. The correlation between corrosion behavior and microstructure of weld metals is also discussed. The difference in high corrosion potential between Nb-rich precipitates and the matrix could result in establishing effective galvanic couples, and thus accelerating the corrosion of weld metals.

  8. Microstructure and Mechanical Properties of Stainless Steel/Brass Joints Brazed by Sn-Electroplated Ag Brazing Filler Metals

    Science.gov (United States)

    Wang, Xingxing; Peng, Jin; Cui, Datian

    2018-05-01

    To develop a high-Sn-content AgCuZnSn brazing filler metal, the BAg50CuZn was used as the base filler metal and a Sn layer was electroplated upon it. Then, the 304 stainless steel and the H62 brass were induction-brazed with the Sn-plated brazing filler metals. The microstructures of the joints were examined with an optical microscope, a scanning electron microscope and an x-ray diffractometer. The corresponding mechanical properties were obtained with a universal tensile testing machine. The results indicated that the induction brazed joints consisted of the Ag phase, the Cu phase and the CuZn phase. When the content of Sn in the Sn-plated Ag brazing filler metal was 6.0 or 7.2 wt.%, the Cu5Zn8, the Cu41Sn11 and the Ag3Sn phases appeared in the brazed joint. The tensile strength of the joints brazed with the Sn-plated filler metal was higher compared to the joints with the base filler metal. When the content of Sn was 6.0 wt.%, the highest tensile strength of the joint reached to 395 MPa. The joint fractures presented a brittle mode, mixed with a low amount of ductile fracture, when the content of Sn exceeded 6.0 wt.%.

  9. Effects of aging treatment and heat input on the microstructures and mechanical properties of TIG-welded 6061-T6 alloy joints

    Science.gov (United States)

    Peng, Dong; Shen, Jun; Tang, Qin; Wu, Cui-ping; Zhou, Yan-bing

    2013-03-01

    Aging treatment and various heat input conditions were adopted to investigate the microstructural evolution and mechanical properties of TIG welded 6061-T6 alloy joints by microstructural observations, microhardness tests, and tensile tests. With an increase in heat input, the width of the heat-affected zone (HAZ) increases and grains in the fusion zone (FZ) coarsen. Moreover, the hardness of the HAZ decreases, whereas that of the FZ decreases initially and then increases with an increase in heat input. Low heat input results in the low ultimate tensile strength of the welded joints due to the presence of partial penetrations and pores in the welded joints. After a simple artificial aging treatment at 175°C for 8 h, the microstructure of the welded joints changes slightly. The mechanical properties of the welded joints enhance significantly after the aging process as few precipitates distribute in the welded seam.

  10. Microstructure Evolution and Mechanical Properties of Underwater Dry and Local Dry Cavity Welded Joints of 690 MPa Grade High Strength Steel.

    Science.gov (United States)

    Shi, Yonghua; Sun, Kun; Cui, Shuwan; Zeng, Min; Yi, Jianglong; Shen, Xiaoqin; Yi, Yaoyong

    2018-01-22

    Q690E high strength low alloy (HSLA) steel plays an important role in offshore structures. In addition, underwater local cavity welding (ULCW) technique was widely used to repair important offshore constructions. However, the high cooling rate of ULCW joints results in bad welding quality compared with underwater dry welding (UDW) joints. Q690E high strength low alloy steels were welded by multi-pass UDW and ULCW techniques, to study the microstructural evolution and mechanical properties of underwater welded joints. The microstructure and fracture morphology of welded joints were observed by scanning electron microscope and optical microscope. The elemental distribution in the microstructure was determined with an Electron Probe Microanalyzer. The results indicated that the microstructure of both two welded joints was similar. However, martensite and martensite-austenite components were significantly different with different underwater welding methods such that the micro-hardness of the HAZ and FZ in the ULCW specimen was higher than that of the corresponding regions in UDW joint. The yield strength and ultimate tensile strength of the ULCW specimen are 109 MPa lower and 77 MPa lower, respectively, than those of the UDW joint. The impact toughness of the UDW joint was superior to those of the ULCW joint.

  11. Microstructure Evolution and Mechanical Properties of Underwater Dry and Local Dry Cavity Welded Joints of 690 MPa Grade High Strength Steel

    Science.gov (United States)

    Sun, Kun; Cui, Shuwan; Zeng, Min; Yi, Jianglong; Shen, Xiaoqin; Yi, Yaoyong

    2018-01-01

    Q690E high strength low alloy (HSLA) steel plays an important role in offshore structures. In addition, underwater local cavity welding (ULCW) technique was widely used to repair important offshore constructions. However, the high cooling rate of ULCW joints results in bad welding quality compared with underwater dry welding (UDW) joints. Q690E high strength low alloy steels were welded by multi-pass UDW and ULCW techniques, to study the microstructural evolution and mechanical properties of underwater welded joints. The microstructure and fracture morphology of welded joints were observed by scanning electron microscope and optical microscope. The elemental distribution in the microstructure was determined with an Electron Probe Microanalyzer. The results indicated that the microstructure of both two welded joints was similar. However, martensite and martensite-austenite components were significantly different with different underwater welding methods such that the micro-hardness of the HAZ and FZ in the ULCW specimen was higher than that of the corresponding regions in UDW joint. The yield strength and ultimate tensile strength of the ULCW specimen are 109 MPa lower and 77 MPa lower, respectively, than those of the UDW joint. The impact toughness of the UDW joint was superior to those of the ULCW joint. PMID:29361743

  12. Microstructure evolution and mechanical properties of Ti−22Al−25Nb alloy joints brazed with Ti−Ni−Nb alloy

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Y.; Cai, X.Q.; Yang, Z.W., E-mail: tjuyangzhenwen@163.com; Qiu, Q.W.; Wang, D.P.; Liu, Y.C.

    2016-10-01

    Ti{sub 45}Ni{sub 45}Nb{sub 10} (at.%) brazing alloy, fabricated by arc melting, was successfully used to braze Ti−22Al−25Nb (at.%) alloy. The microstructures of Ti{sub 45}Ni{sub 45}Nb{sub 10} brazing alloy and Ti−22Al−25Nb alloy brazed joints were analyzed using scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), electron backscatter diffraction (EBSD), and micro-area X-ray diffraction (XRD). The effects of the brazing parameters on the interfacial microstructure and mechanical properties of the Ti−22Al−25Nb alloy brazed joints were investigated. The results showed that the joint was primarily comprised of two characteristic zones: diffusion zone I and central zone II, and the reaction phases formed in the brazed joint were the B2, O, τ{sub 3}, and Ti{sub 2}Ni phase. The crystal orientation of B2 phase in diffusion zone I was consistent with that in the Ti−22Al−25Nb substrate. The O phase was precipitated from the B2 phase. As the brazing temperature or holding time increased, τ{sub 3} was gradually replaced by the B2 phase, and the Ti{sub 2}Ni phase decreased and ultimately disappeared. The maximum shear strength achieved at room temperature was 318 MPa when the joint was brazed at 1180 °C for 20 min, whereas it was 278 MPa at 650 °C. Crack primarily propagated in the τ{sub 3} compound, which was extremely hard and brittle, and partially traversed the B2 and O phases. - Highlights: • Ti{sub 45}Ni{sub 45}Nb{sub 10} alloy was successfully developed to braze Ti−22Al−25Nb alloy. • Ti−22Al−25Nb alloy was transformed from B2 phase into the O + B2 duplex phase after brazing. • Crystal orientation of B2 in joint was dependent on metal substrate. • Correlation between joint microstructure and mechanical properties was revealed. • Ti−22Al−25Nb brazed joint had excellent ambient and high temperature strength.

  13. Microstructure and Mechanical Properties of Laser Welded Joints of DZ125L and IN718 Nickel Base Superalloys

    Science.gov (United States)

    Liang, Taosha; Wang, Lei; Liu, Yang; Song, Xiu

    2018-05-01

    The microstructure and mechanical properties of the laser welded joint of DZ125L and IN718 nickel base superalloys were investigated. The results show that the fusion zone (FZ) mainly consists of fine dendrite structure with fine γ', Laves phases and MC carbides inhomogeneously distributed. The high welding temperature induces the partial dissolution of γ' in the heat-affected zone (HAZ) of DZ125L and liquation of grain boundaries in both of the HAZs. After post-weld heat treatment (PWHT), fine γ″ and γ' phases precipitate in the FZ, IN718 HAZ and IN718 base metal (BM), and fine γ' precipitate in the γ channel of the HAZ and BM of DZ125L. With tensile testing, the joints after PWHT show higher strengths than that of the weaker DZ125L alloy. Plastic deformation mainly concentrates in the weaker DZ125L and the joint finally fails in the DZ125L BM.

  14. Microstructure and mechanical properties of friction stir lap welded Mg/Al joint assisted by stationary shoulder

    Science.gov (United States)

    Ji, Shude; Li, Zhengwei

    2017-11-01

    Using magnesium alloy as upper sheet, 3 mm-thick AZ31 magnesium alloy and 6061 aluminum alloy were joined using friction stir lap welding assisted by stationary shoulder. The effects of tool rotating speed on cross-sections, microstructure and mechanical properties of Mg/Al lap joints were mainly discussed. Results showed that stationary shoulder contributed to joint formation, by which stir zones (SZ) were characterized by big onion rings after welding. Because of the big forging force exerted by stationary shoulder, the upper region of hook was well bonded. SZ showed much higher hardness because of intermetallic compounds (IMCs). The bonding conditions at the base material (BM)/SZ interface at advancing side and the hook region played important roles on joint lap shear properties. The X-ray diffraction pattern analysis revealed that the main IMCs were Al3Mg2 and Al12Mg17.

  15. Soldering of Nanotubes onto Microelectrodes

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing sold...... bonds were consistently found to be mechanically stronger than the carbon nanotubes.......Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...

  16. Influence of groove size and reinforcements addition on mechanical properties and microstructure of friction stir welded joints

    Science.gov (United States)

    Reddy Baridula, Ravinder; Ibrahim, Abdullah Bin; Yahya, Che Ku Mohammad Faizal Bin Che Ku; Kulkarni, Ratnakar; Varma Ramaraju, Ramgopal

    2018-03-01

    The butt joints fabricated by friction stir welding were found to have more strength than the joints obtained by conventional joining process. The important outcome of this process is the successful fabrication of surface composites with improved properties. Thus in order to further enhance the strength of the dissimilar alloy joints the reinforcements can be deposited in to the aluminium matrix during the process of friction stir welding. In the present study the multi-walled carbon nanotubes were embedded in to the groove by varying the width during joining of dissimilar alloys AA2024 and AA7075. Four widths were selected with constant depth and optimum process parameters were selected to fabricate the sound welded joints. The results show that the mechanical properties of the fabricated butt joints were influenced by the size of the groove, due to variation in the deposition of reinforcement in the stir zone. The microstructural study and identification of the elements of the welded joints show that the reinforcements deposition is influenced by the size of the groove. It has also been observed that the groove with minimum width is more effective than higher width. The mechanical properties are found to be improved due to the pinning of grain boundaries.

  17. Microstructure and Properties of Porous Si3N4/Dense Si3N4 Joints Bonded Using RE–Si–Al–O–N (RE = Y or Yb Glasses

    Directory of Open Access Journals (Sweden)

    Ling Li

    2017-11-01

    Full Text Available The joining of porous Si3N4 to dense Si3N4 ceramics has been successfully performed using mixed RE2O3 (RE = Y or Yb, Al2O3, SiO2, and α-Si3N4 powders. The results suggested that the α-Si3N4 powders partly transformed into β-SiAlON and partly dissolved into oxide glass to form oxynitride glass. Thus, composites of glass/β-SiAlON-ceramic formed in the seam of joints. Due to the capillary action of the porous Si3N4 ceramic, the molten glass solder infiltrated into the porous Si3N4 ceramic side during the joining process and formed the “infiltration zone” with a thickness of about 400 μm, which contributed to the heterogeneous distribution of the RE–Si–Al–O–N glasses in the porous Si3N4 substrate. In-situ formation of β-SiAlON in the seam resulted in a high bonding strength. The maximum bending strength of 103 MPa and 88 MPa was reached for the porous Si3N4/dense Si3N4 joints using Y–Si–Al–O–N and Yb–Si–Al–O–N glass solders, respectively.

  18. Study of microstructure and mechanical property relationships of A-TIG welded P91–316L dissimilar steel joint

    Energy Technology Data Exchange (ETDEWEB)

    Vidyarthy, R.S., E-mail: vidyashanker01@gmail.com; Kulkarni, A.; Dwivedi, D.K.

    2017-05-17

    The current work enunciated the effect of activating flux tungsten inert gas (A-TIG) welding on the microstructural, mechanical and corrosion behaviour of the 316L stainless steel (SS) and P91 steel weldment. The current study also demonstrated the comprehensive structure–property relationships of dissimilar joint weldment using the collective techniques of optical macro and microscopy, electron microscopy, and Energy-dispersive X-ray spectroscopy (EDS) techniques. Microstructure study reveals the presence of delta ferrite, austenite and martensite in different zones of the weldment. The dissimilar steel weldment failed from the 316L side fusion boundary during the tensile testing. Maximum impact energy was absorbed by the 316L SS side heat affected zone (HAZ) while minimum by P91 steel side HAZ during the Charpy toughness test. The potentiodynamic test result suggested that the P91 side fusion boundary had minimum corrosion and pitting potential in all the weldment.

  19. Microstructure and toughness of ferritic weld metal of hyperbaric welded joints

    International Nuclear Information System (INIS)

    Mueller, L.

    1988-01-01

    In the present work ferritic weld metals of hyperbaric MIG/MAG welds with pressures up to 100 bar were examined. As a result of the pressure, interactions with the shielding gas, the filler metal as well as with the welding parameters had to be expected and were consequently included in the analysis. Investigation was focused on the influence of these parameters on the chemical composition of the weld metals, the microstructure and toughness behaviour, including fracture mechanics test. Using quantitative microstructural analysis as well as fractography a correlation between microstructure and toughness has been shown. (orig.) [de

  20. Microstructure and corrosion behavior of shielded metal arc-welded dissimilar joints comprising duplex stainless steel and low alloy steel

    Science.gov (United States)

    Srinivasan, P. Bala; Muthupandi, V.; Sivan, V.; Srinivasan, P. Bala; Dietzel, W.

    2006-12-01

    This work describes the results of an investigation on a dissimilar weld joint comprising a boiler-grade low alloy steel and duplex stainless steel (DSS). Welds produced by shielded metal arc-welding with two different electrodes (an austenitic and a duplex grade) were examined for their microstructural features and properties. The welds were found to have overmatching mechanical properties. Although the general corrosion resistance of the weld metals was good, their pitting resistance was found to be inferior when compared with the DSS base material.

  1. EFECTO DE LA ALTURA DEL MANGUITO EN UNIONES SOLDADAS EN CAÑERÍAS DE COBRE BUSHING HEIGHT EFFECT IN SOLDERED COPPER PIPE JOINTS

    Directory of Open Access Journals (Sweden)

    Víctor Carmona

    2006-12-01

    Full Text Available Se perforó un tubo de cobre de 28,6 mm de diámetro, por el proceso de taladrado por fluencia térmica (TFT. Se prepararon manguitos de diferentes alturas, haciendo un preperforado con brocas convencionales HSS de diferentes diámetros. Se seleccionaron manguitos de dos alturas diferentes. Se determinó la circularidad de la perforación. Se soldó un tubo cobre de ø 12,7 mm en forma perpendicular a un tubo de cobre de ø 28,6 mm y se determinó la resistencia a la tracción de la unión soldada, para lo cual se diseñó un dispositivo mecánico que fue adaptado en la máquina universal de ensayos. Se hicieron ensayos de microdureza y metalografía de la unión. Se concluyó que el manguito de menor altura es suficiente para que la unión alcance la máxima resistencia.Copper tubes were drilled with thermal flow drilling. Conventional HSS drills diameters were used to make pre drilling holes. Different height bushings were made. Two of the bushing heights were selected. The bushing circularity was measured. A ø 12,7 mm tube was welded perpendicularly on a ø 28,6 mm tube. A especial support device was designed and it was adapted to the Universal Test Machine, to determine the tensile stress of the brazing joint. The micro hardness and metallographic test were made in the brazing zone. As a conclusion the lower height bushing is enough to reach the maximum resistance.

  2. Effect of Rotation Rate on Microstructure and Properties of Friction Stir Welded Joints of Al/Cu Clad Plates

    Directory of Open Access Journals (Sweden)

    QIAO Ke

    2017-10-01

    Full Text Available Al/Cu clad plates were joined by friction stir welding (FSW, and the effect of rotation rate on microstructure and mechanical properties of joints was investigated. The results show that the laminar structure of aluminum and copper is generated in the weld. With increase the of rotation rate, the grain sizes of aluminum and copper are increased respectively. The average microhardness of the Al/Cu plates exceeds that of the as-received metal of 33.0 HV, and ultimate tensile strength is 127.21 MPa in the nugget zone when rotation rate is 1180 r/min. The microhardness of copper in the nugget zone is 99.7 HV, reached 82.05% of the microhardness of received metal, and void defect is main reason responsible for the decrease of mechanical properties of joints.

  3. Microstructure and bonding mechanism of Al/Ti bonded joint using Al-10Si-1Mg filler metal

    International Nuclear Information System (INIS)

    Sohn, Woong H.; Bong, Ha H.; Hong, Soon H.

    2003-01-01

    The microstructures and liquid state diffusion bonding mechanism of cp-Ti to 1050 Al using an Al-10.0wt.%Si-1.0wt.%Mg filler metal with 100 μm in thickness have been investigated at 620 deg. C under 1x10 -4 Torr. The effects of bonding process parameters on microstructure of bonded joint have been analyzed by using an optical microscope, AES, scanning electron microscopy and EDS. The interfacial bond strength of Al/Ti bonded joints was measured by the single lap shear test. The results show that the bonding at the interface between Al and filler metal proceeds by wetting the Al with molten filler metal, and followed by removal of oxide layer on surface of Al. The interface between Al and filler metal moved during the isothermal solidification of filler metal by the diffusion of Si from filler metal into Al layer. The interface between Al and filler metal became curved in shape with increasing bonding time due to capillary force at grain boundaries. The bonding at the interface between Ti and filler metal proceeds by the formation of two different intermetallic compound layers, identified as Al 5 Si 12 Ti 7 and Al 12 Si 3 Ti 5 , followed by the growth of the intermetallic compound layers. The interfacial bond strength at Al/Ti joint increased with increasing bonding time up to 25 min at 620 deg. C. However, the interfacial bond strength of Al/Ti joint decreased after bonding time of 25 min at 620 deg. C due to formation of cavities in Al near Al/intermetallic interfaces

  4. Correlation of microstructure and fracture toughness of advanced 9Cr/CrMoV dissimilarly welded joint

    Energy Technology Data Exchange (ETDEWEB)

    Guo, Qian [Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240 (China); Lu, Fenggui, E-mail: Lfg119@sjtu.edu.cn [Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240 (China); Liu, Xia [Shanghai Turbine Plant of Shanghai Electric Power Generation Equipment Co. Ltd., Shanghai 200240 (China); Yang, Renjie [Shanghai Turbine Works Company, Shanghai 200240 (China); Cui, Haichao [Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240 (China); Gao, Yulai, E-mail: ylgao@shu.edu.cn [State Key Laboratory of Advanced Special Steels, Shanghai University, Shanghai 200072 (China)

    2015-06-25

    In this paper, the fracture toughness and the related microstructure characteristics of dissimilarly welded joint manufactured by advanced 9Cr and CrMoV steels were systematically investigated. The dissimilarly welded joint was fabricated by narrow gap submerged arc welding (NG-SAW) applying multi-layer and multi-pass technique. Fracture toughness, as one of the most important property to assess the reliability of welded joint, was studied for different regions including CrMoV base metal (CrMoV-BM), heat affected zone (HAZ) of CrMoV side (CrMoV-HAZ), weld metal (WM), heat affected zone of 9Cr side (9Cr-HAZ) and 9Cr base metal (9Cr-BM). It was found that the fracture toughness of CrMoV-BM, CrMoV-HAZ and WM was better than that of 9Cr-HAZ and 9Cr-BM. In order to illustrate these results, the microstructure of the whole welded joint was observed by optical microscope (OM), scanning electron microscope (SEM) and transmission electron microscope (TEM) detailedly. It was found that the fine high-temperature tempered martensite and bainite in WM, CrMoV-BM and CrMoV-HAZ contribute to the higher fracture toughness, while lower fracture toughness for 9Cr-BM and HAZ was caused by coarse tempered lath-martensite. Furthermore, the fracture morphology showed that ductile fracture occurred in WM and CrMoV side, while brittle fracture appeared in BM and HAZ of 9Cr side.

  5. Microstructure Evolution and Selective Corrosion Resistance in Underwater Multi-pass 2101 Duplex Stainless Steel Welding Joints

    Science.gov (United States)

    Hu, Yu; Shi, Yonghua; Shen, Xiaoqin; Wang, Zhongmin

    2018-05-01

    A recently developed promising material, 2101 lean duplex stainless steel, represents an alternative to 304 austenite stainless steel. In this work, multi-pass 2101 weld joints were fabricated using the flux-cored arc welding method in a hyperbaric chamber. The pressure varied from 0 to 0.75 MPa. The evolution of the welding process and microstructure was investigated. γ 2 formation in the reheated zones of the WM and HAZ was not uniform. The closer the reheated zone is to the subsequent heat source, the greater the γ 2 formation in the reheated zone. Sufficient primary austenite transformation inhibited Cr2N precipitation and the subsequent intragranular γ 2 formation in the reheated weld passes of the 0.45 MPa weld metal. The localized corrosion resistance of each zone of the 0.45 MPa DSS joint was measured using non-destructive double-loop electrochemical potentiokinetic reactivation tests. The localized corrosion was induced by γ 2 and Cr2N. The root region of the 0.45 MPa weld metal underwent two subsequent welding thermal cycles, which induced increased γ 2 formation and lower resistance to corrosion because of the decreased pitting resistance value of γ 2. The correlation between microstructure evolution and the distribution of selective corrosion was determined.

  6. Effect of Friction Stir Welding Parameters on the Mechanical and Microstructure Properties of the Al-Cu Butt Joint

    Directory of Open Access Journals (Sweden)

    Sare Celik

    2016-05-01

    Full Text Available Friction Stir Welding (FSW is a solid-state welding process used for welding similar and dissimilar materials. FSW is especially suitable to join sheet Al alloys, and this technique allows different material couples to be welded continuously. In this study, 1050 Al alloys and commercially pure Cu were produced at three different tool rotation speeds (630, 1330, 2440 rpm and three different tool traverse speeds (20, 30, 50 mm/min with four different tool position (0, 1, 1.5, 2 mm by friction stir welding. The influence of the welding parameters on the microstructure and mechanical properties of the joints was investigated. Tensile and bending tests and microhardness measurements were used to determine the mechanical properties. The microstructures of the weld zone were investigated by optical microscope and scanning electron microscope (SEM and were analyzed in an energy dispersed spectrometer (EDS. Intermetallic phases were detected based on the X-ray diffraction (XRD analysis results that evaluated the formation of phases in the weld zone. When the welding performance of the friction stir welded butt joints was evaluated, the maximum value obtained was 89.55% with a 1330 rpm tool rotational speed, 20 mm/min traverse speed and a 1 mm tool position configuration. The higher tensile strength is attributed to the dispersion strengthening of the fine Cu particles distributed over the Al material in the stir zone region.

  7. Microstructural characterization of welded zone for Fe{sub 3}Al/Q235 fusion-bonded joint

    Energy Technology Data Exchange (ETDEWEB)

    Ma Haijun [Key Lab of Liquid Structure and Heredity of Materials, Ministry of Education, Shandong University, Jinan 250061, Shandong Province, Jing Shi Road 73, Shandong (China)], E-mail: hjma123@mail.sdu.edu.cn; Li Yajiang [Key Lab of Liquid Structure and Heredity of Materials, Ministry of Education, Shandong University, Jinan 250061, Shandong Province, Jing Shi Road 73, Shandong (China); Material Science Department, Bauman Moscow State Technical University, Moscow 105005 (Russian Federation); Puchkov, U.A. [Material Science Department, Bauman Moscow State Technical University, Moscow 105005 (Russian Federation); Wang Juan [Key Lab of Liquid Structure and Heredity of Materials, Ministry of Education, Shandong University, Jinan 250061, Shandong Province, Jing Shi Road 73, Shandong (China)

    2008-12-20

    The microstructural characterization of Fe{sub 3}Al/Q235 welded zone were analysed to investigate the welding behavior of Fe{sub 3}Al intermetallic. The results indicated that a crack-free Fe{sub 3}Al/Q235 joint was obtained when Cr25-Ni13 alloy was adopted as the filler metal. The microstructure of the welded zone presented different morphology due to the severe fluctuation of Al, Ni, Mn and Cr elements near the fusion zone. The fish-bone like structures in Q235 side fusion zone were composed of {alpha}-Fe(Cr, Al, Ni) solid solutions. Fe{sub 3}Al/Q235 joint fractured in the Fe{sub 3}Al HAZ, and shear strength of 533.33 MPa was achieved. The fracture mode of Fe{sub 3}Al side fracture surface was mainly transgranular cleavage, occured along [1 1 1] orientation on {l_brace}1 1 0{r_brace} planes. And the Q235 side fracture surface was in intergranular and quasi-cleavage mode. The phase relations of {gamma} and {alpha} in Fe{sub 3}Al side fusion zone, constituent of lower bainite in the weld and the Fe{sub 3}Al ordered transformation in HAZ were also determined.

  8. Microstructural Variations Across a Dissimilar 316L Austenitic: 9Cr Reduced Activation Ferritic Martensitic Steel Weld Joint

    Science.gov (United States)

    Thomas Paul, V.; Karthikeyan, T.; Dasgupta, Arup; Sudha, C.; Hajra, R. N.; Albert, S. K.; Saroja, S.; Jayakumar, T.

    2016-03-01

    This paper discuss the microstructural variations across a dissimilar weld joint between SS316 and 9Cr-RAFM steel and its modifications on post weld heat treatments (PWHT). Detailed characterization showed a mixed microstructure of austenite and martensite in the weld which is in agreement with the phases predicted using Schaeffler diagram based on composition measurements. The presence of very low volume fraction of δ-ferrite in SS316L has been identified employing state of the art electron back-scattered diffraction technique. PWHT of the ferritic steel did not reduce the hardness in the weld metal. Thermal exposure at 973 K (700 °C) showed a progressive reduction in hardness of weld joint with duration of treatment except in austenitic base metal. However, diffusion annealing at 1073 K (800 °C) for 100 hours resulted in an unexpected increase in hardness of weld metal, which is a manifestation of the dilution effects and enrichment of Ni on the transformation characteristics of the weld zone. Migration of carbon from ferritic steel aided the precipitation of fine carbides in the austenitic base metal on annealing at 973 K (700 °C); but enhanced diffusion at 1073 K (880 °C) resulted in coarsening of carbides and thereby reduction of hardness.

  9. Influence of Zn Interlayer on Interfacial Microstructure and Mechanical Properties of TIG Lap-Welded Mg/Al Joints

    Science.gov (United States)

    Gao, Qiong; Wang, Kehong

    2016-03-01

    This study explored 6061 Al alloy and AZ31B Mg alloy joined by TIG lap welding with Zn foils of varying thicknesses, with the additional Zn element being imported into the fusion zone to alloy the weld seam. The microstructures and chemical composition in the fusion zone near the Mg substrate were examined by SEM and EDS, and tensile shear strength tests were conducted to investigate the mechanical properties of the Al/Mg joints, as well as the fracture surfaces, and phase compositions. The results revealed that the introduction of an appropriate amount of Zn transition layer improves the microstructure of Mg/Al joints and effectively reduces the formation of Mg-Al intermetallic compounds (IMCs). The most common IMCs in the fusion zone near the Mg substrate were Mg-Zn and Mg-Al-Zn IMCs. The type and distribution of IMCs generated in the weld zone differed according to Zn additions; Zn interlayer thickness of 0.4 mm improved the sample's mechanical properties considerably compared to thicknesses of less than 0.4 mm; however, any further increase in Zn interlayer thickness of above 0.4 mm caused mechanical properties to deteriorate.

  10. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates

    International Nuclear Information System (INIS)

    Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

    2008-01-01

    The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in

  11. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates.

    Energy Technology Data Exchange (ETDEWEB)

    Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

    2008-09-01

    The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in

  12. Dissimilar friction stir welding of 6061 Al to T2 pure Cu adopting tooth-shaped joint configuration: Microstructure and mechanical properties

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Wei; Shen, Yifu, E-mail: yfshen_nuaa@hotmail.com; Yan, Yinfei; Guo, Rui

    2017-04-06

    In this paper, dissimilar 6061aluminum alloy and commercial pure copper were friction stir butt welded adopting tooth-shaped joint configuration to investigate the influence of Al/Cu content in welding bead (WB) on the microstructure and mechanical properties of the joint. At preliminary tests, optimal welding parameters were determined to guarantee proper heat input. Welding experiments were performed with the dimensions of the tooth as variables, which is a special technique to tailor Al/Cu content in WB. Macro and microstructure of the cross section of the joints were characterized via optical microscopy (OM) and Scanning Electron Microscopy (SEM) equipped with energy dispersive spectroscopy (EDS). Special band structure(BS) showing lamellar-like flow characteristic is worthy of noticing. Additionally, dispersive Cu particles (DP), forming composite-like structure, were captured. High Cu concentration, however, yielded a harsh material flow due to its high plasticized temperature and poor flowability and can not produce reliable metallurgical bonding. Microhardness of the joint was investigated and the high hardness was caused mainly by the hard intermetallic compounds (IMCs). Besides, tensile tests were conducted to evaluate the joint performance. Based on the result analysis, this joint form has special advantage in tailoring Al/Cu content in WB and controlling the microstructure that imposes significant influence on mechanical properties of the joints.

  13. Dissimilar friction stir welding of 6061 Al to T2 pure Cu adopting tooth-shaped joint configuration: Microstructure and mechanical properties

    International Nuclear Information System (INIS)

    Zhang, Wei; Shen, Yifu; Yan, Yinfei; Guo, Rui

    2017-01-01

    In this paper, dissimilar 6061aluminum alloy and commercial pure copper were friction stir butt welded adopting tooth-shaped joint configuration to investigate the influence of Al/Cu content in welding bead (WB) on the microstructure and mechanical properties of the joint. At preliminary tests, optimal welding parameters were determined to guarantee proper heat input. Welding experiments were performed with the dimensions of the tooth as variables, which is a special technique to tailor Al/Cu content in WB. Macro and microstructure of the cross section of the joints were characterized via optical microscopy (OM) and Scanning Electron Microscopy (SEM) equipped with energy dispersive spectroscopy (EDS). Special band structure(BS) showing lamellar-like flow characteristic is worthy of noticing. Additionally, dispersive Cu particles (DP), forming composite-like structure, were captured. High Cu concentration, however, yielded a harsh material flow due to its high plasticized temperature and poor flowability and can not produce reliable metallurgical bonding. Microhardness of the joint was investigated and the high hardness was caused mainly by the hard intermetallic compounds (IMCs). Besides, tensile tests were conducted to evaluate the joint performance. Based on the result analysis, this joint form has special advantage in tailoring Al/Cu content in WB and controlling the microstructure that imposes significant influence on mechanical properties of the joints.

  14. Detailed Microstructural Characterization and Restoration Mechanisms of Duplex and Superduplex Stainless Steel Friction-Stir-Welded Joints

    Science.gov (United States)

    Santos, T. F. A.; Torres, E. A.; Lippold, J. C.; Ramirez, A. J.

    2016-12-01

    Duplex stainless steels are successfully used in a wide variety of applications in areas such as the food industry, petrochemical installations, and sea water desalination plants, where high corrosion resistance and high mechanical strength are required. However, during fusion welding operations, there can be changes to the favorable microstructure of these materials that compromise their performance. Friction stir welding with a non-consumable pin enables welded joints to be obtained in the solid state, which avoids typical problems associated with solidification of the molten pool, such as segregation of alloying elements and the formation of solidification and liquefaction cracks. In the case of superduplex stainless steels, use of the technique can avoid unbalanced proportions of ferrite and austenite, formation of deleterious second phases, or growth of ferritic grains in the heat-affected zone. Consolidated joints with full penetration were obtained for 6-mm-thick plates of UNS S32101 and S32205 duplex stainless steels, and S32750 and S32760 superduplex steels. The welding heat cycles employed avoided the conditions required for formation of deleterious phases, except in the case of the welded joint of the S32760 steel, where SEM images indicated the formation of secondary phases, as corroborated by decreased mechanical performance. Analysis using EBSD and transmission electron microscopy revealed continuous dynamic recrystallization by the formation of cellular arrays of dislocations in the ferrite and discontinuous dynamic recrystallization in the austenite. Microtexture evaluation indicated the presence of fibers typical of shear in the thermomechanically affected zone. These fibers were not obviously present in the stir zone, probably due to the intensity of microstructural reformulation to which this region was subjected.

  15. Microstructure evolution and shear strength of vacuum brazed joint for super-Ni/NiCr laminated composite with Ni–Cr–Si–B amorphous interlayer

    International Nuclear Information System (INIS)

    Wu, Na; Li, Yajiang; Ma, Qunshuang

    2014-01-01

    Highlights: • Divorced eutectic of γ-Ni and Ni 3 B formed in the brazed region. • The detailed isothermal solidification mechanism was proposed. • Borides formed at the interfaces at different temperatures were identified. • Effect of brazing temperatures on microstructure and shear strength was investigated. • Excellent joint with shear strength of 191 MPa was obtained at 1100 °C for 20 min. - Abstract: Vacuum brazing of super-Ni/NiCr laminated composite and Cr18–Ni8 steel was carried out with Ni–Cr–Si–B amorphous interlayer at different temperatures (1060–1150 °C). The effects of brazing temperature on the microstructure evolution and shear strength of the joints were investigated. Microstructure, chemical composition and microhardness of the joints were studied using field emission scanning electron microscope, energy dispersive spectroscopy, X-ray diffraction and microsclerometer. Shear strength of the joints were measured by the electromechanical universal testing machine. Diffusion of B was the controlling factor for microstructure evolution. The detailed isothermal solidification mechanism was proposed in this study. The fracture morphology of the joint made at 1100 °C exhibited plastic feature and the shear strength reached 191 MPa. Bulky Ni 3 B formed in super-Ni cover layer near the brazed region when performed at 1060–1100 °C while Ni–B eutectic formed instead at 1150 °C

  16. Microstructure and mechanical properties of China low activation martensitic steel joint by TIG multi-pass welding with a new filler wire

    Science.gov (United States)

    Huang, Bo; Zhang, Junyu; Wu, Qingsheng

    2017-07-01

    Tungsten Inner Gas (TIG) welding is employed for joining of China low activation martensitic (CLAM) steel. A new filler wire was proposed, and the investigation on welding with various heat input and welding passes were conducted to lower the tendency towards the residual of δ ferrite in the joint. With the optimized welding parameters, a butt joint by multi-pass welding with the new filler wire was prepared to investigate the microstructure and mechanical properties. The microstructure of the joint was observed by optical microscope (OM) and scanning electron microscope (SEM). The hardness, Charpy impact and tensile tests of the joint were implemented at room temperature (25 °C). The results revealed that almost full martensite free from ferrite in the joints were obtained by multipass welding with the heat input of 2.26 kJ/mm. A certain degree of softening occurred at the heat affected zone of the joint according to the results of tensile and hardness tests. The as welded joints showed brittle fracture in the impact tests. However, the joints showed toughness fracture after tempering and relatively better comprehensive performance were achieved when the joints were tempered at 740 °C for 2 h.

  17. Microstructure and mechanical properties of China low activation martensitic steel joint by TIG multi-pass welding with a new filler wire

    Energy Technology Data Exchange (ETDEWEB)

    Huang, Bo [Key Laboratory of Neutronics and Radiation Safety, Institute of Nuclear Energy Safety Technology, Chinese Academy of Sciences, Hefei, Anhui, 230031 (China); Zhang, Junyu [Key Laboratory of Neutronics and Radiation Safety, Institute of Nuclear Energy Safety Technology, Chinese Academy of Sciences, Hefei, Anhui, 230031 (China); University of Science and Technology of China, Hefei, Anhui, 230027 (China); Wu, Qingsheng, E-mail: qingsheng.wu@fds.org.cn [Key Laboratory of Neutronics and Radiation Safety, Institute of Nuclear Energy Safety Technology, Chinese Academy of Sciences, Hefei, Anhui, 230031 (China)

    2017-07-15

    Tungsten Inner Gas (TIG) welding is employed for joining of China low activation martensitic (CLAM) steel. A new filler wire was proposed, and the investigation on welding with various heat input and welding passes were conducted to lower the tendency towards the residual of δ ferrite in the joint. With the optimized welding parameters, a butt joint by multi-pass welding with the new filler wire was prepared to investigate the microstructure and mechanical properties. The microstructure of the joint was observed by optical microscope (OM) and scanning electron microscope (SEM). The hardness, Charpy impact and tensile tests of the joint were implemented at room temperature (25 °C). The results revealed that almost full martensite free from ferrite in the joints were obtained by multipass welding with the heat input of 2.26 kJ/mm. A certain degree of softening occurred at the heat affected zone of the joint according to the results of tensile and hardness tests. The as welded joints showed brittle fracture in the impact tests. However, the joints showed toughness fracture after tempering and relatively better comprehensive performance were achieved when the joints were tempered at 740 °C for 2 h. - Highlights: •A new filler material was proposed to control ferrite content in CLAM weld metal. •Heat input affected ferrite content through influencing cooling rate during welding. •Multipass welding was a promising way to eliminate the ferrite in the weld.

  18. Au-Ge based Candidate Alloys for High-Temperature Lead-Free Solder Alternatives

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure and microhard......Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure...... was primarily strengthened by the refined (Ge) dispersed phase. The distribution of phases played a relatively more crucial role in determining the ductility of the bulk solder alloy. In the present work it was found that among the low melting point metals, the addition of Sb to the Au-Ge eutectic would...

  19. Effect of Brass Interlayer Sheet on Microstructure and Joint Performance of Ultrasonic Spot-Welded Copper-Steel Joints

    Science.gov (United States)

    Satpathy, Mantra Prasad; Kumar, Abhishek; Sahoo, Susanta Kumar

    2017-07-01

    Solid-state ultrasonic spot welding (USW) inevitably offers a potential solution for joining dissimilar metal combination like copper (Cu) and steel (SS). In this study, the USW has been performed on Cu (UNS C10100) and SS (AISI 304) with brass interlayer by varying various welding parameters, aiming to identify the interfacial reaction, changes in microstructure and weld strength. The highest tensile shear and T-peel failure loads of 1277 and 174 N are achieved at the optimum conditions like 68 µm of vibration amplitude, 0.42 MPa of weld pressure and 1 s of weld time. The fractured surface analysis of brass interlayer and AISI 304 stainless steel samples reveals the features like swirls, voids and intermetallic compounds (IMCs). These IMCs are composed of CuZn and FeZn composite-like structures with 1.0 μm thickness. This confirms that the weld quality is specifically sensitive to the levels of input parameter combinations as well as the type of material present on the sonotrode side.

  20. Interfacial microstructure and shear strength of reactive air brazed oxygen transport membrane ceramic-metal alloy joints

    Science.gov (United States)

    FR, Wahid Muhamad; Yoon, Dang-Hyok; Raju, Kati; Kim, Seyoung; Song, Kwang-sup; Yu, Ji Haeng

    2018-01-01

    To fabricate a multi-layered structure for maximizing oxygen production, oxygen transport membrane (OTM) ceramics need to be joined or sealed hermetically metal supports for interfacing with the peripheral components of the system. Therefore, in this study, Ag-10 wt% CuO was evaluated as an effective filler material for the reactive air brazing of dense Ce0.9Gd0.1O2-δ-La0.7Sr0.3MnO3±δ (GDC-LSM) OTM ceramics. Thermal decomposition in air and wetting behavior of the braze filler was performed. Reactive air brazing was performed at 1050 °C for 30 min in air to join GDC-LSM with four different commercially available high temperature-resistant metal alloys, such as Crofer 22 APU, Inconel 600, Fecralloy, and AISI 310S. The microstructure and elemental distribution of the ceramic-ceramic and ceramic-metal interfaces were examined from polished cross-sections. The mechanical shear strength at room temperature for the as-brazed and isothermally aged (800 °C for 24 h) joints of all the samples was compared. The results showed that the strength of the ceramic-ceramic joints was decreased marginally by aging; however, in the case of metal-ceramic joints, different decreases in strengths were observed according to the metal alloy used, which was explained based on the formation of different oxide layers at the interfaces.

  1. Microstructure evolution of Al/Mg butt joints welded by gas tungsten arc with Zn filler metal

    International Nuclear Information System (INIS)

    Liu Fei; Zhang Zhaodong; Liu Liming

    2012-01-01

    Based on the idea of alloying welding seam, Gas tungsten arc welding method with pure Zn filler metal was chosen to join Mg alloy and Al alloy. The microstructures, phases, element distribution and fracture morphology of welding seams were examined. The results indicate that there was a transitional zone in the width of 80–100 μm between the Mg alloy substrate and fusion zone. The fusion zone was mainly composed of MgZn 2 , Zn-based solid solution and Al-based solid solution. The welding seam presented distinct morphology in different location owning to the quite high cooling rate of the molten pool. The addition of Zn metal could prevent the formation of Mg–Al intermetallics and form the alloyed welding seam during welding. Therefore, the tensile strengths of joints have been significantly improved compared with those of gas tungsten arc welded joints without Zn metal added. Highlights: ► Mg alloy AZ31B and Al alloy 6061 are welded successfully. ► Zinc wire is employed as a filler metal to form the alloyed welding seam. ► An alloyed welding seam is benefit for improving of the joint tensile strength.

  2. Effect of minor Er and Zr on microstructure and mechanical properties of Al–Mg–Mn alloy (5083) welded joints

    International Nuclear Information System (INIS)

    Dongxia, Yang; Xiaoyan, Li; Dingyong, He; Hui, Huang

    2013-01-01

    Samples of Al–Mg–Mn and Al–Mg–Mn–Er–Zr alloys were welded using the method of laser welding. The influence of Er and Zr on microstructure, microhardness and mechanical properties of the Al–Mg–Mn alloy welded joints were investigated. It has been found that addition of Er and Zr refines the grain size in the fusion zone, due to the formation of primary Al 3 Zr and Al 3 Er. Fine equiaxed grains are dominated near the fusion boundary of the Al–Mg–Mn–Er–Zr alloy joint, which is contrary with the columnar crystal in the Al–Mg–Mn alloy joint. Microhardness of the center of the fusion zone rises from 74HV 0.1 to 84HV 0.1 owing to the grain refinement by Er and Zr. The tensile test result shows that the ultimate tensile strength and yield strength are improved by adding Er and Zr. The main reason for this is related to grain refining strengthening.

  3. Effect of minor Er and Zr on microstructure and mechanical properties of Al-Mg-Mn alloy (5083) welded joints

    Energy Technology Data Exchange (ETDEWEB)

    Dongxia, Yang, E-mail: yangdongxia116@emails.bjut.edu.cn [Department of Materials Science and Engineering, Beijing University of Technology, Beijing 100124 (China); Xiaoyan, Li; Dingyong, He; Hui, Huang [Department of Materials Science and Engineering, Beijing University of Technology, Beijing 100124 (China)

    2013-01-20

    Samples of Al-Mg-Mn and Al-Mg-Mn-Er-Zr alloys were welded using the method of laser welding. The influence of Er and Zr on microstructure, microhardness and mechanical properties of the Al-Mg-Mn alloy welded joints were investigated. It has been found that addition of Er and Zr refines the grain size in the fusion zone, due to the formation of primary Al{sub 3}Zr and Al{sub 3}Er. Fine equiaxed grains are dominated near the fusion boundary of the Al-Mg-Mn-Er-Zr alloy joint, which is contrary with the columnar crystal in the Al-Mg-Mn alloy joint. Microhardness of the center of the fusion zone rises from 74HV{sub 0.1} to 84HV{sub 0.1} owing to the grain refinement by Er and Zr. The tensile test result shows that the ultimate tensile strength and yield strength are improved by adding Er and Zr. The main reason for this is related to grain refining strengthening.

  4. Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys

    Science.gov (United States)

    Lis, Adrian; Nakanishi, Kohei; Matsuda, Tomoki; Sano, Tomokazu; Minagawa, Madoka; Okamoto, Masahide; Hirose, Akio

    2017-07-01

    Solder joints between leads and printed circuit boards in thin small outline packages were produced with conventional Sn1.0Ag0.7Cu (SAC107) and Sn3.0Ag0.7Cu (SAC305) solders as well as various solder alloys with gradually increasing amounts of Bi (up to 3.0 wt.%) and In (up to 1.0 wt.%) within the SAC107 base solder. The reliability of soldered leads in temperature cycle (TC) tests improved most with solder alloys containing both Bi (1.6 wt.%) and In (0.5 wt.%). Microindentation and electron probe microanalysis mappings revealed that the effect originates from a combination of solution and precipitation strengthening of the initial SAC alloy. The distribution of inelastic strain accumulation (ISA), as a measure for degradation, was determined in the solder joints by finite element calculations. It was shown that defects in the solder proximal to the lead (60-75 μm), which was underpinned by similar cracking characteristics along the lead-solder interface. The ISA was confirmed to be lower in SAC+Bi/In alloys owing to their enhanced elasto-plastic properties. Moreover, the addition of a thin Cu coating on the leads could improve the joint reliability, as suggested by the calculation of the ISA and the acceleration factor.

  5. Evolution of the Thermal Conductivity of Sintered Silver Joints with their Porosity Predicted by the Finite Element Analysis of Real 3D Microstructures

    Science.gov (United States)

    Signor, L.; Kumar, P.; Tressou, B.; Nadot-Martin, C.; Miranda-Ordonez, José; Carr, J.; Joulain, K.; Milhet, X.

    2018-07-01

    Silver paste sintering is a very promising technology for chip bonding in future power electronics modules owing to its high melting temperature and the good electrical and thermal properties among other classic solder alloys. However, in its sintered form, these joints contain nanometric/submicrometric pores that affect their thermal performance. The present study gives insight into the relationship between the material thermal conductivity and the real three-dimensional porous structure using finite element modelling. It is shown that over a certain pore fraction threshold (˜ 13%), the pore morphology has a non-negligible influence on the thermal conductivity. Results are also compared to predictions obtained by analytical models available in the literature.

  6. Microstructures of friction welded joints of AZ31 to AM60 magnesium alloys

    Energy Technology Data Exchange (ETDEWEB)

    Fukumoto, S.; Ono, T.; Tanaka, S.; Tsubakino, H. [Graduate School of Engineering, Himeji Inst. of Tech., Hyogo (Japan); Tomita, T.; Aritoshi, M. [Hyogo Prefectural Inst. of Industrial Research, Kobe, Hyogo (Japan); Okita, K. [Inst. of Industrial Research, Osaka Sangyo Univ., Osaka (Japan)

    2003-07-01

    AZ31 magnesium alloy was friction-welded to AM60 and the microstructures and the friction welding process were studied. The microstructures changed near the weld interface. The AZ31 was refined to a grain size of several {mu}m near the weld interface. The nucleation occurred in the shear bands that were introduced during the welding process. On the other hand, the eutectic structure was deformed and the lamellar structure which was composed of {alpha}-Mg and Mg{sub 17}Al{sub 12} was formed near the weld interface in AM60 alloy. In the friction process, the adhesion and peel off occurred alternately between AZ31 and AM60. Eventually, bonding was completed during upset process. (orig.)

  7. Comparative shear tests of some low temperature lead-free solder pastes

    Science.gov (United States)

    Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

    2016-12-01

    The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

  8. Microstructure characterization in the weld joint of a high nickel austenitic alloy and Cr18-Ni8 stainless steel

    Energy Technology Data Exchange (ETDEWEB)

    Wu, Na; Li, Yajiang; Wang, Juan [Shandong Univ., Jinan (CN). Key Lab. for Liquid - Solid Structural Evolution and Processing of Materials (Ministry of Education)

    2012-06-15

    High nickel austenitic alloy, 6 mm thick, and Cr18-Ni8 stainless steel with a thickness of 0.6 mm were joined by pulsed current tungsten inert gas arc welding without filler metal in this work. Metallographic examination, microhardness measurement and electron microprobe analysis were used to reveal microstructural characteristics in the joint. The results indicated that the weld metal consisted of {gamma}-austenite, {delta}-ferrite and carbides without the appearance of martensite. There were dendrite crystals at the edge of the weld metal near the high nickel austenitic alloy and isometric crystals in the center of the weld metal. The microhardness of the weld metal was the highest due to the existence of carbides and its finer structure. Graphite flakes were still embedded in the austenite matrix of the heat-affected zone without the formation of martensite. (orig.)

  9. Effects of rework on adhesion of Pb-In soldered gold thick films

    International Nuclear Information System (INIS)

    Gehman, R.W.; Becka, G.A.; Losure, J.A.

    1982-02-01

    The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au 9 In 4 . It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing

  10. Microstructural variation through weld thickness and mechanical properties of peened friction stir welded 6061 aluminum alloy joints

    Energy Technology Data Exchange (ETDEWEB)

    Abdulstaar, Mustafa A., E-mail: mustafa.abdulstaar@gmail.com [Institute of Material Science and Engineering, Clausthal University of Technology, Agricolastr. 6, 38678 Clausthal-Zellerfeld (Germany); Al-Fadhalah, Khaled J. [Department of Mechanical Engineering, College of Engineering & Petroleum, Kuwait University, P.O. Box 5969, Safat 13060 (Kuwait); Wagner, Lothar [Institute of Material Science and Engineering, Clausthal University of Technology, Agricolastr. 6, 38678 Clausthal-Zellerfeld (Germany)

    2017-04-15

    The current study examined the effect of microstructure variation on the development of mechanical properties in friction stir welded joints of 6061-T6 aluminum alloy, which were subsequently processed by shot peening (SP). Following to FSW, fatigue specimens were extracted perpendicularly to the welding direction. Surface Skimming to 0.5 mm from crown and root sides of the joint was made and SP was later applied on the two sides using ceramic shots of two different Almen intensities of 0.18 mmA and 0.24 mmA. Microstructural examination by electron back scattered diffraction (EBSD) indicated variation in the grain refinement of the weld zone, with coarsest grains (5 μm) at the crown side and finest grains (2 μm) at the root side. Reduction of microhardness to 60 HV occurred in the weld zone for samples in FSW condition. Application of SP promoted significant strain hardening at the crown side, with Almen intensities of 0.24 mmA providing maximum increase in microhardness to 120 HV. On the contrary, only a maximum microhardness of 75 HV was obtained at the root side. The difference in strain hardening capability at the two sides was strongly dependent on grain size. The two Almen intensities produced similar distribution of compressive residual stresses in the subsurface regions that led to enhance the fatigue strength to the level of base metal for N ≥ 10{sup 5} cycles. Yet, the increase in fatigue strength was more pronounced with increasing Almen intensity to 0.24 mmA, demonstrating further enhancement by strain hardening. - Highlights: • Grain refinement was observed after friction stir welding of AA 6061-T6. • Reduction in microhardness and fatigue strength were obtained after welding. • Variation in grain refinement led to different hardening behavior after peening. • Shot peening induced beneficial compressive residual stresses. • Shot peening and surface skimming markedly improved the fatigue performance.

  11. Analysis of microstructural variation and mechanical behaviors in submerged arc welded joint of high strength low carbon bainitic steel

    Energy Technology Data Exchange (ETDEWEB)

    Lan, Liangyun, E-mail: lly.liangyun@gmail.com [State Key Laboratory of Rolling Technology and Automation, Northeastern University, Shenyang 110819 (China); Qiu, Chunlin; Zhao, Dewen; Gao, Xiuhua; Du, Linxiu [State Key Laboratory of Rolling Technology and Automation, Northeastern University, Shenyang 110819 (China)

    2012-12-15

    Microstructural variation in high strength low carbon bainitic steel weldment was investigated in detail by means of optical microscope, transmission electron microscope and scanning electron microscope equipped with electron backscattered diffraction. The results showed that the welded joint has various microstructures such as acicular ferrite, coarse granular ferrite and fine polygonal ferrite. The martensite-austenite (MA) constituent has a variable structure in each sub-zone, which includes fully martensite and fully retained austenite. Meanwhile, the fine grained heat affected zone has higher content of retained austenite than the welded metal (WM) and coarse grained heat affected zone (CGHAZ). The orientation relationship between retained austenite and product phases in the WM and CGHAZ is close to Kurdjumov-Sachs relationship. However, the polygonal ferrite in the fine grained HAZ has no specific orientation relationship with the neighboring retained austenite. The toughness of the coarse grained region is much lower than that of the WM because the coarse bainite contains many large MA constituents to assist the nucleation of microcracks and coarse cleavage facet lowers the ability to inhibit the crack propagation.

  12. Study on Microstructure and Mechanical Properties of 304 Stainless Steel Joints by Tig-Mig Hybrid Welding

    Science.gov (United States)

    Ogundimu, Emmanuel O.; Akinlabi, Esther T.; Erinosho, Mutiu F.

    Stainless steel is a family of Fe-based alloys having excellent resistance to corrosion and as such has been used imperatively for kitchen utensils, transportation, building constructions and much more. This paper presents the work conducted on the material characterizations of a tungsten inert gas (TIG)-metal inert gas (MIG) hybrid welded joint of type 304 austenitic stainless steel. The welding processes were conducted in three phases. The phases of welding employed are MIG welding using a current of 170A, TIG welding using a current of 190A, and a hybrid TIG-MIG welding with currents of 190/170A, respectively. The MIG, TIG, and hybrid TIG-MIG weldments were characterized with incomplete penetration, full penetration and excess penetration of weld. Intergranular austenite was created toward transition and heat affected zones. The thickness of the delta ferrite (δ-Fe) formed in the microstructures of the TIG weld is more than the thickness emerged in the microstructures of MIG and hybrid TIG-MIG welds. A TIG-MIG hybrid weld of specimen welded at the currents of 190/170A has the highest ultimate tensile strength value and percentage elongation of 397.72MPa and 35.7%. The TIG-MIG hybrid welding can be recommended for high-tech industrial applications such as nuclear, aircraft, food processing, and automobile industry.

  13. Effects of LSP on micro-structures and residual stresses in a 4 mm CLAM steel weld joints

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Xizhang, E-mail: chenxizhang@wzu.edu.cn [School of Mechanical and Electrical Engineering, Wenzhou University., Wenzhou 325035 (China); School of Materials Science and Engineering, Jiangsu University, Zhenjiang 212013, Jiangsu (China); Fang, Yuanyuan [School of Materials Science and Engineering, Jiangsu University, Zhenjiang 212013, Jiangsu (China); Zhang, Shuyan; Kelleher, Joe F. [ISIS, Rutherford Appleton Laboratory, Chilton, Didcot OX11 0QX (United Kingdom); Zhou, Jianzhong [School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, Jiangsu (China)

    2015-05-15

    The effects of laser shock processing (LSP) on the distribution of residual stress and micro-structure of China Low Activation Martensitic (CLAM) steel weldment were investigated via neutron diffraction and optical microscope (OM). A pair of 4 mm CLAM steel plates joined by GTA welding. Special attention is paid to the generation of high level compressive residual stresses introduced by LSP. Residual stress in longitudinal, normal and transversal direction at weldment surface and longitudinal stress through thickness are evaluated via neutron diffraction. Compressive residual stress after LSP occurred at more than 90% areas within the weld joint, it is almost double the areas of compressive stress compare to weldment surface before LSP. The maximum compressive normal residual stress becomes to −183 MPa after LSP from −63 MPa before LSP. The Modification of surface micro-structures including weld zone (WZ), heat affected zone (HAZ) and base metal (BM) are also discussed. Results to date demonstrate that laser shock processing has been a great potential method for the improvement of mechanical performance of components.

  14. Microstructure and mechanical properties of SiO2-BN ceramic and Invar alloy joints brazed with Ag–Cu–Ti+TiH2+BN composite filler

    Directory of Open Access Journals (Sweden)

    Y. Wang

    2016-03-01

    Full Text Available Ag–Cu–Ti + TiH2+BN composite filler was prepared to braze SiO2-BN ceramic and Invar alloy. The interfacial microstructure, mechanical properties, and residual stress distribution of the brazed joints were investigated. The results show that a wave-like Fe2Ti–Ni3Ti structure appears in the Invar substrate and a thin TiN–TiB2 reaction layer forms adjacent to the SiO2-BN ceramic. The added BN particles react with Ti to form TiN–TiB fine-particles, which is beneficial to refine the microstructure of the brazing seam and to greatly inhibit the brittle compounds formation. The interfacial microstructure at various brazing temperatures was analyzed, and the mechanism for the interfacial reactions responsible for the bonding was proposed. The maximum shear strength of the joints brazed with the composite filler at 880 °C for 10 min is 39 MPa, which is 30% greater than that brazed with Ag–Cu–Ti alloy. The improvement of the joint strength is attributed to the variation of joint microstructure and the reduction of tensile stresses induced in the SiO2-BN ceramic. The finite element analysis indicates that the peak tensile stress decreases from 230 to 142 MPa due to the addition of BN particles in the ceramic.

  15. A comparative study of the microstructure and properties of 800 MPa microalloyed C-Mn steel welded joints by laser and gas metal arc welding

    Energy Technology Data Exchange (ETDEWEB)

    Sun, Qian [The State Key Laboratory of Rolling and Automation of Northeastern University, Shenyang 110819 (China); Di, Hong-Shuang, E-mail: hongshuangdi_ral@126.com [The State Key Laboratory of Rolling and Automation of Northeastern University, Shenyang 110819 (China); Li, Jun-Chen [The State Key Laboratory of Rolling and Automation of Northeastern University, Shenyang 110819 (China); Wu, Bao-Qiang [National Key Laboratory for Precision Hot Processing of Metals, Harbin Institute of Technology, Harbin 150001 (China); Misra, R.D.K. [Laboratory for Excellence in Advanced Steel Research, Department of Metallurgical, Material and Biomedical Engineering, University of Texas at El Paso, TX 79968 (United States)

    2016-07-04

    The differences in microstructure and mechanical properties of laser beam welded (LBW) and gas metal arc welded (GMAW) joints of 800 MPa grade Nb-Ti-Mo microalloyed C-Mn steel of 5 mm thickness were studied. The study suggested that the microstructure in welded seam (WS) of GMAW was acicular ferrite and fine grained ferrite, whereas lath martensite (LM) was obtained in WS of LBW, where inclusions were finer and did not act as nucleation sites for acicular ferrite. The microstructure of coarse-grained HAZ (CGHAZ) obtained using the two welding methods was LM and granular bainite (GB), respectively. The original austenite grain size in CGHAZ of LBW was 1/3 of GMAW. The microstructure of fine-grained HAZ and mixed-grained HAZ using the two welding methods was ferrite and M-A constituents, while that of LBW was significantly fine. The hardness of LBW welded joints was higher than the base metal (BM), which was the initiation site for tensile fracture. The tensile fracture location of GMAW welded joints was in WS. The impact toughness of LBW welded joints was excellent and the impact absorption energy was similar to BM.

  16. Microstructure of Welded Joints of X5CrNiCuNb16-4 (17-4 PH Martensitic Stainlees Steel After Heat Treatment

    Directory of Open Access Journals (Sweden)

    Ziewiec A.

    2014-10-01

    Full Text Available The paper presents rezults of microstructure (LM, TEM investigation and hardness measurments of welded joints in martensitic precipitation hardened stainless steel containing copper, subjected to heat treatment. For the aging temperature up to 540 °C even for the very long times, the microstructure of the welded joints is similar to this one at lower temerature aging. After aging at 620 °C a distinct change of the microstructure was observed. Non-equilibrium solidification conditions of the weld metal, segregation and the diffusion of copper and the elements stablilizing the austenite cause the occurrence of the reverse transformation of the martensite into austenite as fast as just 1 hour at 620 °C. TEM investigations revealed the differences in dispersion of hardening copper precipitates after aging at temperature 620 °C for 1 and 4 hours.

  17. Effect of microstructural variation on the Cu/CK45 carbon steel friction weld joint

    Energy Technology Data Exchange (ETDEWEB)

    Lee, W.B.; Jung, S.B. [Advanced Materials and Process Research Center for IT, Sungkyunkwan Univ., Gyounggi-do (Korea)

    2003-12-01

    The mechanical properties of friction-welded pure Cu/CK45 carbon steel joints have been studied. The joint strength increased with increasing upset pressure till it reached a critical value. However, the joint strength was fixed at a low strength with increasing friction time, compared to that of the Cu base metal. The hardness near the interface at the Cu side was softer than that of the base metal due to the dynamically recrystallized and annealed grain. The width of the softened region became wider with increasing friction time and decreasing upset pressure. But the hardness of the CK45 carbon steel side showed a slightly higher value than that of the base metal. This result was explained by the formation of martensite structure at the CK45 carbon steel side during the welding process. (orig.)

  18. Microstructure of friction stir welded joints of 2017A aluminium alloy sheets.

    Science.gov (United States)

    Mroczka, K; Dutkiewicz, J; Pietras, A

    2010-03-01

    The present study examines a friction stir welded 2017A aluminium alloy. Transmission electron microscope investigations of the weld nugget revealed the average grain size of 5 microm, moderate density of dislocations as well as the presence of nanometric precipitates located mostly in grains interiors. Scanning electron microscope observations of fractures showed the presence of ductile fracture in the region of the weld nugget with brittle precipitates in the lower part. The microhardness analysis performed on the cross-section of the joints showed fairly small changes; however, after the artificial ageing process an increase in hardness was observed. The change of the joint hardness subject to the ageing process indicates partial supersaturation in the material during friction stir welding and higher precipitation hardening of the joint.

  19. Microstructural investigation of the heat-affected zone of simulated welded joint of P91 steel

    Directory of Open Access Journals (Sweden)

    T. Vuherer

    2013-07-01

    Full Text Available In the process of testing real components exposed to elevated temperature, it is not possible to neglect cracks. The most significant cracks can be induced by welding, which is applied for joining of structural components. Pressure equipment in service is also exposed to high pressure and high stresses. Materials for their manufacturing are designed to resist high stress at elevated temperature, and to meet requirements regarding creep resistance. The objective of this study is to investigate microstructure of different regions of the heat affected zone in T/P91 steels by using thermal simulation instead of welding.

  20. Microstructure and pitting corrosion of friction stir welded joints in 2219-O aluminum alloy thick plate

    International Nuclear Information System (INIS)

    Xu Weifeng; Liu Jinhe

    2009-01-01

    Effect of welding parameters on the microstructure and pitting corrosion of different positions along the thickness of weld nugget zone in friction stir welded 2219-O aluminum alloy plate was investigated using scanning electron microscopy (SEM), polarization experiment and electrochemical impedance tests (EIS). It was found that the material presents significant passivation and the top has best corrosion resistance compared to the bottom and base material. Corrosion resistance decreases with the increase of traverse speed from 60 to 100 mm/min at rotary speed 400 rpm. Corrosion resistance at rotary speed 600 rpm is lower than that at 500 rpm.

  1. The Microstructure and Pitting Resistance of Weld Joints of 2205 Duplex Stainless Steel

    Science.gov (United States)

    Wu, Mingfang; Liu, Fei; Pu, Juan; Anderson, Neil E.; Li, Leijun; Liu, Dashuang

    2017-11-01

    2205 duplex stainless steel (DSS) was welded by submerged arc welding. The effects of both heat input and groove type on the ferrite/austenite ratio and elemental diffusion of weld joints were investigated. The relationships among welding joint preparation, ferrite/austenite ratio, elemental diffusion, and pitting corrosion resistance of weld joints were analyzed. When the Ni content of the weld wire deposit was at minimum 2-4% higher than that of 2205 DSS base metal, the desired ratio of ferrite/austenite and elemental partitioning between the austenite and ferrite phases were obtained. While the pitting sensitivity of weld metal was higher than that of base metal, the self-healing capability of the passive film of weld metal was better than that of the base metal when a single V-type groove was used. Furthermore, the heat input should be carefully controlled since pitting corrosion occurred readily in the coarse-grained heat-affected zone near the fusion line of welded joints.

  2. Handbook of machine soldering SMT and TH

    CERN Document Server

    Woodgate, Ralph W

    1996-01-01

    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  3. Interfacial microstructure of partial transient liquid phase bonded Si3N4-to-Inconel 718 joints

    International Nuclear Information System (INIS)

    Kim, Jae Joong; Park, Jin-Woo; Eagar, Thomas W.

    2003-01-01

    This work presents transmission electron microscopy (TEM) analysis of the interfacial microstructure in Si 3 N 4 -to-Inconel 718 joints with Ni interlayers produced by partial transient liquid phase bonding (PTLPB). Ti and Cu microfoils have been inserted between Si 3 N 4 and the Ni interlayer and joining has been performed at lower temperatures than previous PTLPBs of Si 3 N 4 with the same insert metals. The TEM work is focused on phase identification of the reaction layers between the Si 3 N 4 and the Ni interlayer. According to the TEM analysis, most of the Cu precipitates without reacting with Ti and Ni. Si diffused in the filler metal and thin reaction layer formed at the interface between Si 3 N 4 and the filler metal producing good bond-formation and hence, high interfacial strength. No interfacial fractures occurred after cooling from the bonding temperature of 900 deg. C, which supports the results observed in the TEM analysis. This work confirms that this joining process can produce a more heat resistant Si 3 N 4 -to-Inconel 718 joint than active brazing using Ag-Cu-Ti alloys

  4. Study on microstructure and mechanical characteristics of low-carbon steel and ferritic stainless steel joints

    Energy Technology Data Exchange (ETDEWEB)

    Sarkari Khorrami, Mahmoud; Mostafaei, Mohammad Ali; Pouraliakbar, Hesam, E-mail: hpouraliakbar@alum.sharif.edu; Kokabi, Amir Hossein

    2014-07-01

    In this work, examinations on the microstructure and mechanical properties of plain carbon steel and AISI 430 ferritic stainless steel dissimilar welds are carried out. Welding is conducted in both autogenous and using ER309L austenitic filler rod conditions through gas tungsten arc welding process. The results indicate that fully-ferritic and duplex ferritic–martensitic microstructures are formed for autogenous and filler-added welds, respectively. Carbide precipitation and formation of martensite at ferrite grain boundaries (intergranular martensite) as well as grain growth occur in the heat affected zone (HAZ) of AISI 430 steel. It is found that weld heat input can strongly affect grain growth phenomenon along with the amount and the composition of carbides and intergranular martensite. Acquired mechanical characteristics of weld in the case of using filler metal are significantly higher than those of autogenous one. Accordingly, ultimate tensile strength (UTS), hardness, and absorbed energy during tensile test of weld metal are increased from 662 MPa to 910 MPa, 140 Hv to 385 Hv, and 53.6 J m{sup −3} to 79 J m{sup −3}, respectively by filler metal addition. From fracture surfaces, predominantly ductile fracture is observed in the specimen welded with filler metal while mainly cleavage fracture occurs in the autogenous weld metal.

  5. Pressure brazing of ceramics to metals with copper solder

    International Nuclear Information System (INIS)

    Pavlova, M.A.; Metelkin, I.I.

    1986-01-01

    The effect on the quality of joints brazed with copper of different non metallized aluminooxide dielectrics with metals and alloys of a series of technological parameters (temperature, pressure, holding, and medium) in the course of pressure brazing is investigated. It is shown that in case of brazing with kovar and nickel the character of dependences is identical, however in all cases the joints with nickel are more durable. For the ceramics - molybdenum system characterized by weak interaction with copper solder kinetic dependences have no maximum and only under holding of more than 20 min the constant strength of 150-190 MPa is attained

  6. Microstructure and Porosity of Laser-welded Dissimilar Material Joints of HR-2 and J75

    Science.gov (United States)

    Shen, Xianfeng; Teng, Wenhua; Zhao, Shuming; He, Wenpei

    Dissimilar laser welding of HR-2 and J75 has a wide range of applications in high-and low-temperature hydrogen storage. The porosity distributions of the welded joints were investigated at different line energies, penetration status, and welding positions (1G, 2G, and 3G). The effect of the welding position on the welding appearance was evident only at high line energies because of the essential effect of gravity of the larger and longer dwelling molten pool. The porosity of the welded joints between the solutionised and aged J75 and HR-2 at the 3G position and partial penetration was located at the weld centre line, while the porosity at the 2G position with full penetration was distributed at the weld edges, which is consistent with the distribution of floating slag. Full keyhole penetration resulted in minimum porosity, partial penetration resulted in moderate porosity, and periodic molten pool penetration resulted in maximum porosity.

  7. Modeling microstructure of incudostapedial joint and the effect on cochlear input

    Science.gov (United States)

    Gan, Rong Z.; Wang, Xuelin

    2015-12-01

    The incudostapedial joint (ISJ) connects the incus to stapes in human ear and plays an important role for sound transmission from the tympanic membrane (TM) to cochlea. ISJ is a synovial joint composed of articular cartilage on the lenticular process and stapes head with the synovial fluid between them. However, there is no study on how the synovial ISJ affects the middle ear and cochlear functions. Recently, we have developed a 3-dimensinal finite element (FE) model of synovial ISJ and connected the model to our comprehensive FE model of the human ear. The motions of TM, stapes footplate, and basilar membrane and the pressures in scala vestibule and scala tympani were derived over frequencies and compared with experimental measurements. Results show that the synovial ISJ affects sound transmission into cochlea and the frequency-dependent viscoelastic behavior of ISJ provides protection for cochlea from high intensity sound.

  8. The critical oxide thickness for Pb-free reflow soldering on Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)

    2012-06-01

    Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

  9. MICROSTRUCTURE AND FATIGUE PROPERTIES OF DISSIMILAR SPOT WELDED JOINTS OF AISI 304 AND AISI 1008

    Directory of Open Access Journals (Sweden)

    Nachimani Charde

    2013-06-01

    Full Text Available Carbon steel and stainless steel composites are being more frequently used for applications requiring a corrosion resistant and attractive exterior surface and a high strength structural substrate. Spot welding is a potentially useful and efficient jointing process for the production of components consisting of these two materials. The spot welding characteristics of weld joints between these two materials are discussed in this paper. The experiment was conducted on dissimilar weld joints using carbon steel and 304L (2B austenitic stainless steel by varying the welding currents and electrode pressing forces. Throughout the welding process; the electrical signals from the strain sensor, current transducer and terminal voltage clippers are measured in order to understand each and every millisecond of the welding process. In doing so, the dynamic resistances, heat distributions and forging forces are computed for various currents and force levels within the good welds’ regions. The other process controlling parameters, particularly the electrode tip and weld time, remained constant throughout the experiment. The weld growth was noted for the welding current increment, but in the electrode force increment it causes an adverse reaction to weld growth. Moreover, the effect of heat imbalance was clearly noted during the welding process due to the different electrical and chemical properties. The welded specimens finally underwent tensile, hardness and metallurgical testing to characterise the weld growth.

  10. Microstructure and Mechanical Properties of Ultrasonic Spot Welded Mg/Al Alloy Dissimilar Joints

    Directory of Open Access Journals (Sweden)

    He Peng

    2018-04-01

    Full Text Available Lightweight structural applications of magnesium and aluminum alloys inevitably necessitate welding and joining, especially dissimilar welding between these alloys. The objective of this study was to examine the feasibility of joining ZEK100 Mg alloy to Al6022 alloy via ultrasonic spot welding, focusing on effects of welding energy. An interface diffusion layer consisting of α-Mg and Al12Mg17 eutectic structure was observed to form, with its thickness increased from ~0.5 µm to ~30 µm with increasing welding energy from 500 J to 2000 J. The tensile lap shear peak load or strength and critical stress intensity of the welded joints first increased and then decreased with increasing welding energy, with their peak values achieved at 750 J. Fatigue life of the joints made at 750 J and 2000 J was equivalent at the lower cyclic loading levels, while it was longer for the joints made at 750 J at the higher cyclic loading levels. Fatigue fracture mode changed from interfacial failure to mainly transverse-through-thickness crack growth with decreasing cyclic loading level, which corresponded well to the bi-linear characteristic of S-N curves. Crack initiation basically occurred at the weld nugget border and at the interface between the two sheets, which can be understood via a theoretical stress analysis.

  11. Effect of Activated Flux on the Microstructure, Mechanical Properties, and Residual Stresses of Modified 9Cr-1Mo Steel Weld Joints

    Science.gov (United States)

    Maduraimuthu, V.; Vasudevan, M.; Muthupandi, V.; Bhaduri, A. K.; Jayakumar, T.

    2012-02-01

    A novel variant of tungsten inert gas (TIG) welding called activated-TIG (A-TIG) welding, which uses a thin layer of activated flux coating applied on the joint area prior to welding, is known to enhance the depth of penetration during autogenous TIG welding and overcomes the limitation associated with TIG welding of modified 9Cr-1Mo steels. Therefore, it is necessary to develop a specific activated flux for enhancing the depth of penetration during autogeneous TIG welding of modified 9Cr-1Mo steel. In the current work, activated flux composition is optimized to achieve 6 mm depth of penetration in single-pass TIG welding at minimum heat input possible. Then square butt weld joints are made for 6-mm-thick and 10-mm-thick plates using the optimized flux. The effect of flux on the microstructure, mechanical properties, and residual stresses of the A-TIG weld joint is studied by comparing it with that of the weld joints made by conventional multipass TIG welding process using matching filler wire. Welded microstructure in the A-TIG weld joint is coarser because of the higher peak temperature in A-TIG welding process compared with that of multipass TIG weld joint made by a conventional TIG welding process. Transverse strength properties of the modified 9Cr-1Mo steel weld produced by A-TIG welding exceeded the minimum specified strength values of the base materials. The average toughness values of A-TIG weld joints are lower compared with that of the base metal and multipass weld joints due to the presence of δ-ferrite and inclusions in the weld metal caused by the flux. Compressive residual stresses are observed in the fusion zone of A-TIG weld joint, whereas tensile residual stresses are observed in the multipass TIG weld joint.

  12. Mechanisms of joint and microstructure formation in high power ultrasonic spot welding 6111 aluminium automotive sheet

    International Nuclear Information System (INIS)

    Bakavos, D.; Prangnell, P.B.

    2010-01-01

    Resistance spot welding (RSW) is difficult to apply to aluminium automotive alloys. High power ultrasonic spot welding (HP-USW) is a new alternative method which is extremely efficient, using ∼2% of the energy of RSW. However, to date there have been few studies of the mechanisms of bond formation and the material interactions that take place with this process. Here, we report on a detailed investigation where we have used X-ray tomography, high resolution SEM, and EBSD, and dissimilar alloy welds, to track the interface position and characterise the stages of weld formation, and microstructure evolution, as a function of welding energy. Under optimum conditions high quality welds are produced, showing few defects. Welding proceeds by the development and spread of microwelds, until extensive plastic deformation occurs within the weld zone, where the temperature reaches ∼380 deg. C. The origin of the weld interface 'flow features' characteristic of HP-USW are discussed.

  13. Microstructure and Strain Rate-Dependent Tensile Deformation Behavior of Fiber Laser-Welded Butt Joints of Dual-Phase Steels

    Science.gov (United States)

    Liu, Yang; Dong, Danyang; Han, Zhiqiang; Yang, Zhibin; Wang, Lu; Dong, Qingwei

    2018-05-01

    The microstructure and tensile deformation behavior of the fiber laser-welded similar and dissimilar dual-phase (DP) steel joints over a wide range of strain rates from 10-3 to 103 s-1 were investigated for the further applications on the lightweight design of vehicles. The high strain rate dynamic tensile deformation process and full-field strain distribution of the base metals and welded joints were examined using the digital image correlation method and high-speed photography. The strain rate effects on the stress-strain responses, tensile properties, deformation, and fracture behavior of the investigated materials were analyzed. The yield stress (YS) and ultimate tensile strength (UTS) of the dissimilar DP780/DP980 welded joints were lying in-between those of the DP780 and DP980 base metals, and all materials exhibited positive strain rate dependence on the YS and UTS. Owing to the microstructure heterogeneity, the welded joints showed relatively lower ductility in terms of total elongation (TE) than those of the corresponding base metals. The strain localization started before the maximum load was reached, and the strain localization occurred earlier during the whole deformation process with increasing strain rate. As for the dissimilar welded joint, the strain localization tended to occur in the vicinity of the lowest hardness value across the welded joint, which was in the subcritical HAZ at the DP780 side. As the strain rate increased, the typical ductile failure characteristic of the investigated materials did not change.

  14. Microstructure and Strain Rate-Dependent Tensile Deformation Behavior of Fiber Laser-Welded Butt Joints of Dual-Phase Steels

    Science.gov (United States)

    Liu, Yang; Dong, Danyang; Han, Zhiqiang; Yang, Zhibin; Wang, Lu; Dong, Qingwei

    2018-04-01

    The microstructure and tensile deformation behavior of the fiber laser-welded similar and dissimilar dual-phase (DP) steel joints over a wide range of strain rates from 10-3 to 103 s-1 were investigated for the further applications on the lightweight design of vehicles. The high strain rate dynamic tensile deformation process and full-field strain distribution of the base metals and welded joints were examined using the digital image correlation method and high-speed photography. The strain rate effects on the stress-strain responses, tensile properties, deformation, and fracture behavior of the investigated materials were analyzed. The yield stress (YS) and ultimate tensile strength (UTS) of the dissimilar DP780/DP980 welded joints were lying in-between those of the DP780 and DP980 base metals, and all materials exhibited positive strain rate dependence on the YS and UTS. Owing to the microstructure heterogeneity, the welded joints showed relatively lower ductility in terms of total elongation (TE) than those of the corresponding base metals. The strain localization started before the maximum load was reached, and the strain localization occurred earlier during the whole deformation process with increasing strain rate. As for the dissimilar welded joint, the strain localization tended to occur in the vicinity of the lowest hardness value across the welded joint, which was in the subcritical HAZ at the DP780 side. As the strain rate increased, the typical ductile failure characteristic of the investigated materials did not change.

  15. Effect of Welding Processes on the Microstructure, Mechanical Properties and Residual Stresses of Plain 9Cr-1Mo Steel Weld Joints

    Science.gov (United States)

    Nagaraju, S.; Vasantharaja, P.; Brahadees, G.; Vasudevan, M.; Mahadevan, S.

    2017-12-01

    9Cr-1Mo steel designated as P9 is widely used in the construction of power plants and high-temperature applications. It is chosen for fabricating hexcan fuel subassembly wrapper components of fast breeder reactors. Arc welding processes are generally used for fabricating 9Cr-1Mo steel weld joints. A-TIG welding process is increasingly being adopted by the industries. In the present study, shielded metal arc (SMA), tungsten inert gas (TIG) and A-TIG welding processes are used for fabricating the 9Cr-1Mo steel weld joints of 10 mm thickness. Effect of the above welding processes on the microstructure evolution, mechanical properties and residual stresses of the weld joints has been studied in detail. All the three weld joints exhibited comparable strength and ductility values. 9Cr-1Mo steel weld joint fabricated by SMAW process exhibited lower impact toughness values caused by coarser grain size and inclusions. 9Cr-1Mo steel weld joint fabricated by TIG welding exhibited higher toughness due to finer grain size, while the weld joint fabricated by A-TIG welding process exhibited adequate toughness values. SMA steel weld joint exhibited compressive residual stresses in the weld metal and HAZ, while TIG and A-TIG weld joint exhibited tensile residual stresses in the weld metal and HAZ.

  16. Study on interfacial reaction between lead-free solders and alternative surface finishes

    International Nuclear Information System (INIS)

    Siti Rabiatul Aisha; Ourdjini, A.; Saliza Osman

    2007-01-01

    This study investigates the interfacial reactions occurring during reflow soldering between Sn-Ag-Cu lead-free solder and two surface finishes: electroless nickel/ immersion gold (ENIG) and immersion silver (IAg). The study focuses on interfacial reactions evolution and growth kinetics of intermetallic compounds (IMC) formed during soldering and isothermal ageing at 150 degree Celsius for up to 2000 hours. Optical and scanning electron microscopy were used to measure IMC thickness and examine the morphology of IMC respectively, whereas the IMC phases were identified by energy dispersive X-ray analysis (EDX). The results showed that the IMC formed on ENIG finish is thinner compared to that formed on IAg finish. For IAg surface finish, Cu 6 Sn 5 IMCs with scallop morphology are formed at the solder/ surface finish interface after reflow while a second IMC, Cu 3 Sn was formed between the copper and Cu 6 Sn 5 IMC after the isothermal ageing treatment. For ENIG surface finish both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 are formed after soldering. Isothermal aging of the solder joints formed on ENIG finish was found to have a significant effect on the morphology of the intermetallics by transforming to more spherical and denser morphology in addition to increase i their thickness with increased ageing time. (author)

  17. Mechanical properties and microstructure of model lead-free joints for electronics made with use of nanopowders

    Czech Academy of Sciences Publication Activity Database

    Buršík, Jiří; Buršíková, V.; Pešina, Z.; Sopoušek, J.

    2012-01-01

    Roč. 106, SI (2012), s390-s392 ISSN 0009-2770. [Local Mechanical Properties 2011. Olomouc, 09.11.2011-11.11.2011] R&D Projects: GA ČR(CZ) GA106/09/0700 Institutional research plan: CEZ:AV0Z20410507 Keywords : solder * silver nanopowdwer * nanoindentation Subject RIV: JG - Metallurgy Impact factor: 0.453, year: 2012

  18. Instantaneous fluxless bonding of Au with Pb-Sn solder in ambient atmosphere

    International Nuclear Information System (INIS)

    Lee, T.K.; Zhang, Sam; Wong, C.C.; Tan, A.C.

    2005-01-01

    A fluxless bonding technique has been developed as a method of flip-chip bonding for microelectronic packaging. The fluxless bonding technique can be achieved instantaneously in an ambient environment between metallic stud bumps and predefined molten solder. This paper describes the mechanics of the bonding action and verifies the effectiveness of this bonding method through wetting balance tests and scanning electron microscope and energy dispersive x-ray analysis. This technique has been demonstrated by using a gold stud bump to break the tin oxide layer over molten solder. This allows for a fast, solid liquid interdiffusion between gold (Au) and the fresh molten eutectic lead-tin (Pb-Sn) solder for joint formation during solidification. This bonding method has been successfully tested with 130-μm-pitch flip-chip bond pads on a joint-in-via flex substrate architecture

  19. Microstructural characterization and finite element modeling of AZ31 magnesium alloys welded joints

    Directory of Open Access Journals (Sweden)

    José A. Segarra

    2018-03-01

    Full Text Available In this article, it has been studied how the microstructure of AZ31 magnesium alloy can be affected by the thermic cycles produced by welding processes, trying to modeling by element finite software the thermic cycles in this material. The AZ31 samples tested were welded using Gas Tugsten Arc Welding (GTAW and different filler materials. For this investigation, optic microscopy, scanning electronic microscopy, and finite elements method software has been used. This work indicates in one hand that in this type of alloys the microconstituyentes are Al-Mn o Al-Mn-Mg compounds, the presence of β-phase cannot be found at room temperature in this research at room, on the other hand the obtained simulation models indicate that the recrystallization takes place in the areas which reach maximum temperatures around 550 °C, this value is also the limit of the dissolution area for the Al-Mn o Al-Mn-Mg precipitated particles which are very likely to act as inhibitors of the corrosion in NaCl electrolytes.

  20. Spectroscopic investigation of oxidized solder surfaces

    International Nuclear Information System (INIS)

    Song, Jenn-Ming; Chang-Chien, Yu-Chien; Huang, Bo-Chang; Chen, Wei-Ting; Shie, Chi-Rung; Hsu, Chuang-Yao

    2011-01-01

    Highlights: → UV-visible spectroscopy is successfully used to evaluate the degree of discoloring of solders. → The surface oxides of solders can also be identified by UV-visible absorption spectra. → The discoloration of solder surface can be correlated with optical characterization of oxides. → A strategy against discoloring by alloying was also suggested. - Abstract: For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV-vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible region. A trace of P can effectively depress the discoloration of solders under both solid and semi-solid states through the suppression of SnO.

  1. Interfacial microstructure and mechanical property of Ti6Al4V/A6061 dissimilar joint by direct laser brazing without filler metal and groove

    International Nuclear Information System (INIS)

    Song, Zhihua; Nakata, Kazuhiro; Wu, Aiping; Liao, Jinsun

    2013-01-01

    Laser brazing of Ti6Al4V and A6061-T6 alloys with 2 mm thickness was conducted by focusing laser beam on aluminum alloy side, and the effect of laser offset distance on microstructure and mechanical properties of the dissimilar butt joint was investigated. Laser offset has a great influence on the thickness of interfacial intermetallic compound (IMC) layer and the mechanical property of joint. The thickness of interfacial IMC layer is less than 500 nm, and the average tensile strength of the joint reaches 64% of aluminum base material strength, when suitable welding conditions are used. The interfacial IMC is TiAl 3 . The formation of interfacial IMC layer and its effect on mechanical property of the joint are discussed in the present study.

  2. Fabrication of high-quality brazed joints

    International Nuclear Information System (INIS)

    Orlov, A.V.

    1980-01-01

    Problem of ensuring of joint high-quality when brazing different parts in power engineering is considered. To obtain high-quality joints it is necessary to correctly design brazed joint and to choose a gap width, overlap length and fillet radius; to clean up carefully the surfaces to be brazed and fix them properly one relative to another; to apply a solder so as to provide its flowing into the gap and sticking in it; to exactly regulate thermal conditions of brazing. High quality and reliability of brazed joints are ensured by the application of solders based on noble metals, and cheap solders based on nickel, manganese and copper. Joints brazed with nickel base solders may operate at temperatures as high as 888 deg C

  3. Effect of Al-Si Coating on Weld Microstructure and Properties of 22MnB5 Steel Joints for Hot Stamping

    Science.gov (United States)

    Lin, Wenhu; Li, Fang; Wu, Dongsheng; Chen, Xiaoguan; Hua, Xueming; Pan, Hua

    2018-03-01

    22MnB5 hot stamping steels are gradually being used in tailor-welded blank applications. In this experiment, 1-mm-thick Al-Si coated and de-coated 22MnB5 steels were laser-welded and then hot-stamped. The chemical compositions, solidification process, microstructure and mechanical properties were investigated to reveal the effect of Al-Si coating and heat treatment. In the welded condition, the coated joints had an Al content of approximately 2.5 wt.% in the fusion zone and the de-coated joints had 0.5 wt.% Al. The aluminum promoted the δ-ferrite formation as the skeletal structure during solidification. In the high-aluminum weld, the microstructure consisted of martensite and long and band-like δ-ferrite. Meanwhile, the low-aluminum weld was full of lath martensite. After the hot stamping process, the δ-ferrite fraction increased from 10 to 24% in the coated joints and the lath martensite became finer in the de-coated joints. The tensile strengths of the coated joints or de-coated joints were similar to that before hot stamping, but the strength of the coated joints was reduced heavily after hot stamping compared to the de-coated joints and base material. The effect of δ-ferrite on the tensile properties became stronger when the fusion zone was soft and deformed first in the hot-stamped specimens. The coated weld showed a brittle fracture surface with many cleavage planes, and the de-coated weld showed a ductile fracture surface with many dimples in hot-stamped conditions.

  4. Effect of holding time on the microstructure and strength of tungsten/ferritic steel joints diffusion bonded with a nickel interlayer

    International Nuclear Information System (INIS)

    Zhong Zhihong; Hinoki, Tatsuya; Kohyama, Akira

    2009-01-01

    The microstructural development and mechanical properties of a tungsten/ferritic steel diffusion joint with a Ni interlayer, bonded at 900 deg. C under vacuum for 0.5-2 h, were investigated. Cross-sectional images of the W/Ni diffusion zone indicate the presence of a Ni-rich solid solution, Ni(W), for holding times up to 1.5 h. However, an intermetallic compound Ni 4 W grew as a distinguishable layer between the W and Ni(W) when the holding time was increased to 2 h. The growth behavior of diffusion layers and their growth mechanism is discussed. On the other hand, smooth changes in concentration of various elements across the Ni/steel interface were observed for the joints annealed at the holding time studied. An average bond strength of 215 MPa was obtained for the joint bonded for 1 h; this bond strength decreased as holding time increased. Variations in the strength of the joints was significantly related to the microstructural development of the diffusion zone. The formation of Ni 4 W and a solid solution phase enhanced hardness at the interfaces but reduced strength of the joints.

  5. Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys

    Science.gov (United States)

    Reeve, Kathlene N.; Anderson, Iver E.; Handwerker, Carol A.

    2015-03-01

    Lead-free solder alloys Sn-Cu (SC) and Sn-Ag-Cu (SAC) are widely used by the microelectronics industry, but enhanced control of the microstructure is needed to improve solder performance. For such control, nucleation and stability of Cu-Al intermetallic compound (IMC) solidification catalysts were investigated by variation of the Cu (0.7-3.0 wt.%) and Al (0.0-0.4 wt.%) content of SC + Al and SAC + Al alloys, and of SAC + Al ball-grid array (BGA) solder joints. All of the Al-modified alloys produced Cu-Al IMC particles with different morphologies and phases (occasionally non-equilibrium phases). A trend of increasing Cu-Al IMC volume fraction with increasing Al content was established. Because of solidification of non-equilibrium phases in wire alloy structures, differential scanning calorimetry (DSC) experiments revealed delayed, non-equilibrium melting at high temperatures related to quenched-in Cu-Al phases; a final liquidus of 960-1200°C was recorded. During cooling from 1200°C, the DSC samples had the solidification behavior expected from thermodynamic equilibrium calculations. Solidification of the ternary alloys commenced with formation of ternary β and Cu-Al δ phases at 450-550°C; this was followed by β-Sn, and, finally, Cu6Sn5 and Cu-Al γ1. Because of the presence of the retained, high-temperature phases in the alloys, particle size and volume fraction of the room temperature Cu-Al IMC phases were observed to increase when the alloy casting temperature was reduced from 1200°C to 800°C, even though both temperatures are above the calculated liquidus temperature of the alloys. Preliminary electron backscatter diffraction results seemed to show Sn grain refinement in the SAC + Al BGA alloy.

  6. Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

    Science.gov (United States)

    Hammad, A. E.; El-Taher, A. M.

    2014-11-01

    The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

  7. Microstructural evolution and characterisation of interfacial phases in Al2O3/Ag–Cu–Ti/Al2O3 braze joints

    International Nuclear Information System (INIS)

    Ali, Majed; Knowles, Kevin M.; Mallinson, Phillip M.; Fernie, John A.

    2015-01-01

    Alumina ceramics with different levels of purity have been joined to themselves using an active braze alloy (ABA) Ag–35.3Cu–1.8Ti wt.% and brazing cycles that peak at temperatures between 815 °C and 875 °C for 2 to 300 min. The microstructures of the joints have been studied using scanning electron microscopy, transmission electron microscopy, and energy dispersive X-ray spectroscopy. A limited number of joints prepared with the ABA Ag–26.7Cu–4.5Ti wt.% have also been studied. In terms of characterising the interfacial phases, efforts were made to understand the interfacial reactions, and to determine the influence of various brazing parameters, such as the peak temperature (T p ) and time at T p (τ), on the microstructure. In addition, the extent to which impurities in the alumina affect the interfacial microstructure has been determined. Ti 3 Cu 3 O has been identified as the main product of the reactions at the ABA/alumina interfaces. At the shortest joining time used, this phase was observed in the form of a micron-size continuous layer in contact with the ABA, alongside a nanometre-size layer on the alumina that was mostly composed of γ-TiO grains. Occasionally, single grains of Ti 3 O 2 were observed in the thin layer on alumina. In the joints prepared with Ag–35.3Cu–1.8Ti wt.%, the interfacial structure evolved considerably with joining time, eventually leading to a high degree of inhomogeneity across the length of the joint at the highest T p . The level of purity of alumina was not found to affect the overall interfacial microstructure, which is attributed to the formation of various solid solutions. It is suggested that Ti 3 Cu 3 O forms initially on the alumina. Diffusion of Ti occurs subsequently to form titanium oxide at the Ti 3 Cu 3 O/alumina interface

  8. Circuit reliability boosted by soldering pins of disconnect plugs to sockets

    Science.gov (United States)

    Pierce, W. B.

    1964-01-01

    Where disconnect pins must be used for wiring and testing a circuit, improved system reliability is obtained by making a permanent joint between pins and sockets of the disconnect plug. After the circuit has been tested, contact points may be fused through soldering, brazing, or welding.

  9. Abnormal microstructure in the weld zone of linear friction welded Ti–6.5Al–3.5Mo–1.5Zr–0.3Si titanium alloy joint and its influence on joint properties

    Energy Technology Data Exchange (ETDEWEB)

    Li, Wenya, E-mail: liwy@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi' an 710072 (China); Suo, Juandi; Ma, Tiejun; Feng, Yan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi' an 710072 (China); Kim, KeeHyun [School of Metallurgy and Materials, University of Birmingham, Edgbaston, Birmingham B15 2TT (United Kingdom)

    2014-04-01

    A detailed investigation on an unexpected abnormal microstructure formed near the weld line in the linear friction welded Ti–6.5Al–3.5Mo–1.5Zr–0.3Si titanium alloy joint had been performed. Microstructure observations with the help of optical microscope, electron backscatter diffraction and transmission electron microscope with an energy dispersive X-ray spectroscopy were conducted to determine the compositions and phases near the weld line. The results indicate that the abnormal microstructure may be obtained at a low friction pressure and consists of α phase in the form of spherical particles. Tensile strength and fracture characteristics were also examined to clarify the influence of α grains. It is found that the tensile strength is only about 49% of the parent material. The explanation to the formation of spherical α is that lamellar α breaks up, spheroidizes and coalesces to form bigger particles by squeezing out the softer intergranular β phase. The effect of post-weld heat treatment (PWHT) was also investigated to optimize the joint microstructure and mechanical properties. The results suggest that the defects still exist after PWHT, and consequently the appropriate process parameters should be used to achieve a good weld.

  10. Creep behavior and evolution of microstructure of modified Grade 91 welded joint after short term exposure at 500 deg C

    International Nuclear Information System (INIS)

    Vivier, F.

    2009-03-01

    With the increase in worldwide energy demand, the nuclear industry is a way of producing electricity on a large scale and to answer to this need. For the design of a new generation of fission nuclear reactors and among six chosen fission reactor systems, France develops in particularly the Very High Temperature Reactor (VHTR) concept. This implies the use of materials that are more and more resistant to high temperature for long-term exposure. AREVA focuses on materials already used in fossil-fuel power plant, so that the mechanical behaviour of Grade 91 (Fe 9 Cr 1 MoNbV) has to be investigated. This ferritic-martensitic steel is considered to be a potential candidate for welded components. Such structures are combined with welded joints, which have to be studied. Three industrial partners (AREVA, CEA, EDF) have launched a study with the Centre des Materiaux in order to investigate the creep of welded joint of Grade 91. The aim of this work is to complete the available database about the mechanical behaviour of Grade 91, base metal and welded joint, during creep tests performed at 500 C up to 4500 h exposure. Thermal aging tests, tensile tests, and creep tests were performed at 450 C and 500 C using both base metal and cross-weld samples. Several geometries of cross-weld creep specimens were tested. The microstructure has not remarkably changed after tests concerning both nature and size of precipitates, and the characteristic size of the matrix sub-structure. The creep damage is not developed in the ruptured specimens after creep tests. Only little damage by cavity nucleation and growth was found in the creep specimens. Creep fracture at 500 C takes places by viscoplastic flow, contrary to tests performed at 625 C where the creep-induced damage governs the creep rupture at least for long-term lifetime. From creep curves of base metal and cross-weld specimens, a phenomenological model is proposed. The flow rule is a Norton power law with a stress exponent of 19 in

  11. On the Process-Related Rivet Microstructural Evolution, Material Flow and Mechanical Properties of Ti-6Al-4V/GFRP Friction-Riveted Joints

    Directory of Open Access Journals (Sweden)

    Natascha Z. Borba

    2017-02-01

    Full Text Available In the current work, process-related thermo-mechanical changes in the rivet microstructure, joint local and global mechanical properties, and their correlation with the rivet plastic deformation regime were investigated for Ti-6Al-4V (rivet and glass-fiber-reinforced polyester (GF-P friction-riveted joints of a single polymeric base plate. Joints displaying similar quasi-static mechanical performance to conventional bolted joints were selected for detailed characterization. The mechanical performance was assessed on lap shear specimens, whereby the friction-riveted joints were connected with AA2198 gussets. Two levels of energy input were used, resulting in process temperatures varying from 460 ± 130 °C to 758 ± 56 °C and fast cooling rates (178 ± 15 °C/s, 59 ± 15 °C/s. A complex final microstructure was identified in the rivet. Whereas equiaxial α-grains with β-phase precipitated in their grain boundaries were identified in the rivet heat-affected zone, refined α′ martensite, Widmanstätten structures and β-fleck domains were present in the plastically deformed rivet volume. The transition from equiaxed to acicular structures resulted in an increase of up to 24% in microhardness in comparison to the base material. A study on the rivet material flow through microtexture of the α-Ti phase and β-fleck orientation revealed a strong effect of shear stress and forging which induced simple shear deformation. By combining advanced microstructural analysis techniques with local mechanical testing and temperature measurement, the nature of the complex rivet plastic deformational regime could be determined.

  12. On the Process-Related Rivet Microstructural Evolution, Material Flow and Mechanical Properties of Ti-6Al-4V/GFRP Friction-Riveted Joints

    Science.gov (United States)

    Borba, Natascha Z.; Afonso, Conrado R. M.; Blaga, Lucian; dos Santos, Jorge F.; Canto, Leonardo B.; Amancio-Filho, Sergio T.

    2017-01-01

    In the current work, process-related thermo-mechanical changes in the rivet microstructure, joint local and global mechanical properties, and their correlation with the rivet plastic deformation regime were investigated for Ti-6Al-4V (rivet) and glass-fiber-reinforced polyester (GF-P) friction-riveted joints of a single polymeric base plate. Joints displaying similar quasi-static mechanical performance to conventional bolted joints were selected for detailed characterization. The mechanical performance was assessed on lap shear specimens, whereby the friction-riveted joints were connected with AA2198 gussets. Two levels of energy input were used, resulting in process temperatures varying from 460 ± 130 °C to 758 ± 56 °C and fast cooling rates (178 ± 15 °C/s, 59 ± 15 °C/s). A complex final microstructure was identified in the rivet. Whereas equiaxial α-grains with β-phase precipitated in their grain boundaries were identified in the rivet heat-affected zone, refined α′ martensite, Widmanstätten structures and β-fleck domains were present in the plastically deformed rivet volume. The transition from equiaxed to acicular structures resulted in an increase of up to 24% in microhardness in comparison to the base material. A study on the rivet material flow through microtexture of the α-Ti phase and β-fleck orientation revealed a strong effect of shear stress and forging which induced simple shear deformation. By combining advanced microstructural analysis techniques with local mechanical testing and temperature measurement, the nature of the complex rivet plastic deformational regime could be determined. PMID:28772545

  13. Microstructures and mechanical properties of welded joints of novel 3Cr pipeline steel using an inhouse and two commercial welding wires

    International Nuclear Information System (INIS)

    Zhu, Jinyang; Xu, Lining; Chang, Wei; Hu, Lihua; Lu, Minxu

    2014-01-01

    Highlights: • Weldability of novel 3Cr pipeline steel was investigated using two commercial and an inhouse welding wires. • Mechanical properties were measured and microstructure characteristics were observed. • Fracture positions of tensile test just corresponded to the minimum hardness region of the joints. • The inhouse wire R01 can provide the highest cost-performance ratio. - Abstract: The welded joints of the novel 3Cr pipeline steel were fabricated via the gas tungsten arc welding (GTAW) technique using an inhouse welding wire labeled as R01 and two kinds of commercial wires (H08Cr3MoMnA and TGS-2CML). Microhardness, impact toughness and tensile properties of the joints were measured, and microstructure characteristics were observed by scanning electron microscopy (SEM). The results show that under selected welding procedure, the joints of R01 can achieve quite good mechanical properties without preheating and post weld heat treatment (PWHT). After thermal refining, elongation (15.2%) doubled and met the DNV-OS-F101 standard. For low carbon or super low carbon pipeline steels such as 3Cr steel, the revised formula with the carbon applicable coefficient (A(c)) was quite good for predicting the maximum hardness in heat affected zone (HAZ). Compared with these two selected commercial wires, the inhouse welding wire R01 can provide the highest cost-performance ratio

  14. Nano-soldering to single atomic layer

    Science.gov (United States)

    Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  15. Safer Soldering Guidelines and Instructional Resources

    Science.gov (United States)

    Love, Tyler S.; Tomlinson, Joel

    2018-01-01

    Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

  16. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  17. THE POSSIBILITY OF USING LASER-ULTRASOUND TO MONITOR THE QUALITY SOLDERED CONNECTIONS CHAMBERS OF LIQUID ROCKET ENGINES

    Directory of Open Access Journals (Sweden)

    N. V. Astredinova

    2014-01-01

    Full Text Available During the manufacturing process to the design of modern liquid rocket engines are presented important requirements, such as minimum weight, maximum stiffness and strength of nodes, maximum service life in operation, high reliability and quality of soldered and welded seams. Due to the high quality requirements soldered connections and the specific design of the nozzle, it became necessary in the development and testing of a new non-conventional non-destructive testing method – laser-ultrasound diagnosis. In accordance with regulatory guidelines, quality control soldered connections is allowed to use an acoustic kind of control methods of the reflected light, transmitted light, resonant, free vibration and acoustic emission. Attempts to use traditional methods of non-destructive testing did not lead to positive results. This is due primarily to the size of typical solder joint defects, as well as the structural features of the rocket engine, the data structure is not controllable. In connection with this, a new method that provides quality control soldered connections cameras LRE based on the thermo generation of ultrasound. Methods of ultrasonic flaw detection of photoacoustic effect, in most cases, have a number of advantages over methods that use standard (traditional piezo transducers. In the course of studies have found that the sensitivity of the laser-ultrasonic method and flaw detector UDL-2M can detect lack of adhesion in the solder joints on the upper edges of the nozzle in the sub-header area of the site.

  18. Quantifying the dependence of Ni(P) thickness in ultrathin-ENEPIG metallization on the growth of Cu–Sn intermetallic compounds in soldering reaction

    Energy Technology Data Exchange (ETDEWEB)

    Ho, Cheng-Ying; Duh, Jenq-Gong, E-mail: jgd@mx.nthu.edu.tw

    2014-11-14

    A new multilayer metallization, ENEPIG (Electroless Ni(P)/Electroless Pd/Immersion Au) with ultrathin Ni(P) deposit (ultrathin-ENEPIG), was designed to be used in high frequency electronic packaging in this study because of its ultra-low electrical impedance. Sequential interfacial microstructures of commercial Sn–3.0Ag–0.5Cu solders reflowed on ultarthin-ENEPIG with Ni(P) deposit thickness ranged from 4.79 μm to 0.05 μm were first investigated. Accelerated thermal aging test was then conducted to evaluate the long-term thermal stabilization of solder joints. The results showed that P-rich intermetallic compound (IMC) layer formed when the Ni(P) thickness was greater than a critical vale (about 0.18 μm). Besides, it is interesting to mention that the growth of (Cu,Ni){sub 6}Sn{sub 5} and (Cu,Ni){sub 3}Sn IMCs was suppressed with the formation of P-rich layer, i.e., Ni{sub 3}P and Ni{sub 2}Sn{sub 1+x}P{sub 1−x} phase, even though the electroless-plated Ni(P) layer was exhausted at initial stage of reflow process. The atomic Cu flux in solder joints without P-rich layer was calculated to be several times larger than that with P-rich layer formation after calculation, which implies that the P-rich layer and ultrathin Ni(P) deposit in ENEPIG served as diffusion barrier against rapid Cu diffusion. - Highlights: • Microstructures in ultrathin-ENEPIG with various Ni(P) thickness are investigated. • P-rich IMC layer formed when the Ni(P) thickness is greater than 0.18 μm. • Secondary (Cu,Ni){sub 6}Sn{sub 5} formed when the Ni(P) thickness is between 0.18 and 0.31 μm. • Cu diffusion flux without P-rich layer is larger than those with P-rich layer. • P-rich layer in ultrathin-ENEPIG exhibits good diffusion barrier characteristic.

  19. Characterization of microstructure and texture across dissimilar super duplex/austenitic stainless steel weldment joint by austenitic filler metal

    International Nuclear Information System (INIS)

    Eghlimi, Abbas; Shamanian, Morteza; Eskandarian, Masoomeh; Zabolian, Azam; Szpunar, Jerzy A.

    2015-01-01

    The evolution of microstructure and texture across an as-welded dissimilar UNS S32750 super duplex/UNS S30403 austenitic stainless steel joint welded by UNS S30986 (AWS A5.9 ER309LMo) austenitic stainless steel filler metal using gas tungsten arc welding process was evaluated by optical micrography and EBSD techniques. Due to their fabrication through rolling process, both parent metals had texture components resulted from deformation and recrystallization. The weld metal showed the highest amount of residual strain and had large austenite grain colonies of similar orientations with little amounts of skeletal ferrite, both oriented preferentially in the < 001 > direction with cub-on-cube orientation relationship. While the super duplex stainless steel's heat affected zone contained higher ferrite than its parent metal, an excessive grain growth was observed at the austenitic stainless steel's counterpart. At both heat affected zones, austenite underwent some recrystallization and formed twin boundaries which led to an increase in the fraction of high angle boundaries as compared with the respective base metals. These regions showed the least amount of residual strain and highest amount of recrystallized austenite grains. Due to the static recrystallization, the fraction of low degree of fit (Σ) coincident site lattice boundaries, especially Σ3 boundaries, was increased in the austenitic stainless steel heat affected zone, while the formation of subgrains in the ferrite phase increased the content of < 5° low angle boundaries at that of the super duplex stainless steel. - Graphical abstract: Display Omitted - Highlights: • Extensive grain growth in the HAZ of austenitic stainless steel was observed. • Intensification of < 100 > orientated grains was observed adjacent to both fusion lines. • Annealing twins with Σ3 CSL boundaries were formed in the austenite of both HAZ. • Cub-on-cube OR was observed between austenite and ferrite in the weld

  20. Characterization of microstructure and texture across dissimilar super duplex/austenitic stainless steel weldment joint by austenitic filler metal

    Energy Technology Data Exchange (ETDEWEB)

    Eghlimi, Abbas, E-mail: a.eghlimi@ma.iut.ac.ir [Department of Materials Engineering, Isfahan University of Technology, Isfahan 84156-83111 (Iran, Islamic Republic of); Shamanian, Morteza [Department of Materials Engineering, Isfahan University of Technology, Isfahan 84156-83111 (Iran, Islamic Republic of); Eskandarian, Masoomeh [Department of Materials Engineering, Shiraz University, Shiraz 71348-51154 (Iran, Islamic Republic of); Zabolian, Azam [Department of Natural Resources, Isfahan University of Technology, Isfahan 84156-83111 (Iran, Islamic Republic of); Szpunar, Jerzy A. [Department of Mechanical Engineering, University of Saskatchewan, Saskatoon, SK S7N 5A9 (Canada)

    2015-08-15

    The evolution of microstructure and texture across an as-welded dissimilar UNS S32750 super duplex/UNS S30403 austenitic stainless steel joint welded by UNS S30986 (AWS A5.9 ER309LMo) austenitic stainless steel filler metal using gas tungsten arc welding process was evaluated by optical micrography and EBSD techniques. Due to their fabrication through rolling process, both parent metals had texture components resulted from deformation and recrystallization. The weld metal showed the highest amount of residual strain and had large austenite grain colonies of similar orientations with little amounts of skeletal ferrite, both oriented preferentially in the < 001 > direction with cub-on-cube orientation relationship. While the super duplex stainless steel's heat affected zone contained higher ferrite than its parent metal, an excessive grain growth was observed at the austenitic stainless steel's counterpart. At both heat affected zones, austenite underwent some recrystallization and formed twin boundaries which led to an increase in the fraction of high angle boundaries as compared with the respective base metals. These regions showed the least amount of residual strain and highest amount of recrystallized austenite grains. Due to the static recrystallization, the fraction of low degree of fit (Σ) coincident site lattice boundaries, especially Σ3 boundaries, was increased in the austenitic stainless steel heat affected zone, while the formation of subgrains in the ferrite phase increased the content of < 5° low angle boundaries at that of the super duplex stainless steel. - Graphical abstract: Display Omitted - Highlights: • Extensive grain growth in the HAZ of austenitic stainless steel was observed. • Intensification of < 100 > orientated grains was observed adjacent to both fusion lines. • Annealing twins with Σ3 CSL boundaries were formed in the austenite of both HAZ. • Cub-on-cube OR was observed between austenite and ferrite in the weld

  1. Effects of TiO2 coating on the microstructures and mechanical properties of tungsten inert gas welded AZ31 magnesium alloy joints

    International Nuclear Information System (INIS)

    Wang Linzhi; Shen Jun; Xu Nan

    2011-01-01

    Highlights: → The weld penetration and the D/W ratio could be improved dramatically by increasing of the amount of the TiO 2 coating. → The average grain size of the α-Mg grains increased and the β-Mg 17 Al 12 IMC transformed from granular structure to continuous structure with an increase of the amount of the TiO 2 coating. → With an increase of the amount of the TiO 2 coating, the microhardness of the FZ of the AZ31 magnesium alloy welded joints decreased slightly at first and then decreased sharply. → The UTS value of the welded joints increased with an increase of the amount of the TiO 2 coating. → However, too much TiO 2 coating caused a significant decrease of the UTS value of the welded joints. - Abstract: The effects of TiO 2 coating on the macro-morphologies, microstructures and mechanical properties of tungsten inert gas (TIG) welded AZ31 magnesium alloy joints were investigated by microstructural observations, microhardness tests and tensile tests. The results showed that an increase in the amount of the TiO 2 coating resulted in an increase in the weld penetration and the depth/width (D/W) ratio of the TIG welded AZ31 magnesium alloy seams. Moreover, the average grain size of the α-Mg grains increased and the β-Mg 17 Al 12 intermetallic compound (IMC) was coarser in the case of higher amount of the TiO 2 coating. With an increase in the amount of the TiO 2 coating, the microhardness of the fusion zone (FZ) of the AZ31 magnesium alloy welded joints decreased slightly initially and then decreased sharply. In addition, with an increase in the amount of the TiO 2 coating, the ultimate tensile strength (UTS) value and elongation of the welded joints increased at first and then decreased sharply.

  2. Effect of HIP temperature and cooling rate on microstructure and hardness of joints for ODS-RAFM steels and JLF-1 steel

    International Nuclear Information System (INIS)

    Fu, Haiying; Nagasaka, Takuya; Muroga, Takeo; Kimura, Akihiko; Ukai, Shigeharu

    2016-01-01

    Dissimilar-metal joints between ODS-RAFM (oxide-dispersion-strengthened reduced activation ferritic/martensitic) steels and JLF-1 steel were fabricated by hot isostatic pressing (HIP) at 1000 - 1100degC with a cooling rate of 5degC/min. After the HIP, it was always quenched martensite for JLF-1 steel. However, coarse precipitates were found in 9Cr-ODS. Additional annealing experiments to simulate HIP conditions were conducted for 9Cr-ODS with cooling rate ranged from 0.5 to 36degC/min at 800 - 1100degC. The results showed that, to form quenched martensite for 9Cr-ODS, the HIP temperature should be above 1000degC with cooling rate no less than 25dgeC/min. When the cooling rate is increased to 36degC/min, the microstructure of 9Cr-ODS is quenched martensite with precipitate size similar as that before HIP. If the limitation of precipitate size in 9Cr-ODS is 0.2 µm, HIP temperature above 1050degC with cooling rate no less than 30degC/min is needed. In this case, post-weld heat treatment (PWHT) with only tempering is necessary to recover the microstructure of 9Cr-ODS to tempered martensite. For 12Cr-ODS, the HIP temperature and cooling rate has no effect on hardness and precipitate size. PWHT is not necessary for the single-metal joint of 12Cr-ODS from the view point of precipitation control. However, for the dissimilar-metal joints between ODS-RAFM steels and JLF-1 steel, the PWHT condition should be comprehensively determined by considering microstructural evolution of each part in the joints after HIP. (author)

  3. Microstructure, local mechanical properties and stress corrosion cracking susceptibility of an SA508-52M-316LN safe-end dissimilar metal weld joint by GTAW

    Energy Technology Data Exchange (ETDEWEB)

    Ming, Hongliang; Zhu, Ruolin [Key Laboratory of Nuclear Materials and Safety Assessment, Liaoning KeyLaboratory for Safety and Assessment Technique of Nuclear Materials, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China); University of Chinese Academy of Sciences, 19 Yuquan Road, Beijing 100049 (China); Zhang, Zhiming [Key Laboratory of Nuclear Materials and Safety Assessment, Liaoning KeyLaboratory for Safety and Assessment Technique of Nuclear Materials, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China); Wang, Jianqiu, E-mail: wangjianqiu@imr.ac.cn [Key Laboratory of Nuclear Materials and Safety Assessment, Liaoning KeyLaboratory for Safety and Assessment Technique of Nuclear Materials, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China); Han, En.-Hou.; Ke, Wei [Key Laboratory of Nuclear Materials and Safety Assessment, Liaoning KeyLaboratory for Safety and Assessment Technique of Nuclear Materials, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China); Su, Mingxing [Shanghai Research Center for Weld and Detection Engineering Technique of Nuclear Equipment, Shanghai 201306 (China)

    2016-07-04

    The microstructure, local mechanical properties and local stress corrosion cracking susceptibility of an SA508-52M-316LN domestic dissimilar metal welded safe-end joint used for AP1000 nuclear power plant prepared by automatic gas tungsten arc welding was studied in this work by optical microscopy, scanning electron microscopy (with electron back scattering diffraction and an energy dispersive X-ray spectroscopy system), micro-hardness testing, local mechanical tensile testing and local slow strain rate tests. The micro-hardness, local mechanical properties and stress corrosion cracking susceptibility across this dissimilar metal weld joint vary because of the complex microstructure across the fusion area and the dramatic chemical composition change across the fusion lines. Briefly, Type I boundaries and Type II boundaries exist in 52Mb near the SA508-52Mb interface, a microstructure transition was found in SA508 heat affected zone, the residual strain and grain boundary character distribution changes as a function of the distance from the fusion boundary in 316LN heat affected zone, micro-hardness distribution and local mechanical properties along the DMWJ are heterogeneous, and 52Mw-316LN interface has the highest SCC susceptibility in this DMWJ while 316LN base metal has the lowest one.

  4. Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    McNally, K.M.; Sorg, B.S.; Welch, A.J.; Dawes, J.M.; Owen, E.R.

    1999-01-01

    Low-strength anastomoses and thermal damage of tissue are major concerns in laser tissue welding techniques where laser energy is used to induce thermal changes in the molecular structure of the tissues being joined, hence allowing them to bond together. Laser tissue soldering, on the other hand, is a bonding technique in which a protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. The addition of protein solders to augment tissue repair procedures significantly reduces the problems of low strength and thermal damage associated with laser tissue welding techniques. Investigations were conducted to determine optimal solder and laser parameters for tissue repair in terms of tensile strength, temperature rise and damage and the microscopic nature of the bonds formed. An in vitro study was performed using an 808 nm diode laser in conjunction with indocyanine green (ICG)-doped albumin protein solders to repair bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The efficacy of temperature feedback control in enhancing the soldering process was also investigated. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the repairs. A reduction in dye concentration from 2.5mgml -1 to 0.25mgml -1 was also found to result in an increase in tensile strength. Increasing the laser irradiance and thus surface temperature resulted in an increased severity of histological injury. Thermal denaturation of tissue collagen and necrosis of the intimal layer smooth muscle cells increased laterally and in depth with higher temperatures. The strongest repairs were produced with an irradiance of 6.4Wcm -2 using a solid protein solder composed of 60% BSA and 0.25mgml -1 ICG. Using this combination of laser and solder parameters, surface temperatures were observed to reach 85±5 deg. C with a

  5. Effect of temperature and flux concentration on soldering of base metal.

    Science.gov (United States)

    Lee, S Y; Lin, C T; Wang, M H; Tseng, H; Huang, H M; Dong, D R; Pan, L C; Shih, Y H

    2000-12-01

    The present study used the acoustic emission (AE) technique to evaluate interactions among soldering temperature, flux treatment, and the resultant ultimate tensile strength (UTS). Scanning electron microscopy (SEM) was used to examine fracture surfaces of the solder joints. Specimens were cast from removable partial denture alloy and then placed in a jig with a gap distance of 1.0 mm. A high-frequency soldering machine with an optical pyrometer was used for soldering at 1150 degrees C and 1200 degrees C, respectively. The flux concentrations were 67% and 75%. The soldered specimens were subjected to tensile test at a crosshead speed of 0.05 mm/min. During testing, acoustic emissions in the frequency range of 100--1200 kHz were collected, filtered, recorded, and processed by a sensing device. The results were analysed by ANOVA and Tukey LSD test. UTS at different temperatures showed no significant difference according to either mechanical or acoustic results. But in the 1200 degrees C group, the UTSs and AE counts showed significant differences (Pacoustic signals within the elastic deformation zone, while the 67% flux subgroup produced similar signals within the plastic deformation zone, either beyond the 0.2% yield point or before fracture.

  6. Effects of nano-particles strengthening activating flux on the microstructures and mechanical properties of TIG welded AZ31 magnesium alloy joints

    International Nuclear Information System (INIS)

    Xie, Xiong; Shen, Jun; Cheng, Liang; Li, Yang; Pu, Yayun

    2015-01-01

    Highlights: • Increased nano-particles strengthening activating flux degraded TIGed seams. • The reaction between SiC particles and Mg alloy produced Al 4 C 3 and Mg 2 Si phases. • Al 4 C 3 and SiC particles promoted the nucleation and suppressed the growth of α-Mg. • Refined α-Mg grains, precipitated phase and SiC particles enhanced TIGed joints. - Abstract: In this paper, AZ31 magnesium alloy joints were processed by nano-particles strengthening activating flux tungsten inert gas (NSA-TIG) welding, which was achieved by the mixed TiO 2 and nano-SiC particles coated on the samples before welding tests. The macro/micro structural observation and mechanical properties evaluation of the welding joints were conducted by using optical microscope, scanning electron microscope, energy dispersive X-ray spectroscopy, X-ray diffraction and tension and microhardness tests. The results showed that nano-particles strengthening activating flux effective improved the microstructure, microhardness in fusion zone, ultimate tensile strength of the TIG welding joints. In addition, the chemical reaction between part of SiC particles and AZ31 magnesium alloy produced Al 4 C 3 and Mg 2 Si in the joints. The Al 4 C 3 performed as nucleating agents for α-Mg and the dispersed Mg 2 Si and SiC particles enhanced the mechanical properties of the NSA-TIG welding joints. However, large heat input induced by the increase of the surface coating density of the nano-particles strengthening activating flux, increased the α-Mg grain sizes and weakened the mechanical properties of the welded joints. Therefore, the grain size of α-Mg, distribution of β-Mg 17 Al 12 , Mg 2 Si and SiC particles together influenced the evolution of the mechanical properties of the NSA-TIG welded AZ31 magnesium alloy joints

  7. An Analysis of Microstructure and Mechanical Properties on Friction Stir Welded Joint of Dissimilar 304 Stainless Steel and Commercially Pure Aluminium

    Directory of Open Access Journals (Sweden)

    Balamagendiravarman M.

    2017-09-01

    Full Text Available In this study, friction stir welding of dissimilar 304 stainless steel and commercially pure aluminium was performed under the following condition of tool rotational speed 1000 rpm, traverse speed 60 mm/min and tool tilt angle 2 degree. Microstructural characterisation was carried out by optical microscope, scanning electron microscope (SEM. Optical images shows that the microstructural change is very minimum in steel side when compared to aluminium side due to the difference in mechanical and thermal properties. The intermetallic compound Al3Fe was observed at the interfacial region and stir region of the welded joint. The maximum ultimate tensile strength is 78% of commercially pure aluminium base metal. Microhardness profile was measured across the weld interface and the maximum value reaches at the stir zone due to the formation of intermettalics.

  8. Optimal parameters for laser tissue soldering

    Science.gov (United States)

    McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

    1998-07-01

    Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

  9. Growth and microstructure formation of isothermally-solidified Zircaloy-4 joints brazed by a Zr-Ti-Cu-Ni amorphous alloy ribbon

    Science.gov (United States)

    Kim, K. H.; Lim, C. H.; Lee, J. G.; Lee, M. K.; Rhee, C. K.

    2013-10-01

    The microstructure and growth characteristics of Zircaloy-4 joints brazed by a Zr48Ti16Cu17Ni19 (at.%) amorphous filler metal have been investigated with regard to the controlled isothermal solidification and intermetallic formation. Two typical joints were produced depending on the isothermal brazing temperature: (1) a dendritic growth structure including bulky segregation in the central zone (at 850 °C), and (2) a homogeneous dendritic structure throughout the joint without segregation (at 890 °C). The primary α-Zr phase was solidified isothermally, nucleating to grow into a joint with a cellular or dendritic structure. Also, the continuous Zr2Ni and particulate Zr2Cu phases were formed in the segregated center zone and at the intercellular region, respectively, owing to the different solubility and atomic mobility of the solute elements (Ti, Cu, and Ni) in the α-Zr matrix. A disappearance of the central Zr2Ni phase was also rate-controlled by the outward diffusion of the Cu and Ni elements. When the detrimental Zr2Ni intermetallic phase was eliminated by a complete isothermal solidification at 890 °C, the strengths of the joints were high enough to cause yielding and fracture in the base metal, exceeding those of the bulk Zircaloy-4, at room temperature as well as at elevated temperatures (up to 400 °C).

  10. Growth and microstructure formation of isothermally-solidified Zircaloy-4 joints brazed by a Zr–Ti–Cu–Ni amorphous alloy ribbon

    Energy Technology Data Exchange (ETDEWEB)

    Kim, K.H. [University of Science and Technology, Nuclear Materials Development Division, Korea Atomic Energy Research Institute (KAERI), Yuseong, Daejeon 305-353 (Korea, Republic of); Lim, C.H. [Nuclear Materials Development Division, Korea Atomic Energy Research Institute (KAERI), Yuseong, Daejeon 305-353 (Korea, Republic of); Lee, J.G., E-mail: jglee88@kaeri.re.kr [Nuclear Materials Development Division, Korea Atomic Energy Research Institute (KAERI), Yuseong, Daejeon 305-353 (Korea, Republic of); Lee, M.K.; Rhee, C.K. [Nuclear Materials Development Division, Korea Atomic Energy Research Institute (KAERI), Yuseong, Daejeon 305-353 (Korea, Republic of)

    2013-10-15

    The microstructure and growth characteristics of Zircaloy-4 joints brazed by a Zr{sub 48}Ti{sub 16}Cu{sub 17}Ni{sub 19} (at.%) amorphous filler metal have been investigated with regard to the controlled isothermal solidification and intermetallic formation. Two typical joints were produced depending on the isothermal brazing temperature: (1) a dendritic growth structure including bulky segregation in the central zone (at 850 °C), and (2) a homogeneous dendritic structure throughout the joint without segregation (at 890 °C). The primary α-Zr phase was solidified isothermally, nucleating to grow into a joint with a cellular or dendritic structure. Also, the continuous Zr{sub 2}Ni and particulate Zr{sub 2}Cu phases were formed in the segregated center zone and at the intercellular region, respectively, owing to the different solubility and atomic mobility of the solute elements (Ti, Cu, and Ni) in the α-Zr matrix. A disappearance of the central Zr{sub 2}Ni phase was also rate-controlled by the outward diffusion of the Cu and Ni elements. When the detrimental Zr{sub 2}Ni intermetallic phase was eliminated by a complete isothermal solidification at 890 °C, the strengths of the joints were high enough to cause yielding and fracture in the base metal, exceeding those of the bulk Zircaloy-4, at room temperature as well as at elevated temperatures (up to 400 °C)

  11. Comparative Microstructural and Wettability Studies of 63sn-37pb ...

    African Journals Online (AJOL)

    The respective wettability values (in percentage) of the total area of the copper grid covered by the molten solder are: 8.3%, and 8.6% The alloy also have the following Vicker's Hardness Values of 18.58VHN and 16.32VHN. The microstructures of the developed alloys were studied and analyzed. The alloy's microstructures ...

  12. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

    National Research Council Canada - National Science Library

    Reuse, Rolando

    2005-01-01

    .... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

  13. Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy

    DEFF Research Database (Denmark)

    Malik, Safdar Abbas; Le, Thanh Hung; Van Nong, Ngo

    2018-01-01

    and metallic electrodes. In this paper, we investigate the joining of ZnSb to Ni and Ag electrodes using a commercial solder alloy S-Bond 400 and hot-pressing technique. Ti and Cr layers are also introduced as a diffusion barrier and microstructure at the interfaces is observed by scanning electron microscopy....... We found that S-bond 400 solder reacts with Ag and Ni electrodes to form different alloys at the interfaces. Cr layer was found to be broken after joining, resulting in a thicker reaction/diffusion layer at the interface, while Ti layer was preserved....

  14. Development of Pb-Free Nanocomposite Solder Alloys

    Directory of Open Access Journals (Sweden)

    Animesh K. Basak

    2018-04-01

    Full Text Available As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1 Al2O3 or (2 Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys.

  15. Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

    Directory of Open Access Journals (Sweden)

    Soares D.

    2007-01-01

    Full Text Available Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layers. The effect of the addition of P, at low levels, on the chemical composition of the layers present at the interface was studied. The phases formed at the interface between the Cu or Ni substrate and a molten lead-free solder at 250ºC, were studied for different stage times and alloy compositions. The melting temperatures, of the studied alloys, were determined by Differential Scanning Calorimetry (DSC. Identification of equilibrium phases formed at the interface layer, and the evaluation of their chemical composition were performed by Scanning Electron Microscopy (SEM/EDS. Different interface characteristics were obtained, namely for the alloys containing Zn. The obtained IML layer thickness was compared, for both types of alloy systems.

  16. Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

    International Nuclear Information System (INIS)

    Yang, Ming; Ko, Yong-Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu

    2017-01-01

    Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

  17. Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Ming [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Ko, Yong-Ho [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Bang, Junghwan [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Kim, Taek-Soo [Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Lee, Chang-Woo, E-mail: cwlee@kitech.re.kr [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Li, Mingyu, E-mail: myli@hit.edu.cn [Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055 (China)

    2017-02-15

    Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

  18. Friction stir welding joint of dissimilar materials between AZ31B magnesium and 6061 aluminum alloys: Microstructure studies and mechanical characterizations

    Energy Technology Data Exchange (ETDEWEB)

    Mohammadi, J. [Department of Materials Science and Engineering, Science and Research Branch, Islamic Azad University, Tehran 141554933 (Iran, Islamic Republic of); Behnamian, Y. [Department of Chemical and Materials Engineering, University of Alberta, Edmonton, Alberta T6G 2V4 (Canada); Mostafaei, A., E-mail: amir.mostafaei@gmail.com [Young Researchers and Elites Club, Tehran North Branch, Islamic Azad University, Tehran (Iran, Islamic Republic of); Izadi, H. [Department of Chemical and Materials Engineering, University of Alberta, Edmonton, Alberta T6G 2V4 (Canada); Saeid, T. [Faculty of Materials Engineering, Sahand University of Technology, Tabriz 513351996 (Iran, Islamic Republic of); Kokabi, A.H. [Department of Materials Science and Engineering, Sharif University of Technology, Tehran 113659466 (Iran, Islamic Republic of); Gerlich, A.P., E-mail: adrian.gerlich@uwaterloo.ca [Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, Ontario N2L 3G1 (Canada)

    2015-03-15

    Friction stir welding is an efficient manufacturing method for joining dissimilar alloys, which can dramatically reduce grain sizes and offer high mechanical joint efficiency. Lap FSW joints between dissimilar AZ31B and Al 6061 alloy sheets were made at various tool rotation and travel speeds. Rotation and travel speeds varied between 560–1400 r/min and 16–40 mm/min respectively, where the ratio between these parameters was such that nearly constant pitch distances were applied during welding. X-ray diffraction pattern (XRD), optical microscopy images (OM), electron probe microanalysis (EPMA) and scanning electron microscopy equipped with an energy-dispersive X-ray spectroscopy (SEM-EDS) were used to investigate the microstructures of the joints welded. Intermetallic phases including Al{sub 12}Mg{sub 17} (γ) and Al{sub 3}Mg{sub 2} (β) were detected in the weld zone (WZ). For different tool rotation speeds, the morphology of the microstructure in the stir zone changed significantly with travel speed. Lap shear tensile test results indicated that by simultaneously increasing the tool rotation and travel speeds to 1400 r/min and 40 mm/min, the joint tensile strength and ductility reached a maximum. Microhardness measurements and tensile stress–strain curves indicated that mechanical properties were affected by FSW parameters and mainly depended on the formation of intermetallic compounds in the weld zone. In addition, a debonding failure mode in the Al/Mg dissimilar weld nugget was investigated by SEM and surface fracture studies indicated that the presence of intermetallic compounds in the weld zone controlled the failure mode. XRD analysis of the fracture surface indicated the presence of brittle intermetallic compounds including Al{sub 12}Mg{sub 17} (γ) and Al{sub 3}Mg{sub 2} (β). - Highlights: • Dissimilar Al/Mg joint was obtained by lap friction stir welding technique. • Effect of rotation and travel speeds on the formation of intermetallic

  19. Friction stir welding joint of dissimilar materials between AZ31B magnesium and 6061 aluminum alloys: Microstructure studies and mechanical characterizations

    International Nuclear Information System (INIS)

    Mohammadi, J.; Behnamian, Y.; Mostafaei, A.; Izadi, H.; Saeid, T.; Kokabi, A.H.; Gerlich, A.P.

    2015-01-01

    Friction stir welding is an efficient manufacturing method for joining dissimilar alloys, which can dramatically reduce grain sizes and offer high mechanical joint efficiency. Lap FSW joints between dissimilar AZ31B and Al 6061 alloy sheets were made at various tool rotation and travel speeds. Rotation and travel speeds varied between 560–1400 r/min and 16–40 mm/min respectively, where the ratio between these parameters was such that nearly constant pitch distances were applied during welding. X-ray diffraction pattern (XRD), optical microscopy images (OM), electron probe microanalysis (EPMA) and scanning electron microscopy equipped with an energy-dispersive X-ray spectroscopy (SEM-EDS) were used to investigate the microstructures of the joints welded. Intermetallic phases including Al 12 Mg 17 (γ) and Al 3 Mg 2 (β) were detected in the weld zone (WZ). For different tool rotation speeds, the morphology of the microstructure in the stir zone changed significantly with travel speed. Lap shear tensile test results indicated that by simultaneously increasing the tool rotation and travel speeds to 1400 r/min and 40 mm/min, the joint tensile strength and ductility reached a maximum. Microhardness measurements and tensile stress–strain curves indicated that mechanical properties were affected by FSW parameters and mainly depended on the formation of intermetallic compounds in the weld zone. In addition, a debonding failure mode in the Al/Mg dissimilar weld nugget was investigated by SEM and surface fracture studies indicated that the presence of intermetallic compounds in the weld zone controlled the failure mode. XRD analysis of the fracture surface indicated the presence of brittle intermetallic compounds including Al 12 Mg 17 (γ) and Al 3 Mg 2 (β). - Highlights: • Dissimilar Al/Mg joint was obtained by lap friction stir welding technique. • Effect of rotation and travel speeds on the formation of intermetallic compounds • Microstructure and chemical

  20. Interfacial microstructure of Si{sub 3}N{sub 4}/Si{sub 3}N{sub 4} brazing joint with Cu-Zn-Ti filler alloy

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, J. [School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China)], E-mail: hitzhangjie@hit.edu.cn; Zhang, X.M.; Zhou, Y. [School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China); Naka, M. [Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka 567-0047 (Japan); Svetlana, Atroshenko [Faculty of Mathematics and Mechanics, Saint-Petersburg State University (Russian Federation)

    2008-11-15

    In this study, Si{sub 3}N{sub 4} ceramic was jointed by a brazing technique with a Cu-Zn-Ti filler alloy. The interfacial microstructure between Si{sub 3}N{sub 4} ceramic and filler alloy in the Si{sub 3}N{sub 4}/Si{sub 3}N{sub 4} joint was observed and analyzed by using electron-probe microanalysis, X-ray diffraction and transmission electron microscopy. The results indicate that there are two reaction layers at the ceramic/filler interface in the joint, which was obtained by brazing at a temperature and holding time of 1223 K and 15 min, respectively. The layer nearby the Si{sub 3}N{sub 4} ceramic is a TiN layer with an average grain size of 100 nm, and the layer nearby the filler alloy is a Ti{sub 5}Si{sub 3}N{sub x} layer with an average grain size of 1-2 {mu}m. Thickness of the TiN and Ti{sub 5}Si{sub 3}N{sub x} layers is about 1 {mu}m and 10 {mu}m, respectively. The formation mechanism of the reaction layers was discussed. A model showing the microstructure from Si{sub 3}N{sub 4} ceramic to filler alloy in the Si{sub 3}N{sub 4}/Si{sub 3}N{sub 4} joint was provided as: Si{sub 3}N{sub 4} ceramic/TiN reaction layer/Ti{sub 5}Si{sub 3}N{sub x} reaction layer/Cu-Zn solution.

  1. Microstructure and mechanical properties of MoSi2–MoSi2 joints brazed by Ag–Cu–Zr interlayer

    International Nuclear Information System (INIS)

    Hatami Ramsheh, H.; Faghihi Sani, M.A.; Kokabi, A.H.

    2013-01-01

    Highlights: ► Brazing of MoSi 2 –MoSi 2 using Ag–Cu–Zr interlayer at different temperatures. ► Investigation of shear strength and microstructure of the joint by SEM and XRD. ► Formation of Ag-rich solid solution and various Cu–Zr–Si intermetallic compounds. ► Maximum shear strength for the sample with 830 °C brazing temperature. ► Various fracture path and morphology at different brazing temperatures. - Abstract: The present work investigates joining of two MoSi 2 parts through Cusil/Zr/Cusil interlayer with Cusil being a commercial eutectic of Cu–Ag alloy. The joining operation was implemented in an inert gas tube furnace by brazing. The brazing temperature ranged from 800 to 930 °C while the operation lasted for 60 min. Evaluation of joints strength through shear loading identified the maximum strength 60.31 MPa for the brazed sample at 830 °C. Interfacial microstructure was studied by Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS) and X-ray Diffraction (XRD) techniques. Applying the temperature of 830 °C was led to a uniform dense joint consisting of various phases with excellent bonding within the interfaces. XRD and EDS results revealed different phases such as Mo 5 Si 3 , Ag-rich solid solution and Cu 10 Zr 7 at the interface. At higher brazing temperatures the amount of intemetallic compounds and residual stresses increased and therefore, mechanical properties of the joint degraded. The fracture analysis by SEM revealed various fracture path and morphology for different brazing temperatures

  2. Effect of welding process on the microstructure and properties of dissimilar weld joints between low alloy steel and duplex stainless steel

    Science.gov (United States)

    Wang, Jing; Lu, Min-xu; Zhang, Lei; Chang, Wei; Xu, Li-ning; Hu, Li-hua

    2012-06-01

    To obtain high-quality dissimilar weld joints, the processes of metal inert gas (MIG) welding and tungsten inert gas (TIG) welding for duplex stainless steel (DSS) and low alloy steel were compared in this paper. The microstructure and corrosion morphology of dissimilar weld joints were observed by scanning electron microscopy (SEM); the chemical compositions in different zones were detected by energy-dispersive spectroscopy (EDS); the mechanical properties were measured by microhardness test, tensile test, and impact test; the corrosion behavior was evaluated by polarization curves. Obvious concentration gradients of Ni and Cr exist between the fusion boundary and the type II boundary, where the hardness is much higher. The impact toughness of weld metal by MIG welding is higher than that by TIG welding. The corrosion current density of TIG weld metal is higher than that of MIG weld metal in a 3.5wt% NaCl solution. Galvanic corrosion happens between low alloy steel and weld metal, revealing the weakness of low alloy steel in industrial service. The quality of joints produced by MIG welding is better than that by TIG welding in mechanical performance and corrosion resistance. MIG welding with the filler metal ER2009 is the suitable welding process for dissimilar metals jointing between UNS S31803 duplex stainless steel and low alloy steel in practical application.

  3. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Science.gov (United States)

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2004-10-01

    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  4. Characterization of microstructure, chemical composition, corrosion resistance and toughness of a multipass weld joint of superduplex stainless steel UNS S32750

    International Nuclear Information System (INIS)

    Tavares, S.S.M.; Pardal, J.M.; Lima, L.D.; Bastos, I.N.; Nascimento, A.M.; Souza, J.A. de

    2007-01-01

    The superduplex stainless steels have an austeno-ferritic microstructure with an average fraction of each phase of approximately 50%. This duplex microstructure improves simultaneously the mechanical properties and corrosion resistance. Welding of these steels is often a critical operation. In this paper we focus on characterization and analysis of a multipass weld joint of UNS S32750 steel prepared using welding conditions equal to industrial standards. The toughness and corrosion resistance properties of the base metal, root pass welded with gas tungsten arc welding, as well as the filler passes, welded with shielded metal arc welding, were evaluated. The microstructure and chemical composition of the selected areas were also determined and correlated to the corrosion and mechanical properties. The root pass was welded with low nickel filler metal and, as a consequence, presented low austenite content and significant precipitation. This precipitation is reflected in the corrosion and mechanical properties. The filler passes presented an adequate ferrite:austenite proportion but, due to their high oxygen content, the toughness was lower than that of the root pass. Corrosion properties were evaluated by cyclic polarization tests in 3.5% NaCl and H 2 SO 4 media

  5. Microstructure characteristics and mechanical properties of laser-TIG hybrid welded dissimilar joints of Ti-22Al-27Nb and TA15

    Science.gov (United States)

    Zhang, Kezhao; Lei, Zhenglong; Chen, Yanbin; Liu, Ming; Liu, Yang

    2015-10-01

    Laser-TIG-hybrid-welding (TIG - tungsten inert gas) process was successfully applied to investigate the microstructure and tensile properties of Ti-22Al-27Nb/TA15 dissimilar joints. The HAZ of the arc zone in Ti-22Al-27Nb was characterized by three different regions: single B2, B2+α2 and B2+α2+O, while the single B2 phase region was absent in the HAZ of the laser zone. As for the HAZ in TA15 alloy, the microstructure mainly contained acicular α‧ martensites near the fusion line and partially remained the lamellar structure near the base metal. The fusion zone consisted of B2 phase due to the relatively high content of β phase stabilizing elements and fast cooling rate during the welding process. The tensile strength of the welds was higher than that of TA15 alloy because of the fully B2 microstructure in the fusion zone, and the fracture preferentially occurred on the base metal of TA15 alloy during the tensile tests at room temperature and 650 °C.

  6. Effect of heat input on microstructure and mechanical properties of dissimilar joints between super duplex stainless steel and high strength low alloy steel

    International Nuclear Information System (INIS)

    Sadeghian, M.; Shamanian, M.; Shafyei, A.

    2014-01-01

    Highlights: • The microstructure of weld metal consists of austenite and ferrite. • The HAZ of the API X-65 shows different transformation. • Impact strength of sample with low heat input was lower than base metals. • The heat input at 0.506 kJ/mm is not the suitable for dissimilar joining between UNS S32750/API X-65. - Abstract: In the present study, microstructure and mechanical properties of UNS S32750 super duplex stainless steel (SDSS)/API X-65 high strength low alloy steel (HSLA) dissimilar joint were investigated. For this purpose, gas tungsten arc welding (GTAW) was used in two different heat inputs: 0.506 and 0.86 kJ/mm. The microstructures investigation with optical microscope, scanning electron microscope and X-ray diffraction showed that an increase in heat input led to a decrease in ferrite percentage, and that detrimental phases were not present. It also indicated that in heat affected zone of HSLA base metal in low heat input, bainite and ferrite phases were created; but in high heat input, perlite and ferrite phases were created. The results of impact tests revealed that the specimen with low heat input exhibited brittle fracture and that with high heat input had a higher strength than the base metals

  7. Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Chih-Yao [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Hon, Min-Hsiung [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 415 Chien-Kung Road, Kaohsiung 80782, Taiwan (China); Wang, Moo-Chin, E-mail: mcwang@kmu.edu.tw [Department of Fragrance and Cosmetic Science, Kaohsiung Medical University, 100, Shih-Chuan 1st Road, Kaohsiung 80728, Taiwan (China); Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long [Institute of Nanotechnology and Microsystems Engineering, National Cheng Kung University, No. 1, University Road, Tainan 70101, Taiwan (China)

    2014-01-05

    Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag{sub 3}Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn{sub 3}. No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging.

  8. Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

    International Nuclear Information System (INIS)

    Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin; Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long

    2014-01-01

    Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag 3 Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn 3 . No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging

  9. Study of local-zone microstructure, strength and fracture toughness of hybrid laser-metal-inert-gas-welded A7N01 aluminum alloy joint

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Xiaomin, E-mail: xmwang991011@163.com [School of Life Science and Engineering, Southwest Jiaotong University, Chengdu 610031, Sichuan (China); Li, Bo [School of Materials Science and Engineering, Southwest Jiaotong University, Chengdu 610031, Sichuan (China); Li, Mingxing; Huang, Cui [School of Life Science and Engineering, Southwest Jiaotong University, Chengdu 610031, Sichuan (China); Chen, Hui [School of Materials Science and Engineering, Southwest Jiaotong University, Chengdu 610031, Sichuan (China)

    2017-03-14

    Mechanical properties of hybrid laser-metal-inert-gas-welded A7N01-T5 aluminum alloy joints were studied by using local samples that were extracted from the base metal (BM), heat-affected zone (HAZ), and fusion zone (FZ) of the joint to investigate the triangular relationship of microstructure, strength and fracture toughness of the local zones. The BM had the highest yield strength, ultimate tensile strength (UTS) and lowest elongation, which contrasts with the FZ. The yield strength of the HAZ is lower than that of the BM, whereas its UTS is very close to that of the BM, and its elongation is higher than that of the BM. The fracture toughness of the three local zones decreased as HAZ>BM>FZ. To analyze differences in local mechanical behavior, the detailed microstructure of the three local zones was studied by optical microscopy and electron backscattered diffraction, whereas the fracture surface and precipitation were studied by scanning and transmission electron microscopy. The variation of grain size, especially the morphology and distribution of strengthening phase in HAZ in welding process is the key factor that leads to its different mechanical properties from that of BM, which can be elucidated by different dislocation mechanism, sheared mechanism or Orowan mechanism. The as-cast microstructure and second-phase particles that segregate between dendritic branches provide the FZ with the lowest yield strength and UTS. The factors including area fraction of the precipitates, the difference of strength between the matrix and the grain boundaries, the precipitate-free zone along grain boundaries, as well as the grain boundaries angle are taken into account to explain the difference of fracture toughness among BM, HAZ and FZ, and their fracture modes.

  10. Microstructural and Mechanical Characterization of Electron Beam Welded Joints of High Strength S960QL and Weldox 1300 Steel Grades

    Directory of Open Access Journals (Sweden)

    Błacha S.

    2017-06-01

    Full Text Available The paper shows the results of metallographic examination and mechanical properties of electron beam welded joints of quenched and tempered S960QL and Weldox 1300 steel grades. The aim of this study was to examine the feasibility of producing good quality electron beam welded joints without filler material.

  11. Correlation between microstructure and mechanical properties of active brazed C{sub f}/SiC composite joints using Ti-Zr-Be

    Energy Technology Data Exchange (ETDEWEB)

    Fan, Dongyu; Huang, Jihua, E-mail: jhhuang62@sina.com; Sun, Xiaowei; Yang, Jian; Chen, Shuhai; Zhao, Xingke

    2016-06-14

    C{sub f}/SiC composites were successfully active brazed by Ti-Zr-Be filler foil. The microstructure of the brazed joints was investigated by auger electron spectroscopy (AES) and scanning electron microscope (SEM) equipped with energy dispersive spectrometer (EDS). The phase structure was determined by X-ray diffraction (XRD). The mechanical property was measured by mechanical testing machine. The results indicate that the brazed joint consisted of TiC, Ti{sub 3}SiC{sub 2}, ZrC, Be{sub 2}C, Be{sub 17}Ti{sub 2} and Ti-based solid solution (β-Ti). TiC+Ti{sub 3}SiC{sub 2}/ZrC+Ti(Zr)-Si-C+Be{sub 2}C reaction layers were formed near C{sub f}/SiC composite side while the reaction layer of β-Ti+Be{sub 17}Ti{sub 2}+Ti(Zr){sub 3}SiC{sub 2} with a small amount of ZrC, TiSi{sub 2}, Be{sub 2}C particles was formed in the center of the joint. With the increase of the brazing temperature or holding time, the amount of β-Ti compound in the interlayer decreased gradually while the thickness of reaction layer increased gradually. When the brazing temperature was 1000 °C and the holding time was 15 min, the maximum room temperature shear strength of the brazed joint can be achieved, which was 136.63 MPa. The joints with the parameters of 950 °C/30 min, 1000 °C/15 min and 1050 °C/5 min could resist a pressure of 5 MPa at 1200 °C for 5 min.

  12. A flip chip process based on electroplated solder bumps

    Science.gov (United States)

    Salonen, J.; Salmi, J.

    1994-01-01

    Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

  13. Microstructure characteristics and temperature-dependent high cycle fatigue behavior of advanced 9% Cr/CrMoV dissimilarly welded joint

    Energy Technology Data Exchange (ETDEWEB)

    Wu, Qingjun [Shanghai Key Laboratory of Materials Laser Processing and Modification, Shanghai Jiao Tong University, Shanghai 200240 (China); Lu, Fenggui, E-mail: Lfg119@sjtu.edu.cn [Shanghai Key Laboratory of Materials Laser Processing and Modification, Shanghai Jiao Tong University, Shanghai 200240 (China); Shanghai Key Laboratory of Modern Metallurgy and Materials Processing, Shanghai University, Shanghai 200072 (China); Cui, Haichao [Shanghai Key Laboratory of Materials Laser Processing and Modification, Shanghai Jiao Tong University, Shanghai 200240 (China); Ding, Yuming; Liu, Xia [Shanghai Turbine Plant of Shanghai Electric Power Generation Equipment Co. Ltd., Shanghai 200240 (China); Gao, Yulai, E-mail: ylgao@shu.edu.cn [Shanghai Key Laboratory of Modern Metallurgy and Materials Processing, Shanghai University, Shanghai 200072 (China)

    2014-10-06

    Advanced 9% Cr and CrMoV steels chosen as candidate materials are first welded by narrow-gap submerged arc welding (NG-SAW) to fabricate the heavy section rotor. The present work focuses on studying the high-cycle fatigue (HCF) behavior of advanced 9% Cr/CrMoV dissimilarly welded joint at different temperatures. Conditional fatigue strength of this dissimilarly welded joint was obtained by HCF tests at room temperature (RT), 400 °C and 470 °C. It was observed that the failure occurred at the side of CrMoV base metal (BM), weld metal (WM) and heat affected zone (HAZ) of CrMoV side over 5×10{sup 7} cycles for the specimens tested at RT, 400 °C and 470 °C. The detailed microstructures of BMs, WMs and HAZs as well as fracture appearance were observed by optical microscopy (OM) and scanning electron microscopy (SEM). Precipitation and aggregation of carbides along the grain boundaries were clearly detected with the increase of temperature, which brought a negative effect on the fatigue properties. It is interesting to note that the inclusion size leading to crack initiation became smaller for the HCF test at higher temperature. Therefore, reduction in the inclusion size in a welded joint helps to improve the HCF performance at high temperature.

  14. Microstructure characteristics and temperature-dependent high cycle fatigue behavior of advanced 9% Cr/CrMoV dissimilarly welded joint

    International Nuclear Information System (INIS)

    Wu, Qingjun; Lu, Fenggui; Cui, Haichao; Ding, Yuming; Liu, Xia; Gao, Yulai

    2014-01-01

    Advanced 9% Cr and CrMoV steels chosen as candidate materials are first welded by narrow-gap submerged arc welding (NG-SAW) to fabricate the heavy section rotor. The present work focuses on studying the high-cycle fatigue (HCF) behavior of advanced 9% Cr/CrMoV dissimilarly welded joint at different temperatures. Conditional fatigue strength of this dissimilarly welded joint was obtained by HCF tests at room temperature (RT), 400 °C and 470 °C. It was observed that the failure occurred at the side of CrMoV base metal (BM), weld metal (WM) and heat affected zone (HAZ) of CrMoV side over 5×10 7 cycles for the specimens tested at RT, 400 °C and 470 °C. The detailed microstructures of BMs, WMs and HAZs as well as fracture appearance were observed by optical microscopy (OM) and scanning electron microscopy (SEM). Precipitation and aggregation of carbides along the grain boundaries were clearly detected with the increase of temperature, which brought a negative effect on the fatigue properties. It is interesting to note that the inclusion size leading to crack initiation became smaller for the HCF test at higher temperature. Therefore, reduction in the inclusion size in a welded joint helps to improve the HCF performance at high temperature

  15. The Interfacial Microstructure and Mechanical Properties of Diffusion-Bonded Joints of 316L Stainless Steel and the 4J29 Kovar Alloy Using Nickel as an Interlayer

    Directory of Open Access Journals (Sweden)

    Tingfeng Song

    2016-11-01

    Full Text Available 316L stainless steel (Fe–18Cr–11Ni and a Kovar (Fe–29Ni–17Co or 4J29 alloy were diffusion-bonded via vacuum hot-pressing in a temperature range of 850–950 °C with an interval of 50 °C for 120 min and at 900 °C for 180 and 240 min, under a pressure of 34.66 MPa. Interfacial microstructures of diffusion-bonded joints were characterized by optical microscopy (OM, scanning electron microscopy (SEM, X-ray diffraction (XRD, and energy dispersive spectroscopy (EDS. The inter-diffusion of the elements across the diffusion interface was revealed via electron probe microanalysis (EPMA. The mechanical properties of the joints were investigated via micro Vickers hardness and tensile strength. The results show that an Ni interlayer can serve as an effective diffusion barrier for the bonding of 316L stainless steel and the 4J29 Kovar alloy. The composition of the joints was 316L/Ni s.s (Fe–Cr–Ni/remnant Ni/Ni s.s (Fe–Co–Ni/4J29. The highest tensile strength of 504.91 MPa with an elongation of 38.75% was obtained at 900 °C for 240 min. After the width of nickel solid solution (Fe–Co–Ni sufficiently increased, failure located at the 4J29 side and the fracture surface indicated a ductile nature.

  16. Current redistribution in cables made of insulated, soldered, or oxidized strands

    International Nuclear Information System (INIS)

    Turck, B.

    1979-07-01

    Current redistributions are compared in cables made of insulated strands, soldered, or oxidized strands and insulated strands with periodic joints. After discussing the different current redistributions in the cases of a rapidly changing current and a dc current, several particular situations are investigated: what happens if a strand is broken, or if a local normal zone appears that does not affect all the strands equally, the detection of this normal zone, and the influence of short circuits between strands

  17. Ductile fracture mechanism of low-temperature In-48Sn alloy joint under high strain rate loading.

    Science.gov (United States)

    Kim, Jong-Woong; Jung, Seung-Boo

    2012-04-01

    The failure behaviors of In-48Sn solder ball joints under various strain rate loadings were investigated with both experimental and finite element modeling study. The bonding force of In-48Sn solder on an Ni plated Cu pad increased with increasing shear speed, mainly due to the high strain-rate sensitivity of the solder alloy. In contrast to the cases of Sn-based Pb-free solder joints, the transition of the fracture mode from a ductile mode to a brittle mode was not observed in this solder joint system due to the soft nature of the In-48Sn alloy. This result is discussed in terms of the relationship between the strain-rate of the solder alloy, the work-hardening effect and the resulting stress concentration at the interfacial regions.

  18. Efforts to Develop a 300°C Solder

    Energy Technology Data Exchange (ETDEWEB)

    Norann, Randy A [Perma Works LLC

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  19. Microstructural characterization of weld joints of 9Cr reduced activation ferritic martensitic steel fabricated by different joining methods

    Energy Technology Data Exchange (ETDEWEB)

    Thomas Paul, V.; Saroja, S.; Albert, S.K.; Jayakumar, T.; Rajendra Kumar, E., E-mail: vtp@igcar.gov.in

    2014-10-15

    This paper presents a detailed electron microscopy study on the microstructure of various regions of weldment fabricated by three welding methods namely tungsten inert gas welding, electron beam welding and laser beam welding in an indigenously developed 9Cr reduced activation ferritic/martensitic steel. Electron back scatter diffraction studies showed a random micro-texture in all the three welds. Microstructural changes during thermal exposures were studied and corroborated with hardness and optimized conditions for the post weld heat treatment have been identified for this steel. Hollomon–Jaffe parameter has been used to estimate the extent of tempering. The activation energy for the tempering process has been evaluated and found to be corresponding to interstitial diffusion of carbon in ferrite matrix. The type and microchemistry of secondary phases in different regions of the weldment have been identified by analytical transmission electron microscopy. - Highlights: • Comparison of microstructural parameters in TIG, electron beam and laser welds of RAFM steel • EBSD studies to illustrate the absence of preferred orientation and identification of prior austenite grain size using phase identification map • Optimization of PWHT conditions for indigenous RAFM steel • Study of kinetics of tempering and estimation of apparent activation energy of the process.

  20. Effects of brazing temperature on microstructure and mechanical performance of Al{sub 2}O{sub 3}/AgCuTi/Fe–Ni–Co brazed joints

    Energy Technology Data Exchange (ETDEWEB)

    Cao, Yongtong; Yan, Jiazhen, E-mail: yanjiazhen@scu.edu.cn; Li, Ning; Zheng, Yi; Xin, Chenglai

    2015-11-25

    Al{sub 2}O{sub 3}/Fe–Ni–Co joints are achieved using Ag–Cu–8Ti filler alloy, and the dependence of the joint microstructure and mechanical performance on the brazing temperature has been studied by means of SEM, EDS, XRD and tensile test. The results show that the brazing seam is composed of TiO, Ti{sub 3}Al, Ag (s, s), Cu (s, s), (Cu, Ni) and Ni{sub 4}Ti{sub 3} phases. A layer of Ti{sub 3}Al and TiO products is observed at the Al{sub 2}O{sub 3}/AgCuTi interface and the fracture testing indicates that the thickness of the reaction layer plays a critical role in the joint strength. The joint strength firstly increases and then declines with the thickness of the (Ti{sub 3}Al + TiO) layer increasing, and the formation of the cracks is ascribed to the existence of Ti{sub 3}Al phase. The thermokinetic analysis for the interfacial reaction between Al{sub 2}O{sub 3} and AgCuTi show that the Gibbs free energy equals −88.939 kJ/mol for forming Ti{sub 3}Al and TiO phases, and the growth rate of the reaction layer mainly depends on the diffusion rate of Ti across the formed reaction layer. Meanwhile, the quantitative relationship among brazing temperature, holding time and reaction layer thickness has been established. - Graphical abstract: The theoretical curve of brazing time and thickness is close proximity to the measured values, which means the extracted mathematical relationship (X = 2.2616 × 10{sup −1} exp (−143.85 × 10{sup 3}/8.314 T) × t{sup 0.5}) relatively closed to the actual situation. The growth rate of reaction layer declines with the increase of brazing time, and this phenomenon indicates that the diffusion rate of Ti atoms across the reaction layer is less than the rate of the chemical reaction during brazing, that is, the growth rate of reaction layer mainly depends on the diffusion rate of Ti atoms across the formed reaction layer. - Highlights: • The dependence of seam microstructure on brazing temperature is discussed. • Thermokinetic

  1. Microstructure of a safe-end dissimilar metal weld joint (SA508-52-316L) prepared by narrow-gap GTAW

    Energy Technology Data Exchange (ETDEWEB)

    Ming, Hongliang [Key Laboratory of Nuclear Materials and Safety Assessment, Liaoning Key Laboratory for Safety and Assessment Technique of Nuclear Materials, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China); University of Chinese Academy of Sciences, 19 Yuquan Road, Beijing 100049 (China); Zhang, Zhiming [Key Laboratory of Nuclear Materials and Safety Assessment, Liaoning Key Laboratory for Safety and Assessment Technique of Nuclear Materials, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China); Wang, Jianqiu, E-mail: wangjianqiu@imr.ac.cn [Key Laboratory of Nuclear Materials and Safety Assessment, Liaoning Key Laboratory for Safety and Assessment Technique of Nuclear Materials, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China); Han, En-Hou [Key Laboratory of Nuclear Materials and Safety Assessment, Liaoning Key Laboratory for Safety and Assessment Technique of Nuclear Materials, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China); Wang, Peipei; Sun, Zhiyuan [Shanghai Research Center for Weld and Detection Engineering Technique of Nuclear Equipment, Shanghai 201306 (China)

    2017-01-15

    The microstructure, residual strain and interfacial chemical composition distribution of a safe-end dissimilar metal weld joint (DMWJ, SA508-52-316L) prepared by narrow-gap gas-tungsten arc welding (NG-GTAW) were studied by optical microscope (OM) and scanning electron microscope equipped with an energy dispersive X-ray microanalysis (SEM/EDX) and an electron back scattering diffraction (EBSD) system. Complex microstructure and chemical composition distribution are found, especially at the SA508-52 interface and the 52-316L interface. In brief, a complicated microstructure transition exists within the SA508 heat affected zone (HAZ); the residual strain, the fraction of high angle random grain boundaries and low angle boundaries decrease with increasing the distance from the fusion boundary in 316L HAZ; neither typical type II boundary nor obvious carbon-depleted zone is found near the SA508-52 interface; dramatic and complicated changes of the contents of the main elements, Fe, Cr and Ni, are observed at the distinct interfaces, especially at the SA508-52 interface. No carbon concentration is found at the SA508-52 interface. - Highlights: •Residual strain and GBCD change as a function of the distance from FB in 316L HAZ. •Neither type II boundary nor obvious carbon-depleted zone is found in SA508 HAZ. •No carbon concentration is found at the SA508-52 interface. •The middle part of the DMWJ has the highest residual strain.

  2. Microstructure and stress corrosion cracking of the fusion boundary region in an alloy 182-A533B low alloy steel dissimilar weld joint

    International Nuclear Information System (INIS)

    Hou, Juan; Peng, Qunjia; Takeda, Yoichi; Kuniya, Jiro; Shoji, Tetsuo

    2010-01-01

    Research highlights: → High-angle misorientation at FB, type-II and type-I boundaries. → Highest residual strain and hardness in the zone between FB and type-II boundary. → Type-II and type-I boundaries had lower resistance to SCC growth than the FB. → Crack growth blunted by pitting at the FB. → Reactivation of crack growth from the pitting by oxidation along the grain boundary. - Abstract: Stress corrosion cracking (SCC) in the fusion boundary (FB) region of an Alloy 182-A533B low alloy steel (LAS) dissimilar weld joint in high temperature water doped with sulfate was studied following a microstructure characterization of the FB region. The microstructure characterization suggested the type-II and type-I boundaries in the dilution zone (DZ) adjacent to the FB had lower resistance to SCC growth than the FB. Crack propagating perpendicular to the FB in the DZ was observed to be blunted by pitting at the FB, followed by the reactivation from the pitting by localized oxidation along the grain boundary in LAS.

  3. Microstructure and mechanical property in heat affected zone (HAZ in F82H jointed with SUS316L by fiber laser welding

    Directory of Open Access Journals (Sweden)

    S. Kano

    2016-12-01

    Full Text Available This study investigates the microstructure and mechanical property in heat affected zone (HAZ between F82H and SUS316L jointed by 4 kW fiber laser welding at different parameters such as laser scan rate and beam position. OM/FE-SEM observation, EPMA analysis and nano-indentation hardness test were utilized to characterize the microstructure and evaluate the mechanical property. Results show that the HAZ width is dependent on the welding condition. The precipitation of M23C6 particle in HAZ is found to be closely related to the distance from WM/HAZ interface. Decrease in Cr and C concentration in M23C6 depended on the welding condition; the decrease was relatively milder in the case of shifting the beam position to SUS side. Furthermore, the rapid increment in nano-indentation hardness, i.e. ≈2500 MPa, at HAZ/F82H interface was observed regardless of welding parameters. The temperatures at HAZ/F82H interface were estimated from Cr and C concentration change of M23C6 by EPMA. It was revealed that the temperature of HAZ/F82H interface increased with increasing HAZ width, and that the presence of over-tempered HAZ (THAZ region is confirmed only in the specimens welded right on the F82H/SUS interface (no-shift at the laser scan rate of 3 m/min.

  4. A Hodge dual for soldered bundles

    International Nuclear Information System (INIS)

    Lucas, Tiago Gribl; Pereira, J G

    2009-01-01

    In order to account for all possible contractions allowed by the presence of the solder form, a generalized Hodge dual is defined for the case of soldered bundles. Although for curvature the generalized dual coincides with the usual one, for torsion it gives a completely new dual definition. Starting from the standard form of a gauge Lagrangian for the translation group, the generalized Hodge dual yields precisely the Lagrangian of the teleparallel equivalent of general relativity, and consequently also the Einstein-Hilbert Lagrangian of general relativity

  5. Influence of PC-GTAW Parameters on the Microstructural and Mechanical Properties of Thin AISI 1008 Steel Joints

    Science.gov (United States)

    Kumar, Ravindra; Anant, Ramkishor; Ghosh, P. K.; Kumar, Ankit; Agrawal, B. P.

    2016-09-01

    Butt weld joints are prepared using pulse current gas tungsten arc welding out of thin sheets of AISI 1008 steel using various combinations of pulse parameters. During welding, the welding speed was kept high, but with the increase of welding speed the mean current was also increased to get the required weld joint at the constant heat input. The use of pulse current has led to improvement in mechanical and metallurgical properties of weld joints. It has resulted in less development of humping which is a common problem with high-speed welding. The undercut or dipped weld face is not observed severe. The tensile strength and hardness are enhanced by 12.5 and 12%. The increase of tensile strength and hardness is justified through TEM micrograph showing the presence of dislocation.

  6. Modelling of microstructural creep damage in welded joints of 316L stainless steel; Modelisation de l'endommagement a haute temperature dans le metal d'apport des joints soudes d'acier inoxydable austenitique

    Energy Technology Data Exchange (ETDEWEB)

    Bouche, G

    2000-07-01

    Welded joints of 316L stainless steel under service conditions at elevated temperature are known to be preferential sites of creep damage, as compared to the base material. This damage results in the formation of cavities and the development of creep cracks which can lead to a premature failure of welded components. The complex two-phase microstructure of 316L welds was simulated by manually filling a mould with longitudinal deposited weld beads. The moulded material was then aged during 2000 hours at 600 deg. C. High resolution Scanning Electron Microscopy was largely used to examine the microstructure of the simulated material before and after ageing. Smooth and notched creep specimens were cut from the mould and tested at 600 deg. C under various stress levels. A comparison of the lifetime versus nominal stress curves for the base and welded materials shows a greater dependence of the welded material to creep phenomena. Observation and EBSD analysis show that damage is preferentially located along the austenite grain boundaries. The stress and strain fields in the notched specimens were calculated by finite element method. A correlation of this field to the observed damage was made in order to propose a predictive law relating the creep damage to the mechanical conditions applied locally. Further mechanical tests and simulation on CT specimens and mode II tubular specimens allowed validating the model under various multiaxial loading conditions. (author)

  7. In Situ Study of Reduction Process of CuO Paste and Its Effect on Bondability of Cu-to-Cu Joints

    Science.gov (United States)

    Yao, Takafumi; Matsuda, Tomoki; Sano, Tomokazu; Morikawa, Chiaki; Ohbuchi, Atsushi; Yashiro, Hisashi; Hirose, Akio

    2018-04-01

    A bonding method utilizing redox reactions of metallic oxide microparticles achieves metal-to-metal bonding in air, which can be alternative to lead-rich high-melting point solder. However, it is known that the degree of the reduction of metallic oxide microparticles have an influence on the joint strength using this bonding method. In this paper, the reduction behavior of CuO paste and its effect on Cu-to-Cu joints were investigated through simultaneous microstructure-related x-ray diffraction and differential scanning calorimetry measurements. The CuO microparticles in the paste were gradually reduced to submicron Cu2O particles at 210-250°C. Subsequently, Cu nanoparticles were generated instantaneously at 300-315°C. There was a marked difference in the strengths of the joints formed at 300°C and 350°C. Thus, the Cu nanoparticles play a critical role in sintering-based bonding using CuO paste. Furthermore, once the Cu nanoparticles have formed, the joint strength increases with higher bonding temperature (from 350°C to 500°C) and pressure (5-15 MPa), which can exceed the strength of Pb-5Sn solder at higher temperature and pressure.

  8. Laser assisted soldering: microdroplet accumulation with a microjet device.

    Science.gov (United States)

    Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

    1998-01-01

    We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

  9. Characterization of microstructure and texture across dissimilar super duplex/austenitic stainless steel weldment joint by super duplex filler metal

    Energy Technology Data Exchange (ETDEWEB)

    Eghlimi, Abbas, E-mail: a.eghlimi@ma.iut.ac.ir [Department of Materials Engineering, Isfahan University of Technology, Isfahan 84156-83111 (Iran, Islamic Republic of); Shamanian, Morteza [Department of Materials Engineering, Isfahan University of Technology, Isfahan 84156-83111 (Iran, Islamic Republic of); Eskandarian, Masoomeh [Department of Materials Engineering, Shiraz University, Shiraz 71348-51154 (Iran, Islamic Republic of); Zabolian, Azam [Department of Natural Resources, Isfahan University of Technology, Isfahan 84156-83111 (Iran, Islamic Republic of); Szpunar, Jerzy A. [Department of Mechanical Engineering, University of Saskatchewan, Saskatoon SK S7N 5A9 (Canada)

    2015-08-15

    In the present paper, microstructural changes across an as-welded dissimilar austenitic/duplex stainless steel couple welded by a super duplex stainless steel filler metal using gas tungsten arc welding process is characterized with optical microscopy and electron back-scattered diffraction techniques. Accordingly, variations of microstructure, texture, and grain boundary character distribution of base metals, heat affected zones, and weld metal were investigated. The results showed that the weld metal, which was composed of Widmanstätten austenite side-plates and allotriomorphic grain boundary austenite morphologies, had the weakest texture and was dominated by low angle boundaries. The welding process increased the ferrite content but decreased the texture intensity at the heat affected zone of the super duplex stainless steel base metal. In addition, through partial ferritization, it changed the morphology of elongated grains of the rolled microstructure to twinned partially transformed austenite plateaus scattered between ferrite textured colonies. However, the texture of the austenitic stainless steel heat affected zone was strengthened via encouraging recrystallization and formation of annealing twins. At both interfaces, an increase in the special character coincident site lattice boundaries of the primary phase as well as a strong texture with <100> orientation, mainly of Goss component, was observed. - Graphical abstract: Display Omitted - Highlights: • Weld metal showed local orientation at microscale but random texture at macroscale. • Intensification of <100> orientated grains was observed adjacent to the fusion lines. • The austenite texture was weaker than that of the ferrite in all duplex regions. • Welding caused twinned partially transformed austenites to form at SDSS HAZ. • At both interfaces, the ratio of special CSL boundaries of the primary phase increased.

  10. Microstructures and mechanical properties of magnesium alloy and stainless steel weld-joint made by friction stir lap welding

    International Nuclear Information System (INIS)

    Wei, Yanni; Li, Jinglong; Xiong, Jiangtao; Huang, Fu; Zhang, Fusheng

    2012-01-01

    Highlights: → Friction stir lap welding technology with cutting pin was successfully employed to form lap joint of magnesium and steel. → The cutting pin made the lower steel participate in deformation and the interface was no longer flat. → A saw-toothed structure formed due to a mechanical mixing of the magnesium and steel was found at the interface. → A high-strength joint was produced which fractured in the magnesium side. -- Abstract: Friction stir lap welding was conducted on soft/hard metals. A welding tool was designed with a cutting pin of rotary burr made of tungsten carbide, which makes the stirring pin possible to penetrate and cut the surface layer of the hard metal. Magnesium alloy AZ31 and stainless steel SUS302 were chosen as soft/hard base metals. The structures of the joining interface were analyzed by scanning electron microscopy (SEM). The joining strength was evaluated by tensile shear test. The results showed that flower-like interfacial morphologies were presented with steel flashes and scraps, which formed bonding mechanisms of nail effect by long steel flashes, zipper effect by saw-tooth structure and metallurgical bonding. The shear strength of the lap joint falls around the shear strength of butt joint of friction stir welded magnesium alloy.

  11. Laser solder welding of articular cartilage: tensile strength and chondrocyte viability.

    Science.gov (United States)

    Züger, B J; Ott, B; Mainil-Varlet, P; Schaffner, T; Clémence, J F; Weber, H P; Frenz, M

    2001-01-01

    The surgical treatment of full-thickness cartilage defects in the knee joint remains a therapeutic challenge. Recently, new techniques for articular cartilage transplantation, such as mosaicplasty, have become available for cartilage repair. The long-term success of these techniques, however, depends not only on the chondrocyte viability but also on a lateral integration of the implant. The goal of this study was to evaluate the feasibility of cartilage welding by using albumin solder that was dye-enhanced to allow coagulation with 808-nm laser diode irradiation. Conventional histology of light microscopy was compared with a viability staining to precisely determine the extent of thermal damage after laser welding. Indocyanine green (ICG) enhanced albumin solder (25% albumin, 0.5% HA, 0.1% ICG) was used for articular cartilage welding. For coagulation, the solder was irradiated through the cartilage implant by 808-nm laser light and the tensile strength of the weld was measured. Viability staining revealed a thermal damage of typically 500 m in depth at an irradiance of approximately 10 W/cm(2) for 8 seconds, whereas conventional histologies showed only half of the extent found by the viability test. Heat-bath investigations revealed a threshold temperature of minimum 54 degrees C for thermal damage of chondrocytes. Efficient cartilage bonding was obtained by using bovine albumin solder as adhesive. Maximum tensile strength of more than 10 N/cm(2) was achieved. Viability tests revealed that the thermal damage is much greater (up to twice) than expected after light microscopic characterization. This study shows the feasibility to strongly laser weld cartilage on cartilage by use of a dye-enhanced albumin solder. Possibilities to reduce the range of damage are suggested. Copyright 2001 Wiley-Liss, Inc.

  12. Fluxless flip-chip bonding using a lead-free solder bumping technique

    Science.gov (United States)

    Hansen, K.; Kousar, S.; Pitzl, D.; Arab, S.

    2017-09-01

    With the LHC exceeding the nominal instantaneous luminosity, the current barrel pixel detector (BPIX) of the CMS experiment at CERN will reach its performance limits and undergo significant radiation damage. In order to improve detector performance in high luminosity conditions, the entire BPIX is replaced with an upgraded version containing an additional detection layer. Half of the modules comprising this additional layer are produced at DESY using fluxless and lead-free bumping and bonding techniques. Sequential solder-jetting technique is utilized to wet 40-μm SAC305 solder spheres on the silicon-sensor pads with electroless Ni, Pd and immersion Au (ENEPIG) under-bump metallization (UBM). The bumped sensors are flip-chip assembled with readout chips (ROCs) and then reflowed using a flux-less bonding facility. The challenges for jetting low solder volume have been analyzed and will be presented in this paper. An average speed of 3.4 balls per second is obtained to jet about 67 thousand solder balls on a single chip. On average, 7 modules have been produced per week. The bump-bond quality is evaluated in terms of electrical and mechanical properties. The peak-bump resistance is about 17.5 mΩ. The cross-section study revealed different types of intermetallic compounds (IMC) as a result of interfacial reactions between UBM and solder material. The effect of crystalline phases on the mechanical properties of the joint is discussed. The mean shear strength per bump after the final module reflow is about 16 cN. The results and sources of yield loss of module production are reported. The achieved yield is 95%.

  13. Effects of thermal aging on the microstructure of Type-II boundaries in dissimilar metal weld joints

    Science.gov (United States)

    Yoo, Seung Chang; Choi, Kyoung Joon; Bahn, Chi Bum; Kim, Si Hoon; Kim, Ju Young; Kim, Ji Hyun

    2015-04-01

    In order to investigate the effects of long-term thermal aging on the microstructural evolution of Type-II boundary regions in the weld metal of Alloy 152, a representative dissimilar metal weld was fabricated from Alloy 690, Alloy 152, and A533 Gr.B. This mock-up was thermally aged at 450 °C to accelerate the effects of thermal aging in a nuclear power plant operation condition (320 °C). The microstructure of the Type-II boundary region of the weld root, which is parallel to and within 100 μm of the fusion boundary and known to be more susceptible to material degradation, was then characterized after different aging times using a scanning electron microscope equipped with an energy dispersive X-ray spectroscope for micro-compositional analysis, electron backscattered diffraction detector for grain and grain boundary orientation analysis, and a nanoindenter for measurement of mechanical properties. Through this, it was found that a steep compositional gradient and high grain average misorientation is created in the narrow zone between the Type-II and fusion boundaries, while the concentration of chromium and number of low-angle grain boundaries increases with aging time. A high average hardness was also observed in the same region of the dissimilar metal welds, with hardness peaking with thermal aging simulating an operational time of 15 years.

  14. Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

    Energy Technology Data Exchange (ETDEWEB)

    Hu, Xiaowu, E-mail: xwhmaterials@aliyun.com [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Li, Yulong [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Liu, Yi [School of Materials Science and Engineering, Nanchang University, Nanchang 330031 (China); Min, Zhixian [China Electronics Technology Group Corporation No. 38 Research Institute, Hefei 230088 (China)

    2015-03-15

    Highlights: • The Sn0.7Cu–xBi solder alloys were directionally solidified. • Both spacing and diameter of fibers decreased with increasing solidification rate. • The UTS and YS first increased with increased solidification rate, then decreased. • The UTS and YS of Sn0.7Cu–xBi first increased with increased Bi content. - Abstract: Bi-containing Sn0.7Cu (SC) eutectic solder alloys were prepared and subjected to directional solidification, through which new types of fiber reinforced eutectic composites were generated. The influences of Bi addition on the microstructures and tensile properties of directionally solidified (DS) Bi-containing eutectic SC lead-free solder alloys have been investigated by using differential scanning calorimetry (DSC), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and a tensile testing machine. The experimental results showed that addition of Bi could effectively reduce both the melting temperature and undercooling of SC solder alloy. The microstructures of DS SC–xBi solder alloys were composed of Sn-rich phase (β) and Cu{sub 6}Sn{sub 5} fiber. No other intermetallic compounds (IMCs) with Bi content were observed in the solder matrix for SC solder alloys with various Bi contents. Both fiber spacing and diameter all decreased gradually with increasing growth rate and/or Bi content. Besides, the regularity of Cu{sub 6}Sn{sub 5} fibers alignment also decreased with increasing growth rate, too. The tensile strengths of the SC–xBi eutectic solder alloys varied parabolically with growth rate (R). When R was 60 μm/s, maximum tensile strengths of 43.8, 55.2 and 56.37 MPa were reached for SC, SC0.7Bi and SC1.3Bi solder alloys. A comparison of tensile strength of SC, SC0.7Bi and SC1.3Bi with the same R indicated that the tensile strength increased with increasing Bi content, which was attributed to the presence of Bi and its role in refining microstructure and solid solution strengthening.

  15. HAZ microstructure in joints made of X13CrMoCoVNbNB9-2-1 (PB2 steel welded with and without post-weld heat treatment

    Directory of Open Access Journals (Sweden)

    M. Łomozik

    2016-07-01

    Full Text Available The article presents the results of research butt welded joints made of X13CrMoCoVNbNB9-2-1 steel. The joints were welded with post-weld heat treatment PWHT and without PWHT, using the temper bead technique TBT. After welding the joint welded with PWHT underwent stress-relief annealing at 770 °C for 3 hours. The scope of structural tests included the microstructural examination of the coarse-grained heat affected zone (HAZ areas of the joints, the comparison of the morphology of these areas and the determination of carbide precipitate types of the coarse grain heat affected zone (CGHAZ of the joints welded with and without PWHT.

  16. Influencing Factors for the Microstructure and Mechanical Properties of Micro Porous Titanium Manufactured by Metal Injection Molding

    Directory of Open Access Journals (Sweden)

    Zhen Lu

    2016-04-01

    Full Text Available Porous titanium is a new structural and functional material. It is widely used in many fields since it integrates the properties of biomaterials with those of metallic foam. A new technology that combines both the preparation and forming of porous materials has been proposed in this paper. Moreover, a new solder was developed that could be employed in the joining of porous materials. Influencing factors for microstructure and mechanical properties of the parent material and joint interface are identified. Metal injection molding (MIM technology was used for fabricating porous materials. The feedstock for injection molding of porous titanium powders was prepared from titanium powders and a polymer-based binder system. In addition, the proportion of powder loading and binders was optimized. Through MIM technology, a porous titanium filter cartridge was prepared. For the purpose of investigating the thermal debinding technology of the filter cartridge, effects of the sintering temperature on the porosity, morphology of micropores and mechanical properties were analyzed. It could be found that when the sintering temperature increased, the relative density, bending and compression strength of the components also increased. Moreover, the porosity reached 32.28% when the sintering temperature was 1000 °C. The microstructure morphology indicated that micropores connected with each other. Meanwhile, the strength of the components was relatively high, i.e., the bending and compression strength was 65 and 60 MPa, respectively. By investigating the joining technology of porous filter cartridges, the ideal components of the solder and pressure were determined. Further research revealed that the micropore structure of the joint interface is the same as that of the parent material, and that the bending strength of the joint interface is 40 MPa.

  17. Texture, microstructure, and fractal features of the low-cycle fatigue failure of the metal in pipeline welded joints

    Science.gov (United States)

    Usov, V. V.; Gopkalo, E. E.; Shkatulyak, N. M.; Gopkalo, A. P.; Cherneva, T. S.

    2015-09-01

    Crystallographic texture and fracture features are studied after low-cycle fatigue tests of laboratory specimens cut from the base metal and the characteristic zones of a welded joint in a pipeline after its longterm operation. The fractal dimensions of fracture surfaces are determined. The fractal dimension is shown to increase during the transition from ductile to quasi-brittle fracture, and a relation between the fractal dimension of a fracture surface and the fatigue life of the specimen is found.

  18. Tin-silver and tin-copper alloys for capillarity joining-soft soldering-of copper piping

    International Nuclear Information System (INIS)

    Duran, J.; Amo, J. M.; Duran, C. M.

    2001-01-01

    It is studied the influence of the type of alloy used as filling material on the defects of the soldering joints in copper piping installations, which induce the fluid leak of the systems. The different eutectic temperatures and solidus-liquidus ranges of these alloys, require the setting of the soldering heat input in each case to obtain the suitable capillarity features and alloying temperatures to achieve for the correct formation of the bonding. Most defects in the joints are demonstrated to be generated by bad dossification of thermal inputs, which led depending on the filler alloy used to variations in its fluidity that may produce penetration failures in the bonds or insufficient consistency for the filling of the joints. (Author) 7 refs

  19. Microstructural Evolution of Inconel 625 and Inconel 686CPT Weld Metal for Clad Carbon Steel Linepipe Joints: A Comparator Study

    Science.gov (United States)

    Maltin, Charles A.; Galloway, Alexander M.; Mweemba, Martin

    2014-07-01

    Microstructural evolution of Inconel 625 and Inconel 686CPT filler metals, used for the fusion welding of clad carbon steel linepipe, has been investigated and compared. The effects of iron dilution from the linepipe parent material on the elemental segregation potential of the filler metal chemistry have been considered. The results obtained provide significant evidence to support the view that, in Inconel 686CPT weld metal, the segregation of tungsten is a function of the level of iron dilution from the parent material. The data presented indicate that the incoherent phase precipitated in the Inconel 686CPT weld metal has a morphology that is dependent on tungsten enrichment and, therefore, iron dilution. Furthermore, in the same weld metal, a continuous network of finer precipitates was observed. The Charpy impact toughness of each filler metal was evaluated, and the results highlighted the superior impact toughness of the Inconel 625 weld metal over that of Inconel 686CPT.

  20. Microstructural, Micro-hardness and Sensitization Evaluation in HAZ of Type 316L Stainless Steel Joint with Narrow Gap Welds

    Energy Technology Data Exchange (ETDEWEB)

    Islam, Faisal Shafiqul; Jang, Changheui [KAIST, Daejeon (Korea, Republic of); Kang, Shi Chull [Korea Institute of Nuclear Safety, Daejeon (Korea, Republic of)

    2015-10-15

    From Micro-hardness measurement HAZ zone was found approximately 1-1.5 mm in NGW and DL-EPR test confirmed that 316L NGW HAZ was not susceptible to sensitization as DOS <1% according to sensitization criteria based on reference. In nuclear power plants 316L stainless steels are commonly used material for their metallurgical stability, high corrosion resistance, and good creep and ductility properties at elevated temperatures. Welding zone considered as the weakest and failure initiation source of the components. For safety and economy of nuclear power plants accurate and dependable structural integrity assessment of main components like pressure vessels and piping are need as it joined by different welding process. In similar and dissimilar metal weld it has been observed that weld microstructure cause the variation of mechanical properties through the thickness direction. In the Heat Affected Zone (HAZ) relative to the fusion line face a unique thermal experience during welding.

  1. TRANSIENT FINITE ELEMENT SIMULATION AND MICROSTRUCTURE EVOLUTION OF AA2219 WELD JOINT USING GAS TUNGSTEN ARC WELDING PROCESS

    Directory of Open Access Journals (Sweden)

    Sivaraman Arunkumar

    2016-09-01

    Full Text Available In this study we focus on finite element simulation of gas tungsten arc welding (GTAW of AA2219 aluminum alloy and the behavioral of the microstructure before and after weld. The simulations were performed using commercial COMSOL Multiphysics software. The thermal history of the weld region was studied by initially developed mathematical model. A sweep type meshing was used and transient analysis was performed for one welding cycle. The highest temperature noted was 3568 °C during welding. The welding operation was performed on 200×100×25 mm plates. Through metallurgical characterization, it was observed that a fair copper rich cellular (CRC network existed in the weld region. A small amount of intermetallic compounds like Al2Cu is observed through the XRD pattern.

  2. Investigation of Sn-Pb solder bumps of prototype photo detectors for the LHCb experiment

    CERN Document Server

    Delsante, M L; Arnau-Izquierdo, G

    2004-01-01

    The Large Hadron Collider (LHC) is now under construction at the European Organization for Nuclear Research (CERN). LHCb is one of the dedicated LHC experiments, allowing high energy proton-proton collisions to be exploited. This paper presents the results of the metallurgic studies carried out on Sn-Pb solder bumps of prototype vacuum photo detectors under development for LHCb, and in particular for the ring imaging Cherenkov-hybrid photo diode (RICH-HPD) project. These detectors encapsulate, in a vacuum tube, an assembly made of two silicon chips bonded together by a matrix of solder bumps. Each bump lies on a suitable system of under-bump metallic layers ensuring mechanical and electrical transition between the chip pad and the solder alloy. During manufacturing of the detector, bump-bonded (BB) assemblies are exposed to severe heat cycles up to 400 degree C inducing, in the present fabrication process, a clear degradation of electrical connectivity. Several investigations such as microstructural observati...

  3. Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

    National Research Council Canada - National Science Library

    Chung, Kohn C

    2006-01-01

    .... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

  4. Effects of nitrogen in shielding gas on microstructure evolution and localized corrosion behavior of duplex stainless steel welding joint

    Science.gov (United States)

    Zhang, Zhiqiang; Jing, Hongyang; Xu, Lianyong; Han, Yongdian; Zhao, Lei; Zhou, Chao

    2017-05-01

    The effects of nitrogen addition in shielding gas on microstructure evolution and localized corrosion behavior of duplex stainless steel (DSS) welds were studied. N2-supplemented shielding gas facilitated the primary austenite formation, suppressed the Cr2N precipitation in weld root, and increased the microhardnesses of weld metal. Furthermore, N2-supplemented shielding gas increased pitting resistance equivalent number (PREN) of austenite, but which decreased slightly PREN of ferrite. The modified double loop electrochemical potentiokinetic reactivation in 2 M H2SO4 + 1 M HCl was an effective method to study the localized corrosion of the different zones in the DSS welds. The adding 2% N2 to pure Ar shielding gas improved the localized corrosion resistance in the DSS welds, which was due to compensation for nitrogen loss and promoting nitrogen further solution in the austenite phases, suppression of the Cr2N precipitation in the weld root, and increase of primary austenite content with higher PREN than the ferrite and secondary austenite. Secondary austenite are prone to selective corrosion because of lower PREN compared with ferrite and primary austenite. Cr2N precipitation in the pure Ar shielding weld root and heat affected zone caused the pitting corrosion within the ferrite and the intergranular corrosion at the ferrite boundary. In addition, sigma and M23C6 precipitation resulted in the intergranular corrosion at the ferrite boundary.

  5. Interfacial Microstructure and Mechanical Properties of Friction Stir Welded Joints of Commercially Pure Aluminum and 304 Stainless Steel

    Science.gov (United States)

    Murugan, Balamagendiravarman; Thirunavukarasu, Gopinath; Kundu, Sukumar; Kailas, Satish V.; Chatterjee, Subrata

    2018-05-01

    In the present investigation, friction stir welding of commercially pure aluminum and 304 stainless steel was carried out at varying tool rotational speeds from 200 to 1000 rpm in steps of 200 rpm using 60 mm/min traverse speed at 2 (degree) tool tilt angle. Microstructural characterization of the interfacial zone was carried out using optical microscope and scanning electron microscope. Energy-dispersive spectroscopy indicated the presence of FeAl3 intermetallic phase. Thickness of the intermetallic layer increased with the increase in tool rotational speed. X-ray diffraction studies indicated the formation of intermetallic phases like FeAl2, Fe4Al13, Fe2Al5, and FeAl3. A maximum tensile strength of 90% that of aluminum along with 4.5% elongation was achieved with the welded sample at tool rotational speed of 400 rpm. The stir zone showed higher hardness as compared to base metals, heat affected zone, and thermo-mechanically affected zone due to the presence of intermetallics. The maximum hardness value at the stir zone was achieved at 1000 rpm tool rotational speed.

  6. Probing Phase Transformations and Microstructural Evolutions at the Small Scales: Synchrotron X-ray Microdiffraction for Advanced Applications in [Phase 3 Memory,] 3D IC (Integrated Circuits) and Solar PV (Photovoltaic) Devices

    Energy Technology Data Exchange (ETDEWEB)

    Radchenko, I. [Singapore Univ. of Technology and Design (SUTD) (Singapore); Tippabhotla, S. K. [Singapore Univ. of Technology and Design (SUTD) (Singapore); Tamura, N. [Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States); Budiman, A. S. [Singapore Univ. of Technology and Design (SUTD) (Singapore)

    2016-10-21

    Synchrotron x-ray microdiffraction (μXRD) allows characterization of a crystalline material in small, localized volumes. Phase composition, crystal orientation and strain can all be probed in few-second time scales. Crystalline changes over a large areas can be also probed in a reasonable amount of time with submicron spatial resolution. However, despite all the listed capabilities, μXRD is mostly used to study pure materials but its application in actual device characterization is rather limited. This article will explore the recent developments of the μXRD technique illustrated with its advanced applications in microelectronic devices and solar photovoltaic systems. Application of μXRD in microelectronics will be illustrated by studying stress and microstructure evolution in Cu TSV (through silicon via) during and after annealing. Here, the approach allowing study of the microstructural evolution in the solder joint of crystalline Si solar cells due to thermal cycling will be also demonstrated.

  7. Effect of Solder Flux Residues on Corrosion of Electronics

    DEFF Research Database (Denmark)

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

    2009-01-01

    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... testing and use in the field, consequences and recommendations are given. Failures, caused by harsh[1] customer environments, are not covered in this paper....

  8. Microstructure and Mechanical Characterization of a Dissimilar Friction-Stir-Welded CuCrZr/CuNiCrSi Butt Joint

    Directory of Open Access Journals (Sweden)

    Youqing Sun

    2018-05-01

    Full Text Available Dissimilar CuNiCrSi and CuCrZr butt joints were successfully frictionstirwelded at constant welding speed of 150 mm/min and rotational speed of 1400 rpm with the CuCrZr alloy or the CuNiCrSi alloy located on the advancing side (AS. The microstructure and mechanical properties of joints were investigated. When the CuCrZr alloy was located on the AS, the area of retreating material in the nugget zone was a little bigger. The Cr solute-rich particles were found in the nugget zone on CuCrZr side (CuCrZr-NZ while a larger density of solute-rich particles identified as the concentration of Cr and Si element was found in the nugget zone on CuNiCrSi side (CuNiCrSi-NZ. The Cr precipitates and δ-Ni2Si precipitates were found in the base metal on CuNiCrSi side (CuNiCrSi-BM but only Cr precipitates can be observed in the base metal on CuCrZr side (CuCrZr-BM. Precipitates were totally dissolved into Cu matrix in both CuCrZr-NZ and CuNiCrSi-NZ, which led to a sharp decrease in both micro-hardness and tensile strength from BM to NZ. When the CuNiCrSi was located on the AS, the tensile testing results showed the fracture occurred at the CuCrZr-NZ, while the fracture was found at the mixed zone of CuNiCrSi-NZ and CuCrZr-NZ for the other case.

  9. Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages

    Energy Technology Data Exchange (ETDEWEB)

    Gain, Asit Kumar [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong); Chan, Y.C. [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong)], E-mail: eeycchan@cityu.edu.hk; Yung, Winco K.C. [Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon (Hong Kong)

    2009-05-25

    The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear loads with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After the addition of nano Ni powder in Sn-based lead-free solders, there were no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn-rich phase was observed. Also on the fracture surfaces a fine Zn-Ni compound was found. After the addition of nano Ni powder in Sn-based solders, the shear loads were increased due to a refinement of the microstructure and in addition, ductile fracture surfaces were clearly observed. The shear loads of the plain Sn-9Zn and Sn-8Zn-3Bi solders after one reflow cycle were about 1798 g and 2059 g, respectively. After the addition of nano Ni powder, their loads were about 2172 g and 2212 g, respectively, after one reflow cycle and their shear loads after eight reflow cycles were about 2099 g and 2081 g, respectively.

  10. Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages

    International Nuclear Information System (INIS)

    Gain, Asit Kumar; Chan, Y.C.; Yung, Winco K.C.

    2009-01-01

    The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear loads with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After the addition of nano Ni powder in Sn-based lead-free solders, there were no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn-rich phase was observed. Also on the fracture surfaces a fine Zn-Ni compound was found. After the addition of nano Ni powder in Sn-based solders, the shear loads were increased due to a refinement of the microstructure and in addition, ductile fracture surfaces were clearly observed. The shear loads of the plain Sn-9Zn and Sn-8Zn-3Bi solders after one reflow cycle were about 1798 g and 2059 g, respectively. After the addition of nano Ni powder, their loads were about 2172 g and 2212 g, respectively, after one reflow cycle and their shear loads after eight reflow cycles were about 2099 g and 2081 g, respectively.

  11. Effect of Different Chromium Additions on the Microstructure and Mechanical Properties of Multipass Weld Joint of Duplex Stainless Steel

    Science.gov (United States)

    Kang, Dong Hoon; Lee, Hae Woo

    2012-12-01

    The correlation between the mechanical properties and ferrite volume fraction (approximately 40, 50, and 60 Ferrite Number [FN]) in duplex stainless steel weld metals were investigated by changing the Cr content in filler wires with a flux-cored arc-welding (FCAW) process. The interpass temperature was thoroughly maintained under a maximum of 423 K (150 °C), and the heat input was also sustained at a level under 15 KJ/cm in order to minimize defects. The microstructure examination demonstrated that the δ-ferrite volume fraction in the deposited metals increased as the Cr/Ni equivalent ratio increased, and consequently, chromium nitride (Cr2N) precipitation was prone to occur in the ferrite domains due to low solubility of nitrogen in this phase. Thus, more dislocations are pinned by the precipitates, thereby lowering the mobility of the dislocations. Not only can this lead to the strength improvement, but also it can accentuate embrittlement of the weld metal at subzero temperature. Additionally, the solid-solution strengthening by an increase of Cr and Mo content in austenite phase depending on the reduction of austenite proportion also made an impact on the increase of the tensile and yield strength. On the other hand, the impact test (at 293 K, 223 K, and 173 K [20 °C, -50 °C, and -100 °C]) showed that the specimen containing about 40 to 50 FN had the best result. The absorbed energy of about 40 to 50 J sufficiently satisfied the requirements for industrial applications at 223 K (-50 °C), while the ductile-to-brittle transition behavior exhibited in weldment containing 60 FN. As the test temperature decreased under 223 K (-50 °C), a narrow and deep dimple was transformed into a wide and shallow dimple, and a significant portion of the fracture surface was occupied by a flat cleavage facet with river patterns.

  12. Evaluation on the characteristics of tin-silver-bismuth solder

    Science.gov (United States)

    Xia, Z.; Shi, Y.; Chen, Z.

    2002-02-01

    Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

  13. Miniaturization of Micro-Solder Bumps and Effect of IMC on Stress Distribution

    Science.gov (United States)

    Choudhury, Soud Farhan; Ladani, Leila

    2016-07-01

    As the joints become smaller in more advanced packages and devices, intermetallic (IMCs) volume ratio increases, which significantly impacts the overall mechanical behavior of joints. The existence of only a few grains of Sn (Tin) and IMC materials results in anisotropic elastic and plastic behavior which is not detectable using conventional finite element (FE) simulation with average properties for polycrystalline material. In this study, crystal plasticity finite element (CPFE) simulation is used to model the whole joint including copper, Sn solder and Cu6Sn5 IMC material. Experimental lap-shear test results for solder joints from the literature were used to validate the models. A comparative analysis between traditional FE, CPFE and experiments was conducted. The CPFE model was able to correlate the experiments more closely compared to traditional FE analysis because of its ability to capture micro-mechanical anisotropic behavior. Further analysis was conducted to evaluate the effect of IMC thickness on stress distribution in micro-bumps using a systematic numerical experiment with IMC thickness ranging from 0% to 80%. The analysis was conducted on micro-bumps with single crystal Sn and bicrystal Sn. The overall stress distribution and shear deformation changes as the IMC thickness increases. The model with higher IMC thickness shows a stiffer shear response, and provides a higher shear yield strength.

  14. Microstructure of Vacuum-Brazed Joints of Super-Ni/NiCr Laminated Composite Using Nickel-Based Amorphous Filler Metal

    Science.gov (United States)

    Ma, Qunshuang; Li, Yajiang; Wu, Na; Wang, Juan

    2013-06-01

    Vacuum brazing of super-Ni/NiCr laminated composite and Cr18-Ni8 stainless steel was carried out using Ni-Cr-Si-B amorphous filler metal at 1060, 1080, and 1100 °C, respectively. Microstructure and phase constitution were investigated by means of optical and scanning electron microscopy, energy-dispersive spectroscopy, x-ray diffraction, and micro-hardness tester. When brazed at 1060-1080 °C, the brazed region can be divided into two distinct zones: isothermally solidified zone (ISZ) consisting of γ-Ni solid solution and athermally solidified zone (ASZ) consisting of Cr-rich borides. Micro-hardness of the Cr-rich borides formed in the ASZ was as high as 809 HV50 g. ASZ decreased with increase of the brazing temperature. Isothermal solidification occurred sufficiently at 1100 °C and an excellent joint composed of γ-Ni solid solution formed. The segregation of boron from ISZ to residual liquid phase is the reason of Cr-rich borides formed in ASZ. The formation of secondary precipitates in diffusion-affected zone is mainly controlled by diffusion of B.

  15. Double-sided laser beam welded T-joints for aluminum-lithium alloy aircraft fuselage panels: Effects of filler elements on microstructure and mechanical properties

    Science.gov (United States)

    Han, Bing; Tao, Wang; Chen, Yanbin; Li, Hao

    2017-08-01

    In the current work, T-joints consisting of 2.0 mm thick 2060-T8/2099-T83 aluminum-lithium alloys for aircraft fuselage panels have been fabricated by double-sided fiber laser beam welding with different filler wires. A new type wire CW3 (Al-6.2Cu-5.4Si) was studied and compared with conventional wire AA4047 (Al-12Si) mainly on microstructure and mechanical properties. It was found that the main combined function of Al-6.2%Cu-5.4%Si in CW3 resulted in considerable improvements especially on intergranular strength, hot cracking susceptibility and hoop tensile properties. Typical non-dendritic equiaxed zone (EQZ) was observed along welds' fusion boundary. Hot cracks and fractures during the load were always located within the EQZ, however, this typical zone could be restrained by CW3, effectively. Furthermore, changing of the main intergranular precipitated phase within the EQZ from T phase by AA4047 to T2 phase by CW3 also resulted in developments on microscopic intergranular reinforcement and macroscopic hoop tensile properties. In addition, bridging caused by richer substructure dendrites within CW3 weld's columnar zone resulted in much lower hot cracking susceptibility of the whole weld than AA4047.

  16. Interfacial microstructure and mechanical properties of diffusion-bonded titanium-stainless steel joints using a nickel interlayer

    International Nuclear Information System (INIS)

    Kundu, S.; Chatterjee, S.

    2006-01-01

    Diffusion bonding was carried out between commercially pure titanium and 304 stainless steel using nickel interlayer in the temperature range of 800-950 deg. C for 3.6 ks under 3 MPa load in vacuum. The transition joints thus formed were characterized in optical and scanning electron microscopes. TiNi 3 , TiNi and Ti 2 Ni are formed at the nickel-titanium (Ni-Ti) interface; whereas, stainless steel-nickel (SS-Ni) interface is free from intermetallic compounds up to 900 deg. C processing temperatures. At 950 deg. C, Ni-Ti interface exhibits the presence of β-Ti discrete islands in the matrix of Ti 2 Ni and the phase mixture of λ + χ + α-Fe, λ + α-Fe, λ + FeTi + β-Ti and FeTi + β-Ti occurs at the stainless steel-nickel interface. Nickel is able to inhibit the diffusion of Ti to stainless steel side up to 900 deg. C temperature; however, becomes unable to restrict the migration of Ti to stainless steel at 950 deg. C. Bond strength was also evaluated and maximum tensile strength of ∼302 MPa and shear strength of ∼219 MPa were obtained for the diffusion couple processed at 900 deg. C temperature due to better contact of the mating surfaces and failure takes place at the Ni-Ti interface. At higher joining temperature, the formation of Fe-Ti bases intermetallics reduces the bond strength and failure occurs at the SS-Ni interface

  17. Microstructural characterization and formation of α′ martensite phase in Ti–6Al–4V alloy butt joints produced by friction stir and gas tungsten arc welding processes

    International Nuclear Information System (INIS)

    Esmaily, M.; Nooshin Mortazavi, S.; Todehfalah, P.; Rashidi, M.

    2013-01-01

    Highlights: ► A fusion (GTAW) and a solid state method (FSW) are used to weld Ti–6Al–4V alloy. ► Optimal parameters yielding defects-free weldments are identified. ► A very careful microstructural quantification of the FSW and GTAW weldments are performed. ► α′ Martensite formed only in FSWed samples and avoided in GTAWed samples. ► FSW process produced joints with considerably smaller HAZ and higher hardness values. - Abstract: The obtained microstructures of a Ti–6Al–4V alloy welded by Gas Tungsten Arc Welding (GTAW) and Friction Stir Welding (FSW) were investigated and evaluated quantitatively. In the GTAW method, the effect of current was examined so that the samples were subjected to various currents between 90 and 120 A. In the FSW process, samples were welded by different rotational speeds (450–850 rpm). Non-destructive tests including Visual and Radiography Tests (VT and RT) were used to identify defect-free samples. The microstructural studies by electron microscopes revealed formation of different phases in the weld area of the samples welded via mentioned methods. The recorded peak temperatures in the weld regions compared favorably with the expectations about the evolved microstructures. A bi-modal microstructure was just obtained in the FSWed sample with a peak temperature below β transus temperature (T < 995 °C). α′ martensite phase, which is an acicular and strengthening phase in this alloy, was only observed in FSWed specimens

  18. Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X = Bi, In) solders with Cu substrate

    International Nuclear Information System (INIS)

    Hodulova, Erika; Palcut, Marian; Lechovic, Emil; Simekova, Beata; Ulrich, Koloman

    2011-01-01

    Highlights: → In substitutes Sn in intermetallic compounds formed at the Cu-solder interface. → Bi and In decrease the parabolic rate constant of Cu 3 Sn layer growth. → In increases the parabolic rate constant of Cu 6 Sn 5 layer growth. → High In concentrations should be avoided since they may lead to a pre-mature solder joint degradation. - Abstract: The effects of Bi and In additions on intermetallic phase formation in lead-free solder joints of Sn-3.7Ag-0.7Cu; Sn-1.0Ag-0.5Cu-1.0Bi and Sn-1.5Ag-0.7Cu-9.5In (composition given in weight %) with copper substrate are studied. Soldering of copper plate was conducted at 250 deg. C for 5 s. The joints were subsequently aged at temperatures of 130-170 deg. C for 2-16 days in a convection oven. The aged interfaces were analyzed by optical microscopy and energy dispersive X-ray spectroscopy (EDX) microanalysis. Two intermetallic layers are observed at the interface - Cu 3 Sn and Cu 6 Sn 5 . Cu 6 Sn 5 is formed during soldering. Cu 3 Sn is formed during solid state ageing. Bi and In decrease the growth rate of Cu 3 Sn since they appear to inhibit tin diffusion through the grain boundaries. Furthermore, indium was found to produce a new phase - Cu 6 (Sn,In) 5 instead of Cu 6 Sn 5 , with a higher rate constant. The mechanism of the Cu 6 (Sn,In) 5 layer growth is discussed and the conclusions for the optimal solder chemical composition are presented.

  19. Laser-activated protein solder for peripheral nerve repair

    Science.gov (United States)

    Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

    1995-05-01

    A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

  20. Integration of environmentally compatible soldering technologies for waste minimization

    International Nuclear Information System (INIS)

    Hosking, F.M.

    1992-01-01

    There has been a concentrated effort throughout the international microelectronics industry to phase out chlorofluorocarbon (CFC) materials and alleviate the serious problem of ozone depletion created by the release of CFCS. The development of more environmentally compatible manufacturing technologies is the cornerstone of this effort. Alternative materials and processes for cleaning and soldering have received special attention. Electronic. soldering typically utilizes rosin-based fluxes to promote solder wettability. Flux residues must be removed from the soldered parts when high product reliability is essential. Halogenated or CFC solvents have been the principle chemicals used to clean the residues. With the accelerated push to eliminate CFCs in the US by 1995, CFC-free solvents, aqueous-based cleaning, water soluble or ''no clean'' fluxes, and fluxless soldering technologies are being developed and quickly integrated into manufacturing practice. Sandia's Center for Solder Science and Technology has been ch g a variety of fluxless and alternative soldering technologies for DOE's waste minimization program. The work has focused on controlled atmosphere, laser, and ultrasonic fluxless soldering, protective metallic and organic coatings, and fluxes which have water soluble or low solids-based chemistries. With the increasing concern that Pb will also be banned from electronic soldering, Sandia has been characterizing the wetting, aging, and mechanical properties of Pb-fire solder alloys. The progress of these integrated studies will be discussed. Their impact on environmentally compatible manufacturing will be emphasized. Since there is no universal solution to the various environmental, safety, and health issues which currently face industry, the proposed technologies offer several complementary materials and processing options from which one can choose

  1. Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/ Pd/ Au surface finishes

    International Nuclear Information System (INIS)

    NorAkmal, F.; Ourdjini, A.; Azmah Hanim, M.A.; Siti Aisha, I.; Chin, Y.T.

    2007-01-01

    Flip chip technology provides the ultimate in high I/ O-density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) which is widely used in electronics packaging as surface finish for flip-chip application nowadays. In this research, field emission scanning electron microscopy (FESEM) analysis was conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between the SAC lead-free solder with Cu surface finish after reflow were mainly (Cu, Ni) 6 Sn 5 and Cu 6 Sn 5 . While the main IMCs formed between lead-free solder on ENEPIG surface finish are (Ni, Cu) 3 Sn 4 and Ni 3 Sn 4 . The results from FESEM with energy dispersive x-ray (EDX) have revealed that isothermal aging at 150 degree Celsius has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated was found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. (author)

  2. Soldering formalism in noncommutative field theory: a brief note

    International Nuclear Information System (INIS)

    Ghosh, Subir

    2004-01-01

    In this Letter, I develop the soldering formalism in a new domain--the noncommutative planar field theories. The soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair of noncommutative Maxwell-Chern-Simons theories, having opposite signs in their respective topological terms, can be consistently soldered to yield the Proca model (Maxwell theory with a mass term) with corrections that are at least quadratic in the noncommutativity parameter. We further argue that this model can be thought of as the noncommutative generalization of the Proca theory of ordinary spacetime. It is well known that abelian noncommutative gauge theory bears a close structural similarity with non-abelian gauge theory. This fact is manifested in a non-trivial way if the present Letter is compared with existing literature, where soldering of non-abelian models are discussed. Thus the present work further establishes the robustness of the soldering programme. The subtle role played by gauge invariance (or the lack of it), in the above soldering process, is revealed in an interesting way

  3. Utilization of Pb-free solders in MEMS packaging

    Science.gov (United States)

    Selvaduray, Guna S.

    2003-01-01

    Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

  4. FY 1998 report on the waste processing/recycling related technology, 'The R and D of lead-free solder standardization'; 1998 nendo haikibutsu shori recycle kanren gijutsu seika hokokusho. Namari free handa kikakuka nado kenkyu kaihatsu

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2000-03-01

    To reduce the environmental pollution caused by lead eluted from the electronic equipment waste, the R and D on lead-free solder were conducted and the results were summarized. As to the basic characteristics, the evaluation test method was studied in terms of the range of melting temperature, mechanical strength, wettability and joint strength, to select a uniform test method. As the lead-free solder, Sn-Ag alloys were mainly used and mixed in a combination of Cu, Bi and In. Changes in characteristics were made clear by adding trace elements such as Ge, Mn and P. Relating to the applied characteristics, in selection of solder materials, materials were selected for which evaluation of the commercialization is proceeded with from a viewpoint of promotion of commercialization. Concerning the experimental evaluation of characteristics of lead-free solder in mounted substrates, it was indicated that basically lead-free solder can be practically used. Further, it was indicated that the Sn-Ag-Cu-Bi system depends not on solder composition but on active force, printing accuracy and flux characteristic of solder paste, that improvement of solder paste has an effect on mounting characteristics. (NEDO)

  5. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

  6. Manipulation and soldering of carbon nanotubes using atomic force microscope

    International Nuclear Information System (INIS)

    Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

    2008-01-01

    Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

  7. Microstructure evolution of the Si{sub 3}N{sub 4}/Si{sub 3}N{sub 4} joints brazed using Au-Ni-V filler alloys with different V content

    Energy Technology Data Exchange (ETDEWEB)

    Sun, Y. [School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China); Zhang, J., E-mail: hitzhangjie@hit.edu.cn [School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China); Zhang, H.W.; Fan, G.H.; He, Y.M. [School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001 (China)

    2011-08-18

    Highlights: > Si{sub 3}N{sub 4} ceramic was brazed using Au-Ni-V filler alloy with different V content. > The microstructure evolution of the joint was study in detail in the paper. > The polygonal Ni{sub 2}SiV{sub 3} and Ni{sub 3}V phase in the joint were investigated by TEM. > The formation of different compounds and alloys in joint was detailed discussed. - Abstract: Au-Ni-V filler alloys with different vanadium contents were designed to braze Si{sub 3}N{sub 4} ceramic at 1373 K for 30 min, and the microstructures of brazing seams were investigated by SEM and TEM. When the Au-Ni-V filler alloy contains 5 at.% V, round-like Ni[Si, V, Au] precipitates form in the Au[Ni] solid solution matrix and a VN reaction layer with 0.5 {mu}m thickness appears on Si{sub 3}N{sub 4} interface. When the V content increases to 10 at.%, a new polygonal Ni{sub 2}SiV{sub 3} phase occurs in the seam, and the Ni[Si, V, Au] precipitate coarsens and VN layer thickens. With increase of V contents to 15 and 20 at.%, laminar Ni[Au] and polygonal Ni{sub 3}V precipitates form. With 25 at.% V content in the filler alloy, the Ni{sub 2}SiV{sub 3} and Ni{sub 3}V precipitates distribute homogenously in the brazing seam. These microstructure evolutions were attributed to the reaction between Si{sub 3}N{sub 4} and vanadium, which forms VN reaction layer and releases Si into the molten alloy.

  8. Diffusion barrier characteristics and shear fracture behaviors of eutectic PbSn solder/electroless Co(W,P) samples

    International Nuclear Information System (INIS)

    Pan, Hung-Chun; Hsieh, Tsung-Eong

    2012-01-01

    Highlights: ► Diffusion barrier features, activation energies of IMC growth and mechanical behaviors of electroless Co(W,P)/PbSn joints. ► Amorphous Co(W,P) is a sacrificial- plus stuffed-type barrier while polycrystalline Co(W,P) is a sacrificial-type barrier. ► Ductile mode dominates the failure of Co(W,P)/PbSn joints. ► Phosphorus content of Co(W,P) is crucial to the barrier capability and microstructure evolution at Co(W,P)/PbSn interface. ► Diffusion barrier capability is governed by the nature of chemical bonds, rather than the crystallinity of materials. - Abstract: Diffusion barrier characteristics, activation energy (E a ) of IMC growth and bonding properties of amorphous and polycrystalline electroless Co(W,P) (termed as α-Co(W,P) and poly-Co(W,P)) to eutectic PbSn solder are presented. Intermetallic compound (IMC) spallation and an nano-crystalline P-rich layer were observed in PbSn/α-Co(W,P) samples subjected to liquid-state aging at 250 °C. In contrast, IMCs resided on the P-rich layer in PbSn/α-Co(W,P) samples subjected to solid-state aging at 150 °C. Thick IMCs neighboring to an amorphous W-rich layer was seen in PbSn/poly-Co(W,P) samples regardless of the aging type. α-Co(W,P) was found to be a sacrificial- plus stuffed-type barrier while poly-Co(W,P) is mainly a sacrificial-type barrier. The values of E a 's for PbSn/α-Co(W,P) and PbSn/poly-Co(W,P) systems were 338.6 and 167.5 kJ/mol, respectively. Shear test revealed the ductile mode dominates the failure in both α- and poly-Co(W,P) samples. Analytical results indicated the high P content in electroless layer might enhance the barrier capability but degrade the bonding strength.

  9. Development of Au-Ge based candidate alloys as an alternative to high-lead content solders

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2010-01-01

    Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The changes in microstructure and microhardness associated with the addition of low melting point metals namely In, Sb and Sn to the Au......-Ge-In and Au-Ge-Sn combinations was determined to be the classic solid solution strengthening. The Au-Ge-Sb combination was primarily strengthened by the refined (Ge) dispersed phase. The aging temperature had a significant influence on the microhardness in the case of the Au-Ge-Sn candidate alloy...

  10. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  11. Creep behavior and evolution of microstructure of modified Grade 91 welded joint after short term exposure at 500 deg C; Fluage a 500 deg C d'un joint soude d'un acier 9Cr-1Mo modifie. Evolution de la microstructure et comportement mecanique

    Energy Technology Data Exchange (ETDEWEB)

    Vivier, F.

    2009-03-15

    With the increase in worldwide energy demand, the nuclear industry is a way of producing electricity on a large scale and to answer to this need. For the design of a new generation of fission nuclear reactors and among six chosen fission reactor systems, France develops in particularly the Very High Temperature Reactor (VHTR) concept. This implies the use of materials that are more and more resistant to high temperature for long-term exposure. AREVA focuses on materials already used in fossil-fuel power plant, so that the mechanical behaviour of Grade 91 (Fe{sub 9}Cr{sub 1}MoNbV) has to be investigated. This ferritic-martensitic steel is considered to be a potential candidate for welded components. Such structures are combined with welded joints, which have to be studied. Three industrial partners (AREVA, CEA, EDF) have launched a study with the Centre des Materiaux in order to investigate the creep of welded joint of Grade 91. The aim of this work is to complete the available database about the mechanical behaviour of Grade 91, base metal and welded joint, during creep tests performed at 500 C up to 4500 h exposure. Thermal aging tests, tensile tests, and creep tests were performed at 450 C and 500 C using both base metal and cross-weld samples. Several geometries of cross-weld creep specimens were tested. The microstructure has not remarkably changed after tests concerning both nature and size of precipitates, and the characteristic size of the matrix sub-structure. The creep damage is not developed in the ruptured specimens after creep tests. Only little damage by cavity nucleation and growth was found in the creep specimens. Creep fracture at 500 C takes places by viscoplastic flow, contrary to tests performed at 625 C where the creep-induced damage governs the creep rupture at least for long-term lifetime. From creep curves of base metal and cross-weld specimens, a phenomenological model is proposed. The flow rule is a Norton power law with a stress exponent

  12. Electrochemical Behavior of Sn-9Zn- xTi Lead-Free Solders in Neutral 0.5M NaCl Solution

    Science.gov (United States)

    Wang, Zhenghong; Chen, Chuantong; Jiu, Jinting; Nagao, Shijo; Nogi, Masaya; Koga, Hirotaka; Zhang, Hao; Zhang, Gong; Suganuma, Katsuaki

    2018-05-01

    Electrochemical techniques were employed to study the electrochemical corrosion behavior of Sn-9Zn- xTi ( x = 0, 0.05, 0.1, 0.2 wt.%) lead-free solders in neutral 0.5M NaCl solution, aiming to figure out the effect of Ti content on the corrosion properties of Sn-9Zn, providing information for the composition design of Sn-Zn-based lead-free solders from the perspective of corrosion. EIS results reveal that Ti addition was involved in the corrosion product layer and changed electrochemical interface behavior from charge transfer control process to diffusion control process. The trace amount of Ti addition (0.05 wt.%) can refine the microstructure and improve the corrosion resistance of Sn-9Zn solder, evidenced by much lower corrosion current density ( i corr) and much higher total resistance ( R t). Excess Ti addition (over 0.1 wt.%) led to the formation of Ti-containing IMCs, which were confirmed as Sn3Ti2 and Sn5Ti6, deteriorating the corrosion resistance of Sn-9Zn- xTi solders. The main corrosion products were confirmed as Sn3O(OH)2Cl2 mixed with small amount of chlorine/oxide Sn compounds.

  13. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2009-03-01

    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  14. Tensile strength of two soldered alloys (Minalux and Verabond2

    Directory of Open Access Journals (Sweden)

    Mir Mohammad Rezaee S

    2002-07-01

    Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

  15. Lead-free solder technology transfer from ASE Americas

    Energy Technology Data Exchange (ETDEWEB)

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  16. Beta-Tin Grain Formation in Aluminum-Modified Lead-Free Solder Alloys

    Science.gov (United States)

    Reeve, Kathlene N.; Handwerker, Carol A.

    2018-01-01

    The limited number of independent β-Sn grain orientations that typically form during solidification of Sn-based solders and the resulting large β-Sn grain size have major effects on overall solder performance and reliability. This study analyzes whether additions of Al to Sn-Cu and Sn-Cu-Ag alloys can be used to change the grain size, morphology, and twinning structures of atomized (as-solidified) and re-melted (reflowed) β-Sn dendrites as determined using scanning electron microscopy and electron backscatter diffraction for as-solidified and reflow cycled (20-250°C, 1-5 cycles) Sn-Cu-Al and Sn-Ag-Cu-Al drip atomized spheres (260 μm diameter). The resulting microstructures were compared to as-solidified and reflow cycled Sn-Ag-Cu spheres (450 μm diameter) as well as as-solidified Sn-Ag-Cu, Sn-Cu, and Sn-Ag microstructures from the literature. Previous literature observations reporting reductions in undercooling and β-Sn grain size with Al micro-alloying additions could not be correlated to the presence of the Cu9Al4 phase or Al solute. The as-solidified spheres displayed no change in β-Sn dendrite structure or grain size when compared to non-Al-modified alloys, and the reflow cycled spheres produced high undercoolings (22-64°C), indicating a lack of potent nucleation sites. The current findings highlighted the role of Ag in the formation of the interlaced twinning structure and demonstrated that with deliberate compositional choices, formation of the alloy's β-Sn grain structure (cyclical twinning versus interlaced twinning) could be influenced, in both the as-solidified and reflow cycled states, though still not producing the fine-grain sizes and multiple orientations desired for improved thermomechanical properties.

  17. Experimental and computational study of the morphological evolution of intermetallic compound (Cu6Sn5) layers at the Cu/Sn interface under isothermal soldering conditions

    International Nuclear Information System (INIS)

    Park, M.S.; Stephenson, M.K.; Shannon, C.; Cáceres Díaz, L.A.; Hudspeth, K.A.; Gibbons, S.L.; Muñoz-Saldaña, J.; Arróyave, R.

    2012-01-01

    Cu/Sn soldering alloys have emerged as a viable alternative to Pb-based solders, and thus have been extensively explored in the past decade, although the fine-scale behavior of the resulting intermetallic compounds (IMCs), particularly during the early stages of interface formation, is still a source of debate. In this work, the microstructural evolution of Cu 6 Sn 5 , in a Cu/Sn soldering reaction at 523 K, was experimentally investigated by dipping a single Cu sample into molten Sn at a near-constant speed, yielding a continuous set of time evolution samples. The thickness, coarsening and morphology evolution of the Cu 6 Sn 5 layer is investigated through the use of scanning electron microscopy. The experimental results are also compared to phase-field simulations of the microstructural evolution of the Cu 6 Sn 5 layer. The influence of model parameters on the kinetics and morphological evolution of the IMC layer was examined. In general, good qualitative agreement is found between experiments and simulations and for a limited parameter set there appears to be good quantitative agreement between the growth kinetics of the Cu 6 Sn 5 layer, the grain boundary (GB) effect on grain coarsening, and the substrate/IMC interface roughness evolution. Furthermore, the parametric investigations of the model suggests that good agreement between experiments and simulations is achieved when the dominant transport mechanism for the reacting elements (Cu and Sn) is GB diffusion.

  18. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    /methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base...... titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

  19. Fatigue limits of titanium-bar joints made with the laser and the electric resistance welding techniques: microstructural characterization and hardness properties.

    Science.gov (United States)

    Degidi, Marco; Nardi, Diego; Morri, Alessandro; Sighinolfi, Gianluca; Tebbel, Florian; Marchetti, Claudio

    2017-09-01

    Fatigue behavior of the titanium bars is of utmost importance for the safe and reliable operation of dental implants and prosthetic constructions based on these implants. To date, however, only few data are available on the fatigue strength of dental prostheses made with electric resistance welding and laser welding techniques. This in-vitro study highlighted that although the joints made with the laser welding approach are credited of a superior tensile strength, joints made with electric resistance welding exhibited double the minimum fatigue strength with respect to the joints made with laser welding (120 vs 60 N).

  20. Commentary: Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    Menovsky, T.; Beek, J.F.; Gemert, M.J.C. van

    1999-01-01

    Full text: Laser tissue welding is the process of using laser energy to join tissues without sutures or with a reduced number of sutures. Recently, diode lasers have been added to the list of fusion lasers (Lewis and Uribe 1993, Reali et al 1993). Typically, for tissue welding, deep penetrating diode lasers emitting at 800-810 nm are used, in combination with a strong absorbing protein solder containing the dye indocyanine green. Indocyanine green has a maximum absorption coefficient at 805 nm and binds preferentially with proteins (Sauda et al 1986). The greatest advantage of diode lasers is their compact size, easy use and low cost. In this issue of Physics in Medicine and Biology (pp 983-1002, 'Photothermal effects of laser tissue soldering'), in an in vitro study, McNally et al investigate the optimal laser settings and welding temperatures in relation to the tensile strength and thermal damage of bovine aorta specimens. An interesting statement in their introduction is that the low strength of laser produced anastomoses can lead to aneurysm formation. The increased chance of aneurysm formation may merely be due to the thermal effect of the laser on the vascular wall, especially on the adventitia and media layers, which become necrotic after thermal injury. Subsequent haemodynamic stress exerted on a damaged vascular wall is a significant contributing factor for aneurysmal initiation. Also interesting is the remark that 'by the application of wavelength-specific chromophores in tissue welding ... the requirement for precise focusing and aiming of the laser beam may be removed'. Though perhaps not yet fully justified, this statement, if true, would facilitate surgical procedures. While the experiments are conducted in a proper manner, the use of bovine aorta specimens, which were stored at -70 deg. C and subsequently thawed for the tissue welding experiments, may not be the most appropriate for studying tissue effects or tensile strength measurements, as the

  1. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

  2. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

  3. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

  4. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan

    2009-01-01

    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work...

  5. Influence of scandium on the microstructure and strength properties of the welded joint at the laser welding of aluminum-lithium alloys

    Science.gov (United States)

    Malikov, A. G.; Golyshev, A. A.; Ivanova, M. Yu.

    2017-10-01

    Today, aeronautical equipment manufacture involves up-to-date high-strength aluminum alloys of decreased density resulting from lithium admixture. Various technologies of fusible welding of these alloys are being developed. Serious demands are imposed to the welded joints of aluminum alloys in respect to their strength characteristics. The paper presents experimental investigations of the optimization of the laser welding of aluminum alloys with the scandium-modified welded joint. The effect of scandium on the micro-and macro-structure has been studied as well as the strength characteristics of the welded joint. It has been found that scandium under in the laser welding process increases the welded joint elasticity for the system Al-Mg-Li, aluminum alloy 1420 by 20 %, and almost doubles the same for the system Al-Cu-Li, aluminum alloy 1441.

  6. Microstructure and properties of nickel base superalloy joints brazed with Ni-Cr-Co-B and BNi-1a filler metals

    Energy Technology Data Exchange (ETDEWEB)

    Zhuang, H. [Beijing Univ. of Aeronautics and Astronautics (China); Liu, W. [Dalian Railway Inst. (China). Welding Div.

    1995-12-31

    In this study, the kind and compositions of brittle phases formed in joints of a nickel-base superalloy brazed with the Ni-Cr-Co-B and BNi-1a (Ni-Cr-B-Si) filler metals were investigated. Their brittle-phase-free maximum brazing clearances (MBC) were characterized in dependence on the brazing conditions. The improvement on joint structures by post-braze heat treatment was also examined. (orig./MM)

  7. Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

    Science.gov (United States)

    Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

    2018-03-01

    The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

  8. Automation of experimental research of waveguide paths induction soldering

    Science.gov (United States)

    Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

    2018-05-01

    The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

  9. Optimization of the soldering process by the DMAIC methodology

    Directory of Open Access Journals (Sweden)

    Michał Zasadzień

    2016-06-01

    Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

  10. Improved microstructure and mechanical properties in gas tungsten arc welded aluminum joints by using graphene nanosheets/aluminum composite filler wires.

    Science.gov (United States)

    Fattahi, M; Gholami, A R; Eynalvandpour, A; Ahmadi, E; Fattahi, Y; Akhavan, S

    2014-09-01

    In the present study, different amounts of graphene nanosheets (GNSs) were added to the 4043 aluminum alloy powders by using the mechanical alloying method to produce the composite filler wires. With each of the produced composite filler wires, one all-weld metal coupon was welded using the gas tungsten arc (GTA) welding process. The microstructure, mechanical properties and fracture surface morphology of the weld metals have been evaluated and the results are compared. As the amount of GNSs in the composition of filler wire is increased, the microstructure of weld metal was changed from the dendritic structure to fine equiaxed grains. Furthermore, the tensile strength and microhardness of weld metal was improved, and is attributed to the augmented nucleation and retarded growth. From the results, it was seen that the GNSs/Al composite filler wire can be used to improve the microstructure and mechanical properties of GTA weld metals of aluminum and its alloys. Copyright © 2014 Elsevier Ltd. All rights reserved.

  11. Drinking Water Contamination Due To Lead-based Solder

    Science.gov (United States)

    Garcia, N.; Bartelt, E.; Cuff, K. E.

    2004-12-01

    The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

  12. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan

    2017-08-10

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  13. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong

    2017-01-01

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  14. The development of a graphite to copper joint for injector diagnostics

    International Nuclear Information System (INIS)

    Baker, D.

    1975-09-01

    A successful method of joining soft graphite to copper, to achieve a high thermal conductivity joint, is described, together with initial attempts and the difficulties experienced. The graphite, after an initial treatment, was flame sprayed with copper. The main copper-to-graphite joint was of silver solder. (U.K.)

  15. Microstructure and mechanical properties of joints in sintered SiC fiber-bonded ceramics brazed with Ag-Cu-Ti alloy

    Energy Technology Data Exchange (ETDEWEB)

    Singh, Mrityunjay [Ohio Aerospace Institute, Cleveland, OH 44142 (United States); Matsunaga, Tadashi [R and D Division, Ube Industries, Ltd., Ube-shi, Yamaguchi 755-8633 (Japan); Lin, Hua-Tay [Materials Science and Technology Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831-6068 (United States); Asthana, Rajiv, E-mail: asthanar@uwstout.edu [Department of Engineering and Technology, 326 Fryklund Hall, University of Wisconsin-Stout, Menomonie, WI 54751 (United States); Ishikawa, Toshihiro [R and D Division, Ube Industries, Ltd., Ube-shi, Yamaguchi 755-8633 (Japan)

    2012-11-15

    Active metal brazing of a new high thermal conductivity sintered SiC-polycrystalline fiber-bonded ceramic (SA-Tyrannohex{sup Registered-Sign }) has been carried out using a Ti-containing Ag-Cu active braze alloy (Cusil-ABA{sup Registered-Sign }). The brazed composite joints were characterized using scanning electron microscopy coupled with energy-dispersive X-ray spectrometry (SEM-EDS). The results show that this material can be successfully joined using judiciously selected off-the shelf active braze alloys to yield metallurgically sound joints possessing high integrity. Uniform and continuous joints were obtained irrespective of differences in the fiber orientation in the substrate material. Detailed interfacial microanalysis showed that the titanium reacts with C and Si to form TiC layer and a Ti-Si compound, respectively. Furthermore, the evaluation of shear strength of the joints was also conducted at ambient and elevated temperatures in air using the single-lap offset (SLO) shear test. The perpendicular-type SA-Tyrannohex joints exhibited apparent shear strengths of about 42 MPa and 25 MPa at 650 Degree-Sign C and 750 Degree-Sign C, respectively. The fracture at the higher temperature occurred at the interface between the reaction-formed TiC layer and braze. This might be caused by generation of stress intensity when a shear stress was applied, according to {mu}-FEA simulation results.

  16. Influences of post weld heat treatment on tensile strength and microstructure characteristics of friction stir welded butt joints of AA2014-T6 aluminum alloy

    Science.gov (United States)

    Rajendran, C.; Srinivasan, K.; Balasubramanian, V.; Balaji, H.; Selvaraj, P.

    2016-08-01

    Friction stir welded (FSWed) joints of aluminum alloys exhibited a hardness drop in both the advancing side (AS) and retreating side (RS) of the thermo-mechanically affected zone (TMAZ) due to the thermal cycle involved in the FSW process. In this investigation, an attempt has been made to overcome this problem by post weld heat treatment (PWHT) methods. FSW butt (FSWB) joints of Al-Cu (AA2014-T6) alloy were PWHT by two methods such as simple artificial aging (AA) and solution treatment followed by artificial aging (STA). Of these two treatments, STA was found to be more beneficial than the simple aging treatment to improve the tensile properties of the FSW joints of AA2014 aluminum alloy.

  17. An Analysis of the Microstructure, Macrostructure and Microhardness of Nicr-Ir Joints Produced by Laser Welding with and without Preheat

    Directory of Open Access Journals (Sweden)

    Różowicz S.

    2016-06-01

    Full Text Available This paper discusses some of the basic problems involved in laser welding of dissimilar materials with significant differences in melting points. It focuses on the micro and macrostructure of laser welded NiCr-Ir microjoints used in central spark plug electrodes. The joints were produced by welding with and without preheat using an Nd,YAG laser. The structure and composition of the welded joints were analyzed by means of a light microscope (LM and a scanning electron microscope (SEM equipped with an energy dispersive X-ray (EDX spectrometer. The microhardness of the weld area was also studied.

  18. Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

    Science.gov (United States)

    This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

  19. Influence of the brazing parameters on microstructure and mechanical properties of brazed joints of Hastelloy B2 nickel base alloy; Influencia de los parametros de soldeo fuerte en la microestructura y propiedades mecanicas de la union de la aleacion base niquel Hastelloy B2

    Energy Technology Data Exchange (ETDEWEB)

    Sotelo, J. C.; Gonzalez, M.; Porto, E.

    2014-07-01

    A study of the high vacuum brazing process of solid solution strengthened Hastelloy B2 nickel alloy has been done. A first stage of research has focused on the selection of the most appropriate brazing filler metal to the base material and vacuum furnace brazing process. The influence of welding parameters on joint microstructure constituents, relating the microstructure of the joint to its mechanical properties, has been evaluated. Two gaps of 50 and 200 micrometers, and two dwell times at brazing temperature of 10 and 90 minutes were studied. The braze joint mainly consists of the nickel rich matrix, nickel silicide and ternary compounds. Finally, the results of this study have shown the high bond strength for small gaps and increased dwell times of 90 minutes. (Author)

  20. Horizon shells and BMS-like soldering transformations

    Energy Technology Data Exchange (ETDEWEB)

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

    2016-03-07

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  1. Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

    2017-07-27

    Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integr