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Sample records for solder joint mechanical

  1. Mechanical properties of soldered joints of niobium base alloys

    International Nuclear Information System (INIS)

    Grishin, V.L.

    1980-01-01

    Mechanical properties of soldered joints of niobium alloys widely distributed in industry: VN3, VN4, VN5A, VN5AE, VN5AEP etc., 0.6-1.2 mm thick are investigated. It is found out that the usage of zirconium-vanadium, titanium-tantalum solders for welding niobium base alloys permits to obtain soldered joints with satisfactory mechanical properties at elevated temperatures

  2. Mechanical properties of Bi-In-Zn/ Cu solder joint system

    International Nuclear Information System (INIS)

    Ervina Efzan Mohd Noor; Mohammed Noori Ridha; Ahmad Badri Ismail; Nurulakmal Mohd Sharif; Kuan Yew Cheong; Tadashi Ariga; Zuhailawati Hussain

    2009-01-01

    Full text: In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry; the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this works, microstructure and mechanical properties of different reflow temperature (80, 100, 120 and 140 degree Celsius) for solder joints on shear strength of Bi-In-Zn lead free solder with low melting temperature of 60 degree Celsius on Cu solder joint has been investigated. This paper will compared the mechanical properties of the Bi-In-Zn lead-free solder alloys with current lead-free solder, Sn-Ag-Cu solder alloy. The fracture surface analyses have been observed by Optical Microscope and were investigated by Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX) and proved it by X-ray diffraction (XRD). (author)

  3. Influence of solder joint length to the mechanical aspect during the thermal stress analysis

    Science.gov (United States)

    Tan, J. S.; Khor, C. Y.; Rahim, Wan Mohd Faizal Wan Abd; Ishak, Muhammad Ikman; Rosli, M. U.; Jamalludin, Mohd Riduan; Zakaria, M. S.; Nawi, M. A. M.; Aziz, M. S. Abdul; Ani, F. Che

    2017-09-01

    Solder joint is an important interconnector in surface mount technology (SMT) assembly process. The real time stress, strain and displacement of the solder joint is difficult to observe and assess the experiment. To tackle these problems, simulation analysis was employed to study the von Mises stress, strain and displacement in the thermal stress analysis by using Finite element based software. In this study, a model of leadless electronic package was considered. The thermal stress analysis was performed to investigate the effect of the solder length to those mechanical aspects. The simulation results revealed that solder length gives significant effect to the maximum von Mises stress to the solder joint. Besides, changes in solder length also influence the displacement of the solder joint in the thermal environment. The increment of the solder length significantly reduces the von Mises stress and strain on the solder joint. Thus, the understanding of the physical parameter for solder joint is important for engineer prior to designing the solder joint of the electronic component.

  4. Investigation into mechanical properties of joints of heterogeneous materials brazed with high-temperature solders

    International Nuclear Information System (INIS)

    Lomenko, V.I.; Merkushev, V.P.; Borodina, L.M.; Sycheva, T.S.; Tokhtina, O.A.; Frolov, N.N.

    1988-01-01

    Mechanical properties of copper joints with copper, 12Kh18M10T steel and KhD50 composite obtained by vacuum brazing by copper-titanium solder as compared with properties of joints brazed by PSr 72 and PMFOTsr 6-4-0.03 solders in hydrogen are studied. Dependences of joints strength on temperature of contact - reactive vacuum brazing are obtained. Possible applications of joints of dissimilar materials in electrovacuum devices subjected to the effect of dynamic loadings are established

  5. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

    Science.gov (United States)

    Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

    2017-08-01

    Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

  6. Mechanical performances of lead-free solder joint connections with applications in the aerospace domain

    Directory of Open Access Journals (Sweden)

    Georgiana PADURARU

    2016-03-01

    Full Text Available The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of solder joint in correlation with different pad finishes, there were made some mechanical determinations using a dedicated Share Test System. The theoretical model highlights the link between the experimental results and the influence of gravitational acceleration on the mechanical and functional integrity of the electronic assemblies that works in vibration environment. The paper novelty is provided by the interdisciplinary experiment that offers results that can be used in the mechanical, tribological, electronical and aerospace domains.

  7. Solder joint technology materials, properties, and reliability

    CERN Document Server

    Tu, King-Ning

    2007-01-01

    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  8. Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

    Science.gov (United States)

    Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R.

    2014-01-01

    A fracture mechanism map (FMM) is a powerful tool which correlates the fracture behavior of a material to its microstructural characteristics in an explicit and convenient way. In the FMM for solder joints, an effective thickness of the interfacial intermetallic compound (IMC) layer ( t eff) and the solder yield strength ( σ ys,eff) are used as abscissa and ordinate axes, respectively, as these two predominantly affect the fracture behavior of solder joints. Earlier, a definition of t eff, based on the uniform thickness of IMC ( t u) and the average height of the IMC scallops ( t s), was proposed and shown to aptly explain the fracture behavior of solder joints on Cu. This paper presents a more general definition of t eff that is more widely applicable to a range of metallizations, including Cu and electroless nickel immersion gold (ENIG). Using this new definition of t eff, mode I FMM for SAC387/Cu joints has been updated and its validity was confirmed. A preliminary FMM for SAC387/Cu joints with ENIG metallization is also presented.

  9. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Directory of Open Access Journals (Sweden)

    Benabou Lahouari

    2014-06-01

    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  10. Lead free solder mechanics and reliability

    CERN Document Server

    Pang, John Hock Lye

    2012-01-01

    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  11. Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

    Directory of Open Access Journals (Sweden)

    Shuye Zhang

    2018-01-01

    Full Text Available Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile electronic applications. However, crack formation of the solder joint crack was occurred at low temperature curable acrylic polymer resins after bonding processes. In this study, the mechanism of SnBi58 solder joint crack at low temperature curable acrylic adhesive was investigated. In addition, SnBi58 solder joint cracks can be significantly removed by increasing the storage modulus of adhesives instead of coefficient of thermal expansion. The first approach of reducing the amount of polymer rebound can be achieved by using an ultrasonic bonding method to maintain a bonding pressure on the SnBi58 solder joints cooling to room temperature. The second approach is to increase storage modulus of adhesives by adding silica filler into acrylic polymer resins to prevent the solder joint from cracking. Finally, excellent acrylic based SnBi58 solder joints reliability were obtained after 1000 cycles thermal cycling test.

  12. Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

    Science.gov (United States)

    Abdelhadi, Ousama Mohamed Omer

    Continuous miniaturization of microelectronic interconnects demands smaller joints with comparable microstructural and structural sizes. As the size of joints become smaller, the volume of intermetallics (IMCs) becomes comparable with the joint size. As a result, the kinetics of bond formation changes and the types and thicknesses of IMC phases that form within the constrained region of the bond varies. This dissertation focuses on investigating combination effects of process parameters and size on kinetics of bond formation, resulting microstructure and the mechanical properties of joints that are formed under structurally constrained conditions. An experiment is designed where several process parameters such as time of bonding, temperature, and pressure, and bond thickness as structural chracteristic, are varied at multiple levels. The experiment is then implemented on the process. Scanning electron microscope (SEM) is then utilized to determine the bond thickness, IMC phases and their thicknesses, and morphology of the bonds. Electron backscatter diffraction (EBSD) is used to determine the grain size in different regions, including the bulk solder, and different IMC phases. Physics-based analytical models have been developed for growth kinetics of IMC compounds and are verified using the experimental results. Nanoindentation is used to determine the mechanical behavior of IMC phases in joints in different scales. Four-point bending notched multilayer specimen and four-point bending technique were used to determine fracture toughness of the bonds containing IMCs. Analytical modeling of peeling and shear stresses and fracture toughness in tri-layer four-point bend specimen containing intermetallic layer was developed and was verified and validated using finite element simulation and experimental results. The experiment is used in conjunction with the model to calculate and verify the fracture toughness of Cu6Sn5 IMC materials. As expected two different IMC phases

  13. Soldering of Mg Joints Using Zn-Al Solders

    Science.gov (United States)

    Gancarz, Tomasz; Berent, Katarzyna; Skuza, Wojciech; Janik, Katarzyna

    2018-04-01

    Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 °C, 450 °C, 475 °C, and 500 °C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.

  14. Influence of intermetallic growth on the mechanical properties of Zn–Sn–Cu–Bi/Cu solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Xing, Fei; Yao, Jia; Liang, Jingwei; Qiu, Xiaoming, E-mail: qiuxm13@163.com

    2015-11-15

    The formation of intermetallic reaction layers and their influence on shear strength and fractography was investigated between the Zn–Sn–Cu–Bi (ZSCB) and Cu substrate during the liquid state reaction at 450 °C after 10–90 s. Results showed that reliable solder joints could be obtained at 450 °C after 15–30 s of wetting, accompanied by the creation of scallop ε-CuZn{sub 5}, flat γ-Cu{sub 5}Zn{sub 8} and β-CuZn intermetallic layers in ZSCB/Cu interface. However, with excess increase of soldering time, a transient intermetallic ε-CuZn{sub 4} phase was nuclear and grew at ε-CuZn{sub 5}/γ-Cu{sub 5}Zn{sub 8} interface, which apparently deteriorated the shear strength of solder joints from 76.5 MPa to 51.6 MPa. The sensitivity of the fracture proportion was gradually transformed from monotonic ε-CuZn{sub 5} to the mixture of ε-CuZn{sub 4} and ε-CuZn{sub 5} intermetallic cleavage. Furthermore, the growth mechanism of ε-CuZn{sub 4} intermetallic phase at the ZSCB/Cu interface was discussed. - Highlights: • There are four interfacial intermetallic layers formed at the Zn–Sn–Cu–Bi/Cu interface. • The growth mechanism of ε-CuZn{sub 4} intermetallic phase was discussed. • The wetting time of Zn–Sn–Cu–Bi solder in contact with Cu substrate is a key parameter.

  15. Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

    OpenAIRE

    Koo, Ja-Myeong; Jung, Seung-Boo

    2007-01-01

    Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920); International audience; Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafte...

  16. Quality Analysis of Welded and Soldered Joints of Cu-Nb Microcomposite Wires

    Directory of Open Access Journals (Sweden)

    Nikolaj VIŠNIAKOV

    2011-03-01

    Full Text Available Quality analysis of welded and soldered joints of Cu-Nb microcomposite wires has been performed. Quality and mechanical characteristics of joints as ultimate tensile stress limit and elongation at break were measured with an universal testing machine and controlled visually using an optical microscope. Two wires joints were soldered with silver and copper solders and put into steel and copper sleeve respectively. Another two wires joints were soldered with silver solder and welded without any reinforcement. Joints soldered with the silver solder and steel sleeve have demonstrated the best mechanical characteristics: ultimate tensile stress limit of 650 MPa and elongation at break of 0.85 %. Joints soldered with the copper sleeve have no advantages comparing with the soldered butt joint. Ultimate tensile stress limit and elongation at break were in 300 MPa - 350 MPa and in 0.35 % - 0.45 % ranges respectively. Two welded joints had ultimate tensile stress limit of 470 MPa and elongation at break of 0.71 %. In all joints the microstructure of Nb filaments was destroyed and mechanical properties have been specified by mechanical strength of copper and sleeve materials only.http://dx.doi.org/10.5755/j01.ms.17.1.242

  17. Visual detection of defects in solder joints

    Science.gov (United States)

    Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

    1995-03-01

    The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

  18. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-11-25

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

  19. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    International Nuclear Information System (INIS)

    Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-01-01

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

  20. Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

    International Nuclear Information System (INIS)

    Liu, X.W.; Plumbridge, W.J.

    2003-01-01

    The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

  1. Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement

    Energy Technology Data Exchange (ETDEWEB)

    Li, Yi, E-mail: yili64-c@my.cityu.edu.hk [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong); Luo, Kaiming; Lim, Adeline B.Y.; Chen, Zhong [School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798 (Singapore); Wu, Fengshun [School of Materials Science and Engineering, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan (China); Chan, Y.C. [Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong (Hong Kong)

    2016-07-04

    Sn57.6Bi0.4Ag solder has been reinforced successfully through the addition of tungsten (W) nanoparticles at a concentration of 0.5 wt%. With the addition of W nanoparticles, the solder matrix lamellar interphase spacing was reduced by 31.0%. Due to the dispersion of W nanoparticles and the consequently refined microstructure, the mechanical properties of the solder alloy were enhanced, as indicated by a 6.2% improvement in the microhardness. During the reflow of solder on Au/Ni/Cu pads, the entire Au layer dissolved into the molten solder rapidly and a large number of (Au,Ni)(Sn,Bi){sub 4} particles were formed. The fracture path of the as-reflowed joint was within the solder region, showing ductile characteristic, and the shear strength was reinforced by 8.2%, due to the enhanced mechanical properties of the solder. During the subsequent aging process, the Au migrated back towards the interface and a thick layer of interfacial (Au,Ni)(Sn,Bi){sub 4} IMC was formed, leading to the shift of the fracture path to the interfacial IMC region, the transformation to brittle fracture and the deterioration of the strength of the joint, due to Au embrittlement. By adding W nanoparticles, the migration of Au was mitigated and the thickness of the (Au,Ni)(Sn,Bi){sub 4} layer was reduced significantly, which reduced the Au embrittlement-induced deterioration of the strength of the joint. During electromigration, the segregation of the Bi-rich and Sn-rich phases and the accumulation of the (Au,Ni)(Sn,Bi){sub 4} layer at cathode interface were mitigated by the addition of W nanoparticles, which improved the electromigration resistance.

  2. Fatigue and thermal fatigue of Pb-Sn solder joints

    International Nuclear Information System (INIS)

    Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

    1987-01-01

    This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55 0 C and 125 0 C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb

  3. The creep behavior of In-Ag eutectic solder joints

    International Nuclear Information System (INIS)

    Reynolds, H.L.; Kang, S.H.; Morris, J.W. Jr.; Univ. of California, Berkeley, CA

    1999-01-01

    The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90 C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the In-rich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems

  4. SMT soldering handbook

    National Research Council Canada - National Science Library

    Strauss, Rudolf

    1998-01-01

    ... 3.2.1 Constituents, melting behaviour and mechanical properties 3.2.2 Composition of solders for use in electronics 3.2.3 Lead-free solders 3.2.4 Solder impurities The soldered joint 3.3.1 Solde...

  5. Characteristics of solder joints under fatigue loads using piezomechanical actuation

    Science.gov (United States)

    Shim, Dong-Jin; Spearing, S. Mark

    2003-07-01

    Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

  6. Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

    Science.gov (United States)

    Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

    2018-03-01

    In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

  7. Strength of joints brazed with two-phase solders

    International Nuclear Information System (INIS)

    Shnyakin, N.S.; Parfenova, L.V.; Ekatova, A.S.; Prilepskaya, I.V.

    1976-01-01

    Dependence of the structure and strength of soldered joints upon a gap size in case of 1Kh18N10T stainless steel soldering with a double-phase solder of Ni-Zn-Cu system is described. Butt and lap joints have been subjected to soldering with gas-flame and induction heating. The optimum conditions of the solder crystallization are determined with wedge-gap samples. The studies show that the character of distribution of a fusible β-phase in metal depends upon a gap size. With gaps up to 0.1 mm the β-phase enriched with a fusible component (zinc) runs as a continuous thin interlayer in the middle of the seam. As a result of zinc evaporation from the β-phase this interlayer becomes internally oxidized. After the sample is broken an oxidized fracture gives one the impression of a poor fusion in the middle part of the joint. The ultimate strength of butt joints is 15-20 kgf/sq.mm. A value of thermal expansion of 1Kh18N10T steel samples, 1-5 mm thick, has been experimentally determined for butt soldering. The elongation of two halves of the sample is measured by an indicator and proved to be 0.89 mm for a 50x50x2 mm sample at a soldering temperature of 1.100 deg C. The paper presents methods for the calculation of an optimal gap value for butt soldering with a local gas-flame and induction heating

  8. Aging treatment characteristics of solder bump joint for high reliability optical module

    International Nuclear Information System (INIS)

    Kim, Kyung-Seob; Yu, Chung-Hee; Yang, Jun-Mo

    2004-01-01

    The joint strength and fracture surfaces of Sn-37 mass% Pb and Au stud bumps for photo diode packages after isothermal aging testing were studied experimentally. Al/Au stud bumps and Cu/Sn-37 mass% Pb solders were adopted, and aged for up to 900 h to analyze the effect of intermetallic compound (IMC). The joint strength decreased with aging time. The diffraction patterns of Cu 6 Sn 5 , scallop-shaped IMCs, and planar-shaped Cu 3 Sn were characterized using transmission electron microscopy (TEM). The formation of Kirkendall voids and the growth of IMCs at the solder were found to be a possible mechanism for joint strength reduction

  9. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Directory of Open Access Journals (Sweden)

    Mohd Nizam Ab. Rahman

    2014-12-01

    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  10. Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

    Energy Technology Data Exchange (ETDEWEB)

    Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

    1999-11-01

    Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

  11. Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

    Science.gov (United States)

    Yoon, Jeong-Won; Noh, Bo-In; Jung, Seung-Boo

    2011-09-01

    Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.

  12. Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

    Directory of Open Access Journals (Sweden)

    Molnar A.

    2017-06-01

    Full Text Available In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

  13. Multi-layer SiC ceramics/Mo joints brazed using high-temperature solders

    International Nuclear Information System (INIS)

    Olesinska, W.; Kesik, J.

    2003-01-01

    The paper presents the results of studies on joining SiC ceramics with molybdenum, with the ceramic surface being activated by titanium, chromium or copper. Titanium or chromium were deposited by the sputtering technique, and copper - by the electro-chemical method. The microstructures of the SiC/Mo joints brazed with the CuMn13Ni3 solder and copper in a nitrogen atmosphere were examined and the results discussed. The joints, in which the ceramic surface was activated in addition with chromium, do not contain mechanical defects caused by the joining process, and the ceramic surface is covered with a continuous layer of the solder. A phase analysis of the interface surface identified an MeSiC phase. The mechanical strength of the joints in which the ceramic surface was modified by the Ti, Cr and Cu layers was markedly greater than that of the joints brazed directly to the uncoated ceramics with the use of active solders. (author)

  14. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

    Science.gov (United States)

    Lee, Sang-Yeob; Lee, Jong-Hyuk

    2010-12-01

    The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

  15. Interfacial reaction of Sn-based solder joint in the package system

    Science.gov (United States)

    Gu, Huandi

    In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

  16. Impurity Effects in Electroplated-Copper Solder Joints

    Directory of Open Access Journals (Sweden)

    Hsuan Lee

    2018-05-01

    Full Text Available Copper (Cu electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl disulfide (SPS with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

  17. Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint

    Science.gov (United States)

    Darbandi, Payam

    Due to the awareness of the potential health hazards associated with the toxicity of lead (Pb), actions have been taken to eliminate or reduce the use of Pb in consumer products. Among those, tin (Sn) solders have been used for the assembly of electronic systems. Anisotropy is of significant importance in all structural metals, but this characteristic is unusually strong in Sn, making Sn based solder joints one of the best examples of the influence of anisotropy. The effect of anisotropy arising from the crystal structure of tin and large grain microstructure on the microstructure and the evolution of constitutive responses of microscale SAC305 solder joints is investigated. Insights into the effects of key microstructural features and dominant plastic deformation mechanisms influencing the measured relative activity of slip systems in SAC305 are obtained from a combination of optical microscopy, orientation imaging microscopy (OIM), slip plane trace analysis and crystal plasticity finite element (CPFE) modeling. Package level SAC305 specimens were subjected to shear deformation in sequential steps and characterized using optical microscopy and OIM to identify the activity of slip systems. X-ray micro Laue diffraction and high energy monochromatic X-ray beam were employed to characterize the joint scale tensile samples to provide necessary information to be able to compare and validate the CPFE model. A CPFE model was developed that can account for relative ease of activating slip systems in SAC305 solder based upon the statistical estimation based on correlation between the critical resolved shear stress and the probability of activating various slip systems. The results from simulations show that the CPFE model developed using the statistical analysis of activity of slip system not only can satisfy the requirements associated with kinematic of plastic deformation in crystal coordinate systems (activity of slip systems) and global coordinate system (shape changes

  18. Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

    2008-04-24

    The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes.

  19. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  20. Soldering handbook

    CERN Document Server

    Vianco, Paul T

    1999-01-01

    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  1. Reliability and microstructure of lead-free solder joints in industrial electronics after accelerated thermal aging

    NARCIS (Netherlands)

    Scaltro, F.; Biglari, M.H.; Kodentsov, A.; Yakovleva, O.; Brom, E.

    2009-01-01

    The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface component/solder together with the formation of fractures. The evolution, the morphology and the elemental

  2. Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints

    International Nuclear Information System (INIS)

    Dudek, M.A.; Hunter, L.; Kranz, S.; Williams, J.J.; Lau, S.H.; Chawla, N.

    2010-01-01

    The volume, size, and dispersion of porosity in solder joints are known to affect mechanical performance and reliability. Most of the techniques used to characterize the three-dimensional (3D) nature of these defects are destructive. With the enhancements in high resolution computed tomography (CT), the detection limits of intrinsic microstructures have been significantly improved. Furthermore, the 3D microstructure of the material can be used in finite element models to understand their effect on microscopic deformation. In this paper we describe a technique utilizing high resolution (< 1 μm) X-ray tomography for the three-dimensional (3D) visualization of pores in Sn-3.9Ag-0.7Cu/Cu joints. The characteristics of reflow porosity, including volume fraction and distribution, were investigated for two reflow profiles. The size and distribution of porosity size were visualized in 3D for four different solder joints. In addition, the 3D virtual microstructure was incorporated into a finite element model to quantify the effect of voids on the lap shear behavior of a solder joint. The presence, size, and location of voids significantly increased the severity of strain localization at the solder/copper interface.

  3. The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

    Science.gov (United States)

    Mayappan, R.; Salleh, A.; Andas, J.

    2017-09-01

    Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

  4. A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

    Science.gov (United States)

    Wei, Helin; Wang, Kuisheng

    2011-11-01

    Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

  5. The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

    Science.gov (United States)

    Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

    2015-12-01

    Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (ptensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

  6. Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Kita, T; Mukaibo, N; Ando, K; Moriyama, M [Honda R and D Co. Ltd., Tokyo (Japan)

    1997-10-01

    Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

  7. The Shear Strength and Fracture Behavior of Sn-Ag- xSb Solder Joints with Au/Ni-P/Cu UBM

    Science.gov (United States)

    Lee, Hwa-Teng; Hu, Shuen-Yuan; Hong, Ting-Fu; Chen, Yin-Fa

    2008-06-01

    This study investigates the effects of Sb addition on the shear strength and fracture behavior of Sn-Ag-based solders with Au/Ni-P/Cu underbump metallization (UBM) substrates. Sn-3Ag- xSb ternary alloy solder joints were prepared by adding 0 wt.% to 10 wt.% Sb to a Sn-3.5Ag alloy and joining them with Au/Ni-P/Cu UBM substrates. The solder joints were isothermally stored at 150°C for up to 625 h to study their microstructure and interfacial reaction with the UBM. Single-lap shear tests were conducted to evaluate the mechanical properties, thermal resistance, and failure behavior. The results show that UBM effectively suppressed intermetallic compound (IMC) formation and growth during isothermal storage. The Sb addition helped to refine the Ag3Sn compounds, further improving the shear strength and thermal resistance of the solders. The fracture behavior evolved from solder mode toward the mixed mode and finally to the IMC mode with increasing added Sb and isothermal storage time. However, SnSb compounds were found in the solder with 10 wt.% Sb; they may cause mechanical degradation of the solder after long-term isothermal storage.

  8. Effect of gamma radiation on micromechanical hardness of lead-free solder joint

    Energy Technology Data Exchange (ETDEWEB)

    Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

    2015-09-25

    Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

  9. How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

    Science.gov (United States)

    Suhir, E.; Yi, S.; Ghaffarian, R.

    2017-03-01

    It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

  10. Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu

    Science.gov (United States)

    Lee, Hwa-Teng; Huang, Kuo-Chen

    2016-12-01

    Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

  11. Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages

    Science.gov (United States)

    Talebanpour, B.; Huang, Z.; Chen, Z.; Dutta, I.

    2016-01-01

    In 3-dimensional (3D) packages, a stack of dies is vertically connected to each other using through-silicon vias and very thin solder micro-bumps. The thinness of the micro-bumps results in joints with a very high volumetric proportion of intermetallic compounds (IMCs), rendering them much more brittle compared to conventional joints. Because of this, the reliability of micro-bumps, and the dependence thereof on the proportion of IMC in the joint, is of substantial concern. In this paper, the growth kinetics of IMCs in thin Sn-3Ag-0.5Cu joints attached to Cu substrates were analyzed, and empirical kinetic laws for the growth of Cu6Sn5 and Cu3Sn in thin joints were obtained. Modified compact mixed mode fracture mechanics samples, with adhesive solder joints between massive Cu substrates, having similar thickness and IMC content as actual micro-bumps, were produced. The effects of IMC proportion and strain rate on fracture toughness and mechanisms were investigated. It was found that the fracture toughness G C decreased with decreasing joint thickness ( h Joint). In addition, the fracture toughness decreased with increasing strain rate. Aging also promoted alternation of the crack path between the two joint-substrate interfaces, possibly proffering a mechanism to enhance fracture toughness.

  12. A review of typical thermal fatigue failure models for solder joints of electronic components

    Science.gov (United States)

    Li, Xiaoyan; Sun, Ruifeng; Wang, Yongdong

    2017-09-01

    For electronic components, cyclic plastic strain makes it easier to accumulate fatigue damage than elastic strain. When the solder joints undertake thermal expansion or cold contraction, different thermal strain of the electronic component and its corresponding substrate is caused by the different coefficient of thermal expansion of the electronic component and its corresponding substrate, leading to the phenomenon of stress concentration. So repeatedly, cracks began to sprout and gradually extend [1]. In this paper, the typical thermal fatigue failure models of solder joints of electronic components are classified and the methods of obtaining the parameters in the model are summarized based on domestic and foreign literature research.

  13. Effect of gap distance on tensile strength of preceramic base metal solder joints.

    Science.gov (United States)

    Fattahi, Farnaz; Motamedi, Milad

    2011-01-01

    In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023), but the differences between other groups were not sig-nificant at a significance level of 0.05. There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints.

  14. Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements

    Science.gov (United States)

    Gadag, Shiva P.; Patra, Susant

    2000-12-01

    Solder joint interconnects are mechanical means of structural support for bridging the various electronic components and providing electrical contacts and a thermal path for heat dissipation. The functionality of the electronic device often relies on the structural integrity of the solder. The dimensional stability of solder joints is numerically predicted based on their mechanical properties. Algorithms to model the kinetics of dissolution and subsequent growth of intermetallic from the complete knowledge of a single history of time-temperature-reflow profile, by considering equivalent isothermal time intervals, have been developed. The information for dissolution is derived during the heating cycle of reflow and for the growth process from cooling curve of reflow profile. A simple and quick analysis tool to derive tensile stress-strain maps as a function of the reflow temperature of solder and strain rate has been developed by numerical program. The tensile properties are used in modeling thermal strain, thermal fatigue and to predict the overall fatigue life of solder joints. The numerical analysis of the tensile properties as affected by their composition and rate of testing, has been compiled in this paper. A numerical model using constitutive equation has been developed to evaluate the interfacial fatigue crack growth rate. The model can assess the effect of cooling rate, which depends on the level of strain energy release rate. Increasing cooling rate from normalizing to water-quenching, enhanced the fatigue resistance to interfacial crack growth by up to 50% at low strain energy release rate. The increased cooling rates enhanced the fatigue crack growth resistance by surface roughening at the interface of solder joint. This paper highlights salient features of process modeling. Interfacial intermetallic microstructure is affected by cooling rate and thereby affects the mechanical properties.

  15. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    International Nuclear Information System (INIS)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-01-01

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines

  16. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-10-31

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

  17. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    Science.gov (United States)

    Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

    2016-12-01

    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

  18. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Energy Technology Data Exchange (ETDEWEB)

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

    2013-06-01

    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  19. The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder joint

    Energy Technology Data Exchange (ETDEWEB)

    Fleshman, Collin; Chen, Wei-Yu; Chou, Tzu-Ting [Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan (China); Huang, Jia-Hong [Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan (China); Duh, Jenq-Gong, E-mail: jgd@mx.nthu.edu.tw [Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan (China)

    2017-03-01

    In this study, the slow speed shear test in both Sn-3.0Ag-0.5Cu (wt%)/OSP Cu and Sn-3.0Ag-0.5Cu-0.1Ni (wt%)/OSP Cu assembly with the ball heights of 300 μm and the corresponding grain structures were investigated. With the aid of Electron Back Scattering Diffraction (EBSD) analysis, single grain structure was observed in Sn-3.0Ag-0.5Cu/OSP Cu. Besides, Ni was found to control the grain structure in Sn-3.0Ag-0.5Cu-0.1Ni solder balls, showing multiple grains with partially interlaced structure. The grain variation resulted from larger undercooling caused by smaller ball size and Ni-dopant induced tiny intermetallic compounds (IMCs). IMCs serve as heterogeneous nucleation sites for β-tin and thus alter the grain structure of solder balls. The results of shear test reveal that the peak force of solder joints was efficiently enhanced by the addition of Ni. The enhancement of mechanical strength was attributed to the modification of grain structure by the introduction of Ni dopant. It is believed that the smaller grains, tiny intermetallic compounds, and the oriented interlaced area in Ni-doped solder joints became energy barriers for propagation of cracks and dislocations. It is demonstrated that Ni-doped solder joints tend to exhibit better mechanical reliability in advanced electronic packaging. - Highlights: • The grain structure and slow speed shear test performance were investigated. • Doping Ni into solder induce interlaced grain structure. • Interlaced structure can enhance mechanical reliability in BGA packaging.

  20. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Lei Sun

    2015-01-01

    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  1. Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

    Science.gov (United States)

    Coyle, Richard J.; Sweatman, Keith; Arfaei, Babak

    2015-09-01

    Thermal fatigue is a major source of failure of solder joints in surface mount electronic components and it is critically important in high reliability applications such as telecommunication, military, and aeronautics. The electronic packaging industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu alloys first established as replacements for eutectic SnPb. This paper discusses the results from Pb-free solder joint reliability programs sponsored by two industry consortia. The characteristic life in accelerated thermal cycling is reported for 12 different Pb-free solder alloys and a SnPb control in 9 different accelerated thermal cycling test profiles in terms of the effects of component type, accelerated thermal cycling profile and dwell time. Microstructural analysis on assembled and failed samples was performed to investigate the effect of initial microstructure and its evolution during accelerated thermal cycling test. A significant finding from the study is that the beneficial effect of Ag on accelerated thermal cycling reliability (measured by characteristic lifetime) diminishes as the severity of the accelerated thermal cycling, defined by greater ΔT, higher peak temperature, and longer dwell time increases. The results also indicate that all the Pb-free solders are more reliable in accelerated thermal cycling than the SnPb alloy they have replaced. Suggestions are made for future work, particularly with respect to the continued evolution of alloy development for emerging application requirements and the value of using advanced analytical methods to provide a better understanding of the effect of microstructure and its evolution on accelerated thermal cycling performance.

  2. Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

    Science.gov (United States)

    Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

    2011-01-01

    The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

  3. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Dias, Marcelino; Costa, Thiago [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Rocha, Otávio [Federal Institute of Education, Science and Technology of Pará — IFPA, 66093-020 Belém, PA (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos — UFSCar, 13565-905 São Carlos, SP (Brazil); Cheung, Noé, E-mail: cheung@fem.unicamp.br [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil)

    2015-08-15

    Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing.

  4. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    OpenAIRE

    Sun, Lei; Zhang, Liang

    2015-01-01

    SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparti...

  5. Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

    International Nuclear Information System (INIS)

    Zhang, Liang; Han, Ji-guang; Guo, Yong-huan; He, Cheng-wen

    2014-01-01

    With the addition of 0.03 wt% rare earth Ce, in our previous works, the properties of SnAgCu solder were enhanced obviously. Based on the Garofalo–Arrhenius creep constitutive model, finite element method was used to simulate the stress–strain response during thermal cycle loading, and combined with the fatigue life prediction models, the fatigue life of SnAgCu/SnAgCuCe solder joints was calculated respectively, which can demonstrate the effect of the rare earth Ce on the fatigue life of SnAgCu solder joints. The results indicated that the maximum stress–strain can be found on the top surface of the corner solder joint, and the warpage of the PCB substrate occurred during thermal cycle loading. The trends obtained from modeling results have a good agreement with the experimental data reported in the literature for WLCSP devices. In addition, the stress–strain of SnAgCuCe solder joints is lower than that of SnAgCu solder joints. The thermal fatigue lives of solder joints calculated based on the creep model and creep strain energy density model show that the fatigue life of SnAgCuCe solder joints is higher than the SnAgCu solder joints. The fatigue life of SnAgCuCe solder joints can be enhanced significantly with the addition of Ce, is 30.2% higher than that of SnAgCu solder joints, which can be attributed to the CeSn 3 particles formed resisting the motion of dislocation; moreover, the refinement of microstructure and the IMC sizes also contribute to the enhancement of fatigue life, which elucidates that SnAgCuCe solder can be utilized in electronic industry with high reliability replacing the SnAgCu solder

  6. Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock

    Science.gov (United States)

    Han, Jing; Tan, Shihai; Guo, Fu

    2018-01-01

    Ball grid array (BGA) samples were soldered on a printed circuit board with Sn37Pb solder paste to investigate the recrystallization induced by subgrain rotation during thermal shock. The composition of the solder balls was Sn3.0Ag0.5Cu-Sn37Pb, which comprised mixed solder joints. The BGA component was cross-sectioned before thermal shock. The microstructure and grain orientations were obtained by a scanning electron microscope equipped with an electron back-scattered diffraction system. Two mixed solder joints at corners of the BGA component were selected as the subjects. The results showed that recrystallization occurred at the corner of the solder joints after 200 thermal shock cycles. The recrystallized subgrains had various new grain orientations. The newly generated grain orientations were closely related to the initial grain orientations, which indicated that different subgrain rotation behaviors could occur in one mixed solder joint with the same initial grain orientation. When the misorientation angles were very small, the rotation axes were about Sn [100], [010] and [001], as shown by analyzing the misorientation angles and subgrain rotation axes, while the subgrain rotation behavior with large misorientation angles in the solder joints was much more complicated. As Pb was contained in the solder joints and the stress was concentrated on the corner of the mixed solder joints, concaves and cracks were formed. When the adjacent recrystallized subgrains were separated, and the process of the continuous recrystallization was limited.

  7. Design of mechanical joints

    CERN Document Server

    Blake, Alexander

    2018-01-01

    A cornerstone publication that covers the basic principles and practical considerations of design methodology for joints held by rivets, bolts, weld seams, and adhesive materials, Design of Mechanical Joints gives engineers the practical results and formulas they need for the preliminary design of mechanical joints, combining the essential topics of joint mechanics...strength of materials...and fracture control to provide a complete treatment of problems pertinent to the field of mechanical connections.

  8. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    Science.gov (United States)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. PMID:27877786

  9. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    International Nuclear Information System (INIS)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. (review)

  10. Intergranular stress corrosion in soldered joints of stainless steel 304

    International Nuclear Information System (INIS)

    Zamora R, L.

    1994-01-01

    The intergranular stress cracking of welded joints of austenitic stainless steel, AISI 304, is a serious problem in BWR type reactors. It is associated with the simultaneous presence of three factors; stress, a critical media and sensibilization (DOS). EPR technique was used in order to verify the sensibilization degree in the base metal, and the zone affected by heat and welding material. The characterization of material was done. The objective of this work is the study of microstructure and the evaluation of EPR technique used for the determination of DOS in a welded plate of austenitic stainless steel AISI 304. (Author)

  11. Damage Model for Reliability Assessment of Solder Joints in Wind Turbines

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    environmental factors. Reliability assessment for such type of products conventionally is performed by classical reliability techniques based on test data. Usually conventional reliability approaches are time and resource consuming activities. Thus in this paper we choose a physics of failure approach to define...... damage model by Miner’s rule. Our attention is focused on crack propagation in solder joints of electrical components due to the temperature loadings. Based on the proposed method it is described how to find the damage level for a given temperature loading profile. The proposed method is discussed...

  12. Effects of In and Ni Addition on Microstructure of Sn-58Bi Solder Joint

    Science.gov (United States)

    Mokhtari, Omid; Nishikawa, Hiroshi

    2014-11-01

    In this study, the effect of adding 0.5 wt.% and 1 wt.% In and Ni to Sn-58Bi solder on intermetallic compound (IMC) layers at the interface and the microstructure of the solder alloys were investigated during reflow and thermal aging by scanning electron microscopy and electron probe micro-analysis. The results showed that the addition of minor elements was not effective in suppressing the IMC growth during the reflow; however, the addition of 0.5 wt.% In and Ni was effective in suppressing the IMC layer growth during thermal aging. The thickening kinetics of the total IMC layer was analyzed by plotting the mean thickness versus the aging time on log-log coordinates, and the results showed the transition point from grain boundary diffusion control to a volume diffusion control mechanism. The results also showed that the minor addition of In can significantly suppress the coarsening of the Bi phase.

  13. Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

    Science.gov (United States)

    Hasnine, M.; Tolla, B.; Vahora, N.

    2018-04-01

    This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

  14. Electromigration in 3D-IC scale Cu/Sn/Cu solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Ho, Cheng-En, E-mail: ceho1975@hotmail.com; Lee, Pei-Tzu; Chen, Chih-Nan; Yang, Cheng-Hsien

    2016-08-15

    The electromigration effect on the three-dimensional integrated circuits (3D-IC) scale solder joints with a Cu/Sn(25–50 μm)/Cu configuration was investigated using a field-emission scanning electron microscope (FE–SEM) combined with electron backscatter diffraction (EBSD) analysis system. Electron current stressing for a few days caused the pronounced accumulation of Cu{sub 6}Sn{sub 5} in specific Sn grain boundaries (GBs). The EBSD analysis indicated that both the β-Sn crystallographic orientation and GB orientation play dominant roles in this accumulation. The dependencies of the Cu{sub 6}Sn{sub 5} accumulation on the two above factors (i.e., Sn grain orientation and GB orientation) can be well rationalized via a proposed mathematic model based on the Huntington and Grone's electromigration theory with the Cu anisotropic diffusion data in a β-Sn lattice. - Highlights: • Anisotropic Cu electromigration in the 3D-IC scale microelectronic solder joints. • Pronounced accumulation of Cu{sub 6}Sn{sub 5} intermetallic in specific Sn grain boundaries. • A linear dependence of Cu{sub 6}Sn{sub 5} accumulation over the current stressing time. • β-Sn and grain boundary orientations are the dominant factors in Cu{sub 6}Sn{sub 5} accumulation.

  15. Mechanics of Suture Joints

    Science.gov (United States)

    Li, Yaning; Song, Juha; Ortiz, Christine; Boyce, Mary; Ortiz Group/DMSE/MIT Team; Boyce Group/ME/MIT Team

    2011-03-01

    Biological sutures are joints which connect two stiff skeletal or skeletal-like components. These joints possess a wavy geometry with a thin organic layer providing adhesion. Examples of biological sutures include mammalian skulls, the pelvic assembly of the armored fish Gasterosteus aculeatus (the three-spined stickleback), and the suture joints in the shell of the red-eared slider turtle. Biological sutures allow for movement and compliance, control stress concentrations, transmit loads, reduce fatigue stress and absorb energy. In this investigation, the mechanics of the role of suture geometry in providing a naturally optimized joint is explored. In particular, analytical and numerical micromechanical models of the suture joint are constructed. The anisotropic mechanical stiffness and strength are studied as a function of suture wavelength, amplitude and the material properties of the skeletal and organic components, revealing key insights into the optimized nature of these ubiquitous natural joints.

  16. Features of soldering of molybdenum a lols

    International Nuclear Information System (INIS)

    Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

    1980-01-01

    Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

  17. Joining technologies for the 1990s: Welding, brazing, soldering, mechanical, explosive, solid-state, adhesive

    Science.gov (United States)

    Buckley, John D. (Editor); Stein, Bland A. (Editor)

    1986-01-01

    A compilation of papers presented in a joint NASA, American Society for Metals, The George Washington University, American Welding Society, and Society of Manufacturing Engineers Conference on Welding, Bonding, and Fastening at Langley Research Center, Hampton, VA, on October 23 to 25, 1984 is given. Papers were presented on technology developed in current research programs relevant to welding, bonding, and fastening of structural materials required in fabricating structures and mechanical systems used in the aerospace, hydrospace, and automotive industries. Topics covered in the conference included equipment, hardware and materials used when welding, brazing, and soldering, mechanical fastening, explosive welding, use of unique selected joining techniques, adhesives bonding, and nondestructive evaluation. A concept of the factory of the future was presented, followed by advanced welding techniques, automated equipment for welding, welding in a cryogenic atmosphere, blind fastening, stress corrosion resistant fasteners, fastening equipment, explosive welding of different configurations and materials, solid-state bonding, electron beam welding, new adhesives, effects of cryogenics on adhesives, and new techniques and equipment for adhesive bonding.

  18. Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

    Science.gov (United States)

    Mukherjee, S.; Chauhan, P.; Osterman, M.; Dasgupta, A.; Pecht, M.

    2016-07-01

    Mechanistic microstructural models have been developed to capture the effect of isothermal aging on time dependent viscoplastic response of Sn3.0Ag0.5Cu (SAC305) solders. SnAgCu (SAC) solders undergo continuous microstructural coarsening during both storage and service because of their high homologous temperature. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long term reliability of microelectronic packages. It is well documented that isothermal aging degrades the creep resistance of SAC solder. SAC305 alloy is aged for (24-1000) h at (25-100)°C (~0.6-0.8 × T melt). Cross-sectioning and image processing techniques were used to periodically quantify the effect of isothermal aging on phase coarsening and evolution. The parameters monitored during isothermal aging include size, area fraction, and inter-particle spacing of nanoscale Ag3Sn intermetallic compounds (IMCs) and the volume fraction of micronscale Cu6Sn5 IMCs, as well as the area fraction of pure tin dendrites. Effects of microstructural evolution on secondary creep constitutive response of SAC305 solder joints were then modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs in the eutectic phase; and (2) load sharing between pro-eutectic Sn dendrites and the surrounding coarsened eutectic Sn-Ag phase and microscale Cu6Sn5 IMCs. The coarse-grained polycrystalline Sn microstructure in SAC305 solder was not captured in the above model because isothermal aging does not cause any significant change in the initial grain size and orientation of SAC305 solder joints. The above mechanistic model can successfully capture the drop in creep resistance due to the influence of isothermal aging on SAC305 single crystals. Contribution of grain boundary sliding to the creep strain of

  19. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

    2008-07-14

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

  20. Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy

    Science.gov (United States)

    Tikale, Sanjay; Prabhu, K. Narayan

    2018-05-01

    The effect of Al2O3 nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al2O3 nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (T L) and melting temperature range of the SAC305 solder alloy by addition of Al2O3 nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al2O3 nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu6Sn5 IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy.

  1. Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy

    Directory of Open Access Journals (Sweden)

    Abdoul-Aziz Bogno

    2015-01-01

    Full Text Available The properties and performance of lead-free solder alloys such as fluidity and wettability are defined by the alloy composition and solidification microstructure. Rapid solidification of metallic alloys is known to result in refined microstructures with reduced microsegregation and improved mechanical properties of the final products as compared to normal castings. The rapidly solidified Sn-based solders by melt spinning were shown to be suitable for soldering with low temperature and short soldering duration. In the present study, rapidly solidified Sn–0.7 wt.%Cu droplets generated by impulse atomization (IA were achieved as well as directional solidification under transient conditions at lower cooling rate. This paper reports on a comparative study of the rapidly solidified and the directionally solidified samples. Different but complementary characterization techniques were used to fully analyze the solidification microstructures of the samples obtained under the two cooling regimes. These include X-ray diffractometry (XRD and scanning electron microscopy (SEM. In order to compare the tensile strength and elongation to fracture of the directionally solidified ingot and strip castings with the atomized droplet, compaction and extrusion of the latter were carried out. It was shown that more balanced and superior tensile mechanical properties are available for the hot extruded samples from compacted as-atomized Sn–0.7 wt.%Cu droplets. Further, elongation-to-fracture was 2–3× higher than that obtained for the directionally solidified samples.

  2. The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints

    Science.gov (United States)

    Sona, Mrunali; Prabhu, K. Narayan

    2017-09-01

    The failure of solder joints due to imposed stresses in an electronic assembly is governed by shear bond strength. In the present study, the effect of wetting gravity regime on single-lap shear strength of Sn-0.3Ag-0.7Cu and Sn-2.5Ag-0.5Cu solder alloys reflowed between bare copper substrates as well as Ni-coated Cu substrates was investigated. Samples were reflowed for 10 s, T gz (time corresponding to the end of gravity regime) and 100 s individually and tested for single-lap shear strength. The single-lap shear test was also carried out on eutectic Sn-Pb/Cu- and Sn-Pb/Ni-coated Cu specimens to compare the shear strength values obtained with those of lead-free alloys. The eutectic Sn-Pb showed significantly higher ultimate shear strength on bare Cu substrates when compared to Sn-Ag-Cu alloys. However, SAC alloys reflowed on nickel-coated copper substrate exhibited higher shear strength when compared to eutectic Sn-Pb/Ni-coated Cu specimens. All the substrate/solder/substrate lap joint specimens that were reflowed for the time corresponding to the end of gravity regime exhibited maximum ultimate shear strength.

  3. Analysis of a short beam with application to solder joints: could larger stand-off heights relieve stress?

    Science.gov (United States)

    Suhir, Ephraim

    2015-08-01

    Physically meaningful and easy-to-use analytical (mathematical) stress model is developed for a short beam with clamped and known-in-advance offset ends. The analysis is limited to elastic deformations. While the classical Timoshenko short-beam theory seeks the beam's deflection caused by the combined bending and shear deformations for the given loading, an inverse problem is considered here: the lateral force is sought for the given ends offset. In short beams this force is larger than in long beams, since, in order to achieve the given displacement (offset), the applied force has to overcome both bending and shear resistance of the beam. It is envisioned that short beams could adequately mimic the state of stress in solder joint interconnections, including ball-grid-array (BGA) systems, with large, compared to conventional joints, stand-off heights. When the package/printed-circuit-board (PCB) assembly is subjected to the change in temperature, the thermal expansion (contraction) mismatch of the package and the PCB results in an easily predictable relative displacement (offset) of the ends of the solder joint. This offset can be determined from the known external thermal mismatch strain (determined as the product of the difference in the coefficients of thermal expansion and the change in temperature) and the position of the joint with respect to the mid-cross-section of the assembly. The maximum normal and shearing stresses could be viewed as suitable criteria of the beam's (joint's) material long-term reliability. It is shown that these stresses can be brought down by employing beam-like joints, i.e., joints with an increased stand-off height compared to conventional joints. It is imperative, of course, that, if such joints are employed, there is still enough interfacial real estate, so that the BGA bonding strength is not compromised. On the other hand, owing to the lower stress level, reliability assurance might be much less of a challenge than in the case of

  4. Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

    Science.gov (United States)

    Barbagallo, C.; Malgioglio, G. L.; Petrone, G.; Cammarata, G.

    2017-05-01

    For power devices, the reliability of thermal fatigue induced by thermal cycling has been prioritized as an important concern. The main target of this work is to apply a numerical procedure to assess the fatigue life for lead-free solder joints, that represent, in general, the weakest part of the electronic modules. Starting from a real multi-chip power module, FE-based models were built-up by considering different conditions in model implementation in order to simulate, from one hand, the worst working condition for the module and, from another one, the module standing into a climatic test room performing thermal cycles. Simulations were carried-out both in steady and transient conditions in order to estimate the module thermal maps, the stress-strain distributions, the effective plastic strain distributions and finally to assess the number of cycles to failure of the constitutive solder layers.

  5. Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

    International Nuclear Information System (INIS)

    Barbagallo, C; Petrone, G; Cammarata, G; Malgioglio, G L

    2017-01-01

    For power devices, the reliability of thermal fatigue induced by thermal cycling has been prioritized as an important concern. The main target of this work is to apply a numerical procedure to assess the fatigue life for lead-free solder joints, that represent, in general, the weakest part of the electronic modules. Starting from a real multi-chip power module, FE-based models were built-up by considering different conditions in model implementation in order to simulate, from one hand, the worst working condition for the module and, from another one, the module standing into a climatic test room performing thermal cycles. Simulations were carried-out both in steady and transient conditions in order to estimate the module thermal maps, the stress-strain distributions, the effective plastic strain distributions and finally to assess the number of cycles to failure of the constitutive solder layers. (paper)

  6. Spontaneous soldering

    International Nuclear Information System (INIS)

    Percacci, R.

    1984-01-01

    It is proposed that the soldering form of general relativity be treated as a dynamical variable. This gives rise to the possibility of treating the linear connection on (n-dimensional) spacetime and an internal O(k)-Yang-Mills field as different components of the same O(N) gauge field (N= n+k). The distinction between gravitational and Yang-Mills interactions is due to a kind of Higgs mechanism driven by the vacuum expectation value of the soldering form. (orig.)

  7. Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

    Science.gov (United States)

    Hammad, A. E.; El-Taher, A. M.

    2014-11-01

    The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

  8. Investigation on solder joint strength of nickel tin-plated and CRS tabs with PCB

    International Nuclear Information System (INIS)

    Luay Hussain

    2002-01-01

    Failure analysis on easily peels off Nickel and CRS steel tabs from PCB was carried out. Nickel Tin plated tabs, CRS steel tabs and tube were joined to the PCB using reflow/ convection soldering, in an oven. The solder paste composition is Sn36/Pb35/Ag2. Peel test was conducted and it was found that many tabs could be easily peeled off with low force. Porosities which varies from 0.4 mm to < 0.01mm in diameter, developed during soldering process and solidification was noted. It was found, the number, size and position of these porosities inside the solder layer on both parts of the tabs affect the peel strength. Scanning Electron Microscopy study and EDX analysis were carried out. It was found that the low peel strength values were due to the combination of generation and development of porosities during soldering process which act as stress concentrators and the evolution (growth) of eutectic Sn/Pb and Sn/Ni/Cu brittle grainy phase. Large eutectic microstructure with brittle Sn-Ni-Cu grainy phase enhances the failure with low peeling forces. Sample showing no feature of Sn/Ni/Cu grain gave high peeling strength value. Solder reflow, an important process, can result in strength enhancement (if it was controlled for example in a furnace). (Author)

  9. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Directory of Open Access Journals (Sweden)

    Yee Mei Leong

    2016-06-01

    Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

  10. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Science.gov (United States)

    Leong, Yee Mei; Haseeb, A.S.M.A.

    2016-01-01

    Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

  11. Current density redistribution from no current crowding to current crowding in Pb-free solder joints with an extremely thick Cu layer

    International Nuclear Information System (INIS)

    Han, Jung Kyu; Choi, Daechul; Fujiyoshi, Masaru; Chiwata, Nobuhiko; Tu, King-Ning

    2012-01-01

    In order to remove the effect of current crowding on electromigration, thick Cu under-bump metallization has been widely adopted in the electronics industry. Three-dimensional (3-D) integrated circuits, using through Si via Cu column interconnects, is being developed, and it seems that current crowding may not be a reliability issue. However, statistical experiments and 3-D finite element simulation indicate that there is a transition from no current crowding to current crowding, caused by void growth at the cathode. An analysis of the electromigration-induced failure mechanism in solder joints having a very thick Cu layer is presented. It is a unique failure mechanism, different from that in flip chip technology. Moreover, the study of marker displacement shows two different stages of drift velocity, which clearly demonstrates the back-stress effect and the development of compressive stress.

  12. Methodology for Analyzing Strain States During In-Situ Thermomechanical Cycling in Individual Lead Free Solder Joints Using Synchrotron Radiation

    International Nuclear Information System (INIS)

    Zhou, Bite; Bieler, Thomas R.; Lee, Tae-Kyu; Liu, Kuo-Chuan

    2009-01-01

    To examine how a lead-free solder joint deforms in a thermal cycling environment, both the elastic and plastic stress and strain behavior must be understood. Methods to identify evolution of the internal strain (stress) state during thermal cycling are described. A slice of a package containing a single row of solder joints was thermally cycled from 0 C to 100 C with a period of about 1 h with concurrent acquisition of transmission Laue patterns using synchrotron radiation. These results indicated that most joints are single crystals, with some being multicrystals with no more than a few Sn grain orientations. Laue patterns were analyzed to estimate local strains in different crystal directions at different temperatures during a thermal cycle. While the strains perpendicular to various crystal planes all vary in a similar way, the magnitude of strain varies. The specimens were subsequently given several hundred additional thermal cycles and measured again to assess changes in the crystal orientations. These results show that modest changes in crystal orientations occur during thermal cycling.

  13. SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

    Directory of Open Access Journals (Sweden)

    D. Heinemann

    2016-06-01

    Full Text Available Printed Circuit Boards (PCB play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

  14. Influence of Poly(ethylene glycol) Degradation on Voiding Sporadically Occurring in Solder Joints with Electroplated Cu

    Science.gov (United States)

    Wafula, F.; Yin, L.; Borgesen, P.; Andala, D.; Dimitrov, N.

    2012-07-01

    This paper presents a comprehensive study of the effect of poly(ethylene glycol) (PEG) degradation on the void formation known to take place sporadically at the interface between electroplated Cu and Pb-free solder. Thorough chemical analysis of our plating solution, carried out at different times of the deposition process by matrix-assisted laser desorption ionization time-of-flight mass spectroscopy, reveals a dramatic shift in the peaks to lower mass range with time. Scanning electron microscopy cross-sectional images of solder joints with Cu samples that have been plated at different times in the course of solution aging show a decrease in void formation. A decreasing magnitude of the deposition overpotential also seen during aging suggests that, breaking down to lower-molecular-weight fragments, PEG loses its suppression effect and likely has lower impact on the voiding propensity. This indirect correlation is confirmed further by the use of plating solutions containing PEG with preselected molecular weight. We also report on the effect of the surface area-to-solution volume ratio on PEG degradation studied by comparative experiments performed in a 50-mL bath with a rotating disc electrode and in a larger cell (Hull cell) with volume of 267 mL. The results show that, at fixed charge per unit volume, PEG degrades at a greatly accelerated rate in the Hull cell featuring higher electrode surface-to-solution volume ratio. Analysis of solder joints with accordingly grown Cu layers suggests that the voiding decreases faster with the accelerated rate of PEG degradation.

  15. Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

    International Nuclear Information System (INIS)

    Chellvarajoo, Srivalli; Abdullah, M.Z.; Samsudin, Z.

    2015-01-01

    Highlights: • Fe 2 NiO 4 nanoparticles added into SAC 305 by mechanical mixing to form nanocomposite solder paste. • Nanoparticles in the composite solder travels with flux to the outermost surface after reflow. • The intermetallics compound reduced with the addition of nanoparticles into solder paste. • The hardness increased with the addition of limited percentage of nanoparticles into SAC 305. - Abstract: This study investigates the effects of the addition of Fe 2 NiO 4 nanoparticles into a SAC-305 lead-free solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper ‘sandwich’ method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5 wt.% of Fe 2 NiO 4 nanoparticles, respectively. If the addition of Fe 2 NiO 4 nanoparticle exceeded 1.5 wt.%, the hardness increased infinitely

  16. An evaluation of the spring finger solder joints on SA1358-10 and SA2052-4 connector assemblies (MC3617,W87)

    International Nuclear Information System (INIS)

    Kilgo, Alice C.; Vianco, Paul Thomas; Hlava, Paul Frank; Zender, Gary L.

    2006-01-01

    The SA1358-10 and SA2052-4 circular JT Type plug connectors are used on a number of nuclear weapons and Joint Test Assembly (JTA) systems. Prototype units were evaluated for the following specific defects associated with the 95Sn-5Sb (Sn-Sb, wt.%) solder joint used to attach the beryllium-copper (BeCu) spring fingers to the aluminum (Al) connector shell: (1) extended cracking within the fillet; (2) remelting of the solder joint during the follow-on, soldering step that attached the EMR adapter ring to the connector shell (and/or soldering the EMR shell to the adapter ring) that used the lower melting temperature 63Sn-37Pb (Sn-Pb) alloy; and (3) spalling of the Cd (Cr) layer overplating layer from the fillet surface. Several pedigrees of connectors were evaluated, which represented older fielded units as well as those assemblies that were recently constructed at Kansas City Plant. The solder joints were evaluated that were in place on connectors made with the current soldering process as well as an alternative induction soldering process for attaching the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely reflected the different extents to which the connector was mated to its counterpart assembly. In all cases, the spring finger solder joints on the SA1358-10 connectors were remelted as a result of the subsequent EMR adapter ring attachment process. Spalling of the Cd (Cr) overplating layer was also observed for these connectors, which was a consequence of the remelting activity. On the other hand, the SA2052-4 connector did not exhibit evidence of

  17. On the problem of soldering refractory metals with silver-containing solders

    International Nuclear Information System (INIS)

    Anikeev, E.F.; Andryushchenko, V.I.; Chepelenko, V.N.; Batov, V.M.

    1981-01-01

    The processes of wetting, spreading and interphase interactions of copper-silver liquid alloys alloyed with Ni and Si, with niobium, tantalum, molybdenum, tungsten, 12Kh18N10T steel and nickel are studied. It has been determined that Ni or Si additions into the copper-silver solder improve the wetting and adhesion. When soldering with the alloy containing Ni additions, the strength of a soldered Joint grows with the increase of soldering duration while soldering with the alloy containing Si additions, the strength decreases. That is why Ni-containing solders are preferable for soldering thick-walled structures, and Si-containing solders - for thin-walled structures [ru

  18. Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

    Science.gov (United States)

    Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

    2017-10-01

    Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

  19. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

    Directory of Open Access Journals (Sweden)

    John D. Sørensen

    2011-12-01

    Full Text Available Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is necessary to understand the physics of their failure and be able to develop reliability prediction models. Such a model is proposed in this paper for an IGBT power electronic module. IGBTs are critical components in wind turbine converter systems. These are multilayered devices where layers are soldered to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development and propagation processes is discussed. A statistical analysis is performed for appropriate model parameter selection. Based on the proposed model, a layout for component life prediction with crack movement is described in details.

  20. Thermomechanical fatigue life prediction for several solders

    Science.gov (United States)

    Wen, Shengmin

    Since solder connections operate at high homologous temperature, solders are high temperature materials. This feature makes their mechanical behavior and fatigue phenomena unique. Based on experimental findings, a physical damage mechanism is introduced for solders. The mechanism views the damage process as a series of independent local damage events characterized by the failure of individual grains, while the structural damage is the eventual percolation result of such local events. Fine's dislocation energy density concept and Mura's microcrack initiation theory are adopted to derive the fatigue formula for an individual grain. A physical damage metric is introduced to describe the material with damage. A unified creep and plasticity constitutive model is adopted to simulate the mechanical behavior of solders. The model is cast into a continuum damage mechanics framework to simulate material with damage. The model gives good agreement with the experimental results of 96.5Pb-3.5Sn and 96.5Sn-3.5Ag solders under uniaxial strain-controlled cyclic loading. The model is convenient for implementation into commercial computational packages. Also presented is a fatigue theory with its failure criterion for solders based on physical damage mechanism. By introducing grain orientation into the fatigue formula, an m-N curve (m is Schmid factor) at constant loading condition is suggested for fatigue of grains with different orientations. A solder structure is defined as fatigued when the damage metric reaches a critical threshold, since at this threshold the failed grains may form a cluster and percolate through the structure according to percolation theory. Fatigue data of 96.5Pb-3.5Sn solder bulk specimens under various uniaxial tension tests were analyzed. Results show that the theory gives consistent predictions under broad conditions, while inelastic strain theory does not. The theory is anisotropic with no size limitation to its application, which could be suitable for

  1. Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

    Directory of Open Access Journals (Sweden)

    Jinhua Mi

    2014-01-01

    Full Text Available Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA and fine-pitch ball grid array (FBGA interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products.

  2. Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2011-01-01

    Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is nec......Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components...... to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development...

  3. Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process.

    Science.gov (United States)

    Li, Z L; Dong, H J; Song, X G; Zhao, H Y; Tian, H; Liu, J H; Feng, J C; Yan, J C

    2018-04-01

    Homogeneous (Cu, Ni) 6 Sn 5 intermetallic compound (IMC) joints were rapidly formed in asymmetrical Ni/Sn/Cu system by an ultrasound-induced transient liquid phase (TLP) soldering process. In the traditional TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system consisted of major (Cu, Ni) 6 Sn 5 and minor Cu 3 Sn IMCs, and the grain morphology of (Cu, Ni) 6 Sn 5 IMCs subsequently exhibited fine rounded, needlelike and coarse rounded shapes from the Ni side to the Cu side, which was highly in accordance with the Ni concentration gradient across the joints. However, in the ultrasound-induced TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system only consisted of the (Cu, Ni) 6 Sn 5 IMCs which exhibited an uniform grain morphology of rounded shape with a remarkably narrowed Ni concentration gradient. The ultrasound-induced homogeneous intermetallic joints exhibited higher shear strength (61.6 MPa) than the traditional heterogeneous intermetallic joints (49.8 MPa). Copyright © 2017 Elsevier B.V. All rights reserved.

  4. Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly

    Energy Technology Data Exchange (ETDEWEB)

    Mostafa Shalaby, Rizk; Kamal, Mustafa [Metal Physics Laboratory, Physics Department, Faculty of Science, Mansoura University, P.O.Box: 35516, Mansoura (Egypt); Ali, Esmail A.M. [Basic Science Department, Faculty of Engineering, University of Science & Technology (Yemen); Gumaan, Mohammed S., E-mail: m.gumaan1@gmail.com [Metal Physics Laboratory, Physics Department, Faculty of Science, Mansoura University, P.O.Box: 35516, Mansoura (Egypt); Basic Science Department, Faculty of Engineering, University of Science & Technology (Yemen)

    2017-04-06

    This paper aims to investigate the reliability of mechanical and creep behavior for the eutectic Sn-Ag and Sn-Ag-Cu Solder joints rapidly solidified after hot compressing (HC) in terms of structural changes and its relationship with thermal behavior, which has been discussed and compared with their properties before HC process by Mustafa et al. (2016) . These solder joints were prepared by melt-spinning technique and tested by HC at 30 MPa pressure and 150 °C for 90 min, their structural, mechanical and thermal properties after HC process have been investigated by X-ray diffraction (XRD), dynamic resonance techniques (DRT) and differential scanning calorimetry (DSC) techniques respectively and compared with these solders before HC. The results revealed that the pressure caused some fractures on the solders morphology surfaces. But some benefits for these solders have been occurred, like eliminating the internal stresses through recrystallization process whose evidence by the particle size increases after they HC, stabilized structure after HC was due to the metastable phases rearrangements, new intermetallic compounds (IMCs) formation, decreasing, melting temperature range (∆T), lattice strains (ƹ) and entropy change (S). These sequential benefits are considered to be the main reasons which lead to decreasing energy loss (Q{sup −1}), creep rate (É›) and thermal stability enhancement. Elastic modulus increment might be due to low elastic lattice distortions after HC, while the stress exponent (n) reduction refers to viscous glide mechanism of deformation after HC instead of climb deformation mechanism before HC.

  5. Solderability study of RABiTS-based YBCO coated conductors

    International Nuclear Information System (INIS)

    Zhang Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

    2011-01-01

    Study examines the implication of solder and flux selection in YBCO splice joints. Focus is on commercially available RABiTS-based YBCO coated conductors. Solderability varied with solder and flux for three different stabilizations tested. Resistivity of stabilizer was dominant factor in splice joint resistance. Solder materials affected splice joint resistance when solderability was poor. The solderability of commercially available YBa 2 Cu 3 O 7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

  6. Development of a soft-soldering system for aluminum

    Science.gov (United States)

    Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

    1983-03-01

    The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

  7. Characterization of lead-free solders for electronic packaging

    Science.gov (United States)

    Ma, Hongtao

    The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

  8. Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

    Science.gov (United States)

    2015-05-05

    under bump metallurgy and solder joint geometry on Sn grain morphology in Pb free solder joints were examined. SnAgCu solder joints were examined for...free solder interconnects”, Sci. Technol. Weld . Join. 13, 732 (2008). [3.25] Terashima, S., Takahama, K., Nozaki, M., and Tanaka, M. Recrystallization

  9. Mechanical flexible joint design document

    Science.gov (United States)

    Daily, Vic

    1993-01-01

    The purpose of this report is to document the status of the Mechanical Flexible Joint (MFJ) Design Subtask with the intent of halting work on the design. Recommendations for future work is included in the case that the task is to be resumed. The MFJ is designed to eliminate two failure points from the current flex joint configuration, the inner 'tripod configuration' and the outer containment jacket. The MFJ will also be designed to flex 13.5 degrees and have three degrees of freedom. By having three degrees of freedom, the MFJ will allow the Low Pressure Fuel Duct to twist and remove the necessity to angulate the full 11 degrees currently required. The current flex joints are very labor intensive and very costly and a simple alternative is being sought. The MFJ is designed with a greater angular displacement, with three degrees of freedom, to reside in the same overall envelope, to meet weight constraints of the current bellows, to be compatible with cryogenic fuel and oxidizers, and also to be man-rated.

  10. The joint implementation mechanisms (MOC)

    International Nuclear Information System (INIS)

    2003-01-01

    The aim of the joint implementation mechanisms (MOC) is aims to favor the fight against the climatic change, by the implementing of activities, technologies and appropriate techniques emitting less greenhouse gases in south countries and by the possibility of reducing the greenhouse gases emissions for a more economical cost. This guide brings a practical assistance to the projects set-up: the possible concerned projects, the formalization of the project, the methodology, the involvement of the carbon credits in the project financing. (A.L.B.)

  11. Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Chih-Yao [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Hon, Min-Hsiung [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 415 Chien-Kung Road, Kaohsiung 80782, Taiwan (China); Wang, Moo-Chin, E-mail: mcwang@kmu.edu.tw [Department of Fragrance and Cosmetic Science, Kaohsiung Medical University, 100, Shih-Chuan 1st Road, Kaohsiung 80728, Taiwan (China); Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long [Institute of Nanotechnology and Microsystems Engineering, National Cheng Kung University, No. 1, University Road, Tainan 70101, Taiwan (China)

    2014-01-05

    Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag{sub 3}Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn{sub 3}. No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging.

  12. Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

    International Nuclear Information System (INIS)

    Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin; Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long

    2014-01-01

    Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag 3 Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn 3 . No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging

  13. Elevated-Temperature Mechanical Properties of Lead-Free Sn-0.7Cu- xSiC Nanocomposite Solders

    Science.gov (United States)

    Mohammadi, A.; Mahmudi, R.

    2018-02-01

    Mechanical properties of Sn-0.7 wt.%Cu lead-free solder alloy reinforced with 0 vol.%, 1 vol.%, 2 vol.%, and 3 vol.% 100-nm SiC particles have been assessed using the shear punch testing technique in the temperature range from 25°C to 125°C. The composite materials were fabricated by the powder metallurgy route by blending, compacting, sintering, and finally extrusion. The 2 vol.% SiC-containing composite showed superior mechanical properties. In all conditions, the shear strength was adversely affected by increasing test temperature, and the 2 vol.% SiC-containing composite showed superior mechanical properties. Depending on the test temperature, the shear yield stress and ultimate shear strength increased, respectively, by 3 MPa to 4 MPa and 4 MPa to 5.5 MPa, in the composite materials. The strength enhancement was mostly attributed to the Orowan particle strengthening mechanism due to the SiC nanoparticles, and to a lesser extent to the coefficient of thermal expansion mismatch between the particles and matrix in the composite solder. A modified shear lag model was used to predict the total strengthening achieved by particle addition, based on the contribution of each of the above mechanisms.

  14. Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

    International Nuclear Information System (INIS)

    Sun, Peng; Andersson, Cristina; Wei, Xicheng; Cheng, Zhaonian; Shangguan, Dongkai; Liu, Johan

    2007-01-01

    In this paper, the coupling effect in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi solder joint with sandwich structure by long time reflow soldering was studied. It was found that the interfacial compound at the Cu substrate was binary Cu-Sn compound in Sn-Ag-Bi solder joint and Cu 5 Zn 8 phase in Sn-Zn-Bi solder joint. The thickness of the Cu-Zn compound layer formed at the Cu substrate was greater than or equal to that of Cu-Sn compound layer, although the reflow soldering temperature of Sn-Zn-Bi (240 o C) was lower than that of Sn-Ag-Bi (250 o C). The stable Cu-Zn compound was the absolute preferential phase in the interfacial layer between Sn-Zn-Bi and the Cu substrate. The ternary (Cu, Ni) 6 Sn 5 compound was formed at the Sn-Ag-Bi/Ni(P)-Cu metallization interface, and a complex alloy Sn-Ni-Cu-Zn was formed at the Sn-Zn-Bi/Ni(P)-Cu metallization interface. It was noted that Cu atoms could diffuse from the Cu substrate through the solder matrix to the Ni(P)-Cu metallization within 1 min reflow soldering time for both solder systems, indicating that just 30 s was long enough for Cu to go through 250 μm diffusion length in the Sn-Ag-Bi solder joint at 250 o C. The coupling effect between Ni(P)/Cu metallization and Cu substrate was confirmed as the type of IMCs at Ni(P) layer had been changed from Ni-Sn system to Cu-Sn system apparently by the diffusion effect of Cu atoms. The (Cu, Ni) 6 Sn 5 layer at the Ni(P)/Cu metallization grew significantly and its thickness was even greater than that of the Cu-Sn compound on the opposite side, however the growth of the complex alloy including Sn, Ni, Cu and Zn on the Ni(P)/Cu metallization was suppressed

  15. Soldering of Nanotubes onto Microelectrodes

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing sold...... bonds were consistently found to be mechanically stronger than the carbon nanotubes.......Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...

  16. Microstructure evolution and thermomechanical fatigue of solder materials

    NARCIS (Netherlands)

    Matin, M.A.

    2005-01-01

    The microelectronics industry is confronted with the new challenge to produce joints with lead-free solder materials replacing classical tin-lead solders in devices used in many fields (e.g. consumer electronics, road transport, aviation, space-crafts, telecommunication). In service, solder

  17. Ductile fracture mechanism of low-temperature In-48Sn alloy joint under high strain rate loading.

    Science.gov (United States)

    Kim, Jong-Woong; Jung, Seung-Boo

    2012-04-01

    The failure behaviors of In-48Sn solder ball joints under various strain rate loadings were investigated with both experimental and finite element modeling study. The bonding force of In-48Sn solder on an Ni plated Cu pad increased with increasing shear speed, mainly due to the high strain-rate sensitivity of the solder alloy. In contrast to the cases of Sn-based Pb-free solder joints, the transition of the fracture mode from a ductile mode to a brittle mode was not observed in this solder joint system due to the soft nature of the In-48Sn alloy. This result is discussed in terms of the relationship between the strain-rate of the solder alloy, the work-hardening effect and the resulting stress concentration at the interfacial regions.

  18. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

    2009-12-01

    Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the Beta-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of Beta-Sn derived from the electromigration data is in good agreement with the calculated value.

  19. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

    2009-05-15

    Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the {beta}-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of {beta}-Sn derived from the electromigration data is in good agreement with the calculated value.

  20. Comparative shear tests of some low temperature lead-free solder pastes

    Science.gov (United States)

    Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

    2016-12-01

    The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

  1. Microstructure and mechanical properties of Sn-9Zn-xAl2O3 nanoparticles (x=0–1) lead-free solder alloy: First-principles calculation and experimental research

    International Nuclear Information System (INIS)

    Xing, Wen-qing; Yu, Xin-ye; Li, Heng; Ma, Le; Zuo, Wei; Dong, Peng; Wang, Wen-xian; Ding, Min

    2016-01-01

    This paper studies microstructure and mechanical properties of Sn-9Zn-x Al 2 O 3 nanoparticles (x=0–1) lead-free solder alloy. The interface structure, interface energy and electronic properties of Al 2 O 3 /Sn9Zn interface are investigated by first-principle calculation. On the experimental part, in comparison with the plain Sn-9Zn solder, the Al 2 O 3 nanoparticles incorporated into the solder matrix can inhibit the growth of coarse dendrite Sn-Zn eutectic structure and refine grains of the composite solders during the solidification process of the alloys. Moreover, the microhardness and average tensile strength of the solders with addition of Al 2 O 3 nanoparticles increased with the increasing weight percentages of Al 2 O 3 nanoparticles. These improved mechanical properties can be attributed to the microstructure developments and the dispersed Al 2 O 3 nanoparticles.

  2. Interface between Sn-Sb-Cu solder and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

    2011-07-15

    Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

  3. Soldering in electronics assembly

    CERN Document Server

    Judd, Mike

    2013-01-01

    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  4. Features of Pd-Ni-Fe solder system for vacuum brazing of low alloy steels

    International Nuclear Information System (INIS)

    Radzievskij, V.N.; Kurochko, R.S.; Lotsmanov, S.N.; Rymar', V.I.

    1975-01-01

    The brazing solder of the Pd-Ni-Fe alloyed with copper and lithium, in order to decrease the melting point and provide for a better spreading, when soldered in vacuum ensures a uniform strength of soldered joints with the base metal of low-alloyed steels of 34KHNIM-type. The properties of low-alloyed steel joints brazed with the Pd-Ni-Fe-system solder little depend on the changes in the soldering parameters. The soldered joint keeps a homogeneous structure after all the stages of heat treatment (annealing, quenching and tempering)

  5. Tolerance Optimization for Mechanisms with Lubricated Joints

    International Nuclear Information System (INIS)

    Choi, J.-H.; Lee, S.J.; Choi, D.-H.

    1998-01-01

    This paper addresses an analytical approach to tolerance optimization for planar mechanisms with lubricated joints based on mechanical error analysis. The mobility method is applied to consider the lubrication effects at joints and planar mechanisms are stochastically defined by using the clearance vector model for mechanical error analysis. The uncertainties considered in the analysis are tolerances on link lengths and radial clearances and these are selected as design variables. To show the validity of the proposed method for mechanical error analysis, it is applied to two examples, and the results obtained are compared with those of Monte Carlo simulations. Based on the mechanical error analysis, tolerance optimizations are applied to the examples

  6. Reliability of Pb free solder alloys. Physical and mechanical properties; Pb free handa no shinraisei. Butsuri kikaiteki shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Sanji, M; Yoshino, M; Ishikawa, J; Takenaka, O [Denso Corp., Aichi (Japan)

    1997-10-01

    Properties of 19 different Pb free solders have been evaluated in comparison with Sn-37Pb eutectic solder. Pb free solders without Bi were on the same level as Sn-37Pb in tensile strength and elongation, and those with Bi had higher strength and lower elongation than Sn-37Pb. As the Bi content increased, strength was higher, and elongation was lower. In torsion fatigue tests, fatigue life of Pb free solders without Bi was longer than Sn-37Pb. The relationships of Coffin-Manson rule and Basquin rule with fatigue life was applicable to Pb free solder. Fatigue life of those is inferred from their tensile strength. 7 refs., 13 figs., 1 tab.

  7. Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Wang Fengjiang [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States); O' Keefe, Matthew [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)], E-mail: mjokeefe@mst.edu; Brinkmeyer, Brandon [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)

    2009-05-27

    The effect of incorporating eutectic Sn-Pb solder with Sn-3.0Ag-0.5Cu (SAC) Pb-free solder on the microstructure and tensile properties of the mixed alloys was investigated. Alloys containing 100, 75, 50, 25, 20, 15, 10, 5 and 0 wt% SAC, with the balance being Sn-37Pb eutectic solder alloy, were prepared and characterized. Optical and scanning electron microscopy were used to analyze the microstructures while 'mini-tensile' test specimens were fabricated and tested to determine mechanical properties at the mm length scale, more closely matching that of the solder joints. Microstructural analysis indicated that a Pb-rich phase formed and was uniformly distributed at the boundary between the Sn-rich grains or between the Sn-rich and the intermetallic compounds in the solder. Tensile results showed that mixing of the alloys resulted in an increase in both the yield and the ultimate tensile strength compared to the original solders, with the 50% SAC-50% Sn-Pb mixture having the highest measured strength. Initial investigations indicate the formation and distribution of a Pb-rich phase in the mixed solder alloys as the source of the strengthening mechanism.

  8. The Effects of Antimony Addition on the Microstructural, Mechanical, and Thermal Properties of Sn-3.0Ag-0.5Cu Solder Alloy

    Science.gov (United States)

    Sungkhaphaitoon, Phairote; Plookphol, Thawatchai

    2018-02-01

    In this study, we investigated the effects produced by the addition of antimony (Sb) to Sn-3.0Ag-0.5Cu-based solder alloys. Our focus was the alloys' microstructural, mechanical, and thermal properties. We evaluated the effects by means of scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), differential scanning calorimetry (DSC), and a universal testing machine (UTM). The results showed that a part of the Sb was dissolved in the Sn matrix phase, and the remaining one participated in the formation of intermetallic compounds (IMCs) of Ag3(Sn,Sb) and Cu6(Sn,Sb)5. In the alloy containing the highest wt pct Sb, the added component resulted in the formation of SnSb compound and small particle pinning of Ag3(Sn,Sb) along the grain boundary of the IMCs. Our tests of the Sn-3.0Ag-0.5Cu solder alloys' mechanical properties showed that the effects produced by the addition of Sb varied as a function of the wt pct Sb content. The ultimate tensile strength (UTS) increased from 29.21 to a maximum value of 40.44 MPa, but the pct elongation (pct EL) decreased from 48.0 to a minimum 25.43 pct. Principally, the alloys containing Sb had higher UTS and lower pct EL than Sb-free solder alloys due to the strengthening effects of solid solution and second-phase dispersion. Thermal analysis showed that the alloys containing Sb had a slightly higher melting point and that the addition amount ranging from 0.5 to 3.0 wt pct Sb did not significantly change the solidus and liquidus temperatures compared with the Sb-free solder alloys. Thus, the optimal concentration of Sb in the alloys was 3.0 wt pct because the microstructure and the ultimate tensile strength of the SAC305 solder alloys were improved.

  9. The critical oxide thickness for Pb-free reflow soldering on Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)

    2012-06-01

    Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

  10. Instantaneous fluxless bonding of Au with Pb-Sn solder in ambient atmosphere

    International Nuclear Information System (INIS)

    Lee, T.K.; Zhang, Sam; Wong, C.C.; Tan, A.C.

    2005-01-01

    A fluxless bonding technique has been developed as a method of flip-chip bonding for microelectronic packaging. The fluxless bonding technique can be achieved instantaneously in an ambient environment between metallic stud bumps and predefined molten solder. This paper describes the mechanics of the bonding action and verifies the effectiveness of this bonding method through wetting balance tests and scanning electron microscope and energy dispersive x-ray analysis. This technique has been demonstrated by using a gold stud bump to break the tin oxide layer over molten solder. This allows for a fast, solid liquid interdiffusion between gold (Au) and the fresh molten eutectic lead-tin (Pb-Sn) solder for joint formation during solidification. This bonding method has been successfully tested with 130-μm-pitch flip-chip bond pads on a joint-in-via flex substrate architecture

  11. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    CERN Document Server

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

    2015-01-01

    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  12. Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

    Directory of Open Access Journals (Sweden)

    Yulong Li

    2018-01-01

    Full Text Available In order to accelerate the growth of interfacial intermetallic compound (IMC layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms and 800 ms, were used for the ultrasonic soldering. The isothermal aging was conducted at 150 °C for 0, 120, 240, and 360 h. The evolution of microstructure, the IMC layer growth mechanism during aging, and the shear strength of the joints after aging were systemically investigated. Results showed the following. (i Formation of intermetallic compounds was accelerated by ultrasonic cavitation and streaming effects, the thickness of the interfacial Cu6Sn5 layer increased with aging time, and a thin Cu3Sn layer was identified after aging for 360 h. (ii The growth of the interfacial IMC layer of the ultrasonically soldered Cu/SAC305/Cu joints followed a linear function of the square root of the aging time, revealing a diffusion-controlled mechanism. (iii The tensile shear strength of the joint decreased to a small extent with increasing aging time, owing to the combined effects of IMC grain coarsening and the increase of the interfacial IMC. (iv Finally, although the fracture surfaces and failure locations of the joint soldered with 400 ms and 800 ms vibration times show similar characteristics, they are influenced by the aging time.

  13. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Directory of Open Access Journals (Sweden)

    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  14. Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature

    Energy Technology Data Exchange (ETDEWEB)

    Prabhu, K.N., E-mail: prabhukn_2002@yahoo.co.in [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India); Deshapande, Parashuram; Satyanarayan [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India)

    2012-01-30

    Highlights: Black-Right-Pointing-Pointer Effect of cooling rate on tensile and impact properties of Sn-9Zn alloy was assessed. Black-Right-Pointing-Pointer Both DBTT and UTS of the solder alloy increased with increase in cooling rate. Black-Right-Pointing-Pointer An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile-brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn-9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 Degree-Sign C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the

  15. Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature

    International Nuclear Information System (INIS)

    Prabhu, K.N.; Deshapande, Parashuram; Satyanarayan

    2012-01-01

    Highlights: ► Effect of cooling rate on tensile and impact properties of Sn–9Zn alloy was assessed. ► Both DBTT and UTS of the solder alloy increased with increase in cooling rate. ► An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile–brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn–9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 °C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the DBTT.

  16. Systematics of Structural, Phase Stability, and Cohesive Properties of η'-Cu6(Sn,In)5 Compounds Occurring in In-Sn/Cu Solder Joints

    Science.gov (United States)

    Ramos, S. B.; González Lemus, N. V.; Deluque Toro, C. E.; Cabeza, G. F.; Fernández Guillermet, A.

    2017-07-01

    Motivated by the high solubility of In in ( mC44) η'-Cu6Sn5 compound as well as the occurrence of an In-doped η'-intermetallic in the microstructure of Cu/In-Sn/Cu solder joints, a theoretical study has been carried out to investigate the various physical effects of incorporating In at Sn Wyckoff sites of the binary η'-phase. Systematic ab initio calculations using the projected augmented wave method and Vienna Ab initio Simulation Package were used to determine the composition dependence of the structural and cohesive properties of η'-Cu6(Sn,In)5 compounds, compared with those expected from the binary end-member compounds Cu6Sn5 and Cu6In5. The molar volume shows significant deviations from Vegard's law. The predicted composition dependence of the cohesive properties is discussed using two complementary approaches, viz. a valence-electron density approach as well as a bond-number approach, both accounting for the roughly linear dependence of the cohesive energy on the In content. A microscopic interpretation for this general trend is given in terms of the key contributions to chemical bonding in this class of compounds, namely Cu d-electron overlap and hybridization of Cu d-states with In and Sn p-electron states. Moreover, a crystallographic site approach is developed to accurately establish the phase-stabilizing effect of incorporating In at specific Wyckoff positions of the ( mC44) η'-Cu6Sn5 structure.

  17. Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

    International Nuclear Information System (INIS)

    Yang, Ming; Ko, Yong-Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu

    2017-01-01

    Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

  18. Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Ming [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Ko, Yong-Ho [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Bang, Junghwan [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Kim, Taek-Soo [Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Lee, Chang-Woo, E-mail: cwlee@kitech.re.kr [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Li, Mingyu, E-mail: myli@hit.edu.cn [Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055 (China)

    2017-02-15

    Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

  19. Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi–Sn based lead-free solder alloys

    International Nuclear Information System (INIS)

    Shalaby, Rizk Mostafa

    2013-01-01

    Mechanical properties and indentation creep of the melt-spun process Bi–42 wt%Sn, Bi–40 wt%Sn–2 wt%In, Bi–40 wt%Sn–2 wt%Ag and Bi–38 wt%Sn–2 wt%In–2 wt%Ag were studied by dynamic resonance technique and Vickers indentation testing at room temperature and compared to that of the traditional Sn–37 wt%Pb eutectic alloy. The results show that the structure of Bi–42 wt%Sn alloy is characterized by the presence of rhombohedral Bi and body centered tetragonal β-Sn. The two ternary alloys exhibit additional constituent phases of intermetallic compounds SnIn 19 for Bi–40 wt%Sn–2 wt%In and ε-Ag 3 Sn for Bi–40 wt%Sn–2 wt%Ag alloys. Attention has been paid to the role of intermetallic compounds on mechanical and creep behavior. The In and Ag containing solder alloy exhibited a good combination of higher creep resistance, good mechanical properties and lower melting temperature as compared with Pb–Sn eutectic solder alloy. This was attributed to the strengthening effect of Bi as a strong solid solution element in the Sn matrix and formation of intermetallic compounds β-SnBi, ε-Ag 3 Sn and InSn 19 which act as both strengthening agent and grain refiner in the matrix of the material. Addition of In and Ag decreased the melting temperature of Bi–Sn lead-free solder from 143 °C to 133 °C which was possible mainly due to the existence of InSn 19 and Ag 3 Sn intermetallic compounds. Elastic constants, internal friction and thermal properties of Bi–Sn based alloys have been studied and analyzed.

  20. Effect of temperature and flux concentration on soldering of base metal.

    Science.gov (United States)

    Lee, S Y; Lin, C T; Wang, M H; Tseng, H; Huang, H M; Dong, D R; Pan, L C; Shih, Y H

    2000-12-01

    The present study used the acoustic emission (AE) technique to evaluate interactions among soldering temperature, flux treatment, and the resultant ultimate tensile strength (UTS). Scanning electron microscopy (SEM) was used to examine fracture surfaces of the solder joints. Specimens were cast from removable partial denture alloy and then placed in a jig with a gap distance of 1.0 mm. A high-frequency soldering machine with an optical pyrometer was used for soldering at 1150 degrees C and 1200 degrees C, respectively. The flux concentrations were 67% and 75%. The soldered specimens were subjected to tensile test at a crosshead speed of 0.05 mm/min. During testing, acoustic emissions in the frequency range of 100--1200 kHz were collected, filtered, recorded, and processed by a sensing device. The results were analysed by ANOVA and Tukey LSD test. UTS at different temperatures showed no significant difference according to either mechanical or acoustic results. But in the 1200 degrees C group, the UTSs and AE counts showed significant differences (Pacoustic signals within the elastic deformation zone, while the 67% flux subgroup produced similar signals within the plastic deformation zone, either beyond the 0.2% yield point or before fracture.

  1. The constitutive response of three solder materials

    International Nuclear Information System (INIS)

    Perez-Bergquist, Alejandro G.; Cao Fang; Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T.

    2012-01-01

    Highlights: ► The full constitutive response of three solder materials. ► Test temperatures from −196 °C to 60 °C and strain rates from 10 −3 to >10 3 s −1 . ► Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (−196 °C to 60 °C) and strain rate (10 −3 to >10 3 s −1 ). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  2. The constitutive response of three solder materials

    Energy Technology Data Exchange (ETDEWEB)

    Perez-Bergquist, Alejandro G., E-mail: alexpb@lanl.gov [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States); Cao Fang [Exxon Mobil Research and Engineering Company, Annadale, NJ 08801 (United States); Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T. [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States)

    2012-05-25

    Highlights: Black-Right-Pointing-Pointer The full constitutive response of three solder materials. Black-Right-Pointing-Pointer Test temperatures from -196 Degree-Sign C to 60 Degree-Sign C and strain rates from 10{sup -3} to >10{sup 3} s{sup -1}. Black-Right-Pointing-Pointer Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196 Degree-Sign C to 60 Degree-Sign C) and strain rate (10{sup -3} to >10{sup 3} s{sup -1}). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  3. Effect of P on Microstructure and Mechanical Properties of Sn-Bi Solder

    Directory of Open Access Journals (Sweden)

    WANG Xiao-jing

    2016-07-01

    Full Text Available Micro alloy metals P or P/Cu/Zn were added into Sn-Bi alloy to investigate the doping effects on microstructure, mechanical property, deformation fracture from the function of P in pure tin. The results show that doping 1%( mass fraction, same as below P to pure tin can improve the strength and stiffness, decrease the plasticity. Only 0.1%P additive degenerates the mechanical property of Sn-Bi alloy, this is related to the existing form of element P in the base metal and the microstructure of the base metal. In Sn base alloy, P is distributed in phase or grain boundaries in the form of Sn-P intermetallic compounds (IMC, restricting the diffusion and shifting of deformation. Therefore, Sn-1P alloy, IMC distributed in beta-tin base plays a role of strengthening in pure tin doped situation, in Sn-Bi alloy instead, enhancing the deformation mismatch under loading becoming the weak spots where cracks may initiate and propagate, and leading to brittle fracture . Finally, addition of P/Zn/Cu simultaneously to Sn-Bi alloy, the doping can optimize the microstructure, improve the strength and enhance the ultimate tensile strength (UTS of Sn-Bi alloys.

  4. Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    McNally, K.M.; Sorg, B.S.; Welch, A.J.; Dawes, J.M.; Owen, E.R.

    1999-01-01

    maximum temperature difference through the 150μm thick solder strips of about 15 deg. C. Histological examination of the repairs formed using these parameters showed negligible evidence of collateral thermal damage to the underlying tissue. Scanning electron microscopy suggested albumin intertwining within the tissue collagen matrix and subsequent fusion with the collagen as the mechanism for laser tissue soldering. The laser tissue soldering technique is shown to be an effective method for producing repairs with improved tensile strength and minimal collateral thermal damage over conventional laser tissue welding techniques. (author)

  5. Soldering of copper-clad niobium--titanium superconductor composite

    International Nuclear Information System (INIS)

    Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

    1977-04-01

    When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

  6. New Coating Technique of Ceramic Implants with Different Glass Solder Matrices for Improved Osseointegration-Mechanical Investigations.

    Science.gov (United States)

    Mick, Enrico; Markhoff, Jana; Mitrovic, Aurica; Jonitz, Anika; Bader, Rainer

    2013-09-11

    Ceramics are a very popular material in dental implant technology due to their tribological properties, their biocompatibility and their esthetic appearance. However, their natural surface structure lacks the ability of proper osseointegration, which constitutes a crucial process for the stability and, thus, the functionality of a bone implant. We investigated the application of a glass solder matrix in three configurations-consisting mainly of SiO₂, Al₂O₃, K₂O and Na₂O to TZP-A ceramic specimens. The corresponding adhesive strength and surface roughness of the coatings on ceramic specimens have been analyzed. Thereby, high adhesive strength (70.3 ± 7.9 MPa) was found for the three different coatings. The obtained roughness (R z ) amounted to 18.24 ± 2.48 µm in average, with significant differences between the glass solder configurations. Furthermore, one configuration was also tested after additional etching which did not lead to significant increase of surface roughness (19.37 ± 1.04 µm) or adhesive strength (57.2 ± 5.8 MPa). In conclusion, coating with glass solder matrix seems to be a promising surface modification technique that may enable direct insertion of ceramic implants in dental and orthopaedic surgery.

  7. New Coating Technique of Ceramic Implants with Different Glass Solder Matrices for Improved Osseointegration-Mechanical Investigations

    Directory of Open Access Journals (Sweden)

    Rainer Bader

    2013-09-01

    Full Text Available Ceramics are a very popular material in dental implant technology due to their tribological properties, their biocompatibility and their esthetic appearance. However, their natural surface structure lacks the ability of proper osseointegration, which constitutes a crucial process for the stability and, thus, the functionality of a bone implant. We investigated the application of a glass solder matrix in three configurations—consisting mainly of SiO2, Al2O3, K2O and Na2O to TZP-A ceramic specimens. The corresponding adhesive strength and surface roughness of the coatings on ceramic specimens have been analyzed. Thereby, high adhesive strength (70.3 ± 7.9 MPa was found for the three different coatings. The obtained roughness (Rz amounted to 18.24 ± 2.48 µm in average, with significant differences between the glass solder configurations. Furthermore, one configuration was also tested after additional etching which did not lead to significant increase of surface roughness (19.37 ± 1.04 µm or adhesive strength (57.2 ± 5.8 MPa. In conclusion, coating with glass solder matrix seems to be a promising surface modification technique that may enable direct insertion of ceramic implants in dental and orthopaedic surgery.

  8. Microstructure and mechanical properties of Sn-9Zn-xAl{sub 2}O{sub 3} nanoparticles (x=0–1) lead-free solder alloy: First-principles calculation and experimental research

    Energy Technology Data Exchange (ETDEWEB)

    Xing, Wen-qing; Yu, Xin-ye; Li, Heng; Ma, Le; Zuo, Wei [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Dong, Peng; Wang, Wen-xian [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Shanxi Key Laboratory of Advanced Magnesium-based Materials, Taiyuan 030024 (China); Key Laboratory of Interface Science and Engineering in Advanced Materials, Ministry of Education, Taiyuan University of Technology, Taiyuan 030024 (China); Ding, Min, E-mail: dingmin@tyut.edu.cn [Taiyuan University of Technology, College of Material Science and Technology, Taiyuan 030024 (China); Shanxi Key Laboratory of Advanced Magnesium-based Materials, Taiyuan 030024 (China); Key Laboratory of Interface Science and Engineering in Advanced Materials, Ministry of Education, Taiyuan University of Technology, Taiyuan 030024 (China)

    2016-12-15

    This paper studies microstructure and mechanical properties of Sn-9Zn-x Al{sub 2}O{sub 3} nanoparticles (x=0–1) lead-free solder alloy. The interface structure, interface energy and electronic properties of Al{sub 2}O{sub 3}/Sn9Zn interface are investigated by first-principle calculation. On the experimental part, in comparison with the plain Sn-9Zn solder, the Al{sub 2}O{sub 3} nanoparticles incorporated into the solder matrix can inhibit the growth of coarse dendrite Sn-Zn eutectic structure and refine grains of the composite solders during the solidification process of the alloys. Moreover, the microhardness and average tensile strength of the solders with addition of Al{sub 2}O{sub 3} nanoparticles increased with the increasing weight percentages of Al{sub 2}O{sub 3} nanoparticles. These improved mechanical properties can be attributed to the microstructure developments and the dispersed Al{sub 2}O{sub 3} nanoparticles.

  9. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Directory of Open Access Journals (Sweden)

    Saliza Azlina O.

    2016-01-01

    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  10. A novel method for direct solder bump pull testing using lead-free solders

    Science.gov (United States)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  11. Effects of Ni{sub 3}Sn{sub 4} and (Cu,Ni){sub 6}Sn{sub 5} intermetallic layers on cross-interaction between Pd and Ni in solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Baek, Yong-Ho [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of); Division of Advanced Circuit Interconnect, Samsung Electro-Mechanics Co., Ltd., Suwon 443-743 (Korea, Republic of); Chung, Bo-Mook [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of); Department of Research and Development, KPM TECH, Ansan 425-090 (Korea, Republic of); Choi, Young-Sik [Division of Advanced Circuit Interconnect, Samsung Electro-Mechanics Co., Ltd., Suwon 443-743 (Korea, Republic of); Choi, Jaeho [Department of Advanced Metal and Materials Engineering, Gangneung-Wonju National University, Gangneung 210-702 (Korea, Republic of); Huh, Joo-Youl, E-mail: jyhuh@korea.ac.kr [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of)

    2013-12-05

    alleviate the (Pd,Ni)Sn{sub 4}-related degradation of solder joint reliability.

  12. Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties

    Energy Technology Data Exchange (ETDEWEB)

    Billah, Md. Muktadir; Shorowordi, Kazi Mohammad; Sharif, Ahmed, E-mail: asharif@mme.buet.ac.bd

    2014-02-05

    Highlights: • Ni-added Sn-Zn-Bi were characterized metallographically, thermally and mechanically. • The volume fraction of α-Zn phase increased with both Bi and Ni in Sn-Zn-Bi alloys. • Micron-sized Ni particles reacted with neither Sn nor Zn to form intermetallics. • Better combination of thermal and mechanical properties can be achieved with Ni. -- Abstract: Micron-sized Ni particle-reinforced Sn–8Zn–3Bi composite solders were prepared by mechanically dispersing Ni particles into Sn–8Zn–3Bi alloy and the bulk properties of the composite solder alloy were characterized metallographically, thermally and mechanically. Different percentage of Ni particle viz. 0.25, 0.5 and 1 wt.% were added in the liquid Sn–8Zn–3Bi alloy and then cast into the metal molds. Melting behavior was studied by differential thermal analyzer (DTA). Microstructural investigation was carried out by both optical and scanning electron microscope. Tensile properties were determined using an Instron Universal Testing Machine at a strain rate 3.00 mm/min. The results indicated that the Ni addition increased the melting temperature of Sn–8Zn–3Bi alloy. The addition of Ni was also found to increase the solidification range. In the Sn–8Zn–3Bi alloy, needle-shaped α-Zn phase was found to be uniformly distributed in the β-Sn matrix. However, it was found that the small amount of Ni addition in Sn–8Zn–3Bi alloy refined the Zn needles throughout the matrix. Also an enhanced precipitation of Zn in the structure was observed with the addition of Ni. All these structural changes improved the mechanical properties like tensile strength and hardness of the newly developed quaternary alloy.

  13. Evaluation on the characteristics of tin-silver-bismuth solder

    Science.gov (United States)

    Xia, Z.; Shi, Y.; Chen, Z.

    2002-02-01

    Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

  14. Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2018-04-01

    Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

  15. Mechanical properties of welded joints of duplex steels

    International Nuclear Information System (INIS)

    Kawiak, M.; Nowacki, J.

    2003-01-01

    The paper presents the study results of mechanical properties of duplex steels UNS S31803 welded joints as well as duplex and NV A36 steels welded joints. They have ben welded by FCAW method in CO 2 using FCW 2205-H flux-cored wire. The joints have been subjected: tensile tests, impact tests, bending tests, hardness tests and metallographic investigations. The influence of welding parameters and mechanical properties of the joints was appreciated. The welding method assured high tensile strength of the joints (approximately 770 MPa) and high impact strength of the welds (approximately 770 J). All samples were broken outside of welds. (author)

  16. Influence of Nickel Thickness and Annealing Time on the Mechanical Properties of Intermetallic Compounds Formed between Cu-Sn Solder and Substrate

    Energy Technology Data Exchange (ETDEWEB)

    Kim, Yiseul; Kwon, Jeehye; Yoo, Dayoung; Park, Sungkyu; Lee, Dajeong; Lee, Dongyun [Pusan National University, Busan (Korea, Republic of)

    2017-03-15

    Intermetallic compounds (IMCs) developed on the interface between a solder alloy and its bonding pads are an important factor in the failure of electronic circuits. In this study, the mechanical behaviors of the IMCs formed in the Cu-Ni-Sn ternary alloy system are investigated. Presumably, Ni can act as a diffusion barrier to Cu and Sn to form the IMCs. Detailed analysis of the microstructure is conducted using an electron probe micro-analyzer (EPMA). The addition of Ni softened the IMCs, which is determined based on the fracture toughness increasing (from 0.71 to 1.55 MPa√m) with the Ni layer thickness. However, above a critical amount of Ni involved in the Cu-Sn IMCs, the softening effect is diminished, and this could result from the segregation of Ni inside the IMCs. Therefore, the optimized condition must be determined in order to obtain a positive Ni effect on enhancing the reliability of the electronic circuits.

  17. FY 1998 report on the waste processing/recycling related technology, 'The R and D of lead-free solder standardization'; 1998 nendo haikibutsu shori recycle kanren gijutsu seika hokokusho. Namari free handa kikakuka nado kenkyu kaihatsu

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2000-03-01

    To reduce the environmental pollution caused by lead eluted from the electronic equipment waste, the R and D on lead-free solder were conducted and the results were summarized. As to the basic characteristics, the evaluation test method was studied in terms of the range of melting temperature, mechanical strength, wettability and joint strength, to select a uniform test method. As the lead-free solder, Sn-Ag alloys were mainly used and mixed in a combination of Cu, Bi and In. Changes in characteristics were made clear by adding trace elements such as Ge, Mn and P. Relating to the applied characteristics, in selection of solder materials, materials were selected for which evaluation of the commercialization is proceeded with from a viewpoint of promotion of commercialization. Concerning the experimental evaluation of characteristics of lead-free solder in mounted substrates, it was indicated that basically lead-free solder can be practically used. Further, it was indicated that the Sn-Ag-Cu-Bi system depends not on solder composition but on active force, printing accuracy and flux characteristic of solder paste, that improvement of solder paste has an effect on mounting characteristics. (NEDO)

  18. Fluxless flip-chip bonding using a lead-free solder bumping technique

    Science.gov (United States)

    Hansen, K.; Kousar, S.; Pitzl, D.; Arab, S.

    2017-09-01

    With the LHC exceeding the nominal instantaneous luminosity, the current barrel pixel detector (BPIX) of the CMS experiment at CERN will reach its performance limits and undergo significant radiation damage. In order to improve detector performance in high luminosity conditions, the entire BPIX is replaced with an upgraded version containing an additional detection layer. Half of the modules comprising this additional layer are produced at DESY using fluxless and lead-free bumping and bonding techniques. Sequential solder-jetting technique is utilized to wet 40-μm SAC305 solder spheres on the silicon-sensor pads with electroless Ni, Pd and immersion Au (ENEPIG) under-bump metallization (UBM). The bumped sensors are flip-chip assembled with readout chips (ROCs) and then reflowed using a flux-less bonding facility. The challenges for jetting low solder volume have been analyzed and will be presented in this paper. An average speed of 3.4 balls per second is obtained to jet about 67 thousand solder balls on a single chip. On average, 7 modules have been produced per week. The bump-bond quality is evaluated in terms of electrical and mechanical properties. The peak-bump resistance is about 17.5 mΩ. The cross-section study revealed different types of intermetallic compounds (IMC) as a result of interfacial reactions between UBM and solder material. The effect of crystalline phases on the mechanical properties of the joint is discussed. The mean shear strength per bump after the final module reflow is about 16 cN. The results and sources of yield loss of module production are reported. The achieved yield is 95%.

  19. High temperature soldering of graphite

    International Nuclear Information System (INIS)

    Anikin, L.T.; Kravetskij, G.A.; Dergunova, V.S.

    1977-01-01

    The effect is studied of the brazing temperature on the strength of the brazed joint of graphite materials. In one case, iron and nickel are used as solder, and in another, molybdenum. The contact heating of the iron and nickel with the graphite has been studied in the temperature range of 1400-2400 ged C, and molybdenum, 2200-2600 deg C. The quality of the joints has been judged by the tensile strength at temperatures of 2500-2800 deg C and by the microstructure. An investigation into the kinetics of carbon dissolution in molten iron has shown that the failure of the graphite in contact with the iron melt is due to the incorporation of iron atoms in the interbase planes. The strength of a joint formed with the participation of the vapour-gas phase is 2.5 times higher than that of a joint obtained by graphite recrystallization through the carbon-containing metal melt. The critical temperatures are determined of graphite brazing with nickel, iron, and molybdenum interlayers, which sharply increase the strength of the brazed joint as a result of the formation of a vapour-gas phase and deposition of fine-crystal carbon

  20. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    International Nuclear Information System (INIS)

    Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

    2010-01-01

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  1. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

    2010-02-18

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  2. The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

    Science.gov (United States)

    Werden, Jesse

    The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the

  3. Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X = Bi, In) solders with Cu substrate

    International Nuclear Information System (INIS)

    Hodulova, Erika; Palcut, Marian; Lechovic, Emil; Simekova, Beata; Ulrich, Koloman

    2011-01-01

    Highlights: → In substitutes Sn in intermetallic compounds formed at the Cu-solder interface. → Bi and In decrease the parabolic rate constant of Cu 3 Sn layer growth. → In increases the parabolic rate constant of Cu 6 Sn 5 layer growth. → High In concentrations should be avoided since they may lead to a pre-mature solder joint degradation. - Abstract: The effects of Bi and In additions on intermetallic phase formation in lead-free solder joints of Sn-3.7Ag-0.7Cu; Sn-1.0Ag-0.5Cu-1.0Bi and Sn-1.5Ag-0.7Cu-9.5In (composition given in weight %) with copper substrate are studied. Soldering of copper plate was conducted at 250 deg. C for 5 s. The joints were subsequently aged at temperatures of 130-170 deg. C for 2-16 days in a convection oven. The aged interfaces were analyzed by optical microscopy and energy dispersive X-ray spectroscopy (EDX) microanalysis. Two intermetallic layers are observed at the interface - Cu 3 Sn and Cu 6 Sn 5 . Cu 6 Sn 5 is formed during soldering. Cu 3 Sn is formed during solid state ageing. Bi and In decrease the growth rate of Cu 3 Sn since they appear to inhibit tin diffusion through the grain boundaries. Furthermore, indium was found to produce a new phase - Cu 6 (Sn,In) 5 instead of Cu 6 Sn 5 , with a higher rate constant. The mechanism of the Cu 6 (Sn,In) 5 layer growth is discussed and the conclusions for the optimal solder chemical composition are presented.

  4. Recent Advances in Computational Mechanics of the Human Knee Joint

    Science.gov (United States)

    Kazemi, M.; Dabiri, Y.; Li, L. P.

    2013-01-01

    Computational mechanics has been advanced in every area of orthopedic biomechanics. The objective of this paper is to provide a general review of the computational models used in the analysis of the mechanical function of the knee joint in different loading and pathological conditions. Major review articles published in related areas are summarized first. The constitutive models for soft tissues of the knee are briefly discussed to facilitate understanding the joint modeling. A detailed review of the tibiofemoral joint models is presented thereafter. The geometry reconstruction procedures as well as some critical issues in finite element modeling are also discussed. Computational modeling can be a reliable and effective method for the study of mechanical behavior of the knee joint, if the model is constructed correctly. Single-phase material models have been used to predict the instantaneous load response for the healthy knees and repaired joints, such as total and partial meniscectomies, ACL and PCL reconstructions, and joint replacements. Recently, poromechanical models accounting for fluid pressurization in soft tissues have been proposed to study the viscoelastic response of the healthy and impaired knee joints. While the constitutive modeling has been considerably advanced at the tissue level, many challenges still exist in applying a good material model to three-dimensional joint simulations. A complete model validation at the joint level seems impossible presently, because only simple data can be obtained experimentally. Therefore, model validation may be concentrated on the constitutive laws using multiple mechanical tests of the tissues. Extensive model verifications at the joint level are still crucial for the accuracy of the modeling. PMID:23509602

  5. Knee joint mobilization reduces secondary mechanical hyperalgesia induced by capsaicin injection into the ankle joint.

    Science.gov (United States)

    Sluka, K A; Wright, A

    2001-01-01

    Joint mobilization is a treatment approach commonly used by physical therapists for the management of a variety of painful conditions. However, the clinical effectiveness when compared to placebo and the neurophysiological mechanism of action are not known. The purpose of this study was to establish that application of a manual therapy technique will produce antihyperalgesia in an animal model of joint inflammation and that the antihyperalgesia produced by joint mobilization depends on the time of treatment application. Capsaicin (0.2%, 50 microl) was injected into the lateral aspect of the left ankle joint and mechanical withdrawal threshold assessed before and after capsaicin injection in Sprague-Dawley rats. Joint mobilization of the ipsilateral knee joint was performed 2 h after capsaicin injection for a total of 3 min, 9 min or 15 min under halothane anaesthesia. Control groups included animals that received halothane for the same time as the group that received joint mobilization and those whose limbs were held for the same duration as the mobilization (no halothane). Capsaicin resulted in a decreased mechanical withdrawal threshold by 2 h after injection that was maintained through 4 h. Both 9 and 15 min of mobilization, but not 3 min of mobilization, increased the withdrawal threshold to mechanical stimuli to baseline values when compared with control groups. The antihyperalgesic effect of joint mobilization lasted 30 min. Thus, joint mobilization (9 or 15 min duration) produces a significant reversal of secondary mechanical hyperalgesia induced by intra-articular injection of capsaicin. Copyright 2001 European Federation of Chapters of the International Association for the Study of Pain.

  6. Integration of environmentally compatible soldering technologies for waste minimization

    International Nuclear Information System (INIS)

    Hosking, F.M.

    1992-01-01

    There has been a concentrated effort throughout the international microelectronics industry to phase out chlorofluorocarbon (CFC) materials and alleviate the serious problem of ozone depletion created by the release of CFCS. The development of more environmentally compatible manufacturing technologies is the cornerstone of this effort. Alternative materials and processes for cleaning and soldering have received special attention. Electronic. soldering typically utilizes rosin-based fluxes to promote solder wettability. Flux residues must be removed from the soldered parts when high product reliability is essential. Halogenated or CFC solvents have been the principle chemicals used to clean the residues. With the accelerated push to eliminate CFCs in the US by 1995, CFC-free solvents, aqueous-based cleaning, water soluble or ''no clean'' fluxes, and fluxless soldering technologies are being developed and quickly integrated into manufacturing practice. Sandia's Center for Solder Science and Technology has been ch g a variety of fluxless and alternative soldering technologies for DOE's waste minimization program. The work has focused on controlled atmosphere, laser, and ultrasonic fluxless soldering, protective metallic and organic coatings, and fluxes which have water soluble or low solids-based chemistries. With the increasing concern that Pb will also be banned from electronic soldering, Sandia has been characterizing the wetting, aging, and mechanical properties of Pb-fire solder alloys. The progress of these integrated studies will be discussed. Their impact on environmentally compatible manufacturing will be emphasized. Since there is no universal solution to the various environmental, safety, and health issues which currently face industry, the proposed technologies offer several complementary materials and processing options from which one can choose

  7. Miniaturization of Micro-Solder Bumps and Effect of IMC on Stress Distribution

    Science.gov (United States)

    Choudhury, Soud Farhan; Ladani, Leila

    2016-07-01

    As the joints become smaller in more advanced packages and devices, intermetallic (IMCs) volume ratio increases, which significantly impacts the overall mechanical behavior of joints. The existence of only a few grains of Sn (Tin) and IMC materials results in anisotropic elastic and plastic behavior which is not detectable using conventional finite element (FE) simulation with average properties for polycrystalline material. In this study, crystal plasticity finite element (CPFE) simulation is used to model the whole joint including copper, Sn solder and Cu6Sn5 IMC material. Experimental lap-shear test results for solder joints from the literature were used to validate the models. A comparative analysis between traditional FE, CPFE and experiments was conducted. The CPFE model was able to correlate the experiments more closely compared to traditional FE analysis because of its ability to capture micro-mechanical anisotropic behavior. Further analysis was conducted to evaluate the effect of IMC thickness on stress distribution in micro-bumps using a systematic numerical experiment with IMC thickness ranging from 0% to 80%. The analysis was conducted on micro-bumps with single crystal Sn and bicrystal Sn. The overall stress distribution and shear deformation changes as the IMC thickness increases. The model with higher IMC thickness shows a stiffer shear response, and provides a higher shear yield strength.

  8. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Science.gov (United States)

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  9. An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation

    Science.gov (United States)

    Chawla, N.; Shen, Y.-L.; Deng, X.; Ege, E. S.

    2004-12-01

    The lap-shear technique is commonly used to evaluate the shear, creep, and thermal fatigue behavior of solder joints. We have conducted a parametric experimental and modeling study, on the effect of testing and geometrical parameters on solder/copper joint response in lap-shear. It was shown that the farfield applied strain is quite different from the actual solder strain (measured optically). Subtraction of the deformation of the Cu substrate provides a reasonable approximation of the solder strain in the elastic regime, but not in the plastic regime. Solder joint thickness has a profound effect on joint response. The solder response moves progressively closer to “true” shear response with increasing joint thickness. Numerical modeling using finite-element analyses were performed to rationalize the experimental findings. The same lap-shear configuration was used in the simulation. The input response for solder was based on the experimental tensile test result on bulk specimens. The calculated shear response, using both the commonly adopted far-field measure and the actual shear strain in solder, was found to be consistent with the trends observed in the lap-shear experiments. The geometric features were further explored to provide physical insight into the problem. Deformation of the substrate was found to greatly influence the shear behavior of the solder.

  10. Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

    Science.gov (United States)

    Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

    2004-04-01

    Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

  11. Soldering formalism in noncommutative field theory: a brief note

    International Nuclear Information System (INIS)

    Ghosh, Subir

    2004-01-01

    In this Letter, I develop the soldering formalism in a new domain--the noncommutative planar field theories. The soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair of noncommutative Maxwell-Chern-Simons theories, having opposite signs in their respective topological terms, can be consistently soldered to yield the Proca model (Maxwell theory with a mass term) with corrections that are at least quadratic in the noncommutativity parameter. We further argue that this model can be thought of as the noncommutative generalization of the Proca theory of ordinary spacetime. It is well known that abelian noncommutative gauge theory bears a close structural similarity with non-abelian gauge theory. This fact is manifested in a non-trivial way if the present Letter is compared with existing literature, where soldering of non-abelian models are discussed. Thus the present work further establishes the robustness of the soldering programme. The subtle role played by gauge invariance (or the lack of it), in the above soldering process, is revealed in an interesting way

  12. Utilization of Pb-free solders in MEMS packaging

    Science.gov (United States)

    Selvaduray, Guna S.

    2003-01-01

    Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

  13. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    CERN Document Server

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

    2015-01-01

    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  14. Post Irradiation Mechanical Behaviour of Three EUROFER Joints

    International Nuclear Information System (INIS)

    Lucon, E.; Leenaers, A.; Vandermeulen, W.

    2006-01-01

    The post-irradiation mechanical properties of three EUROFER joints (two diffusion joints and one TIG weld) have been characterized after irradiation to 1.8 dpa at 300 degrees Celsius in the BR-2 reactor. Tensile, KLST impact and fracture toughness tests have been performed. Based on the results obtained and on the comparison with data from EUROFER base material irradiated under similar conditions, the post-irradiation mechanical behaviour of both diffusion joints (laboratory and mock-up) appears similar to that of the base material. The properties of the TIG joint are affected by the lack of a post-weld heat treatment, which causes the material from the upper part of the weld to be significantly worse than that of the lower region. Thus, specimens from the upper layer exhibit extremely pronounced hardening and embrittlement caused by irradiation. The samples extracted from the lower layer show much better resistance to neutron exposure, although their measured properties do not match those of the diffusion joints. The results presented demonstrate that diffusion joining can be a very promising technique.

  15. Thermal and mechanical properties of lead-free SnZn–xNa casting alloys, and interfacial chemistry on Cu substrates during the soldering process

    Energy Technology Data Exchange (ETDEWEB)

    Gancarz, Tomasz, E-mail: tomasz.gancarz@imim.pl [Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Krakow (Poland); Bobrowski, Piotr; Pstruś, Janusz [Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Krakow (Poland); Pawlak, Sylwia [Wroclaw Research Centre EIT+, Wroclaw (Poland)

    2016-09-15

    The microstructural features, thermal properties and mechanical properties of eutectic Sn–Zn alloys with varying Na content (0.1, 0.2, 0.5, 1.0 3.0 and 5.0 at. %) were examined in this study. In the scanning electron microscopy, transmission electron microscopy, and X-ray diffraction analysis data, precipitates of NaSn were observed. The addition of Na to eutectic Sn–Zn alloy improved the mechanical properties and increased electrical resistivity, and reduced the coefficient of thermal expansion; however, the melting point did not change. Wettability tests carried out using Na-doped Sn–15Zn alloys on Cu substrates showed the formation of Cu–Zn phases at the interfaces. Wettability studies were performed using flux ALU33 after 60, 180, 480, 900, 1800 and 3600 s of contact, at temperatures of 230, 250, 280 and 320 °C. The experiments were designed to demonstrate the effect of Na addition on the formation and growth kinetics of Cu{sub 5}Zn{sub 8} and CuZn{sub 4} phases, which were identified using XRDs and EDS. The addition of Na to SnZn causes a reduction in the thickness of the intermetallic compounds layer created at the interface between the liquid solder and the Cu substrate, and an increase in the activation energy of the Cu{sub 5}Zn{sub 8} phase compared to eutectic SnZn. - Highlights: • Precipitates of NaSn was observed and confirmed using TEM and XRD. • Addition Na to eutectic SnZn cussed increased the mechanical properties. • IMCs of Na–Zn and Na–Sn increased electrical resistivity and reduced the CTE. • IMCs layers CuZn{sub 4} and Cu{sub 5}Zn{sub 8} was found at the interface. • Na content changing the character of growth CuZn{sub 4} layer in SnZnNa alloys.

  16. Thermo-mechanical ratcheting in jointed rock masses

    KAUST Repository

    Pasten, C.; Garcí a, M.; Santamarina, Carlos

    2015-01-01

    Thermo-mechanical coupling takes place in jointed rock masses subjected to large thermal oscillations. Examples range from exposed surfaces under daily and seasonal thermal fluctuations to subsurface rock masses affected by engineered systems such as geothermal operations. Experimental, numerical and analytical results show that thermo-mechanical coupling can lead to wedging and ratcheting mechanisms that result in deformation accumulation when the rock mass is subjected to a biased static-force condition. Analytical and numerical models help in identifying the parameter domain where thermo-mechanical ratcheting can take place.

  17. Thermo-mechanical ratcheting in jointed rock masses

    KAUST Repository

    Pasten, C.

    2015-09-01

    Thermo-mechanical coupling takes place in jointed rock masses subjected to large thermal oscillations. Examples range from exposed surfaces under daily and seasonal thermal fluctuations to subsurface rock masses affected by engineered systems such as geothermal operations. Experimental, numerical and analytical results show that thermo-mechanical coupling can lead to wedging and ratcheting mechanisms that result in deformation accumulation when the rock mass is subjected to a biased static-force condition. Analytical and numerical models help in identifying the parameter domain where thermo-mechanical ratcheting can take place.

  18. The influence of incline walking on joint mechanics.

    Science.gov (United States)

    Haggerty, Mason; Dickin, D Clark; Popp, Jennifer; Wang, Henry

    2014-04-01

    Walking is a popular form of exercise and is associated with many health benefits; however, frontal-plane knee joint loading brought about by a large internal knee-abduction moment and cyclic loading could lead to cartilage degeneration over time. Therefore, knee joint mechanics during an alternative walking exercise needs to be analyzed. The purpose of this study was to examine the lower-extremity joint mechanics in the frontal and sagittal planes during incline walking. Fifteen healthy males walked on a treadmill at five gradients (0%, 5%, 10%, 15%, and 20%) at 1.34m/s, and lower-extremity joint mechanics in the frontal and sagittal planes were quantified. The peak internal knee-abduction moment significantly decreased from the level walking condition at all gradients except 5%. Also, a negative relationship between the internal knee-abduction moment and the treadmill gradient was found to exist in 10% increments (0-10%, 5-15%, and 10-20%). The decrease in the internal knee-abduction moment during incline walking could have positive effects on knee joint health such as potentially reducing cartilage degeneration of the knee joint, reducing pain, and decreasing the rate of development of medial tibiofemoral osteoarthritis. This would be beneficial for a knee surgery patient, obese persons, and older adults who are using incline walking for rehabilitation and exercise protocols. Findings from the current study can provide guidance for the development of rehabilitation and exercise prescriptions incorporating incline walking. Copyright © 2014 Elsevier B.V. All rights reserved.

  19. Intergranular stress corrosion in soldered joints of stainless steel 304.; Corrosion intergranular bajo esfuerzo en uniones soldadas de acero inoxidable 304

    Energy Technology Data Exchange (ETDEWEB)

    Zamora R, L [Instituto Nacional de Investigaciones Nucleares, Mexico City (Mexico)

    1994-12-31

    The intergranular stress cracking of welded joints of austenitic stainless steel, AISI 304, is a serious problem in BWR type reactors. It is associated with the simultaneous presence of three factors; stress, a critical media and sensibilization (DOS). EPR technique was used in order to verify the sensibilization degree in the base metal, and the zone affected by heat and welding material. The characterization of material was done. The objective of this work is the study of microstructure and the evaluation of EPR technique used for the determination of DOS in a welded plate of austenitic stainless steel AISI 304. (Author).

  20. Mechanical model of suture joints with fibrous connective layer

    Science.gov (United States)

    Miroshnichenko, Kateryna; Liu, Lei; Tsukrov, Igor; Li, Yaning

    2018-02-01

    A composite model for suture joints with a connective layer of aligned fibers embedded in soft matrix is proposed. Based on the principle of complementary virtual work, composite cylinder assemblage (CCA) approach and generalized self-consistent micro-mechanical models, a hierarchical homogenization methodology is developed to systematically quantify the synergistic effects of suture morphology and fiber orientation on the overall mechanical properties of sutures. Suture joints with regular triangular wave-form serve as an example material system to apply this methodology. Both theoretical and finite element mechanical models are developed and compared to evaluate the overall normal stiffness of sutures as a function of wavy morphology of sutures, fiber orientation, fiber volume fraction, and the mechanical properties of fibers and matrix in the interfacial layer. It is found that generally due to the anisotropy-induced coupling effects between tensile and shear deformation, the effective normal stiffness of sutures is highly dependent on the fiber orientation in the connective layer. Also, the effective shear modulus of the connective layer and the stiffness ratio between the fiber and matrix significantly influence the effects of fiber orientation. In addition, optimal fiber orientations are found to maximize the stiffness of suture joints.

  1. Multi-scale modeling of elasto-plastic response of SnAgCu lead-free solder alloys at different ageing conditions: Effect of microstructure evolution, particle size effects and interfacial failure

    Energy Technology Data Exchange (ETDEWEB)

    Maleki, Milad; Cugnoni, Joel, E-mail: joel.cugnoni@epfl.ch; Botsis, John

    2016-04-20

    In microelectronics applications, SnAgCu lead-free solder joints play the important role of ensuring both the mechanical and electrical integrity of the components. In such applications, the SnAgCu joints are subjected to elevated homologous temperatures for an extended period of time causing significant microstructural changes and leading to reliability issues. In this study, the link between the change in microstructures and deformation behavior of SnAgCu solder during ageing is explained by developing a hybrid multi-scale microstructure-based modeling approach. Herein, the SnAgCu solder alloy is seen as a three phase metal matrix composite in which Ag{sub 3}Sn and Cu{sub 6}Sn{sub 5} hard intermetallics play the role of reinforcements and Sn the role of a ductile matrix. The hardening of the Sn matrix due to fine intermetallics in the eutectic mixture is modeled by incorporating the mean field effects of geometrically necessary dislocations. Subsequently, a two level homogenization procedure based on micromechanical finite element (FE) models is used to capture the interactions between the different phases. For this purpose, tomographic images of microstructures obtained by Focused Ion Beam (FIB) and synchrotron X-Ray in different ageing conditions are directly used to generate statistically representative volume elements (RVE) using 3D FE models. The constitutive behavior of the solder is determined by sequentially performing two scales of numerical homogenization at the eutectic level and then at the dendrite level. For simplification, the anisotropy of Sn as well as the potential recovery processes have been neglected in the modeling. The observed decrease in the yield strength of solder due to ageing is well captured by the adopted modeling strategy and allows explaining the different ageing mechanisms. Finally, the effects of potential debonding at the intermetallic particle-matrix interface as well as particle fracture on the overall strength of solder are

  2. Microstructural effects on constitutive and fatigue fracture behavior of TinSilverCopper solder

    Science.gov (United States)

    Tucker, Jonathon P.

    -contaminated SnAgCu solder alloys ranging from the traditional time-hardening creep model to the viscoplastic Anand model are described. The second focus of the thesis is on fatigue damage accumulation in SnAgCu solder alloys. While, typical fatigue fracture models are empirical, recently a non-empirical model termed Maximum Entropy Fracture Model (MEFM) was proposed. MEFM is a thermodynamically consistent and information theory inspired damage accumulation theory for ductile solids. This model has been validated recently for Sn3.8Ag0.7Cu solder alloy, and uses a single damage accumulation parameter to relate the probability of fracture to accumulated entropic dissipation. Isothermal cycling fatigue tests on Sn3.0Ag0.5Cu and mixed SnPb/Sn3.0Ag0.5Cu solder alloys at varying strain rates and temperatures are conducted using a custom-built microscale mechanical tester capable of submicron displacement resolution. MEFM is applied here in conjunction with the Anand viscoplasticity model to predict the softening occurring over successive cycles as a result of damage accumulation. The damage accumulation parameters for Sn3.0Ag0.5Cu in different aged states are related to a microstructural parameter which quantitatively describes the state of coarsening. In addition, damage accumulation parameters for the three mixed solder alloys are reported. This approach allows for a non-empirical prediction of both constitutive and fracture behavior of packages of different geometries and different microstructural states under thermo-mechanical fatigue. Approaches to solder joint reliability predictions from materials science and mechanics perspectives differ dramatically. Materials science methods identify key failure mechanisms, but most models cannot predict failure. In contrast, mechanics approaches often provide estimates of joint lifetime, but fail to provide insight into microstructural influences. This work attempts to connect the two fields by relating constitutive behavior and fatigue

  3. Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn-Ag-Cu and Sn-Ag Solder Interconnects With and Without Board-Side Ni Surface Finish

    Science.gov (United States)

    Lee, Tae-Kyu; Duh, Jeng-Gong

    2014-11-01

    The combined effects on long-term reliability of isothermal aging and chemically balanced or unbalanced surface finish have been investigated for fine-pitch ball grid array packages with Sn-3.0Ag-0.5Cu (SAC305) (wt.%) and Sn-3.5Ag (SnAg) (wt.%) solder ball interconnects. Two different printed circuit board surface finishes were selected to compare the effects of chemically balanced and unbalanced structure interconnects with and without board-side Ni surface finish. NiAu/solder/Cu and NiAu/solder/NiAu interconnects were isothermally aged and thermally cycled to evaluate long-term thermal fatigue reliability. Weibull plots of the combined effects of each aging condition and each surface finish revealed lifetime for NiAu/SAC305/Cu was reduced by approximately 40% by aging at 150°C; less degradation was observed for NiAu/SAC305/NiAu. Further reduction of characteristic life-cycle number was observed for NiAu/SnAg/NiAu joints. Microstructure was studied, focusing on its evolution near the board and package-side interfaces. Different mechanisms of aging were apparent under the different joint configurations. Their effects on the fatigue life of solder joints are discussed.

  4. Thermomechanical behavior of tin-rich (lead-free) solders

    Science.gov (United States)

    Sidhu, Rajen Singh

    In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local

  5. Mechanical Behaviour of Bolted Joints Under Impact Rates of Loading

    Science.gov (United States)

    2012-01-01

    M. (1995). Bearing Strength of Autoclave and oven cured kevlar / epoxy laminates under static and dynamic loading. Compostes, 451-456. Kretsis, G...Joints in Glass Fibre/ Epoxy Laminates. Composites, Volume 16. No 2. Kolsky, H. (1949). An Investigation of the Mechanical Properties of Materials at...elongating the pulse width. The responses are read by the strain gages bonded on the incident and transmission bar with Vishay AE-10 epoxy . The gages

  6. Mechanical characteristics of welded joints between different stainless steels grades

    Science.gov (United States)

    Topolska, S.; Łabanowski, J.

    2017-08-01

    Investigation of mechanical characteristics of welded joints is one of the most important tasks that allow determining their functional properties. Due to the very high, still rising, cost of some stainless steels it is justified, on economic grounds, welding austenitic stainless steel with steels that are corrosion-resistant like duplex ones. According to forecasts the price of corrosion resistant steels stil can increase by 26 ÷ 30%. For technical reasons welded joints require appropriate mechanical properties such as: tensile strength, bending, ductility, toughness, and resistance to aggressive media. Such joints are applied in the construction of chemical tankers, apparatus and chemical plants and power steam stations. Using the proper binder makes possible the welds directly between the elements of austenitic stainless steels and duplex ones. It causes that such joits behave satisfactorily in service in such areas like maritime constructions and steam and chemical plants. These steels have high mechanical properties such as: the yield strength, the tensile strength and the ductility as well as the resistance to general corrosion media. They are resistant to both pitting and stress corrosions. The relatively low cost of production of duplex steels, in comparison with standard austenitic steels, is inter alia, the result of a reduced amount of scarce and expensive Nickel, which is seen as a further advantage of these steels.

  7. Mechanical and physiological factors in knee joint contact mechanics

    DEFF Research Database (Denmark)

    Mølgaard, Carsten

    conservative treatment modalities also increases. The aim of this thesis was to 1) identify relationships between footwear and laterally wedged insoles in a healthy group, 2) to evaluate the mechanical and physiological factors of experimental pain when introducing a laterally wedged insoles to otherwise...... not to the level of healthy matched controls. In conclusion, although similar reductions can be achieved by choice of shoe design the difference between a neutral running shoe and Oxford leather shoes are similar in magnitude compared to the effect of lateral wedges in any type of shoe. Experimental pain does...... not seem to change the effect of lateral wedges independently. The knee adduction moment in patients 3-5 years after a medial arthroscopic partial meniscectomy was at a similar level to what is observed with advanced knee osteoarthritis. Therefore, laterally wedged insoles should be considered part...

  8. Bench for mechanical cleaning of circular welded joints

    International Nuclear Information System (INIS)

    Sklifasovskij, V.M.

    1986-01-01

    A special bench for weld reinforcement removal and mechanical cleaning of the heat affected zones was designed to provide for a possibility of an ultrasonic testing of welded joints in the course of steam generator section fabrication. The bench comprises a mechanized roller support for fixing and rotating the workpiece; a lap-cutting device for external machining; milling/grinding tractor for internal machining and a delivery table for tractor approach and departure. The bench performance and overall view are presented. The operation succession is described

  9. EFECTO DE LA ALTURA DEL MANGUITO EN UNIONES SOLDADAS EN CAÑERÍAS DE COBRE BUSHING HEIGHT EFFECT IN SOLDERED COPPER PIPE JOINTS

    Directory of Open Access Journals (Sweden)

    Víctor Carmona

    2006-12-01

    Full Text Available Se perforó un tubo de cobre de 28,6 mm de diámetro, por el proceso de taladrado por fluencia térmica (TFT. Se prepararon manguitos de diferentes alturas, haciendo un preperforado con brocas convencionales HSS de diferentes diámetros. Se seleccionaron manguitos de dos alturas diferentes. Se determinó la circularidad de la perforación. Se soldó un tubo cobre de ø 12,7 mm en forma perpendicular a un tubo de cobre de ø 28,6 mm y se determinó la resistencia a la tracción de la unión soldada, para lo cual se diseñó un dispositivo mecánico que fue adaptado en la máquina universal de ensayos. Se hicieron ensayos de microdureza y metalografía de la unión. Se concluyó que el manguito de menor altura es suficiente para que la unión alcance la máxima resistencia.Copper tubes were drilled with thermal flow drilling. Conventional HSS drills diameters were used to make pre drilling holes. Different height bushings were made. Two of the bushing heights were selected. The bushing circularity was measured. A ø 12,7 mm tube was welded perpendicularly on a ø 28,6 mm tube. A especial support device was designed and it was adapted to the Universal Test Machine, to determine the tensile stress of the brazing joint. The micro hardness and metallographic test were made in the brazing zone. As a conclusion the lower height bushing is enough to reach the maximum resistance.

  10. Effects of step rate manipulation on joint mechanics during running.

    Science.gov (United States)

    Heiderscheit, Bryan C; Chumanov, Elizabeth S; Michalski, Max P; Wille, Christa M; Ryan, Michael B

    2011-02-01

    the objective of this study was to characterize the biomechanical effects of step rate modification during running on the hip, knee, and ankle joints so as to evaluate a potential strategy to reduce lower extremity loading and risk for injury. three-dimensional kinematics and kinetics were recorded from 45 healthy recreational runners during treadmill running at constant speed under various step rate conditions (preferred, ± 5%, and ± 10%). We tested our primary hypothesis that a reduction in energy absorption by the lower extremity joints during the loading response would occur, primarily at the knee, when step rate was increased. less mechanical energy was absorbed at the knee (P running and may prove beneficial in the prevention and treatment of common running-related injuries.

  11. Mechanical Properties and Microstructure of Dissimilar Material Welded Joints

    Directory of Open Access Journals (Sweden)

    Ziewiec A.

    2014-10-01

    Full Text Available The paper presents results of the mechanical testing and the microstructure analysis of dissimilar welded joint of the R350HT steel and the high-manganese (Hadfield cast steel using Cr-Ni cast steel spacer. The simulation tests of the welded joint surface deformation were carried out. The macroscopic and microscopic investigation were made using light microscopy (LM and scanning electron microscopy (SEM. Content of the magnetic phase was measured using magnetoscope. The quantitative metallographic investigation was used for assessment of ferrite and martensite contents and X-ray diffraction phase analysis was carried out. The results showed that during cooling of the spacer after welding, the transformation of metastable austenite into martensite proceeded. In addition to work hardening, the phase transformation of austenite into martensite occurs during the process of the superficial deformation of the spacer while simulated exploitation. This leads to a substantial increase of hardness, and at the same time, causes the increase of wear resistance of the welded joints of crossovers.

  12. 2014 Joint Conference on Mechanical Design Engineering and Advanced Manufacturing

    CERN Document Server

    Daidie, Alain; Eynard, Benoit; Paredes, Manuel

    2016-01-01

    Covering key topics in the field such as technological innovation, human-centered sustainable engineering and manufacturing, and manufacture at a global scale in a virtual world, this book addresses both advanced techniques and industrial applications of key research in interactive design and manufacturing. Featuring the full papers presented at the 2014 Joint Conference on Mechanical Design Engineering and Advanced Manufacturing, which took place in June 2014 in Toulouse, France, it presents recent research and industrial success stories related to implementing interactive design and manufacturing solutions.

  13. The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

    Science.gov (United States)

    Jang, Guh-Yaw; Duh, Jenq-Gong

    2005-01-01

    The eutectic Sn-Ag solder alloy is one of the candidates for the Pb-free solder, and Sn-Pb solder alloys are still widely used in today’s electronic packages. In this tudy, the interfacial reaction in the eutectic Sn-Ag and Sn-Pb solder joints was investigated with an assembly of a solder/Ni/Cu/Ti/Si3N4/Si multilayer structures. In the Sn-3.5Ag solder joints reflowed at 260°C, only the (Ni1-x,Cux)3Sn4 intermetallic compound (IMC) formed at the solder/Ni interface. For the Sn-37Pb solder reflowed at 225°C for one to ten cycles, only the (Ni1-x,Cux)3Sn4 IMC formed between the solder and the Ni/Cu under-bump metallization (UBM). Nevertheless, the (Cu1-y,Niy)6Sn5 IMC was observed in joints reflowed at 245°C after five cycles and at 265°C after three cycles. With the aid of microstructure evolution, quantitative analysis, and elemental distribution between the solder and Ni/Cu UBM, it was revealed that Cu content in the solder near the solder/IMC interface played an important role in the formation of the (Cu1-y,Niy)6Sn5 IMC. In addition, the diffusion behavior of Cu in eutectic Sn-Ag and Sn-Pb solders with the Ni/Cu UBM were probed and discussed. The atomic flux of Cu diffused through Ni was evaluated by detailed quantitative analysis in an electron probe microanalyzer (EPMA). During reflow, the atomic flux of Cu was on the order of 1016-1017 atoms/cm2sec in both the eutectic Sn-Ag and Sn-Pb systems.

  14. Impact of mechanical heterogeneity on joint density in a welded ignimbrite

    Science.gov (United States)

    Soden, A. M.; Lunn, R. J.; Shipton, Z. K.

    2016-08-01

    Joints are conduits for groundwater, hydrocarbons and hydrothermal fluids. Robust fluid flow models rely on accurate characterisation of joint networks, in particular joint density. It is generally assumed that the predominant factor controlling joint density in layered stratigraphy is the thickness of the mechanical layer where the joints occur. Mechanical heterogeneity within the layer is considered a lesser influence on joint formation. We analysed the frequency and distribution of joints within a single 12-m thick ignimbrite layer to identify the controls on joint geometry and distribution. The observed joint distribution is not related to the thickness of the ignimbrite layer. Rather, joint initiation, propagation and termination are controlled by the shape, spatial distribution and mechanical properties of fiamme, which are present within the ignimbrite. The observations and analysis presented here demonstrate that models of joint distribution, particularly in thicker layers, that do not fully account for mechanical heterogeneity are likely to underestimate joint density, the spatial variability of joint distribution and the complex joint geometries that result. Consequently, we recommend that characterisation of a layer's compositional and material properties improves predictions of subsurface joint density in rock layers that are mechanically heterogeneous.

  15. Fracture-mechanical analysis of metal/ceramic composites for applications in high-temperature fuel cells (SOFC); Bruchmechanische Untersuchung von Metall/Keramik-Verbunsystemen fuer die Anwendung in der Hochtemperaturbrennstoffzelle (SOFC)

    Energy Technology Data Exchange (ETDEWEB)

    Kuhn, Bernd Josef

    2008-08-25

    The author investigated the deformation and damage behaviour of soldered ceramic/metal joints in SOFC stacks, using thermochemical methods. Methods for analyzing sandwich systems and for mechanical characterization of joints were adapted and modified in order to provide fundamental understanding of the mechanical properties of soldered joints. [German] In dieser Arbeit wurde das Verformungs- und Schaedigungsverhalten von Keramik/ Metall-Loetverbindungen fuer SOFC-Stacks thermomechanisch untersucht. Verfahren zur Analyse von Schichtsystemen und fuer die mechanische Charakterisierung von Fuegeverbindungen wurden adaptiert und weiterentwickelt, um zu einem grundlegenden Verstaendnis der mechanischen Eigenschaften von Loetverbindungen zu gelangen.

  16. Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys

    Science.gov (United States)

    Lis, Adrian; Nakanishi, Kohei; Matsuda, Tomoki; Sano, Tomokazu; Minagawa, Madoka; Okamoto, Masahide; Hirose, Akio

    2017-07-01

    Solder joints between leads and printed circuit boards in thin small outline packages were produced with conventional Sn1.0Ag0.7Cu (SAC107) and Sn3.0Ag0.7Cu (SAC305) solders as well as various solder alloys with gradually increasing amounts of Bi (up to 3.0 wt.%) and In (up to 1.0 wt.%) within the SAC107 base solder. The reliability of soldered leads in temperature cycle (TC) tests improved most with solder alloys containing both Bi (1.6 wt.%) and In (0.5 wt.%). Microindentation and electron probe microanalysis mappings revealed that the effect originates from a combination of solution and precipitation strengthening of the initial SAC alloy. The distribution of inelastic strain accumulation (ISA), as a measure for degradation, was determined in the solder joints by finite element calculations. It was shown that defects in the solder proximal to the lead (60-75 μm), which was underpinned by similar cracking characteristics along the lead-solder interface. The ISA was confirmed to be lower in SAC+Bi/In alloys owing to their enhanced elasto-plastic properties. Moreover, the addition of a thin Cu coating on the leads could improve the joint reliability, as suggested by the calculation of the ISA and the acceleration factor.

  17. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Fan Yang

    2016-01-01

    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  18. Study of Diffusion Barrier for Solder/ n-Type Bi2Te3 and Bonding Strength for p- and n-Type Thermoelectric Modules

    Science.gov (United States)

    Lin, Wen-Chih; Li, Ying-Sih; Wu, Albert T.

    2018-01-01

    This paper investigates the interfacial reaction between Sn and Sn3Ag0.5Cu (SAC305) solder on n-type Bi2Te3 thermoelectric material. An electroless Ni-P layer successfully suppressed the formation of porous SnTe intermetallic compound at the interface. The formation of the layers between Bi2Te3 and Ni-P indicates that Te is the dominant diffusing species. Shear tests were conducted on both Sn and SAC305 solder on n- and p-type Bi2Te3 with and without a Ni-P barrier layer. Without a Ni-P layer, porous SnTe would result in a more brittle fracture. A comparison of joint strength for n- and p-type thermoelectric modules is evaluated by the shear test. Adding a diffusion barrier increases the mechanical strength by 19.4% in n-type and 74.0% in p-type thermoelectric modules.

  19. Mechanical Behavior of Bio-inspired Model Suture Joints

    Science.gov (United States)

    Li, Yaning; Lin, Erica; Ortiz, Christine; Boyce, Mary

    2012-02-01

    Suture joints of varying degrees of geometric complexity are prevalent throughout nature as a means of joining structural elements while providing locally tailored mechanical performance. Here, micromechanical models of general trapezoidal waveforms of varying hierarchy are formulated to reveal the role of geometric complexity in governing stiffness, strength, toughness and corresponding deformation and failure mechanisms. Physical constructs of model composite suture systems are fabricated via multi-material 3D printing (Object Connex500). Tensile tests are conducted on samples covering a range in geometry, thus providing quantitative measures of stiffness, strength, and failure. The experiments include direct visualization of the deformation and failure mechanisms and their progression, as well as their dependence on suture geometry, showing the interplay between shear and tension/compression of the interfacial layers and tension of the skeletal teeth and the transition in failure modes with geometry. The results provide quantitative guidelines for the design and tailoring of suture geometry to achieve the desired mechanical properties and also facilitate understanding of suture growth and fusion, and evolutionary phenotype.

  20. Characterization of the microstructure of tin-silver lead free solder

    Energy Technology Data Exchange (ETDEWEB)

    Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

    2016-07-05

    Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

  1. International Joint Conference on Mechanics, Design Engineering & Advanced Manufacturing

    CERN Document Server

    Nigrelli, Vincenzo; Oliveri, Salvatore; Peris-Fajarnes, Guillermo; Rizzuti, Sergio

    2017-01-01

    This book gathers papers presented at the International Joint Conference on Mechanics, Design Engineering and Advanced Manufacturing (JCM 2016), held on 14-16 September, 2016, in Catania, Italy. It reports on cutting-edge topics in product design and manufacturing, such as industrial methods for integrated product and process design; innovative design; and computer-aided design. Further topics covered include virtual simulation and reverse engineering; additive manufacturing; product manufacturing; engineering methods in medicine and education; representation techniques; and nautical, aeronautics and aerospace design and modeling. The book is divided into eight main sections, reflecting the focus and primary themes of the conference. The contributions presented here will not only provide researchers, engineers and experts in a range of industrial engineering subfields with extensive information to support their daily work; they are also intended to stimulate new research directions, advanced applications of t...

  2. Effects of rework on adhesion of Pb-In soldered gold thick films

    International Nuclear Information System (INIS)

    Gehman, R.W.; Becka, G.A.; Losure, J.A.

    1982-02-01

    The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au 9 In 4 . It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing

  3. Experimental measurement and modeling analysis on mechanical properties of incudostapedial joint.

    Science.gov (United States)

    Zhang, Xiangming; Gan, Rong Z

    2011-10-01

    The incudostapedial (IS) joint between the incus and stapes is a synovial joint consisting of joint capsule, cartilage, and synovial fluid. The mechanical properties of the IS joint directly affect the middle ear transfer function for sound transmission. However, due to the complexity and small size of the joint, the mechanical properties of the IS joint have not been reported in the literature. In this paper, we report our current study on mechanical properties of human IS joint using both experimental measurement and finite element (FE) modeling analysis. Eight IS joint samples with the incus and stapes attached were harvested from human cadaver temporal bones. Tension, compression, stress relaxation and failure tests were performed on those samples in a micro-material testing system. An analytical approach with the hyperelastic Ogden model and a 3D FE model of the IS joint including the cartilage, joint capsule, and synovial fluid were employed to derive mechanical parameters of the IS joint. The comparison of measurements and modeling results reveals the relationship between the mechanical properties and structure of the IS joint.

  4. Physical properties of lead free solders in liquid and solid state

    Energy Technology Data Exchange (ETDEWEB)

    Mhiaoui, Souad

    2007-04-17

    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  5. Mechanical properties and microstructure of model lead-free joints for electronics made with use of nanopowders

    Czech Academy of Sciences Publication Activity Database

    Buršík, Jiří; Buršíková, V.; Pešina, Z.; Sopoušek, J.

    2012-01-01

    Roč. 106, SI (2012), s390-s392 ISSN 0009-2770. [Local Mechanical Properties 2011. Olomouc, 09.11.2011-11.11.2011] R&D Projects: GA ČR(CZ) GA106/09/0700 Institutional research plan: CEZ:AV0Z20410507 Keywords : solder * silver nanopowdwer * nanoindentation Subject RIV: JG - Metallurgy Impact factor: 0.453, year: 2012

  6. Handbook of machine soldering SMT and TH

    CERN Document Server

    Woodgate, Ralph W

    1996-01-01

    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  7. Prediction of vibration characteristics of a planar mechanism having imperfect joints using neural network

    International Nuclear Information System (INIS)

    Erkaya, Selcuk

    2012-01-01

    Clearance is inevitable in the joints of mechanisms due primarily to the design, manufacturing and assembly processes or a wear effect. Excessive value of joint clearance plays a crucial role and has a significant effect on the kinematic and dynamic performances of the mechanism. In this study, effects of joint clearances on bearing vibrations of mechanism are investigated. An experimental test rig is set up, and a planar slider-crank mechanism having two imperfect joints with radial clearance is used as a model mechanism. Three accelerometers are positioned at different points to measure the bearing vibrations during the mechanism motion. For the different running speeds and clearance sizes, this work provides a neural model to predict and estimate the bearing vibrations of the mechanical systems having imperfect joints. The results show that radial basis function (RBF) neural network has a superior performance for predicting and estimating the vibration characteristics of the mechanical system

  8. Mechanical behavior of multipass welded joint during stress relief annealing

    International Nuclear Information System (INIS)

    Ueda, Yukio; Fukuda, Keiji; Nakacho, Keiji; Takahashi, Eiji; Sakamoto, Koichi.

    1978-01-01

    An investigation into mechanical behavior of a multipass welded joint of a pressure vessel during stress relief annealing was conducted. The study was performed theoretically and experimentally on idealized research models. In the theoretical analysis, the thermal elastic-plastic creep theory developed by the authors was applied. The behavior of multipass welded joints during the entire thermal cycle, from welding to stress relief annealing, was consistently analyzed by this theory. The results of the analysis show a good, fundamentally coincidence with the experimental findings. The outline of the results and conclusions is as follows. (1) In the case of the material (2 1/4Cr-1Mo steel) furnished in this study, the creep strain rate during stress relief annealing below 575 0 C obeys the strain-hardening creep law using the transient creep and the one above 575 0 C obeys the power creep law using the stational creep. (2) In the transverse residual stress (σsub(x)) distribution after annealing, the location of the largest tensile stress on the top surface is about 15 mm away from the toe of weld, and the largest at the cross section is just below the finishing bead. These features are similar to those of welding residual stresses. But the stress distribution after annealing is smoother than one from welding. (3) The effectiveness of stress relief annealing depends greatly on the annealing temperature. For example, most of residual stresses are relieved at the heating stage with a heating rate of 30 0 C/hr. to 100 0 C/hr. if the annealing temperature is 650 0 C, but if the annealing temperature is 550 0 C, the annealing is not effective even with a longer holding time. (4) In the case of multipass welding residual stresses studied in this paper, the behaviors of high stresses during annealing are approximated by ones during anisothermal relaxation. (auth.)

  9. Pressure brazing of ceramics to metals with copper solder

    International Nuclear Information System (INIS)

    Pavlova, M.A.; Metelkin, I.I.

    1986-01-01

    The effect on the quality of joints brazed with copper of different non metallized aluminooxide dielectrics with metals and alloys of a series of technological parameters (temperature, pressure, holding, and medium) in the course of pressure brazing is investigated. It is shown that in case of brazing with kovar and nickel the character of dependences is identical, however in all cases the joints with nickel are more durable. For the ceramics - molybdenum system characterized by weak interaction with copper solder kinetic dependences have no maximum and only under holding of more than 20 min the constant strength of 150-190 MPa is attained

  10. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Silva, Bismarck L., E-mail: bismarck_luiz@yahoo.com.br [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, 13083-860 Campinas, SP (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil)

    2016-04-15

    Low temperature soldering technology encompasses Sn–Bi based alloys as reference materials for joints since such alloys may be molten at temperatures less than 180 °C. Despite the relatively high strength of these alloys, segregation problems and low ductility are recognized as potential disadvantages. Thus, for low-temperature applications, Bi–Sn eutectic or near-eutectic compositions with or without additions of alloying elements are considered interesting possibilities. In this context, additions of third elements such as Cu and Ag may be an alternative in order to reach sounder solder joints. The length scale of the phases and their proportions are known to be the most important factors affecting the final wear, mechanical and corrosions properties of ternary Sn–Bi–(Cu,Ag) alloys. In spite of this promising outlook, studies emphasizing interrelations of microstructure features and solidification thermal parameters regarding these multicomponent alloys are rare in the literature. In the present investigation Sn–Bi–(Cu,Ag) alloys were directionally solidified (DS) under transient heat flow conditions. A complete characterization is performed including experimental cooling thermal parameters, segregation (XRF), optical and scanning electron microscopies, X-ray diffraction (XRD) and length scale of the microstructural phases. Experimental growth laws relating dendritic spacings to solidification thermal parameters have been proposed with emphasis on the effects of Ag and Cu. The theoretical predictions of the Rappaz-Boettinger model are shown to be slightly above the experimental scatter of secondary dendritic arm spacings for both ternary Sn–Bi–Cu and Sn–Bi–Ag alloys examined. - Highlights: • Dendritic growth prevailed for the ternary Sn–Bi–Cu and Sn–Bi–Ag solder alloys. • Bi precipitates within Sn-rich dendrites were shown to be unevenly distributed. • Morphology and preferential region for the Ag{sub 3}Sn growth depend on Ag

  11. Joint Implementation, Clean Development Mechanism and Tradable Permits

    Energy Technology Data Exchange (ETDEWEB)

    Nielsen, L.; Rose Olsen, K.

    2000-06-01

    This report deals with international environmental instruments aimed at a cost-effective reduction of greenhouse gas emissions. More precisely the instruments mentioned in the Kyoto Protocol, namely Joint Implementation (JI), the Clean Development Mechanism (CDM) and Tradable Permits (TP). The report describes the background for the international co-operation on reducing the greenhouse gases and the background for the instruments. How the instruments work in theory and what the practical problems may be. What agents' incentives are when they engage in JI or CDM, and how the initiation of the instruments can be organised. The institutional frameworks for JI, CDM and TP are discussed. The report describes how the Kyoto instruments and the Kyoto commitments interact with other instruments and describe distributive effects between countries. It is analysed how the use of CDM may influence the developing countries incentives to participate in the coalition of committed countries. In the concluding chapter some recommendations on the use of JI, TP and CDM are given. The recommendations are a kind of dialog with especially the Norwegian and Swedish reports on tradable permits. Some of the issues described in this main report are analysed in separate working papers. The working papers are collected in an appendix to the main report. (au)

  12. Joint Implementation, Clean Development Mechanism and Tradable Permits

    Energy Technology Data Exchange (ETDEWEB)

    Nielsen, L; Rose Olsen, K

    2000-06-01

    This report deals with international environmental instruments aimed at a cost-effective reduction of greenhouse gas emissions. More precisely the instruments mentioned in the Kyoto Protocol, namely Joint Implementation (JI), the Clean Development Mechanism (CDM) and Tradable Permits (TP). The report describes the background for the international co-operation on reducing the greenhouse gases and the background for the instruments. How the instruments work in theory and what the practical problems may be. What agents' incentives are when they engage in JI or CDM, and how the initiation of the instruments can be organised. The institutional frameworks for JI, CDM and TP are discussed. The report describes how the Kyoto instruments and the Kyoto commitments interact with other instruments and describe distributive effects between countries. It is analysed how the use of CDM may influence the developing countries incentives to participate in the coalition of committed countries. In the concluding chapter some recommendations on the use of JI, TP and CDM are given. The recommendations are a kind of dialog with especially the Norwegian and Swedish reports on tradable permits. Some of the issues described in this main report are analysed in separate working papers. The working papers are collected in an appendix to the main report. (au)

  13. Joint implementation: a pioneer mechanism within the limits of emissions - Climate study nr 33

    International Nuclear Information System (INIS)

    Shishlov, Igor; Bellassen, Valentin; Leguet, Benoit

    2012-02-01

    The authors first notice that much has been written about the Clean Development mechanism defined in the Kyoto protocol, but also that the Joint Implementation mechanism has an always increasing importance. Provided that always more countries would adopt greenhouse gas emissions thresholds and the Joint Implementation after the Durban conference, they analyse the Joint Implementation mechanism operation in comparison with the Clean Development mechanism. They address the economic and environmental background of the Joint Implementation. Then, they analyse quantitative aspects of this mechanism, develop a model for the assessment of the potential offer in carbon credits. They discuss the qualitative aspects of the Joint Implementation mechanism: environmental integrity, double accounting, perceived concurrence of national climate policies. Case studies are presented (Russia, Ukraine, France, EU, etc.)

  14. Study on interfacial reaction between lead-free solders and alternative surface finishes

    International Nuclear Information System (INIS)

    Siti Rabiatul Aisha; Ourdjini, A.; Saliza Osman

    2007-01-01

    This study investigates the interfacial reactions occurring during reflow soldering between Sn-Ag-Cu lead-free solder and two surface finishes: electroless nickel/ immersion gold (ENIG) and immersion silver (IAg). The study focuses on interfacial reactions evolution and growth kinetics of intermetallic compounds (IMC) formed during soldering and isothermal ageing at 150 degree Celsius for up to 2000 hours. Optical and scanning electron microscopy were used to measure IMC thickness and examine the morphology of IMC respectively, whereas the IMC phases were identified by energy dispersive X-ray analysis (EDX). The results showed that the IMC formed on ENIG finish is thinner compared to that formed on IAg finish. For IAg surface finish, Cu 6 Sn 5 IMCs with scallop morphology are formed at the solder/ surface finish interface after reflow while a second IMC, Cu 3 Sn was formed between the copper and Cu 6 Sn 5 IMC after the isothermal ageing treatment. For ENIG surface finish both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 are formed after soldering. Isothermal aging of the solder joints formed on ENIG finish was found to have a significant effect on the morphology of the intermetallics by transforming to more spherical and denser morphology in addition to increase i their thickness with increased ageing time. (author)

  15. Identification of Nonlinear Micron-Level Mechanics for a Precision Deployable Joint

    Science.gov (United States)

    Bullock, S. J.; Peterson, L. D.

    1994-01-01

    The experimental identification of micron-level nonlinear joint mechanics and dynamics for a pin-clevis joint used in a precision, adaptive, deployable space structure are investigated. The force-state mapping method is used to identify the behavior of the joint under a preload. The results of applying a single tension-compression cycle to the joint under a tensile preload are presented. The observed micron-level behavior is highly nonlinear and involves all six rigid body motion degrees-of-freedom of the joint. it is also suggests that at micron levels of motion modelling of the joint mechanics and dynamics must include the interactions between all internal components, such as the pin, bushings, and the joint node.

  16. Mechanical instability destabilises the ankle joint directly in the ankle-sprain mechanism.

    Science.gov (United States)

    Gehring, Dominic; Faschian, Katrin; Lauber, Benedikt; Lohrer, Heinz; Nauck, Tanja; Gollhofer, Albert

    2014-03-01

    Despite massive research efforts, it remains unclear how mechanical ankle instability (MAI) and functional ankle instability (FAI) affect joint control in the situation of ankle sprain. Thus, the purpose of this study was to evaluate whether individuals with MAI have deficits in stabilising their ankle joint in a close-to-injury situation compared with those with FAI and healthy controls. Ankle-joint control was assessed by means of three-dimensional motion analysis and electromyography in participants with FAI and MAI (n=19), in participants with pure FAI (n=9) and in healthy controls (n=18). Close-to-injury situations were simulated during standing, walking and jumping by means of a custom-made tilt platform. Individuals with FAI and MAI displayed significantly greater maximum ankle inversion angles (+5°) and inversion velocities (+50°/s) in the walking and jumping conditions compared to those with pure FAI and controls. Furthermore, individuals in the FAI and MAI group showed a significantly decreased pre-activation of the peroneus longus muscle during jumping compared to those with FAI. No differences between groups were found for plantar flexion and internal rotation, or for muscle activities following tilting of the platform. The present study demonstrates that MAI is characterised by impairments of ankle-joint control in close-to-injury situations. This could make these individuals more prone to recurrent ankle sprains, and suggests the need for additional mechanical support such as braces or even surgery. In addition, the study highlights the fact that dynamic experimental test conditions in the acting participant are needed to further unravel the mystery of chronic ankle instability.

  17. Spectroscopic investigation of oxidized solder surfaces

    International Nuclear Information System (INIS)

    Song, Jenn-Ming; Chang-Chien, Yu-Chien; Huang, Bo-Chang; Chen, Wei-Ting; Shie, Chi-Rung; Hsu, Chuang-Yao

    2011-01-01

    Highlights: → UV-visible spectroscopy is successfully used to evaluate the degree of discoloring of solders. → The surface oxides of solders can also be identified by UV-visible absorption spectra. → The discoloration of solder surface can be correlated with optical characterization of oxides. → A strategy against discoloring by alloying was also suggested. - Abstract: For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV-vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible region. A trace of P can effectively depress the discoloration of solders under both solid and semi-solid states through the suppression of SnO.

  18. Testing of the Structure and Mechanical Properties of Technical Titanium Joints

    Directory of Open Access Journals (Sweden)

    Bogumił Wronka

    2013-01-01

    Full Text Available The aim of the research was the titanium pipeline welding technology. The transformations of this material due to the influence of thermal welding were analysed. The basic purpose was to evaluate the properties of titanium joint areas. Pipe joints of various thicknesses were welded by means of TIG argon arc welding while applying the optimum and reduced gas flow intensities. The structure and mechanical properties of these joints were tested. Different test results were obtained for joints welded in these two conditions. Recommendations concerning the welding technology and the heat treatment of joints after welding were presented.

  19. Design and Evaluation of a Prosthetic Knee Joint Using the Geared Five-Bar Mechanism.

    Science.gov (United States)

    Sun, Yuanxi; Ge, Wenjie; Zheng, Jia; Dong, Dianbiao

    2015-11-01

    This paper presents the mechanical design, dynamics analysis and ankle trajectory analysis of a prosthetic knee joint using the geared five-bar mechanism. Compared with traditional four-bar or six-bar mechanisms, the geared five-bar mechanism is better at performing diverse movements and is easy to control. This prosthetic knee joint with the geared five-bar mechanism is capable of fine-tuning its relative instantaneous center of rotation and ankle trajectory. The centrode of this prosthetic knee joint, which is mechanically optimized according to the centrode of human knee joint, is better in the bionic performance than that of a prosthetic knee joint using the four-bar mechanism. Additionally, the stability control of this prosthetic knee joint during the swing and stance phase is achieved by a motor. By adjusting the gear ratio of this prosthetic knee joint, the ankle trajectories of both unilateral and bilateral amputees show less deviations from expected than that of the four-bar knee joint.

  20. Fabrication of high-quality brazed joints

    International Nuclear Information System (INIS)

    Orlov, A.V.

    1980-01-01

    Problem of ensuring of joint high-quality when brazing different parts in power engineering is considered. To obtain high-quality joints it is necessary to correctly design brazed joint and to choose a gap width, overlap length and fillet radius; to clean up carefully the surfaces to be brazed and fix them properly one relative to another; to apply a solder so as to provide its flowing into the gap and sticking in it; to exactly regulate thermal conditions of brazing. High quality and reliability of brazed joints are ensured by the application of solders based on noble metals, and cheap solders based on nickel, manganese and copper. Joints brazed with nickel base solders may operate at temperatures as high as 888 deg C

  1. Intra-articular pressures and joint mechanics: should we pay attention to effusion in knee osteoarthritis?

    Science.gov (United States)

    Rutherford, Derek James

    2014-09-01

    What factors play a role to ensure a knee joint does what it should given the demands of moving through the physical environment? This paper aims to probe the hypothesis that intra-articular joint pressures, once a topic of interest, have been left aside in contemporary frameworks in which we now view knee joint function. The focus on ligamentous deficiencies and the chondrocentric view of osteoarthritis, while important, have left little attention to the consideration of other factors that can impair joint function across the lifespan. Dynamic knee stability is required during every step we take. While there is much known about the role that passive structures and muscular activation play in maintaining a healthy knee joint, this framework does not account for the role that intra-articular joint pressures may have in providing joint stability during motion and how these factors interact. Joint injuries invariably result in some form of intra-articular fluid accumulation. Ultimately, it may be how the knee mechanically responds to this fluid, of which pressure plays a significant role that provides the mechanisms for continued function. Do joint pressures provide an important foundation for maintaining knee function? This hypothesis is unique and argues that we are missing an important piece of the puzzle when attempting to understand implications that joint injury and disease have for joint function. Copyright © 2014 Elsevier Ltd. All rights reserved.

  2. Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits

    Energy Technology Data Exchange (ETDEWEB)

    Huang, Y. T.; Hsu, H. H.; Wu, Albert T., E-mail: atwu@ncu.edu.tw [Department of Chemical and Materials Engineering, National Central University, Jhongli City 320, Taiwan (China)

    2014-01-21

    Because of the miniaturization of electronic devices, the reliability of electromigration has become a major concern when shrinking the solder dimensions in flip-chip joints. Fast reaction between solders and electrodes causes intermetallic compounds (IMCs) to form, which grow rapidly and occupy entire joints when solder volumes decrease. In this study, U-grooves were fabricated on Si chips as test vehicles. An electrode-solder-electrode sandwich structure was fabricated by using lithography and electroplating. Gaps exhibiting well-defined dimensions were filled with Sn3.5Ag solders. The gaps between the copper electrodes in the test sample were limited to less than 15 μm to simulate microbumps. The samples were stressed at various current densities at 100 °C, 125 °C, and 150 °C. The morphological changes of the IMCs were observed, and the dimensions of the IMCs were measured to determine the kinetic growth of IMCs. Therefore, this study focused on the influence of back stress caused by microstructural evolution in microbumps.

  3. Design of mechanical coxa joints based on three-degree-of-freedom spherical parallel manipulators

    International Nuclear Information System (INIS)

    Li, Yanbiao; Ji, Shiming; Wang, Zhongfei; Jin, Mingsheng; Liu, Yi; Jin, Zhenlin

    2013-01-01

    We addressed the issue of the design of mechanical coxa joints based on three-degree-of-freedom spherical parallel manipulators using the parameter statistics optimum method based on index atlases. The coxa joints have the advantages of high payload, high accuracy, and good technological efficiency. The first step of the design and prototyping used in this paper develops the direct and inverse displacement equations from the layout feature of the mechanical coxa joints. Then, the shapes of a constant-orientation workspace of the mechanical coxa joints are described, and the effects of the design parameters on the workspace volume are studied quantitatively. The next step deals with the graphical representation of the atlases that illustrates the relationship between performance evaluation index and design parameters based on the kinematics and torque analysis of the mechanical coxa joints. Finally, the geometric parameters of the coxa joints are obtained by the parameter statistics optimum method based on the index atlases. Considering assembly conditions, the design scheme of the mechanical coxa joints is developed, which provides a theoretical basis for the application of the mechanical coxa joints.

  4. Circuit reliability boosted by soldering pins of disconnect plugs to sockets

    Science.gov (United States)

    Pierce, W. B.

    1964-01-01

    Where disconnect pins must be used for wiring and testing a circuit, improved system reliability is obtained by making a permanent joint between pins and sockets of the disconnect plug. After the circuit has been tested, contact points may be fused through soldering, brazing, or welding.

  5. Reliable high-power diode lasers: thermo-mechanical fatigue aspects

    Science.gov (United States)

    Klumel, Genady; Gridish, Yaakov; Szafranek, Igor; Karni, Yoram

    2006-02-01

    High power water-cooled diode lasers are finding increasing demand in biomedical, cosmetic and industrial applications, where repetitive cw (continuous wave) and pulsed cw operation modes are required. When operating in such modes, the lasers experience numerous complete thermal cycles between "cold" heat sink temperature and the "hot" temperature typical of thermally equilibrated cw operation. It is clearly demonstrated that the main failure mechanism directly linked to repetitive cw operation is thermo-mechanical fatigue of the solder joints adjacent to the laser bars, especially when "soft" solders are used. Analyses of the bonding interfaces were carried out using scanning electron microscopy. It was observed that intermetallic compounds, formed already during the bonding process, lead to the solders fatigue both on the p- and n-side of the laser bar. Fatigue failure of solder joints in repetitive cw operation reduces useful lifetime of the stacks to hundreds hours, in comparison with more than 10,000 hours lifetime typically demonstrated in commonly adopted non-stop cw reliability testing programs. It is shown, that proper selection of package materials and solders, careful design of fatigue sensitive parts and burn-in screening in the hard pulse operation mode allow considerable increase of lifetime and reliability, without compromising the device efficiency, optical power density and compactness.

  6. Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E...... in a carbon matrix. Nanoscale soldering of multi-walled carbon nanotubes (MWNT) onto microelectrodes was achieved by deposition of a conducting gold line across a contact point between nanotube and electrode. The solderings were found to be mechanically stronger than the carbon nanotubes. We have positioned...... MWNTs to bridge the gap between two electrodes, and formed soldering bonds between the tube and each of the electrodes. All nanotube bridges showed ohmic resistances in the range 10-30 kΩ. We observed no increase in resistance after exposing the MWNT bridge to air for days....

  7. Compression-rate-dependent nonlinear mechanics of normal and impaired porcine knee joints.

    Science.gov (United States)

    Rodriguez, Marcel Leonardo; Li, LePing

    2017-11-14

    The knee joint performs mechanical functions with various loading and unloading processes. Past studies have focused on the kinematics and elastic response of the joint with less understanding of the rate-dependent load response associated with viscoelastic and poromechanical behaviors. Forty-five fresh porcine knee joints were used in the present study to determine the loading-rate-dependent force-compression relationship, creep and relaxation of normal, dehydrated and meniscectomized joints. The mechanical tests of all normal intact joints showed similar strong compression-rate-dependent behavior: for a given compression-magnitude up to 1.2 mm, the reaction force varied 6 times over compression rates. While the static response was essentially linear, the nonlinear behavior was boosted with the increased compression rate to approach the asymptote or limit at approximately 2 mm/s. On the other hand, the joint stiffness varied approximately 3 times over different joints, when accounting for the maturity and breed of the animals. Both a loss of joint hydration and a total meniscectomy greatly compromised the load support in the joint, resulting in a reduction of load support as much as 60% from the corresponding intact joint. However, the former only weakened the transient load support, but the latter also greatly weakened the equilibrium load support. A total meniscectomy did not diminish the compression-rate-dependence of the joint though. These findings are consistent with the fluid-pressurization loading mechanism, which may have a significant implication in the joint mechanical function and cartilage mechanobiology.

  8. Mechanical behaviour of Astm A 297 grade Hp joints welded using different processes

    International Nuclear Information System (INIS)

    Emygdio, Paulo Roberto Oliveira; Zeemann, Annelise; Almeida, Luiz Henrique de

    1996-01-01

    The influence of different arc welding processes on mechanical behaviour was studied for cast heat resistant stainless steel welded joints, in the as welded conditions. ASTM A 297 grade HP with niobium and niobium/titanium additions were welded following three different welding procedures, using shielded metal arc welding gas tungsten arc welding and plasma arc welding, in six welded joints. The welded joint mechanical behaviour was evaluated by ambient temperature and 870 deg C tensile tests; and creep tests at 900 deg C and 50 MPa. Mechanical test results showed that the welding procedure qualification following welding codes is not suitable for high temperature service applications. (author)

  9. Nano-soldering to single atomic layer

    Science.gov (United States)

    Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  10. Safer Soldering Guidelines and Instructional Resources

    Science.gov (United States)

    Love, Tyler S.; Tomlinson, Joel

    2018-01-01

    Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

  11. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  12. THE POSSIBILITY OF USING LASER-ULTRASOUND TO MONITOR THE QUALITY SOLDERED CONNECTIONS CHAMBERS OF LIQUID ROCKET ENGINES

    Directory of Open Access Journals (Sweden)

    N. V. Astredinova

    2014-01-01

    Full Text Available During the manufacturing process to the design of modern liquid rocket engines are presented important requirements, such as minimum weight, maximum stiffness and strength of nodes, maximum service life in operation, high reliability and quality of soldered and welded seams. Due to the high quality requirements soldered connections and the specific design of the nozzle, it became necessary in the development and testing of a new non-conventional non-destructive testing method – laser-ultrasound diagnosis. In accordance with regulatory guidelines, quality control soldered connections is allowed to use an acoustic kind of control methods of the reflected light, transmitted light, resonant, free vibration and acoustic emission. Attempts to use traditional methods of non-destructive testing did not lead to positive results. This is due primarily to the size of typical solder joint defects, as well as the structural features of the rocket engine, the data structure is not controllable. In connection with this, a new method that provides quality control soldered connections cameras LRE based on the thermo generation of ultrasound. Methods of ultrasonic flaw detection of photoacoustic effect, in most cases, have a number of advantages over methods that use standard (traditional piezo transducers. In the course of studies have found that the sensitivity of the laser-ultrasonic method and flaw detector UDL-2M can detect lack of adhesion in the solder joints on the upper edges of the nozzle in the sub-header area of the site.

  13. Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

    Science.gov (United States)

    Boesenberg, Adam J.; Anderson, Iver E.; Harringa, Joel L.

    2012-07-01

    Of Pb-free solder choices, an array of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic ( T eut = 217°C) composition have emerged with potential for broad use, including ball grid array (BGA) joints that cool slowly. This work investigated minor substitutional additions of Al (0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2- μm to 5- μm faceted Cu-Al particles, identified as Cu33Al17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness. Clustering of Cu33Al17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface. Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance.

  14. Effects of joint alignment and type on mechanical properties of thermoplastic articulated ankle-foot orthosis.

    Science.gov (United States)

    Gao, Fan; Carlton, William; Kapp, Susan

    2011-06-01

    Articulated or hinged ankle-foot orthosis (AFO) allow more range of motion. However, quantitative investigation on articulated AFO is still sparse. The objective of the study was to quantitatively investigate effects of alignment and joint types on mechanical properties of the thermoplastic articulated AFO. Tamarack dorsiflexion assist flexure joints with three durometers (75, 85 and 95) and free motion joint were tested. The AFO joint was aligned with the center of the motor shaft (surrogate ankle joint), 10 mm superior, inferior, anterior and posterior with respect to the motor shaft center. The AFO was passively moved from 20° plantar flexion to 15° dorsiflexion at a speed of 10°/s using a motorized device. Mechanical properties including index of hysteresis, passive resistance torque and quasi-static stiffness (at neutral, 5°, 10° and 15° in plantar flexion) were quantified. Significant effects of joint types and joint alignment on the mechanical properties of an articulated thermoplastic AFO were revealed. Specifically, center alignment showed minimum resistance and stiffness while anterior and posterior alignment showed significantly higher resistance and stiffness. The dorsiflexion assist torques at neutral position ranged from 0.69 ± 0.09 to 1.88 ± 0.10 Nm. Anterior and posterior alignment should be avoided as much as possible. The current study suggested that anterior and posterior alignment be avoided as much as possible in clinical practice due to potential skin irritation and increase in stress around the ankle joint.

  15. Influences of Shear History and Infilling on the Mechanical Characteristics and Acoustic Emissions of Joints

    Science.gov (United States)

    Meng, Fanzhen; Zhou, Hui; Wang, Zaiquan; Zhang, Liming; Kong, Liang; Li, Shaojun; Zhang, Chuanqing

    2017-08-01

    Filled joints, which are characterized by high deformability and low shear strength, are among the most critical discontinuities in rock mass and may be sheared repeatedly when subject to cyclic loading. Shear tests were carried out on tension splitting joints, with soil and granular cement mortar particles used as infillings, and the effects of the shear history on the mechanical behavior and acoustic emission (AE) of clean and filled joints were studied. The maximum strength in the subsequent shears was approximately 60% of the peak strength of the first shear for a clean joint, and the friction angle degraded from 63° to 45° after the first shear. The maximum shear strength of the filled joints was lower than 35% of the peak strength of the clean joint under the same normal stress. The change in the shear strength of filled joints with the number of shearing cycles was closely related to the transformation of the shear medium. Rolling friction occurred and the shear strength was low for the granular particle-filled joint, but the strength was elevated when the particles were crushed and sliding friction occurred. The AEs were significantly reduced during the second shear for the clean joint, and the peak AEs were mainly obtained at or near the turning point of the shear stress curve for the filled joint. The AEs were the highest for the cement particle-filled joint and lowest for the dry soil-filled joint; when subjected to repeated shears, the AEs were more complex because of the continuous changes to the shear medium. The evolution of the AEs with the shear displacement can accurately reflect the shear failure mechanism during a single shear process.

  16. Altered Tibiofemoral Joint Contact Mechanics and Kinematics in Patients with Knee Osteoarthritis and Episodic Complaints of Joint Instability

    Science.gov (United States)

    Farrokhi, Shawn; Voycheck, Carrie A.; Klatt, Brian A.; Gustafson, Jonathan A.; Tashman, Scott; Fitzgerald, G. Kelley

    2014-01-01

    Background To evaluate knee joint contact mechanics and kinematics during the loading response phase of downhill gait in knee osteoarthritis patients with self-reported instability. Methods Forty-three subjects, 11 with medial compartment knee osteoarthritis and self-reported instability (unstable), 7 with medial compartment knee osteoarthritis but no reports of instability (stable), and 25 without knee osteoarthritis or instability (control) underwent Dynamic Stereo X-ray analysis during a downhill gait task on a treadmill. Findings The medial compartment contact point excursions were longer in the unstable group compared to the stable (p=0.046) and the control groups (p=0.016). The peak medial compartment contact point velocity was also greater for the unstable group compared to the stable (p=0.047) and control groups (p=0.022). Additionally, the unstable group demonstrated a coupled movement pattern of knee extension and external rotation after heel contact which was different than the coupled motion of knee flexion and internal rotation demonstrated by stable and control groups. Interpretation Our findings suggest that knee joint contact mechanics and kinematics are altered during the loading response phase of downhill gait in knee osteoarthritis patients with self-reported instability. The observed longer medial compartment contact point excursions and higher velocities represent objective signs of mechanical instability that may place the arthritic knee joint at increased risk for disease progression. Further research is indicated to explore the clinical relevance of altered contact mechanics and kinematics during other common daily activities and to assess the efficacy of rehabilitation programs to improve altered joint biomechanics in knee osteoarthritis patients with self-reported instability. PMID:24856791

  17. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    Directory of Open Access Journals (Sweden)

    Enrico Mick

    2015-07-01

    Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

  18. Experimental Studies on the Mechanical Behaviour of Rock Joints with Various Openings

    Science.gov (United States)

    Li, Y.; Oh, J.; Mitra, R.; Hebblewhite, B.

    2016-03-01

    The mechanical behaviour of rough joints is markedly affected by the degree of joint opening. A systematic experimental study was conducted to investigate the effect of the initial opening on both normal and shear deformations of rock joints. Two types of joints with triangular asperities were produced in the laboratory and subjected to compression tests and direct shear tests with different initial opening values. The results showed that opened rock joints allow much greater normal closure and result in much lower normal stiffness. A semi-logarithmic law incorporating the degree of interlocking is proposed to describe the normal deformation of opened rock joints. The proposed equation agrees well with the experimental results. Additionally, the results of direct shear tests demonstrated that shear strength and dilation are reduced because of reduced involvement of and increased damage to asperities in the process of shearing. The results indicate that constitutive models of rock joints that consider the true asperity contact area can be used to predict shear resistance along opened rock joints. Because rock masses are loosened and rock joints become open after excavation, the model suggested in this study can be incorporated into numerical procedures such as finite-element or discrete-element methods. Use of the model could then increase the accuracy and reliability of stability predictions for rock masses under excavation.

  19. Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction

    Science.gov (United States)

    Takaku, Yoshikazu; Ohnuma, Ikuo; Kainuma, Ryosuke; Yamada, Yasushi; Yagi, Yuji; Nishibe, Yuji; Ishida, Kiyohito

    2006-11-01

    Bismuth and its alloys are candidates for Pb-free high-temperature solders that can be substituted for conventional Pb-rich Pb-Sn solders (melting point (mp) = 573 583 K). However, inferior properties such as brittleness and weak bonding strength should be improved for practical use. To that end, BiCu-X (X=Sb, Sn, and Zn) Pb-free high-temperature solders are proposed. Miscibility gaps in liquid BiCu-X alloys were surveyed using the thermodynamic database ADAMIS (alloy database for micro-solders), and compositions of the BiCu-X solders were designed on the basis of calculation. In-situ composite solders that consist of a Bi-base matrix with fine intermetallic compound (IMC) particles were produced by gas-atomizing and melt-spinning methods. The interfacial reaction between in-situ composite solders and Cu or Ni substrates was investigated. The IMCs at the interface formed a thin, uniform layer, which is an appropriate morphology for a reliable solder joint.

  20. How mechanical context and feedback jointly determine the use of mechanical variables in length perception by dynamic touch

    NARCIS (Netherlands)

    Menger, Rudmer; Withagen, Rob

    Earlier studies have revealed that both mechanical context and feedback determine what mechanical invariant is used to perceive length by dynamic touch. In the present article, the authors examined how these two factors jointly constrain the informational variable that is relied upon. Participants

  1. How mechanical context and feedback jointly determine the use of mechanical variables in length perception by dynamic touch

    NARCIS (Netherlands)

    Menger, Rudmer; Withagen, Rob

    2009-01-01

    Earlier studies have revealed that both mechanical context and feedback determine what mechanical invariant is used to perceive length by dynamic touch. In the present article, the authors examined how these two factors jointly constrain the informational variable that is relied upon. Participants

  2. Optimal parameters for laser tissue soldering

    Science.gov (United States)

    McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

    1998-07-01

    Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

  3. Contribution of facet joints, axial compression, and composition to human lumbar disc torsion mechanics.

    Science.gov (United States)

    Bezci, Semih E; Eleswarapu, Ananth; Klineberg, Eric O; O'Connell, Grace D

    2018-02-12

    Stresses applied to the spinal column are distributed between the intervertebral disc and facet joints. Structural and compositional changes alter stress distributions within the disc and between the disc and facet joints. These changes influence the mechanical properties of the disc joint, including its stiffness, range of motion, and energy absorption under quasi-static and dynamic loads. There have been few studies evaluating the role of facet joints in torsion. Furthermore, the relationship between biochemical composition and torsion mechanics is not well understood. Therefore, the first objective of this study was to investigate the role of facet joints in torsion mechanics of healthy and degenerated human lumbar discs under a wide range of compressive preloads. To achieve this, each disc was tested under four different compressive preloads (300-1200 N) with and without facet joints. The second objective was to develop a quantitative structure-function relationship between tissue composition and torsion mechanics. Facet joints have a significant contribution to disc torsional stiffness (∼60%) and viscoelasticity, regardless of the magnitude of axial compression. The findings from this study demonstrate that annulus fibrosus GAG content plays an important role in disc torsion mechanics. A decrease in GAG content with degeneration reduced torsion mechanics by more than an order of magnitude, while collagen content did not significantly influence disc torsion mechanics. The biochemical-mechanical and compression-torsion relationships reported in this study allow for better comparison between studies that use discs of varying levels of degeneration or testing protocols and provide important design criteria for biological repair strategies. © 2018 Orthopaedic Research Society. Published by Wiley Periodicals, Inc. J Orthop Res. © 2018 Orthopaedic Research Society. Published by Wiley Periodicals, Inc.

  4. Interfacial microstructure and mechanical properties of brazed aluminum / stainless steel - joints

    Science.gov (United States)

    Fedorov, V.; Elßner, M.; Uhlig, T.; Wagner, G.

    2017-03-01

    Due to the demand of mass and cost reduction, joints based on dissimilar metals become more and more interesting. Especially there is a high interest for joints between stainless steel and aluminum, often necessary for example for automotive heat exchangers. Brazing offers the possibilities to manufacture several joints in one step at, in comparison to fusion welding, lower temperatures. In the recent work, aluminum / stainless steel - joints are produced by induction brazing using an AlSi10 filler and a non-corrosive flux. The mechanical properties are determined by tensile shear tests as well as fatigue tests at ambient and elevated temperatures. The microstructure of the brazed joints and the fracture surfaces of the tested samples are investigated by SEM.

  5. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

    National Research Council Canada - National Science Library

    Reuse, Rolando

    2005-01-01

    .... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

  6. Evaluation of mechanical strength of the joints in JT-60 toroidal field coil conductors

    International Nuclear Information System (INIS)

    Nishio, Satoshi; Ohkubo, Monoru; Sasajima, Hiroshi

    1980-04-01

    Toroidal field (TF) coils of JT-60 produce a toroidal field of 45 kG at a plasma axis, they have an inner bore of 3.90 m and a weight of about 80 metric tons per coil. Eighteen TF coils are located around a torus axis at regular intervals. TF coil conductors are mostly jointed by high frequency induction brazing, the rest jointed by welding. In deciding the details of the jointing procedures, the conductor size and the requested mechanical strength are mainly taken into consideration. Described are non-destructive inspection methods for the brazed joints, strength evaluation, and the inspection criteria. Ultrasonic testing method is found to be the most effective in evaluation of mechanical properties of the brazed joints especially in terms of fatigue strength. In section 1, specifications of the TF coils are given. In section 2, the ultrasonic inspection method and the detectability of this apparatus are described in detail, the defects of known size are compared with the indication values and display figures. The apparatus developed for JT-60 is operated automatically also recording the inspectionresults. In section 3, mechanical strength of the brazed joints with initial defects is discussed on the basis of Fracture Mechanics theory and results of the fatigue crack growth test. The inspection criteria in accordance with the descriptions of section 2 and 3 are given in section 4. (author)

  7. Gradient material model in analysis of mechanical joints of CFRP laminate

    Science.gov (United States)

    Puchała, Krzysztof; ElŻbieta, Szymczyk; Jachimowicz, Jerzy; Bogusz, Paweł

    2018-01-01

    Mechanical joints (e.g. bolted) used for decades are proved to be reliable. They can be assembled and applied in very rough conditions since they are less sensitive to environmental effects than other types of joints (e.g. adhesive). Therefore, they are still employed in aircraft design. High specific stiffness and strength of composite materials (especially CFRP) cause a continuous increase in their usage in aircraft structures. In general, composites are brittle materials and more notch sensitive than metal alloys. Hole making is a necessary stage in manufacturing of a mechanical joint. Holes vicinities are the areas of high stress concentrations and determine load capability of the whole structure. Therefore, mechanical joints of composite parts require a special focus during both a designing and a manufacturing process. The aim of the paper is analysis of potential local material weakness/deterioration caused by a drilling process and its influence on the global response of a mechanical joint. The specimen in the form of a double-shear joint was analyzed. The weakened areas were identified on the basis of NDT ultrasonic analysis. A simple gradient material model was proposed to describe the hole vicinity. Numerical simulations were performed and compared to experimental results.

  8. The preparation and mechanical properties of carbon–carbon/lithium–aluminum–silicate composite joints

    International Nuclear Information System (INIS)

    Li, Ke-zhi; Wang, Jie; Ren, Xiao-bin; Li, He-jun; Li, Wei; Li, Zhao-qian

    2013-01-01

    Highlights: ► First study to join carbon cloth laminated C–C composites to LAS glass–ceramics. ► First study on the flexural property of C–C/LAS joints at different temperatures. ► The joint flexural strength at 800 °C can increase 14.1% than at room temperature. ► A quasi-ductile fracture behavior can be found in the C–C/LAS joints. -- Abstract: Silica carbide modified carbon cloth laminated C–C composites have been successfully joined to lithium–aluminum–silicate (LAS) glass–ceramics using magnesium–aluminum–silicate (MAS) glass–ceramics as interlayer by vacuum hot-press technique. The microstructure, mechanical properties and fracture mechanism of C–C/LAS composite joints were investigated. SiC coating modified the wettability between C–C composites and LAS glass–ceramics. Three continuous and homogenous interfaces (i.e. C–C/SiC, SiC/MAS and MAS/LAS) were formed by element interdiffusions and chemical reactions, which lead to a smooth transition from C–C composites to LAS glass–ceramics. The C–C/LAS joints have superior flexural property with a quasi-ductile behavior. The average flexural strength of C–C/LAS joints can be up to 140.26 MPa and 160.02 MPa at 25 °C and 800 °C, respectively. The average shear strength of C–C/LAS joints achieves 21.01 MPa and the joints are apt to fracture along the SiC/MAS interface. The high retention of mechanical properties at 800 °C makes the joints to be potentially used in a broad temperature range as structural components.

  9. Laser beam soldering of micro-optical components

    Science.gov (United States)

    Eberhardt, R.

    2003-05-01

    MOTIVATION Ongoing miniaturisation and higher requirements within optical assemblies and the processing of temperature sensitive components demands for innovative selective joining techniques. So far adhesive bonding has primarily been used to assemble and adjust hybrid micro optical systems. However, the properties of the organic polymers used for the adhesives limit the application of these systems. In fields of telecommunication and lithography, an enhancement of existing joining techniques is necessary to improve properties like humidity resistance, laserstability, UV-stability, thermal cycle reliability and life time reliability. Against this background laser beam soldering of optical components is a reasonable joining technology alternative. Properties like: - time and area restricted energy input - energy input can be controlled by the process temperature - direct and indirect heating of the components is possible - no mechanical contact between joining tool and components give good conditions to meet the requirements on a joining technology for sensitive optical components. Additionally to the laser soldering head, for the assembly of optical components it is necessary to include positioning units to adjust the position of the components with high accuracy before joining. Furthermore, suitable measurement methods to characterize the soldered assemblies (for instance in terms of position tolerances) need to be developed.

  10. Bio-mechanical Analysis of Human Joints and Extension of the Study to Robot

    OpenAIRE

    S. Parasuraman; Ler Shiaw Pei

    2008-01-01

    In this paper, the bio-mechanical analysis of human joints is carried out and the study is extended to the robot manipulator. This study will first focus on the kinematics of human arm which include the movement of each joint in shoulder, wrist, elbow and finger complexes. Those analyses are then extended to the design of a human robot manipulator. A simulator is built for Direct Kinematics and Inverse Kinematics of human arm. In the simulation of Direct Kinematics, the human joint angles can...

  11. Mechanical properties of dynamic diffusion bonded joints in a mild alloy steel

    International Nuclear Information System (INIS)

    Gomez de Salazar, J. M.; Urena, A.; Menendez, M.

    2001-01-01

    Mechanical properties in Dynamic Diffusion Bonded (DDB) in a A.S.T.M. 1045 steel (=.45%C) joints were studied. The thermomechanical cycle added to the process, favours both the initial deformation stage and probably the diffusion mechanisms which participate in bond formation. (Author) 11 refs

  12. Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

    Directory of Open Access Journals (Sweden)

    Soares D.

    2007-01-01

    Full Text Available Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layers. The effect of the addition of P, at low levels, on the chemical composition of the layers present at the interface was studied. The phases formed at the interface between the Cu or Ni substrate and a molten lead-free solder at 250ºC, were studied for different stage times and alloy compositions. The melting temperatures, of the studied alloys, were determined by Differential Scanning Calorimetry (DSC. Identification of equilibrium phases formed at the interface layer, and the evaluation of their chemical composition were performed by Scanning Electron Microscopy (SEM/EDS. Different interface characteristics were obtained, namely for the alloys containing Zn. The obtained IML layer thickness was compared, for both types of alloy systems.

  13. Mechanical behaviour of adhesive joint under tensile and shear loading

    NARCIS (Netherlands)

    Jiang, X.; Kolstein, M.H.; Bijlaard, F.S.K.

    2013-01-01

    Due to various advantages of Fibre-Reinforced Polymer (FRP) decks, the FRP to steel composite bridge system is being increasingly used in new bridge structures as well as rehabilitation projects for old bridges. This paper focuses on the mechanical behaviours and failure modes of the

  14. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Science.gov (United States)

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2004-10-01

    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  15. Mechanical testing of austenitic steel welded joints. Joint final report - Vol. 2

    International Nuclear Information System (INIS)

    Boerman, D.J.; Krischer, W.

    1990-01-01

    In the field of material properties and structural behaviour of LMFBR reactor components under normal operation and accident conditions, the Commission of the European Communities has promoted an experimental study on the mechanical properties of welded austenitic steel type AISI 316L. The study was launched in the frame of the Shared Cost Action (SCA) programme 1985-1987 on reactor safety. The research was performed in four European laboratories and coordinated by JRC-Ispra. Five different welding methods have been examined. The manufacture and characterization of the welds has been described in a separate report. The present report gives the results of four different mechanical tests carried out on the weld material. The comparison of results proved that, at the present state of development, the vacuum electron beam method seems to have clear advantages as compared with the other methods investigated

  16. Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

    Science.gov (United States)

    Teverovsky, Alexander A.

    2014-01-01

    Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

  17. Mechanism of rock shattering by explosions, depending on the nature of jointing and the elastic state

    Energy Technology Data Exchange (ETDEWEB)

    Mosinets, V N

    1966-01-01

    For proper use of explosives in shattering rock it is necessary to understand the mechanism of shattering. To a great extent this mechanism of shattering is controlled by fracturing in the rock and by the elastic properties of the rock. The processes of shattering as a result of explosion are analyzed, and the conclusion is made that, in its general interpretation, the mechanism of shattering is merely of theoretical interest. The applicability to actual media changes according to structure of the medium. Relatively massive rocks are characterized by an asymmetrical distribution function of the joints and micro-fractures and other inhomogeneities, the mode being shifted to the left of the asymmetry center. Rocks cut by an extensive network of microfractures and joints are characterized by an approximately normal distribution function; rocks cut by large joints have an asymmetrical distribution function, with the mode shifted to the right of the asymmetry center.

  18. Effect of process parameters on microstructure and mechanical properties of friction stir welded joints: A review

    Science.gov (United States)

    Wanare, S. P.; Kalyankar, V. D.

    2018-04-01

    Friction stir welding is emerging as a promising technique for joining of lighter metal alloys due to its several advantages over conventional fusion welding processes such as low thermal distortion, good mechanical properties, fine weld joint microstructure, etc. This review article mainly focuses on analysis of microstructure and mechanical properties of friction stir welded joints. Various microstructure characterization techniques used by previous researchers such as optical microscopes, x-ray diffraction, electron probe microscope, transmission electron microscope, scanning electron microscopes with electron back scattered diffraction, electron dispersive microscopy, etc. are thoroughly overviewed and their results are discussed. The effects of friction stir welding process parameters such as tool rotational speed, welding speed, tool plunge depth, axial force, tool shoulder diameter to tool pin diameter ratio, tool geometry etc. on microstructure and mechanical properties of welded joints are studied and critical observations are noted down. The microstructure examination carried out by previous researchers on various zones of welded joints such as weld zone, heat affected zone and base metal are studied and critical remarks have been presented. Mechanical performances of friction stir welded joints based on tensile test, micro-hardness test, etc. are discussed. This article includes exhaustive literature review of standard research articles which may become ready information for subsequent researchers to establish their line of action.

  19. An Approach for Impression Creep of Lead Free Microelectronic Solders

    Science.gov (United States)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  20. Microstructural Characteristics and Mechanical Properties of an Electron Beam-Welded Ti/Cu/Ni Joint

    Science.gov (United States)

    Zhang, Feng; Wang, Ting; Jiang, Siyuan; Zhang, Binggang; Feng, Jicai

    2018-05-01

    Electron beam welding experiments of TA15 titanium alloy to GH600 nickel superalloy with and without a copper sheet interlayer were carried out. Surface appearance, microstructure and phase constitution of the joint were examined by optical microscopy, scanning electron microscopy and x-ray diffraction analysis. Mechanical properties of Ti/Ni and Ti/Cu/Ni joint were evaluated based on tensile strength and microhardness tests. The results showed that cracking occurred in Ti/Ni electron beam weldment for the formation of brittle Ni-Ti intermetallics, while a crack-free electron beam-welded Ti/Ni joint can be obtained by using a copper sheet as filler metal. The addition of copper into the weld affected the welding metallurgical process of the electron beam-welded Ti/Ni joint significantly and was helpful for restraining the formation of Ti-Ni intermetallics in Ti/Ni joint. The microstructure of the weld was mainly characterized by a copper-based solid solution and Ti-Cu interfacial intermetallic compounds. Ti-Ni intermetallic compounds were almost entirely suppressed. The hardness of the weld zone was significantly lower than that of Ti/Ni joint, and the tensile strength of the joint can be up to 282 MPa.

  1. Experimental analysis of mechanical joints strength by means of energy dissipation

    Science.gov (United States)

    Wolf, Alexander; Lafarge, Remi; Kühn, Tino; Brosius, Alexander

    2018-05-01

    Designing complex structures with the demand for weight reduction leads directly to a multi-material concept. This mixture has to be joined securely and welding, mechanical joining and the usage of adhesives are commonly used for that purpose. Sometimes also a mix of at least two materials is useful to combine the individual advantages. The challenge is the non-destructive testing of these connections because destructive testing requires a lot of preparation and expensive testing equipment. The authors show a testing method by measuring and analysing the energy dissipation in mechanical joints. Known methods are radiography, thermography and ultrasound testing. Unfortunately, the usage of these methods is difficult and often not usable in fibre-reinforced-plastics. The presented approach measures the propagation of the elastic strain wave through the joint. A defined impact strain is detected with by strain-gauges whereby the transmitter is located on one side of the joint and the receiver on the other, respectively. Because of different mechanisms, energy dissipates by passing the joint areas. Main reasons are damping caused by friction and material specific damping. Insufficient performed joints lead to an effect especially in the friction damping. By the measurement of the different strains and the resulting energy loss a statement to the connection quality is given. The possible defect during the execution of the joint can be identified by the energy loss and strain vs. time curve. After the description of the method, the authors present the results of energy dissipation measurements at a bolted assembly with different locking torques. By the adjustable tightening torques for the screw connections easily a variation of the contact pressure can be applied and analysed afterwards. The outlook will give a statement for the usability for other mechanical joints and fibre-reinforced-plastics.

  2. From joint implementation to a clean development mechanism : Have the African positions changed?

    International Nuclear Information System (INIS)

    Thomas, J.P.

    1998-01-01

    The economic and political implications of the applications of the Kyoto United Nations Framework Conference on Climate Change for African developing nations were discussed. The concepts of joint implementation, clean development mechanism, and ecological implications were presented. Also discussed were the African positions on these matters, and on the mechanism of Article 12 of the Kyoto protocol (the Clean Development Mechanism). 19 refs., 1 tab

  3. Effect of the weld joint configuration on stressed components, residual stresses and mechanical properties

    Energy Technology Data Exchange (ETDEWEB)

    Cevik, Bekir; Oezer, Alpay; Oezcatalbas, Yusuf [Gazi Univ., Ankara (Turkey)

    2014-03-01

    The effect of the weld joint configuration on components has been studied, which are under service loads, under repair or construction and the residual stresses as well as the mechanical properties of the joint have been determined. For this purpose, a horizontal positioned tensile testing device and a semi-automatic MIG welding machine have been used and then the weld joints of the plates were subjected to different elastic stresses. When the temperature of the joined elements decreased to room temperature, applied elastic stresses were released. By this means, the effects of the existing tensile stresses in the joined parts and the tensile stresses created by the welding processes were investigated. The tensile stresses occurring in the joined elements were determined by using the photo-elasticity analysis method and the hole-drilling method. Also, tensile-shear tests were applied in order to determine the effect of permanent tensile loads on the mechanical properties of the joint. Experimental results showed that the application of corner welded lap joints for components under tensile loading significantly decrease the shear strength and yielding capacities of the joint. (orig.)

  4. Self-reported knee joint instability is related to passive mechanical stiffness in medial knee osteoarthritis.

    Science.gov (United States)

    Creaby, Mark W; Wrigley, Tim V; Lim, Boon-Whatt; Hinman, Rana S; Bryant, Adam L; Bennell, Kim L

    2013-11-20

    Self-reported knee joint instability compromises function in individuals with medial knee osteoarthritis and may be related to impaired joint mechanics. The purpose of this study was to evaluate the relationship between self-reported instability and the passive varus-valgus mechanical behaviour of the medial osteoarthritis knee. Passive varus-valgus angular laxity and stiffness were assessed using a modified isokinetic dynamometer in 73 participants with medial tibiofemoral osteoarthritis. All participants self-reported the absence or presence of knee instability symptoms and the degree to which instability affected daily activity on a 6-point likert scale. Forward linear regression modelling identified a significant inverse relationship between passive mid-range knee stiffness and symptoms of knee instability (r = 0.27; P 0.05). Conceivably, a stiffer passive system may contribute toward greater joint stability during functional activities. Importantly however, net joint stiffness is influenced by both active and passive stiffness, and thus the active neuromuscular system may compensate for reduced passive stiffness in order to maintain joint stability. Future work is merited to examine the role of active stiffness in symptomatic joint stability.

  5. Assesment of influncing factors on mechanical and electrical properties of Al/Cu joints

    Science.gov (United States)

    Selvaraj, R. Meby; Hynes, N. Rajesh Jesudoss

    2018-05-01

    Joining of dissimilar materials opens up challenging opportunities in todays technology. Al/Cu weldments are used in applications that demands corrosion resistance, thermal and electrical conducting properties. In dissimilar joining mechanical and thermal properties result in large stress gradients during heating. The Al-Cu joints are lighter, cheaper and have conductivity equal to copper alloy. The main scope of this study is to assess the influencing factors of Al/Cu joints in mechanical and electrical properties. It includes the influence of the dilution between the base metals, influence of physical properties, influence of welding parameters, influence of filler metal, influence of heat treatment, and influence of electrical properties

  6. Microstructure and mechanical properties of resistance upset butt welded 304 austenitic stainless steel joints

    International Nuclear Information System (INIS)

    Sharifitabar, M.; Halvaee, A.; Khorshahian, S.

    2011-01-01

    Graphical abstract: Three different microstructural zones formed at different distances from the joint interface in resistance upset butt welding of 304 austenitic stainless steel. Highlights: → Evaluation of microstructure in resistance upset welding of 304 stainless steel. → Evaluation of welding parameters effects on mechanical properties of the joint. → Introducing the optimum welding condition for joining stainless steel bars. -- Abstract: Resistance upset welding (UW) is a widely used process for joining metal parts. In this process, current, time and upset pressure are three parameters that affect the quality of welded products. In the present research, resistance upset butt welding of 304 austenitic stainless steel and effect of welding power and upset pressure on microstructure, tensile strength and fatigue life of the joint were investigated. Microstructure of welds were studied using scanning electron microscopy (SEM). X-ray diffraction (XRD) analysis was used to distinguish the phase(s) that formed at the joint interface and in heat affected zone (HAZ). Energy dispersive spectroscopy (EDS) linked to the SEM was used to determine chemical composition of phases formed at the joint interface. Fatigue tests were performed using a pull-push fatigue test machine and the fatigue properties were analyzed drawing stress-number of cycles to failure (S-N) curves. Also tensile strength tests were performed. Finally tensile and fatigue fracture surfaces were studied by SEM. Results showed that there were three different microstructural zones at different distances from the joint interface and delta ferrite phase has formed in these regions. There was no precipitation of chromium carbide at the joint interface and in the HAZ. Tensile and fatigue strengths of the joint decreased with welding power. Increasing of upset pressure has also considerable influence on tensile strength of the joint. Fractography of fractured samples showed that formation of hot spots at

  7. Microstructure and failure mechanisms of refill friction stir spot welded 7075-T6 aluminum alloy joints

    International Nuclear Information System (INIS)

    Shen, Zhikang; Yang, Xinqi; Zhang, Zhaohua; Cui, Lei; Li, Tielong

    2013-01-01

    Highlights: ► There is a correlation between the void in the weld and the joint strength. ► The preferable mechanical properties can be obtained by lowering rotational speed. ► The alclad has an adverse effect on the mechanical properties. -- Abstract: In this paper, the microstructure and mechanical properties of 7075-T6 aluminum alloy joints joined by refill friction stir spot welding (RFSSW) were investigated. The keyhole was refilled successfully, and the microstructure of the weld exhibited variations in the grain sizes in the width and the thickness directions. There existed defects (hook, voids, bonding ligament, etc.) associated to the material flow in the weld. Mechanical properties of the joint have been investigated in terms of hardness and tensile/shear and cross-tension test, and the fracture mechanisms were observed by SEM (scanning electron microscope). The hardness profile of the weld exhibited a W-shaped appearance in the macroscopic level, which reached the minimum at the boundary of the sleeve and the clamping ring. The variation laws between tensile/shear and cross-tension strength and processing parameters were rather complicated. The void in the weld played an important role in determining the strength of the joint. On the whole, the preferable strength can be obtained at lower rotational speed. Shear fracture mode was observed under tensile–shear loadings, and nugget debonding, plug type fracture (on the upper sheet) and plug type fracture (on the lower sheet) modes were observed under cross-tension loadings. It was also observed that the main feature affecting the mechanical properties of the joint is the alclad between the upper and lower sheets and the connecting qualities between the stir zone and thermo-mechanically affected zone.

  8. The mechanical structure of the Joint European Torus

    International Nuclear Information System (INIS)

    Huguet, M.; Sonnerup, L.; Celentano, G.; Booth, J.; Raimondi, T.

    1976-01-01

    The JET mechanical structure is designed to resist with suitable stiffness the large azimuthal forces acting on the 32 toroidal field coils. Due to the limited space available the structure is designed as a thin closed shell giving a maximum torsional rigidity with a minimum of material thickness. Externally the structure consists of a thin shell surrounding the toroidal magnet. The shell is attached at top and bottom to two disc-shaped rings which are provided with side supports for the coils. Finally along the inner straight portion, the coils are supported by a grooved cylinder which is attached to the upper and lower rings. To facilitate assembly and maintenance the structure is divided into 8 identical sectors. Insulation gaps have been provided between sectors to reduce eddy current and allow for the penetration of the poloidal field through the structure. One of the major problems is the design of the connections between sectors. A combination of insulated bolts and keys has been provided to resist the very high shear loads. A three dimensional finite element code has been used to compute stresses and deformations. Photoelastic tests have been carried out in order to assess the design of critical areas. In particular, openings in the structure give rise to stress concentrations which can be made tolerable with a proper design of the hole rims

  9. A flip chip process based on electroplated solder bumps

    Science.gov (United States)

    Salonen, J.; Salmi, J.

    1994-01-01

    Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

  10. The Ageing Effect of Mechanical Joints on the Tyre/Joint Noises Monitored by a Control Vehicle Method without Traffic Disturbance

    Directory of Open Access Journals (Sweden)

    C. K. Wong

    2013-01-01

    Full Text Available This paper studies the ageing effect of mechanical joints reflecting from the tyre/joint impacting noise by measuring the vehicle structure-borne noise change. Field data is collected applying two measurement methods suitable for newly installed and existing old expansion joints. The measurement methodology is improved by designing and applying a trailer for equipment installation. The main advantage of this method is not to disturb existing traffic by lane closure for measurement. Field measurements were conducted regularly for a study period up to 16 months after new joint replacement to monitor the variation of the structure-borne noise change inside a test vehicle while passing through mechanical joints. Empirical relationship is developed based on the field data of the roadside airborne noise change and the vehicle structure-borne noise change. The roadside tyre/joint noises could be converted using calibrated empirical formula. Key result findings include the following. (1 The vehicle structure-borne noise change is found smallest during the 3rd–6th months even lower than that measured when a new joint is installed. The structure-borne noise change then keeps increasing afterwards till the end of the study period. (2 Similar observations are found in all study cases incorporating various mechanical joint types and test vehicle types.

  11. Modeling and simulating the neuromuscular mechanisms regulating ankle and knee joint stiffness during human locomotion.

    Science.gov (United States)

    Sartori, Massimo; Maculan, Marco; Pizzolato, Claudio; Reggiani, Monica; Farina, Dario

    2015-10-01

    This work presents an electrophysiologically and dynamically consistent musculoskeletal model to predict stiffness in the human ankle and knee joints as derived from the joints constituent biological tissues (i.e., the spanning musculotendon units). The modeling method we propose uses electromyography (EMG) recordings from 13 muscle groups to drive forward dynamic simulations of the human leg in five healthy subjects during overground walking and running. The EMG-driven musculoskeletal model estimates musculotendon and resulting joint stiffness that is consistent with experimental EMG data as well as with the experimental joint moments. This provides a framework that allows for the first time observing 1) the elastic interplay between the knee and ankle joints, 2) the individual muscle contribution to joint stiffness, and 3) the underlying co-contraction strategies. It provides a theoretical description of how stiffness modulates as a function of muscle activation, fiber contraction, and interacting tendon dynamics. Furthermore, it describes how this differs from currently available stiffness definitions, including quasi-stiffness and short-range stiffness. This work offers a theoretical and computational basis for describing and investigating the neuromuscular mechanisms underlying human locomotion. Copyright © 2015 the American Physiological Society.

  12. Stress analysis of fatigue cracks in mechanically fastened joints : An analytical and experimental investigation

    NARCIS (Netherlands)

    De Rijck, J.J.M.

    2005-01-01

    The two historical fuselage failures, Comet in 1954 and Aloha in 1988, illustrate that similar accidents must be avoided which requires a profound understanding of the fatigue mechanisms involved, including analytical models to predict the fatigue behavior of riveted joints of a fuselage structure.

  13. Estimation of the mechanical loading of the shoulder joint in daily conditions

    NARCIS (Netherlands)

    De Vries, W.H.K.

    2015-01-01

    The goal of this thesis is to assemble a method to estimate shoulder joint reaction forces, in daily conditions, based on long term collection of ambulatory measurable variables, to obtain the desired long term mechanical load profile of the shoulder. Chapter 2 examines, and discusses one of the

  14. The Effects of Load Carriage and Muscle Fatigue on Lower-Extremity Joint Mechanics

    Science.gov (United States)

    Wang, He; Frame, Jeff; Ozimek, Elicia; Leib, Daniel; Dugan, Eric L.

    2013-01-01

    Military personnel are commonly afflicted by lower-extremity overuse injuries. Load carriage and muscular fatigue are major stressors during military basic training. Purpose: To examine effects of load carriage and muscular fatigue on lower-extremity joint mechanics during walking. Method: Eighteen men performed the following tasks: unloaded…

  15. Mechanical Properties of Steel P92 Welded Joints Obtained By TIG Technology

    Science.gov (United States)

    Mohyla, P.; Havelka, L.; Schmidová, E.; Vontorová, J.

    2017-11-01

    Mechanical properties of P92 steel welded joints obtained using the TIG (141) technology have been studied upon post-welding heat treatment (PWHT). The microhardness, tensile strength, and impact toughness of metal in the weld and heat-affected zone are determined. The PWHT is shown to be obligatory.

  16. Current redistribution in cables made of insulated, soldered, or oxidized strands

    International Nuclear Information System (INIS)

    Turck, B.

    1979-07-01

    Current redistributions are compared in cables made of insulated strands, soldered, or oxidized strands and insulated strands with periodic joints. After discussing the different current redistributions in the cases of a rapidly changing current and a dc current, several particular situations are investigated: what happens if a strand is broken, or if a local normal zone appears that does not affect all the strands equally, the detection of this normal zone, and the influence of short circuits between strands

  17. Experimental Investigation on the Fatigue Mechanical Properties of Intermittently Jointed Rock Models Under Cyclic Uniaxial Compression with Different Loading Parameters

    Science.gov (United States)

    Liu, Yi; Dai, Feng; Dong, Lu; Xu, Nuwen; Feng, Peng

    2018-01-01

    Intermittently jointed rocks, widely existing in many mining and civil engineering structures, are quite susceptible to cyclic loading. Understanding the fatigue mechanism of jointed rocks is vital to the rational design and the long-term stability analysis of rock structures. In this study, the fatigue mechanical properties of synthetic jointed rock models under different cyclic conditions are systematically investigated in the laboratory, including four loading frequencies, four maximum stresses, and four amplitudes. Our experimental results reveal the influence of the three cyclic loading parameters on the mechanical properties of jointed rock models, regarding the fatigue deformation characteristics, the fatigue energy and damage evolution, and the fatigue failure and progressive failure behavior. Under lower loading frequency or higher maximum stress and amplitude, the jointed specimen is characterized by higher fatigue deformation moduli and higher dissipated hysteresis energy, resulting in higher cumulative damage and lower fatigue life. However, the fatigue failure modes of jointed specimens are independent of cyclic loading parameters; all tested jointed specimens exhibit a prominent tensile splitting failure mode. Three different crack coalescence patterns are classified between two adjacent joints. Furthermore, different from the progressive failure under static monotonic loading, the jointed rock specimens under cyclic compression fail more abruptly without evident preceding signs. The tensile cracks on the front surface of jointed specimens always initiate from the joint tips and then propagate at a certain angle with the joints toward the direction of maximum compression.

  18. Microstructure and mechanical performance of autogenously fibre laser beam welded Ti-6242 butt joints

    Energy Technology Data Exchange (ETDEWEB)

    Kashaev, Nikolai, E-mail: nikolai.kashaev@hzg.de; Pugachev, Dmitry; Ventzke, Volker; Fomin, Fedor; Burkhardt, Irmela; Enz, Josephin; Riekehr, Stefan

    2017-05-10

    This work deals with the effects of laser beam power, focus position and advance speed on the geometry, microstructure and mechanical properties such as the tensile strength and microhardness of autogenously fibre laser beam welded Ti-6Al-2Sn-4Zr-2Mo (denoted as Ti-6242) butt joints used for high temperature applications. The Ti-6242 sheet employed here is characterized by a globular (α+β) microstructure. Laser beam welded butt joints consisted of a martensitic fusion zone, inhomogeneous heat affected zones and equiaxed base materials. The microhardness increased from 330 HV 0.3 in base material to 430 HV 0.3 in fusion zone due to the martensitic transformation. Butt joints showed the base material level of strength in tensile test. The local increase in microhardness provided a shielding effect that protected the Ti-6242 butt joint against mechanical damage during the static tensile load test. The predicted critical total underfill depth that does not reduce the tensile strength of the weld was determined to be 25% of the specimen thickness. - Highlights: • Autogenous fibre LBW of Ti-6242 was successfully achieved. • Butt joints showed low levels of porosity and an appropriate seam geometry. • Base material level of strength achieved for tensile strength. • Predicted critical underfill depth is 25% of the specimen thickness.

  19. Effect of joint mechanism on vehicle redirectional capability of water-filled road safety barrier systems.

    Science.gov (United States)

    Thiyahuddin, M I; Thambiratnam, D P; Gu, Y T

    2014-10-01

    Portable water-filled barriers (PWFBs) are roadside appurtenances that prevent vehicles from penetrating into temporary construction zones on roadways. PWFBs are required to satisfy the strict regulations for vehicle re-direction in tests. However, many of the current PWFBs fail to re-direct the vehicle at high speeds due to the inability of the joints to provide appropriate stiffness. The joint mechanism hence plays a crucial role in the performance of a PWFB system at high speed impacts. This paper investigates the desired features of the joint mechanism in a PWFB system that can re-direct vehicles at high speeds, while limiting the lateral displacement to acceptable limits. A rectangular "wall" representative of a 30m long barrier system was modeled and a novel method of joining adjacent road barriers was introduced through appropriate pin-joint connections. The impact response of the barrier "wall" and the vehicle was obtained and the results show that a rotational stiffness of 3000kNm/rad at the joints seems to provide the desired features of the PWFB system to re-direct impacting vehicles and restrict the lateral deflection. These research findings will be useful to safety engineers and road barrier designers in developing a new generation of PWFBs for increased road safety. Copyright © 2014 Elsevier Ltd. All rights reserved.

  20. Efforts to Develop a 300°C Solder

    Energy Technology Data Exchange (ETDEWEB)

    Norann, Randy A [Perma Works LLC

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  1. Generalised fracture mechanics approach to the interfacial failure analysis of a bonded steel-concrete joint

    Czech Academy of Sciences Publication Activity Database

    De Corte, W.; Helincks, P.; Boel, V.; Klusák, Jan; Seitl, Stanislav; De Schutter, G.

    2017-01-01

    Roč. 11, č. 42 (2017), s. 147-160 ISSN 1971-8993 R&D Projects: GA MŠk(CZ) LQ1601; GA ČR(CZ) GA16-18702S Institutional support: RVO:68081723 Keywords : Epoxy adhesive * Fracture mechanics * Interfacial properties * Numerical study * Push-out test * Steel-concrete joint Subject RIV: JL - Materials Fatigue, Friction Mechanics OBOR OECD: Audio engineering, reliability analysis

  2. Hyaluronan supplementation as a mechanical regulator of cartilage tissue development under joint-kinematic-mimicking loading.

    Science.gov (United States)

    Wu, Yabin; Stoddart, Martin J; Wuertz-Kozak, Karin; Grad, Sibylle; Alini, Mauro; Ferguson, Stephen J

    2017-08-01

    Articular cartilage plays an essential role in joint lubrication and impact absorption. Through this, the mechanical signals are coupled to the tissue's physiological response. Healthy synovial fluid has been shown to reduce and homogenize the shear stress acting on the cartilage surfaces due to its unique shear-thinning viscosity. As cartilage tissues are sensitive to mechanical changes in articulation, it was hypothesized that replacing the traditional culture medium with a healthy non-Newtonian lubricant could enhance tissue development in a cartilage engineering model, where joint-kinematic-mimicking mechanical loading is applied. Different amounts of hyaluronic acid were added to the culture medium to replicate the viscosities of synovial fluid at different health states. Hyaluronic acid supplementation, especially at a physiologically healthy concentration (2.0 mg ml -1 ), promoted a better preservation of chondrocyte phenotype. The ratio of collagen II to collagen I mRNA was 4.5 times that of the control group, implying better tissue development (however, with no significant difference of measured collagen II content), with a good retention of collagen II and proteoglycan in the mechanically active region. Simulating synovial fluid properties by hyaluronic acid supplementation created a favourable mechanical environment for mechanically loaded constructs. These findings may help in understanding the influence of joint articulation on tissue homeostasis, and moreover, improve methods for functional cartilage tissue engineering. © 2017 The Author(s).

  3. Experimental Investigation of the Influence of Joint Geometric Configurations on the Mechanical Properties of Intermittent Jointed Rock Models Under Cyclic Uniaxial Compression

    Science.gov (United States)

    Liu, Yi; Dai, Feng; Fan, Pengxian; Xu, Nuwen; Dong, Lu

    2017-06-01

    Intermittent joints in rock mass are quite sensitive to cyclic loading conditions. Understanding the fatigue mechanical properties of jointed rocks is beneficial for rational design and stability analysis of rock engineering projects. This study experimentally investigated the influences of joint geometry (i.e., dip angle, persistency, density and spacing) on the fatigue mechanism of synthetic jointed rock models. Our results revealed that the stress-strain curve of jointed rock under cyclic loadings is dominated by its curve under monotonic uniaxial loadings; the terminal strain in fatigue curve is equal to the post-peak strain corresponding to the maximum cyclic stress in the monotonic stress-strain curve. The four joint geometrical parameters studied significantly affect the fatigue properties of jointed rocks, including the irreversible strains, the fatigue deformation modulus, the energy evolution, the damage variable and the crack coalescence patterns. The higher the values of the geometrical parameters, the lower the elastic energy stores in this jointed rock, the higher the fatigue damage accumulates in the first few cycles, and the lower the fatigue life. The elastic energy has certain storage limitation, at which the fatigue failure occurs. Two basic micro-cracks, i.e., tensile wing crack and shear crack, are observed in cyclic loading and unloading tests, which are controlled principally by joint dip angle and persistency. In general, shear cracks only occur in the jointed rock with higher dip angle or higher persistency, and the jointed rock is characterized by lower fatigue strength, larger damage variable and lower fatigue life.

  4. Structure and Mechanical Properties of Friction Stir Weld Joints of Magnesium Alloy AZ31

    Science.gov (United States)

    Nagasawa, T.; Otsuka, M.; Yokota, T.; Ueki, T.

    The applicability of friction stir welding to hot rolled sheet of commercial magnesium alloy AZ31 plates has been investigated. Friction stir weld joint showed mechanical strength comparable to that of base material, though the ductility remained at one half of that of the latter. The results are consistent with the microstructure which is characterized by a fine grained bond layer bounded by-intermediate grained base metals. It is found that both anodizing treatment and insertion of aluminum foil between batting faces do not degrade the joint properties at all. The results suggest that friction stir welding can be potentially applied to magnesium alloy.

  5. Testing the permeability and corrosion resistance of micro-mechanically interlocked joints

    DEFF Research Database (Denmark)

    Byskov-Nielsen, Jeppe; Holm, Allan Hjarbæk; Højsholt, Rune

    2011-01-01

    Micro-mechanical interlocking (MMI) can be applied to create new and interesting composite materials. We have employed laser structuring to achieve MMI between stainless steel and plastic with extremely high joint strength. However, the water permeability and corrosion resistance of the joint must...... is conducted. The permeability seems to be consistent with the Hagen–Poiseuille equation independent of the laser structuring technique and is orders of magnitudes larger than the diffusion rate through the plastic. Two different types of corrosion tests have been undertaken, and we show that care must...... be taken in order not to degrade the corrosion resistance of the sample to an unacceptable level....

  6. The Role of Mechanical Connection during Friction Stir Keyholeless Spot Welding Joints of Dissimilar Materials

    Directory of Open Access Journals (Sweden)

    Xiao Liu

    2017-06-01

    Full Text Available Contrast experiments of lap joints among dissimilar AZ31B Mg alloy, Mg99.50, zinc-coated DP600 sheet, and non-zinc-coated DP600 sheet were made by friction stir keyholeless spot welding (FSKSW and vacuum diffusion welding (VDW, respectively. Scanning electron microscopy (SEM and energy disperse spectroscopy (EDS were used to investigate the microstructures and components of the joints welded. The experimental results show that the FSKSW bonding method is a kind of compound mode that contains a mechanical connection and element diffusion fusion connection, in which mechanical connection has the main decisive function on joints of Mg/steel. Elements diffusion exists in the interfacial region of the joints and the elements diffusion extent is basically the same to that of VDW. The elements’ diffusion in Mg/steel using FSKSW is defined in the reaction between small amounts elements of the base metal and zinc-coated metals. The intermetallic compounds and composite oxide perform some reinforcement on the mechanical connection strength.

  7. A Hodge dual for soldered bundles

    International Nuclear Information System (INIS)

    Lucas, Tiago Gribl; Pereira, J G

    2009-01-01

    In order to account for all possible contractions allowed by the presence of the solder form, a generalized Hodge dual is defined for the case of soldered bundles. Although for curvature the generalized dual coincides with the usual one, for torsion it gives a completely new dual definition. Starting from the standard form of a gauge Lagrangian for the translation group, the generalized Hodge dual yields precisely the Lagrangian of the teleparallel equivalent of general relativity, and consequently also the Einstein-Hilbert Lagrangian of general relativity

  8. Enhancement of mechanical properties and failure mechanism of electron beam welded 300M ultrahigh strength steel joints

    International Nuclear Information System (INIS)

    Zhang, Guodong; Yang, Xinqi; He, Xinlong; Li, Jinwei; Hu, Haichao

    2013-01-01

    Highlights: ► Normalizing at 970 °C plus quenching and tempering cannot refine the columnar grains. ► Ductility and toughness of conventional quenched and tempered joint are very low. ► An optimum combination of strength and ductility was obtained for the welded joints. ► Intergranular cracked columnar dendritic grains were found on the fracture surface. -- Abstract: In this study, four post-weld heat treatment (PWHT) schedules were selected to enhance the mechanical properties of electron beam welded 300M ultrahigh strength steel joints. The microstructure, mechanical properties and fractography of specimens under the four post-weld heat treatment (PWHT) conditions were investigated and also compared with the base metal (BM) specimens treated by conventional quenching and tempering (QT). Results of macro and microstructures indicate that all of the four PWHT procedures did not eliminate the coarse columnar dendritic grains in weld metal (WM). Whereas, the morphology of the weld centerline and the boundaries of the columnar dendritic grains in WM of weld joint specimens subjected to the PWHT procedure of normalizing at 970 °C for 1 h followed by conventional quenching and tempering (W-N2QT) are indistinct. The width of martensite lath in WM of W-N2QT is narrower than that of specimens subjected to other PWHT procedures. Experimental results indicate that the ductility and toughness of conventional quenched and tempered joints are very low compared with the BM specimens treated by conventional QT. However, the strength and impact toughness of the W-N2QT specimens are superior to those of the BM specimen treated by conventional QT, and the ductility is only slightly inferior to that of the latter.

  9. Study of failure mechanism of double-lap joints of steel to FRP by bolt and resin

    Directory of Open Access Journals (Sweden)

    Amir Hossein Zakeri

    2017-05-01

    Full Text Available In this study, the behavior of joints in two sides of steel coat which are screwed to the composite plate, and joints of two sides of compound steel coat (bolted and bonded to the composite plate has been studied. In the standards, distance of mechanical bolts from the edges and the distance of mechanical bolts from each other have been discussed. Different distances in the range of the standards determined for the distance of screws from edges and screws from each other. In this paper, the screw joints and the combined joints with different terminal distances for screws from the edges are modeled and studied. The results showed the basic effects of the terminal distance of the screw from the connection edges on the resistance and mechanism of break of screw joints. In combined joints, the terminal distance of the screw had trivial effects in the resistance and mechanism of joint break. In addition, overlap length of the connection elements on increase of joint resistance analyzed and studied. To do so, a combined joint with configuration of two steel plates and one CFRP/GFRP composite plates which were joined by two screws and adhesive layers with different overlap were modeled. The results showed the direct relationship between increase of overlap length and increase in resistance of the joint. Finally, a design guide to be used in practice was proposed.

  10. Strength and Failure Mechanism of Composite-Steel Adhesive Bond Single Lap Joints

    Directory of Open Access Journals (Sweden)

    Kai Wei

    2018-01-01

    Full Text Available Carbon fiber-reinforced plastics- (CFRP- steel single lap joints with regard to tensile loading with two levels of adhesives and four levels of overlap lengths were experimentally analyzed and numerically simulated. Both joint strength and failure mechanism were found to be highly dependent on adhesive type and overlap length. Joints with 7779 structural adhesive were more ductile and produced about 2-3 kN higher failure load than MA830 structural adhesive. Failure load with the two adhesives increased about 147 N and 176 N, respectively, with increasing 1 mm of the overlap length. Cohesion failure was observed in both types of adhesive joints. As the overlap length increased, interface failure appeared solely on the edge of the overlap in 7779 adhesive joints. Finite element analysis (FEA results revealed that peel and shear stress distributions were nonuniform, which were less severe as overlap length increased. Severe stress concentration was observed on the overlap edge, and shear failure of the adhesive was the main reason for the adhesive failure.

  11. Evaluation of the cryogenic mechanical properties of the insulation material for ITER Feeder superconducting joint

    Science.gov (United States)

    Wu, Zhixiong; Huang, Rongjin; Huang, ChuanJun; Yang, Yanfang; Huang, Xiongyi; Li, Laifeng

    2017-12-01

    The Glass-fiber reinforced plastic (GFRP) fabricated by the vacuum bag process was selected as the high voltage electrical insulation and mechanical support for the superconducting joints and the current leads for the ITER Feeder system. To evaluate the cryogenic mechanical properties of the GFRP, the mechanical properties such as the short beam strength (SBS), the tensile strength and the fatigue fracture strength after 30,000 cycles, were measured at 77K in this study. The results demonstrated that the GFRP met the design requirements of ITER.

  12. In-vivo degradation mechanism of Ti-6Al-4V hip joints

    DEFF Research Database (Denmark)

    Lomholt, Trine Colding; Pantleon, Karen; Somers, Marcel A. J.

    2011-01-01

    In-vivo exposed Ti-6Al-4V implants were investigated to determine the degradation mechanism occurring during the articulating movements of the hip joint in the human body. Failed implants were compared to Ti-6Al-4V samples, which were tested in the laboratory for their tribocorrosion performance....... The results strongly indicate that degradation of Ti-6Al-4V has occurred with the same mechanism for both the implants and the laboratory tested samples and, hence, block-on-ring tribocorrosion testing was found to be a useful tool for mimicking the degradation occurring in the body.The degradation mechanism...

  13. Microstructure and mechanical properties of the TIG welded joints of fusion CLAM steel

    Energy Technology Data Exchange (ETDEWEB)

    Jiang Zhizhong, E-mail: zhizhongjiang2006@yahoo.com.c [School of Materials Science and Engineering, University of Science and Technology Beijing, Xueyuan Road, Beijing 100083 (China); Ren Litian; Huang Jihua; Ju Xin; Wu Huibin [School of Materials Science and Engineering, University of Science and Technology Beijing, Xueyuan Road, Beijing 100083 (China); Huang Qunying; Wu Yican [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, Anhui 230031 (China)

    2010-12-15

    The CLAM steel plates were butt-welded through manual tungsten inert gas welding (TIG) process, and the following post-welding heat treatment (PWHT) at 740 {sup o}C for 1 h. The microstructure and mechanical properties of the welded joints were measured. The results show that both hardening and softening occur in the weld joints before PWHT, but the hardening is not removed completely in the weld metal and the fusion zone after PWHT. In as-welded condition, the microstructure of the weld metal is coarse lath martensite, and softened zone in heat-affected zone (HAZ) consists of a mixture of tempered martensite and ferrite. After PWHT, a lot of carbides precipitate at all zones in weld joints. The microstructure of softened zone transforms to tempered sorbite. Tensile strength of the weld metal is higher than that of HAZ and base metal regardless of PWHT. However, the weld metal has poor toughness without PWHT. The impact energy of the weld metal after PWHT reaches almost the same level as the base metal. So it is concluded that microstructure and mechanical properties of the CLAM steel welded joints can be improved by a reasonable PWHT.

  14. Characterization of Mechanical Properties and Residual Stress in API 5L X80 Steel Welded Joints

    Science.gov (United States)

    de Sousa Lins, Amilton; de Souza, Luís Felipe Guimarães; Fonseca, Maria Cindra

    2018-01-01

    The use of high-strength and low-alloy steels, high design factors and increasingly stringent safety requirements have increased the operating pressure levels and, consequently, the need for further studies to avoid and prevent premature pipe failure. To evaluate the possibility of improving productivity in manual arc welding of this type of steel, this work characterizes the mechanical properties and residual stresses in API 5L X80 steel welded joints using the SMAW and FCAW processes. The residual stresses were analyzed using x-ray diffraction with the sin2 ψ method at the top and root of the welded joints in the longitudinal and transverse directions of the weld bead. The mechanical properties of the welded joints by both processes were characterized in terms of tensile strength, impact toughness and Vickers microhardness in the welded and shot peening conditions. A predominantly compressive residual stress was found, and shot peening increased the tensile strength and impact toughness in both welded joints.

  15. Body mass index affects knee joint mechanics during gait differently with and without moderate knee osteoarthritis.

    Science.gov (United States)

    Harding, Graeme T; Hubley-Kozey, Cheryl L; Dunbar, Michael J; Stanish, William D; Astephen Wilson, Janie L

    2012-11-01

    Obesity is a highly cited risk factor for knee osteoarthritis (OA), but its role in knee OA pathogenesis and progression is not as clear. Excess weight may contribute to an increased mechanical burden and altered dynamic movement and loading patterns at the knee. The objective of this study was to examine the interacting role of moderate knee OA disease presence and obesity on knee joint mechanics during gait. Gait analysis was performed on 104 asymptomatic and 140 individuals with moderate knee OA. Each subject group was divided into three body mass categories based on body mass index (BMI): healthy weight (BMI30). Three-dimensional knee joint angles and net external knee joint moments were calculated and waveform principal component analysis (PCA) was applied to extract major patterns of variability from each. PC scores for major patterns were compared between groups using a two-factor ANOVA. Significant BMI main effects were found in the pattern of the knee adduction moment, the knee flexion moment, and the knee rotation moment during gait. Two interaction effects between moderate OA disease presence and BMI were also found that described different changes in the knee flexion moment and the knee flexion angle with increased BMI with and without knee OA. Our results suggest that increased BMI is associated with different changes in biomechanical patterns of the knee joint during gait depending on the presence of moderate knee OA. Copyright © 2012 Osteoarthritis Research Society International. Published by Elsevier Ltd. All rights reserved.

  16. Laser assisted soldering: microdroplet accumulation with a microjet device.

    Science.gov (United States)

    Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

    1998-01-01

    We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

  17. Laser solder welding of articular cartilage: tensile strength and chondrocyte viability.

    Science.gov (United States)

    Züger, B J; Ott, B; Mainil-Varlet, P; Schaffner, T; Clémence, J F; Weber, H P; Frenz, M

    2001-01-01

    The surgical treatment of full-thickness cartilage defects in the knee joint remains a therapeutic challenge. Recently, new techniques for articular cartilage transplantation, such as mosaicplasty, have become available for cartilage repair. The long-term success of these techniques, however, depends not only on the chondrocyte viability but also on a lateral integration of the implant. The goal of this study was to evaluate the feasibility of cartilage welding by using albumin solder that was dye-enhanced to allow coagulation with 808-nm laser diode irradiation. Conventional histology of light microscopy was compared with a viability staining to precisely determine the extent of thermal damage after laser welding. Indocyanine green (ICG) enhanced albumin solder (25% albumin, 0.5% HA, 0.1% ICG) was used for articular cartilage welding. For coagulation, the solder was irradiated through the cartilage implant by 808-nm laser light and the tensile strength of the weld was measured. Viability staining revealed a thermal damage of typically 500 m in depth at an irradiance of approximately 10 W/cm(2) for 8 seconds, whereas conventional histologies showed only half of the extent found by the viability test. Heat-bath investigations revealed a threshold temperature of minimum 54 degrees C for thermal damage of chondrocytes. Efficient cartilage bonding was obtained by using bovine albumin solder as adhesive. Maximum tensile strength of more than 10 N/cm(2) was achieved. Viability tests revealed that the thermal damage is much greater (up to twice) than expected after light microscopic characterization. This study shows the feasibility to strongly laser weld cartilage on cartilage by use of a dye-enhanced albumin solder. Possibilities to reduce the range of damage are suggested. Copyright 2001 Wiley-Liss, Inc.

  18. Microstructure and mechanical properties of laser-welded joints of TWIP and TRIP steels

    International Nuclear Information System (INIS)

    Mujica, L.; Weber, S.; Pinto, H.; Thomy, C.; Vollertsen, F.

    2010-01-01

    With the aim of investigating a laser-welded dissimilar joint of TWIP and TRIP steel sheets, the microstructure was characterized by means of OM, SEM, and EBSD to differentiate the fusion zone, heat-affected zone, and the base material. OIM was used to differentiate between ferritic, bainitic, and martensitic structures. Compositions were measured by means of optical emission spectrometry and EDX to evaluate the effect of manganese segregation. Microhardness measurements and tensile tests were performed to evaluate the mechanical properties of the joint. Residual stresses and XRD phase quantification were used to characterize the weld. Grain coarsening and martensitic areas were found in the fusion zone, and they had significant effects on the mechanical properties of the weld. The heat-affected zone of the TRIP steel and the corresponding base material showed considerable differences in the microstructure and properties.

  19. Predictive Modeling of Mechanical Properties of Welded Joints Based on Dynamic Fuzzy RBF Neural Network

    Directory of Open Access Journals (Sweden)

    ZHANG Yongzhi

    2016-10-01

    Full Text Available A dynamic fuzzy RBF neural network model was built to predict the mechanical properties of welded joints, and the purpose of the model was to overcome the shortcomings of static neural networks including structural identification, dynamic sample training and learning algorithm. The structure and parameters of the model are no longer head of default, dynamic adaptive adjustment in the training, suitable for dynamic sample data for learning, learning algorithm introduces hierarchical learning and fuzzy rule pruning strategy, to accelerate the training speed of model and make the model more compact. Simulation of the model was carried out by using three kinds of thickness and different process TC4 titanium alloy TIG welding test data. The results show that the model has higher prediction accuracy, which is suitable for predicting the mechanical properties of welded joints, and has opened up a new way for the on-line control of the welding process.

  20. Intelligent design of mechanical parameters of the joint in vehicle body concept design model

    Science.gov (United States)

    Hou, Wen-bin; Zhang, Hong-zhe; Hou, Da-jun; Hu, Ping

    2013-05-01

    In order to estimate the mechanical properties of the overall structure of the body accurately and quickly in conceptual design phase of the body, the beam and shell mixing elements was used to build simplified finite element model of the body. Through the BP neural network algorithm, the parameters of the mechanical property of joints element which had more affection on calculation accuracy were calculated and the joint finite element model based on the parameters was also constructed. The case shown that the method can improve the accuracy of the vehicle simulation results, while not too many design details were needed, which was fit to the demand in the vehicle body conceptual design phase.

  1. Evaluation of Microstructure and Mechanical Properties in Dissimilar Austenitic/Super Duplex Stainless Steel Joint

    Science.gov (United States)

    Rahmani, Mehdi; Eghlimi, Abbas; Shamanian, Morteza

    2014-10-01

    To study the effect of chemical composition on microstructural features and mechanical properties of dissimilar joints between super duplex and austenitic stainless steels, welding was attempted by gas tungsten arc welding process with a super duplex (ER2594) and an austenitic (ER309LMo) stainless steel filler metal. While the austenitic weld metal had vermicular delta ferrite within austenitic matrix, super duplex stainless steel was mainly comprised of allotriomorphic grain boundary and Widmanstätten side plate austenite morphologies in the ferrite matrix. Also the heat-affected zone of austenitic base metal comprised of large austenite grains with little amounts of ferrite, whereas a coarse-grained ferritic region was observed in the heat-affected zone of super duplex base metal. Although both welded joints showed acceptable mechanical properties, the hardness and impact strength of the weld metal produced using super duplex filler metal were found to be better than that obtained by austenitic filler metal.

  2. Microstructure and mechanical analysis of W/P91 steel HIP-joint with Ti interlayer

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Ji-chao [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, 230031 (China); Science Island Branch of Graduate School, University of Science & Technology of China, Hefei, 230031 (China); Wang, Wanjing, E-mail: wjwang@ipp.ac.cn [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, 230031 (China); Sun, Zhaoxuan; Wang, Xingli; Wei, Ran [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, 230031 (China); Science Island Branch of Graduate School, University of Science & Technology of China, Hefei, 230031 (China); Xie, Chunyi; Li, Qiang [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, 230031 (China); Luo, Guang-nan [Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, 230031 (China); Science Island Branch of Graduate School, University of Science & Technology of China, Hefei, 230031 (China); Hefei Center for Physical Science and Technology, Hefei, 230022 (China); Hefei Science Center of Chinese Academy of Sciences, Hefei, 230027 (China)

    2016-11-15

    Highlights: • W and P91 steel can be joined successfully using the Hot Isostatic Pressing (HIP) method with Ti interlayer. • The experiment was conducted at 760 °C below the P91 steel austenitizing temperature with the pressure 150 MPa for 4 h. • The residual stress concentration is responsible for the fracture of HIP joints under low joining temperature. • Low temperature can reduce the reaction products and improve the mechanical properties of W/Ti/P91 steel joints. - Abstract: W and P91 steel were joined by using the Hot Isostatic Pressing method with Ti interlayer, and the experiments were conducted at 760 °C. The mechanical property, bonding quality and interface microstructure were tested by the Torsion test, Non-Destructive Test, Scanning Electron Microscope and Nano-indentation test. The minimum shear strength of joints was 225 MPa and the failure occurred at the W/Ti interfaces. Metallographic analysis revealed good bonding quality across bonding lines. Almost no reaction products were found in the diffusion region and the Nano-indentation test demonstrated that the solid solution strengthening was caused by inter-diffusion in the diffusion zone. The effect of low joining temperature on reducing reaction products and improving mechanical properties of W/Ti/Steel diffusion bonding were investigated in this paper.

  3. Microstructure and mechanical analysis of W/P91 steel HIP-joint with Ti interlayer

    International Nuclear Information System (INIS)

    Wang, Ji-chao; Wang, Wanjing; Sun, Zhaoxuan; Wang, Xingli; Wei, Ran; Xie, Chunyi; Li, Qiang; Luo, Guang-nan

    2016-01-01

    Highlights: • W and P91 steel can be joined successfully using the Hot Isostatic Pressing (HIP) method with Ti interlayer. • The experiment was conducted at 760 °C below the P91 steel austenitizing temperature with the pressure 150 MPa for 4 h. • The residual stress concentration is responsible for the fracture of HIP joints under low joining temperature. • Low temperature can reduce the reaction products and improve the mechanical properties of W/Ti/P91 steel joints. - Abstract: W and P91 steel were joined by using the Hot Isostatic Pressing method with Ti interlayer, and the experiments were conducted at 760 °C. The mechanical property, bonding quality and interface microstructure were tested by the Torsion test, Non-Destructive Test, Scanning Electron Microscope and Nano-indentation test. The minimum shear strength of joints was 225 MPa and the failure occurred at the W/Ti interfaces. Metallographic analysis revealed good bonding quality across bonding lines. Almost no reaction products were found in the diffusion region and the Nano-indentation test demonstrated that the solid solution strengthening was caused by inter-diffusion in the diffusion zone. The effect of low joining temperature on reducing reaction products and improving mechanical properties of W/Ti/Steel diffusion bonding were investigated in this paper.

  4. A fully rotational joint underactuated finger mechanism and its kinematics analysis

    Directory of Open Access Journals (Sweden)

    Wu Licheng

    2016-09-01

    Full Text Available The characteristic features of underactuated finger are compact structure, large grasping force, and simple operation. It has a wide application prospect in the fields of industrial robot, humanoid robot, human artificial limb, and space robot. A new type of fully rotating joint linkage-based underactuated mechanism is proposed, and a new method based on the law of minimum resistance is presented to realize the equivalent mechanism at different contact conditions of the finger and the kinematical analysis based on the equivalent mechanism. The kinematic equations and the limit moving position of the mechanism are derived using the proposed method. Finally, the numerical simulation is carried out by MATLAB program. The correctness and effectiveness of the proposed method are verified. The simulation results show that the proposed mechanism has a large grasp space and can achieve good grasp trajectory.

  5. Tin-silver and tin-copper alloys for capillarity joining-soft soldering-of copper piping

    International Nuclear Information System (INIS)

    Duran, J.; Amo, J. M.; Duran, C. M.

    2001-01-01

    It is studied the influence of the type of alloy used as filling material on the defects of the soldering joints in copper piping installations, which induce the fluid leak of the systems. The different eutectic temperatures and solidus-liquidus ranges of these alloys, require the setting of the soldering heat input in each case to obtain the suitable capillarity features and alloying temperatures to achieve for the correct formation of the bonding. Most defects in the joints are demonstrated to be generated by bad dossification of thermal inputs, which led depending on the filler alloy used to variations in its fluidity that may produce penetration failures in the bonds or insufficient consistency for the filling of the joints. (Author) 7 refs

  6. Morphology, microstructure, and mechanical properties of laser-welded joints in GH909 alloy

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Chunming; Cai, Yuanzheng; Hu, Chongjing; Zhang, Xiong; Yan, Fei; Hu, Xiyuan [Huazhong University of Science and Technology, Wuhan (China)

    2017-05-15

    The experimental laser welding of GH909 alloy was conducted in this study. The morphology, microstructure, and mechanical properties of laser-welded joints were analyzed by scanning electron microscopy, energy diffraction spectroscopy, and other techniques. Results revealed that the microstructure of the welded joints mainly consisted of tiny cellular structures, dendritic structures, and equiaxed crystals. Pores appeared in the interdendritic regions because of the insufficient local feeding of molten metal during solidification. Nb segregation in the heat-affected zone caused liquation cracking, whereas C segregation further induced the formation of carbide precipitates along the grain boundaries during the welding thermal cycle. The instability of the keyhole significantly promoted the escape of the metal vapor/plasma from the hole; as a result, porosity defects formed in the weld. The average tensile strength of the test joints was 756 MPa, which is 93.1 % of that of the base metal. The average microhardness of the weld zone (250 HV) was higher than that of the GH909 alloy substrate (208 HV), peaking at 267 HV. Microcracks appeared along the grain boundaries, proving that the grain boundaries were the weakest areas in the joint.

  7. Microstructure and mechanical properties of electron beam welded dissimilar steel to Fe–Al alloy joints

    Energy Technology Data Exchange (ETDEWEB)

    Dinda, Soumitra Kumar; Basiruddin Sk, Md.; Roy, Gour Gopal [Department of Metallurgical and Materials Engineering, Indian Institute of Technology, Kharagpur (India); Srirangam, Prakash, E-mail: p.srirangam@warwick.ac.uk [Warwick Manufacturing Group (WMG), University of Warwick, Coventry CV4 7AL (United Kingdom)

    2016-11-20

    Electron beam welding (EBW) technique was used to perform dissimilar joining of plain carbon steel to Fe–7%Al alloy under three different weld conditions such as with beam oscillation, without beam oscillation and at higher welding speed. The effect of weld parameters on the microstructure and mechanical properties of dissimilar joints was studied using optical microscopy, SEM, EBSD, hardness, tensile and erichsen cup tests. Microstructure results show that the application of beam oscillation resulted in uniform and homogeneous microstructure compared to without beam oscillations and higher welding speed. Further, it was observed that weld microstructure changes from equiaxed to columnar grains depending on the weld speed. High weld speed results in columnar grain structure in the weld joint. Erichsen cup test results show that the application of beam oscillation results in excellent formability as compared to high weld speed. Tensile test results show no significant difference in strength properties in all three weld conditions, but the ductility was found to be highest for joints obtained with the application of weld beam oscillation as compared to without beam oscillation and high weld speed. This study shows that the application of beam oscillations plays an important role in improving the weld quality and performance of EBW dissimilar steel to Fe–Al joints.

  8. Finite element analysis of adanced composite structures containing mechanically fastened joints

    International Nuclear Information System (INIS)

    Baumann, E.

    1982-01-01

    Although the usual engineering practice is to ignore joint effects in finite element models of overall structures, there are times when the inclusion of fastener effects in a model is necessary for accurate analysis. This paper describes some simple but accurate methods for accommodating this modeling requirement. The approach involves correlation of test results from a few composite mechanically fastened joints with finite element analyses of joints. It is assumed that if the fastener actions in the test articles can be properly predicted by simple finite element techniques, then these same techniques can be applied to large overall structure models. During the course of this test-analysis effort it was determined that it is possible to obtain correct results for overall structure-joint analyses by using simple modeling concepts provided special care is employed. Also, some emphasis is given in this paper to the importance of properly reducing test data in order to obtain meaningful correlations with finite element analysis. Finally, for those interested, the appendix contains brief descriptions of the test results and failure modes explored in the test program. (orig.)

  9. Structural and mechanical properties of welded joints of reduced activation martensitic steels

    International Nuclear Information System (INIS)

    Filacchioni, G.; Montanari, R.; Tata, M.E.; Pilloni, L.

    2002-01-01

    Gas tungsten arc welding and electron beam welding methods were used to realise welding pools on plates of reduced activation martensitic steels. Structural and mechanical features of these simulated joints have been investigated in as-welded and post-welding heat-treated conditions. The research allowed to assess how each welding technique affects the original mechanical properties of materials and to find suitable post-welding heat treatments. This paper reports results from experimental activities on BATMAN II and F82H mod. steels carried out in the frame of the European Blanket Project - Structural Materials Program

  10. Thermo-mechanical properties and integrity of metallic interconnects in microelectronics

    Science.gov (United States)

    Ege, Efe Sinan

    In this dissertation, combined numerical (Finite Element Method) and experimental efforts were undertaken to study thermo-mechanical behavior in microelectronic devices. Interconnects, including chip-level metallization and package-level solder joints, are used to join many of the circuit parts in modern equipment. The dissertation is structured into six independent studies after the introductory chapter. The first two studies focus on thermo-mechanical fatigue of solder joints. Thermo-mechanical fatigue, in the form of damage along a microstructurally coarsened region in tin-lead solder, is analyzed along with the effects of intermetallic morphology. Also, lap-shear testing is modeled to characterize the joint and to investigate the validity of experimental data from different solder and substrate geometries. In the third study, the effects of pre-machined holes on strain localization and overall ductility in bulk eutectic tin-lead alloy is examined. Finite element analyses, taking into account the viscoplastic response, were carried out to provide a mechanistic rationale to corroborate the experimental findings. The fourth study concerns chip-level copper interconnects. Various combinations of oxide and polymer-based low-k dielectric schemes, with and without the thin barrier layers surrounding the Cu line, are considered. Attention is devoted to the thermal stress and strain fields and their dependency on material properties, geometry, and modeling details. This study is followed by a chapter on atomistics of interface-mediated plasticity in thin metallic films. The objective is to gain fundamental insight into the underlying mechanisms affecting the mechanical response of nanoscale thin films. The final study investigates the effect of microstructural heterogeneity on indentation response, for the purpose of raising awareness of the uncertainties involved in applying indentation techniques in probing mechanical properties of miniaturized devices.

  11. Virtual Agonist-antagonist Mechanisms Produce Biological Muscle-like Functions: An Application for Robot Joint Control

    DEFF Research Database (Denmark)

    Xiong, Xiaofeng; Wörgötter, Florentin; Manoonpong, Poramate

    2014-01-01

    Purpose – Biological muscles of animals have a surprising variety of functions, i.e., struts, springs, and brakes. According to this, the purpose of this paper is to apply virtual agonist-antagonist mechanisms to robot joint control allowing for muscle-like functions and variably compliant joint......, variably compliant joint motions can be produced without mechanically bulky and complex mechanisms or complex force/toque sensing at each joint. Moreover, through tuning the damping coefficient of the VAAM, the functions of the VAAM are comparable to biological muscles. Originality/value – The model (i.......e., VAAM) provides a way forward to emulate muscle-like functions that are comparable to those found in physiological experiments of biological muscles. Based on these muscle-like functions, the robotic joints can easily achieve variable compliance that does not require complex physical components...

  12. Development of Pb-Free Nanocomposite Solder Alloys

    Directory of Open Access Journals (Sweden)

    Animesh K. Basak

    2018-04-01

    Full Text Available As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1 Al2O3 or (2 Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys.

  13. Rhythm in joint action: psychological and neurophysiological mechanisms for real-time interpersonal coordination

    Science.gov (United States)

    Keller, Peter E.; Novembre, Giacomo; Hove, Michael J.

    2014-01-01

    Human interaction often requires simultaneous precision and flexibility in the coordination of rhythmic behaviour between individuals engaged in joint activity, for example, playing a musical duet or dancing with a partner. This review article addresses the psychological processes and brain mechanisms that enable such rhythmic interpersonal coordination. First, an overview is given of research on the cognitive-motor processes that enable individuals to represent joint action goals and to anticipate, attend and adapt to other's actions in real time. Second, the neurophysiological mechanisms that underpin rhythmic interpersonal coordination are sought in studies of sensorimotor and cognitive processes that play a role in the representation and integration of self- and other-related actions within and between individuals' brains. Finally, relationships between social–psychological factors and rhythmic interpersonal coordination are considered from two perspectives, one concerning how social-cognitive tendencies (e.g. empathy) affect coordination, and the other concerning how coordination affects interpersonal affiliation, trust and prosocial behaviour. Our review highlights musical ensemble performance as an ecologically valid yet readily controlled domain for investigating rhythm in joint action. PMID:25385772

  14. The mechanism of joint capsule thermal modification in an in-vitro sheep model.

    Science.gov (United States)

    Hayashi, K; Peters, D M; Thabit, G; Hecht, P; Vanderby, R; Fanton, G S; Markel, M D

    2000-01-01

    The purpose of this study was to understand the mechanism responsible for joint capsule shrinkage after nonablative laser application in an in-vitro sheep model. Femoropatellar joint capsular tissue specimens harvested from 20 adult sheep were treated with one of three power settings of a holmium:yttrium-aluminum-garnet laser or served as a control. Laser treatment significantly shortened the tissue and decreased tissue stiffness in all three laser groups, whereas failure strength was not altered significantly by laser treatment. Transmission electron microscopic examination showed swollen collagen fibrils and loss of membrane integrity of fibroblasts. A thermometric study revealed nonablative laser energy caused tissue temperature to rise in the range of 64 degrees C to 100 degrees C. Electrophoresis after trypsin digestion of the tissue revealed significant loss of distinct alpha bands of Type I collagen in laser treated samples, whereas alpha bands were present in laser treated tissue without trypsin digestion. The results of this study support the concept that the primary mechanism responsible for the effect of nonablative laser energy is thermal denaturation of collagen in joint capsular tissue associated with unwinding of the triple helical structure of the collagen molecule.

  15. Improving Mechanical Properties of PVPPA Welded Joints of 7075 Aluminum Alloy by PWHT

    Directory of Open Access Journals (Sweden)

    Guowei Li

    2018-03-01

    Full Text Available In this study, 7075 aluminum alloy with a thickness of 10 mm was successfully welded with no obvious defects by pulsed variable polarity plasma arc (PVPPA welding. The mechanical properties of PVPPA welded joints have been researched by post weld heat treatment (PWHT. The results indicate that the heat treatment strongly affects the mechanical properties of the welded joints. The tensile strength and the microhardness of the welded joints gradually improved with the increase of the solution temperature. With the increase of the solution time, the tensile strength, and microhardness first dramatically increased and then decreased slightly. The best tensile strength of 537.5 MPa and the microhardness of 143.7 HV were obtained after 490 °C × 80 min + 120 °C × 24 h, and the strength was nearly 91.2% of that of the parent metal, and increased about 35% compared with as-welded. The improvement of strength and microhardness was mainly due to the precipitation of η′ phase.

  16. Microstructural and Mechanical Characterization of Electron Beam Welded Joints of High Strength S960QL and Weldox 1300 Steel Grades

    Directory of Open Access Journals (Sweden)

    Błacha S.

    2017-06-01

    Full Text Available The paper shows the results of metallographic examination and mechanical properties of electron beam welded joints of quenched and tempered S960QL and Weldox 1300 steel grades. The aim of this study was to examine the feasibility of producing good quality electron beam welded joints without filler material.

  17. Yucca Mountain Project thermal and mechanical codes first benchmark exercise: Part 3, Jointed rock mass analysis

    International Nuclear Information System (INIS)

    Costin, L.S.; Bauer, S.J.

    1991-10-01

    Thermal and mechanical models for intact and jointed rock mass behavior are being developed, verified, and validated at Sandia National Laboratories for the Yucca Mountain Site Characterization Project. Benchmarking is an essential part of this effort and is one of the tools used to demonstrate verification of engineering software used to solve thermomechanical problems. This report presents the results of the third (and final) phase of the first thermomechanical benchmark exercise. In the first phase of this exercise, nonlinear heat conduction code were used to solve the thermal portion of the benchmark problem. The results from the thermal analysis were then used as input to the second and third phases of the exercise, which consisted of solving the structural portion of the benchmark problem. In the second phase of the exercise, a linear elastic rock mass model was used. In the third phase of the exercise, two different nonlinear jointed rock mass models were used to solve the thermostructural problem. Both models, the Sandia compliant joint model and the RE/SPEC joint empirical model, explicitly incorporate the effect of the joints on the response of the continuum. Three different structural codes, JAC, SANCHO, and SPECTROM-31, were used with the above models in the third phase of the study. Each model was implemented in two different codes so that direct comparisons of results from each model could be made. The results submitted by the participants showed that the finite element solutions using each model were in reasonable agreement. Some consistent differences between the solutions using the two different models were noted but are not considered important to verification of the codes. 9 refs., 18 figs., 8 tabs

  18. Glenoid labrum ossification and mechanical restriction of joint motion: extraosseous manifestations of melorheostosis

    International Nuclear Information System (INIS)

    Subhas, N.; Sundaram, M.; Recht, M.P.; Bauer, T.W.; Seitz, W.H.

    2008-01-01

    We report a case of a 47-year-old man who presented with progressive loss of motion and pain in the right shoulder. Radiographs of the shoulder demonstrated dense ossification in the glenoid and humeral head with extension into the periarticular soft tissues. CT and MRI scans confirmed the radiographic findings and also revealed ossification of the glenoid labrum. A radiographic diagnosis of melorheostosis, an uncommon benign sclerosing bone dysplasia, was made. Because of the patient's severe symptomatology, he underwent total shoulder arthroplasty. Histological analysis of the resected masses was consistent with melorheostosis with a few areas covered by a cartilage cap. This case illustrates several uncommon but important features of melorheostosis, including mechanical obstruction of joint motion requiring joint replacement, ossification of the glenoid labrum, and cartilage-covering portions of the intra-articular masses, not to be confused with cartilage-producing tumors. (orig.)

  19. Glenoid labrum ossification and mechanical restriction of joint motion: extraosseous manifestations of melorheostosis

    Energy Technology Data Exchange (ETDEWEB)

    Subhas, N.; Sundaram, M.; Recht, M.P. [Cleveland Clinic, Department of Diagnostic Radiology, Cleveland, OH (United States); Bauer, T.W. [Cleveland Clinic, Department of Anatomic Pathology, Cleveland, OH (United States); Seitz, W.H. [Cleveland Clinic, Department of Orthopaedic Surgery, Cleveland, OH (United States)

    2008-02-15

    We report a case of a 47-year-old man who presented with progressive loss of motion and pain in the right shoulder. Radiographs of the shoulder demonstrated dense ossification in the glenoid and humeral head with extension into the periarticular soft tissues. CT and MRI scans confirmed the radiographic findings and also revealed ossification of the glenoid labrum. A radiographic diagnosis of melorheostosis, an uncommon benign sclerosing bone dysplasia, was made. Because of the patient's severe symptomatology, he underwent total shoulder arthroplasty. Histological analysis of the resected masses was consistent with melorheostosis with a few areas covered by a cartilage cap. This case illustrates several uncommon but important features of melorheostosis, including mechanical obstruction of joint motion requiring joint replacement, ossification of the glenoid labrum, and cartilage-covering portions of the intra-articular masses, not to be confused with cartilage-producing tumors. (orig.)

  20. Glenoid labrum ossification and mechanical restriction of joint motion: extraosseous manifestations of melorheostosis.

    Science.gov (United States)

    Subhas, N; Sundaram, M; Bauer, T W; Seitz, W H; Recht, M P

    2008-02-01

    We report a case of a 47-year-old man who presented with progressive loss of motion and pain in the right shoulder. Radiographs of the shoulder demonstrated dense ossification in the glenoid and humeral head with extension into the periarticular soft tissues. CT and MRI scans confirmed the radiographic findings and also revealed ossification of the glenoid labrum. A radiographic diagnosis of melorheostosis, an uncommon benign sclerosing bone dysplasia, was made. Because of the patient's severe symptomatology, he underwent total shoulder arthroplasty. Histological analysis of the resected masses was consistent with melorheostosis with a few areas covered by a cartilage cap. This case illustrates several uncommon but important features of melorheostosis, including mechanical obstruction of joint motion requiring joint replacement, ossification of the glenoid labrum, and cartilage-covering portions of the intra-articular masses, not to be confused with cartilage-producing tumors.

  1. Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

    National Research Council Canada - National Science Library

    Chung, Kohn C

    2006-01-01

    .... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

  2. Tribology and total hip joint replacement: current concepts in mechanical simulation.

    Science.gov (United States)

    Affatato, S; Spinelli, M; Zavalloni, M; Mazzega-Fabbro, C; Viceconti, M

    2008-12-01

    Interest in the rheology and effects of interacting surfaces is as ancient as man. This subject can be represented by a recently coined word: tribology. This term is derived from the Greek word "tribos" and means the "science of rubbing". Friction, lubrication, and wear mechanism in the common English language means the precise field of interest of tribology. Wear of total hip prosthesis is a significant clinical problem that involves, nowadays, a too high a number of patients. In order to acquire further knowledge on the tribological phenomena that involve hip prosthesis wear tests are conducted on employed materials to extend lifetime of orthopaedic implants. The most basic type of test device is the material wear machine, however, a more advanced one may more accurately reproduce some of the in vivo conditions. Typically, these apparatus are called simulators, and, while there is no absolute definition of a joint simulator, its description as a mechanical rig used to test a joint replacement, under conditions approximating those occurring in the human body, is acceptable. Simulator tests, moreover, can be used to conduct accelerated protocols that replicate/simulate particularly extreme conditions, thus establishing the limits of performance for the material. Simulators vary in their level of sophistication and the international literature reveals many interpretations of the design of machines used for joint replacement testing. This paper aims to review the current state of the art of the hip joint simulators worldwide. This is specified through a schematic overview by describing, in particular, constructive solutions adopted to reproduce in vivo conditions. An exhaustive commentary on the evolution and actually existing simulation standards is proposed by the authors. The need of a shared protocol among research laboratories all over the world could lead to a consensus conference.

  3. Mechanical Simulation of the Extension and Flexion of the Elbow Joint in Rehabilitation

    Directory of Open Access Journals (Sweden)

    Iman Vahdat

    2013-01-01

    Full Text Available Objective: The goal of the present study was to improve the extension and flexion of the elbow joint for rehabilitation purposes, in terms of energy dissipation and of injuries caused by stress imposed on connective tissue by exercise equipments during force transfer , by investigation of viscoelastic property variations during change in speed of motion. Materials & Methods: A sample of five men without any previous neuromuscular impairment of the elbow joint was chosen by the BMI factor. The passive continuous motion test (CPM was performed by the CYBEX isokinetic system in the extension and flexion movements of the elbow joint of the left hand, at 4 different speeds (15, 45, 75 and120 Deg/s during 5 consecutive cycles at the range of motion of about 0 to 130 degrees. The experimental data was exported to the MATLAB software for analysis. In order to determine viscoelastic property effects and biomechanical parameters, we used a passive viscoelastic mechanical model constructed by 3 elements for simulation, and also we used the curve fitting method to derive the elastic and viscose coefficients for the model.,. Results: Results of experiments showed that by increasing the speed of motion, the value of work done, hysteresis and elastic coefficient increased and the value of viscose coefficient decreased. Also, it appeared that by increasing the speed of motion, the effect of viscose resistance on the passive torque curves increased. In addition, there was significant correlation between the action of the mechanical model and the action of the concerned limbs, during the movement. Conclusion: It was concluded that in order to improve motion and to reduce imposed risks and injuries to joints and limbs, rehabilitation exercises better be performed at lower speeds and with rehabilitation equipments supported by viscoelastic resistant force.

  4. Effects of the Heterogeneity in the Electron Beam Welded Joint on Mechanical Properties of Ti6Al4V Alloy

    Science.gov (United States)

    Liu, Jing; Gao, Xiao-Long; Zhang, Lin-Jie; Zhang, Jian-Xun

    2015-01-01

    The aim of this investigation was to evaluate the effect of microstructure heterogeneity on the tensile and low cycle fatigue properties of electron beam welded (EBW) Ti6Al4V sheets. To achieve this goal, the tensile and low cycle fatigue property in the EBW joints and base metal (BM) specimens is compared. During the tensile testing, digital image correlation technology was used to measure the plastic strain field evolution within the specimens. The experimental results showed that the tensile ductility and low cycle fatigue strength of EBW joints are lower than that of BM specimens, mainly because of the effect of microstructure heterogeneity of the welded joint. Moreover, the EBW joints exhibit the cyclic hardening behavior during low fatigue process, while BM specimens exhibit the cyclic softening behavior. Compared with the BM specimens with uniform microstructure, the heterogeneity of microstructure in the EBW joint is found to decrease the mechanical properties of welded joint.

  5. Effect of Solder Flux Residues on Corrosion of Electronics

    DEFF Research Database (Denmark)

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

    2009-01-01

    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... testing and use in the field, consequences and recommendations are given. Failures, caused by harsh[1] customer environments, are not covered in this paper....

  6. Mechanical characterization of PVA hydrogel to be used as artificial joint cartilage reinforced by irradiation techniques

    International Nuclear Information System (INIS)

    Bavaresco, Vanessa Petrilli; Zavaglia, Cecilia A.C.; Reis, Marcelo de Carvalho

    2002-01-01

    Crosslinked networks of polyvinyl alcohol (PVA) produced from PVA aqueous solution and induced by radiation has been recently developed, and their mechanical properties have been studied. These materials are too fragile to be useful for artificial joint cartilage applications, unless reinforced in some way. In this work, the mechanical resistance of PVA hydrogel produced by irradiation techniques was studied. Polyvinyl alcohol films from 15 and 20% w/w aqueous solutions were acetalized by immersing it in an acetalization bath containing aqueous formaldehyde, sulfuric acid and sodium sulfate anhydrous (60:50:300 g) at 60 deg C. The acetalized samples were irradiated (Dynamitron (E = 1,5 MeV)) with 25, 50, 75, 100 kGy doses. Hydrogel samples were characterized by indentation creep test and water swelling. The results obtained in this study suggest the improving of the mechanical properties of the hydrogel by the combination of acetalization and electron beam irradiation, without decreasing in the swelling properties. (author)

  7. Mechanical design assessments of structural components and auxiliaries of the Joint European Torus

    International Nuclear Information System (INIS)

    Sonnerup, L.

    1985-01-01

    The general design of the Joint European Torus (JET) is briefly described. The loads on its major structural components, at normal operation, and in cases of plasma instability and/or disruption, are discussed. The way these components have been assessed and optimised in relation to their loads is presented. A short account of mechanical design problems of auxiliary equipment is given. Finally, the state of operation of JET and its implications for the mechanical design at the time of the conference will be summarized. The mechanically most important components of the JET device are the support structure of the toroidal magnet, th vacuum vessel, the coils of the magnets and the pedestals supporting the weight of the torus. These components all participate in resisting and transmitting the primary forces during operation. (orig.)

  8. Mechanical design assessments of structural components and auxiliaries of the Joint European Torus

    International Nuclear Information System (INIS)

    Sonnerup, L.

    1986-01-01

    The general design of the Joint European Torus (JET) is briefly described. The loads on its major structural components, at normal operation, and in cases of plasma instability and/or disruption, are discussed. The way these components have been assessed and optimised in relation to their loads is presented. A short account of mechanical design problems of auxiliary equipment is given. Finally, the state of operation of JET and its implications for the mechanical design is summarized. The mechanically most important components of the JET device are the support structure of the toroidal magnet, the vacuum vessel, the coils of the magnets and the pedestals supporting the weight of the torus. These components all participate in resisting and transmitting the primary forces during operation. (orig.)

  9. Microstructure and Mechanical Properties of TIG Weld Joint of ZM5 Magnesium Alloy

    Directory of Open Access Journals (Sweden)

    QIN Ren-yao

    2016-06-01

    Full Text Available The ZM5 magnesium alloy plates were welded by TIG welding method. The microstructural characteristics and mechanical properties of ZM5 magnesium alloy joint were studied by optical microscopy, microhardness and tensile testers. The results show that the TIG weld joint of ZM5 magnesium alloy is composed of heat affected zone, partially melted zone and weld metal. The heat affected zone is consisted of primary α-Mg phase and eutectic phase that is composed of eutectic α-Mg and eutectic β-Mg17Al12 phase and mainly precipitated at grain boundaries. In the partially melted zone, the eutectic phase is not only increasingly precipitated at grain boundaries, but also dispersed in grains, and the growth of the β-Mg17Al12 phase is obviously observed. The microstructure in the weld is the typical dendritic morphology. The dendrites are considered as primary α-Mg phase, and the interdendritic regions are α+β eutectic phase. The difference in the microstructure of the heat affected zone, partially melted zone and weld results in their various microhardness values, and leads to the smaller tensile strength and ductility in the ZM5 alloy weld joint than parent metal.

  10. Influence of nanoporous structure on mechanical strength of aluminium and aluminium alloy adhesive structural joints

    International Nuclear Information System (INIS)

    Spadaro, C; Dispenza, C; Sunseri, C

    2006-01-01

    The influence of surface treatments on the mechanical strength of adhesive joints was investigated. The attention was focused on AA2024 alloy because it is extensively used in both the automotive and aerospace industries. Adhesive joints fabricated with pure aluminium were also investigated in order to evidence possible differences in the surface features after identical treatments. Before joining with a commercial epoxy adhesive, metal substrates were subjected to different kinds of treatment and the surfaces were characterized by SEM analysis. The formation of a microporous surface in the AA2024 alloy, upon etching and anodizing, is discussed on the basis of the role of the intermetallic particles and their electrochemical behaviour with respect to the aluminium matrix. Moreover, nanostructured porous oxide layers on both type of substrate were also formed, as a consequence of the anodizing process. Differences in their morphologies were revealed as a function of both the applied voltage and the presence of alloying elements. On this basis, an explanation of the different values of fracture energy measured by means of T-peel tests carried out on the corresponding joints was attempted

  11. Damage mechanism of piping welded joints made from austenitic Steel for the type RBMK reactor

    International Nuclear Information System (INIS)

    Karzov, G.; Timofeev, B.; Gorbakony, A.; Petrov, V.; Chernaenko, T.

    1999-01-01

    In the process of operation of RBMK reactors the damages were taking place on welded piping, produced from austenitic stainless steel of the type 08X18H10T. The inspection of damaged sections in piping has shown that in most cases crack-like defects are of corrosion and mechanical character. The paper considers in details the reasons of damages appearance and their development for this type of welded joints of downcomers 325xl6 mm, which were fabricated from austenitic stainless steel using TlG and MAW welding methods. (author)

  12. Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows

    Science.gov (United States)

    Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

    2016-12-01

    Controlling the size, dispersion, and stability of intermetallic compounds in lead-free solder alloys is vital to creating reliable solder joints regardless of how many times the solder joints are melted and resolidified (reflowed) during circuit board assembly. In this article, the coarsening behavior of Cu x Al y and Cu6Sn5 in two Sn-Cu-Al alloys, a Sn-2.59Cu-0.43Al at. pct alloy produced via drip atomization and a Sn-5.39Cu-1.69Al at. pct alloy produced via melt spinning at a 5-m/s wheel speed, was characterized after multiple (1-5) reflow cycles via differential scanning calorimetry between the temperatures of 293 K and 523 K (20 °C and 250 °C). Little-to-no coarsening of the Cu x Al y particles was observed for either composition; however, clustering of Cu x Al y particles was observed. For Cu6Sn5 particle growth, a bimodal size distribution was observed for the drip atomized alloy, with large, faceted growth of Cu6Sn5 observed, while in the melt spun alloy, Cu6Sn5 particles displayed no significant increase in the average particle size, with irregularly shaped, nonfaceted Cu6Sn5 particles observed after reflow, which is consistent with shapes observed in the as-solidified alloys. The link between original alloy composition, reflow undercooling, and subsequent intermetallic coarsening behavior was discussed by using calculated solidification paths. The reflowed microstructures suggested that the heteroepitaxial relationship previously observed between the Cu x Al y and the Cu6Sn5 was maintained for both alloys.

  13. Mechanical Properties and Microstructure of TIG and FSW Joints of a New Al-Mg-Mn-Sc-Zr Alloy

    Science.gov (United States)

    Xu, Guofu; Qian, Jian; Xiao, Dan; Deng, Ying; Lu, Liying; Yin, Zhimin

    2016-04-01

    A new Al-5.8%Mg-0.4%Mn-0.25%Sc-0.10%Zr (wt.%) alloy was successfully welded by tungsten inert gas (TIG) and friction stir welding (FSW) techniques, respectively. The mechanical properties and microstructure of the welded joints were investigated by microhardness measurements, tensile tests, and microscopy methods. The results show that the ultimate tensile strength, yield strength, and elongation to failure are 358, 234 MPa, and 27.6% for TIG welded joint, and 376, 245 MPa and 31.9% for FSW joint, respectively, showing high strength and superior ductility. The TIG welded joint fails in the heat-affected zone and the fracture of FSW joint is located in stirred zone. Al-Mg-Mn-Sc-Zr alloy is characterized by lots of dislocation tangles and secondary coherent Al3(Sc,Zr) particles. The superior mechanical properties of the TIG and FSW joints are mainly derived from the Orowan strengthening and grain boundary strengthening caused by secondary coherent Al3(Sc,Zr) nano-particles (20-40 nm). For new Al-Mg-Mn-Sc-Zr alloy, the positive effect from secondary Al3(Sc, Zr) particles in the base metal can be better preserved in FSW joint than in TIG welded joint.

  14. Effect of steel reinforcement with different degree of corrosion on degeneration of mechanical performance of reinforced concrete frame joints

    Directory of Open Access Journals (Sweden)

    Wu Xu

    2016-02-01

    Full Text Available Beam-column joints which shoulders high-level and vertical shearing effect that maintains balance of beam and column end is the major component influencing the performance of the whole framework. Post earthquake investigation suggests that collapse of frame structure is induced by failure of joints in most cases. Thus, beam-column joints must have strong bearing capacity and good ductility, and reinforced concrete structure just meets the above requirement. But corrosion caused by long time use of reinforced concrete framework will lead to degeneration of mechanical performance of joints. To find out the rule of effect of steel reinforcement with different corrosion rate on degeneration of bearing capacity of reinforced concrete framework joints, this study made a nonlinear numerical analysis on fifteen models without stirrup in the core area of reinforced concrete frame joints using displacement method considering axial load ratio of column end and constraint condition. This work aims to find out the key factor that influences mechanical performance of joints, thus to provide a basis for repair and reinforcement of degenerated framework joints.

  15. Microstructure and mechanical properties of resistance spot welded dissimilar thickness DP780/DP600 dual-phase steel joints

    International Nuclear Information System (INIS)

    Zhang, Hongqiang; Wei, Ajuan; Qiu, Xiaoming; Chen, Jianhe

    2014-01-01

    Highlights: • We examine changes of microstructure of dissimilar thickness DP600/DP780 joints. • The hardness profile of RSW joints can be predicted by the equation. • Failure modes, peak load and energy describes the mechanical properties of joints. • The nugget diameter is the key factor of transition between the failure modes. - Abstract: In this study, resistance spot welding (RSW) experiments were performed in order to evaluate the microstructure and mechanical properties of single-lap joints between DP780 and DP600. The results show that the weld joints consist of three regions including base metal (BM), heat affected zone (HAZ) and fusion zone (FZ). The grain size and martensite volume fractions increase in the order of BM, HAZ and FZ. The hardness in the FZ is significantly higher than hardness of base metals. Tensile properties of the joints were described in terms of the failure modes and static load-carrying capabilities. Two distinct failure modes were observed during the tensile shear test of the joints: interfacial failure (IF) and pullout failure (PF). The FZ size plays a dominate role in failure modes of the joints

  16. Effect of heat input on the microstructure and mechanical properties of gas tungsten arc welded AISI 304 stainless steel joints

    International Nuclear Information System (INIS)

    Kumar, Subodh; Shahi, A.S.

    2011-01-01

    Highlights: → Welding procedure is established for welding 6 mm thick AISI 304 using GTAW process. → Mechanical properties of the weld joints are influenced strongly by the heat input. → Highest tensile strength of 657.32 MPa is achieved by joints using low heat input. → Welding parameters affect heat input and hence microstructure of weld joints. → Extent of grain coarsening in the HAZ increases with increase in the heat input. -- Abstract: Influence of heat input on the microstructure and mechanical properties of gas tungsten arc welded 304 stainless steel (SS) joints was studied. Three heat input combinations designated as low heat (2.563 kJ/mm), medium heat (2.784 kJ/mm) and high heat (3.017 kJ/mm) were selected from the operating window of the gas tungsten arc welding process (GTAW) and weld joints made using these combinations were subjected to microstructural evaluations and tensile testing so as to analyze the effect of thermal arc energy on the microstructure and mechanical properties of these joints. The results of this investigation indicate that the joints made using low heat input exhibited higher ultimate tensile strength (UTS) than those welded with medium and high heat input. Significant grain coarsening was observed in the heat affected zone (HAZ) of all the joints and it was found that the extent of grain coarsening in the heat affected zone increased with increase in the heat input. For the joints investigated in this study it was also found that average dendrite length and inter-dendritic spacing in the weld zone increases with increase in the heat input which is the main reason for the observable changes in the tensile properties of the weld joints welded with different arc energy inputs.

  17. Effect of weld spacing on microstructure and mechanical properties of CLAM electron beam welding joints

    Energy Technology Data Exchange (ETDEWEB)

    Zhai, Yutao; Huang, Bo, E-mail: aufa0007@163.com; Zhang, Junyu; Zhang, Baoren; Liu, Shaojun; Huang, Qunying

    2016-11-15

    Highlights: • The welded joints of CLAM steel with different weld spacings have been fabricated with electron beam welding, and a simplified model of CLAM sheet was proposed. • The microstructure and mechanical properties such as microhardness, impact and tensile were investigated at different welding spacing for both conditions of as-welded and post weld heat treatment (PWHT). • The effect of the welding thermal cycle was significantly when the weld spacings were smaller than 4 mm. • When the weld spacing was small enough, the original microstructures would be fragmented with the high heat input. - Abstract: China low activation martensitic (CLAM) steel has been chosen as the primary structural material in the designs of dual function lithium-lead (DFLL) blanket for fusion reactors, China helium cooled ceramic breeder (HCCB) test blanket module (TBM) for ITER and China fusion engineering test reactor (CFETR) blanket. The cooling components of the blankets are designed with high density cooling channels (HDCCs) to remove the high nuclear thermal effectively. Hence, the welding spacing among the channels are small. In this paper, the welded joints of CLAM steel with different weld spacings have been fabricated with electron beam welding (EBW). The weld spacing was designed to be 2 mm, 3 mm, 4 mm, 6 mm and 8 mm. The microstructure and mechanical properties such as microhardness, impact and tensile were investigated at different welding spacing for both conditions of as-welded and post weld heat treatment (PWHT). The PWHT is tempering at 740 °C for 120 min. The results showed that the grain size in the heat affected zone (HAZ) increased with the increasing weld spacing, and the joint with small weld spacing had a better performance after PWHT. This work would give useful guidance to improve the preparation of the cooling components of blanket.

  18. Effect of Manganese on the Mechanical Properties of Welded As-Cast Aluminium Joint

    Directory of Open Access Journals (Sweden)

    Isiaka Oluwole OLADELE

    2013-11-01

    Full Text Available The effects of manganese on the mechanical properties of welded and un-weld as-cast 6063 aluminium alloy has been studied. Alloys of varying percentage of manganese from 0.019 to 0.24 were sand cast. A wooden pattern of dimensions 200×100×100mm was used, the aluminium (500g was charged into an induction furnace and heated to 750°C for 15 minutes, this was followed by the addition of weighed powdered manganese, stirred and heated at the same temperature for another 5 minutes and thereafter poured into the already prepared sand mould at a temperature of 690°C. The as-cast aluminium samples, were sectioned into two equal parts of 45mm each using power hack saw; a weld groove was created between the sides of the samples using an electric hand grinding machine, the groove served as the path along which the filler metal was deposited on the aluminium, a single v butt joint was produced from each sample and Metal Inert Gas Welding process was carried out to produce the required joint design. The different cast samples were machined to the different test pieces after which they were assessed to determine their mechanical properties (impact, hardness (welded joint and heat affected zone and tensile tests. The microstructures of the welded samples were also studied. From the results, it was observed that Sample F, which has 0.172% Mn, has the best hardness and impact strength while sample C with 0.160% Mn has the highest ultimate tensile strength.

  19. Mechanical influences on morphogenesis of the knee joint revealed through morphological, molecular and computational analysis of immobilised embryos.

    Directory of Open Access Journals (Sweden)

    Karen A Roddy

    2011-02-01

    Full Text Available Very little is known about the regulation of morphogenesis in synovial joints. Mechanical forces generated from muscle contractions are required for normal development of several aspects of normal skeletogenesis. Here we show that biophysical stimuli generated by muscle contractions impact multiple events during chick knee joint morphogenesis influencing differential growth of the skeletal rudiment epiphyses and patterning of the emerging tissues in the joint interzone. Immobilisation of chick embryos was achieved through treatment with the neuromuscular blocking agent Decamethonium Bromide. The effects on development of the knee joint were examined using a combination of computational modelling to predict alterations in biophysical stimuli, detailed morphometric analysis of 3D digital representations, cell proliferation assays and in situ hybridisation to examine the expression of a selected panel of genes known to regulate joint development. This work revealed the precise changes to shape, particularly in the distal femur, that occur in an altered mechanical environment, corresponding to predicted changes in the spatial and dynamic patterns of mechanical stimuli and region specific changes in cell proliferation rates. In addition, we show altered patterning of the emerging tissues of the joint interzone with the loss of clearly defined and organised cell territories revealed by loss of characteristic interzone gene expression and abnormal expression of cartilage markers. This work shows that local dynamic patterns of biophysical stimuli generated from muscle contractions in the embryo act as a source of positional information guiding patterning and morphogenesis of the developing knee joint.

  20. Mechanical Influences on Morphogenesis of the Knee Joint Revealed through Morphological, Molecular and Computational Analysis of Immobilised Embryos

    Science.gov (United States)

    Roddy, Karen A.; Prendergast, Patrick J.; Murphy, Paula

    2011-01-01

    Very little is known about the regulation of morphogenesis in synovial joints. Mechanical forces generated from muscle contractions are required for normal development of several aspects of normal skeletogenesis. Here we show that biophysical stimuli generated by muscle contractions impact multiple events during chick knee joint morphogenesis influencing differential growth of the skeletal rudiment epiphyses and patterning of the emerging tissues in the joint interzone. Immobilisation of chick embryos was achieved through treatment with the neuromuscular blocking agent Decamethonium Bromide. The effects on development of the knee joint were examined using a combination of computational modelling to predict alterations in biophysical stimuli, detailed morphometric analysis of 3D digital representations, cell proliferation assays and in situ hybridisation to examine the expression of a selected panel of genes known to regulate joint development. This work revealed the precise changes to shape, particularly in the distal femur, that occur in an altered mechanical environment, corresponding to predicted changes in the spatial and dynamic patterns of mechanical stimuli and region specific changes in cell proliferation rates. In addition, we show altered patterning of the emerging tissues of the joint interzone with the loss of clearly defined and organised cell territories revealed by loss of characteristic interzone gene expression and abnormal expression of cartilage markers. This work shows that local dynamic patterns of biophysical stimuli generated from muscle contractions in the embryo act as a source of positional information guiding patterning and morphogenesis of the developing knee joint. PMID:21386908

  1. Sacroiliac joint luxation after pedicle subtraction osteotomy: report of two cases and analysis of failure mechanism.

    Science.gov (United States)

    Charles, Yann Philippe; Yu, Bo; Steib, Jean-Paul

    2016-05-01

    Sagittal decompensation after pedicle subtraction osteotomy (PSO) is considered as late onset complication. Several mechanisms have been suggested, but little attention has been paid to the caudal end of lumbar instrumented fusion, especially sacral iliac joint (SIJ) deterioration. Clinical histories and radiographic sagittal parameters of two patients with SIJ luxation after PSO are presented. The biomechanical failure mechanism and risk factors are analysed. Two patients underwent correction of fixed anterior sagittal imbalance by PSO, followed by pseudarthrosis revision surgery. Both of them sustained persistent sacroiliac pain, progressive recurrence of anterior imbalance and progressive pelvic incidence (PI) increase around 10°. An acute bilateral SIJ luxation occurred in both patients leading to sharp increase or PI around 20°. One patient was treated by SIJ fusion and the other patient was placed on non-weight-bearing crutch ambulation for 1 year. Both patients had a high preoperative PI (95° and 78°). A theoretical match between lumbar lordosis (LL) and PI was not achieved by PSO. Osteopenia was present in both patients. Computed tomography evidenced L5-S1 pseudarthrosis and sacroiliac joint violation by pelvic or sacral ala screws. Patients with high PI might seek for further compensation at their SIJ when lacking LL after PSO. Chronic anterior imbalance might lead to progressive weakening of sacroiliac ligaments. Initial circumferential lumbosacral fusion and accurate iliac screw fixation might reduce stress on implants, risk for pseudarthrosis, implant failure and finally SIJ deterioration. Bone mineral density should further be investigated preoperatively.

  2. Mean load effect on fatigue of welded joints using structural stress and fracture mechanics approach

    International Nuclear Information System (INIS)

    Kim, Jong Sung; Kim, Cheol; Jin, Tae Eun; Dong, P.

    2006-01-01

    In order to ensure the structural integrity of nuclear welded structures during design life, the fatigue life has to be evaluated by fatigue analysis procedures presented in technical codes such as ASME B and PV Code Section III. However, existing fatigue analysis procedures do not explicitly consider the presence of welded joints. A new fatigue analysis procedure based on a structural stress/fracture mechanics approach has been recently developed in order to reduce conservatism by erasing uncertainty in the analysis procedure. A recent review of fatigue crack growth data under various mean loading conditions using the structural stress/fracture mechanics approach, does not consider the mean loading effect, revealed some significant discrepancies in fatigue crack growth curves according to the mean loading conditions. In this paper, we propose the use of the stress intensity factor range ΔK characterized with loading ratio R effects in terms of the structural stress. We demonstrate the effectiveness in characterizing fatigue crack growth and S-N behavior using the well-known data. It was identified that the S-N data under high mean loading could be consolidated in a master S-N curve for welded joints

  3. Mechanical properties of TIG and EB weld joints of F82H

    Energy Technology Data Exchange (ETDEWEB)

    Hirose, Takanori, E-mail: hirose.takanori@jaea.go.jp; Sakasegawa, Hideo; Nakajima, Motoki; Tanigawa, Hiroyasu

    2015-10-15

    Highlights: • Narrow groove TIG minimized volume of F82H weld. • Mechanical properties of TIG and EB welds of F82H have been characterized. • Post weld heat treatment successfully moderate the toughness of weld metal without softening the base metal. - Abstract: This work investigates mechanical properties of weld joints of a reduced activation ferritic/martensitic steel, F82H and effects of post weld heat treatment on the welds. Vickers hardness, tensile and Charpy impact tests were conducted on F82H weld joints prepared using tungsten-inert-gas and electron beam after various heat treatments. Although narrow groove tungsten-inert-gas welding reduced volume of weld bead, significant embrittlement was observed in a heat affected zone transformed due to heat input. Post weld heat treatment above 993 K successfully moderated the brittle transformed region. The hardness of the brittle region strongly depends on the heat treatment temperature. Meanwhile, strength of base metal was slightly reduced by the treatment at temperature ranging from 993 to 1053 K. Moreover, softening due to double welding was observed only in the weld metal, but negligible in base metal.

  4. Toughness study of an under matched welded joint: application to the mechanical integrity of the electron beam welded joint of 6016-T6 aluminium alloy

    International Nuclear Information System (INIS)

    Rekik, Wissal

    2016-01-01

    For the demonstration of the integrity of the most sensitive nuclear components, conventional defects, as cracks for example, must be considered within the design step as required by the nuclear safety authority. This phase is particularly crucial for dimensioning of welded structures. To ensure a conservative prediction, the position of the initial crack within the welded joint must be the most detrimental in fracture behavior. Commonly used analyzes consider homogeneous structure with the behavior of the base metal of the welded joint, considered as the weakest metallurgical zone in the case of an overmatched weld. In contrast, similar analysis is not conservative in case of under matched weld. The thesis contributes by the development of an experimental and numerical methodology allowing the identification of the detrimental metallurgical zone in fracture behavior of an under matched welded joint. The methodology proposed is applied to an electron beam welded joint on al 6061-T6. To reach this goal, the gradient of the mechanical behavior along the welded joint was first identified. This is particularly interesting to conduct an advanced analysis based on a multi material approach. In a second step, the fracture behavior of the welded joint was studied on CT specimen. The transferability of the J integral at initiation was approved on another geometry: this represents an important foundation for the transferability assumption to structure. Finally, a numerical analysis on full scale tube was developed. Residual welding stresses and structural effects were considered. The results demonstrate that the heat affected zone located at 13 mm from the middle of the welded joint is the most detrimental zone for fracture analysis. This contradicts the conventional methods conducted on fracture analysis which consider a conventional defect within the fusion zone. (author) [fr

  5. Nanoconstruction by welding individual metallic nanowires together using nanoscale solder

    International Nuclear Information System (INIS)

    Peng, Y; Inkson, B J; Cullis, A G

    2010-01-01

    This work presents a new bottom-up nanowelding technique enabling building blocks to be assembled and welded together into complex 3D nanostructures using nanovolumes of metal solder. The building blocks of gold nanowires, (Co 72 Pt 28 /Pt) n multilayer nanowires, and nanosolder Sn 99 Au 1 alloy nanowires were successfully fabricated by a template technique. Individual metallic nanowires were picked up and assembled together. Conductive nanocircuits were then welded together using similar or dissimilar nanosolder material. At the weld sites, nanoscale volumes of a chosen metal are deposited using nanosolder of a sacrificial nanowire, which ensures that the nanoobjects to be bonded retain their structural integrity. The whole nanowelding process is clean, controllable and reliable, and ensures both mechanically strong and electrically conductive contacts.

  6. Effect Of Irradiation Temperature and Dose On Mechanical Properties And Fracture Characteristics Of Cu//SS Joints For ITER

    International Nuclear Information System (INIS)

    Fabritsiev, S.A.; Pokrovsky, A.S.; Peacock, A.; Roedig, M.; Linke, J.; Gervash, A.; Barabash, V.

    2007-01-01

    Full text of publication follows: By now, a number of technologies have been proposed for the production of Cu//SS joints for ITER, such as brazing, friction welding, HIP and cast-copper-to-steel (CC). The two last-mentioned technologies ensure sufficiently high mechanical properties and a high joint quality, when unirradiated. The data, however, on mechanical characteristics of irradiated of Cu//SS HIP joints are limited. In this paper, the authors present the results of investigations into the mechanical characteristics after irradiation of GlidCopAl25/316L(N) and Cu-Cr-Zr/316L(N)-type joints produced by the HIP and CC technologies. Specimens of the joints were irradiated in the RBT-6 reactor in the dose range of 10 -3 - 10 -1 dpa at T irr = 200 deg. C and 300 deg. C. The tensile stress-strain curves for irradiated and unirradiated joint specimens show deformation processes occurring in both the Cu and SS parts of the specimens. Irradiation at T irr = 200 deg. C causes strengthening of the joints specimens (by about 100 MPa at the maximum dose). The uniform elongation drops from 8% in the initial state to 2-3 %. But the total elongation remains at a relatively high level of ∼ 7%. Irradiation at T irr = 300 deg. C causes a slight strengthening of the joints specimens (∼30 MPa). The uniform elongation remains unchanged at ∼ 7%. The total elongation also maintains a relatively high level of ∼9-13%. SEM investigations revealed that fracture occurs only in the copper part of the irradiated specimens, and ductile trans-crystalline fracture predominates in the joints. 3D finite element analysis of the tensile test indicates that the concentration of stresses and deformations in the copper layer adjacent to the joint line is responsible for this typical failure of the irradiated joints specimens. Comparison of the behavior of the joints irradiated at T irr = 200 deg. C and 300 deg. C indicate an increased embrittlement at lower irradiation temperatures. At a

  7. Skeletal muscle contraction in protecting joints and bones by absorbing mechanical impacts

    Science.gov (United States)

    Rudenko, O. V.; Tsyuryupa, S.; Sarvazyan, A.

    2016-09-01

    We have previously hypothesized that the dissipation of mechanical energy of external impact is a fundamental function of skeletal muscle in addition to its primary function to convert chemical energy into mechanical energy. In this paper, a mathematical justification of this hypothesis is presented. First, a simple mechanical model, in which the muscle is considered as a simple Hookean spring, is considered. This analysis serves as an introduction to the consideration of a biomechanical model taking into account the molecular mechanism of muscle contraction, kinetics of myosin bridges, sarcomere dynamics, and tension of muscle fibers. It is shown that a muscle behaves like a nonlinear and adaptive spring tempering the force of impact and increasing the duration of the collision. The temporal profiles of muscle reaction to the impact as functions of the levels of muscle contraction, durations of the impact front, and the time constants of myosin bridges closing, are obtained. The absorption of mechanical shock energy is achieved due to the increased viscoelasticity of the contracting skeletal muscle. Controlling the contraction level allows for the optimization of the stiffness and viscosity of the muscle necessary for the protection of the joints and bones.

  8. Examination of structure and mechanical properties of hard-to-weld metal joints obtained with the laser method

    International Nuclear Information System (INIS)

    Czujko, T.; Przetakiewicz, W.; Jozwiak, S.; Hoffman, J.; Kalita, W.

    1995-01-01

    Metal joints of stainless of type X6CrNiMoTi1722 (according to DIN) and high conductivity (HC) copper, and joints of transformer steel containing about 3.5% of silicon were obtained using metal sheets 2 mm in thickness. The microstructure and the distribution of microhardness in the area of the joint, and the changes of the strength and elongation caused by the process of laser welding were examined with reference to the properties of the native metal; and, in the case of transformer steel-joints, the effects of welding by means of the TIG method were also analyzed. A probable mechanism of the formation of the steel-copper joint was presented, the strength of which is comparable with that of copper. The superiority of laser welding over TIG welding was also demonstrated. (author). 11 refs, 4 figs, 1 tab

  9. Effect of Complete Syndesmotic Disruption and Deltoid Injuries and Different Reduction Methods on Ankle Joint Contact Mechanics.

    Science.gov (United States)

    LaMothe, Jeremy; Baxter, Josh R; Gilbert, Susannah; Murphy, Conor I; Karnovsky, Sydney C; Drakos, Mark C

    2017-06-01

    Syndesmotic injuries can be associated with poor patient outcomes and posttraumatic ankle arthritis, particularly in the case of malreduction. However, ankle joint contact mechanics following a syndesmotic injury and reduction remains poorly understood. The purpose of this study was to characterize the effects of a syndesmotic injury and reduction techniques on ankle joint contact mechanics in a biomechanical model. Ten cadaveric whole lower leg specimens with undisturbed proximal tibiofibular joints were prepared and tested in this study. Contact area, contact force, and peak contact pressure were measured in the ankle joint during simulated standing in the intact, injured, and 3 reduction conditions: screw fixation with a clamp, screw fixation without a clamp (thumb technique), and a suture-button construct. Differences in these ankle contact parameters were detected between conditions using repeated-measures analysis of variance. Syndesmotic disruption decreased tibial plafond contact area and force. Syndesmotic reduction did not restore ankle loading mechanics to values measured in the intact condition. Reduction with the thumb technique was able to restore significantly more joint contact area and force than the reduction clamp or suture-button construct. Syndesmotic disruption decreased joint contact area and force. Although the thumb technique performed significantly better than the reduction clamp and suture-button construct, syndesmotic reduction did not restore contact mechanics to intact levels. Decreased contact area and force with disruption imply that other structures are likely receiving more loads (eg, medial and lateral gutters), which may have clinical implications such as the development of posttraumatic arthritis.

  10. The associations between quadriceps muscle strength, power, and knee joint mechanics in knee osteoarthritis: A cross-sectional study.

    Science.gov (United States)

    Murray, Amanda M; Thomas, Abbey C; Armstrong, Charles W; Pietrosimone, Brian G; Tevald, Michael A

    2015-12-01

    Abnormal knee joint mechanics have been implicated in the pathogenesis and progression of knee osteoarthritis. Deficits in muscle function (i.e., strength and power) may contribute to abnormal knee joint loading. The associations between quadriceps strength, power and knee joint mechanics remain unclear in knee osteoarthritis. Three-dimensional motion analysis was used to collect peak knee joint angles and moments during the first 50% of stance phase of gait in 33 participants with knee osteoarthritis. Quadriceps strength and power were assessed using a knee extension machine. Strength was quantified as the one repetition maximum. Power was quantified as the peak power produced at 40-90% of the one repetition maximum. Quadriceps strength accounted for 15% of the variance in peak knee flexion angle (P=0.016). Quadriceps power accounted for 20-29% of the variance in peak knee flexion angle (Pknee adduction moment (P=0.05). These data suggest that quadriceps power explains more variance in knee flexion angle and knee adduction moment during gait in knee osteoarthritis than quadriceps strength. Additionally, quadriceps power at multiple loads is associated with knee joint mechanics and therefore should be assessed at a variety of loads. Taken together, these results indicate that quadriceps power may be a potential target for interventions aimed at changing knee joint mechanics in knee osteoarthritis. Copyright © 2015 Elsevier Ltd. All rights reserved.

  11. Laser-activated protein solder for peripheral nerve repair

    Science.gov (United States)

    Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

    1995-05-01

    A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

  12. An investigation into the mechanism for enhanced mechanical properties in friction stir welded AA2024-T3 joints coated with cold spraying

    Science.gov (United States)

    Li, N.; Li, W. Y.; Yang, X. W.; Feng, Y.; Vairis, A.

    2018-05-01

    Using cold spraying (CS), a surface layer with a modified microstructure and enhanced mechanical properties was formed on a 3.2 mm thick friction stir welded (FSWed) AA2024-T3 joint. The combined effect of "shot peening effect (SPE)" and "heat flow effect (HFE)" during CS were used to enhance joint mechanical properties. The microstructure evolution of the FSWed AA2024-T3 joints in the surface layer following CS coatings and their effect on mechanical properties were systematically characterized with electron back-scattered diffraction, transmission electron microscopy, differential scanning calorimetry and mechanical tests. Based on these experiments, a grain refinement, finer and more S phases, and improved amount of Guinier-Preston-Bagaryatsky (GPB) zones produced by CS treatments are proposed. The deposition of aluminum coating on the joint, lead to hardness recovery in the stir zone and the development of two low hardness zones as the density of GPB increased. The tensile properties of FSWed AA2024-T3 joints improved with the application of the aluminum coatings. Experiments and analysis of the enhanced mechanical properties mechanism indicate that SPE with a high plastic deformation and HFE with an intensive heat flow are necessary for the production of refined grains and increased numbers of GPB zones.

  13. Effect of groove design on mechanical and metallurgical properties of quenched and tempered low alloy abrasion resistant steel welded joints

    International Nuclear Information System (INIS)

    Sharma, Varun; Shahi, A.S.

    2014-01-01

    Highlights: • Effect of weld groove design on Q and T steel welded joints is investigated. • Groove design influences heat dissipation characteristics of welded joints. • Double-V groove joint possesses maximum yield strength and UTS. • C-groove joint possesses highest impact energy, both at room temperature and 0 °C. • A wide variation in microhardness exists across different zone of the weldments. - Abstract: Experimental investigations were carried out to study the influence of three different groove designs on mechanical and metallurgical properties of 15 mm thick Q and T (quenched and tempered) steel welded joints. Welding heat input variation corresponding to each joint configuration was kept to a minimal such that the objective of investigating, exclusively, the effect of varied weld volume on the mechanical and metallurgical performance of these joints could be accomplished. Mechanical performance of these joints was evaluated by subjecting them to transverse tensile testing, and Charpy V-notch impact testing of the weld zones at room temperature and 0 °C. The results of this study reveal that among all types of groove formations used for welding, double-V groove joint possessed maximum YS (yield strength) and UTS (ultimate tensile strength), besides maximum strength ratio (YS/UTS) that was followed by U-groove joint and C-groove joint, respectively. However, weld zone tested individually, for the cover as well as the root pass of the C-groove joint possessed highest CVN (Charpy V-notch) values, both at room temperature and 0 °C. Extensive microhardness studies of these weldments showed a wide variation in the microhardness values of the weld zone and the HAZ (heat affected zone). It was concluded that each groove formation/design exerted a significant influence on the heat dissipation characteristics of these joints, which is evident from different morphological features as revealed through optical microscopy. Scanning electron microscopic

  14. Active joint mechanism driven by multiple actuators made of flexible bags: a proposal of dual structural actuator.

    Science.gov (United States)

    Kimura, Hitoshi; Matsuzaki, Takuya; Kataoka, Mokutaro; Inou, Norio

    2013-01-01

    An actuator is required to change its speed and force depending on the situation. Using multiple actuators for one driving axis is one of the possible solutions; however, there is an associated problem of output power matching. This study proposes a new active joint mechanism using multiple actuators. Because the actuator is made of a flexible bag, it does not interfere with other actuators when it is depressurized. The proposed joint achieved coordinated motion of multiple actuators. This report also discusses a new actuator which has dual cylindrical structure. The cylinders are composed of flexible bags with different diameters. The joint torque is estimated based on the following factors: empirical formula for the flexible actuator torque, geometric relationship between the joint and the actuator, and the principle of virtual work. The prototype joint mechanism achieves coordinated motion of multiple actuators for one axis. With this motion, small inner actuator contributes high speed motion, whereas large outer actuator generates high torque. The performance of the prototype joint is examined by speed and torque measurements. The joint showed about 30% efficiency at 2.0 Nm load torque under 0.15 MPa air input.

  15. Roentgencinematographic studies on the mechanics of the tempero-mandibular joint

    International Nuclear Information System (INIS)

    Gernet, W.; Puff, A.; Steinkraus-Maatz, C.

    1978-01-01

    Investigations of the articular mechanics of the tempero-mandibular joint are an important element in gnathology. Graphically recorded movements of the condylus obtained by extra-oral mechanical aids, only give information about the projections of the articulatory pathways. Only roentgencinematography allows a profound study of the articular mechanics. The movements of the condylus can be analysed directly without interference. Studies on condylar pathways evaluated by roentgencinematography from waerers of full dentures who received two sets of dentures which fitted after different jaw relation determinations, confirmed that the movement of the condylus is controlled by neuromuscular mechanism. The condylar pathway changes after removal of the dentures. The fitting of different dentures in a healthy stomatognatic system had no effect on the course of the pathway. In neuromuscular disorders the fitting of a full denture which can be made corresponding to the functional anatomical concept reflecting a suitable jaw relation determination according to Gerber, allows the articulation pathway to be altered. A therapeutic re-orientation of the pathological reflexes makes the improvement of the discomfort possible. (orig.) [de

  16. Air rudder mechanism dynamics considering two elements:Joint clearance and link flexibility

    Energy Technology Data Exchange (ETDEWEB)

    Li, Yuntao; Quan, Qiquan; Li, He; Tang, Dewei; Li, Zhonghong; Fan, Wenyang; Deng, Zongquan [Harbin Institute of Technology, Harbin (China)

    2017-07-15

    Both the impact phenomenon in the clearance revolute joint and the link deformation will influence the dynamics of the air rudder transmission mechanism, which could reduce the flight quality of an aircraft. Given the effect of the two elements, a feasible simulation method with two improvements of previous methods is proposed to analyze the dynamic characteristics of the mechanism. In previous studies, the parameters of the contact force model in multi-body dynamics software were generally determined by experience, which may cause uncertainty in the calculation precision of the contact force. Furthermore, it is difficult to solve for the elastic link deformation in the practical mechanism using the available analytical methods due to the complicated section of the link. In this paper, a Continuous contact force (CCF) model was proposed and embedded in the ADAMS by developing a routine of the CCF model. Then, the flexible model was obtained by ANSYS to obtain the elastic link deformation. The experimental results indicate that the proposed simulation method can be effectively applied to predict the dynamic behavior of the mechanism.

  17. Single-step brazing process for mono-block joints and mechanical testing

    International Nuclear Information System (INIS)

    Casalegno, V.; Ferraris, M.; Salvo, M.; Rizzo, S.; Merola, M.

    2007-01-01

    Full text of publication follows: Plasma facing components act as actively cooled thermal shields to sustain thermal and particle loads during normal and transient operations in ITER (International Thermonuclear Experimental Reactor). The plasma-facing layer is referred to as 'armour', which is made of either carbon fibre reinforced carbon composite (CFC) or tungsten (W). CFC is the reference design solution for the lower part of the vertical target of the ITER divertor. The armour is joined onto an actively cooled substrate, the heat sink, made of precipitation hardened copper alloy CuCrZr through a thin pure copper interlayer to decrease, by plastic deformation, the joint interface stresses; in fact, the CFC to Cu joint is affected by the CTE mismatch between the ceramic and metallic material. A new method of joining CFC to copper and CFC/Cu to CuCrZr alloy was effectively developed for the flat-type configuration; the feasibility of this process also for mono-block geometry and the development of a procedure for testing mono-block-type mock-ups is described in this work. The mono-block configuration consists of copper alloy pipe shielded by CFC blocks. It is worth noting that in mono-block configuration, the large thermal expansion mismatch between CFC and copper alloy is more significant than for flat-tile configuration, due to curved interfaces. The joining technique foresees a single-step brazing process: the brazing of the three materials (CFC-Cu-CuCrZr) can be performed in a single heat treatment using the same Cu/Ge based braze. The composite surface was modified by solid state reaction with chromium with the purpose of increasing the wettability of CFC by the brazing alloy. The CFC substrate reacts with Cr which, forming a carbide layer, allows a large reduction of the contact angle; then, the brazing of CFC to pure copper and pure copper to CuCrZr by the same treatment is feasible. This process allows to obtain good joints using a non-active brazing

  18. Single-step brazing process for mono-block joints and mechanical testing

    Energy Technology Data Exchange (ETDEWEB)

    Casalegno, V.; Ferraris, M.; Salvo, M.; Rizzo, S. [Politecnico di Torino, Materials Science and Chemical Engineering Dept., Torino (Italy); Merola, M. [ITER International Team, llER Joint Work Site, Cadarache, 13 - St Paul Lez Durance (France)

    2007-07-01

    Full text of publication follows: Plasma facing components act as actively cooled thermal shields to sustain thermal and particle loads during normal and transient operations in ITER (International Thermonuclear Experimental Reactor). The plasma-facing layer is referred to as 'armour', which is made of either carbon fibre reinforced carbon composite (CFC) or tungsten (W). CFC is the reference design solution for the lower part of the vertical target of the ITER divertor. The armour is joined onto an actively cooled substrate, the heat sink, made of precipitation hardened copper alloy CuCrZr through a thin pure copper interlayer to decrease, by plastic deformation, the joint interface stresses; in fact, the CFC to Cu joint is affected by the CTE mismatch between the ceramic and metallic material. A new method of joining CFC to copper and CFC/Cu to CuCrZr alloy was effectively developed for the flat-type configuration; the feasibility of this process also for mono-block geometry and the development of a procedure for testing mono-block-type mock-ups is described in this work. The mono-block configuration consists of copper alloy pipe shielded by CFC blocks. It is worth noting that in mono-block configuration, the large thermal expansion mismatch between CFC and copper alloy is more significant than for flat-tile configuration, due to curved interfaces. The joining technique foresees a single-step brazing process: the brazing of the three materials (CFC-Cu-CuCrZr) can be performed in a single heat treatment using the same Cu/Ge based braze. The composite surface was modified by solid state reaction with chromium with the purpose of increasing the wettability of CFC by the brazing alloy. The CFC substrate reacts with Cr which, forming a carbide layer, allows a large reduction of the contact angle; then, the brazing of CFC to pure copper and pure copper to CuCrZr by the same treatment is feasible. This process allows to obtain good joints using a non

  19. The porosity formation mechanism in the laser-MIG hybrid welded joint of Invar alloy

    Science.gov (United States)

    Zhan, Xiaohong; Gao, Qiyu; Gu, Cheng; Sun, Weihua; Chen, Jicheng; Wei, Yanhong

    2017-10-01

    The porosity formation mechanism in the laser-metal inter gas (MIG) multi-layer hybrid welded (HW) joint of 19.05 mm thick Invar alloy is investigated. The microstructure characteristics and energy dispersive spectroscopy (EDS) are analyzed. The phase identification was conducted by the X-ray diffractometer (XRD). Experimental results show that the generation of porosity is caused by the relatively low laser power in the root pass and low current in the cover pass. It is also indicated that the microstructures of the welded joints are mainly observed to be columnar crystal and equiaxial crystal, which are closely related to the porosity formation. The EDS results show that oxygen content is significantly high in the inner wall of the porosity. The XRD results indicate that the BM and the WB of laser-MIG HW all are composed of Fe0.64Ni0.36 and γ-(Fe,Ni). When the weld pool is cooled quickly, [NiO] [FeO] and [MnO] are formed that react on C to generate CO/CO2 gases. The porosity of laser-MIG HW for Invar alloy is oxygen pore. The root source of metallurgy porosity formation is that the dissolved gases are hard to escape sufficiently and thus exist in the weld pool. Furthermore, 99.99% pure Argon is recommended as protective gas in the laser-MIG HW of Invar alloy.

  20. Redistribution of Mechanical Work at the Knee and Ankle Joints During Fast Running in Minimalist Shoes.

    Science.gov (United States)

    Fuller, Joel T; Buckley, Jonathan D; Tsiros, Margarita D; Brown, Nicholas A T; Thewlis, Dominic

    2016-10-01

    Minimalist shoes have been suggested as a way to alter running biomechanics to improve running performance and reduce injuries. However, to date, researchers have only considered the effect of minimalist shoes at slow running speeds. To determine if runners change foot-strike pattern and alter the distribution of mechanical work at the knee and ankle joints when running at a fast speed in minimalist shoes compared with conventional running shoes. Crossover study. Research laboratory. Twenty-six trained runners (age = 30.0 ± 7.9 years [age range, 18-40 years], height = 1.79 ± 0.06 m, mass = 75.3 ± 8.2 kg, weekly training distance = 27 ± 15 km) who ran with a habitual rearfoot foot-strike pattern and had no experience running in minimalist shoes. Participants completed overground running trials at 18 km/h in minimalist and conventional shoes. Sagittal-plane kinematics and joint work at the knee and ankle joints were computed using 3-dimensional kinematic and ground reaction force data. Foot-strike pattern was classified as rearfoot, midfoot, or forefoot strike based on strike index and ankle angle at initial contact. We observed no difference in foot-strike classification between shoes (χ 2 1 = 2.29, P = .13). Ankle angle at initial contact was less (2.46° versus 7.43°; t 25 = 3.34, P = .003) and strike index was greater (35.97% versus 29.04%; t 25 = 2.38, P = .03) when running in minimalist shoes compared with conventional shoes. We observed greater negative (52.87 J versus 42.46 J; t 24 = 2.29, P = .03) and positive work (68.91 J versus 59.08 J; t 24 = 2.65, P = .01) at the ankle but less negative (59.01 J versus 67.02 J; t 24 = 2.25, P = .03) and positive work (40.37 J versus 47.09 J; t 24 = 2.11, P = .046) at the knee with minimalist shoes compared with conventional shoes. Running in minimalist shoes at a fast speed caused a redistribution of work from the knee to the ankle joint. This finding suggests that runners changing from conventional to minimalist

  1. Microstructures and mechanical properties of friction stir welded dissimilar steel-copper joints

    Energy Technology Data Exchange (ETDEWEB)

    Jafari, M.; Abbasi, M.; Poursina, D.; Gheysarian, A. [University of Kashan, Kashan (Iran, Islamic Republic of); Bagheri, B. [Amirkabir University of Technology, Tehran (Iran, Islamic Republic of)

    2017-03-15

    Welding dissimilar metals by fusion welding is challenging. It results in welding defects. Friction stir welding (FSW) as a solid-state joining method can overcome these problems. In this study, 304L stainless steel was joined to copper by FSW. The optimal values of the welding parameters traverse speed, rotational speed, and tilt angle were obtained through Response surface methodology (RSM). Under optimal welding conditions, the effects of welding pass number on the microstructures and mechanical properties of the welded joints were investigated. Results indicated that appropriate values of FSW parameters could be obtained by RSM and grain size refinement during FSW mainly affected the hardness in the weld regions. Furthermore, the heat from the FSW tool increased the grain size in the Heat-affected zones (HAZs), especially on the copper side. Therefore, the strength and ductility decreased as the welding pass number increased because of grain size enhancement in the HAZs as the welding pass number increased.

  2. Anesthetic Mechanism of Myeloacupuncture in Joints аnd Spine Pathology

    Directory of Open Access Journals (Sweden)

    V.V. Yakovlenko

    2015-08-01

    Full Text Available The article presents a literature review on the application of such method of reflexotherapy acupuncture as myeloacupuncture used in the pathology of the peri­pheral joints and spine. It is theoretically grounded and associated with a positive clinical effect as a result of regenerating influence on the processes of free radical oxidation, imbalance of the cytokine network, growth factors, vascular endothelial function, the system of nitric oxide and pro-inflammatory enzymes (matrix metalloproteinases, cyclooxygenase-2, caspase-3. Achievement of the analgesic effect by acupuncture needle injection into the spinal cord is conducted due to the impact on peripheral, spinal and sub-spinal mechanisms, synthesis of neurotransmitters and neurohormones, neuroacid, that cause vanniloid-1 reception normalization, enhancement of production of endorphins, enkephalins and endomorphins, thyrotropin-releasing hormone and P substance.

  3. Study on microstructure and mechanical properties of Al–Mg–Mn–Er alloy joints welded by TIG and laser beam

    International Nuclear Information System (INIS)

    Yang, Dongxia; Li, Xiaoyan; He, Dingyong; Huang, Hui; Zhang, Liang

    2012-01-01

    Highlights: ► The microstructural characterization of the TIG and laser welded Al–Mg–Mn–Er alloy is studied. ► Transition zone and HAZ are found to disappear near the fusion boundaries in LBW joint. ► Primary Al 3 Er in LBW weld provides more nucleation sites and lead to the grain refinement. ► The evaporation of alloying element Mg in TIG and LBW joints is investigated. ► Reasons for high strength of LBW joint are fine-grain strengthening and solution strengthening. -- Abstract: Al-4.7Mg-0.7Mn-0.3Er alloy plates were welded by laser beam welding (LBW) and tungsten inert gas (TIG). Mechanical properties and microstructures of both welded joints were analyzed. The results showed that the tensile strength of LBW joint was 315 MPa, which was approximately 10% higher than that of TIG welded joint. This was attributed to the fine grains, dispersed primary Al 3 Er phase and low Mg evaporation in LBW weld. Equiaxed grains with average size of 30 μm were obtained in the fusion zone, which were much smaller than that of 90 μm in the fusion zone of TIG joint, due to the low heat input during LBW process. Moreover, finer primary Al 3 Er particles were uniformly distributed in the LBW joints, which resulted in a substantial increase of nucleation rate in LBW welds. In addition, it was also found that Mg concentrations in the fusion zones, in both TIG and LBW joints, were lower than that of the base one tested by EPMA. The burning loss rates of Mg in TIG and LBW joints were 36% and 22%, respectively.

  4. Fluid load support and contact mechanics of hemiarthroplasty in the natural hip joint.

    Science.gov (United States)

    Pawaskar, Sainath Shrikant; Ingham, Eileen; Fisher, John; Jin, Zhongmin

    2011-01-01

    The articular cartilage covering the ends of the bones of diarthrodial synovial joints is thought to have evolved so that the loads are transferred under different and complex conditions, with a very high degree of efficiency and without compromising the structural integrity of the tissue for the life of an individual. These loading conditions stem from different activities such as walking, and standing. The integrity of cartilage may however become compromised due to congenital disease, arthritis or trauma. Hemiarthroplasty is a potentially conservative treatment when only the femoral cartilage is affected as in case of femoral neck fractures. In hemiarthroplasty, a metallic femoral prosthesis is used to articulate against the natural acetabular cartilage. It has also been hypothesized that biphasic lubrication is the predominant mechanism protecting the cartilage through a very high fluid load support which lowers friction. This may be altered due to hemiarthroplasty and have a direct effect on the frictional shear stresses and potentially cartilage degradation and wear. This study modelled nine activities of daily living and investigated the contact mechanics of a hip joint with a hemiarthroplasty, focussing particularly on the role of the fluid phase. It was shown that in most of the activities studied the peak contact stresses and peak fluid pressures were in the superior dome or lateral roof of the acetabulum. Total fluid load support was very high (~90%) in most of the activities which would shield the solid phase from being subjected to very high contact stresses. This was dependent not only on the load magnitude but also the direction and hence on the location of the contact area with respect to the cartilage coverage. Lower fluid load support was found when the contact area was nearer the edges where the fluid drained easily. Copyright © 2010 IPEM. Published by Elsevier Ltd. All rights reserved.

  5. MANAGING JOINT PRODUCTION MOTIVATION : THE ROLE OF GOAL FRAMING AND GOVERNANCE MECHANISMS

    NARCIS (Netherlands)

    Lindenberg, Siegwart; Foss, Nicolai J.

    We contribute to the microfoundations of organizational performance by proffering the construct of joint production motivation. Under such motivational conditions individuals see themselves as part of a joint endeavor, each with his or her own roles and responsibilities; generate shared

  6. Effect of friction stir welding parameters on microstructure and mechanical properties of DSS–Cu joints

    Energy Technology Data Exchange (ETDEWEB)

    Shokri, V., E-mail: v.shokri@modares.ac.ir [Department of Mechanical Engineering, Tarbiat Modarres University, Tehran (Iran, Islamic Republic of); Sadeghi, A. [School of Mechanical Engineering, College of Engineering, University of Tehran, Tehran (Iran, Islamic Republic of); Sadeghi, M.H. [Department of Mechanical Engineering, Tarbiat Modarres University, Tehran (Iran, Islamic Republic of)

    2017-05-02

    Dissimilar joining of copper to duplex stainless steel (DSS) is challenging at high temperatures of fusion welding owing to the large difference in physical properties of the base metals. To reduce negative effects of welding at high temperatures, solid state welding at lower temperatures has been proposed. To study different effects of welding parameters (rotation speed, travel speed and tool offset) on weld zone microstructure and mechanical properties butt joints of a copper alloy and duplex stainless steel (DSS) were produced by friction stir welding (FSW). It has been found that heat input generated by the interaction of different welding conditions has a significant effect on the formation of a brittle intermetallic at the interface and eventually the final mechanical properties. At low heat inputs, mixing of the two sides is insufficient and metallurgical bonding is weak; while at high heat inputs, the thickness of the formed intermetallic is too thick which causes stress concentration at the interface and premature failure. An optimum welding condition was found (rotation speed of 1200 rpm, travel speed of 30 mm/min and tool offset of 0.5 mm) which almost reached the mechanical properties of the Cu-alloy monolayer.

  7. Electrical characteristics for Sn-Ag-Cu solder bump with Ti/Ni/Cu under-bump metallization after temperature cycling tests

    Science.gov (United States)

    Shih, T. I.; Lin, Y. C.; Duh, J. G.; Hsu, Tom

    2006-10-01

    Lead-free solder bumps have been widely used in current flip-chip technology (FCT) due to environmental issues. Solder joints after temperature cycling tests were employed to investigate the interfacial reaction between the Ti/Ni/Cu under-bump metallization and Sn-Ag-Cu solders. The interfacial morphology and quantitative analysis of the intermetallic compounds (IMCs) were obtained by electron probe microanalysis (EPMA) and field emission electron probe microanalysis (FE-EPMA). Various types of IMCs such as (Cu1-x,Agx)6Sn5, (Cu1-y,Agy)3Sn, and (Ag1-z,Cuz)3Sn were observed. In addition to conventional I-V measurements by a special sample preparation technique, a scanning electron microscope (SEM) internal probing system was introduced to evaluate the electrical characteristics in the IMCs after various test conditions. The electrical data would be correlated to microstructural evolution due to the interfacial reaction between the solder and under-bump metallurgy (UBM). This study demonstrated the successful employment of an internal nanoprobing approach, which would help further understanding of the electrical behavior within an IMC layer in the solder/UBM assembly.

  8. Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/ Pd/ Au surface finishes

    International Nuclear Information System (INIS)

    NorAkmal, F.; Ourdjini, A.; Azmah Hanim, M.A.; Siti Aisha, I.; Chin, Y.T.

    2007-01-01

    Flip chip technology provides the ultimate in high I/ O-density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) which is widely used in electronics packaging as surface finish for flip-chip application nowadays. In this research, field emission scanning electron microscopy (FESEM) analysis was conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between the SAC lead-free solder with Cu surface finish after reflow were mainly (Cu, Ni) 6 Sn 5 and Cu 6 Sn 5 . While the main IMCs formed between lead-free solder on ENEPIG surface finish are (Ni, Cu) 3 Sn 4 and Ni 3 Sn 4 . The results from FESEM with energy dispersive x-ray (EDX) have revealed that isothermal aging at 150 degree Celsius has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated was found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. (author)

  9. Local microstructures, Hardness and mechanical properties of a stainless steel pipe-welded joint

    International Nuclear Information System (INIS)

    Zhao Yongxiang; Gao Qing; Cai Lixun

    2000-01-01

    An experimental investigation is carefully performed into the local microstructures, hardness values and monotonic mechanical properties of the three zones (the base metal, heat affecting zone and weld metal) of 1Cr18Ni9Ti stainless steel pipe-welded joint. The local microstructures are observed by a metallurgical test and a surface replica technology, the local hardness values are measures by a random Vickers hardness test, and the local mechanical properties are characterized by the Ramberg-Osgood and modified Ramberg-Osgood stress-stain relations. The investigation reveals that there are significant differences of the three zones in the local microstructures, hardness values and monotonic mechanical properties, especially of the three zones in the local microstructure, hardness values and monotonic mechanical properties, especially of the weld metal. The weld metal exhibits the largest heterogeneity of local microstructures and monotonic mechanical properties, and the largest scatter of local hardness values. It is necessary to consider these difference and introduce the reliability method to model the scatter in the pipe analysis. In addition, it is verified that a columnar grain structure, which is made up of matrix-rich δ ferrite bands, can characterize the weld metal and the distance between the neighboring rich δ ferrite bands is an appropriate measurement of the columnar grain structure. This measurement is in accordance with the transition point between the microstructural short crack and physical small crack stages, which are generally used for characterizing the short fatigue crack behavior of materials. This indicates that the microstructure controls the fatigue damage character of the present material

  10. Influences of Nozzle Material on Laser Droplet Brazing Joints with Cu89Sn11 Preforms

    Science.gov (United States)

    Stein, Stefan; Heberle, Johannes; Gürtler, Franz Josef; Cvecek, Kristian; Roth, Stephan; Schmidt, Michael

    This paper presents latest results on the influences of nozzle material and geometry on the electromechanical contacting of sensitive piezoceramic actuator modules. Two nozzle types have been investigated,a standard WC/Co nozzle which is used for soldering applications and a novelceramic nozzle. Applications for active piezoceramic components integrated in structural parts are e.g. active damping, energy harvesting, or monitoring of vibrations and material failure. Anup to now unsolved problem is the electrical contacting of such components without damaging the conductor or the metallization of the ceramic substrate. Since piezoelectric components are to be integrated into structures made of casted aluminum, requirements are high mechanical strength and temperature resistance. Within this paper a method forcontacting piezoceramic modules is presented. A spherical braze preform of tin bronze Cu89Sn11 with a diameter of 600 μm is located in a ceramic nozzle and is subsequently melted by a laser pulse. The liquid solder is ejected from the nozzlevia nitrogen overpressure and wets the surface of the metallization pad and the Cu-wire, resulting in a brazing joint after solidification. The process is called laser droplet brazing (LDB). To asses the thermal evolution during one cycle WC/Co and ZTA have been simulated numerically for two different geometries enabling a proposition weather the geometry or the material properties have a significant influence on the thermal load during one cycle. To evaluate the influence of the nozzle on the joint the positioning accuracy, joint height and detachment times have been evaluated. Results obtained with the ZTA nozzle show comparable positioning accuracies to a WC/Co nozzle with a lower standard deviation of solder detachment time.

  11. Microstructural and mechanical behaviors of nano-SiC-reinforced AA7075-O FSW joints prepared through two passes

    Energy Technology Data Exchange (ETDEWEB)

    Bahrami, Mohsen, E-mail: Mohsen.bahrami@aut.ac.ir [Faculty of Mining and Materials Engineering, Amirkabir University of Technology (AUT), Hafez Aveenue, Tehran (Iran, Islamic Republic of); Farahmand Nikoo, Mohsen [Faculty of Mining and Materials Engineering, Amirkabir University of Technology (AUT), Hafez Aveenue, Tehran (Iran, Islamic Republic of); Besharati Givi, Mohammad Kazem [Department of Mechanical Engineering, University of Tehran, Tehran (Iran, Islamic Republic of)

    2015-02-25

    In this paper, a threaded tapered pin tool was employed to fabricate a 2-pass friction stir welded (FSWed) joint. To investigate the benefits of nano-sized SiC particles on microstructural and mechanical properties of the joint, the experiment was repeated while SiC particles had been inserted along the joint line. In another joint, a square pin tool was applied in the second pass to evaluate the effectiveness of switching pin geometry between passes on the aforementioned properties. Microstructural features including grain size, second phase particles and reinforcement distribution were examined via optical and scanning electron microscopy (SEM) techniques. In addition to satisfactory connections between SiC particles and the matrix, the most homogenous particles distribution was observed in the specimen FSWed with both pin tools. This observation was further supported by atomic force microscopy (AFM) examination. Additionally, the foregoing joint demonstrated the maximum tensile strength which was synonymous with its smallest grain size. During tensile testing, SiC-free joint and SiC-reinforced ones fractured from stir zone (SZ) and base metal, respectively. Moreover, SiC-free joint showed necking phenomenon. SEM results showed that the SiC-reinforced specimens possessed ductile fracture morphologies. On the other hand, SiC-free specimen showed a quasi-cleavage fracture mode confirming its moderate percent elongation. In the meantime, SiC-reinforced specimens exhibited superior hardness level to SiC-free specimen.

  12. Microstructure and Mechanical Properties of Stainless Steel/Brass Joints Brazed by Sn-Electroplated Ag Brazing Filler Metals

    Science.gov (United States)

    Wang, Xingxing; Peng, Jin; Cui, Datian

    2018-05-01

    To develop a high-Sn-content AgCuZnSn brazing filler metal, the BAg50CuZn was used as the base filler metal and a Sn layer was electroplated upon it. Then, the 304 stainless steel and the H62 brass were induction-brazed with the Sn-plated brazing filler metals. The microstructures of the joints were examined with an optical microscope, a scanning electron microscope and an x-ray diffractometer. The corresponding mechanical properties were obtained with a universal tensile testing machine. The results indicated that the induction brazed joints consisted of the Ag phase, the Cu phase and the CuZn phase. When the content of Sn in the Sn-plated Ag brazing filler metal was 6.0 or 7.2 wt.%, the Cu5Zn8, the Cu41Sn11 and the Ag3Sn phases appeared in the brazed joint. The tensile strength of the joints brazed with the Sn-plated filler metal was higher compared to the joints with the base filler metal. When the content of Sn was 6.0 wt.%, the highest tensile strength of the joint reached to 395 MPa. The joint fractures presented a brittle mode, mixed with a low amount of ductile fracture, when the content of Sn exceeded 6.0 wt.%.

  13. Enhancement of mechanical properties and corrosion resistance of friction stir welded joint of AA2014 using water cooling

    Energy Technology Data Exchange (ETDEWEB)

    Sinhmar, S., E-mail: sinhmarsunil88@gmail.com; Dwivedi, D.K.

    2017-01-27

    An investigation on the microstructure, mechanical properties, and corrosion behavior of friction stir welded joint of AA2014 in natural cooled (NC) and water cooled (WC) conditions have been reported. Optical microscopy, field emission scanning electron microscopy (FESEM) with Energy dispersive X-ray spectroscopy (EDS), Vicker's microhardness, tensile testing, X-ray diffraction (XRD), and electrochemical potentiodynamic polarization corrosion test (Tafel curve) were carried out to characterize the friction stir weld joints in both the cooling conditions. Water cooling resulted in higher strength and microhardness of friction stir weld joint compared to the natural cooling. The width of heat affected zone was reduced by the use of water cooling during friction stir welding (FSW) and minimum hardness zone was shifted towards weld center. The corrosion test was performed in 3.5% NaCl solution. Corrosion resistance of water cooled joint was found higher than natural cooled FSW joint. The precipitation behavior of weld nugget and heat affected zone impacts the corrosion resistance of FSW joint of AA 2014. Hardness, tensile, and corrosion properties of FSW joints produced under NC and WC conditions have been discussed in the light of microstructure.

  14. Enhancement of mechanical properties and corrosion resistance of friction stir welded joint of AA2014 using water cooling

    International Nuclear Information System (INIS)

    Sinhmar, S.; Dwivedi, D.K.

    2017-01-01

    An investigation on the microstructure, mechanical properties, and corrosion behavior of friction stir welded joint of AA2014 in natural cooled (NC) and water cooled (WC) conditions have been reported. Optical microscopy, field emission scanning electron microscopy (FESEM) with Energy dispersive X-ray spectroscopy (EDS), Vicker's microhardness, tensile testing, X-ray diffraction (XRD), and electrochemical potentiodynamic polarization corrosion test (Tafel curve) were carried out to characterize the friction stir weld joints in both the cooling conditions. Water cooling resulted in higher strength and microhardness of friction stir weld joint compared to the natural cooling. The width of heat affected zone was reduced by the use of water cooling during friction stir welding (FSW) and minimum hardness zone was shifted towards weld center. The corrosion test was performed in 3.5% NaCl solution. Corrosion resistance of water cooled joint was found higher than natural cooled FSW joint. The precipitation behavior of weld nugget and heat affected zone impacts the corrosion resistance of FSW joint of AA 2014. Hardness, tensile, and corrosion properties of FSW joints produced under NC and WC conditions have been discussed in the light of microstructure.

  15. Influence of groove size and reinforcements addition on mechanical properties and microstructure of friction stir welded joints

    Science.gov (United States)

    Reddy Baridula, Ravinder; Ibrahim, Abdullah Bin; Yahya, Che Ku Mohammad Faizal Bin Che Ku; Kulkarni, Ratnakar; Varma Ramaraju, Ramgopal

    2018-03-01

    The butt joints fabricated by friction stir welding were found to have more strength than the joints obtained by conventional joining process. The important outcome of this process is the successful fabrication of surface composites with improved properties. Thus in order to further enhance the strength of the dissimilar alloy joints the reinforcements can be deposited in to the aluminium matrix during the process of friction stir welding. In the present study the multi-walled carbon nanotubes were embedded in to the groove by varying the width during joining of dissimilar alloys AA2024 and AA7075. Four widths were selected with constant depth and optimum process parameters were selected to fabricate the sound welded joints. The results show that the mechanical properties of the fabricated butt joints were influenced by the size of the groove, due to variation in the deposition of reinforcement in the stir zone. The microstructural study and identification of the elements of the welded joints show that the reinforcements deposition is influenced by the size of the groove. It has also been observed that the groove with minimum width is more effective than higher width. The mechanical properties are found to be improved due to the pinning of grain boundaries.

  16. Effects of Amplitude Variations on Deformation and Damage Evolution in SnAgCu Solder in Isothermal Cycling

    Science.gov (United States)

    Wentlent, Luke; Alghoul, Thaer M.; Greene, Christopher M.; Borgesen, Peter

    2018-02-01

    Although apparently simpler than in thermal cycling, the behavior of SnAgCu (SAC) solder joints in cyclic bending or vibration is not currently well understood. The rate of damage has been shown to scale with the inelastic work per cycle, and excursions to higher amplitudes lead to an apparent softening, some of which remains so that damage accumulation is faster in subsequent cycling at lower amplitudes. This frequently leads to a dramatic breakdown of current damage accumulation rules. An empirical damage accumulation rule has been proposed to account for this, but any applicability to the extrapolation of accelerated test results to life under realistic long-term service conditions remains to be validated. This will require a better understanding of the underlying mechanisms. The present work provides experimental evidence to support recent suggestions that the observed behavior is a result of cycling-induced dislocation structures providing for increased diffusion creep. It is argued that this means that the measured work is an indicator of the instantaneous dislocation density, rather than necessarily reflecting the actual work involved in the creation of the damage.

  17. A coupled mechanical-hydrological methodology for modeling flow in jointed rock masses using laboratory data for the joint flow model

    International Nuclear Information System (INIS)

    Voss, C.F.; Bastian, R.J.; Shotwell, L.R.

    1986-01-01

    Pacific Northwest Laboratory (PNL) currently supports the U.S. Department of Energy's Office of Civilian Radioactive Waste Management in developing and evaluating analytical methods for assessing the suitability of sites for geologic disposal of high-level radioactive waste. The research includes consideration of hydrological, geomechanical, geochemical, and waste package components and the evaluation of the degree of coupling that can occur between two or more of these components. The PNL effort and those of other research groups investing potential waste sites in the U.S. and abroad are producing a suite of computer codes to analyze the long-term performance of the proposed repository sites. This paper summarizes the ongoing research in rock mechanics at PNL involving flow through jointed rock. The objective of this research is to develop a methodology for modeling the coupled mechanical-hydrological process of flow through joints and then attempt to validate a ''simple'' model using small-scale laboratory test data as a basis for judging whether the approach has merit. This paper discusses the laboratory tests being conducted to develop a joint behavioral constitutive model for the numerical method under development and the modeling approach being considered

  18. Joint Source Location and Focal Mechanism Inversion: efficiency, accuracy and applications

    Science.gov (United States)

    Liang, C.; Yu, Y.

    2017-12-01

    The analysis of induced seismicity has become a common practice to evaluate the results of hydraulic fracturing treatment. Liang et al (2016) proposed a joint Source Scanning Algorithms (jSSA for short) to obtain microseismic events and focal mechanisms simultaneously. The jSSA is superior over traditional SSA in many aspects, but the computation cost is too significant to be applied in real time monitoring. In this study, we have developed several scanning schemas to reduce computation time. A multi-stage scanning schema is proved to be able to improve the efficiency significantly while also retain its accuracy. A series of tests have been carried out by using both real field data and synthetic data to evaluate the accuracy of the method and its dependence on noise level, source depths, focal mechanisms and other factors. The surface-based arrays have better constraints on horizontal location errors (0.5). For sources with varying rakes, dips, strikes and depths, the errors are mostly controlled by the partition of positive and negative polarities in different quadrants. More evenly partitioned polarities in different quadrants yield better results in both locations and focal mechanisms. Nevertheless, even with bad resolutions for some FMs, the optimized jSSA method can still improve location accuracies significantly. Based on much more densely distributed events and focal mechanisms, a gridded stress inversion is conducted to get a evenly distributed stress field. The full potential of the jSSA has yet to be explored in different directions, especially in earthquake seismology as seismic array becoming incleasingly dense.

  19. Microstructure and mechanical properties of GTAW welded joints of AA6105 aluminum alloy

    Directory of Open Access Journals (Sweden)

    Minerva Dorta-Almenara

    2016-09-01

    Full Text Available Gas Tungsten Arc Welding (GTAW is one of the most used methods to weld aluminum. This work investigates the influence of welding parameters on the microstructure and mechanical properties of GTAW welded AA6105 aluminum alloy joints. AA6105 alloy plates with different percent values of cold work were joined by GTAW, using various combinations of welding current and speed. The fusion zone, in which the effects of cold work have disappeared, and the heat affected zone of the welded samples were examined under optical and scanning electron microscopes, additionally, mechanical tests and measures of Vickers microhardness were performed. Results showed dendritic morphology with solute micro- and macrosegregation in the fusion zone, which is favored by the constitutional supercooling when heat input increases. When heat input increased and welding speed increased or remained constant, greater segregation was obtained, whereas welding speed decrease produced a coarser microstructure. In the heat affected zone recrystallization, dissolution, and coarsening of precipitates occurred, which led to variations in hardness and strength.

  20. The thumb carpometacarpal joint: curvature morphology of the articulating surfaces, mathematical description and mechanical functioning.

    Science.gov (United States)

    Dathe, Henning; Dumont, Clemens; Perplies, Rainer; Fanghänel, Jochen; Kubein-Meesenburg, Dietmar; Nägerl, Hans; Wachowski, Martin M

    2016-01-01

    The purpose is to present a mathematical model of the function of the thumb carpometacarpal joint (TCMCJ) based on measurements of human joints. In the TCMCJ both articulating surfaces are saddle-shaped. The aim was to geometrically survey the shapes of the articulating surfaces using precise replicas of 28 TCMCJs. None of these 56 articulating surfaces did mathematically extend the differential geometrical neighbourhood around the main saddle point so that each surface could be characterised by three main parameters: the two extreme radii of curvature in the main saddle point and the angle between the saddles' asymptotics (straight lines). The articulating surfaces, when contacting at the respective main saddle points, are incongruent. Hence, the TCMCJ has functionally five kinematical degrees of freedom (DOF); two DOF belong to flexion/extension, two to ab-/adduction. These four DOF are controlled by the muscular apparatus. The fifth DOF, axial rotation, cannot be adjusted but stabilized by the muscular apparatus so that physiologically under compressive load axial rotation does not exceed an angle of approximately ±3°. The TCMCJ can be stimulated by the muscular apparatus to circumduct. The mechanisms are traced back to the curvature incongruity of the saddle surfaces. Hence we mathematically proved that none of the individual saddle surfaces can be described by a quadratic saddle surface as is often assumed in literature. We derived an algebraic formula with which the articulating surfaces in the TCMCJ can be quantitatively described. This formula can be used to shape the articulating surfaces in physiologically equivalent TCMCJ-prostheses.

  1. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

  2. Manipulation and soldering of carbon nanotubes using atomic force microscope

    International Nuclear Information System (INIS)

    Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

    2008-01-01

    Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

  3. Effect of Mg and Cu on mechanical properties of high-strength welded joints of aluminum alloys obtained by laser welding

    Science.gov (United States)

    Annin, B. D.; Fomin, V. M.; Karpov, E. V.; Malikov, A. G.; Orishich, A. M.

    2017-09-01

    Results of experimental investigations of welded joints of high-strength aluminum-lithium alloys of the Al-Cu-Li and Al-Mg-Li systems are reported. The welded joints are obtained by means of laser welding and are subjected to various types of processing for obtaining high-strength welded joints. A microstructural analysis is performed. The phase composition and mechanical properties of the welded joints before and after heat treatment are studied. It is found that combined heat treatment of the welded joint (annealing, quenching, and artificial ageing) increases the joint strength, but appreciably decreases the alloy strength outside the region thermally affected by the welding process.

  4. Mechanical properties of a 316L/T91 weld joint tested in lead-bismuth liquid

    International Nuclear Information System (INIS)

    Serre, Ingrid; Vogt, Jean-Bernard

    2009-01-01

    The mechanical strength of T91/316L weld joint assembled by electron beam process is investigated in air and in a liquid lead bismuth bath at 300 and 380 o C using the small punch test. It is shown that the mechanical response in air of the weld joint is similar to that of the T91 base material. The plastic deformation is mainly concentrated in the T91 part of the weld joint which promotes cracking in this material. Testing in liquid lead bismuth bath results in a reduction in ductility and the formation of brittle cracks. The T91/weld interface is found to be rather resistant as it cracks late in the test and after a large crack propagated in the T91 steel.

  5. Impact of mechanism vibration characteristics by joint clearance and optimization design of its multi-objective robustness

    Science.gov (United States)

    Zeng, Baoping; Wang, Chao; Zhang, Yu; Gong, Yajun; Hu, Sanbao

    2017-12-01

    Joint clearances and friction characteristics significantly influence the mechanism vibration characteristics; for example: as for joint clearances, the shaft and bearing of its clearance joint collide to bring about the dynamic normal contact force and tangential coulomb friction force while the mechanism works; thus, the whole system may vibrate; moreover, the mechanism is under contact-impact with impact force constraint from free movement under action of the above dynamic forces; in addition, the mechanism topology structure also changes. The constraint relationship between joints may be established by a repeated complex nonlinear dynamic process (idle stroke - contact-impact - elastic compression - rebound - impact relief - idle stroke movement - contact-impact). Analysis of vibration characteristics of joint parts is still a challenging open task by far. The dynamic equations for any mechanism with clearance is often a set of strong coupling, high-dimensional and complex time-varying nonlinear differential equations which are solved very difficultly. Moreover, complicated chaotic motions very sensitive to initial values in impact and vibration due to clearance let high-precision simulation and prediction of their dynamic behaviors be more difficult; on the other hand, their subsequent wearing necessarily leads to some certain fluctuation of structure clearance parameters, which acts as one primary factor for vibration of the mechanical system. A dynamic model was established to the device for opening the deepwater robot cabin door with joint clearance by utilizing the finite element method and analysis was carried out to its vibration characteristics in this study. Moreover, its response model was carried out by utilizing the DOE method and then the robust optimization design was performed to sizes of the joint clearance and the friction coefficient change range so that the optimization design results may be regarded as reference data for selecting bearings

  6. The tensile strength of mechanical joint prototype of lontar fiber composite

    Science.gov (United States)

    Bale, Jefri; Adoe, Dominggus G. H.; Boimau, Kristomus; Sakera, Thomas

    2018-03-01

    In the present study, an experimental activity has been programmed to investigate the effect of joint prototype configuration on tensile strength of lontar (Borassus Flabellifer) fiber composite. To do so, a series of tests were conducted to establish the tensile strength of different joint prototype configuration specimen of lontar fiber composite. In addition, post observation of macroscope was used to map damage behavior. The analysis of lontar fiber composite is a challenge since the material has limited information than others natural fiber composites materials. The results shown that, under static tensile loading, the tensile strength of 13 MPa produced by single lap joint of lontar fiber composite is highest compare to 11 MPa of tensile strength generated by step lap joint and double lap joint where produced the lowest tensile strength of 6 MPa. It is concluded that the differences of tensile strength depend on the geometric dimensions of the cross-sectional area and stress distribution of each joint prototype configuration.

  7. Analytical magmatic source modelling from a joint inversion of ground deformation and focal mechanisms data

    Science.gov (United States)

    Cannavo', Flavio; Scandura, Danila; Palano, Mimmo; Musumeci, Carla

    2014-05-01

    Seismicity and ground deformation represent the principal geophysical methods for volcano monitoring and provide important constraints on subsurface magma movements. The occurrence of migrating seismic swarms, as observed at several volcanoes worldwide, are commonly associated with dike intrusions. In addition, on active volcanoes, (de)pressurization and/or intrusion of magmatic bodies stress and deform the surrounding crustal rocks, often causing earthquakes randomly distributed in time within a volume extending about 5-10 km from the wall of the magmatic bodies. Despite advances in space-based, geodetic and seismic networks have significantly improved volcano monitoring in the last decades on an increasing worldwide number of volcanoes, quantitative models relating deformation and seismicity are not common. The observation of several episodes of volcanic unrest throughout the world, where the movement of magma through the shallow crust was able to produce local rotation of the ambient stress field, introduces an opportunity to improve the estimate of the parameters of a deformation source. In particular, during these episodes of volcanic unrest a radial pattern of P-axes of the focal mechanism solutions, similar to that of ground deformation, has been observed. Therefore, taking into account additional information from focal mechanisms data, we propose a novel approach to volcanic source modeling based on the joint inversion of deformation and focal plane solutions assuming that both observations are due to the same source. The methodology is first verified against a synthetic dataset of surface deformation and strain within the medium, and then applied to real data from an unrest episode occurred before the May 13th 2008 eruption at Mt. Etna (Italy). The main results clearly indicate as the joint inversion improves the accuracy of the estimated source parameters of about 70%. The statistical tests indicate that the source depth is the parameter with the highest

  8. Microstructure and mechanical properties of similar and dissimilar joints of aluminium alloy and pure copper by friction stir welding

    Directory of Open Access Journals (Sweden)

    V.C. Sinha

    2016-09-01

    Full Text Available In the present study, the microstructure and mechanical properties of similar and dissimilar friction stir welded joints of aluminium alloy (AlA and pure copper (Cu were evaluated at variable tool rotational speeds from 150 to 900 rpm in steps of 150 rpm at 60 mm/min travel speed and constant tilt angle 2°. The interfacial microstructures of the joints were characterised by optical and scanning electron microscopy. The Al4Cu9, AlCu, Al2Cu and Al2Cu3 intermetallic compounds have been observed at the interface and stir zone region of dissimilar Al/Cu FSWed joints. Variation in the grain size was observed in the stir zone depending upon the heat input value. Axial force, traverse force and torque value were analysed with variation in tool rotational speed. Residual stresses were measured at the stir zone by X-ray diffraction technique. Maximum ultimate tensile strength of ∼75% of AlA strength for AlA–AlA joints has been obtained at 750 rpm and for Cu–Cu joint tensile strength of ∼100% of tensile strength of Cu was obtained at 300 rpm. However, for Cu–AlA joint when processed at 600 rpm tool rotational speed achieved maximum ultimate tensile strength of ∼77% of AlA.

  9. Investigation of Sn-Pb solder bumps of prototype photo detectors for the LHCb experiment

    CERN Document Server

    Delsante, M L; Arnau-Izquierdo, G

    2004-01-01

    The Large Hadron Collider (LHC) is now under construction at the European Organization for Nuclear Research (CERN). LHCb is one of the dedicated LHC experiments, allowing high energy proton-proton collisions to be exploited. This paper presents the results of the metallurgic studies carried out on Sn-Pb solder bumps of prototype vacuum photo detectors under development for LHCb, and in particular for the ring imaging Cherenkov-hybrid photo diode (RICH-HPD) project. These detectors encapsulate, in a vacuum tube, an assembly made of two silicon chips bonded together by a matrix of solder bumps. Each bump lies on a suitable system of under-bump metallic layers ensuring mechanical and electrical transition between the chip pad and the solder alloy. During manufacturing of the detector, bump-bonded (BB) assemblies are exposed to severe heat cycles up to 400 degree C inducing, in the present fabrication process, a clear degradation of electrical connectivity. Several investigations such as microstructural observati...

  10. Geometrical Comparison of Numerical Models Used in the Design and Validation of Mechanically Rolled Tube-Tubesheet Joints

    DEFF Research Database (Denmark)

    Madsen, Søren Bøgelund; Ibsen, Claus Hessler; Gervang, Bo

    2015-01-01

    The focus of this paper is the validation and comparison of simplified numerical models of the mechanical rolling process used in tube to tubesheet joints. The investigated models is an axisymmetric model and planar models with plane strain and stress. There are different pros and cons...

  11. The Joint International Conference of the XII International Conference on Mechanisms and Mechanical Transmissions (MTM) and the XXIII International Conference on Robotics (Robotics ’16)

    CERN Document Server

    Lovasz, Erwin-Christian; Hüsing, Mathias; Maniu, Inocentiu; Gruescu, Corina

    2017-01-01

    This volume presents the proceedings of the Joint International Conference of the XII International Conference on Mechanisms and Mechanical Transmissions (MTM) and the XXIII International Conference on Robotics (Robotics ’16), that was held in Aachen, Germany, October 26th-27th, 2016. It contains applications of mechanisms and transmissions in several modern technical fields such as mechatronics, biomechanics, machines, micromachines, robotics and apparatus. In connection with these fields, the work combines the theoretical results with experimental testing. The book presents reviewed papers developed by researchers specialized in mechanisms analysis and synthesis, dynamics of mechanisms and machines, mechanical transmissions, biomechanics, precision mechanics, mechatronics, micromechanisms and microactuators, computational and experimental methods, CAD in mechanism and machine design, mechanical design of robot architecture, parallel robots, mobile robots, micro and nano robots, sensors and actuators in ro...

  12. Articular surface approximation in equivalent spatial parallel mechanism models of the human knee joint: an experiment-based assessment.

    Science.gov (United States)

    Ottoboni, A; Parenti-Castelli, V; Sancisi, N; Belvedere, C; Leardini, A

    2010-01-01

    In-depth comprehension of human joint function requires complex mathematical models, which are particularly necessary in applications of prosthesis design and surgical planning. Kinematic models of the knee joint, based on one-degree-of-freedom equivalent mechanisms, have been proposed to replicate the passive relative motion between the femur and tibia, i.e., the joint motion in virtually unloaded conditions. In the mechanisms analysed in the present work, some fibres within the anterior and posterior cruciate and medial collateral ligaments were taken as isometric during passive motion, and articulating surfaces as rigid. The shapes of these surfaces were described with increasing anatomical accuracy, i.e. from planar to spherical and general geometry, which consequently led to models with increasing complexity. Quantitative comparison of the results obtained from three models, featuring an increasingly accurate approximation of the articulating surfaces, was performed by using experimental measurements of joint motion and anatomical structure geometries of four lower-limb specimens. Corresponding computer simulations of joint motion were obtained from the different models. The results revealed a good replication of the original experimental motion by all models, although the simulations also showed that a limit exists beyond which description of the knee passive motion does not benefit considerably from further approximation of the articular surfaces.

  13. The Effect of Tool Profiles on Mechanical Properties of Friction Stir Welded Al5052 T-Joints.

    Science.gov (United States)

    Kim, Byeong-Jin; Bang, Hee-Seon; Bang, Han-Sur

    2018-03-01

    Al5052 T butt joints with two skins (5 mm) and one stringer (3 mm) has been successfully welded by friction stir welding (FSW). Notably, this paper has been investigated the effect of tool shape on welded formation mechanism and mechanical properties. The used shapes of tool pin are two types which are cylinder (type 1) and frustum (type 2). Dimension on two types of tool pin shape is respectively pin length of 4.7 mm and pin diameter of frustum type of top (5 mm) and bottom (3 mm). The results of experiment show that inner defects in FSWed T-joints increase significantly in accordance with traverse speed. The maximum tensile strength of welded joint fabricated using type 1 is equivalent to 85% that of the base metal, which is approximately 10% higher than that of type 2. Because welded joint of type 1 has more smoothly plastic flow in comparison with type 2. Consequently, the results show that type 1 is better appropriate for friction stir welded Al5052 T butt joints than type 2.

  14. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  15. Effect of Stretching Combined With Ultrashort Wave Diathermy on Joint Function and Its Possible Mechanism in a Rabbit Knee Contracture Model.

    Science.gov (United States)

    Zhang, Quan Bing; Zhou, Yun; Zhong, Hua Zhang; Liu, Yi

    2018-05-01

    The aim of this study was to investigate the therapeutic effect of stretching combined with ultrashort wave on joint contracture and explore its possible mechanism. Thirty-two rabbits underwent unilateral immobilization of a knee joint at full extension to cause joint contracture. At 6 wks after immobilization, the rabbits were randomly divided into the following four groups: natural recovery group, stretching treatment group, ultrashort wave treatment group, and combined treatment group. For comparison, eight control group animals of corresponding age were also examined. The effect of stretching and ultrashort wave treatment on joint contracture was assessed by measuring the joint range of motion, evaluating the collagen deposition of joint capsule and assessing the mRNA and protein levels for transforming growth factor β1 in the joint capsule. The combined treatment group led to the best recovery of joint function. The combined treatment with stretching and ultrashort wave was more effective than stretching or ultrashort wave treatment alone against the synovial thickening of suprapatellar joint capsule, the collagen deposition of anterior joint capsule, and the elevated expression of transforming growth factor β1 in the joint capsule. Stretching combined with ultrashort wave treatment was effective in improving joint range of motion, reducing the biomechanical, histological, and molecular manifestations of joint capsule fibrosis in a rabbit model of extending joint contracture.

  16. Metallurgical and mechanical characterization of a submerged arc welded joint in a 316 type stainless steel

    International Nuclear Information System (INIS)

    Piatti, G.; Vedani, M.

    1990-01-01

    The tensile (deformation and fracture) behaviour of a multipass submerged arc welded joint Type 316 stainless steel is investigated by tests at room temperature and at 400 0 C on all-weld metal and transverse to weld (composite) specimens as well as by microstructural and compositional analyses (optical, scanning electron and transmission electron microscopy). The as-deposited metal is characterised by a systematic variation in the tensile properties across the thickness with the higher strength and the lower ductility in the weld centre. These variations are related to material variability (mainly in dislocation density) because of local dissimilarities in thermal and mechanical histories occurring during the welding process. However, the material variability in the fusion zone, although important is not so large in the present weld and it does not influence the tensile properties of the weld as a whole. Moreover, the tensile behaviour concerning the transverse to weld specimens is characterized by a supporting effect from the higher yield strength material zone (fusion zone) to the lower yield strength material zone (parent metal) justified by the different contribution of the parent metal and of the weld-deposit metal to the integral plastic strain of the specimens. (author)

  17. Mechanics of brazed joints and compliant layers in high heat flux components

    International Nuclear Information System (INIS)

    Lovato, G.; Moret, F.; Chaumat, G.; Cailletaud, G.; Pilvin, P.

    1995-01-01

    Soft layers are of great interest for the joining of dissimilar materials like beryllium, tungsten or carbone base refractory tiles for plasma interface and cooled structures made of copper or molybdenum. Soft layers reduce the residual and in-service stress/strain level without reducing the thermal capability. Thin soft layers interfaces are produced during the brazing or HIP bonding cycles. However, the numerical modelling of the mechanical effect of such soft layers remains largely inaccurate. The camber of [CFC tiles (A05, N11, N112)/Ag-Cu-Ti filler metal/OFHC or TZM substrate] assemblies is recorded during the whole brazing thermal cycle and subsequent thermal fatigue cycles using a special vertical dilatometer. An inverse method based on Finite Element modelling of the samples is used to determine the joint constitutive law. Then, by comparing experiments and FEM calculations, the effects of distributed damage of the CFC and of the strain hardening and thermal softening of OFHC on the in-service stress/strain state of the component are observed. (orig.)

  18. Mechanics of brazed joints and compliant layers in high heat flux components

    International Nuclear Information System (INIS)

    Lovato, G.; Moret, F.; Chaumat, G.

    1994-01-01

    Soft layers are of great interest for the joining of dissimilar materials like beryllium, tungsten or carbon base refractory tiles for plasma interface and cooled structures made of copper or molybdenum. Soft layers reduce the residual and in-service stress/strain level without reducing the thermal capability. Thin soft layers interfaces are produced during the brazing or HIP bonding cycles. However, the numerical modelling of the mechanical effect of such soft layers remains largely inaccurate. The camber of [CFC tiles (A05, N11, N112)/Ag-Cu-Ti filler metal/OFHC or TZM substrate] assemblies is recorded during the whole brazing thermal cycle and subsequent thermal fatigue cycles using a special vertical dilatometer. An inverse method based on Finite Element modelling of the samples is used to determine the joint constitutive law. Then, by comparing experiments and FEM calculations, the effects of distributed damage of the CFC and of the strain hardening and thermal softening of OFHC on the in-service stress/strain state of the component are observed. (authors). 5 refs., 7 figs

  19. Analysis of microstructure and mechanical properties of aluminium-copper joints welded by FSW process

    Science.gov (United States)

    Iordache, M.; Sicoe, G.; Iacomi, D.; Niţu, E.; Ducu, C.

    2017-08-01

    The research conducted in this article aimed to check the quality of joining some dissimilar materials Al-Cu by determining the mechanical properties and microstructure analysis. For the experimental measurements there were used tin alloy Al - EN-AW-1050A with a thickness of 2 mm and Cu99 sheet with a thickness of 2 mm, joined by FSW weld overlay. The main welding parameters were: rotating speed of the rotating element 1400 rev/min, speed of the rotating element 50 mm/min. The experimental results were determined on samples specially prepared for metallographic analysis. In order to prepare samples for their characterization, there was designed and built a device that allowed simultaneous positioning and fixing for grinding. The characteristics analyzed in the joint welded samples were mictrostructure, microhardness and residual stresses. The techniques used to determine these characteristics were optical microscopy, electron microscopy with fluorescence radioactive elemental analysis (EDS), Vickers microhardness line - HV0.3 and X-ray diffractometry.

  20. Microstructure and mechanical characteristics of a laser welded joint in SA508 nuclear pressure vessel steel

    Energy Technology Data Exchange (ETDEWEB)

    Guo, Wei, E-mail: wei.guo-2@manchester.ac.uk [Laser Processing Research Centre, School of Mechanical, Aerospace and Civil Engineering, University of Manchester, Sackville Street, Manchester, M13 9 PL (United Kingdom); Dong, Shiyun [Laser Processing Research Centre, School of Mechanical, Aerospace and Civil Engineering, University of Manchester, Sackville Street, Manchester, M13 9 PL (United Kingdom); Institute of Laser Engineering, Beijing University of Technology, Beijing 100124 (China); Guo, Wei; Francis, John A.; Li, Lin [Laser Processing Research Centre, School of Mechanical, Aerospace and Civil Engineering, University of Manchester, Sackville Street, Manchester, M13 9 PL (United Kingdom)

    2015-02-11

    SA508 steels are typically used in civil nuclear reactors for critical components such as the reactor pressure vessel. Nuclear components are commonly joined using arc welding processes, but with design lives for prospective new build projects exceeding 60 years, new welding technologies are being sought. In this exploratory study, for the first time, autogenous laser welding was carried out on 6 mm thick SA508 Cl.3 steel sheets using a 16 kW fiber laser system operating at a power of 4 kW. The microstructure and mechanical properties (including microhardness, tensile strength, elongation, and Charpy impact toughness) were characterized and the microstructures were compared with those produced through arc welding. A three-dimensional transient model based on a moving volumetric heat source model was also developed to simulate the laser welding thermal cycles in order to estimate the cooling rates included by the process. Preliminary results suggest that the laser welding process can produce welds that are free of macroscopic defects, while the strength and toughness of the laser welded joint in this study matched the values that were obtained for the parent material in the as-welded condition.

  1. Influence of Friction Stir Welding on Mechanical Properties of Butt Joints of AZ61 Magnesium Alloy

    Directory of Open Access Journals (Sweden)

    Seung-Ju Sun

    2017-01-01

    Full Text Available In this study, the effect of heat input on the mechanical properties and fracture behaviors of AZ61 magnesium alloy joints has been studied. Magnesium alloy AZ61 plates with thickness of 5 mm were welded at different ratios of tool rotational speed to welding speed (ω/ν. The average ultimate tensile strength of all weld conditions satisfying a ω/ν ratio of 3 reached 100% of the strength of the base material. Fractures occurred at the interface between the thermomechanical affected zone at advancing side and the stir zone in all welded specimens. From the scanning electron microscope and electron backscatter diffraction analysis, it was determined that the interface between the thermomechanical affected zone and the stir zone, which is the region where the grain orientation changes, was the weakest part; the advancing side region was relatively weaker than the retreating side region because the grain orientation change occurred more dramatically in the advancing side region.

  2. Identification of mechanical properties of weld joints of AlMgSi07.F25 aluminium alloy

    Directory of Open Access Journals (Sweden)

    P. Kopas

    2017-01-01

    Full Text Available The aim of this paper is to present the analysis of selected mechanical properties of weld joints of AlMgSi07.F25 aluminium alloy. We will focus on the influence of the test bar neck shape on the tensile strength characteristics and the course of hardness in the weld joint cross-section. For the welding process using TIG (Tungsten Inert Gas technology we considered AlSi5 as the additive material. This paper also includes a short study of numerical modelling of the test bar welding.

  3. Etude Climat no. 33 'Joint Implementation: a frontier mechanism within the borders of an emissions cap'

    International Nuclear Information System (INIS)

    Shishlov, Igor; Bellassen, Valentin; Leguet, Benoit

    2012-01-01

    Among the publications of CDC Climat Research, 'Climate Reports' offer in-depth analyses on a given subject. This issue addresses the following points: Based on specific projects rather than economy-wide emissions reductions, and driven by the demand from the installations covered by the European Union Emissions Trading Scheme (EU ETS), Joint Implementation (JI) turned out to be a largely private sector mechanism. Besides attracting private investors in GHG abatement projects, JI creates an opportunity for countries to exploit the arbitrage price spread between different carbon offsets: Emission Reduction Units (ERU), the credits issued from JI projects, trade with a premium of up to 50% over Assigned Amount Units (AAU), the country-level carbon allowances. Some countries, like for instance Ukraine, quickly realized the added value of JI and boosted its development, while in others, like Russia, JI lacked political support and efficient frameworks took time to be established. According to the ERU supply forecasting model developed by CDC Climat Research, Annex I countries are expected to generate up to 356 million ERUs for the first Kyoto commitment period. Around 80% of these credits shall originate from Russia and Ukraine, and up to 70 million shall be generated from countries participating in the EU ETS. Within the EU, JI has been used as a 'frontier mechanism': JI projects mostly explored abatement opportunities not covered by the scheme and, as highlighted by the case of nitrous oxide emissions from the production of nitric acid, played an important role in identifying abatement technologies and providing information to extend the scope of the EU ETS. One of the most complex issues related to JI is the practice of additionality. The cases of France and Ukraine demonstrate that the stakes associated with additionality may differ depending on a country's compliance position. In Ukraine, additionality was not perceived as a significant economic risk due to a

  4. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2009-03-01

    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  5. Tensile strength of two soldered alloys (Minalux and Verabond2

    Directory of Open Access Journals (Sweden)

    Mir Mohammad Rezaee S

    2002-07-01

    Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

  6. Lead-free solder technology transfer from ASE Americas

    Energy Technology Data Exchange (ETDEWEB)

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  7. Influence of PC-GTAW Parameters on the Microstructural and Mechanical Properties of Thin AISI 1008 Steel Joints

    Science.gov (United States)

    Kumar, Ravindra; Anant, Ramkishor; Ghosh, P. K.; Kumar, Ankit; Agrawal, B. P.

    2016-09-01

    Butt weld joints are prepared using pulse current gas tungsten arc welding out of thin sheets of AISI 1008 steel using various combinations of pulse parameters. During welding, the welding speed was kept high, but with the increase of welding speed the mean current was also increased to get the required weld joint at the constant heat input. The use of pulse current has led to improvement in mechanical and metallurgical properties of weld joints. It has resulted in less development of humping which is a common problem with high-speed welding. The undercut or dipped weld face is not observed severe. The tensile strength and hardness are enhanced by 12.5 and 12%. The increase of tensile strength and hardness is justified through TEM micrograph showing the presence of dislocation.

  8. Microstructure and Mechanical Properties of Laser Welded Joints of DZ125L and IN718 Nickel Base Superalloys

    Science.gov (United States)

    Liang, Taosha; Wang, Lei; Liu, Yang; Song, Xiu

    2018-05-01

    The microstructure and mechanical properties of the laser welded joint of DZ125L and IN718 nickel base superalloys were investigated. The results show that the fusion zone (FZ) mainly consists of fine dendrite structure with fine γ', Laves phases and MC carbides inhomogeneously distributed. The high welding temperature induces the partial dissolution of γ' in the heat-affected zone (HAZ) of DZ125L and liquation of grain boundaries in both of the HAZs. After post-weld heat treatment (PWHT), fine γ″ and γ' phases precipitate in the FZ, IN718 HAZ and IN718 base metal (BM), and fine γ' precipitate in the γ channel of the HAZ and BM of DZ125L. With tensile testing, the joints after PWHT show higher strengths than that of the weaker DZ125L alloy. Plastic deformation mainly concentrates in the weaker DZ125L and the joint finally fails in the DZ125L BM.

  9. Microstructure and mechanical properties of friction stir lap welded Mg/Al joint assisted by stationary shoulder

    Science.gov (United States)

    Ji, Shude; Li, Zhengwei

    2017-11-01

    Using magnesium alloy as upper sheet, 3 mm-thick AZ31 magnesium alloy and 6061 aluminum alloy were joined using friction stir lap welding assisted by stationary shoulder. The effects of tool rotating speed on cross-sections, microstructure and mechanical properties of Mg/Al lap joints were mainly discussed. Results showed that stationary shoulder contributed to joint formation, by which stir zones (SZ) were characterized by big onion rings after welding. Because of the big forging force exerted by stationary shoulder, the upper region of hook was well bonded. SZ showed much higher hardness because of intermetallic compounds (IMCs). The bonding conditions at the base material (BM)/SZ interface at advancing side and the hook region played important roles on joint lap shear properties. The X-ray diffraction pattern analysis revealed that the main IMCs were Al3Mg2 and Al12Mg17.

  10. Microstructure and mechanical properties of resistance-spot-welded joints for A5052 aluminum alloy and DP 600 steel

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Jianbin [College of Automotive Collaborative Innovation Center, Chongqing University, No. 174, Shazheng Street, Shapingba District, Chongqing 400044 (China); Yuan, Xinjian, E-mail: xinjianyuan@yahoo.com [College of Materials Science and Engineering, Chongqing University, No. 174, Shazheng Street, Shapingba District, Chongqing 400044 (China); Hu, Zhan; Sun, Changzheng; Zhang, Yanxin; Zhang, Yuxuan [College of Materials Science and Engineering, Chongqing University, No. 174, Shazheng Street, Shapingba District, Chongqing 400044 (China)

    2016-10-15

    The microstructure and mechanical properties of resistance-spot-welded A5052 aluminum alloy and DP 600 dual-phase steel joint were studied. The fusion zone (FZ) and heat-affected zone (HAZ) of DP 600 exhibited lath martensite and ferrite-martensite structures, respectively. The microstructure of FZ and HAZ in the A5052 side was composed of cellular crystals and the boundary region of FZ exhibited a columnar crystal morphology. A Fe{sub 2}Al{sub 5} intermetallic compound (IMC) layer with 3.3 μm thickness was found adjacent to the DP 600 side, whereas a needle-shaped Fe{sub 4}Al{sub 13} IMC layer with length of 0.67 μm to 15.8 μm was found adjacent to the aluminum alloy side. The maximum tensile shear load of the A5052/DP 600 joint was 5.5 KN, with a corresponding molten nugget diameter of 6.3 mm. The fracture morphology of the optimized A5052/DP 600 joint was mainly an elongated dimple fracture accompanied by cleavage fracture. - Highlights: •A5052 and DP 600 with large gaps in properties were investigated by RSW. •The microstructures of RSW joints in DP 600/A5052 were examined detailedly. •The micro/macro-characteristics and strength relations of joints were analyzed.

  11. Mechanical Integrity Issues at MCM-Cs for High Reliability Applications

    International Nuclear Information System (INIS)

    Morgenstern, H.A.; Tarbutton, T.J.; Becka, G.A.; Uribe, F.; Monroe, S.; Burchett, S.

    1998-01-01

    During the qualification of a new high reliability low-temperature cofired ceramic (LTCC) multichip module (MCM), two issues relating to the electrical and mechanical integrity of the LTCC network were encountered while performing qualification testing. One was electrical opens after aging tests that were caused by cracks in the solder joints. The other was fracturing of the LTCC networks during mechanical testing. Through failure analysis, computer modeling, bend testing, and test samples, changes were identified. Upon implementation of all these changes, the modules passed testing, and the MCM was placed into production

  12. Mechanical Description of a Hyper-Redundant Robot Joint Mechanism Used for a Design of a Biomimetic Robotic Fish

    Directory of Open Access Journals (Sweden)

    M. O. Afolayan

    2012-01-01

    Full Text Available A biologically inspired robot in the form of fish (mackerel model using rubber (as the biomimetic material for its hyper-redundant joint is presented in this paper. Computerized simulation of the most critical part of the model (the peduncle shows that the rubber joints will be able to take up the stress that will be created. Furthermore, the frequency-induced softening of the rubber used was found to be critical if the joints are going to oscillate at frequency above 25 Hz. The robotic fish was able to attain a speed of 0.985 m/s while the tail beats at a maximum of 1.7 Hz when tested inside water. Furthermore, a minimum turning radius of 0.8 m (approximately 2 times the fish body length was achieved.

  13. Expecting ankle tilts and wearing an ankle brace influence joint control in an imitated ankle sprain mechanism during walking.

    Science.gov (United States)

    Gehring, Dominic; Wissler, Sabrina; Lohrer, Heinz; Nauck, Tanja; Gollhofer, Albert

    2014-03-01

    A thorough understanding of the functional aspects of ankle joint control is essential to developing effective injury prevention. It is of special interest to understand how neuromuscular control mechanisms and mechanical constraints stabilize the ankle joint. Therefore, the aim of the present study was to determine how expecting ankle tilts and the application of an ankle brace influence ankle joint control when imitating the ankle sprain mechanism during walking. Ankle kinematics and muscle activity were assessed in 17 healthy men. During gait rapid perturbations were applied using a trapdoor (tilting with 24° inversion and 15° plantarflexion). The subjects either knew that a perturbation would definitely occur (expected tilts) or there was only the possibility that a perturbation would occur (potential tilts). Both conditions were conducted with and without a semi-rigid ankle brace. Expecting perturbations led to an increased ankle eversion at foot contact, which was mediated by an altered muscle preactivation pattern. Moreover, the maximal inversion angle (-7%) and velocity (-4%), as well as the reactive muscle response were significantly reduced when the perturbation was expected. While wearing an ankle brace did not influence muscle preactivation nor the ankle kinematics before ground contact, it significantly reduced the maximal ankle inversion angle (-14%) and velocity (-11%) as well as reactive neuromuscular responses. The present findings reveal that expecting ankle inversion modifies neuromuscular joint control prior to landing. Although such motor control strategies are weaker in their magnitude compared with braces, they seem to assist ankle joint stabilization in a close-to-injury situation. Copyright © 2013 Elsevier B.V. All rights reserved.

  14. Development of HIP bonding procedure and mechanical properties of HIP bonded joints for reduced activation ferritic steel F-82H

    International Nuclear Information System (INIS)

    Oda, Masahiro; Kurasawa, Toshimasa; Kuroda, Toshimasa; Hatano, Toshihisa; Takatsu, Hideyuki

    1997-03-01

    Structural materials of blanket components in fusion DEMO reactors will receive a neutron wall load more than 3-5MW/m 2 as well as exposed by surface heat flux more than 0.5MW/m 2 . A reduced activation ferritic steel F-82H has been developed by JAERI in collaboration with NKK from viewpoints of resistance for high temperature and neutron loads and lower radioactivity. This study intends to obtain basic performance of F-82H to establish the fabrication procedure of the first wall and blanket box by using Hot Isostatic Pressing (HIP) bonding. Before HIP bonding tests, effects of heat treatment temperature and surface roughness on mechanical properties of joints were investigated in the heat treatment tests and diffusion bonding tests, respectively. From these results, the optimum HIP bonding conditions and the post heat treatment were selected. Using these conditions, the HIP bonding tests were carried out to evaluate HIP bondability and to obtain mechanical properties of the joints. Sufficient HIP bonding performance was obtained under the temperature of 1040degC, the compressive stress of 150MPa, the holding time of 2h, and the surface roughness ∼μ m. Mechanical properties of HIP bonded joints with these conditions were similar to those of as-received base metal. An oxide formation on the surface to be bonded would need to be avoided for sufficient bonding. The bonding ratio, Charpy impact value and fatigue performance of the joints strongly depended on the HIP conditions, especially temperature, while micro-structure, Vickers hardness and tensile properties had little dependence on the HIP temperature. The surface roughness strongly affected the bonding ratio and would be required to be in the level of a few μ m. In the HIP bonding test of the welded material, the once-melted surface could be jointed by the HIP bonding under the above-mentioned procedure. (J.P.N.)

  15. Jointly Feature Learning and Selection for Robust Tracking via a Gating Mechanism.

    Directory of Open Access Journals (Sweden)

    Bineng Zhong

    Full Text Available To achieve effective visual tracking, a robust feature representation composed of two separate components (i.e., feature learning and selection for an object is one of the key issues. Typically, a common assumption used in visual tracking is that the raw video sequences are clear, while real-world data is with significant noise and irrelevant patterns. Consequently, the learned features may be not all relevant and noisy. To address this problem, we propose a novel visual tracking method via a point-wise gated convolutional deep network (CPGDN that jointly performs the feature learning and feature selection in a unified framework. The proposed method performs dynamic feature selection on raw features through a gating mechanism. Therefore, the proposed method can adaptively focus on the task-relevant patterns (i.e., a target object, while ignoring the task-irrelevant patterns (i.e., the surrounding background of a target object. Specifically, inspired by transfer learning, we firstly pre-train an object appearance model offline to learn generic image features and then transfer rich feature hierarchies from an offline pre-trained CPGDN into online tracking. In online tracking, the pre-trained CPGDN model is fine-tuned to adapt to the tracking specific objects. Finally, to alleviate the tracker drifting problem, inspired by an observation that a visual target should be an object rather than not, we combine an edge box-based object proposal method to further improve the tracking accuracy. Extensive evaluation on the widely used CVPR2013 tracking benchmark validates the robustness and effectiveness of the proposed method.

  16. Microstructures and mechanical properties of magnesium alloy and stainless steel weld-joint made by friction stir lap welding

    International Nuclear Information System (INIS)

    Wei, Yanni; Li, Jinglong; Xiong, Jiangtao; Huang, Fu; Zhang, Fusheng

    2012-01-01

    Highlights: → Friction stir lap welding technology with cutting pin was successfully employed to form lap joint of magnesium and steel. → The cutting pin made the lower steel participate in deformation and the interface was no longer flat. → A saw-toothed structure formed due to a mechanical mixing of the magnesium and steel was found at the interface. → A high-strength joint was produced which fractured in the magnesium side. -- Abstract: Friction stir lap welding was conducted on soft/hard metals. A welding tool was designed with a cutting pin of rotary burr made of tungsten carbide, which makes the stirring pin possible to penetrate and cut the surface layer of the hard metal. Magnesium alloy AZ31 and stainless steel SUS302 were chosen as soft/hard base metals. The structures of the joining interface were analyzed by scanning electron microscopy (SEM). The joining strength was evaluated by tensile shear test. The results showed that flower-like interfacial morphologies were presented with steel flashes and scraps, which formed bonding mechanisms of nail effect by long steel flashes, zipper effect by saw-tooth structure and metallurgical bonding. The shear strength of the lap joint falls around the shear strength of butt joint of friction stir welded magnesium alloy.

  17. Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

    Science.gov (United States)

    Kim, Youngsoon; Lee, Seyong; Shin, Ji-won; Paik, Kyung-Wook

    2016-06-01

    While solder bumps have been used as the bump structure to form the interconnection during the last few decades, the continuing scaling down of devices has led to a change in the bump structure to Cu-pillar/Sn-Ag micro-bumps. Cu-pillar/Sn-Ag micro-bump interconnections differ from conventional solder bump interconnections in terms of their assembly processing and reliability. A thermo-compression bonding method with pre-applied b-stage non-conductive films has been adopted to form solder joints between Cu pillar/Sn-Ag micro bumps and printed circuit board vehicles, using various pad metal finishes. As a result, various interfacial inter-metallic compounds (IMCs) reactions and stress concentrations occur at the Cu pillar/Sn-Ag micro bumps joints. Therefore, it is necessary to investigate the influence of pad metal finishes on the structural reliability of fine pitch Cu pillar/Sn-Ag micro bumps flip chip packaging. In this study, four different pad surface finishes (Thin Ni ENEPIG, OSP, ENEPIG, ENIG) were evaluated in terms of their interconnection reliability by thermal cycle (T/C) test up to 2000 cycles at temperatures ranging from -55°C to 125°C and high-temperature storage test up to 1000 h at 150°C. The contact resistances of the Cu pillar/Sn-Ag micro bump showed significant differences after the T/C reliability test in the following order: thin Ni ENEPIG > OSP > ENEPIG where the thin Ni ENEPIG pad metal finish provided the best Cu pillar/Sn-Ag micro bump interconnection in terms of bump joint reliability. Various IMCs formed between the bump joint areas can account for the main failure mechanism.

  18. Nano Enabled Thermo-Mechanical Materials in Adhesive Joints: A New Paradigm to Materials Functionality (Preprint)

    National Research Council Canada - National Science Library

    Roy, Ajit K; Ganguli, Sabyasachi; Sihn, Sangwook; Qu, Liangti; Dai, Liming

    2006-01-01

    One of the barriers in achieving adequate through-thickness thermal conductivity in composite materials and also in composite joints is the extremely low thermal conductivity of resins (polymer) or adhesives (typically 0.3 W/mK...

  19. An investigation on mechanical properties of steel fibre reinforced for underwater welded joint

    Science.gov (United States)

    Navin, K.; Zakaria, M. S.; Zairi, S.

    2017-09-01

    Underwater pipelines are always exposed to water and have a high tendency to have corrosion especially on the welded joint. This research is about using fiber glass as steel fiber to coat the welded joint to determine the effectiveness in corrosion prevention of the welded joint. Number of coating is varied to determine the better number coating to coat the pipeline. Few samples were left without immersion in salt water and few samples are immersed into salt water with same salinity as sea water. The material sample is prepared in dog bone shape to enable to be used in Universal Tensile Machine (UTM). The material prepared is left immersed for recommended time and tested in Universal Tensile Machine. Upon analyzing the result, the result is used to determine the breakage point whether broken on the welded joint or different place and also the suitable number of coating to be used.

  20. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

    International Nuclear Information System (INIS)

    Sujan, G.K.; Haseeb, A.S.M.A.; Afifi, A.B.M.

    2014-01-01

    Lead free solders currently in use are prone to develop thick interfacial intermetallic compound layers with rough morphology which are detrimental to the long term solder joint reliability. A novel method has been developed to control the morphology and growth of intermetallic compound layers between lead-free Sn–3.0Ag–0.5Cu solder ball and copper substrate by doping a water soluble flux with metallic nanoparticles. Four types of metallic nanoparticles (nickel, cobalt, molybdenum and titanium) were used to investigate their effects on the wetting behavior and interfacial microstructural evaluations after reflow. Nanoparticles were dispersed manually with a water soluble flux and the resulting nanoparticle doped flux was placed on copper substrate. Lead-free Sn–3.0Ag–0.5Cu solder balls of diameter 0.45 mm were placed on top of the flux and were reflowed at a peak temperature of 240 °C for 45 s. Angle of contact, wetting area and interfacial microstructure were studied by optical microscopy, field emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. It was observed that the angle of contact increased and wetting area decreased with the addition of cobalt, molybdenum and titanium nanoparticles to flux. On the other hand, wettability improved with the addition of nickel nanoparticles. Cross-sectional micrographs revealed that both nickel and cobalt nanoparticle doping transformed the morphology of Cu 6 Sn 5 from a typical scallop type to a planer one and reduced the intermetallic compound thickness under optimum condition. These effects were suggested to be related to in-situ interfacial alloying at the interface during reflow. The minimum amount of nanoparticles required to produce the planer morphology was found to be 0.1 wt.% for both nickel and cobalt. Molybdenum and titanium nanoparticles neither appear to undergo alloying during reflow nor have any influence at the solder/substrate interfacial reaction. Thus, doping of flux

  1. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sujan, G.K., E-mail: sgkumer@gmail.com; Haseeb, A.S.M.A., E-mail: haseeb@um.edu.my; Afifi, A.B.M., E-mail: amalina@um.edu.my

    2014-11-15

    Lead free solders currently in use are prone to develop thick interfacial intermetallic compound layers with rough morphology which are detrimental to the long term solder joint reliability. A novel method has been developed to control the morphology and growth of intermetallic compound layers between lead-free Sn–3.0Ag–0.5Cu solder ball and copper substrate by doping a water soluble flux with metallic nanoparticles. Four types of metallic nanoparticles (nickel, cobalt, molybdenum and titanium) were used to investigate their effects on the wetting behavior and interfacial microstructural evaluations after reflow. Nanoparticles were dispersed manually with a water soluble flux and the resulting nanoparticle doped flux was placed on copper substrate. Lead-free Sn–3.0Ag–0.5Cu solder balls of diameter 0.45 mm were placed on top of the flux and were reflowed at a peak temperature of 240 °C for 45 s. Angle of contact, wetting area and interfacial microstructure were studied by optical microscopy, field emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. It was observed that the angle of contact increased and wetting area decreased with the addition of cobalt, molybdenum and titanium nanoparticles to flux. On the other hand, wettability improved with the addition of nickel nanoparticles. Cross-sectional micrographs revealed that both nickel and cobalt nanoparticle doping transformed the morphology of Cu{sub 6}Sn{sub 5} from a typical scallop type to a planer one and reduced the intermetallic compound thickness under optimum condition. These effects were suggested to be related to in-situ interfacial alloying at the interface during reflow. The minimum amount of nanoparticles required to produce the planer morphology was found to be 0.1 wt.% for both nickel and cobalt. Molybdenum and titanium nanoparticles neither appear to undergo alloying during reflow nor have any influence at the solder/substrate interfacial reaction. Thus, doping

  2. Microstructure evolution and mechanical properties of Ti−22Al−25Nb alloy joints brazed with Ti−Ni−Nb alloy

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Y.; Cai, X.Q.; Yang, Z.W., E-mail: tjuyangzhenwen@163.com; Qiu, Q.W.; Wang, D.P.; Liu, Y.C.

    2016-10-01

    Ti{sub 45}Ni{sub 45}Nb{sub 10} (at.%) brazing alloy, fabricated by arc melting, was successfully used to braze Ti−22Al−25Nb (at.%) alloy. The microstructures of Ti{sub 45}Ni{sub 45}Nb{sub 10} brazing alloy and Ti−22Al−25Nb alloy brazed joints were analyzed using scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), electron backscatter diffraction (EBSD), and micro-area X-ray diffraction (XRD). The effects of the brazing parameters on the interfacial microstructure and mechanical properties of the Ti−22Al−25Nb alloy brazed joints were investigated. The results showed that the joint was primarily comprised of two characteristic zones: diffusion zone I and central zone II, and the reaction phases formed in the brazed joint were the B2, O, τ{sub 3}, and Ti{sub 2}Ni phase. The crystal orientation of B2 phase in diffusion zone I was consistent with that in the Ti−22Al−25Nb substrate. The O phase was precipitated from the B2 phase. As the brazing temperature or holding time increased, τ{sub 3} was gradually replaced by the B2 phase, and the Ti{sub 2}Ni phase decreased and ultimately disappeared. The maximum shear strength achieved at room temperature was 318 MPa when the joint was brazed at 1180 °C for 20 min, whereas it was 278 MPa at 650 °C. Crack primarily propagated in the τ{sub 3} compound, which was extremely hard and brittle, and partially traversed the B2 and O phases. - Highlights: • Ti{sub 45}Ni{sub 45}Nb{sub 10} alloy was successfully developed to braze Ti−22Al−25Nb alloy. • Ti−22Al−25Nb alloy was transformed from B2 phase into the O + B2 duplex phase after brazing. • Crystal orientation of B2 in joint was dependent on metal substrate. • Correlation between joint microstructure and mechanical properties was revealed. • Ti−22Al−25Nb brazed joint had excellent ambient and high temperature strength.

  3. Mechanical testing and development of the helical field coil joint for the Advanced Toroidal Facility

    International Nuclear Information System (INIS)

    Nelson, B.E.; Bryan, W.E.; Goranson, P.L.; Warwick, J.E.

    1985-01-01

    The helical field (HF) coil set for the Advanced Toroidal Facility (ATF) is an M = 12, l = 2, constant-ratio torsatron winding consisting of 2 coils, each with 14 turns of heavy copper conductor. The coils are divided into 24 identical segments to facilitate fabrication and minimize the assembly schedule. The segments are connected across through-bolted lap joints that must carry up to 124,000 A per turn for 5 s or 62,500 A steady-state. In addition, the joints must carry the high magnetic and thermal loads induced in the conductor and still fit within the basic 140- by 30-mm copper envelope. Extensive testing and development were undertaken to verify and refine the basic joint design. Tests included assembly force and clamping force for various types of misalignment; joint resistance as a function of clamping force; clamp bolt relaxation due to thermal cycling; fatigue testing of full-size, multiturn joint prototypes; and low-cycle fatigue and tensile tests of annealed CDA102 copper. The required performance parameters and actual test results, as well as the final joint configuration, are presented. 2 refs., 9 figs., 4 tabs

  4. Joint implementation, clean development mechanism and Tradable Permits. International regulation of greenhouse gases

    Energy Technology Data Exchange (ETDEWEB)

    Nielsen, L.; Rose Olsen, K.

    2000-06-01

    A 'correct' accreditation is a key issue when evaluating Joint Implementation as a global environmental instrument. Problems mentioned in the literature on Joint Implementation - including the problem of additionality - are often relating to the problem of defining a correct accreditation. This paper lists some of these problems and lists some of the tools available to solve the reported problems of accreditation. The paper concludes that the institutional framework is crucial in defining what a correct accreditation is. It also concludes that different groups may have different interests in Joint Implementation, and that each of the reported problems may be a problem to some of the Joint Implementation interests groups but not to others. In designing the institutional framework for JI it is important to know the incentives and motivations of the different groups. The main part of the paper is an analysis of the basic incentives and motivations of the different Joint Implementation interest groups. This analysis can be used to weight the problems of Joint Implementation from an environmental perspective and from the perspective of cost effectiveness. (au)

  5. Joint implementation, clean development mechanism and Tradable Permits. International regulation of greenhouse gases

    Energy Technology Data Exchange (ETDEWEB)

    Nielsen, L; Rose Olsen, K

    2000-06-01

    A 'correct' accreditation is a key issue when evaluating Joint Implementation as a global environmental instrument. Problems mentioned in the literature on Joint Implementation - including the problem of additionality - are often relating to the problem of defining a correct accreditation. This paper lists some of these problems and lists some of the tools available to solve the reported problems of accreditation. The paper concludes that the institutional framework is crucial in defining what a correct accreditation is. It also concludes that different groups may have different interests in Joint Implementation, and that each of the reported problems may be a problem to some of the Joint Implementation interests groups but not to others. In designing the institutional framework for JI it is important to know the incentives and motivations of the different groups. The main part of the paper is an analysis of the basic incentives and motivations of the different Joint Implementation interest groups. This analysis can be used to weight the problems of Joint Implementation from an environmental perspective and from the perspective of cost effectiveness. (au)

  6. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    /methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base...... titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

  7. Numerical analysis of laser welding with consideration analytical methods of determining phase transformations and mechanical properties of welded joint

    Directory of Open Access Journals (Sweden)

    Piekarska Wiesława

    2018-01-01

    Full Text Available The numerical analysis of laser welding process with consideration analytical methods determining phase transformations and mechanical properties of welded joints are presents in this paper. The analytical CCT diagram and final structural composition of S355 steel are presented. The empirical relations presents in paper are determined by chemical compositions investigated steel and cooling rate between temperatures 800-500°C (t8/5. Phase composition and mechanical properties each of structures of steel in weld and heat affected zone (HAZ are determined on the basis of analytical methods. Laser welded flat is used in numerical simulations in ABAQUS. Mathematical modes of volumetric welding source are used in the calculations. Temperature fields, shape and size of melting zone for selected points in the cross-section of the joint are determined on the basis of thermal cycles obtained numerical.

  8. The Kinematic and Static Analysis of the Tibio-Femoral Joint Based on a Novel Spatial Mechanism

    Directory of Open Access Journals (Sweden)

    Yonggang Xu

    2012-11-01

    Full Text Available To reveal the characteristics of knee movement and tibio-femoral joint contact force, a novel single degree of freedom spatial mechanism is built to simulate the joint kinematics based on a three dimensional model of the human knee. The length changes of the three ligaments can be obtained by establishing and solving the kinematics spiral function. Based on this mechanism, a static model is built where linear springs are used to model the ligaments and whose stiffness coefficients are obtained by the finite element method. The main strength of the proposed model is that it associates the knee's flexion motion with internal/external rotation of the tibia based on the isometricity of the anterior cruciate ligament. This offers an efficient method to model and analyse the changes of ligament lengths and static kinematics after ligament reconstruction, which is crucial in designing knee recovery and rehabilitation equipment.

  9. Multi-rate sensor fusion-based adaptive discrete finite-time synergetic control for flexible-joint mechanical systems

    International Nuclear Information System (INIS)

    Xue Guang-Yue; Ren Xue-Mei; Xia Yuan-Qing

    2013-01-01

    This paper proposes an adaptive discrete finite-time synergetic control (ADFTSC) scheme based on a multi-rate sensor fusion estimator for flexible-joint mechanical systems in the presence of unmeasured states and dynamic uncertainties. Multi-rate sensors are employed to observe the system states which cannot be directly obtained by encoders due to the existence of joint flexibilities. By using an extended Kalman filter (EKF), the finite-time synergetic controller is designed based on a sensor fusion estimator which estimates states and parameters of the mechanical system with multi-rate measurements. The proposed controller can guarantee the finite-time convergence of tracking errors by the theoretical derivation. Simulation and experimental studies are included to validate the effectiveness of the proposed approach. (general)

  10. Joint Instability and Osteoarthritis

    Directory of Open Access Journals (Sweden)

    Darryl Blalock

    2015-01-01

    Full Text Available Joint instability creates a clinical and economic burden in the health care system. Injuries and disorders that directly damage the joint structure or lead to joint instability are highly associated with osteoarthritis (OA. Thus, understanding the physiology of joint stability and the mechanisms of joint instability-induced OA is of clinical significance. The first section of this review discusses the structure and function of major joint tissues, including periarticular muscles, which play a significant role in joint stability. Because the knee, ankle, and shoulder joints demonstrate a high incidence of ligament injury and joint instability, the second section summarizes the mechanisms of ligament injury-associated joint instability of these joints. The final section highlights the recent advances in the understanding of the mechanical and biological mechanisms of joint instability-induced OA. These advances may lead to new opportunities for clinical intervention in the prevention and early treatment of OA.

  11. Joint instability and osteoarthritis.

    Science.gov (United States)

    Blalock, Darryl; Miller, Andrew; Tilley, Michael; Wang, Jinxi

    2015-01-01

    Joint instability creates a clinical and economic burden in the health care system. Injuries and disorders that directly damage the joint structure or lead to joint instability are highly associated with osteoarthritis (OA). Thus, understanding the physiology of joint stability and the mechanisms of joint instability-induced OA is of clinical significance. The first section of this review discusses the structure and function of major joint tissues, including periarticular muscles, which play a significant role in joint stability. Because the knee, ankle, and shoulder joints demonstrate a high incidence of ligament injury and joint instability, the second section summarizes the mechanisms of ligament injury-associated joint instability of these joints. The final section highlights the recent advances in the understanding of the mechanical and biological mechanisms of joint instability-induced OA. These advances may lead to new opportunities for clinical intervention in the prevention and early treatment of OA.

  12. The extraordinary joint material of an articulated coralline alga. II. Modeling the structural basis of its mechanical properties.

    Science.gov (United States)

    Denny, Mark W; King, Felicia A

    2016-06-15

    By incorporating joints into their otherwise rigid fronds, erect coralline algae have evolved to be as flexible as other seaweeds, which allows them to thrive - and even dominate space - on wave-washed shores around the globe. However, to provide the required flexibility, the joint tissue of Calliarthron cheilosporioides, a representative articulated coralline alga, relies on an extraordinary tissue that is stronger, more extensible and more fatigue resistant than that of other algae. Here, we used the results from recent experiments to parameterize a conceptual model that links the microscale architecture of cell walls to the adaptive mechanical properties of joint tissue. Our analysis suggests that the theory of discontinuous fiber-wound composite materials (with cellulose fibrils as the fibers and galactan gel as the matrix) can explain key aspects of the material's mechanics. In particular, its adaptive viscoelastic behavior can be characterized by two, widely separated time constants. We speculate that the short time constant (∼14 s) results from the viscous response of the matrix to the change in cell-wall shape as a joint is stretched, a response that allows the material both to remain flexible and to dissipate energy as a frond is lashed by waves. We propose that the long time constant (∼35 h), is governed by the shearing of the matrix between cellulose fibrils. The resulting high apparent viscosity ensures that joints avoid accumulating lethal deformation in the course of a frond's lifetime. Our synthesis of experimental measurements allows us to draw a chain of mechanistic inference from molecules to cell walls to fronds and community ecology. © 2016. Published by The Company of Biologists Ltd.

  13. Fundamental studies on electron-beam welding of heat-resistant superalloys for nuclear plants: Report 4. Mechanical properties of welded joints

    International Nuclear Information System (INIS)

    Susei, S.; Shimizu, S.; Aota, T.

    1982-04-01

    In this report, electron-beam (EB) welded joints and TIG welded joints of various superalloys to be used for nuclear plants, such as Hastelloy-type, Inconel-type and Incoloy-type, are systematically evaluated in terms of tensile properties, low-cycle fatigue properties at elevated temperatures, creep and creep-rupture properties. It was fully confirmed as conclusion that the EB welded joints are superior to the TIG welded ones in mechanical properties, especially at high temperature. In the evaluation of creep properties, ductility is one of the most important criteria to represent the resistance against fracture due to creep deformation, and this criterion is very useful in evaluating the properties of welded joints. Therefore, the more comparable to the base metal the electron beam welded joint becomes in terms of ductility, the more resistant is it against fracture. From this point of view, the electron beam welded joint is considerably superior to the TIG welded joint [fr

  14. Mechanical behaviour of wood T-joints. Experimental and numerical investigation

    Directory of Open Access Journals (Sweden)

    C.L. dos Santos

    2015-01-01

    Full Text Available Results of a double-shear single-dowel wood connection tested under monotonic quasi-static compression loading are presented and discussed in this paper. The wood used in this study was a pine wood, namely the Pinus pinaster species, which is one of the most important Portuguese species. Each connection (specimen consists of three wood members: a centre member, loaded in compression along the parallel-tograin direction and two simply supported side members, loaded along the perpendicular-to-grain direction (Tconnection. The load transfer between wood members was assured by means of a steel dowel, which is representative of the most common joining technique applied for structural details in wooden structures. The complete load-slip behaviour of the joint is obtained until failure. In particular, the values of the stiffness, the ultimate loads and the ductility were evaluated. Additionally, this investigation proposed non-linear 3D finite element models to simulate the T-joint behaviour. The interaction between the dowel and the wood members was simulated using contact finite elements. A plasticity model, based on Hill’s criterion, was used to simulate the joint ductility and cohesive damage modelling was applied to simulate the brittle failure modes (splitting observed in the side members of the joint. The simulation procedure allowed a satisfactory description of the non-linear behaviour of the T-joint including the collapse prediction.

  15. The effect of constitutive representations and structural constituents of ligaments on knee joint mechanics.

    Science.gov (United States)

    Orozco, Gustavo A; Tanska, Petri; Mononen, Mika E; Halonen, Kimmo S; Korhonen, Rami K

    2018-02-02

    Ligaments provide stability to the human knee joint and play an essential role in restraining motion during daily activities. Compression-tension nonlinearity is a well-known characteristic of ligaments. Moreover, simpler material representations without this feature might give reasonable results because ligaments are primarily in tension during loading. However, the biomechanical role of different constitutive representations and their fibril-reinforced poroelastic properties is unknown. A numerical knee model which considers geometric and material nonlinearities of meniscus and cartilages was applied. Five different constitutive models for the ligaments (spring, elastic, hyperelastic, porohyperelastic, and fibril-reinforced porohyperelastic (FRPHE)) were implemented. Knee joint forces for the models with elastic, hyperelastic and porohyperelastic properties showed similar behavior throughout the stance, while the model with FRPHE properties exhibited lower joint forces during the last 50% of the stance phase. The model with ligaments as springs produced the lowest joint forces at this same stance phase. The results also showed that the fibril network contributed substantially to the knee joint forces, while the nonfibrillar matrix and fluid had small effects. Our results indicate that simpler material models of ligaments with similar properties in compression and tension can be used when the loading is directed primarily along the ligament axis in tension.

  16. Commentary: Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    Menovsky, T.; Beek, J.F.; Gemert, M.J.C. van

    1999-01-01

    Full text: Laser tissue welding is the process of using laser energy to join tissues without sutures or with a reduced number of sutures. Recently, diode lasers have been added to the list of fusion lasers (Lewis and Uribe 1993, Reali et al 1993). Typically, for tissue welding, deep penetrating diode lasers emitting at 800-810 nm are used, in combination with a strong absorbing protein solder containing the dye indocyanine green. Indocyanine green has a maximum absorption coefficient at 805 nm and binds preferentially with proteins (Sauda et al 1986). The greatest advantage of diode lasers is their compact size, easy use and low cost. In this issue of Physics in Medicine and Biology (pp 983-1002, 'Photothermal effects of laser tissue soldering'), in an in vitro study, McNally et al investigate the optimal laser settings and welding temperatures in relation to the tensile strength and thermal damage of bovine aorta specimens. An interesting statement in their introduction is that the low strength of laser produced anastomoses can lead to aneurysm formation. The increased chance of aneurysm formation may merely be due to the thermal effect of the laser on the vascular wall, especially on the adventitia and media layers, which become necrotic after thermal injury. Subsequent haemodynamic stress exerted on a damaged vascular wall is a significant contributing factor for aneurysmal initiation. Also interesting is the remark that 'by the application of wavelength-specific chromophores in tissue welding ... the requirement for precise focusing and aiming of the laser beam may be removed'. Though perhaps not yet fully justified, this statement, if true, would facilitate surgical procedures. While the experiments are conducted in a proper manner, the use of bovine aorta specimens, which were stored at -70 deg. C and subsequently thawed for the tissue welding experiments, may not be the most appropriate for studying tissue effects or tensile strength measurements, as the

  17. Computational modeling to predict mechanical function of joints: application to the lower leg with simulation of two cadaver studies.

    Science.gov (United States)

    Liacouras, Peter C; Wayne, Jennifer S

    2007-12-01

    Computational models of musculoskeletal joints and limbs can provide useful information about joint mechanics. Validated models can be used as predictive devices for understanding joint function and serve as clinical tools for predicting the outcome of surgical procedures. A new computational modeling approach was developed for simulating joint kinematics that are dictated by bone/joint anatomy, ligamentous constraints, and applied loading. Three-dimensional computational models of the lower leg were created to illustrate the application of this new approach. Model development began with generating three-dimensional surfaces of each bone from CT images and then importing into the three-dimensional solid modeling software SOLIDWORKS and motion simulation package COSMOSMOTION. Through SOLIDWORKS and COSMOSMOTION, each bone surface file was filled to create a solid object and positioned necessary components added, and simulations executed. Three-dimensional contacts were added to inhibit intersection of the bones during motion. Ligaments were represented as linear springs. Model predictions were then validated by comparison to two different cadaver studies, syndesmotic injury and repair and ankle inversion following ligament transection. The syndesmotic injury model was able to predict tibial rotation, fibular rotation, and anterior/posterior displacement. In the inversion simulation, calcaneofibular ligament extension and angles of inversion compared well. Some experimental data proved harder to simulate accurately, due to certain software limitations and lack of complete experimental data. Other parameters that could not be easily obtained experimentally can be predicted and analyzed by the computational simulations. In the syndesmotic injury study, the force generated in the tibionavicular and calcaneofibular ligaments reduced with the insertion of the staple, indicating how this repair technique changes joint function. After transection of the calcaneofibular

  18. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

  19. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

  20. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

  1. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan

    2009-01-01

    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work...

  2. Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

    Science.gov (United States)

    Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

    2018-03-01

    The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

  3. Mechanical performance and contact zone of timber joint with oblique faces

    Czech Academy of Sciences Publication Activity Database

    Kunecký, Jiří; Sebera, V.; Tippner, J.; Hasníková, Hana; Kloiber, Michal; Arciszewska-Kędzior, Anna; Milch, J.

    2015-01-01

    Roč. 63, č. 4 (2015), s. 1153-1159 ISSN 1211-8516 R&D Projects: GA MK(CZ) DF12P01OVV004 Keywords : bending * contact zone * digital image correlation * dowel * non-destructive test ing * timber joint Subject RIV: AL - Art, Architecture, Cultural Heritage http://dx.doi.org/10.11118/actaun201563041153

  4. A mechanism to compensate undesired stiffness in joints of prosthetic hands

    NARCIS (Netherlands)

    Smit, G.; Plettenbrug, D.H.; Van der Helm, F.C.T.

    2014-01-01

    Background: Cosmetic gloves that cover a prosthetic hand have a parasitic positive stiffness that counteracts the flexion of a finger joint. Objectives: Reducing the required input torque to move a finger of a prosthetic hand by compensating the parasitic stiffness of the cosmetic glove. Study

  5. The acting wear mechanisms on metal-on-metal hip joint bearings: in-vitro results

    NARCIS (Netherlands)

    Wimmer, M.A.; Loos, J.; Nassutt, R.; Heitkemper, M.; Fischer, A.

    2001-01-01

    Metal-on-metal (MOM) hip joint bearings are currently under discussion as alternatives to metal-on-polymer (MOP) bearings. Some criteria under scrutiny are the wear resistance, the influence of wear particles on the surrounding tissue, as well as the frictional torque. In order to understand and

  6. Fatigue Strength Estimation Based on Local Mechanical Properties for Aluminum Alloy FSW Joints

    Directory of Open Access Journals (Sweden)

    Kittima Sillapasa

    2017-02-01

    Full Text Available Overall fatigue strengths and hardness distributions of the aluminum alloy similar and dissimilar friction stir welding (FSW joints were determined. The local fatigue strengths as well as local tensile strengths were also obtained by using small round bar specimens extracted from specific locations, such as the stir zone, heat affected zone, and base metal. It was found from the results that fatigue fracture of the FSW joint plate specimen occurred at the location of the lowest local fatigue strength as well as the lowest hardness, regardless of microstructural evolution. To estimate the fatigue strengths of aluminum alloy FSW joints from the hardness measurements, the relationship between fatigue strength and hardness for aluminum alloys was investigated based on the present experimental results and the available wide range of data from the references. It was found as: σa (R = −1 = 1.68 HV (σa is in MPa and HV has no unit. It was also confirmed that the estimated fatigue strengths were in good agreement with the experimental results for aluminum alloy FSW joints.

  7. Automation of experimental research of waveguide paths induction soldering

    Science.gov (United States)

    Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

    2018-05-01

    The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

  8. Optimization of the soldering process by the DMAIC methodology

    Directory of Open Access Journals (Sweden)

    Michał Zasadzień

    2016-06-01

    Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

  9. Metallurgical and mechanical examinations of steel–copper joints arc welded using bronze and nickel-base superalloy filler materials

    International Nuclear Information System (INIS)

    Velu, M.; Bhat, Sunil

    2013-01-01

    Highlights: ► Optical and scanning electron microscopy show defect free weld interfaces. ► Energy dispersive spectroscopy shows low dilution level of the weld by Fe. ► XRD studies show no brittle intermetallic phases in the weld interfaces. ► Weld interfaces did not fail during tensile, transverse bending and impact tests. ► The joint exhibits superior strength properties than that of bronze filler. - Abstract: The paper presents metallurgical and mechanical examinations of joints between dissimilar metals viz. copper (UNSC11000) and alloy steel (En31) obtained by Shielded Metal Arc Welding (SMAW) using two different filler materials, bronze and nickel-base super alloy. The weld bead of the joint with bronze-filler displayed porosity, while that with nickel-filler did not. In tension tests, the weldments with bronze-filler fractured in the centre of the weld, while those with nickel-filler fractured in the heat affected zone (HAZ) of copper. Since the latter exhibited higher strength than the former, all the major tests were undertaken over the joints with nickel-filler alone. Scanning Electron Microscopy (SEM) coupled with Energy Dispersive Spectroscopy (EDS) indicated corrugated weld interfaces and favorable elemental diffusions across them. X-ray diffraction (XRD) studies around the weld interfaces did not reveal any detrimental intermetallic compounds. Transverse bending tests showed that flexural strengths of the weldments were higher than the tensile strengths. Transverse side bend tests confirmed good ductility of the joints. Shear strength of the weld-interface (Cu–Ni or Ni–steel) was higher than the yield strength of weaker metal. Microhardness and Charpy impact values were measured at all the important zones across the weldment

  10. Drinking Water Contamination Due To Lead-based Solder

    Science.gov (United States)

    Garcia, N.; Bartelt, E.; Cuff, K. E.

    2004-12-01

    The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

  11. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan

    2017-08-10

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  12. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong

    2017-01-01

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  13. Mechanical properties of friction stir welded butt joint of steel/aluminium alloys: effect of tool geometry

    Science.gov (United States)

    Syafiq, W. M.; Afendi, M.; Daud, R.; Mazlee, M. N.; Majid, M. S. Abdul; Lee, Y. S.

    2017-10-01

    This paper described the mechanical properties from hardness testing and tensile testing of Friction Stir Welded (FSW) materials. In this project, two materials of aluminium and steel are welded using conventional milling machine and tool designed with different profile and shoulder size. During welding the temperature along the weld line is collected using thermocouples. Threaded pins was found to produce stronger joints than cylindrical pins. 20 mm diameter shoulder tool welded a slightly stronger joint than 18 mm diameter one, as well as softer nugget zone due to higher heat input. Threaded pins also contributed to higher weld temperature than cylindrical pins due to increase in pin contact surface. Generally, higher temperatures were recorded in aluminium side due to pin offset away from steel.

  14. The Mechanism of Ultrasonic Vibration on Grain Refining and Degassing in GTA Spot Welding of Copper Joints.

    Science.gov (United States)

    Al-Ezzi, Salih; Quan, Gaofeng; Elrayah, Adil

    2018-05-07

    This paper examines the effect of ultrasonic vibration (USV) on grain size and interrupted porosity in Gas Tungsten Arc (GTA) spot-welded copper. Grain size was refined by perpendicularly attaching a transducer to the welded sheet and applying USV to the weld pool for a short time (0, 2, 4, and 6 s) in addition improvements to the degassing process. Results illustrate a significant reduction of grain size (57%). Notably, USV provided interaction between reformations (fragmentation) and provided nucleation points (detaching particles from the fusion line) for grains in the nugget zone and the elimination of porosity in the nugget zone. The GTA spot welding process, in conjunction with USV, demonstrated an improvement in the corrosion potential for a copper spot-welded joint in comparison to the joint welded without assistance of USV. Finally, welding of copper by GTA spot welding in conjunction with ultrasound for 2 s presented significant mechanical properties.

  15. The Effect of Welding Energy on the Microstructural and Mechanical Properties of Ultrasonic-Welded Copper Joints

    Science.gov (United States)

    Yang, Jingwei; Cao, Biao; Lu, Qinghua

    2017-01-01

    The effects of welding energy on the mechanical and microstructural characteristics of ultrasonic-welded pure copper plates were investigated. Complex dynamic recrystallization and grain growth occurred inside the weld zone during ultrasonic welding. At a low welding energy, a thin band of straight weld interfaces was observed and had an ultra-fine grain structure. With an increase in welding energy, the weld interface progressively changed from flat to sinusoidal, and eventually turned into a convoluted wavy pattern, bearing similarities to shear instabilities, as observed in fluid dynamics. The lap shear load of the joints initially increased and then remained stable as the welding energy increased. The tensile characteristics of the joints significantly depended on the development of plastic deformation at the interface. The influence of the microstructure on the hardness was also discussed. PMID:28772553

  16. The development of a graphite to copper joint for injector diagnostics

    International Nuclear Information System (INIS)

    Baker, D.

    1975-09-01

    A successful method of joining soft graphite to copper, to achieve a high thermal conductivity joint, is described, together with initial attempts and the difficulties experienced. The graphite, after an initial treatment, was flame sprayed with copper. The main copper-to-graphite joint was of silver solder. (U.K.)

  17. Mechanical characterization and validation of poly (methyl methacrylate)/multi walled carbon nanotube composite for the polycentric knee joint.

    Science.gov (United States)

    Arun, S; Kanagaraj, S

    2015-10-01

    Trans femoral amputation is one of the most uncomfortable surgeries in patient׳s life, where the prosthesis consisting of a socket, knee joint, pylon and foot is used to do the walking activities. The artificial prosthetic knee joint imitates the functions of human knee to achieve the flexion-extension for the above knee amputee. The objective of present work is to develop a light weight composite material for the knee joint to reduce the metabolic cost of an amputee. Hence, an attempt was made to study the mechanical properties of multi walled carbon nanotubes (MWCNT) reinforced Poly (methyl methacrylate) (PMMA) prepared through melt mixing technique and optimize the concentration of reinforcement. The PMMA nanocomposites were prepared by reinforcing 0, 0.1, 0.2, 0.25, 0.3 and 0.4 wt% of MWCNT using injection moulding machine via twin screw extruder. It is observed that the tensile and flexural strength of PMMA, which were studied as per ASTM D638 and D790, respectively, were increased by 32.9% and 26.3% till 0.25 wt% reinforcement of MWCNT. The experimental results of strength and modulus were compared with theoretical prediction, where a good correlation was noted. It is concluded that the mechanical properties of PMMA were found to be increased to maximum at 0.25 wt% reinforcement of MWCNT, where the Pukanszky model and modified Halpin-Tsai model are suggested to predict the strength and modulus, respectively, of the PMMA/MWCNT composite, which can be opted as a suitable materiel for the development of polycentric knee joint. Copyright © 2015 Elsevier Ltd. All rights reserved.

  18. The Influence of the Heat-Affected Zone Mechanical Properties on the Behaviour of the Welding in Transverse Plate-to-Tube Joints.

    Science.gov (United States)

    Lozano, Miguel; Serrano, Miguel A; López-Colina, Carlos; Gayarre, Fernando L; Suárez, Jesús

    2018-02-09

    Eurocode 3 establishes the component method to analytically characterize the structural joints between beam and columns. When one of the members involved in the joint is a hollow section (i.e., a tube) there is a lack of information for the specific components present in the joint. There are two different ways to bridge the gap: experimental testing on the actual beam column joints involving tubular sections; or numerical modelization, typically by means of finite element analysis. For this second option, it is necessary to know the actual mechanical properties of the material. As long as the joint implies a welding process, there is a concern related to how the mechanical properties in the heat-affected zone (HAZ) influence the behavior of the joint. In this work, some coupons were extracted from the HAZ of the beam-column joint. The coupons were tested and the results were implemented in the numerical model of the joint, in an attempt to bring it closer to the experimental results of the tested joints.

  19. Effect of Multipass TIG and Activated TIG Welding Process on the Thermo-Mechanical Behavior of 316LN Stainless Steel Weld Joints

    Science.gov (United States)

    Ganesh, K. C.; Balasubramanian, K. R.; Vasudevan, M.; Vasantharaja, P.; Chandrasekhar, N.

    2016-04-01

    The primary objective of this work was to develop a finite element model to predict the thermo-mechanical behavior of an activated tungsten inert gas (ATIG)-welded joint. The ATIG-welded joint was fabricated using 10 mm thickness of 316LN stainless steel plates in a single pass. To distinguish the merits of ATIG welding process, it was compared with manual multipass tungsten inert gas (MPTIG)-welded joint. The ATIG-welded joint was fabricated with square butt edge configuration using an activating flux developed in-house. The MPTIG-welded joint was fabricated in thirteen passes with V-groove edge configuration. The finite element model was developed to predict the transient temperature, residual stress, and distortion of the welded joints. Also, microhardness, impact toughness, tensile strength, ferrite measurement, and microstructure were characterized. Since most of the recent publications of ATIG-welded joint was focused on the molten weld pool dynamics, this research work gives an insight on the thermo-mechanical behavior of ATIG-welded joint over MPTIG-welded joint.

  20. Mechanical performance of dovetail joint related to the global stiffness of timber roof structures

    Czech Academy of Sciences Publication Activity Database

    Kunecký, Jiří; Arciszewska-Kędzior, Anna; Sebera, V.; Hasníková, Hana

    2016-01-01

    Roč. 49, č. 6 (2016), s. 2315-2327 ISSN 1359-5997 R&D Projects: GA MK(CZ) DF12P01OVV004 Keywords : dovetail * FEM * stiffness * carpentry joint * digital image correlation Subject RIV: AL - Art, Architecture, Cultural Heritage Impact factor: 2.607, year: 2016 http://link.springer.com/article/10.1617%2Fs11527-015-0651-1

  1. Microstructure and Mechanical Properties of Ultrasonic Spot Welded Mg/Al Alloy Dissimilar Joints

    Directory of Open Access Journals (Sweden)

    He Peng

    2018-04-01

    Full Text Available Lightweight structural applications of magnesium and aluminum alloys inevitably necessitate welding and joining, especially dissimilar welding between these alloys. The objective of this study was to examine the feasibility of joining ZEK100 Mg alloy to Al6022 alloy via ultrasonic spot welding, focusing on effects of welding energy. An interface diffusion layer consisting of α-Mg and Al12Mg17 eutectic structure was observed to form, with its thickness increased from ~0.5 µm to ~30 µm with increasing welding energy from 500 J to 2000 J. The tensile lap shear peak load or strength and critical stress intensity of the welded joints first increased and then decreased with increasing welding energy, with their peak values achieved at 750 J. Fatigue life of the joints made at 750 J and 2000 J was equivalent at the lower cyclic loading levels, while it was longer for the joints made at 750 J at the higher cyclic loading levels. Fatigue fracture mode changed from interfacial failure to mainly transverse-through-thickness crack growth with decreasing cyclic loading level, which corresponded well to the bi-linear characteristic of S-N curves. Crack initiation basically occurred at the weld nugget border and at the interface between the two sheets, which can be understood via a theoretical stress analysis.

  2. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    DEFF Research Database (Denmark)

    High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

  3. Aging effects on fracture behavior of 63Sn37Pb eutectic solder during tensile tests under the SEM

    International Nuclear Information System (INIS)

    Ding Ying; Wang Chunqing; Li Mingyu; Bang Hansur

    2004-01-01

    This study investigates the influence of aging treatment on fracture behavior of Sn-Pb eutectic solder alloys at different loading rate regime during tensile tests under the scanning electron microscope. In high homologous temperature, the solder exhibit the creep behavior that could be confirmed through the phenomena of grain boundary sliding (GBS) to both as-cast and aged specimens. Owing to the large grain scale after high temperature storage, boundary behavior was limited to some extent for the difficulty in grain rotation and boundary migration. Instead, drastic intragranular deformation occurred. Also, the phase coarsening weakened the combination between lead-rich phase and tin matrix. Consequently, surface fragmentation was detected for the aged specimens. Furthermore, the fracture mechanism changed from intergranular dominated to transgranular dominated with increasing loading rate to both specimens during early stage

  4. Effects of aging treatment and heat input on the microstructures and mechanical properties of TIG-welded 6061-T6 alloy joints

    Science.gov (United States)

    Peng, Dong; Shen, Jun; Tang, Qin; Wu, Cui-ping; Zhou, Yan-bing

    2013-03-01

    Aging treatment and various heat input conditions were adopted to investigate the microstructural evolution and mechanical properties of TIG welded 6061-T6 alloy joints by microstructural observations, microhardness tests, and tensile tests. With an increase in heat input, the width of the heat-affected zone (HAZ) increases and grains in the fusion zone (FZ) coarsen. Moreover, the hardness of the HAZ decreases, whereas that of the FZ decreases initially and then increases with an increase in heat input. Low heat input results in the low ultimate tensile strength of the welded joints due to the presence of partial penetrations and pores in the welded joints. After a simple artificial aging treatment at 175°C for 8 h, the microstructure of the welded joints changes slightly. The mechanical properties of the welded joints enhance significantly after the aging process as few precipitates distribute in the welded seam.

  5. Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

    Science.gov (United States)

    This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

  6. Experimental Study On Lateral Load Capacity of Bamboo RC Beam Column Joints Strengthened By Bamboo Mechanical Anchors

    Directory of Open Access Journals (Sweden)

    Sri Umniati B.

    2017-01-01

    Full Text Available In this paper, the prospective of bamboos which available abundantly especially in Indonesia as rebars and mechanical anchors are studied. And also the endurance of the bamboos mechanical anchors to withstand cyclic loading were observed. Nine classes of bamboos bar were evaluated: consist of 3 different anchors (0, 4 and 8 anchors and 3 different compressive strength (19.19 MPa, 29.61 MPa and 37.96 MPa means 3 × 3 parameters. The results show that the lateral load capacity increased significantly with the present of bamboo anchors specimens: 26.04 % for 4 anchors specimens (C2 and 25 % for the 8 anchors specimens (C3 compared to zero anchor specimens (C1. On the other hand, the compressive strength of concrete have no significant effects to the lateral load capacity. Overall it can be concluded that, bamboo can be used as mechanical anchorage to strengthen beam column joint.

  7. Anatomical study of the articular branches innervated the hip and knee joint with reference to mechanism of referral pain in hip joint disease patients.

    Science.gov (United States)

    Sakamoto, Junya; Manabe, Yoshitaka; Oyamada, Joichi; Kataoka, Hideki; Nakano, Jiro; Saiki, Kazunobu; Okamoto, Keishi; Tsurumoto, Toshiyuki; Okita, Minoru

    2018-03-25

    Referred pain in the anterior knee joint is the most common symptom in hip disease patients. The development of referred pain is considered to be related to dichotomizing peripheral sensory fibers. However, no gross anatomical findings identify any dichotomizing fibers innervating both the hip and knee joints. We dissected the femoral and obturator nerves in human cadavers to investigate the distribution of the articular branches in the hip and knee joints. Fourteen embalmed left lower limbs from 14 Japanese adult cadavers (five from females, nine from males, average age 73.8 ± 14.1 years) were observed macroscopically. The articular branches of the femoral and obturator nerves were dissected at the anterior margin of the groin toward the thigh region. After dissections of the articular nerves of the hip joints, the femoral and obturator nerves were exposed from proximally to distally to identify the articular nerves of the knee joints. The branching pattern of the articular branches in the hip and knee joints was recorded. In six of 14 limbs (42.9%), the femoral nerve supplied articular branches to the anteromedial aspect of both the hip and knee joints. These articular branches were derived from the same bundle of femoral nerve. These gross anatomical findings suggested that dichotomizing peripheral sensory fibers innervate the hip and knee joints and these could relate to the referred pain confirmed in the anterior knee joints of patients with hip disease. Clin. Anat., 2018. © 2018 Wiley Periodicals, Inc. © 2018 Wiley Periodicals, Inc.

  8. Influence of Zn Interlayer on Interfacial Microstructure and Mechanical Properties of TIG Lap-Welded Mg/Al Joints

    Science.gov (United States)

    Gao, Qiong; Wang, Kehong

    2016-03-01

    This study explored 6061 Al alloy and AZ31B Mg alloy joined by TIG lap welding with Zn foils of varying thicknesses, with the additional Zn element being imported into the fusion zone to alloy the weld seam. The microstructures and chemical composition in the fusion zone near the Mg substrate were examined by SEM and EDS, and tensile shear strength tests were conducted to investigate the mechanical properties of the Al/Mg joints, as well as the fracture surfaces, and phase compositions. The results revealed that the introduction of an appropriate amount of Zn transition layer improves the microstructure of Mg/Al joints and effectively reduces the formation of Mg-Al intermetallic compounds (IMCs). The most common IMCs in the fusion zone near the Mg substrate were Mg-Zn and Mg-Al-Zn IMCs. The type and distribution of IMCs generated in the weld zone differed according to Zn additions; Zn interlayer thickness of 0.4 mm improved the sample's mechanical properties considerably compared to thicknesses of less than 0.4 mm; however, any further increase in Zn interlayer thickness of above 0.4 mm caused mechanical properties to deteriorate.

  9. Report on the SNL/NSF International Workshop on Joint Mechanics, Arlington, Virginia, 16-18 October 2006.

    Energy Technology Data Exchange (ETDEWEB)

    Ewins, David J. (Imperial College, London England, UK); Bergman, Lawrence A. (University of Illinois, Urbana, IL); Segalman, Daniel Joseph

    2007-11-01

    The NSF/SNL joint mechanics workshop, held in Arlington, Virginia, 16-18 October, 2006, attempted to assess the current state of the art for modeling joint mechanics for the purpose of structural dynamics calculation, to identify the underlying physics issues that must be addressed to advance the field, and to propose a path forward. Distinguished participants from several countries representing research communities that focus on very different length and time scales identified multiple challenges in bridging those scales. Additionally, two complementary points of view were developed for addressing those challenges. The first approach - the 'bottom-up' perspective - attempts to bridge scales by starting from the smallest length scale and working up. The other approach starts at the length scale of application and attempts to deduce mechanics at smaller length scales through reconciliation with laboratory observation. Because interface physics is a limiting element of predictive simulation in defense and transportation, this issue will be of continuing importance for the foreseeable future.

  10. Ultrasonic Welding of Thermoplastic Composite Coupons for Mechanical Characterization of Welded Joints through Single Lap Shear Testing.

    Science.gov (United States)

    Villegas, Irene F; Palardy, Genevieve

    2016-02-11

    This paper presents a novel straightforward method for ultrasonic welding of thermoplastic-composite coupons in optimum processing conditions. The ultrasonic welding process described in this paper is based on three main pillars. Firstly, flat energy directors are used for preferential heat generation at the joining interface during the welding process. A flat energy director is a neat thermoplastic resin film that is placed between the parts to be joined prior to the welding process and heats up preferentially owing to its lower compressive stiffness relative to the composite substrates. Consequently, flat energy directors provide a simple solution that does not require molding of resin protrusions on the surfaces of the composite substrates, as opposed to ultrasonic welding of unreinforced plastics. Secondly, the process data provided by the ultrasonic welder is used to rapidly define the optimum welding parameters for any thermoplastic composite material combination. Thirdly, displacement control is used in the welding process to ensure consistent quality of the welded joints. According to this method, thermoplastic-composite flat coupons are individually welded in a single lap configuration. Mechanical testing of the welded coupons allows determining the apparent lap shear strength of the joints, which is one of the properties most commonly used to quantify the strength of thermoplastic composite welded joints.

  11. The interface microstructure, mechanical properties and corrosion resistance of dissimilar joints during multipass laser welding for nuclear power plants

    Science.gov (United States)

    Li, Gang; Lu, Xiaofeng; Zhu, Xiaolei; Huang, Jian; Liu, Luwei; Wu, Yixiong

    2018-05-01

    This study presents the interface microstructure, mechanical properties and corrosion resistance of dissimilar joints between Inconel 52M overlays and 316L stainless steel during multipass laser welding for nuclear power plants. The results indicate that the microstructure at the interface beside 316L stainless steel consists of cellular with the width of 30-40 μm, which also exhibits numerous Cr and Mo-rich precipitates like flocculent structure and in chains along grain boundaries as a mixed chemical solution for etching. Many dendritic structure with local melting characteristics and Nb-rich precipitates are exhibited at the interface beside Inconel 52M overlays. Such Nb-rich precipitates at the interface beside Inconel 52M overlays deteriorate the tensile strength and toughness of dissimilar joints at room temperature. The tensile strength of 316L stainless steel at 350 °C significantly decreases with the result that dissimilar joints are fractured in 316L stainless steel. The correlation between corrosion behavior and microstructure of weld metals is also discussed. The difference in high corrosion potential between Nb-rich precipitates and the matrix could result in establishing effective galvanic couples, and thus accelerating the corrosion of weld metals.

  12. Effect of minor Er and Zr on microstructure and mechanical properties of Al–Mg–Mn alloy (5083) welded joints

    International Nuclear Information System (INIS)

    Dongxia, Yang; Xiaoyan, Li; Dingyong, He; Hui, Huang

    2013-01-01

    Samples of Al–Mg–Mn and Al–Mg–Mn–Er–Zr alloys were welded using the method of laser welding. The influence of Er and Zr on microstructure, microhardness and mechanical properties of the Al–Mg–Mn alloy welded joints were investigated. It has been found that addition of Er and Zr refines the grain size in the fusion zone, due to the formation of primary Al 3 Zr and Al 3 Er. Fine equiaxed grains are dominated near the fusion boundary of the Al–Mg–Mn–Er–Zr alloy joint, which is contrary with the columnar crystal in the Al–Mg–Mn alloy joint. Microhardness of the center of the fusion zone rises from 74HV 0.1 to 84HV 0.1 owing to the grain refinement by Er and Zr. The tensile test result shows that the ultimate tensile strength and yield strength are improved by adding Er and Zr. The main reason for this is related to grain refining strengthening.

  13. Effect of minor Er and Zr on microstructure and mechanical properties of Al-Mg-Mn alloy (5083) welded joints

    Energy Technology Data Exchange (ETDEWEB)

    Dongxia, Yang, E-mail: yangdongxia116@emails.bjut.edu.cn [Department of Materials Science and Engineering, Beijing University of Technology, Beijing 100124 (China); Xiaoyan, Li; Dingyong, He; Hui, Huang [Department of Materials Science and Engineering, Beijing University of Technology, Beijing 100124 (China)

    2013-01-20

    Samples of Al-Mg-Mn and Al-Mg-Mn-Er-Zr alloys were welded using the method of laser welding. The influence of Er and Zr on microstructure, microhardness and mechanical properties of the Al-Mg-Mn alloy welded joints were investigated. It has been found that addition of Er and Zr refines the grain size in the fusion zone, due to the formation of primary Al{sub 3}Zr and Al{sub 3}Er. Fine equiaxed grains are dominated near the fusion boundary of the Al-Mg-Mn-Er-Zr alloy joint, which is contrary with the columnar crystal in the Al-Mg-Mn alloy joint. Microhardness of the center of the fusion zone rises from 74HV{sub 0.1} to 84HV{sub 0.1} owing to the grain refinement by Er and Zr. The tensile test result shows that the ultimate tensile strength and yield strength are improved by adding Er and Zr. The main reason for this is related to grain refining strengthening.

  14. Microstructure characteristics of vacuum glazing brazing joints using laser sealing technique

    Science.gov (United States)

    Liu, Sixing; Yang, Zheng; Zhang, Jianfeng; Zhang, Shanwen; Miao, Hong; Zhang, Yanjun; Zhang, Qi

    2018-05-01

    Two pieces of plate glass were brazed into a composite of glazing with a vacuum chamber using PbO-TiO2-SiO2-RxOy powder filler alloys to develop a new type of vacuum glazing. The brazing process was carried out by laser technology. The interface characteristics of laser brazed joints formed between plate glass and solder were investigated using optical microscope, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD) techniques. The results show that the inter-diffusion of Pb/Ti/Si/O elements from the sealing solder toward the glass and O/Al/Si elements from the glass toward the solder, resulting in a reaction layer in the brazed joints. The microstructure phases of PbTiO3, AlSiO, SiO2 and PbO in the glass/solder interface were confirmed by XRD analysis. The joining of the sealing solder to the glass was realized by the reaction products like fibrous structures on interface, where the wetting layer can help improve the bonding performance and strength between the sealing solder and the plate glass during the laser brazing process.

  15. Soldered Power Arm: An Easy and Effective Method for Intrusion and Retraction of Anterior Teeth

    Directory of Open Access Journals (Sweden)

    Ketan K Vakil

    2014-01-01

    Full Text Available The orthodontic correction of deep overbite can be achieved with several mechanisms that will result in true intrusion of anterior teeth, extrusion of posterior teeth, or a combination of both. For the orthodontic correction of bimaxillary dentoalveolar protrusion with deep bite, there are several treatment modalities like segmented arch approach, retraction and intrusion utility arches, temporary anchorage devices. Though not a novel therapeutic concept, the use of miniscrew implants to obtain absolute anchorage has recently become very popular in clinical orthodontic approaches. To allow the use of sliding mechanics for bodily retraction with intrusion of anterior teeth, we devised a soldered power arm (SPA on standard molar tube. It is simple, stable, precise and effective in cases where anterior teeth need to be simultaneously retracted and intruded. A power arm can be readily fabricated from 20 gauge stainless steel wire and soldered on the molar buccal tube so as to avoid any distortion or loosening of power arm from molar tube during the course of the treatment. The SPA works efficiently with the molar being stabilized in all three planes of space. The resultant force vector is directed more apically toward the center of resistance of the anchor unit, which resulted in the treatment outcome of retraction and intrusion of the anterior teeth and correction of the deep bite.

  16. Microstructure and bonding mechanism of Al/Ti bonded joint using Al-10Si-1Mg filler metal

    International Nuclear Information System (INIS)

    Sohn, Woong H.; Bong, Ha H.; Hong, Soon H.

    2003-01-01

    The microstructures and liquid state diffusion bonding mechanism of cp-Ti to 1050 Al using an Al-10.0wt.%Si-1.0wt.%Mg filler metal with 100 μm in thickness have been investigated at 620 deg. C under 1x10 -4 Torr. The effects of bonding process parameters on microstructure of bonded joint have been analyzed by using an optical microscope, AES, scanning electron microscopy and EDS. The interfacial bond strength of Al/Ti bonded joints was measured by the single lap shear test. The results show that the bonding at the interface between Al and filler metal proceeds by wetting the Al with molten filler metal, and followed by removal of oxide layer on surface of Al. The interface between Al and filler metal moved during the isothermal solidification of filler metal by the diffusion of Si from filler metal into Al layer. The interface between Al and filler metal became curved in shape with increasing bonding time due to capillary force at grain boundaries. The bonding at the interface between Ti and filler metal proceeds by the formation of two different intermetallic compound layers, identified as Al 5 Si 12 Ti 7 and Al 12 Si 3 Ti 5 , followed by the growth of the intermetallic compound layers. The interfacial bond strength at Al/Ti joint increased with increasing bonding time up to 25 min at 620 deg. C. However, the interfacial bond strength of Al/Ti joint decreased after bonding time of 25 min at 620 deg. C due to formation of cavities in Al near Al/intermetallic interfaces

  17. Horizon shells and BMS-like soldering transformations

    Energy Technology Data Exchange (ETDEWEB)

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

    2016-03-07

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  18. Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

    2017-07-27

    Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integrated with attractive fabrication techniques for thermoelectric modules, such as screen printing, suggesting the potential of these solders in the rational design of printable and moldable thermoelectrics.

  19. Effects of PCB thickness on adjustable fountain wave soldering

    Indian Academy of Sciences (India)

    hybrid circuit assembly, component lead tinning, and wire tinning. .... The mesh model was built and optimized with 599920 hybrid nodes as shown in figure 9. ... conducted to track the fluid motions of the two phases (i.e., molten solder and air).

  20. Synchronised and complementary coordination mechanisms in an asymmetric joint aiming task

    DEFF Research Database (Denmark)

    Skewes, Joshua Charles; Skewes, Lea; Michael, John

    2015-01-01

    Many forms of social interaction require that behaviour be coordinated in the here and now. Much research has been conducted on how people coordinate their actions in real time to achieve a joint goal, showing that people use both synchronised (i.e. symmetric) and complementary (i.e. asymmetric) ...... in this asymmetric task, as people synchronise better with an irregular, but adaptive partner, than with a completely predictable, but non-responsive metronome. These results show that given asymmetric task constraints, adaptability, rather than predictability facilitates coordination....