Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

Science.gov (United States)

Lee, Sang-Yeob; Lee, Jong-Hyuk

2010-12-01

The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

Effect of gamma radiation on micromechanical hardness of lead-free solder joint

Energy Technology Data Exchange (ETDEWEB)

Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

2015-09-25

Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

Energy Technology Data Exchange (ETDEWEB)

Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

2013-06-01

The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

Science.gov (United States)

Wei, Helin; Wang, Kuisheng

2011-11-01

Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

Science.gov (United States)

Suhir, E.; Yi, S.; Ghaffarian, R.

2017-03-01

It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

International Nuclear Information System (INIS)

Liu, X.W.; Plumbridge, W.J.

2003-01-01

The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

Visual detection of defects in solder joints

Science.gov (United States)

Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

1995-03-01

The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

International Nuclear Information System (INIS)

Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

2008-01-01

The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines

The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

Science.gov (United States)

Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

2015-12-01

Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (ptensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

Science.gov (United States)

Mayappan, R.; Salleh, A.; Andas, J.

2017-09-01

Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

Multi-layer SiC ceramics/Mo joints brazed using high-temperature solders

International Nuclear Information System (INIS)

Olesinska, W.; Kesik, J.

2003-01-01

The paper presents the results of studies on joining SiC ceramics with molybdenum, with the ceramic surface being activated by titanium, chromium or copper. Titanium or chromium were deposited by the sputtering technique, and copper - by the electro-chemical method. The microstructures of the SiC/Mo joints brazed with the CuMn13Ni3 solder and copper in a nitrogen atmosphere were examined and the results discussed. The joints, in which the ceramic surface was activated in addition with chromium, do not contain mechanical defects caused by the joining process, and the ceramic surface is covered with a continuous layer of the solder. A phase analysis of the interface surface identified an MeSiC phase. The mechanical strength of the joints in which the ceramic surface was modified by the Ti, Cr and Cu layers was markedly greater than that of the joints brazed directly to the uncoated ceramics with the use of active solders. (author)

Effect of gap distance on tensile strength of preceramic base metal solder joints.

Science.gov (United States)

Fattahi, Farnaz; Motamedi, Milad

2011-01-01

In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023), but the differences between other groups were not sig-nificant at a significance level of 0.05. There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints.

In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

Energy Technology Data Exchange (ETDEWEB)

Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

2008-10-31

The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock

Science.gov (United States)

Han, Jing; Tan, Shihai; Guo, Fu

2018-01-01

Ball grid array (BGA) samples were soldered on a printed circuit board with Sn37Pb solder paste to investigate the recrystallization induced by subgrain rotation during thermal shock. The composition of the solder balls was Sn3.0Ag0.5Cu-Sn37Pb, which comprised mixed solder joints. The BGA component was cross-sectioned before thermal shock. The microstructure and grain orientations were obtained by a scanning electron microscope equipped with an electron back-scattered diffraction system. Two mixed solder joints at corners of the BGA component were selected as the subjects. The results showed that recrystallization occurred at the corner of the solder joints after 200 thermal shock cycles. The recrystallized subgrains had various new grain orientations. The newly generated grain orientations were closely related to the initial grain orientations, which indicated that different subgrain rotation behaviors could occur in one mixed solder joint with the same initial grain orientation. When the misorientation angles were very small, the rotation axes were about Sn [100], [010] and [001], as shown by analyzing the misorientation angles and subgrain rotation axes, while the subgrain rotation behavior with large misorientation angles in the solder joints was much more complicated. As Pb was contained in the solder joints and the stress was concentrated on the corner of the mixed solder joints, concaves and cracks were formed. When the adjacent recrystallized subgrains were separated, and the process of the continuous recrystallization was limited.

Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

Science.gov (United States)

Yoon, Jeong-Won; Noh, Bo-In; Jung, Seung-Boo

2011-09-01

Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.

Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

Science.gov (United States)

Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

2016-12-01

To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

Investigation into mechanical properties of joints of heterogeneous materials brazed with high-temperature solders

International Nuclear Information System (INIS)

Lomenko, V.I.; Merkushev, V.P.; Borodina, L.M.; Sycheva, T.S.; Tokhtina, O.A.; Frolov, N.N.

1988-01-01

Mechanical properties of copper joints with copper, 12Kh18M10T steel and KhD50 composite obtained by vacuum brazing by copper-titanium solder as compared with properties of joints brazed by PSr 72 and PMFOTsr 6-4-0.03 solders in hydrogen are studied. Dependences of joints strength on temperature of contact - reactive vacuum brazing are obtained. Possible applications of joints of dissimilar materials in electrovacuum devices subjected to the effect of dynamic loadings are established

Proposal of guideline for bonding to prevention of hydrogen embrittlement at Ta/Zr bond interface. Hydrogen embrittlement in SUS304ULC/Ta/Zr explosive bonded joint

International Nuclear Information System (INIS)

Saida, Kazuyoshi; Fujimoto, Tetsuya; Nishimoto, Kazutoshi

2010-01-01

The occurrence condition of hydrogen embrittlement cracking at Ta/Zr bond interface was investigated with respect to the hydrogen content and applied stress in order to propose a guideline for the explosive bonding procedure to prevention of hydrogen embrittlement. Hydrogen charging test was conducted for SUS304ULC/Ta/Zr explosive bonded joints applied the different flexural strains. A hydrogen embrittlement crack occurred in the Zr substrate at Ta/Zr bond interface after hydrogen charging, and it was initiated at shorter charging times when the augmented strain was increased. The occurrence condition of hydrogen embrittlement cracking at Ta/Zr bond interface was shifted to lower stress and hydrogen content with an increase in the amount of explosive during bonding. It was suggested that hydrogen embrittlement in Ta/Zr explosive bonded joint could be inhibited by reducing the initial hydrogen content in Ta substrate less than approx. 5 ppm. (author)

Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

Science.gov (United States)

Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R.

2014-01-01

A fracture mechanism map (FMM) is a powerful tool which correlates the fracture behavior of a material to its microstructural characteristics in an explicit and convenient way. In the FMM for solder joints, an effective thickness of the interfacial intermetallic compound (IMC) layer ( t eff) and the solder yield strength ( σ ys,eff) are used as abscissa and ordinate axes, respectively, as these two predominantly affect the fracture behavior of solder joints. Earlier, a definition of t eff, based on the uniform thickness of IMC ( t u) and the average height of the IMC scallops ( t s), was proposed and shown to aptly explain the fracture behavior of solder joints on Cu. This paper presents a more general definition of t eff that is more widely applicable to a range of metallizations, including Cu and electroless nickel immersion gold (ENIG). Using this new definition of t eff, mode I FMM for SAC387/Cu joints has been updated and its validity was confirmed. A preliminary FMM for SAC387/Cu joints with ENIG metallization is also presented.

Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

International Nuclear Information System (INIS)

Zhang, Liang; Han, Ji-guang; Guo, Yong-huan; He, Cheng-wen

2014-01-01

With the addition of 0.03 wt% rare earth Ce, in our previous works, the properties of SnAgCu solder were enhanced obviously. Based on the Garofalo–Arrhenius creep constitutive model, finite element method was used to simulate the stress–strain response during thermal cycle loading, and combined with the fatigue life prediction models, the fatigue life of SnAgCu/SnAgCuCe solder joints was calculated respectively, which can demonstrate the effect of the rare earth Ce on the fatigue life of SnAgCu solder joints. The results indicated that the maximum stress–strain can be found on the top surface of the corner solder joint, and the warpage of the PCB substrate occurred during thermal cycle loading. The trends obtained from modeling results have a good agreement with the experimental data reported in the literature for WLCSP devices. In addition, the stress–strain of SnAgCuCe solder joints is lower than that of SnAgCu solder joints. The thermal fatigue lives of solder joints calculated based on the creep model and creep strain energy density model show that the fatigue life of SnAgCuCe solder joints is higher than the SnAgCu solder joints. The fatigue life of SnAgCuCe solder joints can be enhanced significantly with the addition of Ce, is 30.2% higher than that of SnAgCu solder joints, which can be attributed to the CeSn 3 particles formed resisting the motion of dislocation; moreover, the refinement of microstructure and the IMC sizes also contribute to the enhancement of fatigue life, which elucidates that SnAgCuCe solder can be utilized in electronic industry with high reliability replacing the SnAgCu solder

Aging treatment characteristics of solder bump joint for high reliability optical module

International Nuclear Information System (INIS)

Kim, Kyung-Seob; Yu, Chung-Hee; Yang, Jun-Mo

2004-01-01

The joint strength and fracture surfaces of Sn-37 mass% Pb and Au stud bumps for photo diode packages after isothermal aging testing were studied experimentally. Al/Au stud bumps and Cu/Sn-37 mass% Pb solders were adopted, and aged for up to 900 h to analyze the effect of intermetallic compound (IMC). The joint strength decreased with aging time. The diffraction patterns of Cu 6 Sn 5 , scallop-shaped IMCs, and planar-shaped Cu 3 Sn were characterized using transmission electron microscopy (TEM). The formation of Kirkendall voids and the growth of IMCs at the solder were found to be a possible mechanism for joint strength reduction

Impurity Effects in Electroplated-Copper Solder Joints

Directory of Open Access Journals (Sweden)

Hsuan Lee

2018-05-01

Full Text Available Copper (Cu electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl disulfide (SPS with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

Transition temperature of embrittlement of steel 11 474.1 welded joint

International Nuclear Information System (INIS)

Petrikova, A.; Cocher, M.

1987-01-01

The results are presented of tests of notch toughness in dependence on temperature for steel 11 474.1 used for the manufacture of steam separators, in the area of a joint welded using an automatic submerged-arc welding machine with pre-heating at 200 to 250 degC. After welding, the welded joints were annealed for reduced stress for 160 minutes at a temperature of 600 to 650 degC and left to cool off in the furnace. The obtained results show that: (1) critical embrittlement temperature for the welded joint and the given welding technology ranges within -20 and -13 degC; (2) critical embrittlement temperature following heat ageing is shifted to positive temperature values; (3) pressure tests of the steam separator jacket made of steel 11 474.1 may in the process of production be carried out at a minimal wall temperature of 17 degC; (4) in case a pressure test has to be made after the equipment has been in operation for a certain period of time the test will probably have to be made at temperatures higher than 20 degC; (5) further tests will have to be made at temperatures higher than 20 degC in order to determine critical embrittlement temperatures after ageing. (J.B.). 7 figs., 2 tabs., 5 refs

Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

Energy Technology Data Exchange (ETDEWEB)

Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

2008-07-14

Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

SMT soldering handbook

National Research Council Canada - National Science Library

Strauss, Rudolf

1998-01-01

... 3.2.1 Constituents, melting behaviour and mechanical properties 3.2.2 Composition of solders for use in electronics 3.2.3 Lead-free solders 3.2.4 Solder impurities The soldered joint 3.3.1 Solde...

Soldering handbook

CERN Document Server

Vianco, Paul T

1999-01-01

Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

Directory of Open Access Journals (Sweden)

Shuye Zhang

2018-01-01

Full Text Available Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile electronic applications. However, crack formation of the solder joint crack was occurred at low temperature curable acrylic polymer resins after bonding processes. In this study, the mechanism of SnBi58 solder joint crack at low temperature curable acrylic adhesive was investigated. In addition, SnBi58 solder joint cracks can be significantly removed by increasing the storage modulus of adhesives instead of coefficient of thermal expansion. The first approach of reducing the amount of polymer rebound can be achieved by using an ultrasonic bonding method to maintain a bonding pressure on the SnBi58 solder joints cooling to room temperature. The second approach is to increase storage modulus of adhesives by adding silica filler into acrylic polymer resins to prevent the solder joint from cracking. Finally, excellent acrylic based SnBi58 solder joints reliability were obtained after 1000 cycles thermal cycling test.

Lead free solder mechanics and reliability

CERN Document Server

Pang, John Hock Lye

2012-01-01

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

Science.gov (United States)

Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

2011-01-01

The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

Energy Technology Data Exchange (ETDEWEB)

Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

2008-04-24

The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes.

Reliability and microstructure of lead-free solder joints in industrial electronics after accelerated thermal aging

NARCIS (Netherlands)

Scaltro, F.; Biglari, M.H.; Kodentsov, A.; Yakovleva, O.; Brom, E.

2009-01-01

The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface component/solder together with the formation of fractures. The evolution, the morphology and the elemental

Solderability study of RABiTS-based YBCO coated conductors

International Nuclear Information System (INIS)

Zhang Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

2011-01-01

Study examines the implication of solder and flux selection in YBCO splice joints. Focus is on commercially available RABiTS-based YBCO coated conductors. Solderability varied with solder and flux for three different stabilizations tested. Resistivity of stabilizer was dominant factor in splice joint resistance. Solder materials affected splice joint resistance when solderability was poor. The solderability of commercially available YBa 2 Cu 3 O 7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints

International Nuclear Information System (INIS)

Dudek, M.A.; Hunter, L.; Kranz, S.; Williams, J.J.; Lau, S.H.; Chawla, N.

2010-01-01

The volume, size, and dispersion of porosity in solder joints are known to affect mechanical performance and reliability. Most of the techniques used to characterize the three-dimensional (3D) nature of these defects are destructive. With the enhancements in high resolution computed tomography (CT), the detection limits of intrinsic microstructures have been significantly improved. Furthermore, the 3D microstructure of the material can be used in finite element models to understand their effect on microscopic deformation. In this paper we describe a technique utilizing high resolution (< 1 μm) X-ray tomography for the three-dimensional (3D) visualization of pores in Sn-3.9Ag-0.7Cu/Cu joints. The characteristics of reflow porosity, including volume fraction and distribution, were investigated for two reflow profiles. The size and distribution of porosity size were visualized in 3D for four different solder joints. In addition, the 3D virtual microstructure was incorporated into a finite element model to quantify the effect of voids on the lap shear behavior of a solder joint. The presence, size, and location of voids significantly increased the severity of strain localization at the solder/copper interface.

On the problem of soldering refractory metals with silver-containing solders

International Nuclear Information System (INIS)

Anikeev, E.F.; Andryushchenko, V.I.; Chepelenko, V.N.; Batov, V.M.

1981-01-01

The processes of wetting, spreading and interphase interactions of copper-silver liquid alloys alloyed with Ni and Si, with niobium, tantalum, molybdenum, tungsten, 12Kh18N10T steel and nickel are studied. It has been determined that Ni or Si additions into the copper-silver solder improve the wetting and adhesion. When soldering with the alloy containing Ni additions, the strength of a soldered Joint grows with the increase of soldering duration while soldering with the alloy containing Si additions, the strength decreases. That is why Ni-containing solders are preferable for soldering thick-walled structures, and Si-containing solders - for thin-walled structures [ru

A review of typical thermal fatigue failure models for solder joints of electronic components

Science.gov (United States)

Li, Xiaoyan; Sun, Ruifeng; Wang, Yongdong

2017-09-01

For electronic components, cyclic plastic strain makes it easier to accumulate fatigue damage than elastic strain. When the solder joints undertake thermal expansion or cold contraction, different thermal strain of the electronic component and its corresponding substrate is caused by the different coefficient of thermal expansion of the electronic component and its corresponding substrate, leading to the phenomenon of stress concentration. So repeatedly, cracks began to sprout and gradually extend [1]. In this paper, the typical thermal fatigue failure models of solder joints of electronic components are classified and the methods of obtaining the parameters in the model are summarized based on domestic and foreign literature research.

The Shear Strength and Fracture Behavior of Sn-Ag- xSb Solder Joints with Au/Ni-P/Cu UBM

Science.gov (United States)

Lee, Hwa-Teng; Hu, Shuen-Yuan; Hong, Ting-Fu; Chen, Yin-Fa

2008-06-01

This study investigates the effects of Sb addition on the shear strength and fracture behavior of Sn-Ag-based solders with Au/Ni-P/Cu underbump metallization (UBM) substrates. Sn-3Ag- xSb ternary alloy solder joints were prepared by adding 0 wt.% to 10 wt.% Sb to a Sn-3.5Ag alloy and joining them with Au/Ni-P/Cu UBM substrates. The solder joints were isothermally stored at 150°C for up to 625 h to study their microstructure and interfacial reaction with the UBM. Single-lap shear tests were conducted to evaluate the mechanical properties, thermal resistance, and failure behavior. The results show that UBM effectively suppressed intermetallic compound (IMC) formation and growth during isothermal storage. The Sb addition helped to refine the Ag3Sn compounds, further improving the shear strength and thermal resistance of the solders. The fracture behavior evolved from solder mode toward the mixed mode and finally to the IMC mode with increasing added Sb and isothermal storage time. However, SnSb compounds were found in the solder with 10 wt.% Sb; they may cause mechanical degradation of the solder after long-term isothermal storage.

Mechanical performances of lead-free solder joint connections with applications in the aerospace domain

Directory of Open Access Journals (Sweden)

Georgiana PADURARU

2016-03-01

Full Text Available The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of solder joint in correlation with different pad finishes, there were made some mechanical determinations using a dedicated Share Test System. The theoretical model highlights the link between the experimental results and the influence of gravitational acceleration on the mechanical and functional integrity of the electronic assemblies that works in vibration environment. The paper novelty is provided by the interdisciplinary experiment that offers results that can be used in the mechanical, tribological, electronical and aerospace domains.

An evaluation of the spring finger solder joints on SA1358-10 and SA2052-4 connector assemblies (MC3617,W87)

International Nuclear Information System (INIS)

Kilgo, Alice C.; Vianco, Paul Thomas; Hlava, Paul Frank; Zender, Gary L.

2006-01-01

The SA1358-10 and SA2052-4 circular JT Type plug connectors are used on a number of nuclear weapons and Joint Test Assembly (JTA) systems. Prototype units were evaluated for the following specific defects associated with the 95Sn-5Sb (Sn-Sb, wt.%) solder joint used to attach the beryllium-copper (BeCu) spring fingers to the aluminum (Al) connector shell: (1) extended cracking within the fillet; (2) remelting of the solder joint during the follow-on, soldering step that attached the EMR adapter ring to the connector shell (and/or soldering the EMR shell to the adapter ring) that used the lower melting temperature 63Sn-37Pb (Sn-Pb) alloy; and (3) spalling of the Cd (Cr) layer overplating layer from the fillet surface. Several pedigrees of connectors were evaluated, which represented older fielded units as well as those assemblies that were recently constructed at Kansas City Plant. The solder joints were evaluated that were in place on connectors made with the current soldering process as well as an alternative induction soldering process for attaching the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely reflected the different extents to which the connector was mated to its counterpart assembly. In all cases, the spring finger solder joints on the SA1358-10 connectors were remelted as a result of the subsequent EMR adapter ring attachment process. Spalling of the Cd (Cr) overplating layer was also observed for these connectors, which was a consequence of the remelting activity. On the other hand, the SA2052-4 connector did not exhibit evidence of

Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint

Science.gov (United States)

Darbandi, Payam

Due to the awareness of the potential health hazards associated with the toxicity of lead (Pb), actions have been taken to eliminate or reduce the use of Pb in consumer products. Among those, tin (Sn) solders have been used for the assembly of electronic systems. Anisotropy is of significant importance in all structural metals, but this characteristic is unusually strong in Sn, making Sn based solder joints one of the best examples of the influence of anisotropy. The effect of anisotropy arising from the crystal structure of tin and large grain microstructure on the microstructure and the evolution of constitutive responses of microscale SAC305 solder joints is investigated. Insights into the effects of key microstructural features and dominant plastic deformation mechanisms influencing the measured relative activity of slip systems in SAC305 are obtained from a combination of optical microscopy, orientation imaging microscopy (OIM), slip plane trace analysis and crystal plasticity finite element (CPFE) modeling. Package level SAC305 specimens were subjected to shear deformation in sequential steps and characterized using optical microscopy and OIM to identify the activity of slip systems. X-ray micro Laue diffraction and high energy monochromatic X-ray beam were employed to characterize the joint scale tensile samples to provide necessary information to be able to compare and validate the CPFE model. A CPFE model was developed that can account for relative ease of activating slip systems in SAC305 solder based upon the statistical estimation based on correlation between the critical resolved shear stress and the probability of activating various slip systems. The results from simulations show that the CPFE model developed using the statistical analysis of activity of slip system not only can satisfy the requirements associated with kinematic of plastic deformation in crystal coordinate systems (activity of slip systems) and global coordinate system (shape changes

Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

Science.gov (United States)

Abdelhadi, Ousama Mohamed Omer

Continuous miniaturization of microelectronic interconnects demands smaller joints with comparable microstructural and structural sizes. As the size of joints become smaller, the volume of intermetallics (IMCs) becomes comparable with the joint size. As a result, the kinetics of bond formation changes and the types and thicknesses of IMC phases that form within the constrained region of the bond varies. This dissertation focuses on investigating combination effects of process parameters and size on kinetics of bond formation, resulting microstructure and the mechanical properties of joints that are formed under structurally constrained conditions. An experiment is designed where several process parameters such as time of bonding, temperature, and pressure, and bond thickness as structural chracteristic, are varied at multiple levels. The experiment is then implemented on the process. Scanning electron microscope (SEM) is then utilized to determine the bond thickness, IMC phases and their thicknesses, and morphology of the bonds. Electron backscatter diffraction (EBSD) is used to determine the grain size in different regions, including the bulk solder, and different IMC phases. Physics-based analytical models have been developed for growth kinetics of IMC compounds and are verified using the experimental results. Nanoindentation is used to determine the mechanical behavior of IMC phases in joints in different scales. Four-point bending notched multilayer specimen and four-point bending technique were used to determine fracture toughness of the bonds containing IMCs. Analytical modeling of peeling and shear stresses and fracture toughness in tri-layer four-point bend specimen containing intermetallic layer was developed and was verified and validated using finite element simulation and experimental results. The experiment is used in conjunction with the model to calculate and verify the fracture toughness of Cu6Sn5 IMC materials. As expected two different IMC phases

Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

Science.gov (United States)

Mukherjee, S.; Chauhan, P.; Osterman, M.; Dasgupta, A.; Pecht, M.

2016-07-01

Mechanistic microstructural models have been developed to capture the effect of isothermal aging on time dependent viscoplastic response of Sn3.0Ag0.5Cu (SAC305) solders. SnAgCu (SAC) solders undergo continuous microstructural coarsening during both storage and service because of their high homologous temperature. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long term reliability of microelectronic packages. It is well documented that isothermal aging degrades the creep resistance of SAC solder. SAC305 alloy is aged for (24-1000) h at (25-100)°C (~0.6-0.8 × T melt). Cross-sectioning and image processing techniques were used to periodically quantify the effect of isothermal aging on phase coarsening and evolution. The parameters monitored during isothermal aging include size, area fraction, and inter-particle spacing of nanoscale Ag3Sn intermetallic compounds (IMCs) and the volume fraction of micronscale Cu6Sn5 IMCs, as well as the area fraction of pure tin dendrites. Effects of microstructural evolution on secondary creep constitutive response of SAC305 solder joints were then modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs in the eutectic phase; and (2) load sharing between pro-eutectic Sn dendrites and the surrounding coarsened eutectic Sn-Ag phase and microscale Cu6Sn5 IMCs. The coarse-grained polycrystalline Sn microstructure in SAC305 solder was not captured in the above model because isothermal aging does not cause any significant change in the initial grain size and orientation of SAC305 solder joints. The above mechanistic model can successfully capture the drop in creep resistance due to the influence of isothermal aging on SAC305 single crystals. Contribution of grain boundary sliding to the creep strain of

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Science.gov (United States)

Coyle, Richard J.; Sweatman, Keith; Arfaei, Babak

2015-09-01

Thermal fatigue is a major source of failure of solder joints in surface mount electronic components and it is critically important in high reliability applications such as telecommunication, military, and aeronautics. The electronic packaging industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu alloys first established as replacements for eutectic SnPb. This paper discusses the results from Pb-free solder joint reliability programs sponsored by two industry consortia. The characteristic life in accelerated thermal cycling is reported for 12 different Pb-free solder alloys and a SnPb control in 9 different accelerated thermal cycling test profiles in terms of the effects of component type, accelerated thermal cycling profile and dwell time. Microstructural analysis on assembled and failed samples was performed to investigate the effect of initial microstructure and its evolution during accelerated thermal cycling test. A significant finding from the study is that the beneficial effect of Ag on accelerated thermal cycling reliability (measured by characteristic lifetime) diminishes as the severity of the accelerated thermal cycling, defined by greater ΔT, higher peak temperature, and longer dwell time increases. The results also indicate that all the Pb-free solders are more reliable in accelerated thermal cycling than the SnPb alloy they have replaced. Suggestions are made for future work, particularly with respect to the continued evolution of alloy development for emerging application requirements and the value of using advanced analytical methods to provide a better understanding of the effect of microstructure and its evolution on accelerated thermal cycling performance.

Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

Directory of Open Access Journals (Sweden)

Jinhua Mi

2014-01-01

Full Text Available Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA and fine-pitch ball grid array (FBGA interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products.

Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

Science.gov (United States)

2015-05-05

under bump metallurgy and solder joint geometry on Sn grain morphology in Pb free solder joints were examined. SnAgCu solder joints were examined for...free solder interconnects”, Sci. Technol. Weld . Join. 13, 732 (2008). [3.25] Terashima, S., Takahama, K., Nozaki, M., and Tanaka, M. Recrystallization

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

International Nuclear Information System (INIS)

Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

2015-01-01

Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. (review)

Interface between Sn-Sb-Cu solder and copper substrate

Energy Technology Data Exchange (ETDEWEB)

Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

2011-07-15

Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Science.gov (United States)

Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

2015-01-01

Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. PMID:27877786

Electromigration in 3D-IC scale Cu/Sn/Cu solder joints

Energy Technology Data Exchange (ETDEWEB)

Ho, Cheng-En, E-mail: ceho1975@hotmail.com; Lee, Pei-Tzu; Chen, Chih-Nan; Yang, Cheng-Hsien

2016-08-15

The electromigration effect on the three-dimensional integrated circuits (3D-IC) scale solder joints with a Cu/Sn(25–50 μm)/Cu configuration was investigated using a field-emission scanning electron microscope (FE–SEM) combined with electron backscatter diffraction (EBSD) analysis system. Electron current stressing for a few days caused the pronounced accumulation of Cu{sub 6}Sn{sub 5} in specific Sn grain boundaries (GBs). The EBSD analysis indicated that both the β-Sn crystallographic orientation and GB orientation play dominant roles in this accumulation. The dependencies of the Cu{sub 6}Sn{sub 5} accumulation on the two above factors (i.e., Sn grain orientation and GB orientation) can be well rationalized via a proposed mathematic model based on the Huntington and Grone's electromigration theory with the Cu anisotropic diffusion data in a β-Sn lattice. - Highlights: • Anisotropic Cu electromigration in the 3D-IC scale microelectronic solder joints. • Pronounced accumulation of Cu{sub 6}Sn{sub 5} intermetallic in specific Sn grain boundaries. • A linear dependence of Cu{sub 6}Sn{sub 5} accumulation over the current stressing time. • β-Sn and grain boundary orientations are the dominant factors in Cu{sub 6}Sn{sub 5} accumulation.

The creep behavior of In-Ag eutectic solder joints

International Nuclear Information System (INIS)

Reynolds, H.L.; Kang, S.H.; Morris, J.W. Jr.; Univ. of California, Berkeley, CA

1999-01-01

The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90 C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the In-rich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems

The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder joint

Energy Technology Data Exchange (ETDEWEB)

Fleshman, Collin; Chen, Wei-Yu; Chou, Tzu-Ting [Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan (China); Huang, Jia-Hong [Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan (China); Duh, Jenq-Gong, E-mail: jgd@mx.nthu.edu.tw [Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan (China)

2017-03-01

In this study, the slow speed shear test in both Sn-3.0Ag-0.5Cu (wt%)/OSP Cu and Sn-3.0Ag-0.5Cu-0.1Ni (wt%)/OSP Cu assembly with the ball heights of 300 μm and the corresponding grain structures were investigated. With the aid of Electron Back Scattering Diffraction (EBSD) analysis, single grain structure was observed in Sn-3.0Ag-0.5Cu/OSP Cu. Besides, Ni was found to control the grain structure in Sn-3.0Ag-0.5Cu-0.1Ni solder balls, showing multiple grains with partially interlaced structure. The grain variation resulted from larger undercooling caused by smaller ball size and Ni-dopant induced tiny intermetallic compounds (IMCs). IMCs serve as heterogeneous nucleation sites for β-tin and thus alter the grain structure of solder balls. The results of shear test reveal that the peak force of solder joints was efficiently enhanced by the addition of Ni. The enhancement of mechanical strength was attributed to the modification of grain structure by the introduction of Ni dopant. It is believed that the smaller grains, tiny intermetallic compounds, and the oriented interlaced area in Ni-doped solder joints became energy barriers for propagation of cracks and dislocations. It is demonstrated that Ni-doped solder joints tend to exhibit better mechanical reliability in advanced electronic packaging. - Highlights: • The grain structure and slow speed shear test performance were investigated. • Doping Ni into solder induce interlaced grain structure. • Interlaced structure can enhance mechanical reliability in BGA packaging.

Influence of intermetallic growth on the mechanical properties of Zn–Sn–Cu–Bi/Cu solder joints

Energy Technology Data Exchange (ETDEWEB)

Xing, Fei; Yao, Jia; Liang, Jingwei; Qiu, Xiaoming, E-mail: qiuxm13@163.com

2015-11-15

The formation of intermetallic reaction layers and their influence on shear strength and fractography was investigated between the Zn–Sn–Cu–Bi (ZSCB) and Cu substrate during the liquid state reaction at 450 °C after 10–90 s. Results showed that reliable solder joints could be obtained at 450 °C after 15–30 s of wetting, accompanied by the creation of scallop ε-CuZn{sub 5}, flat γ-Cu{sub 5}Zn{sub 8} and β-CuZn intermetallic layers in ZSCB/Cu interface. However, with excess increase of soldering time, a transient intermetallic ε-CuZn{sub 4} phase was nuclear and grew at ε-CuZn{sub 5}/γ-Cu{sub 5}Zn{sub 8} interface, which apparently deteriorated the shear strength of solder joints from 76.5 MPa to 51.6 MPa. The sensitivity of the fracture proportion was gradually transformed from monotonic ε-CuZn{sub 5} to the mixture of ε-CuZn{sub 4} and ε-CuZn{sub 5} intermetallic cleavage. Furthermore, the growth mechanism of ε-CuZn{sub 4} intermetallic phase at the ZSCB/Cu interface was discussed. - Highlights: • There are four interfacial intermetallic layers formed at the Zn–Sn–Cu–Bi/Cu interface. • The growth mechanism of ε-CuZn{sub 4} intermetallic phase was discussed. • The wetting time of Zn–Sn–Cu–Bi solder in contact with Cu substrate is a key parameter.

Soldering of copper-clad niobium--titanium superconductor composite

International Nuclear Information System (INIS)

Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

1977-04-01

When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

International Nuclear Information System (INIS)

Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

2010-01-01

In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

Energy Technology Data Exchange (ETDEWEB)

Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

2010-02-18

In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

Microstructure evolution and thermomechanical fatigue of solder materials

NARCIS (Netherlands)

Matin, M.A.

2005-01-01

The microelectronics industry is confronted with the new challenge to produce joints with lead-free solder materials replacing classical tin-lead solders in devices used in many fields (e.g. consumer electronics, road transport, aviation, space-crafts, telecommunication). In service, solder

Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

OpenAIRE

Koo, Ja-Myeong; Jung, Seung-Boo

2007-01-01

Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920); International audience; Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafte...

Features of Pd-Ni-Fe solder system for vacuum brazing of low alloy steels

International Nuclear Information System (INIS)

Radzievskij, V.N.; Kurochko, R.S.; Lotsmanov, S.N.; Rymar', V.I.

1975-01-01

The brazing solder of the Pd-Ni-Fe alloyed with copper and lithium, in order to decrease the melting point and provide for a better spreading, when soldered in vacuum ensures a uniform strength of soldered joints with the base metal of low-alloyed steels of 34KHNIM-type. The properties of low-alloyed steel joints brazed with the Pd-Ni-Fe-system solder little depend on the changes in the soldering parameters. The soldered joint keeps a homogeneous structure after all the stages of heat treatment (annealing, quenching and tempering)

Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages

Science.gov (United States)

Talebanpour, B.; Huang, Z.; Chen, Z.; Dutta, I.

2016-01-01

In 3-dimensional (3D) packages, a stack of dies is vertically connected to each other using through-silicon vias and very thin solder micro-bumps. The thinness of the micro-bumps results in joints with a very high volumetric proportion of intermetallic compounds (IMCs), rendering them much more brittle compared to conventional joints. Because of this, the reliability of micro-bumps, and the dependence thereof on the proportion of IMC in the joint, is of substantial concern. In this paper, the growth kinetics of IMCs in thin Sn-3Ag-0.5Cu joints attached to Cu substrates were analyzed, and empirical kinetic laws for the growth of Cu6Sn5 and Cu3Sn in thin joints were obtained. Modified compact mixed mode fracture mechanics samples, with adhesive solder joints between massive Cu substrates, having similar thickness and IMC content as actual micro-bumps, were produced. The effects of IMC proportion and strain rate on fracture toughness and mechanisms were investigated. It was found that the fracture toughness G C decreased with decreasing joint thickness ( h Joint). In addition, the fracture toughness decreased with increasing strain rate. Aging also promoted alternation of the crack path between the two joint-substrate interfaces, possibly proffering a mechanism to enhance fracture toughness.

The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints

Science.gov (United States)

Sona, Mrunali; Prabhu, K. Narayan

2017-09-01

The failure of solder joints due to imposed stresses in an electronic assembly is governed by shear bond strength. In the present study, the effect of wetting gravity regime on single-lap shear strength of Sn-0.3Ag-0.7Cu and Sn-2.5Ag-0.5Cu solder alloys reflowed between bare copper substrates as well as Ni-coated Cu substrates was investigated. Samples were reflowed for 10 s, T gz (time corresponding to the end of gravity regime) and 100 s individually and tested for single-lap shear strength. The single-lap shear test was also carried out on eutectic Sn-Pb/Cu- and Sn-Pb/Ni-coated Cu specimens to compare the shear strength values obtained with those of lead-free alloys. The eutectic Sn-Pb showed significantly higher ultimate shear strength on bare Cu substrates when compared to Sn-Ag-Cu alloys. However, SAC alloys reflowed on nickel-coated copper substrate exhibited higher shear strength when compared to eutectic Sn-Pb/Ni-coated Cu specimens. All the substrate/solder/substrate lap joint specimens that were reflowed for the time corresponding to the end of gravity regime exhibited maximum ultimate shear strength.

Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process.

Science.gov (United States)

Li, Z L; Dong, H J; Song, X G; Zhao, H Y; Tian, H; Liu, J H; Feng, J C; Yan, J C

2018-04-01

Homogeneous (Cu, Ni) 6 Sn 5 intermetallic compound (IMC) joints were rapidly formed in asymmetrical Ni/Sn/Cu system by an ultrasound-induced transient liquid phase (TLP) soldering process. In the traditional TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system consisted of major (Cu, Ni) 6 Sn 5 and minor Cu 3 Sn IMCs, and the grain morphology of (Cu, Ni) 6 Sn 5 IMCs subsequently exhibited fine rounded, needlelike and coarse rounded shapes from the Ni side to the Cu side, which was highly in accordance with the Ni concentration gradient across the joints. However, in the ultrasound-induced TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system only consisted of the (Cu, Ni) 6 Sn 5 IMCs which exhibited an uniform grain morphology of rounded shape with a remarkably narrowed Ni concentration gradient. The ultrasound-induced homogeneous intermetallic joints exhibited higher shear strength (61.6 MPa) than the traditional heterogeneous intermetallic joints (49.8 MPa). Copyright © 2017 Elsevier B.V. All rights reserved.

Analysis of a short beam with application to solder joints: could larger stand-off heights relieve stress?

Science.gov (United States)

Suhir, Ephraim

2015-08-01

Physically meaningful and easy-to-use analytical (mathematical) stress model is developed for a short beam with clamped and known-in-advance offset ends. The analysis is limited to elastic deformations. While the classical Timoshenko short-beam theory seeks the beam's deflection caused by the combined bending and shear deformations for the given loading, an inverse problem is considered here: the lateral force is sought for the given ends offset. In short beams this force is larger than in long beams, since, in order to achieve the given displacement (offset), the applied force has to overcome both bending and shear resistance of the beam. It is envisioned that short beams could adequately mimic the state of stress in solder joint interconnections, including ball-grid-array (BGA) systems, with large, compared to conventional joints, stand-off heights. When the package/printed-circuit-board (PCB) assembly is subjected to the change in temperature, the thermal expansion (contraction) mismatch of the package and the PCB results in an easily predictable relative displacement (offset) of the ends of the solder joint. This offset can be determined from the known external thermal mismatch strain (determined as the product of the difference in the coefficients of thermal expansion and the change in temperature) and the position of the joint with respect to the mid-cross-section of the assembly. The maximum normal and shearing stresses could be viewed as suitable criteria of the beam's (joint's) material long-term reliability. It is shown that these stresses can be brought down by employing beam-like joints, i.e., joints with an increased stand-off height compared to conventional joints. It is imperative, of course, that, if such joints are employed, there is still enough interfacial real estate, so that the BGA bonding strength is not compromised. On the other hand, owing to the lower stress level, reliability assurance might be much less of a challenge than in the case of

Damage Model for Reliability Assessment of Solder Joints in Wind Turbines

DEFF Research Database (Denmark)

Kostandyan, Erik; Sørensen, John Dalsgaard

2012-01-01

environmental factors. Reliability assessment for such type of products conventionally is performed by classical reliability techniques based on test data. Usually conventional reliability approaches are time and resource consuming activities. Thus in this paper we choose a physics of failure approach to define...... damage model by Miner’s rule. Our attention is focused on crack propagation in solder joints of electrical components due to the temperature loadings. Based on the proposed method it is described how to find the damage level for a given temperature loading profile. The proposed method is discussed...

Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

Science.gov (United States)

Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

2004-04-01

Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation

Science.gov (United States)

Chawla, N.; Shen, Y.-L.; Deng, X.; Ege, E. S.

2004-12-01

The lap-shear technique is commonly used to evaluate the shear, creep, and thermal fatigue behavior of solder joints. We have conducted a parametric experimental and modeling study, on the effect of testing and geometrical parameters on solder/copper joint response in lap-shear. It was shown that the farfield applied strain is quite different from the actual solder strain (measured optically). Subtraction of the deformation of the Cu substrate provides a reasonable approximation of the solder strain in the elastic regime, but not in the plastic regime. Solder joint thickness has a profound effect on joint response. The solder response moves progressively closer to “true” shear response with increasing joint thickness. Numerical modeling using finite-element analyses were performed to rationalize the experimental findings. The same lap-shear configuration was used in the simulation. The input response for solder was based on the experimental tensile test result on bulk specimens. The calculated shear response, using both the commonly adopted far-field measure and the actual shear strain in solder, was found to be consistent with the trends observed in the lap-shear experiments. The geometric features were further explored to provide physical insight into the problem. Deformation of the substrate was found to greatly influence the shear behavior of the solder.

A novel method for direct solder bump pull testing using lead-free solders

Science.gov (United States)

Turner, Gregory Alan

This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

Methodology for Analyzing Strain States During In-Situ Thermomechanical Cycling in Individual Lead Free Solder Joints Using Synchrotron Radiation

International Nuclear Information System (INIS)

Zhou, Bite; Bieler, Thomas R.; Lee, Tae-Kyu; Liu, Kuo-Chuan

2009-01-01

To examine how a lead-free solder joint deforms in a thermal cycling environment, both the elastic and plastic stress and strain behavior must be understood. Methods to identify evolution of the internal strain (stress) state during thermal cycling are described. A slice of a package containing a single row of solder joints was thermally cycled from 0 C to 100 C with a period of about 1 h with concurrent acquisition of transmission Laue patterns using synchrotron radiation. These results indicated that most joints are single crystals, with some being multicrystals with no more than a few Sn grain orientations. Laue patterns were analyzed to estimate local strains in different crystal directions at different temperatures during a thermal cycle. While the strains perpendicular to various crystal planes all vary in a similar way, the magnitude of strain varies. The specimens were subsequently given several hundred additional thermal cycles and measured again to assess changes in the crystal orientations. These results show that modest changes in crystal orientations occur during thermal cycling.

Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

Directory of Open Access Journals (Sweden)

Saliza Azlina O.

2016-01-01

Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

Influence of Poly(ethylene glycol) Degradation on Voiding Sporadically Occurring in Solder Joints with Electroplated Cu

Science.gov (United States)

Wafula, F.; Yin, L.; Borgesen, P.; Andala, D.; Dimitrov, N.

2012-07-01

This paper presents a comprehensive study of the effect of poly(ethylene glycol) (PEG) degradation on the void formation known to take place sporadically at the interface between electroplated Cu and Pb-free solder. Thorough chemical analysis of our plating solution, carried out at different times of the deposition process by matrix-assisted laser desorption ionization time-of-flight mass spectroscopy, reveals a dramatic shift in the peaks to lower mass range with time. Scanning electron microscopy cross-sectional images of solder joints with Cu samples that have been plated at different times in the course of solution aging show a decrease in void formation. A decreasing magnitude of the deposition overpotential also seen during aging suggests that, breaking down to lower-molecular-weight fragments, PEG loses its suppression effect and likely has lower impact on the voiding propensity. This indirect correlation is confirmed further by the use of plating solutions containing PEG with preselected molecular weight. We also report on the effect of the surface area-to-solution volume ratio on PEG degradation studied by comparative experiments performed in a 50-mL bath with a rotating disc electrode and in a larger cell (Hull cell) with volume of 267 mL. The results show that, at fixed charge per unit volume, PEG degrades at a greatly accelerated rate in the Hull cell featuring higher electrode surface-to-solution volume ratio. Analysis of solder joints with accordingly grown Cu layers suggests that the voiding decreases faster with the accelerated rate of PEG degradation.

Thermomechanical behavior of tin-rich (lead-free) solders

Science.gov (United States)

Sidhu, Rajen Singh

In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local

Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy

Science.gov (United States)

Tikale, Sanjay; Prabhu, K. Narayan

2018-05-01

The effect of Al2O3 nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al2O3 nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (T L) and melting temperature range of the SAC305 solder alloy by addition of Al2O3 nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al2O3 nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu6Sn5 IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy.

Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

International Nuclear Information System (INIS)

Sun, Peng; Andersson, Cristina; Wei, Xicheng; Cheng, Zhaonian; Shangguan, Dongkai; Liu, Johan

2007-01-01

In this paper, the coupling effect in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi solder joint with sandwich structure by long time reflow soldering was studied. It was found that the interfacial compound at the Cu substrate was binary Cu-Sn compound in Sn-Ag-Bi solder joint and Cu 5 Zn 8 phase in Sn-Zn-Bi solder joint. The thickness of the Cu-Zn compound layer formed at the Cu substrate was greater than or equal to that of Cu-Sn compound layer, although the reflow soldering temperature of Sn-Zn-Bi (240 o C) was lower than that of Sn-Ag-Bi (250 o C). The stable Cu-Zn compound was the absolute preferential phase in the interfacial layer between Sn-Zn-Bi and the Cu substrate. The ternary (Cu, Ni) 6 Sn 5 compound was formed at the Sn-Ag-Bi/Ni(P)-Cu metallization interface, and a complex alloy Sn-Ni-Cu-Zn was formed at the Sn-Zn-Bi/Ni(P)-Cu metallization interface. It was noted that Cu atoms could diffuse from the Cu substrate through the solder matrix to the Ni(P)-Cu metallization within 1 min reflow soldering time for both solder systems, indicating that just 30 s was long enough for Cu to go through 250 μm diffusion length in the Sn-Ag-Bi solder joint at 250 o C. The coupling effect between Ni(P)/Cu metallization and Cu substrate was confirmed as the type of IMCs at Ni(P) layer had been changed from Ni-Sn system to Cu-Sn system apparently by the diffusion effect of Cu atoms. The (Cu, Ni) 6 Sn 5 layer at the Ni(P)/Cu metallization grew significantly and its thickness was even greater than that of the Cu-Sn compound on the opposite side, however the growth of the complex alloy including Sn, Ni, Cu and Zn on the Ni(P)/Cu metallization was suppressed

Features of soldering of molybdenum a lols

International Nuclear Information System (INIS)

Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

1980-01-01

Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

Rate of fatigue crack growth in residual stress fields of welded titanium joints with different contents of embrittling impurities

International Nuclear Information System (INIS)

Troshchenko, V.T.; Pokrovskij, V.V.; Yarusevich, V.L.; Mikhajlov, V.I.; Sher, V.A.

1990-01-01

Resistance to fatigue crack growth (FCG) has been studied in welded joints of structural titanium alloys contaminated by embrittling impurities. Besides, effect of crack closing has been taken into account what makes it possible to determine the effective coefficient of the stress intensity. The rate of fatigue crack growth is proved to considerably depend on the value and direction of residual stresses. The rate dependence of FCG in welded joints of structural titanium alloys on the swing of effective coefficient of stress intensity is invariant to the value and direction of weld residual stresses

Fundamentals of lead-free solder interconnect technology from microstructures to reliability

CERN Document Server

Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

2015-01-01

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

Directory of Open Access Journals (Sweden)

Roman Koleňák

2018-04-01

Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

Science.gov (United States)

Barbagallo, C.; Malgioglio, G. L.; Petrone, G.; Cammarata, G.

2017-05-01

For power devices, the reliability of thermal fatigue induced by thermal cycling has been prioritized as an important concern. The main target of this work is to apply a numerical procedure to assess the fatigue life for lead-free solder joints, that represent, in general, the weakest part of the electronic modules. Starting from a real multi-chip power module, FE-based models were built-up by considering different conditions in model implementation in order to simulate, from one hand, the worst working condition for the module and, from another one, the module standing into a climatic test room performing thermal cycles. Simulations were carried-out both in steady and transient conditions in order to estimate the module thermal maps, the stress-strain distributions, the effective plastic strain distributions and finally to assess the number of cycles to failure of the constitutive solder layers.

Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

International Nuclear Information System (INIS)

Barbagallo, C; Petrone, G; Cammarata, G; Malgioglio, G L

2017-01-01

For power devices, the reliability of thermal fatigue induced by thermal cycling has been prioritized as an important concern. The main target of this work is to apply a numerical procedure to assess the fatigue life for lead-free solder joints, that represent, in general, the weakest part of the electronic modules. Starting from a real multi-chip power module, FE-based models were built-up by considering different conditions in model implementation in order to simulate, from one hand, the worst working condition for the module and, from another one, the module standing into a climatic test room performing thermal cycles. Simulations were carried-out both in steady and transient conditions in order to estimate the module thermal maps, the stress-strain distributions, the effective plastic strain distributions and finally to assess the number of cycles to failure of the constitutive solder layers. (paper)

Characterization of the microstructure of tin-silver lead free solder

Energy Technology Data Exchange (ETDEWEB)

Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

2016-07-05

Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

Fabrication of high-quality brazed joints

International Nuclear Information System (INIS)

Orlov, A.V.

1980-01-01

Problem of ensuring of joint high-quality when brazing different parts in power engineering is considered. To obtain high-quality joints it is necessary to correctly design brazed joint and to choose a gap width, overlap length and fillet radius; to clean up carefully the surfaces to be brazed and fix them properly one relative to another; to apply a solder so as to provide its flowing into the gap and sticking in it; to exactly regulate thermal conditions of brazing. High quality and reliability of brazed joints are ensured by the application of solders based on noble metals, and cheap solders based on nickel, manganese and copper. Joints brazed with nickel base solders may operate at temperatures as high as 888 deg C

The critical oxide thickness for Pb-free reflow soldering on Cu substrate

Energy Technology Data Exchange (ETDEWEB)

Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)

2012-06-01

Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

Science.gov (United States)

Boesenberg, Adam J.; Anderson, Iver E.; Harringa, Joel L.

2012-07-01

Of Pb-free solder choices, an array of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic ( T eut = 217°C) composition have emerged with potential for broad use, including ball grid array (BGA) joints that cool slowly. This work investigated minor substitutional additions of Al (0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2- μm to 5- μm faceted Cu-Al particles, identified as Cu33Al17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness. Clustering of Cu33Al17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface. Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance.

Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys

Science.gov (United States)

Lis, Adrian; Nakanishi, Kohei; Matsuda, Tomoki; Sano, Tomokazu; Minagawa, Madoka; Okamoto, Masahide; Hirose, Akio

2017-07-01

Solder joints between leads and printed circuit boards in thin small outline packages were produced with conventional Sn1.0Ag0.7Cu (SAC107) and Sn3.0Ag0.7Cu (SAC305) solders as well as various solder alloys with gradually increasing amounts of Bi (up to 3.0 wt.%) and In (up to 1.0 wt.%) within the SAC107 base solder. The reliability of soldered leads in temperature cycle (TC) tests improved most with solder alloys containing both Bi (1.6 wt.%) and In (0.5 wt.%). Microindentation and electron probe microanalysis mappings revealed that the effect originates from a combination of solution and precipitation strengthening of the initial SAC alloy. The distribution of inelastic strain accumulation (ISA), as a measure for degradation, was determined in the solder joints by finite element calculations. It was shown that defects in the solder proximal to the lead (60-75 μm), which was underpinned by similar cracking characteristics along the lead-solder interface. The ISA was confirmed to be lower in SAC+Bi/In alloys owing to their enhanced elasto-plastic properties. Moreover, the addition of a thin Cu coating on the leads could improve the joint reliability, as suggested by the calculation of the ISA and the acceleration factor.

Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

CERN Document Server

Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

2015-01-01

The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

Directory of Open Access Journals (Sweden)

Liu Mei Lee

2013-01-01

Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits

Energy Technology Data Exchange (ETDEWEB)

Huang, Y. T.; Hsu, H. H.; Wu, Albert T., E-mail: atwu@ncu.edu.tw [Department of Chemical and Materials Engineering, National Central University, Jhongli City 320, Taiwan (China)

2014-01-21

Because of the miniaturization of electronic devices, the reliability of electromigration has become a major concern when shrinking the solder dimensions in flip-chip joints. Fast reaction between solders and electrodes causes intermetallic compounds (IMCs) to form, which grow rapidly and occupy entire joints when solder volumes decrease. In this study, U-grooves were fabricated on Si chips as test vehicles. An electrode-solder-electrode sandwich structure was fabricated by using lithography and electroplating. Gaps exhibiting well-defined dimensions were filled with Sn3.5Ag solders. The gaps between the copper electrodes in the test sample were limited to less than 15 μm to simulate microbumps. The samples were stressed at various current densities at 100 °C, 125 °C, and 150 °C. The morphological changes of the IMCs were observed, and the dimensions of the IMCs were measured to determine the kinetic growth of IMCs. Therefore, this study focused on the influence of back stress caused by microstructural evolution in microbumps.

Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

Science.gov (United States)

Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

2017-10-01

Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

Development of a soft-soldering system for aluminum

Science.gov (United States)

Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

1983-03-01

The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Directory of Open Access Journals (Sweden)

Lei Sun

2015-01-01

Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

Comparative shear tests of some low temperature lead-free solder pastes

Science.gov (United States)

Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

2016-12-01

The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

OpenAIRE

Sun, Lei; Zhang, Liang

2015-01-01

SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparti...

Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

Directory of Open Access Journals (Sweden)

John D. Sørensen

2011-12-01

Full Text Available Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is necessary to understand the physics of their failure and be able to develop reliability prediction models. Such a model is proposed in this paper for an IGBT power electronic module. IGBTs are critical components in wind turbine converter systems. These are multilayered devices where layers are soldered to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development and propagation processes is discussed. A statistical analysis is performed for appropriate model parameter selection. Based on the proposed model, a layout for component life prediction with crack movement is described in details.

Investigation on solder joint strength of nickel tin-plated and CRS tabs with PCB

International Nuclear Information System (INIS)

Luay Hussain

2002-01-01

Failure analysis on easily peels off Nickel and CRS steel tabs from PCB was carried out. Nickel Tin plated tabs, CRS steel tabs and tube were joined to the PCB using reflow/ convection soldering, in an oven. The solder paste composition is Sn36/Pb35/Ag2. Peel test was conducted and it was found that many tabs could be easily peeled off with low force. Porosities which varies from 0.4 mm to < 0.01mm in diameter, developed during soldering process and solidification was noted. It was found, the number, size and position of these porosities inside the solder layer on both parts of the tabs affect the peel strength. Scanning Electron Microscopy study and EDX analysis were carried out. It was found that the low peel strength values were due to the combination of generation and development of porosities during soldering process which act as stress concentrators and the evolution (growth) of eutectic Sn/Pb and Sn/Ni/Cu brittle grainy phase. Large eutectic microstructure with brittle Sn-Ni-Cu grainy phase enhances the failure with low peeling forces. Sample showing no feature of Sn/Ni/Cu grain gave high peeling strength value. Solder reflow, an important process, can result in strength enhancement (if it was controlled for example in a furnace). (Author)

Instantaneous fluxless bonding of Au with Pb-Sn solder in ambient atmosphere

International Nuclear Information System (INIS)

Lee, T.K.; Zhang, Sam; Wong, C.C.; Tan, A.C.

2005-01-01

A fluxless bonding technique has been developed as a method of flip-chip bonding for microelectronic packaging. The fluxless bonding technique can be achieved instantaneously in an ambient environment between metallic stud bumps and predefined molten solder. This paper describes the mechanics of the bonding action and verifies the effectiveness of this bonding method through wetting balance tests and scanning electron microscope and energy dispersive x-ray analysis. This technique has been demonstrated by using a gold stud bump to break the tin oxide layer over molten solder. This allows for a fast, solid liquid interdiffusion between gold (Au) and the fresh molten eutectic lead-tin (Pb-Sn) solder for joint formation during solidification. This bonding method has been successfully tested with 130-μm-pitch flip-chip bond pads on a joint-in-via flex substrate architecture

Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

Science.gov (United States)

Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

2010-09-15

As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

Effects of voids on thermal-mechanical reliability of lead-free solder joints

Directory of Open Access Journals (Sweden)

Benabou Lahouari

2014-06-01

Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

Effects of rework on adhesion of Pb-In soldered gold thick films

International Nuclear Information System (INIS)

Gehman, R.W.; Becka, G.A.; Losure, J.A.

1982-02-01

The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au 9 In 4 . It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing

Intermetallic compounds in 3D integrated circuits technology: a brief review.

Science.gov (United States)

Annuar, Syahira; Mahmoodian, Reza; Hamdi, Mohd; Tu, King-Ning

2017-01-01

The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed.

Intermetallic compounds in 3D integrated circuits technology: a brief review

Science.gov (United States)

Annuar, Syahira; Mahmoodian, Reza; Hamdi, Mohd; Tu, King-Ning

2017-12-01

The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed.

SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

Directory of Open Access Journals (Sweden)

D. Heinemann

2016-06-01

Full Text Available Printed Circuit Boards (PCB play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

Thermomechanical fatigue life prediction for several solders

Science.gov (United States)

Wen, Shengmin

anisotropic small-scale (micron or nano scale) solder joints. More importantly, the theory is materials science based so that the parameters of the fatigue formula can be worked out by testing of bulk specimens while the formula can be applicable to small-scale structures. The theory suggests metallurgical control in the manufacturing process to optimize the fatigue life of solder structures.

Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

Directory of Open Access Journals (Sweden)

Yulong Li

2018-01-01

Full Text Available In order to accelerate the growth of interfacial intermetallic compound (IMC layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms and 800 ms, were used for the ultrasonic soldering. The isothermal aging was conducted at 150 °C for 0, 120, 240, and 360 h. The evolution of microstructure, the IMC layer growth mechanism during aging, and the shear strength of the joints after aging were systemically investigated. Results showed the following. (i Formation of intermetallic compounds was accelerated by ultrasonic cavitation and streaming effects, the thickness of the interfacial Cu6Sn5 layer increased with aging time, and a thin Cu3Sn layer was identified after aging for 360 h. (ii The growth of the interfacial IMC layer of the ultrasonically soldered Cu/SAC305/Cu joints followed a linear function of the square root of the aging time, revealing a diffusion-controlled mechanism. (iii The tensile shear strength of the joint decreased to a small extent with increasing aging time, owing to the combined effects of IMC grain coarsening and the increase of the interfacial IMC. (iv Finally, although the fracture surfaces and failure locations of the joint soldered with 400 ms and 800 ms vibration times show similar characteristics, they are influenced by the aging time.

Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

Energy Technology Data Exchange (ETDEWEB)

Kita, T; Mukaibo, N; Ando, K; Moriyama, M [Honda R and D Co. Ltd., Tokyo (Japan)

1997-10-01

Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

Soldering in electronics assembly

CERN Document Server

Judd, Mike

2013-01-01

Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

Characterization of lead-free solders for electronic packaging

Science.gov (United States)

Ma, Hongtao

The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

Science.gov (United States)

Jang, Guh-Yaw; Duh, Jenq-Gong

2005-01-01

The eutectic Sn-Ag solder alloy is one of the candidates for the Pb-free solder, and Sn-Pb solder alloys are still widely used in today’s electronic packages. In this tudy, the interfacial reaction in the eutectic Sn-Ag and Sn-Pb solder joints was investigated with an assembly of a solder/Ni/Cu/Ti/Si3N4/Si multilayer structures. In the Sn-3.5Ag solder joints reflowed at 260°C, only the (Ni1-x,Cux)3Sn4 intermetallic compound (IMC) formed at the solder/Ni interface. For the Sn-37Pb solder reflowed at 225°C for one to ten cycles, only the (Ni1-x,Cux)3Sn4 IMC formed between the solder and the Ni/Cu under-bump metallization (UBM). Nevertheless, the (Cu1-y,Niy)6Sn5 IMC was observed in joints reflowed at 245°C after five cycles and at 265°C after three cycles. With the aid of microstructure evolution, quantitative analysis, and elemental distribution between the solder and Ni/Cu UBM, it was revealed that Cu content in the solder near the solder/IMC interface played an important role in the formation of the (Cu1-y,Niy)6Sn5 IMC. In addition, the diffusion behavior of Cu in eutectic Sn-Ag and Sn-Pb solders with the Ni/Cu UBM were probed and discussed. The atomic flux of Cu diffused through Ni was evaluated by detailed quantitative analysis in an electron probe microanalyzer (EPMA). During reflow, the atomic flux of Cu was on the order of 1016-1017 atoms/cm2sec in both the eutectic Sn-Ag and Sn-Pb systems.

Tin-silver and tin-copper alloys for capillarity joining-soft soldering-of copper piping

International Nuclear Information System (INIS)

Duran, J.; Amo, J. M.; Duran, C. M.

2001-01-01

It is studied the influence of the type of alloy used as filling material on the defects of the soldering joints in copper piping installations, which induce the fluid leak of the systems. The different eutectic temperatures and solidus-liquidus ranges of these alloys, require the setting of the soldering heat input in each case to obtain the suitable capillarity features and alloying temperatures to achieve for the correct formation of the bonding. Most defects in the joints are demonstrated to be generated by bad dossification of thermal inputs, which led depending on the filler alloy used to variations in its fluidity that may produce penetration failures in the bonds or insufficient consistency for the filling of the joints. (Author) 7 refs

Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

Science.gov (United States)

Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

2004-10-01

It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

Effect of temperature and flux concentration on soldering of base metal.

Science.gov (United States)

Lee, S Y; Lin, C T; Wang, M H; Tseng, H; Huang, H M; Dong, D R; Pan, L C; Shih, Y H

2000-12-01

The present study used the acoustic emission (AE) technique to evaluate interactions among soldering temperature, flux treatment, and the resultant ultimate tensile strength (UTS). Scanning electron microscopy (SEM) was used to examine fracture surfaces of the solder joints. Specimens were cast from removable partial denture alloy and then placed in a jig with a gap distance of 1.0 mm. A high-frequency soldering machine with an optical pyrometer was used for soldering at 1150 degrees C and 1200 degrees C, respectively. The flux concentrations were 67% and 75%. The soldered specimens were subjected to tensile test at a crosshead speed of 0.05 mm/min. During testing, acoustic emissions in the frequency range of 100--1200 kHz were collected, filtered, recorded, and processed by a sensing device. The results were analysed by ANOVA and Tukey LSD test. UTS at different temperatures showed no significant difference according to either mechanical or acoustic results. But in the 1200 degrees C group, the UTSs and AE counts showed significant differences (Pacoustic signals within the elastic deformation zone, while the 67% flux subgroup produced similar signals within the plastic deformation zone, either beyond the 0.2% yield point or before fracture.

Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements

Science.gov (United States)

Gadag, Shiva P.; Patra, Susant

2000-12-01

Solder joint interconnects are mechanical means of structural support for bridging the various electronic components and providing electrical contacts and a thermal path for heat dissipation. The functionality of the electronic device often relies on the structural integrity of the solder. The dimensional stability of solder joints is numerically predicted based on their mechanical properties. Algorithms to model the kinetics of dissolution and subsequent growth of intermetallic from the complete knowledge of a single history of time-temperature-reflow profile, by considering equivalent isothermal time intervals, have been developed. The information for dissolution is derived during the heating cycle of reflow and for the growth process from cooling curve of reflow profile. A simple and quick analysis tool to derive tensile stress-strain maps as a function of the reflow temperature of solder and strain rate has been developed by numerical program. The tensile properties are used in modeling thermal strain, thermal fatigue and to predict the overall fatigue life of solder joints. The numerical analysis of the tensile properties as affected by their composition and rate of testing, has been compiled in this paper. A numerical model using constitutive equation has been developed to evaluate the interfacial fatigue crack growth rate. The model can assess the effect of cooling rate, which depends on the level of strain energy release rate. Increasing cooling rate from normalizing to water-quenching, enhanced the fatigue resistance to interfacial crack growth by up to 50% at low strain energy release rate. The increased cooling rates enhanced the fatigue crack growth resistance by surface roughening at the interface of solder joint. This paper highlights salient features of process modeling. Interfacial intermetallic microstructure is affected by cooling rate and thereby affects the mechanical properties.

Microstructural effects on constitutive and fatigue fracture behavior of TinSilverCopper solder

Science.gov (United States)

Tucker, Jonathon P.

As microelectronic package construction becomes more diverse and complex, the need for accurate, geometry-independent material constitutive and failure models increases. Evaluations of packages based on accelerated environmental tests (such as accelerated thermal cycling or power cycling) only provide package-dependent reliability information. In addition, extrapolations of such test data to life predictions under field conditions are often empirical. Besides geometry, accelerated environmental test data must account for microstructural factors such as alloy composition or isothermal aging condition, resulting in expensive experimental variation. In this work, displacement-controlled, creep, and fatigue lap shear tests are conducted on specially designed SnAgCu test specimens with microstructures representative to those found in commercial microelectronic packages. The data are used to develop constitutive and fatigue fracture material models capable of describing deformation and fracture behavior for the relevant temperature and strain rate ranges. Furthermore, insight is provided into the microstructural variation of solder joints and the subsequent effect on material behavior. These models are appropriate for application to packages of any geometrical construction. The first focus of the thesis is on Pb-mixed SnAgCu solder alloys. During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of SnPb and SnAgCu often result from either mixed assemblies or rework. Three alloys of 1, 5 and 20 weight percent Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn37Pb components mixed with Sn3.0Ag0.5Cu. Displacement-controlled (constant strain rate) and creep tests were performed at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. Rate-dependent constitutive models for Pb

Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction

Science.gov (United States)

Takaku, Yoshikazu; Ohnuma, Ikuo; Kainuma, Ryosuke; Yamada, Yasushi; Yagi, Yuji; Nishibe, Yuji; Ishida, Kiyohito

2006-11-01

Bismuth and its alloys are candidates for Pb-free high-temperature solders that can be substituted for conventional Pb-rich Pb-Sn solders (melting point (mp) = 573 583 K). However, inferior properties such as brittleness and weak bonding strength should be improved for practical use. To that end, BiCu-X (X=Sb, Sn, and Zn) Pb-free high-temperature solders are proposed. Miscibility gaps in liquid BiCu-X alloys were surveyed using the thermodynamic database ADAMIS (alloy database for micro-solders), and compositions of the BiCu-X solders were designed on the basis of calculation. In-situ composite solders that consist of a Bi-base matrix with fine intermetallic compound (IMC) particles were produced by gas-atomizing and melt-spinning methods. The interfacial reaction between in-situ composite solders and Cu or Ni substrates was investigated. The IMCs at the interface formed a thin, uniform layer, which is an appropriate morphology for a reliable solder joint.

Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

Energy Technology Data Exchange (ETDEWEB)

Wang Fengjiang [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States); O' Keefe, Matthew [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)], E-mail: mjokeefe@mst.edu; Brinkmeyer, Brandon [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)

2009-05-27

The effect of incorporating eutectic Sn-Pb solder with Sn-3.0Ag-0.5Cu (SAC) Pb-free solder on the microstructure and tensile properties of the mixed alloys was investigated. Alloys containing 100, 75, 50, 25, 20, 15, 10, 5 and 0 wt% SAC, with the balance being Sn-37Pb eutectic solder alloy, were prepared and characterized. Optical and scanning electron microscopy were used to analyze the microstructures while 'mini-tensile' test specimens were fabricated and tested to determine mechanical properties at the mm length scale, more closely matching that of the solder joints. Microstructural analysis indicated that a Pb-rich phase formed and was uniformly distributed at the boundary between the Sn-rich grains or between the Sn-rich and the intermetallic compounds in the solder. Tensile results showed that mixing of the alloys resulted in an increase in both the yield and the ultimate tensile strength compared to the original solders, with the 50% SAC-50% Sn-Pb mixture having the highest measured strength. Initial investigations indicate the formation and distribution of a Pb-rich phase in the mixed solder alloys as the source of the strengthening mechanism.

Ductile fracture mechanism of low-temperature In-48Sn alloy joint under high strain rate loading.

Science.gov (United States)

Kim, Jong-Woong; Jung, Seung-Boo

2012-04-01

The failure behaviors of In-48Sn solder ball joints under various strain rate loadings were investigated with both experimental and finite element modeling study. The bonding force of In-48Sn solder on an Ni plated Cu pad increased with increasing shear speed, mainly due to the high strain-rate sensitivity of the solder alloy. In contrast to the cases of Sn-based Pb-free solder joints, the transition of the fracture mode from a ductile mode to a brittle mode was not observed in this solder joint system due to the soft nature of the In-48Sn alloy. This result is discussed in terms of the relationship between the strain-rate of the solder alloy, the work-hardening effect and the resulting stress concentration at the interfacial regions.

Special features of embrittlement of welded joints in shells of VVER-type reactors

International Nuclear Information System (INIS)

Kasatkin, O.G.

1999-01-01

At present, the atomic power engineering of Russia and Ukraine is based on water-water energy reactors of the VVER-440 and VVER-1000 type, with the electric power of 440 and 1000 MW, respectively. The majority of the VVER-440 reactors are installed in Russia, and VVER-1000 reactors operate in Ukraine. The reactors' shell (RS) is produced from cylindrical shells and a dished end welded together by circular joints under a flux. The RS of the VVER-440 reactor is produced from 15Kh3MFA steel, and the VVER-1000 reactors are produced from 15Kh2NMFA steel. The shell of the VVER-1000 reactor has an internal austenite coating. The condition of the RS metal is determined mainly by the critical brittleness temperature T b at which the impact toughness of specimens with a sharp notch reaches 60 J/cm 2 . The energy reactors, working in western countries, are characterised by a service life of 40 years and discussion is being carried out to extend this lifetime to 60 years. The design service life of the domestic reactors varies from 30 (RS VVER-440) to 40 (RS VVER-1000) years. According to investigations, the service life of the shells of these reactors is restricted by the properties of welded joints which are characterised by higher susceptibility to embrittlement than that of the parent metal, especially due to a higher content in the weld of phosphorus (RS VVER-440) or nickel (RS VVER-1000). Therefore, some experts believe that the actual service life of the RS is shorter than the design life. The accurate evaluation of the service life of welded joints in the RS is very important for the safety of service and also in the economic aspects, because the unjustified decrease of the permissible service life and premature shutdown of units of the nuclear power station result in huge losses

THE POSSIBILITY OF USING LASER-ULTRASOUND TO MONITOR THE QUALITY SOLDERED CONNECTIONS CHAMBERS OF LIQUID ROCKET ENGINES

Directory of Open Access Journals (Sweden)

N. V. Astredinova

2014-01-01

Full Text Available During the manufacturing process to the design of modern liquid rocket engines are presented important requirements, such as minimum weight, maximum stiffness and strength of nodes, maximum service life in operation, high reliability and quality of soldered and welded seams. Due to the high quality requirements soldered connections and the specific design of the nozzle, it became necessary in the development and testing of a new non-conventional non-destructive testing method – laser-ultrasound diagnosis. In accordance with regulatory guidelines, quality control soldered connections is allowed to use an acoustic kind of control methods of the reflected light, transmitted light, resonant, free vibration and acoustic emission. Attempts to use traditional methods of non-destructive testing did not lead to positive results. This is due primarily to the size of typical solder joint defects, as well as the structural features of the rocket engine, the data structure is not controllable. In connection with this, a new method that provides quality control soldered connections cameras LRE based on the thermo generation of ultrasound. Methods of ultrasonic flaw detection of photoacoustic effect, in most cases, have a number of advantages over methods that use standard (traditional piezo transducers. In the course of studies have found that the sensitivity of the laser-ultrasonic method and flaw detector UDL-2M can detect lack of adhesion in the solder joints on the upper edges of the nozzle in the sub-header area of the site.

Study on interfacial reaction between lead-free solders and alternative surface finishes

International Nuclear Information System (INIS)

Siti Rabiatul Aisha; Ourdjini, A.; Saliza Osman

2007-01-01

This study investigates the interfacial reactions occurring during reflow soldering between Sn-Ag-Cu lead-free solder and two surface finishes: electroless nickel/ immersion gold (ENIG) and immersion silver (IAg). The study focuses on interfacial reactions evolution and growth kinetics of intermetallic compounds (IMC) formed during soldering and isothermal ageing at 150 degree Celsius for up to 2000 hours. Optical and scanning electron microscopy were used to measure IMC thickness and examine the morphology of IMC respectively, whereas the IMC phases were identified by energy dispersive X-ray analysis (EDX). The results showed that the IMC formed on ENIG finish is thinner compared to that formed on IAg finish. For IAg surface finish, Cu 6 Sn 5 IMCs with scallop morphology are formed at the solder/ surface finish interface after reflow while a second IMC, Cu 3 Sn was formed between the copper and Cu 6 Sn 5 IMC after the isothermal ageing treatment. For ENIG surface finish both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 are formed after soldering. Isothermal aging of the solder joints formed on ENIG finish was found to have a significant effect on the morphology of the intermetallics by transforming to more spherical and denser morphology in addition to increase i their thickness with increased ageing time. (author)

High temperature soldering of graphite

International Nuclear Information System (INIS)

Anikin, L.T.; Kravetskij, G.A.; Dergunova, V.S.

1977-01-01

The effect is studied of the brazing temperature on the strength of the brazed joint of graphite materials. In one case, iron and nickel are used as solder, and in another, molybdenum. The contact heating of the iron and nickel with the graphite has been studied in the temperature range of 1400-2400 ged C, and molybdenum, 2200-2600 deg C. The quality of the joints has been judged by the tensile strength at temperatures of 2500-2800 deg C and by the microstructure. An investigation into the kinetics of carbon dissolution in molten iron has shown that the failure of the graphite in contact with the iron melt is due to the incorporation of iron atoms in the interbase planes. The strength of a joint formed with the participation of the vapour-gas phase is 2.5 times higher than that of a joint obtained by graphite recrystallization through the carbon-containing metal melt. The critical temperatures are determined of graphite brazing with nickel, iron, and molybdenum interlayers, which sharply increase the strength of the brazed joint as a result of the formation of a vapour-gas phase and deposition of fine-crystal carbon

Radiation embrittlement of metals and alloys

International Nuclear Information System (INIS)

Wechsler, M.S.

1975-01-01

Three types of radiation embrittlement are identified: (1) radiation embrittlement in nominally ductile metals, (2) radiation embrittlement in metals that undergo a ductile-brittle transition, and (3) high-temperature grain boundary embrittlement. This paper deals with type (1) and, more briefly, type (2) radiation embrittlement. Radiation embrittlement in nominally ductile metals is characterized by the premature onset of plastic instability, which causes a sharp decrease in the macroscopic plastic strain that the material can sustain before necking (uniform strain) and breaking (fracture strain). Dislocation channeling seems to be largely responsible and experimental results are reviewed. The origin of dislocation channeling is discussed. Irradiated metals that exhibit a ductile-brittle transition show an increase in the transition temperature but the nature of the transition (shear to cleavage fracture) does not appear to be greatly altered. A key factor is the temperature dependence of yielding and how it is affected upon irradiation. Impurities exert an influence on the stability of radiation-produced defect clusters and thus can alter the amount of radiation embrittlement experienced upon irradiation at somewhat elevated temperatures. In general, radiation embrittlement appears to stem mostly from changes in plastic properties (particularly in the trend toward more dynamic and inhomogeneous plastic deformation) rather than from changes in the inherent fracture process. 63 references, 10 figures

Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X = Bi, In) solders with Cu substrate

International Nuclear Information System (INIS)

Hodulova, Erika; Palcut, Marian; Lechovic, Emil; Simekova, Beata; Ulrich, Koloman

2011-01-01

Highlights: → In substitutes Sn in intermetallic compounds formed at the Cu-solder interface. → Bi and In decrease the parabolic rate constant of Cu 3 Sn layer growth. → In increases the parabolic rate constant of Cu 6 Sn 5 layer growth. → High In concentrations should be avoided since they may lead to a pre-mature solder joint degradation. - Abstract: The effects of Bi and In additions on intermetallic phase formation in lead-free solder joints of Sn-3.7Ag-0.7Cu; Sn-1.0Ag-0.5Cu-1.0Bi and Sn-1.5Ag-0.7Cu-9.5In (composition given in weight %) with copper substrate are studied. Soldering of copper plate was conducted at 250 deg. C for 5 s. The joints were subsequently aged at temperatures of 130-170 deg. C for 2-16 days in a convection oven. The aged interfaces were analyzed by optical microscopy and energy dispersive X-ray spectroscopy (EDX) microanalysis. Two intermetallic layers are observed at the interface - Cu 3 Sn and Cu 6 Sn 5 . Cu 6 Sn 5 is formed during soldering. Cu 3 Sn is formed during solid state ageing. Bi and In decrease the growth rate of Cu 3 Sn since they appear to inhibit tin diffusion through the grain boundaries. Furthermore, indium was found to produce a new phase - Cu 6 (Sn,In) 5 instead of Cu 6 Sn 5 , with a higher rate constant. The mechanism of the Cu 6 (Sn,In) 5 layer growth is discussed and the conclusions for the optimal solder chemical composition are presented.

Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications

DEFF Research Database (Denmark)

Kostandyan, Erik; Sørensen, John Dalsgaard

2011-01-01

Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is nec......Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components...... to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development...

Neutron embrittlement of the Kozloduy NPP unit 1 reactor

International Nuclear Information System (INIS)

Vodenicharov, S.; Kamenova, Tz.

1996-01-01

Activities made in the period 1989-1996 according to the Program for metal state monitoring of the Kozloduy NPP Unit 1 are described. Data on P and Cu content in the welded joint 4 are reported. Determination is made by wet chemical analysis of shavings taken out from the inner side of the wall, direct spectral analysis of the vessel itself and spectroscopy of the inner and outer side of 6 templates. The results obtained from 4 different study teams showed a good agreement. The real average P content is 0.046% and tends to diminish in depth. Microstructural investigation does not show any expressed inter-crystalline mechanism of brittle failure at low temperatures. The data on real P and Cu content, as well as the experimental values of the initial critical temperature of embrittlement (Tk o ), the residual part of temperature shift (Tk r ) and the re-embrittlement temperature after annealing at 475 o (Tk) allow to predict the change in Tk o of the joint 4 during the next refueling cycles. The measured low value of Tk after 18-th refueling cycle is considerably lower than that forecasted by lateral re-embrittlement law. This means that the forecasting of Tk for the next cycles is made with big enough conservatisms, and that a second annealing of the vessel until 26-th cycle is not necessary. So according to the most conservative estimate, the Unit 1 can operate safely until the end of the 26-th refueling cycle. It is also concluded, that in terms of radiation degradation of the vessel metal the operation life time of the Unit 1 can reach and exceed the designed one. 2 tab., 7 ref

Circuit reliability boosted by soldering pins of disconnect plugs to sockets

Science.gov (United States)

Pierce, W. B.

1964-01-01

Where disconnect pins must be used for wiring and testing a circuit, improved system reliability is obtained by making a permanent joint between pins and sockets of the disconnect plug. After the circuit has been tested, contact points may be fused through soldering, brazing, or welding.

Thermal embrittlement of reactor vessel steels

International Nuclear Information System (INIS)

Corwin, W.R.; Nanstad, R.K.; Alexander, D.J.; Stoller, R.E.; Wang, J.A.; Odette, G.R.

1995-01-01

As a result of observations of possible thermal embrittlement from recent studies with welds removed from retired steam generators of the Palisades Nuclear Plant (PNP), an assessment was made of thermal aging of reactor pressure vessel (RPV) steels under nominal reactor operating conditions. Discussions are presented on (1) data from the literature regarding relatively low-temperature thermal embrittlement of RPV steels; (2)relevant data from the US power reactor-embrittlement data base (PR-EDB); and (3)potential mechanisms of thermal embrittlement in low-alloy steels

Hardening Embrittlement and Non-Hardening Embrittlement of Welding-Heat-Affected Zones in a Cr-Mo Low Alloy Steel

Directory of Open Access Journals (Sweden)

Yu Zhao

2018-06-01

Full Text Available The embrittlement of heat affected zones (HAZs resulting from the welding of a P-doped 2.25Cr-1Mo steel was studied by the analysis of the fracture appearance transition temperatures (FATTs of the HAZs simulated under a heat input of 45 kJ/cm with different peak temperatures. The FATTs of the HAZs both with and without tempering increased with the rise of the peak temperature. However, the FATTs were apparently lower for the tempered HAZs. For the as-welded (untempered HAZs, the FATTs were mainly affected by residual stress, martensite/austenite (M/A islands, and bainite morphology. The observed embrittlement is a hardening embrittlement. On the other hand, the FATTs of the tempered HAZs were mainly affected by phosphorus grain boundary segregation, thereby causing a non-hardening embrittlement. The results demonstrate that the hardening embrittlement of the as-welded HAZs was more severe than the non-hardening embrittlement of the tempered HAZs. Consequently, a post-weld heat treatment should be carried out if possible so as to eliminate the hardening embrittlement.

Pressure brazing of ceramics to metals with copper solder

International Nuclear Information System (INIS)

Pavlova, M.A.; Metelkin, I.I.

1986-01-01

The effect on the quality of joints brazed with copper of different non metallized aluminooxide dielectrics with metals and alloys of a series of technological parameters (temperature, pressure, holding, and medium) in the course of pressure brazing is investigated. It is shown that in case of brazing with kovar and nickel the character of dependences is identical, however in all cases the joints with nickel are more durable. For the ceramics - molybdenum system characterized by weak interaction with copper solder kinetic dependences have no maximum and only under holding of more than 20 min the constant strength of 150-190 MPa is attained

Miniaturization of Micro-Solder Bumps and Effect of IMC on Stress Distribution

Science.gov (United States)

Choudhury, Soud Farhan; Ladani, Leila

2016-07-01

As the joints become smaller in more advanced packages and devices, intermetallic (IMCs) volume ratio increases, which significantly impacts the overall mechanical behavior of joints. The existence of only a few grains of Sn (Tin) and IMC materials results in anisotropic elastic and plastic behavior which is not detectable using conventional finite element (FE) simulation with average properties for polycrystalline material. In this study, crystal plasticity finite element (CPFE) simulation is used to model the whole joint including copper, Sn solder and Cu6Sn5 IMC material. Experimental lap-shear test results for solder joints from the literature were used to validate the models. A comparative analysis between traditional FE, CPFE and experiments was conducted. The CPFE model was able to correlate the experiments more closely compared to traditional FE analysis because of its ability to capture micro-mechanical anisotropic behavior. Further analysis was conducted to evaluate the effect of IMC thickness on stress distribution in micro-bumps using a systematic numerical experiment with IMC thickness ranging from 0% to 80%. The analysis was conducted on micro-bumps with single crystal Sn and bicrystal Sn. The overall stress distribution and shear deformation changes as the IMC thickness increases. The model with higher IMC thickness shows a stiffer shear response, and provides a higher shear yield strength.

Hydrogen Embrittlement

Science.gov (United States)

Woods, Stephen; Lee, Jonathan A.

2016-01-01

Hydrogen embrittlement (HE) is a process resulting in a decrease in the fracture toughness or ductility of a metal due to the presence of atomic hydrogen. In addition to pure hydrogen gas as a direct source for the absorption of atomic hydrogen, the damaging effect can manifest itself from other hydrogen-containing gas species such as hydrogen sulfide (H2S), hydrogen chloride (HCl), and hydrogen bromide (HBr) environments. It has been known that H2S environment may result in a much more severe condition of embrittlement than pure hydrogen gas (H2) for certain types of alloys at similar conditions of stress and gas pressure. The reduction of fracture loads can occur at levels well below the yield strength of the material. Hydrogen embrittlement is usually manifest in terms of singular sharp cracks, in contrast to the extensive branching observed for stress corrosion cracking. The initial crack openings and the local deformation associated with crack propagation may be so small that they are difficult to detect except in special nondestructive examinations. Cracks due to HE can grow rapidly with little macroscopic evidence of mechanical deformation in materials that are normally quite ductile. This Technical Memorandum presents a comprehensive review of experimental data for the effects of gaseous Hydrogen Environment Embrittlement (HEE) for several types of metallic materials. Common material screening methods are used to rate the hydrogen degradation of mechanical properties that occur while the material is under an applied stress and exposed to gaseous hydrogen as compared to air or helium, under slow strain rates (SSR) testing. Due to the simplicity and accelerated nature of these tests, the results expressed in terms of HEE index are not intended to necessarily represent true hydrogen service environment for long-term exposure, but rather to provide a practical approach for material screening, which is a useful concept to qualitatively evaluate the severity of

Effects of Ni{sub 3}Sn{sub 4} and (Cu,Ni){sub 6}Sn{sub 5} intermetallic layers on cross-interaction between Pd and Ni in solder joints

Energy Technology Data Exchange (ETDEWEB)

Baek, Yong-Ho [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of); Division of Advanced Circuit Interconnect, Samsung Electro-Mechanics Co., Ltd., Suwon 443-743 (Korea, Republic of); Chung, Bo-Mook [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of); Department of Research and Development, KPM TECH, Ansan 425-090 (Korea, Republic of); Choi, Young-Sik [Division of Advanced Circuit Interconnect, Samsung Electro-Mechanics Co., Ltd., Suwon 443-743 (Korea, Republic of); Choi, Jaeho [Department of Advanced Metal and Materials Engineering, Gangneung-Wonju National University, Gangneung 210-702 (Korea, Republic of); Huh, Joo-Youl, E-mail: jyhuh@korea.ac.kr [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of)

2013-12-05

alleviate the (Pd,Ni)Sn{sub 4}-related degradation of solder joint reliability.

Spontaneous soldering

International Nuclear Information System (INIS)

Percacci, R.

1984-01-01

It is proposed that the soldering form of general relativity be treated as a dynamical variable. This gives rise to the possibility of treating the linear connection on (n-dimensional) spacetime and an internal O(k)-Yang-Mills field as different components of the same O(N) gauge field (N= n+k). The distinction between gravitational and Yang-Mills interactions is due to a kind of Higgs mechanism driven by the vacuum expectation value of the soldering form. (orig.)

Power reactor embrittlement data base

International Nuclear Information System (INIS)

Kam, F.B.K.; Stallmann, F.W.; Wang, J.A.

1989-01-01

Regulatory and research evaluations of embrittlement prediction models and of vessel integrity under load can be greatly expedited by the use of a well-designed, computerized embrittlement data base. The Power Reactor Embrittlement Data Base (PR-EDB) is a comprehensive collection of data from surveillance reports and other published reports of commercial nuclear reactors. The uses of the data base require that as many different data as available are collected from as many sources as possible with complete references and that subsets of relevant data can be easily retrieved and processed. The objectives of this NRC-sponsored program are the following: to compile and to verify the quality of the PR-EDB; to provide user-friendly software to access and process the data; to explore or confirm embrittlement prediction models; and to interact with standards organizations to provide the technical bases for voluntary consensus standards that can be used in regulatory guides, standard review plans, and codes. 9 figs

Microstructure characteristics of vacuum glazing brazing joints using laser sealing technique

Science.gov (United States)

Liu, Sixing; Yang, Zheng; Zhang, Jianfeng; Zhang, Shanwen; Miao, Hong; Zhang, Yanjun; Zhang, Qi

2018-05-01

Two pieces of plate glass were brazed into a composite of glazing with a vacuum chamber using PbO-TiO2-SiO2-RxOy powder filler alloys to develop a new type of vacuum glazing. The brazing process was carried out by laser technology. The interface characteristics of laser brazed joints formed between plate glass and solder were investigated using optical microscope, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD) techniques. The results show that the inter-diffusion of Pb/Ti/Si/O elements from the sealing solder toward the glass and O/Al/Si elements from the glass toward the solder, resulting in a reaction layer in the brazed joints. The microstructure phases of PbTiO3, AlSiO, SiO2 and PbO in the glass/solder interface were confirmed by XRD analysis. The joining of the sealing solder to the glass was realized by the reaction products like fibrous structures on interface, where the wetting layer can help improve the bonding performance and strength between the sealing solder and the plate glass during the laser brazing process.

Soldering of Nanotubes onto Microelectrodes

DEFF Research Database (Denmark)

Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

2003-01-01

Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing sold...... bonds were consistently found to be mechanically stronger than the carbon nanotubes.......Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...

Thermally Conductive Metal-Tube/Carbon-Composite Joints

Science.gov (United States)

Copeland, Robert J.

2004-01-01

An improved method of fabricating joints between metal and carbon-fiber-based composite materials in lightweight radiators and heat sinks has been devised. Carbon-fiber-based composite materials have been used in such heat-transfer devices because they offer a combination of high thermal conductivity and low mass density. Metal tubes are typically used to carry heat-transfer fluids to and from such heat-transfer devices. The present fabrication method helps to ensure that the joints between the metal tubes and the composite-material parts in such heat-transfer devices have both (1) the relatively high thermal conductances needed for efficient transfer of heat and (2) the flexibility needed to accommodate differences among thermal expansions of dissimilar materials in operation over wide temperature ranges. Techniques used previously to join metal tubes with carbon-fiber-based composite parts have included press fitting and bonding with epoxy. Both of these prior techniques have been found to yield joints characterized by relatively high thermal resistances. The present method involves the use of a solder (63 percent Sn, 37 percent Pb) to form a highly thermally conductive joint between a metal tube and a carbon-fiber-based composite structure. Ordinarily, the large differences among the coefficients of thermal expansion of the metal tube, solder, and carbon-fiber-based composite would cause the solder to pull away from the composite upon post-fabrication cooldown from the molten state. In the present method, the structure of the solder is modified (see figure) to enable it to deform readily to accommodate the differential thermal expansion.

Embrittlement data base, version 1

International Nuclear Information System (INIS)

Wang, J.A.

1997-08-01

The aging and degradation of light-water-reactor (LWR) pressure vessels is of particular concern because of their relevance to plant integrity and the magnitude of the expected irradiation embrittlement. The radiation embrittlement of reactor pressure vessel (RPV) materials depends on many different factors such as flux, fluence, fluence spectrum, irradiation temperature, and preirradiation material history and chemical compositions. These factors must be considered to reliably predict pressure vessel embrittlement and to ensure the safe operation of the reactor. Based on embrittlement predictions, decisions must be made concerning operating parameters and issues such as low-leakage-fuel management, possible life extension, and the need for annealing the pressure vessel. Large amounts of data from surveillance capsules and test reactor experiments, comprising many different materials and different irradiation conditions, are needed to develop generally applicable damage prediction models that can be used for industry standards and regulatory guides. Version 1 of the Embrittlement Data Base (EDB) is such a comprehensive collection of data resulting from merging version 2 of the Power Reactor Embrittlement Data Base (PR-EDB). Fracture toughness data were also integrated into Version 1 of the EDB. For power reactor data, the current EDB lists the 1,029 Charpy transition-temperature shift data points, which include 321 from plates, 125 from forgoings, 115 from correlation monitor materials, 246 from welds, and 222 from heat-affected-zone (HAZ) materials that were irradiated in 271 capsules from 101 commercial power reactors. For test reactor data, information is available for 1,308 different irradiated sets (352 from plates, 186 from forgoings, 303 from correlation monitor materials, 396 from welds and 71 from HAZs) and 268 different irradiated plus annealed data sets

Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature

Energy Technology Data Exchange (ETDEWEB)

Prabhu, K.N., E-mail: prabhukn_2002@yahoo.co.in [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India); Deshapande, Parashuram; Satyanarayan [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India)

2012-01-30

Highlights: Black-Right-Pointing-Pointer Effect of cooling rate on tensile and impact properties of Sn-9Zn alloy was assessed. Black-Right-Pointing-Pointer Both DBTT and UTS of the solder alloy increased with increase in cooling rate. Black-Right-Pointing-Pointer An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile-brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn-9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 Degree-Sign C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the

Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature

International Nuclear Information System (INIS)

Prabhu, K.N.; Deshapande, Parashuram; Satyanarayan

2012-01-01

Highlights: ► Effect of cooling rate on tensile and impact properties of Sn–9Zn alloy was assessed. ► Both DBTT and UTS of the solder alloy increased with increase in cooling rate. ► An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile–brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn–9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 °C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the DBTT.

Hydrogen embrittlement of steels: study and prevention

International Nuclear Information System (INIS)

Brass, A.M.; Chene, J.; Coudreuse, L.

2000-01-01

Hydrogen embrittlement of steels is one of the important reason of rupture of pieces in the industry (nuclear, of petroleum..). Indeed, there are a lot of situations which can lead to the phenomenon of hydrogen embrittlement: introduction of hydrogen in the material during the elaboration or during transformation or implementation processes (heat treatments, welding); use of steels when hydrogen or hydrogenated gaseous mixtures are present; hydrogen produced by electrolytic reactions (surface treatments, cathodic protection). The hydrogen embrittlement can appear in different forms which depend of a lot of parameters: material (state, composition, microstructure..); surrounding medium (gas, aqueous medium, temperature..); condition of mechanical solicitation (static, dynamic, cyclic..). The industrial phenomena which appear during cases of hydrogen embrittlement are more particularly described here. Several methods of steels studies are proposed as well as some possible ways for the prevention of hydrogen embrittlement risks. (O.M.)

Blistering and hydride embrittlement

International Nuclear Information System (INIS)

Louthan, M.R. Jr.

1975-01-01

The effects of hydrogen on the mechanical properties of metals have been categorized into several groups. Two of the groups, hydrogen blistering and hydride embrittlement, are reasonably well understood, and problems relating to their occurrence may be avoided if that understanding is used as a basis for selecting alloys for hydrogen service. Blistering and hydride embrittlement are described along with several techniques of materials selection and used to minimize their adverse effects. (U.S.)

Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows

Science.gov (United States)

Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

2016-12-01

Controlling the size, dispersion, and stability of intermetallic compounds in lead-free solder alloys is vital to creating reliable solder joints regardless of how many times the solder joints are melted and resolidified (reflowed) during circuit board assembly. In this article, the coarsening behavior of Cu x Al y and Cu6Sn5 in two Sn-Cu-Al alloys, a Sn-2.59Cu-0.43Al at. pct alloy produced via drip atomization and a Sn-5.39Cu-1.69Al at. pct alloy produced via melt spinning at a 5-m/s wheel speed, was characterized after multiple (1-5) reflow cycles via differential scanning calorimetry between the temperatures of 293 K and 523 K (20 °C and 250 °C). Little-to-no coarsening of the Cu x Al y particles was observed for either composition; however, clustering of Cu x Al y particles was observed. For Cu6Sn5 particle growth, a bimodal size distribution was observed for the drip atomized alloy, with large, faceted growth of Cu6Sn5 observed, while in the melt spun alloy, Cu6Sn5 particles displayed no significant increase in the average particle size, with irregularly shaped, nonfaceted Cu6Sn5 particles observed after reflow, which is consistent with shapes observed in the as-solidified alloys. The link between original alloy composition, reflow undercooling, and subsequent intermetallic coarsening behavior was discussed by using calculated solidification paths. The reflowed microstructures suggested that the heteroepitaxial relationship previously observed between the Cu x Al y and the Cu6Sn5 was maintained for both alloys.

Spectroscopic investigation of oxidized solder surfaces

International Nuclear Information System (INIS)

Song, Jenn-Ming; Chang-Chien, Yu-Chien; Huang, Bo-Chang; Chen, Wei-Ting; Shie, Chi-Rung; Hsu, Chuang-Yao

2011-01-01

Highlights: → UV-visible spectroscopy is successfully used to evaluate the degree of discoloring of solders. → The surface oxides of solders can also be identified by UV-visible absorption spectra. → The discoloration of solder surface can be correlated with optical characterization of oxides. → A strategy against discoloring by alloying was also suggested. - Abstract: For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV-vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible region. A trace of P can effectively depress the discoloration of solders under both solid and semi-solid states through the suppression of SnO.

Optimal parameters for laser tissue soldering

Science.gov (United States)

McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

1998-07-01

Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

Fluxless flip-chip bonding using a lead-free solder bumping technique

Science.gov (United States)

Hansen, K.; Kousar, S.; Pitzl, D.; Arab, S.

2017-09-01

With the LHC exceeding the nominal instantaneous luminosity, the current barrel pixel detector (BPIX) of the CMS experiment at CERN will reach its performance limits and undergo significant radiation damage. In order to improve detector performance in high luminosity conditions, the entire BPIX is replaced with an upgraded version containing an additional detection layer. Half of the modules comprising this additional layer are produced at DESY using fluxless and lead-free bumping and bonding techniques. Sequential solder-jetting technique is utilized to wet 40-μm SAC305 solder spheres on the silicon-sensor pads with electroless Ni, Pd and immersion Au (ENEPIG) under-bump metallization (UBM). The bumped sensors are flip-chip assembled with readout chips (ROCs) and then reflowed using a flux-less bonding facility. The challenges for jetting low solder volume have been analyzed and will be presented in this paper. An average speed of 3.4 balls per second is obtained to jet about 67 thousand solder balls on a single chip. On average, 7 modules have been produced per week. The bump-bond quality is evaluated in terms of electrical and mechanical properties. The peak-bump resistance is about 17.5 mΩ. The cross-section study revealed different types of intermetallic compounds (IMC) as a result of interfacial reactions between UBM and solder material. The effect of crystalline phases on the mechanical properties of the joint is discussed. The mean shear strength per bump after the final module reflow is about 16 cN. The results and sources of yield loss of module production are reported. The achieved yield is 95%.

Handbook of machine soldering SMT and TH

CERN Document Server

Woodgate, Ralph W

1996-01-01

A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

Photothermal effects of laser tissue soldering

International Nuclear Information System (INIS)

McNally, K.M.; Sorg, B.S.; Welch, A.J.; Dawes, J.M.; Owen, E.R.

1999-01-01

Low-strength anastomoses and thermal damage of tissue are major concerns in laser tissue welding techniques where laser energy is used to induce thermal changes in the molecular structure of the tissues being joined, hence allowing them to bond together. Laser tissue soldering, on the other hand, is a bonding technique in which a protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. The addition of protein solders to augment tissue repair procedures significantly reduces the problems of low strength and thermal damage associated with laser tissue welding techniques. Investigations were conducted to determine optimal solder and laser parameters for tissue repair in terms of tensile strength, temperature rise and damage and the microscopic nature of the bonds formed. An in vitro study was performed using an 808 nm diode laser in conjunction with indocyanine green (ICG)-doped albumin protein solders to repair bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The efficacy of temperature feedback control in enhancing the soldering process was also investigated. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the repairs. A reduction in dye concentration from 2.5mgml -1 to 0.25mgml -1 was also found to result in an increase in tensile strength. Increasing the laser irradiance and thus surface temperature resulted in an increased severity of histological injury. Thermal denaturation of tissue collagen and necrosis of the intimal layer smooth muscle cells increased laterally and in depth with higher temperatures. The strongest repairs were produced with an irradiance of 6.4Wcm -2 using a solid protein solder composed of 60% BSA and 0.25mgml -1 ICG. Using this combination of laser and solder parameters, surface temperatures were observed to reach 85±5 deg. C with a

Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

Directory of Open Access Journals (Sweden)

Soares D.

2007-01-01

Full Text Available Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layers. The effect of the addition of P, at low levels, on the chemical composition of the layers present at the interface was studied. The phases formed at the interface between the Cu or Ni substrate and a molten lead-free solder at 250ºC, were studied for different stage times and alloy compositions. The melting temperatures, of the studied alloys, were determined by Differential Scanning Calorimetry (DSC. Identification of equilibrium phases formed at the interface layer, and the evaluation of their chemical composition were performed by Scanning Electron Microscopy (SEM/EDS. Different interface characteristics were obtained, namely for the alloys containing Zn. The obtained IML layer thickness was compared, for both types of alloy systems.

Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn-Ag-Cu and Sn-Ag Solder Interconnects With and Without Board-Side Ni Surface Finish

Science.gov (United States)

Lee, Tae-Kyu; Duh, Jeng-Gong

2014-11-01

The combined effects on long-term reliability of isothermal aging and chemically balanced or unbalanced surface finish have been investigated for fine-pitch ball grid array packages with Sn-3.0Ag-0.5Cu (SAC305) (wt.%) and Sn-3.5Ag (SnAg) (wt.%) solder ball interconnects. Two different printed circuit board surface finishes were selected to compare the effects of chemically balanced and unbalanced structure interconnects with and without board-side Ni surface finish. NiAu/solder/Cu and NiAu/solder/NiAu interconnects were isothermally aged and thermally cycled to evaluate long-term thermal fatigue reliability. Weibull plots of the combined effects of each aging condition and each surface finish revealed lifetime for NiAu/SAC305/Cu was reduced by approximately 40% by aging at 150°C; less degradation was observed for NiAu/SAC305/NiAu. Further reduction of characteristic life-cycle number was observed for NiAu/SnAg/NiAu joints. Microstructure was studied, focusing on its evolution near the board and package-side interfaces. Different mechanisms of aging were apparent under the different joint configurations. Their effects on the fatigue life of solder joints are discussed.

Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/ Pd/ Au surface finishes

International Nuclear Information System (INIS)

NorAkmal, F.; Ourdjini, A.; Azmah Hanim, M.A.; Siti Aisha, I.; Chin, Y.T.

2007-01-01

Flip chip technology provides the ultimate in high I/ O-density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) which is widely used in electronics packaging as surface finish for flip-chip application nowadays. In this research, field emission scanning electron microscopy (FESEM) analysis was conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between the SAC lead-free solder with Cu surface finish after reflow were mainly (Cu, Ni) 6 Sn 5 and Cu 6 Sn 5 . While the main IMCs formed between lead-free solder on ENEPIG surface finish are (Ni, Cu) 3 Sn 4 and Ni 3 Sn 4 . The results from FESEM with energy dispersive x-ray (EDX) have revealed that isothermal aging at 150 degree Celsius has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated was found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. (author)

Specificity in liquid metal induced embrittlement

CSIR Research Space (South Africa)

Fernandes, PJL

1996-12-01

Full Text Available One of the most intriguing features of liquid metal induced embrittlement (LMIE) is the observation that some liquid metal-solid metal couples are susceptible to embrittlement, while others appear to be immune. This is referred to as the specificity...

Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

International Nuclear Information System (INIS)

Yang, Ming; Ko, Yong-Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu

2017-01-01

Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

Energy Technology Data Exchange (ETDEWEB)

Yang, Ming [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Ko, Yong-Ho [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Bang, Junghwan [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Kim, Taek-Soo [Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Lee, Chang-Woo, E-mail: cwlee@kitech.re.kr [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Li, Mingyu, E-mail: myli@hit.edu.cn [Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055 (China)

2017-02-15

Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

Laser solder welding of articular cartilage: tensile strength and chondrocyte viability.

Science.gov (United States)

Züger, B J; Ott, B; Mainil-Varlet, P; Schaffner, T; Clémence, J F; Weber, H P; Frenz, M

2001-01-01

The surgical treatment of full-thickness cartilage defects in the knee joint remains a therapeutic challenge. Recently, new techniques for articular cartilage transplantation, such as mosaicplasty, have become available for cartilage repair. The long-term success of these techniques, however, depends not only on the chondrocyte viability but also on a lateral integration of the implant. The goal of this study was to evaluate the feasibility of cartilage welding by using albumin solder that was dye-enhanced to allow coagulation with 808-nm laser diode irradiation. Conventional histology of light microscopy was compared with a viability staining to precisely determine the extent of thermal damage after laser welding. Indocyanine green (ICG) enhanced albumin solder (25% albumin, 0.5% HA, 0.1% ICG) was used for articular cartilage welding. For coagulation, the solder was irradiated through the cartilage implant by 808-nm laser light and the tensile strength of the weld was measured. Viability staining revealed a thermal damage of typically 500 m in depth at an irradiance of approximately 10 W/cm(2) for 8 seconds, whereas conventional histologies showed only half of the extent found by the viability test. Heat-bath investigations revealed a threshold temperature of minimum 54 degrees C for thermal damage of chondrocytes. Efficient cartilage bonding was obtained by using bovine albumin solder as adhesive. Maximum tensile strength of more than 10 N/cm(2) was achieved. Viability tests revealed that the thermal damage is much greater (up to twice) than expected after light microscopic characterization. This study shows the feasibility to strongly laser weld cartilage on cartilage by use of a dye-enhanced albumin solder. Possibilities to reduce the range of damage are suggested. Copyright 2001 Wiley-Liss, Inc.

Study of susceptibility to hydrogen embrittlement of welded joints of large WWER reactor vessels at different temperatures

International Nuclear Information System (INIS)

Mazel', R.E.; Kuznetsova, T.P.; Grinenko, V.G.; Sapronova, M.N.

1977-01-01

The effect is studied of hydrogen and a coolant of WWER on the susceptibility to brittle fracture of welded joints from steels 15Kh2MFA and 15Kh2NMFA obtained by automatic submerged arc welding with the use of the welding materials of different purity. The effect of hydrogen (concentration range 0.5-7.5 cm 3 /100 g, testing temperatures 20, 70 and 325 deg C) and the coolant (pressures up to 120 atm, temperatures 20-350 deg C) have been estimated by the fracture work during static bending tests. It is shown that the purification of the welding materials enhances the fracture properties by about a factor of 2. Hydrogenation results in a sharp drop (by about a factor of 3) of the fracture work. The increased testing temperature (up to 325 deg C) is accompanied by disappearance of the effect of hydrogen embrittlement, which is explained by an increase in the diffusion mobility of atomic hydrogen. Under the action of the coolant the fracture work shows a two-fold decrease, while the pressure being increased up to 100 atm leads to greater fracture work decrease

Effects of In and Ni Addition on Microstructure of Sn-58Bi Solder Joint

Science.gov (United States)

Mokhtari, Omid; Nishikawa, Hiroshi

2014-11-01

In this study, the effect of adding 0.5 wt.% and 1 wt.% In and Ni to Sn-58Bi solder on intermetallic compound (IMC) layers at the interface and the microstructure of the solder alloys were investigated during reflow and thermal aging by scanning electron microscopy and electron probe micro-analysis. The results showed that the addition of minor elements was not effective in suppressing the IMC growth during the reflow; however, the addition of 0.5 wt.% In and Ni was effective in suppressing the IMC layer growth during thermal aging. The thickening kinetics of the total IMC layer was analyzed by plotting the mean thickness versus the aging time on log-log coordinates, and the results showed the transition point from grain boundary diffusion control to a volume diffusion control mechanism. The results also showed that the minor addition of In can significantly suppress the coarsening of the Bi phase.

Low Temperature Irradiation Embrittlement of Reactor Pressure Vessel Steels

Energy Technology Data Exchange (ETDEWEB)

Wang, Jy-An John [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

2015-08-01

The embrittlement trend curve development project for HFIR reactor pressure vessel (RPV) steels was carried out with three major tasks. Which are (1) data collection to match that used in HFIR steel embrittlement trend published in 1994 Journal Nuclear Material by Remec et. al, (2) new embrittlement data of A212B steel that are not included in earlier HFIR RPV trend curve, and (3) the adjustment of nil-ductility-transition temperature (NDTT) shift data with the consideration of the irradiation temperature effect. An updated HFIR RPV steel embrittlement trend curve was developed, as described below. NDTT( C) = 23.85 log(x) + 203.3 log (x) + 434.7, with 2- uncertainty of 34.6 C, where parameter x is referred to total dpa. The developed update HFIR RPV embrittlement trend curve has higher embrittlement rate compared to that of the trend curve developed in 1994.

Hydrogen embrittlement and galvanic corrosion of titanium alloys

Energy Technology Data Exchange (ETDEWEB)

Soh, Jeong Ryong; Jeong, Y. H.; Choi, B. K.; Baek, J. H.; Hwang, D. Y.; Choi, B. S.; Lee, D. J

2000-06-01

The material properties including the fracture behavior of titanium alloys used as a steam generator tube in SMART can be degraded de to the hydrogen embrittlement and the galvanic corrosion occurring as a result of other materials in contact with titanium alloys in a conducting corrosive environment. In this report the general concepts and trends of hydrogen embrittlement are qualitatively described to adequately understand and expect the fracture behavior from hydrogen within the bulk of materials and under hydrogen containing environments because hydrogen embrittlement may be very complicated process. And the characteristics of galvanic corrosion closely related to hydrogen embrittlement is qualitatively based on wimple electrochemical theory.

Hydrogen embrittlement and galvanic corrosion of titanium alloys

International Nuclear Information System (INIS)

Soh, Jeong Ryong; Jeong, Y. H.; Choi, B. K.; Baek, J. H.; Hwang, D. Y.; Choi, B. S.; Lee, D. J.

2000-06-01

The material properties including the fracture behavior of titanium alloys used as a steam generator tube in SMART can be degraded de to the hydrogen embrittlement and the galvanic corrosion occurring as a result of other materials in contact with titanium alloys in a conducting corrosive environment. In this report the general concepts and trends of hydrogen embrittlement are qualitatively described to adequately understand and expect the fracture behavior from hydrogen within the bulk of materials and under hydrogen containing environments because hydrogen embrittlement may be very complicated process. And the characteristics of galvanic corrosion closely related to hydrogen embrittlement is qualitatively based on wimple electrochemical theory

Electrical characteristics for Sn-Ag-Cu solder bump with Ti/Ni/Cu under-bump metallization after temperature cycling tests

Science.gov (United States)

Shih, T. I.; Lin, Y. C.; Duh, J. G.; Hsu, Tom

2006-10-01

Lead-free solder bumps have been widely used in current flip-chip technology (FCT) due to environmental issues. Solder joints after temperature cycling tests were employed to investigate the interfacial reaction between the Ti/Ni/Cu under-bump metallization and Sn-Ag-Cu solders. The interfacial morphology and quantitative analysis of the intermetallic compounds (IMCs) were obtained by electron probe microanalysis (EPMA) and field emission electron probe microanalysis (FE-EPMA). Various types of IMCs such as (Cu1-x,Agx)6Sn5, (Cu1-y,Agy)3Sn, and (Ag1-z,Cuz)3Sn were observed. In addition to conventional I-V measurements by a special sample preparation technique, a scanning electron microscope (SEM) internal probing system was introduced to evaluate the electrical characteristics in the IMCs after various test conditions. The electrical data would be correlated to microstructural evolution due to the interfacial reaction between the solder and under-bump metallurgy (UBM). This study demonstrated the successful employment of an internal nanoprobing approach, which would help further understanding of the electrical behavior within an IMC layer in the solder/UBM assembly.

Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

DEFF Research Database (Denmark)

Kostandyan, Erik; Sørensen, John Dalsgaard

2012-01-01

on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

Liquid and Solid Metal Embrittlement.

Science.gov (United States)

1981-09-05

example, embrittlement of AISI 4140 steel begins at T/T, - 0.75 for cadmium, and 0.85 for lead and tin environments (2). In a few cases, e.g. zinc...has recently proposed, however, that liquid zinc can penetrate to very near the tip of a sharp crack in 4140 steel, based upon both direct observation...long could be detected, was observed in delayed failure experi- ments on unnotched 4140 steel, in the quenched and tempered condi- tion, embrittled by

High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

DEFF Research Database (Denmark)

High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

Current density redistribution from no current crowding to current crowding in Pb-free solder joints with an extremely thick Cu layer

International Nuclear Information System (INIS)

Han, Jung Kyu; Choi, Daechul; Fujiyoshi, Masaru; Chiwata, Nobuhiko; Tu, King-Ning

2012-01-01

In order to remove the effect of current crowding on electromigration, thick Cu under-bump metallization has been widely adopted in the electronics industry. Three-dimensional (3-D) integrated circuits, using through Si via Cu column interconnects, is being developed, and it seems that current crowding may not be a reliability issue. However, statistical experiments and 3-D finite element simulation indicate that there is a transition from no current crowding to current crowding, caused by void growth at the cathode. An analysis of the electromigration-induced failure mechanism in solder joints having a very thick Cu layer is presented. It is a unique failure mechanism, different from that in flip chip technology. Moreover, the study of marker displacement shows two different stages of drift velocity, which clearly demonstrates the back-stress effect and the development of compressive stress.

Laser-activated protein solder for peripheral nerve repair

Science.gov (United States)

Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

1995-05-01

A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

U.S. NRC Embrittlement Data Base (EDB)

International Nuclear Information System (INIS)

Pace, J.V.; Rosseel, T.M.; Wang, J.A.

1999-01-01

Large amounts of data obtained from surveillance capsules and test reactor experiments are needed, comprising many different materials and different irradiation conditions, to develop generally applicable damage prediction models that can be used for industry standards and regulatory guides. Version 1 of the Embrittlement Data Base (EDB) [I] is such a comprehensive collection of such data resulting from the merging of the Power Reactor Embrittlement Data Base (PR-EDB) [2] and the Test Reactor Embrittlement Data Base (TR-EDB) [3]. Fracture toughness data were also integrated into Version 1 of the EDB. The EDB data files are in dBASE format and can be accessed with a personal computer using the DOS or WINDOWS operating system. A utility program has been written to investigate radiation embrittlement using this data base. The utility program is used to retrieve and select specific data, manipulate data, display data to the screen or printer, and to tit and plot Charpy impact data

The constitutive response of three solder materials

International Nuclear Information System (INIS)

Perez-Bergquist, Alejandro G.; Cao Fang; Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T.

2012-01-01

Highlights: ► The full constitutive response of three solder materials. ► Test temperatures from −196 °C to 60 °C and strain rates from 10 −3 to >10 3 s −1 . ► Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (−196 °C to 60 °C) and strain rate (10 −3 to >10 3 s −1 ). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

Radiation embrittlement of PWR vessel supports

International Nuclear Information System (INIS)

Cheverton, R.D.; Robinson, G.C.; Pennell, W.E.; Nanstad, R.K.

1989-01-01

Several studies pertaining to radiation damage of PWR vessel supports were conducted between 1978 and 1987. During this period, apparently there was no reason to believe that low-temperature (<100 degree C) MTR embrittlement data were not appropriate for evaluating embrittlement of PWR vessel supports. However, late in 1986, data from the High Flux Isotope Reactor (HFIR) vessel surveillance program indicated that the embrittlement rates of the several HFIR vessel materials (A212-B, A350-LF3, A105-II) were substantially greater than anticipated on the basis of MTR data. Further evaluation of the HFIR data suggested that a fluence-rate effect was responsible for the apparent discrepancy, and shortly thereafter it became apparent that this rate effect was applicable to the evaluation of LWR vessel supports. As a result, the Nuclear Regulatory Commission (NRC) requested that the Oak Ridge National Laboratory (ORNL) evaluate the impact of the apparent embrittlement rate effect on the integrity of light-water-reactor (LWR) vessel supports. The purpose of the study was to provide an indication of whether the integrity of reactor vessel supports is likely to be challenged by radiation-induced embrittlement. The scope of the evaluation included correlation of the HFIR data for application to the evaluation of LWR vessel supports; a survey and cursory evaluation of all US LWR vessel support designs, selection of two plants for specific-plant evaluation, and a specific-plant evaluation of both plants to determine critical flaw sizes for their vessel supports. 19 refs., 8 figs., 2 tabs

Current redistribution in cables made of insulated, soldered, or oxidized strands

International Nuclear Information System (INIS)

Turck, B.

1979-07-01

Current redistributions are compared in cables made of insulated strands, soldered, or oxidized strands and insulated strands with periodic joints. After discussing the different current redistributions in the cases of a rapidly changing current and a dc current, several particular situations are investigated: what happens if a strand is broken, or if a local normal zone appears that does not affect all the strands equally, the detection of this normal zone, and the influence of short circuits between strands

Thermal Runaway of the 13 kA Busbar Joints in the LHC

OpenAIRE

Verweij, A P

2010-01-01

Triggered by the incident in the LHC in September 2008, the thermo-electrical stability of the 10,000 soldered busbar joints in the 13 kA circuits of the LHC has been re-assessed. For this purpose the computer model QP3 has been developed. In this paper the results of some calculations are presented, and it is shown how the results have been used to improve the quench detection system and ensure safe future operation. First the layout of the 13 kA circuits, the geometry of the soldered joints...

Modeling of irradiation embrittlement and annealing/recovery in pressure vessel steels

International Nuclear Information System (INIS)

Lott, R.G.; Freyer, P.D.

1996-01-01

The results of reactor pressure vessel (RPV) annealing studies are interpreted in light of the current understanding of radiation embrittlement phenomena in RPV steels. An extensive RPV irradiation embrittlement and annealing database has been compiled and the data reveal that the majority of annealing studies completed to date have employed test reactor irradiated weldments. Although test reactor and power reactor irradiations result in similar embrittlement trends, subtle differences between these two damage states can become important in the interpretation of annealing results. Microstructural studies of irradiated steels suggest that there are several different irradiation-induced microstructural features that contribute to embrittlement. The amount of annealing recovery and the post-anneal re-embrittlement behavior of a steel are determined by the annealing response of these microstructural defects. The active embrittlement mechanisms are determined largely by the irradiation temperature and the material composition. Interpretation and thorough understanding of annealing results require a model that considers the underlying physical mechanisms of embrittlement. This paper presents a framework for the construction of a physically based mechanistic model of irradiation embrittlement and annealing behavior

Laser assisted soldering: microdroplet accumulation with a microjet device.

Science.gov (United States)

Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

1998-01-01

We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

Irradiation embrittlement mitigation

Energy Technology Data Exchange (ETDEWEB)

Torronen, K; Pelli, R; Planman, T; Valo, M [Technical Research Centre of Finland, Jyvaeskylae (Finland). Combustion and Thermal Engineering Lab.

1994-12-31

Mitigation methods for reducing the irradiation damage on pressure vessel materials are reviewed: load leakage loading schemes are commonly used in PWRs to mitigate reactor pressure vessel embrittlement; dummy assemblies have been applied in WWER 440-type and in some old western power plants, when exceptional fast embrittlement has been encountered; shielding of the pressure vessel has been developed, but is not in common use; pre-stressing the pressure vessel has been proposed for preventing PTS failures, but its applicability is not yet demonstrated. The large number of successful annealing treatments performed in WWER 440 type reactors as well as research on the effects of annealing treatments suggest applications for western PWRs. The emergency core cooling systems have been modified in WWER 440-type reactors in connection with other mitigation measures. (authors). 37 refs., 18 figs., 2 tabs.

Irradiation embrittlement mitigation

International Nuclear Information System (INIS)

Torronen, K.; Pelli, R.; Planman, T.; Valo, M.

1993-01-01

Mitigation methods for reducing the irradiation damage on pressure vessel materials are reviewed: load leakage loading schemes are commonly used in PWRs to mitigate reactor pressure vessel embrittlement; dummy assemblies have been applied in WWER 440-type and in some old western power plants, when exceptional fast embrittlement has been encountered; shielding of the pressure vessel has been developed, but is not in common use; pre-stressing the pressure vessel has been proposed for preventing PTS failures, but its applicability is not yet demonstrated. The large number of successful annealing treatments performed in WWER 440 type reactors as well as research on the effects of annealing treatments suggest applications for western PWRs. The emergency core cooling systems have been modified in WWER 440-type reactors in connection with other mitigation measures. (authors). 37 refs., 18 figs., 2 tabs

Evaluation on the characteristics of tin-silver-bismuth solder

Science.gov (United States)

Xia, Z.; Shi, Y.; Chen, Z.

2002-02-01

Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

The constitutive response of three solder materials

Energy Technology Data Exchange (ETDEWEB)

Perez-Bergquist, Alejandro G., E-mail: alexpb@lanl.gov [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States); Cao Fang [Exxon Mobil Research and Engineering Company, Annadale, NJ 08801 (United States); Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T. [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States)

2012-05-25

Highlights: Black-Right-Pointing-Pointer The full constitutive response of three solder materials. Black-Right-Pointing-Pointer Test temperatures from -196 Degree-Sign C to 60 Degree-Sign C and strain rates from 10{sup -3} to >10{sup 3} s{sup -1}. Black-Right-Pointing-Pointer Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196 Degree-Sign C to 60 Degree-Sign C) and strain rate (10{sup -3} to >10{sup 3} s{sup -1}). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

An Approach for Impression Creep of Lead Free Microelectronic Solders

Science.gov (United States)

Anastasio, Onofrio A.

2002-06-01

Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

Computer simulation of hydrogen diffusion and hydride precipitation at Ta/Zr bond interface. Hydrogen embrittlement in SUS304ULC/Ta/Zr explosive bonded joint

International Nuclear Information System (INIS)

Saida, Kazuyoshi; Fujimoto, Tetsuya; Nishimoto, Kazutoshi

2010-01-01

The concentration of hydrogen and precipitation of zirconium hydrides in Ta/Zr explosive bonded joint were analysed by computer simulation. Numerical model of hydride precipitation under hydrogen diffusion was simplified by the alternate model coupled the macroscopic hydrogen diffusion with the microscopic hydride precipitation. Effects of the initial hydrogen content in Ta, working degree of Zr and post-bond heat treatment on the hydrogen diffusion and hydride precipitation were investigated. Hydrogen was rapidly diffused from Ta substrate into Zr after explosive bonding and temporarily concentrated at Ta/Zr bond interface. Zirconium hydrides were precipitated and grew at Ta/Zr bond interface, and the precipitation zone of hydrides was enlarged with the lapse of time. The precipitation of zirconium hydrides was promoted when the initial hydrogen content in Ta and working degree of Zr were increased. The concentration of hydrogen and precipitation of hydrides at the bond interface were reduced and diminished by post-bond heat treatment at 373 K. It was deduced that hydrogen embrittlement in Ta/Zr explosive bonded joint was caused by the precipitation of zirconium hydrides and concentration of hydrogen at Ta/Zr bond interface during the diffusion of hydrogen containing in Ta substrate. (author)

Radiation embrittlement of WWER-1000 reactor vessel steels

International Nuclear Information System (INIS)

Nikolaeva, A.V.; Nikolaev, Yu.A.; Kevorkyan, Yu.R.

2001-01-01

Results obtained on the blank samples of materials of the WWER-1000 vessels irradiated by low density neutron flux are discussed. Chemical composition of the materials is characterized by the low content of the impurities (copper and phosphorus) and high content of nickel. Dependence of the radiation embrittlement of the WWER-1000 vessel materials on metallurgic variables and damage dose is treated. The research showed that nickel largely enhanced the radiation embrittlement. New dependences for determination of the radiation embrittlement real rate of the WWER-1000 vessel materials and its conservative estimation were developed [ru

Modeling irradiation embrittlement in reactor pressure vessel steels

International Nuclear Information System (INIS)

Odette, G.R.

1998-01-01

As a result of the popularity of the Agencies report 'Neutron Irradiation Embrittlement of Reactor Pressure Vessel Steels' of 1975, it was decided that another report on this broad subject would be of use. In this report, background and contemporary views on specially identified areas of the subject are considered as self-contained chapters, written by experts. In chapter 10, numerical modeling of irradiation embrittlement in reactor vessel steels are introduced. Physically-based models are developed and their role in advancing the state-of-the-art of predicting irradiation embrittlement of RPV steels is stressed

Solder wetting behavior enhancement via laser-textured surface microcosmic topography

Energy Technology Data Exchange (ETDEWEB)

Chen, Haiyan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Peng, Jianke [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Fu, Li, E-mail: fuli@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Wang, Xincheng [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Xie, Yan [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China)

2016-04-15

Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

Utilization of Pb-free solders in MEMS packaging

Science.gov (United States)

Selvaduray, Guna S.

2003-01-01

Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

Albumin solder covalently bound to a polymer membrane: New approach to improve binding strength in laser tissue soldering in-vitro.

Science.gov (United States)

Hiebl, B; Ascher, L; Luetzow, K; Kratz, K; Gruber, C; Mrowietz, C; Nehring, M E; Lendlein, A; Franke, R-P; Jung, F

2018-01-01

Laser tissue soldering (LTS) based on indocyanine green (ICG)-mediated heat-denaturation of proteins might be a promising alternative technique for micro-suturing, but up to now the problem of too weak shear strength of the solder welds in comparison to sutures is not solved. Earlier reports gave promising results showing that solder supported by carrier materials can enhance the cohesive strength of the liquid solder. In these studies, the solder was applied to the carriers by dip coating. Higher reliability of the connection between the solder and the carrier material is expected when the solder is bound covalently to the carrier material. In the present study a poly(ether imide) (PEI) membrane served as carrier material and ICG-supplemented albumin as solder substrate. The latter was covalently coupled to the carrier membrane under physiological conditions to prevent structural protein changes. As laser source a diode continuous-wave laser emitting at 808 nm with intensities between 250 mW and 1500 mW was utilized. The albumin functionalized carrier membrane was placed onto the tunica media of explanted pig thoracic aortae forming an overlapping area of approximately 0.5×0.5 cm2. All tests were performed in a dry state to prevent laser light absorption by water. Infrared spectroscopy, spectro-photometrical determination of the secondary and primary amine groups after acid orange II staining, contact angle measurements, and atomic force microscopy proved the successful functionalization of the PEI membrane with albumin. A laser power of 450 mW LTS could generate a membrane-blood vessel connection which was characterized by a shear strength of 0.08±0.002 MPa, corresponding to 15% of the tensile strength of the native blood vessel. Theoretically, an overlapping zone of 4.1 mm around the entire circumference of the blood vessel could have provided shear strength of the PEI membrane-blood vessel compound identical to the tensile strength of the native

Integration of environmentally compatible soldering technologies for waste minimization

International Nuclear Information System (INIS)

Hosking, F.M.

1992-01-01

There has been a concentrated effort throughout the international microelectronics industry to phase out chlorofluorocarbon (CFC) materials and alleviate the serious problem of ozone depletion created by the release of CFCS. The development of more environmentally compatible manufacturing technologies is the cornerstone of this effort. Alternative materials and processes for cleaning and soldering have received special attention. Electronic. soldering typically utilizes rosin-based fluxes to promote solder wettability. Flux residues must be removed from the soldered parts when high product reliability is essential. Halogenated or CFC solvents have been the principle chemicals used to clean the residues. With the accelerated push to eliminate CFCs in the US by 1995, CFC-free solvents, aqueous-based cleaning, water soluble or ''no clean'' fluxes, and fluxless soldering technologies are being developed and quickly integrated into manufacturing practice. Sandia's Center for Solder Science and Technology has been ch g a variety of fluxless and alternative soldering technologies for DOE's waste minimization program. The work has focused on controlled atmosphere, laser, and ultrasonic fluxless soldering, protective metallic and organic coatings, and fluxes which have water soluble or low solids-based chemistries. With the increasing concern that Pb will also be banned from electronic soldering, Sandia has been characterizing the wetting, aging, and mechanical properties of Pb-fire solder alloys. The progress of these integrated studies will be discussed. Their impact on environmentally compatible manufacturing will be emphasized. Since there is no universal solution to the various environmental, safety, and health issues which currently face industry, the proposed technologies offer several complementary materials and processing options from which one can choose

Efforts to Develop a 300°C Solder

Energy Technology Data Exchange (ETDEWEB)

Norann, Randy A [Perma Works LLC

2015-01-25

This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

Science.gov (United States)

Werden, Jesse

The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the

Safer Soldering Guidelines and Instructional Resources

Science.gov (United States)

Love, Tyler S.; Tomlinson, Joel

2018-01-01

Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

Updated embrittlement trend curve for reactor pressure vessel steels

International Nuclear Information System (INIS)

Kirk, M.; Santos, C.; Eason, E.; Wright, J.; Odette, G.R.

2003-01-01

The reactor pressure vessels of commercial nuclear power plants are subject to embrittlement due to exposure to high energy neutrons from the core. Irradiation embrittlement of RPV belt-line materials is currently evaluated using US Regulatory Guide 1.99 Revision 2 (RG 1.99 Rev 2), which presents methods for estimating the Charpy transition temperature shift (ΔT30) at 30 ft-lb (41 J) and the drop in Charpy upper shelf energy (ΔUSE). A more recent embrittlement model, based on a broader database and more recent research results, is presented in NUREG/CR-6551. The objective of this paper is to describe the most recent update to the embrittlement model in NUREG/CR-6551, based upon additional data and increased understanding of embrittlement mechanisms. The updated ΔT30 and USE models include fluence, copper, nickel, phosphorous content, and product form; the ΔT30 model also includes coolant temperature, irradiation time (or flux), and a long-time term. The models were developed using multi-variable surface fitting techniques, understanding of the ΔT30 mechanisms, and engineering judgment. The updated ΔT30 model reduces scatter significantly relative to RG 1.99 Rev 2 on the currently available database for plates, forgings, and welds. This updated embrittlement trend curve will form the basis of revision 3 to Regulatory Guide 1.99. (author)

The Test Reactor Embrittlement Data Base (TR-EDB)

International Nuclear Information System (INIS)

Stallmann, F.W.; Kam, F.B.K.; Wang, J.A.

1993-01-01

The Test Reactor Embrittlement Data Base (TR-EDB) is part of an ongoing program to collect test data from materials irradiations to aid in the research and evaluation of embrittlement prediction models that are used to assure the safety of pressure vessels in power reactors. This program is being funded by the US Nuclear Regulatory Commission (NRC) and has resulted in the publication of the Power Reactor Embrittlement Data Base (PR-EDB) whose second version is currently being released. The TR-EDB is a compatible collection of data from experiments in materials test reactors. These data contain information that is not obtainable from surveillance results, especially, about the effects of annealing after irradiation. Other information that is only available from test reactors is the influence of fluence rates and irradiation temperatures on radiation embrittlement. The first version of the TR-EDB will be released in fall of 1993 and contains published results from laboratories in many countries. Data collection will continue and further updates will be published

Lead-free solder technology transfer from ASE Americas

Energy Technology Data Exchange (ETDEWEB)

FTHENAKIS,V.

1999-10-19

To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

Science.gov (United States)

Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

2018-03-01

The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

Irradiation embrittlement of pressure vessel steels

International Nuclear Information System (INIS)

Brumovsky, M.; Vacek, M.

1975-01-01

A Standard Research Programme on Irradiation Embrittlement of Pressure Vessel Steels was approved by the Coordinating Meeting on the 12th May 1972 at the Working Group on Engineering Aspects of Irradiation Embrittlement of Pressure Vessel Steels. This Working Group was set up by the International Atomic Energy Agency in Vienna. Seven countries with their research institutes agreed on doing irradiation experiments according to the approved programme on steel A533 B from the U.S. HSST Programme. The Czechoslovak contribution covering tensile and impact testing of non-irradiated steel and steel irradiated at 280degC to 1.3 x 10 23 n/m 2 (E above 1 MeV) is presented in this report. As an additional part the same set of experiments was carried out on two additional steels - A 542 and A 543, made in SKODA Works for comparison of their irradiation embrittlement and hardening with A533 B steel. (author)

The liquid metal embrittlement of iron and ferritic steels in sodium

International Nuclear Information System (INIS)

Hilditch, J.P.; Hurley, J.R.; Tice, D.R.; Skeldon, P.

1995-01-01

The liquid metal embrittlement of iron and A508 III, 21/4Cr-1Mo and 15Mo3 steels in sodium at 200-400 o C has been studied, using dynamic straining at 10 -6 s -1 , in order to investigate the roles of microstructure and composition. The steels comprised bainitic, martensitic, tempered martensitic and ferritic/pearlitic microstructures. All materials were embrittled by sodium, the embrittlement being associated generally with quasicleavage on fracture surfaces. Intergranular cracking was also found with martensitic and ferritic/pearlitic microstructures. The susceptibility to embrittlement was greater in higher strength materials and at higher temperatures. The embrittlement was similar to that encountered previously in 9Cr steel, which depends upon the presence of non-metallic impurities in the sodium. (author)

Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

Energy Technology Data Exchange (ETDEWEB)

Dias, Marcelino; Costa, Thiago [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Rocha, Otávio [Federal Institute of Education, Science and Technology of Pará — IFPA, 66093-020 Belém, PA (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos — UFSCar, 13565-905 São Carlos, SP (Brazil); Cheung, Noé, E-mail: cheung@fem.unicamp.br [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil)

2015-08-15

Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing.

Embrittlement and life prediction of aged duplex stainless steel

International Nuclear Information System (INIS)

Kuwano, Hisashi

1996-01-01

The stainless steel, for which the durability for long term in high temperature corrosive environment is demanded, is a complex plural alloy. Cr heightens the oxidation resistance, Ni improves the ductility and impact characteristics, Si improves the fluidity of the melted alloy and heightens the resistance to stress corrosion cracking, and Mo suppresses the pitting due to chlorine ions. These alloy elements are in the state of nonequilibrium solid solution in Fe base at practical temperature, and cause aging phenomena such as segregation, concentration abnormality and precipitation during the use for long term. The characteristics of stainless steel deteriorate due to this. Two-phase stainless cast steel, the example of the embrittlement of the material for an actual machine, the accelerated test of embrittlement, the activation energy for embrittlement, and as the mechanism of aging embrittlement, the spinodal decomposition of ferrite, the precipitation of G phase and the precipitation of carbides and nitrides are described. Also in the welded parts of austenitic stainless steel, delta-ferrite is formed during cooling, therefore, the condition is nearly same as two-phase stainless steel, and the embrittlement due to long term aging occurs. (K.I.)

Nano-soldering to single atomic layer

Science.gov (United States)

Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

2011-10-11

A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

Soldering formalism in noncommutative field theory: a brief note

International Nuclear Information System (INIS)

Ghosh, Subir

2004-01-01

In this Letter, I develop the soldering formalism in a new domain--the noncommutative planar field theories. The soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair of noncommutative Maxwell-Chern-Simons theories, having opposite signs in their respective topological terms, can be consistently soldered to yield the Proca model (Maxwell theory with a mass term) with corrections that are at least quadratic in the noncommutativity parameter. We further argue that this model can be thought of as the noncommutative generalization of the Proca theory of ordinary spacetime. It is well known that abelian noncommutative gauge theory bears a close structural similarity with non-abelian gauge theory. This fact is manifested in a non-trivial way if the present Letter is compared with existing literature, where soldering of non-abelian models are discussed. Thus the present work further establishes the robustness of the soldering programme. The subtle role played by gauge invariance (or the lack of it), in the above soldering process, is revealed in an interesting way

A new method for soldering particle-reinforced aluminum metal matrix composites

Energy Technology Data Exchange (ETDEWEB)

Lu, Jinbin; Mu, Yunchao [Zhongyuan University of Technology, Zhengzhou 450007 (China); Luo, Xiangwei [Zhengzhou University, Zhengzhou 450002 (China); Niu, Jitai, E-mail: niujitai@163.com [Zhongyuan University of Technology, Zhengzhou 450007 (China)

2012-12-01

Highlights: Black-Right-Pointing-Pointer Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. Black-Right-Pointing-Pointer The nickel plating is required on the surface of the composites before soldering. Black-Right-Pointing-Pointer Low welding temperature is set to avoid overheating of the matrix. Black-Right-Pointing-Pointer Chemical and metallurgical bonding of composites and Kovar is carried out. Black-Right-Pointing-Pointer High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al-SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe-Ni-Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn-Cd-Ag-Cu) with a melting point of about 400 Degree-Sign C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)-Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al-SiC composite.

A new method for soldering particle-reinforced aluminum metal matrix composites

International Nuclear Information System (INIS)

Lu, Jinbin; Mu, Yunchao; Luo, Xiangwei; Niu, Jitai

2012-01-01

Highlights: ► Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. ► The nickel plating is required on the surface of the composites before soldering. ► Low welding temperature is set to avoid overheating of the matrix. ► Chemical and metallurgical bonding of composites and Kovar is carried out. ► High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al–SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe–Ni–Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn–Cd–Ag–Cu) with a melting point of about 400 °C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)–Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al–SiC composite.

Power Reactor Embrittlement Data Base

International Nuclear Information System (INIS)

Kam, F.B.K.; Stallmann, F.W.; Wang, J.A.

1990-01-01

Regulatory and research evaluations of embrittlement prediction models and of vessel integrity under load can be greatly expedited by the use of a well designed, computerized embrittlement data base. The Power Reactor Embrittlement Data Base (PR-EDB) is a comprehensive collection of data from surveillance reports and other published reports of commercial nuclear reactors. The uses of the data base require that as many different data as available are collected from as many sources as possible with complete references and that subsets of relevant data can be easily retrieved and processed. The objectives of this NRC-sponsored program are the following: (1) to compile and to verify the quality of the PR-EDB; (2) to provide user-friendly software to access and process the data; (3) to explore or confirm embrittlement prediction models; and (4) to interact with standards organizations to provide the technical bases for voluntary consensus standards that can be used in regulatory guides, standard review plans, and codes. To achieve these goals, the data base architecture was designed after much discussion and planning with prospective users, namely, material scientists and members of the research staff. The current compilation of the PR-EDB (Version 1) contains results from surveillance capsule reports of 78 reactors with 381 data points for 110 different irradiated base materials and 161 data points for 79 different welds. Results from heat-affected zone materials are also listed. The time and effort required to process and evaluate different types of data in the PR-EDB have been drastically reduced from previous data bases. The Electric Power Research Institute (EPRI), reactor vendors, and utilities are in the process of providing back-up quality assurance checks of PR-EDB and will be supplementing the data base with additional data and documentation

Mechanisms of liquid-metal embrittlement

International Nuclear Information System (INIS)

Popovich, V.V.

1979-01-01

The mechanism of the embrittlement of metals and alloys during deformation in contact with liquid metals are discussed. With 20Kh13 steel in a Pb-Sn melt and polycrystalline Al in the presence of various mercury solutions a.s examples, considered are the three main processes - adsorption, corrosion (dissolution), formation of new phases which cause the disintegration of materials under the action of liquid-metallic media. Presented are data on plastic ductile and strength properties of the above materials in the presence of liquid-metallic media. A model is described that takes into account the effect of the medium upon the plastic deformation and the part the medium plays in liquid-metallic embrittlement

The development of a graphite to copper joint for injector diagnostics

International Nuclear Information System (INIS)

Baker, D.

1975-09-01

A successful method of joining soft graphite to copper, to achieve a high thermal conductivity joint, is described, together with initial attempts and the difficulties experienced. The graphite, after an initial treatment, was flame sprayed with copper. The main copper-to-graphite joint was of silver solder. (U.K.)

Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly

Energy Technology Data Exchange (ETDEWEB)

Mostafa Shalaby, Rizk; Kamal, Mustafa [Metal Physics Laboratory, Physics Department, Faculty of Science, Mansoura University, P.O.Box: 35516, Mansoura (Egypt); Ali, Esmail A.M. [Basic Science Department, Faculty of Engineering, University of Science & Technology (Yemen); Gumaan, Mohammed S., E-mail: m.gumaan1@gmail.com [Metal Physics Laboratory, Physics Department, Faculty of Science, Mansoura University, P.O.Box: 35516, Mansoura (Egypt); Basic Science Department, Faculty of Engineering, University of Science & Technology (Yemen)

2017-04-06

This paper aims to investigate the reliability of mechanical and creep behavior for the eutectic Sn-Ag and Sn-Ag-Cu Solder joints rapidly solidified after hot compressing (HC) in terms of structural changes and its relationship with thermal behavior, which has been discussed and compared with their properties before HC process by Mustafa et al. (2016) . These solder joints were prepared by melt-spinning technique and tested by HC at 30 MPa pressure and 150 °C for 90 min, their structural, mechanical and thermal properties after HC process have been investigated by X-ray diffraction (XRD), dynamic resonance techniques (DRT) and differential scanning calorimetry (DSC) techniques respectively and compared with these solders before HC. The results revealed that the pressure caused some fractures on the solders morphology surfaces. But some benefits for these solders have been occurred, like eliminating the internal stresses through recrystallization process whose evidence by the particle size increases after they HC, stabilized structure after HC was due to the metastable phases rearrangements, new intermetallic compounds (IMCs) formation, decreasing, melting temperature range (∆T), lattice strains (ƹ) and entropy change (S). These sequential benefits are considered to be the main reasons which lead to decreasing energy loss (Q{sup −1}), creep rate (É›) and thermal stability enhancement. Elastic modulus increment might be due to low elastic lattice distortions after HC, while the stress exponent (n) reduction refers to viscous glide mechanism of deformation after HC instead of climb deformation mechanism before HC.

Cladding embrittlement during postulated loss-of-coolant accidents.

Energy Technology Data Exchange (ETDEWEB)

Billone, M.; Yan, Y.; Burtseva, T.; Daum, R.; Nuclear Engineering Division

2008-07-31

The effect of fuel burnup on the embrittlement of various cladding alloys was examined with laboratory tests conducted under conditions relevant to loss-of-coolant accidents (LOCAs). The cladding materials tested were Zircaloy-4, Zircaloy-2, ZIRLO, M5, and E110. Tests were performed with specimens sectioned from as-fabricated cladding, from prehydrided (surrogate for high-burnup) cladding, and from high-burnup fuel rods which had been irradiated in commercial reactors. The tests were designed to determine for each cladding material the ductile-to-brittle transition as a function of steam oxidation temperature, weight gain due to oxidation, hydrogen content, pre-transient cladding thickness, and pre-transient corrosion-layer thickness. For short, defueled cladding specimens oxidized at 1000-1200 C, ring compression tests were performed to determine post-quench ductility at {le} 135 C. The effect of breakaway oxidation on embrittlement was also examined for short specimens oxidized at 800-1000 C. Among other findings, embrittlement was found to be sensitive to fabrication processes--especially surface finish--but insensitive to alloy constituents for these dilute zirconium alloys used as cladding materials. It was also demonstrated that burnup effects on embrittlement are largely due to hydrogen that is absorbed in the cladding during normal operation. Some tests were also performed with longer, fueled-and-pressurized cladding segments subjected to LOCA-relevant heating and cooling rates. Recommendations are given for types of tests that would identify LOCA conditions under which embrittlement would occur.

Estimation of embrittlement damage risk at neutron embrittled vessel constructions

International Nuclear Information System (INIS)

Staevski, K.; Madzharov, D.; Detistov, P.; Petrova, T.

1998-01-01

In this work a methodology based on Damage mechanics criteria is proposed. This methodology serves for probability assessment of the brittle damage risk for the neutron embrittled vessel elements. The developed methodology is realised in RISK code and has been verified on the base of tough reliability of the pressure vessel, 'Kozloduy' NPP Unit 2. This investigation has been carried out at the given parameters of the possible defects on the vessel's weld 4 taking into account requirements of the western and Russian standards. The obtained values for ductile to brittle transition temperatures, defining the equipment life-time in the presence of maximal defect, are in good consistence with the experimentally determined ones. The analyses of results show that the pressure vessel of 'Kozloduy' NPP Unit 2 has got a high level of reliability from brittle damage risk point of view and that the western standards give more conservative evaluation. On the bases of the results a conclusion is made that the developed methodology enables analysing the influence of possible defects in the neutron embrittled elements on their to reliability and their remained life-time

Metallographic observations of AISI 304 - copper dissimular joints

International Nuclear Information System (INIS)

Medeiros, R.C. de; Carvalho Perdigao, S. de

1982-01-01

The current work informs on the SMAW dissimilar joints embrittled by molten Copper. Bead on plate of that metal were deposited on four different base metals to evaluate the phenomena. Conventional and non conventional welding methods were employed to obtain dissimilar joints of AISI 304-Cu. The latter were observed metallographically. These results are to be complemented by mechanical testing actually being performed. (Author) [pt

Embrittlement of zircaloy cladding due to oxygen uptake (CBRTTL)

International Nuclear Information System (INIS)

Reymann, G.A.

1979-02-01

A model for embrittlement of zircaloy due to oxygen uptake at high temperatures is described. The model defines limits for oxygen content and temperature which, if exceeded, give rise to zircaloy cladding which is sufficiently embrittled to cause failure either on quenching or normal handling following a transient. A significant feature of this model is that the onset of embrittlement is dependent on the cooling rate. A distinction is made between slow and fast cooling, with the boundary at 100 K/s. The material property correlations and computer subcodes described in MATPRO are developed for use in Light Water Reactor (LWR) codes

In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

Energy Technology Data Exchange (ETDEWEB)

Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

2009-12-01

Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the Beta-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of Beta-Sn derived from the electromigration data is in good agreement with the calculated value.

In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

Energy Technology Data Exchange (ETDEWEB)

Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

2009-05-15

Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the {beta}-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of {beta}-Sn derived from the electromigration data is in good agreement with the calculated value.

TR-EDB: Test Reactor Embrittlement Data Base, Version 1

Energy Technology Data Exchange (ETDEWEB)

Stallmann, F.W.; Wang, J.A.; Kam, F.B.K. [Oak Ridge National Lab., TN (United States)

1994-01-01

The Test Reactor Embrittlement Data Base (TR-EDB) is a collection of results from irradiation in materials test reactors. It complements the Power Reactor Embrittlement Data Base (PR-EDB), whose data are restricted to the results from the analysis of surveillance capsules in commercial power reactors. The rationale behind their restriction was the assumption that the results of test reactor experiments may not be applicable to power reactors and could, therefore, be challenged if such data were included. For this very reason the embrittlement predictions in the Reg. Guide 1.99, Rev. 2, were based exclusively on power reactor data. However, test reactor experiments are able to cover a much wider range of materials and irradiation conditions that are needed to explore more fully a variety of models for the prediction of irradiation embrittlement. These data are also needed for the study of effects of annealing for life extension of reactor pressure vessels that are difficult to obtain from surveillance capsule results.

TR-EDB: Test Reactor Embrittlement Data Base, Version 1

International Nuclear Information System (INIS)

Stallmann, F.W.; Wang, J.A.; Kam, F.B.K.

1994-01-01

The Test Reactor Embrittlement Data Base (TR-EDB) is a collection of results from irradiation in materials test reactors. It complements the Power Reactor Embrittlement Data Base (PR-EDB), whose data are restricted to the results from the analysis of surveillance capsules in commercial power reactors. The rationale behind their restriction was the assumption that the results of test reactor experiments may not be applicable to power reactors and could, therefore, be challenged if such data were included. For this very reason the embrittlement predictions in the Reg. Guide 1.99, Rev. 2, were based exclusively on power reactor data. However, test reactor experiments are able to cover a much wider range of materials and irradiation conditions that are needed to explore more fully a variety of models for the prediction of irradiation embrittlement. These data are also needed for the study of effects of annealing for life extension of reactor pressure vessels that are difficult to obtain from surveillance capsule results

Simulation of He embrittlement at grain boundaries in bcc transition metals

Energy Technology Data Exchange (ETDEWEB)

Suzudo, Tomoaki, E-mail: suzudo.tomoaki@jaea.go.jp; Yamaguchi, Masatake

2015-10-15

To investigate what atomic properties largely determine vulnerability to He embrittlement at grain boundaries (GB) of bcc metals, we introduce a computational model composed of first principles density functional theory and a He segregation rate theory model. Predictive calculations of He embrittlement at the first wall of the future DEMO fusion concept reactor indicate that variation in the He embrittlement originated not only from He production rate related to neutron irradiation, but also from the He segregation energy at the GB that has a systematic trend in the periodic table. - Highlights: • We modeled He grain boundary (GB) segregation of bcc transition metals using first-principles-based rate theory. • We established the quantitative relation between He embrittlement and He segregation using GB cohesive energy. • He embrittlement was strongly dependent on He segregation energy at the GB that has a systematic trend in the periodic table.

Simulation of He embrittlement at grain boundaries in bcc transition metals

International Nuclear Information System (INIS)

Suzudo, Tomoaki; Yamaguchi, Masatake

2015-01-01

To investigate what atomic properties largely determine vulnerability to He embrittlement at grain boundaries (GB) of bcc metals, we introduce a computational model composed of first principles density functional theory and a He segregation rate theory model. Predictive calculations of He embrittlement at the first wall of the future DEMO fusion concept reactor indicate that variation in the He embrittlement originated not only from He production rate related to neutron irradiation, but also from the He segregation energy at the GB that has a systematic trend in the periodic table. - Highlights: • We modeled He grain boundary (GB) segregation of bcc transition metals using first-principles-based rate theory. • We established the quantitative relation between He embrittlement and He segregation using GB cohesive energy. • He embrittlement was strongly dependent on He segregation energy at the GB that has a systematic trend in the periodic table.

30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

Thermal Runaway of the 13 kA Busbar Joints in the LHC

CERN Document Server

Verweij, A P

2010-01-01

Triggered by the incident in the LHC in September 2008, the thermo-electrical stability of the 10,000 soldered busbar joints in the 13 kA circuits of the LHC has been re-assessed. For this purpose the computer model QP3 has been developed. In this paper the results of some calculations are presented, and it is shown how the results have been used to improve the quench detection system and ensure safe future operation. First the layout of the 13 kA circuits, the geometry of the soldered joints and the quench detection system will be described. Special focus is put on several types of defects in the joint that have been found in the LHC. The difference between slow and fast thermal run-away will be discussed, focusing on quench propagation and reduced thermal and electrical contacts between the various parts of the joint. It is shown that an enhancement of the LHC quench detection system with a much lower threshold will greatly reduce the risk of burn-out of the joint. Finally it is discussed that protection is...

A Corrosion Investigation of Solder Candidates for High-Temperature Applications

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Ambat, Rajan

2009-01-01

The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work...

Reactor pressure vessel embrittlement: Insights from neural network modelling

Science.gov (United States)

Mathew, J.; Parfitt, D.; Wilford, K.; Riddle, N.; Alamaniotis, M.; Chroneos, A.; Fitzpatrick, M. E.

2018-04-01

Irradiation embrittlement of steel pressure vessels is an important consideration for the operation of current and future light water nuclear reactors. In this study we employ an ensemble of artificial neural networks in order to provide predictions of the embrittlement using two literature datasets, one based on US surveillance data and the second from the IVAR experiment. We use these networks to examine trends with input variables and to assess various literature models including compositional effects and the role of flux and temperature. Overall, the networks agree with the existing literature models and we comment on their more general use in predicting irradiation embrittlement.

Intrinsic ductility and environmental embrittlement of binary Ni3Al

International Nuclear Information System (INIS)

George, E.P.; Liu, C.T.; Pope, D.P.

1993-01-01

Polycrystalline, B-free Ni 3 Al (23.4 at.% Al), produced by cold working and recrystallizing a single crystal, exhibits room temperature tensile ductilities of 3-5% in air and 13-16% in oxygen. These ductilities are considerably higher than anything previously reported, and demonstrate that the 'intrinsic' ductility of Ni 3 Al is much higher than previously thought. They also show that the moisture present in ordinary ambient air can severely embrittle Ni 3 Al (ductility decreasing from a high of 16% in oxygen to a low of 3% in air). Fracture is predominantly intergranular in both air and oxygen. This indicates that, while moisture can further embrittle the GBs in Ni 3 Al, they persist as weak links even in the absence of environmental embrittlement. However, they are not 'intrinsically brittle' as once thought, since they can withstand relatively large plastic deformations prior to fracture. Because B essentially eliminates environmental embrittlement in Ni 3 Al - and environmental embrittlement is a major cause of poor ductility in B-free Ni 3 Al - it is concluded that a significant portion of the so-called B effect must be related to suppression of moisture-induced environmental embrittlement. However, since B-doped Ni 3 Al fractures transgranularly, whereas B-free Ni 3 Al fractures predominantly intergranularly, B must have the added effect that it strengthens the GBs. A comparison with the earlier work on Zr-doped Ni 3 Al shows that Zr improves the ductility of Ni 3 Al, both in air and (and even more dramatically) in oxygen. While the exact mechanism of this ductility improvement is not clear at present, Zr appears to have more of an effect on (enhancing) GB strength than on (suppressing) environmental embrittlement

High Fluency Low Flux Embrittlement Models of LWR Reactor Pressure Vessel Embrittlement and a Supporting Database from the UCSB ATR-2 Irradiation Experiment

Energy Technology Data Exchange (ETDEWEB)

Odette, G. Robert [Univ. of California, Santa Barbara, CA (United States)

2017-01-24

Reactor pressure vessel embrittlement may limit the lifetime of light water reactors (LWR). Embrittlement is primarily caused by formation of nano-scale precipitates, which cause hardening and a subsequent increase in the ductile-to-brittle transition temperature of the steel. While the effect of Cu has historically been the largest research focus of RPV embrittlement, there is increasing evidence that Mn, Ni and Si are likely to have a large effect at higher fluence, where Mn-Ni-Si precipitates can form, even in the absence of Cu. Therefore, extending RPV lifetimes will require a thorough understanding of both precipitation and embrittlement at higher fluences than have ever been observed in a power reactor. To address this issue, test reactors that irradiate materials at higher neutron fluxes than power reactors are used. These experiments at high neutron flux can reach extended life neutron fluences in only months or several years. The drawback of these test irradiations is that they add additional complexity to interpreting the data, as the irradiation flux also plays a role into both precipitate formation and irradiation hardening and embrittlement. This report focuses on developing a database of both microstructure and mechanical property data to better understand the effect of flux. In addition, a previously developed model that enables the comparison of data taken over a range of neutron flux is discussed.

Effect of Solder Flux Residues on Corrosion of Electronics

DEFF Research Database (Denmark)

Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

2009-01-01

Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... testing and use in the field, consequences and recommendations are given. Failures, caused by harsh[1] customer environments, are not covered in this paper....

Low temperature hydrogen embrittlement of niobium. II. Microscopic observations

International Nuclear Information System (INIS)

Grossbeck, M.L.; Birnbaum, H.K.

1977-01-01

The detailed, microscopic processes which occur during the hydrogen embrittlement of pure Nb are examined using in situ SEM crack propagation studies, SEM fractography, electron diffraction and ion probe methods. These results show that the fracture process occurs in a stress induced NbH hydride phase which forms in front of the propagating crack. The experimental results are in good agreement with the stress induced hydride embrittlement mechanism which is discussed. The thermodynamics of precipitation of hydrides under external stress is discussed and calculations are presented for the stress effects on the α-β solvus temperatures. These are related to the embrittlement process and evidence is presented to support the calculated stress effects on the solvus temperature

FY 1998 report on the waste processing/recycling related technology, 'The R and D of lead-free solder standardization'; 1998 nendo haikibutsu shori recycle kanren gijutsu seika hokokusho. Namari free handa kikakuka nado kenkyu kaihatsu

Energy Technology Data Exchange (ETDEWEB)

NONE

2000-03-01

To reduce the environmental pollution caused by lead eluted from the electronic equipment waste, the R and D on lead-free solder were conducted and the results were summarized. As to the basic characteristics, the evaluation test method was studied in terms of the range of melting temperature, mechanical strength, wettability and joint strength, to select a uniform test method. As the lead-free solder, Sn-Ag alloys were mainly used and mixed in a combination of Cu, Bi and In. Changes in characteristics were made clear by adding trace elements such as Ge, Mn and P. Relating to the applied characteristics, in selection of solder materials, materials were selected for which evaluation of the commercialization is proceeded with from a viewpoint of promotion of commercialization. Concerning the experimental evaluation of characteristics of lead-free solder in mounted substrates, it was indicated that basically lead-free solder can be practically used. Further, it was indicated that the Sn-Ag-Cu-Bi system depends not on solder composition but on active force, printing accuracy and flux characteristic of solder paste, that improvement of solder paste has an effect on mounting characteristics. (NEDO)

A flip chip process based on electroplated solder bumps

Science.gov (United States)

Salonen, J.; Salmi, J.

1994-01-01

Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

Re-examining reactor vessel embrittlement at Chooz A

International Nuclear Information System (INIS)

Guilleret, J.-C.

1988-01-01

The Chooz A PWR experienced an extended shutdown in 1987/88 following indications that the reactor vessel was embrittling more rapidly than expected. Discrepancies between the expected rate and estimates of the actual rate were not easily explained. The huge body of work done since then to establish safety margins and support restart of the plant should provide a model for the owners of other older PWRs grappling with the embrittlement issue. (author)

Properties and Microstructures of Sn-Bi-X Lead-Free Solders

Directory of Open Access Journals (Sweden)

Fan Yang

2016-01-01

Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

Physical properties of lead free solders in liquid and solid state

Energy Technology Data Exchange (ETDEWEB)

Mhiaoui, Souad

2007-04-17

The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

National Research Council Canada - National Science Library

Reuse, Rolando

2005-01-01

.... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

Power Reactor Embrittlement Data Base

International Nuclear Information System (INIS)

Kam, F.B.K.; Stallmann, F.W.; Wang, J.A.

1990-01-01

Regulatory and research evaluations of embrittlement predication models and of pressure vessel integrity can be greatly expedited by the use of a well-designed, computerized data base. The Power Reactor Embrittlement Data Base (PR-EDB) is such a comprehensive collection of data for US commercial nuclear reactors. The Nuclear Regulatory Commission (NRC) has provided financial support, and the Electric Power Research Institute (EPRI) has provided technical assistance in the quality assurance (QA) of the data to establish an industry-wide data base that will be maintained and updated on a long-term basis. Successful applications of the data base to several of NRC's evaluations have received favorable response and support for its continuation. The future direction of the data base has been designed to include the test reactor and other types of data of interest to the regulators and the researchers. 1 ref

PR-EDB: Power Reactor Embrittlement Database Version 3

International Nuclear Information System (INIS)

Wang, Jy-An John; Subramani, Ranjit

2008-01-01

The aging and degradation of light-water reactor pressure vessels is of particular concern because of their relevance to plant integrity and the magnitude of the expected irradiation embrittlement. The radiation embrittlement of reactor pressure vessel materials depends on many factors, such as neutron fluence, flux, and energy spectrum, irradiation temperature, and preirradiation material history and chemical compositions. These factors must be considered to reliably predict pressure vessel embrittlement and to ensure the safe operation of the reactor. Large amounts of data from surveillance capsules are needed to develop a generally applicable damage prediction model that can be used for industry standards and regulatory guides. Furthermore, the investigations of regulatory issues such as vessel integrity over plant life, vessel failure, and sufficiency of current codes, Standard Review Plans (SRPs), and Guides for license renewal can be greatly expedited by the use of a well-designed computerized database. The Power Reactor Embrittlement Database (PR-EDB) is such a comprehensive collection of data for U.S. designed commercial nuclear reactors. The current version of the PR-EDB lists the test results of 104 heat-affected-zone (HAZ) materials, 115 weld materials, and 141 base materials, including 103 plates, 35 forgings, and 3 correlation monitor materials that were irradiated in 321 capsules from 106 commercial power reactors. The data files are given in dBASE format and can be accessed with any personal computer using the Windows operating system. 'User-friendly' utility programs have been written to investigate radiation embrittlement using this database. Utility programs allow the user to retrieve, select and manipulate specific data, display data to the screen or printer, and fit and plot Charpy impact data. The PR-EDB Version 3.0 upgrades Version 2.0. The package was developed based on the Microsoft .NET framework technology and uses Microsoft Access for

PR-EDB: Power Reactor Embrittlement Database - Version 3

Energy Technology Data Exchange (ETDEWEB)

Wang, Jy-An John [ORNL; Subramani, Ranjit [ORNL

2008-03-01

The aging and degradation of light-water reactor pressure vessels is of particular concern because of their relevance to plant integrity and the magnitude of the expected irradiation embrittlement. The radiation embrittlement of reactor pressure vessel materials depends on many factors, such as neutron fluence, flux, and energy spectrum, irradiation temperature, and preirradiation material history and chemical compositions. These factors must be considered to reliably predict pressure vessel embrittlement and to ensure the safe operation of the reactor. Large amounts of data from surveillance capsules are needed to develop a generally applicable damage prediction model that can be used for industry standards and regulatory guides. Furthermore, the investigations of regulatory issues such as vessel integrity over plant life, vessel failure, and sufficiency of current codes, Standard Review Plans (SRPs), and Guides for license renewal can be greatly expedited by the use of a well-designed computerized database. The Power Reactor Embrittlement Database (PR-EDB) is such a comprehensive collection of data for U.S. designed commercial nuclear reactors. The current version of the PR-EDB lists the test results of 104 heat-affected-zone (HAZ) materials, 115 weld materials, and 141 base materials, including 103 plates, 35 forgings, and 3 correlation monitor materials that were irradiated in 321 capsules from 106 commercial power reactors. The data files are given in dBASE format and can be accessed with any personal computer using the Windows operating system. "User-friendly" utility programs have been written to investigate radiation embrittlement using this database. Utility programs allow the user to retrieve, select and manipulate specific data, display data to the screen or printer, and fit and plot Charpy impact data. The PR-EDB Version 3.0 upgrades Version 2.0. The package was developed based on the Microsoft .NET framework technology and uses Microsoft Access for

Advance of investigation of irradiation embrittlement mechanism of nuclear reactor pressure vessel steels. History and future of irradiation embrittlement researches

International Nuclear Information System (INIS)

Ishino, Shiori

2007-01-01

The nuclear reactor pressure vessel is the most important component of LWR plants required to be safe. This paper describes contents of the title consisting of four chapters. The first chapter states the general theory of irradiation effects, irradiation embrittlement and decreasing of toughness, and some kinds of pressure vessel steels. The second chapter explains history of irradiation embrittlement investigations and the advance of research methods for experiments and calculation. The third chapter contains information of inner structure of irradiated materials and development of prediction equations, recent information of embrittlement mechanism and mechanism guided prediction method, USA model and Central Research Institute of Electric Power Industry (CRIEPI) model. The fourth chapter states recent problems from viewpoints of experimental and analytical approaches. Comparison of standards of LWR pressure vessel steels between Japan and USA, relation between the density of number of cluster and the copper content, effect of flux on clustering of copper atoms, and CRIEPI's way of approaching the prediction method are illustrated. (S.Y.)

An internal-friction study of reactor-pressure-vessel steel embrittlement

International Nuclear Information System (INIS)

Ouytsel, K. van; Fabry, A.; Batist, R. de; Schaller, R.

1997-01-01

Within an enhanced commercial surveillance strategy, the nuclear-research institute SCK.CEN in Mol, Belgium is investigating, by means of internal friction, the microstructural processes responsible for embrittlement of pressure-vessel steels. The experiments were carried out using a torsion pendulum at the Ecole Polytechnique Federale de Lausanne in Switzerland. Amplitude-independent internal-friction experiments teach us that neutron irradiation induces defects which interact with mobile dislocations. Thermal ageing of JRQ and Doel-IV steel does not cause major embrittlement effects. Amplitude-dependent internal-friction experiments allow us to determine a critical amplitude which corresponds to the yield stress of the material as obtained from static tensile tests. The results also correspond to a three-component model for the yield strength taking into account both hardening and non-hardening embrittlement. Investigations of Doel-I-II weld material in different conditions reveal that embrittlement due to irradiation or thermal ageing can be interpreted in terms of a fine interplay between long- and short-range phenomena. (author)

Tensile strength of two soldered alloys (Minalux and Verabond2

Directory of Open Access Journals (Sweden)

Mir Mohammad Rezaee S

2002-07-01

Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

Grain boundary embrittlement and cohesion enhancement in copper

Energy Technology Data Exchange (ETDEWEB)

Paxton, Anthony; Lozovoi, Alexander [Atomistic Simulation Centre, Queen' s University Belfast, BT7 1NN (United Kingdom); Schweinfest, Rainer [Science+Computing ag, Hagellocher Weg 71-5, 720270 T ubingen (Germany); Finnis, Michael [Imperial College London, Exhibition Road, London SW7 2AZ (United Kingdom)

2008-07-01

There has been a long standing debate surrounding the mechanism of grain boundary embrittlement and cohesion enhancement in metals. Embrittlement can lead to catastrophic failure such as happened in the Hinkley Point disaster, or indeed in the case of the Titanic. This kind of embrittlement is caused by segregation of low solubility impurities to grain boundaries. While the accepted wisdom is that this is a phenomenon driven by electronic or chemical factors, using language such as charge transfer and electronegativity difference; we believe that in copper, at least, both cohesion enhancement and reduction are caused by a simple size effect. We have developed a theory that allows us to separate unambiguously, if not uniquely, chemical and structural factors. We have studied a large number of solutes in copper using first principles atomistic simulation to support this argument, and the results of these calculations are presented here.

Assessment of potential solder candidates for high temperature applications

DEFF Research Database (Denmark)

pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

Different approaches to estimation of reactor pressure vessel material embrittlement

Directory of Open Access Journals (Sweden)

V. M. Revka

2013-03-01

Full Text Available The surveillance test data for the nuclear power plant which is under operation in Ukraine have been used to estimate WWER-1000 reactor pressure vessel (RPV material embrittlement. The beltline materials (base and weld metal were characterized using Charpy impact and fracture toughness test methods. The fracture toughness test data were analyzed according to the standard ASTM 1921-05. The pre-cracked Charpy specimens were tested to estimate a shift of reference temperature T0 due to neutron irradiation. The maximum shift of reference temperature T0 is 84 °C. A radiation embrittlement rate AF for the RPV material was estimated using fracture toughness test data. In addition the AF factor based on the Charpy curve shift (ΔTF has been evaluated. A comparison of the AF values estimated according to different approaches has shown there is a good agreement between the radiation shift of Charpy impact and fracture toughness curves for weld metal with high nickel content (1,88 % wt. Therefore Charpy impact test data can be successfully applied to estimate the fracture toughness curve shift and therefore embrittlement rate. Furthermore it was revealed that radiation embrittlement rate for weld metal is higher than predicted by a design relationship. The enhanced embrittlement is most probably related to simultaneously high nickel and high manganese content in weld metal.

Influence of pre-hydriding on embrittlement of E110 alloy under LOCA conditions

International Nuclear Information System (INIS)

VNIINM, Moscow (Russian Federation))" data-affiliation=" (SC VNIINM, Moscow (Russian Federation))" >Fedotov, P.; VNIINM, Moscow (Russian Federation))" data-affiliation=" (SC VNIINM, Moscow (Russian Federation))" >Kuznetsov, V.; VNIINM, Moscow (Russian Federation))" data-affiliation=" (SC VNIINM, Moscow (Russian Federation))" >Nechaeva, O.; VNIINM, Moscow (Russian Federation))" data-affiliation=" (SC VNIINM, Moscow (Russian Federation))" >Novikov, V.; VNIINM, Moscow (Russian Federation))" data-affiliation=" (SC VNIINM, Moscow (Russian Federation))" >Salatov, A.; Ignatiev, D.; Mokrushin, A.; Soldatkin, D.; Urusov, A.

2015-01-01

The researches presented in this paper were carried out in the framework of TVS-K project developed by JSC “TVEL”. The data on the corrosion and residual ductility of unirradiated and pre-hydrided E110 alloy under LACA conditions at temperature range from 1100 to 1200°C are presented. The hydrogen concentration was varied from 30 (as-received) to 600 wppm. The initial concentration of hydrogen has no effect on the oxidation kinetics, while the oxidation kinetics are parabolic and the breakaway oxidation is not observed. Oxide films on surfaces of claddings are black and shining. There are no cracks, visual spots and peelings. The residual ductility of oxidised samples decrease with hydrogen concentration rise. The residual ductility of claddings oxidized at 1100 °C, generally higher than the same of the claddings oxidized at 1200 °C. E110 alloy has a good residual ductility in comparison to Zry-4, ZIRLO, M5. Joint analysis of the test results allowed us to formulate embrittlement criteria of the E110 alloy under LOCA conditions. This embrittlement criterion is preliminary, because the experimental data base must to be enlarged by results of tests with claddings of another geometry and quench experiments. (author)

Nano-soldering of magnetically aligned three-dimensional nanowire networks

International Nuclear Information System (INIS)

Gao Fan; Gu Zhiyong

2010-01-01

It is extremely challenging to fabricate 3D integrated nanostructures and hybrid nanoelectronic devices. In this paper, we report a simple and efficient method to simultaneously assemble and solder nanowires into ordered 3D and electrically conductive nanowire networks. Nano-solders such as tin were fabricated onto both ends of multi-segmented nanowires by a template-assisted electrodeposition method. These nanowires were then self-assembled and soldered into large-scale 3D network structures by magnetic field assisted assembly in a liquid medium with a high boiling point. The formation of junctions/interconnects between the nanowires and the scale of the assembly were dependent on the solder reflow temperature and the strength of the magnetic field. The size of the assembled nanowire networks ranged from tens of microns to millimeters. The electrical characteristics of the 3D nanowire networks were measured by regular current-voltage (I-V) measurements using a probe station with micropositioners. Nano-solders, when combined with assembling techniques, can be used to efficiently connect and join nanowires with low contact resistance, which are very well suited for sensor integration as well as nanoelectronic device fabrication.

A Hodge dual for soldered bundles

International Nuclear Information System (INIS)

Lucas, Tiago Gribl; Pereira, J G

2009-01-01

In order to account for all possible contractions allowed by the presence of the solder form, a generalized Hodge dual is defined for the case of soldered bundles. Although for curvature the generalized dual coincides with the usual one, for torsion it gives a completely new dual definition. Starting from the standard form of a gauge Lagrangian for the translation group, the generalized Hodge dual yields precisely the Lagrangian of the teleparallel equivalent of general relativity, and consequently also the Einstein-Hilbert Lagrangian of general relativity

Hydrogen embrittlement susceptibility of laser-hardened 4140 steel

Energy Technology Data Exchange (ETDEWEB)

Tsay, L.W.; Lin, Z.W. [Nat. Taiwan Ocean Univ., Keelung (Taiwan). Inst. of Mater. Eng.; Shiue, R.K. [Institute of Materials Sciences and Engineering, National Dong Hwa University, Hualien, Taiwan (Taiwan); Chen, C. [Institute of Materials Sciences and Engineering, National Taiwan University, Taipei, Taiwan (Taiwan)

2000-10-15

Slow strain rate tensile (SSRT) tests were performed to investigate the susceptibility to hydrogen embrittlement of laser-hardened AISI 4140 specimens in air, gaseous hydrogen and saturated H{sub 2}S solution. Experimental results indicated that round bar specimens with two parallel hardened bands on opposite sides along the loading axis (i.e. the PH specimens), exhibited a huge reduction in tensile ductility for all test environments. While circular-hardened (CH) specimens with 1 mm hardened depth and 6 mm wide within the gauge length were resistant to gaseous hydrogen embrittlement. However, fully hardened CH specimens became susceptible to hydrogen embrittlement for testing in air at a lower strain rate. The strength of CH specimens increased with decreasing the depth of hardened zones in a saturated H{sub 2}S solution. The premature failure of hardened zones in a susceptible environment caused the formation of brittle intergranular fracture and the decrease in tensile ductility. (orig.)

Influence of a cyclic load on the embrittlement kinetics of alloys by the example of the 475 C embrittlement of duplex steel and the dynamic embrittlement of a nickel base alloy; Einfluss einer zyklischen Belastung auf die Versproedungskinetik von Legierungen am Beispiel der 475 C-Versproedung von Duplexstahl und der dynamischen Versproedung einer Nickelbasislegierung

Energy Technology Data Exchange (ETDEWEB)

Wackermann, Ken

2015-07-07

The objective of this study was to investigate the dependence of high temperature embrittlement mechanisms on high temperature fatigue and vice versa. As model embrittlement mechanisms the 475 C Embrittlement of ferritic austenitic duplex stainless steel (1.4462) and the Dynamic Embrittlement of nickel-based superalloys (IN718) were selected. The 475 C Embrittlement is a thermally activated decomposition of the ferritic phase which hardens the material. In contrast to this a cyclic plastic deformation weakens the steel by a deformation-induced dissolution of the decomposition. Fatigue tests with different frequencies, loading amplitudes at room temperature and at 475 C with Duplex Stainless Steel in different states of embrittlement show that the ongoing 475 C Embrittlement and the deformation-induced dissolution are competing mechanisms. It depends on the frequency, the loading amplitude and the temperature which mechanism is dominant. Applying the model of the yield stress distribution function to the hysteresis branches of the fatigue tests allows an analysis of the fatigue behaviour of each phase individually. This analysis shows that the global fatigue behaviour for the test conditions applied in this study is mainly controlled by the ferritic phase. According to the existing understanding of Dynamic Embrittlement it is an oxygen grain boundary diffusion arising by tensile stress at elevated temperatures with the result of a fast intercrystalline crack propagation. In reference tests under vacuum conditions without oxygen grain boundary diffusion, a slow transcrystalline fracture appears. To analyse the Dynamic Embrittlement, the crack propagation was tested at 650 C with different frequencies and superimposed hold times in the fatigue cycle at maximum stress. The results shows that the existing model of Dynamic Embrittlement needs to be adapted to the effects of cyclic plastic deformation. In hold times, the oxygen grain boundary diffusion in front of the

Dye-enhanced protein solders and patches in laser-assisted tissue welding.

Science.gov (United States)

Small, W; Heredia, N J; Maitland, D J; Da Silva, L B; Matthews, D L

1997-01-01

This study examines the use of dye-enhanced protein bonding agents in 805 nm diode laser-assisted tissue welding. A comparison of an albumin liquid solder and collagen solid-matrix patches used to repair arteriotomies in an in vitro porcine model is presented. Extrinsic bonding media in the form of solders and patches have been used to enhance the practice of laser tissue welding. Preferential absorption of the laser wavelength has been achieved by the incorporation of chromophores. Both the solder and the patch included indocyanine green dye (ICG) to absorb the 805 nm continuous-wave diode laser light used to perform the welds. Solder-mediated welds were divided into two groups (high power/short exposure and low power/long exposure), and the patches were divided into three thickness groups ranging from 0.1 to 1.3 mm. The power used to activate the patches was constant, but the exposure time was increased with patch thickness. Burst pressure results indicated that solder-mediated and patched welds yielded similar average burst strengths in most cases, but the patches provided a higher success rate (i.e., more often exceeded 150 mmHg) and were more consistent (i.e., smaller standard deviation) than the solder. The strongest welds were obtained using 1.0-1.3 mm thick patches, while the high power/short exposure solder group was the weakest. Though the solder and patches yielded similar acute weld strengths, the solid-matrix patches facilitated the welding process and provided consistently strong welds. The material properties of the extrinsic agents influenced their performance.

Drinking Water Contamination Due To Lead-based Solder

Science.gov (United States)

Garcia, N.; Bartelt, E.; Cuff, K. E.

2004-12-01

The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

Multi-scale modeling of elasto-plastic response of SnAgCu lead-free solder alloys at different ageing conditions: Effect of microstructure evolution, particle size effects and interfacial failure

Energy Technology Data Exchange (ETDEWEB)

Maleki, Milad; Cugnoni, Joel, E-mail: joel.cugnoni@epfl.ch; Botsis, John

2016-04-20

In microelectronics applications, SnAgCu lead-free solder joints play the important role of ensuring both the mechanical and electrical integrity of the components. In such applications, the SnAgCu joints are subjected to elevated homologous temperatures for an extended period of time causing significant microstructural changes and leading to reliability issues. In this study, the link between the change in microstructures and deformation behavior of SnAgCu solder during ageing is explained by developing a hybrid multi-scale microstructure-based modeling approach. Herein, the SnAgCu solder alloy is seen as a three phase metal matrix composite in which Ag{sub 3}Sn and Cu{sub 6}Sn{sub 5} hard intermetallics play the role of reinforcements and Sn the role of a ductile matrix. The hardening of the Sn matrix due to fine intermetallics in the eutectic mixture is modeled by incorporating the mean field effects of geometrically necessary dislocations. Subsequently, a two level homogenization procedure based on micromechanical finite element (FE) models is used to capture the interactions between the different phases. For this purpose, tomographic images of microstructures obtained by Focused Ion Beam (FIB) and synchrotron X-Ray in different ageing conditions are directly used to generate statistically representative volume elements (RVE) using 3D FE models. The constitutive behavior of the solder is determined by sequentially performing two scales of numerical homogenization at the eutectic level and then at the dendrite level. For simplification, the anisotropy of Sn as well as the potential recovery processes have been neglected in the modeling. The observed decrease in the yield strength of solder due to ageing is well captured by the adopted modeling strategy and allows explaining the different ageing mechanisms. Finally, the effects of potential debonding at the intermetallic particle-matrix interface as well as particle fracture on the overall strength of solder are

Horizon shells and BMS-like soldering transformations

Energy Technology Data Exchange (ETDEWEB)

Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

2016-03-07

We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

Reactor pressure vessel embrittlement of NPP borssele: Design lifetime and lifetime extension

International Nuclear Information System (INIS)

Blom, F.J.

2007-01-01

Embrittlement of the reactor pressure vessel of the Borssele nuclear power plant has been investigated taking account of the design lifetime of 40 years and considering 20 years subsequent lifetime extension. The paper presents the current licensing status based on considerations of material test data and of US nuclear regulatory standards. Embrittlement status is also evaluated against German and French nuclear safety standards. Results from previous fracture toughness and Charpy tests are investigated by means of the Master curve toughness transition approach. Finally, state of the art insights are investigated by means of literature research. Regarding the embrittlement status of the reactor pressure vessel of Borssele nuclear power plant it is concluded that there is a profound basis for the current license up to the original end of the design life in 2013. The embrittlement temperature changes only slightly with respect to the acceptance criterion adopted postulating further operation up to 2033. Continued safe operation and further lifetime extension are therefore not restricted by reactor pressure vessel embrittlement

Effects of soldering methods on tensile strength of a gold-palladium metal ceramic alloy.

Science.gov (United States)

Ghadhanfari, Husain A; Khajah, Hasan M; Monaco, Edward A; Kim, Hyeongil

2014-10-01

The tensile strength obtained by conventional postceramic application soldering and laser postceramic welding may require more energy than microwave postceramic soldering, which could provide similar tensile strength values. The purpose of the study was to compare the tensile strength obtained by microwave postceramic soldering, conventional postceramic soldering, and laser postceramic welding. A gold-palladium metal ceramic alloy and gold-based solder were used in this study. Twenty-seven wax specimens were cast in gold-palladium noble metal and divided into 4 groups: laser welding with a specific postfiller noble metal, microwave soldering with a postceramic solder, conventional soldering with the same postceramic solder used in the microwave soldering group, and a nonsectioned control group. All the specimens were heat treated to simulate a normal porcelain sintering sequence. An Instron Universal Testing Machine was used to measure the tensile strength for the 4 groups. The means were analyzed statistically with 1-way ANOVA. The surface and fracture sites of the specimens were subjectively evaluated for fracture type and porosities by using a scanning electron microscope. The mean (standard deviation) ultimate tensile strength values were as follows: nonsectioned control 818 ±30 MPa, microwave 516 ±34 MPa, conventional 454 ±37 MPa, and laser weld 191 ±39 MPa. A 1-way ANOVA showed a significant difference in ultimate tensile strength among the groups (F3,23=334.5; Ptensile strength for gold and palladium noble metals than either conventional soldering or laser welding. Conventional soldering resulted in a higher tensile strength than laser welding. Under the experimental conditions described, either microwave or conventional postceramic soldering would appear to satisfy clinical requirements related to tensile strength. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

Directory of Open Access Journals (Sweden)

Yee Mei Leong

2016-06-01

Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

Science.gov (United States)

Leong, Yee Mei; Haseeb, A.S.M.A.

2016-01-01

Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

Models for embrittlement recovery due to annealing of reactor pressure vessel steels

International Nuclear Information System (INIS)

Eason, E.D.; Wright, J.E.; Nelson, E.E.; Odette, G.R.; Mader, E.V.

1995-05-01

The reactor pressure vessel (RPV) surrounding the core of a commercial nuclear power plant is subject to embrittlement due to exposure to high energy neutrons. The effects of irradiation embrittlement can be reduced by thermal annealing at temperatures higher than the normal operating conditions. However, a means of quantitatively assessing the effectiveness of annealing for embrittlement recovery is needed. The objective of this work was to analyze the pertinent data on this issue and develop quantitative models for estimating the recovery in 30 ft-lb (41 J) Charpy transition temperature and Charpy upper shelf energy due to annealing. Data were gathered from the Test Reactor Embrittlement Data Base and from various annealing reports. An analysis data base was developed, reviewed for completeness and accuracy, and documented as part of this work. Independent variables considered in the analysis included material chemistries, annealing time and temperature, irradiation time and temperature, fluence, and flux. To identify important variables and functional forms for predicting embrittlement recovery, advanced statistical techniques, including pattern recognition and transformation analysis, were applied together with current understanding of the mechanisms governing embrittlement and recovery. Models were calibrated using multivariable surface-fitting techniques. Several iterations of model calibration, evaluation with respect to mechanistic and statistical considerations, and comparison with the trends in hardness data produced correlation models for estimating Charpy upper shelf energy and transition temperature after irradiation and annealing. This work provides a clear demonstration that (1) microhardness recovery is generally a very good surrogate for shift recovery, and (2) there is a high level of consistency between the observed annealing trends and fundamental models of embrittlement and recovery processes

Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

International Nuclear Information System (INIS)

Chellvarajoo, Srivalli; Abdullah, M.Z.; Samsudin, Z.

2015-01-01

Highlights: • Fe 2 NiO 4 nanoparticles added into SAC 305 by mechanical mixing to form nanocomposite solder paste. • Nanoparticles in the composite solder travels with flux to the outermost surface after reflow. • The intermetallics compound reduced with the addition of nanoparticles into solder paste. • The hardness increased with the addition of limited percentage of nanoparticles into SAC 305. - Abstract: This study investigates the effects of the addition of Fe 2 NiO 4 nanoparticles into a SAC-305 lead-free solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper ‘sandwich’ method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5 wt.% of Fe 2 NiO 4 nanoparticles, respectively. If the addition of Fe 2 NiO 4 nanoparticle exceeded 1.5 wt.%, the hardness increased infinitely

An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates

International Nuclear Information System (INIS)

Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

2008-01-01

The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in

An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates.

Energy Technology Data Exchange (ETDEWEB)

Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

2008-09-01

The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in

The metallurgical approach on the solder voids behaviour in surface mount devices

International Nuclear Information System (INIS)

Mohabattul Zaman Bukhari

1996-01-01

Solder voids are believed to cause poor heat dissiption in the Surface Mount devices and reduce the reliability of the devices at higher operating services. There are a lot of factors involved in creating voids such as gas/flux entrapment, wettability, outgasseous, air bubbles in the solder paste, inconsistency of solder coverage and improper metal scheme selection. This study was done to observe the behaviour of the solder voids in term of flux entrapmentt and wettability. It is believed that flux entrapment and wettability are verify this hypothesis. Two types of metal scheme were chosen which are Nickel (Ni) plated and Tin (Sn) plated heatsink. X-ray techniques such as Radiographic Inspection Analysis and EDAX were used to detect the minute solder voids. The solder voids observed on the heatsinks and Copper shims after the reflow process are believed to be a non contact voids that resulted from some portion of the surface not wetting properly

Study on prediction model of irradiation embrittlement for reactor pressure vessel steel

International Nuclear Information System (INIS)

Wang Rongshan; Xu Chaoliang; Huang Ping; Liu Xiangbing; Ren Ai; Chen Jun; Li Chengliang

2014-01-01

The study on prediction model of irradiation embrittlement for reactor pres- sure vessel (RPV) steel is an important method for long term operation. According to the deep analysis of the previous prediction models developed worldwide, the drawbacks of these models were given and a new irradiation embrittlement prediction model PMIE-2012 was developed. A corresponding reliability assessment was carried out by irradiation surveillance data. The assessment results show that the PMIE-2012 have a high reliability and accuracy on irradiation embrittlement prediction. (authors)

Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

Energy Technology Data Exchange (ETDEWEB)

Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others

1995-06-01

The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

Laser Soldering of Rat Skin Using a Controlled Feedback System

Directory of Open Access Journals (Sweden)

Mohammad Sadegh Nourbakhsh

2009-03-01

Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

The low-temperature aging embrittlement in a 2205 duplex stainless steel

International Nuclear Information System (INIS)

Weng, K.L.; Chen, H.R.; Yang, J.R.

2004-01-01

The effect of isothermal treatment (at temperatures ranging between 400 and 500 deg. C) on the embrittlement of a 2205 duplex stainless steel (with 45 ferrite-55 austenite, vol.%) has been investigated. The impact toughness and hardness of the aged specimens were measured, while the corresponding fractography was studied. The results show that the steel is susceptible to severe embrittlement when exposed at 475 deg. C; this aging embrittlement is analogous with that of the ferritic stainless steels, which is ascribed to the degenerated ferrite phase. High-resolution transmission electron microscopy reveals that an isotropic spinodal decomposition occurred during aging at 475 deg. C in the steel studied; the original δ-ferrite decomposed into a nanometer-scaled modulated structure with a complex interconnected network, which contained an iron-rich BCC phase (α) and a chromium-enriched BCC phase (α'). It is suggested that the locking of dislocations in the modulated structure leads to the severe embrittlement

Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

Science.gov (United States)

Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

2015-12-01

Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

Complications with computer-aided designed/computer-assisted manufactured titanium and soldered gold bars for mandibular implant-overdentures: short-term observations.

Science.gov (United States)

Katsoulis, Joannis; Wälchli, Julia; Kobel, Simone; Gholami, Hadi; Mericske-Stern, Regina

2015-01-01

Implant-overdentures supported by rigid bars provide stability in the edentulous atrophic mandible. However, fractures of solder joints and matrices, and loosening of screws and matrices were observed with soldered gold bars (G-bars). Computer-aided designed/computer-assisted manufactured (CAD/CAM) titanium bars (Ti-bars) may reduce technical complications due to enhanced material quality. To compare prosthetic-technical maintenance service of mandibular implant-overdentures supported by CAD/CAM Ti-bar and soldered G-bar. Edentulous patients were consecutively admitted for implant-prosthodontic treatment with a maxillary complete denture and a mandibular implant-overdenture connected to a rigid G-bar or Ti-bar. Maintenance service and problems with the implant-retention device complex and the prosthesis were recorded during minimally 3-4 years. Annual peri-implant crestal bone level changes (ΔBIC) were radiographically assessed. Data of 213 edentulous patients (mean age 68 ± 10 years), who had received a total of 477 tapered implants, were available. Ti-bar and G-bar comprised 101 and 112 patients with 231 and 246 implants, respectively. Ti-bar mostly exhibited distal bar extensions (96%) compared to 34% of G-bar (p overdentures supported by soldered gold bars or milled CAD/CAM Ti-bars are a successful treatment modality but require regular maintenance service. These short-term observations support the hypothesis that CAD/CAM Ti-bars reduce technical complications. Fracture location indicated that the titanium thickness around the screw-access hole should be increased. © 2013 Wiley Periodicals, Inc.

Hydrogen embrittlement due to hydrogen-inclusion interactions

International Nuclear Information System (INIS)

Yu, H.Y.; Li, J.C.M.

1976-01-01

Plastic flow around inclusions creates elastic misfit which attracts hydrogen towards the regions of positive dilatation. Upon decohesion of the inclusion-matrix interface, the excess hydrogen escapes into the void and can produce sufficient pressure to cause void growth by plastic deformation. This mechanism of hydrogen embrittlement can be used to understand the increase of ductility with temperature, the decrease of ductility with hydrogen content, and the increase of ductility with the ultimate strength of the matrix. An examination of the effect of the shape of spheroid inclusion reveals that rods are more susceptible to hydrogen embrittlement than disks. The size of the inclusion is unimportant while the volume fraction of inclusions plays the usual role

Development of neutron irradiation embrittlement correlation of reactor pressure vessel materials of light water reactors

International Nuclear Information System (INIS)

Soneda, Naoki; Dohi, Kenji; Nomoto, Akiyoshi; Nishida, Kenji; Ishino, Shiori

2007-01-01

A large amount of surveillance data of the RPV embrittlement of the Japanese light water reactors have been compiled since the current Japanese embrittlement correlation has been issued in 1991. Understanding on the mechanisms of the embrittlement has also been greatly improved based on both experimental and theoretical studies. CRIEPI and the Japanese electric power utilities have started research project to develop a new embrittlement correlation method, where extensive study of the microstructural analyses of the surveillance specimens irradiated in the Japanese commercial reactors has been conducted. The new findings obtained from the experimental study are that the formation of solute-atom clusters with little or no copper is responsible for the embrittlement in low-copper materials, and that the flux effect exists especially in high-copper materials and this is supported by the difference in the microstructure of the high-copper materials irradiated at different fluxes. Based on these new findings, a new embrittlement correlation method is formulated using rate equations. The new methods has higher prediction capability than the current Japanese embrittlement correlation in terms of smaller standard deviation as well as smaller mean value of the prediction error. (author)

Lifetime embrittlement of reactor core materials

International Nuclear Information System (INIS)

Kreyns, P.H..; Bourgeois, W.F.; Charpentier, P.L.; Kammenzind, B.F.; Franklin, D.G.; White, C.J.

1994-08-01

Over a core lifetime, the reactor materials Zircaloy-2, Zircaloy-4, and hafnium may become embrittled due to the absorption of corrosion- generated hydrogen and to neutron irradiation damage. Results are presented on the effects of fast fluence on the fracture toughness of wrought Zircaloy-2, Zircaloy-4, and hafnium; Zircaloy-4 to hafnium butt welds; and hydrogen precharged beta treated and weld metal Zircaloy-4 for fluences up to a maximum of approximately 150 x 10 24 n/M 2 (> 1 Mev). While Zircaloy-4 did not exhibit a decrement in K IC due to irradiation, hafnium and butt welds between hafnium and Zircaloy-4 are susceptible to embrittlement with irradiation. The embrittlement can be attributed to irradiation strengthening, which promotes cleavage fracture in hafnium and hafnium-Zircaloy welds, and, in part, to the lower chemical potential of hydrogen in Zircaloy-4 compared to hafnium, which causes hydrogen, over time, to drift from the hafnium end toward the Zircaloy-4 end and to precipitate at the interface between the weld and base-metal interface. Neutron radiation apparently affects the fracture toughness of Zircaloy-2, Zircaloy-4, and hafnium in different ways. Possible explanations for these differences are suggested. It was found that Zircaloy-4 is preferred over Zircaloy-2 in hafnium-to- Zircaloy butt-weld applications due to its absence of a radiation- induced reduction in K IC plus its lower hydrogen absorption characteristics compared with Zircaloy-2

Neutron irradiation embrittlement of reactor pressure vessel steels

International Nuclear Information System (INIS)

Steele, L.E.

1975-01-01

The reliability of nuclear power plants depends on the proper functioning of complex components over the whole life on the plant. Particular concern for reliability is directed to the primary pressure boundary. This report focuses on the portion of the primary system exposed to and significantly affected by neutron radiation. Experimental evidence from research programmes and from reactor surveillance programmes has indicated radiation embrittlement of a magnitude sufficient to raise doubts about reactor pressure vessel integrity. The crucial nature of the primary vessel function heightens the need to be alert to this problem, to which, fortunately, there are positive aspects: for example, steels have been developed which are relatively immune to radiation embrittlement. Further, awareness of such embrittlement has led to designs which can accomodate this factor. The nature of nuclear reactors, of the steels used in their construction, and of the procedures for interpreting embrittlement and minimizing the effects are reviewed with reference to the reactors that are expected to play a major role in electric power production from now to about the turn of the century. The report is intended as a manual or guidebook; the aim has been to make each chapter or major sub-division sufficiently comprehensive and self-contained for it to be understood and read independently of the rest of the book. At the same time, it is hoped that the whole is unified enough to make a complete reading useful and interesting to the several classes of reader that are involved with only specific aspects of the topic

Survey of irradiation embrittlement effects on the mechanical properties of alloyed steels

International Nuclear Information System (INIS)

Gillemot, F.

1992-01-01

In the everyday engineering practice the neutron irradiation embrittlement of the PWR wall materials is measured by empirical methods like Charpy impact testing. New developments in fracture mechanics are given better material characteristics. The use of Absorbed Specific Fracture Energy Measured on tensile bars is a promising way to solve the problem. On the other hand the IAEA runs coordinated research program to correlate the chemical analysis with the rate of the neutron embrittlement. Better understanding of the physics of neutron embrittlement should help the life time management of the PWR vessels

Correlation methodology for predicting in-service irradiation embrittlement of reactor pressure vessels

International Nuclear Information System (INIS)

Odette, G.R.

1980-01-01

Irradiation embrittlement of reactor pressure steels is the consequence of altered microstructure due to both irradiation and time-at-temperature. Relatively poor characterisation of the initial microstructure and chemistry, and inaccurate dosimetry and temperature control, as well as failure properly to correlate these variables, have all contributed to a very large scatter in the experimental embrittlement data base. This has made improvement of the basic understanding of embrittlement very difficult. Therefore, it is necessary to develop a more realistic approach to utilising the data base. This is discussed, and proposals are made. (author)

Investigations of low-temperature neutron embrittlement of ferritic steels

International Nuclear Information System (INIS)

Farrell, K.; Mahmood, S.T.; Stoller, R.E.; Mansur, L.K.

1992-01-01

Investigations were made into reasons for accelerated embrittlement of surveillance specimens of ferritic steels irradiated at 50C at the High Flux Isotope Reactor (HFIR) pressure vessel. Major suspects for the precocious embrittlement were a highly thermalized neutron spectrum,a low displacement rate, and the impurities boron and copper. None of these were found guilty. A dosimetry measurement shows that the spectrum at a major surveillance site is not thermalized. A new model of matrix hardening due to point defect clusters indicates little effect of displacement rate at low irradiation temperature. Boron levels are measured at 1 wt ppM or less, inadequate for embrittlement. Copper at 0.3 wt % and nickel at 0.7 wt % are shown to promote radiation strengthening in iron binary alloys irradiated at 50 to 60C, but no dependence on copper and nickel was found in steels with 0.05 to 0.22% Cu and 0.07 to 3.3% Ni. It is argued that copper impurity is not responsible for the accelerated embrittlement of the HFIR surveillance specimens. The dosimetry experiment has revealed the possibility that the fast fluence for the surveillance specimens may be underestimated because the stainless steel monitors in the surveillance packages do not record an unexpected component of neutrons in the spectrum at energies just below their measurement thresholds of 2 to 3 MeV

Nanocrystalline Steels’ Resistance to Hydrogen Embrittlement

Directory of Open Access Journals (Sweden)

Skołek E.

2015-04-01

Full Text Available The aim of this study is to determine the susceptibility to hydrogen embrittlement in X37CrMoV5-1 steel with two different microstructures: a nanocrystalline carbide-free bainite and tempered martensite. The nanobainitic structure was obtained by austempering at the bainitic transformation zone. It was found, that after hydrogen charging, both kinds of microstructure exhibit increased yield strength and strong decrease in ductility. It has been however shown that the resistance to hydrogen embrittlement of X37CrMoV5-1 steel with nanobainitic structure is higher as compared to the tempered martensite. After hydrogen charging the ductility of austempered steel is slightly higher than in case of quenched and tempered (Q&T steel. This effect was interpreted as a result of phase composition formed after different heat treatments.

In vitro conjunctival incision repair by temperature-controlled laser soldering.

Science.gov (United States)

Norman, Galia; Rabi, Yaron; Assia, Ehud; Katzir, Abraham

2009-01-01

The common method of closing conjunctival incisions is by suturing, which is associated with several disadvantages. It requires skill to apply and does not always provide a watertight closure, which is required in some operations (e.g., glaucoma filtration). The purpose of the present study was to evaluate laser soldering as an alternative method for closing conjunctival incisions. Conjunctival incisions of 20 ex vivo porcine eyes were laser soldered using a temperature-controlled fiberoptic laser system and an albumin mixed with indocyanine green as a solder. The control group consisted of five repaired incisions by a 10-0 nylon running suture. The leak pressure of the repaired incisions was measured. The mean leak pressure in the laser-soldered group was 132 mm Hg compared to 4 mm Hg in the sutured group. There was no statistically significant difference in both the incision's length and distance from the limbus between the groups, before and after the procedure, indicating that there was no severe thermal damage. These preliminary results clearly demonstrate that laser soldering may be a useful method for achieving an immediate watertight conjunctival wound closure. This procedure is faster and easier to apply than suturing.

Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

International Nuclear Information System (INIS)

Durairaj, R.; Ramesh, S.; Mallik, S.; Seman, A.; Ekere, N.

2009-01-01

Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G') is higher than the liquid characteristic (G'') for the pastes material. In addition, the results from the study showed that the solder paste with a large G' = G'' has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (δ) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.

Corrosion Reliability of Lead-free Solder Systems Used in Electronics

DEFF Research Database (Denmark)

Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

2017-01-01

humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

Energy Technology Data Exchange (ETDEWEB)

Silva, Bismarck L., E-mail: bismarck_luiz@yahoo.com.br [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas, UNICAMP, 13083-860 Campinas, SP (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos, UFSCar, 13565-905 São Carlos, SP (Brazil)

2016-04-15

Low temperature soldering technology encompasses Sn–Bi based alloys as reference materials for joints since such alloys may be molten at temperatures less than 180 °C. Despite the relatively high strength of these alloys, segregation problems and low ductility are recognized as potential disadvantages. Thus, for low-temperature applications, Bi–Sn eutectic or near-eutectic compositions with or without additions of alloying elements are considered interesting possibilities. In this context, additions of third elements such as Cu and Ag may be an alternative in order to reach sounder solder joints. The length scale of the phases and their proportions are known to be the most important factors affecting the final wear, mechanical and corrosions properties of ternary Sn–Bi–(Cu,Ag) alloys. In spite of this promising outlook, studies emphasizing interrelations of microstructure features and solidification thermal parameters regarding these multicomponent alloys are rare in the literature. In the present investigation Sn–Bi–(Cu,Ag) alloys were directionally solidified (DS) under transient heat flow conditions. A complete characterization is performed including experimental cooling thermal parameters, segregation (XRF), optical and scanning electron microscopies, X-ray diffraction (XRD) and length scale of the microstructural phases. Experimental growth laws relating dendritic spacings to solidification thermal parameters have been proposed with emphasis on the effects of Ag and Cu. The theoretical predictions of the Rappaz-Boettinger model are shown to be slightly above the experimental scatter of secondary dendritic arm spacings for both ternary Sn–Bi–Cu and Sn–Bi–Ag alloys examined. - Highlights: • Dendritic growth prevailed for the ternary Sn–Bi–Cu and Sn–Bi–Ag solder alloys. • Bi precipitates within Sn-rich dendrites were shown to be unevenly distributed. • Morphology and preferential region for the Ag{sub 3}Sn growth depend on Ag

Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

National Research Council Canada - National Science Library

Chung, Kohn C

2006-01-01

.... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

Progress in identification of radiation embrittlement mechanisms

International Nuclear Information System (INIS)

Hawthorne, J.R.

1988-01-01

This report outlines recent advances in the isolation and understanding of mechanisms behind known composition influences on he radiation embrittlement sensitivity of reactor pressure vessel steels at 288 deg. C. The advances are largely the product of joint investigations by Materials Engineering Associates (MEA) and other laboratories in the U.S. and overseas under cooperative and subcontract arrangements. Specific objectives were: confirmation of the suspect Cu mechanism, identification of the process for the Cu:Ni synergism, and isolation of the P mechanism in radiation sensitivity development. The investigations proceeded with MEA-supplied steels and iron alloys from 4-way split laboratory melts; research tools included Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Field Ion Microscopy (FIM), Small Angle Neutron Scattering (SANS), Positron Annihilation (PA) and Auger Electron Spectroscopy (AES). Experimental results show that P and Cu enhance the radiation elevation of yield strength and that the associated mechanisms are a radiation-induced precipitation of P or Cu-rich clusters which impede dislocation motion. With high Cu alloys, a Cu phosphide is formed in preference to P precipitates and the P contribution is greatly reduced. Effects of postirradiation annealing and reirradiation are also reported. (author)

Embrittling effects of residual elements on steels

International Nuclear Information System (INIS)

Brear, J.M.; King, B.L.

1979-01-01

In a review of work related to reheat cracking in nuclear pressure vessel steels, Dhooge et al referred to work of the authors on the relative embrittling parameter for SA533B steels. The poor agreement when these parameters were applied to creep ductility data for SA508 class 2 lead the reviewers to conclude that the relative importance of impurity elements is a function of base alloy composition. The authors briefly describe some of their more recent work which demonstrates that when various mechanical, and other, effects are taken into consideration, the relative effects of the principal residual elements are similar, despite differing base compositions, and that the embrittling parameters derived correlate well with the data for SA Class 2 steel. (U.K.)

Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

Science.gov (United States)

Teverovsky, Alexander A.

2014-01-01

Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

Science.gov (United States)

This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

Severe embrittlement of neutron irradiated austenitic steels arising from high void swelling

Energy Technology Data Exchange (ETDEWEB)

Neustroev, V.S. [FSUE ' SSC RF Research Institute of Atomic Reactors' , Dimitrovgrad (Russian Federation)], E-mail: neustroev@niiar.ru; Garner, F.A. [Pacific Northwest National Laboratory, Richland, WA (United States)

2009-04-30

Data are presented from BOR-60 irradiations showing that significant radiation-induced swelling causes severe embrittlement in austenitic stainless steels, reducing the service life of structural components and introducing limitations on low temperature handling especially. It is shown that the degradation is actually a form of quasi-embrittlement arising from intense flow localization with high levels of localized ductility involving micropore coalescence and void-to-void cracking. Voids initially serve as hardening components whose effect is overwhelmed by the void-induced reduction in shear and Young's moduli at high swelling levels. Thus the alloy appears to soften even as the ductility plunges toward zero on a macroscopic level although a large amount of deformation occurs microscopically at the failure site. Thus the failure is better characterized as 'quasi-embrittlement' which is a suppression of uniform deformation. This case should be differentiated from that of real embrittlement which involves the complete suppression of the material's capability for plastic deformation.

Mercury embrittlement of Cu-Al alloys under cyclic loading

Science.gov (United States)

Regan, T. M.; Stoloff, N. S.

1977-01-01

The effect of mercury on the room temperature, high cycle fatigue properties of three alloys: Cu-5.5 pct Al, Cu-7.3 pct Al, and Cu-6.3 pct Al-2.5 pct Fe has been determined. Severe embrittlement under cyclic loading in mercury is associated with rapid crack propagation in the presence of the liquid metal. A pronounced grain size effect is noted under mercury, while fatigue properties in air are insensitive to grain size. The fatigue results are discussed in relation to theories of adsorption-induced liquid metal embrittlement.

A review on solder reflow and flux application for flip chip

Science.gov (United States)

Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Visvanathan, Susthitha Menon; Retnasamy, Vithyacharan

2017-09-01

This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

Irradiation embrittlement of reactor pressure vessel steels: Considerations for thermal annealing

International Nuclear Information System (INIS)

Burke, M.G.; Freyer, P.D.; Mager, T.R.

1993-01-01

In this paper, an overview of the irradiation embrittlement phenomenon is presented from a structure-properties viewpoint. Effects of irradiation conditions on embrittlement are first reviewed: irradiation temperature, fluence, flux, and steel or alloy composition. Then, the techniques for identifying/characterizing the irradiation-induced microstructural features are described: TEM/STEM (electron microscopy), small angle neutron scattering, atom probe field-ion microscopy, positron annihilation lifetime spectroscopy. Mechanisms of hardening and embrittlement generally consist of a ''precipitation-type'' and a ''damage-type'' component and the potential of annealing treatments for restoring the most of the original pressure vessel material toughness is examined; its conditions and mechanisms involved are discussed. Feasibility and economic evaluation of annealing costs is also carried out. 90 refs., 4 figs

Approach for estimating post-annual reirradiation embrittlement of reactor vessel steels

International Nuclear Information System (INIS)

Server, W.L.; Taboada, A.

1985-01-01

Thermal annealing of a commercial nuclear reactor pressure vessel is a possible solution for extending lifetime in situations where excessive radiation embrittlement has taken place or when the original design life is approached. Two difficult facets of thermal annealing are the degree of toughness recovery after annealing and the post-anneal reirradiation embrittlement behavior. These aspects of annealing are evaluated in this paper by using simple models and translation of the initial irradiation damage curve either vertically or laterally at the point of residual shift after annealing. Results using this methodology are compared to limited actual weld metal measurements of annealing behavior. A forthcoming ASTM Guide on in-place annealing uses this methodology to assess annealing recovery and re-embrittlement response

Irradiation embrittlement of reactor pressure vessel steels: Considerations for thermal annealing

Energy Technology Data Exchange (ETDEWEB)

Burke, M G; Freyer, P D; Mager, T R

1994-12-31

In this paper, an overview of the irradiation embrittlement phenomenon is presented from a structure-properties viewpoint. Effects of irradiation conditions on embrittlement are first reviewed: irradiation temperature, fluence, flux, and steel or alloy composition. Then, the techniques for identifying/characterizing the irradiation-induced microstructural features are described: TEM/STEM (electron microscopy), small angle neutron scattering, atom probe field-ion microscopy, positron annihilation lifetime spectroscopy. Mechanisms of hardening and embrittlement generally consist of a ``precipitation-type`` and a ``damage-type`` component and the potential of annealing treatments for restoring the most of the original pressure vessel material toughness is examined; its conditions and mechanisms involved are discussed. Feasibility and economic evaluation of annealing costs is also carried out. 90 refs., 4 figs.

Multiscale modelling and experimentation of hydrogen embrittlement in aerospace materials

Science.gov (United States)

Jothi, Sathiskumar

Pulse plated nickel and nickel based superalloys have been used extensively in the Ariane 5 space launcher engines. Large structural Ariane 5 space launcher engine components such as combustion chambers with complex microstructures have usually been manufactured using electrodeposited nickel with advanced pulse plating techniques with smaller parts made of nickel based superalloys joined or welded to the structure to fabricate Ariane 5 space launcher engines. One of the major challenges in manufacturing these space launcher components using newly developed materials is a fundamental understanding of how different materials and microstructures react with hydrogen during welding which can lead to hydrogen induced cracking. The main objective of this research has been to examine and interpret the effects of microstructure on hydrogen diffusion and hydrogen embrittlement in (i) nickel based superalloy 718, (ii) established and (iii) newly developed grades of pulse plated nickel used in the Ariane 5 space launcher engine combustion chamber. Also, the effect of microstructures on hydrogen induced hot and cold cracking and weldability of three different grades of pulse plated nickel were investigated. Multiscale modelling and experimental methods have been used throughout. The effect of microstructure on hydrogen embrittlement was explored using an original multiscale numerical model (exploiting synthetic and real microstructures) and a wide range of material characterization techniques including scanning electron microscopy, 2D and 3D electron back scattering diffraction, in-situ and ex-situ hydrogen charged slow strain rate tests, thermal spectroscopy analysis and the Varestraint weldability test. This research shows that combined multiscale modelling and experimentation is required for a fundamental understanding of microstructural effects in hydrogen embrittlement in these materials. Methods to control the susceptibility to hydrogen induced hot and cold cracking and

Automation of experimental research of waveguide paths induction soldering

Science.gov (United States)

Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

2018-05-01

The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

Optimization of the soldering process by the DMAIC methodology

Directory of Open Access Journals (Sweden)

Michał Zasadzień

2016-06-01

Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

Contamination profile on typical printed circuit board assemblies vs soldering process

DEFF Research Database (Denmark)

Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

Irradiation embrittlement of reactor vessel steels

International Nuclear Information System (INIS)

Bros, J.

2000-01-01

From the historical decision of closing the Yankee Rowe NPP because of the uncertainties on the level of reactor pressure vessel neutron embrittlement, this paper reviews the technical-scientist bases of the degradation phenomena, and refers to the evolution of reactor pressure vessel radiation surveillance programs. (Author)

Helium embrittlement model and program plan for weldability of ITER materials

International Nuclear Information System (INIS)

Louthan, M.R. Jr.; Kanne, W.R. Jr.; Tosten, M.H.; Rankin, D.T.; Cross, B.J.

1997-02-01

This report presents a refined model of how helium embrittles irradiated stainless steel during welding. The model was developed based on experimental observations drawn from experience at the Savannah River Site and from an extensive literature search. The model shows how helium content, stress, and temperature interact to produce embrittlement. The model takes into account defect structure, time, and gradients in stress, temperature and composition. The report also proposes an experimental program based on the refined helium embrittlement model. A parametric study of the effect of initial defect density on the resulting helium bubble distribution and weldability of tritium aged material is proposed to demonstrate the roll that defects play in embrittlement. This study should include samples charged using vastly different aging times to obtain equivalent helium contents. Additionally, studies to establish the minimal sample thickness and size are needed for extrapolation to real structural materials. The results of these studies should provide a technical basis for the use of tritium aged materials to predict the weldability of irradiated structures. Use of tritium charged and aged material would provide a cost effective approach to developing weld repair techniques for ITER components

Investigation of moisture-induced embrittlement of iron aluminides. Final report

Energy Technology Data Exchange (ETDEWEB)

Alven, D.A.; Stoloff, N.S. [Rensselaer Polytechnic Inst., Troy, NY (United States). Materials Engineering Dept.

1997-06-05

Iron-aluminum alloys with 28 at.% Al and 5 at.% Cr were shown to be susceptible to hydrogen embrittlement by exposure to both gaseous hydrogen and water vapor. This study examined the effect of the addition of zirconium and carbon on the moisture-induced hydrogen embrittlement of an Fe{sub 3}Al,Cr alloy through the evaluation of tensile properties and fatigue crack growth resistance in hydrogen gas and moisture-bearing air. Susceptibility to embrittlement was found to vary with the zirconium content while the carbon addition was found to only affect the fracture toughness. Inherent fatigue crack growth resistance and fracture toughness, as measured in an inert environment, was found to increase with the addition of 0.5 at.% Zr. The combined addition of 0.5 at.% Zr and carbon only increased the fracture toughness. The addition of 1 at.% Zr and carbon was found to have no effect on the crack growth rate when compared to the base alloy. Susceptibility to embrittlement in moisture-bearing environments was found to decrease with the addition of 0.5 at.% Zr. In gaseous hydrogen, the threshold value of the Zr-containing alloys was found to increase above that found in the inert environment while the crack growth resistance was much lower. By varying the frequency of fatigue loading, it was shown that the corrosion fatigue component of the fatigue crack growth rate in an embrittling environment displays a frequency dependence. Hydrogen transport in iron aluminides was shown to occur primarily by a dislocation-assisted transport mechanism. This mechanism, in conjunction with fractography, indicates that the zirconium-containing precipitates act as traps for the hydrogen that is carried along by the dislocations through the lattice.

Manipulation and soldering of carbon nanotubes using atomic force microscope

International Nuclear Information System (INIS)

Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

2008-01-01

Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

Microstructure and embrittlement of VVER 440 reactor pressure vessel steels

International Nuclear Information System (INIS)

Hennion, A.

1999-03-01

27 VVER 440 pressurised water reactors operate in former Soviet Union and in Eastern Europe. The pressure vessel, is made of Cr-Mo-V steel. It contains a circumferential arc weld in front of the nuclear core. This weld undergoes a high neutron flux and contains large amounts of copper and phosphorus, elements well known for their embrittlement potency under irradiation. The embrittlement kinetic of the steel is accelerated, reducing the lifetime of the reactor. In order to get informations on the microstructure and mechanical properties of these steels, base metals, HAZ, and weld metals have been characterized. The high amount of phosphorus in weld metals promotes the reverse temper embrittlement that occurs during post-weld heat treatment. The radiation damage structure has been identified by small angle neutron scattering, atomic probe, and transmission electron microscopy. Nanometer-sized clusters of solute atoms, rich in copper with almost the same characteristics as in western pressure vessels steels, and an evolution of the size distribution of vanadium carbides, which are present on dislocation structure, are observed. These defects disappear during post-irradiation tempering. As in western steels, the embrittlement is due to both hardening and reduction of interphase cohesion. The radiation damage specificity of VVER steels arises from their high amount of phosphorus and from their significant density of fine vanadium carbides. (author)

Status and task of the study on the hydrogen embrittlement of zirconium alloys

International Nuclear Information System (INIS)

Nagase, Fumihisa; Furuta, Teruo; Seino, Shun; Komatsu, Kazushi.

1995-08-01

As the burnup of the LWR fuel is extended, waterside corrosion and hydrogen pickup increase in the Zircaloy cladding. Hydrogen embrittlement of Zircaloy is one of the main factors which may limit the life of the fuel rod. This report presents a review on the hydrogen embrittlement of zirconium and its alloys including the irradiated materials. Research tasks for the reduction of ductility in the high burnup fuel cladding are also discussed. Many fundamental investigations have been performed on the hydrogen embrittlement of zirconium alloys. However, the embrittlement mechanism of the high burnup fuel cladding is complicated. Especially, a coupled effect of hydrides and radiation defects are expected to be pronounced with neutron dose increase. In order to evaluate the reduction of ductility of the higher burnup fuel cladding properly, it is necessary to investigate the coupled effect of these two factors by systematic examinations. (author) 64 refs

Embrittlement of nickel-, cobalt-, and iron-base superalloys by exposure to hydrogen

Science.gov (United States)

Gray, H. R.

1975-01-01

Five nickel-base alloys (Inconel 718, Udimet 700, Rene 41, Hastelloy X, and TD-NiCr), one cobalt-base alloy (L-605), and an iron-base alloy (A-286) were exposed in hydrogen at 0.1 MN/sq m (15 psi) at several temperatures in the range from 430 to 980 C for as long as 1000 hours. These alloys were embrittled to varying degrees by such exposures in hydrogen. Embrittlement was found to be: (1) sensitive to strain rate, (2) reversible, (3) caused by large concentrations of absorbed hydrogen, and (4) not associated with any detectable microstructural changes in the alloys. These observations are consistent with a mechanism of internal reversible hydrogen embrittlement.

Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

Czech Academy of Sciences Publication Activity Database

Kroupa, Aleš; Andersson, D.; Hoo, N.; Pearce, J.; Watson, A.; Dinsdale, A.; Mucklejohn, S.

2012-01-01

Roč. 21, č. 5 (2012), s. 629-637 ISSN 1059-9495 Institutional support: RVO:68081723 Keywords : lead-free soldering, * materials for high-temperature LF * new technologies for HT lead-free soldering Subject RIV: BJ - Thermodynamics Impact factor: 0.915, year: 2012

Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

Science.gov (United States)

Sorg, Brian S.; Welch, Ashley J.

2001-05-01

Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

Power reactor embrittlement data base (PR-EDB): Uses in evaluating radiation embrittlement of reactor vessels

International Nuclear Information System (INIS)

Kam, F.B.K.; Stallmann, F.W.; Wang, J.A.

1992-01-01

Investigations of regulatory issues such as vessel integrity over plant life, vessel failure, and sufficiency of current Codes, Standard Review Plans (SRPs), and Guides for license renewal can be greatly expedited by the use of a well-designed, computerized data base. Also, such a data is essential for the evaluation of embrittlement prediction models by researchers. The Power Reactor Embrittlement Data Base (PR-EDB) is such a comprehensive collection of data for US commercial nuclear reactors. The current compilation contains data from 92 reactors and consists of 175 data points for weld materials (79 different welds) and 395 data points for base materials (110 different base materials). The different types of data that are implemented or planned for this data base are discussed. ''User-friendly'' utility programs have been written to investigate a list of problems using this data base. The utility programs are also used to add and upgrade data, retrieve and select specific data, manipulate data, display data to the screen or printer, and to fit and plot Charpy impact data. The results of several studies investigated are presented in this paper

Effect of trapping and temperature on the hydrogen embrittlement susceptibility of alloy 718

Energy Technology Data Exchange (ETDEWEB)

Galliano, Florian; Andrieu, Eric; Blanc, Christine; Cloue, Jean-Marc; Connetable, Damien; Odemer, Gregory, E-mail: gregory.odemer@ensiacet.fr

2014-08-12

Ni-based alloy 718 is widely used to manufacture structural components in the aeronautic and nuclear industries. Numerous studies have shown that alloy 718 may be sensitive to hydrogen embrittlement. In the present study, the susceptibilities of three distinct metallurgical states of alloy 718 to hydrogen embrittlement were investigated to identify both the effect of hydrogen trapping on hydrogen embrittlement and the role of temperature in the hydrogen-trapping mechanism. Cathodic charging in a molten salt bath was used to saturate the different hydrogen traps of each metallurgical state. Tensile tests at different temperatures and different strain rates were carried out to study the effect of hydrogen on mechanical properties and failure modes, in combination with hydrogen content measurements. The results demonstrated that Ni-based superalloy 718 was strongly susceptible to hydrogen embrittlement between 25 °C and 300 °C, and highlighted the dominant roles played by the hydrogen solubility and the hydrogen trapping on mechanical behavior and fracture modes.

Long-term embrittlement of cast duplex stainless steels in LWR systems

International Nuclear Information System (INIS)

Chopra, O.K.; Chung, H.M.

1990-08-01

This progress report summarizes work performed by Argonne National Laboratory on long-term embrittlement of cast duplex stainless steels in LWR systems during the six months from April to September 1988. Characteristics of the primary mechanism of aging embrittlement (i.e., spinodal decomposition of ferrite) and synergistic effects of alloying and impurity elements that influence the kinetics of the primary mechanism are discussed. Several secondary metallurgical processes of embrittlement, strongly dependent on the C, N, Ni, Mo, and Si content of various heats, are identified. Information on kinetics and data on impact properties are analyzed and correlated with microstructural characteristics to provide a unified method of extrapolating accelerated-aging data to reactor operating conditions. Fracture toughness data are presented for several heats of cast stainless steel aged at temperatures between 320 and 450 degrees C for times up to 10,000 h. Mechanical property data are analyzed to develop the procedure and correlations or predicting the kinetics and extent of embrittlement of reactor components from known material parameters. The method and examples of estimating the impact strength and fracture toughness of cast components during reactor service are described. The lower-bound values of impact strength and fracture toughness for cast stainless steels at LWR operating temperatures are defined. 42 refs., 14 figs., 6 tabs

Embrittlement of the nuclear icebreaker Lenin reactor pressure vessel materials reconstruction

International Nuclear Information System (INIS)

Krasikov, E.A.; Nikolaenko, V.A.

2008-01-01

Paper deals with the results of the efforts to examine the radiation damage of the Lenin nuclear-powered ice-breaker decommissioned reactor pressure vessel on the basis of which one has determined the peculiar features of the metal radiation embrittlement. Under 10 10 -10 11 s -1 cm -2 low density neutron flux irradiation one notes the most intensive embrittlement of the metal. Then, as the noxious element content in the metal matrix grows smaller the embrittlement reduces up to the change of sign as to the normal curve plotted at the neutron flux density exceeding 10 13 s -1 cm -2 . One assumes that as a result of the low density neutron flux irradiation the reactor pressure vessel edge spaces at some operation stages may be damaged more severely in contrast to these near the reactor core. The neutron irradiation density is the factor affecting the reactor vessel material embrittlement, that is why, it is important to study the damage mechanism of the materials of the power reactor vessels under design characterized by the low radiation load. The mentioned is important, as well, to evaluate the efficiency of the efforts undertaken to mitigate the effect of the neutron radiation on the reactor vessel [ru

Guidelines for prediction of irradiation embrittlement of operating WWER-440 reactor pressure vessels

International Nuclear Information System (INIS)

2005-06-01

This TECDOC has been developed under an International Atomic Energy Agency Coordinated Research Project (CRP) entitled Evaluation of Radiation Damage of WWER Reactor Pressure Vessels (RPV) using Database on RPV Materials to develop the guidelines for prediction of radiation damage to WWER-440 PRVs. The WWER-440 RPV was designed by OKB Gidropress, Russian Federation, the general designer. Prediction of irradiation embrittlement of RPV materials is usually done in accordance with relevant codes and standards that are based on the large amounts of information from surveillance and research programmes. The existing Russian code (standard for strength calculations of components and piping in NPPs - PNAE G 7-002-86) for the WWER RPV irradiation embrittlement assessment was approved more than twenty years ago and based mostly on the experimental data obtained in research reactors with accelerated irradiation. Nevertheless, it is still in use and generally consistent with new data. The present publication presents the analyses using all available data required for more precise prediction of radiation embrittlement of WWER-440 RPV materials. Based on the fact that it contains a large amount of data from surveillance programmes as well as research programmes, the IAEA International Database on RPV Materials (IDRPVM) is used for the detailed analysis of irradiation embrittlement of WWER RPV materials. Using IDRPVM, the guideline is developed for assessment of irradiation embrittlement of RPV ferritic materials as a result of degradation during operation. Two approaches, i.e. transition temperatures based on Charpy impact notch toughness, as well as based on static fracture toughness tests, are used in RPV integrity evaluation. The objectives of the TECDOC are the analysis of irradiation embrittlement data for WWER- 440 RPV materials using IDRPVM database, evaluation of predictive formulae depending on chemical composition of the material, neutron fluence, flux, and

Metal induced embrittlement. Annual report, [March 1, 1987--February 29, 1988

Energy Technology Data Exchange (ETDEWEB)

Hoagland, R.G.

1988-11-01

This program is investigating the causes of embrittlement that occur in certain solid metals when exposed to liquid metals. The degree of embrittlement varies enormously among different solid/liquid pairs as witness, for example, the modest loss of load carrying, ability induced in carbon steels by Pb or the profound embrittlment of aluminum (particularly high strength) alloys by Hg and Ga. The structure of this study involves two types of activities: an experimental fracture mechanics study of the behavior of certain solid metals in liquid metals, and a theoretical study on an atomic scale of the crack tip deformation and extension behavior by means of atomistic simulation. This research, which began March 1, 1987, has completed its 20 month. A brief synopsis is given of performance in each of the areas of activity during the past year.

Thermal annealing of an embrittled reactor pressure vessel

International Nuclear Information System (INIS)

Mager, T.R.; Dragunov, Y.G.; Leitz, C.

1998-01-01

As a result of the popularity of the Agencies report 'Neutron Irradiation Embrittlement of Reactor Pressure Vessel Steels' of 1975, it was decided that another report on this broad subject would be of use. In this report, background and contemporary views on specially identified areas of the subject are considered as self-contained chapters, written by experts. Chapter 11 deals with thermal annealing of an embrittled reactor pressure vessel. Anneal procedures for vessels from both the US and the former USSR are mentioned schematically, wet anneals at lower temperature and dry anneals above RPV design temperatures are investigated. It is shown that heat treatment is a means of recovering mechanical properties which were degraded by neutron radiation exposure, thus assuring reactor pressure vessel compliance with regulatory requirements

Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

KAUST Repository

Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong

2017-01-01

Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

KAUST Repository

Zhang, Xuan

2017-08-10

Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

Influence of sulfur, phosphorus, and antimony segregation on the intergranular hydrogen embrittlement of nickel

International Nuclear Information System (INIS)

Bruemmer, S.M.; Baer, D.R.; Jones, R.H.; Thomas, M.T.

1983-01-01

The effectiveness of sulfur, phosphorus, and antimony in promoting the intergranular embrittlement of nickel was investigated using straining electrode tests in 1N H 2 SO 4 at cathodic potentials. Sulfur was found to be the critical grain boundary segregant due to its large enrichment at grain boundaries (10 4 to 10 5 times the bulk content) and the direct relationship between sulfur coverage and hydrogeninduced intergranular failure. Phosphorus was shown to be significantly less effective than sulfur or antimony in inducing the intergranular hydrogen embrittlement of nickel. The addition of phosphoru to nickel reduced the tendency for intergranular fracture and improved ductility because phosphoru segregated strongly to grain interfaces and limited sulfur enrichment. The hydrogen embrittling potency of antimony was also less than that of sulfur while its segregation propensity was considerably less. It was found that the effectiveness of segregated phosphorus and antimony in prompting inter granular embrittlement vs that of sulfur could be expressed in terms of an equivalent grain boundary sulfur coverage. The relative hydrogen embrittling potencies of sulfur, phosphorus, and antimony are discussed in reference to general mechanisms for the effect of impurity segregation on hydrogeninduced intergranular fracture

30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

Science.gov (United States)

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

Soldered Contact and Current Risetime Effects on Negative Polarity Wire Array Z-pinches

International Nuclear Information System (INIS)

Chalenski, D. A.; Kusse, B. R.; Greenly, J. B.; Blesener, I. C.; McBride, R. D.; Hammer, D. A.; Knapp, P. F.

2009-01-01

The Cornell University COBRA pulser is a nominal 1 MA machine, capable of driving up to 32 wire cylindrical Z-pinch arrays. COBRA can operate with variable current risetimes ranging from 100 ns to 200 ns (short and long pulse, respectively). Wires are typically strung with a ''press'' contact to the electrode hardware, where the wire is loosely pulled against the hardware and held there to establish electrical contact. The machine is normally negative, but a bolt-on convolute can be used to modify the current path and effectively produce positive polarity operation at the load.Previous research with single wires on a 1-5 kA pulser has shown that soldering the wire, thereby improving the wire/electrode contact, and operating in positive polarity can improve the energy deposition into the wire and enhance wire core expansion. Negative polarity showed no difference. Previous experiments on the negative polarity, 20 MA, 100 ns Z accelerator have shown that improving the contact improved the x-ray yield.Cornell data were collected on 16-wire Aluminum Z-pinch arrays in negative polarity. Experiments were conducted with both short and long current pulses with soldered and no-soldered wire/electrode contacts. The initiation, ablation, implosion and stagnation phases were compared for these four conditions. Time dependent x-ray signals were measured using diodes and diamond detectors. An inductive voltage monitor was used to infer minimum current radius achieved, as defined by a uniform shell of current moving radially inward, producing a time dependent inductance. Total energy data were collected with a metal-strip bolometer. Self-emission data were collected by an XUV 4-frame camera and an optical streak camera.In negative polarity and with short pulses, soldering appeared to produce a smaller radius pinch and decrease variations in the x-ray pulse shape. The bolometer, laser backlighter, 4-frame and streak cameras showed negligible differences in the initiation ablation

Hydrogen embrittlement of Zr-2.5Nb PT with temperature

International Nuclear Information System (INIS)

Oh, Dong Joon; Ahn, Sang Bok; Kim, Young Suk

2003-01-01

The aim of this study is to investigate the effect of hydrogen embrittlement of Zr-2.5Nb CANDU pressure tube. The tests were performed at three hydrogen contents for transverse tensile and CCT specimens while the test temperatures were changed (RT to 300 .deg. C). The specimens were directly machined from the tube retaining original curvature using electric discharge machine. Both the transverse tensile and the fracture toughness tests showed the hydrogen embrittlement clearly at RT but this phenomenon was disappeared while the test temperature arrived over 250 .deg. C

Recrystallization and embrittlement of sintered tungsten

International Nuclear Information System (INIS)

Bega, N.D.; Babak, A.V.; Uskov, E.I.

1982-01-01

The recrystallization of sintered tungsten with a cellular structure of deformation is studied as related to its embrittlement. It is stated that in case of preliminary recrystallization the sintered tungsten crack resistance does not depend on the testing temperature. The tungsten crack resistance is shown to lower with an increase of the structure tendency to primary recrystallization [ru

Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

Energy Technology Data Exchange (ETDEWEB)

Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

2017-07-27

Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integrated with attractive fabrication techniques for thermoelectric modules, such as screen printing, suggesting the potential of these solders in the rational design of printable and moldable thermoelectrics.

Embrittlement recovery due to annealing of reactor pressure vessel steels

International Nuclear Information System (INIS)

Eason, E.D.; Wright, J.E.; Nelson, E.E.; Odette, G.R.; Mader, E.V.

1998-01-01

The irradiation embrittlement of nuclear reactor pressure vessels (RPV) can be reduced by thermal annealing at temperatures higher than the normal operating conditions. The objective of this work was to analyze the pertinent data and develop quantitative models for estimating the recovery in 41 J (30 ft-lb) Charpy transition temperature (TT) and Charpy upper shelf energy (USE) due to annealing. An analysis data base was developed, reviewed for completeness and accuracy, and documented as part of this work. Models were developed based on a combination of statistical techniques, including pattern recognition and transformation analysis, and the current understanding of the mechanisms governing embrittlement and recovery. The quality of models fitted in this project was evaluated by considering both the Charpy annealing data used for fitting and a surrogate hardness data base. This work demonstrates that microhardness recovery is a good surrogate for shift recovery and that there is a high level of consistency between the observed annealing trends and fundamental models of embrittlement and recovery processes. (orig.)

Effect of heat treatments on the hydrogen embrittlement ...

Indian Academy of Sciences (India)

pipe steel in as received (controlled rolled), normalized, and quenched and tempered conditions. The resistance to hydrogen embrittlement was found in the order of controlled rolled > quenched and tempered > normalized. The fracture mode ...

Study of Diffusion Barrier for Solder/ n-Type Bi2Te3 and Bonding Strength for p- and n-Type Thermoelectric Modules

Science.gov (United States)

Lin, Wen-Chih; Li, Ying-Sih; Wu, Albert T.

2018-01-01

This paper investigates the interfacial reaction between Sn and Sn3Ag0.5Cu (SAC305) solder on n-type Bi2Te3 thermoelectric material. An electroless Ni-P layer successfully suppressed the formation of porous SnTe intermetallic compound at the interface. The formation of the layers between Bi2Te3 and Ni-P indicates that Te is the dominant diffusing species. Shear tests were conducted on both Sn and SAC305 solder on n- and p-type Bi2Te3 with and without a Ni-P barrier layer. Without a Ni-P layer, porous SnTe would result in a more brittle fracture. A comparison of joint strength for n- and p-type thermoelectric modules is evaluated by the shear test. Adding a diffusion barrier increases the mechanical strength by 19.4% in n-type and 74.0% in p-type thermoelectric modules.

Overview of French activities on neutron radiation embrittlement of pressure vessel steel

Energy Technology Data Exchange (ETDEWEB)

Brillaud, C [Electricite de France (EDF), 37 - Tours (France); Keroulas, F de [Electricite de France (EDF), 93 - Saint-Denis (France); Pichon, C [Electricite de France (EDF), 69 - Villeurbanne (France); Teissier, A [Electricite de France (EDF), 92 - Courbevoie (France). Service Etudes et Projets Thermiques et Nucleaires

1994-12-31

This paper describes recent developments in France`s pressure vessel surveillance program, particularly aimed at assessing the irradiation-caused embrittlement of EDF`s PWRs. The first part presents surveillance program results for base metal, weld metal and heat-affected zones for 74 capsules removed from 34 units. Fluence ranges from 0.3.10{sup 19} n.cm{sup -2} to 5.5.10{sup 19} n.cm{sup -2}. The second part considers research and development activities in this area: these include the metallurgical structure effects of segregated bands on mechanical properties and the embrittlement rate under irradiation, as well as the effect of irradiation parameters such as flux and neutron spectrum on irradiation embrittlement, and more especially to obtain the best damage assessment. (authors). 14 refs., 5 figs., 1 tab.

Oak Ridge National Laboratory Embrittlement Data Base (EDB) and Dosimetry Evaluation (DE) program

International Nuclear Information System (INIS)

Pace, J.V. III; Remec, I.; Wang, J.A.; White, J.E.

1996-01-01

The objective of this program is to develop, maintain, and upgrade computerized data bases, calculational procedures, and standards relating to reactor pressure vessel fluence spectra determinations and embrittlement assessments. As part of this program, the information from radiation embrittlement research on nuclear reactor pressure vessel steels and from power reactor surveillance reports is maintained in a data base published on a periodic basis. The Embrittlement Data Base (EDB) effort consists of verifying the quality of the EDB, providing user-friendly software to access and process the data, and exploring and assessing embrittlement prediction models. The Dosimetry Evaluation effort consists of maintaining and upgrading validated neutron and gamma radiation transport procedures, maintaining cross-section libraries with the latest evaluated nuclear data, and maintaining and updating validated dosimetry procedures and data bases. The information available from this program provides data for assisting the Office of Nuclear Reactor Regulation, with support from the Office of Nuclear Regulatory Research, to effectively monitor current procedures and data bases used by vendors, utilities, and service laboratories in the pressure vessel irradiation surveillance program

Evaluation of temper embrittlement of martensitic and ferritic-martensitic steels by acoustic emission

International Nuclear Information System (INIS)

Lu, Yusho; Takahashi, Hideaki; Shoji, Tetsuo

1987-01-01

Martensitic (HT-9) and ferritic-martensitic steels (9Cr-2Mo) are considered as fusion first wall materials. In this investigation in order to understand the sensitivity of temper embrittlement in these steels under actual service condition, fracture toughness testing was made by use of acoustic emission technique. The temper embrittlement was characterized in terms of fracture toughness. The fracture toughness of these steels under 500 deg C, 100 hrs, and 1000 hrs heat treatment was decreased and their changes in micro-fracture process have been observed. The fracture toughness changes by temper embrittlement was discussed by the characteristic of AE, AE spectrum analysis and fractographic investigation. The relation between micro-fracture processes and AE has been clarified. (author)

Multiscale Modeling of Hydrogen Embrittlement for Multiphase Material

KAUST Repository

Al-Jabr, Khalid A.

2014-01-01

Hydrogen Embrittlement (HE) is a very common failure mechanism induced crack propagation in materials that are utilized in oil and gas industry structural components and equipment. Considering the prediction of HE behavior, which is suggested

A study on the irradiation embrittlement and recovery characteristics of light water reactor pressure vessel steels

International Nuclear Information System (INIS)

Chi, Se Hwan; Hong, Jun Hwa; Lee, Bong Sang; Oh, Jong Myung; Song, Sook Hyang; Milan, Brumovsky

1999-03-01

The neutron irradiation embrittlement phenomenon of light water RPV steels greatly affects the life span for safe operation of a reactor. Reliable evaluation and prediction of the embrittlement of RPV steels, especially of aged reactors, are of importance to the safe operation of a reactor. In addition, the thermal recovery of embrittled RPV has been recognized as an option for life extension. This study aimed to tracer/refine available technologies for embrittlement characterization and prediction, to prepare relevant materials for several domestic RPV steels of the embrittlement and recovery, and to find out possible remedy for steel property betterment. Small specimen test techniques, magnetic measurement techniques, and the Meechan and Brinkmann's recovery curve analysis method were examined/applied as the evaluation techniques. Results revealed a high irradiation sensitivity in YG 3 RPV steel. Further extended study may be urgently needed. Both the small specimen test technique for the direct determination of fracture toughness, and the magnetic measurement technique for embrittlement evaluation appeared to be continued for the technical improvement and data base preparation. Manufacturing process relevant to the heat treatment appeared to be improved in lowering the irradiation sensitivity of the steel. Further study is needed especially in applying the present techniques to the new structural materials under new irradiation environment of advanced reactors. (author)

Hydrogen environment embrittlement

International Nuclear Information System (INIS)

Donovan, J.A.

1975-01-01

Exposure of many metals to gaseous hydrogen causes losses in elongation, reduction of area, and fracture toughness, and causes increases in slow crack growth rate or fatigue life compared with values obtained in air or vacuum. Hydrogen pressure, temperature, and purity significantly influence deleterious effects. The strength and structural characteristics of the metal influence the degradation of its properties by hydrogen. Several theories have been proposed to explain the loss of properties in hydrogen, but none has gained wide acceptance. The embrittlement mechanism and the role of diffusion are, therefore, open questions and need more quantitative experimental data both to test the proposed theories and to allow the development of realistic preventive measures. (U.S.)

Laser welding of vas deferens in rodents: initial experience with fluid solders.

Science.gov (United States)

Trickett, R I; Wang, D; Maitz, P; Lanzetta, M; Owen, E R

1998-01-01

This study evaluates the use of sutureless laser welding for vasovasostomy. In 14 rodents, the left vas deferens underwent vasovasostomy using an albumin-based solder applied to the adventitia of the vas deferens. The solder contained the dye, indocyanine green, to allow selective absorption and denaturation by a fiber-coupled 800-nm diode laser. The right vas deferens served as a control, receiving conventional layered microsurgical repair. We used a removable 4/0 nylon stent and microclamps to appose the vas deferens during repair, with no need for stay sutures. The mean time to perform laser solder repair (23.5 min) and conventional repair (23.3 min) were not significantly different (P=0.91). However, examination after 8 weeks showed that granuloma formation (G) and patency (P) rates for the conventional suture technique (G, 14%; P, 93%) were significantly better than observed for the laser solder technique (G, 57%; P, 50%).

High temperature embrittlement of metals by helium

International Nuclear Information System (INIS)

Schroeder, H.

1983-01-01

The present knowledge of the influence of helium on the high temperature mechanical properties of metals to be used as structural materials in fast fission and in future fusion reactors is reviewed. A wealth of experimental data has been obtained by many different experimental techniques, on many different alloys, and on different properties. This review is mostly concentrated on the behaviour of austenitic alloys -especially austenitic stainless steels, for which the data base is by far the largest - and gives only a few examples of special bcc alloys. The effect of the helium embrittlement on the different properties - tensile, fatigue and, with special emphasis, creep - is demonstrated by representative results. A comparison between data obtained from in-pile (-beam) experiments and from post-irradiation (-implantation) experiments, respectively, is presented. Theoretical models to describe the observed phenomena are briefly outlined and some suggestions are made for future work to resolve uncertainties and differences between our experimental knowledge and theoretical understanding of high temperature helium embrittlement. (author)

The influences of impurity content, tensile strength, and grain size on in-service temper embrittlement of CrMoV steels

International Nuclear Information System (INIS)

Cheruvu, N.S.; Seth, B.B.

1989-01-01

The influences of impurity levels, grain size, and tensile strength on in-service temper embrittlement of CrMoV steels have been investigated. The samples for this study were taken from steam turbine CrMoV rotors which had operated for 15 to 26 years. The effects of grain size and tensile strength on embrittlement susceptibility were separated by evaluating the embrittlement behavior of two rotor forgings made from the same ingot after an extended step-cooling treatment. Among the residual elements in the steels, only P produces a significant embrittlement. The variation of P and tensile strength has no effect on in-service temper embrittlement susceptibility, as measured by the shift in fracture appearance transition temperature (FATT). However, the prior austenite grain size plays a major role in service embrittlement. The fine grain steels with a grain size of ASTM No. 9 or higher are virtually immune to in-service embrittlement. In steels having duplex grain sizes, embrittlement susceptibility is controlled by the size of coarser grains. For a given steel chemistry, the coarse grain steel is more susceptible to in-service embrittlement, and a decrease in ASTM grain size number from 4 to 0/1 increases the shift in FATT by 61 degrees C (10/10 degrees F). It is demonstrated that long-term service embrittlement can be simulated, except in very coarse grain steels, by using the extended step-cooling treatment. The results of step-cooling studies show that the coarse grain rotor steels take longer time during service to reach a fully embrittled state than the fine grain rotor steels

Laser beam soldering of micro-optical components

Science.gov (United States)

Eberhardt, R.

2003-05-01

MOTIVATION Ongoing miniaturisation and higher requirements within optical assemblies and the processing of temperature sensitive components demands for innovative selective joining techniques. So far adhesive bonding has primarily been used to assemble and adjust hybrid micro optical systems. However, the properties of the organic polymers used for the adhesives limit the application of these systems. In fields of telecommunication and lithography, an enhancement of existing joining techniques is necessary to improve properties like humidity resistance, laserstability, UV-stability, thermal cycle reliability and life time reliability. Against this background laser beam soldering of optical components is a reasonable joining technology alternative. Properties like: - time and area restricted energy input - energy input can be controlled by the process temperature - direct and indirect heating of the components is possible - no mechanical contact between joining tool and components give good conditions to meet the requirements on a joining technology for sensitive optical components. Additionally to the laser soldering head, for the assembly of optical components it is necessary to include positioning units to adjust the position of the components with high accuracy before joining. Furthermore, suitable measurement methods to characterize the soldered assemblies (for instance in terms of position tolerances) need to be developed.

Comparison of implant-abutment interface misfits after casting and soldering procedures.

Science.gov (United States)

Neves, Flávio Domingues das; Elias, Gisele Araújo; da Silva-Neto, João Paulo; de Medeiros Dantas, Lucas Costa; da Mota, Adérito Soares; Neto, Alfredo Júlio Fernandes

2014-04-01

The aim of this study was to compare vertical and horizontal adjustments of castable abutments after conducting casting and soldering procedures. Twelve external hexagonal implants (3.75 × 10 mm) and their UCLA abutments were divided according their manufacturer and abutment type: PUN (plastic UCLA, Neodent), PUC (plastic UCLA, Conexão), PU3i (plastic UCLA, Biomet 3i), and PUTN (plastic UCLA with Tilite milled base, Neodent). Three infrastructures of a fixed partial implant-supported bridge with 3 elements were produced for each group. The measurements of vertical (VM) and horizontal (HM) misfits were obtained via scanning electron microscopy after completion of casting and soldering. The corresponding values were determined to be biomechanically acceptable to the system, and the results were rated as a percentage. Statistical analysis establishes differences between groups by chi-square after procedures, and McNeman's test was applied to analyze the influence of soldering over casting (α ≤ .05). For the values of VM and HM, respectively, when the casting process was complete, it was observed that 83.25% and 100% (PUTN), 33.3% and 27.75% (PUN), 33.3% and 88.8% (PUC), 33.3% and 94.35% (PU3i) represented acceptable values. After completing the requisite soldering, acceptable values were 50% and 94.35% (PUTN), 16.6% and 77.7% (PUN), 38.55% and 77.7% (PUC), and 27.75% and 94.35% (PU3i). Within the limitations of this study, it can be concluded that the premachined abutments presented more acceptable VM values. The HM values were within acceptable limits before and after the soldering procedure for most groups. Further, the soldering procedure resulted in an increase of VM in all groups.

Characterizing performances of solder paste printing process at flexible manufacturing lines

International Nuclear Information System (INIS)

Siew, Jit Ping; Low, Heng Chin; Teoh, Ping Chow

2015-01-01

Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter

Characterizing performances of solder paste printing process at flexible manufacturing lines

Energy Technology Data Exchange (ETDEWEB)

Siew, Jit Ping; Low, Heng Chin [University of Science Malaysia, 11800 Minden, Penang (Malaysia); Teoh, Ping Chow [Wawasan Open University, 54 Jalan Sultan Ahmad Shah, 10050 Penang (Malaysia)

2015-02-03

Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.

Hydrogen embrittlement of titanium tested with fracture mechanics specimens

International Nuclear Information System (INIS)

Aho-Mantila, I.; Rahko, P.

1990-11-01

Titanium is one of the possible canister materials for spent nuclear fuel. The aim of this study is to determine whether the hydrogen embrittlement of titanium could be a possible deterioration mechanism of titanium canisters. This experimental study was preceded by a literature review and an experimental study on crack nucleation. Tests in this study were carried out with hydrogen charged fracture mechanics specimens. The studied hydrogen contents were as received, 100 ppm, 200 ppm, 500 ppm and 700 ppm and the types of the studied titanium were ASTM Grades 2 and 12. Test methods were slow tensile test (0.027 mm/h) and fatigue test (stress ratio 0.7 or 0.8 and frequency 5 Hz). According to the literature titanium may be embrittled by hydrogen at slow strain rates and cracking may occur under sustained load. In this study no evidence of hydrogen embrittlement was noticed in slow strain rate tension with bulk hydrogen contents up to 700 ppm. The fatigue tests of titanium Grades 2 and 12 containing 700 ppm hydrogen showed even slower crack growth compared to the as received condition. Very high hydrogen contents well in eccess of 700 ppm on the surface of titanium can, however, facilitate surface crack nucleation and crack growth, as shown in the previous study

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Science.gov (United States)

Hammad, A. E.; El-Taher, A. M.

2014-11-01

The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

Estimate the thermomechanical fatigue life of two flip chip packages

International Nuclear Information System (INIS)

Pash, R.A.; Ullah, H.S.; Khan, M.Z.

2005-01-01

The continuing demand towards high density and low profile integrated circuit packaging has accelerated the development of flip chip structures as used in direct chip attach (DCA) technology, ball grid array (BOA) and chip scale package (CSP). In such structures the most widely used flip chip interconnects are solder joints. The reliability of flip chip structures largely depends on the reliability of solder joints. In this work solder joint fatigue life prediction for two chip scale packages is carried out. Elasto-plastic deformation behavior of the solder was simulated using ANSYS. Two dimensional plain strain finite element models were developed for each package to numerically compute the stress and total strain of the solder joints under temperature cycling. These stress and strain values are then used to predict the solder joint lifetime through modified Coffin Manson equation. The effect of solder joint's distance from edge of silicon die on life of the package is explored. The solder joint fatigue response is modeled for a typical temperature cycling of -60 to 140 degree C. (author)

Review of recent studies on neutron irradiation embrittlement in light water reactor pressure vessel steels

International Nuclear Information System (INIS)

Sudo, Akira; Miyazono, Shohachiro

1983-06-01

Recent studies in foreign countries (USA, France, FRG and UK) on neutron irradiation embrittlement have been reviewed. These studies are classified into four areas, such as 1) effect of chemical composition on irradiation embrittlement sensitivity, 2) postirradiation heat treatment for embrittlement relief, 3) fracture toughness evaluation of irradiated materials based on fracture mechanics analysis, and 4) effect of irradiation on fatigue crack propagation behavior. The first area mainly includes the studies related to the effects of copper, phosphorus impurities and nickel alloying and synergistic effect of these components, and furthermore, evaluation of Regulatory Guide 1.99 Rev.l. Studies in the second area show the effects of annealing condition (temperature and time) and metallugical condition on embrittlement relief, and evaluation of periodic annealing in the period of irradiation as a promising method for embrittlement control. Studies in the third area show the correlation between fracture toughness and Cv notch ductility changes with neutron irradiation, and J-R curves of irradiated materials based on the elasto-plastic fracture mechanics. In the forth area, most of studies are investigated in air condition but a few studies in reactor-grade water at high temperature and pressure. (author)

Role of twinning and transformation in hydrogen embrittlement of austenitic stainless steels

International Nuclear Information System (INIS)

Caskey, G.R. Jr.

1977-01-01

Internal hydrogen embrittlement may be viewed as an extreme form of environmental embrittlement that arises following prolonged exposure to a source of hydrogen. Smooth bar tensile specimens of three stainless steels saturated with deuterium (approximately 200 mol D 2 /m 3 ) were pulled to failure in air at 200 to 400 0 K or in liquid nitrogen at 78 0 K. In Type 304L stainless steel and Tenelon ductility losses are a maximum around 200 to 273 0 K; Type 310 stainless steel is not embrittled at this hydrogen concentration. A distinct change in fracture mode accompanies hydrogen embrittlement, with fracture proceeding along coherent boundaries of pre-existing annealing twins. This fracture path is observed in Tenelon at 78 0 K even when hydrogen is absent. There is also a change in fracture appearance in specimens with no prior exposure to hydrogen if they are pulled to failure in high-pressure hydrogen. The fracture path is not identifiable, however. Magnetic response measurements and changes in the stress-strain curves show that hydrogen suppresses formation of strain-induced α'-martensite at 198 0 K in both Type 304L stainless steel and Tenelon, but there is little effect in Type 304L stainless at 273 0 K

Ni/boride interfaces and environmental embrittlement in Ni-based superalloys: A first-principles study

International Nuclear Information System (INIS)

Sanyal, Suchismita; Waghmare, Umesh V.; Hanlon, Timothy; Hall, Ernest L.

2011-01-01

Highlights: ► Fracture strengths of Ni/boride interfaces through first-principles calculations. ► Fracture strengths of Ni/boride interfaces are higher than Ni/Ni 3 Al and NiΣ5 grain boundaries. ► Ni/boride interfaces have higher resistance to O-embrittlement than Ni/Ni 3 Al and NiΣ5 grain boundaries. ► CrMo-borides are more effective than Cr-borides in resisting O-embrittlement. ► Electronegativity differences between alloying elements correlate with fracture strengths. - Abstract: Motivated by the vital role played by boride precipitates in Ni-based superalloys in improving mechanical properties such as creep rupture strength, fatigue crack growth rates and improved resistance towards environmental embrittlement , we estimate fracture strength of Ni/boride interfaces through determination of their work of separation using first-principles simulations. We find that the fracture strength of Ni/boride interfaces is higher than that of other commonly occurring interfaces in Ni-alloys, such as Ni Σ-5 grain boundaries and coherent Ni/Ni 3 Al interfaces, and is less susceptible to oxygen-induced embrittlement. Our calculations show how the presence of Mo in Ni/M 5 B 3 (M = Cr, Mo) interfaces leads to additional reduction in oxygen-induced embrittlement. Through Electron-Localization-Function based analyses, we identify the electronic origins of effects of alloying elements on fracture strengths of these interfaces and observe that chemical interactions stemming from electronegativity differences between different atomic species are responsible for the trends in calculated strengths. Our findings should be useful towards designing Ni-based alloys with higher interfacial strengths and reduced oxygen-induced embrittlement.

Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

Science.gov (United States)

Rolin, T. D.; Hodge, R. E.

2008-01-01

An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

Charles J. McMahon Interfacial Segregation and Embrittlement Symposium

National Research Council Canada - National Science Library

Vitek, Vaclav

2003-01-01

.... McMahon Interfacial Segregation and Embrittlement Symposium: Grain Boundary Segregation and Fracture in Steels was sponsored by ASM International, Materials Science Critical Technology Sector, Structural Materials Division, Materials Processing...

Role of vanadium carbide traps in reducing the hydrogen embrittlement susceptibility of high strength alloy steels. Final report

Energy Technology Data Exchange (ETDEWEB)

Spencer, G.L.; Duquette, D.J.

1998-08-01

High strength alloy steels typically used for gun steel were investigated to determine their susceptibility to hydrogen embrittlement. Although AISI grade 4340 was quite susceptible to hydrogen embrittlement, ASTM A723 steel, which has identical mechanical properties but slightly different chemistries, was not susceptible to hydrogen embrittlement when exposed to the same conditions. The degree of embrittlement was determined by conducting notched tensile testing on uncharged and cathodically charged specimens. Chemical composition was modified to isolate the effect of alloying elements on hydrogen embrittlement susceptibility. Two steels-Modified A723 (C increased from 0.32% to 0.40%) and Modified 4340 (V increased from 0 to O.12%) were tested. X-ray diffraction identified the presence of vanadium carbide, V{sub 4}C{sub 3}, in A-23 steels, and subsequent hydrogen extraction studies evaluated the trapping effect of vanadium carbide. Based on these tests, it was determined that adding vanadium carbide to 4340 significantly decreased hydrogen embrittlement susceptibility because vanadium carbide traps ties up diffusible hydrogen. The effectiveness of these traps is examined and discussed in this paper.

A study on the irradiation embrittlement and recovery characteristics of light water reactor pressure vessel steels

Energy Technology Data Exchange (ETDEWEB)

Chi, Se Hwan; Hong, Jun Hwa; Lee, Bong Sang; Oh, Jong Myung; Song, Sook Hyang; Milan, Brumovsky [NRI Czech (Czech Republic)

1999-03-01

The neutron irradiation embrittlement phenomenon of light water RPV steels greatly affects the life span for safe operation of a reactor. Reliable evaluation and prediction of the embrittlement of RPV steels, especially of aged reactors, are of importance to the safe operation of a reactor. In addition, the thermal recovery of embrittled RPV has been recognized as an option for life extension. This study aimed to tracer/refine available technologies for embrittlement characterization and prediction, to prepare relevant materials for several domestic RPV steels of the embrittlement and recovery, and to find out possible remedy for steel property betterment. Small specimen test techniques, magnetic measurement techniques, and the Meechan and Brinkmann's recovery curve analysis method were examined/applied as the evaluation techniques. Results revealed a high irradiation sensitivity in YG 3 RPV steel. Further extended study may be urgently needed. Both the small specimen test technique for the direct determination of fracture toughness, and the magnetic measurement technique for embrittlement evaluation appeared to be continued for the technical improvement and data base preparation. Manufacturing process relevant to the heat treatment appeared to be improved in lowering the irradiation sensitivity of the steel. Further study is needed especially in applying the present techniques to the new structural materials under new irradiation environment of advanced reactors. (author)

Surveillance of irradiation embrittlement of nuclear reactor pressure vessels

International Nuclear Information System (INIS)

Najzer, M.

1982-01-01

Surveillance of irradiation embrittlement of nuclear reactor pressure vessels is briefly discussed. The experimental techniques and computer programs available for this work at the J. Stefan Institute are described. (author)

Present status of the disk pressure tests for hydrogen embrittlement

International Nuclear Information System (INIS)

Fidelle, J.P.

1985-05-01

The Disk Pressure Tests (DPT) have been developed considerably theoretically and experimentally for Internal Hydrogen Embrittlement (IHE) e.g. Co, Ti, U alloys, for Environment Embrittlement due to H 2 , hydrogenated media such as water vapor, alcohol, machining fluids or liquid NH 3 . The range has been expanded considerably for pressure up to 300 MPa and temperature (-160 0 C to 1000 0 C). Very low strain rate -longer than a month- tests have been able to evidence embrittlement of FFC alloys where H diffusivity is low. Conversely for very oxidation - sensitive metals (e.g. Nb and Ta) effects may appear only at somewhat high rates. The relationship between dynamic (increasing stress) tests, static (delayed failure) and low-cycle fatigue tests has been determined. In a number of instances, including SCC, other techniques and even fracture mechanics have been compared to the DPT and proved at best equivalent and several times, less sensitive than a well conducted DPT. At extreme they could not reproduce the field service phenomenon whereas the DPT did and could also be applied satisfactorily to low yield stress materials. The main rupture aspects have been analyzed mechanically and organized in a rational and comprehensive chart based on 12,000 + tests over 150 + materials in different conditions. From the tests on a large number of metal systems, a theory of HE has been derived which accounts for the behavior of metals and alloys either embrittled and or hydrited. Finally comparison of HGE tests and service behavior of a large variety of materials and industrial equipments has made possible to specify acceptance criteria for industrial service

Effect of microstructure on the susceptibility of a 533 steel to temper embrittlement

International Nuclear Information System (INIS)

Raoul, S.; Marini, B.; Pineau, A.

1998-01-01

In ferritic steels, brittle fracture usually occurs at low temperature by cleavage. However the segregation of impurities (P, As, Sn etc..) along prior γ grain boundaries can change the brittle fracture mode from transgranular to intergranular. In quenched and tempered steels, this segregation is associated with what is called the temper-embrittlement phenomenon. The main objective of the present study is to investigate the influence of the as-quenched microstructure (lower bainite or martensite) on the susceptibility of a low alloy steel (A533 cl.1) to temper-embrittlement. Dilatometric tests were performed to determine the continous-cooling-transformation (CCT) diagram of the material and to measure the critical cooling rate (V c ) for a martensitic quench. Then subsized Charpy V-notched specimens were given various cooling rates from the austenitization temperature to obtain a wide range of as-quenched microstructures, including martensite and bainite. These specimens were subsequently given a heat treatment to develop temper embrittlement and tested to measure the V-notch fracture toughness at -50 C. The fracture surfaces were examined by SEM. It is shown that martensitic microstructures are more susceptible to intergranular embrittlement than bainitic microstructures. These observed microstructural influences are briefly discussed. (orig.)

On the tempered martensite embrittlement in AISI 4140 low alloy steel

Energy Technology Data Exchange (ETDEWEB)

Darwish, F.A. (Dept. of Materials Science and Metallurgy, Catholic Univ., Rio de Janeiro, RJ (Brazil)); Pereira, L.C.; Gatts, C. (Dept. of Metallurgy and Materials Engineering, Federal Univ., Rio de Janeiro, RJ (Brazil)); Graca, M.L. (Materials Div., Technical Aerospace Center, Sao Jose dos Campos, SP (Brazil))

1991-02-01

In the present investigation the Auger electron spectroscopy (AES) technique was used to determine local carbon and phosphorus concentrations on the fracture surfaces of as-quenched and quenched-and-tempered (at 350deg C) AISI 4140 steel specimens austenitized at low and high temperatures. The AES results were rationalized to conclude that, although carbide growth as well as phosphorus segregation are expected to contribute to tempered martensite embrittlement, carbide precipitation on prior austenite grain boundaries during tempering is seen to be the microstructural change directly responsible for the occurrence of the referred embrittlement phenomenon. (orig.).

Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution

Science.gov (United States)

Nordarina, J.; Mohd, H. Z.; Ahmad, A. M.; Muhammad, F. M. N.

2018-03-01

The corrosion properties of Sn-9(5Al-Zn), Sn-Cu and SAC305 were studied via potentiodynamic polarization method in an acidic solution of 1 M hydrochloric acid (HCl). Sn-9(5Al-Zn) produced different polarization profile compared with Sn-Cu and SAC305. The morphological analysis showed that small, deep grooves shaped of corrosion product formed on top of Sn-9(5Al-Zn) solder while two distinctive structures of closely packed and loosely packed corrosion product formed on top of Sn-Cu and SAC305 solder alloys. Phase analysis revealed the formations of various corrosion products such as SnO and SnO2 mainly dominant on surface of solder alloys after potentiodynamic polarization in 1 M hydrochloric acid (HCl).

Embrittlement of irradiated ferritic/martensitic steels in the absence of irradiation hardening

Energy Technology Data Exchange (ETDEWEB)

Klueh, R.L. [Oak Ridge Noational Laboratory, TN (United States); Shiba, K. [Japan Atomic Energy Agency, Tokai-mura, Naga-gun, Ibaraki-ken (Japan); Sokolov, M. [Oak Ridge National Laboratory, Materials Science and Technology Div., TN (United States)

2007-07-01

Full text of publication follows: Neutron irradiation of 9-12% Cr ferritic/martensitic steels below 425-450 deg. C produces microstructural defects that cause an increase in yield stress and ultimate tensile strength. This irradiation hardening causes embrittlement, which is observed in Charpy impact and toughness tests as an increase in ductile-brittle transition temperature (DBTT). Based on observations that show little change in strength in these steels irradiated above 425-450 deg. C, the general conclusion has been that no embrittlement occurs above this irradiation-hardening temperature regime. In a recent study of F82H steel irradiated at 300, 380, and 500 deg. C, irradiation hardening-an increase in yield stress-was observed in tensile specimens irradiated at the two lower temperatures, but no change was observed for the specimens irradiated at 500 deg. C. As expected, an increase in DBTT occurred for the Charpy specimens irradiated at 300 and 380 deg. C. However, there was an unexpected increase in the DBTT of the specimens irradiated at 500 deg. C. The observed embrittlement was attributed to the irradiation-accelerated precipitation of Laves phase. This conclusion was based on results from a detailed thermal aging study of F82H, in which tensile and Charpy specimens were aged at 500, 550, 600, and 650 deg. C to 30,000 h. These studies indicated that there was a decrease in yield stress at the two highest temperatures and essentially no change at the two lowest temperatures. Despite the strength decrease or no change, the DBTT increased for Charpy specimens irradiated at all four temperatures. Precipitates were extracted from thermally aged specimens, and the amount of precipitate was correlated with the increase in transition temperature. Laves phase was identified in the extracted precipitates by X-ray diffraction. Earlier studies on conventional elevated-temperature steels also showed embrittlement effects above the irradiation-hardening temperature

Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

International Nuclear Information System (INIS)

Koo, Jahyun; Lee, Changsoo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck Mo

2015-01-01

It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu_3_3Al_1_7, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu_6Sn_5 networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu_6Sn_5 IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu_3_3Al_1_7 IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

Energy Technology Data Exchange (ETDEWEB)

Koo, Jahyun; Lee, Changsoo [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of); Hong, Sung Jea [MK Electron Co., Ltd., Yongin Cheoin-gu 316-2 (Korea, Republic of); Kim, Keun-Soo, E-mail: keunsookim@hoseo.edu [Department of Display Engineering, Hoseo University, Asan 336-795 (Korea, Republic of); Lee, Hyuck Mo, E-mail: hmlee@kaist.ac.kr [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of)

2015-11-25

It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu{sub 33}Al{sub 17}, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu{sub 6}Sn{sub 5} networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu{sub 6}Sn{sub 5} IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu{sub 33}Al{sub 17} IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

Precipitation hardening and hydrogen embrittlement of aluminum ...

Indian Academy of Sciences (India)

Hydrogen susceptibility of alloy AA7020 was evaluated by slow strain-rate tensile ... high pressures because of the embrittling effect of hydrogen. ... The higher the total Zn + Mg content,. ∗ .... dislocations, leading to a local softening of the slip plane, and thus to ... A Vickers hardness testing machine was used to measure the.

LYRA and other projects on RPV steel embrittlement study and mitigation of the AMES network

International Nuclear Information System (INIS)

Debarberis, L.; Estorff, U. von; Crutzen, S.; Beers, M.; Stamm, H.; Vries, M.I. de; Tjoa, G.L.

1998-01-01

Within the framework of the European Network AMES, Ageing Materials evaluation and Studies, a number of experimental works on RPV materials embrittlement are carried out at the Institute of Advanced Materials (AIM) of the Joint Research Centre (JRC) of the European Commission (EC). The objectives of AMES are mainly the understanding of the property degradation phenomena of RPV western reference steels like JRQ and HSST, eastern RPV steels like 15X2mFA and 15H2X15, and annealing possibilities. In order to conduct a very high quality irradiation rig, LYRA facility, has been designed and developed at the High Flux Reactor (HFR) Petten. An other dedicated rig, named LIMA, has been developed at the HFR Petten in order to irradiate RPV steels, internals and in-core materials under typical BWR/PWR conditions. The samples can be irradiated in pressurised water up to 160 bar, 320 deg. C, and the water chemistry fully controlled. For irradiation of standard or miniaturised LWR related materials samples, another group of well experienced irradiation devices with inert gas or liquid metals environment are employed. These devices are tailored to their various specific applications. This paper is intended to give information about the structure and the objectives of the existing European network AMES, and to present the various AMES main and spin-off projects, including a brief description on he modelling activities related to RPV materials embrittlement. (author)

Investigation of moisture uptake into printed circuit board laminate and solder mask materials

DEFF Research Database (Denmark)

Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

2017-01-01

with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

Low temperature thermal ageing embrittlement of austenitic stainless steel welds and its electrochemical assessment

International Nuclear Information System (INIS)

Chandra, K.; Kain, Vivekanand; Raja, V.S.; Tewari, R.; Dey, G.K.

2012-01-01

Highlights: ► Embrittlement study of austenitic stainless steel welds after ageing up to 20,000 h. ► Spinodal decomposition and G-phase precipitation in ferrite at 400 °C. ► Spinodal decomposition of ferrite at 335 and 365 °C. ► Large decrease in corrosion resistance due to G-phase precipitation. ► Good correlation between electrochemical properties and the degree of embrittlement. - Abstract: The low temperature thermal ageing embrittlement of austenitic stainless steel welds is investigated after ageing up to 20,000 h at 335, 365 and 400 °C. Spinodal decomposition and G-phase precipitation after thermal ageing were identified by transmission electron microscopy. Ageing led to increase in hardness of the ferrite phase while there was no change in the hardness of austenite. The degree of embrittlement was evaluated by non-destructive methods, e.g., double-loop and single-loop electrochemical potentiokinetic reactivation tests. A good correlation was obtained between the electrochemical properties and hardening of the ferrite phase of the aged materials.

Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

International Nuclear Information System (INIS)

Sujan, G.K.; Haseeb, A.S.M.A.; Afifi, A.B.M.

2014-01-01

Lead free solders currently in use are prone to develop thick interfacial intermetallic compound layers with rough morphology which are detrimental to the long term solder joint reliability. A novel method has been developed to control the morphology and growth of intermetallic compound layers between lead-free Sn–3.0Ag–0.5Cu solder ball and copper substrate by doping a water soluble flux with metallic nanoparticles. Four types of metallic nanoparticles (nickel, cobalt, molybdenum and titanium) were used to investigate their effects on the wetting behavior and interfacial microstructural evaluations after reflow. Nanoparticles were dispersed manually with a water soluble flux and the resulting nanoparticle doped flux was placed on copper substrate. Lead-free Sn–3.0Ag–0.5Cu solder balls of diameter 0.45 mm were placed on top of the flux and were reflowed at a peak temperature of 240 °C for 45 s. Angle of contact, wetting area and interfacial microstructure were studied by optical microscopy, field emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. It was observed that the angle of contact increased and wetting area decreased with the addition of cobalt, molybdenum and titanium nanoparticles to flux. On the other hand, wettability improved with the addition of nickel nanoparticles. Cross-sectional micrographs revealed that both nickel and cobalt nanoparticle doping transformed the morphology of Cu 6 Sn 5 from a typical scallop type to a planer one and reduced the intermetallic compound thickness under optimum condition. These effects were suggested to be related to in-situ interfacial alloying at the interface during reflow. The minimum amount of nanoparticles required to produce the planer morphology was found to be 0.1 wt.% for both nickel and cobalt. Molybdenum and titanium nanoparticles neither appear to undergo alloying during reflow nor have any influence at the solder/substrate interfacial reaction. Thus, doping of flux

Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

Energy Technology Data Exchange (ETDEWEB)

Sujan, G.K., E-mail: sgkumer@gmail.com; Haseeb, A.S.M.A., E-mail: haseeb@um.edu.my; Afifi, A.B.M., E-mail: amalina@um.edu.my

2014-11-15

Lead free solders currently in use are prone to develop thick interfacial intermetallic compound layers with rough morphology which are detrimental to the long term solder joint reliability. A novel method has been developed to control the morphology and growth of intermetallic compound layers between lead-free Sn–3.0Ag–0.5Cu solder ball and copper substrate by doping a water soluble flux with metallic nanoparticles. Four types of metallic nanoparticles (nickel, cobalt, molybdenum and titanium) were used to investigate their effects on the wetting behavior and interfacial microstructural evaluations after reflow. Nanoparticles were dispersed manually with a water soluble flux and the resulting nanoparticle doped flux was placed on copper substrate. Lead-free Sn–3.0Ag–0.5Cu solder balls of diameter 0.45 mm were placed on top of the flux and were reflowed at a peak temperature of 240 °C for 45 s. Angle of contact, wetting area and interfacial microstructure were studied by optical microscopy, field emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. It was observed that the angle of contact increased and wetting area decreased with the addition of cobalt, molybdenum and titanium nanoparticles to flux. On the other hand, wettability improved with the addition of nickel nanoparticles. Cross-sectional micrographs revealed that both nickel and cobalt nanoparticle doping transformed the morphology of Cu{sub 6}Sn{sub 5} from a typical scallop type to a planer one and reduced the intermetallic compound thickness under optimum condition. These effects were suggested to be related to in-situ interfacial alloying at the interface during reflow. The minimum amount of nanoparticles required to produce the planer morphology was found to be 0.1 wt.% for both nickel and cobalt. Molybdenum and titanium nanoparticles neither appear to undergo alloying during reflow nor have any influence at the solder/substrate interfacial reaction. Thus, doping

Laser-tissue soldering with biodegradable polymer films in vitro: film surface morphology and hydration effects.

Science.gov (United States)

Sorg, B S; Welch, A J

2001-01-01

Previous research introduced the concept of using biodegradable polymer film reinforcement of a liquid albumin solder for improvement of the tensile strength of repaired incisions in vitro. In this study, the effect of creating small pores in the PLGA films on the weld breaking strength is studied. Additionally, the effect of hydration on the strength of the reinforced welds is investigated. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with an 806-nm CW diode laser. A poly(DL-lactic-co-glycolic acid) (PLGA) film was used to reinforce the solder (the controls had solder but no reinforcement). Breaking strengths were measured acutely and after hydration in saline for 1 and 2 days. The data were analyzed by ANOVA (P < 0.05) and multiple comparisons of means were performed using the Newman-Keuls test. The creation of pores in the PLGA films qualitatively improved the film flexibility without having an apparent adverse effect on the breaking strength, while the actual technique of applying the film and solder had more of an effect. The acute maximum average breaking strengths of some of the film reinforced specimens (114.7 g-134.4 g) were significantly higher (P < 0.05) than the acute maximum average breaking strength of the unreinforced control specimens (68.3 g). Film reinforced specimens were shown to have a statistically significantly higher breaking strength than unreinforced controls after 1- and 2-day hydration. Reinforcement of liquid albumin solders in laser-assisted incision repair appears to have advantages over conventional methods that do not reinforce the cohesive strength of the solder in terms of acute breaking strength and after immersion in moist environments for short periods of time. Using a film with the solder applied to one surface only may be advantageous over other techniques.

Effect of hydrogen and oxygen content on the embrittlement of Zr alloys

International Nuclear Information System (INIS)

Griger, A.; Hozer, Z.; Matus, L.; Vasaros, L.; Horvath, M.

2001-01-01

An experimental study is carried out in the KFKI Atomic Energy Research Institute in order to clear up the role of oxidation and hydrogen uptake in the embrittlement process. Russian E110 type Zr1%Nb and Zircaloy-4 claddings are used as test materials. The differences between the properties of two alloys are examined. The sample preparation covered the following cases: oxidation in Ar+O 2 atmosphere; hydrogen uptake of as received and pre-oxidised samples (in Ar+O 2 atmosphere); oxidation in steam. The oxidation in Ar+O 2 and the subsequent hydrogen uptake procedure make possible the production of samples with well-characterized hydrogen and oxygen content. Corrosion treated ring samples of 8 mm height are examined in ring compression tests. The force-deformation curves are recorded and the crushing force and deformation are determined. The relative deformation is used for the characterisation of embrittlement level. The results of experiments provide detailed information about the effect of hydrogen and oxygen content on the embrittlement of zirconium alloys. The conclusions are: 1) hydrogen seems to play a more important role in the embrittlement of zirconium alloys than oxygen; 2) the Zircaloy-4 alloy becomes brittle at lower hydrogen content than the Zr1%Nb; 3) under steam oxidation conditions the Zr1%Nb alloy takes up much more hydrogen and becomes more brittle than the Zircaloy-4

Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

International Nuclear Information System (INIS)

Mallik, S.; Ekere, N.N.; Durairaj, R.; Marks, A.E.; Seman, A.

2009-01-01

Solder paste is the most important strategic bonding material used in the assembly of surface mount components in electronics manufacturing. As the trend towards miniaturisation of electronic products continues, there is an increasing demand for better understanding of the flow and deformation that is, the rheological behaviour of solder paste formulations. Wall slip plays an important role in characterising the flow behaviour of solder paste materials. The problem of wall slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. In rheological measurements, slip effects can generally be avoided by using roughened surfaces for measuring geometries. In this paper, a novel technique is developed to study the effect of wall slip in the rheological measurements of lead-free solder paste. The viscosity and oscillatory data obtained for three different solder paste samples (from measuring geometries of different surface roughness) have been analysed and compared. In viscosity measurements, slip effects were dominant at low shear rates and the use of serrated surfaces was found to be quite effective in minimizing slip effects. Oscillatory measurements were also affected by roughening the surfaces of measuring geometries.

Comparison of hydrogen gas embrittlement of austenitic and ferritic stainless steels

Science.gov (United States)

Perng, T. P.; Altstetter, C. J.

1987-01-01

Hydrogen-induced slow crack growth (SCG) was compared in austenitic and ferritic stainless steels at 0 to 125 °Cand 11 to 216 kPa of hydrogen gas. No SCG was observed for AISI 310, while AISI 301 was more susceptible to hydrogen embrittlement and had higher cracking velocity than AL 29-4-2 under the same test conditions. The kinetics of crack propagation was modeled in terms of the hydrogen transport in these alloys. This is a function of temperature, microstructure, and stress state in the embrittlement region. The relatively high cracking velocity of AISI 301 was shown to be controlled by the fast transport of hydrogen through the stress-induced α' martensite at the crack tip and low escape rate of hydrogen through the γ phase in the surrounding region. Faster accumulation rates of hydrogen in the embrittlement region were expected for AISI 301, which led to higher cracking velocities. The mechanism of hydrogen-induced SCG was discussed based upon the concept of hydrogen-enhanced plasticity.

Heavy-Section Steel Irradiation Program: Embrittlement issues

International Nuclear Information System (INIS)

Corwin, W.R.

1991-01-01

Maintaining the integrity of the reactor pressure vessel (RPV) in a light-water-cooled nuclear power plant is crucial in preventing and controlling severe accidents and the potential for major contamination releases. It is imperative to understand and predict the capabilities and limitations of its integrity. It is particularly vital to fully understand the degree of irradiation-induced degradation of the RPV's fracture resistance which occurs during service, since without that radiation damage it is virtually impossible to postulate a realistic scenario which would result in RPV failure. The Heavy-Section Steel Irradiation (HSSI) Program has been established by the US Nuclear Regulatory Commission (USNRC) to provide a thorough, quantitative assessment of the effects of neutron irradiation on the material behavior, and in particular the fracture toughness properties, of typical pressure vessel steels as they relate to light-water reactor pressure-vessel integrity. Results from HSSI studies provide information needed to aid in resolving major regulatory issues facing the USNRC which involve RPV irradiation embrittlement such as pressurized-thermal shock, operating pressure-temperature limits, low-temperature overpressurization, and the specialized problems associated with low upper-shelf (LUS) welds. Taken together the results of these studies also provide guidance and bases for evaluating both the aging behavior and the potential for plant life extension of light-water RPVs. The principal materials examined within the HSSI program are high-copper welds since their postirradiation properties are most frequently limiting in the continued safe operation of commercial RPVs. Embrittlement modeling studies have shown that the time or dose required for the point defect concentrations, which ultimately contribute to irradiation embrittlement, to reach their steady state values can be comparable to the component lifetime or to the duration of an irradiation experiment

Thermal decomposition of solder flux activators under simulated wave soldering conditions

DEFF Research Database (Denmark)

Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

2017-01-01

/methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base...... titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

Current limitations of trend curve analysis for the prediction of reactor PV embrittlement

International Nuclear Information System (INIS)

Gold, R.; McElroy, W.N.

1986-02-01

In operating light water reactor (LWR) commercial power plants, neutron radiation induces embrittlement of the pressure vessel (PV) and its support structures. As a consequence, LWR-PV integrity is a primary safety consideration. LWR-PV integrity is a significant economic consideration since the PV and its support structures are nonreplaceable power plant components and embrittlement of these components can therefore limit the effective operating lifetime of the plant

Study of intergranular embrittlement in Fe-12Mn alloys

International Nuclear Information System (INIS)

Lee, H.J.

1982-06-01

A high resolution scanning Auger microscopic study has been performed on the intergranular fracture surfaces of Fe-12Mn steels in the as-austenitized condition. Fracture mode below the ductile-brittle transition temperature was intergranular whenever the alloy was quenched from the austenite field. The intergranular fracture surface failed to reveal any consistent segregation of P, S, As, O, or N. The occasional appearance of S or O on the fracture surface was found to be due to a low density precipitation of MnS and MnO 2 along the prior austenite boundaries. An AES study with Ar + ion-sputtering showed no evidence of manganese enrichment along the prior austenite boundaries, but a slight segregation of carbon which does not appear to be implicated in the tendency toward intergranular fracture. Addition of 0.002% B with a 1000 0 C/1h/WQ treatment yielded a high Charpy impact energy at liquid nitrogen temperature, preventing the intergranular fracture. High resolution AES studies showed that 3 at. % B on the prior austenite grain boundaries is most effective in increasing the grain boundary cohesive strength in an Fe-12Mn alloy. Trace additions of Mg, Zr, or V had negligible effects on the intergranular embrittlement. A 450 0 C temper of the boron-modified alloys was found to cause tempered martensite embrittlement, leading to intergranular fracture. The embrittling treatment of the Fe-12Mn alloys with and without boron additions raised the ductile-brittle transition by 150 0 C. This tempered martensite embrittlement was found to be due to the Mn enrichment of the fracture surface to 32 at. % Mn in the boron-modified alloy and 38 at. % Mn in the unmodified alloy. The Mn-enriched region along the prior austenite grain boundaries upon further tempering is believed to cause nucleation of austenite and to change the chemistry of the intergranular fracture surfaces. 61 figures

Influences of Nozzle Material on Laser Droplet Brazing Joints with Cu89Sn11 Preforms

Science.gov (United States)

Stein, Stefan; Heberle, Johannes; Gürtler, Franz Josef; Cvecek, Kristian; Roth, Stephan; Schmidt, Michael

This paper presents latest results on the influences of nozzle material and geometry on the electromechanical contacting of sensitive piezoceramic actuator modules. Two nozzle types have been investigated,a standard WC/Co nozzle which is used for soldering applications and a novelceramic nozzle. Applications for active piezoceramic components integrated in structural parts are e.g. active damping, energy harvesting, or monitoring of vibrations and material failure. Anup to now unsolved problem is the electrical contacting of such components without damaging the conductor or the metallization of the ceramic substrate. Since piezoelectric components are to be integrated into structures made of casted aluminum, requirements are high mechanical strength and temperature resistance. Within this paper a method forcontacting piezoceramic modules is presented. A spherical braze preform of tin bronze Cu89Sn11 with a diameter of 600 μm is located in a ceramic nozzle and is subsequently melted by a laser pulse. The liquid solder is ejected from the nozzlevia nitrogen overpressure and wets the surface of the metallization pad and the Cu-wire, resulting in a brazing joint after solidification. The process is called laser droplet brazing (LDB). To asses the thermal evolution during one cycle WC/Co and ZTA have been simulated numerically for two different geometries enabling a proposition weather the geometry or the material properties have a significant influence on the thermal load during one cycle. To evaluate the influence of the nozzle on the joint the positioning accuracy, joint height and detachment times have been evaluated. Results obtained with the ZTA nozzle show comparable positioning accuracies to a WC/Co nozzle with a lower standard deviation of solder detachment time.

Development of high melting point, environmentally friendly solders, using the calphad approach

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

2008-01-01

An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Vario...... tension have also been considered. Special focus has been given to toxicity related issues since the main ideology of looking for an alternative to high lead containing solders is not related to technical issues but due to environmental concerns.......An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Various...... of promising solder alloy candidates. The ternary combinations that satisfied the primary solidification requirement were scrutinized taking into account the commercial interests i.e. availability, cost-effectiveness, recyclability and toxicity issues. Technical issues like manufacturability and surface...

Experimental study on the resistance to hydrogen embrittlement of NIFS-V4Cr4Ti alloy

International Nuclear Information System (INIS)

Chen Jiming; Xu Zengyu; Den Ying; Muroga, T.

2002-01-01

SWIP (Southwestern Institute of Physics) has joined an international collaboration on the hydrogen embrittlement resistance evaluation of the vanadium alloy. This paper presents some experiments on the tensile properties and Charpy impact properties of the NIFS-V4Cr4Ti alloy with high-level hydrogen concentration. The experiment results show different properties against hydrogen embrittlement in static tension and impact load. The critical hydrogen concentration required to embrittle the alloy was about 215 - 310 mg·kg -1 on static tension load, but less than 130 mg·kg -1 on impact loading

Irreversible traps, their influence on the embrittlement of high strength steel

International Nuclear Information System (INIS)

Mariano, I; Mansilla, G

2012-01-01

Hydrogen (H) can be trapped in lattice defects such as vacancies, dislocations, grain boundaries and interfaces between the matrix and precipitates. The effect on the mechanical properties depends on factors inherent in materials such as the activation energy of irreversible traps (H trapped in Network Places) and its sensitivity to embrittlement. Differential scanning calorimetry (DSC) allows the study of those processes in which enthalpy variation occurs. The purpose is to record the difference in enthalpy change that occurs in the sample as a function of temperature or time. This work represents a study of H embrittlement of high strength steel resulfurized

Effect of microstructure on the susceptibility of a 533 steel to temper embrittlement

Energy Technology Data Exchange (ETDEWEB)

Raoul, S.; Marini, B. [CEA Centre d`Etudes Nucleaires de Saclay, 91 - Gif-sur-Yvette (France). Service de Recherches Metallurgiques Appliquees; Pineau, A. [CNRS, Evry (France). Centre de Materiaux

1998-11-01

In ferritic steels, brittle fracture usually occurs at low temperature by cleavage. However the segregation of impurities (P, As, Sn etc..) along prior {gamma} grain boundaries can change the brittle fracture mode from transgranular to intergranular. In quenched and tempered steels, this segregation is associated with what is called the temper-embrittlement phenomenon. The main objective of the present study is to investigate the influence of the as-quenched microstructure (lower bainite or martensite) on the susceptibility of a low alloy steel (A533 cl.1) to temper-embrittlement. Dilatometric tests were performed to determine the continous-cooling-transformation (CCT) diagram of the material and to measure the critical cooling rate (V{sub c}) for a martensitic quench. Then subsized Charpy V-notched specimens were given various cooling rates from the austenitization temperature to obtain a wide range of as-quenched microstructures, including martensite and bainite. These specimens were subsequently given a heat treatment to develop temper embrittlement and tested to measure the V-notch fracture toughness at -50 C. The fracture surfaces were examined by SEM. It is shown that martensitic microstructures are more susceptible to intergranular embrittlement than bainitic microstructures. These observed microstructural influences are briefly discussed. (orig.) 11 refs.

Stress corrosion cracking and hydrogen embrittlement of an Al-Zn-Mg-Cu alloy

International Nuclear Information System (INIS)

Song, R.G.; Dietzel, W.; Zhang, B.J.; Liu, W.J.; Tseng, M.K.; Atrens, A.

2004-01-01

The age hardening, stress corrosion cracking (SCC) and hydrogen embrittlement (HE) of an Al-Zn-Mg-Cu 7175 alloy were investigated experimentally. There were two peak-aged states during ageing. For ageing at 413 K, the strength of the second peak-aged state was slightly higher than that of the first one, whereas the SCC susceptibility was lower, indicating that it is possible to heat treat 7175 to high strength and simultaneously to have high SCC resistance. The SCC susceptibility increased with increasing Mg segregation at the grain boundaries. Hydrogen embrittlement (HE) increased with increased hydrogen charging and decreased with increasing ageing time for the same hydrogen charging conditions. Computer simulations were carried out of (a) the Mg grain boundary segregation using the embedded atom method and (b) the effect of Mg and H segregation on the grain boundary strength using a quasi-chemical approach. The simulations showed that (a) Mg grain boundary segregation in Al-Zn-Mg-Cu alloys is spontaneous, (b) Mg segregation decreases the grain boundary strength, and (c) H embrittles the grain boundary more seriously than does Mg. Therefore, the SCC mechanism of Al-Zn-Mg-Cu alloys is attributed to the combination of HE and Mg segregation induced grain boundary embrittlement

Influence of the volume-contact area ratio on the growth behavior of the Cu-Sn intermetallic phase

Science.gov (United States)

Giddaluri, Venkatakamakshi Supraja

Solder Joints play a very important role in electronic packaging industry by serving as mechanical support and provides integrity to the device. The increasing demand for high performance, environmental and economic feasibility and miniaturization led to the development of high density interconnects. With the reduction in the size/standoff height of the solder reliability issues in the surface mount assemblies and packaging structures under various rigorous environments are becoming significant. One of the most important impact factors that affect the solder joint reliability is the growth rate IMC formed between the solder and substrate with reduction in joint size. IMC formation is required to ensure good bonding and connectivity of the device in packaging. However excess IMC growth rate is detrimental to the device from mechanical aspects due to its brittle nature. Thus there is a need to study effect the IMC growth rate behavior with the solder joint size/standoff height. In this present study, two solder joints of different standoff heights and same composition (pure Sn solder) are used subjected to reflow process at 270°C for 1--7 min to study solid liquid interfacial reaction on joint size and the same experiment is repeated with SAC alloy of composition (96.5% Sn, 3.0% Ag, 0.5% Cu) to investigate the effect of joint size and initial copper concentration on IMC growth rate. The IMC thickness of the Sn 15microm solder joint at 1 min and 7 min is found to be 1.52microm and 2.86microm respectively while that of Sn 150microm solder joint is 1.31microm and 3.16 microm. The thickness is high in low standoff height sample at the early stage of reaction with decrease in IMC growth rate as the time of reflow increases. In case of 25microm SAC alloy solder joint the IMC thickness from 1 and 7 min is found to be 2.1microm and 3.5microm while that of 250microm SAC alloy solder joint its 1.43microm and3.235microm. Similar trend is observed but the IMC thickness is more

Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

Energy Technology Data Exchange (ETDEWEB)

Hamm, Randy; Peterson, Kenneth A.

2015-10-01

This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.

Improvement of the auto wire feeder machine in a de-soldering process

Directory of Open Access Journals (Sweden)

Niramon Nonkhukhetkhong

2016-10-01

Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

In Situ Study of Reduction Process of CuO Paste and Its Effect on Bondability of Cu-to-Cu Joints

Science.gov (United States)

Yao, Takafumi; Matsuda, Tomoki; Sano, Tomokazu; Morikawa, Chiaki; Ohbuchi, Atsushi; Yashiro, Hisashi; Hirose, Akio

2018-04-01

A bonding method utilizing redox reactions of metallic oxide microparticles achieves metal-to-metal bonding in air, which can be alternative to lead-rich high-melting point solder. However, it is known that the degree of the reduction of metallic oxide microparticles have an influence on the joint strength using this bonding method. In this paper, the reduction behavior of CuO paste and its effect on Cu-to-Cu joints were investigated through simultaneous microstructure-related x-ray diffraction and differential scanning calorimetry measurements. The CuO microparticles in the paste were gradually reduced to submicron Cu2O particles at 210-250°C. Subsequently, Cu nanoparticles were generated instantaneously at 300-315°C. There was a marked difference in the strengths of the joints formed at 300°C and 350°C. Thus, the Cu nanoparticles play a critical role in sintering-based bonding using CuO paste. Furthermore, once the Cu nanoparticles have formed, the joint strength increases with higher bonding temperature (from 350°C to 500°C) and pressure (5-15 MPa), which can exceed the strength of Pb-5Sn solder at higher temperature and pressure.

Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

DEFF Research Database (Denmark)

Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

2003-01-01

We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E...... in a carbon matrix. Nanoscale soldering of multi-walled carbon nanotubes (MWNT) onto microelectrodes was achieved by deposition of a conducting gold line across a contact point between nanotube and electrode. The solderings were found to be mechanically stronger than the carbon nanotubes. We have positioned...... MWNTs to bridge the gap between two electrodes, and formed soldering bonds between the tube and each of the electrodes. All nanotube bridges showed ohmic resistances in the range 10-30 kΩ. We observed no increase in resistance after exposing the MWNT bridge to air for days....

Reliability analysis of different structure parameters of PCBA under drop impact

Science.gov (United States)

Liu, P. S.; Fan, G. M.; Liu, Y. H.

2018-03-01

The establishing process of PCBA is modelled by finite element analysis software ABAQUS. Firstly, introduce the Input-G method and the fatigue life under drop impact are introduced and the mechanism of the solder joint failure in the process of drop is analysed. The main reason of solder joint failure is that the PCB component is suffering repeated tension and compression stress during the drop impact. Finally, the equivalent stress and peel stress of different solder joint and plate-level components under different impact acceleration are also analysed. The results show that the reliability of tin-silver copper joint is better than that of tin- lead solder joint, and the fatigue life of solder joint expectancy decrease as the impact pulse amplitude increases.

Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

Directory of Open Access Journals (Sweden)

Xiuyun Zhou

2015-10-01

Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

Post Irradiation Mechanical Behaviour of Three EUROFER Joints

International Nuclear Information System (INIS)

Lucon, E.; Leenaers, A.; Vandermeulen, W.

2006-01-01

The post-irradiation mechanical properties of three EUROFER joints (two diffusion joints and one TIG weld) have been characterized after irradiation to 1.8 dpa at 300 degrees Celsius in the BR-2 reactor. Tensile, KLST impact and fracture toughness tests have been performed. Based on the results obtained and on the comparison with data from EUROFER base material irradiated under similar conditions, the post-irradiation mechanical behaviour of both diffusion joints (laboratory and mock-up) appears similar to that of the base material. The properties of the TIG joint are affected by the lack of a post-weld heat treatment, which causes the material from the upper part of the weld to be significantly worse than that of the lower region. Thus, specimens from the upper layer exhibit extremely pronounced hardening and embrittlement caused by irradiation. The samples extracted from the lower layer show much better resistance to neutron exposure, although their measured properties do not match those of the diffusion joints. The results presented demonstrate that diffusion joining can be a very promising technique.

Reliability of Pb free solder alloys. Physical and mechanical properties; Pb free handa no shinraisei. Butsuri kikaiteki shinraisei

Energy Technology Data Exchange (ETDEWEB)

Sanji, M; Yoshino, M; Ishikawa, J; Takenaka, O [Denso Corp., Aichi (Japan)

1997-10-01

Properties of 19 different Pb free solders have been evaluated in comparison with Sn-37Pb eutectic solder. Pb free solders without Bi were on the same level as Sn-37Pb in tensile strength and elongation, and those with Bi had higher strength and lower elongation than Sn-37Pb. As the Bi content increased, strength was higher, and elongation was lower. In torsion fatigue tests, fatigue life of Pb free solders without Bi was longer than Sn-37Pb. The relationships of Coffin-Manson rule and Basquin rule with fatigue life was applicable to Pb free solder. Fatigue life of those is inferred from their tensile strength. 7 refs., 13 figs., 1 tab.

Fracture toughness prediction for RPV Steels with various degree of embrittlement

International Nuclear Information System (INIS)

Margolin, B.; Gulenko, A.; Shvetsova, V.

2003-01-01

In the present report, predictions of the temperature dependence of cleavage fracture toughness are performed on the basis of the Master Curve approach and a probabilistic model named now the Prometey model. These predictions are performed for reactor pressure vessel steels in different states, the initial (as-produced), irradiated state with moderate degree of embrittlement and in the highly embrittled state. Calculations of the K IC (T) curves may be performed with both approaches on the basis of fracture toughness test results from pre-cracked Charpy specimens at some (one) temperature. The calculated curves are compared with test results. It is shown that the K IC (T) curves for the initial state calculated with the Master Curve approach and the probabilistic model show good agreement. At the same time, for highly embrittled RPV steel, the K IC (T) curve predicted with the Master Curve approach is not an adequate fit to the experimental data, whereas the agreement of the test results and the K IC (T) curve calculated with the probabilistic model is good. An analysis is performed for a possible variation of the K IC (T) curve shape and the scatter in K IC results. (author)

Effects of metallurgical variables on hydrgen embrittlement in types 316, 321, and 347 stainless steels

International Nuclear Information System (INIS)

Rozenak, P.; Eliezer, D.

1984-01-01

Hydrogen embrittlement of 316, 321 and 347 types austenitic stainless steels has been studied by charging thin tensile specimens with hydrogen through cathodic polarization. Throughout this study we have compared solution annealed samples having various prior austenitic grain-size with samples given the additional sensitization treatment. The results show that refined grains improves the resistance to hydrogen cracking regardless of the failure mode. The sensitized specimens were predominantly intergranular, while the annealed specimens show massive regions of microvoid coalescence producing ductile rupture. 347 type stainless steel is much more susceptible to hydrogen embrittlement than 321 type steel, and 316 type is the most resistant to hydrogen embrittlement. the practical implication of the experimental conclusions are discussed

Quantifying the dependence of Ni(P) thickness in ultrathin-ENEPIG metallization on the growth of Cu–Sn intermetallic compounds in soldering reaction

Energy Technology Data Exchange (ETDEWEB)

Ho, Cheng-Ying; Duh, Jenq-Gong, E-mail: jgd@mx.nthu.edu.tw

2014-11-14

A new multilayer metallization, ENEPIG (Electroless Ni(P)/Electroless Pd/Immersion Au) with ultrathin Ni(P) deposit (ultrathin-ENEPIG), was designed to be used in high frequency electronic packaging in this study because of its ultra-low electrical impedance. Sequential interfacial microstructures of commercial Sn–3.0Ag–0.5Cu solders reflowed on ultarthin-ENEPIG with Ni(P) deposit thickness ranged from 4.79 μm to 0.05 μm were first investigated. Accelerated thermal aging test was then conducted to evaluate the long-term thermal stabilization of solder joints. The results showed that P-rich intermetallic compound (IMC) layer formed when the Ni(P) thickness was greater than a critical vale (about 0.18 μm). Besides, it is interesting to mention that the growth of (Cu,Ni){sub 6}Sn{sub 5} and (Cu,Ni){sub 3}Sn IMCs was suppressed with the formation of P-rich layer, i.e., Ni{sub 3}P and Ni{sub 2}Sn{sub 1+x}P{sub 1−x} phase, even though the electroless-plated Ni(P) layer was exhausted at initial stage of reflow process. The atomic Cu flux in solder joints without P-rich layer was calculated to be several times larger than that with P-rich layer formation after calculation, which implies that the P-rich layer and ultrathin Ni(P) deposit in ENEPIG served as diffusion barrier against rapid Cu diffusion. - Highlights: • Microstructures in ultrathin-ENEPIG with various Ni(P) thickness are investigated. • P-rich IMC layer formed when the Ni(P) thickness is greater than 0.18 μm. • Secondary (Cu,Ni){sub 6}Sn{sub 5} formed when the Ni(P) thickness is between 0.18 and 0.31 μm. • Cu diffusion flux without P-rich layer is larger than those with P-rich layer. • P-rich layer in ultrathin-ENEPIG exhibits good diffusion barrier characteristic.

Laser tissue welding mediated with a protein solder

Science.gov (United States)

Small, Ward, IV; Heredia, Nicholas J.; Celliers, Peter M.; Da Silva, Luiz B.; Eder, David C.; Glinsky, Michael E.; London, Richard A.; Maitland, Duncan J.; Matthews, Dennis L.; Soltz, Barbara A.

1996-05-01

A study of laser tissue welding mediated with an indocyanine green dye-enhanced protein solder was performed. Freshly obtained sections of porcine artery were used for the experiments. Sample arterial wall thickness ranged from two to three millimeters. Incisions approximately four millimeters in length were treated using an 805 nanometer continuous- wave diode laser coupled to a one millimeter diameter fiber. Controlled parameters included the power delivered by the laser, the duration of the welding process, and the concentration of dye in the solder. A two-color infrared detection system was constructed to monitor the surface temperatures achieved at the weld site. Burst pressure measurements were made to quantify the strengths of the welds immediately following completion of the welding procedure.

Zinc-induced embrittlement in nickel-base superalloys by simulation and experiment

Science.gov (United States)

Otis, Richard; Waje, Mahesh; Lindwall, Greta; Jefferson, Tiffany; Lange, Jeremy; Liu, Zi-Kui

2017-09-01

The high cost of Re has driven interest in processes for recovering Re from scrap superalloy parts. In this work thermodynamic modelling is used to study Zn-induced embrittlement of a superalloy and to direct experiments. Treating superalloy powder with Zn vapour reduces the average particle size after milling from approximately ?m to 0.5-10 ?m, vs. ?m for untreated powder. Simulations predict the required treatment time to increase with temperature. Agreement between predictions and experiments suggests that an embrittling liquid forms in less than an hour of Zn vapour treatment between 950-1000 ?C and partial pressures of Zn between 14-34 kPa (2-5 psi).

Influence of helium embrittlement on post-irradiation creep rupture behaviour of austenitic and martensitic stainless steels

International Nuclear Information System (INIS)

Wassilew, C.

1982-01-01

The author has investigated the influence of helium embrittlement on the creep rupture properties of the austenitic stainless steels 1.4970 and 1.4962 and the martensitic stainless steel 1.4914 after irradiation in the BR-2 reactor in Mol, Belgium. The results show that austenitic steels react much more strongly to the embrittlement effect of the helium than do martensitic steels. The causes of the lower embrittlement tendency of the martensitic than of both austenitic stainless steels were analysed carefully. A new embrittlement model was developed on the basis of data derived from the creep rupture experiments, and reinforced by a simple metallographic investigation of the fracture zone and its immediate environment. This model pays specific attention to the role of the twin planes as the most efficient area of increased vacancy production, and takes into account the ability of the twin boundaries to transport these vacancies with reduced energy and low loss into the high-angle grain boundaries. (author)

Electrical Resistance of Nb$_{3}$Sn/Cu Splices Produced by Electromagnetic Pulse Technology and Soft Soldering

CERN Document Server

Schoerling, D; Scheuerlein, C; Atieh, S; Schaefer, R

2011-01-01

The electrical interconnection of Nb$_{3}$Sn/Cu strands is a key issue for the construction of Nb$_{3}$Sn based damping ring wigglers and insertion devices for third generation light sources. We compare the electrical resistance of Nb$_{3}$Sn/Cu splices manufactured by solid state welding using Electromagnetic Pulse Technology (EMPT) with that of splices produced by soft soldering with two different solders. The resistance of splices produced by soft soldering depends strongly on the resistivity of the solder alloy at the operating temperature. By solid state welding splice resistances below 10 nOhm can be achieved with 1 cm strand overlap length only, which is about 4 times lower than the resistance of Sn96Ag4 soldered splices with the same overlap length. The comparison of experimental results with Finite Element simulations shows that the electrical resistance of EMPT welded splices is determined by the resistance of the stabilizing copper between the superconducting filaments and confirms that welding of ...

Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

Science.gov (United States)

Hasnine, M.; Tolla, B.; Vahora, N.

2018-04-01

This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

Initial assessment of the mechanisms and significance of low-temperature embrittlement of cast stainless steels in LWR systems

International Nuclear Information System (INIS)

Chopra, O.K.; Sather, A.

1990-08-01

This report summarizes work performed by Argonne National Laboratory on long-term embrittlement of cast duplex stainless steels in LWR systems. Metallurgical characterization and mechanical property data from Charpy-impact, tensile, and J-R curve tests are presented for several experimental and commercial heats, as well as for reactor-aged CF-3, CF-8, and CF-8M cast stainless steels. The effects of material variables on the embrittlement of cast stainless steels are evaluated. Chemical composition and ferrite morphology strongly affect the extent and kinetics of embrittlement. In general, the low-carbon CF-3 stainless steels are the most resistant and the molybdenum-containing high-carbon CF-8M stainless steels are most susceptible to embrittlement. The microstructural and mechanical-property data are analyzed to establish the mechanisms of embrittlement. The procedure and correlations for predicting the impact strength and fracture toughness of cast components during reactor service are described. The lower bound values of impact strength and fracture toughness for low-temperature-aged cast stainless steel are defined. 39 refs., 56 figs., 8 tabs

Long-term aging embrittlement of cast duplex stainless steels in LWR systems

International Nuclear Information System (INIS)

Chopra, O.K.; Chung, H.M.

1991-01-01

The primary objectives of this program are to investigate the significance of in-service embrittlement of cast duplex stainless steels in light water reactor (LWR) systems and to evaluate possible remedies for the embrittlement problem in existing and future plants. The scope of the investigation includes three goals: (1) develop a methodology and correlations for predicting the toughness loss suffered by cast stainless steel components during normal and extended life of LWRs, (2) validate the simulation of in-reactor degradation by accelerated aging, and (3) establish the effects of key compositional and metallurgical variables on the kinetics and extent of embrittlement. The emphasis during the current year was on developing a procedure and correlations for predicting fracture toughness J-R curves of aged cast stainless steels from known material information. The present analysis has focused on developing correlations for the fracture properties in terms of material information that can be determined from the certified material test record (CMTR) and on ensuring that the correlations are adequately conservative for structurally weak materials

Study on the application of 50 mm thick welded joints without PWHT for containment vessels

Energy Technology Data Exchange (ETDEWEB)

Watanabe, Nozomu; Sakai, Yoshiyuki; Hayashi, Kazutoshi; Higashikubo, Tomohiro (Mitsubishi Heavy Industries. Ltd., Kobe Shipyard and Machinery Works (Japan)); Iida, Kunihiro (Shibaura Inst. of Tech., Dept. of Mechanical Engineering, Tokyo (Japan)); Satou, Masanobu (Mitsubishi Heavy Industries. Ltd., Tkasago Research and Development Center (Japan))

1992-01-01

In order to investigate the propriety of the use of 50 mm thick SGV480 carbon steel which is equivalent to ASTM A516 Gr. 70 without post weld heat treatment for containment vessels, the authors have certified the basic properties of base metal and welded joints of 50 mm thick SGV480 steel plates. The results showed that fracture thoughness of welded joints is high without PWHT and the steel is safe enough without PWHT against embrittlement fracture under the operating conditions. (orig.).

Study on the application of 50 mm thick welded joints without PWHT for containment vessels

International Nuclear Information System (INIS)

Watanabe, Nozomu; Sakai, Yoshiyuki; Hayashi, Kazutoshi; Higashikubo, Tomohiro; Iida, Kunihiro; Satou, Masanobu

1992-01-01

In order to investigate the propriety of the use of 50 mm thick SGV480 carbon steel which is equivalent to ASTM A516 Gr. 70 without post weld heat treatment for containment vessels, the authors have certified the basic properties of base metal and welded joints of 50 mm thick SGV480 steel plates. The results showed that fracture thoughness of welded joints is high without PWHT and the steel is safe enough without PWHT against embrittlement fracture under the operating conditions. (orig.)

Status of reactor pressure vessel embrittlement study in Japan

International Nuclear Information System (INIS)

Sasajima, H.

1997-01-01

Since the construction of Japanese first commercial nuclear power plant in 1966, 52 nuclear power plants have been commissioned in Japan to commercial operation. Japanese first nuclear power plant has now been service for 30 years and the aging of nuclear power plants is steadily progressing in general. Under these circumstances, the Japan Power Engineering and Inspection Corporation (JAPEIC) is executing, under consignment by the Ministry of International Trade and Industry (MITI), the development and verification test programs for plant integrity evaluation technology by which nuclear power plant aging can be appropriately handled. This paper shows the outline of study dealing with embrittlement of RPV caused by neutron irradiation, as one of the activity of JAPEIC. The embrittlement of RPV caused by neutron irradiation is manifested as a shift of transition temperature and as a reduction in Upper Shelf Energy (USE). In JAPEIC, the study dealing with a shift of transition temperature was conducted in the ''Reactor Pressure Vessel Pressurized Thermal Shock Test Project (the PTS Project)'', and the study dealing with a reduction in USE has been conducted in the ''Nuclear Power Plant Life Management Technology (the PLIM Project)''. And the reconstitution technology of surveillance test specimen has been conducted in PLIM Project as one of the measures to improve monitoring above material characteristic changes. The integrity evaluation under the Pressurized Thermal Shock (PTS) events including the effect of neutron irradiation embrittlement was initiated in 1983 FY as the PTS Project and was completed in the 1991 FY. The study verified that plant integrity could be assured at not only the end of design life, but also an extended service life even when the severest PTS events were postulated. The PLIM Project, designed to develop and verify the integrity evaluation technology dealing with reduction of USE by neutron irradiation, was started in the 1996 FY as a 10

Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

DEFF Research Database (Denmark)

Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

Embrittlement of the Shippingport reactor shield tank

International Nuclear Information System (INIS)

Chopra, O.K.; Shack, W.J.

1989-01-01

Surveillance specimens from the High Flux Isotope Reactor (HFIR) at Oak Ridge National Laboratory showed an unexpectedly high degree of embrittlement relative to the data obtained on similar materials in Materials Testing Reactors (MTRs). The results suggest a possible negative flux effect and raise the issue of embrittlement of the pressure vessel support structures of commercial light water reactors. To help resolve this issues, a program was initiated to characterize the irradiation embrittlement of the neutron shield tank (NST) from the decommissioned Shippingport reactor. The Shippingport NST operated at 55 degree C (130 degree F) and was fabricated from A212 Grade B steel, similar to the vessel material in HFIR. The inner wall of the NST was exposed to a total maximum fluence of ∼ 6 x 10 17 n/cm 2 (E > 1 MeV) over a life of 9.25 effective full power years. This corresponds to a fast flux of 2.1 x 10 9 n/cm 2 x s and is comparable to the conditions for the HFIR surveillance specimens. The results indicate that irradiation increases the 15 ft x lb Charpy transition temperature (CTT) by ∼25 degree C (45 degree F) and decreases the upper shelf energy. The shift in CTT is not as severe as that observed in the HFIR surveillance specimens and is consistent with that expected from the MTR data base. However, the actual value of CTT is high, and the toughness at service temperature is low, even when compared with the HFIR data. The increase in yield stress is ∼50 MPa, which is comparable to the HFIR data. The results also indicate a lower impact strength and higher transition temperature for the TL orientation than that for the LT orientation. Some effects of the location across the thickness of the wall are also observed for the LT specimens; CTT is slightly greater for the specimens from the inner region of the wall

Environmental embrittlement of intermetallic compounds in Fe-Al alloys

Institute of Scientific and Technical Information of China (English)

张建民; 张瑞林; S.H.YU; 余瑞璜

1996-01-01

First,it is proposed that hydrogen atoms occupy the interstitial sites in Fe3Al and FeAl.Then the environmental embrittlement of intermetallic compounds in Fe-Al alloys is studied in the light of calculated valence electron structures and bond energy of Fe3Al and FeAl containing hydrogen atoms.From the analyses it is found that the states of metal atoms will change,in which more lattice electrons will become covalent electrons to bond with hydrogen atoms when the atomic hydrogen diffuses into the intermetallic compounds in Fe-Al alloys,which will result in the decrease of local metallicity in Fe3Al and FeAl.Meanwhile,it is found that the crystal will easily cleave since solute hydrogen bonds with metal atoms and severely anisotropic bonds form.As a conclusion,these factors result in the environmental embrittlement of Fe3Al and FeAl.

Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

Science.gov (United States)

Kim, Youngsoon; Lee, Seyong; Shin, Ji-won; Paik, Kyung-Wook

2016-06-01

While solder bumps have been used as the bump structure to form the interconnection during the last few decades, the continuing scaling down of devices has led to a change in the bump structure to Cu-pillar/Sn-Ag micro-bumps. Cu-pillar/Sn-Ag micro-bump interconnections differ from conventional solder bump interconnections in terms of their assembly processing and reliability. A thermo-compression bonding method with pre-applied b-stage non-conductive films has been adopted to form solder joints between Cu pillar/Sn-Ag micro bumps and printed circuit board vehicles, using various pad metal finishes. As a result, various interfacial inter-metallic compounds (IMCs) reactions and stress concentrations occur at the Cu pillar/Sn-Ag micro bumps joints. Therefore, it is necessary to investigate the influence of pad metal finishes on the structural reliability of fine pitch Cu pillar/Sn-Ag micro bumps flip chip packaging. In this study, four different pad surface finishes (Thin Ni ENEPIG, OSP, ENEPIG, ENIG) were evaluated in terms of their interconnection reliability by thermal cycle (T/C) test up to 2000 cycles at temperatures ranging from -55°C to 125°C and high-temperature storage test up to 1000 h at 150°C. The contact resistances of the Cu pillar/Sn-Ag micro bump showed significant differences after the T/C reliability test in the following order: thin Ni ENEPIG > OSP > ENEPIG where the thin Ni ENEPIG pad metal finish provided the best Cu pillar/Sn-Ag micro bump interconnection in terms of bump joint reliability. Various IMCs formed between the bump joint areas can account for the main failure mechanism.

Oxidation-induced embrittlement and structural changes of Zircaloy-4 tubing in steam at 700-1000 deg. C

Energy Technology Data Exchange (ETDEWEB)

Ali, A E; Huessein, A G; El-Sayed, A A; El Banna, O A [Atomic Energy Authority, Cairo (Egypt); El Raghy, S M [Cairo Univ. (Egypt). Faculty of Engineering

1997-02-01

The oxidation-induced embrittlement and structural changes of Zircaloy-4 (KWU-Type) tubing was investigated under light water reactors (LWR) Loss-of-Coolant. Accident conditions (LOCA) in temperature range 700-1000 deg. C. The effect of hydrogen addition to steam was also investigated in the temperature range 800-1000 deg. C. The oxidation-induced embrittlement was found to be a function of both temperature and time. Fractography investigation of oxidized tubing showed a typical brittle fracture in the stabilized-alpha zone. The microhardness measurements revealed that the alpha-Zr is harder than that near the mid-wall position. The oxidation-induced embrittlement at 900 deg. C was found to be higher than at 1000 deg. C. The results also indicated that the addition of 5% by volume hydrogen to steam resulted in an increase in the degree of embrittlement. (author). 22 refs, 9 figs, 3 tabs.

Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

DEFF Research Database (Denmark)

Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

2009-01-01

of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

Dissolution ad uptake of cadmium from dental gold solder alloy implants

International Nuclear Information System (INIS)

Bergman, B.; Bergman, M.; Soeremark, R.

1977-01-01

Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium ( 115 Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of 115 Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver. (author)

Dissolution and uptake of cadmium from dental gold solder alloy implants

Energy Technology Data Exchange (ETDEWEB)

Bergman, B; Bergman, M; Soeremark, R [Umeaa Univ. (Sweden); Karolinska Institutet, Stockholm (Sweden))

1977-01-01

Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium (/sup 115/Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of /sup 115/Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver.

CO2 temperature-controlled laser soldering of pig trachea incisions in vitro using flexible albumin bands

Science.gov (United States)

Sharvit, Dan; Vasilyev, Tamar; Vasserman, Irena; Simhon, David; Kariv, Naam; DeRowe, Ari; Katzir, Abraham

2005-04-01

Resection of a segment of the trachea is a procedure applied for the removal of cervical tumors invading the trachea, or for the treatment of severe tracheal stenosis. The current method of anastomosis is based on multiple sutures. The main drawbacks of this method are: 1) A long procedure time, 2) An air leakage, and 3) An inflammatory response to the sutures. In this study we evaluated the feasibility and effectiveness of the use of temperature controlled CO2 laser soldering of incisions in pig tracheas in vitro. A transverse incision was made in a separated pig trachea. A flexible albumin band was prepared and was laser soldered with albumin solder to the outer surface of the trachea, covering the incision. The soldered trachea ends were sealed and the burst pressure was measured. In a series of in vitro experiments, the mean burst pressure was found to be 230 mm Hg. These preliminary results demonstrated that laser soldering using a flexible albumin band may be a useful method for sealing an incision in the trachea.

PR-EDB: Power Reactor Embrittlement Data Base, version 1: Program description

International Nuclear Information System (INIS)

Stallmann, F.W.; Kam, F.B.K.; Taylor, B.J.

1990-06-01

Data concerning radiation embrittlement of pressure vessel steels in commercial power reactors have been collected form available surveillance reports. The purpose of this NRC-sponsored program is to provide the technical bases for voluntary consensus standards, regulatory guides, standard review plans, and codes. The data can also be used for the exploration and verification of embrittlement prediction models. The data files are given in dBASE 3 Plus format and can be accessed with any personal computer using the DOS operating system. Menu-driven software is provided for easy access to the data including curve fitting and plotting facilities. This software has drastically reduced the time and effort for data processing and evaluation compared to previous data bases. The current compilation of the Power Reactor Embrittlement Data base (PR-EDB, version 1) contains results from surveillance capsule reports of 78 reactors with 381 data points from 110 different irradiated base materials (plates and forgings) and 161 data points from 79 different welds. Results from heat-affected-zone materials are also listed. Electric Power Research Institute (EPRI), reactor vendors, and utilities are in the process of providing back-up quality assurance checks of the PR-EDB and will be supplementing the data base with additional data and documentation. 2 figs., 28 tabs

Application of magnetomechanical hysteresis modeling to magnetic techniques for monitoring neutron embrittlement and biaxial stress

International Nuclear Information System (INIS)

Sablik, M.J.; Kwun, H.; Rollwitz, W.L.; Cadena, D.

1992-01-01

The objective is to investigate experimentally and theoretically the effects of neutron embrittlement and biaxial stress on magnetic properties in steels, using various magnetic measurement techniques. Interaction between experiment and modeling should suggest efficient magnetic measurement procedures for determining neutron embrittlement biaxial stress. This should ultimately assist in safety monitoring of nuclear power plants and of gas and oil pipelines. In the first six months of this first year study, magnetic measurements were made on steel surveillance specimens from the Indian Point 2 and D.C. Cook 2 reactors. The specimens previously had been characterized by Charpy tests after specified neutron fluences. Measurements now included: (1) hysteresis loop measurement of coercive force, permeability and remanence, (2) Barkhausen noise amplitude; and (3) higher order nonlinear harmonic analysis of a 1 Hz magnetic excitation. Very good correlation of magnetic parameters with fluence and embrittlement was found for specimens from the Indian Point 2 reactor. The D.C. Cook 2 specimens, however showed poor correlation. Possible contributing factors to this are: (1) metallurgical differences between D.C. Cook 2 and Indian Point 2 specimens; (2) statistical variations in embrittlement parameters for individual samples away from the stated men values; and (3) conversion of the D.C. Cook 2 reactor to a low leakage core configuration in the middle of the period of surveillance. Modeling using a magnetomechanical hysteresis model has begun. The modeling will first focus on why Barkhausen noise and nonlinear harmonic amplitudes appear to be better indicators of embrittlement than the hysteresis loop parameters

A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

Directory of Open Access Journals (Sweden)

Enrico Mick

2015-07-01

Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

Systematics of Structural, Phase Stability, and Cohesive Properties of η'-Cu6(Sn,In)5 Compounds Occurring in In-Sn/Cu Solder Joints

Science.gov (United States)

Ramos, S. B.; González Lemus, N. V.; Deluque Toro, C. E.; Cabeza, G. F.; Fernández Guillermet, A.

2017-07-01

Motivated by the high solubility of In in ( mC44) η'-Cu6Sn5 compound as well as the occurrence of an In-doped η'-intermetallic in the microstructure of Cu/In-Sn/Cu solder joints, a theoretical study has been carried out to investigate the various physical effects of incorporating In at Sn Wyckoff sites of the binary η'-phase. Systematic ab initio calculations using the projected augmented wave method and Vienna Ab initio Simulation Package were used to determine the composition dependence of the structural and cohesive properties of η'-Cu6(Sn,In)5 compounds, compared with those expected from the binary end-member compounds Cu6Sn5 and Cu6In5. The molar volume shows significant deviations from Vegard's law. The predicted composition dependence of the cohesive properties is discussed using two complementary approaches, viz. a valence-electron density approach as well as a bond-number approach, both accounting for the roughly linear dependence of the cohesive energy on the In content. A microscopic interpretation for this general trend is given in terms of the key contributions to chemical bonding in this class of compounds, namely Cu d-electron overlap and hybridization of Cu d-states with In and Sn p-electron states. Moreover, a crystallographic site approach is developed to accurately establish the phase-stabilizing effect of incorporating In at specific Wyckoff positions of the ( mC44) η'-Cu6Sn5 structure.

Radiation embrittlement of WWER 440 pressure vessel steel and of some improved steels by western producers

International Nuclear Information System (INIS)

Koutsky, J.; Vacek, M.; Stoces, B.; Pav, T.; Otruba, J.; Novosad, P.; Brumovsky, M.

1982-01-01

The resistance was studied of Cr-Mo-V type steel 15Kh2MFA to radiation embrittlement at an irradiation temperature of around 288 degC. Studied was the steel used for the manufacture of the pressure vessel of the Paks nuclear reactor in Hungary. The obtained results of radiation embrittlement and hardening of steel 15Kh2MFA were compared with similar values of Mn-Ni-Mo type steels A 533-B and A 508 manufactured by leading western manufacturers within the international research programme coordinated by the IAEA. It was found that the resistance of steel 15Kh2MFA to radiation embrittlement is comparable with steels A 533-B and A 508 by western manufacturers. (author)

Statistical analysis using the Bayesian nonparametric method for irradiation embrittlement of reactor pressure vessels

Energy Technology Data Exchange (ETDEWEB)

Takamizawa, Hisashi, E-mail: takamizawa.hisashi@jaea.go.jp; Itoh, Hiroto, E-mail: ito.hiroto@jaea.go.jp; Nishiyama, Yutaka, E-mail: nishiyama.yutaka93@jaea.go.jp

2016-10-15

In order to understand neutron irradiation embrittlement in high fluence regions, statistical analysis using the Bayesian nonparametric (BNP) method was performed for the Japanese surveillance and material test reactor irradiation database. The BNP method is essentially expressed as an infinite summation of normal distributions, with input data being subdivided into clusters with identical statistical parameters, such as mean and standard deviation, for each cluster to estimate shifts in ductile-to-brittle transition temperature (DBTT). The clusters typically depend on chemical compositions, irradiation conditions, and the irradiation embrittlement. Specific variables contributing to the irradiation embrittlement include the content of Cu, Ni, P, Si, and Mn in the pressure vessel steels, neutron flux, neutron fluence, and irradiation temperatures. It was found that the measured shifts of DBTT correlated well with the calculated ones. Data associated with the same materials were subdivided into the same clusters even if neutron fluences were increased.

Cooperation modes of the radiation embrittlement

International Nuclear Information System (INIS)

Voevodin, V.N.; Laptev, I.N.; Neklyudov, I.M.; Ozhigov, L.S.; Bryk, V.V.; Parkhomenko, A.A.

2012-01-01

According to the results of experimental and theoretical studies of the structures and properties of irradiated deformed materials with different crystalline structure, the effect of irradiation on mechanisms of radiation embrittlement on all structure levels (from atomic to macrolevel) has been shown. The effects of structural localization, collectivization, long range effects, rotation modes development are described. It was shown that these effects are closely interrelated; they characterized the deformed irradiation material as open dissipative system subjected to the laws of such scientific approach as synergetic.

The Effect of Reflow on Wettability of Sn 96.5 Ag 3 Cu 0.5 Solder

Directory of Open Access Journals (Sweden)

Zoltán Weltsch

2012-11-01

Full Text Available Surface conditions on Printed Circuit Board (PCB final finishes have an important impact on the wetting behaviour with lead-free solder. The improvement of wettability in liquid Sn 96.5 Ag 3 Cu 0.5 Solder alloy on PCB substrate was measured with a sessile drop method at 523 K temperature. Wetting properties was determined in normal atmospheric air and inert atmosphere. The wetting angles increasing with the number of reflows both atmosphere. The effect of the atmosphere has a huge importance of the oxidation which manifests itself of the measured wetting angles. One of the most important factors to the wetting properties is the amount of oxygen in the soldering atmosphere. Using the inert atmosphere is crucial to Pb-free solders, particularly after reflows.

Hydrogen Embrittlement Mechanism in Fatigue Behavior of Austenitic and Martensitic Stainless Steels

Directory of Open Access Journals (Sweden)

Sven Brück

2018-05-01

Full Text Available In the present study, the influence of hydrogen on the fatigue behavior of the high strength martensitic stainless steel X3CrNiMo13-4 and the metastable austenitic stainless steels X2Crni19-11 with various nickel contents was examined in the low and high cycle fatigue regime. The focus of the investigations were the changes in the mechanisms of short crack propagation. Experiments in laboratory air with uncharged and precharged specimen and uncharged specimen in pressurized hydrogen were carried out. The aim of the ongoing investigation was to determine and quantitatively describe the predominant processes of hydrogen embrittlement and their influence on the short fatigue crack morphology and crack growth rate. In addition, simulations were carried out on the short fatigue crack growth, in order to develop a detailed insight into the hydrogen embrittlement mechanisms relevant for cyclic loading conditions. It was found that a lower nickel content and a higher martensite content of the samples led to a higher susceptibility to hydrogen embrittlement. In addition, crack propagation and crack path could be simulated well with the simulation model.

Al and Si Influences on Hydrogen Embrittlement of Carbide-Free Bainitic Steel

Directory of Open Access Journals (Sweden)

Yanguo Li

2013-01-01

Full Text Available A first-principle method based on the density functional theory was applied to investigate the Al and Si influences on the hydrogen embrittlement of carbide-free bainitic steel. The hydrogen preference site, binding energy, diffusion behaviour, and electronic structure were calculated. The results showed that hydrogen preferred to be at the tetrahedral site. The binding energy of the cell with Si was the highest and it was decreased to be the worst by adding hydrogen. The diffusion barrier of hydrogen in the cell containing Al was the highest, so it was difficult for hydrogen to diffuse. Thus, hydrogen embrittlement can be reduced by Al rather than Si.

In Situ Monitoring of Pb2+ Leaching from the Galvanic Joint Surface in a Prepared Chlorinated Drinking Water.

Science.gov (United States)

Ma, Xiangmeng; Armas, Stephanie M; Soliman, Mikhael; Lytle, Darren A; Chumbimuni-Torres, Karin; Tetard, Laurene; Lee, Woo Hyoung

2018-02-20

A novel method using a micro-ion-selective electrode (micro-ISE) technique was developed for in situ lead monitoring at the water-metal interface of a brass-leaded solder galvanic joint in a prepared chlorinated drinking water environment. The developed lead micro-ISE (100 μm tip diameter) showed excellent performance toward soluble lead (Pb 2+ ) with sensitivity of 22.2 ± 0.5 mV decade -1 and limit of detection (LOD) of 1.22 × 10 -6 M (0.25 mg L -1 ). The response time was less than 10 s with a working pH range of 2.0-7.0. Using the lead micro-ISE, lead concentration microprofiles were measured from the bulk to the metal surface (within 50 μm) over time. Combined with two-dimensional (2D) pH mapping, this work clearly demonstrated that Pb 2+ ions build-up across the lead anode surface was substantial, nonuniform, and dependent on local surface pH. A large pH gradient (ΔpH = 6.0) developed across the brass and leaded-tin solder joint coupon. Local pH decreases were observed above the leaded solder to a pH as low as 4.0, indicating it was anodic relative to the brass. The low pH above the leaded solder supported elevated lead levels where even small local pH differences of 0.6 units (ΔpH = 0.6) resulted in about four times higher surface lead concentrations (42.9 vs 11.6 mg L -1 ) and 5 times higher fluxes (18.5 × 10 -6 vs 3.5 × 10 -6 mg cm -2 s -1 ). Continuous surface lead leaching monitoring was also conducted for 16 h.

Au-Ge based Candidate Alloys for High-Temperature Lead-Free Solder Alternatives

DEFF Research Database (Denmark)

Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

2009-01-01

Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure and microhard......Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure...... was primarily strengthened by the refined (Ge) dispersed phase. The distribution of phases played a relatively more crucial role in determining the ductility of the bulk solder alloy. In the present work it was found that among the low melting point metals, the addition of Sb to the Au-Ge eutectic would...

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Energy Technology Data Exchange (ETDEWEB)

Hu, Xiaowu, E-mail: xwhmaterials@aliyun.com [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Li, Yulong [School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031 (China); Liu, Yi [School of Materials Science and Engineering, Nanchang University, Nanchang 330031 (China); Min, Zhixian [China Electronics Technology Group Corporation No. 38 Research Institute, Hefei 230088 (China)

2015-03-15

Highlights: • The Sn0.7Cu–xBi solder alloys were directionally solidified. • Both spacing and diameter of fibers decreased with increasing solidification rate. • The UTS and YS first increased with increased solidification rate, then decreased. • The UTS and YS of Sn0.7Cu–xBi first increased with increased Bi content. - Abstract: Bi-containing Sn0.7Cu (SC) eutectic solder alloys were prepared and subjected to directional solidification, through which new types of fiber reinforced eutectic composites were generated. The influences of Bi addition on the microstructures and tensile properties of directionally solidified (DS) Bi-containing eutectic SC lead-free solder alloys have been investigated by using differential scanning calorimetry (DSC), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and a tensile testing machine. The experimental results showed that addition of Bi could effectively reduce both the melting temperature and undercooling of SC solder alloy. The microstructures of DS SC–xBi solder alloys were composed of Sn-rich phase (β) and Cu{sub 6}Sn{sub 5} fiber. No other intermetallic compounds (IMCs) with Bi content were observed in the solder matrix for SC solder alloys with various Bi contents. Both fiber spacing and diameter all decreased gradually with increasing growth rate and/or Bi content. Besides, the regularity of Cu{sub 6}Sn{sub 5} fibers alignment also decreased with increasing growth rate, too. The tensile strengths of the SC–xBi eutectic solder alloys varied parabolically with growth rate (R). When R was 60 μm/s, maximum tensile strengths of 43.8, 55.2 and 56.37 MPa were reached for SC, SC0.7Bi and SC1.3Bi solder alloys. A comparison of tensile strength of SC, SC0.7Bi and SC1.3Bi with the same R indicated that the tensile strength increased with increasing Bi content, which was attributed to the presence of Bi and its role in refining microstructure and solid solution strengthening.

Laser Soldering and Thermal Cycling Tests of Monolithic Silicon Pixel Chips

CERN Document Server

Strand, Frode Sneve

2015-01-01

An ALPIDE-1 monolithic silicon pixel sensor prototype has been laser soldered to a flex printed circuit using a novel interconnection technique using lasers. This technique is to be optimised to ensure stable, good quality connections between the sensor chips and the FPCs. To test the long-term stability of the connections, as well as study the effects on hit thresholds and noise in the sensor, it was thermally cycled in a climate chamber 1200 times. The soldered connections showed good qualities like even melting and good adhesion on pad/flex surfaces, and the chip remained in working condition for 1080 cycles. After this, a few connections failed, having cracks in the soldering tin, rendering the chip unusable. Threshold and noise characteristics seemed stable, except for the noise levels of sector 2 in the chip, for 1000 cycles in a temperature interval of "10^{\\circ}" and "50^{\\circ}" C. Still, further testing with wider temperature ranges and more cycles is needed to test the limitations of the chi...

Non-destructive evaluation of thermal aging embrittlement of duplex stainless steels

International Nuclear Information System (INIS)

Yi, Y.S.; Tomobe, T.; Watanabe, Y.; Shoji, T.

1993-01-01

The non-destructive evaluation procedure for detecting thermal aging embrittlement of cast duplex stainless steels has been investigated. As a novel measurement technique for the thermal aging embrittlement, an electrochemical method was used and anodic polarization behaviors were measured on new, service exposed, and laboratory aged materials and then were compared with the results of the mechanical tests and microstructural changes. During the polarization experiments performed in potassium hydroxide solution (KOH), M 23 C 6 carbides on phase boundary were preferentially dissolved, which was comfirmed by the SEM after polarization measurements. The preferential dissolution of M 23 C 6 carbides were obtained. Also, the non-destructive measurement and evaluation method of spinodal decomposition, which has been known as the primary mechanism of embrittlement inferrite phase, was reviewed. When the materials, where spinodal decomposition occurred, were polarized in an acetic acid solution (CH 3 COOH), larger critical anodic current densities were observed than those observed on new materials, and these results were consistent with the result of the microhardness measurement. Concerning these polarization results, a critical electric charge, which was required for stable passive films in passive metals, was defined and the relationship between the microstructural changes and this charge amount was reviewed under various polarization conditions in order to verify the polarization mechanism of the spinodally decomposed ferrite phase

Reduction of helium embrittlement in stainless steel by finely dispersed TiC precipitates

International Nuclear Information System (INIS)

Kesternich, W.; Rothaut, J.

1982-01-01

The He embrittlement effects in two candidate stainless steels for first wall of fusion reactors were studied in creep tests at 700 0 C simulating the He production by He implantation. Creep rupture life before He implantation and reduction of rupture life due to He were superior by orders of magnitude in 1.4970 steel after pertinent pretreatment compared to 316 steel. The high strength and the low He embrittlement result from a fine dispersion of TiC precipitates in the grain interiors. From microstructural investigations a mechanism explaining the high sink efficiency of TiC for He atom accumulation is suggested. (orig.)

Evaluation on thermal aging embrittlement of cast stainless steel components in domestic PWRs

Energy Technology Data Exchange (ETDEWEB)

Lee, Bong Sang; Hwa, Hong Jun; Chi, Se Hwan; Ryu, Woo Seog; Kuk, Il Hyun [Korea Atomic Energy Research Institute, Taejon (Korea, Republic of)

1994-06-01

This report reviewed the R and D states of thermal aging embrittlement of cast stainless steel components in PWRs. Cast stainless steel is being widely used in PWRs including primary piping. This material shows the reduction of fracture toughness during operating life due to high temperature. Micromechanisms and kinetics are summarized to improve the materials properties. The reduction of toughness due to thermal embrittlement in domestic reactors are predicted based on each chemical composition until the end of plant life time. Substantial degradation was predicted in some components during plant life time. (Author) 26 refs., 19 figs., 11 tabs.

Hydrogen embrittlement considerations in niobium-base alloys for application in the ITER divertor

International Nuclear Information System (INIS)

Peterson, D.T.; Hull, A.B.; Loomis, B.A.

1991-01-01

The ITER divertor will be subjected to hydrogen from aqueous corrosion by the coolant and by transfer from the plasma. Global hydrogen concentrations are one factor in assessing hydrogen embrittlement but local concentrations affected by source fluxes and thermotransport in thermal gradients are more important considerations. Global hydrogen concentrations is some corrosion- tested alloys will be presented and interpreted. The degradation of mechanical properties of Nb-base alloys due to hydrogen is a complex function of temperature, hydrogen concentration, stresses and alloy composition. The known tendencies for embrittlement and hydride formation in Nb alloys are reviewed

Study and prediction model on low temperature aging embrittlement in duplex stainless steels

International Nuclear Information System (INIS)

Sanchez, L.; Gutierrez-Solana, F.

1997-01-01

Within the framework of a general study on low temperature (280-400 degree centigree) aging embrittlement in duplex stainless steels, a relationship has been obtained between aging, measured from ferrite hardness evolution, and bulk materials embrittlement, determined from fracture toughness and fracture impact tests. The existing correlation between the increase in ferrite hardness and its percentage presence in the fracture path supports this relationship and results in the development of a prediction design model which provides the fracture resistance curves, for any aging level, based on the chemical composition and the steel's properties in an unaged state. (Author)

Scalable Manufacturing of Solderable and Stretchable Physiologic Sensing Systems.

Science.gov (United States)

Kim, Yun-Soung; Lu, Jesse; Shih, Benjamin; Gharibans, Armen; Zou, Zhanan; Matsuno, Kristen; Aguilera, Roman; Han, Yoonjae; Meek, Ann; Xiao, Jianliang; Tolley, Michael T; Coleman, Todd P

2017-10-01

Methods for microfabrication of solderable and stretchable sensing systems (S4s) and a scaled production of adhesive-integrated active S4s for health monitoring are presented. S4s' excellent solderability is achieved by the sputter-deposited nickel-vanadium and gold pad metal layers and copper interconnection. The donor substrate, which is modified with "PI islands" to become selectively adhesive for the S4s, allows the heterogeneous devices to be integrated with large-area adhesives for packaging. The feasibility for S4-based health monitoring is demonstrated by developing an S4 integrated with a strain gauge and an onboard optical indication circuit. Owing to S4s' compatibility with the standard printed circuit board assembly processes, a variety of commercially available surface mount chip components, such as the wafer level chip scale packages, chip resistors, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating the versatile and modular nature of S4s. Tegaderm-integrated S4 respiration sensors are tested for robustness for cyclic deformation, maximum stretchability, durability, and biocompatibility for multiday wear time. The results of the tests and demonstration of the respiration sensing indicate that the adhesive-integrated S4s can provide end users a way for unobtrusive health monitoring. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

A wide-range embrittlement trend curve for western RPV steels

International Nuclear Information System (INIS)

Kirk, M.T.

2011-01-01

Embrittlement trend curves (ETCs) are used to estimate neutron irradiation embrittlement as a function of both exposure (fluence, flux, temperature, ...) and composition variables. ETCs provide information needed to assess the structural integrity of operating nuclear reactors, and to determine their suitability for continued safe operation. Past efforts on ETC development in the United States have used data drawn from domestic licensees. While this approach has addressed past needs well, future needs such as power up-rates, license extensions to 60 years and beyond, and the use of low copper materials in new reactors produce future operating conditions for the US reactor fleet that may differ from past experience, suggesting that data from sources other than licensee surveillance programs may be needed. In this paper we draw together embrittlement data expressed in terms of ΔT41J and ΔYS from a wide variety of data sources as a first step in examining future embrittlement trends. We develop a 'wide range' ETC based on a collection of over 2500 data. We assess how well this ETC models the whole database, as well as significant data subsets. Comparisons presented herein indicate that a single algebraic model, denoted WR-C(5), represents reasonably well both the trends evident in the data overall as well as trends exhibited by four special data subsets. The WR-C(5) model indicates the existence of trends in high fluence data (Φ > 2-3*10 19 n/cm 2 , E > 1 MeV) that are not as apparent in the US surveillance data due to the limited quantity of ΔT30 data measured at high fluence in this dataset. Additionally, WR-C(5) models well the trends in both test and power reactor data despite the fact it has not term to account for flux. It is suggested that one appropriate use of the WR-C(5) trend curve may include the design irradiation studies to validate or refute the findings presented herein. Additionally, WR-C(5) could be used, along with other information (e.g., other

Embrittlement of the alloy U 7.5 Nb 2.5 Zr by gaseous oxygen and hydrogen

International Nuclear Information System (INIS)

Lepoutre, D.; Nomine, A.M.; Miannay, D.

1981-04-01

Embrittlement of the alloy uranium 7.5 niobium 2.5 zirconium in gaseous oxygen and hydrogen versus stress intensity, temperature and pressure is studied using rupture mechanics. Cracking speed is determined. In oxygen, only cracks are produced and embrittlement is due to oxidation. In hydrogen at high pressure an hydride is formed and at low pressure cracks are produced but the mechanism is not identified [fr

High temperature service embrittlement of EUROFER´97 steel

Czech Academy of Sciences Publication Activity Database

Stratil, Luděk; Hadraba, Hynek; Dlouhý, Ivo

2010-01-01

Roč. 1, č. 2 (2010), s. 142-145 ISSN 1335-1532. [Fraktografia 2009. Stará Lesná, 08.11.2009-11.11.2009] R&D Projects: GA ČR GA106/08/1397; GA AV ČR 1QS200410502 Institutional research plan: CEZ:AV0Z20410507 Keywords : Eurofer´97 * isothermal ageing * embrittlement * impact properties Subject RIV: JL - Materials Fatigue, Friction Mechanics

Low temperature radiation embrittlement for reactor vessel steels