Sample records for solder fluxes mold

  1. Effect of Solder Flux Residues on Corrosion of Electronics

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per


    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA[...

  2. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan


    Purpose:The aim of this work is to investigate the decomposition behaviour of the activator species commonly used in the wave solder no-clean flux systems and to estimate the residue amount left after subjecting the samples to simulated wave soldering conditions. Design/methodology/approach: Chan......Purpose:The aim of this work is to investigate the decomposition behaviour of the activator species commonly used in the wave solder no-clean flux systems and to estimate the residue amount left after subjecting the samples to simulated wave soldering conditions. Design....../methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid......-malic). The decomposition patterns of solder flux activators depend on their chemical nature, time of heat exposure and substrate materials. Evaporation of the residue from the surface of different materials (laminate with solder mask, copper surface or glass surface) was found to be more pronounced for succinic...

  3. Indium Corporation Introduces New Pb-Free VOC-Free Wave Solder Flux


    The Indium Corporation of America has introduced WF-7742 Wave Solder Flux specifically designed to meet the process demands of Pb-Free manufacturing. WF-7742 is a VOC-Free material formulated for Pb-Free wave soldering of surface-mount, mixed-technology and through-holeelectronics assemblies.

  4. Soldering handbook

    Vianco, Paul T


    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  5. Relative effect of solder flux chemistry on the humidity related failures in electronics

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan


    of printed circuit boards under humid conditions. Originality/value - The classification of solder flux systems according to IPC J-STD-004 standard does not specify the WOAs in the flux; however, ranking of the flux systems based on the hygroscopic property of activators would be useful information when...

  6. Relative effect of solder flux chemistry on the humidity related failures in electronics

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan


    Purpose - This paper aims to investigate the effect of no-clean flux chemistry with various weak organic acids (WOAs) as activators on the corrosion reliability of electronics with emphasis on the hygroscopic nature of the residue. Design/methodology/approach - The hygroscopicity of flux residue...... of printed circuit boards under humid conditions. Originality/value - The classification of solder flux systems according to IPC J-STD-004 standard does not specify the WOAs in the flux; however, ranking of the flux systems based on the hygroscopic property of activators would be useful information when...... selecting no-clean flux systems for electronics with applications in humid conditions....

  7. Wave soldering with Pb-free solders

    Artaki, I.; Finley, D.W.; Jackson, A.M.; Ray, U. [AT and T Bell Labs., Princeton, NJ (United States); Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)


    The manufacturing feasibility and attachment reliability of a series of newly developed lead-free solders were investigated for wave soldering applications. Some of the key assembly aspects addressed included: wettability as a function of board surface finish, flux activation and surface tension of the molten solder, solder joint fillet quality and optimization of soldering thermal profiles. Generally, all new solder formulations exhibited adequate wave soldering performance and can be considered as possible alternatives to eutectic SnPb for wave soldering applications. Further process optimization and flux development is necessary to achieve the defect levels associated with the conventional SnPb process.

  8. Relative effect of solder flux chemistry on the humidity related failures in electronics

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan


    was studied by quartz crystal microbalance, while corrosive effects were studied by leakage current and impedance measurements on standard test boards. The measurements were performed as a function of relative humidity (RH) in the range from 60 to ~99 per cent at 25°C. The corrosiveness of solder flux systems...... of printed circuit boards under humid conditions. Originality/value - The classification of solder flux systems according to IPC J-STD-004 standard does not specify the WOAs in the flux; however, ranking of the flux systems based on the hygroscopic property of activators would be useful information when...... selecting no-clean flux systems for electronics with applications in humid conditions....

  9. Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

    Conseil, Helene; Verdingovas, Vadimas; Jellesen, Morten Stendahl


    No-clean flux systems are used today for the soldering of electronic printed circuit board assemblies assuming that all the aggressive substances of the flux will vanish during the soldering process i.e. evaporate, decompose or being enclosed safely in the residues. However this is not true in most...... cases, as the flux residue left on a printed circuit board assembly is a key factor compromising the corrosion reliability under humid conditions. This investigation focuses on the chemical degradation of three kinds of solder flux systems based on adipic, succinic, and glutaric acid as a function...... determination. Effect on corrosion reliability was investigated by exposing the test printed circuit board assemblies to humidity after pre-contaminating with pure acids and desired solder flux systems and measuring the charge transferred between electrodes under applied potential bias. Results showed...

  10. Decomposition studies of no-clean solder flux systems in connection with corrosion reliability of electronics

    Conseil, Helene; Jellesen, Morten Stendahl; Verdingovas, Vadimas


    One of the predominant factors for accelerated corrosion in electronics is the intrinsic contamination on Printed Circuit Board Assemblies (PCBAs) originating from the soldering process used for component mounting. However, the amount, distribution, and morphology of flux residue vary considerably...... such as electrochemical migration resulting in intermittent or permanent failures. This paper summarizes the investigations on decomposition of some typical no-clean flux systems (WOA based) which are used today for the electronic manufacturing. The change in flux chemistry was studied as a function of temperature...

  11. Soldering in electronics assembly

    Judd, Mike


    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  12. A Review of Mold Flux Development for the Casting of High-Al Steels

    Wang, Wanlin; Lu, Boxun; Xiao, Dan


    Mold flux plays key roles during the continuous casting process of molten steel, which accounts for the quality of final slabs. With the development of advanced high strength steels (AHSS), certain amounts of Al have been added into steels that would introduce severe slag/metal interaction problems during process of continuous casting. The reaction is between Al and SiO2 that is the major component in the mold flux system. Intensive efforts have been conducted to optimize the mold flux and a CaO-Al2O3-based mold flux system has been proposed, which shows the potential to be applied for the casting process of AHSS. The latest developments for this new mold flux system were summarized with the aim to offer technical guidance for the design of new generation mold flux system for the casting of AHSS.

  13. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

    Sujan, G.K., E-mail:; Haseeb, A.S.M.A., E-mail:; Afifi, A.B.M., E-mail:


    Lead free solders currently in use are prone to develop thick interfacial intermetallic compound layers with rough morphology which are detrimental to the long term solder joint reliability. A novel method has been developed to control the morphology and growth of intermetallic compound layers between lead-free Sn–3.0Ag–0.5Cu solder ball and copper substrate by doping a water soluble flux with metallic nanoparticles. Four types of metallic nanoparticles (nickel, cobalt, molybdenum and titanium) were used to investigate their effects on the wetting behavior and interfacial microstructural evaluations after reflow. Nanoparticles were dispersed manually with a water soluble flux and the resulting nanoparticle doped flux was placed on copper substrate. Lead-free Sn–3.0Ag–0.5Cu solder balls of diameter 0.45 mm were placed on top of the flux and were reflowed at a peak temperature of 240 °C for 45 s. Angle of contact, wetting area and interfacial microstructure were studied by optical microscopy, field emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. It was observed that the angle of contact increased and wetting area decreased with the addition of cobalt, molybdenum and titanium nanoparticles to flux. On the other hand, wettability improved with the addition of nickel nanoparticles. Cross-sectional micrographs revealed that both nickel and cobalt nanoparticle doping transformed the morphology of Cu{sub 6}Sn{sub 5} from a typical scallop type to a planer one and reduced the intermetallic compound thickness under optimum condition. These effects were suggested to be related to in-situ interfacial alloying at the interface during reflow. The minimum amount of nanoparticles required to produce the planer morphology was found to be 0.1 wt.% for both nickel and cobalt. Molybdenum and titanium nanoparticles neither appear to undergo alloying during reflow nor have any influence at the solder/substrate interfacial reaction. Thus, doping

  14. Properties of High Basicity Mold Fluxes for Peritectic Steel Slab Casting

    LONG Xiao; HE Sheng-ping; XU Jian-fei; HUO Xu-ling; WANG Qian


    In high speed continuous casting of peritectic steel slabs, mold fluxes with high basicity are required for less surface defect product. However, the basicity of remaining liquid slag film tends to decrease in casting process because of the crystallization of 3CaO ·2SiO2 · CaF2. Thus, a way is put forward to improve mold fluxesr properties by raising the original basicity. In order to confirm the possibility of this method, the effect of rising original basicity on the properties of mold fluxes is discussed. Properties of high fluorine based mold fluxes with different basicities and contents of CaF2 , Na2 O, and MgO were measured, respectively. Then, properties of higher basicity mold fluxes were discussed and compared with traditional ones. The results show that increasing the basicity index can improve the melting and flow property of mold fluxes. With the increasing basicity, crystallization rate of mold fluxes increases obviously and crystallization temperature tends to decrease when the basicity exceeds 1.35. The method presen- ted before is proved as a potential way to resolve the contradiction between horizontal heat transfer controlling and solidified shell lubricating for peritectic steel slab casting. But further study on improving the flow property of liquid slag is needed. This work can be used to guide mold fluxes design for high speed continuous casting of peritectic steel slabs.

  15. The influence of solder mask and hygroscopic flux residues on water layer formation on PCBA surface and corrosion reliability of electronics

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan


    The presence of solder flux residue on the Printed Circuit Board Assembly (PCBA) surface compromises the corrosion reliability of electronics under humid conditions and can lead to degradation of the device’s lifetime. In this work, the effect of solder mask morphology and hygroscopic residues were...

  16. Effect of Carbon Properties on Melting Behavior of Mold Fluxes for Continuous Casting of Steels


    During continuous casting of steel, the properties of mold fluxes strongly affect the casting performance,steel quality and environment of casting operation. The high temperature microscopy technique was used to investigate the melting behaviour of mold fluxes, and drip test method was used to determine their melting rate. The results showed that free carbon is a dominant factor in governing the melting behaviour of fluxes, and the melting rate is increased with increasing carbon reactivity and decreasing carbon content.

  17. Control of Crystal Morphology for Mold Flux During High-Aluminum AHSS Continuous Casting Process

    GUO, Jing; SEO, Myung-Duk; SHI, Cheng-Bin; CHO, Jung-Wook; KIM, Seon-Hyo


    In the present manuscript, the efforts to control the crystal morphology are carried out aiming at improving the lubrication of lime-alumina-based mold flux for casting advanced high-strength steel with high aluminum. Jackson α factors for crystals of melt crystallization in multi-component mold fluxes are established and reasonably evaluated by applying thermodynamic databases to understand the crystal morphology control both in lime-alumina-based and lime-silica-based mold fluxes. The results show that Jackson α factor and supercooling are the most critical factors to determine the crystal morphology in a mold flux. Crystals precipitating in mold fluxes appear with different morphologies due to their different Jackson α factors and are likely to be more faceted with higher Jackson α factor. In addition, there is a critical supercooling degree for crystal morphology dendritic transition. When the supercooling over the critical value, the crystals transform from faceted shape to dendritic ones in morphology as the kinetic roughening occurs. Typically, the critical supercooling degrees for cuspidine dendritic transition in the lime-silica-based mold fluxes are evaluated to be between 0.05 and 0.06. Finally, addition of a small amount of Li2O in the mold flux can increase the Jackson α factor and decrease the supercooling for cuspidine precipitation; thus, it is favorable to enhance a faceted cuspidine crystal.

  18. CCT and TTT Diagrams to Characterize Crystallization Behavior of Mold Fluxes

    WEN Guang-hua; LIU Hui; TANG Ping


    The isothermal and non-isothermal experiments were performed to construct the continuous cooling trans formation (CCT) and temperature time transformation (TTT) diagrams of four industrial mold fluxes through visual observations in an experimental apparatus based on the single hot thermocouple technique (SHTT).The results of the CCT diagrams indicate that ① the crystallization temperature of mold fluxes lowers as the cooling rate increases,② the mold fluxes have larger critical cooling rate,higher crystallization temperature,and less onset time of crystallization when the basicity increases or the viscosity decreases,③ the influences of the melting points of the mold fluxes on their crystallization tendency are not significant.Isothermal tests show that the onset time of crystallization decreases at first,and then increases,and finally represents a"C"shape with increasing isothermal temperature.The TTT diagrams of four industrial mold fluxes were divided into two separate"C"shape regions.The crystal phase of C20A selected was analyzed by X-ray diffraction,which is cuspidine (Ca4Si2O7F2 ) over 1 100℃ and calcium silicon oxide fluoride (Ca2SiO2F2) below 1 100 ℃.When compared with the TTT diagram,the CCT diagram can provide a more realistic estimate of the critical cooling rate of the mold fluxes.Thus,both the CCT and TTT diagrams can unambiguously describe the crystallization phenomena of the mold fluxes.

  19. Effect of MnO content on the interfacial property of mold flux and steel

    Wang, Wanlin; Li, Jingwen; Zhou, Lejun; Yang, Jian


    The interfacial property between liquid mold flux and steel has significant impact on the quality of casting slab, and this property is mainly determined by the chemical composition of mold flux and the reaction between the flux and steel. The effect of MnO content on the contact angle and interfacial tension between liquid mold flux and ultra-low carbon steel was investigated by sessile drop method in this article, and the results suggested that both the contact angle and interfacial tension decreased with the increase of MnO content in the mold flux. The increase of Si and Mn and the reduction of Al and Ti in the interaction layer were caused by the chemical reactions occurred in the vicinity of interface between mold flux and steel substrate. Besides, the thickness of the interaction layer increased from 4 μm to 7 μm, then to 9 μm, 11 μm and 15 μm when the MnO content was added from 1 wt% to 3 wt%, then to 5 wt%, 7 wt%, and 9 wt% due to the fact that MnO can simplify the polymerized structure of the melt and improve the penetrability of molten mold flux to make the interfacial reaction easier.

  20. Distribution of Magnetic Flux Density in Soft-Contact EMCC Rectangular Mold

    ZHANG Lin-tao; WANG En-gang; DENG An-yuan; HE Ji-cheng


    The distribution of the magnetic flux density in a soft-contact electromagnetic continuous casting (EMCC) rectangular mold was investigated. The experimental results show that with an increase in electric power, the magnetic flux density increases. The position where the maximum magnetic flux density appears will shift up when the coil moves to the top of the mold. At the same time, the maximum magnetic flux density will increase and the effective acting range of electromagnetic pressure will widen. As a result, in practice, the coil should be placed near the top part of the mold. The meniscus should be controlled near the top part of the coil, as this not only remarkably improves the billet surface quality but also saves energy. With the same electric power input, the higher the frequency, the lower the magnetic flux density.

  1. Low temperature aluminum soldering analysis

    Peterkort, W.G.


    The investigation of low temperature aluminum soldering included the collection of spread factor and dihedral angle data for several solder alloys and a study of flux effects on aluminum. Selected solders were subjected to environmental tests and evaluated on the basis of tensile strength, joint resistance, visual appearance, and metallurgical analysis. A production line method for determining adequate flux removal was developed.

  2. Solderability test system

    Yost, Fred (Cedar Crest, NM); Hosking, Floyd M. (Albuquerque, NM); Jellison, James L. (Albuquerque, NM); Short, Bruce (Beverly, MA); Giversen, Terri (Beverly, MA); Reed, Jimmy R. (Austin, TX)


    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.

  3. Solderability test system

    Yost, F.; Hosking, F.M.; Jellison, J.L.; Short, B.; Giversen, T.; Reed, J.R.


    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time. 11 figs.

  4. Measurement of Heat Flux at Metal-Mold Interface during Casting Solidification

    Sabau, Adrian S [ORNL


    All previous studies on interfacial heat transfer coefficient have been based on indirect methods for estimating the heat flux that employed either inverse heat transfer analysis procedures or instrumentation arrangements to measure temperatures and displacements near the metal-mold interface. In this paper, the heat transfer at the metal-mold interfaces is investigated using a sensor for the direct measurement of heat flux. The heat flux sensor (HFS) was rated for 700oC and had a time response of less than 10 ms. Casting experiments were conducted using graphite molds for aluminum alloy A356. Several casting experiments were performed using a graphite coating and a boron nitride coating. The measurement errors were estimated. The temperature of the mold surface was provided by the HFS while the temperature of the casting surface was measured using a thermocouple. Results for the heat transfer coefficients were obtained based on measured heat flux and temperatures. Four stages were clearly identified for the variation in time of the heat flux. Values of the heat transfer coefficient were in good agreement with data from previous studies.

  5. Mold


    This podcast answers a listener's question about the risks associated with mold after a natural disaster or severe weather.  Created: 5/2/2011 by National Center for Environmental Health (NCEH).   Date Released: 5/2/2011.

  6. Study of the Viscosity of Mold Flux Based on the Vogel-Fulcher-Tammann (VFT) Model

    Zhou, Lejun; Wang, Wanlin


    Viscosity is one of the most important properties of mold flux and affects the process of continuous casting significantly. In order to describe the variation of viscosity of mold flux accurately in a wide range of temperature occurring in the casting mold, a non-Arrhenius Vogel-Fulcher-Tammann (VFT) model was adopted in this study. The results showed that the adjusted coefficient of determination (Adj. R 2) of non-Arrhenius VFT Model ranges from 0.92 to 0.96, which suggests this model could be well adapted to predict the relationship between viscosity and temperature of mold flux. The temperature at which viscosity becomes infinite, T VFT, increased with the addition of Cr2O3 and improvement of basicity, while it decreased with the addition of B2O3, as it was determined by both the degree of polymerization of the melt structure and crystallization behavior of the melt. Also, the pseudo-activation energy, E VFT, of Samples 1 to 5 was 60.1 ± 3.6, 94.7 ± 14.9, 101.7 ± 19.0, 38.0 ± 4.8, and 32.4 ± 4.0 kJ/mol, respectively; it increased with the addition of Cr2O3 and B2O3, but deceased with the increase of basicity.

  7. Mold flux characterization for thin slab casting of steel

    Cruz-Ramírez, A.


    Full Text Available The mineralogical constitution and the melting-solidification behavior of two commercial fluxes for thin slab casting of steel were determined. The characterization of the commercial fluxes as received show the presence of wollastonite (CaO. SiO2, a sodium carbonate (Na2CO3, calcite (CaCO3, fluorite (CaF2 and carbon as the main components by X ray powder diffraction (XRD and microscopic techniques. When fluxes were heated to 1573 K and further solidification, there was almost a whole transformation from the original compounds to cuspidine (3CaO - 2SiO2 - CaF2 and nepheline (Na2O - Al2O3 - 2SiO2 phases. The thermal gravimetrical analysis showed an important weight reduction in both fluxes due to the thermal decompositions of calcite and sodium carbonate. The characterization reveals that fluxes are produced by an agglomeration process.

    Se determinó la composición mineralógica y el comportamiento de fusión-solidificación de dos fundentes comerciales para la colada de planchón delgado de acero. La caracterización de los fundentes comerciales por difracción de rayos X (XRD y técnicas de microscopía muestra la presencia de wollastonita (CaO - SiO2, un carbonato de sodio (Na2CO3, calcita (CaCO3, fluorita (CaF2 y carbono como los principales componentes. Cuando los fundentes se calentaron a 1.573 K y después de la solidificación, hubo una transformación casi total de los compuestos originales a las fases cuspidina (3CaO - 2SiO2 - CaF2 y nefelina (Na2O - Al2O3 - 2SiO2. El análisis termogravimétrico muestra una importante reducción de peso en los fundentes debido a la descomposición térmica de la calcita y el carbonato de sodio. La caracterización indica que los fundentes son producidos por

  8. O on the Crystallization Behavior of Lime-Alumina-Based Mold Flux for Casting High-Al Steels

    Lu, Boxun; Chen, Kun; Wang, Wanlin; Jiang, Binbin


    With the development of advanced high strength steel (AHSS), a large amount of aluminum was added into steels. The reaction between aluminum in the molten steel and silica based mold flux in the continuous-casting process would tend to cause a series of problems and influence the quality of slabs. To solve the above problems caused by the slag-steel reaction, nonreactive lime-alumina-based mold flux system has been proposed. In this article, the effect of Li2O and Na2O on the crystallization behavior of the lime-alumina-silica-based mold flux has been studied by using the single hot thermocouple technology (SHTT) and double hot thermocouple technology (DHTT). The results indicated that Li2O and Na2O in the above mold flux system play different roles as they behaved in traditional lime-silica based mold flux, which would tend to inhibit general mold flux crystallization by lowering the initial crystallization temperature and increasing incubation time, especially in the high-temperature region. However, when their content exceeds a critical value, the crystallization process of mold fluxes in low temperature zone would be greatly accelerated by the new phase formation of LiAlO2 and Na x Al y Si z O4 crystals, respectively. The crystalline phases precipitated in all samples during the experiments are discussed in the article.

  9. Flow and thermal behavior of the top surface flux/powder layers in continuous casting molds

    McDavid, R. M.; Thomas, B. G.


    Steady-state finite-element models have been formulated to investigate the coupled fluid flow and thermal behavior of the top-surface flux layers in continuous casting of steel slabs. The three-dimensional (3-D) FIDAP model includes the shear stresses imposed on the flux/steel interface by flow velocities calculated in the molten steel pool. It also includes different temperature-dependent powder properties for solidification and melting. Good agreement between the 3-D model and experimental measurements was obtained. The shear forces, imposed by the steel surface motion toward the submerged entry nozzle (SEN), create a large recirculation zone in the liquid flux pool. Its depth increases with increasing casting speed, increasing liquid flux conductivity, and decreasing flux viscosity. For typical conditions, this zone contains almost 4 kg of flux, which contributes to an average residence time of about 2 minutes. Additionally, because the shear forces produced by the narrowface consumption and the steel flow oppose each other, the flow in the liquid flux layer separates at a location centered 200 mm from the narrowface wall. This flow separation depletes the liquid flux pool at this location and may contribute to generically poor feeding of the mold-strand gap there. As a further consequence, a relatively cold spot develops at the wideface mold wall near the separation point. This nonuniformity in the temperature distribution may result in nonuniform heat removal, and possibly nonuniform initial shell growth in the meniscus region along the wideface off-corner region. In this way, potential steel quality problems may be linked to flow in the liquid flux pool.

  10. Improvement of Castability and Surface Quality of Continuously Cast TWIP Slabs by Molten Mold Flux Feeding Technology

    Cho, Jung-Wook; Yoo, Shin; Park, Min-Seok; Park, Joong-Kil; Moon, Ki-Hyeon


    An innovative continuous casting process named POCAST (POSCO's advanced CASting Technology) was developed based on molten mold flux feeding technology to improve both the productivity and the surface quality of cast slabs. In this process, molten mold flux is fed into the casting mold to enhance the thermal insulation of the meniscus and, hence, the lubrication between the solidifying steel shell and the copper mold. Enhancement of both the castability and the surface quality of high-aluminum advanced high-strength steel (AHSS) slabs is one of the most important advantages when the new process has been applied into the commercial continuous casting process. A trial cast of TWIP steel has been carried out using a 10-ton scale pilot caster and 100-ton scale and 250-ton scale commercial casters. The amount of mold flux consumption was more than 0.2 kg/m2 in the new process, which is much larger than that in the conventional powder casting. Trial TWIP castings at both the pilot and the plant caster showed stable mold performances such as mold heat transfer. Also, cast slabs showed periodic/sound oscillation marks and little defects. The successful casting of TWIP steel has been attributed to the following characteristics of POCAST: dilution of the reactant by increasing the slag pool depth, enlargement of channel for slag film infiltration at meniscus by elimination of the slag bear, and decrease of apparent viscosity of the mold slag at meniscus by increasing the slag temperature.

  11. Improvement of Castability and Surface Quality of Continuously Cast TWIP Slabs by Molten Mold Flux Feeding Technology

    Cho, Jung-Wook; Yoo, Shin; Park, Min-Seok; Park, Joong-Kil; Moon, Ki-Hyeon


    An innovative continuous casting process named POCAST (POSCO's advanced CASting Technology) was developed based on molten mold flux feeding technology to improve both the productivity and the surface quality of cast slabs. In this process, molten mold flux is fed into the casting mold to enhance the thermal insulation of the meniscus and, hence, the lubrication between the solidifying steel shell and the copper mold. Enhancement of both the castability and the surface quality of high-aluminum advanced high-strength steel (AHSS) slabs is one of the most important advantages when the new process has been applied into the commercial continuous casting process. A trial cast of TWIP steel has been carried out using a 10-ton scale pilot caster and 100-ton scale and 250-ton scale commercial casters. The amount of mold flux consumption was more than 0.2 kg/m2 in the new process, which is much larger than that in the conventional powder casting. Trial TWIP castings at both the pilot and the plant caster showed stable mold performances such as mold heat transfer. Also, cast slabs showed periodic/sound oscillation marks and little defects. The successful casting of TWIP steel has been attributed to the following characteristics of POCAST: dilution of the reactant by increasing the slag pool depth, enlargement of channel for slag film infiltration at meniscus by elimination of the slag bear, and decrease of apparent viscosity of the mold slag at meniscus by increasing the slag temperature.

  12. Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems

    Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan


    (RH) to ∼99%RH at 25°C. The following parameters were used for characterization of WOAs: mass gain due to water adsorption and deliquescence of the WOA (by quartz crystal microbalance), resistivity of the water layer formed on the printed circuit board (by impedance spectroscopy), and leakage current...... measured using the surface insulation resistance pattern in the potential range from 0 V to 10 V. The combined results indicate the importance of the WOA chemical structure for the water adsorption and therefore conductive water layer formation on the printed circuit board assembly (PCBA). A substantial...... increase of leakage currents and probability of electrochemical migration was observed at humidity levels above the RH corresponding to the deliquescence point of WOAs present as contaminants on the printed circuit boards. The results suggest that use of solder fluxes with WOAs having higher deliquescence...

  13. Analysis of Crystallization Behavior of Mold Fluxes Containing TiO2 Using Single Hot Thermocouple Technique

    Yun LEI; Bing XIE; Wen-hui MA


    The crystallization behavior of mold fluxes containing 0-8 mass% TiO 2 was investigated using the single hot thermocouple technique (SHTT)and X-ray diffraction (XRD)to study the possible effects on the coordination of heat transfer control and strand lubrication for casting crack-sensitive peritectic steels.Time-temperature-transforma-tion (TTT)and continuous-cooling-transformation (CCT)curves were plotted using the data obtained from SHTT to characterize the crystallization of the mold fluxes.The results showed that crystallization of the mold fluxes during isothermal and non-isothermal processes was suppressed with TiO 2 addition.From the TTT curves,it could be seen that the incubation and growth time of crystallization increased significantly with TiO 2 addition.The CCT curves showed that the crystallization temperature initially decreased,and then suddenly increased with increasing the TiO 2 content.XRD analysis suggested the presence of cuspidine in the mold fluxes with lower TiO 2 content (< 4 mass%),while both perovskite and cuspidine were detected in the mold fluxes when the TiO 2 content was increased to 8 mass%.In addition,the growth mechanisms of the crystals changed during the isothermal crystallization process from interface-controlled growth to diffusion-controlled growth with increasing the TiO 2 content.

  14. Effect of Al2O3 on the Crystallization of Mold Flux for Casting High Al Steel

    Zhou, Lejun; Wang, Wanlin; Zhou, Kechao


    In order to lower the weight of automotive bodies for better fuel-efficiency and occupant safety, the demand for high Al-containing advanced high strength steel, such as transformation-induced plasticity and twinning-induced plasticity steel, is increasing. However, high aluminum content in steels would tend to significantly affect the properties of mold flux during the continuous casting process. In this paper, a kinetic study of the effect of Al2O3 content on the crystallization behavior of mold flux was conducted by using the single hot thermocouple technique and the Johnson-Mehl-Avrami model combined with the Arrhenius Equation. The results suggested that Al2O3 behaves as an amphoteric oxide in the crystallization process of mold flux. The precipitated phases of mold flux change from cuspidine (Ca4Si2O7F2) into nepheline (NaAlSiO4) and CaF2, and then into gehlenite (Ca2Al2SiO7) with the increase of Al2O3 content. The kinetics study of the isothermal crystallization process indicated that the effective crystallization rate ( k) and Avrami exponent ( n) also first increased and then decreased with the increase of Al2O3 content. The values for the crystallization activation energy of mold flux with different Al2O3 contents were E R0.8A7 = 150.76 ± 17.89 kJ/mol, E R0.8A20 = 136.43 ± 6.48 kJ/mol, E R0.8A30 = 108.63 ± 12.25 kJ/mol and E R0.8A40 = 116.15 ± 8.17 kJ/mol.

  15. Crystallization Behavior and Heat Transfer of Fluorine-Free Mold Fluxes with Different Na2O Concentration

    Yang, Jian; Zhang, Jianqiang; Sasaki, Yasushi; Ostrovski, Oleg; Zhang, Chen; Cai, Dexiang; Kashiwaya, Yoshiaki


    In this study, the crystallization behavior and heat transfer of CaO-SiO2-Na2O-B2O3-TiO2-Al2O3-MgO-Li2O fluorine-free mold fluxes with different Na2O contents (5 to 11 mass pct) were studied using single/double hot thermocouple technique (SHTT/DHTT) and infrared emitter technique (IET), respectively. Continuous cooling transformation (CCT) and time-temperature transformation (TTT) diagrams constructed using SHTT showed that crystallization temperature increased and incubation time shortened with the increase of Na2O concentration, indicating an enhanced crystallization tendency. The crystallization process of mold fluxes in the temperature field simulating the casting condition was also investigated using DHTT. X-ray diffraction (XRD) analysis of the quenched mold fluxes showed that the dominant phase changed from CaSiO3 to Ca11Si4B2O22 with the increasing concentration of Na2O. The heat transfer examined by IET showed that the increase of Na2O concentration reduced the responding heat flux when Na2O was lower than 9 mass pct but the further increase of Na2O to 11 mass pct enhanced the heat flux. The correlation between crystallinity and heat transfer was discussed in terms of crystallization tendency and crystal morphology.

  16. Study on the behaviour of fluxes to steel continuous casting mold; Estudio del comportamiento de los fundentes para molde de colada continua de acero

    Chavez, J.F.; Celaya, Arturo; Morales, Rodolfo D. [Instituto Politecnico Nacional, Mexico City (Mexico). Dept. de Ingenieria Metalurgica; Barron, Miguel A. [Universidad Nacional Autonoma de Mexico, Azcapotzalco (Mexico)


    A mathematical heat transfer model has been developed, which calculates both the field flow and the temperature profile through the flux thickness between the mold and the strand. The physical condition of the flux in each point is calculated as a function of the physical properties of the powder, the powder film thickness and the oscillation conditions. The model consists of two heat transfer submodels, one for the old and the other one for the steel strand. The dynamic of both system are used as boundary conditions for solving the heat transfer and the Navier-Stokes equations. The calculated dynamic behavior is mostly influenced by the flux properties. The thermophysical and rheological properties of the most employed fluxes by mexican steel plants were considered for carrying out the simulations. Some of these properties were determined by using standard experimental techniques. I has been found a possible non linear velocity profile, which were not prior reported, depending on the flux properties and the operation conditions. This effect has some influence on the shear stress acting on the strand surface due to the presence of the flux. (author) 14 refs., 10 figs., 2 tabs.

  17. Acid soldering flux poisoning

    ... Throat swelling (which may also cause breathing difficulty) SKIN Burn Holes in the skin or tissues under the skin Irritation ... tracing) Endoscopy -- camera down the throat to see burns in the ... burned skin Washing of the skin (irrigation), perhaps every few ...

  18. The Development of CaO-SiO2-B2O3-based Fluorine-Free Mold Flux for a Continuous Casting Process

    Zhou, Lejun; Wang, Wanlin


    Designing and developing high-performance fluorine-free (F-free) mold flux has become a hot topic in steel continuous casting processes, with concerns of environment protection and energy saving. In conventional commercial mold flux, fluorine plays important roles on the properties as it works as a fluxing agent; however, it tends to cause serious environmental and health problems. In this paper, a new F-free mold flux based on the CaO-SiO2-B2O3 slag system has been introduced through summarizing previous works. The melting temperature range of F-free mold flux decreases with the addition of Na2O/Li2O and B2O3; the viscosity and heat flux decrease with the increase of basicity and Na2O/Li2O, as well as the decrease of B2O3 contents. Also, the crystallization temperatures of F-free mold fluxes increase with the increase of basicity and Na2O/Li2O content. The analyses of EDS and XRD show that Ca11Si4B2O22 and Ca14Mg2(SiO4)8 are the two main precipitated crystalline phases in F-free mold fluxes, and that the Ca11Si4B2O22 is a common and stable crystalline phase in the designed F-free mold fluxes system that shows the potential to replace Ca4Si2O7F2 in conventional flourine-containing mold fluxes.

  19. Die Soldering in Aluminium Die Casting

    Han, Q.; Kenik, E.A.; Viswanathan, S.


    Two types of tests, dipping tests and dip-coating tests were carried out on small steel cylinders using pure aluminum and 380 alloy to investigate the mechanism of die soldering during aluminum die casting. Optical and scanning electron microscopy were used to study the morphology and composition of the phases formed during soldering. A soldering mechanism is postulated based on experimental observations. A soldering critical temperature is postulated at which iron begins to react with aluminum to form an aluminum-rich liquid phase and solid intermetallic compounds. When the temperature at the die surface is higher than this critical temperature, the aluminum-rich phase is liquid and joins the die with the casting during the subsequent solidification. The paper discusses the mechanism of soldering for the case of pure aluminum and 380 alloy casting in a steel mold, the factors that promote soldering, and the strength of the bond formed when soldering occurs. conditions, an aluminum-rich soldering layer may also form over the intermetallic layer. Although a significant amount of research has been conducted on the nature of these intermetallics, little is known about the conditions under which soldering occurs.

  20. X-Ray Observation of Gas Evolution, Flotation, and Emulsification of Molten Carbon Steel Immersed in Mold Flux

    Elfsberg, Jessica; Matsushita, Taishi


    At two interfacial-tension measurement experiments with the same experimental conditions, steel samples and mold flux samples of the same compositions were melted in crucibles from the same batch. During the first experiment, the steel drop melted far below its liquidus and then was emulsified. At the second experiment, the steel melted at the expected temperature but did not emulsify. The difference that can be identified is the mass of the steel samples.

  1. Fluxes design for continuous casting mold of slab low carbon steels; Diseno de polvos de molde para colada continua de slabs de aceros bajo carbono

    Cruz-Ramirez, A.; Chavez-Alcala, J. F.; Romero-Serrano, J. A.


    Commercial fluxes were characterized by laboratory tests, and their original properties were changed with additions of chemical reagents in order to establish criteria and design strategies to produce new fluxes. The characterization of the commercial fluxes reveals that they are produced by simple mechanical blend of minerals, using feldspars and clays as base materials, containing SiO{sub 2} Al{sub 2}O{sub 3}, Na{sub 2}O and in less quantity K{sub 2}O, Fe{sub 2}O{sub 3} and MnO; limestone as the main source of CaO, fluorspar (CaF{sub 2}) used to control the viscosity and graphite as carbon source. Melting-solidification tests revealed melting and fluidity temperatures and the existence of abundant mineralogical phases formed during the flux solidification. some important mineralogical compounds are the nepheline (NaAlSiO{sub 4}) and cus pidine (Ca{sub 4}Si{sub 2}O{sub 7}F{sub 2}): these species have a direct influence on the heat transfer phenomena from strand to mold and therefore on the phase transformations and the shrinkage of the steel. (Author) 8 refs.



    In order to study the mechanism of vacuum fluxless soldering on the conditions of laser heating, the method of measuring temperature by the thermocouple is used to analyze the spreading and wetting process of boh fluxless SnPb solder in the vacuum surroundings and flux SnPb solder on Cu pad. Solder spreading and wetting affected by the soldering thermal process is also discussed according to the thermodynamics principle. Results show that vacuum fluxless soldering demands higher temperature, and the fall of the solder su rface tension is the important factor achieving fluxless laser soldering.

  3. Efforts to Develop a 300°C Solder

    Norann, Randy A [Perma Works LLC


    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  4. A Study of the Interface of Soldered Joints of SnInAgTi Active Solder with Ito Ceramics

    M. Provazník; R. Koleňák


    This paper presents an analysis of the solderability ITO ceramics (In2O3/SnO2). The soft active solder SnInAgeTi was used for the experiments. The solder was activated by power ultrasound in air without flux. An analysis of the interface of the phases between the solder and the ceramic was carried out in order to discover the ultrasonic impacts on the active metal and to identify the mechanism of the joint on the ceramic side.

  5. Multiobjective Design of Turbo Injection Mode for Axial Flux Motor in Plastic Injection Molding Machine by Particle Swarm Optimization

    Jian-Long Kuo


    Full Text Available This paper proposes a turbo injection mode (TIM for an axial flux motor to apply onto injection molding machine. Since the injection molding machine requires different speed and force parameters setting when finishing a complete injection process. The interleaved winding structure in the motor provides two different injection levels to provide enough injection forces. Two wye-wye windings are designed to switch two control modes conveniently. Wye-wye configuration is used to switch two force levels for the motor. When only one set of wye-winding is energized, field weakening function is achieved. Both of the torque and speed increase under field weakening operation. To achieve two control objectives for torque and speed of the motor, fuzzy based multiple performance characteristics index (MPCI with particle swarm optimization (PSO is used to find out the multiobjective optimal design solution. Both of the torque and speed are expected to be maximal at the same time. Three control factors are selected as studied factors: winding diameter, winding type, and air-gap. Experimental results show that both of the torque and speed increase under the optimal condition. This will provide enough large torque and speed to perform the turbo injection mode in injection process for the injection molding machine.

  6. Integrated environmentally compatible soldering technologies. Final report

    Hosking, F.M.; Frear, D.R.; Iman, R.L.; Keicher, D.M.; Lopez, E.P.; Peebles, H.C.; Sorensen, N.R.; Vianco, P.T.


    Chemical fluxes are typically used during conventional electronic soldering to enhance solder wettability. Most fluxes contain very reactive, hazardous constituents that require special storage and handling. Corrosive flux residues that remain on soldered parts can severely degrade product reliability. The residues are removed with chlorofluorocarbon (CFC), hydrochlorofluorocarbon (HCFC), or other hazardous solvents that contribute to ozone depletion, release volatile organic compounds into the atmosphere, or add to the solvent waste stream. Alternative materials and processes that offer the potential for the reduction or elimination of cleaning are being developed to address these environmental issues. Timing of the effort is critical, since the targeted chemicals will soon be heavily taxed or banned. DOE`s Office of Environmental Restoration and Waste Management (DOE/EM) has supported Sandia National Laboratories` Environmentally Conscious Manufacturing Integrated Demonstration (ECMID). Part of the ECM program involves the integration of several environmentally compatible soldering technologies for assembling electronics devices. Fluxless or {open_quotes}low-residue/no clean{close_quotes} soldering technologies (conventional and ablative laser processing, controlled atmospheres, ultrasonic tinning, protective coatings, and environmentally compatible fluxes) have been demonstrated at Sandia (SNL/NM), the University of California at Berkeley, and Allied Signal Aerospace-Kansas City Division (AS-KCD). The university demonstrations were directed under the guidance of Sandia staff. Results of the FY93 Soldering ID are presented in this report.

  7. SNL initiatives in electronic fluxless soldering

    Hosking, F. M.; Frear, D. R.; Vianco, P. T.; Keicher, D. M.

    Conventional soldering of electronic components generally requires the application of a chemical flux to promote solder wetting and flow. Chlorofluorocarbons (CFC) and halogenated solvents are normally used to remove the resulting flux residues. While such practice has been routinely accepted throughout the electronics industry, the environmental impact of hazardous solvents on ozone depletion will eventually limit or prevent their use. Solvent substitution or alternative technologies must be developed to meet these goals. Sandia National Laboratories (SNL), Albuquerque has a comprehensive environmentally conscious electronics manufacturing program underway that is funded by the DOE Office of Technology Development. Primary elements of the integrated task are the characterization and development of alternative fluxless soldering technologies that would eliminate circuit board cleaning associated with flux residue removal. Storage and handling of hazardous solvents and mixed solvent-flux waste would be consequently reduced during electronics soldering. This paper will report on the progress of the SNL fluxless soldering initiative. Emphasis is placed on the use of controlled atmospheres, laser heating, and ultrasonic soldering.

  8. PWB solder wettability after simulated storage

    Hernandez, C.L.; Hosking, F.M.


    A new solderability test method has been developed at Sandia National Laboratories that simulates the capillary flow physics of solders on circuit board surfaces. The solderability test geometry was incorporated on a circuit board prototype that was developed for a National Center for Manufacturing Sciences (NCMS) program. The work was conducted under a cooperative research and development agreement between Sandia National Laboratories, NCMS, and several PWB fabricators (AT&T, IBM, Texas Instruments, United Technologies/Hamilton Standard and Hughes Aircraft) to advance PWB interconnect technology. The test was used to investigate the effects of environmental prestressing on the solderability of printed wiring board (PWB) copper finishes. Aging was performed in a controlled chamber representing a typical indoor industrial environment. Solderability testing on as-fabricated and exposed copper samples was performed with the Sn-Pb eutectic solder at four different reflow temperatures (215, 230, 245 and 260{degrees}C). Rosin mildly activated (RMA), low solids (LS), and citric acid-based (CA) fluxes were included in the evaluation. Under baseline conditions, capillary flow was minimal at the lowest temperatures with all fluxes. Wetting increased with temperature at both baseline and prestressing conditions. Poor wetting, however, was observed at all temperatures with the LS flux. Capillary flow is effectively restored with the CA flux.

  9. Study on Non-rosin Based Flux Used for Cored Lead-free Solder Wire%无铅药芯焊锡丝用非松香基固体助焊剂的研究

    程方杰; 杨俊香; 葛文君


    针对现有松香固体助焊剂活性温度低和焊后变色的问题,研制了以十八酸、聚乙二醇和少量耐热松香作为载体,以己二酸和癸二酸复配作为活性剂的非松香基固体助焊剂.此助焊剂常温下为白色膏状,熔点范围110℃~130 ℃,满足Sn-0.7Cu无铅药芯焊锡丝灌芯和拔丝工艺.助焊剂中各成分沸点在300℃左右,满足手工烙铁焊高温要求且大大减少焊接飞溅,测试飞溅仅为0.16%.试验测定焊前焊后表面绝缘电阻均达到国家一级标准1×1012 Ω.其铺展率好,助焊效果理想.该助焊剂在高温助焊活性、稳定性和焊后腐蚀性等方面都符合标准,焊后焊点饱满光亮,残留物无腐蚀.%A non-rosin based flux was developed due to the problems of solders which are no activity at high temperatures and have discoloration after soldering associated with some conventional fluxes, using stearic acid, Polyethylene glycol (PEG),and a small amount of heat-resistant rosin as the vector, and a combination of adipic acid and sebacic acid as the active agent.This flux is a white paste at room temperature, and is found to have a melting point 110 ℃~ 130 ℃, which is suitable for wire core grouted and wire-drawn Sn-0.7Cu lead-free solder. The boiling points of each component are about 300 ℃, meeting the requirements of a high temperature for manual soldering. Also, splash was reduced significantly, and was only 0.16% in tests.Experimental measurement showed that the insulation resistance of the surface reached the standard of 1 × 1012 Ω, and it was found that its spreading rate was comparable to the commercial fluxes. Importantly, the soldering results were satisfactory.The activity characteristics at high temperatures, stability, corrosion resistance, and other variables of the flux, all reached established soldering standards, achieving full bright spot solder, with no corrosion residue.

  10. Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

    Roshanghias, Ali; Khatibi, Golta; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert


    Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

  11. A Study of the Interface of Soldered Joints of SnInAgTi Active Solder with Ito Ceramics

    M. Provazník


    Full Text Available This paper presents an analysis of the solderability ITO ceramics (In2O3/SnO2. The soft active solder SnInAgeTi was used for the experiments. The solder was activated by power ultrasound in air without flux. An analysis of the interface of the phases between the solder and the ceramic was carried out in order to discover the ultrasonic impacts on the active metal and to identify the mechanism of the joint on the ceramic side.

  12. Process characterization and control of hand-soldered printed wiring assemblies

    Cheray, D.L.; Mandl, R.G.


    A designed experiment was conducted to characterize the hand soldering process parameters for manufacturing printed wiring assemblies (PWAs). Component tinning was identified as the most important parameter in hand soldering. After tinning, the soldering iron tip temperature of 700{degrees}F and the choice of operators influence solder joint quality more than any other parameters. Cleaning and flux/flux core have little impact on the quality of the solder joint. The need for component cleaning prior to assembly must be evaluated for each component.

  13. Study of Shell-Mold Thermal Resistance: Laboratory Measurements, Estimation from Compact Strip Production Plant Data, and Observation of Simulated Flux-Mold Interface

    González de la C., J. Manuel; Flores F., Tania M.; Castillejos E., A. Humberto


    The slag film that forms between the shell and mold in steel continuous casting is key in regulating the heat transfer between them. Generally, the mechanisms proposed are related to the phenomena associated with the formation of crystals in the solid layer of the film, such as the appearance of internal pores and surface roughness, which decrease phononic conduction through the layer and interfacial gap with the mold, respectively, and the emergence of crystals themselves, which reduce the transmissivity of infrared radiation across the layer. Due to the importance of the solid layer, this study investigates experimentally the effective thermal resistance, R T, between a hot Inconel surface and a cold Cu surface separated by an initially glassy slag disk, made from powders for casting low and medium-carbon steels, denoted as A and B, respectively. In the tests, an initially mirror-polished disk is sandwiched for 10,800 seconds while the Inconel temperature, away from the disk face, is maintained steady at a value, T c, between 973 K and 1423 K (700 °C and 1150 °C)-below the liquidus temperature of the slags. The disks have a thickness, d t, between ~0.7 and 3.2 mm. Over the range of conditions studied, mold slag B shows R T 33 pct larger than slag A, and microscopic observation of disks hints that the greater resistance arises from the larger porosity developed in B. This finding is supported by high-temperature confocal laser scanning microscope observations of the evolution of the surface of slag parallelepipeds encased between Pt sheets, which reveal that during devitrification the film surface moves outward not inward, contrary with what is widely claimed. This behavior would favor contact of the slag with the mold for both kinds of powders. However, in the case of slag A, the crystalline grains growing at or near the surface pack closely together, leaving only few and small empty spaces. In slag B, crystalline grains pack loosely and many and large empty

  14. Surface tension and reactive wetting in solder connections

    Wedi, Andre; Schmitz, Guido [Institut fuer Materialphysik, Westf. Wilhelms-Universitaet, Wilhelm-Klemm-Strasse 10, 48149 Muenster (Germany)


    Wetting is an important pre-requisite of a reliable solder connection. However, it is only an indirect measure for the important specific energy of the reactive interface between solder and base metallization. In order to quantify this energy, we measured wetting angles of solder drops as well as surface tension of SnPb solders under systematic variation of composition and gaseous flux at different reflow temperatures. For the latter, we used the sessile drop method placing a solder drop on a glas substrate. From the two independent data sets, the important energy of the reactive interface is evaluated based on Young's equation. Remarkably, although both, the tension between the solder and flux and the wetting angle, reveal significant dependence on solder composition. So the adhesion energy reveals distinguished plateaus which are related to different reaction products in contact to the solder. TEM analysis and calculations of phase stabilities show that there is no Cu6Sn5 for high lead concentrations. The experiments confirm a model of reactive wetting by Eustathopoulos.

  15. Solderability test development. Final report. [Meniscograph tests

    Jarboe, D.M.


    Operating procedures and data reduction techniques applicable to the Meniscograph (General Electric Company, Limited) were developed. Using force-time traces from tests involving various sample materials and configurations, flux types, and test temperatures, the wetting rate and contact angle were obtained through statistical treatment of the data. This information provides a means of directly correlating solderability with the physical phenomenon of wetting.

  16. Reduced oxide soldering activation (ROSA) PWB solderability testing

    Hernandez, C.L.; Hosking, F.M. [Sandia National Labs., Albuquerque, NM (United States). Physical and Joining Metallurgy Dept.; Reed, J. [Texas Instruments, Austin, TX (United States); Tench, D.M.; White, J. [Rockwell Science Center, Thousand Oaks, CA (United States)


    The effect of ROSA pretreatment on the solderability of environmentally stressed PWB test coupons was investigated. The PWB surface finish was an electroplated, reflowed solder. Test results demonstrated the ability to recover plated-through-hole fill of steam aged samples with solder after ROSA processing. ROSA offers an alternative method for restoring the solderability of aged PWB surfaces.

  17. Imaging and Analysis of Void-defects in Solder Joints Formed in Reduced Gravity using High-Resolution Computed Tomography

    Easton, John W.; Struk, Peter M.; Rotella, Anthony


    As a part of efforts to develop an electronics repair capability for long duration space missions, techniques and materials for soldering components on a circuit board in reduced gravity must be developed. This paper presents results from testing solder joint formation in low gravity on a NASA Reduced Gravity Research Aircraft. The results presented include joints formed using eutectic tin-lead solder and one of the following fluxes: (1) a no-clean flux core, (2) a rosin flux core, and (3) a solid solder wire with external liquid no-clean flux. The solder joints are analyzed with a computed tomography (CT) technique which imaged the interior of the entire solder joint. This replaced an earlier technique that required the solder joint to be destructively ground down revealing a single plane which was subsequently analyzed. The CT analysis technique is described and results presented with implications for future testing as well as implications for the overall electronics repair effort discussed.

  18. High temperature solder alloys for underhood applications. Progress report

    Drewien, C.A.; Yost, F.G.; Sackinger, S. [Sandia National Labs., Albuquerque, NM (United States); Kern, J.; Weiser, M.W. [Univ. of New Mexico (United States). Dept. of Mechanical Engineering


    Under a cooperative research and development agreement with General Motors Corporation, lead-free solder systems including the flux, metallization, and solder are being developed for high temperature, underhood applications. Six tin-rich solders, five silver-rich metallizations, and four fluxes were screened using an experimental matrix whereby every combination was used to make sessile drops via hot plate or Heller oven processing. The contact angle, sessile drop appearance, and in some instances the microstructure was evaluated to determine combinations that would yield contact angles of less than 30{degrees}, well-formed sessile drops, and fine, uniform microstructures. Four solders, one metallization, and one flux were selected and will be used for further aging and mechanical property studies.

  19. Lead-free solder

    Anderson, Iver E. (Ames, IA); Terpstra, Robert L. (Ames, IA)


    A Sn--Ag--Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn--Ag--Cu eutectic solder alloy based on the ternary eutectic Sn--4.7%Ag--1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.

  20. Removing Dross From Molten Solder

    Webb, Winston S.


    Automatic device helps to assure good solder connections. Machine wipes dross away from area on surface of molten solder in pot. Sweeps across surface of molten solder somewhat in manner of windshield wiper. Each cycle of operation triggered by pulse from external robot. Equipment used wherever precise, automated soldering must be done to military specifications.

  1. Thermo-Physical Properties of B2O3-Containing Mold Flux for High Carbon Steels in Thin Slab Continuous Casters: Structure, Viscosity, Crystallization, and Wettability

    Park, Jun-Yong; Kim, Gi Hyun; Kim, Jong Bae; Park, Sewoong; Sohn, Il


    The effect of B2O3 on the thermo-physical properties of commercial mold fluxes, including the viscosity, crystallization behavior, and wettability, was investigated. Viscosity was measured using the rotating spindle method, and CCT (continuous cooling transformation) diagrams were obtained to investigate the crystallization behavior at various cooling rates using CLSM (confocal laser scanning microscope). The wettability of the fluxes was determined by measuring the contact angles at 1573 K (1300 °C) using the digital images generated by the sessile drop method and were used to calculate the surface tension, interfacial tension, and work of adhesion for Flux A (existing flux) and B (modified flux). These thermo-physical properties were correlated with the structural analysis obtained using FT-IR (Fourier transform-infrared), Raman and MAS-NMR (magic angle spin-nuclear magnetic resonance) spectroscopy. In addition, DTA (differential thermal analysis) was performed on the samples to measure the liquidus temperatures. Higher B2O3 concentrations resulted in lower liquidus temperatures, consequently decreasing the viscosity, the break temperature, and the crystallization temperature. However, B2O3 addition accelerated crystal growth owing to the higher diffusion kinetics of the cations, which also reduced the size of the liquid/solid co-existing region.

  2. Solder dross removal apparatus

    Webb, Winston S. (Inventor)


    An automatic dross removal apparatus (10) is disclosed for removing dross from the surface of a solder bath (22) in an automated electric component handling system. A rotatable wiper blade (14) is positioned adjacent the solder bath (22) which skims the dross off of the surface prior to the dipping of a robot conveyed component into the bath. An electronic control circuit (34) causes a motor (32) to rotate the wiper arm (14) one full rotational cycle each time a pulse is received from a robot controller (44) as a component approaches the solder bath (22).

  3. Mold Allergy

    ... Ask the Allergist Health Professionals Partners Media Donate Allergies Mold Allergy What Is a Mold Allergy? If you have an allergy that occurs over ... basement. What Are the Symptoms of a Mold Allergy? The symptoms of mold allergy are very similar ...

  4. Materials chemistry. Composition-matched molecular "solders" for semiconductors.

    Dolzhnikov, Dmitriy S; Zhang, Hao; Jang, Jaeyoung; Son, Jae Sung; Panthani, Matthew G; Shibata, Tomohiro; Chattopadhyay, Soma; Talapin, Dmitri V


    We propose a general strategy to synthesize largely unexplored soluble chalcogenidometallates of cadmium, lead, and bismuth. These compounds can be used as "solders" for semiconductors widely used in photovoltaics and thermoelectrics. The addition of solder helped to bond crystal surfaces and link nano- or mesoscale particles together. For example, CdSe nanocrystals with Na2Cd2Se3 solder was used as a soluble precursor for CdSe films with electron mobilities exceeding 300 square centimeters per volt-second. CdTe, PbTe, and Bi2Te3 powders were molded into various shapes in the presence of a small additive of composition-matched chalcogenidometallate or chalcogel, thus opening new design spaces for semiconductor technologies.

  5. Environmentally compatible solder materials for thick film hybrid assemblies

    Hosking, F.M.; Vianco, P.T.; Rejent, J.A.; Hernandez, C.L. [Sandia National Labs., Albuquerque, NM (United States). Materials and Process Sciences Center


    New soldering materials and processes have been developed over the last several years to address a variety of environmental issues. One of the primary efforts by the electronics industry has involved the development of alternative solders to replace the traditional lead-containing alloys. Sandia National Laboratories is developing such alternative solder materials for printed circuit board and hybrid microcircuit (HMC) applications. This paper describes the work associated with low residue, lead-free soldering of thick film HMC`s. The response of the different materials to wetting, aging, and mechanical test conditions was investigated. Hybrid test vehicles were designed and fabricated with a variety of chip capacitors and leadless ceramic chip carriers to conduct thermal, electrical continuity, and mechanical evaluations of prototype joints. Microstructural development along the solder and thick film interface, after isothermal solid state aging over a range of elevated temperatures and times, was quantified using microanalytical techniques. Flux residues on soldered samples were stressed (temperature-humidity aged) to identify potential corrosion problems. Mechanical tests also supported the development of a solder joint lifetime prediction model. Progress of this effort is summarized.

  6. Wettability study of lead free solder paste and its effect towards multiple reflow

    Idris Siti Rabiatull Aisha


    Full Text Available Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluate the wettability of two different types of no-clean flux onto copper substrate. Besides, its effect towards multiple reflow was also studied. Reflow soldering was conducted for both types of solder paste that contained different type of no-clean flux for up to double reflow. Two different reflow profile was used. The results showed that the Flux A exhibit better soldering performance after first and second reflow soldering. In addition, type of intermetallic compound (IMC found after first reflow remain the same even after second reflow which was Cu-Sn based. This is shows that Flux A manage to control the diffusion process which will finally leads to a better solder joint performance. Nevertheless, mechanical testing should be carried out in order to evaluate the solder joint strength.

  7. C4NP - Lead Free Flip Chip Solder Bumping Manufacturing and Reliability Data%C4NP-无铅倒装晶片焊凸形成生产工艺与可靠性数据


    受控倒塌芯片连接新工艺是一种由IBM公司开发、由Suss MicroTec公司推向商品化的新型焊凸形成技术.受控倒塌芯片连接新工艺采用各种无铅焊料合金致力于解决现有的凸台.形成技术限定,使低成本小节距焊凸形成成为可能.受控倒塌芯片连接新工艺是一种焊球转移技术,熔焊料被注入预先制成并可重复使用的玻璃模板(模具).这种注满焊料的模具在焊料转入圆片之前先经过检查以确保高成品率.注满焊料的模具与圆片达到精确的接近后以与液态熔剂复杂性无关的简单工序转移在整个300 mm(或300 mm以下)圆片上.受控倒塌芯片连接新工艺技术能够在焊膏印刷中实现小节距凸台形成的同时提供相同合金选择的适应性.这种简单的受控倒塌芯片连接新工艺使低成本、高成品率以及快速封装周期的解决方法对于细节距FCiP以及WLCSP凸台形成均能适用.%C4NP is a new solder bumping technology developed by IBM and commercialized by Suss MicroTec. C4NP addresses the limitations of existing bumping technologies by enabling low-cost, fine pitch bumping using a variety of lead-free solder alloys. C4NP is a solder transfer technology where molten solder is injected into pre-fabricated and reusable glass templates (molds). The filled mold is inspected prior to solder transfer to the wafer to ensure high final yields. Filled mold and wafer are brought into close proximity and solder bumps are transferred onto the entire 300 mm (or smaller)wafer in a single process step without the complexities associated with liquid flux. C4NP technology is capable of fine pitch bumping while offering the same alloy selection flexibility as solder paste printing.The simplicity of the C4NP process makes it a low cost, high yield and fast cycle time solution for both,fine-pitch FCiP as well as WLCSP bumping applications.This paper summarizes the latest manufacturing and reliability data for

  8. A new active solder for joining electronic components



    Electronic components and micro-sensors utilize ceramic substrates, copper and aluminum interconnect and silicon. The joining of these combinations require pre-metallization such that solders with fluxes can wet such combinations of metals and ceramics. The paper will present a new solder alloy that can bond metals, ceramics and composites. The alloy directly wets and bonds in air without the use flux or premetallized layers. The paper will present typical processing steps and joint microstructures in copper, aluminum, aluminum oxide, aluminum nitride, and silicon joints.

  9. Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology

    HAN Zong-jie; XUE Song-bai; WANG Jian-xin; ZHANG Xin; ZHANG Liang; YU Sheng-lin; WANG Hui


    Soldering experiments of quad flat package(QFP) devices were carried out by means of diode laser soldering system with Sn-Ag-Cu and Sn-Cu-Ni lead-free solders, and competitive experiments were also carried out not only with Sn-Pb eutectic solders but also with infrared reflow soldering method. The results indicate that under the conditions of laser continuous scanning mode as well as the fixed laser soldering time, an optimal power exists, while the optimal mechanical properties of QFP micro-joints are gained. Mechanical properties of QFP micro-joints soldered with laser soldering system are better than those of QFP micro-joints soldered with IR reflow soldering method. Fracture morphologies of QFP micro-joints soldered with laser soldering system exhibit the characteristic of tough fracture, and homogeneous and fine dimples appear under the optimal laser output power.

  10. Cost comparison modeling between current solder sphere attachment technology and solder jetting technology

    Davidson, R.N.


    By predicting the total life-cycle cost of owning and operating production equipment, it becomes possible for processors to make accurate and intelligent decisions regarding major capitol equipment investments as well as determining the most cost effective manufacturing processes and environments. Cost of Ownership (COO) is a decision making technique based on inputting the total costs of acquiring, operating and maintaining production equipment. All quantitative economic and production data can be modeled and processed using COO software programs such as the Cost of Ownership Luminator program TWO COOL{trademark}. This report investigated the Cost of Ownership differences between the current state-of-the-art solder ball attachment process and a prototype solder jetting process developed by Sandia National Laboratories. The prototype jetting process is a novel and unique approach to address the anticipated high rate ball grid array (BGA) production requirements currently forecasted for the next decade. The jetting process, which is both economically and environmentally attractive eliminates the solder sphere fabrication step, the solder flux application step as well as the furnace reflow and post cleaning operations.

  11. Environmentally friendly solders 3-4 beyond Pb-based systems

    GAO Yuan; LIU Peng; GUO Fu; XIA Zhidong; LEI Yongping; SHI Yaowu


    , dwell time, etc.The damage accumulation features and residual mechanical properties of the thermomechanically-fatigued composite solder joints were compared with non-composite solder joints.To match the lead-free alloys, various types of water soluble no-clean soldering flux have also been developed and their properties were presented.

  12. Soldering of Nanotubes onto Microelectrodes

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina


    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...... bonds were consistently found to be mechanically stronger than the carbon nanotubes....

  13. Capillary flow solder wettability test

    Vianco, P.T.; Rejent, J.A.


    A test procedure was developed to assess the capillary flow wettability of solders inside of a confined geometry. The test geometry was comprised of two parallel plates with a controlled gap of constant thickness (0.008 cm, 0.018 cm, 0.025 cm, and 0.038 cm). Capillary flow was assessed by: (1) the meniscus or capillary rise of the solder within the gap, (2) the extent of void formation in the gap, and (3) the time-dependence of the risen solder film. Tests were performed with the lead-free solders.

  14. Wettability study of lead free solder paste and its effect towards multiple reflow

    Idris Siti Rabiatull Aisha; Zuleikha Siti; Abd Malek Zetty Akhtar


    Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluate the wettability of two different types of no-clean flux onto copper substrate. Besides, its effect towards multiple reflow was also studied. Reflow soldering was conducted for both types of solde...

  15. Allergies, asthma, and molds

    Reactive airway - mold; Bronchial asthma - mold; Triggers - mold; Allergic rhinitis - pollen ... Things that make allergies or asthma worse are called triggers. Mold is a common trigger. When your asthma or allergies become worse due to mold, you are ...

  16. Porosity in collapsible Ball Grid Array solder joints

    Gonzalez, C.A. [Univ. of California, Berkeley, CA (United States). Dept. of Materials Science and Mineral Engineering]|[Lawrence Berkeley National Lab., Berkeley, CA (United States). Materials Science Div.


    Ball Grid Array (BGA) technology has taken off in recent years due to the increased need for high interconnect density. Opposite to all the advantages BGA packages offer, porosity in collapsible BGA solder joints is often a major concern in the reliability of such packages. The effect of pores on the strength of collapsible BGA solder-joints was studied by manufacturing samples with different degrees of porosity and testing them under a shear load. It was found that the shear strength of the solder joints decreased in a linear fashion with increasing porosity. Failure occurred by internal necking of the interpore matrix. It was confirmed that entrapment of flux residues leads to porosity by manufacturing fluxless samples in a specially made furnace, and comparing them with samples assembled using flux. Also, contamination of Au electrodeposits (in substrate metallization) was determined to cause significant porosity. It was found that hard-Au (Co hardened Au) electrodeposits produce high degrees of porosity even in the absence of flux. Finally, increasing the time the solder spends in the molten state was proven to successfully decrease porosity.

  17. Effects of CaO/SiO2 Ratio and Na2O Content on Melting Properties and Viscosity of SiO2-CaO-Al2O3-B2O3-Na2O Mold Fluxes

    Wang, Lin; Zhang, Chen; Cai, Dexiang; Zhang, Jianqiang; Sasaki, Yasushi; Ostrovski, Oleg


    This paper investigated the effects of CaO/SiO2 ratio (0.8 to 1.5) and Na2O concentration (6 to 9 wt pct) on melting properties and viscosity of SiO2-CaO-Al2O3-B2O3-Na2O mold fluxes with a fixed B2O3 content. Melting properties of fluxes (softening temperature T s, hemispherical temperature T h, and fluidity temperature T f) were determined by the hot-stage microscopy method. Viscosity was measured using rotating cylindrical viscometer, and structure of quenched fluxes was studied using Raman spectroscopy. Equilibrium phases in the SiO2-CaO-Al2O3-B2O3-Na2O system were calculated using FactSage. It was found that T h decreased with increasing CaO/SiO2 ratio from 0.8 to 1.0 and increased with a further increase in the CaO/SiO2 ratio to 1.5. The effect of Na2O content in the range of 6 to 9 wt pct on T h of the flux with a fixed CaO/SiO2 ratio at 1.3 was marginal. Increasing CaO/SiO2 ratio and Na2O content increased the break temperature and reduced the value of viscosity at 1673 K (1400 °C). Viscosity of liquid fluxes was discussed in the relationship with the flux structure. Melting properties and viscosity of boracic fluxes were compared with those of industrial fluorine-containing mold fluxes.

  18. Soldering Formalism Theory and Applications

    Wotzasek, C


    The soldering mechanism is a new technique to work with distinct manifestations of dualities that incorporates interference effects, leading to new physical results that includes quantum contributions. This approach was used to investigate the cases of electromagnetic dualities, and $D\\geq 2$ bosonization. In the former context this technique is applied for the quantum mechanical harmonic oscillator, the scalar field theory in two dimensions and the Maxwell theory in four dimensions. The soldered actions in any dimension leads to a master action which is duality invariant under a much bigger set of symmetries. The effects of coupling to gravity are also elaborated. In the later context, a technique is developed that solders the dual aspects of some symmetry following from the bosonisation of two distinct fermionic models, leading to new results which cannot be otherwise obtained. Exploiting this technique, the two dimensional chiral determinants with opposite chirality are soldered to reproduce either the usu...

  19. Molds in the Environment

    ... on Facebook Tweet Share Compartir Molds in the Environment What are molds? What are some of the ... molds found? Molds are found in virtually every environment and can be detected, both indoors and outdoors, ...

  20. Mold Testing or Sampling

    In most cases, if visible mold growth is present, sampling is unnecessary. Since no EPA or other federal limits have been set for mold or mold spores, sampling cannot be used to check a building's compliance with federal mold standards.

  1. Mold Simulator Study of the Initial Solidification of Molten Steel in Continuous Casting Mold: Part II. Effects of Mold Oscillation and Mold Level Fluctuation

    Zhang, Haihui; Wang, Wanlin


    The surface quality of the continuous casting strands is closely related to the initial solidification of liquid steel in the vicinity of the mold meniscus, and thus the clear understanding of the behavior of molten steel initial solidification would be of great importance for the control of the quality of final slab. With the development of the mold simulator techniques, the complex interrelationship between the solidified shell surface profile, heat flux, shell thickness, mold level fluctuation, and the infiltrated slag film was well illustrated in our previous study. As the second part, this article investigated the effect of the mold oscillation frequency, stroke, and mold level fluctuation on the initial solidification of the molten steel through the conduction of five different experiments. Results suggested that in the case of the stable mold level, the oscillation marks (OMs) exhibit equally spaced horizon depressions on the shell surface, where the heat flux at the meniscus area raises rapidly during negative strip time (NST) period and the presence of each OMs on the shell surface is corresponding to a peak value of the heat flux variation rate. Otherwise, the shell surface is poorly defined by the existence of wave-type defects, such as ripples or deep depressions, and the heat flux variation is irregular during NST period. The rising of the mold level leads to the longer-pitch and deeper OMs formation; conversely, the falling of mold level introduces shorter-pitch and shallower OMs. With the increase of the mold oscillation frequency, the average value of the low-frequency heat flux at the meniscus increases; however, it decreases when the mold oscillation stroke increases. Additionally, the variation amplitude of the high-frequency temperature and the high-frequency heat flux decreases with the increase of the oscillation frequency and the reduction of the oscillation stroke.

  2. Solder joint technology materials, properties, and reliability

    Tu, King-Ning


    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  3. Wetting behavior of alternative solder alloys

    Hosking, F.M.; Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.


    Recent economic and environmental issues have stimulated interest in solder alloys other than the traditional Sn-Pb eutectic or near eutectic composition. Preliminary evaluations suggest that several of these alloys approach the baseline properties (wetting, mechanical, thermal, and electrical) of the Sn-Pb solders. Final alloy acceptance will require major revisions to existing industrial and military soldering specifications. Bulk alloy and solder joint properties are consequently being investigated to validate their producibility and reliability. The work reported in this paper examines the wetting behavior of several of the more promising commercial alloys on copper substrates. Solder wettability was determined by the meniscometer and wetting balance techniques. The wetting results suggest that several of the alternative solders would satisfy pretinning and surface mount soldering applications. Their use on plated through hole technology might be more difficult since the alloys generally did not spread or flow as well as the 60Sn-40Pb solder.

  4. The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

    Jang, Guh-Yaw; Duh, Jenq-Gong


    The eutectic Sn-Ag solder alloy is one of the candidates for the Pb-free solder, and Sn-Pb solder alloys are still widely used in today’s electronic packages. In this tudy, the interfacial reaction in the eutectic Sn-Ag and Sn-Pb solder joints was investigated with an assembly of a solder/Ni/Cu/Ti/Si3N4/Si multilayer structures. In the Sn-3.5Ag solder joints reflowed at 260°C, only the (Ni1-x,Cux)3Sn4 intermetallic compound (IMC) formed at the solder/Ni interface. For the Sn-37Pb solder reflowed at 225°C for one to ten cycles, only the (Ni1-x,Cux)3Sn4 IMC formed between the solder and the Ni/Cu under-bump metallization (UBM). Nevertheless, the (Cu1-y,Niy)6Sn5 IMC was observed in joints reflowed at 245°C after five cycles and at 265°C after three cycles. With the aid of microstructure evolution, quantitative analysis, and elemental distribution between the solder and Ni/Cu UBM, it was revealed that Cu content in the solder near the solder/IMC interface played an important role in the formation of the (Cu1-y,Niy)6Sn5 IMC. In addition, the diffusion behavior of Cu in eutectic Sn-Ag and Sn-Pb solders with the Ni/Cu UBM were probed and discussed. The atomic flux of Cu diffused through Ni was evaluated by detailed quantitative analysis in an electron probe microanalyzer (EPMA). During reflow, the atomic flux of Cu was on the order of 1016-1017 atoms/cm2sec in both the eutectic Sn-Ag and Sn-Pb systems.

  5. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    Rolin, T. D.; Hodge, R. E.


    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  6. Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections

    Ren, Guang [Stokes Laboratories, Bernal Institute, University of Limerick (Ireland); Department of Civil Engineering and Materials Science, University of Limerick (Ireland); Wilding, Ian J. [Henkel Ltd, Hemel Hempstead (United Kingdom); Collins, Maurice N., E-mail: [Stokes Laboratories, Bernal Institute, University of Limerick (Ireland)


    Due to its commercial potential and the technological challenges associated with processing, low temperature soldering is a topic gaining widespread interest in both industry and academia in the application space of consumer and “throw away” electronics. This review focuses on the latest metallurgical alloys, tin zinc (Sn–Zn) and tin bismuth (Sn–Bi), for lower temperature processed electronic interconnections. The fundamentals of solder paste production and flux development for these highly surface active metallic powders are introduced. Intermetallic compounds that underpin low temperature solder joint production and reliability are discussed. The influence of alloying on these alloys is described in terms of critical microstructural changes, mechanical properties and reliability. The review concludes with an outlook for next generation electronic interconnect materials. - Highlights: • Review of the latest advances in Sn–Zn and Sn–Bi solder alloys. • Technological developments underpinning low temperature soldering. • Micro alloying influences on next generation interconnect materials.

  7. Solder Joint Health Monitoring Testbed

    Delaney, Michael M.; Flynn, James G.; Browder, Mark E.


    A method of monitoring the health of selected solder joints, called SJ-BIST, has been developed by Ridgetop Group Inc. under a Small Business Innovative Research (SBIR) contract. The primary goal of this research program is to test and validate this method in a flight environment using realistically seeded faults in selected solder joints. An additional objective is to gather environmental data for future development of physics-based and data-driven prognostics algorithms. A test board is being designed using a Xilinx FPGA. These boards will be tested both in flight and on the ground using a shaker table and an altitude chamber.

  8. Handbook of machine soldering SMT and TH

    Woodgate, Ralph W


    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  9. Determination of Average Failure Time and Microstructural Analysis of Sn-Ag-Bi-In Solder Under Electromigration

    Wu, Albert T.; Sun, K. H.


    Despite the extensive use of Sn-Ag-Cu as a Pb-free solder alloy, its melting point is significantly higher than that of eutectic Sn-Pb solder. Sn-Ag-Bi-In solder is an alternative Pb-free solder, with a melting temperature close to that of eutectic Sn-Pb. This study elucidates the electromigration behavior of Sn-Ag-Bi-In solder and then compares the results with those of the Sn-Ag-Bi system. The behavior of Pb-free Sn-Ag-Bi-In solder strips under electromigration is examined by preparing them in Si (001) U-grooves. The samples are then tested under various temperatures and current densities. Although the compounds thicken near both electrodes with current stressing, the thickness at the anode exceeds that at the cathode. Experimental results of the average failure time indicate that Sn-Ag-Bi-In solder has a longer lifetime than does Sn-Ag-Bi, which is attributed to the ζ phase. Additionally, the ζ phase dissolved by the current in the early stage replenishes the outgoing atomic flux. These atomic fluxes also enhance the growth of abnormally large particles in the middle of the strips. Field-emission electron probe microanalysis (FE-EPMA) results indicate that the amount of indium is reduced after the ζ phase near the cathode is exhausted for extended current stressing time.

  10. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)


    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  11. Improvement of the auto wire feeder machine in a de-soldering process

    Niramon Nonkhukhetkhong


    Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

  12. Lead free solder mechanics and reliability

    Pang, John Hock Lye


    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  13. Effect of B2O3 on Crystallization Behavior, Structure, and Heat Transfer of CaO-SiO2-B2O3-Na2O-TiO2-Al2O3-MgO-Li2O Mold Fluxes

    Yang, Jian; Zhang, Jianqiang; Sasaki, Yasushi; Ostrovski, Oleg; Zhang, Chen; Cai, Dexiang; Kashiwaya, Yoshiaki


    The effect of B2O3 on crystallization behavior, structure, and heat transfer of CaO-SiO2-Na2O-B2O3-TiO2-Al2O3-MgO-Li2O fluorine-free mold fluxes was investigated using hot thermocouple technique (HTT), Raman spectroscopy, and infrared emitter technique (IET), respectively. The critical cooling rate in continuous cooling experiments decreased and the incubation time determined in isothermal experiments increased with increasing B2O3 content, both implying a decreasing crystallization tendency. The major phases of mold fluxes determined using X-ray diffraction changed from Ca2MgSi2O7 and Ca11Si4B2O22 to CaSiO3 with the increasing amount of B2O3. B2O3 increased the degree of polymerization in silicate network, forming 3D borate structures. Addition of B2O3 decreased the flux melting temperature which has a significant impeding effect on the crystal nucleation and growth. The heat flux of mold fluxes measured using IET showed that the increase of B2O3 from 4.7 to 6.8 mass pct impeded the heat flux; while a further increase of B2O3 from 6.8 to 10.4 mass pct promoted the heat transfer. This phenomenon was attributed to the variation of crystallization behavior and crystal morphology with different B2O3 content in the mold fluxes.

  14. Effect of superheat, mold, and casting materials on the metal/mold interfacial heat transfer during solidification in graphite-lined permanent molds

    Prabhu, K. Narayan; Suresha, K. M.


    Heat transfer during the solidification of an Al-Cu-Si alloy (LM4) and commercial pure tin in single steel, graphite, and graphite-lined metallic (composite) molds was investigated. Experiments were carried out at three different superheats. In the case of composite molds, the effect of the thickness of the graphite lining and the outer wall on heat transfer was studied. Temperatures at known locations inside the mold and casting were used to solve the Fourier heat conduction equation inversely to yield the casting/mold interfacial heat flux transients. Increased melt superheats and higher thermal conductivity of the mold material led to an increase in the peak heat flux at the metal/mold interface. Factorial experiments indicated that the mold material had a significant effect on the peak heat flux at the 5% level of significance. The ratio of graphite lining to outer steel wall and superheat had a significant effect on the peak heat flux in significance range varying between 5 and 25%. A heat flux model was proposed to estimate the maximum heat flux transients at different superheat levels of 25 to 75 °C for any metal/mold combinations having a thermal diffusivity ratio (α R) varying between 0.25 and 6.96. The heat flow models could be used to estimate interfacial heat flux transients from the thermophysical properties of the mold and cast materials and the melt superheat. Metallographic analysis indicated finer microstructures for castings poured at increased melt superheats and cast in high-thermal diffusivity molds.

  15. Study on laser and hot air reflow soldering of PBGA solder ball

    田艳红; 王春青


    Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bump reflowed by laser was superior than the solder bump by hot air, and the microstructure within the solder bump reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn4 layer and remnant Au element. Needle-like AuSn4 grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni3Sn4 intermetallic compound was found at the interface of solder bump reflowed by hot air, and AuSn4 particles distributed within the whole solder bump randomly. The combination effect of the continuous AuSn4 layer and finer eutectic microstructure contributes to the higher shear strength of solder bump reflowed by laser.

  16. The Thermal Distortion of a Funnel Mold

    Hibbeler, Lance C.; Thomas, Brian G.; Schimmel, Ronald C.; Abbel, Gert


    This article investigates the thermal distortion of a funnel mold for continuous casting of thin slabs and explores the implications on taper and solidification of the steel shell. The three-dimensional mold temperatures are calculated using shell-mold heat flux and cooling water profiles that were calibrated with plant measurements. The thermal stresses and distorted shape of the mold are calculated with a detailed finite-element model of a symmetric fourth of the entire mold and waterbox assembly, and they are validated with plant thermocouple data and measurements of the wear of the narrow-face copper mold plates. The narrow-face mold distorts into the typical parabolic arc, and the wide face distorts into a "W" shape owing to the large variation in bolt stiffnesses. The thermal expansion of the wide face works against the applied narrow-face taper and funnel effects, so the effect of thermal distortion must be considered to accurately predict the ideal mold taper.

  17. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan


    , and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...... by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under...



    Mar 1, 2012 ... Based on this, a wettability test using copper grid was conducted on the solder alloys produced. The result shows that wetting time varied from 4 seconds to 5 seconds for the lead-free solders ... at the interfaces [4]. This study ...

  19. Nano-soldering to single atomic layer

    Girit, Caglar O.; Zettl, Alexander K.


    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  20. Laser ablative fluxless soldering (LAFS): 60Sn-40Pb solder wettability tests on laser cleaned OFHC copper substrates

    Peebles, H. C.; Keicher, D. M.; Hosking, F. M.; Hlava, P. F.; Creager, N. A.


    OFHC copper substrates, cleaned by laser ablation under argon and helium gas, were tested for solder wettability by 60Sn-40Pb using an area-of-spread method. The wettability of copper surfaces cleaned under both argon and helium gas was found to equal or exceed the wettability obtained on this surface in air using a standard RMA flux. The area of spread on copper substrates cleaned under helium was eight times larger than the area of spread of substrates cleaned under argon. The enhanced spreading observed on the substrates cleaned under helium gas was found to be due to surface roughness. 11 refs., 8 figs., 2 tabs.

  1. Low cycle fatigue of lead free solder joints

    Schemmann, Lars; Wedi, Andre; Baither, Dietmar; Schmitz, Guido [Institut fuer Materialphysik, Westf. Wilhelms-Universitaet, Muenster (Germany)


    Presently solders containing lead are banned from consumer electronics. Important alternatives are the Sn-Ag-Cu (SAC) solders and solders containing antimony. This work studies the isothermal low cycle fatigue properties of SAC solders and the SnSb(8) solder. For the experiments, model solder joints were produced and used. They consist of two pure copper plates joined together by a circular disk of solder. Low cycle fatigue experiments were done under displacement control. Furthermore hardness was tested by a micro indenter. In order to find an explanation for the different lifetimes of the solders, several micro structural investigations were performed. For this we used transmission and scanning electron microscopy as well as optical microscopy. The measured data showed a strong relation between lifetime and hardness of the solder alloy. We also found, that the type of solder influences the crack propagation.

  2. Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds

    Haseeb, A.S.M.A., E-mail:; Arafat, M.M., E-mail:; Johan, Mohd Rafie, E-mail:


    This work investigates the effects of molybdenum nanoparticles on the growth of interfacial intermetallic compound between Sn-3.8Ag-0.7Cu solder and copper substrate during multiple reflow. Molybdenum nanoparticles were mixed with Sn-3.8Ag-0.7Cu solder paste by manual mixing. Solder samples were reflowed on a copper substrate in a 250 Degree-Sign C reflow oven up to six times. The molybdenum content of the bulk solder was determined by inductive coupled plasma-optical emission spectrometry. It is found that upon the addition of molybdenum nanoparticles to Sn-3.8Ag-0.7Cu solder, the interfacial intermetallic compound thickness and scallop diameter decreases under all reflow conditions. Molybdenum nanoparticles do not appear to dissolve or react with the solder. They tend to adsorb preferentially at the interface between solder and the intermetallic compound scallops. It is suggested that molybdenum nanoparticles impart their influence on the interfacial intermetallic compound as discrete particles. The intact, discrete nanoparticles, by absorbing preferentially at the interface, hinder the diffusion flux of the substrate and thereby suppress the intermetallic compound growth. - Highlights: Black-Right-Pointing-Pointer Mo nanoparticles do not dissolve or react with the SAC solder during reflow. Black-Right-Pointing-Pointer Addition of Mo nanoparticles results smaller IMC thickness and scallop diameter. Black-Right-Pointing-Pointer Mo nanoparticles influence the interfacial IMC through discrete particle effect.

  3. Floods and Mold Growth

    Mold growth may be a problem after flooding. Excess moisture in the home is cause for concern about indoor air quality primarily because it provides breeding conditions for pests, molds and other microorganisms.

  4. Effects of soldering and laser welding on bond strength of ceramic to metal.

    Aladağ, Akin; Cömlekoğlu, M Erhan; Dündar, Mine; Güngör, M Ali; Artunç, Celal


    Welding or soldering of metal frameworks negatively affects the overall bond strength between the veneering ceramic and metal. The purpose of this study was to evaluate the effect of soldering and laser-welding procedures on the bond strength between ceramic and metal. Thirty Ni-based metal specimens (Wiron 99) (8 × 4 × 4 mm) were fabricated and divided into 3 groups; soldered (S), laser welded (L), and control (untreated cast alloy) (n=10). In S and L specimens, a notch (1 × 1.5 mm) was prepared longitudinally on the surface of each specimen and filled with compatible alloy (Wiron soldering rods and Wiroweld NC, respectively). Vickers hardness measurements were made after polishing the surfaces with a metallographic polishing kit. A veneering ceramic (VITA VMK 95) was vibrated, condensed in a mold, and fired on the metal frameworks. The specimens were sectioned in 2 axes to obtain nontrimmed bar specimens with a bonding area of approximately 1 mm². Forty bars per block were obtained. Each bar was subjected to microtensile bond strength (μTBS) testing with a crosshead speed of 1 mm/min. The μTBS data (MPa) were recorded, and SEM was used for failure analysis of the tested bars. The measurements were statistically analyzed using a 1-way ANOVA and Tamhane tests (α=.05). The mean differences in μTBS of veneering ceramic to soldered (10.4 ±2.4 MPa) and laser-welded (11.7 ±1.3 MPa) metal surfaces were not significantly different and were significantly lower than that of the cast alloy (25.4 ±3.6 MPa) (Plaser-welded groups (129 ±11 HV) (Plaser welding significantly decreased the μTBS of a veneering ceramic to a base metal alloy. Copyright © 2011 The Editorial Council of the Journal of Prosthetic Dentistry. Published by Mosby, Inc. All rights reserved.

  5. Bleach Neutralizes Mold Allergens

    Science Teacher, 2005


    Researchers at National Jewish Medical and Research Center have demonstrated that dilute bleach not only kills common household mold, but may also neutralize the mold allergens that cause most mold-related health complaints. The study, published in the Journal of Allergy and Clinical Immunology, is the first to test the effect on allergic…

  6. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders


    controlled fatigue life, likely because of increased void -nucleation via creep-fatigue interactions. Since the solder is largely under plastically deform the solder in order to break the oxide layers and eliminate some minor voids around the NiTi particles. Figure 32... Underfill Constraint Effects during Thermomechanical Cycling of Flip Chip Solder Joints,” Journal of Electronic Materials, Vol. 31, No. 4, 2002

  7. Lead Ingestion Hazard in Hand Soldering Environments.



  8. Modeling the diffusion of solid copper into liquid solder alloys

    Rizvi, M.J. [School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, London, SE10 9LS (United Kingdom)], E-mail:; Lu, H.; Bailey, C. [School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, London, SE10 9LS (United Kingdom)


    During the soldering process, the copper atoms diffuse into liquid solders. The diffusion process determines integrity and the reworking possibility of a solder joint. In order to capture the diffusion scenarios of solid copper into liquid Sn-Pb and Sn-Cu solders, a computer modeling has been performed for 10 s. An analytical model has also been proposed for calculating the diffusion coefficient of copper into liquid solders. It is found that the diffusion coefficient for Sn-Pb solder is 2.74 x 10{sup -10} m{sup 2}/s and for Sn-Cu solder is 6.44 x 10{sup -9} m{sup 2}/s. The modeling results reveal that the diffusion coefficient is one of the major factors that govern the rate at which solid Cu dissolve in the molten solder. The predicted dissolved amounts of copper into solders have been validated with the help of scanning electron microscopic analysis.

  9. The use of process plasmas for cleaning PCB substrates for fluxless soldering of electronic assemblies

    Philpott, J.D


    In this thesis the ability of single and multiple gas plasmas to improve the solderability of PCB substrates, and hence allow the removal of flux from the soldering process for electronic assemblies has been investigated. It has been shown that asymmetric electrode plasma chambers allow the use of single gas plasmas for this purpose due to their greater efficiency compared to symmetric systems. It has also been shown that the use of triple gas plasmas results in improved cleaning ability when using symmetric electrode systems. Dynamic contact angle (DCA) analysis was the primary analytical technique used in this work. This technique produces two contact angles, advancing and receding. The advancing contact angle determines the surface energy of a solid. It has been shown using Auger analysis that contact angles of approximately 48 deg indicate low levels of hydrocarbon contamination. It has also been shown that plasma cleaning processes giving advancing contact angles of this magnitude result in the ability to solder Hot Air Solder Leveled (HASL) PCB substrates without the use of flux. In addition it has been shown that, whilst it is possible to reduce the advancing contact angle of copper substrates considerably, the reduction is not as great as for HASL substrates. Analytical models of RF plasma chambers have also been reviewed, and these adapted for the plasma chambers used in this work. The experimental work carried out in this research also shows that these models hold true. (author)

  10. High rate fabrication of compression molded components

    Matsen, Marc R.; Negley, Mark A.; Dykstra, William C.; Smith, Glen L.; Miller, Robert J.


    A method for fabricating a thermoplastic composite component comprises inductively heating a thermoplastic pre-form with a first induction coil by inducing current to flow in susceptor wires disposed throughout the pre-form, inductively heating smart susceptors in a molding tool to a leveling temperature with a second induction coil by applying a high-strength magnetic field having a magnetic flux that passes through surfaces of the smart susceptors, shaping the magnetic flux that passes through surfaces of the smart susceptors to flow substantially parallel to a molding surface of the smart susceptors, placing the heated pre-form between the heated smart susceptors; and applying molding pressure to the pre-form to form the composite component.

  11. Electromigration and solid state aging of flip chip solder joints and analysis of tin whisker on lead-frame

    Lee, Taekyeong

    Electromigration and solid state aging in flip chip joint, and whisker on lead frame of Pb-containing (eutectic SnPb) and Pb-free solders (SnAg 3.5, SnAg3.8Cu0.7, and SnCu0.7), have been studied systematically, using Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Analysis (EDX), and synchrotron radiation. The high current density in flip chip joint drives the diffusion of atoms of eutectic SnPb and SnAgCu. A marker is used to measure the diffusion flux in a half cross-sectioned solder joint. SnAgCu shows higher resistance against electromigration than eutectic SnPb. In the half cross-sectioned solder joint, void growth is the dominant failure mechanism. However, the whole solder balls in the underfill show that the failure mechanism is a result from the dissolution of electroless Ni under bump metallization (UBM) of about 10 mum thickness. The growth rate between intermetallic compounds in molten and solid solders differed by four orders of magnitude. In liquid solder, the growth rate is about 1 mum/min; the growth rate in solid solder is only about 10 -4 mum/min. The difference is not resulting from factors of thermodynamics, which is the change of Gibbs free energy before and after intermetallic compound formation, but from kinetic factors, which is the rate of change of Gibbs free energy. Even though the difference in growth rate between eutectic SnPb and Pb-free solders during solid state aging was found, the reason behind such difference shown is unclear. The orientation and stress levels of whiskers are measured by white X-ray of synchrotron radiation. The growth direction is nearly parallel to one of the principal axes of tin. The compressive stress level is quite low because the residual stress is relaxed by the whisker growth.

  12. Organic solderability preservation evaluation. Topical report

    Becka, G.A.; McHenry, M.R.; Slanina, J.T.


    An evaluation was conducted to determine the possible replacement of the hot air solder leveling (HASL) process used in the Allied Signal Federal Manufacturing & Technologies (FM&T) Printed Wiring Board Facility with an organic solderability preservative (OSP). The drivers for replacing HASL include (1) Eliminating lead from PWB fabrication processes; (2) Potential legislation restricting use of lead, (3) Less expensive processing utilizing OSP rather than HASL processing; (4) Avoiding solder dross disposal inherent with HASL processing, (5) OSP provides flat, planar surface required for surface mount technology product, and (6) Trend to thinner PWB designs. A reduction in the cost of nonconformance (CONC) due to HASL defects (exposed copper, solderability, dewetting and non-wetting) would be realized with the incorporation of the OSP process. Several supplier HASL replacement candidates were initially evaluated. One supplier chemistry was chosen for potential use in the FM&T PWB and assembly areas.

  13. Soldering Chiralities; 2, Non-Abelian Case

    Wotzasek, C


    We study the non-abelian extension of the soldering process of two chiral WZW models of opposite chiralities, resulting in a (non-chiral) WZW model living in a 2D space-time with non trivial Riemanian curvature.

  14. Shrink-Fit Solderable Inserts Seal Hermetically

    Croucher, William C.


    Shrink-fit stainless-steel insert in aluminum equipment housing allows electrical connectors to be replaced by soldering, without degrading hermeticity of housing or connector. Welding could destroy electrostatic-sensitive components and harm housing and internal cables. Steel insert avoids problems because connector soldered directly to it rather than welded to housing. Seals between flange and housing, and between connector and flange resistant to leaks, even after mechanical overloading and thermal shocking.

  15. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi


    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  16. Temperature versus time curves for manual and automated soldering processes

    Trent, M.A.


    Temperature-versus-time curves were recorded for various electronic components during pre-tinning, hand soldering, and drag soldering operations to determine the temperature ranges encountered. The component types investigated included a wide range of electronic assemblies. The data collected has been arranged by process and will help engineers to: (1) predetermine the thermal profile to which various components are subjected during the soldering operation; (2) decide--on the basis of component heat sensitivity and the need for thermal relief--where hand soldering would be more feasible than drag soldering; and (3) determine the optimum drag solder control parameters.

  17. Use of organic solderability preservatives on solderability retention of copper after accelerated aging

    Hernandez, C.L.; Sorensen, N.R.; Lucero, S.J.


    Organic solderability preservatives (OSP`s) have been used by the electronics industry for some time to maintain the solderability of circuit boards and components. Since solderability affects both manufacturing efficiency and product reliability, there is significant interest in maintaining good solder wettability. There is often a considerable time interval between the initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, in many cases not well controlled. Solder wettability can deteriorate during storage, especially in harsh environments. This paper describes the ongoing efforts at Sandia National Laboratories to quantify solder watability on bare and aged copper surfaces. Benzotriazole and imidazole were applied to electronic grade copper to retard aging effects on solderability. The coupons were introduced into Sandia`s Facility for Atmospheric Corrosion Testing (FACT) to simulate aging in a typical indoor industrial environment. H{sub 2}S, NO{sub 2} and Cl{sub 2} mixed gas was introduced into the test cell and maintained at 35{degrees}C and 70% relative humidity for test periods of one day to two weeks. The OSP`s generally performed better than bare Cu, although solderability diminished with increasing exposure times.

  18. Corrosion resistance of the soldering joint of post-soldering of palladium-based metal-ceramic alloys.

    Kawada, E; Sakurai, Y; Oda, Y


    To evaluate the corrosion resistance of post soldering of metal-ceramic alloys, four commercially available palladium-system metal-ceramic alloys (Pd-Cu, Pd-Ni, Pd-Ag, and Pd-Sb systems) and two types of solder (12 k gold solder and 16 k gold solder) with different compositions and melting points were used. The corrosion resistance of the soldered joint was evaluated by anodic polarization. The electrochemical characteristics of soldered surface were measured using electrochemical equipment. Declines in corrosion resistance were not detectable with Pd-Cu, Pd-Ag and Pd-Sb types, but break down at low potential occurred with Pd-Ni type.

  19. 免清洗水性助焊剂主要组分的选择及其缓蚀性能研究%Selection of main components of no-clean water-based soldering flux and study on its corrosion inhibition

    钟金春; 郝志峰; 吴青青; 陈亚湛; 陈奕向; 郭奕鹏


    The components including activator, film-forming agent, and surfactant used in environmentally friendly no-clean soldering flux were selected experimentally. The optimum proportion of benzotriazole (BTA), a common corrosion inhibitor, was determined by AC impedance method. The influence of individual component in the flux system on its corrosion inhibition was discussed. The results indicated that the corrosiveness of flux was decreased as a result of the combination of acid with amine, and the corrosion inhibition of the flux system was remarkably improved by using BTA as corrosion inhibitor. The prepared flux system has the optimum corrosion inhibition and a film resistance of 6.2 × 105 Ω·cm2 when: malic acid and adipic acid in a ratio of 1∶5 (by mol) is combined with triethanolamine; the molar ratio of mixed acid to triethanolamine is equal to 11∶1; and mass fraction is 3.15% for acid-amine mixed solution, 0.2% for polyethylene glycol 2000 as surfactant, 0.05% for corrosion inhibitor BTA, 1.5% for both isopropyl alcohol and ethylene glycol monobutyl ether as co-solvents, and 0.2% for polyvinyl alcohol as film-forming agent. The flux system has weak corrosion to the metallic copperplate substrate.%通过实验优选了环保型水性免清洗助焊剂所用的活化剂、成膜剂和表面活性剂等组分.采用交流阻抗法确定了缓蚀剂苯并三氮唑(BTA)的最佳配比,探究了体系中各组分对助焊剂缓蚀性能的影响.结果表明,酸-胺复配可以降低助焊剂的腐蚀性,而缓蚀剂BTA能显著提高助焊剂体系的缓蚀性能.当苹果酸和己二酸以1∶5的物质的量之比与三乙醇胺复配,n复配酸∶n三乙酵胺=11∶1,且酸-胺复合液的质量分数为3.15%、表面活性剂聚乙二醇2000的质量分数为0.2%、缓蚀剂BTA的质量分数为0.05%,助溶剂异丙醇和乙二醇丁醚的质量分数均为1.5%,成膜剂聚乙烯醇的质量分数为0.2%时,所制备的助焊剂体系的缓蚀

  20. Effect of Flux onto Intermetallic Compound Formation and Growth

    Idris Siti Rabiatull Aisha


    Full Text Available In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC formation and growth was investigated. The solder joint between Sn-3Ag-0.5Cu solder alloy and printed circuit board (PCB was made through reflow soldering. They were further aged at 125°C and 150°C for up to 1000 hours. Results showed that fluxes significantly affect the IMC thickness and growth. In addition, during aging, the scallop and columnar morphology of IMC changed to a more planar type for both type of flux during isothermal aging. It was observed that the growth behavior of IMC was closely related to initial soldering condition.

  1. Age-aware solder performance models : level 2 milestone completion.

    Neilsen, Michael K.; Vianco, Paul Thomas; Neidigk, Matthew Aaron; Holm, Elizabeth Ann


    Legislated requirements and industry standards are replacing eutectic lead-tin (Pb-Sn) solders with lead-free (Pb-free) solders in future component designs and in replacements and retrofits. Since Pb-free solders have not yet seen service for long periods, their long-term behavior is poorly characterized. Because understanding the reliability of Pb-free solders is critical to supporting the next generation of circuit board designs, it is imperative that we develop, validate and exercise a solder lifetime model that can capture the thermomechanical response of Pb-free solder joints in stockpile components. To this end, an ASC Level 2 milestone was identified for fiscal year 2010: Milestone 3605: Utilize experimentally validated constitutive model for lead-free solder to simulate aging and reliability of solder joints in stockpile components. This report documents the completion of this milestone, including evidence that the milestone completion criteria were met and a summary of the milestone Program Review.

  2. Computer simulation of solder joint failure

    Burchett, S.N.; Frear, D.R. [Sandia National Lab., Albuquerque, NM (United States); Rashid, M.M. [Univ. of California, Davis, CA (United States)


    The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliability issue for electronic packages. The purpose of this Laboratory Directed Research and Development (LDRD) project was to develop computational tools for simulating the behavior of solder joints under strain and temperature cycling, taking into account the microstructural heterogeneities that exist in as-solidified near eutectic Sn-Pb joints, as well as subsequent microstructural evolution. The authors present two computational constitutive models, a two-phase model and a single-phase model, that were developed to predict the behavior of near eutectic Sn-Pb solder joints under fatigue conditions. Unique metallurgical tests provide the fundamental input for the constitutive relations. The two-phase model mathematically predicts the heterogeneous coarsening behavior of near eutectic Sn-Pb solder. The finite element simulations with this model agree qualitatively with experimental thermomechanical fatigue tests. The simulations show that the presence of an initial heterogeneity in the solder microstructure could significantly degrade the fatigue lifetime. The single-phase model was developed to predict solder joint behavior using materials data for constitutive relation constants that could be determined through straightforward metallurgical experiments. Special thermomechanical fatigue tests were developed to give fundamental materials input to the models, and an in situ SEM thermomechanical fatigue test system was developed to characterize microstructural evolution and the mechanical behavior of solder joints during the test. A shear/torsion test sample was developed to impose strain in two different orientations. Materials constants were derived from these tests. The simulation results from the two-phase model showed good fit to the experimental test results.

  3. Evaluation technology of lead-free solders; Namari free handa zairyo ni okeru hyoka gijutsu

    Yamashita, M.; Shiokawa, K. [Fuji Electric Co. Ltd., Tokyo (Japan); Ueda, A. [Fuji Electric Corporate Research and Development,Ltd., Kanagawa (Japan)


    Solders mainly composed of tin and lead are currently in widespread use in semiconductor devices. However, in view of lead influences on the human body and environmental problems, lead-free solders have been in urgent demand. In this study, aiming to improve the solderability and reliability of a tin-silver solder, one of most promising lead-free solder materials, we have investigated elements to be added. Focusing on typical lead-free tin-silver solders and tin-lead eutectic solders, this paper describes the result of investigations into the mechanical properties solderability, micro structures of the solder materials and gas analysis in soldering. (author)

  4. Intense generation of respirable metal nanoparticles from a low-power soldering unit

    Gómez, Virginia [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Irusta, Silvia [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain); Balas, Francisco [Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain); Instituto de Carboquímica – Consejo Superior de Investigaciones Científicas (ICB-CSIC), 50018 Zaragoza (Spain); Santamaria, Jesus, E-mail: [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain)


    Highlights: • Intense generation of nanoparticles in the breathing range from a flux-soldering unit is detected. • Coagulation in the aerosol phase leads to 200-nm respirable nanoparticles up to 30 min after operation. • Nanoparticle concentration in the working environment depends on the presence of ambient air. • Metal-containing nanoparticles are collected in TEM grids and filters in the hundreds of nanometer range. -- Abstract: Evidence of intense nanoparticle generation from a low power (45 W) flux soldering unit is presented. This is a familiar device often used in daily life, including home repairs and school electronic laboratories. We demonstrate that metal-containing nanoparticles may reach high concentrations (ca. 10{sup 6} particles/cm{sup 3}) within the breathing range of the operator, with initial size distributions centered at 35–60 nm The morphological and chemical analysis of nanoparticle agglomerates collected on TEM grids and filters confirms their multiparticle structure and the presence of metals.

  5. Production of Liquid Metal Spheres by Molding

    Mohammed G. Mohammed


    Full Text Available This paper demonstrates a molding technique for producing spheres composed of eutectic gallium-indium (EGaIn with diameters ranging from hundreds of microns to a couple millimeters. The technique starts by spreading EGaIn across an elastomeric sheet featuring cylindrical reservoirs defined by replica molding. The metal flows into these features during spreading. The spontaneous formation of a thin oxide layer on the liquid metal keeps the metal flush inside these reservoirs. Subsequent exposure to acid removes the oxide and causes the metal to bead up into a sphere with a size dictated by the volume of the reservoirs. This technique allows for the production and patterning of droplets with a wide range of volumes, from tens of nanoliters up to a few microliters. EGaIn spheres can be embedded or encased subsequently in polymer matrices using this technique. These spheres may be useful as solder bumps, electrodes, thermal contacts or components in microfluidic devices (valves, switches, pumps. The ease of parallel-processing and the ability to control the location of the droplets during their formation distinguishes this technique.

  6. Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications

    Yoon, Jeong-Won; Koo, Ja-Myeong; Jung, Seung-Boo


    As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic Au-Sn alloy was used in this study. Using a co-electroplating process, it was possible to plate the Au-Sn solder directly onto a wafer at or near the eutectic composition from a single solution. Two distinct phases, Au5Sn and AuSn, were deposited at a composition of 30at.%Sn. The Au-Sn flip-chip joints were formed at 300 and 400 degrees without using any flux. In the case where the samples were reflowed at 300 degrees, only an (Au,Ni)3Sn2 IMC layer formed at the interface between the Au-Sn solder and Ni UBM. On the other hand, two IMC layers, (Au,Ni)3Sn2 and (Au,Ni)3Sn, were found at the interfaces of the samples reflowed at 400 degrees. As the reflow time increased, the thickness of the (Au,Ni)3Sn2 and (Au,Ni)3Sn IMC layers formed at the interface increased and the eutectic lamellae in the bulk solder coarsened.

  7. Microstructural evolution of eutectic Au-Sn solder joints

    Song, Ho Geon


    Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.

  8. Microstructural evolution of eutectic Au-Sn solder joints

    Song, Ho Geon [Univ. of California, Berkeley, CA (United States)


    Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.

  9. Testing of printed circuit board solder joints by optical correlation

    Espy, P. N.


    An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

  10. Mold Simulator Study on the Initial Solidification of Molten Steel Near the Corner of Continuous Casting Mold

    Lyu, Peisheng; Wang, Wanlin; Zhang, Haihui


    Corner cracks are one of the most widespread surface defects of continuous casting slabs, and they are especially severe for peritectic steels and low-alloy steels. Therefore, a clear understanding of molten steel initial solidification around mold corner would be of great importance for the inhibition of corner cracks. This paper has been conducted with the aim to elucidate this understanding, by using a novel mold simulator equipped with a right-angle copper mold. The responding temperatures and heat fluxes across the mold hot-face and corner were firstly calculated through a 2D-inverse heat conduction program mathematical model, and the results suggested that the cooling ability and the fluctuation of heat fluxes around the mold corner are stronger than those for mold hot-face. With the help of power spectral density analysis and fast Fourier transformation, the four characteristic signals of heat fluxes were discussed in this paper. Next, the relation between the thickness of solidified shell and solidification time was fitted with the solidification square root law; as a result, the average solidification factor bar{K} for the hot-face shell is 2.32 mm/s1/2, and it is 2.77 mm/s1/2 for the shell near-corner. For the same oscillation marks (OMs), it appeared that the OMs positions on the shell corner are lower than those on the shell hot-face along the casting direction, because the stronger shrinkage of shell at the corner allows the overflowing steel to penetrate deeper into the larger gap between the shell corner and mold, which is demonstrated through the heat transfer analysis and metallographic examination. Finally, the interrelation between shell profile, mold oscillation, variation rate of heat flux, high-frequency heat flux and high-frequency temperature was discussed for above two cases, and the results suggested that meniscus conditions (heat transfer and melt flow) around the mold corner are more unsteady.

  11. Mold Simulator Study on the Initial Solidification of Molten Steel Near the Corner of Continuous Casting Mold

    Lyu, Peisheng; Wang, Wanlin; Zhang, Haihui


    Corner cracks are one of the most widespread surface defects of continuous casting slabs, and they are especially severe for peritectic steels and low-alloy steels. Therefore, a clear understanding of molten steel initial solidification around mold corner would be of great importance for the inhibition of corner cracks. This paper has been conducted with the aim to elucidate this understanding, by using a novel mold simulator equipped with a right-angle copper mold. The responding temperatures and heat fluxes across the mold hot-face and corner were firstly calculated through a 2D-inverse heat conduction program mathematical model, and the results suggested that the cooling ability and the fluctuation of heat fluxes around the mold corner are stronger than those for mold hot-face. With the help of power spectral density analysis and fast Fourier transformation, the four characteristic signals of heat fluxes were discussed in this paper. Next, the relation between the thickness of solidified shell and solidification time was fitted with the solidification square root law; as a result, the average solidification factor bar{K} for the hot-face shell is 2.32 mm/s1/2, and it is 2.77 mm/s1/2 for the shell near-corner. For the same oscillation marks (OMs), it appeared that the OMs positions on the shell corner are lower than those on the shell hot-face along the casting direction, because the stronger shrinkage of shell at the corner allows the overflowing steel to penetrate deeper into the larger gap between the shell corner and mold, which is demonstrated through the heat transfer analysis and metallographic examination. Finally, the interrelation between shell profile, mold oscillation, variation rate of heat flux, high-frequency heat flux and high-frequency temperature was discussed for above two cases, and the results suggested that meniscus conditions (heat transfer and melt flow) around the mold corner are more unsteady.

  12. Phenolic Molding Compounds

    Koizumi, Koji; Charles, Ted; de Keyser, Hendrik

    Phenolic Molding Compounds continue to exhibit well balanced properties such as heat resistance, chemical resistance, dimensional stability, and creep resistance. They are widely applied in electrical, appliance, small engine, commutator, and automotive applications. As the focus of the automotive industry is weight reduction for greater fuel efficiency, phenolic molding compounds become appealing alternatives to metals. Current market volumes and trends, formulation components and its impact on properties, and a review of common manufacturing methods are presented. Molding processes as well as unique advanced techniques such as high temperature molding, live sprue, and injection/compression technique provide additional benefits in improving the performance characterisitics of phenolic molding compounds. Of special interest are descriptions of some of the latest innovations in automotive components, such as the phenolic intake manifold and valve block for dual clutch transmissions. The chapter also characterizes the most recent developments in new materials, including long glass phenolic molding compounds and carbon fiber reinforced phenolic molding compounds exhibiting a 10-20-fold increase in Charpy impact strength when compared to short fiber filled materials. The role of fatigue testing and fatigue fracture behavior presents some insight into long-term reliability and durability of glass-filled phenolic molding compounds. A section on new technology outlines the important factors to consider in modeling phenolic parts by finite element analysis and flow simulation.

  13. A novel method for direct solder bump pull testing using lead-free solders

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  14. Mold design with simulation for chalcogenide glass precision molding

    Zhang, Yunlong; Wang, Zhibin; Li, Junqi; Zhang, Feng; Su, Ying; Wang, Zhongqiang


    Compare with the manufacturing of the traditional infrared material, such as signal crystal germanium, zinc sulfide, zinc selenide etc, chalcogenide infrared glass is suitable for precision molding for the low soften temperature to have large mass industry production. So the researches of precision glass molding are necessary, especially for the fast development of infrared product. The mold design is one of the key technologies of precision glass molding. In this paper, the mold processing of a sample chalcogenide glass from the technical drawing, mold design, molding to the lens are introduced. From the result of the precision molding, the technology of finite element simulation is a useful way to guiding the mold design. The molded lens by using mold process fit the design requirement.

  15. Silicon micro-mold

    Morales, Alfredo M.


    The present invention describes a method for rapidly fabricating a robust 3-dimensional silicon-mold for use in preparing complex metal micro-components. The process begins by depositing a conductive metal layer onto one surface of a silicon wafer. A thin photoresist and a standard lithographic mask are then used to transfer a trace image pattern onto the opposite surface of the wafer by exposing and developing the resist. The exposed portion of the silicon substrate is anisotropically etched through the wafer thickness down to conductive metal layer to provide an etched pattern consisting of a series of rectilinear channels and recesses in the silicon which serve as the silicon micro-mold. Microcomponents are prepared with this mold by first filling the mold channels and recesses with a metal deposit, typically by electroplating, and then removing the silicon micro-mold by chemical etching.

  16. Mold Simulator Study of Heat Transfer Phenomenon During the Initial Solidification in Continuous Casting Mold

    Zhang, Haihui; Wang, Wanlin


    In this paper, mold simulator trials were firstly carried out to study the phenomena of the initial shell solidification of molten steel and the heat transfer across the initial shell to the infiltrated mold/shell slag film and mold. Second, a one-dimensional inverse heat transfer problem for solidification (1DITPS) was built to determine the temperature distribution and the heat transfer behavior through the solidifying shell from the measured shell thickness. Third, the mold wall temperature field was recovered by a 2DIHCP mathematical model from the measured in-mold wall temperatures. Finally, coupled with the measured slag film thickness and the calculations of 1DITPS and 2DIHCP, the thermal resistance and the thickness of liquid slag film in the vicinity of the meniscus were evaluated. The experiment results show that: the total mold/shell thermal resistance, the mold/slag interfacial thermal resistance, the liquid film thermal resistance, and the solid film thermal resistance is 8.0 to 14.9 × 10-4, 2.7 to 4.8 × 10-4, 1.5 to 4.6 × 10-4, and 3.9 to 6.8 × 10-4 m2 K/W, respectively. The percentage of mold/slag interfacial thermal resistance, liquid film thermal resistance, and solid film thermal resistance over the total mold/shell thermal resistance is 27.5 to 34.4, 17.2 to 34.0, and 38.5 to 48.8 pct, respectively. The ratio of radiation heat flux is around 14.1 to 51.9 pct in the liquid slag film.

  17. Capillary wave formation on excited solder jet and fabrication of lead-free solder ball

    ZHANG Shu-guang; HE Li-jun; ZHU Xue-xin; ZHANG Shao-ming; SHI Li-kai; XU Jun


    A survey of solder ball production processes especially focusing on disturbed molten metal jet breakup process was made. Then the formation of capillary wave on tin melt jet in the way of rapid solidification was studied. A semi-empirical formula, which can be written as λ = Cvib (σ/ρ)1/3f-2/3 to predict the relationship between wavelength of capillary wave and frequency of imposed vibration was obtained. Sn-4.0Ag-0.5Cu lead free solder ball was successfully produced with tight distribution and good sphericity. The excited jet breakup process is promising for cost effectively producing solder ball.

  18. Solder Joint Health Monitoring Testbed System

    Delaney, Michael M.


    The density and pin count for Field Programmable Gate Arrays (FPGAs) has been increasing, and has exceeded current methods of solder joint inspection, making early detection of failures more problematic. These failures are a concern for both flight safety and maintenance in commercial aviation. Ridgetop Group, Inc. has developed a method for detecting solder joint failures in real time. The NASA Dryden Flight Research Center is developing a set of boards to test this method in ground environmental and accelerated testing as well as flight test on a Dryden F-15 or F-18 research aircraft. In addition to detecting intermittent and total solder joint failures, environmental data on the boards, such as temperature and vibration, will be collected and time-correlated to aircraft state data. This paper details the technical approach involved in the detection process, and describes the design process and products to date for Dryden s FPGA failure detection boards.

  19. Pb-Free Soldering Iron Temperature Controller

    Hamane, Hiroto; Wajima, Kenji; Hayashi, Yoichi; Komiyama, Eiichi; Tachibana, Toshiaki; Miyazaki, Kazuyoshi

    Recently, much importance has been attached to the environmental problem. The content of two directives to better control the management of waste electronic equipment was approved. The two directives are the Waste from Electrical and Electronic Equipment (WEEE) and the Restriction of Hazardous Substances (RoHS). These set phase-out dates for the use of lead materials contained in electronic products. Increasingly, attention is focusing on the potential use of Pb-free soldering in electronics manufacturing. It should be noted that many of the current solding irons are not suitable for Pb-free technology, due to the inferior wetting ability of Pb-free alloys compared with SnPb solder pastes. This paper presents a Pb-free soldering iron temperature controller using an embedded micro-processor with a low memory capacity.

  20. Nanocopper Based Solder-Free Electronic Assembly

    Schnabl, K.; Wentlent, L.; Mootoo, K.; Khasawneh, S.; Zinn, A. A.; Beddow, J.; Hauptfleisch, E.; Blass, D.; Borgesen, P.


    CuantumFuse nano copper material has been used to assemble functional LED test boards and a small camera board with a 48 pad CMOS sensor quad-flat no-lead chip and a 10 in flexible electronics demo. Drop-in replacement of solder, by use of stencil printing and standard surface mount technology equipment, has been demonstrated. Applications in space and commercial systems are currently under consideration. The stable copper-nanoparticle paste has been examined and characterized by scanning electron microscopy and high-resolution transmission electron microscopy; this has shown that the joints are nanocrystalline but with substantial porosity. Assessment of reliability is expected to be complicated by this and by the effects of thermal and strain-enhanced coarsening of pores. Strength, creep, and fatigue properties were measured and results are discussed with reference to our understanding of solder reliability to assess the potential of this nano-copper based solder alternative.

  1. Identification and chemical characterization of particulate matter from wave soldering processes at a printed circuit board manufacturing company.

    Szoboszlai, Z; Kertész, Zs; Szikszai, Z; Angyal, A; Furu, E; Török, Zs; Daróczi, L; Kiss, A Z


    In this case study, the elemental composition and mass size distribution of indoor aerosol particles were determined in a working environment where soldering of printed circuit boards (PCB) took place. Single particle analysis using ion and electron microscopy was carried out to obtain more detailed and reliable data about the origin of these particles. As a result, outdoor and indoor aerosol sources such as wave soldering, fluxing processes, workers' activity, mineral dust, biomass burning, fertilizing and other anthropogenic sources could be separated. With the help of scanning electron microscopy, characteristic particle types were identified. On the basis of the mass size distribution data, a stochastic lung deposition model was used to calculate the total and regional deposition efficiencies of the different types of particles within the human respiratory system. The information presented in this study aims to give insights into the detailed characteristics and the health impact of aerosol particles in a working environment where different kinds of soldering activity take place.

  2. Moisture and aging effects of solder wettability of copper surfaces

    Hernandez, C.L.; Sorensen, N.R.; Lucero, S.J.


    Solderability is a critical property of electronic assembly that affects both manufacturing efficiency and product reliability. There is often a considerable time interval between initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, usually not controlled. Solder wettability can soon deteriorate during storage, especially in extreme environments. This paper describes ongoing efforts at Sandia to quantify solder wettability on bare and aged Cu surfaces. In addition, organic solderability preservatives (OSPs) were applied to the bare Cu to retard solderability loss due to aging. The OSPs generally performed well, although wetting did decrease with exposure time.

  3. Parametric study on the solderability of etched PWB copper

    Hosking, F.M.; Stevenson, J.O.; Hernandez, C.L.


    The rapid advancement of interconnect technology has resulted in a more engineered approach to designing and fabricating printed wiring board (PWB) surface features. Recent research at Sandia National Laboratories has demonstrated the importance of surface roughness on solder flow. This paper describes how chemical etching was used to enhance the solderability of surfaces that were normally difficult to wet. The effects of circuit geometry, etch concentration, and etching time on solder flow are discussed. Surface roughness and solder flow data are presented. The results clearly demonstrate the importance of surface roughness on the solderability of fine PWB surface mount features.

  4. Glass molding process with mold lubrication

    Davey, Richard G.


    Improvements are provided in glass forming processes of the type wherein hot metal blank molds are employed by using the complementary action of a solid film lubricant layer, of graphite dispersed in a cured thermoset organopolysiloxane, along with an overspray of a lubricating oil.

  5. Lead (Pb)-Free Solder Applications



    Legislative and marketing forces both abroad and in the US are causing the electronics industry to consider the use of Pb-free solders in place of traditional Sn-Pb alloys. Previous case studies have demonstrated the satisfactory manufacturability and reliability of several Pb-free compositions for printed circuit board applications. Those data, together with the results of fundamental studies on Pb-free solder materials, have indicated the general feasibility of their use in the broader range of present-day, electrical and electronic components.

  6. Effects of PCB thickness on adjustable fountain wave soldering

    M S Abdul Aziz; M Z Abdullah; C Y Khor; A Jalar; M A Bakar; W Y W Yusoff; F Che Ani; Nobe Yan; M Zhou; C Cheok


    This study investigates the effects of printed circuit board (PCB) thickness on adjustable fountain and conventional wave soldering. The pin-through-hole (PTH) vertical fill is examined with three PCBs of different thicknesses (i.e., 1.6, 3.1, and 6.0 mm) soldered through adjustable fountain and conventional wave soldering at conveyor angles of 0° and 6°. The vertical fill of each PCB is the focus. The PTH solder profile is inspected with a non-destructive X-ray computed tomography scanning machine. The percentages of the PTH vertical fill of both soldering processes are also estimated and compared. The aspect ratio of the PCB is also investigated. Experimental results reveal that adjustable fountain wave soldering yields better vertical fill than conventional wave soldering. The vertical fill level of adjustable fountain wave soldering is 100%, 90%, and 50% for the 1.6, 3.1, and 6.0 mm PCB thickness, respectively. FLUENT simulation is conducted for the vertical fill of the solder profile. Simulation and experimental results show that the PTH solder profiles of the two soldering processes are almost identical. The effect of PCB thickness on PTH voiding is also discussed.

  7. Solder flow over fine line PWB surface finishes

    Hosking, F.M.; Hernandez, C.L.


    The rapid advancement of interconnect technology has stimulated the development of alternative printed wiring board (PWB) surface finishes to enhance the solderability of standard copper and solder-coated surfaces. These new finishes are based on either metallic or organic chemistries. As part of an ongoing solderability study, Sandia National Laboratories has investigated the solder flow behavior of two azole-based organic solderability preservations, immersion Au, immersion Ag, electroless Pd, and electroless Pd/Ni on fine line copper features. The coated substrates were solder tested in the as-fabricated and environmentally-stressed conditions. Samples were processed through an inerted reflow machine. The azole-based coatings generally provided the most effective protection after aging. Thin Pd over Cu yielded the best wetting results of the metallic coatings, with complete dissolution of the Pd overcoat and wetting of the underlying Cu by the flowing solder. Limited wetting was measured on the thicker Pd and Pd over Ni finishes, which were not completely dissolved by the molten solder. The immersion Au and Ag finishes yielded the lowest wetted lengths, respectively. These general differences in solderability were directly attributed to the type of surface finish which the solder came in contact with. The effects of circuit geometry, surface finish, stressing, and solder processing conditions are discussed.

  8. Prototype circuit boards assembled with non-lead bearing solders

    Vianco, P.T.; Rejent, J.A.


    The 91.84Sn-3.33Ag-4.83Bi and 96.5Sn-3.5Ag Pb-free solders were evaluated for surface mount circuit board interconnects. The 63Sn-37Pb solder provided the baseline data. All three solders exhibited suitable manufacturability per a defect analyses of circuit board test vehicles. Thermal cycling had no significant effect on the 91.84Sn-3.33Ag-4.83Bi solder joints. Some degradation in the form of grain boundary sliding was observed in 96.5Sn-3.5Ag and 63Sn-37Pb solder joints. The quality of the solder joint microstructures showed a slight degree of degradation under thermal shock exposure for all of the solders tested. Trends in the solder joint shear strengths could be traced to the presence of Pd in the solder, the source of which was the Pd/Ni finish on the circuit board conductor features. The higher, intrinsic strengths of the Pb-free solders encouraged the failure path to be located in proximity to the solder/substrate interface where Pd combined with Sn to form brittle PdSn{sub 4} particles, resulting in reduced shear strengths.

  9. Capillary flow of solder on chemically roughened PWB surfaces

    Hosking, F.M.; Stevenson, J.O.; Yost, F.G.


    The Center for Solder Science and Technology at Sandia National Laboratories has developed a solderability test for evaluating fundamental solder flow over PWB (printed wiring boards) surface finishes. The work supports a cooperative research and development agreement between Sandia, the National Center for Manufacturing Sciences (NCMS), and several industrial partners. An important facet of the effort involved the ``engineering`` of copper surfaces through mechanical and chemical roughening. The roughened topography enhances solder flow, especially over very fine features. In this paper, we describe how etching with different chemical solutions can affect solder flow on a specially designed ball grid array test vehicle (BGATV). The effects of circuit geometry, solution concentration, and etching time are discussed. Surface roughness and solder flow data are presented to support the roughening premise. Noticeable improvements in solder wettability were observed on uniformly etched surfaces having relatively steep peak-to-valley slopes.

  10. Automatic computer-aided system of simulating solder joint formation

    Zhao, Xiujuan; Wang, Chunqing; Zheng, Guanqun; Wang, Gouzhong; Yang, Shiqin


    One critical aspect in electronic packaging is the fatigue/creep-induced failure in solder interconnections, which is found to be highly dependent on the shape of solder joints. Thus predicting and analyzing the solder joint shape is warranted. In this paper, an automatic computer-aided system is developed to simulate the formation of solder joint and analyze the influence of the different process parameters on the solder joint shape. The developed system is capable of visually designing the process parameters and calculating the solder joint shape automatically without any intervention from the user. The automation achieved will enable fast shape estimation with the variation of process parameters without time consuming experiments, and the simulating system provides the design and manufacturing engineers an efficient software tools to design soldering process in design environment. Moreover, a program developed from the system can serve as the preprocessor for subsequent finite element joint analysis program.

  11. Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

    Ji, Hongjun; Wang, Qiang; Li, Mingyu


    Solder joint reliability greatly depends on the microstructure of the solder matrix and the morphology of intermetallic compounds (IMCs) in the joints. Addition of strengthening phases such as carbon nanotubes and ceramic particles to solder joints to improve their properties has been widely studied. In this work, ultrasonic vibration (USV) of casting ingots was applied to considerably improve their microstructure and properties, and the resulting influence on fluxless soldering of Cu/Sn-3.0Ag-0.5Cu/Cu joints and their microstructural evolution was investigated. It was demonstrated that USV application during reflow of Sn-based solder had favorable effects on β-Sn grain size refinement as well as the growth and distribution of various IMC phases within the joints. The β-Sn grain size was significantly refined as the ultrasound power was increased, with a reduction of almost 90% from more than 100 μm to below 10 μm. Long and large Cu6Sn5 tubes in the solder matrix of the joints were broken into tiny ones. Needle-shaped Ag3Sn was transformed into flake-shaped. These IMCs were mainly precipitated along β-Sn phase boundaries. High-temperature storage tests indicated that the growth rate of interfacial IMCs in joints formed with USV was slower than in conventional reflow joints. The mechanisms of grain refinement and IMC fragmentation are discussed and related to the ultrasonic effects.

  12. Multilead, Vaporization-Cooled Soldering Heat Sink

    Rice, John


    Vaporization-cooled heat sink proposed for use during soldering of multiple electrical leads of packaged electronic devices to circuit boards. Heat sink includes compliant wicks held in grooves on edges of metal fixture. Wicks saturated with water. Prevents excessive increases in temperature at entrances of leads into package.

  13. Soldering and Mass Generation in Four Dimensions

    Banerjee, R; Banerjee, Rabin; Wotzasek, Clovis


    We propose bosonised expressions for the chiral Schwinger models in four dimensions. Then, in complete analogy with the two dimensional case, we show the soldering of two bosonised chiral Schwinger models with opposite chiralities to yield the bosonised Schwinger model in four dimensions. The implications of the Schwinger model or its chiral version, as known for two dimensions, thereby get extended to four dimensions.

  14. Mold Image Library

    The image library contains mold-related images in seven categories. There are also animated images that you can choose to view and download. These photos may be used for presentations and educational purposes without contacting EPA.

  15. Microwave Tissue Soldering for Immediate Wound Closure

    Arndt, G. Dickey; Ngo, Phong H.; Phan, Chau T.; Byerly, Diane; Dusl, John; Sognier, Marguerite A.; Carl, James


    A novel approach for the immediate sealing of traumatic wounds is under development. A portable microwave generator and handheld antenna are used to seal wounds, binding the edges of the wound together using a biodegradable protein sealant or solder. This method could be used for repairing wounds in emergency settings by restoring the wound surface to its original strength within minutes. This technique could also be utilized for surgical purposes involving solid visceral organs (i.e., liver, spleen, and kidney) that currently do not respond well to ordinary surgical procedures. A miniaturized microwave generator and a handheld antenna are used to deliver microwave energy to the protein solder, which is applied to the wound. The antenna can be of several alternative designs optimized for placement either in contact with or in proximity to the protein solder covering the wound. In either case, optimization of the design includes the matching of impedances to maximize the energy delivered to the protein solder and wound at a chosen frequency. For certain applications, an antenna could be designed that would emit power only when it is in direct contact with the wound. The optimum frequency or frequencies for a specific application would depend on the required depth of penetration of the microwave energy. In fact, a computational simulation for each specific application could be performed, which would then match the characteristics of the antenna with the protein solder and tissue to best effect wound closure. An additional area of interest with potential benefit that remains to be validated is whether microwave energy can effectively kill bacteria in and around the wound. Thus, this may be an efficient method for simultaneously sterilizing and closing wounds.

  16. Transferability of glass lens molding

    Katsuki, Masahide


    Sphere lenses have been used for long time. But it is well known that sphere lenses theoretically have spherical aberration, coma and so on. And, aspheric lenses attract attention recently. Plastic lenses are molded easily with injection machines, and are relatively low cost. They are suitable for mass production. On the other hand, glass lenses have several excellent features such as high refractive index, heat resistance and so on. Many aspheric glass lenses came to be used for the latest digital camera and mobile phone camera module. It is very difficult to produce aspheric glass lenses by conventional process of curve generating and polishing. For the solution of this problem, Glass Molding Machine was developed and is spreading through the market. High precision mold is necessary to mold glass lenses with Glass Molding Machine. The mold core is ground or turned by high precision NC aspheric generator. To obtain higher transferability of the mold core, the function of the molding machine and the conditions of molding are very important. But because of high molding temperature, there are factors of thermal expansion and contraction of the mold and glass material. And it is hard to avoid the factors. In this session, I introduce following items. [1] Technology of glass molding and the machine is introduced. [2] The transferability of glass molding is analyzed with some data of glass lenses molded. [3] Compensation of molding shape error is discussed with examples.

  17. Preparation of solder pads by selective laser scanning

    Wenqing Shi; Yongqiang Yang; Yanlu Huang; Guoqiang Wei; Wei Guo


    We propose a new laser preparation technique to solder Sn-Ag3.5-Cu0.7 on a copper clad laminate (CCL). The experiment is conducted by selective laser heating and melting the thin solder layer and then preprint-ing it on CCL in order to form the matrix with solder pads. Through the analysis of macro morphology of the matrix with solder pads and microstructure of single pads, this technique is proved to be suitable for preparing solder pads and that the solder pads are of good mechanical properties. The results also reveal that high frequency laser pulse is beneficial to the formation of better solder pad, and that the 12-W fiber laser with a beam diameter of 0.030 mm can solder Sn-Ag3.5-Cu0.7 successfully on CCL at 500-kHz pulse frequency. The optimized parameters of laser soldering on CCL are as follows: the laser power is 12 W, the scanning speed is 1.0 mm/s, the beam diameter is 0.030 mm, the lead-free solder is Sn-Ag3.5-Cu0.7, and the laser pulse frequency is 500 kHz.

  18. Dynamic of taking out molding parts at injection molding

    E. Ragan


    Full Text Available Most plastic parts used in automobile production are manufactured by injection molding. Their quality depends also on taking out molding and on the manipulators for it. Task of this contribution is to theoretically describe a transport of molding at taking out after injection molding in relation on its regulation. The following quantities are derived at it: the transition characteristic of the taking out system, the blocking diagram of taking out molding regulation, the amplitude and phase characteristic and the transition characteristic of action quantity at taking out molding regulation.

  19. Effects of AlN Nanoparticles on the Microstructure, Solderability, and Mechanical Properties of Sn-Ag-Cu Solder

    Jung, Do-Hyun; Sharma, Ashutosh; Lim, Dong-Uk; Yun, Jong-Hyun; Jung, Jae-Pil


    The addition of nanosized AlN particles to Sn-3.0 wt pctAg-0.5 wt pctCu (SAC305) lead-free solder alloy has been investigated. The various weight fractions of AlN (0, 0.03, 0.12, 0.21, 0.60 wt pct) have been dispersed in SAC305 solder matrix by a mechanical mixing and melting route. The influences of AlN nanosized particles on the microstructure, mechanical properties, and solderability ( e.g., spreadability and wettability) have been carried out. The structural and morphological features of the nanocomposite solder were characterized by scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and transmission electron microscope (TEM). The experimental results show that the best combination of solderability and mechanical properties is obtained at 0.21 wt pct AlN in the solder matrix. The reinforced composite solder with 0.21 wt pct AlN nanoparticles shows ≈25 pct improvement in ultimate tensile strength (UTS), and ≈4 pct increase in the spreadability. In addition, the results of microstructural analyses of composite solders indicate that the nanocomposite solder, especially reinforced with 0.21 wt pct of AlN nanoparticles, exhibits better microstructure and improved elongation percentage, compared with the monolithic SAC305 solder.

  20. Investigation of Solder Cracking Problems on Printed Circuit Boards

    Berkebile, M. J.


    A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations.

  1. Assessment of potential solder candidates for high temperature applications

    Multi-Chip module (MCM) technology is a specialized electronic packaging technology recently gaining momentum due to the miniaturization drive in the microelectronics industry. The step soldering approach is being employed in the MCM technology. This method is used to solder various levels...... of the package with different solders of different melting temperatures. High Pb containing alloys where the lead levels can be above 85% by weight, is one of the solders currently being used in this technology. Responding to market pressure i.e. need for green electronic products there is now an increasing...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

  2. Anomalous creep in Sn-rich solder joints

    Song, Ho Geon; Morris Jr., John W.; Hua, Fay


    This paper discusses the creep behavior of example Sn-rich solders that have become candidates for use in Pb-free solder joints. The specific solders discussed are Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-0.7Cu and Sn-10In-3.1Ag, used in thin joints between Cu and Ni-Au metallized pads.

  3. Solderability preservation through the use of organic inhibitors

    Sorensen, N.R.; Hosking, F.M.


    Organic inhibitors can be used to prevent corrosion of metals and have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper, but provides a vast improvement relative to oxidized copper.

  4. Aging, stressing and solderability of electroplated and electroless copper

    Sorensen, N.R.; Hosking, F.M.


    Organic inhibitors can be used to prevent corrosion of metals have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by the molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper but provides a vast improvement relative to oxidized copper.

  5. High temperature solder alloys for underhood applications: Final report

    Kern, J.A. [Univ. of New Mexico, Albuquerque, NM (United States). Dept. of Mechanical Engineering; Drewien, C.A.; Yost, F.G.; Sackinger, S. [Sandia National Laboratories, Albuquerque, NM (United States); Weiser, M.W. [Johnson-Mathey Electronics Corp., Spokane, WA (United States)


    In this continued study, the microstructural evolution and peel strength as a function of thermal aging were evaluated for four Sn-Ag solders deposited on double layered Ag-Pt metallization. Additionally, activation energies for intermetallic growth over the temperature range of 134 to 190{degrees}C were obtained through thickness measurements of the Ag-Sn intermetallic that formed at the solder-metallization interface. It was found that Bi-containing solders yielded higher activation energies for the intermetallic growth, leading to thicker intermetallic layers at 175 and 190{degrees}C for times of 542 and 20.5 hrs, respectively, than the solders free of Bi. Complete reaction of the solder with the metallization occurred and lower peel strengths were measured on the Bi-containing solders. In all solder systems, a Ag-Sn intermetallic thickness of greater than {approximately}7 {mu}m contributed to lower peel strength values. The Ag-Sn binary eutectic composition and the Ag-Sn-Cu ternary eutectic composition solders yielded lower activation energies for intermetallic formation, less microstructural change with time, and higher peel strengths; these solder systems were resilient to the effects of temperatures up to 175{degrees}C. Accelerated isothermal aging studies provide useful criteria for recommendation of materials systems. The Sn-Ag and Sn-Ag-Cu eutectic compositions should be considered for future service life and reliability studies based upon their performance in this study.

  6. Recent Research Trend in Laser-Soldering Process

    Kim, Hwan Tae; Kil, Sang Cheol [Korea Institute of Science and Technology Information, Seoul (Korea, Republic of); Hwang, Woon Suk [Inha University, Incheon (Korea, Republic of)


    The trend of the microjoining technology by the laser-soldering process has been reviewed. Among the production technologies, joining technology plays an important role in the fabrication of electronic components. This has led to an increasing attention towards the use of modem microjoining technology such as micro-resistance spot joining micro-soldering, micro-friction stir joining and laser-soldering, etc. This review covers the recent technical trends of laser-soldering collected from the COMPENDEX DB analysis of published papers, research subject and research institutes.


    G.J. Xu; D.H. Li; J.C. He


    In order to know the distribution of magnetic field in a novel flow control of mold(NFC Mold) and to provide the experimental data for the electromagnetic structuredesign and the analysis of flow control in continuous casting mold, the magnetic fieldin a NFC Mold were measured by Tesla meter of Model CT-3. The method of vectorsynthesis was adopted in the measurement of magnetic fields. The results showed thatthe magnetic field in the NFC Mold was composed of two main magnetic areas thatwere symmetrical. Although there was leaking magnetic flux between the lower surfaceof the upper pole and the upper surface of the lower pole on the sides, it was restrainedby the main magnetic fields effectively. Therefore the NFC Mold was more preferablysatisfied to be used in controlling the molten steel flow in continuous casting mold.

  8. Meer bekend over Black Mold

    Duyvesteijn, R.G.E.; Kohrman, E.


    In de vollegrondsrozenteelt zorgde Black Mold in 2007 voor een groot aantal mislukte oculaties. In 2008 waren er aanzienlijk minder problemen. Uit onderzoek is meer bekend over de oorzaak en bestrijding van Black Mold.

  9. Meer bekend over Black Mold

    Duyvesteijn, R.G.E.; Kohrman, E.


    In de vollegrondsrozenteelt zorgde Black Mold in 2007 voor een groot aantal mislukte oculaties. In 2008 waren er aanzienlijk minder problemen. Uit onderzoek is meer bekend over de oorzaak en bestrijding van Black Mold.

  10. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Mohd Nizam Ab. Rahman


    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  11. Effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder

    XUE Song-bai; YU Sheng-lin; WANG Xu-yan; LIU lin; HU Yong-fang; YAO Li-hua


    Several important properties of the micron-powdered Sn-Ag-Cu-Ce solder, including the spreadability, spreading ratio, wetting time, and melting point, were investigated for verifying the effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder. The solidus and the liquidus of the micron-powdered Sn-Ag-Cu-Ce solder are 193.6℃ and 218.4℃, respectively, about 28℃ and 3℃ lower than the melting point of the block Sn-Ag-Cu solder, which reminds the existence of the surface effect of the micron-powdered solder. By adding Ce into Sn-Ag-Cu alloy, its wetting time on pure copper can be obviously decreased. For the Sn-Ag-Cu-0.03%Ce, the soldering temperature is 250℃, and the wetting time on pure copper is close to 1s, with the soldering temperature approaching to 260℃, the wetting time is dropped to 0.8s, which is close to the wetting time, 0.68s, of Sn-Pb solder at 235℃.

  12. Research of Interaction Between Zn Based Solders and Cu, Al Substrates

    Prach Michal


    Full Text Available The paper deals with the study of interaction between Cu, Al substrates (purity 5N and ZnAl4, ZnAg6Al6 zinc solders for higher application temperatures. Soldering was performed with power ultrasound in the air without flux application at temperature 420 °C. Acting time of ultrasonic vibration was 3 s and ultrasound frequency was 40 kHz. Soldered joints were assessed by optical light microscopy and EDX microanalysis. Intermetallic layers (IM CuZn4 and Cu5Zn8 were formed at the Cu/ZnAl4 boundary. The βZn-αAl mechanical mixture was formed at the Al/ZnAl4 boundary. AgZn3 and Cu5Zn8 IM layers were formed at the Cu/ZnAg6Al6 boundary, and mechanical mixture of βZn-αAl and AgZn3 intermetallic mixture were formed at the boundary Al/ZnAg6Al6.

  13. End moldings for cable dielectrics

    Roose, L.D.


    End moldings for high-voltage cables are described wherein the dielectric insulator of the cable is heated and molded to conform to a desired shape. As a consequence, high quality substantially bubble- free cable connectors suitable for mating to premanufactured fittings are made. Disclosed are a method for making the cable connectors either in the field or in a factory, molds suitable for use with the method, and the molded cable connectors, themselves.

  14. Phase separation micro molding

    Vogelaar, Laura


    The research described in this thesis concerns the development of a new microfabrication method, Phase Separation Micro Molding (PSμM). While microfabrication is still best known from semiconductor industry, where it is used to integrate electrical components on a chip, the scope has immensely expan

  15. High Cost/High Risk Components to Chalcogenide Molded Lens Model: Molding Preforms and Mold Technology

    Bernacki, Bruce E.


    This brief report contains a critique of two key components of FiveFocal's cost model for glass compression molding of chalcogenide lenses for infrared applications. Molding preforms and mold technology have the greatest influence on the ultimate cost of the product and help determine the volumes needed to select glass molding over conventional single-point diamond turning or grinding and polishing. This brief report highlights key areas of both technologies with recommendations for further study.

  16. Assessment of potential solder candidates for high temperature applications

    of the package with different solders of different melting temperatures. High Pb containing alloys where the lead levels can be above 85% by weight, is one of the solders currently being used in this technology. Responding to market pressure i.e. need for green electronic products there is now an increasing...

  17. Molded optics design and manufacture

    Schaub, Michael


    While several available texts discuss molded plastic optics, none provide information on all classes of molded optics. Filling this gap, Molded Optics: Design and Manufacture presents detailed descriptions of molded plastic, glass, and infrared optics. Since an understanding of the manufacturing process is necessary to develop cost-effective, producible designs, the book extensively covers various manufacturing methods, design guidelines, trade-offs, best practices, and testing of critical parameters. It also discusses topics that often arise when designing systems with molded optics, such as

  18. Determination of heat transfer coefficients at the polymer-mold-interface for injection molding simulation by means of calorimetry

    Stricker, M.; Steinbichler, G.


    Appropriate modeling of heat transfer from the polymer material to the injection mold is essential to achieve accurate simulation results. The heat transfer is commonly modeled using convective heat transfer and applying heat transfer coefficients (HTC) to the polymer-mold-interface. The set HTC has an influence on the results for filling pressure, cooling performance and shrinkage, among others. The current paper, presents a new strategy to measure HTC in injection molding experiments using Newtons law of cooling. The heat flux is calculated out of demolding heat (measured by means of calorimetry), injection heat (measured by means of an IR-sensor), cooling time and part mass. Cavity surface area, average mold surface temperature and average part surface temperature lead to the HTC.

  19. Effect of Thick Film Firing Conditions on the Solderability and Structure of Au-Pt-Pd Conductor for Low-Temperature, Co-Fired Ceramic Substrates

    Hernandez, C.L; Vianco, P.T.


    Low-temperature, co-fired ceramics (LTCC) are the substrate material-of-choice for a growing number of multi-chip module (MCM) applications. Unlike the longer-standing hybrid microcircuit technology based upon alumina substrates, the manufacturability and reliability of thick film solder joints on LTCC substrates have not been widely studied. An investigation was undertaken to fully characterize such solder joints. A surface mount test vehicle with Daisy chain electrical connections was designed and built with Dupont{trademark} 951 tape. The Dupont{trademark} 4569 thick film ink (Au76-Pt21 -Pd3 wt.%) was used to establish the surface conductor pattern. The conductor pattern was fired onto the LTCC substrate in a matrix of process conditions that included: (1) double versus triple prints, (2) dielectric frame versus no frame, and (3) three firing temperatures (800 C, 875 C and 950 C). Pads were examined from the test vehicles. The porosity of the thick film layers was measured using quantitative image analysis in both the transverse and short transverse directions. A significant dependence on firing temperature was recorded for porosity. Solder paste comprised of Sn63-Pb37 powder with an RMA flux was screen printed onto the circuit boards. The appropriate components, which included chip capacitors of sizes 0805 up to 2225 and 50 mil pitch, leadless ceramic chip carriers having sizes of 16 I/O to 68 I/O, were then placed on the circuit boards. The test vehicles were oven reflowed under a N{sub 2} atmosphere. The solderability of the thick film pads was also observed to be sensitive to the firing conditions. Solderability appeared to degrade by the added processing steps needed for the triple print and dielectric window depositions. However, the primary factor in solderability was the firing temperature. Solderability was poorer when the firing temperature was higher.

  20. A Study of Solder Alloy Ductility for Cryogenic Applications

    Lupinacci, A.; Shapiro, A. A.; Suh, J-O.; Minor, A. M.


    For aerospace applications it is important to understand the mechanical performance of components at the extreme temperature conditions seen in service. For solder alloys used in microelectronics, cryogenic temperatures can prove problematic. At low temperatures Sn-based solders undergo a ductile to brittle transition that leads to brittle cracks, which can result in catastrophic failure of electronic components, assemblies and spacecraft payloads. As industrial processes begin to move away from Pb-Sn solder, it is even more critical to characterize the behavior of alternative Sn-based solders. Here we report on initial investigations using a modified Charpy test apparatus to characterize the ductile to brittle transformation temperature of nine different solder systems.

  1. Hybrid microcircuit board assembly with lead-free solders

    Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.


    An assessment was made of the manufacturability of hybrid microcircuit test vehicles assembled using three Pb-free solder compositions 96.5Sn--3.5Ag (wt.%), 91.84Sn--3.33Ag--4.83Bi, and 86.85Sn--3.15Ag--5.0Bi--5.0Au. The test vehicle substrate was 96% alumina; the thick film conductor composition was 76Au--21Pt--3Pd. Excellent registration between the LCCC or chip capacitor packages and the thick film solder pads was observed. Reduced wetting of bare (Au-coated) LCCC castellations was eliminated by hot solder dipping the I/Os prior to assembly of the circuit card. The Pb-free solders were slightly more susceptible to void formation, but not to a degree that would significantly impact joint functionality. Microstructural damage, while noted in the Sn-Pb solder joints, was not observed in the Pb-free interconnects.

  2. Current Status of Lead-Free Soldering and Conductive Adhesives



    Lead-free soldering technology took offin the Japanese market during the year 2000, and as the year 2001-03 ushered in the 21 st century, a large number of products with lead-free soldering were already appearing on store shelves. Elsewhere, EU deliberation on the draft of the WEEE/RoHS directive finalized in February 2003 and be in force in July 2006. The course had been set for adopting lead-free solder for mounting processes of parts as well, bringing the possibility of lead-free solder mounting very close to achievement. This review will provide a view of the current state of technological progress in lead-free soldering, both in Japan and abroad, and will discuss future prospects.

  3. Development of lead-free solders for hybrid microcircuits

    Hosking, F.M.; Vianco, P.T.; Frear, D.R.; Robinson, D.G.


    Extensive work has been conducted by industry to develop lead-free solders for electronics applications. The driving force behind this effort is pressure to ban or tax the use of lead-bearing solders. There has been further interest to reduce the use of hazardous chemical cleaners. Lead-free soldering and low-residue, ``no clean`` assembly processing are being considered as solutions to these environmental issues. Most of the work has been directed toward commercial and military printed wiring board (PWB) technology, although similar problems confront the hybrid microcircuit (HMC) industry, where the development of lead-free HMC solders is generally lagging. Sandia National Laboratories is responsible for designing a variety of critical, high reliability hybrid components for radars. Sandia has consequently initiated a project, as part of its Environmentally Conscious Manufacturing program, to develop low-residue, lead-free soldering for HMCs. This paper discusses the progress of that work.


    A.Y. Deng; G.L. Jia; J.C. He


    The three-dimensional electromagnetic characteristics and non-uniform distribution of electromagnetic field in soft-contact mold have been analyzed by numerical simulation. The results show that the maximum electromagnetic flux density is found in front of slit; the electromagnetic flux density becomes large as coil current and slit number increase. In a certain frequency range, the electromagnetic flux density increases with increasing frequency; and the frequency range is different with changing of azimuthal position along inner wall of mold. The uniformity of electromagnetic field is effected mainly by frequency and mold structure parameters. Increasing slit number and adjusting slit arrangement position can improve the electromagnetic flux density and the uniformity of electromagnetic field. For a soft-contact mold with 16 slits, when frequency is 20kHz, the optimal slit arrangement parameter is a: b = 1: 2.c=0.

  5. Duality Symmetry and Soldering in Different Dimensions

    Banerjee, R


    We develop a systematic method of obtaining duality symmetric actions in different dimensions. This technique is applied for the quantum mechanical harmonic oscillator, the scalar field theory in two dimensions and the Maxwell theory in four dimensions. In all cases there are two such distinct actions. Furthermore, by soldering these distinct actions in any dimension a master action is obtained which is duality invariant under a much bigger set of symmetries than is usually envisaged. The concept of swapping duality is introduced and its implications are discussed. The effects of coupling to gravity are also elaborated. Finally, the extension of the analysis for arbitrary dimensions is indicated.

  6. Electromigration of composite Sn-Ag-Cu solder bumps

    Sharma, Ashutosh; Xu, Di Erick; Chow, Jasper; Mayer, Michael; Sohn, Heung-Rak; Jung, Jae Pil


    This study investigates the electromigration (EM) behavior of lead free Sn-Ag-Cu (SAC) solder alloys that were reinforced with different types of nanoparticles [Copper-coated carbon nanotubes (Cu/CNT), La2O3, Graphene, SiC, and ZrO2]. The composite solders were bumped on a Cu substrate at 220°C, and the resistance of the bumped solders was measured using a four wire setup. Current aging was carried out for 4 hours at a temperature of 160°C, and an increase in resistance was noted during this time. Of all the composite solders that were studied, La2O3 and SiC reinforced SAC solders exhibited the smallest resistances after current aging. However, the rate of change in the resistance at room temperature was lower for the SiC-reinforced SAC solder. The SAC and Graphene reinforced SAC solder bumps completely failed within 15 - 20 min of these tests. The SiC nanoparticles were reported to possibly entrap the SAC atoms better than other nanoparticles with a lower rate of EM. [Figure not available: see fulltext.

  7. Simulation of thermomechanical fatigue in solder joints

    Fang, H.E.; Porter, V.L.; Fye, R.M.; Holm, E.A. [Sandia National Labs., Albuquerque, NM (United States)


    Thermomechanical fatigue (TMF) is a very complex phenomenon in electronic component systems and has been identified as one prominent degradation mechanism for surface mount solder joints in the stockpile. In order to precisely predict the TMF-related effects on the reliability of electronic components in weapons, a multi-level simulation methodology is being developed at Sandia National Laboratories. This methodology links simulation codes of continuum mechanics (JAS3D), microstructural mechanics (GLAD), and microstructural evolution (PARGRAIN) to treat the disparate length scales that exist between the macroscopic response of the component and the microstructural changes occurring in its constituent materials. JAS3D is used to predict strain/temperature distributions in the component due to environmental variable fluctuations. GLAD identifies damage initiation and accumulation in detail based on the spatial information provided by JAS3D. PARGRAIN simulates the changes of material microstructure, such as the heterogeneous coarsening in Sn-Pb solder, when the component`s service environment varies.

  8. Albumin-genipin solder for laser tissue welding

    Lauto, Antonio; Foster, John; Avolio, Albert; Poole-Warren, Laura


    Background. Laser tissue soldering (LTS) is an alternative technique to suturing for tissue repair. One of the major drawbacks of LTS is the weak tensile strength of the solder welds when compared to sutures. In this study, the possibility was investigated for a low cytotoxic crosslinker, acting on amino groups, to enhance the bond strength of albumin solders. Materials and Methods. Solder strips were welded onto rectangular sections of sheep small intestine by a diode laser. The laser delivered in continuous mode mode a power of 170 +/- 10 mW at λ=808 nm, through a multimode optical fiber (core size = 200 μm) to achieve a dose of 10.8 +/- 0.5 J/mg. The solder thickness and surface area were kept constant throughout the experiment (thickness = 0.15 +/- 1 mm, area = 12 +/- 1.2 mm2). The solder incorporated 62% bovine serum albumin, 0.38% genipin, 0.25% indocyanin green dye (IG) and water. Tissue welding was also performed with a similar solder, which did not incorporate genipin, as a control group. The repaired tissue was tested for tensile strength by a calibrated tensiometer. Results. The tensile strength of the "genipin" solder was twice as high as the strength of the BSA solder (0.21 +/- 0.04 N and 0.11 +/- 0.04 N respectively; p~10-15 unpaired t-test, N=30). Discussion. Addition of a chemical crosslinking agent, such as genipin, significantly increased the tensile strength of adhesive-tissue bonds. A proposed mechanism for this enhanced bond strength is the synergistic action of mechanical adhesion with chemical crosslinking by genipin.

  9. Optimization design of wide face water slots for medium-thick slab casting mold

    Xue-lin Yin


    Full Text Available A three-dimensional finite-element model has been established to investigate the thermal behavior of the medium-thick slab copper casting mold with different cooling water slot designs. The mold wall temperatures measured using thermocouples buried in different positions of the mold with the original designed cooling system were analyzed to determine the corresponding heat flux profile. This profile was then used for simulation to predict the temperature distribution and the thermal stress distribution of the molds. The predicted temperatures during operation matched the plant measurements. The results showed that the maximum temperature, about 635 K in the wide hot surface, was found about 60 mm below the meniscus and 226 mm from the center of the mold. For the mold with the type I modified design, there was an insignificant decrease in temperature of about 5 K, and for the mold with the type II modified design, the maximum temperature was decreased by about 15 K and the temperature of the hot surface was distributed more uniformly along the length of the mold. The corresponding maximum thermal stress at the hot surface of the mold was reduced from 408 MPa to 386 MPa with the type II modified design. The results indicated that the modified design II is beneficial to the increase of mold life and the quality of casting slabs.

  10. Mechanical Reliability of Aged Lead-­Free Solders

    Lewin, Susanne


    The usage of lead-­free solder joints in electronic packaging is of greatest concern to the electronic industry due to the health and environmental hazards arising with the use of lead. As a consequence, lead is legally prohibited in the European Union and the industry is aiming to produce lead-free products.            The reliability of solder joints is an important issue as the failure could destroy the whole function of a product. SnAgCu is a commonly used alloy for lead-­free solders. Co...

  11. Solder technology in the manufacturing of electronic products

    Vianco, P.T.


    The electronics industry has relied heavily upon the use of soldering for both package construction and circuit assembly. The solder attachment of devices onto printed circuit boards and ceramic microcircuits has supported the high volume manufacturing processes responsible for low cost, high quality consumer products and military hardware. Defects incurred during the manufacturing process are minimized by the proper selection of solder alloys, substrate materials and process parameters. Prototyping efforts are then used to evaluate the manufacturability of the chosen material systems. Once manufacturing feasibility has been established, service reliability of the final product is evaluated through accelerated testing procedures.

  12. Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

    CHEN Wenxue; XUE Songbai; WANG Hui; WANG Jianxin; HAN Zongjie


    The eutectie Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quan-tity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxi-dation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the gluti-nosity and fluidity of Sn-9Zn-(0.5, 1)Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the pre-cipitation of ε-AgZn_3 from the liquid solder on preformed interracial intermetallics (Cu_5Zn_8). The peripheral AgZn_3, nodular on the Cu_5Zn_8 IMCs layer, is likely to be generated by a peritectic reaction L+γ-Ag_5Zn8→ε-AgZn_3 and the following crystallization of AgZn_3.

  13. Nanofabrication with molds & stamps

    Byron D. Gates


    Full Text Available A number of methods can be used to fabricate patterns with features having dimensions <100 nm. These techniques, however, can require specialized equipment and are often restricted to a cleanroom environment. Nanofabrication can be made accessible to multiple users by using elastomeric molds or stamps to transfer high-resolution patterns into other materials. These techniques are inexpensive and can transfer patterns into functional materials and onto a number of surfaces. This review describes recent advances in fabricating nanostructures using these techniques.

  14. Mold and Crucible Coatings


    34;" -"""-"’" " " ""’’ "" "" ’"" ’ j * AD I. AT)-E 9 7 W CONTRACTOR REPORT ARCCD-CR-86007 MOLD AND CRUCIBLE COATINGS Sylvia J. Canino Arthur L. Geary Nuclear...IFnlRpr April 1984_-_December 198, .. AUTNORfo) S. CONTRACT on CRAM? # "I MWef(e)I Sylvia J. Canino and Arthur L. Geary DAAK1O-84-C-0056 PERFORMING

  15. Enhanced Injection Molding Simulation of Advanced Injection Molds

    Béla Zink


    Full Text Available The most time-consuming phase of the injection molding cycle is cooling. Cooling efficiency can be enhanced with the application of conformal cooling systems or high thermal conductivity copper molds. The conformal cooling channels are placed along the geometry of the injection-molded product, and thus they can extract more heat and heat removal is more uniform than in the case of conventional cooling systems. In the case of copper mold inserts, cooling channels are made by drilling and heat removal is facilitated by the high thermal conductivity coefficient of copper, which is several times that of steel. Designing optimal cooling systems is a complex process; a proper design requires injection molding simulations, but the accuracy of calculations depends on how precise the input parameters and boundary conditions are. In this study, three cooling circuit designs and three mold materials (Ampcoloy 940, 1.2311 (P20 steel, and MS1 steel were used and compared using numerical methods. The effect of different mold designs and materials on cooling efficiency were examined using calculated and measured results. The simulation model was adjusted to the measurement results by considering the joint gap between the mold inserts.

  16. Injection Compression Molding of Replica Molds for Nanoimprint Lithography

    Keisuke Nagato


    Full Text Available As a breakthrough in the cost and durability of molds for nanoimprint lithography (NIL, replica molds are fabricated by injection compression molding (ICM. ICM is commonly used for optical disks such as DVDs or Blu-ray disks and is also a practical fabrication method for nanostructures. In this paper, I successfully demonstrated the fabrication of cycloolefin polymer replica molds with structures smaller than 60 nm by ICM. Furthermore, ultraviolet (UV-NIL using these replica molds was demonstrated. UV-cured resist was replicated over an area of 60 mm diameter. The degree of replication by UV-NIL in the first usage of each replica mold had good repeatability. Because ICM is a high-throughput, low-cost process, the replica mold can be disposed of after a certain time for UV-NIL. This method leads to a high-integrity UV-NIL process of patterned media because multiple large-area replica molds can be fabricated simultaneously.

  17. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Liu Mei Lee


    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  18. Solderability study of 63Sn-37Pb on zinc-plated and cadmium-plated stainless steel for the MC4636 lightning arrestor connector.

    Lopez, Edwin Paul; Vianco, Paul Thomas; Rejent, Jerome Andrew; Martin, Joseph J.


    Cadmium plating on metal surfaces is commonly used for corrosion protection and to achieve good solderability on the 304L stainless steel shell of the MC4636 lightning arrestor connector (LAC) for the W76-1 system. This study examined the use of zinc as a potential substitute for the cadmium protective surface finish. Tests were performed with an R and RMA flux and test temperatures of 230 C, 245 C, and 260 C. Contact angle, {theta}{sub c}, served as the generalized solderability metric. The wetting rate and wetting time parameters were also collected. The solderability ({theta}{sub c}) of the Erie Plating Cd/Ni coatings was better than that of similar Amphenol coatings. Although the {theta}{sub c} data indicated that both Cd/Ni platings would provide adequate solderability, the wetting rate and wetting time data showed the Amphenol coatings to have better performance. The Zn/Ni coatings exhibited non-wetting under all flux and temperature conditions. Based on the results of these tests, it has been demonstrated that zinc plating is not a viable alternate to cadmium plating for the LAC connectors.

  19. Mold Materials For Permanent Molding of Aluminum Alloys

    John F Wallace; David Schwam; Wen Hong


    A test that involves immersion of the potential mod materials for permanent molds has been developed that provides a thermal cycle that is similar to the experienced during casting of aluminum in permanent molds. This test has been employed to determine the relative thermal fatigue resistance of several different types of mold materials. Four commercial mold coatings have been evaluated for their insulating ability, wear resistance and roughness. The results indicate that composition and structure of the mold materials have considerable effect on their thermal fatigue cracking behavior. Irons with a gray iron structure are the most prone to thermal fatigue cracking followed by compacted graphite irons with the least thermal fatigue cracking of the cast irons experienced by ductile iron. The composition of these various irons affects their behavior.

  20. Thermophilic molds: Biology and applications.

    Singh, Bijender; Poças-Fonseca, Marcio J; Johri, B N; Satyanarayana, Tulasi


    Thermophilic molds thrive in a variety of natural habitats including soils, composts, wood chip piles, nesting materials of birds and other animals, municipal refuse and others, and ubiquitous in their distribution. These molds grow in simple media containing carbon and nitrogen sources and mineral salts. Polyamines are synthesized in these molds and the composition of lipids varies considerably, predominantly containing palmitic, oleic and linoleic acids with low levels of lauric, palmiotoleic and stearic acids. Thermophilic molds are capable of efficiently degrading organic materials by secreting thermostable enzymes, which are useful in the bioremediation of industrial wastes and effluents that are rich in oil, heavy metals, anti-nutritional factors such as phytic acid and polysaccharides. Thermophilic molds synthesize several antimicrobial substances and biotechnologically useful miscellaneous enzymes. The analysis of genomes of thermophilic molds reveals high G:C contents, shorter introns and intergenic regions with lesser repetitive sequences, and further confirms their ability to degrade agro-residues efficiently. Genetic engineering has aided in ameliorating the characteristics of the enzymes of thermophilic molds. This review is aimed at focusing on the biology of thermophilic molds with emphasis on recent developments in the analysis of genomes, genetic engineering and potential applications.

  1. Development of gold based solder candidates for flip chip assembly

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri


    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders for inte......Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  2. Method of defence of solder surface from oxidization

    Kurmashev Sh. D.


    Full Text Available Compositions are developed for defence of fusion solder from oxidization on the basis of mixture of glycerin, urea and powders of refractory oxides, carbides (Al2O3, TiO2, SIC, graphite. The offered compositions can be used for defence of fusion of solder from oxidization in the process of soludering and tinning of explorers, and also electric conclusions of elements of radio electronic apparatus by the method of immersion in stationary baths.

  3. Critical evaluations of lead-free solder alloys and performance comparisons

    Hitch, T.T.; Palit, K.; Prabhu, A.N. [David Sarnoff Research Center, Princeton, NJ (United States)


    This paper discusses the methodology for solder alloy selection, solder preparation processes, test selection, results, and conclusions. The conclusions from this phase of study were that: (1). Solders containing significant amounts of bismuth exhibit poor fatigue life. (2). The Sn-Ag-Cu alloy was the best solder we studied for use as a replacement for Sn-Pb eutectic. A second phase of the work involved detailed study of the Sn-Ag-Cu system with other additions to determine the optimum lead-free solder compositions in terms of melting point, solderability, and mechanical properties.

  4. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Liu Mei Lee; Ahmad Azmin Mohamad


    This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also disc...

  5. The effect of interface heat transfer on solidification, microstructure evolution, and mold wear in permanent mold casting of titanium-aluminum-vanadium

    Kobryn, Pamela Astra

    and to more than 5000 W/m2-K in the "shrink on" case. The applicability of solidification mapping and the validity of applying the parabolic grain growth law to predict as-cast beta grain size to Ti PMC was assessed. Two main mold wear mechanisms for Ti PMC were identified (soldering and wrinkling), and theories were developed for the causes of these types of mold wear.

  6. Microsurgical anastomosis of sperm duct by laser tissue soldering

    Wehner, Martin M.; Teutu-Kengne, Alain-Fleury; Brkovic, Drasko; Henning, Thomas; Klee, Doris; Poprawe, Reinhart; Jakse, Gerhard


    Connection of small vessels is usually done by suturing which is very cumbersome. Laser tissue soldering can circumvent that obstacle if a handy procedure can be defined. Our principle approach consists of a bioresorbable hollow stent with an expected degradation time of 3 weeks in combination with laser soldering. The stent is to be fed into the vessel to stabilize both ends and should allow percolation immediately after joining. The stents are made of Poly(D,L-lactid-co-glycolid) and solder is prepared from bovine serum albumin (BSA) doped with Indocyanine green (ICG) as chromophore to increase the absorption of laser light. After insertion, solder is applied onto the outer surface of the vessel and coagulated by laser radiation. The wavelength of 810 nm of a diode laser fits favorably to absorption properties of tissue and solder such that heating up of tissue is limited to prevent from necrosis and wound healing complications. In our study the preparation of stents, the consistency and doping of solder, a beam delivery instrument and the irradiation conditions are worked out. In-vitro tests are carried out on sperm ducts of Sprague-Dowlae (SD) rats. Different irradiation conditions are investigated and a micro-optical system consisting of a lens and a reflecting prism to ensure simultaneous irradiation of front and back side of the vessels tested. Under these conditions, the short-term rupture strength of laser anastomosis revealed as high as those achieved by suturing.

  7. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Mohammad Sadegh Nourbakhsh


    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  8. Creep properties of Pb-free solder joints

    Song, H.G.; Morris Jr., J.W.; Hua, F.


    Describes the creep behavior of three Sn-rich solders that have become candidates for use in Pb-free solder joints: Sn-3.5Ag, Sn-3Ag-0.5Cu and Sn-0.7Cu. The three solders show the same general behavior when tested in thin joints between Cu and Ni/Au metallized pads at temperatures between 60 and 130 C. Their steady-state creep rates are separated into two regimes with different stress exponents(n). The low-stress exponents range from {approx}3-6, while the high-stress exponents are anomalously high (7-12). Strikingly, the high-stress exponent has a strong temperature dependence near room temperature, increasing significantly as the temperature drops from 95 to 60 C. The anomalous creep behavior of the solders appears to be due to the dominant Sn constituent. Joints of pure Sn have stress exponents, n, that change with stress and temperature almost exactly like those of the Sn-rich solder joints. Research on creep in bulk samples of pure Sn suggests that the anomalous temperature dependence of the stress exponent may show a change in the dominant mechanism of creep. Whatever its source, it has the consequence that conventional constitutive relations for steady-state creep must be used with caution in treating Sn-rich solder joints, and qualification tests that are intended to verify performance should be carefully designed.

  9. Solderability perservative coatings: Electroless tin vs. organic azoles

    Artaki, I.; Ray, U.; Jackson, A.M.; Gordon, H.M. [AT and T Bell Labs., Princeton, NJ (United States); Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)


    This paper compares the solderability performance and corrosions ion protection effectiveness of electroless tin coatings versus organic azole films after exposure to a series of humidity and thermal (lead-free solders) cycling conditions. The solderability of immersion tin is directly related to the tin oxide growth on the surface and is not affected by the formation of Sn-Cu intermetallic phases as long as the intermetallic phase is protected by a Sn layer. For a nominal tin thickness of 60{mu}inches, the typical thermal excursions associated with assembly are not sufficient to cause the intermetallic phase to consume the entire tin layer. Exposure to humidity at moderate to elevated temperatures promotes heavy tin oxide formation which leads to solderability loss. In contrast, thin azole films are more robust to humidity exposure; however upon heating in the presence of oxygen, they decompose and lead to severe solderability degradation. Evaluations of lead-free solder pastes for surface mount assembly applications indicate that immersion tin significantly improves the spreading of Sn:Ag and Sn:Bi alloys as compared to azole surface finishes.

  10. Soldering in prosthodontics--an overview, part I.

    Byrne, Gerard


    The fit of fixed multiunit dental prostheses (FDP), traditionally termed fixed partial dentures (FPDs), is an ongoing problem. Poorly fitting restorations may hasten mechanical failure, due to abutment caries or screw failure. Soldering and welding play an important role in trying to overcome misfit of fixed multiunit prostheses. The term FPD will be used to denote multiunit fixed dental prostheses in this review. This is the first of a series of articles that review the state of the art and science of soldering and welding in relation to the fit of cemented or screw-retained multiunit prostheses. A comprehensive archive of background information and scientific findings is presented. Texts in dental materials and prosthodontics were reviewed. Scientific data were drawn from the numerous laboratory studies up to and including 2009. The background, theory, terminology, and working principles, along with the applied research, are presented. This first article focuses on soldering principles and dimensional accuracy in soldering. There is some discussion and suggestions for future research and development. Soldering may improve dimensional accuracy or reduce the distortion of multiunit fixed prostheses. Many variables can affect the outcome in soldering technique. Research science has developed some helpful guidelines. Research projects are disconnected and limited in scope. © 2011 by The American College of Prosthodontists.

  11. Soldering of Thin Film-Metallized Glass Substrates

    Hosking, F.M.; Hernandez, C.L.; Glass, S.J.


    The ability to produce reliable electrical and structural interconnections between glass and metals by soldering was investigated. Soldering generally requires premetallization of the glass. As a solderable surface finish over soda-lime-silicate glass, two thin films coatings, Cr-Pd-Au and NiCr-Sn, were evaluated. Solder nettability and joint strengths were determined. Test samples were processed with Sn60-Pb40 solder alloy at a reflow temperature of 210 C. Glass-to-cold rolled steel single lap samples yielded an average shear strength of 12 MPa. Solder fill was good. Control of the Au thickness was critical in minimizing the formation of AuSn{sub 4} intermetallic in the joint, with a resulting joint shear strength of 15 MPa. Similar glass-to-glass specimens with the Cr-Pd-Au finish failed at 16.5 MPa. The NiCr-Sn thin film gave even higher shear strengths of 20-22.5 MPa, with failures primarily in the glass.

  12. 板级跌落碰撞下BGA焊点的失效分析与可靠性%Failure analysis and reliability studying of BGA solder joint in board-level drop test



    研究焊点在跌落碰撞状态下的可靠性是研究电子产品可靠性的关键技术之一,本文基于JE-DEC冲击跌落标准对焊料的跌落性能进行了测试,试验过程中充分考虑了焊料的材料组成、助焊剂、焊盘的处理方法以及焊球的大小等因素.焊料选择常用的Sn-3Ag-0.5Cu(SAC305)和Sn-1Ag-0.5Cu(SAC105)和Sn63Pb37,焊盘处理方法为Ni/Au电镀法和有机保焊膜(OSP)涂覆法.运用红油浸渍试验和焊点金相剖面分析对焊点的失效模式和可靠性进行分析,结果表明无铅焊料中银含量较低和焊盘采用OSP涂覆法有利于提高BGA焊点的可靠性.%The experimental studying of the reliability of solder joint in dropping and impacting have been a key procedure of studying of the electronic product reliability. The paper have measured the drop performance about solder joint point based on JEDEC drop standard, and compared the effect to reliability of solder joint among the composition of solder material, fluxes, the method of substrate pad surface treatment and solder ball size and so on. Now Sn -3Ag -0. 5Cu and Sn - lAg -0. 5Cu and Sn63Pb37 are three kind of solder material selected, and substrate pad with Ni/Au surface finish and organic solder-ability preservatives (OSP) coating in the testing. The failure model and reliability of solder joint are examined using the dye- pry and cross - section test, and the result indicate that the solder joint with a low Ag weight contented and substrate pad with OSP coating can both enhance the reliability of BGA solder joint.

  13. Lead-free solder technology transfer from ASE Americas



    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  14. Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders

    Li, Qin; Ma, Ninshu; Lei, YongPing; Lin, Jian; Fu, HanGuang; Gu, Jian


    Development of lead-free solders with low melting temperature is important for substitution of Pb-based solders to reduce direct risks to human health and the environment. In the present work, Sn-Bi-In solders were studied for different ratios of Bi and Sn to obtain solders with low melting temperature. The microstructure, thermal properties, wettability, mechanical properties, and reliability of joints with Cu have been investigated. The results show that the microstructures of the Sn-Bi-In solders were composed of β-Sn, Bi, and InBi phases. The intermetallic compound (IMC) layer was mainly composed of Cu6Sn5, and its thickness increased slightly as the Bi content was increased. The melting temperature of the solders was around 100°C to 104°C. However, when the Sn content exceeded 50 wt.%, the melting range became larger and the wettability became worse. The tensile strength of the solder alloys and solder joints declined with increasing Bi content. Two fracture modes (IMC layer fracture and solder/IMC mixed fracture) were found in solder joints. The fracture mechanism of solder joints was brittle fracture. In addition, cleavage steps on the fracture surface and coarse grains in the fracture structure were comparatively apparent for higher Bi content, resulting in decreased elongation for both solder alloys and solder joints.

  15. Influences of fine pitch solder joint shape parameters on fatigue life under thermal cycle

    HUANG Chun-yue; WU Zhao-hua; HUANG Hong-yan; ZHOU De-jian


    The solder joint reliability of a 0. 5 mm lead pitch, 240-pin quad flat package(QFP) was studied by nonlinear finite element analysis(FEA). The stress/strain distributions within the solder joints and the maximum plastic strain range of the solder joints were determined. Based on the calculated maximum plastic strain range the thermal fatigue life of the solder joints was calculated using Coffin-Manson equation. The influences of shape parameters including volume of solder joint, pad size and stand-off on the thermal fatigue life of the solder joints were also studied. The results show that the stress and strain distribution in the solder joint are not uniform; the interface between the lead and the solder joint is the high stress and strain region; the maximum stress and stain occur at the topmost point where the solder joint intersects with the inner side of the lead. The solder joint cracks should occur firstly at this point and propagate along the interface between the solder and the lead. The solder joint with the pad size of 1.25 mm× 0.35 mm, the stand-off of 0.02 mm and the solder volume of 0. 026 mm3 has longer fatigue life than that of any others. These optimal parameters have been applied in practice to assemble the 240-pin, 0.5 mm pitch QFP.

  16. Investigation of Heat Transfer at the Mold/Metal Interface in Permanent Mold Casting of Light Alloys

    Robert D. Pehlke; John T. Berry


    curve information, as well as temperature gradient history both in the solidifying metal and within the mold are invariably required to be validated. This validation depends upon the response of the sensor concerned, but also on its own effect upon the thermal environment. A joint university/industry team has completed an investigation of the invasive effects of thermocouples upon temperature history in permanent molds determining the degree of uncertainty associated with placement and indicating how the time-temperature history may be recovered. In addition to its relevance to the all important study of thermal contact of the casting with metallic molds, the observations also impact the determination of heat flux and interfacial heat transfer coefficients. In these respects the study represents the first of its kind that has tackled the problem in depth for permanent mold castings. An important ramification of this investigation has been the errors likely to be encountered in mold temperature measurement with thin section aluminum castings, especially with respect to the plans for thermocouple placement. A comparison between the degree of uncertainty experienced in sand molds compared with that found in permanent molds reveals that the associated problems have a lesser impact. These conclusions and the related recommendations have been disseminated to industry and the technical community through project reports and publications.

  17. Solderability of Sn-9Zn-0.5Ag-1In lead-free solder on Cu substrate

    Chang, T.-C. [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Wang, J.-W. [Department of Environmental and Safety Engineering, Chung Hwa College of Medical Technology, 89 Wen-Hwa 1st Street, Jen-Te, Tainan 71703, Taiwan (China); Wang, M.-C. [Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 415 Chien-Kung Road, Kaohsiung 80782, Taiwan (China)]. E-mail:; Hon, M.-H. [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Da-Yeh University, 112 Shan Jean Road, Da-tsuen, Chang-hua, Taiwan (China)


    The thermal properties, microstructure corrosion and oxidation resistance of the Sn-9Zn-0.5Ag-1In lead-free solder have been investigated by differential scanning calorimetry, X-ray diffractometry, scanning electron microscopy, energy dispersive spectrometry, potentiostat and thermogravimetry. The Sn-9Zn-0.5Ag-1In solder alloy has a near-eutectic composition, it melts at 187.6 deg. C and the heat of fusion is determined as 71.3 J/g. The Sn-9Zn-0.5Ag-1In solder alloy with a corrosion potential of -1.09 V{sub SCE} and a current density of 9.90 x 10{sup -2} A/cm{sup 2}, shows a better corrosion resistance than that of the Sn-9Zn solder alloy. From the thermogravimetry analysis, the weight gain ratio of the Sn-9Zn solder alloy appears a parabolic relationship at 150 deg. C. The initial oxidation behavior of the Sn-9Zn-0.5Ag and Sn-9Zn-0.5Ag-1In solder alloys also shows a parabolic relationship but the weight gain ratio of them appears a negative linear one after aging at 150 deg. C for 2.5 and 5 h, respectively.

  18. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Chen, Haiyan; Peng, Jianke; Fu, Li; Wang, Xincheng; Xie, Yan


    In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  19. Interaction Kinetics between Sn-Pb Solder Droplet and Au/Ni/Cu Pad

    Fuquan LI; Chunqing WANG; Yanhong TIAN


    The interfacial phenomena of the Sn-Pb solder droplet on Au/Ni/Cu pad are investigated. A continuous AuSn2and needle-like AuSn4 are formed at the interface after the liquid state reaction (soldering). The interfacial reaction between the solder and Au layer continues during solid state aging with AuSn4 breaking off from the interface and felling into the solder. The kinetics of Au layer dissolution and diffusion into the solder during soldering and aging is analyzed to elucidate intermetallic formation mechanism at the solder/Au pad interface.The concentration of Au near the solder/pad interface is identified to increase and reach the solubility limit during the period of liquid state reaction. During solid state reaction, the thickening of Au-Sn compound is mainly controlled by element diffusion.

  20. Development of a new Pb-free solder: Sn-Ag-Cu

    Miller, C.M.


    With the ever increasing awareness of the toxicity of Pb, significant pressure has been put on the electronics industry to get the Pb out of solder. This work pertains to the development and characterization of an alloy which is Pb-free, yet retains the proven positive qualities of current Sn-Pb solders while enhancing the shortcomings of Sn-Pb solder. The solder studied is the Sn-4.7Ag-1.7Cu wt% alloy. By utilizing a variety of experimental techniques the alloy was characterized. The alloy has a melting temperature of 217{degrees}C and exhibits eutectic melting behavior. The solder was examined by subjecting to different annealing schedules and examining the microstructural stability. The effect of cooling rate on the microstructure of the solder was also examined. Overall, this solder alloy shows great promise as a viable alternative to Pb-bearing solders and, as such, an application for a patent has been filed.

  1. A critical review of constitutive models for solders in electronic packaging

    Chen, Gang; Zhao, Xiaochen; Wu, Hao


    .... Because the failure of the whole electronic packaging is often induced by the failure of solders, modeling and simulation of solder joint performance are quite important in ensuring the quality...

  2. Microbial leaching of waste solder for recovery of metal.

    Hocheng, H; Hong, T; Jadhav, U


    This study proposes an environment-friendly bioleaching process for recovery of metals from solders. Tin-copper (Sn-Cu), tin-copper-silver (Sn-Cu-Ag), and tin-lead (Sn-Pb) solders were used in the current study. The culture supernatant of Aspergillus niger removed metals faster than the culture supernatant of Acidithiobacillus ferrooxidans. Also, the metal removal by A. niger culture supernatant is faster for Sn-Cu-Ag solder as compared to other solder types. The effect of various process parameters such as shaking speed, temperature, volume of culture supernatant, and increased solder weight on bioleaching of metals was studied. About 99 (±1.75) % metal dissolution was achieved in 60 h, at 200-rpm shaking speed, 30 °C temperature, and by using 100-ml A. niger culture supernatant. An optimum solder weight for bioleaching was found to be 5 g/l. Addition of sodium hydroxide (NaOH) and sodium chloride (NaCl) in the bioleached solution from Sn-Cu-Ag precipitated tin (85 ± 0.35 %) and silver (80 ± 0.08 %), respectively. Passing of hydrogen sulfide (H2S) gas at pH 8.1 selectively precipitated lead (57.18 ± 0.13 %) from the Sn-Pb bioleached solution. The proposed innovative bioleaching process provides an alternative technology for recycling waste solders to conserve resources and protect environment.

  3. Injection Molding of High Aspect Ratio Nanostructures

    Matschuk, Maria; Larsen, Niels Bent

    We present a process for injection molding of 40 nm wide and >100 nm high pillars (pitch: 200 nm). We explored the effects of mold coatings and injection molding conditions on the replication quality of nanostructures in cyclic olefin copolymer. We found that optimization of molding parameters...

  4. Rapid control of mold temperature during injection molding process

    Liparoti, Sara; Titomanlio, Giuseppe [Department of Industrial Engineering, University of Salerno Via Giovanni Paolo II, 132, 84084 Fisciano (Italy); Hunag, Tsang Min; Cakmak, Mukerrem [Department of Polymer Engineering, The University of Akron, Akron, OH 44325 (United States); Sorrentino, Andrea [Institute for Polymers, Composite and Biomaterials (IPCB) - CNR, P. Enrico Fermi 1, 80055 Portici (Italy)


    The control of mold surface temperature is an important factor that determines surface morphology and its dimension in thickness direction. It can also affect the frozen molecular orientation and the mold surface replicability in injection molded products. In this work, thin thermally active films were used to quickly control the mold surface temperature. In particular, an active high electrical conductivity carbon black loaded polyimide composites sandwiched between two insulating thin polymeric layers was used to condition the mold surface. By controlling the heating time, it was possible to control precisely the temporal variation of the mold temperature surface during the entire cycle. The surface heating rate was about 40°C/s and upon contact with the polymer the surface temperature decreased back to 40°C within about 5 s; the overall cycle time increased only slightly. The effect on cross section sample morphology of samples of iPP were analyzed and discussed on the basis of the recorded temperature evolution.

  5. Analysis of solderability test methods: predicition model generation for through-hole components

    Woods, Bobby


    peer-reviewed In order to achieve a reduction in solderability related defects on electronic components and Printed Circuit Board???s (PCB???s) in electronics manufacturing, preventive controls such as ???Dip & Look??? and ???Wetting Balance??? solderability testing need to be fully optimised to screen out all poor soldering components and PCB???s. Components and PCB???s that pass these tests should solder correctly in volume production. This thesis initially investigates the variations...

  6. White mold of Jerusalem artichoke

    Jerusalem artichoke (Helianthus tuberosus) is a Native American food plant closely related to the common sunflower (Helianthus annuus). Tubers of Jerusalem artichoke are increasingly available in retail grocery outlets. White mold (Sclerotinia stem rot), caused by the fungus, Sclerotinia sclerotioru...

  7. Methylene blue solder re-absorption in microvascular anastomoses

    Birch, Jeremy F.; Hepplewhite, J.; Frier, Malcolm; Bell, Peter R. F.


    Soldered vascular anastomoses have been reported using several chromophores but little is known of the optimal conditions for microvascular anastomosis. There are some indications of the optimal protein contents of a solder, and the effects of methylene blue on anastomotic strength. The effects of varying laser power density in vivo have also been described, showing a high rate of thrombosis with laser power over 22.9Wcm-2. However no evidence exists to describe how long the solder remains at the site of the anastomosis. Oz et al reported that the fibrin used in their study had been almost completely removed by 90 days but without objective evidence of solder removal. In order to address the issue of solder re-absorption from the site of an anastomosis we used radio-labelled albumin (I-125) incorporated into methylene blue based solder. This was investigated in both the situation of the patent and thrombosed anastomosis with anastomoses formed at high and low power. Iodine-125 (half life: 60.2 days) was covalently bonded to porcine albumin and mixed with the solder solution. Radio-iodine has been used over many years to determine protein turnover using either I-125 or I-131. Iodine-125 labelled human albumin is regularly used as a radiopharmaceutical tool for the determination of plasma volume. Radio-iodine has the advantages of not affecting protein metabolism and the label is rapidly excreted after metabolic breakdown. Labelling with chromium (Cr-51) causes protein denaturation and is lost from the protein with time. Labelled albumin has been reported in human studies over a 21-day period, with similar results reported by Matthews. Most significantly McFarlane reported a different rate of catabolism of I-131 and I-125 over a 22-day period. The conclusion from this is that the rate of iodine clearance is a good indicator of protein catabolism. In parallel with the surgery a series of blank standards were prepared with a known mass of solder to correct for isotope

  8. Reliability of lead-free solders in electronic packaging technology

    Choi, Woojin

    The electromigration of flip chip solder bump (eutetic SnPb) has been studied at temperatures of 100, 125 and 150°C and current densities of 1.9 to 2.75 x 104 A/cm2. The under-bump-metallization on the chip side is thin film Al/Ni(V)/Cu and on the board side is thick Cu. By simulation, we found that current crowding occurs at the corner on the chip side where the electrons enter the solder ball. We are able to match this simulation to the real electromigration damage in the sample. The experimental result showed that voids initiated from the position of current crowding and propagated across the interface between UBM and the solder ball. The Cu-Sn intermetallic compounds formed during the reflow is known to adhere well to the thin film UBM, but they detached from the UBM after current stressing. Therefore, the UBM itself becomes part of the reliability problem of the flip chip solder joint under electromigration. Currently there is a renewed interest in Sn whisker growth owing to the introduction of Pb-free solder in electronic manufacturing. The leadframe is electroplated or finished with a layer of Pb-free solder. The solder is typically pure Sn or eutectic SnCu (0.7 atomic % Cu). It is a serious reliability concern in the use of the eutectic SnCu solder as leadframe surface finish due to the growth of long whiskers on it. The origin of the driving force of compressive stress can be mechanical, thermal, and chemical. Among them, the chemical force is the most important contribution to the whisker growth and its origin is due to the reaction between Sn and Cu to form intermetallic compound (IMC) at room temperature. For whisker or hillock growth, the surface cannot be free of oxide and it must be covered with oxide and the oxide must be a protective one so that it removes effectively all the vacancy sources and sinks on the surface. Hence, only those metals, which grow protective oxides such as Al and Sn, are known to have hillock growth or whisker growth. We

  9. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    Chidambaram, Vivek; Hald, John; Ambat, Rajan;


    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work, co...

  10. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.


    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  11. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.


    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  12. Photonic flash soldering of thin chips and SMD components on foils for flexible electronics

    Ende, D.A. van den; Hendriks, R.; Cauchois, R.; Kusters, R.H.L.; Cauwe, M.; Groen, W.A.; Brand, J. van den


    Ultrathin bare die chips and small-size surface mount device components were successfully soldered using a novel roll-to-roll compatible soldering technology. A high-power xenon light flash was used to successfully solder the components to copper tracks on polyimide (PI) and polyethylene terephthala

  13. Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders

    Nagy E.


    Full Text Available Interfacial intermetallic compounds (IMC play an important role in Sn-Cu lead-free soldering. The size and morphology of the intermetallic compounds formed between the lead-free solder and the Cu substrate have a significant effect on the mechanical strength of the solder joint.

  14. Prevention of Mold Contamination : Ozone Treatment

    Nakarmi, Kanchan


    Mold is a common pest that can cause diseases and decay property. Moreover, certain mold can produce toxic chemicals which leads directly or indirectly to additional health impacts and economic losses. Therefore, prevention of mold growth is a major concern, and disinfection of mold has become a center of attention. The purpose of this thesis was to study about the effect of ozone in the disinfection of mold and the method of producing ozone. The usage of ozone for disinfection in in...

  15. Onychomycosis due to opportunistic molds*

    Martínez-Herrera, Erick Obed; Arroyo-Camarena,Stefanie; Tejada-García, Diana Luz; Porras-López, Carlos Francisco; Arenas, Roberto


    Abstract BACKGROUND: Onychomycosis are caused by dermatophytes and Candida, but rarely by non- dermatophyte molds. These opportunistic agents are filamentous fungi found as soil and plant pathogens. OBJECTIVES: To determine the frequency of opportunistic molds in onychomycosis. METHODS: A retrospective analysis of 4,220 cases with onychomycosis, diagnosed in a 39-month period at the Institute of Dermatology and Skin surgery "Prof. Dr. Fernando A. Cordero C." in Guatemala City, and confirmed w...

  16. Experimental Methods in Reduced-gravity Soldering Research

    Pettegrew, Richard D.; Struk, Peter M.; Watson, John K.; Haylett, Daniel R.


    The National Center for Microgravity Research, NASA Glenn Research Center, and NASA Johnson Space Center are conducting an experimental program to explore the influence of reduced gravity environments on the soldering process. An improved understanding of the effects of the acceleration environment is important to application of soldering during current and future human space missions. Solder joint characteristics that are being considered include solder fillet geometry, porosity, and microstructural features. Both through-hole and surface mounted devices are being investigated. This paper focuses on the experimental methodology employed in this project and the results of macroscopic sample examination. The specific soldering process, sample configurations, materials, and equipment were selected to be consistent with those currently on-orbit. Other apparatus was incorporated to meet requirements imposed by operation onboard NASA's KC-135 research aircraft and instrumentation was provided to monitor both the atmospheric and acceleration environments. The contingent of test operators was selected to include both highly skilled technicians and less skilled individuals to provide a population cross-section that would be representative of the skill mix that might be encountered in space mission crews.

  17. Low-temperature solder for laser tissue welding

    Lauto, Antonio; Stewart, Robert B.; Felsen, D.; Foster, John; Poole-Warren, Laura; Poppas, Dix P.


    In this study, a two layer (TL) solid solder was developed with a fixed thickness to minimize the difference in temperature across the solder (ΔT) and to weld at low temperature. Solder strips comprising two layers (65% albumin, 35% water) were welded onto rectangular sections of dog small intestine by a diode laser (λ = 808 nm). The laser delivered a power of 170 +/- 10 mW through an optical fiber (spot size approximately 1 mm) for 100 seconds. A solder layer incorporated also a dye (carbon black, 0.25%) to absorb the laser radiation. A thermocouple and an infrared thermometer system recorded the temperatures at the tissue interface and at the external solder surface, during welding. The repaired tissue was tested for tensile strength by a calibrated tensiometer. The TL strips were able to minimize ΔT (12 +/- 4°C) and control the temperature at tissue-interface. The strips fused on tissue at 55=70°C for tissue repair, which cause more irreversible thermal damage.

  18. Creep characterization of solder bumps using nanoindentation

    Du, Yingjie; Liu, Xiao Hu; Fu, Boshen; Shaw, Thomas M.; Lu, Minhua; Wassick, Thomas A.; Bonilla, Griselda; Lu, Hongbing


    Current nanoindentation techniques for the measurement of creep properties are applicable to viscoplastic materials with negligible elastic deformations. A new technique for characterization of creep behavior is needed for situations where the elastic deformation plays a significant role. In this paper, the effect of elastic deformation on the determination of creep parameters using nanoindentation with a self-similar nanoindenter tip is evaluated using finite element analysis (FEA). It is found that the creep exponent measured from nanoindentation without taking into account of the contribution of elastic deformation tends to be higher than the actual value. An effective correction method is developed to consider the elastic deformation in the calculation of creep parameters. FEA shows that this method provides accurate creep exponent. The creep parameters, namely the creep exponent and activation energy, were measured for three types of reflowed solder bumps using the nanoindentation method. The measured parameters were verified using FEA. The results show that the new correction approach allows extraction of creep parameters with precision from nanoindentation data.

  19. Hydrogen silsesquioxane mold coatings for improved replication of nanopatterns by injection molding

    Hobæk, Thor Christian; Matschuk, Maria; Kafka, Jan;


    We demonstrate the replication of nanosized pillars in polymer (cyclic olefin copolymer) by injection molding using nanostructured thermally cured hydrogen silsesquioxane (HSQ) ceramic coatings on stainless steel mold inserts with mold nanostructures produced by a simple embossing process...

  20. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    Zhang, Xuan


    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  1. Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

    Abdul Aziz, M. S.; Abdullah, M. Z.; Khor, C. Y.


    An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183°C) analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. The ΔT obtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry. PMID:25225638

  2. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Vianco, P.T.


    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  3. Horizon Shells and BMS-like Soldering Transformations

    Blau, Matthias


    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like ...

  4. Development of alternatives to lead-bearing solders

    Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)


    Soldering technology, using tin-lead alloys has had a significant role in the packaging of highly functional, low cost electronic devices. The elimination of lead from all manufactured products, whether through legislation or tax incentives, will impact the electronics community which uses lead-containing solders. In response to these proposed measures, the National Center for Manufacturing Sciences has established a multi-year program involving participants from industry, academia, and the national laboratories with the objective to identify potential replacements for lead-bearing solders. Selection of candidate alloys is based upon the analysis of materials properties, manufacturability, modeling codes for reliability prediction, as well as toxicological properties and resource availability, data developed in the program.

  5. Bosonisation and Duality Symmetry in the Soldering Formalism

    Banerjee, R


    We develop a technique that solders the dual aspects of some symmetry. Using this technique it is possible to combine two theories with such symmetries to yield a new effective theory. Some applications in two and three dimensional bosonisation are discussed. In particular, it is shown that two apparently independent three dimensional massive Thirring models with same coupling but opposite mass signatures, in the long wavelegth limit, combine by the process of bosonisation and soldering to yield an effective massive Maxwell theory. Similar features also hold for quantum electrodynamics in three dimensions. We also provide a systematic derivation of duality symmetric actions and show that the soldering mechanism leads to a master action which is duality invariant under a bigger set of symmetries than is usually envisaged. The concept of duality swapping is introduced and its implications are analysed. The example of electromagnetic duality is discussed in details.

  6. Corrosion Issues in Solder Joint Design and Service



    Corrosion is an important consideration in the design of a solder joint. It must be addressed with respect to the service environment or, as in the case of soldered conduit, as the nature of the medium being transported within piping or tubing. Galvanic-assisted corrosion is of particular concern, given the fact that solder joints are comprised of different metals or alloy compositions that are in contact with one-another. The (thermodynamic) potential for corrosion to take place in a particular environment requires the availability of the galvanic series for those conditions and which includes the metals or alloys in question. However, the corrosion kinetics, which actually determine the rate of material loss under the specified service conditions, are only available through laboratory evaluations or field data that are found in the existing literature or must be obtained by in-house testing.

  7. The impact of process parameters on gold elimination from soldered connector assemblies



    Minimizing the likelihood of solder joint embrittlement in connectors is realized by reducing or eliminating retained Au plating and/or Au-Sn intermetallic compound formation from the assemblies. Gold removal is performed most effectively by using a double wicking process. When only a single wicking procedure can be used, a higher soldering temperature improves the process of Au removal from the connector surfaces and to a nominal extent, removal of Au-contaminated solder from the joint. A longer soldering time did not appear to offer any appreciable improvement toward removing the Au-contaminated solder from the joint. Because the wicking procedure was a manual process, it was operator dependent.

  8. Lead Free Solder Joint Thermal Condition in Semiconductor Packaging

    M. N. Harif


    Full Text Available Problem statement: Solder joints are responsible for both electrical and mechanical connections. Solder does not have adequate ductility to ensure the repeated relative displacements due to the mismatch between expansion coefficients of the chip carrier and the circuit board. Solder material plays a crucial role to provide the necessary electrical and mechanical interconnections in an electronic assembly. Finding a technique to increase the service life of future connections is not the total solution. A method must be developed for predicting the remaining service life of many joints already in use. Approach: The effect of High Temperature Storage (HTS on lead free solder joint material for ball grid array application using pull test method is studied in this study. Some statistical analysis base on the pull test data also discussed. Three samples of different lead free solder joint material were selected in this experiment namely Sn3.8Ag0.7Cu (SAC387, Sn2.3Ag0.08Ni0.01Co (SANC and Sn3.5Ag. After the thermal condition test, all the lead free solder joint material samples were tested using Dage 4000 pull test machine. Each pull test will be 5 units and each unit contains 8 balls. Results: The mean pull strength for high temperature storage is 2847.66, 2628.20 and 2613.79 g for Sn3.5Ag, SANC and SAC387, respectively. Thus, Sn3.5Ag shows a significantly better solder joint performance in terms of joint strength compare to SANC and SAC387. Hence, Intermetallic Compound (IMC thicknesses were measured after cross-sectioning. Sample size for cross-sectioning was 3 units per read point, 2 balls per unit and 3 maximum IMC peaks per ball and the measurement using high power scope of 100x and Image Analyzer software to measure the IMC thickness. For high temperature storage, result show that the mean IMC thicknesses for SAC387, SANC and Sn3.5Ag are 3.9139, 2.3111 and 2.3931 µm. Conclusion/Recommendations: It was found that IMC thickness for SANC and Sn3

  9. Functional nanostructures on injection molded plastic

    Johansson, Alicia Charlotte; Søgaard, Emil; Andersen, Nis Korsgaard

    Nanotechnology can be used to make inexpensive plastic parts with functional surfaces. The plastic parts can be molded using a standard injection molding process. The nanostructures are directly transferred from the surface of the molding tool to the surface of the molded plastic part during...... the molding process. The main advantage with this method is that surface treatments and chemical additives are avoided, which minimizes health risks and simplifies recycling. Another advantage is that the unique technology enables nanostructuring of free form molded parts. The functional surfaces can have...

  10. Studies on in situ particulate reinforced tin-silver composite solders relevant to thermomechanical fatigue issues

    Choi, Sunglak


    Global pressure based on environmental and health concerns regarding the use of Pb-bearing solder has forced the electronics industry to develop Pb-free alternative solders. Eutectic Sn-Ag solder has received much attention as a potential Pb-free candidate to replace Sn-Pb solder. Since introduction of surface mount technology, packaging density increased and the electronic devices became smaller. As a result, solders in electronic modules are forced to function as a mechanical connection as well as electrical contact. Solders are also exposed to very harsh service conditions such as automotive under-the-hood and aerospace applications. Solder joints experience thermomechanical fatigue, i.e. interaction of fatigue and creep, during thermal cycling due to temperature fluctuation in service conditions. Microstructural study on thermomechanical fatigue of the actual eutectic Sn-Ag and Sn-4Ag-0.5Cu solder joints was performed to better understand deformation and damage accumulation occurring during service. Incorporation of reinforcements has been pursued to improve the mechanical and particularly thermomechanical behavior of solders, and their service temperature capability. In-situ Sn-Ag composite solders were developed by incorporating Cu 6Sn5, Ni3Sn4, and FeSn2 particulate reinforcements in the eutectic Sn-Ag solder in an effort to enhance thermomechanical fatigue resistance. In-situ composite solders were investigated on the growth of interfacial intermetallic layer between solder and Cu substrate growth and creep properties. Solder joints exhibited significant deformation and damage on free surface and interior regions during thermomechanical fatigue. Cracks initiated on the free surface of the solder joints and propagated toward interior regions near the substrate of the solder joint. Crack grew along Sn grain boundaries by grain boundary sliding. There was significant residual stress within the solder joint causing more damage. Presence of small amount of Cu

  11. High-temperature lead-free solder alternatives

    Nachiappan, Vivek Chidambaram; Hattel, Jesper Henri; Hald, John


    For lead-free solders in the high-temperature regime, unfortunately, a limited number of alloying systems are available. These are Bi based alloys, gold involving alloys and Zn–Al based alloys. Based on these systems, possible candidate alloys were designed to have a melting range between 270°C a...

  12. Thermomechanical fatigue damage evolution in SAC solder joints

    Matin, M. A.; Vellinga, W. P.; D Geers, M. G.


    Thermornechanical fatigue in lab-type Sn-Ag-Cu solder interconnections between two copper plates has been investigated under cyclic thermal loading within a number of temperature ranges. Fatigue mechanisms have been studied using optical and scanning electron microscopy. Among the various fatigue me

  13. Fundamentals of wetting and spreading with emphasis on soldering

    Yost, F.G.


    Soldering is often referred to as a mature technology whose fundamentals were established long ago. Yet a multitude of soldering problems persist, not the least of which are related to the wetting and spreading of solder. The Buff-Goodrich approach to thermodynamics of capillarity is utilized in a review of basic wetting principles. These thermodynamics allow a very compact formulation of capillary phenomena which is used to calculate various meniscus shapes and wetting forces. These shapes and forces lend themselves to experimental techniques, such as the sessile drop and the Wilhelmy plate, for measuring useful surface and interfacial energies. The familiar equations of Young, Wilhelmy, and Neumann are all derived with this approach. The force-energy duality of surface energy is discussed and the force method is developed and used to derive the Herring relations for anisotropic surfaces. The importance of contact angle hysteresis which results from surface roughness and chemical inhomogeneity is presented and Young's equation is modified to reflect these ever present effects. Finally, an analysis of wetting with simultaneous metallurigical reaction is given and used to discuss solder wetting phenomena. 60 refs., 13 figs.

  14. Horizon shells and BMS-like soldering transformations

    Blau, Matthias; O'Loughlin, Martin


    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  15. Thermomechanical fatigue damage evolution in SAC solder joints

    Matin, M. A.; Vellinga, W. P.; D Geers, M. G.


    Thermornechanical fatigue in lab-type Sn-Ag-Cu solder interconnections between two copper plates has been investigated under cyclic thermal loading within a number of temperature ranges. Fatigue mechanisms have been studied using optical and scanning electron microscopy. Among the various fatigue me

  16. Printed-Circuit-Board Soldering Training for Group IV Personnel.

    Hooprich, E. A.; Matlock, E. W.

    As part of a larger program to determine which Navy skills can be learned by lower aptitude personnel, and which methods and techniques would be most effective, an experimental course in printed circuit board soldering was given to 186 Group IV students in 13 classes. Two different training approaches--one stressing instructor guidance and the…

  17. Horizon shells and BMS-like soldering transformations

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)


    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  18. Recycling of lead solder dross, Generated from PCB manufacturing

    Lucheva, Biserka; Tsonev, Tsonio; Iliev, Peter


    The main purpose of this work is to analyze lead solder dross, a waste product from manufacturing of printed circuit boards by wave soldering, and to develop an effective and environmentally sound technology for its recycling. A methodology for determination of the content and chemical composition of the metal and oxide phases of the dross is developed. Two methods for recycling of lead solder dross were examined—carbothermal reduction and recycling using boron-containing substances. The influence of various factors on the metal yield was studied and the optimal parameters of the recycling process are defined. The comparison between them under the same parameters-temperature and retention time, showed that recycling of dross with a mixture of borax and boric acid in a 1:2 ratio provides higher metal yield (93%). The recycling of this hazardous waste under developed technology gets glassy slag and solder, which after correction of the chemical composition can be used again for production of PCB.

  19. Roles of interfacial reaction on mechanical properties of solder interfaces

    Liu, Pilin

    This study investigated roles of interfacial reaction in fracture and fatigue of solder interconnects. The interfacial reaction phases in the as-reflowed and after aging were examined by cross-sectional transmission electron microscopy (TEM) while interfacial mechanical properties were determined from a flexural peel fracture mechanics technique. Because of their widespread uses in microelectronic packaging, SnPb solder interfaces, and Bi-containing Pb-free solder interfaces were chosen as the subjects of this study. In the interfacial reaction study, we observed a complicated micro structural evolution during solid-state aging of electroless-Ni(P)/SnPb solder interconnects. In as-reflowed condition, the interfacial reaction produced Ni3Sn 4 and P-rich layers. Following overaging, the interfacial microstructure degenerated into a complex multilayer structure consisting of multiple layers of Ni-Sn compounds and transformed Ni-P phases. In SnPb solder interfacial system, fatigue study showed that the overaging of the high P electroless Ni-P/SnPb interconnects resulted in a sharp reduction in the fatigue resistance of the interface in the high crack growth rate regime. Fracture mechanism analysis indicated that the sharp drop in fatigue resistance was triggered by the brittle fracture of the Ni3Sn2 intermetallic phase developed at the overaged interface. The fatigue behavior was strongly dependent on P concentration in electroless Ni. Kirkendall voids were found in the interfacial region after aging, but they did not cause premature fracture of the solder interfaces. In Bi-containing solder interfacial system, we found that Bi segregated to the Cu-intermetallic interface during aging in SnBi/Cu interconnect. This caused serious embrittlement of Sn-Bi/Cu interface. Further aging induced numerous voids along the Cu3Sn/Cu interface. These interfacial voids were different from Kirkendall voids. Their formation was explained on basis of vacancy condensation at the


    Y.H.Tian; C.Q.Wang


    Interactions between 63Sn37Pb solder and PBGA metallization(Au/Ni/Cu)during laser and infrared reflow soldering were studied.During laser refow soldering process,a thin layer of AuSn4 was observed at the interface of the solder bumps,its morphology was strongly dependent on the laser reflow power and heating time.The solder bumps formed by the first laser reflow was refowed again to form the solder joints.The AuSn4 compounds formed in the first laser reflow process dissolved into the bulk solder after the secondary infrared reflow process.The needle-like AuSn4 changed into rodlike,and distributed inside the solder near the solder/pad interface.

  1. Silane based coating of aluminium mold


    having at least one closed cavity is provided, at least one surface of the at least one cavity being an aluminium surface coated with a silane based coating layer. The silane based anti-stiction coating improves the anti-stiction properties of the mold which may allow for molding and demolding...... of structures which would otherwise be difficult to mold. The resistance of the coated aluminium mold is significantly improved by applying a silane-based coating layer....

  2. A Combined Experimental and Computational Approach for the Design of Mold Topography that Leads to Desired Ingot Surface and Microstructure in Aluminum Casting.

    Dr. Zabaras, N.; Tan, L.


    A thermomechanical study of the effects of mold topography on the solidification of Aluminum alloys at early times is provided. The various coupling mechanisms between the solid-shell and mold deformation and heat transfer at the mold/solid-shell interface during the early stages of Aluminum solidification on molds with uneven topographies are investigated. The air-gap nucleation time, the stress evolution and the solid-shell growth pattern are examined for different mold topographies to illustrate the potential control of Aluminum cast surface morphologies during the early stages of solidification using proper design of mold topographies. The unstable shell growth pattern in the early solidification stages results mainly from the unevenness of the heat flux between the solid-shell and the mold surface. This heat flux is determined by the size of the air-gaps formed between the solidifying shell and mold surface or from the value of the contact pressure. Simulation results show that a sinusoidal mold surface with a smaller wavelength leads to nucleation of air-gaps at earlier times. In addition, the unevenness in the solid-shell growth pattern decreases faster for a smaller wavelength. Such studies can be used to tune mold surfaces for the control of cast surface morphologies.

  3. Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints

    Wang, Yan; Han, Jing; Ma, Limin; Zuo, Yong; Guo, Fu


    The composite approach, by incorporating small amounts of reinforcement particles in the solder matrix, has proven to be one of the effective ways to improve the reliability of solder joints. The effects of Cu addition on electromigration were investigated in this study by incorporating 2% volume fraction Cu particles into Sn-3.5Ag eutectic solder paste by the in situ process. The one-dimensional solder joints, designed to prevent the current crowding effect, were stressed under a constant current density of 104 A/cm2 at room temperature, and the temperature of the sample could reach 105 ± 5°C due to the Joule heating effect. Doping 2 vol.% Cu was found to retard the electromigration phenomenon effectively. After electric current stressing for 528 h, the growth rate of an interfacial intermetallic compound (IMC) layer at the anode decreased 73% in contrast to that of Sn-3.5Ag solder joints, and the IMC layer at the cathode was almost unchanged. The polarization effect of Cu reinforced composite solder joints was also apparently mitigated. In addition, the surface damage of the composite solder joints was relieved by incorporating 2 vol.% Cu particles. Compared to Sn-3.5Ag solder joints, which had protruded Cu6Sn5 and wrinkles of Sn-solder matrix on the surface, the solder joints with Cu addition had a more even surface.

  4. Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints

    Wang, Yan; Han, Jing; Ma, Limin; Zuo, Yong; Guo, Fu


    The composite approach, by incorporating small amounts of reinforcement particles in the solder matrix, has proven to be one of the effective ways to improve the reliability of solder joints. The effects of Cu addition on electromigration were investigated in this study by incorporating 2% volume fraction Cu particles into Sn-3.5Ag eutectic solder paste by the in situ process. The one-dimensional solder joints, designed to prevent the current crowding effect, were stressed under a constant current density of 104 A/cm2 at room temperature, and the temperature of the sample could reach 105 ± 5°C due to the Joule heating effect. Doping 2 vol.% Cu was found to retard the electromigration phenomenon effectively. After electric current stressing for 528 h, the growth rate of an interfacial intermetallic compound (IMC) layer at the anode decreased 73% in contrast to that of Sn-3.5Ag solder joints, and the IMC layer at the cathode was almost unchanged. The polarization effect of Cu reinforced composite solder joints was also apparently mitigated. In addition, the surface damage of the composite solder joints was relieved by incorporating 2 vol.% Cu particles. Compared to Sn-3.5Ag solder joints, which had protruded Cu6Sn5 and wrinkles of Sn-solder matrix on the surface, the solder joints with Cu addition had a more even surface.

  5. Surface microstructure replication in injection molding

    Theilade, Uffe Arlø; Hansen, Hans Nørgaard


    In recent years, polymer components with surface microstructures have been in rising demand for applications such as lab-on-a-chip and optical components. Injection molding has proven to be a feasible and efficient way to manufacture such components. In injection molding, the mold surface topogra...

  6. Injection Molding of Plastics from Agricultural Materials

    Bhattacharya, M.; Ruan, R.


    The objective of this research was to conduct a systematic study to relate injection molding parameters to properties of blends of starch and synthetic polymer. From this study, we wished to develop a thorough understanding of the injection molding process and gain significant insight into designing molds and aiding in developing products cheaply and efficiently.

  7. Planning an Injection Mold Design Training Program.

    Allyn, Edward P.

    With the increased use of plastics worldwide the shortage of trained personnel in moldmaking and design for plastic injection molds is becoming critical. Local schools and community colleges should provide courses in mold design and mold making, since most workers presently learn while working under experienced designers on the job. Following this…

  8. Is Mold the New Asbestos?

    Colgan, Craig


    Mold and indoor air quality (IAQ) are matters of major concern to architects and their educational clients. The Environmental Protection Agency's Indoor Air Quality Tools for Schools program offers help to districts seeking to tackle IAQ issues. Strengthening community relations is one way to be ready in case of a bad environmental or IAQ report.…

  9. Stochastic resin transfer molding process

    Park, M


    We consider one-dimensional and two-dimensional models of stochastic resin transfer molding process, which are formulated as random moving boundary problems. We study their properties, analytically in the one-dimensional case and numerically in the two-dimensional case. We show how variability of time to fill depends on correlation lengths and smoothness of a random permeability field.

  10. Is Mold the New Asbestos?

    Colgan, Craig


    Mold and indoor air quality (IAQ) are matters of major concern to architects and their educational clients. The Environmental Protection Agency's Indoor Air Quality Tools for Schools program offers help to districts seeking to tackle IAQ issues. Strengthening community relations is one way to be ready in case of a bad environmental or IAQ report.…

  11. Molded Concrete Center Mine Wall

    Lewis, E. V.


    Proposed semiautomatic system forms concrete-foam wall along middle of coal-mine passage. Wall helps support roof and divides passage into two conduits needed for ventilation of coal face. Mobile mold and concrete-foam generator form sections of wall in place.

  12. Hydrogen silsesquioxane mold coatings for improved replication of nanopatterns by injection molding

    Hobæk, Thor Christian; Matschuk, Maria; Kafka, Jan; Pranov, Henrik J.; Larsen, Niels Bent


    We demonstrate the replication of nanosized pillars in polymer (cyclic olefin copolymer) by injection molding using nanostructured thermally cured hydrogen silsesquioxane (HSQ) ceramic coatings on stainless steel mold inserts with mold nanostructures produced by a simple embossing process. At isothermal mold conditions, the average pillar height increases by up to 100% and a more uniform height distribution is observed compared to a traditional metal mold insert. Thermal heat transfer simulat...

  13. Solidification process and infrared image characteristics of permanent mold castings

    Viets, Roman; Breuer, Markus; Haferkamp, Heinz; Kruessel, Thomas; Niemeyer, Matthias


    Interdependence between the development of temperature gradients at the solid-liquid interface during solidification of metals and the formation of local defects demands for thermal investigation. In foundry practice thermocouples are used to control the die's overall cooling-rate, but fluctuations in product quality still occur. Capturing FIR- thermograms after opening the die visualizes the state, when most thermal throughput has already flattened the temperature gradients in the mold. Rapid dissipation of heat from liquid metal to the mold during solidification forces further approach of the process investigation by slowing down the heat flux or the use of transparent mold material. Aluminum gravity casting experiments under technical vacuum conditions lead to decelerated solidification by suppression of convection and image sequences containing explicit characteristics that could be assigned to local shrinkage of the casting. Hence relevant clusters are extracted and thermal profiles are drawn from image series, pointing out correlations between feeding performance from the sink heads and the appearance of local defects. Tracing thermal processes in vacuum casting can scarcely be transferred to image data in foundry practice, since only little analogies exist between atmospheric and vacuum casting. The diagnosis of the casting process requires detection of the still closed mold using a transparent silica- aerogel sheet as part of the die. Hereby thermograms of the initial heat input are recorded by adapting a NIR-camera in addition to the FIR-unit. Thus the entire thermal compensation at the joint face for each casting is visualized. This experimental set-up is used for image sequence analysis related to the intermediate casting phases of mold filling, body formation and solidification shrinkage.

  14. Precision injection molding of freeform optics

    Fang, Fengzhou; Zhang, Nan; Zhang, Xiaodong


    Precision injection molding is the most efficient mass production technology for manufacturing plastic optics. Applications of plastic optics in field of imaging, illumination, and concentration demonstrate a variety of complex surface forms, developing from conventional plano and spherical surfaces to aspheric and freeform surfaces. It requires high optical quality with high form accuracy and lower residual stresses, which challenges both optical tool inserts machining and precision injection molding process. The present paper reviews recent progress in mold tool machining and precision injection molding, with more emphasis on precision injection molding. The challenges and future development trend are also discussed.

  15. Implementation of Molding Constraints in Topology Optimization

    Marx, S.; Kristensen, Anders Schmidt


    In many cases the topology optimization method yield inadmissible solutions in respect to a particular manufacturing process, e.g. injection molding. In the present work it is chosen to focus on the most common injection molding parameters/factors determining the quality of the mold geometry, i.......e. uniform thickness, filling of the die and ejection of the molded item, i.e. extrusion. The mentioned injection mold parameters/factors are introduced in the topology optimization by defining a centerline of the initial domain and then penalize elements in respect to the distance to the defined centerline...

  16. Effects of particle size on the mechanical properties of particle-reinforced Sn-Ag composite solder joint


    Particulate size has significant influenced on the mechanical properties of particle-reinforced composite solder joints. In this current research, Cu or Ni reinforcement particles were mechanically added to the Sn-3.5Ag eutectic solder, and the effects of the particle size on the mechanical properties of particle-reinforced composite solder joint were systematically studied. This investigation touched on how mechanical properties of the solder joints are affected by particles size. A quantitative formula was set up to correlate the mechanical property of the solder joint with particle size in different processing conditions. Besides, the fracture mechanism of the composite solder joint was analyzed.

  17. The Mechanical Behavior of Sn-Ag4 Solder Joints Subjected to Thermal Cycling

    CHENGuohai; MAJusheng


    The method of mount strain gages is used to measure the stress/strain hysteresis loops of the solder joints under thermal cycling. The results show that different solders have different loops; the shape of the loops will change less, and finally become a line along with the thermal cycle increase. The shear module decreases along with the thermal cycling process. But the creep index of the solder joints is not sensitive to the cycling process,which fluctuates between 5 and 7. Because the elements of the solder and matrix materials diffuse during the process, the voids induced in the solder joints expand. The expansion of the voids will lead to the crystal lattice aberrance of solder crystal.

  18. Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows

    Li, Yan; Hatch, Olen; Liu, Pilin; Goyal, Deepak


    Solder joint interconnects in three-dimensional (3D) packages with package stacking configurations typically must undergo multiple reflow cycles during the assembly process. In this work, interfacial open joint failures between the bulk solder and the intermetallic compound (IMC) layer were found in Sn-Ag-Cu (SAC) solder joints connecting a small package to a large package after multiple reflow reliability tests. Systematic progressive 3D x-ray computed tomography experiments were performed on both incoming and assembled parts to reveal the initiation and evolution of the open failures in the same solder joints before and after the reliability tests. Characterization studies, including focused ion beam cross-sections, scanning electron microscopy, and energy-dispersive x-ray spectroscopy, were conducted to determine the correlation between IMC phase transformation and failure initiation in the solder joints. A comprehensive failure mechanism, along with solution paths for the solder joint interfacial failures after multiple reflow cycles, is discussed in detail.

  19. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A


    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  20. Silane based coating of aluminium mold


    comprising a chemically bonded monolayer of silane compounds on the at least one surface wherein the silane is a halogenated silane. The at least one surface coated with the anti-stiction coating may be configured to withstand an injection molding process at a pressure above 100 MPa. Furthermore, a mold......A method of preparing an aluminum mold for injection molding is provided, the method comprises the steps of providing an aluminum mold having a least one surface, subjecting the at least one surface to a gas or liquid phase silane to thereby form an anti-stiction coating, the anti-stiction coating...... having at least one closed cavity is provided, at least one surface of the at least one cavity being an aluminium surface coated with a silane based coating layer. The silane based anti-stiction coating improves the anti-stiction properties of the mold which may allow for molding and demolding...

  1. Reaction of Liquid Sn-Ag-Cu-Ce Solders with Solid Copper

    Chriaštel'Ová, J.; Rízeková Trnková, L.; Pocisková Dimová, K.; Ožvold, M.


    Small amounts of the rare-earth element Ce were added to the Sn-rich lead-free eutectic solders Sn-3.5Ag-0.7Cu, Sn-0.7Cu, and Sn-3.5Ag to improve their properties. The microstructures of the solders without Ce and with different amounts (0.1 wt.%, 0.2 wt.%, and 0.5 wt.%) of Ce were compared. The microstructure of the solders became finer with increasing Ce content. Deviation from this rule was observed for the Sn-Ag-Cu solder with 0.2 wt.% Ce, and for the Sn-0.7Cu eutectic alloy, which showed the finest microstructure without Ce. The melting temperatures of the solders were not affected. The morphology of intermetallic compounds (IMC) formed at the interface between the liquid solders and a Cu substrate at temperatures about 40°C above the melting point of the solder for dipping times from 2 s to 256 s was studied for the basic solder and for solder with 0.5 wt.% Ce addition. The morphology of the Cu6Sn5 IMC layer developed at the interface between the solders and the substrate exhibited the typical scallop-type shape without significant difference between solders with and without Ce for the shortest dipping time. Addition of Ce decreased the thickness of the Cu6Sn5 IMC layer only at the Cu/Sn-Ag-Cu solder interface for the 2-s dipping. A different morphology of the IMC layer was observed for the 256-s dipping time: The layers were less continuous and exhibited a broken relief. Massive scallops were not observed. For longer dipping times, Cu3Sn IMC layers located near the Cu substrate were also observed.


    Heinemann, D.; S. Knabner; Baumgarten, D.


    Printed Circuit Boards (PCB) play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. ...

  3. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti


    Presence of moisture in a printed circuit board (PCB) laminate, typically made of glass fibres reinforced epoxy polymer, significantly influences the electrical functionality in various ways and causes problems during soldering process. This paper investigates the water uptake of laminates coated...... with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  4. Numerical Analysis of Mold Deformation Including Plastic Melt Flow During Injection Molding

    Jung, Joon Tae; Lee, Bong-Kee [Chonnam National University, Gwangju (Korea, Republic of)


    In the present study, a numerical analysis of an injection molding process was conducted for predicting the mold deformation considering non-Newtonian flow, heat transfer, and structural behavior. The accurate prediction of mold deformation during the filling stage is important to successfully design and manufacture a precision injection mold. While the local mold deformation can be caused by various factors, a pressure induced by the polymer melt is considered to be one of the most significant ones. In this regard, the numerical simulation considering both the melt filling and the mold deformation was carried out. A mold core for a 2D axisymmetric center-gated disk was used for the demonstration of the present study. The flow behavior inside the mold cavity and temperature distribution were analyzed along with the core displacement. Also, a Taguchi method was employed to investigate the influence of the relevant parameters including flow velocity, mold core temperature, and melt temperature.

  5. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    and mechanical properties of these potential candidate alloys with respect to the currently used high-lead content solders is made. Finally, the paper presents the superior characteristics as well as some drawbacks of these proposed high-temperature lead-free solder alternatives....... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

  6. Research Progress in Solderable Black Pad of Electroless Nickel/Immersion Gold

    Liu Haiping; Li Ning; Bi Sifu; Li Deyu


    Electroless nickel/immersion gold (ENIG) technology is widely used as one of the surface final finish for electronics packaging substrate and printed circuit board (PCB), providing a protective, conductive and solderable surface. However, there is a solder joint interfacial brittle fracture (or solderability failure) of using the ENIG coating. The characteristics and the application of ENIG technology were narrated in this paper. The research progress on the solderability failure of ENIG was introduced. The mechanism of "black pad" and the possible measure of eliminating or alleviating the "black pad" were also introduced. The development direction and market prospects of ENIG were prospected.

  7. Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys

    Hidaka, N.; Watanabe, H.; Yoshiba, M.


    We developed a new lead-free solder alloy, an Sn-Ag-Cu base to which a small amount of Ni and Ge is added, to improve the mechanical properties of solder alloys. We examined creep deformation in bulk and through-hole (TH) form for two lead-free solder alloys, Sn-3.5Ag-0.5Cu-Ni-Ge and Sn-3.0Ag-0.5Cu, at elevated temperatures, finding that the creep rupture life of the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy was over three times better than that of the Sn-3.0Ag-0.5Cu solder at 398 K. Adding Ni to the solder appears to make microstructural development finer and more uniform. The Ni added to the solder readily combined with Cu to form stable intermetallic compounds of (Cu, Ni)6Sn5 capable of improving the creep behavior of solder alloys. Moreover, microstructural characterization based on transmission electron microscopy analyses observing creep behavior in detail showed that such particles in the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy prevent dislocation and movement.

  8. Joining of Bi-2212 high- Tc superconductors and metals using indium solders

    Oh, S. Y.; Kim, H. R.; Jeong, Y. H.; Hyun, O. B.; Kim, C. J.


    BSCCO tubes can be used as a base material for switching devices such as superconducting fault current limiters (SFCLs) that prevent an electrical problem from occurring in an electrical power system. To apply an BSCCO bulk tube to a switching device, the superconducting tube has to be joined with a metallic part to by the over current to the metal part when the FCL is quenched. In this study, joining between Cu-Ni alloy and BSCCO was accomplished by soldering using In-Sn and In-Bi solders. Additionally, an Sn-Ag-Cu/In-Bi solder was used for the soldering of a different kind. For a better joining of the BSCCO superconductor with the In-Bi solder, the surface of the BSCCO was pre-coated with Ag by electro-plating. From the experiments, an intermetallic compound (IMC) of AgxIny chain was observed to be mainly formed from In-Sn and In-Bi soldering process. In case of the soldering of a different kind, IMC of AgxIny and CuxSny was also developed. Finally, we confirmed that the properties of soldering were enhanced by Sn-Ag-Cu/In-Bi twice-soldering process.

  9. Joining of Bi-2212 high-T{sub c} superconductors and metals using indium solders

    Oh, S.Y. [Nuclear Nanomaterials Development Laboratory, Korea Atomic Energy Research Institute (KAERI), 150 Dukjin-dong, Yusong-gu, Daejeon 305-353 (Korea, Republic of); Kim, H.R.; Jeong, Y.H.; Hyun, O.B. [Superconductivity and Applications Group, Korea Electric Power Research Institute (KEPRI), Daejeon 305-380 (Korea, Republic of); Kim, C.J. [Nuclear Nanomaterials Development Laboratory, Korea Atomic Energy Research Institute (KAERI), 150 Dukjin-dong, Yusong-gu, Daejeon 305-353 (Korea, Republic of)], E-mail:


    BSCCO tubes can be used as a base material for switching devices such as superconducting fault current limiters (SFCLs) that prevent an electrical problem from occurring in an electrical power system. To apply an BSCCO bulk tube to a switching device, the superconducting tube has to be joined with a metallic part to by the over current to the metal part when the FCL is quenched. In this study, joining between Cu-Ni alloy and BSCCO was accomplished by soldering using In-Sn and In-Bi solders. Additionally, an Sn-Ag-Cu/In-Bi solder was used for the soldering of a different kind. For a better joining of the BSCCO superconductor with the In-Bi solder, the surface of the BSCCO was pre-coated with Ag by electro-plating. From the experiments, an intermetallic compound (IMC) of Ag{sub x}In{sub y} chain was observed to be mainly formed from In-Sn and In-Bi soldering process. In case of the soldering of a different kind, IMC of Ag{sub x}In{sub y} and Cu{sub x}Sn{sub y} was also developed. Finally, we confirmed that the properties of soldering were enhanced by Sn-Ag-Cu/In-Bi twice-soldering process.

  10. An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder



    An evaluation was performed which examined the aging of surface mount solder joints assembled with 91.84Sn-3.33Ag-4.83Bi solder. Defect analysis of the as-fabricated test vehicles revealed excellent solderability, good package alignment, and a minimum number of voids. Continuous DC electrical monitoring of the solder joints did not reveal opens during as many as 10,000 thermal cycles (0 C, 100 C). The solder joints exhibited no significant degradation through 2500 cycles, based upon an absence of microstructural damage and sustained shear and pull strengths of chip capacitors and J-leaded solder joints, respectively. Thermal cycles of 5000 and 10,000 resulted in some surface cracking of the solder fillets and coatings. In a few cases, deeper cracks were observed in the thinner reaches of several solder fillets. There was no deformation or cracking in the solder located in the gap between the package I/O and the circuit board pad nor in the interior of the fillets, both locations that would raise concerns of joint mechanical integrity. A drop in the chip capacitor shear strength was attributed to crack growth near the top of the fillet.

  11. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Saliza Azlina O.


    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  12. Compression molding of aerogel microspheres

    Pekala, Richard W. (Pleasant Hill, CA); Hrubesh, Lawrence W. (Pleasanton, CA)


    An aerogel composite material produced by compression molding of aerogel microspheres (powders) mixed together with a small percentage of polymer binder to form monolithic shapes in a cost-effective manner. The aerogel composites are formed by mixing aerogel microspheres with a polymer binder, placing the mixture in a mold and heating under pressure, which results in a composite with a density of 50-800 kg/m.sup.3 (0.05-0.80 g/cc). The thermal conductivity of the thus formed aerogel composite is below that of air, but higher than the thermal conductivity of monolithic aerogels. The resulting aerogel composites are attractive for applications such as thermal insulation since fabrication thereof does not require large and expensive processing equipment. In addition to thermal insulation, the aerogel composites may be utilized for filtration, ICF target, double layer capacitors, and capacitive deionization.

  13. Compression molding of aerogel microspheres

    Pekala, R.W.; Hrubesh, L.W.


    An aerogel composite material produced by compression molding of aerogel microspheres (powders) mixed together with a small percentage of polymer binder to form monolithic shapes in a cost-effective manner is disclosed. The aerogel composites are formed by mixing aerogel microspheres with a polymer binder, placing the mixture in a mold and heating under pressure, which results in a composite with a density of 50--800 kg/m{sup 3} (0.05--0.80 g/cc). The thermal conductivity of the thus formed aerogel composite is below that of air, but higher than the thermal conductivity of monolithic aerogels. The resulting aerogel composites are attractive for applications such as thermal insulation since fabrication thereof does not require large and expensive processing equipment. In addition to thermal insulation, the aerogel composites may be utilized for filtration, ICF target, double layer capacitors, and capacitive deionization. 4 figs.

  14. Nano Coated Lead Free Solders for Sustainable Electronic Waste Management

    K. Arun Vasantha Geethan

    Full Text Available ABSTRACT Lead has been used in a wide range of applications, but in the past decades it became clear that its high toxicity could cause various problems. Studies indicate that exposure to high concentrations of lead can cause harmful damages to humans. To eliminate the usage of lead in electronic products as an initiative towards electronic waste management (e waste, lead free solders were produced with suitable methods by replacing lead. But lead free solders are not preferred as a substitute of lead because they are poor in their mechanical properties such as tensile strength, shear strength and hardness which are ultimately required for a material to resist failure.Nano-Structured materials and coatings offer the potential for Vital improvements in engineering properties based on improvements in physical and mechanical properties resulting from reducing micro structural features by factors of 100 to 1000 times compared to current engineering materials.

  15. Onychomycosis due to opportunistic molds*

    Martínez-Herrera, Erick Obed; Arroyo-Camarena, Stefanie; Tejada-García, Diana Luz; Porras-López, Carlos Francisco; Arenas, Roberto


    BACKGROUND: Onychomycosis are caused by dermatophytes and Candida, but rarely by non- dermatophyte molds. These opportunistic agents are filamentous fungi found as soil and plant pathogens. OBJECTIVES: To determine the frequency of opportunistic molds in onychomycosis. METHODS: A retrospective analysis of 4,220 cases with onychomycosis, diagnosed in a 39-month period at the Institute of Dermatology and Skin surgery "Prof. Dr. Fernando A. Cordero C." in Guatemala City, and confirmed with a positive KOH test and culture. RESULTS: 32 cases (0.76%) of onychomycosis caused by opportunistic molds were confirmed. The most affected age group ranged from 41 to 65 years (15 patients, 46.9%) and females were more commonly affected (21 cases, 65.6%) than males. Lateral and distal subungual onychomycosis (OSD-L) was detected in 20 cases (62.5%). The microscopic examination with KOH showed filaments in 19 cases (59.4%), dermatophytoma in 9 cases (28.1%), spores in 2 cases (6.25%), and filaments and spores in 2 cases (6.25%). Etiologic agents: Aspergillus sp., 11 cases (34.4%); Scopulariopsis brevicaulis, 8 cases (25.0%); Cladosporium sp., 3 cases (9.4%); Acremonium sp., 2 cases (6.25%); Paecilomyces sp., 2 cases (6.25%); Tritirachium oryzae, 2 cases (6.25%); Fusarium sp., Phialophora sp., Rhizopus sp. and Alternaria alternate, 1 case (3.1%) each. CONCLUSIONS: We found onychomycosis by opportunistic molds in 0.76% of the cases and DLSO was present in 62.5%. The most frequent isolated etiological agents were: Aspergillus sp. and Scopulariopsis brevicaulis. PMID:26131862

  16. Sn-Zn系无铅钎料最新进展%Review on Latest Advances of Sn-Zn-X Solder Joints

    孙磊; 张亮


    Sn-Zn系钎料熔点与传统Sn-37Pb钎料十分接近,成本低廉,被研究者所推崇。由于Zn的存在导致Sn-Zn钎料润湿性差及抗氧化性不足,阻碍了该钎料的发展。添加合金元素和纳米颗粒是改善Sn-Zn钎料组织和性能行之有效的方法之一,为国内外研究者所推崇。结合国内外Sn-Zn系无铅钎料最新研究成果,探讨添加微量的合金元素In、Ni、Cr、Ga、Bi、Cu、Al、Ag、稀土元素及纳米颗粒对钎料润湿性、抗氧化性、力学性能、显微组织和界面组织的影响,同时简述有关钎剂对Sn-Zn的影响,并对Sn-Zn系钎料的发展趋势进行分析与展望。%Sn-Zn alloy, a nontoxic binary lead-free solder with melting temperature of 198˚C, closer to the eutectic temperature of Sn-Pb solder, has been identified as one of very few suitable candidates for lead-free solder replacement. Due to the high activity of Zn, the wettability and oxidation resistance of the Sn-Zn alloys are poor, which is a major obstacle to its application. The addition of alloying elements and nanoparticles is one of the effective ways to improve the performance of Sn-Zn solders. The work of Sn-Zn lead-free solders bearing In, Ni, Cr, Ga, Bi, Cu, Al, Ag, rare earth and nanoparticles were reviewed, and the effect of alloying elements and nanoparticles on the wettability, oxidation resistance, mechanical properties, microstructure and intermetallic compounds were analyzed. Meanwhile, the influence of flux of Sn-Zn was outlined and the prospect on Sn-Zn solders bearing alloying elements and nanoparties were analyzed and looked-ahead.

  17. Electromigration in Sn–Ag solder thin films under high current density

    Zhu, X. [School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, London SE10 9LS (United Kingdom); Kotadia, H. [Physics Department, School of Natural and Mathematical Sciences, King' s College London, Strand, London WC2R 2LS (United Kingdom); Xu, S. [Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kow-loon Tong, Hong Kong (China); Lu, H. [School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, London SE10 9LS (United Kingdom); Mannan, S.H. [Physics Department, School of Natural and Mathematical Sciences, King' s College London, Strand, London WC2R 2LS (United Kingdom); Bailey, C. [School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, London SE10 9LS (United Kingdom); Chan, Y.C. [Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kow-loon Tong, Hong Kong (China)


    The electro-migration behavior of a Sn–Ag solder thin film stripe that is deposited on a glass substrate has been investigated under a high current density in the absence ofthermo-migration. The distribution of voids and hillocks at current densities of 4.4–6.0 × 10{sup 4} A/cm{sup 2} has been analyzed optically and using electron microscopy. The voids mainly formed at the cathode side of the stripe where maximum current density was predicted but voids also formed along a line that crosses the stripe. This was explained in terms of the initial voids forming at locations of maximum current density concentration, altering these locations, and then expanding into them. The movement of the maximum current density location is caused by redistribution of current as the voids form. An atomic migration model has been developed and used in this work. It was found that if thermal gradients were completely neglected, the model was unable to account for the divergence of atomic flux density which is necessary for void nucleation. However, the temperature dependence of the diffusivity of atoms is sufficient to account for void nucleation within the timescale of the experiments. - Highlights: • Experimental and computational study of electron migration in a SnAg film • The calculated atomic flux divergence has been used to predict void formation. • Voids caused by electromigration observed at current crowding sites and in other regions.

  18. Ultrasonic Atomization of Low Ag Lead-free Solder and Properties of Solder Paste%低银焊料超声雾化制粉及焊膏性能研究

    倪广春; 陈旭; 周健


    The influences of Ag and Ni on wet ability and X on inoxidability of Sn-0.7Cu-0.1Ag low Ag lead-free solder were investigated. Differences of solder powders made by ultrasonic atomization and gas atomization process were also studied. Results show that the addition of Ag can improve the wetting force and reduce the wetting time. Wetting force did not change but the wetting time reduced slightly with the addition of Ni. Welding flux with high activity can both improve the wetting force and reduce the wetting time. The ability of oxidation resistance of solder alloys notably enhanced when the content of X increased to 0.003%. Compared with gas atomization process, less proportion of abnormity powders can be found in solder powders made by ultrasonic atomization process.%  在Sn-0.7Cu-0.1Ag低银焊料基础上进行微合金化,研究了Ag和Ni对钎料润湿性以及元素X对钎料润湿抗氧化性的影响,比较了超声波雾化法与气体雾化法制备焊锡粉的区别.结果表明:随着Ag含量增加,钎料合金的润湿力提高并且润湿时间减少.添加Ni元素,钎料润湿力并没有明显变化,润湿时间略有减小.高活性焊剂可以显著提高钎料润湿力,同时缩短润湿时间.在低银钎料中添加微量元素X,质量分数超过0.003%时,可以显著改善钎料抗氧化性能.采用超声波雾化法较气体雾化法制得的低银焊锡粉,异形粉比例明显下降.

  19. Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

    Yakymovych, A.; Plevachuk, Yu.; Švec, P.; Švec, P.; Janičkovič, D.; Šebo, P.; Beronská, N.; Roshanghias, A.; Ipser, H.


    To date, additions of different oxide nanoparticles is one of the most widespread procedures to improve the mechanical properties of metals and metal alloys. This research deals with the effect of minor ceramic nanoparticle additions (SiO2, TiO2 and ZrO2) on the microstructure and mechanical properties of Cu/solder/Cu joints. The reinforced Sn3.0Ag0.5Cu (SAC305) solder alloy with 0.5 wt.% and 1.0 wt.% of ceramic nanoparticles was prepared through mechanically stirring. The microstructure of as-solidified Cu/solder/Cu joints was studied using scanning electron microscopy. The additions of ceramic nanoparticles suppressed the growth of the intermetallic compound layer Cu6Sn5 at the interface solder/Cu and improved the microstructure of the joints. Furthermore, measurements of mechanical properties showed improved shear strength of Cu/composite solder/Cu joints compared to joints with unreinforced solder. This fact related to all investigated ceramic nanoinclusions and should be attributed to the adsorption of nanoparticles on the grain surface during solidification. However, this effect is less pronounced on increasing the nanoinclusion content from 0.5 wt.% to 1.0 wt.% due to agglomeration of nanoparticles. Moreover, a comparison analysis showed that the most beneficial influence was obtained by minor additions of SiO2 nanoparticles into the SAC305 solder alloy.

  20. A microstructural analysis of solder joints from the electronic assemblies of dismantled nuclear weapons

    Vianco, P.T.; Rejent, J.A. [Sandia National Labs., Albuquerque, NM (United States). Materials Joining Dept.


    MC1814 Interconnection Boxes from dismantled B57 bombs, and MC2839 firing Sets from retired W70-1 warheads were obtained from the Pantex facility. Printed circuit boards were selected from these components for microstructural analysis of their solder joints. The analysis included a qualitative examination of the solder joints and quantitative assessments of (1) the thickness of the intermetallic compound layer that formed between the solder and circuit board Cu features, and (2) the Pb-rich phase particle distribution within the solder joint microstructure. The MC2839 solder joints had very good workmanship qualities. The intermetallic compound layer stoichiometry was determined to be that of Cu6Sn5. The mean intermetallic compound layer thickness for all solder joints was 0.885 mm. The magnitude of these values did not indicate significant growth over the weapon lifetime. The size distribution of the Pb-rich phase particles for each of the joints were represented by the mean of 9.85 {times} 10{sup {minus}6} mm{sup 2}. Assuming a spherical geometry, the mean particle diameter would be 3.54 mm. The joint-to-joint difference of intermetallic compound layer thickness and Pb-rich particle size distribution was not caused by varying thermal environments, but rather, was a result of natural variations in the joint microstructure that probably existed at the time of manufacture. The microstructural evaluation of the through-hole solder joints form the MC2839 and MC1814 components indicated that the environmental conditions to which these electronic units were exposed in the stockpile, were benign regarding solder joint aging. There was an absence of thermal fatigue damage in MC2839 circuit board, through-hole solder joints. The damage to the eyelet solder joints of the MC1814 more likely represented infant mortality failures at or very near the time of manufacture, resulting from a marginal design status of this type of solder joint design.

  1. Gating of Permanent Molds for ALuminum Casting

    David Schwam; John F. Wallace; Tom Engle; Qingming Chang


    This report summarizes a two-year project, DE-FC07-01ID13983 that concerns the gating of aluminum castings in permanent molds. The main goal of the project is to improve the quality of aluminum castings produced in permanent molds. The approach taken was determine how the vertical type gating systems used for permanent mold castings can be designed to fill the mold cavity with a minimum of damage to the quality of the resulting casting. It is evident that somewhat different systems are preferred for different shapes and sizes of aluminum castings. The main problems caused by improper gating are entrained aluminum oxide films and entrapped gas. The project highlights the characteristic features of gating systems used in permanent mold aluminum foundries and recommends gating procedures designed to avoid common defects. The study also provides direct evidence on the filling pattern and heat flow behavior in permanent mold castings.

  2. Novel Approach for Modeling of Nonuniform Slag Layers and Air Gap in Continuous Casting Mold

    Wang, Xudong; Kong, Lingwei; Yao, Man; Zhang, Xiaobing


    Various kinds of surface defects on the continuous casting slab usually originate from nonuniform heat transfer and mechanical behavior, especially during the initial solidification inside the mold. In this article, a model-coupled inverse heat transfer problem incorporating the effect of slag layers and air gap is developed to study the nonuniform distribution of liquid slag, solid slag, and air gap layers. The model considers not only the formation and evolution of slag layers and air gap but also the temperatures in the mold copper as measured by thermocouples. The simulation results from the model and the measured temperatures from experiments are shown to be in good agreement with each other. At the casting speed of 0.65 m/min, the liquid slag film disappears and transforms into solid slag entirely at about 400 mm away from meniscus, and an air gap begins to form. Until the mold exit, the maximum thickness of the solid slag layer and air gap gradually increases to 1.34 and 0.056 mm, respectively. The results illustrate that the magnitude and nonuniform distribution of the slag layers and air gap along the cross direction, correlating with heat flux between the shell and mold, eventually determine the temperature profiles of the mold hot face and slab surface. The proposed model may provide a convenient approach for analyzing nonuniform heat transfer and mechanical behaviors between the mold and slab in the real casting process.

  3. Effect of Functional Nano Channel Structures Different Widths on Injection Molding and Compression Molding Replication Capabilities

    Calaon, M.; Tosello, G.; Garnaes, J.

    The present study investigates the capabilities of the two employed processes, injection molding (IM) and injection compression molding (ICM) on replicating different channel cross sections. Statistical design of experiment was adopted to optimize replication quality of produced polymer parts wit...

  4. Combined thermal, thermodynamic and kinetic modelling for the reliability of high-density lead-free solder interconnections

    Yu, Hao


    Continuous miniaturization of electronics devices as well as increasing complexity of soldering metallurgy introduce more and more challenges to the reliability of modern electronics products. Although loading condition plays an important role, the reliability of solder interconnections is ultimately controlled by microstructures' responses to loading. It is therefore of great importance to understand and control the microstructural evolutions of solder interconnections under different loadin...

  5. Porous media heat transfer for injection molding

    Beer, Neil Reginald


    The cooling of injection molded plastic is targeted. Coolant flows into a porous medium disposed within an injection molding component via a porous medium inlet. The porous medium is thermally coupled to a mold cavity configured to receive injected liquid plastic. The porous medium beneficially allows for an increased rate of heat transfer from the injected liquid plastic to the coolant and provides additional structural support over a hollow cooling well. When the temperature of the injected liquid plastic falls below a solidifying temperature threshold, the molded component is ejected and collected.

  6. Analysis of optical properties in injection-molded and compression-molded optical lenses.

    Wang, Chung Yen; Wang, Pei Jen


    Numerical mold-flow simulations and experimental measurements for injection-molded lenses have been investigated in form accuracy on a two-cavity mold with various process conditions. First, form profiles of the molded lenses have been measured together with the corresponding simulated mold-temperature distribution and displacement distribution of the lens in the z direction. A flow-through type layout of cooling channels has been devised for balance of mold-temperature distribution in mold cavities with various parametric distances for assessments in uniformity of temperature distribution. Finally, a compression-molding process is proposed for the post-process of birefringence relaxation as well as adequate form accuracy of lenses. In conclusion, optimization of process parameters to achieve good form accuracy in a multicavity mold with symmetric geometry but nonuniform cooling conditions is difficult. A good design of cooling channels plus optimized process conditions could provide uniform mold-temperature distribution so that molded lenses of good quality would be possible. Then, the profile deviation of lenses could be further compensated by profile geometry corrections. In conclusion, the post-compression-molding process could make birefringence-free plastic lenses with good form accuracy.

  7. A two-dimensional simulation model for the molded underfill process in flip chip packaging

    Guo, Xue Ru; Young, Wen Bin [National Cheng Kung University, Tainan (China)


    The flip chip process involves the deposition of solder bumps on the chip surface and their subsequent direct attachment and connection to a substrate. Underfilling traditional flip chip packaging is typically performed following a two-step approach. The first step uses capillary force to fill the gap between the chip and the substrate, and the second step uses epoxy molding compound (EMC) to overmold the package. Unlike traditional flip chip packaging, the molded underfill (MUF) concept uses a single-step approach to simultaneously achieve both underfill and overmold. MUF is a simpler and faster process. In this study, a 2D numerical model is developed to simulate the front movement of EMC flow and the void formation for different geometric parameters. The 2D model simplifies the procedures of geometric modeling and reduces the modeling time for the MUF simulation. Experiments are conducted to verify the prediction results of the model. The effect on void formation for different geometric parameters is investigated using a 2D model.

  8. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

    Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu


    Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

  9. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    Sorg, Brian S.; Welch, Ashley J.


    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  10. Active soft solder deposition by magnetron-sputter-ion-plating (MSIP)-PVD-process

    Lugscheider, E.; Bobzin, K.; Erdle, A


    In different technical areas micro electro mechanical systems (M.E.M.S.), e.g. micro pumps, micro sensors, actuators and micro dosage systems are in use today. The components of these M.E.M.S. consist of various materials, which have to be joined. To join materials like ceramics, plastics or metals to a hybrid M.E.M.S., established joining technologies have to be adjusted. For the assembling and mounting of temperature sensible micro components, a low temperature joining process, e.g. transient liquid phase (TLP) bonding or an active soft soldering process can be performed. In this article the deposition of a low melting active soft solder by magnetron-sputter (MS)-PVD deposition with an active substrate cooling will be presented. The substrate temperatures were set and controlled by an additional cooling unit, which was integrated into the sputtering facility. In the performed experiments a substrate temperature range from -40 to +20 deg. C was investigated. The effects of these different substrate temperatures to the microstructure and the soldering suitability of the solder system were investigated by scanning electron microscopy (SEM), nanoindentation and soldering tests. The chemical composition of the deposited solder systems was examined by glow discharge optical spectroscopy (GDOS)-analysis. As a suitable substrate temperature range for deposition -10 to -20 deg. C was detected. Solder systems deposited in this temperature range showed good solder abilities.

  11. Dural reconstruction by fascia using a temperature-controlled CO2 laser soldering system

    Forer, Boaz; Vasilyev, Tamar; Brosh, Tamar; Kariv, Naam; Gil, Ziv; Fliss, Dan M.; Katzir, Abraham


    Conventional methods for dura repair are normally based on sutures or stitches. These methods have several disadvantages: (1) The dura is often brittle, and the standard procedures are difficult and time consuming. (2) The seal is leaky. (3) The introduction of a foreign body (e.g. sutures) may cause an inflammatory response. In order to overcome these difficulties we used a temperature controlled fiber optic based CO2 laser soldering system. In a set of in vitro experiments we generated a hole of diameter 10 mm in the dura of a pig corpse, covered the hole with a segment of fascia, and soldered the fascia to the edges of the hole, using 47% bovine albumin as a solder. The soldering was carried out spot by spot, and each spot was heated to 65° C for 3-6 seconds. The soldered dura was removed and the burst pressure of the soldered patch was measured. The average value for microscopic muscular side soldering was 194 mm Hg. This is much higher than the maximal physiological pressure of the CSF fluid in the brain, which is 15 mm Hg. In a set of in vivo experiments, fascia patches were soldered on holes in five farm pigs. The long term results of these experiments were very promising. In conclusion, we have developed an advanced technique for dural reconstruction, which will find important clinical applications.

  12. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S


    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

  13. Development of lead-free solders for high-temperature applications

    Chidambaram, Vivek

    -temperature applications. Unfortunately, even the substitute technologies that are currently being developed cannot address several critical issues of high-temperature soldering. Therefore, further research and development of high-temperature lead-free soldering is obviously needed. It is hoped that this thesis can serve...... as a valuable source of information to those interested in environmentally conscious electronic packaging....

  14. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.


    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  15. Development of a solder bump technique for contacting a three-dimensional multi electrode array

    Frieswijk, T.A.; Frieswijk, T.A.; Bielen, J.A.; Bielen, J.A.; Rutten, Wim; Bergveld, Piet


    The application of a solder bump technique for contacting a three-dimensional multi electrode array is presented. Solder bumping (or C4: Controlled Collapse Chip Connections, also called Flip Chip contacting) is the most suitable contacting technique available for small dimensions and large numbers

  16. The automated system for technological process of spacecraft's waveguide paths soldering

    Tynchenko, V. S.; Murygin, A. V.; Emilova, O. A.; Bocharov, A. N.; Laptenok, V. D.


    The paper solves the problem of automated process control of space vehicles waveguide paths soldering by means of induction heating. The peculiarities of the induction soldering process are analyzed and necessity of information-control system automation is identified. The developed automated system makes the control of the product heating process, by varying the power supplied to the inductor, on the basis of information about the soldering zone temperature, and stabilizing the temperature in a narrow range above the melting point of the solder but below the melting point of the waveguide. This allows the soldering process automating to improve the quality of the waveguides and eliminate burn-troughs. The article shows a block diagram of a software system consisting of five modules, and describes the main algorithm of its work. Also there is a description of the waveguide paths automated soldering system operation, for explaining the basic functions and limitations of the system. The developed software allows setting of the measurement equipment, setting and changing parameters of the soldering process, as well as view graphs of temperatures recorded by the system. There is shown the results of experimental studies that prove high quality of soldering process control and the system applicability to the tasks of automation.

  17. Mechanical properties of FeCo magnetic particles-based Sn-Ag-Cu solder composites

    Xu, Siyang; Prasitthipayong, Anya; Pickel, Andrea D.; Habib, Ashfaque H.; McHenry, Michael E.


    We demonstrate magnetic nanoparticles (MNPs) in enabling lead-free solder reflow in RF fields and improved mechanical properties that impact solder joint reliability. Here, we report on Sn-Ag-Cu (SAC) alloys. SAC solder-FeCo MNP composites with 0, 1, 2, 3, and 4 wt. % FeCo MNP and the use of AC magnetic fields to achieve localized reflow. Electron microscopy of the as-reflowed samples show a decrease in the volume of Sn dendrite regions as well as smaller and more homogeneously dispersed Ag3Sn intermetallic compounds (IMCs) with increasing MNP concentrations. Mechanical properties of the composites were measured by nanoindentation. In pure solder samples and solder composites with 4 wt. % MNP, hardness values increased from 0.18 GPa to 0.20 GPa and the modulus increased from 39.22 GPa to 71.22 GPa. The stress exponent, reflecting creep resistance, increased from 12.85 of pure solder to 16.47 for solder composites with 4 wt. % MNP. Enhanced mechanical properties as compared with the as-prepared solder joints are explained in terms of grain boundary and dispersion strengthening resulting from the microstructural refinement.

  18. Intermetallic compound layer growth kinetics in non-lead bearing solders

    Vianco, P.T.; Kilgo, A.C.; Grant, R.


    The introduction of alternative, non-lead bearing solders into electronic assemblies requires a thorough investigation of product manufacturability and reliability. Both of these attributes can be impacted by the excessive growth of intermetallic compound (IMC) layers at the solder/substrate interface. An extensive study has documented the stoichiometry and solid state growth kinetics of IMC layers formed between copper and the lead-free solders: 96.5Sn-3.5Ag (wt.%), 95Sn-5Sb, 100Sn, and 58Bi-42Sn. Aging temperatures were 70--205 C for the Sn-based solders and 55--120 C for the Bi-rich solder. Time periods were 1--400 days for all of the alloys. The Sn/Cu, Sn-Ag/Cu, and Sn-Sb/Cu IMC layers exhibited sub-layers of Cu{sub 6}Sn{sub 5} and Cu{sub 3}Sn; the latter composition was present only following prolonged aging times or higher temperatures. The total layer growth exhibited a time exponent of n = 0.5 at low temperatures and a value of n = 0.42 at higher temperatures in each of the solder/Cu systems. Similar growth kinetics were observed with the low temperature 58Bi-42Sn solder; however, a considerably more complex sub-layer structure was observed. The kinetic data will be discussed with respect to predicting IMC layer growth based upon solder composition.

  19. Generation of Tin(II) Oxide Crystals on Lead-Free Solder Joints in Deionized Water

    Chang, Hong; Chen, Hongtao; Li, Mingyu; Wang, Ling; Fu, Yonggao


    The effect of the anode and cathode on the electrochemical corrosion behavior of lead-free Sn-Ag-Cu and Sn-Ag-Cu-Bi solder joints in deionized water was investigated. Corrosion studies indicate that SnO crystals were generated on the surfaces of all lead-free solder joints. The constituents of the lead-free solder alloys, such as Ag, Cu, and Bi, did not affect the corrosion reaction significantly. In contrast to lead-free solders, PbO x was formed on the surface of the traditional 63Sn-37Pb solder joint in deionized water. A cathode, such as Au or Cu, was necessary for the electrochemical corrosion reaction of solders to occur. The corrosion reaction rate decreased with reduction of the cathode area. The formation mechanism of SnO crystals was essentially a galvanic cell reaction. The anodic reaction of Sn in the lead-free solder joints occurred through solvation by water molecules to form hydrated cations. In the cathodic reaction, oxygen dissolved in the deionized water captures electrons and is deoxidized to hydroxyl at the Au or Cu cathode. By diffusion, the anodic reaction product Sn2+ and the cathodic reaction product OH- meet to form Sn(OH)2, some of which can dehydrate to form more stable SnO· xH2O crystals on the surface of the solder joints. In addition, thermodynamic analysis confirms that the Sn corrosion reaction could occur spontaneously.

  20. Assessment of circuit board surface finishes for electronic assembly with lead-free solders

    Ray, U.; Artaki, I.; Finley, D.W.; Wenger, G.M. [Bell Labs., Princeton, NJ (United States). Lucent Technologies; Pan, T.; Blair, H.D.; Nicholson, J.M. [Ford Motor Co., Dearborn, MI (United States); Vianco, P.T. [Sandia National Labs., Albuquerque, NM (United States)


    The suitability of various metallic printed wiring board surface finishes was assessed for new technology applications that incorporate assembly with Lead-free solders. The manufacture of a lead-free product necessitates elimination of lead (Pb) from the solder, the circuit board as well as the component lead termination. It is critical however for the selected interconnect Pb-free solder and the corresponding printed wiring board (PWB) and component lead finishes to be mutually compatible. Baseline compatibility of select Pb-free solders with Pb containing PWB surface finish and components was assessed. This was followed by examining the compatibility of the commercially available CASTIN{trademark} (SnAgCuSb) Pb-free solder with a series of PWB metallic finishes: Ni/Au, Ni/Pd, and Pd/Cu. The compatibility was assessed with respect to assembly performance, solder joint integrity and long term attachment reliability. Solder joint integrity and mechanical behavior of representative 50 mil pitch 20I/O SOICs was determined before and after thermal stress. Mechanical pull test studies demonstrated that the strength of SnAgCuSb solder interconnections is notably greater than that of SnPb interconnections.

  1. Complex of automated equipment and technologies for waveguides soldering using induction heating

    Murygin, A. V.; Tynchenko, V. S.; Laptenok, V. D.; Emilova, O. A.; Bocharov, A. N.


    The article deals with the problem of designing complex automated equipment for soldering waveguides based on induction heating technology. A theoretical analysis of the problem, allowing to form a model of the «inductor-waveguide» system and to carry out studies to determine the form of inducing wire, creating a narrow and concentrated heat zone in the area of the solder joint. Also solves the problem of the choice of the temperature control means, the information from which is used later to generate the effective management of induction soldering process. Designed hardware complex in conjunction with the developed software system is a system of automatic control, allowing to manage the process of induction heating, to prevent overheating and destruction of the soldered products, improve the stability of induction soldering process, to improve the quality of products, thereby reducing time and material costs for the production.

  2. Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective

    Zeng, Kejun; Pierce, Mike; Miyazaki, Hiroshi; Holdford, Becky


    To obtain the desired performance of Pb-free packages in mechanical tests, while the solder composition should be carefully selected, the influence of metals dissolved from the soldering pad or under bump metallization (UBM) should also be taken into account. Dissolved metals such as Cu can alter the intermetallic compound (IMC) formation, not only at the local interface but also on the other side of the joint. The high rate of interfacial cracking of Sn-Ag-Cu solder joints on Ni/Au-plated pads is attributed to the high stiffness of the solder and the dual IMC structure of (Cu,Ni)6Sn5 on Ni3Sn4 at the interface. Approaches to avoid this dual IMC structure at the interface are discussed. A rule for selecting the solder alloy composition and the pad surface materials on both sides of the joints is proposed for ball grid array (BGA) packages.

  3. Tensile properties and thermal shock reliability of Sn-Ag-Cu solder joint with indium addition.

    Yu, A-Mi; Jang, Jae-Won; Lee, Jong-Hyun; Kim, Jun-Ki; Kim, Mok-Soon


    The thermal shock reliability and tensile properties of a newly developed quaternary Sn-1.2Ag-0.5Cu-0.4In (wt%) solder alloy were investigated and compared to those of ternary Sn-Ag-Cu based Pb-free solder alloys. It was revealed that the Sn-1.2Ag-0.5Cu-0.4In solder alloy shows better thermal shock reliability compared to the Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu solder alloys. The quaternary alloy has higher strength than Sn-1.0Ag-0.5Cu alloy, and higher elongation than Sn-3.0Ag-0.5Cu alloy. It was also revealed that the addition of indium promotes the formation of Ag3(Sn, In) phase in the solder joint during reflow process.

  4. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Fan Yang


    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  5. Minimization of sink mark defects in injection molding process ...

    Minimization of sink mark defects in injection molding process – Taguchi approach. ... plays a very important role in controlling the quality of the injection molded products. ... of injection molding variables on sink marks using Taguchi approach.

  6. Mold

    ... all, may produce toxins or poisonous substances called mycotoxins that may cause effects in humans. Although there are many types of mycotoxins, aflatoxins are probably the best known and most ...

  7. Study on Sn-Zn Solder Used in Cu-Al Soldering%用于铜铝焊接的锡锌焊料研究

    倪广春; 张浩; 韩敏


    Lead-free electronic products led the development of lead-free solder technology. Taking cost factors into account, some copper material has been replaced by aluminum material. When ordinary Sn-Cu and Sn-Ag-Cu solder are used in soldering of Cu-Al, there is the electrochemical corrosion problems. So Sn-Zn solder is used for Cu-Al soldering. However, the joints of Sn-Zn solder are brittle and easy to crack. Focus on problems in Cu-Al soldering joint of electrical and electronic devices, put forward Sn-Zn-X alloy soldering materials, did a large number of experiments, and achieved good results.%电子产品无铅化的推广带动了无铅焊料技术的发展,考虑到成本因素,部分铜材已被铝材取代。普通的锡铜系和锡银铜系焊料在铜铝焊接时,存在电化学腐蚀问题,因此多用锡锌焊料进行焊接。但锡锌焊料的焊点脆,存在易开裂的问题。针对电工电子器件铜铝焊接点存在的问题,提出了Sn一Zn一X多元合金焊接材料,并做了大量实验,取得很好的效果。

  8. Physical properties of lead free solders in liquid and solid state

    Mhiaoui, Souad


    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  9. Mechanical Properties of Injection Molded and Compression Molded Samples from Nature-Butadiene Rubber

    Skrobak Adam


    Full Text Available The aim of this paper is to show what extent there is an impact on the mechanical properties (tensile strength and tear strength of a standardized testing sample made of rubber compound based on nature rubber and butadiene rubber produced by injection molding in comparison with a sample produced by classic preparation (cutting out a compression molded plate according to the standard ISO 23529. For realization of this study it was necessary to design and produce an injection mold for all types testing samples. Subsequently, mechanical properties such as the tensile stress-strain and tear strenght of compression molded samples and injection molded samples were studied, compared and discussed.

  10. Nonlinear Modeling of a High Precision Servo Injection Molding Machine Including Novel Molding Approach

    何雪松; 王旭永; 冯正进; 章志新; 杨钦廉


    A nonlinear mathematical model of the injection molding process for electrohydraulic servo injection molding machine (IMM) is developed.It was found necessary to consider the characteristics of asymmetric cylinder for electrohydraulic servo IMM.The model is based on the dynamics of the machine including servo valve,asymmetric cylinder and screw,and the non-Newtonian flow behavior of polymer melt in injection molding is also considered.The performance of the model was evaluated based on novel approach of molding - injection and compress molding,and the results of simulation and experimental data demonstrate the effectiveness of the model.

  11. Mold Remediation in Schools and Commercial Buildings.

    Environmental Protection Agency, Washington, DC. Office of Radiation and Indoor Air.

    This document describes how to investigate and evaluate moisture and mold problems in educational facilities, and presents the key steps for implementing a remediation plan. A checklist is provided for conducting mold remediation efforts along with a resource list of helpful organizations and governmental agencies. Appendices contain a glossary,…

  12. Nanostructuring steel for injection molding tools

    Al-Azawi, A.; Smistrup, Kristian; Kristensen, Anders


    and ion beam etching are combined to nanostructure the planar surface of a steel wafer. Injection molded plastic parts with enhanced surface properties, like anti-reflective, superhydrophobic and structural colors can be achieved by micro-and nanostructuring the surface of the steel molds. We investigate...

  13. The use of IR thermography to show the mold and part temperature evolution in injection molding

    Bula, Karol; Różański, Leszek; Marciniak-Podsadna, Lidia; Wróbel, Dawid


    This study concerns the application of infrared camera for injection molding analysis by measuring temperatures of both injection molded parts and injection mold cavities in a function of injection cycles. The mold with two cavities, differing in thickness (1 and 3 mm), and a cold direct runner was used. Isotactic polypropylene homopolymer was utilized to produce parts. Mold temperature was set at 22°C and controlled by a water chiller. Five measuring points were determined: SP1, SP2 (placed in the 3 mm cavity), SP3, SP4 (located in the 1 mm cavity) and SP5 around an injection molding gate. Our investigations showed that the highest temperature is localized around SP2 point and the lowest at SP4. Also, it was proved that even after 62 injection molding cycles, temperatures of cavities were not stable, revealing their further increase with each cycle.

  14. The use of IR thermography to show the mold and part temperature evolution in injection molding

    Bula Karol


    Full Text Available This study concerns the application of infrared camera for injection molding analysis by measuring temperatures of both injection molded parts and injection mold cavities in a function of injection cycles. The mold with two cavities, differing in thickness (1 and 3 mm, and a cold direct runner was used. Isotactic polypropylene homopolymer was utilized to produce parts. Mold temperature was set at 22°C and controlled by a water chiller. Five measuring points were determined: SP1, SP2 (placed in the 3 mm cavity, SP3, SP4 (located in the 1 mm cavity and SP5 around an injection molding gate. Our investigations showed that the highest temperature is localized around SP2 point and the lowest at SP4. Also, it was proved that even after 62 injection molding cycles, temperatures of cavities were not stable, revealing their further increase with each cycle.

  15. Immune Response among Patients Exposed to Molds

    Jordan N. Fink


    Full Text Available Macrocyclic trichothecenes, mycotoxins produced by Stachybotrys chartarum, have been implicated in adverse reactions in individuals exposed to mold-contaminated environments. Cellular and humoral immune responses and the presence of trichothecenes were evaluated in patients with mold-related health complaints. Patients underwent history, physical examination, skin prick/puncture tests with mold extracts, immunological evaluations and their sera were analyzed for trichothecenes. T-cell proliferation, macrocyclic trichothecenes, and mold specific IgG and IgA levels were not significantly different than controls; however 70% of the patients had positive skin tests to molds. Thus, IgE mediated or other non-immune mechanisms could be the cause of their symptoms.

  16. IC chip stress during plastic package molding

    Palmer, D.W.; Benson, D.A.; Peterson, D.W.; Sweet, J.N.


    Approximately 95% of the world`s integrated chips are packaged using a hot, high pressure transfer molding process. The stress created by the flow of silica powder loaded epoxy can displace the fine bonding wires and can even distort the metalization patterns under the protective chip passivation layer. In this study the authors developed a technique to measure the mechanical stress over the surface of an integrated circuit during the molding process. A CMOS test chip with 25 diffused resistor stress sensors was applied to a commercial lead frame. Both compression and shear stresses were measured at all 25 locations on the surface of the chip every 50 milliseconds during molding. These measurements have a fine time and stress resolution which should allow comparison with computer simulation of the molding process, thus allowing optimization of both the manufacturing process and mold geometry.

  17. Effect of Mold Coating Materials and Thickness on Heat Transfer in Permanent Mold Casting of Aluminum Alloys

    Hamasaiid, A.; Dargusch, M. S.; Davidson, C. J.; Tovar, S.; Loulou, T.; Rezaï-Aria, F.; Dour, G.


    In permanent mold casting or gravity die casting (GDC) of aluminum alloys, die coating at the casting-mold interface is the most important single factor controlling heat transfer and, hence, it has the greatest influence on the solidification rate and development of microstructure. This investigation studies the influence of coating thickness, coating composition, and alloy composition on the heat transfer at the casting-mold interface. Both graphite and TiO2-based coatings have been investigated. Two aluminum alloys have been investigated: Al-7Si-0.3Mg and Al-9Si-3Cu. Thermal histories throughout the die wall have been recorded by fine type-K thermocouples. From these measurements, die surface temperatures and heat flux density have been evaluated using an inverse method. Casting surface temperature was measured by infrared pyrometry, and the interfacial heat-transfer coefficient (HTC) has been determined using these combined pieces of information. While the alloy is liquid, the coating material has only a weak influence over heat flow and the thermal contact resistance seems to be governed more by coating porosity and thickness. The HTC decreases as the coating thickness increases. However, as solidification takes place and the HTC decreases, the HTC of graphite coating remains higher than that of ceramic coatings of similar thickness. After the formation of an air gap at the interface, the effect of coating material vanishes. The peak values of HTC and the heat flux density are larger for Al-7Si-0.3Mg than for Al-9Si-3Cu. Consequently, the apparent solidification time of Al-9Si-3Cu is larger than that of Al-7Si-0.3Mg and it increases with coating thickness.

  18. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    Kostandyan, Erik; Sørensen, John Dalsgaard


    on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  19. Pb-free Sn-Ag-Cu ternary eutectic solder

    Anderson, I.E.; Yost, F.G.; Smith, J.F.; Miller, C.M.; Terpstra, R.L.


    A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217 C and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid ``mushy`` zone) relative to the eutectic melting temperature (e.g. up to 15 C above the eutectic melting temperature). 5 figs.

  20. Comparing suppository mold variability which can lead to dosage errors for suppositories prepared with the same or different molds.

    Alexander, Kenneth S; Baki, Gabriella; Hart, Christine; Hejduk, Courtney; Chillas, Stephanie


    Suppository molds must be properly calibrated to ensure accurate dosing. There are often slight differences between molds and even in the cavities within a mold. A method is presented for the calibration of standard aluminum 6-, 12-, 50-, or 100-well suppository molds. Ten different molds were tested using water for volume calibration, and cocoa butter for standardization involving establishing the density factor. This method is shown to be straightforward and appropriate for calibrating suppository molds.

  1. Medical diagnostics for indoor mold exposure.

    Hurraß, Julia; Heinzow, Birger; Aurbach, Ute; Bergmann, Karl-Christian; Bufe, Albrecht; Buzina, Walter; Cornely, Oliver A; Engelhart, Steffen; Fischer, Guido; Gabrio, Thomas; Heinz, Werner; Herr, Caroline E W; Kleine-Tebbe, Jörg; Klimek, Ludger; Köberle, Martin; Lichtnecker, Herbert; Lob-Corzilius, Thomas; Merget, Rolf; Mülleneisen, Norbert; Nowak, Dennis; Rabe, Uta; Raulf, Monika; Seidl, Hans Peter; Steiß, Jens-Oliver; Szewszyk, Regine; Thomas, Peter; Valtanen, Kerttu; Wiesmüller, Gerhard A


    In April 2016, the German Society of Hygiene, Environmental Medicine and Preventative Medicine (Gesellschaft für Hygiene, Umweltmedizin und Präventivmedizin (GHUP)) together with other scientific medical societies, German and Austrian medical societies, physician unions and experts has provided an AWMF (Association of the Scientific Medical Societies) guideline 'Medical diagnostics for indoor mold exposure'. This guideline shall help physicians to advise and treat patients exposed indoors to mold. Indoor mold growth is a potential health risk, even without a quantitative and/or causal association between the occurrence of individual mold species and health effects. Apart from the allergic bronchopulmonary aspergillosis (ABPA) and the mycoses caused by mold, there is only sufficient evidence for the following associations between moisture/mold damages and different health effects: Allergic respiratory diseases, asthma (manifestation, progression, exacerbation), allergic rhinitis, exogenous allergic alveolitis and respiratory tract infections/bronchitis. In comparison to other environmental allergens, the sensitizing potential of molds is estimated to be low. Recent studies show a prevalence of sensitization of 3-10% in the total population of Europe. The evidence for associations to mucous membrane irritation and atopic eczema (manifestation, progression, exacerbation) is classified as limited or suspected. Inadequate or insufficient evidence for an association is given for COPD, acute idiopathic pulmonary hemorrhage in children, rheumatism/arthritis, sarcoidosis, and cancer. The risk of infections from indoor molds is low for healthy individuals. Only molds that are capable to form toxins can cause intoxications. The environmental and growth conditions and especially the substrate determine whether toxin formation occurs, but indoor air concentrations are always very low. In the case of indoor moisture/mold damages, everyone can be affected by odor effects and

  2. Effect of firing conditions on thick film microstructure and solder joint strength for low-temperature, co-fired ceramic substrates

    Hernandez, C.L.; Vianco, P.T.; Rejent, J.A.


    Low-temperature, co-fired ceramics (LTCC) are the substrate material-of-choice for a growing number of multi-chip module (MCM) applications. Unlike the longer-standing hybrid microcircuit technology based upon alumina substrates, the manufacturability and reliability of thick film solder joints on LTCC substrates have not been widely studied. An investigation was undertaken to fully characterize solder joints on these substrates. A surface mount test vehicle with Daisy chain electrical connections was designed and built with Dupont{trademark} 951 tape. The Dupont{trademark} 4569 thick film ink (Au76-Pt21-Pd3 wt.%) was used to establish the surface conductor pattern. The conductor pattern was fired onto the LTCC substrate in a matrix of processing conditions that included: (1) double versus triple prints, (2) dielectric window versus no window, and (3) three firing temperatures (800 C, 875 C and 950 C). Sn63-Pb37 solder paste with an RMA flux was screen printed onto the circuit boards. The appropriate packages, which included five sizes of chip capacitors and four sizes of leadless ceramic chip carriers, were placed on the circuit boards. The test vehicles were oven reflowed under a N{sub 2} atmosphere. Nonsoldered pads were removed from the test vehicles and the porosity of their thick film layers was measured using quantitative image analysis in both the transverse and short transverse directions. A significant dependence on firing temperature was recorded for porosity. The double printed substrates without a dielectric window revealed a thick film porosity of 31.2% at 800 C, 26.2% at 875 C and 20.4% at 950 C. In contrast, the thick film porosity of the triple printed substrates with a dielectric window is 24.1% at 800 C, 23.2% at 875 C and 17.6% at 950 C. These observations were compared with the shear strength of the as-fabricated chip capacitor solder joints to determine the effect of firing conditions on solder joint integrity. The denser films from the higher

  3. Detection of micro solder balls using active thermography and probabilistic neural network

    He, Zhenzhi; Wei, Li; Shao, Minghui; Lu, Xingning


    Micro solder ball/bump has been widely used in electronic packaging. It has been challenging to inspect these structures as the solder balls/bumps are often embedded between the component and substrates, especially in flip-chip packaging. In this paper, a detection method for micro solder ball/bump based on the active thermography and the probabilistic neural network is investigated. A VH680 infrared imager is used to capture the thermal image of the test vehicle, SFA10 packages. The temperature curves are processed using moving average technique to remove the peak noise. And the principal component analysis (PCA) is adopted to reconstruct the thermal images. The missed solder balls can be recognized explicitly in the second principal component image. Probabilistic neural network (PNN) is then established to identify the defective bump intelligently. The hot spots corresponding to the solder balls are segmented from the PCA reconstructed image, and statistic parameters are calculated. To characterize the thermal properties of solder bump quantitatively, three representative features are selected and used as the input vector in PNN clustering. The results show that the actual outputs and the expected outputs are consistent in identification of the missed solder balls, and all the bumps were recognized accurately, which demonstrates the viability of the PNN in effective defect inspection in high-density microelectronic packaging.

  4. Enhanced laser tissue soldering using indocyanine green chromophore and gold nanoshells combination.

    Khosroshahi, Mohammad E; Nourbakhsh, Mohammad S


    Gold nanoshells (GNs) are new materials that have an optical response dictated by the plasmon resonance. The wavelength at which the resonance occurs depends on the core and shell sizes. The purposes of this study were to use the combination of indocyanine green (ICG) and different concentration of gold nanoshells for skin tissue soldering and also to examine the effect of laser soldering parameters on the properties of repaired skin. Two mixtures of albumin solder and different combinations of ICG and gold nanoshells were prepared. A full thickness incision of 2 × 20 mm(2) was made on the surface and after addition of mixtures it was irradiated by an 810 nm diode laser at different power densities. The changes of tensile strength (σ(t)) due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. The results showed at constant laser power density (I), σ(t) of repaired incisions increases by increasing the concentration of gold nanoshells in solder, Ns, and decreasing Vs. It was demonstrated that laser soldering using combination of ICG + GNs could be practical provided the optothermal properties of the tissue are carefully optimized. Also, the tensile strength of soldered skin is higher than skins that soldered with only ICG or GNs. In our case, this corresponds to σ(t) = 1800 g cm(-2) at I ∼ 47 Wcm(-2), T ∼ 85 [ordinal indicator, masculine]C, Ns = 10, and Vs = 0.3 mms(-1).

  5. A microstructural study of creep and thermal fatigue deformation in 60Sn-40Pb solder joints

    Tribula, D.


    Thermal fatigue failures of solder joints in electronic devices often arise from cyclic shear strains imposed by the mismatched thermal expansion coefficients of the materials that bind the joint as temperature changes are encountered. Increased solder joint reliability demands a fundamental understanding of the metallurigical mechanisms that control the fatigue to design accurate accelerated probative tests and new, more fatigue resistant solder alloys. The high temperatures and slow strain rates that pertain to thermal fatigue imply that creep is an important deformation mode in the thermal fatigue cycle. In this work, the creep behaviour of a solder joint is studied to determine the solder's microstructural response to this type of deformation and to relate this to the more complex problem of thermal fatigue. It is shown that creep failures arise from the inherent inhomogeneity and instability of the solder microstructure and suggest that small compositional changes of the binary near-eutectic Pn-Sn alloy may defeat the observed failure mechanisms. This work presents creep and thermal fatigue data for several near-eutectic Pb-Sn solder compositions and concludes that a 58Sn-40Pb-2In and a 58Sn-40Pb-2Cd alloy show significantly enhanced fatigue resistance over that of the simple binary material. 80 refs., 33 figs., 1 tab.

  6. Evaluation of Scattered Wave and Stress Concentration Field in a Damaged Solder Joint

    Dineva, P.; Gross, D.; Rangelov, T.


    Two different, but equally important problems for solder joint reliability are solved. The evaluation of the dynamic stress concentration field in the thin base layer of a damaged solder joint is the first one. It is considered as a rectangular plate with a central macro-crack surrounded with randomly distributed micro-cracks, subjected to uniform time-harmonic tension. The damaged solder joint state is described by the model of Gross and Zhang [1] (International Journal of Solids and Structures29, 1763-1779). The information of the stress concentration field in a damaged solder joint is important to understand the mechanisms in the base components of all electronic packages.The second problem is ultrasonic wave scattering in a solder joint damaged by micro-cracks, considered as a two-dimensional finite multi-layered system. The solution of this problem may aid the creation of the modern non-destructive evaluation method (NDEM) for a high quality control of products in electronic industry.The method of the solution of both boundary-value problems is a direct BIEM (boundary integral equation method). The numerical results obtained for a solder joint with real geometry and physical properties show how the acoustic and stress concentration fields depend on the solder joint damage state. The character of this dependence is discussed.

  7. Thermoplastic blow molding of metals

    Jan Schroers


    Full Text Available While plastics have revolutionized industrial design due to their versatile processability, their relatively low strength has hampered their use in structural components. On the other hand, while metals are the basis for strong structural components, the geometries into which they can be processed are rather limited. The “ideal” material would offer a desirable combination of superior structural properties and the ability to be precision (net shaped into complex geometries. Here we show that bulk metallic glasses (BMGs, which have superior mechanical properties, can be blow molded like plastics. The key to the enhanced processability of BMG formers is their amenability to thermoplastic forming. This allows complex BMG structures, some of which cannot be produced using any other metal process, to be net shaped precisely.

  8. Challenges in mold manufacturing for high precision molded diffractive optical elements

    Pongs, Guido; Bresseler, Bernd; Schweizer, Klaus; Bergs, Thomas


    Isothermal precision glass molding of imaging optics is the key technology for mass production of precise optical elements. Especially for numerous consumer applications (e.g. digital cameras, smart phones, …), high precision glass molding is applied for the manufacturing of aspherical lenses. The usage of diffractive optical elements (DOEs) can help to further reduce the number of lenses in the optical systems which will lead to a reduced weight of hand-held optical devices. But today the application of molded glass DOEs is limited due to the technological challenges in structuring the mold surfaces. Depending on the application submicrometer structures are required on the mold surface. Furthermore these structures have to be replicated very precisely to the glass lens surface. Especially the micro structuring of hard and brittle mold materials such as Tungsten Carbide is very difficult and not established. Thus a multitude of innovative approaches using diffractive optical elements cannot be realized. Aixtooling has investigated in different mold materials and different suitable machining technologies for the micro- and sub-micrometer structuring of mold surfaces. The focus of the work lays on ultra-precision grinding to generate the diffractive pattern on the mold surfaces. This paper presents the latest achievements in diffractive structuring of Tungsten Carbide mold surfaces by ultra-precision grinding.

  9. Study on Effects of Mold Temperature on the Injection Molded Article

    Han J.-H.


    Full Text Available This is a study of the effects of temperature of injection mold on the injection molded article. By supplying water of the proper temperature in the cooling line of mold in the cooling process, the mold was the appropriate temperature, and the deformation of the injection molded article was examined according to the mold temperature. In this study, we conducted simulation analysis and experiments, and the results were analyzed. The minimum deformation of the injection molded article model obtained by supplying 50°C water in the cooling line is 0.003 mm, and the maximum deformation was 0.813 mm. Injection molded article models obtained by supplying 20°C water were found to be a minimum of 0.002 mm, with deformation of up to 0.761 mm. When comparing both conditions, the error rate of injection molded article obtained by supplying 20°C water in the mold cooling line was lower by about 0.18%.

  10. Characterization of fiberglass-filled diallyl phthalate plastic molding resins and molded parts

    Whitaker, R.B.; Glaub, J.E.; Bonekowski, N.R.; Gillham, P.D.


    Characterization of diallyl phthalate (DAP) molding resins was undertaken by differential scanning calorimetry (DSC) and by combined size exclusion chromatography (SEC)/low angle laser light scattering (LALLS) in order to better predict moldability and storage life limits. Completeness of cure of molded parts, before and after any post-curing, was also determined by thermal analysis. Molecular weights and molecular weight distributions of the DAP molding resins by SEC/LALLS indicated that the better molding resins have lower M/sub w//M/sub n/ ratios. Association effects were observed, which could not be overcome by solvent modification alone. Determination of DAP molding resin heats of reaction by DSC indicated a linear relation between R/ and weight percent filler for the good molding resins. DSC analyses of molded DAP parts showed that 95% cure was achieved in some as-molded parts, with a post-cure temperature of 165/sup 0/C being required to complete the cure to 100%. Thickness of the parts was a factor, with the thicker parts being 100% cured as molded. The glass transition temperature (T/sub g/) of the molded parts increased as cure was completed, to approx. 160 to 165/sup 0/C maximum. These results are consistent with a model of thermoset resin curing behavior which states that 100% cure can be achieved only if a post-curing operation is conducted above the T/sub g infinity/ (T/sub g/ at complete cure) of the polymer.

  11. Heat Flux Through Slag Film and Its Crystallization Behavior

    TANG Ping; XU Chu-shao; WEN Guang-hua; ZHAO Yan-hong; QI Xin


    An experimental apparatus for simulating copper mold is used to quantify the heat flux through the slag film and to obtain a solid slag for further determining its crystallization behavior.The result indicates that both the chemical composition of the mold powder and the cooling rate have an important influence on the heat flux through the slag film.With increasing the binary hasicity,the heat flux of slag film decreases at first,reaches the minimum at the basicity of 1.4,and then increases,indicating that the maximum binary basicity is about 1.4 for selecting"mild cooling"mold powder.The heat transfer through the slag film can be specified in terms of the crystalline ratio and the thickness of the slag film.Reerystallization of the solid slag occurs and must be considered as an important factor that may influence the heat transfer through the solid slag layer.

  12. Wettability Studies of Pb-Free Soldering Materials

    Moser, Z.; Gąsior, W.; Pstruś, J.; Dębski, A.


    For Pb-free soldering materials, two main substitutes are currently being considered, consisting of Sn-Ag and Sn-Ag-Cu eutectics, both with melting points higher than that of the Sn-Pb eutectic. Therefore, both will require higher soldering temperatures for industrial applications. Also, both eutectics have a higher surface tension than the Sn-Pb eutectic, requiring wettability studies on adding Bi, Sb, and In to the eutectics to decrease the melting points and surface tension. The experimental results for the surface tension were compared with thermodynamic modeling by Butler’s method and were used to create the SURDAT database, which also includes densities for pure metals, binary, ternary, quaternary, and quinary alloys. To model the surface tension, excess Gibbs energies of the molten components were taken from the ADAMIS database. For the case of the Ag-Sn system, enthalpies of formation of Ag3Sn from solution calorimetry were used for checking optimized thermodynamic parameters. In the study of Sn-Ag-Cu-Bi-Sb liquid alloys, the range of possible Bi compositions for practical applications has been used to formulate a generalized metric of wettability, which was checked by measurements of the influence of In on the Sn-Ag-Cu system.

  13. Effect of contact metallization on electromigration reliability of Pb-free solder joints

    Ding, Min; Wang, Guotao; Chao, Brook; Ho, Paul S.; Su, Peng; Uehling, Trent


    The effect of underbump metallization (UBM) on electromigration (EM) lifetime and failure mechanism has been investigated for Pb-free solder bumps of 97Sn3Ag composition in the temperature range of 110-155 °C. The EM lifetime of the SnAg Pb-free solders with either Cu or Ni UBM was found to be better than the eutectic SnPb (63Sn37Pb) solders but worse than high-Pb (95Pb5Sn) solders. In the test temperature range, the EM lifetimes were found to be comparable for Cu and Ni UBMs but with different activation energies: 0.64-0.72 eV for Cu UBM and 1.03-1.11 eV for Ni UBM. EM failure was observed only in solder bumps with electron current flow from UBM to the substrate. Failure analysis revealed that EM damage was initiated by the formation of intermetallic compounds (IMC) at the UBM/solder interface which was found to be significantly enhanced by mass transport driven by the electron current. Under EM, the continued growth of IMC with the dissolution of the UBM and the accumulation of Kirkendall voids resulted in the formation of interfacial cracks and eventual EM failure of the solder bump. For Ni UBM, the IMC formation was dominated by the Ni3Sn4 phase while for Cu UBM, a bilayer of Cu3Sn/Cu6Sn5 was found. Void formation at the Cu6Sn5/solder interface was found to be important in controlling the EM lifetime of the Cu UBM solder.

  14. Transferencia de calor en la colada continua de aceros. I parte. El molde

    Cicutti, C.


    Full Text Available The continuous casting mold plays the important role of receiving the liquid steel and allowing an uniform and defect free solidified skin to be developed. In this work, the different heat transfer mechanisms which are present from the liquid steel to the mold cooling water are reviewed. The effect of operating variables on heat extraction and the relationship between global and distributed heat flux are also analyzed.

    El molde de colada continua cumple la importante función de recibir el acero líquido y permitir que se desarrolle una capa solidificada uniforme y libre de defectos. En este trabajo se revisan los distintos mecanismos implicados en el proceso de transferencia de calor, desde el acero líquido hasta el agua de refrigeración del molde. Se analiza también el efecto de las distintas variables de funcionamiento en la extracción calórica producida y la relación entre el flujo global de calor y su distribución a lo largo del molde.

  15. An apparatus for in situ x-ray scattering measurements during polymer injection molding.

    Rendon, Stanley; Fang, Jun; Burghardt, Wesley R; Bubeck, Robert A


    We report a novel instrument for synchrotron-based in situ x-ray scattering measurements during injection molding processing. It allows direct, real-time monitoring of molecular-scale structural evolution in polymer materials undergoing a complex processing operation. The instrument is based on a laboratory-scale injection molding machine, and employs customized mold tools designed to allow x-ray access during mold filling and subsequent solidification, while providing sufficient robustness to withstand high injection pressures. The use of high energy, high flux synchrotron radiation, and a fast detector allows sufficiently rapid data acquisition to resolve time-dependent orientation dynamics in this transient process. Simultaneous monitoring of temperature and pressure signals allows transient scattering data to be referenced to various stages of the injection molding cycle. Representative data on a commercial liquid crystalline polymer, Vectra(R) B950, are presented to demonstrate the features of this apparatus; however, it may find application in a wide range of polymeric materials such as nanocomposites, semicrystalline polymers and fiber-reinforced thermoplastics.

  16. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe


    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique. PMID:26473871

  17. Life Prediction of Ball Grid Array Soldered Joints under Thermal Cycling Loading by Fracture Mechanics Method


    Fatigue crack propagation life of ball grid array (BGA) soldered joints during thermal cycling loading was investigated by fracture mechanics approach using finite element analysis. The relationships between the strain energy release rate (G) and crack size (α), thermal cycle numbers (N) can be derived. Based on the relationships, fatigue life of the soldered joints was determined. The results showed that crack propagation life was higher than crack initiation life. Therefore, it appears that it is more appropriate to predict the fatigue life of soldered joints using the fracture mechanics method.

  18. Research on defects inspection of solder balls based on eddy current pulsed thermography.

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe


    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  19. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Xiuyun Zhou


    Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  20. Effect of constraint on crack propagation behavior in BGA soldered joints

    王莉; 王国忠; 方洪渊; 钱乙余


    The effects of stress triaxiality on crack propagation behavior in the BGA soldered joint were analyzed using FEM method. The computation results verified that stress triaxiality factor has an important effect on crack growth behavior. Crack growth rate increased with increasing stress triaxiality at the near-tip region, which is caused by increasing crack lengths or decreasing solder joint heights. Solder joint deformation is subjected to constraint effect provided by its surrounding rigid ceramic substrate, the constraint can be scaled by stress triaxiality near crack tip region. Therefore, it can be concluded that crack growth rate increased when the constraint effect increases.

  1. Observations of microstructural coarsening in micro flip-chip solder joints

    Barney, Monica M.; Morris, J. W.


    Coarsening of solder microstructures dramatically affects fatigue lifetimes. This paper presents a study of microstructural evolution due to thermal cycling and aging of small solder joints. The lead-tin solder joints in this study have a height of 55 5 m and a tin content of 65 70 wt.%, with a degenerate eutectic microstructure. The joint microstructure coarsens more rapidly during aging at 160°C than cycling from 0 160°C. No coarsened bands are observed. The cycling data scales with standard coarsening equations, while the aging data fits to an enhanced trend. The joints experiencing 2.8% strain during cycling fail by 1000 cycles.

  2. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B


    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  3. A cause of the non-solderability of ceramic capacitor terminations

    Cozzolino, M. J.; Kumar, A.; Ewell, G. J.


    The results of an analysis into the cause of the non-solderability of multiple defective part lots from two capacitor manufacturers are described. This analysis consisted of visual, scanning electron microscopic, surface, and metalographic examinations and analyses. The results indicated that non-solderability results from areas of excess porosity in the termination which are caused by segregation of ink constituents during manufacturing. This segregation can be minimized by proper monitoring and control of process variables; where excess porosity does occur, solderability can be improved by proper precleaning of parts.

  4. Influencing Factors for the Microstructure and Mechanical Properties of Micro Porous Titanium Manufactured by Metal Injection Molding

    Zhen Lu


    Full Text Available Porous titanium is a new structural and functional material. It is widely used in many fields since it integrates the properties of biomaterials with those of metallic foam. A new technology that combines both the preparation and forming of porous materials has been proposed in this paper. Moreover, a new solder was developed that could be employed in the joining of porous materials. Influencing factors for microstructure and mechanical properties of the parent material and joint interface are identified. Metal injection molding (MIM technology was used for fabricating porous materials. The feedstock for injection molding of porous titanium powders was prepared from titanium powders and a polymer-based binder system. In addition, the proportion of powder loading and binders was optimized. Through MIM technology, a porous titanium filter cartridge was prepared. For the purpose of investigating the thermal debinding technology of the filter cartridge, effects of the sintering temperature on the porosity, morphology of micropores and mechanical properties were analyzed. It could be found that when the sintering temperature increased, the relative density, bending and compression strength of the components also increased. Moreover, the porosity reached 32.28% when the sintering temperature was 1000 °C. The microstructure morphology indicated that micropores connected with each other. Meanwhile, the strength of the components was relatively high, i.e., the bending and compression strength was 65 and 60 MPa, respectively. By investigating the joining technology of porous filter cartridges, the ideal components of the solder and pressure were determined. Further research revealed that the micropore structure of the joint interface is the same as that of the parent material, and that the bending strength of the joint interface is 40 MPa.

  5. Cooling simulation of plastic injection molding


    Analyses the cooling of mold and plastic part during injectionmolding and the continued cooling of plastic part after being ejected from mold using the heat transfer theory and Boundary Element Method (BEM) to predict the temperature distribution in both mold and plastic part,and presents the experiments carried out with plates of ABS (Acrylonitrile-Butadiene-Styrene) to verify the validity of the cooling analysis software used to simulate the temperature distribution in ABS plate parts, and concludes that the analysis software agree qualitatively well with actual experimental findings.

  6. Evaluation of stability for monolayer injection molding tools coating

    Cech, Jiri; Taboryski, Rafael J.


    We tested and characterized molecular coating of Aluminium and Nickel prototype molds and mold inserts for polymer replication via injection molding (IM). X-Ray photoelectron spectroscopy (XPS) data, sessile drop contact angles with multiple fluids, surface energy and roughness data have been...... and especially suitable for rapid prototyping and mold geometry testing....

  7. Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

    Koo, Ja-Myeong


    Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafter OSP). During bonding, continuous AuIn2, Ni3(Sn,In)4 and Cu6(Sn,In)5 intermetallic compound (IMC) layers were formed at the solder/E-NG, solder/ENIG and solder/OSP interface, respectively. The interfacial reactions between the solder and I-Ag substrate during bonding resulted in the formation of Cu6(Sn,In)5 and Cu(Sn,In)2 IMCs with a minor Ag element. The In-48Sn/I-Ag solder joint showed the best shear properties among the four solder joints after bonding, whereas the solder/ENIG solder joint exhibited the weakest mechanical integrity.

  8. Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

    Lai, Yi-Shao; Chiu, Ying-Ta; Chen, Jiunn


    The Cu pillar is a thick underbump metallurgy (UBM) structure developed to alleviate current crowding in a flip-chip solder joint under operating conditions. We present in this work an examination of the electromigration reliability and morphologies of Cu pillar flip-chip solder joints formed by joining Ti/Cu/Ni UBM with largely elongated ˜62 μm Cu onto Cu substrate pad metallization using the Sn-3Ag-0.5Cu solder alloy. Three test conditions that controlled average current densities in solder joints and ambient temperatures were considered: 10 kA/cm2 at 150°C, 10 kA/cm2 at 160°C, and 15 kA/cm2 at 125°C. Electromigration reliability of this particular solder joint turns out to be greatly enhanced compared to a conventional solder joint with a thin-film-stack UBM. Cross-sectional examinations of solder joints upon failure indicate that cracks formed in (Cu,Ni)6Sn5 or Cu6Sn5 intermetallic compounds (IMCs) near the cathode side of the solder joint. Moreover, the ~52- μm-thick Sn-Ag-Cu solder after long-term current stressing has turned into a combination of ~80% Cu-Ni-Sn IMC and ~20% Sn-rich phases, which appeared in the form of large aggregates that in general were distributed on the cathode side of the solder joint.

  9. Materials compatibility and aging for flux and cleaner combinations

    Archuleta, Kim M. [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States); Piatt, Rochelle [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)


    A materials study of high reliability electronics cleaning is presented here. In Phase 1, mixed type substrates underwent a condensed contaminants application to view a worst- case scenario for unremoved flux with cleaning agent residue for parts in a silicone oil filled environment. In Phase 2, fluxes applied to copper coupons and to printed wiring boards underwent gentle cleaning then accelerated aging in air at 65% humidity and 30 O C. Both sets were aged for 4 weeks. Contaminants were no-clean (ORL0), water soluble (ORH1 liquid and ORH0 paste), and rosin (RMA; ROL0) fluxes. Defluxing agents were water, solvents, and engineered aqueous defluxers. In the first phase, coupons had flux applied and heated, then were placed in vials of oil with a small amount of cleaning agent and additional coupons. In the second phase, pairs of copper coupons and PWB were hand soldered by application of each flux, using tin-lead solder in a strip across the coupon or a set of test components on the PWB. One of each pair was cleaned in each cleaning agent, the first with a typical clean, and the second with a brief clean. Ionic contamination residue was measured before accelerated aging. After aging, substrates were removed and a visual record of coupon damage made, from which a subjective rank was applied for comparison between the various flux and defluxer combinations; more corrosion equated to higher rank. The ORH1 water soluble flux resulted in the highest ranking in both phases, the RMA flux the least. For the first phase, in which flux and defluxer remained on coupons, the aqueous defluxers led to worse corrosion. The vapor phase cleaning agents resulted in the highest ranking in the second phase, in which there was no physical cleaning. Further study of cleaning and rinsing parameters will be required.

  10. Mechanical Properties of Injection Molded and Compression Molded Samples from Nature-Butadiene Rubber

    Skrobak Adam; Janoštík Václav; Stanek Michal; Manas David; Ovsik Martin; Senkerik Vojtech; Reznicek Martin


    The aim of this paper is to show what extent there is an impact on the mechanical properties (tensile strength and tear strength) of a standardized testing sample made of rubber compound based on nature rubber and butadiene rubber produced by injection molding in comparison with a sample produced by classic preparation (cutting out a compression molded plate) according to the standard ISO 23529. For realization of this study it was necessary to design and produce an injection mold for all typ...

  11. Solving depressions formed during production of plastic molding

    J. Dobránsky


    Full Text Available This article deals with improvement of design properties of molded plastic parts. It can be achieved by modifying construction of metal injection mold and optimization of parameters in injection process. The subject of our examination was depressions formed on molded plastic parts which are inacceptable in the process of approval. The problem which has arisen was solved in two phases. The first phase consisted in alteration of injection mold design – enlargement of injection molding gate. In the second phase, we have changed the location of injection molding gate. After performing constructional modifications, new molded plastic parts were manufactured and assessed.

  12. Assessment of mold concentrations in Singapore shopping centers using mold-specific quantitative PCR (MSQPCR) analysis.

    Yap, Jennifer; Toh, Zhen Ann; Goh, Vivien; Ng, Lee Chen; Vesper, Stephen


    Molds can pose a human health threat and may amplify in buildings in humid climates. The objective of this study was to evaluate the mold growth in Singapore shopping centers based on the collection of 40 dust samples from 15 shopping centers, including one with a history of water damage. The dust was analyzed by a DNA-based technology called mold-specific quantitative PCR (MSQPCR). In a water-damaged shopping center, most of the 26 water-damage indicator species were detected at some concentration and many were much more abundant than the average in the shopping centers. MSQPCR is a useful method for quantifying indoor molds in tropical climates.

  13. A new insight into foaming mechanisms in injection molding via a novel visualization mold

    V. Shaayegan


    Full Text Available The complex mechanisms of bubble nucleation and dynamics in foam injection molding have not been uncovered despite many previous efforts due to the non-steady stop-and-flow nature of injection molding and the non-uniform temperature and pressure distributions in the mold. To this end, a new visualization mold was designed and manufactured for the direct observation of bubble nucleation and growth/collapse in foam injection molding. A reflective prism was incorporated into the stationary part of the injection mold with which the nucleation and growth behaviors of bubbles were successfully observed. The mechanisms of bubble nucleation in low- and high-pressure foam injection molding, with and without the application of gas-counter pressure, was investigated. We identified how the inherently non-uniform cell structure is developed in low-pressure foam injection molding with gate-nucleated bubbles, and when and how cell nucleation occurs in high-pressure foam injection molding with a more uniform pressure drop.

  14. The effect of mold surface topography on plastic parat in-process shrinkage in injection molding

    Arlø, Uffe Rolf; Hansen, Hans Nørgaard; Kjær, Erik Michael


    An experimental study of the effect of mold surface roughness on in-process in-flow linear part shrinkage in injection molding has been carried out. The investigation is based on an experimental two-cavity tool, where the cavities have different surface topographies, but are otherwise identical....... The study has been carried out for typical commercial polystyrene and polypropylene grades. The relationship between mold surface topography and linear shrinkage has been investigated with an experimental two-cavity mold producing simple rectangular parts with the nominal dimensions 1 x 25 x 50 mm (see...

  15. Molds on Food: Are They Dangerous?

    ... food was stored. Check nearby items the moldy food might have touched. Mold spreads quickly in fruits and vegetables. See the attached chart "Moldy Food: When to Use, When to Discard." FOOD HANDLING ...

  16. Injection molded optical backplane for broadcast architecture

    Rosenberg, Paul; Mathai, Sagi; Sorin, Wayne V.; McLaren, Moray; Straznicky, Joseph; Panotopoulos, Georgios; Warren, David; Morris, Terry; Tan, Michael R. T.


    A low cost, blind mate, injection molded optical backplane is presented. The optical backplane is comprised of 12 channel optical broadcast buses, operating at 10Gbps/channel with six blindmate optical output ports spaced 1U apart.

  17. Three-Dimensional Pneumatic Molding of Veneers

    Milan Gaff


    Full Text Available The goal of this paper is to introduce a new testing method suitable for the evaluation of the three-dimensional (3-D moldability of veneers and to use this method to test the impact of specific factors on the 3-D pneumatic molding process. The tested factors included veneer moisture content, wood species, shape of test piece, and fixing method on the maximum wood deflection. Veneers were molded using compressed air on equipment designed by our group for the sole purpose of this experiment. The results indicated that the monitored factors had an effect on deflection during the 3-D molding process. The results of this investigation extend the state-of-the-art knowledge regarding this technology and indicate the possibility of utilizing this innovative testing method for 3-D molded veneers.

  18. Secondary metabolites of slime molds (myxomycetes).

    Dembitsky, Valery M; Rezanka, Tomás; Spízek, Jaroslav; Hanus, Lumír O


    The compounds reported from the slime molds (myxomycetes) species are described. Almost 100 natural compounds including their chemical structures and biological activities are described in this review article. Only metabolites with a well-defined structure are included.

  19. Rozen : steeds meer bekend over Black Mold

    Smits, A.P.; Kohrman, E.


    Onderzoek naar Black Mold heeft al veel informatie opgeleverd over de verspreiding, bestrijding en ontwikkeling van de oculatieschimmel. In dit artikel de nieuwste resultaten van PPO en Cultus Agro Advies

  20. Facts about Stachybotrys chartarum and Other Molds

    ... Organization issued additional guidance, the WHO Guidelines for Indoor Air Quality: Dampness and Mould [PDF - 2.52 MB] . Other ... reliable sampling for mold can be expensive, and standards for judging what is and what is not ...

  1. Custom molded thermal MRg-FUS phantom

    Eames, Matthew D. C.; Snell, John W.; Hananel, Arik; Kassell, Neal F.


    This article describes a method for creating custom-molded thermal phantoms for use with MR-guided focused ultrasound systems. The method is defined here for intracranial applications, though it may be modified for other anatomical targets.

  2. Additive Manufacturing of Wind Turbine Molds

    Post, Brian [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Richardson, Bradley [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Lloyd, Peter [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Love, Lonnie [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Nolet, Stephen [TPI Composites, Scottsdale, AZ (United States); Hannan, James [TPI Composites, Scottsdale, AZ (United States)


    The objective of this project was to explore the utility of Big Area Additive Manufacturing (BAAM) for low cost manufacturing of wind turbine molds. Engineers at Oak Ridge National Laboratory (ORNL) and TPI Composites (TPI) collaborated to design and manufacture a printed mold that can be used for resin infusion of wind turbine components. Specific focus was on required material properties (operating temperatures and pressures, coefficient of thermal expansion (CTE), thermal conductivity), surface finish (accuracy and coatings) and system integration (integrated vacuum ports, and heating element). The project began with a simple proof of principle components, targeting surface coatings and material properties for printing a small section (approximately 4’ x 4’ x 2’) of a mold. Next, the second phase scaled up and integrated with the objective of capturing all of the necessary components (integrated heating to accelerate cure time, and vacuum, sealing) for resin infusion on a mold of significant size (8’ x 20’ x 6’).

  3. National Allergy Bureau Pollen and Mold Report

    ... the Expert Search Search AAAAI National Allergy Bureau Pollen and Mold Report Date: April 11, 2017 Location: ... 11, 2017 Click Here to View Most Recent Pollen and Spore Levels (04/10/2017) If you ...

  4. 21 CFR 133.184 - Roquefort cheese, sheep's milk blue-mold, and blue-mold cheese from sheep's milk.


    ... 21 Food and Drugs 2 2010-04-01 2010-04-01 false Roquefort cheese, sheep's milk blue-mold, and blue-mold cheese from sheep's milk. 133.184 Section 133.184 Food and Drugs FOOD AND DRUG ADMINISTRATION..., sheep's milk blue-mold, and blue-mold cheese from sheep's milk. (a) Description. (1) Roquefort...

  5. Die Casting Mold Design for Aluminum Alloy Shell of Instrument

    Li Yuanyuan


    Full Text Available This paper is about die casting mold design for aluminum alloy shell of instrument. Three-dimensional model of the casting and mold are designed by using Pro/Engineer and AutoCad which can analyze forming quality. Digital design and theoretical calculation can greatly shorten product development cycle and mold design cycle, improve the accuracy of product design and mold design, and reduce the cost of mold design.

  6. Abnormal growth of Ag3Sn intermetallic compounds in Sn-Ag lead-free solder

    SHEN Jun; LIU Yongchang; GAO Houxiu


    The abnormal growth of Ag3Sn intermetallic compounds in eutectic Sn-3.5% Ag solder was investigated through high-temperature aging treatment. Microstructural evolutions of this solder before and after the aging treatment were observed by optical microscopy and scanning electron microscopy. Precise differential thermal analysis was made to study the changes in enthalpies of the solder under different conditions. The results reveal that the water-cooled solder is in metastable thermodynamic state due to the high free energy of Ag3Sn nanoparticles, which sporadically distribute in the matrix as second-phase. The second-phase Ag3Sn nanoparticles aggregate rapidly and grow to form bulk intermetallic compounds due to the migration of grain boundary between primary Sn-rich phase and the Ag3Sn nanoparticles during high temperature aging treatment.

  7. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper


    Soldering of cast alloys to the dies has been a continuing source of die surface damage in the aluminum die-casting industry. To reduce the repair and maintenance costs, an approach to modeling the damage and predicting the die lifetime is required. The aim of the present study is the estimation...... of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

  8. Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints

    Bosco, Nick; Silverman, Timothy J.; Kurtz, Sarah


    FEM simulations of PbSn solder fatigue damage are used to evaluate seven cities that represent a variety of climatic zones. It is shown that the rate of solder fatigue damage is not ranked with the cities' climate designations. For an accurate ranking, the mean maximum daily temperature, daily temperature change and a characteristic of clouding events are all required. A physics-based empirical equation is presented that accurately calculates solder fatigue damage according to these three factors. An FEM comparison of solder damage accumulated through service and thermal cycling demonstrates the number of cycles required for an equivalent exposure. For an equivalent 25-year exposure, the number of thermal cycles (-40 degrees C to 85 degrees C) required ranged from roughly 100 to 630 for the cities examined. It is demonstrated that increasing the maximum cycle temperature may significantly reduce the number of thermal cycles required for an equivalent exposure.

  9. Thermal analysis of selected tin-based lead-free solder alloys

    Palcut, Marián; Sopoušek, J.; Trnková, L.


    The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC) and thermodyna......The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC...... was simulated using the Thermo-Calc software package. This approach enabled us to obtain the enthalpy of cooling for each alloy and to compare its temperature derivative with the experimental DSC curves....

  10. Shear Deformation Behaviors of Sn3.5Ag Lead-free Solder Samples

    Jing Han; Hongtao Chen; Mingyu Li; Chunqing Wang


    In this study,shear tests have been performed on the as-reflowed Sn3.5Ag solder bumps and joints to investigate the deformation behavior of Sn3.5Ag lead-free solder samples.Scanning electron microscopy (SEM) was employed to characterize the microstructures of the samples and orientation imaging microscopy (OIM) with electron backscattered diffraction (EBSD) in SEM was used to obtain crystallographic orientation of grains to provide a detailed characterization of the deformation behavior in Sn3.5Ag solder samples after shear tests.The deformation behavior in solder samples under shear stress was discussed.The experimental results suggest that the dynamic recrystallization could occur under shear stress at room temperature and recrystallized grains should evolve from subgrains by rotation.Compared with that of non-recrystallized and as-reflowed microstructures,the microhardness of the recrystallized microstructure decreased after shear tests.

  11. Joint Strength with Soldering of Al2O3 Ceramics After Ni-P Chemical Plating

    邹贵生; 吴爱萍; 张德库; 孟繁明; 白海林; 张永清; 黎义; 巫世杰; 顾兆旃


    Ni-P alloy was chemically plated on Al2O3 ceramics to produce uniform alloy coatings at temperatures below 70℃. Cu metal was electroplated onto the Ni-P coating to facilitate the soldering and shorten the chemical plating time. Then, the electroplated ceramic specimens were soldered with 60 wt.% Sn-40 wt.% Pb solder in active colophony. The highest shear strength was acquired after the heat treatment at 170℃ for 15 min. The joint fractures mostly propagated along the interface between the ceramics and the Ni-P coating, with some fracture in both the ceramics and the Ni-P coating near the interface and some along the interface between the Cu and Ni-P coatings. The results show that ceramic surface roughness and the chemical plating parameters influence the coating quality, and that suitable heat treatment before the soldering also improves the adhesion between the ceramics and Ni-P coatings, thus strengthening the joints.

  12. Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

    Lee, Tae-Kyu; Liu, Bo; Zhou, Bite; Bieler, Thomas; Liu, Kuo-Chuan


    The impact of a marine environment on Sn-Ag-Cu interconnect reliability is examined using salt spray exposure followed by thermal cycling. Sn-Ag-Cu solder alloy wafer-level packages, with and without pretreatment with 5% NaCl salt spray, were thermally cycled to failure. The prior salt spray reduced the characteristic lifetime of the Sn-Ag-Cu solder joints by over 43%. Although Sn-based materials show strong resistance to corrosion, the nature of localized corroded areas at critical locations in the solder joint caused significant degradation in the Sn-Ag-Cu solder joints. An important link between the corrosion path and Sn grain orientation was observed using orientation imaging microscopy (OIM). A strong correlation between the corrosion path and grain orientation was identified, indicating that the corrosion attack preferentially followed the basal plane of the Sn lattice.

  13. Influence of Asymmetrical Waveform on Low-Cycle Fatigue Life of Micro Solder Joint

    Kanda, Yoshihiko; Kariya, Yoshiharu


    The effects of waveform symmetry on the low-cycle fatigue life of the Sn-3.0Ag-0.5Cu alloy have been investigated, using micro solder joint specimens with approximately the same volume of solder as is used in actual products. Focusing on crack initiation life, fatigue tests on Sn-Ag-Cu micro solder joints using asymmetrical triangular waveforms revealed no significant reduction in fatigue life. A slight reduction in fatigue life at low strain ranges caused by an increase in the fatigue ductility exponent, which is the result of a weakening microstructure due to loads applied at high temperature for long testing time, was observed. This was due to the fact that grain boundary damage, which has been reported in large-size specimens subjected to asymmetrical triangular waveforms, does not occur in Sn-Ag-Cu micro size solder joints with only a small number of crystal grain boundaries.

  14. Evaluation of Detachable Ga-Based Solder Contacts for Thermoelectric Materials

    Kolb, H.; Sottong, R.; Dasgupta, T.; Mueller, E.; de Boor, J.


    Low electrical and thermal contact resistances are a prerequisite for highly efficient thermoelectric generators. Likewise, certain measurement setups for characterization of thermoelectric materials rely on good-quality contacts between sample and setup. Detachable contacts are an interesting alternative to permanent contacting solutions due to ease of handling and nondestructive disassembly of valuable samples. Therefore, the applicability of gallium-based liquid metal solder as detachable contact material was studied, particularly with regard to compatibility of the solder with state-of-the-art thermoelectric materials CoSb3, Mg2Si, and FeSi2. Tungsten, nickel, chromium, and titanium were tested as protective coatings between the thermoelectric material and liquid metal solder. Electrical measurements showed that some materials form excellent and stable contacts with the solder for a limited temperature range. At higher temperatures, application of a protective layer was found to be necessary for all investigated materials. Tungsten and nickel showed promising results as protective layer.

  15. Nano ZrO2 Particulate-reinforced Lead-Free Solder Composite

    Jun SHEN; Yongchang LIU; Dongjiang WANG; Houxiu GAO


    A lead-free solder composite was prepared by adding ZrO2 nanopowders in eutectic Sn-Ag alloy. Microstructural features and microhardness properties of those solders with different ZrO2 nanopowder fraction were examined. Results indicate that the addition of ZrO2 nanopowders reduced the size ofβ-Sn grains and restrained the formation of bulk Ag3Sn intermetallic compounds (IMCs) due to the adsorption effect of the ZrO2 particles. The Vicker's hardness of the obtained lead-free solder composites fits well with the Hall-Petch relationship. The refinement of β-Sn grains favors to improve the microhardness of composite solders.

  16. Microstructurally based thermomechanical fatigue lifetime model of solder joints for electronic applications

    Frear, D.R.; Rashid, M.M.; Burchett, S.N.


    We present a new methodology for predicting the fatigue life of solder joints for electronics applications. This approach involves integration of experimental and computational techniques. The first stage involves correlating the manufacturing and processing parameters with the starting microstructure of the solder joint. The second stage involves a series of experiments that characterize the evolution of the microstructure during thermal cycling. The third stage consists of a computer modeling and simulation effort that utilizes the starting microstructure and experimental data to produce a reliability prediction of the solder joint. This approach is an improvement over current methodologies because it incorporates the microstructure and properties of the solder directly into the model and allows these properties to evolve as the microstructure changes during fatigue.

  17. Interfacial Reactions and Joint Strengths of Sn- xZn Solders with Immersion Ag UBM

    Jee, Y. K.; Yu, Jin


    The solder joint microstructures of immersion Ag with Sn- xZn ( x = 0 wt.%, 1 wt.%, 5 wt.%, and 9 wt.%) solders were analyzed and correlated with their drop impact reliability. Addition of 1 wt.% Zn to Sn did not change the interface microstructure and was only marginally effective. In comparison, the addition of 5 wt.% or 9 wt.% Zn formed layers of AgZn3/Ag5Zn8 at the solder joint interface, which increased drop reliability significantly. Under extensive aging, Ag-Zn intermetallic compounds (IMCs) transformed into Cu5Zn8 and Ag3Sn, and the drop impact resistance at the solder joints deteriorated up to a point. The beneficial role of Zn on immersion Ag pads was ascribed to the formation of Ag-Zn IMC layers, which were fairly resistant to the drop impact, and to the suppression of the brittle Cu6Sn5 phase at the joint interface.

  18. Integrated mold/surface-micromachining process

    Barron, C.C.; Fleming, J.G.; Montague, S.; Sniegowski, J.J.; Hetherington, D.L.


    We detail a new monolithically integrated silicon mold/surface-micromachining process which makes possible the fabrication of stiff, high-aspect-ratio micromachined structures integrated with finely detailed, compliant structures. An important example, which we use here as our process demonstration vehicle, is that of an accelerometer with a large proof mass and compliant suspension. The proof mass is formed by etching a mold into the silicon substrate, lining the mold with oxide, filling it with mechanical polysilicon, and then planarizing back to the level of the substrate. The resulting molded structure is recessed into the substrate, forming a planar surface ideal for subsequent processing. We then add surface-micromachined springs and sense contacts. The principal advantage of this new monolithically integrated mold/surface-micromachining process is that it decouples the design of the different sections of the device: In the case of a sensitive accelerometer, it allows us to optimize independently the proof mass, which needs to be as large, stiff, and heavy as possible, and the suspension, which needs to be as delicate and compliant as possible. The fact that the high-aspect-ratio section of the device is embedded in the substrate enables the monolithic integration of high-aspect-ratio parts with surface-micromachined mechanical parts, and, in the future, also electronics. We anticipate that such an integrated mold/surface micromachining/electronics process will offer versatile high-aspect-ratio micromachined structures that can be batch-fabricated and monolithically integrated into complex microelectromechanical systems.


    Tomasz Garbacz


    Full Text Available In a study of cellular injection, molding process uses polyvinylchloride PVC. Polymers modified with introducing blowing agents into them in the Laboratory of the Department of Technologies and Materiase of Technical University of Kosice. For technological reasons, blowing agents have a form of granules. In the experiment, the content of the blowing agent (0–2,0 % by mass fed into the processed polymer was adopted as a variable factor. In the studies presented in the article, the chemical blowing agents occurring in the granulated form with a diameter of 1.2 to 1.4 mm were used. The view of the technological line for cellular injection molding and injection mold cavity with injection moldings are shown in Figure 1. The results of the determination of selected properties of injection molded parts for various polymeric materials, obtained with different content of blowing agents, are shown in Figures 4-7. Microscopic examination of cross-sectional structure of the moldings were obtained using the author's position image analysis of porous structure. Based on analysis of photographs taken (Figures 7, 8, 9 it was found that the coating containing 1.0% of blowing agents is a clearly visible solid outer layer and uniform distribution of pores and their sizes are similar.

  20. Studies of intermetallic growth in Cu-solder systems and wettability at solid-liquid interfaces

    Martin, Raymond W.


    Approved for public release; distribution is unlimited The metallurgical bond formed between tin-lead solder and the copper substrate is characterized by the formation of an intermetallic compound layer. The growth of the intermetallic layer is the result of competing mechanisms, growth of the intermetallic at the intermetallic/copper interface and its dissolution at the intermetallic/liquid solder interface. These were studied by determining the dissolution rates of the copper and the i...

  1. Joint Lead-Free Solder Test Program for High Reliability Military and Space Applications

    Brown, Christina


    Current and future space and defense systems face potential risks from the continued use of tin-lead solder, including: compliance with current environmental regulations, concerns about potential environmental legislation banning lead-containing products, reduced mission readiness, and component obsolescence with lead surface finishes. For example, the United States Environmental Protection Agency (USEPA) has lowered the Toxic Chemical Release reporting threshold for lead to 100 pounds. Overseas, the Waste Electrical and Electronic Equipment (WEEE) and the Restriction on Hazardous Substances (RoHS) Dicctives in Europe and similar mandates in Japan have instilled concern that a legislative body will prohibit the use of lead in aerospace/military electronics soldering. Any potential banning of lead compounds could reduce the supplier base and adversely affect the readiness of missions led by the National Aeronautics and Space Administration (NASA) and the U.S. Department of Defense (DoD). Before considering lead-free electronics for system upgrades or future designs, however, it is important for the DoD and NASA to know whether lead-free solders can meet their systems' requirements. No single lead-free solder is likely to qualify for all defense and space applications. Therefore, it is important to validate alternative solders for discrete applications. As a result of the need for comprehensive test data on the reliability of lead-free solders, a partnership was formed between the DoD, NASA, and several original equipment manufactures (OEMs) to conduct solder-joint reliability (laboratory) testing of three lead-free solder alloys on newly manufactured and reworked circuit cards to generate performance data for high-reliability (IPC Class 3) applications.

  2. Thermomechanical cycling investigation of CU particulate and NITI reinforced lead-free solder

    Horton, W. Scott.


    In todayâ s Flip Chip (FC) and Ball Grid Array (BGA) electronic packages solder joints provide both the electrical as well as the mechanical connections between the silicon chip and the substrate. Due to coefficient of thermal expansion (CTE) differences between the chip and substrate the solder joints undergo thermomechanical stresses and strains as an electronic package is heated and cooled with power on/off cycles. Advances in chip designs result in chips that are larger, run hotter and d...

  3. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Benabou Lahouari


    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  4. Packaging of hard solder 500W QCW diode laser array

    Li, Xiaoning; Wang, Jingwei; Hou, Dong; Nie, Zhiqiang; Liu, Xingsheng


    The package structure critically influences the major characteristics of diode laser, such as thermal behavior, output power, wavelength and smile effect. In this work, a novel micro channel cooler (MCC) for stack array laser with good heat dissipation capability and high reliability is presented. Numerical simulations of thermal management with different MCC structure are conducted and analyzed. Based on this new MCC packaging structure, a series of QCW 500W high power laser arrays with hard solder packaging technology has been fabricated. The performances of the laser arrays are characterized. A narrow spectrum of 3.12 nm and an excellent smile value are obtained. The lifetime of the laser array is more than 1.38×109 shots and still ongoing.

  5. Modeling of thermal processes in waveguide tracts induction soldering

    Murygin, A. V.; Tynchenko, V. S.; Laptenok, V. D.; Emilova, O. A.; Seregin, Yu N.


    The problem solving of the induction heating models development, which describe the heating of the separate structural assembly components of the waveguide path and product generally, is presented in this paper. Proposed mathematical models are based on the thermodynamics equation and on the heat balance law. The system of the heating process mathematical models, such as surge tube and flange heating, and the mathematical model of the energy distribution are presented. During the modeling process with Matlab system by using mathematical models graphs of the tube, flange and coupling heating were obtained. These design charts are confirmed by the results of the experimental study. During the experimental studies pyrometers for temperature control and a video camera for visual control of the process parameters were used. On the basis of obtained models the induction soldering process features analysis is carried out and the need of its automation by the using of the information control systems for thermal management between the connection elements is revealed.

  6. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others


    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  7. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Lei Sun


    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  8. Soldering in a Reduced Gravity Environment (SoRGE)

    Easton, John W.; Struk, Peter M.


    Future long-duration human exploration missions will be challenged by constraints on mass and volume allocations available for spare parts. Addressing this challenge will be critical to the success of these missions. As a result, it is necessary to consider new approaches to spacecraft maintenance and repair that reduce the need for large replacement components. Currently, crew members on the International Space Station (ISS) recover from faults by removing and replacing, using backup systems, or living without the function of Orbital Replacement Units (ORUs). These ORUs are returned to a depot where the root cause of the failure is determined and the ORU is repaired. The crew has some limited repair capability with the Modulation/DeModulation (MDM) ORU, where circuit cards are removed and replace in faulty units. The next step to reducing the size of the items being replaced would be to implement component-level repair. This mode of repair has been implemented by the U.S. Navy in an operational environment and is now part of their standard approach for maintenance. It is appropriate to consider whether this approach can be adapted for future spaceflight operations. To this end, the Soldering in a Reduced Gravity Environment (SoRGE) experiment studied the effect of gravity on the formation of solder joints on electronic circuit boards. This document describes the SoRGE experiment, the analysis methods, and results to date. This document will also contain comments from the crew regarding their experience conducting the SoRGE experiment as well as recommendations for future improvements. Finally, this document will discuss the plans for the SoRGE samples which remain on ISS.

  9. Solder-Filling of a Cicc Cable for the Efda Dipole Magnet

    Bauer, P.; Bruzzone, P.; Cau, F.; Weiss, K.; Portone, A.; Salpietro, E.; Vogel, M.; Vostner, A.


    Several prototype Cable-In-Conduit-Conductors (CICC) for the superconducting EDIPO (Efda DIPOle) revealed a degradation of their critical current (Ic) increasing with each loading cycle. The strong Lorentz-forces during operation in combination with the limited support of the single strands against these forces are thought to be the cause of the permanent degradation of the brittle Nb3Sn superconductor from which the multi-stranded CICC are made. In summer 2006 EFDA started to explore the possibility to remedy the Ic degradation by solder-filling the conductor in order to mechanically stabilize the twisted-strand cable inside the conduit. This solution was not considered as the main one, but as an emergency solution to be applied to the completed magnet, should every other option fail. The solder-filling approach was previously applied with success in some cases. Some issues, however, needed to be clarified before this solution could be proposed for the EDIPO project. The most important among them are the choice of solder material, details of the solder filling process, and the thermo-mechanical implications of a solder-filled, high-field, high-current cable. This work, being reported here, made use not only of simulation but also of experiments, such as the mechanical testing of solder filled cables at cryogenic temperatures.

  10. Preliminary Study on Synthesis of Organolead Halide with Lead Derived from Solder Wire

    Pratiwi, P.; Rahmi, G. N.; Aimon, A. H.; Iskandar, F.; Abdullah, M.; Nuryadin, B. W.


    Organolead halide has attracted great attention for application in perovskite solar cells due to its high power conversion efficiency (PCE) of up to 20.1%. One of the most common perovskite materials is lead based reagent. In this research, we have synthesized organolead halide with lead extracted from solder wire. In the preparation procedure, first PbCl2 and PbI2 are produced by reacting lead from the solder wire with NaCl and KI, which are used as the basic substance for the perovskite material. Then, in order to get perovskite solution, the powders are reacted with methylamine iodide (MAI) in dimethylformamide (DMF) using a solution based method. Further, the spin coating method is used to fabricate perovskite thin film. The XRD peak results agreed with JCPDS Powder Diffraction of PbCl2 and PbI2. Based on FTIR, the transmittance spectra of the organolead mixed halide that was prepared using solder wire lead exhibited absorption peaks identical to organolead mixed halide using commercial lead. The UV-Vis absorbance spectra of the organolead mixed halide from solder wire lead also exhibited the same absorption ability as from commercial lead. Morever, EDS measurement showed that the element composition of the perovskite thin film using lead from solder wire identical to that from commercial lead. This indicates that solder wire lead is suitable enough for organolead halide material synthesis.

  11. Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying

    Kao, Szu-Tsung; Duh, Jenq-Gong


    The mechanical alloying (MA) process is considered an alternative approach to produce solder materials. In this study, the effect of Cu concentration in the ternary Sn-3.5Ag-xCu (x=0.2, 0.7, and 1) solder by MA was investigated. The (Cu,Sn) solid solution was precipitated as the Cu6Sn5 intermetallic compound (IMC), which was distributed nonuniformly through the microstructure. The Cu6Sn5 IMC, which was present in the SnAgCu solder with high Cu composition, causes the as-milled MA particle to fracture to a smaller size. Appreciable distinction on morphology of as-milled MA powders with different Cu content was revealed. When the Cu concentration was low (x=0.2), MA particle aggregated to a spherical ingot with large particle size. For higher Cu concentration (x=0.7 and x=1), the MA particle turned to flakes with smaller particle size. The distinction of the milling mechanism of Sn-3.5Ag-xCu (x=0.2, 0.7, and 1) solder by the MA process was discussed. An effective approach was developed to reduce the particle size of the SnAgCu solder from 1 mm down to 10-100 µm by doping the Cu6Sn5 nanoparticle during the MA process. In addition, the differential scanning calorimetry (DSC) results also ensure the compatibility to apply the solder material for the reflow process.

  12. Development of high strength Sn-Mg solder alloys with reasonable ductility

    Alam, Md Ershadul; Gupta, Manoj


    This study discussed the development of a series of new lead-free Sn-Mg solders by incorporating varying amounts of Mg (0.8, 1.5 and 2.5 wt. %) into pure Sn using disintegrated melt deposition technique followed by room temperature extrusion. All extruded Sn and Sn-Mg solder samples were characterized. Microstructural characterization studies revealed equiaxed grain morphology, minimal porosity and relatively uniform distribution of secondary phase. Better coefficient of thermal expansion was observed for Sn-2.5Mg sample when compared to conventional Sn-37Pb solder. Melting temperature of Sn-1.5Mg was found to be 212°C which is much lower than the conventional Sn-Ag-Cu or Sn-Cu (227°C) solders. Microhardness was increased with increasing amount of Mg in pure Sn. Room temperature tensile test results revealed that newly developed Sn-Mg solders exhibit enhanced strengths (0.2% yield strength and ultimate tensile strength) with comparable (if not better) ductility when compared to other commercially available and widely used Sn-based solder alloys.

  13. Effect of interface microstructure on the mechanical properties of Pb-free hybrid microcircuit solder joints

    Hernandez, C.L.; Vianco, P.T.; Rejent, J.A.


    Although Sn-Pb eutectic alloy is widely used as a joining material in the electronics industry, it has well documented environmental and toxicity issues. Sandia National Laboratories is developing alternative solder materials to replace traditional Pb-containing alloys. The alloys are based on the Sn-Ag, Sn-Ag-Bi and Sn-Ag-Bi-Au systems. Prototype hybrid microcircuit (HMC) test vehicles have been developed to evaluate these Pb-free solders, using Au-Pt-Pd thick film metallization. Populated test vehicles with surface mount devices have been designed and fabricated to evaluate the reliability of surface mount solder joints. The test components consist of a variety of dummy chip capacitors and leadless ceramic chip carriers (LCCC`s). Intermetallic compound (IMC) layer reaction products that form at the solder/substrate interface have been characterized and their respective growth kinetics quantified. Thicker IMC layers pose a potential reliability problem with solder joint integrity. Since the IMC layer is brittle, the likelihood of mechanical failure of a joint in service is increased. The effect of microstructure and the response of these different materials to wetting, aging and mechanical testing was also investigated. Solid-state reaction data for intermetallic formation and mechanical properties of the solder joints are reported.

  14. Mechanical properties of Pb-free solder alloys on thick film hybrid microcircuits

    Hernandez, C.L.; Vianco, P.T.; Rejent, J.A.; Hosking, F.M.


    The technology drivers of the electronics industry continue to be systems miniaturization and reliability, in addition to addressing a variety of important environmental issues. Although the Sn-Pb eutectic alloy is widely used as a joining material in the electronics industry, it has drawn environmental concern due to its Pb content. The solder acts both as an electrical and mechanical connection within the different packaging levels in an electronic device. New Pb-free solders are being developed at Sandia National Laboratories. The alloys are based on the Sn-Ag alloy, having Bi and Au additions. Prototype hybrid microcircuit (HMC) test vehicles have been assembled to evaluate Pb-free solders for Au-Pt-Pd thick film soldering. The test components consist of a variety of dummy chip capacitors and leadless ceramic chip carriers (LCCC`s). The mechanical properties of the joints were evaluated. The reflow profiles and the solid state intermetallic formation reaction will also be presented. Improved solder joint manufacturability and increased fatigue resistance solder alloys are the goals of these materials.

  15. Numerical simulation of soldered joints and reliability analysis of PLCC components with J-shape leads

    Zhang Liang; Xue Songbai; Lu Fangyan; Han Zongjie; Wang Jianxin


    This paper deals with a study on SnPb and lead-free soldered joint reliability of PLCC devices with different lead counts under three kinds of temperature cycle profiles, which is based on non-linear finite element method. By analyzing the stress of soldered joints, it is found that the largest stress is at the area between the soldered joints and the leads, and analysis results indicate that the von Mises stress at the location slightly increases with the increase of lead counts. For PLCC with 84 leads the soldered joints was modeled for three typical loading (273-398 K, 218-398 K and 198-398 K) in order to study the influence of acceleration factors on the reliability of soldered joints. And the estimation of equivalent plastic strain of three different lead-free solder alloys (Sn3.8Ag0.7Cu, Sn3.5Ag and Sn37Pb) was also carried out.

  16. Comparative shear tests of some low temperature lead-free solder pastes

    Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.


    The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

  17. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    Enrico Mick


    Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

  18. Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly

    El-Daly, A.A., E-mail: [Physics Department, Faculty of Science, Zagazig Univ., Zagazig (Egypt); Center of Nanotechnology, Zagazig Univ., Zagazig (Egypt); El-Taher, A.M. [Physics Department, Faculty of Science, Zagazig Univ., Zagazig (Egypt); Center of Nanotechnology, Zagazig Univ., Zagazig (Egypt); Gouda, S. [Physics Department, Faculty of Science, Zagazig Univ., Zagazig (Egypt)


    Highlights: • Small amounts of Bi have been added into Sn–1.5Ag–0.7Cu solder. • Bi reduced the undercooling and eutectic temperature of SAC257 solder. • Bi refined the microstructure and diminishes the nucleation rate of IMCs. • Bi increased the creep resistance and fracture lifetime of the solder. • Overall SAC properties can be improved adding not more than 3 wt.% Bi. - Abstract: Eutectic Sn–Ag–Cu (SAC) solder is one of the candidate alternatives to Sn–Pb-based solder alloys. The coupling effect of both minor alloying Bi addition and reducing the amount of Ag phase have been proposed as an important approach to optimize existing and to develop new SAC solders. Characteristics of new Sn–Ag–Cu–Bi solders were analyzed and compared with those of as-solidified Sn–1.5Ag–0.7Cu (SAC157) alloy. The results of differential scanning calorimetry (DSC) indicate significant reduction of both undercooling, eutectic temperature, solidus and liquidus temperatures with the addition of Bi into SAC(157) solder, although the pasty range remains the same or slightly increased. Moreover, SAC(157) solders containing Bi were found to have a higher creep resistance (126.1 times) than SAC(157) solder at the same stress level and testing temperature. The higher creep resistance was contributed by the solid solution and precipitations strengthen effects of Bi. The precipitation of these Bi atoms or particles can significantly refine the microstructure, blocks the movement of dislocations and increases the creep resistance of Bi-containing solders. The creep life time of plain SAC(157) alloy was extremely enlarged 23.7 times with the addition of 3 wt.% Bi. Constitutive Garofalo model of creep for both SAC(157) and Sn–Ag–Cu–Bi solders was assembled based on the experimental data.

  19. Fast Mold Temperature Evolution on Micro Features Replication Quality during Injection Molding

    Liparoti, S.; Calaon, Matteo; Speranza, V.;


    lithography and subsequent nickel electroplating. The mold temperature was controlled by a thin heating device (composed by polyimide as insulating layer and polyimide carbon black loaded aselectrical conductive layer) able to increase the temperature on mold surface in a few seconds (40°C/s) by Joule effect...

  20. Development of sheet molding compound solar collectors with molded-in silvered glass reflective surfaces

    Champion, R. L.; Allred, R. E.


    The reflecting concentrator of a parabolic trough solar collector system comprises approximately 40% of initial system cost. The parabolic concentrator structure is also the most influential component in determining overall system efficiency. Parabolic test moldings have been fabricated from a general purpose sheet molding compound with flat chemically strengthened glass, flat annealed glass, and thermally formed glass. The test panel configuration was a 1.22 m x 0.61 m, 45/sup 0/ rim angle (0.762 m focal length) parabola. Attempts to mold with annealed sheet glass (1 mm thick) and thermally formed glass (1.25 mm thick) were unsuccessful; only the chemically strengthened glass (1.25 mm thick) was strong enough to survive molding pressures. Because of the mismatch in thermal expansion between glass and sheet molding compound, the as-molded panels contained a sizeable residual stress. The results are given of dimensional changes taking place in the panels under accelerated thermal cycling and outdoor aging conditions; these results are compared to an analytical model of the laminate. In addition, the sheet molding compound has been examined for thermomechanical properties and flow behavior in the rib sections. Results indicated that lowering the thermal expansion coefficient of the sheet molding compound through material modifications would produce a more stable structure.

  1. Study on Solder Joint Reliability of Plastic Ball Grid Array Component Based on SMT Products Virtual Assembly Technology

    HUANG Chunyue; WU Zhaohua; ZHOU Dejian


    Based on surface mount products virtual assembly technology, the solder joint reliability of plastic ball grid array (PBGA) was studied. Four process parameters, including the upper pad diameter,the stencil thickness, the chip weight on a single solder joint and the lower pad diameter were chose as four control factors. By using an L25(56) orthogonal array the PBGA solder joints which have 25 different process parameters' levels combinations were designed. The numerical models of all the 25 PBGA solder joints were developed and the finite element analysis models were setup. The stress and strain distribution within the PBGA solder joints under thermal cycles were studied by finite element analysis, and the thermal fatigue life of PBGA solder joint was calculated using Coffin-Manson equation. Based on the calculated thermal fatigue life results, the range analysis was performed. The results of study show that that the impact sequence of the four factors from high to low on the fatigue life of PBGA solder joints are the stencil thickness,the upper pad diameter, the lower pad diameter and the chip weight on a single solder joint; the best level combination ofprocess parameters that results in the longest fatigue life is the lower pad diameter of 0.6 mm, the stencil thickness of 0.175 mm, the chip weight on asingle solder joint of 28×10-5 N and the upper pad diameter of 0.5 mm.

  2. Effect of Lanthanum on Driving Force for Cu6Sn5 Growth and Improvement of Solder Joint Reliability


    By means of adding low content of rare earth element La into Sn60-Pb40 solder alloy, the growth of Cu6Sn5 intermetallic compound at the interface of solder joint is hindered, and the thermal fatigue life of solder joint is increased by 2 times. The results of thermodynamic calculation based on diffusion kinetics show that, the driving force for Cu6Sn5 growth is lowered by adding small content of La in Sn60-Pb40 solder alloy. Meanwhile, there is an effective local mole fraction range of La, in which, 0.18% is the limited value and 0.08% is the best value.

  3. Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB

    Kim, Jungsoo; Myung, Woo-Ram; Jung, Seung-Boo


    The mechanical properties of Sn-58Bi epoxy solder were evaluated by low-speed shear testing as functions of aging time and temperature. To determine the effects of epoxy, the interfacial reaction and mechanical properties of both Sn-58Bi and Sn-58Bi epoxy solder were investigated after aging treatment. The chemical composition and growth kinetics of the intermetallic compound (IMC) formed at the interface between Sn-58Bi solder and electroless nickel electroless palladium immersion gold (ENEPIG) surface finish were analyzed. Sn-58Bi solder paste was applied by stencil-printing on flame retardant-4 substrate, then reflowed. Reflowed samples were aged at 85°C, 95°C, 105°C, and 115°C for up to 1000 h. (Ni,Pd)3Sn4 IMC formed between Sn-58Bi solder and ENEPIG surface finish after reflow. Ni3Sn4 and Ni3P IMCs formed at the interface between (Ni,Pd)3Sn4 IMC and ENEPIG surface finish after aging at 115°C for 300 h. The overall IMC growth rate of Sn-58Bi solder joint was higher than that of Sn-58Bi epoxy solder joint during aging. The shear strength of Sn-58Bi epoxy solder was about 2.4 times higher than that of Sn-58Bi solder due to the blocking effect of epoxy, and the shear strength decreased with increasing aging time.

  4. Study On The External Gas-Assisted Mold Temperature Control For Thin Wall Injection Molding

    ThanhTrung Do


    Full Text Available Dynamic mold surface temperature control (DMTC has many advantages in micro-injection molding as well as thin-wall molding product. In this paper, DMTC will be applied for the thin-wall molding part with the observation of the weldline appearance and the weldline strength. The heating step of DMTC will be achieved by the hot air flow directly to the weldline area. The results show that the heating rate could be reached to 4.5C/s, which could raising the mold surface from 30C to over 120C within 15 s. The melt filling was operated with high temperature at the weldline area; therefore, the weldline appearance was eliminated. In addition, the weldline strength was also improved. The results show that the thinner part had the higher strength of the weldline

  5. Effects of mold geometry on fiber orientation of powder injection molded metal matrix composites

    Ahmad, Faiz, E-mail:; Aslam, Muhammad, E-mail:; Altaf, Khurram, E-mail:; Shirazi, Irfan, E-mail: [Mechanical Engineering Universiti Teknologi PETRONAS Malaysia (Malaysia)


    Fiber orientations in metal matrix composites have significant effect on improving tensile properties. Control of fiber orientations in metal injection molded metal composites is a difficult task. In this study, two mold cavities of dimensions 6x6x90 mm and 10x20x180 mm were used for comparison of fiber orientation in injection molded metal composites test parts. In both mold cavities, convergent and divergent flows were developed by modifying the sprue dimensions. Scanning electron microscope (SEM) was used to examine the fiber orientations within the test samples. The results showed highly aligned fiber in injection molded test bars developed from the convergent melt flow. Random orientation of fibers was noted in the composites test bars produced from divergent melt flow.

  6. Electrodeposition of lead-free, tin-based alloy solder films

    Han, Chunfen

    The dominant materials used for solders in electronic assemblies over the past 60 years have been Pb-Sn alloys. Increasing pressure from environmental and health authorities has stimulated the development of various Pb-free solders. Two of the most promising replacements are eutectic Sn-Cu and Sn-Ag-Cu alloys that are produced primarily by electrodeposition. During soldering and solid state aging (storage or in service of the electronic assemblies), interactions take place at the solder/substrate metal interface and form intermetallic compounds (IMCs) which are crucial for the reliability of the solder joints. Simple and "green" Sn-citrate and Sn-Cu-citrate solutions have been developed and optimized to electrodeposit eutectic and near eutectic Sn-Cu solder films. Sn-citrate suspensions with Cu particles and Sn-Cu-citrate suspensions with Ag nano-particles have also been developed and optimized to allow for electrochemical composite deposition of eutectic and near eutectic Sn-Cu and Sn-Ag-Cu solder films. Different plating and post-plating conditions, including solution concentration, current density, agitation, additives, and aging, have been investigated by evaluating their effects on plating rate, deposit composition and microstructure. Tri-ammonium citrate is used as the only complexing agent for Sn, Sn-Cu, and Sn-Ag-Cu deposition. Speciation diagram calculations, reduction potential calculations, and polarization studies are conducted to study Sn-citrate solution chemistry and the kinetics of Sn electrodeposition. X-ray photoelectron spectroscopy (XPS) analysis is used to identify the precipitates formed in Sn-citrate solutions at low pH. Current-controlled and potential-controlled electrochemical techniques, nucleation modeling, and surface morphology characterization techniques are applied to study the nucleation and film growth mechanism of Sn and Sn-Cu electrodeposition from Sn-citrate and Sn-Cu-citrate solutions. Reflow and aging tests for deposited Sn

  7. Laser solder repair technique for nerve anastomosis: temperatures required for optimal tensile strength

    McNally-Heintzelman, Karen M.; Dawes, Judith M.; Lauto, Antonio; Parker, Anthony E.; Owen, Earl R.; Piper, James A.


    Laser-assisted repair of nerves is often unsatisfactory and has a high failure rate. Two disadvantages of laser assisted procedures are low initial strength of the resulting anastomosis and thermal damage of tissue by laser heating. Temporary or permanent stay sutures are used and fluid solders have been proposed to increase the strength of the repair. These techniques, however, have their own disadvantages including foreign body reaction and difficulty of application. To address these problems solid protein solder strips have been developed for use in conjunction with a diode laser for nerve anastomosis. The protein helps to supplement the bond, especially in the acute healing phase up to five days post- operative. Indocyanine green dye is added to the protein solder to absorb a laser wavelength (approximately 800 nm) that is poorly absorbed by water and other bodily tissues. This reduces the collateral thermal damage typically associated with other laser techniques. An investigation of the feasibility of the laser-solder repair technique in terms of required laser irradiance, tensile strength of the repair, and solder and tissue temperature is reported here. The tensile strength of repaired nerves rose steadily with laser irradiance reaching a maximum of 105 plus or minus 10 at 12.7 When higher laser irradiances were used the tensile strength of the resulting bonds dropped. Histopathological analysis of the laser- soldered nerves, conducted immediately after surgery, showed the solder to have adhered well to the perineurial membrane, with minimal damage to the inner axons of the nerve. The maximum temperature reached at the solder surface and at the solder/nerve interface, measured using a non-contact fiber optic radiometer and thermocouple respectively, also rose steadily with laser irradiance. At 12.7, the temperatures reached at the surface and at the interface were 85 plus or minus 4 and 68 plus or minus 4 degrees Celsius respectively

  8. Injection molding simulation with variothermal mold temperature control of highly filled polyphenylene sulfide

    Birkholz, A.; Tschiersky, M.; Wortberg, J.


    For the installation of a fuel cell stack to convert chemical energy into electricity it is common to apply bipolar plates to separate and distribute reaction gases and cooling agents. For reducing manufacturing costs of bipolar plates a fully automated injection molding process is examined. The high performance thermoplastic matrix material, polyphenylene sulfide (PPS), defies against the chemical setting and the operation temperature up to 200 °C. To adjust also high electrical and thermal conductivity, PPS is highly filled with various carbon fillers up to an amount of 65 percentage by volume. In the first step two different structural plates (one-sided) with three different gate heights and molds are designed according to the characteristics of a bipolar plate. To cope with the approach that this plate should be producible on standard injection molding machines with variothermal mold temperature control, injection molding simulation is used. Additionally, the simulation should allow to formulate a quality prediction model, which is transferrable to bipolar plates. Obviously, the basis for a precise simulation output is an accurate description of the material properties and behavior of the highly filled compound. This, the design of the structural plate and mold and the optimization via simulation is presented, as well. The influence of the injection molding process parameters, e.g. injection time, cycle times, packing pressure, mold temperature, and melt temperature on the form filling have been simulated to determine optimal process conditions. With the aid of the simulation and the variothermal mold temperature control it was possible to reduce the required melt temperature below the decomposition temperature of PPS. Thereby, hazardous decomposition products as hydrogen sulfide are obviated. Thus, the health of the processor, the longevity of the injection molding machine as well as the material and product properties can be protected.

  9. Environmental impact estimation of mold making process

    Kong, Daeyoung

    Increasing concern of environmental sustainability regarding depletion of natural resources and resulting negative environmental impact has triggered various movements to address these issues. Various regulations about product life cycle have been made and applied to industries. As a result, how to evaluate the environmental impact and how to improve current technologies has become an important issue to product developers. Molds and dies are very generally used manufacturing tools and indispensible parts to the production of many products. However, evaluating environmental impact in mold and die manufacturing is not well understood and not much accepted yet. The objective of this thesis is to provide an effective and straightforward way of environmental analysis for mold and die manufacturing practice. For this, current limitations of existing tools were identified. While conventional life cycle assessment tools provide a lot of life cycle inventories, reliable data is not sufficient for the mold and die manufacturer. Even with comprehensive data input, current LCA tools only provide another comprehensive result which is not directly applicable to problem solving. These issues are critical especially to the mold and die manufacturer with limited resource and time. This thesis addresses the issues based on understanding the needs of mold and die manufacturers. Computer aided manufacturing (CAM) is the most frequently used software tool and includes most manufacturing information including the process definition and sometimes geometric modeling. Another important usage of CAM software tools is problem identification by process simulation. Under the virtual environment, possible problems are detected and solved. Environmental impact can be handled in the same manner. To manufacture molds and dies with minimizing the associated environmental impact, possible environmental impact sources must be minimized before the execution in the virtual environment. Molds and dies

  10. NASA Workmanship Hot Topics: Water Soluble Flux and ESD Charge Device Model

    Plante, Jeannette F.


    This slide presentation reviews two topics of interest to NASA Workmanship: (1) Water Soluble Flux (WSF) and Electrostatic Discharge (ESD) safety. In the first topic, WSF, the presentation reviews voiding and the importance of cleanliness in using WSF for welding and soldering operations. The second topic reviews the NASA-HDBK-8739.21 for Human Body Model, and Machine Model safety methods, and challenges associated with the Charged Device Model (CDM)

  11. Injection molding of high aspect ratio sub-100 nm nanostructures

    Matschuk, Maria; Larsen, Niels B


    with FDTS. Reduced adhesion forces are consistent with lowered friction that reduces the risk of fracturing the nanoscopic pillars during demolding. Optimized mold surface chemistry and associated injection molding conditions permitted the fabrication of square arrays of 40 nm wide and 107 nm high (aspect......We have explored the use of mold coatings and optimized processing conditions to injection mold high aspect ratio nanostructures (height-to-width >1) in cyclic olefin copolymer (COC). Optimizing the molding parameters on uncoated nickel molds resulted in slight improvements in replication quality...

  12. Intermetallic compound formation at Sn-3.0Ag-0.5Cu-1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions

    Wang, Feng-Jiang [Department of Materials Science and Engineering, Shanghai University of Engineering Science, Shanghai 201620 (China)]. E-mail:; Yu, Zhi-Shui [Department of Materials Science and Engineering, Shanghai University of Engineering Science, Shanghai 201620 (China); Qi, Kai [Department of Materials Science and Engineering, Shanghai University of Engineering Science, Shanghai 201620 (China)


    Intermetallic formations of Sn-3.0Ag-0.5Cu solder alloy with additional 1.0 wt% Zn were investigated for Cu-substrate during soldering and isothermal aging. During soldering condition, the Cu{sub 5}Zn{sub 8} compound with granular-type morphology is the interfacial IMC for Sn-3.0Ag-0.5Cu-1.0Zn solder, while the Cu{sub 6}Sn{sub 5} compound with scallop-type morphology is the interfacial IMC for Sn-3.0Ag-0.5Cu solder. During thermal aging, the final interfacial structure for Sn-3.0Ag-0.5Cu-1.0Zn solder is solder/Cu{sub 5}Zn{sub 8}/Cu{sub 6}Sn{sub 5}/Cu{sub 3}Sn/Cu, different from the solder/Cu{sub 6}Sn{sub 5}/Cu{sub 3}Sn/Cu for Sn-3.0Ag-0.5Cu solder. The thickness of Cu-Sn IMC layers increases, while the thickness of Cu{sub 5}Zn{sub 8} compound layer decreases with increasing aging time due to the decomposition of the Cu{sub 5}Zn{sub 8} layer by the diffusion of Cu and Zn atoms into the solder and Cu{sub 6}Sn{sub 5} at higher aging temperature. For Sn-3.0Ag-0.5Cu-1.0Zn solder, at higher aging temperature of 150 or 175 {sup o}C, with the formation of Cu{sub 3}Sn at Cu{sub 6}Sn{sub 5}/Cu, Kirkendall voids can be observed at the interface of Cu{sub 3}Sn/Cu.

  13. Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad

    WANG Jian-xin; XUE Song-bai; FANG Dian-song; JU Jin-long; HAN Zong-jie; YAO Li-hua


    Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively. The influence of different heating methods as well as output power of diode-laser on shear force of micro-joints was studied and the relationship between the shear force and microstructures of micro-joints was analyzed.The results indicate that the formation of intermetallic compound Ag3Sn is the key factor to affect the shear force and the fine eutectic network structures of micro-joints as well as the dispersion morphology of fine compound Ag3Sn, in which eutectic network band is responsible for the improvement of the shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder. With the increases of output power of diode-laser, the shear force and the microstructures change obviously. The eutectic network structures of micro-joints soldered with diode-laser soldering method are more homogeneous and the grains of Ag3Sn compounds are finer in the range of near optimal output power than those soldered with IR reflow soldering method, so the shear force is also higher than that using IR reflow soldering method. When the output power value of diode-laser is about 41.0 W, the shear force exhibits the highest value that is 70% higher than that using IR reflow soldering method.

  14. How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

    Suhir, E.; Yi, S.; Ghaffarian, R.


    It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

  15. Effects of Ga Addition on Interfacial Reactions Between Sn-Based Solders and Ni

    Wang, Chao-Hong; Li, Kuan-Ting


    The use of Ga as a micro-alloying element in Sn-based solders can change the microstructure of solder joints to improve the mechanical properties, and even suppress the interfacial intermetallic compound (IMC) growth. This research investigated the effects of Ga addition (0.2-1 wt.%Ga) on the IMC formation and morphological evolution in the Sn-based solder joints with Ni substrate. In the soldering reaction at 250°C and with less than 0.2 wt.%Ga addition, the formed phase was Ni3Sn4. When the Ga addition increased to 0.5 wt.%, it changed to a thin Ni2Ga3 layer of ˜1 μm thick, which stably existed at the interface in the initial 1-h reaction. Subsequently, the whole Ni2Ga3 layer detached from the Ni substrate and drifted into the molten solder. The Ni3Sn4 phase became dominant in the later stage. Notably, the Ga addition significantly reduced the grain size of Ni3Sn4, resulting in the massive spalling of Ni3Sn4 grains. With 1 wt.%Ga addition, the Ni2Ga3 layer remained very thin with no significant growth, and it stably existed at the interface for more than 10 h. In addition, the solid-state reactions were examined at temperatures of 160°C to 200°C. With addition of 0.5 wt.%Ga, the Ni3Sn4 phase dominated the whole reaction. By contrast, with increasing to 1 wt.%Ga, only a thin Ni2Ga3 layer was found even after aging at 160°C for more than 1200 h. The 1 wt.%Ga addition in solder can effectively inhibit the Ni3Sn4 formation in soldering and the long-term aging process.

  16. High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

    Shnawah, Dhafer Abdulameer; Said, Suhana Binti Mohd; Sabri, Mohd Faizul Mohd; Badruddin, Irfan Anjum; Che, Fa Xing


    Sn-Ag-Cu (SAC) alloy is currently recognized as the standard lead-free solder alloy for packaging of interconnects in the electronics industry, and high- Ag-content SAC alloys are the most popular choice. However, this choice has been encumbered by the fragility of the solder joints that has been observed in drop testing as well as the high cost of the Ag itself. Therefore, low-Ag-content SAC alloy was considered as a solution for both issues. However, this approach may compromise the thermal-cycling performance of the solders. Therefore, to enhance the thermal-cycling reliability of low-Ag-content SAC alloys without sacrificing their drop-impact performance, alloying elements such as Mn, Ce, Ti, Bi, In, Sb, Ni, Zn, Al, Fe, and Co were selected as additions to these alloys. However, research reports related to these modified SAC alloys are limited. To address this paucity, the present study reviews the effect of these minor alloying elements on the solder joint reliability of low-Ag-content SAC alloys in terms of thermal cycling and drop impact. Addition of Mn, Ce, Bi, and Ni to low-Ag-content SAC solder effectively improves the thermal-cycling reliability of joints without sacrificing the drop-impact performance. Taking into consideration the improvement in the bulk alloy microstructure and mechanical properties, wetting properties, and growth suppression of the interface intermetallic compound (IMC) layers, addition of Ti, In, Sb, Zn, Al, Fe, and Co to low-Ag-content SAC solder has the potential to improve the thermal-cycling reliability of joints without sacrificing the drop-impact performance. Consequently, further investigations of both thermal-cycling and drop reliability of these modified solder joints must be carried out in future work.


    XUE Songbai; WU Yuxiu; HAN Zongjie; WANG Jianxin


    The finite element method(FEM) is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum Simulation for QFP devices is also researched. The results indicate that when the lead pitches are the same, the maximum equivalent stress of the soldered joints increases with the increasing of lead widths, while the reliability of the soldered joints reduces. When the lead widths are the same, the maximum equivalent stress of the soldered joints doesn't decrease completely with the increasing of lead pitches, a minimum value of the maximum equivalent stress values exists in all the curves. Under this condition the maximum equivalent stress of the soldered joints is relatively the least, the reliability of soldered joints is high and the assembly is excellent. The simulating results indicate the best parameter: The lead width is 0.2 mm and lead pitch is 0.3 mm (the distance between two leads is 0.1 mm), which are benefited for the micromation of QFP devices now. The minimum value of the maximum equivalent stress of soldered joints exists while lead width is 0.25 mm and lead pitch is 0.35 mm (the distance between two leads is 0.1 mm), the devices can serve for a long time and the reliability is the highest, the assembly is excellent. The simulating results also indicate the fact that the lead width is 0.15 mm and lead pitch is 0.2 mm maybe the limit of QFP, which is significant for the high lead count and micromation of assembly.

  18. The critical oxide thickness for Pb-free reflow soldering on Cu substrate

    Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)


    Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

  19. Effects of Ga Addition on Interfacial Reactions Between Sn-Based Solders and Ni

    Wang, Chao-Hong; Li, Kuan-Ting


    The use of Ga as a micro-alloying element in Sn-based solders can change the microstructure of solder joints to improve the mechanical properties, and even suppress the interfacial intermetallic compound (IMC) growth. This research investigated the effects of Ga addition (0.2-1 wt.%Ga) on the IMC formation and morphological evolution in the Sn-based solder joints with Ni substrate. In the soldering reaction at 250°C and with less than 0.2 wt.%Ga addition, the formed phase was Ni3Sn4. When the Ga addition increased to 0.5 wt.%, it changed to a thin Ni2Ga3 layer of ˜1 μm thick, which stably existed at the interface in the initial 1-h reaction. Subsequently, the whole Ni2Ga3 layer detached from the Ni substrate and drifted into the molten solder. The Ni3Sn4 phase became dominant in the later stage. Notably, the Ga addition significantly reduced the grain size of Ni3Sn4, resulting in the massive spalling of Ni3Sn4 grains. With 1 wt.%Ga addition, the Ni2Ga3 layer remained very thin with no significant growth, and it stably existed at the interface for more than 10 h. In addition, the solid-state reactions were examined at temperatures of 160°C to 200°C. With addition of 0.5 wt.%Ga, the Ni3Sn4 phase dominated the whole reaction. By contrast, with increasing to 1 wt.%Ga, only a thin Ni2Ga3 layer was found even after aging at 160°C for more than 1200 h. The 1 wt.%Ga addition in solder can effectively inhibit the Ni3Sn4 formation in soldering and the long-term aging process.

  20. Gating of Permanent Molds for Aluminum Casting

    David Schwam; John F. Wallace; Tom Engle; Qingming Chang


    This report summarizes a two-year project, DE-FC07-011D13983 that concerns the gating of aluminum castings in permanent molds. The main goal of the project is to improve the quality of aluminum castings produced in permanent molds. The approach taken was to determine how the vertical type gating systems used for permanent mold castings can be designed to fill the mold cavity with a minimum of damage to the quality of the resulting casting. It is evident that somewhat different systems are preferred for different shapes and sizes of aluminum castings. The main problems caused by improper gating are entrained aluminum oxide films and entrapped gas. The project highlights the characteristic features of gating systems used in permanent mold aluminum foundries and recommends gating procedures designed to avoid common defects. The study also provides direct evidence on the filling pattern and heat flow behavior in permanent mold castings. Equipment and procedure for real time X-Ray radiography of molten aluminum flow into permanent molds have been developed. Other studies have been conducted using water flow and behavior of liquid aluminum in sand mold using real time photography. This investigation utilizes graphite molds transparent to X-Rays making it possible to observe the flow pattern through a number of vertically oriented grating systems. These have included systems that are choked at the base of a rounded vertical sprue and vertical gating systems with a variety of different ingates into the bottom of a mold cavity. These systems have also been changed to include gating systems with vertical and horizontal gate configurations. Several conclusions can be derived from this study. A sprue-well, as designed in these experiments, does not eliminate the vena contracta. Because of the swirling at the sprue-base, the circulating metal begins to push the entering metal stream toward the open runner mitigating the intended effect of the sprue-well. Improved designs of

  1. Future Specialist’s Professional Position Molding

    Irina A. Levitskaya


    Full Text Available The search of conditions for future specialist’s professional position molding is crucial nowadays. This article discloses the features of “position” notion essence in the context of professional self-determination, analyses the problems of future specialist’s professional development in terms of topical social and professional objectives solution, considers debatable issues of professional development as an integral continuous process of future specialist’s personality formation. The stages of personality professional molding are elaborated. The author determines the relation of professional position with different types of positions (social, personal, role-based. It is mentioned that professional position is determined by professional attitudes and characterizes person’s system of stable value relations towards future professional activities. The relation between the professional position molding and the professional orientation, determining person’s peculiarly experienced selective attitude towards reality, influencing his/her activity is emphasized

  2. Modelling and monitoring in injection molding

    Thyregod, Peter


    -conforning unit is only expected very rarely during sampling, a moving sum chart and a CUSUM chart are equivalent. Finally, the correlation structure of 21 process variables has been studied prior to monitoring the process. Is is illustrated how the process can be analysed with multivariate techniques......This thesis is concerned with the application of statistical methods in quality improvement of injection molded parts. The methods described are illustrated with data from the manufacturing of parts for a medical device. The emphasis has been on the variation between cavities in multi-cavity molds...... taken within the same machine set-point did not cause great variation compared to the two preceding sources of variation. A simple graphical approach is suggested for finding patterns in the cavity differences. Applying this method to data from a 16 cavity mold, a clear connection was found between...

  3. Injection molded self-cleaning surfaces

    Søgaard, Emil

    This PhD thesis concerns the development of superhydrophobic surfaces fabricated by injection molding. Today, injection molding is the prevalent production method for consumer plastic products. However, concerns regarding the environmental impact of a plastic production are increasing, especially...... that are superhydrophobic based on topography rather than chemical compounds. Therefore, a novel method for fabricating superhydrophobic polymer surfaces with excellent water-repellant properties is developed. The method is based on microstructure fabrication and superposed nanostructures on silicon wafers. The nano......° for structured surfaces with a drop roll-off angle of less than 2°. Thereby, it is shown that an extremely water repellant surface can be injection molded directly with clear perspectives for more environmental and healthier plastic consumer products....

  4. Single gate optimization for plastic injection mold

    LI Ji-quan; LI De-qun; GUO Zhi-ying; LV Hai-yuan


    This paper deals with a methodology for single gate location optimization for plastic injection mold. The objective of the gate optimization is to minimize the warpage of injection molded parts, because warpage is a crucial quality issue for most injection molded parts while it is influenced greatly by the gate location. Feature warpage is defined as the ratio of maximum displacement on the feature surface to the projected length of the feature surface to describe part warpage. The optimization is combined with the numerical simulation technology to find the optimal gate location, in which the simulated annealing algorithm is used to search for the optimum. Finally, an example is discussed in the paper and it can be concluded that the proposed method is effective.

  5. Neonatal Ear Molding: Timing and Technique.

    Anstadt, Erin Elizabeth; Johns, Dana Nicole; Kwok, Alvin Chi-Ming; Siddiqi, Faizi; Gociman, Barbu


    The incidence of auricular deformities is believed to be ∼11.5 per 10,000 births, excluding children with microtia. Although not life-threatening, auricular deformities can cause undue distress for patients and their families. Although surgical procedures have traditionally been used to reconstruct congenital auricular deformities, ear molding has been gaining acceptance as an efficacious, noninvasive alternative for the treatment of newborns with ear deformations. We present the successful correction of bilateral Stahl's ear deformity in a newborn through a straightforward, nonsurgical method implemented on the first day of life. The aim of this report is to make pediatric practitioners aware of an effective and simple molding technique appropriate for correction of congenital auricular anomalies. In addition, it stresses the importance of very early initiation of ear cartilage molding for achieving the desired outcome.

  6. Ultrasonically-assisted Polymer Molding: An Evaluation

    Moles, Matthew; Roy, Anish; Silberschmidt, Vadim

    Energy reduction in extrusion and injection molding processes can be achieved by the introduction of ultrasonic energy. Polymer flow can be enhanced on application of ultrasonic vibration, which can reduce the thermal and pressure input requirements to produce the same molding; higher productivity may also be achieved. In this paper, a design of an ultrasound-assisted injection mold machine is explored. An extrusion-die design was augmented with a commercial 1.5 kW ultrasonic transducer and sonotrode designed to resonate close to 20 kHz with up to 100 μm vibration amplitude. The design was evaluated with modal and thermal analysis using finite-element analysis software. The use of numerical techniques, including computational fluid dynamics, fluid-structure interaction and coupled Lagrangian-Eulerian method, to predict the effect of ultrasound on polymer flow was considered. A sonotrode design utilizing ceramic to enhance thermal isolation was also explored.

  7. Mechanical Properties and Microstructure Investigation of Lead Free Solder

    Wang, Qing; Gail, William F.; Johnson, R. Wayne; Strickland, Mark; Blanche, Jim


    While the electronics industry appears to be focusing on Sn-Ag-Cu as the alloy of choice for lead free electronics assembly, ,the exact composition varies by geographic region, supplier and user. Add to that dissolved copper and silver from the printed circuit board traces and surface finish, and there can be significant variation in the final solder joint composition. A systematic study of the mechanical and microstructural properties of Sn-Ag-Cu alloys with Ag varying from 2wt% to 4wt% and Cu varying from 0.5wt% to lSwt%, was undertaken in this research study. Different sample preparation techniques (water quenched, oil quenched and water quenched followed by reflow) were explored and the resulting microstructure compared to that of a typical reflowed lead free chip scale package (CSP) solder joint. Tensile properties (modulus, 0.2% yield strength and the ultimate tensile strength) and creep behavior of selected alloy compositions (Sn-4Ag-1 X u , Sn-4Ag-OSCu, Sn- 2Ag-1 X u , Sn-2Ag-OSCu, Sn-3.5Ag-O.SCu) were determined for three conditions: as- cast; aged for 100 hours at 125OC; and aged for 250 hours at 125OC. There was no significant difference in Young's Modulus as a function of alloy composition. After an initial decrease in modulus after 100 hours at 125"C, there was an insignificant change with further aging. The distribution of 0.2% strain yield stress and ultimate tensile strength as a function of alloy composition was more significant and decreased with aging time and temperature. The microstructures of these alloys were examined using light and scanning electron microscopy (LM and SEM) respectively and SEM based energy dispersive x-ray spectroscopy (EDS). Fracture surface and cross-section analysis were performed on the specimens after creep testing. The creep testing results and the effect of high temperature aging on mechanical properties is presented for the oil quenched samples. In general the microstructure of oil quenched specimen exhibited a

  8. Oxidation kinetics of thin copper films and wetting behaviour of copper and Organic Solderability Preservatives (OSP) with lead-free solder

    Ramirez, Mauricio, E-mail: [Robert Bosch GmbH, Robert-Bosch-Strasse 2, 71701 Schwieberdingen (Germany); Chair for Surface Science and Corrosion, University of Erlangen-Nuremberg, Martensstrasse 7, 91058 Erlangen (Germany); Henneken, Lothar [Robert Bosch GmbH, Robert-Bosch-Strasse 2, 71701 Schwieberdingen (Germany); Virtanen, Sannakaisa [Chair for Surface Science and Corrosion, University of Erlangen-Nuremberg, Martensstrasse 7, 91058 Erlangen (Germany)


    The oxide formation on thin copper films deposited on Si wafer was studied by XPS, SEM and Sequential Electrochemical Reduction Analysis SERA. The surfaces were oxidized in air with a reflow oven as used in electronic assembly at temperatures of 100 deg. C, 155 deg. C, 200 deg. C, 230 deg. C and 260 deg. C. The SERA analyses detected only the formation of Cu{sub 2}O but the XPS analysis done for the calibration of the SERA equipment proved also the presence of a CuO layer smaller than 2 nm above the Cu{sub 2}O oxide. The oxide growth follows a power-law dependence on time within this temperature range and an activation energy of 33.1 kJ/mol was obtained. The wettability of these surfaces was also determined by measuring the contact angle between solder and copper substrate after the soldering process. A correlation between oxide thickness and wetting angle was established. It was found that the wetting is acceptable only when the oxide thickness is smaller than 16 nm. An activation energy of 27 kJ/mol was acquired for the spreading of lead free solder on oxidized copper surfaces. From wetting tests on copper surfaces protected by Organic Solderability Preservatives (OSP), it was possible to calculate the activation energy for the thermal decomposition of these protective layers.

  9. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak


    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys (T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

  10. Monitoring of solidification in the continuous casting mold by temperature sensors

    Pyszko, René; Příhoda, Miroslav; Čarnogurská, Mária


    Defects of continuously cast strand, such as unevenness of shell thickness or cracks as well as unstable casting parameters result in changes of strand surface temperature which affect heat flux and temperature field in the mold wall. Methods based on the principle of measurement and mathematical processing of temperatures in the mold wall are used for the purposes of diagnostics of the shell formation process, prediction of surface and subsurface quality and breakout danger, adjustment of the casting axis or condition monitoring of the oscillating mechanism. Measured values of temperatures in the wall depend on the exact position of the sensor in the wall, especially in the normal direction to the mold working surface. Ensuring the accurate and constant distance between the sensor and the mold surface is technically demanding; therefore it is necessary to correct the measured temperatures mathematically. The article describes two methods for correcting the measured temperatures, based on physical and statistical principles that have been developed and used in a real diagnostics system. Practical applications of the methods for diagnostics of strand surface quality and breakout prediction are presented.

  11. The Elastic Mold Deformation During the Filling and Packing Stage of the Injection Molding Process

    Stefan Kleindel


    Full Text Available The accurate numerical prediction of the mold filling process of long and thin walled parts is dependent on numerous factors. This paper investigates the effect of various influencing variables on the filling pattern by means of simulation and experimental validation. It was found that mold temperature, process settings and venting conditions have little effect on the predicted filling pattern. However, in the actual case study, the filling behavior observed during the experiments was significantly different compared to the numerical prediction. A structural finite element analysis of the moving mold half showed an unacceptable large deformation of the mold plates under injection pressure. A very good correlation between simulation and experiment was attained after improving the stiffness of the mold. Therefore it can be concluded, that the elasticity of the mold may have a significant influence on the filling pattern when long and thin walled products are considered. Furthermore, it was shown, that even an apparently stiff mold can exhibit a distinct deformation during filling and packing stage.

  12. Numerical recipes for mold filling simulation

    Kothe, D.; Juric, D.; Lam, K.; Lally, B.


    Has the ability to simulate the filling of a mold progressed to a point where an appropriate numerical recipe achieves the desired results? If results are defined to be topological robustness, computational efficiency, quantitative accuracy, and predictability, all within a computational domain that faithfully represents complex three-dimensional foundry molds, then the answer unfortunately remains no. Significant interfacial flow algorithm developments have occurred over the last decade, however, that could bring this answer closer to maybe. These developments have been both evolutionary and revolutionary, will continue to transpire for the near future. Might they become useful numerical recipes for mold filling simulations? Quite possibly. Recent progress in algorithms for interface kinematics and dynamics, linear solution methods, computer science issues such as parallelization and object-oriented programming, high resolution Navier-Stokes (NS) solution methods, and unstructured mesh techniques, must all be pursued as possible paths toward higher fidelity mold filling simulations. A detailed exposition of these algorithmic developments is beyond the scope of this paper, hence the authors choose to focus here exclusively on algorithms for interface kinematics. These interface tracking algorithms are designed to model the movement of interfaces relative to a reference frame such as a fixed mesh. Current interface tracking algorithm choices are numerous, so is any one best suited for mold filling simulation? Although a clear winner is not (yet) apparent, pros and cons are given in the following brief, critical review. Highlighted are those outstanding interface tracking algorithm issues the authors feel can hamper the reliable modeling of today`s foundry mold filling processes.

  13. Methane Flux

    U.S. Geological Survey, Department of the Interior — Methane (CH4) flux is the net rate of methane exchange between an ecosystem and the atmosphere. Data of this variable were generated by the USGS LandCarbon project...

  14. Powder injection molding of pure titanium

    GUO Shibo; DUAN Bohua; HE Xinbo; QU Xuanhui


    An improved wax-based binder was developed for powder injection molding of pure titanium. A critical powder loading of 69 vol.% and a pseudo-plastic flow behavior were obtained by the feedstock based on the binder. The injection molding, debinding, and sintering process were studied. An ideal control of carbon and oxygen contents was achieved by thermal debinding in vacuum atmosphere (10-3 Pa). The mechanical properties of as-sintered specimens were less than those of titanium made by the conventional press-sintering process. Good shape retention and ±0.04 mm dimension deviation were achieved.

  15. Natural latex (Hevea brasiliensis) mold for neovaginoplasty


    OBJETIVO: avaliar a utilização do molde de látex natural (Hevea brasiliensis) como modificação à neovaginoplastia de McIndoe e Bannister em pacientes portadoras da síndrome de Mayer-Rokitansky-Küster-Hauser (MRKH). MÉTODOS: análise retrospectiva de nove pacientes com o diagnóstico de síndrome de MRKH, submetidas à neovaginoplastia pela técnica de McIndoe e Bannister com molde de látex natural. Foram avaliadas epitelização, amplitude e profundidade das neovaginas, ocorrência de coitos bem como...

  16. Reduction of Injection Pressure for Thin Walled Molding using the Laser Metal Sintered Mold

    米山, 猛; 内藤, 圭亮; 阿部, 諭; 宮丸, 充


    Using milling combined laser metal sintering, porous surface has been fabricated on the thin walled cavity closed by the surrounded thick cavity in the injection mold. Resin flows into the cavity of 2mm thick at first around the thin part and then flows into the thin cavity of 0.2mm thick with 11mm square by packing pressure. The packing pressure for filling the thin part was compared among laser metal sintered mold with or without porous surface, steel mold with or without porous block. The ...

  17. Relationship Between Casting Distortion, Mold Filling, and Interfacial Heat Transfer in Sand Molds

    J. K. Parker; K. A. Woodbury; T. S. Piwonka; Y. Owusu


    This project sought to determine the relationship between casting dimensions and interfacial heat transfer in aluminum alloy sand castings. The program had four parts; measurement of interfacial heat transfer coefficients in resin bonded and green sand molds, the measurement of gap formation in these molds, the analysis of castings made in varying gatings, orientations and thicknesses, and the measurement of residual stresses in castings in the as-cast and gate removed condition. New values for interfacial heat transfer coefficients were measured, a novel method for gap formation was developed, and the variation of casting dimensions with casting method, gating, and casting orientation in the mold was documented.

  18. Chemotaxis in the Plasmodial Slime Mold, Physarum polycephalum.

    Bozzone, Donna M.; Martin, Denise A.


    Describes a biology unit designed so that students pose their own questions and perform experiments to answer these questions. Plasmodial slime mold is employed as the focus of the study with background information about the mold provided. (DDR)

  19. EPA Scientists Develop Research Methods for Studying Mold Fact Sheet

    In 2002, U.S. Environmental Protection Agency researchers developed a DNA-based Mold Specific Quantitative Polymerase Chain Reaction method (MSQPCR) for identifying and quantifying over 100 common molds and fungi.

  20. Brief Guide to Mold, Moisture, and Your Home

    ... plastic or rubber and have removable cartridges that trap most of the mold spores from entering. In ... thank Paul Ellringer, PE, CIH, for providing the photo of Mold growing on the back side of ...

  1. Affordable, Precision Reflector Mold Technology (PDRT08-029) Project

    National Aeronautics and Space Administration — Advances in replication mold technology that reduce material costs, grinding time, and polishing time would enable fabrication of large, precision molds and possibly...

  2. Tool steel quality and surface finishing of plastic molds

    Rafael Agnelli Mesquita


    Full Text Available Plastic industry is today in a constant growth, demanding several products from other segments, which includes the plastic molds, mainly used in the injection molding process. Considering all the requirements of plastic molds, the surface finishing is of special interest, as the injected plastic part is able to reproduce any details (and also defects from the mold surface. Therefore, several aspects on mold finishing are important, mainly related to manufacturing conditions - machining, grinding, polishing and texturing, and also related to the tool steel quality, in relation to microstructure homogeneity and non-metallic inclusions (cleanliness. The present paper is then focused on this interrelationship between steel quality and manufacturing process, which are both related to the final quality of plastic mold surfaces. Examples are discussed in terms of surface finishing of plastic molds and the properties or the microstructure of mold steels.

  3. Exploring the problem of mold growth and the efficacy of various mold inhibitor methods during moisture sorption isotherm measurements.

    Yu, X; Martin, S E; Schmidt, S J


    Mold growth is a common problem during the equilibration of food materials at high relative humidity values using the standard saturated salt slurry method. Exposing samples to toluene vapor and mixing samples with mold inhibitor chemicals are suggested methods for preventing mold growth while obtaining isotherms. However, no published research was found that examined the effect of mold growth on isotherm performance or the efficacy of various mold inhibitor methods, including their possible effect on the physicochemical properties of food materials. Therefore, the objectives of this study were to (1) explore the effect of mold growth on isotherm performance in a range of food materials, (2) investigate the effectiveness of 4 mold inhibitor methods, irradiation, 2 chemical inhibitors (potassium sorbate and sodium acetate), and toluene vapor, on mold growth on dent corn starch inoculated with A. niger, and (3) examine the effect of mold inhibitor methods on the physicochemical properties of dent corn starch, including isotherm performance, pasting properties, gelatinization temperature, and enthalpy. Mold growth was found to affect starch isotherm performance by contributing to weight changes during sample equilibration. Among the 4 mold inhibitor methods tested, irradiation and toluene vapor were found to be the most effective for inhibiting growth of A. niger on dent cornstarch. However, both methods exhibited a significant impact on the starches' physiochemical properties, suggesting the need to probe the efficacy of other mold inhibitor methods and explore the use of new rapid isotherm instruments, which hamper mold growth by significantly decreasing measurement time.

  4. CO₂ laser welding of corneal cuts with albumin solder using radiometric temperature control.

    Strassmann, Eyal; Livny, Eitan; Loya, Nino; Kariv, Noam; Ravid, Avi; Katzir, Abraham; Gaton, Dan D


    To examine the efficacy and reproducibility of CO₂ laser soldering of corneal cuts using real-time infrared fiber-optic radiometric control of tissue temperature in bovine eyes (in vitro) and to evaluate the duration of this procedure in rabbit eyes (in vivo). In vitro experiment: a 6-mm central perforating cut was induced in 40 fresh bovine eyes and sealed with a CO₂ laser, with or without albumin soldering, following placement of a single approximating nylon suture. A fiber-optic radiometric temperature control system for the CO₂ laser was used. Leaking pressure and histological findings were analyzed and compared between groups. In vivo experiment: following creation of a central perforation, 6 rabbit eyes were treated with a CO₂ laser with albumin solder and 6 rabbit eyes were treated with 10-0 nylon sutures. The amount of time needed for completion of the procedures was compared. In vitro experiment: effective sealing was achieved by CO₂ laser soldering. Mean (± SD) leaking pressure was 109 ± 30 mm Hg in the bovine corneas treated by the laser with albumin solder compared to 51 ± 7 mm Hg in the sutured control eyes (n = 10 each; p laser without albumin solder (48 ± 12 mm Hg) and in the cuts sealed only with albumin without laser welding (6.3 ± 4 mm Hg) than in the cuts treated with laser welding and albumin solder. In vivo experiment: mean surgical time was 140 ± 17 s in the laser-treated rabbits compared to 330 ± 30 s in the sutured controls (n = 6; p laser soldering revealed sealed corneal edges with a small gap bridged by coagulated albumin. The inflammatory reaction was minimal in contrast to the sutured controls. No thermal damage was detected at the wound edges. CO₂ laser soldering combined with the fiber-optic radiometer is an effective, reliable, and rapid tool for the closure of corneal wounds, and holds advantages over conventional suturing in terms of leaking pressure and surgical time. Copyright © 2013 S. Karger AG, Basel.

  5. Mechanical Shock Behavior of Environmentally-Benign Lead-free Solders

    Yazzie, Kyle

    The mechanical behavior of Pb-free solder alloys is important, since they must maintain mechanical integrity under thermomechanical fatigue, creep, and mechanical shock conditions. Mechanical shock, in particular, has become an increasing concern in the electronics industry, since electronic packages can be subjected to mechanical shock by mishandling during manufacture or by accidental dropping. In this study, the mechanical shock behavior of Sn and Sn-Ag-Cu alloys was systematically analyzed over the strain rate range 10-3 -- 30 s-1 in bulk samples, and over 10-3 -- 12 s-1 on the single solder joint level. More importantly, the influences of solder microstructure and intermetallic compounds (IMC) on mechanical shock resistance were quantified. A thorough microstructural characterization of Sn-rich alloys was conducted using synchrotron x-ray computed tomography. The three-dimensional morphology and distribution of contiguous phases and precipitates was analyzed. A multiscale approach was utilized to characterize Sn-rich phases on the microscale with x-ray tomography and focused ion beam tomography to characterize nanoscale precipitates. A high strain rate servohydraulic test system was developed in conjunction with a modified tensile specimen geometry and a high speed camera for quantifying deformation. The effect of microstructure and applied strain rate on the local strain and strain rate distributions were quantified using digital image correlation. Necking behavior was analyzed using a novel mirror fixture, and the triaxial stresses associated with necking were corrected using a self-consistent method to obtain the true stress-true strain constitutive behavior. Fracture mechanisms were quantified as a function of strain rate. Finally, the relationship between solder microstructure and intermetallic compound layer thickness with the mechanical shock resistance of Sn-3.8Ag-0.7Cu solder joints was characterized. It was found that at low strain rates the dynamic

  6. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao


    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  7. The influence of heat treatment on properties of lead-free solders

    Lýdia Trnková Rízeková


    Full Text Available The article is focused on the analysis of degradation of properties of two eutectic lead-free solders SnCu0.7 and SnAg3.5Cu0.7. The microstructures of the intermetallic compound (IMC layers at the copper substrate - solder interface were examined before and after heat treatment at 150°C for 50, 200, 500 and 1000 hours. The thickness of IMC layers of the Cu6Sn5 phase was growing with the increasing time of annealing and shown the typical scallops. For the heat treatment times of 200 hours and longer, the Cu3Sn IMC layers located near the Cu substrate were also observed. The experiments showed there is a link between the thickness of IMC layers and decrease of the shear strength of solder joints. In general, the joints made of the ternary solder showed higher shear strength before and after heat treatment in comparison to joints from solder SnCu0.7.

  8. Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders

    Kim, Seongjun; Kim, Keun-Soo; Kim, Sun-Sik; Suganuma, Katsuaki


    Interfacial reaction and die attach properties of Zn- xSn ( x = 20 wt.%, 30 wt.%, and 40 wt.%) solders on an aluminum nitride-direct bonded copper substrate were investigated. At the interface with Si die coated with Au/TiN thin layers, the TiN layer did not react with the solder and worked as a good protective layer. At the interface with Cu, CuZn5, and Cu5Zn8 IMC layers were formed, the thicknesses of which can be controlled by joining conditions such as peak temperature and holding time. During multiple reflow treatments at 260°C, the die attach structure was quite stable. The shear strength of the Cu/solder/Cu joint with Zn-Sn solder was about 30 MPa to 34 MPa, which was higher than that of Pb-5Sn solder (26 MPa). The thermal conductivity of Zn-Sn alloys of 100 W/m K to 106 W/m K was sufficiently high and superior to those of Au-20Sn (59 W/m K) and Pb-5Sn (35 W/m K).

  9. Application of robust color composite fringe in flip-chip solder bump 3-D measurement

    Kuo, Chung-Feng Jeffrey; Wu, Han-Cheng


    This study developed a 3-D measurement system based on flip-chip solder bump, used fringes with different modulation intensities in color channels, in order to produce color composite fringe with robustness, and proposed a multi-channel composite phase unwrapping algorithm, which uses fringe modulation weights of different channels to recombine the phase information for better measurement accuracy and stability. The experimental results showed that the average measurement accuracy is 0.43μm and the standard deviation is 1.38 μm. The results thus proved that the proposed 3-D measurement system is effective in measuring a plane with a height of 50 μm. In the flip-chip solder bump measuring experiment, different fringe modulation configurations were tested to overcome the problem of reflective coefficient between the flip-chip base board and the solder bump. The proposed system has a good measurement results and robust stability in the solder bump measurement, and can be used for the measurement of 3-D information for micron flip-chip solder bump application.

  10. Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints

    Kim, Kyoung-Ho; Koike, Junichi; Yoon, Jeong-Won; Yoo, Sehoon


    The wetting behavior, interfacial reactions, and mechanical reliability of Sn-Ag-Cu solder on a plasma-coated printed circuit board (PCB) substrate were evaluated under multiple heat-treatments. Conventional organic solderability preservative (OSP) finished PCBs were used as a reference. The plasma process created a dense and highly cross-linked polymer coating on the Cu substrates. The plasma finished samples had higher wetting forces and shorter zero-cross times than those with OSP surface finish. The OSP sample was degraded after sequential multiple heat treatments and reflow processes, whereas the solderability of the plasma finished sample was retained after multiple heat treatments. After the soldering process, similar microstructures were observed at the interfaces of the two solder joints, where the development of intermetallic compounds was observed. From ball shear tests, it was found that the shear force for the plasma substrate was consistently higher than that for the OSP substrate. Deterioration of the OSP surface finish was observed after multiple heat treatments. Overall, the plasma surface finish was superior to the conventional OSP finish with respect to wettability and joint reliability, indicating that it is a suitable material for the fabrication of complex electronic devices.

  11. Electrical Resistance of the Solder Connections for the Consolidation of the LHC Main Interconnection Splices

    Lutum, R; Scheuerlein, C


    For the consolidation of the LHC 13 kA main interconnection splices, shunts will be soldered onto each of the 10170 splices. The solder alloy selected for this purpose is Sn60Pb40. In this context the electrical resistance of shunt to busbar lap splices has been measured in the temperature range from RT to 20 K. A cryocooler set-up has been adapted such that a test current of 150 A could be injected for accurate resistance measurements in the low nΩ range. To study the influence of the solder bulk resistivity on the overall splice resistance, connections produced with Sn96Ag4 and Sn77.2In20Ag2.8 have been studied as well. The influence of the Sn60Pb40 solder resistance is negligible when measuring the splice resistance in a longitudinal configuration over a length of 6 cm. In a transverse measurement configuration the splice resistance is significantly influenced by the solder. The connections prepared with Sn77.2In20Ag2.8 show significantly higher resistance values, as expected from the relatively high sol...

  12. In situ X-ray observation and simulation of ratcheting-fatigue interactions in solder joints

    Shi, Liting; Mei, Yunhui; Chen, Gang; Chen, Xu


    Reflow voids created by solder oxidation reduce the reliability of lap joints. In situ visualization of reflow voids in Sn-3Ag-0.5Cu (SAC305) lap-shear solder joints under cyclic stressing was realized by X-ray computed tomography (CT), while the ratcheting deformation of the solder joints was monitored by a non-contact displacement detecting system (NDDS). The results revealed that the shape evolution of reflow voids in solder joints, as characterized by the sphericity of the voids, can be divided into three stages: i.e., the initial stage with a sharp drop, a stable stage, and a rapidly declining stage. A new evolution law for describing the progress of sphericity was proposed, and was further introduced into a viscoplastic constitutive model based on the OW-AF nonlinear kinematic hardening rule. The damage-coupled OW-AF model yielded an accurate estimation of the whole-life ratcheting behavior of Sn-3Ag-0.5Cu (SAC305) lap-shear solder joints. [Figure not available: see fulltext.

  13. The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance

    Lee, Tae-Kyu; Zhou, Bite; Bieler, Thomas R.; Tseng, Chien-Fu; Duh, Jeng-Gong


    The mechanical stability of solder joints with Pd added to Sn-Ag-Cu alloy with different aging conditions was investigated in a high- G level shock environment. A test vehicle with three different strain and shock level conditions in one board was used to identify the joint stability and failure modes. The results revealed that Pd provided stability at the package-side interface with an overall shock performance improvement of over 65% compared with the Sn-Ag-Cu alloy without Pd. A dependency on the pad structure was also identified. However, the strengthening mechanism was only observed in the non-solder mask defined (NSMD) pad design, whereas the solder mask defined (SMD) pad design boards showed no improvement in shock performance with Pd-added solders. The effects of Sn grain orientation on shock performance, interconnect stability, and crack propagation path with and without Pd are discussed. The SAC305 + Pd solder joints showed more grain refinements, recrystallization, and especially mechanical twin deformation during the shock test, which provides a partial explanation for the ability of SAC305 + Pd to absorb more shock-induced energy through active deformation compared with SAC305.

  14. Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

    Kang, Sung K.; Leonard, Donovan; Shih, Da-Yuan; Gignac, Lynne; Henderson, D. W.; Cho, Sungil; Yu, Jin


    The near-ternary eutectic Sn-Ag-Cu alloys have been identified as leading Pb-free solder candidates to replace Pb-bearing solders in microelectronic applications. However, recent investigations on the processing behavior and solder joints reliability assessment have revealed several potential reliability risk factors associated with the alloy system. The formation of large Ag3Sn plates in Sn-Ag-Cu joints, especially when solidified in a relatively slow cooling rate, is one issue of concern. The implications of large Ag3Sn plates on solder joint performance and several methods to control them have been discussed in previous studies. The minor Zn addition was found to be effective in reducing the amount of undercooling required for tin solidification and thereby to suppress the formation of large Ag3Sn plates. The Zn addition also caused the changes in the bulk microstructure as well as the interfacial reaction. In this paper, an in-depth characterization of the interfacial reaction of Zn-added Sn-Ag-Cu solders on Cu and Au/Ni(P) surface finishes is reported. The effects of a Zn addition on modification of the interfacial IMCs and their growth kinetics are also discussed.

  15. Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates

    Leinenbach, C.; Valenza, F.; Giuranno, D.; Elsener, H. R.; Jin, S.; Novakovic, R.


    Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substrates have been investigated. Good wetting on both substrates with final contact angles of 13° to 14° was observed. In addition, solder joints with bond shear strength of 30 MPa to 35 MPa could be produced under controlled conditions. Cu substrates exhibit pronounced dissolution into the Au-Ge filler metal. On Ni substrates, the NiGe intermetallic compound was formed at the filler/substrate interface, which prevents dissolution of Ni into the solder. Using thin filler metal foils (25 μm), complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of an almost pure Au layer in the soldering zone.

  16. Metal ion release from silver soldering and laser welding caused by different types of mouthwash.

    Erdogan, Ayse Tuygun; Nalbantgil, Didem; Ulkur, Feyza; Sahin, Fikrettin


    To compare metal ion release from samples welded with silver soldering and laser welding when immersed into mouthwashes with different ingredients. A total of 72 samples were prepared: 36 laser welded and 36 silver soldered. Four samples were chosen from each subgroup to study the morphologic changes on their surfaces via scanning electron microscopy (SEM). Each group was further divided into four groups where the samples were submerged into mouthwash containing sodium fluoride (NaF), mouthwash containing sodium fluoride + alcohol (NaF + alcohol), mouthwash containing chlorhexidine (CHX), or artificial saliva (AS) for 24 hours and removed thereafter. Subsequently, the metal ion release from the samples was measured with inductively coupled plasma mass spectrometry (ICP-MS). The metal ion release among the solutions and the welding methods were compared. The Kruskal-Wallis and analysis of variance (ANOVA) tests were used for the group comparisons, and post hoc Dunn multiple comparison test was utilized for the two group comparisons. The level of metal ion release from samples of silver soldering was higher than from samples of laser welding. Furthermore, greater amounts of nickel, chrome, and iron were released from silver soldering. With regard to the mouthwash solutions, the lowest amounts of metal ions were released in CHX, and the highest amounts of metal ions were released in NaF + alcohol. SEM images were in accord with these findings. The laser welding should be preferred over silver soldering. CHX can be recommended for patients who have welded appliances for orthodontic reasons.

  17. 240 Mold Sensitization in Chronic Rhinosinusitis Patients


    Background It is estimated that about 10% of the population have IgE antibodies to common inhalant molds. Exposure to fungal allergens could be linked to the presence and persistence of asthma, rhinitis and atopic dermatitis. Mold sensitization is a risk factor for development and deterioration of upper airway allergy, especially chronic rhinosinusitis. We addressed the incidence of mold allergy measured as specific IgE to molds and skin prick tests in chronic sinusitis patients. We assessed ...




    Full Text Available Sheet metal molding design with classical methods is formed in very long times calculates and drafts. At the molding design, selection and drafting of most of the components requires very long time because of similar repetative processes. In this study, a molding design program has been developed by using AutoLISP which has been adapted AutoCAD packet program. With this study, design of sheet metal molding, dimensioning, assemly drafting has been realized.

  19. Effects of Ni-coated Carbon Nanotubes addition on the electromigration of Sn–Ag–Cu solder joints

    Yang, Zhongbao; Zhou, Wei; Wu, Ping, E-mail:


    Highlights: •The electromigration behaviors of the composite solder joints were investigated. •The presence of Ni altered the morphology of the IMC layer after reflow. •Carbon nanotube network was observed in solder matrix. •Current crowding occurred at the carbon nanotube networks. •The electromigration effect of composite solder joint was suppressed effectively. -- Abstract: The electromigration behaviors of line-type Cu/Sn–Ag–Cu/Cu interconnects with and without Ni-Coated multi-walled Carbon Nanotubes addition were investigated in this work. After soldering, the (Cu,Ni){sub 6}Sn{sub 5} intermetallic compounds formed at the solder/Cu interface. The electromigration analysis shows that the presence of Carbon Nanotubes can suppress the atomic diffusion in the solder induced by electromigration effectively. And finite element simulation indicates that the Carbon Nanotube networks can reduce the current density in the solder matrix, which results in the improvement of electromigration resistance of composite solders.

  20. Development of aluminum, manganese, and zinc-doped tin-silver-copper-X solders for electronic assembly

    Boesenberg, Adam James

    The global electronic assembly community is striving for a robust replacement for leaded solders due to increased environmental regulations. A family of Pb-free solder alloys based on Sn-Ag-Cu (SAC) compositions has shown promise; but reliability issues in certain assembly and operating environments have arisen. Elemental (X) additions (Al, Mn, Zn) to SAC3595 were developed recently for better control of heterogeneous nucleation in solder joint solidification. Cu substrate solderability of these SAC+X alloys was investigated at concentrations between 0.01-0.25 wt. % using globule wetting balance tests due to concern about increased oxidation during reflow. Asymmetric four point bend (AFPB) tests were conducted on as-soldered and thermally aged specimens to investigate correlation between decreased shear strength and extended aging time; a common phenomenon seen in solder joints in service. Composition dependence of these X additions also was explored in simplified Cu joints by differential scanning calorimetry (DSC) and joint microstructure analysis to determine the coupling between undercooling and solidification morphology on single and multiple reflow cycles. Interesting observations by methods such as x-ray diffraction (XRD) and nano-indentation of SAC solder joints with aluminum elemental additions led to promising results and provided a possible solution to promoting heterogeneous nucleation and high reliability in these solder alloys.

  1. Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies

    Vianco, P.; Rejent, J. [Sandia National Labs., Albuquerque, NM (United States); Artaki, I.; Ray, U.; Finley, D.; Jackson, A. [AT and T Bell Labs., Princeton, NJ (United States)


    Enhanced performance goals and environmental restrictions have heightened the consideration for use of alternative solders as replacements for the traditional tin-lead (Sn-Pb) eutectic and near-eutectic alloys. However, the implementation of non-Pb bearing surface finishes may lag behind solder alloy development. A study was performed which examined the effect(s) of Pb contamination on the performance of Sn-Ag-Bi and Sn-Ag-Cu-Sb lead-free solders by the controlled addition of 63Sn-37Pb solder at levels of 0.5 {minus} 8.0 wt.%. Thermal analysis and ring-in-plug shear strength studies were conducted on bulk solder properties. Circuit board prototype studies centered on the performance of 20I/O SOIC gull wing joints. Both alloys exhibited declines in their melting temperatures with greater Sn-Pb additions. The ring-in-plug shear strength of the Sn-Ag-Cu-Sb solder increased slightly with Sn-Pb levels while the Sn-Ag-Bi alloy experienced a strength loss. The mechanical behavior of the SOIC (Small Outline Integrated Circuit) Sn-Ag-Bi solder joints reproduced the strength levels were insensitive to 10,106 thermal cycles. The Sn-Ag-Cu-Sb solder showed a slight decrease in the gull wing joint strengths that was sensitive to the Pb content of the surface finish.

  2. Modeling Material Properties of Lead-Free Solder Alloys

    Guo, Zhanli; Saunders, Nigel; Miodownik, Peter; Schillé, Jean-Philippe


    A full set of physical and thermophysical properties for lead-free solder (LFS) alloys have been calculated, including liquidus/solidus temperatures, fraction solid, density, coefficient of thermal expansion, thermal conductivity, Young’s modulus, viscosity, and liquid surface tension, all as a function of composition and temperature (extending into the liquid state). The results have been extensively validated against data available in the literature. A detailed comparison of the properties of two LFS alloys Sn-20In-2.8Ag and Sn-5.5Zn-4.5In-3.5Bi with Sn-37Pb has been made to show the utility and need for calculations that cover a wide range of properties, including the need to consider the effect of nonequilibrium cooling. The modeling of many of these properties follows well-established procedures previously used in JMatPro software for a range of structural alloys. This paper describes an additional procedure for the calculation of the liquid surface tension for multicomponent systems, based on the Butler equation. Future software developments are reviewed, including the addition of mechanical properties, but the present calculations can already make a useful contribution to the selection of appropriate new LFS alloys.

  3. 21 CFR 874.3430 - Middle ear mold.


    ... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Middle ear mold. 874.3430 Section 874.3430 Food... DEVICES EAR, NOSE, AND THROAT DEVICES Prosthetic Devices § 874.3430 Middle ear mold. (a) Identification. A middle ear mold is a preformed device that is intended to be implanted to reconstruct the middle...

  4. Process and part filling control in micro injection molding

    Tosello, Guido; Hansen, Hans Nørgaard; Schoth, Andreas


    The influence of process parameters on μ-injection molding (μIM) and on μ-injection molded parts has been investigated using Design of Experiments. A mold with a sensor applied at injection location was used to monitor actual injection pressure and to determine the cavity filling time. Flow markers...

  5. Comparison of two setups for induction heating in injection molding

    Menotti, Stefano; Hansen, Hans Nørgaard; Bissacco, Giuliano


    To eliminate defects and improve the quality of molded parts, increasing the mold temperature is one of the applicable solutions. A high mold temperature can increase the path flow of the polymer inside the cavity allowing reduction of the number of injection points, reduction of part thickness, ...

  6. Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder

    Lin, D. C.; Srivatsan, T. S.; Wang, G.-X.; Kovacevic, R.


    This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, the eutectic Sn-3.5%Ag, and its composite counterparts. Direct temperature recordings for the no-clean solder paste during the simulated reflow process revealed a significant amount of undercooling to occur prior to the initiation of solidification of the eutectic Sn-3.5%Ag solder, which is 6.5 °C, and for the composite counterparts, it is dependent on the percentage of copper nanopowder. Temperature recordings revealed the same temperature level of 221 °C for both melting (from solid to liquid) and final solidification (after recalescence) of the Sn-3.5%Ag solder. Addition of copper nanoparticles was observed to have no appreciable influence on melting temperature of the composite solder. However, it does influence solidification of the composite solder. The addition of 0.5 wt.% copper nanoparticles lowered the solidification temperature to 219.5 °C, while addition of 1.0 wt.% copper nanoparticles lowered the solidification temperature to 217.5 °C, which is close to the melting point of the ternary eutectic Sn-Ag-Cu solder alloy, Sn-3.7Ag-0.9Cu. This indicates the copper nanoparticles are completely dissolved in the eutectic Sn-3.5%Ag solder and precipitate as the Cu6Sn5, which reinforces the eutectic solder. Optical microscopy observations revealed the addition of 1.0 wt.% of copper nanoparticles to the Sn-3.5%Ag solder results in the formation and presence of the intermetallic compound Cu6Sn5. These particles are polygonal in morphology and dispersed randomly through the solder matrix. Addition of microsized copper particles cannot completely dissolve in the eutectic solder and projects a sunflower morphology with the solid copper particle surrounded by the Cu6Sn5 intermetallic compound coupled with residual porosity present in the solder sample. Microhardness measurements revealed the addition of copper nanopowder to the eutectic Sn-3.5%Ag solder resulted in

  7. Fabrication of silicon molds for polymer optics

    Nilsson, Daniel; Jensen, Søren; Menon, Aric Kumaran


    A silicon mold used for structuring polymer microcavities for optical applications is fabricated, using a combination of DRIE (deep reactive ion etching) and anisotropic chemical wet etching with KOH + IPA. For polymer optical microcavities, low surface roughness and vertical sidewalls are often...

  8. Onychomycosis by molds. Report of 78 cases.

    Bonifaz, Alexandro; Cruz-Aguilar, Pamela; Ponce, Rosa María


    A retrospective study of onychomycohosis by molds was carried out during a 14-year period (1992-2005). All cases were clinically and mycologically proven (repetitive KOH and culture) and then each of the molds was identified. A total of 5,221 cases of onychomycosis were evaluated, 78 of which were molds (1.49%). Mean patient age was 44.1 years. 75/78 cases occurred in toenails. Associated factors were detected in 39/78 (50.0%) cases, with the major ones being: peripheral vascular disease, contact with soil, and trauma. The most frequent clinical presentation was distal and lateral subungual onychomycosis (DLSO), in 54/78 cases (69%). The most frequent causative agents were: Scopulariopsis brevicaulis in 34/78 cases and Aspergillus niger in 13/78 cases. Onychomycoses by molds are infrequent; in this study they accounted for 1.49% of cases. The clinical features are virtually similar to those caused by dermatophytes, which makes the clinicomycological tests necessary.

  9. Flexible Interior-Impression-Molding Tray

    Anders, Jeffrey E.


    Device used inside combustion chamber of complicated shape for nondestructive evaluation of qualities of welds, including such features as offset, warping, misalignment of parts, and dropthrough. Includes flexible polypropylene tray trimmed to fit desired interior surface contour. Two neodymium boron magnets and inflatable bladder attached to tray. Tray and putty inserted in cavity to make mold of interior surface.

  10. Molding cork sheets to complex shapes

    Sharpe, M. H.; Simpson, W. G.; Walker, H. M.


    Partially cured cork sheet is easily formed to complex shapes and then final-cured. Temperature and pressure levels required for process depend upon resin system used and final density and strength desired. Sheet can be bonded to surface during final cure, or can be first-formed in mold and bonded to surface in separate step.

  11. Epidemics of mold poisoning past and present.

    Meggs, William J


    Molds are ubiquitous throughout the biosphere of planet earth and cause infectious, allergic, and toxic diseases. Toxic diseases arise from exposure to mycotoxins produced by molds. Throughout history, there have been a number of toxic epidemics associated with exposure to mycotoxins. Acute epidemics of ergotism are caused by consumption of grain infested by fungi of the genus Claviceps, which produce the bioactive amine ergotamine that mimics the neurotransmitters norepinephrine, serotonin, and dopamine. Acute aflatoxin outbreaks have occurred from ingestion of corn stored in damp conditions that potentiate growth of the molds of the species Aspergillus. Contemporary construction methods that use cellulose substrates such as fiber board and indoor moisture have caused an outbreak of contaminated buildings with Stachybotrys chartarum, with the extent of health effects still a subject of debate and ongoing research. This article reviews several of the more prominent epidemics and discusses the nature of the toxins. Two diseases that were leading causes of childhood mortality in England in the 1970s and vanished with changing dietary habits, putrid malignant fever, and slow nervous fever were most likely toxic mold epidemics.

  12. Introducing the slime mold graph repository

    Dirnberger, M.; Mehlhorn, K.; Mehlhorn, T.


    We introduce the slime mold graph repository or SMGR, a novel data collection promoting the visibility, accessibility and reuse of experimental data revolving around network-forming slime molds. By making data readily available to researchers across multiple disciplines, the SMGR promotes novel research as well as the reproduction of original results. While SMGR data may take various forms, we stress the importance of graph representations of slime mold networks due to their ease of handling and their large potential for reuse. Data added to the SMGR stands to gain impact beyond initial publications or even beyond its domain of origin. We initiate the SMGR with the comprehensive Kist Europe data set focusing on the slime mold Physarum polycephalum, which we obtained in the course of our original research. It contains sequences of images documenting growth and network formation of the organism under constant conditions. Suitable image sequences depicting the typical P. polycephalum network structures are used to compute sequences of graphs faithfully capturing them. Given such sequences, node identities are computed, tracking the development of nodes over time. Based on this information we demonstrate two out of many possible ways to begin exploring the data. The entire data set is well-documented, self-contained and ready for inspection at

  13. Residual thermal stresses in injection molded products

    Zoetelief, W.F.; Douven, L.F.A.; Ingen Housz, A.J.


    Nonisothermal flow of a polymer melt in a cold mold cavity introduces stresses that are partly frozen-in during solidification. Flow-induced stresses cause anisotropy of mechanical, thermal, and optical properties, while the residual thermal stresses induce warpage and stress-cracking. In this study

  14. Injection molding of micro patterned PMMA plate

    Yeong-Eun YOO; Tae-Hoon KIM; Tae-Jin JE; Doo-Sun CHOI; Chang-Wan KIM; Sun-Kyung KIM


    A plastic plate with surface micro features was injection molded to investigate the effect of pressure rise of melt on the replication of the micro structures. Prism pattern, which is used in many optical applications, was selected as a model pattern. The prism pattern is 50 μm in pitch and 108° in the vertical angle. The overall size of the plate was 335 mm×213 mm and the thickness of the plate varied linearly from 2.6 mm to 0.7 mm. The prism pattern was firstly machined on the nickel plated core block using micro diamond tool and this machined pattern core was installed in a mold for injection molding of prism patterned plate. Polymethyl methacrylate (PMMA) was used as a molding material. The pressure and temperature of the melt in the cavity were measured at different positions in the cavity and the replication of the pattern was also measured at the same positions. The results show that the pressure or temperature profile through the process depends on the shape and the size of the plate. The replication is affected by the temperature and pressure profiles at the early stage of filling, which is right after the melt reaches the position to be measured.

  15. Mold Die Making. 439-322/324.

    Yunke, P.; And Others

    Each unit in this curriculum guide on mold die making contains an introduction, objectives, materials required, lessons, space for notes, figures, and diagrams. There are 10 units in this guide: (1) introduction to Electrical Discharge Machining (EDM); (2) EDM principles; (3) the single pulse; (4) EDM safety; (5) electrode material; (6) electrode…


    More than 100 assay were developed to identify and quantify indoor molds using quantitiative PCR (QPCR) assays. This technology incorporates fluorigenic 5' nuclease (TaqMan�) chemistry directed at the nuclear ribosomal RNA operon internal transcribed spacer regions (ITS1 or ITS2...

  17. Progress in Titanium Metal Powder Injection Molding

    Randall M. German


    Full Text Available Metal powder injection molding is a shaping technology that has achieved solid scientific underpinnings. It is from this science base that recent progress has occurred in titanium powder injection molding. Much of the progress awaited development of the required particles with specific characteristics of particle size, particle shape, and purity. The production of titanium components by injection molding is stabilized by a good understanding of how each process variable impacts density and impurity level. As summarized here, recent research has isolated the four critical success factors in titanium metal powder injection molding (Ti-MIM that must be simultaneously satisfied—density, purity, alloying, and microstructure. The critical role of density and impurities, and the inability to remove impurities with sintering, compels attention to starting Ti-MIM with high quality alloy powders. This article addresses the four critical success factors to rationalize Ti-MIM processing conditions to the requirements for demanding applications in aerospace and medical fields. Based on extensive research, a baseline process is identified and reported here with attention to linking mechanical properties to the four critical success factors.

  18. Residual stresses in injection molded products

    Jansen, K.M.B.


    During the molding process residual stresses are formed due to thermal contraction during cooling as well as the local pressure history during solidification. In this paper a simple analytical model is reviewed which relates residual stresses, product shrinkage as well as warpage to the temperature

  19. Cultural Molding: A Modular Approach. Cultural Anthropology.

    Kassebaum, Peter

    Designed for use as supplementary instructional material in a cultural anthropology course, this learning module introduces the student to cultural molding, the idea that most human behavior can be traced to enculturation and exposure rather than to a socio-biological explanation of human behavior. Following a brief description of socialization,…


    More than 100 assay were developed to identify and quantify indoor molds using quantitiative PCR (QPCR) assays. This technology incorporates fluorigenic 5' nuclease (TaqMan�) chemistry directed at the nuclear ribosomal RNA operon internal transcribed spacer regions (ITS1 or ITS2...