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Sample records for solder filled conductor

  1. Solderability study of RABiTS-based YBCO coated conductors

    International Nuclear Information System (INIS)

    Zhang Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

    2011-01-01

    Study examines the implication of solder and flux selection in YBCO splice joints. Focus is on commercially available RABiTS-based YBCO coated conductors. Solderability varied with solder and flux for three different stabilizations tested. Resistivity of stabilizer was dominant factor in splice joint resistance. Solder materials affected splice joint resistance when solderability was poor. The solderability of commercially available YBa 2 Cu 3 O 7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

  2. Solder bond requirement for large, built-up, high-performance conductors

    International Nuclear Information System (INIS)

    Willig, R.L.

    1981-01-01

    Some large built-up conductors fabricated for large superconducting magnets are designed to operate above the maximum recovery current. Because the stability of these conductors is sensitive to the quality of the solder bond joining the composite superconductor to the high-conductivity substrate, a minimum bond requirement is necessary. The present analysis finds that the superconductor is unstable and becomes abruptly resistive when there are temperature excursions into the current sharing region of a poorly bonded conductor. This abrupt transition, produces eddy current heating in the vicinity of the superconducting filaments and causes a sharp reduction in the minimum propagating zone (MPZ) energy. This sensitivity of the MPZ energy to the solder bond contact area is used to specify a minimum bond requirement. For the superconducting MHD magnet built for the Component Development Integration Facility (CDIF), the minimum bonded surface area is .68 cm/sup 2//cm which is 44% of the composite perimeter. 5 refs

  3. A wireless intraocular pressure monitoring device with a solder-filled microchannel antenna

    International Nuclear Information System (INIS)

    Varel, Çağdaş; Shih, Yi-Chun; Otis, Brian P; Böhringer, Karl F; Shen, Tueng S

    2014-01-01

    This paper presents the prototype of an intraocular pressure sensor as a major step toward building a device that can be permanently implanted during cataract surgery. The implantation will proceed through an incision of 2–3 mm using an injector, during which the complete device must be folded into a cross-section of 2 mm × 1 mm. The device uses radio frequency (RF) for wireless power and data transfer. The prototype includes an antenna, an RF chip and a pressure sensor assembled on a printed circuit board with several circuit components used for testing and calibration. The antenna is fabricated and integrated with the circuit using a fabrication method employing solder-filled microchannels embedded in an elastomer. The monitoring device is powered at 2.716 GHz from a distance of 1–2 cm. The prototype has undergone electrical and mechanical tests for antenna and sensor performance. The flexible antenna can withstand a stress of 33.4 kPa without any electrical disconnection. It did not show a significant increase in electrical resistance after 50 bending cycles with a maximum applied stress of 116 kPa. Transmitted pressure data shows an averaged sensitivity of 16.66 Hz (mm-Hg) –1 . (paper)

  4. Effective conductivity by fluid analogy for a porous insulator filled with a conductor

    International Nuclear Information System (INIS)

    Berryman, J.G.

    1983-01-01

    By combining of identities relating effective conductivity to tortuosity and tortuosity to induced mass, a general formula for the effective (electrical or thermal) conductivity of a porous insulator filled with a conductor is obtained. This formula depends on an induced-mass factor which arises by treating of the conducting material as an inviscid fluid. This induced-mass factor can be estimated with the use of an effective-medium theory. For random arrays of equal spheres, the estimates of conductivity obtained with the use of this fluid analogy are in good agreement with recent exact values derived for periodic arrays of insulating spheres to closest packing

  5. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates

    International Nuclear Information System (INIS)

    Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

    2008-01-01

    The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in

  6. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates.

    Energy Technology Data Exchange (ETDEWEB)

    Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

    2008-09-01

    The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in

  7. Soldering handbook

    CERN Document Server

    Vianco, Paul T

    1999-01-01

    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  8. Spontaneous soldering

    International Nuclear Information System (INIS)

    Percacci, R.

    1984-01-01

    It is proposed that the soldering form of general relativity be treated as a dynamical variable. This gives rise to the possibility of treating the linear connection on (n-dimensional) spacetime and an internal O(k)-Yang-Mills field as different components of the same O(N) gauge field (N= n+k). The distinction between gravitational and Yang-Mills interactions is due to a kind of Higgs mechanism driven by the vacuum expectation value of the soldering form. (orig.)

  9. Soldering in electronics assembly

    CERN Document Server

    Judd, Mike

    2013-01-01

    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  10. SMT soldering handbook

    National Research Council Canada - National Science Library

    Strauss, Rudolf

    1998-01-01

    ... 3.2.1 Constituents, melting behaviour and mechanical properties 3.2.2 Composition of solders for use in electronics 3.2.3 Lead-free solders 3.2.4 Solder impurities The soldered joint 3.3.1 Solde...

  11. Evaluation on the characteristics of tin-silver-bismuth solder

    Science.gov (United States)

    Xia, Z.; Shi, Y.; Chen, Z.

    2002-02-01

    Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

  12. Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

    Science.gov (United States)

    Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

    2004-04-01

    Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

  13. Low ac loss geometries in YBCO coated conductors and impact on conductor stability

    Energy Technology Data Exchange (ETDEWEB)

    Duckworth, Robert C [ORNL; List III, Frederick Alyious [ORNL; Paranthaman, Mariappan Parans [ORNL; Rupich, M. W. [American Superconductor Corporation, Westborough, MA; Zhang, W. [American Superconductor Corporation, Westborough, MA; Xie, Y. Y. [SuperPower Incorporated, Schenectady, New York; Selvamanickam, V. [SuperPower Incorporated, Schenectady, New York

    2007-01-01

    Reduction of ac losses in applied ac fields can be accomplished through either the creation of filaments and bridging in YBCO coated conductors or an assembly of narrow width YBCO tapes. The ac losses for each of these geometries were measured at 77 K in perpendicular ac fields up to 100 mT. While ac loss reduction was achieved with YBCO filaments created through laser scribing and inkjet deposition, the assembly of stacked YBCO conductor provides an alternative method of ac loss reduction. When compared to a 4-mm wide YBCO coated conductor with a critical current of 60 A, the ac loss in a stack of 2-mm wide YBCO coated conductors with a similar total critical current was reduced. While the reduction in ac loss in a 2-mm wide stack coincided with the reduction in the engineering current density of the conductor, further reduction of ac loss was obtained through the splicing of the 2-mm wide tapes with low resistance solders. To better determine the practicality of these methods from a stability point of view, a numerical analysis was carried out to determine the influence of bridging and splicing on stability of a YBCO coated conductor for both liquid nitrogen-cooled and conduction cooled geometries.

  14. Conductores recubiertos

    Directory of Open Access Journals (Sweden)

    P. Garcés

    2008-07-01

    Full Text Available Since the 1960s, Nb–Ti, exhibiting a superconducting transition temperature Tc of 9K, and Nb3Sn, with a Tc of 18K have been the materials of choice for superconducting applications. The prospects for the future changed dramatically with the discovery of ceramic high temperature superconductors exhibiting Tc values well above the boiling temperature of liquid nitrogen (77K. These materials are now widely considered for large power applications, electronics and magnets as in microelectronics. The first case corresponding power transmission wires, motors, generators, fault current limiters, transformers, etc. and technology related small scale manufacturing SQUID superconductors. Nevertheless, the fabrication of useful conductors out of these layered cuprates encountered some problems such as chemical and structural purity, stability, oxygen stoichiometric and weak links limiting current carrying capacity. However, despite these difficulties a first generation of silver sheathed composites based on (Bi,PbSrCaCuO (solving the problem of inherent fragility of these materials has already been commercialized. It is now a widespread view that superconducting wires with high performance under strong magnetic fields and at elevated temperatures above liquid nitrogen, will need to be realized using the (REBaCuO (RE = rare earth materials. Chemical deposition techniques (CVD of thick films, appear as the most suitable for this purpose, so the study of various chemical deposition techniques that allow to grow superconducting films and buffer layers with the right texture to produce a coated conductor Proper alignment and high current carrying capacity (∼ 1 MA/cm2 are now booming.

  15. Soldering of Nanotubes onto Microelectrodes

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing sold...... bonds were consistently found to be mechanically stronger than the carbon nanotubes.......Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...

  16. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    DEFF Research Database (Denmark)

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

    2009-01-01

    of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

  17. On the problem of soldering refractory metals with silver-containing solders

    International Nuclear Information System (INIS)

    Anikeev, E.F.; Andryushchenko, V.I.; Chepelenko, V.N.; Batov, V.M.

    1981-01-01

    The processes of wetting, spreading and interphase interactions of copper-silver liquid alloys alloyed with Ni and Si, with niobium, tantalum, molybdenum, tungsten, 12Kh18N10T steel and nickel are studied. It has been determined that Ni or Si additions into the copper-silver solder improve the wetting and adhesion. When soldering with the alloy containing Ni additions, the strength of a soldered Joint grows with the increase of soldering duration while soldering with the alloy containing Si additions, the strength decreases. That is why Ni-containing solders are preferable for soldering thick-walled structures, and Si-containing solders - for thin-walled structures [ru

  18. LTS and HTS high current conductor development for DEMO

    International Nuclear Information System (INIS)

    Bruzzone, Pierluigi; Sedlak, Kamil; Uglietti, Davide; Bykovsky, Nikolay; Muzzi, Luigi; De Marzi, Gainluca; Celentano, Giuseppe; Della Corte, Antonio; Turtù, Simonetta; Seri, Massimo

    2015-01-01

    Highlights: • Design and R&D for DEMO TF conductors. • Wind&react vs. react&wind options for Nb_3Sn high grade TF conductors. • Progress in the manufacture of short length Nb_3Sn proptotypes. • Design and prototype manufacture for high current HTS cabled conductors. - Abstract: The large size of the magnets for DEMO calls for very large operating current in the forced flow conductor. A plain extrapolation from the superconductors in use for ITER is not adequate to fulfill the technical and cost requirements. The proposed DEMO TF magnets is a graded winding using both Nb_3Sn and NbTi conductors, with operating current of 82 kA @ 13.6 T peak field. Two Nb_3Sn prototypes are being built in 2014 reflecting the two approaches suggested by CRPP (react&wind method) and ENEA (wind&react method). The Nb_3Sn strand (overall 200 kg) has been procured at technical specification similar to ITER. Both the Nb_3Sn strand and the high RRR, Cr plated copper wire (400 kg) have been delivered. The cabling trials are carried out at TRATOS Cavi using equipment relevant for long length production. The completion of the manufacture of the two 20 m long prototypes is expected in the end of 2014 and their test is planned in 2015 at CRPP. In the scope of a long term technology development, high current HTS conductors are built at CRPP and ENEA. A DEMO-class prototype conductor is developed and assembled at CRPP: it is a flat cable composed of 20 twisted stacks of coated conductor tape soldered into copper shells. The 10 kA conductor developed at ENEA consists of stacks of coated conductor tape inserted into a slotted and twisted Al core, with a central cooling channel. Samples have been manufactured in industrial environment and the scalability of the process to long production lengths has been proven.

  19. Solder joint technology materials, properties, and reliability

    CERN Document Server

    Tu, King-Ning

    2007-01-01

    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  20. Low ac loss geometries in YBCO coated conductors

    International Nuclear Information System (INIS)

    Duckworth, R.C.; List, F.A.; Paranthaman, M.P.; Rupich, M.W.; Zhang, W.; Xie, Y.Y.; Selvamanickam, V.

    2007-01-01

    Reduction of ac losses in applied ac fields can be accomplished through either the creation of filaments and bridging in YBCO coated conductors or by an assembly of narrow width YBCO tapes. The ac losses for each of these geometries were measured at 77 K in perpendicular ac fields up to 100 mT. Despite physical isolation of the filaments, coupling losses were still present in the samples when compared to the expected hysteretic loss. In addition to filamentary conductors the assembly of stacked YBCO conductor provides an alternative method of ac loss reduction. When compared to a 4-mm wide YBCO coated conductor with a critical current of 60 A, the ac loss in a stack of 2-mm wide YBCO coated conductors with a similar total critical current was reduced. While the reduction in ac loss in a 2-mm wide stack coincided with the reduction in the engineering current density of the conductor, further reduction of ac loss was obtained through the splicing of the 2-mm wide tapes with low resistance solders

  1. Low ac loss geometries in YBCO coated conductors

    Energy Technology Data Exchange (ETDEWEB)

    Duckworth, R.C. [Oak Ridge National Laboratory, One Bethel Valley Road, P.O. Box 2008, MS-6305, Oak Ridge, TN 37831-6305 (United States)], E-mail: duckworthrc@ornl.gov; List, F.A.; Paranthaman, M.P. [Oak Ridge National Laboratory, One Bethel Valley Road, P.O. Box 2008, MS-6305, Oak Ridge, TN 37831-6305 (United States); Rupich, M.W.; Zhang, W. [American Superconductor, Two Technology Drive, Westborough, MA 01581 (United States); Xie, Y.Y.; Selvamanickam, V. [SuperPower, 450 Duane Ave, Schenectady, NY 12304 (United States)

    2007-10-01

    Reduction of ac losses in applied ac fields can be accomplished through either the creation of filaments and bridging in YBCO coated conductors or by an assembly of narrow width YBCO tapes. The ac losses for each of these geometries were measured at 77 K in perpendicular ac fields up to 100 mT. Despite physical isolation of the filaments, coupling losses were still present in the samples when compared to the expected hysteretic loss. In addition to filamentary conductors the assembly of stacked YBCO conductor provides an alternative method of ac loss reduction. When compared to a 4-mm wide YBCO coated conductor with a critical current of 60 A, the ac loss in a stack of 2-mm wide YBCO coated conductors with a similar total critical current was reduced. While the reduction in ac loss in a 2-mm wide stack coincided with the reduction in the engineering current density of the conductor, further reduction of ac loss was obtained through the splicing of the 2-mm wide tapes with low resistance solders.

  2. AC losses for the various voltage-leads in a semi-triple layer BSCCO conductor

    International Nuclear Information System (INIS)

    Li, Z.; Ryu, K.; Hwang, S.D.; Cha, G.; Song, H.J.

    2011-01-01

    Two voltage-leads (inner-lead, outer-lead) were soldered to the wires in each layer. Voltage-lead (total-lead) was soldered to the inner layer and arranged on the surface of the outer layer. The loss from the total-lead significantly differs from the sum of the wire losses. In order to investigate the AC loss of the multilayer conductor in a high temperature superconductor cable, a voltage-lead was generally attached to the outermost layer of the conductor. But the conductor's AC loss has not been completely cleared due to the various contact positions and arrangements of the voltage-lead. In this paper, we prepared a semi-triple layer conductor consisting of an inner layer and an outer layer with double layer structure. To measure the AC loss of the conductor, two voltage-leads (inner-lead, outer-lead) were soldered to the wires in each layer and arranged along their surfaces, as well as another voltage-lead (total-lead) was soldered to the inner layer and arranged on the surface of the outer layer. The results show that the AC losses for each layer measured from the inner-lead and the outer-lead, respectively, are identical to the sum of the wire losses. The AC losses in the semi-triple layer conductor measured from the total-lead and the outer-lead are identical for the uniform layer current density, and similar to the sum of the wire losses in both layers. However, the losses measured for the non-uniform layer current density from three voltage-leads are unequal to each other, and the loss from the total-lead significantly differs from the sum of the wire losses.

  3. Method of installing well conductors

    International Nuclear Information System (INIS)

    Houser, D.M.

    1991-01-01

    This patent describes a method of installing a well conductor in a marine environment. It comprises sealing a well conductor with a watertight plug; submerging the conductor from an elevated platform; adding additional conductor lengths to the conductor as needed thereby forming a conductor string; adjusting the buoyancy of the string to control the lowering of the string to the sea floor; and drilling through the plug after the conductor string has achieved the desired penetration depth

  4. Handbook of machine soldering SMT and TH

    CERN Document Server

    Woodgate, Ralph W

    1996-01-01

    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  5. An A15 conductor design and its implications for the NET-II TF coils

    International Nuclear Information System (INIS)

    Fluekiger, R.; Arendt, F.; Hofmann, A.; Jeske, U.; Juengst, K.P.; Komarek, P.; Krauth, H.; Lehmann, W.; Luehning, J.; Manes, B.; Maurer, W.; Nyilas, A.; Specking, W.; Turowski, P.; Zehlein, H.

    1985-06-01

    The paper describes the results of studies for a NET toroidal field coil conductor carried out at KfK-Karlsruhe. The conductor concept is based on the same design principles as used in the Euratom-LCT coil, well proven in all conductor tests and the domestic tests of the coil. These principles are applied to the peculiarities of Nb 3 Sn for a rated current of 20 kA at 12 T, taking into account ac losses and nuclear heating. A flat Nb 3 Sn cable is soldered to a surrounding CuNi tape after reaction. Around this rectangular conductor core, Cu profiles are cabled on distance by the Roebel-process and subsequently soldered onto the CuNi tape. The whole system is surrounded by a steel conduit. The conductor data result from electric, thermohydraulic and stability calculations as well as mechanical evaluations. Expected fabrication processes are discussed, and measurements on a first simplified subsize conductor model are presented. (orig.) [de

  6. Spectroscopic investigation of oxidized solder surfaces

    International Nuclear Information System (INIS)

    Song, Jenn-Ming; Chang-Chien, Yu-Chien; Huang, Bo-Chang; Chen, Wei-Ting; Shie, Chi-Rung; Hsu, Chuang-Yao

    2011-01-01

    Highlights: → UV-visible spectroscopy is successfully used to evaluate the degree of discoloring of solders. → The surface oxides of solders can also be identified by UV-visible absorption spectra. → The discoloration of solder surface can be correlated with optical characterization of oxides. → A strategy against discoloring by alloying was also suggested. - Abstract: For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV-vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible region. A trace of P can effectively depress the discoloration of solders under both solid and semi-solid states through the suppression of SnO.

  7. Intercalated Graphite Fiber Conductor.

    Science.gov (United States)

    1980-12-01

    melting solders, used as electrical contacts as well as sealants for the glass containers described earlier, and high temperature gold varnish , used on...corrosion resistant to fluorine containing chemicals. Since the moisture permeability of the TFE is much less than that of the FEP, attempts were made to

  8. Soldering of Mg Joints Using Zn-Al Solders

    Science.gov (United States)

    Gancarz, Tomasz; Berent, Katarzyna; Skuza, Wojciech; Janik, Katarzyna

    2018-04-01

    Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 °C, 450 °C, 475 °C, and 500 °C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.

  9. Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

    Directory of Open Access Journals (Sweden)

    Shuye Zhang

    2018-01-01

    Full Text Available Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile electronic applications. However, crack formation of the solder joint crack was occurred at low temperature curable acrylic polymer resins after bonding processes. In this study, the mechanism of SnBi58 solder joint crack at low temperature curable acrylic adhesive was investigated. In addition, SnBi58 solder joint cracks can be significantly removed by increasing the storage modulus of adhesives instead of coefficient of thermal expansion. The first approach of reducing the amount of polymer rebound can be achieved by using an ultrasonic bonding method to maintain a bonding pressure on the SnBi58 solder joints cooling to room temperature. The second approach is to increase storage modulus of adhesives by adding silica filler into acrylic polymer resins to prevent the solder joint from cracking. Finally, excellent acrylic based SnBi58 solder joints reliability were obtained after 1000 cycles thermal cycling test.

  10. Lead free solder mechanics and reliability

    CERN Document Server

    Pang, John Hock Lye

    2012-01-01

    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  11. Storm on lightning conductors

    International Nuclear Information System (INIS)

    Broomhead, Laurent.

    1980-01-01

    Radioactive lightning conductors using radium or americium 241 sources are compared to Faraday cage and lightning rod. Americium source preparation is shortly described. Efficiency of the different systems is still controversed [fr

  12. Organic Conductors: Evidence for Correlation Effects in Infrared Properties

    DEFF Research Database (Denmark)

    Jacobsen, Claus Schelde; Johannsen, Ib; Bechgaard, Klaus

    1984-01-01

    The infrared conductivities of four organic conductors with partially filled one-electron bands are compared. The behavior ranges from near Drude type in the best metal to semiconductorlike in the moderate conductor. Electron-molecular-vibration coupling effects of varying degree are seen in all...... materials. It is suggested that the combined effect of electron-electron interaction and electron-phonon interaction in producing 4kF charge-density waves is essential for interpreting the results....

  13. Nano-soldering to single atomic layer

    Science.gov (United States)

    Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  14. Safer Soldering Guidelines and Instructional Resources

    Science.gov (United States)

    Love, Tyler S.; Tomlinson, Joel

    2018-01-01

    Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

  15. Features of soldering of molybdenum a lols

    International Nuclear Information System (INIS)

    Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

    1980-01-01

    Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

  16. Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits

    Energy Technology Data Exchange (ETDEWEB)

    Huang, Y. T.; Hsu, H. H.; Wu, Albert T., E-mail: atwu@ncu.edu.tw [Department of Chemical and Materials Engineering, National Central University, Jhongli City 320, Taiwan (China)

    2014-01-21

    Because of the miniaturization of electronic devices, the reliability of electromigration has become a major concern when shrinking the solder dimensions in flip-chip joints. Fast reaction between solders and electrodes causes intermetallic compounds (IMCs) to form, which grow rapidly and occupy entire joints when solder volumes decrease. In this study, U-grooves were fabricated on Si chips as test vehicles. An electrode-solder-electrode sandwich structure was fabricated by using lithography and electroplating. Gaps exhibiting well-defined dimensions were filled with Sn3.5Ag solders. The gaps between the copper electrodes in the test sample were limited to less than 15 μm to simulate microbumps. The samples were stressed at various current densities at 100 °C, 125 °C, and 150 °C. The morphological changes of the IMCs were observed, and the dimensions of the IMCs were measured to determine the kinetic growth of IMCs. Therefore, this study focused on the influence of back stress caused by microstructural evolution in microbumps.

  17. Delamination behaviour in differently copper laminated REBCO coated conductor tapes under transverse loading

    Energy Technology Data Exchange (ETDEWEB)

    Gorospe, Alking [Department of Mechanical Design Engineering, Andong National University, 1375 Kyungdong-Ro, Andong 760-749 (Korea, Republic of); Department of Engineering, Aurora State College of Technology, Baler Aurora 3200 (Philippines); Nisay, Arman [Department of Mechanical Design Engineering, Andong National University, 1375 Kyungdong-Ro, Andong 760-749 (Korea, Republic of); Shin, Hyung-Seop, E-mail: hsshin@andong.ac.kr [Department of Mechanical Design Engineering, Andong National University, 1375 Kyungdong-Ro, Andong 760-749 (Korea, Republic of)

    2014-09-15

    Highlights: • I{sub c} degradation behavior under transverse tension loading in different CC tape structure. • Weibull distribution analysis applied on delamination mechanism of CC tape. • Delamination mechanism on CC tapes depending on copper lamination type. • SEM and WDS mapping analysis of delamination sites under transverse loading. - Abstract: Laminated HTS coated conductor (CC) tapes having a unique multi-layer structure made them vulnerable when exposed to transverse loading. Electromechanical transport properties of these CC tapes can be affected by excessive transverse stresses. Due to the coefficient of thermal expansion (CTE) mismatch and incompatibility among constituent materials used in coil applications, delamination among layers occurs and causes critical current, I{sub c} degradation in the CC tapes. In this study, the delamination behaviors in copper (Cu) solder-laminated CC tapes by soldering and surround Cu-stabilized ones by electroplating under transverse tension loading were investigated. Similarly to the surround Cu-stabilized CC tapes in our previous reports, the Cu solder-laminated CC tapes also showed an abrupt and gradual I{sub c} degradation behavior. However, the Cu solder-laminated CC tapes showed different delamination morphologies as compared to the surround Cu-stabilized CC tapes; the superconducting side and the substrate side of the Cu solder laminated CC tapes were totally separated by delamination. On the other hand, the brass laminate did not show any significant effect on the delamination strength when it is added upon the surround Cu-stabilized CC tapes.

  18. Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    McNally, K.M.; Sorg, B.S.; Welch, A.J.; Dawes, J.M.; Owen, E.R.

    1999-01-01

    Low-strength anastomoses and thermal damage of tissue are major concerns in laser tissue welding techniques where laser energy is used to induce thermal changes in the molecular structure of the tissues being joined, hence allowing them to bond together. Laser tissue soldering, on the other hand, is a bonding technique in which a protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. The addition of protein solders to augment tissue repair procedures significantly reduces the problems of low strength and thermal damage associated with laser tissue welding techniques. Investigations were conducted to determine optimal solder and laser parameters for tissue repair in terms of tensile strength, temperature rise and damage and the microscopic nature of the bonds formed. An in vitro study was performed using an 808 nm diode laser in conjunction with indocyanine green (ICG)-doped albumin protein solders to repair bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The efficacy of temperature feedback control in enhancing the soldering process was also investigated. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the repairs. A reduction in dye concentration from 2.5mgml -1 to 0.25mgml -1 was also found to result in an increase in tensile strength. Increasing the laser irradiance and thus surface temperature resulted in an increased severity of histological injury. Thermal denaturation of tissue collagen and necrosis of the intimal layer smooth muscle cells increased laterally and in depth with higher temperatures. The strongest repairs were produced with an irradiance of 6.4Wcm -2 using a solid protein solder composed of 60% BSA and 0.25mgml -1 ICG. Using this combination of laser and solder parameters, surface temperatures were observed to reach 85±5 deg. C with a

  19. Plasma Generator Using Spiral Conductors

    Science.gov (United States)

    Szatkowski, George N. (Inventor); Dudley, Kenneth L. (Inventor); Ticatch, Larry A. (Inventor); Smith, Laura J. (Inventor); Koppen, Sandra V. (Inventor); Nguyen, Truong X. (Inventor); Ely, Jay J. (Inventor)

    2016-01-01

    A plasma generator includes a pair of identical spiraled electrical conductors separated by dielectric material. Both spiraled conductors have inductance and capacitance wherein, in the presence of a time-varying electromagnetic field, the spiraled conductors resonate to generate a harmonic electromagnetic field response. The spiraled conductors lie in parallel planes and partially overlap one another in a direction perpendicular to the parallel planes. The geometric centers of the spiraled conductors define endpoints of a line that is non-perpendicular with respect to the parallel planes. A voltage source coupled across the spiraled conductors applies a voltage sufficient to generate a plasma in at least a portion of the dielectric material.

  20. Development of 1 m HTS conductor using YBCO on textured metal substrate

    International Nuclear Information System (INIS)

    Yagi, M.; Sakamoto, H.; Mukoyama, S.; Yamamoto, K.; Amemiya, N.; Nagaya, S.; Kashima, N.; Shiohara, Y.

    2009-01-01

    We fabricated 1 m high temperature superconducting conductor (HTS conductor) using YBa 2 Cu 3 O 7-x coated conductors (YBCO tapes) on textured metal substrates, which are expected to be lower in cost than YBCO tapes using ion-beam assisted deposition. Those substrate and intermediate layers were manufactured by Furukawa Electric, and YBCO and a protective layer were applied to the intermediate layer by Chubu Electric Power. Before fabricating the conductor, a 0.1 mm thick copper tape was soldered to the YBCO tape, and 10 mm wide YBCO tape was divided into three strips by a YAG laser. To have sufficient current capacity for 1 kA, a two-layer conductor was fabricated, and its critical current (I c ) was 1976 A, but the magnetic properties of the textured metal substrates affected the increase in AC loss. In a low current region, the AC loss in this conductor was much higher than the Norris strip model, but approached the Norris strip model in the high current region because the magnetization was almost saturated. Low AC loss of 0.144 W/m at 1 kA rms was achieved even though the conductor had a small outer diameter of 20 mm and was composed of YBCO tapes with magnetic substrates.

  1. The constitutive response of three solder materials

    International Nuclear Information System (INIS)

    Perez-Bergquist, Alejandro G.; Cao Fang; Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T.

    2012-01-01

    Highlights: ► The full constitutive response of three solder materials. ► Test temperatures from −196 °C to 60 °C and strain rates from 10 −3 to >10 3 s −1 . ► Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (−196 °C to 60 °C) and strain rate (10 −3 to >10 3 s −1 ). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  2. The constitutive response of three solder materials

    Energy Technology Data Exchange (ETDEWEB)

    Perez-Bergquist, Alejandro G., E-mail: alexpb@lanl.gov [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States); Cao Fang [Exxon Mobil Research and Engineering Company, Annadale, NJ 08801 (United States); Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T. [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States)

    2012-05-25

    Highlights: Black-Right-Pointing-Pointer The full constitutive response of three solder materials. Black-Right-Pointing-Pointer Test temperatures from -196 Degree-Sign C to 60 Degree-Sign C and strain rates from 10{sup -3} to >10{sup 3} s{sup -1}. Black-Right-Pointing-Pointer Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196 Degree-Sign C to 60 Degree-Sign C) and strain rate (10{sup -3} to >10{sup 3} s{sup -1}). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  3. Optimal parameters for laser tissue soldering

    Science.gov (United States)

    McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

    1998-07-01

    Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

  4. Focus on Organic Conductors

    Directory of Open Access Journals (Sweden)

    Shinya Uji, Takehiko Mori and Toshihiro Takahashi

    2009-01-01

    Full Text Available Organic materials are usually thought of as electrical insulators. Progress in chemical synthesis, however, has brought us a rich variety of conducting organic materials, which can be classified into conducting polymers and molecular crystals. Researchers can realize highly conducting molecular crystals in charge-transfer complexes, where suitable combinations of organic electron donor or acceptor molecules with counter ions or other organic molecules provide charge carriers. By means of a kind of chemical doping, the charge-transfer complexes exhibit high electrical conductivity and, thanks to their highly crystalline nature, even superconductivity has been observed. This focus issue of Science and Technology of Advanced Materials is devoted to the research into such 'organic conductors'The first organic metal was (TTF(TCNQ, which was found in 1973 to have high conductivity at room temperature and a metal–insulator transition at low temperatures. The first organic superconductor was (TMTSF2PF6, whose superconductivity under high pressures was reported by J´erome in 1980. After these findings, the research on organic conductors exploded. Hundreds of organic conductors have been reported, among which more than one hundred exhibit superconductivity. Recently, a single-component organic conductor has been found with metallic conductivity down to low temperatures.In these organic conductors, in spite of their simple electronic structures, much new physics has arisen from the low dimensionality. Examples are charge and spin density waves, characteristic metal–insulator transitions, charge order, unconventional superconductivity, superconductor–insulator transitions, and zero-gap conductors with Dirac cones. The discovery of this new physics is undoubtedly derived from the development of many intriguing novel organic conductors. High quality single crystals are indispensable to the precise measurement of electronic states.This focus issue

  5. Plasmonic transparent conductors

    Science.gov (United States)

    Liapis, Andreas C.; Sfeir, Matthew Y.; Black, Charles T.

    2016-09-01

    Many of today's technological applications, such as solar cells, light-emitting diodes, displays, and touch screens, require materials that are simultaneously optically transparent and electrically conducting. Here we explore transparent conductors based on the excitation of surface plasmons in nanostructured metal films. We measure both the optical and electrical properties of films perforated with nanometer-scale features and optimize the design parameters in order to maximize optical transmission without sacrificing electrical conductivity. We demonstrate that plasmonic transparent conductors can out-perform indium tin oxide in terms of both their transparency and their conductivity.

  6. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

    National Research Council Canada - National Science Library

    Reuse, Rolando

    2005-01-01

    .... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

  7. Influence of the magnetic field profile on ITER conductor testing

    International Nuclear Information System (INIS)

    Nijhuis, A; Ilyin, Y; Kate, H H J ten

    2006-01-01

    We performed simulations with the numerical CUDI-CICC code on a typical short ITER (International Thermonuclear Experimental Reactor) conductor test sample of dual leg configuration, as usually tested in the SULTAN test facility, and made a comparison with the new EFDA-Dipole test facility offering a larger applied DC field region. The new EFDA-Dipole test facility, designed for short sample testing of conductors for ITER, has a homogeneous high field region of 1.2 m, while in the SULTAN facility this region is three times shorter. The inevitable non-uniformity of the current distribution in the cable, introduced by the joints at both ends, has a degrading effect on voltage-current (VI) and voltage-temperature (VT) characteristics, particularly for these short samples. This can easily result in an underestimation or overestimation of the actual conductor performance. A longer applied DC high field region along a conductor suppresses the current non-uniformity by increasing the overall longitudinal cable electric field when reaching the current sharing mode. The numerical interpretation study presented here gives a quantitative analysis for a relevant practical case of a test of a short sample poloidal field coil insert (PFCI) conductor in SULTAN. The simulation includes the results of current distribution analysis from self-field measurements with Hall sensor arrays, current sharing measurements and inter-petal resistance measurements. The outcome of the simulations confirms that the current uniformity improves with a longer high field region but the 'measured' VI transition is barely affected, though the local peak voltages become somewhat suppressed. It appears that the location of the high field region and voltage taps has practically no influence on the VI curve as long as the transverse voltage components are adequately cancelled. In particular, for a thin conduit wall, the voltage taps should be connected to the conduit in the form of an (open) azimuthally

  8. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Science.gov (United States)

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2004-10-01

    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  9. Test of 60 kA coated conductor cable prototypes for fusion magnets

    Science.gov (United States)

    Uglietti, D.; Bykovsky, N.; Sedlak, K.; Stepanov, B.; Wesche, R.; Bruzzone, P.

    2015-12-01

    Coated conductors could be promising materials for the fabrication of the large magnet systems of future fusion devices. Two prototype conductors (flat cables in steel conduits), each about 2 m long, were manufactured using coated conductor tapes (4 mm wide) from Super Power and SuperOx, with a total tape length of 1.6 km. Each flat cable is assembled from 20 strands, each strand consisting of a stack of 16 tapes surrounded by two half circular copper profiles, twisted and soldered. The tapes were measured at 12 T and 4.2 K and the results of the measurements were used for the assessment of the conductor electromagnetic properties at low temperature and high field. The two conductors were assembled together in a sample that was tested in the European Dipole (EDIPO) facility. The current sharing temperatures of the two conductors were measured at background fields from 8 T up to 12 T and for currents from 30 kA up to 70 kA: the measured values are within a few percent of the values expected from the measurements on tapes (short samples). After electromagnetic cycling, T cs at 12 T and 50 kA decreased from about 12 K to 11 K (about 10%), corresponding to less than 3% of I c.

  10. Thermomechanical fatigue life prediction for several solders

    Science.gov (United States)

    Wen, Shengmin

    Since solder connections operate at high homologous temperature, solders are high temperature materials. This feature makes their mechanical behavior and fatigue phenomena unique. Based on experimental findings, a physical damage mechanism is introduced for solders. The mechanism views the damage process as a series of independent local damage events characterized by the failure of individual grains, while the structural damage is the eventual percolation result of such local events. Fine's dislocation energy density concept and Mura's microcrack initiation theory are adopted to derive the fatigue formula for an individual grain. A physical damage metric is introduced to describe the material with damage. A unified creep and plasticity constitutive model is adopted to simulate the mechanical behavior of solders. The model is cast into a continuum damage mechanics framework to simulate material with damage. The model gives good agreement with the experimental results of 96.5Pb-3.5Sn and 96.5Sn-3.5Ag solders under uniaxial strain-controlled cyclic loading. The model is convenient for implementation into commercial computational packages. Also presented is a fatigue theory with its failure criterion for solders based on physical damage mechanism. By introducing grain orientation into the fatigue formula, an m-N curve (m is Schmid factor) at constant loading condition is suggested for fatigue of grains with different orientations. A solder structure is defined as fatigued when the damage metric reaches a critical threshold, since at this threshold the failed grains may form a cluster and percolate through the structure according to percolation theory. Fatigue data of 96.5Pb-3.5Sn solder bulk specimens under various uniaxial tension tests were analyzed. Results show that the theory gives consistent predictions under broad conditions, while inelastic strain theory does not. The theory is anisotropic with no size limitation to its application, which could be suitable for

  11. Impurity Effects in Electroplated-Copper Solder Joints

    Directory of Open Access Journals (Sweden)

    Hsuan Lee

    2018-05-01

    Full Text Available Copper (Cu electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl disulfide (SPS with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

  12. Physics of superionic conductors

    CERN Document Server

    1979-01-01

    Superionic conductors are solids whose ionic conductivities approach, and in some cases exceed, those of molten salts and electrolyte solutions. This implies an un­ usual state of matter in which some atoms have nearly liquidlike mobility while others retain their regular crystalline arrangement. This liquid-solid duality has much appeal to condensed matter physicists, and the coincident development of powerful new methods for studying disordered solids and interest in superionic conductors for technical applications has resulted in a new surge of activity in this venerable field. It is the purpose of this book to summarize the current re­ search in the physics of superionic conduction. with special emphasis on those aspects which set these materials apart from other solids. The volume is aimed to­ wards the materials community and will, we expect, stimulate further research on these potentially useful substances. The usual characterization of the superionic phase lists high ionic conductivity; low activat...

  13. The CMS conductor

    CERN Document Server

    Horváth, I L; Marti, H P; Neuenschwander, J; Smith, R P; Fabbricatore, P; Musenich, R; Calvo, A; Campi, D; Curé, B; Desirelli, Alberto; Favre, G; Riboni, P L; Sgobba, Stefano; Tardy, T; Sequeira-Lopes-Tavares, S

    2000-01-01

    The Compact Muon Solenoid (CMS) is one of the experiments, which are being designed in the framework of the Large Hadron Collider (LHC) project at CERN, the design field of the CMS magnet is 4 T, the magnetic length is 13 m and the aperture is 6 m. This high magnetic field is achieved by means of a 4 layer, 5 modules superconducting coil. The coil is wound from an Al-stabilized Rutherford type conductor. The nominal current of the magnet is 20 kA at 4.5 K. In the CMS coil the structural function is ensured, unlike in other existing Al-stabilized thin solenoids, both by the Al-alloy reinforced conductor and the external former. In this paper the retained manufacturing process of the 50-km long reinforced conductor is described. In general the Rutherford type cable is surrounded by high purity aluminium in a continuous co-extrusion process to produce the Insert. Thereafter the reinforcement is joined by Electron Beam Welding to the pure Al of the insert, before being machined to the final dimensions. During the...

  14. High temperature soldering of graphite

    International Nuclear Information System (INIS)

    Anikin, L.T.; Kravetskij, G.A.; Dergunova, V.S.

    1977-01-01

    The effect is studied of the brazing temperature on the strength of the brazed joint of graphite materials. In one case, iron and nickel are used as solder, and in another, molybdenum. The contact heating of the iron and nickel with the graphite has been studied in the temperature range of 1400-2400 ged C, and molybdenum, 2200-2600 deg C. The quality of the joints has been judged by the tensile strength at temperatures of 2500-2800 deg C and by the microstructure. An investigation into the kinetics of carbon dissolution in molten iron has shown that the failure of the graphite in contact with the iron melt is due to the incorporation of iron atoms in the interbase planes. The strength of a joint formed with the participation of the vapour-gas phase is 2.5 times higher than that of a joint obtained by graphite recrystallization through the carbon-containing metal melt. The critical temperatures are determined of graphite brazing with nickel, iron, and molybdenum interlayers, which sharply increase the strength of the brazed joint as a result of the formation of a vapour-gas phase and deposition of fine-crystal carbon

  15. Microstructure evolution and thermomechanical fatigue of solder materials

    NARCIS (Netherlands)

    Matin, M.A.

    2005-01-01

    The microelectronics industry is confronted with the new challenge to produce joints with lead-free solder materials replacing classical tin-lead solders in devices used in many fields (e.g. consumer electronics, road transport, aviation, space-crafts, telecommunication). In service, solder

  16. Efforts to Develop a 300°C Solder

    Energy Technology Data Exchange (ETDEWEB)

    Norann, Randy A [Perma Works LLC

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  17. A novel method for direct solder bump pull testing using lead-free solders

    Science.gov (United States)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  18. DESIGN, FABRICATION AND TEST OF THE REACT AND WIND, NB(3)SN, LDX FLOATING COIL CONDUCTOR

    International Nuclear Information System (INIS)

    SMITH, B.A.; MICHAEL, P.C.; MINERVINI, J.V.; TAKAYASU, M.; SCHULTZ, J.H.; GREGORY, E.; PYON, T.; SAMPSON, W.B.; GHOSH, A.; SCANLAN, R.

    2000-01-01

    The Levitated Dipole Experiment (LDX) is a novel approach for studying magnetic confinement of a fusion plasma. In this approach, a superconducting ring coil is magnetically levitated for up to 8 hours a day in the center of a 5 meter diameter vacuum vessel. The levitated coil, with on-board helium supply, is called the gloating Coil (F-Coil). Although the maximum field at the coil is only 5.3 tesla, a react-and-wind Nb 3 Sn conductor was selected because the relatively high critical temperature will enable the coil to remain levitated while it warms from 5 K to 10 K. Since pre-reacted Nb 3 Sn tape is no longer commercially available, a composite conductor was designed that contains an 18 strand Nb 3 Sn Rutherford cable. The cable was reacted and then soldered into a structural copper channel that completes the conductor and also provides quench protection. The strain state of the cable was continuously controlled during fabrication steps such as: soldering into the copper channel, spooling, and coil winding, to prevent degradation of the critical current. Measurements of strand and cable critical currents are reported, as well as estimates of the effect of fabrication, winding and operating strains on critical current

  19. Interface between Sn-Sb-Cu solder and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

    2011-07-15

    Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

  20. A Hodge dual for soldered bundles

    International Nuclear Information System (INIS)

    Lucas, Tiago Gribl; Pereira, J G

    2009-01-01

    In order to account for all possible contractions allowed by the presence of the solder form, a generalized Hodge dual is defined for the case of soldered bundles. Although for curvature the generalized dual coincides with the usual one, for torsion it gives a completely new dual definition. Starting from the standard form of a gauge Lagrangian for the translation group, the generalized Hodge dual yields precisely the Lagrangian of the teleparallel equivalent of general relativity, and consequently also the Einstein-Hilbert Lagrangian of general relativity

  1. Visual detection of defects in solder joints

    Science.gov (United States)

    Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

    1995-03-01

    The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

  2. Laser assisted soldering: microdroplet accumulation with a microjet device.

    Science.gov (United States)

    Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

    1998-01-01

    We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

  3. Interacting with a Virtual Conductor

    NARCIS (Netherlands)

    Bos, Pieter; Reidsma, Dennis; Ruttkay, Zsófia; Nijholt, Anton; Harper, Richard; Rauterberg, Matthias; Combetto, Marco

    This paper presents a virtual embodied agent that can conduct musicians in a live performance. The virtual conductor conducts music specified by a MIDI file and uses input from a microphone to react to the tempo of the musicians. The current implementation of the virtual conductor can interact with

  4. Understanding core conductor fabrics

    International Nuclear Information System (INIS)

    Swenson, D E

    2011-01-01

    ESD Association standard test method ANSI/ESD STM2.1 - Garments (STM2.1), provides electrical resistance test procedures that are applicable for materials and garments that have surface conductive or surface dissipative properties. As has been reported in other papers over the past several years 1 fabrics are now used in many industries for electrostatic control purposes that do not have surface conductive properties and therefore cannot be evaluated using the procedures in STM2.1 2 . A study was conducted to compare surface conductive fabrics with samples of core conductor fibre based fabrics in order to determine differences and similarities with regards to various electrostatic properties. This work will be used to establish a new work item proposal within WG-2, Garments, in the ESD Association Standards Committee in the USA.

  5. Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

    National Research Council Canada - National Science Library

    Chung, Kohn C

    2006-01-01

    .... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

  6. Conductor for a fluid-cooled winding

    Science.gov (United States)

    Kenney, Walter J.

    1983-01-01

    A conductor and method of making the conductor are provided for use in winding electrical coils which are cooled by a fluid communicating with the conductor. The conductor is cold worked through twisting and reshaping steps to form a generally rectangular cross section conductor having a plurality of helical cooling grooves extending axially of the conductor. The conductor configuration makes it suitable for a wide variety of winding applications and permits the use of simple strip insulation between turns and perforated sheet insulation between layers of the winding.

  7. Tin-silver and tin-copper alloys for capillarity joining-soft soldering-of copper piping

    International Nuclear Information System (INIS)

    Duran, J.; Amo, J. M.; Duran, C. M.

    2001-01-01

    It is studied the influence of the type of alloy used as filling material on the defects of the soldering joints in copper piping installations, which induce the fluid leak of the systems. The different eutectic temperatures and solidus-liquidus ranges of these alloys, require the setting of the soldering heat input in each case to obtain the suitable capillarity features and alloying temperatures to achieve for the correct formation of the bonding. Most defects in the joints are demonstrated to be generated by bad dossification of thermal inputs, which led depending on the filler alloy used to variations in its fluidity that may produce penetration failures in the bonds or insufficient consistency for the filling of the joints. (Author) 7 refs

  8. Effect of Solder Flux Residues on Corrosion of Electronics

    DEFF Research Database (Denmark)

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

    2009-01-01

    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... testing and use in the field, consequences and recommendations are given. Failures, caused by harsh[1] customer environments, are not covered in this paper....

  9. Mechanical properties of soldered joints of niobium base alloys

    International Nuclear Information System (INIS)

    Grishin, V.L.

    1980-01-01

    Mechanical properties of soldered joints of niobium alloys widely distributed in industry: VN3, VN4, VN5A, VN5AE, VN5AEP etc., 0.6-1.2 mm thick are investigated. It is found out that the usage of zirconium-vanadium, titanium-tantalum solders for welding niobium base alloys permits to obtain soldered joints with satisfactory mechanical properties at elevated temperatures

  10. Analytical investigation in bending characteristic of twisted stacked-tape cable conductor

    International Nuclear Information System (INIS)

    Takayasu, Makoto; Chiesa, Luisa

    2015-01-01

    An analytical model to evaluate bending strains of a twisted stack-tape cable (TSTC) conductor has been developed. Through a comparison with experimental results obtained for a soldered 32-tape YBCO TSTC conductor, it has been found that a Perfect-Slip Model (PSM) taking into account the slipping between tapes in a stacked-tape cable during bending gives much better estimation of the bending performance compared to a No-Slip Model (NSM). In the PSM case the tapes can slip so that the internal longitudinal axial strain can be released. The longitudinal strains of compression and tension regions along the tape are balanced in one twist-pitch and cancel out evenly in a long cable. Therefore, in a cable the strains due to bending can be minimized. This is an important advantage of a TSTC conductor. The effect of the cable diameter size on the bending strain is also expected to be minor, and all tapes composing a TSTC conductor have the same strain response under bending, therefore the cable critical current can be characterized from a single tape behaviour. (paper)

  11. Analytical investigation in bending characteristic of twisted stacked-tape cable conductor

    Science.gov (United States)

    Takayasu, Makoto; Chiesa, Luisa

    2015-12-01

    An analytical model to evaluate bending strains of a twisted stack-tape cable (TSTC) conductor has been developed. Through a comparison with experimental results obtained for a soldered 32-tape YBCO TSTC conductor, it has been found that a Perfect-Slip Model (PSM) taking into account the slipping between tapes in a stacked-tape cable during bending gives much better estimation of the bending performance compared to a No-Slip Model (NSM). In the PSM case the tapes can slip so that the internal longitudinal axial strain can be released. The longitudinal strains of compression and tension regions along the tape are balanced in one twist-pitch and cancel out evenly in a long cable. Therefore, in a cable the strains due to bending can be minimized. This is an important advantage of a TSTC conductor. The effect of the cable diameter size on the bending strain is also expected to be minor, and all tapes composing a TSTC conductor have the same strain response under bending, therefore the cable critical current can be characterized from a single tape behaviour.

  12. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Directory of Open Access Journals (Sweden)

    Mohd Nizam Ab. Rahman

    2014-12-01

    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  13. Laser-activated protein solder for peripheral nerve repair

    Science.gov (United States)

    Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

    1995-05-01

    A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

  14. Soldering of copper-clad niobium--titanium superconductor composite

    International Nuclear Information System (INIS)

    Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

    1977-04-01

    When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

  15. Integration of environmentally compatible soldering technologies for waste minimization

    International Nuclear Information System (INIS)

    Hosking, F.M.

    1992-01-01

    There has been a concentrated effort throughout the international microelectronics industry to phase out chlorofluorocarbon (CFC) materials and alleviate the serious problem of ozone depletion created by the release of CFCS. The development of more environmentally compatible manufacturing technologies is the cornerstone of this effort. Alternative materials and processes for cleaning and soldering have received special attention. Electronic. soldering typically utilizes rosin-based fluxes to promote solder wettability. Flux residues must be removed from the soldered parts when high product reliability is essential. Halogenated or CFC solvents have been the principle chemicals used to clean the residues. With the accelerated push to eliminate CFCs in the US by 1995, CFC-free solvents, aqueous-based cleaning, water soluble or ''no clean'' fluxes, and fluxless soldering technologies are being developed and quickly integrated into manufacturing practice. Sandia's Center for Solder Science and Technology has been ch g a variety of fluxless and alternative soldering technologies for DOE's waste minimization program. The work has focused on controlled atmosphere, laser, and ultrasonic fluxless soldering, protective metallic and organic coatings, and fluxes which have water soluble or low solids-based chemistries. With the increasing concern that Pb will also be banned from electronic soldering, Sandia has been characterizing the wetting, aging, and mechanical properties of Pb-fire solder alloys. The progress of these integrated studies will be discussed. Their impact on environmentally compatible manufacturing will be emphasized. Since there is no universal solution to the various environmental, safety, and health issues which currently face industry, the proposed technologies offer several complementary materials and processing options from which one can choose

  16. Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

    Science.gov (United States)

    2015-05-05

    under bump metallurgy and solder joint geometry on Sn grain morphology in Pb free solder joints were examined. SnAgCu solder joints were examined for...free solder interconnects”, Sci. Technol. Weld . Join. 13, 732 (2008). [3.25] Terashima, S., Takahama, K., Nozaki, M., and Tanaka, M. Recrystallization

  17. Characterization of lead-free solders for electronic packaging

    Science.gov (United States)

    Ma, Hongtao

    The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

  18. High Critical Current Coated Conductors

    Energy Technology Data Exchange (ETDEWEB)

    Paranthaman, M. P.; Selvamanickam, V. (SuperPower, Inc.)

    2011-12-27

    One of the important critical needs that came out of the DOE’s coated conductor workshop was to develop a high throughput and economic deposition process for YBCO. Metal-organic chemical vapor deposition (MOCVD) technique, the most critical steps in high technical micro fabrications, has been widely employed in semiconductor industry for various thin film growth. SuperPower has demonstrated that (Y,Gd)BCO films can be deposited rapid with world record performance. In addition to high critical current density with increased film thickness, flux pinning properties of REBCO films needs to be improved to meet the DOE requirements for various electric-power equipments. We have shown that doping with Zr can result in BZO nanocolumns, but at substantially reduced deposition rate. The primary purpose of this subtask is to develop high current density MOCVD-REBCO coated conductors based on the ion-beam assisted (IBAD)-MgO deposition process. Another purpose of this subtask is to investigate HTS conductor design optimization (maximize Je) with emphasis on stability and protection issues, and ac loss for REBCO coated conductors.

  19. Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/ Pd/ Au surface finishes

    International Nuclear Information System (INIS)

    NorAkmal, F.; Ourdjini, A.; Azmah Hanim, M.A.; Siti Aisha, I.; Chin, Y.T.

    2007-01-01

    Flip chip technology provides the ultimate in high I/ O-density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) which is widely used in electronics packaging as surface finish for flip-chip application nowadays. In this research, field emission scanning electron microscopy (FESEM) analysis was conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between the SAC lead-free solder with Cu surface finish after reflow were mainly (Cu, Ni) 6 Sn 5 and Cu 6 Sn 5 . While the main IMCs formed between lead-free solder on ENEPIG surface finish are (Ni, Cu) 3 Sn 4 and Ni 3 Sn 4 . The results from FESEM with energy dispersive x-ray (EDX) have revealed that isothermal aging at 150 degree Celsius has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated was found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. (author)

  20. Soldering formalism in noncommutative field theory: a brief note

    International Nuclear Information System (INIS)

    Ghosh, Subir

    2004-01-01

    In this Letter, I develop the soldering formalism in a new domain--the noncommutative planar field theories. The soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair of noncommutative Maxwell-Chern-Simons theories, having opposite signs in their respective topological terms, can be consistently soldered to yield the Proca model (Maxwell theory with a mass term) with corrections that are at least quadratic in the noncommutativity parameter. We further argue that this model can be thought of as the noncommutative generalization of the Proca theory of ordinary spacetime. It is well known that abelian noncommutative gauge theory bears a close structural similarity with non-abelian gauge theory. This fact is manifested in a non-trivial way if the present Letter is compared with existing literature, where soldering of non-abelian models are discussed. Thus the present work further establishes the robustness of the soldering programme. The subtle role played by gauge invariance (or the lack of it), in the above soldering process, is revealed in an interesting way

  1. Utilization of Pb-free solders in MEMS packaging

    Science.gov (United States)

    Selvaduray, Guna S.

    2003-01-01

    Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

  2. Fatigue and thermal fatigue of Pb-Sn solder joints

    International Nuclear Information System (INIS)

    Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

    1987-01-01

    This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55 0 C and 125 0 C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb

  3. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

  4. Manipulation and soldering of carbon nanotubes using atomic force microscope

    International Nuclear Information System (INIS)

    Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

    2008-01-01

    Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

  5. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

    Science.gov (United States)

    Lee, Sang-Yeob; Lee, Jong-Hyuk

    2010-12-01

    The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

  6. Power distribution: conductors in aluminium

    International Nuclear Information System (INIS)

    Schmid, R.

    2007-01-01

    This article takes a look at the use of aluminium conductors in medium and low-voltage cables. The author discusses how the increasing price of copper has led to the increasing use of aluminium as a material for the production of the conductors used in medium and low-voltage power cables. Aid is provided that is to help purchasers make the correct decisions when buying medium and low-voltage cables. The current market situation is examined and the appropriate norms are looked at. Technical data and economic aspects are discussed, both for medium and low-voltage applications. The electrical characteristics of the type of cable to be used are examined and discussed

  7. Pulse Propagation on close conductors

    CERN Document Server

    Dieckmann, A

    2001-01-01

    The propagation and reflection of arbitrarily shaped pulses on non-dispersive parallel conductors of finite length with user defined cross section is simulated employing the discretized telegraph equation. The geometry of the system of conductors and the presence of dielectric material determine the capacities and inductances that enter the calculation. The values of these parameters are found using an iterative Laplace equation solving procedure and confirmed for certain calculable geometries including the line charge inside a box. The evolving pulses and the resulting crosstalk can be plotted at any instant and - in the Mathematica notebook version of this report - be looked at in an animation. As an example a differential pair of microstrips as used in the ATLAS vertex detector is analysed.

  8. Composite conductor containing superconductive wires

    Energy Technology Data Exchange (ETDEWEB)

    Larson, W.L.; Wong, J.

    1974-03-26

    A superconductor cable substitute made by coworking multiple rods of superconductive niobium--titanium or niobium--zirconium alloy with a common copper matrix to extend the copper and rods to form a final elongated product which has superconductive wires distributed in a reduced cross-section copper conductor with a complete metallurgical bond between the normal-conductive copper and the superconductor wires contained therein is described. The superconductor cable can be in the form of a tube.

  9. Coated Conductors under Tensile Stress

    International Nuclear Information System (INIS)

    Antonevici, Anca; Villaume, Alain; Villard, Catherine; Sulpice, Andre; Maron, Pierre Brosse; Bourgault, Daniel; Porcar, Laureline

    2006-01-01

    Critical current dependence versus strain is obtained for in-situ axial stress experiments on ISD YBCO and DyBCO coated conductors. The drop of critical current due to the apparition of first cracks in the superconducting ceramics is related to the passage in the plastic region of the substrate for a strain of about 0.3% and a stress higher then 500MPa. The superconductivity is preserved between the cracks

  10. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Directory of Open Access Journals (Sweden)

    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  11. Tetrathiapentalene-based organic conductors

    International Nuclear Information System (INIS)

    Misaki, Yohji

    2009-01-01

    The synthesis, structure and properties of tetrathiapentalene-based (TTP) organic conductors are reviewed. Among various TTP-type donors, bis-fused tetrathiafulvalene, 2,5-bis(1,3-dithiol-2-ylidene)-1,3,4,6-tetrathiapentalene (BDT-TTP) and its derivatives afford many metallic radical cation salts stable down to low temperatures, regardless of the size and shape of the counter anions. Most BDT-TTP conductors have a β-type donor arrangement with almost uniform stacks. Introduction of appropriate substituents results in molecular packing that differs from the β-type. A vinylogous TTP, 2-(1,3-dithiol-2-ylidene)-5-(2-ethanediylidene-1,3-dithiole) -1,3,4,6-tetrathiapentalene (DTEDT) has yielded an organic superconductor (DTEDT) 3 Au(CN) 2 as well as metallic radical cation salts, regardless of the counter anions. (Thio)pyran analogs of TTP, namely (T)PDT-TTP and its derivatives produce molecular conductors with novel molecular arrangements. A TTP analog with reduced π-electron system 2,5-bis(1,3-dithian-2-ylidene)-1,3,4,6-tetrathiapentalene (BDA-TTP) has afforded several organic superconductors. Highly conducting molecular metals with unusual oxidation states (+1, +5/3 and neutral) have been developed on the basis of 2,5-bis(1,3-dithiol-2-ylidene)-1,3,4,6-tetrathiapentalene (BDT-TTP) derivatives and analogous metal derivatives M(dt) 2 (M = Ni, Au). (topical review)

  12. Development of a soft-soldering system for aluminum

    Science.gov (United States)

    Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

    1983-03-01

    The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

  13. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  14. Temperature limited heater utilizing non-ferromagnetic conductor

    Science.gov (United States)

    Vinegar,; Harold J. , Harris; Kelvin, Christopher [Houston, TX

    2012-07-17

    A heater is described. The heater includes a ferromagnetic conductor and an electrical conductor electrically coupled to the ferromagnetic conductor. The ferromagnetic conductor is positioned relative to the electrical conductor such that an electromagnetic field produced by time-varying current flow in the ferromagnetic conductor confines a majority of the flow of the electrical current to the electrical conductor at temperatures below or near a selected temperature.

  15. Strength of joints brazed with two-phase solders

    International Nuclear Information System (INIS)

    Shnyakin, N.S.; Parfenova, L.V.; Ekatova, A.S.; Prilepskaya, I.V.

    1976-01-01

    Dependence of the structure and strength of soldered joints upon a gap size in case of 1Kh18N10T stainless steel soldering with a double-phase solder of Ni-Zn-Cu system is described. Butt and lap joints have been subjected to soldering with gas-flame and induction heating. The optimum conditions of the solder crystallization are determined with wedge-gap samples. The studies show that the character of distribution of a fusible β-phase in metal depends upon a gap size. With gaps up to 0.1 mm the β-phase enriched with a fusible component (zinc) runs as a continuous thin interlayer in the middle of the seam. As a result of zinc evaporation from the β-phase this interlayer becomes internally oxidized. After the sample is broken an oxidized fracture gives one the impression of a poor fusion in the middle part of the joint. The ultimate strength of butt joints is 15-20 kgf/sq.mm. A value of thermal expansion of 1Kh18N10T steel samples, 1-5 mm thick, has been experimentally determined for butt soldering. The elongation of two halves of the sample is measured by an indicator and proved to be 0.89 mm for a 50x50x2 mm sample at a soldering temperature of 1.100 deg C. The paper presents methods for the calculation of an optimal gap value for butt soldering with a local gas-flame and induction heating

  16. Characteristics of solder joints under fatigue loads using piezomechanical actuation

    Science.gov (United States)

    Shim, Dong-Jin; Spearing, S. Mark

    2003-07-01

    Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

  17. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2009-03-01

    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  18. Tensile strength of two soldered alloys (Minalux and Verabond2

    Directory of Open Access Journals (Sweden)

    Mir Mohammad Rezaee S

    2002-07-01

    Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

  19. Features of Pd-Ni-Fe solder system for vacuum brazing of low alloy steels

    International Nuclear Information System (INIS)

    Radzievskij, V.N.; Kurochko, R.S.; Lotsmanov, S.N.; Rymar', V.I.

    1975-01-01

    The brazing solder of the Pd-Ni-Fe alloyed with copper and lithium, in order to decrease the melting point and provide for a better spreading, when soldered in vacuum ensures a uniform strength of soldered joints with the base metal of low-alloyed steels of 34KHNIM-type. The properties of low-alloyed steel joints brazed with the Pd-Ni-Fe-system solder little depend on the changes in the soldering parameters. The soldered joint keeps a homogeneous structure after all the stages of heat treatment (annealing, quenching and tempering)

  20. Lead-free solder technology transfer from ASE Americas

    Energy Technology Data Exchange (ETDEWEB)

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  1. Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2018-04-01

    Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

  2. Transparent conductor based on aluminum nanomesh

    International Nuclear Information System (INIS)

    Kazarkin, B; Mohammed, A S; Stsiapanau, A; Zhuk, S; Satskevich, Y; Smirnov, A

    2014-01-01

    We report a transparent conductor based on Al nanomesh, which was fabricated through Al anodization and etching processes. The Al anodization was performed at low temperature condition to slow down the anodization rate to achieve the well-controlled thickness of an Al nanomesh. By careful controlling of the anodization process, we can fabricate Al nanomesh transparent conductors with different sheet resistance and optical transparency in the visible spectrum range. We shall show that Al nanomesh transparent conductor is a strong contender for a transparent conductor dominated by ITO

  3. Tetrathiapentalene-based organic conductors

    Energy Technology Data Exchange (ETDEWEB)

    Misaki, Yohji, E-mail: misaki@eng.ehime-u.ac.j [Department of Applied Chemistry, Graduate School of Engineering, Ehime University, 3 Bunkyo-cho, Matsuyama 790-8577 (Japan)

    2009-04-15

    The synthesis, structure and properties of tetrathiapentalene-based (TTP) organic conductors are reviewed. Among various TTP-type donors, bis-fused tetrathiafulvalene, 2,5-bis(1,3-dithiol-2-ylidene)-1,3,4,6-tetrathiapentalene (BDT-TTP) and its derivatives afford many metallic radical cation salts stable down to low temperatures, regardless of the size and shape of the counter anions. Most BDT-TTP conductors have a {beta}-type donor arrangement with almost uniform stacks. Introduction of appropriate substituents results in molecular packing that differs from the {beta}-type. A vinylogous TTP, 2-(1,3-dithiol-2-ylidene)-5-(2-ethanediylidene-1,3-dithiole) -1,3,4,6-tetrathiapentalene (DTEDT) has yielded an organic superconductor (DTEDT){sub 3}Au(CN){sub 2} as well as metallic radical cation salts, regardless of the counter anions. (Thio)pyran analogs of TTP, namely (T)PDT-TTP and its derivatives produce molecular conductors with novel molecular arrangements. A TTP analog with reduced {pi}-electron system 2,5-bis(1,3-dithian-2-ylidene)-1,3,4,6-tetrathiapentalene (BDA-TTP) has afforded several organic superconductors. Highly conducting molecular metals with unusual oxidation states (+1, +5/3 and neutral) have been developed on the basis of 2,5-bis(1,3-dithiol-2-ylidene)-1,3,4,6-tetrathiapentalene (BDT-TTP) derivatives and analogous metal derivatives M(dt){sub 2} (M = Ni, Au). (topical review)

  4. Fabrication process of a superconducting multifilament conductor of a cable and resulting electric conductor

    International Nuclear Information System (INIS)

    Fevrier, A.; Verhaege, T.; Bonnet, P.

    1990-01-01

    Elementary conductors constituted of a plurality of superconducting filaments in a metallic matrix are prepared and then twisted. Elementary conductors with a diameter between 0.05 and 0.25 mm without electric insulation are twisted after heating with a pitch of four time the diameter, finally the conductor is insulated [fr

  5. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    /methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base...... titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

  6. Mechanical properties of Bi-In-Zn/ Cu solder joint system

    International Nuclear Information System (INIS)

    Ervina Efzan Mohd Noor; Mohammed Noori Ridha; Ahmad Badri Ismail; Nurulakmal Mohd Sharif; Kuan Yew Cheong; Tadashi Ariga; Zuhailawati Hussain

    2009-01-01

    Full text: In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry; the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this works, microstructure and mechanical properties of different reflow temperature (80, 100, 120 and 140 degree Celsius) for solder joints on shear strength of Bi-In-Zn lead free solder with low melting temperature of 60 degree Celsius on Cu solder joint has been investigated. This paper will compared the mechanical properties of the Bi-In-Zn lead-free solder alloys with current lead-free solder, Sn-Ag-Cu solder alloy. The fracture surface analyses have been observed by Optical Microscope and were investigated by Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX) and proved it by X-ray diffraction (XRD). (author)

  7. Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

    Directory of Open Access Journals (Sweden)

    Molnar A.

    2017-06-01

    Full Text Available In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

  8. Assessment of sodium conductor distribution cable

    Energy Technology Data Exchange (ETDEWEB)

    None

    1979-06-01

    The study assesses the barriers and incentives for using sodium conductor distribution cable. The assessment considers environmental, safety, energy conservation, electrical performance and economic factors. Along with all of these factors considered in the assessment, the sodium distribution cable system is compared to the present day alternative - an aluminum conductor system. (TFD)

  9. Doped LZO buffer layers for laminated conductors

    Science.gov (United States)

    Paranthaman, Mariappan Parans [Knoxville, TN; Schoop, Urs [Westborough, MA; Goyal, Amit [Knoxville, TN; Thieme, Cornelis Leo Hans [Westborough, MA; Verebelyi, Darren T [Oxford, MA; Rupich, Martin W [Framingham, MA

    2010-03-23

    A laminated conductor includes a metallic substrate having a surface, a biaxially textured buffer layer supported by the surface of the substrate, the biaxially textured buffer layer comprising LZO and a dopant for mitigating metal diffusion through the LZO, and a biaxially textured conductor layer supported by the biaxially textured buffer layer.

  10. Commentary: Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    Menovsky, T.; Beek, J.F.; Gemert, M.J.C. van

    1999-01-01

    Full text: Laser tissue welding is the process of using laser energy to join tissues without sutures or with a reduced number of sutures. Recently, diode lasers have been added to the list of fusion lasers (Lewis and Uribe 1993, Reali et al 1993). Typically, for tissue welding, deep penetrating diode lasers emitting at 800-810 nm are used, in combination with a strong absorbing protein solder containing the dye indocyanine green. Indocyanine green has a maximum absorption coefficient at 805 nm and binds preferentially with proteins (Sauda et al 1986). The greatest advantage of diode lasers is their compact size, easy use and low cost. In this issue of Physics in Medicine and Biology (pp 983-1002, 'Photothermal effects of laser tissue soldering'), in an in vitro study, McNally et al investigate the optimal laser settings and welding temperatures in relation to the tensile strength and thermal damage of bovine aorta specimens. An interesting statement in their introduction is that the low strength of laser produced anastomoses can lead to aneurysm formation. The increased chance of aneurysm formation may merely be due to the thermal effect of the laser on the vascular wall, especially on the adventitia and media layers, which become necrotic after thermal injury. Subsequent haemodynamic stress exerted on a damaged vascular wall is a significant contributing factor for aneurysmal initiation. Also interesting is the remark that 'by the application of wavelength-specific chromophores in tissue welding ... the requirement for precise focusing and aiming of the laser beam may be removed'. Though perhaps not yet fully justified, this statement, if true, would facilitate surgical procedures. While the experiments are conducted in a proper manner, the use of bovine aorta specimens, which were stored at -70 deg. C and subsequently thawed for the tissue welding experiments, may not be the most appropriate for studying tissue effects or tensile strength measurements, as the

  11. HTS current lead units prepared by the TFA-MOD processed YBCO coated conductors

    International Nuclear Information System (INIS)

    Shiohara, K.; Sakai, S.; Ishii, Y.; Yamada, Y.; Tachikawa, K.; Koizumi, T.; Aoki, Y.; Hasegawa, T.; Tamura, H.; Mito, T.

    2010-01-01

    Two superconducting current lead units have been prepared using ten coated conductors of the Tri-Fluoro-Acetate - Metal Organic Deposition (TFA-MOD) processed Y 1 Ba 2 Cu 3 O 7-δ (YBCO) coated conductors with critical current (I c ) of about 170 A at 77 K in self-field. The coated conductors are 5 mm in width, 190 mm in length and about 120 μm in overall thickness. The 1.5 μm thick superconducting YBCO layer was synthesized through the TFA-MOD process on Hastelloy TM C-276 substrate tape with two buffer oxide layers of Gd 2 Zr 2 O 7 and CeO 2 . The five YBCO coated conductors are attached on a 1 mm thick Glass Fiber Reinforced Plastics (GFRP) board and soldered to Cu caps at the both ends. We prepared two 500 A-class current lead units. The DC transport current of 800 A was stably applied at 77 K without any voltage generation in all coated conductors. The voltage between both Cu caps linearly increased with increasing the applied current, and was about 350 μV at 500 A in both current lead units. According to the estimated values of the heat leakage from 77 K to 4.2 K, the heat leakage for the current lead unit was 46.5 mW. We successfully attained reduction of the heat leakage because of improvement of the transport current performance (I c ), a thinner Ag layer of YBCO coated conductor and usage of the GFRP board for reinforcement instead of a stainless steel board used in the previous study. The DC transport current of 1400 A was stably applied when the two current lead units were joined in parallel. The sum of the heat leakages from 77 K to 4.2 K for the combined the current lead units was 93 mW. In comparison with the conventional Cu current leads by gas-cooling, it could be noted that the heat leakage of the current lead is about one order of magnitude smaller than that of the Cu current lead.

  12. Study on Mitigation Method of Solder Corrosion for Crystalline Silicon Photovoltaic Modules

    Directory of Open Access Journals (Sweden)

    Ju-Hee Kim

    2014-01-01

    Full Text Available The corrosion of 62Sn36Pb2Ag solder connections poses serious difficulties for outdoor-exposed photovoltaic (PV modules, as connection degradation contributes to the increase in series resistance (RS of PV modules. In this study, we investigated a corrosion mitigation method based on the corrosion mechanism. The effect of added sacrificial metal on the reliability of PV modules was evaluated using the oxidation-reduction (redox reaction under damp heat (DH conditions. Experimental results after exposure to DH show that the main reason for the decrease in power was a drop in the module’s fill factor. This drop was attributed to the increase of RS. The drop in output power of the PV module without added sacrificial metal is greater than that of the sample with sacrificial metal. Electroluminescence and current-voltage mapping analysis also show that the PV module with sacrificial metal experienced less degradation than the sample without sacrificial metal.

  13. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

  14. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

  15. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

  16. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan

    2009-01-01

    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work...

  17. About Dental Amalgam Fillings

    Science.gov (United States)

    ... and Medical Procedures Dental Devices Dental Amalgam About Dental Amalgam Fillings Share Tweet Linkedin Pin it More ... should I have my fillings removed? What is dental amalgam? Dental amalgam is a dental filling material ...

  18. Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

    Science.gov (United States)

    Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

    2018-03-01

    The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

  19. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  20. Automation of experimental research of waveguide paths induction soldering

    Science.gov (United States)

    Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

    2018-05-01

    The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

  1. Optimization of the soldering process by the DMAIC methodology

    Directory of Open Access Journals (Sweden)

    Michał Zasadzień

    2016-06-01

    Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

  2. Radiation damages on superionic conductors

    International Nuclear Information System (INIS)

    Awano, T.; Ikezawa, M.; Matsuyama, T.

    1995-01-01

    Irradiation coloration on superionic conductors of MA 4 X 5 (M=K, Rb, NH 4 ; A=Ag, Cu; X=Cl, I) was observed. Five absorption bands were observed at 1.4, 1.8, 2.1, 2.3 and 2.9 eV in RbAg 4 I 5 . In these crystals, stable coloration was observed at lower temperature than in alkali halides. The absorption bands due to electronic centers and hole one were classified from the results of optical breaching and electron or hole doping. Growth rate and induced spectra by irradiation changed drastically at the temperatures just above the superionic phase transition. The growth rate increased drastically also at 40 K. ESR signal of γ-irradiated RbCu 4 Cl 3 I 2 showed that one of the induced defects is a hole trapped by a monovalent copper ion (Cu 2+ ). (author)

  3. Drinking Water Contamination Due To Lead-based Solder

    Science.gov (United States)

    Garcia, N.; Bartelt, E.; Cuff, K. E.

    2004-12-01

    The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

  4. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan

    2017-08-10

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  5. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong

    2017-01-01

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  6. Thermomechanical behavior of tin-rich (lead-free) solders

    Science.gov (United States)

    Sidhu, Rajen Singh

    In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local

  7. The Calculated and Measured Resistance for Splices between Conductors in a MICE Superconducting Coil

    International Nuclear Information System (INIS)

    Green, Michael A.; Dietderich, Dan; Higley, Hugh; Pan, Heng; Tam, Darren; Trillaud, Federic; Wang, Li; Wu, Hong; Xu, Feng Yu

    2009-01-01

    The resistance of superconducting joints within MICE coils is an important issue particularly for the coupling coils. The MICE tracker solenoids have only two superconducting joints in the three spectrometer set (end coil 1, the center coil and end coil 2). The AFC magnets may have only a single joint within the coil. The coupling coils may have as many as fifteen joints within the coil, due to relatively short piece lengths of the superconductor. LBNL and ICST looked at three types of coil joints. They are: (1) cold fusion butt joints, (2) side-by-side lap joints, and (3) up-down lap joints. A theoretical calculation of the joint resistance was done at LBNL and checked by ICST. After looking at the theoretical resistance of the three types of joints, it was decided that the cold welded butt joint was not an attractive alternative for joints within a MICE superconducting magnet coil. Side-by-side and up-down lap joints were fabricated at ICST using two types of soft solder between the conductors. These conductor joints were tested at LBNL at liquid helium temperatures over a range of magnetic fields. The joint resistance was compared with the theoretical calculations. Measurements of splice strength were also made at 300 K and 77 K.

  8. Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

    Energy Technology Data Exchange (ETDEWEB)

    Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

    1999-11-01

    Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

  9. Influence of solder joint length to the mechanical aspect during the thermal stress analysis

    Science.gov (United States)

    Tan, J. S.; Khor, C. Y.; Rahim, Wan Mohd Faizal Wan Abd; Ishak, Muhammad Ikman; Rosli, M. U.; Jamalludin, Mohd Riduan; Zakaria, M. S.; Nawi, M. A. M.; Aziz, M. S. Abdul; Ani, F. Che

    2017-09-01

    Solder joint is an important interconnector in surface mount technology (SMT) assembly process. The real time stress, strain and displacement of the solder joint is difficult to observe and assess the experiment. To tackle these problems, simulation analysis was employed to study the von Mises stress, strain and displacement in the thermal stress analysis by using Finite element based software. In this study, a model of leadless electronic package was considered. The thermal stress analysis was performed to investigate the effect of the solder length to those mechanical aspects. The simulation results revealed that solder length gives significant effect to the maximum von Mises stress to the solder joint. Besides, changes in solder length also influence the displacement of the solder joint in the thermal environment. The increment of the solder length significantly reduces the von Mises stress and strain on the solder joint. Thus, the understanding of the physical parameter for solder joint is important for engineer prior to designing the solder joint of the electronic component.

  10. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    DEFF Research Database (Denmark)

    High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

  11. Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

    2008-04-24

    The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes.

  12. Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

    Science.gov (United States)

    This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

  13. Frequency Dependent Losses in Transmission Cable Conductors

    DEFF Research Database (Denmark)

    Olsen, Rasmus Schmidt; Holbøll, Joachim; Guðmundsdóttir, Unnur Stella

    2011-01-01

    , such as thermal conditions in and around the cable, as well as the heat generated in conductors, screens, armours etc., taking into account proximity and skin effects. The work performed and presented in this paper is concerned with an improved determination of the losses generated in the conductor, by means...... of better calculation of the AC resistance of transmission cable conductors, in particular regarding higher frequencies. In this way, also losses under harmonics can be covered. Furthermore, the model is suitable for modelling of transient attenuation in high voltage cables. The AC resistance is calculated...... based on the current density distribution in different conductor designs by means of the Finite Element Method (FEM). The obtained results and methods are compared to available standards (IEC publication 60287-1-1)....

  14. Rail industry job analysis : passenger conductor.

    Science.gov (United States)

    2013-02-01

    This document describes the results of a job analysis that was conducted for the position of railroad Passenger Conductor. Key aspects of the position were identified, including main tasks and knowledge, skills, abilities, and other characteristics (...

  15. Rail industry job analysis : freight conductor.

    Science.gov (United States)

    2013-03-01

    This document describes the results from a job analysis that was conducted for the position of Freight Conductor. Key aspects of the position were identified, including main tasks and knowledge, skills, abilities, and other characteristics (KSAOs) ne...

  16. Horizon shells and BMS-like soldering transformations

    Energy Technology Data Exchange (ETDEWEB)

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

    2016-03-07

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  17. Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

    International Nuclear Information System (INIS)

    Liu, X.W.; Plumbridge, W.J.

    2003-01-01

    The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

  18. Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

    2017-07-27

    Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integrated with attractive fabrication techniques for thermoelectric modules, such as screen printing, suggesting the potential of these solders in the rational design of printable and moldable thermoelectrics.

  19. Effects of PCB thickness on adjustable fountain wave soldering

    Indian Academy of Sciences (India)

    hybrid circuit assembly, component lead tinning, and wire tinning. .... The mesh model was built and optimized with 599920 hybrid nodes as shown in figure 9. ... conducted to track the fluid motions of the two phases (i.e., molten solder and air).

  20. Mutual capacitance of liquid conductors in deformable tactile sensing arrays

    Energy Technology Data Exchange (ETDEWEB)

    Li, Bin [Electrical and Computer Engineering Department, Drexel University, Philadelphia, Pennsylvania 19104 (United States); Fontecchio, Adam K. [Electrical and Computer Engineering and Materials Science and Engineering Departments, Drexel University, Philadelphia, Pennsylvania 19104 (United States); Visell, Yon [Electrical and Computer Engineering Department, Media Arts and Technology, California NanoSystems Institute, University of California, Santa Barbara, California 93106 (United States)

    2016-01-04

    Advances in highly deformable electronics are needed in order to enable emerging categories of soft computing devices ranging from wearable electronics, to medical devices, and soft robotic components. The combination of highly elastic substrates with intrinsically stretchable conductors holds the promise of enabling electronic sensors that can conform to curved objects, reconfigurable displays, or soft biological tissues, including the skin. Here, we contribute sensing principles for tactile (mechanical image) sensors based on very low modulus polymer substrates with embedded liquid metal microfluidic arrays. The sensors are fabricated using a single-step casting method that utilizes fine nylon filaments to produce arrays of cylindrical channels on two layers. The liquid metal (gallium indium alloy) conductors that fill these channels readily adopt the shape of the embedding membrane, yielding levels of deformability greater than 400%, due to the use of soft polymer substrates. We modeled the sensor performance using electrostatic theory and continuum mechanics, yielding excellent agreement with experiments. Using a matrix-addressed capacitance measurement technique, we are able to resolve strain distributions with millimeter resolution over areas of several square centimeters.

  1. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Directory of Open Access Journals (Sweden)

    Yee Mei Leong

    2016-06-01

    Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

  2. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Science.gov (United States)

    Leong, Yee Mei; Haseeb, A.S.M.A.

    2016-01-01

    Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

  3. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Haiyan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Peng, Jianke [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Fu, Li, E-mail: fuli@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Wang, Xincheng [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Xie, Yan [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China)

    2016-04-15

    Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  4. Effects of soldering methods on tensile strength of a gold-palladium metal ceramic alloy.

    Science.gov (United States)

    Ghadhanfari, Husain A; Khajah, Hasan M; Monaco, Edward A; Kim, Hyeongil

    2014-10-01

    The tensile strength obtained by conventional postceramic application soldering and laser postceramic welding may require more energy than microwave postceramic soldering, which could provide similar tensile strength values. The purpose of the study was to compare the tensile strength obtained by microwave postceramic soldering, conventional postceramic soldering, and laser postceramic welding. A gold-palladium metal ceramic alloy and gold-based solder were used in this study. Twenty-seven wax specimens were cast in gold-palladium noble metal and divided into 4 groups: laser welding with a specific postfiller noble metal, microwave soldering with a postceramic solder, conventional soldering with the same postceramic solder used in the microwave soldering group, and a nonsectioned control group. All the specimens were heat treated to simulate a normal porcelain sintering sequence. An Instron Universal Testing Machine was used to measure the tensile strength for the 4 groups. The means were analyzed statistically with 1-way ANOVA. The surface and fracture sites of the specimens were subjectively evaluated for fracture type and porosities by using a scanning electron microscope. The mean (standard deviation) ultimate tensile strength values were as follows: nonsectioned control 818 ±30 MPa, microwave 516 ±34 MPa, conventional 454 ±37 MPa, and laser weld 191 ±39 MPa. A 1-way ANOVA showed a significant difference in ultimate tensile strength among the groups (F3,23=334.5; Ptensile strength for gold and palladium noble metals than either conventional soldering or laser welding. Conventional soldering resulted in a higher tensile strength than laser welding. Under the experimental conditions described, either microwave or conventional postceramic soldering would appear to satisfy clinical requirements related to tensile strength. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

  5. Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

    Science.gov (United States)

    Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

    2017-10-01

    Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

  6. Admittance of multiterminal quantum Hall conductors at kilohertz frequencies

    International Nuclear Information System (INIS)

    Hernández, C.; Consejo, C.; Chaubet, C.; Degiovanni, P.

    2014-01-01

    We present an experimental study of the low frequency admittance of quantum Hall conductors in the [100 Hz, 1 MHz] frequency range. We show that the frequency dependence of the admittance of the sample strongly depends on the topology of the contacts connections. Our experimental results are well explained within the Christen and Büttiker approach for finite frequency transport in quantum Hall edge channels taking into account the influence of the coaxial cables capacitance. In the Hall bar geometry, we demonstrate that there exists a configuration in which the cable capacitance does not influence the admittance measurement of the sample. In this case, we measure the electrochemical capacitance of the sample and observe its dependence on the filling factor

  7. Admittance of multiterminal quantum Hall conductors at kilohertz frequencies

    Energy Technology Data Exchange (ETDEWEB)

    Hernández, C. [Departamento de Física, Universidad Militar Nueva Granada, Carrera 11 101-80 Bogotá D.C. (Colombia); Consejo, C.; Chaubet, C., E-mail: christophe.chaubet@univ-montp2.fr [Université Montpellier 2, Laboratoire Charles Coulomb UMR5221, F-34095 Montpellier, France and CNRS, Laboratoire Charles Coulomb UMR5221, F-34095 Montpellier (France); Degiovanni, P. [Université de Lyon, Fédération de Physique Andrée Marie Ampère, CNRS, Laboratoire de Physique de l' Ecole Normale Supérieure de Lyon, 46 allée d' Italie, 69364 Lyon Cedex 07 (France)

    2014-03-28

    We present an experimental study of the low frequency admittance of quantum Hall conductors in the [100 Hz, 1 MHz] frequency range. We show that the frequency dependence of the admittance of the sample strongly depends on the topology of the contacts connections. Our experimental results are well explained within the Christen and Büttiker approach for finite frequency transport in quantum Hall edge channels taking into account the influence of the coaxial cables capacitance. In the Hall bar geometry, we demonstrate that there exists a configuration in which the cable capacitance does not influence the admittance measurement of the sample. In this case, we measure the electrochemical capacitance of the sample and observe its dependence on the filling factor.

  8. The metallurgical approach on the solder voids behaviour in surface mount devices

    International Nuclear Information System (INIS)

    Mohabattul Zaman Bukhari

    1996-01-01

    Solder voids are believed to cause poor heat dissiption in the Surface Mount devices and reduce the reliability of the devices at higher operating services. There are a lot of factors involved in creating voids such as gas/flux entrapment, wettability, outgasseous, air bubbles in the solder paste, inconsistency of solder coverage and improper metal scheme selection. This study was done to observe the behaviour of the solder voids in term of flux entrapmentt and wettability. It is believed that flux entrapment and wettability are verify this hypothesis. Two types of metal scheme were chosen which are Nickel (Ni) plated and Tin (Sn) plated heatsink. X-ray techniques such as Radiographic Inspection Analysis and EDAX were used to detect the minute solder voids. The solder voids observed on the heatsinks and Copper shims after the reflow process are believed to be a non contact voids that resulted from some portion of the surface not wetting properly

  9. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Science.gov (United States)

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  10. Sodium fill of FFTF

    International Nuclear Information System (INIS)

    Waldo, J.B.; Greenwell, R.K.; Keasling, T.A.; Collins, J.R.; Klos, D.B.

    1980-02-01

    With construction of the Fast Flux Test Facility (FFTF) completed, the first major objective in the startup program was to fill the sodium systems. A sodium fill sequence was developed to match construction completion, and as systems became available, they were inerted, preheated, and filled with sodium. The secondary sodium systems were filled first while dry refueling system testing was in progress in the reactor vessel. The reactor vessel and the primary loops were filled last. This paper describes the methods used and some of the key results achieved for this major FFTF objective

  11. Interfacial reaction of Sn-based solder joint in the package system

    Science.gov (United States)

    Gu, Huandi

    In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

  12. A new method for soldering particle-reinforced aluminum metal matrix composites

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Jinbin; Mu, Yunchao [Zhongyuan University of Technology, Zhengzhou 450007 (China); Luo, Xiangwei [Zhengzhou University, Zhengzhou 450002 (China); Niu, Jitai, E-mail: niujitai@163.com [Zhongyuan University of Technology, Zhengzhou 450007 (China)

    2012-12-01

    Highlights: Black-Right-Pointing-Pointer Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. Black-Right-Pointing-Pointer The nickel plating is required on the surface of the composites before soldering. Black-Right-Pointing-Pointer Low welding temperature is set to avoid overheating of the matrix. Black-Right-Pointing-Pointer Chemical and metallurgical bonding of composites and Kovar is carried out. Black-Right-Pointing-Pointer High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al-SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe-Ni-Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn-Cd-Ag-Cu) with a melting point of about 400 Degree-Sign C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)-Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al-SiC composite.

  13. A new method for soldering particle-reinforced aluminum metal matrix composites

    International Nuclear Information System (INIS)

    Lu, Jinbin; Mu, Yunchao; Luo, Xiangwei; Niu, Jitai

    2012-01-01

    Highlights: ► Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. ► The nickel plating is required on the surface of the composites before soldering. ► Low welding temperature is set to avoid overheating of the matrix. ► Chemical and metallurgical bonding of composites and Kovar is carried out. ► High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al–SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe–Ni–Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn–Cd–Ag–Cu) with a melting point of about 400 °C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)–Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al–SiC composite.

  14. Laser tissue welding mediated with a protein solder

    Science.gov (United States)

    Small, Ward, IV; Heredia, Nicholas J.; Celliers, Peter M.; Da Silva, Luiz B.; Eder, David C.; Glinsky, Michael E.; London, Richard A.; Maitland, Duncan J.; Matthews, Dennis L.; Soltz, Barbara A.

    1996-05-01

    A study of laser tissue welding mediated with an indocyanine green dye-enhanced protein solder was performed. Freshly obtained sections of porcine artery were used for the experiments. Sample arterial wall thickness ranged from two to three millimeters. Incisions approximately four millimeters in length were treated using an 805 nanometer continuous- wave diode laser coupled to a one millimeter diameter fiber. Controlled parameters included the power delivered by the laser, the duration of the welding process, and the concentration of dye in the solder. A two-color infrared detection system was constructed to monitor the surface temperatures achieved at the weld site. Burst pressure measurements were made to quantify the strengths of the welds immediately following completion of the welding procedure.

  15. Quality Analysis of Welded and Soldered Joints of Cu-Nb Microcomposite Wires

    Directory of Open Access Journals (Sweden)

    Nikolaj VIŠNIAKOV

    2011-03-01

    Full Text Available Quality analysis of welded and soldered joints of Cu-Nb microcomposite wires has been performed. Quality and mechanical characteristics of joints as ultimate tensile stress limit and elongation at break were measured with an universal testing machine and controlled visually using an optical microscope. Two wires joints were soldered with silver and copper solders and put into steel and copper sleeve respectively. Another two wires joints were soldered with silver solder and welded without any reinforcement. Joints soldered with the silver solder and steel sleeve have demonstrated the best mechanical characteristics: ultimate tensile stress limit of 650 MPa and elongation at break of 0.85 %. Joints soldered with the copper sleeve have no advantages comparing with the soldered butt joint. Ultimate tensile stress limit and elongation at break were in 300 MPa - 350 MPa and in 0.35 % - 0.45 % ranges respectively. Two welded joints had ultimate tensile stress limit of 470 MPa and elongation at break of 0.71 %. In all joints the microstructure of Nb filaments was destroyed and mechanical properties have been specified by mechanical strength of copper and sleeve materials only.http://dx.doi.org/10.5755/j01.ms.17.1.242

  16. Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Kita, T; Mukaibo, N; Ando, K; Moriyama, M [Honda R and D Co. Ltd., Tokyo (Japan)

    1997-10-01

    Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

  17. Properties and applications of perovskite proton conductors

    Directory of Open Access Journals (Sweden)

    Eduardo Caetano Camilo de Souza

    2010-09-01

    Full Text Available A brief overview is given of the main types and principles of solid-state proton conductors with perovskite structure. Their properties are summarized in terms of the defect chemistry, proton transport and chemical stability. A good understanding of these subjects allows the manufacturing of compounds with the desired electrical properties, for application in renewable and sustainable energy devices. A few trends and highlights of the scientific advances are given for some classes of protonic conductors. Recent results and future prospect about these compounds are also evaluated. The high proton conductivity of barium cerate and zirconate based electrolytes lately reported in the literature has taken these compounds to a highlight position among the most studied conductor ceramic materials.

  18. Molecular dynamics studies of superionic conductors

    International Nuclear Information System (INIS)

    Rahman, A.; Vashishta, P.

    1983-01-01

    Structural and dynamical properties of superionic conductors AgI and CuI are studied using molecular dynamics (MD) techniques. The model of these superionic conductors is based on the use of effective pair potentials. To determine the constants in these potentials, cohesive energy and bulk modulus are used as input: in addition one uses notions of ionic size based on the known crystal structure. Salient features of the MD technique are outlined. Methods of treating long range Coulomb forces are discussed in detail. This includes the manner of doing Ewald sum for MD cells of arbitrary shape. Features that can be incorporated to expedite the MD calculations are also discussed. A novel MD technique which allows for a dynamically controlled variation of the shape and size of the MD cell is described briefly. The development of this novel technique has made it possible to study structural phase transitions in superionic conductors. 68 references, 17 figures, 2 tables

  19. The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

    Science.gov (United States)

    Mayappan, R.; Salleh, A.; Andas, J.

    2017-09-01

    Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

  20. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Directory of Open Access Journals (Sweden)

    Saliza Azlina O.

    2016-01-01

    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  1. Laser beam soldering of micro-optical components

    Science.gov (United States)

    Eberhardt, R.

    2003-05-01

    MOTIVATION Ongoing miniaturisation and higher requirements within optical assemblies and the processing of temperature sensitive components demands for innovative selective joining techniques. So far adhesive bonding has primarily been used to assemble and adjust hybrid micro optical systems. However, the properties of the organic polymers used for the adhesives limit the application of these systems. In fields of telecommunication and lithography, an enhancement of existing joining techniques is necessary to improve properties like humidity resistance, laserstability, UV-stability, thermal cycle reliability and life time reliability. Against this background laser beam soldering of optical components is a reasonable joining technology alternative. Properties like: - time and area restricted energy input - energy input can be controlled by the process temperature - direct and indirect heating of the components is possible - no mechanical contact between joining tool and components give good conditions to meet the requirements on a joining technology for sensitive optical components. Additionally to the laser soldering head, for the assembly of optical components it is necessary to include positioning units to adjust the position of the components with high accuracy before joining. Furthermore, suitable measurement methods to characterize the soldered assemblies (for instance in terms of position tolerances) need to be developed.

  2. Scalable Manufacturing of Solderable and Stretchable Physiologic Sensing Systems.

    Science.gov (United States)

    Kim, Yun-Soung; Lu, Jesse; Shih, Benjamin; Gharibans, Armen; Zou, Zhanan; Matsuno, Kristen; Aguilera, Roman; Han, Yoonjae; Meek, Ann; Xiao, Jianliang; Tolley, Michael T; Coleman, Todd P

    2017-10-01

    Methods for microfabrication of solderable and stretchable sensing systems (S4s) and a scaled production of adhesive-integrated active S4s for health monitoring are presented. S4s' excellent solderability is achieved by the sputter-deposited nickel-vanadium and gold pad metal layers and copper interconnection. The donor substrate, which is modified with "PI islands" to become selectively adhesive for the S4s, allows the heterogeneous devices to be integrated with large-area adhesives for packaging. The feasibility for S4-based health monitoring is demonstrated by developing an S4 integrated with a strain gauge and an onboard optical indication circuit. Owing to S4s' compatibility with the standard printed circuit board assembly processes, a variety of commercially available surface mount chip components, such as the wafer level chip scale packages, chip resistors, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating the versatile and modular nature of S4s. Tegaderm-integrated S4 respiration sensors are tested for robustness for cyclic deformation, maximum stretchability, durability, and biocompatibility for multiday wear time. The results of the tests and demonstration of the respiration sensing indicate that the adhesive-integrated S4s can provide end users a way for unobtrusive health monitoring. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  3. Challenges and status of ITER conductor production

    Science.gov (United States)

    Devred, A.; Backbier, I.; Bessette, D.; Bevillard, G.; Gardner, M.; Jong, C.; Lillaz, F.; Mitchell, N.; Romano, G.; Vostner, A.

    2014-04-01

    Taking the relay of the large Hadron collider (LHC) at CERN, ITER has become the largest project in applied superconductivity. In addition to its technical complexity, ITER is also a management challenge as it relies on an unprecedented collaboration of seven partners, representing more than half of the world population, who provide 90% of the components as in-kind contributions. The ITER magnet system is one of the most sophisticated superconducting magnet systems ever designed, with an enormous stored energy of 51 GJ. It involves six of the ITER partners. The coils are wound from cable-in-conduit conductors (CICCs) made up of superconducting and copper strands assembled into a multistage cable, inserted into a conduit of butt-welded austenitic steel tubes. The conductors for the toroidal field (TF) and central solenoid (CS) coils require about 600 t of Nb3Sn strands while the poloidal field (PF) and correction coil (CC) and busbar conductors need around 275 t of Nb-Ti strands. The required amount of Nb3Sn strands far exceeds pre-existing industrial capacity and has called for a significant worldwide production scale up. The TF conductors are the first ITER components to be mass produced and are more than 50% complete. During its life time, the CS coil will have to sustain several tens of thousands of electromagnetic (EM) cycles to high current and field conditions, way beyond anything a large Nb3Sn coil has ever experienced. Following a comprehensive R&D program, a technical solution has been found for the CS conductor, which ensures stable performance versus EM and thermal cycling. Productions of PF, CC and busbar conductors are also underway. After an introduction to the ITER project and magnet system, we describe the ITER conductor procurements and the quality assurance/quality control programs that have been implemented to ensure production uniformity across numerous suppliers. Then, we provide examples of technical challenges that have been encountered and

  4. Velocity measurement of conductor using electromagnetic induction

    International Nuclear Information System (INIS)

    Kim, Gu Hwa; Kim, Ho Young; Park, Joon Po; Jeong, Hee Tae; Lee, Eui Wan

    2002-01-01

    A basic technology was investigated to measure the speed of conductor by non-contact electromagnetic method. The principle of the velocity sensor was electromagnetic induction. To design electromagnet for velocity sensor, 2D electromagnetic analysis was performed using FEM software. The sensor output was analyzed according to the parameters of velocity sensor, such as the type of magnetizing currents and the lift-off. Output of magnetic sensor was linearly depended on the conductor speed and magnetizing current. To compensate the lift-off changes during measurement of velocity, the other magnetic sensor was put at the pole of electromagnet.

  5. Challenges and status of ITER conductor production

    International Nuclear Information System (INIS)

    Devred, A; Backbier, I; Bessette, D; Bevillard, G; Gardner, M; Jong, C; Lillaz, F; Mitchell, N; Romano, G; Vostner, A

    2014-01-01

    Taking the relay of the large Hadron collider (LHC) at CERN, ITER has become the largest project in applied superconductivity. In addition to its technical complexity, ITER is also a management challenge as it relies on an unprecedented collaboration of seven partners, representing more than half of the world population, who provide 90% of the components as in-kind contributions. The ITER magnet system is one of the most sophisticated superconducting magnet systems ever designed, with an enormous stored energy of 51 GJ. It involves six of the ITER partners. The coils are wound from cable-in-conduit conductors (CICCs) made up of superconducting and copper strands assembled into a multistage cable, inserted into a conduit of butt-welded austenitic steel tubes. The conductors for the toroidal field (TF) and central solenoid (CS) coils require about 600 t of Nb 3 Sn strands while the poloidal field (PF) and correction coil (CC) and busbar conductors need around 275 t of Nb–Ti strands. The required amount of Nb 3 Sn strands far exceeds pre-existing industrial capacity and has called for a significant worldwide production scale up. The TF conductors are the first ITER components to be mass produced and are more than 50% complete. During its life time, the CS coil will have to sustain several tens of thousands of electromagnetic (EM) cycles to high current and field conditions, way beyond anything a large Nb 3 Sn coil has ever experienced. Following a comprehensive R and D program, a technical solution has been found for the CS conductor, which ensures stable performance versus EM and thermal cycling. Productions of PF, CC and busbar conductors are also underway. After an introduction to the ITER project and magnet system, we describe the ITER conductor procurements and the quality assurance/quality control programs that have been implemented to ensure production uniformity across numerous suppliers. Then, we provide examples of technical challenges that have been

  6. Resistive coating for current conductors in cryogenic applications

    International Nuclear Information System (INIS)

    Hirayama, C.; Wagner, G.R.

    1982-01-01

    This invention relates to a resistive or semiconducting coating for use on current conductors in cryogenic applications. This includes copper-clad superconductor wire, copper wire used for stabilizing superconductor magnets, and for hyperconductors. The coating is a film of cuprous sulfide (Cu2S) that has been found not to degrade the properties of the conductors. It is very adherent to the respective conductors and satisfies the mechanical, thermal and electrical requirements of coatings for the conductors

  7. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-11-25

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

  8. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    International Nuclear Information System (INIS)

    Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-01-01

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

  9. High-temperature superconducting conductors and cables

    International Nuclear Information System (INIS)

    Peterson, D.E.; Maley, M.P.; Boulaevskii, L.; Willis, J.O.; Coulter, J.Y.; Ullmann, J.L.; Cho, Jin; Fleshler, S.

    1996-01-01

    This is the final report of a 3-year LDRD project at LANL. High-temperature superconductivity (HTS) promises more efficient and powerful electrical devices such as motors, generators, and power transmission cables; however this depends on developing HTS conductors that sustain high current densities J c in high magnetic fields at temperatures near liq. N2's bp. Our early work concentrated on Cu oxides but at present, long wire and tape conductors can be best made from BSCCO compounds with high J c at low temperatures, but which are degraded severely at temperatures of interest. This problem is associated with thermally activated motion of magnetic flux lines in BSCCO. Reducing these dc losses at higher temperatures will require a high density of microscopic defects that will pin flux lines and inhibit their motion. Recently it was shown that optimum defects can be produced by small tracks formed by passage of energetic heavy ions. Such defects result when Bi is bombarded with high energy protons. The longer range of protons in matter suggests the possibility of application to tape conductors. AC losses are a major limitation in many applications of superconductivity such as power transmission. The improved pinning of flux lines reduces ac losses, but optimization also involves other factors. Measuring and characterizing these losses with respect to material parameters and conductor design is essential to successful development of ac devices

  10. 33 CFR 183.425 - Conductors: General.

    Science.gov (United States)

    2010-07-01

    ...) BOATING SAFETY BOATS AND ASSOCIATED EQUIPMENT Electrical Systems Manufacturer Requirements § 183.425... than 30 inches. (g) This section does not apply to communications systems; electronic navigation... conductors and terminations that are in ignition systems; pigtails of less than seven inches of exposed...

  11. High Temperature Protonic Conductors by Melt Growth

    Science.gov (United States)

    2006-11-21

    A.R. de Arellano-López, A. Sayir. “Microestructura y Comportamiento Plástico de Perovsquitas Conductoras Protónicas de Alta Temperatura ”. Bol. Soc...Conductores Protónicos de Alta Temperatura Crecidos por Fusión de Zona Flotante”. VII Reunión Nacional y VI Conferencia Iberoamericana (Electrocerámica

  12. Reshaping the perfect electrical conductor cylinder arbitrarily

    International Nuclear Information System (INIS)

    Chen Huanyang; Zhang Xiaohe; Luo Xudong; Ma Hongru; Chan Cheting

    2008-01-01

    A general method is proposed to design a cylindrical cloak, concentrator and superscatterer with an arbitrary cross section. The method is demonstrated by the design of a perfect electrical conductor (PEC) reshaper which is able to reshape a PEC cylinder arbitrarily by combining the concept of cloak, concentrator and superscatterer together. Numerical simulations are performed to demonstrate its properties.

  13. Control of Radioactive Lightning-Conductor

    International Nuclear Information System (INIS)

    Esposito, E.

    2004-01-01

    The radioactive lightning-conductor production in Brazil was started in 1970 and after a period of 19 years of commercialization of these devices, the National Nuclear Energy Commission (CNEN), based in studies done in Brazil and abroad, proved that the radioactive lightning-conductor performance wasn't superior to the conventional one, so the use of radioactive source is not justified. Thence, the authorization for its production was suspended and the installation of this type of lightning-conductor was forbidden. The radioactive material that results from the dismount of these devices must be immediately sent to CNEN, for treatment and temporary storage. After this prohibition and its publication in several specialized magazines, CNEN was searched for several institutions, factories, churches, etc, interested in obtaining information about the handling and shipment procedures of radioactive lightning-conductors that are inoperative and that must be sent to CNEN's Institutes, in a correct and secure form. From this moment CNEN technicians realize that the owners of radioactive lightning-conductors didn't have any knowledge and training in radiation protection, neither in equipment to monitoring the radiation. The radioactive material from these sources is, in almost all cases, the radioisotope 241Am which has a maximum activity of an order of 5 mCi (1,85 x 10-2 TBq); as the radiation emitted by 241Am is of alpha type, whose range in the air, is just few centimeters and the gamma rays are of low energy, an irradiation offer small risk. However, there is a contamination risk on someone hands, by the contact with the source. Aiming to attend, in an objective way, the users' interests in obtaining some pertinent technical information about the shipping of radioactive lightning-conductor that is inoperative or is being replaced and also to optimize its receipt in CNEN's Institutes, because there still has a great number of these lightning-conductors installed and still

  14. Specifications for conductors and proposed conductor configurations: Milestone M5.3

    CERN Document Server

    Bordini, Bernardo; Dhallé, Marc

    2018-01-01

    This document summarises the specifications of a superconductor suitable to be used in a particle accelerator dipole magnet that can reach a field of 16 Tesla during regular operation. The document reports also on the conductor configuration. These specifications set the performance targets for industrial production requirements at large scale. The document motivates the specifications on one hand by taking a particular magnet baseline design as starting point and by considering the results of various conductor test campaigns carried out at partner institutes.

  15. Alloy spreading and filling of gaps in brazing of VDU-2 and KhN50VMTYuB heat resistant nickel alloys with VPr3K and VPr10 alloys

    International Nuclear Information System (INIS)

    Shapiro, A.E.; Podol'skij, B.A.; Lepisko, M.R.; Borzyak, A.G.; Moryakov, V.F.; Rostislavskaya, T.T.

    1984-01-01

    A study was made on contact interaction of VDU-2 and KhN50VMTYuB alloys with VPr3K and VPr10 alloys at 1325 and 1220 deg C in argon and industrial vacuum. The contact angles and wettability indexes were determined. The solders fill the vertical gaps of up to 0.25 mm width through 80 mm height. Spreading and filling of gaps proceeds better during soldering in argon with boron trifluoride addition as compared to soldering in industrial vacuum. VPr10 alloy is divided into two phases when wetting KhN50VMTYuB alloy: fusible one on the base of nickel-chromium-manganese solution and infusible one on the base of nickel-niobium eutectics. The square of fusible phase spreading is 2.5...3 times larger as compared to infusible one

  16. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

  17. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    Science.gov (United States)

    Sorg, Brian S.; Welch, Ashley J.

    2001-05-01

    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  18. Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Andersson, D.; Hoo, N.; Pearce, J.; Watson, A.; Dinsdale, A.; Mucklejohn, S.

    2012-01-01

    Roč. 21, č. 5 (2012), s. 629-637 ISSN 1059-9495 Institutional support: RVO:68081723 Keywords : lead-free soldering, * materials for high-temperature LF * new technologies for HT lead-free soldering Subject RIV: BJ - Thermodynamics Impact factor: 0.915, year: 2012

  19. Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

    Science.gov (United States)

    Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

    2018-03-01

    In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

  20. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    Science.gov (United States)

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

    2015-08-01

    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

  1. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

    Science.gov (United States)

    Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

    2017-08-01

    Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

  2. Corrosion Reliability of Lead-free Solder Systems Used in Electronics

    DEFF Research Database (Denmark)

    Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

    2017-01-01

    humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

  3. Reliability and microstructure of lead-free solder joints in industrial electronics after accelerated thermal aging

    NARCIS (Netherlands)

    Scaltro, F.; Biglari, M.H.; Kodentsov, A.; Yakovleva, O.; Brom, E.

    2009-01-01

    The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface component/solder together with the formation of fractures. The evolution, the morphology and the elemental

  4. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    DEFF Research Database (Denmark)

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

    2017-01-01

    with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  5. High current density aluminum stabilized conductor concepts for space applications

    International Nuclear Information System (INIS)

    Huang, X.; Eyssa, Y.M.; Hilal, M.A.

    1989-01-01

    Lightweight conductors are needed for space magnets to achieve values of E/M (energy stored per unit mass) comparable to the or higher than advanced batteries. High purity aluminum stabilized NbTi composite conductors cooled by 1.8 K helium can provide a winding current density up to 15 kA/cm/sup 2/ at fields up to 10 tesla. The conductors are edge cooled with enough surface area to provide recovery following a normalizing disturbance. The conductors are designed so that current diffusion time in the high purity aluminum is smaller than thermal diffusion time in helium. Conductor design, stability and current diffusion are considered in detail

  6. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Fan Yang

    2016-01-01

    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  7. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    International Nuclear Information System (INIS)

    Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

    2010-01-01

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  8. Physical properties of lead free solders in liquid and solid state

    Energy Technology Data Exchange (ETDEWEB)

    Mhiaoui, Souad

    2007-04-17

    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  9. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

    2010-02-18

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  10. An Approach for Impression Creep of Lead Free Microelectronic Solders

    Science.gov (United States)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  11. Transected sciatic nerve repair by diode laser protein soldering.

    Science.gov (United States)

    Fekrazad, Reza; Mortezai, Omid; Pedram, MirSepehr; Kalhori, Katayoun Am; Joharchi, Khojasteh; Mansoori, Korosh; Ebrahimi, Roja; Mashhadiabbas, Fatemeh

    2017-08-01

    Despite advances in microsurgical techniques, repair of peripheral nerve injuries (PNI) is still a major challenge in regenerative medicine. The standard treatment for PNI includes suturing and anasthomosis of the transected nerve. The objective of this study was to compare neurorraphy (nerve repair) using standard suturingto diode laser protein soldering on the functional recovery of transected sciatic nerves. Thirty adult male Fischer-344 Wistar rats were randomly assigned to 3 groups: 1. The control group, no repair, 2. the standard of care suture group, and 3. The laser/protein solder group. For all three groups, the sciatic nerve was transected and the repair was done immediately. For the suture repair group, 10.0 prolene suture was used and for the laser/protein solder group a diode laser (500mW output power) in combination with bovine serum albumen and indocyanine green dye was used. Behavioral assessment by sciatic functional index was done on all rats biweekly. At 12weeks post-surgery, EMG recordings were done on all the rats and the rats were euthanized for histological evaluation of the sciatic nerves. The one-way ANOVA test was used for statistical analysis. The average time required to perform the surgery was significantly shorter for the laser-assisted nerve repair group compared to the suture group. The EMG evaluation revealed no difference between the two groups. Based on the sciatic function index the laser group was significantly better than the suture group after 12weeks (pneurorraphy using standard suturing methods. Copyright © 2017 Elsevier B.V. All rights reserved.

  12. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  13. Pressure brazing of ceramics to metals with copper solder

    International Nuclear Information System (INIS)

    Pavlova, M.A.; Metelkin, I.I.

    1986-01-01

    The effect on the quality of joints brazed with copper of different non metallized aluminooxide dielectrics with metals and alloys of a series of technological parameters (temperature, pressure, holding, and medium) in the course of pressure brazing is investigated. It is shown that in case of brazing with kovar and nickel the character of dependences is identical, however in all cases the joints with nickel are more durable. For the ceramics - molybdenum system characterized by weak interaction with copper solder kinetic dependences have no maximum and only under holding of more than 20 min the constant strength of 150-190 MPa is attained

  14. Benchmarking organic mixed conductors for transistors

    KAUST Repository

    Inal, Sahika; Malliaras, George G.; Rivnay, Jonathan

    2017-01-01

    Organic mixed conductors have garnered significant attention in applications from bioelectronics to energy storage/generation. Their implementation in organic transistors has led to enhanced biosensing, neuromorphic function, and specialized circuits. While a narrow class of conducting polymers continues to excel in these new applications, materials design efforts have accelerated as researchers target new functionality, processability, and improved performance/stability. Materials for organic electrochemical transistors (OECTs) require both efficient electronic transport and facile ion injection in order to sustain high capacity. In this work, we show that the product of the electronic mobility and volumetric charge storage capacity (µC*) is the materials/system figure of merit; we use this framework to benchmark and compare the steady-state OECT performance of ten previously reported materials. This product can be independently verified and decoupled to guide materials design and processing. OECTs can therefore be used as a tool for understanding and designing new organic mixed conductors.

  15. Benchmarking organic mixed conductors for transistors

    KAUST Repository

    Inal, Sahika

    2017-11-20

    Organic mixed conductors have garnered significant attention in applications from bioelectronics to energy storage/generation. Their implementation in organic transistors has led to enhanced biosensing, neuromorphic function, and specialized circuits. While a narrow class of conducting polymers continues to excel in these new applications, materials design efforts have accelerated as researchers target new functionality, processability, and improved performance/stability. Materials for organic electrochemical transistors (OECTs) require both efficient electronic transport and facile ion injection in order to sustain high capacity. In this work, we show that the product of the electronic mobility and volumetric charge storage capacity (µC*) is the materials/system figure of merit; we use this framework to benchmark and compare the steady-state OECT performance of ten previously reported materials. This product can be independently verified and decoupled to guide materials design and processing. OECTs can therefore be used as a tool for understanding and designing new organic mixed conductors.

  16. Superconducting homopolar motor and conductor development

    Science.gov (United States)

    Gubser, Donald U.

    1996-10-01

    The U.S. Navy has been developing superconducting homopolar motors for ship applications since 1969; a successful at-sea demonstration of the first motor, using NbTi wire for the magnet, was achieved in the early 1980s. Recently, this same motor was used as a test bed to demonstrate progress in high-critical-temperature superconducting magnet technology using bismuth-strontium- calcium-copper-oxide (BSCCO) compounds. In the fall of 1995, this motor achieved a performance of 124 kW operating at a temperature of 4.2 K and 91 kW while operating at 28 K. Future tests are scheduled using new magnets with conductors of both the 2223 and the 2212 BSCCO phases. This article describes the advantages of superconducting propulsion and recent progress in the development of BSCCO conductors for use in Navy power systems.

  17. Films of Carbon Nanomaterials for Transparent Conductors

    Directory of Open Access Journals (Sweden)

    Jun Wei

    2013-05-01

    Full Text Available The demand for transparent conductors is expected to grow rapidly as electronic devices, such as touch screens, displays, solid state lighting and photovoltaics become ubiquitous in our lives. Doped metal oxides, especially indium tin oxide, are the commonly used materials for transparent conductors. As there are some drawbacks to this class of materials, exploration of alternative materials has been conducted. There is an interest in films of carbon nanomaterials such as, carbon nanotubes and graphene as they exhibit outstanding properties. This article reviews the synthesis and assembly of these films and their post-treatment. These processes determine the film performance and understanding of this platform will be useful for future work to improve the film performance.

  18. Local noise in a diffusive conductor

    Science.gov (United States)

    Tikhonov, E. S.; Shovkun, D. V.; Ercolani, D.; Rossella, F.; Rocci, M.; Sorba, L.; Roddaro, S.; Khrapai, V. S.

    2016-07-01

    The control and measurement of local non-equilibrium configurations is of utmost importance in applications on energy harvesting, thermoelectrics and heat management in nano-electronics. This challenging task can be achieved with the help of various local probes, prominent examples including superconducting or quantum dot based tunnel junctions, classical and quantum resistors, and Raman thermography. Beyond time-averaged properties, valuable information can also be gained from spontaneous fluctuations of current (noise). From these perspective, however, a fundamental constraint is set by current conservation, which makes noise a characteristic of the whole conductor, rather than some part of it. Here we demonstrate how to remove this obstacle and pick up a local noise temperature of a current biased diffusive conductor with the help of a miniature noise probe. This approach is virtually noninvasive for the electronic energy distributions and extends primary local measurements towards strongly non-equilibrium regimes.

  19. AA, inner conductor of a magnetic horn

    CERN Multimedia

    CERN PhotoLab

    1981-01-01

    At the start-up of the AA and during its initial operation, magnetic horns focused the antiprotons emanating from the production target. These "current-sheet lenses" had a thin inner conductor (for minimum absorption of antiprotons), machined from aluminium to wall thicknesses of 0.7 or 1 mm. The half-sine pulses rose to 150 kA in 8 microsec. The angular acceptance was 50 mrad.

  20. Hall effect in organic layered conductors

    Directory of Open Access Journals (Sweden)

    R.A.Hasan

    2006-01-01

    Full Text Available The Hall effect in organic layered conductors with a multisheeted Fermi surfaces was considered. It is shown that the experimental study of Hall effect and magnetoresistance anisotropy at different orientations of current and a quantizing magnetic field relative to the layers makes it possible to determine the contribution of various charge carriers groups to the conductivity, and to find out the character of Fermi surface anisotropy in the plane of layers.

  1. Filling a Conical Cavity

    Science.gov (United States)

    Nye, Kyle; Eslam-Panah, Azar

    2016-11-01

    Root canal treatment involves the removal of infected tissue inside the tooth's canal system and filling the space with a dense sealing agent to prevent further infection. A good root canal treatment happens when the canals are filled homogeneously and tightly down to the root apex. Such a tooth is able to provide valuable service for an entire lifetime. However, there are some examples of poorly performed root canals where the anterior and posterior routes are not filled completely. Small packets of air can be trapped in narrow access cavities when restoring with resin composites. Such teeth can cause trouble even after many years and lead the conditions like acute bone infection or abscesses. In this study, the filling of dead-end conical cavities with various liquids is reported. The first case studies included conical cavity models with different angles and lengths to visualize the filling process. In this investigation, the rate and completeness at which a variety of liquids fill the cavity were observed to find ideal conditions for the process. Then, a 3D printed model of the scaled representation of a molar with prepared post spaces was used to simulate the root canal treatment. The results of this study can be used to gain a better understanding of the restoration for endodontically treated teeth.

  2. Albumin solder covalently bound to a polymer membrane: New approach to improve binding strength in laser tissue soldering in-vitro.

    Science.gov (United States)

    Hiebl, B; Ascher, L; Luetzow, K; Kratz, K; Gruber, C; Mrowietz, C; Nehring, M E; Lendlein, A; Franke, R-P; Jung, F

    2018-01-01

    Laser tissue soldering (LTS) based on indocyanine green (ICG)-mediated heat-denaturation of proteins might be a promising alternative technique for micro-suturing, but up to now the problem of too weak shear strength of the solder welds in comparison to sutures is not solved. Earlier reports gave promising results showing that solder supported by carrier materials can enhance the cohesive strength of the liquid solder. In these studies, the solder was applied to the carriers by dip coating. Higher reliability of the connection between the solder and the carrier material is expected when the solder is bound covalently to the carrier material. In the present study a poly(ether imide) (PEI) membrane served as carrier material and ICG-supplemented albumin as solder substrate. The latter was covalently coupled to the carrier membrane under physiological conditions to prevent structural protein changes. As laser source a diode continuous-wave laser emitting at 808 nm with intensities between 250 mW and 1500 mW was utilized. The albumin functionalized carrier membrane was placed onto the tunica media of explanted pig thoracic aortae forming an overlapping area of approximately 0.5×0.5 cm2. All tests were performed in a dry state to prevent laser light absorption by water. Infrared spectroscopy, spectro-photometrical determination of the secondary and primary amine groups after acid orange II staining, contact angle measurements, and atomic force microscopy proved the successful functionalization of the PEI membrane with albumin. A laser power of 450 mW LTS could generate a membrane-blood vessel connection which was characterized by a shear strength of 0.08±0.002 MPa, corresponding to 15% of the tensile strength of the native blood vessel. Theoretically, an overlapping zone of 4.1 mm around the entire circumference of the blood vessel could have provided shear strength of the PEI membrane-blood vessel compound identical to the tensile strength of the native

  3. Testing of the 3M Company Composite Conductor

    Energy Technology Data Exchange (ETDEWEB)

    Stovall, John P [ORNL; Rizy, D Tom [ORNL; Kisner, Roger A [ORNL

    2010-10-01

    The 3M Company has developed a high-temperature low-sag conductor referred to as Aluminum-Conductor Composite-Reinforced or ACCR. The conductor uses an aluminum metal matrix material to replace the steel in conventional conductors. The objective of this work is to accelerate the commercial acceptance by electric utilities of this new conductor design by testing four representative conductor classes in controlled conditions. A unique facility called the Powerline Conductor Accelerated Testing (PCAT) Facility was built at ORNL for testing overhead conductors. The PCAT has been uniquely designed for testing overhead bare transmission line conductors at high currents and temperatures after they have been installed and tensioned to the manufacturer's specifications. The ability to operate a transmission line conductor in this manner does not exist elsewhere in the United States. Four classes of ACCR cable designed by the 3M Company have been successfully test at ORNL small, medium, large and small/compact. Based on these and other manufacturer tests, the 3M Company has successfully introduced the ACCR into the commercial market and has completed over twenty installations for utility companies.

  4. Development of Pb-Free Nanocomposite Solder Alloys

    Directory of Open Access Journals (Sweden)

    Animesh K. Basak

    2018-04-01

    Full Text Available As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1 Al2O3 or (2 Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys.

  5. A flip chip process based on electroplated solder bumps

    Science.gov (United States)

    Salonen, J.; Salmi, J.

    1994-01-01

    Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

  6. A generalized transformation to convert an arbitrary perfect electric conductor into another arbitrary dielectric object

    International Nuclear Information System (INIS)

    Huang Lujun; Zhou Daming; Wang Jian; Li Guanhai; Li Zhifeng; Chen Xiaoshuang; Lu Wei

    2011-01-01

    A generalized transformation is proposed to design an illusion device. The device can reshape an arbitrarily shaped perfect electrical conductor (PEC) into another dielectric object with arbitrary geometry. Such a device can evolve into an ideal invisibility cloak with non-conformal boundaries if the virtual space is filled with air. Furthermore, the validity of our proposed transformation is confirmed by two specific devices. One is to convert a regular polygonal PEC cylinder into a circular dielectric cylinder. Another one is to reshape a circular PEC cylinder into a regular polygonal dielectric cylinder.

  7. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

    Science.gov (United States)

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-12-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

  8. Laser-tissue soldering with biodegradable polymer films in vitro: film surface morphology and hydration effects.

    Science.gov (United States)

    Sorg, B S; Welch, A J

    2001-01-01

    Previous research introduced the concept of using biodegradable polymer film reinforcement of a liquid albumin solder for improvement of the tensile strength of repaired incisions in vitro. In this study, the effect of creating small pores in the PLGA films on the weld breaking strength is studied. Additionally, the effect of hydration on the strength of the reinforced welds is investigated. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with an 806-nm CW diode laser. A poly(DL-lactic-co-glycolic acid) (PLGA) film was used to reinforce the solder (the controls had solder but no reinforcement). Breaking strengths were measured acutely and after hydration in saline for 1 and 2 days. The data were analyzed by ANOVA (P < 0.05) and multiple comparisons of means were performed using the Newman-Keuls test. The creation of pores in the PLGA films qualitatively improved the film flexibility without having an apparent adverse effect on the breaking strength, while the actual technique of applying the film and solder had more of an effect. The acute maximum average breaking strengths of some of the film reinforced specimens (114.7 g-134.4 g) were significantly higher (P < 0.05) than the acute maximum average breaking strength of the unreinforced control specimens (68.3 g). Film reinforced specimens were shown to have a statistically significantly higher breaking strength than unreinforced controls after 1- and 2-day hydration. Reinforcement of liquid albumin solders in laser-assisted incision repair appears to have advantages over conventional methods that do not reinforce the cohesive strength of the solder in terms of acute breaking strength and after immersion in moist environments for short periods of time. Using a film with the solder applied to one surface only may be advantageous over other techniques.

  9. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Energy Technology Data Exchange (ETDEWEB)

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

    2013-06-01

    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  10. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Directory of Open Access Journals (Sweden)

    Xiuyun Zhou

    2015-10-01

    Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  11. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

  12. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

  13. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    CERN Document Server

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

    2015-01-01

    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  14. Mechanical test of the model coil wound with large conductor

    International Nuclear Information System (INIS)

    Hiue, Hisaaki; Sugimoto, Makoto; Nakajima, Hideo; Yasukawa, Yukio; Yoshida, Kiyoshi; Hasegawa, Mitsuru; Ito, Ikuo; Konno, Masayuki.

    1992-09-01

    The high rigidity and strength of the winding pack are required to realize the large superconducting magnet for the fusion reactor. This paper describes mechanical tests concerning the rigidity of the winding pack. Samples were prepared to evaluate the adhesive strength between conductors and insulators. Epoxy and Bismaleimide-Triazine resin (BT resin) were used as the conductor insulator. The stainless steel (SS) 304 bars, whose surface was treated mechanically and chemically, was applied to the modeled conductor. The model coil was would with the model conductors covered with the insulator by grand insulator. A winding model combining 3 x 3 conductors was produced for measuring shearing rigidity. The sample was loaded with pure shearing force at the LN 2 temperature. The bar winding sample, by 8 x 6 conductors, was measured the bending rigidity. These three point bending tests were carried out at room temperature. The pancake winding sample was loaded with compressive forces to measure compressive rigidity of winding. (author)

  15. Apparatus to examine pulsed parallel field losses in large conductors

    International Nuclear Information System (INIS)

    Miller, J.R.; Shen, S.S.

    1977-01-01

    Conductors in tokamak toroidal field coils will be exposed to pulsed fields both parallel and perpendicular to the current direction. These conductors will likely be quite high capacity (10 to 20 kA) and therefore probably will be built up out of smaller units. We have previously published measurements of losses in conductors exposed to a pulsed parallel field, but those experiments necessarily used monolithic conductors of relatively small cross section because the pulse coil, a torus that surrounded the test conductor, was itself small. Here we describe an apparatus that is conceptually similar but has been scaled up to accept conductors of much larger cross section and current capacity. The apparatus consists basically of a superconducting torus that contains a movable spool to allow test samples to be wound inside without unwinding the torus. Details of apparatus design and capabilities are described and preliminary results from tests of the apparatus and from loss measurements using it are reported

  16. Test of ITER conductors in SULTAN: An update

    International Nuclear Information System (INIS)

    Bruzzone, Pierluigi; Stepanov, Boris; Wesche, Rainer; Herzog, Robert; Calzolaio, Ciro; Vogel, Martin

    2011-01-01

    The ITER Toroidal Field (TF) conductor qualification phase has been carried out by testing short sample prototype conductors in the SULTAN test facility. This phase, started in 2007, has been substantially completed after minor adjustment of the conductor specification and test procedures. All the parties involved in the TF conductor procurement passed the qualification phase. Starting 2010, the samples for TF process qualification phase are tested in SULTAN. A summary of the results for all the ITER Qualification samples and an updated statistics are presented for the V-I and V-T characteristics of the cable-in-conduit conductors (CICC), including Nb 3 Sn and NbTi samples assembled with either a 'bottom joint' or a 'U-bend'. The technical improvements of the test facility are reported, including the enhanced cyclic loading rate and the calibration of the current meter. An outlook of the ITER conductor tests in the coming years is also presented.

  17. Hearing status among Norwegian train drivers and train conductors

    OpenAIRE

    Lie, A.; Skogstad, M.; Johnsen, T. S.; Engdahl, B.; Tambs, K.

    2013-01-01

    Background There is a general perception that train drivers and conductors may be at increased risk of developing noise-induced hearing loss. Aims To study job-related hearing loss among train drivers and train conductors. Methods Audiograms from train drivers and train conductors were obtained from the medical records of the occupational health service of the major Norwegian railway company. The results were compared with audiograms from an internal control group of railway workers and an ex...

  18. Fabrication of built-up conductors for large pulsed coils

    International Nuclear Information System (INIS)

    Henke, M.D.; Schermer, R.I.

    1979-01-01

    The development work was performed to provide a low-loss, cryostable conductor capable of carrying 5 kA at 3 T for a 30-MJ coil cycled at 0.35 Hz. Much of the work is relevant to conductor development for other pulsed coils, such as a tokamak induction heating coil. As part of the development process, various conductor configurations were subjected to ac loss measurements, stability tests, electrical resistance measurements, and mechanical load-bearing and mechanical fatigue tests. The result is a conductor that appears to satisfy the design criteria with a considerable safety margin

  19. Development of YBCO tape conductor fabrication technology

    Energy Technology Data Exchange (ETDEWEB)

    Hong, G W; Kim, C J; Lee, H G. and others

    2001-08-01

    Superconductor when fabricated into wire shape is applied for developing electric power transmission cable, transformer, generator and SMES. Such superconducting power devices are capable of maximizing the efficiency of electricity and are anticipated to contribute for solving the energy problem of humankind. Furthermore the high temperature oxide superconductor developed in late 1980s is superconducting above boiling temperature of liquid nitrogen temperature has strong potential to realize superconducting power device and a lot of researches are being done in this field. Superconducting wire is the most important core material for developing superconducting power device and thermo-mechanical powder in tube process was developed to fabricated Ag/Bi-2223 conductor in long length having high critical current carrying capacity. Several companies fabricate and sell Ag/Bi-2223 superconducting wire longer than km length and used for developed electrical power device. But because of its inherent property of sharp decrease in current carrying capacity when applying high magnetic field, the application of Bi-2223 sire is limited as low as 20 K when the power device is in operating under high magnetic field. The YBCO tape conductor has the advantages of maintaining high critical current applying high magnetic field and can be used to most of the power device without special limitation. The metal substrate having good crystallographic texture and deposition technique which can deposit the good quality superconducting thin film continuously in large area are need to fabricate coated conductor, and this technique can be applied to develop the superconducting current limiter or magnetic field shielding device. A superconducting wire for using in high magnetic field is play a critical role in developing maglev, MRI, SMES, transformer, generator and motor and the continuous film deposition technique can be applied in other industry very much.

  20. AA, Inner Conductor of Magnetic Horn

    CERN Multimedia

    CERN PhotoLab

    1979-01-01

    Antiprotons emerging at large angles from the production target (hit by an intense 26 GeV proton beam from the PS), were focused into the acceptance of the injection line of the AA by means of a "magnetic horn" (current-sheet lens). Here we see an early protype of the horn's inner conductor, machined from solid aluminium to a thickness of less than 1 mm. The 1st version had to withstand pulses of 150 kA, 15 us long, every 2.4 s. See 8801040 for a later version.

  1. Flux pinning characteristics of YBCO coated conductor

    International Nuclear Information System (INIS)

    Matsushita, T.; Watanabe, T.; Fukumoto, Y.; Yamauchi, K.; Kiuchi, M.; Otabe, E.S.; Kiss, T.; Watanabe, T.; Miyata, S.; Ibi, A.; Muroga, T.; Yamada, Y.; Shiohara, Y.

    2005-01-01

    Flux pinning properties of PLD-processed YBCO coated conductors deposited on IBAD substrate are investigated. The thickness of YBCO layer is changed in the range of 0.27-1.0 μm. The thickness dependence of critical current density, n-value and irreversibility field are measured in a wide range of magnetic field. The results are compared with the theoretical flux creep-flow model. It is found that these pinning properties are strongly influenced by the thickness as well as the pinning strength. Optimum condition for high field application of this superconductor is discussed

  2. Relative stiffness of flat conductor cables

    Science.gov (United States)

    Hankins, J. D.

    1976-01-01

    The measurement of the bending moment required to obtain a given deflection in short lengths of flat conductor cable (FCC) is presented in this report. Experimental data were taken on 10 different samples of FCC and normalized to express all bending moments (relative stiffness factor) in terms of a cable 5.1 cm (2.0 in.) in width. Data are presented in tabular and graphical form for the covenience of designers who may be interested in finding torques exerted on critical components by short lengths of FCC.

  3. Tension-filled Governance?

    DEFF Research Database (Denmark)

    Celik, Tim Holst

    on the statesituated tension-filled functional relationship between legitimation and accumulation, the study both historically and theoretically reworks this approach and reapplies it for the post-1970s/1990s governance period. It asks whether and to what extent governance has served as a distinctive post- 1970s/1990s...

  4. filled neutron detectors

    Indian Academy of Sciences (India)

    Boron trifluoride (BF3) proportional counters are used as detectors for thermal neutrons. They are characterized by high neutron sensitivity and good gamma discriminating properties. Most practical BF3 counters are filled with pure boron trifluoride gas enriched up to 96% 10B. But BF3 is not an ideal proportional counter ...

  5. Gas filled detectors

    International Nuclear Information System (INIS)

    Stephan, C.

    1993-01-01

    The main types of gas filled nuclear detectors: ionization chambers, proportional counters, parallel-plate avalanche counters (PPAC) and microstrip detectors are described. New devices are shown. A description of the processes involved in such detectors is also given. (K.A.) 123 refs.; 25 figs.; 3 tabs

  6. Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu

    Science.gov (United States)

    Lee, Hwa-Teng; Huang, Kuo-Chen

    2016-12-01

    Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

  7. Assessment of conductor degradation in the ITER CS insert coil and implications for the ITER conductors

    Science.gov (United States)

    Mitchell, N.

    2007-01-01

    Nb3Sn cable in conduit-type conductors were expected to provide an efficient way of achieving large conductor currents at high field (up to 13 T) combined with good stability to electromagnetic disturbances due to the extensive helium contact area with the strands. Although ITER model coils successfully reached their design performance (Kato et al 2001 Fusion Eng. Des. 56/57 59-70), initial indications (Mitchell 2003 Fusion Eng. Des. 66-68 971-94) that there were unexplained performance shortfalls have been confirmed. Recent conductor tests (Pasztor et al 2004 IEEE Trans. Appl. Supercond. 14 1527-30) and modelling work (Mitchell 2005 Supercond. Sci. Technol. 18 396-404) suggest that the shortfalls are due to a combination of strand bending and filament fracture under the transverse magnetic loads. Using the new model, the extensive database from the ITER CS insert coil has been reassessed. A parametric fit based on a loss of filament area and n (the exponent of the power-law fit to the electric field) combined with a more rigorous consideration of the conductor field gradient has enabled the coil behaviour to be explained much more consistently than in earlier assessments, now fitting the Nb3Sn strain scaling laws when used with measurements of the conductor operating strain, including conditions when the insert coil current (and hence operating strain) were reversed. The coil superconducting performance also shows a fatigue-type behaviour consistent with recent measurements on conductor samples (Martovetsky et al 2005 IEEE Trans. Appl. Supercond. 15 1367-70). The ITER conductor design has already been modified compared to the CS insert, to increase the margin and provide increased resistance to the degradation, by using a steel jacket to provide thermal pre-compression to reduce tensile strain levels, reducing the void fraction from 36% to 33% and increasing the non-copper material by 25%. Test results are not yet available for the new design and performance

  8. A review on solder reflow and flux application for flip chip

    Science.gov (United States)

    Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Visvanathan, Susthitha Menon; Retnasamy, Vithyacharan

    2017-09-01

    This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

  9. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    Science.gov (United States)

    Rolin, T. D.; Hodge, R. E.

    2008-01-01

    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  10. Laser welding of vas deferens in rodents: initial experience with fluid solders.

    Science.gov (United States)

    Trickett, R I; Wang, D; Maitz, P; Lanzetta, M; Owen, E R

    1998-01-01

    This study evaluates the use of sutureless laser welding for vasovasostomy. In 14 rodents, the left vas deferens underwent vasovasostomy using an albumin-based solder applied to the adventitia of the vas deferens. The solder contained the dye, indocyanine green, to allow selective absorption and denaturation by a fiber-coupled 800-nm diode laser. The right vas deferens served as a control, receiving conventional layered microsurgical repair. We used a removable 4/0 nylon stent and microclamps to appose the vas deferens during repair, with no need for stay sutures. The mean time to perform laser solder repair (23.5 min) and conventional repair (23.3 min) were not significantly different (P=0.91). However, examination after 8 weeks showed that granuloma formation (G) and patency (P) rates for the conventional suture technique (G, 14%; P, 93%) were significantly better than observed for the laser solder technique (G, 57%; P, 50%).

  11. Effects of rework on adhesion of Pb-In soldered gold thick films

    International Nuclear Information System (INIS)

    Gehman, R.W.; Becka, G.A.; Losure, J.A.

    1982-02-01

    The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au 9 In 4 . It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing

  12. Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E...... in a carbon matrix. Nanoscale soldering of multi-walled carbon nanotubes (MWNT) onto microelectrodes was achieved by deposition of a conducting gold line across a contact point between nanotube and electrode. The solderings were found to be mechanically stronger than the carbon nanotubes. We have positioned...... MWNTs to bridge the gap between two electrodes, and formed soldering bonds between the tube and each of the electrodes. All nanotube bridges showed ohmic resistances in the range 10-30 kΩ. We observed no increase in resistance after exposing the MWNT bridge to air for days....

  13. Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

    Science.gov (United States)

    Hasnine, M.; Tolla, B.; Vahora, N.

    2018-04-01

    This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

  14. The creep behavior of In-Ag eutectic solder joints

    International Nuclear Information System (INIS)

    Reynolds, H.L.; Kang, S.H.; Morris, J.W. Jr.; Univ. of California, Berkeley, CA

    1999-01-01

    The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90 C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the In-rich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems

  15. Nanoconstruction by welding individual metallic nanowires together using nanoscale solder

    International Nuclear Information System (INIS)

    Peng, Y; Inkson, B J; Cullis, A G

    2010-01-01

    This work presents a new bottom-up nanowelding technique enabling building blocks to be assembled and welded together into complex 3D nanostructures using nanovolumes of metal solder. The building blocks of gold nanowires, (Co 72 Pt 28 /Pt) n multilayer nanowires, and nanosolder Sn 99 Au 1 alloy nanowires were successfully fabricated by a template technique. Individual metallic nanowires were picked up and assembled together. Conductive nanocircuits were then welded together using similar or dissimilar nanosolder material. At the weld sites, nanoscale volumes of a chosen metal are deposited using nanosolder of a sacrificial nanowire, which ensures that the nanoobjects to be bonded retain their structural integrity. The whole nanowelding process is clean, controllable and reliable, and ensures both mechanically strong and electrically conductive contacts.

  16. Soldered Contact and Current Risetime Effects on Negative Polarity Wire Array Z-pinches

    International Nuclear Information System (INIS)

    Chalenski, D. A.; Kusse, B. R.; Greenly, J. B.; Blesener, I. C.; McBride, R. D.; Hammer, D. A.; Knapp, P. F.

    2009-01-01

    The Cornell University COBRA pulser is a nominal 1 MA machine, capable of driving up to 32 wire cylindrical Z-pinch arrays. COBRA can operate with variable current risetimes ranging from 100 ns to 200 ns (short and long pulse, respectively). Wires are typically strung with a ''press'' contact to the electrode hardware, where the wire is loosely pulled against the hardware and held there to establish electrical contact. The machine is normally negative, but a bolt-on convolute can be used to modify the current path and effectively produce positive polarity operation at the load.Previous research with single wires on a 1-5 kA pulser has shown that soldering the wire, thereby improving the wire/electrode contact, and operating in positive polarity can improve the energy deposition into the wire and enhance wire core expansion. Negative polarity showed no difference. Previous experiments on the negative polarity, 20 MA, 100 ns Z accelerator have shown that improving the contact improved the x-ray yield.Cornell data were collected on 16-wire Aluminum Z-pinch arrays in negative polarity. Experiments were conducted with both short and long current pulses with soldered and no-soldered wire/electrode contacts. The initiation, ablation, implosion and stagnation phases were compared for these four conditions. Time dependent x-ray signals were measured using diodes and diamond detectors. An inductive voltage monitor was used to infer minimum current radius achieved, as defined by a uniform shell of current moving radially inward, producing a time dependent inductance. Total energy data were collected with a metal-strip bolometer. Self-emission data were collected by an XUV 4-frame camera and an optical streak camera.In negative polarity and with short pulses, soldering appeared to produce a smaller radius pinch and decrease variations in the x-ray pulse shape. The bolometer, laser backlighter, 4-frame and streak cameras showed negligible differences in the initiation ablation

  17. PREFACE: International Symposium on Molecular Conductors: Novel Functions of Molecular Conductors under Extreme Conditions (ISMC 2008)

    Science.gov (United States)

    Takahashi, Toshihiro; Suzumura, Yoshikazu

    2008-02-01

    The International Symposium on Molecular Conductors 2008 (ISMC2008) was held as the second international symposium of the project entitled `Novel Functions of Molecular Conductors under Extreme Conditions', which was supported by the Grant-in-aid for Scientific Research on Priority Areas from the Ministry of Education, Culture, Sports, Science and Technology in Japan. The project lasted from September 2003 to March 2008, and was completed by this symposium held at Okazaki Conference Center, Institute for Molecular Science, Okazaki, Japan (23-25 July 2008), which about 100 scientists attended. During the symposium, five project teams gave summary talks and exciting talks were given on the topics developed recently not only by the members of the project but also by other scientists including invited speakers from abroad, who are doing active research on molecular conductors. It is expected that papers presented in the symposium will give valuable hints for the next step in the research of this field. Therefore the organizers of this symposium decided to publish this proceedings in order to demonstrate these activities, not only for the local community of the project, but also for the broad society of international scientists who are interested in molecular conductors. The editors, who are also the organizers of this symposium, believe that this proceedings provides a significant and relevant contribution to the field of molecular conductors since it is the first time we have published such a proceedings as an electronic journal. We note that all papers published in this volume of Journal of Physics: Conference Series have been peer reviewed by expert referees. Editors made every effort to satisfy the criterion of a proceedings journal published by IOP Publishing. Toshihiro Takahashi and Yoshikazu Suzumura Editors: Toshihiro Takahashi (Gakushuin University) (Chairman) Kazushi Kanoda (University of Tokyo) Seiichi Kagoshima (University of Tokyo) Takehiko Mori (Tokyo

  18. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Directory of Open Access Journals (Sweden)

    Benabou Lahouari

    2014-06-01

    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  19. Investigation into mechanical properties of joints of heterogeneous materials brazed with high-temperature solders

    International Nuclear Information System (INIS)

    Lomenko, V.I.; Merkushev, V.P.; Borodina, L.M.; Sycheva, T.S.; Tokhtina, O.A.; Frolov, N.N.

    1988-01-01

    Mechanical properties of copper joints with copper, 12Kh18M10T steel and KhD50 composite obtained by vacuum brazing by copper-titanium solder as compared with properties of joints brazed by PSr 72 and PMFOTsr 6-4-0.03 solders in hydrogen are studied. Dependences of joints strength on temperature of contact - reactive vacuum brazing are obtained. Possible applications of joints of dissimilar materials in electrovacuum devices subjected to the effect of dynamic loadings are established

  20. Dye-enhanced protein solders and patches in laser-assisted tissue welding.

    Science.gov (United States)

    Small, W; Heredia, N J; Maitland, D J; Da Silva, L B; Matthews, D L

    1997-01-01

    This study examines the use of dye-enhanced protein bonding agents in 805 nm diode laser-assisted tissue welding. A comparison of an albumin liquid solder and collagen solid-matrix patches used to repair arteriotomies in an in vitro porcine model is presented. Extrinsic bonding media in the form of solders and patches have been used to enhance the practice of laser tissue welding. Preferential absorption of the laser wavelength has been achieved by the incorporation of chromophores. Both the solder and the patch included indocyanine green dye (ICG) to absorb the 805 nm continuous-wave diode laser light used to perform the welds. Solder-mediated welds were divided into two groups (high power/short exposure and low power/long exposure), and the patches were divided into three thickness groups ranging from 0.1 to 1.3 mm. The power used to activate the patches was constant, but the exposure time was increased with patch thickness. Burst pressure results indicated that solder-mediated and patched welds yielded similar average burst strengths in most cases, but the patches provided a higher success rate (i.e., more often exceeded 150 mmHg) and were more consistent (i.e., smaller standard deviation) than the solder. The strongest welds were obtained using 1.0-1.3 mm thick patches, while the high power/short exposure solder group was the weakest. Though the solder and patches yielded similar acute weld strengths, the solid-matrix patches facilitated the welding process and provided consistently strong welds. The material properties of the extrinsic agents influenced their performance.

  1. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others

    1995-06-01

    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  2. Effect of gamma radiation on micromechanical hardness of lead-free solder joint

    Energy Technology Data Exchange (ETDEWEB)

    Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

    2015-09-25

    Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

  3. Characterization of the microstructure of tin-silver lead free solder

    Energy Technology Data Exchange (ETDEWEB)

    Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

    2016-07-05

    Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

  4. A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

    Science.gov (United States)

    Wei, Helin; Wang, Kuisheng

    2011-11-01

    Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

  5. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    Directory of Open Access Journals (Sweden)

    Enrico Mick

    2015-07-01

    Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

  6. Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

    International Nuclear Information System (INIS)

    Mallik, S.; Ekere, N.N.; Durairaj, R.; Marks, A.E.; Seman, A.

    2009-01-01

    Solder paste is the most important strategic bonding material used in the assembly of surface mount components in electronics manufacturing. As the trend towards miniaturisation of electronic products continues, there is an increasing demand for better understanding of the flow and deformation that is, the rheological behaviour of solder paste formulations. Wall slip plays an important role in characterising the flow behaviour of solder paste materials. The problem of wall slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. In rheological measurements, slip effects can generally be avoided by using roughened surfaces for measuring geometries. In this paper, a novel technique is developed to study the effect of wall slip in the rheological measurements of lead-free solder paste. The viscosity and oscillatory data obtained for three different solder paste samples (from measuring geometries of different surface roughness) have been analysed and compared. In viscosity measurements, slip effects were dominant at low shear rates and the use of serrated surfaces was found to be quite effective in minimizing slip effects. Oscillatory measurements were also affected by roughening the surfaces of measuring geometries.

  7. The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

    Science.gov (United States)

    Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

    2015-12-01

    Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (ptensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

  8. Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

    International Nuclear Information System (INIS)

    Durairaj, R.; Ramesh, S.; Mallik, S.; Seman, A.; Ekere, N.

    2009-01-01

    Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G') is higher than the liquid characteristic (G'') for the pastes material. In addition, the results from the study showed that the solder paste with a large G' = G'' has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (δ) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.

  9. Study on interfacial reaction between lead-free solders and alternative surface finishes

    International Nuclear Information System (INIS)

    Siti Rabiatul Aisha; Ourdjini, A.; Saliza Osman

    2007-01-01

    This study investigates the interfacial reactions occurring during reflow soldering between Sn-Ag-Cu lead-free solder and two surface finishes: electroless nickel/ immersion gold (ENIG) and immersion silver (IAg). The study focuses on interfacial reactions evolution and growth kinetics of intermetallic compounds (IMC) formed during soldering and isothermal ageing at 150 degree Celsius for up to 2000 hours. Optical and scanning electron microscopy were used to measure IMC thickness and examine the morphology of IMC respectively, whereas the IMC phases were identified by energy dispersive X-ray analysis (EDX). The results showed that the IMC formed on ENIG finish is thinner compared to that formed on IAg finish. For IAg surface finish, Cu 6 Sn 5 IMCs with scallop morphology are formed at the solder/ surface finish interface after reflow while a second IMC, Cu 3 Sn was formed between the copper and Cu 6 Sn 5 IMC after the isothermal ageing treatment. For ENIG surface finish both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 are formed after soldering. Isothermal aging of the solder joints formed on ENIG finish was found to have a significant effect on the morphology of the intermetallics by transforming to more spherical and denser morphology in addition to increase i their thickness with increased ageing time. (author)

  10. Comparative shear tests of some low temperature lead-free solder pastes

    Science.gov (United States)

    Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

    2016-12-01

    The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

  11. Investigation on solder joint strength of nickel tin-plated and CRS tabs with PCB

    International Nuclear Information System (INIS)

    Luay Hussain

    2002-01-01

    Failure analysis on easily peels off Nickel and CRS steel tabs from PCB was carried out. Nickel Tin plated tabs, CRS steel tabs and tube were joined to the PCB using reflow/ convection soldering, in an oven. The solder paste composition is Sn36/Pb35/Ag2. Peel test was conducted and it was found that many tabs could be easily peeled off with low force. Porosities which varies from 0.4 mm to < 0.01mm in diameter, developed during soldering process and solidification was noted. It was found, the number, size and position of these porosities inside the solder layer on both parts of the tabs affect the peel strength. Scanning Electron Microscopy study and EDX analysis were carried out. It was found that the low peel strength values were due to the combination of generation and development of porosities during soldering process which act as stress concentrators and the evolution (growth) of eutectic Sn/Pb and Sn/Ni/Cu brittle grainy phase. Large eutectic microstructure with brittle Sn-Ni-Cu grainy phase enhances the failure with low peeling forces. Sample showing no feature of Sn/Ni/Cu grain gave high peeling strength value. Solder reflow, an important process, can result in strength enhancement (if it was controlled for example in a furnace). (Author)

  12. VAMAS Nb3Sn test conductor

    International Nuclear Information System (INIS)

    Anon.

    1994-01-01

    A bronze-process Nb 3 Sn conductor was measured as part of the second VAMAS (Versailles Project on Advanced Materials and Standards) international critical-current round robin. The conductor specifications are given in Table 15. The critical current was measured as a function of magnetic field and axial tensile strain. The measured data are presented in Table 16 and in Figs. 23 and 24. The I c and J c values are based on an electric field criterion (E c ) of 1 μV/cm. In the first VAMAS round robin tests, differences in the test specimens' axial strain, caused by variations in the thermal contraction of different test fixtures, was a major source of interlaboratory variation in the critical-current data. Consequently, electromechanical characterization of the test specimen is important for data interpretation and error analysis. In the second round robin, the test apparatus and procedure were more rigidly specified. This increased experimental control reduced the critical-current variation by a factor of 3.5. The results of our measurements will be published in the final VAMAS report

  13. Maximum permissible voltage of YBCO coated conductors

    Energy Technology Data Exchange (ETDEWEB)

    Wen, J.; Lin, B.; Sheng, J.; Xu, J.; Jin, Z. [Department of Electrical Engineering, Shanghai Jiao Tong University, Shanghai (China); Hong, Z., E-mail: zhiyong.hong@sjtu.edu.cn [Department of Electrical Engineering, Shanghai Jiao Tong University, Shanghai (China); Wang, D.; Zhou, H.; Shen, X.; Shen, C. [Qingpu Power Supply Company, State Grid Shanghai Municipal Electric Power Company, Shanghai (China)

    2014-06-15

    Highlights: • We examine three kinds of tapes’ maximum permissible voltage. • We examine the relationship between quenching duration and maximum permissible voltage. • Continuous I{sub c} degradations under repetitive quenching where tapes reaching maximum permissible voltage. • The relationship between maximum permissible voltage and resistance, temperature. - Abstract: Superconducting fault current limiter (SFCL) could reduce short circuit currents in electrical power system. One of the most important thing in developing SFCL is to find out the maximum permissible voltage of each limiting element. The maximum permissible voltage is defined as the maximum voltage per unit length at which the YBCO coated conductors (CC) do not suffer from critical current (I{sub c}) degradation or burnout. In this research, the time of quenching process is changed and voltage is raised until the I{sub c} degradation or burnout happens. YBCO coated conductors test in the experiment are from American superconductor (AMSC) and Shanghai Jiao Tong University (SJTU). Along with the quenching duration increasing, the maximum permissible voltage of CC decreases. When quenching duration is 100 ms, the maximum permissible of SJTU CC, 12 mm AMSC CC and 4 mm AMSC CC are 0.72 V/cm, 0.52 V/cm and 1.2 V/cm respectively. Based on the results of samples, the whole length of CCs used in the design of a SFCL can be determined.

  14. Conductor gestures influence evaluations of ensemble performance.

    Science.gov (United States)

    Morrison, Steven J; Price, Harry E; Smedley, Eric M; Meals, Cory D

    2014-01-01

    Previous research has found that listener evaluations of ensemble performances vary depending on the expressivity of the conductor's gestures, even when performances are otherwise identical. It was the purpose of the present study to test whether this effect of visual information was evident in the evaluation of specific aspects of ensemble performance: articulation and dynamics. We constructed a set of 32 music performances that combined auditory and visual information and were designed to feature a high degree of contrast along one of two target characteristics: articulation and dynamics. We paired each of four music excerpts recorded by a chamber ensemble in both a high- and low-contrast condition with video of four conductors demonstrating high- and low-contrast gesture specifically appropriate to either articulation or dynamics. Using one of two equivalent test forms, college music majors and non-majors (N = 285) viewed sixteen 30 s performances and evaluated the quality of the ensemble's articulation, dynamics, technique, and tempo along with overall expressivity. Results showed significantly higher evaluations for performances featuring high rather than low conducting expressivity regardless of the ensemble's performance quality. Evaluations for both articulation and dynamics were strongly and positively correlated with evaluations of overall ensemble expressivity.

  15. Systolic ventricular filling.

    Science.gov (United States)

    Torrent-Guasp, Francisco; Kocica, Mladen J; Corno, Antonio; Komeda, Masashi; Cox, James; Flotats, A; Ballester-Rodes, Manel; Carreras-Costa, Francesc

    2004-03-01

    The evidence of the ventricular myocardial band (VMB) has revealed unavoidable coherence and mutual coupling of form and function in the ventricular myocardium, making it possible to understand the principles governing electrical, mechanical and energetical events within the human heart. From the earliest Erasistratus' observations, principal mechanisms responsible for the ventricular filling have still remained obscured. Contemporary experimental and clinical investigations unequivocally support the attitude that only powerful suction force, developed by the normal ventricles, would be able to produce an efficient filling of the ventricular cavities. The true origin and the precise time frame for generating such force are still controversial. Elastic recoil and muscular contraction were the most commonly mentioned, but yet, still not clearly explained mechanisms involved in the ventricular suction. Classical concepts about timing of successive mechanical events during the cardiac cycle, also do not offer understandable insight into the mechanism of the ventricular filling. The net result is the current state of insufficient knowledge of systolic and particularly diastolic function of normal and diseased heart. Here we summarize experimental evidence and theoretical backgrounds, which could be useful in understanding the phenomenon of the ventricular filling. Anatomy of the VMB, and recent proofs for its segmental electrical and mechanical activation, undoubtedly indicates that ventricular filling is the consequence of an active muscular contraction. Contraction of the ascendent segment of the VMB, with simultaneous shortening and rectifying of its fibers, produces the paradoxical increase of the ventricular volume and lengthening of its long axis. Specific spatial arrangement of the ascendent segment fibers, their interaction with adjacent descendent segment fibers, elastic elements and intra-cavitary blood volume (hemoskeleton), explain the physical principles

  16. Testing of the 3M Company ACCR Conductor

    Energy Technology Data Exchange (ETDEWEB)

    Stovall, J.P.; RIzy, D.T.; Kisner, R.A.; Deve, H.E. (3M Comp.)

    2010-09-15

    The 3M Company has developed a high-temperature low-sag conductor referred to as Aluminum- Conductor Composite-Reinforced or ACCR. The conductor uses an aluminum metal matrix material to replace the steel in conventional conductors so the core has a lower density and higher conductivity. The objective of this work is to accelerate the commercial acceptance by electric utilities of these new conductor designs by testing four representative conductor classes in controlled conditions. Overhead transmission lines use bare aluminum conductor strands wrapped around a steel core strands to transmit electricity. The typical cable is referred to as aluminum-conductor steel-reinforced (ACSR). The outer strands are aluminum, chosen for its conductivity, low weight, and low cost. The center strand is of steel for the strength required to support the weight without stretching the aluminum due to its ductility. The power density of a transmission corridor has been directly increased by increasing the voltage level. Transmission voltages have increased from 115-kV to 765- kV over the past 80 years. In the United States, further increasing the voltage level is not feasible at this point in time, so in order to further increase the power density of a transmission corridor, conductor designs that increase the current carrying capability have been examined. One of the key limiting factors in the design of a transmission line is the conductor sag which determines the clearance of the conductor above ground or underlying structures needed for electrical safety. Increasing the current carrying capability of a conductor increases the joule heating in the conductor which increases the conductor sag. A conductor designed for high-temperature and lowsag operation requires an engineered modification of the conductor materials. To make an advanced cable, the 3M Company solution has been the development of a composite conductor consisting of Nextel ceramic fibers to replace the steel core and

  17. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Lei Sun

    2015-01-01

    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  18. Beyond the Beat: Modelling Intentions in a Virtual Conductor

    NARCIS (Netherlands)

    ter Maat, Mark; Ebbers, Rob M.; Reidsma, Dennis; Nijholt, Antinus

    We describe our research on designing and implementing a Virtual Conductor. That is, a virtual human (embodied agent) that acts like a human conductor in its interaction with a real, human orchestra. We reported previously on a first version that used a digital musical score to lead an orchestra.

  19. Elastically stretchable thin film conductors on an elastomeric substrate

    Science.gov (United States)

    Jones Harris, Joyelle Elizabeth

    Imagine a large, flat screen television that can be rolled into a small cylinder after purchase in the store and then unrolled and mounted onto the wall of a home. The electronic devices within the television must be able to withstand large deformation and tensile strain. Consider a robot that is covered with an electronic skin that simulates human skin. The skin would enable the machine to lift an elderly person with care and sensitivity. The skin will endure repeated deformation with the highest tensile strains being experienced at the robot's joints. These applications and many others will benefit from stretchable electronic circuitry. While several different methods have been employed to create stretchable electronics, all methods use a common tool -- stretchable conductors. Therefore, the goal of this thesis work was to fabricate elastically stretchable conductors that can be used in stretchable electronics. We deposited Au thin films on an elastomeric substrate, and the resulting conductors remained electrically continuous when stretched by 30% and more. We developed photolithographic processes that can be used to pattern elastically stretchable conductors with a 10 mum resolution. We fabricated bi-level stretchable conductors that are separated by an elastomeric insulator and are electrically connected through via holes in the insulator. We applied our bi-level conductors to create a stretchable resistor-inductor-capacitor (RLC) circuit with a tunable resonant frequency. We also used stretchable conductors to measure action potentials in biological samples. This thesis describes the fabrication and application of our elastically stretchable conductors.

  20. 21 CFR 868.1920 - Esophageal stethoscope with electrical conductors.

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Esophageal stethoscope with electrical conductors. 868.1920 Section 868.1920 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH AND HUMAN... stethoscope with electrical conductors. (a) Identification. An esophageal stethoscope with electrical...

  1. The Identification of Conductor-Distinguished Functions of Conducting

    Science.gov (United States)

    Gumm, Alan J.; Battersby, Sharyn L.; Simon, Kathryn L.; Shankles, Andrew E.

    2011-01-01

    The purpose of the present study was to identify whether conductors distinguish functions of conducting similarly to functions implied in previous research. A sample of 84 conductors with a full range of experience levels (M = 9.8) and of a full range of large ensemble types and ensemble age levels rated how much they pay attention to 82…

  2. Overcurrent experiments on HTS tape and cable conductor

    DEFF Research Database (Denmark)

    Tønnesen, Ole; Jensen, Kim Høj; Træholt, Chresten

    2001-01-01

    their critical current. In this light, it is important to investigate the response of HTS tapes and cable conductors to overcurrents several times the critical current. A number of experiments have been performed on HTS tapes and cable conductors, with currents up to 20 times the critical current. During...... overcurrent experiments, the voltage, and the temperature were measured as functions of time in order to investigate the dynamic behavior of the HTS tape and cable conductor. After each experiment, damage to the superconductors was assessed by measuring the critical current. Preliminary results show...... that within seconds an HTS tape (critical current=17 A) heats above room temperature with an overcurrent larger than 140 A. Similar overcurrent experiments showed that a HTS cable conductor could sustain damage with overcurrents exceeding 10 times the critical current of the cable conductor....

  3. An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation

    Science.gov (United States)

    Chawla, N.; Shen, Y.-L.; Deng, X.; Ege, E. S.

    2004-12-01

    The lap-shear technique is commonly used to evaluate the shear, creep, and thermal fatigue behavior of solder joints. We have conducted a parametric experimental and modeling study, on the effect of testing and geometrical parameters on solder/copper joint response in lap-shear. It was shown that the farfield applied strain is quite different from the actual solder strain (measured optically). Subtraction of the deformation of the Cu substrate provides a reasonable approximation of the solder strain in the elastic regime, but not in the plastic regime. Solder joint thickness has a profound effect on joint response. The solder response moves progressively closer to “true” shear response with increasing joint thickness. Numerical modeling using finite-element analyses were performed to rationalize the experimental findings. The same lap-shear configuration was used in the simulation. The input response for solder was based on the experimental tensile test result on bulk specimens. The calculated shear response, using both the commonly adopted far-field measure and the actual shear strain in solder, was found to be consistent with the trends observed in the lap-shear experiments. The geometric features were further explored to provide physical insight into the problem. Deformation of the substrate was found to greatly influence the shear behavior of the solder.

  4. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    OpenAIRE

    Sun, Lei; Zhang, Liang

    2015-01-01

    SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparti...

  5. Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy

    Science.gov (United States)

    Tikale, Sanjay; Prabhu, K. Narayan

    2018-05-01

    The effect of Al2O3 nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al2O3 nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (T L) and melting temperature range of the SAC305 solder alloy by addition of Al2O3 nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al2O3 nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu6Sn5 IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy.

  6. Irreversible properties of YBCO coated conductors

    International Nuclear Information System (INIS)

    Vostner, A.

    2001-02-01

    Over the past few years substantial efforts were made to optimize the fabrication techniques of various high temperature superconductors for commercial applications. In addition to Bi-2223 tapes, Y-123 coated conductors have the potential for large-scale production and are considered as the second generation of superconducting 'wires' for high current applications. This work reports on magnetic and transport current investigations of Y-123 thick films deposited on either single crystalline substrates by liquid phase epitaxy (LPE) or on metallic substrates by pulsed laser deposition (PLD). At the beginning, a short introduction of the general idea of a coated conductor and of the different production techniques is presented, followed by a description of the different experimental set-ups and the evaluation methods. The main part starts with the results obtained from SQUID magnetometry and ac-susceptibility measurements including the transition temperatures T c , the field dependence of the magnetic critical current densities and the irreversibility lines. In addition, some issues concerning the granular structure and the inter- and intragranular current distribution of the superconducting films are discussed. The investigations by transport currents are focused on the behavior of the application relevant irreversible parameters. These are the angular and the field dependence of the critical transport current densities at 77 and 60 K, as well as the temperature dependence of the irreversibility fields up to 6 T. To gain more insight into the defect structure of the films, neutron irradiation studies were performed on some samples. The introduction of these artificial pinning centers causes large enhancements of the magnetic J c in LPE specimens for the field parallel to the c-axis (H//c) at higher temperatures and magnetic fields. The granular structure of the samples does not change up to the highest neutron fluences. However, the enhancements of the transport J c

  7. Synthesis of POSS-based ionic conductors with low glass transition temperatures for efficient solid-state dye-sensitized solar cells.

    Science.gov (United States)

    Zhang, Wei; Wang, Zhong-Sheng

    2014-07-09

    Replacing liquid-state electrolytes with solid-state electrolytes has been proven to be an effective way to improve the durability of dye-sensitized solar cells (DSSCs). We report herein the synthesis of amorphous ionic conductors based on polyhedral oligomeric silsesquioxane (POSS) with low glass transition temperatures for solid-state DSSCs. As the ionic conductor is amorphous and in the elastomeric state at the operating temperature of DSSCs, good pore filling in the TiO2 film and good interfacial contact between the solid-state electrolyte and the TiO2 film can be guaranteed. When the POSS-based ionic conductor containing an allyl group is doped with only iodine as the solid-state electrolyte without any other additives, power conversion efficiency of 6.29% has been achieved with good long-term stability under one-sun soaking for 1000 h.

  8. Local structure of gallate proton conductors

    Energy Technology Data Exchange (ETDEWEB)

    Giannici, F; Messana, D; Martorana, A [Universita degli Studi di Palermo, Dipartimento di Chimica Inorganica ed Analitica, Viale delle Scienze, I-90128 Palermo (Italy); Longo, A [CNR, Istituto per lo studio dei materiali nanostrutturati, Via Ugo La Malfa 153, I-90146 Palermo (Italy); Sciortino, L, E-mail: sciortino@pa.ismn.cnr.i

    2009-11-15

    Lanthanum barium gallate proton conductors are based on disconnected GaO{sub 4} groups. The insertion of hydroxyls in the LaBaGaO{sub 4} network proceeds through self-doping with Ba{sup 2+}, consequent O{sup 2-} vacancy formation to fulfill charge neutrality. With a structural investigation on self-doped LaBaGaO{sub 4} oxides using synchrotron XRD and EXAFS on the Ga K-edge, we find that: (a) the GaO{sub 4} tetrahedra retain their size throughout the whole series; (b) the GaO{sub 4} tetrahedra rotate as rigid bodies on hydration, leading to the formation of a network of shorter O-O configurations that are stabilized by hydrogen bonds; (c) contraction of the lattice occurs along the a unit cell axis, as a consequence of an overall structural rearrangement of the hydrated solid.

  9. Local structure of gallate proton conductors

    International Nuclear Information System (INIS)

    Giannici, F; Messana, D; Martorana, A; Longo, A; Sciortino, L

    2009-01-01

    Lanthanum barium gallate proton conductors are based on disconnected GaO 4 groups. The insertion of hydroxyls in the LaBaGaO 4 network proceeds through self-doping with Ba 2+ , consequent O 2- vacancy formation to fulfill charge neutrality. With a structural investigation on self-doped LaBaGaO 4 oxides using synchrotron XRD and EXAFS on the Ga K-edge, we find that: (a) the GaO 4 tetrahedra retain their size throughout the whole series; (b) the GaO 4 tetrahedra rotate as rigid bodies on hydration, leading to the formation of a network of shorter O-O configurations that are stabilized by hydrogen bonds; (c) contraction of the lattice occurs along the a unit cell axis, as a consequence of an overall structural rearrangement of the hydrated solid.

  10. Local structure of gallate proton conductors

    Science.gov (United States)

    Giannici, F.; Messana, D.; Longo, A.; Sciortino, L.; Martorana, A.

    2009-11-01

    Lanthanum barium gallate proton conductors are based on disconnected GaO4 groups. The insertion of hydroxyls in the LaBaGaO4 network proceeds through self-doping with Ba2+, consequent O2- vacancy formation to fulfill charge neutrality. With a structural investigation on self-doped LaBaGaO4 oxides using synchrotron XRD and EXAFS on the Ga K-edge, we find that: (a) the GaO4 tetrahedra retain their size throughout the whole series; (b) the GaO4 tetrahedra rotate as rigid bodies on hydration, leading to the formation of a network of shorter O-O configurations that are stabilized by hydrogen bonds; (c) contraction of the lattice occurs along the a unit cell axis, as a consequence of an overall structural rearrangement of the hydrated solid.

  11. [Trophoblast: conductor of the maternal immune tolerance].

    Science.gov (United States)

    Mesdag, V; Salzet, M; Vinatier, D

    2014-11-01

    Pregnancy is a temporary semi-allograft that survives for nine months. The importance of this event for the survival of the species justifies several tolerance mechanisms that are put into place at the beginning of pregnancy, some of which occur even at the time of implantation. The description of these mechanisms underlines the leadership of the trophoblast. The trophoblast is the conductor of the events, protects himself by expressing specific antigens and regulates the environment of the decidua according to the calendar of the events of the pregnancy The trophoblast and the decidual environment attract the effectors of immunity, almost all present in the decidua. The immunological atmosphere of the decidua evolves during the pregnancy modulating the level of activation of the immunological cells and adapting the level of activation to the stage of the pregnancy. Copyright © 2014 Elsevier Masson SAS. All rights reserved.

  12. ELECTRODYNAMIC STABILITY COMPUTATIONS FOR FLEXIBLE CONDUCTORS OF THE AERIAL LINES

    Directory of Open Access Journals (Sweden)

    I. I. Sergey

    2015-01-01

    Full Text Available In aerial transmission lines aluminium multiwire conductors are in use. Owing to their flexible design the electrodynamic effect of short circuit currents may lead to intolerable mutual rendezvous and even cross-whipping of the phase conductors. The increasing motion of the conductors caused by effect of the short-circuit electrodynamic force impulse is accompanied by the dynamic load impact affecting the conductors, insulating and supporting constructions of the aerial lines. Intensity of the short-circuit currents electrodynamic impact on the flexible conductors depends on the short circuit current magnitude. For research into electrodynamic endurance of the conductors of the aerial lines located at the vertices of arbitrary triangle with spans of a large length, the authors assume the conductor analytical model in the form of a flexible tensile thread whose mass is distributed evenly lengthwise the conductor. With this analytical model, by the action of the imposed forces the conductor assumes the form conditioned by the diagram of applied external forces, and resists neither bending nor torsion. The initial conditions calculation task reduces to solving the flexible thread statics equations. The law of motion of the conductor marginal points comes out of the conjoint solution of dynamic equations of the conductor and structural components of the areal electric power lines. Based on the proposed algorithm, the researchers of the Chair of the Electric Power Stations of BNTU developed a software program LINEDYS+, which in its characteristics yields to no foreign analogs, e. g. SAMSEF. To calculate the initial conditions they modified a software program computing the flexible conductor mechanics named MR 21. The conductor short-circuit electrodynamic interaction estimation considers structural elements of the areal lines, ice and wind loads, objective parameters of the short circuit. The software programs are accommodated with the simple and

  13. Dye filled security seal

    International Nuclear Information System (INIS)

    Wilson, D.C.

    1982-01-01

    A security seal for providing an indication of unauthorized access to a sealed object includes an elongate member to be entwined in the object such that access is denied unless the member is removed. The elongate member has a hollow, pressurizable chamber extending throughout its length that is filled with a permanent dye under greater than atmospheric pressure. Attempts to cut the member and weld it together are revealed when dye flows through a rupture in the chamber wall and stains the outside surface of the member

  14. Benign gastric filling defect

    International Nuclear Information System (INIS)

    Oh, K. K.; Lee, Y. H.; Cho, O. K.; Park, C. Y.

    1979-01-01

    The gastric lesion is a common source of complaints to Orientals, however, evaluation of gastric symptoms and laboratory examination offer little specific aid in the diagnosis of gastric diseases. Thus roentgenography of gastrointestinal tract is one of the most reliable method for detail diagnosis. On double contract study of stomach, gastric filling defect is mostly caused by malignant gastric cancer, however, other benign lesions can cause similar pictures which can be successfully treated by surgery. 66 cases of benign causes of gastric filling defect were analyzed at this point of view, which was verified pathologically by endoscope or surgery during recent 7 years in Yensei University College of Medicine, Severance Hospital. The characteristic radiological picture of each disease was discussed for precise radiologic diagnosis. 1. Of total 66 cases, there were 52 cases of benign gastric tumor 10 cases of gastric varices, 5 cases of gastric bezoar, 5 cases of corrosive gastritis, 3 cases of granulomatous disease and one case of gastric hematoma. 2. The most frequent causes of benign tumors were adenomatous polyp (35/42) and the next was leiomyoma (4/42). Others were one of case of carcinoid, neurofibroma and cyst. 3. Characteristic of benign adenomatous polyp were relatively small in size, smooth surface and were observed that large size, benign polyp was frequently type IV lesion with a stalk. 4. Submucosal tumors such as leiomyoma needed differential diagnosis with polypoid malignant cancer. However, the characteristic points of differentiation was well circumscribed smooth margined filling defect without definite mucosal destruction on surface. 5. Gastric varices showed multiple lobulated filling defected especially on gastric fundus that changed its size and shape by respiration and posture of patients. Same varices lesions on esophagus and history of liver disease were helpful for easier diagnosis. 6. Gastric bezoar showed well defined movable mass

  15. Benign gastric filling defect

    Energy Technology Data Exchange (ETDEWEB)

    Oh, K. K.; Lee, Y. H.; Cho, O. K.; Park, C. Y. [Yonsei University College of Medicine, Seoul (Korea, Republic of)

    1979-06-15

    The gastric lesion is a common source of complaints to Orientals, however, evaluation of gastric symptoms and laboratory examination offer little specific aid in the diagnosis of gastric diseases. Thus roentgenography of gastrointestinal tract is one of the most reliable method for detail diagnosis. On double contract study of stomach, gastric filling defect is mostly caused by malignant gastric cancer, however, other benign lesions can cause similar pictures which can be successfully treated by surgery. 66 cases of benign causes of gastric filling defect were analyzed at this point of view, which was verified pathologically by endoscope or surgery during recent 7 years in Yensei University College of Medicine, Severance Hospital. The characteristic radiological picture of each disease was discussed for precise radiologic diagnosis. 1. Of total 66 cases, there were 52 cases of benign gastric tumor 10 cases of gastric varices, 5 cases of gastric bezoar, 5 cases of corrosive gastritis, 3 cases of granulomatous disease and one case of gastric hematoma. 2. The most frequent causes of benign tumors were adenomatous polyp (35/42) and the next was leiomyoma (4/42). Others were one of case of carcinoid, neurofibroma and cyst. 3. Characteristic of benign adenomatous polyp were relatively small in size, smooth surface and were observed that large size, benign polyp was frequently type IV lesion with a stalk. 4. Submucosal tumors such as leiomyoma needed differential diagnosis with polypoid malignant cancer. However, the characteristic points of differentiation was well circumscribed smooth margined filling defect without definite mucosal destruction on surface. 5. Gastric varices showed multiple lobulated filling defected especially on gastric fundus that changed its size and shape by respiration and posture of patients. Same varices lesions on esophagus and history of liver disease were helpful for easier diagnosis. 6. Gastric bezoar showed well defined movable mass

  16. Benign gastric filling defect

    Energy Technology Data Exchange (ETDEWEB)

    Oh, K K; Lee, Y H; Cho, O K; Park, C Y [Yonsei University College of Medicine, Seoul (Korea, Republic of)

    1979-06-15

    The gastric lesion is a common source of complaints to Orientals, however, evaluation of gastric symptoms and laboratory examination offer little specific aid in the diagnosis of gastric diseases. Thus roentgenography of gastrointestinal tract is one of the most reliable method for detail diagnosis. On double contract study of stomach, gastric filling defect is mostly caused by malignant gastric cancer, however, other benign lesions can cause similar pictures which can be successfully treated by surgery. 66 cases of benign causes of gastric filling defect were analyzed at this point of view, which was verified pathologically by endoscope or surgery during recent 7 years in Yensei University College of Medicine, Severance Hospital. The characteristic radiological picture of each disease was discussed for precise radiologic diagnosis. 1. Of total 66 cases, there were 52 cases of benign gastric tumor 10 cases of gastric varices, 5 cases of gastric bezoar, 5 cases of corrosive gastritis, 3 cases of granulomatous disease and one case of gastric hematoma. 2. The most frequent causes of benign tumors were adenomatous polyp (35/42) and the next was leiomyoma (4/42). Others were one of case of carcinoid, neurofibroma and cyst. 3. Characteristic of benign adenomatous polyp were relatively small in size, smooth surface and were observed that large size, benign polyp was frequently type IV lesion with a stalk. 4. Submucosal tumors such as leiomyoma needed differential diagnosis with polypoid malignant cancer. However, the characteristic points of differentiation was well circumscribed smooth margined filling defect without definite mucosal destruction on surface. 5. Gastric varices showed multiple lobulated filling defected especially on gastric fundus that changed its size and shape by respiration and posture of patients. Same varices lesions on esophagus and history of liver disease were helpful for easier diagnosis. 6. Gastric bezoar showed well defined movable mass

  17. How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

    Science.gov (United States)

    Suhir, E.; Yi, S.; Ghaffarian, R.

    2017-03-01

    It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

  18. Effect of gap distance on tensile strength of preceramic base metal solder joints.

    Science.gov (United States)

    Fattahi, Farnaz; Motamedi, Milad

    2011-01-01

    In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023), but the differences between other groups were not sig-nificant at a significance level of 0.05. There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints.

  19. The critical oxide thickness for Pb-free reflow soldering on Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)

    2012-06-01

    Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

  20. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    Science.gov (United States)

    Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

    2016-12-01

    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

  1. Hydrogen Filling Station

    Energy Technology Data Exchange (ETDEWEB)

    Boehm, Robert F; Sabacky, Bruce; Anderson II, Everett B; Haberman, David; Al-Hassin, Mowafak; He, Xiaoming; Morriseau, Brian

    2010-02-24

    future. Project partners also conducted a workshop on hydrogen safety and permitting. This provided an opportunity for the various permitting agencies and end users to gather to share experiences and knowledge. As a result of this workshop, the permitting process for the hydrogen filling station on the Las Vegas Valley Water District’s land was done more efficiently and those who would be responsible for the operation were better educated on the safety and reliability of hydrogen production and storage. The lessons learned in permitting the filling station and conducting this workshop provided a basis for future hydrogen projects in the region. Continuing efforts to increase the working pressure of electrolysis and efficiency have been pursued. Research was also performed on improving the cost, efficiency and durability of Proton Exchange Membrane (PEM) hydrogen technology. Research elements focused upon PEM membranes, electrodes/catalysts, membrane-electrode assemblies, seals, bipolar plates, utilization of renewable power, reliability issues, scale, and advanced conversion topics. Additionally, direct solar-to-hydrogen conversion research to demonstrate stable and efficient photoelectrochemistry (PEC) hydrogen production systems based on a number of optional concepts was performed. Candidate PEC concepts included technical obstacles such as inefficient photocatalysis, inadequate photocurrent due to non-optimal material band gap energies, rapid electron-hole recombination, reduced hole mobility and diminished operational lifetimes of surface materials exposed to electrolytes. Project Objective 1: Design, build, operate hydrogen filling station Project Objective 2: Perform research and development for utilizing solar technologies on the hydrogen filling station and convert two utility vehicles for use by the station operators Project Objective 3: Increase capacity of hydrogen filling station; add additional vehicle; conduct safety workshop; develop a roadmap for

  2. Recent progress in high-pressure studies on organic conductors

    Directory of Open Access Journals (Sweden)

    Syuma Yasuzuka and Keizo Murata

    2009-01-01

    Full Text Available Recent high-pressure studies of organic conductors and superconductors are reviewed. The discovery of the highest Tc superconductivity among organics under high pressure has triggered the further progress of the high-pressure research. Owing to this finding, various organic conductors with the strong electron correlation were investigated under high pressures. This review includes the pressure techniques using the cubic anvil apparatus, as well as high-pressure studies of the organic conductors up to 10 GPa showing extraordinary temperature and pressure dependent transport phenomena.

  3. Conductor development for the Superconducting Super Collider (SSC)

    International Nuclear Information System (INIS)

    Gregory, E.

    1988-01-01

    This review investigates the developments in fine filamentary materials over the last three years and traces how the relations between the magnet requirements and property improvements have fashioned SSC conductor specifications. The review emphasizes factors that affect filament nonuniformity and the overall quality of the product. The elimination of proximity effect-induced coupling in SCC type conductors, by introducing small percentages of manganese into the copper between the filaments, is discussed. Modification of a Fermi kit has produced materials with improved critical current densities. The possibility of using this approach to make conductors for accelerator magnets is assessed

  4. Electrical circuit modeling of conductors with skin effect

    International Nuclear Information System (INIS)

    Kerst, D.W.; Sprott, J.C.

    1986-01-01

    The electrical impedance of a lossy conductor is a complicated function of time (or frequency) because of the skin effect. By solving the diffusion equation for magnetic fields in conductors of several prototypical shapes, the impedance can be calculated as a function of time for a step function of current. The solution suggests an electrical circuit representation that allows calculation of time-dependent voltages and currents of arbitrary waveforms. A technique using an operational amplifier to determine the current in such a conductor by measuring some external voltage is described. Useful analytical approximations to the results are derived

  5. General relativistic galvano-gravitomagnetic effect in current carrying conductors

    International Nuclear Information System (INIS)

    Ahmedov, B.J.

    1998-11-01

    The analogy between general relativity and electromagnetism suggests that there is a galvano-gravitomagnetic effect, which is the gravitational analogue of the Hall effect. This new effect takes place when a current carrying conductor is placed in a gravitomagnetic field and the conduction electrons moving inside the conductor are deflected transversally with respect to the current flow. In connection with this galvano-gravitomagnetic effect, we explore the possibility of using current carrying conductors for detecting the gravitomagnetic field of the Earth. (author)

  6. Chemical wiring and soldering toward all-molecule electronic circuitry.

    Science.gov (United States)

    Okawa, Yuji; Mandal, Swapan K; Hu, Chunping; Tateyama, Yoshitaka; Goedecker, Stefan; Tsukamoto, Shigeru; Hasegawa, Tsuyoshi; Gimzewski, James K; Aono, Masakazu

    2011-06-01

    Key to single-molecule electronics is connecting functional molecules to each other using conductive nanowires. This involves two issues: how to create conductive nanowires at designated positions, and how to ensure chemical bonding between the nanowires and functional molecules. Here, we present a novel method that solves both issues. Relevant functional molecules are placed on a self-assembled monolayer of diacetylene compound. A probe tip of a scanning tunneling microscope is then positioned on the molecular row of the diacetylene compound to which the functional molecule is adsorbed, and a conductive polydiacetylene nanowire is fabricated by initiating chain polymerization by stimulation with the tip. Since the front edge of chain polymerization necessarily has a reactive chemical species, the created polymer nanowire forms chemical bonding with an encountered molecular element. We name this spontaneous reaction "chemical soldering". First-principles theoretical calculations are used to investigate the structures and electronic properties of the connection. We demonstrate that two conductive polymer nanowires are connected to a single phthalocyanine molecule. A resonant tunneling diode formed by this method is discussed. © 2011 American Chemical Society

  7. Improvement of the auto wire feeder machine in a de-soldering process

    Directory of Open Access Journals (Sweden)

    Niramon Nonkhukhetkhong

    2016-10-01

    Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

  8. Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

    Science.gov (United States)

    Teverovsky, Alexander A.

    2014-01-01

    Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

  9. In vitro conjunctival incision repair by temperature-controlled laser soldering.

    Science.gov (United States)

    Norman, Galia; Rabi, Yaron; Assia, Ehud; Katzir, Abraham

    2009-01-01

    The common method of closing conjunctival incisions is by suturing, which is associated with several disadvantages. It requires skill to apply and does not always provide a watertight closure, which is required in some operations (e.g., glaucoma filtration). The purpose of the present study was to evaluate laser soldering as an alternative method for closing conjunctival incisions. Conjunctival incisions of 20 ex vivo porcine eyes were laser soldered using a temperature-controlled fiberoptic laser system and an albumin mixed with indocyanine green as a solder. The control group consisted of five repaired incisions by a 10-0 nylon running suture. The leak pressure of the repaired incisions was measured. The mean leak pressure in the laser-soldered group was 132 mm Hg compared to 4 mm Hg in the sutured group. There was no statistically significant difference in both the incision's length and distance from the limbus between the groups, before and after the procedure, indicating that there was no severe thermal damage. These preliminary results clearly demonstrate that laser soldering may be a useful method for achieving an immediate watertight conjunctival wound closure. This procedure is faster and easier to apply than suturing.

  10. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    CERN Document Server

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

    2015-01-01

    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  11. Effect of temperature and flux concentration on soldering of base metal.

    Science.gov (United States)

    Lee, S Y; Lin, C T; Wang, M H; Tseng, H; Huang, H M; Dong, D R; Pan, L C; Shih, Y H

    2000-12-01

    The present study used the acoustic emission (AE) technique to evaluate interactions among soldering temperature, flux treatment, and the resultant ultimate tensile strength (UTS). Scanning electron microscopy (SEM) was used to examine fracture surfaces of the solder joints. Specimens were cast from removable partial denture alloy and then placed in a jig with a gap distance of 1.0 mm. A high-frequency soldering machine with an optical pyrometer was used for soldering at 1150 degrees C and 1200 degrees C, respectively. The flux concentrations were 67% and 75%. The soldered specimens were subjected to tensile test at a crosshead speed of 0.05 mm/min. During testing, acoustic emissions in the frequency range of 100--1200 kHz were collected, filtered, recorded, and processed by a sensing device. The results were analysed by ANOVA and Tukey LSD test. UTS at different temperatures showed no significant difference according to either mechanical or acoustic results. But in the 1200 degrees C group, the UTSs and AE counts showed significant differences (Pacoustic signals within the elastic deformation zone, while the 67% flux subgroup produced similar signals within the plastic deformation zone, either beyond the 0.2% yield point or before fracture.

  12. Nano-soldering of magnetically aligned three-dimensional nanowire networks

    International Nuclear Information System (INIS)

    Gao Fan; Gu Zhiyong

    2010-01-01

    It is extremely challenging to fabricate 3D integrated nanostructures and hybrid nanoelectronic devices. In this paper, we report a simple and efficient method to simultaneously assemble and solder nanowires into ordered 3D and electrically conductive nanowire networks. Nano-solders such as tin were fabricated onto both ends of multi-segmented nanowires by a template-assisted electrodeposition method. These nanowires were then self-assembled and soldered into large-scale 3D network structures by magnetic field assisted assembly in a liquid medium with a high boiling point. The formation of junctions/interconnects between the nanowires and the scale of the assembly were dependent on the solder reflow temperature and the strength of the magnetic field. The size of the assembled nanowire networks ranged from tens of microns to millimeters. The electrical characteristics of the 3D nanowire networks were measured by regular current-voltage (I-V) measurements using a probe station with micropositioners. Nano-solders, when combined with assembling techniques, can be used to efficiently connect and join nanowires with low contact resistance, which are very well suited for sensor integration as well as nanoelectronic device fabrication.

  13. The first DC performance test and analysis of CC conductor short sample at ASIPP conductor test facility

    International Nuclear Information System (INIS)

    Shi Yi; Wu Yu; Liu Huajun; Long Feng; Qian Li; Ren Zhibin; Li Shaolei; Liu Bo; Chen Jinglin

    2012-01-01

    Highlights: ► In this study the first DC performance experiments of ITER correction coil conductor short sample have been carried out in ASIPP test facility. ► A CC conductor short sample was fabricated and tested to confirm the capability of this test facility for qualification tests of CC conductors. ► There is no obvious impact of cycling on DC performance measurement. ► Those measured results of current sharing temperature are in agreement with the expected results from strand scaling - Abstract: The first DC performance experiments of ITER correction coil (CC) conductor short sample have been carried out in the conductor test facility of Institute of Plasma Physics, CAS (ASIPP) in January this year. Those experiments aim to investigate the DC performance of ITER CC conductor. The tested conductor short sample is bended as a half circle with the diameter of 270 mm to meet the background magnetic field shape. The half circle part of sample is longer than the final twist pitch. The current sharing temperature (T cs ) in the 3.86 T external magnetic field (B ex ), ≤12 kA could be measured including the critical current (I c ) run. There is no obvious impact of 1000 cycles on DC performance. Those measured T cs results are in agreement with the expected results from strand scaling.

  14. Preparing for faster filling

    CERN Multimedia

    CERN Bulletin

    2010-01-01

    Following the programmed technical stop last week, operators focussed on preparing the machine for faster filling, which includes multibunch injection and a faster pre-cycle phase.   The LHC1 screen shot during the first multibunch injection operation. The LHC operational schedule incorporates a technical stop for preventive maintenance roughly every six weeks of stable operation, during which several interventions on the various machines are carried out. Last week these included the replacement of a faulty magnet in the SPS pre-accelerator, which required the subsequent re-setting of the system of particle extraction and transfer to the LHC. At the end of last week, all the machines were handed back for operation and work could start on accommodating all the changes made into the complex systems in order for normal operation to be resumed. These ‘recovery’ operations continued through the weekend and into this week. At the beginning of this week, operators succeeded in pro...

  15. Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

    International Nuclear Information System (INIS)

    Chellvarajoo, Srivalli; Abdullah, M.Z.; Samsudin, Z.

    2015-01-01

    Highlights: • Fe 2 NiO 4 nanoparticles added into SAC 305 by mechanical mixing to form nanocomposite solder paste. • Nanoparticles in the composite solder travels with flux to the outermost surface after reflow. • The intermetallics compound reduced with the addition of nanoparticles into solder paste. • The hardness increased with the addition of limited percentage of nanoparticles into SAC 305. - Abstract: This study investigates the effects of the addition of Fe 2 NiO 4 nanoparticles into a SAC-305 lead-free solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper ‘sandwich’ method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5 wt.% of Fe 2 NiO 4 nanoparticles, respectively. If the addition of Fe 2 NiO 4 nanoparticle exceeded 1.5 wt.%, the hardness increased infinitely

  16. Bulk-Fill Resin Composites

    DEFF Research Database (Denmark)

    Benetti, Ana Raquel; Havndrup-Pedersen, Cæcilie; Honoré, Daniel

    2015-01-01

    the restorative procedure. The aim of this study, therefore, was to compare the depth of cure, polymerization contraction, and gap formation in bulk-fill resin composites with those of a conventional resin composite. To achieve this, the depth of cure was assessed in accordance with the International Organization...... for Standardization 4049 standard, and the polymerization contraction was determined using the bonded-disc method. The gap formation was measured at the dentin margin of Class II cavities. Five bulk-fill resin composites were investigated: two high-viscosity (Tetric EvoCeram Bulk Fill, SonicFill) and three low......-viscosity (x-tra base, Venus Bulk Fill, SDR) materials. Compared with the conventional resin composite, the high-viscosity bulk-fill materials exhibited only a small increase (but significant for Tetric EvoCeram Bulk Fill) in depth of cure and polymerization contraction, whereas the low-viscosity bulk...

  17. Loss and Inductance Investigation in Superconducting Cable Conductors

    DEFF Research Database (Denmark)

    Olsen, Søren Krüger; Tønnesen, Ole; Træholt, Chresten

    1999-01-01

    An important parameter in the design and optimization of a superconducting cable conductor is the control of the current distribution among single tapes and layers. This distribution is to a large degree determined by inductances, since the resistances are low. The self and mutual inductances...... of transport current and current distribution.This presentation is based on a number of experiments performed on prototype superconducting cable conductors. The critical current (1uV/cm) of the conductor at 77K was 1590 A (cable #1) and 3240 A (cable #2) respectively.At an rms current of 2 kA (50 Hz) the AC......-loss was measured on cable #2 to 0.6W/mxphase. This is, to our knowledge, the lowest AC-loss (at 2kA and 77K) of a high temperature superconducting cable conductor reported so far....

  18. Materials Science of High-Temperature Superconducting Coated Conductor Materials

    National Research Council Canada - National Science Library

    Beasley, M. R

    2007-01-01

    This program was broadly focused on the materials science of high temperature superconducting coated conductors, which are of potential interest for application in electric power systems of interest to the Air Force...

  19. Gravitomagnetic effects in conductor in applied magnetic field

    International Nuclear Information System (INIS)

    Ahmedov, B.J.; Karim, M.

    1999-11-01

    The electromagnetic measurements of general relativistic gravitomagnetic effects which can be performed within a conductor embedded in the space-time of slow rotating gravitational object in the presence of magnetic field are proposed. (author)

  20. High voltage switches having one or more floating conductor layers

    Science.gov (United States)

    Werne, Roger W.; Sampayan, Stephen; Harris, John Richardson

    2015-11-24

    This patent document discloses high voltage switches that include one or more electrically floating conductor layers that are isolated from one another in the dielectric medium between the top and bottom switch electrodes. The presence of the one or more electrically floating conductor layers between the top and bottom switch electrodes allow the dielectric medium between the top and bottom switch electrodes to exhibit a higher breakdown voltage than the breakdown voltage when the one or more electrically floating conductor layers are not present between the top and bottom switch electrodes. This increased breakdown voltage in the presence of one or more electrically floating conductor layers in a dielectric medium enables the switch to supply a higher voltage for various high voltage circuits and electric systems.

  1. Experimental and computational approaches to electrical conductor loading characteristics

    International Nuclear Information System (INIS)

    Vary, M.; Goga, V.; Paulech, J.

    2012-01-01

    This article describes cooling analyses of horizontally arranged bare electric conductor using analytical and numerical methods. Results of these analyses will be compared to the results obtained from experimental measurement. (Authors)

  2. Reliability of Pb free solder alloys. Physical and mechanical properties; Pb free handa no shinraisei. Butsuri kikaiteki shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Sanji, M; Yoshino, M; Ishikawa, J; Takenaka, O [Denso Corp., Aichi (Japan)

    1997-10-01

    Properties of 19 different Pb free solders have been evaluated in comparison with Sn-37Pb eutectic solder. Pb free solders without Bi were on the same level as Sn-37Pb in tensile strength and elongation, and those with Bi had higher strength and lower elongation than Sn-37Pb. As the Bi content increased, strength was higher, and elongation was lower. In torsion fatigue tests, fatigue life of Pb free solders without Bi was longer than Sn-37Pb. The relationships of Coffin-Manson rule and Basquin rule with fatigue life was applicable to Pb free solder. Fatigue life of those is inferred from their tensile strength. 7 refs., 13 figs., 1 tab.

  3. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    International Nuclear Information System (INIS)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-01-01

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines

  4. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-10-31

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

  5. Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

    Energy Technology Data Exchange (ETDEWEB)

    Wolfe, Larry

    2009-04-22

    Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.

  6. Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution

    Science.gov (United States)

    Nordarina, J.; Mohd, H. Z.; Ahmad, A. M.; Muhammad, F. M. N.

    2018-03-01

    The corrosion properties of Sn-9(5Al-Zn), Sn-Cu and SAC305 were studied via potentiodynamic polarization method in an acidic solution of 1 M hydrochloric acid (HCl). Sn-9(5Al-Zn) produced different polarization profile compared with Sn-Cu and SAC305. The morphological analysis showed that small, deep grooves shaped of corrosion product formed on top of Sn-9(5Al-Zn) solder while two distinctive structures of closely packed and loosely packed corrosion product formed on top of Sn-Cu and SAC305 solder alloys. Phase analysis revealed the formations of various corrosion products such as SnO and SnO2 mainly dominant on surface of solder alloys after potentiodynamic polarization in 1 M hydrochloric acid (HCl).

  7. Au-Ge based Candidate Alloys for High-Temperature Lead-Free Solder Alternatives

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure and microhard......Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure...... was primarily strengthened by the refined (Ge) dispersed phase. The distribution of phases played a relatively more crucial role in determining the ductility of the bulk solder alloy. In the present work it was found that among the low melting point metals, the addition of Sb to the Au-Ge eutectic would...

  8. Instantaneous fluxless bonding of Au with Pb-Sn solder in ambient atmosphere

    International Nuclear Information System (INIS)

    Lee, T.K.; Zhang, Sam; Wong, C.C.; Tan, A.C.

    2005-01-01

    A fluxless bonding technique has been developed as a method of flip-chip bonding for microelectronic packaging. The fluxless bonding technique can be achieved instantaneously in an ambient environment between metallic stud bumps and predefined molten solder. This paper describes the mechanics of the bonding action and verifies the effectiveness of this bonding method through wetting balance tests and scanning electron microscope and energy dispersive x-ray analysis. This technique has been demonstrated by using a gold stud bump to break the tin oxide layer over molten solder. This allows for a fast, solid liquid interdiffusion between gold (Au) and the fresh molten eutectic lead-tin (Pb-Sn) solder for joint formation during solidification. This bonding method has been successfully tested with 130-μm-pitch flip-chip bond pads on a joint-in-via flex substrate architecture

  9. Dissolution ad uptake of cadmium from dental gold solder alloy implants

    International Nuclear Information System (INIS)

    Bergman, B.; Bergman, M.; Soeremark, R.

    1977-01-01

    Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium ( 115 Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of 115 Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver. (author)

  10. SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

    Directory of Open Access Journals (Sweden)

    D. Heinemann

    2016-06-01

    Full Text Available Printed Circuit Boards (PCB play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

  11. Guanidinium nonaflate as a solid-state proton conductor

    DEFF Research Database (Denmark)

    Chen, Xiaoli; Tang, Haolin; Putzeys, Tristan

    2016-01-01

    Protic organic ionic plastic crystals (POIPCs) are a type of novel solid-state proton conductors. In this work, guanidinium nonaflate ([Gdm-H][NfO]) is reported to be a model POIPC. Its structure-property relationship has been investigated comprehensively. Infrared analysis of [Gdm-H][NfO] and its....... In addition, POIPC-based solid-state proton conductors are also expected to find applications in sensors and other electrochemical devices....

  12. Chaotic Music Generation System Using Music Conductor Gesture

    OpenAIRE

    Chen, Shuai; Maeda, Yoichiro; Takahashi, Yasutake

    2013-01-01

    In the research of interactive music generation, we propose a music generation method, that the computer generates the music, under the recognition of human music conductor's gestures.In this research, the generated music is tuned by the recognized gestures for the parameters of the network of chaotic elements in real time. The music conductor's hand motions are detected by Microsoft Kinect in this system. Music theories are embedded in the algorithm, as a result, the generated music will be ...

  13. Music Conductor Gesture Recognized Interactive Music Generation System

    OpenAIRE

    CHEN, Shuai; MAEDA, Yoichiro; TAKAHASHI, Yasutake

    2012-01-01

    In the research of interactive music generation, we propose a music generation method, that the computer generates the music automatically, and then the music will be arranged under the human music conductor's gestures, before it outputs to us. In this research, the generated music is processed from chaotic sound, which is generated from the network of chaotic elements in realtime. The music conductor's hand motions are detected by Microsoft Kinect in this system. Music theories are embedded ...

  14. Spatial Analysis of Thermal Aging of Overhead Transmission Conductors

    Czech Academy of Sciences Publication Activity Database

    Musílek, P.; Heckenbergerová, Jana; Bhuiyan, M.M.I.

    2012-01-01

    Roč. 27, č. 3 (2012), s. 1196-1204 ISSN 0885-8977 Grant - others:GA AV ČR(CZ) M100300904 Source of funding: V - iné verejné zdroje Keywords : aluminium conductor steel reinforced (ACSR) conductor * hot spot * loss of tensile strength * numerical weather prediction * power transmission lines * thermal aging Subject RIV: JE - Non-nuclear Energetics, Energy Consumption ; Use Impact factor: 1.519, year: 2012

  15. Tilt stability of rotating current rings with passive conductors

    International Nuclear Information System (INIS)

    Zweibel, E.G.; Pomphrey, N.

    1984-12-01

    We study the combined effects of rotation and resistive passive conductors on the stability of a rigid current in an external magnetic field. We present numerical and approximate analytical solutions to the equations of motion, which show that the ring is always tilt unstable on the resistive decay timescale of the conductors, although rotation and eddy currents may stabilize it over short times. Possible applications of our model include spheromaks which rotate or which are encircled by energetic particle rings

  16. Test and evaluation of conductors for superconducting magnetic energy storage

    International Nuclear Information System (INIS)

    Schermer, R.I.; Hassenzahl, W.V.

    1976-01-01

    Pancake coils of a monolithic conductor and several different types of braid and cable, using a variety of insulating tapes and bonding resins were constructed. The coils were tested to quench in self-field at currents up to 2700 A. Results are presented for the training behavior of the various coils as compared to short-sample tests. A conductor composed of several braids or cables in parallel, which will be suitable for the in situ fabrication of large magnets is described

  17. Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

    Science.gov (United States)

    Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

    2011-01-01

    The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

  18. Transport AC losses in YBCO coated conductors

    Energy Technology Data Exchange (ETDEWEB)

    Majoros, M [Ohio State University, Columbus, OH 43210 (United States); Ye, L [IRC in Superconductivity, University of Cambridge, Madingley Road, Cambridge CB3 0HE (United Kingdom); Velichko, A V [IRC in Superconductivity, University of Cambridge, Madingley Road, Cambridge CB3 0HE (United Kingdom); Coombs, T A [IRC in Superconductivity, University of Cambridge, Madingley Road, Cambridge CB3 0HE (United Kingdom); Sumption, M D [Ohio State University, Columbus, OH 43210 (United States); Collings, E W [Ohio State University, Columbus, OH 43210 (United States)

    2007-09-15

    Transport AC loss measurements have been made on YBCO-coated conductors prepared on two different substrate templates-RABiTS (rolling-assisted biaxially textured substrate) and IBAD (ion-beam-assisted deposition). RABiTS samples show higher losses compared with the theoretical values obtained from the critical state model, with constant critical current density, at currents lower than the critical current. An origin of this extra AC loss was demonstrated experimentally by comparison of the AC loss of two samples with different I-V curves. Despite a difference in I-V curves and in the critical currents, their measured losses, as well as the normalized losses, were practically the same. However, the functional dependence of the losses was affected by the ferromagnetic substrate. An influence of the presence of a ferromagnetic substrate on transport AC losses in YBCO film was calculated numerically by the finite element method. The presence of a ferromagnetic substrate increases transport AC losses in YBCO films depending on its relative magnetic permeability. The two loss contributions-transport AC loss in YBCO films and ferromagnetic loss in the substrate-cannot be considered as mutually independent.

  19. Electron quantum optics in ballistic chiral conductors

    Energy Technology Data Exchange (ETDEWEB)

    Bocquillon, Erwann; Freulon, Vincent; Parmentier, Francois D.; Berroir, Jean-Marc; Placais, Bernard; Feve, Gwendal [Laboratoire Pierre Aigrain, Ecole Normale Superieure, CNRS (UMR 8551), Universite Pierre et Marie Curie, Universite Paris Diderot, Paris (France); Wahl, Claire; Rech, Jerome; Jonckheere, Thibaut; Martin, Thierry [Aix Marseille Universite, CNRS, CPT, UMR 7332, Marseille (France); Universite de Toulon, CNRS, CPT, UMR 7332, La Garde (France); Grenier, Charles; Ferraro, Dario; Degiovanni, Pascal [Universite de Lyon, Federation de Physique Andre Marie Ampere, CNRS - Laboratoire de Physique de l' Ecole Normale Superieure de Lyon, Lyon (France)

    2014-01-15

    The edge channels of the quantum Hall effect provide one dimensional chiral and ballistic wires along which electrons can be guided in an optics-like setup. Electronic propagation can then be analyzed using concepts and tools derived from optics. After a brief review of electron optics experiments performed using stationary current sources which continuously emit electrons in the conductor, this paper focuses on triggered sources, which can generate on-demand a single particle state. It first outlines the electron optics formalism and its analogies and differences with photon optics and then turns to the presentation of single electron emitters and their characterization through the measurements of the average electrical current and its correlations. This is followed by a discussion of electron quantum optics experiments in the Hanbury-Brown and Twiss geometry where two-particle interferences occur. Finally, Coulomb interactions effects and their influence on single electron states are considered. (copyright 2013 by WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  20. Electron quantum optics in ballistic chiral conductors

    International Nuclear Information System (INIS)

    Bocquillon, Erwann; Freulon, Vincent; Parmentier, Francois D.; Berroir, Jean-Marc; Placais, Bernard; Feve, Gwendal; Wahl, Claire; Rech, Jerome; Jonckheere, Thibaut; Martin, Thierry; Grenier, Charles; Ferraro, Dario; Degiovanni, Pascal

    2014-01-01

    The edge channels of the quantum Hall effect provide one dimensional chiral and ballistic wires along which electrons can be guided in an optics-like setup. Electronic propagation can then be analyzed using concepts and tools derived from optics. After a brief review of electron optics experiments performed using stationary current sources which continuously emit electrons in the conductor, this paper focuses on triggered sources, which can generate on-demand a single particle state. It first outlines the electron optics formalism and its analogies and differences with photon optics and then turns to the presentation of single electron emitters and their characterization through the measurements of the average electrical current and its correlations. This is followed by a discussion of electron quantum optics experiments in the Hanbury-Brown and Twiss geometry where two-particle interferences occur. Finally, Coulomb interactions effects and their influence on single electron states are considered. (copyright 2013 by WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  1. Applications of inorganic Ion-conductor

    Energy Technology Data Exchange (ETDEWEB)

    Fujiki, Yoshinori [Science and Technology Agency, Tokyo (Japan)

    1989-03-01

    Physical properties and application of solid electrolyte, particularly of inorganic solid electrolyte, are described. Ion conductors have been widely used not only for electric power application but also for sensors, gas separators, display elements, Coulomb meters, storage elements, etc. The most extensively used pacemakers now employ Li/I{sub 2}(PVP) primary batteries. Thin film lithium secondary battery has a feature of providing comparatively large electric current, with 2.5 V charging, 1.8 V discharging, and 3 mA.cm{sup {minus}2} short circuit current. The capacity of about 4 mAh per 1 cm{sup 2} electrode has been achieved. The most widely used solid electrolyte for the oxygen sensor is the stabilized ZrO{sub 2}. The relation of air/fuel mix proportion with the change in electromotive force is shown. Although solid electrolyte fuel cell is not yet put to practical use, a result of an experiment is introduced. Brief explanations are made on the oxygen pump, electrochromic display elements, Coulomb meter and voltage storage element. 18 refs., 11 figs., 6 tabs.

  2. Conductor gestures influence evaluations of ensemble performance

    Directory of Open Access Journals (Sweden)

    Steven eMorrison

    2014-07-01

    Full Text Available Previous research has found that listener evaluations of ensemble performances vary depending on the expressivity of the conductor’s gestures, even when performances are otherwise identical. It was the purpose of the present study to test whether this effect of visual information was evident in the evaluation of specific aspects of ensemble performance, articulation and dynamics. We constructed a set of 32 music performances that combined auditory and visual information and were designed to feature a high degree of contrast along one of two target characteristics: articulation and dynamics. We paired each of four music excerpts recorded by a chamber ensemble in both a high- and low-contrast condition with video of four conductors demonstrating high- and low-contrast gesture specifically appropriate to either articulation or dynamics. Using one of two equivalent test forms, college music majors and nonmajors (N = 285 viewed sixteen 30-second performances and evaluated the quality of the ensemble’s articulation, dynamics, technique and tempo along with overall expressivity. Results showed significantly higher evaluations for performances featuring high rather than low conducting expressivity regardless of the ensemble’s performance quality. Evaluations for both articulation and dynamics were strongly and positively correlated with evaluations of overall ensemble expressivity.

  3. Comparison of implant-abutment interface misfits after casting and soldering procedures.

    Science.gov (United States)

    Neves, Flávio Domingues das; Elias, Gisele Araújo; da Silva-Neto, João Paulo; de Medeiros Dantas, Lucas Costa; da Mota, Adérito Soares; Neto, Alfredo Júlio Fernandes

    2014-04-01

    The aim of this study was to compare vertical and horizontal adjustments of castable abutments after conducting casting and soldering procedures. Twelve external hexagonal implants (3.75 × 10 mm) and their UCLA abutments were divided according their manufacturer and abutment type: PUN (plastic UCLA, Neodent), PUC (plastic UCLA, Conexão), PU3i (plastic UCLA, Biomet 3i), and PUTN (plastic UCLA with Tilite milled base, Neodent). Three infrastructures of a fixed partial implant-supported bridge with 3 elements were produced for each group. The measurements of vertical (VM) and horizontal (HM) misfits were obtained via scanning electron microscopy after completion of casting and soldering. The corresponding values were determined to be biomechanically acceptable to the system, and the results were rated as a percentage. Statistical analysis establishes differences between groups by chi-square after procedures, and McNeman's test was applied to analyze the influence of soldering over casting (α ≤ .05). For the values of VM and HM, respectively, when the casting process was complete, it was observed that 83.25% and 100% (PUTN), 33.3% and 27.75% (PUN), 33.3% and 88.8% (PUC), 33.3% and 94.35% (PU3i) represented acceptable values. After completing the requisite soldering, acceptable values were 50% and 94.35% (PUTN), 16.6% and 77.7% (PUN), 38.55% and 77.7% (PUC), and 27.75% and 94.35% (PU3i). Within the limitations of this study, it can be concluded that the premachined abutments presented more acceptable VM values. The HM values were within acceptable limits before and after the soldering procedure for most groups. Further, the soldering procedure resulted in an increase of VM in all groups.

  4. In-vitro Investigations of Skin Closure using Diode Laser and Protein Solder Containing Gold Nanoshells

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2010-12-01

    Full Text Available Introduction: Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nanoshells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nanoshells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nanoshells were prepared. A full thickness incision of 2×20 mm2 was made on the surface and after placing 50 μl of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns, and scan velocity (Vs were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nanoshell concentrations. In addition, at constant laser irradiance (I, the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to st = 1610 g/cm2 at I ~ 60 Wcm-2, T ~ 65ºC, Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nanoshells can be used as an indocyanine green dye (ICG alterative for laser tissue soldering.  Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

  5. Thin film conductors for self-equalizing cables

    Science.gov (United States)

    Owen, G.; Trutna, W. R.; Orsley, T. J.; Lucia, F.; Daly, C. B.

    2017-10-01

    Self-equalizing cables using hollow conductors with wall thickness less than the skin depth were proposed in 1929. However, they do not appear ever to have been widely used, although the idea has resurfaced and been refined from time to time. In the early 2000's, self-equalizing conductors consisting of solid magnetic steel cores coated with silver were developed by W.L. Gore, and used in their 2.5 Gb/s "Eye-Opener" cables, although higher speed versions never appeared. We have revived the original 1929 idea, proposing to use glass as a solid insulating core. This technology can potentially work at frequencies of many 10's of GHz. Possible uses include short range GHz links such as USB and Thunderbolt, and intra-rack interconnections in data centers. Our feasibility experiments have validated the principle. Copper coated glass fibers can, in principle, be manufactured, but in these tests, the conductors were capillaries internally coated with silver as these are easily obtainable, relatively inexpensive and serve to test the concept. The performance of these experimental twin lead cables corresponds to calculations, confirming the general principle. By calculation, we have compared the performance of cables made from copper-on-insulator conductors to that of similar cables made with solid copper conductors, and verified that copper-on-insulator cables have significantly less frequency dependent loss. We have also made and tested cables with copper on PEEK conductors as surrogates for copper on glass fiber.

  6. Design of force-cooled conductors for large fusion magnets

    International Nuclear Information System (INIS)

    Dresner, L.; Lue, J.W.

    1977-01-01

    One type of conductor under consideration for tokamak toroidal field (TF) magnets is a cable-in-conduit cooled by supercritical helium in forced convection. The main problem is designing such force-cooled conductors (fcc) is to maintain adequate stability while keeping the pumping power tolerably low. The transit time of the helium through a coil is many minutes. Since recovery of the conductor from a thermomechanical perturbation takes on the order of tens of milliseconds, for purposes of calculation, the inventory of helium available to promote recovery is finite. This means that a large enough perturbation will quench the conductor. We can then judge the stability of a fcc by the maximum perturbation of some specified type against which the conductor is stable, i.e., can still return to the superconducting state. The simplest type of perturbation is a sudden, uniform heat input over the entire length of the conductor. The maximum, sudden, uniform heat input per unit volume of metal ΔH is called the ''stability margin.''

  7. Ac-loss measurement of a DyBCO-Roebel assembled coated conductor cable (RACC)

    International Nuclear Information System (INIS)

    Schuller, S.; Goldacker, W.; Kling, A.; Krempasky, L.; Schmidt, C.

    2007-01-01

    Low ac-loss HTS cables for transport currents well above 1 kA are required for application in transformers and generators and are taken into consideration for future generations of fusion reactor coils. Coated conductors (CC) are suitable candidates for high field application at an operation temperature around 50-77 K, which is a crucial precondition for economical cooling costs. We prepared a short length of a Roebel bar cable made of industrial DyBCO coated conductor (Theva Company, Germany). Meander shaped tapes of 4 mm width with a twist pitch of 122 mm were cut from 10 mm wide CC tapes using a specially designed tool. Eleven of these strands were assembled to a cable. The electrical and mechanical connection of the tapes was achieved using a silver powder filled conductive epoxy resin. Ac-losses of a short sample in an external ac field were measured as a function of frequency and field amplitude in transverse and parallel field orientations. In addition, the coupling current time constant of the sample was directly measured

  8. Ac-loss measurement of a DyBCO-Roebel assembled coated conductor cable (RACC)

    Science.gov (United States)

    Schuller, S.; Goldacker, W.; Kling, A.; Krempasky, L.; Schmidt, C.

    2007-10-01

    Low ac-loss HTS cables for transport currents well above 1 kA are required for application in transformers and generators and are taken into consideration for future generations of fusion reactor coils. Coated conductors (CC) are suitable candidates for high field application at an operation temperature around 50-77 K, which is a crucial precondition for economical cooling costs. We prepared a short length of a Roebel bar cable made of industrial DyBCO coated conductor (Theva Company, Germany). Meander shaped tapes of 4 mm width with a twist pitch of 122 mm were cut from 10 mm wide CC tapes using a specially designed tool. Eleven of these strands were assembled to a cable. The electrical and mechanical connection of the tapes was achieved using a silver powder filled conductive epoxy resin. Ac-losses of a short sample in an external ac field were measured as a function of frequency and field amplitude in transverse and parallel field orientations. In addition, the coupling current time constant of the sample was directly measured.

  9. Mechanical performances of lead-free solder joint connections with applications in the aerospace domain

    Directory of Open Access Journals (Sweden)

    Georgiana PADURARU

    2016-03-01

    Full Text Available The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of solder joint in correlation with different pad finishes, there were made some mechanical determinations using a dedicated Share Test System. The theoretical model highlights the link between the experimental results and the influence of gravitational acceleration on the mechanical and functional integrity of the electronic assemblies that works in vibration environment. The paper novelty is provided by the interdisciplinary experiment that offers results that can be used in the mechanical, tribological, electronical and aerospace domains.

  10. A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing the equilib......An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing...

  11. A review of typical thermal fatigue failure models for solder joints of electronic components

    Science.gov (United States)

    Li, Xiaoyan; Sun, Ruifeng; Wang, Yongdong

    2017-09-01

    For electronic components, cyclic plastic strain makes it easier to accumulate fatigue damage than elastic strain. When the solder joints undertake thermal expansion or cold contraction, different thermal strain of the electronic component and its corresponding substrate is caused by the different coefficient of thermal expansion of the electronic component and its corresponding substrate, leading to the phenomenon of stress concentration. So repeatedly, cracks began to sprout and gradually extend [1]. In this paper, the typical thermal fatigue failure models of solder joints of electronic components are classified and the methods of obtaining the parameters in the model are summarized based on domestic and foreign literature research.

  12. Physics of Failure as a Basis for Solder Elements Reliability Assessment in Wind Turbines

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    description of the reliability. A physics of failure approach is applied. A SnAg solder component used in power electronics is used as an example. Crack propagation in the SnAg solder is modeled and a model to assess the accumulated plastic strain is proposed based on a physics of failure approach. Based...... on the proposed model it is described how to find the accumulated linear damage and reliability levels for a given temperature loading profile. Using structural reliability methods the reliability levels of the electrical components are assessed by introducing scale factors for stresses....

  13. Aging treatment characteristics of solder bump joint for high reliability optical module

    International Nuclear Information System (INIS)

    Kim, Kyung-Seob; Yu, Chung-Hee; Yang, Jun-Mo

    2004-01-01

    The joint strength and fracture surfaces of Sn-37 mass% Pb and Au stud bumps for photo diode packages after isothermal aging testing were studied experimentally. Al/Au stud bumps and Cu/Sn-37 mass% Pb solders were adopted, and aged for up to 900 h to analyze the effect of intermetallic compound (IMC). The joint strength decreased with aging time. The diffraction patterns of Cu 6 Sn 5 , scallop-shaped IMCs, and planar-shaped Cu 3 Sn were characterized using transmission electron microscopy (TEM). The formation of Kirkendall voids and the growth of IMCs at the solder were found to be a possible mechanism for joint strength reduction

  14. Nanostructured ionic conductors: A study of Vycor 7930-LiI composites

    International Nuclear Information System (INIS)

    Albert, Stephanie; Frolet, Nathalie; Yot, Pascal G.; Pradel, Annie; Ribes, Michel

    2008-01-01

    A series of three Vycor glass/LiI composites were prepared by impregnating molten LiI into a porous Vycor 7930 powdered glass. X-ray diffraction showed the presence of LiI and LiI, H 2 O crystallites of about 100 nm in size. Scanning electron microscopy confirmed that an optimisation of heat treatment could lead to a composite with optimal coating and filling of the pores of the matrix. An increase in the pore size, unavoidable and due to the residual water content of the Vycor, was measured by Hg porosimetry. Nevertheless the conductivity of the composites was increased compared to that of pure LiI, with a gain of two orders of magnitude for the best conductor, i.e. 0.5LiI-0.5Vycor

  15. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    Science.gov (United States)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. PMID:27877786

  16. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    International Nuclear Information System (INIS)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. (review)

  17. Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Wang Fengjiang [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States); O' Keefe, Matthew [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)], E-mail: mjokeefe@mst.edu; Brinkmeyer, Brandon [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)

    2009-05-27

    The effect of incorporating eutectic Sn-Pb solder with Sn-3.0Ag-0.5Cu (SAC) Pb-free solder on the microstructure and tensile properties of the mixed alloys was investigated. Alloys containing 100, 75, 50, 25, 20, 15, 10, 5 and 0 wt% SAC, with the balance being Sn-37Pb eutectic solder alloy, were prepared and characterized. Optical and scanning electron microscopy were used to analyze the microstructures while 'mini-tensile' test specimens were fabricated and tested to determine mechanical properties at the mm length scale, more closely matching that of the solder joints. Microstructural analysis indicated that a Pb-rich phase formed and was uniformly distributed at the boundary between the Sn-rich grains or between the Sn-rich and the intermetallic compounds in the solder. Tensile results showed that mixing of the alloys resulted in an increase in both the yield and the ultimate tensile strength compared to the original solders, with the 50% SAC-50% Sn-Pb mixture having the highest measured strength. Initial investigations indicate the formation and distribution of a Pb-rich phase in the mixed solder alloys as the source of the strengthening mechanism.

  18. Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

    Science.gov (United States)

    Hammad, A. E.; El-Taher, A. M.

    2014-11-01

    The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

  19. Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

    Science.gov (United States)

    Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R.

    2014-01-01

    A fracture mechanism map (FMM) is a powerful tool which correlates the fracture behavior of a material to its microstructural characteristics in an explicit and convenient way. In the FMM for solder joints, an effective thickness of the interfacial intermetallic compound (IMC) layer ( t eff) and the solder yield strength ( σ ys,eff) are used as abscissa and ordinate axes, respectively, as these two predominantly affect the fracture behavior of solder joints. Earlier, a definition of t eff, based on the uniform thickness of IMC ( t u) and the average height of the IMC scallops ( t s), was proposed and shown to aptly explain the fracture behavior of solder joints on Cu. This paper presents a more general definition of t eff that is more widely applicable to a range of metallizations, including Cu and electroless nickel immersion gold (ENIG). Using this new definition of t eff, mode I FMM for SAC387/Cu joints has been updated and its validity was confirmed. A preliminary FMM for SAC387/Cu joints with ENIG metallization is also presented.

  20. The thermodynamic database COST MP0602 for materials for high-temperature lead-free soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Dinsdale, A.; Watson, A.; Vřešťál, J.; Zemanová, Adéla; Brož, P.

    2012-01-01

    Roč. 48, č. 3 (2012), s. 339-346 ISSN 1450-5339 R&D Projects: GA MŠk LD11024 Institutional support: RVO:68081723 Keywords : CALPHAD method * lead-free solders * thermodynamic database Subject RIV: BJ - Thermodynamics Impact factor: 1.435, year: 2012

  1. Circuit reliability boosted by soldering pins of disconnect plugs to sockets

    Science.gov (United States)

    Pierce, W. B.

    1964-01-01

    Where disconnect pins must be used for wiring and testing a circuit, improved system reliability is obtained by making a permanent joint between pins and sockets of the disconnect plug. After the circuit has been tested, contact points may be fused through soldering, brazing, or welding.

  2. Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

    Energy Technology Data Exchange (ETDEWEB)

    Hamm, Randy; Peterson, Kenneth A.

    2015-10-01

    This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.

  3. Fatigue damage modeling in solder interconnects using a cohesive zone approach

    NARCIS (Netherlands)

    Abdul-Baqi, A.J.J.; Schreurs, P.J.G.; Geers, M.G.D.

    2005-01-01

    The objective of this work is to model the fatigue damage process in a solder bump subjected to cyclic loading conditions. Fatigue damage is simulated using the cohesive zone methodology. Damage is assumed to occur at interfaces modeled through cohesive zones in the material, while the bulk material

  4. Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy

    Directory of Open Access Journals (Sweden)

    Abdoul-Aziz Bogno

    2015-01-01

    Full Text Available The properties and performance of lead-free solder alloys such as fluidity and wettability are defined by the alloy composition and solidification microstructure. Rapid solidification of metallic alloys is known to result in refined microstructures with reduced microsegregation and improved mechanical properties of the final products as compared to normal castings. The rapidly solidified Sn-based solders by melt spinning were shown to be suitable for soldering with low temperature and short soldering duration. In the present study, rapidly solidified Sn–0.7 wt.%Cu droplets generated by impulse atomization (IA were achieved as well as directional solidification under transient conditions at lower cooling rate. This paper reports on a comparative study of the rapidly solidified and the directionally solidified samples. Different but complementary characterization techniques were used to fully analyze the solidification microstructures of the samples obtained under the two cooling regimes. These include X-ray diffractometry (XRD and scanning electron microscopy (SEM. In order to compare the tensile strength and elongation to fracture of the directionally solidified ingot and strip castings with the atomized droplet, compaction and extrusion of the latter were carried out. It was shown that more balanced and superior tensile mechanical properties are available for the hot extruded samples from compacted as-atomized Sn–0.7 wt.%Cu droplets. Further, elongation-to-fracture was 2–3× higher than that obtained for the directionally solidified samples.

  5. Development of high melting point, environmentally friendly solders, using the calphad approach

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2008-01-01

    An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Vario...... tension have also been considered. Special focus has been given to toxicity related issues since the main ideology of looking for an alternative to high lead containing solders is not related to technical issues but due to environmental concerns.......An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Various...... of promising solder alloy candidates. The ternary combinations that satisfied the primary solidification requirement were scrutinized taking into account the commercial interests i.e. availability, cost-effectiveness, recyclability and toxicity issues. Technical issues like manufacturability and surface...

  6. Electrochemical migration of lead-free solder alloys in Na2SO4 environment

    DEFF Research Database (Denmark)

    Medgyes, Balint; Ádám, Sándor; Tar, Lajos

    2017-01-01

    The effect of sulphate ion concentration on electrochemical migration of lead-free solder alloys was investigated with the use of water drop tests, by applying an in-situ optical and electrical inspection system. According to the Mean-Time-To-Failure (MTTF) values it was found that in the case of...

  7. Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

    Directory of Open Access Journals (Sweden)

    Shoudong Gu

    2016-06-01

    Full Text Available To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 μm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within ±3%.

  8. Characterizing performances of solder paste printing process at flexible manufacturing lines

    International Nuclear Information System (INIS)

    Siew, Jit Ping; Low, Heng Chin; Teoh, Ping Chow

    2015-01-01

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter

  9. Characterizing performances of solder paste printing process at flexible manufacturing lines

    Energy Technology Data Exchange (ETDEWEB)

    Siew, Jit Ping; Low, Heng Chin [University of Science Malaysia, 11800 Minden, Penang (Malaysia); Teoh, Ping Chow [Wawasan Open University, 54 Jalan Sultan Ahmad Shah, 10050 Penang (Malaysia)

    2015-02-03

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.

  10. Gas-filled hohlraum fabrication

    International Nuclear Information System (INIS)

    Salazar, M.A.; Gobby, P.L.; Foreman, L.R.; Bush, H. Jr.; Gomez, V.M.; Moore, J.E.; Stone, G.F.

    1995-01-01

    Los Alamos National Laboratory (LANL) researchers have fabricated and fielded gas-filled hohlraums at the Lawrence Livermore National Laboratory (LLNL) Nova laser. Fill pressures of 1--5 atmospheres have been typical. We describe the production of the parts, their assembly and fielding. Emphasis is placed on the production of gas-tight polyimide windows and the fielding apparatus and procedure

  11. Texture development of HTS powder-in-tube conductors

    Energy Technology Data Exchange (ETDEWEB)

    Glowacki, B A [IRC in Superconductivity, University of Cambridge, Cambridge (United Kingdom); Department of Materials Science and Metallurgy, University of Cambridge, Cambridge (United Kingdom)

    1998-10-01

    An overview of the fabrication and electromagnetic properties of high-temperature conductors processed by the powder-in-tube (PIT) technique with reference to texture development and critical anisotropy data is presented. Special emphasis is given to the optimization of the physicochemical and electromagnetic parameters of the multifilamentary and single-filament conductors with superconducting cores of Bi-2223, Tl-1223 and Y-123 superconducting phases. The influence of the multifilamentary and single-filament structures on texture development is discussed. Also, the importance of the local disturbances of the grain alignment and microdefects for the current distribution across and in the plane of the whole conductor is analysed. A comparative study of the critical current anisotropy with field direction in low magnetic fields of Tl-1223 and Bi-2223 conductors manufactured by the PIT technique is presented. For Tl-1223 PIT conductors the anisotropy coefficient shows a very pronounced minimum, followed by a monotonic reduction of anisotropy with the increase of the magnetic field. This is explained in terms of poor grain alignment with weak intergranular superconducting coupling which cause 3D current percolation and also by the demagnetizing effect of the grains and the ceramic core in the PIT Tl-1223 tapes. (author)

  12. Fabrication and tests of EF conductors for JT-60SA

    Energy Technology Data Exchange (ETDEWEB)

    Kizu, Kaname, E-mail: kizu.kaname@jaea.go.jp [Japan Atomic Energy Agency, Naka, Ibaraki 311-0193 (Japan); Kashiwa, Yoshitoshi; Murakami, Haruyuki [Japan Atomic Energy Agency, Naka, Ibaraki 311-0193 (Japan); Obana, Tetsuhiro; Takahata, Kazuya [National Institute for Fusion Science, Toki, Gifu 509-5292 (Japan); Tsuchiya, Katsuhiko; Yoshida, Kiyoshi [Japan Atomic Energy Agency, Naka, Ibaraki 311-0193 (Japan); Hamaguchi, Shinji [National Institute for Fusion Science, Toki, Gifu 509-5292 (Japan); Matsui, Kunihiro [Japan Atomic Energy Agency, Naka, Ibaraki 311-0193 (Japan); Nakamura, Kazuya; Takao, Tomoaki [Sophia University, Tokyo 102-8554 (Japan); Yanagi, Nagato; Imagawa, Shinsaku; Mito, Toshiyuki [National Institute for Fusion Science, Toki, Gifu 509-5292 (Japan)

    2011-10-15

    The conductors for plasma equilibrium field (EF) coils of JT-60SA are NbTi cable-in-conduit (CIC) conductor with stainless steel 316L jacket. The production of superconductors for actual EF coils started from February 2010. Nine superconductors with 444 m in length were produced up to July 2010. More than 300 welding of jackets were performed. Six nonconformities were found by inspections as go gauge, visual inspection and X-ray test. In order to shorten the manufacturing time schedule, helium leak test was conducted at once after connecting the long length jacket not just after the welding. The maximum force to pull the cable into jacket was about 7.6 kN on average. The mass flow rates of 9 conductors showed almost same values indicating that there are no blockages in the conductors. The measured current sharing temperature agreed with the expectation values from strand performance indicating that no degradation was caused by production process. The coupling time constants of conductors ranged from 80 to 90 ms which are much smaller than the design value of 200 ms.

  13. Use of ion conductors in the pyrochemical reduction of oxides

    International Nuclear Information System (INIS)

    Miller, W.E.; Tomczuk, Z.

    1994-01-01

    An electrochemical process and electrochemical cell for reducing a metal oxide are provided. First the oxide is separated as oxygen gas using, for example, a ZrO 2 oxygen ion conductor anode and the metal ions from the reduction salt are reduced and deposited on an ion conductor cathode, for example, sodium ion reduced on a β-alumina sodium ion conductor cathode. The generation of and separation of oxygen gas avoids the problem with chemical back reaction of oxygen with active metals in the cell. The method also is characterized by a sequence of two steps where an inert cathode electrode is inserted into the electrochemical cell in the second step and the metallic component in the ion conductor is then used as the anode to cause electrochemical reduction of the metal ions formed in the first step from the metal oxide where oxygen gas formed at the anode. The use of ion conductors serves to isolate the active components from chemically reacting with certain chemicals in the cell. While applicable to a variety of metal oxides, the invention has special importance for reducing CaO to Ca o used for reducing UO 2 and PuO 2 to U and Pu. 2 figures

  14. Hearing status among Norwegian train drivers and train conductors.

    Science.gov (United States)

    Lie, A; Skogstad, M; Johnsen, T S; Engdahl, B; Tambs, K

    2013-12-01

    There is a general perception that train drivers and conductors may be at increased risk of developing noise-induced hearing loss. To study job-related hearing loss among train drivers and train conductors. Audiograms from train drivers and train conductors were obtained from the medical records of the occupational health service of the major Norwegian railway company. The results were compared with audiograms from an internal control group of railway workers and an external reference group of people not occupationally exposed to noise. The monaural hearing threshold level at 4kHz, the mean binaural value at 3, 4 and 6kHz and the prevalence of audiometric notches (≥25 dB at 4kHz) were used for comparison. Audiograms were available for 1567 drivers, 1565 conductors, 4029 railway worker controls and 15 012 people not occupationally exposed to noise. No difference in hearing level or prevalence of audiometric notches was found between study groups after adjusting for age and gender. Norwegian train drivers and conductors have normal hearing threshold levels comparable with those in non-exposed groups.

  15. Design of force-cooled conductors for large fusion magnets

    Energy Technology Data Exchange (ETDEWEB)

    Dresner, L.; Lue, J.W.

    1977-01-01

    Conductors cooled by supercritical helium in forced convection are under active consideration for large toroidal fusion magnets. One of the central problems in designing such force cooled conductors is to maintain an adequate stability margin while keeping the pumping power tolerably low. A method has been developed for minimizing the pumping power for fixed stability by optimally choosing the matrix-to-superconductor and the metal-to-helium ratios. Such optimized conductors reduce pumping power requirements for fusion size magnets to acceptable limits. Furthermore, the mass flow and hence pumping losses can be varied through a magnet according to the local magnetic field and magnitude of desired stability margin. Force cooled conductors give flexibility in operation, permitting, for example, higher fields to be obtained than originally intended by lowering the bath temperature or increasing the pumping power or both. This flexibility is only available if the pumping power is low to begin with. Scaling laws for the pumping requirement and stability margin as functions of operating current density, number of strands and such physical parameters as stabilizer resistivity and critical current density, have been proved. Numerical examples will be given for design of conductors intended for use in large toroidal fusion magnet systems.

  16. Qualification tests for ITER TF conductors in SULTAN

    International Nuclear Information System (INIS)

    Bruzzone, P.; Stepanov, B.; Wesche, R.

    2009-01-01

    From February 2007 to May 2008, 18 short length conductor sections have been tested in SULTAN for design verification and manufacturer qualification of the ITER Toroidal Field (TF) conductor. The test program is focussed on the current sharing temperature, T cs , at the nominal operating conditions, 68 kA current and 11.15 T effective field, which can be fully reproduced in the SULTAN test facility. A broad range of results was observed, with over 2 K difference among the T cs of the conductors. In average, the results are poorer compared to the potential performance estimated from the strand scaling law. The key parameters to mitigate the degradation are not yet clearly identified. The experimental challenges to test conductors with performance degradation are highlighted, including enhanced instrumentation sets, the application of gas flow calorimetry to sense the current sharing power and the post-processing of voltage data to cancel the transverse potential across the cable. The updated schedule of the tests in SULTAN is presented with the short-term action plan for conductor test.

  17. Design of force-cooled conductors for large fusion magnets

    International Nuclear Information System (INIS)

    Dresner, L.; Lue, J.W.

    1977-01-01

    Conductors cooled by supercritical helium in forced convection are under active consideration for large toroidal fusion magnets. One of the central problems in designing such force cooled conductors is to maintain an adequate stability margin while keeping the pumping power tolerably low. A method has been developed for minimizing the pumping power for fixed stability by optimally choosing the matrix-to-superconductor and the metal-to-helium ratios. Such optimized conductors reduce pumping power requirements for fusion size magnets to acceptable limits. Furthermore, the mass flow and hence pumping losses can be varied through a magnet according to the local magnetic field and magnitude of desired stability margin. Force cooled conductors give flexibility in operation, permitting, for example, higher fields to be obtained than originally intended by lowering the bath temperature or increasing the pumping power or both. This flexibility is only available if the pumping power is low to begin with. Scaling laws for the pumping requirement and stability margin as functions of operating current density, number of strands and such physical parameters as stabilizer resistivity and critical current density, have been proved. Numerical examples will be given for design of conductors intended for use in large toroidal fusion magnet systems

  18. Hypospadias repair using laser tissue soldering (LTS): preliminary results of a prospective randomized study

    Science.gov (United States)

    Kirsch, Andrew J.; Cooper, Christopher S.; Canning, Douglas A.; Snyder, Howard M., III; Zderic, Stephen A.

    1998-07-01

    Purpose: The purpose of this study was to evaluate laser tissue soldering using an 808 nm diode laser and wavelength- matched human albumin solder for urethral surgery in children. Methods: Currently, 30 boys, ages 3 months to 8 years were randomized to standard suturing (n equals 22) or 'sutureless' laser hypospadias repair (n equals 18). Laser soldering was performed with a human albumin solder doped with indocyanine green dye (2.5 mg/ml) using a laser power output of 0.5 W, pulse duration of 0.5 sec, and interval of 0.1 sec. Power density was approximately 16 W/cm2. In the laser group, sutures were used for tissue alignment only. At the time of surgery, neourethral and penile lengths, operative time for urethral repair, and number of sutures/throws were measured. Postoperatively, patients were examined for complications of wound healing, stricture, or fistula formation. Results: Mean age, severity of urethral defect, type of repair, and neourethra length were equivalent between the two groups. Operative time was significantly faster for laser soldering in both simple (1.6 plus or minus 0.21 min, p less than 0.001) and complex (5.4 plus or minus 0.28 min, p less than 0.0001) hypospadias repairs compared to controls (10.6 plus or minus 1.4 min and 27.8 plus or minus 2.9 min, respectively). The mean number of sutures used in the laser group for simple and complex repairs (3.3 plus or minus 0.3 and 8.1 plus or minus 0.64, respectively) were significantly (p less than 0.0001) less than for controls (8.2 plus or minus 0.84 and 20 plus or minus 2.3, respectively). Followup was between 3 months and 14 months. The overall complication rate in the laser group (11%) was lower than the controls (23%). However, statistical significance (p less than 0.05) was achieved only for the subgroup of patients undergoing simple repairs (LTS, 100% success versus suturing, 69% success). Conclusions: These preliminary results indicate that laser tissue soldering for hypospadias repair

  19. Mechanics of filled carbon nanotubes

    KAUST Repository

    Monteiro, A.O.; Cachim, P.B.; Da Costa, Pedro M. F. J.

    2014-01-01

    The benefits of filling carbon nanotubes (CNTs) with assorted molecular and crystalline substances have been investigated for the past two decades. Amongst the study of new structural phases, defects, chemical reactions and varied types of host-guest interactions, there is one fundamental characterisation aspect of these systems that continues to be overlooked: the mechanical behaviour of filled CNTs. In contrast to their empty counterparts, the mechanics of filled CNTs is a subject where reports appear far and apart, this despite being key to the application of these materials in technological devices. In the following paragraphs, we review the work that has been carried out up to the present on the mechanics of filled CNTs. The studies discussed range from experimental resonant frequency essays performed within electron microscopes to modelling, via molecular dynamics, of three-point bending of nanotubes filled with gases. (C) 2014 Elsevier B.V. All rights reserved.

  20. Mechanics of filled carbon nanotubes

    KAUST Repository

    Monteiro, A.O.

    2014-04-01

    The benefits of filling carbon nanotubes (CNTs) with assorted molecular and crystalline substances have been investigated for the past two decades. Amongst the study of new structural phases, defects, chemical reactions and varied types of host-guest interactions, there is one fundamental characterisation aspect of these systems that continues to be overlooked: the mechanical behaviour of filled CNTs. In contrast to their empty counterparts, the mechanics of filled CNTs is a subject where reports appear far and apart, this despite being key to the application of these materials in technological devices. In the following paragraphs, we review the work that has been carried out up to the present on the mechanics of filled CNTs. The studies discussed range from experimental resonant frequency essays performed within electron microscopes to modelling, via molecular dynamics, of three-point bending of nanotubes filled with gases. (C) 2014 Elsevier B.V. All rights reserved.

  1. Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

    DEFF Research Database (Denmark)

    Conseil, Helene; Verdingovas, Vadimas; Jellesen, Morten Stendahl

    2016-01-01

    No-clean flux systems are used today for the soldering of electronic printed circuit board assemblies assuming that all the aggressive substances of the flux will vanish during the soldering process i.e. evaporate, decompose or being enclosed safely in the residues. However this is not true in most...... that the fluxes do not decompose fully within the temperature regime of the soldering process, leaving behind significant level of weak organic acid residues. The residue depending on the type and amount can be can be very aggressive towards the corrosion on the printed circuit board assemblies. The glutaric acid...

  2. Wiring assembly and method of forming a channel in a wiring assembly for receiving conductor and providing separate regions of conductor contact with the channel

    Energy Technology Data Exchange (ETDEWEB)

    Stelzer, Gerald; Meinke, Rainer; Senti, Mark

    2018-03-06

    A conductor assembly and method for constructing an assembly of the type which, when conducting current, generates a magnetic field or which, in the presence of a changing magnetic field, induces a voltage. In one embodiment the method provides a first insulative layer tubular in shape and including a surface along which a conductor segment may be positioned. A channel formed in the surface of the insulative layer defines a first conductor path and includes a surface of first contour in cross section along a first plane transverse to the conductor path. A segment of conductor having a surface of second contour in cross section is positioned at least partly in the channel and extends along the conductor path. Along the first plane, contact between the conductor surface of second contour and the channel surface of first contour includes at least two separate regions of contact.

  3. Laser solder welding of articular cartilage: tensile strength and chondrocyte viability.

    Science.gov (United States)

    Züger, B J; Ott, B; Mainil-Varlet, P; Schaffner, T; Clémence, J F; Weber, H P; Frenz, M

    2001-01-01

    The surgical treatment of full-thickness cartilage defects in the knee joint remains a therapeutic challenge. Recently, new techniques for articular cartilage transplantation, such as mosaicplasty, have become available for cartilage repair. The long-term success of these techniques, however, depends not only on the chondrocyte viability but also on a lateral integration of the implant. The goal of this study was to evaluate the feasibility of cartilage welding by using albumin solder that was dye-enhanced to allow coagulation with 808-nm laser diode irradiation. Conventional histology of light microscopy was compared with a viability staining to precisely determine the extent of thermal damage after laser welding. Indocyanine green (ICG) enhanced albumin solder (25% albumin, 0.5% HA, 0.1% ICG) was used for articular cartilage welding. For coagulation, the solder was irradiated through the cartilage implant by 808-nm laser light and the tensile strength of the weld was measured. Viability staining revealed a thermal damage of typically 500 m in depth at an irradiance of approximately 10 W/cm(2) for 8 seconds, whereas conventional histologies showed only half of the extent found by the viability test. Heat-bath investigations revealed a threshold temperature of minimum 54 degrees C for thermal damage of chondrocytes. Efficient cartilage bonding was obtained by using bovine albumin solder as adhesive. Maximum tensile strength of more than 10 N/cm(2) was achieved. Viability tests revealed that the thermal damage is much greater (up to twice) than expected after light microscopic characterization. This study shows the feasibility to strongly laser weld cartilage on cartilage by use of a dye-enhanced albumin solder. Possibilities to reduce the range of damage are suggested. Copyright 2001 Wiley-Liss, Inc.

  4. Fluxless flip-chip bonding using a lead-free solder bumping technique

    Science.gov (United States)

    Hansen, K.; Kousar, S.; Pitzl, D.; Arab, S.

    2017-09-01

    With the LHC exceeding the nominal instantaneous luminosity, the current barrel pixel detector (BPIX) of the CMS experiment at CERN will reach its performance limits and undergo significant radiation damage. In order to improve detector performance in high luminosity conditions, the entire BPIX is replaced with an upgraded version containing an additional detection layer. Half of the modules comprising this additional layer are produced at DESY using fluxless and lead-free bumping and bonding techniques. Sequential solder-jetting technique is utilized to wet 40-μm SAC305 solder spheres on the silicon-sensor pads with electroless Ni, Pd and immersion Au (ENEPIG) under-bump metallization (UBM). The bumped sensors are flip-chip assembled with readout chips (ROCs) and then reflowed using a flux-less bonding facility. The challenges for jetting low solder volume have been analyzed and will be presented in this paper. An average speed of 3.4 balls per second is obtained to jet about 67 thousand solder balls on a single chip. On average, 7 modules have been produced per week. The bump-bond quality is evaluated in terms of electrical and mechanical properties. The peak-bump resistance is about 17.5 mΩ. The cross-section study revealed different types of intermetallic compounds (IMC) as a result of interfacial reactions between UBM and solder material. The effect of crystalline phases on the mechanical properties of the joint is discussed. The mean shear strength per bump after the final module reflow is about 16 cN. The results and sources of yield loss of module production are reported. The achieved yield is 95%.

  5. Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

    Science.gov (United States)

    Coyle, Richard J.; Sweatman, Keith; Arfaei, Babak

    2015-09-01

    Thermal fatigue is a major source of failure of solder joints in surface mount electronic components and it is critically important in high reliability applications such as telecommunication, military, and aeronautics. The electronic packaging industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu alloys first established as replacements for eutectic SnPb. This paper discusses the results from Pb-free solder joint reliability programs sponsored by two industry consortia. The characteristic life in accelerated thermal cycling is reported for 12 different Pb-free solder alloys and a SnPb control in 9 different accelerated thermal cycling test profiles in terms of the effects of component type, accelerated thermal cycling profile and dwell time. Microstructural analysis on assembled and failed samples was performed to investigate the effect of initial microstructure and its evolution during accelerated thermal cycling test. A significant finding from the study is that the beneficial effect of Ag on accelerated thermal cycling reliability (measured by characteristic lifetime) diminishes as the severity of the accelerated thermal cycling, defined by greater ΔT, higher peak temperature, and longer dwell time increases. The results also indicate that all the Pb-free solders are more reliable in accelerated thermal cycling than the SnPb alloy they have replaced. Suggestions are made for future work, particularly with respect to the continued evolution of alloy development for emerging application requirements and the value of using advanced analytical methods to provide a better understanding of the effect of microstructure and its evolution on accelerated thermal cycling performance.

  6. Thermodynamic behaviour of a coated conductor for currents above Ic

    International Nuclear Information System (INIS)

    Schwarz, M; Schacherer, Chr; Weiss, K-P; Jung, A

    2008-01-01

    Coated conductors are becoming more and more applicable. The temperature range below the critical value (T c ) or below the critical current (I c ) is well characterized. But for applications such as fault current limiters, which take advantage of the superconducting-to-normal transition, characterization beyond the superconducting regime is mandatory. Therefore, this work studies the thermodynamic behaviour of a coated conductor immersed in boiling liquid nitrogen which is driven by a sinusoidal over-current of up to more than five times I c . The temperature of the coated conductor exceeds 720 K without any significant degradation. To validate this current-induced high-temperature region, the resistance of the composite tape is measured from T c to 600 K. A thermodynamic and electrical model is conceptualized for calculating the temperature, developing as a function of time during over-currents. The calculated temperature fits well with the measured temperature

  7. Benefits of current percolation in superconducting coated conductors

    International Nuclear Information System (INIS)

    Rutter, N.A.; Durrell, J.H.; Blamire, M.G.; MacManus-Driscoll, J.L.; Wang, H.; Foltyn, S.R.

    2005-01-01

    The critical currents of coated conductors fabricated by metal-organic deposition (MOD) on rolling-assisted biaxially textured substrates (RABiTS) and by pulsed laser deposition (PLD) on ion-beam assisted deposition (IBAD) templates have been measured as a function of magnetic field orientation and compared to films grown on single crystal substrates. By varying the orientation of magnetic field applied in the plane of the film, we are able to determine the extent to which current flow in each type of conductor is percolative. Standard MOD/RABiTS conductors have also been compared to samples whose grain boundaries have been doped by diffusing Ca from an overlayer. We find that undoped MOD/RABiTS tapes have a less anisotropic in-plane field dependence than PLD/IBAD tapes and that the uniformity of critical current as a function of in-plane field angle is greater for MOD/RABiTS samples doped with Ca

  8. Characterization of textile electrodes and conductors using standardized measurement setups

    International Nuclear Information System (INIS)

    Beckmann, L; Neuhaus, C; Medrano, G; Walter, M; Leonhardt, S; Jungbecker, N; Gries, T

    2010-01-01

    Textile electrodes and conductors are being developed and used in different monitoring scenarios, such as ECG or bioimpedance spectroscopy measurements. Compared to standard materials, conductive textile materials offer improved wearing comfort and enable long-term measurements. Unfortunately, the development and investigation of such materials often suffers from the non-reproducibility of the test scenarios. For example, the materials are generally tested on human skin which is difficult since the properties of human skin differ for each person and can change within hours. This study presents two test setups which offer reproducible measurement procedures for the systematic analysis of textile electrodes and conductors. The electrode test setup was designed with a special skin dummy which allows investigation of not only the electrical properties of textile electrodes but also the contact behavior between electrode and skin. Using both test setups, eight textile electrodes and five textile conductors were analyzed and compared

  9. Nb3Sn conductor development for the ITER magnets

    International Nuclear Information System (INIS)

    Mitchell, N.

    1997-01-01

    The ITER magnet system consists of Toroidal Field (TF) coils, Poloidal Field (PF) coils, the Central Solenoid (CS) and error field correction coils (CC). The conductors for the coils are Nb 3 Sn or NbTi cable in conduit type, forced flow cooled with supercritical helium having a maximum operating current in the range 40-60 kA. To qualify the Nb 3 Sn conductor, two large model coils (energy up to 640 MJ) are being wound by the Home Teams of the Parties to the ITER EDA Agreement. A total of 24 t of strand has been completed for the CS model coil and 4 t for the TF model coil, and fabricated into 7 km of conductor in unit lengths up to 210 m, by an international collaboration involving 12 companies in Europe, Japan, Russia and the USA

  10. Tension layer winding of cable-in-conduit conductor

    International Nuclear Information System (INIS)

    Devernoe, A.; Ciancetta, G.; King, M.; Parizh, M.; Painter, T.; Miller, J.

    1996-01-01

    A 710 mm i.d. by 440 mm long, 6 layer Cable-in-Conduit (CIC) coil was precision tension layer wound with Incoloy 908 jacketed conductor to model winding technology that will be used for the Nb 3 Sn outsert coils of the 45 Tesla Hybrid Magnet Project at the US National High Magnetic Field Laboratory. This paper reports on the set up of a new winding facility with unique capabilities for insulating and winding long length CIC conductor and on special procedures which were developed to wind and support layer to layer transitions and to safely form conductor into and out of the winding. Analytical methods used to predict conduit keystoning, springback and back tensioning requirements before winding are reported in comparison to results obtained during winding and actual winding build-up dimensions on a layer by layer basis in comparison to design requirements

  11. Radiopacity of root filling materials

    International Nuclear Information System (INIS)

    Beyer-Olsen, E.M.

    1983-01-01

    A method for measuring the radiopacity of root filling materials is described. Direct measurements were made of the optic density values of the materials in comparison with a standard curve relating optic density to the thickness of an aluminium step wedge exposed simultaneously. By proper selection of film and conditions for exposure and development, it was possible to obtain a near-linear standard curve which added to the safety and reproducibility of the method. The technique of radiographic assessment was modified from clinical procedures in evaluating the obturation in radiographs, and it was aimed at detecting slits or voids between the dental wall and the filling material. This radiographic assessment of potensial leakage was compared with actual in vitro lekage of dye (basic fuchsin) into the roots of filled teeth. The result of the investigation show that root filling materials display a very wide range of radiopacity, from less than 3 mm to more than 12 mm of aluminium. It also seem that tooth roots that appear to be well obturated by radiographic evaluation, stand a good chance of beeing resistant to leakage in vitro, and that the type of filling material rather than its radiographic appearance, determines the susceptibility of the filled tooth to leakage in vitro. As an appendix the report contains a survey of radiopaque additives in root filling materials

  12. Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock

    Science.gov (United States)

    Han, Jing; Tan, Shihai; Guo, Fu

    2018-01-01

    Ball grid array (BGA) samples were soldered on a printed circuit board with Sn37Pb solder paste to investigate the recrystallization induced by subgrain rotation during thermal shock. The composition of the solder balls was Sn3.0Ag0.5Cu-Sn37Pb, which comprised mixed solder joints. The BGA component was cross-sectioned before thermal shock. The microstructure and grain orientations were obtained by a scanning electron microscope equipped with an electron back-scattered diffraction system. Two mixed solder joints at corners of the BGA component were selected as the subjects. The results showed that recrystallization occurred at the corner of the solder joints after 200 thermal shock cycles. The recrystallized subgrains had various new grain orientations. The newly generated grain orientations were closely related to the initial grain orientations, which indicated that different subgrain rotation behaviors could occur in one mixed solder joint with the same initial grain orientation. When the misorientation angles were very small, the rotation axes were about Sn [100], [010] and [001], as shown by analyzing the misorientation angles and subgrain rotation axes, while the subgrain rotation behavior with large misorientation angles in the solder joints was much more complicated. As Pb was contained in the solder joints and the stress was concentrated on the corner of the mixed solder joints, concaves and cracks were formed. When the adjacent recrystallized subgrains were separated, and the process of the continuous recrystallization was limited.

  13. Thin film conductors for self-equalizing cables

    Directory of Open Access Journals (Sweden)

    G. Owen

    2017-10-01

    Full Text Available Self-equalizing cables using hollow conductors with wall thickness less than the skin depth were proposed in 1929. However, they do not appear ever to have been widely used, although the idea has resurfaced and been refined from time to time. In the early 2000’s, self-equalizing conductors consisting of solid magnetic steel cores coated with silver were developed by W.L. Gore, and used in their 2.5 Gb/s “Eye-Opener” cables, although higher speed versions never appeared. We have revived the original 1929 idea, proposing to use glass as a solid insulating core. This technology can potentially work at frequencies of many 10’s of GHz. Possible uses include short range GHz links such as USB and Thunderbolt, and intra-rack interconnections in data centers. Our feasibility experiments have validated the principle. Copper coated glass fibers can, in principle, be manufactured, but in these tests, the conductors were capillaries internally coated with silver as these are easily obtainable, relatively inexpensive and serve to test the concept. The performance of these experimental twin lead cables corresponds to calculations, confirming the general principle. By calculation, we have compared the performance of cables made from copper-on-insulator conductors to that of similar cables made with solid copper conductors, and verified that copper-on-insulator cables have significantly less frequency dependent loss. We have also made and tested cables with copper on PEEK conductors as surrogates for copper on glass fiber.

  14. The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

    Science.gov (United States)

    Jang, Guh-Yaw; Duh, Jenq-Gong

    2005-01-01

    The eutectic Sn-Ag solder alloy is one of the candidates for the Pb-free solder, and Sn-Pb solder alloys are still widely used in today’s electronic packages. In this tudy, the interfacial reaction in the eutectic Sn-Ag and Sn-Pb solder joints was investigated with an assembly of a solder/Ni/Cu/Ti/Si3N4/Si multilayer structures. In the Sn-3.5Ag solder joints reflowed at 260°C, only the (Ni1-x,Cux)3Sn4 intermetallic compound (IMC) formed at the solder/Ni interface. For the Sn-37Pb solder reflowed at 225°C for one to ten cycles, only the (Ni1-x,Cux)3Sn4 IMC formed between the solder and the Ni/Cu under-bump metallization (UBM). Nevertheless, the (Cu1-y,Niy)6Sn5 IMC was observed in joints reflowed at 245°C after five cycles and at 265°C after three cycles. With the aid of microstructure evolution, quantitative analysis, and elemental distribution between the solder and Ni/Cu UBM, it was revealed that Cu content in the solder near the solder/IMC interface played an important role in the formation of the (Cu1-y,Niy)6Sn5 IMC. In addition, the diffusion behavior of Cu in eutectic Sn-Ag and Sn-Pb solders with the Ni/Cu UBM were probed and discussed. The atomic flux of Cu diffused through Ni was evaluated by detailed quantitative analysis in an electron probe microanalyzer (EPMA). During reflow, the atomic flux of Cu was on the order of 1016-1017 atoms/cm2sec in both the eutectic Sn-Ag and Sn-Pb systems.

  15. Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

    International Nuclear Information System (INIS)

    Zhang, Liang; Han, Ji-guang; Guo, Yong-huan; He, Cheng-wen

    2014-01-01

    With the addition of 0.03 wt% rare earth Ce, in our previous works, the properties of SnAgCu solder were enhanced obviously. Based on the Garofalo–Arrhenius creep constitutive model, finite element method was used to simulate the stress–strain response during thermal cycle loading, and combined with the fatigue life prediction models, the fatigue life of SnAgCu/SnAgCuCe solder joints was calculated respectively, which can demonstrate the effect of the rare earth Ce on the fatigue life of SnAgCu solder joints. The results indicated that the maximum stress–strain can be found on the top surface of the corner solder joint, and the warpage of the PCB substrate occurred during thermal cycle loading. The trends obtained from modeling results have a good agreement with the experimental data reported in the literature for WLCSP devices. In addition, the stress–strain of SnAgCuCe solder joints is lower than that of SnAgCu solder joints. The thermal fatigue lives of solder joints calculated based on the creep model and creep strain energy density model show that the fatigue life of SnAgCuCe solder joints is higher than the SnAgCu solder joints. The fatigue life of SnAgCuCe solder joints can be enhanced significantly with the addition of Ce, is 30.2% higher than that of SnAgCu solder joints, which can be attributed to the CeSn 3 particles formed resisting the motion of dislocation; moreover, the refinement of microstructure and the IMC sizes also contribute to the enhancement of fatigue life, which elucidates that SnAgCuCe solder can be utilized in electronic industry with high reliability replacing the SnAgCu solder

  16. Improvement of SOFC electrodes using mixed ionic-electronic conductors

    Energy Technology Data Exchange (ETDEWEB)

    Matsuzaki, Y.; Hishinuma, M. [Tokyo Gas Co., Ltd. (Japan)

    1996-12-31

    Since the electrode reaction of SOFC is limited to the proximity of a triple phase boundary (TPB), the local current density at the electrode and electrolyte interface is larger than mean current density, which causes large ohmic and electrode polarization. This paper describes an application of mixed ionic-electronic conductors to reduce such polarization by means of (1) enhancing ionic conductivity of the electrolyte surface layer by coating a high ionic conductors, and (2) reducing the local current density by increasing the electrochemically active sites.

  17. Thin film conductors for self-equalizing cables

    OpenAIRE

    G. Owen; W. R. Trutna; T. J. Orsley; F. Lucia; C. B. Daly

    2017-01-01

    Self-equalizing cables using hollow conductors with wall thickness less than the skin depth were proposed in 1929. However, they do not appear ever to have been widely used, although the idea has resurfaced and been refined from time to time. In the early 2000’s, self-equalizing conductors consisting of solid magnetic steel cores coated with silver were developed by W.L. Gore, and used in their 2.5 Gb/s “Eye-Opener” cables, although higher speed versions never appeared. We have revived the or...

  18. Improvement in the heat transfer of a gas filled thermal switch

    International Nuclear Information System (INIS)

    Yamamoto, J.

    1984-01-01

    This chapter attempts to clarify the heat transfer mechanism of a gas filled stainless steel tube, and shows how the maximum heat transfer rate is determined under various filling pressures. The thermal switch is a convenient device for a thermal link between the cold heat of a cryocooler and a magnet dewar, because the switch acts as an active thermal conductor at the precooling stage and as an insulator after collecting liquid helium in the dewar. Topics considered include the switch structure, the heat transfer process, the delay of condensation, and the precooling stage and switching. It is determined that the heat transfer mechanism of the gas filled switch is due to normal nucleate boiling at the bottom and condensation on the upper cone. The higher the initial pressure, the larger the maximum heat flow obtained. Evaporation and condensation surfaces play an important role in the heat transfer rate

  19. The Effect of Reflow on Wettability of Sn 96.5 Ag 3 Cu 0.5 Solder

    Directory of Open Access Journals (Sweden)

    Zoltán Weltsch

    2012-11-01

    Full Text Available Surface conditions on Printed Circuit Board (PCB final finishes have an important impact on the wetting behaviour with lead-free solder. The improvement of wettability in liquid Sn 96.5 Ag 3 Cu 0.5 Solder alloy on PCB substrate was measured with a sessile drop method at 523 K temperature. Wetting properties was determined in normal atmospheric air and inert atmosphere. The wetting angles increasing with the number of reflows both atmosphere. The effect of the atmosphere has a huge importance of the oxidation which manifests itself of the measured wetting angles. One of the most important factors to the wetting properties is the amount of oxygen in the soldering atmosphere. Using the inert atmosphere is crucial to Pb-free solders, particularly after reflows.

  20. 33 CFR 183.435 - Conductors in circuits of 50 volts or more.

    Science.gov (United States)

    2010-07-01

    ... HOMELAND SECURITY (CONTINUED) BOATING SAFETY BOATS AND ASSOCIATED EQUIPMENT Electrical Systems Manufacturer... more. (c) This section does not apply to communication systems; electronic navigation equipment; resistance conductors that control circuit amperage; conductors in secondary circuits of ignition systems...

  1. Cognitive and collaborative demands of freight conductor activities: results and implications of a cognitive task analysis

    Science.gov (United States)

    2012-07-31

    This report presents the results of a cognitive task analysis (CTA) that examined the cognitive and collaborative demands placed on conductors, as well as the knowledge and skills that experienced conductors have developed that enable them to operate...

  2. Design of a Wireless Sensor Module for Monitoring Conductor Galloping of Transmission Lines.

    Science.gov (United States)

    Huang, Xinbo; Zhao, Long; Chen, Guimin

    2016-10-09

    Conductor galloping may cause flashovers and even tower collapses. The available conductor galloping monitoring methods often employ acceleration sensors to measure the conductor translations without considering the conductor twist. In this paper, a new sensor for monitoring conductor galloping of transmission lines based on an inertial measurement unit and wireless communication is proposed. An inertial measurement unit is used for collecting the accelerations and angular rates of a conductor, which are further transformed into the corresponding geographic coordinate frame using a quaternion transformation to reconstruct the galloping of the conductor. Both the hardware design and the software design are described in details. The corresponding test platforms are established, and the experiments show the feasibility and accuracy of the proposed monitoring sensor. The field operation of the proposed sensor in a conductor spanning 734 m also shows its effectiveness.

  3. Removal of root filling materials.

    LENUS (Irish Health Repository)

    Duncan, H.F. Chong, B.S.

    2011-05-01

    Safe, successful and effective removal of root filling materials is an integral component of non-surgical root canal re-treatment. Access to the root canal system must be achieved in order to negotiate to the canal terminus so that deficiencies in the original treatment can be rectified. Since a range of materials have been advocated for filling root canals, different techniques are required for their removal. The management of commonly encountered root filling materials during non-surgical re-treatment, including the clinical procedures necessary for removal and the associated risks, are reviewed. As gutta-percha is the most widely used and accepted root filling material, there is a greater emphasis on its removal in this review.

  4. Better building of valley fills

    Energy Technology Data Exchange (ETDEWEB)

    Chironis, N.P.

    1980-03-01

    Current US regulations for building valley fills or head of hollow fills to hold excess spoil resulting from contour mining are meeting with considerable opposition, particularly from operators in steep-slope areas. An alternative method has been submitted to the Office of Surface Mining by Virgina. Known as the zoned concept method, it has already been used successfully in building water-holding dams and coal refuse embankments on sloping terrain. The ways in which drainage and seepage are managed are described.

  5. Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

    OpenAIRE

    Koo, Ja-Myeong; Jung, Seung-Boo

    2007-01-01

    Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920); International audience; Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafte...

  6. Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

    International Nuclear Information System (INIS)

    Koo, Jahyun; Lee, Changsoo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck Mo

    2015-01-01

    It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu_3_3Al_1_7, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu_6Sn_5 networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu_6Sn_5 IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu_3_3Al_1_7 IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

  7. A FPGA implementation of solder paste deposit on printed circuit boards errors detector based in a bright and contrast algorithm

    OpenAIRE

    De Luca-Pennacchia, A.; Sánchez-Martínez, M. Á.

    2007-01-01

    Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be ...

  8. Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

    Energy Technology Data Exchange (ETDEWEB)

    Koo, Jahyun; Lee, Changsoo [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of); Hong, Sung Jea [MK Electron Co., Ltd., Yongin Cheoin-gu 316-2 (Korea, Republic of); Kim, Keun-Soo, E-mail: keunsookim@hoseo.edu [Department of Display Engineering, Hoseo University, Asan 336-795 (Korea, Republic of); Lee, Hyuck Mo, E-mail: hmlee@kaist.ac.kr [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of)

    2015-11-25

    It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu{sub 33}Al{sub 17}, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu{sub 6}Sn{sub 5} networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu{sub 6}Sn{sub 5} IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu{sub 33}Al{sub 17} IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

  9. Mechanism of Superconductivity in Quasi-Two-Dimensional Organic Conductor β-(BDA-TTP) Salts

    Science.gov (United States)

    Nonoyama, Yoshito; Maekawa, Yukiko; Kobayashi, Akito; Suzumura, Yoshikazu; Ito, Hiroshi

    2008-09-01

    We investigate theoretically the superconductivity of two-dimensional organic conductors, β-(BDA-TTP)2SbF6 and β-(BDA-TTP)2AsF6, to understand the role of the spin and charge fluctuations. The transition temperature is estimated by applying random phase approximation to an extended Hubbard model wherein realistic transfer energies are estimated by extended Hückel calculation. We find a gapless superconducting state with a dxy-like symmetry, which is consistent with the experimental results obtained by specific heat and scanning tunneling microscope. In the present model with an effectively half-filled triangular lattice, spin fluctuation competes with charge fluctuation as a mechanism of pairing interaction since both fluctuations have the same characteristic momentum q=(π,0) for V being smaller than U. This is in contrast to a model with a quarter-filled square lattice, wherein both fluctuations contribute cooperatively to pairing interaction due to fluctuations having different characteristic momenta. The resultant difference in the superconductivity of these two materials is also discussed.

  10. THE POSSIBILITY OF USING LASER-ULTRASOUND TO MONITOR THE QUALITY SOLDERED CONNECTIONS CHAMBERS OF LIQUID ROCKET ENGINES

    Directory of Open Access Journals (Sweden)

    N. V. Astredinova

    2014-01-01

    Full Text Available During the manufacturing process to the design of modern liquid rocket engines are presented important requirements, such as minimum weight, maximum stiffness and strength of nodes, maximum service life in operation, high reliability and quality of soldered and welded seams. Due to the high quality requirements soldered connections and the specific design of the nozzle, it became necessary in the development and testing of a new non-conventional non-destructive testing method – laser-ultrasound diagnosis. In accordance with regulatory guidelines, quality control soldered connections is allowed to use an acoustic kind of control methods of the reflected light, transmitted light, resonant, free vibration and acoustic emission. Attempts to use traditional methods of non-destructive testing did not lead to positive results. This is due primarily to the size of typical solder joint defects, as well as the structural features of the rocket engine, the data structure is not controllable. In connection with this, a new method that provides quality control soldered connections cameras LRE based on the thermo generation of ultrasound. Methods of ultrasonic flaw detection of photoacoustic effect, in most cases, have a number of advantages over methods that use standard (traditional piezo transducers. In the course of studies have found that the sensitivity of the laser-ultrasonic method and flaw detector UDL-2M can detect lack of adhesion in the solder joints on the upper edges of the nozzle in the sub-header area of the site.

  11. Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

    Directory of Open Access Journals (Sweden)

    Soares D.

    2007-01-01

    Full Text Available Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layers. The effect of the addition of P, at low levels, on the chemical composition of the layers present at the interface was studied. The phases formed at the interface between the Cu or Ni substrate and a molten lead-free solder at 250ºC, were studied for different stage times and alloy compositions. The melting temperatures, of the studied alloys, were determined by Differential Scanning Calorimetry (DSC. Identification of equilibrium phases formed at the interface layer, and the evaluation of their chemical composition were performed by Scanning Electron Microscopy (SEM/EDS. Different interface characteristics were obtained, namely for the alloys containing Zn. The obtained IML layer thickness was compared, for both types of alloy systems.

  12. Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

    International Nuclear Information System (INIS)

    Yang, Ming; Ko, Yong-Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu

    2017-01-01

    Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

  13. Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Ming [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Ko, Yong-Ho [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Bang, Junghwan [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Kim, Taek-Soo [Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Lee, Chang-Woo, E-mail: cwlee@kitech.re.kr [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Li, Mingyu, E-mail: myli@hit.edu.cn [Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055 (China)

    2017-02-15

    Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

  14. Conductor Temperature Estimation and Prediction at Thermal Transient State in Dynamic Line Rating Application

    DEFF Research Database (Denmark)

    Alvarez, David L.; Silva, Filipe Miguel Faria da; Mombello, Enrique Esteban

    2018-01-01

    . This paper presents an algorithm to estimate and predict the temperature in overhead line conductors using an Extended Kalman Filter. The proposed algorithm assumes both actual weather and current intensity flowing along the conductor as control variables. The temperature of the conductor, mechanical tension...

  15. Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows

    Science.gov (United States)

    Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

    2016-12-01

    Controlling the size, dispersion, and stability of intermetallic compounds in lead-free solder alloys is vital to creating reliable solder joints regardless of how many times the solder joints are melted and resolidified (reflowed) during circuit board assembly. In this article, the coarsening behavior of Cu x Al y and Cu6Sn5 in two Sn-Cu-Al alloys, a Sn-2.59Cu-0.43Al at. pct alloy produced via drip atomization and a Sn-5.39Cu-1.69Al at. pct alloy produced via melt spinning at a 5-m/s wheel speed, was characterized after multiple (1-5) reflow cycles via differential scanning calorimetry between the temperatures of 293 K and 523 K (20 °C and 250 °C). Little-to-no coarsening of the Cu x Al y particles was observed for either composition; however, clustering of Cu x Al y particles was observed. For Cu6Sn5 particle growth, a bimodal size distribution was observed for the drip atomized alloy, with large, faceted growth of Cu6Sn5 observed, while in the melt spun alloy, Cu6Sn5 particles displayed no significant increase in the average particle size, with irregularly shaped, nonfaceted Cu6Sn5 particles observed after reflow, which is consistent with shapes observed in the as-solidified alloys. The link between original alloy composition, reflow undercooling, and subsequent intermetallic coarsening behavior was discussed by using calculated solidification paths. The reflowed microstructures suggested that the heteroepitaxial relationship previously observed between the Cu x Al y and the Cu6Sn5 was maintained for both alloys.

  16. Violence Against Drivers and Conductors in the Road Passenger ...

    African Journals Online (AJOL)

    This cross-sectional study examined the extent, nature and risk factors of workplace violence in the road passenger transport sector in Maputo, the capital city of Mozambique. A random sample of 504 participants was selected from a population of 2 618 registered bus, minibus, and taxi drivers/conductors. The results ...

  17. Intermediate Temperature Proton Conductors – Why and How

    DEFF Research Database (Denmark)

    Li, Qingfeng; Aili, David; Jensen, Jens Oluf

    represented by early fundamental material research for ionic electrolytes. Such materials, most likely based on proton conductors, are expected to bring a new generation of the technologies: fuel cells by direct oxidation or internal splitting of biofuels such as methanol and ethanol, as well as efficient...

  18. Comparative characterization of Cu–Ni substrates for coated conductors

    DEFF Research Database (Denmark)

    Tian, H.; Suo, H.L.; Wulff, Anders Christian

    2014-01-01

    Three Cu100xNix alloys, with x = 23, 33 and 45 at.%Ni, have been evaluated for use as substrates for coated conductors on the basis of measurements of their microstructure, crystallographic texture and hardness. It is found that high-temperature annealing after heavy rolling generates strong cube...

  19. Temporal interaction between an artificial orchestra conductor and human musicians

    NARCIS (Netherlands)

    Reidsma, Dennis; Nijholt, Antinus; Bos, Pieter

    2008-01-01

    The Virtual Conductor project concerns the development of the first properly interactive virtual orchestra conductor—a Virtual Human that can conduct a piece of music through interaction with musicians, leading and following them while they are playing. This article describes our motivation for

  20. Conductor and Ensemble Performance Expressivity and State Festival Ratings

    Science.gov (United States)

    Price, Harry E.; Chang, E. Christina

    2005-01-01

    This study is the second in a series examining the relationship between conducting and ensemble performance. The purpose was to further examine the associations among conductor, ensemble performance expressivity, and festival ratings. Participants were asked to rate the expressivity of video-only conducting and parallel audio-only excerpts from a…

  1. An Organic Mixed Ion-Electron Conductor for Power Electronics

    DEFF Research Database (Denmark)

    Malti, Abdellah; Edberg, Jesper; Granberg, Hjalmar

    2016-01-01

    A mixed ionic–electronic conductor based on nanofibrillated cellulose composited with poly(3,4-ethylene-dioxythio­phene):­poly(styrene-sulfonate) along with high boiling point solvents is demonstrated in bulky electrochemical devices. The high electronic and ionic conductivities of the resulting...

  2. An Organic Mixed Ion–Electron Conductor for Power Electronics

    DEFF Research Database (Denmark)

    Malti, Abdellah; Edberg, Jesper; Granberg, Hjalmar

    2016-01-01

    A mixed ionic–electronic conductor based on nanofibrillated cellulose composited with poly(3,4-ethylene-dioxythio­phene):­poly(styrene-sulfonate) along with high boiling point solvents is demonstrated in bulky electrochemical devices. The high electronic and ionic conductivities of the resulting...

  3. Structural analysis of the NET toroidal field coils and conductor

    International Nuclear Information System (INIS)

    Mitchell, N.; Collier, D.; Gori, R.

    1989-01-01

    The NET toroidal field coils will utilise A15-type superconductor at 4.2 K to generate fields up to 11.5 T. The superconductor strands themselves are sensitive to strain, which causes degradation of their current carrying capacity, and thus the detailed behaviour of the coil conductor must be analysied so that the strian can be minimised. This analysis must include the manufacturing processes of the conductor as well as the normal and abnormal loperational loads. The conductor will be insulated and bonded by glass fibre reinforced epoxy resin, with limited bonding shear strength, and the overall support of the complete coil system must be designed to reduce these shear stresses. The coils will be subjected to pulse loads form the poloidal field coils, and analysis of the slip between the various coil components, such as conductors and the coil case, giving rise to frictional heating and possible loss of superconducting properties is another important factor, which has been investigated by a number of stress analyses. The manufacturing, thermal and normal magnetic loads on the coils and the analysis leading to the proposed structural design are described. In addition to the normal operating conditions, there is a range of abnormal load conditions which could result from electrical or mechanical faults on the coils. The effect of these potential faults has been analysed and the coil design modified to prevent catastrophic structural failure. (author). 13 refs.; 8 figs.; 1 tab

  4. H/D isotope effects in high temperature proton conductors

    DEFF Research Database (Denmark)

    Bonanos, Nikolaos; Huijser, A.; Poulsen, Finn Willy

    2015-01-01

    The atomic mass ratio of ca. 2 between deuterium and hydrogen is the highest for any pair of stable isotopes and results in significant and measurable H/D isotope effects in high temperature proton conductors containing these species. This paper discusses H/D isotope effects manifested in O-H/O-D...

  5. Non-equilibrium and band tailing in organic conductors

    Indian Academy of Sciences (India)

    . Non-equilibrium ... Introduction. Study of organic conductors and semiconductors continues to generate interest with the ... Band tailing reduces band gap or the acti- ..... (9), we can identify Eg(0) with the focal point and is proportional to P2. 1 .

  6. The electric field of a current-carrying conductor

    International Nuclear Information System (INIS)

    Strel'tsov, V.N.

    1991-01-01

    A subject concerning the relativistic invariance of the Gauss theorem has been discussed. The appearance of the electric field around the neutral conductor after excitation of current in it doesn't signify the change of its charge. 8 refs.; 1 fig

  7. Attentional flexibility and memory capacity in conductors and pianists.

    Science.gov (United States)

    Wöllner, Clemens; Halpern, Andrea R

    2016-01-01

    Individuals with high working memory (WM) capacity also tend to have better selective and divided attention. Although both capacities are essential for skilled performance in many areas, evidence for potential training and expertise effects is scarce. We investigated the attentional flexibility of musical conductors by comparing them to equivalently trained pianists. Conductors must focus their attention both on individual instruments and on larger sections of different instruments. We studied students and professionals in both domains to assess the contributions of age and training to these skills. Participants completed WM span tests for auditory and visual (notated) pitches and timing durations, as well as long-term memory tests. In three dichotic attention tasks, they were asked to detect small pitch and timing deviations from two melodic streams presented in baseline (separate streams), selective-attention (concentrating on only one stream), and divided-attention (concentrating on targets in both streams simultaneously) conditions. Conductors were better than pianists in detecting timing deviations in divided attention, and experts detected more targets than students. We found no group differences for WM capacity or for pitch deviations in the attention tasks, even after controlling for the older age of the experts. Musicians' WM spans across multimodal conditions were positively related to selective and divided attention. High-WM participants also had shorter reaction times in selective attention. Taken together, conductors showed higher attentional flexibility in successfully switching between different foci of attention.

  8. Effect of annular secondary conductor in a linear electromagnetic ...

    Indian Academy of Sciences (India)

    This paper presents the variation of average axial force density in the annular secondary conductor of a linear electromagnetic stirrer. Different geometries of secondaries are considered for numerical and experimental validation namely, 1. hollow annular ring, 2. annular ring with a solid cylinder and 3. solid cylinder.

  9. 30 CFR 57.12080 - Bare conductor guards.

    Science.gov (United States)

    2010-07-01

    ....12080 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR METAL AND NONMETAL MINE SAFETY AND HEALTH SAFETY AND HEALTH STANDARDS-UNDERGROUND METAL AND NONMETAL MINES Electricity... conductors are less than 7 feet above the rail, they shall be guarded at all points where persons work or...

  10. Exploring a Metamorphosis: Identity Formation for an Emerging Conductor

    Science.gov (United States)

    Ponchione, Cayenna

    2013-01-01

    Exploring the manner in which professional identity formation in emerging conductors is entangled with the cultural context of orchestras, I focus on the amorphous evolution from a student identity to that of a professional, illuminating some underlying social conditions of the ever-elusive profession of conducting. Prevailing assumptions about…

  11. Charge densities and charge noise in mesoscopic conductors

    Indian Academy of Sciences (India)

    This generalization leads to a local Wigner–Smith life-time matrix. Keywords. Density ... Of interest is the charge distribution in such a conductor and ..... is the transmission probability of the scattering problem without absorption if .... as a voltage probe which has its potential adjusted in such a way that there is no net current.

  12. Effect of surface oxide on the melting behavior of lead-free solder nanowires and nanorods

    International Nuclear Information System (INIS)

    Gao Fan; Rajathurai, Karunaharan; Cui, Qingzhou; Zhou, Guangwen; NkengforAcha, Irene; Gu Zhiyong

    2012-01-01

    Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders. By controlling the nanosolder reflow atmosphere using a flux, the surface oxide of the nanowires/nanorods can be effectively removed and complete nanosolder melting can be achieved. The complete melting of the nanosolders leads to the formation of nanoscale to microscale spherical solder balls, followed by Ostwald ripening phenomenon. The contact angle of the microscale solder balls formed on Si substrate was measured by direct electron microscopic imaging. These results provide new insights into micro- and nanoscale phase transition and liquid droplet coalescence from nanowires/nanorods to spheroids, and are relevant to nanoscale assembly and smaller ball grid array formation.

  13. Recovery of Tin and Nitric Acid from Spent Solder Stripping Solutions

    International Nuclear Information System (INIS)

    Ahn, Jae-Woo; Ryu, Seong-Hyung; Kim, Tae-young

    2015-01-01

    Spent solder-stripping solutions containing tin, copper, iron, and lead in nitric acid solution, are by-products of the manufacture of printed-circuit boards. The recovery of these metals and the nitric acid, for re-use has economic and environmental benefits. In the spent solder-stripping solution, a systematic method to determine a suitable process for recovery of valuable metals and nitric acid was developed. Initially, more than 90% of the tin was successfully recovered as high-purity SnO 2 by thermal precipitation at 80 ℃ for 3 hours. About 94% of the nitric acid was regenerated effectively from the spent solutions by diffusion dialysis, after which there remained copper, iron, and lead in solution. Leakage of tin through the anion-exchange membrane was the lowest (0.026%), whereas Pb-leakage was highest (4.26%). The concentration of the regenerated nitric acid was about 5.1 N.

  14. Appendix to the report from the low-residue soldering task force: Phase 2 results

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J.; Huffman, D.D. [and others

    1995-12-01

    The LRSTF report for Phase I of its evaluation of low-residue soldering was issued in June 1995. This Appendix summarizes the results of follow-on testing performed in Phase II and compares electrical test results for both phases. Deliberate decisions were made by the LRSTF in Phase I to challenge the design guideline limits in MILSTD-275, Printed Wiring for Electronic Equipment The LRSTF considered this approach to produce a ``worst case`` design and provide useful information about the robustness of LR soldering processes. As such, good design practices were sometimes deliberately violated in designing the LRSTF board. This approach created some anomalies for both LR boards and RMA/cleaned controls. Phase II testing verified that problems that affected both RMA/cleaned and LR boards in Phase I were design related.

  15. Intense generation of respirable metal nanoparticles from a low-power soldering unit

    Energy Technology Data Exchange (ETDEWEB)

    Gómez, Virginia [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Irusta, Silvia [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain); Balas, Francisco [Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain); Instituto de Carboquímica – Consejo Superior de Investigaciones Científicas (ICB-CSIC), 50018 Zaragoza (Spain); Santamaria, Jesus, E-mail: Jesus.Santamaria@unizar.es [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain)

    2013-07-15

    Highlights: • Intense generation of nanoparticles in the breathing range from a flux-soldering unit is detected. • Coagulation in the aerosol phase leads to 200-nm respirable nanoparticles up to 30 min after operation. • Nanoparticle concentration in the working environment depends on the presence of ambient air. • Metal-containing nanoparticles are collected in TEM grids and filters in the hundreds of nanometer range. -- Abstract: Evidence of intense nanoparticle generation from a low power (45 W) flux soldering unit is presented. This is a familiar device often used in daily life, including home repairs and school electronic laboratories. We demonstrate that metal-containing nanoparticles may reach high concentrations (ca. 10{sup 6} particles/cm{sup 3}) within the breathing range of the operator, with initial size distributions centered at 35–60 nm The morphological and chemical analysis of nanoparticle agglomerates collected on TEM grids and filters confirms their multiparticle structure and the presence of metals.

  16. Intense generation of respirable metal nanoparticles from a low-power soldering unit

    International Nuclear Information System (INIS)

    Gómez, Virginia; Irusta, Silvia; Balas, Francisco; Santamaria, Jesus

    2013-01-01

    Highlights: • Intense generation of nanoparticles in the breathing range from a flux-soldering unit is detected. • Coagulation in the aerosol phase leads to 200-nm respirable nanoparticles up to 30 min after operation. • Nanoparticle concentration in the working environment depends on the presence of ambient air. • Metal-containing nanoparticles are collected in TEM grids and filters in the hundreds of nanometer range. -- Abstract: Evidence of intense nanoparticle generation from a low power (45 W) flux soldering unit is presented. This is a familiar device often used in daily life, including home repairs and school electronic laboratories. We demonstrate that metal-containing nanoparticles may reach high concentrations (ca. 10 6 particles/cm 3 ) within the breathing range of the operator, with initial size distributions centered at 35–60 nm The morphological and chemical analysis of nanoparticle agglomerates collected on TEM grids and filters confirms their multiparticle structure and the presence of metals

  17. Diode Lasers used in Plastic Welding and Selective Laser Soldering - Applications and Products

    Science.gov (United States)

    Reinl, S.

    Aside from conventional welding methods, laser welding of plastics has established itself as a proven bonding method. The component-conserving and clean process offers numerous advantages and enables welding of sensitive assemblies in automotive, electronic, medical, human care, food packaging and consumer electronics markets. Diode lasers are established since years within plastic welding applications. Also, soft soldering using laser radiation is becoming more and more significant in the field of direct diode laser applications. Fast power controllability combined with a contactless temperature measurement to minimize thermal damage make the diode laser an ideal tool for this application. These advantages come in to full effect when soldering of increasingly small parts in temperature sensitive environments is necessary.

  18. Effects of In and Ni Addition on Microstructure of Sn-58Bi Solder Joint

    Science.gov (United States)

    Mokhtari, Omid; Nishikawa, Hiroshi

    2014-11-01

    In this study, the effect of adding 0.5 wt.% and 1 wt.% In and Ni to Sn-58Bi solder on intermetallic compound (IMC) layers at the interface and the microstructure of the solder alloys were investigated during reflow and thermal aging by scanning electron microscopy and electron probe micro-analysis. The results showed that the addition of minor elements was not effective in suppressing the IMC growth during the reflow; however, the addition of 0.5 wt.% In and Ni was effective in suppressing the IMC layer growth during thermal aging. The thickening kinetics of the total IMC layer was analyzed by plotting the mean thickness versus the aging time on log-log coordinates, and the results showed the transition point from grain boundary diffusion control to a volume diffusion control mechanism. The results also showed that the minor addition of In can significantly suppress the coarsening of the Bi phase.

  19. Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys

    Science.gov (United States)

    Lis, Adrian; Nakanishi, Kohei; Matsuda, Tomoki; Sano, Tomokazu; Minagawa, Madoka; Okamoto, Masahide; Hirose, Akio

    2017-07-01

    Solder joints between leads and printed circuit boards in thin small outline packages were produced with conventional Sn1.0Ag0.7Cu (SAC107) and Sn3.0Ag0.7Cu (SAC305) solders as well as various solder alloys with gradually increasing amounts of Bi (up to 3.0 wt.%) and In (up to 1.0 wt.%) within the SAC107 base solder. The reliability of soldered leads in temperature cycle (TC) tests improved most with solder alloys containing both Bi (1.6 wt.%) and In (0.5 wt.%). Microindentation and electron probe microanalysis mappings revealed that the effect originates from a combination of solution and precipitation strengthening of the initial SAC alloy. The distribution of inelastic strain accumulation (ISA), as a measure for degradation, was determined in the solder joints by finite element calculations. It was shown that defects in the solder proximal to the lead (60-75 μm), which was underpinned by similar cracking characteristics along the lead-solder interface. The ISA was confirmed to be lower in SAC+Bi/In alloys owing to their enhanced elasto-plastic properties. Moreover, the addition of a thin Cu coating on the leads could improve the joint reliability, as suggested by the calculation of the ISA and the acceleration factor.

  20. Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

    DEFF Research Database (Denmark)

    Kuhmann, Jochen Friedrich; Preuss, A.; Adolphi, B.

    1998-01-01

    : (1) SnPb; (2) InSn; (3) AuSn. The studies of the oxidation kinetics show that the growth of the native oxide, which covers the solder surfaces from the start of all soldering operations is self-limiting. The rate of oxidation on the molten, metallic solder surfaces is significantly reduced...... and reduction kinetics, are applied to flip-chip (FC) bonding experiments in vacuum with and without the injection of H2. Wetting in vacuum is excellent but the self-alignment during flip-chip soldering is restricted. The desired, perfectly self-aligned FC-bonds have been only achieved, using evaporated...

  1. Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint

    Science.gov (United States)

    Darbandi, Payam

    Due to the awareness of the potential health hazards associated with the toxicity of lead (Pb), actions have been taken to eliminate or reduce the use of Pb in consumer products. Among those, tin (Sn) solders have been used for the assembly of electronic systems. Anisotropy is of significant importance in all structural metals, but this characteristic is unusually strong in Sn, making Sn based solder joints one of the best examples of the influence of anisotropy. The effect of anisotropy arising from the crystal structure of tin and large grain microstructure on the microstructure and the evolution of constitutive responses of microscale SAC305 solder joints is investigated. Insights into the effects of key microstructural features and dominant plastic deformation mechanisms influencing the measured relative activity of slip systems in SAC305 are obtained from a combination of optical microscopy, orientation imaging microscopy (OIM), slip plane trace analysis and crystal plasticity finite element (CPFE) modeling. Package level SAC305 specimens were subjected to shear deformation in sequential steps and characterized using optical microscopy and OIM to identify the activity of slip systems. X-ray micro Laue diffraction and high energy monochromatic X-ray beam were employed to characterize the joint scale tensile samples to provide necessary information to be able to compare and validate the CPFE model. A CPFE model was developed that can account for relative ease of activating slip systems in SAC305 solder based upon the statistical estimation based on correlation between the critical resolved shear stress and the probability of activating various slip systems. The results from simulations show that the CPFE model developed using the statistical analysis of activity of slip system not only can satisfy the requirements associated with kinematic of plastic deformation in crystal coordinate systems (activity of slip systems) and global coordinate system (shape changes

  2. Current redistribution in cables made of insulated, soldered, or oxidized strands

    International Nuclear Information System (INIS)

    Turck, B.

    1979-07-01

    Current redistributions are compared in cables made of insulated strands, soldered, or oxidized strands and insulated strands with periodic joints. After discussing the different current redistributions in the cases of a rapidly changing current and a dc current, several particular situations are investigated: what happens if a strand is broken, or if a local normal zone appears that does not affect all the strands equally, the detection of this normal zone, and the influence of short circuits between strands

  3. Life cycle assessment (LCA of lead-free solders from the environmental protection aspect

    Directory of Open Access Journals (Sweden)

    Mitovski Aleksandra M.

    2009-01-01

    Full Text Available Life-cycle assessment (LCA presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equivalent basis, which, in this case, was 1000 cubic centimeters of an alloy. Two of the LCA phases, life-cycle inventory (LCA and life-cycle impact assessment (LCIA, are needed to calculate the environmental impacts. Methodology of LCIA applied in this analysis aligns every input and output influence into 16 different categories, divided in two subcategories. The life-cycle assessment reaserch review of the leadfree solders Sn-Cu, SAC (Sn-Ag-Cu, BSA (Bi-Sb-Ag and SABC (Sn-Ag-Bi-Cu respectively, is given in this paper, from the environmental protection aspect starting from production, through application process and finally, reclamation at the end-of-life, i.e. recycling. There are several opportunities for reducing the overall environmental and human health impacts of solder used in electronics manufacturing based on the results of the LCA, such as: using secondary metals reclaimed through post-industrial recycling; power consumption reducing by replacing older, less efficient reflow assembly equipment, or by optimizing the current equipment to perform at the elevated temperatures required for lead-free soldering, etc. The LCA analysis was done comparatively in relation to widely used Sn-Pb solder material. Additionally, the impact factors of material consumption, energy use, water and air reserves, human health and ecotoxicity have been ALSO considered including

  4. Study of silicon chip soldering in high-power transistor housing

    Directory of Open Access Journals (Sweden)

    Vasily S. Anosov

    2017-09-01

    We experimentally assessed the effect of outer housing layer materials and back side chip metallization. For lead-silver soldering of silicon chips, the best housing is that with a nickel outer layer rather than with a gold-plated one, because the resultant thermal resistance is lower and the absence of gold makes the technology cheaper. We obtained a 0.6 K/W thermal resistance for a 24 mm2 chip area.

  5. Verification of a Novel Method of Detecting Faults in Medium-Voltage Systems with Covered Conductors

    Directory of Open Access Journals (Sweden)

    Mišák Stanislav

    2017-06-01

    Full Text Available This paper describes the use of new methods of detecting faults in medium-voltage overhead lines built of covered conductors. The methods mainly address such faults as falling of a conductor, contacting a conductor with a tree branch, or falling a tree branch across three phases of a medium-voltage conductor. These faults cannot be detected by current digital relay protection systems. Therefore, a new system that can detect the above mentioned faults was developed. After having tested its operation, the system has already been implemented to protect mediumvoltage overhead lines built of covered conductors.

  6. Evaluation on Dorsey Method in Surface Tension Measurement of Solder Liquids Containing Surfactants

    Science.gov (United States)

    Zhao, Xingke; Xie, Feiming; Fan, Jinsheng; Liu, Dayong; Huang, Jihua; Chen, Shuhai

    2018-06-01

    With the purpose of developing a feasible approach for measuring the surface tension of solders containing surfactants, the surface tension of Sn-3Ag-0.5Cu-xP solder alloys, with various drop sizes as well as different phosphorus (P) content, was evaluated using the Dorsey method based on the sessile drop test. The results show that the accuracy of the surface tension calculations depends on both of sessile drop size and the liquid metal composition. With a proper drop size, in the range of 4.5 mm to 5.3 mm in equivalent spherical diameters, the deviation of the surface tension calculation can be limited to 1.43 mN·m-1 and 6.30 mN·m-1 for SnAgCu and SnAgCu-P, respectively. The surface tension of SnAgCu-xP solder alloys decreases quickly to a minimum value when the P content reaches 0.5 wt% and subsequently increases slowly with the P content further increasing. The formation of a P-enriched surface layer and Sn4P3 intermetallic phases is regarded to be responsible for the decreasing and subsequent increasing of surface tension, respectively.

  7. Liver repair and hemorrhage control by using laser soldering of liquid albumin in a porcine model.

    Science.gov (United States)

    Wadia, Y; Xie, H; Kajitani, M

    2000-01-01

    We evaluated laser soldering by using liquid albumin for welding liver injuries. Major liver trauma has a high mortality because of immediate exsanguination and a delayed morbidity from septicemia, peritonitis, biliary fistulae, and delayed secondary hemorrhage. Eight laceration (6 x 2 cm) and eight nonanatomic resection injuries (raw surface, 6 x 2 cm) were repaired. An 805-nm laser was used to weld 50% liquid albumin-indocyanine green solder to the liver surface, reinforcing it with a free autologous omental scaffold. The animals were heparinized and hepatic inflow occlusion was used for vascular control. All 16 soldering repairs were evaluated at 3 hours. All 16 laser mediated liver repairs had minimal blood loss as compared with the suture controls. No dehiscence, hemorrhage, or bile leakage was seen in any of the laser repairs after 3 hours. Laser fusion repair of the liver is a reliable technique to gain hemostasis on the raw surface as well as weld lacerations. Copyright 2000 Wiley-Liss, Inc.

  8. Investigation of Sn-Pb solder bumps of prototype photo detectors for the LHCb experiment

    CERN Document Server

    Delsante, M L; Arnau-Izquierdo, G

    2004-01-01

    The Large Hadron Collider (LHC) is now under construction at the European Organization for Nuclear Research (CERN). LHCb is one of the dedicated LHC experiments, allowing high energy proton-proton collisions to be exploited. This paper presents the results of the metallurgic studies carried out on Sn-Pb solder bumps of prototype vacuum photo detectors under development for LHCb, and in particular for the ring imaging Cherenkov-hybrid photo diode (RICH-HPD) project. These detectors encapsulate, in a vacuum tube, an assembly made of two silicon chips bonded together by a matrix of solder bumps. Each bump lies on a suitable system of under-bump metallic layers ensuring mechanical and electrical transition between the chip pad and the solder alloy. During manufacturing of the detector, bump-bonded (BB) assemblies are exposed to severe heat cycles up to 400 degree C inducing, in the present fabrication process, a clear degradation of electrical connectivity. Several investigations such as microstructural observati...

  9. Multi-layer SiC ceramics/Mo joints brazed using high-temperature solders

    International Nuclear Information System (INIS)

    Olesinska, W.; Kesik, J.

    2003-01-01

    The paper presents the results of studies on joining SiC ceramics with molybdenum, with the ceramic surface being activated by titanium, chromium or copper. Titanium or chromium were deposited by the sputtering technique, and copper - by the electro-chemical method. The microstructures of the SiC/Mo joints brazed with the CuMn13Ni3 solder and copper in a nitrogen atmosphere were examined and the results discussed. The joints, in which the ceramic surface was activated in addition with chromium, do not contain mechanical defects caused by the joining process, and the ceramic surface is covered with a continuous layer of the solder. A phase analysis of the interface surface identified an MeSiC phase. The mechanical strength of the joints in which the ceramic surface was modified by the Ti, Cr and Cu layers was markedly greater than that of the joints brazed directly to the uncoated ceramics with the use of active solders. (author)

  10. Laser Soldering and Thermal Cycling Tests of Monolithic Silicon Pixel Chips

    CERN Document Server

    Strand, Frode Sneve

    2015-01-01

    An ALPIDE-1 monolithic silicon pixel sensor prototype has been laser soldered to a flex printed circuit using a novel interconnection technique using lasers. This technique is to be optimised to ensure stable, good quality connections between the sensor chips and the FPCs. To test the long-term stability of the connections, as well as study the effects on hit thresholds and noise in the sensor, it was thermally cycled in a climate chamber 1200 times. The soldered connections showed good qualities like even melting and good adhesion on pad/flex surfaces, and the chip remained in working condition for 1080 cycles. After this, a few connections failed, having cracks in the soldering tin, rendering the chip unusable. Threshold and noise characteristics seemed stable, except for the noise levels of sector 2 in the chip, for 1000 cycles in a temperature interval of "10^{\\circ}" and "50^{\\circ}" C. Still, further testing with wider temperature ranges and more cycles is needed to test the limitations of the chi...

  11. Reinforcement of high-risk anastomoses using laser-activated protein solders: a clinical study

    Science.gov (United States)

    Libutti, Steven K.; Bessler, Marc; Chabot, J.; Bass, Lawrence S.; Oz, Mehmet C.; Auteri, Joseph S.; Kirsch, Andrew J.; Nowygrod, Roman; Treat, Michael R.

    1993-07-01

    Anastomotic leakage or breakdown can result in catastrophic complications and significantly increased post-operative morbidity and mortality. Certain anastomoses are subject to a higher incidence of disruption and are therefore termed high risk. In an attempt to decrease the risk of anastomotic leaks, we reinforced sutured anastomoses with a laser activated protein solder in patients undergoing esophagojejunostomies (n equals 2), lung transplantation (n equals 2), and pancreaticojejunostomies (Whipple procedure, n equals 5). The protein solder was composed of 1.0 ml of a 25% human albumin solution, 1.0 ml of sodium hyaluronate, and 0.1 ml of Cardiogreen dye. This composition was applied to the sutured anastomosis and activated with an 860 nm pulsed diode laser. Drains were placed when appropriate and patients were followed for up to 10 months post-operatively and assessed for clinical signs of anastomotic leaks. Results to data demonstrated that there were no immediate complications as a result of the procedure. Operative time was not significantly lengthened. There were no cases of clinically significant leakage from any of the reinforced anastomoses. Laser activated protein solders may help to reduce the incidence of leakage in high risk anastomoses. Large numbers of patients and longer follow-up is needed however, to draw significant conclusions.

  12. Liver repair and hemorrhage control using laser soldering of liquid albumin in a porcine model

    Science.gov (United States)

    Wadia, Yasmin; Xie, Hua; Kajitani, Michio; Gregory, Kenton W.; Prahl, Scott A.

    2000-05-01

    The purpose of this study was to evaluate laser soldering using liquid albumin for welding liver lacerations and sealing raw surfaces created by segmental resection of a lobe. Major liver trauma has a high mortality due to immediate exsanguination and a delayed morbidity and mortality from septicemia, peritonitis, biliary fistulae and delayed secondary hemorrhage. Eight laceration injuries (6 cm long X 2 cm deep) and eight non-anatomical resection injuries (raw surface 6 cm X 2 cm) were repaired. An 805 nm laser was used to weld 53% liquid albumin-ICG solder to the liver surface, reinforcing it with a free autologous omental scaffold. The animals were heparinized to simulate coagulation failure and hepatic inflow occlusion was used for vascular control. For both laceration and resection injuries, eight soldering repairs each were evaluated at three hours. A single suture repair of each type was evaluated at three hours. All 16 laser mediated liver repairs were accompanied by minimal blood loss as compared to the suture controls. No dehiscence, hemorrhage or bile leakage was seen in any of the laser repairs after three hours. In conclusion laser fusion repair of the liver is a quick and reliable technique to gain hemostasis on the cut surface as well as weld lacerations.

  13. Dissolution and uptake of cadmium from dental gold solder alloy implants

    Energy Technology Data Exchange (ETDEWEB)

    Bergman, B; Bergman, M; Soeremark, R [Umeaa Univ. (Sweden); Karolinska Institutet, Stockholm (Sweden))

    1977-01-01

    Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium (/sup 115/Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of /sup 115/Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver.

  14. QENS investigation of filled rubbers

    CERN Document Server

    Triolo, A; Desmedt, A; Pieper, J K; Lo Celso, F; Triolo, R; Negroni, F; Arrighi, V; Qian, H; Frick, B

    2002-01-01

    The polymer segmental dynamics is investigated in a series of silica-filled rubbers. The presence of inert fillers in polymers greatly affects the mechanical and physical performance of the final materials. For example, silica has been proposed as a reinforcing agent of elastomers in tire production. Results from quasielastic neutron scattering and Dynamic Mechanical Thermal Analysis (DMTA) measurements are presented on styrene-ran-butadiene rubber filled with silica. A clear indication is obtained of the existence of a bimodal dynamics, which can be rationalized in terms of the relaxation of bulk rubber and the much slower relaxation of the rubber adsorbed on the filler surface. (orig.)

  15. Gas-Filled Capillary Model

    International Nuclear Information System (INIS)

    Steinhauer, L. C.; Kimura, W. D.

    2006-01-01

    We have developed a 1-D, quasi-steady-state numerical model for a gas-filled capillary discharge that is designed to aid in selecting the optimum capillary radius in order to guide a laser beam with the required intensity through the capillary. The model also includes the option for an external solenoid B-field around the capillary, which increases the depth of the parabolic density channel in the capillary, thereby allowing for propagation of smaller laser beam waists. The model has been used to select the parameters for gas-filled capillaries to be utilized during the Staged Electron Laser Acceleration -- Laser Wakefield (STELLA-LW) experiment

  16. New tests on the 40 kA Nb3Sn CEA conductor for ITER applications

    International Nuclear Information System (INIS)

    Duchateau, J.L.; Bessette, D.; Katheder, H.

    1994-01-01

    New tests have been performed on the 40 kA CEA Nb 3 Sn conductor in the Sultan III facility. The aim of these tests is to obtain key experimental data on the behaviour of Nb 3 Sn conductors for fusion applications under high field and large transport current. The 40 kA Nb 3 Sn CEA conductor has a shape and an internal arrangement of the superconducting wires which is very similar to the ITER conductors. The level of the ac losses experienced by these conductors under varying fields influences deeply their design. The basic experiment consists of producing field pulses on the conductor by means of a coil installed in the bore of the Sultan magnet and recording the integrated voltage obtained on pick-up coils placed on the conductor as a function of time. (author) 4 refs.; 5 figs.; 2 tabs

  17. Electrostatic separation for recycling conductors, semiconductors, and nonconductors from electronic waste.

    Science.gov (United States)

    Xue, Mianqiang; Yan, Guoqing; Li, Jia; Xu, Zhenming

    2012-10-02

    Electrostatic separation has been widely used to separate conductors and nonconductors for recycling e-waste. However, the components of e-waste are complex, which can be classified as conductors, semiconductors, and nonconductors according to their conducting properties. In this work, we made a novel attempt to recover the mixtures containing conductors (copper), semiconductors (extrinsic silicon), and nonconductors (woven glass reinforced resin) by electrostatic separation. The results of binary mixtures separation show that the separation of conductor and nonconductor, semiconductor and nonconductor need a higher voltage level while the separation of conductor and semiconductor needs a higher roll speed. Furthermore, the semiconductor separation efficiency is more sensitive to the high voltage level and the roll speed than the conductor separation efficiency. An integrated process was proposed for the multiple mixtures separation. The separation efficiency of conductors and semiconductors can reach 82.5% and 88%, respectively. This study contributes to the efficient recycling of valuable resources from e-waste.

  18. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

    2008-07-14

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

  19. Filling of charged cylindrical capillaries

    NARCIS (Netherlands)

    Das, Siddhartha; Chanda, Sourayon; Eijkel, J.C.T.; Tas, N.R.; Chakraborty, Suman; Mitra, Sushanta K.

    2014-01-01

    We provide an analytical model to describe the filling dynamics of horizontal cylindrical capillaries having charged walls. The presence of surface charge leads to two distinct effects: It leads to a retarding electrical force on the liquid column and also causes a reduced viscous drag force because

  20. Space-filling polyhedral sorbents

    Energy Technology Data Exchange (ETDEWEB)

    Haaland, Peter

    2016-06-21

    Solid sorbents, systems, and methods for pumping, storage, and purification of gases are disclosed. They derive from the dynamics of porous and free convection for specific gas/sorbent combinations and use space filling polyhedral microliths with facial aplanarities to produce sorbent arrays with interpenetrating interstitial manifolds of voids.

  1. Bending Test of Conductor for ALICE and LHCb Dipole Magnets

    CERN Document Server

    Giudici, P A; CERN. Geneva; Flegel, W

    2000-01-01

    Abstract It is foreseen that the coils for the two magnets will be manufactured by winding flat pancakes, which are subsequently shaped to a semi-cylindrical form (ALICE) or bent by 45 degrees (LHCb). We propose here several methods and describe tests that were performed to estimate tolerances and forces which will have to be expected during the manufacturing process. To this end, short Aluminium conductor lengths of adequate cross-section were bent around a shaper piece to an angle of 90 degrees. The tests were repeated for conductors both wrapped with prepreg insulation tape and without this tape. The different test set-ups and the obtained results are described in this note.

  2. The electrostatics of charged insulating sheets peeled from grounded conductors

    International Nuclear Information System (INIS)

    Datta, M J; Horenstein, M N

    2008-01-01

    The physics of a charged, insulating sheet peeled from a ground-plane conductor is examined. Contact charging is ensured by charging a sheet to 10-12 kV with corona to establish intimate electrostatic contact with the underlying conductor. The surface potential is next forced to zero by sweeping the sheet with a stainless-steel brush, and the surface recharged to a new potential between 0 and 11 kV. The sheet is then peeled from the ground plane and its residual charge density is measured. Results show that the residual charge equals the breakdown-limiting value, but its polarity depends on the surface potential acquired just prior to peeling. The results have relevance to studies of industrial webs and insulating sheets.

  3. The ATLAS semi-conductor tracker operation and performance

    International Nuclear Information System (INIS)

    Robinson, D.

    2013-01-01

    The Semi-Conductor Tracker (SCT) is a silicon strip detector and one of the key precision tracking devices in the Inner Detector of the ATLAS experiment at the CERN Large Hadron Collider (LHC). The SCT was installed and commissioned within ATLAS in 2007, and has been used to exploit fully the physics potential of the LHC since the first proton–proton collisions at 7 TeV were delivered in 2009. In this paper, its operational status throughout data taking up to the end of 2011 is presented, and its tracking performance is reviewed. -- Highlights: ► The operation and performance of the ATLAS Semi-Conductor Tracker (SCT) is reviewed. ► More than 99% of the SCT strips have remained operational in all data taking periods so far. ► Tracking performance indicators have met or exceeded design specifications. ► Radiation damage effects match closely expectations from delivered fluence.

  4. Chemical solution deposition: a path towards low cost coated conductors

    International Nuclear Information System (INIS)

    Obradors, X; Puig, T; Pomar, A; Sandiumenge, F; Pinol, S; Mestres, N; Castano, O; Coll, M; Cavallaro, A; Palau, A; Gazquez, J; Gonzalez, J C; Gutierrez, J; Roma, N; Ricart, S; Moreto, J M; Rossell, M D; Tendeloo, G van

    2004-01-01

    The achievement of low cost deposition techniques for high critical current YBa 2 Cu 3 O 7 coated conductors is one of the major objectives to achieve a widespread use of superconductivity in power applications. Chemical solution deposition techniques are appearing as a very promising methodology to achieve epitaxial oxide thin films at a low cost, so an intense effort is being carried out to develop routes for all chemical coated conductor tapes. In this work recent achievements will be presented towards the goal of combining the deposition of different type of buffer layers on metallic substrates based on metal-organic decomposition with the growth of YBa 2 Cu 3 O 7 layers using the trifluoroacetate route. The influence of processing parameters on the microstructure and superconducting properties will be stressed. High critical currents are demonstrated in 'all chemical' multilayers

  5. Current transfer between superconductor and normal layer in coated conductors

    International Nuclear Information System (INIS)

    Takacs, S

    2007-01-01

    The current transfer between superconducting stripes coated with normal layer is examined in detail. It is shown that, in present YBCO coated conductors with striations, a considerable amount of the current flowing in the normal layer is not transferred into the superconducting stripes. This effect also influences the eddy currents and the coupling currents between the stripes. The effective resistance for the coupling currents is calculated. The maximum allowable twist length of such a striated structure is given, which ensures lower losses than in the corresponding normal conductor of the same volume as the total YBCO cable (including substrate, buffer layer, superconductor and normal coating). In addition, a new simple method for determining the transfer resistance between superconducting and normal parts is proposed

  6. Hydrogen electrolysis using a NASICON solid protonic conductor

    Energy Technology Data Exchange (ETDEWEB)

    Gulens, J.; Longhurst, T.H.; Kuriakose, A.K.; Canaday, J.D.

    1988-09-01

    A protonic conductor based on a bonded NASICON disc has been used for hydrogen electrolysis at 300 K. Currents up to 200 mA can be passed through the disc, and the electrolysis proceeds with 100% current efficiency. The resistance of the ceramic is affected by its extent of hydration. Degradation and failure of the ceramic occurs at the cathode as a result of electrolysis.

  7. Intermediate Temperature Proton Conductors – Why and How

    OpenAIRE

    Li, Qingfeng; Aili, David; Jensen, Jens Oluf; Cleemann, Lars Nilausen

    2016-01-01

    The current technologies of fuel cells and electrolzers are based on ionic conducting electrolyte materials exclusively operational either in the low (20 - 200ºC) or high (600 - 1000ºC) temperature ranges. The intermediate temperature window, especially between 200 and 400 ºC, is still only represented by early fundamental material research for ionic electrolytes. Such materials, most likely based on proton conductors, are expected to bring a new generation of the technologies: fuel cells by ...

  8. What is a good conductor for metamaterials or plasmonics

    Directory of Open Access Journals (Sweden)

    Soukoulis Costas M.

    2015-04-01

    Full Text Available We review conducting materials like metals, conducting oxides and graphene for nanophotonic applications. We emphasize that metamaterials and plasmonic systems benefit from different conducting materials. Resonant metamaterials need conductors with small resistivity, since dissipative loss in resonant metamaterials is proportional to the real part of the resistivity of the conducting medium it contains. For plasmonic systems, one must determine the propagation length at a desired level of confinement to estimate the dissipative loss.

  9. The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

    Science.gov (United States)

    Werden, Jesse

    The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the

  10. Modelling the V-I characteristic of coated conductors

    Energy Technology Data Exchange (ETDEWEB)

    Rutter, N A [Department of Materials Science, University of Cambridge, Cambridge (United Kingdom); IRC in Superconductivity, Cavendish Laboratory, Cambridge (United Kingdom)]. E-mail: ruttern@ornl.gov; Glowacki, B A [Department of Materials Science, University of Cambridge, Cambridge (United Kingdom); IRC in Superconductivity, Cavendish Laboratory, Cambridge (United Kingdom)

    2001-09-01

    The critical current densities of coated conductor samples are limited by the presence of low-angle grain boundaries. These boundaries provide an obstacle to current flow, which is determined by their misorientation angle. The superconducting layer of a coated conductor tape may be considered as a network of grains linked together by grain boundaries through which the supercurrent must pass. Such a network has been investigated using a two-dimensional grain model. The three-dimensional orientations of grains in the superconducting network can be assigned randomly based on information obtained from EBSD and x-ray texture measurements. By assigning critical current values to boundaries based on their calculated misorientation, the overall J{sub c} of macroscopic modelled samples can then be calculated. This paper demonstrates how such a technique is applied using a small-scale, idealized sample grain structure in an applied magnetic field. The onset of dissipation at the critical current may be viewed in terms of the flow of the magnetic flux across the sample along high-angle grain boundaries when the critical current is first exceeded. Through such a consideration, the model may be further used to predict the current-voltage characteristic of the coated conductor sample around the superconducting transition. (author)

  11. MHD Modeling of Conductors at Ultra-High Current Density

    International Nuclear Information System (INIS)

    ROSENTHAL, STEPHEN E.; DESJARLAIS, MICHAEL P.; SPIELMAN, RICK B.; STYGAR, WILLIAM A.; ASAY, JAMES R.; DOUGLAS, M.R.; HALL, C.A.; FRESE, M.H.; MORSE, R.L.; REISMAN, D.B.

    2000-01-01

    In conjunction with ongoing high-current experiments on Sandia National Laboratories' Z accelerator, the authors have revisited a problem first described in detail by Heinz Knoepfel. Unlike the 1-Tesla MITLs of pulsed power accelerators used to produce intense particle beams, Z's disc transmission line (downstream of the current addition) is in a 100--1,200 Tesla regime, so its conductors cannot be modeled simply as static infinite conductivity boundaries. Using the MHD code MACH2 they have been investigating the conductor hydrodynamics, characterizing the joule heating, magnetic field diffusion, and material deformation, pressure, and velocity over a range of current densities, current rise-times, and conductor materials. Three purposes of this work are (1) to quantify power flow losses owing to ultra-high magnetic fields, (2) to model the response of VISAR diagnostic samples in various configurations on Z, and (3) to incorporate the most appropriate equation of state and conductivity models into the MHD computations. Certain features are strongly dependent on the details of the conductivity model

  12. High-field thermal transports properties of REBCO coated conductors

    CERN Document Server

    Bonura, M

    2015-01-01

    The use of REBCO coated conductors is envisaged for many applications, extending from power cables to high-field magnets. Whatever the case, thermal properties of REBCO tapes play a key role for the stability of superconducting devices. In this work, we present the first study on the longitudinal thermal conductivity (k) of REBCO coated conductors in magnetic fields up to 19 T applied both parallelly and perpendicularly to the thermal-current direction. Copper-stabilized tapes from six industrial manufacturers have been investigated. We show that zero-field k of coated conductors can be calculated with an accuracy of ‡ 15% from the residual resistivity ratio of the stabilizer and the Cu/non-Cu ratio. Measurements performed at high fields have allowed us to evaluate the consistency of the procedures generally used for estimating in-field k in the framework of the Wiedemann-Franz law from an electrical characterization of the materials. In-field data are intended to provide primary ingredients for the ...

  13. Quantum oscillations in quasi-two-dimensional conductors

    CERN Document Server

    Galbova, O

    2002-01-01

    The electronic absorption of sound waves in quasi-two-dimensional conductors in strong magnetic fields, is investigated theoretically. A longitudinal acoustic wave, propagating along the normal n-> to the layer of quasi-two-dimensional conductor (k-> = left brace 0,0,k right brace; u-> = left brace 0,0,u right brace) in magnetic field (B-> = left brace 0, 0, B right brace), is considered. The quasiclassical approach for this geometry is of no interest, due to the absence of interaction between electromagnetic and acoustic waves. The problem is of interest in strong magnetic field when quantization of the charge carriers energy levels takes place. The quantum oscillations in the sound absorption coefficient, as a function of the magnetic field, are theoretically observed. The experimental study of the quantum oscillations in quasi-two-dimensional conductors makes it possible to solve the inverse problem of determining from experimental data the extrema closed sections of the Fermi surface by a plane p sub z = ...

  14. MHD Modeling of Conductors at Ultra-High Current Density

    International Nuclear Information System (INIS)

    Rosenthal, S.E.; Asay, J.R.; Desjarlais, M.P.; Douglas, M.R.; Frese, M.H.; Hall, C.A.; Morse, R.L.; Reisman, D.; Spielman, R.B.; Stygar, W.A.

    1999-01-01

    In conjunction with ongoing high-current experiments on Sandia National Laboratories' Z accelerator we have revisited a problem first described in detail by Heinz Knoepfel. MITLs of previous pulsed power accelerators have been in the 1-Tesla regime. Z's disc transmission line (downstream of the current addition) is in a 100-1200 Tesla regime, so its conductors cannot be modeled simply as static infinite conductivity boundaries. Using the MHD code MACH2 we have been investigating conductor hydrodynamics, characterizing the joule heating, magnetic field diffusion, and material deformation, pressure, and velocity over a range of current densities, current rise-times, and conductor materials. Three purposes of this work are ( 1) to quantify power flow losses owing to ultra-high magnetic fields, (2) to model the response of VISAR diagnostic samples in various configurations on Z, and (3) to incorporate the most appropriate equation of state and conductivity models into our MHD computations. Certain features are strongly dependent on the details of the conductivity model. Comparison with measurements on Z will be discussed

  15. Design principles for solid-state lithium superionic conductors.

    Science.gov (United States)

    Wang, Yan; Richards, William Davidson; Ong, Shyue Ping; Miara, Lincoln J; Kim, Jae Chul; Mo, Yifei; Ceder, Gerbrand

    2015-10-01

    Lithium solid electrolytes can potentially address two key limitations of the organic electrolytes used in today's lithium-ion batteries, namely, their flammability and limited electrochemical stability. However, achieving a Li(+) conductivity in the solid state comparable to existing liquid electrolytes (>1 mS cm(-1)) is particularly challenging. In this work, we reveal a fundamental relationship between anion packing and ionic transport in fast Li-conducting materials and expose the desirable structural attributes of good Li-ion conductors. We find that an underlying body-centred cubic-like anion framework, which allows direct Li hops between adjacent tetrahedral sites, is most desirable for achieving high ionic conductivity, and that indeed this anion arrangement is present in several known fast Li-conducting materials and other fast ion conductors. These findings provide important insight towards the understanding of ionic transport in Li-ion conductors and serve as design principles for future discovery and design of improved electrolytes for Li-ion batteries.

  16. Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

    Directory of Open Access Journals (Sweden)

    Yulong Li

    2018-01-01

    Full Text Available In order to accelerate the growth of interfacial intermetallic compound (IMC layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms and 800 ms, were used for the ultrasonic soldering. The isothermal aging was conducted at 150 °C for 0, 120, 240, and 360 h. The evolution of microstructure, the IMC layer growth mechanism during aging, and the shear strength of the joints after aging were systemically investigated. Results showed the following. (i Formation of intermetallic compounds was accelerated by ultrasonic cavitation and streaming effects, the thickness of the interfacial Cu6Sn5 layer increased with aging time, and a thin Cu3Sn layer was identified after aging for 360 h. (ii The growth of the interfacial IMC layer of the ultrasonically soldered Cu/SAC305/Cu joints followed a linear function of the square root of the aging time, revealing a diffusion-controlled mechanism. (iii The tensile shear strength of the joint decreased to a small extent with increasing aging time, owing to the combined effects of IMC grain coarsening and the increase of the interfacial IMC. (iv Finally, although the fracture surfaces and failure locations of the joint soldered with 400 ms and 800 ms vibration times show similar characteristics, they are influenced by the aging time.

  17. Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

    Science.gov (United States)

    Yoon, Jeong-Won; Noh, Bo-In; Jung, Seung-Boo

    2011-09-01

    Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.

  18. CO2 temperature-controlled laser soldering of pig trachea incisions in vitro using flexible albumin bands

    Science.gov (United States)

    Sharvit, Dan; Vasilyev, Tamar; Vasserman, Irena; Simhon, David; Kariv, Naam; DeRowe, Ari; Katzir, Abraham

    2005-04-01

    Resection of a segment of the trachea is a procedure applied for the removal of cervical tumors invading the trachea, or for the treatment of severe tracheal stenosis. The current method of anastomosis is based on multiple sutures. The main drawbacks of this method are: 1) A long procedure time, 2) An air leakage, and 3) An inflammatory response to the sutures. In this study we evaluated the feasibility and effectiveness of the use of temperature controlled CO2 laser soldering of incisions in pig tracheas in vitro. A transverse incision was made in a separated pig trachea. A flexible albumin band was prepared and was laser soldered with albumin solder to the outer surface of the trachea, covering the incision. The soldered trachea ends were sealed and the burst pressure was measured. In a series of in vitro experiments, the mean burst pressure was found to be 230 mm Hg. These preliminary results demonstrated that laser soldering using a flexible albumin band may be a useful method for sealing an incision in the trachea.

  19. Electrical Resistance of Nb$_{3}$Sn/Cu Splices Produced by Electromagnetic Pulse Technology and Soft Soldering

    CERN Document Server

    Schoerling, D; Scheuerlein, C; Atieh, S; Schaefer, R

    2011-01-01

    The electrical interconnection of Nb$_{3}$Sn/Cu strands is a key issue for the construction of Nb$_{3}$Sn based damping ring wigglers and insertion devices for third generation light sources. We compare the electrical resistance of Nb$_{3}$Sn/Cu splices manufactured by solid state welding using Electromagnetic Pulse Technology (EMPT) with that of splices produced by soft soldering with two different solders. The resistance of splices produced by soft soldering depends strongly on the resistivity of the solder alloy at the operating temperature. By solid state welding splice resistances below 10 nOhm can be achieved with 1 cm strand overlap length only, which is about 4 times lower than the resistance of Sn96Ag4 soldered splices with the same overlap length. The comparison of experimental results with Finite Element simulations shows that the electrical resistance of EMPT welded splices is determined by the resistance of the stabilizing copper between the superconducting filaments and confirms that welding of ...

  20. Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

    Science.gov (United States)

    Boesenberg, Adam J.; Anderson, Iver E.; Harringa, Joel L.

    2012-07-01

    Of Pb-free solder choices, an array of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic ( T eut = 217°C) composition have emerged with potential for broad use, including ball grid array (BGA) joints that cool slowly. This work investigated minor substitutional additions of Al (0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2- μm to 5- μm faceted Cu-Al particles, identified as Cu33Al17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness. Clustering of Cu33Al17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface. Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance.

  1. Selection of a cryostabilized Nb3Sn conductor cooling system for the large coil program

    International Nuclear Information System (INIS)

    Chi, J.W.H.; Murphy, J.H.; Jones, C.K.

    1977-01-01

    The Large Coil Project (LCP) is a program to design, fabricate and test relatively large superconducting toroidal field coils for tokamak fusion reactor applications. Some basic requirements that affect the conductor design are cryostabilization, 8 tesla peak magnetic field, and a specified maximum refrigeration load. The engineering considerations that led to the selection of a forced flow supercritical helium-cooled cable conductor are described. Comparisons of forced flow supercritical helium cooled cable conductors with pool boiling cooled monolithic conductors were made with regard to a number of factors such as the thermal capacity of the coolant, the thermal design margins, propensity for conductor normalization, predictability of the thermal-flow performance, controllability of the cooling conditions, etc. It was concluded that, although there exists a number of design uncertainties and engineering problems, forced flow supercritical helium cooled conductors can provide a far more reliable coil design than the pool boiling monolithic concept. The design of a cryostabilized Nb 3 Sn hollow cabled conductor involved detailed considerations of the need for fully transposed conductor strands, the nonuniform void and helium flow distributions, heat transfer from the twisted conductor strands, and helium flow rate and pump work requirements. The uncertainties in the design are discussed and the specifications of a reference Nb 3 Sn conductor concept that meets the design requirements and constraints are presented

  2. Conductors for commercial MRI magnets beyond NbTi: requirements and challenges

    Science.gov (United States)

    Parizh, Michael; Lvovsky, Yuri; Sumption, Michael

    2017-01-01

    Magnetic resonance imaging (MRI), a powerful medical diagnostic tool, is the largest commercial application of superconductivity. The superconducting magnet is the largest and most expensive component of an MRI system. The magnet configuration is determined by competing requirements including optimized functional performance, patient comfort, ease of siting in a hospital environment, minimum acquisition and lifecycle cost including service. In this paper, we analyze conductor requirements for commercial MRI magnets beyond traditional NbTi conductors, while avoiding links to a particular magnet configuration or design decisions. Potential conductor candidates include MgB2, ReBCO and BSCCO options. The analysis shows that no MRI-ready non-NbTi conductor is commercially available at the moment. For some conductors, MRI specifications will be difficult to achieve in principle. For others, cost is a key barrier. In some cases, the prospects for developing an MRI-ready conductor are more favorable, but significant developments are still needed. The key needs include the development of, or significant improvements in: (a) conductors specifically designed for MRI applications, with form-fit-and-function readily integratable into the present MRI magnet technology with minimum modifications. Preferably, similar conductors should be available from multiple vendors; (b) conductors with improved quench characteristics, i.e. the ability to carry significant current without damage while in the resistive state; (c) insulation which is compatible with manufacturing and refrigeration technologies; (d) dramatic increases in production and long-length quality control, including large-volume conductor manufacturing technology. In-situ MgB2 is, perhaps, the closest to meeting commercial and technical requirements to become suitable for commercial MRI. Conductor technology is an important, but not the only, issue in introduction of HTS/MgB2 conductor into commercial MRI magnets. These

  3. Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds

    Energy Technology Data Exchange (ETDEWEB)

    Haseeb, A.S.M.A., E-mail: haseeb@um.edu.my; Arafat, M.M., E-mail: arafat_mahmood@yahoo.com; Johan, Mohd Rafie, E-mail: mrafiej@um.edu.my

    2012-02-15

    This work investigates the effects of molybdenum nanoparticles on the growth of interfacial intermetallic compound between Sn-3.8Ag-0.7Cu solder and copper substrate during multiple reflow. Molybdenum nanoparticles were mixed with Sn-3.8Ag-0.7Cu solder paste by manual mixing. Solder samples were reflowed on a copper substrate in a 250 Degree-Sign C reflow oven up to six times. The molybdenum content of the bulk solder was determined by inductive coupled plasma-optical emission spectrometry. It is found that upon the addition of molybdenum nanoparticles to Sn-3.8Ag-0.7Cu solder, the interfacial intermetallic compound thickness and scallop diameter decreases under all reflow conditions. Molybdenum nanoparticles do not appear to dissolve or react with the solder. They tend to adsorb preferentially at the interface between solder and the intermetallic compound scallops. It is suggested that molybdenum nanoparticles impart their influence on the interfacial intermetallic compound as discrete particles. The intact, discrete nanoparticles, by absorbing preferentially at the interface, hinder the diffusion flux of the substrate and thereby suppress the intermetallic compound growth. - Highlights: Black-Right-Pointing-Pointer Mo nanoparticles do not dissolve or react with the SAC solder during reflow. Black-Right-Pointing-Pointer Addition of Mo nanoparticles results smaller IMC thickness and scallop diameter. Black-Right-Pointing-Pointer Mo nanoparticles influence the interfacial IMC through discrete particle effect.

  4. Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction

    Science.gov (United States)

    Takaku, Yoshikazu; Ohnuma, Ikuo; Kainuma, Ryosuke; Yamada, Yasushi; Yagi, Yuji; Nishibe, Yuji; Ishida, Kiyohito

    2006-11-01

    Bismuth and its alloys are candidates for Pb-free high-temperature solders that can be substituted for conventional Pb-rich Pb-Sn solders (melting point (mp) = 573 583 K). However, inferior properties such as brittleness and weak bonding strength should be improved for practical use. To that end, BiCu-X (X=Sb, Sn, and Zn) Pb-free high-temperature solders are proposed. Miscibility gaps in liquid BiCu-X alloys were surveyed using the thermodynamic database ADAMIS (alloy database for micro-solders), and compositions of the BiCu-X solders were designed on the basis of calculation. In-situ composite solders that consist of a Bi-base matrix with fine intermetallic compound (IMC) particles were produced by gas-atomizing and melt-spinning methods. The interfacial reaction between in-situ composite solders and Cu or Ni substrates was investigated. The IMCs at the interface formed a thin, uniform layer, which is an appropriate morphology for a reliable solder joint.

  5. Microstructural effects on constitutive and fatigue fracture behavior of TinSilverCopper solder

    Science.gov (United States)

    Tucker, Jonathon P.

    As microelectronic package construction becomes more diverse and complex, the need for accurate, geometry-independent material constitutive and failure models increases. Evaluations of packages based on accelerated environmental tests (such as accelerated thermal cycling or power cycling) only provide package-dependent reliability information. In addition, extrapolations of such test data to life predictions under field conditions are often empirical. Besides geometry, accelerated environmental test data must account for microstructural factors such as alloy composition or isothermal aging condition, resulting in expensive experimental variation. In this work, displacement-controlled, creep, and fatigue lap shear tests are conducted on specially designed SnAgCu test specimens with microstructures representative to those found in commercial microelectronic packages. The data are used to develop constitutive and fatigue fracture material models capable of describing deformation and fracture behavior for the relevant temperature and strain rate ranges. Furthermore, insight is provided into the microstructural variation of solder joints and the subsequent effect on material behavior. These models are appropriate for application to packages of any geometrical construction. The first focus of the thesis is on Pb-mixed SnAgCu solder alloys. During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of SnPb and SnAgCu often result from either mixed assemblies or rework. Three alloys of 1, 5 and 20 weight percent Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn37Pb components mixed with Sn3.0Ag0.5Cu. Displacement-controlled (constant strain rate) and creep tests were performed at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. Rate-dependent constitutive models for Pb

  6. Hard-to-fill vacancies.

    Science.gov (United States)

    Williams, Ruth

    2010-09-29

    Skills for Health has launched a set of resources to help healthcare employers tackle hard-to-fill entry-level vacancies and provide sustainable employment for local unemployed people. The Sector Employability Toolkit aims to reduce recruitment and retention costs for entry-level posts and repare people for employment through pre-job training programmes, and support employers to develop local partnerships to gain access to wider pools of candidates and funding streams.

  7. Exploring the limits of a very large Nb3Sn conductor: the 80 kA conductor of the ITER toroidal field model coil

    International Nuclear Information System (INIS)

    Duchateau, J.L.; Ciazynski, D.; Guerber, O.; Park, S.H.; Zani, L.

    2003-01-01

    In Phase II experiment of the International Thermonuclear Experimental Reactor (ITER) Toroidal Field Model Coil (TFMC) the operation limits of its 80 kA Nb 3 Sn conductor were explored. To increase the magnetic field on the conductor, the TFMC was tested in presence of another large coil: the EURATOM-LCT coil. Under these conditions the maximum field reached on the conductor, was around 10 tesla. This exploration has been performed at constant current, by progressively increasing the coil temperature and monitoring the coil voltage drop in the current sharing regime. Such an operation was made possible thanks to the very high stability of the conductor. The aim of these tests was to compare the critical properties of the conductor with expectations and assess the ITER TF conductor design. These expectations are based on the documented critical field and temperature dependent properties of the 720 superconducting strands which compose the conductor. In addition the conductor properties are highly dependent on the strain, due to the compression appearing on Nb 3 Sn during the heat treatment of the pancakes and related to the differential thermal compression between Nb 3 Sn and the stainless steel jacket. No precise model exists to predict this strain, which is therefore the main information, which is expected from these tests. The method to deduce this strain from the different tests is presented, including a thermalhydraulic analysis to identify the temperature of the critical point and a careful estimation of the field map across the conductor. The measured strain has been estimated in the range -0.75% to -0.79 %. This information will be taken into account for ITER design and some adjustment of the ITER conductor design is under examination. (authors)

  8. Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

    Science.gov (United States)

    Mallik, S.; Bauer, R.; Hübner, F.; Ekere, N. N.

    2011-01-01

    Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

  9. Roebel assembled coated conductor cables (RACC): Ac-Losses and current carrying potential

    Science.gov (United States)

    Frank, A.; Heller, R.; Goldacker, W.; Kling, A.; Schmidt, C.

    2008-02-01

    Low ac-loss HTS cables for transport currents well above 1 kA are required for application in transformers and generators and are taken into consideration for future generations of fusion reactor coils. Coated conductors (CC) are suitable candidates for high field application at an operation temperature in the range 50-77 K. Ac-field applications require cables with low ac-losses and hence twisting of the individual strands. We solved this problem using the Roebel technique. Short lengths of Roebel bar cables were prepared from industrial DyBCO and YBCO-CC. Meander shaped tapes of 4 or 5 mm width with twist pitches of 123 or 127 mm were cut from the 10 or 12 mm wide CC tapes using a specially designed tool. Eleven or twelve of these strands were assembled to a cable. The electrical and mechanical connection of the tapes was achieved using a silver powder filled conductive epoxy resin. Ac-losses of a short sample in an external ac-field were measured as a function of frequency and field amplitude as well as the coupling current decay time constant. We discuss the results in terms of available theories and compare measured time constants in transverse field with measured coupling losses. Finally the potential of this cable type for ac-use is discussed with respect to ac-losses and current carrying capability.

  10. Roebel assembled coated conductor cables (RACC): Ac-Losses and current carrying potential

    International Nuclear Information System (INIS)

    Frank, A; Heller, R; Goldacker, W; Kling, A; Schmidt, C

    2008-01-01

    Low ac-loss HTS cables for transport currents well above 1 kA are required for application in transformers and generators and are taken into consideration for future generations of fusion reactor coils. Coated conductors (CC) are suitable candidates for high field application at an operation temperature in the range 50-77 K. Ac-field applications require cables with low ac-losses and hence twisting of the individual strands. We solved this problem using the Roebel technique. Short lengths of Roebel bar cables were prepared from industrial DyBCO and YBCO-CC. Meander shaped tapes of 4 or 5 mm width with twist pitches of 123 or 127 mm were cut from the 10 or 12 mm wide CC tapes using a specially designed tool. Eleven or twelve of these strands were assembled to a cable. The electrical and mechanical connection of the tapes was achieved using a silver powder filled conductive epoxy resin. Ac-losses of a short sample in an external ac-field were measured as a function of frequency and field amplitude as well as the coupling current decay time constant. We discuss the results in terms of available theories and compare measured time constants in transverse field with measured coupling losses. Finally the potential of this cable type for ac-use is discussed with respect to ac-losses and current carrying capability

  11. Transport ac losses in Bi-2223 multifilamentary tapes - conductor materials aspect

    Energy Technology Data Exchange (ETDEWEB)

    Glowacki, B A [IRC in Superconductivity, University of Cambridge, Madingley Road, Cambridge CB3 0HE (United Kingdom); Department of Materials Science and Metallurgy, University of Cambridge, Pembroke Street, Cambridge BC2 3QZ (United Kingdom); Majoros, M [IRC in Superconductivity, University of Cambridge, Madingley Road, Cambridge CB3 0HE (United Kingdom); Institute of Electrical Engineering, SAS, Bratislava (Slovakia)

    2000-05-01

    Transport ac losses in technical superconductors based on Bi-2223 tape material are influenced by many parameters. The major factors that define the ac performance of such conductors are the following: the size and number of filaments, their geometrical arrangement in the cross-section of the conductor, the twist pitch length, the resistivity of the matrix, the presence of oxide barriers around the filaments and deformation procedures such as sequential pressing or rolling followed by appropriate thermal treatment. In the present paper the above aspects are addressed from the viewpoint of the materials science of technical conductor design. Transport ac losses at power frequencies in different types of Bi-2223 conductor are presented and analysed. The results of conductor design analysis with respect to the coexistence of the superconductor with other materials in the conductor structure are presented. New concepts for minimization of the transport ac losses are discussed in detail. (author)

  12. A Boundary Element Solution to the Problem of Interacting AC Fields in Parallel Conductors

    Directory of Open Access Journals (Sweden)

    Einar M. Rønquist

    1984-04-01

    Full Text Available The ac fields in electrically insulated conductors will interact through the surrounding electromagnetic fields. The pertinent field equations reduce to the Helmholtz equation inside each conductor (interior problem, and to the Laplace equation outside the conductors (exterior problem. These equations are transformed to integral equations, with the magnetic vector potential and its normal derivative on the boundaries as unknowns. The integral equations are then approximated by sets of algebraic equations. The interior problem involves only unknowns on the boundary of each conductor, while the exterior problem couples unknowns from several conductors. The interior and the exterior problem are coupled through the field continuity conditions. The full set of equations is solved by standard Gaussian elimination. We also show how the total current and the dissipated power within each conductor can be expressed as boundary integrals. Finally, computational results for a sample problem are compared with a finite difference solution.

  13. Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements

    Science.gov (United States)

    Gadag, Shiva P.; Patra, Susant

    2000-12-01

    Solder joint interconnects are mechanical means of structural support for bridging the various electronic components and providing electrical contacts and a thermal path for heat dissipation. The functionality of the electronic device often relies on the structural integrity of the solder. The dimensional stability of solder joints is numerically predicted based on their mechanical properties. Algorithms to model the kinetics of dissolution and subsequent growth of intermetallic from the complete knowledge of a single history of time-temperature-reflow profile, by considering equivalent isothermal time intervals, have been developed. The information for dissolution is derived during the heating cycle of reflow and for the growth process from cooling curve of reflow profile. A simple and quick analysis tool to derive tensile stress-strain maps as a function of the reflow temperature of solder and strain rate has been developed by numerical program. The tensile properties are used in modeling thermal strain, thermal fatigue and to predict the overall fatigue life of solder joints. The numerical analysis of the tensile properties as affected by their composition and rate of testing, has been compiled in this paper. A numerical model using constitutive equation has been developed to evaluate the interfacial fatigue crack growth rate. The model can assess the effect of cooling rate, which depends on the level of strain energy release rate. Increasing cooling rate from normalizing to water-quenching, enhanced the fatigue resistance to interfacial crack growth by up to 50% at low strain energy release rate. The increased cooling rates enhanced the fatigue crack growth resistance by surface roughening at the interface of solder joint. This paper highlights salient features of process modeling. Interfacial intermetallic microstructure is affected by cooling rate and thereby affects the mechanical properties.

  14. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Dias, Marcelino; Costa, Thiago [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Rocha, Otávio [Federal Institute of Education, Science and Technology of Pará — IFPA, 66093-020 Belém, PA (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos — UFSCar, 13565-905 São Carlos, SP (Brazil); Cheung, Noé, E-mail: cheung@fem.unicamp.br [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil)

    2015-08-15

    Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing.

  15. In-vitro investigations of skin closure using diode laser and protein solder containing gold nano shells

    International Nuclear Information System (INIS)

    Nourbakhsh, M. S.; Etrati Khosroshahi, M.

    2011-01-01

    Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nano shells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nano shells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nano shells were prepared. A full thickness incision of 2*20 mm 2 was made on the surface and after placing 50 μ1 of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nano shell concentrations. In addition, at constant laser irradiance (I), the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to σt = 1610 g/cm 2 at I ∼ 60 W cm-2, T ∼ 65 d egree C , Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nano shells can be used as an indocyanine green dye alterative for laser tissue soldering. Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

  16. Selection and specification criteria for fills for cut-and-fill mining

    Energy Technology Data Exchange (ETDEWEB)

    Thomas, E. G.

    1980-05-15

    Because of significant differences in placement and loading conditions, the ideal fill material for a cut-and-fill operation has different characteristics to those for a fill for a filled open stoping operation. The differing requirements of the two mining operations must be understood and accounted for in establishing fill selection and specification criteria. Within the paper, aspects of the particular requirements of cut-and-fill mining are analyzed and related to the specific fill tests and properties required. Emphasis is placed upon the role of fill in ground support, though this cannot be isolated from overall fill performance. Where appropriate, test data are introduced and areas requiring continuing research highlighted.

  17. In situ investigation of SnAgCu solder alloy microstructure

    International Nuclear Information System (INIS)

    Pietrikova, Alena; Bednarcik, Jozef; Durisin, Juraj

    2011-01-01

    Research highlights: → In situ X-ray diffraction investigation enabled detailed analysis of the melting and solidification process of the SAC305 alloy. → It was found that the SAC305 solder melts at 230 deg. C. When cooling from 240 deg. C the SAC305 alloy solidifies at the temperature of 214 deg. C. During solidification β-Sn and Cu 6 Sn 5 is also formed. Formation of Ag 3 Sn occurs at 206 deg. C and the remaining amount of alloy crystallizes approximately at 160 deg. C. → Furthermore, observation of the thermal expansion behaviour of the β-Sn tetragonal unit cell revealed linear dependence of the unit cell volume on temperature. The unit cell parameters a and c also increase linearly with the temperature. Despite the fact that the c parameter is substantially smaller than parameter a, it exhibits a significantly higher linear thermal expansion coefficient. Comparison between data obtained during heating and cooling indicates that the thermal expansion coefficient is slightly greater in the case of cooling. - Abstract: In situ X-ray diffraction experiments, using synchrotron radiation, were employed to analyze microstructure evolution of the 96.5Sn3Ag0.5Cu (wt.%)-SAC305 lead-free solder alloy during heating (30-240 deg. C), isothermal dwell (240 deg. C) and cooling (240-30 deg. C). The special emphasis was placed on the study of the melting and solidification processes, explaining formation, distribution and the order of crystallization of the crystal phases (β-Sn, intermetallic compounds) in the solder alloy. Furthermore, thermal expansion behaviour of the main constituent phase β-Sn was analyzed prior to melting and after the consequent solidification.

  18. 30 CFR 817.72 - Disposal of excess spoil: Valley fill/head-of-hollow fills.

    Science.gov (United States)

    2010-07-01

    ... STANDARDS-UNDERGROUND MINING ACTIVITIES § 817.72 Disposal of excess spoil: Valley fill/head-of-hollow fills.... Uncontrolled surface drainage may not be directed over the outslope of the fill. (2) Runoff from areas above the fill and runoff from the surface of the fill shall be diverted into stabilized diversion channels...

  19. Loss and Inductance Investigations in a 4-layer Superconducting Prototype Cable Conductor

    DEFF Research Database (Denmark)

    Tønnesen, Ole; Olsen, Søren Krüger; Kühle (fratrådt), Anders Van Der Aa

    1999-01-01

    One important issue in the design and optimization of a superconducting cable conductor is the control of the current distribution between single tapes and layers. This presentation is based on a number of experiments performed on a 4-layer three meter long prototype superconducting cable conductor......-losses are measured as a function of transport current and a given current distribution and compared with the monoblock model. Recommendations for design of future cable conductor prototypes are given....

  20. Estimation of Equivalent Thermal Conductivity for Impregnated Electrical Windings Formed from Profiled Rectangular Conductors

    OpenAIRE

    Ayat, Sabrina S; Wrobel, Rafal; Goss, James; Drury, David

    2016-01-01

    In order to improve accuracy and reduce model setting-up, and solving time in thermal analysis of electrical machines, transformers and wound passive components, the multi-material winding region is frequently homogenised. The existing winding homogenization techniques are predo-minantly focused on winding constructions with round conductors, where thermal conductivity across conductors is usually assumed to be isotropic. However, for the profiled rectangular conductors that assumption is no ...

  1. Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy

    DEFF Research Database (Denmark)

    Malik, Safdar Abbas; Le, Thanh Hung; Van Nong, Ngo

    2018-01-01

    and metallic electrodes. In this paper, we investigate the joining of ZnSb to Ni and Ag electrodes using a commercial solder alloy S-Bond 400 and hot-pressing technique. Ti and Cr layers are also introduced as a diffusion barrier and microstructure at the interfaces is observed by scanning electron microscopy....... We found that S-bond 400 solder reacts with Ag and Ni electrodes to form different alloys at the interfaces. Cr layer was found to be broken after joining, resulting in a thicker reaction/diffusion layer at the interface, while Ti layer was preserved....

  2. Damage Model for Reliability Assessment of Solder Joints in Wind Turbines

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    environmental factors. Reliability assessment for such type of products conventionally is performed by classical reliability techniques based on test data. Usually conventional reliability approaches are time and resource consuming activities. Thus in this paper we choose a physics of failure approach to define...... damage model by Miner’s rule. Our attention is focused on crack propagation in solder joints of electrical components due to the temperature loadings. Based on the proposed method it is described how to find the damage level for a given temperature loading profile. The proposed method is discussed...

  3. Decomposition studies of no-clean solder flux systems in connection with corrosion reliability of electronics

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Verdingovas, Vadimas

    2013-01-01

    with specific soldering process and parameters, while most important factors are the flux chemistry and its decomposition characteristics. Active parts of the flux residue can cause increased water absorption due to their hygroscopic nature and in solution they will increase leakage current and corrosion...... the contaminated PCBA parts to varying humidity and measuring the resulting leakage current. Results revealed a significant influence of flux chemistry including the amount of WOAs, while aggressiveness of the residue seems to vary with content and type of WOAs, and their nature of decomposition....

  4. Control of microstructure in soldered, brazed, welded, plated, cast or vapor deposited manufactured components

    Science.gov (United States)

    Ripley, Edward B.; Hallman, Russell L.

    2015-11-10

    Disclosed are methods and systems for controlling of the microstructures of a soldered, brazed, welded, plated, cast, or vapor deposited manufactured component. The systems typically use relatively weak magnetic fields of either constant or varying flux to affect material properties within a manufactured component, typically without modifying the alloy, or changing the chemical composition of materials or altering the time, temperature, or transformation parameters of a manufacturing process. Such systems and processes may be used with components consisting of only materials that are conventionally characterized as be uninfluenced by magnetic forces.

  5. Improved Switching Characteristics of Fast Power MOSFETs Applying Solder Bump Technology

    Directory of Open Access Journals (Sweden)

    Sibylle Dieckerhoff

    2008-01-01

    Full Text Available The impact of a reduced package stray inductance on the switching performance of fast power MOSFETs is discussed applying advanced 3D packaging technologies. Starting from an overview over new packaging approaches, a solder bump technology using a flexible PI substrate is exemplarily chosen for the evaluation. Measurement techniques to determine the stray inductance are discussed and compared with a numerical solution based on the PEEC method. Experimental results show the improvement of the voltage utilization while there is only a slight impact on total switching losses.

  6. In situ TEM observation of microcrack nucleation and propagation in pure tin solder

    International Nuclear Information System (INIS)

    Ding Ying; Wang Chunqing; Li, Mingyu; Wang Weiqiang

    2006-01-01

    Microcrack nucleation and propagation behavior in pure tin solder was investigated by using transmission electron microscopy (TEM) through in situ tensile test. Observation results showed that fracture process was completed in this visco-plastic material by connecting discontinuous cracks or voids. Depending on remarkable vacancy diffusion ability, microvoids were nucleated and developed in the dislocation free zone (DFZ) or super thinned area ahead of crack tip under local high stress concentration. The cracks were linked with each other by mutual dislocation emission which expedites the propagation of crack tips effectively

  7. Soldering Technology (6th) Proceedings of Annual Seminar, 17-18 February 1982.

    Science.gov (United States)

    1982-02-01

    aspect oF health and safety during this presentation. We are hoping that the work conducted by Van 2 Der Molen in the USA will clarify this issue. FLUX... Der Molen , PROC. OF 5th ANNUAL SEMINAR SOLDERING TECHNOLOGY, Naval Weapons Centre, China Lake, California, February 1981. 3. Burge, Perks, O’Brien...developed a new and innovative solution, which we believe to be a significant advance in the state of the art. In this new design (Fig.l) a FM DER

  8. Technology of hardening fills for mined spaces

    International Nuclear Information System (INIS)

    Simek, P.; Holas, M.; Chyla, A.; Pech, P.

    1985-01-01

    The technology is described of hardening fills for mined spaces of uranium deposits in North Bohemian chalk. A special equipment was developed for the controlled preparation of a hardening mixture. The composition of the fill is determined by the strength of the filled rock, expecially by the standard strength, i.e., the minimal strength of the filling under uniaxial pressure. The said parameter determines the consumption of binding materials and thereby the total costs of the filling. A description is presented of the filling technology, including rabbit tube transport of the mixture and quality control. (Pu)

  9. Studies on advanced superconductors for fusion device. Pt. 1. Present status of Nb3Sn conductors

    International Nuclear Information System (INIS)

    Tachikawa, Kyoji; Yamamoto, Junya

    1996-03-01

    Nb 3 Sn conductors have been developed with great expectation as an advanced high-field superconductor to be used in fusion devices of next generation. Furthermore, Nb 3 Sn conductors are being developed for NMR magnet and superconducting generator as well as for cryogen-free superconducting magnet. A variety of fabrication procedures, such as bronze process, internal tin process and Nb tube method, have been developed based on the diffusion reaction. Recently, Nb 3 Sn conductors with ultra-thin filaments have been fabricated for AC use. Both high-field and AC performances of Nb 3 Sn conductors have been significantly improved by alloying addition. The Ti-doped Nb 3 Sn conductor has generated 21.5T at 1.8K operation. This report summarizes manufacturing procedures, superconducting performances and applications of Nb 3 Sn conductors fabricated through different processes in different countries. More detailed subjects included in this report are high-field properties, AC properties, conductors for fusion with large current capacities, stress-strain effect and irradiation effect as well as standardization of critical current measurement method regarding to Nb 3 Sn conductors. Comprehensive grasp on the present status of Nb 3 Sn conductors provided by this report will act as a useful data base for the future planning of fusion devices. (author). 172 refs

  10. Investigation of the influence of heat transfer on screen printed textile conductor

    Science.gov (United States)

    Kazani, I.; De Mey, G.; Hertleer, C.; Guxho, G.; Van Langenhove, L.

    2017-10-01

    Two different textile substrates were screen printed with silver-based inks in order to be electrically conductive. In every textile four conductors were printed with different widths in order to investigate the influence of heat transfer on each conductor. This was done, by using the thermo graphic camera and through the evaluation of each conductor’s profile. It was found that the conductors printed on the white textile had higher values of heat transfer compared to the other conductors printed on the dark textiles.

  11. Charge balancing fill rate monitor

    International Nuclear Information System (INIS)

    Rothman, J.L.; Blum, E.B.

    1995-01-01

    A fill rate monitor has been developed for the NSLS storage rings to allow machine tuning over a very large dynamic range of beam current. Synchrotron light, focused on a photodiode, produces a signal proportional to the beam current. A charge balancing circuit processes the diode current, creating an output signal proportional to the current injected into the ring. The unit operates linearly over a dynamic range of 120 dB and can resolve pulses of injected beam as small as 1 μA

  12. Preparation of the ITER Poloidal Field Conductor Insert (PFCI) test

    International Nuclear Information System (INIS)

    Zanino, R.; Egorov, S.; Kim, K.; Martovetsky, N.; Nunoya, Y.; Okuno, K.; Salpietro, E.; Sborchia, C.; Takahashi, Y.; Weng, P.; Bangasco, M.; Savoldi Richard, L.; Polak, M.; Formisano, A.; Zapretilina, E.; Shikov, A.; Vedernikov, G.; Ciazynski, D.; Zani, L.; Muzzi, L.; Ricci, M.; Deela Corte, A.; Sugimoto, M.; Hamada, K.; Portone, A.; Hurd, F.; Mitchell, N.; Nijhuis, A.; Ilyin, Y.

    2004-01-01

    The Poloidal Field Conductor Insert (PFCI) of the International Thermonuclear Experimental Reactor (ITER) has been designed in Europe and is being manufactured at Tesla Engineering, UK, in the frame of a Task Agreement with the ITER International Team. Completion of the PFCI is expected at the beginning of 2005. Then, the coil shall be shipped to JAERI Naka, Japan, and inserted into the bore of the ITER Central Solenoid Model Coil, where it should be tested in 2005 to 2006. The PFCI consists of a NbTi dual-channel conductor, almost identical to the ITER PF1 and PF6 design, about 45 m long, with a 50 mm thick square stainless steel jacket, wound in a single-layer solenoid. It should carry up to 50 kA in a field of about 6 T, and it will be cooled by supercritical He at around 4.5 K and 0.6 MPa. An intermediate joint, representative of the ITER PF joints and located at relatively high field, will be an important new item in the test configuration with respect to the previous ITER Insert Coils. The PFCI will be fully instrumented with inductive and resistive heaters, as well as with voltage taps, Hall probes, pick-up coils, temperature sensors, pressure taps, strain and displacement sensors. The test program shall be aimed at DC and pulsed performance assessment of conductor and intermediate joint, AC loss measurement, stability and quench propagation, thermalhydraulic characterization. Here we give an overview of the preparatory work towards the test, including a review of the coil manufacturing and of the available instrumentation, a discussion of the most likely test program items, and a presentation of the supporting modeling and characterization work performed so far. (authors)

  13. Laser direct fabrication of silver conductors on glass boards

    International Nuclear Information System (INIS)

    Li Xiangyou; Zeng Xiaoyan; Li Huiling; Qi Xiaojing

    2005-01-01

    Laser micro-cladding has been used to fabricate metal conductors, according to a designed electronic circuit, directly onto glass boards which had been coated with a silver-containing electronic paste. The electronic pastes, composed of silver powders, inorganic binders and organic medium, thus formed the conductive metal pattern (i.e. electric circuit) along the path of the laser allowing the rest of the layer to be removed subsequently by an organic solvent. Firing in a furnace at 600 deg. C resulted in conductive lines with resistivity of about 10 -5 Ω cm and with adhesive strength of the order of magnitude of megapascals

  14. Specific features of the thermodynamics of superionic conductors

    International Nuclear Information System (INIS)

    Gurevich, Yu.Ya.; Kharkats, Yu.I.

    1982-01-01

    A review of theoretical and experimental investigations devoted to a study of thermodynamic aspects of the superionic conductivity phenomena for the recent decade is presented. A relation between a superionic conductivity and the disordering of one of the crystal sublattices, the phase transitions of the disordering caused by the point defects interaction, the mechanism of polymorphic transitions conjugated with a partial disordering are considered. The effect of an abrupt change of the ionic conductivity induced by electric field, the thermodynamics of the domain states in superionic conductors and the influence of pressure on phase transitions and ionic conductivity are analyzed

  15. The ATLAS Semi-Conductor Tracker Operation and Performance

    CERN Document Server

    Robinson, D; The ATLAS collaboration

    2012-01-01

    The Semi-Conductor Tracker (SCT), is a silicon strip detector and one of the key precision tracking devices in the Inner Detector of the ATLAS experiment at the CERN Large Hadron Collider (LHC). The SCT was installed and commissioned within ATLAS in 2007, and has been has been used to fully exploit the physics potential of the LHC since the first proton-proton collisions at 7 TeV were delivered in 2009. In this paper, its operational status throughout data taking up to the end of 2011 is presented, and its tracking performance is reviewed.

  16. Method for deposition of a conductor in integrated circuits

    Science.gov (United States)

    Creighton, J. Randall; Dominguez, Frank; Johnson, A. Wayne; Omstead, Thomas R.

    1997-01-01

    A method is described for fabricating integrated semiconductor circuits and, more particularly, for the selective deposition of a conductor onto a substrate employing a chemical vapor deposition process. By way of example, tungsten can be selectively deposited onto a silicon substrate. At the onset of loss of selectivity of deposition of tungsten onto the silicon substrate, the deposition process is interrupted and unwanted tungsten which has deposited on a mask layer with the silicon substrate can be removed employing a halogen etchant. Thereafter, a plurality of deposition/etch back cycles can be carried out to achieve a predetermined thickness of tungsten.

  17. The quantum flux in quasis one-dimensional conductors

    International Nuclear Information System (INIS)

    Ventura, J.

    1989-01-01

    A method is presented which quantizes electromagnetic fluxes directly in flux space. It is based on the commutation law [φ B , φ E ] = i, where φ B is the magnetic flux, and φ E the longitudinal electric flux of a quasi one-dimensional conductor. The relevance of such a method for the description of the quantized Hall plateaus is discussed. In a second step, the polarization electric flux is introduced, together with a method for quantization of hybrid variables formed with pure electromagnetic fluxes plus electronic variables. (author) [pt

  18. Flux line lattice in type II super conductors

    International Nuclear Information System (INIS)

    Manindra Kumar; Singh, Arun Kumar; Surendra Kumar

    2003-01-01

    The shear modules C 66 of the flux line lattice in type II super conductors can be obtained from a two body interaction between the flux lines even at large inductions B ∼ HC 2 . The potential is composed of a repulsive and an attractive part and has a range diverging at HC 2 . An explicit expression for the Ginzberg-Landau C 66 is given for arbitrary B and k' (G-L parameter). The graph for C 66 exhibits the expected maximum at a certain value of b. (author)

  19. Magnet and conductor developments for the Mirror Fusion Program

    International Nuclear Information System (INIS)

    Cornish, D.N.

    1981-01-01

    The conductor development and the magnet design and construction for the MFTF are described. Future plans for the Mirror Program and their influence on the associated superconductor development program are discussed. Included is a summary of the progress being made to develop large, high-field, multifilamentary Nb 3 Sn superconductors and the feasibility of building a 12-T yin-yang set of coils for the machine to follow MFTF. In a further look into the future, possible magnetic configurations and requirements for mirror reactors are surveyed

  20. Application of the Lifshitz Theory to Poor Conductors

    International Nuclear Information System (INIS)

    Svetovoy, Vitaly B.

    2008-01-01

    The Lifshitz formula for dispersive forces is generalized to the materials, which cannot be described with the local dielectric response. The principal nonlocality of poor conductors is related to the finite screening length of the penetrating field and collisional relaxation; at low temperatures the role of collisions plays the Landau damping. Spatial dispersion makes the theory self-consistent. Our predictions are compared with the recent experiment. It is demonstrated that at low temperatures Casimir-Lifshitz entropy disappears as T in the case of degenerate plasma and as T 2 for the nondegenerate one