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Sample records for solder creep-fatigue interactions

  1. Experimental study on creep-fatigue interaction behavior of GH4133B superalloy

    International Nuclear Information System (INIS)

    Hu Dianyin; Wang Rongqiao

    2009-01-01

    The creep-fatigue tests have been conducted with nickel-based superalloy GH4133B at 600 deg. C in three cases of type loading to study the creep-fatigue behavior of the alloy and the loading history effect on the creep-fatigue damage. Since the conventional linear cumulative damage rule failed in evaluating the creep-fatigue life based on experimental data, a continuous non-linear model proposed by Mao et al. was employed to describe the creep-fatigue interaction. The creep-fatigue damage in the cases of continuous cyclic creep loading (CF) and prior fatigue followed by creep loading (F + C) was larger than unity and smaller than unity when the type loading was prior creep followed by fatigue loading (C + F). Scanning electron microscope (SEM) analyses of the fracture surface showed that the cracks initiated from the specimen surface and the fracture modes in different loading history were different. The crack mode at CF loading depended on the cyclic period. In the case of F + C loading, the primary fracture mode was transgranular, and in the condition where the type of waveform was C + F, the fracture mode was of mixed transgranular and intergranular type. In addition, the origin of the history effect on creep-fatigue interaction was explained by the SEM observations.

  2. A life evaluation under creep-fatigue-environment interaction of Ni-base wrought alloys

    International Nuclear Information System (INIS)

    Hattori, Hiroshi; Kitagawa, Masaki; Ohtomo, Akira; Itoh, Mitsuyoshi

    1986-01-01

    In order to determine a failure criteria under cyclic loading and affective environment for HTGR systems, a series of strain controlled low-cycle fatigue tests were carried out at HTGR maximum gas temperatures in air, in vacuum and in HTGR helium environments on two nickel-base wrought alloys, namely Inconel 617 and Hastelloy XR. This paper first describes the creep-fatigue-environment properties of these alloys followed by a proposal of an evaluation method of creep-fatigue-environment interaction based on the experimental data to define the more reasonable design criteria, which is a modification of the linear damage summation rule. Second, the creep-fatigue properties of Hastelloy XR at 900 deg C and the result evaluated by this proposed method are shown. This criterion is successfully applied to the life prediction at 900 deg C. In addition, the creep-fatigue properties of Hastelloy XR-II are discussed. (author)

  3. Modeling Creep-Fatigue-Environment Interactions in Steam Turbine Rotor Materials for Advanced Ultra-supercritical Coal Power Plants

    Energy Technology Data Exchange (ETDEWEB)

    Shen, Chen [General Electric Global Research, Niskayuna, NY (United States)

    2014-04-01

    The goal of this project is to model creep-fatigue-environment interactions in steam turbine rotor materials for advanced ultra-supercritical (A-USC) coal power Alloy 282 plants, to develop and demonstrate computational algorithms for alloy property predictions, and to determine and model key mechanisms that contribute to the damages caused by creep-fatigue-environment interactions.

  4. Crack Growth Behaviour of P92 Steel Under Creep-fatigue Interaction Conditions

    Directory of Open Access Journals (Sweden)

    JING Hong-yang

    2017-05-01

    Full Text Available Creep-fatigue interaction tests of P92 steel at 630℃ under stress-controlled were carried out, and the crack propagation behaviour of P92 steel was studied. The fracture mechanism of crack growth under creep-fatigue interaction and the transition points in a-N curves were analyzed based on the fracture morphology. The results show that the fracture of P92 steel under creep-fatigue interaction is creep ductile fracture and the (Ctavg parameter is employed to demonstrate the crack growth behaviour; in addition, the fracture morphology shows that the crack growth for P92 steel under creep-fatigue interaction is mainly caused by the nucleation and growth of the creep voids and micro-cracks. Furthermore, the transition point of a-lg(Ni/Nf curve corresponds to the turning point of initial crack growth changed into steady crack growth while the transition point of (da/dN-N curve exhibits the turning point of steady creep crack growth changed into the accelerated crack growth.

  5. The effect of creep cavitation on the fatigue life under creep-fatigue interaction

    International Nuclear Information System (INIS)

    Nam, S.W.

    1995-01-01

    Low cycle fatigue tests have been carried out with three different materials (1Cr-Mo-V steel, 12Cr-Mo-V steel and 304 stainless steel) for the investigation of the effect of surface roughness on the fatigue life. To see the effect systematically, we have chosen those materials which may or may not form grain boundary cavities.Test results show that the continuous fatigue life of 1Cr-Mo-V steel and aged 304 stainless steel with a rough surface is decreased compared with that of the specimens with a smooth surface. These two alloys are found to have no grain boundary cavities formed under creep-fatigue test conditions. On the contrary, the fatigue life of 12Cr-Mo-V steel and solutionized 304 stainless steel in which grain boundary cavities are formed under creep-fatigue test conditions is not influenced by the states of surface roughness.The characteristic test results strongly confirm that the fatigue life of the specimen under creep-fatigue interaction, during which creep cavities are forming, may be controlled by the cavity nucleation and growth processes rather than the process of surface crack initiation. ((orig.))

  6. Creep, Fatigue and Environmental Interactions and Their Effect on Crack Growth in Superalloys

    Science.gov (United States)

    Telesman, J.; Gabb, T. P.; Ghosn, L. J.; Smith, T.

    2017-01-01

    Complex interactions of creep/fatigue/environment control dwell fatigue crack growth (DFCG) in superalloys. Crack tip stress relaxation during dwells significantly changes the crack driving force and influence DFCG. Linear Elastic Fracture Mechanics, Kmax, parameter unsuitable for correlating DFCG behavior due to extensive visco-plastic deformation. Magnitude of remaining crack tip axial stresses controls DFCG resistance due to the brittle-intergranular nature of the crack growth process. Proposed a new empirical parameter, Ksrf, which incorporates visco-plastic evolution of the magnitude of remaining crack tip stresses. Previous work performed at 704C, extend the work to 760C.

  7. Creep-fatigue interactions in an austenitic stainless steel

    International Nuclear Information System (INIS)

    Majumdar, S.; Maiya, P.S.

    1978-01-01

    A phenomenological model of the interaction between creep and fatigue in Type 304 stainless steel at elevated temperatures is presented. The model is based on a crack-growth equation and an equation governing cavity growth, expressed in terms of current plastic strain and plastic strain rate. Failure is assumed to occur when a proposed interaction equation is satisfied. Various parameters of the equations can be obtained by correlation with continuously cycling fatigue and monotonic creep-rupture test data, without the use of any hold-time fatigue tests. Effects of various wave shapes such as tensile, compressive, and symmetrical hold on the low-cycle fatigue life can be computed by integrating the damage-rate equations along the appropriate loading path. Microstructural evidence in support of the proposed model is also discussed

  8. Creep-fatigue-environment interaction of 9Cr-1Mo-V-Nb steel

    International Nuclear Information System (INIS)

    Shibata, Hiroyuki; Ishikawa, Akiyoshi; Asada, Yasuhide

    1996-01-01

    An extension of the creep-fatigue damage model has been conducted in the present study. The original damage model has been developed to the predict the creep-fatigue life of 9Cr-1Mo-V-Nb steel (Modified 9Cr-1Mo steel) in a very high vacuum environment. The present study is to extend an applicability of the model to the creep-fatigue damage accumulation in the air environment. (orig.)

  9. Experimental investigation on low cycle fatigue and creep-fatigue interaction of DZ125 in different dwell time at elevated temperatures

    International Nuclear Information System (INIS)

    Shi Duoqi; Liu Jinlong; Yang Xiaoguang; Qi Hongyu; Wang Jingke

    2010-01-01

    Research highlights: → This paper has researched creep-fatigue interaction of directionally solidified superalloy DZ125 with different dwell time at high temperature combined with micro-mechanism by experiment. → The results indicated that the life of creep-fatigue decreases as dwell time increases, but the life of this alloy was almost unchanged when dwell time exceeds a critical value at 850 deg. C. - Abstract: The low cycle fatigue (LCF) and creep-fatigue tests have been conducted with directionally solidified nickel-based superalloy DZ125 at 850 and 980 deg. C to study the creep-fatigue interaction behavior of alloy with different dwell time. On the average, the life of creep-fatigue tests are about 70% less than the life of LCF tests under the same strain range at 850 deg. C. The life of creep-fatigue decreases as dwell time increases, but the life of this alloy was almost unchanged when dwell time exceeds a critical value at 850 deg. C. Scanning electron microscope (SEM) analyses of the fracture revealed that the fracture modes were influenced by different way of loading. In case of LCF, the primary fracture mode was transgranular, while in case of creep-fatigue, the primary fracture mode was mixed with transgranular and intergranular. There were also obvious different morphologies of surface crack between LCF and creep-fatigue.

  10. LCF life prediction for waspaloy in the creep-fatigue interaction regime

    International Nuclear Information System (INIS)

    Yeom, Jong Taek; Park, Nho Kwang

    2001-01-01

    This paper describes the empirical rule of strain rate modified linear accumulation of creep damage(SRM rule) for Low-Cycle Fatigue(LCF) life prediction of Waspaloy in the creep-fatigue interaction regime and Chaboche type unified viscoplastic model predicting the stress-strain response in various cyclic loading conditions. The comparison of the experimental data and the predictions for strain controlled LCF tests carried out for various strain ranges at 600 .deg. C and 650 .deg. C was made. Chaboche type unified viscoplastic model described efficiently the inelastic deformation behavior during LCF tests. Crack-initiation lifting method to predict the material life was investigated with Strain Rate Modification(SRM) rule. The application of SRM rule to LCF tests on Waspaloy indicated a good agreement between measured and predicted cycles to failure

  11. High Temperature Creep-Fatigue-Oxidation Interactions in 9% Cr Martensitic Steels

    International Nuclear Information System (INIS)

    Fournier, B.; Sauzay, M.; Pineau, A.

    2007-01-01

    Full text of publication follows: Martensitic steels of the 9-12%Cr family are widely used in the energy industry and were selected as candidate materials for structural components of future fusion reactors [1,2]. Typical in-service conditions require operating temperatures between 673 and 873 K, which means that the creep behaviour of these steels is of primary interest. In addition, some components are anticipated to operate in a pulsed mode, leading to complex time-dependencies of temperature, stress and strain in materials. Therefore, in design procedures, fatigue and creep-fatigue data are required. Furthermore, to meet the need for very long inservice lifetime of components (with very long hold times ∼ one month) reliable cyclic lifetime models are necessary, since complete tests with such long holding periods cannot, of course, be carried out in laboratory. To make these extrapolations safer and more reliable a precise understanding of the damage and interaction mechanisms is required. Fatigue, creep-fatigue and relaxation-fatigue tests were carried out at high temperature (823 K), under three different atmospheres (air, vacuum and He+impurities) and for a large panel of applied fatigue and creep strain. Holding periods are found to decrease the fatigue lifetime. Surprisingly enough compressive holding periods are more deleterious than tensile ones in air. Observations were carried out on fracture surfaces, specimen surfaces and cross sections. No creep cavity is visible, whatever the holding period duration, but a major influence of oxidation is highlighted. Oxidation is all the more predominant for low applied strains. Tests carried out under vacuum and helium show that the formation of a thick oxide layer can lead to a fatigue lifetime 4 times shorter. Crack propagation is mainly transgranular for all applied strains. Both damage observations and a theoretical study of oxide layers fracture mechanisms allow qualitative explanations for recorded fatigue

  12. Evaluation of creep-fatigue/ environment interaction in Ni-base wrought alloys for HTGR application

    International Nuclear Information System (INIS)

    Hattori, Hiroshi; Kitagawa, Masaki; Ohtomo, Akira

    1986-01-01

    High Temperature Gas-cooled Reactor (HTGR) systems should be designed based on the high temperature structural strength design procedures. On the development of design code, the determination of failure criteria under cyclic loading and severe environments is one of the most important items. By using the previous experimental data for Ni-base wrought alloys, Inconel 617 and Hastelloy XR, several evaluation methods for creep-fatigue interaction were examined for their capability to predict their cyclic loading behavior for HTGR application. At first, the strainrange partitioning method, the frequency modified damage function and the linear damage summation rule were discussed. However, these methods were not satisfactory with the above experimental results. Thus, in this paper, a new fracture criterion, which is a modification of the linear damage summation rule, is proposed based on the experimental data. In this criterion, fracture is considered to occur when the sum of the fatigue damage, which is the function of the applied cyclic strain magnitude, and the modified creep damage, which is the function of the applied cyclic stress magnitude (determined as time devided by cyclic creep rupture time reflecting difference of creep damages by tensile creep and compressive creep), reaches a constant value. This criterion was successfully applied to the life prediction of materials at HTGR temperatures. (author)

  13. Impact of creep-fatigue interaction on the lifetime of a dispersion strengthened copper alloy in unirradiated and irradiated conditions

    International Nuclear Information System (INIS)

    Singh, B.N.; Toft, P.; Stubbins, J.F.

    2001-06-01

    Creep-fatigue interaction behaviour of a dispersion strengthened copper alloy was investigated at 22 and 250 deg. C. To determine the effect of irradiation a number of fatigue specimens were irradiated at 250 deg. C to a dose level of 0.3 dpa and were tested at 250 deg. C. The creep-fatigue interaction was simulated by applying a certain hold-time on both tension and compression sides of the cyclic loading with a frequency of 0.5 Hz. Hold-times of 0,2, 5, 10, 100 and 1000 seconds were used. For a given hold-time, the real lifetime and the number of cycles to failure were determined at different strain amplitudes. Post-deformation micro-structures and fracture surfaces were investigated using transmission and scanning electron microscopes, respectively. The main results of these investigations are presented and their implications are briefly discussed in the present report. The central conclusion emerging from the present work is that a hold-time of 10 seconds or less causes a drastic decrease in the real lifetime as well as in the number of cycles to failure, particularly at low levels of strain amplitudes. A combination of higher temperature, higher strain amplitude and longer hold-time, on the other hand, may lead to an improvement in the lifetime. The irradiation at 250 deg. C to a dose level of 0.3 dpa does not play any significant role in determining the lifetime under creep-fatigue testing conditions. (au)

  14. Creep-fatigue interaction at high temperature; Proceedings of the Symposium, 112th ASME Winter Annual Meeting, Atlanta, GA, Dec. 1-6, 1991

    Science.gov (United States)

    Haritos, George K.; Ochoa, O. O.

    Various papers on creep-fatigue interaction at high temperature are presented. Individual topics addressed include: analysis of elevated temperature fatigue crack growth mechanisms in Alloy 718, physically based microcrack propagation laws for creep-fatigue-environment interaction, in situ SEM observation of short fatigue crack growth in Waspaloy at 700 C under cyclic and dwell conditions, evolution of creep-fatigue life prediction models, TMF design considerations in turbine airfoils of advanced turbine engines. Also discussed are: high temperature fatigue life prediction computer code based on the total strain version of strainrange partitioning, atomic theory of thermodynamics of internal variables, geometrically nonlinear analysis of interlaminar stresses in unsymmetrically laminated plates subjected to uniform thermal loading, experimental investigation of creep crack tip deformation using moire interferometry. (For individual items see A93-31336 to A93-31344)

  15. Sequential creep-fatigue interaction in austenitic stainless steel type 316L-SPH

    International Nuclear Information System (INIS)

    Tavassoli, A.A.; Mottot, M.; Petrequin, P.

    1986-01-01

    Influence of a prior creep or fatigue exposure on subsequent fatigue or creep properties of stainless steel type 316 L SPH has been investigated. The results obtained are used to verify the validity of time and cycle fraction rule and to obtain information on the effect of very long intermittent hold times on low cycle fatigue properties, as well as on transitory loads occurring during normal service of some structural components of LMFBR reactors. Creep and fatigue tests have been carried out at 600 0 C and under conditions yielding equal or different fatigue saturation and creep stresses. Prior creep damage levels introduced range from primary to tertiary creep, whilst those of fatigue span from 20 to 70 percent of fatigue life. In both creep-fatigue and fatigue-creep sequences in the absence of a permanent prior damage (cavitation or cracking) the subsequent resistance of 316 L-SPH to fatigue or creep is unchanged, if not improved. Thin foils prepared from the specimens confirmed these observations and showed that the dislocation substructure developed during the first mode of testing is quickly replaced by that of the second mode. Grain boundary cavitation does not occur in 316 L-SPH during creep exposures to well beyond the apparent end of secondary stage and as a result prior creep exposures up to approximately 80% of rupture life do not affect fatigue properties. Conversely, significant surface cracks were found in the prior fatigue tested specimens after above about 50% life. In the presence of such cracks the subsequent creep damage was localized at the tip of the main crack and the remaining creep life was found to be usually proportional to the effective specimen cross section. Creep and fatigue sequential damage are not necessarily additive and this type of loadings are in general less severe than the repeated creep-fatigue cycling. 17 refs.

  16. High temperature creep-fatigue design

    International Nuclear Information System (INIS)

    Tavassoli, A. A. F.; Fournier, B.; Sauzay, M.

    2010-01-01

    Generation IV fission and future fusion reactors envisage development of more efficient high temperature concepts where materials performances are key to their success. This paper examines different types of high temperature creep-fatigue interactions and their implications on design rules for the structural materials retained in both programmes. More precisely, the paper examines current status of design rules for the stainless steel type 316L(N), the conventional Modified 9Cr-1Mo martensitic steel and the low activation Eurofer steel. Results obtained from extensive high temperature creep, fatigue and creep-fatigue tests performed on these materials and their welded joints are presented. These include sequential creep-fatigue and relaxation creep-fatigue tests with hold times in tension, in compression or in both. Effects of larger plastic deformations on fatigue properties are studied through cyclic creep tests or fatigue tests with extended hold time in creep. In most cases, mechanical test results are accompanied with microstructural and fractographic observations. In the case of martensitic steels, the effect of oxidation is examined by performing creep-fatigue tests on identical specimens in vacuum. Results obtained are analyzed and their implications on design allowable and creep-fatigue interaction diagrams are presented. While reasonable confidence is found in predicting creep-fatigue damage through existing code procedures for austenitic stainless steels, effects of cyclic softening and coarsening of microstructure of martensitic steels throughout the fatigue life on materials properties need to be taken into account for more precise damage calculations. In the long-term, development of ferritic/martensitic steels with stable microstructure, such as ODS steels, is proposed. (authors)

  17. High temperature creep-fatigue design

    Energy Technology Data Exchange (ETDEWEB)

    Tavassoli, A. A. F.; Fournier, B.; Sauzay, M. [CEA Saclay, DEN DMN, F-91191 Gif Sur Yvette (France)

    2010-07-01

    Generation IV fission and future fusion reactors envisage development of more efficient high temperature concepts where materials performances are key to their success. This paper examines different types of high temperature creep-fatigue interactions and their implications on design rules for the structural materials retained in both programmes. More precisely, the paper examines current status of design rules for the stainless steel type 316L(N), the conventional Modified 9Cr-1Mo martensitic steel and the low activation Eurofer steel. Results obtained from extensive high temperature creep, fatigue and creep-fatigue tests performed on these materials and their welded joints are presented. These include sequential creep-fatigue and relaxation creep-fatigue tests with hold times in tension, in compression or in both. Effects of larger plastic deformations on fatigue properties are studied through cyclic creep tests or fatigue tests with extended hold time in creep. In most cases, mechanical test results are accompanied with microstructural and fractographic observations. In the case of martensitic steels, the effect of oxidation is examined by performing creep-fatigue tests on identical specimens in vacuum. Results obtained are analyzed and their implications on design allowable and creep-fatigue interaction diagrams are presented. While reasonable confidence is found in predicting creep-fatigue damage through existing code procedures for austenitic stainless steels, effects of cyclic softening and coarsening of microstructure of martensitic steels throughout the fatigue life on materials properties need to be taken into account for more precise damage calculations. In the long-term, development of ferritic/martensitic steels with stable microstructure, such as ODS steels, is proposed. (authors)

  18. Microstructure-sensitive Crystal Viscoplasticity for Ni-base Superalloys Targeting Long-term Creep-Fatigue Interaction Modeling

    Energy Technology Data Exchange (ETDEWEB)

    Neu, Richard W.

    2017-09-30

    The aim of this project is to develop a microstructure-sensitive crystal viscoplasticity (CVP) model for single-crystal Ni-base superalloys to model the behavior of the material and components in the hot gas path sections of industrial gas turbines (IGT). Microstructure degradation associated with aging critical to predicting long-term creep-fatigue interactions will be embedded into the model through the γ' precipitate morphology evolution by coupling the coarsening drivers and kinetics into the constitutive equations of the CVP model. Model parameters will be determined using new experimental protocols that involve systematically artificially aging the alloy under different stress conditions to determine the relationship between the size and morphology g' precipitates on the creep and thermomechanical fatigue response.

  19. Microstructure-sensitive Crystal Viscoelasticity for Ni-base Superalloys Targeting Long-term Creep-Fatigue Interaction Modeling

    Energy Technology Data Exchange (ETDEWEB)

    Neu, Richard W

    2016-09-30

    The aim of this project is to develop a microstructure-sensitive crystal viscoplasticity (CVP) model for single-crystal Ni-base superalloys to model the behavior of the material and components in the hot gas path sections of industrial gas turbines (IGT). Microstructure degradation associated with aging critical to predicting long-term creep-fatigue interactions will be embedded into the model through the γ' precipitate morphology evolution by coupling the coarsening drivers and kinetics into the constitutive equations of the CVP model. Model parameters will be determined using new experimental protocols that involve systematically artificially aging the alloy under different stress conditions to determine the relationship between the size and morphology g' precipitates on the creep and thermomechanical fatigue response.

  20. High-Temperature Creep-Fatigue Behavior of Alloy 617

    Directory of Open Access Journals (Sweden)

    Rando Tungga Dewa

    2018-02-01

    Full Text Available This paper presents the high-temperature creep-fatigue testing of a Ni-based superalloy of Alloy 617 base metal and weldments at 900 °C. Creep-fatigue tests were conducted with fully reversed axial strain control at a total strain range of 0.6%, 1.2%, and 1.5%, and peak tensile hold time of 60, 180, and 300 s. The effects of different constituents on the combined creep-fatigue endurance such as hold time, strain range, and stress relaxation behavior are discussed. Under all creep-fatigue tests, weldments’ creep-fatigue life was less than base metal. In comparison with the low-cycle fatigue condition, the introduction of hold time decreased the cycle number of both base metal and weldments. Creep-fatigue lifetime in the base metal was continually decreased by increasing the tension hold time, except for weldments under longer hold time (>180 s. In all creep-fatigue tests, intergranular brittle cracks near the crack tip and thick oxide scales at the surface were formed, which were linked to the mixed-mode creep and fatigue cracks. Creep-fatigue interaction in the damage-diagram (D-Diagram (i.e., linear damage summation was evaluated from the experimental results. The linear damage summation was found to be suitable for the current limited test conditions, and one can enclose all the data points within the proposed scatter band.

  1. Modeling of creep-fatigue interaction of zirconium α under cyclic loading at 200 C

    International Nuclear Information System (INIS)

    Vogel, C.

    1996-04-01

    The present work deals with mechanical behaviour of zirconium alpha at 200 deg. C and crack initiation prediction methods, particularly when loading conditions lead to interaction of fatigue and creep phenomena. A classical approach used to study interaction between cyclic effects and constant loading effects does not give easy understanding of experimental results. Therefore, a new approach has been developed, which allow to determine a number of cycles for crack initiation for complex structures under large loading conditions. To study influence of fatigue and creep interaction on crack initiation, a model was chosen, using a scalar variable, giving representation of the material deterioration state. The model uses a non linear cumulating effect between the damage corresponding to cyclic loads and the damage correlated to time influence. The model belongs to uncoupled approaches between damage and behaviour, which is described here by a two inelastic deformations model. This mechanical behaviour model is chosen because it allows distinction between a plastic and a viscous part in inelastic flow. Cyclic damage is function of stress amplitude and mean stress. For the peculiar sensitivity of the material to creep, a special parameter bas been defined to be critical toward creep damage. It is the kinematic term associated to state variables describing this type of hardening in the viscous mechanism. (author)

  2. A proposal of predictive methods of crack propagation life and remaining life of structural metal under creep-fatigue interacted conditions by use of X-ray profile analysis

    International Nuclear Information System (INIS)

    Ohnami, M.; Sakane, M.; Nishino, S.

    1987-01-01

    The following two series of studies are described: One is crack propagation life prediction in high-temperature low-cycle fatigue tests under triangular and trapezoidal strain or stress waves for austenitic stainless steel by X-ray fractography. Another is remaining life prediction of the steel under creep-fatigue interacted conditions by applying the concept of the remaining life diagram and X-ray profile analysis. Particle size and microstrain obtained by X-ray profile analysis were effective nondestructive parameters for estimating crack propagation life and remaining life in creep-fatigue interaction

  3. Creep fatigue damage under multiaxial conditions

    International Nuclear Information System (INIS)

    Lobitz, D.W.; Nickell, R.E.

    1977-01-01

    When structural components are subjected to severe cyclic loading conditions with intermittent periods of sustained loading at elevated temperature, the designer must guard against a failure mode caused by the interaction of time-dependent and time-independent deformation. This phenomena is referred to as creep-fatigue interaction. The most elementary form of interaction theory (called linear damage summation) is now embodied in the ASME Boiler and Pressure Vessel Code. In recent years, a competitor for the linear damage summation theory has emerged, called strainrange partitioning. This procedure is based upon the visualization of the cyclic strain in a uniaxial creep-fatigue test as a hysteresis loop, with the inelastic strains in the loop counter-balanced in one of two ways. The two theories are compared and contrasted in terms of ease of use, possible inconsistencies, and component life prediction. Future work to further test the damage theories is recommended

  4. The assessment of creep-fatigue initiation and crack growth

    International Nuclear Information System (INIS)

    Priest, R.H.; Miller, D.A.

    1991-01-01

    An outline of Nuclear Electric's Assessment Procedure for the High Temperature Response of Structures ('R5') for creep-fatigue initiation and crack growth is given. A unified approach is adopted for both regimes. For initiation, total damage is described in terms of separate creep and fatigue components. Ductility exhaustion is used for estimating creep damage whilst continuous cycling endurance data are used to evaluate the fatigue damage term. Evidence supporting this approach is given through the successful prediction of creep-fatigue endurances for a range of materials, cycle types, dwell period times, etc. Creep-fatigue crack growth is similarly described in terms of separated creep and fatigue components. Crack growth rates for each component are characterised in terms of fracture mechanics parameters. It is shown that creep crack growth rates can be rationalised on a ductility basis. Creep-fatigue interactions are accommodated in the cyclic growth component through the use of materials coefficients which depend on dwell time. (orig.)

  5. Low cycle fatigue and creep-fatigue interaction behavior of nickel-base superalloy GH4169 at elevated temperature of 650 °C

    Energy Technology Data Exchange (ETDEWEB)

    Chen, G., E-mail: agang@tju.edu.cn [School of Chemical Engineering and Technology, Tianjin University, Tianjin 300072 (China); Zhang, Y. [School of Chemical Engineering and Technology, Tianjin University, Tianjin 300072 (China); Xu, D.K. [Environmental Corrosion Center, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 (China); Lin, Y.C. [School of Mechanical and Electrical Engineering, Central South University, Changsha 410083 (China); Chen, X. [School of Chemical Engineering and Technology, Tianjin University, Tianjin 300072 (China)

    2016-02-08

    Total strain-controlled low cycle fatigue (LCF) tests of a nickel based superalloy were performed at 650 °C. Various hold times were introduced at the peak tensile strain to investigate the high-temperature creep-fatigue interaction (CFI) effects under the same temperature. A substantial decrease in fatigue life occurred as the total strain amplitude increased. Moreover, tensile strain holding further reduced fatigue life. The saturation phenomenon of holding effect was found when the holding period reached 120 s. Cyclic softening occurred during the LCF and CFI process and it was related to the total strain amplitude and the holding period. The relationship between life-time and total strain amplitude was obtained by combining Basquin equation and Coffin-Manson equation. The surface and fracture section of the fatigued specimens were observed via scanning electronic microscope (SEM) to determine the failure mechanism.

  6. Study on creep-fatigue life improvement and life evaluation of 316FR stainless steels

    International Nuclear Information System (INIS)

    Kobayashi, Kazuo; Yamaguchi, Koji; Yamazaki, Masayoshi; Hongo, Hiromichi; Nakazawa, Takanori; Date, Shingo; Tendo, Masayuki

    2000-01-01

    Creep rupture and creep-fatigue interaction tests were conducted at 550deg C for modified 316FR austenitic stainless steels in order to improve the creep-fatigue lives. Reducing the carbon contents from 0.01% to 0.002 or 0.003% and finning the grain size were effective for increasing the creep-fatigue lives and the creep rupture ductilities. From these results, an estimation method of the creep-fatigue lives by using the creep rupture ductilities in the modified 316FR steels was proposed. (author)

  7. Creep-Fatigue Failure Diagnosis

    Science.gov (United States)

    Holdsworth, Stuart

    2015-01-01

    Failure diagnosis invariably involves consideration of both associated material condition and the results of a mechanical analysis of prior operating history. This Review focuses on these aspects with particular reference to creep-fatigue failure diagnosis. Creep-fatigue cracking can be due to a spectrum of loading conditions ranging from pure cyclic to mainly steady loading with infrequent off-load transients. These require a range of mechanical analysis approaches, a number of which are reviewed. The microstructural information revealing material condition can vary with alloy class. In practice, the detail of the consequent cracking mechanism(s) can be camouflaged by oxidation at high temperatures, although the presence of oxide on fracture surfaces can be used to date events leading to failure. Routine laboratory specimen post-test examination is strongly recommended to characterise the detail of deformation and damage accumulation under known and well-controlled loading conditions to improve the effectiveness and efficiency of failure diagnosis. PMID:28793676

  8. On the microstructural basis of creep strength and creep-fatigue interaction in 9-12 % Cr steels for application in power plants

    Energy Technology Data Exchange (ETDEWEB)

    Chilukuru, H

    2007-03-06

    As part of the efforts of preserving the environment it is necessary to reduce of the CO2 emissions from power plants. This can be done by increasing the plant efficiency. Research groups around the world are engaged in developing new steels capable of sustaining higher stresses and temperatures envisaged for high-efficiency power plants. Research carried out in Europe is organized within the COST Programme (Co-Operation in Science and Technology) aiming at replacing the conventional steels of type X20CrMoV121 by the new class of 9-12% Cr-steels with modified composition. The resistance of materials against deformation at elevated temperatures depends on their microstructure. Frequently in 9-12% Cr-steels improved short-term creep properties do not persist in the long-term service [1, 2, 3, 4, 5, 6]. This is related with insufficient microstructural stability. Hardening contributions in 9-12% Cr-steels come from solute atoms of the ferritic matrix, from dislocations, and from precipitates of foreign phases within the matrix. The term ''carbide stabilized substructure hardening'' of 9-12% Cr steels [7, 8] indicates that the hardening contributions are interdependent. The dislocations are the carriers of plastic deformation. They interact with each other, with solute atoms and with precipitates. The dislocation-dislocation interaction leads to formation of planar dislocation networks constituting low-angle boundaries. They form a subgrain structure within the grains. At present, a full and detailed understanding of the effects exerted by the different components of microstructure on creep strength is still lacking. The present work makes a contribution to the efforts of understanding the microstructural basis of creep strength and of creep-fatigue interaction by transmission electron microscopic structure investigations coupled with creep tests. Investigations by transmission electron microscopy (TEM) were carried out with regard to hardening by subgrain boundaries

  9. On the microstructural basis of creep strength and creep-fatigue interaction in 9-12 % Cr steels for application in power plants

    Energy Technology Data Exchange (ETDEWEB)

    Chilukuru, H.

    2007-03-06

    As part of the efforts of preserving the environment it is necessary to reduce of the CO2 emissions from power plants. This can be done by increasing the plant efficiency. Research groups around the world are engaged in developing new steels capable of sustaining higher stresses and temperatures envisaged for high-efficiency power plants. Research carried out in Europe is organized within the COST Programme (Co-Operation in Science and Technology) aiming at replacing the conventional steels of type X20CrMoV121 by the new class of 9-12% Cr-steels with modified composition. The resistance of materials against deformation at elevated temperatures depends on their microstructure. Frequently in 9-12% Cr-steels improved short-term creep properties do not persist in the long-term service [1, 2, 3, 4, 5, 6]. This is related with insufficient microstructural stability. Hardening contributions in 9-12% Cr-steels come from solute atoms of the ferritic matrix, from dislocations, and from precipitates of foreign phases within the matrix. The term ''carbide stabilized substructure hardening'' of 9-12% Cr steels [7, 8] indicates that the hardening contributions are interdependent. The dislocations are the carriers of plastic deformation. They interact with each other, with solute atoms and with precipitates. The dislocation-dislocation interaction leads to formation of planar dislocation networks constituting low-angle boundaries. They form a subgrain structure within the grains. At present, a full and detailed understanding of the effects exerted by the different components of microstructure on creep strength is still lacking. The present work makes a contribution to the efforts of understanding the microstructural basis of creep strength and of creep-fatigue interaction by transmission electron microscopic structure investigations coupled with creep tests. Investigations by transmission electron microscopy (TEM) were carried out with regard to hardening by

  10. Multiaxial creep-fatigue rules

    International Nuclear Information System (INIS)

    Spindler, M.W.; Hales, R.; Ainsworth, R.A.

    1997-01-01

    Within the UK, a comprehensive procedure, called R5, is used to assess the high temperature response of structures. One part of R5 deals with creep-fatigue initiation, and in this paper we describe developments in this part of R5 to cover multiaxial stress states. To assess creep-fatigue, damage is written as the linear sum of fatigue and creep components. Fatigue is assessed using Miner's law with the total endurance split into initiation and growth cycles. Initiation is assessed by entering the curve of initiation cycles vs strain range using a Tresca equivalent strain range. Growth is assessed by entering the curve of growth cycles vs strain range using a Rankine equivalent strain range. The number of allowable cycles is obtained by summing the initiation and growth cycles. In this way the problem of defining an equivalent strain range applicable over a range of endurance is avoided. Creep damage is calculated using ductility exhaustion methods. In this paper we address two aspects; first, the nature of stress relaxation and, hence, accumulated creep strain in multiaxial stress fields; secondly, the effect of multiaxial stress on creep ductility. The effect of multiaxial stress state on creep ductility has been examined using experimental data and mechanistic models. Good agreement is demonstrated between an empirical description of test data and a cavity growth model, provided a simple nucleation criterion is included. A simple scaling factor is applied to uniaxial creep ductility, defined as a function of stress state. The factor is independent of the cavity growth mechanisms and yields a value of equivalent strain which can be conveniently used in determining creep damage by ductility exhaustion. (author). 14 refs, 4 figs

  11. Creep fatigue assessment for EUROFER components

    Energy Technology Data Exchange (ETDEWEB)

    Özkan, Furkan, E-mail: oezkan.furkan@partner.kit.edu; Aktaa, Jarir

    2015-11-15

    Highlights: • Design rules for creep fatigue assessment are developed to EUROFER components. • Creep fatigue assessment tool is developed in FORTRAN code with coupling MAPDL. • Durability of the HCPB-TBM design is discussed under typical fusion reactor loads. - Abstract: Creep-fatigue of test blanket module (TBM) components built from EUROFER is evaluated based on the elastic analysis approach in ASME Boiler Pressure Vessel Code (BPVC). The required allowable number of cycles design fatigue curve and stress-to-rupture curve to estimate the creep-fatigue damage are used from the literature. Local stress, strain and temperature inputs for the analysis of creep-fatigue damage are delivered by the finite element code ANSYS utilizing the Mechanical ANSYS Parametric Design Language (MAPDL). A developed external FORTRAN code used as a post processor is coupled with MAPDL. Influences of different pulse durations (hold-times) and irradiation on creep-fatigue damage for the preliminary design of the Helium Cooled Pebble Bed Test Blanket Module (HCPB-TBM) are discussed for the First Wall component of the TBM box.

  12. Final Report for Project 13-4791: New Mechanistic Models of Creep-Fatigue Crack Growth Interactions for Advanced High Temperature Reactor Components

    Energy Technology Data Exchange (ETDEWEB)

    Kruzic, Jamie J [Oregon State Univ., Corvallis, OR (United States); Siegmund, Thomas [Purdue Univ., West Lafayette, IN (United States); Tomar, Vikas [Purdue Univ., West Lafayette, IN (United States)

    2018-03-20

    This project developed and validated a novel, multi-scale, mechanism-based model to quantitatively predict creep-fatigue crack growth and failure for Ni-based Alloy 617 at 800°C. Alloy 617 is a target material for intermediate heat exchangers in Generation IV very high temperature reactor designs, and it is envisioned that this model will aid in the design of safe, long lasting nuclear power plants. The technical effectiveness of the model was shown by demonstrating that experimentally observed crack growth rates can be predicted under both steady state and overload crack growth conditions. Feasibility was considered by incorporating our model into a commercially available finite element method code, ABAQUS, that is commonly used by design engineers. While the focus of the project was specifically on an alloy targeted for Generation IV nuclear reactors, the benefits to the public are expected to be wide reaching. Indeed, creep-fatigue failure is a design consideration for a wide range of high temperature mechanical systems that rely on Ni-based alloys, including industrial gas power turbines, advanced ultra-super critical steam turbines, and aerospace turbine engines. It is envisioned that this new model can be adapted to a wide range of engineering applications.

  13. Low cycle fatigue and creep fatigue behavior of alloy 617 at high temperature

    International Nuclear Information System (INIS)

    Cabet, Celine; Carroll, Laura; Wright, Richard

    2013-01-01

    Alloy 617 is the leading candidate material for an intermediate heat exchanger (IHX) application of the very high temperature nuclear reactor (VHTR), expected to have an outlet temperature as high as 950 C. Acceptance of Alloy 617 in Section III of the ASME Code for nuclear construction requires a detailed understanding of the creep-fatigue behavior. Initial creep-fatigue work on Alloy 617 suggests a more dominant role of environment with increasing temperature and/or hold times evidenced through changes in creep-fatigue crack growth mechanisms and failure life. Continuous cycle fatigue and creep-fatigue testing of Alloy 617 was conducted at 950 C and 0.3% and 0.6% total strain in air to simulate damage modes expected in a VHTR application. Continuous cycle fatigue specimens exhibited transgranular cracking. Intergranular cracking was observed in the creep-fatigue specimens and the addition of a hold time at peak tensile strain degraded the cycle life. This suggests that creep-fatigue interaction occurs and that the environment may be partially responsible for accelerating failure. (authors)

  14. Improved methods of creep-fatigue life assessment of components

    Energy Technology Data Exchange (ETDEWEB)

    Scholz, Alfred; Berger, Christina [Inst. fuer Werkstoffkunde (IfW), Technische Univ. Darmstadt (Germany)

    2009-07-01

    The improvement of life assessment methods contributes to a reduction of efforts at design and an effective long term operation of high temperature components, reduces technical risk and increases high economical advantages. Creep-fatigue at multi-stage loading, covering cold start, warm start and hot start cycles in typical loading sequences e.g. for medium loaded power plants, was investigated here. At hold times creep and stress relaxation, respectively, lead to an acceleration of crack initiation. Creep fatigue life time can be calculated by a modified damage accumulation rule, which considers the fatigue fraction rule for fatigue damage and the life fraction rule for creep damage. Mean stress effects, internal stress and interaction effects of creep and fatigue are considered. Along with the generation of advanced creep data, fatigue data and creep fatigue data as well scatter band analyses are necessary in order to generate design curves and lower bound properties inclusive. Besides, in order to improve lifing methods the enhancement of modelling activities for deformation and life time are important. For verification purposes, complex experiments at variable creep conditions as well as at creep fatigue interaction under multi-stage loading are of interest. Generally, the development of methods to transfer uniaxial material properties to multiaxial loading situations is a current challenge. For specific design purposes, a constitutive material model is introduced which is implemented as an user subroutine for Finite Element applications due to start-up and shut-down phases of components. Identification of material parameters have been performed by Neural Networks. (orig.)

  15. Creep fatigue design of FBR components

    International Nuclear Information System (INIS)

    Bhoje, S.B.; Chellapandi, P.

    1997-01-01

    This paper deals with the characteristic features of Fast Breeder Reactor (FBR) with reference to creep fatigue, current creep fatigue design approach in compliance with RCCMR (1987) design code, material data, effects of weldments and neutron irradiation, material constitutive models employed, structural analysis and further R and D required for achieving maturity in creep fatigue design of FBR components. For the analysis reported in this paper, material constitutive models developed based on ORNIb (Oak Ridge National Laboratory) and Chaboche viscoplastic theories are employed to demonstrate the potential of FBR components for higher plant temperatures and/or longer life. The results are presented for the studies carried out towards life prediction of Prototype Fast Breeder Reactor (PFBR) components. (author). 24 refs, 8 figs, 5 tabs

  16. Continuous observation of cavity growth and coalescence by creep-fatigue tests in SEM

    International Nuclear Information System (INIS)

    Arai, Masayuki; Ogata, Takashi; Nitta, Akito

    1995-01-01

    Structural components operating at high temperatures in power plants are subjected to interaction of thermal fatigue and creep which results in creep-fatigue damage. In evaluating the life of those components, it is important to understand microscopic damage evolution under creep-fatigue conditions. In this study, static creep and creep-fatigue tests with tensile holdtime were conducted on SUS304 stainless steel by using a high-temperature fatigue machine combined with a scanning electron microscope (SEM), and cavity growth and coalescence behaviors on surface grain boundaries were observed continuously by the SEM. Quantitative analysis of creep cavity growth based on the observation was made for comparison with theoretical growth models. As a result, it was found that grain boundary cavities nucleate at random and grow preferentially on grain boundaries in a direction almost normal to the stress axis. Under the creep condition, the cavities grow monotonously on grain boundaries while they remain the elliptical shape. On the other hand, under the creep-fatigue condition the cavities grow with an effect of local strain distribution around the grain boundary due to cyclic loading and the micro cracks of one grain-boundary length were formed by coalescence of the cavities. Also, cavity nucleation and growth rates for creep-fatigue were more rapid than those for static creep and the constrained cavity growth model coincided well with the experimental data for creep. (author)

  17. Development of nondestructive evaluation of creep-fatigue damage in SUS316 stainless steel

    International Nuclear Information System (INIS)

    Shoji, Tetsuo; Kawahara, Tetsuji; Awano, Masakazu; Sato, Yasumoto

    1999-01-01

    Creep-fatigue is a fatal failure mode of high temperature structural materials. It is recognized that the law of linear damage, according to which creep-fatigue damage is expressed by the sum of the creep damage and the fatigue damage, is inadequate to evaluate creep-fatigue damage. This is due to the fact that the law of linear damage does not include the effect of interaction between the creep damage and the fatigue damage. Consequently, development of direct measurement of damage accumulation on the sample of interest is required for plant life evaluation. In this study, the induced current focusing potential drop (ICFPD) technique was used to evaluate the depth of small surface cracks in SUS316FR stainless steel which was subjected to creep-fatigue damage. It is shown that the potential drop increased during the micro-crack initiation and propagation. Correspondingly, the ICFPD technique applied to estimate micro-crack depth changes was used to accurately evaluate the residual life of creep-fatigue damaged structural materials. (author)

  18. Multiaxial creep-fatigue life analysis using strainrange partitioning

    International Nuclear Information System (INIS)

    Manson, S.S.; Halford, G.R.

    1976-01-01

    Strain-Range Partitioning is a recently developed method for treating creep-fatigue interaction at elevated temperature. Most of the work to date has been on uniaxially loaded specimens, whereas practical applications often involve load multiaxiality. This paper shows how the method can be extended to treat multiaxiality through a set of rules for combining the strain components in the three principal directions. Closed hysteresis loops, as well as plastic and creep strain ratcheting, are included. An application to hold-time tests in torsion is used to illustrate the approach

  19. Creep-fatigue of low cobalt superalloys

    Science.gov (United States)

    Halford, G. R.

    1982-01-01

    Testing for the low cycle fatigue and creep fatigue resistance of superalloys containing reduced amounts of cobalt is described. The test matrix employed involves a single high temperature appropriate for each alloy. A single total strain range, again appropriate to each alloy, is used in conducting strain controlled, low cycle, creep fatigue tests. The total strain range is based upon the level of straining that results in about 10,000 cycles to failure in a high frequency (0.5 Hz) continuous strain-cycling fatigue test. No creep is expected to occur in such a test. To bracket the influence of creep on the cyclic strain resistance, strain hold time tests with ore minute hold periods are introduced. One test per composition is conducted with the hold period in tension only, one in compression only, and one in both tension and compression. The test temperatures, alloys, and their cobalt compositions that are under study are given.

  20. Fatigue and creep-fatigue in sodium of 316 L stainless-steel

    International Nuclear Information System (INIS)

    Ardellier, A.

    1981-03-01

    The present paper describes test-facility developed to perform low-cycle fatigue and creep-fatigue interaction in sodium on stainless steel - 316 L . Fatigue life in sodium and in air are compared. A beneficial effect in sodium is noted

  1. Creep-fatigue damage under multiaxial conditions

    International Nuclear Information System (INIS)

    Lobitz, D.W.; Nickell, R.E.

    1977-02-01

    ASME Code rules for design against creep-fatigue damage for Class 1 nuclear components operating at elevated temperatures are currently being studied by ASME working groups and task forces with a view toward major modification. In addition, the design rules being developed for Class 2 and Class 3 components would be affected by any major modifications of Class 1 Rules. The report represents an attempt to evaluate the differences between two competing procedures--linear damage summation and strainrange partitioning--for multiaxial stress conditions. A modified version of strainrange partitioning is also developed to alleviate some limitations on nonproportional loading

  2. Collect Available Creep-Fatigue Data and Study Existing Creep-Fatigue Evaluation Procedures for Grade 91 and Hastelloy XR

    International Nuclear Information System (INIS)

    Asayama, Tai; Tachibana, Yukio

    2007-01-01

    This report describes the results of investigation on Task 5 of DOE/ASME Materials Project based on a contract between ASME Standards Technology, LLC (ASME ST-LLC) and Japan Atomic Energy Agency (JAEA). Task 5 is to collect available creep-fatigue data and study existing creep-fatigue evaluation procedures for Grade 91 steel and Hastelloy XR. Part I of this report is devoted to Grade 91 steel. Existing creep-fatigue data were collected (Appendix A) and analyzed from the viewpoints of establishing a creep-fatigue procedure for VHTR design. A fair amount of creep-fatigue data has been obtained and creep-fatigue phenomena have been clarified to develop design standards mainly for fast breeder reactors. Following this, existing creep-fatigue procedures were studied and it was clarified that the creep-fatigue evaluation procedure of the ASME-NH has a lot of conservatisms and they were analyzed in detail from the viewpoints of the evaluation of creep damage of material. Based on the above studies, suggestions to improve the ASME-NH procedure along with necessary research and development items were presented. Part II of this report is devoted to Hastelloy XR. Existing creep-fatigue data used for development of the high temperature structural design guideline for High Temperature Gas-cooled Reactor (HTGR) were collected. Creep-fatigue evaluation procedure in the design guideline and its application to design of the intermediate heat exchanger (IHX) for High Temperature Engineering Test Reactor (HTTR) was described. Finally, some necessary research and development items in relation to creep-fatigue evaluation for Gen IV and VHTR reactors were presented.

  3. Nondestructive evaluation of creep-fatigue damage: an interim report

    International Nuclear Information System (INIS)

    Nickell, R.E.

    1977-02-01

    In view of the uncertainties involved in designing against creep-fatigue failure and the consequences of such failures in Class 1 nuclear components that operate at elevated temperature, the possibility of intermittent or even continuous non-destructive examination of these components has been considered. In this interim report some preliminary results on magnetic force and ultrasonic evaluation of creep-fatigue damage in an LMFBR steam generator material are presented. These results indicate that the non-destructive evaluation of pure creep damage will be extremely difficult. A set of biaxial creep-fatigue tests that are designed to discriminate between various failure theories is also described

  4. Collection of creep fatigue laws and their comparison with experimental data

    International Nuclear Information System (INIS)

    Rieunier, J.B.; Dufresne, J.

    1982-07-01

    A systematic investigation has been undertaken to collect the main model describing phenomena of creep-fatigue interaction. A total of 13 models was collected. Simultaneously, 660 experimental data on 304 stainless steel were collected and compared to the results obtained from theoretical models. Conclusion are that none of these models describes correctly all phenomena considered (imposed strain or stress - hold time - two strain levels etc...) but each of those phenomena is well represented by some laws

  5. Assessment of creep-fatigue damage using the UK strain based procedure

    International Nuclear Information System (INIS)

    Bate, S.K.

    1997-01-01

    The UK strain based procedures have been developed for the evaluation of damage in structures, arising from fatigue cycles and creep processes. The fatigue damage is assessed on the basis of modelling crack growth from about one grain depth to an allowable limit which represents an engineering definition of crack formation. Creep damage is based up on the exhaustion of available ductility by creep strain accumulation. The procedures are applicable only when level A and B service conditions apply, as defined in RCC-MR or ASME Code Case N47. The procedures require the components of strain to be evaluated separately, thus they may be used with either full inelastic analysis or simplified methods. To support the development of the UK strain based creep-fatigue procedures an experimental program was undertaken by NNC to study creep-fatigue interaction of structures operating at high temperature. These tests, collectively known as the SALTBATH tests considered solid cylinder and tube-plate specimens, manufactured from Type 316 stainless steel. These specimens were subjected to thermal cycles between 250 deg. C and 600 deg. C. In all the cases the thermal cycle produces tensile residual stresses during dwells at 600 deg. C. One of the tube-plate specimens was used as a benchmark for validating the strain based creep fatigue procedures and subsequently as part of a CEC co-operative study. This benchmark work is described in this paper. A thermal and inelastic stress analysis was carried out using the finite element code ABAQUS. The inelastic behaviour of the material was described using the ORNL constitutive equations. A creep fatigue assessment using the strain based procedures has been compared with an assessment using the RCC-MR inelastic rules. The analyses indicated that both the UK strain based procedures and the RCC-MR rules were conservative, but the conservatism was greater for the RCC-MR rules. (author). 8 refs, 8 figs, 4 tabs

  6. Creep-fatigue of High Temperature Materials for VHTR: Effect of Cyclic Loading and Environment

    Energy Technology Data Exchange (ETDEWEB)

    Celine Cabet; L. Carroll; R. Wright; R. Madland

    2011-05-01

    Alloy 617 is the one of the leading candidate materials for Intermediate Heat eXchangers (IHX) of a Very High Temperature Reactor (VHTR). System start-ups and shut-downs as well as power transients will produce low cycle fatigue (LCF) loadings of components. Furthermore, the anticipated IHX operating temperature, up to 950°C, is in the range of creep so that creep-fatigue interaction, which can significantly increase the fatigue crack growth, may be one of the primary IHX damage modes. To address the needs for Alloy 617 codification and licensing, a significant creep-fatigue testing program is underway at Idaho National Laboratory. Strain controlled LCF tests including hold times up to 1800s at maximum tensile strain were conducted at total strain range of 0.3% and 0.6% in air at 950°C. Creep-fatigue testing was also performed in a simulated VHTR impure helium coolant for selected experimental conditions. The creep-fatigue tests resulted in failure times up to 1000 hrs. Fatigue resistance was significantly decreased when a hold time was added at peak stress and when the total strain was increased. The fracture mode also changed from transgranular to intergranular with introduction of a tensile hold. Changes in the microstructure were methodically characterized. A combined effect of temperature, cyclic and static loading and environment was evidenced in the targeted operating conditions of the IHX. This paper This paper reviews the data previously published by Carroll and co-workers in references 10 and 11 focusing on the role of inelastic strain accumulation and of oxidation in the initiation and propagation of surface fatigue cracks.

  7. Some aspects of thermomechanical fatigue of AISI 304L stainless steel: Part I. creep- fatigue damage

    Science.gov (United States)

    Zauter, R.; Christ, H. J.; Mughrabi, H.

    1994-02-01

    Thermomechanical fatigue (TMF) tests on the austenitic stainless steel AISI 304L have been conducted under “true≓ plastic-strain control in vacuum. This report considers the damage oc-curring during TMF loading. It is shown how the temperature interval and the phasing (in-phase, out-of-phase) determine the mechanical response and the lifetime of the specimens. If creep-fatigue interaction takes place during in-phase cycling, the damage occurs inside the ma-terial, leading to intergranular cracks which reduce the lifetime considerably. Out-of-phase cy-cling inhibits creep-induced damage, and no lifetime reduction occurs, even if the material is exposed periodically to temperatures in the creep regime. A formula is proposed which allows prediction of the failure mode, depending on whether creep-fatigue damage occurs or not. At a given strain rate, the formula is able to estimate the temperature of transition between pure fatigue and creep-fatigue damage.

  8. Creep-fatigue damage in austenitic stainless steels

    International Nuclear Information System (INIS)

    Rezgui, Brahim.

    1980-06-01

    This is a study of hold time effects on the low cycle fatigue (L.C.F.) properties of 316L austenitic stainless steel at 600 0 C in air. Results obtained for different plastic strain levels indicate that a tension hold time at peak strain lead to a reduction in fatigue life. The importance of this effect depend on the length of hold period, and also on the strain amplitude. No saturation had been observed. Metallographic and microstructural analysis of failed specimens indicates mechanisms by which failure is produced. For continuous cycling the fractures occurs by the initiation and the propagation of a trans-granular crack. Creep damage in the bulk of material is formed during periods of tensile stress relaxation; it causes a change in the failure mode which became intergranular. It is the interaction between this creep-damage and fatigue cracks which is partly responsable for the reduction in the fatigue life. Predictions based upon linear cumulative damage method indicate that virgin material properties may be irrelevant in creep-fatigue interactions [fr

  9. Consistent creep and rupture properties for creep-fatigue evaluation

    International Nuclear Information System (INIS)

    Schultz, C.C.

    1978-01-01

    The currently accepted practice of using inconsistent representations of creep and rupture behaviors in the prediction of creep-fatigue life is shown to introduce a factor of safety beyond that specified in current ASME Code design rules for 304 stainless steel Class 1 nuclear components. Accurate predictions of creep-fatigue life for uniaxial tests on a given heat of material are obtained by using creep and rupture properties for that same heat of material. The use of a consistent representation of creep and rupture properties for a mininum strength heat is also shown to provide adequate predictions. The viability of using consistent properties (either actual or those of a minimum heat) to predict creep-fatigue life thus identifies significant design uses for the results of characterization tests and improved creep and rupture correlations

  10. Consistent creep and rupture properties for creep-fatigue evaluation

    International Nuclear Information System (INIS)

    Schultz, C.C.

    1979-01-01

    The currently accepted practice of using inconsistent representations of creep and rupture behaviors in the prediction of creep-fatigue life is shown to introduce a factor of safety beyond that specified in current ASME Code design rules for 304 stainless steel Class 1 nuclear components. Accurate predictions of creep-fatigue life for uniaxial tests on a given heat of material are obtained by using creep and rupture properties for that same heat of material. The use of a consistent representation of creep and rupture properties for a minimum strength heat is also shown to provide reasonable predictions. The viability of using consistent properties (either actual or those of a minimum strength heat) to predict creep-fatigue life thus identifies significant design uses for the results of characterization tests and improved creep and rupture correlations. 12 refs

  11. Evaluation of long term creep-fatigue life for type 304 stainless steel

    International Nuclear Information System (INIS)

    Kawasaki, Hirotsugu; Ueno, Fumiyoshi; Aoto, Kazumi; Ichimiya, Masakazu; Wada, Yusaku

    1992-01-01

    The long term creep-fatigue life of type 304 stainless steel was evaluated by the creep-fatigue life prediction method based on a linear damage fraction rule. The displacement controlled creep-fatigue tests were carried out, and the time to failure of longer than 10000 hours was obtained. The creep damage of long term creep-fatigue was evaluated by taking into account the stress relaxation behavior with elastic follow-up during the hold period. The relationship between life reduction of creep-fatigue and fracture mode was provided by the creep cavity growth. The results of this study are summarized as follows; (1) The long term creep-fatigue data can be reasonably evaluated by the present method. The predicted lives were within a factor of 3 of the observed ones. (2) The present method provides the capability to predict the long term creep-fatigue life at lower temperatures as well as that at the creep dominant temperature. (3) The value of creep damage for the long term creep-fatigue data increased by elastic follow-up. The creep-fatigue damage diagram intercepted between 0.3 and 1 can represent the observed creep-fatigue damages. (4) The cavity growth depends on the hold time. The fracture of long term creep-fatigue is caused by the intergranular cavity growth. The intergranular fracture of creep-fatigue is initiated by the cavity growth and followed by the microcrack propagation along grain boundaries starting from creep cavities. (author)

  12. Life prediction methods for the combined creep-fatigue endurance

    International Nuclear Information System (INIS)

    Wareing, J.; Lloyd, G.J.

    1980-09-01

    The basis and current status of development of the various approaches to the prediction of the combined creep-fatigue endurance are reviewed. It is concluded that an inadequate materials data base makes it difficult to draw sensible conclusions about the prediction capabilities of each of the available methods. Correlation with data for stainless steel 304 and 316 is presented. (U.K.)

  13. The effect of creep-fatigue damage relationships upon HTGR heat exchanger design

    International Nuclear Information System (INIS)

    Kozina, M.M.; King, J.H.; Basol, M.

    1984-01-01

    Materials for heat exchangers in the high temperature gas-cooled reactor (HTGR) are subjected to cyclic loading, extending the necessity to design against fatigue failure into the temperature region where creep processes become significant. Therefore, the fatigue life must be considered in terms of creep-fatigue interaction. In addition, since HTGR heat exchangers are subjected to holds at constant strain levels or constant stress levels in high-temperature environments, the cyclic life is substantially reduced. Of major concern in the design and analysis of HTGR heat exchangers is the accounting for the interaction of creep and fatigue. The accounting is done in conformance to the American Society of Mechanical Engineers Boiler and Pressure Vessel Code, Code Case N-47, which allows the use of the linear damage criterion for interaction of creep and fatigue. This method separates the damage incurred in the material into two parts: one due to fatigue and one due to creep. The summation of the creep-fatigue damage must be less than 1.0. Recent material test data have indicated that the assumption of creep and fatigue damage equals unity at failure may not always be valid for materials like Alloy 800H, which is used in the higher temperature sections of HTGR steam generators. Therefore, a more conservative creep-fatigue damage relationship was postulated for Alloy 800H. This more conservative bilinear damage relationship consists of a design locus drawn from D F =1.0, D C =0 to D F =0.1, D C =0.1 to D F =0, D C =1.0. D F is the fatigue damage and D C is the creep damage. A more conservative damage relationship for 2-1/4 Cr-1 Mo material consisted of including factors that degrade the fatigue curves. These revised relationships were used in a structural evaluation of the HTGR steam cycle/cogeneration (SC/C) steam generator design. The HTGR-SC/C steam generator, a once-through type, is comprised of an economizer-evaporator-superheater (ESS) helical bundle of 2-1/4 Cr-1

  14. The Effect of Hold Time on Creep-Fatigue in 9Cr-1Mo

    Energy Technology Data Exchange (ETDEWEB)

    Oh, Tae Young; Kim, Dae Whan; Kim, Yong Wan [Korea Atomic Energy Research Institute, Daejeon (Korea, Republic of); Baek, Kyoung Ho [Chungnam National University, Daejeon (Korea, Republic of)

    2009-05-15

    9Cr-1Mo steel is a candidate material for reactor vessel for VHTR. Because 9Cr-1Mo steel has a good mechanical properties and a lower thermal expansion coefficient than austenitic stainless steel. The reactor vessel of VHTR is operated at about 450 .deg. C. At this temperature, fatigue occurs during start-up and cool-down, and creep occurs during normal operation. Creep-fatigue damage by the interaction between fatigue and creep is an important factor that limits VHTR reactor vessel life. In this study, Effect of hold time on low cycle fatigue behavior of 9Cr-1Mo at 600 .deg. C was investigated in air.

  15. The Effect of Hold Time on Creep-Fatigue in 9Cr-1Mo

    International Nuclear Information System (INIS)

    Oh, Tae Young; Kim, Dae Whan; Kim, Yong Wan; Baek, Kyoung Ho

    2009-01-01

    9Cr-1Mo steel is a candidate material for reactor vessel for VHTR. Because 9Cr-1Mo steel has a good mechanical properties and a lower thermal expansion coefficient than austenitic stainless steel. The reactor vessel of VHTR is operated at about 450 .deg. C. At this temperature, fatigue occurs during start-up and cool-down, and creep occurs during normal operation. Creep-fatigue damage by the interaction between fatigue and creep is an important factor that limits VHTR reactor vessel life. In this study, Effect of hold time on low cycle fatigue behavior of 9Cr-1Mo at 600 .deg. C was investigated in air

  16. Improved methods for prediction of creep-fatigue in next generation conventional and nuclear plant

    International Nuclear Information System (INIS)

    Payten, Warwick

    2012-01-01

    Materials technology poses a major challenge in the design and construction of next generation super critical/ultra super critical power plant (SC/USC) and Generation IV (GenIV) nuclear plant. New plant is expected to have in the order of a 60 year life-time, imposing complex design difficulties in areas of creep rupture and creep fatigue damage. For SC/USC plant, the main goal is the enhancement of performance by raising the steam pressure and temperatures. In order to achieve these goals materials with acceptable creep rupture strength at design temperatures and pressures must be used. In GenIV designs, the issue is more complex, with both low and high tempera-ture designs. A key requirement in the majority of the designs, however, will be acceptable resistance to creep rupture, fatigue cracking, creep fatigue interactions, with the additional effects of void swelling and irradiation creep. The accumulation of creep fatigue damage over time in both SC/USC and GenIV plant will be one of the principal damage mechanisms. This will eventually lead to crack initiation in critical high temperature equipment. Hence, improved knowledge of creep and fatigue interactions is a necessary development as components in power-generating plants move to operate at high temperature under cyclic conditions. The key to safe, reliable operation of these high-energy plants will depend on understanding the factors that affect damage initiation and propagation, as well as developing and validating technologies to predict the accumulation of damage in systems and components.

  17. IFMIF - Design Study for in Situ Creep Fatigue Tests

    International Nuclear Information System (INIS)

    Gordeev, S.; Heinzel, V.; Simakov, St.; Stratmanns, E.; Vladimirov, P.; Moeslang, A.

    2006-01-01

    While the high flux volume (20-50 dpa/fpy) of the International Fusion Materials Irradiation Facility (IFMIF) is dedicated to the irradiation of ∼ 1100 qualified specimens that will be post irradiation examined after disassembling in dedicated Hot Cells, various in situ experiments are foreseen in the medium flux volume (1-20 dpa/fpy). Of specific importance for structural lifetime assessments of fusion power reactors are instrumented in situ creep-fatigue experiments, as they can simulate realistically a superposition of thermal fatigue or creep fatigue and irradiation with fusion relevant neutrons. Based on former experience with in situ fatigue tests under high energy light ion irradiation, a design study has been performed to evaluate the feasibility of in situ creep fatigue tests in the IFMIF medium flux position. The vertically arranged test module for such experiments consists basically of a frame similar to a universal testing machine, but equipped with three pulling rods, driven by independent step motors, instrumentation systems and specimen cooling systems. Therefore, three creep fatigue specimens may be tested at one time in this apparatus. Each specimen is a hollow tube with coolant flow in the specimen interior to maintain individual specimen temperatures. The recently established IFMIF global 3D geometry model was used together the latest McDeLicious code for the neutral and charged particle transport calculations. These comprehensive neutronics calculations have been performed with a fine special resolution of 0.25 cm 3 , showing among others that the specimens will be irradiated with a homogeneous damage rate of up to 13(∼ 9%) dpa/fpy and a fusion relevant damage to helium ratio of 10-12 appm He/dpa. In addition, damage and gas production rates as well as the heat deposition in structural parts of the test module have been calculated. Despite of the vertical gradients in the nuclear heating, CFD code calculations with STAR-CD revealed very

  18. Creep-fatigue life assessment of cruciform weldments using the linear matching method

    International Nuclear Information System (INIS)

    Gorash, Yevgen; Chen, Haofeng

    2013-01-01

    This paper presents a creep-fatigue life assessment of a cruciform weldment made of the steel AISI type 316N(L) and subjected to reversed bending and cyclic dwells at 550 °C using the Linear Matching Method (LMM) and considering different weld zones. The design limits are estimated by the shakedown analysis using the LMM and elastic-perfectly-plastic material model. The creep-fatigue analysis is implemented using the following material models: 1) Ramberg–Osgood model for plastic strains under saturated cyclic conditions; 2) power-law model in “time hardening” form for creep strains during primary creep stage. The number of cycles to failure N ⋆ under creep-fatigue interaction is defined by: a) relation for cycles to fatigue failure N ∗ dependent on numerical total strain range Δε tot for the fatigue damage ω f ; b) long-term strength relation for the time to creep rupture t ∗ dependent on numerical average stress σ ¯ during dwell Δt for the creep damage ω cr ; c) non-linear creep-fatigue interaction diagram for the total damage. Numerically estimated N ⋆ for different Δt and Δε tot shows good quantitative agreement with experiments. A parametric study of different dwell times Δt is used to formulate the functions for N ⋆ and residual life L ⋆ dependent on Δt and normalised bending moment M -tilde , and the corresponding contour plot intended for design applications is created. -- Highlights: ► Ramberg–Osgood model is used for plastic strains under saturated cyclic conditions. ► Power-law model in time-hardening form is used for creep strains during dwells. ► Life assessment procedure is based on time fraction rule to evaluate creep damage. ► Function for cycles to failure is dependent on dwell period and normalised moment. ► Function for FSRF dependent on dwell period takes into account the effect of creep

  19. Standard test method for creep-fatigue testing

    CERN Document Server

    American Society for Testing and Materials. Philadelphia

    2009-01-01

    1.1 This test method covers the determination of mechanical properties pertaining to creep-fatigue deformation or crack formation in nominally homogeneous materials, or both by the use of test specimens subjected to uniaxial forces under isothermal conditions. It concerns fatigue testing at strain rates or with cycles involving sufficiently long hold times to be responsible for the cyclic deformation response and cycles to crack formation to be affected by creep (and oxidation). It is intended as a test method for fatigue testing performed in support of such activities as materials research and development, mechanical design, process and quality control, product performance, and failure analysis. The cyclic conditions responsible for creep-fatigue deformation and cracking vary with material and with temperature for a given material. 1.2 The use of this test method is limited to specimens and does not cover testing of full-scale components, structures, or consumer products. 1.3 This test method is primarily ...

  20. Elastic creep-fatigue evaluation for ASME code

    International Nuclear Information System (INIS)

    Severud, L.K.; Winkel, B.V.

    1987-01-01

    Experience with applying the ASME Code Case N-47 rules for evaluation of creep-fatigue with elastic analysis results has been problematic. The new elastic evaluation methods are intended to bound the stress level and strain range values needed for use in employing the code inelastic analysis creep-fatigue damage counting procedures. To account for elastic followup effects, ad hoc rules for stress classification, shakedown, and ratcheting are employed. Because elastic followup, inelastic strain concentration, and stress-time effects are accounted for, the design fatigue curves in Case N-47 for inelastic analysis are used instead of the more conservative elastic analysis curves. Creep damage assessments are made using an envelope stress-time history that treats multiple load events and repeated cycles during elevated temperature service life. (orig./GL)

  1. A cycle combining method for creep fatigue analysis

    International Nuclear Information System (INIS)

    Debaene, J.P.; Permezel, P.

    1987-01-01

    In codes such as RCC-Mr (2) or code case N 47, rules are written against the creep fatigue damage. During the design phase, the order of succession of transients is not known. In that case, the codes require to take the order of events which leads to the maximum damage, but they don't give the detailed rules to perform it. The method we present here consists in building the totality of possible loading histories. For each loading history we calculate the creep fatigue damage V+W. The choice of the most severe loading history is done a posteriori. In practice, we are lead to uncouple the calculation of V and W. We proceed as follows: 1. Build all the loading histories able to masimize V. 2. For each of these loading histories, maximize W. 3. Choose a posteriori the most damaging loading history. (orig./GL)

  2. Predominantly elastic crack growth under combined creep-fatigue cycling

    International Nuclear Information System (INIS)

    Lloyd, G.J.

    1979-01-01

    A rationalization of the various observed effects of combined creep-fatigue cycling upon predominantly elastic fatigue-crack propagation in austenitic steel is presented. Existing and new evidence is used to show two main groups of behaviour: (i) material and cycling conditions which lead to modest increases (6-8 times) in the rate of crack growth are associated with relaxation-induced changes in the material deformation characteristics, and (ii) material and cycling conditions severe enough to generate internal fracture damage lead to significant (up to a factor of 30) increases in crack growth rate when compared with fast-cycling crack propagation rates at the same temperature. A working hypothesis is presented to show that the boundary between the two groups occurs when the scale of the nucleated creep damage is of the same magnitude as the crack tip opening displacement. This leads to the possibility of unstable crack advance. Creep crack growth rates are shown to provide an upper bound to creep-fatigue crack growth rates when crack advance is unstable. If the deformation properties only are affected by the creep-fatigue cycling then creep crack growth rates provide a lower bound. The role of intergranular oxygen corrosion in very low frequency crack growth tests is also briefly discussed. (author)

  3. Standard test method for creep-fatigue crack growth testing

    CERN Document Server

    American Society for Testing and Materials. Philadelphia

    2010-01-01

    1.1 This test method covers the determination of creep-fatigue crack growth properties of nominally homogeneous materials by use of pre-cracked compact type, C(T), test specimens subjected to uniaxial cyclic forces. It concerns fatigue cycling with sufficiently long loading/unloading rates or hold-times, or both, to cause creep deformation at the crack tip and the creep deformation be responsible for enhanced crack growth per loading cycle. It is intended as a guide for creep-fatigue testing performed in support of such activities as materials research and development, mechanical design, process and quality control, product performance, and failure analysis. Therefore, this method requires testing of at least two specimens that yield overlapping crack growth rate data. The cyclic conditions responsible for creep-fatigue deformation and enhanced crack growth vary with material and with temperature for a given material. The effects of environment such as time-dependent oxidation in enhancing the crack growth ra...

  4. Creep-Fatigue Relationsihps in Electroactive Polymer Systems and Predicted Effects in an Actuator Design

    Science.gov (United States)

    Vinogradov, Aleksandra M.; Ihlefeld, Curtis M.; Henslee, Issac

    2009-01-01

    The paper concerns the time-dependent behavior of electroactive polymers (EAP) and their use in advanced intelligent structures for space exploration. Innovative actuator design for low weight and low power valves required in small plants planned for use on the moon for chemical analysis is discussed. It is shown that in-depth understanding of cyclic loading effects observed through accelerated creep rates due to creep-fatigue interaction in polymers is critical in terms of proper functioning of EAP based actuator devices. In the paper, an overview of experimental results concerning the creep properties and cyclic creep response of a thin film piezoelectric polymer polyvinylidene fluoride (PVDF) is presented. The development of a constitutive creep-fatigue interaction model to predict the durability and service life of electroactive polymers is discussed. A novel method is proposed to predict damage accumulation and fatigue life of polymers under oyclic loading conditions in the presence of creep. The study provides a basis for ongoing research initiatives at the NASA Kennedy Space Center in the pursuit of new technologies using EAP as active elements for lunar exploration systems.

  5. Elastic creep-fatigue evaluation for ASME [American Society of Mechanical Engineers] code

    International Nuclear Information System (INIS)

    Severud, L.K.; Winkel, B.V.

    1987-02-01

    Reassessment of past ASME N-47 creep-fatigue rules have been under way by committee members. The new proposed elastic creep-fatigue methods are easier to apply than those previously in the code case. They also provide a wider range of practical application while still providing conservative assessments. It is expected that new N-47 code rules for elastic creep-fatigue evaluation will be adopted in the near future

  6. Creep-fatigue behavior of turbine disc of superalloy GH720Li at 650 °C and probabilistic creep-fatigue modeling

    Energy Technology Data Exchange (ETDEWEB)

    Hu, Dianyin [School of Energy and Power Engineering, Beihang University, Beijing 100191 (China); Collaborative Innovation Center of Advanced Aero-Engine, Beijing 100191 (China); Beijing Key Laboratory of Aero-Engine Structure and Strength, Beijing 100191 (China); Ma, Qihang [School of Energy and Power Engineering, Beihang University, Beijing 100191 (China); Shang, Lihong [Mining and Materials Engineering, McGill University, Montreal, QC H3A 0C5 (Canada); Gao, Ye [School of Energy and Power Engineering, Beihang University, Beijing 100191 (China); Wang, Rongqiao, E-mail: wangrq@buaa.edu.cn [School of Energy and Power Engineering, Beihang University, Beijing 100191 (China); Collaborative Innovation Center of Advanced Aero-Engine, Beijing 100191 (China); Beijing Key Laboratory of Aero-Engine Structure and Strength, Beijing 100191 (China)

    2016-07-18

    Creep-fatigue experiments have been conducted in nickel-based superalloy GH720Li at an elevated temperature of 650 °C with a stress ratio of 0.1, based on which, different dwell times at the maximum loading were applied to investigate the effect of dwell time on the creep-fatigue behaviors. The tested specimens were cut from the rim region of an actual turbine disc in the hoop direction. The grain size and precipitates of the GH720Li superalloy were examined through scanning electronic microscope (SEM) and energy-dispersive X-ray spectroscopy (EDS) analyses. Experimental data shows creep-fatigue lifetime decreases as the dwell time prolongs. Further, different scattering was observed in the creep-fatigue lifetime at different dwell times. Then a probabilistic model based on the applied mechanical work density (AMWD), with a linear heteroscedastic function that evaluates the non-constant deviation in the creep-fatigue lifetime, was formulated to describe the dependence of creep-fatigue lifetime on the dwell time. Finally, the possible microscopic mechanism of the creep-fatigue behavior has been discussed by SEM with EDS on the fracture surfaces.

  7. A survey of the French creep-fatigue design rules for LMFBR

    International Nuclear Information System (INIS)

    Tribout, J.; Cordier, G.; Moulin, D.

    1987-01-01

    The paper provides a survey of the creep-fatigue design rules for the LMFBR in France. These rules are the ones currently implemented in French component manufacturing. The background of each item is discussed and the trends for improvements currently investigated are described. The creep-fatigue rules apply to elastic analysis only. (orig.)

  8. A knowledge based system for creep-fatigue assessment

    International Nuclear Information System (INIS)

    Holdsworth, S.R.

    1999-01-01

    A knowledge based system was developed in the BRITE-EURAM C-FAT project to store the material property information necessary to perform complex creep-fatigue assessments and to thereby improve the effectiveness of data retrieval for such purposes. The C-FAT KBS incorporates a multi-level database which is structured to contain not only 'reduced' deformation and fracture test data, but also to enable ready access to the derived parameter constants for the constitutive and model equations used in a range of assessment procedures. The data management scheme is reviewed. The C-FAT KBS also has a dynamic worked example module which allows the sensitivity of predicted lifetimes to material property input data to be evaluated by a number of procedures. Complex cycle creep-fatigue endurance predictions are particularly sensitive to the creep property data used in assessment, and this is demonstrated with reference to the results of a number of large single edge notched bend specimen feature tests performed on a 1CrMoV turbine casting steel at 550 C. (orig.)

  9. Evaluation of creep-fatigue life prediction methods for low-carbon/nitrogen-added SUS316

    International Nuclear Information System (INIS)

    Takahashi, Yukio

    1998-01-01

    Low-carbon/medium nitrogen 316 stainless steel called 316FR is a principal candidate for the high-temperature structural materials of a demonstration fast reactor plant. Because creep-fatigue damage is a dominant failure mechanism of the high-temperature materials subjected to thermal cycles, it is important to establish a reliable creep-fatigue life prediction method for this steel. Long-term creep tests and strain-controlled creep-fatigue tests have been conducted at various conditions for two different heats of the steel. In the constant load creep tests, both materials showed similar creep rupture strength but different ductility. The material with lower ductility exhibited shorter life under creep-fatigue loading conditions and correlation of creep-fatigue life with rupture ductility, rather than rupture strength, was made clear. Two kinds of creep-fatigue life prediction methods, i.e. time fraction rule and ductility exhaustion method were applied to predict the creep-fatigue life. Accurate description of stress relaxation behavior was achieved by an addition of 'viscous' strain to conventional creep strain and only the latter of which was assumed to contribute to creep damage in the application of ductility exhaustion method. The current version of the ductility exhaustion method was found to have very good accuracy in creep-fatigue life prediction, while the time fraction rule overpredicted creep-fatigue life as large as a factor of 30. To make a reliable estimation of the creep damage in actual components, use of ductility exhaustion method is strongly recommended. (author)

  10. A metallographic examination of structural degradation during creep-fatigue

    International Nuclear Information System (INIS)

    Hales, R.

    1979-07-01

    A series of specimens of T316 stainless steel, which had been tested under creep-fatigue conditions, has been examined by optical and scanning electron microscopy. The development of cavities which are associated with grain-boundary carbide precipitates has been recorded. These cavities increase in size and number with increasing hold time at peak tensile strain and cause the propagating fatigue crack to follow an intergranular path. At a strain range of +- 0.25% the dominant damage mechanism is due to creep damage when the tensile hold time is greater than one minute. The fatigue crack which causes final failure is nucleated at a stress raiser and it is possible that in a smooth specimen failure may occur without the nucleation of a fatigue crack at all but rather by ductile shearing. (author)

  11. Creep-fatigue rules in the RCC-MR code

    International Nuclear Information System (INIS)

    Drubay, B.

    1988-01-01

    In 1978, CEA, Electricite de France (EDF) and NOVATOME decided to draw up a complete set of design and construction rules for LMFBR components. This RCC-MR code issued in June 1985 and completed in November 1987 was chosen as a sound basis for the next European Fast Reactor (EFR). The purpose of this paper is to describe the present RCC-MR creep-fatigue design rules to be applied with elastic analysis including the modifications adopted in the first addenda. This method is based on a separate evaluation of a fatigue usage fraction V and creep rupture usage fraction W with the common linear summation rule. The fatigue usage fraction is obtained from continuous fatigue curves (without hold times) and from total strain ranges (elastic + plastic + creep). The creep rupture usage fraction W is obtained from stress to rupture curves and a stress σk evaluating the stress generated during the cycle. (author)

  12. Creep, fatigue and creep-fatigue damage evaluation and estimation of remaining life of SUS 304 austenitic stainless steel at high temperature

    International Nuclear Information System (INIS)

    Nishino, Seiichi; Sakane, Masao; Ohnami, Masateru

    1986-01-01

    Experimental study was made on the damage evaluation and estimation of remaining life of SUS 304 stainless steel in creep, low-cycle fatigue and creep-fatigue at 873 K in air. Creep, fatigue and creep-fatigue damage curves were drawn by the method proposed by D.A. Woodford and the relations between these damages and non-destructive parameters, i.e., microvickers hardness and quantities obtained from X-ray diffraction, were discussed. From these tests, the following conclusions were obtained. (1) Constant damage lines in the diagram of remaining lives in creep and fatigue could be drawn by changing load levels during the tests. Constant damage lines in creep-fatigue were also made by a linear damage rule using both static creep and fatigue damage curves, which agree well with the experimental data in creep-fatigue. (2) Microvickers hardness and half-value breadth in X-ray diffraction are appropriate parameters to evaluate creep damage but are not proper to evaluate fatigue damage. Particle size and microstrain obtained by X-ray profile analysis are good parameters to evaluate both creep and fatigue damages. (author)

  13. Magnetic characterization of creep-fatigue damage for energy structural materials

    International Nuclear Information System (INIS)

    Suzuki, Takayuki; Hashidate, Ryuta; Harada, Yoshihisa

    2012-01-01

    Magnetic characterization of creep-fatigue damage for welded specimens of austenitic stainless steel (SUS316FR) and high-chromium steel (Mod.9Cr-1Mo) steel was performed using magnetic force microscope and Hall sensor. In SUS316FR volume fraction of δ-ferrite at weld metal region decreased by creep or creep-fatigue and the remanent magnetic flux density at weld metal region also decreased. In Mod.9Cr-1Mo steel magnetic characteristics at weld metal region were different from those at base metal initially, however, during creep or creep fatigue the difference of magnetic characteristics between welded metal and base metal became small. It was found that the degradation mechanism for these energy structural materials during creep or creep fatigue could be clarified by magnetic characterization techniques. (author)

  14. Creep-fatigue deformation behaviour of OFHC-copper and CuCrZr alloy with different heat treatments and with and without neutron irradiation

    International Nuclear Information System (INIS)

    Singh, B.N.; Johansen, B.S.; Li, M.; Stubbins, J.F.

    2005-08-01

    The creep-fatigue interaction behaviour of a precipitation hardened CuCrZr alloy was investigated at 295 and 573 K. To determine the effect of irradiation a number of fatigue specimens were irradiated at 333 and 573 K to a dose level in the range of 0.2 - 0.3 dpa and were tested at room temperature and 573 K, respectively. The creep-fatigue deformation behaviour of OFHC-copper was also investigated but only in the unirradiated condition and at room temperature. The creep-fatigue interaction was simulated by applying a certain holdtime on both tension and compression sides of the cyclic loading with a frequency of 0.5 Hz. Holdtimes of up to 1000 seconds were used. Creep-fatigue experiments were carried out using strain, load and extension controlled modes of cyclic loading. In addition, a number of 'interrupted' creep-fatigue tests were performed on the prime aged CuCuZr specimens in the strain controlled mode with a strain amplitude of 0.5% and a holdtime of 10 seconds. The lifetimes in terms of the number of cycles to failure were determined at different strain and load amplitudes at each holdtime. Post-deformation microstructures was investigated using a transmission electron microscopy. The main results of these investigations are presented and their implications are briefly discussed in the present report. The central conclusion emerging from the present work is that the application of holdtime generally reduces the number of cycles to failure. The largest reduction was found to be in the case of OFHC-copper. Surprisingly, the magnitude of this reduction is found to be larger at lower levels of strain or stress amplitudes, particularly when the level of the stress amplitude is below the monotonic yield strength of the material. The reduction in the yield strength due to overaging heat treatments causes a substantial decrease in the number of cycles to failure at all holdtimes investigated. The increase in the yield strength due to neutron irradiation at 333 K

  15. Multi Resolution In-Situ Testing and Multiscale Simulation for Creep Fatigue Damage Analysis of Alloy 617

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Yongming [Arizona State Univ., Tempe, AZ (United States). School for Engineering of Matter, Transport and Energy; Oskay, Caglar [Vanderbilt Univ., Nashville, TN (United States). Dept. of Civil and Environmental Engineering

    2017-04-30

    This report outlines the research activities that were carried out for the integrated experimental and simulation investigation of creep-fatigue damage mechanism and life prediction of Nickel-based alloy, Inconel 617 at high temperatures (950° and 850°). First, a novel experimental design using a hybrid control technique is proposed. The newly developed experimental technique can generate different combinations of creep and fatigue damage by changing the experimental design parameters. Next, detailed imaging analysis and statistical data analysis are performed to quantify the failure mechanisms of the creep fatigue of alloy 617 at high temperatures. It is observed that the creep damage is directly associated with the internal voids at the grain boundaries and the fatigue damage is directly related to the surface cracking. It is also observed that the classical time fraction approach does not has a good correlation with the experimental observed damage features. An effective time fraction parameter is seen to have an excellent correlation with the material microstructural damage. Thus, a new empirical damage interaction diagram is proposed based on the experimental observations. Following this, a macro level viscoplastic model coupled with damage is developed to simulate the stress/strain response under creep fatigue loadings. A damage rate function based on the hysteresis energy and creep energy is proposed to capture the softening behavior of the material and a good correlation with life prediction and material hysteresis behavior is observed. The simulation work is extended to include the microstructural heterogeneity. A crystal plasticity finite element model considering isothermal and large deformation conditions at the microstructural scale has been developed for fatigue, creep-fatigue as well as creep deformation and rupture at high temperature. The model considers collective dislocation glide and climb of the grains and progressive damage accumulation of

  16. Creep-fatigue life prediction method using Diercks equation for Cr-Mo steel

    International Nuclear Information System (INIS)

    Sonoya, Keiji; Nonaka, Isamu; Kitagawa, Masaki

    1990-01-01

    For dealing with the situation that creep-fatigue life properties of materials do not exist, a development of the simple method to predict creep-fatigue life properties is necessary. A method to predict the creep-fatigue life properties of Cr-Mo steels is proposed on the basis of D. Diercks equation which correlates the creep-fatigue lifes of SUS 304 steels under various temperatures, strain ranges, strain rates and hold times. The accuracy of the proposed method was compared with that of the existing methods. The following results were obtained. (1) Fatigue strength and creep rupture strength of Cr-Mo steel are different from those of SUS 304 steel. Therefore in order to apply Diercks equation to creep-fatigue prediction for Cr-Mo steel, the difference of fatigue strength was found to be corrected by fatigue life ratio of both steels and the difference of creep rupture strength was found to be corrected by the equivalent temperature corresponding to equal strength of both steels. (2) Creep-fatigue life can be predicted by the modified Diercks equation within a factor of 2 which is nearly as precise as the accuracy of strain range partitioning method. Required test and analysis procedure of this method are not so complicated as strain range partitioning method. (author)

  17. An assessment of the linear damage summation method for creep-fatigue failure with reference to a cast of type 316 stainless steel tested at 570 deg. C

    International Nuclear Information System (INIS)

    Wareing, J.; Bretherton, I.

    This paper presents preliminary results from the programme for hold period tests on a cast BQ of type 316 stainless steel at 570 deg. C. The results of tensile hold period tests on a relatively low ductility cast of type 316 stainless steel have indicated that the failure mechanism changes from a creep-fatigue interaction failure to a creep dominated failure at low strain levels. An assessment of the linear damage summation approach for failure prediction indicates that it is inappropriate for creep-fatigue interaction failures. For creep dominated fracture, failure occurs when the accumulation relaxation strain exhausts the material ductility i.e. Nsub(f epsilon R)=D. The failure criterion based on a creep summation in terms of time to fracture underestimates life

  18. Study on the effect of prior fatigue and creep-fatigue damage on the fatigue and creep characteristics of 316 FR stainless steel. 2nd report. The effect of prior creep-fatigue damage on the creep and fatigue characteristics

    International Nuclear Information System (INIS)

    Yamauchi, Masafumi; Chuman, Yasuharu; Otani, Tomomi; Takahashi, Yukio

    2001-01-01

    The effect of prior creep-fatigue damage on the creep and the fatigue characteristics was studied to investigate the creep-fatigue life evaluation procedure of 316FR stainless steel. Creep and fatigue tests were conducted at 550degC by using the specimen exposed to prior creep-fatigue cycles at the same temperature and interrupted at 1/4 Nf, 1/2 Nf and 3/4 Nf cycle. The creep and fatigue strength of the pre-damaged material showed monotonic reduction with the prior creep-fatigue damage compared with the virgin material. The creep ductility also showed monotonic reduction with the prior creep-fatigue damage. These results were evaluated by the stress-based Time Fraction Rule and the strain-based Ductility Exhaustion Method. The result showed that the application of the Ductility Exhaustion Method to the creep-fatigue damage evaluation is more promising than the Time Fraction Rule. (author)

  19. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    International Nuclear Information System (INIS)

    Li Guangdong; Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu

    2010-01-01

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  20. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder

    Energy Technology Data Exchange (ETDEWEB)

    Li Guangdong, E-mail: liguangdong@emails.bjut.edu.c [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China); Shi Yaowu; Hao Hu; Xia Zhidong; Lei Yongping; Guo Fu [College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124 (China)

    2010-02-18

    In the present work, the effect of phosphorus on the creep fatigue properties of Sn-Cu eutectic lead-free solder was carried out. The experimental results show that the melting temperature was almost not changed with adding small amount of P element. However, the addition of trace P element led to the decrease in the property of creep fatigue. The fractography analysis by a scanning electron microscopy (SEM) shows that ductile fracture was the dominant failure behavior in the process of creep fatigue test of Sn0.7Cu and Sn0.7Cu0.005P specimens. It should be pointed out that there is significant difference in the fractographs between the joints of Sn0.7Cu solder and Sn0.7Cu0.005P solder. In the fractograph of Sn0.7Cu solder joint, the microstructure is prolonged along testing direction, and the dimples were more than the fractograph of Sn0.7Cu0.005P solder joint. In addition, the voids could be found on the Sn0.7Cu0.005P solder joint, and trace P addition may increase the rate of forming void of Sn0.7Cu solder joint. The voids can potentially lead to crack initiation or propagation sites in the solder joint. As a result, the creep fatigue of solder joint containing P such as Sn0.7Cu0.005P offers worse property compared to Sn0.7Cu solder joint.

  1. Thermal stress and creep fatigue limitations in first wall design

    International Nuclear Information System (INIS)

    Majumdar, S.; Misra, B.; Harkness, S.D.

    1977-01-01

    The thermal-hydraulic performance of a lithium cooled cylindrical first wall module has been analyzed as a function of the incident neutron wall loading. Three criteria were established for the purpose of defining the maximum wall loading allowable for modules constructed of Type 316 stainless steel and a vanadium alloy. Of the three, the maximum structural temperature criterion of 750 0 C for vanadium resulted in the limiting wall loading value of 7 MW/m 2 . The second criterion limited thermal stress levels to the yield strength of the alloy. This led to the lowest wall loading value for the Type 316 stainless steel wall (1.7 MW/m 2 ). The third criterion required that the creep-fatigue characteristics of the module allow a lifetime of 10 MW-yr/m 2 . At wall temperatures of 600 0 C, this lifetime could be achieved in a stainless steel module for wall loadings less than 3.2 MW/m 2 , while the same lifetime could be achieved for much higher wall loadings in a vanadium module

  2. Image-based creep-fatigue damage mechanism investigation of Alloy 617 at 950 °C

    Energy Technology Data Exchange (ETDEWEB)

    Tahir, Fraaz; Dahire, Sonam; Liu, Yongming, E-mail: yongming.liu@asu.edu

    2017-01-02

    Alloy 617 is a primary candidate material to be used in the next generation of nuclear power plants. Structural materials for these plants are expected to undergo creep and fatigue at temperatures as high as 950 °C. This study uses a hybrid-control creep-fatigue loading profile, as opposed to the traditional strain-controlled loading, to generate creep dominated failure. Qualitative and quantitative image analysis through SEM, EDS, and EBSD, is used to show that hybrid control testing is capable of producing creep dominated failure and that time fraction approach is not a valid indicator of creep or fatigue dominated damage. The focus of image analysis is on surface fatigue cracks and internal creep voids. A creep-fatigue damage interaction diagram based on these micro-scale features is plotted. It is shown that the classical time fraction approach suggested by the ASME code does not agree with the experimental findings and has a poor correlation with observed microscale damage features. A new definition of creep damage fraction based on an effective hold time is found to correlate well with the micro-scale image analysis.

  3. Modeling of creep-fatigue interaction of zirconium {alpha} under cyclic loading at 200 C; Modelisation du comportement et de l`endommagement en fatigue-fluage du zirconium {alpha} a 200C

    Energy Technology Data Exchange (ETDEWEB)

    Vogel, C.

    1996-04-01

    The present work deals with mechanical behaviour of zirconium alpha at 200 deg. C and crack initiation prediction methods, particularly when loading conditions lead to interaction of fatigue and creep phenomena. A classical approach used to study interaction between cyclic effects and constant loading effects does not give easy understanding of experimental results. Therefore, a new approach has been developed, which allow to determine a number of cycles for crack initiation for complex structures under large loading conditions. To study influence of fatigue and creep interaction on crack initiation, a model was chosen, using a scalar variable, giving representation of the material deterioration state. The model uses a non linear cumulating effect between the damage corresponding to cyclic loads and the damage correlated to time influence. The model belongs to uncoupled approaches between damage and behaviour, which is described here by a two inelastic deformations model. This mechanical behaviour model is chosen because it allows distinction between a plastic and a viscous part in inelastic flow. Cyclic damage is function of stress amplitude and mean stress. For the peculiar sensitivity of the material to creep, a special parameter bas been defined to be critical toward creep damage. It is the kinematic term associated to state variables describing this type of hardening in the viscous mechanism. (author).

  4. Finite Element Creep-Fatigue Analysis of a Welded Furnace Roll for Identifying Failure Root Cause

    Science.gov (United States)

    Yang, Y. P.; Mohr, W. C.

    2015-11-01

    Creep-fatigue induced failures are often observed in engineering components operating under high temperature and cyclic loading. Understanding the creep-fatigue damage process and identifying failure root cause are very important for preventing such failures and improving the lifetime of engineering components. Finite element analyses including a heat transfer analysis and a creep-fatigue analysis were conducted to model the cyclic thermal and mechanical process of a furnace roll in a continuous hot-dip coating line. Typically, the roll has a short life, modeling heat convection from hot air inside the furnace. The creep-fatigue analysis was performed by inputting the predicted temperature history and applying mechanical loads. The analysis results showed that the failure was resulted from a creep-fatigue mechanism rather than a creep mechanism. The difference of material properties between the filler metal and the base metal is the root cause for the roll failure, which induces higher creep strain and stress in the interface between the weld and the HAZ.

  5. Evaluation procedure of creep-fatigue defect growth in high temperature condition and application

    International Nuclear Information System (INIS)

    Park, Chang Gyu; Kim, Jong Bum; Lee, Jae Han

    2003-12-01

    This study proposed the evaluation procedure of creep-fatigue defect growth on the high-temperature cylindrical structure applicable to the KALIMER, which is developed by KAERI. Parameters used in creep defect growth and the evaluation codes with these parameters were analyzed. In UK, the evaluation procedure of defect initiation and growth were proposed with R5/R6 code. In Japan, simple evauation method was proposed by JNC. In France, RCC-MR A16 code which was evaluation procedure of the creep-fatigue defect initiation and growth related to leak before break was developed, and equations related to load conditions were modified lately. As an application example, the creep-fatigue defect growth on circumferential semi-elliptical surface defect in high temperature cylindrical structure was evaluated by RCC-MR A16

  6. Final report on in-reactor creep-fatigue deformation behaviour of a CuCrZr alloy: COFAT 1

    DEFF Research Database (Denmark)

    Singh, Bachu Narain; Tähtinen, S.; Moilanen, P.

    CrZr(HT1) alloy exposed concurrently to flux of neutrons and creep-fatigue cyclic loading directly in a fission reactor. Special experimental facilities were designed and fabricated for this purpose. A number of in-reactor creep-fatigue experiments were successfully carried out in the BR-2 reactor at Mol...

  7. Experimental and modeling results of creep fatigue life of Inconel 617 and Haynes 230 at 850 C

    International Nuclear Information System (INIS)

    Chen, Xiang; Sokolov, Mikhail A.; Sham, Sam; Erdman, Donald L. III; Busby, Jeremy T.; Mo, Kun; Stubbins, James

    2013-01-01

    Creep fatigue testing of Ni-based superalloy Inconel 617 and Haynes 230 were conducted in the air at 850 C. Tests were performed with fully reversed axial strain control at a total strain range of 0.5%, 1.0% or 1.5% and hold time at maximum tensile strain for 3, 10 or 30 min. In addition, two creep fatigue life prediction methods, i.e. linear damage summation and frequency-modified tensile hysteresis energy modeling, were evaluated and compared with experimental results. Under all creep fatigue tests, Haynes 230 performed better than Inconel 617. Compared to the low cycle fatigue life, the cycles to failure for both materials decreased under creep fatigue test conditions. Longer hold time at maximum tensile strain would cause a further reduction in both material creep fatigue life. The linear damage summation could predict the creep fatigue life of Inconel 617 for limited test conditions, but considerably underestimated the creep fatigue life of Haynes 230. In contrast, frequency-modified tensile hysteresis energy modeling showed promising creep fatigue life prediction results for both materials.

  8. A method of creep damage summation based on accumulated strain for the assessment of creep-fatigue endurance

    International Nuclear Information System (INIS)

    Hales, R.

    1983-01-01

    A method of combining long term creep data with relatively short term mechanical behaviour to provide an estimate of creep-fatigue endurance is presented. It is proposed that the creep-fatigue effect in high temperature cyclic deformation is governed by a difference in strain rate around the cycle and the associated variation in ductility with strain rate. (author)

  9. Flaw assessment guide for high-temperature reactor components subject to creep-fatigue loading

    International Nuclear Information System (INIS)

    Ainsworth, R.A.; Takahashi, Y.

    1990-10-01

    A high-temperature flaw assessment procedure is described. This procedure is a result of a collaborative effort between Electric Power Research Institute in the United States, Central Research Institute of Electric Power Industry in Japan, and Nuclear Electric plc in the United Kingdom. The procedure addresses preexisting defects subject to creep-fatigue loading conditions. Laws employed to calculate the crack growth per cycle are defined in terms of fracture mechanics parameters and constants related to the component material. The crack-growth laws can be integrated to calculate the remaining life of a component or to predict the amount of crack extension in a given period. Fatigue and creep crack growth per cycle are calculated separately, and the total crack extension is taken as the simple sum of the two contributions. An interaction between the two propagation modes is accounted for in the material properties in the separate calculations. In producing the procedure, limitations of the approach have been identified. 25 refs., 1 fig

  10. Evaluation of Creep-Fatigue Damage in 304 Stainless Steel using Ultrasonic Non-Destructive Test

    Energy Technology Data Exchange (ETDEWEB)

    Lee, Sung Sik [Safetech Co. Ltd., Kimhae (Korea, Republic of); Oh, Yong Jun [Hanbat National Univ., Daejon (Korea, Republic of); Nam, Soo Woo [KISTI ReSEAT Program, Seoul (Korea, Republic of)

    2011-12-15

    It is well known that grain boundary cavitation is the main failure mechanism in austenitic stainless steel under tensile hold creep-fatigue interaction conditions. The cavities are nucleated at the grain boundary during cyclic loading and grow to become grain boundary cracks. The attenuation of ultrasound depends on scattering and absorption in polycrystalline materials. Scattering occurs when a propagation wave encounters microstructural discontinuities, such as internal voids or cavities. Since the density of the creepfatigue cavities increases with the fatigue cycles, the attenuation of ultrasound will also be increased with the fatigue cycles and this attenuation can be detected nondestructively. In this study, it is found that individual grain boundary cavities are formed and grow up to about 100 cycles and then, these cavities coalesce to become cracks. The measured ultrasonic attenuation increased with the cycles up to cycle 100, where it reached a maximum value and then decreased with further cycles. These experimental measurements strongly indicate that the open pores of cavities contribute to the attenuation of ultrasonic waves. However, when the cavities develop, at the grain boundary cracks whose crack surfaces are in contact with each other, there is no longer any open space and the ultrasonic wave may propagate across the cracks. Therefore, the attenuation of ultrasonic waves will be decreased. This phenomenon of maximum attenuation is very important to judge the stage of grain boundary crack development, which is the indication of the dangerous stage of the structures.

  11. Creep and creep fatigue crack behavior of 1Cr- and 9Cr-steels

    International Nuclear Information System (INIS)

    Maile, K.; Klenk, A.; Schellenberg, G.; Granacher, J.; Tramer, M.

    2000-01-01

    A large database for creep crack initiation and propagation under constant load conditions is available on conventional power plant steels of types 1%Cr and 12%Cr. Modern plants are often used in the medium and peak load regime, thus the dominant loading situation in high temperature components is creep fatigue. For life assessment data about crack initiation and growth under creep fatigue loading are required. These characteristics can not be substituted by pure fatigue or creep crack data. Therefore, a comprehensive test programme was started to investigate the creep fatigue crack behaviour of a 1%CrMoNiV turbine rotor steel (30CrMoNiV 4 11) at 550 C and a new 9%CrMoVNb pipe steel (type P 9 1) at 600 C. DENT-specimen with 15 and 60 mm thickness as well as side grooved CT-specimen with 25 and 50 mm thickness have been tested to determine possible influences of geometry and thus to check the transferability of the data to components. The creep fatigue crack growth results of tests with dwell times between t H = 0,32h and 10 h lie in the scatterbands given by creep crack growth results. Nevertheless a higher crack growth rate under creep fatigue conditions can be stated. An increase in crack growth rate due to creep fatigue is clearly visible. Loading situations with frequencies higher than 1.10 -4 Hz should be not assessed with pure creep crack results or sufficient safety margins have to be applied. (orig.)

  12. Prediction of inelastic behavior and creep-fatigue life of perforated plates

    International Nuclear Information System (INIS)

    Igari, Toshihide; Setoguchi, Katsuya; Nakano, Shohki; Nomura, Shinichi

    1991-01-01

    Prediction methods of macroscopic and local stress-strain behavior of perforated plates in plastic and creep regime which are proposed by the authors are applied to the inelastic analysis and creep-fatigue life prediction of perforated cylinder subjected to cyclic thermal stress. Stress-strain behavior of perforated cylinder is analyzed by modeling the perforated portion to cylinder with equivalent-solid-plate properties. Creep-fatigue lives at around a hole of perforated plates are predicted by using the local stress-strain behavior and are compared with experimentally observed lives. (author)

  13. The creep-fatigue crack growth behaviour of a 1CrMoV rotor steel

    International Nuclear Information System (INIS)

    Priest, R.H.; Miller, D.A.; Gladwin, D.N.; Maguire, J.

    1989-01-01

    Crack growth rates under simultaneous creep-fatigue conditions have been quantified for a 1CrMoV rotor steel. Measured growth rates were partitioned into cyclic and hold period contributions and these characterized by the relevant fracture mechanics parameters K and C. Cyclic growth rates measured in the creep-fatigue tests were enhanced compared with pure fatigue rates. This observation is compared with the behaviour of other steels and explained by quantitative metallography. The resulting crack growth equation can be used during integrity assessments for plant components containing cracks which are subject to thermal fatigue

  14. Creep-fatigue damage rules for advanced fast reactor design. Proceedings of a technical committee meeting

    International Nuclear Information System (INIS)

    1997-03-01

    The IAEA, following the recommendations of the International Working Group on Fast Reactors, convened a Technical Committee Meeting on Creep-Fatigue Damage Rules to be used in Fast Reactor Design. The objective of the meeting was to review developments in design rules for creep-fatigue conditions and to identify any areas in which further work would be desirable. The meeting was hosted by AEA Technology, Risley, and held in Manchester, United Kingdom, 11-13 June 1996. It was attended by experts from the European Commission, France, India, Japan, the Republic of Korea, the Russian Federation and the United Kingdom. Refs, figs, tabs

  15. Progress Report on Long Hold Time Creep Fatigue of Alloy 617 at 850°C

    International Nuclear Information System (INIS)

    Carroll, Laura Jill

    2015-01-01

    Alloy 617 is the leading candidate material for an intermediate heat exchanger for the very high temperature reactor. To evaluate the behavior of this material in the expected service conditions, strain-controlled cyclic tests that include long hold times up to 240 minutes at maximum tensile strain were conducted at 850°C. In terms of the total number of cycles to failure, the fatigue resistance decreased when a hold time was added at peak tensile strain. Increases in the tensile hold duration degraded the creep-fatigue resistance, at least to the investigated strain controlled hold time of up to 60 minutes at the 0.3% strain range and 240 minutes at the 1.0% strain range. The creep-fatigue deformation mode is considered relative to the lack of saturation, or continually decreasing number of cycles to failure with increasing hold times. Additionally, preliminary values from the 850°C creep-fatigue data are calculated for the creep-fatigue damage diagram and have higher values of creep damage than those from tests at 950°C.

  16. Update and Improve Subsection NH - Alternative Simplified Creep-Fatigue Design Methods

    International Nuclear Information System (INIS)

    Asayama, Tai

    2009-01-01

    This report described the results of investigation on Task 10 of DOE/ASME Materials NGNP/Generation IV Project based on a contract between ASME Standards Technology, LLC (ASME ST-LLC) and Japan Atomic Energy Agency (JAEA). Task 10 is to Update and Improve Subsection NH -- Alternative Simplified Creep-Fatigue Design Methods. Five newly proposed promising creep-fatigue evaluation methods were investigated. Those are (1) modified ductility exhaustion method, (2) strain range separation method, (3) approach for pressure vessel application, (4) hybrid method of time fraction and ductility exhaustion, and (5) simplified model test approach. The outlines of those methods are presented first, and predictability of experimental results of these methods is demonstrated using the creep-fatigue data collected in previous Tasks 3 and 5. All the methods (except the simplified model test approach which is not ready for application) predicted experimental results fairly accurately. On the other hand, predicted creep-fatigue life in long-term regions showed considerable differences among the methodologies. These differences come from the concepts each method is based on. All the new methods investigated in this report have advantages over the currently employed time fraction rule and offer technical insights that should be thought much of in the improvement of creep-fatigue evaluation procedures. The main points of the modified ductility exhaustion method, the strain range separation method, the approach for pressure vessel application and the hybrid method can be reflected in the improvement of the current time fraction rule. The simplified mode test approach would offer a whole new advantage including robustness and simplicity which are definitely attractive but this approach is yet to be validated for implementation at this point. Therefore, this report recommends the following two steps as a course of improvement of NH based on newly proposed creep-fatigue evaluation

  17. Influence of dynamic sodium environment on the creep-fatigue behaviour of Modified 9Cr-1Mo ferritic-martensitic steel

    International Nuclear Information System (INIS)

    Kannan, R.; Ganesan, V.; Mariappan, K.; Sukumaran, G.; Sandhya, R.; Mathew, M.D.; Bhanu Sankara Rao, K.

    2011-01-01

    Highlights: → The effects of dynamic sodium on the CFI behaviour of Mod. 9Cr-1Mo steel has investigated. → The cyclic stress response of Mod. 9Cr-1Mo steel under flowing sodium environment is similar to that of air environment. → The creep-fatigue endurance of the alloy is found to decrease with introduction of hold time and with increase in the duration of hold time and the factor of life increase in sodium compared to air environment is reduced with increase in hold time. → In contrast to air environment, tensile holds were found to be more damaging than compression hold in sodium environment. → Design rules based on air environment can be safely applied for the components operating in sodium environment. - Abstract: The use of liquid sodium as a heat transfer medium for sodium-cooled fast reactors (SFRs) necessitates a clear understanding of the effects of dynamic sodium on low cycle fatigue (LCF), creep and creep-fatigue interaction (CFI) behaviour of reactor structural materials. Mod. 9Cr-1Mo ferritic steel is the material of current interest for the steam generator components of sodium cooled fast reactors. The steam generator has a design life of 30-40 years. The effects of dynamic sodium on the LCF and CFI behaviour of Mod. 9Cr-1Mo steel have been investigated at 823 and 873 K. The CFI life of the steel showed marginal increase under flowing sodium environment when compared to air environment. Hence, the design rules for creep-fatigue interaction based on air tests can be safely applied for components operating in sodium environment. This paper attempts to explain the observed LCF and CFI results based on the detailed metallography and fractography conducted on the failed samples.

  18. Influence of creep ductility on creep-fatigue behaviour of 20%Cr/25%Ni/Nb stainless steel

    International Nuclear Information System (INIS)

    Gladwin, D.; Miller, D.A.

    1985-01-01

    The influence of creep ductility on creep-fatigue endurance of 20%Cr/25%Ni/Nb stainless steel has been examined. In order to induce different creep ductilities in the 20/25/Nb stainless steel, three different thermo-mechanical routes were employed. These resulted in a range of ductilities (3-36%) being obtained at the strain rates of interest. Strain controlled slow-fast creep-fatigue cycles were used with strain rates of 10 -6 s -1 , 10 -7 s -1 in tension and 10 -3 s -1 in compression. It was found that creep ductility strongly influenced the creep-fatigue endurance of the 20/25/Nb stainless steel. When failure was creep dominated endurance was found to be directly proportional to the creep ductility. A ductility exhaustion model has been used to successfully predict creep-fatigue endurance when failure was creep dominated. (author)

  19. A ductility exhaustion evaluation of some long term creep/fatigue tests on austenitic steel

    International Nuclear Information System (INIS)

    Wood, D.S.; Wynn, J.; Austin, C.; Green, J.G.

    1988-01-01

    A limited number of long term creep/fatigue tests performed on two batches of Type 316 steel and one batch of associated 17Cr8Ni2Mo weld metal are reported. Test durations range from 5000 to 32,000 h and temperatures from 550 to 625 0 C. Subsequent metallographic examination shows the failures to be wholly or predominantly intergranular. The results are analysed using a ductility exhaustion approach and it is shown that the endurances obtained are within a factor of two of predicted values. The results confirm that the design approach to creep/fatigue currently being developed in the U.K. and based on ductility exhaustion is likely to be satisfactory. (author)

  20. Creep-Fatigue Behavior of Alloy 617 at 850 and 950°C, Revision 2

    Energy Technology Data Exchange (ETDEWEB)

    Carroll, L. [Idaho National Lab. (INL), Idaho Falls, ID (United States); Carroll, M. [Idaho National Lab. (INL), Idaho Falls, ID (United States)

    2015-05-01

    Alloy 617 is the leading candidate material for an Intermediate Heat Exchanger (IHX) of the Very High Temperature Reactor (VHTR). To evaluate the behavior of this material in the expected service conditions, strain-controlled cyclic tests including hold times up to 9000 s at maximum tensile strain were conducted at 850 and 950 degrees C. At both temperatures, the fatigue resistance decreased when a hold time was added at peak tensile strain. The magnitude of this effect depended on the specific mechanisms and whether they resulted in a change in fracture mode from transgranular in pure fatigue to intergranular in creep-fatigue for a particular temperature and strain range combination. Increases in the tensile hold duration beyond an initial value were not detrimental to the creep-fatigue resistance at 950 degrees C but did continue to degrade the lifetimes at 850 degrees C.

  1. Influences of cyclic deformation on creep property and creep-fatigue life prediction considering them

    International Nuclear Information System (INIS)

    Takahashi, Yukio

    2009-01-01

    Evaluation of creep-fatigue is essential in design and life management of high-temperature components in power generation plants. Cyclic deformation may alter creep property of the materials and its consideration may improve predictability of creep-fatigue failure life. To understand them, creep tests were conducted for the materials subjected to cyclic loading and their creep rupture and deformation behaviors were compared with those of as-received materials. Both 316FR and modified 9Cr-1Mo steel were tested. (1) Creep rupture time and elongation generally tend to decrease with cyclic loading in both materials, and especially elongation of 316FR drastically decreases by being cyclically deformed. (2) Amount of primary creep deformation decreases by cyclic loading and the ways to improve its predictability were developed. (3) Use of creep rupture ductility after cyclic deformation, instead of that of as-received material, brought about clear improvement of life prediction in a modified ductility exhaustion approach. (author)

  2. Study on creep-fatigue life of irradiated austenitic stainless steel

    International Nuclear Information System (INIS)

    Ioka, Ikuo; Miwa, Yukio; Tsuji, Hirokazu; Yonekawa, Minoru; Takada, Fumiki; Hoshiya, Taiji

    2001-01-01

    The low cycle creep-fatigue test with tensile strain hold of the austenitic stainless steel irradiated to 2 dpa was carried out at 823K in vacuum. The applicability of creep-fatigue life prediction methods to the irradiated specimen was examined. The fatigue life on the irradiated specimen without tensile strain hold time was reduced by a factor of 2-5 in comparison with the unirradiated specimen. The decline in fatigue life of the irradiated specimen with tensile strain hold was almost equal to that of the unirradiated specimen. The creep damage of both unirradiated and irradiated specimens was underestimated by the time fraction rule or the ductility exhaustion rule. The creep damage calculated by the time fraction rule or the ductility exhaustion rule increased by the irradiation. The predictions derived from the linear damage rule are unsafe as compared with the experimental fatigue lives. (author)

  3. Evaluation of hot hardness, creep, fatigue and fracture properties of zirconia ceramics by an indentation technique

    International Nuclear Information System (INIS)

    Kutty, T.R.G.; Ganguly, C.; Upadhyaya, D.D.

    1996-01-01

    Zirconia ceramics have wide range engineering applications at room and elevated temperatures. For understanding the mechanical behaviour, the indentation technique was adapted for quick evaluation of hot hardness, creep, fatigue and fracture properties. A Vicker's diamond indentor with 10 N load was employed for hot hardness and creep measurement up to 1300 deg. The fatigue data were evaluated at room temperature by repeated indentation with a constant load (10-2500N) at the same location for a dwell time of 5s until it resulted in the formation of a lateral chip on the sample surface. Thus, the number of cycles for chip formation at a specific indentation load was obtained. The fracture toughness was evaluated at room temperature with a load of 300N using a Vicker's diamond indentor. The results of hot hardness, creep, fatigue, and fracture data ol 3Y-TZP and Mg-PSZ are discussed along with their microstructural features. (authors)

  4. Monitoring microstructural evolution of alloy 617 with non-linear acoustics for remaining useful life prediction; multiaxial creep-fatigue and creep-ratcheting

    International Nuclear Information System (INIS)

    Lissenden, Cliff; Hassan, Tasnin; Rangari, Vijaya

    2014-01-01

    The research built upon a prior investigation to develop a unified constitutive model for design-@by-@analysis of the intermediate heat exchanger (IHX) for a very high temperature reactor (VHTR) design of next generation nuclear plants (NGNPs). Model development requires a set of failure data from complex mechanical experiments to characterize the material behavior. Therefore uniaxial and multiaxial creep-@fatigue and creep-@ratcheting tests were conducted on the nickel base Alloy 617 at 850 and 950°C. The time dependence of material behavior, and the interaction of time dependent behavior (e.g., creep) with ratcheting, which is an increase in the cyclic mean strain under load-@controlled cycling, are major concerns for NGNP design. This research project aimed at characterizing the microstructure evolution mechanisms activated in Alloy 617 by mechanical loading and dwell times at elevated temperature. The acoustic harmonic generation method was researched for microstructural characterization. It is a nonlinear acoustics method with excellent potential for nondestructive evaluation, and even online continuous monitoring once high temperature sensors become available. It is unique because it has the ability to quantitatively characterize microstructural features well before macroscale defects (e.g., cracks) form. The nonlinear acoustics beta parameter was shown to correlate with microstructural evolution using a systematic approach to handle the complexity of multiaxial creep-@fatigue and creep-@ratcheting deformation. Mechanical testing was conducted to provide a full spectrum of data for: thermal aging, tensile creep, uniaxial fatigue, uniaxial creep-@fatigue, uniaxial creep-ratcheting, multiaxial creep-fatigue, and multiaxial creep-@ratcheting. Transmission Electron Microscopy (TEM), Scanning Electron Microscopy (SEM), and Optical Microscopy were conducted to correlate the beta parameter with individual microstructure mechanisms. We researched application of the

  5. Fatigue and creep-fatigue in sodium of 316 1 stainless steel

    International Nuclear Information System (INIS)

    Ardellier, A.

    1982-01-01

    Equipment and results obtained on type 316 L stainless stee1 at 450 0 C and 600 0 C with low-cycle fatique and creep fatigue tests are described. Comparison with runs in air on type 316 L stainless steel shows a better low-cycle fatigue behavior in a sodium environment. This beneficial effect can be attributed to the low oxygen content which limits the surface oxidazation

  6. Ratchetting and creep-fatigue evaluation for nozzle-to-cylinder intersection

    International Nuclear Information System (INIS)

    Barsoum, R.S.; Loomis, R.W.; Stewart, B.D.

    1976-01-01

    The study is part of an analytical investigation on the applicability of the simplified ratchetting and creep-fatigue rules to LMFBR component geometry. Both the detailed inelastic rules and the simplified elastic rules are applied to the results obtained from a three-dimensional finite element analysis of the nozzle-to-cylinder intersection. The results of both evaluations are compared at several locations on the surface, and an assessment of the degree of conservatism of the simplified methods is discussed

  7. Creep-fatigue evaluation method for modified 9Cr-1Mo steel

    International Nuclear Information System (INIS)

    Wada, Y.; Aoto, K.

    1997-01-01

    As creep-fatigue evaluation methods on normalized and tempered Modified 9Cr-1Mo steel for design use, the time fraction rule and the simplified conventional ductility exhaustion rule are investigated for the prediction of tension strain hold creep-fatigue damage of this material. For the above investigation, stress relaxation behaviour during strain hold has to be analyzed using stress-strain-time relation. The initial value of stress relaxation was determined by cyclic stress-strain curves in continuous cycling fatigue tests. Cyclic stress-strain behaviour of Mod.9Cr-1Mo(NT) steel is different from that of austenitic stainless steels, so this effect was considered. Stress relaxation analysis was performed using static creep strain-time relation and conventional hardening rule. The time fraction by using the above stress relaxation analysis results can give good prediction for creep-fatigue life of Mod.9Cr-1Mo(NT) steel. For design use it is practical to be able to estimate creep damages conservatively by both strain behaviour of cyclic plastic (in continuous cycling fatigue tests) and monotonic creep (in standard creep tests). The life reduction by strain hold at the minimum peak of compressive stress in creep-fatigue tests was examined, and this effects can be evaluated by the relationship between the location of oxidation and the effective deformation at crack tip. In an accelerated oxidation environment, for example in high temperature and high pressure steam, a different approach for life reduction should be developed based on the mechanism of growth of oxide and crack growth with oxidation. However, in the creep damage dominant region, its effect is saturated and the effect of cavity growth along grain boundary becomes dominant for long-term strain hold in the high temperature conditions. (author). 6 refs, 6 figs

  8. Influenced prior loading on the creep fatigue damage accumulation of heat resistant steels

    International Nuclear Information System (INIS)

    Kloos, K.H.; Granacher, J.; Scholz, A.

    1990-01-01

    On two heat resistant power plant steels the influence of prior strain cycling on the creep rupture behaviour and the influence of prior creep loading on the strain cycling behaviour is investigated. These influences concern the number of cycles to failure and the rupture time being the reference values of the generalized damage accumulation rule and they are used for a creep fatigue analysis of the results of long term service-type strain cycling tests. (orig.) [de

  9. Creep-fatigue behaviour of the titanium alloy IMI 834 at 600 C

    International Nuclear Information System (INIS)

    Nowack, H.; Kordisch, T.

    1998-01-01

    In the present study the creep-fatigue behaviour of the titanium alloy IMI 834 at 600 C was investigated. A comparison of the crack initiation life behaviour and of the crack propagation as caused by different types of complex creep-fatigue cycles (with hold times into tension and/or into compression direction and with different loading rates into tension and/or into compression direction) showed, that a slow increase of the loadings into tension reduced the life and increased the crack velocity more than hold times at the maximum load. Furthermore, there existed environmental influences. On the basis of the experimental investigations the prediction capability of convenient crack initiation life prediction methods was evaluated. It turned out that the prediction capability of the strain range partitioning method could be improved if it was frequency modified. The prediction capability of the frequency modification method could also be improved, if mean stresses in the cycles were explicitely accounted for. In the short and long crack stage the propagation behaviour could be correlated well if the effective cyclic J-integral was used. This is of importance for damage tolerance considerations. Because the strains and the stresses at the crack tip are most important for the crack propagation behaviour, they were analysed on the basis of the finite element method. It was found that the strains and stresses differed for different types of creep-fatigue cycles. (orig.)

  10. Creep fatigue of low-cobalt superalloys: Waspalloy, PM U 700 and wrought U 700

    Science.gov (United States)

    Leis, B. N.; Rungta, R.; Hopper, A. T.

    1983-01-01

    The influence of cobalt content on the high temperature creep fatigue crack initiation resistance of three primary alloys was evaluated. These were Waspalloy, Powder U 700, and Cast U 700, with cobalt contents ranging from 0 up to 17 percent. Waspalloy was studied at 538 C whereas the U 700 was studied at 760 C. Constraints of the program required investigation at a single strain range using diametral strain control. The approach was phenomenological, using standard low cycle fatigue tests involving continuous cycling tension hold cycling, compression hold cycling, and symmetric hold cycling. Cycling in the absence of or between holds was done at 0.5 Hz, whereas holds when introduced lasted 1 minute. The plan was to allocate two specimens to the continuous cycling, and one specimen to each of the hold time conditions. Data was taken to document the nature of the cracking process, the deformation response, and the resistance to cyclic loading to the formation of small cracks and to specimen separation. The influence of cobalt content on creep fatigue resistance was not judged to be very significant based on the results generated. Specific conclusions were that the hold time history dependence of the resistance is as significant as the influence of cobalt content and increased cobalt content does not produce increased creep fatigue resistance on a one to one basis.

  11. An analysis of the creep/fatigue behaviour of type 316 weld metal

    International Nuclear Information System (INIS)

    Wood, D.S.; Wynn, J.

    The document presents creep/fatigue results obtained at UKAEA Risley Nuclear Labs. on type 316 weld metal and the associated stress rupture data and analyses them in the same way as that currently favoured for wrought material. The continuous cycling fatigue results are shown; the lower temperature is seen to give a higher endurance. The creep/fatigue results indicate that lower endurances are obtained at 625 deg. C and that with increasing hold time there is a tendency for the endurance to be lowered. The weld metal creep/fatigue endurances are compared with published UK data on wrought material for strain ranges of up to 3%. Under the conditions examined, it can be seen that the weld metal endurance is towards the top of the scatter band, the results at 550 deg. C forming the upper bound. The stress rupture data note that the ductility is reasonable at short times but fall to relatively low values at long times (10,000h)

  12. Study on creep-fatigue evaluation of chrome-molybdenum steel

    International Nuclear Information System (INIS)

    Aoto, Kazumi; Wada, Yusaku

    1993-01-01

    Though chrome-molybdenum steel has quite different basic material properties from austenitic stainless steel, the life fraction rule based on an advanced ductility exhaustion theory proposed for SUS304 is able to give proper prediction for creep-fatigue life of chrome-molybdenum steel. The applicability of the present evaluation method to chrome-molybdenum steel is validated by both mechanical study and micro-structural observation. The mechanism of creep-fatigue failure of Mod.9Cr-1Mo(NT) is one of the most controversial subjects among researchers. However, it is clarified in this report that creep-fatigue damage of this material under actual loading conditions is dominated by creep-cavitation of grain boundaries as same way as that of austenitic stainless steel. Furthermore, for the life reduction of low cycle fatigue of chrome-molybdenum steel with compression-side strain hold, both effects of mean stress and oxide-wedge are denied and it is insisted that the acceleration of fatigue-crack propagation is occurred by oxide-progress location and its thickness. (author)

  13. Prediction of inelastic behavior and creep-fatigue life of perforated plates

    International Nuclear Information System (INIS)

    Igari, Toshihide; Yamauchi, Masafumi; Nomura, Shinichi.

    1992-01-01

    Prediction methods of macroscopic and local stress-strain behaviors of perforated plates in plastic and creep regime are proposed in this paper, and are applied to the creep-fatigue life prediction of perforated plates. Both equivalent-solid-plate properties corresponding to the macroscopic behavior and the stress-strain concentration around a hole were obtained by assuming the analogy between plasticity and creep and also by extending the authors' proposal in creep condition. The perforated plates which were made of Hastelloy XR were subjected to the strain-controlled cyclic test at 950degC in air in order to experimentally obtain the macroscopic behavior such as the cyclic stress-strain curve and creep-fatigue life around a hole. The results obtained are summarized as follows. (1) The macroscopic behavior of perforated plates including cyclic stress-strain behavior and relaxation is predictable by using the proposed method in this paper. (2) The creep-fatigue life around a hole can be predicted by using the proposed method for stress-strain concentration around a hole. (author)

  14. Prediction of creep-fatigue life by use of creep rupture ductility

    International Nuclear Information System (INIS)

    Yamaguchi, Koji; Suzuki, Naoyuki; Ijima, Kiyoshi; Kanazawa, Kenji

    1985-01-01

    It was clarified that tension strain hold reduced creep-fatigue life of many engineering materials in different degrees depending on material, temperature and test duration. However the reduction in the life due to holding for various durations could be correlated to the fraction of intergranular facets on fracture surfaces which was considered to be an index of the damage introduced during strain hold. This fraction of intergranular facets by creep-fatigue failure exhibited a direct relation to the creep rupture ductility of the material tested at the same temperature and for the same creep-fatigue life-time. From these results an empirical equation has been derived as follow; (Δ sub(epsilonsub(i)))/Dsub(c).(N sub(h sup(α))) = C, where Δ sub(epsilonsub(i)) is inelastic strain range, Dsub(c) is the creep rupture ductility for the same duration as creep-fatigue life time, Nsub(h) is the creep-fatigue life under tension strain hold conditions, and α and C are constants depending on the material and testing temperature. From the equation the life prediction is possible for a given inelastic strain range Δ sub(epsilonsub(i)) if the constants α and C, and Dsub(c) are known. The value of α was found to be 0.62 and 0.74 for various austenitic stainless steels and NCF800 at 600 0 C and 700 0 C, respectively, and 0.69 for 1 1/4Cr-1/2Mo steel at 600 0 C. The value of C was found to be 0.50 and 0.59 for various austenitic stainless steels and NCF800 at 600 0 C and 700 0 C, respectively, and 0.49 for 1 1/4Cr-1/2Mo steel at 600 0 C. The creep rupture ductility Dsub(c) is available in the NRIM Creep Data Sheets up to 10 5 h for multi-heats of many kinds of heat resistant alloys. (author)

  15. Report on FY15 Alloy 617 SMT Creep-Fatigue Test Results

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Yanli [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Jetter, Robert I. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Baird, Seth T. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Pu, Chao [Univ. of Tennessee, Knoxville, TN (United States); Sham, Sam [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2015-06-22

    For the temperature range of 990-950C, Alloy 617 is a candidate IHX structural material for high temperature gas reactors (HTGRs) because of its high temperature creep properties. Also, its superior strength over a broad temperature range also offers advantages for certain component applications. In order for the designers to be able to use Alloy 617 for these high temperature components, Alloy 617 has to be approved for use in Section III (the nuclear section) of the ASME (American Society of Mechanical Engineers) Boiler and Pressure Vessel Code. A plan has been developed to propose a Code Case for use of Alloy 617 at elevated temperature in Section III of the ASME Code by September 2015. There has not been a new high temperature material approved for use in Section III for almost 20 years. The Alloy 617 Code Case effort would lead the way to establish a path for Code qualification of new high temperature materials of interest to other advanced SMRs. Creep-fatigue at elevated temperatures is the most damaging structural failure mode. In the past 40 years significant efforts have been devoted to the elevated temperature Code rule development in Section III, Subsection NH* of the ASME Boiler and Pressure Vessel Code, to ascertain conservative structural designs to prevent creep-fatigue failure. The current Subsection NH creep-fatigue procedure was established by the steps of (1) analytically obtaining a detailed stress-strain history, (2) comparing the stress and strain components to cyclic test results deconstructed into stress and strain quantities, and (3) recombining the results to obtain a damage function in the form of the so-called creep-fatigue damage-diagram. The deconstruction and recombination present difficulties in evaluation of test data and determination of cyclic damage in design. The uncertainties in these steps lead to the use of overly conservative design factors in the current creep-fatigue procedure. In addition, and of major significance to the

  16. Creep-fatigue behavior of 2 1/4Cr-1Mo steel at 5500C in air and vacuum

    International Nuclear Information System (INIS)

    Asayama, T.; Cheng, S.Z.; Asada, Y.; Mitsuhashi, S.; Tachibana, Y.

    1987-01-01

    Following studies on creep-fatigue behaviors of 304 steel at 650 0 C (Asada et al (1980) and Morishita et al (1984), (1985), (1987)), 2 1/4Cr-1Mo steel was studied on its creep-fatigue behaviors at 550 0 C in air and vacuum of 100 and 0.1 μPa. The present study intends to give a base for an evaluation of the environmental effect through obtaining a pure creep-fatigue behavior of this steel which is free from the environmental effect. In the previous studies on 304 steel, tests were conducted in three kinds of environment of air, 100 and 0.1 μPa vacuum. It seemed to be plausible that the 0.1 μPa vacuum shows the pure creep-fatigue behavior of 304 steel at 650 0 C which is almost completely free from the environment. A creep-fatigue life in 0.1 μPa vacuum is almost one order of magnitude higher than that in air. The 100 μPa vacuum suggested that the environmental effect of air still remains but is so small that a creep-fatigue life in 100 μPa is same to that in 0.1 μPa in some strain wave forms. The present study intends to examine if similar observations are obtained with 2 1/4Cr-1Mo steel at 550 0 C. This paper describes the analysis of the overstress and damages, in addition to a creep-fatigue result. (orig.GL)

  17. Spontaneous soldering

    International Nuclear Information System (INIS)

    Percacci, R.

    1984-01-01

    It is proposed that the soldering form of general relativity be treated as a dynamical variable. This gives rise to the possibility of treating the linear connection on (n-dimensional) spacetime and an internal O(k)-Yang-Mills field as different components of the same O(N) gauge field (N= n+k). The distinction between gravitational and Yang-Mills interactions is due to a kind of Higgs mechanism driven by the vacuum expectation value of the soldering form. (orig.)

  18. Fatigue and creep-fatigue deformation of an ultra-fine precipitate strengthened advanced austenitic alloy

    Energy Technology Data Exchange (ETDEWEB)

    Carroll, M.C., E-mail: Mark.Carroll@INL.gov [Idaho National Laboratory, 1955 Fremont, PO Box 1625, Idaho Falls, ID 83415-2218 (United States); Carroll, L.J. [Idaho National Laboratory, 1955 Fremont, PO Box 1625, Idaho Falls, ID 83415-2218 (United States)

    2012-10-30

    An advanced austenitic alloy, HT-UPS (high-temperature ultrafine-precipitation-strengthened), has been identified as an ideal candidate material for the structural components of fast reactors and energy-conversion systems. HT-UPS alloys demonstrate improved creep resistance relative to 316 stainless steel (SS) through additions of Ti and Nb, which precipitate to form a widespread dispersion of stable nanoscale metallic carbide (MC) particles in the austenitic matrix. To investigate the behavior in more representative conditions than are offered by uniaxial creep tests, the low-cycle continuous fatigue and combined creep-fatigue response of an HT-UPS alloy have been investigated at 650 Degree-Sign C and 1.0% total strain, with an R-ratio of -1 and hold times at peak tensile strain of up to 150 min. The cyclic deformation response of HT-UPS is directly compared to that of standard 316 SS. The measured values for total cycles to failure between the two alloys are similar, despite differences in peak stress profiles and in qualitative observations of the deformed microstructures. Crack propagation is primarily transgranular in both fatigue and creep-fatigue of each alloy at the investigated conditions. Internal grain boundary damage in the form of fine cracks resulting from the tensile hold is present following the application of hold times of 60 min and longer, and considerably more internal cracks are quantifiable in 316 SS than in HT-UPS. The dislocation substructures observed in the deformed material differ substantially; an equiaxed cellular structure is observed in the microstructure of 316 SS, whereas HT-UPS exhibits widespread and relatively homogenous tangles of dislocations pinned by the nanoscale MC precipitates. The significant effect of the fine distribution of precipitates on observed fatigue and creep-fatigue response is described in three distinct behavioral regions as the microstructure evolves with continued cycling.

  19. Creep fracture and creep-fatigue fracture in ceramics and ceramic composites

    International Nuclear Information System (INIS)

    Suresh, S.

    1993-01-01

    This paper summarizes recent advances in the areas of subcritical crack growth in ceramics subjected to static and cyclic loads at elevated temperatures. Attention is devoted to the specific role of pre-existing and in-situ-formed glass films in influencing creep fracture and creep-fatigue fracture. Experimental results on the effects of cyclic frequency and load ratio, along with detailed transmission electron microscopy of crack-tip and crack-wake damage are highlighted. Some general conclusions are drawn about the dependence of high-temperature damage tolerance on interfacial glass films and about the susceptibility of ceramic materials to cyclic fatigue fracture

  20. One-stage or multi-stage creep fatigue behaviour of heat-resistant steels

    International Nuclear Information System (INIS)

    Kloos, K.H.; Granacher, J.; Scholz, A.

    1994-01-01

    For one stage realistic long term alternating strain tests on two forged steels with the duration of tests up to an order of magnitude of 45,000 hours, the generalised damage accumulation rule, using an optimised evaluation process dealing with pre-stress effects leads to a relative creep fatigue service life of one. A replacement description by the modified service life share rule is indicated for the long term area. First results from realistic three step tests are classified in the scatter band of single stage stress, where there are only slight differences from different cycle counting processes. (orig.) [de

  1. Thermal stresses and cyclic creep-fatigue in fusion reactor blanket

    International Nuclear Information System (INIS)

    Liu, K.C.

    1977-01-01

    Thermal stresses in the first walls of fusion reactor blankets were studied in detail. ORNL multibucket modules are emphasized. Practicality of using the bucket module rather than other blanket designs is examined. The analysis shows that applying intelligent engineering judgment in design can reduce the thermal stresses significantly. Arrangement of coolant flow and distribution of temperature are reviewed. Creep-fatigue property requirements for a first wall are discussed on the basis of existing design rules and criteria. Some major questions are pointed out and experiments needed to resolve basic uncertainties relative to key design decisions are discussed

  2. Mechanical behavior of 9Cr-1Mo-1V steel due to creep fatigue deformation

    International Nuclear Information System (INIS)

    Kim, Sang Tae; Kim, Jae Kyoung; Lee, Hak Sun; Oh, Sang Hyun; Kwun, Sook In; Kim, Chung Seok

    2005-01-01

    Creep-fatigue tests with trapezoid load wave were performed on a 9Cr-1Mo-1V steel at high temperature(550 .deg. C). Trapezoid load wave is considering about hold time for creep effects. we could find out some information in the relationship between number of cycles to failure and hold time. The number of cycles to failure depended on hold time. The cyclic behavior of 9Cr-1Mo-1V steel was characterized by cyclic softening with increasing number of cycles in high temperature. Also we could observe some cavity in the specimens. The size of cavity was different from each hold time

  3. Evaluation of long-term creep-fatigue life of stainless steel weldment based on a microstructure degradation model

    International Nuclear Information System (INIS)

    Asayama, Tai; Hasebe, Shinichi

    1997-01-01

    This paper describes a newly developed analytical method of evaluation of creep-fatigue strength of stainless weld metals. Based on the observation that creep-fatigue crack initiates adjacent to the interface of sigma-phase/delta-ferrite and matrix, a mechanistic model which allows the evaluation of micro stress/strain concentration adjacent to the interface was developed. Fatigue and creep damage were evaluated using the model which describes the microstructure after exposed to high temperatures for a long time. Thus it was made possible to predict analytically the long-term creep-fatigue life of stainless steel metals whose microstructure is degraded as a result of high temperature service. (author)

  4. Further evaluation of creep-fatigue life prediction methods for low-carbon nitrogen-added 316 stainless steel

    International Nuclear Information System (INIS)

    Takahashi, Y.

    1999-01-01

    Low-carbon, medium-nitrogen 316 stainless steel is a principal candidate for a main structural material of a demonstration fast breeder reactor plant in Japan. A number of long-term creep tests and creep-fatigue tests have been conducted for four products of this steel. Two representative creep-fatigue life prediction methods, i.e., time fraction rule and ductility exhaustion method were applied. Total stress relaxation behavior was simulated well by an addition of a viscous strain term to the conventional (primary plus secondary) creep strain, but only the letter was assumed to contribute to creep damage in the ductility exhaustion method. The present ductility exhaustion approach was found to have very good accuracy in creep-fatigue life prediction for all materials tested, while the time fraction rule tended to overpredict failure life as large as a factor of 30. Discussion was made on the reason for this notable difference

  5. Influence of microstructural parameters on the deformation and failure behaviour of the ODS alloy PM 2000 under creep and creep-fatigue loading

    International Nuclear Information System (INIS)

    Bothe, K.; Kussmaul, K.; Maile, K.

    1999-01-01

    The influence of grain size, manufacturing type and specimen direction (anisotropy) with respect to deformation and failure behaviour under creep, fatigue and creep-fatigue load was investigated. Thus, a basis for the correlation between microstructure and mechanical behaviour has been established. The specific damage and failure behaviour could be explained by means of the different microstructures observed. (orig.)

  6. Creep-fatigue life property of FBR high-temperature structural materials under tension-torsion loading and life evaluation method

    International Nuclear Information System (INIS)

    Ogata, Takashi; Nitta, Akito

    1994-01-01

    Creep-fatigue damage in high temperature structural components in a FBR progress under multiaxial stress condition depending on their operating conditions and configuration. Therefore, multiaxial stress effects on creep-fatigue damage evolution must be clarified to make precise creep-fatigue damage evaluation of these components. In this study, creep-fatigue tests in FBR high temperature materials such as SUS304, 316FR stainless steels and a modified 9Cr steel were conducted under biaxial stress subjecting tension-compression and torsion loading, in order to examine biaxial stress effects on failure mechanism and life property, and to discuss creep-fatigue life evaluation methods under biaxial stress. Main results obtained in this study are summarized as follows: 1. The main cracks under cyclic torsion loading propagated by shear mode in three materials. But intergranular failure was occurred in SUS304 and 316FR, and transgranular failure was observed in Mod.9Cr steel. 2. Nonlinear damage accumulation model proposed based on uniaxial creep-fatigue test results was extended to apply for creep-fatigue damage evaluation under biaxial stress state by considering the biaxial stress effects on fatigue and creep damage evolution. 3. It was confirmed that creep-fatigue life under biaxial stress could be predicted by the extended evaluation method with higher accuracy than existing methods. (author)

  7. Final report on in-reactor creep-fatigue deformation behaviour of a CuCrZr alloy: COFAT 2

    International Nuclear Information System (INIS)

    Singh, B.N.; Johansen, B.S.; Taehtinen, S.; Moilanen, P.; Saarela, S.; Jacquet, P.; Dekeyser, J.; Stubbins, J.F.

    2008-01-01

    The main objective of the present work was to determine experimentally the mechanical response and resulting microstructural changes in CuCrZr (HT1) alloy exposed concurrently to flux of neutrons and creep-fatigue cyclic loading directly in a fission reactor. Using specially designed test facilities for this purpose, in-reactor creep-fatigue tests have been performed at strain amplitudes of 0.25 and 0.35 % with a holdtime of 10s in the BR-2 reactor at Mol (Belgium). These tests were performed at the ambient temperatures of 326K and 323K. For comparison purposes corresponding out-of-reactor creep-fatigue tests were also carried out. In the following we first describe the details of the creep-fatigue experiments. We then present the main results on the mechanical response of the material in the form of hysteresis loops and the maximum stress amplitude as a function of the number of creep-fatigue cycles during the out-of-reactor and the in-reactor tests carried out at different strain amplitudes. Finally, the dependence of the number of cycles to failure (i.e. creep-fatigue lifetime) on the strain amplitudes is shown. The details of microstructure of the specimens tested out-of-reactor as well as in the reactor were investigated using transmission electron microscopy. The main results on the mechanical response as well as changes in the microstructure are briefly discussed. The main conclusion emerging from the present work is that the lifetime of the in-reactor tested specimens is by a factor of about two longer than in the case of corresponding out-of-reactor tests. (au)

  8. The prediction of creep damage in Type 347 weld metal: part II creep fatigue tests

    International Nuclear Information System (INIS)

    Spindler, M.W.

    2005-01-01

    Calculations of creep damage under conditions of strain control are often carried out using either a time fraction approach or a ductility exhaustion approach. In part I of this paper the rupture strength and creep ductility data for a Type 347 weld metal were fitted to provide the material properties that are used to calculate creep damage. Part II of this paper examines whether the time fraction approach or the ductility exhaustion approach gives the better predictions of creep damage in creep-fatigue tests on the same Type 347 weld metal. In addition, a new creep damage model, which was developed by removing some of the simplifying assumptions that are made in the ductility exhaustion approach, was used. This new creep damage model is a function of the strain rate, stress and temperature and was derived from creep and constant strain rate test data using a reverse modelling technique (see part I of this paper). It is shown that the new creep damage model gives better predictions of creep damage in the creep-fatigue tests than the time fraction and the ductility exhaustion approaches

  9. Novel experiments to characterise creep-fatigue degradation in VHTR alloys

    International Nuclear Information System (INIS)

    Simpson, J.A.; Wright, J.K.; Wright, R.N.

    2015-01-01

    It is well known in energy systems that the creep lifetime of high temperature alloys is significantly degraded when a cyclic load is superimposed on components operating in the creep regime. A test method has been developed in an attempt to characterise creep-fatigue behaviour of alloys at high temperature. The test imposes a hold time during the tensile phase of a fully reversed strain-controlled low cycle fatigue test. Stress relaxation occurs during the strain-controlled hold period. This type of fatigue stress relaxation test tends to emphasise the fatigue portion of the total damage and does not necessarily represent the behaviour of a component in-service well. Several different approaches to laboratory testing of creep-fatigue at 950 deg. C have been investigated for Alloy 617, the primary candidate for application in VHTR heat exchangers. The potential for mode switching in a cyclic test from strain control to load control, to allow specimen extension by creep, has been investigated to further emphasise the creep damage. In addition, tests with a lower strain rate during loading have been conducted to examine the influence of creep damage occurring during loading. Very short constant strain hold time tests have also been conducted to examine the influence of the rapid stress relaxation that occurs at the beginning of strain holds. (authors)

  10. Creep and Creep-Fatigue Crack Growth at Structural Discontinuities and Welds

    Energy Technology Data Exchange (ETDEWEB)

    Dr. F. W. Brust; Dr. G. M. Wilkowski; Dr. P. Krishnaswamy; Mr. Keith Wichman

    2010-01-27

    The subsection ASME NH high temperature design procedure does not admit crack-like defects into the structural components. The US NRC identified the lack of treatment of crack growth within NH as a limitation of the code and thus this effort was undertaken. This effort is broken into two parts. Part 1, summarized here, involved examining all high temperature creep-fatigue crack growth codes being used today and from these, the task objective was to choose a methodology that is appropriate for possible implementation within NH. The second part of this task, which has just started, is to develop design rules for possible implementation within NH. This second part is a challenge since all codes require step-by-step analysis procedures to be undertaken in order to assess the crack growth and life of the component. Simple rules for design do not exist in any code at present. The codes examined in this effort included R5, RCC-MR (A16), BS 7910, API 579, and ATK (and some lesser known codes). There are several reasons that the capability for assessing cracks in high temperature nuclear components is desirable. These include: (1) Some components that are part of GEN IV reactors may have geometries that have sharp corners - which are essentially cracks. Design of these components within the traditional ASME NH procedure is quite challenging. It is natural to ensure adequate life design by modeling these features as cracks within a creep-fatigue crack growth procedure. (2) Workmanship flaws in welds sometimes occur and are accepted in some ASME code sections. It can be convenient to consider these as flaws when making a design life assessment. (3) Non-destructive Evaluation (NDE) and inspection methods after fabrication are limited in the size of the crack or flaw that can be detected. It is often convenient to perform a life assessment using a flaw of a size that represents the maximum size that can elude detection. (4) Flaws that are observed using in-service detection

  11. Cumulative fatigue and creep-fatigue damage at 3500C on recrystallized zircaloy 4

    International Nuclear Information System (INIS)

    Brun, G.; Pelchat, J.; Floze, J.C.; Galimberti, M.

    1985-06-01

    An experimental programme undertaken by C.E.A., E.D.F. and FRAGEMA with the aim of characterizing the fatigue and creep fatigue behaviour of zircaloy-4 following annealing treatments (recrystallized, stress-delived) is in progress. The results given below concern only recrystallized material. Cyclic properties, low-cycle fatigue curves and creep behaviour laws under stresses have been established. Sequential tests of pure fatigue and creep-fatigue were performed. The cumulative life fractions at fracture depend on the sequence of leading, stress history and number of cycles of prestressing. The MINER's rule appears to be conservative with regard to a low-high loading sequence whereas it is not for the reverse high-low loading sequences. Fatigue and creep damage are not interchangeable. Pre-creep improves the fatigue resistance. Pre-fatigue improves the creep strength as long as the beneficial effect of cyclic hardening overcomes the damaging effect of surface cracking. The introduction of a tension hold time into the fatigue cycle slightly increases cyclic hardening and reduces the number of cycles to failure. For hold times of less than one hour, the sum of fatigue and creep life fractions is closed to one

  12. Investigations on creep and creep fatigue crack behaviour for component assessment

    International Nuclear Information System (INIS)

    Gengenbach, T.; Klenk, A.; Maile, K.

    2004-01-01

    There are various methods to assess crack initiation and crack growth behaviour of components under creep and creep fatigue loading. The programme system HT-Riss has been developed to support calculations aimed to determine the behaviour of a crack under creep or creep-fatigue loading using methods based on stress-intensity factor K (e.g. the Two-Criteria-Diagram) or C*-Integral. This paper describes the steps which have to be performed to assess crack initiation and growth of a component using this programme system. First the size of the maximum initial defect in a specimen or in a component has to be estimated and the necessary fracture mechanics parameters have to be determined. Then the time for creep crack initiation and creep crack growth is calculated. Using these values a prediction of life time and necessary inspection intervals is possible. For exemplification the crack assessment of a component-like specimen and a component is shown. (orig.)

  13. Creep and Creep-Fatigue Crack Growth at Structural Discontinuities and Welds

    International Nuclear Information System (INIS)

    Brust, F.W.; Wilkowski, G.M.; Krishnaswamy, P.; Wichman, Keith

    2010-01-01

    The subsection ASME NH high temperature design procedure does not admit crack-like defects into the structural components. The US NRC identified the lack of treatment of crack growth within NH as a limitation of the code and thus this effort was undertaken. This effort is broken into two parts. Part 1, summarized here, involved examining all high temperature creep-fatigue crack growth codes being used today and from these, the task objective was to choose a methodology that is appropriate for possible implementation within NH. The second part of this task, which has just started, is to develop design rules for possible implementation within NH. This second part is a challenge since all codes require step-by-step analysis procedures to be undertaken in order to assess the crack growth and life of the component. Simple rules for design do not exist in any code at present. The codes examined in this effort included R5, RCC-MR (A16), BS 7910, API 579, and ATK (and some lesser known codes). There are several reasons that the capability for assessing cracks in high temperature nuclear components is desirable. These include: (1) Some components that are part of GEN IV reactors may have geometries that have sharp corners - which are essentially cracks. Design of these components within the traditional ASME NH procedure is quite challenging. It is natural to ensure adequate life design by modeling these features as cracks within a creep-fatigue crack growth procedure. (2) Workmanship flaws in welds sometimes occur and are accepted in some ASME code sections. It can be convenient to consider these as flaws when making a design life assessment. (3) Non-destructive Evaluation (NDE) and inspection methods after fabrication are limited in the size of the crack or flaw that can be detected. It is often convenient to perform a life assessment using a flaw of a size that represents the maximum size that can elude detection. (4) Flaws that are observed using in-service detection

  14. Final report on in-reactor creep-fatigue deformation behaviour of a CuCrZr alloy: COFAT 2

    DEFF Research Database (Denmark)

    Singh, Bachu Narain; Johansen, Bjørn Sejr; Tähtinen, S.

    facilities for this purpose, in-reactor creep-fatigue tests have been performed at strain amplitudes of 0.25 and 0.35 % with a holdtime of 10s in the BR-2 reactor at Mol (Belgium). These tests were performed at the ambient temperatures of 326K and 323K. For comparison purposes corresponding out...

  15. Evaluation of environmental effect on creep-fatigue of 2 1/4Cr-1Mo steel

    International Nuclear Information System (INIS)

    Yang Beinan; Ishikawa, Akiyoshi; Asada, Yasuhide.

    1991-01-01

    In the present study, a trial evaluation was made to evaluate the environmental effect of air separately from the behavior of material origin. Data with 2 1/4Cr-1Mo steel at 550degC in air were subjected to the evaluation based on data of the steel in high vacuum with a newly developed procedure using the overstress concept. An empirical expression was proposed to describe the environmental effect of air on the creep-fatigue behavior. Following conclusions were obtained in the present study on a separation of the environmental effect of air on a creep-fatigue behavior of 2 1/4Cr-1Mo steel at 550degC. 1) The environmental effect of air reduces a fatigue life, that is, it increases the time-independent damage component of the creep-fatigue. 2) The environmental effect of air brings on the frequency effect which is mainly dependent upon a strain rate or time in a compression going stroke. Other environmental effect on F-S or compression hold-time cycles depends upon the strain rate in compression. 3) The rate-time dependent damage component, that is, the creep damage is reduced by the environmental effect of air. That means a creep-fatigue life recovers in air environment. (author)

  16. Analytical investigation of the applicability of simplified ratchetting and creep-fatigue rules to a nozzle-to-sphere geometry

    International Nuclear Information System (INIS)

    Gwaltney, R.C.

    1982-01-01

    This paper presents an analysis of a nozzle-to-spherical-shell attachment and explores the applicability of simplified ratchetting and creep-fatigue rules to this attachment. A five-cycle inelastic analysis and creep-fatigue damage evaluation was carried out on this component. An elastic analysis also was done to provide input parameters required to apply the various rules and procedures of simplified analysis methods. Ten lines, or critical sections, were chosen for postprocessing to determine the ratchetting strain and creep-fatigue damage at both the inside and outside surfaces. At many of the 20 surface points analyzed, the inelastic analysis results did not develop a constant or decreasing pattern for the incremental strain or damage even after 5 cycles were analyzed. Failure to develop a constant or decreasing pattern was especially prevalent for creep damage. The results of the detailed inelastic analyses at the ten critical sections are compared with the results of elastic evaluations of ratchetting and creep-fatigue damage calculated according to American Society of Mechanical Engineers Boiler and Pressure Vessel Code Case N-47-13

  17. Feasibility study on ductility exhaustion approach for creep-fatigue damage assessment of FBR 316 stainless steel using published data

    International Nuclear Information System (INIS)

    Nonaka, Isamu; Kitagawa, Masaki; Torihata, Shoji.

    1995-01-01

    In order to investigate the applicability of a ductility exhaustion rule to the creep-fatigue life assessment of FBR 316 stainless steel, a feasibility study using the published data was conducted. The assessment method was proposed based on the linear damage summation rule. In the proposed method, fatigue damage was calculated by Minor's rule and creep damage was calculated by a ductility exhaustion rule. The creep-fatigue lives in the published data were predicted by the proposed method. The results obtained are as follows: (1) All the data could be predicted within a factor of two on life by the proposed method. (2) The creep-fatigue lives under 10 minute strain hold at 550degC were overestimated, while those under 60 minute strain hold at 550degC and 600degC were estimated adequately. From the above facts, the proposed method seemed to be effective for the prediction of creep-fatigue life in which the creep damage was dominant and also the intergranular cracking was remarkable. (3) The creep damage was simultaneously calculated by the time fraction rule in order to compare with the ductility exhaustion role. All the data could be also predicted within a factor of two on life by this rule, but it tended to overestimate the life. (author)

  18. Soldering handbook

    CERN Document Server

    Vianco, Paul T

    1999-01-01

    Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today's advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering.

  19. Review of ASME-NH Design Materials for Creep-Fatigue

    International Nuclear Information System (INIS)

    Koo, Gyeong Hoi; Kim, Jong Bum

    2010-01-01

    To review and recommend the candidate design materials for the Sodium-Cooled Fast Reactor, the material sensitivity evaluations by the comparison of design data between the ASME-NH materials were performed by using the SIE ASME-NH computer program implementing the material database of the ASME-NH. The design material data provided by the ASME-NH code are the elastic modulus and yield Strength, Time-Independent Allowable Stress Intensity value, time-dependent allowable stress intensity value, expected minimum stress-to rupture value, stress rupture Factors for weldment, isochronous stress-strain curves, and design fatigue curves. Among these, the data related with the creep-fatigue evaluation are investigated in this study

  20. Fatigue and creep-fatigue strength of 304 steel under biaxial strain conditions

    International Nuclear Information System (INIS)

    Asayama, Tai; Aoto, Kazumi; Wada, Yusaku

    1990-01-01

    A series of fatigue and creep-fatigue tests were conducted with 304 stainless steel at 550degC under a variety of biaxial strain conditions. Fatigue life under nonproportional loading conditions showed a significant life reduction compared with that of proportional loading, and this life reduction was reasonably estimated by taking into account the strain paths along which the strain history is imposed. Furthermore, a marked life reduction was shown to occur under nonproportional loading by imposing a strain hold period at a peak tensile strain. This life reduction was evaluated by the linear damage rule. It was shown to be possible to estimate the fatigue damage and the creep damage under nonproportional loading by a linear damage rule by estimating a stress relaxation behavior by Mises-type equivalent stress or Huddleston-type equivalent stress. (author)

  1. Fracture mechanical evaluation of high temperature structure and creep-fatigue defect assessment

    Energy Technology Data Exchange (ETDEWEB)

    Park, Chang Gyu; Kim, Jong Bum; Lee, Jae Han

    2004-02-01

    This study proposed the evaluation procedure of high temperature structures from the viewpoint of fracture mechanics on the cylindrical structure applicable to the KALIMER, which is developed by KAERI. For the evaluation of structural integrity, linear and non-linear fracture mechanics parameters were analyzed. Parameters used in creep defect growth applicable to high temperature structure of liquid metal reactor and the evaluation codes with these parameters were analyzed. The evaluation methods of defect initiation and defect growth which were established in R5/R6 code(UK), JNC method (Japan) and RCC-MR A16(France) code were analyzed respectively. The evaluation procedure of leak before break applicable to KALIMER was preliminarily developed and proposed. As an application example of defect growth, the creep-fatigue defect growth on circumferential throughwall defect in high temperature cylindrical structure was evaluated by RCC-MR A16 and this application technology was established.

  2. An Abnormal Increase of Fatigue Life with Dwell Time during Creep-Fatigue Deformation for Directionally Solidified Ni-Based Superalloy DZ445

    Science.gov (United States)

    Ding, Biao; Ren, Weili; Deng, Kang; Li, Haitao; Liang, Yongchun

    2018-03-01

    The paper investigated the creep-fatigue behavior for directionally solidified nickel-based superalloy DZ445 at 900 °C. It is found that the fatigue life shows an abnormal increase when the dwell time exceeds a critical value during creep-fatigue deformation. The area of hysteresis loop and fractograph explain the phenomenon quite well. The shortest life corresponds to the maximal area of hysteresis loop, i. e. the maximum energy to be consumed during the creep-fatigue cycle. The fractographic observation of failed samples further supports the abnormal behavior of fatigue life.

  3. Creep-fatigue monitoring system for header ligaments of fossil power plants

    International Nuclear Information System (INIS)

    Chen, K.L.; Deardorf, A.F.; Copeland, J.F.; Pflasterer, R.; Beckerdite, G.

    1993-01-01

    The cracking of headers (primary and secondary superheater outlet, and reheater outlet headers) at ligament locations is an important issue for fossil power plants. A model for crack initiation and growth has been developed, based on creep-fatigue damage mechanisms. This cracking model is included in a creep-fatigue monitoring system to assess header structural integrity under high temperature operating conditions. The following principal activities are required to achieve this goal: (1) the development of transfer functions and (2) the development of a ligament cracking model. The first task is to develop stress transfer functions to convert measured (monitored) temperatures, pressures and flow rates into stresses to be used to compute damage. Elastic three-dimensional finite element analyses were performed to study transient thermal stress behavior. The sustained pressure stress redistribution due to high temperature creep was studied by nonlinear finite element analyses. The preceding results are used to derive Green's functions and pressure stress gradient transfer functions for monitoring at the juncture of the tube with the header inner surface, and for crack growth at the ligaments. The virtual crack closure method is applied to derive a stress intensity factor K solution for a corner crack at the tube/header juncture. Similarly, using the reference stress method, the steady state creep crack growth parameter C * is derived for a header corner crack. The C * solution for a small corner crack in a header can be inserted directed into the available C t solution, along with K to provide the complete transient creep solution

  4. Evaluation of creep-fatigue strength of P122 high temperature boiler material

    International Nuclear Information System (INIS)

    Pumwa, John

    2003-01-01

    In components, which operate at high temperatures, changes in conditions at the beginning and end of operation or during operation result in transient temperature gradients. If these transients are repeated, the differential thermal expansion during each transient may result in thermally induced cyclic stresses. The extent of the resulting fatigue damage depends on the nature and frequency of the transient, the thermal gradient in the component, and the material properties. Components, which are subjected to thermally induced stresses generally, operate within the creep range so that damage due to both fatigue and creep has to be taken into account. In order to select the correct materials for these hostile operating environmental conditions, it is vitally important to understand the behaviour of mechanical properties such as creep-fatigue properties of these materials. This paper reports the results of standard creep-fatigue tests conducted using P122 (HCM12A or 12Cr-1.8W-1.5Cu) high temperature boiler material. P122 is one of the latest developed materials for high temperature environments, which has the potential to be successful in such hostile operation environments. The tests were conducted at temperatures ranging from 550degC to 700degC at 50degC intervals with strain ranges of ±1.5 to ±3.0% at 0.5% intervals and a strain rate of 4 x 10 -3 s -1 with an application of 10-minute tensile hold time using a closed-loop hydraulic Instron material testing machine with a servo hydraulic controller. The results confirm that P122 is comparable to conventional high temperature steels. (author)

  5. Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders

    Directory of Open Access Journals (Sweden)

    Soares D.

    2006-01-01

    Full Text Available The interactions of copper substrate with titanium-alloyed Sn-Zn eutectic solders have been studied. Two series of experiments have been performed. The first one consisted in differential thermal analyses of Sn-Zn nearly eutectic alloys containing from 1.3 to 2.2 wt. % Ti. Diffusion couples consisted of Cu-wires and Sn-Zn-Ti liquid solders, produced at 250 and 275 OC have been prepared in the second series,. The contact times were up to 3600 s. The contact zones have been characterized by optical and scanning electron microscope. Two layers have been found along the interfaces solid/liquid. The first and the second layers are identical, respectively, with γ and ε phases of the Cu-Zn system. No changes of the chemical compositions were detected for the tested temperatures and reaction times. Continuous parabolic growth of the total diffusion zone thickness with the time of diffusion is observed. The growth is due mainly to one the formed layers (γ while the thickness of the ε-phase layer, stays almost constant for all tested diffusion times and temperatures.

  6. On the problem of soldering refractory metals with silver-containing solders

    International Nuclear Information System (INIS)

    Anikeev, E.F.; Andryushchenko, V.I.; Chepelenko, V.N.; Batov, V.M.

    1981-01-01

    The processes of wetting, spreading and interphase interactions of copper-silver liquid alloys alloyed with Ni and Si, with niobium, tantalum, molybdenum, tungsten, 12Kh18N10T steel and nickel are studied. It has been determined that Ni or Si additions into the copper-silver solder improve the wetting and adhesion. When soldering with the alloy containing Ni additions, the strength of a soldered Joint grows with the increase of soldering duration while soldering with the alloy containing Si additions, the strength decreases. That is why Ni-containing solders are preferable for soldering thick-walled structures, and Si-containing solders - for thin-walled structures [ru

  7. A study on creep-fatigue life analysis using a unified constitutive equation and a continuous damage law

    International Nuclear Information System (INIS)

    Hiroe, Tetsuyuki; Igari, Toshihide; Nakajima, Keiichi

    1986-01-01

    A newly developed type of life analysis is introduced using a unified constitutive equation and a continuous damage law on 2 1/4Cr - 1Mo steel at 600 deg C. the viscoplasticity theory based on total strain and overstress used for the rate effect at room temperature is extended for application to the inelastic analysis at elevated temperature, and the extended uniaxial model is shown to reproduce the inelastic stress and strain behavior with a strain rate change observed in the experiment. The incremental life prediction law is employed and its coupling with the viscoplasticity model produces both an inelastic stress-strain response and the damage accumulation, simultaneously and continuously. The life prediction for creep, fatigue and creep-fatigue loading shows good correspondence with the experimental data. (author)

  8. Creep-fatigue damage evaluation for SS-316LN (ORNL PLATES): - RCC-MR vs. ASME SEC III - NH

    International Nuclear Information System (INIS)

    Sati, Bhuwan Chandra; Jalaldeen, S.; Velusamy, K.; Selvaraj, P.

    2016-01-01

    Investigations of high temperature tests done on ORNL plate with deformation control loading, under creep-fatigue damage have been presented. The test results with methodology of RCC-MR and ASME-NH life prediction under creep-fatigue loading have been assessed. The stress relaxation effect in calculating the life using RCC-MR under creep-fatigue damage is found to be significant in presence of secondary stress. RCC-MR: 2007 is more realistic number of cycles (predicts 51 number of cycles) as compared to ASME-NH (predicts 312 number of cycles) which is demonstrated by the experimental work (observed 86 numbers of cycles). Between RCC-MR and experimental work, design code seems to be more conservative for life prediction due to creep-fatigue damage. For fatigue damage, the approaches are same and the difference comes from material properties and the starting stress for applying Neuber's rule. ASME approach has the limitation of stress range magnitude. ASME approach predicts lower elastic plus plastic strain for the cases having S* above the linear stress limit. For creep strain and creep damage evaluation, ASME and RCC-MR have different approaches for calculating the stress at the beginning and during the hold period. The RCC-MR takes account of cyclic hardening or softening effects (hardening in the present case of 316 LN) by means of the cyclic stress-strain curve and the benefit of symmetrization effects which are significant for this material. The ASME code neglects these effects and instead relies on an approach based on the isochronous stress-strain curves. (author)

  9. Evaluation of creep-fatigue crack growth for large-scale FBR reactor vessel and NDE assessment

    Energy Technology Data Exchange (ETDEWEB)

    Joo, Young Sang; Kim, Jong Bum; Kim, Seok Hun; Yoo, Bong

    2001-03-01

    Creep fatigue crack growth contributes to the failure of FRB reactor vessels in high temperature condition. In the design stage of reactor vessel, crack growth evaluation is very important to ensure the structural safety and setup the in-service inspection strategy. In this study, creep-fatigue crack growth evaluation has been performed for the semi-elliptical surface cracks subjected to thermal loading. The thermal stress analysis of a large-scale FBR reactor vessel has been carried out for the load conditions. The distributions of axial, radial, hoop, and Von Mises stresses were obtained for the loading conditions. At the maximum point of the axial and hoop stress, the longitudinal and circumferential surface cracks (i.e. PTS crack, NDE short crack and shallow long crack) were postulated. Using the maximum and minimum values of stresses, the creep-fatigue crack growth of the proposed cracks was simulated. The crack growth rate of circumferential cracks becomes greater than that of longitudinal cracks. The total crack growth of the largest PTS crack is very small after 427 cycles. The structural integrity of a large-scale reactor can be maintained for the plant life. The crack depth growth of the shallow long crack is faster than that of the NDE short crack. In the ISI of the large-scale FBR reactor vessel, the ultrasonic inspection is beneficial to detect the shallow circumferential cracks.

  10. Creep-fatigue behavior of 2 1/4Cr-1Mo steel at 5500C in air and vacuum

    International Nuclear Information System (INIS)

    Asayama, T.; Cheng, S.Z.; Asada, Y.; Mitsuhashi, S.; Tachibana, Y.

    1987-01-01

    Creep-fatigue tests were conducted with 2 1/4Cr-1Mo steel at 550 0 C under various strain wave forms in air and vacuum of 100 and 0.1 μPa. No indication of environmental effect of air was observed in 0.1 μPa vacuum in which a strain rate effect diminished. However, there observed still a time/rate dependent life reduction in a case of wave forms with a longer tension going time than compression. In addition, there observed an effect of mean stress with this steel. An analysis of stress-strain response showed the response is not affected by the test environment. Internal stresses of back and drag stress were obtained with this steel and an overstress was predicted based on phenomenology. A pure creep-fatigue life reduction was predicted based on a damage model composed of the overstress. The prediction showed a scatter of a factor of two. An effect of air environment was evaluated based on the prediction procedure. The method should be improved to include the effect of mean stress on creep-fatigue behavior of this steel

  11. Creep-fatigue assessment of a thermina test specimen using the R5 procedure

    International Nuclear Information System (INIS)

    Booth, P.; Budden, P.J.; Bate, S.K.

    1997-01-01

    A creep-fatigue life assessment of an axisymmetric 316 stainless steel test specimen under constant mechanical and cyclic thermal shock loading using the R5 Procedure is described in this paper. This test was carried out at CEA, France, and formed part of the 'Thermina' series. Stress analysis has been carried out using both full inelastic finite element analysis and also the simplified shakedown methods, based on elastic calculation, within R5. The estimates of strain range and the stress at the start of the creep dwell have then been used with R5 to estimate creep and fatigue damage per cycle and hence to make predictions of component life. The predicted lives are compared with the lives observed in the tests. The simplified R5 estimate of life, based on development of a crack of depth 200 microns, is 260 cycles using best-estimate material properties. Experimentally, cracks of depth at least 150 microns were observed in between 526 and 650 cycles, for two similar tests. The simplified R5 route therefore leads to an estimate of life which is conservative but not unduly so on this component. Detailed cyclic inelastic analysis using the ORNL constitutive model and the ABAQUS finite element code to estimate the strain range and dwell stress led to a best estimate of 618 cycles to crack initiation using R5. (author). 16 refs, 11 figs, 4 tabs

  12. French recent developments in support to rules for creep and creep-fatigue analyses

    International Nuclear Information System (INIS)

    Touboul, F.; Moulin, D.

    1997-01-01

    RCC-MR proposes Design rules for creep and creep-fatigue damage evaluation in zones with no geometrical discontinuities. Rules have been developed, based on the σ d concept, in order to consider zones with geometrical discontinuities. Rule for Weld are proposed in the paragraph relative to shell design rules and reduction coefficient due to material properties are given in Appendix A9. For fatigue analysis, last version of RCC-MR (1993) has proposed a reduction factor on fatigue curves (Jf value), derived from preliminary tests performed within European program. Studies have been carried out in order to have a better understanding of the phenomena involved in these fatigue reduction factors. Tests have been performed on large plates, with varying applied displacements, weld geometry, plate thickness, weld direction. It appears that material effect is not the only purpose to be considered but that it is necessary to think about the geometrical effect, linked to the welded zone dimensions, and the elastic follow-up effect between the two materials: base metal and weld metal. As a first approach, simplified calculations have been achieved with precise material characterization. Roche's method and Zarka method's give conservative result in comparison to tests results. (author). 3 refs, 4 tabs

  13. Creep-fatigue evaluation method for type 304 and 316FR SS

    International Nuclear Information System (INIS)

    Wada, Y.; Aoto, K.; Ueno, F.

    1997-01-01

    For long-term creep-fatigue of Type 304SS, intergranular failure is dominant in the case of significant life reduction. It is considered that this phenomenon has its origin in the grain boundary sliding as observed in cavity-type creep-rupture. Accordingly a simplified procedure to estimate intergranular damages caused by the grain boundary sliding is presented in connection with the secondary creep. In the conventional ductility exhaustion method, failure ductility includes plastic strain, and damage estimation is based on the primary creep strain, which is recoverable during strain cycling. Therefore the accumulated creep strain becomes a very large value, and quite different from grain boundary sliding strain. As a new concept on ductility exhaustion, the product of secondary creep rate and time to rupture (Monkman-Grant product) is applied to fracture ductility, and grain boundary sliding strain is approximately estimated using the accumulated secondary creep strain. From the new concept it was shown that the time fraction rule and the conventional ductility exhaustion method can be derived analytically. Furthermore an advanced method on cyclic stress relaxation was examined. If cyclic plastic strain hardening is softened thermally during strain hold, cyclic creep strain behaviour is also softened. An unrecoverable accumulated primary creep strain causes hardening of the primary creep, and the reduction of deformation resistance to the secondary creep caused by thermal softening accelerates grain boundary sliding rate. As the results creep damages depend not on applied stress but on effective stress. The new concept ductility exhaustion method based on the above consideration leads up to simplified time fraction estimation method only by continuous cycling fatigue and monotonic creep which was already developed in PNC for Monju design guide. This method gave good life prediction for the intergranular failure mode and is convenient for design use on the elastic

  14. Stable and unstable fatigue crack propagation during high temperature creep-fatigue in austenitic steels: the role of precipitation

    International Nuclear Information System (INIS)

    Lloyd, G.J.; Wareing, J.

    1979-01-01

    The distinction between stable and unstable fatigue crack propagation during high temperature creep-fatigue in austenitic stainless steels is introduced. The transition from one class of behavior to the other is related to the precipitate distribution and to the nature of the prevailing crack path. It is shown by reference to new studies and examples drawn from the literature that this behavior is common to both high strain and predominantly elastic fatigue in austenitic stainless steels. The relevance of this distinction to a mechanistic approach to high temperature plant design is discussed

  15. Final Report on in-reactor creep-fatigue deformation behaviour of a CuCrZr alloy: COFAT 1

    Energy Technology Data Exchange (ETDEWEB)

    Singh, B.N. [Risoe National Lab. - DTU, Materials Research Dept., Roskilde (Denmark); Taehtinen, S.; Moilanen, P. [VTT Industrial Systems (Finland); Jacquet, P.; Dekeyser, J. [SCK-CEN, Reactor Technology Design Dept., Mol (Belgium); Edwards, D.J. [Pacific Northwest National Lab., Reactor Technology Design Dept., Richland (United States); Li, M. [Oak Ridge National Lab., Materials Science and Technology Div., Oak Ridge, Tennessee (United States); Stubbins, J.F. [Univ. of Illinois, Dept. of Nuclear, Plasma and Radiological Engineering, Urbane, Illinois (United States)

    2007-08-15

    At present, practically nothing is known about the deformation behaviour of materials subjected simultaneously to external cyclic force and neutron irradiation. The main objective of the present work is to determine experimentally the mechanical response and resulting microstructural changes in CuCrZr(HT1) alloy exposed concurrently to flux of neutrons and creep-fatigue cyclic loading directly in a fission reactor. Special experimental facilities were designed and fabricated for this purpose. A number of in-reactor creep-fatigue experiments were successfully carried out in the BR-2 reactor at Mol (Belgium). In the present report we first describe the experimental facilities and the details of the in-reactor creep-fatigue experiments carried out at 363 and 343K at a strain amplitude of 0.5% with hold-times of 10 and 100s, respectively. For comparison purposes, similar creep-fatigue tests were performed outside of the reactor. (i.e. in the absence of neutron irradiation). During in-reactor tests, the mechanical response was continuously registered throughout the whole test. The results are first presented in the form of hysteresis loops confirming that the nature of deformation during these tests was truly cyclic. The temporal evolution of the stress response in the specimens is presented in the form of the average maximum stress amplitude as a function of the number of cycles as well as a function of displacement dose accumulated during the tests. The results illustrate the nature and magnitude of cyclic hardening as well as softening as a function of the number of cycles and displacement dose. Details of the microstructure were investigated using TEM and STEM techniques. The fracture surface morphology was investigated using SEM technique. Both mechanical and microstructural results are briefly discussed. The main conclusion emerging from the limited amount of present results is that neither the irradiation nor the duration of the hold-time have any significant

  16. Life assessment of Mod.9Cr-1Mo steel. Quantitative evaluation of microstructural damage in creep interrupted specimens and in creep-fatigue specimens

    International Nuclear Information System (INIS)

    Maruyama, Kouichi; Kato, Syoichi; Nagae, Yuji

    1999-02-01

    Boiler and steam turbine components in power generating plants are used under creep and creep-fatigue conditions. It is important to measure both creep and creep-fatigue damage of the components in order to assess the residual life of the components. Modified 9Cr-1Mo steel, a candidate material for steam generator in FBR, has a tempered martensitic lath structure. It was proposed in the second report that lath width in the lath structure is closely related to creep strain, and using this relation one can assess residual creep life of a structural component made of the steel. The objectives of this study are to investigate the change of the lath structure during creep.fatigue deformation, and to estimate creep strain by measuring area of cell composing the lath structure. The area of cell can be a better measure of creep deformation than the lath width. The lath structure is covered during creep-fatigue deformation. The lath structure becomes equiaxed cell structure under creep-fatigue more quickly compared with the lath structure recovered during creep. The lath structure recovered under creep-fatigue has a stationary value of the lath width determined by maximum stress at Nf/2. (Nf: number of cycles) If the recovery process of the lath structure can be investigated under creep-fatigue, the lath width can be a measure of the life assessment under creep-fatigue. Area of cell composing the lath structure increases with creep deformation and reaches a stationary value S s determined by creep stress. The rate of increase in the area is faster at a higher stress and temperature. A normalized change in the area of cell, ΔS/ΔS s , was introduced as a measure of the recovery process of martensitic lath structure. ΔS is the change in area of cell from the initial value S 0 , ΔS s is the difference between S s and S 0 . ΔS/ΔS s is uniquely related to creep strain independent of creep conditions. However, the scatter of data in ΔS/ΔS s -strain relation is wider than

  17. Study on deformation behavior and life evaluation method for SUS304 notched plate under bending creep fatigue loading

    International Nuclear Information System (INIS)

    Fukuda, Yoshio; Satoh, Yoshimi; Nakamura, Kazuhiro; Takahashi, Yukio; Kuwabara, Kazuo.

    1990-01-01

    Creep-fatigue tests were carried out on notched plates under cyclic bending loads out of plane at 550degC, and the local strain at the notch-root and micro crack propagation behavior were measured. Then, inelastic analysis was performed for the experiment by using three kinds of constitutive models, such as kinematic hardening, ORNL and Ohno models. From the comparison of the experiment with the results of analysis, the following conclusions were obtained. (1) Creep strain caused at the notch-root during load holding was negligibly small compared with plastic strain, so that the neighborhood of the notch-root is subjected to constrained strain type damage. (2) The strain range at the notch-root can be calculated from the results of elastic-plastic analysis for monotonic loading independent of the constitutive models used, where the cyclic stress-strain relationship was used as the material monotonic deformation property. (3) The mean strain calculated was consistent with the experimental value in case of kinematic hardening or ORNL model, while not in case of Ohno model. (4) A method for predicting the crack initiation life of a notched plate has been proposed on the basis of micro-crack propagation behavior obtained by a fundamental creep-fatigue test. (author)

  18. A study on metallic creep-fatigue interaction at elevated temperatures

    International Nuclear Information System (INIS)

    Ohnami, Masateru; Sakane, Masao

    1978-01-01

    In order to investigate the difference between the hold-time effect in push-pull low-cycle fatigue and that in torsional one, both types of strain controlled fatigue tests of SUS 316 stainless steel were performed at 600 0 C with or without hold-time. Significant difference between the push-pull and torsional fatigue test data on the basis of equivalent total strain range of Mises' type was not observed in terms of number of cycles to failure, number of cycles to crack initiation and crack propagation rate. More precisely speaking, however, the push-pull test had a larger hold-time effect on the failure life and on the crack behaviors than the torsional test in lower strain range. That is, slower crack propagation rate was observed in the push-pull test without hold-time than in torsional one, but crack propagation was observed in the push-pull test with hold-time. This crack behavior was discussed from the influence of stress triaxiality near the crack tip on the crack propagation rate and also from the effect of hydrostatic stress. (author)

  19. Microstructural characterisation and constitutive behaviour of alloy RR1000 under fatigue and creep-fatigue loading conditions

    International Nuclear Information System (INIS)

    Stoecker, C.; Zimmermann, M.; Christ, H.-J.; Zhan, Z.-L.; Cornet, C.; Zhao, L.G.; Hardy, M.C.; Tong, J.

    2009-01-01

    Mechanical behaviour of a nickel-based superalloy, RR1000, has been investigated at 650 deg. C under cyclic and dwell loading conditions. The microstructural characteristics of the alloy have been studied using scanning electron microscopy (SEM) and transmission electron microscopy (TEM), and the distribution patterns of the dislocations and slip planes have been compared between samples tested under fatigue and creep-fatigue loading conditions. Constitutive behaviour of the alloy was described by a unified constitutive model, where both cyclic plastic and viscoplastic strains were represented by one inelastic strain. The results show that the precipitation state is very stable at 650 deg. C and only minor differences exist in the dislocation arrangements formed under pure fatigue and combined creep and fatigue conditions. Hence, a unified constitutive model seems to be justified in describing and predicting the constitutive behaviour in both cases.

  20. Comparison of various 9-12%Cr steels under fatigue and creep-fatigue loadings at high temperature

    International Nuclear Information System (INIS)

    Fournier, B.; Dalle, F.; Sauzay, M.; Longour, J.; Salvi, M.; Caes, C.; Tournie, I.; Giroux, P.F.; Kim, S.H.

    2011-01-01

    The present article compares the cyclic behaviour of various 9-12%Cr steels, both commercial grades and optimized materials (in terms of creep strength). These materials were subjected to high temperature fatigue and creep-fatigue loadings. TEM examinations of the microstructure after cyclic loadings were also carried out. It appears that all the tempered ferritic-martensitic steels suffer from a cyclic softening effect linked to the coarsening of the sub-grains and laths and to the decrease of the dislocation density. These changes of the microstructure lead to a drastic loss in creep strength for all the materials under study. However, due to a better precipitation state, several materials optimized for their creep strength still present a good creep resistance after cyclic softening. These results are discussed and compared to the literature in terms of the physical mechanisms responsible for cyclic and creep deformation at the microstructural scale. (authors)

  1. Creep-Fatigue Life Design with Various Stress and Temperature Conditions on the Basis of Lethargy Coefficient

    International Nuclear Information System (INIS)

    Park, Jung Eun; Yang, Sung Mo; Han, Jae Hee; Yu, Hyo Sun

    2011-01-01

    High temperature and stress are encounted in power plants and vehicle engines. Therefore, determination of the creep-fatigue life of a material is necessary prior to fabricating equipment. In this study, life design was determined on the basis of the lethargy coefficient for different temperatures, stress and rupture times. SP-Creep test data was compared with computed data. The SP-Creep test was performed to obtain the rupture time for X20CrMoV121 steel. The integration life equation was considered for three cases with various load, temperature and load-temperature. First, the lethargy coefficient was calculated by using the obtained rupture stress and the rupture time that were determined by carrying out the SP-Creep test. Next, life was predicted on the basis of the temperature condition. Finally, it was observed that life decreases considerably due to the coupling effect that results when fatigue and creep occur simultaneously

  2. Creep-fatigue evaluation method for weld joint of Mod.9Cr-1Mo steel Part II: Plate bending test and proposal of a simplified evaluation method

    Energy Technology Data Exchange (ETDEWEB)

    Ando, Masanori, E-mail: ando.masanori@jaea.go.jp; Takaya, Shigeru, E-mail: takaya.shigeru@jaea.go.jp

    2016-12-15

    Highlights: • Creep-fatigue evaluation method for weld joint of Mod.9Cr-1Mo steel is proposed. • A simplified evaluation method is also proposed for the codification. • Both proposed evaluation method was validated by the plate bending test. • For codification, the local stress and strain behavior was analyzed. - Abstract: In the present study, to develop an evaluation procedure and design rules for Mod.9Cr-1Mo steel weld joints, a method for evaluating the creep-fatigue life of Mod.9Cr-1Mo steel weld joints was proposed based on finite element analysis (FEA) and a series of cyclic plate bending tests of longitudinal and horizontal seamed plates. The strain concentration and redistribution behaviors were evaluated and the failure cycles were estimated using FEA by considering the test conditions and metallurgical discontinuities in the weld joints. Inelastic FEA models consisting of the base metal, heat-affected zone and weld metal were employed to estimate the elastic follow-up behavior caused by the metallurgical discontinuities. The elastic follow-up factors determined by comparing the elastic and inelastic FEA results were determined to be less than 1.5. Based on the estimated elastic follow-up factors obtained via inelastic FEA, a simplified technique using elastic FEA was proposed for evaluating the creep-fatigue life in Mod.9Cr-1Mo steel weld joints. The creep-fatigue life obtained using the plate bending test was compared to those estimated from the results of inelastic FEA and by a simplified evaluation method.

  3. Creep-fatigue life prediction for different heats of Type 304 stainless steel by linear-damage rule, strain-range partitioning method, and damage-rate approach

    International Nuclear Information System (INIS)

    Maiya, P.S.

    1978-07-01

    The creep-fatigue life results for five different heats of Type 304 stainless steel at 593 0 C (1100 0 F), generated under push-pull conditions in the axial strain-control mode, are presented. The life predictions for the various heats based on the linear-damage rule, strain-range partitioning method, and damage-rate approach are discussed. The appropriate material properties required for computation of fatigue life are also included

  4. Creep-fatigue evaluation method for weld joint of Mod.9Cr-1Mo steel Part II: Plate bending test and proposal of a simplified evaluation method

    International Nuclear Information System (INIS)

    Ando, Masanori; Takaya, Shigeru

    2016-01-01

    Highlights: • Creep-fatigue evaluation method for weld joint of Mod.9Cr-1Mo steel is proposed. • A simplified evaluation method is also proposed for the codification. • Both proposed evaluation method was validated by the plate bending test. • For codification, the local stress and strain behavior was analyzed. - Abstract: In the present study, to develop an evaluation procedure and design rules for Mod.9Cr-1Mo steel weld joints, a method for evaluating the creep-fatigue life of Mod.9Cr-1Mo steel weld joints was proposed based on finite element analysis (FEA) and a series of cyclic plate bending tests of longitudinal and horizontal seamed plates. The strain concentration and redistribution behaviors were evaluated and the failure cycles were estimated using FEA by considering the test conditions and metallurgical discontinuities in the weld joints. Inelastic FEA models consisting of the base metal, heat-affected zone and weld metal were employed to estimate the elastic follow-up behavior caused by the metallurgical discontinuities. The elastic follow-up factors determined by comparing the elastic and inelastic FEA results were determined to be less than 1.5. Based on the estimated elastic follow-up factors obtained via inelastic FEA, a simplified technique using elastic FEA was proposed for evaluating the creep-fatigue life in Mod.9Cr-1Mo steel weld joints. The creep-fatigue life obtained using the plate bending test was compared to those estimated from the results of inelastic FEA and by a simplified evaluation method.

  5. Soldering in electronics assembly

    CERN Document Server

    Judd, Mike

    2013-01-01

    Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem

  6. Creep-Fatigue Damage Evaluation of a Model Reactor Vessel and Reactor Internals of Sodium Test Facility according to ASME-NH and RCC-MRx Codes

    International Nuclear Information System (INIS)

    Lim, Dong-Won; Lee, Hyeong-Yeon; Eoh, Jae-Hyuk; Son, Seok-Kwon; Kim, Jong-Bum; Jeong, Ji-Young

    2016-01-01

    The objective of the STELLA-2 is to support the specific design approval for PGSFR by synthetic reviews of key safety issues and code validations through the integral effect tests. Due to its high temperature operation in SFRs (and in a testing facility) up to 550 °C, thermally induced creep-fatigue damage is very likely in components including a reactor vessel, reactor internals (interior structures), heat exchangers, pipelines, etc. In this study, structural integrity of the components such as reactor vessel and internals in STELLA-2 has been evaluated against creep-fatigue failures at a concept-design step. As 2D analysis yields far conservative results, a realistic 3D simulation is performed by a commercial software. A design integrity guarding against a creep-fatigue damage failure operating at high temperature was evaluated for the reactor vessel with its internal structure of the STELLA-2. Both the high temperature design codes were used for the evaluation, and results were compared. All the results showed the vessel as a whole is safely designed at the given operating conditions, while the ASME-NH gives a conservative evaluation

  7. Creep-Fatigue Damage Evaluation of a Model Reactor Vessel and Reactor Internals of Sodium Test Facility according to ASME-NH and RCC-MRx Codes

    Energy Technology Data Exchange (ETDEWEB)

    Lim, Dong-Won; Lee, Hyeong-Yeon; Eoh, Jae-Hyuk; Son, Seok-Kwon; Kim, Jong-Bum; Jeong, Ji-Young [KAERI, Daejeon (Korea, Republic of)

    2016-05-15

    The objective of the STELLA-2 is to support the specific design approval for PGSFR by synthetic reviews of key safety issues and code validations through the integral effect tests. Due to its high temperature operation in SFRs (and in a testing facility) up to 550 °C, thermally induced creep-fatigue damage is very likely in components including a reactor vessel, reactor internals (interior structures), heat exchangers, pipelines, etc. In this study, structural integrity of the components such as reactor vessel and internals in STELLA-2 has been evaluated against creep-fatigue failures at a concept-design step. As 2D analysis yields far conservative results, a realistic 3D simulation is performed by a commercial software. A design integrity guarding against a creep-fatigue damage failure operating at high temperature was evaluated for the reactor vessel with its internal structure of the STELLA-2. Both the high temperature design codes were used for the evaluation, and results were compared. All the results showed the vessel as a whole is safely designed at the given operating conditions, while the ASME-NH gives a conservative evaluation.

  8. Influence of reference stress formulae on creep and creep-fatigue crack initiation and growth prediction in plate components

    Energy Technology Data Exchange (ETDEWEB)

    Wasmer, K., E-mail: kilian.wasmer@empa.c [Empa, Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Advanced Materials Processing, Feuerwerkerstrasse 39, 3602 Thun (Switzerland); Nikbin, K.M.; Webster, G.A. [Department of Mechanical Engineering, Imperial College London, London SW7 2BX (United Kingdom)

    2010-08-15

    Creep and creep-fatigue crack growth in pre-cracked plates of 316L(N) austenitic stainless steel, containing a semi-elliptical surface defect and tested at 650 {sup o}C under combined axial and bending loading, are investigated. The results have been interpreted in terms of the creep fracture mechanics parameter C* and compared with data obtained on standard compact tension (CT) specimens of the same material and batch. In making the assessments, the reference stress method has been used to determine C*. Several formulae exist for calculating the reference stress depending on whether it is based on a 'global' or a 'local' collapse mechanism and the assessment procedure adopted. When using this approach, it has been found that the most satisfactory comparison of crack growth rates with standard CT specimen data is obtained when the 'global' reference stress solution is used in conjunction with mean uniaxial creep properties. It has been found that the main effect of changing the fatigue cycle range from 0.1 to -1.0 is to cause an acceleration in the early stage of cracking.

  9. Influence of reference stress formulae on creep and creep-fatigue crack initiation and growth prediction in plate components

    International Nuclear Information System (INIS)

    Wasmer, K.; Nikbin, K.M.; Webster, G.A.

    2010-01-01

    Creep and creep-fatigue crack growth in pre-cracked plates of 316L(N) austenitic stainless steel, containing a semi-elliptical surface defect and tested at 650 o C under combined axial and bending loading, are investigated. The results have been interpreted in terms of the creep fracture mechanics parameter C* and compared with data obtained on standard compact tension (CT) specimens of the same material and batch. In making the assessments, the reference stress method has been used to determine C*. Several formulae exist for calculating the reference stress depending on whether it is based on a 'global' or a 'local' collapse mechanism and the assessment procedure adopted. When using this approach, it has been found that the most satisfactory comparison of crack growth rates with standard CT specimen data is obtained when the 'global' reference stress solution is used in conjunction with mean uniaxial creep properties. It has been found that the main effect of changing the fatigue cycle range from 0.1 to -1.0 is to cause an acceleration in the early stage of cracking.

  10. SMT soldering handbook

    National Research Council Canada - National Science Library

    Strauss, Rudolf

    1998-01-01

    ... 3.2.1 Constituents, melting behaviour and mechanical properties 3.2.2 Composition of solders for use in electronics 3.2.3 Lead-free solders 3.2.4 Solder impurities The soldered joint 3.3.1 Solde...

  11. Monitoring microstructural evolution of alloy 617 with non-linear acoustics for remaining useful life prediction; multiaxial creep-fatigue and creep-ratcheting

    Energy Technology Data Exchange (ETDEWEB)

    Lissenden, Cliff [Pennsylvania State Univ., State College, PA (United States); Hassan, Tasnin [North Carolina State Univ., Raleigh, NC (United States); Rangari, Vijaya [Tuskegee Univ., Tuskegee, AL (United States)

    2014-10-30

    The research built upon a prior investigation to develop a unified constitutive model for design-­by-­analysis of the intermediate heat exchanger (IHX) for a very high temperature reactor (VHTR) design of next generation nuclear plants (NGNPs). Model development requires a set of failure data from complex mechanical experiments to characterize the material behavior. Therefore uniaxial and multiaxial creep-­fatigue and creep-­ratcheting tests were conducted on the nickel-­base Alloy 617 at 850 and 950°C. The time dependence of material behavior, and the interaction of time dependent behavior (e.g., creep) with ratcheting, which is an increase in the cyclic mean strain under load-­controlled cycling, are major concerns for NGNP design. This research project aimed at characterizing the microstructure evolution mechanisms activated in Alloy 617 by mechanical loading and dwell times at elevated temperature. The acoustic harmonic generation method was researched for microstructural characterization. It is a nonlinear acoustics method with excellent potential for nondestructive evaluation, and even online continuous monitoring once high temperature sensors become available. It is unique because it has the ability to quantitatively characterize microstructural features well before macroscale defects (e.g., cracks) form. The nonlinear acoustics beta parameter was shown to correlate with microstructural evolution using a systematic approach to handle the complexity of multiaxial creep-­fatigue and creep-­ratcheting deformation. Mechanical testing was conducted to provide a full spectrum of data for: thermal aging, tensile creep, uniaxial fatigue, uniaxial creep-­fatigue, uniaxial creep-ratcheting, multiaxial creep-fatigue, and multiaxial creep-­ratcheting. Transmission Electron Microscopy (TEM), Scanning Electron Microscopy (SEM), and Optical Microscopy were conducted to correlate the beta parameter with individual microstructure mechanisms. We researched

  12. Damage Assessment of Heat Resistant Steels through Electron BackScatter Diffraction Strain Analysis under Creep and Creep-Fatigue Conditions

    Science.gov (United States)

    Fujiyama, Kazunari; Kimachi, Hirohisa; Tsuboi, Toshiki; Hagiwara, Hiroyuki; Ogino, Shotaro; Mizutani, Yoshiki

    EBSD(Electron BackScatter Diffraction) analyses were conducted for studying the quantitative microstructural metrics of creep and creep-fatigue damage for austenitic SUS304HTB boiler tube steel and ferritic Mod.9Cr piping steel. KAM(Kernel Average Misorientation) maps and GOS(Grain Orientation Spread) maps were obtained for these samples and the area averaged values KAMave and GOSave were obtained. While the increasing trends of these misorientation metrics were observed for SUS304HTB steel, the decreasing trends were observed for damaged Mod.9Cr steel with extensive recovery of subgrain structure. To establish more universal parameter representing the accumulation of damage to compensate these opposite trends, the EBSD strain parameters were introduced for converting the misorientation changes into the quantities representing accumulated permanent strains during creep and creep-fatigue damage process. As KAM values were dependent on the pixel size (inversely proportional to the observation magnification) and the permanent strain could be expressed as the shear strain which was the product of dislocation density, Burgers vector and dislocation movement distance, two KAM strain parameters MεKAMnet and MεδKAMave were introduced as the sum of product of the noise subtracted KAMnet and the absolute change from initial value δKAMave with dislocation movement distance divided by pixel size. MεδKAMave parameter showed better relationship both with creep strain in creep tests and accumulated creep strain range in creep-fatigue tests. This parameter can be used as the strain-based damage evaluation and detector of final failure.

  13. A continuous damage approach for the analysis of creep-fatigue behavior of 2 1/4 Cr - 1 Mo steel

    International Nuclear Information System (INIS)

    Gomuc, R.; Biron, A.; Bui-Quoc, T.

    1985-01-01

    Components made from 2 1/4 Cr-1 Mo in thermal and nuclear power plants have usually been designed for lifetimes as long as forty years at service temperatures approaching 593 o C. While several experimental investigations on the creep-fatigue behaviour of such materials have been reported, a detailed analysis of material behavior under these loading conditions is not available, to the authors knowledge. The aim of the present paper is to report the results of an analysis on these experimental data using a recently developed procedure. (author)

  14. Local strain in front of cracks in the case of creep fatigue

    International Nuclear Information System (INIS)

    Rie Kyongtschong; Olfe, J.

    1993-01-01

    In-situ measurements of strain fields in front of cracks were performed for high temperature Low Cycle Fatigue (LCF) with different hold times by means of a grid method. The tests were carried out on the austenitic stainless steel 304 L and the ferritic steel X22 CrMoV 12 1. Simultaneous observation of crack growth leads to a correlation between crack growth and local strain. The interaction of creep and fatigue related to strain concentration at the crackk tip and crack growth was discussed. A model is proposed which is based on the formation of cavities on grain boundaries. (orig.) [de

  15. Creep-fatigue effects in structural materials used in advanced nuclear power generating systems

    International Nuclear Information System (INIS)

    Brinkman, C.R.

    1980-01-01

    Various aspects of time-dependent fatigue behavior of a number of structural alloys in use or planned for use in advanced nuclear power generating systems are reviewed. Materials included are types 304 and 316 stainless steel, Fe-2 1/4 Cr-1 Mo steel, and alloy 800H. Examples of environmental effects, including both chemical and physical interaction, are presented for a number of environments. The environments discussed are high-purity liquid sodium, high vacuum, air, impure helium, and irradiation damage, including internal helium bubble generation

  16. Study of creep-fatigue behavior in a 1000 MW rotor using a phenomenological lifetime model

    Energy Technology Data Exchange (ETDEWEB)

    Zhao, Nailong; Wang, Weizhe; Jiang, Jishen; Liu, Yingzheng [School of Mechanical Engineering, Shanghai (China)

    2017-02-15

    In this study, the phenomenological lifetime model was applied to part of an ultra-supercritical steam turbine rotor model to predict its lifetime as a post processing of the finite element method. To validate the accuracy and adaptation of the post processing program, stress strain hysteresis loops of a cylinderal model under service-like load cycle conditions in cycle N = 1 and 300 were constructed, and the comparison of the results with experimental data on the same cylinderal specimen showed them to be satisfactory. The temperature and von Mises stress distributions of the rotor during a startup-running-shutdown-natural cool process were numerically studied using ABAQUS and the damage caused by the interaction of creep and fatigue was subsequently computed and discussed. It was found that the maximum damage appeared at the inlet notch zone, with the blade groove areas and the front notch areas also suffering a large damage amplitude.

  17. Interface between Sn-Sb-Cu solder and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sebo, P., E-mail: Pavel.Sebo@savba.sk [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Racianska 75, 831 02 Bratislava 3 (Slovakia); Svec, P. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janickovic, D.; Illekova, E. [Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, 845 11 Bratislava 45 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine)

    2011-07-15

    Highlights: {yields} New lead-free solder materials based on Sn-Sb-Cu were designed and prepared. {yields} Melting and solidification temperatures of the solders have been determined. {yields} Cu-substrate/solder interaction has been analyzed and quantified. {yields} Phases formed at the solder-substrate interface have been identified. {yields} Composition and soldering atmospheres were correlated with joint strength. - Abstract: Influence of antimony and copper in Sn-Sb-Cu solder on the melting and solidification temperatures and on the microstructure of the interface between the solder and copper substrate after wetting the substrate at 623 K for 1800 s were studied. Microstructure of the interface between the solder and copper substrates in Cu-solder-Cu joints prepared at the same temperature for 1800 s was observed and shear strength of the joints was measured. Influence of the atmosphere - air with the flux and deoxidising N{sub 2} + 10H{sub 2} gas - was taken into account. Thermal stability and microstructure were studied by differential scanning calorimetry (DSC), light microscopy, scanning electron microscopy (SEM) with energy-dispersive spectrometry (EDS) and X-ray diffraction (XRD). Melting and solidification temperatures of the solders were determined. An interfacial transition zone was formed by diffusion reaction between solid copper and liquid solder. At the interface Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} phases arise. Cu{sub 3}Sn is adjacent to the Cu substrate and its thickness decreases with increasing the amount of copper in solder. Scallop Cu{sub 6}Sn{sub 5} phase is formed also inside the solder drop. The solid solution Sn(Sb) and SbSn phase compose the interior of the solder drop. Shear strength of the joints measured by push-off method decreases with increasing Sb concentration. Copper in the solder shows even bigger negative effect on the strength.

  18. Multiaxial Creep-Fatigue and Creep-Ratcheting Failures of Grade 91 and Haynes 230 Alloys Toward Addressing Design Issues of Gen IV Nuclear Power Plants

    Energy Technology Data Exchange (ETDEWEB)

    Hassan, Tasnim [North Carolina State Univ., Raleigh, NC (United States); Lissenden, Cliff [Penn State Univ., University Park, PA (United States); Carroll, Laura [Idaho National Lab. (INL), Idaho Falls, ID (United States)

    2015-04-01

    The proposed research will develop systematic sets of uniaxial and multiaxial experimental data at a very high temperature (850-950°C) for Alloy 617. The loading histories to be prescribed in the experiments will induce creep-fatigue and creep-ratcheting failure mechanisms. These experimental responses will be scrutinized in order to quantify the influences of temperature and creep on fatigue and ratcheting failures. A unified constitutive model (UCM) will be developed and validated against these experimental responses. The improved UCM will be incorporated into the widely used finite element commercial software packages ANSYS. The modified ANSYS will be validated so that it can be used for evaluating the very high temperature ASME-NH design-by-analysis methodology for Alloy 617 and thereby addressing the ASME-NH design code issues.

  19. Multiaxial Creep-Fatigue and Creep-Ratcheting Failures of Grade 91 and Haynes 230 Alloys Toward Addressing Design Issues of Gen IV Nuclear Power Plants

    International Nuclear Information System (INIS)

    Hassan, Tasnim; Lissenden, Cliff; Carroll, Laura

    2015-01-01

    The proposed research will develop systematic sets of uniaxial and multiaxial experimental data at a very high temperature (850-950°C) for Alloy 617. The loading histories to be prescribed in the experiments will induce creep-fatigue and creep-ratcheting failure mechanisms. These experimental responses will be scrutinized in order to quantify the influences of temperature and creep on fatigue and ratcheting failures. A unified constitutive model (UCM) will be developed and validated against these experimental responses. The improved UCM will be incorporated into the widely used finite element commercial software packages ANSYS. The modified ANSYS will be validated so that it can be used for evaluating the very high temperature ASME-NH design-by-analysis methodology for Alloy 617 and thereby addressing the ASME-NH design code issues.

  20. Creep-fatigue propagation of semi-elliptical crack at 650 deg. C in 316L(N) stainless steel plates with or without welded joints

    International Nuclear Information System (INIS)

    Curtit, F.

    2000-01-01

    This study realised in LISN Laboratory of CEA Saclay, deals with the creep fatigue propagation of semi elliptical crack at the temperature of 650 deg C in 316L(N) stainless steel plates with or without welded joints. A vast majority of the studies on creep fatigue propagation models are based on specimen (CT) especially designed for crack propagation study. The PLAQFLU program performed in LISN laboratory deals with the application and adaptation of these models to complex crack shape, which are more representative of the cracks observed in industrial components. In this scope, we use propagation tests realised at the temperature of 650 deg C with wide plates containing semi elliptical defects. For some of them, the initial defect is machined in the middle of a welded joint, which constitute a privileged site for the crack initiation. The approach used in this study is based on global parameters of fracture mechanics. At first, tests on CT specimen are used in order to determine the propagation laws correlating the crack growth rate to the global parameters K or C * . These laws are then supposed to be intrinsic to our materials and are used to analysed the semi elliptical crack propagation. The analysis of the comportment of the crack during the hold time demonstrates the possibility to establish a correlation between the crack propagation both in the deepest and the surface point and the local value of C * . These correlations are coherent in the different points of the crack front for the different applied hold times, and they present a reasonably good agreement with the creep propagation law identified on CT specimen. The simulation of test performed on based metal specimen with a model of summation of both creep and pure fatigue crack growth gives acceptable results when the calculus of the simplified expression of C * s considers a continuous evolution of creep deformations rate during the all test. (author)

  1. Thermal fatigue strength estimation of 2.25Cr-1Mo steel under creep-fatigue interaction

    International Nuclear Information System (INIS)

    Kuwahara, Kazuo; Nitta, Akihito; Kitamura, Takayuki

    1980-01-01

    A 2-1/4Cr-1Mo steel is one of principal materials for high temperature equipments in nuclear and thermal power plants. The authors experimentally analyzed the high temperature fatigue strength and creep strength of a 2-1/4 Cr-1Mo steel main steam pipe which had been used in a thermal plant for operation up to 130,000 hours, and pointed out that the strain-range vs. life curves crossed each other due to the difference of temperature-strain phase in thermal fatigue. This suggests that it is difficult to estimate thermal fatigue life of steel materials having been subjected to different temperature-strain phase on the basis of isothermal low-cycle fatigue life at the upper limit temperature of thermal fatigue, and that it is urgently required to establish an appropriate method of evaluating thermal fatigue life. The authors attempted to prove that the strain range partitioning method used for the evaluation of thermal fatigue life in SUS 304 steels is applicable to this 2-1/4Cr-1Mo steel. Consequently, it was found that the thermal fatigue life could be estimated within a factor of 2.5 by the application of this method. (author)

  2. Development of plate-fin heat exchanger for intermediate heat exchanger of high-temperature gas cooled reactor. Fabrication process, high-temperature strength and creep-fatigue life prediction of plate-fin structure made of Hastelloy X

    International Nuclear Information System (INIS)

    Mizokami, Yorikata; Igari, Toshihide; Nakashima, Keiichi; Kawashima, Fumiko; Sakakibara, Noriyuki; Kishikawa, Ryouji; Tanihira, Masanori

    2010-01-01

    The helium/helium heat exchanger (i.e., intermediate heat exchanger: IHX) of a high-temperature gas-cooled reactor (HTGR) system with nuclear heat applications is installed between a primary system and a secondary system. IHX is operated at the highest temperature of 950degC and has a high capacity of up to 600 MWt. A plate-fin-type heat exchanger is the most suitable for IHX to improve construction cost. The purpose of this study is to develop an ultrafine plate-fin-type heat exchanger with a finer pitch fin than a conventional technology. In the first step, fabrication conditions of the ultrafine plate fin were optimized by press tests. In the second step, a brazing material was selected from several candidates through brazing tests of rods, and brazing conditions were optimized for plate-fin structures. In the third step, tensile strength, creep rupture, fatigue, and creep-fatigue tests were performed as typical strength tests for plate-fin structures. The obtained data were compared with those of the base metal and plate-fin element fabricated from SUS316. Finally, the accuracy of the creep-fatigue life prediction using both the linear cumulative damage rule and the equivalent homogeneous solid method was confirmed through the evaluation of creep-fatigue test results of plate-fin structures. (author)

  3. Characterizing the Soldering Alloy Type In–Ag–Ti and the Study of Direct Soldering of SiC Ceramics and Copper

    Directory of Open Access Journals (Sweden)

    Roman Koleňák

    2018-04-01

    Full Text Available The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 °C. The solder microstructure is composed of a matrix with solid solution (In, in which the phases of titanium (Ti3In4 and silver (AgIn2 are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide—SiTi and titanium carbide—C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase—(CuAg6In5 and (AgCuIn2. The average shear strength of a combined joint of SiC–Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In–Ag–Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

  4. Development of system based code for integrity of FBR. Fundamental probabilistic approach, Part 1: Model calculation of creep-fatigue damage (Research report)

    International Nuclear Information System (INIS)

    Kawasaki, Nobuchika; Asayama, Tai

    2001-09-01

    Both reliability and safety have to be further improved for the successful commercialization of FBRs. At the same time, construction and operation costs need to be reduced to a same level of future LWRs. To realize compatibility among reliability, safety and, cost, the Structural Mechanics Research Group in JNC started the development of System Based Code for Integrity of FBR. This code extends the present structural design standard to include the areas of fabrication, installation, plant system design, safety design, operation and maintenance, and so on. A quantitative index is necessary to connect different partial standards in this code. Failure probability is considered as a candidate index. Therefore we decided to make a model calculation using failure probability and judge its applicability. We first investigated other probabilistic standards like ASME Code Case N-578. A probabilistic approach in the structural integrity evaluation was created based on these results, and also an evaluation flow was proposed. According to this flow, a model calculation of creep-fatigue damage was performed. This trial calculation was for a vessel in a sodium-cooled FBR. As the result of this model calculation, a crack initiation probability and a crack penetration probability were found to be effective indices. Last we discussed merits of this System Based Code, which are presented in this report. Furthermore, this report presents future development tasks. (author)

  5. Creep-fatigue crack initiation assessment on thick circumferentially notched 316L tubes under cyclic thermal shocks and uniform tension with the σd approach

    International Nuclear Information System (INIS)

    Michel, B.; Poette, C.

    1997-01-01

    For crack initiation assessment under creep fatigue loading, in high temperature Fast Reactor's components, specific approaches based on fracture mechanics analysis had to be developed. In the present paper the crack initiation assessment method proposed in the A16 document is presented. The so called ''σ d method'' is also validated on experimental results for tubular specimens with internal axisymmetric surface cracks. Experimental data are extracted from the TERFIS program carried out on a sodium test device at the CEA Cadarache. Metallurgical examinations on TERFIS specimens confirm that the initiation assessment of the ''σ d '' approach is conservative even for a different geometry than the CT specimen on which the method was set up. However, the conservatism is reduced when the creep residual stress field is relaxed during the hold time. An investigation concerning this last point is needed in order to know if relaxing the stress, when using a lower bound of the mechanical properties, always keeps a safety margin. (author). 14 refs, 10 figs, 4 tabs

  6. Effects of Ni{sub 3}Sn{sub 4} and (Cu,Ni){sub 6}Sn{sub 5} intermetallic layers on cross-interaction between Pd and Ni in solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Baek, Yong-Ho [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of); Division of Advanced Circuit Interconnect, Samsung Electro-Mechanics Co., Ltd., Suwon 443-743 (Korea, Republic of); Chung, Bo-Mook [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of); Department of Research and Development, KPM TECH, Ansan 425-090 (Korea, Republic of); Choi, Young-Sik [Division of Advanced Circuit Interconnect, Samsung Electro-Mechanics Co., Ltd., Suwon 443-743 (Korea, Republic of); Choi, Jaeho [Department of Advanced Metal and Materials Engineering, Gangneung-Wonju National University, Gangneung 210-702 (Korea, Republic of); Huh, Joo-Youl, E-mail: jyhuh@korea.ac.kr [Department of Materials Science and Engineering, Korea University, Seoul 136-713 (Korea, Republic of)

    2013-12-05

    Highlights: •Ni{sub 3}Sn{sub 4} acts as a source of Ni atoms, leading to a strong cross-interaction with Pd. •(Cu,Ni){sub 6}Sn{sub 5} is an effective Ni diffusion barrier, inhibiting Pd resettlement. •Dissolution kinetics of (Pd,Ni)Sn{sub 4} was interpreted based on the Sn–Ni–Pd isotherm. •Cu addition to solder alleviates the (Pd,Ni)Sn{sub 4}-related risk of reliability deterioration. -- Abstract: We examined the effects of layers of intermetallic compound (IMC) Ni{sub 3}Sn{sub 4} and (Cu,Ni){sub 6}Sn{sub 5} formed at the solder/Ni interface, on the cross-interactions between Pd and Ni during solid-state aging and reflow soldering. Two types of diffusion couples, Pd/Sn/Ni and Pd/Sn–Cu/Ni, were aged at 150 °C to study the solid-state interactions. In contrast to the Pd/Sn/Ni couples in which a Ni{sub 3}Sn{sub 4} layer formed at the Ni interface, the Pd/Sn–Cu/Ni couple where a (Cu,Ni){sub 6}Sn{sub 5} layer formed at the Ni interface exhibited no significant interaction between Pd and Ni. The (Cu,Ni){sub 6}Sn{sub 5} layer acted as an effective barrier against Ni diffusion and thus inhibited the resettlement of (Pd,Ni)Sn{sub 4} onto the Ni interface. For the interaction during reflow, Sn–3.5Ag and Sn–3.0Ag–0.5Cu solder balls were isothermally reflowed on an electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) surface finish at 250 °C, and the dissolution kinetics of the (Pd,Ni)Sn{sub 4} particles converted from the 0.2-μm-thick Pd-finish layer were examined. The spalled (Pd,Ni)Sn{sub 4} particles very quickly dissolved into the molten solder when the IMC layer formed on the Ni substrate was (Cu,Ni){sub 6}Sn{sub 5} rather than Ni{sub 3}Sn{sub 4}. The dependence of the dissolution kinetics of the spalled (Pd,Ni)Sn{sub 4} particles on the IMC layers was rationalized on the basis of a Sn–Ni–Pd isotherm at 250 °C. The present study suggests that the formation of a dense (Cu,Ni){sub 6}Sn{sub 5} layer at the solder/Ni interface can effectively

  7. Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

    Science.gov (United States)

    Haseeb, A. S. M. A.; Arafat, M. M.; Tay, S. L.; Leong, Y. M.

    2017-10-01

    Tin (Sn)-based solders have established themselves as the main alternative to the traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn-based solders continues to be a concern. In order to make Sn-based solders microstructurally more stable and hence more reliable, researchers are showing great interest in investigating the effects of the incorporation of different nanoparticles into them. This paper gives an overview of the influence of metallic nanoparticles on the characteristics of interfacial intermetallic compounds (IMCs) in Sn-based solder joints on copper substrates during reflow and thermal aging. Nanocomposite solders were prepared by mechanically blending nanoparticles of nickel (Ni), cobalt (Co), zinc (Zn), molybdenum (Mo), manganese (Mn) and titanium (Ti) with Sn-3.8Ag-0.7Cu and Sn-3.5Ag solder pastes. The composite solders were then reflowed and their wetting characteristics and interfacial microstructural evolution were investigated. Through the paste mixing route, Ni, Co, Zn and Mo nanoparticles alter the morphology and thickness of the IMCs in beneficial ways for the performance of solder joints. The thickness of Cu3Sn IMC is decreased with the addition of Ni, Co and Zn nanoparticles. The thickness of total IMC layer is decreased with the addition of Zn and Mo nanoparticles in the solder. The metallic nanoparticles can be divided into two groups. Ni, Co, and Zn nanoparticles undergo reactive dissolution during solder reflow, causing in situ alloying and therefore offering an alternative route of alloy additions to solders. Mo nanoparticles remain intact during reflow and impart their influence as discrete particles. Mechanisms of interactions between different types of metallic nanoparticles and solder are discussed.

  8. Soldering of Nanotubes onto Microelectrodes

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing sold...... bonds were consistently found to be mechanically stronger than the carbon nanotubes.......Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold-carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder...... bonds were formed at the intersection of the nanotube and the electrodes. Current-voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9-29 kOmega. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Omega, and the solder...

  9. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xiao, H., E-mail: xiaohui2013@yahoo.com.cn; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-11-25

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R{sub 0}/R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints.

  10. Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

    International Nuclear Information System (INIS)

    Xiao, H.; Li, X.Y.; Hu, Y.; Guo, F.; Shi, Y.W.

    2013-01-01

    Highlights: •A creep–fatigue damage model based on CDM was proposed. •Designed system includes load frame, strain measure device and damage test device. •Damage evolution of solder joints was a function of accumulated inelastic strain. •Damage of solder joints is an interaction between creep and low-cycle fatigue. -- Abstract: Thermomechanical fatigue damage is a progressive process of material degradation. The objective of this study was to investigate the damage behavior of SnAgCu/Cu solder joints under thermomechanical cycling. A damage model was proposed based on continuum damage mechanics (CDM). Based upon an analysis of displacements for flip-chip solder joints subjected to thermal cycling, a special bimetallic loading frame with single-solder joint samples was designed to simulate the service conditions of actual joints in electronic packages. The assembly, which allowed for strain measurements of an individual solder joint during temperature cycling, was used to investigate the impact of stress–strain cycling on the damage behavior of SnAgCu/Cu solder joints. The characteristic parameters of the damage model were determined through thermomechanical cycling and strain measurement tests. The damage variable D = 1 − R 0 /R was selected, and values for it were obtained using a four-probe method for the single-solder joint samples every dozen cycles during thermomechanical cycling tests to verify the model. The results showed that the predicted damage was in good agreement with the experimental results. The damage evolution law proposed here is a function of inelastic strain, and the results showed that the damage rate of SnAgCu/Cu solder joints increased as the range of the applied strain increased. In addition, the microstructure evolution of the solder joints was analyzed using scanning electron microscopy, which provided the microscopic explanation for the damage evolution law of SnAgCu/Cu solder joints

  11. A study on the notch effect on the low cycle fatigue of metals in creep-fatigue interacting conditions at elevated temperature

    International Nuclear Information System (INIS)

    Sakane, M.; Oknami, M.

    1983-01-01

    Frequency and hold-time effects on fatigue lives of cylindrical notched specimens of SUS 316 stainless steel were studied at 600 0 C in air. From the tests, the following conclusions were obtained: Neuber's rule, as used in the ASME N-47 Code, predicts very conservatively the life of notched specimens in tests without a hold-time. But it gives a nonconservative estimate for the reduction in the life of the material by the introduction of a hold-time. An empirical formula of a ''frequency-elastic stress concentration factor modified equation'' was obtained by analysing the experimental data. It predicts accurately the life of the notched specimen tested at different frequencies

  12. Solder joint technology materials, properties, and reliability

    CERN Document Server

    Tu, King-Ning

    2007-01-01

    Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

  13. Handbook of machine soldering SMT and TH

    CERN Document Server

    Woodgate, Ralph W

    1996-01-01

    A shop-floor guide to the machine soldering of electronics Sound electrical connections are the operational backbone of every piece of electronic equipment-and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment. This fully updated and revised volume covers all of the new technologies and processes that have emerged in recent years, most notably the use of surface mount technology (SMT). Supplemented with 200 illustrations, this thoroughly accessible text Describes reflow and wave soldering in detail, including reflow soldering of SMT boards and the use of nitrogen blankets * Explains the setup, operation, and maintenance of a variety of soldering machines * Discusses theory, selection, and control met...

  14. Interaction of high cycle fatigue with high temperature creep in superalloy single crystals

    Czech Academy of Sciences Publication Activity Database

    Lukáš, Petr; Kunz, Ludvík; Svoboda, Milan

    2002-01-01

    Roč. 93, č. 7 (2002), s. 661-665 ISSN 0044-3093 R&D Projects: GA AV ČR IAA2041002; GA AV ČR KSK1010104 Institutional research plan: CEZ:AV0Z2041904 Keywords : Single crystals * Creep/fatigue interaction * Persistent slip bands Subject RIV: JL - Materials Fatigue, Friction Mechanics Impact factor: 0.636, year: 2002

  15. Spectroscopic investigation of oxidized solder surfaces

    International Nuclear Information System (INIS)

    Song, Jenn-Ming; Chang-Chien, Yu-Chien; Huang, Bo-Chang; Chen, Wei-Ting; Shie, Chi-Rung; Hsu, Chuang-Yao

    2011-01-01

    Highlights: → UV-visible spectroscopy is successfully used to evaluate the degree of discoloring of solders. → The surface oxides of solders can also be identified by UV-visible absorption spectra. → The discoloration of solder surface can be correlated with optical characterization of oxides. → A strategy against discoloring by alloying was also suggested. - Abstract: For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV-vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible region. A trace of P can effectively depress the discoloration of solders under both solid and semi-solid states through the suppression of SnO.

  16. Soldering of Mg Joints Using Zn-Al Solders

    Science.gov (United States)

    Gancarz, Tomasz; Berent, Katarzyna; Skuza, Wojciech; Janik, Katarzyna

    2018-04-01

    Magnesium has applications in the automotive and aerospace industries that can significantly contribute to greater fuel economy and environmental conservation. The Mg alloys used in the automotive industry could reduce mass by up to 70 pct, providing energy savings. However, alongside the advantages there are limitations and technological barriers to use Mg alloys. One of the advantages concerns phenomena occurring at the interface when joining materials investigated in this study, in regard to the effect of temperature and soldering time for pure Mg joints. Eutectic Zn-Al and Zn-Al alloys with 0.05 (wt pct) Li and 0.2 (wt pct) Na were used in the soldering process. The process was performed for 3, 5, and 8 minutes of contact, at temperatures of 425 °C, 450 °C, 475 °C, and 500 °C. Selected, solidified solder-substrate couples were cross-sectioned, and their interfacial microstructures were investigated by scanning electron microscopy. The experiment was designed to demonstrate the effect of time, temperature, and the addition of Li and Na on the kinetics of the dissolving Mg substrate. The addition of Li and Na to eutectic Zn-Al caused to improve mechanical properties. Higher temperatures led to reduced joint strength, which is caused by increased interfacial reaction.

  17. Lead free solder mechanics and reliability

    CERN Document Server

    Pang, John Hock Lye

    2012-01-01

    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

  18. Service life prediction. Development of models for predicting the service life of power plant components subject to thermomechanical creep fatigue; Lebensdauervorhersage. Entwicklung von Modellen zur Lebensdauervorhersage von Kraftwerksbauteilen unter thermisch-mechanischer Kriechermuedungsbeanspruchung. Abschlussbericht

    Energy Technology Data Exchange (ETDEWEB)

    Cui, L.; Scholz, A. [Technische Univ. Darmstadt (Germany). Institut fuer Werkstoffkunde; Hartrott, P. von; Schlesinger, M. [Fraunhofer-Institut fuer Werkstoffmechanik (IWM), Freiburg im Breisgau (Germany)

    2009-07-01

    Extensive use is made of massive components of heat resistant and highly heat resistant materials in installations of the power and heating industry. These components are exposed to varying thermomechanical stress as a result of ramping-up and down processes. In this research project two computer-assisted methods of predicting service life until crack initiation were extended to include cases of thermomechanical multi-axis stress conducive to creep fatigue and of superposition of high-cycle stress on power plant components. Investigations were limited to rotor steel of type X12CrMoWVNbN10-1-1. Complex thermomechanical multi-axis experiments were performed on round, notched and cruciform test specimens of close-to-life dimensions in order to demonstrate by experiment the validity of these models. The results of these calculations showed an acceptable degree of agreement between experiment and simulation for both models. Calculations on earlier TMF experiments performed at IfW on hollow specimens of 1%CrMoNiV showed good predictability for both the SARA and the ThoMat programme. Calculations on experiments performed at MPA Stuttgart on model bodies consisting of the same 1%CrMoNiV showed a predictability of acceptable variability considering the complexity of the stresses involved. A further outcome of this project is that the use of SARA appears universally suitable for the construction of new plants and in the service area, while the use of ThoMat appears suited for detail optimisation in the development process.

  19. Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

    Science.gov (United States)

    Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

    2011-01-01

    The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

  20. Nano-soldering to single atomic layer

    Science.gov (United States)

    Girit, Caglar O [Berkeley, CA; Zettl, Alexander K [Kensington, CA

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  1. Safer Soldering Guidelines and Instructional Resources

    Science.gov (United States)

    Love, Tyler S.; Tomlinson, Joel

    2018-01-01

    Soldering is a useful and necessary process for many classroom, makerspace, Fab Lab, technology and engineering lab, and science lab activities. As described in this article, soldering can pose many safety risks without proper engineering controls, standard operating procedures, and direct instructor supervision. There are many safety hazards…

  2. Features of soldering of molybdenum a lols

    International Nuclear Information System (INIS)

    Grishin, V.L.; Rybkin, B.V.; Cherkasov, A.F.

    1980-01-01

    Soldering features of complex-alloy molybdenum alloys were investigated in comparison with alloys based on solid solutions. Soldering features of heterogeneous molybdenum base alloys were investigated using samples of 0.5-1.O mm sheets with the strain of about 95% made of ingots which had been smelted in arc vacuum furnaces. The soldering of samples was carried out in 5x1O -5 mm Hg vacuum using different sources of heating: radiation, electron-ray and contact. It was shown that heat-resisting soldered joints of heterogeneous molybdenum alloys could be produced using zirconium and niobium base solders containing the most effective hardeners of the parent material (titanum, vanadium, tantalum, molybdenum, tungsten). To preserve high mechanical properties of heterogeneous alloys it was expedient to use for welding local heating sources which permitted to decrease considerably temperature- time conditions of the process

  3. Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

    International Nuclear Information System (INIS)

    Mallik, S.; Ekere, N.N.; Durairaj, R.; Marks, A.E.; Seman, A.

    2009-01-01

    Solder paste is the most important strategic bonding material used in the assembly of surface mount components in electronics manufacturing. As the trend towards miniaturisation of electronic products continues, there is an increasing demand for better understanding of the flow and deformation that is, the rheological behaviour of solder paste formulations. Wall slip plays an important role in characterising the flow behaviour of solder paste materials. The problem of wall slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. In rheological measurements, slip effects can generally be avoided by using roughened surfaces for measuring geometries. In this paper, a novel technique is developed to study the effect of wall slip in the rheological measurements of lead-free solder paste. The viscosity and oscillatory data obtained for three different solder paste samples (from measuring geometries of different surface roughness) have been analysed and compared. In viscosity measurements, slip effects were dominant at low shear rates and the use of serrated surfaces was found to be quite effective in minimizing slip effects. Oscillatory measurements were also affected by roughening the surfaces of measuring geometries.

  4. The influence of silver content on structure and properties of Sn–Bi–Ag solder and Cu/solder/Cu joints

    Energy Technology Data Exchange (ETDEWEB)

    Šebo, P. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Švec, P. Sr., E-mail: Peter.Svec@savba.sk [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Faculty of Materials Science and Technology, Slovak University of Technology, J. Bottu 25, 917 24 Trnava (Slovakia); Janičkovič, D.; Illeková, E. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia); Zemánková, M. [Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02 Bratislava 3 (Slovakia); Plevachuk, Yu. [Ivan Franko National University, Department of Metal Physics, 79005 Lviv (Ukraine); Sidorov, V. [Ural State Pedagogical University, Cosmonavtov 26, 620017 Ekaterinburg (Russian Federation); Švec, P. [Institute of Physics, Slovak Academy of Sciences, Dúbravská cesta 9, 845 11 Bratislava 45 (Slovakia)

    2013-06-01

    The effect of silver content on structure and properties of Sn{sub 100−x}Bi{sub 10}Ag{sub x} (x=3–10 at%) lead-free solder and Cu–solder–Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553–673 K in air and deoxidizing gas (N{sub 2}+10%H{sub 2}) at atmospheric pressure. Cu–solder–Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag{sub 3}Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu{sub 3}Sn, which is adjacent to the substrate, and a Cu{sub 6}Sn{sub 5} phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N{sub 2}+10H{sub 2} gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N{sub 2}+10H{sub 2} is more apparent.

  5. Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    McNally, K.M.; Sorg, B.S.; Welch, A.J.; Dawes, J.M.; Owen, E.R.

    1999-01-01

    Low-strength anastomoses and thermal damage of tissue are major concerns in laser tissue welding techniques where laser energy is used to induce thermal changes in the molecular structure of the tissues being joined, hence allowing them to bond together. Laser tissue soldering, on the other hand, is a bonding technique in which a protein solder is applied to the tissue surfaces to be joined, and laser energy is used to bond the solder to the tissue surfaces. The addition of protein solders to augment tissue repair procedures significantly reduces the problems of low strength and thermal damage associated with laser tissue welding techniques. Investigations were conducted to determine optimal solder and laser parameters for tissue repair in terms of tensile strength, temperature rise and damage and the microscopic nature of the bonds formed. An in vitro study was performed using an 808 nm diode laser in conjunction with indocyanine green (ICG)-doped albumin protein solders to repair bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The efficacy of temperature feedback control in enhancing the soldering process was also investigated. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the repairs. A reduction in dye concentration from 2.5mgml -1 to 0.25mgml -1 was also found to result in an increase in tensile strength. Increasing the laser irradiance and thus surface temperature resulted in an increased severity of histological injury. Thermal denaturation of tissue collagen and necrosis of the intimal layer smooth muscle cells increased laterally and in depth with higher temperatures. The strongest repairs were produced with an irradiance of 6.4Wcm -2 using a solid protein solder composed of 60% BSA and 0.25mgml -1 ICG. Using this combination of laser and solder parameters, surface temperatures were observed to reach 85±5 deg. C with a

  6. Creep, Fatigue and Fracture Behavior of Environmental Barrier Coating and SiC-SiC Ceramic Matrix Composite Systems: The Role of Environment Effects

    Science.gov (United States)

    Zhu, Dongming; Ghosn, Louis J.

    2015-01-01

    Advanced environmental barrier coating (EBC) systems for low emission SiCSiC CMC combustors and turbine airfoils have been developed to meet next generation engine emission and performance goals. This presentation will highlight the developments of NASAs current EBC system technologies for SiC-SiC ceramic matrix composite combustors and turbine airfoils, their performance evaluation and modeling progress towards improving the engine SiCSiC component temperature capability and long-term durability. Our emphasis has also been placed on the fundamental aspects of the EBC-CMC creep and fatigue behaviors, and their interactions with turbine engine oxidizing and moisture environments. The EBC-CMC environmental degradation and failure modes, under various simulated engine testing environments, in particular involving high heat flux, high pressure, high velocity combustion conditions, will be discussed aiming at quantifying the protective coating functions, performance and durability, and in conjunction with damage mechanics and fracture mechanics approaches.

  7. Solderability study of RABiTS-based YBCO coated conductors

    International Nuclear Information System (INIS)

    Zhang Yifei; Duckworth, Robert C.; Ha, Tam T.; Gouge, Michael J.

    2011-01-01

    Study examines the implication of solder and flux selection in YBCO splice joints. Focus is on commercially available RABiTS-based YBCO coated conductors. Solderability varied with solder and flux for three different stabilizations tested. Resistivity of stabilizer was dominant factor in splice joint resistance. Solder materials affected splice joint resistance when solderability was poor. The solderability of commercially available YBa 2 Cu 3 O 7-x (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

  8. The constitutive response of three solder materials

    International Nuclear Information System (INIS)

    Perez-Bergquist, Alejandro G.; Cao Fang; Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T.

    2012-01-01

    Highlights: ► The full constitutive response of three solder materials. ► Test temperatures from −196 °C to 60 °C and strain rates from 10 −3 to >10 3 s −1 . ► Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (−196 °C to 60 °C) and strain rate (10 −3 to >10 3 s −1 ). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  9. The constitutive response of three solder materials

    Energy Technology Data Exchange (ETDEWEB)

    Perez-Bergquist, Alejandro G., E-mail: alexpb@lanl.gov [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States); Cao Fang [Exxon Mobil Research and Engineering Company, Annadale, NJ 08801 (United States); Perez-Bergquist, Sara J.; Lopez, Mike F.; Trujillo, Carl P.; Cerreta, Ellen K.; Gray, George T. [Materials Science and Technology Division, Los Alamos National Laboratory, Mail Stop G755, Los Alamos, NM 87545 (United States)

    2012-05-25

    Highlights: Black-Right-Pointing-Pointer The full constitutive response of three solder materials. Black-Right-Pointing-Pointer Test temperatures from -196 Degree-Sign C to 60 Degree-Sign C and strain rates from 10{sup -3} to >10{sup 3} s{sup -1}. Black-Right-Pointing-Pointer Substitutes for leaded solders from a mechanical/microstructural properties view. - Abstract: As increasing worldwide demand for portable consumer electronics drives development of smaller, faster, more powerful electronic devices, components in these devices must become smaller, more precise, and more robust. Often, failure of these devices comes as a result of failure of the package (i.e. when a mobile phone is dropped) and specifically comes as a result of failure of solder interconnects. As a result, stronger more reliable solder materials are needed. In this paper, the constitutive responses of three solder materials (Sn63Pb37, Sn62Pb36Ag2, and Sn96.5Ag3Cu0.5) are analyzed as a function of temperature (-196 Degree-Sign C to 60 Degree-Sign C) and strain rate (10{sup -3} to >10{sup 3} s{sup -1}). The lead-free Sn96.5Ag3Cu0.5 possessed the highest yield stress of the three solders at all tested strain rates and temperatures, and all solder microstructures which displayed a mechanical response that was sensitive to temperature exhibited grain coarsening with increasing plastic strain, even at room temperature.

  10. Optimal parameters for laser tissue soldering

    Science.gov (United States)

    McNally-Heintzelman, Karen M.; Sorg, Brian S.; Chan, Eric K.; Welch, Ashley J.; Dawes, Judith M.; Owen, Earl R.

    1998-07-01

    Variations in laser irradiance, exposure time, solder composition, chromophore type and concentration have led to inconsistencies in published results of laser-solder repair of tissue. To determine optimal parameters for laser tissue soldering, an in vitro study was performed using an 808-nm diode laser in conjunction with an indocyanine green (ICG)- doped albumin protein solder to weld bovine aorta specimens. Liquid and solid protein solders prepared from 25% and 60% bovine serum albumin (BSA), respectively, were compared. The effects of laser irradiance and exposure time on tensile strength of the weld and temperature rise as well as the effect of hydration on bond stability were investigated. Optimum irradiance and exposure times were identified for each solder type. Increasing the BSA concentration from 25% to 60% greatly increased the tensile strength of the weld. A reduction in dye concentration from 2.5 mg/ml to 0.25 mg/ml was also found to result in an increase in tensile strength. The strongest welds were produced with an irradiance of 6.4 W/cm2 for 50 s using a solid protein solder composed of 60% BSA and 0.25 mg/ml ICG. Steady-state solder surface temperatures were observed to reach 85 plus or minus 5 degrees Celsius with a temperature gradient across the solid protein solder strips of between 15 and 20 degrees Celsius. Finally, tensile strength was observed to decrease significantly (20 to 25%) after the first hour of hydration in phosphate-buffered saline. No appreciable change was observed in the strength of the tissue bonds with further hydration.

  11. Thermomechanical Behavior of Monolithic SN-AG-CU Solder and Copper Fiber Reinforced Solders

    National Research Council Canada - National Science Library

    Reuse, Rolando

    2005-01-01

    .... The thermomechanical cycling in the solder causes numerous reliability challenges, mostly because of the mismatch of the coefficient of thermal expansion between the silicon chip and the substrate...

  12. Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes

    Science.gov (United States)

    Takahashi, Junichi; Nakahara, Sumio; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2004-10-01

    It has reported that a waste of an electronics substrate including lead and its compound such as 63Sn-37Pb has polluted the environment with acid rain. For that environment problem the development of lead-free solder alloys has been promoted in order to find out the substitute for Sn-Pb solders in the United States, Europe, and Japan. In a present electronics industry, typical alloys have narrowed down to Sn-Ag-Cu and Sn-Zn lead-free solder. In this study, solderability of Pb-free solder that are Sn-Ag-Cu and Sn-Zn-Bi alloy was studied on soldering using YAG (yttrium aluminum garnet) laser and diode laser. Experiments were peformed in order to determine the range of soldering parameters for obtaining an appropriate wettability based on a visual inspection. Joining strength of surface mounting chip components soldered on PCB (printed circuit board) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics of eutectic Sn-Pb alloy and under different power density were examined. As a result, solderability of Sn-Ag-Cu (Pb-free) solder paste are equivalent to that of coventional Sn-Pb solder paste, and are superior to that of Sn-Zn-Bi solder paste in the laser soldering method.

  13. Thermomechanical fatigue life prediction for several solders

    Science.gov (United States)

    Wen, Shengmin

    Since solder connections operate at high homologous temperature, solders are high temperature materials. This feature makes their mechanical behavior and fatigue phenomena unique. Based on experimental findings, a physical damage mechanism is introduced for solders. The mechanism views the damage process as a series of independent local damage events characterized by the failure of individual grains, while the structural damage is the eventual percolation result of such local events. Fine's dislocation energy density concept and Mura's microcrack initiation theory are adopted to derive the fatigue formula for an individual grain. A physical damage metric is introduced to describe the material with damage. A unified creep and plasticity constitutive model is adopted to simulate the mechanical behavior of solders. The model is cast into a continuum damage mechanics framework to simulate material with damage. The model gives good agreement with the experimental results of 96.5Pb-3.5Sn and 96.5Sn-3.5Ag solders under uniaxial strain-controlled cyclic loading. The model is convenient for implementation into commercial computational packages. Also presented is a fatigue theory with its failure criterion for solders based on physical damage mechanism. By introducing grain orientation into the fatigue formula, an m-N curve (m is Schmid factor) at constant loading condition is suggested for fatigue of grains with different orientations. A solder structure is defined as fatigued when the damage metric reaches a critical threshold, since at this threshold the failed grains may form a cluster and percolate through the structure according to percolation theory. Fatigue data of 96.5Pb-3.5Sn solder bulk specimens under various uniaxial tension tests were analyzed. Results show that the theory gives consistent predictions under broad conditions, while inelastic strain theory does not. The theory is anisotropic with no size limitation to its application, which could be suitable for

  14. Effect of temperature and flux concentration on soldering of base metal.

    Science.gov (United States)

    Lee, S Y; Lin, C T; Wang, M H; Tseng, H; Huang, H M; Dong, D R; Pan, L C; Shih, Y H

    2000-12-01

    The present study used the acoustic emission (AE) technique to evaluate interactions among soldering temperature, flux treatment, and the resultant ultimate tensile strength (UTS). Scanning electron microscopy (SEM) was used to examine fracture surfaces of the solder joints. Specimens were cast from removable partial denture alloy and then placed in a jig with a gap distance of 1.0 mm. A high-frequency soldering machine with an optical pyrometer was used for soldering at 1150 degrees C and 1200 degrees C, respectively. The flux concentrations were 67% and 75%. The soldered specimens were subjected to tensile test at a crosshead speed of 0.05 mm/min. During testing, acoustic emissions in the frequency range of 100--1200 kHz were collected, filtered, recorded, and processed by a sensing device. The results were analysed by ANOVA and Tukey LSD test. UTS at different temperatures showed no significant difference according to either mechanical or acoustic results. But in the 1200 degrees C group, the UTSs and AE counts showed significant differences (Pacoustic signals within the elastic deformation zone, while the 67% flux subgroup produced similar signals within the plastic deformation zone, either beyond the 0.2% yield point or before fracture.

  15. Pressure brazing of ceramics to metals with copper solder

    International Nuclear Information System (INIS)

    Pavlova, M.A.; Metelkin, I.I.

    1986-01-01

    The effect on the quality of joints brazed with copper of different non metallized aluminooxide dielectrics with metals and alloys of a series of technological parameters (temperature, pressure, holding, and medium) in the course of pressure brazing is investigated. It is shown that in case of brazing with kovar and nickel the character of dependences is identical, however in all cases the joints with nickel are more durable. For the ceramics - molybdenum system characterized by weak interaction with copper solder kinetic dependences have no maximum and only under holding of more than 20 min the constant strength of 150-190 MPa is attained

  16. High temperature soldering of graphite

    International Nuclear Information System (INIS)

    Anikin, L.T.; Kravetskij, G.A.; Dergunova, V.S.

    1977-01-01

    The effect is studied of the brazing temperature on the strength of the brazed joint of graphite materials. In one case, iron and nickel are used as solder, and in another, molybdenum. The contact heating of the iron and nickel with the graphite has been studied in the temperature range of 1400-2400 ged C, and molybdenum, 2200-2600 deg C. The quality of the joints has been judged by the tensile strength at temperatures of 2500-2800 deg C and by the microstructure. An investigation into the kinetics of carbon dissolution in molten iron has shown that the failure of the graphite in contact with the iron melt is due to the incorporation of iron atoms in the interbase planes. The strength of a joint formed with the participation of the vapour-gas phase is 2.5 times higher than that of a joint obtained by graphite recrystallization through the carbon-containing metal melt. The critical temperatures are determined of graphite brazing with nickel, iron, and molybdenum interlayers, which sharply increase the strength of the brazed joint as a result of the formation of a vapour-gas phase and deposition of fine-crystal carbon

  17. Microstructure evolution and thermomechanical fatigue of solder materials

    NARCIS (Netherlands)

    Matin, M.A.

    2005-01-01

    The microelectronics industry is confronted with the new challenge to produce joints with lead-free solder materials replacing classical tin-lead solders in devices used in many fields (e.g. consumer electronics, road transport, aviation, space-crafts, telecommunication). In service, solder

  18. Efforts to Develop a 300°C Solder

    Energy Technology Data Exchange (ETDEWEB)

    Norann, Randy A [Perma Works LLC

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  19. A novel method for direct solder bump pull testing using lead-free solders

    Science.gov (United States)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  20. Creep-fatigue propagation of semi-elliptical crack at 650 deg. C in 316L(N) stainless steel plates with or without welded joints; Propagation de fissures semi-elliptiques en fatigue-fluage a 650 deg. C dans des plaques d'acier 316L(N) avec ou sans joints soudes

    Energy Technology Data Exchange (ETDEWEB)

    Curtit, F

    2000-07-01

    This study realised in LISN Laboratory of CEA Saclay, deals with the creep fatigue propagation of semi elliptical crack at the temperature of 650 deg C in 316L(N) stainless steel plates with or without welded joints. A vast majority of the studies on creep fatigue propagation models are based on specimen (CT) especially designed for crack propagation study. The PLAQFLU program performed in LISN laboratory deals with the application and adaptation of these models to complex crack shape, which are more representative of the cracks observed in industrial components. In this scope, we use propagation tests realised at the temperature of 650 deg C with wide plates containing semi elliptical defects. For some of them, the initial defect is machined in the middle of a welded joint, which constitute a privileged site for the crack initiation. The approach used in this study is based on global parameters of fracture mechanics. At first, tests on CT specimen are used in order to determine the propagation laws correlating the crack growth rate to the global parameters K or C{sup *}. These laws are then supposed to be intrinsic to our materials and are used to analysed the semi elliptical crack propagation. The analysis of the comportment of the crack during the hold time demonstrates the possibility to establish a correlation between the crack propagation both in the deepest and the surface point and the local value of C{sup *}. These correlations are coherent in the different points of the crack front for the different applied hold times, and they present a reasonably good agreement with the creep propagation law identified on CT specimen. The simulation of test performed on based metal specimen with a model of summation of both creep and pure fatigue crack growth gives acceptable results when the calculus of the simplified expression of C{sup *}{sub s} considers a continuous evolution of creep deformations rate during the all test. (author)

  1. Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

    Directory of Open Access Journals (Sweden)

    Soares D.

    2007-01-01

    Full Text Available Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layers. The effect of the addition of P, at low levels, on the chemical composition of the layers present at the interface was studied. The phases formed at the interface between the Cu or Ni substrate and a molten lead-free solder at 250ºC, were studied for different stage times and alloy compositions. The melting temperatures, of the studied alloys, were determined by Differential Scanning Calorimetry (DSC. Identification of equilibrium phases formed at the interface layer, and the evaluation of their chemical composition were performed by Scanning Electron Microscopy (SEM/EDS. Different interface characteristics were obtained, namely for the alloys containing Zn. The obtained IML layer thickness was compared, for both types of alloy systems.

  2. A Hodge dual for soldered bundles

    International Nuclear Information System (INIS)

    Lucas, Tiago Gribl; Pereira, J G

    2009-01-01

    In order to account for all possible contractions allowed by the presence of the solder form, a generalized Hodge dual is defined for the case of soldered bundles. Although for curvature the generalized dual coincides with the usual one, for torsion it gives a completely new dual definition. Starting from the standard form of a gauge Lagrangian for the translation group, the generalized Hodge dual yields precisely the Lagrangian of the teleparallel equivalent of general relativity, and consequently also the Einstein-Hilbert Lagrangian of general relativity

  3. Visual detection of defects in solder joints

    Science.gov (United States)

    Blaignan, V. B.; Bourbakis, Nikolaos G.; Moghaddamzadeh, Ali; Yfantis, Evangelos A.

    1995-03-01

    The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new `frame' for the achievement of better results regarding efficiency, products quality and automated service. In this paper the visual detection and classification of different types of defects on solder joints in PC boards is presented by combining several image processing methods, such as smoothing, segmentation, edge detection, contour extraction and shape analysis. The results of this paper are based on simulated solder defects and a real one.

  4. Laser assisted soldering: microdroplet accumulation with a microjet device.

    Science.gov (United States)

    Chan, E K; Lu, Q; Bell, B; Motamedi, M; Frederickson, C; Brown, D T; Kovach, I S; Welch, A J

    1998-01-01

    We investigated the feasibility of a microjet to dispense protein solder for laser assisted soldering. Successive micro solder droplets were deposited on rat dermis and bovine intima specimens. Fixed laser exposure was synchronized with the jetting of each droplet. After photocoagulation, each specimen was cut into two halves at the center of solder coagulum. One half was fixed immediately, while the other half was soaked in phosphate-buffered saline for a designated hydration period before fixation (1 hour, 1, 2, and 7 days). After each hydration period, all tissue specimens were prepared for scanning electron microscopy (SEM). Stable solder coagulum was created by successive photocoagulation of microdroplets even after the soldered tissue exposed to 1 week of hydration. This preliminary study suggested that tissue soldering with successive microdroplets is feasible even with fixed laser parameters without active feedback control.

  5. Impurity Effects in Electroplated-Copper Solder Joints

    Directory of Open Access Journals (Sweden)

    Hsuan Lee

    2018-05-01

    Full Text Available Copper (Cu electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl disulfide (SPS with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

  6. Processing and Characterization of NiTi Shape Memory Alloy Particle Reinforced Sn-In Solders

    National Research Council Canada - National Science Library

    Chung, Kohn C

    2006-01-01

    .... In previous work, it was proposed that reinforcement of solder by NiTi shape memory alloy particles to form smart composite solder reduces the inelastic strain of the solder and hence, may enhance...

  7. Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Lin, C.-T. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China); Hsi, C.-S. [Department of Materials Science and Engineering, National United University, 1 Lein-Da, Kung-Ching Li, Miaoli 36003, Taiwan (China); Wang, M.-C. [Faculty of Fragrance and Cosmetics, Kaohsiung Medical University, 100 Shih-Chuan 1st Road, Kaohsiung 807, Taiwan (China)], E-mail: mcwang@kmu.edu.tw; Chang, T.-C.; Liang, M.-K. [Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, 195 Section 4, Chung-Hsing Road, Chutung, Hsinchu 31040, Taiwan (China)

    2008-07-14

    Two kinds of lead-free solders, Sn-8Zn-3Bi and Sn-9Zn-lAl, were used to mount passive components onto printed circuit boards via a re-flow soldering process. The samples were stored at 150 deg. C for 200, 400, 600, 800, and 1100 h. The microstructures of the samples after aged at 150 deg. C for various times were characterized using optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and the analyzed of solder joint shear strengths. The joint strength between Sn-8Zn-3Bi and Cu pad was about 4.0 {+-} 0.3 kg, while the strength between Sn-9Zn-lAl and Cu pad had values of 2.6 {+-} 0.1 kg. Both kinds of solder joints exhibited reduced strengths with increasing aging times. After aging at 150 deg. C for 1100 h, the joints strengths of Sn-8Zn-3Bi and Sn-9Zn-lAl were 1.8 {+-} 0.3 and 1.7 {+-} 0.3 kg, respectively. Both the Sn-8Zn-3Bi and Sn-9Zn-lAl joints showed brittle fracture behaviors. A flat layer of Cu{sub 5}Zn{sub 8} intermetallic compound (IMC) was formed between Sn-8Zn-3Bi solder and Cu pad after reflow. When the aging time was increased to 400 h, Zn-depletion and formation of Cu{sub 6}Sn{sub 5} IMC were observed in the solders due to the interaction between the tin and zinc compounds. The interaction between Sn-9Zn-lAl solder and Cu pad had similar behavior, however, Cu{sub 6}Sn{sub 5} IMC formed in Sn-9Zn-lAl solder when after aging at 150 deg. C for 600 h. As the aging time increased, both types of solders generated clear IMC spalling layers with large and continuous voids. Those voids substantially decreased the joint strength.

  8. Effect of Solder Flux Residues on Corrosion of Electronics

    DEFF Research Database (Denmark)

    Hansen, Kirsten Stentoft; Jellesen, Morten Stendahl; Møller, Per

    2009-01-01

    Flux from ‘No Clean’ solder processes can cause reliability problems in the field due to aggressive residues, which may be electrical conducting or corrosive in humid environments. The solder temperature during a wave solder process is of great importance to the amount of residues left on a PCBA...... testing and use in the field, consequences and recommendations are given. Failures, caused by harsh[1] customer environments, are not covered in this paper....

  9. Mechanical properties of soldered joints of niobium base alloys

    International Nuclear Information System (INIS)

    Grishin, V.L.

    1980-01-01

    Mechanical properties of soldered joints of niobium alloys widely distributed in industry: VN3, VN4, VN5A, VN5AE, VN5AEP etc., 0.6-1.2 mm thick are investigated. It is found out that the usage of zirconium-vanadium, titanium-tantalum solders for welding niobium base alloys permits to obtain soldered joints with satisfactory mechanical properties at elevated temperatures

  10. Evaluation on the characteristics of tin-silver-bismuth solder

    Science.gov (United States)

    Xia, Z.; Shi, Y.; Chen, Z.

    2002-02-01

    Tin-silver-bismuth solder is characterized by its lower melting point, good wetting behavior, and good mechanical property for which it is expected to be a new lead-free solder to replace tin-lead solder. In this article, Sn-3.33Ag-4.83Bi solder was investigated concerning its physical, spreading, and mechanical properties under specific conditions. Cooling curves and DSC results showed that it was close to eutectic composition (m.p. 210° 212 °C). Coefficiency of thermal expansion (CTE) of this solder, between that of PCBs and copper substrates, was beneficial to alleviate the thermal mismatch of the substrates. It was also a good electrical and thermal conductor. Using a rosin-based, mildly activated (RMA) flux, a spreading test indicated that SnAgBi solder paste had good solderability. Meanwhile, the solder had high tensile strength and fracture energy. Its fracture mechanism was a mixture of ductile and brittle fracture morphology. The metallographic and EDAX analyses indicated that it was composed of a tin-based solid solution and some intermetallic compound (IMC) that could strengthen the substrate. However, these large needle-like IMCs would cut the substrate and this resulted in the decreasing of the toughness of the solder.

  11. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    Directory of Open Access Journals (Sweden)

    Mohd Nizam Ab. Rahman

    2014-12-01

    Full Text Available The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB. The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm, and the solder height is the table speed of the SP machine (2.5 mm/s.

  12. Laser-activated protein solder for peripheral nerve repair

    Science.gov (United States)

    Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

    1995-05-01

    A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

  13. Soldering of copper-clad niobium--titanium superconductor composite

    International Nuclear Information System (INIS)

    Moorhead, A.J.; Woodhouse, J.J.; Easton, D.S.

    1977-04-01

    When superconductivity is applied to various electrical devices, the joining of the superconducting material and the performance of the joints are generally crucial to the successful operation of the system. Although many techniques are being considered for joining composite superconductors, soldering is the most common. We determined the wetting and flow behavior of various solder and flux combinations on a copper-clad Nb-Ti composite, developed equipment and techniques for soldering and inspection of lap joints, and determined the shear strength of joints at temperatures down to -269 0 C (4 0 K). We studied 15 solders and 17 commercial and experimental fluxes in the wettability and flow tests. A resistance unit was built for soldering test specimens. A series of samples soldered with 80 Pb-20 Sn, 83 Pb-15 Sn-2 Sb, 97.5 Pb-1.5 Ag-1 Sn, 80 In-15 Pb-5 Ag, or 25 In-37.5 Pb-37.5 Sn (wt percent) was inspected by three nondestructive techniques. Through-transmission ultrasound gave the best correlation with nonbond areas revealed in peel tests. Single-lap shear specimens soldered with 97.5 Pb-1.5 Ag-1 Sn had the highest strength (10.44 ksi, 72 MPa) and total elongation (0.074 in., 1.88 mm) at -269 0 C (4 0 K) of four solders tested

  14. Integration of environmentally compatible soldering technologies for waste minimization

    International Nuclear Information System (INIS)

    Hosking, F.M.

    1992-01-01

    There has been a concentrated effort throughout the international microelectronics industry to phase out chlorofluorocarbon (CFC) materials and alleviate the serious problem of ozone depletion created by the release of CFCS. The development of more environmentally compatible manufacturing technologies is the cornerstone of this effort. Alternative materials and processes for cleaning and soldering have received special attention. Electronic. soldering typically utilizes rosin-based fluxes to promote solder wettability. Flux residues must be removed from the soldered parts when high product reliability is essential. Halogenated or CFC solvents have been the principle chemicals used to clean the residues. With the accelerated push to eliminate CFCs in the US by 1995, CFC-free solvents, aqueous-based cleaning, water soluble or ''no clean'' fluxes, and fluxless soldering technologies are being developed and quickly integrated into manufacturing practice. Sandia's Center for Solder Science and Technology has been ch g a variety of fluxless and alternative soldering technologies for DOE's waste minimization program. The work has focused on controlled atmosphere, laser, and ultrasonic fluxless soldering, protective metallic and organic coatings, and fluxes which have water soluble or low solids-based chemistries. With the increasing concern that Pb will also be banned from electronic soldering, Sandia has been characterizing the wetting, aging, and mechanical properties of Pb-fire solder alloys. The progress of these integrated studies will be discussed. Their impact on environmentally compatible manufacturing will be emphasized. Since there is no universal solution to the various environmental, safety, and health issues which currently face industry, the proposed technologies offer several complementary materials and processing options from which one can choose

  15. Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder

    Science.gov (United States)

    2015-05-05

    under bump metallurgy and solder joint geometry on Sn grain morphology in Pb free solder joints were examined. SnAgCu solder joints were examined for...free solder interconnects”, Sci. Technol. Weld . Join. 13, 732 (2008). [3.25] Terashima, S., Takahama, K., Nozaki, M., and Tanaka, M. Recrystallization

  16. Characterization of lead-free solders for electronic packaging

    Science.gov (United States)

    Ma, Hongtao

    The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5T m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn-Pb solder alloys. In this research, mechanical measurements of isothermal aging effects and the resulting changes in the materials behavior of lead-free solders were performed. A novel specimen preparation procedure was developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process. Using specimens fabricated with the developed procedure, isothermal aging effects and viscoplastic material behavior evolution have been characterized for 95.5Sn-4.0Ag-0.5Cu (SAC405) and 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solders, which are commonly used as the solder ball alloy in lead-free BGAs and other components. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes. Up to 40% reduction in tensile strength was observed for water quenched specimens after two months of aging at room temperature. Creep deformation also increased dramatically with increasing aging durations. Microstructural changes during room temperature aging were also observed and recorded for the solder alloys and correlated with the observed mechanical behavior changes. Aging effects at elevated temperatures for up to 6 months were also investigated. Thermal aging caused significant tensile strength loss and deterioration of creep deformation. The thermal aging results also showed that after an initial tensile strength drop, the Sn-Pb eutectic solder reached a relatively stable stage after 200 hours of aging. However, for SAC alloy, both the tensile and

  17. Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/ Pd/ Au surface finishes

    International Nuclear Information System (INIS)

    NorAkmal, F.; Ourdjini, A.; Azmah Hanim, M.A.; Siti Aisha, I.; Chin, Y.T.

    2007-01-01

    Flip chip technology provides the ultimate in high I/ O-density and count with superior electrical performance for interconnecting electronic components. Therefore, the study of the intermetallic compounds was conducted to investigate the effect of solder bumps sizes on several surface finishes which are copper and Electroless Nickel/ Electroless Palladium/ Immersion Gold (ENEPIG) which is widely used in electronics packaging as surface finish for flip-chip application nowadays. In this research, field emission scanning electron microscopy (FESEM) analysis was conducted to analyze the morphology and composition of intermetallic compounds (IMCs) formed at the interface between the solder and UBM. The IMCs between the SAC lead-free solder with Cu surface finish after reflow were mainly (Cu, Ni) 6 Sn 5 and Cu 6 Sn 5 . While the main IMCs formed between lead-free solder on ENEPIG surface finish are (Ni, Cu) 3 Sn 4 and Ni 3 Sn 4 . The results from FESEM with energy dispersive x-ray (EDX) have revealed that isothermal aging at 150 degree Celsius has caused the thickening and coarsening of IMCs as well as changing them into more spherical shape. The thickness of the intermetallic compounds in both finishes investigated was found to be higher in solders with smaller bump size. From the experimental results, it also appears that the growth rate of IMCs is higher when soldering on copper compared to ENEPIG finish. Besides that, the results also showed that the thickness of intermetallic compounds was found to be proportional to isothermal aging duration. (author)

  18. Soldering formalism in noncommutative field theory: a brief note

    International Nuclear Information System (INIS)

    Ghosh, Subir

    2004-01-01

    In this Letter, I develop the soldering formalism in a new domain--the noncommutative planar field theories. The soldering mechanism fuses two distinct theories showing opposite or complimentary properties of some symmetry, taking into account the interference effects. The above mentioned symmetry is hidden in the composite (or soldered) theory. In the present work it is shown that a pair of noncommutative Maxwell-Chern-Simons theories, having opposite signs in their respective topological terms, can be consistently soldered to yield the Proca model (Maxwell theory with a mass term) with corrections that are at least quadratic in the noncommutativity parameter. We further argue that this model can be thought of as the noncommutative generalization of the Proca theory of ordinary spacetime. It is well known that abelian noncommutative gauge theory bears a close structural similarity with non-abelian gauge theory. This fact is manifested in a non-trivial way if the present Letter is compared with existing literature, where soldering of non-abelian models are discussed. Thus the present work further establishes the robustness of the soldering programme. The subtle role played by gauge invariance (or the lack of it), in the above soldering process, is revealed in an interesting way

  19. Utilization of Pb-free solders in MEMS packaging

    Science.gov (United States)

    Selvaduray, Guna S.

    2003-01-01

    Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

  20. Fatigue and thermal fatigue of Pb-Sn solder joints

    International Nuclear Information System (INIS)

    Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

    1987-01-01

    This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55 0 C and 125 0 C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb

  1. Assessment of potential solder candidates for high temperature applications

    DEFF Research Database (Denmark)

    pressure to eliminate lead containing materials despite the fact that materials for high Pb containing alloys are currently not affected by any legislations. A tentative assessment was carried out to determine the potential solder candidates for high temperature applications based on the solidification...... criterion, phases predicted in the bulk solder and the thermodynamic stability of chlorides. These promising solder candidates were precisely produced using the hot stage microscope and its respective anodic and cathodic polarization curves were investigated using a micro-electrochemical set up...

  2. Manipulation and soldering of carbon nanotubes using atomic force microscope

    International Nuclear Information System (INIS)

    Kashiwase, Yuta; Ikeda, Takayuki; Oya, Takahide; Ogino, Toshio

    2008-01-01

    Manipulation of carbon nanotubes (CNTs) by an atomic force microscope (AFM) and soldering of CNTs using Fe oxide nanoparticles are described. We succeeded to separate a CNT bundle into two CNTs or CNT bundles, to move the separated CNT to a desirable position, and to bind it to another bundle. For the accurate manipulation, load of the AFM cantilever and frequency of the scan were carefully selected. We soldered two CNTs using an Fe oxide nanoparticle prepared from a ferritin molecule. The adhesion forces between the soldered CNTs were examined by an AFM and it was found that the CNTs were bound, though the binding force was not strong

  3. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint.

    Science.gov (United States)

    Lee, Sang-Yeob; Lee, Jong-Hyuk

    2010-12-01

    The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

  4. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

    Directory of Open Access Journals (Sweden)

    Liu Mei Lee

    2013-01-01

    Full Text Available This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

  5. Development of a soft-soldering system for aluminum

    Science.gov (United States)

    Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

    1983-03-01

    The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

  6. Development of gold based solder candidates for flip chip assembly

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Flip chip technology is now rapidly replacing the traditional wire bonding interconnection technology in the first level packaging applications due to the miniaturization drive in the microelectronics industry. Flip chip assembly currently involves the use of high lead containing solders...

  7. Strength of joints brazed with two-phase solders

    International Nuclear Information System (INIS)

    Shnyakin, N.S.; Parfenova, L.V.; Ekatova, A.S.; Prilepskaya, I.V.

    1976-01-01

    Dependence of the structure and strength of soldered joints upon a gap size in case of 1Kh18N10T stainless steel soldering with a double-phase solder of Ni-Zn-Cu system is described. Butt and lap joints have been subjected to soldering with gas-flame and induction heating. The optimum conditions of the solder crystallization are determined with wedge-gap samples. The studies show that the character of distribution of a fusible β-phase in metal depends upon a gap size. With gaps up to 0.1 mm the β-phase enriched with a fusible component (zinc) runs as a continuous thin interlayer in the middle of the seam. As a result of zinc evaporation from the β-phase this interlayer becomes internally oxidized. After the sample is broken an oxidized fracture gives one the impression of a poor fusion in the middle part of the joint. The ultimate strength of butt joints is 15-20 kgf/sq.mm. A value of thermal expansion of 1Kh18N10T steel samples, 1-5 mm thick, has been experimentally determined for butt soldering. The elongation of two halves of the sample is measured by an indicator and proved to be 0.89 mm for a 50x50x2 mm sample at a soldering temperature of 1.100 deg C. The paper presents methods for the calculation of an optimal gap value for butt soldering with a local gas-flame and induction heating

  8. Characteristics of solder joints under fatigue loads using piezomechanical actuation

    Science.gov (United States)

    Shim, Dong-Jin; Spearing, S. Mark

    2003-07-01

    Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

  9. Laser Soldering of Rat Skin Using a Controlled Feedback System

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2009-03-01

    Full Text Available Introduction: Laser tissue soldering using albumin and indocyanine green dye (ICG is an effective technique utilized in various surgical procedures. The purpose of this study was to perform laser soldering of rat skin under a feedback control system and compare the results with those obtained using standard sutures. Material and Methods: Skin incisions were made over eight rats’ dorsa, which were subsequently closed using different wound closure interventions in two groups: (a using a temperature controlled infrared detector or (b by suture. Tensile strengths were measured at 2, 5, 7 and 10 days post-incision. Histological examination was performed at the time of sacrifice. Results: Tensile strength results showed that during the initial days following the incisions, the tensile strengths of the sutured samples were greater than the laser samples. However, 10 days after the incisions, the tensile strengths of the laser soldered incisions were higher than the sutured cuts. Histopathological examination showed a preferred wound healing response in the soldered skin compared with the control samples. The healing indices of the laser soldered repairs (426 were significantly better than the control samples (340.5. Conclusion: Tissue feedback control of temperature and optical changes in laser soldering of skin leads to a higher tensile strength and better histological results and hence this method may be considered as an alternative to standard suturing.

  10. Tensile strength of two soldered alloys (Minalux and Verabond2

    Directory of Open Access Journals (Sweden)

    Mir Mohammad Rezaee S

    2002-07-01

    Full Text Available Recently. Minalux alloy, a base metal free from Be, has been presented on the market while no special soldering has been recommended for it. On the other hand, based on the manufacturer's claim, this alloy is similar to Verabond2. The aim of this study was to investigate the tensile strength of Minalux and Verabond2, soldered by Verasolder. Twelve standard dambble shape samples, with the length of 18 mm and the diameter of 3mm, were prepared from each alloy. Six samples of each alloy were divided into two pieces with carboradom disk. Soldering gap distance was 0.3mm, measured by a special jig and they were soldered by Verasolder alloy. Six other samples, of both Iranian and foreign unsoldered alloys were considered as control group. Then samples were examined under tensile force and their tensile strength was recorded. Two- way variance analysis showed that the tensile strength of Minalux alloy and Verabond2 were not statistically significant (Verasoler 686, Minalux 723, but after soldering, such difference became significant (Minalux 308, Verabond2 432. Verabond2 showed higher tensile strength after soldering.

  11. Features of Pd-Ni-Fe solder system for vacuum brazing of low alloy steels

    International Nuclear Information System (INIS)

    Radzievskij, V.N.; Kurochko, R.S.; Lotsmanov, S.N.; Rymar', V.I.

    1975-01-01

    The brazing solder of the Pd-Ni-Fe alloyed with copper and lithium, in order to decrease the melting point and provide for a better spreading, when soldered in vacuum ensures a uniform strength of soldered joints with the base metal of low-alloyed steels of 34KHNIM-type. The properties of low-alloyed steel joints brazed with the Pd-Ni-Fe-system solder little depend on the changes in the soldering parameters. The soldered joint keeps a homogeneous structure after all the stages of heat treatment (annealing, quenching and tempering)

  12. Lead-free solder technology transfer from ASE Americas

    Energy Technology Data Exchange (ETDEWEB)

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a

  13. High temperature strength data-base of SUS304 steel and a study on life prediction method under ceep-fatigue interaction

    International Nuclear Information System (INIS)

    Matsubara, Masaaki; Nitta, Akito; Ogata, Takashi; Kuwabara, Kazuo

    1985-01-01

    As a part of ''Study for practical use of Tank Type FBR'', ''Practical use of inelastic analysis method to FBR structural design'' is carried out as a cooperative study for three years from 1984. In this cooperative study, to establish the life prediction method under creep-fatigue interaction is one of the most important theme. To attain this purpose, many different type tests are planned and then conducted. By the way, to use these many data rapidly and effectively, it is necessary to make a data base. So in this work, we developed the simple data base of high temperature strength. And the data of SUS304 obtained at this place to this day are inputted into this data base. Next, we investigated about five life prediction methods under creep-fatigue interaction, Frequency Modified Method, Ostergren Method, Strain Range Partitioning Method, Damage Rate Approach and Strain Energy Parameter Method. As a result, Strain Range Partitioning Method can predict the lives within Factor of 2. In the other four methods, it is supported that material constants in the prediction formula are dependent on temperature. (author)

  14. Thermal decomposition of solder flux activators under simulated wave soldering conditions

    DEFF Research Database (Denmark)

    Piotrowska, Kamila; Jellesen, Morten Stendahl; Ambat, Rajan

    2017-01-01

    /methodology/approach: Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base...... titration method as a function of temperature, time of exposure and the substrate material used. Findings: The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL...

  15. Mechanical properties of Bi-In-Zn/ Cu solder joint system

    International Nuclear Information System (INIS)

    Ervina Efzan Mohd Noor; Mohammed Noori Ridha; Ahmad Badri Ismail; Nurulakmal Mohd Sharif; Kuan Yew Cheong; Tadashi Ariga; Zuhailawati Hussain

    2009-01-01

    Full text: In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry; the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this works, microstructure and mechanical properties of different reflow temperature (80, 100, 120 and 140 degree Celsius) for solder joints on shear strength of Bi-In-Zn lead free solder with low melting temperature of 60 degree Celsius on Cu solder joint has been investigated. This paper will compared the mechanical properties of the Bi-In-Zn lead-free solder alloys with current lead-free solder, Sn-Ag-Cu solder alloy. The fracture surface analyses have been observed by Optical Microscope and were investigated by Scanning Electron Microscope (SEM) and Energy Dispersive X-ray (EDX) and proved it by X-ray diffraction (XRD). (author)

  16. Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

    Directory of Open Access Journals (Sweden)

    Molnar A.

    2017-06-01

    Full Text Available In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints’ lifetime.

  17. Commentary: Photothermal effects of laser tissue soldering

    International Nuclear Information System (INIS)

    Menovsky, T.; Beek, J.F.; Gemert, M.J.C. van

    1999-01-01

    Full text: Laser tissue welding is the process of using laser energy to join tissues without sutures or with a reduced number of sutures. Recently, diode lasers have been added to the list of fusion lasers (Lewis and Uribe 1993, Reali et al 1993). Typically, for tissue welding, deep penetrating diode lasers emitting at 800-810 nm are used, in combination with a strong absorbing protein solder containing the dye indocyanine green. Indocyanine green has a maximum absorption coefficient at 805 nm and binds preferentially with proteins (Sauda et al 1986). The greatest advantage of diode lasers is their compact size, easy use and low cost. In this issue of Physics in Medicine and Biology (pp 983-1002, 'Photothermal effects of laser tissue soldering'), in an in vitro study, McNally et al investigate the optimal laser settings and welding temperatures in relation to the tensile strength and thermal damage of bovine aorta specimens. An interesting statement in their introduction is that the low strength of laser produced anastomoses can lead to aneurysm formation. The increased chance of aneurysm formation may merely be due to the thermal effect of the laser on the vascular wall, especially on the adventitia and media layers, which become necrotic after thermal injury. Subsequent haemodynamic stress exerted on a damaged vascular wall is a significant contributing factor for aneurysmal initiation. Also interesting is the remark that 'by the application of wavelength-specific chromophores in tissue welding ... the requirement for precise focusing and aiming of the laser beam may be removed'. Though perhaps not yet fully justified, this statement, if true, would facilitate surgical procedures. While the experiments are conducted in a proper manner, the use of bovine aorta specimens, which were stored at -70 deg. C and subsequently thawed for the tissue welding experiments, may not be the most appropriate for studying tissue effects or tensile strength measurements, as the

  18. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near combustible...

  19. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. [Statutory Provisions] All welding, cutting, or soldering with arc or flame in all underground areas of a coal mine shall, whenever...

  20. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering with...

  1. A Corrosion Investigation of Solder Candidates for High-Temperature Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan

    2009-01-01

    The step soldering approach is being employed in the Multi-Chip module (MCM) technology. High lead containing alloys is one of the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work...

  2. Influence of Co and W powders on viscosity of composite solders during soldering of specially shaped diamond-abrasive tools

    Science.gov (United States)

    Sokolov, E. G.; Aref’eva, S. A.; Svistun, L. I.

    2018-03-01

    The influence of Co and W powders on the structure and the viscosity of composite solders Sn-Cu-Co-W used for the manufacture of the specially shaped diamond tools has been studied. The solders were obtained by mixing the metallic powders with an organic binder. The mixtures with and without diamonds were applied to steel rollers and shaped substrates. The sintering was carried out in a vacuum at 820 ° C with time-exposure of 40 minutes. The influence of Co and W powders on the viscosity solders was evaluated on the basis of the study of structures and according to the results of sintering specially shaped diamond tools. It was found that to provide the necessary viscosity and to obtain the uniform diamond-containing layers on the complex shaped surfaces, Sn-Cu-Co-W solder should contain 27–35 vol % of solid phase. This is achieved with a total solder content of 24–32 wt % of cobalt powder and 7 wt % of tungsten powder.

  3. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    Energy Technology Data Exchange (ETDEWEB)

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  4. Automation of experimental research of waveguide paths induction soldering

    Science.gov (United States)

    Tynchenko, V. S.; Petrenko, V. E.; Kukartsev, V. V.; Tynchenko, V. V.; Antamoshkin, O. A.

    2018-05-01

    The article presents an automated system of experimental studies of the waveguide paths induction soldering process. The system is a part of additional software for a complex of automated control of the technological process of induction soldering of thin-walled waveguide paths from aluminum alloys, expanding its capabilities. The structure of the software product, the general appearance of the controls and the potential application possibilities are presented. The utility of the developed application by approbation in a series of field experiments was considered and justified. The application of the experimental research system makes it possible to improve the process under consideration, providing the possibility of fine-tuning the control regulators, as well as keeping the statistics of the soldering process in a convenient form for analysis.

  5. Optimization of the soldering process by the DMAIC methodology

    Directory of Open Access Journals (Sweden)

    Michał Zasadzień

    2016-06-01

    Full Text Available The chapter presents the use of the DMAIC method for the analysis and improvement of the process of soldering pins in a plug connecting a bundle of wires to the board of a controller; a part of the steering system of a car. The main problem in the soldering process, that is an unsatisfactory share of bad soldered connections between the board and the plug and the instability of that number, was identified by means of a five-phase improvement process. Key points and main causes of the defect were pointed out, and process improvement measures were suggested. Due to the analysis conducted and the correct implementation of improvement measures the share of defective connections has been decreased twofold.

  6. Drinking Water Contamination Due To Lead-based Solder

    Science.gov (United States)

    Garcia, N.; Bartelt, E.; Cuff, K. E.

    2004-12-01

    The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

  7. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan

    2017-08-10

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  8. Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

    KAUST Repository

    Zhang, Xuan; Zheng, Xiujun; Zhang, Hong; Zhang, Junli; Fu, Jiecai; Zhang, Qiang; Peng, Chaoyi; Bai, Feiming; Zhang, Xixiang; Peng, Yong

    2017-01-01

    Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.

  9. Thermomechanical behavior of tin-rich (lead-free) solders

    Science.gov (United States)

    Sidhu, Rajen Singh

    In order to adequately characterize the behavior of ball-grid-array (BGA) Pb-free solder spheres in electronic devices, the microstructure and thermomechanical behavior need to be studied. Microstructure characterization of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu alloys was conducted using optical microscopy, scanning electron microscopy, transmission electron microscopy, image analysis, and a novel serial sectioning 3D reconstruction process. Microstructure-based finite-element method (FEM) modeling of deformation in Sn-3.5Ag alloy was conducted, and it will be shown that this technique is more accurate when compared to traditional unit cell models for simulating and understanding material behavior. The effect of cooling rate on microstructure and creep behavior of bulk Sn-rich solders was studied. The creep behavior was evaluated at 25, 95, and 120°C. Faster cooling rates were found to increase the creep strength of the solders due to refinement of the solder microstructure. The creep behavior of Sn-rich single solder spheres reflowed on Cu substrates was studied at 25, 60, 95, and 130°C. Testing was conducted using a microforce testing system, with lap-shear geometry samples. The solder joints displayed two distinct creep behaviors: (a) precipitation-strengthening (Sn-3.5Ag and Sn-3.9Ag-0.7Cu) and (b) power law creep accommodated by grain boundary sliding (GBS) (Sn and Sn-0.7Cu). The relationship between microstructural features (i.e. intermetallic particle size and spacing), stress exponents, threshold stress, and activation energies are discussed. The relationship between small-length scale creep behavior and bulk behavior is also addressed. To better understand the damage evolution in Sn-rich solder joints during thermal fatigue, the local damage will be correlated to the cyclic hysteresis behavior and crystal orientations present in the Sn phase of solder joints. FEM modeling will also be utilized to better understand the macroscopic and local

  10. Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

    Energy Technology Data Exchange (ETDEWEB)

    Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

    1999-11-01

    Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

  11. Influence of solder joint length to the mechanical aspect during the thermal stress analysis

    Science.gov (United States)

    Tan, J. S.; Khor, C. Y.; Rahim, Wan Mohd Faizal Wan Abd; Ishak, Muhammad Ikman; Rosli, M. U.; Jamalludin, Mohd Riduan; Zakaria, M. S.; Nawi, M. A. M.; Aziz, M. S. Abdul; Ani, F. Che

    2017-09-01

    Solder joint is an important interconnector in surface mount technology (SMT) assembly process. The real time stress, strain and displacement of the solder joint is difficult to observe and assess the experiment. To tackle these problems, simulation analysis was employed to study the von Mises stress, strain and displacement in the thermal stress analysis by using Finite element based software. In this study, a model of leadless electronic package was considered. The thermal stress analysis was performed to investigate the effect of the solder length to those mechanical aspects. The simulation results revealed that solder length gives significant effect to the maximum von Mises stress to the solder joint. Besides, changes in solder length also influence the displacement of the solder joint in the thermal environment. The increment of the solder length significantly reduces the von Mises stress and strain on the solder joint. Thus, the understanding of the physical parameter for solder joint is important for engineer prior to designing the solder joint of the electronic component.

  12. High-Temperature Lead-Free Solder Alternatives: Possibilities and Properties

    DEFF Research Database (Denmark)

    High-temperature solders have been widely used as joining materials to provide stable interconnections that resist a severe thermal environment and also to facilitate the drive for miniaturization. High-lead containing solders have been commonly used as high-temperature solders. The development...... of high-temperature lead-free solders has become an important issue for both the electronics and automobile industries because of the health and environmental concerns associated with lead usage. Unfortunately, limited choices are available as high-temperature lead-free solders. This work outlines...... the criteria for the evaluation of a new high-temperature lead-free solder material. A list of potential ternary high-temperature lead-free solder alternatives based on the Au-Sn and Au-Ge systems is proposed. Furthermore, a comprehensive comparison of the high-temperature stability of microstructures...

  13. Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

    Energy Technology Data Exchange (ETDEWEB)

    Xia Yanghua [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)], E-mail: xia_yanghua@hotmail.com; Xie Xiaoming [State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 (China)

    2008-04-24

    The reliability of lead-free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered on FR4 PCB (printed circuit board) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) were studied. The results show that OSP finish reveals better performance than its ENIG counterparts. The crack originates at the fringe of heel fillet in both cases. The propagation of crack in the ENIG case is along the device/solder interface, while in the case of OSP, the crack extends parallel to the solder/PCB interface. When the OSP finishes are employed, many Cu6Sn5 precipitates form inside the bulk solder and have a strengthening effect on the solder joint, resulting in better reliability performance as compared to those with ENIG finishes.

  14. Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

    Science.gov (United States)

    This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

  15. Horizon shells and BMS-like soldering transformations

    Energy Technology Data Exchange (ETDEWEB)

    Blau, Matthias [Albert Einstein Center for Fundamental Physics,Institute for Theoretical Physics, University of Bern,Sidlerstrasse 5, 3012 Bern (Switzerland); O’Loughlin, Martin [University of Nova Gorica,Vipavska 13, 5000 Nova Gorica (Slovenia)

    2016-03-07

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  16. Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints

    International Nuclear Information System (INIS)

    Liu, X.W.; Plumbridge, W.J.

    2003-01-01

    The fatigue of Sn-37 wt.% Pb model solder joints has been investigated under thermomechanical and thermal cycling. Based upon an analysis of displacements during thermomechancial cycling, a model solder joint has been designed to simulate actual joints in electronic packages. The strain-stress relationship, characterised by hysteresis loops, was determined during cycling from 30 to 125 deg. C, and the stress-range monitored throughout. The number of cycles to failure, as defined by the fall in stress range, was correlated to strain range and strain energy. The strain hardening exponent, k, varied with the definition of failure and, when a stress-range drop of 50% was used, it was 0.46. Cracks were produced during pure thermal cycling without external strains applied. These arose due to the local strains caused by thermal expansion mismatches between the solder and Cu 6 Sn 5 intermetallic layer, between the phases of solder, and due to the anisotropy of the materials. The fatigue life under thermomechanical cycling was significantly inferior to that obtained in isothermal mechanical cycling. A factor contributing to this inferiority is the internal damage produced during temperature cycling

  17. Soluble Lead and Bismuth Chalcogenidometallates: Versatile Solders for Thermoelectric Materials

    Energy Technology Data Exchange (ETDEWEB)

    Zhang, Hao [Department; Son, Jae Sung [Department; School; Dolzhnikov, Dmitriy S. [Department; Filatov, Alexander S. [Department; Hazarika, Abhijit [Department; Wang, Yuanyuan [Department; Hudson, Margaret H. [Department; Sun, Cheng-Jun [Advanced; Chattopadhyay, Soma [Physical; Talapin, Dmitri V. [Department; Center

    2017-07-27

    Here we report the syntheses of largely unexplored lead and bismuth chalcogenidometallates in the solution phase. Using N2H4 as the solvent, new compounds such as K6Pb3Te6·7N2H4 were obtained. These soluble molecular compounds underwent cation exchange processes using resin chemistry, replacing Na+ or K+ by decomposable N2H5+ or tetraethylammonium cations. They also transformed into stoichiometric lead and bismuth chalcogenide nanomaterials with the addition of metal salts. Such a versatile chemistry led to a variety of composition-matched solders to join lead and bismuth chalcogenides and tune their charge transport properties at the grain boundaries. Solution-processed thin films composed of Bi0.5Sb1.5Te3 microparticles soldered by (N2H5)6Bi0.5Sb1.5Te6 exhibited thermoelectric power factors (~28 μW/cm K2) comparable to those in vacuum-deposited Bi0.5Sb1.5Te3 films. The soldering effect can also be integrated with attractive fabrication techniques for thermoelectric modules, such as screen printing, suggesting the potential of these solders in the rational design of printable and moldable thermoelectrics.

  18. Effects of PCB thickness on adjustable fountain wave soldering

    Indian Academy of Sciences (India)

    hybrid circuit assembly, component lead tinning, and wire tinning. .... The mesh model was built and optimized with 599920 hybrid nodes as shown in figure 9. ... conducted to track the fluid motions of the two phases (i.e., molten solder and air).

  19. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Directory of Open Access Journals (Sweden)

    Yee Mei Leong

    2016-06-01

    Full Text Available Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag content solder SAC105 (Sn-1.0Ag-0.5Cu because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al addition (0.1–0.5 wt.% to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface.

  20. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

    Science.gov (United States)

    Leong, Yee Mei; Haseeb, A.S.M.A.

    2016-01-01

    Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present work investigates the effect of minor aluminum (Al) addition (0.1–0.5 wt.%) to SAC105 on the interfacial structure between solder and copper substrate during reflow. The addition of minor Al promoted formation of small, equiaxed Cu-Al particle, which are identified as Cu3Al2. Cu3Al2 resided at the near surface/edges of the solder and exhibited higher hardness and modulus. Results show that the minor addition of Al does not alter the morphology of the interfacial intermetallic compounds, but they substantially suppress the growth of the interfacial Cu6Sn5 intermetallic compound (IMC) after reflow. During isothermal aging, minor alloying Al has reduced the thickness of interfacial Cu6Sn5 IMC but has no significant effect on the thickness of Cu3Sn. It is suggested that of atoms of Al exert their influence by hindering the flow of reacting species at the interface. PMID:28773645

  1. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Haiyan [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Peng, Jianke [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Fu, Li, E-mail: fuli@nwpu.edu.cn [State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072 (China); Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Wang, Xincheng [Shaanxi Key Laboratory of Friction Welding Technologies, Xi’an 710072 (China); Xie, Yan [School of Materials Science and Engineering, Tianjin University, Tianjin 300072 (China)

    2016-04-15

    Graphical abstract: - Highlights: • The wetting angle of lead free solder on Cu was reduced by surface microstructure. • The wetting form of Sn-Ag-Cu solder on Cu was “non-composite surface”. • The experimental results had a sound fit with the theoretical calculation. - Abstract: In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  2. Effects of soldering methods on tensile strength of a gold-palladium metal ceramic alloy.

    Science.gov (United States)

    Ghadhanfari, Husain A; Khajah, Hasan M; Monaco, Edward A; Kim, Hyeongil

    2014-10-01

    The tensile strength obtained by conventional postceramic application soldering and laser postceramic welding may require more energy than microwave postceramic soldering, which could provide similar tensile strength values. The purpose of the study was to compare the tensile strength obtained by microwave postceramic soldering, conventional postceramic soldering, and laser postceramic welding. A gold-palladium metal ceramic alloy and gold-based solder were used in this study. Twenty-seven wax specimens were cast in gold-palladium noble metal and divided into 4 groups: laser welding with a specific postfiller noble metal, microwave soldering with a postceramic solder, conventional soldering with the same postceramic solder used in the microwave soldering group, and a nonsectioned control group. All the specimens were heat treated to simulate a normal porcelain sintering sequence. An Instron Universal Testing Machine was used to measure the tensile strength for the 4 groups. The means were analyzed statistically with 1-way ANOVA. The surface and fracture sites of the specimens were subjectively evaluated for fracture type and porosities by using a scanning electron microscope. The mean (standard deviation) ultimate tensile strength values were as follows: nonsectioned control 818 ±30 MPa, microwave 516 ±34 MPa, conventional 454 ±37 MPa, and laser weld 191 ±39 MPa. A 1-way ANOVA showed a significant difference in ultimate tensile strength among the groups (F3,23=334.5; Ptensile strength for gold and palladium noble metals than either conventional soldering or laser welding. Conventional soldering resulted in a higher tensile strength than laser welding. Under the experimental conditions described, either microwave or conventional postceramic soldering would appear to satisfy clinical requirements related to tensile strength. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

  3. Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

    Science.gov (United States)

    Huang, Chien-Sheng; Jang, Guh-Yaw; Duh, Jenq-Gong

    2004-04-01

    Nickel-based under bump metallization (UBM) has been widely used as a diffusion barrier to prevent the rapid reaction between the Cu conductor and Sn-based solders. In this study, joints with and without solder after heat treatments were employed to evaluate the diffusion behavior of Cu in the 63Sn-37Pb/Ni/Cu/Ti/Si3N4/Si multilayer structure. The atomic flux of Cu diffused through Ni was evaluated from the concentration profiles of Cu in solder joints. During reflow, the atomic flux of Cu was on the order of 1015-1016 atoms/cm2s. However, in the assembly without solder, no Cu was detected on the surface of Ni even after ten cycles of reflow. The diffusion behavior of Cu during heat treatments was studied, and the soldering-process-induced Cu diffusion through Ni metallization was characterized. In addition, the effect of Cu content in the solder near the solder/intermetallic compound (IMC) interface on interfacial reactions between the solder and the Ni/Cu UBM was also discussed. It is evident that the (Cu,Ni)6Sn5 IMC might form as the concentration of Cu in the Sn-Cu-Ni alloy exceeds 0.6 wt.%.

  4. Creep-fatique interactions in 316 stainless steel under torsional loading

    International Nuclear Information System (INIS)

    Wei, K.; Dyson, B.F.

    1982-01-01

    Some fatigue, fatigue with creep dwells and creep tests have been performed in torsion using 316 stainless steel at 600 0 C. As expected from push-pull testing, the introduction of a creep dwell reduced fatigue endurances and changed the fracture from classical transgranular to intergranular. Optical microscopical examination revealed a large number of intergranular cracks concentrated along shear planes, but quantitative assessment identified the importance of creep tensile stresses in crack development. In contrast, little intergranular damage was found after torsion creep, which is consistent with its exhibited buckling mode of failure. It is concluded that reverse plastic strain is the cause of intergranular crack formation in the material and is therefore the primary mechanism of creep-fatigue interaction. (author)

  5. The metallurgical approach on the solder voids behaviour in surface mount devices

    International Nuclear Information System (INIS)

    Mohabattul Zaman Bukhari

    1996-01-01

    Solder voids are believed to cause poor heat dissiption in the Surface Mount devices and reduce the reliability of the devices at higher operating services. There are a lot of factors involved in creating voids such as gas/flux entrapment, wettability, outgasseous, air bubbles in the solder paste, inconsistency of solder coverage and improper metal scheme selection. This study was done to observe the behaviour of the solder voids in term of flux entrapmentt and wettability. It is believed that flux entrapment and wettability are verify this hypothesis. Two types of metal scheme were chosen which are Nickel (Ni) plated and Tin (Sn) plated heatsink. X-ray techniques such as Radiographic Inspection Analysis and EDAX were used to detect the minute solder voids. The solder voids observed on the heatsinks and Copper shims after the reflow process are believed to be a non contact voids that resulted from some portion of the surface not wetting properly

  6. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    Science.gov (United States)

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  7. Interfacial reaction of Sn-based solder joint in the package system

    Science.gov (United States)

    Gu, Huandi

    In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

  8. A new method for soldering particle-reinforced aluminum metal matrix composites

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Jinbin; Mu, Yunchao [Zhongyuan University of Technology, Zhengzhou 450007 (China); Luo, Xiangwei [Zhengzhou University, Zhengzhou 450002 (China); Niu, Jitai, E-mail: niujitai@163.com [Zhongyuan University of Technology, Zhengzhou 450007 (China)

    2012-12-01

    Highlights: Black-Right-Pointing-Pointer Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. Black-Right-Pointing-Pointer The nickel plating is required on the surface of the composites before soldering. Black-Right-Pointing-Pointer Low welding temperature is set to avoid overheating of the matrix. Black-Right-Pointing-Pointer Chemical and metallurgical bonding of composites and Kovar is carried out. Black-Right-Pointing-Pointer High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al-SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe-Ni-Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn-Cd-Ag-Cu) with a melting point of about 400 Degree-Sign C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)-Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al-SiC composite.

  9. A new method for soldering particle-reinforced aluminum metal matrix composites

    International Nuclear Information System (INIS)

    Lu, Jinbin; Mu, Yunchao; Luo, Xiangwei; Niu, Jitai

    2012-01-01

    Highlights: ► Soldering of 55% SiCp/Al composite and Kovar is first achieved in the world. ► The nickel plating is required on the surface of the composites before soldering. ► Low welding temperature is set to avoid overheating of the matrix. ► Chemical and metallurgical bonding of composites and Kovar is carried out. ► High tension strength of 225 MPa in soldering seam has been obtained. - Abstract: Soldering of aluminum metal matrix composites (Al–SiC) to other structural materials, or even to themselves, has proved unsuccessful mainly due to the poor wetting of these composites by conventional soldering alloys. This paper reports a new approach, which improves the wetting properties of these composites by molting solder alloys to promote stronger bonds. The new approach relies on nickel-plating of the composite's faying surface prior to application of a solder alloy. Based on this approach, an aluminum metal matrix composite containing 55 vol.% SiC particles is successfully soldered to a Fe–Ni–Co alloy (commercially known as Kovar 4J29). The solder material is a zinc-based alloy (Zn–Cd–Ag–Cu) with a melting point of about 400 °C. Microscopic examinations of the aluminum metal matrix composites (Al-MMCs)–Kovar interfaces show that the nickel-plating, prior to soldering, could noticeably enhance the reaction between the molten solder and composites. The fractography of the shear-tested samples revealed that fracture occurs within the composite (i.e. cohesive failure), indicating a good adhesion between the solder alloy and the Al–SiC composite.

  10. Laser tissue welding mediated with a protein solder

    Science.gov (United States)

    Small, Ward, IV; Heredia, Nicholas J.; Celliers, Peter M.; Da Silva, Luiz B.; Eder, David C.; Glinsky, Michael E.; London, Richard A.; Maitland, Duncan J.; Matthews, Dennis L.; Soltz, Barbara A.

    1996-05-01

    A study of laser tissue welding mediated with an indocyanine green dye-enhanced protein solder was performed. Freshly obtained sections of porcine artery were used for the experiments. Sample arterial wall thickness ranged from two to three millimeters. Incisions approximately four millimeters in length were treated using an 805 nanometer continuous- wave diode laser coupled to a one millimeter diameter fiber. Controlled parameters included the power delivered by the laser, the duration of the welding process, and the concentration of dye in the solder. A two-color infrared detection system was constructed to monitor the surface temperatures achieved at the weld site. Burst pressure measurements were made to quantify the strengths of the welds immediately following completion of the welding procedure.

  11. Quality Analysis of Welded and Soldered Joints of Cu-Nb Microcomposite Wires

    Directory of Open Access Journals (Sweden)

    Nikolaj VIŠNIAKOV

    2011-03-01

    Full Text Available Quality analysis of welded and soldered joints of Cu-Nb microcomposite wires has been performed. Quality and mechanical characteristics of joints as ultimate tensile stress limit and elongation at break were measured with an universal testing machine and controlled visually using an optical microscope. Two wires joints were soldered with silver and copper solders and put into steel and copper sleeve respectively. Another two wires joints were soldered with silver solder and welded without any reinforcement. Joints soldered with the silver solder and steel sleeve have demonstrated the best mechanical characteristics: ultimate tensile stress limit of 650 MPa and elongation at break of 0.85 %. Joints soldered with the copper sleeve have no advantages comparing with the soldered butt joint. Ultimate tensile stress limit and elongation at break were in 300 MPa - 350 MPa and in 0.35 % - 0.45 % ranges respectively. Two welded joints had ultimate tensile stress limit of 470 MPa and elongation at break of 0.71 %. In all joints the microstructure of Nb filaments was destroyed and mechanical properties have been specified by mechanical strength of copper and sleeve materials only.http://dx.doi.org/10.5755/j01.ms.17.1.242

  12. Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Kita, T; Mukaibo, N; Ando, K; Moriyama, M [Honda R and D Co. Ltd., Tokyo (Japan)

    1997-10-01

    Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.

  13. The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder

    Science.gov (United States)

    Mayappan, R.; Salleh, A.; Andas, J.

    2017-09-01

    Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suitable replacement for the lead solder. Although many lead-free solders are available, the Sn-3.5Ag solder with the addition of graphene seem to be a suitable candidate. In this study, a 0.07 wt% graphene nanosheet was added into the Sn-3.5Ag solder and this composite solder was prepared under powder metallurgy method. The solder was reacted with copper substrate at 250 °C for one minute. For joint strength analysis, two copper strips were soldered together. The solder joint was aged at temperature 100 °C for 500 hours. Scanning Electron Microscope (SEM) was used to observe the interfacial reaction and Instron machine was used to determine the joint strength. Cu6Sn5 intermetallic layer was formed at the interface between the Cu substrate and the solders. Composite solder showed the retardation of the intermetallic growth compared to the plain solder. The thickness value of the intermetallic was used to calculate the growth rate the IMC. The graphene nanosheets added solder has lower growth rate which is 3.86 × 10-15 cm2/s compared to the plain solder 7.15 × 10-15 cm2/s. Shear strength analysis show that the composite solder has higher joint compared to the plain solder.

  14. Influence of Difference Solders Volume on Intermetallic Growth of Sn-4.0Ag-0.5Cu/ENEPIG

    Directory of Open Access Journals (Sweden)

    Saliza Azlina O.

    2016-01-01

    Full Text Available In recent years, portable electronic packaging products such as smart phones, tablets, notebooks and other gadgets have been developed with reduced size of component packaging, light weight, high speed and with enhanced performance. Thus, flip chip technology with smaller solder sphere sizes that would produce fine solder joint interconnections have become essential in order to fulfill these miniaturization requirements. This study investigates the interfacial reactions and intermetallics formation during reflow soldering and isothermal aging between Sn-4.0Ag-0.5Cu (SAC405 and electroless nickel/immersion palladium/immersion gold (EN(PEPIG. Solder diameters of 300 μm and 700 μm were used to compare the effect of solder volume on the solder joint microstructure. The solid state isothermal aging was performed at 125°C starting from 250 hours until 2000 hours. The results revealed that only (Cu,Ni6Sn5 IMC was found at the interface during reflow soldering while both (Cu,Ni6Sn5 and (Ni,Cu3Sn4 IMC have been observed after aging process. Smaller solder sizes produced thinner IMC than larger solder joints investigated after reflow soldering, whereas the larger solders produced thinner IMC than the smaller solders after isothermal aging. Aging duration of solder joints has been found to be increase the IMC’s thickness and changed the IMC morphologies to spherical-shaped, compacted and larger grain size.

  15. Laser beam soldering of micro-optical components

    Science.gov (United States)

    Eberhardt, R.

    2003-05-01

    MOTIVATION Ongoing miniaturisation and higher requirements within optical assemblies and the processing of temperature sensitive components demands for innovative selective joining techniques. So far adhesive bonding has primarily been used to assemble and adjust hybrid micro optical systems. However, the properties of the organic polymers used for the adhesives limit the application of these systems. In fields of telecommunication and lithography, an enhancement of existing joining techniques is necessary to improve properties like humidity resistance, laserstability, UV-stability, thermal cycle reliability and life time reliability. Against this background laser beam soldering of optical components is a reasonable joining technology alternative. Properties like: - time and area restricted energy input - energy input can be controlled by the process temperature - direct and indirect heating of the components is possible - no mechanical contact between joining tool and components give good conditions to meet the requirements on a joining technology for sensitive optical components. Additionally to the laser soldering head, for the assembly of optical components it is necessary to include positioning units to adjust the position of the components with high accuracy before joining. Furthermore, suitable measurement methods to characterize the soldered assemblies (for instance in terms of position tolerances) need to be developed.

  16. Scalable Manufacturing of Solderable and Stretchable Physiologic Sensing Systems.

    Science.gov (United States)

    Kim, Yun-Soung; Lu, Jesse; Shih, Benjamin; Gharibans, Armen; Zou, Zhanan; Matsuno, Kristen; Aguilera, Roman; Han, Yoonjae; Meek, Ann; Xiao, Jianliang; Tolley, Michael T; Coleman, Todd P

    2017-10-01

    Methods for microfabrication of solderable and stretchable sensing systems (S4s) and a scaled production of adhesive-integrated active S4s for health monitoring are presented. S4s' excellent solderability is achieved by the sputter-deposited nickel-vanadium and gold pad metal layers and copper interconnection. The donor substrate, which is modified with "PI islands" to become selectively adhesive for the S4s, allows the heterogeneous devices to be integrated with large-area adhesives for packaging. The feasibility for S4-based health monitoring is demonstrated by developing an S4 integrated with a strain gauge and an onboard optical indication circuit. Owing to S4s' compatibility with the standard printed circuit board assembly processes, a variety of commercially available surface mount chip components, such as the wafer level chip scale packages, chip resistors, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating the versatile and modular nature of S4s. Tegaderm-integrated S4 respiration sensors are tested for robustness for cyclic deformation, maximum stretchability, durability, and biocompatibility for multiday wear time. The results of the tests and demonstration of the respiration sensing indicate that the adhesive-integrated S4s can provide end users a way for unobtrusive health monitoring. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  17. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Science.gov (United States)

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting, or...

  18. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    Science.gov (United States)

    Sorg, Brian S.; Welch, Ashley J.

    2001-05-01

    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  19. Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Andersson, D.; Hoo, N.; Pearce, J.; Watson, A.; Dinsdale, A.; Mucklejohn, S.

    2012-01-01

    Roč. 21, č. 5 (2012), s. 629-637 ISSN 1059-9495 Institutional support: RVO:68081723 Keywords : lead-free soldering, * materials for high-temperature LF * new technologies for HT lead-free soldering Subject RIV: BJ - Thermodynamics Impact factor: 0.915, year: 2012

  20. Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

    Science.gov (United States)

    Lin, Jian; Lei, Yongping; Fu, Hanguang; Guo, Fu

    2018-03-01

    In surface mount technology, the Sn-3.0Ag-0.5Cu solder joint has a shorter impact lifetime than a traditional lead-tin solder joint. In order to improve the impact property of SnAgCu lead-free solder joints and identify the effect of silver content on tensile strength and impact property, impact experiments were conducted at various strain rates on three selected SnAgCu based solder joints. It was found that joint failure mainly occurred in the solder material with large plastic deformation under low strain rate, while joint failure occurred at the brittle intermetallic compound layer without any plastic deformation at a high strain rate. Joint strength increased with the silver content in SnAgCu alloys in static tensile tests, while the impact property of the solder joint decreased with increasing silver content. When the strain rate was low, plastic deformation occurred with failure and the tensile strength of the Sn-3.0Ag-0.5Cu solder joint was higher than that of Sn-0.3Ag-0.7Cu; when the strain rate was high, joint failure mainly occurred at the brittle interface layer and the Sn-0.3Ag-0.7Cu solder joint had a better impact resistance with a thinner intermetallic compound layer.

  1. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    Science.gov (United States)

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

    2015-08-01

    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding.

  2. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

    Science.gov (United States)

    Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu

    2017-08-01

    Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe- xNi ( x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

  3. Corrosion Reliability of Lead-free Solder Systems Used in Electronics

    DEFF Research Database (Denmark)

    Li, Feng; Verdingovas, Vadimas; Medgyes, Balint

    2017-01-01

    humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods...

  4. Reliability and microstructure of lead-free solder joints in industrial electronics after accelerated thermal aging

    NARCIS (Netherlands)

    Scaltro, F.; Biglari, M.H.; Kodentsov, A.; Yakovleva, O.; Brom, E.

    2009-01-01

    The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface component/solder together with the formation of fractures. The evolution, the morphology and the elemental

  5. Investigation of moisture uptake into printed circuit board laminate and solder mask materials

    DEFF Research Database (Denmark)

    Conseil, Helene; Gudla, Visweswara Chakravarthy; Borgaonkar, Shruti

    2017-01-01

    with different solder mask materials and exposed to saturated water vapour and liquid water. The solder masks are characterised for their microstructure and constituent phases using scanning electron microscopy and X-ray diffraction. The observations are correlated with themoisture absorption characteristic...

  6. Properties and Microstructures of Sn-Bi-X Lead-Free Solders

    Directory of Open Access Journals (Sweden)

    Fan Yang

    2016-01-01

    Full Text Available The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

  7. Physical properties of lead free solders in liquid and solid state

    Energy Technology Data Exchange (ETDEWEB)

    Mhiaoui, Souad

    2007-04-17

    The European legislation prohibits the use of lead containing solders in Europe. However, lead free solders have a higher melting point (typical 20%) and their mechanical characteristics are worse. Additional problems are aging and adhesion of the solder on the electronic circuits. Thus, research activities must focus on the optimization of the properties of Sn-Ag-Cu based lead free solders chosen by the industry. Two main objectives are treated in this work. In the center of the first one is the study of curious hysteresis effects of metallic cadmium-antimony alloys after thermal cycles by measuring electronic transport phenomena (thermoelectric power and electrical resistivity). The second objective, within the framework of ''cotutelle'' between the universities of Metz and of Chemnitz and supported by COST531, is to study more specifically lead free solders. A welding must well conduct electricity and well conduct and dissipate heat. In Metz, we determined the electrical conductivity, the thermoelectric power and the thermal conductivity of various lead free solders (Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Sb) as well in the liquid as well in the solid state. The results have been compared to classical lead-tin (Pb-Sn) solders. In Chemnitz we measured the surface tension, the interfacial tension and the density of lead free solders. We also measured the viscosity of these solders without and with additives, in particular nickel. These properties were related to the industrial problems of wettability and spreadability. Lastly, we solidified alloys under various conditions. We observed undercooling. We developed a technique of mixture of nanocrystalline powder with lead free solders ''to sow'' the liquid bath in order to obtain ''different'' solids which were examined using optical and electron microscopy. (orig.)

  8. An Approach for Impression Creep of Lead Free Microelectronic Solders

    Science.gov (United States)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  9. Transected sciatic nerve repair by diode laser protein soldering.

    Science.gov (United States)

    Fekrazad, Reza; Mortezai, Omid; Pedram, MirSepehr; Kalhori, Katayoun Am; Joharchi, Khojasteh; Mansoori, Korosh; Ebrahimi, Roja; Mashhadiabbas, Fatemeh

    2017-08-01

    Despite advances in microsurgical techniques, repair of peripheral nerve injuries (PNI) is still a major challenge in regenerative medicine. The standard treatment for PNI includes suturing and anasthomosis of the transected nerve. The objective of this study was to compare neurorraphy (nerve repair) using standard suturingto diode laser protein soldering on the functional recovery of transected sciatic nerves. Thirty adult male Fischer-344 Wistar rats were randomly assigned to 3 groups: 1. The control group, no repair, 2. the standard of care suture group, and 3. The laser/protein solder group. For all three groups, the sciatic nerve was transected and the repair was done immediately. For the suture repair group, 10.0 prolene suture was used and for the laser/protein solder group a diode laser (500mW output power) in combination with bovine serum albumen and indocyanine green dye was used. Behavioral assessment by sciatic functional index was done on all rats biweekly. At 12weeks post-surgery, EMG recordings were done on all the rats and the rats were euthanized for histological evaluation of the sciatic nerves. The one-way ANOVA test was used for statistical analysis. The average time required to perform the surgery was significantly shorter for the laser-assisted nerve repair group compared to the suture group. The EMG evaluation revealed no difference between the two groups. Based on the sciatic function index the laser group was significantly better than the suture group after 12weeks (pneurorraphy using standard suturing methods. Copyright © 2017 Elsevier B.V. All rights reserved.

  10. Prediction of activities of all components in the lead-free solder systems Bi-In-Sn and Bi-In-Sn-Zn

    International Nuclear Information System (INIS)

    Tao Dongping

    2008-01-01

    The activities of components of the ternary lead-free solder systems Al-Sn-Zn at 973 K, Zn-Cu-Sn at 1023 K and Bi-In-Sn at 1000 and 1050 K have been predicted by a novel molecular interaction volume model-MIVM and the results are in good agreement with experimental data. Then the activities of all components of the Bi-In-Sn at 550 K and the Bi-In-Sn-Zn quaternary system at 700 K have been further predicted and the results are reasonable and reliable. This shows that the model may be a superior alternative for describing interfacial chemical reactions between lead-free solder alloys and common base materials and for the calculation of their phase diagrams because MIVM has certain physical meaning from the viewpoint of statistical thermodynamics and requires only two infinite dilute activity coefficients for each sub-binary system

  11. Reliability of Wind Turbine Components-Solder Elements Fatigue Failure

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    on the temperature mean and temperature range. Constant terms and model errors are estimated. The proposed methods are useful to predict damage values for solder joint in power electrical components. Based on the proposed methods it is described how to find the damage level for a given temperature loading profile....... The proposed methods are discussed for application in reliability assessment of Wind Turbine’s electrical components considering physical, model and measurement uncertainties. For further research it is proposed to evaluate damage criteria for electrical components due to the operational temperature...

  12. Multi-scale modeling of elasto-plastic response of SnAgCu lead-free solder alloys at different ageing conditions: Effect of microstructure evolution, particle size effects and interfacial failure

    Energy Technology Data Exchange (ETDEWEB)

    Maleki, Milad; Cugnoni, Joel, E-mail: joel.cugnoni@epfl.ch; Botsis, John

    2016-04-20

    In microelectronics applications, SnAgCu lead-free solder joints play the important role of ensuring both the mechanical and electrical integrity of the components. In such applications, the SnAgCu joints are subjected to elevated homologous temperatures for an extended period of time causing significant microstructural changes and leading to reliability issues. In this study, the link between the change in microstructures and deformation behavior of SnAgCu solder during ageing is explained by developing a hybrid multi-scale microstructure-based modeling approach. Herein, the SnAgCu solder alloy is seen as a three phase metal matrix composite in which Ag{sub 3}Sn and Cu{sub 6}Sn{sub 5} hard intermetallics play the role of reinforcements and Sn the role of a ductile matrix. The hardening of the Sn matrix due to fine intermetallics in the eutectic mixture is modeled by incorporating the mean field effects of geometrically necessary dislocations. Subsequently, a two level homogenization procedure based on micromechanical finite element (FE) models is used to capture the interactions between the different phases. For this purpose, tomographic images of microstructures obtained by Focused Ion Beam (FIB) and synchrotron X-Ray in different ageing conditions are directly used to generate statistically representative volume elements (RVE) using 3D FE models. The constitutive behavior of the solder is determined by sequentially performing two scales of numerical homogenization at the eutectic level and then at the dendrite level. For simplification, the anisotropy of Sn as well as the potential recovery processes have been neglected in the modeling. The observed decrease in the yield strength of solder due to ageing is well captured by the adopted modeling strategy and allows explaining the different ageing mechanisms. Finally, the effects of potential debonding at the intermetallic particle-matrix interface as well as particle fracture on the overall strength of solder are

  13. Albumin solder covalently bound to a polymer membrane: New approach to improve binding strength in laser tissue soldering in-vitro.

    Science.gov (United States)

    Hiebl, B; Ascher, L; Luetzow, K; Kratz, K; Gruber, C; Mrowietz, C; Nehring, M E; Lendlein, A; Franke, R-P; Jung, F

    2018-01-01

    Laser tissue soldering (LTS) based on indocyanine green (ICG)-mediated heat-denaturation of proteins might be a promising alternative technique for micro-suturing, but up to now the problem of too weak shear strength of the solder welds in comparison to sutures is not solved. Earlier reports gave promising results showing that solder supported by carrier materials can enhance the cohesive strength of the liquid solder. In these studies, the solder was applied to the carriers by dip coating. Higher reliability of the connection between the solder and the carrier material is expected when the solder is bound covalently to the carrier material. In the present study a poly(ether imide) (PEI) membrane served as carrier material and ICG-supplemented albumin as solder substrate. The latter was covalently coupled to the carrier membrane under physiological conditions to prevent structural protein changes. As laser source a diode continuous-wave laser emitting at 808 nm with intensities between 250 mW and 1500 mW was utilized. The albumin functionalized carrier membrane was placed onto the tunica media of explanted pig thoracic aortae forming an overlapping area of approximately 0.5×0.5 cm2. All tests were performed in a dry state to prevent laser light absorption by water. Infrared spectroscopy, spectro-photometrical determination of the secondary and primary amine groups after acid orange II staining, contact angle measurements, and atomic force microscopy proved the successful functionalization of the PEI membrane with albumin. A laser power of 450 mW LTS could generate a membrane-blood vessel connection which was characterized by a shear strength of 0.08±0.002 MPa, corresponding to 15% of the tensile strength of the native blood vessel. Theoretically, an overlapping zone of 4.1 mm around the entire circumference of the blood vessel could have provided shear strength of the PEI membrane-blood vessel compound identical to the tensile strength of the native

  14. Development of Pb-Free Nanocomposite Solder Alloys

    Directory of Open Access Journals (Sweden)

    Animesh K. Basak

    2018-04-01

    Full Text Available As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs during aging/reflow. Accordingly, this study examines the improvement of properties of SAC alloys by incorporating nanoparticles in it. Two different types of nanoparticles were added in monolithic SAC alloy: (1 Al2O3 or (2 Fe and their effect on microstructure and thermal properties were investigated. Addition of Fe nanoparticles leads to the formation of FeSn2 IMCs alongside Ag3Sn and Cu6Sn5 from monolithic SAC alloy. Addition of Al2O3 nano-particles do not contribute to phase formation, however, remains dispersed along primary β-Sn grain boundaries and act as a grain refiner. As the addition of either Fe or Al2O3 nano-particles do not make any significant effect on thermal behavior, these reinforced nanocomposites are foreseen to provide better mechanical characteristics with respect to conventional monolithic SAC solder alloys.

  15. A flip chip process based on electroplated solder bumps

    Science.gov (United States)

    Salonen, J.; Salmi, J.

    1994-01-01

    Compared to wire bonding and TAB, flip chip technology using solder joints offers the highest pin count and packaging density and superior electrical performance. The chips are mounted upside down on the substrate, which can be made of silicon, ceramic, glass or - in some cases - even PCB. The extra processing steps required for chips are the deposition of a suitable thin film metal layer(s) on the standard Al pad and the formation of bumps. Also, the development of new fine line substrate technologies is required to utilize the full potential of the technology. In our bumping process, bump deposition is done by electroplating, which was chosen for its simplicity and economy. Sputter deposited molybdenum and copper are used as thin film layers between the aluminum pads and the solder bumps. A reason for this choice is that the metals can be selectively etched after bumping using the bumps as a mask, thus circumventing the need for a separate mask for etching the thin film metals. The bumps are electroplated from a binary Pb-Sn bath using a thick liquid photoresist. An extensively modified commercial flip chip bonder is used for alignment and bonding. Heat assisted tack bonding is used to attach the chips to the substrate, and final reflow joining is done without flux in a vacuum furnace.

  16. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

    Science.gov (United States)

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-12-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

  17. Some questions regarding the interaction of creep and fatigue

    International Nuclear Information System (INIS)

    James, L.A.

    1975-04-01

    Data are presented from fatigue-crack growth tests conducted on Type 304 S.S. in inert environments at elevated temperatures which show that the thermal-activation noted in similar tests run in air environments is not present in the inert environment. Similar observations from the literature are reviewed, including the observation that the time-dependency noted in tests conducted in elevated temperature air environments is also greatly suppressed in inert environments. These findings suggest that an interaction between the fatigue process and the corrosive air environments is responsible for the thermally activated time-dependent behavior often attributed to creep-fatigue interaction. Data are also presented which show that the fatigue-crack growth behavior of Type 304 S.S. subjected to significant creep damage prior to fatigue testing does not differ appreciably from the behavior of material not subjected to prior creep damage, again indicating minimal interaction between creep and fatigue. It is suggested that in the temperature range where pressure vessels and piping are generally designed to operate (i.e. below about one-half the absolute melting temperature of the alloy), the interaction between creep and fatigue is far less significant than once supposed, and that the major parameter interacting with the fatigue process is that of high-temperature corrosion. (39 references, 12 fig) (auth)

  18. Laser-tissue soldering with biodegradable polymer films in vitro: film surface morphology and hydration effects.

    Science.gov (United States)

    Sorg, B S; Welch, A J

    2001-01-01

    Previous research introduced the concept of using biodegradable polymer film reinforcement of a liquid albumin solder for improvement of the tensile strength of repaired incisions in vitro. In this study, the effect of creating small pores in the PLGA films on the weld breaking strength is studied. Additionally, the effect of hydration on the strength of the reinforced welds is investigated. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with an 806-nm CW diode laser. A poly(DL-lactic-co-glycolic acid) (PLGA) film was used to reinforce the solder (the controls had solder but no reinforcement). Breaking strengths were measured acutely and after hydration in saline for 1 and 2 days. The data were analyzed by ANOVA (P < 0.05) and multiple comparisons of means were performed using the Newman-Keuls test. The creation of pores in the PLGA films qualitatively improved the film flexibility without having an apparent adverse effect on the breaking strength, while the actual technique of applying the film and solder had more of an effect. The acute maximum average breaking strengths of some of the film reinforced specimens (114.7 g-134.4 g) were significantly higher (P < 0.05) than the acute maximum average breaking strength of the unreinforced control specimens (68.3 g). Film reinforced specimens were shown to have a statistically significantly higher breaking strength than unreinforced controls after 1- and 2-day hydration. Reinforcement of liquid albumin solders in laser-assisted incision repair appears to have advantages over conventional methods that do not reinforce the cohesive strength of the solder in terms of acute breaking strength and after immersion in moist environments for short periods of time. Using a film with the solder applied to one surface only may be advantageous over other techniques.

  19. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    Directory of Open Access Journals (Sweden)

    Xiuyun Zhou

    2015-10-01

    Full Text Available In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT. Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  20. Contamination profile on typical printed circuit board assemblies vs soldering process

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

  1. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

    2014-01-01

    Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

  2. Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

    DEFF Research Database (Denmark)

    Domkin, Konstantin; Hattel, Jesper Henri; Thorborg, Jesper

    2009-01-01

    of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling. solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft....... The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers...

  3. Eddy current quality control of soldered current-carrying busbar splices of superconducting magnets

    CERN Document Server

    Kogan, L; Savary, F; Principe, R; Datskov, V; Rozenfel'd, E; Khudjakov, B

    2015-01-01

    The eddy current technique associated with a U-shaped transducer is studied for the quality control of soldered joints between superconducting busbars ('splices'). Two other quality control techniques, based on X-rays and direct measurement of the electrical resistance, are also studied for comparison. A comparative analysis of the advantages and disadvantages of these three methods in relation to the quality control of soldered superconducting busbar cables enclosed in copper shells is used for benchmarking. The results of inspections with the U-shaped eddy current transducer carried out on several sample joints presenting different types of soldering defects show the potential of this type of nondestructive (ND) quality control technique.

  4. Influence of aging treatment on deformation behavior of 96.5Sn3.5Ag lead-free solder alloy during in situ tensile tests

    International Nuclear Information System (INIS)

    Ding, Ying; Wang, Chunqing; Tian, Yanhong; Li, Mingyu

    2007-01-01

    This study investigates the influence of aging treatment on deformation behavior of 96.5Sn3.5Ag eutectic solder alloys with lower strain rate ( -3 s -1 ) during tensile tests under the scanning electron microscope. Results showed that because of the existence of Ag 3 Sn intermetallic particles and the special microstructure of β-Sn phases in Sn3.5Ag solder, grain boundary sliding was not the dominant mechanism any longer for this Pb-free solder. While the interaction of dislocations with the relatively rigid Ag 3 Sn particles began to dominate. For the as-cast specimen, accompanied by partial intragranular cracks, intergranular fracture along the grain boundaries in Sn-Ag eutectic structure or the interphase boundaries between Sn-rich dendrites and Sn-Ag eutectic phases occurred primarily in early tensile stage. However, the boundary behavior was limited by the large Ag 3 Sn particles presented along the Sn-rich dendrites boundaries after aging. Plastic flow was observed in large area, and cracks propagated in a transgranular manner across the Sn-dendrites and Sn-Ag eutectic structure

  5. Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu

    Science.gov (United States)

    Lee, Hwa-Teng; Huang, Kuo-Chen

    2016-12-01

    Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

  6. A review on solder reflow and flux application for flip chip

    Science.gov (United States)

    Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Visvanathan, Susthitha Menon; Retnasamy, Vithyacharan

    2017-09-01

    This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

  7. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    Science.gov (United States)

    Rolin, T. D.; Hodge, R. E.

    2008-01-01

    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  8. Laser welding of vas deferens in rodents: initial experience with fluid solders.

    Science.gov (United States)

    Trickett, R I; Wang, D; Maitz, P; Lanzetta, M; Owen, E R

    1998-01-01

    This study evaluates the use of sutureless laser welding for vasovasostomy. In 14 rodents, the left vas deferens underwent vasovasostomy using an albumin-based solder applied to the adventitia of the vas deferens. The solder contained the dye, indocyanine green, to allow selective absorption and denaturation by a fiber-coupled 800-nm diode laser. The right vas deferens served as a control, receiving conventional layered microsurgical repair. We used a removable 4/0 nylon stent and microclamps to appose the vas deferens during repair, with no need for stay sutures. The mean time to perform laser solder repair (23.5 min) and conventional repair (23.3 min) were not significantly different (P=0.91). However, examination after 8 weeks showed that granuloma formation (G) and patency (P) rates for the conventional suture technique (G, 14%; P, 93%) were significantly better than observed for the laser solder technique (G, 57%; P, 50%).

  9. Effects of rework on adhesion of Pb-In soldered gold thick films

    International Nuclear Information System (INIS)

    Gehman, R.W.; Becka, G.A.; Losure, J.A.

    1982-02-01

    The feasibility of repeatedly reworking Pb-In soldered joints on gold thick films was evaluated. Nailhead adhesion tests on soldered thick films typically resulted in failure within the bulk solder (50 In-50 Pb). Average strengths increased with each rework, and the failure mode changed. An increase in metalization lift-off occurred with successive reworks. An investigation was initiated to determine why these changes occurred. Based on this work, the thick film adhesion to the substrate appeared to be lowered by indium reduction of cadmium oxide and by formation of a weak, brittle intermetallic compound, Au 9 In 4 . It was concluded that two solder reworks could be conducted without significant amounts of metallization lift-off during nailhead testing

  10. Nanoscale Soldering of Positioned Carbon Nanotubes using Highly Conductive Electron Beam Induced Gold Deposition

    DEFF Research Database (Denmark)

    Madsen, Dorte Nørgaard; Mølhave, Kristian; Mateiu, Ramona Valentina

    2003-01-01

    We have developed an in-situ method for controlled positioning of carbon nanotubes followed by highly conductive contacting of the nanotubes, using electron beam assisted deposition of gold. The positioning and soldering process takes place inside an Environmental Scanning Electron Microscope (E...... in a carbon matrix. Nanoscale soldering of multi-walled carbon nanotubes (MWNT) onto microelectrodes was achieved by deposition of a conducting gold line across a contact point between nanotube and electrode. The solderings were found to be mechanically stronger than the carbon nanotubes. We have positioned...... MWNTs to bridge the gap between two electrodes, and formed soldering bonds between the tube and each of the electrodes. All nanotube bridges showed ohmic resistances in the range 10-30 kΩ. We observed no increase in resistance after exposing the MWNT bridge to air for days....

  11. Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

    Science.gov (United States)

    Hasnine, M.; Tolla, B.; Vahora, N.

    2018-04-01

    This paper explores the effects of aging on the mechanical behavior, microstructure evolution and IMC formation on different surface finishes of two high temperature solders, Sn-5 wt.% Ag and Sn-5 wt.% Sb. High temperature aging showed significant degradation of Sn-5 wt.% Ag solder hardness (34%) while aging has little effect on Sn-5 wt.% Sb solder. Sn-5 wt.% Ag experienced rapid grain growth as well as the coarsening of particles during aging. Sn-5 wt.% Sb showed a stable microstructure due to solid solution strengthening and the stable nature of SnSb precipitates. The increase of intermetallic compound (IMC) thickness during aging follows a parabolic relationship with time. Regression analysis (time exponent, n) indicated that IMC growth kinetics is controlled by a diffusion mechanism. The results have important implications in the selection of high temperature solders used in high temperature applications.

  12. The creep behavior of In-Ag eutectic solder joints

    International Nuclear Information System (INIS)

    Reynolds, H.L.; Kang, S.H.; Morris, J.W. Jr.; Univ. of California, Berkeley, CA

    1999-01-01

    The addition of 3 wt.% Ag to In results in a eutectic composition with improved mechanical properties while only slightly lowering the melting temperature. Steady-state creep properties of In-Ag eutectic solder joints have been measured using constant load tests at 0, 30, 60, and 90 C. Constitutive equations are derived to describe the creep behavior. The data are well represented by an equation of the form proposed by Dorn: a power-law equation applies to each independent creep mechanism. Two parallel mechanisms were observed for the In-Ag eutectic joints. The high-stress mechanism is a bulk mechanism with a thermal dependence dominated by the thermal dependence of creep in the In-rich matrix. The low-stress mechanism is a grain boundary mechanism. Results of this work are discussed with regard to creep behavior of typical eutectic systems

  13. Nanoconstruction by welding individual metallic nanowires together using nanoscale solder

    International Nuclear Information System (INIS)

    Peng, Y; Inkson, B J; Cullis, A G

    2010-01-01

    This work presents a new bottom-up nanowelding technique enabling building blocks to be assembled and welded together into complex 3D nanostructures using nanovolumes of metal solder. The building blocks of gold nanowires, (Co 72 Pt 28 /Pt) n multilayer nanowires, and nanosolder Sn 99 Au 1 alloy nanowires were successfully fabricated by a template technique. Individual metallic nanowires were picked up and assembled together. Conductive nanocircuits were then welded together using similar or dissimilar nanosolder material. At the weld sites, nanoscale volumes of a chosen metal are deposited using nanosolder of a sacrificial nanowire, which ensures that the nanoobjects to be bonded retain their structural integrity. The whole nanowelding process is clean, controllable and reliable, and ensures both mechanically strong and electrically conductive contacts.

  14. Soldered Contact and Current Risetime Effects on Negative Polarity Wire Array Z-pinches

    International Nuclear Information System (INIS)

    Chalenski, D. A.; Kusse, B. R.; Greenly, J. B.; Blesener, I. C.; McBride, R. D.; Hammer, D. A.; Knapp, P. F.

    2009-01-01

    The Cornell University COBRA pulser is a nominal 1 MA machine, capable of driving up to 32 wire cylindrical Z-pinch arrays. COBRA can operate with variable current risetimes ranging from 100 ns to 200 ns (short and long pulse, respectively). Wires are typically strung with a ''press'' contact to the electrode hardware, where the wire is loosely pulled against the hardware and held there to establish electrical contact. The machine is normally negative, but a bolt-on convolute can be used to modify the current path and effectively produce positive polarity operation at the load.Previous research with single wires on a 1-5 kA pulser has shown that soldering the wire, thereby improving the wire/electrode contact, and operating in positive polarity can improve the energy deposition into the wire and enhance wire core expansion. Negative polarity showed no difference. Previous experiments on the negative polarity, 20 MA, 100 ns Z accelerator have shown that improving the contact improved the x-ray yield.Cornell data were collected on 16-wire Aluminum Z-pinch arrays in negative polarity. Experiments were conducted with both short and long current pulses with soldered and no-soldered wire/electrode contacts. The initiation, ablation, implosion and stagnation phases were compared for these four conditions. Time dependent x-ray signals were measured using diodes and diamond detectors. An inductive voltage monitor was used to infer minimum current radius achieved, as defined by a uniform shell of current moving radially inward, producing a time dependent inductance. Total energy data were collected with a metal-strip bolometer. Self-emission data were collected by an XUV 4-frame camera and an optical streak camera.In negative polarity and with short pulses, soldering appeared to produce a smaller radius pinch and decrease variations in the x-ray pulse shape. The bolometer, laser backlighter, 4-frame and streak cameras showed negligible differences in the initiation ablation

  15. Effects of voids on thermal-mechanical reliability of lead-free solder joints

    Directory of Open Access Journals (Sweden)

    Benabou Lahouari

    2014-06-01

    Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

  16. Investigation into mechanical properties of joints of heterogeneous materials brazed with high-temperature solders

    International Nuclear Information System (INIS)

    Lomenko, V.I.; Merkushev, V.P.; Borodina, L.M.; Sycheva, T.S.; Tokhtina, O.A.; Frolov, N.N.

    1988-01-01

    Mechanical properties of copper joints with copper, 12Kh18M10T steel and KhD50 composite obtained by vacuum brazing by copper-titanium solder as compared with properties of joints brazed by PSr 72 and PMFOTsr 6-4-0.03 solders in hydrogen are studied. Dependences of joints strength on temperature of contact - reactive vacuum brazing are obtained. Possible applications of joints of dissimilar materials in electrovacuum devices subjected to the effect of dynamic loadings are established

  17. Dye-enhanced protein solders and patches in laser-assisted tissue welding.

    Science.gov (United States)

    Small, W; Heredia, N J; Maitland, D J; Da Silva, L B; Matthews, D L

    1997-01-01

    This study examines the use of dye-enhanced protein bonding agents in 805 nm diode laser-assisted tissue welding. A comparison of an albumin liquid solder and collagen solid-matrix patches used to repair arteriotomies in an in vitro porcine model is presented. Extrinsic bonding media in the form of solders and patches have been used to enhance the practice of laser tissue welding. Preferential absorption of the laser wavelength has been achieved by the incorporation of chromophores. Both the solder and the patch included indocyanine green dye (ICG) to absorb the 805 nm continuous-wave diode laser light used to perform the welds. Solder-mediated welds were divided into two groups (high power/short exposure and low power/long exposure), and the patches were divided into three thickness groups ranging from 0.1 to 1.3 mm. The power used to activate the patches was constant, but the exposure time was increased with patch thickness. Burst pressure results indicated that solder-mediated and patched welds yielded similar average burst strengths in most cases, but the patches provided a higher success rate (i.e., more often exceeded 150 mmHg) and were more consistent (i.e., smaller standard deviation) than the solder. The strongest welds were obtained using 1.0-1.3 mm thick patches, while the high power/short exposure solder group was the weakest. Though the solder and patches yielded similar acute weld strengths, the solid-matrix patches facilitated the welding process and provided consistently strong welds. The material properties of the extrinsic agents influenced their performance.

  18. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J. [Sandia National Labs., Albuquerque, NM (United States); Burress, R.V. [SEHO (United States)] [and others

    1995-06-01

    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  19. Effect of gamma radiation on micromechanical hardness of lead-free solder joint

    Energy Technology Data Exchange (ETDEWEB)

    Paulus, Wilfred [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Malaysian Nuclear Agency, Bangi, 43000 Kajang, Selangor (Malaysia); Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu [Universiti Kebangsaan Malaysia, Bangi, 43600 Kajang, Selangor (Malaysia); Yusoff, Wan Yusmawati Wan [Universiti Pertahanan Nasional Malaysia, Kem Sg. Besi, 57000 Kuala Lumpur (Malaysia)

    2015-09-25

    Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

  20. Characterization of the microstructure of tin-silver lead free solder

    Energy Technology Data Exchange (ETDEWEB)

    Hurtony, Tamás, E-mail: hurtony@ett.bme.hu [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary); Szakál, Alex; Almásy, László [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Len, Adél [Neutron Spectroscopy Department, Wigner Research Centre for Physics, Budapest (Hungary); Faculty of Engineering and Information Technology, University of Pécs (Hungary); Kugler, Sándor [Department of Theoretical Physics, Budapest University of Technology and Economics (Hungary); Bonyár, Attila; Gordon, Péter [Department of Electronics Technology, Budapest University of Technology and Economics, Egry József utca 18, Budapest, H-1111 (Hungary)

    2016-07-05

    Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag{sub 3}Sn phases.

  1. A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

    Science.gov (United States)

    Wei, Helin; Wang, Kuisheng

    2011-11-01

    Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

  2. A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

    Directory of Open Access Journals (Sweden)

    Enrico Mick

    2015-07-01

    Full Text Available Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm made of alumina toughened zirconia (ATZ, as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM and energy-dispersive X-ray (EDX analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

  3. The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints.

    Science.gov (United States)

    Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

    2015-12-01

    Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (ptensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint.

  4. Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

    International Nuclear Information System (INIS)

    Durairaj, R.; Ramesh, S.; Mallik, S.; Seman, A.; Ekere, N.

    2009-01-01

    Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G') is higher than the liquid characteristic (G'') for the pastes material. In addition, the results from the study showed that the solder paste with a large G' = G'' has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (δ) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.

  5. Study on interfacial reaction between lead-free solders and alternative surface finishes

    International Nuclear Information System (INIS)

    Siti Rabiatul Aisha; Ourdjini, A.; Saliza Osman

    2007-01-01

    This study investigates the interfacial reactions occurring during reflow soldering between Sn-Ag-Cu lead-free solder and two surface finishes: electroless nickel/ immersion gold (ENIG) and immersion silver (IAg). The study focuses on interfacial reactions evolution and growth kinetics of intermetallic compounds (IMC) formed during soldering and isothermal ageing at 150 degree Celsius for up to 2000 hours. Optical and scanning electron microscopy were used to measure IMC thickness and examine the morphology of IMC respectively, whereas the IMC phases were identified by energy dispersive X-ray analysis (EDX). The results showed that the IMC formed on ENIG finish is thinner compared to that formed on IAg finish. For IAg surface finish, Cu 6 Sn 5 IMCs with scallop morphology are formed at the solder/ surface finish interface after reflow while a second IMC, Cu 3 Sn was formed between the copper and Cu 6 Sn 5 IMC after the isothermal ageing treatment. For ENIG surface finish both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 are formed after soldering. Isothermal aging of the solder joints formed on ENIG finish was found to have a significant effect on the morphology of the intermetallics by transforming to more spherical and denser morphology in addition to increase i their thickness with increased ageing time. (author)

  6. Comparative shear tests of some low temperature lead-free solder pastes

    Science.gov (United States)

    Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

    2016-12-01

    The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

  7. Investigation on solder joint strength of nickel tin-plated and CRS tabs with PCB

    International Nuclear Information System (INIS)

    Luay Hussain

    2002-01-01

    Failure analysis on easily peels off Nickel and CRS steel tabs from PCB was carried out. Nickel Tin plated tabs, CRS steel tabs and tube were joined to the PCB using reflow/ convection soldering, in an oven. The solder paste composition is Sn36/Pb35/Ag2. Peel test was conducted and it was found that many tabs could be easily peeled off with low force. Porosities which varies from 0.4 mm to < 0.01mm in diameter, developed during soldering process and solidification was noted. It was found, the number, size and position of these porosities inside the solder layer on both parts of the tabs affect the peel strength. Scanning Electron Microscopy study and EDX analysis were carried out. It was found that the low peel strength values were due to the combination of generation and development of porosities during soldering process which act as stress concentrators and the evolution (growth) of eutectic Sn/Pb and Sn/Ni/Cu brittle grainy phase. Large eutectic microstructure with brittle Sn-Ni-Cu grainy phase enhances the failure with low peeling forces. Sample showing no feature of Sn/Ni/Cu grain gave high peeling strength value. Solder reflow, an important process, can result in strength enhancement (if it was controlled for example in a furnace). (Author)

  8. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    Directory of Open Access Journals (Sweden)

    Lei Sun

    2015-01-01

    Full Text Available SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

  9. An evaluation of the lap-shear test for Sn-rich solder/Cu couples: Experiments and simulation

    Science.gov (United States)

    Chawla, N.; Shen, Y.-L.; Deng, X.; Ege, E. S.

    2004-12-01

    The lap-shear technique is commonly used to evaluate the shear, creep, and thermal fatigue behavior of solder joints. We have conducted a parametric experimental and modeling study, on the effect of testing and geometrical parameters on solder/copper joint response in lap-shear. It was shown that the farfield applied strain is quite different from the actual solder strain (measured optically). Subtraction of the deformation of the Cu substrate provides a reasonable approximation of the solder strain in the elastic regime, but not in the plastic regime. Solder joint thickness has a profound effect on joint response. The solder response moves progressively closer to “true” shear response with increasing joint thickness. Numerical modeling using finite-element analyses were performed to rationalize the experimental findings. The same lap-shear configuration was used in the simulation. The input response for solder was based on the experimental tensile test result on bulk specimens. The calculated shear response, using both the commonly adopted far-field measure and the actual shear strain in solder, was found to be consistent with the trends observed in the lap-shear experiments. The geometric features were further explored to provide physical insight into the problem. Deformation of the substrate was found to greatly influence the shear behavior of the solder.

  10. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

    OpenAIRE

    Sun, Lei; Zhang, Liang

    2015-01-01

    SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparti...

  11. Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy

    Science.gov (United States)

    Tikale, Sanjay; Prabhu, K. Narayan

    2018-05-01

    The effect of Al2O3 nanoparticles reinforcement on melting behavior, microstructure evolution at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al2O3 nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature (T L) and melting temperature range of the SAC305 solder alloy by addition of Al2O3 nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al2O3 nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu6Sn5 IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy.

  12. Energy and intensity distributions of 0.279 MeV multiply Compton-scattered photons in soldering material

    International Nuclear Information System (INIS)

    Singh, Manpreet; Singh, Gurvinderjit; Singh, Bhajan; Sandhu, B.S.

    2007-01-01

    An inverse response matrix converts the observed pulse-height distribution of a NaI(Tl) scintillation detector to a photon spectrum. This also results in extraction of intensity distribution of multiply scattered events originating from interactions of 0.279 MeV photons with thick targets of soldering material. The observed pulse-height distributions are a composite of singly and multiply scattered events in addition to bremmstrahlung-and Rayleigh-scattered events. To evaluate the contribution of multiply scattered events, the spectrum of singly scattered events contributing to inelastic Compton peak is reconstructed analytically. The optimum thickness (saturation depth), at which the number of multiply scattered events saturates, has been measured. Monte Carlo calculations also support the present results

  13. How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

    Science.gov (United States)

    Suhir, E.; Yi, S.; Ghaffarian, R.

    2017-03-01

    It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

  14. Effect of gap distance on tensile strength of preceramic base metal solder joints.

    Science.gov (United States)

    Fattahi, Farnaz; Motamedi, Milad

    2011-01-01

    In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. Based on ADA/ISO 9693 specifications for tensile test, 40 specimens were fabricated from a Ni-Cr alloy and cut at the midpoint of 3-mm diameter bar and placed at desired positions by a specially designed device. The specimens were divided into four groups of 10 samples according to the desired solder gap distance: Group1: 0.1mm; Group2: 0.25mm; Group3: 0.5mm; and Group4: 0.75mm. After soldering, specimens were tested for tensile strength by a universal testing machine at a cross-head speed of 0.5mm/min with a preload of 10N. The mean tensile strength values of the groups were 162, 307.8, 206.1 and 336.7 MPa, respectively. The group with 0.75-mm gap had the highest and the group with 0.1-mm gap had the lowest tensile strength. Bonferroni test showed that Group1 and Group4 had statistically different values (P=0.023), but the differences between other groups were not sig-nificant at a significance level of 0.05. There was no direct relationship between increasing soldering gap distance and tensile strength of the solder joints.

  15. The critical oxide thickness for Pb-free reflow soldering on Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Chung, C. Key [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Assembly Test Global Materials, Intel Microelectronics Asia Ltd, B1, No. 205, Tun-Hwa North Road, 10595 Taipei, Taiwan (China); Chen, Y.J.; Li, C.C. [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China); Kao, C.R., E-mail: crkao@ntu.edu.tw [Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei, 10617, Taiwan (China)

    2012-06-01

    Oxidation is an undesirable effect of reflow soldering. Non-wetting occurs when the oxide layer grows above the critical thickness. Characterizing the critical oxide thickness for soldering is challenging due to oxide's nano-scale thickness and irregular topographic surface. In this paper, the critical copper oxide thickness was characterized by Time-of-Flight Secondary Ion Mass Spectrometry, Scanning Electron Microscopy, Energy-Dispersive X-ray spectroscopy, and Transmission Electron Microscopy. Copper substrates were coated with an Organic-Solderable-Preservative (OSP) layer and baked at 150 Degree-Sign C and 85% Relative Humidity for different amounts of time. The onset of the non-wetting phenomenon occurred when the oxide thickness reached 18 {+-} 5 nm. As the oxide grew beyond this critical thickness, the percentage of non-wetting solder joint increased exponentially. The growth of the oxide thickness followed a parabolic rate law. The rate constant of oxidation was 0.6 Multiplication-Sign 10{sup -15} cm{sup 2} min{sup -1}. Oxidation resulted from interdiffusion of copper and oxygen atoms through the OSP and oxide layers. The oxidation mechanism will be presented and discussed. - Highlights: Black-Right-Pointing-Pointer Critical oxide thickness for Pb free solder on Cu substrate is 18 {+-} 5 nm. Black-Right-Pointing-Pointer Above the critical oxide, non-wet solder joint increases exponentially. Black-Right-Pointing-Pointer A maximum 13-nm oxide thickness is suggested for good solder joint. Black-Right-Pointing-Pointer Initial growth of oxide thickness is logarithmic and then parabolic after 12 nm. Black-Right-Pointing-Pointer Thick oxide (360-560 nm) is formed as pores shorten the oxidation path.

  16. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    Science.gov (United States)

    Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

    2016-12-01

    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

  17. Chemical wiring and soldering toward all-molecule electronic circuitry.

    Science.gov (United States)

    Okawa, Yuji; Mandal, Swapan K; Hu, Chunping; Tateyama, Yoshitaka; Goedecker, Stefan; Tsukamoto, Shigeru; Hasegawa, Tsuyoshi; Gimzewski, James K; Aono, Masakazu

    2011-06-01

    Key to single-molecule electronics is connecting functional molecules to each other using conductive nanowires. This involves two issues: how to create conductive nanowires at designated positions, and how to ensure chemical bonding between the nanowires and functional molecules. Here, we present a novel method that solves both issues. Relevant functional molecules are placed on a self-assembled monolayer of diacetylene compound. A probe tip of a scanning tunneling microscope is then positioned on the molecular row of the diacetylene compound to which the functional molecule is adsorbed, and a conductive polydiacetylene nanowire is fabricated by initiating chain polymerization by stimulation with the tip. Since the front edge of chain polymerization necessarily has a reactive chemical species, the created polymer nanowire forms chemical bonding with an encountered molecular element. We name this spontaneous reaction "chemical soldering". First-principles theoretical calculations are used to investigate the structures and electronic properties of the connection. We demonstrate that two conductive polymer nanowires are connected to a single phthalocyanine molecule. A resonant tunneling diode formed by this method is discussed. © 2011 American Chemical Society

  18. Improvement of the auto wire feeder machine in a de-soldering process

    Directory of Open Access Journals (Sweden)

    Niramon Nonkhukhetkhong

    2016-10-01

    Full Text Available This paper presents the methodology of the de-soldering process for rework of disk drive Head Stack Assembly (HSA units. The auto wire feeder is a machine that generates Tin (Sn on the product. This machine was determined to be one of the major sources of excess Sn on the HSA. The defect rate due to excess Sn is more than 30%, which leads to increased processing time and cost to perform additional cleaning steps. From process analysis, the major causes of excess Sn are as follows: 1 The machine cannot cut the wire all the way into the flux core area; 2 The sizes and types of soldering irons are not appropriate for the unit parts; and, 3 There are variations introduced into the de-soldering process by the workforce. This paper proposes a methodology to address all three of these causes. First, the auto wire feeder machine in the de-solder process will be adjusted in order to cut wires into flux core. Second, the types of equipment and material used in de-soldering will be optimized. Finally, a new standard method for operators, which can be controlled more easily, will be developed in order to reduce defects due to workforce related variation. After these process controls and machine adjustments were implemented, the overall Sn related problems were significantly improved. Sn contamination was reduced by 41% and cycle time was reduced by an average of 15 seconds.

  19. Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits

    Energy Technology Data Exchange (ETDEWEB)

    Huang, Y. T.; Hsu, H. H.; Wu, Albert T., E-mail: atwu@ncu.edu.tw [Department of Chemical and Materials Engineering, National Central University, Jhongli City 320, Taiwan (China)

    2014-01-21

    Because of the miniaturization of electronic devices, the reliability of electromigration has become a major concern when shrinking the solder dimensions in flip-chip joints. Fast reaction between solders and electrodes causes intermetallic compounds (IMCs) to form, which grow rapidly and occupy entire joints when solder volumes decrease. In this study, U-grooves were fabricated on Si chips as test vehicles. An electrode-solder-electrode sandwich structure was fabricated by using lithography and electroplating. Gaps exhibiting well-defined dimensions were filled with Sn3.5Ag solders. The gaps between the copper electrodes in the test sample were limited to less than 15 μm to simulate microbumps. The samples were stressed at various current densities at 100 °C, 125 °C, and 150 °C. The morphological changes of the IMCs were observed, and the dimensions of the IMCs were measured to determine the kinetic growth of IMCs. Therefore, this study focused on the influence of back stress caused by microstructural evolution in microbumps.

  20. Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

    Science.gov (United States)

    Teverovsky, Alexander A.

    2014-01-01

    Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

  1. In vitro conjunctival incision repair by temperature-controlled laser soldering.

    Science.gov (United States)

    Norman, Galia; Rabi, Yaron; Assia, Ehud; Katzir, Abraham

    2009-01-01

    The common method of closing conjunctival incisions is by suturing, which is associated with several disadvantages. It requires skill to apply and does not always provide a watertight closure, which is required in some operations (e.g., glaucoma filtration). The purpose of the present study was to evaluate laser soldering as an alternative method for closing conjunctival incisions. Conjunctival incisions of 20 ex vivo porcine eyes were laser soldered using a temperature-controlled fiberoptic laser system and an albumin mixed with indocyanine green as a solder. The control group consisted of five repaired incisions by a 10-0 nylon running suture. The leak pressure of the repaired incisions was measured. The mean leak pressure in the laser-soldered group was 132 mm Hg compared to 4 mm Hg in the sutured group. There was no statistically significant difference in both the incision's length and distance from the limbus between the groups, before and after the procedure, indicating that there was no severe thermal damage. These preliminary results clearly demonstrate that laser soldering may be a useful method for achieving an immediate watertight conjunctival wound closure. This procedure is faster and easier to apply than suturing.

  2. Fundamentals of lead-free solder interconnect technology from microstructures to reliability

    CERN Document Server

    Lee, Tae-Kyu; Kim, Choong-Un; Ma, Hongtao

    2015-01-01

    This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering tech...

  3. Nano-soldering of magnetically aligned three-dimensional nanowire networks

    International Nuclear Information System (INIS)

    Gao Fan; Gu Zhiyong

    2010-01-01

    It is extremely challenging to fabricate 3D integrated nanostructures and hybrid nanoelectronic devices. In this paper, we report a simple and efficient method to simultaneously assemble and solder nanowires into ordered 3D and electrically conductive nanowire networks. Nano-solders such as tin were fabricated onto both ends of multi-segmented nanowires by a template-assisted electrodeposition method. These nanowires were then self-assembled and soldered into large-scale 3D network structures by magnetic field assisted assembly in a liquid medium with a high boiling point. The formation of junctions/interconnects between the nanowires and the scale of the assembly were dependent on the solder reflow temperature and the strength of the magnetic field. The size of the assembled nanowire networks ranged from tens of microns to millimeters. The electrical characteristics of the 3D nanowire networks were measured by regular current-voltage (I-V) measurements using a probe station with micropositioners. Nano-solders, when combined with assembling techniques, can be used to efficiently connect and join nanowires with low contact resistance, which are very well suited for sensor integration as well as nanoelectronic device fabrication.

  4. Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

    International Nuclear Information System (INIS)

    Chellvarajoo, Srivalli; Abdullah, M.Z.; Samsudin, Z.

    2015-01-01

    Highlights: • Fe 2 NiO 4 nanoparticles added into SAC 305 by mechanical mixing to form nanocomposite solder paste. • Nanoparticles in the composite solder travels with flux to the outermost surface after reflow. • The intermetallics compound reduced with the addition of nanoparticles into solder paste. • The hardness increased with the addition of limited percentage of nanoparticles into SAC 305. - Abstract: This study investigates the effects of the addition of Fe 2 NiO 4 nanoparticles into a SAC-305 lead-free solder paste. Iron, nickel, and oxide nano-elements were mixed with Pb-free solder alloying elements to produce a new form of nanocomposite solder paste, which can be a promising material in electronic packaging. The SAC-305 was mechanically added with 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles. The migration of nanoparticles in the nanocomposite solder paste to the outermost surface was clarified using the copper ‘sandwich’ method, which was performed after the reflow soldering process. Varying amounts of nanoparticles in the SAC-305 affected the IMC thickness and mechanical properties of the nanocomposite solder paste. The IMC thickness was reduced by 29.15%, 42.37%, and 59.00% after adding 0.5, 1.5, and 2.5 wt.% of Fe 2 NiO 4 nanoparticles in the SAC-305, respectively. However, via nanoindentation method, the hardness of the nanocomposite solder was improved by 44.07% and 56.82% after adding 0.5 and 1.5 wt.% of Fe 2 NiO 4 nanoparticles, respectively. If the addition of Fe 2 NiO 4 nanoparticle exceeded 1.5 wt.%, the hardness increased infinitely

  5. Reliability of Pb free solder alloys. Physical and mechanical properties; Pb free handa no shinraisei. Butsuri kikaiteki shinraisei

    Energy Technology Data Exchange (ETDEWEB)

    Sanji, M; Yoshino, M; Ishikawa, J; Takenaka, O [Denso Corp., Aichi (Japan)

    1997-10-01

    Properties of 19 different Pb free solders have been evaluated in comparison with Sn-37Pb eutectic solder. Pb free solders without Bi were on the same level as Sn-37Pb in tensile strength and elongation, and those with Bi had higher strength and lower elongation than Sn-37Pb. As the Bi content increased, strength was higher, and elongation was lower. In torsion fatigue tests, fatigue life of Pb free solders without Bi was longer than Sn-37Pb. The relationships of Coffin-Manson rule and Basquin rule with fatigue life was applicable to Pb free solder. Fatigue life of those is inferred from their tensile strength. 7 refs., 13 figs., 1 tab.

  6. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    International Nuclear Information System (INIS)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-01-01

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines

  7. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    Energy Technology Data Exchange (ETDEWEB)

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-10-31

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

  8. Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

    Energy Technology Data Exchange (ETDEWEB)

    Wolfe, Larry

    2009-04-22

    Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.

  9. Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution

    Science.gov (United States)

    Nordarina, J.; Mohd, H. Z.; Ahmad, A. M.; Muhammad, F. M. N.

    2018-03-01

    The corrosion properties of Sn-9(5Al-Zn), Sn-Cu and SAC305 were studied via potentiodynamic polarization method in an acidic solution of 1 M hydrochloric acid (HCl). Sn-9(5Al-Zn) produced different polarization profile compared with Sn-Cu and SAC305. The morphological analysis showed that small, deep grooves shaped of corrosion product formed on top of Sn-9(5Al-Zn) solder while two distinctive structures of closely packed and loosely packed corrosion product formed on top of Sn-Cu and SAC305 solder alloys. Phase analysis revealed the formations of various corrosion products such as SnO and SnO2 mainly dominant on surface of solder alloys after potentiodynamic polarization in 1 M hydrochloric acid (HCl).

  10. Au-Ge based Candidate Alloys for High-Temperature Lead-Free Solder Alternatives

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure and microhard......Au-Ge based candidate alloys have been proposed as an alternative to high-lead content solders that are currently being used for high-temperature applications. The influence of the low melting point metals namely In, Sb and Sn to the Au-Ge eutectic with respect to the microstructure...... was primarily strengthened by the refined (Ge) dispersed phase. The distribution of phases played a relatively more crucial role in determining the ductility of the bulk solder alloy. In the present work it was found that among the low melting point metals, the addition of Sb to the Au-Ge eutectic would...

  11. Instantaneous fluxless bonding of Au with Pb-Sn solder in ambient atmosphere

    International Nuclear Information System (INIS)

    Lee, T.K.; Zhang, Sam; Wong, C.C.; Tan, A.C.

    2005-01-01

    A fluxless bonding technique has been developed as a method of flip-chip bonding for microelectronic packaging. The fluxless bonding technique can be achieved instantaneously in an ambient environment between metallic stud bumps and predefined molten solder. This paper describes the mechanics of the bonding action and verifies the effectiveness of this bonding method through wetting balance tests and scanning electron microscope and energy dispersive x-ray analysis. This technique has been demonstrated by using a gold stud bump to break the tin oxide layer over molten solder. This allows for a fast, solid liquid interdiffusion between gold (Au) and the fresh molten eutectic lead-tin (Pb-Sn) solder for joint formation during solidification. This bonding method has been successfully tested with 130-μm-pitch flip-chip bond pads on a joint-in-via flex substrate architecture

  12. Dissolution ad uptake of cadmium from dental gold solder alloy implants

    International Nuclear Information System (INIS)

    Bergman, B.; Bergman, M.; Soeremark, R.

    1977-01-01

    Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium ( 115 Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of 115 Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver. (author)

  13. SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

    Directory of Open Access Journals (Sweden)

    D. Heinemann

    2016-06-01

    Full Text Available Printed Circuit Boards (PCB play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

  14. Comparison of implant-abutment interface misfits after casting and soldering procedures.

    Science.gov (United States)

    Neves, Flávio Domingues das; Elias, Gisele Araújo; da Silva-Neto, João Paulo; de Medeiros Dantas, Lucas Costa; da Mota, Adérito Soares; Neto, Alfredo Júlio Fernandes

    2014-04-01

    The aim of this study was to compare vertical and horizontal adjustments of castable abutments after conducting casting and soldering procedures. Twelve external hexagonal implants (3.75 × 10 mm) and their UCLA abutments were divided according their manufacturer and abutment type: PUN (plastic UCLA, Neodent), PUC (plastic UCLA, Conexão), PU3i (plastic UCLA, Biomet 3i), and PUTN (plastic UCLA with Tilite milled base, Neodent). Three infrastructures of a fixed partial implant-supported bridge with 3 elements were produced for each group. The measurements of vertical (VM) and horizontal (HM) misfits were obtained via scanning electron microscopy after completion of casting and soldering. The corresponding values were determined to be biomechanically acceptable to the system, and the results were rated as a percentage. Statistical analysis establishes differences between groups by chi-square after procedures, and McNeman's test was applied to analyze the influence of soldering over casting (α ≤ .05). For the values of VM and HM, respectively, when the casting process was complete, it was observed that 83.25% and 100% (PUTN), 33.3% and 27.75% (PUN), 33.3% and 88.8% (PUC), 33.3% and 94.35% (PU3i) represented acceptable values. After completing the requisite soldering, acceptable values were 50% and 94.35% (PUTN), 16.6% and 77.7% (PUN), 38.55% and 77.7% (PUC), and 27.75% and 94.35% (PU3i). Within the limitations of this study, it can be concluded that the premachined abutments presented more acceptable VM values. The HM values were within acceptable limits before and after the soldering procedure for most groups. Further, the soldering procedure resulted in an increase of VM in all groups.

  15. In-vitro Investigations of Skin Closure using Diode Laser and Protein Solder Containing Gold Nanoshells

    Directory of Open Access Journals (Sweden)

    Mohammad Sadegh Nourbakhsh

    2010-12-01

    Full Text Available Introduction: Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nanoshells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nanoshells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nanoshells were prepared. A full thickness incision of 2×20 mm2 was made on the surface and after placing 50 μl of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns, and scan velocity (Vs were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nanoshell concentrations. In addition, at constant laser irradiance (I, the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to st = 1610 g/cm2 at I ~ 60 Wcm-2, T ~ 65ºC, Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nanoshells can be used as an indocyanine green dye (ICG alterative for laser tissue soldering.  Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

  16. Mechanical performances of lead-free solder joint connections with applications in the aerospace domain

    Directory of Open Access Journals (Sweden)

    Georgiana PADURARU

    2016-03-01

    Full Text Available The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of solder joint in correlation with different pad finishes, there were made some mechanical determinations using a dedicated Share Test System. The theoretical model highlights the link between the experimental results and the influence of gravitational acceleration on the mechanical and functional integrity of the electronic assemblies that works in vibration environment. The paper novelty is provided by the interdisciplinary experiment that offers results that can be used in the mechanical, tribological, electronical and aerospace domains.

  17. A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2009-01-01

    An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing the equilib......An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing...

  18. A review of typical thermal fatigue failure models for solder joints of electronic components

    Science.gov (United States)

    Li, Xiaoyan; Sun, Ruifeng; Wang, Yongdong

    2017-09-01

    For electronic components, cyclic plastic strain makes it easier to accumulate fatigue damage than elastic strain. When the solder joints undertake thermal expansion or cold contraction, different thermal strain of the electronic component and its corresponding substrate is caused by the different coefficient of thermal expansion of the electronic component and its corresponding substrate, leading to the phenomenon of stress concentration. So repeatedly, cracks began to sprout and gradually extend [1]. In this paper, the typical thermal fatigue failure models of solder joints of electronic components are classified and the methods of obtaining the parameters in the model are summarized based on domestic and foreign literature research.

  19. Physics of Failure as a Basis for Solder Elements Reliability Assessment in Wind Turbines

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    description of the reliability. A physics of failure approach is applied. A SnAg solder component used in power electronics is used as an example. Crack propagation in the SnAg solder is modeled and a model to assess the accumulated plastic strain is proposed based on a physics of failure approach. Based...... on the proposed model it is described how to find the accumulated linear damage and reliability levels for a given temperature loading profile. Using structural reliability methods the reliability levels of the electrical components are assessed by introducing scale factors for stresses....

  20. Aging treatment characteristics of solder bump joint for high reliability optical module

    International Nuclear Information System (INIS)

    Kim, Kyung-Seob; Yu, Chung-Hee; Yang, Jun-Mo

    2004-01-01

    The joint strength and fracture surfaces of Sn-37 mass% Pb and Au stud bumps for photo diode packages after isothermal aging testing were studied experimentally. Al/Au stud bumps and Cu/Sn-37 mass% Pb solders were adopted, and aged for up to 900 h to analyze the effect of intermetallic compound (IMC). The joint strength decreased with aging time. The diffraction patterns of Cu 6 Sn 5 , scallop-shaped IMCs, and planar-shaped Cu 3 Sn were characterized using transmission electron microscopy (TEM). The formation of Kirkendall voids and the growth of IMCs at the solder were found to be a possible mechanism for joint strength reduction

  1. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates

    International Nuclear Information System (INIS)

    Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

    2008-01-01

    The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in

  2. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates.

    Energy Technology Data Exchange (ETDEWEB)

    Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

    2008-09-01

    The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in

  3. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    Science.gov (United States)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. PMID:27877786

  4. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

    International Nuclear Information System (INIS)

    Ting Tan, Ai; Wen Tan, Ai; Yusof, Farazila

    2015-01-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided. (review)

  5. Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Wang Fengjiang [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States); O' Keefe, Matthew [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)], E-mail: mjokeefe@mst.edu; Brinkmeyer, Brandon [Department of Materials Science and Engineering and Materials Research Center, Missouri University of Science and Technology, Rolla, MO 65401 (United States)

    2009-05-27

    The effect of incorporating eutectic Sn-Pb solder with Sn-3.0Ag-0.5Cu (SAC) Pb-free solder on the microstructure and tensile properties of the mixed alloys was investigated. Alloys containing 100, 75, 50, 25, 20, 15, 10, 5 and 0 wt% SAC, with the balance being Sn-37Pb eutectic solder alloy, were prepared and characterized. Optical and scanning electron microscopy were used to analyze the microstructures while 'mini-tensile' test specimens were fabricated and tested to determine mechanical properties at the mm length scale, more closely matching that of the solder joints. Microstructural analysis indicated that a Pb-rich phase formed and was uniformly distributed at the boundary between the Sn-rich grains or between the Sn-rich and the intermetallic compounds in the solder. Tensile results showed that mixing of the alloys resulted in an increase in both the yield and the ultimate tensile strength compared to the original solders, with the 50% SAC-50% Sn-Pb mixture having the highest measured strength. Initial investigations indicate the formation and distribution of a Pb-rich phase in the mixed solder alloys as the source of the strengthening mechanism.

  6. Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

    Science.gov (United States)

    Hammad, A. E.; El-Taher, A. M.

    2014-11-01

    The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) inside the β-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni)6Sn5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)- and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

  7. Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

    Science.gov (United States)

    Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R.

    2014-01-01

    A fracture mechanism map (FMM) is a powerful tool which correlates the fracture behavior of a material to its microstructural characteristics in an explicit and convenient way. In the FMM for solder joints, an effective thickness of the interfacial intermetallic compound (IMC) layer ( t eff) and the solder yield strength ( σ ys,eff) are used as abscissa and ordinate axes, respectively, as these two predominantly affect the fracture behavior of solder joints. Earlier, a definition of t eff, based on the uniform thickness of IMC ( t u) and the average height of the IMC scallops ( t s), was proposed and shown to aptly explain the fracture behavior of solder joints on Cu. This paper presents a more general definition of t eff that is more widely applicable to a range of metallizations, including Cu and electroless nickel immersion gold (ENIG). Using this new definition of t eff, mode I FMM for SAC387/Cu joints has been updated and its validity was confirmed. A preliminary FMM for SAC387/Cu joints with ENIG metallization is also presented.

  8. The thermodynamic database COST MP0602 for materials for high-temperature lead-free soldering

    Czech Academy of Sciences Publication Activity Database

    Kroupa, Aleš; Dinsdale, A.; Watson, A.; Vřešťál, J.; Zemanová, Adéla; Brož, P.

    2012-01-01

    Roč. 48, č. 3 (2012), s. 339-346 ISSN 1450-5339 R&D Projects: GA MŠk LD11024 Institutional support: RVO:68081723 Keywords : CALPHAD method * lead-free solders * thermodynamic database Subject RIV: BJ - Thermodynamics Impact factor: 1.435, year: 2012

  9. Circuit reliability boosted by soldering pins of disconnect plugs to sockets

    Science.gov (United States)

    Pierce, W. B.

    1964-01-01

    Where disconnect pins must be used for wiring and testing a circuit, improved system reliability is obtained by making a permanent joint between pins and sockets of the disconnect plug. After the circuit has been tested, contact points may be fused through soldering, brazing, or welding.

  10. Maintaining Low Voiding Solder Die Attach for Power Die While Minimizing Die Tilt

    Energy Technology Data Exchange (ETDEWEB)

    Hamm, Randy; Peterson, Kenneth A.

    2015-10-01

    This paper addresses work to minimize voiding and die tilt in solder attachment of a large power die, measuring 9.0 mm X 6.5 mm X 0.1 mm (0.354” x 0.256” x 0.004”), to a heat spreader. As demands for larger high power die continue, minimizing voiding and die tilt is of interest for improved die functionality, yield, manufacturability, and reliability. High-power die generate considerable heat, which is important to dissipate effectively through control of voiding under high thermal load areas of the die while maintaining a consistent bondline (minimizing die tilt). Voiding was measured using acoustic imaging and die tilt was measured using two different optical measurement systems. 80Au-20Sn solder reflow was achieved using a batch vacuum solder system with optimized fixturing. Minimizing die tilt proved to be the more difficult of the two product requirements to meet. Process development variables included tooling, weight and solder preform thickness.

  11. Fatigue damage modeling in solder interconnects using a cohesive zone approach

    NARCIS (Netherlands)

    Abdul-Baqi, A.J.J.; Schreurs, P.J.G.; Geers, M.G.D.

    2005-01-01

    The objective of this work is to model the fatigue damage process in a solder bump subjected to cyclic loading conditions. Fatigue damage is simulated using the cohesive zone methodology. Damage is assumed to occur at interfaces modeled through cohesive zones in the material, while the bulk material

  12. Microstructural and mechanical properties analysis of extruded Sn–0.7Cu solder alloy

    Directory of Open Access Journals (Sweden)

    Abdoul-Aziz Bogno

    2015-01-01

    Full Text Available The properties and performance of lead-free solder alloys such as fluidity and wettability are defined by the alloy composition and solidification microstructure. Rapid solidification of metallic alloys is known to result in refined microstructures with reduced microsegregation and improved mechanical properties of the final products as compared to normal castings. The rapidly solidified Sn-based solders by melt spinning were shown to be suitable for soldering with low temperature and short soldering duration. In the present study, rapidly solidified Sn–0.7 wt.%Cu droplets generated by impulse atomization (IA were achieved as well as directional solidification under transient conditions at lower cooling rate. This paper reports on a comparative study of the rapidly solidified and the directionally solidified samples. Different but complementary characterization techniques were used to fully analyze the solidification microstructures of the samples obtained under the two cooling regimes. These include X-ray diffractometry (XRD and scanning electron microscopy (SEM. In order to compare the tensile strength and elongation to fracture of the directionally solidified ingot and strip castings with the atomized droplet, compaction and extrusion of the latter were carried out. It was shown that more balanced and superior tensile mechanical properties are available for the hot extruded samples from compacted as-atomized Sn–0.7 wt.%Cu droplets. Further, elongation-to-fracture was 2–3× higher than that obtained for the directionally solidified samples.

  13. Development of high melting point, environmentally friendly solders, using the calphad approach

    DEFF Research Database (Denmark)

    Chidambaram, Vivek; Hald, John; Hattel, Jesper Henri

    2008-01-01

    An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Vario...... tension have also been considered. Special focus has been given to toxicity related issues since the main ideology of looking for an alternative to high lead containing solders is not related to technical issues but due to environmental concerns.......An attempt has been made using the CALPHAD approach via Thermo-Calc to explore the various possible chemical compositions that adhere to the melting criterion i.e. 270-350 degrees C, required to replace the traditionally used high lead content solders for first level packaging applications. Various...... of promising solder alloy candidates. The ternary combinations that satisfied the primary solidification requirement were scrutinized taking into account the commercial interests i.e. availability, cost-effectiveness, recyclability and toxicity issues. Technical issues like manufacturability and surface...

  14. Electrochemical migration of lead-free solder alloys in Na2SO4 environment

    DEFF Research Database (Denmark)

    Medgyes, Balint; Ádám, Sándor; Tar, Lajos

    2017-01-01

    The effect of sulphate ion concentration on electrochemical migration of lead-free solder alloys was investigated with the use of water drop tests, by applying an in-situ optical and electrical inspection system. According to the Mean-Time-To-Failure (MTTF) values it was found that in the case of...

  15. Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

    Directory of Open Access Journals (Sweden)

    Shoudong Gu

    2016-06-01

    Full Text Available To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 μm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within ±3%.

  16. Characterizing performances of solder paste printing process at flexible manufacturing lines

    International Nuclear Information System (INIS)

    Siew, Jit Ping; Low, Heng Chin; Teoh, Ping Chow

    2015-01-01

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter

  17. Characterizing performances of solder paste printing process at flexible manufacturing lines

    Energy Technology Data Exchange (ETDEWEB)

    Siew, Jit Ping; Low, Heng Chin [University of Science Malaysia, 11800 Minden, Penang (Malaysia); Teoh, Ping Chow [Wawasan Open University, 54 Jalan Sultan Ahmad Shah, 10050 Penang (Malaysia)

    2015-02-03

    Solder paste printing (SPP) has been a challenge on printed circuit board (PCB) manufacturing, evident by the proliferation of solder paste inspection equipment, or substituted by rigorous non-value added activity of manual inspections. The objective of this study is to characterize the SPP performance of various products manufactured in flexible production lines with different equipment configurations, and determine areas for process improvement. The study began by collecting information on SPP performance relative to component placement (CP) process, and to the proportion of mixed products. Using a clustering algorithm to group similar elements together, SPP performance across all product-production line pairs are statistically modeled to discover the trend and the influential factors. The main findings are: (a) Ratio of overall dpku for CP and SPP processes are 2:1; (b) logistic regression models of SPP performance indicated that only effects of product-production line and solder paste printer configuration are significant; (c) PCB circuitry design with BGA components and single solder paste printer line configurations generated the highest monthly defects, with the highest variation in the latter.

  18. Hypospadias repair using laser tissue soldering (LTS): preliminary results of a prospective randomized study

    Science.gov (United States)

    Kirsch, Andrew J.; Cooper, Christopher S.; Canning, Douglas A.; Snyder, Howard M., III; Zderic, Stephen A.

    1998-07-01

    Purpose: The purpose of this study was to evaluate laser tissue soldering using an 808 nm diode laser and wavelength- matched human albumin solder for urethral surgery in children. Methods: Currently, 30 boys, ages 3 months to 8 years were randomized to standard suturing (n equals 22) or 'sutureless' laser hypospadias repair (n equals 18). Laser soldering was performed with a human albumin solder doped with indocyanine green dye (2.5 mg/ml) using a laser power output of 0.5 W, pulse duration of 0.5 sec, and interval of 0.1 sec. Power density was approximately 16 W/cm2. In the laser group, sutures were used for tissue alignment only. At the time of surgery, neourethral and penile lengths, operative time for urethral repair, and number of sutures/throws were measured. Postoperatively, patients were examined for complications of wound healing, stricture, or fistula formation. Results: Mean age, severity of urethral defect, type of repair, and neourethra length were equivalent between the two groups. Operative time was significantly faster for laser soldering in both simple (1.6 plus or minus 0.21 min, p less than 0.001) and complex (5.4 plus or minus 0.28 min, p less than 0.0001) hypospadias repairs compared to controls (10.6 plus or minus 1.4 min and 27.8 plus or minus 2.9 min, respectively). The mean number of sutures used in the laser group for simple and complex repairs (3.3 plus or minus 0.3 and 8.1 plus or minus 0.64, respectively) were significantly (p less than 0.0001) less than for controls (8.2 plus or minus 0.84 and 20 plus or minus 2.3, respectively). Followup was between 3 months and 14 months. The overall complication rate in the laser group (11%) was lower than the controls (23%). However, statistical significance (p less than 0.05) was achieved only for the subgroup of patients undergoing simple repairs (LTS, 100% success versus suturing, 69% success). Conclusions: These preliminary results indicate that laser tissue soldering for hypospadias repair

  19. Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

    DEFF Research Database (Denmark)

    Conseil, Helene; Verdingovas, Vadimas; Jellesen, Morten Stendahl

    2016-01-01

    No-clean flux systems are used today for the soldering of electronic printed circuit board assemblies assuming that all the aggressive substances of the flux will vanish during the soldering process i.e. evaporate, decompose or being enclosed safely in the residues. However this is not true in most...... that the fluxes do not decompose fully within the temperature regime of the soldering process, leaving behind significant level of weak organic acid residues. The residue depending on the type and amount can be can be very aggressive towards the corrosion on the printed circuit board assemblies. The glutaric acid...

  20. Laser solder welding of articular cartilage: tensile strength and chondrocyte viability.

    Science.gov (United States)

    Züger, B J; Ott, B; Mainil-Varlet, P; Schaffner, T; Clémence, J F; Weber, H P; Frenz, M

    2001-01-01

    The surgical treatment of full-thickness cartilage defects in the knee joint remains a therapeutic challenge. Recently, new techniques for articular cartilage transplantation, such as mosaicplasty, have become available for cartilage repair. The long-term success of these techniques, however, depends not only on the chondrocyte viability but also on a lateral integration of the implant. The goal of this study was to evaluate the feasibility of cartilage welding by using albumin solder that was dye-enhanced to allow coagulation with 808-nm laser diode irradiation. Conventional histology of light microscopy was compared with a viability staining to precisely determine the extent of thermal damage after laser welding. Indocyanine green (ICG) enhanced albumin solder (25% albumin, 0.5% HA, 0.1% ICG) was used for articular cartilage welding. For coagulation, the solder was irradiated through the cartilage implant by 808-nm laser light and the tensile strength of the weld was measured. Viability staining revealed a thermal damage of typically 500 m in depth at an irradiance of approximately 10 W/cm(2) for 8 seconds, whereas conventional histologies showed only half of the extent found by the viability test. Heat-bath investigations revealed a threshold temperature of minimum 54 degrees C for thermal damage of chondrocytes. Efficient cartilage bonding was obtained by using bovine albumin solder as adhesive. Maximum tensile strength of more than 10 N/cm(2) was achieved. Viability tests revealed that the thermal damage is much greater (up to twice) than expected after light microscopic characterization. This study shows the feasibility to strongly laser weld cartilage on cartilage by use of a dye-enhanced albumin solder. Possibilities to reduce the range of damage are suggested. Copyright 2001 Wiley-Liss, Inc.

  1. Fluxless flip-chip bonding using a lead-free solder bumping technique

    Science.gov (United States)

    Hansen, K.; Kousar, S.; Pitzl, D.; Arab, S.

    2017-09-01

    With the LHC exceeding the nominal instantaneous luminosity, the current barrel pixel detector (BPIX) of the CMS experiment at CERN will reach its performance limits and undergo significant radiation damage. In order to improve detector performance in high luminosity conditions, the entire BPIX is replaced with an upgraded version containing an additional detection layer. Half of the modules comprising this additional layer are produced at DESY using fluxless and lead-free bumping and bonding techniques. Sequential solder-jetting technique is utilized to wet 40-μm SAC305 solder spheres on the silicon-sensor pads with electroless Ni, Pd and immersion Au (ENEPIG) under-bump metallization (UBM). The bumped sensors are flip-chip assembled with readout chips (ROCs) and then reflowed using a flux-less bonding facility. The challenges for jetting low solder volume have been analyzed and will be presented in this paper. An average speed of 3.4 balls per second is obtained to jet about 67 thousand solder balls on a single chip. On average, 7 modules have been produced per week. The bump-bond quality is evaluated in terms of electrical and mechanical properties. The peak-bump resistance is about 17.5 mΩ. The cross-section study revealed different types of intermetallic compounds (IMC) as a result of interfacial reactions between UBM and solder material. The effect of crystalline phases on the mechanical properties of the joint is discussed. The mean shear strength per bump after the final module reflow is about 16 cN. The results and sources of yield loss of module production are reported. The achieved yield is 95%.

  2. Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

    Science.gov (United States)

    Coyle, Richard J.; Sweatman, Keith; Arfaei, Babak

    2015-09-01

    Thermal fatigue is a major source of failure of solder joints in surface mount electronic components and it is critically important in high reliability applications such as telecommunication, military, and aeronautics. The electronic packaging industry has seen an increase in the number of Pb-free solder alloy choices beyond the common near-eutectic Sn-Ag-Cu alloys first established as replacements for eutectic SnPb. This paper discusses the results from Pb-free solder joint reliability programs sponsored by two industry consortia. The characteristic life in accelerated thermal cycling is reported for 12 different Pb-free solder alloys and a SnPb control in 9 different accelerated thermal cycling test profiles in terms of the effects of component type, accelerated thermal cycling profile and dwell time. Microstructural analysis on assembled and failed samples was performed to investigate the effect of initial microstructure and its evolution during accelerated thermal cycling test. A significant finding from the study is that the beneficial effect of Ag on accelerated thermal cycling reliability (measured by characteristic lifetime) diminishes as the severity of the accelerated thermal cycling, defined by greater ΔT, higher peak temperature, and longer dwell time increases. The results also indicate that all the Pb-free solders are more reliable in accelerated thermal cycling than the SnPb alloy they have replaced. Suggestions are made for future work, particularly with respect to the continued evolution of alloy development for emerging application requirements and the value of using advanced analytical methods to provide a better understanding of the effect of microstructure and its evolution on accelerated thermal cycling performance.

  3. Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock

    Science.gov (United States)

    Han, Jing; Tan, Shihai; Guo, Fu

    2018-01-01

    Ball grid array (BGA) samples were soldered on a printed circuit board with Sn37Pb solder paste to investigate the recrystallization induced by subgrain rotation during thermal shock. The composition of the solder balls was Sn3.0Ag0.5Cu-Sn37Pb, which comprised mixed solder joints. The BGA component was cross-sectioned before thermal shock. The microstructure and grain orientations were obtained by a scanning electron microscope equipped with an electron back-scattered diffraction system. Two mixed solder joints at corners of the BGA component were selected as the subjects. The results showed that recrystallization occurred at the corner of the solder joints after 200 thermal shock cycles. The recrystallized subgrains had various new grain orientations. The newly generated grain orientations were closely related to the initial grain orientations, which indicated that different subgrain rotation behaviors could occur in one mixed solder joint with the same initial grain orientation. When the misorientation angles were very small, the rotation axes were about Sn [100], [010] and [001], as shown by analyzing the misorientation angles and subgrain rotation axes, while the subgrain rotation behavior with large misorientation angles in the solder joints was much more complicated. As Pb was contained in the solder joints and the stress was concentrated on the corner of the mixed solder joints, concaves and cracks were formed. When the adjacent recrystallized subgrains were separated, and the process of the continuous recrystallization was limited.

  4. The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

    Science.gov (United States)

    Jang, Guh-Yaw; Duh, Jenq-Gong

    2005-01-01

    The eutectic Sn-Ag solder alloy is one of the candidates for the Pb-free solder, and Sn-Pb solder alloys are still widely used in today’s electronic packages. In this tudy, the interfacial reaction in the eutectic Sn-Ag and Sn-Pb solder joints was investigated with an assembly of a solder/Ni/Cu/Ti/Si3N4/Si multilayer structures. In the Sn-3.5Ag solder joints reflowed at 260°C, only the (Ni1-x,Cux)3Sn4 intermetallic compound (IMC) formed at the solder/Ni interface. For the Sn-37Pb solder reflowed at 225°C for one to ten cycles, only the (Ni1-x,Cux)3Sn4 IMC formed between the solder and the Ni/Cu under-bump metallization (UBM). Nevertheless, the (Cu1-y,Niy)6Sn5 IMC was observed in joints reflowed at 245°C after five cycles and at 265°C after three cycles. With the aid of microstructure evolution, quantitative analysis, and elemental distribution between the solder and Ni/Cu UBM, it was revealed that Cu content in the solder near the solder/IMC interface played an important role in the formation of the (Cu1-y,Niy)6Sn5 IMC. In addition, the diffusion behavior of Cu in eutectic Sn-Ag and Sn-Pb solders with the Ni/Cu UBM were probed and discussed. The atomic flux of Cu diffused through Ni was evaluated by detailed quantitative analysis in an electron probe microanalyzer (EPMA). During reflow, the atomic flux of Cu was on the order of 1016-1017 atoms/cm2sec in both the eutectic Sn-Ag and Sn-Pb systems.

  5. Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

    International Nuclear Information System (INIS)

    Zhang, Liang; Han, Ji-guang; Guo, Yong-huan; He, Cheng-wen

    2014-01-01

    With the addition of 0.03 wt% rare earth Ce, in our previous works, the properties of SnAgCu solder were enhanced obviously. Based on the Garofalo–Arrhenius creep constitutive model, finite element method was used to simulate the stress–strain response during thermal cycle loading, and combined with the fatigue life prediction models, the fatigue life of SnAgCu/SnAgCuCe solder joints was calculated respectively, which can demonstrate the effect of the rare earth Ce on the fatigue life of SnAgCu solder joints. The results indicated that the maximum stress–strain can be found on the top surface of the corner solder joint, and the warpage of the PCB substrate occurred during thermal cycle loading. The trends obtained from modeling results have a good agreement with the experimental data reported in the literature for WLCSP devices. In addition, the stress–strain of SnAgCuCe solder joints is lower than that of SnAgCu solder joints. The thermal fatigue lives of solder joints calculated based on the creep model and creep strain energy density model show that the fatigue life of SnAgCuCe solder joints is higher than the SnAgCu solder joints. The fatigue life of SnAgCuCe solder joints can be enhanced significantly with the addition of Ce, is 30.2% higher than that of SnAgCu solder joints, which can be attributed to the CeSn 3 particles formed resisting the motion of dislocation; moreover, the refinement of microstructure and the IMC sizes also contribute to the enhancement of fatigue life, which elucidates that SnAgCuCe solder can be utilized in electronic industry with high reliability replacing the SnAgCu solder

  6. The Effect of Reflow on Wettability of Sn 96.5 Ag 3 Cu 0.5 Solder

    Directory of Open Access Journals (Sweden)

    Zoltán Weltsch

    2012-11-01

    Full Text Available Surface conditions on Printed Circuit Board (PCB final finishes have an important impact on the wetting behaviour with lead-free solder. The improvement of wettability in liquid Sn 96.5 Ag 3 Cu 0.5 Solder alloy on PCB substrate was measured with a sessile drop method at 523 K temperature. Wetting properties was determined in normal atmospheric air and inert atmosphere. The wetting angles increasing with the number of reflows both atmosphere. The effect of the atmosphere has a huge importance of the oxidation which manifests itself of the measured wetting angles. One of the most important factors to the wetting properties is the amount of oxygen in the soldering atmosphere. Using the inert atmosphere is crucial to Pb-free solders, particularly after reflows.

  7. Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

    OpenAIRE

    Koo, Ja-Myeong; Jung, Seung-Boo

    2007-01-01

    Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/5920); International audience; Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafte...

  8. Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

    International Nuclear Information System (INIS)

    Koo, Jahyun; Lee, Changsoo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck Mo

    2015-01-01

    It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu_3_3Al_1_7, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu_6Sn_5 networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu_6Sn_5 IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu_3_3Al_1_7 IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

  9. A FPGA implementation of solder paste deposit on printed circuit boards errors detector based in a bright and contrast algorithm

    OpenAIRE

    De Luca-Pennacchia, A.; Sánchez-Martínez, M. Á.

    2007-01-01

    Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be ...

  10. Microstructural discovery of Al addition on Sn–0.5Cu-based Pb-free solder design

    Energy Technology Data Exchange (ETDEWEB)

    Koo, Jahyun; Lee, Changsoo [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of); Hong, Sung Jea [MK Electron Co., Ltd., Yongin Cheoin-gu 316-2 (Korea, Republic of); Kim, Keun-Soo, E-mail: keunsookim@hoseo.edu [Department of Display Engineering, Hoseo University, Asan 336-795 (Korea, Republic of); Lee, Hyuck Mo, E-mail: hmlee@kaist.ac.kr [Department of Materials Science and Engineering, KAIST, Daejeon 305-701 (Korea, Republic of)

    2015-11-25

    It is important to develop Pb-free solder alloys suitable for automotive use instead of traditional Sn–Pb solder due to environmental regulations (e.g., Restriction of Hazardous Substances (RoHS)). Al addition has been spotlighted to enhance solder properties. In this study, we investigated the microstructural change of Sn–0.5Cu wt.% based Pb-free solder alloys with Al addition (0.01–0.05 wt.%). The small amount of Al addition caused a remarkable microstructural change. The Al was favored to form Cu–Al intermetallic compounds inside the solder matrix. We identified the Cu–Al intermetallic compound as Cu{sub 33}Al{sub 17}, which has a rhombohedral structure, using EPMA and TEM analyses. This resulted in refined Cu{sub 6}Sn{sub 5} networks in the Sn–0.5Cu based solder alloy. In addition, we conducted thermal analysis to confirm its stability at a high temperature of approximately 230 °C, which is the necessary temperature range for automotive applications. The solidification results were substantiated thermodynamically using the Scheil solidification model. We can provide criteria for the minimum aluminum content to modify the microstructure of Pb-free solder alloys. - Graphical abstract: The minor Al additions refined eutectic Cu{sub 6}Sn{sub 5} IMC networks on the Sn–0.5Cu based solder alloys. The microstructure was dramatically changed with the minor Al addition. - Highlights: • We observed dramatic microstructure-change with Al additions. • We defined Cu{sub 33}Al{sub 17} IMC with Al additions using TEM analysis. • We investigated grain refinement with Al additions using EBSD. • We discussed the refinement based on Scheil solidification model.

  11. THE POSSIBILITY OF USING LASER-ULTRASOUND TO MONITOR THE QUALITY SOLDERED CONNECTIONS CHAMBERS OF LIQUID ROCKET ENGINES

    Directory of Open Access Journals (Sweden)

    N. V. Astredinova

    2014-01-01

    Full Text Available During the manufacturing process to the design of modern liquid rocket engines are presented important requirements, such as minimum weight, maximum stiffness and strength of nodes, maximum service life in operation, high reliability and quality of soldered and welded seams. Due to the high quality requirements soldered connections and the specific design of the nozzle, it became necessary in the development and testing of a new non-conventional non-destructive testing method – laser-ultrasound diagnosis. In accordance with regulatory guidelines, quality control soldered connections is allowed to use an acoustic kind of control methods of the reflected light, transmitted light, resonant, free vibration and acoustic emission. Attempts to use traditional methods of non-destructive testing did not lead to positive results. This is due primarily to the size of typical solder joint defects, as well as the structural features of the rocket engine, the data structure is not controllable. In connection with this, a new method that provides quality control soldered connections cameras LRE based on the thermo generation of ultrasound. Methods of ultrasonic flaw detection of photoacoustic effect, in most cases, have a number of advantages over methods that use standard (traditional piezo transducers. In the course of studies have found that the sensitivity of the laser-ultrasonic method and flaw detector UDL-2M can detect lack of adhesion in the solder joints on the upper edges of the nozzle in the sub-header area of the site.

  12. Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

    International Nuclear Information System (INIS)

    Yang, Ming; Ko, Yong-Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu

    2017-01-01

    Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

  13. Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Ming [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Ko, Yong-Ho [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Bang, Junghwan [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Kim, Taek-Soo [Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141 (Korea, Republic of); Lee, Chang-Woo, E-mail: cwlee@kitech.re.kr [Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon 21999 (Korea, Republic of); Li, Mingyu, E-mail: myli@hit.edu.cn [Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055 (China)

    2017-02-15

    Low–Ag–content Sn–Ag–Cu (SAC) solders have attracted much recent attention in electronic packaging for their low cost. To reasonably reduce the Ag content in Pb–free solders, a deep understanding of the basic influence of Ag on the SAC solder/Cu substrate interfacial reaction is essential. Previous studies have discussed the influence of Ag on the interfacial intermetallic compound (IMC) thickness. However, because IMC growth is the joint result of multiple factors, such characterizations do not reveal the actual role of Ag. In this study, changes in interfacial IMCs after Ag introduction were systemically and quantitatively characterized in terms of coarsening behaviors, orientation evolution, and growth kinetics. The results show that Ag in the solder alloy affects the coarsening behavior, accelerates the orientation concentration, and inhibits the growth of interfacial IMCs during solid–state aging. The inhibition mechanism was quantitatively discussed considering the individual diffusion behaviors of Cu and Sn atoms, revealing that Ag inhibits interfacial IMC growth primarily by slowing the diffusion of Cu atoms through the interface. - Highlights: •Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. •Ag affects coarsening, crystallographic orientation, and IMC growth. •Diffusion pathways of Sn and Cu are affected differently by Ag. •Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.

  14. Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows

    Science.gov (United States)

    Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

    2016-12-01

    Controlling the size, dispersion, and stability of intermetallic compounds in lead-free solder alloys is vital to creating reliable solder joints regardless of how many times the solder joints are melted and resolidified (reflowed) during circuit board assembly. In this article, the coarsening behavior of Cu x Al y and Cu6Sn5 in two Sn-Cu-Al alloys, a Sn-2.59Cu-0.43Al at. pct alloy produced via drip atomization and a Sn-5.39Cu-1.69Al at. pct alloy produced via melt spinning at a 5-m/s wheel speed, was characterized after multiple (1-5) reflow cycles via differential scanning calorimetry between the temperatures of 293 K and 523 K (20 °C and 250 °C). Little-to-no coarsening of the Cu x Al y particles was observed for either composition; however, clustering of Cu x Al y particles was observed. For Cu6Sn5 particle growth, a bimodal size distribution was observed for the drip atomized alloy, with large, faceted growth of Cu6Sn5 observed, while in the melt spun alloy, Cu6Sn5 particles displayed no significant increase in the average particle size, with irregularly shaped, nonfaceted Cu6Sn5 particles observed after reflow, which is consistent with shapes observed in the as-solidified alloys. The link between original alloy composition, reflow undercooling, and subsequent intermetallic coarsening behavior was discussed by using calculated solidification paths. The reflowed microstructures suggested that the heteroepitaxial relationship previously observed between the Cu x Al y and the Cu6Sn5 was maintained for both alloys.

  15. Effect of surface oxide on the melting behavior of lead-free solder nanowires and nanorods

    International Nuclear Information System (INIS)

    Gao Fan; Rajathurai, Karunaharan; Cui, Qingzhou; Zhou, Guangwen; NkengforAcha, Irene; Gu Zhiyong

    2012-01-01

    Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders. By controlling the nanosolder reflow atmosphere using a flux, the surface oxide of the nanowires/nanorods can be effectively removed and complete nanosolder melting can be achieved. The complete melting of the nanosolders leads to the formation of nanoscale to microscale spherical solder balls, followed by Ostwald ripening phenomenon. The contact angle of the microscale solder balls formed on Si substrate was measured by direct electron microscopic imaging. These results provide new insights into micro- and nanoscale phase transition and liquid droplet coalescence from nanowires/nanorods to spheroids, and are relevant to nanoscale assembly and smaller ball grid array formation.

  16. Recovery of Tin and Nitric Acid from Spent Solder Stripping Solutions

    International Nuclear Information System (INIS)

    Ahn, Jae-Woo; Ryu, Seong-Hyung; Kim, Tae-young

    2015-01-01

    Spent solder-stripping solutions containing tin, copper, iron, and lead in nitric acid solution, are by-products of the manufacture of printed-circuit boards. The recovery of these metals and the nitric acid, for re-use has economic and environmental benefits. In the spent solder-stripping solution, a systematic method to determine a suitable process for recovery of valuable metals and nitric acid was developed. Initially, more than 90% of the tin was successfully recovered as high-purity SnO 2 by thermal precipitation at 80 ℃ for 3 hours. About 94% of the nitric acid was regenerated effectively from the spent solutions by diffusion dialysis, after which there remained copper, iron, and lead in solution. Leakage of tin through the anion-exchange membrane was the lowest (0.026%), whereas Pb-leakage was highest (4.26%). The concentration of the regenerated nitric acid was about 5.1 N.

  17. Solder bond requirement for large, built-up, high-performance conductors

    International Nuclear Information System (INIS)

    Willig, R.L.

    1981-01-01

    Some large built-up conductors fabricated for large superconducting magnets are designed to operate above the maximum recovery current. Because the stability of these conductors is sensitive to the quality of the solder bond joining the composite superconductor to the high-conductivity substrate, a minimum bond requirement is necessary. The present analysis finds that the superconductor is unstable and becomes abruptly resistive when there are temperature excursions into the current sharing region of a poorly bonded conductor. This abrupt transition, produces eddy current heating in the vicinity of the superconducting filaments and causes a sharp reduction in the minimum propagating zone (MPZ) energy. This sensitivity of the MPZ energy to the solder bond contact area is used to specify a minimum bond requirement. For the superconducting MHD magnet built for the Component Development Integration Facility (CDIF), the minimum bonded surface area is .68 cm/sup 2//cm which is 44% of the composite perimeter. 5 refs

  18. Appendix to the report from the low-residue soldering task force: Phase 2 results

    Energy Technology Data Exchange (ETDEWEB)

    Iman, R.L.; Anderson, D.J.; Huffman, D.D. [and others

    1995-12-01

    The LRSTF report for Phase I of its evaluation of low-residue soldering was issued in June 1995. This Appendix summarizes the results of follow-on testing performed in Phase II and compares electrical test results for both phases. Deliberate decisions were made by the LRSTF in Phase I to challenge the design guideline limits in MILSTD-275, Printed Wiring for Electronic Equipment The LRSTF considered this approach to produce a ``worst case`` design and provide useful information about the robustness of LR soldering processes. As such, good design practices were sometimes deliberately violated in designing the LRSTF board. This approach created some anomalies for both LR boards and RMA/cleaned controls. Phase II testing verified that problems that affected both RMA/cleaned and LR boards in Phase I were design related.

  19. Intense generation of respirable metal nanoparticles from a low-power soldering unit

    Energy Technology Data Exchange (ETDEWEB)

    Gómez, Virginia [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Irusta, Silvia [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain); Balas, Francisco [Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain); Instituto de Carboquímica – Consejo Superior de Investigaciones Científicas (ICB-CSIC), 50018 Zaragoza (Spain); Santamaria, Jesus, E-mail: Jesus.Santamaria@unizar.es [Department of Chemical Engineering, Nanoscience Institute of Aragon (INA), 50018 Zaragoza (Spain); Networking Biomedical Research Center of Bioengineering, Biomaterials and Nanomedicine (CIBER-BBN), 50018 Zaragoza (Spain)

    2013-07-15

    Highlights: • Intense generation of nanoparticles in the breathing range from a flux-soldering unit is detected. • Coagulation in the aerosol phase leads to 200-nm respirable nanoparticles up to 30 min after operation. • Nanoparticle concentration in the working environment depends on the presence of ambient air. • Metal-containing nanoparticles are collected in TEM grids and filters in the hundreds of nanometer range. -- Abstract: Evidence of intense nanoparticle generation from a low power (45 W) flux soldering unit is presented. This is a familiar device often used in daily life, including home repairs and school electronic laboratories. We demonstrate that metal-containing nanoparticles may reach high concentrations (ca. 10{sup 6} particles/cm{sup 3}) within the breathing range of the operator, with initial size distributions centered at 35–60 nm The morphological and chemical analysis of nanoparticle agglomerates collected on TEM grids and filters confirms their multiparticle structure and the presence of metals.

  20. Intense generation of respirable metal nanoparticles from a low-power soldering unit

    International Nuclear Information System (INIS)

    Gómez, Virginia; Irusta, Silvia; Balas, Francisco; Santamaria, Jesus

    2013-01-01

    Highlights: • Intense generation of nanoparticles in the breathing range from a flux-soldering unit is detected. • Coagulation in the aerosol phase leads to 200-nm respirable nanoparticles up to 30 min after operation. • Nanoparticle concentration in the working environment depends on the presence of ambient air. • Metal-containing nanoparticles are collected in TEM grids and filters in the hundreds of nanometer range. -- Abstract: Evidence of intense nanoparticle generation from a low power (45 W) flux soldering unit is presented. This is a familiar device often used in daily life, including home repairs and school electronic laboratories. We demonstrate that metal-containing nanoparticles may reach high concentrations (ca. 10 6 particles/cm 3 ) within the breathing range of the operator, with initial size distributions centered at 35–60 nm The morphological and chemical analysis of nanoparticle agglomerates collected on TEM grids and filters confirms their multiparticle structure and the presence of metals

  1. Diode Lasers used in Plastic Welding and Selective Laser Soldering - Applications and Products

    Science.gov (United States)

    Reinl, S.

    Aside from conventional welding methods, laser welding of plastics has established itself as a proven bonding method. The component-conserving and clean process offers numerous advantages and enables welding of sensitive assemblies in automotive, electronic, medical, human care, food packaging and consumer electronics markets. Diode lasers are established since years within plastic welding applications. Also, soft soldering using laser radiation is becoming more and more significant in the field of direct diode laser applications. Fast power controllability combined with a contactless temperature measurement to minimize thermal damage make the diode laser an ideal tool for this application. These advantages come in to full effect when soldering of increasingly small parts in temperature sensitive environments is necessary.

  2. Effects of In and Ni Addition on Microstructure of Sn-58Bi Solder Joint

    Science.gov (United States)

    Mokhtari, Omid; Nishikawa, Hiroshi

    2014-11-01

    In this study, the effect of adding 0.5 wt.% and 1 wt.% In and Ni to Sn-58Bi solder on intermetallic compound (IMC) layers at the interface and the microstructure of the solder alloys were investigated during reflow and thermal aging by scanning electron microscopy and electron probe micro-analysis. The results showed that the addition of minor elements was not effective in suppressing the IMC growth during the reflow; however, the addition of 0.5 wt.% In and Ni was effective in suppressing the IMC layer growth during thermal aging. The thickening kinetics of the total IMC layer was analyzed by plotting the mean thickness versus the aging time on log-log coordinates, and the results showed the transition point from grain boundary diffusion control to a volume diffusion control mechanism. The results also showed that the minor addition of In can significantly suppress the coarsening of the Bi phase.

  3. Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys

    Science.gov (United States)

    Lis, Adrian; Nakanishi, Kohei; Matsuda, Tomoki; Sano, Tomokazu; Minagawa, Madoka; Okamoto, Masahide; Hirose, Akio

    2017-07-01

    Solder joints between leads and printed circuit boards in thin small outline packages were produced with conventional Sn1.0Ag0.7Cu (SAC107) and Sn3.0Ag0.7Cu (SAC305) solders as well as various solder alloys with gradually increasing amounts of Bi (up to 3.0 wt.%) and In (up to 1.0 wt.%) within the SAC107 base solder. The reliability of soldered leads in temperature cycle (TC) tests improved most with solder alloys containing both Bi (1.6 wt.%) and In (0.5 wt.%). Microindentation and electron probe microanalysis mappings revealed that the effect originates from a combination of solution and precipitation strengthening of the initial SAC alloy. The distribution of inelastic strain accumulation (ISA), as a measure for degradation, was determined in the solder joints by finite element calculations. It was shown that defects in the solder proximal to the lead (60-75 μm), which was underpinned by similar cracking characteristics along the lead-solder interface. The ISA was confirmed to be lower in SAC+Bi/In alloys owing to their enhanced elasto-plastic properties. Moreover, the addition of a thin Cu coating on the leads could improve the joint reliability, as suggested by the calculation of the ISA and the acceleration factor.

  4. Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

    DEFF Research Database (Denmark)

    Kuhmann, Jochen Friedrich; Preuss, A.; Adolphi, B.

    1998-01-01

    : (1) SnPb; (2) InSn; (3) AuSn. The studies of the oxidation kinetics show that the growth of the native oxide, which covers the solder surfaces from the start of all soldering operations is self-limiting. The rate of oxidation on the molten, metallic solder surfaces is significantly reduced...... and reduction kinetics, are applied to flip-chip (FC) bonding experiments in vacuum with and without the injection of H2. Wetting in vacuum is excellent but the self-alignment during flip-chip soldering is restricted. The desired, perfectly self-aligned FC-bonds have been only achieved, using evaporated...

  5. Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint

    Science.gov (United States)

    Darbandi, Payam

    Due to the awareness of the potential health hazards associated with the toxicity of lead (Pb), actions have been taken to eliminate or reduce the use of Pb in consumer products. Among those, tin (Sn) solders have been used for the assembly of electronic systems. Anisotropy is of significant importance in all structural metals, but this characteristic is unusually strong in Sn, making Sn based solder joints one of the best examples of the influence of anisotropy. The effect of anisotropy arising from the crystal structure of tin and large grain microstructure on the microstructure and the evolution of constitutive responses of microscale SAC305 solder joints is investigated. Insights into the effects of key microstructural features and dominant plastic deformation mechanisms influencing the measured relative activity of slip systems in SAC305 are obtained from a combination of optical microscopy, orientation imaging microscopy (OIM), slip plane trace analysis and crystal plasticity finite element (CPFE) modeling. Package level SAC305 specimens were subjected to shear deformation in sequential steps and characterized using optical microscopy and OIM to identify the activity of slip systems. X-ray micro Laue diffraction and high energy monochromatic X-ray beam were employed to characterize the joint scale tensile samples to provide necessary information to be able to compare and validate the CPFE model. A CPFE model was developed that can account for relative ease of activating slip systems in SAC305 solder based upon the statistical estimation based on correlation between the critical resolved shear stress and the probability of activating various slip systems. The results from simulations show that the CPFE model developed using the statistical analysis of activity of slip system not only can satisfy the requirements associated with kinematic of plastic deformation in crystal coordinate systems (activity of slip systems) and global coordinate system (shape changes

  6. Current redistribution in cables made of insulated, soldered, or oxidized strands

    International Nuclear Information System (INIS)

    Turck, B.

    1979-07-01

    Current redistributions are compared in cables made of insulated strands, soldered, or oxidized strands and insulated strands with periodic joints. After discussing the different current redistributions in the cases of a rapidly changing current and a dc current, several particular situations are investigated: what happens if a strand is broken, or if a local normal zone appears that does not affect all the strands equally, the detection of this normal zone, and the influence of short circuits between strands

  7. Life cycle assessment (LCA of lead-free solders from the environmental protection aspect

    Directory of Open Access Journals (Sweden)

    Mitovski Aleksandra M.

    2009-01-01

    Full Text Available Life-cycle assessment (LCA presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equivalent basis, which, in this case, was 1000 cubic centimeters of an alloy. Two of the LCA phases, life-cycle inventory (LCA and life-cycle impact assessment (LCIA, are needed to calculate the environmental impacts. Methodology of LCIA applied in this analysis aligns every input and output influence into 16 different categories, divided in two subcategories. The life-cycle assessment reaserch review of the leadfree solders Sn-Cu, SAC (Sn-Ag-Cu, BSA (Bi-Sb-Ag and SABC (Sn-Ag-Bi-Cu respectively, is given in this paper, from the environmental protection aspect starting from production, through application process and finally, reclamation at the end-of-life, i.e. recycling. There are several opportunities for reducing the overall environmental and human health impacts of solder used in electronics manufacturing based on the results of the LCA, such as: using secondary metals reclaimed through post-industrial recycling; power consumption reducing by replacing older, less efficient reflow assembly equipment, or by optimizing the current equipment to perform at the elevated temperatures required for lead-free soldering, etc. The LCA analysis was done comparatively in relation to widely used Sn-Pb solder material. Additionally, the impact factors of material consumption, energy use, water and air reserves, human health and ecotoxicity have been ALSO considered including

  8. Study of silicon chip soldering in high-power transistor housing

    Directory of Open Access Journals (Sweden)

    Vasily S. Anosov

    2017-09-01

    We experimentally assessed the effect of outer housing layer materials and back side chip metallization. For lead-silver soldering of silicon chips, the best housing is that with a nickel outer layer rather than with a gold-plated one, because the resultant thermal resistance is lower and the absence of gold makes the technology cheaper. We obtained a 0.6 K/W thermal resistance for a 24 mm2 chip area.

  9. Evaluation on Dorsey Method in Surface Tension Measurement of Solder Liquids Containing Surfactants

    Science.gov (United States)

    Zhao, Xingke; Xie, Feiming; Fan, Jinsheng; Liu, Dayong; Huang, Jihua; Chen, Shuhai

    2018-06-01

    With the purpose of developing a feasible approach for measuring the surface tension of solders containing surfactants, the surface tension of Sn-3Ag-0.5Cu-xP solder alloys, with various drop sizes as well as different phosphorus (P) content, was evaluated using the Dorsey method based on the sessile drop test. The results show that the accuracy of the surface tension calculations depends on both of sessile drop size and the liquid metal composition. With a proper drop size, in the range of 4.5 mm to 5.3 mm in equivalent spherical diameters, the deviation of the surface tension calculation can be limited to 1.43 mN·m-1 and 6.30 mN·m-1 for SnAgCu and SnAgCu-P, respectively. The surface tension of SnAgCu-xP solder alloys decreases quickly to a minimum value when the P content reaches 0.5 wt% and subsequently increases slowly with the P content further increasing. The formation of a P-enriched surface layer and Sn4P3 intermetallic phases is regarded to be responsible for the decreasing and subsequent increasing of surface tension, respectively.

  10. Liver repair and hemorrhage control by using laser soldering of liquid albumin in a porcine model.

    Science.gov (United States)

    Wadia, Y; Xie, H; Kajitani, M

    2000-01-01

    We evaluated laser soldering by using liquid albumin for welding liver injuries. Major liver trauma has a high mortality because of immediate exsanguination and a delayed morbidity from septicemia, peritonitis, biliary fistulae, and delayed secondary hemorrhage. Eight laceration (6 x 2 cm) and eight nonanatomic resection injuries (raw surface, 6 x 2 cm) were repaired. An 805-nm laser was used to weld 50% liquid albumin-indocyanine green solder to the liver surface, reinforcing it with a free autologous omental scaffold. The animals were heparinized and hepatic inflow occlusion was used for vascular control. All 16 soldering repairs were evaluated at 3 hours. All 16 laser mediated liver repairs had minimal blood loss as compared with the suture controls. No dehiscence, hemorrhage, or bile leakage was seen in any of the laser repairs after 3 hours. Laser fusion repair of the liver is a reliable technique to gain hemostasis on the raw surface as well as weld lacerations. Copyright 2000 Wiley-Liss, Inc.

  11. Investigation of Sn-Pb solder bumps of prototype photo detectors for the LHCb experiment

    CERN Document Server

    Delsante, M L; Arnau-Izquierdo, G

    2004-01-01

    The Large Hadron Collider (LHC) is now under construction at the European Organization for Nuclear Research (CERN). LHCb is one of the dedicated LHC experiments, allowing high energy proton-proton collisions to be exploited. This paper presents the results of the metallurgic studies carried out on Sn-Pb solder bumps of prototype vacuum photo detectors under development for LHCb, and in particular for the ring imaging Cherenkov-hybrid photo diode (RICH-HPD) project. These detectors encapsulate, in a vacuum tube, an assembly made of two silicon chips bonded together by a matrix of solder bumps. Each bump lies on a suitable system of under-bump metallic layers ensuring mechanical and electrical transition between the chip pad and the solder alloy. During manufacturing of the detector, bump-bonded (BB) assemblies are exposed to severe heat cycles up to 400 degree C inducing, in the present fabrication process, a clear degradation of electrical connectivity. Several investigations such as microstructural observati...

  12. Multi-layer SiC ceramics/Mo joints brazed using high-temperature solders

    International Nuclear Information System (INIS)

    Olesinska, W.; Kesik, J.

    2003-01-01

    The paper presents the results of studies on joining SiC ceramics with molybdenum, with the ceramic surface being activated by titanium, chromium or copper. Titanium or chromium were deposited by the sputtering technique, and copper - by the electro-chemical method. The microstructures of the SiC/Mo joints brazed with the CuMn13Ni3 solder and copper in a nitrogen atmosphere were examined and the results discussed. The joints, in which the ceramic surface was activated in addition with chromium, do not contain mechanical defects caused by the joining process, and the ceramic surface is covered with a continuous layer of the solder. A phase analysis of the interface surface identified an MeSiC phase. The mechanical strength of the joints in which the ceramic surface was modified by the Ti, Cr and Cu layers was markedly greater than that of the joints brazed directly to the uncoated ceramics with the use of active solders. (author)

  13. Laser Soldering and Thermal Cycling Tests of Monolithic Silicon Pixel Chips

    CERN Document Server

    Strand, Frode Sneve

    2015-01-01

    An ALPIDE-1 monolithic silicon pixel sensor prototype has been laser soldered to a flex printed circuit using a novel interconnection technique using lasers. This technique is to be optimised to ensure stable, good quality connections between the sensor chips and the FPCs. To test the long-term stability of the connections, as well as study the effects on hit thresholds and noise in the sensor, it was thermally cycled in a climate chamber 1200 times. The soldered connections showed good qualities like even melting and good adhesion on pad/flex surfaces, and the chip remained in working condition for 1080 cycles. After this, a few connections failed, having cracks in the soldering tin, rendering the chip unusable. Threshold and noise characteristics seemed stable, except for the noise levels of sector 2 in the chip, for 1000 cycles in a temperature interval of "10^{\\circ}" and "50^{\\circ}" C. Still, further testing with wider temperature ranges and more cycles is needed to test the limitations of the chi...

  14. Reinforcement of high-risk anastomoses using laser-activated protein solders: a clinical study

    Science.gov (United States)

    Libutti, Steven K.; Bessler, Marc; Chabot, J.; Bass, Lawrence S.; Oz, Mehmet C.; Auteri, Joseph S.; Kirsch, Andrew J.; Nowygrod, Roman; Treat, Michael R.

    1993-07-01

    Anastomotic leakage or breakdown can result in catastrophic complications and significantly increased post-operative morbidity and mortality. Certain anastomoses are subject to a higher incidence of disruption and are therefore termed high risk. In an attempt to decrease the risk of anastomotic leaks, we reinforced sutured anastomoses with a laser activated protein solder in patients undergoing esophagojejunostomies (n equals 2), lung transplantation (n equals 2), and pancreaticojejunostomies (Whipple procedure, n equals 5). The protein solder was composed of 1.0 ml of a 25% human albumin solution, 1.0 ml of sodium hyaluronate, and 0.1 ml of Cardiogreen dye. This composition was applied to the sutured anastomosis and activated with an 860 nm pulsed diode laser. Drains were placed when appropriate and patients were followed for up to 10 months post-operatively and assessed for clinical signs of anastomotic leaks. Results to data demonstrated that there were no immediate complications as a result of the procedure. Operative time was not significantly lengthened. There were no cases of clinically significant leakage from any of the reinforced anastomoses. Laser activated protein solders may help to reduce the incidence of leakage in high risk anastomoses. Large numbers of patients and longer follow-up is needed however, to draw significant conclusions.

  15. Liver repair and hemorrhage control using laser soldering of liquid albumin in a porcine model

    Science.gov (United States)

    Wadia, Yasmin; Xie, Hua; Kajitani, Michio; Gregory, Kenton W.; Prahl, Scott A.

    2000-05-01

    The purpose of this study was to evaluate laser soldering using liquid albumin for welding liver lacerations and sealing raw surfaces created by segmental resection of a lobe. Major liver trauma has a high mortality due to immediate exsanguination and a delayed morbidity and mortality from septicemia, peritonitis, biliary fistulae and delayed secondary hemorrhage. Eight laceration injuries (6 cm long X 2 cm deep) and eight non-anatomical resection injuries (raw surface 6 cm X 2 cm) were repaired. An 805 nm laser was used to weld 53% liquid albumin-ICG solder to the liver surface, reinforcing it with a free autologous omental scaffold. The animals were heparinized to simulate coagulation failure and hepatic inflow occlusion was used for vascular control. For both laceration and resection injuries, eight soldering repairs each were evaluated at three hours. A single suture repair of each type was evaluated at three hours. All 16 laser mediated liver repairs were accompanied by minimal blood loss as compared to the suture controls. No dehiscence, hemorrhage or bile leakage was seen in any of the laser repairs after three hours. In conclusion laser fusion repair of the liver is a quick and reliable technique to gain hemostasis on the cut surface as well as weld lacerations.

  16. Dissolution and uptake of cadmium from dental gold solder alloy implants

    Energy Technology Data Exchange (ETDEWEB)

    Bergman, B; Bergman, M; Soeremark, R [Umeaa Univ. (Sweden); Karolinska Institutet, Stockholm (Sweden))

    1977-01-01

    Pure metallic cadmium was irradiated by means of thermal neutrons. The irradiated cadmium (/sup 115/Cd) was placed in bags of gold foil and the bags were implanted subcutaneously in the neck region of mice. Two and 3 d respectively after implantation the mice were killed, the bags removed and the animals subjected to whole-body autoradiography. The autoradiograms revealed an uptake of /sup 115/Cd in liver and kidney. In another experiment specimens of a cadmium-containing dental gold solder alloy, a cadmium-free dental casting gold alloy and soldered assemblies made of these two alloys were implanted subcutaneously in the neck region of mice. The animals were killed after 6 months; cadmium analysis showed significant increases in the cadmium concentration in liver and kidney of those mice which had been given implants of gold solder alloy. The study clearly shows that due to electrochemical corrosion cadmium can be released from implants and accumulated in the kidneys and the liver.

  17. Creep/fatigue damage prediction of fast reactor components using shakedown methods

    International Nuclear Information System (INIS)

    Buckthorpe, D.E.

    1997-01-01

    The present status of the shakedown method is reviewed, the application of the shakedown based principles to complex hardening and creep behaviour is described and justified and the prediction of damage against design criteria outlined. Comparisons are made with full inelastic analysis solutions where these are available and against damage assessments using elastic and inelastic design code methods. Current and future developments of the method are described including a summary of the advances made in the development of the post process ADAPT, which has enabled the method to be applied to complex geometry features and loading cases. The paper includes a review of applications of the method to typical Fast Reactor structural example cases within the primary and secondary circuits. For the primary circuit this includes structures such as the large diameter internal shells which are surrounded by hot sodium and subject to slow and rapid thermal transient loadings. One specific case is the damage assessment associated with thermal stratifications within sodium and the effects of moving sodium surfaces arising from reactor trip conditions. Other structures covered are geometric features within components such as the Above Core structure and Intermediate Heat Exchanger. For the secondary circuit the method has been applied to alternative and more complex forms of geometry namely thick section tubeplates of the Steam Generator and a typical secondary circuit piping run. Both of these applications are in an early stage of development but are expected to show significant advantages with respect to creep and fatigue damage estimation compared with existing code methods. The principle application of the method to design has so far been focused on Austenitic Stainless steel components however current work shows some significant benefits may be possible from the application of the method to structures made from Ferritic steels such as Modified 9Cr 1Mo. This aspect is briefly discussed as a potential application and future development of the method. 8 refs, 14 figs, 5 tabs

  18. The interpretation of stress reductions in creep-fatigue cycles of 316 stainless steel

    International Nuclear Information System (INIS)

    Hales, R.

    1986-11-01

    A statistical analysis of stress-drop results obtained on a number of different casts of 316 stainless steel in the temperature range 550 0 C to 700 0 C is presented. In all cases the results were obtained from strain controlled fatigue tests. The equations used to describe stress relaxation here are derived from forward creep equations which describe the dependence of creep rate on time, stress and temperature. Although there is no clear correspondence between creep and stress relaxation, creep equations offer an attractive starting point. Not all the models considered exhibited the expected response to changes in temperature. A revised analysis was carried out on the assumption that stress relaxation is thermally activated according to the Arrhenius equation. Two models were found to fit the data equally well and it was not possible to choose which of these relationships is the more appropriate to describe stress relaxation of cyclically conditioned material. On the basis of the evidence both are acceptable and may be used to calculate the creep damage according to the various high temperature design codes. Whichever gives the more conservative assessment should be used until a more mechanistically based judgement can be reached. (author)

  19. Relationship between fatigue life in the creep-fatigue region and stress-strain response

    Science.gov (United States)

    Berkovits, A.; Nadiv, S.

    1988-01-01

    On the basis of mechanical tests and metallographic studies, strainrange partitioned lives were predicted by introducing stress-strain materials parameters into the Universal Slopes Equation. This was the result of correlating fatigue damage mechanisms and deformation mechanisms operating at elevated temperatures on the basis of observed mechanical and microstructural behavior. Correlation between high temperature fatigue and stress strain properties for nickel base superalloys and stainless steel substantiated the method. Parameters which must be evaluated for PP- and CC- life are the maximum stress achievable under entirely plastic and creep conditions respectively and corresponding inelastic strains, and the two more pairs of stress strain parameters must be ascertained.

  20. Room temperature creep-fatigue response of selected copper alloys for high heat flux applications

    DEFF Research Database (Denmark)

    Li, M.; Singh, B.N.; Stubbins, J.F.

    2004-01-01

    times. The influence of hold times on fatigue life in the low cycle fatigue, short life regime (i.e., at high strain amplitudes) was minimal. When hold time effects were observed, fatigue lives were reduced with hold times as short as two seconds. Appreciable stress relaxation was observed during...

  1. Validation of a new multiaxial criteria for creep-fatigue damage evaluation

    International Nuclear Information System (INIS)

    Cabrillat, M.T.; Martin, P.

    1989-01-01

    For many years, design codes evaluated creep damage using the Von Mises criterion to take account of multiaxiality of stresses. However, recent studies have confirmed that the Von Mises criterion is overconservative for nonuniaxial stress state. Various criteria have been put forward to take account of the real stress state. This paper describes a criterion which was introduced in 1987 and the various studies which led to its adoption

  2. Implementation of creep-fatigue model into finite-element code to assess cooled turbine blade.

    CSIR Research Space (South Africa)

    Dedekind, MO

    1994-01-01

    Full Text Available Turbine blades which are designed with airfoil cooling are subject to thermo-mechanical fatigue as well as creep damage. These problems arise due to thermal cycling and high operating temperatures in service. An implementation of fatigue and creep...

  3. Risk based lifetime assessment of piping under creep-fatigue conditions

    International Nuclear Information System (INIS)

    Bielak, O.; Bina, V.; Korous, J.

    2003-01-01

    The analysis of the steam pipeline lifetime is based on: (i) technical procedures supplied by Nuclear Electric R5; (ii) random interpretation of material damage accumulation laws for creep and fatigue; (iii) a stochastic model of the creep process (creep rupture strength, deformation characteristics); (iv) probabilistic description of geometrical quantities of the steam pipeline. The probabilistic procedure results in the calculation of the crack initiation risks both for the critical localities and for the steam pipeline as a whole (its subsystems, if need be). The residual lifetime was calculated from the conditional (a posteriori) probabilities. The risks of crack initiation was calculated for different operating periods (inspection frequency), and the periods were optimised to meet (i) the minimum risk of crack initiation and (2) the operation and economy criteria. The method also involves calculation of the residual lifetime from the updated data (material properties, dimensions). In the standard service-life calculations there is no difference between the weld and BM, the justification being that the weld is exposed to axial stress caused by internal pressure, which is one half of the hoop stress. Thus, the low creep resistant properties of the weld were ignored, as well as the uneven state of stress and its redistribution. In a number of cases it is the welds that are a weak point and therefore should receive considerable attention. The probabilistic method of lifetime and reliability assessment was verified on over 29 piping systems in power and petrochemical plants

  4. The effect of micro alloying on the microstructure evolution of Sn-Ag-Cu lead-free solder

    Science.gov (United States)

    Werden, Jesse

    The microelectronics industry is required to obtain alternative Pb-free soldering materials due to legal, environmental, and technological factors. As a joining material, solder provides an electrical and mechanical support in electronic assemblies and therefore, the properties of the solder are crucial to the durability and reliability of the solder joint and the function of the electronic device. One major concern with new Pb-free alternatives is that the microstructure is prone to microstructural coarsening over time which leads to inconsistent properties over the device's lifetime. Power aging the solder is a common method of stabilizing the microstructure for Pb-based alloys, however, it is unclear if this will be an appropriate solution to the microstructural coarsening of Pb-free solders. The goal of this work is to develop a better understanding of the coarsening process in new solder alloys and to suggest methods of stabilizing the solder microstructure. Microalloying is one potential solution to the microstructural coarsening problem. This experiment consists of a microstructural coarsening study of SAC305 in which each sample has been alloyed with one of three different solutes, directionally solidified at 100microm/s, and then aged at three different temperatures over a total period of 20 days. There are several important conclusions from this experiment. First, the coarsening kinetics of the intermetallics in the ternary eutectic follow the Ostwald ripening model where r3 in proprotional to t for each alloying constituent. Second, the activation energy for coarsening was found to be 68.1+/-10.3 kJ/mol for the SAC305 samples, Zn had the most significant increase in the activation energy increasing it to 88.8+/-34.9 kJ/mol for the SAC+Zn samples, Mn also increased the activation energy to 83.2+/-20.8 kJ/mol for the SAC+Mn samples, and Sb decreased the activation energy to 48.0+/-3.59 kJ/mol for the SAC+Sb samples. Finally, it was found that the

  5. Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

    Directory of Open Access Journals (Sweden)

    Yulong Li

    2018-01-01

    Full Text Available In order to accelerate the growth of interfacial intermetallic compound (IMC layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms and 800 ms, were used for the ultrasonic soldering. The isothermal aging was conducted at 150 °C for 0, 120, 240, and 360 h. The evolution of microstructure, the IMC layer growth mechanism during aging, and the shear strength of the joints after aging were systemically investigated. Results showed the following. (i Formation of intermetallic compounds was accelerated by ultrasonic cavitation and streaming effects, the thickness of the interfacial Cu6Sn5 layer increased with aging time, and a thin Cu3Sn layer was identified after aging for 360 h. (ii The growth of the interfacial IMC layer of the ultrasonically soldered Cu/SAC305/Cu joints followed a linear function of the square root of the aging time, revealing a diffusion-controlled mechanism. (iii The tensile shear strength of the joint decreased to a small extent with increasing aging time, owing to the combined effects of IMC grain coarsening and the increase of the interfacial IMC. (iv Finally, although the fracture surfaces and failure locations of the joint soldered with 400 ms and 800 ms vibration times show similar characteristics, they are influenced by the aging time.

  6. Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

    Science.gov (United States)

    Yoon, Jeong-Won; Noh, Bo-In; Jung, Seung-Boo

    2011-09-01

    Interfacial reactions and joint reliability of Sn-3.0Ag-0.5Cu solder with two different surface finishes, electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG), were evaluated during a reflow process. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn-Ag-Cu/ENIG joint exhibited a higher intermetallic compound (IMC) growth rate and a higher consumption rate of the Ni(P) layer than the Sn-Ag-Cu/ENEPIG joint. The presence of the Pd layer in the ENEPIG suppressed the growth of the interfacial IMC layer and the consumption of the Ni(P) layer, resulting in the superior interfacial stability of the solder joint. The shear test results show that the ENIG joint fractured along the interface, exhibiting indications of brittle failure possibly due to the brittle IMC layer. In contrast, the failure of the ENEPIG joint only went through the bulk solder, supporting the idea that the interface is mechanically reliable. The results from this study confirm that the Sn-Ag-Cu/ENEPIG solder joint is mechanically robust and, thus, the combination is a viable option for a Pb-free package system.

  7. CO2 temperature-controlled laser soldering of pig trachea incisions in vitro using flexible albumin bands

    Science.gov (United States)

    Sharvit, Dan; Vasilyev, Tamar; Vasserman, Irena; Simhon, David; Kariv, Naam; DeRowe, Ari; Katzir, Abraham

    2005-04-01

    Resection of a segment of the trachea is a procedure applied for the removal of cervical tumors invading the trachea, or for the treatment of severe tracheal stenosis. The current method of anastomosis is based on multiple sutures. The main drawbacks of this method are: 1) A long procedure time, 2) An air leakage, and 3) An inflammatory response to the sutures. In this study we evaluated the feasibility and effectiveness of the use of temperature controlled CO2 laser soldering of incisions in pig tracheas in vitro. A transverse incision was made in a separated pig trachea. A flexible albumin band was prepared and was laser soldered with albumin solder to the outer surface of the trachea, covering the incision. The soldered trachea ends were sealed and the burst pressure was measured. In a series of in vitro experiments, the mean burst pressure was found to be 230 mm Hg. These preliminary results demonstrated that laser soldering using a flexible albumin band may be a useful method for sealing an incision in the trachea.

  8. Electrical Resistance of Nb$_{3}$Sn/Cu Splices Produced by Electromagnetic Pulse Technology and Soft Soldering

    CERN Document Server

    Schoerling, D; Scheuerlein, C; Atieh, S; Schaefer, R

    2011-01-01

    The electrical interconnection of Nb$_{3}$Sn/Cu strands is a key issue for the construction of Nb$_{3}$Sn based damping ring wigglers and insertion devices for third generation light sources. We compare the electrical resistance of Nb$_{3}$Sn/Cu splices manufactured by solid state welding using Electromagnetic Pulse Technology (EMPT) with that of splices produced by soft soldering with two different solders. The resistance of splices produced by soft soldering depends strongly on the resistivity of the solder alloy at the operating temperature. By solid state welding splice resistances below 10 nOhm can be achieved with 1 cm strand overlap length only, which is about 4 times lower than the resistance of Sn96Ag4 soldered splices with the same overlap length. The comparison of experimental results with Finite Element simulations shows that the electrical resistance of EMPT welded splices is determined by the resistance of the stabilizing copper between the superconducting filaments and confirms that welding of ...

  9. Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

    Science.gov (United States)

    Boesenberg, Adam J.; Anderson, Iver E.; Harringa, Joel L.

    2012-07-01

    Of Pb-free solder choices, an array of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic ( T eut = 217°C) composition have emerged with potential for broad use, including ball grid array (BGA) joints that cool slowly. This work investigated minor substitutional additions of Al (0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2- μm to 5- μm faceted Cu-Al particles, identified as Cu33Al17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness. Clustering of Cu33Al17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface. Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance.

  10. Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds

    Energy Technology Data Exchange (ETDEWEB)

    Haseeb, A.S.M.A., E-mail: haseeb@um.edu.my; Arafat, M.M., E-mail: arafat_mahmood@yahoo.com; Johan, Mohd Rafie, E-mail: mrafiej@um.edu.my

    2012-02-15

    This work investigates the effects of molybdenum nanoparticles on the growth of interfacial intermetallic compound between Sn-3.8Ag-0.7Cu solder and copper substrate during multiple reflow. Molybdenum nanoparticles were mixed with Sn-3.8Ag-0.7Cu solder paste by manual mixing. Solder samples were reflowed on a copper substrate in a 250 Degree-Sign C reflow oven up to six times. The molybdenum content of the bulk solder was determined by inductive coupled plasma-optical emission spectrometry. It is found that upon the addition of molybdenum nanoparticles to Sn-3.8Ag-0.7Cu solder, the interfacial intermetallic compound thickness and scallop diameter decreases under all reflow conditions. Molybdenum nanoparticles do not appear to dissolve or react with the solder. They tend to adsorb preferentially at the interface between solder and the intermetallic compound scallops. It is suggested that molybdenum nanoparticles impart their influence on the interfacial intermetallic compound as discrete particles. The intact, discrete nanoparticles, by absorbing preferentially at the interface, hinder the diffusion flux of the substrate and thereby suppress the intermetallic compound growth. - Highlights: Black-Right-Pointing-Pointer Mo nanoparticles do not dissolve or react with the SAC solder during reflow. Black-Right-Pointing-Pointer Addition of Mo nanoparticles results smaller IMC thickness and scallop diameter. Black-Right-Pointing-Pointer Mo nanoparticles influence the interfacial IMC through discrete particle effect.

  11. Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction

    Science.gov (United States)

    Takaku, Yoshikazu; Ohnuma, Ikuo; Kainuma, Ryosuke; Yamada, Yasushi; Yagi, Yuji; Nishibe, Yuji; Ishida, Kiyohito

    2006-11-01

    Bismuth and its alloys are candidates for Pb-free high-temperature solders that can be substituted for conventional Pb-rich Pb-Sn solders (melting point (mp) = 573 583 K). However, inferior properties such as brittleness and weak bonding strength should be improved for practical use. To that end, BiCu-X (X=Sb, Sn, and Zn) Pb-free high-temperature solders are proposed. Miscibility gaps in liquid BiCu-X alloys were surveyed using the thermodynamic database ADAMIS (alloy database for micro-solders), and compositions of the BiCu-X solders were designed on the basis of calculation. In-situ composite solders that consist of a Bi-base matrix with fine intermetallic compound (IMC) particles were produced by gas-atomizing and melt-spinning methods. The interfacial reaction between in-situ composite solders and Cu or Ni substrates was investigated. The IMCs at the interface formed a thin, uniform layer, which is an appropriate morphology for a reliable solder joint.

  12. Microstructural effects on constitutive and fatigue fracture behavior of TinSilverCopper solder

    Science.gov (United States)

    Tucker, Jonathon P.

    As microelectronic package construction becomes more diverse and complex, the need for accurate, geometry-independent material constitutive and failure models increases. Evaluations of packages based on accelerated environmental tests (such as accelerated thermal cycling or power cycling) only provide package-dependent reliability information. In addition, extrapolations of such test data to life predictions under field conditions are often empirical. Besides geometry, accelerated environmental test data must account for microstructural factors such as alloy composition or isothermal aging condition, resulting in expensive experimental variation. In this work, displacement-controlled, creep, and fatigue lap shear tests are conducted on specially designed SnAgCu test specimens with microstructures representative to those found in commercial microelectronic packages. The data are used to develop constitutive and fatigue fracture material models capable of describing deformation and fracture behavior for the relevant temperature and strain rate ranges. Furthermore, insight is provided into the microstructural variation of solder joints and the subsequent effect on material behavior. These models are appropriate for application to packages of any geometrical construction. The first focus of the thesis is on Pb-mixed SnAgCu solder alloys. During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of SnPb and SnAgCu often result from either mixed assemblies or rework. Three alloys of 1, 5 and 20 weight percent Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn37Pb components mixed with Sn3.0Ag0.5Cu. Displacement-controlled (constant strain rate) and creep tests were performed at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. Rate-dependent constitutive models for Pb

  13. Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

    Science.gov (United States)

    Mallik, S.; Bauer, R.; Hübner, F.; Ekere, N. N.

    2011-01-01

    Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

  14. Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements

    Science.gov (United States)

    Gadag, Shiva P.; Patra, Susant

    2000-12-01

    Solder joint interconnects are mechanical means of structural support for bridging the various electronic components and providing electrical contacts and a thermal path for heat dissipation. The functionality of the electronic device often relies on the structural integrity of the solder. The dimensional stability of solder joints is numerically predicted based on their mechanical properties. Algorithms to model the kinetics of dissolution and subsequent growth of intermetallic from the complete knowledge of a single history of time-temperature-reflow profile, by considering equivalent isothermal time intervals, have been developed. The information for dissolution is derived during the heating cycle of reflow and for the growth process from cooling curve of reflow profile. A simple and quick analysis tool to derive tensile stress-strain maps as a function of the reflow temperature of solder and strain rate has been developed by numerical program. The tensile properties are used in modeling thermal strain, thermal fatigue and to predict the overall fatigue life of solder joints. The numerical analysis of the tensile properties as affected by their composition and rate of testing, has been compiled in this paper. A numerical model using constitutive equation has been developed to evaluate the interfacial fatigue crack growth rate. The model can assess the effect of cooling rate, which depends on the level of strain energy release rate. Increasing cooling rate from normalizing to water-quenching, enhanced the fatigue resistance to interfacial crack growth by up to 50% at low strain energy release rate. The increased cooling rates enhanced the fatigue crack growth resistance by surface roughening at the interface of solder joint. This paper highlights salient features of process modeling. Interfacial intermetallic microstructure is affected by cooling rate and thereby affects the mechanical properties.

  15. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Dias, Marcelino; Costa, Thiago [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Rocha, Otávio [Federal Institute of Education, Science and Technology of Pará — IFPA, 66093-020 Belém, PA (Brazil); Spinelli, José E. [Department of Materials Engineering, Federal University of São Carlos — UFSCar, 13565-905 São Carlos, SP (Brazil); Cheung, Noé, E-mail: cheung@fem.unicamp.br [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil); Garcia, Amauri [Department of Manufacturing and Materials Engineering, University of Campinas — UNICAMP, 13083-860 Campinas, SP (Brazil)

    2015-08-15

    Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing.

  16. In-vitro investigations of skin closure using diode laser and protein solder containing gold nano shells

    International Nuclear Information System (INIS)

    Nourbakhsh, M. S.; Etrati Khosroshahi, M.

    2011-01-01

    Laser tissue soldering is a new technique for repair of various tissues including the skin, liver, articular cartilage and nerves and is a promising alternative to suture. To overcome the problems of thermal damage to surrounding tissues and low laser penetration depth, some exogenous chromophores such as gold nano shells, a new class of nanoparticles consisting of a dielectric core surrounded by a thin metal shell, are used. The aims of this study were to use two different concentrations of gold nano shells as the exogenous material for skin tissue soldering and also to examine the effects of laser soldering parameters on the properties of the repaired skin. Material and Methods: Two mixtures of albumin solder and different concentrations of gold nano shells were prepared. A full thickness incision of 2*20 mm 2 was made on the surface and after placing 50 μ1 of the solder mixture on the incision, an 810 nm diode laser was used to irradiate it at different power densities. The changes of tensile strength, σt, due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. Results: The results showed that the tensile strength of the repaired skin increased with increasing irradiance for both gold nano shell concentrations. In addition, at constant laser irradiance (I), the tensile strength of the repaired incision increased with increasing Ns and decreasing Vs. In our case, this corresponded to σt = 1610 g/cm 2 at I ∼ 60 W cm-2, T ∼ 65 d egree C , Ns = 10 and Vs = 0.2 mms-1. Discussion and Conclusion: Gold nano shells can be used as an indocyanine green dye alterative for laser tissue soldering. Although by increasing the laser power density, the tensile strength of the repaired skin increases, an optimum power density must be considered due to the resulting increase in tissue temperature.

  17. INTERACT

    DEFF Research Database (Denmark)

    Jochum, Elizabeth; Borggreen, Gunhild; Murphey, TD

    This paper considers the impact of visual art and performance on robotics and human-computer interaction and outlines a research project that combines puppetry and live performance with robotics. Kinesics—communication through movement—is the foundation of many theatre and performance traditions ...

  18. In situ investigation of SnAgCu solder alloy microstructure

    International Nuclear Information System (INIS)

    Pietrikova, Alena; Bednarcik, Jozef; Durisin, Juraj

    2011-01-01

    Research highlights: → In situ X-ray diffraction investigation enabled detailed analysis of the melting and solidification process of the SAC305 alloy. → It was found that the SAC305 solder melts at 230 deg. C. When cooling from 240 deg. C the SAC305 alloy solidifies at the temperature of 214 deg. C. During solidification β-Sn and Cu 6 Sn 5 is also formed. Formation of Ag 3 Sn occurs at 206 deg. C and the remaining amount of alloy crystallizes approximately at 160 deg. C. → Furthermore, observation of the thermal expansion behaviour of the β-Sn tetragonal unit cell revealed linear dependence of the unit cell volume on temperature. The unit cell parameters a and c also increase linearly with the temperature. Despite the fact that the c parameter is substantially smaller than parameter a, it exhibits a significantly higher linear thermal expansion coefficient. Comparison between data obtained during heating and cooling indicates that the thermal expansion coefficient is slightly greater in the case of cooling. - Abstract: In situ X-ray diffraction experiments, using synchrotron radiation, were employed to analyze microstructure evolution of the 96.5Sn3Ag0.5Cu (wt.%)-SAC305 lead-free solder alloy during heating (30-240 deg. C), isothermal dwell (240 deg. C) and cooling (240-30 deg. C). The special emphasis was placed on the study of the melting and solidification processes, explaining formation, distribution and the order of crystallization of the crystal phases (β-Sn, intermetallic compounds) in the solder alloy. Furthermore, thermal expansion behaviour of the main constituent phase β-Sn was analyzed prior to melting and after the consequent solidification.

  19. Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy

    DEFF Research Database (Denmark)

    Malik, Safdar Abbas; Le, Thanh Hung; Van Nong, Ngo

    2018-01-01

    and metallic electrodes. In this paper, we investigate the joining of ZnSb to Ni and Ag electrodes using a commercial solder alloy S-Bond 400 and hot-pressing technique. Ti and Cr layers are also introduced as a diffusion barrier and microstructure at the interfaces is observed by scanning electron microscopy....... We found that S-bond 400 solder reacts with Ag and Ni electrodes to form different alloys at the interfaces. Cr layer was found to be broken after joining, resulting in a thicker reaction/diffusion layer at the interface, while Ti layer was preserved....

  20. Damage Model for Reliability Assessment of Solder Joints in Wind Turbines

    DEFF Research Database (Denmark)

    Kostandyan, Erik; Sørensen, John Dalsgaard

    2012-01-01

    environmental factors. Reliability assessment for such type of products conventionally is performed by classical reliability techniques based on test data. Usually conventional reliability approaches are time and resource consuming activities. Thus in this paper we choose a physics of failure approach to define...... damage model by Miner’s rule. Our attention is focused on crack propagation in solder joints of electrical components due to the temperature loadings. Based on the proposed method it is described how to find the damage level for a given temperature loading profile. The proposed method is discussed...

  1. Decomposition studies of no-clean solder flux systems in connection with corrosion reliability of electronics

    DEFF Research Database (Denmark)

    Conseil, Helene; Jellesen, Morten Stendahl; Verdingovas, Vadimas

    2013-01-01

    with specific soldering process and parameters, while most important factors are the flux chemistry and its decomposition characteristics. Active parts of the flux residue can cause increased water absorption due to their hygroscopic nature and in solution they will increase leakage current and corrosion...... the contaminated PCBA parts to varying humidity and measuring the resulting leakage current. Results revealed a significant influence of flux chemistry including the amount of WOAs, while aggressiveness of the residue seems to vary with content and type of WOAs, and their nature of decomposition....

  2. Control of microstructure in soldered, brazed, welded, plated, cast or vapor deposited manufactured components

    Science.gov (United States)

    Ripley, Edward B.; Hallman, Russell L.

    2015-11-10

    Disclosed are methods and systems for controlling of the microstructures of a soldered, brazed, welded, plated, cast, or vapor deposited manufactured component. The systems typically use relatively weak magnetic fields of either constant or varying flux to affect material properties within a manufactured component, typically without modifying the alloy, or changing the chemical composition of materials or altering the time, temperature, or transformation parameters of a manufacturing process. Such systems and processes may be used with components consisting of only materials that are conventionally characterized as be uninfluenced by magnetic forces.

  3. Improved Switching Characteristics of Fast Power MOSFETs Applying Solder Bump Technology

    Directory of Open Access Journals (Sweden)

    Sibylle Dieckerhoff

    2008-01-01

    Full Text Available The impact of a reduced package stray inductance on the switching performance of fast power MOSFETs is discussed applying advanced 3D packaging technologies. Starting from an overview over new packaging approaches, a solder bump technology using a flexible PI substrate is exemplarily chosen for the evaluation. Measurement techniques to determine the stray inductance are discussed and compared with a numerical solution based on the PEEC method. Experimental results show the improvement of the voltage utilization while there is only a slight impact on total switching losses.

  4. In situ TEM observation of microcrack nucleation and propagation in pure tin solder

    International Nuclear Information System (INIS)

    Ding Ying; Wang Chunqing; Li, Mingyu; Wang Weiqiang

    2006-01-01

    Microcrack nucleation and propagation behavior in pure tin solder was investigated by using transmission electron microscopy (TEM) through in situ tensile test. Observation results showed that fracture process was completed in this visco-plastic material by connecting discontinuous cracks or voids. Depending on remarkable vacancy diffusion ability, microvoids were nucleated and developed in the dislocation free zone (DFZ) or super thinned area ahead of crack tip under local high stress concentration. The cracks were linked with each other by mutual dislocation emission which expedites the propagation of crack tips effectively

  5. Soldering Technology (6th) Proceedings of Annual Seminar, 17-18 February 1982.

    Science.gov (United States)

    1982-02-01

    aspect oF health and safety during this presentation. We are hoping that the work conducted by Van 2 Der Molen in the USA will clarify this issue. FLUX... Der Molen , PROC. OF 5th ANNUAL SEMINAR SOLDERING TECHNOLOGY, Naval Weapons Centre, China Lake, California, February 1981. 3. Burge, Perks, O’Brien...developed a new and innovative solution, which we believe to be a significant advance in the state of the art. In this new design (Fig.l) a FM DER

  6. Miniaturization of Micro-Solder Bumps and Effect of IMC on Stress Distribution

    Science.gov (United States)

    Choudhury, Soud Farhan; Ladani, Leila

    2016-07-01

    As the joints become smaller in more advanced packages and devices, intermetallic (IMCs) volume ratio increases, which significantly impacts the overall mechanical behavior of joints. The existence of only a few grains of Sn (Tin) and IMC materials results in anisotropic elastic and plastic behavior which is not detectable using conventional finite element (FE) simulation with average properties for polycrystalline material. In this study, crystal plasticity finite element (CPFE) simulation is used to model the whole joint including copper, Sn solder and Cu6Sn5 IMC material. Experimental lap-shear test results for solder joints from the literature were used to validate the models. A comparative analysis between traditional FE, CPFE and experiments was conducted. The CPFE model was able to correlate the experiments more closely compared to traditional FE analysis because of its ability to capture micro-mechanical anisotropic behavior. Further analysis was conducted to evaluate the effect of IMC thickness on stress distribution in micro-bumps using a systematic numerical experiment with IMC thickness ranging from 0% to 80%. The analysis was conducted on micro-bumps with single crystal Sn and bicrystal Sn. The overall stress distribution and shear deformation changes as the IMC thickness increases. The model with higher IMC thickness shows a stiffer shear response, and provides a higher shear yield strength.

  7. Soldered Power Arm: An Easy and Effective Method for Intrusion and Retraction of Anterior Teeth

    Directory of Open Access Journals (Sweden)

    Ketan K Vakil

    2014-01-01

    Full Text Available The orthodontic correction of deep overbite can be achieved with several mechanisms that will result in true intrusion of anterior teeth, extrusion of posterior teeth, or a combination of both. For the orthodontic correction of bimaxillary dentoalveolar protrusion with deep bite, there are several treatment modalities like segmented arch approach, retraction and intrusion utility arches, temporary anchorage devices. Though not a novel therapeutic concept, the use of miniscrew implants to obtain absolute anchorage has recently become very popular in clinical orthodontic approaches. To allow the use of sliding mechanics for bodily retraction with intrusion of anterior teeth, we devised a soldered power arm (SPA on standard molar tube. It is simple, stable, precise and effective in cases where anterior teeth need to be simultaneously retracted and intruded. A power arm can be readily fabricated from 20 gauge stainless steel wire and soldered on the molar buccal tube so as to avoid any distortion or loosening of power arm from molar tube during the course of the treatment. The SPA works efficiently with the molar being stabilized in all three planes of space. The resultant force vector is directed more apically toward the center of resistance of the anchor unit, which resulted in the treatment outcome of retraction and intrusion of the anterior teeth and correction of the deep bite.

  8. Electromigration in 3D-IC scale Cu/Sn/Cu solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Ho, Cheng-En, E-mail: ceho1975@hotmail.com; Lee, Pei-Tzu; Chen, Chih-Nan; Yang, Cheng-Hsien

    2016-08-15

    The electromigration effect on the three-dimensional integrated circuits (3D-IC) scale solder joints with a Cu/Sn(25–50 μm)/Cu configuration was investigated using a field-emission scanning electron microscope (FE–SEM) combined with electron backscatter diffraction (EBSD) analysis system. Electron current stressing for a few days caused the pronounced accumulation of Cu{sub 6}Sn{sub 5} in specific Sn grain boundaries (GBs). The EBSD analysis indicated that both the β-Sn crystallographic orientation and GB orientation play dominant roles in this accumulation. The dependencies of the Cu{sub 6}Sn{sub 5} accumulation on the two above factors (i.e., Sn grain orientation and GB orientation) can be well rationalized via a proposed mathematic model based on the Huntington and Grone's electromigration theory with the Cu anisotropic diffusion data in a β-Sn lattice. - Highlights: • Anisotropic Cu electromigration in the 3D-IC scale microelectronic solder joints. • Pronounced accumulation of Cu{sub 6}Sn{sub 5} intermetallic in specific Sn grain boundaries. • A linear dependence of Cu{sub 6}Sn{sub 5} accumulation over the current stressing time. • β-Sn and grain boundary orientations are the dominant factors in Cu{sub 6}Sn{sub 5} accumulation.

  9. Economical surface treatment of die casting dies to prevent soldering in high pressure casting

    International Nuclear Information System (INIS)

    Fraser, D.T.; Jahedi, M.Z.

    2001-01-01

    This paper describes the use of a gas oxidation treatment of H13 tool steel to develop a compact iron oxide layer at the surface of core pins to prevent soldering in high pressure die casting. The performance of oxide layers in the protection of die steel against soldering during high pressure die casting was tested in a specially designed die using removable core pins and Al-11 Si-3 Cu casting alloy. The gas oxidation treatment can be applied at low temperatures and to large areas of the die surface. In addition this process is very cost effective compared to other coating processes such as physical vapour deposition (PVD), or thermo-reactive diffusion (TRD) coatings. This work demonstrated that surface treatment producing pure magnetite (Fe 3 O 4 ) layers are more protective than oxide layers containing a combination of Fe 3 O 4 (magnetite) and Fe 3 O 3 (haematite). The magnetite layer acts as a barrier between the die steel/casting alloy interface and prevents the formation of inter-metallic phases. Optical microscopy and scanning electron microscope were used to determine the thickness of the oxide layer, while X-ray diffraction was performed to determine the oxide phase structure

  10. Assessment of the effects of the Japanese shift to lead-free solders and its impact on material substitution and environmental emissions by a dynamic material flow analysis

    International Nuclear Information System (INIS)

    Fuse, Masaaki; Tsunemi, Kiyotaka

    2012-01-01

    Lead-free electronics has been extensively studied, whereas their adoption by society and their impact on material substitution and environmental emissions are not well understood. Through a material flow analysis (MFA), this paper explores the life cycle flows for solder-containing metals in Japan, which leads the world in the shift to lead-free solders in electronics. The results indicate that the shift has been progressing rapidly for a decade, and that substitutes for lead in solders, which include silver and copper, are still in the early life cycle stages. The results also show, however, that such substitution slows down during the late life cycle stages owing to long electronic product lifespans. This deceleration of material substitution in the solder life cycle may not only preclude a reduction in lead emissions to air but also accelerate an increase in silver emissions to air and water. As an effective measure against ongoing lead emissions, our scenario analysis suggests an aggressive recycling program for printed circuit boards that utilizes an existing recycling scheme. -- Highlights: ► We model the life cycle flows for solder-containing metals in Japan. ► The Japanese shift to lead-free solders progresses rapidly for a decade. ► Substitution for lead in solders slows down during the late life cycle stages. ► The deceleration of substitution precludes a reduction in lead emissions to air.

  11. The Shear Strength and Fracture Behavior of Sn-Ag- xSb Solder Joints with Au/Ni-P/Cu UBM

    Science.gov (United States)

    Lee, Hwa-Teng; Hu, Shuen-Yuan; Hong, Ting-Fu; Chen, Yin-Fa

    2008-06-01

    This study investigates the effects of Sb addition on the shear strength and fracture behavior of Sn-Ag-based solders with Au/Ni-P/Cu underbump metallization (UBM) substrates. Sn-3Ag- xSb ternary alloy solder joints were prepared by adding 0 wt.% to 10 wt.% Sb to a Sn-3.5Ag alloy and joining them with Au/Ni-P/Cu UBM substrates. The solder joints were isothermally stored at 150°C for up to 625 h to study their microstructure and interfacial reaction with the UBM. Single-lap shear tests were conducted to evaluate the mechanical properties, thermal resistance, and failure behavior. The results show that UBM effectively suppressed intermetallic compound (IMC) formation and growth during isothermal storage. The Sb addition helped to refine the Ag3Sn compounds, further improving the shear strength and thermal resistance of the solders. The fracture behavior evolved from solder mode toward the mixed mode and finally to the IMC mode with increasing added Sb and isothermal storage time. However, SnSb compounds were found in the solder with 10 wt.% Sb; they may cause mechanical degradation of the solder after long-term isothermal storage.

  12. Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

    Directory of Open Access Journals (Sweden)

    Shuye Zhang

    2018-01-01

    Full Text Available Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile electronic applications. However, crack formation of the solder joint crack was occurred at low temperature curable acrylic polymer resins after bonding processes. In this study, the mechanism of SnBi58 solder joint crack at low temperature curable acrylic adhesive was investigated. In addition, SnBi58 solder joint cracks can be significantly removed by increasing the storage modulus of adhesives instead of coefficient of thermal expansion. The first approach of reducing the amount of polymer rebound can be achieved by using an ultrasonic bonding method to maintain a bonding pressure on the SnBi58 solder joints cooling to room temperature. The second approach is to increase storage modulus of adhesives by adding silica filler into acrylic polymer resins to prevent the solder joint from cracking. Finally, excellent acrylic based SnBi58 solder joints reliability were obtained after 1000 cycles thermal cycling test.

  13. Observations on the ductility of zircaloy-2 under simultaneous tension and bending

    International Nuclear Information System (INIS)

    Pettersson, K.

    1975-01-01

    The ductility of Zircaloy-2 in creep-fatigue interaction tests has been found to exceed the ductility in separate tensile tests. It was shown that the increase of ductility was due to either the suppression of the localized shear band instability causing final failure in a tensile test, or because the hydrostatic tension-shear stress ratio in the creep-fatigue test is lower than in the tensile test. Possible applications of the ductility increase in forming operations are suggested. (author)

  14. Basic Mechanisms Leading to Fatigue Failure of Structural Materials

    Czech Academy of Sciences Publication Activity Database

    Polák, Jaroslav; Petráš, Roman; Mazánová, Veronika

    2016-01-01

    Roč. 69, č. 2 (2016), s. 289-294 ISSN 0972-2815. [International Conference on CREEP , FATIGUE and CREEP -FATIGUE INTERACTION /7./. Kalpakkam, 19.01.2016-22.01.2016] R&D Projects: GA ČR(CZ) GA13-23652S Institutional support: RVO:68081723 Keywords : Damage mechanism * Fatigue crack initiation * Austenitic steel * Oxide cracking Subject RIV: JL - Materials Fatigue, Friction Mechanics Impact factor: 0.533, year: 2016

  15. Interaction fatigue-creep-environment in an austenitic stainless steel Z2 CND 17-13 (Type 316 L) at 600 and 650 deg C. Microstructural evolution and damage

    International Nuclear Information System (INIS)

    Rezgui, B.

    1982-12-01

    The resistance of steel to continuous fatigue is directly related to its behaviour towards the surroundings (oxidation). This interaction considerably lowers resistance to crack initiation but has no effect on propagation, and rupture is transgranular. Conversely the influence of the environment is negligible under fatigue conditions with a hold time and rupture becomes intergranular whatever the surroudings. Cavities are created inside the material during the hold time and their interaction with each other and with cracks from the surface are the factors responsible for the degradation of fatigue properties. Transgranular rupture initiated in slip bands, which characterises damage by pure fatigue, is gradually replaced by intergranular rupture under fatigue with hold time. Meanwhile a new deformation mode appears: intergranular slip. The longer the hold time the stronger its effect, a tendency offset at high temperature. Hold time, temperature and deformation promote dynamic structural aging and restoration in the material. Since the mechanisms and kinetics of creep fatigue damage are different according to the deformation level and the hold time duration it would not be safe to extrapolate the results [fr

  16. Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature

    Energy Technology Data Exchange (ETDEWEB)

    Prabhu, K.N., E-mail: prabhukn_2002@yahoo.co.in [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India); Deshapande, Parashuram; Satyanarayan [Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore 575 025 (India)

    2012-01-30

    Highlights: Black-Right-Pointing-Pointer Effect of cooling rate on tensile and impact properties of Sn-9Zn alloy was assessed. Black-Right-Pointing-Pointer Both DBTT and UTS of the solder alloy increased with increase in cooling rate. Black-Right-Pointing-Pointer An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile-brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn-9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 Degree-Sign C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the

  17. Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature

    International Nuclear Information System (INIS)

    Prabhu, K.N.; Deshapande, Parashuram; Satyanarayan

    2012-01-01

    Highlights: ► Effect of cooling rate on tensile and impact properties of Sn–9Zn alloy was assessed. ► Both DBTT and UTS of the solder alloy increased with increase in cooling rate. ► An optimum cooling rate during solidification would minimize DBTT and maximize UTS. - Abstract: Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile–brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn–9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 °C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the DBTT.

  18. Interfacial Microstructure and Shear Strength of Brazed Cu-Cr-Zr Alloy Cylinder and Cylindrical Hole by Au Based Solder

    Directory of Open Access Journals (Sweden)

    Zaihua Li

    2017-07-01

    Full Text Available Au-Ge-Ni solder was chosen for brazing of the Cu-Cr-Zr alloy cylinder and a part with a cylindrical hole (sleeve below 550 °C. The Au based solder was first sintered on the surface of the cylinder and then brazed to the inner surface of the sleeve. The effects of the heating process, the temperature and the holding time at the temperature on the microstructure of the sintered layer on the surface of the cylinder, the brazed interfacial microstructure, and the brazed shear strength between the cylinder and the sleeve were investigated by scanning electron microscope, energy dispersive X-ray spectroscopy analysis, and tensile shear tests. By approach of side solder melt feeding and brazing under proper parameters, the voids and micro cracks due to a lack of enough solder melt feeding are greatly lessened and the brazed shear strength of 100 MPa is ensured even with large clearances around 0.01 mm.

  19. Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints

    International Nuclear Information System (INIS)

    Dudek, M.A.; Hunter, L.; Kranz, S.; Williams, J.J.; Lau, S.H.; Chawla, N.

    2010-01-01

    The volume, size, and dispersion of porosity in solder joints are known to affect mechanical performance and reliability. Most of the techniques used to characterize the three-dimensional (3D) nature of these defects are destructive. With the enhancements in high resolution computed tomography (CT), the detection limits of intrinsic microstructures have been significantly improved. Furthermore, the 3D microstructure of the material can be used in finite element models to understand their effect on microscopic deformation. In this paper we describe a technique utilizing high resolution (< 1 μm) X-ray tomography for the three-dimensional (3D) visualization of pores in Sn-3.9Ag-0.7Cu/Cu joints. The characteristics of reflow porosity, including volume fraction and distribution, were investigated for two reflow profiles. The size and distribution of porosity size were visualized in 3D for four different solder joints. In addition, the 3D virtual microstructure was incorporated into a finite element model to quantify the effect of voids on the lap shear behavior of a solder joint. The presence, size, and location of voids significantly increased the severity of strain localization at the solder/copper interface.

  20. In-situ Investigation of Lead-free Solder Alloy Formation Using a Hot-plate Microscope

    DEFF Research Database (Denmark)

    Bergmann, René; Tang, Peter Torben; Hansen, Hans Nørgaard

    2007-01-01

    This work presents the advantages of using a hot-plate microscope for investigation of new (high-temperature) lead- free solders as in-situ analysis tool and preparation equipment. A description of the equipment and the preparation method is given and some examples are outlined. The formation...

  1. Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders

    Science.gov (United States)

    Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

    2016-12-01

    Particles of Cu x Al y in Sn-Cu-Al solders have previously been shown to nucleate the Cu6Sn5 phase during solidification. In this study, the number and size of Cu6Sn5 nucleation sites were controlled through the particle size refinement of Cu x Al y via rapid solidification processing and controlled cooling in a differential scanning calorimeter. Cooling rates spanning eight orders of magnitude were used to refine the average Cu x Al y and Cu6Sn5 particle sizes down to submicron ranges. The average particle sizes, particle size distributions, and morphologies in the microstructures were analyzed as a function of alloy composition and cooling rate. Deep etching of the samples revealed the three-dimensional microstructures and illuminated the epitaxial and morphological relationships between the Cu x Al y and Cu6Sn5 phases. Transitions in the Cu6Sn5 particle morphologies from faceted rods to nonfaceted, equiaxed particles were observed as a function of both cooling rate and composition. Initial solidification cooling rates within the range of 103 to 104 °C/s were found to be optimal for realizing particle size refinement and maintaining the Cu x Al y /Cu6Sn5 nucleant relationship. In addition, little evidence of the formation or decomposition of the ternary- β phase in the solidified alloys was noted. Solidification pathways omitting the formation of the ternary- β phase agreed well with observed room temperature microstructures.

  2. Measurement of erosion of stainless steel by molten lead-free solder using micro-focus x-ray CT system

    International Nuclear Information System (INIS)

    Nishikawa, Hiroshi; Takemoto, Tadashi; Kang, Songai

    2009-01-01

    The severe erosion damage, which is caused by a molten lead-free solder, of wave solder equipment made into stainless steel has been encountered in operation. Then, the higher maintenance frequency and reduced life time of wave solder machine component is a serious issue in a manufacturing process. In this study, the evaluation method of erosion of stainless steel by molten lead-free solders was investigated using micro-focus X-ray systems for fluoroscopic and computed tomography (CT). As a result, it was found that the fluoroscopic image could truly reconstruct the cross-shape of the stainless steel sample after immersion test without destruction. In the case of X-ray systems for fluoroscopic and CT used in this study, three-dimensional data can be obtained. Therefore, it was possible to easily check the whole picture of the test sample after immersion test and to decide the maximum erosion depth of test sample. (author)

  3. Study on Mitigation Method of Solder Corrosion for Crystalline Silicon Photovoltaic Modules

    Directory of Open Access Journals (Sweden)

    Ju-Hee Kim

    2014-01-01

    Full Text Available The corrosion of 62Sn36Pb2Ag solder connections poses serious difficulties for outdoor-exposed photovoltaic (PV modules, as connection degradation contributes to the increase in series resistance (RS of PV modules. In this study, we investigated a corrosion mitigation method based on the corrosion mechanism. The effect of added sacrificial metal on the reliability of PV modules was evaluated using the oxidation-reduction (redox reaction under damp heat (DH conditions. Experimental results after exposure to DH show that the main reason for the decrease in power was a drop in the module’s fill factor. This drop was attributed to the increase of RS. The drop in output power of the PV module without added sacrificial metal is greater than that of the sample with sacrificial metal. Electroluminescence and current-voltage mapping analysis also show that the PV module with sacrificial metal experienced less degradation than the sample without sacrificial metal.

  4. Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

    DEFF Research Database (Denmark)

    Sopousek, J.; Palcut, Marián; Hodúlová, Erika

    2010-01-01

    The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching...... to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry...

  5. Determination of Te in soldering tin using continuous flowing electrochemical hydride generation atomic fluorescence spectrometry

    International Nuclear Information System (INIS)

    Jiang Xianjuan; Gan Wuer; Han Suping; He Youzhao

    2008-01-01

    An electrochemical hydride generation system was developed for the detection of Te by coupling an electrochemical hydride generator with atomic fluorescence spectrometry. Since TeH 2 is unstable and easily decomposes in solution, a reticular W filament cathode was used in the present system. The TeH 2 generated on the cathode surface was effectively driven out by sweeping gas from the cathode chamber. In addition, a low temperature electrochemical cell (10 deg. C) was applied to reduce the decomposition of TeH 2 in solution. The limit of detection (LOD) was 2.2 ng ml -1 and the relative standard deviation (RSD) was 3.9% for nine consecutive measurements of standard solution. This method was successfully employed for determination of Te in soldering tin material

  6. Beta-Tin Grain Formation in Aluminum-Modified Lead-Free Solder Alloys

    Science.gov (United States)

    Reeve, Kathlene N.; Handwerker, Carol A.

    2018-01-01

    The limited number of independent β-Sn grain orientations that typically form during solidification of Sn-based solders and the resulting large β-Sn grain size have major effects on overall solder performance and reliability. This study analyzes whether additions of Al to Sn-Cu and Sn-Cu-Ag alloys can be used to change the grain size, morphology, and twinning structures of atomized (as-solidified) and re-melted (reflowed) β-Sn dendrites as determined using scanning electron microscopy and electron backscatter diffraction for as-solidified and reflow cycled (20-250°C, 1-5 cycles) Sn-Cu-Al and Sn-Ag-Cu-Al drip atomized spheres (260 μm diameter). The resulting microstructures were compared to as-solidified and reflow cycled Sn-Ag-Cu spheres (450 μm diameter) as well as as-solidified Sn-Ag-Cu, Sn-Cu, and Sn-Ag microstructures from the literature. Previous literature observations reporting reductions in undercooling and β-Sn grain size with Al micro-alloying additions could not be correlated to the presence of the Cu9Al4 phase or Al solute. The as-solidified spheres displayed no change in β-Sn dendrite structure or grain size when compared to non-Al-modified alloys, and the reflow cycled spheres produced high undercoolings (22-64°C), indicating a lack of potent nucleation sites. The current findings highlighted the role of Ag in the formation of the interlaced twinning structure and demonstrated that with deliberate compositional choices, formation of the alloy's β-Sn grain structure (cyclical twinning versus interlaced twinning) could be influenced, in both the as-solidified and reflow cycled states, though still not producing the fine-grain sizes and multiple orientations desired for improved thermomechanical properties.

  7. Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Chih-Yao [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Hon, Min-Hsiung [Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China); Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 415 Chien-Kung Road, Kaohsiung 80782, Taiwan (China); Wang, Moo-Chin, E-mail: mcwang@kmu.edu.tw [Department of Fragrance and Cosmetic Science, Kaohsiung Medical University, 100, Shih-Chuan 1st Road, Kaohsiung 80728, Taiwan (China); Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long [Institute of Nanotechnology and Microsystems Engineering, National Cheng Kung University, No. 1, University Road, Tainan 70101, Taiwan (China)

    2014-01-05

    Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag{sub 3}Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn{sub 3}. No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging.

  8. Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

    International Nuclear Information System (INIS)

    Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin; Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long

    2014-01-01

    Highlights: • The microstructure of these solder alloys are composed of Sn-rich phase and Ag 3 Sn. • The grain size of Sn–9Zn–1.5Ag–xBi solder alloys increases with rose aging time. • The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloys. • TEM observed that Bi appears as oblong shape fine particles. -- Abstract: The effects of aging time on the mechanical properties of the Sn–9Zn–1.5Ag–xBi lead-free solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction (XRD), transmission electron microscopy (TEM), selected area electron diffraction (SAED), energy dispersive spectrometry (EDS) and a universal testing machine. The experimental results show that the microstructure of Sn–9Zn–1.5Ag–xBi solder alloys is composed of Sn-rich phase and AgZn 3 . No other intermetallic compounds (IMCs) with Bi content was observed in the solder matrix for Sn–9Zn–1.5Ag solder alloys with various Bi contents before and after aging at 150 °C for different durations. The lattice parameter increases significantly with increasing aging time or Bi addition. The size of Sn-rich grain increased gradually with aging time increased, but decreases with Bi content increases. The maximum yield strength is 112.7 ± 2.2 MPa for Sn–9Zn–1.5Ag–3Bi solder alloy before aging

  9. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

    International Nuclear Information System (INIS)

    Sujan, G.K.; Haseeb, A.S.M.A.; Afifi, A.B.M.

    2014-01-01

    Lead free solders currently in use are prone to develop thick interfacial intermetallic compound layers with rough morphology which are detrimental to the long term solder joint reliability. A novel method has been developed to control the morphology and growth of intermetallic compound layers between lead-free Sn–3.0Ag–0.5Cu solder ball and copper substrate by doping a water soluble flux with metallic nanoparticles. Four types of metallic nanoparticles (nickel, cobalt, molybdenum and titanium) were used to investigate their effects on the wetting behavior and interfacial microstructural evaluations after reflow. Nanoparticles were dispersed manually with a water soluble flux and the resulting nanoparticle doped flux was placed on copper substrate. Lead-free Sn–3.0Ag–0.5Cu solder balls of diameter 0.45 mm were placed on top of the flux and were reflowed at a peak temperature of 240 °C for 45 s. Angle of contact, wetting area and interfacial microstructure were studied by optical microscopy, field emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. It was observed that the angle of contact increased and wetting area decreased with the addition of cobalt, molybdenum and titanium nanoparticles to flux. On the other hand, wettability improved with the addition of nickel nanoparticles. Cross-sectional micrographs revealed that both nickel and cobalt nanoparticle doping transformed the morphology of Cu 6 Sn 5 from a typical scallop type to a planer one and reduced the intermetallic compound thickness under optimum condition. These effects were suggested to be related to in-situ interfacial alloying at the interface during reflow. The minimum amount of nanoparticles required to produce the planer morphology was found to be 0.1 wt.% for both nickel and cobalt. Molybdenum and titanium nanoparticles neither appear to undergo alloying during reflow nor have any influence at the solder/substrate interfacial reaction. Thus, doping of flux

  10. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

    Energy Technology Data Exchange (ETDEWEB)

    Sujan, G.K., E-mail: sgkumer@gmail.com; Haseeb, A.S.M.A., E-mail: haseeb@um.edu.my; Afifi, A.B.M., E-mail: amalina@um.edu.my

    2014-11-15

    Lead free solders currently in use are prone to develop thick interfacial intermetallic compound layers with rough morphology which are detrimental to the long term solder joint reliability. A novel method has been developed to control the morphology and growth of intermetallic compound layers between lead-free Sn–3.0Ag–0.5Cu solder ball and copper substrate by doping a water soluble flux with metallic nanoparticles. Four types of metallic nanoparticles (nickel, cobalt, molybdenum and titanium) were used to investigate their effects on the wetting behavior and interfacial microstructural evaluations after reflow. Nanoparticles were dispersed manually with a water soluble flux and the resulting nanoparticle doped flux was placed on copper substrate. Lead-free Sn–3.0Ag–0.5Cu solder balls of diameter 0.45 mm were placed on top of the flux and were reflowed at a peak temperature of 240 °C for 45 s. Angle of contact, wetting area and interfacial microstructure were studied by optical microscopy, field emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. It was observed that the angle of contact increased and wetting area decreased with the addition of cobalt, molybdenum and titanium nanoparticles to flux. On the other hand, wettability improved with the addition of nickel nanoparticles. Cross-sectional micrographs revealed that both nickel and cobalt nanoparticle doping transformed the morphology of Cu{sub 6}Sn{sub 5} from a typical scallop type to a planer one and reduced the intermetallic compound thickness under optimum condition. These effects were suggested to be related to in-situ interfacial alloying at the interface during reflow. The minimum amount of nanoparticles required to produce the planer morphology was found to be 0.1 wt.% for both nickel and cobalt. Molybdenum and titanium nanoparticles neither appear to undergo alloying during reflow nor have any influence at the solder/substrate interfacial reaction. Thus, doping

  11. Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

    Science.gov (United States)

    Mukherjee, S.; Chauhan, P.; Osterman, M.; Dasgupta, A.; Pecht, M.

    2016-07-01

    Mechanistic microstructural models have been developed to capture the effect of isothermal aging on time dependent viscoplastic response of Sn3.0Ag0.5Cu (SAC305) solders. SnAgCu (SAC) solders undergo continuous microstructural coarsening during both storage and service because of their high homologous temperature. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long term reliability of microelectronic packages. It is well documented that isothermal aging degrades the creep resistance of SAC solder. SAC305 alloy is aged for (24-1000) h at (25-100)°C (~0.6-0.8 × T melt). Cross-sectioning and image processing techniques were used to periodically quantify the effect of isothermal aging on phase coarsening and evolution. The parameters monitored during isothermal aging include size, area fraction, and inter-particle spacing of nanoscale Ag3Sn intermetallic compounds (IMCs) and the volume fraction of micronscale Cu6Sn5 IMCs, as well as the area fraction of pure tin dendrites. Effects of microstructural evolution on secondary creep constitutive response of SAC305 solder joints were then modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs in the eutectic phase; and (2) load sharing between pro-eutectic Sn dendrites and the surrounding coarsened eutectic Sn-Ag phase and microscale Cu6Sn5 IMCs. The coarse-grained polycrystalline Sn microstructure in SAC305 solder was not captured in the above model because isothermal aging does not cause any significant change in the initial grain size and orientation of SAC305 solder joints. The above mechanistic model can successfully capture the drop in creep resistance due to the influence of isothermal aging on SAC305 single crystals. Contribution of grain boundary sliding to the creep strain of

  12. Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

    Science.gov (United States)

    Kotadia, H. R.; Panneerselvam, A.; Mokhtari, O.; Green, M. A.; Mannan, S. H.

    2012-04-01

    The interfacial intermetallic compound (IMC) formation between Cu substrate and Sn-3.8Ag-0.7Cu-X (wt.%) solder alloys has been studied, where X consists of 0-5% Zn or 0-2% Al. The study has focused on the effect of solder volume as well as the Zn or Al concentration. With low solder volume, when the Zn and Al concentrations in the solder are also low, the initial Cu-Zn and Al-Cu IMC layers, which form at the solder/substrate interface, are not stable and spall off, displaced by a Cu6Sn5 IMC layer. As the total Zn or Al content in the system increases by increasing solder volume, stable CuZn or Al2Cu IMCs form on the substrate and are not displaced. Increasing concentration of Zn has a similar effect of stabilizing the Cu-Zn IMC layer and also of forming a stable Cu5Zn8 layer, but increasing Al concentration alone does not prevent spalling of Al2Cu. These results are explained using a combination of thermodynamic- and kinetics-based arguments.

  13. Aging effects on the microstructure, surface characteristics and wettability of Cu pretinned with Sn-Pb solders

    Energy Technology Data Exchange (ETDEWEB)

    Linch, Heidi Sue [Univ. of California, Berkeley, CA (United States)

    1993-11-01

    This study investigates effects of aging in air and argon at 170 C on Cu coupons which were pretinned with 75Sn-25Pb, 8Sn-92Pb, and 5Sn-95Pb solders. Coatings were applied using electroplating or hot dipping techniques. The coating thickness was controlled between 3 to 3μm and the specimens were aged for 0 hours, 2 hours, 24 hours and 2 weeks. Wetting balance tests were used to evaluate the wettability of the test specimens. Microstructural development was evaluated using X-ray diffraction, energy dispersive X-ray and Auger spectroscopy, as well as optical and scanning electron microscopy. The wetting behavior of the test specimens is interpreted with respect to observed microstructural changes and as a function of aging time, solder composition, and processing conditions.

  14. Tin-silver and tin-copper alloys for capillarity joining-soft soldering-of copper piping

    International Nuclear Information System (INIS)

    Duran, J.; Amo, J. M.; Duran, C. M.

    2001-01-01

    It is studied the influence of the type of alloy used as filling material on the defects of the soldering joints in copper piping installations, which induce the fluid leak of the systems. The different eutectic temperatures and solidus-liquidus ranges of these alloys, require the setting of the soldering heat input in each case to obtain the suitable capillarity features and alloying temperatures to achieve for the correct formation of the bonding. Most defects in the joints are demonstrated to be generated by bad dossification of thermal inputs, which led depending on the filler alloy used to variations in its fluidity that may produce penetration failures in the bonds or insufficient consistency for the filling of the joints. (Author) 7 refs

  15. Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

    Science.gov (United States)

    Barbagallo, C.; Malgioglio, G. L.; Petrone, G.; Cammarata, G.

    2017-05-01

    For power devices, the reliability of thermal fatigue induced by thermal cycling has been prioritized as an important concern. The main target of this work is to apply a numerical procedure to assess the fatigue life for lead-free solder joints, that represent, in general, the weakest part of the electronic modules. Starting from a real multi-chip power module, FE-based models were built-up by considering different conditions in model implementation in order to simulate, from one hand, the worst working condition for the module and, from another one, the module standing into a climatic test room performing thermal cycles. Simulations were carried-out both in steady and transient conditions in order to estimate the module thermal maps, the stress-strain distributions, the effective plastic strain distributions and finally to assess the number of cycles to failure of the constitutive solder layers.

  16. Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

    International Nuclear Information System (INIS)

    Barbagallo, C; Petrone, G; Cammarata, G; Malgioglio, G L

    2017-01-01

    For power devices, the reliability of thermal fatigue induced by thermal cycling has been prioritized as an important concern. The main target of this work is to apply a numerical procedure to assess the fatigue life for lead-free solder joints, that represent, in general, the weakest part of the electronic modules. Starting from a real multi-chip power module, FE-based models were built-up by considering different conditions in model implementation in order to simulate, from one hand, the worst working condition for the module and, from another one, the module standing into a climatic test room performing thermal cycles. Simulations were carried-out both in steady and transient conditions in order to estimate the module thermal maps, the stress-strain distributions, the effective plastic strain distributions and finally to assess the number of cycles to failure of the constitutive solder layers. (paper)

  17. Aging effects on fracture behavior of 63Sn37Pb eutectic solder during tensile tests under the SEM

    International Nuclear Information System (INIS)

    Ding Ying; Wang Chunqing; Li Mingyu; Bang Hansur

    2004-01-01

    This study investigates the influence of aging treatment on fracture behavior of Sn-Pb eutectic solder alloys at different loading rate regime during tensile tests under the scanning electron microscope. In high homologous temperature, the solder exhibit the creep behavior that could be confirmed through the phenomena of grain boundary sliding (GBS) to both as-cast and aged specimens. Owing to the large grain scale after high temperature storage, boundary behavior was limited to some extent for the difficulty in grain rotation and boundary migration. Instead, drastic intragranular deformation occurred. Also, the phase coarsening weakened the combination between lead-rich phase and tin matrix. Consequently, surface fragmentation was detected for the aged specimens. Furthermore, the fracture mechanism changed from intergranular dominated to transgranular dominated with increasing loading rate to both specimens during early stage

  18. Influence of intermetallic growth on the mechanical properties of Zn–Sn–Cu–Bi/Cu solder joints

    Energy Technology Data Exchange (ETDEWEB)

    Xing, Fei; Yao, Jia; Liang, Jingwei; Qiu, Xiaoming, E-mail: qiuxm13@163.com

    2015-11-15

    The formation of intermetallic reaction layers and their influence on shear strength and fractography was investigated between the Zn–Sn–Cu–Bi (ZSCB) and Cu substrate during the liquid state reaction at 450 °C after 10–90 s. Results showed that reliable solder joints could be obtained at 450 °C after 15–30 s of wetting, accompanied by the creation of scallop ε-CuZn{sub 5}, flat γ-Cu{sub 5}Zn{sub 8} and β-CuZn intermetallic layers in ZSCB/Cu interface. However, with excess increase of soldering time, a transient intermetallic ε-CuZn{sub 4} phase was nuclear and grew at ε-CuZn{sub 5}/γ-Cu{sub 5}Zn{sub 8} interface, which apparently deteriorated the shear strength of solder joints from 76.5 MPa to 51.6 MPa. The sensitivity of the fracture proportion was gradually transformed from monotonic ε-CuZn{sub 5} to the mixture of ε-CuZn{sub 4} and ε-CuZn{sub 5} intermetallic cleavage. Furthermore, the growth mechanism of ε-CuZn{sub 4} intermetallic phase at the ZSCB/Cu interface was discussed. - Highlights: • There are four interfacial intermetallic layers formed at the Zn–Sn–Cu–Bi/Cu interface. • The growth mechanism of ε-CuZn{sub 4} intermetallic phase was discussed. • The wetting time of Zn–Sn–Cu–Bi solder in contact with Cu substrate is a key parameter.

  19. Behavior of Sn-0.7Cu-xZn lead free solder on physical properties and micro structure

    Science.gov (United States)

    Siahaan, Erwin

    2017-09-01

    The issues to substitute Tin-Lead Solders is concerning the health and environmental hazards that is caused by lead, and also legislative actions around the world regarding lead toxicity, which has prompted the research community to attempt to replace solder alloys for the traditional Sn-Pb alloys lead which has been used by industrial worker throughout history because it is easily extracted and refined at a relatively low energy cost and also has a range of useful properties. Traditional industry lead has been used in soldering materials for electronic applications because it has low melting point and a soft, malleable nature, when combined with tin at the eutectic composition which causes the alloy to flow easily in the liquid state and solidifies over a very small range of temperature. One of the potential candidate to replace tin-lead solder is Sn-Cu-Zn eutectic alloy as it has a lower melting temperature. Consequently, it is of interest to determine what reactions can occur in ternary systems derived from the Sn-Cu-Zn eutectic. One such system is Sn-0.7Cu-xZn. The specimen was elaborated on physical properties. The chemical content was analyzed by using Shimadzu XRD and melting point was analyzed by using Differential Scanning Calorimeter ( DSC ). The results has shown that the highest addition of Zinc content (15%Zn) will decrease the melting temperatur to 189°C compared to Sn-Pb at 183°C Increasing the amount of Zn on Sn0.7Cu-xZn alloys will decrease Cu3Sn intermetallic coumpound.

  20. Electromigration-induced cracks in Cu/Sn3.5Ag/Cu solder reaction couple at room temperature

    International Nuclear Information System (INIS)

    He Hongwen; Xu Guangchen; Guo Fu

    2009-01-01

    Electromigration (EM) behavior of Cu/Sn 3.5 Ag/Cu solder reaction couple was investigated with a high current density of 5 x 10 3 A/cm 2 at room temperature. One dimensional structure, copper wire/solder ball/copper wire SRC was designed and fabricated to dissipate the Joule heating induced by the current flow. In addition, thermomigration effect was excluded due to the symmetrical structure of the SRC. The experimental results indicated that micro-cracks initially appeared near the cathode interface between solder matrix and copper substrate after 474 h current stressing. With current stressing time increased, the cracks propagated and extended along the cathode interface. It should be noted that the continuous Cu 6 Sn 5 intermetallic compounds (IMCs) layer both at the anode and at the cathode remained their sizes. Interestingly, tiny cracks appeared at the root of some long column-type Cu 6 Sn 5 at the cathode interface due to the thermal stress.