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Sample records for sio4 tetrahedra interconnected

  1. Quadrilaterals and Tetrahedra

    Science.gov (United States)

    Mammana, Maria Flavia; Micale, Biagio; Pennisi, Mario

    2009-01-01

    In this note we show the existence of a surprising analogy between quadrilaterals and tetrahedra, determining some properties that hold for both families of figures. This analogy suggests some new properties of quadrilaterals. (Contains 11 figures,)

  2. Navigating Weighted Regions with Scattered Skinny Tetrahedra

    KAUST Repository

    Cheng, Siu-Wing

    2015-11-26

    We propose an algorithm for finding a (1 + ε)-approximate shortest path through a weighted 3D simplicial complex T. The weights are integers from the range [1,W] and the vertices have integral coordinates. Let N be the largest vertex coordinate magnitude, and let n be the number of tetrahedra in T. Let ρ be some arbitrary constant. Let κ be the size of the largest connected component of tetrahedra whose aspect ratios exceed ρ. There exists a constant C dependent on ρ but independent of T such that if κ ≤ 1 C log log n + O(1), the running time of our algorithm is polynomial in n, 1/ε and log(NW). If κ = O(1), the running time reduces to O(nε(log(NW))).

  3. Calcio-olivine γ-Ca2SiO4: I. Rietveld refinement of the crystal structure

    Science.gov (United States)

    Gobechiya, E. R.; Yamnova, N. A.; Zadov, A. E.; Gazeev, V. M.

    2008-05-01

    The structure of the natural mineral calcio-olivine (γ-Ca2SiO4) found in skarn xenoliths in the region of the Lakargi Mountain (North Caucasus, Kabardino-Balkaria, Russia) is refined by the Rietveld method [ a = 5.07389(7) Å, b = 11.21128(14) Å, c = 6.75340(9) Å, V = 384.170(5) Å3, Z = 4, ρcalcd = 2.98 g/cm3, space group Pbnm]. The X-ray diffraction pattern of a powdered sample is recorded on a STOE STADI MP diffractometer [λCu K α1; Ge(111) primary monochromator; 6.00° calcio-olivine (the natural analogue of the γ-Ca2SiO4 compound) (83%), hillebrandite (13%), and wadalite (4%) are dominant. Only the scale factors and the unit cell parameters are refined for hillebrandite Ca2SiO3(OH)2 [ a = 3.63472(16) Å, b = 16.4140(10) Å, c = 11.7914(8) Å, space group Cmc21, Z = 6] and wadalite Ca6Al5Si2O16Cl3 ( a = 12.0088 Å, space group, I bar 4 3 d Z = 4). The results of the structure refinement of the main component of the sample confirm that the mineral calcio-olivine is isostructural to the synthetic compound γ-Ca2SiO4. The structure of this compound is formed by the heteropolyhedral framework composed of Ca octahedra joined together into olivine-like ribbons and isolated Si tetrahedra.

  4. Massive production of A2SiO4:Eu3+ and A2SiO4:Eu2+ (A = Ca, Sr, Ba) microspheres and luminescent properties

    Science.gov (United States)

    Wei, Fengjun; Jia, Qiuli

    2015-06-01

    A2SiO4:Eu3+ and A2SiO4:Eu2+ (A = Ca, Sr, Ba) microspheres with dense structure were synthesized by the modified spray-drying process. The obtained samples were characterized by XRD, SEM, and spectrophotometer. The XRD results reveal that all samples are isostructure. The SEM results show that the obtained samples are microspheres with size in the range of 0.6-2.2 μm. Dextrin plays an important role in the formation of spherical morphology. The excitation and emission spectra of the samples indicate that Eu3+ (or Eu2+) ions doped into different alkaline earth silicates will give different emission bands in different color regions and with different emission intensities. A2SiO4:Eu3+ samples show characteristic emission bands originating from 5D0 → 7Fj transitions of Eu3+ ions. A2SiO4:Eu2+ samples show different emission bands. The two emission bands for Sr2SiO4:Eu2+ relate to the two Eu2+ activator sites locating at two Sr2+ sites in Sr2SiO4 host. The difference of luminescent properties relates to the different sites of Eu3+ (or Eu2+) ions in the A2SiO4 hosts.

  5. Stacking fault tetrahedra formation in the neighbourhood of grain boundaries

    CERN Document Server

    Samaras, M; Van Swygenhoven, H; Victoria, M

    2003-01-01

    Large scale molecular dynamics computer simulations are performed to study the role of the grain boundary (GB) during the cascade evolution in irradiated nanocrystalline Ni. At all primary knock-on atom (PKA) energies in cascades near GBs, the damage produced after cooling down is vacancy dominated. Truncated stacking fault tetrahedra (TSFTs) are easily formed at 10 keV and higher PKA energies. At the higher energies a complex partial dislocation network forms, consisting of TSFTs. The GB acts as an interstitial sink without undergoing major structural changes.

  6. High-pressure crystal structure investigation of synthetic Fe2SiO4 spinel

    DEFF Research Database (Denmark)

    Nestola, F.; Balic Zunic, Tonci; Koch-Müller, M.

    2011-01-01

    The crystal structure of Fe2SiO4 spinel at room temperature was investigated at seven different pressures by X-ray diffraction, using a diamond anvil cell to examine the influence of Fe substitution on ringwoodite behaviour at high pressure. The results compared with those of a pure Mg endmember...... show that the substitution of Fe into the spinel structure causes only small changes in the compression rate of coordination polyhedra and the distortion of the octahedron. The data show that the compression rate for the octahedron and tetrahedron in (Mg,Fe)2SiO4 can be considered statistically equal...

  7. Photoluminescence properties of X5SiO4Cl6:Tb (X = Sr, Ba) green ...

    Indian Academy of Sciences (India)

    Energy-level diagram of Tb3+ showing transitions that produce emission in visible region. bands that are correlated with some 4 f → 4 f electronic transitions in the activating terbium ions. In the emission spectra of X5SiO4Cl6:Tb3+ (X = Sr, Ba) phosphor, cha- racteristic blue and green emission peaks corresponding to.

  8. Tetrahedra and polynomial equations in topological field theory

    International Nuclear Information System (INIS)

    Chair, N.; Zhu Chuanjie.

    1989-11-01

    Some tetrahedra in SU k (2)-Chern-Simons-Witten theory are computed. The results can be used to compute an arbitrary tetrahedron inductively by fusing with the fundamental representation. The results obtained are in agreement with those of quantum groups. By associating a (finite) topological field theory (FTFT) to every rational conformal field theory (RCFT), we show that the pentagon and hexagon equations in RCFT follow directly from some skein relations in FTFT. By generalizing the operation of surgery on links in FTFT we derive also an explicit expression for the modular transformation matrix S(k) of the one point conformal blocks on a torus in RCFT and the equations satisfied by S(k), in agreement with those required in RCFT. The implication of our results on the general programme of classifying RCFT is also discussed. (author). 24 refs, 21 figs

  9. Transurban interconnectivities

    DEFF Research Database (Denmark)

    Jørgensen, Claus Møller

    2012-01-01

    , radicalism and nationalism in 1848. In the concluding paragraph, the limitations of the notion of urban–rural nterconnectivity are discussed in order to clarify the nature of transurban interconnectivity. 1848 revolutions; European history; interconnectivity; transurban; urban political movements...

  10. Interconnection Guidelines

    Science.gov (United States)

    The Interconnection Guidelines provide general guidance on the steps involved with connecting biogas recovery systems to the utility electrical power grid. Interconnection best practices including time and cost estimates are discussed.

  11. Shock and Release Data on Forsterite (Mg2SiO4) Single Crystals

    Science.gov (United States)

    Root, S.; Townsend, J. P.; Shulenburger, L.; Davies, E.; Kraus, R. G.; Spaulding, D.; Stewart, S. T.; Jacobsen, S. B.; Mattsson, T. R.

    2016-12-01

    The Kepler mission has discovered numerous extra-solar rocky planets with sizes ranging from Earth-size to the super-Earths with masses 40 times larger than Earth. The solid solution series of (Mg, Fe)2SiO4 (olivine) is a major component in the mantle of Earth and likely these extra-solar rocky planets. However, understanding how the (Mg, Fe)2SiO4 system behaves at Earth like and super-Earth like pressures is still unknown. Using Sandia's Z machine facility, we shock compress single crystal forsterite, the Mg end-member of the olivine series. Solid aluminum flyers are accelerated up to 28 km/s to generate steady shock states up to 950 GPa. Release states from the Hugoniot are determined as well. In addition to experiments, we perform density functional theory (DFT) calculations to examine the potential phases along the Mg2SiO4 Hugoniot. We compare our results to other recent shock experiments on forsterite. Sandia National Laboratories is a multiprogram laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. Department of Energy's National Nuclear Security Administration under Contract No. DE-AC04-94AL85000. This work was performed under the auspices of the U.S. Department of Energy by Lawrence Livermore National Laboratory under Contract DE-AC52-07NA27344.

  12. Role of Synthesis Method on Luminescence Properties of Europium(II, III) Ions in β-Ca2SiO4: Probing Local Site and Structure.

    Science.gov (United States)

    Mani, Rajaboopathi; Jiang, Huaidong; Gupta, Santosh Kumar; Li, Ziqing; Duan, Xiulan

    2018-02-05

    The europium ion probes the symmetry disorder in the crystal structure, although the distortion due to charge compensation in the case of aliovalent dopant remains interesting, especially preparation involves low and high temperatures. This work studies the preparation of the β-Ca 2 SiO 4 (from here on C 2 S) particle from Pechini (C 2 SP) and hydrothermal (C 2 SH) methods, and its luminescence variance upon doping with Eu 2+ and Eu 3+ ions. The blue shift of the charge-transfer band (CTB) in the excitation spectra indicates a larger Eu 3+ -O 2- distance in Eu 3+ doped C 2 SH. The changes in vibrational frequencies due to stretching and bending vibrations in the FTIR and the Raman spectra and binding energy shift in the XPS analysis confirmed the distorted SiO 4 4- tetrahedra in C 2 SH. The high hydrothermal temperature and pressure produce distortion, which leads to symmetry lowering although doping of aliovalent ion may slightly change the position of the Ca atoms. The increasing asymmetry ratio value from C 2 SP to C 2 SH clearly indicates that the europium ion stabilized in a more distorted geometry. It is also supported by Judd-Ofelt analysis. The concentration quenching and site-occupancy of Eu 3+ ions in two nonequivalent sites of C 2 S were discussed. The charge state and concentration of europium ions in C 2 SP and C 2 SH were determined using X-ray photoelectron spectroscopy measurements. The C 2 S particles were studied by X-ray powder diffraction, FTIR, Raman, BET surface area, TGA/DTA, electron microscopy, XPS, and luminescence spectroscopy. The impact of citrate ion on the morphology and particle size of C 2 SH has been hypothesized on the basis of the microscopy images. This study provides insights that are needed for further understanding the structure of C 2 S and thereby improves the applications in optical and biomedical areas and cement hydration.

  13. Electroluminescence properties of In-doped Zn2SiO4 thin films prepared by sol-gel process

    International Nuclear Information System (INIS)

    Ogawa, Hirotaka; Kan, Akinori; Ikeda, Norihiro; Fujita, Akihiro

    2012-01-01

    The effect of In doping on the electroluminescence (EL) properties of Zn 2 SiO 4 :In thin films was investigated. In-doped Zn 2 SiO 4 thin films were deposited on BaTiO 3 substrates and their EL properties were characterized in this study. X-ray powder diffraction patterns of In-doped Zn 2 SiO 4 powders revealed a single phase of Zn 2 SiO 4 for In concentrations up to approximately 1.5 mol%, whereas a secondary phase of In 2 O 3 was observed for In concentrations in the range of 2-10 mol%. The maximum luminance of thin film electroluminescent (TFEL) devices varied significantly with the amount of In doping. The highest luminance with blue emission was obtained when 2 mol% In was doped. The blue emission of In-doped Zn 2 SiO 4 thin film may be related to the In substitution for Zn. The 2 mol% In-doped Zn 2 SiO 4 thin film exhibited blue emission with CIE color coordinates of x=0.208 and y=0.086.

  14. The principal Hugoniot of Mg2SiO4 to 950 GPa

    Science.gov (United States)

    Townsend, J. P.; Root, S.; Shulenburger, L.; Lemke, R. W.; Kraus, R. G.; Jacobsen, S. B.; Spaulding, D.; Davies, E.; Stewart, S. T.

    2017-12-01

    We present new measurements and ab-initio calculations of the principal Hugoniot states of forsterite Mg2SiO4 in the liquid regime between 200-950 GPa.Forsterite samples were shock compressed along the principal Hugoniot using plate-impact shock compression experiments on the Sandia National Laboratories Z machine facility.In order to gain insight into the physical state of the liquid, we performed quantum molecular dynamics calculations of the Hugoniot and compare the results to experiment.We show that the principal Hugoniot is consistent with that of a single molecular fluid phase of Mg2SiO4, and compare our results to previous dynamic compression experiments and QMD calculations.Finally, we discuss how the results inform planetary accretion and impact models.Sandia National Laboratories is a multimission laboratory managed and operated by National Technology and Engineering Solutions of Sandia, LLC., a wholly owned subsidiary of Honeywell International, Inc., for the U.S. Department of Energy's National Nuclear Security Administration under contract DE-NA0003525.

  15. Optical interconnects

    CERN Document Server

    Chen, Ray T

    2006-01-01

    This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical

  16. Phase transformation upon cooling path in Ca2SiO4: Possible geological implication

    Science.gov (United States)

    Chang, Yun-Ting; Kung, Jennifer; Hsu, Han

    2016-04-01

    At the contact metamorphism zone two different Ca2SiO4 phases can be found; calcio-olivine (γ phase) and larnite (β phase). In-situ experiments illustrated the existence of five various polymorphs in Ca2SiO4, i.e., α, α'H, α'L, β and γ. The path of phase transformation and the transformation temperatures are shown as follows. γ → α'L(700° C) → α'H(1100° C) → α (1450° C) α'L → β (680° C) → γ (500° C) Experiments showed that the phase transitions at lower temperature is not reversible and seemed to be complicated; β phase is only stable from 500° C to 680° C upon cooling. To understand the possible mechanism of the β phase being metastable at room temperature, atmosphere condition, we were motivated to investigate the route of phase transition in Ca2SiO4 in different thermal process. Powder samples were synthesized by the solid-state reaction. Pure reagent oxides CaCO3 and SiO2 were mixed in 2:1 stoichiometric mole. Two control factors were designated in the experiments; the sintering temperature of starting materials and the cooling path. The sintering temperature was set within the range of stable phase field of α'L phase (˜900° C) and α'H phase (1300° C). The cooling process was designed in three different routes: 1) the quenched procedure from sintering temperature with rate of 900° C/min and 1300° C/min, 2) the furnace cooling procedure, 3) set a slow cooling rate (0.265 ° C/min). The products were examined for the crystal structure by X-ray powder diffraction. First-principle calculation was also applied to investigate the thermodynamic properties of α'H, β and γ phases. A major finding in this study showed that the γ phase presented in the final product when the sintering temperature was set at the stable field of α'H phase; on the other hand, the β phase would present when the sintering temperature was set within the field of α'L phase. It was noted that the existing phase in the product would be modified by the cooling procedures. Our calculation indicates the enthalpy of beta phase was slightly higher than that of the gamma phase at zero pressure, verifying the metastable β phase observed in the natural. In this meeting we present the detailed experimental results and discuss the potential implication for the thermal history of geological setting using the phase transition path upon cooling of Ca2SiO4.

  17. Interconnected networks

    CERN Document Server

    2016-01-01

    This volume provides an introduction to and overview of the emerging field of interconnected networks which include multi layer or multiplex networks, as well as networks of networks. Such networks present structural and dynamical features quite different from those observed in isolated networks. The presence of links between different networks or layers of a network typically alters the way such interconnected networks behave – understanding the role of interconnecting links is therefore a crucial step towards a more accurate description of real-world systems. While examples of such dissimilar properties are becoming more abundant – for example regarding diffusion, robustness and competition – the root of such differences remains to be elucidated. Each chapter in this topical collection is self-contained and can be read on its own, thus making it also suitable as reference for experienced researchers wishing to focus on a particular topic.

  18. Prediction study on mechanical and thermodynamic properties of orthorhombic Mg2SiO4 under high temperature

    International Nuclear Information System (INIS)

    Zhou, Jianting; Zhang, Hong; Chen, Yue; Shong, Jun; Chen, Zhuo; Yang, Juan; Zheng, Zhou; Wang, Feng

    2014-01-01

    In this work, based on density functional theory and quasi-harmonic Debye model, mechanical and thermodynamic properties of orthorhombic Mg 2 SiO 4 under high temperature are predicted. We found out that α-Mg 2 SiO 4 is mechanically stable under the condition from about 0 to 74 GPa. Results indicate that the main cause of mechanical instability is high pressure, and the effect caused by high temperature is small. C 11 , C 22 , C 33 , B and v p reduce with temperature just a little and increase with pressure obviously. Mg 2 SiO 4 has excellent resistance to strong compression; however the resistance to shear is unsatisfactory. The C v tends to the Petit and Dulong limit at high temperature under any pressure, and it is proportional to T 3 at extremely low temperature. Pressure has an opposite effect on C v than temperature. The suppressed effect on C v caused by pressure is not obvious under low and very high temperature. Mg 2 SiO 4 has three different thermal expansion coefficients (α) along a-, b- and c-axes, and α a <α c <α b . α increases rapidly at low temperature (about <300 K), and slows down at high temperature. High pressure would greatly suppress expansion caused by temperature. Nevertheless, increasing tendency of α b and α c is still obvious under high pressure, especially α b . All the properties are mainly due to Si–O covalent bonds and their directions

  19. Analysis of thermoluminescence kinetics of Mg2SiO4:Tb compounds employing an interactive model

    International Nuclear Information System (INIS)

    Marcazzo, J.; Prokic, M.; Santiago, M.; Molina, P.; Caselli, E.

    2009-01-01

    The kinetics involved in the thermoluminescence (TL) of Mg 2 SiO 4 :Tb compounds has been investigated by unfolding glow curves employing both the General Order model and a model that takes into account interactions among traps. The dependence of the glow curve shape on dose is only correctly described if interaction among traps is included in the analysis.

  20. Photoluminescence properties of X5SiO4Cl6: Tb 3 (X= Sr, Ba) green ...

    Indian Academy of Sciences (India)

    , Ba) prepared by modified solid state method is reported here. It is characterized by powder X-ray diffraction and studied by photoluminescence excitation and emission spectra. In the emission spectra of X5SiO4Cl6:Tb3+ (X = Sr, Ba) phosphor ...

  1. Synthesis and Luminescence Properties of Yellow-emitting SiO2/Zn2SiO4: Mn Nanocomposite

    Directory of Open Access Journals (Sweden)

    Karim OMRI

    2014-05-01

    Full Text Available Yellow light emitting Mn2+-doped b-Zn2SiO4 phosphor nanoparticles embedded in SiO2 host matrix, were prepared by a simple solid-phase reaction under natural atmosphere at 1500 °C for 2 hours after the incorporation of manganese doped zinc oxide nanoparticles in silica using sol-gel method. The SiO2/Zn2SiO4:Mn nanocomposite was characterized by X-ray diffraction (XRD, transmission electron microscopy (TEM, scanning electron microscopy (SEM and photoluminescence (PL. The nanopowder was crystallized in triclinic b-Zn2SiO4 phase with a particles size varies between 70 nm and 84 nm. The SiO2/b-Zn2SiO4:Mn nanocomposite exhibited a broad yellow emission band at 575 nm under UV excitation light. The dependence of the intensity and energy position of the obtained PL band on measurement temperature and power excitation will be discussed.

  2. [Effect of charge compensation on emission spectrum of Sr2SiO4 : Dy3+ phosphor].

    Science.gov (United States)

    Li, Pan-Lai; Wang, Zhi-Jun; Yang, Zhi-Ping; Guo, Qing-Lin

    2009-01-01

    The Sr2SiO4 : Dy3+ phosphor was synthesized by the high temperature solid-state reaction method in air. Dy2O3 (99.9%), SiO2 (99.9%), SrCO3 (99.9%), Li2CO3 (99.9%), Na2CO3 (99.9%) and K2CO3 (99.9%) were used as starting materials, and the Dy3+ doping concentration was 2 mol%. The emission spectrum was measured by a SPEX1404 spectrophotometer, and all the characterization of the phosphors was conducted at room temperature. The emission spectrum of Sr2 SiO4 : Dy3+ phosphor showed several bands centered at 486, 575 and 665 nm under the 365 nm excitation. The effect of Li+, Na+ and K+ on the emission spectra of Sr2SiO4 : Dy3+ phosphor was studied. The results show that the location of the emission spectrum of Sr2SiO4 : Dy3+ phosphor was not influenced by Li+, Na+ and K+. However, the emission spectrum intensity was greatly influenced by Li+, Na+ and K+, and the evolvement trend was monotone with different charge compensation, i. e. the emission spectrum intensity of Sr2SiO4 : Dy3+ phosphor firstly increased with increasing Li+ concentration, then decreased. However the charge compensation concentration corresponding to the maximum emission intensity was different with different charge compensation, and the concentration is 4, 3 and 3 mol% corresponding to Li+, Na+ and K+, respectively. And the theoretical reason for the above results was analyzed.

  3. Study on Formation Mechanism of Fayalite (Fe2SiO4) by Solid State Reaction in Sintering Process

    Science.gov (United States)

    Wang, Zhongbing; Peng, Bing; Zhang, Lifeng; Zhao, Zongwen; Liu, Degang; Peng, Ning; Wang, Dawei; He, Yinghe; Liang, Yanjie; Liu, Hui

    2017-12-01

    The sintering behaviors among SiO2, FeS and Fe3O4 were detected to reveal the formation mechanism of Fe2SiO4. The results indicated that the formation mechanism is divided into five steps: (1) migration of O2- induced by S2- under a reducing atmosphere; (2) formation of Fe3O4-β ; (3) migration of Fe(II) into a ferrite cluster structure to gain oxygen and form Fe3-x O4; (4) Fe(II) invaded the silicon atomic position and released Si(IV); and (5) formation of the stable structure of Fe2SiO4 through chemical diffusion between cations of Fe(II) and Si(IV). These findings can provide theoretical support for controlling the process of the recovery of valuable metals in copper slag through the combined roasting modification-magnetic separation process.

  4. Study on Formation Mechanism of Fayalite (Fe2SiO4) by Solid State Reaction in Sintering Process

    Science.gov (United States)

    Wang, Zhongbing; Peng, Bing; Zhang, Lifeng; Zhao, Zongwen; Liu, Degang; Peng, Ning; Wang, Dawei; He, Yinghe; Liang, Yanjie; Liu, Hui

    2018-04-01

    The sintering behaviors among SiO2, FeS and Fe3O4 were detected to reveal the formation mechanism of Fe2SiO4. The results indicated that the formation mechanism is divided into five steps: (1) migration of O2- induced by S2- under a reducing atmosphere; (2) formation of Fe3O4- β ; (3) migration of Fe(II) into a ferrite cluster structure to gain oxygen and form Fe3- x O4; (4) Fe(II) invaded the silicon atomic position and released Si(IV); and (5) formation of the stable structure of Fe2SiO4 through chemical diffusion between cations of Fe(II) and Si(IV). These findings can provide theoretical support for controlling the process of the recovery of valuable metals in copper slag through the combined roasting modification-magnetic separation process.

  5. Density functional theory calculations of point defects and hydrogen isotopes in Li4SiO4

    Directory of Open Access Journals (Sweden)

    Xiaogang Xiang

    2015-10-01

    Full Text Available The Li4SiO4 is a promising breeder material for future fusion reactors. Radiation induced vacancies and hydrogen isotope related impurities are the major types of point defects in this breeder material. In present study, various kinds of vacancies and hydrogen isotopes related point defects in Li4SiO4 are investigated through density functional theory (DFT calculations. The band gap of Li4SiO4 is determined by UV-Vis diffuse reflectance spectroscopy experiments. Formation energies of all possible charge states of Li, Si and O vacancies are calculated using DFT methods. Formation energies of possible charge states of hydrogen isotopes substitution for Li and O are also calculated. We found that Li-vacancies will dominate among all vacancies in neutral charge state under radiation conditions and the O, Li, and Si vacancies (VO,VLi,VSi are stable in charge states +2, -1, -4 for most of the range of Fermi level, respectively. The interstitial hydrogen isotopes (Hi and substitutional HLi are stable in the charge states +1, 0 for most of the range of Fermi level, respectively. Moreover, substitutional HO are stable in +1 charge states. We also investigated the process of tritium recovery by discussing the interaction between interstitial H and Li-vacancy, O-vacancy, and found that H O + and H Li 0 are the most common H related defects during radiation process.

  6. Self-setting properties and in vitro bioactivity of Ca2SiO4/CaSO4.1/2H2O composite bone cement.

    Science.gov (United States)

    Huan, Zhiguang; Chang, Jiang; Huang, Xiang-Hui

    2008-11-01

    In this study, a biphasic injectable bone substitute based on beta-dicalcium silicate (Ca(2)SiO(4)) and plaster of Paris (CaSO(4).1/2H(2)O) is presented, and its behavior as cement was studied and compared to that of pure Ca(2)SiO(4) paste. The results demonstrated that the setting time of the workable Ca(2)SiO(4)/CaSO(4).1/2H(2)O pastes was only 15 min, which was significantly reduced as compared to that of the Ca(2)SiO(4) paste (100 min), and the composite showed higher short- and long-term mechanical strength (3.25 and 37.2 MPa, respectively) than those of the Ca(2)SiO(4) paste (0.2 and 24.6 MPa). Similar to the pure Ca(2)SiO(4) paste, the composite paste could induce apatite formation in simulated body fluid within a short period and degrade in Ringer's solution. Moreover, the degradation rate could be adjusted by modifying the content of the plaster within the composite cement. These results suggested that the addition of the plaster significantly improved the self-setting properties of the Ca(2)SiO(4) paste, and the bioactive composite cement could be a prospective candidate for further investigation as self-setting tissue-repairing substitute.

  7. Tetrahedra system Cudaca: high-temperature manifold of molecular configurations governing low-temperature properties

    OpenAIRE

    Zaharko, O.; Mesot, J.; Salguero, L. A.; Valenti, R.; Zbiri, M.; Johnson, M.; Filinchuk, Y.; Klemke, B.; Kiefer, K.; Mys'kiv, M.; Straessle, T.; Mutka, H.

    2008-01-01

    The Cudaca system composed of isolated Cu2+ S=1/2 tetrahedra with antiferromagnetic exchange should exhibit properties of a frustrated quantum spin system. ab initio density functional theory calculations for electronic structure and molecular dynamics computations suggest a complex interplay between magnetic exchange, electron delocalization and molecular vibrations. Yet, extensive experimental characterization of Cudaca by means of synchrotron x-ray diffraction, magnetization, specific heat...

  8. Advanced Interconnect Development

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Z.G.; Maupin, G.; Simner, S.; Singh, P.; Stevenson, J.; Xia, G.

    2005-01-27

    The objectives of this project are to develop cost-effective, optimized materials for intermediate temperature SOFC interconnect and interconnect/electrode interface applications and identify and understand degradation processes in interconnects and at their interfaces with electrodes.

  9. A single phase, red emissive Mg2SiO4:Sm3+ nanophosphor prepared via rapid propellant combustion route

    Science.gov (United States)

    Naik, Ramachandra; Prashantha, S. C.; Nagabhushana, H.; Sharma, S. C.; Nagaswarupa, H. P.; Anantharaju, K. S.; Nagabhushana, B. M.; Premkumar, H. B.; Girish, K. M.

    2015-04-01

    Mg2SiO4:Sm3+ (1-11 mol%) nanoparticles were prepared by a rapid low temperature solution combustion route. The powder X-ray diffraction (PXRD) patterns exhibit orthorhombic structure with α-phase. The average crystallite size estimated using Scherer's method, W-H plot and strain-size plots were found to be in the range 25-50 nm and the same was confirmed by Transmission Electron Microscopy (TEM). Scanning electron microscopy (SEM) pictures show porous structure and crystallites were agglomerated. The effect of Sm3+ cations on luminescence of Mg2SiO4 was well studied. Interestingly the samples could be effectively excited with 315 nm and emitted light in the red region, which was suitable for the demands of high efficiency WLEDs. The emission spectra consists of four main peaks which can be assigned to the intra 4-f orbital transitions of Sm3+ ions 4G5/2 → 6H5/2 (576 nm), 4G5/2 → 6H7/2 (611 nm), 4G5/2 → 6H9/2 (656 nm) and 4G5/2 → 6H11/2 (713 nm). The optimal luminescence intensity was obtained for 5 mol% Sm3+ ions. The CIE (Commission International de I'Eclairage) chromaticity co-ordinates were calculated from emission spectra, the values (0.588, 0.386) were close to the NTSC (National Television Standard Committee) standard value of red emission. Coordinated color temperature (CCT) was found to be 1756 K. Therefore optimized Mg2SiO4:Sm3+ (5 mol%) phosphor was quite useful for solid state lighting.

  10. Luminescence mechanisms of organic/inorganic hybrid organic light-emitting devices fabricated utilizing a Zn2SiO4:Mn color-conversion layer

    International Nuclear Information System (INIS)

    Choo, D.C.; Ahn, S.D.; Jung, H.S.; Kim, T.W.; Lee, J.Y.; Park, J.H.; Kwon, M.S.

    2010-01-01

    Zn 2 SiO 4 :Mn phosphor layers used in this study were synthesized by using the sol-gel method and printed on the glass substrates by using a vehicle solution and a heating process. Organic/inorganic hybrid organic light-emitting devices (OLEDs) utilizing a Zn 2 SiO 4 :Mn color-conversion layer were fabricated. X-ray diffraction data for the synthesized Zn 2 SiO 4 :Mn phosphor films showed that the Zn ions in the phosphor were substituted into Mn ions. The electroluminescence (EL) spectrum of the deep blue OLEDs showed that a dominant peak at 461 nm appeared. The photoluminescence spectrum for the Zn 2 SiO 4 :Mn phosphor layer by using a 470 nm excitation source showed that a dominant peak at 527 nm appeared, which originated from the 4 T 1 - 6 A 1 transitions of Mn ions. The appearance of the peak around 527 nm of the EL spectra for the OLEDs fabricated utilizing a Zn 2 SiO 4 :Mn phosphor layer demonstrated that the emitted blue color from the deep blue OLEDs was converted into a green color due to the existence of the color-conversion layer. The luminescence mechanisms of organic/inorganic hybrid OLEDs fabricated utilizing a Zn 2 SiO 4 :Mn color-conversion layer are described on the basis of the EL and PL spectra.

  11. Effective Red Compensation of Sr2SiO4 : Dy3+ Phosphor by Codoping Mn2+ Ions and Its Energy Transfer

    Directory of Open Access Journals (Sweden)

    Le Zhang

    2012-01-01

    Full Text Available Mn2+ ions codoped Sr2SiO4 : Dy3+ phosphors were prepared by the solid-state reaction method using NH4Cl as the flux. Their phase compositions, photoluminescence properties, and the energy transfer process were systematically investigated. All Mn/Dy codoped powders were α′-Sr2SiO4. The codoping concentration range of Mn2+ was ≤4.0 mol% to keep the structure undamaged. The broad red emission of Mn2+ centered at 647 nm in Sr2SiO4 : Mn, Dy powders, which effectively compensated the red emission of Sr2SiO4 : Dy3+ phosphor. The CIE chromaticity coordinates dramatically changed from (0.310, 0.340 to (0.332, 0.326 due to the red enhancement via the energy transfer from Dy3+ to Mn2+. This energy transfer is realized by the exchange interaction. But the luminescence quenching of Sr2SiO4 : Dy, Mn phosphor was mainly caused by the electric multipoles interaction. The concentration optimized (Sr0.96, Mn0.02, Dy0.022SiO4 phosphor with high and almost pure white emission has great potential to act as a single-matrix white phosphor for white LEDs.

  12. A new high-pressure phase of Fe2SiO4 and the relationship between spin and structural transitions

    Science.gov (United States)

    Yamanaka, T.; Kyono, A.; Nakamoto, Y.; Kharlamova, S. A.; Struzhkin, V. V.; Gramsch, S.; Mao, H.; Hemley, R. J.

    2013-12-01

    Structure transformation of Fe2SiO4 Angle-dispersive powder x-ray diffraction was carried out at beam line 16-BMD APS. Structure of a new high-pressure phase of I-Fe2SiO4 spinel was determined by Rietveld profile fitting of x-ray diffraction data up to 64GPa at ambient temperature. A structural transition from the cubic spinel to the new structure was observed at 34GPa. Diffraction patterns taken at 44.6GPa and 54.6GPa indicate a two-phase mixture of spinel and new high-pressure phase. Reversible transition from I-Fe2SiO4 to spinel was confirmed. Laser heating experiment at 1500K proved the decomposition of Fe2SiO4 spinel to two oxides of FeO and SiO2. Spin transition X-ray emission measurements of Fe2SiO4 were carried out up to 65GPa at ambient temperature at beam line 16-IDD APS. The spin transition exerts an influence to Fe2SiO4 spinel structure and triggers two distinct curves of the lattice constant in the spinel phase. Although the compression curve of the spinel is discontinuous at approximately 20 GPa, Fe Kβ emission measurements show that the transition from a high spin (HS) to an intermediate spin (IS) state begins at 17GPa in the spinel phase. The IS electronic state is gradually enhanced with pressure, which results in an isostructural phase transition. HS-to-LS transition of iron bearing spinels starts from 15.6GPa in Fe3O4 and 19.6GPa in Fe2TiO4. The transition is more capable due to Fe2+ in the octahedral site. The extremely shortened octahedral bonds result in a distortion of 6-fold cation site. New structure of Fe2SiO4 Monte Carlo method was applied to find candidates for the high-pressure phase using the diffraction intensities with fixed lattice constants determined by DICVOL. Rietveld profile fitting was then performed using the initial model. The new structure is a body centered orthorhombic phase (I-Fe2SiO4) with space group Imma and Z=4, with two crystallographically distinct FeO6 octahedra. Silicon exists in six-fold coordination in I-Fe2SiO4. This new high-pressure phase reversibly transforms to the spinel structure under decompression. A Martensitic transformation of spinel slabs with translation vector [1/8 1/8 1/8] generates the I-Fe2SiO4 structure. The transition is induced by atomic displacements in the spinel structure, which generates the orthorhombic distortion resulting in I-Fe2SiO4 arrangement. A topotactic relation between spinel and I-Fe2SiO4 is suggested as the origin of this phase transition: Fe2SiO4 spinel at 34.8 GPa, Fd m, z = 8, a(spinel)= 7.894 Å I-Fe2SiO4 at 54.6 GPa, Imma,, z = 4, a= 5.543(1)Å, b=6.032(4)Å, c= 7.201(5)Å a = b = d(spnel 110) = 0.707107a (spinel) c= c(spinel) Compression along the [001] direction of the spinel structure and simultaneous elongation along the [110] direction results in the I-Fe2SiO4 arrangement. This transition is induced by the 20% shrinkage of ionic radius of Fe2+in the octahedral site at the low spin state.

  13. Lattice-dynamical estimation of atomic thermal parameters for silicates: Forsterite α-Mg2SiO4

    International Nuclear Information System (INIS)

    Pilati, T.; Bianchi, R.; Gramaccioli, C.M.

    1990-01-01

    As an example of extending harmonic lattice-dynamical procedures to silicates, the atomic thermal parameters for forsterite Mg 2 SiO 4 , an important constituent of earth's crust, have been calculated on this basis. For this purpose, Iishi's rigid-ion model was used, with slight modifications. Although such potentials were derived exclusively from fitting IR and Raman-active frequencies, the reproduction of the phonon-dispersion curves is good, and the calculation of thermodynamic functions such as entropy provides values which are near to calorimetric estimates. The calculated atomic thermal parameters are in good agreement with the experimental values reported by most authors. The calculations at various temperatures show the effect of zero-point motion very clearly: its contribution to temperature factors is about half of the total at room temperature. Bond-length corrections for thermal libration can be applied using the general-case formula: these amount to 0.003 A for the Si-O bonds at room temperature. Although the thermal parameters in the SiO 4 group fit a rigid-body model, the correction obtained using the Schomaker-Trueblood procedure gives a significantly different result: this is essentially due to the weak librational character of the motion of silicate groups in the structure. (orig.)

  14. Evolution of grain sizes and orientations during phase transitions in hydrous Mg2SiO4

    Science.gov (United States)

    Rosa, Angelika D.; Hilairet, Nadège; Ghosh, Sujoy; Perrillat, Jean-Philippe; Garbarino, Gaston; Merkel, Sébastien

    2016-10-01

    Transformation microstructures in mantle minerals, such as (Mg,Fe)2SiO4, are critical for predicting the rheological properties of rocks and the interpretation of seismic observations. We present in situ multigrain X-ray diffraction experiments on hydrous Mg2SiO4 at the P/T conditions relevant for deep cold subducting slabs (up to 40 GPa and 850°C) at a low experimental strain rate ( 4 * 10-6s-1). We monitor the orientations of hundreds of grains and grain size variations during the series of α-β-γ (forsterite-wadsleyite-ringwoodite) phase transformations. Microtextural results indicate that the β and an intermediate γ* phase grow incoherently relatively to the host α phase consistent with a nucleation and growth model. The β and γ phases exhibit orientation relationships which are in agreement with previous ex situ observations. The β and intermediate γ* show texturing due to moderate differential stress in the sample. Both the α-β and α-γ transformation induce significant reductions of the mean sample grain size of up to 90% that starts prior to the appearance of the daughter phase. Apart from the γ*, in the newly formed β and γ phases, the nucleation rate is faster than the growth rate, inhibiting the formation of large grains. These results on grain orientations and grain size reductions in relation to transformation kinetics should allow refining existing slab strength models.

  15. Enhancement of reactivity in Li4SiO4-based sorbents from the nano-sized rice husk ash for high-temperature CO2 capture

    International Nuclear Information System (INIS)

    Wang, Ke; Zhao, Pengfei; Guo, Xin; Li, Yimin; Han, Dongtai; Chao, Yang

    2014-01-01

    Highlights: • The Li 4 SiO 4 sorbent from nano-sized rice husk ash was prepared and characterized. • The Aerosil and Quartz were comparably used for synthesized Li 4 SiO 4 . • The structure of sorbent was depended on the morphology of heated silicon materials. • The pretreatment sorbent showed increase in the CO 2 uptake and kinetic behavior. • This promising sorbent also maintained higher capacities during the multiple cycles. - Abstract: Using the cost-effective, renewable and nano-sized of citric acid pretreatment rice husk ash (CRHA) as silicon source, high efficient Li 4 SiO 4 (lithium orthosilicate)-based sorbents (CRHA-Li 4 SiO 4 ) for high-temperature CO 2 capture were prepared through the solid-state reaction at lower temperature (700 °C). Two typical raw materials (nano-structured Aerosil and crystalline Quartz powders) were used to synthesize Li 4 SiO 4 sorbents (Aerosil-Li 4 SiO 4 and Quartz-Li 4 SiO 4 ) for comparison purposes. The phase composition behavior, surface area, and morphology of the silicon sources, heat treated raw materials and as-received Li 4 SiO 4 sorbents were studied by analytical techniques. The CO 2 adsorption capacity and adsorption–desorption performance were tested by the thermo-gravimetric analyses (CO 2 atmosphere) and a fixed bed reactor, respectively. Compared with the case of its original samples, the morphology of heat treated raw materials had a greater effect on the phase composition, microstructure, special surface area and CO 2 adsorption properties of their resulting sorbents. Although the calcined Quartz sample maintained the structure of micron particles, its reactivity was not enough to react completely with Li 2 CO 3 . Due to the greater reactivity of nanoparticles, Aerosil-Li 4 SiO 4 presented pure of Li 4 SiO 4 whereas it obtained large particles with dense morphology, which was coming from the pronounced fusing of silica nanoparticles during the calcined process. Conversely, CRHA-Li 4 SiO 4 achieved porous agglomerates of submicron particles resulting from a high anti-sintering character of its calcined CRHA. This more favorable structure of CRHA-Li 4 SiO 4 could lead to the higher CO 2 adsorption capacity of 30.5 wt% (6.92 mmol/g Li 4 SiO 4 , corresponding to 83.1% efficiency), faster kinetic behavior and better regenerability (its adsorption capacity only decreased 2.1 wt% from the first cycle to the 15th cycle), which was illustrated by the thermogravimetric analyses and fix bed results

  16. Tunable photoluminescence properties and energy transfer in oxyapatite-based Ca2Tb8(SiO4)6:Eu3+ phosphors for UV-LEDs

    International Nuclear Information System (INIS)

    Yang, Che-Yuan; Das, Subrata; Lu, Chung-Hsin

    2015-01-01

    New phosphors Ca 2 Tb 8–x Eu x (SiO 4 ) 6 O 2 with color-tunability were synthesized in this work. The Rietveld refinement indicated that the prepared phosphors were crystallized to a hexagonal structure with space group P6 3 /m (no. 176). When Eu 3+ ions were introduced into Ca 2 Tb 8 (SiO 4 ) 6 O 2 , characteristic red–orange emissions of Eu 3+ ions and the green emission of Tb 3+ ions were obtained. Eu 3+ -doped phosphors emitted with enhanced intensity and had broader excitation spectra than the undoped Ca 2 Tb 8 (SiO 4 ) 6 O 2 phosphors. As Eu 3+ content increased, a decline in Tb 3+ emission was observed owing to resonant energy transfer from the 5 D 3 level of Tb 3+ ions to the 5 D 0 level of Eu 3+ ions. Moreover, the transfer of energy from Tb 3+ ions to Eu 3+ ions proceeded via a dipole–dipole interaction, and the critical distance for this energy transfer was calculated to be 7.2 Å. The efficiency of energy transfer in Ca 2 Tb 8−x Eu x (SiO 4 ) 6 O 2 increased from 72% to 87% with an increase in the Eu 3+ concentration, x, from 0.02 to 0.08. The emitted color of Ca 2 Tb 8−x Eu x (SiO 4 ) 6 O 2 was tuned from green to red via controlling the concentration of Eu 3+ ions. Meanwhile, the optimum phosphor system Ca 2 Tb 7.94 Eu 0.6 (SiO 4 ) 6 O 2 exhibited adequate thermal stability even at 200 °C and the corresponding activation energy was calculated to be 0.027 eV. These results suggest that Ca 2 Tb 8 (SiO 4 ) 6 O 2 :Eu 3+ may be potential phosphors for the application in UV LEDs. - Highlights: • New phosphors Ca 2 Tb 8−x Eu x (SiO 4 ) 6 O 2 were synthesized in this work. • The structure of Ca 2 Tb 8−x Eu x (SiO 4 ) 6 O 2 was refined to be P6 3 /m (no. 176). • As Eu 3+ was doped into the host, efficient energy transfer from Tb 3+ to Eu 3+ was observed. • The efficiency of energy transfer increased with the concentration of Eu 3+ . • The emitted color of the present phosphors was tuned from green to red.

  17. Kinetic analysis of the thermal stability of lithium silicates (Li4SiO4 and Li2SiO3)

    International Nuclear Information System (INIS)

    Cruz, Daniel; Bulbulian, Silvia; Lima, Enrique; Pfeiffer, Heriberto

    2006-01-01

    The kinetics describing the thermal decomposition of Li 4 SiO 4 and Li 2 SiO 3 have been analysed. While Li 4 SiO 4 decomposed on Li 2 SiO 3 by lithium sublimation, Li 2 SiO 3 was highly stable at the temperatures studied. Li 4 SiO 4 began to decompose between 900 and 1000 deg. C. However, at 1100 deg. C or higher temperatures, Li 4 SiO 4 melted, and the kinetic data of its decomposition varied. The activation energy of both processes was estimated according to the Arrhenius kinetic theory. The energy values obtained were -408 and -250 kJ mol -1 for the solid and liquid phases, respectively. At the same time, the Li 4 SiO 4 decomposition process was described mathematically as a function of a diffusion-controlled reaction into a spherical system. The activation energy for this process was estimated to be -331 kJ mol -1 . On the other hand, Li 2 SiO 3 was not decomposed at high temperatures, but it presented a very high preferential orientation after the heat treatments

  18. Elasticity of Hydrous Aluminosilicate Mineral, Topaz-OH (Al2SiO4(OH)2) at High Pressures

    Science.gov (United States)

    Hariharan, A.; Mookherjee, M.; Tsuchiya, J.

    2015-12-01

    We examined the equation of state and high-pressure elasticity of the hydrous aluminosilicate mineral topaz-OH (Al2SiO4(OH)2) using first principles simulation. Topaz-OH is a hydrous phase in the Al2O3-SiO2-H2O (ASH) ternary system, which is relevant for the mineral phase relations in the hydrated sedimentary layer of subducting slabs. Based on recent experiments, it is known that the protons in the topaz-OH exhibit positional disorder with half occupancy over two distinct crystallographic sites. In order to adequately depict the proton environment in the topaz-OH, we examined five crystal structure models with distinct configuration for the protons. Upon full geometry optimization, we find that there are two distinct crystal structures for the topaz-OH. The first crystal structure has an orthorhombic Pbnm space group symmetry, and the second crystal structure has a monoclinic P21/c space group symmetry. At static conditions, the monoclinic (P21/c) topaz-OH has lower energy compared to the orthorhombic (Pbnm) topaz-OH. The energy of the monoclinic (P21/c) topaz-OH remains stable at least up to 40 GPa, i.e., pressures beyond the thermodynamic stability of the topaz-OH. Based on the results from first principles simulation, the equation of state for the monoclinic topaz-OH is well represented by a third-order Birch-Murnaghan formulation, with V0 = 348.63 (±0.04) Å3, K0 = 164.7 (±0.04) GPa, and K'0 = 4.24 (±0.05). The equation of state for the orthorhombic topaz-OH is well represented by a third-order Birch-Murnaghan formulation, with V0 = 352.47 (±0.04) Å3, K0 = 166.4 (±0.06) GPa, and K'0 = 4.03 (±0.04). While the bulk modulus is very similar for both the monoclinic and orthorhombic topaz-OH, the shear elastic moduli are very sensitive to the position of the proton and the orientation of the hydroxyl (O-H) groups. In the hydrated sedimentary layer of a subducting slab, transformation of a mineral assemblage consisting of coesite (SiO2) and diaspore (AlOOH) to topaz-OH (Al2SiO4(OH)2) is likely to be accompanied by an increase in the density, compressional velocity, and shear wave velocity. To gain better insight into the transport of water via subduction of sediments, further constraints on the elasticity at high pressures and temperatures are required.

  19. Effects of cobalt doping on structural, morphological, and optical properties of Zn2SiO4 nanophosphors prepared by sol-gel method

    Directory of Open Access Journals (Sweden)

    Norhafizah Mohd Rasdi

    Full Text Available In this paper, undoped and cobalt (II (3, and 5 mol % doped zinc silicate nanophosphors prepared by a sol-gel method which were heated at 1000 °C were studied in detail. From the XRD result, undoped and Co2+ doped zinc silicate sample yields α- and β-Zn2SiO4. This also shows that α-Zn2SiO4 acts as the primary phase in the crystal structure of the sample. For FESEM, the grain size decreases as the dopant increases where undoped sample indicates average grain size of 181 nm while 3 and 5 mol % exhibits containing ones 136.89 nm and 176.22 nm respectively. With FTIR transmission a major peak at range of 1100 cm−1, 880, 550, and 350 assigning as Si-O-Si asymmetric stretching, SiO4 asymmetric stretching, ZnO4 symmetric stretching, and Si-O asymmetric deformation vibration were observed respectively. The absorption band of doped Zn2SiO4 exhibited a higher absorbance intensity in the UV region compared to undoped Zn2SiO4. Besides, all the samples depict that the sample was having a red shift in which the band shifted to the longer wavelength. The energy band gap value of undoped sample shows 3.07 eV and when Co2+ dopant (3 and 5 mol % was introduced, the energy band gap started to decrease (2.46 and 2.42 eV respectively. PL emission presents two peaks at blue emissions (420 and 480 nm and a green emission (525 nm. The result present that Co2+:Zn2SiO4 is potentially good to use as blue and green phosphors for luminescent optical material. Keywords: Cobalt (II doped zinc silicate, Transition metal, Sol-gel method, Nanophosphors, Photoluminescence

  20. Crystal structure and optical spectra of LiLa9(SiO4)6O2 crystals activated with Er3+

    International Nuclear Information System (INIS)

    Bettinelli, Marco; Speghini, Adolfo; Falcomer, Daniele; Cavalli, Enrico; Calestani, Gianluca; Quintanilla, Marta; Cantelar, Eugenio; Cusso, Fernando

    2008-01-01

    LiLa 9 (SiO 4 ) 6 O 2 (LLS) crystals activated with Er 3+ have been grown by the flux growth method. Their apatite structure has been characterized by single-crystal X-ray diffraction. The absorption and emission spectra have been measured in the visible and NIR regions. They are affected by a significant inhomogeneous broadening making these crystals interesting active media for tunable solid-state laser operation

  1. Red, Green, and Blue Photoluminescence of Ba2SiO4:M (M = Eu3+, Eu2+, Sr2+ Nanophosphors

    Directory of Open Access Journals (Sweden)

    Claudia Wickleder

    2013-07-01

    Full Text Available Divalent europium doped barium orthosilicate is a very important phosphor for the production of light emitting diodes (LEDs, generally associated to the green emission color of micron-sized crystals synthesized by means of solid-state reactions. This work presents the combustion synthesis as an energy and time-saving preparation method for very small nano-sized Ba2SiO4 particles, flexibly doped to acquire different emission energies. The size of the resulting spherical nanoparticles (NPs of the green emitting Ba2SiO4:Eu2+ was estimated to about 35 nm applying the Scherrer equation and further characterized with aid of atomic force microscopy (AFM as well as scanning electron microscopy (SEM. This phosphor is able to build homogeneous luminescent suspensions and was successfully down-sized without changing the optical properties in comparison to the bulk phosphors. Besides the X-ray diffraction (XRD analysis and the different types of microscopy, the samples were characterized by luminescence spectroscopy. Undoped Ba2SiO4 NPs are not luminescent, but show characteristic red emission of the 5D0 → 7FJ (J = 0–4 electronic transitions when doped with Eu3+ ions. Moreover, these orthosilicate nanoparticles generate blue light at low temperatures due to impurity-trapped excitons, introduced by the partial substitution of the Ba2+ with Sr2+ ions in the Ba2SiO4 lattice causing a substantial distortion. A model for the temperature behavior of the defect luminescence as well as for their nature is provided, based on temperature-dependent luminescence spectra and lifetime measurements.

  2. Synthesis of Si/MgO/Mg2SiO4 Composite from Rice Husk-Originated Nano-Silica

    Directory of Open Access Journals (Sweden)

    Maryam Azadeh

    2016-12-01

    Full Text Available Silica exists in Rice husk, an agriculture waste, as a naturally occurring phase. In first step, acidic pre-treatment and calcination of the rice husk were performed to obtain nano-silica, in which various sizes of the nano-silica, totally with sizes under 80 nm, were achieved. Second, to reduce nano-silica to elemental Si and subsequently formation of the composite, Mg used as the reducing agent. In this work, the as-obtained composite mainly is the product of magnesiothermic reduction reaction of the nano-silica, which finally resulted in formation of elemental Si (silicon, MgO (magnesia and Mg2SiO4 (magnesium silicate. The as-synthesized composite can be used as anode in lithium ion batteries. The products in each step were characterized using X-ray powder diffraction (XRD and scanning electron microscopy (FESEM and HRSEM techniques. X-ray powder diffraction patterns confirmed the formation of almost amorphous silica while the FE-SEM images were representing the spherical silica particles at various calcination temperatures. After the magnesiothermic reduction process, HRSEM micrographs indicated the formation of Si-MgO-Mg2SiO4 composite with particle sizes of 180-300 nm. The phase composition analysis was calculated by Rietveld method The electrical response of the Si/MgO/Mg2SiO4 composite was measured to be of 6×108 Ω.m resulted from I-V measurement.

  3. Synthesis of Si-Induced MnO/Mn2SiO4@C Cuboids as High-Performance Anodes for Lithium-Ion Batteries.

    Science.gov (United States)

    Wei, Hang; Xia, Zhonghong; Xia, Dingguo

    2017-12-20

    The exploration of anode materials of lithium-ion batteries (LIBs) is still a great challenge because of their low electrical conductivity and poor durability. Transition-metal oxides are proposed as a potential alternative, even though their dimension and structure greatly affect their electrochemical properties. In this study, MnO/Mn 2 SiO 4 @C cuboids were prepared via the polymerization-pyrolysis process. Larger MnCO 3 precursor particles embedded into a monolithic carbon framework and formed smaller nanoparticles owing to the inducing effect of Si element in phthalocyanino silicon (SiPc), giving MnO/Mn 2 SiO 4 @C cuboids. The micron-scaled cuboid composite can lead to higher tap density and greater electrical performance due to lower interparticle resistance. Therefore, the as-prepared MnO/Mn 2 SiO 4 @C electrode exhibits stable specific capacities of 585.9 and 423.9 mA h g -1 after 1000 discharge/charge cycles at 1 and 2 A g -1 , respectively. Meanwhile, an excellent rate capacity of 246.3 mA h g -1 was achieved even at 30 A g -1 . Additionally, this facile and economical strategy to improve electrode performance provides a commercially feasible way for the construction of high-performance LIBs.

  4. Formation of Fe2SiO4 thin films on Si substrates and influence of substrate to its thermoelectric transport properties

    Science.gov (United States)

    Choi, Jeongyong; Nguyen, Van Quang; Duong, Van Thiet; Shin, Yooleemi; Duong, Anh Tuan; Cho, Sunglae

    2018-03-01

    Fe2SiO4 thin films have been grown on n-type, p-type and semi-insulating Si(100) substrates by molecular beam epitaxy. When Fe-O thin films were deposited on Si(100) substrate at 300 °C, the film reacted with Si, resulting in a Fe2SiO4 film because of the high reactivity between Fe and Si. The electrical resistance and Seebeck coefficient of Fe2SiO4 thin films grown were different in different doping states. On n-type and p-type Si(100), the electrical resistance decreased suddenly and increased again at 350 and 250 K, respectively, while on semi-insulating Si(100), it exhibited typical semiconducting resistance behavior. We observed similar crossovers at 350 and 250 K in temperature dependent Seebeck coefficients on n-type and p-type Si(100), respectively. These results suggest that the measured electrical and thermoelectric properties originate from Si substrate.

  5. Revising the Subsystem Nurse’s A-Phase-Silicocarnotite within the System Ca3(PO42–Ca2SiO4

    Directory of Open Access Journals (Sweden)

    Patricia Ros-Tárraga

    2016-04-01

    Full Text Available The subsystem Nurse’s A-phase-silicocarnotite within the system Ca3(PO42–Ca2SiO4 was conducted as a preliminary step toward obtaining new biomaterials with controlled microstructures. Phase composition of the resulting ceramics was studied by X-ray diffraction, differential thermal analysis, and scanning electron microscopy with attached wavelength dispersive spectroscopy. The results showed that the sub-system presents an invariant eutectoid point at 1366 ± 4 °C with a composition of 59.5 wt % Ca3(PO42 and 40.5 wt % Ca2SiO4, and typical eutectoid microstructure of lamellae morphology. These results are in disagreement with the previous reported data, which locate the invariant eutectoid point at 1250 ± 20 °C with a composition of 55 wt % Ca3(PO42 and 45 wt % Ca2SiO4. In addition, cell attachment testing showed that the new eutectoid material supported the mesenchymal stem cell adhesion and spreading, and the cells established close contact with the ceramic after 28 days of culture. These findings indicate that the new ceramic material with eutectoid microstructure of lamellae morphology possesses good bioactivity and biocompatibility and might be a promising bone implant material.

  6. A promising tritium breeding material: Nanostructured 2Li2TiO3-Li4SiO4 biphasic ceramic pebbles

    Science.gov (United States)

    Dang, Chen; Yang, Mao; Gong, Yichao; Feng, Lan; Wang, Hailiang; Shi, Yanli; Shi, Qiwu; Qi, Jianqi; Lu, Tiecheng

    2018-03-01

    As an advanced tritium breeder material for the fusion reactor blanket of the International Thermonuclear Experimental Reactor (ITER), Li2TiO3-Li4SiO4 biphasic ceramic has attracted widely attention due to its merits. In this paper, the uniform precursor powders were prepared by hydrothermal method, and nanostructured 2Li2TiO3-Li4SiO4 biphasic ceramic pebbles were fabricated by an indirect wet method at the first time. In addition, the composition dependence (x/y) of their microstructure characteristics and mechanical properties were investigated. The results indicated that the crush load of biphasic ceramic pebbles was better than that of single phase ceramic pebbles under identical conditions. The 2Li2TiO3-Li4SiO4 ceramic pebbles have good morphology, small grain size (90 nm), satisfactory crush load (37.8 N) and relative density (81.8 %T.D.), which could be a promising breeding material in the future fusion reactor.

  7. Solar cell array interconnects

    Science.gov (United States)

    Carey, Paul G.; Thompson, Jesse B.; Colella, Nicolas J.; Williams, Kenneth A.

    1995-01-01

    Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.

  8. Qubit compatible superconducting interconnects

    Science.gov (United States)

    Foxen, B.; Mutus, J. Y.; Lucero, E.; Graff, R.; Megrant, A.; Chen, Yu; Quintana, C.; Burkett, B.; Kelly, J.; Jeffrey, E.; Yang, Yan; Yu, Anthony; Arya, K.; Barends, R.; Chen, Zijun; Chiaro, B.; Dunsworth, A.; Fowler, A.; Gidney, C.; Giustina, M.; Huang, T.; Klimov, P.; Neeley, M.; Neill, C.; Roushan, P.; Sank, D.; Vainsencher, A.; Wenner, J.; White, T. C.; Martinis, John M.

    2018-01-01

    We present a fabrication process for fully superconducting interconnects compatible with superconducting qubit technology. These interconnects allow for the three dimensional integration of quantum circuits without introducing lossy amorphous dielectrics. They are composed of indium bumps several microns tall separated from an aluminum base layer by titanium nitride which serves as a diffusion barrier. We measure the whole structure to be superconducting (transition temperature of 1.1 K), limited by the aluminum. These interconnects have an average critical current of 26.8 mA, and mechanical shear and thermal cycle testing indicate that these devices are mechanically robust. Our process provides a method that reliably yields superconducting interconnects suitable for use with superconducting qubits.

  9. Balkan electro energetic interconnections

    International Nuclear Information System (INIS)

    Cherepnalkovski, Trajche; Grashevska-Shekjerinska, Jelena; Badarovska, Elizabeta; Cherepnalkovski, Nikola

    1998-01-01

    The Balkan Energy Interconnections Task Force was realized in the framework of the Black Sea Regional Energy Center (BSREC); to set up comprehensive inventory of the potential Interconnection projects in the region and with the neighboring systems. In the paper impacts to the region of the strategy for developing the Trans European Networks (TEN) and potential interests for inter regional cooperation are analyzed. The list of accepted projects and applied methodology for definition the priorities are presented. (Author)

  10. Benefits of transmission interconnections

    International Nuclear Information System (INIS)

    Lyons, D.

    2006-01-01

    The benefits of new power transmission interconnections from Alberta were discussed with reference to the challenges and measures needed to move forward. Alberta's electricity system has had a long period of sustained growth in generation and demand and this trend is expected to continue. However, no new interconnections have been built since 1985 because the transmission network has not expanded in consequence with the growth in demand. As such, Alberta remains weakly interconnected with the rest of the western region. The benefits of stronger transmission interconnections include improved reliability, long-term generation capability, hydrothermal synergies, a more competitive market, system efficiencies and fuel diversity. It was noted that the more difficult challenges are not technical. Rather, the difficult challenges lie in finding an appropriate business model that recognizes different market structures. It was emphasized that additional interconnections are worthwhile and will require significant collaboration among market participants and governments. It was concluded that interties enable resource optimization between systems and their benefits far exceed their costs. tabs., figs

  11. SOFC INTERCONNECT DEVELOPMENT

    Energy Technology Data Exchange (ETDEWEB)

    Diane M. England

    2004-03-16

    An interconnect for an SOFC stack is used to connect fuel cells into a stack. SOFC stacks are expected to run for 40,000 hours and 10 thermal cycles for the stationary application and 10,000 hours and 7000 thermal cycles for the transportation application. The interconnect of a stack must be economical and robust enough to survive the SOFC stack operation temperature of 750 C and must maintain the electrical connection to the fuel cells throughout the lifetime and under thermal cycling conditions. Ferritic and austenitic stainless steels, and nickel-based superalloys were investigated as possible interconnect materials for solid oxide fuel cell (SOFC) stacks. The alloys were thermally cycled in air and in a wet nitrogen-argon-hydrogen (N2-Ar-H2-H2O) atmosphere. Thermogravimetry was used to determine the parabolic oxidation rate constants of the alloys in both atmospheres. The area-specific resistance of the oxide scale and metal substrates were measured using a two-probe technique with platinum contacts. The study identifies two new interconnect designs which can be used with both bonded and compressive stack sealing mechanisms. The new interconnect designs offer a solution to chromium vaporization, which can lead to degradation of some (chromium-sensitive) SOFC cathodes.

  12. Stress-induced formation mechanism of stacking fault tetrahedra in nano-cutting of single crystal copper

    International Nuclear Information System (INIS)

    Wang, Quanlong; Bai, Qingshun; Chen, Jiaxuan; Guo, Yongbo; Xie, Wenkun

    2015-01-01

    Graphical abstract: In this paper, molecular dynamics simulation is performed to study the distribution of dislocation defects and local atomic crystal structure of single crystal copper. The stress distribution is investigated which is calculated by virial stress and analyzed by static pressure. The results are shown in (a)–(d). It is indicated that the compressive stress mainly spreads over the shear-slip zone, and the tensile stress is consisted in flank friction zone, shown in (a). The high tensile stress in subsurface is the source of stress, shown in (b). By the driven action of the stress source, the initial stair-rod dislocation nucleates. Then the dislocation climbs along four {1 1 1} planes under the stress driven action, shown in (d). Finally, the SFT is formed by the interaction of the compressive stress and the tensile stress which come from the shear-slip zone and friction zone, respectively. Besides, stair-rod dislocation, stacking faults and dislocation loop are also nucleated in the subsurface, shown in (c). Dislocation distribution, local atomic crystal structure state and stress-induced formation process of SFT by atomic. - Highlights: • A novel defect structure “stress-induced stacking fault tetrahedra” is revealed. • Atomic structural evolution and stress state distribution of the SFT are studied. • The stress-induced formation mechanism of the SFT is proposed. - Abstract: Stacking fault tetrahedra commonly existed in subsurface of deformed face center cubic metals, has great influence on machining precision and surface roughness in nano-cutting. Here we report, a stacking fault tetrahedra is formed in subsurface of workpiece during nano-cutting. The variation of cutting force and subsurface defects distribution are studied by using molecular dynamics simulation. The stress distribution is investigated which is calculated by virial stress and analyzed by static compression. The result shows that the cutting force has a rapidly

  13. Adsorption mechanism of H2O molecule on the Li4SiO4 (0 1 0) surface from first principles

    Science.gov (United States)

    Kong, Xianggang; Yu, You; Ma, Shenggui; Gao, Tao; Xiao, Chengjian; Chen, Xiaojun

    2018-01-01

    The adsorption and dissociation behaviors of molecular H2O on the Li4SiO4 (0 1 0) surface have been systematically studied by first-principles calculations. It is found that the adsorbed H2O molecule mainly interacts with the O and Li atoms of the surface, that is, H atom bonds with O atoms of the surface while O atom bonds with the surface Li atoms due to the hydrogen bond effect. According to the different adsorption energies and vibrational frequencies of H2O, different adsorption types can be classified. These results may explain the origin of multiple desorption peaks in TDS experiments.

  14. Open Systems Interconnection.

    Science.gov (United States)

    Denenberg, Ray

    1985-01-01

    Discusses the need for standards allowing computer-to-computer communication and gives examples of technical issues. The seven-layer framework of the Open Systems Interconnection (OSI) Reference Model is explained and illustrated. Sidebars feature public data networks and Recommendation X.25, OSI standards, OSI layer functions, and a glossary.…

  15. CAISSON: Interconnect Network Simulator

    Science.gov (United States)

    Springer, Paul L.

    2006-01-01

    Cray response to HPCS initiative. Model future petaflop computer interconnect. Parallel discrete event simulation techniques for large scale network simulation. Built on WarpIV engine. Run on laptop and Altix 3000. Can be sized up to 1000 simulated nodes per host node. Good parallel scaling characteristics. Flexible: multiple injectors, arbitration strategies, queue iterators, network topologies.

  16. Study on energy transfer and energy migration of Ca2Gd8(SiO4)6O2:Dy3+ phosphor films.

    Science.gov (United States)

    Wang, X Q; Han, X M; Zhen, C M

    2011-11-01

    Being a kind of rare-earth-metal silicate with oxidapatite structure, Ca2R8(SiO4)6O2 (R = Y, Gd, La) is a promising material doped with rare earth, and widely used as phosphors. In this thesis, Ca2Gd8(SiO4)6O2:Dy3+ films were prepared by the sol-gel method. X-ray diffraction (XRD), atomic force microscopy (AFM), photoluminescence (PL) spectra, and lifetimes were used to characterize the resulting films. AFM study indicated that the phosphor films consisted of 120 nm homogeneous particles. By combining the model of Burshtein for donor-donor migration and the V-F-B model for donor-acceptor energy transfer, the experimental luminescence decay curve of 6P(J) state of Gd3+ was re-simulated. It is found that concentration quenching of Gd3+ can be due to the result of the joint action of donor-donor (Gd3+-Gd3+) energy migration and donor-acceptor (Gd3+-Dy3+) energy transfer.

  17. Luminescence behavior of Li2 Sr1-3x/2 Eux SiO4 red phosphors for LED applications.

    Science.gov (United States)

    Sun, Xin-Yuan; Lin, Liang-Wu; Liu, Guang-Yao; Liu, Xin-Gen; Wu, Ai-Jin; Huang, Shi-Ming

    2014-03-01

    Red-emitting Li(2)Sr(1-3x/2)Eux SiO4 0 ≤ x ≤ 0.5) phosphors were synthesized at 900 °C in air by a solid-state reaction. The synthesized phosphors were characterized by X-ray powder diffraction, photoluminescence (PL) excitation (PLE) and PL spectra. The results from the PLE spectra suggest that the strong 394 nm excitation peak associated with the (5) L6 state of Eu(3+) ions is of significance for near ultraviolet pumped white light-emitting diodes and solid-state lighting. It is also noted that the position of the charge transfer state of Eu(3+) ions shifts towards the higher energy side (blue shift) by increasing the content of Eu(3+) ions. The predominant emissions of Eu(3+) ions under 394 nm excitation are observed at 580, 593, 614, 656 and 708 nm, which are attributed to the (5) D0 → (7)FJ (J = 0, 1, 2, 3 and 4), respectively. The PL results reveal that the optimal content of the red-emitting Li2 Sr(1-3x/2)Eux SiO4 phosphors is x = 0.475. Simulation of the white light excited by 394 nm near ultraviolet light has also been carried out for its potential white light-emitting diode applications. Copyright © 2013 John Wiley & Sons, Ltd.

  18. Electromagnetism and interconnections

    CERN Document Server

    Charruau, S

    2009-01-01

    This book covers the theoretical problems of modeling electrical behavior of the interconnections encountered in everyday electronic products. The coverage shows the theoretical tools of waveform prediction at work in the design of a complex and high-speed digital electronic system. Scientists, research engineers, and postgraduate students interested in electromagnetism, microwave theory, electrical engineering, or the development of simulation tools software for high speed electronic system design automation will find this book an illuminating resource.

  19. Photovoltaic sub-cell interconnects

    Science.gov (United States)

    van Hest, Marinus Franciscus Antonius Maria; Swinger Platt, Heather Anne

    2017-05-09

    Photovoltaic sub-cell interconnect systems and methods are provided. In one embodiment, a photovoltaic device comprises a thin film stack of layers deposited upon a substrate, wherein the thin film stack layers are subdivided into a plurality of sub-cells interconnected in series by a plurality of electrical interconnection structures; and wherein the plurality of electrical interconnection structures each comprise no more than two scribes that penetrate into the thin film stack layers.

  20. Interconnects, Transmitters, and Receivers

    Science.gov (United States)

    Hoefflinger, Bernd

    Interconnects on-chip between transistors and between functions like processors and memories, between chips on carriers or in stacks, and the communication with the outside world have become a highly complex performance, reliability, cost, and energy challenge. Twelve layers of metal interconnects, produced by lithography, require, including the contact vias, 24 mask and process cycles on top of the process front-end. The resulting lines are associated with resistance, capacitance and inductance parasitics as well as with ageing due to high current densities. Large savings in wiring lengths are achieved with 3D integration: transistor stacking, chip stacking and TSV's, a direction, which has exploded since 2005 because of many other benefits and, at the same time, with sensitive reliability and cost issues. On top of this or as an alternative, non-contact interconnects are possible with capacitive or inductive coupling. Inductive in particular has proven to be attractive because its transmission range is large enough for communication in chip stacks and yet not too large to cause interference.Optical transmitters based on integrated III-V compound-semiconductor lasers and THz power amplifiers compete with ascending low-cost, parallel-wire transmitters based on BiCMOS technologies. Parallel mm-wave and THz transceiver arrays enable mm-wave radar for traffic safety and THz computed-tomography. In spite of all these technology advances, the power efficiency of data communication will only improve 100× in a decade. New compression and architectural techniques are in high demand.

  1. Interconnectivity: Benefits and Challenges

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2010-09-15

    Access to affordable and reliable electricity supplies is a basic prerequisite for economic and social development, prosperity, health, education and all other aspects of modern society. Electricity can be generated both near and far from the consumption areas as transmission lines, grid interconnections and distribution systems can transport it to the final consumer. In the vast majority of countries, the electricity sector used to be owned and run by the state. The wave of privatisation and market introduction in a number of countries and regions which started in the late 1980's has in many cases involved unbundling of generation from transmission and distribution (T and D). This has nearly everywhere exposed transmission bottlenecks limiting the development of well-functioning markets. Transmission on average accounts for about 10-15% of total final kWh cost paid by the end-user but it is becoming a key issue for effective operation of liberalised markets and for their further development. An integrated and adequate transmission infrastructure is of utmost importance for ensuring the delivery of the most competitively priced electricity, including externalities, to customers, both near and far from the power generating facilities. In this report, the role of interconnectivity in the development of energy systems is examined with the associated socio-economic, environmental, financial and regulatory aspects that must be taken into account for successful interconnection projects.

  2. Interconnection of Distributed Energy Resources

    Energy Technology Data Exchange (ETDEWEB)

    Reiter, Emerson [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2017-04-19

    This is a presentation on interconnection of distributed energy resources, including the relationships between different aspects of interconnection, best practices and lessons learned from different areas of the U.S., and an update on technical advances and standards for interconnection.

  3. Electron excitations in BeAl2O4, Be2SiO4 and Be3Al2Si6O18 crystals

    International Nuclear Information System (INIS)

    Ivanov, V.Yu.; Pustovarov, V.A.; Shlygin, E.S.; Korotaev, A.V.; Kruzhalov, A.V.

    2005-01-01

    Low-temperature (T = 7 K) time-resolved selectively photoexcited luminescence spectra (2-6 eV) and luminescence excitation spectra (8-35 eV) of wide-bandgap chrysoberyl BeAl 2 O 4 , phenacite Be 2 SiO 4 , and beryl Be 3 Al 2 Si 6 O 18 crystals have been studied using time-resolved VUV spectroscopy. Both the intrinsic luminescence of the crystals and the luminescence associated with structural defects were assigned. Energy transfer to impurity luminescence centers in alexandrite and emerald was investigated. Luminescence characteristics of stable crystal lattice defects were probed by 3.6-MeV accelerated helium ion beams [ru

  4. Structural study of caesium-based britholites Sr7La2Cs(PO4)5(SiO4)F2

    International Nuclear Information System (INIS)

    Boughzala, K.; Gmati, N.; Bouzouita, K.; Ben Cherifa, A.; Gravereau, P.

    2010-01-01

    Several studies demonstrated the ability of britholites to retain radionuclides such as the caesium and actinides. Therefore, three compounds with formulas Sr 8 LaCs(PO 4 ) 6 F 2 , Sr 7 La 2 Cs(PO 4 ) 5 (SiO 4 )F 2 and Sr 2 La 7 Cs(SiO 4 ) 6 F 2 , were prepared by solid state reaction. However, it seems that only the mono-silicated composition was obtained in a pure state. In this present work, the X-ray diffraction and magnetic nuclear resonance have been used to investigate the structure for this composition. The results showed that in fact this phase was not pure, but it was mixed with a secondary phase, SrLaCs(PO 4 ) 2 . The refinement by the Rietveld method allowed also to precise the distribution of La 3+ and Cs + ions between the two cationic sites of the apatite. (authors)

  5. Calibration of Mg2SiO4(Tb) thermoluminescent dosimeters for use in determining diagnostic X-ray doses to Adult Health Study participants

    International Nuclear Information System (INIS)

    Kato, Kazuo; Antoku, Shigetoshi; Sawada, Shozo; Russell, W.J.

    1989-11-01

    Characteristics of Mg 2 SiO 4 (Tb) thermoluminescent dosimeters (TLD) were ascertained preparatory to measuring dose from diagnostic X-ray examinations received by Adult Health Study participants. These detectors are small, relatively sensitive to low-dose X rays, and are appropriate for precise dosimetry. Extensive calibration is necessary for precisely determining doses according to their thermoluminescent intensities. Their sensitivities were investigated, by dose according to X-ray tube voltage, and by exposure direction, to obtain directional dependence. Dosimeter sensitivity lessened due to the fading effect and diminution of the planchet. However, these adverse effects can be avoided by storing the dosimeters at least 1.5 hours and by using fresh silver-plated planchets. Thus, the TLDs, for which sensitivities were determined in this study, will be useful in subsequent diagnostic X-ray dosimetry. (author)

  6. Molten (Mg0.88Fe0.12)2SiO4 at lower mantle conditions - Melting products and structure of quenched glasses

    Science.gov (United States)

    Williams, Quentin

    1990-01-01

    Infrared spectra of quenched magnesium silicate glasses synthesized by fusing olivine at pressures in excess of 50 GPa and temperatures greater than 2500 K demonstrate that silicon is dominantly present in four-fold coordination with respect to oxygen within these quenched glasses. This low coordination is attributed, by analogy with the structural behavior of glasses compressed at 300 K, to the instability of higher coordinations in glasses of these compositions on decompression. Spectra of glasses formed in a hydrous environment document that water is extensively soluble in melts at these high pressures and temperatures. Also, these results are consistent with the melting of (Mg0.88Fe0.12)2SiO4 compositions to liquids near pyroxene in stoichiometry under these conditions, with iron-rich magnesiowuestite being the liquidus phase.

  7. LHC beampipe interconnection

    CERN Multimedia

    Particle beams circulate for around 10 hours in the Large Hadron Collider (LHC). During this time, the particles make four hundred million revolutions of the machine, travelling a distance equivalent to the diameter of the solar system. The beams must travel in a pipe which is emptied of air, to avoid collisions between the particles and air molecules (which are considerably bigger than protons). The beam pipes are pumped down to an air pressure similar to that on the surface of the moon. Much of the LHC runs at 1.9 degrees above absolute zero. When material is cooled, it contracts. The interconnections must absorb this contraction whilst maintaining electrical connectivity.

  8. Hindered rotational energy barriers of BH4- tetrahedra in β-Mg(BH4)2 from quasielastic neutron scattering and DFT calculations

    DEFF Research Database (Denmark)

    Blanchard, Didier; Maronsson, Jon Bergmann; Riktor, M.D.

    2012-01-01

    In this work, hindered rotations of the BH4- tetrahedra in Mg(BH4)2 were studied by quasielastic neutron scattering, using two instruments with different energy resolution, in combination with density functional theory (DFT) calculations. Two thermally activated reorientations of the BH4- units...

  9. Performance of Topological Insulator Interconnects

    OpenAIRE

    Philip, Timothy M.; Hirsbrunner, Mark R.; Park, Moon Jip; Gilbert, Matthew J.

    2016-01-01

    The poor performance of copper interconnects at the nanometer scale calls for new material solutions for continued scaling of integrated circuits. We propose the use of three dimensional time-reversal-invariant topological insulators (TIs), which host backscattering-protected surface states, for this purpose. Using semiclassical methods, we demonstrate that nanoscale TI interconnects have a resistance 1-3 orders of magnitude lower than copper interconnects and graphene nanoribbons at the nano...

  10. Fuel cell system with interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Goettler, Richard; Liu, Zhien

    2017-12-12

    The present invention includes a fuel cell system having a plurality of adjacent electrochemical cells formed of an anode layer, a cathode layer spaced apart from the anode layer, and an electrolyte layer disposed between the anode layer and the cathode layer. The fuel cell system also includes at least one interconnect, the interconnect being structured to conduct free electrons between adjacent electrochemical cells. Each interconnect includes a primary conductor embedded within the electrolyte layer and structured to conduct the free electrons.

  11. Crystal structure, equation of state, and elasticity of hydrous aluminosilicate phase, topaz-OH (Al2SiO4(OH)2) at high pressures

    Science.gov (United States)

    Mookherjee, Mainak; Tsuchiya, Jun; Hariharan, Anant

    2016-02-01

    We examined the equation of state and high-pressure elasticity of the hydrous aluminosilicate mineral topaz-OH (Al2SiO4(OH)2) using first principles simulation. Topaz-OH is a hydrous phase in the Al2O3-SiO2-H2O (ASH) ternary system, which is relevant for the mineral phase relations in the hydrated sedimentary layer of subducting slabs. Based on recent neutron diffraction experiments, it is known that the protons in the topaz-OH exhibit positional disorder with half occupancy over two distinct crystallographic sites. In order to adequately depict the proton environment in the topaz-OH, we examined five crystal structure models with distinct configuration for the protons in topaz-OH. Upon full geometry optimization we find two distinct space group, an orthorhombic Pbnm and a monoclinic P21/c for topaz-OH. The topaz-OH with the monoclinic P21/c space group has a lower energy compared to the orthorhombic Pbmn space group symmetry. The pressure-volume results for the monoclinic topaz-OH is well represented by a third order Birch-Murnaghan formulation, with V0mon = 348.63 (±0.04) Å3, K0mon = 164.7 (±0.04) GPa, and K0mon = 4.24 (±0.05). The pressure-volume results for the orthorhombic topaz-OH is well represented by a third order Birch-Murnaghan formulation, with V0orth = 352.47 (±0.04) Å3, K0orth = 166.4 (±0.06) GPa, and K0orth = 4.03 (±0.04). While the bulk moduli are very similar for both the monoclinic and orthorhombic topaz-OH, the shear elastic constants and the shear moduli are very sensitive to the position of the proton, orientation of the O-H dipole, and the space group symmetry. The S-wave anisotropy for the orthorhombic and monoclinic topaz-OH are also quite distinct. In the hydrated sedimentary layer of subducting slabs, transformation of a mineral assemblage consisting of coesite (SiO2) and diaspore (AlOOH) to topaz-OH (Al2SiO4(OH)2) is likely to be accompanied by an increase in density, compressional velocity, and shear wave velocity. However, further studies of physical properties and lattice preferred orientation of several key hydrous aluminosilicates needs to be prioritized for gaining better insight into the transport of water via subduction of sediments.

  12. Area array interconnection handbook

    CERN Document Server

    Totta, Paul A

    2012-01-01

    Microelectronic packaging has been recognized as an important "enabler" for the solid­ state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later famil...

  13. Location constrained resource interconnection

    International Nuclear Information System (INIS)

    Hawkins, D.

    2008-01-01

    This presentation discussed issues related to wind integration from the perspective of the California Independent System Operator (ISO). Issues related to transmission, reliability, and forecasting were reviewed. Renewable energy sources currently used by the ISO were listed, and details of a new transmission financing plan designed to address the location constraints of renewable energy sources and provide for new transmission infrastructure was presented. The financing mechanism will be financed by participating transmission owners through revenue requirements. New transmission interconnections will include network facilities and generator tie-lines. Tariff revisions have also been implemented to recover the costs of new facilities and generators. The new transmission project will permit wholesale transmission access to areas where there are significant energy resources that are not transportable. A rate impact cap of 15 per cent will be imposed on transmission owners to mitigate short-term costs to ratepayers. The presentation also outlined energy resource area designation plans, renewable energy forecasts, and new wind technologies. Ramping issues were also discussed. It was concluded that the ISO expects to ensure that 20 per cent of its energy will be derived from renewable energy sources. tabs., figs

  14. Triangles and tetrahedra: metal directed self-assembly of metallo-supramolecular structures incorporating bis-beta-diketonato ligands.

    Science.gov (United States)

    Clegg, Jack K; Lindoy, Leonard F; Moubaraki, Boujema; Murray, Keith S; McMurtrie, John C

    2004-08-21

    The interaction of six aryl-linked bis-beta-diketones, including a new naphthylene linked species, with copper(II), iron(III) and, in one instance gallium(III), has been investigated with the aim of obtaining metallo-supramolecular assemblies exhibiting different geometries. New examples of two assembly types incorporating the above bis-beta-diketones (L) were generated. The first type is represented by a range of molecular triangles of formula [Cu(3)(L-H(2))(3)](solvent)(n) while the second is given by a corresponding selection of less-common neutral molecular tetrahedra of formula [Fe(4)(L-H(2))(6)](solvent)(n) as well as [Ga(4)(L-H(2))(6)].8.5THF.0.5H(2)O; an example of each type has been characterised by X-ray crystallography. A magnetochemical investigation of [Fe(4)(-H(2))(6)].6THF is reported. The susceptibility is Curie like and consistent with very weak coupling occurring between the iron(III) d(5)(high spin) centres. The X-ray structures of two trinuclear copper(II) as well as a tetranuclear iron(III) and a tetranuclear gallium(III) assembly confirm their discrete triangular and tetrahedral geometries, respectively. The structure of the gallium(III) species is closely related to that of the corresponding iron(III) species. The tetrahedral structures provide rare examples of such assemblies encapsulating guest solvent molecules--in each case tetrahydrofuran is incorporated in the central cavity.

  15. Process for electrically interconnecting electrodes

    Science.gov (United States)

    Carey, Paul G.; Thompson, Jesse B.; Colella, Nicolas J.; Williams, Kenneth A.

    2002-01-01

    Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb--Sn) no-clean fluxless solder cream, whereby the high breakage of thin (copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb--Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.

  16. Graph theory and interconnection networks

    CERN Document Server

    Hsu, Lih-Hsing

    2008-01-01

    The advancement of large scale integrated circuit technology has enabled the construction of complex interconnection networks. Graph theory provides a fundamental tool for designing and analyzing such networks. Graph Theory and Interconnection Networks provides a thorough understanding of these interrelated topics. After a brief introduction to graph terminology, the book presents well-known interconnection networks as examples of graphs, followed by in-depth coverage of Hamiltonian graphs. Different types of problems illustrate the wide range of available methods for solving such problems. The text also explores recent progress on the diagnosability of graphs under various models.

  17. Interconnecting heterogeneous database management systems

    Science.gov (United States)

    Gligor, V. D.; Luckenbaugh, G. L.

    1984-01-01

    It is pointed out that there is still a great need for the development of improved communication between remote, heterogeneous database management systems (DBMS). Problems regarding the effective communication between distributed DBMSs are primarily related to significant differences between local data managers, local data models and representations, and local transaction managers. A system of interconnected DBMSs which exhibit such differences is called a network of distributed, heterogeneous DBMSs. In order to achieve effective interconnection of remote, heterogeneous DBMSs, the users must have uniform, integrated access to the different DBMs. The present investigation is mainly concerned with an analysis of the existing approaches to interconnecting heterogeneous DBMSs, taking into account four experimental DBMS projects.

  18. Characterization and origin of low-T willemite (Zn2SiO4) mineralization: the case of the Bou Arhous deposit (High Atlas, Morocco)

    Science.gov (United States)

    Choulet, Flavien; Barbanson, Luc; Buatier, Martine; Richard, James; Vennemann, Torsten; Ennaciri, Aomar; Zouhair, Mohamed

    2017-10-01

    Willemite (Zn2SiO4) usually reported in hypogene non-sulfide deposits is described as the main ore mineral in the carbonate-hosted Bou Arhous zinc deposit. This deposit is located in the High Atlas intracontinental range that formed during the Tertiary. Based on a set of microscopic observations, it was possible to establish that willemite replaces primary sphalerite. On the basis of cathodoluminescence imaging, three successive generations of willemite are distinguished, with evidence of dissolution-reprecipitation processes. Willemite is also variably enriched in Ge (up to 1000 ppm), while Ge contents lower than 100 ppm are reported in the primary sulfide minerals. Depending on the willemite generation, this substitution was positively or negatively correlated to the Zn-Pb substitution. According to the nature of zoning (sector versus oscillatory), the incorporation of Ge was either controlled by crystallographic factors or by the nature of the mineralizing fluids. Willemite is associated with other oxidation-related mineral species, like cerussite (PbCO3) but is not in isotopic equilibrium and therefore not considered to be cogenetic. Oxygen isotope compositions support the formation of willemite at temperatures below 130 °C, from mixed meteoric and deeper, hydrothermal fluids. The formation of the High Atlas Belt during the Tertiary has contributed to the exhumation of the sulfide minerals and the development of vertical conduits for percolation of meteoric water and ascending hydrothermal fluids. In addition to a local contribution of silicate minerals of the host limestone, hydrothermal fluids probably transported Si and Ge that are incorporated in willemite.

  19. Universal Interconnection Technology Workshop Proceedings

    Energy Technology Data Exchange (ETDEWEB)

    Sheaffer, P.; Lemar, P.; Honton, E. J.; Kime, E.; Friedman, N. R.; Kroposki, B.; Galdo, J.

    2002-10-01

    The Universal Interconnection Technology (UIT) Workshop - sponsored by the U.S. Department of Energy, Distributed Energy and Electric Reliability (DEER) Program, and Distribution and Interconnection R&D - was held July 25-26, 2002, in Chicago, Ill., to: (1) Examine the need for a modular universal interconnection technology; (2) Identify UIT functional and technical requirements; (3) Assess the feasibility of and potential roadblocks to UIT; (4) Create an action plan for UIT development. These proceedings begin with an overview of the workshop. The body of the proceedings provides a series of industry representative-prepared papers on UIT functions and features, present interconnection technology, approaches to modularization and expandability, and technical issues in UIT development as well as detailed summaries of group discussions. Presentations, a list of participants, a copy of the agenda, and contact information are provided in the appendices of this document.

  20. SU-8 cantilever chip interconnection

    DEFF Research Database (Denmark)

    Johansson, Alicia Charlotte; Janting, Jakob; Schultz, Peter

    2006-01-01

    the electrodes on the SU-8 chip to a printed circuit board. Here, we present two different methods of electrically connecting an SU-8 chip, which contains a microfluidic network and free-hanging mechanical parts. The tested electrical interconnection techniques are flip chip bonding using underfill or flip chip...... bonding using an anisotropic conductive film (ACF). These are both widely used in the Si industry and might also be used for the large scale interconnection of SU-8 chips. The SU-8 chip, to which the interconnections are made, has a microfluidic channel with integrated micrometer-sized cantilevers...... that can be used for label-free biochemical detection. All the bonding tests are compared with results obtained using similar Si chips. It is found that it is significantly more complicated to interconnect SU-8 than Si cantilever chips primarily due to the softness of SU-8....

  1. Fuel cell system with interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Zhien; Goettler, Richard

    2016-12-20

    The present invention includes an integrated planar, series connected fuel cell system having electrochemical cells electrically connected via interconnects, wherein the anodes of the electrochemical cells are protected against Ni loss and migration via an engineered porous anode barrier layer.

  2. An unusual nitride network of aluminum-centered octahedra and phosphorus-centered tetrahedra and structure determination from microcrystalline samples.

    Science.gov (United States)

    Neudert, Lukas; Heinke, Frank; Bräuniger, Thomas; Pucher, Florian J; Vaughan, Gavin B; Oeckler, Oliver; Schnick, Wolfgang

    2017-02-28

    A new imidooxonitridophosphate AlP 6 O 3x (NH) 3-3x N 9 with x ≈ 0.33 was synthesized under high-pressure high-temperature conditions. The crystal structure determination of the microcrystalline product involved a combination of electron microscopy, synchrotron X-ray diffraction and solid-state NMR. In the solid there are discrete AlN 6 octahedra that interconnect imidophosphate layers. The network topology is unprecedented but is related to other nitride structures.

  3. Synthesis and luminescence properties of a blue-emitting Sr3.5Y6.5O2(PO4)1.5SiO4(4.5) :Eu2+ phosphor.

    Science.gov (United States)

    Xia, Zhiguo; Zhuang, Jiaqing

    2012-01-01

    A novel blue-emitting Sr3.5Y6.5O2(PO4)1.5SiO4(4.5) :Eu2+ phosphor was synthesized via a solid-state reaction. Powder X-ray diffraction (XRD) analysis demonstrated that the Sr3.5Y6.5O2(PO4)1.5(SiO4)4.5 host had a hexagonal crystal structure in the space group P6(3) /m and unit cell parameters a = 9.418 Å, c = 6.900 Å. The as-prepared phosphor showed a blue emission and all the main emission peaks were located at around 466 nm for different excitation wavelengths of 297, 333 and 391 nm. The temperature dependence of the photoluminescence property was investigated in the range 20-250 °C, and the emission intensity decreased to 71% of the initial value at room temperature on increasing the temperature to 150 °C. According to the classical theory of fluorescent thermal quenching, the activation energy (ΔE) for the thermal quenching luminescence of the as-prepared Sr3.45Y6.5O2(PO4)1.5(SiO4)4.5 :0.05Eu2+ phosphor was determined to be 0.20 eV. Copyright © 2011 John Wiley & Sons, Ltd.

  4. Manufacturing of planar ceramic interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Armstrong, B.L.; Coffey, G.W.; Meinhardt, K.D.; Armstrong, T.R. [Pacific Northwest National Lab., Richland, WA (United States)

    1996-12-31

    The fabrication of ceramic interconnects for solid oxide fuel cells (SOFC) and separator plates for electrochemical separation devices has been a perennial challenge facing developers. Electrochemical vapor deposition (EVD), plasma spraying, pressing, tape casting and tape calendering are processes that are typically utilized to fabricate separator plates or interconnects for the various SOFC designs and electrochemical separation devices. For sake of brevity and the selection of a planar fuel cell or gas separation device design, pressing will be the only fabrication technique discussed here. This paper reports on the effect of the characteristics of two doped lanthanum manganite powders used in the initial studies as a planar porous separator for a fuel cell cathode and as a dense interconnect for an oxygen generator.

  5. High-speed photonics interconnects

    CERN Document Server

    Chrostowski, Lukas

    2013-01-01

    Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the amount of data communicated between chips, so as not to limit overall system performance. To meet the increasing demand for interchip communication bandwidth, researchers are investigating the use of high-speed optical interconnect architectures. Unlike their electrical counterparts, optical interconnects offer high bandwidth and negligible frequency-dependent loss, making possible per-channel data rates of more than 10 Gb/s. High-Speed

  6. Cellular structures with interconnected microchannels

    Energy Technology Data Exchange (ETDEWEB)

    Shaefer, Robert Shahram; Ghoniem, Nasr M.; Williams, Brian

    2018-01-30

    A method for fabricating a cellular tritium breeder component includes obtaining a reticulated carbon foam skeleton comprising a network of interconnected ligaments. The foam skeleton is then melt-infiltrated with a tritium breeder material, for example, lithium zirconate or lithium titanate. The foam skeleton is then removed to define a cellular breeder component having a network of interconnected tritium purge channels. In an embodiment the ligaments of the foam skeleton are enlarged by adding carbon using chemical vapor infiltration (CVI) prior to melt-infiltration. In an embodiment the foam skeleton is coated with a refractory material, for example, tungsten, prior to melt infiltration.

  7. Regulatory Issues Surrounding Merchant Interconnection

    International Nuclear Information System (INIS)

    Kuijlaars, Kees-Jan; Zwart, Gijsbert

    2003-11-01

    We discussed various issues concerning the regulatory perspective on private investment in interconnectors. One might claim that leaving investment in transmission infrastructure to competing market parties is more efficient than relying on regulated investment only (especially in the case of long (DC) lines connecting previously unconnected parts of the grids, so that externalities from e.g. loop flows do not play a significant role). We considered that some aspects of interconnection might reduce these market benefits. In particular, the large fixed costs of interconnection construction may lead to significant under investment (due to both first mover monopoly power and the fact that part of generation cost efficiencies realised by interconnection are not captured by the investor itself, and remain external to the investment decision). Second, merchant ownership restricts future opportunities for adaptation of regulation, as would be required e.g. for introduction of potentially more sophisticated methods of congestion management or market splitting. Some of the disadvantages of merchant investment may be mitigated however by a suitable regulatory framework, and we discussed some views in this direction. The issues we discussed are not intended to give a complete framework, and detailed regulation will certainly involve many more specific requirements. Areas we did not touch upon include e.g. the treatment of deep connection costs, rules for operation and maintenance of the line, and impact on availability of capacity on other interconnections

  8. Nanophotonic Devices for Optical Interconnect

    DEFF Research Database (Denmark)

    Van Thourhout, D.; Spuesens, T.; Selvaraja, S.K.

    2010-01-01

    We review recent progress in nanophotonic devices for compact optical interconnect networks. We focus on microdisk-laser-based transmitters and discuss improved design and advanced functionality including all-optical wavelength conversion and flip-flops. Next we discuss the fabrication uniformity...

  9. Interconnection blocks: a method for providing reusable, rapid, multiple, aligned and planar microfluidic interconnections

    International Nuclear Information System (INIS)

    Sabourin, D; Snakenborg, D; Dufva, M

    2009-01-01

    In this paper a method is presented for creating 'interconnection blocks' that are re-usable and provide multiple, aligned and planar microfluidic interconnections. Interconnection blocks made from polydimethylsiloxane allow rapid testing of microfluidic chips and unobstructed microfluidic observation. The interconnection block method is scalable, flexible and supports high interconnection density. The average pressure limit of the interconnection block was near 5.5 bar and all individual results were well above the 2 bar threshold considered applicable to most microfluidic applications

  10. Interconnection blocks: a method for providing reusable, rapid, multiple, aligned and planar microfluidic interconnections

    DEFF Research Database (Denmark)

    Sabourin, David; Snakenborg, Detlef; Dufva, Hans Martin

    2009-01-01

    In this paper a method is presented for creating 'interconnection blocks' that are re-usable and provide multiple, aligned and planar microfluidic interconnections. Interconnection blocks made from polydimethylsiloxane allow rapid testing of microfluidic chips and unobstructed microfluidic...... observation. The interconnection block method is scalable, flexible and supports high interconnection density. The average pressure limit of the interconnection block was near 5.5 bar and all individual results were well above the 2 bar threshold considered applicable to most microfluidic applications....

  11. Driving Interconnected Networks to Supercriticality

    Directory of Open Access Journals (Sweden)

    Filippo Radicchi

    2014-04-01

    Full Text Available Networks in the real world do not exist as isolated entities, but they are often part of more complicated structures composed of many interconnected network layers. Recent studies have shown that such mutual dependence makes real networked systems potentially exposed to atypical structural and dynamical behaviors, and thus there is an urgent necessity to better understand the mechanisms at the basis of these anomalies. Previous research has mainly focused on the emergence of atypical properties in relation to the moments of the intra- and interlayer degree distributions. In this paper, we show that an additional ingredient plays a fundamental role for the possible scenario that an interconnected network can face: the correlation between intra- and interlayer degrees. For sufficiently high amounts of correlation, an interconnected network can be tuned, by varying the moments of the intra- and interlayer degree distributions, in distinct topological and dynamical regimes. When instead the correlation between intra- and interlayer degrees is lower than a critical value, the system enters in a supercritical regime where dynamical and topological phases are no longer distinguishable.

  12. 47 CFR 90.477 - Interconnected systems.

    Science.gov (United States)

    2010-10-01

    ... MOBILE RADIO SERVICES Transmitter Control Interconnected Systems § 90.477 Interconnected systems. (a... indicate on their applications (class of station code) that their stations will be interconnected... the use. (3) For licensees in the Industrial/Business Pool and those licensees who establish...

  13. 18 CFR 292.306 - Interconnection costs.

    Science.gov (United States)

    2010-04-01

    ... 18 Conservation of Power and Water Resources 1 2010-04-01 2010-04-01 false Interconnection costs... § 292.306 Interconnection costs. (a) Obligation to pay. Each qualifying facility shall be obligated to pay any interconnection costs which the State regulatory authority (with respect to any electric...

  14. In-memory interconnect protocol configuration registers

    Energy Technology Data Exchange (ETDEWEB)

    Cheng, Kevin Y.; Roberts, David A.

    2017-09-19

    Systems, apparatuses, and methods for moving the interconnect protocol configuration registers into the main memory space of a node. The region of memory used for storing the interconnect protocol configuration registers may also be made cacheable to reduce the latency of accesses to the interconnect protocol configuration registers. Interconnect protocol configuration registers which are used during a startup routine may be prefetched into the host's cache to make the startup routine more efficient. The interconnect protocol configuration registers for various interconnect protocols may include one or more of device capability tables, memory-side statistics (e.g., to support two-level memory data mapping decisions), advanced memory and interconnect features such as repair resources and routing tables, prefetching hints, error correcting code (ECC) bits, lists of device capabilities, set and store base address, capability, device ID, status, configuration, capabilities, and other settings.

  15. In-memory interconnect protocol configuration registers

    Science.gov (United States)

    Cheng, Kevin Y.; Roberts, David A.

    2017-09-19

    Systems, apparatuses, and methods for moving the interconnect protocol configuration registers into the main memory space of a node. The region of memory used for storing the interconnect protocol configuration registers may also be made cacheable to reduce the latency of accesses to the interconnect protocol configuration registers. Interconnect protocol configuration registers which are used during a startup routine may be prefetched into the host's cache to make the startup routine more efficient. The interconnect protocol configuration registers for various interconnect protocols may include one or more of device capability tables, memory-side statistics (e.g., to support two-level memory data mapping decisions), advanced memory and interconnect features such as repair resources and routing tables, prefetching hints, error correcting code (ECC) bits, lists of device capabilities, set and store base address, capability, device ID, status, configuration, capabilities, and other settings.

  16. Geometry and Width of the Ringwoodite - Bridgmanite+Ferropericlase Binary Loop in the System (Mg,Fe)2SiO4: Interpretation of the Sharpness of the 660-km Discontinuity

    Science.gov (United States)

    Katsura, T.; Ishii, T.; Huang, R.; Maeda, F.; Yuan, L.; Bhat, S.; Farla, R. J.; Kawazoe, T.; Tsujino, N.; Liu, Z.; Fei, H.; Wang, L.; Druzhbin, D.; Yamamoto, T.; Kulik, E.; Koemets, I.; Higo, Y.; Tange, Y.

    2017-12-01

    Short wave-length seismic reflections from the 660 km discontinuity (D660) indicated an extreme sharp, namely less than 2 km thick boundary. To explain this observation, Ito and Takahashi [1989] estimated that the pressure interval of the dissociation of ringwoodite (Rw) to bridgmanite (Brg) plus ferropericlase (fPc) is hours. Simultaneously, after several trials, the press load was increased at the right rate at the temperature to maintain nearly constant pressure within 0.2 GPa. X-ray diffractions of the samples and pressure maker were taken to determine pressure and phases present. An important finding is that the transition pressure in Fo70 is 0.1 GPa higher than that in Fo100. Namely, the hypothetical transition pressure in Fe2SiO4 is 0.3 GPa higher than the transition pressure in Mg2SiO4. This geometry is contrary to the previous understanding. The obtained pressure difference and the partition coefficients of Fe and Mg among Brg, Rw and fPc suggest that the pressure interval is almost zero, which explains the sharpness of the D660.

  17. Integrated Optical Interconnect Architectures for Embedded Systems

    CERN Document Server

    Nicolescu, Gabriela

    2013-01-01

    This book provides a broad overview of current research in optical interconnect technologies and architectures. Introductory chapters on high-performance computing and the associated issues in conventional interconnect architectures, and on the fundamental building blocks for integrated optical interconnect, provide the foundations for the bulk of the book which brings together leading experts in the field of optical interconnect architectures for data communication. Particular emphasis is given to the ways in which the photonic components are assembled into architectures to address the needs of data-intensive on-chip communication, and to the performance evaluation of such architectures for specific applications.   Provides state-of-the-art research on the use of optical interconnects in Embedded Systems; Begins with coverage of the basics for high-performance computing and optical interconnect; Includes a variety of on-chip optical communication topologies; Features coverage of system integration and opti...

  18. Multi-net optimization of VLSI interconnect

    CERN Document Server

    Moiseev, Konstantin; Wimer, Shmuel

    2015-01-01

    This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.  • Describes the evolution of interconnect scaling and provides new techniques for layout migration and optimization, focusing on multi-net optimization; • Presents research results that provide a level of design optimization which does not exist in commercially-available design automation software tools; • Includes mathematical properties and conditions for optimal...

  19. Electricity Market Interconnections and Electricity Price Volatility

    OpenAIRE

    Fonseca, Nuno; Duque, João

    2008-01-01

    In this paper, we present a model of changes in electricity price returns in the context of interconnected electricity markets. This model predicts an inverse relationship between the increase in interconnection capacity and the volatility of price returns in the corresponding electricity markets. This means that an increase of interconnection between two markets leads to a decrease in the volatility of their prices. We support our model with empirical results from the Australian, European an...

  20. Plasma diagnostic studies of the influence of process variables upon the atomic and molecular species ejected from (1-x)Li4SiO4:xLi3PO4 targets during rf-magnetron sputtering

    International Nuclear Information System (INIS)

    Wachs, A.L.; Bates, J.B.; Dudney, N.J.; Luck, C.F.

    1990-01-01

    The deposition of thin-film electrolytes is a critical step in the development of lithium microbatteries with the potential for circuit integration. We have performed a preliminary study of the rf-magnetron sputtering of (1-x)Li 4 SiO 4 :xLi 3 PO 4 targets used to deposit amorphous thin-film electrolytes formed of the three-component system Li 2 O--SiO 2 --P 2 O 5 . Mass and optical emission spectroscopies have been used to investigate the effects of target composition and the deposition conditions upon the atomic and molecular species ejected from the targets. The data provide important information for understanding the mechanism of film formation and for monitoring the Li atomic flux onto the substrates during film growth. 5 refs., 7 figs., 1 tab

  1. Fluidic interconnections for microfluidic systems: A new integrated fluidic interconnection allowing plug 'n' play functionality

    DEFF Research Database (Denmark)

    Perozziello, Gerardo; Bundgaard, Frederik; Geschke, Oliver

    2008-01-01

    for interconnecting polymer microsystems in terms of cost, space and performance. Following this path we propose a new reversible, integrated fluidic interconnection composed of custom-made cylindrical rings integrated in a polymer house next to the fluidic network. This allows plug 'n' play functionality between...... external metal ferrules and the system. Theoretical calculations are made to dimension and model the integrated fluidic interconnection. Leakage tests are performed on the interconnections, in order to experimentally confirm the model, and detect its limits....

  2. Interconnection blocks with minimal dead volumes permitting planar interconnection to thin microfluidic devices

    DEFF Research Database (Denmark)

    Sabourin, David; Snakenborg, Detlef; Dufva, Martin

    2010-01-01

    We have previously described 'Interconnection Blocks' which are re-usable, non-integrated PDMS blocks which allowing multiple, aligned and planar microfluidic interconnections. Here, we describe Interconnection Block versions with zero dead volumes that allow fluidic interfacing to flat or thin s...

  3. Network interconnections: an architectural reference model

    NARCIS (Netherlands)

    Butscher, B.; Lenzini, L.; Morling, R.; Vissers, C.A.; Popescu-Zeletin, R.; van Sinderen, Marten J.; Heger, D.; Krueger, G.; Spaniol, O.; Zorn, W.

    1985-01-01

    One of the major problems in understanding the different approaches in interconnecting networks of different technologies is the lack of reference to a general model. The paper develops the rationales for a reference model of network interconnection and focuses on the architectural implications for

  4. Colligation, Or the Logical Inference of Interconnection

    DEFF Research Database (Denmark)

    Falster, Peter

    1998-01-01

    laws or assumptions. Yet interconnection as an abstract concept seems to be without scientific underpinning in pure logic. Adopting a historical viewpoint, our aim is to show that the reasoning of interconnection may be identified with a neglected kind of logical inference, called "colligation...

  5. Colligation or, The Logical Inference of Interconnection

    DEFF Research Database (Denmark)

    Franksen, Ole Immanuel; Falster, Peter

    2000-01-01

    laws or assumptions. Yet interconnection as an abstract concept seems to be without scientific underpinning in oure logic. Adopting a historical viewpoint, our aim is to show that the reasoning of interconnection may be identified with a neglected kind of logical inference, called "colligation...

  6. Modeling interconnect corners under double patterning misalignment

    Science.gov (United States)

    Hyun, Daijoon; Shin, Youngsoo

    2016-03-01

    Publisher's Note: This paper, originally published on March 16th, was replaced with a corrected/revised version on March 28th. If you downloaded the original PDF but are unable to access the revision, please contact SPIE Digital Library Customer Service for assistance. Interconnect corners should accurately reflect the effect of misalingment in LELE double patterning process. Misalignment is usually considered separately from interconnect structure variations; this incurs too much pessimism and fails to reflect a large increase in total capacitance for asymmetric interconnect structure. We model interconnect corners by taking account of misalignment in conjunction with interconnect structure variations; we also characterize misalignment effect more accurately by handling metal pitch at both sides of a target metal independently. Identifying metal space at both sides of a target metal.

  7. Melting phase relations in the systems Mg2SiO4-H2O and MgSiO3-H2O and the formation of hydrous melts in the upper mantle

    Science.gov (United States)

    Novella, Davide; Dolejš, David; Myhill, Robert; Pamato, Martha G.; Manthilake, Geeth; Frost, Daniel J.

    2017-05-01

    High-pressure and high-temperature melting experiments were conducted in the systems Mg2SiO4-H2O and MgSiO3-H2O at 6 and 13 GPa and between 1150 and 1900 °C in order to investigate the effect of H2O on melting relations of forsterite and enstatite. The liquidus curves in both binary systems were constrained and the experimental results were interpreted using a thermodynamic model based on the homogeneous melt speciation equilibrium, H2O + O2- = 2OH-, where water in the melt is present as both molecular H2O and OH- groups bonded to silicate polyhedra. The liquidus depression as a function of melt H2O concentration is predicted using a cryoscopic equation with the experimental data being reproduced by adjusting the water speciation equilibrium constant. Application of this model reveals that in hydrous MgSiO3 melts at 6 and 13 GPa and in hydrous Mg2SiO4 melts at 6 GPa, water mainly dissociates into OH- groups in the melt structure. A temperature dependent equilibrium constant is necessary to reproduce the data, however, implying that molecular H2O becomes more important in the melt with decreasing temperature. The data for hydrous forsterite melting at 13 GPa are inconclusive due to uncertainties in the anhydrous melting temperature at these conditions. When applied to results on natural peridotite melt systems at similar conditions, the same model infers the presence mainly of molecular H2O, implying a significant difference in physicochemical behaviour between simple and complex hydrous melt systems. As pressures increase along a typical adiabat towards the base of the upper mantle, both simple and complex melting results imply that a hydrous melt fraction would decrease, given a fixed mantle H2O content. Consequently, the effect of pressure on the depression of melting due to H2O could not cause an increase in the proportion, and hence seismic visibility, of melts towards the base of the upper mantle.

  8. Optical Interconnects for Future Data Center Networks

    CERN Document Server

    Bergman, Keren; Tomkos, Ioannis

    2013-01-01

    Optical Interconnects for Future Data Center Networks covers optical networks and how they can provide high bandwidth, energy efficient interconnects with increased communication bandwidth. This volume, with contributions from leading researchers in the field, presents an integrated view of the expected future requirements of data centers and serves as a reference for some of the most advanced and promising solutions proposed by researchers from leading universities, research labs, and companies. The work also includes several novel architectures, each demonstrating different technologies such as optical circuits, optical switching, MIMO optical OFDM, and others. Additionally, Optical Interconnects for Future Data Center Networks provides invaluable insights into the benefits and advantages of optical interconnects and how they can be a promising alternative for future data center networks.

  9. Recent Development of SOFC Metallic Interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Wu JW, Liu XB

    2010-04-01

    Interest in solid oxide fuel cells (SOFC) stems from their higher e±ciencies and lower levels of emitted pollu- tants, compared to traditional power production methods. Interconnects are a critical part in SOFC stacks, which connect cells in series electrically, and also separate air or oxygen at the cathode side from fuel at the anode side. Therefore, the requirements of interconnects are the most demanding, i:e:, to maintain high elec- trical conductivity, good stability in both reducing and oxidizing atmospheres, and close coe±cient of thermal expansion (CTE) match and good compatibility with other SOFC ceramic components. The paper reviewed the interconnect materials, and coatings for metallic interconnect materials.

  10. The Interconnections of the LHC Cryomagnets

    CERN Document Server

    Jacquemod, A; Skoczen, Blazej; Tock, J P

    2001-01-01

    The main components of the LHC, the next world-class facility in high-energy physics, are the twin-aperture high-field superconducting cryomagnets to be installed in the existing 26.7-km long tunnel. After installation and alignment, the cryomagnets have to be interconnected. The interconnections must ensure the continuity of several functions: vacuum enclosures, beam pipe image currents (RF contacts), cryogenic circuits, electrical power supply, and thermal insulation. In the machine, about 1700 interconnections between cryomagnets are necessary. The interconnections constitute a unique system that is nearly entirely assembled in the tunnel. For each of them, various operations must be done: TIG welding of cryogenic channels (~ 50 000 welds), induction soldering of main superconducting cables (~ 10 000 joints), ultrasonic welding of auxiliary superconducting cables (~ 20 000 welds), mechanical assembly of various elements, and installation of the multi-layer insulation (~ 200 000 m2). Defective junctions cou...

  11. Advanced Interconnect and Device-Field Modeling

    National Research Council Canada - National Science Library

    Essaaidi, Mohamed

    2007-01-01

    ... be avoided. Those tasks concerned the development of OOP codes using C++ based on the Method of Moments for microwave interconnections analysis considering different geometrical configurations (i.e...

  12. Variation Tolerant On-Chip Interconnects

    CERN Document Server

    Nigussie, Ethiopia Enideg

    2012-01-01

    This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects.  Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next generation, high-performance electronics systems. Provides comprehensive, circuit-level explanation of high-performance, energy-efficient, variation-tolerant on-chip interconnect; Describes design techniques to mitigate problems caused by variation; Includes techniques for design and implementation of self-timed on-chip interconnect, delay variation insensitive communication protocols, high speed signaling techniques and circuits, bit-width independent completion detection and process, voltage and temperature variation tolerance.                          

  13. Structure and color-tunable luminescence properties of Ce3+ and Tb3+-activated Mg2La8(SiO4)6O2 phosphors based on energy transfer behavior

    Science.gov (United States)

    Zhang, Yuanyuan; Liu, Haikun; Mei, Lefu; Molokeev, Maxim S.; Wang, Yongjie; Huang, Zhaohui

    2017-11-01

    A series of novel luminescent emission-tunable phosphors Mg2La8(SiO4)6O2:Ce3+,Tb3+ (MLS:Ce3+,Tb3+) have been prepared by a solid-state reaction. The phase formation was firstly confirmed through X-ray diffraction technique and refined by the Rietveld method. The MLS:Ce3+,Tb3+ phosphors, which crystallized in apatite-type hexagonal phase, exhibited a broad excitation band ranging from 200 to 400 nm and several emission bands centered at 426 nm and 551 nm. Energy transfer from Ce3+ to Tb3+ ions via a dipole-dipole mechanism occurred in the as-synthesized phosphors upon ultraviolet (UV) excitation. The energy transfer efficiency increases with increasing doping content of Tb3+ ions, which was confirmed by the luminescence spectra and fluorescence decay curves of corresponding ions simultaneously. The energy transfer critical distance was calculated and evaluated by both the concentration quenching and spectral overlap methods. The chromaticity of emission-tunable phosphors was also characterized by the Commission International de l'éclairage (CIE) chromaticity indexes, and the color tone can be tuned from blue (0.179, 0.122) to green (0.267, 0.408) by controlling the ratio of Ce3+/Tb3+.

  14. Interconnect mechanisms in microelectronic packaging

    Science.gov (United States)

    Roma, Maria Penafrancia C.

    alloy showed differences in adhesion strength and IMC formation. Bond strength by wire pull testing showed the 95Ag alloy with higher values while shear bond testing showed the 88Ag higher bond strength. Use of Cu pillars in flip chips and eutectic bonding in wafer level chip scale packages are direct consequences of diminishing interconnect dimension as a result of the drive for miniaturization. The combination of Cu-Sn interdiffusion, Kirkendall mechanism and heterogeneous vacancy precipitation are the main causes of IMC and void formation in Cu pillar - Sn solder - Cu lead frame sandwich structure. However, adding a Ni barrier agent showed less porous IMC layer as well as void formation as a result of the modified Cu and Sn movement well as the void formation. Direct die to die bonding using Al-Ge eutectic bonds is necessary when 3D integration is needed to reduce the footprint of a package. Hermeticity and adhesion strength are a function of the Al/Ge thickness ratio, bonding pressure, temperature and time. Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) allowed imaging of interfacial microstructures, porosity, grain morphology while Scanning Transmission Electron microscope (STEM) provided diffusion profile and confirmed interdiffusion. Ion polishing technique provided information on porosity and when imaged using backscattered mode, grain structure confirmed mechanical deformation of the bonds. Measurements of the interfacial bond strength are made by wire pull tests and ball shear tests based on existing industry standard tests. However, for the Al-Ge eutectic bonds, no standard strength is available so a test is developed using the stud pull test method using the Dage 4000 Plus to yield consistent results. Adhesion strengths of 30-40 MPa are found for eutectic bonded packages however, as low as 20MPa was measured in low temperature bonded areas.

  15. Ssip-a processor interconnection simulator

    Energy Technology Data Exchange (ETDEWEB)

    Navaux, P.; Weber, R.; Prezzi, J.; Tazza, M.

    1982-01-01

    Recent growing interest in multiple processor architectures has given rise to the study of procesor-memory interconnections for the determination of better architectures. This paper concerns the development of the SSIP-sistema simulador de interconexao de processadores (processor interconnection simulating system) which allows the evaluation of different interconnection structures comparing its performance in order to provide parameters which would help the designer to define an architcture. A wide spectrum of systems may be evaluated, and their behaviour observed due to the features incorporated into the simulator program. The system modelling and the simulator program implementation are described. Some results that can be obtained are shown, along with the discussion of their usefulness. 12 references.

  16. Packaging and interconnection for superconductive circuitry

    International Nuclear Information System (INIS)

    Anacker, W.

    1976-01-01

    A three dimensional microelectronic module packaged for reduced signal propagation delay times including a plurality of circuit carrying means, which may comprise unbacked chips, with integrated superconductive circuitry thereon is described. The circuit carrying means are supported on their edges and have contact lands in the vicinity of, or at, the edges to provide for interconnecting circuitry. The circuit carrying means are supported by supporting means which include slots to provide a path for interconnection wiring to contact the lands of the circuit carrying means. Further interconnecting wiring may take the form of integrated circuit wiring on the reverse side of the supporting means. The low heat dissipation of the superconductive circuitry allows the circuit carrying means to be spaced approximately no less than 30 mils apart. The three dimensional arrangement provides lower random propagation delays than would a planar array of circuits

  17. Roymillerite, Pb24Mg9(Si9AlO28)(SiO4)(BO3)(CO3)10(OH)14O4, a new mineral: mineralogical characterization and crystal chemistry

    Science.gov (United States)

    Chukanov, Nikita V.; Jonsson, Erik; Aksenov, Sergey M.; Britvin, Sergey N.; Rastsvetaeva, Ramiza K.; Belakovskiy, Dmitriy I.; Van, Konstantin V.

    2017-11-01

    The new mineral roymillerite Pb24Mg9(Si9AlO28)(SiO4)(BO3)(CO3)10(OH)14O4, related to britvinite and molybdophyllite, was discovered in a Pb-rich assemblage from the Kombat Mine, Grootfontein district, Otjozondjupa region, Namibia, which includes also jacobsite, cerussite, hausmannite, sahlinite, rhodochrosite, barite, grootfonteinite, Mn-Fe oxides, and melanotekite. Roymillerite forms platy single-crystal grains up to 1.5 mm across and up to 0.3 mm thick. The new mineral is transparent, colorless to light pink, with a strong vitreous lustre. Cleavage is perfect on (001). Density calculated using the empirical formula is equal to 5.973 g/cm3. Roymillerite is optically biaxial, negative, α = 1.86(1), β ≈ γ = 1.94(1), 2 V (meas.) = 5(5)°. The IR spectrum shows the presence of britvinite-type tetrahedral sheets, {CO}3^{2 - }, {BO}3^{3 - }, and OH- groups. The chemical composition is (wt%; electron microprobe, H2O and CO2 determined by gas chromatography, the content of B2O3 derived from structural data): MgO 4.93, MnO 1.24, FeO 0.95, PbO 75.38, B2O3 0.50, Al2O3 0.74, CO2 5.83, SiO2 7.90, H2O 1.8, total 99.27. The empirical formula based on 83 O atoms pfu (i.e. Z = 1) is Pb24.12Mg8.74Mn1.25Fe0.94B1.03Al1.04C9.46Si9.39H14.27O83. The crystal structure was determined using single-crystal X-ray diffraction data. The new mineral is triclinic, space group P \\bar{1}, with a = 9.315(1), b = 9.316(1), c = 26.463(4) Å, α = 83.295(3)°, β = 83.308(3)°, γ = 60.023(2)°, V = 1971.2(6) Å3. The crystal structure of roymillerite is based built by alternating pyrophyllite-type TOT-modules Mg9(OH)8[(Si,Al)10O28] and I-blocks Pb24(OH)6O4(CO3)10(BO3,SiO4). The strongest lines of the powder X-ray diffraction pattern [ d, Å (I, %) ( hkl)] are: 25.9 (100) (001), 13.1 (11) (002), 3.480 (12) (017, 107, -115, 1-15), 3.378 (14) (126, 216), 3.282 (16) (-2-15, -1-25), 3.185 (12) (-116, 1-16), 2.684 (16) (031, 301, 030, 300, 332, -109, 0-19, 1-18), 2.382 (11) (0.0.-11). Roymillerite is named to honor Dr. Roy McG. Miller for his important contributions to the knowledge of the geology of Namibia.

  18. Planarization of metal films for multilevel interconnects

    Science.gov (United States)

    Tuckerman, D.B.

    1985-06-24

    In the fabrication of multilevel integrated circuits, each metal layer is planarized by heating to momentarily melt the layer. The layer is melted by sweeping lase pulses of suitable width, typically about 1 microsecond duration, over the layer in small increments. The planarization of each metal layer eliminates irregular and discontinuous conditions between successive layers. The planarization method is particularly applicable to circuits having ground or power planes and allows for multilevel interconnects. Dielectric layers can also be planarized to produce a fully planar multilevel interconnect structure. The method is useful for the fabrication of VLSI circuits, particularly for wafer-scale integration.

  19. Characterization of a Cobalt-Tungsten Interconnect

    DEFF Research Database (Denmark)

    Harthøj, Anders; Holt, Tobias; Caspersen, Michael

    2012-01-01

    A ferritic steel interconnect for a solid oxide fuel cell must be coated in order to prevent chromium evaporation from the steel substrate. The Technical University of Denmark and Topsoe Fuel Cell have developed an interconnect coating based on a cobalt-tungsten alloy. The purpose of the coating...... for 300 h at 800 °C. The coating was characterized with Glow Discharge Optical Spectroscopy (GDOES), Scanning Electron Microscopy (SEM) and X-Ray Diffraction (XRD). The oxidation properties were evaluated by measuring weight change of coated samples of Crofer 22 H and Crofer 22 APU as a function...

  20. Dual-band LTCC antenna based on 0.95Zn2SiO4-0.05CaTiO3 ceramics for GPS/UMTS applications

    Science.gov (United States)

    Dou, Gang; Li, Yu-Xia; Guo, Mei

    2015-10-01

    In this paper, we present a compact low-temperature co-fired ceramic (LTCC) dual-band antenna by using the electromagnetic coupling effect concept for global positioning system (GPS) and universal mobile telecommunication system (UMTS) applications. The overall dimension of the antenna is 8.6 mm × 13.0 mm × 1.1 mm. It consists of double meander lines and a via hole line. The top meander line operates at the upper band, and the bottom radiating patch is designed for the lower band. The via-hole line is employed to connect the double meander lines. Because of the effect of the coupled line, total dimension of the proposed antenna is greatly reduced. With the 2.5: voltage standing wave ratio (VSWR) impedance bandwidth definition, the lower and upper bands have the bandwidths of 110 MHz and 150 MHz, respectively. The proposed antenna is successfully designed, simulated, and analyzed by a high frequency structure simulator (HFSS). And the antenna is manufactured by using the 0.95Zn2SiO4-0.05CaTiO3 ceramics (εr = 7.1, tanδ = 0.00038) that is prepared by ourselves. The results show that the antenna is compact, efficient, and of near omnidirectional radiation pattern. Project supported by the Specialized Research Fund for the Doctoral Program of Higher Education of China (Grant No. 20133718120009), the Natural Science Foundation of Shandong Provence, China (Grant Nos. ZR2013FQ002 and ZR2014FQ006), the China Postdoctoral Science Foundation (Grant No. 2014M551935), the Qingdao Municipality Postdoctoral Science Foundation, China, and the Scientific Research Foundation of Shandong University of Science and Technology for Recruited Talents, China (Grant Nos. 2013RCJJ042 and 2014RCJJ052).

  1. Discovery of Ahrensite γ-Fe2SiO4 and Tissintite (Ca,Na,[])AlSi2O6, Two New Shock-induced Minerals from the Tissint Martian Meteorite: a Nanomineralogy Investigation

    Science.gov (United States)

    Ma, C.; Tschauner, O. D.; Liu, Y.; Sinogeikin, S. V.; Zhuravlev, K. K.; Prakapenka, V.; Dera, P. K.; Taylor, L. A.

    2013-12-01

    The recent Martian meteorite fall, Tissint, is a fresh olivine-phyric shergottite, with strong shock features. During our nano-mineralogy investigation of the Tissint meteorite with a combined analytical scanning electron microscope and synchrotron diffraction approach, two new shock-induced minerals have been discovered; these provide new insights into understanding shock conditions and impact processes on Mars. Ahrensite (IMA 2013-028), the Fe-analogue (γ-Fe2SiO4) of ringwoodite, is a new high-pressure mineral identified in Tissint. Both ahrensite and ringwoodite occur in Tissint as fine-grained polycrystalline aggregates in the rims of olivines around some shock-melt pockets. The morphology and texture of these silicate-spinels suggest formation by a solid-state transformation from Fe-rich olivine. Associated with the ahrensite and ringwoodite, inside melt pockets, often resides a thin layer of vitrified silicate-perovskite and magnesio-wüstite or wüstite. Such transitions represent a unique pressure and temperature gradient. Tissintite (IMA 2013-027), (Ca,Na,[])AlSi2O6 with the C2/c clinopyroxene structure, is a new jadeite-like mineral in Tissint. It appears as fine-grained aggregates within plagioclase glass, inside many shock-melt pockets. Both ahrensite and tissintite are high-pressure minerals formed by shock during the impact event(s) on Mars that excavated and ejected the rock off Mars. We will discuss the path of structure analysis for both new-mineral cases. Such novel methodology be utilized for many cases of mineralogical phase identification or structure analysis; this demonstrates how nano-mineralogy can be addressed and how it may play a unique role in meteorite and Mars rock research, in general.

  2. Experimental demonstration of titanium nitride plasmonic interconnects

    DEFF Research Database (Denmark)

    Kinsey, N.; Ferrera, M.; Naik, G. V.

    2014-01-01

    An insulator-metal-insulator plasmonic interconnect using TiN, a CMOS-compatible material, is proposed and investigated experimentally at the telecommunication wavelength of 1.55 mu m. The TiN waveguide was shown to obtain propagation losses less than 0.8 dB/mm with a mode size of 9.8 mu m...

  3. The Achievable Dynamics via Control by Interconnection

    NARCIS (Netherlands)

    Vinjamoor, Harsh; Schaft, Arjan J. van der

    We consider the problem of finding a controller such that, when interconnected to the plant, we obtain a system that is equivalent to a desired system. Here, "equivalence" is formalized as "bisimilarity." We give necessary and sufficient conditions for the existence of such a controller. The systems

  4. Absorbed radiation dose on LHC interconnects

    CERN Document Server

    Versaci, R; Vlachoudis, V; CERN. Geneva. ATS Department

    2011-01-01

    Here we present the results of our FLUKA simulations devoted to the evaluation of the peak dose absorbed by the busbar insulator in the LHC Interaction Region 7 interconnects. The peak dose absorbed by the cold magnet coils are also presented.

  5. Patterned electrodeposition of interconnects using microcontact printing

    NARCIS (Netherlands)

    Hovestad, A.; Rendering, H.; Maijenburg, A.W.

    2012-01-01

    Microcontact printing combined with electroless deposition is a potential low cost technique to make electrical interconnects for opto-electronic devices. Microcontact printed inhibitors locally prevent electroless deposition resulting in a pre-defined pattern of metal tracks. The inhibition of

  6. Optical interconnections to focal plane arrays

    Energy Technology Data Exchange (ETDEWEB)

    Rienstra, J.L.; Hinckley, M.K.

    2000-11-01

    The authors have successfully demonstrated an optical data interconnection from the output of a focal plane array to the downstream data acquisition electronics. The demonstrated approach included a continuous wave laser beam directed at a multiple quantum well reflectance modulator connected to the focal plane array analog output. The output waveform from the optical interconnect was observed on an oscilloscope to be a replica of the input signal. They fed the output of the optical data link to the same data acquisition system used to characterize focal plane array performance. Measurements of the signal to noise ratio at the input and output of the optical interconnection showed that the signal to noise ratio was reduced by a factor of 10 or more. Analysis of the noise and link gain showed that the primary contributors to the additional noise were laser intensity noise and photodetector receiver noise. Subsequent efforts should be able to reduce these noise sources considerably and should result in substantially improved signal to noise performance. They also observed significant photocurrent generation in the reflectance modulator that imposes a current load on the focal plane array output amplifier. This current loading is an issue with the demonstrated approach because it tends to negate the power saving feature of the reflectance modulator interconnection concept.

  7. An architectural model for network interconnection

    NARCIS (Netherlands)

    van Sinderen, Marten J.; Vissers, C.A.; Kalin, T.

    1983-01-01

    This paper presents a technique of successive decomposition of a common users' activity to illustrate the problems of network interconnection. The criteria derived from this approach offer a structuring principle which is used to develop an architectural model that embeds heterogeneous subnetworks

  8. A transmission electron microscopy study of radiation damages to β-dicalcium (Ca2SiO4) and M3-tricalcium (Ca3SiO5) orthosilicates

    Science.gov (United States)

    de Noirfontaine, Marie-Noëlle; Dunstetter, Frédéric; Courtial, Mireille; Signes-Frehel, Marcel; Wang, Guillaume; Gorse-Pomonti, Dominique

    2016-01-01

    In this paper, we present results of a first study of electron radiation damages to β-dicalcium silicate (Ca2SiO4:C2S) and M3-tricalcium silicate (Ca3SiO5:C3S) in a Transmission Electron Microscope. Electron irradiation is used here as a means to bring to light a difference of reactivity under the electron beam between these two complex ceramic oxides, keeping in mind that C3S reacts faster with water than C2S and that this property remains unexplained, owing to the complex structural characteristics of these ceramics which have not yet been fully elucidated. The following results were obtained by coupling TEM imaging and EDS analysis: i) Rapid decomposition of both silicate particles into CaO nano-crystals separated by (presumably SiO2-rich) amorphous areas at low flux for both silicates; ii) once reached a threshold electron flux, formation of an amorphous crater in both silicates, fully calcium-depleted in C3S but never in C2S; iii) significant post-mortem structural evolution of the craters that at least partially recrystallize in C2S, to be compared to the quasi frozen damaged area in C3S; iv) hole drilling at high flux but only in C3S once reached a threshold flux, ϕth ˜ 7.9 × 1021 e- cm-2 s-1, of the same order of magnitude than previously estimated in a number of ceramic materials, whereas C2S still amorphizes under the electron beam for a flux as high as 2.2 × 1022 e- cm-2 s-1. The radiation damages and their post-mortem evolution differ largely between C2S and C3S. We attempted to relate the obtained results, and especially the evolution of the Ca content in the damaged areas under the electron beam to the available structural characteristics of these two orthosilicates.

  9. National Offshore Wind Energy Grid Interconnection Study Executive Summary

    Energy Technology Data Exchange (ETDEWEB)

    Daniel, John P. [ABB, Inc., Cary, NC (United States); Liu, Shu [ABB, Inc., Cary, NC (United States); Ibanez, Eduardo [National Renewable Energy Lab. (NREL), Golden, CO (United States); Pennock, Ken [AWS Truepower, Albany, NY (United States); Reed, Gregory [Univ. of Pittsburgh, PA (United States); Hanes, Spencer [Duke Energy, Charlotte, NC (United States)

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States.

  10. Development and operation of interconnections in a restructuring context

    International Nuclear Information System (INIS)

    2003-01-01

    In many countries the electrical network is not fully interconnected and the best technical solution to achieve interconnection has to be found. At the same time the electricity industry is being restructured and interconnecting independent energy markets presents technical challenges. It is therefore timely to consider interconnection development and operation options: examine the benefits of interconnecting electrical networks and the development strategies, review the interconnection design options and the technologies available, identify the operational issues, the security problems of large interconnected systems, the protection issues, consider the impact of the restructuring of the electrical supply industry, assess the political, environmental and social implications of interconnections. reorganized in slovenia from 5-7 april 2004. (author)

  11. National Offshore Wind Energy Grid Interconnection Study Full Report

    Energy Technology Data Exchange (ETDEWEB)

    Daniel, John P. [ABB, Inc., Cary, NC (United States); Liu, Shu [ABB, Inc., Cary, NC (United States); Ibanez, Eduardo [National Renewable Energy Lab. (NREL), Golden, CO (United States); Pennock, Ken [AWS Truepower, Albany, NY (United States); Reed, Gregory [Univ. of Pittsburgh, PA (United States); Hanes, Spencer [Duke Energy, Charlotte, NC (United States)

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States.

  12. Si micro photonics for optical interconnection

    International Nuclear Information System (INIS)

    Wada, K.; Ahn, D.H.; Lim, D.R.; Michel, J.; Kimerling, L.C.

    2006-01-01

    This paper reviews current status of silicon microphotonics and the recent prototype of on-chip optical interconnection. Si microphotonics pursues complementary metal oxide semiconductor (CMOS)-compatibility of photonic devices to reduce the materials diversity eventually to integrate on Si chips. Fractal optical H-trees have been implemented on a chip and found to be a technology breakthrough beyond metal interconnection. It has shown that large RC time constants associated with metal can be eliminated at least long distant data communication on a chip, and eventually improve yield and power issues. This has become the world's first electronic and photonic integrated circuits (EPICs) and the possibility of at least 10 GHz clocking for personal computers has been demonstrated

  13. Development of Interconnect Technologies for Particle Detectors

    Energy Technology Data Exchange (ETDEWEB)

    Tripathi, Mani [Univ. of California, Davis, CA (United States)

    2015-01-29

    This final report covers the three years of this grant, for the funding period 9/1/2010 - 8/31/2013. The project consisted of generic detector R&D work at UC Davis, with an emphasis on developing interconnect technologies for applications in HEP. Much of the work is done at our Facility for Interconnect Technologies (FIT) at UC Davis. FIT was established using ARRA funds, with further studies supported by this grant. Besides generic R&D work at UC Davis, FIT is engaged in providing bump bonding help to several DOE supported detector R&D efforts. Some of the developmental work was also supported by funding from other sources: continuing CMS project funds and the Linear Collider R&D funds. The latter program is now terminated. The three year program saw a good deal of progress on several fronts, which are reported here.

  14. Architecture for on-die interconnect

    Science.gov (United States)

    Khare, Surhud; More, Ankit; Somasekhar, Dinesh; Dunning, David S.

    2016-03-15

    In an embodiment, an apparatus includes: a plurality of islands configured on a semiconductor die, each of the plurality of islands having a plurality of cores; and a plurality of network switches configured on the semiconductor die and each associated with one of the plurality of islands, where each network switch includes a plurality of output ports, a first set of the output ports are each to couple to the associated network switch of an island via a point-to-point interconnect and a second set of the output ports are each to couple to the associated network switches of a plurality of islands via a point-to-multipoint interconnect. Other embodiments are described and claimed.

  15. Interconnection of bundled solid oxide fuel cells

    Science.gov (United States)

    Brown, Michael; Bessette, II, Norman F; Litka, Anthony F; Schmidt, Douglas S

    2014-01-14

    A system and method for electrically interconnecting a plurality of fuel cells to provide dense packing of the fuel cells. Each one of the plurality of fuel cells has a plurality of discrete electrical connection points along an outer surface. Electrical connections are made directly between the discrete electrical connection points of adjacent fuel cells so that the fuel cells can be packed more densely. Fuel cells have at least one outer electrode and at least one discrete interconnection to an inner electrode, wherein the outer electrode is one of a cathode and and anode and wherein the inner electrode is the other of the cathode and the anode. In tubular solid oxide fuel cells the discrete electrical connection points are spaced along the length of the fuel cell.

  16. A Thermal Model for Carbon Nanotube Interconnects

    Directory of Open Access Journals (Sweden)

    Clay Mayberry

    2013-04-01

    Full Text Available In this work, we have studied Joule heating in carbon nanotube based very large scale integration (VLSI interconnects and incorporated Joule heating influenced scattering in our previously developed current transport model. The theoretical model explains breakdown in carbon nanotube resistance which limits the current density. We have also studied scattering parameters of carbon nanotube (CNT interconnects and compared with the earlier work. For 1 µm length single-wall carbon nanotube, 3 dB frequency in S12 parameter reduces to ~120 GHz from 1 THz considering Joule heating. It has been found that bias voltage has little effect on scattering parameters, while length has very strong effect on scattering parameters.

  17. Uncertainty in an Interconnected Financial System, Contagion

    OpenAIRE

    Mei Li; Frank Milne; Junfeng Qiu

    2013-01-01

    This paper studies contagion and market freezes caused by uncertainty in financial network structures and provides theoretical guidance for central banks. We establish a formal model to demonstrate that, in a financial system where financial institutions are interconnected, a negative shock to an individual financial institution could spread to other institutions, causing market freezes because of creditors' uncertainty about the financial network structure. Central bank policies to alleviate...

  18. Hybrid Nanomaterials for Flexible Electronics Interconnects (Postprint)

    Science.gov (United States)

    2017-04-19

    2017-1847; Clearance Date: 19 Apr 2017. This document contains color. Journal article published in Micro and Nanomechanics, Volume 5, Conference...to high strain-rate deformation (high impact environment), interconnects materials are to exhibit high strain to failure characteristics while...In emerging flexible electronics survivable to high strain-rate deformation (high impact environment), intercon- nects materials are to exhibit high

  19. Microtexture and strain in electroplated copper interconnects

    OpenAIRE

    Spolenak, Ralph; Barr, D.L.; Gross, M.E.; Evans-Lutterodt, K.; Brown, W.L.; Tamura, N.; MacDowell, A.A.; Celestre, R.S.; Padmore, H.A.; Valek, B.C.; Bravman, J.C.; Flinn, P.; Marieb, T.; Keller, R.R.; Batterman, B.W.

    2001-01-01

    The microstructure of narrow metal conductors in the electrical interconnections on IC chips has often been identified as of major importance in the reliability of these devices. The stresses and stress gradients that develop in the conductors as a result of thermal expansion differences in the materials and of electromigration at high current densities are believed to be strongly dependent on the details of the grain structure. The present work discusses new techniques based on microbe...

  20. Microtexture of Strain in electroplated copper interconnects

    OpenAIRE

    Spolenak, R.; Barr, D.L.; Gross, M.E.; Evans-Lutterodt, K.; Brown, W.L.; Tamura, N.; MacDowell, A.A.; Celestre, R.S.; Padmore, H.A.; Valek, B.C.; Bravman, J.C.; Flinn, P.; Marieb, T.; Keller, R.R.; Batterman, B.W.

    2001-01-01

    The microstructure of narrow metal conductors in the electrical interconnections on IC chips has often been identified as of major importance in the reliability of these devices. The stresses and stress gradients that develop in the conductors as a result of thermal expansion differences in the materials and of electromigration at high current densities are believed to be strongly dependent on the details of the grain structure. The present work discusses new techniques based on microbe...

  1. Viewing Integrated-Circuit Interconnections By SEM

    Science.gov (United States)

    Lawton, Russel A.; Gauldin, Robert E.; Ruiz, Ronald P.

    1990-01-01

    Back-scattering of energetic electrons reveals hidden metal layers. Experiment shows that with suitable operating adjustments, scanning electron microscopy (SEM) used to look for defects in aluminum interconnections in integrated circuits. Enables monitoring, in situ, of changes in defects caused by changes in temperature. Gives truer picture of defects, as etching can change stress field of metal-and-passivation pattern, causing changes in defects.

  2. Investigation of electrical and thermal properties of carbon nanotube interconnects

    OpenAIRE

    Todri-Sanial , Aida

    2016-01-01

    International audience; Carbon nanotubes (CNTs) present themselves as a viable material for on-and off-chip interconnect material due to their unique electrical, thermal and mechanical properties. The electrothermal properties of CNTs, including high Young's modulus, resiliency and low thermal expansion coefficient offer great advantage for reliable and strong interconnects, and even more so for local and global on-chip interconnects. With aggressive scaling, on-chip interconnects contribute ...

  3. Synthesis, structure, and electronic structure calculation of a new centrosymmetric borate Pb{sub 2}O[BO{sub 2}(OH)] based on anion-centered OPb{sub 4} tetrahedra

    Energy Technology Data Exchange (ETDEWEB)

    Sun, Feng [College of Chemistry and Chemical Engineering, Xinjiang Normal University, Urumqi 830054 (China); Wang, Li, E-mail: wangliresearch@163.com [College of Chemistry and Chemical Engineering, Xinjiang Normal University, Urumqi 830054 (China); Stoumpos, Constantinos C. [Department of Chemistry, Northwestern University, Evanston, IL 60208 (United States)

    2016-08-15

    The synthesis, structure, and characterization of a new centrosymmetric borate Pb{sub 2}O[BO{sub 2}(OH)] based on anion-centered OPb{sub 4} tetrahedra are reported. Pb{sub 2}O[BO{sub 2}(OH)] crystallizes in monoclinic space group C2/m with a=12.725(7) Å, b=5.698(3) Å, c=7.344(4) Å, β=116.277(6)°. The electronic band structure and density of states of Pb{sub 2}O[BO{sub 2}(OH)] have been calculated via the density functional theory (DFT). Electron density difference calculation indicates that lone-pair electrons of Pb{sup 2+} cation should be stereoactive. - Graphical abstract: An indirect gap compound of Pb{sub 2}O[BO{sub 2}(OH)] with 2D inorganic layers motif based on OPb{sub 4} tetrahedra has been synthesized and full characterized by crystallographic, IR, TG, UV–vis-NIR Diffuse Reflectance, and theoretical calculations. Display Omitted - Highlights: • A centrosymmetric borate Pb{sub 2}O[BO{sub 2}(OH)] was synthesized and characterized. • The crystalstructure, electronic band and density states was analyzed. • The lone-pair electrons of Pb{sup 2+} were proved to be stereoactive.

  4. High-density hybrid interconnect methodologies

    International Nuclear Information System (INIS)

    John, J.; Zimmermann, L.; Moor, P.De; Hoof, C.Van

    2003-01-01

    Full text: The presentation gives an overview of the state-of-the-art of hybrid integration and in particular the IMEC technological approaches that will be able to address future hybrid detector needs. The dense hybrid flip-chip integration of an array of detectors and its dedicated readout electronics can be achieved with a variety of solderbump techniques such as pure Indium or Indium alloys, Ph-In, Ni/PbSn, but also conducting polymers... Particularly for cooled applications or ultra-high density applications, Indium solderbump technology (electroplated or evaporated) is the method of choice. The state-of-the-art of solderbump technologies that are to a high degree independent of the underlying detector material will be presented and examples of interconnect densities between 5x1E4cm-2 and 1x1E6 cm-2 will be demonstrated. For several classes of detectors, flip-chip integration is not allowed since the detectors have to be illuminated from the top. This applies to image sensors for EUV applications such as GaN/AlGaN based detectors and to MEMS-based sensors. In such cases, the only viable interconnection method has to be through the (thinned) detector wafer followed by a solderbump-based integration. The approaches for dense and ultra-dense through-the-wafer interconnect 'vias' will be presented and wafer thinning approaches will be shown

  5. The first LHC sector is fully interconnected

    CERN Multimedia

    2006-01-01

    Sector 7-8 is the first sector of the LHC to become fully operational. All the magnets, cryogenic line, vacuum chambers and services are interconnected. The cool down of this sector can soon commence. LHC project leader Lyn Evans, the teams from CERN's AT/MCS, AT/VAC and AT/MEL groups, and the members of the IEG consortium celebrate the completion of the first LHC sector. The 10th of November was a red letter day for the LHC accelerator teams, marking the completion of the first sector of the machine. The magnets of sector 7-8, together with the cryogenic line, the vacuum chambers and the distribution feedboxes (DFBs) are now all completely interconnected. Sector 7-8 has thus been closed and is the first LHC sector to become operational. The interconnection work required several thousand electrical, cryogenic and insulating connections to be made on the 210 interfaces between the magnets in the arc, the 30 interfaces between the special magnets and the interfaces with the cryogenic line. 'This represent...

  6. Wireless Interconnects for Intra-chip & Inter-chip Transmission

    Science.gov (United States)

    Narde, Rounak Singh

    With the emergence of Internet of Things and information revolution, the demand of high performance computing systems is increasing. The copper interconnects inside the computing chips have evolved into a sophisticated network of interconnects known as Network on Chip (NoC) comprising of routers, switches, repeaters, just like computer networks. When network on chip is implemented on a large scale like in Multicore Multichip (MCMC) systems for High Performance Computing (HPC) systems, length of interconnects increases and so are the problems like power dissipation, interconnect delays, clock synchronization and electrical noise. In this thesis, wireless interconnects are chosen as the substitute for wired copper interconnects. Wireless interconnects offer easy integration with CMOS fabrication and chip packaging. Using wireless interconnects working at unlicensed mm-wave band (57-64GHz), high data rate of Gbps can be achieved. This thesis presents study of transmission between zigzag antennas as wireless interconnects for Multichip multicores (MCMC) systems and 3D IC. For MCMC systems, a four-chips 16-cores model is analyzed with only four wireless interconnects in three configurations with different antenna orientations and locations. Return loss and transmission coefficients are simulated in ANSYS HFSS. Moreover, wireless interconnects are designed, fabricated and tested on a 6'' silicon wafer with resistivity of 55O-cm using a basic standard CMOS process. Wireless interconnect are designed to work at 30GHz using ANSYS HFSS. The fabricated antennas are resonating around 20GHz with a return loss of less than -10dB. The transmission coefficients between antenna pair within a 20mm x 20mm silicon die is found to be varying between -45dB to -55dB. Furthermore, wireless interconnect approach is extended for 3D IC. Wireless interconnects are implemented as zigzag antenna. This thesis extends the work of analyzing the wireless interconnects in 3D IC with different

  7. Economic and environmental benefits of interconnected systems. The Spanish example

    International Nuclear Information System (INIS)

    Chicharro, A.S.; Dios Alija, R. de

    1996-01-01

    The interconnected systems provide large technical and economic benefits which, evaluated and contrasted with the associated network investment cost, usually produce important net savings. There are continental electrical systems formed by many interconnected subsystems. The optimal size of an interconnection should be defined within an economic background. It is necessary to take into account the global environmental effects. The approach and results of studies carried out by Red Electrica is presented, in order to analyse both economic and environmental benefits resulting from an increase in the present Spanish interconnection capacities. From both economic and environmental points of view, the development of the interconnected systems is highly positive. (author)

  8. Crosstalk in modern on-chip interconnects a FDTD approach

    CERN Document Server

    Kaushik, B K; Patnaik, Amalendu

    2016-01-01

    The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the ...

  9. Carbon nanotubes for interconnects process, design and applications

    CERN Document Server

    Dijon, Jean; Maffucci, Antonio

    2017-01-01

    This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes c...

  10. Interconnectivity and the Electronic Academic Library

    Directory of Open Access Journals (Sweden)

    Donald E. Riggs

    1988-03-01

    Full Text Available 無Due to the emphasis on the use of computing networks on campuses and to the very nature of more information being accessible to library users only via electronic means, we are witnessing a migration to electronic academic libraries. this new type of library is being required to have interconnections with the campus' other online information/data systems. Arizona State University libraries have been provided the opportunity to develop an electronic library that will be the focal point of a campus-wide information/data network.

  11. Updating Interconnection Screens for PV System Integration

    Energy Technology Data Exchange (ETDEWEB)

    Coddington, M.; Mather, B.; Kroposki, B.; Lynn, K.; Razon, A.; Ellis, A.; Hill, R.; Key, T.; Nicole, K.; Smith, J.

    2012-02-01

    This white paper evaluates the origins and usefulness of the capacity penetration screen, offer short-term solutions which could effectively allow fast-track interconnection to many PV system applications, and considers longer-term solutions for increasing PV deployment levels in a safe and reliable manner while reducing or eliminating the emphasis on the penetration screen. Short-term and longer-term alternatives approaches are offered as examples; however, specific modifications to screening procedures should be discussed with stakeholders and must ultimately be adopted by state and federal regulatory bodies.

  12. Inherent dynamic properties of interconnected power systems

    Energy Technology Data Exchange (ETDEWEB)

    Ustinov, S.M. [St. Petersburg State Technical Univ. (Russian Federation). Dept. of Information and Control Systems; Milanovic, J.V. [UMIST, Manchester (United Kingdom). Dept. of Electrical Engineering and Electronics; Maslennikov, V.A. [St. Petersburg State Technical Univ. (Russian Federation). Dept. of Power Networks and Systems

    2002-06-01

    The paper presents the analytical formulae for calculation of the damping and frequency of the electromechanical modes in large interconnected power systems. The system used for the derivation of those formulae had a structure of a rectangular uniform grid of arbitrary dimensions. It is clearly shown that the low frequency inter-area (LFIA) oscillations are fundamental property of the large longitudinal systems. The reasons for poor damping of these modes are analysed. Analytical expressions for the corresponding eigenvalues are also derived and the modal properties of the LFIA oscillations are discussed. Analytically obtained results are verified through numerical simulations. (author)

  13. Environmental Regulation Impacts on Eastern Interconnection Performance

    Energy Technology Data Exchange (ETDEWEB)

    Markham, Penn N [ORNL; Liu, Yilu [ORNL; Young II, Marcus Aaron [ORNL

    2013-07-01

    In the United States, recent environmental regulations will likely result in the removal of nearly 30 GW of oil and coal-fired generation from the power grid, mostly in the Eastern Interconnection (EI). The effects of this transition on voltage stability and transmission line flows have previously not been studied from a system-wide perspective. This report discusses the results of power flow studies designed to simulate the evolution of the EI over the next few years as traditional generation sources are replaced with environmentally friendlier ones such as natural gas and wind.

  14. National Offshore Wind Energy Grid Interconnection Study

    Energy Technology Data Exchange (ETDEWEB)

    Daniel, John P. [ABB Inc; Liu, Shu [ABB Inc; Ibanez, Eduardo [National Renewable Energy Laboratory; Pennock, Ken [AWS Truepower; Reed, Greg [University of Pittsburgh; Hanes, Spencer [Duke Energy

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States. A total of 54GW of offshore wind was assumed to be the target for the analyses conducted. A variety of issues are considered including: the anticipated staging of offshore wind; the offshore wind resource availability; offshore wind energy power production profiles; offshore wind variability; present and potential technologies for collection and delivery of offshore wind energy to the onshore grid; potential impacts to existing utility systems most likely to receive large amounts of offshore wind; and regulatory influences on offshore wind development. The technologies considered the reliability of various high-voltage ac (HVAC) and high-voltage dc (HVDC) technology options and configurations. The utility system impacts of GW-scale integration of offshore wind are considered from an operational steady-state perspective and from a regional and national production cost perspective.

  15. Message Passing Framework for Globally Interconnected Clusters

    International Nuclear Information System (INIS)

    Hafeez, M; Riaz, N; Asghar, S; Malik, U A; Rehman, A

    2011-01-01

    In prevailing technology trends it is apparent that the network requirements and technologies will advance in future. Therefore the need of High Performance Computing (HPC) based implementation for interconnecting clusters is comprehensible for scalability of clusters. Grid computing provides global infrastructure of interconnecting clusters consisting of dispersed computing resources over Internet. On the other hand the leading model for HPC programming is Message Passing Interface (MPI). As compared to Grid computing, MPI is better suited for solving most of the complex computational problems. MPI itself is restricted to a single cluster. It does not support message passing over the internet to use the computing resources of different clusters in an optimal way. We propose a model that provides message passing capabilities between parallel applications over the internet. The proposed model is based on Architecture for Java Universal Message Passing (A-JUMP) framework and Enterprise Service Bus (ESB) named as High Performance Computing Bus. The HPC Bus is built using ActiveMQ. HPC Bus is responsible for communication and message passing in an asynchronous manner. Asynchronous mode of communication offers an assurance for message delivery as well as a fault tolerance mechanism for message passing. The idea presented in this paper effectively utilizes wide-area intercluster networks. It also provides scheduling, dynamic resource discovery and allocation, and sub-clustering of resources for different jobs. Performance analysis and comparison study of the proposed framework with P2P-MPI are also presented in this paper.

  16. Towards energy aware optical networks and interconnects

    Science.gov (United States)

    Glesk, Ivan; Osadola, Tolulope; Idris, Siti

    2013-10-01

    In a today's world, information technology has been identified as one of the major factors driving economic prosperity. Datacenters businesses have been growing significantly in the past few years. The equipments in these datacenters need to be efficiently connected to each other and also to the outside world in order to enable effective exchange of information. This is why there is need for highly scalable, energy savvy and reliable network connectivity infrastructure that is capable of accommodating the large volume of data being exchanged at any time within the datacenter network and the outside network in general. These devices that can ensure such effective connectivity currently require large amount of energy in order to meet up with these increasing demands. In this paper, an overview of works being done towards realizing energy aware optical networks and interconnects for datacenters is presented. Also an OCDMA approach is discussed as potential multiple access technique for future optical network interconnections. We also presented some challenges that might inhibit effective implementation of the OCDMA multiplexing scheme.

  17. Message Passing Framework for Globally Interconnected Clusters

    Science.gov (United States)

    Hafeez, M.; Asghar, S.; Malik, U. A.; Rehman, A.; Riaz, N.

    2011-12-01

    In prevailing technology trends it is apparent that the network requirements and technologies will advance in future. Therefore the need of High Performance Computing (HPC) based implementation for interconnecting clusters is comprehensible for scalability of clusters. Grid computing provides global infrastructure of interconnecting clusters consisting of dispersed computing resources over Internet. On the other hand the leading model for HPC programming is Message Passing Interface (MPI). As compared to Grid computing, MPI is better suited for solving most of the complex computational problems. MPI itself is restricted to a single cluster. It does not support message passing over the internet to use the computing resources of different clusters in an optimal way. We propose a model that provides message passing capabilities between parallel applications over the internet. The proposed model is based on Architecture for Java Universal Message Passing (A-JUMP) framework and Enterprise Service Bus (ESB) named as High Performance Computing Bus. The HPC Bus is built using ActiveMQ. HPC Bus is responsible for communication and message passing in an asynchronous manner. Asynchronous mode of communication offers an assurance for message delivery as well as a fault tolerance mechanism for message passing. The idea presented in this paper effectively utilizes wide-area intercluster networks. It also provides scheduling, dynamic resource discovery and allocation, and sub-clustering of resources for different jobs. Performance analysis and comparison study of the proposed framework with P2P-MPI are also presented in this paper.

  18. Variational Integrators for Interconnected Lagrange-Dirac Systems

    Science.gov (United States)

    Parks, Helen; Leok, Melvin

    2017-10-01

    Interconnected systems are an important class of mathematical models, as they allow for the construction of complex, hierarchical, multiphysics, and multiscale models by the interconnection of simpler subsystems. Lagrange-Dirac mechanical systems provide a broad category of mathematical models that are closed under interconnection, and in this paper, we develop a framework for the interconnection of discrete Lagrange-Dirac mechanical systems, with a view toward constructing geometric structure-preserving discretizations of interconnected systems. This work builds on previous work on the interconnection of continuous Lagrange-Dirac systems (Jacobs and Yoshimura in J Geom Mech 6(1):67-98, 2014) and discrete Dirac variational integrators (Leok and Ohsawa in Found Comput Math 11(5), 529-562, 2011). We test our results by simulating some of the continuous examples given in Jacobs and Yoshimura (2014).

  19. One-gigabit per second free-space optical interconnection.

    Science.gov (United States)

    Tsang, D Z

    1990-05-10

    A simple and efficient board-to-board optical interconnection consisting of only a laser, two lenses, and a detector demonstrates the direct free-space interconnection of digital circuits. No external laser driver, detector preamplifier, or other interface circuitry was required because of the high efficiency of the link. A differential electrical-to-electrical current efficiency as high as 19% was measured. The interconnection operates at clock rates of 1 GHz.

  20. Asynchronous decentralized method for interconnected electricity markets

    International Nuclear Information System (INIS)

    Huang, Anni; Joo, Sung-Kwan; Song, Kyung-Bin; Kim, Jin-Ho; Lee, Kisung

    2008-01-01

    This paper presents an asynchronous decentralized method to solve the optimization problem of interconnected electricity markets. The proposed method decomposes the optimization problem of combined electricity markets into individual optimization problems. The impact of neighboring markets' information is included in the objective function of the individual market optimization problem by the standard Lagrangian relaxation method. Most decentralized optimization methods use synchronous models of communication to exchange updated market information among markets during the iterative process. In this paper, however, the solutions of the individual optimization problems are coordinated through an asynchronous communication model until they converge to the global optimal solution of combined markets. Numerical examples are presented to demonstrate the advantages of the proposed asynchronous method over the existing synchronous methods. (author)

  1. Experimental demonstration of titanium nitride plasmonic interconnects.

    Science.gov (United States)

    Kinsey, N; Ferrera, M; Naik, G V; Babicheva, V E; Shalaev, V M; Boltasseva, A

    2014-05-19

    An insulator-metal-insulator plasmonic interconnect using TiN, a CMOS-compatible material, is proposed and investigated experimentally at the telecommunication wavelength of 1.55 µm. The TiN waveguide was shown to obtain propagation losses less than 0.8 dB/mm with a mode size of 9.8 µm on sapphire, which agree well with theoretical predictions. A theoretical analysis of a solid-state structure using Si(3)N(4) superstrates and ultra-thin metal strips shows that propagation losses less than 0.3 dB/mm with a mode size of 9 µm are attainable. This work illustrates the potential of TiN as a realistic plasmonic material for practical solid-state, integrated nano-optic and hybrid photonic devices.

  2. SIDES - Segment Interconnect Diagnostic Expert System

    International Nuclear Information System (INIS)

    Booth, A.W.; Forster, R.; Gustafsson, L.; Ho, N.

    1989-01-01

    It is well known that the FASTBUS Segment Interconnect (SI) provides a communication path between two otherwise independent, asynchronous bus segments. The SI is probably the most important module in any FASTBUS data acquisition network since it's failure to function can cause whole segments of the network to be inaccessible and sometimes inoperable. This paper describes SIDES, an intelligent program designed to diagnose SI's both in situ as they operate in a data acquisition network, and in the laboratory in an acceptance/repair environment. The paper discusses important issues such as knowledge acquisition; extracting knowledge from human experts and other knowledge sources. SIDES can benefit high energy physics experiments, where SI problems can be diagnosed and solved more quickly. Equipment pool technicians can also benefit from SIDES, first by decreasing the number of SI's erroneously turned in for repair, and secondly as SIDES acts as an intelligent assistant to the technician in the diagnosis and repair process

  3. Virtual interconnection platform initiative scoping study

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Yong [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Kou, Gefei [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Pan, Zuohong [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Liu, Yilu [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); King Jr., Thomas J. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2016-01-01

    Due to security and liability concerns, the research community has limited access to realistic large-scale power grid models to test and validate new operation and control methodologies. It is also difficult for industry to evaluate the relative value of competing new tools without a common platform for comparison. This report proposes to develop a large-scale virtual power grid model that retains basic features and represents future trends of major U.S. electric interconnections. This model will include realistic power flow and dynamics information as well as a relevant geospatial distribution of assets. This model will be made widely available to the research community for various power system stability and control studies and can be used as a common platform for comparing the efficacies of various new technologies.

  4. Cost based interconnection charges as a way to induce competition

    DEFF Research Database (Denmark)

    Falch, Morten

    The objective of this paper is to analyse the relationship between regulation of interconnection charges and the level of competition. One of the most important issues in the debate on interconnect regulation has been use of forward looking costs for setting of interconnection charges. This debate...... has been ongoing within the EU as well as in US. This paper discusses the European experiences and in particular the Danish experiences with use of cost based interconnection charges, and their impact on competition in the telecom market....

  5. Assessment of The Electrical Systems Interconnection in The Arab World

    Directory of Open Access Journals (Sweden)

    M.H. Abderrazzaq

    2002-06-01

    Full Text Available The international trend of interconnecting electric power systems has two dimensions; economical and technical. Electric power systems in the Arab World are not only eligible, but in need for having a unified power grid. The potentials, status and conditions of the existing and future interconnections in this region are overviewed. The development of the six countries interconnection project, including the completed phase of Jordan-Egypt submarine link, is discussed in details. Finally, the main technical problems, which either faced the first stages of the project or expected to face the interconnected systems in the subsequent stages, are highlighted.

  6. Interconnection of subsystems in closed-loop systems

    DEFF Research Database (Denmark)

    Niemann, Hans Henrik; Poulsen, Niels Kjølstad

    2009-01-01

    The focus in this paper is analysis of stability and controller design for interconnected systems. This includes both the case with known and unknown interconnected sub-system. The key element in both the stability analysis and controller design is the application of the Youla-Jabr-Bongiorno-Kuce......The focus in this paper is analysis of stability and controller design for interconnected systems. This includes both the case with known and unknown interconnected sub-system. The key element in both the stability analysis and controller design is the application of the Youla...

  7. Distributed Energy Resources Interconnection Systems: Technology Review and Research Needs

    Energy Technology Data Exchange (ETDEWEB)

    Friedman, N. R.

    2002-09-01

    Interconnecting distributed energy resources (DER) to the electric utility grid (or Area Electric Power System, Area EPS) involves system engineering, safety, and reliability considerations. This report documents US DOE Distribution and Interconnection R&D (formerly Distributed Power Program) activities, furthering the development and safe and reliable integration of DER interconnected with our nation's electric power systems. The key to that is system integration and technology development of the interconnection devices that perform the functions necessary to maintain the safety, power quality, and reliability of the EPS when DER are connected to it.

  8. Electric power grid interconnection in Northeast Asia

    International Nuclear Information System (INIS)

    Yun, Won-Cheol; Zhang, Zhong Xiang

    2006-01-01

    In spite of regional closeness, energy cooperation in Northeast Asia has remained unexplored. However, this situation appears to be changing. The government of South Korea seems to be very enthusiastic for power grid interconnection between the Russian Far East and South Korea to overcome difficulties in finding new sites for building power facilities to meet its need for increased electricity supplies. This paper analyzes the feasibility of this electric power grid interconnection route. The issues addressed include electricity market structures; the prospects for electric power industry restructuring in the Russian Federation and South Korea; the political issues related to North Korea; the challenges for the governments involved and the obstacles anticipated in moving this project forward; project financing and the roles and concerns from multilateral and regional banks; and institutional framework for energy cooperation. While there are many technical issues that need to be resolved, we think that the great challenge lies in the financing of this commercial project. Thus, the governments of the Russian Federation and South Korea involved in the project need to foster the development of their internal capital markets and to create confidence with international investors. To this end, on energy side, this involves defining a clear energy policy implemented by independent regulators, speeding up the already started but delayed reform process of restructuring electric power industry and markets, and establishing a fair and transparent dispute resolution mechanism in order to reduce non-commercial risks to a minimum. The paper argues that establishing a framework for energy cooperation in this region will contribute positively towards that end, although views differ regarding its specific form. Finally, given that North Korea has a crucial transit role to play and faces a very unstable political situation, it is concluded that moving the project forward needs to be

  9. Synthesis of ceramic powders of La9,56 (SiO4)6O2,34 and La9,8Si5,7MgO,3O26,4 by modified sol-gel process

    International Nuclear Information System (INIS)

    Lira, Sabrina Lopes; Paiva, Mayara Rafaela Soares; Misso, Agatha Matos; Elias, Daniel Ricco; Yamagata, Chieko

    2012-01-01

    Lanthanum silicate oxyapatite materials are promising for application as electrolyte in solid oxide fuel cells because of high ionic conductivity at temperatures between 600 deg C and 800 deg C. In this work, oxyapatites with the composition La 9,56 (SiO 4 ) 6 O 2,34 , and La 9,8 Si 5,7 Mg 0,3 O 26,4 were synthesized by using the sol-gel method, followed by precipitation. Initially, the gel of silica was synthesized from sodium silicate solution, by acid catalysis using lanthanum and magnesium chloride solution. Then, the La and Mg hydroxides were precipitated with NaOH in the gel. The powders were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM) and measurements of specific surface area. The crystalline oxyapatite phase of La 9,56 (SiO 4 ) 6 O 2,34 , and was La 9,8 Si 5,7 Mg 0,3 O 26,4 obtained by calcination at 900 deg C for 2 and 1h respectively (author)

  10. Robert Aymar seals the last interconnect in the LHC

    CERN Multimedia

    Maximilien Brice

    2007-01-01

    The LHC completes the circle. On 7 November, in a brief ceremony in the LHC tunnel, CERN Director General Robert Aymar (Photo 1) sealed the last interconnect between the main magnets of the Large Hadron Collider (LHC). Jean-Philippe Tock, leader of the Interconnections team, tightens the last bolt (Photos 4-8).

  11. 14 CFR 29.957 - Flow between interconnected tanks.

    Science.gov (United States)

    2010-01-01

    ... AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY ROTORCRAFT Powerplant Fuel System § 29.957 Flow between interconnected tanks. (a) Where tank outlets are interconnected and allow fuel to flow between them due to gravity or flight accelerations, it must be impossible for fuel to flow between tanks in...

  12. Carbon Nanotubes as Vertical Interconnects in 3D Integrated Circuits

    NARCIS (Netherlands)

    Vollebregt, S.

    2014-01-01

    Interconnects in integrated circuits (IC) are the major cause of power dissipation and delay. 3D integration has been proposed as a method to reduce these issues. For this 3D integration, fabrication of high aspect ratio reliable vertical interconnects (vias) are required. For this new materials,

  13. Circuit and interconnect design for high bit-rate applications

    NARCIS (Netherlands)

    Veenstra, H.

    2006-01-01

    This thesis presents circuit and interconnect design techniques and design flows that address the most difficult and ill-defined aspects of the design of ICs for high bit-rate applications. Bottlenecks in interconnect design, circuit design and on-chip signal distribution for high bit-rate

  14. Laser induced forward transfer of interconnects for 3D integration

    NARCIS (Netherlands)

    Oosterhuis, G.; Prenen, A.; Huis in 't veld, A.J.

    2011-01-01

    Interconnects are an important cost driver in advanced 3D chip packaging. This holds for Through Silicon Vias (TSVs) for chip stacking, but also for other interconnect steps like re-distribution layers and solder bumps. Especially in applications with a low number (<100 mm-2) of relatively large

  15. Updating Small Generator Interconnection Procedures for New Market Conditions

    Energy Technology Data Exchange (ETDEWEB)

    Coddington, M.; Fox, K.; Stanfield, S.; Varnado, L.; Culley, T.; Sheehan, M.

    2012-12-01

    Federal and state regulators are faced with the challenge of keeping interconnection procedures updated against a backdrop of evolving technology, new codes and standards, and considerably transformed market conditions. This report is intended to educate policymakers and stakeholders on beneficial reforms that will keep interconnection processes efficient and cost-effective while maintaining a safe and reliable power system.

  16. Determining the Utility Value of Water-Supply Interconnections.

    Science.gov (United States)

    Hardman, James L.; Cheremisinoff, Paul N.

    1979-01-01

    This article is the third in a series which discusses a mathematical methodology for evaluating interconnections of water supply systems. The model can be used to analyze the carrying capacity of proposed links or predict the impact of abandoning interconnections. (AS)

  17. Laser Direct Routing for High Density Interconnects

    Science.gov (United States)

    Moreno, Wilfrido Alejandro

    The laser restructuring of electronic circuits fabricated using standard Very Large Scale Integration (VLSI) process techniques, is an excellent alternative that allows low-cost quick turnaround production with full circuit similarity between the Laser Restructured prototype and the customized product for mass production. Laser Restructurable VLSI (LRVLSI) would allow design engineers the capability to interconnect cells that implement generic logic functions and signal processing schemes to achieve a higher level of design complexity. LRVLSI of a particular circuit at the wafer or packaged chip level is accomplished using an integrated computer controlled laser system to create low electrical resistance links between conductors and to cut conductor lines. An infrastructure for rapid prototyping and quick turnaround using Laser Restructuring of VLSI circuits was developed to meet three main parallel objectives: to pursue research on novel interconnect technologies using LRVLSI, to develop the capability of operating in a quick turnaround mode, and to maintain standardization and compatibility with commercially available equipment for feasible technology transfer. The system is to possess a high degree of flexibility, high data quality, total controllability, full documentation, short downtime, a user-friendly operator interface, automation, historical record keeping, and error indication and logging. A specially designed chip "SLINKY" was used as the test vehicle for the complete characterization of the Laser Restructuring system. With the use of Design of Experiment techniques the Lateral Diffused Link (LDL), developed originally at MIT Lincoln Laboratories, was completely characterized and for the first time a set of optimum process parameters was obtained. With the designed infrastructure fully operational, the priority objective was the search for a substitute for the high resistance, high current leakage to substrate, and relatively low density Lateral

  18. Next generation space interconnect research and development in space communications

    Science.gov (United States)

    Collier, Charles Patrick

    2017-11-01

    Interconnect or "bus" is one of the critical technologies in design of spacecraft avionics systems that dictates its architecture and complexity. MIL-STD-1553B has long been used as the avionics backbone technology. As avionics systems become more and more capable and complex, however, limitations of MIL-STD-1553B such as insufficient 1 Mbps bandwidth and separability have forced current avionics architects and designers to use combination of different interconnect technologies in order to meet various requirements: CompactPCI is used for backplane interconnect; LVDS or RS422 is used for low and high-speed direct point-to-point interconnect; and some proprietary interconnect standards are designed for custom interfaces. This results in a very complicated system that consumes significant spacecraft mass and power and requires extensive resources in design, integration and testing of spacecraft systems.

  19. On the reliability oriented optimization of the LHC interconnections

    CERN Document Server

    Skoczen, Blazej; Jacquemod, A; Poncet, A; Schauf, F; Tock, J P

    2002-01-01

    To achieve the maximum beam energy in the LHC the accumulated length of spatial zones, dedicated to the interconnections between the main cryomagnets, has been limited to 3% of the total magnetic length in the Arcs and Dispersion Suppressors. Such a low ratio leads to a very compact design of systems and subsystems situated in the LHC interconnections. The requirements concerning reliability of the LHC interconnections are very tight since the availability of the collider for physics cannot be compromised. The failure modes taken into account in the LHC interconnections are grouped into 4 categories: material failures, structural failures, fatigue failures and electrical failures. A concept of reliability oriented parametric optimization of the LHC interconnections is presented. (4 refs).

  20. Fuel cell electrode interconnect contact material encapsulation and method

    Energy Technology Data Exchange (ETDEWEB)

    Derose, Anthony J.; Haltiner, Jr., Karl J.; Gudyka, Russell A.; Bonadies, Joseph V.; Silvis, Thomas W.

    2016-05-31

    A fuel cell stack includes a plurality of fuel cell cassettes each including a fuel cell with an anode and a cathode. Each fuel cell cassette also includes an electrode interconnect adjacent to the anode or the cathode for providing electrical communication between an adjacent fuel cell cassette and the anode or the cathode. The interconnect includes a plurality of electrode interconnect protrusions defining a flow passage along the anode or the cathode for communicating oxidant or fuel to the anode or the cathode. An electrically conductive material is disposed between at least one of the electrode interconnect protrusions and the anode or the cathode in order to provide a stable electrical contact between the electrode interconnect and the anode or cathode. An encapsulating arrangement segregates the electrically conductive material from the flow passage thereby, preventing volatilization of the electrically conductive material in use of the fuel cell stack.

  1. A one-semester course in modeling of VSLI interconnections

    CERN Document Server

    Goel, Ashok

    2015-01-01

    Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. A One-Semester Course in Modeling of VLSI Interconnections also includes an overview of the future interconnection technologies for the nanotechnology circuits.

  2. Interconnecting Danube networks through satellite links

    Science.gov (United States)

    Radureau, J.

    Studies to be performed by the French NADIR project on techniques to interconnect Danube local-area networks via the Telecom-1 satellite communications system are described. Danube links up to 256 stations by coaxial cable at a predicted rate of 1.8 Mbit/sec in CSMA/CD mode and offers both connectionless and connection-oriented service; Telecom 1 (as simulated by ANIS) provides call-per-call or semipermanent TDMA simplex or full-duplex linkage (point-to-point or multipoint) at 2.4-2000 kbit/sec with a delay of 300 msec and a bit error rate (BER) lower than 10 to the -6th 99 percent of the time (or 10 to the -10th with forward-error correction). The problems of routing, error control, and flow control are considered. A simple scheme involving routing by filtering the address fields, no error and flow control, and minicomputers as gateways in each Danube system is chosen for the point-to-point simulations, while the multipoint connections will be made receiver half-gates and single sender half-gates at each Danube system. Block diagrams are provided.

  3. Microtexture of Strain in electroplated copper interconnects

    International Nuclear Information System (INIS)

    Spolenak, R.; Barr, D.L.; Gross, M.E.; Evans-Lutterodt, K.; Brown, W.L.; Tamura, N.; MacDowell, A.A.; Celestre, R.S.; Padmore, H.A.; Valek, B.C.; Bravman, J.C.; Flinn, P.; Marieb, T.; Keller, R.R.; Batterman, B.W.; Patel, J.R.

    2001-01-01

    The microstructure of narrow metal conductors in the electrical interconnections on IC chips has often been identified as of major importance in the reliability of these devices. The stresses and stress gradients that develop in the conductors as a result of thermal expansion differences in the materials and of electromigration at high current densities are believed to be strongly dependent on the details of the grain structure. The present work discusses new techniques based on microbeam x-ray diffraction (MBXRD) that have enabled measurement not only of the microstructure of totally encapsulated conductors but also of the local stresses in them on a micron and submicron scale. White x-rays from the Advanced Light Source were focused to a micron spot size by Kirkpatrick-Baez mirrors. The sample was stepped under the micro-beam and Laue images obtained at each sample location using a CCD area detector. Microstructure and local strain were deduced from these images. Cu lines with widths ranging from 0.8 mm to 5 mm and thickness of 1 mm were investigated. Comparisons are made between the capabilities of MBXRD and the well established techniques of broad beam XRD, electron back scatter diffraction (EBSD) and focused ion beam imagining (FIB)

  4. Interconnected cavernous structure of bacterial fruiting bodies.

    Directory of Open Access Journals (Sweden)

    Cameron W Harvey

    Full Text Available The formation of spore-filled fruiting bodies by myxobacteria is a fascinating case of multicellular self-organization by bacteria. The organization of Myxococcus xanthus into fruiting bodies has long been studied not only as an important example of collective motion of bacteria, but also as a simplified model for developmental morphogenesis. Sporulation within the nascent fruiting body requires signaling between moving cells in order that the rod-shaped self-propelled cells differentiate into spores at the appropriate time. Probing the three-dimensional structure of myxobacteria fruiting bodies has previously presented a challenge due to limitations of different imaging methods. A new technique using Infrared Optical Coherence Tomography (OCT revealed previously unknown details of the internal structure of M. xanthus fruiting bodies consisting of interconnected pockets of relative high and low spore density regions. To make sense of the experimentally observed structure, modeling and computer simulations were used to test a hypothesized mechanism that could produce high-density pockets of spores. The mechanism consists of self-propelled cells aligning with each other and signaling by end-to-end contact to coordinate the process of differentiation resulting in a pattern of clusters observed in the experiment. The integration of novel OCT experimental techniques with computational simulations can provide new insight into the mechanisms that can give rise to the pattern formation seen in other biological systems such as dictyostelids, social amoeba known to form multicellular aggregates observed as slugs under starvation conditions.

  5. Interconnection issues in Ontario : a status check

    International Nuclear Information System (INIS)

    Helbronner, V.

    2010-01-01

    This PowerPoint presentation discussed wind and renewable energy interconnection issues in Ontario. The province's Green Energy Act established a feed-in tariff (FIT) program and provided priority connection access to the electricity system for renewable energy generation facilities that meet regulatory requirements. As a result of the province's initiatives, Hydro One has identified 20 priority transmission expansion projects and is focusing on servicing renewable resource clusters. As of October 2010, the Ontario Power Authority (OPA) has received 1469 MW of FIT contracts executed for wind projects. A further 5953 MW of wind projects are awaiting approval. A Korean consortium is now planning to develop 2500 MW of renewable energy projects in the province. The OPA has also been asked to develop an updated transmission expansion plan. Transmission/distribution availability tests (TAT/DAT) have been established to determine if there is sufficient connection availability for FIT application projects. Economic connection tests (ECTs) are conducted to assess whether grid upgrade costs to enable additional FIT capacity are justifiable. When projects pass the ECT, grid upgrades needed for the connection included in grid expansion plans. Ontario's long term energy plan was also reviewed. tabs., figs.

  6. Electrically driven monolithic subwavelength plasmonic interconnect circuits.

    Science.gov (United States)

    Liu, Yang; Zhang, Jiasen; Liu, Huaping; Wang, Sheng; Peng, Lian-Mao

    2017-10-01

    In the post-Moore era, an electrically driven monolithic optoelectronic integrated circuit (OEIC) fabricated from a single material is pursued globally to enable the construction of wafer-scale compact computing systems with powerful processing capabilities and low-power consumption. We report a monolithic plasmonic interconnect circuit (PIC) consisting of a photovoltaic (PV) cascading detector, Au-strip waveguides, and electrically driven surface plasmon polariton (SPP) sources. These components are fabricated from carbon nanotubes (CNTs) via a CMOS (complementary metal-oxide semiconductor)-compatible doping-free technique in the same feature size, which can be reduced to deep-subwavelength scale (~λ/7 to λ/95, λ = 1340 nm) compared with the 14-nm technique node. An OEIC could potentially be configured as a repeater for data transport because of its "photovoltaic" operation mode to transform SPP energy directly into electricity to drive subsequent electronic circuits. Moreover, chip-scale throughput capability has also been demonstrated by fabricating a 20 × 20 PIC array on a 10 mm × 10 mm wafer. Tailoring photonics for monolithic integration with electronics beyond the diffraction limit opens a new era of chip-level nanoscale electronic-photonic systems, introducing a new path to innovate toward much faster, smaller, and cheaper computing frameworks.

  7. Two new ternary chalcogenides Ba{sub 2}ZnQ{sub 3} (Q = Se, Te) with chains of ZnQ{sub 4} tetrahedra. Syntheses, crystal structure, and optical and electronic properties

    Energy Technology Data Exchange (ETDEWEB)

    Prakash, Jai; Beard, Jessica; Malliakas, Christos D.; Ibers, James A. [Northwestern Univ., Evanston, IL (United States). Dept. of Chemistry; Mesbah, Adel [Northwestern Univ., Evanston, IL (United States). Dept. of Chemistry; ICSM, UMR 5257 CEA/CNRS/UM2/ENSCM, Bagnols-sur-Ceze (France); Rocca, Dario; Lebegue, Sebastien [Univ. de Lorraine, Vandoeuvre-les-Nancy (France). Lab. de Cristallographie, Resonance Magnetique et Modelisations (CRM2, UMR CNRS 7036)

    2016-08-01

    Single crystals of Ba{sub 2}ZnQ{sub 3} (Q = Se, Te) were obtained by solid-state reactions at 1173 K. These isostructural compounds crystallize in the K{sub 2}AgI{sub 3} structure type. The Zn atoms in this structure are coordinated to four Q atoms (2 Q1, 1 Q2, 1 Q3) and these form a distorted tetrahedron around each Zn atom. Each ZnQ{sub 4} tetrahedron shares two corners with neighboring ZnQ{sub 4} tetrahedra resulting in the formation of infinite chains of [ZnQ{sub 4}{sup 4-}] units. The absorption spectrum of a single crystal of Ba{sub 2}ZnTe{sub 3} shows an absorption edge at 2.10(2) eV, consistent with the dark-red color of the crystals. From DFT calculations Ba{sub 2}ZnSe{sub 3} and Ba{sub 2}ZnTe{sub 3} are found to be semiconductors with electronic band gaps of 2.6 and 1.9 eV, respectively.

  8. Topologies for optical interconnection networks based on the optical transpose interconnection system.

    Science.gov (United States)

    Coudert, D; Ferreira, A; Muñoz, X

    2000-06-10

    Many results exist in the literature describing technological and theoretical advances in optical network topologies and design. However, an essential effort has yet to be made in linking those results together. We propose a step in this direction by giving optical layouts for several graph-theoretical topologies studied in the literature, using the optical transpose interconnection system (OTIS) architecture. These topologies include the family of partitioned optical passive star (POPS) and stack-Kautz networks as well as a generalization of the Kautz and the de Bruijn digraphs.

  9. Signal Integrity Analysis in Single and Bundled Carbon Nanotube Interconnects

    International Nuclear Information System (INIS)

    Majumder, M.K.; Pandya, N.D.; Kaushik, B.K.; Manhas, S.K.

    2013-01-01

    Carbon nanotube (CN T) can be considered as an emerging interconnect material in current nano scale regime. They are more promising than other interconnect materials such as Al or Cu because of their robustness to electromigration. This research paper aims to address the crosstalk-related issues (signal integrity) in interconnect lines. Different analytical models of single- (SWCNT), double- (DWCNT), and multiwalled CNTs (MWCNT) are studied to analyze the crosstalk delay at global interconnect lengths. A capacitively coupled three-line bus architecture employing CMOS driver is used for accurate estimation of crosstalk delay. Each line in bus architecture is represented with the equivalent RLC models of single and bundled SWCNT, DWCNT, and MWCNT interconnects. Crosstalk delay is observed at middle line (victim) when it switches in opposite direction with respect to the other two lines (aggressors). Using the data predicted by ITRS 2012, a comparative analysis on the basis of crosstalk delay is performed for bundled SWCNT/DWCNT and single MWCNT interconnects. It is observed that the overall crosstalk delay is improved by 40.92% and 21.37% for single MWCNT in comparison to bundled SWCNT and bundled DWCNT interconnects, respectively.

  10. Genomic Predictability of Interconnected Biparental Maize Populations

    Science.gov (United States)

    Riedelsheimer, Christian; Endelman, Jeffrey B.; Stange, Michael; Sorrells, Mark E.; Jannink, Jean-Luc; Melchinger, Albrecht E.

    2013-01-01

    Intense structuring of plant breeding populations challenges the design of the training set (TS) in genomic selection (GS). An important open question is how the TS should be constructed from multiple related or unrelated small biparental families to predict progeny from individual crosses. Here, we used a set of five interconnected maize (Zea mays L.) populations of doubled-haploid (DH) lines derived from four parents to systematically investigate how the composition of the TS affects the prediction accuracy for lines from individual crosses. A total of 635 DH lines genotyped with 16,741 polymorphic SNPs were evaluated for five traits including Gibberella ear rot severity and three kernel yield component traits. The populations showed a genomic similarity pattern, which reflects the crossing scheme with a clear separation of full sibs, half sibs, and unrelated groups. Prediction accuracies within full-sib families of DH lines followed closely theoretical expectations, accounting for the influence of sample size and heritability of the trait. Prediction accuracies declined by 42% if full-sib DH lines were replaced by half-sib DH lines, but statistically significantly better results could be achieved if half-sib DH lines were available from both instead of only one parent of the validation population. Once both parents of the validation population were represented in the TS, including more crosses with a constant TS size did not increase accuracies. Unrelated crosses showing opposite linkage phases with the validation population resulted in negative or reduced prediction accuracies, if used alone or in combination with related families, respectively. We suggest identifying and excluding such crosses from the TS. Moreover, the observed variability among populations and traits suggests that these uncertainties must be taken into account in models optimizing the allocation of resources in GS. PMID:23535384

  11. Analysis of interconnecting energy systems over a synchronized life cycle

    International Nuclear Information System (INIS)

    Nian, Victor

    2016-01-01

    Highlights: • A methodology is developed for evaluating a life cycle of interconnected systems. • A new concept of partial temporal boundary is introduced via quantitative formulation. • The interconnecting systems are synchronized through the partial temporal boundary. • A case study on the life cycle of the coal–uranium system is developed. - Abstract: Life cycle analysis (LCA) using the process chain analysis (PCA) approach has been widely applied to energy systems. When applied to an individual energy system, such as coal or nuclear electricity generation, an LCA–PCA methodology can yield relatively accurate results with its detailed process representation based on engineering data. However, there are fundamental issues when applying conventional LCA–PCA methodology to a more complex life cycle, namely, a synchronized life cycle of interconnected energy systems. A synchronized life cycle of interconnected energy systems is established through direct interconnections among the processes of different energy systems, and all interconnecting systems are bounded within the same timeframe. Under such a life cycle formation, there are some major complications when applying conventional LCA–PCA methodology to evaluate the interconnecting energy systems. Essentially, the conventional system and boundary formulations developed for a life cycle of individual energy system cannot be directly applied to a life cycle of interconnected energy systems. To address these inherent issues, a new LCA–PCA methodology is presented in this paper, in which a new concept of partial temporal boundary is introduced to synchronize the interconnecting energy systems. The importance and advantages of these new developments are demonstrated through a case study on the life cycle of the coal–uranium system.

  12. On-chip photonic interconnects a computer architect's perspective

    CERN Document Server

    Nitta, Christopher J; Akella, Venkatesh

    2013-01-01

    As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to the interconnection network. Electrical interconnects are not likely to scale well to a large number of processors for energy efficiency reasons, and the problem is compounded by the fact that there is a fixed total power budget for a die, dictated by the amount of heat that can be dissipated without special (and expensive) cooling and packaging techniques. Thus, there is a need to seek alternatives to electrical signaling for on-chip interconnection appli

  13. 1st International Conference on Local Area Network Interconnection

    CERN Document Server

    Onvural, Raif O; Local area network interconnection

    1993-01-01

    QoS Enhancements and the New Transport Services; A. Danthine, et al. Performance Evaluation and Monitoring of Heterogenous Networks; J. Neuman, et al. Application of High Speed Networks in Hospital Environment; J.R. Rao. On Allocation Schemes for the Interconnection of LANs and Multimedia Sources over Broadband Networks; M. Mateescu. A Superposition of Bursty Sources in a LAN Interconnection Environment; J.M. Karlsson. Interconnecting LANs for Real Time Traffic Application; I. Chlamtac. An Analytical Model for ATM Based Networks which Utilize LookAhead Contention Resolution Switching;

  14. Post-magmatic solid solutions of CaCeAl2(Fe3+ 2/3□1/3)[Si2O7][SiO4]O(OH), allanite-(Ce) and REE-bearing epidote in miarolitic pegmatites of Permian Baveno granite (Verbania, central-southern alps, Italy)

    Science.gov (United States)

    Guastoni, Alessandro; Nestola, Fabrizio; Schiazza, Mariangela

    2017-06-01

    CaCeAl2(Fe3+ 2/3□1/3)[Si2O7][SiO4]O(OH), allanite-(Ce) and rare earth element (REE)-bearing epidote occur as globular aggregates and platy prismatic crystals in miarolitic cavities in a niobium, yttrium, fluorine (NYF) granitic pegmatite at Baveno, Verbania, Southern Alps, Italy. These samples were investigated by means of an electron probe micro-analyser (EPMA) and single-crystal X-ray diffraction. Our EPMA results show that the globular aggregates have the highest REE content in the core portion and decreases to REE-bearing epidote towards the rim whereas the prismatic crystals are characterized by marked oscillatory zoning that have the highest REE contents at the rim of the crystal. The unit-cell parameters of "allanites" have an intermediate unit-cell between CaCeAl2(Fe3+ 2/3□1/3)[Si2O7][SiO4]O(OH), allanite-(Ce) and REE-free epidote, because reflect the strong chemical heterogeneity of the samples which form complete solid solutions. Hydrothermal fluids control the activity and precipitation of incompatible elements like high field strength elements (HFSE), Sc and REE by hydrous F-rich fluids below the critical temperature which allow to deposit accessory minerals in the cavities with decreasing temperature. The source of REE and Y are the sheet and REE-silicates like siderophyllite-annite, and gadolinite-(Y) which underwent partial to complete decomposition by the activity of aggressive F-rich hydrothermal fluids.

  15. On the Equilibrium States of Interconnected Bubbles or Balloons.

    Science.gov (United States)

    Weinhaus, F.; Barker, W.

    1978-01-01

    Describes the equilibrium states of a system composed of two interconnected, air-filled spherical membranes of different sizes. The equilibrium configurations are determined by the method of minimization of the availability of the system at constant temperature. (GA)

  16. 78 FR 73239 - Small Generator Interconnection Agreements and Procedures

    Science.gov (United States)

    2013-12-05

    ... Provider's system (e.g., changing meters, fuses, relay settings) that would allow interconnection and... Facilities, together with lower prices for solar panels, smart grid enhancements and other factors, have...

  17. Lightweight Metal RubberTM Sensors and Interconnects, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — The objective of the proposed program is to develop lightweight and highly elastic electrically conducting interconnects and strain sensor arrays for next generation...

  18. Robust design of head interconnect for hard disk drive

    Science.gov (United States)

    Gao, X. K.; Liu, Q. H.; Liu, Z. J.

    2005-05-01

    Design of head interconnect is one of the important issues for hard disk drives with higher data rate and storage capacity. The impedance of interconnect and electromagnetic coupling influence the quality level of data communication. Thus an insightful study on how the trace configuration affects the impedance and crosstalk is necessary. An effective design approach based on Taguchi's robust design method is employed therefore in an attempt to realize impedance matching and crosstalk minimization with the effects of uncontrollable sources taken into consideration.

  19. Interconnections within food, biofuel, and fossil fuel markets

    OpenAIRE

    Chrz, Stepan; Hruby, Zdenek; Janda, Karel; Kristoufek, Ladislav

    2013-01-01

    The interconnections within food, biofuel and fossil fuel markets are first described in the context of biofuels technologies and economic policy framework. Consequently, the econometric analysis consisting of Johansen cointegration, error correction model, vector autoregression and Granger causality is applied to price series of 12 biofuel related commodities. While a number of equilibrium relationships are found across the examined markets suggesting an interconnections of these markets, we...

  20. Interconnected Power Systems Mexico-Guatemala financed by BID

    International Nuclear Information System (INIS)

    Martinez, Veronica

    2003-01-01

    The article describes the plans for the interconnection of the electric power systems of Guatemala, El Salvador, Honduras, Nicaragua, Costa Rica, Panama and Mexico within the project Plan Pueba Panama. The objective of the interconnection is to create an electric market in the region that contributes to reduce costs and prices. The project will receive a financing of $37.5 millions of US dollars from the Banco Intrameramericano de Desarrollo (BID)

  1. About message routing in different hypercube interconnection network types

    Directory of Open Access Journals (Sweden)

    M. Popa

    1999-10-01

    Full Text Available The paper treats the problem of message routing in different hypercube interconnection network types. Because the communication algorithms frequently use a few basic communication operations, the purpose was to optain relationships for the total communication time at the implementation of these basic operations in different hypercube interconnection types. The basic communication operations considered were: simple message transfer between two processors, one to all broadcast, all to all broadcast, one to all personalized communication, and all to all personalized communication. For establishing the desired relationships, the starting point were the relationships for the total communication time for the above mentioned operations implemented on three basic interconnection networks: classical hypercube, ring and mesh. The different hypercube interconnection network types considered were: the cube connected cycles network, the extended hypercube, the hypernet network, the k array n hypercube and the composed hypercube. The obtained relationships are useful to establish the performances of the considered networks, from the total communication time point of view, making comparisons between them and between them and the classical hypercube interconnection network with the same number of nodes. The most advantageous interconnection network from the above mentioned point of view, is the composed hypercube with the dynamic position of the nodes.

  2. Synthesis, crystal structures, and physical properties of the new Zintl phases A21Zn4Pn18 (A=Ca, Eu; Pn=As, Sb)-Versatile arrangements of [ZnPn4] tetrahedra

    Science.gov (United States)

    Suen, Nian-Tzu; Wang, Yi; Bobev, Svilen

    2015-07-01

    Four new Zintl phases, Ca21Zn4As18, Ca21Zn4Sb18, Eu21Zn4As18 and Eu21Zn4Sb18 have been synthesized by metal flux reactions. Their structures have been established from single-crystal X-ray diffraction. Despite the similar chemical makeup and the identical formulae, the structures of the four compounds are not the same-Ca21Zn4As18, Ca21Zn4Sb18 and Eu21Zn4As18 crystallize in the monoclinic space group C2/m (No. 12, Z=4) with the β-Ca21Mn4Sb18 structure type, while Eu21Zn4Sb18 adopts the Ba21Cd4Sb18 structure type with the orthorhombic space group Cmce (No. 64, Z=8). Both structures are based on ZnAs4 or ZnSb4 tetrahedra, linked in slightly different ways, and Ca2+ and Eu2+ cations that fill the space between them. The structural relationships between the title compounds and other known ternary phases with intricate structures are discussed. Electrical resistivity measurement on single-crystalline Eu21Zn4Sb18 suggests an intrinsic semiconductor behavior with a band gap of ca. 0.2 eV. The temperature dependent DC magnetization measurement on the same material indicates Curie-Weiss paramagnetism in the high-temperature regime, and a spontaneous antiferromagnetic ordering below 8 K. The calculated effective moments of Eu confirm the divalent Eu2+ ground state, as expected from the Zintl-Klemm concept.

  3. Free-Space Optical Interconnects for Multiprocessing Computers

    Science.gov (United States)

    Ha, Berlin

    Various new free-space optical interconnects are studied in this thesis. The focus of the research is to design and to develop fast, reliable and efficient free -space optical interconnects for linking multiprocessing digital computers. New approaches to realize optical crossover and perfect shuffle interconnects are presented in the first two chapters. To implement the optical crossover interconnects, two methods, one based on reflective components, such as mirrors and beam-splitters, and the other based on diffractive components, such as Fresnel zone plates, are used to provide controllable data permutations among digital processing elements. A new optical perfect shuffle, which can form a cascade network of shuffles, is also proposed. This new cascadable optical shuffle makes it possible to realize optical interconnects for multiple-instruction-and-multiple -data processing applications. Optical implementation of binary symmetric logic functions is also studied in this thesis. The proposed optical binary symmetric logic networks provide a new means of using a set of spatially interconnected contact switches as computation tools to execute various binary arithmetic operations, such as arithmetic addition and multiplication. In this thesis, processing element distribution methods for different interconnect topologies are also studied. A new concept to distribute processing elements in a ring array rather than in a rectangular array is proposed. Employing a pair of Dove prisms, the designed optical ring array imaging system can provide both bi-directional and unidirectional links for digital processing nodes. A reflective prism is also specially designed to perform a pair of conjugated image rotation operations for the proposed reflective ring array interconnect. Both the transmissive and reflective ring array networks offer a high speed clock-skew-free data communications among single-instruction-and-multiple -data processors. Finally, a detailed in

  4. Electrode and interconnect for miniature fuel cells using direct methanol feed

    Science.gov (United States)

    Narayanan, Sekharipuram R. (Inventor); Valdez, Thomas I. (Inventor); Clara, Filiberto (Inventor)

    2004-01-01

    An improved system for interconnects in a fuel cell. In one embodiment, the membranes are located in parallel with one another, and current flow between them is facilitated by interconnects. In another embodiment, all of the current flow is through the interconnects which are located on the membranes. The interconnects are located between two electrodes.

  5. Electronic interconnects and devices with topological surface states and methods for fabricating same

    Energy Technology Data Exchange (ETDEWEB)

    Yazdani, Ali; Ong, N. Phuan; Cava, Robert J.

    2016-05-03

    An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

  6. Electronic interconnects and devices with topological surface states and methods for fabricating same

    Energy Technology Data Exchange (ETDEWEB)

    Yazdani, Ali; Ong, N. Phuan; Cava, Robert J.

    2017-04-04

    An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

  7. Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

    Science.gov (United States)

    Strickland, S. M.; Hester, J. D.; Gowan, A. K.; Montgomery, R. K.; Geist, D. L.; Blanche, J. F.; McGuire, G. D.; Nash, T. S.

    2011-01-01

    As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

  8. Generation adequacy and transmission interconnection in regional electricity markets

    International Nuclear Information System (INIS)

    Cepeda, Mauricio; Saguan, Marcelo; Finon, Dominique; Pignon, Virginie

    2009-01-01

    The power system capacity adequacy has public good features that cannot be entirely solved by electricity markets. Regulatory intervention is then necessary and established methods have been used to assess adequacy and help regulators to fix this market failure. In regional electricity markets, transmission interconnections play an important role in contributing to adequacy. However, the adequacy problem and related policy are typically considered at a national level. This paper presents a simple model to study how the interconnection capacity interacts with generation adequacy. First results indicate that increasing interconnection capacity between systems improves adequacy up to a certain level; further increases do not procure additional adequacy improvements. Furthermore, besides adequacy improvement, increasing transmission capacity under asymmetric adequacy criteria or national system characteristics could create several concerns about externalities. These results imply that regional coordination of national adequacy policies is essential to internalise adequacy of cross-border effects.

  9. Net Metering and Interconnection Procedures-- Incorporating Best Practices

    Energy Technology Data Exchange (ETDEWEB)

    Jason Keyes, Kevin Fox, Joseph Wiedman, Staff at North Carolina Solar Center

    2009-04-01

    State utility commissions and utilities themselves are actively developing and revising their procedures for the interconnection and net metering of distributed generation. However, the procedures most often used by regulators and utilities as models have not been updated in the past three years, in which time most of the distributed solar facilities in the United States have been installed. In that period, the Interstate Renewable Energy Council (IREC) has been a participant in more than thirty state utility commission rulemakings regarding interconnection and net metering of distributed generation. With the knowledge gained from this experience, IREC has updated its model procedures to incorporate current best practices. This paper presents the most significant changes made to IREC’s model interconnection and net metering procedures.

  10. Mechanical response of spiral interconnect arrays for highly stretchable electronics

    KAUST Repository

    Qaiser, Nadeem

    2017-11-21

    A spiral interconnect array is a commonly used architecture for stretchable electronics, which accommodates large deformations during stretching. Here, we show the effect of different geometrical morphologies on the deformation behavior of the spiral island network. We use numerical modeling to calculate the stresses and strains in the spiral interconnects under the prescribed displacement of 1000 μm. Our result shows that spiral arm elongation depends on the angular position of that particular spiral in the array. We also introduce the concept of a unit-cell, which fairly replicates the deformation mechanism for full complex hexagon, diamond, and square shaped arrays. The spiral interconnects which are axially connected between displaced and fixed islands attain higher stretchability and thus experience the maximum deformations. We perform tensile testing of 3D printed replica and find that experimental observations corroborate with theoretical study.

  11. Use of VCSEL arrays for parallel optical interconnects

    Science.gov (United States)

    Lebby, Michael S.; Gaw, Craig A.; Jiang, Wenbin; Kiely, Philip A.; Shieh, Chan L.; Claisse, Paul R.; Ramdani, Jamal; Hartman, Davis H.; Schwartz, Daniel B.; Grula, Jerry

    1996-04-01

    The use of vertical cavity surface emitting lasers (VCSELs) in a parallel optical interconnect for Motorola's OPTOBUSTM interconnect was made public over 1 year ago. This was the first time VCSELs were introduced into a product which took advantage of the excellent qualities of VCSELs over edge-emitting lasers. Motorola's OPTOBUSTM interconnect is a ten channel parallel bi-directional data link based on two 10 channel multimode fiber ribbons. One of the key differences in this type of interconnect compared with previous data link designs is the use of the VCSELs as the optical source for the link's fiber optic transmitter. A single 1 X 10 VCSEL array from a GaAs wafer is die attached to a 10 channel GUIDECASTTM optical interface unit which couples the emission from each laser device to its corresponding fiber ribbon channel and thus negates the use of expensive manufacturing techniques such as active alignment and pig-tailing. The OPTOBUSTM interconnect achieves its performance goals (which include low cost) via the unique characteristics of the GaAs VCSELs arrays. For example, the 850 nm devices produce a circular symmetric beam with a half angle of about 10 degrees allowing the coupling loss into the waveguide to be less than 3 dB. In addition, to maintain low manufacturing costs, each VCSEL array is individually and automatically probe tested (just as in the silicon industry) to verify that each VCSEL achieves the OPTOBUSTM interconnect's stringent electrical, optical, thermal and mechanical specifications. Typical computer generated wafer maps from automated production tooling and statistical parametric results are discussed. The combination of low threshold currents with superior thermal and optical performance allow the devices to be modulated under fixed bias conditions. Typical drive currents of 3X threshold are used to obtain nominal FDA Class 1 safety optical power levels from the GUIDECASTTM optical interface unit.

  12. Dual Damascene copper interconnects with low-k polymer dielectrics

    Science.gov (United States)

    Price, David Thomas

    To increase the speed of integrated circuits (ICs), copper interconnects combined with low dielectric constant (low-k) insulators are accepted as the near future replacements for traditional aluminum and silicon dioxide based interconnect technology. In this work, multilevel copper interconnects and low-k polymer insulator fabrication strategies are investigated, with emphasis on integration and two-level metal process realization. Copper interconnects were fabricated with dual Damascene patterning of etching vias and interconnect trenches in the insulator followed by metal deposition and chemical mechanical polishing (CMP) to remove the excess material. The copper adhesion layer and diffusion barrier (or liner) material used was sputtered tantalum. The low-k dielectrics used were vapor deposited parylene-n (PA-n) and spin-on CycloteneTM 5021 divinylsiloxane bisbenzocyclobutene (BCB). PECVD silicon nitride was used as a hard etch mask for dielectric etching, as well as a CMP polish stop, a plasma etch stop and copper diffusion barrier. The dual Damascene processing strategies used to create the via and interconnect pattern were investigated at length. Full integration was performed with four traditional dual Damascene strategies, followed by the development of two unique "clustered hard mask" strategies with full integration of one of them. The fabrication and characterization of dual Damascene copper interconnects led to the defining of eight dual Damascene optimization criteria, specifically addressing polymer dielectrics. Based on polymer dielectric processing considerations and electrical measurements, the clustered hard mask strategies were determined to be superior in comparison to the dual Damascene strategies previously developed for oxide-based dielectrics. The two-level interconnects were characterized by focused ion beam (FIB) cross sectioning and imaging to validate the success of the dual Damascene integration. The average metal-to-metal specific

  13. Compact models and performance investigations for subthreshold interconnects

    CERN Document Server

    Dhiman, Rohit

    2014-01-01

    The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wi

  14. Load Frequency Control of AC Microgrid Interconnected Thermal Power System

    Science.gov (United States)

    Lal, Deepak Kumar; Barisal, Ajit Kumar

    2017-08-01

    In this paper, a microgrid (MG) power generation system is interconnected with a single area reheat thermal power system for load frequency control study. A new meta-heuristic optimization algorithm i.e. Moth-Flame Optimization (MFO) algorithm is applied to evaluate optimal gains of the fuzzy based proportional, integral and derivative (PID) controllers. The system dynamic performance is studied by comparing the results with MFO optimized classical PI/PID controllers. Also the system performance is investigated with fuzzy PID controller optimized by recently developed grey wolf optimizer (GWO) algorithm, which has proven its superiority over other previously developed algorithm in many interconnected power systems.

  15. Wafer thinning for high-density, through-wafer interconnects

    Science.gov (United States)

    Wang, Lianwei; Visser, Cassan C. G.; de Boer, Charles R.; Laros, M.; van der Vlist, W.; Groeneweg, J.; Craciun, G.; Sarro, Pasqualina M.

    2003-01-01

    Thinning of micromachined wafers containing trenches and cavities to realize through-chip interconnects is presented. Successful thinning of wafers by lapping and polishing until the cavities previously etched by deep reactive ion etching are reached is demonstrated. The possible causes of damage to the etched structures are investigated. The trapping of particles in the cavities and suitable cleaning procedures to address this issue are studied. The results achieved so far allow further processing of the thinned wafers to form through wafer interconnections by copper electroplating. Further improvement of the quality of thinned surfaces can be achieved by alternative cleaning procedures.

  16. Stability of interconnected dynamical systems described on Banach spaces

    Science.gov (United States)

    Rasmussen, R. D.; Michel, A. N.

    1976-01-01

    New stability results for a large class of interconnected dynamical systems (also called composite systems or large scale systems) described on Banach spaces are established. In the present approach, the objective is always the same: to analyze large scale systems in terms of their lower order and simpler subsystems and in terms of their interconnecting structure. The present results provide a systematic procedure of analyzing hybrid dynamical systems (i.e., systems that are described by a mixture of different types of equations). To demonstrate the method of analysis advanced, two specific examples are considered.

  17. Supplemental Information for New York State Standardized Interconnection Requirements

    Energy Technology Data Exchange (ETDEWEB)

    Ingram, Michael [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Narang, David J. [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Mather, Barry A. [National Renewable Energy Laboratory (NREL), Golden, CO (United States); Kroposki, Benjamin D. [National Renewable Energy Laboratory (NREL), Golden, CO (United States)

    2017-10-24

    This document is intended to aid in the understanding and application of the New York State Standardized Interconnection Requirements (SIR) and Application Process for New Distributed Generators 5 MW or Less Connected in Parallel with Utility Distribution Systems, and it aims to provide supplemental information and discussion on selected topics relevant to the SIR. This guide focuses on technical issues that have to date resulted in the majority of utility findings within the context of interconnecting photovoltaic (PV) inverters. This guide provides background on the overall issue and related mitigation measures for selected topics, including substation backfeeding, anti-islanding and considerations for monitoring and controlling distributed energy resources (DER).

  18. Fundamentals of reliability engineering applications in multistage interconnection networks

    CERN Document Server

    Gunawan, Indra

    2014-01-01

    This book presents fundamentals of reliability engineering with its applications in evaluating reliability of multistage interconnection networks. In the first part of the book, it introduces the concept of reliability engineering, elements of probability theory, probability distributions, availability and data analysis.  The second part of the book provides an overview of parallel/distributed computing, network design considerations, and more.  The book covers a comprehensive reliability engineering methods and its practical aspects in the interconnection network systems. Students, engineers, researchers, managers will find this book as a valuable reference source.

  19. Security challenges for cooperative and interconnected mobility systems

    NARCIS (Netherlands)

    Bijlsma, T.; Kievit, S. de; Sluis, H.J.D. van de; Nunen, E. van; Passchier, I.; Luiijf, H.A.M.

    2013-01-01

    Software is becoming an important part of the innovation for vehicles. In addition, the systems in vehicles become interconnected and also get external connections, to the internet and Vehicular Ad hoc NETworks (VANETs). These trends form a combined security and safety threat, because recent

  20. Interconnecting Microgrids via the Energy Router with Smart Energy Management

    Directory of Open Access Journals (Sweden)

    Yingshu Liu

    2017-08-01

    Full Text Available A novel and flexible interconnecting framework for microgrids and corresponding energy management strategies are presented, in response to the situation of increasing renewable-energy penetration and the need to alleviate dependency on energy storage equipment. The key idea is to establish complementary energy exchange between adjacent microgrids through a multiport electrical energy router, according to the consideration that adjacent microgrids may differ substantially in terms of their patterns of energy production and consumption, which can be utilized to compensate for each other’s instant energy deficit. Based on multiport bidirectional voltage source converters (VSCs and a shared direct current (DC power line, the energy router serves as an energy hub, and enables flexible energy flow among the adjacent microgrids and the main grid. The analytical model is established for the whole system, including the energy router, the interconnected microgrids and the main grid. Various operational modes of the interconnected microgrids, facilitated by the energy router, are analyzed, and the corresponding control strategies are developed. Simulations are carried out on the Matlab/Simulink platform, and the results have demonstrated the validity and reliability of the idea for microgrid interconnection as well as the corresponding control strategies for flexible energy flow.

  1. An efficient reduction algorithm for computation of interconnect delay ...

    Indian Academy of Sciences (India)

    We develop a method for delay analysis of interconnects considering the impact of Gaussian metal process variations. The resistance and capacitance of a distributed RC line are expressed as correlated Gaussian random variables which are then used to compute the standard deviation of delay Probability Distribution ...

  2. On the Computation of Lyapunov Functions for Interconnected Systems

    DEFF Research Database (Denmark)

    Sloth, Christoffer

    2016-01-01

    This paper addresses the computation of additively separable Lyapunov functions for interconnected systems. The presented results can be applied to reduce the complexity of the computations associated with stability analysis of large scale systems. We provide a necessary and sufficient condition ...

  3. 78 FR 14532 - Small Generator Interconnection Agreements and Procedures; Workshop

    Science.gov (United States)

    2013-03-06

    ... Energy Regulatory Commission Small Generator Interconnection Agreements and Procedures; Workshop Take notice that Federal Energy Regulatory Commission (Commission) staff will convene a workshop in the above..., DC 20426. Members of the Commission may attend the workshop, which will also be open to the public...

  4. Interconnects and On-Chip Data Communication Techniques

    NARCIS (Netherlands)

    Mensink, E.; Schinkel, Daniel; Klumperink, Eric A.M.; van Tuijl, Adrianus Johannes Maria

    Global on-chip communication is rapidly becoming a speed and power bottleneck in CMOS circuits. In this paper, a ‘mixed-signal’ approach is taken to analyze on-chip interconnects and it is investigated how data-rates can be improved. It is shown that complex signaling schemes such as OFDM and CDMA

  5. Bandgap control with local and interconnected LC piezoelectric shunts

    Science.gov (United States)

    Flores Parra, Edgar A.; Bergamini, Andrea; Lossouarn, Boris; Van Damme, Bart; Cenedese, Mattia; Ermanni, Paolo

    2017-09-01

    This paper reports on the control of longitudinal wave propagation, in the kHz frequency range, using local and interconnected LC (inductance-capacitance) shunts distributed periodically along a rod. The LC shunts are connected to piezoelectric inserts and tuned to engender narrow or broad-band pass-bands in the forbidden band frequency range. The Bragg-scattering bandgaps are the result of the periodic mechanical mismatch between PMMA (polymethyl-methacrylate) of the rod and PZT (lead-zirconate-titanate). The narrow pass-bands correspond to the local configuration, where an equivalence between the mechanical impedance of the PMMA and PZT occurs around the shunt resonance frequency. Conversely, the interconnected shunts give a way to an electrical medium through which energy can propagate parallel to its mechanical counterpart, leading to broad pass-bands. This paper presents analytical models for calculating the dispersion and displacements of the 1D medium with interconnected LC shunts. An analytical formulation is also introduced to expediently identify the location of bandgaps and pass-bands in the medium comprised of local LC shunts. Moreover, analytical investigations are carried out to elucidate different physical phenomena giving rise to these pass-bands. The findings are experimentally validated using a finite periodic rod. The ability to tune the dispersion properties of the medium to control the width or depth of the bandgap, by utilizing local or interconnected shunts, offers a new and powerful application for piezoelectric shunts.

  6. Ultra-Stretchable Interconnects for High-Density Stretchable Electronics

    Directory of Open Access Journals (Sweden)

    Salman Shafqat

    2017-09-01

    Full Text Available The exciting field of stretchable electronics (SE promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for proven standardized (complementary metal-oxide semiconductor (CMOS-type process recipes using bulk integrated circuit (IC microfabrication tools and fine-pitch photolithography patterning. Here, we address this combined challenge of microfabrication with extreme stretchability for high-density SE devices by introducing CMOS-enabled, free-standing, miniaturized interconnect structures that fully exploit their 3D kinematic freedom through an interplay of buckling, torsion, and bending to maximize stretchability. Integration with standard CMOS-type batch processing is assured by utilizing the Flex-to-Rigid (F2R post-processing technology to make the back-end-of-line interconnect structures free-standing, thus enabling the routine microfabrication of highly-stretchable interconnects. The performance and reproducibility of these free-standing structures is promising: an elastic stretch beyond 2000% and ultimate (plastic stretch beyond 3000%, with <0.3% resistance change, and >10 million cycles at 1000% stretch with <1% resistance change. This generic technology provides a new route to exciting highly-stretchable miniature devices.

  7. A nanostructure based on metasurfaces for optical interconnects

    Science.gov (United States)

    Lin, Shulang; Gu, Huarong

    2017-08-01

    Optical-electronic Integrated Neural Co-processor takes vital part in optical neural network, which is mainly realized by optical interconnects. Because of the accuracy requirement and long-term goal of integration, optical interconnects should be effective and pint-size. In traditional solutions of optical interconnects, holography built on crystalloid or law of Fresnel diffraction exploited on zone plate was used. However, holographic method cannot meet the efficiency requirement and zone plate is too bulk to make the optical neural unit miniaturization. Thus, this paper aims to find a way to replace holographic method or zone plate with enough diffraction efficiency and smaller size. Metasurfaces are composed of subwavelength-spaced phase shifters at an interface of medium. Metasurfaces allow for unprecedented control of light properties. They also have advanced optical technology of enabling versatile functionalities in a planar structure. In this paper, a nanostructure is presented for optical interconnects. The comparisons of light splitting ability and simulated crosstalk between nanostructure and zone plate are also made.

  8. Early resistance change and stress/electromigrationmodeling in aluminium interconnects

    NARCIS (Netherlands)

    Petrescu, V.; Mouthaan, A.J.; Schoenmaker, W.

    1997-01-01

    A complete description for early resistance change and two dimensional simulation of mechanical stress evolution in confined Al interconnects, related to the electromigration, is given in this paper. The model, combines the stress/ vacancy concentration evolution with the early resistance change of

  9. Distributed Robustness Analysis of Interconnected Uncertain Systems Using Chordal Decomposition

    DEFF Research Database (Denmark)

    Pakazad, Sina Khoshfetrat; Hansson, Anders; Andersen, Martin Skovgaard

    2014-01-01

    Large-scale interconnected uncertain systems commonly have large state and uncertainty dimensions. Aside from the heavy computational cost of performing robust stability analysis in a centralized manner, privacy requirements in the network can also introduce further issues. In this paper, we...

  10. Advanced Modulation Techniques for High-Performance Computing Optical Interconnects

    DEFF Research Database (Denmark)

    Karinou, Fotini; Borkowski, Robert; Zibar, Darko

    2013-01-01

    We experimentally assess the performance of a 64 × 64 optical switch fabric used for ns-speed optical cell switching in supercomputer optical interconnects. More specifically, we study four alternative modulation formats and detection schemes, namely, 10-Gb/s nonreturn-to-zero differential phase-...

  11. Automatic generation control of interconnected power system with ...

    African Journals Online (AJOL)

    In this paper, automatic generation control (AGC) of two area interconnected power system having diverse sources of power generation is studied. A two area power system comprises power generations from hydro, thermal and gas sources in area-1 and power generations from hydro and thermal sources in area-2. All the ...

  12. A high-speed interconnect network using ternary logic

    DEFF Research Database (Denmark)

    Madsen, Jens Kargaard; Long, S. I.

    1995-01-01

    This paper describes the design and implementation of a high-speed interconnect network (ICN) for a multiprocessor system using ternary logic. By using ternary logic and a fast point-to-point communication technique called STARI (Self-Timed At Receiver's Input), the communication between...

  13. Load frequency control of three area interconnected hydro-thermal ...

    African Journals Online (AJOL)

    user

    Sam Higginbottom Institute of Agriculture, Technology & Sciences- Deemed University, Allahabad, INDIA ... This paper present analysis on dynamic performance of Load Frequency Control (LFC) of three area interconnected ..... Higher values of Kp give better steady-state performance, but worse transient response.

  14. Load frequency control of three area interconnected hydro-thermal ...

    African Journals Online (AJOL)

    This paper present analysis on dynamic performance of Load Frequency Control (LFC) of three area interconnected hydrothermal reheat power system by the use of Artificial Intelligent and PI Controller. In the proposed scheme, control methodology developed using conventional PI controller, Artificial Neural Network ...

  15. The myth of interconnected plastids and related phenomena.

    Science.gov (United States)

    Schattat, Martin H; Barton, Kiah A; Mathur, Jaideep

    2015-01-01

    Studies spread over nearly two and a half centuries have identified the primary plastid in autotrophic algae and plants as a pleomorphic, multifunctional organelle comprising of a double-membrane envelope enclosing an organization of internal membranes submerged in a watery stroma. All plastid units have been observed extending and retracting thin stroma-filled tubules named stromules sporadically. Observations on living plant cells often convey the impression that stromules connect two or more independent plastids with each other. When photo-bleaching techniques were used to suggest that macromolecules such as the green fluorescent protein could flow between already interconnected plastids, for many people this impression changed to conviction. However, it was noticed only recently that the concept of protein flow between plastids rests solely on the words "interconnected plastids" for which details have never been provided. We have critically reviewed botanical literature dating back to the 1880s for understanding this term and the phenomena that have become associated with it. We find that while meticulously detailed ontogenic studies spanning nearly 150 years have established the plastid as a singular unit organelle, there is no experimental support for the idea that interconnected plastids exist under normal conditions of growth and development. In this review, while we consider several possibilities that might allow a single elongated plastid to be misinterpreted as two or more interconnected plastids, our final conclusion is that the concept of direct protein flow between plastids is based on an unfounded assumption.

  16. Inkjet-printed, intrinsically stretchable conductors and interconnects

    Science.gov (United States)

    Kraft, U.; Molina-Lopez, F.; Zhu, C.; Wang, Y.; Bao, Z.; Murmann, B.

    2017-08-01

    In the future, a large variety of electronic devices will be wearable and operate in close contact with the skin. To accommodate deformations such as twisting and elongation, these devices should ideally be stretchable. One viable approach toward stretchable electronics is the development of intrinsically stretchable electronic materials, devices and circuits. Recently, the first intrinsically stretchable transistors have been demonstrated [1-7]. However, for the realization of stretchable circuits, stretchable interconnects are equally important. For the deployment of highly stretchable materials as interconnects and electrodes, patterning is crucial. Therefore, we developed a process for inkjet printing of intrinsically stretchable PEDOT:PSS-based interconnects and conductors. Ionic additives act as dopants and plasticisers in this approach [8]. A customized ink was printed on stretchable polymeric substrates (SEBS, styrene-ethylene-butadiene-styrene) and optimized to achieve a smooth morphology of the printed features by adjusting the surface tension and suppressing the coffee stain effect. The printed interconnects have a conductivity of 700 S/cm, sustain strains above 100% and show good stability in 1000-cycle stretching experiments. In addition to morphology, electrical properties and stretchability, we also investigated bias-stress stability, long-term stability in ambient air and cycling stability.

  17. At the speed of light? electricity interconnections for Europe

    International Nuclear Information System (INIS)

    Nies, S.

    2010-01-01

    Electricity moves almost at the speed of light: 273,000 km per second. The speed of electricity makes it the ultimate 'just in time' commodity. A problem anywhere can be transmitted every where in a nanosecond. Electricity interconnection is a prominent issue in the news, sometimes even featured as a panacea for the shortcomings of the European electricity market - a panacea that will ensure security o supply, solidarity and pave the way for a promising use of renewables in the future. The present study is devoted to electricity interconnections in Europe, their current state and the projects concerning them. The study addresses the following questions: - What is the role of interconnections in the development of a sustainable grid that can emerge from the existing pieces, make optimum use of existing generation capacity, ensure energy security, and offer economies of scales? What is their role in the process of building a different energy concept, one that would be concerned with climate change and thus in favour of the use of renewables? - How are existing interconnections exploited and governed, and how can their exploitation be improved? Does the EU need more and new interconnections; and if so, where and why, and who is going to finance them? Prominent projects as such as Desertec, the debate on DC or AC lines, or the limits of synchronization, as well as the state of a potential East-West electricity linkage between Former Soviet Union and EU, termed UCTE-UPS/IPS, are discussed in the volume. Part I develops definitions and basic notions necessary for the understanding of the subject. It also addresses the independent variables that influence interconnections (here the dependent variable), and recounts the historical legacies and their enduring impact on today's grid. Part II is devoted to the EU legal framework and to the complex landscape of governance and its current state of transition. Part III addresses the management of existing interconnections and

  18. At the speed of light? electricity interconnections for Europe

    Energy Technology Data Exchange (ETDEWEB)

    Nies, S.

    2010-07-01

    Electricity moves almost at the speed of light: 273,000 km per second. The speed of electricity makes it the ultimate 'just in time' commodity. A problem anywhere can be transmitted every where in a nanosecond. Electricity interconnection is a prominent issue in the news, sometimes even featured as a panacea for the shortcomings of the European electricity market - a panacea that will ensure security o supply, solidarity and pave the way for a promising use of renewables in the future. The present study is devoted to electricity interconnections in Europe, their current state and the projects concerning them. The study addresses the following questions: - What is the role of interconnections in the development of a sustainable grid that can emerge from the existing pieces, make optimum use of existing generation capacity, ensure energy security, and offer economies of scales? What is their role in the process of building a different energy concept, one that would be concerned with climate change and thus in favour of the use of renewables? - How are existing interconnections exploited and governed, and how can their exploitation be improved? Does the EU need more and new interconnections; and if so, where and why, and who is going to finance them? Prominent projects as such as Desertec, the debate on DC or AC lines, or the limits of synchronization, as well as the state of a potential East-West electricity linkage between Former Soviet Union and EU, termed UCTE-UPS/IPS, are discussed in the volume. Part I develops definitions and basic notions necessary for the understanding of the subject. It also addresses the independent variables that influence interconnections (here the dependent variable), and recounts the historical legacies and their enduring impact on today's grid. Part II is devoted to the EU legal framework and to the complex landscape of governance and its current state of transition. Part III addresses the management of existing

  19. Assessment of on-farm anaerobic digester grid interconnections

    International Nuclear Information System (INIS)

    Ruhnke, W.

    2006-01-01

    While several anaerobic digestion (AD) pilot plants have recently been built in Canada, early reports suggest that interconnection barriers are delaying their widescale implementation. This paper examined grid interconnection experiences from the perspectives of farmers, local distributing companies (LDCs) and other stakeholders. The aim of the paper was to identify challenges to the implementation of AD systems. Case studies included an Ontario Dairy Herd AD system generating 50 kW; a Saskatchewan hog farm AD system generating 120 kW and an Alberta outdoor beef feedlot AD system generating 1000 kW. Two survey forms were created for project operators, and LDCs. The following 3 category barriers were identified: (1) technical concerns over islanding conditions, power quality requirements, power flow studies and other engineering analyses; (2) business practices barriers such as a lack of response after initial utility contact; and (3) regulatory barriers including the unavailability of fair buy-back rates, the lack of net metering programs, restrictive net metering programs, and pricing issues. It was suggested that collaborative efforts among all stakeholders are needed to resolve barriers quickly. Recommendations included the adoption of uniform technical standards for connecting generators to the grid, as well as adopting standard commercial practices for any required LDC interconnection review. It was also suggested that standard business terms for interconnection agreements should be established. Regulatory principles should be compatible with distributed power choices in regulated and unregulated markets. It was concluded that resolving interconnection barriers is a critical step towards realizing market opportunities available for AD technologies. refs., tabs., figs

  20. The Postspinel Phases in the Mg2SiO4-Fe2SiO4 System.

    Science.gov (United States)

    Ming, L C; Bassett, W A

    1975-01-10

    Samples of olivine (Fo(0)Fa(100), Fo(60)Fa(40), Fo(80)Fa(20), and Fo(100)Fa(0)) and of spinel (Fo(50)Fa(50), Fo(2)Fa(100), where Fo is forsterite and Fa is fayalite) were subjected to pressures up to 250 kilobars in a diamond anvil press and were heated in situ up to ~ 1700 degrees C by an infrared beam from a continuous-wave YAG (yttrium-aluminum-garnet) laser. The brightness temperature was determined from the intensity of incandescence of the sample by means of an optical pyrometer. X-ray diffraction patterns of the samples, obtained after quenching and unloading, show conclusively that these compositions disproportionate to (Mg, Fe)O and SiO(s) (stishovite) under these conditions.

  1. Fractal Characteristics Analysis of Blackouts in Interconnected Power Grid

    DEFF Research Database (Denmark)

    Wang, Feng; Li, Lijuan; Li, Canbing

    2018-01-01

    The power failure models are a key to understand the mechanism of large scale blackouts. In this letter, the similarity of blackouts in interconnected power grids (IPGs) and their sub-grids is discovered by the fractal characteristics analysis to simplify the failure models of the IPG. The distri......The power failure models are a key to understand the mechanism of large scale blackouts. In this letter, the similarity of blackouts in interconnected power grids (IPGs) and their sub-grids is discovered by the fractal characteristics analysis to simplify the failure models of the IPG....... The distribution characteristics of blackouts in various sub-grids are demonstrated based on the Kolmogorov-Smirnov (KS) test. The fractal dimensions (FDs) of the IPG and its sub-grids are then obtained by using the KS test and the maximum likelihood estimation (MLE). The blackouts data in China were used...

  2. Capacitive micromachined ultrasonic transducers with through-wafer interconnects

    Science.gov (United States)

    Zhuang, Xuefeng

    Capacitive micromachined ultrasonic transducer (CMUT) is a promising candidate for making ultrasound transducer arrays for applications such as 3D medical ultrasound, non-destructive evaluation and chemical sensing. Advantages of CMUTs over traditional piezoelectric transducers include low-cost batch fabrication, wide bandwidth, and ability to fabricate arrays with broad operation frequency range and different geometric configurations on a single wafer. When incorporated with through-wafer interconnects, a CMUT array can be directly integrated with a front-end integrated circuit (IC) to achieve compact packaging and to mitigate the effects of the parasitic capacitance from the connection cables. Through-wafer via is the existing interconnect scheme for CMUT arrays, and many other types of micro-electro-mechanical system (MEMS) devices. However, to date, no successful through-wafer via fabrication technique compatible with the wafer-bonding method of making CMUT arrays has been demonstrated. The through-wafer via fabrication steps degrade the surface conditions of the wafer, reduce the radius of curvature, thus making it difficult to bond. This work focuses on new through-wafer interconnect techniques that are compatible with common MEMS fabrication techniques, including both surface-micromachining and direct wafer-to-wafer fusion bonding. In this dissertation, first, a through-wafer via interconnect technique with improved characteristics is presented. Then, two implementations of through-wafer trench isolation are demonstrated. The through-wafer trench methods differ from the through-wafer vias in that the electrical conduction is through the bulk silicon instead of the conductor in the vias. In the first implementation, a carrier wafer is used to provide mechanical support; in the second, mechanical support is provided by a silicon frame structure embedded inside the isolation trenches. Both implementations reduce fabrication complexity compared to the through

  3. Conductive polymer/metal composites for interconnect of flexible devices

    Science.gov (United States)

    Kawakita, Jin; Hashimoto Shinoda, Yasuo; Shuto, Takanori; Chikyow, Toyohiro

    2015-06-01

    An interconnect of flexible and foldable devices based on advanced electronics requires high electrical conductivity, flexibility, adhesiveness on a plastic substrate, and efficient productivity. In this study, we investigated the applicability of a conductive polymer/metal composite to the interconnect of flexible devices. By combining an inkjet process and a photochemical reaction, micropatterns of a polypyrrole/silver composite were formed on flexible plastic substrates with an average linewidth of approximately 70 µm within 10 min. The conductivity of the composite was improved to 6.0 × 102 Ω-1·cm-1. From these results, it is expected that the conducting polymer/metal composite can be applied to the microwiring of flexible electronic devices.

  4. Performance evaluation of two highly interconnected Data Center networks

    DEFF Research Database (Denmark)

    Andrus, Bogdan-Mihai; Mihai Poncea, Ovidiu; Vegas Olmos, Juan José

    2015-01-01

    In this paper we present the analysis of highly interconnected topologies like hypercube and torus and how they can be implemented in data centers in order to cope with the rapid increase and demands for performance of the internal traffic. By replicating the topologies and subjecting them to uni...... of the network was increased by a factor of 32. The performance measurements are supported by abstract metrics that also give a cost and complexity indication in choosing the right topology for the required application.......In this paper we present the analysis of highly interconnected topologies like hypercube and torus and how they can be implemented in data centers in order to cope with the rapid increase and demands for performance of the internal traffic. By replicating the topologies and subjecting them...

  5. Methodology for assessing the impacts of distributed generation interconnection

    Directory of Open Access Journals (Sweden)

    Luis E. Luna

    2011-06-01

    Full Text Available This paper proposes a methodology for identifying and assessing the impact of distributed generation interconnection on distribution systems using Monte Carlo techniques. This methodology consists of two analysis schemes: a technical analysis, which evaluates the reliability conditions of the distribution system; on the other hand, an economic analysis that evaluates the financial impacts on the electric utility and its customers, according to the system reliability level. The proposed methodology was applied to an IEEE test distribution system, considering different operation schemes for the distributed generation interconnection. The application of each one of these schemes provided significant improvements regarding the reliability and important economic benefits for the electric utility. However, such schemes resulted in negative profitability levels for certain customers, therefore, regulatory measures and bilateral contracts were proposed which would provide a solution for this kind of problem.

  6. Integrated optoelectronic materials and circuits for optical interconnects

    International Nuclear Information System (INIS)

    Hutcheson, L.D.

    1988-01-01

    Conventional interconnect and switching technology is rapidly becoming a critical issue in the realization of systems using high speed silicon and GaAs based technologies. In recent years clock speeds and on-chip density for VLSI/VHSIC technology has made packaging these high speed chips extremely difficult. A strong case can be made for using optical interconnects for on-chip/on-wafer, chip-to-chip and board-to-board high speed communications. GaAs integrated optoelectronic circuits (IOC's) are being developed in a number of laboratories for performing Input/Output functions at all levels. In this paper integrated optoelectronic materials, electronics and optoelectronic devices are presented. IOC's are examined from the standpoint of what it takes to fabricate the devices and what performance can be expected

  7. Electrical Interconnection Of Superconducting Strands By Electrolytic CU Deposition.

    CERN Document Server

    Scheuerlein, C; Heck, S; Ams, A

    2011-01-01

    The electrical interconnection of Nb3Sn/Cu strands is a key issue for the construction of superconducting devices such as Nb3Sn based insertion devices for third generation light sources. As an alternative connection method for brittle superconducting strands like Nb3Sn/Cu, test joints have been produced by electrolytic deposition of Cu. The resistance of first test joints produced by electrolytic Cu deposition with a strand overlap length of 3 cm at 4.2 K is about 10 n$\\omega$, similar to the resistance measured for joints produced by soft soldering with the same strand overlap length. Interconnection by electrolytic Cu deposition can be done before or after the reaction heat treatment, and it produces a mechanically strong connection. Simulations have been performed with Comsol multiphysics in order to estimate the influence of deposit imperfections on the joint resistance, and to compare the resistance of joints made with different techniques

  8. Optimal interconnection trees in the plane theory, algorithms and applications

    CERN Document Server

    Brazil, Marcus

    2015-01-01

    This book explores fundamental aspects of geometric network optimisation with applications to a variety of real world problems. It presents, for the first time in the literature, a cohesive mathematical framework within which the properties of such optimal interconnection networks can be understood across a wide range of metrics and cost functions. The book makes use of this mathematical theory to develop efficient algorithms for constructing such networks, with an emphasis on exact solutions.  Marcus Brazil and Martin Zachariasen focus principally on the geometric structure of optimal interconnection networks, also known as Steiner trees, in the plane. They show readers how an understanding of this structure can lead to practical exact algorithms for constructing such trees.  The book also details numerous breakthroughs in this area over the past 20 years, features clearly written proofs, and is supported by 135 colour and 15 black and white figures. It will help graduate students, working mathematicians, ...

  9. A reference model for space data system interconnection services

    Science.gov (United States)

    Pietras, John; Theis, Gerhard

    1993-01-01

    The widespread adoption of standard packet-based data communication protocols and services for spaceflight missions provides the foundation for other standard space data handling services. These space data handling services can be defined as increasingly sophisticated processing of data or information received from lower-level services, using a layering approach made famous in the International Organization for Standardization (ISO) Open System Interconnection Reference Model (OSI-RM). The Space Data System Interconnection Reference Model (SDSI-RM) incorporates the conventions of the OSIRM to provide a framework within which a complete set of space data handling services can be defined. The use of the SDSI-RM is illustrated through its application to data handling services and protocols that have been defined by, or are under consideration by, the Consultative Committee for Space Data Systems (CCSDS).

  10. A reference model for space data system interconnection services

    Science.gov (United States)

    Pietras, John; Theis, Gerhard

    1993-03-01

    The widespread adoption of standard packet-based data communication protocols and services for spaceflight missions provides the foundation for other standard space data handling services. These space data handling services can be defined as increasingly sophisticated processing of data or information received from lower-level services, using a layering approach made famous in the International Organization for Standardization (ISO) Open System Interconnection Reference Model (OSI-RM). The Space Data System Interconnection Reference Model (SDSI-RM) incorporates the conventions of the OSIRM to provide a framework within which a complete set of space data handling services can be defined. The use of the SDSI-RM is illustrated through its application to data handling services and protocols that have been defined by, or are under consideration by, the Consultative Committee for Space Data Systems (CCSDS).

  11. Reconfigurable optical interconnection network for multimode optical fiber sensor arrays

    Science.gov (United States)

    Chen, R. T.; Robinson, D.; Lu, H.; Wang, M. R.; Jannson, T.; Baumbick, R.

    1992-01-01

    A single-source, single-detector architecture has been developed to implement a reconfigurable optical interconnection network multimode optical fiber sensor arrays. The network was realized by integrating LiNbO3 electrooptic (EO) gratings working at the Raman Na regime and a massive fan-out waveguide hologram (WH) working at the Bragg regime onto a multimode glass waveguide. The glass waveguide utilized the whole substrate as a guiding medium. A 1-to-59 massive waveguide fan-out was demonstrated using a WH operating at 514 nm. Measured diffraction efficiency of 59 percent was experimentally confirmed. Reconfigurability of the interconnection was carried out by generating an EO grating through an externally applied electric field. Unlike conventional single-mode integrated optical devices, the guided mode demonstrated has an azimuthal symmetry in mode profile which is the same as that of a fiber mode.

  12. Enabling Lead Free Interconnects in DoD Weapon Systems

    Science.gov (United States)

    2017-09-28

    Develop tailored Lead-free webinars for the Program Management and Systems Engineering. These webinars target interconnect reliability and whisker risk to...the needs of the weapon system program managers . Examples of risk will be given and information will be provided on where to access more detailed...Electronics Risk Mitigation: WP-201573T2 Summary Strategic Environmental Research and Development Program (SERDP) Environmental Security Technology

  13. Optical-fiber-interconnected MEMS sensors and actuators

    Science.gov (United States)

    Miller, Michael B.; Meller, Scott A.; Wavering, Thomas A.; Greene, Jonathan A.; Murphy, Kent A.

    1998-07-01

    Microelectromechanical systems or MEMS are miniature devices that have several advantages over conventional sensing and actuating technology. MEMS devices benefit form well developed integrated circuit production methods which ensure high volume, high yield processes that create low-cost sensors and actuators. OPtical fiber interconnected MEMS will provide new functionality in MEMS devices such as multiplexed operation for distributed sensing applications. This paper presents approaches in optical fiber to MEMS interfacing and some preliminary results.

  14. The critical thickness of liners of Cu interconnects

    International Nuclear Information System (INIS)

    Jiang, Q; Zhang, S H; Li, J C

    2004-01-01

    A model for the size-dependence of activation energy is developed. With the model and Fick's second law, relationships among the liner thickness, the working life and the working temperature of a TaN liner for Cu interconnects are predicted. The predicted results of the TaN liner are in good agreement with the experimental results. Moreover, the critical thicknesses of liners of some elements are calculated

  15. Overvoltages related to distributed generation-power system interconnection transformer

    Energy Technology Data Exchange (ETDEWEB)

    Zamanillo, G.R.; Gomez, J.C.; Florena, E.F. [Rio Cuarto National University (IPSEP/UNRC), Cordoba (Argentina). Electric Power Systems Protection Institute], Email: jcgomez@ing.unrc.edu.ar

    2009-07-01

    The energy crisis that experiences the world drives to carry to an extreme, the use of all energy sources which are available. The sources need to be connected to the electric network in their next point, requiring of electric-electronic interfaces. The traditional electric power systems are changing their characteristics, in what concerns to structure, operation and on overvoltage generation. This change is not taking place in coordinated form among the involved sectors. The interconnection of a Distributed Generator (DG) directly with the power system is objectionable and risky. It is required of an interconnection transformer which performs several functions. Rigid specifications do not exist in this respect, for the variety of systems in use in the world, nevertheless there are utilities recommendations. Overvoltages caused by the DG, which arise due to the change of structure of the electric system, are explained. The transformer connection selection, presents positive and negative aspects that impact the utility and the user in a different or many times in an antagonistic way. The phenomenon of balanced and unbalanced ferroresonance overvoltage is studied. This phenomenon can takes place when using DG, either with synchronous or asynchronous generator, and for any type of connection of the transformer. The necessary conditions so that the phenomenon appears are presented. Eight interconnection transformer connection ways were studied. It is concluded that the solutions to reach by means of the employment of the DG, offer technical-economic advantages so much to the utility as to the user. It is also concluded in this work that the more advisable interconnection type is function of the system connection type. (author)

  16. Interconnection France-England; Interconnexion France-Angleterre

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2001-07-01

    These documents defines the interconnection France-England rules for the 2000 MW DC submarine cable directly linking the transmission networks of England and Wales and France. Rights to use Interconnector capacity from 1 April 2001 are to be offered through competitive tenders and auctions, full details of which are set out in the Rules. The contract and a guide to the application form are provided. (A.L.B.)

  17. Physical Properties of 3D Interconnected Graphite Networks - Aerographite

    Science.gov (United States)

    2015-10-30

    networks: Aerographite Grant Number: FA8655-13-1-3058 Principal investigator: Prof. Dr.-Ing. Karl Schulte Institute of Polymers & Composites Hamburg...step process: first, ZnO is manufactured, in a flame spray process forming a solid 3-D scaffold as template, followed by a CVD process in which the...tured graphitic scaffold , the so called Aerographite, in which the graphitic ligaments are directly interconnected by covalent bonds. This rare

  18. Interconnections and market integration in the Irish Single Electricity Market

    International Nuclear Information System (INIS)

    Nepal, Rabindra; Jamasb, Tooraj

    2012-01-01

    Interconnections can be an effective way to increase competition and improve market integration in concentrated wholesale electricity markets with limited number of participants. This paper examines the potential for interconnections and increasing market integration in the Irish Single Electricity Market (SEM). We use a time-varying Kalman filter technique to assess the degree of market integration between SEM and other large, mature and interconnected wholesale electricity markets in Europe including Great Britain (GB). The results indicate no market integration between SEM and other European markets except for Elspot and GB. We show that the current state of market integration between SEM and GB is just 17% indicating potential to improve market integration via increased interconnector capacity. The results indicate that liquidity of wholesale markets might be a crucial factor in the market integration process while our results remain inconclusive in determining whether increased trade of renewables can improve market integration. - Highlights: ► We assess the degree of market integration between SEM and other EU electricity markets. ► Our results indicate no market integration between SEM and other European markets except for Elspot and GB. ► We show that the current state of market integration between SEM and GB is just 17%.

  19. Greenhouse gas emission factors of purchased electricity from interconnected grids

    International Nuclear Information System (INIS)

    Ji, Ling; Liang, Sai; Qu, Shen; Zhang, Yanxia; Xu, Ming; Jia, Xiaoping; Jia, Yingtao; Niu, Dongxiao; Yuan, Jiahai; Hou, Yong; Wang, Haikun; Chiu, Anthony S.F.; Hu, Xiaojun

    2016-01-01

    Highlights: • A new accounting framework is proposed for GHG emission factors of power grids. • Three cases are used to demonstrate the proposed framework. • Comparisons with previous system boundaries approve the necessity. - Abstract: Electricity trade among power grids leads to difficulties in measuring greenhouse gas (GHG) emission factors of purchased electricity. Traditional methods assume either electricity purchased from a grid is entirely produced locally (Boundary I) or imported electricity is entirely produced by the exporting grid (Boundary II) (in fact a blend of electricity produced by many grids). Both methods ignore the fact that electricity can be indirectly traded between grids. Failing to capture such indirect electricity trade can underestimate or overestimate GHG emissions of purchased electricity in interconnected grid networks, potentially leading to incorrectly accounting for the effects of emission reduction policies involving purchased electricity. We propose a “Boundary III” framework to account for emissions both directly and indirectly caused by purchased electricity in interconnected gird networks. We use three case studies on a national grid network, an Eurasian Continent grid network, and North Europe grid network to demonstrate the proposed Boundary III emission factors. We found that the difference on GHG emissions of purchased electricity estimated using different emission factors can be considerably large. We suggest to standardize the choice of different emission factors based on how interconnected the local grid is with other grids.

  20. Power System Study for Renewable Energy Interconnection in Malaysia

    International Nuclear Information System (INIS)

    Askar, O F; Ramachandaramurthy, V K

    2013-01-01

    The renewable energy (RE) sector has grown exponentially in Malaysia with the introduction of the Feed-In-Tariff (FIT) by the Ministry of Energy, Green Technology and Water. Photovoltaic, biogas, biomass and mini hydro are among the renewable energy sources which offer a lucrative tariff to incite developers in taking the green technology route. In order to receive the FIT, a developer is required by the utility company to perform a power system analysis which will determine the technical feasibility of an RE interconnection to the utility company's existing grid system. There are a number of aspects which the analysis looks at, the most important being the load flow and fault levels in the network after the introduction of an RE source. The analysis is done by modelling the utility company's existing network and simulating the network with the interconnection of an RE source. The results are then compared to the values before an interconnection is made as well as ensuring the voltage rise or the increase in fault levels do not violate any pre-existing regulations set by the utility company. This paper will delve into the mechanics of performing a load flow analysis and examining the results obtained.

  1. Shuffle-exchange type interconnection networks for multiprocessor systems

    Energy Technology Data Exchange (ETDEWEB)

    Huang, S.T.

    1985-01-01

    There are two major parts in this dissertation. In the first part, a new model, Finite Permutation Machine (FPM), and a set of theorems are developed to capture the theory of operations for the permutation networks used in SIMD mutliprocessor systems. Using this new framework, a long-lasting open problem is partially solved: Are 2n-1 passes of shuffle exchange necessary and sufficient to realize all permutations., where n = log/sub 2/N and N is the number of inputs and outputs interconnected by the network. In the second part, a solution is presented to the resource scheduling problem in large scale loosely coupled MIMD multiprocessor systems. First an interconnection network called circular shuffle network (CSN) is proposed. CSN is a circular form of shuffle-exchange type multistage interconnection network, with the switching node considered as processors. The author defines CSN with homogeneous switching nodes in the entire network as homogeneous CSN (HCSN). HCSN provides two important properties, namely, clustering of nodes in the entire network with respect to any node and efficient partial broadcast mechanisms. Second a distributed scheduling model is described that takes advantage of the above two properties that HCSN provides.

  2. 14 CFR 121.1111 - Electrical wiring interconnection systems (EWIS) maintenance program.

    Science.gov (United States)

    2010-01-01

    ... 14 Aeronautics and Space 3 2010-01-01 2010-01-01 false Electrical wiring interconnection systems... Airworthiness and Safety Improvements § 121.1111 Electrical wiring interconnection systems (EWIS) maintenance... wiring interconnection systems (EWIS). (c) The proposed EWIS maintenance program changes must be based on...

  3. 77 FR 24646 - Open Access and Priority Rights on Interconnection Facilities

    Science.gov (United States)

    2012-04-25

    ... and AD11-11-000] Open Access and Priority Rights on Interconnection Facilities AGENCY: Federal Energy... seeks comment on open access and priority rights for capacity on interconnection facilities. DATES... ] 61,051 Docket Nos. Open Access and Priority Rights on Interconnection AD12-14-000 Facilities Priority...

  4. Next Generation Space Interconnect Standard (NGSIS): a modular open standards approach for high performance interconnects for space

    Science.gov (United States)

    Collier, Charles Patrick

    2017-04-01

    The Next Generation Space Interconnect Standard (NGSIS) effort is a Government-Industry collaboration effort to define a set of standards for interconnects between space system components with the goal of cost effectively removing bandwidth as a constraint for future space systems. The NGSIS team has selected the ANSI/VITA 65 OpenVPXTM standard family for the physical baseline. The RapidIO protocol has been selected as the basis for the digital data transport. The NGSIS standards are developed to provide sufficient flexibility to enable users to implement a variety of system configurations, while meeting goals for interoperability and robustness for space. The NGSIS approach and effort represents a radical departure from past approaches to achieve a Modular Open System Architecture (MOSA) for space systems and serves as an exemplar for the civil, commercial, and military Space communities as well as a broader high reliability terrestrial market.

  5. Synthesis, characterization, and bonding of indium cluster phases: Na15In27.4, a network of In16 and In11 clusters; Na2In with isolated indium tetrahedra

    International Nuclear Information System (INIS)

    Sevov, S.C.; Corbett, J.D.

    1993-01-01

    The remaining phases in the Na-In system have been identified and characterized. The indium-richest is Na 15 In 27.4 , with a structure containing novel closo-In 16 clusters interconnected to two kinds of nido-In 11 units and isolated, 4-bonded atoms (Cmcm, Z = 8, a = 16.108 (4) Angstrom, b = 35.279 (8) Angstrom, c = 15.931 (3) Angstrom, R/R w = 0.041/0.044 at the indium-rich limits Na 15 In 27.54 ). Fractional occupancy of two atoms in cluster chain positions were found, one as a function of a narrow nonstoichiometry. The structure is related to that recently established for Na 7 In 11.8 . Resistivity and magnetic properties are consistent with a small (0.5-3.2%) excess of electrons relative to the calculated bonding requirements. The sodium-richest phase is the stable, diamagnetic, and weakly metallic Na 2 In, isostructural with Na 2 Tl (C222 1 , Z = 16, a = 13.855 (1) Angstrom, b = 8.836 (1) Angstrom, c = 11.762 (1) Angstrom, R/R w = 0.030/0.034). A corrected phase diagram is given. 21 refs., 5 figs., 5 tabs

  6. [O{sub 2}Pb{sub 3}]{sub 2}(BO{sub 3})Br. An oxidoborate oxide bromide with the {sub ∞}{sup 1}[O{sub 2}Pb{sub 3}] double chains based on edge-sharing OPb{sub 4} tetrahedra

    Energy Technology Data Exchange (ETDEWEB)

    Dong, Lingyun [College of Chemistry and Environmental Science, Hebei University, Baoding (China); Biology and Chemistry Department, Baoding University (China); Yang, Jiao; Shen, Shigang; Liu, Zhenzhen; Sun, Sufang [College of Chemistry and Environmental Science, Hebei University, Baoding (China); Chen, Xiaojing [Biology and Chemistry Department, Baoding University (China)

    2017-04-04

    Through extensive research on the PbO / PbBr{sub 2} / B{sub 2}O{sub 3} system, a new single crystal of yellow lead-containing oxyborate bromine, [O{sub 2}Pb{sub 3}]{sub 2}(BO{sub 3})Br, was grown from the melt. It crystallizes in the centrosymmetric space group Cmcm (no. 63) of the orthorhombic system with the following unit cell dimensions: a = 9.5748(8) Aa, b = 20.841(2) Aa, c = 5.7696(5) Aa, and Z = 4. The whole structure is characterized by an infinite one-dimensional (1D) {sub ∞}{sup 1}[O{sub 2}Pb{sub 3}] double chain, which is based on the OPb{sub 4} oxocentered tetrahedra and considered as the derivative of the continuous sheet of OPb{sub 4} tetrahedra from the tetragonal modification of α-PbO. The 1D {sub ∞}{sup 1}[O{sub 2}Pb{sub 3}] double chains are further bridged by the BO{sub 3} units through common oxygen atoms to form two-dimensional (2D) {sub ∞}{sup 1}[(O{sub 2}Pb{sub 3})(BO{sub 3})] layers, with Br atoms situated between the layers. IR spectroscopy, UV/Vis/NIR diffuse reflectance spectroscopy, and thermal analysis were also performed on the reported material. (copyright 2017 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim)

  7. Autoassociative memory design using interconnected generalized brain-state-in-a-box neural networks.

    Science.gov (United States)

    Oh, Cheolhwan; Zak, Stanislaw H; Zhai, Guisheng

    2005-06-01

    A class of interconnected neural networks composed of generalized Brain-State-in-a-Box (gBSB) neural subnetworks is considered. Interconnected gBSB neural network architectures are proposed along with their stability conditions. The design of the interconnected neural networks is reduced to the problem of solving linear matrix inequalities (LMIs) to determine the interconnection parameters. A method for solving LMIs is devised generating the solutions that, in general, are further away from zero than the corresponding solutions obtained using MATLAB's LMI toolbox, thus resulting in stronger interconnections between the subnetworks. The proposed architectures are then used to construct neural associative memories. Simulations are performed to illustrate the results obtained.

  8. Exploring the interconnections between gender, health and nature.

    Science.gov (United States)

    MacBride-Stewart, S; Gong, Y; Antell, J

    2016-12-01

    Public health has recognized that nature is good for health but there are calls for a review of its gendered aspects. This review attempts to develop and explore a broad analytical theme - the differing interconnections between gender, health and nature. The paper summarizes the interconnections that have been subject to extensive academic enquiry between gender and health, health and space, and gender and space. A combination of key terms including place; gender; health; outdoor space; green space; natural environment; national parks; femininity; masculinity; recreation; physical activity; sustainability; ecofeminism; feminism; environmental degradation; and environmental justice were used to search the electronic databases Sociological Abstracts, Web of Science and Scopus to identify relevant articles. We took two approaches for this review to provide an overview and analysis of the range of research in the field, and to present a framework of research that is an analysis of the intersection of gender, health and nature. Four dimensions are distinguished: (1) evaluations of health benefits and 'toxicities' of nature; (2) dimensions and qualities of nature/space; (3) environmental justice including accessibility, availability and usability; and (4) identification of boundaries (symbolic/material) that construct differential relationships between nature, gender and health. This paper offers an understanding of how environmental and social conditions may differentially shape the health of women and men. The dimensions direct analytical attention to the diverse linkages that constitute overlapping and inseparable domains of knowledge and practice, to identify complex interconnections between gender, health and nature. This review therefore analyses assumptions about the health benefits of nature, and its risks, for gender from an in-depth, analytical perspective that can be used to inform policy. Copyright © 2016 The Royal Society for Public Health. Published by

  9. Actual issues concerning nuclear power plants and interconnected grid

    International Nuclear Information System (INIS)

    Medjimorec, D.; Brkic, S.

    2004-01-01

    Nuclear power plants and transmission grid have always been mutually of special relevance. In countries and/or regions where nuclear power plants are located they are almost as a rule counted among strongest nodes of the grid. Hence, they are treated as such from grid point of view in various aspects (operational, planning). In interconnected high-voltage transmission grid of European mainland, usually called UCTE interconnected system, this importance could be shown in a range of issues and several cases, particularly under present situation in which there are numerous demanding and challenging tasks put on transmission system operators, largely due to the opening of electricity markets in the most of European countries. Among these issues definitely worth of mentioning is relevant influence to both commercial paths and physical power flows, and also to exchange programmes between control areas and blocks. In this context there is also relation to cross-border transactions and mechanism applied to them. In respect to security of supply issues and future of nuclear power generation under present regulative framework of most European countries it is needed to comply with connecting conditions (and other stipulations) from national grid codes where different approaches could be observed. Furthermore, nuclear issues significantly influence approach to extension of UCTE system. In certain extent this also applies to pending re-connection of present two synchronous zones of UCTE, particularly to area of broader region directly affected with this complex process. Some of these also reflect to Croatian high-voltage transmission grid as a part of UCTE interconnected system with certain peculiarities.(author)

  10. On some interconnections between combinatorial optimization and extremal graph theory

    Directory of Open Access Journals (Sweden)

    Cvetković Dragoš M.

    2004-01-01

    Full Text Available The uniting feature of combinatorial optimization and extremal graph theory is that in both areas one should find extrema of a function defined in most cases on a finite set. While in combinatorial optimization the point is in developing efficient algorithms and heuristics for solving specified types of problems, the extremal graph theory deals with finding bounds for various graph invariants under some constraints and with constructing extremal graphs. We analyze by examples some interconnections and interactions of the two theories and propose some conclusions.

  11. Fractal Characteristics Analysis of Blackouts in Interconnected Power Grid

    OpenAIRE

    Wang, Feng; Li, Lijuan; Li, Canbing; Wu, Qiuwei; Cao, Yijia; Zhou, Bin; Fang, Baling

    2018-01-01

    The power failure models are a key to understand the mechanism of large scale blackouts. In this letter, the similarity of blackouts in interconnected power grids (IPGs) and their sub-grids is discovered by the fractal characteristics analysis to simplify the failure models of the IPG. The distribution characteristics of blackouts in various sub-grids are demonstrated based on the Kolmogorov-Smirnov (KS) test. The fractal dimensions (FDs) of the IPG and its sub-grids are then obtained by usin...

  12. A new method for energy accounting in interconnected operations

    International Nuclear Information System (INIS)

    Navid, Taghizadegan; Navid, Taghizadegan; Naser, Tabatabaei; Ahmad Reza, Zentabchi; Majid, Mollazadeh

    2005-01-01

    Full text : The measurement of electrical energy supplied to customers or purchased from and delivered to interconnected power systems is of paramount importance in power system operations. Accurate measurement of energy delivered to customers or received from and delivered to other systems is necessary to ensure that billing is correct. energy transferred between systems also must be properly measured and accounted for to ensure that agreed-upon schedules are being met and that each system meets its obligation to match generation with load on a moment-to-moment basis

  13. Ring-array processor distribution topology for optical interconnects

    Science.gov (United States)

    Li, Yao; Ha, Berlin; Wang, Ting; Wang, Sunyu; Katz, A.; Lu, X. J.; Kanterakis, E.

    1992-01-01

    The existing linear and rectangular processor distribution topologies for optical interconnects, although promising in many respects, cannot solve problems such as clock skews, the lack of supporting elements for efficient optical implementation, etc. The use of a ring-array processor distribution topology, however, can overcome these problems. Here, a study of the ring-array topology is conducted with an aim of implementing various fast clock rate, high-performance, compact optical networks for digital electronic multiprocessor computers. Practical design issues are addressed. Some proof-of-principle experimental results are included.

  14. Interconnecting Smart Objects with IP The Next Internet

    CERN Document Server

    Vasseur, Jean-Philippe

    2010-01-01

    Smart object technology, sometimes called the Internet of Things, is having a profound impact on our day-to-day lives. Interconnecting Smart Objects with IP is the first book that takes a holistic approach to the revolutionary area of IP-based smart objects. Smart objects are the intersection of networked embedded systems, wireless sensor networks, ubiquitous and pervasive computing, mobile telephony and telemetry, and mobile computer networking. This book consists of three parts, Part I focuses on the architecture of smart objects networking, Part II covers the hardware, software, and protoco

  15. IIIV/Si hybrid integrated devices for optical interconnect

    Science.gov (United States)

    Chen, Kaixuan; Zhu, Yuntao; Cheng, Jianxin; Huang, Qiangsheng; Fu, Xin; Zhang, Jianhao; Shi, Yaocheng; Liu, Jin; Roelkens, Günther; Liu, Liu

    2015-02-01

    We discuss our view of the on-chip optical interconnect infrastructure for future multi-core processers based on wavelength-division-multiplexing (WDM) and our recent results on some key devices for such structures. Cascading performance of various wavelength multiplexers and de-multiplexers including arrayed waveguide gratings (AWGs) and echelle gratings based on the silicon-on-insulator platform are discussed and compared. IIIV based electro-absorption (EA) modulators on silicon realized through benzocyclobutene (BCB) adhesive bonding are analyzed. Ultra short adiabatic taper based mode converters between passive and active structures are designed. The integration of multichannel modulators, detectors and wavelength de-multiplexers is realized.

  16. Ferroelectric devices, interconnects, and methods of manufacture thereof

    KAUST Repository

    Alshareef, Husam N.

    2013-12-12

    A doped electroconductive organic polymer is used for forming the electrode of a ferroelectric device or an interconnect. An exemplary ferroelectric device is a ferrelectric capacitor comprising: a substrate (101); a first electrode (106) disposed on the substrate; a ferroelectric layer (112) disposed on and in contact with the first electrode; and a second electrode (116) disposed on and in contact with the ferroelectric layer, wherein at least one of the first electrode and the second electrode is an organic electrode comprising a doped electroconductive organic polymer, for example DMSO-doped PEDOT-PSS.

  17. Production process for advanced space satellite system cables/interconnects.

    Energy Technology Data Exchange (ETDEWEB)

    Mendoza, Luis A.

    2007-12-01

    This production process was generated for the satellite system program cables/interconnects group, which in essences had no well defined production process. The driver for the development of a formalized process was based on the set backs, problem areas, challenges, and need improvements faced from within the program at Sandia National Laboratories. In addition, the formal production process was developed from the Master's program of Engineering Management for New Mexico Institute of Mining and Technology in Socorro New Mexico and submitted as a thesis to meet the institute's graduating requirements.

  18. DER Certification Laboratory Pilot, Accreditation Plan, and Interconnection Agreement Handbook

    Energy Technology Data Exchange (ETDEWEB)

    Key, T.; Sitzlar, H. E.; Ferraro, R.

    2003-11-01

    This report describes the first steps toward creating the organization, procedures, plans and tools for distributed energy resources (DER) equipment certification, test laboratory accreditation, and interconnection agreements. It covers the activities and accomplishments during the first period of a multiyear effort. It summarizes steps taken to outline a certification plan to assist in the future development of an interim plan for certification and accreditation activities. It also summarizes work toward a draft plan for certification, a beta Web site to support communications and materials, and preliminary draft certification criteria.

  19. Crosstalk in dynamic optical interconnects in photorefractive crystals

    DEFF Research Database (Denmark)

    Andersen, Peter E.; Petersen, Paul Michael; Buchhave, Preben

    1994-01-01

    We have investigated the crosstalk between two neighboring gratings in photorefractive Bi12SiO20 optical interconnects. The gratings are induced by the interference between one reference beam and two object beams. By applying a suitable phase shift in one of the object beams, we can selectively...... switch off one of the gratings. The crosstalk between the two gratings is experimentally determined from the diffraction efficiency in the remaining grating before and after applying the phase shift. The magnitude of the crosstalk is determined by the intensity ratio between the reference beam intensity...

  20. 100 GHz Externally Modulated Laser for Optical Interconnects Applications

    DEFF Research Database (Denmark)

    Ozolins, Oskars; Pang, Xiaodan; Iglesias Olmedo, Miguel

    2017-01-01

    We report on a 116 Gb/s on-off keying (OOK), four pulse amplitude modulation (PAM) and 105-Gb/s 8-PAM optical transmitter using an InP-based integrated and packaged externally modulated laser for high-speed optical interconnects with up to 30 dB static extinction ratio and over 100-GHz 3-d......B bandwidth with 2 dB ripple. In addition, we study the tradeoff between power penalty and equalizer length to foresee transmission distances with standard single mode fiber....

  1. Addendum to the 2015 Eastern Interconnect Baselining and Analysis Report

    Energy Technology Data Exchange (ETDEWEB)

    Amidan, Brett G. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Follum, James D. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States)

    2016-06-30

    This report serves as an addendum to the report 2015 Eastern Interconnect Baselining and Analysis Report (Amidan, Follum, and Freeman, 2015). This addendum report investigates the following: the impact of shorter record lengths and of adding a daily regularization term to the date/time models for angle pair measurements, additional development of a method to monitor the trend in phase angle pairs, the effect of changing the length of time to determine a baseline, when calculating atypical events, and a comparison between quantitatively discovered atypical events and actual events.

  2. Design rules for vertical interconnections by reverse offset printing

    Science.gov (United States)

    Kusaka, Yasuyuki; Kanazawa, Shusuke; Ushijima, Hirobumi

    2018-03-01

    Formation of vertical interconnections by reverse offset printing was investigated, particularly focusing on the transfer step, in which an ink pattern is transferred from a polydimethylsiloxane (PDMS) sheet for the step coverage of contact holes. We systematically examined the coverage of contact holes made of a tapered photoresist layer by varying the hole size, the hole depth, PDMS elasticity, PDMS thickness, printing speed, and printing indentation depth. Successful ink filling was achieved when the PDMS was softer, and the optimal PDMS thickness varied depending on the size of the contact holes. This behaviour is related to the bell-type uplift deformation of incompressible PDMS, which can be described by contact mechanics numerical simulations. Based on direct observation of PDMS/resist-hole contact behaviour, the step coverage of contact holes typically involves two steps of contact area growth: (i) the PDMS first touches the bottom of the holes and then (ii) the contact area gradually and radially widens toward the tapered sidewall. From an engineering perspective, it is pointed out that mechanical synchronisation mismatch in the roll-to-sheet type printing invokes the cracking of ink layers at the edges of contact holes. According to the above design rule, ink filling into a contact hole with thickness of 2.5 µm and radius of 10 µm was achieved. Contact chain patterns with 1386 points of vertical interconnections with the square hole size of up to 10 µm successfully demonstrated the validity of the technique presented herein.

  3. Security analysis of interconnected AC/DC systems

    DEFF Research Database (Denmark)

    Eriksson, Robert

    2015-01-01

    This paper analyses N-1 security in an interconnected ac/dc transmission system using power transfer distribution factors (PTDFs). In the case of a dc converter outage the power needs to be redistributed among the remaining converter to maintain power balance and operation of the dc grid. The red......This paper analyses N-1 security in an interconnected ac/dc transmission system using power transfer distribution factors (PTDFs). In the case of a dc converter outage the power needs to be redistributed among the remaining converter to maintain power balance and operation of the dc grid...... voltage control design consider the power distribution for a converter outage. By proper design and utilizing the proposed method increases the N-1 security and the secure transfer limits. This article proposes a method which minimizes the 2-norm of the sum of the PTDFs with constraints of not violating...... any line or transformer limits. Simulations were performed in a model of the Nordic power system where a dc grid is placed on top. The simulation supports the method as a tool to consider transfer limits in the grid to avoid violate the same and increase the security after a converter outage....

  4. Advanced methodology for generation expansion planning including interconnected systems

    Energy Technology Data Exchange (ETDEWEB)

    Zhao, M.; Yokoyama, R.; Yasuda, K. [Tokyo Metropolitan Univ. (Japan); Sasaki, H. [Hiroshima Univ. (Japan); Ogimoto, K. [Electric Power Development Co. Ltd., Tokyo (Japan)

    1994-12-31

    This paper reviews advanced methodology for generation expansion planning including interconnected systems developed in Japan, putting focus on flexibility and efficiency in a practical application. First, criteria for evaluating flexibility of generation planning considering uncertainties are introduced. Secondly, the flexible generation mix problem is formulated as a multi-objective optimization with more than two objective functions. The multi-objective optimization problem is then transformed into a single objective problem by using the weighting method, to obtain the Pareto optimal solution, and solved by a dynamics programming technique. Thirdly, a new approach for electric generation expansion planning of interconnected systems is presented, based on the Benders Decomposition technique. That is, large scale generation problem constituted by the general economic load dispatch problem, and several sub problems which are composed of smaller scale isolated system generation expansion plans. Finally, the generation expansion plan solved by an artificial neural network is presented. In conclusion, the advantages and disadvantages of this method from the viewpoint of flexibility and applicability to practical generation expansion planning are presented. (author) 29 refs., 10 figs., 4 tabs.

  5. Electromigration-induced plasticity and texture in Cu interconnects

    International Nuclear Information System (INIS)

    Advanced Light Source; Tamura, Nobumichi; Budiman, A. S.; Hau-Riege, C.S.; Besser, P. R.; Marathe, A.; Joo, Y.-C.; Tamura, N.; Patel, J. R.; Nix, W. D.

    2007-01-01

    Plastic deformation has been observed in damascene Cu interconnect test structures during an in-situ electromigration experiment and before the onset of visible microstructural damage (ie. voiding) using a synchrotron technique of white beam X-ray microdiffraction. We show here that the extent of this electromigration-induced plasticity is dependent on the texture of the Cu grains in the line. In lines with strong textures, the extent of plastic deformation is found to be relatively large compared to our plasticity results in the previous study [1] using another set of Cu lines with weaker textures. This is consistent with our earlier observation that the occurrence of plastic deformation in a given grain can be strongly correlated with the availability of a direction of the crystal in the proximity of the direction of the electron flow in the line (within an angle of 10 o ). In out-of-plane oriented grains in a damascene interconnect scheme, the crystal plane facing the sidewall tends to be a {110} plane,[2-4] so as to minimize interfacial energy. Therefore, it is deterministic rather than probabilistic that the grains will have a direction nearly parallel to the direction of electron flow. Thus, strong textures lead to more plasticity, as we observe

  6. The Baltic interconnected power system; technical basement and development problems

    International Nuclear Information System (INIS)

    Kreslinsh, V.; Pervushin, Yu.; Zeltinsh, N.

    1997-01-01

    Three Baltic states, Estonia, Latvia and Lithuania are located on the Eastern shore of the Baltic Sea and to North-West of the newly independent states of the former Soviet Union. The Baltic States were part of the SU for many years and consequently a part of a highly structured and centralised system. Prior to gaining independence in 1991, Baltic's power system had been planned and operated as a part of the North -West Interconnected Power Systems (Ips) of the former SU for 30 years. That is why the power systems of individual countries of the Baltic were not planned or operated as a independent systems but regionally, with the planning based on the optimisation of the whole Nord-West interconnected system. The Nord-West IPS included the power systems of Estonia, Latvia, Lithuania, and Belarus, as well as six North-West regions of Russia: Leningrad, Kola Peninsula, Karelia, Pskov, Novgorod, and Kaliningrad. Analysis of the structure, conditions, loads, specifics technical features, basics operation data of the main power stations in the Baltic IPS is given

  7. Sound insulation performance of plates with interconnected distributed piezoelectric patches

    Directory of Open Access Journals (Sweden)

    Yi Kaijun

    2017-02-01

    Full Text Available This paper deals with the sound insulation performance of a thin plate with interconnected distributed piezoelectric patches. Piezoelectric patches are periodically bonded on the surfaces of the plate in a collocated fashion, and are interconnected via an inductive circuit network. This piezoelectric system is termed as piezo-electromechanical (PEM plate in the paper. Homogenization methods are involved under a sub-wavelength assumption to analytically develop the dynamical equations for the PEM plate. The dispersion relationships and energy densities of the wave modes propagating in the PEM plate are studied; the sub-wavelength assumption is verified for the simulations in this paper. The coincidence frequency of the PEM plate is researched, and results show that the coincidence frequency of the PEM plate will disappear at certain circumstances; mathematical and physical explanations are made for this phenomenon. The disappearance of the coincidence frequency is used to optimize the value of inductance, for the purpose of improving the sound transmission loss of the PEM plate.

  8. Uniform Microparticles with Controllable Highly Interconnected Hierarchical Porous Structures.

    Science.gov (United States)

    Zhang, Mao-Jie; Wang, Wei; Yang, Xiu-Lan; Ma, Bing; Liu, Ying-Mei; Xie, Rui; Ju, Xiao-Jie; Liu, Zhuang; Chu, Liang-Yin

    2015-07-01

    A simple and versatile strategy is developed for one-step fabrication of uniform polymeric microparticles with controllable highly interconnected hierarchical porous structures. Monodisperse water-in-oil-in-water (W/O/W) emulsions, with methyl methacrylate, ethylene glycol dimethacrylate, and glycidyl methacrylate as the monomer-containing oil phase, are generated from microfluidics and used for constructing the microparticles. Due to the partially miscible property of oil/aqueous phases, the monodisperse W/O/W emulsions can deform into desired shapes depending on the packing structure of inner aqueous microdrops, and form aqueous nanodrops in the oil phase. The deformed W/O/W emulsions allow template syntheses of highly interconnected hierarchical porous microparticles with precisely and individually controlled pore size, porosity, functionality, and particle shape. The microparticles elaborately combine the advantages of enhanced mass transfer, large functional surface area, and flexibly tunable functionalities, providing an efficient strategy to physically and chemically achieve enhanced synergetic performances for extensive applications. This is demonstrated by using the microparticles for oil removal for water purification and protein adsorption for bioseparation. The method proposed in this study provides full versatility for fabrication of functional polymeric microparticles with controllable hierarchical porous structures for enhancing and even broadening their applications.

  9. Electromigration of intergranular voids in metal films for microelectronic interconnects

    CERN Document Server

    Averbuch, A; Ravve, I

    2003-01-01

    Voids and cracks often occur in the interconnect lines of microelectronic devices. They increase the resistance of the circuits and may even lead to a fatal failure. Voids may occur inside a single grain, but often they appear on the boundary between two grains. In this work, we model and analyze numerically the migration and evolution of an intergranular void subjected to surface diffusion forces and external voltage applied to the interconnect. The grain-void interface is considered one-dimensional, and the physical formulation of the electromigration and diffusion model results in two coupled fourth-order one-dimensional time-dependent PDEs. The boundary conditions are specified at the triple points, which are common to both neighboring grains and the void. The solution of these equations uses a finite difference scheme in space and a Runge-Kutta integration scheme in time, and is also coupled to the solution of a static Laplace equation describing the voltage distribution throughout the grain. Since the v...

  10. Cooperative behavior evolution of small groups on interconnected networks

    International Nuclear Information System (INIS)

    Huang, Keke; Cheng, Yuan; Zheng, Xiaoping; Yang, Yeqing

    2015-01-01

    Highlights: • Small groups are modeled on interconnected networks. • Players face different dilemmas inside and outside small groups. • Impact of the ratio and strength of link on the behavioral evolution are studied. - Abstract: Understanding the behavioral evolution in evacuation is significant for guiding and controlling the evacuation process. Based on the fact that the population consists of many small groups, here we model the small groups which are separated in space but linked by other methods, such as kinship, on interconnected networks. Namely, the players in the same layer belong to an identical small group, while the players located in different layers belong to different small groups. And the players of different layers establish interaction by edge crossed layers. In addition, players face different dilemmas inside and outside small groups, in detail, the players in the same layer play prisoner’s dilemma, but players in different layers play harmony game. By means of numerous simulations, we study the impact of the ratio and strength of link on the behavioral evolution. Because the framework of this work takes the space distribution into account, which is close to the realistic life, we hope that it can provide a new insight to reveal the law of behavioral evolution of evacuation population.

  11. Electromigration-induced plasticity and texture in Cu interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Advanced Light Source; Tamura, Nobumichi; Budiman, A. S.; Hau-Riege, C.S.; Besser, P. R.; Marathe, A.; Joo, Y.-C.; Tamura, N.; Patel, J. R.; Nix, W. D.

    2007-10-31

    Plastic deformation has been observed in damascene Cu interconnect test structures during an in-situ electromigration experiment and before the onset of visible microstructural damage (ie. voiding) using a synchrotron technique of white beam X-ray microdiffraction. We show here that the extent of this electromigration-induced plasticity is dependent on the texture of the Cu grains in the line. In lines with strong <111> textures, the extent of plastic deformation is found to be relatively large compared to our plasticity results in the previous study [1] using another set of Cu lines with weaker textures. This is consistent with our earlier observation that the occurrence of plastic deformation in a given grain can be strongly correlated with the availability of a <112> direction of the crystal in the proximity of the direction of the electron flow in the line (within an angle of 10{sup o}). In <111> out-of-plane oriented grains in a damascene interconnect scheme, the crystal plane facing the sidewall tends to be a {l_brace}110{r_brace} plane,[2-4] so as to minimize interfacial energy. Therefore, it is deterministic rather than probabilistic that the <111> grains will have a <112> direction nearly parallel to the direction of electron flow. Thus, strong <111> textures lead to more plasticity, as we observe.

  12. Middleware Architecture for the Interconnection of Distributed and Parallel Systems

    Directory of Open Access Journals (Sweden)

    Ovidiu Gherman

    2012-01-01

    Full Text Available Grid computing is a fast evolving technology, bringing more computing power to its users. Two main directions are observable: creating dedicated supercomputers for scientific and commercial tasks and creating distributed commodity-based systems. The first ones are usually much expensive, but have the advantage of performance, better control and uniformity in platforms. The second one is more affordable but lacks in flexibility and easy maintenance. The computing necessities that often require supplementary computing power for certain time periods are better satisfied by interconnecting available resources than buying new, expensive ones. But interconnecting platforms – sometimes radically different – can be a difficult task. The proliferation of hybrid parallel computing systems can be even more complicated because it puts in contact systems with various operating flows at the parallelism level. In this frame, the present article proposes a new middleware architecture that can connect multiple parallel or distributed resources, of different types, allowing unitary resource utilization and reservation for the user’s jobs. The new architecture is described functionally and structurally.

  13. Zooplankton structure in two interconnected ponds: similarities and differences

    Directory of Open Access Journals (Sweden)

    Špoljar Maria

    2016-03-01

    Full Text Available The research of zooplankton diversity, abundance and trophic structure was conducted during the summer period in pelagial zone on the longitudinal profile of the Sutla River Backwater. Investigated site consists of two interconnected basins: transparent Upper Basin with submerged macrophytes and turbid Lower Basin without macrophytes in the littoral zone. In the Upper Basin, abundance and diversity of zooplankton in the pelagial was higher in comparison to the Lower Basin, with prevailing species of genus Keratella as microfilter-feeder, and genera of Polyartha and Trihocerca as macrofilter-feeder rotifers. On the contrary, in the Lower Basin, crustaceans dominated in abundance. Microfilter-feeder cladoceran (Bosmina longirostris and larval and adult stages of macrofilter-feeder copepod (Macrocyclops albidus prevailed in the Lower Basin. Fish predation pressure was more pronounced in the pelagial of the Upper Basin, indicated by low cladoceran abundance in the surface layer. Although the studied basins were interconnected, results indicate significant (Mann-Whitney U test, p < 0.05 differences in the zooplankton structure as a potential result of the macrophyte impact on environmental conditions and fish predation pressure.

  14. High-speed VCSEL-based optical interconnects

    Science.gov (United States)

    Ishak, Waguih S.

    2001-11-01

    Vertical Cavity Surface Emitting Lasers (VCSEL) have made significant inroads into commercial realization especially in the area of data communications. Single VCSEL devices are key components in Gb Ethernet Transceivers. A multi-element VCSEL array is the key enabling technology for high-speed multi Gb/s parallel optical interconnect modules. In 1996, several companies introduced a new generation of fiber optic products based VCSEL technology such as multimode fiber transceivers for the ANSI Fiber Channel and Gigabit Ethernet IEEE 802.3 standards. VCSELs offer unique advantages over its edge-emitting counterparts in several areas. These include low-cost (LED-like) manufacturability, low current operation and array integrability. As data rates continue to increase, VCSELs offer the advantage of being able to provide the highest modulation bandwidth per milliamp of modulation current. Currently, most of the VCSEL-based products use short (780 - 980 nm) wavelength lasers. However, significant research efforts are taking place at universities and industrial research labs around the world to develop reliable, manufacturable and high-power long (1300 - 1550 nm) wavelength VCSELs. These lasers will allow longer (several km) transmission distances and will help alleviate some of the eye-safety issues. Perhaps, the most important advantage of VCSELs is the ability to form two-dimensional arrays much easier than in the case of edge-emitting lasers. These arrays (single and two-dimensional) will allow a whole new family of applications, specifically in very high-speed computer and switch interconnects.

  15. Mechanics of ultra-stretchable self-similar serpentine interconnects

    International Nuclear Information System (INIS)

    Zhang, Yihui; Fu, Haoran; Su, Yewang; Xu, Sheng

    2013-01-01

    Graphical abstract: We developed analytical models of flexibility and elastic-stretchability for self-similar interconnect. The analytic solutions agree very well with the finite element analyses, both demonstrating that the elastic-stretchability more than doubles when the order of self-similar structure increases by one. Design optimization yields 90% and 50% elastic stretchability for systems with surface filling ratios of 50% and 70% of active devices, respectively. The analytic models are useful for the development of stretchable electronics that simultaneously demand large coverage of active devices, such as stretchable photovoltaics and electronic eye-ball cameras. -- Abstract: Electrical interconnects that adopt self-similar, serpentine layouts offer exceptional levels of stretchability in systems that consist of collections of small, non-stretchable active devices in the so-called island–bridge design. This paper develops analytical models of flexibility and elastic stretchability for such structures, and establishes recursive formulae at different orders of self-similarity. The analytic solutions agree well with finite element analysis, with both demonstrating that the elastic stretchability more than doubles when the order of the self-similar structure increases by one. Design optimization yields 90% and 50% elastic stretchability for systems with surface filling ratios of 50% and 70% of active devices, respectively

  16. Monolithically interconnected GaAs solar cells: A new interconnection technology for high voltage solar cell output

    Science.gov (United States)

    Dinetta, L. C.; Hannon, M. H.

    1995-10-01

    Photovoltaic linear concentrator arrays can benefit from high performance solar cell technologies being developed at AstroPower. Specifically, these are the integration of thin GaAs solar cell and epitaxial lateral overgrowth technologies with the application of monolithically interconnected solar cell (MISC) techniques. This MISC array has several advantages which make it ideal for space concentrator systems. These are high system voltage, reliable low cost monolithically formed interconnections, design flexibility, costs that are independent of array voltage, and low power loss from shorts, opens, and impact damage. This concentrator solar cell will incorporate the benefits of light trapping by growing the device active layers over a low-cost, simple, PECVD deposited silicon/silicon dioxide Bragg reflector. The high voltage-low current output results in minimal 12R losses while properly designing the device allows for minimal shading and resistance losses. It is possible to obtain open circuit voltages as high as 67 volts/cm of solar cell length with existing technology. The projected power density for the high performance device is 5 kW/m for an AMO efficiency of 26% at 1 5X. Concentrator solar cell arrays are necessary to meet the power requirements of specific mission platforms and can supply high voltage power for electric propulsion systems. It is anticipated that the high efficiency, GaAs monolithically interconnected linear concentrator solar cell array will enjoy widespread application for space based solar power needs. Additional applications include remote man-portable or ultra-light unmanned air vehicle (UAV) power supplies where high power per area, high radiation hardness and a high bus voltage or low bus current are important. The monolithic approach has a number of inherent advantages, including reduced cost per interconnect and increased reliability of array connections. There is also a high potential for a large number of consumer products. Dual

  17. Monolithically interconnected GaAs solar cells: A new interconnection technology for high voltage solar cell output

    Science.gov (United States)

    Dinetta, L. C.; Hannon, M. H.

    1995-01-01

    Photovoltaic linear concentrator arrays can benefit from high performance solar cell technologies being developed at AstroPower. Specifically, these are the integration of thin GaAs solar cell and epitaxial lateral overgrowth technologies with the application of monolithically interconnected solar cell (MISC) techniques. This MISC array has several advantages which make it ideal for space concentrator systems. These are high system voltage, reliable low cost monolithically formed interconnections, design flexibility, costs that are independent of array voltage, and low power loss from shorts, opens, and impact damage. This concentrator solar cell will incorporate the benefits of light trapping by growing the device active layers over a low-cost, simple, PECVD deposited silicon/silicon dioxide Bragg reflector. The high voltage-low current output results in minimal 12R losses while properly designing the device allows for minimal shading and resistance losses. It is possible to obtain open circuit voltages as high as 67 volts/cm of solar cell length with existing technology. The projected power density for the high performance device is 5 kW/m for an AMO efficiency of 26% at 1 5X. Concentrator solar cell arrays are necessary to meet the power requirements of specific mission platforms and can supply high voltage power for electric propulsion systems. It is anticipated that the high efficiency, GaAs monolithically interconnected linear concentrator solar cell array will enjoy widespread application for space based solar power needs. Additional applications include remote man-portable or ultra-light unmanned air vehicle (UAV) power supplies where high power per area, high radiation hardness and a high bus voltage or low bus current are important. The monolithic approach has a number of inherent advantages, including reduced cost per interconnect and increased reliability of array connections. There is also a high potential for a large number of consumer products. Dual

  18. Management and use of electric interconnections in 2008

    International Nuclear Information System (INIS)

    2009-07-01

    Major progress was made throughout 2008 in border congestion management and market integration. A number of projects were carried out, including the creation of a single auction platform for the Central-West region (CASC-CWE) and the first centre for regional coordination (Coreso SA) to better control real-time flow, thus laying the foundations for future network management on a regional scale. Such progress encourages more improvements still, which should take effect some time in 2009 and should constitute an important stage in creating an integrated European electricity market. The more significant expected advances notably include the implementation of a single, harmonised set of bidding rules covering the entire Central-West region, which would include introducing the principle of automatic resale of capacity (use-it-or-sell-it); the launch of the second phase of the BALIT project for reciprocal adjusting exchanges between France and England; the introduction of a compensation scheme for curtailments of capacity based on the differences in pricing at Power Exchanges over the France-Spain interconnection; and finally the elaboration of the very first regional reports by regulators on the management and use of interconnections. The launch of the market coupling in the Central-West region, planned for March 2010, will unquestionably be a key event in market integration. In addition to substantially improving the use of the region's interconnections, it will offer significant new perspectives in market organisation (such as the future role and status of organised markets as regards day-ahead activity). The work of network operators on the flow-based aspect of the project will also enable improvements in transparency and coordination when calculating interconnection capacities, and could, in the long-run, open debates on changing the market design. However, of the issues raised in CRE's second report on management and use of interconnections, several have

  19. Silver flip chip interconnect technology and solid state bonding

    Science.gov (United States)

    Sha, Chu-Hsuan

    In this dissertation, fluxless transient liquid phase (TLP) bonding and solid state bonding between thermal expansion mismatch materials have been developed using Ag-In binary systems, pure Au, Ag, and Cu-Ag composite. In contrast to the conventional soldering process, fluxless bonding technique eliminates any corrosion and contamination problems caused by flux. Without flux, it is possible to fabricate high quality joints in large bonding areas where the flux is difficult to clean entirely. High quality joints are crucial to bonding thermal expansion mismatch materials since shear stress develops in the bonded pair. Stress concentration at voids in joints could increases breakage probability. In addition, intermetallic compound (IMC) formation between solder and underbump metallurgy (UBM) is essential for interconnect joint formation in conventional soldering process. However, the interface between IMC and solder is shown to be the weak interface that tends to break first during thermal cycling and drop tests. In our solid state bonding technique, there is no IMC involved in the bonding between Au to Au, Ag and Cu, and Ag and Au. All the reliability issues related to IMC or IMC growth is not our concern. To sum up, ductile bonding media, such as Ag or Au, and proper metallic layered structure are utilized in this research to produce high quality joints. The research starts with developing a low temperature fluxless bonding process using electroplated Ag/In/Ag multilayer structures between Si chip and 304 stainless steel (304SS) substrate. Because the outer thin Ag layer effectively protects inner In layer from oxidation, In layer dissolves Ag layer and joints to Ag layer on the to-be-bonded Si chip when temperature reaches the reflow temperature of 166ºC. Joints consist of mainly Ag-rich Ag-In solid solution and Ag2In. Using this fluxless bonding technique, two 304SS substrates can be bonded together as well. From the high magnification SEM images taken at cross

  20. Swarm Intelligence-Inspired Spontaneous Fabrication of Optimal Interconnect at the Micro/Nanoscale.

    Science.gov (United States)

    Su, Meng; Huang, Zhandong; Huang, Yong; Chen, Shuoran; Qian, Xin; Li, Wenbo; Li, Yifan; Pei, Weihua; Chen, Hongda; Li, Fengyu; Song, Yanlin

    2017-02-01

    A spontaneous process is demonstrated to assemble nanoparticles into an optimal interconnect, as natural systems spontaneously figure out the shortest path. The optimal interconnect leads to a 65.9% decrease in electromagnetic interference, a 17.1% decrease in delay, and a 24.5% decrease in energy-delay. It will be of great significance for interconnect fabrication of versatile electronic circuits. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  1. The high speed interconnect system architecture and operation

    Science.gov (United States)

    Anderson, Steven C.

    The design and operation of a fiber-optic high-speed interconnect system (HSIS) being developed to meet the requirements of future avionics and flight-control hardware with distributed-system architectures are discussed. The HSIS is intended for 100-Mb/s operation of a local-area network with up to 256 stations. It comprises a bus transmission system (passive star couplers and linear media linked by active elements) and network interface units (NIUs). Each NIU is designed to perform the physical, data link, network, and transport functions defined by the ISO OSI Basic Reference Model (1982 and 1983) and incorporates a fiber-optic transceiver, a high-speed protocol based on the SAE AE-9B linear token-passing data bus (1986), and a specialized application interface unit. The operating modes and capabilities of HSIS are described in detail and illustrated with diagrams.

  2. Multimode polymer waveguides for high-speed optical interconnects

    Science.gov (United States)

    Bamiedakis, N.; Ingham, J. D.; Penty, R. V.; White, I. H.; DeGroot, J. V.; Clapp, T. V.

    2017-11-01

    Polymeric multimode waveguides are of particular interest for optical interconnections in short-reach data links. In some applications, for example in space-borne systems, the use of advanced materials with outstanding performance in extreme environments is required (temperature and radiation). In this paper therefore, we present novel siloxane polymers suitable for these applications. The materials are used to form straight, 90° bent and spiral polymer waveguides by low-cost conventional photolithographic techniques on FR4 substrates. The samples have been tested to investigate their propagation characteristics and demonstrate their potential for high-speed data links. Overall, there is strong evidence that these multimode waveguides can be successfully employed as high-speed short-reach data links. Their excellent thermal properties, their low cost and the simple fabrication process indicate their suitability for a wide range of space applications.

  3. Geothermal Power and Interconnection: The Economics of Getting to Market

    Energy Technology Data Exchange (ETDEWEB)

    Hurlbut, D.

    2012-04-01

    This report provides a baseline description of the transmission issues affecting geothermal technologies. The report begins with a comprehensive overview of the grid, how it is planned, how it is used, and how it is paid for. The report then overlays onto this 'big picture' three types of geothermal technologies: conventional hydrothermal systems; emerging technologies such as enhanced engineered geothermal systems (EGS) and geopressured geothermal; and geothermal co-production with existing oil and gas wells. Each category of geothermal technology has its own set of interconnection issues, and these are examined separately for each. The report draws conclusions about each technology's market affinities as defined by factors related to transmission and distribution infrastructure. It finishes with an assessment of selected markets with known geothermal potential, identifying those that offer the best prospects for near-term commercial development and for demonstration projects.

  4. Two Component Injection Moulding for Moulded Interconnect Devices

    DEFF Research Database (Denmark)

    Islam, Aminul

    The moulded interconnect devices (MIDs) contain huge possibilities for many applications in micro electro-mechanical-systems because of their potential in reducing the number of components, process steps and finally in miniaturization of the product. Among the available MID process chains, two...... component (2k) injection moulding is one of the most industrially adaptive processes. However, the use of two component injection moulding for MID fabrication, with circuit patterns in sub-millimeter range, is still a big challenge. This book searches for the technical difficulties associated...... which can effectively control the quality of 2k moulded parts and metallized MIDs. This book presents documented knowledge about MID process chains, 2k moulding and selective metallization which can be valuable source of information for both academic and industrial users....

  5. Stretchable microelectrode array using room-temperature liquid alloy interconnects

    International Nuclear Information System (INIS)

    Wei, P; Ziaie, B; Taylor, R; Chung, C; Higgs, G; Pruitt, B L; Ding, Z; Abilez, O J

    2011-01-01

    In this paper, we present a stretchable microelectrode array for studying cell behavior under mechanical strain. The electrode array consists of gold-plated nail-head pins (250 µm tip diameter) or tungsten micro-wires (25.4 µm in diameter) inserted into a polydimethylsiloxane (PDMS) platform (25.4 × 25.4 mm 2 ). Stretchable interconnects to the outside were provided by fusible indium-alloy-filled microchannels. The alloy is liquid at room temperature, thus providing the necessary stretchability and electrical conductivity. The electrode platform can withstand strains of up to 40% and repeated (100 times) strains of up to 35% did not cause any failure in the electrodes or the PDMS substrate. We confirmed biocompatibility of short-term culture, and using the gold pin device, we demonstrated electric field pacing of adult murine heart cells. Further, using the tungsten microelectrode device, we successfully measured depolarizations of differentiated murine heart cells from embryoid body clusters

  6. The GIOD Project-Globally Interconnected Object Databases

    CERN Document Server

    Bunn, J J; Newman, H B; Wilkinson, R P

    2001-01-01

    The GIOD (Globally Interconnected Object Databases) Project, a joint effort between Caltech and CERN, funded by Hewlett Packard Corporation, has investigated the use of WAN-distributed Object Databases and Mass Storage systems for LHC data. A prototype small- scale LHC data analysis center has been constructed using computing resources at Caltechs Centre for advanced Computing Research (CACR). These resources include a 256 CPU HP Exemplar of ~4600 SPECfp95, a 600 TByte High Performance Storage System (HPSS), and local/wide area links based on OC3 ATM. Using the exemplar, a large number of fully simulated CMS events were produced, and used to populate an object database with a complete schema for raw, reconstructed and analysis objects. The reconstruction software used for this task was based on early codes developed in preparation for the current CMS reconstruction program, ORCA. (6 refs).

  7. Secure Precise Clock Synchronization for Interconnected Body Area Networks

    Directory of Open Access Journals (Sweden)

    Alonso Luis

    2011-01-01

    Full Text Available Secure time synchronization is a paramount service for wireless sensor networks (WSNs constituted by multiple interconnected body area networks (BANs. We propose a novel approach to securely and efficiently synchronize nodes at BAN level and/or WSN level. Each BAN develops its own notion of time. To this effect, the nodes of a BAN synchronize with their BAN controller node. Moreover, controller nodes of different BANs cooperate to agree on a WSN global and/or to transfer UTC time. To reduce the number of exchanged synchronization messages, we use an environmental-aware time prediction algorithm. The performance analysis in this paper shows that our approach exhibits very advanced security, accuracy, precision, and low-energy trade-off. For comparable precision, our proposal outstands related clock synchronization protocols in energy efficiency and risk of attacks. These results are based on computations.

  8. The Quality Control of the LHC Continuous Cryostat Interconnections

    CERN Document Server

    Bertinelli, F; Bozzini, D; Cruikshank, P; Fessia, P; Grimaud, A; Kotarba, A; Maan, W; Olek, S; Poncet, A; Russenschuck, Stephan; Savary, F; Sulek, Z; Tock, J P; Tommasini, D; Vaudaux, L; Williams, L

    2008-01-01

    The interconnections between the Large Hadron Collider (LHC) magnets have required some 40 000 TIG welded joints and 65 000 electrical splices. At the level of single joints and splices, non-destructive techniques find limited application: quality control is based on the qualification of the process and of operators, on the recording of production parameters and on production samples. Visual inspection and process audits were the main techniques used. At the level of an extended chain of joints and splices - from a 53.5 m half-cell to a complete 2.7 km arc sector - quality control is based on vacuum leak tests, electrical tests and RF microwave reflectometry that progressively validated the work performed. Subsequent pressure tests, cryogenic circuits flushing with high pressure helium and cool-downs revealed a few unseen or new defects. This paper presents an overview of the quality control techniques used, seeking lessons applicable to similar large, complex projects.

  9. Efficient dual layer interconnect coating for high temperature electrochemical devices

    DEFF Research Database (Denmark)

    Palcut, Marián; Mikkelsen, Lars; Neufeld, Kai

    2012-01-01

    Effects of novel dual layer coatings Co3O4/La0.85Sr0.15MnO3−δ on high temperature oxidation behaviour of candidate steels for interconnects are studied at 1123 K in flowing simulated ambient air (air + 1% H2O) and oxygen. Four alloys are investigated: Crofer 22 APU, Crofer 22 H, E-Brite and AL 29......-4C. The reaction kinetics is followed by measuring the mass increase of the samples over time. The oxide scale microstructure and chemical composition are investigated by scanning electron microscopy/energy dispersive spectroscopy. The kinetic data follow the parabolic rate law. It is found...... that the oxidation reaction is limited by outward Cr3+ diffusion in the chromia scale. The coating effectively reduces the oxidation rate. Reactions and cation inter-diffusion between the coating and the oxide scale are observed. Long term effects of these interactions are discussed and practical implications...

  10. The (interconnected) reasons elder Americans file consumer bankruptcy.

    Science.gov (United States)

    Thorne, Deborah

    2010-04-01

    Since the early 1990s, the age distribution of the bankruptcy population has shifted. Specifically, the age distribution curve has flattened, due in large part to an increase in the number of elder Americans (65 and older) who are filing bankruptcy. To date, the reasons for elder bankruptcies have not been studied. Quantitative and qualitative data from 381 elder bankruptcy respondents who participated in the 2007 Consumer Bankruptcy Project suggest that overwhelming interest and fees on credit cards, illnesses and injuries, income problems, aggressive debt collectors, and housing problems are the leading reasons that elder debtors file bankruptcy. Further, the vast majority of elder bankruptcies result not from a single cause, but rather from multiple interconnected causes.

  11. New organization scheme for the energy supply in the not interconnected zones of Colombia

    International Nuclear Information System (INIS)

    Zapata, Josue; Bayona Lugdy

    2001-01-01

    The paper shows a new scheme of solutions in the financial institutional environment and regulatory, in this sense it thinks about the creation from a support unit to the rural energy administration that takes charge of to identify energy solutions and the technical and organizational support of the service of a foundation that manage the obtained resources and a interconnected scheme to the current conditions of the NIZ. In Colombia the not interconnected zones NIZ corresponds those of the country that don't receive electric power service through the national interconnected system, and who interconnection is not economically feasible

  12. Superconducting Thin-Film Interconnects for Cryogenic Photon Detector Arrays, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — Next generation astrophysical observatories need improvements in readout electronics and associated high density interconnects. In particular, advanced imaging...

  13. Optical interconnections and networks; Proceedings of the Meeting, The Hague, Netherlands, Mar. 14, 15, 1990

    Science.gov (United States)

    Bartelt, Hartmut (Editor)

    1990-01-01

    The conference presents papers on interconnections, clock distribution, neural networks, and components and materials. Particular attention is given to a comparison of optical and electrical data interconnections at the board and backplane levels, a wafer-level optical interconnection network layout, an analysis and simulation of photonic switch networks, and the integration of picosecond GaAs photoconductive devices with silicon circuits for optical clocking and interconnects. Consideration is also given to the optical implementation of neural networks, invariance in an optoelectronic implementation of neural networks, and the recording of reversible patterns in polymer lightguides.

  14. Weaves as an Interconnection Fabric for ASIM's and Nanosatellites

    Science.gov (United States)

    Gorlick, Michael M.

    1995-01-01

    Many of the micromachines under consideration require computer support, indeed, one of the appeals of this technology is the ability to intermix mechanical, optical, analog, and digital devices on the same substrate. The amount of computer power is rarely an issue, the sticking point is the complexity of the software required to make effective use of these devices. Micromachines are the nano-technologist's equivalent of 'golden screws'. In other words, they will be piece parts in larger assemblages. For example, a nano-satellite may be composed of stacked silicon wafers where each wafer contains hundreds to thousands of micromachines, digital controllers, general purpose computers, memories, and high-speed bus interconnects. Comparatively few of these devices will be custom designed, most will be stock parts selected from libraries and catalogs. The novelty will lie in the interconnections. For example, a digital accelerometer may be a component part in an adaptive suspension, a monitoring element embedded in the wrapper of a package, or a portion of the smart skin of a launch vehicle. In each case, this device must inter-operate with other devices and probes for the purposes of command, control, and communication. We propose a software technology called 'weaves' that will permit large collections of micromachines and their attendant computers to freely intercommunicate while preserving modularity, transparency, and flexibility. Weaves are composed of networks of communicating software components. The network, and the components comprising it, may be changed even while the software, and the devices it controls, are executing. This unusual degree of software plasticity permits micromachines to dynamically adapt the software to changing conditions and allows system engineers to rapidly and inexpensively develop special purpose software by assembling stock software components in custom configurations.

  15. INTERCONNECTION AND INTERACTION OF INTERROGATIVE SENTENCES IN THE ENGLISH LANGUAGE

    Directory of Open Access Journals (Sweden)

    Natalia Sklyarova

    2013-12-01

    Full Text Available Normal 0 false false false RU X-NONE X-NONE MicrosoftInternetExplorer4 This paper presents the results of research devoted to one of significant aspects of interrogative sentences. The precise definitions of interconnection and interaction and the application of these terms to the language units helped to distinguish between interconnection and interaction of interrogative sentences in English. The existence of two different kinds of relations in the language, namely paradigmatic and syntagmatic, provided the basis for singling out two corresponding forms of interaction of English interrogative sentences. Contextual and distributional analyses of the material from authentic sources enabled to characterize the range and degree of their paradigmatic and syntagmatic interaction. /* Style Definitions */ table.MsoNormalTable {mso-style-name:"Обычная таблица"; mso-tstyle-rowband-size:0; mso-tstyle-colband-size:0; mso-style-noshow:yes; mso-style-priority:99; mso-style-qformat:yes; mso-style-parent:""; mso-padding-alt:0cm 5.4pt 0cm 5.4pt; mso-para-margin:0cm; mso-para-margin-bottom:.0001pt; mso-pagination:widow-orphan; font-size:11.0pt; font-family:"Calibri","sans-serif"; mso-ascii-font-family:Calibri; mso-ascii-theme-font:minor-latin; mso-fareast-font-family:"Times New Roman"; mso-fareast-theme-font:minor-fareast; mso-hansi-font-family:Calibri; mso-hansi-theme-font:minor-latin; mso-bidi-font-family:"Times New Roman"; mso-bidi-theme-font:minor-bidi;}

  16. Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Meyer, M.A.

    2007-07-12

    This thesis provides a methodology for the investigation of electromigration (EM) in Cu-based interconnects. An experimental framework based on in-situ scanning electron microscopy (SEM) investigations was developed for that purpose. It is capable to visualize the EM-induced void formation and evolution in multi-level test structures in real time. Different types of interconnects were investigated. Furthermore, stressed and unstressed samples were studied applying advanced physical analysis techniques in order to obtain additional information about the microstructure of the interconnects as well as interfaces and grain boundaries. These data were correlated to the observed degradation phenomena. Correlations of the experimental results to recently established theoretical models were highlighted. Three types of Cu-based interconnects were studied. Pure Cu interconnects were compared to Al-alloyed (CuAl) and CoWP-coated interconnects. The latter two represent potential approaches that address EM-related reliability concerns. It was found that in such interconnects the dominant diffusion path is no longer the Cu/capping layer interface for interconnects as in pure Cu interconnects. Instead, void nucleation occurs at the bottom Cu/barrier interface with significant effects from grain boundaries. Moreover, the in-situ investigations revealed that the initial void nucleation does not occur at the cathode end of the lines but several micrometers away from it. The mean times-to-failure of CuAl and CoWP-coated interconnects were increased by at least one order of magnitude compared to Cu interconnects. The improvements were attributed to the presence of foreign metal atoms at the Cu/capping layer interface. Post-mortem EBSD investigations were used to reveal the microstructure of the tested samples. The data were correlated to the in-situ observations. (orig.)

  17. A model-based prognostic approach to predict interconnect failure using impedance analysis

    Energy Technology Data Exchange (ETDEWEB)

    Kwon, Dae Il; Yoon, Jeong Ah [Dept. of System Design and Control Engineering. Ulsan National Institute of Science and Technology, Ulsan (Korea, Republic of)

    2016-10-15

    The reliability of electronic assemblies is largely affected by the health of interconnects, such as solder joints, which provide mechanical, electrical and thermal connections between circuit components. During field lifecycle conditions, interconnects are often subjected to a DC open circuit, one of the most common interconnect failure modes, due to cracking. An interconnect damaged by cracking is sometimes extremely hard to detect when it is a part of a daisy-chain structure, neighboring with other healthy interconnects that have not yet cracked. This cracked interconnect may seem to provide a good electrical contact due to the compressive load applied by the neighboring healthy interconnects, but it can cause the occasional loss of electrical continuity under operational and environmental loading conditions in field applications. Thus, cracked interconnects can lead to the intermittent failure of electronic assemblies and eventually to permanent failure of the product or the system. This paper introduces a model-based prognostic approach to quantitatively detect and predict interconnect failure using impedance analysis and particle filtering. Impedance analysis was previously reported as a sensitive means of detecting incipient changes at the surface of interconnects, such as cracking, based on the continuous monitoring of RF impedance. To predict the time to failure, particle filtering was used as a prognostic approach using the Paris model to address the fatigue crack growth. To validate this approach, mechanical fatigue tests were conducted with continuous monitoring of RF impedance while degrading the solder joints under test due to fatigue cracking. The test results showed the RF impedance consistently increased as the solder joints were degraded due to the growth of cracks, and particle filtering predicted the time to failure of the interconnects similarly to their actual timesto- failure based on the early sensitivity of RF impedance.

  18. Ceria based protective coatings for steel interconnects prepared by spray pyrolysis

    DEFF Research Database (Denmark)

    Szymczewska, Dagmara; Molin, Sebastian; Chen, Ming

    2014-01-01

    Stainless steels can be used in solid oxide fuel/electrolysis stacks as interconnects. For successful long term operation they require protective coatings, that lower the corrosion rate and block chemical reactions between the interconnect and adjacent layers of the oxygen or the hydrogen electrode...

  19. 14 CFR 26.11 - Electrical wiring interconnection systems (EWIS) maintenance program.

    Science.gov (United States)

    2010-01-01

    ... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Electrical wiring interconnection systems (EWIS) maintenance program. 26.11 Section 26.11 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION... AIRPLANES Enhanced Airworthiness Program for Airplane Systems § 26.11 Electrical wiring interconnection...

  20. One-step fabrication of microfluidic chips with in-plane, adhesive-free interconnections

    DEFF Research Database (Denmark)

    Sabourin, David; Dufva, Martin; Jensen, Thomas Glasdam

    2010-01-01

    A simple method for creating interconnections to a common microfluidic device material, poly(methyl methacrylate) (PMMA), is presented. A press-fit interconnection is created between oversized, deformable tubing and complementary, undersized semi-circular ports fabricated into PMMA bonding surfaces...

  1. Reliable, Low Cost Distributed Generator/Utility System Interconnect: 2001 Annual Report

    Energy Technology Data Exchange (ETDEWEB)

    2003-08-01

    This report details a research program to develop requirements that support the definition, design, and demonstration of a distributed generation-electric power system interconnection interface concept that allows distributed generation to be interconnected to the electric power system in a manner that provides value to end users without compromising reliability and performance.

  2. 76 FR 42534 - Mandatory Reliability Standards for Interconnection Reliability Operating Limits; System...

    Science.gov (United States)

    2011-07-19

    ... Reliability Operating Limits; System Restoration Reliability Standards AGENCY: Federal Energy Regulatory... data necessary to analyze and monitor Interconnection Reliability Operating Limits (IROL) within its... Interconnection Reliability Operating Limits, Order No. 748, 134 FERC ] 61,213 (2011). \\2\\ The term ``Wide-Area...

  3. Technology alternatives towards low-cost and high-speed interconnect manufacturing

    NARCIS (Netherlands)

    Roozeboom, F.; Kniknie, B.; Lankhorst, A.M.; Winands, G.; Poodt, P.; Dingemans, G.; Keuning, W.; Kessels, W.M.M.; Bullema, J.E.; Bressers, P.M.M.C.; Oosterhuis, G.; Mueller, M.; Huis in 't Veld, Bert

    2012-01-01

    In this work we will review our recent work on novel alternative and disruptive technology concepts with industrial potential for cost-effective and high-speed interconnect manufacturing, in particular on the creation (drilling and filling) of advanced interconnects like TSVs. These technologies are

  4. Preparation of self-supporting mesostructured silica thin film membranes as gateable interconnects for microfluidics

    NARCIS (Netherlands)

    Garcia Juez, R.; Boffa, V.; Blank, David H.A.; ten Elshof, Johan E.

    2008-01-01

    A methodology for the preparation of self-standing 100–200 nm thick mesoporous silica membrane interconnects is reported. Interconnects may become an important component in future microfluidic device technology since it allows extension of microfluidic architectures into the third dimension. The

  5. 77 FR 6549 - Notice of Availability for Public Comment of Interconnection Facilities Studies Prepared for the...

    Science.gov (United States)

    2012-02-08

    .... DOE hereby announces the availability for public comment of the Interconnection Studies prepared for... availability for public comment of the Interconnection Facilities Studies prepared as part of the application... DEPARTMENT OF ENERGY [OE Docket No. PP-334] Notice of Availability for Public Comment of...

  6. Energy conservation through the implementation of cogeneration and grid interconnection

    International Nuclear Information System (INIS)

    Dashash, M. A.

    2007-01-01

    With increasing awareness of energy conservation and environmental protection, the Arab World is moving to further improve energy conversion efficiency. The equivalent of over 2.7 MM bbl is being daily burnt to fuel the thermal power plants that represent 92% of the total Arab power generation. This adds up to close to one billion barrels annually. At a conservative 30$ per barrel, this represents a daily cost of over $81 Million. This paper will introduce two strategies with the ultimate objective to cut-off up to half of the current fuel consumption. Firstly, Cogeneration Technology is able to improve thermal efficiency from the current average of less than 25% to up to 80%. Just 1% improvement in power plant thermal efficiency represents 3 million $/day in fuel cost savings. In addition, a well-designed and operated cogeneration plant will: - Reduce unfriendly emissions by burning less fuel as a result of higher thermal efficiency, - Increase the decentralization of electrical generation, - Improve the reliability of electricity supply. As an example, the Kingdom of Saudi Arabia's experience of implementing cogeneration will be presented, in particular within its hydrocarbon facilities and desalination plants. This will include the existing facilities and the planned and on-going projects. Secondly, by interconnecting the power networks of all the adjacent Arab countries, the following benefits could be reached: - Reduce generation reserves and enhance the system reliability, - Improve the economic efficiency of the electricity power systems, - Provide power exchange and strengthen the supply reliability, - Adopt technological development and use the best modern technologies. At least two factors plead for this direction. On one hand, the four-hour time zone difference from Eastern to Western Arab World makes it easy to exchange power. On the other hand, this will help to reduce the reserve capacity and save on corresponding Capital investment, fuel, and O and M

  7. Ultra-low energy photoreceivers for optical interconnects

    Science.gov (United States)

    Going, Ryan Wayne

    Optical interconnects are increasingly important for our communication and data center systems, and are forecasted to be an essential component of future computers. In order to meet these future demands, optical interconnects must be improved to consume less power than they do today. To do this, both more efficient transmitters and more sensitive receivers must be developed. This work addresses the latter, focusing on device level improvements to tightly couple a low capacitance photodiode with the first stage transistor of the receiver as a single phototransistor device. First I motivate the need for a coupled phototransistor using a simple circuit model which shows how receiver sensitivity is determined by photodiode capacitance and the length of wire connecting it to the first transistor in a receiver amplifier. Then I describe our use of the unique rapid melt growth technique, which is used to integrate crystalline germanium on silicon photonics substrates without an epitaxial reactor. The resulting material quality is demonstrated with high quality (0.95 A/W, 40+ GHz) germanium photodiodes on silicon waveguides. Next I describe two germanium phototransistors I have developed. One is a germanium- gated MOSFET on silicon photonics which has up to 18 A/W gate-controlled responsivity at 1550 nm. Simulations show how MOSFET scaling rules can be easily applied to increase both speed and sensitivity. The second is a floating base germanium bipolar phototransistor on silicon photonics with a 15 GHz gain x bandwidth product. The photoBJT also has a clear scaling path, and it is proposed to create a separate gain and absorption region photoBJT to realize the maximum benefit of scaling the BJT without negatively affecting its absorption and photocarrier collection. Following this design a 120 GHz gain x bandwidth photoBJT is simulated. Finally I present a metal-cavity, which can have over 50% quantum efficiency absorption in sub-100 aF germanium photodiodes, which

  8. Thermo-electric Analysis of the Interconnection of the LHC main Superconducting Bus Bars

    CERN Document Server

    Granieri, P P; Casali, M; Bottura, L; Siemko, A

    2013-01-01

    Spurred by the question of the maximum allowable energy for the operation of the Large Hadron Collider (LHC), we have progressed in the understanding of the thermo-electric behavior of the 13 kA superconducting bus bars interconnecting its main magnets. A deep insight of the underlying mechanisms is required to ensure the protection of the accelerator against undesired effects of resistive transitions. This is especially important in case of defective interconnections which can jeopardize the operation of the whole LHC. In this paper we present a numerical model of the interconnections between the main dipole and quadrupole magnets, validated against experimental tests of an interconnection sample with a purposely built-in defect. We consider defective interconnections featuring a lack of bonding among the superconducting cables and the copper stabilizer components, such as those that could be present in the machine. We evaluate the critical defect length limiting the maximum allowable current for powering th...

  9. Physically Based Simulation of Electromigration-Induced Degradation of Inlaid Copper Interconnects

    International Nuclear Information System (INIS)

    Sukharev, Valeriy

    2004-01-01

    A novel physical model and a simulation algorithm capable of predicting electromigration (EM) induced void nucleation and growth in an arbitrary interconnect segment have been developed. EM-induced void nucleation and growth in dual damascene (DD) copper interconnect structures have been predicted with a developed physical model and a simulation algorithm. The incorporation of all important contributions to directed atom migration into the mass balance equation and its solution together with the solution of the corresponding electromagnetics, heat transfer and elasticity problems, in a coupled manner, allows to simulate EM-induced degradation in dual-inlaid copper interconnect segments characterized by different dominant channels for EM-induced mass transport. Model provides a capability for the EM design rules generation/optimization with the physically based simulations. A simulation-based optimization of interconnect architecture, segment geometry, material properties and some of the process parameters can generate on-chip interconnect systems with a high immunity to EM-induced failures

  10. Anisotropy of low dielectric constant materials and reliability of copper/low-k interconnects

    Science.gov (United States)

    Cho, Taiheui

    2000-10-01

    Cu/low-k material interconnects are a solution to overcome problems that occur in deep submicron Al/SiO2 based interconnects. Several challenges have to be resolved before successfully integrating copper and low-k dielectric materials into interconnects. In this work, Cu and several low-k polymers were used for interconnect applications and their effects on interconnect performance were investigated. Dielectric anisotropy is one of the factors that affect interconnect performance. Two fluorinated polymers, a rigid rod-like polyimide (Dupont FPI-136M) and a flexible poly(aryl ether) (Allied Signal FLARE 1.51) were used to investigate the relationship between dielectric anisotropy and molecular orientation. The dielectric anisotropy of the rigid rod-like polyimide was reduced relative to that in blanket films when it was confined in submicron trenches. Such a reduction was not observed in the flexible polymer. Polarized FTIR experiments showed that when rigid rod-like polymer was confined in submicron trenches polymer chains preferentially oriented parallel to metal lines. The preferential orientation reduced the in-plane dielectric constant of the polymer. A barrier layer has to be used to prevent Cu diffusion into an interlayer dielectric material. Ta, TaN, and TaSiN were used to investigate the relationship between barrier capability and microstructures using a bias temperature stress. TaSiN performed best because TaSiN was amorphous, followed by TaN then Ta because TaN had impurities segregated in grain boundaries. When Cu/BCB interconnects were fabricated and their reliability was investigated with the bias temperature stress, some of the interconnect structures performed properly and their life times were comparable to those of Cu/SiO2 interconnects, while other interconnect structures rapidly failed because the Cu readily diffused through defects in the barrier. The defects were introduced during chemical-mechanical polishing and plasma etching processes.

  11. Cross-border versus cross-sector interconnectivity in renewable energy systems

    International Nuclear Information System (INIS)

    Thellufsen, Jakob Zinck; Lund, Henrik

    2017-01-01

    In the transition to renewable energy systems, fluctuating renewable energy, such as wind and solar power, plays a large and important role. This creates a challenge in terms of meeting demands, as the energy production fluctuates based on weather patterns. To utilise high amounts of fluctuating renewable energy, the energy system has to be more flexible in terms of decoupling demand and production. This paper investigates two potential ways to increase flexibility. The first is the interconnection between energy systems, for instance between two countries, labelled as cross-border interconnection, and the second is cross-sector interconnection, i.e., the integration between different parts of an energy system, for instance heat and electricity. This paper seeks to compare the types of interconnectivity and discuss to which extent they are mutually beneficial. To do this, the study investigates two energy systems that represent Northern and Southern Europe. Both systems go through three developmental steps that increase the cross-sector interconnectivity. At each developmental step an increasing level of transmission capacities is examined to identify the benefits of cross-border interconnectivity. The results show that while both measures increase the system utilisation of renewable energy and the system efficiency, the cross-sector interconnection gives the best system performance. To analyse the possible interaction between cross-sector and cross-border interconnectivity, two main aspects have to be clarified. The first part defines the approach and the second is the construction of the two archetypes. - Highlights: • A method to investigate system integration and system interconnection is suggested. • The implementation is investigated across a Northern and Southern energy system. • The study identifies benefits of system integration and system interconnection. • The performance of the energy system benefits most from system integration.

  12. An efficient network for interconnecting remote monitoring instruments and computers

    International Nuclear Information System (INIS)

    Halbig, J.K.; Gainer, K.E.; Klosterbuer, S.F.

    1994-01-01

    Remote monitoring instrumentation must be connected with computers and other instruments. The cost and intrusiveness of installing cables in new and existing plants presents problems for the facility and the International Atomic Energy Agency (IAEA). The authors have tested a network that could accomplish this interconnection using mass-produced commercial components developed for use in industrial applications. Unlike components in the hardware of most networks, the components--manufactured and distributed in North America, Europe, and Asia--lend themselves to small and low-powered applications. The heart of the network is a chip with three microprocessors and proprietary network software contained in Read Only Memory. In addition to all nonuser levels of protocol, the software also contains message authentication capabilities. This chip can be interfaced to a variety of transmission media, for example, RS-485 lines, fiber topic cables, rf waves, and standard ac power lines. The use of power lines as the transmission medium in a facility could significantly reduce cabling costs

  13. Geothermal Power and Interconnection: The Economics of Getting to Market

    Energy Technology Data Exchange (ETDEWEB)

    Hurlbut, David [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2012-04-23

    This report provides a baseline description of the transmission issues affecting geothermal technologies. It is intended for geothermal experts in either the private or public sector who are less familiar with how the electricity system operates beyond the geothermal plant. The report begins with a comprehensive overview of the grid, how it is planned, how it is used, and how it is paid for. The report then overlays onto this "big picture" three types of geothermal technologies: conventional hydrothermal systems; emerging technologies such as enhanced engineered geothermal systems (EGS) and geopressured geothermal; and geothermal co-production with existing oil and gas wells. Each category of geothermal technology has its own set of interconnection issues, and these are examined separately for each. The report draws conclusions about each technology’s market affinities as defined by factors related to transmission and distribution infrastructure. It finishes with an assessment of selected markets with known geothermal potential, identifying those that offer the best prospects for near-term commercial development and for demonstration projects.

  14. Laser welding of copper and aluminium battery interconnections

    Science.gov (United States)

    De Bono, Paola; Blackburn, Jon

    2015-07-01

    The adoption of lithium-ion and/or super-capacitor battery technologies is a current hot topic in the automotive industry. For both battery types, the terminals and busbars are manufactured from copper (Cu) and/or aluminium-based (Al-based) alloys, as a result of their high electrical and thermal conductivities. Laser welding is considered an attractive process to industry due to its easy automotability, high processing speed and highly repeatable cost-effective processing. However, laser welding of Cu-Cu and Al-Al joints presents several difficulties due to the high surface reflectivity at infrared (IR) wavelengths. This behaviour becomes even more critical when processing thin sheets and foils.This paper summarises recent work performed to develop laser welding techniques suitable for monometallic joining of Cu-Cu and Al-Al electrical interconnections. Laser welding of multiple overlapped foils (with thickness in the range of 17μm-100μm) were investigated.

  15. RapidIO as a multi-purpose interconnect

    Science.gov (United States)

    Baymani, Simaolhoda; Alexopoulos, Konstantinos; Valat, Sébastien

    2017-10-01

    RapidIO (http://rapidio.org/) technology is a packet-switched high-performance fabric, which has been under active development since 1997. Originally meant to be a front side bus, it developed into a system level interconnect which is today used in all 4G/LTE base stations world wide. RapidIO is often used in embedded systems that require high reliability, low latency and scalability in a heterogeneous environment - features that are highly interesting for several use cases, such as data analytics and data acquisition (DAQ) networks. We will present the results of evaluating RapidIO in a data analytics environment, from setup to benchmark. Specifically, we will share the experience of running ROOT and Hadoop on top of RapidIO. To demonstrate the multi-purpose characteristics of RapidIO, we will also present the results of investigating RapidIO as a technology for high-speed DAQ networks using a generic multi-protocol event-building emulation tool. In addition we will present lessons learned from implementing native ports of CERN applications to RapidIO.

  16. Biwavelength transceiver module for parallel simultaneous bidirectional optical interconnections

    Science.gov (United States)

    Nguyen, Nga T. H.; Ukaegbu, Ikechi A.; Sangirov, Jamshid; Cho, Mu-Hee; Lee, Tae-Woo; Park, Hyo-Hoon

    2013-12-01

    The design of a biwavelength transceiver (TRx) module for parallel simultaneous bidirectional optical interconnects is described. The TRx module has been implemented using two different wavelengths, 850 and 1060 nm, to send and receive signals simultaneously through a common optical interface while optimizing cost and performance. Filtering mirrors are formed in the optical fibers which are embedded on a V-grooved silicon substrate for reflecting and filtering optical signals from/to vertical-cavity surface-emitting laser (VCSEL)/photodiode (PD). The VCSEL and PD are flip-chip bonded on individual silicon optical benches, which are attached on the silicon substrate for optical signal coupling from the VCSEL to fiber and from fiber to the PD. A high-speed and low-loss ceramic printed circuit board, which has a compact size of 0.033 cc, has been designed to carry transmitter and receiver chips for easy packaging of the TRx module. Applied for quad small form-factor pluggable applications at 40-Gbps operation, the four-channel biwavelength TRx module showed clear eye diagrams with a bit error rate (BER) of 10-12 at input powers of -5 and -5.8 dBm for 1060 and 850 nm operation modes, respectively.

  17. Pulsed laser planarization of metal films for multilevel interconnects

    International Nuclear Information System (INIS)

    Tuckerman, D.B.; Schmitt, R.L.

    1985-05-01

    Multilevel interconnect schemes for integrated circuits generally require one or more planarization steps, in order to maintain an acceptably flat topography for lithography and thin-film step coverage on the higher levels. Traditional approaches have involved planarization of the interlevel insulation (dielectric) layers, either by spin-on application (e.g., polyimide), or by reflow (e.g., phosphosilicate glass). We have pursued an alternative approach, in which each metal level is melted (hence planarized) using a pulsed laser prior to patterning. Short (approx.1 μs) pulses are used to preclude undesirable metallurgical reactions between the film, adhesion or barrier layer, and dielectric layer. Laser planarization of metals is particularly well suited to multilevel systems which include ground or power planes. Results are presented for planarization of gold films on SiO 2 dielectric layers using a flashlamp-pumped dye laser. The pulse duration is approx.1 μs, which allows the heat pulse to uniformly penetrate the gold while not penetrating substantially through the underlying SiO 2 (hence not perturbing the lower levels of metal). Excellent planarization of the gold films is achieved (less than 0.1 μm surface roughness, even starting with extreme topographic variations), as well as improved conductivity. To demonstrate the process, numerous planarized two-layer structures (transmission lines under a ground plane) were fabricated and characterized. 9 refs., 2 figs

  18. Environmental benefits of electricity grid interconnections in Northeast Asia

    International Nuclear Information System (INIS)

    Streets, D.G.

    2003-01-01

    From an environmental perspective, electricity grid interconnections in Northeast Asia make sense. Cities in Northeast China, Mongolia, the Democratic People's Republic of Korea (DPRK), and the Republic of Korea (ROK) suffer from poor air quality due to the extensive use of coal-fired power generation. Rural communities suffer from a deficit of electricity, forcing reliance on coal and biofuels for cooking and heating in the home, which causes health-damaging indoor air pollution. Regional air pollution from acid rain and ozone is widespread. In addition, Japan is finding it hard to meet its commitment under the Kyoto Protocol. Yet, just across their borders in far eastern Russia are extensive, clean energy resources: hydroelectricity and natural gas, and (potentially) nuclear power and tidal power. It would be environmentally beneficial to generate electricity cleanly in far eastern Russia and transmit the electricity across the borders into China, Mongolia, the DPRK, the ROK, and Japan, thereby displacing coal-fired electricity generation. We estimate that currently planned projects could alleviate the problems of two to five Chinese cities, with the potential for much larger benefits in the future. (author)

  19. Assessment of Industrial Load for Demand Response across Western Interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Alkadi, Nasr E [ORNL; Starke, Michael R [ORNL; Ma, Ookie [United States Department of Energy (DOE), Office of Efficiency and Renewable Energy (EERE)

    2013-11-01

    Demand response (DR) has the ability to both increase power grid reliability and potentially reduce operating system costs. Understanding the role of demand response in grid modeling has been difficult due to complex nature of the load characteristics compared to the modeled generation and the variation in load types. This is particularly true of industrial loads, where hundreds of different industries exist with varying availability for demand response. We present a framework considering industrial loads for the development of availability profiles that can provide more regional understanding and can be inserted into analysis software for further study. The developed framework utilizes a number of different informational resources, algorithms, and real-world measurements to perform a bottom-up approach in the development of a new database with representation of the potential demand response resource in the industrial sector across the U.S. This tool houses statistical values of energy and demand response (DR) potential by industrial plant and geospatially locates the information for aggregation for different territories without proprietary information. This report will discuss this framework and the analyzed quantities of demand response for Western Interconnect (WI) in support of evaluation of the cost production modeling with power grid modeling efforts of demand response.

  20. Financial Economy and Financial System: Basis of Structural Interconnection

    Directory of Open Access Journals (Sweden)

    Khorosheva Olena I.

    2014-02-01

    Full Text Available The goal of the article lies in identification of grounds of interconnection of the financial economy and financial system. The study was conducted with consideration of main provisions of the theory of finance and concept of financial economy, which is a set of means used in the process of reproduction of finance by their owner for formation and / or maintenance of the own system of values in the viable state. For the first time ever the structure of the financial system is identified as an aggregate of financial economies and financial market. The article justifies a necessity of expansion of boundaries of perception of the state financial economy, which is offered to include public financial economy of the state level and the set of financial economies of the state as a subject of economic activity. Such an approach forms a base for justification of the synthesis of participation of the state in financial relations as the owner and as the basic macro-economic regulator. Prospects of further study in this direction are: development of classification of financial economies; revelation of specific features of impact of shadow finance on development of the national financial economy; and assessment of possibilities of inclusion of structured financial products into the system of values of financial economies in Ukraine.

  1. Interconnect-integrated solid oxide fuel cell with high temperature sinter-joining process

    Energy Technology Data Exchange (ETDEWEB)

    Baek, Seung-Wook [KAIST Institute (KI) for Eco-Energy, Korea Advanced Institute of Science and Technology (KAIST), 373-1 Guseong-Dong, Yuseong-Gu, Daejeon 305-701 (Korea); Jeong, Jihoon; Bae, Joongmyeon [Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 373-1 Guseong-Dong, Yuseong-Gu, Daejeon 305-701 (Korea); Kim, Jung Hyun [School of Chemistry, University of St. Andrews, Fife KY16 9ST (United Kingdom); Lee, Changbo [SAMSUNG Electro-Mechanics Co., 314 Maetan-3-Dong, Yeongtong-Gu, Suwon (Korea)

    2010-11-15

    In this study, a recently developed interconnect-integrated solid oxide fuel cell (SOFC) is characterized in terms of cell components, cell area enlargement, potential cathode material and mechanical/electrochemical properties. First, a high temperature sinter-joining process is used to fabricate an interconnect-integrated SOFC. This manuscript describes the interconnect material and the slurry composition design for bonding the interconnect and ceramic cell. The oxidation and thermal expansion characteristics of the starting materials of the interconnect-integrated cell, including the interconnect, metal powder of the bonding layer and metal powder/8YSZ/NiO compositions, are investigated to enhance both cell joining performance and cell stability during operation. Cell area enlargements of 50 mm x 50 mm and 100 mm x 100 mm are successfully realized using the optimized cell processing conditions. The cathode of the interconnect-integrated cell cannot be sintered in an air atmosphere due to the oxidation of the interconnect. Accordingly, a Sm{sub 1.0}Ba{sub 0.5}Sr{sub 0.5}Co{sub 2.0}O{sub 5-d}/Gd{sub 0.1}Ce{sub 0.9}O{sub 1.9} (50:50 wt%) (SBSCO50) composite cathode is selected and used as the potential in situ cathode for the interconnect-integrated SOFC. The in situ sintering properties of a conventional LSM82/8YSZ(6:4) composite cathode is also studied as the reference material. The mechanical and electrochemical performance of the resulting interconnect-integrated cell is tested. The mechanical strengths of the anode-supported cell and the interconnect-integrated cell are compared, and the electrochemical properties of the interconnect-integrated button cell and the large area (50 mm x 50 mm) interconnect-integrated cell are investigated. The button cell of a SBSCO50 composite cathode exhibits a maximum power density of 0.57 W cm{sup -2} at 800 C. The large area single repeat unit with an area of 50 mm x 50 mm with a SBSCO50 in situ cathode exhibits a maximum

  2. The structure of pumice by neutron diffraction

    International Nuclear Information System (INIS)

    Floriano, M.A.; Venezia, A.M.; Deganello, G.; Svensson, E.C.; Root, J.H.

    1994-01-01

    Small-angle neutron scattering (SANS) and wide-angle neutron scattering (WANS) measurements on pumice, an amorphous natural aluminosilicate used as support for metals in the preparation of catalysts, are reported. The SANS spectrum indicates the presence of a broad size distribution of pores and the absence of volume fractality. Surface fractality, however, cannot be ruled out. The structure of pumice, suggested by the pair-correlation function derived from the WANS spectrum and simulated by a random-network structure model, is very similar to that of vitreous silica, consisting mainly of SiO 4- 4 tetrahedra interconnected by bridging O atoms with additional local disorder generated by the replacement, on average, of one in ten Si atoms by aluminium. (orig.)

  3. Determining optimal interconnection capacity on the basis of hourly demand and supply functions of electricity

    International Nuclear Information System (INIS)

    Keppler, Jan Horst; Meunier, William; Coquentin, Alexandre

    2017-01-01

    Interconnections for cross-border electricity flows are at the heart of the project to create a common European electricity market. At the time, increase in production from variable renewables clustered during a limited numbers of hours reduces the availability of existing transport infrastructures. This calls for higher levels of optimal interconnection capacity than in the past. In complement to existing scenario-building exercises such as the TYNDP that respond to the challenge of determining optimal levels of infrastructure provision, the present paper proposes a new empirically-based methodology to perform Cost-Benefit analysis for the determination of optimal interconnection capacity, using as an example the French-German cross-border trade. Using a very fine dataset of hourly supply and demand curves (aggregated auction curves) for the year 2014 from the EPEX Spot market, it constructs linearized net export (NEC) and net import demand curves (NIDC) for both countries. This allows assessing hour by hour the welfare impacts for incremental increases in interconnection capacity. Summing these welfare increases over the 8 760 hours of the year, this provides the annual total for each step increase of interconnection capacity. Confronting welfare benefits with the annual cost of augmenting interconnection capacity indicated the socially optimal increase in interconnection capacity between France and Germany on the basis of empirical market micro-data. (authors)

  4. The effect of long-distance interconnection on wind power variability

    International Nuclear Information System (INIS)

    Fertig, Emily; Apt, Jay; Jaramillo, Paulina; Katzenstein, Warren

    2012-01-01

    We use time- and frequency-domain techniques to quantify the extent to which long-distance interconnection of wind plants in the United States would reduce the variability of wind power output. Previous work has shown that interconnection of just a few wind plants across moderate distances could greatly reduce the ratio of fast- to slow-ramping generators in the balancing portfolio. We find that interconnection of aggregate regional wind plants would not reduce this ratio further but would reduce variability at all frequencies examined. Further, interconnection of just a few wind plants reduces the average hourly change in power output, but interconnection across regions provides little further reduction. Interconnection also reduces the magnitude of low-probability step changes and doubles firm power output (capacity available at least 92% of the time) compared with a single region. First-order analysis indicates that balancing wind and providing firm power with local natural gas turbines would be more cost-effective than with transmission interconnection. For net load, increased wind capacity would require more balancing resources but in the same proportions by frequency as currently, justifying the practice of treating wind as negative load. (letter)

  5. Welfare and competition effects of electricity interconnection between Ireland and Great Britain

    International Nuclear Information System (INIS)

    Malaguzzi Valeri, Laura

    2009-01-01

    This study analyzes the effects of additional interconnection on welfare and competition in the Irish electricity market. I simulate the wholesale electricity markets of the island of Ireland and Great Britain for 2005. I find that in order for the two markets to be integrated in 2005, additional interconnection would have to be large. The amount of interconnection decreases for high costs of carbon, since this causes the markets to become more similar. This suggests that in the absence of strategic behavior of firms, most of the gains from trade derive not from differences in size between countries, but from technology differences and are strongly influenced by fuel and carbon costs. Social welfare increases with interconnection, although at a decreasing rate. As the amount of interconnection increases, there are also positive effects on competition in Ireland, the less competitive of the two markets. Finally, it is unlikely that private investors will pay for the optimal amount of interconnection since their returns are significantly smaller than the total social benefit of interconnection. (author)

  6. Religion, Science, and Culture: An Integrated, Interconnected Paradigm of Science

    Directory of Open Access Journals (Sweden)

    M. Amin Abdullah

    2015-04-01

    Full Text Available Discussing the paradigm of dialogue and integration in the Islamic science of religion is important since the practice of religious education still applies the paradigm of conflict and independence. These paradigms have a great influence on the formation of socio-religious and cultural ways of thinking. The relationship between Islamic religiousc and natural, social, as well as cultural sciences, needs patterns of integrated, interconnected relations and dialogues. Islamic Studies requires a multidisciplinary approach, that is, interdisciplinarity and transdisciplinarity. Scientific linearity, in which science is narrowly defined and mono-disciplinary, will lead to an understanding of religion and religious interpretations that has no contact with and relevance to the context in which it is studied. New types of religious thought that encourage independent discussion and dialogue on the subjective, objective and intersubjective aspects of science and religion will create the emergence of a new type of religiosity in the multicultural era. All of this requires more effort to undertake a serious reconstruction of scientific methodologies and the methodologies of scientific studies of religion.[Penerapan paradigma dialog dan integrasi dalam ilmu-ilmu keislaman masih penting untuk didiskusikan mengingat praktik pendidikan agama masih menerapkan paradigm konflik dan independen. Paradigma-paradigma ini memiliki pengaruh yang besar dalam pembentukan cara pandang keagamaan, baik sosial maupun kultural. Hubungan antara ilmu-ilmu keislaman di satu sisi dengan ilmu-ilmu alam, sosial, dan budaya di sisi lain, memerlukan pola hubungan dan dialog yang terintegrasi-interkoneksi. Studi Islam mensyaratkan pendekatan multi disiplin, baik interdisipliner maupun transdisipliner. Linearitas keilmuan yang membatasi bidang ilmu secara sempit dan mono-disiplin akan menggiring pemahaman agama dan tafsir keagamaan yang tidak terkait dan tidak relevan dengan konteks

  7. Agent-Based Simulation for Interconnection-Scale Renewable Integration and Demand Response Studies

    Directory of Open Access Journals (Sweden)

    David P. Chassin

    2015-12-01

    Full Text Available This paper collects and synthesizes the technical requirements, implementation, and validation methods for quasi-steady agent-based simulations of interconnection-scale models with particular attention to the integration of renewable generation and controllable loads. Approaches for modeling aggregated controllable loads are presented and placed in the same control and economic modeling framework as generation resources for interconnection planning studies. Model performance is examined with system parameters that are typical for an interconnection approximately the size of the Western Electricity Coordinating Council (WECC and a control area about 1/100 the size of the system. These results are used to demonstrate and validate the methods presented.

  8. Lateral buckling and mechanical stretchability of fractal interconnects partially bonded onto an elastomeric substrate

    International Nuclear Information System (INIS)

    Fu, Haoran; Xu, Sheng; Rogers, John A.; Xu, Renxiao; Huang, Yonggang; Jiang, Jianqun; Zhang, Yihui

    2015-01-01

    Fractal-inspired designs for interconnects that join rigid, functional devices can ensure mechanical integrity in stretchable electronic systems under extreme deformations. The bonding configuration of such interconnects with the elastomer substrate is crucial to the resulting deformation modes, and therefore the stretchability of the entire system. In this study, both theoretical and experimental analyses are performed for postbuckling of fractal serpentine interconnects partially bonded to the substrate. The deformation behaviors and the elastic stretchability of such systems are systematically explored, and compared to counterparts that are not bonded at all to the substrate

  9. Abnormal contact resistance reduction of bonded copper interconnects in three-dimensional integration during current stressing

    Science.gov (United States)

    Chen, K. N.; Tan, C. S.; Fan, A.; Reif, R.

    2005-01-01

    Bonded copper interconnects were stressed with current to measure the specific contact resistance. For bonded copper interconnects without a prebonding HCl clean, the corresponding specific contact resistance did not change while increasing the stress current. However, for some interconnects with the prebonding HCl clean, an abnormal contact resistance reduction was observed during the increase of the stress current. The rise of temperature at the bonding interface area due to Joule heating under high current density may have caused the decrease of contact resistance. This behavior may be one option for quality enhancement in 3D integration at low temperature.

  10. Modeling of Ni Diffusion Induced Austenite Formation in Ferritic Stainless Steel Interconnects

    DEFF Research Database (Denmark)

    Chen, Ming; Alimadadi, Hossein; Molin, Sebastian

    2017-01-01

    Ferritic stainless steel interconnect plates are widely used in planar solid oxide fuel cell and electrolysis cell stacks. During stack production and operation, nickel from the Ni/yttria stabilized zirconia fuel electrode or from the Ni contact component layer diffuses into the interconnect plate......, causing transformation of the ferritic phase into an austenitic phase in the interface region. This is accompanied with changes in volume, and in mechanical and corrosion properties of the interconnect plates. In this work, kinetic modeling of the inter-diffusion between Ni and FeCr based ferritic...

  11. Advanced Platform for Development and Evaluation of Grid Interconnection Systems Using Hardware-in-the-Loop: Part III - Grid Interconnection System Evaluator

    Energy Technology Data Exchange (ETDEWEB)

    Lundstrom, B.; Shirazi, M.; Coddington, M.; Kroposki, B.

    2013-01-01

    This paper describes a Grid Interconnection System Evaluator (GISE) that leverages hardware-in-the-loop (HIL) simulation techniques to rapidly evaluate the grid interconnection standard conformance of an ICS according to the procedures in IEEE Std 1547.1. The architecture and test sequencing of this evaluation tool, along with a set of representative ICS test results from three different photovoltaic (PV) inverters, are presented. The GISE adds to the National Renewable Energy Laboratory's (NREL) evaluation platform that now allows for rapid development of ICS control algorithms using controller HIL (CHIL) techniques, the ability to test the dc input characteristics of PV-based ICSs through the use of a PV simulator capable of simulating real-world dynamics using power HIL (PHIL), and evaluation of ICS grid interconnection conformance.

  12. Advanced Platform for Development and Evaluation of Grid Interconnection Systems Using Hardware-in-the-Loop: Part III -- Grid Interconnection System Evaluator: Preprint

    Energy Technology Data Exchange (ETDEWEB)

    Lundstrom, B.; Shirazi, M.; Coddington, M.; Kroposki, B.

    2013-01-01

    This paper, presented at the IEEE Green Technologies Conference 2013, describes a Grid Interconnection System Evaluator (GISE) that leverages hardware-in-the-loop (HIL) simulation techniques to rapidly evaluate the grid interconnection standard conformance of an ICS according to the procedures in IEEE Std 1547.1 (TM). The architecture and test sequencing of this evaluation tool, along with a set of representative ICS test results from three different photovoltaic (PV) inverters, are presented. The GISE adds to the National Renewable Energy Laboratory's (NREL) evaluation platform that now allows for rapid development of ICS control algorithms using controller HIL (CHIL) techniques, the ability to test the dc input characteristics of PV-based ICSs through the use of a PV simulator capable of simulating real-world dynamics using power HIL (PHIL), and evaluation of ICS grid interconnection conformance.

  13. Alberta interconnected electric system transmission development plan 2002 - 2011

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2002-03-13

    Alberta's independent Transmission Administrator, ESBI Alberta Ltd., has committed to publish annually an updated 10-year plan for the development of the Alberta Interconnected Electric System transmission grid. This report is its fourth annual publication which provides valuable information for those wishing to enter the power generation market or for those interested in competing for the provision of new transmission facilities. From 2002-2011, peak demand is projected to increase from 8,000 MW to nearly 10,000 MW. Full competition in power generation came into effect in Alberta in 2001. This stimulated interest in developing new generation in the province, particularly in Lake Wabamun, Fort McMurray, and Southern Alberta. It was noted that the existing transmission infrastructure has performed well, but since there has been no major investment since 1985, it is time to seriously consider new major investments into the system in order to continue to provide secure, reliable service. In 2001 ESBI conducted a conceptual study of the transmission infrastructure that would be needed if Alberta were to export its power. This study is being expanded to include power generation additions. The variables are the location of generation additions and the amount of surplus generation available for export. In 2001, more than $200 M worth of transmission reinforcement projects were initiated. The same level of investment is expected in 2002. Close cooperation between the Transmission Administrator and project developers, regulators and government is needed now more than ever because of the deregulation in power generation. The role of ESBI is to continue the stakeholder consultation process that helps to ensure excellence in power transmission in the province. This report reviews 500 kV, 240 kV and 138/144 kV transmission system reinforcements. It presented an economic outlook for Alberta with reference to underlying economic assumptions, oil and natural gas prices, and

  14. Cross-border versus cross-sector interconnectivity in renewable energy systems

    DEFF Research Database (Denmark)

    Thellufsen, Jakob Zinck; Lund, Henrik

    2017-01-01

    In the transition to renewable energy systems, fluctuating renewable energy, such as wind and solar power, plays a large and important role. This creates a challenge in terms of meeting demands, as the energy production fluctuates based on weather patterns. To utilise high amounts of fluctuating...... renewable energy, the energy system has to be more flexible in terms of decoupling demand and production. This paper investigates two potential ways to increase flexibility. The first is the interconnection between energy systems, for instance between two countries, labelled as cross-border interconnection......, and the second is cross-sector interconnection, i.e., the integration between different parts of an energy system, for instance heat and electricity. This paper seeks to compare the types of interconnectivity and discuss to which extent they are mutually beneficial. To do this, the study investigates two energy...

  15. The Application of Free-Space Optical Interconnects to High Performance Communication Decoding

    National Research Council Canada - National Science Library

    Haney, Michael

    1998-01-01

    Development of the "Two-bounce" interconnection concept, that is based on topological transformations, and which minimizes the smart pixel resource required for the Viterbi architecture and has wider...

  16. A Numerical Method for Modeling the Effects of Irregular Shape on Interconnect Resistance

    Science.gov (United States)

    Chen, Bao-Jun; Tang, Zhen-An; Ju, Yan-Jie

    2014-05-01

    When clock frequencies exceed gigahertz, the skin depth in analog and digital circuits greatly decreases. The irregular shape of the cross section of the interconnect plays an increasingly important role in interconnect parasitic extraction. However, existing methods only focus on the rough surface of the interconnect, while ignoring other irregular shapes, such as the trapezoidal cross section. In this work, a new simulation method is proposed for irregular interconnects, which is applicable to arbitrary irregular shapes and to a wide range of frequencies. The method involves generating a mesh information file firstly and then extracting the frequency-dependent resistance based on a numerical solution of scalar wave modeling by using the method of moments. The singularity extraction method is used to calculate the self-inductors. The data from experiments verify the accuracy of our proposed method.

  17. Switching Fabric Based on Multi-Level LVDS Compatible Interconnect, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — Switching fabric (SF) is the key component of the next generation of back plane interconnects. Low power, TID and SEU resistant and high bandwidth upgradeable...

  18. Joint Application Mapping/Interconnect Synthesis Techniques for Embedded Chip-Scale Multiprocessors

    National Research Council Canada - National Science Library

    Bambha, Neal K; Bhattacharyya, Shuvra S

    2005-01-01

    .... In this paper, we present high-level scheduling and interconnect topology synthesis techniques for embedded multiprocessor systems-on-chip that are streamlined for one or more digital signal processing applications...

  19. Phase 2 Report: Oahu Wind Integration and Transmission Study (OWITS); Hawaiian Islands Transmission Interconnection Project

    Energy Technology Data Exchange (ETDEWEB)

    Woodford, D.

    2011-02-01

    This report provides an independent review including an initial evaluation of the technical configuration and capital costs of establishing an undersea cable system and examining impacts to the existing electric transmission systems as a result of interconnecting the islands

  20. Decomposition and Projection Methods for Distributed Robustness Analysis of Interconnected Uncertain Systems

    DEFF Research Database (Denmark)

    Pakazad, Sina Khoshfetrat; Hansson, Anders; Andersen, Martin Skovgaard

    2013-01-01

    We consider a class of convex feasibility problems where the constraints that describe the feasible set are loosely coupled. These problems arise in robust stability analysis of large, weakly interconnected uncertain systems. To facilitate distributed implementation of robust stability analysis...

  1. Superconducting Thin-Film Interconnects for Cryogenic Photon Detector Arrays, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — Advanced imaging spectrometers for x-ray astronomy will require significant improvements in the high density interconnects between the detector arrays and the first...

  2. Optical Interconnects for Smart Antenna Driver-Receiver-Switch System for Wireless Communication

    National Research Council Canada - National Science Library

    Esener, Sadik

    2002-01-01

    ... at 0.3THz-30THz for telecommunication applications in general and for interconnects within the box, in particular, for example for Smart Antenna Driver-Receiver-Switch System for Wireless Communication...

  3. A novel monolithic fabrication method for a plastic microfluidic chip with liquid interconnecting ports

    Science.gov (United States)

    Lee, Bong-Kee; Kwon, Tai Hun

    2010-10-01

    In the present study, a novel monolithic fabrication method was developed for the manufacturing of a plastic microfluidic chip with liquid interconnecting ports. As the present method can realize both interconnecting ports and through holes, which are essential components for the delivery of working fluids, in the plastic microfluidic chip, no additional processes and external ports are required. Furthermore, the connection of external silicone tubing can be simply achieved by utilizing an elastic deformation of the used tubing. As one representative example, a microinjection molding of a prototype microfluidic chip having two types of interconnecting ports was demonstrated. After obtaining upper and lower plates by the microinjection molding process utilizing mold cores with pin structures, the thermal bonding of the molded plates was carried out, resulting in the prototype plastic microfluidic chip with interconnecting ports. From microfluidic experiments using the fabricated prototype, it was found that the present method could be quite useful in various microfluidic applications.

  4. Back-end interconnection. A generic concept for high volume manufacturing

    Energy Technology Data Exchange (ETDEWEB)

    Bosman, J.; Budel, T.; De Kok, C.J.G.M.

    2013-10-15

    The general method to realize series connection in thin film PV modules is monolithical interconnection through a sequence of laser scribes (P1, P2 and P3) and layer depositions. This method however implies that the deposition processes are interrupted several times, an undesirable situation in high volume processing. In order to eliminate this drawback we focus our developments on the so called 'back-end interconnection concept' in which series interconnection takes place AFTER the deposition of the functional layers of the thin film PV device. The process of making a back-end interconnection combines laser scribing, curing, sintering and inkjet processes. These different processes interacts with each other and are investigated in order to create processing strategies that are robust to ensure high volume production. The generic approach created a technology base that can be applied to any thin film PV technology.

  5. A layered approach to model interconnected infrastructure and its significance for asset management

    NARCIS (Netherlands)

    Bhamidipati, S.K.; Van der Lei, T.T.E.; Herder, P.M.

    2016-01-01

    Physical infrastructures facilitate much of societal and economic wellbeing of countries, regions and urban areas. In our increasingly urbanizing world, infrastructures in urban areas are densely located and interconnected. The effects of this interconnectedness are being studied increasingly,

  6. Cross-border versus cross-sector interconnectivity in renewable energy systems

    DEFF Research Database (Denmark)

    Thellufsen, Jakob Zinck; Lund, Henrik

    2017-01-01

    renewable energy, the energy system has to be more flexible in terms of decoupling demand and production. This paper investigates two potential ways to increase flexibility. The first is the interconnection between energy systems, for instance between two countries, labelled as cross-border interconnection......In the transition to renewable energy systems, fluctuating renewable energy, such as wind and solar power, plays a large and important role. This creates a challenge in terms of meeting demands, as the energy production fluctuates based on weather patterns. To utilise high amounts of fluctuating......, and the second is cross-sector interconnection, i.e., the integration between different parts of an energy system, for instance heat and electricity. This paper seeks to compare the types of interconnectivity and discuss to which extent they are mutually beneficial. To do this, the study investigates two energy...

  7. 75 FR 27550 - Electrical Interconnection of the Juniper Canyon I Wind Project

    Science.gov (United States)

    2010-05-17

    ... From the Federal Register Online via the Government Publishing Office DEPARTMENT OF ENERGY Bonneville Power Administration Electrical Interconnection of the Juniper Canyon I Wind Project AGENCY: Bonneville Power Administration (BPA), Department of Energy (DOE). ACTION: Notice of Availability of Record...

  8. Oahu Wind Integration and Transmission Study (OWITS): Hawaiian Islands Transmission Interconnection Project

    Energy Technology Data Exchange (ETDEWEB)

    Woodford, D.

    2011-02-01

    This report provides an independent review included an initial evaluation of the technical configuration and capital costs of establishing an undersea cable system and examining impacts to the existing electric transmission systems as a result of interconnecting the islands.

  9. Relevance of Generation Interconnection Procedures to Feed-in Tariffs in the United States

    Energy Technology Data Exchange (ETDEWEB)

    Fink, S.; Porter, K.; Rogers, J.

    2010-10-01

    Feed-in tariffs (FITs) have been used to promote renewable electricity development in over 40 countries throughout the past two decades. These policies generally provide guaranteed prices for the full system output from eligible generators for a fixed time period (typically 15-20 years). Due in part to the success of FIT policies in Europe, some jurisdictions in the United States are considering implementing similar policies, and a few have already put such policies in place. This report is intended to offer some guidance to policymakers and regulators on how generator interconnection procedures may affect the implementation of FITs and how state generator interconnection procedures can be formulated to support state renewable energy objectives. This report is based on a literature review of model interconnection procedures formulated by several organizations, as well as other documents that have reviewed, commented on, and in some cases, ranked state interconnection procedures.

  10. The Relevance of Generation Interconnection Procedures to Feed-in Tariffs in the United States

    Energy Technology Data Exchange (ETDEWEB)

    Fink, Sari [Exeter Associates, Inc., Columbia, MD (United States); Porter, Kevin [Exeter Associates, Inc., Columbia, MD (United States); Rogers, Jennifer [Exeter Associates, Inc., Columbia, MD (United States)

    2010-10-01

    Feed-in tariffs (FITs) have been used to promote renewable electricity development in over 40 countries throughout the past two decades. These policies generally provide guaranteed prices for the full system output from eligible generators for a fixed time period (typically 15–20 years). Due in part to the success of FIT policies in Europe, some jurisdictions in the United States are considering implementing similar policies, and a few have already put such policies in place. This report is intended to offer some guidance to policymakers and regulators on how generator interconnection procedures may affect the implementation of FITs and how state generator interconnection procedures can be formulated to support state renewable energy objectives. This report is based on a literature review of model interconnection procedures formulated by several organizations, as well as other documents that have reviewed, commented on, and in some cases, ranked state interconnection procedures.

  11. Switching Fabric based on Multi-Level LVDS Compatible Interconnect, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — The switching fabric (SF) is a key component of the next generation back plane interconnects. Extremely low-power, radiation-hardened, high-bandwidth upgradeable...

  12. IC layout adjustment method and tool for improving dielectric reliability at interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Kahng, Andrew B.; Chan, Tuck Boon

    2018-03-20

    Method for adjusting a layout used in making an integrated circuit includes one or more interconnects in the layout that are susceptible to dielectric breakdown are selected. One or more selected interconnects are adjusted to increase via to wire spacing with respect to at least one via and one wire of the one or more selected interconnects. Preferably, the selecting analyzes signal patterns of interconnects, and estimates the stress ratio based on state probability of routed signal nets in the layout. An annotated layout is provided that describes distances by which one or more via or wire segment edges are to be shifted. Adjustments can include thinning and shifting of wire segments, and rotation of vias.

  13. Innovative Distributed Power Grid Interconnection and Control Systems: Final Report, December 11, 2000 - August 30, 2005

    Energy Technology Data Exchange (ETDEWEB)

    DePodesta, K.; Birlingmair, D.; West, R.

    2006-03-01

    The contract goal was to further advance distributed generation in the marketplace by making installations more cost-effective and compatible with existing systems. This was achieved by developing innovative grid interconnection and control systems.

  14. Interconnection of Broadband Islands via Satellite-Experiments on the Race II Catalyst Project

    National Research Council Canada - National Science Library

    Sun, Z

    1996-01-01

    .... The purpose of the project was to develop an ATM satellite link for the future B-ISDN services, particularly for the interconnections of the ATM testbeds which are in the form of broadband islands...

  15. 47 CFR 69.155 - Per-minute residual interconnection charge.

    Science.gov (United States)

    2010-10-01

    ... local exchange carrier cannot recover its full residual interconnection charge revenues through the PICC... the exemption established in paragraph (c)(1) of this section between the PICC and the per-minute...

  16. The Open System Interconnection as a building block in a health sciences information network.

    OpenAIRE

    Boss, R W

    1985-01-01

    The interconnection of integrated health sciences library systems with other health sciences computer systems to achieve information networks will require either custom linkages among specific devices or the adoption of standards that all systems support. The most appropriate standards appear to be those being developed under the Open System Interconnection (OSI) reference model, which specifies a set of rules and functions that computers must follow to exchange information. The protocols hav...

  17. Toward a Robust Method of Presenting a Rich, Interconnected Deceptive Network Topology

    Science.gov (United States)

    2015-03-01

    connections, and correspond to the Data Link and Network Layer of the Open Systems Interconnection ( OSI ) model . The OSI model is an abstraction that...research project to build a model for our network [39]. • Another option is to have a separate node in our network with a real, physical link that we...NAVAL POSTGRADUATE SCHOOL MONTEREY, CALIFORNIA THESIS TOWARD A ROBUST METHOD OF PRESENTING A RICH, INTERCONNECTED DECEPTIVE NETWORK TOPOLOGY

  18. 3D printed high density, reversible, chip-to-chip microfluidic interconnects.

    Science.gov (United States)

    Gong, Hua; Woolley, Adam T; Nordin, Gregory P

    2018-02-13

    Our latest developments in miniaturizing 3D printed microfluidics [Gong et al., Lab Chip, 2016, 16, 2450; Gong et al., Lab Chip, 2017, 17, 2899] offer the opportunity to fabricate highly integrated chips that measure only a few mm on a side. For such small chips, an interconnection method is needed to provide the necessary world-to-chip reagent and pneumatic connections. In this paper, we introduce simple integrated microgaskets (SIMs) and controlled-compression integrated microgaskets (CCIMs) to connect a small device chip to a larger interface chip that implements world-to-chip connections. SIMs or CCIMs are directly 3D printed as part of the device chip, and therefore no additional materials or components are required to make the connection to the larger 3D printed interface chip. We demonstrate 121 chip-to-chip interconnections in an 11 × 11 array for both SIMs and CCIMs with an areal density of 53 interconnections per mm 2 and show that they withstand fluid pressures of 50 psi. We further demonstrate their reusability by testing the devices 100 times without seal failure. Scaling experiments show that 20 × 20 interconnection arrays are feasible and that the CCIM areal density can be increased to 88 interconnections per mm 2 . We then show the utility of spatially distributed discrete CCIMs by using an interconnection chip with 28 chip-to-world interconnects to test 45 3D printed valves in a 9 × 5 array. Each valve is only 300 μm in diameter (the smallest yet reported for 3D printed valves). Every row of 5 valves is tested to at least 10 000 actuations, with one row tested to 1 000 000 actuations. In all cases, there is no sign of valve failure, and the CCIM interconnections prove an effective means of using a single interface chip to test a series of valve array chips.

  19. SDN Data Center Performance Evaluation of Torus and Hypercube Interconnecting Schemes

    DEFF Research Database (Denmark)

    Andrus, Bogdan-Mihai; Vegas Olmos, Juan José; Mehmeri, Victor

    2015-01-01

    — By measuring throughput, delay, loss-rate and jitter, we present how SDN framework yields a 45% performance increase in highly interconnected topologies like torus and hypercube compared to current Layer2 switching technologies, applied to data center architectures......— By measuring throughput, delay, loss-rate and jitter, we present how SDN framework yields a 45% performance increase in highly interconnected topologies like torus and hypercube compared to current Layer2 switching technologies, applied to data center architectures...

  20. High Speed PAM -8 Optical Interconnects with Digital Equalization based on Neural Network

    DEFF Research Database (Denmark)

    Gaiarin, Simone; Pang, Xiaodan; Ozolins, Oskars

    2016-01-01

    We experimentally evaluate a high-speed optical interconnection link with neural network equalization. Enhanced equalization performances are shown comparing to standard linear FFE for an EML-based 32 GBd PAM-8 signal after 4-km SMF transmission.......We experimentally evaluate a high-speed optical interconnection link with neural network equalization. Enhanced equalization performances are shown comparing to standard linear FFE for an EML-based 32 GBd PAM-8 signal after 4-km SMF transmission....

  1. Ultra-High Capacity Silicon Photonic Interconnects through Spatial Multiplexing

    Science.gov (United States)

    Chen, Christine P.

    The market for higher data rate communication is driving the semiconductor industry to develop new techniques of writing at smaller scales, while continuing to scale bandwidth at low power consumption. Silicon photonic (SiPh) devices offer a potential solution to the electronic interconnect bandwidth bottleneck. SiPh leverages the technology commensurate of decades of fabrication development with the unique functionality of next-generation optical interconnects. Finer fabrication techniques have allowed for manufacturing physical characteristics of waveguide structures that can support multiple modes in a single waveguide. By refining modal characteristics in photonic waveguide structures, through mode multiplexing with the asymmetric y-junction and microring resonator, higher aggregate data bandwidth is demonstrated via various combinations of spatial multiplexing, broadening applications supported by the integrated platform. The main contributions of this dissertation are summarized as follows. Experimental demonstrations of new forms of spatial multiplexing combined together exhibit feasibility of data transmission through mode-division multiplexing (MDM), mode-division and wavelength-division multiplexing (MDM-WDM), and mode-division and polarization-division multiplexing (MDM-PDM) through a C-band, Si photonic platform. Error-free operation through mode multiplexers and demultiplexers show how data can be viably scaled on multiple modes and with existing spatial domains simultaneously. Furthermore, we explore expanding device channel support from two to three arms. Finding that a slight mismatch in the third arm can increase crosstalk contributions considerably, especially when increasing data rate, we explore a methodical way to design the asymmetric y-junction device by considering its angles and multiplexer/demultiplexer arm width. By taking into consideration device fabrication variations, we turn towards optimizing device performance post

  2. Comparative Analysis and Considerations for PV Interconnection Standards in the United States and China

    Energy Technology Data Exchange (ETDEWEB)

    None

    2017-01-01

    The main objectives of this report are to evaluate China's photovoltaic (PV) interconnection standards and the U.S. counterparts and to propose recommendations for future revisions to these standards. This report references the 2013 report Comparative Study of Standards for Grid-Connected PV System in China, the U.S. and European Countries, which compares U.S., European, and China's PV grid interconnection standards; reviews various metrics for the characterization of distribution network with PV; and suggests modifications to China's PV interconnection standards and requirements. The recommendations are accompanied by assessments of four high-penetration PV grid interconnection cases in the United States to illustrate solutions implemented to resolve issues encountered at different sites. PV penetration in China and in the United States has significantly increased during the past several years, presenting comparable challenges depending on the conditions of the grid at the point of interconnection; solutions are generally unique to each interconnected PV installation or PV plant.

  3. On the Distribution of Lightning Current among Interconnected Grounding Systems in Medium Voltage Grids

    Directory of Open Access Journals (Sweden)

    Guido Ala

    2018-03-01

    Full Text Available This paper presents the results of a first investigation on the effects of lightning stroke on medium voltage installations’ grounding systems, interconnected with the metal shields of the Medium Voltage (MV distribution grid cables or with bare buried copper ropes. The study enables us to evaluate the distribution of the lightning current among interconnected ground electrodes in order to estimate if the interconnection, usually created to reduce ground potential rise during a single-line-to-ground fault, can give place to dangerous situations far from the installation hit by the lightning stroke. Four different case studies of direct lightning stroke are presented and discussed: (1 two secondary substations interconnected by the cables’ shields; (2 two secondary substations interconnected by a bare buried conductor; (3 a high voltage/medium voltage station connected with a secondary substation by the medium voltage cables’ shields; (4 a high voltage/medium voltage station connected with a secondary substation by a bare buried conductor. The results of the simulations show that a higher peak-lowering action on the lighting-stroke current occurs due to the use of bare conductors as interconnection elements in comparison to the cables’ shields.

  4. Through-Wafer Optical Interconnects For Multi-Wafer Wafer-Scale Integrated Architectures

    Science.gov (United States)

    Hornak, L. A.; Tewksbury, S. K.; Hatamian, M.; Ligtenberg, A.; Sugla, B.; Franzon, P.

    1986-12-01

    Hybrid mounting of optical components, combined perhaps with integrated optical waveguides and lenses on a large area silicon, wafer-scale integrated (WSI) electronic circuit provides one potential approach to combine advanced electronic and photonic functions. The desire to achieve a high degree of parallelism in multi-wafer WSI-based architectures has stimulated study of three-dimensional interconnect structures obtained by stacking wafer circuit boards and. providing interconnections vertically between wafers over the entire wafer area in addition to planar connections. While presently it is difficult for optical interconnects to compete with electrical interconnects in the wafer plane, it is appropriate to look at vertical optical interconnections between wafer planes since the corresponding conductive structures would be large in area and may impede system repairability. The ability to pass information optically between circuit planes without mechanical electrical contacts offers potential advantages for multi-wafer WSI or other dense three-dimensional architectures. However, while optical waveguides are readily fabricated in the plane of the wafer, waveguiding vertically through the wafer is difficult. If additional processing is required for waveguides or lenses, it should be compatible with standard VLSI processing. This paper presents one straightforward method of meeting this criterion. Using optical device technology operating at wavelengths beyond the ≍1.1μm Si absorption cutoff, low loss, through-wafer propagation between WSI circuit boards can be achieved over the distances of interest (≍1mm) with the interstitial Si wafers as part of the interconnect "free-space" transmission medium. The thickness of existing VLSI layers can be readily adjusted in featureless regions of the wafer to provide antireflection windows such that the transmittance can be raised to ≍77% for n-type and to ≍97% for p-type silicon. Optical interconnect source

  5. Holistic design in high-speed optical interconnects

    Science.gov (United States)

    Saeedi, Saman

    Integrated circuit scaling has enabled a huge growth in processing capability, which necessitates a corresponding increase in inter-chip communication bandwidth. As bandwidth requirements for chip-to-chip interconnection scale, deficiencies of electrical channels become more apparent. Optical links present a viable alternative due to their low frequency-dependent loss and higher bandwidth density in the form of wavelength division multiplexing. As integrated photonics and bonding technologies are maturing, commercialization of hybrid-integrated optical links are becoming a reality. Increasing silicon integration leads to better performance in optical links but necessitates a corresponding co-design strategy in both electronics and photonics. In this light, holistic design of high-speed optical links with an in-depth understanding of photonics and state-of-the-art electronics brings their performance to unprecedented levels. This thesis presents developments in high-speed optical links by co-designing and co-integrating the primary elements of an optical link: receiver, transmitter, and clocking. In the first part of this thesis a 3D-integrated CMOS/Silicon-photonic receiver will be presented. The electronic chip features a novel design that employs a low-bandwidth TIA front-end, double-sampling and equalization through dynamic offset modulation. Measured results show -14.9dBm of sensitivity and energy eciency of 170fJ/b at 25Gb/s. The same receiver front-end is also used to implement source-synchronous 4-channel WDM-based parallel optical receiver. Quadrature ILO-based clocking is employed for synchronization and a novel frequency-tracking method that exploits the dynamics of IL in a quadrature ring oscillator to increase the effective locking range. An adaptive body-biasing circuit is designed to maintain the per-bit-energy consumption constant across wide data-rates. The prototype measurements indicate a record-low power consumption of 153fJ/b at 32Gb/s. The

  6. Electricity and gas interconnections in France. A tool for the construction of an integrated European market

    International Nuclear Information System (INIS)

    2016-06-01

    The French Energy Regulator (CRE) is publishing its report on French electricity and gas interconnections. The report makes two main conclusions: French electricity and natural gas networks are well interconnected with their counterparts in neighbouring countries and the use of interconnections has been significantly improved over the last 10 years. In terms of electricity, France's average export capacity is 13.5 GW, i.e. more than 10% of its production capacity. France is very well integrated in the European gas market and is a transit country to Spain and Italy. It has boosted its interconnection capacity in gas by 40% in 10 years. Interconnections are vital to the internal energy market and help trade between Member States. They enable European consumers to benefit from cost-effective energy by diversifying sources of supply. Since it was created, the CRE has played a leading role in this area, by fostering the development of interconnections at the French borders and by making them more efficiently used. After major efforts, the question of creating new interconnections (which constitute complex and costly projects) is now being raised. In terms of gas, the Midcat Project (a new gas interconnection between France and Spain) provides a good illustration of this question. The project will cost almost 3 billion Euros, two billion of which is being funded by France, and the decision to launch it should not be taken lightly without robust cost-benefit analyses. These studies must, in particular, identify and quantify the benefits for each country concerned as well as for the European Union, and organise the project funding in relation to these benefits. As concerns the interconnection project in the Bay of Biscay between France and Spain, overcoming technical uncertainties is an essential prerequisite before commenting on the opportunities it offers in terms of the costs and benefits that it might generate. In compliance with the law, the CRE acts on behalf of

  7. All-optical interconnection with cross-polarized double phase conjugate mirror

    Science.gov (United States)

    Uemura, Shunsuke; Okamoto, Atsushi; Honma, Satoshi

    2004-06-01

    We propose an all-optical interconnection with cross-polarized double phase conjugate mirrors (CP-DPCMs). In the interconnection, spatially arrayed signal beams from an input port two-dimensionally intersect with control beams from an output port in the photorefractive crystal (PRC) where polarizations of these two beams are orthogonal each other. The CP-DPCM can function as the switching element by adjusting the intensity ratio of these two beams because it strongly depends on the intensity ratio of crossing two beams whether the CP-DPCM is built up in the PRC or not. Thus the signal beam is diffracted by the CP-DPCM and propagated to the output port, when the intensity ratio of signal beam and control beam is adjusted to proper value for buildup of the CP-DPCM. This technique offers the point-to-point interconnection in two-dimensional plane. It implies the possibility of miniaturization and the integration by stacking the planes with different wiring pattern in layers compared to the conventional interconnections with DPCMs. For configuring the arbitrary wiring pattern, it is important to determine the intensities of the signal beams and the control beams, so we investigate the optimum intensities of these beams for effective switching. We carry out basic experiment on 1x2 interconnection with BaTiO3 and Ar+ laser.

  8. Analysis of the trade-offs between conventional and superconducting interconnections

    International Nuclear Information System (INIS)

    Frye, R.

    1989-01-01

    Superconductivity can now be achieved at temperatures compatible with semiconductor device operation. This raises the interesting possibility of using the new, high-temperature superconducting ceramics for interconnections in electronic systems. This paper examines some of the consequences of a resistance-free interconnection medium. A problem with conventional conductors in electronic systems is that the resistance of wires increases quadratically as the wire dimensions are scaled down. Below some minimum cross-sectional area, determined by the metal resistivity and wire length, the resistance in these lines begins to severely limit their bandwidth. Superconductors, on the other hand, are not constrained by the same scaling rules. They provide a high bandwidth interconnection at all sizes and lengths. The limitations for superconductors are set by their critical current densities. If line dimensions become too small, a superconductor will no longer support an adequate flow of current. An analysis is presented examining the performance trade-offs for conventional and superconducting interconnections in applications ranging from printed wiring boards to chips. For most semiconductor device-based applications, the potential gains in wiring density offered by superconductors are probably more important than the bandwidth improvements. An important result of the analysis is that it determines the values of critical current density above which superconductors outperform conventional wires in systems of various physical sizes. This identifies particular interconnection technologies for which high-temperature superconductors show the most promise

  9. Reliability analysis of magnetic logic interconnect wire subjected to magnet edge imperfections

    Science.gov (United States)

    Zhang, Bin; Yang, Xiaokuo; Liu, Jiahao; Li, Weiwei; Xu, Jie

    2018-02-01

    Nanomagnet logic (NML) devices have been proposed as one of the best candidates for the next generation of integrated circuits thanks to its substantial advantages of nonvolatility, radiation hardening and potentially low power. In this article, errors of nanomagnetic interconnect wire subjected to magnet edge imperfections have been evaluated for the purpose of reliable logic propagation. The missing corner defects of nanomagnet in the wire are modeled with a triangle, and the interconnect fabricated with various magnetic materials is thoroughly investigated by micromagnetic simulations under different corner defect amplitudes and device spacings. The results show that as the defect amplitude increases, the success rate of logic propagation in the interconnect decreases. More results show that from the interconnect wire fabricated with materials, iron demonstrates the best defect tolerance ability among three representative and frequently used NML materials, also logic transmission errors can be mitigated by adjusting spacing between nanomagnets. These findings can provide key technical guides for designing reliable interconnects. Project supported by the National Natural Science Foundation of China (No. 61302022) and the Scientific Research Foundation for Postdoctor of Air Force Engineering University (Nos. 2015BSKYQD03, 2016KYMZ06).

  10. Minimum short-circuit ratios for grid interconnection of wind farms with induction generators

    Energy Technology Data Exchange (ETDEWEB)

    Reginatto, Romeu; Rocha, Carlos [Western Parana State University (UNIOESTE), Foz do Iguacu, PR (Brazil). Center for Engineering and Exact Sciences], Emails: romeu@unioeste.br, croberto@unioeste.br

    2009-07-01

    This paper concerns the problem of determining the minimum value for the short-circuit ratio which is adequate for the interconnection of a given wind farms to a given grid point. First, a set of 3 criteria is defined in order to characterize the quality/safety of the interconnection: acceptable terminal voltage variations, a minimum active power margin, and an acceptable range for the internal voltage angle. Then, the minimum short circuit ratio requirement is determined for 6 different induction generator based wind turbines, both fixed-speed (with and without reactive power compensation) and variable-speed (with the following control policies: reactive power, power factor, and terminal voltage regulation). The minimum short-circuit ratio is determined and shown in graphical results for the 6 wind turbines considered, for X/R in the range 0-15, also analyzing the effect of more/less stringent tolerances for the interconnection criteria. It is observed that the tighter the tolerances the larger the minimum short-circuit ratio required. For the same tolerances in the interconnection criteria, a comparison of the minimum short circuit ratio required for the interconnection of both squirrel-cage and doubly-fed induction generators is presented, showing that the last requires much smaller values for the short-circuit ratio. (author)

  11. Interconnecting network for switching data packets and method for switching data packets

    Science.gov (United States)

    Benner, Alan Frederic; Minkenberg, Cyriel Johan Agnes; Stunkel, Craig Brian

    2010-05-25

    The interconnecting network for switching data packets, having data and flow control information, comprises a local packet switch element (S1) with local input buffers (I(1,1) . . . I(1,y)) for buffering the incoming data packets, a remote packet switch element (S2) with remote input buffers (I(2,1) . . . I(2,y)) for buffering the incoming data packets, and data lines (L) for interconnecting the local and the remote packet switch elements (S1, S2). The interconnecting network further comprises a local and a remote arbiter (A1, A2) which are connected via control lines (CL) to the input buffers (I(1,1) . . . I(1,y), I(2,1) . . . I(2,y)), and which are formed such that they can provide that the flow control information is transmitted via the data lines (L) and the control lines (CL).

  12. Oxidation behavior of metallic interconnect in solid oxide fuel cell stack

    Science.gov (United States)

    Li, Jun; Zhang, Wenying; Yang, Jiajun; Yan, Dong; Pu, Jian; Chi, Bo; Jian, Li

    2017-06-01

    Oxidation behavior of integrated interconnect with bipolar plate and corrugated sheet made by ferrite steel SUS430 is investigated and compared in simulated environment and in a realistic stack. Electrical current is found to have a direction-related impact on the thickness of the Cr2O3/MnCr2O4 composite oxide scale. Oxide scale of the interconnect aged in the stack exhibits a dual-layered structure of a complex Mn-Cr oxide layer covered by iron oxide. The oxidation rates vary greatly depending on its local environment, with different thermal, electrical density, as well as gas composition conditions. By analyzing the thickness distribution of oxide scale and comparing them with the simulated test result, the oxidation behavior of interconnect in stack is described in high definition. ASR distribution is also conducted by calculation, which could help further understanding the behavior of stack degradation.

  13. Swarm intelligence algorithm for interconnect model order reduction with sub-block structure preserving

    Science.gov (United States)

    Wang, Xinsheng; Wang, Chenxu; Yu, Mingyan

    2016-07-01

    In this paper, we propose a generalised sub-block structure preservation interconnect model order reduction (MOR) technique based on the swarm intelligence method, that is, particle swarm optimisation (PSO). The swarm intelligence-based structure preservation MOR can be used for a standard model as a criterion for different structure preservation interconnect MOR methods. In the proposed technique, the PSO method is used for predicting the unknown elements of structure-preserving reduced-order modelling of interconnect circuits. The prediction is based on minimising the difference of transform function between the original full-order and desired reduced-order systems maintaining the full-order structure in the reduced-order model. The proposed swarm-intelligence-based structure-preserving MOR method is compared with published work on structure preservation MOR SPRIM techniques. Simulation and synthesis results verify the accuracy and validity of the new structure-preserving MOR technique.

  14. Testing of Ni-plated ferritic steel interconnect in SOFC stacks

    DEFF Research Database (Denmark)

    Nielsen, K.A.; Dinesen, A.R.; Korcakova, L.

    2006-01-01

    Stack tests were run at 850 °C for periods from 80 hours to 1,150 hours to develop contacting procedures and at the same time evaluate the performance of a 5 μm electroplated nickel coating on a ferritic Fe22Cr interconnect. The metallic nickel coating reacted relatively quickly during the initial...... of the protective scale on the cathode side was susceptible to pitting-type corrosion patterns, which may limit the life expectancy to less than 2,000 hours for the 200 μm thick interconnect tested. The initial area-specific resistances (ASR) at the interconnect/cathode current collector interface...

  15. Scalability analysis methodology for passive optical interconnects in data center networks using PAM

    Science.gov (United States)

    Lin, R.; Szczerba, Krzysztof; Agrell, Erik; Wosinska, Lena; Tang, M.; Liu, D.; Chen, J.

    2017-11-01

    A framework is developed for modeling the fundamental impairments in optical datacenter interconnects, i.e., the power loss and the receiver noises. This framework makes it possible, to analyze the trade-offs between data rates, modulation order, and number of ports that can be supported in optical interconnect architectures, while guaranteeing that the required signal-to-noise ratios are satisfied. To the best of our knowledge, this important assessment methodology is not yet available. As a case study, the trade-offs are investigated for three coupler-based top-of-rack interconnect architectures, which suffer from serious insertion loss. The results show that using single-port transceivers with 10 GHz bandwidth, avalanche photodiode detectors, and quadratical pulse amplitude modulation, more than 500 ports can be supported.

  16. Traffic Load on Interconnection Lines of Generalized Double Ring Network Structures

    DEFF Research Database (Denmark)

    Pedersen, Jens Myrup; Riaz, Muhammad Tahir; Madsen, Ole Brun

    2004-01-01

    consists of two planar rings, which are easily embedded by fiber or other wired solutions. It is shown that for large N2R structures, the interconnection lines carry notably lower loads than the other lines if shortest-path routing is used, and the effects of two other routing schemes are explored, leading......Generalized Double Ring (N2R) network structures possess a number of good properties, but being not planar they are hard to physically embed in communication networks. However, if some of the lines, the interconnection lines, are implemented by wireless technologies, the remaining structure...... to lower load on interconnection lines at the price of larger efficient average distance and diameter....

  17. Single OR molecule and OR atomic circuit logic gates interconnected on a Si(100)H surface

    International Nuclear Information System (INIS)

    Ample, F; Joachim, C; Duchemin, I; Hliwa, M

    2011-01-01

    Electron transport calculations were carried out for three terminal OR logic gates constructed either with a single molecule or with a surface dangling bond circuit interconnected on a Si(100)H surface. The corresponding multi-electrode multi-channel scattering matrix (where the central three terminal junction OR gate is the scattering center) was calculated, taking into account the electronic structure of the supporting Si(100)H surface, the metallic interconnection nano-pads, the surface atomic wires and the molecule. Well interconnected, an optimized OR molecule can only run at a maximum of 10 nA output current intensity for a 0.5 V bias voltage. For the same voltage and with no molecule in the circuit, the output current of an OR surface atomic scale circuit can reach 4 μA.

  18. Experimental Study on Strain Reliability of Embroidered Passive UHF RFID Textile Tag Antennas and Interconnections

    Directory of Open Access Journals (Sweden)

    Xiaochen Chen

    2017-01-01

    Full Text Available We present embroidered antennas and interconnections in passive UHF RFID textile tags and test their strain reliability. Firstly, we fabricate tag antennas on two different stretchable fabric substrates by five different embroidery patterns and choose the most stretchable ones for testing. Next, the tag ICs are attached by sewing and gluing, and the tag reliability during repeated stretching cycles is evaluated through wireless measurements. Initially, the chosen tags achieve read ranges of 6–8 meters and can strain up to 140–150% of their original length. After 100 stretching cycles to 80% of their maximum strain, the read ranges of the tags with glued interconnections are similar to the initial values. In addition, also the read ranges of the tags with sewed interconnections are still more than 70%–85% of their initial values. However, some challenges with the reproducibility need to be solved next.

  19. Qualification and Start of Production of the Ultrasonic Welding Machines for the LHC Interconnections

    CERN Document Server

    Jacquemod, A; Laurent, F; Tock, J P; Vaudaux, L

    2006-01-01

    The Large Hadron Collider (LHC) is presently under installation at CERN, Geneva. The approximately 4000 superconducting corrector magnets required by the machine are powered through copper-stabilized Nb-Ti busbars. To interconnect the magnets along the machine, about 50 000 joints between superconducting cables rated at 600 A have to be performed in-situ during the interconnection activities. An ultrasonic welding technique has been developed and optimised by CERN which led to the development of a dedicated machine which was qualified during the assembly of the STRING II, a 110-m chain of cryomagnets assembled as a prototype of the LHC. The realization of the â series â interconnections together with the procurement of the tooling based on functional specifications have been contracted to a consortium of firms. Qualification tests and acceptance criteria in terms of electrical contact resistance, mechanical resistance, reliability and reproducibility have been defined by CERN. This paper presents the tes...

  20. Model Predictive Load Frequency Control of two-area Interconnected Time Delay Power System with TCSC

    Science.gov (United States)

    Deng, Yan; Liu, Wenze

    2017-05-01

    In order to reduce the influence of non-linear constraint and time delay on load frequency control of interconnected power system, this paper, based on Model Predictive Control (MPC), designed a load frequency control scheme for two-area interconnected power system with TCSC device. First, considering the Generation Rate Constraint (GRC) and time delay, this paper builds the dynamics model of two-area interconnected power system with Thyristor Controlled Series Compensation device (TCSC). Then the whole system is decomposed into two subsystems. And each subsystem has its own local area MPC controller. Second, collaborative control is implemented by integrating the control information (measurement value, predictive value, etc.) of subsystems’ MPC controllers into the local control goal. In the end, under consideration of physical constraints, the Matlab simulation is conducted. The calculation results showed that the MPC strategy has better dynamic performance and robustness compared to the traditional PI control.

  1. A Methodology for Physical Interconnection Decisions of Next Generation Transport Networks

    DEFF Research Database (Denmark)

    Gutierrez Lopez, Jose Manuel; Riaz, M. Tahir; Madsen, Ole Brun

    2011-01-01

    The physical interconnection for optical transport networks has critical relevance in the overall network performance and deployment costs. As telecommunication services and technologies evolve, the provisioning of higher capacity and reliability levels is becoming essential for the proper...... of possibilities when designing the physical network interconnection. This paper develops and presents a methodology in order to deal with aspects related to the interconnection problem of optical transport networks. This methodology is presented as independent puzzle pieces, covering diverse topics going from...... development of Next Generation Networks. Currently, there is a lack of specific procedures that describe the basic guidelines to design such networks better than "best possible performance for the lowest investment". Therefore, the research from different points of view will allow a broader space...

  2. Electroplating of Protective Coatings on Interconnects Used for Solid Oxide Fuel Cell Stacks

    DEFF Research Database (Denmark)

    Harthøj, Anders

    and the gaseous chromium species can poison the cathode. Interconnect coatings are a potential solution to reduce the high temperature corrosion issues. An effective coating must consist of a material with the right properties but equally important is the process used for its deposition. It must enable coatings...... to be deposited with good adhesion, low porosity, uniform thickness, good coverage and importantly at a low cost. The focus in this project was on electroplated coatings for metallic interconnects. The aim was to reduce the oxidation rate the interconnect when exposed in a cathode side (air) environment. New...... coatings were developed and their performance and corrosion behaviour was investigated. Processes were developed for electroplating of coatings consisting of cobalt, the alloys cobalt/tungsten (Co/W) and cobalt/molybdenum (Co/Mo) as well as the composites cobalt/cerium oxide (Co/CeO2) and cobalt...

  3. LaCrO{sub 3}-dispersed Cr for metallic interconnect of planar SOFC

    Energy Technology Data Exchange (ETDEWEB)

    Song, Rak-Hyun; Shin, Dong Ryul [Korea Institute of Energy Research, Taejon (Korea, Republic of); Dokiya, Masayuki [National Institute of Materials and Chemical Research, Ibaraki (Japan)

    1996-12-31

    In the planar SOFC, the interconnect materials plays two roles as an electrical connection and as a gas separation plate in a cell stack. The interconnect materials must be chemically stable in reducing and oxidizing environments, and have high electronic conductivity, high thermal conductivity, matching thermal expansion with an electrolyte, high mechanical strength, good fabricability, and gas tightness. Lanthanum chromite so far has been mainly used as interconnect materials in planar SOFC. However, the ceramic materials are very weak in mechanical strength and have poor machining property as compared with metal. Also the metallic materials have high electronic conductivity and high thermal conductivity. Recently some researchers have studied metallic interconnects such as Al{sub 2}O{sub 3}/Inconel 600 cermet, Ni-20Cr coated with (LaSr)CoO{sub 3}, and Y{sub 2}O{sub 3-} or La{sub 2}O{sub 3}-dispersed Cr alloy. These alloys have still some problems because Ni-based alloys have high thermal expansion, the added Al{sub 2}O{sub 3}, Y{sub 2}O{sub 3} and La{sub 2}O{sub 3} to metals have no electronic conductivity, and the oxide formed on the surface of Cr alloy has high volatility. To solve these problems, in this study, LaCrO{sub 3}-dispersed Cr for metallic interconnect of planar SOFC was investigated. The LaCrO{sub 3}-dispersed Cr can be one candidate of metallic interconnect because LaCrO{sub 3} possesses electronic conductivity and Cr metal has relatively low thermal expansion. The content of 25 vol.% LaCrO{sub 3} Was selected on the basis of a theoretically calculated thermal expansion. The thermal expansion, electrical and oxidation properties were examined and the results were discussed as related to SOFC requirements.

  4. Strategic siting and regional grid interconnections key to low-carbon futures in African countries

    Energy Technology Data Exchange (ETDEWEB)

    Wu, Grace C. [Univ. of California, Berkeley, CA (United States). Energy and Resources Group; Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). International Energy Studies Group; Deshmukh, Ranjit [Univ. of California, Berkeley, CA (United States). Energy and Resources Group; Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). International Energy Studies Group; Ndhlukula, Kudakwashe [Namibia Univ. of Science and Technology, Windhoek, (Namibia). Southern Africa Development Community (SADC) Centre for Renewable Energy and Energy Efficiency; Radojicic, Tijana [International Renewable Energy Agency, Masdar City, Abu Dhabi (United Arab Emirates); Reilly-Moman, Jessica [Univ. of California, Berkeley, CA (United States). Energy and Resources Group; Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). International Energy Studies Group; Phadke, Amol [Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). International Energy Studies Group; Kammen, Daniel M. [Univ. of California, Berkeley, CA (United States). Energy and Resources Group; Callaway, Duncan S. [Univ. of California, Berkeley, CA (United States). Energy and Resources Group

    2017-03-27

    Recent forecasts suggest that African countries must triple their current electricity generation by 2030. Our multicriteria assessment of wind and solar potential for large regions of Africa shows how economically competitive and low-environmental– impact renewable resources can significantly contribute to meeting this demand. We created the Multicriteria Analysis for Planning Renewable Energy (MapRE) framework to map and characterize solar and wind energy zones in 21 countries in the Southern African Power Pool (SAPP) and the Eastern Africa Power Pool (EAPP) and find that potential is several times greater than demand in many countries. Significant fractions of demand can be quickly served with “no-regrets” options—or zones that are low-cost, low-environmental impact, and highly accessible. Because no-regrets options are spatially heterogeneous, international interconnections are necessary to help achieve low-carbon development for the region as a whole, and interconnections that support the best renewable options may differ from those planned for hydropower expansion. Additionally, interconnections and selecting wind sites to match demand reduce the need for SAPP-wide conventional generation capacity by 9.5% in a high-wind scenario, resulting in a 6–20% cost savings, depending on the avoided conventional technology. Strategic selection of low-impact and accessible zones is more cost effective with interconnections compared with solutions without interconnections. In conclusion, the overall results are robust to multiple load growth scenarios. Together, results show that multicriteria site selection and deliberate planning of interconnections may significantly increase the economic and environmental competitiveness of renewable alternatives relative to conventional generation.

  5. 3D chip stacking with through silicon-vias (TSVs) for vertical interconnect and underfill dispensing

    Science.gov (United States)

    Le, Fuliang; Lee, Shi-Wei Ricky; Zhang, Qiming

    2017-04-01

    3D chip stacking with through silicon vias (TSVs) has been identified as one of the major technologies for achieving higher silicon packaging density and shorter interconnect. The test vehicle presented in this paper is a 3D chip stack package. Each layer of the test vehicle has two silicon flip chips mounted at the bottom of a silicon interposer with solder bumps. The flip chip has the equivalent dimensions and pad patterns as commercial memory chips. The interposer, with multiple interconnect TSVs for electrical connection and a central TSV for underfill dispensing, can function as a logic chip or as a redistribution chip in a real application. The assembly steps of the test vehicle include conductive adhesive filling for the interconnect TSVs, bonding two bumped flip chips on an interposer (to form a single layer), vertical stacking of the single layers and underfill dispensing. For the filling of the interconnect TSVs, an auger-dispensing method is first adopted to overfill the interconnect TSVs, followed by removing the excessive adhesive beyond the interconnect TSVs by squeegeeing. A jet valve continuously dispenses free dots of an underfill encapsulant into the central TSVs. The central TSVs function as an entrance for underfill dispensing and an uninterrupted point-source to provide fluid for each layer. The free dots form a capillary flow to fill the under-chip spaces of the test vehicle. The usage of TSVs rather than chip edges eliminates the presence of a wide edge reservoir, resulting in smaller ‘keep-out’ area occupation on the substrate.

  6. Strategic siting and regional grid interconnections key to low-carbon futures in African countries.

    Science.gov (United States)

    Wu, Grace C; Deshmukh, Ranjit; Ndhlukula, Kudakwashe; Radojicic, Tijana; Reilly-Moman, Jessica; Phadke, Amol; Kammen, Daniel M; Callaway, Duncan S

    2017-04-11

    Recent forecasts suggest that African countries must triple their current electricity generation by 2030. Our multicriteria assessment of wind and solar potential for large regions of Africa shows how economically competitive and low-environmental-impact renewable resources can significantly contribute to meeting this demand. We created the Multicriteria Analysis for Planning Renewable Energy (MapRE) framework to map and characterize solar and wind energy zones in 21 countries in the Southern African Power Pool (SAPP) and the Eastern Africa Power Pool (EAPP) and find that potential is several times greater than demand in many countries. Significant fractions of demand can be quickly served with "no-regrets" options-or zones that are low-cost, low-environmental impact, and highly accessible. Because no-regrets options are spatially heterogeneous, international interconnections are necessary to help achieve low-carbon development for the region as a whole, and interconnections that support the best renewable options may differ from those planned for hydropower expansion. Additionally, interconnections and selecting wind sites to match demand reduce the need for SAPP-wide conventional generation capacity by 9.5% in a high-wind scenario, resulting in a 6-20% cost savings, depending on the avoided conventional technology. Strategic selection of low-impact and accessible zones is more cost effective with interconnections compared with solutions without interconnections. Overall results are robust to multiple load growth scenarios. Together, results show that multicriteria site selection and deliberate planning of interconnections may significantly increase the economic and environmental competitiveness of renewable alternatives relative to conventional generation.

  7. Analysis of Effective Interconnectivity of DegraPol-foams Designed for Negative Pressure Wound Therapy

    Directory of Open Access Journals (Sweden)

    Heike Hall

    2009-03-01

    Full Text Available Many wounds heal slowly and are difficult to manage. Therefore Negative Pressure Wound Therapy (NPWT was developed where polymer foams are applied and a defined negative pressure removes wound fluid, reduces bacterial burden and increases the formation of granulation tissue. Although NPWT is used successfully, its mechanisms are not well understood. In particular, different NPWT dressings were never compared. Here a poly-ester urethane Degrapol® (DP-foam was produced and compared with commercially available dressings (polyurethane-based and polyvinyl-alcohol-based in terms of apparent pore sizes, swelling and effective interconnectivity of foam pores. DP-foams contain relatively small interconnected pores; PU-foams showed large pore size and interconnectivity; whereas PVA-foams displayed heterogeneous and poorly interconnected pores. PVA-foams swelled by 40 %, whereas DP- and PU-foams remained almost without swelling. Effective interconnectivity was investigated by submitting fluorescent beads of 3, 20 and 45 mm diameter through the foams. DP- and PU-foams removed 70-90 % of all beads within 4 h, independent of the bead diameter or bead pre-adsorption with serum albumin. For PVA-foams albumin pre-adsorbed beads circulated longer, where 20 % of 3 mm and 10 % of 20 mm diameter beads circulated after 96 h. The studies indicate that efficient bead perfusion does not only depend on pore size and swelling capacity, but effective interconnectivity might also depend on chemical composition of the foam itself. In addition due to the efficient sieve-effect of the foams uptake of wound components in vivo might occur only for short time suggesting other mechanisms being decisive for success of NPWT.

  8. Microstructure Effect on EM-induced Degradations in Dual-Inlaid Copper Interconnects

    Science.gov (United States)

    Kteyan, A.; Sukharev, V.; Meyer, M.-A.; Zschech, E.; Nix, W. D.

    2007-10-01

    A novel physical model and a simulation algorithm are used to predict EM induced stress evolution in dual-inlaid copper interconnects. The aim of the current simulation was to investigate the dual effect of the microstructure, which consists of (a) the effect of GBs as the sources/sinks for vacancies and plated atoms and as the channel for vacancy migration, and (b) the effect of texture-related variations of the modulus of elasticity on the stress evolution in copper lines caused by EM. The major difference between our approach and the previously described ones is the accounting of additional stress generated by the plated atoms. As it is shown this stress plays an important role in the vacancy equilibration. The results of the numerical simulation have been proven experimentally by EM degradation studies on fully embedded dual-inlaid copper interconnect test structures and by subsequent microstructure analysis, mainly based on electron backscatter diffraction (EBSD) data. The virtual EM-induced void formation, movement and growth in a copper interconnect were continuously monitored in an in-situ scanning electron microscopy (SEM) experiment. The copper microstructure, particularly the orientation of grains and grain boundaries, was determined with EBSD. It has a significant influence on grain boundary diffusivity and on stress evolution. For interconnects with interfaces that resist atomic transport and where grain boundaries are the important pathways for atom migration, degradation and failure processes are completely different for microstructures with randomly oriented grain boundaries compared with "bamboo-like" microstructures. The correspondence between simulation results and experimental data indicates the applicability of the developed model for optimization of the physical and electrical design rules. Simulation-based optimization of the interconnect architecture, segment geometry, material properties and some of the process parameters can produce on

  9. Comparing Germany's and California's Interconnection Processes for PV Systems (White Paper)

    Energy Technology Data Exchange (ETDEWEB)

    Tweedie, A.; Doris, E.

    2011-07-01

    Establishing interconnection to the grid is a recognized barrier to the deployment of distributed energy generation. This report compares interconnection processes for photovoltaic projects in California and Germany. This report summarizes the steps of the interconnection process for developers and utilities, the average length of time utilities take to process applications, and paperwork required of project developers. Based on a review of the available literature, this report finds that while the interconnection procedures and timelines are similar in California and Germany, differences in the legal and regulatory frameworks are substantial.

  10. Analysis of the prospective energy interconnections in Northeast Asia and development of the data portal

    Science.gov (United States)

    Churkin, Andrey; Bialek, Janusz

    2018-01-01

    Development of power interconnections in Northeast Asia becomes not only engineering but also a political issue. More research institutes are involved in the Asian Super Grid initiative discussion, as well as more politicians mention power interconnection opportunities. UNESCAP started providing a platform for intragovernmental discussion of the issue. However, there are still a lack of comprehensive modern research of the Asian Super Grid. Moreover, there is no unified data base and no unified power routes concept. Therefore, this article discusses a tool for optimal power routes selection and suggest a concept of the unified data portal.

  11. Decentralized Adaptive Control of Systems with Uncertain Interconnections, Plant-Model Mismatch and Actuator Failures

    Science.gov (United States)

    Patre, Parag; Joshi, Suresh M.

    2011-01-01

    Decentralized adaptive control is considered for systems consisting of multiple interconnected subsystems. It is assumed that each subsystem s parameters are uncertain and the interconnection parameters are not known. In addition, mismatch can exist between each subsystem and its reference model. A strictly decentralized adaptive control scheme is developed, wherein each subsystem has access only to its own state but has the knowledge of all reference model states. The mismatch is estimated online for each subsystem and the mismatch estimates are used to adaptively modify the corresponding reference models. The adaptive control scheme is extended to the case with actuator failures in addition to mismatch.

  12. Decentralized adaptive control of interconnected nonlinear systems with unknown control directions.

    Science.gov (United States)

    Huang, Jiangshuai; Wang, Qing-Guo

    2018-03-01

    In this paper, we propose a decentralized adaptive control scheme for a class of interconnected strict-feedback nonlinear systems without a priori knowledge of subsystems' control directions. To address this problem, a novel Nussbaum-type function is proposed and a key theorem is drawn which involves quantifying the interconnections of multiple Nussbaum-type functions of the subsystems with different control directions in a single inequality. Global stability of the closed-loop system and asymptotic stabilization of subsystems' output are proved and a simulation example is given to illustrate the effectiveness of the proposed control scheme. Copyright © 2018 ISA. Published by Elsevier Ltd. All rights reserved.

  13. Understanding price discovery in interconnected markets: Generalized Langevin process approach and simulation

    Science.gov (United States)

    Schenck, Natalya A.; Horvath, Philip A.; Sinha, Amit K.

    2018-02-01

    While the literature on price discovery process and information flow between dominant and satellite market is exhaustive, most studies have applied an approach that can be traced back to Hasbrouck (1995) or Gonzalo and Granger (1995). In this paper, however, we propose a Generalized Langevin process with asymmetric double-well potential function, with co-integrated time series and interconnected diffusion processes to model the information flow and price discovery process in two, a dominant and a satellite, interconnected markets. A simulated illustration of the model is also provided.

  14. Wind/PV Generation for Frequency Regulation and Oscillation Damping in the Eastern Interconnection

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Yong [Univ. of Tennessee, Knoxville, TN (United States); Gracia, Jose R. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Hadley, Stanton W. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Liu, Yilu [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2013-12-01

    This report presents the control of renewable energy sources, including the variable-speed wind generators and solar photovoltaic (PV) generators, for frequency regulation and inter-area oscillation damping in the U.S. Eastern Interconnection (EI). In this report, based on the user-defined wind/PV generator electrical control model and the 16,000-bus Eastern Interconnection dynamic model, the additional controllers for frequency regulation and inter-area oscillation damping are developed and incorporated and the potential contributions of renewable energy sources to the EI system frequency regulation and inter-area oscillation damping are evaluated.

  15. Economic Valuation of Reserves on Cross Border Interconnections; A Danish Case Study

    DEFF Research Database (Denmark)

    Farashbashi-Astaneh, Seyed-Mostafa; Rather, Zakir Hussain; Hu, Weihao

    2014-01-01

    regions that plan for high penetration of intermittent renewables. Extreme intermittency in the nature of wind power imposes elevated risk levels to power system operation. This every day challenge of wind dominant power systems necessitate the crucial role of operating reserves. In this paper, we propose...... benefit of reserve provision provided by cross border interconnections. The focus here will be on reserve services from abundant hydropower resource in Norway, taking advantage of fast VSC-based HVDC interconnection that is expected to be commissioned in immediate coming years....

  16. Characterization of Local Strain around Through-Silicon Via Interconnects by Using X-ray Microdiffraction

    Science.gov (United States)

    Nakatsuka, Osamu; Kitada, Hideki; Kim, Youngsuk; Mizushima, Yoriko; Nakamura, Tomoji; Ohba, Takayuki; Zaima, Shigeaki

    2011-05-01

    We have demonstrated the characterization of the local strain structure in thinned Si layers for wafer-on-a-wafer (WOW) applications by using X-ray microdiffraction with a synchrotron radiation source. The microdiffraction reveals the fluctuation of strains in the thin Si layer around through-silicon via (TSV) interconnects with a sub-micrometer scale. We can separately estimated the in-plane and out-of-plane strain structures in the Si layer, and found that the anisotropic strain is induced in the Si layer between the TSV interconnects.

  17. Open system LANs and their global interconnection electronics and communications reference series

    CERN Document Server

    Houldsworth, Jack; Caves, Keith; Mazda, FF

    2014-01-01

    Open System LANs and Their Global Interconnection focuses on the OSI layer 1 to 4 standards (the OSI bearer service) and also introduces TCP/IP and some of the proprietary PC Local Area Network (LAN) standards.The publication first provides an introduction to Local Area Networks (LANs) and Wide Area Networks (WANs), Open Systems Interconnection (OSI), and LAN standards. Discussions focus on MAC bridging, token bus, slotted ring, MAC constraints and design considerations, OSI functional standards, OSI model, value of the transport model, benefits and origins of OSI, and significance of the tran

  18. Analytical Model based on Green Criteria for Optical Backbone Network Interconnection

    DEFF Research Database (Denmark)

    Gutierrez Lopez, Jose Manuel; Riaz, M. Tahir; Pedersen, Jens Myrup

    2011-01-01

    to the evaluation of the environmental impact of networks from physical interconnection point of view. Networks deployment, usage, and disposal are analyzed as contributing elements to ICT’s (Information and Communications Technology) CO2 emissions. This paper presents an analytical model for evaluating...... for backbone’s interconnection, since minimization of CO2 emissions is becoming an important factor. In addition, two case studies are presented to illustrate the use and application of this model, and the need for de facto and international standards to reduce CO2 emissions through good network planning....

  19. Development of Readout Interconnections for the Si-W Calorimeter of SiD

    Energy Technology Data Exchange (ETDEWEB)

    Woods, M.; Fields, R.G.; Holbrook, B.; Lander, R.L.; Moskaleva, A.; Neher, C.; Pasner, J.; Tripathi, M.; /UC, Davis; Brau, J.E.; Frey, R.E.; Strom, D.; /Oregon U.; Breidenbach, M.; Freytag, D.; Haller, G.; Herbst, R.; Nelson, T.; /SLAC; Schier, S.; Schumm, B.; /UC, Santa Cruz

    2012-09-14

    The SiD collaboration is developing a Si-W sampling electromagnetic calorimeter, with anticipated application for the International Linear Collider. Assembling the modules for such a detector will involve special bonding technologies for the interconnections, especially for attaching a silicon detector wafer to a flex cable readout bus. We review the interconnect technologies involved, including oxidation removal processes, pad surface preparation, solder ball selection and placement, and bond quality assurance. Our results show that solder ball bonding is a promising technique for the Si-W ECAL, and unresolved issues are being addressed.

  20. Incorporation of in-plane interconnects to reflow bonding for electrical functionality

    International Nuclear Information System (INIS)

    Moğulkoç, B; Jansen, H V; Ter Brake, H J M; Elwenspoek, M C

    2011-01-01

    Incorporation of in-plane electrical interconnects to reflow bonding is studied to provide electrical functionality to lab-on-a-chip or microfluidic devices. Reflow bonding is the packaging technology, in which glass tubes are joined to silicon substrates at elevated temperatures. The tubes are used to interface the silicon-based fluidic devices and are directly compatible with standard Swagelok® connectors. After the bonding, the electrically conductive lines will allow probing into the volume confined by the tube, where the fluidic device operates. Therefore methods for fabricating electrical interconnects that survive the bonding procedure at elevated temperature and do not alter the properties of the bond interface are investigated

  1. Infrared differential interference contrast microscopy for 3D interconnect overlay metrology.

    Science.gov (United States)

    Ku, Yi-sha; Shyu, Deh-Ming; Lin, Yeou-Sung; Cho, Chia-Hung

    2013-08-12

    One of the main challenges for 3D interconnect metrology of bonded wafers is measuring through opaque silicon wafers using conventional optical microscopy. We demonstrate here the use infrared microscopy, enhanced by implementing the differential interference contrast (DIC) technique, to measure the wafer bonding overlay. A pair of two dimensional symmetric overlay marks were processed at both the front and back sides of thinned wafers to evaluate the bonding overlay. A self-developed analysis algorithm and theoretical fitting model was used to map the overlay error between the bonded wafers and the interconnect structures. The measurement accuracy was found to be better than 1.0 micron.

  2. Making connections: Case studies of interconnection barriers and their impact on distributed power projects

    Energy Technology Data Exchange (ETDEWEB)

    Alderfer, B.; Eldridge, M.; Starrs, T.

    2000-07-25

    Distributed power is modular electric generation or storage located close to the point of use. Based on interviews of distributed generation project proponents, this report reviews the barriers that distributed generators of electricity are encountering when attempting to interconnect to the electrical grid. Descriptions of 26 of 65 case studies are included in the report. The survey found and the report describes a wide range of technical, business-practice, and regulatory barriers to interconnection. An action plan for reducing the impact of these barriers is also included.

  3. Methodology and results of risk assessment of interconnections within the JET active gas handling system

    International Nuclear Information System (INIS)

    Ballantyne, P.R.; Bell, A.C.; Konstantellos, A.; Hemmerich, J.L.

    1992-01-01

    The Joint European Torus (JET) Active Gas Handling System (AGHS) is a complex interconnection of numerous subsystems. While individual subsystems were assessed for their risk of operation, an assessment of the effects of inadvertent interconnections was needed. A systematic method to document the assessment was devised to ease the assessment of complex plant and was applied to the AGHS. The methodology, application to AGHS, the four critical issues and required plant modifications as a result of this assessment are briefly discussed in this paper

  4. Opto-VLSI-based reconfigurable free-space optical interconnects architecture

    DEFF Research Database (Denmark)

    Aljada, Muhsen; Alameh, Kamal; Chung, Il-Sug

    2007-01-01

    is the Opto-VLSI processor which can be driven by digital phase steering and multicasting holograms that reconfigure the optical interconnects between the input and output ports. The optical interconnects architecture is experimentally demonstrated at 2.5 Gbps using high-speed 1×3 VCSEL array and 1......×3 photoreceiver array in conjunction with two 1×4096 pixel Opto-VLSI processors. The minimisation of the crosstalk between the output ports is achieved by appropriately aligning the VCSEL and PD elements with respect to the Opto-VLSI processors and driving the latter with optimal steering phase holograms....

  5. Renewable Electricity Futures: Operational Analysis of the Western Interconnection at Very High Renewable Penetrations

    Energy Technology Data Exchange (ETDEWEB)

    Brinkman, Gregory [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2015-09-01

    The goal of this work was to perform a detailed, sub-hourly analysis of very high penetration scenarios for a single interconnection (the Western Interconnection). The scenarios analyzed for this study included a variety of generation infrastructure buildouts and power system operational assumptions, with three different portfolios of renewable generators. The primary conclusion of this study is that sub-hourly operation of the grid is possible with renewable generation levels between 80% and 90%. Dynamic studies will need to be done to understand any impacts on reliability during contingencies and transient events.

  6. Panel C report: Standards needed for the use of ISO Open Systems Interconnection - basic reference model

    Science.gov (United States)

    1981-01-01

    The use of an International Standards Organization (ISO) Open Systems Interconnection (OSI) Reference Model and its relevance to interconnecting an Applications Data Service (ADS) pilot program for data sharing is discussed. A top level mapping between the conjectured ADS requirements and identified layers within the OSI Reference Model was performed. It was concluded that the OSI model represents an orderly architecture for the ADS networking planning and that the protocols being developed by the National Bureau of Standards offer the best available implementation approach.

  7. Interconnecting PV on New York City's Secondary Network Distribution System

    Energy Technology Data Exchange (ETDEWEB)

    Anderson, K; Coddington, M; Burman, K; Hayter, S; Kroposki, B; Watson, and A

    2009-11-01

    The U.S. Department of Energy (DOE) has teamed with cities across the country through the Solar America Cities (SAC) partnership program to help reduce barriers and accelerate implementation of solar energy. The New York City SAC team is a partnership between the City University of New York (CUNY), the New York City Mayor s Office of Long-term Planning and Sustainability, and the New York City Economic Development Corporation (NYCEDC).The New York City SAC team is working with DOE s National Renewable Energy Laboratory (NREL) and Con Edison, the local utility, to develop a roadmap for photovoltaic (PV) installations in the five boroughs. The city set a goal to increase its installed PV capacity from1.1 MW in 2005 to 8.1 MW by 2015 (the maximum allowed in 2005). A key barrier to reaching this goal, however, is the complexity of the interconnection process with the local utility. Unique challenges are associated with connecting distributed PV systems to secondary network distribution systems (simplified to networks in this report). Although most areas of the country use simpler radial distribution systems to distribute electricity, larger metropolitan areas like New York City typically use networks to increase reliability in large load centers. Unlike the radial distribution system, where each customer receives power through a single line, a network uses a grid of interconnected lines to deliver power to each customer through several parallel circuits and sources. This redundancy improves reliability, but it also requires more complicated coordination and protection schemes that can be disrupted by energy exported from distributed PV systems. Currently, Con Edison studies each potential PV system in New York City to evaluate the system s impact on the network, but this is time consuming for utility engineers and may delay the customer s project or add cost for larger installations. City leaders would like to streamline this process to facilitate faster, simpler, and

  8. Formalized Interconnected Guidelines on Cardiovascular Disease Prevention and Those for Management of Diabetes, Dyslipidemia and Hypertension

    Czech Academy of Sciences Publication Activity Database

    Peleška, Jan; Anger, Z.; Buchtela, David; Tomečková, Marie; Veselý, Arnošt; Zvárová, Jana

    24 Suppl. 4, - (2006), s. 172-172 ISSN 0263-6352. [European Meeting on Hypertension /16./. 12.06.2006-15.06.2006, Madrid] R&D Projects: GA AV ČR 1ET200300413 Institutional research plan: CEZ:AV0Z10300504 Keywords : computer presentation * interconnected medical guidelines * cardiovascular prevention Subject RIV: FA - Cardiovascular Diseases incl. Cardiotharic Surgery

  9. Psychological Momentum During and Across Sports Matches : Evidence for Interconnected Time Scales

    NARCIS (Netherlands)

    Den Hartigh, Ruud J.R.; Van Geert, Paul L.C.; Van Yperen, Nico W.; Cox, Ralf F.A; Gernigon, Christophe

    This study on psychological momentum (PM) in sports provides the first experimental test of an interconnection between short-term PM (during a match) and long-term PM (across a series of matches). Twenty-two competitive athletes were striving to win a prize during a rowing-ergometer tournament,

  10. 14 CFR 129.111 - Electrical wiring interconnection systems (EWIS) maintenance program.

    Science.gov (United States)

    2010-01-01

    ... 14 Aeronautics and Space 3 2010-01-01 2010-01-01 false Electrical wiring interconnection systems (EWIS) maintenance program. 129.111 Section 129.111 Aeronautics and Space FEDERAL AVIATION... ENGAGED IN COMMON CARRIAGE Continued Airworthiness and Safety Improvements § 129.111 Electrical wiring...

  11. Adaptive Neural Networks Prescribed Performance Control Design for Switched Interconnected Uncertain Nonlinear Systems.

    Science.gov (United States)

    Li, Yongming; Tong, Shaocheng

    2017-06-28

    In this paper, an adaptive neural networks (NNs)-based decentralized control scheme with the prescribed performance is proposed for uncertain switched nonstrict-feedback interconnected nonlinear systems. It is assumed that nonlinear interconnected terms and nonlinear functions of the concerned systems are unknown, and also the switching signals are unknown and arbitrary. A linear state estimator is constructed to solve the problem of unmeasured states. The NNs are employed to approximate unknown interconnected terms and nonlinear functions. A new output feedback decentralized control scheme is developed by using the adaptive backstepping design technique. The control design problem of nonlinear interconnected switched systems with unknown switching signals can be solved by the proposed scheme, and only a tuning parameter is needed for each subsystem. The proposed scheme can ensure that all variables of the control systems are semi-globally uniformly ultimately bounded and the tracking errors converge to a small residual set with the prescribed performance bound. The effectiveness of the proposed control approach is verified by some simulation results.

  12. A note on nonlinear H∞ control of two-block interconnected systems

    NARCIS (Netherlands)

    Dalsmo, Morten; Schaft, Arjan J. van der

    1997-01-01

    In this paper nonlinear H∞ control for a class of two-block interconnected systems is investigated. The situation where the regular nonlinear H∞ suboptimal control problem is solvable for one of the blocks is considered. An auxiliary nonlinear system is defined from the original two-block system,

  13. 2D Modelling of Mechanical Stress Evolution and Electromigration in Confined Aluminium Interconnects

    NARCIS (Netherlands)

    Petrescu, V.; Mouthaan, A.J.

    1997-01-01

    A complete description for mechanical stress evolution and electromigration in confined Al interconnects, taking into account the microstructure features, is presented in this paper. In the last years there were proposed several 1D models for the time-dependent evolution of the mechanical stress in

  14. 77 FR 6110 - Bishop Hill Interconnection LLC; Supplemental Notice that Initial Market-Based Rate Filing...

    Science.gov (United States)

    2012-02-07

    ... DEPARTMENT OF ENERGY Federal Energy Regulatory Commission [Docket No. ER12-845-000] Bishop Hill Interconnection LLC; Supplemental Notice that Initial Market-Based Rate Filing Includes Request for Blanket Section 204 Authorization This is a supplemental notice in the above-referenced proceeding of Bishop Hill...

  15. Cost and Availability Analysis of 2- and 3-Connected WDM Networks Physical Interconnection

    DEFF Research Database (Denmark)

    Gutierrez Lopez, Jose Manuel; Riaz, M. Tahir; Pedersen, Jens Myrup

    2012-01-01

    for the best trade-off among the relevant parameters for the network. In this paper we analyze this trade-off by studying 2-and 3-connected graphs to be used as WDM (Wavelength Division Multiplexing) networks physical infrastructure. The experiments show how the way links are distributed to interconnect...

  16. Foil-to-foil lamination and electrical interconnection of printed components on flexible substrates

    NARCIS (Netherlands)

    Vásquez Quintero, A.; Remoortere, B. van; Smits, E.C.P.; Brand, J. van den; Briand, D.; Schoo, H.F.M.; Rooij, N.F. de

    2013-01-01

    This paper describes and compares two integration methods to structurally laminate and interconnect foil-based components with flexible polymeric substrates. The first method uses isotropic conductive adhesives (ICA) confined in laser-ablated through foil vias (TFV), while the second one uses an

  17. A Hub Location Problem with Fully Interconnected Backbone and Access Networks

    DEFF Research Database (Denmark)

    Thomadsen, Tommy; Larsen, Jesper

    2007-01-01

    This paper considers the design of two-layered fully interconnected networks. A two-layered network consists of clusters of nodes, each defining an access network and a backbone network. We consider the integrated problem of determining the access networks and the backbone network simultaneously....

  18. Highly graphitized laterally interconnected SWCNT network synthesis via a sandwich-grown method

    International Nuclear Information System (INIS)

    Teng, I-Ju; Chen, Kai-Ling; Wang, Li-Chun; Kuo, Cheng-Tzu; Hsu, Hui-Lin; Jian, Sheng-Rui; Chen, Jung-Hsuan; Wang, Wei-Hsiang

    2011-01-01

    We present a sandwich-grown method for growing laterally interconnected single-walled carbon nanotube (SWCNT) networks with a high degree of graphitization by microwave plasma chemical vapour deposition (MPCVD). An Al 2 O 3 -supported Fe catalyst precursor layer deposited on an oxidized Si substrate with an upper Si cover is first pretreated in pure hydrogen, and then exposed to a gas mixture of methane/hydrogen for growth process at a lower growth temperature and a faster rate. The effects of various parameters, such as catalyst film thickness, gas flow rate, working pressure, growth time and plasma power, on the morphologies and structural characteristics of the SWCNT networks are investigated, and therefore provide the essential conditions for direct growth of laterally interconnected SWCNT networks. Analytical results demonstrate that the SWCNT-based lateral architecture comprises a mixture of graphene-sheet-wrapped catalyst particles and laterally interconnected nanotubes, isolated or branched or assembled into bundles. The results also show that the formation of the laterally interconnected SWCNT networks is related to the sandwich-like stack approach and the addition of an Al 2 O 3 layer in the MPCVD process. The successful growth of lateral SWCNT networks provides new experimental information for simply and efficiently preparing lateral SWCNTs on unpatterned substrates, and opens a pathway to create network-structured nanotube-based devices.

  19. Power Consumption and BER of Flip-Flop Inserted Global Interconnect

    Directory of Open Access Journals (Sweden)

    Jingye Xu

    2007-01-01

    Full Text Available In nanometer scale integrated circuits, concurrent insertion of repeaters and sequential elements into the global interconnect lines has been proposed to support multicycle communication—a concept known as interconnect pipelining. The design targets of an interconnect-pipelining scheme are to ensure high reliability, low-power consumption, and less delay cycles. This paper presents an in-depth analysis of the reliability in terms of bit error rate (BER and the power consumption of wire-pipelining scheme. In this analysis, the dependencies of power consumption and BER on the number of inserted flip-flops, and the size of repeaters are illustrated. To trade off the design targets (wire delay, BER, and power consumption, a methodology is developed to optimize the repeater size and the number of flip-flops inserted which maximize a user-specified figure of merit. The methodology is demonstrated by calculating optimal solutions for interconnect pipelining for some International Technology Roadmap for Semiconductor technology nodes.

  20. Investigation and experimental validation of the contribution of optical interconnects in the SYMPHONIE massively parallel computer

    International Nuclear Information System (INIS)

    Scheer, Patrick

    1998-01-01

    Progress in microelectronics lead to electronic circuits which are increasingly integrated, with an operating frequency and an inputs/outputs count larger than the ones supported by printed circuit board and back-plane technologies. As a result, distributed systems with several boards cannot fully exploit the performance of integrated circuits. In synchronous parallel computers, the situation is worsen since the overall system performances rely on the efficiency of electrical interconnects between the integrated circuits which include the processing elements (PE). The study of a real parallel computer named SYMPHONIE shows for instance that the system operating frequency is far smaller than the capabilities of the microelectronics technology used for the PE implementation. Optical interconnections may cancel these limitations by providing more efficient connections between the PE. Especially, free-space optical interconnections based on vertical-cavity surface-emitting lasers (VCSEL), micro-lens and PIN photodiodes are compatible with the required features of the PE communications. Zero bias modulation of VCSEL with CMOS-compatible digital signals is studied and experimentally demonstrated. A model of the propagation of truncated gaussian beams through micro-lenses is developed. It is then used to optimise the geometry of the detection areas. A dedicated mechanical system is also proposed and implemented for integrating free-space optical interconnects in a standard electronic environment, representative of the one of parallel computer systems. A specially designed demonstrator provides the experimental validation of the above physical concepts. (author) [fr

  1. Early resistance change and stress/electromigration evolution in near bamboo interconnects

    NARCIS (Netherlands)

    Petrescu, V.; Mouthaan, A.J.; Dima, G.; Govoreanu, B.; Mitrea, O.; Profirescu, M.

    1997-01-01

    A complete description for early resistance change and mechanical stress evolution in near-bamboo interconnects, related to the electromigration, is given in this paper. The proposed model, for the first time, combines the stress/vacancy concentration evolution with the early resistance change of

  2. Floating dielectric slab optical interconnection between metal-dielectric interface surface plasmon polariton waveguides.

    Science.gov (United States)

    Kang, Minsu; Park, Junghyun; Lee, Il-Min; Lee, Byoungho

    2009-01-19

    A simple and effective optical interconnection which connects two distanced single metal-dielectric interface surface plasmon waveguides by a floating dielectric slab waveguide (slab bridge) is proposed. Transmission characteristics of the suggested structure are numerically studied using rigorous coupled wave analysis, and design rules based on the study are given. In the wave-guiding part, if the slab bridge can support more than the fundamental mode, then the transmission efficiency of the interconnection shows strong periodic dependency on the length of the bridge, due to the multi-mode interference (MMI) effect. Otherwise, only small fluctuation occurs due to the Fabry-Pérot effect. In addition, light beating happens when the slab bridge is relatively short. In the wave-coupling part, on the other hand, gap-assisted transmission occurs at each overlapping region as a consequence of mode hybridization. Periodic dependency on the length of the overlap region also appears due to the MMI effect. According to these results, we propose design principles for achieving both high transmission efficiency and stability with respect to the variation of the interconnection distance, and we show how to obtain the transmission efficiency of 68.3% for the 1mm-long interconnection.

  3. Low energy routing platforms for optical interconnects using active plasmonics integrated with Silicon Photonics

    DEFF Research Database (Denmark)

    Vyrsokinos, K.; Papaioannou, S.; Kalavrouziotis, D.

    2013-01-01

    Power consumption and bandwidth of electronics appear as the main set of technology barriers in next-generation Data Center and High-Performance Computing (HPC) environments. The limited capacity and pitch lane of electrically wired interconnects require the development of new disruptive technolo...

  4. On analysis and control of interconnected finite- and infinite-dimensional physical systems

    NARCIS (Netherlands)

    Ramkrishna Pasumarthy, R.P.; Pasumarthy, Ramkrishna

    2006-01-01

    This thesis is aimed at the analysis, control and simulation of complex physical systems from different domains. We use the recently developed framework of port-Hamiltonian systems which formalizes the interconnection structure of the system through a geometric object called a Dirac structure. It

  5. 2D and 3D interconnect fabrication by picosecond Laser Induced Forward Transfer

    NARCIS (Netherlands)

    Oosterhuis, G.; Huis in 't veld, A.J.; Chall, P.

    2011-01-01

    Interconnects are an important cost driver in advanced 3D chip packaging. This holds for Through Silicon Vias (TSV) for chip stacking, but also for other integrated Si-technology. Especially in applications with a low number (<100 mm-2) of relatively large (10-2- um diameter), high aspect ratio

  6. Review of PREPA Technical Requirements for Interconnecting Wind and Solar Generation

    Energy Technology Data Exchange (ETDEWEB)

    Gevorgian, Vahan [National Renewable Energy Lab. (NREL), Golden, CO (United States); Booth, Sarah [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2013-11-01

    The Puerto Rico Electric Power Authority developed the minimum technical requirements for interconnection of wind turbine generation and photovoltaic power plants. NREL has conducted a review of these requirements based on generic technical aspects and electrical characteristics of wind and photovoltaic power plants, and on existing requirements from other utilities (both U.S. and European).

  7. 3D interconnect technology based on low temperature copper nanoparticle sintering

    NARCIS (Netherlands)

    Zhang, B.; Carisey, Y.C.P.; Damian, A.; Poelma, R.H.; Zhang, G.Q.; van Zeijl, H.W.; Bi, Keyun; Liu, Sheng; Zhou, Shengjun

    2016-01-01

    We explore a methodology for patterned copper nanoparticle paste for 3D interconnect applications in wafer to wafer (W2W) bonding. A novel fine pitch thermal compression bonding process (sintering) with coated copper nanoparticle paste was developed. Most of the particle size is between 10-30 nm.

  8. VoIP interconnection ; between Internet, Cable, Mobile and Fixed Worlds

    NARCIS (Netherlands)

    Deventer, M.O. van; Keesmaat, I.

    2005-01-01

    Four worlds on their own that hardly interconnect; All use SIP, but differently - Internet world - Mobile world - Cable world - Fixed world - At most, only basic voice service will interoperate between those worlds In recent years, VoIP/multimedia services (VoIP: Voice over Internet Protocol) have

  9. Reliable inkjet-printed interconnections on foil-type Li-Ion Batteries

    NARCIS (Netherlands)

    Palacios-Aguilera, N.B.; Visser, H.A.; Sridhar, A.; Balda-Irurzun, U.; Vargas-Llona, L.D.; Zhou, J.; Akkerman, R.; French, P.J.; Bossche, A.

    2013-01-01

    Shapeable rechargeable Li-ion batteries are a good option for the power source of system-in-package devices; nevertheless, their size and temperature limitations are a constraint during the fabrication process. Inkjet-printed interconnections on top of the battery are proposed in order to reduce the

  10. 75 FR 6020 - Electrical Interconnection of the Lower Snake River Wind Energy Project

    Science.gov (United States)

    2010-02-05

    ... DEPARTMENT OF ENERGY Bonneville Power Administration Electrical Interconnection of the Lower Snake River Wind Energy Project AGENCY: Bonneville Power Administration (BPA), Department of Energy (DOE... would be generated from their proposed Lower Snake River Wind Energy Project (Wind Project) in Garfield...

  11. Overcoming Barriers to Rural Children's Mental Health: An Interconnected Systems Public Health Model

    Science.gov (United States)

    Huber, Brenda J.; Austen, Julie M.; Tobin, Renée M.; Meyers, Adena B.; Shelvin, Kristal H.; Wells, Michael

    2016-01-01

    A large, Midwestern county implemented a four-tiered public health model of children's mental health with an interconnected systems approach involving education, health care, juvenile justice and community mental health sectors. The community sought to promote protective factors in the lives of all youth, while improving the capacity,…

  12. 47 CFR 101.137 - Interconnection of private operational fixed point-to-point microwave stations.

    Science.gov (United States)

    2010-10-01

    ... point-to-point microwave stations. 101.137 Section 101.137 Telecommunication FEDERAL COMMUNICATIONS COMMISSION (CONTINUED) SAFETY AND SPECIAL RADIO SERVICES FIXED MICROWAVE SERVICES Technical Standards § 101.137 Interconnection of private operational fixed point-to-point microwave stations. Private...

  13. Effect of internal stresses on thermo-mechanical stability of interconnect structures in microelectronic devices

    International Nuclear Information System (INIS)

    Dutta, I.; Park, C.; Vella, J.

    2006-01-01

    Interconnect structures in microelectronic devices can deform via unusual, scale-sensitive phenomena due to thermo-mechanical loads sustained during processing, or during service as part of a microelectronic package. Examples include creep/plasticity of Cu interconnect lines embedded in a dielectric layer at the back-end of Si chip, and diffusionally accommodated sliding at Cu-dielectric interfaces. These effects may result in in-plane (IP) changes in Cu line dimensions, cause strain incompatibilities between Cu and LKD in the out-of-plane (OOP) direction, and cause Cu lines to migrate or crawl under far-field shear stresses imposed by the package. In this paper, a shear-lag based model is utilized to simulate IP and OOP deformation in a Cu-LKD interconnect structure on a Si substrate under thermal cycling conditions associated with processing. A separate model, which simulates IP deformation of Cu interconnects embedded in LKD under thermo-mechanical cycling conditions imposed when the chip is attached to a package, is also presented. The models, which incorporate a constitutive interfacial sliding law developed previously, help rationalize experimental atomic force microscopy (AFM) observations of inelastic strain accrual in Cu lines, and the development of dimensional incompatibility between adjoining components in devices, during thermal cycling

  14. Unavailability of critical SCADA communication links interconnecting a power grid and a Telco network

    International Nuclear Information System (INIS)

    Bobbio, A.; Bonanni, G.; Ciancamerla, E.; Clemente, R.; Iacomini, A.; Minichino, M.; Scarlatti, A.; Terruggia, R.; Zendri, E.

    2010-01-01

    The availability of power supply to power grid customers depends upon the availability of services of supervision, control and data acquisition (SCADA) system, which constitutes the nervous system of a power grid. In turn, SCADA services depend on the availability of the interconnected networks supporting such services. We propose a service oriented stochastic modelling methodology to investigate the availability of large interconnected networks, based on the hierarchical application of different modelling formalisms to different parts of the networks. Interconnected networks are decomposed according to the specific services delivered until the failure and repair mechanisms of the decomposed elementary blocks can be identified. We represent each network by a convenient stochastic modelling formalism, able to capture the main technological issues and to cope with realistic assumptions about failure and recovery mechanisms. This procedure confines the application of the more intensive computational techniques to those subsystems that actually require it. The paper concentrates on an actual failure scenario, occurred in Rome in January 2004 that involved the outage of critical SCADA communication links, interconnecting a power grid and a Telco network.

  15. A combined SEM and CV Study of Solid Oxide Fuel Cell Interconnect Steels

    DEFF Research Database (Denmark)

    Kammer Hansen, Kent; Ofoegbu, Stanley; Mikkelsen, Lars

    2012-01-01

    Scanning electron microscopy and cyclic voltammetry were used to investigate the high temperature oxidation behavior of two solid oxide fuel cell interconnect steels. One alloy had a low content of manganese; the other alloy had a high content of manganese. Four reduction and four oxidation peaks...

  16. Record of Decision for the Electrical Interconnection of the Windy Point Wind Energy Project.

    Energy Technology Data Exchange (ETDEWEB)

    United States. Bonneville Power Administration.

    2006-11-01

    The Bonneville Power Administration (BPA) has decided to offer contract terms for interconnection of 250 megawatts (MW) of power to be generated by the proposed Windy Point Wind Energy Project (Wind Project) into the Federal Columbia River Transmission System (FCRTS). Windy Point Partners, LLC (WPP) propose to construct and operate the proposed Wind Project and has requested interconnection to the FCRTS. The Wind Project will be interconnected at BPA's Rock Creek Substation, which is under construction in Klickitat County, Washington. The Rock Creek Substation will provide transmission access for the Wind Project to BPA's Wautoma-John Day No.1 500-kilovolt (kV) transmission line. BPA's decision to offer terms to interconnect the Wind Project is consistent with BPA's Business Plan Final Environmental Impact Statement (BP EIS) (DOE/EIS-0183, June 1995), and the Business Plan Record of Decision (BP ROD, August 15, 1995). This decision thus is tiered to the BP ROD.

  17. U.S. Laws and Regulations for Renewable Energy Grid Interconnections

    Energy Technology Data Exchange (ETDEWEB)

    Chernyakhovskiy, Ilya [National Renewable Energy Lab. (NREL), Golden, CO (United States); Tian, Tian [National Renewable Energy Lab. (NREL), Golden, CO (United States); McLaren, Joyce [National Renewable Energy Lab. (NREL), Golden, CO (United States); Miller, Mackay [National Renewable Energy Lab. (NREL), Golden, CO (United States); Geller, Nina [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2016-09-01

    Rapidly declining costs of wind and solar energy technologies, increasing concerns about the environmental and climate change impacts of fossil fuels, and sustained investment in renewable energy projects all point to a not-so-distant future in which renewable energy plays a pivotal role in the electric power system of the 21st century. In light of public pressures and market factors that hasten the transition towards a low-carbon system, power system planners and regulators are preparing to integrate higher levels of variable renewable generation into the grid. Updating the regulations that govern generator interconnections and operations is crucial to ensure system reliability while creating an enabling environment for renewable energy development. This report presents a chronological review of energy laws and regulations concerning grid interconnection procedures in the United States, highlighting the consequences of policies for renewable energy interconnections. Where appropriate, this report places interconnection policies and their impacts on renewable energy within the broader context of power market reform.

  18. Interconnecting Governments, Businesses and Citizens : A Comparison of Two Digital Infrastructures

    NARCIS (Netherlands)

    Klievink, A.J.; Zuiderwijk-van Eijk, A.M.G.; Janssen, M.F.W.H.A.

    2014-01-01

    Public and private organizations in various areas are setting up digital Information Infrastructures (IIs) for interconnecting government, businesses and citizens. IIs can create value by sharing and integrating data of multiple ac-tors. This can be the basis for value added services and especially

  19. Evaluation of Perovskite Overlay Coatings on Ferritic Stainless Steels for SOFC Interconnect Applications

    Energy Technology Data Exchange (ETDEWEB)

    Yang, Z Gary; Xia, Gordon; Maupin, Gary D.; Stevenson, Jeffry W.

    2006-08-02

    Conductive oxide coatings are used to improve electrical performance and surface stability of metallic interconnects, as well as to mitigate or prevent chromium poisoning in solid oxide fuel cells (SOFCs). To further understand materials suitability and shed light on mass transport, two conductive perovskites, were taken as examples and applied as dense coatings via radio frequency (rf)-sputtering on three stainless steels.

  20. Electrohydrodynamic direct—writing of conductor—insulator-conductor multi-layer interconnection

    International Nuclear Information System (INIS)

    Zheng Gao-Feng; Pei Yan-Bo; Wang Xiang; Zheng Jian-Yi; Sun Dao-Heng

    2014-01-01

    A multi-layer interconnection structure is a basic component of electronic devices, and printing of the multi-layer interconnection structure is the key process in printed electronics. In this work, electrohydrodynamic direct-writing (EDW) is utilized to print the conductor—insulator—conductor multi-layer interconnection structure. Silver ink is chosen to print the conductor pattern, and a polyvinylpyrrolidone (PVP) solution is utilized to fabricate the insulator layer between the bottom and top conductor patterns. The influences of EDW process parameters on the line width of the printed conductor and insulator patterns are studied systematically. The obtained results show that the line width of the printed structure increases with the increase of the flow rate, but decreases with the increase of applied voltage and PVP content in the solution. The average resistivity values of the bottom and top silver conductor tracks are determined to be 1.34 × 10 −7 Ω·m and 1.39 × 10 −7 Ω·m, respectively. The printed PVP layer between the two conductor tracks is well insulated, which can meet the insulation requirement of the electronic devices. This study offers an alternative, fast, and cost-effective method of fabricating conductor—insulator—conductor multi-layer interconnections in the electronic industry

  1. Three-dimensional interconnected nickel phosphide networks with hollow microstructures and desulfurization performance

    International Nuclear Information System (INIS)

    Zhang, Shuna; Zhang, Shujuan; Song, Limin; Wu, Xiaoqing; Fang, Sheng

    2014-01-01

    Graphical abstract: Three-dimensional interconnected nickel phosphide networks with hollow microstructures and desulfurization performance. - Highlights: • Three-dimensional Ni 2 P has been prepared using foam nickel as a template. • The microstructures interconnected and formed sponge-like porous networks. • Three-dimensional Ni 2 P shows superior hydrodesulfurization activity. - Abstract: Three-dimensional microstructured nickel phosphide (Ni 2 P) was fabricated by the reaction between foam nickel (Ni) and phosphorus red. The as-prepared Ni 2 P samples, as interconnected networks, maintained the original mesh structure of foamed nickel. The crystal structure and morphology of the as-synthesized Ni 2 P were characterized by X-ray diffraction, scanning electron microscopy, automatic mercury porosimetry and X-ray photoelectron spectroscopy. The SEM study showed adjacent hollow branches were mutually interconnected to form sponge-like networks. The investigation on pore structure provided detailed information for the hollow microstructures. The growth mechanism for the three-dimensionally structured Ni 2 P was postulated and discussed in detail. To investigate its catalytic properties, SiO 2 supported three-dimensional Ni 2 P was prepared successfully and evaluated for the hydrodesulfurization (HDS) of dibenzothiophene (DBT). DBT molecules were mostly hydrogenated and then desulfurized by Ni 2 P/SiO 2

  2. The economic impacts of a submarine HVDC interconnection between Norway and Great Britain

    International Nuclear Information System (INIS)

    Doorman, Gerard L.; Frøystad, Dag Martin

    2013-01-01

    In the present paper we analyze the profitability of different HVDC interconnection alternatives between Norway and Great Britain for present and future scenarios. The analysis is done from a merchant and a social welfare perspective. The analyses include interconnections between Norway and Scotland and Southern Great Britain, respectively, as well as an alternative link to a future offshore wind farm. From a social welfare perspective the northern interconnection alternative is profitable under all sets of assumptions. The southern alternative is profitable under present conditions, but less than the northern alternative. The alternative link to the offshore wind park is not profitable, but this result is highly dependent on market conditions. From a merchant perspective none of the alternatives is profitable, clearly illustrating that leaving investments to commercial parties does not realize all projects that increase social welfare. - Highlights: • Profitability of interconnection between Norway and GB is analyzed using simulation. • The Northern alternative increases social welfare under all assumptions. • None of the alternatives is profitable from a merchant perspective. • A link to a prospective wind farm 200 km from the GB coast is not profitable. • Social welfare increasing infrastructure may not be built on commercial conditions

  3. A GA-fuzzy automatic generation controller for interconnected power system

    CSIR Research Space (South Africa)

    Boesack, CD

    2011-10-01

    Full Text Available This paper presents a GA-Fuzzy Automatic Generation Controller for large interconnected power systems. The design of Fuzzy Logic Controllers by means of expert knowledge have typically been the traditional design norm, however, this may not yield...

  4. Preparation of interconnected highly porous polymeric structures by a replication and freeze-drying process

    NARCIS (Netherlands)

    Hou, Q.; Grijpma, Dirk W.; Feijen, Jan

    2003-01-01

    Three-dimensional degradable porous polymeric structures with high porosities (93-98%) and well-interconnected pore networks have been prepared by freeze-drying polymer solutions in the presence of a leachable template followed by leaching of the template. Templates of the pore network were prepared

  5. FUNDAMENTAL STUDIES OF THE DURABILITY OF MATERIALS FOR INTERCONNECTS IN SOLID OXIDE FUEL CELLS

    Energy Technology Data Exchange (ETDEWEB)

    Frederick S. Pettit; Gerald H. Meier

    2003-06-30

    This report describes the result of the first eight months of effort on a project directed at improving metallic interconnect materials for solid oxide fuel cells (SOFCs). The results include cyclic oxidation studies of a group of ferritic alloys, which are candidate interconnect materials. The exposures have been carried out in simulated fuel cell atmospheres. The oxidation morphologies have been characterized and the ASR has been measured for the oxide scales. The effect of fuel cell electric current density on chromia growth rates has been considered The thermomechanical behavior of the scales has been investigated by stress measurements using x-ray diffraction and interfacial fracture toughness measurements using indentation. The ultimate goal of this thrust is to use knowledge of changes in oxide thickness, stress and adhesion to develop accelerated testing methods for evaluating SOFC interconnect alloys. Finally a theoretical assessment of the potential for use of ''new'' metallic materials as interconnect materials has been conducted and is presented in this report. Alloys being considered include materials based on pure nickel, materials based on the ''Invar'' concept, and coated materials to optimize properties in both the anode and cathode gases.

  6. 78 FR 21928 - Demand Response Coalition v. PJM Interconnection, L.L.C.; Notice of Complaint

    Science.gov (United States)

    2013-04-12

    ... Energy Regulatory Commission Demand Response Coalition v. PJM Interconnection, L.L.C.; Notice of... Regulatory Commission (Commission), 18 CFR 385.206, the Demand Response Coalition \\1\\ (Complainant) filed a... are therefore unenforceable. \\1\\ The Demand Response Coalition includes Comverge, Inc., Viridity...

  7. Reliable inkjet-printed interconnections on foil-type li-ion batteries

    NARCIS (Netherlands)

    Palacios-Aguilera, N.B.; Visser, Roy; Sridhar, Ashok; Balda Irurzun, U.; Vargas-Llona, L.D.; Zhou, J.; Akkerman, Remko; French, P.J.; Bossche, A.

    2013-01-01

    Shapeable rechargeable Li-ion batteries are a good option for the power source of system-in-package devices; nevertheless, their size and temperature limitations are a constraint during the fabrication process. Inkjet-printed interconnections on top of the battery are proposed in order to reduce the

  8. Weaving Together Science and English: An Interconnected Model of Language Development for Emergent Bilinguals

    Science.gov (United States)

    Ciechanowski, Kathryn M.

    2014-01-01

    This research explores third-grade science and language instruction for emergent bilinguals designed through a framework of planning, lessons, and assessment in an interconnected model including content, linguistic features, and functions. Participants were a team of language specialist, classroom teacher, and researcher who designed…

  9. Traffic Load on Interconnection Lines of Generalized Double Ring Network Structures

    DEFF Research Database (Denmark)

    Pedersen, Jens Myrup; Riaz, Muhammad Tahir; Madsen, Ole Brun

    2005-01-01

    consists of two planar rings, which are easily embedded by fiber or other wired solutions. It is shown that for large N2R structures, the interconnection lines carry notably lower loads than the other lines if shortest-path routing is used, and the effects of two other routing schemes are explored, leading...

  10. High temperature corrosion of metallic interconnects in solid oxide fuel cells

    Directory of Open Access Journals (Sweden)

    Bastidas, D. M.

    2006-12-01

    Full Text Available Research and development has made it possible to use metallic interconnects in solid oxide fuel cells (SOFC instead of ceramic materials. The use of metallic interconnects was formerly hindered by the high operating temperature, which made the interconnect degrade too much and too fast to be an efficient alternative. When the operating temperature was lowered, the use of metallic interconnects proved to be favourable since they are easier and cheaper to produce than ceramic interconnects. However, metallic interconnects continue to be degraded despite the lowered temperature, and their corrosion products contribute to electrical degradation in the fuel cell. Coatings of nickel, chromium, aluminium, zinc, manganese, yttrium or lanthanum between the interconnect and the electrodes reduce this degradation during operation

    El uso de interconectores metálicos en pilas de combustible de óxido sólido (SOFC en sustitución de materiales cerámicos ha sido posible gracias a la investigación y desarrollo de nuevos materiales metálicos. Inicialmente, el uso de interconectores metálicos fue limitado, debido a la elevada temperatura de trabajo, ocasionando de forma rápida la degradación del material, lo que impedía que fuesen una alternativa. A medida que la temperatura de trabajo de las SOFC descendió, el uso de interconectores metálicos demostró ser una buena alternativa, dado que son más fáciles de fabricar y más baratos que los interconectores cerámicos. Sin embargo, los interconectores metálicos continúan degradándose a pesar de descender la temperatura a la que operan las SOFC y, asimismo, los productos de corrosión favorecen las pérdidas eléctricas de la pila de combustible. Recubrimientos de níquel, cromo, aluminio, zinc, manganeso, itrio y lantano entre el interconector y los electrodos reduce dichas pérdidas eléctricas.

  11. Phase 1 - Evaluation of a Functional Interconnect System for Solid Oxide Fuel Cells

    Energy Technology Data Exchange (ETDEWEB)

    James M. Rakowski

    2006-09-30

    This project is focused on evaluating the suitability of materials and complex multi-materials systems for use as solid oxide fuel cell interconnects. ATI Allegheny Ludlum has generated promising results for interconnect materials which incorporate modified surfaces. Methods for producing these surfaces include cladding, which permits the use of novel materials, and modifications via unique thermomechanical processing, which allows for the modification of materials chemistry. The University of Pittsburgh is assisting in this effort by providing use of their in-place facilities for dual atmosphere testing and ASR measurements, along with substantial work to characterize post-exposure specimens. Carnegie Mellon is testing interconnects for chromia scale spallation resistance using macro-scale and nano-scale indentation tests. Chromia spallation can increase electrical resistance to unacceptable levels and interconnect systems must be developed that will not experience spallation within 40,000 hours at operating temperatures. Spallation is one of three interconnect failure mechanisms, the others being excessive growth of the chromia scale (increasing electrical resistance) and scale evaporation (which can poison the cathode). The goal of indentation fracture testing at Carnegie Mellon is to accelerate the evaluation of new interconnect systems (by inducing spalls at after short exposure times) and to use fracture mechanics to understand mechanisms leading to premature interconnect failure by spallation. Tests include bare alloys from ATI and coated systems from DOE Laboratories and industrial partners, using ATI alloy substrates. West Virginia University is working towards developing a cost-effective material for use as a contact material in the cathode chamber of the SOFC. Currently materials such as platinum are well suited for this purpose, but are cost-prohibitive. For the solid-oxide fuel cell to become a commercial reality it is imperative that lower cost

  12. High-rate serial interconnections for embedded and distributed systems with power and resource constraints

    Science.gov (United States)

    Sheynin, Yuriy; Shutenko, Felix; Suvorova, Elena; Yablokov, Evgenej

    2008-04-01

    High rate interconnections are important subsystems in modern data processing and control systems of many classes. They are especially important in prospective embedded and on-board systems that used to be multicomponent systems with parallel or distributed architecture, [1]. Modular architecture systems of previous generations were based on parallel busses that were widely used and standardised: VME, PCI, CompactPCI, etc. Busses evolution went in improvement of bus protocol efficiency (burst transactions, split transactions, etc.) and increasing operation frequencies. However, due to multi-drop bus nature and multi-wire skew problems the parallel bussing speedup became more and more limited. For embedded and on-board systems additional reason for this trend was in weight, size and power constraints of an interconnection and its components. Parallel interfaces have become technologically more challenging as their respective clock frequencies have increased to keep pace with the bandwidth requirements of their attached storage devices. Since each interface uses a data clock to gate and validate the parallel data (which is normally 8 bits or 16 bits wide), the clock frequency need only be equivalent to the byte rate or word rate being transmitted. In other words, for a given transmission frequency, the wider the data bus, the slower the clock. As the clock frequency increases, more high frequency energy is available in each of the data lines, and a portion of this energy is dissipated in radiation. Each data line not only transmits this energy but also receives some from its neighbours. This form of mutual interference is commonly called "cross-talk," and the signal distortion it produces can become another major contributor to loss of data integrity unless compensated by appropriate cable designs. Other transmission problems such as frequency-dependent attenuation and signal reflections, while also applicable to serial interfaces, are more troublesome in parallel

  13. Astrophysics Laboratory-Based Lecture Material Development of Solarscope with Integration and Interconnection

    Directory of Open Access Journals (Sweden)

    Asih Melati

    2015-12-01

    Full Text Available The development of laboratory-based lecture materials with integrated and interconnected value is a requirement for study and practical materials and in line with the vision and mission of UIN Sunan Kalijaga. As a result, the optimization of laboratory’s equipment is urgently needed. Although UIN Sunan Kalijaga Laboratory have had Solarscope telescope – which have a guidebook in German language – for six years, it was not optimally used even it can be used to satisfy the desires to observe astronomical objects economically, accurately and easy to operate. Based on above, this research propose to create a lab-work module for Solarscope with integration and interconnection value. This research used 4D methodology (Define, Design, Develop and Disseminate and have passed the assessment and validation phase from material, media and integrated-interconnected value experts. The data analysis of the module which was mapped by Sukarja into 5 scale mark resulted in good grade in the module assessment by material experts with 80% from the ideal mark with most of the complaint is in the formula typing which is not clear in its derivative. The module assessment by media experts scored very good grade with 88.89% from the ideal mark regarding the content and the figures of the module. Lastly, from the integrated-interconnected value experts marked in good grade with 73.50% from the ideal mark and suggested the addition of supported Al-Qur’an verses and relevant exclamation of the Al-Qur’an’s passages. With all of these assessment results, this module can be used as the material of astrophysics lab-work and for supporting students’ researches with integration-interconnection value and enhance the university’s book collection which will support the vision and mission of UIN Sunan Kalijaga

  14. Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects

    Directory of Open Access Journals (Sweden)

    Pay Ying Chia

    2016-05-01

    Full Text Available Miniaturization of electronic devices has led to the development of 3D IC packages which require ultra-small-scale interconnections. Such small interconnects can be completely converted into Cu-Sn based intermetallic compounds (IMCs after reflow. In an effort to improve IMC based interconnects, an attempt is made to add Ni to Cu-Sn-based IMCs. Multilayer interconnects consisting of stacks of Cu/Sn/Cu/Sn/Cu or Cu/Ni/Sn/Ni/Sn/Cu/Ni/Sn/Ni/Cu with Ni = 35 nm, 70 nm, and 150 nm were electrodeposited sequentially using copper pyrophosphate, tin methanesulfonic, and nickel Watts baths, respectively. These multilayer interconnects were investigated under room temperature aging conditions and for solid-liquid reactions, where the samples were subjected to 250 °C reflow for 60 s and also 300 °C for 3600 s. The progress of the reaction in the multilayers was monitored by using X-ray Diffraction, Scanning Electron Microscope, and Energy dispersive X-ray Spectroscopy. FIB-milled samples were also prepared for investigation under room temperature aging conditions. Results show that by inserting a 70 nanometres thick Ni layer between copper and tin, premature reaction between Cu and Sn at room temperature can be avoided. During short reflow, the addition of Ni suppresses formation of Cu3Sn IMC. With increasing Ni thickness, Cu consumption is decreased and Ni starts acting as a barrier layer. On the other hand, during long reflow, two types of IMC were found in the Cu/Ni/Sn samples which are the (Cu,Ni6Sn5 and (Cu,Ni3Sn, respectively. Details of the reaction sequence and mechanisms are discussed.

  15. Seismic qualification of multiple interconnected safety-related cabinets in a high seismic zone

    International Nuclear Information System (INIS)

    Khan, M.R.; Chen, W.H.W.; Wang, T.Y.

    1993-01-01

    Certain safety-related multiple, interconnected electrical cabinets and the devices contained therein are required to perform their intended safety functions during and after a design basis seismic event. In general, seismic testing is performed to ensure the structural integrity of the cabinets and the functionality of their associated devices. Constrained by the shake table capacity, seismic testing is usually performed only for a limited number of interconnected cabinets. Also, original shake table tests performed usually did not provide detailed response information at various locations inside the cabinets. For operational and maintenance purposes, doors and panels of some cabinets may need to be opened while the adjacent cabinets are required to remain functional. In addition, in-cabinet response spectra need to be generated for the seismic qualification of new devices and the replacement parts. Consequently, seismic analysis of safety-related multiple, interconnected cabinets is frequently required for configurations which are different from the original tested conditions. This paper presents results of seismic tests of three interconnected safety-related cabinets and finite element analyses performed to compare the analytical results with those obtained from the cabinet seismic tests. Parametric analyses are performed to determine how many panels and doors can be opened while the adjacent cabinets still remain functional. The study indicates that for cabinets located in a high seismic zone, the critical damping of the cabinet is significantly higher than 5% to 7% typically used in qualifying electrical equipment. For devices mounted on the cabinet doors to performed their intended safety function, it requires stiffening of doors and that these doors be properly bolted to the cabinet frame. It also shows that even though doors and panels bolted to the cabinet frame are the primary seismic resistant element of the cabinet, opening of a limited number of them

  16. A power efficient 2Gb/s transceiver in 90nm CMOS for 10mm On-Chip interconnect

    NARCIS (Netherlands)

    Mensink, E.; Schinkel, Daniel; Klumperink, Eric A.M.; van Tuijl, Adrianus Johannes Maria; Nauta, Bram

    2007-01-01

    Abstract—Global on-chip data communication is becoming a concern as the gap between transistor speed and interconnect bandwidth increases with CMOS process scaling. In this paper a low-swing transceiver for 10mm long 0.54μm wide on-chip interconnect is presented, which achieves a similar data rate

  17. Characterization of nanostructured metals and metal nanowires for chip-to-package interconnections

    Science.gov (United States)

    Bansal, Shubhra

    The Packaging Research Center at Georgia Tech is proposing nano-interconnections as a new interconnect paradigm for potential low-cost, highest performance and reliability. The idea is to use nanocrystalline (nc) metals and metal nanowires as potential interconnect materials with good mechanical properties and shortest electrical interconnection. The goal of the present work is to determine, as closely as possible, the intrinsic electrical and mechanical behavior of nc- metals and metal nanowires to assess the suitability of these materials for off-chip interconnections. In this study, the microstructural stability, creep, fatigue and fracture properties of nanocrystalline copper and nickel (grain size ~ 50 nm) have been reported, in such depth, for the first time to the best of our knowledge. Fatigue life of nanostructured interconnects has also been computed through finite element models, and a clear advantage of using such a material has been demonstrated. Nanostructured copper interconnections exhibit better fatigue life as compared to microcrystalline copper interconnects at a pitch of 100 mum and lower. Nanocrystalline copper is quite stable upto 100°C whereas nickel is stable even upto 400°C. The activation energy of grain growth is 33.427 kJ/mol and 53.056 kJ/mol for ECAE nanocrystalline copper and nickel respectively. GB diffusion along with grain rotation and coalescence has been identified as the grain growth mechanism. Ultimate tensile and yield strength of nc- copper are 454 MPa and 438 MPa, respectively. These for nc- nickel are 898 MPa and 867 MPa, respectively. These values are at least 5 times higher than microcrystalline counterparts. Considerable amount of plastic deformation has been observed and the fracture is ductile in nature. Fracture surfaces show dimples much larger than grain size and stretching between dimples indicates localized plastic deformation. Nanoindentation hardness for nc- copper and nickel is 2.33 GPa and 3.92 GPa

  18. The Open System Interconnection as a building block in a health sciences information network.

    Science.gov (United States)

    Boss, R W

    1985-10-01

    The interconnection of integrated health sciences library systems with other health sciences computer systems to achieve information networks will require either custom linkages among specific devices or the adoption of standards that all systems support. The most appropriate standards appear to be those being developed under the Open System Interconnection (OSI) reference model, which specifies a set of rules and functions that computers must follow to exchange information. The protocols have been modularized into seven different layers. The lowest three layers are generally available as off-the-shelf interfacing products. The higher layers require special development for particular applications. This paper describes the OSI, its application in health sciences networks, and specific tasks that remain to be undertaken.

  19. Recovery Act - CAREER: Sustainable Silicon -- Energy-Efficient VLSI Interconnect for Extreme-Scale Computing

    Energy Technology Data Exchange (ETDEWEB)

    Chiang, Patrick [Oregon State Univ., Corvallis, OR (United States)

    2014-01-31

    The research goal of this CAREER proposal is to develop energy-efficient, VLSI interconnect circuits and systems that will facilitate future massively-parallel, high-performance computing. Extreme-scale computing will exhibit massive parallelism on multiple vertical levels, from thou­ sands of computational units on a single processor to thousands of processors in a single data center. Unfortunately, the energy required to communicate between these units at every level (on­ chip, off-chip, off-rack) will be the critical limitation to energy efficiency. Therefore, the PI's career goal is to become a leading researcher in the design of energy-efficient VLSI interconnect for future computing systems.

  20. Structure of a scheme of emergency control to avoid blackout due to interconnection lines loss

    Energy Technology Data Exchange (ETDEWEB)

    Luz, L.T. da; Werberich, L.C.; Herve, H.M. [Companhia Estadual de Energia Eletrica do Estado do Rio Grande do Sul (CEEE), Porto Alegre, RS (Brazil)

    1994-12-31

    This work presents the structure of Gravatai Emergency Control Scheme (ECS) with short about its development and operation. This ECS was made to avoid two kinds of problems for the systems of Companhia Estadual de Energia Eletrica (CEEE). The first one is the voltage collapse that happens after the opening of one of the 525 kv LTs of the interconnection with the Brazilian Interconnected System (BIS). The second one is the CEEE isolating after the 525 kV network loss. We show the ECS existence reason and we describe its functional structure, the substations, the circuits and the amount of load shedding involved by the system. Finally, we present the project of a control structure based on microcomputer which is being developed for this ECS. (author) 3 refs., 11 figs.

  1. Design and fabrication of optical polymer waveguide devices for optical interconnects and integrated optical coherence tomography

    Science.gov (United States)

    Jiang, Guomin

    Optical interconnects is a promising technique to boost the speed of electronic systems through replacing high speed electrical data buses using optical ones. Optical coherence tomography is an attractive imaging technique that has been widely used in medical imaging applications with capability of high resolution subsurface cross sectional imaging in living tissues. Both the optical interconnects and the optical coherence tomography imaging may benefit from the use of integrated optics technology in particular polymer waveguides that can be designed and fabricated to improve the device capability, system compactness, and performance reliability. In this dissertation, we first present our innovative design and realization on the polymer waveguides with 45° integrated mirrors for optical interconnects using the vacuum assisted microfluidic (VAM) soft lithography. VAM is a new microfluidic based replication technique which can be utilized to improve the performance of imprinted devices by eliminating the residue planar layer and accomplish complex devices incorporating different materials in the same layer. A prism-assisted inclined UV lithography technique is introduced to increase the slanted angles of the side walls of the microstructures and to fabricate multidirectional slanted microstructures. It is also used to fabricate 45° integrated mirrors in polymer waveguides to support surface normal optical coupling for optical interconnects. A dynamic card-to-backplane optical interconnects system has also been demonstrated based on polymer waveguides with tunable optofluidic couplers. The operation of the tunable optofluidic coupler is accomplished by controlling the position of air bubbles and index matching liquid in the perpendicular microfluidic channel for refractive index modulation. The dynamic activation and deactivation of the backplane optofluidic couplers can save the optical signal power. 10 Gbps eye diagrams of the dynamic optical interconnect link

  2. Role of WDM optical interconnections in a distributed shared-memory multiprocessor

    Science.gov (United States)

    Ghose, Kanad; Singhvi, Nitin K.; Horsell, R. K.

    1993-07-01

    This paper explores the use of optical spanning bus interconnections using optical fiber links and wavelength division multiplexing (WDM) with statically assigned channels for implementing distributed shared memory multiprocessors (DSMM). The WDM optical links allow processor synchronization and coherent caches -- two very important requirements for a DSMM -- to be implemented efficiently. Simultaneous broadcasts possible on several channels along a WDM photonic link allow barrier synchronizations to be fast and scalable. The large bandwidth capability of WDM optical links and their ability for accommodating simultaneously -- active channels permits a write-update based cache coherence protocol to be implemented. Our proposed cache coherence protocol is sensitive to the relatively longer propagation delays along optic fiber links and possible mismatch in speeds between the electronic and photonic components. The protocol is hierarchical, reflecting the hierarchy in the interconnection, making it easily scalable with system size. In addition, the proposed protocol performs opportunistic request combining, a pleasant side-effect of using optical links.

  3. Novel electrochemical approach to study corrosion mechanism of Al-Au wire-bond pad interconnections

    DEFF Research Database (Denmark)

    Elisseeva, O. V.; Bruhn, A.; Cerezo, J.

    2013-01-01

    A gold-aluminium material combination is typically employed as an interconnection for microelectronic devices. One of the reliability risks of such devices is that of corrosion of aluminium bond pads resulting from the galvanic coupling between an aluminium bond pad and a gold wire. The research...... presented in this manuscript focuses on studying bond pad corrosion by selecting an appropriate model system and a dedicated set of electrochemical and analytical experimental tools. Taking into account the complex three-dimensional structure and the small dimensions of Au-Al interconnections (around 50......-100 μm), a dedicated and novel experimental approach was developed. Au-Al covered silicon chips were developed under clean room conditions. Three-dimensional electrodes were mimicked as flat, two-dimensional bond pad model systems, allowing the use of microelectrochemical local probe techniques. Thin...

  4. The Development of Interconnection Standards in Six States In 2007-2008

    Energy Technology Data Exchange (ETDEWEB)

    Keyes, Jason B. [Wilson Sonsini Goodrich & Rosati, Seattle, WA (United States)

    2008-05-01

    This paper discusses the process of developing standards for the interconnection of photovoltaic systems and other generators under ten megawatts to the electric grid. State utility commission rulemakings in 2007-2008 in Florida, New Mexico, North Carolina, Maryland, Illinois and Utah provide the basis for analysis of what is and should be considered in the development of standards, and how the process can be improved. State interconnection standards vary substantially, and many utilities have discretion to establish additional or different requirements, creating literally hundreds of sets of rules. This lack of uniformity imposes a significant cost on project developers and installers to track and comply with applicable rules. As well, burdensome provisions and uncertain costs and timelines present formidable barriers to entry, which advocates have limited resources to challenge. For a better process, the author proposes: establishing federal standards as a baseline, involving solar advocates, and developing a utility cost-recovery mechanism.

  5. Interconnection, Integration, and Interactive Impact Analysis of Microgrids and Distribution Systems

    Energy Technology Data Exchange (ETDEWEB)

    Kang, Ning [Argonne National Lab. (ANL), Argonne, IL (United States); Wang, Jianhui [Argonne National Lab. (ANL), Argonne, IL (United States); Singh, Ravindra [Argonne National Lab. (ANL), Argonne, IL (United States); Lu, Xiaonan [Argonne National Lab. (ANL), Argonne, IL (United States)

    2017-01-01

    Distribution management systems (DMSs) are increasingly used by distribution system operators (DSOs) to manage the distribution grid and to monitor the status of both power imported from the transmission grid and power generated locally by a distributed energy resource (DER), to ensure that power flows and voltages along the feeders are maintained within designed limits and that appropriate measures are taken to guarantee service continuity and energy security. When microgrids are deployed and interconnected to the distribution grids, they will have an impact on the operation of the distribution grid. The challenge is to design this interconnection in such a way that it enhances the reliability and security of the distribution grid and the loads embedded in the microgrid, while providing economic benefits to all stakeholders, including the microgrid owner and operator and the distribution system operator.

  6. Lyapunov-based Stability of Feedback Interconnections of Negative Imaginary Systems

    KAUST Repository

    Ghallab, Ahmed G.

    2017-10-19

    Feedback control systems using sensors and actuators such as piezoelectric sensors and actuators, micro-electro-mechanical systems (MEMS) sensors and opto-mechanical sensors, are allowing new advances in designing such high precision technologies. The negative imaginary control systems framework allows for robust control design for such high precision systems in the face of uncertainties due to unmodelled dynamics. The stability of the feedback interconnection of negative imaginary systems has been well established in the literature. However, the proofs of stability feedback interconnection which are used in some previous papers have a shortcoming due to a matrix inevitability issue. In this paper, we provide a new and correct Lyapunov-based proof of one such result and show that the result is still true.

  7. Design space analysis of novel interconnect constructs for 22nm FDX technology

    Science.gov (United States)

    Guha Neogi, Tuhin; Jain, Navneet; Verma, Piyush; Permana, David; Lutich, Andrey; Weishbuch, Francois; Wehella-Gamage, Deepal; Ramadout, Benoit Francois Claude; Vangara, Gowtham; Kim, Juhan; Herrmann, Thomas; Sun, Kai; Babich, Katherina; Pritchard, David; Rashed, Mahbub

    2017-03-01

    In this paper, we describe an integrated design space analysis approach consisting of full factorial layout generation, lithography simulations with added proximity effects, and rigorous statistical analysis through monte-carlo simulations which is used in the evaluating interconnects. This agile Design rule development process provides a quick turnaround time to down-select the potential layout configurations that can offer a competitive, robust and reliable design and manufacturing. Further layout and placement optimization is carried out to evaluate intra-cell, inter-cell and cell boundary situations, which are critical for a place and routed block. These interconnects developed using the integrated approach has been the key contributor to give 20-30% higher performance at the same Iddq leakage for 8T libraries compared to Single Diffusion break or Double Diffusion break based 12T libraries in 22FDX Technology.

  8. Influence of Micro-Damage on Reliability of Cryogenic Bellows in the LHC Interconnections

    CERN Document Server

    Garion, C

    2008-01-01

    To achieve maximum beam energy in the LHC the accumulated length of the interconnections between LHC main magnets has been limited to around 3% of the total magnetic length in the Arcs and Dispersion Suppressors. Such a low ratio leads to a very compact design of components located in the LHC interconnections. This implies development and evolution of high intensity plastic strain fields in the stainless steel expansion bellows subjected to thermo-mechanical loads at low temperatures. These components have been optimised to ensure high reliability standards required for the LHC. Nevertheless, initial damage can occur and lead to a premature fatigue failure. For structures in which plasticity is not confined to the crack tip region, standard failure mechanics, based classically on the stress intensity factor or the strain energy density release rate, can not be used. In the present paper, a constitutive model taking into account plastic strain induced g->a' phase transformation and orthotropic ductile damage i...

  9. Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

    Energy Technology Data Exchange (ETDEWEB)

    Tamura, Nobumichi; Chen, Kai; Kunz, Martin

    2009-12-01

    Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration-induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature.

  10. Microstructure Effect on Electromigration-Induced Degradation of Inlaid Copper Interconnects

    International Nuclear Information System (INIS)

    Zschech, E.; Meyer, M.A.; Prinz, H.; Zienert, I.; Langer, E.; Geisler, H.; Grafe, M.

    2004-01-01

    Electromigration-induced degradation processes in via/line dual inlaid copper interconnect test structures are discussed based on experimental studies. Void formation, growth and movement, and consequently interconnect degradation, depend on both interface bonding and copper microstructure. Void movement along the copper line and void growth in the via are discontinuous processes, wherein their step-like behavior is caused by copper microstructure. Microstructure studies and microstructure monitoring are becoming more important for strengthened top interfaces of copper lines, e. g. by local alloying of the copper or by applying an additional coating on top of the polished copper lines. As a result of this interface engineering, the contribution of grain boundary diffusion becomes increasingly important for the directed mass transport and for electromigration-induced degradation

  11. On the interconnection between hydraulic resistance and heat transfer in porous media

    International Nuclear Information System (INIS)

    Kokorev, L.S.; Subbotin, V.I.; Fedoseev, V.N.; Khoritonov, V.V.; Voskobojnikov, V.V.

    1987-01-01

    Interconnection between coefficients of hydraulic resistance and heat transfer for turbulent flow in porous media has been established in the form of criterion equations containing a single empirical (apparently, universal) constant. This interconnection is based on the representation of a determining effect of velocity scale of coolant pulsation flow on a heat transfer coefficient value. It is discovered that the application of the Kholmogorov scale of pulsation velocity gives satisfactory results in porous media. Calculational results and experimental data on heat transfer in pebble-bed, netted and wiper media, in transversely streamlined rod clusters cooled with liquid metal, gases, water and oils have been compared. The application of the formulae derived is convenient for heat transfer evaluations in porous media from results of hydraulic resistance measurement

  12. Interconnected Silicon Hollow Nanospheres for Lithium-Ion Battery Anodes with Long Cycle Life

    KAUST Repository

    Yao, Yan

    2011-07-13

    Silicon is a promising candidate for the anode material in lithium-ion batteries due to its high theoretical specific capacity. However, volume changes during cycling cause pulverization and capacity fade, and improving cycle life is a major research challenge. Here, we report a novel interconnected Si hollow nanosphere electrode that is capable of accommodating large volume changes without pulverization during cycling. We achieved the high initial discharge capacity of 2725 mAh g-1 with less than 8% capacity degradation every hundred cycles for 700 total cycles. Si hollow sphere electrodes also show a Coulombic efficiency of 99.5% in later cycles. Superior rate capability is demonstrated and attributed to fast lithium diffusion in the interconnected Si hollow structure. © 2011 American Chemical Society.

  13. INTERCONNECTING NETWORKS WITH DIFFERENT LEVELS OF SECURITY – A PRESENT NATO PROBLEM

    Directory of Open Access Journals (Sweden)

    LIVIU TATOMIR

    2016-07-01

    Full Text Available A situation often met in the Romanian Armed Forces in recent years is the need for interconnecting two networks (domains with different levels of classification. Considering that the Romanian armed troops are involved in numerous missions with NATO partners, solutions, already implemented across the organization, are considered to be applied in domestic systems, also. This paper presents the solutions adopted by NATO in order to solve the problem of cross -domains interconnections. We present the maturity level reached by these solutions and the possibility of implementing these solutions in the Romanian Armed Forces, with or without specific adaptation to our own rules and regulations. The goal is to use a NATO already proved solution to our national classified networks.

  14. Optical interconnection network for parallel access to multi-rank memory in future computing systems.

    Science.gov (United States)

    Wang, Kang; Gu, Huaxi; Yang, Yintang; Wang, Kun

    2015-08-10

    With the number of cores increasing, there is an emerging need for a high-bandwidth low-latency interconnection network, serving core-to-memory communication. In this paper, aiming at the goal of simultaneous access to multi-rank memory, we propose an optical interconnection network for core-to-memory communication. In the proposed network, the wavelength usage is delicately arranged so that cores can communicate with different ranks at the same time and broadcast for flow control can be achieved. A distributed memory controller architecture that works in a pipeline mode is also designed for efficient optical communication and transaction address processes. The scaling method and wavelength assignment for the proposed network are investigated. Compared with traditional electronic bus-based core-to-memory communication, the simulation results based on the PARSEC benchmark show that the bandwidth enhancement and latency reduction are apparent.

  15. Interconnections; Interconnexions

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2001-07-01

    Theses documents define and present the contracts to access the public french electric power network for importation, exportation and transit of electric power. The rules, the notifications and the guarantees are defined. (A.L.B.)

  16. Tailoring the Crystallographic Texture and Electrical Properties of Inkjet-printed Interconnects for Use in Microelectronics

    OpenAIRE

    Cauchois, Romain; Saadaoui, Mohamed; Inal, Karim; Dubois-Bonvalot, Béatrice; Fidalgo, Jean-Christophe

    2011-01-01

    International audience; In this paper, silver nanoparticles with a mean diameter of 40 nm are studied for future applications in microelectronic devices. The enhanced diffusivity of nanoparticles is exploited to fabricate electrical interconnects at low temperature. Sintering condition has been tuned to tailor the grain size so that electrical resistivity can be lowered down to 3.4 µOhm∙cm. In this study, a {111}-textured gold thin film has been used to increase diffusion routes. The combined...

  17. Analysis and control of multi–area HVDC interconnected power systems by using virtual inertia

    OpenAIRE

    Rakhshani, Elyas

    2016-01-01

    Virtual inertia is known as an inevitable part of the modern power systems. Recent trend of research is oriented in different methods of emulating virtual inertia in different part of the systems. This dissertation is focused on modelling, analysing and application of virtual inertia concept in frequency control and Automatic Generation Control (AGC) issue in high level control AC/DC interconnected power systems. Since the virtual inertia is provided by advanced control concepts of power elec...

  18. Examination of Potential Benefits of an Energy Imbalance Market in the Western Interconnection

    Energy Technology Data Exchange (ETDEWEB)

    Milligan, M.; Clark, K.; King, J.; Kirby, B.; Guo, T.; Liu, G.

    2013-03-01

    In the Western Interconnection, there is significant interest in improving approaches to wide-area coordinated operations of the bulk electric power system, in part because of the increasing penetration of variable generation. One proposed solution is an energy imbalance market. This study focused on that approach alone, with the goal of identifying the potential benefits of an energy imbalance market in the year 2020.

  19. FPGA-RR: A Novel FPGA Architecture with RRAM-Based Reconfigurable Interconnects

    OpenAIRE

    Xiao, Bingjun

    2012-01-01

    In this paper we introduce a novel FPGA architecture with RRAM-based reconfiguration (FPGA-RR). This architecture focuses on the redesign of programmable interconnects, the dominant part of FPGA. By renovating the routing structure of FPGA using RRAMs, the architecture achieves significant benefits concerning area, performance and energy consumption. The implementation of FPGA-RR can be realized by the existing CMOS-compatible RRAM fabrication process. A customized CAD flow is provided for FP...

  20. System Impacts from Interconnection of Distributed Resources: Current Status and Identification of Needs for Further Development

    Energy Technology Data Exchange (ETDEWEB)

    Basso, T. S.

    2009-01-01

    This report documents and evaluates system impacts from the interconnection of distributed resources to transmission and distribution systems, including a focus on renewable distributed resource technologies. The report also identifies system impact-resolution approaches and actions, including extensions of existing approaches. Lastly, the report documents the current challenges and examines what is needed to gain a clearer understanding of what to pursue to better avoid or address system impact issues.