Monolithic microwave integrated circuits: Interconnections and packaging considerations

Science.gov (United States)

Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.

1984-01-01

Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

Monolithic microwave integrated circuits: Interconnections and packaging considerations

Science.gov (United States)

Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.

Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

Overview of Hanford Single Shell Tank (SST) Structural Integrity

Energy Technology Data Exchange (ETDEWEB)

Rast, Richard S.; Washenfelder, Dennis J.; Johnson, Jeremy M.

2013-11-14

To improve the understanding of the single-shell tanks (SSTs) integrity, Washington River Protection Solutions, LLC (WRPS), the USDOE Hanford Site tank contractor, developed an enhanced Single-Shell Tank Integrity Project (SSTIP) in 2009. An expert panel on SST integrity, consisting of various subject matters experts in industry and academia, was created to provide recommendations supporting the development of the project. This panel developed 33 recommendations in four main areas of interest: structural integrity, liner degradation, leak integrity and prevention, and mitigation of contamination migration, Seventeen of these recommendations were used to develop the basis for the M-45-10-1 Change Package for the Hanford Federal Agreement and Compliance Order, which is also known as the Tri-Party Agreement. The structural integrity of the tanks is a key element in completing the cleanup mission at the Hanford Site. There are eight primary recommendations related to the structural integrity of Hanford Single-Shell Tanks. Six recommendations are being implemented through current and planned activities. The structural integrity of the Hanford is being evaluated through analysis, monitoring, inspection, materials testing, and construction document review. Structural evaluation in the form of analysis is performed using modern finite element models generated in ANSYS. The analyses consider in-situ, thermal, operating loads and natural phenomena such as earthquakes. Structural analysis of 108 of 149 Hanford Single-Shell Tanks has concluded that the tanks are structurally sound and meet current industry standards. Analysis of the remaining Hanford Single-Shell Tanks is scheduled for FY2014. Hanford Single-Shell Tanks are monitored through a dome deflection program. The program looks for deflections of the tank dome greater than 1/4 inch. No such deflections have been recorded. The tanks are also subjected to visual inspection. Digital cameras record the interior surface of

Overview of Hanford Single Shell Tank (SST) Structural Integrity

International Nuclear Information System (INIS)

Rast, Richard S.; Washenfelder, Dennis J.; Johnson, Jeremy M.

2013-01-01

To improve the understanding of the single-shell tanks (SSTs) integrity, Washington River Protection Solutions, LLC (WRPS), the USDOE Hanford Site tank contractor, developed an enhanced Single-Shell Tank Integrity Project (SSTIP) in 2009. An expert panel on SST integrity, consisting of various subject matters experts in industry and academia, was created to provide recommendations supporting the development of the project. This panel developed 33 recommendations in four main areas of interest: structural integrity, liner degradation, leak integrity and prevention, and mitigation of contamination migration, Seventeen of these recommendations were used to develop the basis for the M-45-10-1 Change Package for the Hanford Federal Agreement and Compliance Order, which is also known as the Tri-Party Agreement. The structural integrity of the tanks is a key element in completing the cleanup mission at the Hanford Site. There are eight primary recommendations related to the structural integrity of Hanford Single-Shell Tanks. Six recommendations are being implemented through current and planned activities. The structural integrity of the Hanford is being evaluated through analysis, monitoring, inspection, materials testing, and construction document review. Structural evaluation in the form of analysis is performed using modern finite element models generated in ANSYS. The analyses consider in-situ, thermal, operating loads and natural phenomena such as earthquakes. Structural analysis of 108 of 149 Hanford Single-Shell Tanks has concluded that the tanks are structurally sound and meet current industry standards. Analysis of the remaining Hanford Single-Shell Tanks is scheduled for FY2014. Hanford Single-Shell Tanks are monitored through a dome deflection program. The program looks for deflections of the tank dome greater than 1/4 inch. No such deflections have been recorded. The tanks are also subjected to visual inspection. Digital cameras record the interior surface of

Evaluation Framework and Analyses for Thermal Energy Storage Integrated with Packaged Air Conditioning

Energy Technology Data Exchange (ETDEWEB)

Kung, F.; Deru, M.; Bonnema, E.

2013-10-01

Few third-party guidance documents or tools are available for evaluating thermal energy storage (TES) integrated with packaged air conditioning (AC), as this type of TES is relatively new compared to TES integrated with chillers or hot water systems. To address this gap, researchers at the National Renewable Energy Laboratory conducted a project to improve the ability of potential technology adopters to evaluate TES technologies. Major project outcomes included: development of an evaluation framework to describe key metrics, methodologies, and issues to consider when assessing the performance of TES systems integrated with packaged AC; application of multiple concepts from the evaluation framework to analyze performance data from four demonstration sites; and production of a new simulation capability that enables modeling of TES integrated with packaged AC in EnergyPlus. This report includes the evaluation framework and analysis results from the project.

Piping data retrieval system (PDRS): An integrated package to aid piping layout

International Nuclear Information System (INIS)

Vyas, K.N.; Sharma, A.; Susandhi, R.; Basu, S.

1986-01-01

An integrated package to aid piping layout has been developed and implemented on PDP-11/34 system at Hall 7. The package allows various equipments to be modelled, consisting of primitive equipment components. The equipment layout for the plant can then be reproduced in the form of drawings such as plan, elevation, isometric or perspective. The package has the built in function to perform hidden line removal among equipments. Once the equipment layout is finalised, the package aids in superimposing the piping as per the specified pipe routine. The report discusses the general capabilities and the major input requirements for the package. (author)

Geochemical Processes Data Package for the Vadose Zone in the Single-Shell Tank Waste Management Areas at the Hanford Site

Energy Technology Data Exchange (ETDEWEB)

Cantrell, Kirk J.; Zachara, John M.; Dresel, P. Evan; Krupka, Kenneth M.; Serne, R. Jeffrey

2007-09-28

This data package discusses the geochemistry of vadose zone sediments beneath the single-shell tank farms at the U.S. Department of Energy’s (DOE’s) Hanford Site. The purpose of the report is to provide a review of the most recent and relevant geochemical process information available for the vadose zone beneath the single-shell tank farms and the Integrated Disposal Facility. Two companion reports to this one were recently published which discuss the geology of the farms (Reidel and Chamness 2007) and groundwater flow and contamination beneath the farms (Horton 2007).

Motofit - integrating neutron reflectometry acquisition, reduction and analysis into one, easy to use, package

International Nuclear Information System (INIS)

Nelson, Andrew

2010-01-01

The efficient use of complex neutron scattering instruments is often hindered by the complex nature of their operating software. This complexity exists at each experimental step: data acquisition, reduction and analysis, with each step being as important as the previous. For example, whilst command line interfaces are powerful at automated acquisition they often reduce accessibility by novice users and sometimes reduce the efficiency for advanced users. One solution to this is the development of a graphical user interface which allows the user to operate the instrument by a simple and intuitive 'push button' approach. This approach was taken by the Motofit software package for analysis of multiple contrast reflectometry data. Here we describe the extension of this package to cover the data acquisition and reduction steps for the Platypus time-of-flight neutron reflectometer. Consequently, the complete operation of an instrument is integrated into a single, easy to use, program, leading to efficient instrument usage.

Three-dimensional integration and modeling a revolution in RF and wireless packaging

CERN Document Server

Lee, Jong-Hoon

2007-01-01

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization.Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.Table of Contents: I

CYPROS - Cybernetic Program Packages

Directory of Open Access Journals (Sweden)

Arne Tyssø

1980-10-01

Full Text Available CYPROS is an interactive program system consisting of a number of special purpose packages for simulation, identification, parameter estimation and control system design. The programming language is standard FORTRAN IV and the system is implemented on a medium size computer system (Nord-10. The system is interactive and program control is obtained by the use of numeric terminals. Output is rapidly examined by extensive use of video colour graphics. The subroutines included in the packages are designed and documented according to standardization rules given by the SCL (Scandinavian Control Library organization. This simplifies the exchange of subroutines throughout the SCL system. Also, this makes the packages attractive for implementation by industrial users. In the simulation package, different integration methods are available and it can be easily used for off-line, as well as real time, simulation problems. The identification package consists of programs for single-input/single-output and multivariablc problems. Both transfer function models and state space models can be handled. Optimal test signals can be designed. The control package consists of programs based on multivariable time domain and frequency domain methods for analysis and design. In addition, there is a package for matrix and time series manipulation. CYPROS has been applied successfully to industrial problems of various kinds, and parts of the system have already been implemented on different computers in industry. This paper will, in some detail, describe the use and the contents of the packages and some examples of application will be discussed.

Overview Of Enhanced Hanford Single-Shell Tank (SST) Integrity Project - 12128

International Nuclear Information System (INIS)

Venetz, T.J.; Boomer, K.D.; Washenfelder, D.J.; Johnson, J.B.

2012-01-01

To improve the understanding of the single-shell tanks integrity, Washington River Protection Solutions, LLC, the USDOE Hanford Site tank contractor, developed an enhanced Single-Shell Tank (SST) Integrity Project in 2009. An expert panel on SST integrity, consisting of various subject matters experts in industry and academia, was created to provide recommendations supporting the development of the project. This panel developed 33 recommendations in four main areas of interest: structural integrity, liner degradation, leak integrity and prevention, and mitigation of contamination migration, Seventeen of these recommendations were used to develop the basis for the M-45-10-1 Change Package for the Hanford Federal Agreement and Compliance Order, which is also known as the Tri-Party Agreement. The change package identified two phases of work for SST integrity. The initial phase has been focused on efforts to envelope the integrity of the tanks. The initial phase was divided into two primary areas of investigation: structural integrity and leak integrity. If necessary based on the outcome from the initial work, a second phase would be focused on further definition of the integrity of the concrete and liners. Combined these two phases are designed to support the formal integrity assessment of the Hanford SSTs in 2018 by Independent Qualified Registered Engineer. The work to further define the DOE's understanding of the structural integrity SSTs involves preparing a modern Analysis of Record using a finite element analysis program. Structural analyses of the SSTs have been conducted since 1957, but these analyses used analog calculation, less rigorous models, or focused on individual structures. As such, an integrated understanding of all of the SSTs has not been developed to modern expectations. In support of this effort, other milestones will address the visual inspection of the tank concrete and the collection of concrete core samples from the tanks for analysis of

Low-cost millimeter-wave transceiver module using SMD packaged MMICs

NARCIS (Netherlands)

Heijningen, M. van; Gauthier, G.

2004-01-01

This paper presents a novel approach to realize low-cost millimeter-wave modules using only SMD packaged MMICs integrated on a single organic substrate. This approach is demonstrated on a 38 GHz transceiver module for point-to-point LMDS communication systems. The required SMD package technology and

Low-Cost Millimeter-Wave Transceiver Module using SMD packaged MMICs.

NARCIS (Netherlands)

2004-01-01

This paper presents a novel approach to realize low-cost millimeter-wave modules using only SMD packaged MMICs integrated on a single organic substrate. This approach is demonstrated on a 38 GHz transceiver module for point-to-point LMDS communication systems. The required SMD package technology and

Packaged and hybrid integrated all-optical flip-flop memory

NARCIS (Netherlands)

Liu, Y.; McDougall, R.; Hill, M.T.; Maxwell, G.D.; Zhang, S.; Harmon, R.; Huijskens, Frans; Rivers, L.; Dorren, H.J.S.; Poustie, A.

2006-01-01

A fully-packaged hybrid-integrated all-optical flip-flop, where InP-based semiconductor optical amplifiers are assembled onto a planar silica waveguide board, is demonstrated. It is shown experimentally that the flip-flop can dynamically toggle between its two states by injecting 150 ps optical

Single-mode glass waveguide technology for optical interchip communication on board level

Science.gov (United States)

Brusberg, Lars; Neitz, Marcel; Schröder, Henning

2012-01-01

The large bandwidth demand in long-distance telecom networks lead to single-mode fiber interconnects as result of low dispersion, low loss and dense wavelength multiplexing possibilities. In contrast, multi-mode interconnects are suitable for much shorter lengths up to 300 meters and are promising for optical links between racks and on board level. Active optical cables based on multi-mode fiber links are at the market and research in multi-mode waveguide integration on board level is still going on. Compared to multi-mode, a single-mode waveguide has much more integration potential because of core diameters of around 20% of a multi-mode waveguide by a much larger bandwidth. But light coupling in single-mode waveguides is much more challenging because of lower coupling tolerances. Together with the silicon photonics technology, a single-mode waveguide technology on board-level will be the straight forward development goal for chip-to-chip optical interconnects integration. Such a hybrid packaging platform providing 3D optical single-mode links bridges the gap between novel photonic integrated circuits and the glass fiber based long-distance telecom networks. Following we introduce our 3D photonic packaging approach based on thin glass substrates with planar integrated optical single-mode waveguides for fiber-to-chip and chip-to-chip interconnects. This novel packaging approach merges micro-system packaging and glass integrated optics. It consists of a thin glass substrate with planar integrated singlemode waveguide circuits, optical mirrors and lenses providing an integration platform for photonic IC assembly and optical fiber interconnect. Thin glass is commercially available in panel and wafer formats and characterizes excellent optical and high-frequency properties. That makes it perfect for microsystem packaging. The paper presents recent results in single-mode waveguide technology on wafer level and waveguide characterization. Furthermore the integration in a

Standard high-reliability integrated circuit logic packaging. [for deep space tracking stations

Science.gov (United States)

Slaughter, D. W.

1977-01-01

A family of standard, high-reliability hardware used for packaging digital integrated circuits is described. The design transition from early prototypes to production hardware is covered and future plans are discussed. Interconnections techniques are described as well as connectors and related hardware available at both the microcircuit packaging and main-frame level. General applications information is also provided.

Plasma Etching for Failure Analysis of Integrated Circuit Packages

NARCIS (Netherlands)

Tang, J.; Schelen, J.B.J.; Beenakker, C.I.M.

2011-01-01

Plastic integrated circuit packages with copper wire bonds are decapsulated by a Microwave Induced Plasma system. Improvements on microwave coupling of the system are achieved by frequency tuning and antenna modification. Plasmas with a mixture of O2 and CF4 showed a high etching rate around 2

Do food provisions packaged in single-servings reduce energy intake at breakfast during a brief behavioral weight-loss intervention?

Science.gov (United States)

Raynor, Hollie A; Van Walleghen, Emily L; Niemeier, Heather; Butryn, Meghan L; Wing, Rena R

2009-11-01

Larger portion sizes increase energy intake, yet it is unclear whether single-serving packages can reduce intake. This study examined the effects of providing breakfast foods in single-serving packages and nonportioned packages on energy intake of these foods during an 8-week behavioral weight-loss program. In fall 2005, 19 adults (mean body mass index [calculated as kg/m(2)]=31.8+/-4.0) were randomized to conditions that provided foods in single-serving packages (Single-Serving) or in nonportioned packages (Standard). Overall amounts and types of foods provided were consistent across conditions: cereal and peaches (weeks 1, 3, 5, and 7) and applesauce and cheese (weeks 2, 4, 6, and 8). Participants were instructed to eat one serving of each food for breakfast and not to consume the provided foods at other times. Mean daily energy intake of the provided foods was the primary dependent variable. The Single-Serving group ate less energy from the combined pairs of foods provided together as compared to Standard (cereal and peaches, 117.0+/-3.2 kcal/day vs 143.5+/-39.3 kcal/day; P0.10). This suggests that single-serving packages may help reduce energy intake at breakfast within the context of a behavioral weight-control program.

Packaging signals in single-stranded RNA viruses: nature's alternative to a purely electrostatic assembly mechanism.

Science.gov (United States)

Stockley, Peter G; Twarock, Reidun; Bakker, Saskia E; Barker, Amy M; Borodavka, Alexander; Dykeman, Eric; Ford, Robert J; Pearson, Arwen R; Phillips, Simon E V; Ranson, Neil A; Tuma, Roman

2013-03-01

The formation of a protective protein container is an essential step in the life-cycle of most viruses. In the case of single-stranded (ss)RNA viruses, this step occurs in parallel with genome packaging in a co-assembly process. Previously, it had been thought that this process can be explained entirely by electrostatics. Inspired by recent single-molecule fluorescence experiments that recapitulate the RNA packaging specificity seen in vivo for two model viruses, we present an alternative theory, which recognizes the important cooperative roles played by RNA-coat protein interactions, at sites we have termed packaging signals. The hypothesis is that multiple copies of packaging signals, repeated according to capsid symmetry, aid formation of the required capsid protein conformers at defined positions, resulting in significantly enhanced assembly efficiency. The precise mechanistic roles of packaging signal interactions may vary between viruses, as we have demonstrated for MS2 and STNV. We quantify the impact of packaging signals on capsid assembly efficiency using a dodecahedral model system, showing that heterogeneous affinity distributions of packaging signals for capsid protein out-compete those of homogeneous affinities. These insights pave the way to a new anti-viral therapy, reducing capsid assembly efficiency by targeting of the vital roles of the packaging signals, and opens up new avenues for the efficient construction of protein nanocontainers in bionanotechnology.

Characterization of integrated circuit packaging materials

CERN Document Server

Moore, Thomas

1993-01-01

Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.

Integrated Approach to Industrial Packaging Design

Science.gov (United States)

Vorobeva, O.

2017-11-01

The article reviews studies in the field of industrial packaging design. The major factors which influence technological, ergonomic, economic and ecological features of packaging are established. The main modern trends in packaging design are defined, the principles of marketing communications and their influence on consumers’ consciousness are indicated, and the function of packaging as a transmitter of brand values is specified. Peculiarities of packaging technology and printing techniques in modern printing industry are considered. The role of designers in the stage-by-stage development of the construction, form and graphic design concept of packaging is defined. The examples of authentic packaging are given and the mention of the tetrahedron packaging history is made. At the end of the article, conclusions on the key research aspects are made.

OVERVIEW OF ENHANCED HANFORD SINGLE-SHELL TANK (SST) INTEGRITY PROJECT - 12128

Energy Technology Data Exchange (ETDEWEB)

VENETZ TJ; BOOMER KD; WASHENFELDER DJ; JOHNSON JB

2012-01-25

To improve the understanding of the single-shell tanks integrity, Washington River Protection Solutions, LLC, the USDOE Hanford Site tank contractor, developed an enhanced Single-Shell Tank (SST) Integrity Project in 2009. An expert panel on SST integrity, consisting of various subject matters experts in industry and academia, was created to provide recommendations supporting the development of the project. This panel developed 33 recommendations in four main areas of interest: structural integrity, liner degradation, leak integrity and prevention, and mitigation of contamination migration, Seventeen of these recommendations were used to develop the basis for the M-45-10-1 Change Package for the Hanford Federal Agreement and Compliance Order, which is also known as the Tri-Party Agreement. The change package identified two phases of work for SST integrity. The initial phase has been focused on efforts to envelope the integrity of the tanks. The initial phase was divided into two primary areas of investigation: structural integrity and leak integrity. If necessary based on the outcome from the initial work, a second phase would be focused on further definition of the integrity of the concrete and liners. Combined these two phases are designed to support the formal integrity assessment of the Hanford SSTs in 2018 by Independent Qualified Registered Engineer. The work to further define the DOE's understanding of the structural integrity SSTs involves preparing a modern Analysis of Record using a finite element analysis program. Structural analyses of the SSTs have been conducted since 1957, but these analyses used analog calculation, less rigorous models, or focused on individual structures. As such, an integrated understanding of all of the SSTs has not been developed to modern expectations. In support of this effort, other milestones will address the visual inspection of the tank concrete and the collection of concrete core samples from the tanks for analysis

Safety Analysis Report - Packages, 9965, 9968, 9972-9975 Packages

International Nuclear Information System (INIS)

Blanton, P.

2000-01-01

This Safety Analysis Report for Packaging (SARP) documents the analysis and testing performed on four type B Packages: the 9972, 9973, 9974, and 9975 packages. Because all four packages have similar designs with very similar performance characteristics, all of them are presented in a single SARP. The performance evaluation presented in this SARP documents the compliance of the 9975 package with the regulatory safety requirements. Evaluations of the 9972, 9973, and 9974 packages support that of the 9975. To avoid confusion arising from the inclusion of four packages in a single document, the text segregates the data for each package in such a way that the reader interested in only one package can progress from Chapter 1 through Chapter 9. The directory at the beginning of each chapter identifies each section that should be read for a given package. Sections marked ''all'' are generic to all packages

Integrated packaging of multiple double sided cooling planar bond power modules

Science.gov (United States)

Liang, Zhenxian

2018-04-10

An integrated double sided cooled power module has one or multiple phase legs configuration including one or more planar power packages, each planar power package having an upper power switch unit and a lower power switch unit directly bonded and interconnected between two insulated power substrates, and further sandwiched between two heat exchangers via direct bonds. A segmented coolant manifold is interposed with the one or more planar power packages and creates a sealed enclosure that defines a coolant inlet, a coolant outlet and a coolant flow path between the inlet and the outlet. A coolant circulates along the flow path to remove heat and increase the power density of the power module.

The Fireball integrated code package

Energy Technology Data Exchange (ETDEWEB)

Dobranich, D.; Powers, D.A.; Harper, F.T.

1997-07-01

Many deep-space satellites contain a plutonium heat source. An explosion, during launch, of a rocket carrying such a satellite offers the potential for the release of some of the plutonium. The fireball following such an explosion exposes any released plutonium to a high-temperature chemically-reactive environment. Vaporization, condensation, and agglomeration processes can alter the distribution of plutonium-bearing particles. The Fireball code package simulates the integrated response of the physical and chemical processes occurring in a fireball and the effect these processes have on the plutonium-bearing particle distribution. This integrated treatment of multiple phenomena represents a significant improvement in the state of the art for fireball simulations. Preliminary simulations of launch-second scenarios indicate: (1) most plutonium vaporization occurs within the first second of the fireball; (2) large non-aerosol-sized particles contribute very little to plutonium vapor production; (3) vaporization and both homogeneous and heterogeneous condensation occur simultaneously; (4) homogeneous condensation transports plutonium down to the smallest-particle sizes; (5) heterogeneous condensation precludes homogeneous condensation if sufficient condensation sites are available; and (6) agglomeration produces larger-sized particles but slows rapidly as the fireball grows.

Mousetrap: An integrated, open-source mouse-tracking package.

Science.gov (United States)

Kieslich, Pascal J; Henninger, Felix

2017-10-01

Mouse-tracking - the analysis of mouse movements in computerized experiments - is becoming increasingly popular in the cognitive sciences. Mouse movements are taken as an indicator of commitment to or conflict between choice options during the decision process. Using mouse-tracking, researchers have gained insight into the temporal development of cognitive processes across a growing number of psychological domains. In the current article, we present software that offers easy and convenient means of recording and analyzing mouse movements in computerized laboratory experiments. In particular, we introduce and demonstrate the mousetrap plugin that adds mouse-tracking to OpenSesame, a popular general-purpose graphical experiment builder. By integrating with this existing experimental software, mousetrap allows for the creation of mouse-tracking studies through a graphical interface, without requiring programming skills. Thus, researchers can benefit from the core features of a validated software package and the many extensions available for it (e.g., the integration with auxiliary hardware such as eye-tracking, or the support of interactive experiments). In addition, the recorded data can be imported directly into the statistical programming language R using the mousetrap package, which greatly facilitates analysis. Mousetrap is cross-platform, open-source and available free of charge from https://github.com/pascalkieslich/mousetrap-os .

AMBRE - a mathematica package for the construction of Mellin-Barnes representations for Feynman integrals

Energy Technology Data Exchange (ETDEWEB)

Gluza, J.; Kajda, K. [Silesia Univ, Katowice (Poland). Dept. of Field Theory and Particle Physics, Inst. of Phsyics; Riemann, T. [Deutsches Elektronen-Synchrotron (DESY), Zeuthen (Germany)

2007-05-15

The Mathematica toolkit AMBRE derives Mellin-Barnes (MB) representations for Feynman integrals in d=4-2{epsilon} dimensions. It may be applied for tadpoles as well as for multi-leg multi-loop scalar and tensor integrals. AMBRE uses a loop-by-loop approach and aims at lowest dimensions of the final MB representations. The present version of AMBRE works fine for planar Feynman diagrams. The output may be further processed by the package MB for the determination of its singularity structure in {epsilon}. The AMBRE package contains various sample applications for Feynman integrals with up to six external particles and up to four loops. (orig.)

European energy market liberalisation and integration. An assesment of the new EU energy package

International Nuclear Information System (INIS)

De Joode, J.; Van Oostvoorn, F.

2008-06-01

The new energy package presented by the European Commission (EC) in September 2007 contains a number of diverse, and sometimes controversial, measures aimed at bringing current European energy markets closer to the ideal of one competitive and fully integrated market. We discuss the flaws and merits of the package and signal a number of concerns regarding the ultimate effectiveness of the new energy market Directive into which the proposed package will culminate

High coherence plane breaking packaging for superconducting qubits

Science.gov (United States)

Bronn, Nicholas T.; Adiga, Vivekananda P.; Olivadese, Salvatore B.; Wu, Xian; Chow, Jerry M.; Pappas, David P.

2018-04-01

We demonstrate a pogo pin package for a superconducting quantum processor specifically designed with a nontrivial layout topology (e.g., a center qubit that cannot be accessed from the sides of the chip). Two experiments on two nominally identical superconducting quantum processors in pogo packages, which use commercially available parts and require modest machining tolerances, are performed at low temperature (10 mK) in a dilution refrigerator and both found to behave comparably to processors in standard planar packages with wirebonds where control and readout signals come in from the edges. Single- and two-qubit gate errors are also characterized via randomized benchmarking, exhibiting similar error rates as in standard packages, opening the possibility of integrating pogo pin packaging with extensible qubit architectures.

Packaging signals in single-stranded RNA viruses: nature?s alternative to a purely electrostatic assembly mechanism

OpenAIRE

Stockley, Peter G.; Twarock, Reidun; Bakker, Saskia E.; Barker, Amy M.; Borodavka, Alexander; Dykeman, Eric; Ford, Robert J.; Pearson, Arwen R.; Phillips, Simon E. V.; Ranson, Neil A.; Tuma, Roman

2013-01-01

The formation of a protective protein container is an essential step in the life-cycle of most viruses. In the case of single-stranded (ss)RNA viruses, this step occurs in parallel with genome packaging in a co-assembly process. Previously, it had been thought that this process can be explained entirely by electrostatics. Inspired by recent single-molecule fluorescence experiments that recapitulate the RNA packaging specificity seen in vivo for two model viruses, we present an alternative the...

Monte carlo study of MOSFET packaging, optimised for improved energy response: single MOSFET filtration.

Science.gov (United States)

Othman, M A R; Cutajar, D L; Hardcastle, N; Guatelli, S; Rosenfeld, A B

2010-09-01

Monte Carlo simulations of the energy response of a conventionally packaged single metal-oxide field effect transistors (MOSFET) detector were performed with the goal of improving MOSFET energy dependence for personal accident or military dosimetry. The MOSFET detector packaging was optimised. Two different 'drop-in' design packages for a single MOSFET detector were modelled and optimised using the GEANT4 Monte Carlo toolkit. Absorbed photon dose simulations of the MOSFET dosemeter placed in free-air response, corresponding to the absorbed doses at depths of 0.07 mm (D(w)(0.07)) and 10 mm (D(w)(10)) in a water equivalent phantom of size 30 x 30 x 30 cm(3) for photon energies of 0.015-2 MeV were performed. Energy dependence was reduced to within + or - 60 % for photon energies 0.06-2 MeV for both D(w)(0.07) and D(w)(10). Variations in the response for photon energies of 15-60 keV were 200 and 330 % for D(w)(0.07) and D(w)(10), respectively. The obtained energy dependence was reduced compared with that for conventionally packaged MOSFET detectors, which usually exhibit a 500-700 % over-response when used in free-air geometry.

Packaging Solutions : Delivering customer value through Logistical Packaging: A Case Study at Stora Enso Packaging

OpenAIRE

Shan, Kun; Julius, Joezer

2015-01-01

AbstractBackground;Despite of the significant role of packaging within logistics and supply chain management, packaging is infrequently studied as focal point in supply chain. Most of the previous logistics research studies tend to explain the integration between packaging and logistics through logistical packaging. In very rare cases, the studies mentioned about customer value. Therefore the major disadvantage of these studies is that, they didn’t consider logistical packaging and customer v...

An Integrable SIW Phase Shifter in a Partially Magnetized Ferrite LTCC Package

KAUST Repository

Nafe, Ahmed; Shamim, Atif

2015-01-01

, yielding them unsuitable for this kind of application. In this paper, a novel compact light-weight substrate integrated waveguide (SIW) based phase shifter realized in a multi-layer ferrite low-temperature co-fired ceramic package with embedded bias

Effecting aging time of epoxy molding compound to molding process for integrated circuit packaging

Science.gov (United States)

Tachapitunsuk, Jirayu; Ugsornrat, Kessararat; Srisuwitthanon, Warayoot; Thonglor, Panakamon

2017-09-01

This research studied about effecting aging time of epoxy molding compound (EMC) that effect to reliability performance of integrated circuit (IC) package in molding process. Molding process is so important of IC packaging process for protecting IC chip (or die) from temperature and humidity environment using encapsulated EMC. For general molding process, EMC are stored in the frozen at 5°C and left at room temperature at 25 °C for aging time on self before molding of die onto lead frame is 24 hours. The aging time effect to reliability performance of IC package due to different temperature and humidity inside the package. In experiment, aging time of EMC were varied from 0 to 24 hours for molding process of SOIC-8L packages. For analysis, these packages were tested by x-ray and scanning acoustic microscope to analyze properties of EMC with an aging time and also analyzed delamination, internal void, and wire sweep inside the packages with different aging time. The results revealed that different aging time of EMC effect to properties and reliability performance of molding process.

Recovery of leaded-frame metals from integrated circuit package; Shuseki kairo package kara no lead frame kinzoku no kaishu

Energy Technology Data Exchange (ETDEWEB)

Rokukawa, N.; Sakamoto, H. [National Institute for Resources and Environment, Tsukuba (Japan)

1997-12-25

Discussions were given on separation and recovery of leaded-frame metals from an integrated circuit (IC) package. A printed wiring board in an electronic device is mounted with an IC package molded with an IC as a major component, and composed of IC chips, leaded-frame metals (the pin section retains the IC chips safely in a mold, and plays a role of terminal with an external circuit), and mold material (thermally hardened and reinforced resin). Quantity of IC packages discarded as a result of the deterioration due to aging is increasing year after year. IC package test pieces were crushed in a mortar, selected of metals manually, and classified by using a magnet and a sieve. The leaded-frame metals were easily separated from the mold material by crushing, and capable of being recovered by using a magnet. However, since the recovered leaded-frame metals are alloys having different compositions, how each metal component could be separated and refined is an important problem to be solved. For the time being, the metals may be utilized as structural materials for building materials by melting and alloying the leaded-frame metals. 10 refs., 7 tabs.

Packaging signals in two single-stranded RNA viruses imply a conserved assembly mechanism and geometry of the packaged genome.

Science.gov (United States)

Dykeman, Eric C; Stockley, Peter G; Twarock, Reidun

2013-09-09

The current paradigm for assembly of single-stranded RNA viruses is based on a mechanism involving non-sequence-specific packaging of genomic RNA driven by electrostatic interactions. Recent experiments, however, provide compelling evidence for sequence specificity in this process both in vitro and in vivo. The existence of multiple RNA packaging signals (PSs) within viral genomes has been proposed, which facilitates assembly by binding coat proteins in such a way that they promote the protein-protein contacts needed to build the capsid. The binding energy from these interactions enables the confinement or compaction of the genomic RNAs. Identifying the nature of such PSs is crucial for a full understanding of assembly, which is an as yet untapped potential drug target for this important class of pathogens. Here, for two related bacterial viruses, we determine the sequences and locations of their PSs using Hamiltonian paths, a concept from graph theory, in combination with bioinformatics and structural studies. Their PSs have a common secondary structure motif but distinct consensus sequences and positions within the respective genomes. Despite these differences, the distributions of PSs in both viruses imply defined conformations for the packaged RNA genomes in contact with the protein shell in the capsid, consistent with a recent asymmetric structure determination of the MS2 virion. The PS distributions identified moreover imply a preferred, evolutionarily conserved assembly pathway with respect to the RNA sequence with potentially profound implications for other single-stranded RNA viruses known to have RNA PSs, including many animal and human pathogens. Copyright © 2013 Elsevier Ltd. All rights reserved.

Automated data collection in single particle electron microscopy

Science.gov (United States)

Tan, Yong Zi; Cheng, Anchi; Potter, Clinton S.; Carragher, Bridget

2016-01-01

Automated data collection is an integral part of modern workflows in single particle electron microscopy (EM) research. This review surveys the software packages available for automated single particle EM data collection. The degree of automation at each stage of data collection is evaluated, and the capabilities of the software packages are described. Finally, future trends in automation are discussed. PMID:26671944

Integration of numerical analysis tools for automated numerical optimization of a transportation package design

International Nuclear Information System (INIS)

Witkowski, W.R.; Eldred, M.S.; Harding, D.C.

1994-01-01

The use of state-of-the-art numerical analysis tools to determine the optimal design of a radioactive material (RAM) transportation container is investigated. The design of a RAM package's components involves a complex coupling of structural, thermal, and radioactive shielding analyses. The final design must adhere to very strict design constraints. The current technique used by cask designers is uncoupled and involves designing each component separately with respect to its driving constraint. With the use of numerical optimization schemes, the complex couplings can be considered directly, and the performance of the integrated package can be maximized with respect to the analysis conditions. This can lead to more efficient package designs. Thermal and structural accident conditions are analyzed in the shape optimization of a simplified cask design. In this paper, details of the integration of numerical analysis tools, development of a process model, nonsmoothness difficulties with the optimization of the cask, and preliminary results are discussed

Non-destructive evaluation of the hidden voids in integrated circuit packages using terahertz time-domain spectroscopy

International Nuclear Information System (INIS)

Park, Sung-Hyeon; Kim, Hak-Sung; Jang, Jin-Wook

2015-01-01

In this work, a terahertz time-domain spectroscopy (THz-TDS) imaging technique was used as a non-destructive inspection method for detecting voids in integrated circuit (IC) packages. Transmission and reflection modes, with an angle of incidence of 30°, were used to detect voids in IC packages. The locations of the detected voids in the IC packages could be calculated by analyzing THz waveforms. Finally, voids that are positioned at the different interfaces in the IC package samples could be successfully detected and imaged. Therefore, this THz-TDS imaging technique is expected to be a promising technique for non-destructive evaluation of IC packages. (paper)

Towards co-packaging of photonics and microelectronics in existing manufacturing facilities

Science.gov (United States)

Janta-Polczynski, Alexander; Cyr, Elaine; Bougie, Jerome; Drouin, Alain; Langlois, Richard; Childers, Darrell; Takenobu, Shotaro; Taira, Yoichi; Lichoulas, Ted W.; Kamlapurkar, Swetha; Engelmann, Sebastian; Fortier, Paul; Boyer, Nicolas; Barwicz, Tymon

2018-02-01

The impact of integrated photonics on optical interconnects is currently muted by challenges in photonic packaging and in the dense integration of photonic modules with microelectronic components on printed circuit boards. Single mode optics requires tight alignment tolerance for optical coupling and maintaining this alignment in a cost-efficient package can be challenging during thermal excursions arising from downstream microelectronic assembly processes. In addition, the form factor of typical fiber connectors is incompatible with the dense module integration expected on printed circuit boards. We have implemented novel approaches to interfacing photonic chips to standard optical fibers. These leverage standard high throughput microelectronic assembly tooling and self-alignment techniques resulting in photonic packaging that is scalable in manufacturing volume and in the number of optical IOs per chip. In addition, using dense optical fiber connectors with space-efficient latching of fiber patch cables results in compact module size and efficient board integration, bringing the optics closer to the logic chip to alleviate bandwidth bottlenecks. This packaging direction is also well suited for embedding optics in multi-chip modules, including both photonic and microelectronic chips. We discuss the challenges and rewards in this type of configuration such as thermal management and signal integrity.

Packaged die heater

Science.gov (United States)

Spielberger, Richard; Ohme, Bruce Walker; Jensen, Ronald J.

2011-06-21

A heater for heating packaged die for burn-in and heat testing is described. The heater may be a ceramic-type heater with a metal filament. The heater may be incorporated into the integrated circuit package as an additional ceramic layer of the package, or may be an external heater placed in contact with the package to heat the die. Many different types of integrated circuit packages may be accommodated. The method provides increased energy efficiency for heating the die while reducing temperature stresses on testing equipment. The method allows the use of multiple heaters to heat die to different temperatures. Faulty die may be heated to weaken die attach material to facilitate removal of the die. The heater filament or a separate temperature thermistor located in the package may be used to accurately measure die temperature.

Macromodels of digital integrated circuits for program packages of circuit engineering design

Science.gov (United States)

Petrenko, A. I.; Sliusar, P. B.; Timchenko, A. P.

1984-04-01

Various aspects of the generation of macromodels of digital integrated circuits are examined, and their effective application in program packages of circuit engineering design is considered. Three levels of macromodels are identified, and the application of such models to the simulation of circuit outputs is discussed.

Type B Drum packages

International Nuclear Information System (INIS)

Edwards, W.S.

1995-11-01

The Type B Drum package is a container in which a single drum containing Type B quantities of radioactive material will be packaged for shipment. The Type B Drum containers are being developed to fill a void in the packaging and transportation capabilities of the US Department of Energy (DOE), as no double containment packaging for single drums of Type B radioactive material is currently available. Several multiple-drum containers and shielded casks presently exist. However, the size and weight of these containers present multiple operational challenges for single-drum shipments. The Type B Drum containers will offer one unshielded version and, if needed, two shielded versions, and will provide for the option of either single or double containment. The primary users of the Type B Drum container will be any organization with a need to ship single drums of Type B radioactive material. Those users include laboratories, waste retrieval facilities, emergency response teams, and small facilities

Precise analysis of the metal package photomultiplier single photoelectron spectra

International Nuclear Information System (INIS)

Chirikov-Zorin, I.E.; Fedorko, I.; Sykora, I.; Tokar, S.; Menzione, A.

2000-01-01

A deconvolution method based on a sophisticated photomultiplier response function was used to analyse the compact metal package photomultiplier spectra taken in single photoelectron mode. The spectra taken by Hamamtsu R5600 and R5900 photomultipliers have been analysed. The detailed analysis shows that the method appropriately describes the process of charge multiplication in these photomultipliers in a wide range of working regimes and the deconvoluted parameters are established with about 1% accuracy. The method can be used for a detailed analysis of photomultiplier noise and for calibration purposes

Packaging of single DNA molecules by the yeast mitochondrial protein Abf2p.

Science.gov (United States)

Brewer, Laurence R; Friddle, Raymond; Noy, Aleksandr; Baldwin, Enoch; Martin, Shelley S; Corzett, Michele; Balhorn, Rod; Baskin, Ronald J

2003-10-01

Mitochondrial and nuclear DNA are packaged by proteins in a very different manner. Although protein-DNA complexes called "nucleoids" have been identified as the genetic units of mitochondrial inheritance in yeast and man, little is known about their physical structure. The yeast mitochondrial protein Abf2p was shown to be sufficient to compact linear dsDNA, without the benefit of supercoiling, using optical and atomic force microscopy single molecule techniques. The packaging of DNA by Abf2p was observed to be very weak as evidenced by a fast Abf2p off-rate (k(off) = 0.014 +/- 0.001 s(-1)) and the extremely small forces (<0.6 pN) stabilizing the condensed protein-DNA complex. Atomic force microscopy images of individual complexes showed the 190-nm structures are loosely packaged relative to nuclear chromatin. This organization may leave mtDNA accessible for transcription and replication, while making it more vulnerable to damage.

Implementation and integration of program packages NAMMU and HYPAC

International Nuclear Information System (INIS)

Nedbal, T.

1986-05-01

This work is prepared for the Swedish Power Inspectorate (SKI). The SKI has from the Atomic Energy Research Establishment (AERE) at Harwell, U.K., acquired the computer model NAMMU for groundwater hydrology calculations. The code was first implemented on an AMDAHL 470, a IBM compatible computer, and then modified in order to integrate it with HYPAC, which is a program package for pre- and post-processing finite element data, developed by KEMAKTA AB. This report describes the modifications done to both NAMMU and HYPAC, and the verification of the coupled program system NAMMU-HYPAC. (author)

Evaluation and selection of open-source EMR software packages based on integrated AHP and TOPSIS.

Science.gov (United States)

Zaidan, A A; Zaidan, B B; Al-Haiqi, Ahmed; Kiah, M L M; Hussain, Muzammil; Abdulnabi, Mohamed

2015-02-01

Evaluating and selecting software packages that meet the requirements of an organization are difficult aspects of software engineering process. Selecting the wrong open-source EMR software package can be costly and may adversely affect business processes and functioning of the organization. This study aims to evaluate and select open-source EMR software packages based on multi-criteria decision-making. A hands-on study was performed and a set of open-source EMR software packages were implemented locally on separate virtual machines to examine the systems more closely. Several measures as evaluation basis were specified, and the systems were selected based a set of metric outcomes using Integrated Analytic Hierarchy Process (AHP) and TOPSIS. The experimental results showed that GNUmed and OpenEMR software can provide better basis on ranking score records than other open-source EMR software packages. Copyright © 2014 Elsevier Inc. All rights reserved.

RF and microwave integrated circuit development technology, packaging and testing

CERN Document Server

Gamand, Patrice; Kelma, Christophe

2018-01-01

RF and Microwave Integrated Circuit Development bridges the gap between existing literature, which focus mainly on the 'front-end' part of a product development (system, architecture, design techniques), by providing the reader with an insight into the 'back-end' part of product development. In addition, the authors provide practical answers and solutions regarding the choice of technology, the packaging solutions and the effects on the performance on the circuit and to the industrial testing strategy. It will also discuss future trends and challenges and includes case studies to illustrate examples. * Offers an overview of the challenges in RF/microwave product design * Provides practical answers to packaging issues and evaluates its effect on the performance of the circuit * Includes industrial testing strategies * Examines relevant RF MIC technologies and the factors which affect the choice of technology for a particular application, e.g. technical performance and cost * Discusses future trends and challen...

Substrate Integrated Waveguide Based Phase Shifter and Phased Array in a Ferrite Low Temperature Co-fired Ceramic Package

KAUST Repository

Nafe, Ahmed A.

2014-03-01

Phased array antennas, capable of controlling the direction of their radiated beam, are demanded by many conventional as well as modern systems. Applications such as automotive collision avoidance radar, inter-satellite communication links and future man-portable satellite communication on move services require reconfigurable beam systems with stress on mobility and cost effectiveness. Microwave phase shifters are key components of phased antenna arrays. A phase shifter is a device that controls the phase of the signal passing through it. Among the technologies used to realize this device, traditional ferrite waveguide phase shifters offer the best performance. However, they are bulky and difficult to integrate with other system components. Recently, ferrite material has been introduced in Low Temperature Co-fired Ceramic (LTCC) multilayer packaging technology. This enables the integration of ferrite based components with other microwave circuitry in a compact, light-weight and mass producible package. Additionally, the recent concept of Substrate Integrated Waveguide (SIW) allowed realization of synthesized rectangular waveguide-like structures in planar and multilayer substrates. These SIW structures have been shown to maintain the merits of conventional rectangular waveguides such as low loss and high power handling capabilities while being planar and easily integrable with other components. Implementing SIW structures inside a multilayer ferrite LTCC package enables monolithic integration of phase shifters and phased arrays representing a true System on Package (SoP) solution. It is the objective of this thesis to pursue realizing efficient integrated phase shifters and phased arrays combining the above mentioned technologies, namely Ferrite LTCC and SIW. In this work, a novel SIW phase shifter in ferrite LTCC package is designed, fabricated and tested. The device is able to operate reciprocally as well as non-reciprocally. Demonstrating a measured maximum

iGC-an integrated analysis package of gene expression and copy number alteration.

Science.gov (United States)

Lai, Yi-Pin; Wang, Liang-Bo; Wang, Wei-An; Lai, Liang-Chuan; Tsai, Mong-Hsun; Lu, Tzu-Pin; Chuang, Eric Y

2017-01-14

With the advancement in high-throughput technologies, researchers can simultaneously investigate gene expression and copy number alteration (CNA) data from individual patients at a lower cost. Traditional analysis methods analyze each type of data individually and integrate their results using Venn diagrams. Challenges arise, however, when the results are irreproducible and inconsistent across multiple platforms. To address these issues, one possible approach is to concurrently analyze both gene expression profiling and CNAs in the same individual. We have developed an open-source R/Bioconductor package (iGC). Multiple input formats are supported and users can define their own criteria for identifying differentially expressed genes driven by CNAs. The analysis of two real microarray datasets demonstrated that the CNA-driven genes identified by the iGC package showed significantly higher Pearson correlation coefficients with their gene expression levels and copy numbers than those genes located in a genomic region with CNA. Compared with the Venn diagram approach, the iGC package showed better performance. The iGC package is effective and useful for identifying CNA-driven genes. By simultaneously considering both comparative genomic and transcriptomic data, it can provide better understanding of biological and medical questions. The iGC package's source code and manual are freely available at https://www.bioconductor.org/packages/release/bioc/html/iGC.html .

A Single-Pulse Integrator

DEFF Research Database (Denmark)

Miller, Arne

1974-01-01

A single-pulse integrator is described. It gives a relative measure of the integral of the output signal from a coil monitor on the Risø 10 MeV linear accelerator, and displays the value on a digital voltmeter. The reproduccibility is found to be better than ±1% for an accelerated pulse charge...

MEMS packaging: state of the art and future trends

Science.gov (United States)

Bossche, Andre; Cotofana, Carmen V. B.; Mollinger, Jeff R.

1998-07-01

Now that the technology for Integrated sensor and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discuss the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision molding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimized and automated plastic packaging processes.

Experimental and theoretical analyses of package-on-package structure under three-point bending loading

International Nuclear Information System (INIS)

Jia Su; Wang Xi-Shu; Ren Huai-Hui

2012-01-01

High density packaging is developing toward miniaturization and integration, which causes many difficulties in designing, manufacturing, and reliability testing. Package-on-Package (PoP) is a promising three-dimensional high-density packaging method that integrates a chip scale package (CSP) in the top package and a fine-pitch ball grid array (FBGA) in the bottom package. In this paper, in-situ scanning electron microscopy (SEM) observation is carried out to detect the deformation and damage of the PoP structure under three-point bending loading. The results indicate that the cracks occur in the die of the top package, then cause the crack deflection and bridging in the die attaching layer. Furthermore, the mechanical principles are used to analyse the cracking process of the PoP structure based on the multi-layer laminating hypothesis and the theoretical analysis results are found to be in good agreement with the experimental results. (condensed matter: structural, mechanical, and thermal properties)

Article I. Multi-platform Automated Software Building and Packaging

International Nuclear Information System (INIS)

Rodriguez, A Abad; Gomes Gouveia, V E; Meneses, D; Capannini, F; Aimar, A; Di Meglio, A

2012-01-01

One of the major goals of the EMI (European Middleware Initiative) project is the integration of several components of the pre-existing middleware (ARC, gLite, UNICORE and dCache) into a single consistent set of packages with uniform distributions and repositories. Those individual middleware projects have been developed in the last decade by tens of development teams and before EMI were all built and tested using different tools and dedicated services. The software, millions of lines of code, is written in several programming languages and supports multiple platforms. Therefore a viable solution ought to be able to build and test applications on multiple programming languages using common dependencies on all selected platforms. It should, in addition, package the resulting software in formats compatible with the popular Linux distributions, such as Fedora and Debian, and store them in repositories from which all EMI software can be accessed and installed in a uniform way. Despite this highly heterogeneous initial situation, a single common solution, with the aim of quickly automating the integration of the middleware products, had to be selected and implemented in a few months after the beginning of the EMI project. Because of the previous knowledge and the short time available in which to provide this common solution, the ETICS service, where the gLite middleware was already built for years, was selected. This contribution describes how the team in charge of providing a common EMI build and packaging infrastructure to the whole project has developed a homogeneous solution for releasing and packaging the EMI components from the initial set of tools used by the earlier middleware projects. An important element of the presentation is the developers experience and feedback on converging on ETICS and on the on-going work in order to finally add more widely used and supported build and packaging solutions of the Linux platforms

Overview Of Hanford Single Shell Tank (SST) Structural Integrity - 12123

International Nuclear Information System (INIS)

Rast, R.S.; Rinker, M.W.; Washenfelder, D.J.; Johnson, J.B.

2012-01-01

To improve the understanding of the single-shell tanks (SSTs) integrity, Washington River Protection Solutions, LLC (WRPS), the USDOE Hanford Site tank contractor, developed an enhanced Single-Shell Tank Integrity Project in 2009. An expert panel on SST integrity, consisting of various subject matters experts in industry and academia, was created to provide recommendations supporting the development of the project. This panel developed 33 recommendations in four main areas of interest: structural integrity, liner degradation, leak integrity and prevention, and mitigation of contamination migration. Seventeen of these recommendations were used to develop the basis for the M-45-10-1 Change Package for the Hanford Federal Agreement and Compliance Order, which is also known as the Tri-Party Agreement. The structural integrity of the tanks is a key element in completing the cleanup mission at the Hanford Site. There are eight primary recommendations related to the structural integrity of Hanford SSTs. Six recommendations are being implemented through current and planned activities. The structural integrity of the Hanford SSTs is being evaluated through analysis, monitoring, inspection, materials testing, and construction document review. Structural evaluation in the form of analysis is performed using modern finite element models generated in ANSYS(reg s ign) The analyses consider in-situ, thermal, operating loads and natural phenomena such as earthquakes. Structural analysis of 108 of 149 Hanford SSTs has concluded that the tanks are structurally sound and meet current industry standards. Analyses of the remaining Hanford SSTs are scheduled for FY2013. Hanford SSTs are monitored through a dome deflection program. The program looks for deflections of the tank dome greater than 1/4 inch. No such deflections have been recorded. The tanks are also subjected to visual inspection. Digital cameras record the interior surface of the concrete tank domes, looking for cracks and

OVERVIEW OF HANFORD SINGLE SHELL TANK (SST) STRUCTURAL INTEGRITY - 12123

Energy Technology Data Exchange (ETDEWEB)

RAST RS; RINKER MW; WASHENFELDER DJ; JOHNSON JB

2012-01-25

To improve the understanding of the single-shell tanks (SSTs) integrity, Washington River Protection Solutions, LLC (WRPS), the USDOE Hanford Site tank contractor, developed an enhanced Single-Shell Tank Integrity Project in 2009. An expert panel on SST integrity, consisting of various subject matters experts in industry and academia, was created to provide recommendations supporting the development of the project. This panel developed 33 recommendations in four main areas of interest: structural integrity, liner degradation, leak integrity and prevention, and mitigation of contamination migration. Seventeen of these recommendations were used to develop the basis for the M-45-10-1 Change Package for the Hanford Federal Agreement and Compliance Order, which is also known as the Tri-Party Agreement. The structural integrity of the tanks is a key element in completing the cleanup mission at the Hanford Site. There are eight primary recommendations related to the structural integrity of Hanford SSTs. Six recommendations are being implemented through current and planned activities. The structural integrity of the Hanford SSTs is being evaluated through analysis, monitoring, inspection, materials testing, and construction document review. Structural evaluation in the form of analysis is performed using modern finite element models generated in ANSYS{reg_sign} The analyses consider in-situ, thermal, operating loads and natural phenomena such as earthquakes. Structural analysis of 108 of 149 Hanford SSTs has concluded that the tanks are structurally sound and meet current industry standards. Analyses of the remaining Hanford SSTs are scheduled for FY2013. Hanford SSTs are monitored through a dome deflection program. The program looks for deflections of the tank dome greater than 1/4 inch. No such deflections have been recorded. The tanks are also subjected to visual inspection. Digital cameras record the interior surface of the concrete tank domes, looking for cracks and

RepoSTAR. A Code package for control and evaluation of statistical calculations with the program package RepoTREND; RepoSTAR. Ein Codepaket zur Steuerung und Auswertung statistischer Rechenlaeufe mit dem Programmpaket RepoTREND

Energy Technology Data Exchange (ETDEWEB)

Becker, Dirk-Alexander

2016-05-15

The program package RepoTREND for the integrated long terms safety analysis of final repositories allows besides deterministic studies of defined problems also statistical or probabilistic analyses. Probabilistic uncertainty and sensitivity analyses are realized in the program package repoTREND by a specific statistic frame called RepoSTAR. The report covers the following issues: concept, sampling and data supply of single simulations, evaluation of statistical calculations with the program RepoSUN.

Current status of the ParInt package for parallel multivariate integration

International Nuclear Information System (INIS)

Doncker, E. de; Kaugars, K.; Cucos, L.; Zanny, R.

2002-01-01

The ParInt project focuses on the development of parallel algorithms and software for the computation of multi-variate integrals. We will give an overview of the contents and capabilities of the package. Our objective has been to provide the end-user with state of the art problem solving power. This has required work in a number of areas, including the fundamental numerical techniques, strategies for parallelization, user interfaces for general use and specific applications, and visualization of computations to analyze the mutual influences of problem characteristics and algorithm behavior. Furthermore, the integration of all the above into a versatile set of tools is aimed toward an efficient use of the available parallel or distributed computer resources. (author)

Documentation of the seawater intrusion (SWI2) package for MODFLOW

Science.gov (United States)

Bakker, Mark; Schaars, Frans; Hughes, Joseph D.; Langevin, Christian D.; Dausman, Alyssa M.

2013-01-01

The SWI2 Package is the latest release of the Seawater Intrusion (SWI) Package for MODFLOW. The SWI2 Package allows three-dimensional vertically integrated variable-density groundwater flow and seawater intrusion in coastal multiaquifer systems to be simulated using MODFLOW-2005. Vertically integrated variable-density groundwater flow is based on the Dupuit approximation in which an aquifer is vertically discretized into zones of differing densities, separated from each other by defined surfaces representing interfaces or density isosurfaces. The numerical approach used in the SWI2 Package does not account for diffusion and dispersion and should not be used where these processes are important. The resulting differential equations are equivalent in form to the groundwater flow equation for uniform-density flow. The approach implemented in the SWI2 Package allows density effects to be incorporated into MODFLOW-2005 through the addition of pseudo-source terms to the groundwater flow equation without the need to solve a separate advective-dispersive transport equation. Vertical and horizontal movement of defined density surfaces is calculated separately using a combination of fluxes calculated through solution of the groundwater flow equation and a simple tip and toe tracking algorithm. Use of the SWI2 Package in MODFLOW-2005 only requires the addition of a single additional input file and modification of boundary heads to freshwater heads referenced to the top of the aquifer. Fluid density within model layers can be represented using zones of constant density (stratified flow) or continuously varying density (piecewise linear in the vertical direction) in the SWI2 Package. The main advantage of using the SWI2 Package instead of variable-density groundwater flow and dispersive solute transport codes, such as SEAWAT and SUTRA, is that fewer model cells are required for simulations using the SWI2 Package because every aquifer can be represented by a single layer of cells

Integrated microsystems packaging approach with LCP

Science.gov (United States)

Jaynes, Paul; Shacklette, Lawrence W.

2006-05-01

Within the government communication market there is an increasing push to further miniaturize systems with the use of chip-scale packages, flip-chip bonding, and other advances over traditional packaging techniques. Harris' approach to miniaturization includes these traditional packaging advances, but goes beyond this level of miniaturization by combining the functional and structural elements of a system, thus creating a Multi-Functional Structural Circuit (MFSC). An emerging high-frequency, near hermetic, thermoplastic electronic substrate material, Liquid Crystal Polymer (LCP), is the material that will enable the combination of the electronic circuit and the physical structure of the system. The first embodiment of this vision for Harris is the development of a battlefield acoustic sensor module. This paper will introduce LCP and its advantages for MFSC, present an example of the work that Harris has performed, and speak to LCP MFSCs' potential benefits to miniature communications modules and sensor platforms.

Packaging for Food Service

Science.gov (United States)

Stilwell, E. J.

1985-01-01

Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.

Integration of Product, Package, Process, and Environment: A Food System Optimization

Science.gov (United States)

Cooper, Maya R.; Douglas, Grace L.

2015-01-01

The food systems slated for future NASA missions must meet crew nutritional needs, be acceptable for consumption, and use resources efficiently. Although the current food system of prepackaged, moderately stabilized food items works well for International Space Station (ISS) missions, many of the current space menu items do not maintain acceptability and/or nutritive value beyond 2 years. Longer space missions require that the food system can sustain the crew for 3 to 5 years without replenishment. The task "Integration of Product, Package, Process, and Environment: A Food System Optimization" has the objective of optimizing food-product shelf life for the space-food system through product recipe adjustments, new packaging and processing technologies, and modified storage conditions. Two emergent food processing technologies were examined to identify a pathway to stable, wet-pack foods without the detrimental color and texture effects. Both microwave-assisted thermal sterilization (MATS) and pressure-assisted thermal stabilization (PATS) were evaluated against traditional retort processing to determine if lower heat inputs during processing would produce a product with higher micronutrient quality and longer shelf life. While MATS products did have brighter color and better texture initially, the advantages were not sustained. The non-metallized packaging film used in the process likely provided inadequate oxygen barrier. No difference in vitamin stability was evident between MATS and retort processed foods. Similarly, fruit products produced using PATS showed improved color and texture through 3 years of storage compared to retort fruit, but the vitamin stability was not improved. The final processing study involved freeze drying. Five processing factors were tested in factorial design to assess potential impact of each to the quality of freeze-dried food, including the integrity of the microstructure. The initial freezing rate and primary freeze drying

Integrating environmental management into food safety and food packaging in Malaysia: review of the food regulation 1985

Science.gov (United States)

Nordin, N. H.; Hara, H.; Kaida, N.

2017-05-01

Food safety is an important issue that is related to public safety to prevent the toxicity threats of the food. Management through legal approach has been used in Malaysia as one of the predominant approaches to manage the environment. In this regard, the Food Regulation 1985 has been one of the mechanisms of environmental management through legal approach in controlling the safety of packaged food in food packaging industry in Malaysia. The present study aims to analyse and to explain the implementation of the Food Regulation 1985 in controlling the safety of packaged food in Malaysia and to integrate the concept of environmental management into the food safety issue. Qualitative analysis on the regulation document revealed that there are two main themes, general and specific, while their seven sub themes are included harmful packages, safety packages, reuse packages, polyvinyl chloride (PVC), alcoholic bottle, toys, money and others and iron powder. The implementation of the Food Regulation 1985 in controlling the safety of packaged food should not be regarded solely for regulation purposes but should be further developed for a broader sense of food safety from overcoming the food poisoning.

Waste package performance assessment

International Nuclear Information System (INIS)

Lester, D.H.

1981-01-01

This paper describes work undertaken to assess the life-expectancy and post-failure nuclide release behavior of high-level and waste packages in a geologic repository. The work involved integrating models of individual phenomena (such as heat transfer, corrosion, package deformation, and nuclide transport) and using existing data to make estimates of post-emplacement behavior of waste packages. A package performance assessment code was developed to predict time to package failure in a flooded repository and subsequent transport of nuclides out of the leaking package. The model has been used to evaluate preliminary package designs. The results indicate, that within the limitation of model assumptions and data base, packages lasting a few hundreds of years could be developed. Very long lived packages may be possible but more comprehensive data are needed to confirm this

Type B drum packages

International Nuclear Information System (INIS)

McCoy, J.C.

1994-08-01

The Type B drum packages (TBD) are conceptualized as a family of containers in which a single 208 L or 114 L (55 gal or 30 gal) drum containing Type B quantities of radioactive material (RAM) can be packaged for shipment. The TBD containers are being developed to fill a void in the packaging and transportation capabilities of the U.S. Department of Energy as no container packaging single drums of Type B RAM exists offering double containment. Several multiple-drum containers currently exist, as well as a number of shielded casks, but the size and weight of these containers present many operational challenges for single-drum shipments. As an alternative, the TBD containers will offer up to three shielded versions (light, medium, and heavy) and one unshielded version, each offering single or optional double containment for a single drum. To reduce operational complexity, all versions will share similar design and operational features where possible. The primary users of the TBD containers are envisioned to be any organization desiring to ship single drums of Type B RAM, such as laboratories, waste retrieval activities, emergency response teams, etc. Currently, the TBD conceptual design is being developed with the final design and analysis to be completed in 1995 to 1996. Testing and certification of the unshielded version are planned to be completed in 1996 to 1997 with production to begin in 1997 to 1998

Simplified analytical solutions for free drops during NCT for radioactive material packagings

International Nuclear Information System (INIS)

Gupta, N.K.

1997-01-01

To ensure structural integrity during normal conditions of transport (NCT), Federal regulations in 10CFR71.71 require that the nuclear material package designs be evaluated for the effects of free drops. The vessel stress acceptance criteria for these drops are given in Regulatory Guide 7.6 and ASME Section III Code. During initial phases of the package design, the effects of the NCT free drops can be evaluated by simplified analytical solutions which will ensure that the safety margins specified in R. G. 7.6 are met. These safety margins can be verified during the final stages of the package design with dynamic analyses using finite element methods. This paper calculates the maximum impact open-quotes gclose quotes loading on the vessels using single degree of freedom models for different drop orientations. Only end, bottom, and corner drops are analyzed for cylindrical packages or packages with cylindrical ends

Universal storage/transport/disposal packages

International Nuclear Information System (INIS)

Smith, M.L.

1992-01-01

In this paper a concept for a more robust Engineered Barrier System (EBS) that is part of an integrated waste management system is presented. This integrated system uses a thick walled metal package as the basic component of an integrated system for utility site storage, MRS storage, transportation, and disposal. Overpacks are used where necessary to supplement the basic package in each application. This integrated system combines the advantages of a robust EBS (improved margin and confidence in the repository) with a systems approach that can simplify the waste management system and reduce costs

Advancements in meat packaging.

Science.gov (United States)

McMillin, Kenneth W

2017-10-01

Packaging of meat provides the same or similar benefits for raw chilled and processed meats as other types of food packaging. Although air-permeable packaging is most prevalent for raw chilled red meat, vacuum and modified atmosphere packaging offer longer shelf life. The major advancements in meat packaging have been in the widely used plastic polymers while biobased materials and their integration into composite packaging are receiving much attention for functionality and sustainability. At this time, active and intelligent packaging are not widely used for antioxidant, antimicrobial, and other functions to stabilize and enhance meat properties although many options are being developed and investigated. The advances being made in nanotechnology will be incorporated into food packaging and presumably into meat packaging when appropriate and useful. Intelligent packaging using sensors for transmission of desired information and prompting of subsequent changes in packaging materials, environments or the products to maintain safety and quality are still in developmental stages. Copyright © 2017 Elsevier Ltd. All rights reserved.

3D packaging of a microfluidic system with sensory applications

Science.gov (United States)

Morrissey, Anthony; Kelly, Gerard; Alderman, John C.

1997-09-01

Among the main benefits of microsystem technology are its contributions to cost reductio, reliability and improved performance. however, the packaging of microsystems, and particularly microsensor, has proven to be one of the biggest limitations to their commercialization and the packaging of silicon sensor devices can be the most costly part of their fabrication. This paper describes the integration of 3D packaging of a microsystem. Central to the operation of the 3D demonstrator is a micromachined silicon membrane pump to supply fluids to a sensing chamber constructed about the active area of a sensor chip. This chip carries ISFET based chemical sensors, pressure sensors and thermal sensors. The electronics required for controlling and regulating the activity of the various sensors ar also available on this chip and as other chips in the 3D assembly. The demonstrator also contains a power supply module with optical fiber interconnections. All of these modules are integrated into a single plastic- encapsulated 3D vertical multichip module. The reliability of such a structure, initially proposed by Val was demonstrated by Barrett et al. An additional module available for inclusion in some of our assemblies is a test chip capable of measuring the packaging-induced stress experienced during and after assembly. The packaging process described produces a module with very high density and utilizes standard off-the-shelf components to minimize costs. As the sensor chip and micropump include micromachined silicon membranes and microvalves, the packaging of such structures has to allow consideration for the minimization of the packaging-induced stresses. With this in mind, low stress techniques, including the use of soft glob-top materials, were employed.

Lithium niobate packaging challenges

International Nuclear Information System (INIS)

Murphy, E.J.; Holmes, R.J.; Jander, R.B.; Schelling, A.W.

1988-01-01

The use of lithium niobate integrated optic devices outside of the research laboratory is predicated on the development of a sound packaging method. The authors present a discussion of the many issues that face the development of a viable, robust packaging technology. The authors emphasize the interaction of lithium niobate's physical properties with available packaging materials and technologies. The broad range of properties (i.e. electro-optic, piezo-electric, pyro-electric, photorefractive...) that make lithium niobate an interesting material in many device applications also make it a packaging challenge. The package design, materials and packaging technologies must isolate the device from the environment so that lithium niobate's properties do not adversely affect the device performance

Medical knowledge packages and their integration into health-care information systems and the World Wide Web.

Science.gov (United States)

Adlassnig, Klaus-Peter; Rappelsberger, Andrea

2008-01-01

Software-based medical knowledge packages (MKPs) are packages of highly structured medical knowledge that can be integrated into various health-care information systems or the World Wide Web. They have been established to provide different forms of clinical decision support such as textual interpretation of combinations of laboratory rest results, generating diagnostic hypotheses as well as confirmed and excluded diagnoses to support differential diagnosis in internal medicine, or for early identification and automatic monitoring of hospital-acquired infections. Technically, an MKP may consist of a number of inter-connected Arden Medical Logic Modules. Several MKPs have been integrated thus far into hospital, laboratory, and departmental information systems. This has resulted in useful and widely accepted software-based clinical decision support for the benefit of the patient, the physician, and the organization funding the health care system.

Fabrication and characterization of etched facets in InP for advanced packaging of Photonic Integrated circuits

NARCIS (Netherlands)

Lemos Alvares Dos Santos, R.M.; D'Agostino, D.; Rabbani Haghighi, H.; Smit, M.K.; Leijtens, X.J.M.; Garcia Blanco, S.M.; Boller, K.J.; Sefunc, M.A.; Geuzebroek, D.

2014-01-01

In this work we describe the fabrication and characterization of straight and angled etched facets compatible with the standard COBRA active-passive process. The implementation of these structures enables advanced packaging of photonic integrated circuits with multiple optical inputs and outputs.

Single Molecule Analysis Research Tool (SMART: an integrated approach for analyzing single molecule data.

Directory of Open Access Journals (Sweden)

Max Greenfeld

Full Text Available Single molecule studies have expanded rapidly over the past decade and have the ability to provide an unprecedented level of understanding of biological systems. A common challenge upon introduction of novel, data-rich approaches is the management, processing, and analysis of the complex data sets that are generated. We provide a standardized approach for analyzing these data in the freely available software package SMART: Single Molecule Analysis Research Tool. SMART provides a format for organizing and easily accessing single molecule data, a general hidden Markov modeling algorithm for fitting an array of possible models specified by the user, a standardized data structure and graphical user interfaces to streamline the analysis and visualization of data. This approach guides experimental design, facilitating acquisition of the maximal information from single molecule experiments. SMART also provides a standardized format to allow dissemination of single molecule data and transparency in the analysis of reported data.

Planar-integrated single-crystalline perovskite photodetectors

KAUST Repository

Saidaminov, Makhsud I.

2015-11-09

Hybrid perovskites are promising semiconductors for optoelectronic applications. However, they suffer from morphological disorder that limits their optoelectronic properties and, ultimately, device performance. Recently, perovskite single crystals have been shown to overcome this problem and exhibit impressive improvements: low trap density, low intrinsic carrier concentration, high mobility, and long diffusion length that outperform perovskite-based thin films. These characteristics make the material ideal for realizing photodetection that is simultaneously fast and sensitive; unfortunately, these macroscopic single crystals cannot be grown on a planar substrate, curtailing their potential for optoelectronic integration. Here we produce large-area planar-integrated films made up of large perovskite single crystals. These crystalline films exhibit mobility and diffusion length comparable with those of single crystals. Using this technique, we produced a high-performance light detector showing high gain (above 104 electrons per photon) and high gain-bandwidth product (above 108 Hz) relative to other perovskite-based optical sensors.

Heterogeneous Monolithic Integration of Single-Crystal Organic Materials.

Science.gov (United States)

Park, Kyung Sun; Baek, Jangmi; Park, Yoonkyung; Lee, Lynn; Hyon, Jinho; Koo Lee, Yong-Eun; Shrestha, Nabeen K; Kang, Youngjong; Sung, Myung Mo

2017-02-01

Manufacturing high-performance organic electronic circuits requires the effective heterogeneous integration of different nanoscale organic materials with uniform morphology and high crystallinity in a desired arrangement. In particular, the development of high-performance organic electronic and optoelectronic devices relies on high-quality single crystals that show optimal intrinsic charge-transport properties and electrical performance. Moreover, the heterogeneous integration of organic materials on a single substrate in a monolithic way is highly demanded for the production of fundamental organic electronic components as well as complex integrated circuits. Many of the various methods that have been designed to pattern multiple heterogeneous organic materials on a substrate and the heterogeneous integration of organic single crystals with their crystal growth are described here. Critical issues that have been encountered in the development of high-performance organic integrated electronics are also addressed. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Single-Molecule FISH Reveals Non-selective Packaging of Rift Valley Fever Virus Genome Segments.

Directory of Open Access Journals (Sweden)

Paul J Wichgers Schreur

2016-08-01

Full Text Available The bunyavirus genome comprises a small (S, medium (M, and large (L RNA segment of negative polarity. Although genome segmentation confers evolutionary advantages by enabling genome reassortment events with related viruses, genome segmentation also complicates genome replication and packaging. Accumulating evidence suggests that genomes of viruses with eight or more genome segments are incorporated into virions by highly selective processes. Remarkably, little is known about the genome packaging process of the tri-segmented bunyaviruses. Here, we evaluated, by single-molecule RNA fluorescence in situ hybridization (FISH, the intracellular spatio-temporal distribution and replication kinetics of the Rift Valley fever virus (RVFV genome and determined the segment composition of mature virions. The results reveal that the RVFV genome segments start to replicate near the site of infection before spreading and replicating throughout the cytoplasm followed by translocation to the virion assembly site at the Golgi network. Despite the average intracellular S, M and L genome segments approached a 1:1:1 ratio, major differences in genome segment ratios were observed among cells. We also observed a significant amount of cells lacking evidence of M-segment replication. Analysis of two-segmented replicons and four-segmented viruses subsequently confirmed the previous notion that Golgi recruitment is mediated by the Gn glycoprotein. The absence of colocalization of the different segments in the cytoplasm and the successful rescue of a tri-segmented variant with a codon shuffled M-segment suggested that inter-segment interactions are unlikely to drive the copackaging of the different segments into a single virion. The latter was confirmed by direct visualization of RNPs inside mature virions which showed that the majority of virions lack one or more genome segments. Altogether, this study suggests that RVFV genome packaging is a non-selective process.

Implementation of the GFS physical package in the GRAPES regional model: single column experiment

Science.gov (United States)

Chen, Baode; Huang, Wei; Bao, Jian-wen

2015-04-01

There is a growing concern about coupling among physical components in NWP models. The Physics package of the NCEP Global Forecast System (GFS) has been considerably turned and connection among various components is well considered. Thus, the full GFS physical package was implemented into the GRAPES-MESO and its single column version as well. Using the data collected at ARM Southern Great Plain site during the summer 1997 Intensive Observing Period, several experiments of single-column model (SCM) were conducted to test performance of a set of original physical processes of GRAPES(CTL experiment) and the GFS physics package implemented(GFS experiment). Temperature, moisture, radiation, surface heat flux, surface air temperature and precipitation are evaluated. It is found that potential temperature and vapor mixing ratio simulated by GFS experiment is more accurate than that of CTL experiment. Errors of surface downward solar and long-wave radiation simulated by GFS experiment are less than that of CTL experiment and upward latent and sensible heat flux are also better agreeing with observation. The maximum and minimum 2-m air temperatures of the GFS experiment are close to observation compared with that of CTL experiment. Analysis of precipitation simulated shows that both sets of physical processes well reproduce heavy rainfall events. Failure and delay of moderate rainfall events and over predictions of drizzle events are commonly found for two sets of experiments. For the case of three rainfall events, the errors of potential temperature and vapor mixing ratio simulated by GFS experiment were smaller than that of CTL experiment. It is shown that the late occurrences of rainfall are resulted from a more stable temperature profile and lower moisture simulated in boundary layer than those from the observation prior to rainfall. When the simulated rainfall occurs, the simulated temperature and moisture become more favorable to the precipitation than observation.

An R package for the integrated analysis of metabolomics and spectral data.

Science.gov (United States)

Costa, Christopher; Maraschin, Marcelo; Rocha, Miguel

2016-06-01

Recently, there has been a growing interest in the field of metabolomics, materialized by a remarkable growth in experimental techniques, available data and related biological applications. Indeed, techniques as nuclear magnetic resonance, gas or liquid chromatography, mass spectrometry, infrared and UV-visible spectroscopies have provided extensive datasets that can help in tasks as biological and biomedical discovery, biotechnology and drug development. However, as it happens with other omics data, the analysis of metabolomics datasets provides multiple challenges, both in terms of methodologies and in the development of appropriate computational tools. Indeed, from the available software tools, none addresses the multiplicity of existing techniques and data analysis tasks. In this work, we make available a novel R package, named specmine, which provides a set of methods for metabolomics data analysis, including data loading in different formats, pre-processing, metabolite identification, univariate and multivariate data analysis, machine learning, and feature selection. Importantly, the implemented methods provide adequate support for the analysis of data from diverse experimental techniques, integrating a large set of functions from several R packages in a powerful, yet simple to use environment. The package, already available in CRAN, is accompanied by a web site where users can deposit datasets, scripts and analysis reports to be shared with the community, promoting the efficient sharing of metabolomics data analysis pipelines. Copyright © 2016 Elsevier Ireland Ltd. All rights reserved.

Packaging Concerns and Techniques for Large Devices: Challenges for Complex Electronics

Science.gov (United States)

LaBel, Kenneth A.; Sampson, Michael J.

2010-01-01

NASA is going to have to accept the use of non-hermetic packages for complex devices. There are a large number of packaging options available. Space application subjects the packages to stresses that they were probably not designed for (vacuum for instance). NASA has to find a way of having assurance in the integrity of the packages. There are manufacturers interested in qualifying non-hermetic packages to MIL-PRF-38535 Class V. Government space users are agreed that Class V should be for hermetic packages only. NASA is working on a new Class for non-hermetic packages for M38535 Appendix B, "Class Y". Testing for package integrity will be required but can be package specific as described by a Package Integrity Test Plan. The plan is developed by the manufacturer and approved by DSCC and government space.

Active and intelligent packaging systems for a modern society.

Science.gov (United States)

Realini, Carolina E; Marcos, Begonya

2014-11-01

Active and intelligent packaging systems are continuously evolving in response to growing challenges from a modern society. This article reviews: (1) the different categories of active and intelligent packaging concepts and currently available commercial applications, (2) latest packaging research trends and innovations, and (3) the growth perspectives of the active and intelligent packaging market. Active packaging aiming at extending shelf life or improving safety while maintaining quality is progressing towards the incorporation of natural active agents into more sustainable packaging materials. Intelligent packaging systems which monitor the condition of the packed food or its environment are progressing towards more cost-effective, convenient and integrated systems to provide innovative packaging solutions. Market growth is expected for active packaging with leading shares for moisture absorbers, oxygen scavengers, microwave susceptors and antimicrobial packaging. The market for intelligent packaging is also promising with strong gains for time-temperature indicator labels and advancements in the integration of intelligent concepts into packaging materials. Copyright © 2014 Elsevier Ltd. All rights reserved.

Fully Packaged Carbon Nanotube Supercapacitors by Direct Ink Writing on Flexible Substrates.

Science.gov (United States)

Chen, Bolin; Jiang, Yizhou; Tang, Xiaohui; Pan, Yayue; Hu, Shan

2017-08-30

The ability to print fully packaged integrated energy storage components (e.g., supercapacitors) is of critical importance for practical applications of printed electronics. Due to the limited variety of printable materials, most studies on printed supercapacitors focus on printing the electrode materials but rarely the full-packaged cell. This work presents for the first time the printing of a fully packaged single-wall carbon nanotube-based supercapacitor with direct ink writing (DIW) technology. Enabled by the developed ink formula, DIW setup, and cell architecture, the whole printing process is mask free, transfer free, and alignment free with precise and repeatable control on the spatial distribution of all constituent materials. Studies on cell design show that a wider electrode pattern and narrower gap distance between electrodes lead to higher specific capacitance. The as-printed fully packaged supercapacitors have energy and power performances that are among the best in recently reported planar carbon-based supercapacitors that are only partially printed or nonprinted.

BUMS--Bonner sphere Unfolding Made Simple an HTML based multisphere neutron spectrometer unfolding package

CERN Document Server

Sweezy, J; Veinot, K

2002-01-01

A new multisphere neutron spectrometer unfolding package, Bonner sphere Unfolding Made Simple (BUMS) has been developed that uses an HTML interface to simplify data input and code execution for the novice and the advanced user. This new unfolding package combines the unfolding algorithms contained in other popular unfolding codes under one easy to use interface. The interface makes use of web browsing software to provide a graphical user interface to the unfolding algorithms. BUMS integrates the SPUNIT, BON, MAXIET, and SAND-II unfolding algorithms into a single package. This package also includes a library of 14 response matrices, 58 starting spectra, and 24 dose and detector responses. BUMS has several improvements beyond the addition of unfolding algorithms. It has the ability to search for the most appropriate starting spectra. Also, plots of the unfolded neutron spectra are automatically generated. The BUMS package runs via a web server and may be accessed by any computer with access to the Internet at h...

BUMS--Bonner sphere Unfolding Made Simple: an HTML based multisphere neutron spectrometer unfolding package

International Nuclear Information System (INIS)

Sweezy, Jeremy; Hertel, Nolan; Veinot, Ken

2002-01-01

A new multisphere neutron spectrometer unfolding package, Bonner sphere Unfolding Made Simple (BUMS) has been developed that uses an HTML interface to simplify data input and code execution for the novice and the advanced user. This new unfolding package combines the unfolding algorithms contained in other popular unfolding codes under one easy to use interface. The interface makes use of web browsing software to provide a graphical user interface to the unfolding algorithms. BUMS integrates the SPUNIT, BON, MAXIET, and SAND-II unfolding algorithms into a single package. This package also includes a library of 14 response matrices, 58 starting spectra, and 24 dose and detector responses. BUMS has several improvements beyond the addition of unfolding algorithms. It has the ability to search for the most appropriate starting spectra. Also, plots of the unfolded neutron spectra are automatically generated. The BUMS package runs via a web server and may be accessed by any computer with access to the Internet at http://nukeisit.gatech.edu/bums

Packaging of microwave integrated circuits operating beyond 100 GHz

Science.gov (United States)

Samoska, L.; Daniel, E.; Sokolov, V.; Sommerfeldt, S.; Bublitz, J.; Olson, K.; Gilbert, B.; Chow, D.

2002-01-01

Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5dB and return loss better than -17 dB from DC to 110 GHz. A motherboard/daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method. Split waveguide block packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe andantipodal finline.

Integration of packaging design and planning into transportation

International Nuclear Information System (INIS)

Jarrell, R.F.

1993-01-01

In the past, numerous programs, projects, and design concepts for packaging and materials production have taken place without all the principal participants being involved in the up-front planning process. Many major facilities and packagings have been designed without the involvement of Transportation professionals. Unfortunately, Transportation has been overlooked and in most cases is a critical element that should have been included in the Planning process. (J.P.N.)

An Integrated Communication Skills Package for Undergraduate Chemists

Science.gov (United States)

Kerr, W. J.; Murray, R. E. G.; Moore, B. D.; Nonhebel, D. C.

2000-02-01

Positive feedback and evaluations were provided by students, graduates, academic staff in the department, and industrial contacts and employers. The funding council (Scottish Higher Education Funding Council), in the report on the Teaching Quality Assessment visit, identified this communication skills package as one of the Department's strengths in teaching. These positive evaluations suggest that the package is an effective means of developing the communication skills of students in chemistry.

Hermeticity of electronic packages

CERN Document Server

Greenhouse, Hal; Romenesco, Bruce

2011-01-01

This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the packageùespecially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to so

Hermeticity of electronic packages

CERN Document Server

Greenhouse, Hal

2000-01-01

This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package-especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to so

System issues for multichip packaging

Science.gov (United States)

Sage, Maurice G.; Hartley, Neil

1991-04-01

It is now generally recognised that the performance of an electronic system is governed by the choice of packaging technology. Never before have the technical and financial implications of a packaging technology choice been more critical and never before has technology interdependence or industry globalisation made the choice more difficult. This paper is aimed at examining the choices available and the system issues resulting from the move from single chip to multichip packaging.

PRIDE Surveillance Projects Data Packaging Project, Information Package Specification Version 1.0

Energy Technology Data Exchange (ETDEWEB)

Kelleher, D.M.; Shipp, R. L.; Mason, J. D.

2009-09-28

This document contains a specification for a standard XML document format called an information package that can be used to store information and the context required to understand and use that information in information management systems and other types of information archives. An information package consists of packaged information, a set of information metadata that describes the packaged information, and an XML signature that protects the packaged information. The information package described in this specification was designed to be used to store Department of Energy (DOE) and National Nuclear Security Administration (NNSA) information and includes the metadata required for that information: a unique package identifier, information marking that conforms to DOE and NNSA requirements, and access control metadata. Information package metadata can also include information search terms, package history, and notes. Packaged information can be text content, binary content, and the contents of files and other containers. A single information package can contain multiple types of information. All content not in a text form compatible with XML must be in a text encoding such as base64. Package information is protected by a digital XML signature that can be used to determine whether the information has changed since it was signed and to identify the source of the information. This specification has been tested but has not been used to create production information packages. The authors expect that gaps and unclear requirements in this specification will be identified as this specification is used to create information packages and as information stored in information packages is used. The authors expect to issue revised versions of this specification as needed to address these issues.

Mitigation of biofilm formation on corrugated cardboard fresh produce packaging surfaces using a novel thiazolidinedione derivative integrated in acrylic emulsion polymers

Directory of Open Access Journals (Sweden)

Michael eBrandwein

2016-02-01

Full Text Available Various surfaces associated with the storage and packing of food are known to harbor distinct bacterial pathogens. Conspicuously absent among the plethora of studies implicating food packaging materials and machinery is the study of corrugated cardboard packaging, the worldwide medium for transporting fresh produce. In this study, we observed the microbial communities of three different store-bought fruits and vegetables, along with their analogue cardboard packaging using high throughput sequencing technology. We further developed an anti-biofilm polymer meant to coat corrugated cardboard surfaces and mediate bacterial biofilm growth on said surfaces. Integration of a novel thiazolidinedione derivative into the acrylic emulsion polymers was assessed using Energy Dispersive X-ray Spectrometry analysis and surface topography was visualized and quantified on corrugated cardboard surfaces. Biofilm growth was measured using q-PCR targeting the gene encoding 16s rRNA. Additionally, architectural structure of the biofilm was observed using SEM. The uniform integration of the thiazolidinedione derivative TZD-6 was confirmed, and it was determined via q-PCR to reduce biofilm growth by ~80% on tested surfaces. A novel and effective method for reducing microbial load and preventing contamination on food packaging is thereby proposed.

Mitigation of Biofilm Formation on Corrugated Cardboard Fresh Produce Packaging Surfaces Using a Novel Thiazolidinedione Derivative Integrated in Acrylic Emulsion Polymers.

Science.gov (United States)

Brandwein, Michael; Al-Quntar, Abed; Goldberg, Hila; Mosheyev, Gregory; Goffer, Moshe; Marin-Iniesta, Fulgencio; López-Gómez, Antonio; Steinberg, Doron

2016-01-01

Various surfaces associated with the storage and packing of food are known to harbor distinct bacterial pathogens. Conspicuously absent among the plethora of studies implicating food packaging materials and machinery is the study of corrugated cardboard packaging, the worldwide medium for transporting fresh produce. In this study, we observed the microbial communities of three different store-bought fruits and vegetables, along with their analog cardboard packaging using high throughput sequencing technology. We further developed an anti-biofilm polymer meant to coat corrugated cardboard surfaces and mediate bacterial biofilm growth on said surfaces. Integration of a novel thiazolidinedione derivative into the acrylic emulsion polymers was assessed using Energy Dispersive X-ray Spectrometry (EDS) analysis and surface topography was visualized and quantified on corrugated cardboard surfaces. Biofilm growth was measured using q-PCR targeting the gene encoding 16s rRNA. Additionally, architectural structure of the biofilm was observed using SEM. The uniform integration of the thiazolidinedione derivative TZD-6 was confirmed, and it was determined via q-PCR to reduce biofilm growth by ~80% on tested surfaces. A novel and effective method for reducing microbial load and preventing contamination on food packaging is thereby proposed.

Automated packaging platform for low-cost high-performance optical components manufacturing

Science.gov (United States)

Ku, Robert T.

2004-05-01

Delivering high performance integrated optical components at low cost is critical to the continuing recovery and growth of the optical communications industry. In today's market, network equipment vendors need to provide their customers with new solutions that reduce operating expenses and enable new revenue generating IP services. They must depend on the availability of highly integrated optical modules exhibiting high performance, small package size, low power consumption, and most importantly, low cost. The cost of typical optical system hardware is dominated by linecards that are in turn cost-dominated by transmitters and receivers or transceivers and transponders. Cost effective packaging of optical components in these small size modules is becoming the biggest challenge to be addressed. For many traditional component suppliers in our industry, the combination of small size, high performance, and low cost appears to be in conflict and not feasible with conventional product design concepts and labor intensive manual assembly and test. With the advent of photonic integration, there are a variety of materials, optics, substrates, active/passive devices, and mechanical/RF piece parts to manage in manufacturing to achieve high performance at low cost. The use of automation has been demonstrated to surpass manual operation in cost (even with very low labor cost) as well as product uniformity and quality. In this paper, we will discuss the value of using an automated packaging platform.for the assembly and test of high performance active components, such as 2.5Gb/s and 10 Gb/s sources and receivers. Low cost, high performance manufacturing can best be achieved by leveraging a flexible packaging platform to address a multitude of laser and detector devices, integration of electronics and handle various package bodies and fiber configurations. This paper describes the operation and results of working robotic assemblers in the manufacture of a Laser Optical Subassembly

77 FR 33486 - Certain Integrated Circuit Packages Provided With Multiple Heat-Conducting Paths and Products...

Science.gov (United States)

2012-06-06

...Notice is hereby given that the U.S. International Trade Commission has received a complaint entitled Certain Integrated Circuit Packages Provided With Multiple Heat-Conducting Paths and Products Containing Same, DN 2899; the Commission is soliciting comments on any public interest issues raised by the complaint or complainant's filing under section 210.8(b) of the Commission's Rules of Practice and Procedure (19 CFR 210.8(b)).

Advanced organics for electronic substrates and packages

CERN Document Server

Fletcher, Andrew E

1992-01-01

Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet pre

STRUCTURAL CALCULATIONS FOR THE LIFTING IN VERTICAL ORIENTATION OF 5-DHLW/DOE SNF SINGLE CRM WASTE PACKAGES

International Nuclear Information System (INIS)

S. Mastilovic

1999-01-01

The purpose of this activity is to determine the structural response of the extension of outer shell (which is referred to as skirt throughout this document) designs of both long and short design concepts of 5-Defense High-Level Waste (DHLW) Department of Energy (DOE) spent nuclear fuel (SNF) single corrosion resistant material (CRM) waste packages (WP), subjected to a gravitational load in the course of lifting in vertical orientation. The scope of this document is limited to reporting the calculation results in terms of stress intensity magnitudes. This activity is associated with the WP design; calculations are performed by the Waste Package Design group. AP-3.124, Revision 0, ICN 0, Calculations, is used to perform the calculation and develop the document

Certification of packagings: compliance with DOT specification 7A packaging requirements

International Nuclear Information System (INIS)

Edling, D.A.

1976-01-01

A study was conducted to determine which of the packagings currently listed in CFR 49 Section 173.395 a.1-5, meet the Specification 7A requirements (CFR 49 Section 173.350). According to DOT HM-111 the present listing of various authorized DOT specifications in Section 173.394 and Section 173.395 (Type A containers) of ICC Tariff No. 27 would be deleted with complete reliance being placed on the use of DOT 7A, Type A general packaging specification. Each user of a Specification 7A package would be required to document and maintain on file for one year a written record of his determination of compliance with the DOT Specification 7A performance requirements. All the specification packagings listed in CFR 49 Section 173.395a.1-5 were tested and shown to meet the Specification 7A criteria; however, in many cases qualifications were placed on their use. Forty-nine specification packagings were tested and shown to meet the DOT Specification 7A performance requirements and since there were several styles of some specific packagings, this amounts to greater than 80 packagings. The extensive testing generally indicated a high degree of containment integrity in the packagings tested and the documentation discussed is a valuable tool for shippers of Type A quantities of radioactive materials

Structural Evaluation on HIC Transport Packaging under Accident Conditions

International Nuclear Information System (INIS)

Chung, Sung Hwan; Kim, Duck Hoi; Jung, Jin Se; Yang, Ke Hyung; Lee, Heung Young

2005-01-01

HIC transport packaging to transport a high integrity container(HIC) containing dry spent resin generated from nuclear power plants is to comply with the regulatory requirements of Korea and IAEA for Type B packaging due to the high radioactivity of the content, and to maintain the structural integrity under normal and accident conditions. It must withstand 9 m free drop impact onto an unyielding surface and 1 m drop impact onto a mild steel bar in a position causing maximum damage. For the conceptual design of a cylindrical HIC transport package, three dimensional dynamic structural analysis to ensure that the integrity of the package is maintained under all credible loads for 9 m free drop and 1 m puncture conditions were carried out using ABAQUS code.

Sensory impacts of food-packaging interactions.

Science.gov (United States)

Duncan, Susan E; Webster, Janet B

2009-01-01

Sensory changes in food products result from intentional or unintentional interactions with packaging materials and from failure of materials to protect product integrity or quality. Resolving sensory issues related to plastic food packaging involves knowledge provided by sensory scientists, materials scientists, packaging manufacturers, food processors, and consumers. Effective communication among scientists and engineers from different disciplines and industries can help scientists understand package-product interactions. Very limited published literature describes sensory perceptions associated with food-package interactions. This article discusses sensory impacts, with emphasis on oxidation reactions, associated with the interaction of food and materials, including taints, scalping, changes in food quality as a function of packaging, and examples of material innovations for smart packaging that can improve sensory quality of foods and beverages. Sensory evaluation is an important tool for improved package selection and development of new materials.

Safety Analysis Report for the KRI-ALM Transport Package

Energy Technology Data Exchange (ETDEWEB)

Bang, K. S.; Lee, J. C.; Kim, D. H.; Park, H. Y.; Kim, J. B.; Kim, H. J.; Seo, K. S

2005-11-15

Safety evaluation for the KRI-ALM transport package to transport safely I-123, which is produced at Cyclotron in KIRAMS, was carried out. In the safety analyses results for the KRI-ALM transport package, all the maximum stresses as well as the maximum temperature of the surface are lower than their allowable limits. The safety tests were performed by using the test model of the KRI-ALM transport package. Leak Test was performed after drop test, the measured leakage rate was lower than allowable leakage rate. It is revealed that the containment integrity of the KRI-ALM transport package is maintained. Therefore, it shows that the integrity of the KRI-ALM transport package is well maintained.

Advanced flip chip packaging

CERN Document Server

Lai, Yi-Shao; Wong, CP

2013-01-01

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

The development of a digital signal processing and plotting package to support testing of hazardous and radioactive material packages

International Nuclear Information System (INIS)

Ludwigsen, J.S.; Uncapher, W.L.; Arviso, M.; Lattier, C.N.; Hankinson, M.; Cannone, D.J.

1995-01-01

Federal regulations allow package designers to use analysis, testing, or a combination of analysis and testing to support certification of packages used to transport hazardous or radioactive materials. In recent years, many certified packages were subjected to a combination of analysis and testing. A major part of evaluating structural or thermal package response is the collection, reduction and presentation of instrumentation measurement data. Sandia National Laboratories, under the sponsorship of the US Department of Energy, has developed a comprehensive analysis and plotting package (known as KAPP) that performs digital signal processing of both transient structural and thermal data integrated with a comprehensive plotting package designed to support radioactive material package testing

Hazardous Material Packaging and Transportation

Energy Technology Data Exchange (ETDEWEB)

Hypes, Philip A. [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

2016-02-04

This is a student training course. Some course objectives are to: recognize and use standard international and US customary units to describe activities and exposure rates associated with radioactive material; determine whether a quantity of a single radionuclide meets the definition of a class 7 (radioactive) material; determine, for a given single radionuclide, the shipping quantity activity limits per 49 Code of Federal Regulations (CFR) 173.435; determine the appropriate radioactive material hazard class proper shipping name for a given material; determine when a single radionuclide meets the DOT definition of a hazardous substance; determine the appropriate packaging required for a given radioactive material; identify the markings to be placed on a package of radioactive material; determine the label(s) to apply to a given radioactive material package; identify the entry requirements for radioactive material labels; determine the proper placement for radioactive material label(s); identify the shipping paper entry requirements for radioactive material; select the appropriate placards for a given radioactive material shipment or vehicle load; and identify allowable transport limits and unacceptable transport conditions for radioactive material.

Coupling structure in LED System-in-Package design: a physical responses-based critical parameter sheet like approach

NARCIS (Netherlands)

Borst, E.C.M. de; Gielen, A.W.J.; Etman, L.F.P.

2012-01-01

This paper introduces an approach to study the coupling structure between the design parameters and design objectives of a LED system-in-package (SiP) design concept [1]. The LED SiP is an integrated device that combines the LED chip with driver chips and potential other components in a single

Real-time sensing and discrimination of single chemicals using the channel of phi29 DNA packaging nanomotor.

Science.gov (United States)

Haque, Farzin; Lunn, Jennifer; Fang, Huaming; Smithrud, David; Guo, Peixuan

2012-04-24

A highly sensitive and reliable method to sense and identify a single chemical at extremely low concentrations and high contamination is important for environmental surveillance, homeland security, athlete drug monitoring, toxin/drug screening, and earlier disease diagnosis. This article reports a method for precise detection of single chemicals. The hub of the bacteriophage phi29 DNA packaging motor is a connector consisting of 12 protein subunits encircled into a 3.6 nm channel as a path for dsDNA to enter during packaging and to exit during infection. The connector has previously been inserted into a lipid bilayer to serve as a membrane-embedded channel. Herein we report the modification of the phi29 channel to develop a class of sensors to detect single chemicals. The lysine-234 of each protein subunit was mutated to cysteine, generating 12-SH ring lining the channel wall. Chemicals passing through this robust channel and interactions with the SH group generated extremely reliable, precise, and sensitive current signatures as revealed by single channel conductance assays. Ethane (57 Da), thymine (167 Da), and benzene (105 Da) with reactive thioester moieties were clearly discriminated upon interaction with the available set of cysteine residues. The covalent attachment of each analyte induced discrete stepwise blockage in current signature with a corresponding decrease in conductance due to the physical blocking of the channel. Transient binding of the chemicals also produced characteristic fingerprints that were deduced from the unique blockage amplitude and pattern of the signals. This study shows that the phi29 connector can be used to sense chemicals with reactive thioesters or maleimide using single channel conduction assays based on their distinct fingerprints. The results demonstrated that this channel system could be further developed into very sensitive sensing devices.

RH Packaging Operations Manual

International Nuclear Information System (INIS)

Washington TRU Solutions LLC

2003-01-01

This procedure provides operating instructions for the RH-TRU 72-B Road Cask, Waste Shipping Package. In this document, ''Packaging'' refers to the assembly of components necessary to ensure compliance with the packaging requirements (not loaded with a payload). ''Package'' refers to a Type B packaging that, with its radioactive contents, is designed to retain the integrity of its containment and shielding when subject to the normal conditions of transport and hypothetical accident test conditions set forth in 10 CFR Part 71. Loading of the RH 72-B cask can be done two ways, on the RH cask trailer in the vertical position or by removing the cask from the trailer and loading it in a facility designed for remote-handling (RH). Before loading the 72-B cask, loading procedures and changes to the loading procedures for the 72-B cask must be sent to CBFO at sitedocuments at wipp.ws for approval

Safety Analysis Report for the KRI-ASM Transport Package

Energy Technology Data Exchange (ETDEWEB)

Bang, K. S.; Lee, J. C.; Kim, D. H.; Park, H. Y.; Kim, J. B.; Kim, H. J.; Seo, K. S

2005-11-15

Safety evaluation for the KRI-ASM transport package to transport safely I-131, which is produced at HANARO research reactor in KAERI, was carried out. In the safety analyses results for the KRI-ASM transport package, all the maximum stresses as well as the maximum temperature of the surface are lower than their allowable limits. The safety tests were performed by using the test model of the KRI-ASM transport package. Leak Test was performed after drop test and penetration test, the measured leakage rate was lower than allowable leakage rate. It is revealed that the containment integrity of the KRI-ASM transport package is maintained. Therefore, it shows that the integrity of the KRI-ASM transport package is well maintained.

Hybrid Wafer-Level Packaging for RF-MEMS and Optoelectronic Applications

NARCIS (Netherlands)

Tian, J.

2013-01-01

The current trend in electronic packaging research is to integrate more functions into one package, reduce electrical path parasitic, and increase the heat conduction in order to make the final packaged system smaller, more reliable, more functional and more complete, while keeping the packaging

Materials for advanced packaging

CERN Document Server

Wong, CP

2017-01-01

This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including: Lead-free solders Flip chip underfills Epoxy molding compounds Conductive adhesives Die attach adhesives/films Thermal interface materials (TIMS) Materials for fabricating embedded passives including capacitors, inductors, and resistors Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS) Contributors also review new and emerging technologies such as Light ...

Dynamic modelling and PID loop control of an oil-injected screw compressor package

Science.gov (United States)

Poli, G. W.; Milligan, W. J.; McKenna, P.

2017-08-01

A significant amount of time is spent tuning the PID (Proportional, Integral and Derivative) control loops of a screw compressor package due to the unique characteristics of the system. Common mistakes incurred during the tuning of a PID control loop include improper PID algorithm selection and unsuitable tuning parameters of the system resulting in erratic and inefficient operation. This paper details the design and development of software that aims to dynamically model the operation of a single stage oil injected screw compressor package deployed in upstream oil and gas applications. The developed software will be used to assess and accurately tune PID control loops present on the screw compressor package employed in controlling the oil pressures, temperatures and gas pressures, in a bid to improve control of the operation of the screw compressor package. Other applications of the modelling software will include its use as an evaluation tool that can estimate compressor package performance during start up, shutdown and emergency shutdown processes. The paper first details the study into the fundamental operational characteristics of each of the components present on the API 619 screw compressor package and then discusses the creation of a dynamic screw compressor model within the MATLAB/Simulink software suite. The paper concludes by verifying and assessing the accuracy of the created compressor model using data collected from physical screw compressor packages.

GDCRNATools: an R/Bioconductor package for integrative analysis of lncRNA, miRNA, and mRNA data in GDC.

Science.gov (United States)

Li, Ruidong; Qu, Han; Wang, Shibo; Wei, Julong; Zhang, Le; Ma, Renyuan; Lu, Jianming; Zhu, Jianguo; Zhong, Wei-De; Jia, Zhenyu

2018-03-02

The large-scale multidimensional omics data in the Genomic Data Commons (GDC) provides opportunities to investigate the crosstalk among different RNA species and their regulatory mechanisms in cancers. Easy-to-use bioinformatics pipelines are needed to facilitate such studies. We have developed a user-friendly R/Bioconductor package, named GDCRNATools, for downloading, organizing, and analyzing RNA data in GDC with an emphasis on deciphering the lncRNA-mRNA related competing endogenous RNAs (ceRNAs) regulatory network in cancers. Many widely used bioinformatics tools and databases are utilized in our package. Users can easily pack preferred downstream analysis pipelines or integrate their own pipelines into the workflow. Interactive shiny web apps built in GDCRNATools greatly improve visualization of results from the analysis. GDCRNATools is an R/Bioconductor package that is freely available at Bioconductor (http://bioconductor.org/packages/devel/bioc/html/GDCRNATools.html). Detailed instructions, manual and example code are also available in Github (https://github.com/Jialab-UCR/GDCRNATools). arthur.jia@ucr.edu or zhongwd2009@live.cn or doctorzhujianguo@163.com.

Analytical Design Package (ADP2): A computer aided engineering tool for aircraft transparency design

Science.gov (United States)

Wuerer, J. E.; Gran, M.; Held, T. W.

1994-01-01

The Analytical Design Package (ADP2) is being developed as a part of the Air Force Frameless Transparency Program (FTP). ADP2 is an integrated design tool consisting of existing analysis codes and Computer Aided Engineering (CAE) software. The objective of the ADP2 is to develop and confirm an integrated design methodology for frameless transparencies, related aircraft interfaces, and their corresponding tooling. The application of this methodology will generate high confidence for achieving a qualified part prior to mold fabrication. ADP2 is a customized integration of analysis codes, CAE software, and material databases. The primary CAE integration tool for the ADP2 is P3/PATRAN, a commercial-off-the-shelf (COTS) software tool. The open architecture of P3/PATRAN allows customized installations with different applications modules for specific site requirements. Integration of material databases allows the engineer to select a material, and those material properties are automatically called into the relevant analysis code. The ADP2 materials database will be composed of four independent schemas: CAE Design, Processing, Testing, and Logistics Support. The design of ADP2 places major emphasis on the seamless integration of CAE and analysis modules with a single intuitive graphical interface. This tool is being designed to serve and be used by an entire project team, i.e., analysts, designers, materials experts, and managers. The final version of the software will be delivered to the Air Force in Jan. 1994. The Analytical Design Package (ADP2) will then be ready for transfer to industry. The package will be capable of a wide range of design and manufacturing applications.

Packaging and transport of radioisotopes

International Nuclear Information System (INIS)

Taylor, C.B.G.

1976-01-01

The importance of radioisotope traffic is emphasized. More than a million packages are being transported each year, mostly for medical uses. The involvement of public transport services and the incidental dose to the public (which is very small) are appreciably greater than for movements connected with the nuclear fuel cycle. Modern isotope packages are described, and an outline given of the problems of a large radioisotope manufacturer who has to package many different types of product. Difficulties caused by recent uncoordinated restrictions on the use of passenger aircraft are mentioned. Some specific problems relating to radioisotope packaging are discussed. These include the crush resistance of Type A packages, the closure of steel drums, the design of secure closures for large containers, the Type A packaging of liquids, leak tightness criteria of Type B packages, and the use of 'unit load' overpacks to consign a group of individually approved packages together as a single shipment. Reference is made to recent studies of the impact of radioisotope shipments on the environment. Cost/benefit analysis is important in this field - an important public debate is only just beginning. (author)

Development of integrated radioactive waste packaging and conditioning solutions in the UK

Energy Technology Data Exchange (ETDEWEB)

Sibley, Peter; Butter, Kevin; Zimmerman, Ian [EnergySolutions EU Ltd., Swindon, Wiltshire (United Kingdom); Viermann, Joerg [GNS Gesellschaft fur Nuklear-Service mbH, Essen (Germany); Messer, Matthias [GNS Gesellschaft fur Nuklear-Service mbH, Bristol (United Kingdom)

2013-07-01

In order to offer a more cost effective, safer and efficient Intermediate Level Waste (ILW) management service, EnergySolutions EU Ltd. and Gesellschaft fur Nuklear-Service mbH (GNS) have been engaged in the development of integrated radioactive waste retrieval, packaging and conditioning solutions in the UK. Recognising the challenges surrounding regulatory endorsement and on-site implementation in particular, this has resulted in an alternative approach to meeting customer, safety regulator and disposability requirements. By working closely with waste producers and the organisation(s) responsible for endorsing radioactive waste management operations in the UK, our proposed solutions are now being implemented. By combining GNS' off-the-shelf, proven Ductile Cast Iron Containers (DCICs) and water removal technologies, with EnergySolutions EU Ltd.'s experience and expertise in waste retrieval, safety case development and disposability submissions, a fully integrated service offering has been developed. This has involved significant effort to overcome technical challenges such as onsite equipment deployment, active commissioning, conditioning success criteria and disposability acceptance. Our experience in developing such integrated solutions has highlighted the importance of working in collaboration with all parties to achieve a successful and viable outcome. Ultimately, the goal is to ensure reliable, safe and effective delivery of waste management solutions. (authors)

Smart packaging systems for food applications: a review.

Science.gov (United States)

Biji, K B; Ravishankar, C N; Mohan, C O; Srinivasa Gopal, T K

2015-10-01

Changes in consumer preference for safe food have led to innovations in packaging technologies. This article reviews about different smart packaging systems and their applications in food packaging, packaging research with latest innovations. Active and intelligent packing are such packaging technologies which offer to deliver safer and quality products. Active packaging refers to the incorporation of additives into the package with the aim of maintaining or extending the product quality and shelf life. The intelligent systems are those that monitor the condition of packaged food to give information regarding the quality of the packaged food during transportation and storage. These technologies are designed to the increasing demand for safer foods with better shelf life. The market for active and intelligent packaging systems is expected to have a promising future by their integration into packaging materials or systems.

Integrated performance assessment model for waste package behavior and radionuclide release

International Nuclear Information System (INIS)

Kossik, R.; Miller, I.; Cunnane, M.

1992-01-01

Golder Associates Inc. (GAI) has developed a probabilistic total system performance assessment and strategy evaluation model (RIP) which can be applied in an iterative manner to evaluate repository site suitability and guide site characterization. This paper describes one component of the RIP software, the waste package behavior and radionuclide release model. The waste package component model considers waste package failure by various modes, matrix alteration/dissolution, and radionuclide mass transfer. Model parameters can be described as functions of local environmental conditions. The waste package component model is coupled to component models for far-field radionuclide transport and disruptive events. The model has recently been applied to the proposed repository at Yucca Mountain

A MODFLOW Infiltration Device Package for Simulating Storm Water Infiltration.

Science.gov (United States)

Jeppesen, Jan; Christensen, Steen

2015-01-01

This article describes a MODFLOW Infiltration Device (INFD) Package that can simulate infiltration devices and their two-way interaction with groundwater. The INFD Package relies on a water balance including inflow of storm water, leakage-like seepage through the device faces, overflow, and change in storage. The water balance for the device can be simulated in multiple INFD time steps within a single MODFLOW time step, and infiltration from the device can be routed through the unsaturated zone to the groundwater table. A benchmark test shows that the INFD Package's analytical solution for stage computes exact results for transient behavior. To achieve similar accuracy by the numerical solution of the MODFLOW Surface-Water Routing (SWR1) Process requires many small time steps. Furthermore, the INFD Package includes an improved representation of flow through the INFD sides that results in lower infiltration rates than simulated by SWR1. The INFD Package is also demonstrated in a transient simulation of a hypothetical catchment where two devices interact differently with groundwater. This simulation demonstrates that device and groundwater interaction depends on the thickness of the unsaturated zone because a shallow groundwater table (a likely result from storm water infiltration itself) may occupy retention volume, whereas a thick unsaturated zone may cause a phase shift and a change of amplitude in groundwater table response to a change of infiltration. We thus find that the INFD Package accommodates the simulation of infiltration devices and groundwater in an integrated manner on small as well as large spatial and temporal scales. © 2014, National Ground Water Association.

General technique for the integration of MIC/MMIC'S with waveguides

Science.gov (United States)

Geller, Bernard D. (Inventor); Zaghloul, Amir I. (Inventor)

1987-01-01

A technique for packaging and integrating of a microwave integrated circuit (MIC) or monolithic microwave integrated circuit (MMIC) with a waveguide uses a printed conductive circuit pattern on a dielectric substrate to transform impedance and mode of propagation between the MIC/MMIC and the waveguide. The virtually coplanar circuit pattern lies on an equipotential surface within the waveguide and therefore makes possible single or dual polarized mode structures.

Antimicrobial packaging with natural compunds - a review

Directory of Open Access Journals (Sweden)

Renata Dobrucka

2016-12-01

Full Text Available Background:  Packaging problems are an integral part of logistics and the implementation of packaging significantly affects the effectiveness of logistics processes, as a factor which increases the safety and the quality of products being transported. Active packaging is an area of technology needed to meet the requirements of the contemporary consumer. Active packaging creates additional opportunities in systems for packing goods, as well as offering a solution in which the packaging, the product and surroundings interact. Furthermore, active packaging allows packaging to interact with food and the environment and play a dynamic role in food preservation. The main role of antimicrobial packaging is to inhibit the growth of microorganisms that reduce the quality of the packaged product. Methods: The application of natural antimicrobial agents appears to be safe for food products. Also, these compounds have potential applications as a natural preservative in the food packaging industry. This study presents some antibacterial agents, namely chitosan, nisin and pectins. Results and conclusion: Natural substances used in active packaging can eliminate the danger of chemical substances migrating to food.

The UK core performance code package

International Nuclear Information System (INIS)

Hutt, P.K.; Gaines, N.; McEllin, M.; White, R.J.; Halsall, M.J.

1991-01-01

Over the last few years work has been co-ordinated by Nuclear Electric, originally part of the Central Electricity Generating Board, with contributions from the United Kingdom Atomic Energy Authority and British Nuclear Fuels Limited, to produce a generic, easy-to-use and integrated package of core performance codes able to perform a comprehensive range of calculations for fuel cycle design, safety analysis and on-line operational support for Light Water Reactor and Advanced Gas Cooled Reactor plant. The package consists of modern rationalized generic codes for lattice physics (WIMS), whole reactor calculations (PANTHER), thermal hydraulics (VIPRE) and fuel performance (ENIGMA). These codes, written in FORTRAN77, are highly portable and new developments have followed modern quality assurance standards. These codes can all be run ''stand-alone'' but they are also being integrated within a new UNIX-based interactive system called the Reactor Physics Workbench (RPW). The RPW provides an interactive user interface and a sophisticated data management system. It offers quality assurance features to the user and has facilities for defining complex calculational sequences. The Paper reviews the current capabilities of these components, their integration within the package and outlines future developments underway. Finally, the Paper describes the development of an on-line version of this package which is now being commissioned on UK AGR stations. (author)

Alternate Materials In Design Of Radioactive Material Packages

International Nuclear Information System (INIS)

Blanton, P.; Eberl, K.

2010-01-01

This paper presents a summary of design and testing of material and composites for use in radioactive material packages. These materials provide thermal protection and provide structural integrity and energy absorption to the package during normal and hypothetical accident condition events as required by Title 10 Part 71 of the Code of Federal Regulations. Testing of packages comprising these materials is summarized.

Spent fuel packaging and its safety analysis

International Nuclear Information System (INIS)

Takada, Kimitaka; Nakaoki, Kozo; Tamamura, Tadao; Matsuda, Fumio; Fukudome, Kazuyuki

1983-01-01

An all stainless steel B(U) type packaging is proposed to transport spent fuels discharged from research reactors and other radioactive materials. The package is used dry and provided with surface fins to absorb drop shock and to dissipate decay heat. Safety was analyzed for structural, thermal, containment shielding and criticality factors, and the integrity of the package was confirmed with the MARC-CDC, TRUMP, ORIGEN, QAD, ANISN, and KENO computer codes. (author)

EVALUATION OF FOUR INTEGRATED PEST MANAGEMENT PACKAGES FOR CONTROLLING MAIN PESTS OF COTTON IN RAINFED FIELDS

OpenAIRE

Nurindah Nurindah; Dwi Adi Sunarto

2014-01-01

Cotton production nationally is low due to various constraints, including pests. Two main pests commonly found in cotton plantation in rain fed fields are cotton leafhopper (Amrasca biguttula) and cotton bollworm (Helicoverpa armigera). The study aimed to evaluate four packages of integrated pest management (IPM) techniques to control cotton leafhopper and cotton bollworm in rain fed fields. The experiment was conducted in farmers’ fields at Asembagus, East Java, between January and July 2012...

Fabrication and characterization of a metal-packaged regenerated fiber Bragg grating strain sensor for structural integrity monitoring of high-temperature components

International Nuclear Information System (INIS)

Tu, Yun; Tu, Shan-Tung

2014-01-01

Assessment of the structural integrity of components operating at high temperatures requires the development of novel sensors to measure strain. A metal-packaged regenerated fiber Bragg grating (RFBG) sensor is developed for measurement of strain using titanium–silver magnetron sputtering and nickel electroplating. The strain response of the sensor mounted onto a flat tensile specimen by spot welding is evaluated by uniaxial tensile tests at constant temperatures ranging from room temperature to 400 °C. Similar tests are performed on a bare RFBG sensor for comparison. The metal-packaged RFBG strain sensor exhibits higher strain sensitivity than that of the bare RFBG sensor, as well as good linearity, stability and repeatability of strain measurements. A three-dimensional finite element model of the sensor is established to predict the strain sensitivity based on the sensing principle of the fiber Bragg grating. Comparisons of the experimental results with the numerical predictions for the strain sensitivity show a satisfactory agreement. These results demonstrate that the metal-packaged RFBG strain sensors can be successfully fabricated by combining magnetron sputtering with electroplating, and provide great promise for structural integrity monitoring of high-temperature components. (paper)

The Ettention software package

International Nuclear Information System (INIS)

Dahmen, Tim; Marsalek, Lukas; Marniok, Nico; Turoňová, Beata; Bogachev, Sviatoslav; Trampert, Patrick; Nickels, Stefan; Slusallek, Philipp

2016-01-01

We present a novel software package for the problem “reconstruction from projections” in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. - Highlights: • Novel software package for “reconstruction from projections” in electron microscopy. • Support for high-resolution reconstructions on iterative reconstruction algorithms. • Support for CPU, GPU and Xeon Phi. • Integration in the IMOD software. • Platform for algorithm researchers: object oriented, modular design.

The Ettention software package

Energy Technology Data Exchange (ETDEWEB)

Dahmen, Tim, E-mail: Tim.Dahmen@dfki.de [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Saarland University, 66123 Saarbrücken (Germany); Marsalek, Lukas [Eyen SE, Na Nivách 1043/16, 141 00 Praha 4 (Czech Republic); Saarland University, 66123 Saarbrücken (Germany); Marniok, Nico [Saarland University, 66123 Saarbrücken (Germany); Turoňová, Beata [Saarland University, 66123 Saarbrücken (Germany); IMPRS-CS, Max-Planck Institute for Informatics, Campus E 1.4, 66123 Saarbrücken (Germany); Bogachev, Sviatoslav [Saarland University, 66123 Saarbrücken (Germany); Trampert, Patrick; Nickels, Stefan [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Slusallek, Philipp [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Saarland University, 66123 Saarbrücken (Germany)

2016-02-15

We present a novel software package for the problem “reconstruction from projections” in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. - Highlights: • Novel software package for “reconstruction from projections” in electron microscopy. • Support for high-resolution reconstructions on iterative reconstruction algorithms. • Support for CPU, GPU and Xeon Phi. • Integration in the IMOD software. • Platform for algorithm researchers: object oriented, modular design.

Biocidal packaging for pharmaceuticals, foods, and other perishables.

Science.gov (United States)

Larson, Alyssa M; Klibanov, Alexander M

2013-01-01

Many consumer goods must be protected from bacterial and fungal colonization to ensure their integrity and safety. By making these items' packaging biocidal, the interior environment can be preserved from microbial spoilage without altering the products themselves. Herein we briefly review this concept, referred to as active packaging, and discuss existing methods for constructing active packaging systems. They are based on either packaging materials that release biocides or those that are themselves intrinsically biocidal (or biostatic), with numerous variations within each category.

Packaging of silicon sensors for microfluidic bio-analytical applications

International Nuclear Information System (INIS)

Wimberger-Friedl, Reinhold; Prins, Menno; Megens, Mischa; Dittmer, Wendy; Witz, Christiane de; Nellissen, Ton; Weekamp, Wim; Delft, Jan van; Ansems, Will; Iersel, Ben van

2009-01-01

A new industrial concept is presented for packaging biosensor chips in disposable microfluidic cartridges to enable medical diagnostic applications. The inorganic electronic substrates, such as silicon or glass, are integrated in a polymer package which provides the electrical and fluidic interconnections to the world and provides mechanical strength and protection for out-of-lab use. The demonstrated prototype consists of a molded interconnection device (MID), a silicon-based giant magneto-resistive (GMR) biosensor chip, a flex and a polymer fluidic part with integrated tubing. The various processes are compatible with mass manufacturing and run at a high yield. The devices show a reliable electrical interconnection between the sensor chip and readout electronics during extended wet operation. Sandwich immunoassays were carried out in the cartridges with surface functionalized sensor chips. Biological response curves were determined for different concentrations of parathyroid hormone (PTH) on the packaged biosensor, which demonstrates the functionality and biocompatibility of the devices. The new packaging concept provides a platform for easy further integration of electrical and fluidic functions, as for instance required for integrated molecular diagnostic devices in cost-effective mass manufacturing

Room-temperature-deposited dielectrics and superconductors for integrated photonics.

Science.gov (United States)

Shainline, Jeffrey M; Buckley, Sonia M; Nader, Nima; Gentry, Cale M; Cossel, Kevin C; Cleary, Justin W; Popović, Miloš; Newbury, Nathan R; Nam, Sae Woo; Mirin, Richard P

2017-05-01

We present an approach to fabrication and packaging of integrated photonic devices that utilizes waveguide and detector layers deposited at near-ambient temperature. All lithography is performed with a 365 nm i-line stepper, facilitating low cost and high scalability. We have shown low-loss SiN waveguides, high-Q ring resonators, critically coupled ring resonators, 50/50 beam splitters, Mach-Zehnder interferometers (MZIs) and a process-agnostic fiber packaging scheme. We have further explored the utility of this process for applications in nonlinear optics and quantum photonics. We demonstrate spectral tailoring and octave-spanning supercontinuum generation as well as the integration of superconducting nanowire single photon detectors with MZIs and channel-dropping filters. The packaging approach is suitable for operation up to 160 °C as well as below 1 K. The process is well suited for augmentation of existing foundry capabilities or as a stand-alone process.

Integrating Medical Supply as Part of the Army's Single Integrated Materiel Manager Concept--Why or why Not?

National Research Council Canada - National Science Library

Baxter, Shelia

1998-01-01

.... To achieve the goal of seamless logistics integration capabilities, one concept is to establish a Single Integrated Materiel Manager for the Army which envisions integrating all such functions...

The 1 000-year prediction. A state-of-the-art review on the research activity for the structural integrity of geological disposal packages of high-level nuclear waste

International Nuclear Information System (INIS)

Akashi, Masatsune

1996-01-01

The geological disposal package for high-level nuclear waste to be buried deep underground must be assured of structural integrity for ultra-long services of 1 000 years or even longer. The greatest and essentially the sole adversary to those packages in such a service is corrosion by ground water. Therefore, quantitative assessment of the corrosion form, the corrosion rate, and the corrosion lifetime is indispensable. This paper reviews the research activities to clarify what has been known, and discusses the future items to be studied. The largest detriment to the integrity of the package is not the uniform corrosion but the localized corrosion. The critical potential concept can quantify the safety usage domain for the material concerned. (author)

GMATA: An Integrated Software Package for Genome-Scale SSR Mining, Marker Development and Viewing.

Science.gov (United States)

Wang, Xuewen; Wang, Le

2016-01-01

Simple sequence repeats (SSRs), also referred to as microsatellites, are highly variable tandem DNAs that are widely used as genetic markers. The increasing availability of whole-genome and transcript sequences provides information resources for SSR marker development. However, efficient software is required to efficiently identify and display SSR information along with other gene features at a genome scale. We developed novel software package Genome-wide Microsatellite Analyzing Tool Package (GMATA) integrating SSR mining, statistical analysis and plotting, marker design, polymorphism screening and marker transferability, and enabled simultaneously display SSR markers with other genome features. GMATA applies novel strategies for SSR analysis and primer design in large genomes, which allows GMATA to perform faster calculation and provides more accurate results than existing tools. Our package is also capable of processing DNA sequences of any size on a standard computer. GMATA is user friendly, only requires mouse clicks or types inputs on the command line, and is executable in multiple computing platforms. We demonstrated the application of GMATA in plants genomes and reveal a novel distribution pattern of SSRs in 15 grass genomes. The most abundant motifs are dimer GA/TC, the A/T monomer and the GCG/CGC trimer, rather than the rich G/C content in DNA sequence. We also revealed that SSR count is a linear to the chromosome length in fully assembled grass genomes. GMATA represents a powerful application tool that facilitates genomic sequence analyses. GAMTA is freely available at http://sourceforge.net/projects/gmata/?source=navbar.

Feynman integrals and difference equations

International Nuclear Information System (INIS)

Moch, S.; Schneider, C.

2007-09-01

We report on the calculation of multi-loop Feynman integrals for single-scale problems by means of difference equations in Mellin space. The solution to these difference equations in terms of harmonic sums can be constructed algorithmically over difference fields, the so-called ΠΣ * -fields. We test the implementation of the Mathematica package Sigma on examples from recent higher order perturbative calculations in Quantum Chromodynamics. (orig.)

ggseqlogo: a versatile R package for drawing sequence logos.

Science.gov (United States)

Wagih, Omar

2017-11-15

Sequence logos have become a crucial visualization method for studying underlying sequence patterns in the genome. Despite this, there remains a scarcity of software packages that provide the versatility often required for such visualizations. ggseqlogo is an R package built on the ggplot2 package that aims to address this issue. ggseqlogo offers native illustration of publication-ready DNA, RNA and protein sequence logos in a highly customizable fashion with features including multi-logo plots, qualitative and quantitative colour schemes, annotation of logos and integration with other plots. The package is intuitive to use and seamlessly integrates into R analysis pipelines. ggseqlogo is released under the GNU licence and is freely available via CRAN-The Comprehensive R Archive Network https://cran.r-project.org/web/packages/ggseqlogo. A detailed tutorial can be found at https://omarwagih.github.io/ggseqlogo. wagih@ebi.ac.uk. © The Author 2017. Published by Oxford University Press. All rights reserved. For Permissions, please e-mail: journals.permissions@oup.com

Thermal characteristic of insulation for optimum design of RI transport package

International Nuclear Information System (INIS)

Lee, J. C.; Bang, K. S.; Seo, K. S.

2002-01-01

A package to transport the high level radioactive materials in required to withstand the hypothetical accident conditions as well as normal transport conditions according to IAEA and domestic regulations. The regulations require that the package should maintain the shielding, thermal and structural integrities to release no radioactive material. Thermal characteristics of insulations were evaluated and optimum insulation thickness was deduced for RI transport package. The package has a maximum capacity of 600 Curies for Ir-192 sealed source. The insulation thickness was decided with 10 mm of polyurethane form to maintain the thermal safety under fire accident condition. Thermal analysis was carried out for RI transport package, and it was shown that the thermal integrity of the package was maintained. The results obtained this study will be applied to a basic data for design of RI transport cask

Safety Evaluation of Radioactive Material Transport Package under Stacking Test Condition

International Nuclear Information System (INIS)

Lee, Ju Chan; Seo, Ki Seog; Yoo, Seong Yeon

2012-01-01

Radioactive waste transport package was developed to transport eight drums of low and intermediate level waste(LILW) in accordance with the IAEA and domestic related regulations. The package is classified with industrial package IP-2. IP-2 package is required to undergo a free drop test and a stacking test. After free drop and stacking tests, it should prevent the loss or dispersal of radioactive contents, and loss of shielding integrity which would result in more than 20 % increase in the radiation level at any external surface of the package. The objective of this study is to establish the safety test method and procedure for stacking test and to prove the structural integrities of the IP-2 package. Stacking test and analysis were performed with a compressive load equal to five times the weight of the package for a period of 24 hours using a full scale model. Strains and displacements were measured at the corner fitting of the package during the stacking test. The measured strains and displacements were compared with the analysis results, and there were good agreements. It is very difficult to measure the deflection at the container base, so the maximum deflection of the container base was calculated by the analysis method. The maximum displacement at the corner fitting and deflection at the container base were less than their allowable values. Dimensions of the test model, thickness of shielding material and bolt torque were measured before and after the stacking test. Throughout the stacking test, it was found that there were no loss or dispersal of radioactive contents and no loss of shielding integrity. Thus, the package was shown to comply with the requirements to maintain structural integrity under the stacking condition.

Integrated and Optimized Energy-Efficient Construction Package for a Community of Production Homes in the Mixed-Humid Climate

Energy Technology Data Exchange (ETDEWEB)

Mallay, D.; Wiehagen, J.; Del Bianco, M.

2014-10-01

Selection and integration of high performance home features are two sides of the same coin in energy efficient sustainable construction. Many advanced technologies are available for selection, but it is in the integration of these technologies into an affordable set of features that can be used on a production basis by builders, that ensures whole-house performance meets expectations. This research high performance home analyzes how a set of advanced technologies can be integrated into a durable and energy efficient house in the mixed-humid climate while remaining affordable to homeowners. The technical solutions documented in this report are the cornerstone of the builder's entire business model based on delivering high-performance homes on a production basis as a standard product offering to all price segments of the residential market. Home Innovation Research Labs partnered with production builder Nexus EnergyHomes (CZ 4). The builder plans to adopt the successful components of the energy solution package for all 55 homes in the community. The research objective was to optimize the builder's energy solution package based on energy performance and construction costs. All of the major construction features, including envelope upgrades, space conditioning system, hot water system, and solar electric system were analyzed. The information in this report can be used by builders and designers to evaluate options, and the integration of options, for increasing the efficiency of home designs in climate zone 4. The data also provide a point of reference for evaluating estimates of energy savings and costs for specific features.

Packaging of control system software

International Nuclear Information System (INIS)

Zagar, K.; Kobal, M.; Saje, N.; Zagar, A.; Sabjan, R.; Di Maio, F.; Stepanov, D.

2012-01-01

Control system software consists of several parts - the core of the control system, drivers for integration of devices, configuration for user interfaces, alarm system, etc. Once the software is developed and configured, it must be installed to computers where it runs. Usually, it is installed on an operating system whose services it needs, and also in some cases dynamically links with the libraries it provides. Operating system can be quite complex itself - for example, a typical Linux distribution consists of several thousand packages. To manage this complexity, we have decided to rely on Red Hat Package Management system (RPM) to package control system software, and also ensure it is properly installed (i.e., that dependencies are also installed, and that scripts are run after installation if any additional actions need to be performed). As dozens of RPM packages need to be prepared, we are reducing the amount of effort and improving consistency between packages through a Maven-based infrastructure that assists in packaging (e.g., automated generation of RPM SPEC files, including automated identification of dependencies). So far, we have used it to package EPICS, Control System Studio (CSS) and several device drivers. We perform extensive testing on Red Hat Enterprise Linux 5.5, but we have also verified that packaging works on CentOS and Scientific Linux. In this article, we describe in greater detail the systematic system of packaging we are using, and its particular application for the ITER CODAC Core System. (authors)

Safety analysis report: packages. DOT specification 7A - Type A container Mark 15 sludge shipping package

International Nuclear Information System (INIS)

Zeh, C.W.

1985-03-01

Sludge or filter cake containing 1.1 wt % 235 U enriched uranium from Mark 15 fabrication will be packaged in 55-gallon containers and shipped from SRP to NLO, Fernald, Ohio for recovery of product. About 7 Metric Tons (MT) of filter cake will be produced from fabricating Mark 15 slugs each reactor charge. Packaged shipments of this material, consigned as exclusive use, will be shipped to NLO in Department of Transportation (DOT) Specification 7A - Type A packages under a DOE Certificate of Compliance for Fissile Class III shipments. ''Type A packaging'' is designed to retain containment and shielding integrity under normal conditions of transport. This report documents compliance of the package design, construction methods, material and test performance with DOT Specification 7A. This DOT 7A Type A package contains a carbon steel outer container which is a 0.060-in.-thick 55-gal, galvanized drum equipped with a gasketed closure. The outer container encloses a 0.090-in.-thick, open head, polyethylene liner with lid

TopView - ATLAS top physics analysis package

CERN Document Server

Shibata, A

2007-01-01

TopView is a common analysis package which is widely used in the ATLAS top physics working group. The package is fully based on the official ATLAS software Athena and EventView and playing a central role in the collaborative analysis model. It is a functional package which accounts for a broad range issues in implementing physics analysis. As well as being a modular framework suitable as a common workplace for collaborators, TopView implements numerous analysis tools including a complete top-antitop reconstruction and single top reconstruction. The package is currently used to produce common ntuple from Monte Carlo production and future use cases are under rapid development. In this paper, the design and ideas behind TopView and the performance of the analyses implemented in the package are presented with detailed documentation of the contents and instruction for using the package.

Safety analysis report for packages: packaging of fissile and other radioactive materials. Final report

International Nuclear Information System (INIS)

Chalfant, G.G.

1984-01-01

The 9965, 9966, 9967, and 9968 packages are designed for surface shipment of fissile and other radioactive materials where a high degree of containment (either single or double) is required. Provisions are made to add shielding material to the packaging as required. The package was physically tested to demonstrate that it meets the criteria specified in USDOE Order No. 5480.1, chapter III, dated 5/1/81, which invokes Title 10, Code of Federal Regulations, Part 71 (10 CFR 71), Packing and Transportation of Radioactive Material, and Title 49, Code of Federal Regulations, Part 100-179, Transportation. By restricting the maximum normal operating pressure of the packages to less than 7 kg/cm 2 (gauge) (99 to 54 psig), the packages will comply with Type B(U) regulations of the International Atomic Energy Agency (IAEA) in its Regulations for the Safe Transport of Radioactive Materials, Safety Series No. 6, 1973 Revised Edition, and may be used for export and import shipments. These packages have been assessed for transport of up to 14.5 kilograms of uranium, excluding uranium-233, or 4.4 kilograms of plutonium metal, oxides, or scrap having a maximum radioactive decay energy of 30 watts. Specific maximum package contents are given. This quantity and the configuration of uranium or plutonium metal cannot be made critical by any combination of hydrogeneous reflection and moderation regardless of the condition of the package. For a uranium-233 shipment, a separate criticality evaluation for the specific package is required

Integrated performance assessment model for waste policy package behavior and radionuclide release

International Nuclear Information System (INIS)

Kossik, R.; Miller, I.; Cunnane, M.

1992-01-01

Golder Associates Inc. (GAI) has developed a probabilistic total system performance assessment and strategy evaluation model (RIP) which can be applied in an iterative manner to evaluate repository site suitability and guide site characterization. This paper describes one component of the RIP software, the waste package behavior and radionuclide release model. The waste package component model considers waste package failure by various modes, matrix alteration/dissolution, and radionuclide mass transfer. Model parameters can be described as functions of local environmental conditions. The waste package component model is coupled to component models for far-field radionuclide transport and disruptive events. The model has recently been applied to the proposed repository at Yucca Mountain

Diamond-based heat spreaders for power electronic packaging applications

Science.gov (United States)

Guillemet, Thomas

As any semiconductor-based devices, power electronic packages are driven by the constant increase of operating speed (higher frequency), integration level (higher power), and decrease in feature size (higher packing density). Although research and innovation efforts have kept these trends continuous for now more than fifty years, the electronic packaging technology is currently facing a challenge that must be addressed in order to move toward any further improvements in terms of performances or miniaturization: thermal management. Thermal issues in high-power packages strongly affect their reliability and lifetime and have now become one of the major limiting factors of power modules development. Thus, there is a strong need for materials that can sustain higher heat flux levels while safely integrating into the electronic package architecture. In such context, diamond is an attractive candidate because of its outstanding thermal conductivity, low thermal expansion, and high electrical resistivity. Its low heat capacity relative to metals such as aluminum or copper makes it however preferable for heat spreading applications (as a heat-spreader) rather than for dissipating the heat flux itself (as a heat sink). In this study, a dual diamond-based heat-spreading solution is proposed. Polycrystalline diamond films were grown through laser-assisted combustion synthesis on electronic substrates (in the U.S) while, in parallel, diamond-reinforced copper-matrix composite films were fabricated through tape casting and hot pressing (in France). These two types of diamond-based heat-spreading films were characterized and their microstructure and chemical composition were related to their thermal performances. Particular emphasize was put on the influence of interfaces on the thermal properties of the materials, either inside a single material (grain boundaries) or between dissimilar materials (film/substrate interface, matrix/reinforcement interface). Finally, the packaging

Anticounterfeit packaging technologies

Directory of Open Access Journals (Sweden)

Ruchir Y Shah

2010-01-01

Full Text Available Packaging is the coordinated system that encloses and protects the dosage form. Counterfeit drugs are the major cause of morbidity, mortality, and failure of public interest in the healthcare system. High price and well-known brands make the pharma market most vulnerable, which accounts for top priority cardiovascular, obesity, and antihyperlipidemic drugs and drugs like sildenafil. Packaging includes overt and covert technologies like barcodes, holograms, sealing tapes, and radio frequency identification devices to preserve the integrity of the pharmaceutical product. But till date all the available techniques are synthetic and although provide considerable protection against counterfeiting, have certain limitations which can be overcome by the application of natural approaches and utilization of the principles of nanotechnology.

The KNOO research consortium: work package 3 - an integrated approach to waste immobilisation and management - 16375

International Nuclear Information System (INIS)

Biggs, Simon; Fairweather, Michael; Young, James; Grimes, Robin W.; Milestone, Neil; Livens, Francis

2009-01-01

The Keeping the Nuclear Option Open (KNOO) research consortium is a four-year research council funded initiative addressing the challenges related to increasing the safety, reliability and sustainability of nuclear power in the UK. Through collaboration between key industrial and governmental stakeholders, and with international partners, KNOO was established to maintain and develop skills relevant to nuclear power generation. Funded by a research grant of Pounds 6.1 M from the 'Towards a Sustainable Energy Economy Programme' of the UK Research Councils, it represents the single largest university-based nuclear research programme in the UK for more than 30 years. The programme is led by Imperial College London, in collaboration with the universities of Manchester, Sheffield, Leeds, Bristol, Cardiff and the Open University. These universities are working with the UK nuclear industry, who contributed a further Pounds 0.4 M in funding. The industry/government stakeholders include AWE, British Energy, the Department for Environment, Food and Rural Affairs, the Environment Agency, the Health and Safety Executive, Doosan Babcock, the Ministry of Defence, Nirex, AMEC NNC, Rolls-Royce PLC and the UK Atomic Energy Authority. Work Package 3 of this consortium, led by the University of Leeds, concerns 'An Integrated Approach to Waste Immobilisation and Management', and involves Imperial College London, and the Universities of Manchester and Sheffield. The aims of this work package are: to study the re-mobilisation, transport, solid-liquid separation and immobilisation of particulate wastes; to develop predictive models for particle behaviour based on atomic scale, thermodynamic and process scale simulations; to develop a fundamental understanding of selective adsorption of nuclides onto filter systems and their immobilisation; and to consider mechanisms of nuclide leaving and transport. The paper describes highlights from this work in the key areas of multi-scale modeling

Feynman integrals and difference equations

Energy Technology Data Exchange (ETDEWEB)

Moch, S. [Deutsches Elektronen-Synchrotron (DESY), Zeuthen (Germany); Schneider, C. [Johannes Kepler Univ., Linz (Austria). Research Inst. for Symbolic Computation

2007-09-15

We report on the calculation of multi-loop Feynman integrals for single-scale problems by means of difference equations in Mellin space. The solution to these difference equations in terms of harmonic sums can be constructed algorithmically over difference fields, the so-called {pi}{sigma}{sup *}-fields. We test the implementation of the Mathematica package Sigma on examples from recent higher order perturbative calculations in Quantum Chromodynamics. (orig.)

Recharge Data Package for the 2005 Integrated Disposal Facility Performance Assessment

Energy Technology Data Exchange (ETDEWEB)

Fayer, Michael J.; Szecsody, Jim E.

2004-06-30

Pacific Northwest National Laboratory assisted CH2M Hill Hanford Group, Inc., (CHG) by providing estimates of recharge rates for current conditions and long-term scenarios involving disposal in the Integrated Disposal Facility (IDF). The IDF will be located in the 200 East Area at the Hanford Site and will receive several types of waste including immobilized low-activity waste. The recharge estimates for each scenario were derived from lysimeter and tracer data collected by the IDF PA Project and from modeling studies conducted for the project. Recharge estimates were provided for three specific site features (the surface barrier; possible barrier side slopes; and the surrounding soil) and four specific time periods (pre-Hanford; Hanford operations; surface barrier design life; post-barrier design life). CHG plans to conduct a performance assessment of the latest IDF design and call it the IDF 2005 PA; this recharge data package supports the upcoming IDF 2005 PA.

Transportation package design using numerical optimization

International Nuclear Information System (INIS)

Harding, D.C.; Witkowski, W.R.

1993-01-01

Since the design of transportation packages involves a complex coupling of structural, thermal and radiation shielding analyses and must follow very strict design constraints, numerical optimization provides the potential for more efficient container designs. In numerical optimization, the requirements of the design problem are mathematically formulated through the use of an objective function and constraints. The objective function(s), e.g., package weight, cost, volume, or combination thereof, is the function to be minimized or maximized by altering a set of design variables that define the package's shape and dimensions. Constraints are limitations on the performance of the system, such as resisting structural and thermal accident environments. Two constraints defined for an example wire mesh composite Type B package are: 1) deformation in the containment vessel seal region remains small enough throughout the 10 CFR-71 accident conditions to meet containment criteria, and 2) the elastomeric seal region remains below its operational temperature limit to guarantee seal integrity in the fire environment. The first constraint of a minimum energy absorbing layer thickness is evaluated with finite element analyses of the proposed dynamic crush accident criteria. The second constraint is evaluated with a 1-D transient thermal finite difference code parametrized for variable composite layer thicknesses, and is integrated with the optimization process. (J.P.N.)

Holistic Considerations in Optimizing a Sterile Product Package to Ensure Container Closure Integrity.

Science.gov (United States)

Degrazio, Fran L

2018-01-01

A new major chapter dealing with container closure integrity was released by the United States Pharmacopeial Convention. Chapter provides a significant amount of education and guidance concerning test methodologies to prove that a system is integral and safe for use. The test method used is only one of the major considerations in approaching the challenge of proving an integral system. This paper takes a holistic review of all the major considerations needed in qualifying a new vial system for container closure integrity. There is substantial interplay among many aspects in the process of sealing a vial. This review helps to define major risks that need to be considered and mitigated and reinforces the need to understand the maximum allowable leakage limit that is acceptable for a specific drug application. A typical risk-based approach considers materials, test methods, process, people, environment, and equipment. Each of these aspects is considered in some detail along with a recommended process flow for building a best practice, science-based approach. This approach will inform decision making for evaluating the correct combination of components and assuring they are assembled and tested in an appropriate manner. This work, once completed, can be the basis for a vial system platform or specific drug application qualification. LAY ABSTRACT: Container closure integrity is a fundamental requirement of every sterile drug package. With recent upgrading of compendia standards and guidance around this issue, there is an opportunity to better define a best practice approach to a complicated subject. It is important to recognize that there is substantial interplay among the components of the system, the process of assembly, and the test methods that are used. This paper takes a holistic approach to discussing these issues and identifying the risks that must be considered in assuring an integral container over the shelf life of a drug product. © PDA, Inc. 2018.

Freshness indices of roasted coffee: monitoring the loss of freshness for single serve capsules and roasted whole beans in different packaging.

Science.gov (United States)

Glöss, Alexia N; Schönbächler, Barbara; Rast, Markus; Deuber, Louis; Yeretzian, Chahan

2014-01-01

With the growing demand for high-quality coffee, it is becoming increasingly important to establish quantitative measures of the freshness of coffee, or the loss thereof, over time. Indeed, freshness has become a critical quality criterion in the specialty coffee scene, where the aim is to deliver the most pleasant flavor in the cup, from highest quality beans. A series of intensity ratios of selected volatile organic compounds (VOC) in the headspace of coffee (by gas chromatography-mass spectrometry) were revisited, with the aim to establish robust indicators of freshness of coffee - called freshness indices. Roasted whole beans in four different packaging materials and four commercial capsule systems from the Swiss market were investigated over a period of up to one year of storage time. These measurements revealed three types of insight. First, a clear link between barrier properties of the packaging material and the evolution of selected freshness indices was observed. Packaging materials that contain an aluminum layer offer better protection. Second, processing steps prior to packaging are reflected in the absolute values of freshness indices. Third, differences in the standard deviations of freshness-indices for single serve coffee capsule systems are indicative of differences in the consistency among systems, consistency being an important quality attribute of capsules.

Conceptual waste packaging options for deep borehole disposal

Energy Technology Data Exchange (ETDEWEB)

Su, Jiann -Cherng [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States); Hardin, Ernest L. [Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

2015-07-01

This report presents four concepts for packaging of radioactive waste for disposal in deep boreholes. Two of these are reference-size packages (11 inch outer diameter) and two are smaller (5 inch) for disposal of Cs/Sr capsules. All four have an assumed length of approximately 18.5 feet, which allows the internal length of the waste volume to be 16.4 feet. However, package length and volume can be scaled by changing the length of the middle, tubular section. The materials proposed for use are low-alloy steels, commonly used in the oil-and-gas industry. Threaded connections between packages, and internal threads used to seal the waste cavity, are common oilfield types. Two types of fill ports are proposed: flask-type and internal-flush. All four package design concepts would withstand hydrostatic pressure of 9,600 psi, with factor safety 2.0. The combined loading condition includes axial tension and compression from the weight of a string or stack of packages in the disposal borehole, either during lower and emplacement of a string, or after stacking of multiple packages emplaced singly. Combined loading also includes bending that may occur during emplacement, particularly for a string of packages threaded together. Flask-type packages would be fabricated and heat-treated, if necessary, before loading waste. The fill port would be narrower than the waste cavity inner diameter, so the flask type is suitable for directly loading bulk granular waste, or loading slim waste canisters (e.g., containing Cs/Sr capsules) that fit through the port. The fill port would be sealed with a tapered, threaded plug, with a welded cover plate (welded after loading). Threaded connections between packages and between packages and a drill string, would be standard drill pipe threads. The internal flush packaging concepts would use semi-flush oilfield tubing, which is internally flush but has a slight external upset at the joints. This type of tubing can be obtained with premium, low

Safety Analysis Report for Packaging (SARP): ATMX-500 Railcar nuclear packaging

International Nuclear Information System (INIS)

Griffin, J.F.; Peterson, J.B.; Edling, D.A.; Blauvelt, R.K.

1977-01-01

A Safety Analysis Report for Packaging (SARP) is described that makes available to all potential users the technical specifications and limits pertinent to the modification and use of the ATMX Railcars for which the Department of Transportation has issued Special Permit No. 5948. The SARP includes discussions of structural integrity, thermal resistance, radiation shielding and radiological safety, nuclear criticality safety, and quality control. Much of the information was previously published in a similar report. A complte physical and technical description of the package is presented. The packaging cnsists of a specially modified ATMX Series 500 Railcar loaded with DOT Specification steel drums or fiberglass coated plywood boxes. The results of the nuclear criticality safety analysis provide the maximum quantities of each fissile isotope which may be shipped as Fissile Class I in 30- and 55-gal drums. A limit of 5 g/ft 3 was established for wooden boxes. Design and development considerations regarding the packaging concept and modification of the ATMX-500 Railcar are presented. Tables, dimensional sketches, sequential photographs of the structural modifications, technical references, loading and shipping guidelines, and results of Mound Laboratory's experience in using this container are included. An internal review of this SARP was performed in compliance with the requirements of ERDA Manual Chapter 5201-Part V

Implications of intelligent, integrated microsystems for product design and development

International Nuclear Information System (INIS)

MYERS, DAVID R.; MCWHORTER, PAUL J.

2000-01-01

Intelligent, integrated microsystems combine some or all of the functions of sensing, processing information, actuation, and communication within a single integrated package, and preferably upon a single silicon chip. As the elements of these highly integrated solutions interact strongly with each other, the microsystem can be neither designed nor fabricated piecemeal, in contrast to the more familiar assembled products. Driven by technological imperatives, microsystems will best be developed by multi-disciplinary teams, most likely within the flatter, less hierarchical organizations. Standardization of design and process tools around a single, dominant technology will expedite economically viable operation under a common production infrastructure. The production base for intelligent, integrated microsystems has elements in common with the mathematical theory of chaos. Similar to chaos theory, the development of microsystems technology will be strongly dependent on, and optimized to, the initial product requirements that will drive standardization--thereby further rewarding early entrants to integrated microsystem technology

RNA secondary structures of the bacteriophage phi6 packaging regions.

Science.gov (United States)

Pirttimaa, M J; Bamford, D H

2000-06-01

Bacteriophage phi6 genome consists of three segments of double-stranded RNA. During maturation, single-stranded copies of these segments are packaged into preformed polymerase complex particles. Only phi6 RNA is packaged, and each particle contains only one copy of each segment. An in vitro packaging and replication assay has been developed for phi6, and the packaging signals (pac sites) have been mapped to the 5' ends of the RNA segments. In this study, we propose secondary structure models for the pac sites of phi6 single-stranded RNA segments. Our models accommodate data from structure-specific chemical modifications, free energy minimizations, and phylogenetic comparisons. Previously reported pac site deletion studies are also discussed. Each pac site possesses a unique architecture, that, however, contains common structural elements.

Consequences of postulated losses of LWR spent fuel and plutonium shipping packages at sea

International Nuclear Information System (INIS)

Heaberlin, S.W.; Baker, D.A.; Beyer, C.E.; Friley, J.R.; Mandel, S.; Peterson, P.L.; Sominen, F.A.

1977-10-01

The potential consequences of the loss of a large spent fuel cask and of a single 6M plutonium shipping package into the sea for two specific accident cases are estimated. The radiation dose to man through the marine food chain following the loss of undamaged and fire-damaged packages to the continental shelf and in the deep ocean are conservatively estimated. Two failure mechanisms that could lead to release of radioactive material after loss of packages into the ocean have been considered: corrosion and hydrostatic pressure. A third possible mechanism is thermal overpressurization following burial in marine sediments. It was determined that the seals or pressure relief devices on an undamaged spent fuel cask might fail from hydrostatic forces for losses on the continental shelf although some cask designs would retain their integrity at this depth. The population dose to man through the marine food chain following these scenarios has been estimated. The dose estimates are made relating the radioactive material released and the seafood productivity in the region of the release. Doses are based on a one-year consumption of contaminated seafood. The loss of a single plutonium package on the continental shelf is estimated to produce a population dose commitment of less than 250 man-rem for recycle plutonium. The dose commitment to the average individual is less than one millirem. Doses for losses of undamaged casks to the continental shelf and deep ocean and for loss of a fire-damaged cask to the deep ocean were determined to be several orders of magnitude smaller. 22 tables, 10 figures

Emergency response packaging: A conceptual outline

International Nuclear Information System (INIS)

Luna, R.E.; McClure, J.D.; Bennett, P.C.; Wheeler, T.A.

1992-01-01

The Packaging and Transportation Needs in the 1990's (PATN) component of the Transportation Assessment and Integration (TRAIN) program (DOE Nov. 1991) was designed to survey United States Department of Energy programs, both ongoing and planned, to identify needs for packaging and transportation services over the next decade. PATN also identified transportation elements that should be developed by the DOE Office of Environmental Restoration and Waste Management (DOE EM) Transportation Management Program (TMP). As a result of the predominant involvement of the TMP in radioactive material shipment issues and DOE EM's involvement with waste management issues, the primary focus of PATN was on waste packaging issues. Pending DOE regulations will formalize federal guidelines and regulations for transportation of hazardous and radioactive materials within the boundaries of DOE reservations and facilities and reflect a growing awareness of concern regarding safety environmental responsibility activities on DOE reservations. Future practices involving the transportation of radioactive material within DOE reservations will closely parallel those used for commercial and governmental transportation across the United States. This has added to the perceived need for emergency recovery packaging and emergency response features on primary packaging, for both on-site shipments and shipments between DOE facilities (off-site). Historically, emergency response and recovery functions of packaging have not been adequately considered in packaging design and construction concepts. This paper develops the rationale for emergency response packaging, including both overpack concepts for repackaging compromised packaging and primary packaging redesign to facilitate the recovery of packages via mobile remote handling equipment. The rationale will examine concepts for determination of likely use patterns to identify types of shipments where recovery packaging may have the most favorable payoff

An Object-Oriented Serial DSMC Simulation Package

Science.gov (United States)

Liu, Hongli; Cai, Chunpei

2011-05-01

A newly developed three-dimensional direct simulation Monte Carlo (DSMC) simulation package, named GRASP ("Generalized Rarefied gAs Simulation Package"), is reported in this paper. This package utilizes the concept of simulation engine, many C++ features and software design patterns. The package has an open architecture which can benefit further development and maintenance of the code. In order to reduce the engineering time for three-dimensional models, a hybrid grid scheme, combined with a flexible data structure compiled by C++ language, are implemented in this package. This scheme utilizes a local data structure based on the computational cell to achieve high performance on workstation processors. This data structure allows the DSMC algorithm to be very efficiently parallelized with domain decomposition and it provides much flexibility in terms of grid types. This package can utilize traditional structured, unstructured or hybrid grids within the framework of a single code to model arbitrarily complex geometries and to simulate rarefied gas flows. Benchmark test cases indicate that this package has satisfactory accuracy for complex rarefied gas flows.

Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays

Science.gov (United States)

Forsberg, Fredrik; Roxhed, Niclas; Fischer, Andreas C.; Samel, Björn; Ericsson, Per; Hoivik, Nils; Lapadatu, Adriana; Bring, Martin; Kittilsland, Gjermund; Stemme, Göran; Niklaus, Frank

2013-09-01

Imaging in the long wavelength infrared (LWIR) range from 8 to 14 μm is an extremely useful tool for non-contact measurement and imaging of temperature in many industrial, automotive and security applications. However, the cost of the infrared (IR) imaging components has to be significantly reduced to make IR imaging a viable technology for many cost-sensitive applications. This paper demonstrates new and improved fabrication and packaging technologies for next-generation IR imaging detectors based on uncooled IR bolometer focal plane arrays. The proposed technologies include very large scale heterogeneous integration for combining high-performance, SiGe quantum-well bolometers with electronic integrated read-out circuits and CMOS compatible wafer-level vacuum packing. The fabrication and characterization of bolometers with a pitch of 25 μm × 25 μm that are arranged on read-out-wafers in arrays with 320 × 240 pixels are presented. The bolometers contain a multi-layer quantum well SiGe thermistor with a temperature coefficient of resistance of -3.0%/K. The proposed CMOS compatible wafer-level vacuum packaging technology uses Cu-Sn solid-liquid interdiffusion (SLID) bonding. The presented technologies are suitable for implementation in cost-efficient fabless business models with the potential to bring about the cost reduction needed to enable low-cost IR imaging products for industrial, security and automotive applications.

A single-vendor and a single-buyer integrated inventory model with ordering cost reduction dependent on lead time

Science.gov (United States)

Vijayashree, M.; Uthayakumar, R.

2017-09-01

Lead time is one of the major limits that affect planning at every stage of the supply chain system. In this paper, we study a continuous review inventory model. This paper investigates the ordering cost reductions are dependent on lead time. This study addressed two-echelon supply chain problem consisting of a single vendor and a single buyer. The main contribution of this study is that the integrated total cost of the single vendor and the single buyer integrated system is analyzed by adopting two different (linear and logarithmic) types ordering cost reductions act dependent on lead time. In both cases, we develop effective solution procedures for finding the optimal solution and then illustrative numerical examples are given to illustrate the results. The solution procedure is to determine the optimal solutions of order quantity, ordering cost, lead time and the number of deliveries from the single vendor and the single buyer in one production run, so that the integrated total cost incurred has the minimum value. Ordering cost reduction is the main aspect of the proposed model. A numerical example is given to validate the model. Numerical example solved by using Matlab software. The mathematical model is solved analytically by minimizing the integrated total cost. Furthermore, the sensitivity analysis is included and the numerical examples are given to illustrate the results. The results obtained in this paper are illustrated with the help of numerical examples. The sensitivity of the proposed model has been checked with respect to the various major parameters of the system. Results reveal that the proposed integrated inventory model is more applicable for the supply chain manufacturing system. For each case, an algorithm procedure of finding the optimal solution is developed. Finally, the graphical representation is presented to illustrate the proposed model and also include the computer flowchart in each model.

Single-event effects in analog and mixed-signal integrated circuits

International Nuclear Information System (INIS)

Turflinger, T.L.

1996-01-01

Analog and mixed-signal integrated circuits are also susceptible to single-event effects, but they have rarely been tested. Analog circuit single-particle transients require modified test techniques and data analysis. Existing work is reviewed and future concerns are outlined

Thermal-Insulation Properties of Multilayer Textile Packages

Directory of Open Access Journals (Sweden)

Matusiak Małgorzata

2014-12-01

Full Text Available Thermal-insulation properties of textile materials play a significant role in material engineering of protective clothing. Thermal-insulation properties are very important from the point of view of thermal comfort of the clothing user as well as the protective efficiency against low or high temperature. Thermal protective clothing usually is a multilayer construction. Its thermal insulation is a resultant of a number of layers and their order, as well as the thermalinsulation properties of a single textile material creating particular layers. The aim of the presented work was to investigate the relationships between the thermal-insulation properties of single materials and multilayer textile packages composed of these materials. Measurement of the thermal-insulation properties of single and multilayer textile materials has been performed with the Alambeta. The following properties have been investigated: thermal conductivity, resistance and absorptivity. Investigated textile packages were composed of two, three and four layers made of woven and knitted fabrics, as well as nonwovens. On the basis of the obtained results an analysis has been carried out in order to assess the dependency of the resultant values of the thermal-insulation properties of multilayer packages on the appropriate values of particular components.

CRRES microelectronics test package (MEP)

International Nuclear Information System (INIS)

Mullen, E.G.; Ray, K.P.

1993-01-01

The Microelectronics Test Package (MEP) flown on board the Combined Release and Radiation Effects Satellite (CRRES) contained over 60 device types and approximately 400 total devices which were tested for both single event upset (SEU) and total dose (parametric degradation and annealing). A description of the experiment, the method of testing devices, and the structure of data acquisition are presented. Sample flight data are shown. These included SEUs from a GaAs 1 K RAM during the March 1991 solar flare, and a comparison between passive shielding and a specially designed spot shielding package

An Analysis of Computer Aided Design (CAD) Packages Used at MSFC for the Recent Initiative to Integrate Engineering Activities

Science.gov (United States)

Smith, Leigh M.; Parker, Nelson C. (Technical Monitor)

2002-01-01

This paper analyzes the use of Computer Aided Design (CAD) packages at NASA's Marshall Space Flight Center (MSFC). It examines the effectiveness of recent efforts to standardize CAD practices across MSFC engineering activities. An assessment of the roles played by management, designers, analysts, and manufacturers in this initiative will be explored. Finally, solutions are presented for better integration of CAD across MSFC in the future.

Automatic numerical integration methods for Feynman integrals through 3-loop

International Nuclear Information System (INIS)

De Doncker, E; Olagbemi, O; Yuasa, F; Ishikawa, T; Kato, K

2015-01-01

We give numerical integration results for Feynman loop diagrams through 3-loop such as those covered by Laporta [1]. The methods are based on automatic adaptive integration, using iterated integration and extrapolation with programs from the QUADPACK package, or multivariate techniques from the ParInt package. The Dqags algorithm from QuadPack accommodates boundary singularities of fairly general types. PARINT is a package for multivariate integration layered over MPI (Message Passing Interface), which runs on clusters and incorporates advanced parallel/distributed techniques such as load balancing among processes that may be distributed over a network of nodes. Results are included for 3-loop self-energy diagrams without IR (infra-red) or UV (ultra-violet) singularities. A procedure based on iterated integration and extrapolation yields a novel method of numerical regularization for integrals with UV terms, and is applied to a set of 2-loop self-energy diagrams with UV singularities. (paper)

Welding robot package; Arc yosetsu robot package

Energy Technology Data Exchange (ETDEWEB)

Nishikawa, S. [Yaskawa Electric Corp., Kitakyushu (Japan)

1998-09-01

For the conventional high-speed welding robot, the welding current was controlled mainly for reducing the spatters during short circuits and for stabilizing the beads by the periodic short circuits. However, an increase of deposition amount in response to the speed is required for the high-speed welding. Large-current low-spatter welding current region control was added. Units were integrated into a package by which the arc length is kept in short without dispersion of arc length for welding without defects such as undercut and unequal beads. In automobile industry, use of aluminum parts is extended for the light weight. The welding is very difficult, and automation is not so progressing in spite of the poor environment. Buckling of welding wire is easy to occur, and supply of wire is obstructed by the deposition of chipped powders on the torch cable, which stay within the contact chip resulting in the deposition. Dislocation of locus is easy to occur at the corner of rectangular pipe during the welding. By improving these troubles, an aluminum MIG welding robot package has been developed. 13 figs.

FF. A package to evaluate one-loop Feynman diagrams

International Nuclear Information System (INIS)

Oldenborgh, G.J. van

1990-09-01

A short description and a user's guide of the FF package are given. This package contains routines to evaluate numerically the scalar one-loop integrals occurring in the evaluation in one-loop Feynman diagrams. The algorithms chosen are numerically stable over most parameter space. (author). 5 refs.; 1 tab

RNA secondary structures of the bacteriophage phi6 packaging regions.

OpenAIRE

Pirttimaa, M J; Bamford, D H

2000-01-01

Bacteriophage phi6 genome consists of three segments of double-stranded RNA. During maturation, single-stranded copies of these segments are packaged into preformed polymerase complex particles. Only phi6 RNA is packaged, and each particle contains only one copy of each segment. An in vitro packaging and replication assay has been developed for phi6, and the packaging signals (pac sites) have been mapped to the 5' ends of the RNA segments. In this study, we propose secondary structure models ...

Design and packaging: Impact to consumer decision

Directory of Open Access Journals (Sweden)

Petrašinović Maja

2002-01-01

Full Text Available In marketing theory and practice, product packaging is getting more important. Changes in the market give to packaging a multifunctional phenomenon which is more that core product protection. It represent company marketing strategy and it is competitive tool, which needs to be integrated into a marketing plan and adapt to product, brand price distribution and promotion strategy. A focus to this approach is getting to know customer behavior.

The TE coupled RELAP5/PANTHER/COBRA code package and methodology for integrated PWR accident analysis

International Nuclear Information System (INIS)

Schneidesch, Christophe R.; Zhang, Jinzhao; Ammirabile, Luca; Dalleur, Jean-Paul

2006-01-01

coupled thermal hydraulic-neutronic transient calculations allow realistic simulations and hence better understanding the key physical phenomena. The TE coupled code package will be applied to develop coupled analysis methodologies for integrated safety analysis of other PWR accidents. (authors)

The TE coupled RELAP5/PANTHER/COBRA code package and methodology for integrated PWR accident analysis

Energy Technology Data Exchange (ETDEWEB)

Schneidesch, Christophe R.; Zhang, Jinzhao; Ammirabile, Luca; Dalleur, Jean-Paul [Suez-Tractebel Engineering, Avenue Ariane 7, B-1200 Brussels (Belgium)

2006-07-01

coupled thermal hydraulic-neutronic transient calculations allow realistic simulations and hence better understanding the key physical phenomena. The TE coupled code package will be applied to develop coupled analysis methodologies for integrated safety analysis of other PWR accidents. (authors)

Integrated and Optimized Energy-Efficient Construction Package for a Community of Production Homes in the Mixed-Humid Climate

Energy Technology Data Exchange (ETDEWEB)

Mallay, D. [Partnership for Home Innovation, Upper Marlboro, MD (United States); Wiehagen, J. [Partnership for Home Innovation, Upper Marlboro, MD (United States); Del Bianco, M. [Partnership for Home Innovation, Upper Marlboro, MD (United States)

2014-10-01

This research high performance home analyzes how a set of advanced technologies can be integrated into a durable and energy-efficient house in the mixed-humid climate while remaining affordable to homeowners. The technical solutions documented in this report are the cornerstone of the builder's entire business model based on delivering high-performance homes on a production basis as a standard product offering to all price segments of the residential market. Home Innovation Research Labs partnered with production builder Nexus EnergyHomes (CZ 4) and they plan to adopt the successful components of the energy solution package for all 55 homes in the community. The research objective was to optimize the builder's energy solution package based on energy performance and construction costs. All of the major construction features, including envelope upgrades, space conditioning system, hot water system, and solar electric system were analyzed.

Hybrid integrated single-wavelength laser with silicon micro-ring reflector

Science.gov (United States)

Ren, Min; Pu, Jing; Krishnamurthy, Vivek; Xu, Zhengji; Lee, Chee-Wei; Li, Dongdong; Gonzaga, Leonard; Toh, Yeow T.; Tjiptoharsono, Febi; Wang, Qian

2018-02-01

A hybrid integrated single-wavelength laser with silicon micro-ring reflector is demonstrated theoretically and experimentally. It consists of a heterogeneously integrated III-V section for optical gain, an adiabatic taper for light coupling, and a silicon micro-ring reflector for both wavelength selection and light reflection. Heterogeneous integration processes for multiple III-V chips bonded to an 8-inch Si wafer have been developed, which is promising for massive production of hybrid lasers on Si. The III-V layer is introduced on top of a 220-nm thick SOI layer through low-temperature wafer-boning technology. The optical coupling efficiency of >85% between III-V and Si waveguide has been achieved. The silicon micro-ring reflector, as the key element of the hybrid laser, is studied, with its maximized reflectivity of 85.6% demonstrated experimentally. The compact single-wavelength laser enables fully monolithic integration on silicon wafer for optical communication and optical sensing application.

Shielding design of radioactive contaminated metal waste packaging

International Nuclear Information System (INIS)

Zou Wenhua; Dong Zhiqiang; Yao Zhenyu; Xu Shuhe; Wang Wen

2015-01-01

Focusing on the cylindrical source model to calculate γ dose field of waste packages with the relative formulae then derived. By comparing the calculated data of waste packages of type Ⅷ steel box with the monitoring data, it is found that the cylinder source model could accurately reflect the distributions of γ dose of the waste package. Based on the results of the cylindrical source model, a reasonable shielding technology applicable to waste package containers was designed to meet relevant requirements prescribed in standards about the transport and disposal of radioactive materials. The cylinder source model calculated dose distributions for single package in this paper is simple and easy to implement but slightly larger than the monitoring data providing a certain safety margin for the shielding design. It is suitable for radiological engineering practices. (authors)

Recent developments in intelligent packaging for enhancing food quality and safety.

Science.gov (United States)

Sohail, Muhammad; Sun, Da-Wen; Zhu, Zhiwei

2018-03-07

The role of packaging cannot be denied in the life cycle of any food product. Intelligent packaging is an emerging technology in the food packaging sector. Although it still needs its full emergence in the market, its importance has been proved for the maintenance of food quality and safety. The present review describes several aspects of intelligent packaging. It first highlights different tools used in intelligent packaging and elucidates the role of these packaging devices for maintaining the quality of different food items in terms of controlling microbial growth and gas concentration, and for providing convenience and easiness to its users in the form of time temperature indication. This review also discusses other intelligent packaging solutions in supply chain management of food products to control theft and counterfeiting conducts and broaden the image of the food companies in terms of branding and marketing. Overall, intelligent packaging can ensure food quality and safety in the food industry, however there are still some concerns over this emerging technology including high cost and legal aspects, and thus future work should be performed to overcome these problems for further promoting its applications in the food industry. Moreover, work should also be carried out to combine several single intelligent packaging devices into a single one, so that most of the benefits from this emerging technology can be achieved.

Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects

Science.gov (United States)

Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter

2011-02-01

The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

Extreme temperature packaging: challenges and opportunities

Science.gov (United States)

Johnson, R. Wayne

2016-05-01

Consumer electronics account for the majority of electronics manufactured today. Given the temperature limits of humans, consumer electronics are typically rated for operation from -40°C to +85°C. Military applications extend the range to -65°C to +125°C while underhood automotive electronics may see +150°C. With the proliferation of the Internet of Things (IoT), the goal of instrumenting (sensing, computation, transmission) to improve safety and performance in high temperature environments such as geothermal wells, nuclear reactors, combustion chambers, industrial processes, etc. requires sensors, electronics and packaging compatible with these environments. Advances in wide bandgap semiconductors (SiC and GaN) allow the fabrication of high temperature compatible sensors and electronics. Integration and packaging of these devices is required for implementation into actual applications. The basic elements of packaging are die attach, electrical interconnection and the package or housing. Consumer electronics typically use conductive adhesives or low melting point solders for die attach, wire bonds or low melting solder for electrical interconnection and epoxy for the package. These materials melt or decompose in high temperature environments. This paper examines materials and processes for high temperature packaging including liquid transient phase and sintered nanoparticle die attach, high melting point wires for wire bonding and metal and ceramic packages. The limitations of currently available solutions will also be discussed.

The Space package: Tight Integration Between Space and Semantics

NARCIS (Netherlands)

van Hage, W.R.; Wielemaker, J.; Schreiber, A.Th.

2010-01-01

Interpretation of spatial features often requires combined reasoning over geometry and semantics. We introduce the Space package, an open source SWI-Prolog extension that provides spatial indexing capabilities. Together with the existing semantic web reasoning capabilities of SWI-Prolog, this allows

In-Package Chemistry Abstraction

Energy Technology Data Exchange (ETDEWEB)

E. Thomas

2004-11-09

This report was developed in accordance with the requirements in ''Technical Work Plan for: Regulatory Integration Modeling and Analysis of the Waste Form and Waste Package'' (BSC 2004 [DIRS 171583]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model that uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model that is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed waste packages that contain both high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor that diffuses into the waste package, and (2) seepage water that enters the waste package from the drift as a liquid. (1) Vapor Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H2O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Water Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package. TSPA-LA uses the vapor influx case for the nominal scenario for simulations where the waste

In-Package Chemistry Abstraction

International Nuclear Information System (INIS)

E. Thomas

2004-01-01

This report was developed in accordance with the requirements in ''Technical Work Plan for: Regulatory Integration Modeling and Analysis of the Waste Form and Waste Package'' (BSC 2004 [DIRS 171583]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model that uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model that is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed waste packages that contain both high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor that diffuses into the waste package, and (2) seepage water that enters the waste package from the drift as a liquid. (1) Vapor Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H2O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Water Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package. TSPA-LA uses the vapor influx case for the nominal scenario for simulations where the waste package has been

Classic Multi-Configuration-Dirac-Fock and Hartree-Fock-Relativistic methods integrated into a program package for the RAL-IBM mainframe with automatic comparative output

International Nuclear Information System (INIS)

Cowan, R.D.; Grant, I.P.; Fawcett, B.C.; Rose, S.J.

1985-11-01

A Multi-Configuration-Dirac-Fock (MCDF) computer program is adapted to interface with the Hartree-Fock-Relativistic (HFR) program for the RAL IBM mainframe computer. The two codes are integrated into a package which includes the Zeeman Laboratory Slater parameter optimisation routines as well as new RAL routines to further process the HFR and MCDF output. A description of the adaptions to MCDF and new output extensions is included in this report, and details are given regarding HFR FORTRAN subroutines, and lists of Job Control Language (JCL) files for the complete package. (author)

Nuclear waste management technical support in the developmnt of nuclear waste form criteria for the NRC. Task 5. National waste package program

International Nuclear Information System (INIS)

Davis, M.S.

1982-02-01

This report assesses the need for a centrally organized waste package effort and whether the present national program meets those needs. It is the conclusion of the BNL staff that while the DOE has in principle organized a national effort to develop high-integrity waste packages for geologic disposal of high level waste, the effort has not yet produced data to demonstrate that a waste package will comply with NRC's criteria. The BNL staff feels, however, that such a package is achievable either by development of high integrity components which by themselves could comply with 1000-year containment or by the development of new waste package designs that could comply with both the containment and the controlled release criteria in the 10CFR 60 performance objectives. In terms of waste forms, high-integrity components such as pyrolytic carbon coated waste and radioactive glass coated with non-radioactive glass offer higher potential than normal borosilicate waste glass. The existing container research program has yet to produce the data base on which to assess the potential of a container material to contain the waste for 1000 years. However, there may be the potential, based on Swedish calculations and work done on titanium in the DOE program, that Ti or its alloys may satisfy this criterion. Existing data on natural backfills will not be acceptable as the sole source for satisfying containment and the long-term release rate criteria. However, a synthetic zeolite system is an example of a backfill with a potential to satisfy both criteria. In this particular case, it is the BNL staff's opinion that existing technology and data for this system indicate that major development programs may not be required to qualify this material for licensing applications. The most likely means available for satisfying 10 CFR 60 with a single package component is through the performance of a discrete backfill

GAPIT: genome association and prediction integrated tool.

Science.gov (United States)

Lipka, Alexander E; Tian, Feng; Wang, Qishan; Peiffer, Jason; Li, Meng; Bradbury, Peter J; Gore, Michael A; Buckler, Edward S; Zhang, Zhiwu

2012-09-15

Software programs that conduct genome-wide association studies and genomic prediction and selection need to use methodologies that maximize statistical power, provide high prediction accuracy and run in a computationally efficient manner. We developed an R package called Genome Association and Prediction Integrated Tool (GAPIT) that implements advanced statistical methods including the compressed mixed linear model (CMLM) and CMLM-based genomic prediction and selection. The GAPIT package can handle large datasets in excess of 10 000 individuals and 1 million single-nucleotide polymorphisms with minimal computational time, while providing user-friendly access and concise tables and graphs to interpret results. http://www.maizegenetics.net/GAPIT. zhiwu.zhang@cornell.edu Supplementary data are available at Bioinformatics online.

The Volterra's integral equation theory for accelerator single-freedom nonlinear components

International Nuclear Information System (INIS)

Wang Sheng; Xie Xi

1996-01-01

The Volterra's integral equation equivalent to the dynamic equation of accelerator single-freedom nonlinear components is given, starting from which the transport operator of accelerator single-freedom nonlinear components and its inverse transport operator are obtained. Therefore, another algorithm for the expert system of the beam transport operator of accelerator single-freedom nonlinear components is developed

CHP Integrated with Burners for Packaged Boilers

Energy Technology Data Exchange (ETDEWEB)

Castaldini, Carlo; Darby, Eric

2013-09-30

The objective of this project was to engineer, design, fabricate, and field demonstrate a Boiler Burner Energy System Technology (BBEST) that integrates a low-cost, clean burning, gas-fired simple-cycle (unrecuperated) 100 kWe (net) microturbine (SCMT) with a new ultra low-NOx gas-fired burner (ULNB) into one compact Combined Heat and Power (CHP) product that can be retrofit on new and existing industrial and commercial boilers in place of conventional burners. The Scope of Work for this project was segmented into two principal phases: (Phase I) Hardware development, assembly and pre-test and (Phase II) Field installation and demonstration testing. Phase I was divided into five technical tasks (Task 2 to 6). These tasks covered the engineering, design, fabrication, testing and optimization of each key component of the CHP system principally, ULNB, SCMT, assembly BBEST CHP package, and integrated controls. Phase I work culminated with the laboratory testing of the completed BBEST assembly prior to shipment for field installation and demonstration. Phase II consisted of two remaining technical tasks (Task 7 and 8), which focused on the installation, startup, and field verification tests at a pre-selected industrial plant to document performance and attainment of all project objectives. Technical direction and administration was under the management of CMCE, Inc. Altex Technologies Corporation lead the design, assembly and testing of the system. Field demonstration was supported by Leva Energy, the commercialization firm founded by executives at CMCE and Altex. Leva Energy has applied for patent protection on the BBEST process under the trade name of Power Burner and holds the license for the burner currently used in the product. The commercial term Power Burner is used throughout this report to refer to the BBEST technology proposed for this project. The project was co-funded by the California Energy Commission and the Southern California Gas Company (SCG), a

A Quantitative Property-Property Relationship for Estimating Packaging-Food Partition Coefficients of Organic Compounds

DEFF Research Database (Denmark)

Huang, L.; Ernstoff, Alexi; Xu, H.

2017-01-01

Organic chemicals encapsulated in beverage and food packaging can migrate to the food and lead to human exposures via ingestion. The packaging-food (Kpf) partition coefficient is a key parameter to estimate the chemical migration from packaging materials. Previous studies have simply set Kpf to 1...... or 1000, or provided separate linear correlations for several discrete values of ethanol equivalencies of food simulants (EtOH-eq). The aim of the present study is to develop a single quantitative property-property relationship (QPPR) valid for different chemical-packaging combinations and for water...... because only two packaging types are included. This preliminary QPPR demonstrates that the Kpf for various chemicalpackaging-food combinations can be estimated by a single linear correlation. Based on more than 1000 collected Kpf in 15 materials, we will present extensive results for other packaging types...

Challenges in the Packaging of MEMS

Energy Technology Data Exchange (ETDEWEB)

Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O' Neal, C.; Brown, W.D.; Miller, W.M.

1999-03-26

gross lack of understanding between the package materials, induced stress, and the device performance. The material properties of these packaging materials are not well defined or understood. Modeling of these materials and processes is far from maturity. Current post-package yields are too low for commercial feasibility, and consumer operating environment reliability and compatibility are often difficult to simulate. With further understanding of the materials properties and behavior of the packaging materials, MEMS applications can be fully realized and integrated into countless commercial and military applications.

rpanel: Simple Interactive Controls for R Functions Using the tcltk Package

Directory of Open Access Journals (Sweden)

Gavin Alexander

2006-01-01

Full Text Available In a variety of settings it is extremely helpful to be able to apply R functions through buttons, sliders and other types of graphical control. This is particularly true in plotting activities where immediate communication between such controls and a graphical display allows the user to interact with a plot in a very effective manner. The tcltk package provides extensive tools for this and the aim of the rpanel package is to provide simple and well documented functions which make these facilities as accessible as possible. In addition, the operations which form the basis of communication within tcltk are managed in a way which allows users to write functions with a more standard form of parameter passing. This paper describes the basic design of the software and illustrates it on a variety of examples of interactive control of graphics. The tkrplot system is used to allow plots to be integrated with controls into a single panel. An example of the use of a graphical image, and the ability to interact with this, is also discussed.

Power Electronic Packaging Design, Assembly Process, Reliability and Modeling

CERN Document Server

Liu, Yong

2012-01-01

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can d...

A Maple package for computing Groebner bases for linear recurrence relations

International Nuclear Information System (INIS)

Gerdt, Vladimir P.; Robertz, Daniel

2006-01-01

A Maple package for computing Groebner bases of linear difference ideals is described. The underlying algorithm is based on Janet and Janet-like monomial divisions associated with finite difference operators. The package can be used, for example, for automatic generation of difference schemes for linear partial differential equations and for reduction of multiloop Feynman integrals. These two possible applications are illustrated by simple examples of the Laplace equation and a one-loop scalar integral of propagator type

A Maple package for computing Groebner bases for linear recurrence relations

Energy Technology Data Exchange (ETDEWEB)

Gerdt, Vladimir P. [Laboratory of Information Technologies, Joint Institute for Nuclear Research, 141980 Dubna (Russian Federation)]. E-mail: gerdt@jinr.ru; Robertz, Daniel [Lehrstuhl B fuer Mathematik, RWTH Aachen, Templergraben 64, D-52062 Aachen (Germany)]. E-mail: daniel@momo.math.rwth-aachen.de

2006-04-01

A Maple package for computing Groebner bases of linear difference ideals is described. The underlying algorithm is based on Janet and Janet-like monomial divisions associated with finite difference operators. The package can be used, for example, for automatic generation of difference schemes for linear partial differential equations and for reduction of multiloop Feynman integrals. These two possible applications are illustrated by simple examples of the Laplace equation and a one-loop scalar integral of propagator type.

The Use of Digital Radiography in the Evaluation of Radioactive Materials. Packaging Performance Testing

International Nuclear Information System (INIS)

May, C; Lawrence Gelder, L; Boyd Howard, B

2007-01-01

New designs of radioactive material shipping packages are required to be evaluated in accordance with 10 CFR Part 71, ''Packaging and Transportation of Radioactive Material''. This paper will discuss the use of digital radiography to evaluate the effects of the tests required by 10 CFR 71.71, Normal Conditions of Transport (NCT), and 10 CFR 71.73, Hypothetical Accident Conditions (HAC). One acceptable means of evaluating packaging performance is to subject packagings to the series of NCT and HAC tests. The evaluation includes a determination of the effect on the packaging by the conditions and tests. That determination has required that packagings be cut and sectioned to learn the actual effects on internal components. Digital radiography permits the examination of internal packaging components without sectioning a package. This allows a single package to be subjected to a series of tests. After each test, the package is digitally radiographed and the effects of particular tests evaluated. Radiography reduces the number of packages required for testing and also reduces labor and materials required to section and evaluate numerous packages. This paper will include a description of the digital radiography equipment used in the testing and evaluation of the 9977 and 9978 packages at SRNL. The equipment is capable of making a single radiograph of a full-sized package in one exposure. Radiographs will be compared to sectioned packages that show actual conditions compared to radiographic images

Numerical integration of massive two-loop Mellin-Barnes integrals in Minkowskian regions

International Nuclear Information System (INIS)

Dubovyk, Ievgen

2016-07-01

Mellin-Barnes (MB) techniques applied to integrals emerging in particle physics perturbative calculations are summarized. New versions of AMBRE packages which construct planar and nonplanar MB representations are shortly discussed. The numerical package MBnumerics.m is presented for the first time which is able to calculate with a high precision multidimensional MB integrals in Minkowskian regions. Examples are given for massive vertex integrals which include threshold effects and several scale parameters.

Numerical integration of massive two-loop Mellin-Barnes integrals in Minkowskian regions

Energy Technology Data Exchange (ETDEWEB)

Dubovyk, Ievgen [Deutsches Elektronen-Synchrotron (DESY), Zeuthen (Germany); Hamburg Univ. (Germany). 2. Inst. fuer Theoretische Physik; Gluza, Janusz [Uniwersytet Slaski, Katowice (Poland). Inst. Fizyki; Riemann, Tord [Deutsches Elektronen-Synchrotron (DESY), Zeuthen (Germany); Uniwersytet Slaski, Katowice (Poland). Inst. Fizyki; Usovitsch, Johann [Deutsches Elektronen-Synchrotron (DESY), Zeuthen (Germany)

2016-07-15

Mellin-Barnes (MB) techniques applied to integrals emerging in particle physics perturbative calculations are summarized. New versions of AMBRE packages which construct planar and nonplanar MB representations are shortly discussed. The numerical package MBnumerics.m is presented for the first time which is able to calculate with a high precision multidimensional MB integrals in Minkowskian regions. Examples are given for massive vertex integrals which include threshold effects and several scale parameters.

The single-event effect evaluation technology for nano integrated circuits

International Nuclear Information System (INIS)

Zheng Hongchao; Zhao Yuanfu; Yue Suge; Fan Long; Du Shougang; Chen Maoxin; Yu Chunqing

2015-01-01

Single-event effects of nano scale integrated circuits are investigated. Evaluation methods for single-event transients, single-event upsets, and single-event functional interrupts in nano circuits are summarized and classified in detail. The difficulties in SEE testing are discussed as well as the development direction of test technology, with emphasis placed on the experimental evaluation of a nano circuit under heavy ion, proton, and laser irradiation. The conclusions in this paper are based on many years of testing at accelerator facilities and our present understanding of the mechanisms for SEEs, which have been well verified experimentally. (paper)

Development of Specifications for Radioactive Waste Packages

International Nuclear Information System (INIS)

2006-10-01

The main objective of this publication is to provide guidelines for the development of waste package specifications that comply with waste acceptance requirements for storage and disposal of radioactive waste. It will assist waste generators and waste package producers in selecting the most significant parameters and in developing and implementing specifications for each individual type of waste and waste package. This publication also identifies and reviews the activities and technical provisions that are necessary to meet safety requirements; in particular, selection of the significant safety parameters and preparation of specifications for waste forms, waste containers and waste packages using proven approaches, methods and technologies. This report provides guidance using a systematic, stepwise approach, integrating the technical, organizational and administrative factors that need to be considered at each step of planning and implementing waste package design, fabrication, approval, quality assurance and control. The report reflects the considerable experience and knowledge that has been accumulated in the IAEA Member States and is consistent with the current international requirements, principles, standards and guidance for the safe management of radioactive waste

Development of Specifications for Radioactive Waste Packages

Energy Technology Data Exchange (ETDEWEB)

NONE

2006-10-15

The main objective of this publication is to provide guidelines for the development of waste package specifications that comply with waste acceptance requirements for storage and disposal of radioactive waste. It will assist waste generators and waste package producers in selecting the most significant parameters and in developing and implementing specifications for each individual type of waste and waste package. This publication also identifies and reviews the activities and technical provisions that are necessary to meet safety requirements; in particular, selection of the significant safety parameters and preparation of specifications for waste forms, waste containers and waste packages using proven approaches, methods and technologies. This report provides guidance using a systematic, stepwise approach, integrating the technical, organizational and administrative factors that need to be considered at each step of planning and implementing waste package design, fabrication, approval, quality assurance and control. The report reflects the considerable experience and knowledge that has been accumulated in the IAEA Member States and is consistent with the current international requirements, principles, standards and guidance for the safe management of radioactive waste.

Unsupervised multiple kernel learning for heterogeneous data integration.

Science.gov (United States)

Mariette, Jérôme; Villa-Vialaneix, Nathalie

2018-03-15

Recent high-throughput sequencing advances have expanded the breadth of available omics datasets and the integrated analysis of multiple datasets obtained on the same samples has allowed to gain important insights in a wide range of applications. However, the integration of various sources of information remains a challenge for systems biology since produced datasets are often of heterogeneous types, with the need of developing generic methods to take their different specificities into account. We propose a multiple kernel framework that allows to integrate multiple datasets of various types into a single exploratory analysis. Several solutions are provided to learn either a consensus meta-kernel or a meta-kernel that preserves the original topology of the datasets. We applied our framework to analyse two public multi-omics datasets. First, the multiple metagenomic datasets, collected during the TARA Oceans expedition, was explored to demonstrate that our method is able to retrieve previous findings in a single kernel PCA as well as to provide a new image of the sample structures when a larger number of datasets are included in the analysis. To perform this analysis, a generic procedure is also proposed to improve the interpretability of the kernel PCA in regards with the original data. Second, the multi-omics breast cancer datasets, provided by The Cancer Genome Atlas, is analysed using a kernel Self-Organizing Maps with both single and multi-omics strategies. The comparison of these two approaches demonstrates the benefit of our integration method to improve the representation of the studied biological system. Proposed methods are available in the R package mixKernel, released on CRAN. It is fully compatible with the mixOmics package and a tutorial describing the approach can be found on mixOmics web site http://mixomics.org/mixkernel/. jerome.mariette@inra.fr or nathalie.villa-vialaneix@inra.fr. Supplementary data are available at Bioinformatics online.

EVALUATION OF FOUR INTEGRATED PEST MANAGEMENT PACKAGES FOR CONTROLLING MAIN PESTS OF COTTON IN RAINFED FIELDS

Directory of Open Access Journals (Sweden)

Nurindah Nurindah

2014-04-01

Full Text Available Cotton production nationally is low due to various constraints, including pests. Two main pests commonly found in cotton plantation in rain fed fields are cotton leafhopper (Amrasca biguttula and cotton bollworm (Helicoverpa armigera. The study aimed to evaluate four packages of integrated pest management (IPM techniques to control cotton leafhopper and cotton bollworm in rain fed fields. The experiment was conducted in farmers’ fields at Asembagus, East Java, between January and July 2012. Four packages of IPM evaluated were cotton varieties, i.e. Kanesia 10 or Kanesia 13, and seed treatment with synthetic insecticide (imidacloprid before sowing or spraying molasses (10 ml L-1 water as food for natural enemies. The cotton plants were intercropped with groundnut and sprayed with neem seed extract (NSE at the action threshold level for pest control. These packages were compared among themselves and also with the methods usually used by farmers, i.e. planting cotton variety Kanesia 8 intercropped with groundnut and pest control using synthetic chemical insecticides. Twenty five plants were sampled randomly per plot and measured for their growth, leafhopper and  bollworm populations, as well as cotton seed yield per plot. Observations were made weekly, starting at 30 days after planting (DAP until 120 DAP. The results showed that the use of Kanesia 10 or Kanesia 13 intercropped with groundnut and spraying molasses to conserve natural enemies was the best  pest management practice and superior to farmers’ practices. Conserving natural enemies is not only profitable (saving production cost of IDR1,150,000 to IDR1,500,000 ha-1 season-1, but also safe for the environment (no need to spray chemical insecticides.

Packaging design criteria for the Type B Drum

International Nuclear Information System (INIS)

Edwards, W.S.; Smith, R.J.; Wells, A.H.

1995-09-01

The Type B Drum package is a transportation cask capable of shipping a single 55-gal (208 L) drum of transuranic (TRU) waste. The Type B Drum is smaller than existing certified packages, such as the TRUPACT-II cask, but will allow payloads with higher thermal and gas generation rates, thus providing greater operational flexibility. The Type B Drum package has double containment so that plutonium contents and other radioactive material may be transported in Type B quantities. Conceptual designs of unshielded and shielded versions of the Type B Drum were completed in Report on the Conceptual Design of the Unshielded Type B Drum Packaging and Report on the Conceptual Design of the Shielded type B Drum Packaging (WEC 1994a, WEC 1994b), which demonstrated the Type B Drum to be a viable packaging system. A Type B package containment system must withstand the normal conditions of transport and the hypothetical accident conditions, which include a 9-m (30-ft) drop onto an unyielding surface and a 1-m (3-ft) drop onto a 15-cm (6-in.) diameter pin, and a fire and immersion scenarios

Waste Package Design Methodology Report

Energy Technology Data Exchange (ETDEWEB)

D.A. Brownson

2001-09-28

The objective of this report is to describe the analytical methods and processes used by the Waste Package Design Section to establish the integrity of the various waste package designs, the emplacement pallet, and the drip shield. The scope of this report shall be the methodology used in criticality, risk-informed, shielding, source term, structural, and thermal analyses. The basic features and appropriateness of the methods are illustrated, and the processes are defined whereby input values and assumptions flow through the application of those methods to obtain designs that ensure defense-in-depth as well as satisfy requirements on system performance. Such requirements include those imposed by federal regulation, from both the U.S. Department of Energy (DOE) and U.S. Nuclear Regulatory Commission (NRC), and those imposed by the Yucca Mountain Project to meet repository performance goals. The report is to be used, in part, to describe the waste package design methods and techniques to be used for producing input to the License Application Report.

Waste Package Design Methodology Report

International Nuclear Information System (INIS)

D.A. Brownson

2001-01-01

The objective of this report is to describe the analytical methods and processes used by the Waste Package Design Section to establish the integrity of the various waste package designs, the emplacement pallet, and the drip shield. The scope of this report shall be the methodology used in criticality, risk-informed, shielding, source term, structural, and thermal analyses. The basic features and appropriateness of the methods are illustrated, and the processes are defined whereby input values and assumptions flow through the application of those methods to obtain designs that ensure defense-in-depth as well as satisfy requirements on system performance. Such requirements include those imposed by federal regulation, from both the U.S. Department of Energy (DOE) and U.S. Nuclear Regulatory Commission (NRC), and those imposed by the Yucca Mountain Project to meet repository performance goals. The report is to be used, in part, to describe the waste package design methods and techniques to be used for producing input to the License Application Report

An Integration of the Restructured Melcor for the Midas Computer Code

International Nuclear Information System (INIS)

Sunhee Park; Dong Ha Kim; Ko-Ryu Kim; Song-Won Cho

2006-01-01

The developmental need for a localized severe accident analysis code is on the rise. KAERI is developing a severe accident code called MIDAS, which is based on MELCOR. In order to develop the localized code (MIDAS) which simulates a severe accident in a nuclear power plant, the existing data structure is reconstructed for all the packages in MELCOR, which uses pointer variables for data transfer between the packages. During this process, new features in FORTRAN90 such as a dynamic allocation are used for an improved data saving and transferring method. Hence the readability, maintainability and portability of the MIDAS code have been enhanced. After the package-wise restructuring, the newly converted packages are integrated together. Depending on the data usage in the package, two types of packages can be defined: some use their own data within the package (let's call them independent packages) and the others share their data with other packages (dependent packages). For the independent packages, the integration process is simple to link the already converted packages together. That is, the package-wise structuring does not require further conversion of variables for the integration process. For the dependent packages, extra conversion is necessary to link them together. As the package-wise restructuring converts only the corresponding package's variables, other variables defined from other packages are not touched and remain as it is. These variables are to be converted into the new types of variables simultaneously as well as the main variables in the corresponding package. Then these dependent packages are ready for integration. In order to check whether the integration process is working well, the results from the integrated version are verified against the package-wise restructured results. Steady state runs and station blackout sequences are tested and the major variables are found to be the same each other. In order to verify the results, the integrated

Quantum dash based single section mode locked lasers for photonic integrated circuits.

Science.gov (United States)

Joshi, Siddharth; Calò, Cosimo; Chimot, Nicolas; Radziunas, Mindaugas; Arkhipov, Rostislav; Barbet, Sophie; Accard, Alain; Ramdane, Abderrahim; Lelarge, Francois

2014-05-05

We present the first demonstration of an InAs/InP Quantum Dash based single-section frequency comb generator designed for use in photonic integrated circuits (PICs). The laser cavity is closed using a specifically designed Bragg reflector without compromising the mode-locking performance of the self pulsating laser. This enables the integration of single-section mode-locked laser in photonic integrated circuits as on-chip frequency comb generators. We also investigate the relations between cavity modes in such a device and demonstrate how the dispersion of the complex mode frequencies induced by the Bragg grating implies a violation of the equi-distance between the adjacent mode frequencies and, therefore, forbids the locking of the modes in a classical Bragg Device. Finally we integrate such a Bragg Mirror based laser with Semiconductor Optical Amplifier (SOA) to demonstrate the monolithic integration of QDash based low phase noise sources in PICs.

Hybrid animation integrating 2D and 3D assets

CERN Document Server

O'Hailey, Tina

2010-01-01

Artist imaginations continue to grow and stretch the boundaries of traditional animation. Successful animators adept and highly skilled in traditional animation mediums are branching out beyond traditional animation workflows and will often use multiple forms of animation in a single project. With the knowledge of 3D and 2D assets and the integration of multiple animation mediums into a single project, animators have a wealth of creative resources available for a project that is not limited to a specific animation medium, software package or workflow processs. Enhance a poignant scene by choos

Single Bit Radar Systems for Digital Integration

OpenAIRE

Bjørndal, Øystein

2017-01-01

Small, low cost, radar systems have exciting applications in monitoring and imaging for the industrial, healthcare and Internet of Things (IoT) sectors. We here explore, and show the feasibility of, several single bit square wave radar architectures; that benefits from the continuous improvement in digital technologies for system-on-chip digital integration. By analysis, simulation and measurements we explore novel and harmonic-rich continuous wave (CW), stepped-frequency CW (SFCW) and freque...

Wafer-Level Vacuum Packaging of Smart Sensors

OpenAIRE

Hilton, Allan; Temple, Dorota S.

2016-01-01

The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging...

Foundry fabricated photonic integrated circuit optical phase lock loop.

Science.gov (United States)

Bałakier, Katarzyna; Fice, Martyn J; Ponnampalam, Lalitha; Graham, Chris S; Wonfor, Adrian; Seeds, Alwyn J; Renaud, Cyril C

2017-07-24

This paper describes the first foundry-based InP photonic integrated circuit (PIC) designed to work within a heterodyne optical phase locked loop (OPLL). The PIC and an external electronic circuit were used to phase-lock a single-line semiconductor laser diode to an incoming reference laser, with tuneable frequency offset from 4 GHz to 12 GHz. The PIC contains 33 active and passive components monolithically integrated on a single chip, fully demonstrating the capability of a generic foundry PIC fabrication model. The electronic part of the OPLL consists of commercially available RF components. This semi-packaged system stabilizes the phase and frequency of the integrated laser so that an absolute frequency, high-purity heterodyne signal can be generated when the OPLL is in operation, with phase noise lower than -100 dBc/Hz at 10 kHz offset from the carrier. This is the lowest phase noise level ever demonstrated by monolithically integrated OPLLs.

Integrative NMR for biomolecular research

International Nuclear Information System (INIS)

Lee, Woonghee; Cornilescu, Gabriel; Dashti, Hesam; Eghbalnia, Hamid R.; Tonelli, Marco; Westler, William M.; Butcher, Samuel E.; Henzler-Wildman, Katherine A.; Markley, John L.

2016-01-01

NMR spectroscopy is a powerful technique for determining structural and functional features of biomolecules in physiological solution as well as for observing their intermolecular interactions in real-time. However, complex steps associated with its practice have made the approach daunting for non-specialists. We introduce an NMR platform that makes biomolecular NMR spectroscopy much more accessible by integrating tools, databases, web services, and video tutorials that can be launched by simple installation of NMRFAM software packages or using a cross-platform virtual machine that can be run on any standard laptop or desktop computer. The software package can be downloaded freely from the NMRFAM software download page ( http://pine.nmrfam.wisc.edu/download-packages.html http://pine.nmrfam.wisc.edu/download_packages.html ), and detailed instructions are available from the Integrative NMR Video Tutorial page ( http://pine.nmrfam.wisc.edu/integrative.html http://pine.nmrfam.wisc.edu/integrative.html ).

Experimental Approaches to Study Genome Packaging of Influenza A Viruses

Directory of Open Access Journals (Sweden)

Catherine Isel

2016-08-01

Full Text Available The genome of influenza A viruses (IAV consists of eight single-stranded negative sense viral RNAs (vRNAs encapsidated into viral ribonucleoproteins (vRNPs. It is now well established that genome packaging (i.e., the incorporation of a set of eight distinct vRNPs into budding viral particles, follows a specific pathway guided by segment-specific cis-acting packaging signals on each vRNA. However, the precise nature and function of the packaging signals, and the mechanisms underlying the assembly of vRNPs into sub-bundles in the cytoplasm and their selective packaging at the viral budding site, remain largely unknown. Here, we review the diverse and complementary methods currently being used to elucidate these aspects of the viral cycle. They range from conventional and competitive reverse genetics, single molecule imaging of vRNPs by fluorescence in situ hybridization (FISH and high-resolution electron microscopy and tomography of budding viral particles, to solely in vitro approaches to investigate vRNA-vRNA interactions at the molecular level.

Integrated software package for nuclear material safeguards in a MOX fuel fabrication facility

International Nuclear Information System (INIS)

Schreiber, H.J.; Piana, M.; Moussalli, G.; Saukkonen, H.

2000-01-01

Since computerized data processing was introduced to Safeguards at large bulk handling facilities, a large number of individual software applications have been developed for nuclear material Safeguards implementation. Facility inventory and flow data are provided in computerized format for performing stratification, sample size calculation and selection of samples for destructive and non-destructive assay. Data is collected from nuclear measurement systems running in attended, unattended mode and more recently from remote monitoring systems controlled. Data sets from various sources have to be evaluated for Safeguards purposes, such as raw data, processed data and conclusions drawn from data evaluation results. They are reported in computerized format at the International Atomic Energy Agency headquarters and feedback from the Agency's mainframe computer system is used to prepare and support Safeguards inspection activities. The integration of all such data originating from various sources cannot be ensured without the existence of a common data format and a database system. This paper describes the fundamental relations between data streams, individual data processing tools, data evaluation results and requirements for an integrated software solution to facilitate nuclear material Safeguards at a bulk handling facility. The paper also explains the basis for designing a software package to manage data streams from various data sources and for incorporating diverse data processing tools that until now have been used independently from each other and under different computer operating systems. (author)

Software design practice using two SCADA software packages

DEFF Research Database (Denmark)

Basse, K.P.; Christensen, Georg Kronborg; Frederiksen, P. K.

1996-01-01

Typical software development for manufacturing control is done either by specialists with consideral real-time programming experience or done by the adaptation of standard software packages for manufacturing control. After investigation and test of two commercial software packages: "InTouch" and ......Touch" and "Fix", it is argued, that a more efficient software solution can be achieved by utilising an integrated specification for SCADA and PLC-programming. Experiences gained from process control is planned investigated for descrete parts manufacturing....

equate: An R Package for Observed-Score Linking and Equating

Directory of Open Access Journals (Sweden)

Anthony D. Albano

2016-10-01

Full Text Available The R package equate contains functions for observed-score linking and equating under single-group, equivalent-groups, and nonequivalent-groups with anchor test(s designs. This paper introduces these designs and provides an overview of observed-score equating with details about each of the supported methods. Examples demonstrate the basic functionality of the equate package.

Fair Package Assignment

Science.gov (United States)

Lahaie, Sébastien; Parkes, David C.

We consider the problem of fair allocation in the package assignment model, where a set of indivisible items, held by single seller, must be efficiently allocated to agents with quasi-linear utilities. A fair assignment is one that is efficient and envy-free. We consider a model where bidders have superadditive valuations, meaning that items are pure complements. Our central result is that core outcomes are fair and even coalition-fair over this domain, while fair distributions may not even exist for general valuations. Of relevance to auction design, we also establish that the core is equivalent to the set of anonymous-price competitive equilibria, and that superadditive valuations are a maximal domain that guarantees the existence of anonymous-price competitive equilibrium. Our results are analogs of core equivalence results for linear prices in the standard assignment model, and for nonlinear, non-anonymous prices in the package assignment model with general valuations.

Safety Evaluation for Packaging for the N Reactor/single pass reactor fuel characterization shipments

International Nuclear Information System (INIS)

Stevens, P.F.

1994-01-01

The purpose of this Safety Evaluation for Packaging (SEP) is to authorize the ChemNuclear CNS 1-13G packaging to ship samples of irradiated fuel elements from the 100 K East and 100 K West basins to the Postirradiation Testing Laboratory (PTL) in support of the spent nuclear fuel characterization effort. It also authorizes the return of the fuel element samples to the 100 K East facility using the same packaging. The CNS 1-13G cask has been-chosen to transport the fuel because it has a Certificate of Compliance (CoC) issued by the US Nuclear Regulatory Commission (NRC) for transporting irradiated oxide and metal fuel in commerce. It is capable of being loaded and offloaded underwater and may be shipped with water in the payload compartment

Integration of Single-Photon Sources and Detectors on GaAs

Directory of Open Access Journals (Sweden)

Giulia Enrica Digeronimo

2016-10-01

Full Text Available Quantum photonic integrated circuits (QPICs on a GaAs platform allow the generation, manipulation, routing, and detection of non-classical states of light, which could pave the way for quantum information processing based on photons. In this article, the prototype of a multi-functional QPIC is presented together with our recent achievements in terms of nanofabrication and integration of each component of the circuit. Photons are generated by excited InAs quantum dots (QDs and routed through ridge waveguides towards photonic crystal cavities acting as filters. The filters with a transmission of 20% and free spectral range ≥66 nm are able to select a single excitonic line out of the complex emission spectra of the QDs. The QD luminescence can be measured by on-chip superconducting single photon detectors made of niobium nitride (NbN nanowires patterned on top of a suspended nanobeam, reaching a device quantum efficiency up to 28%. Moreover, two electrically independent detectors are integrated on top of the same nanobeam, resulting in a very compact autocorrelator for on-chip g(2(τ measurements.

An Integrable SIW Phase Shifter in a Partially Magnetized Ferrite LTCC Package

KAUST Repository

Nafe, Ahmed

2015-06-09

There is a growing need for small size integrable phased antenna arrays for emerging satellite communications on-the-move applications. Traditional ferrite-based phase shifters are generally bulky due to the need of electromagnets for biasing, yielding them unsuitable for this kind of application. In this paper, a novel compact light-weight substrate integrated waveguide (SIW) based phase shifter realized in a multi-layer ferrite low-temperature co-fired ceramic package with embedded bias windings is reported. By using embedded windings and operating the material in a partially magnetized state, the required bias magnetic field could be significantly reduced from typically about 1000 Oe to less than 50 Oe. Moreover, the presented phase shifter has two modes of operations corresponding to two different biasing scenarios of the SIW, namely, symmetric and anti-symmetric bias. Under anti-symmetric bias, the phase shifter can achieve high nonreciprocal phase shift, whereas under symmetric bias, the phase shift is reciprocal, but the available phase shift is less than the anti-symmetric case. The fabricated prototype operates in the 11.5-13.5-GHz range and has a peak figure of merit (phase shift per decibel of loss) of 102°/dB and a maximum phase shift per unit length of 153°/cm, which are more than five times the previously reported figures for this technology. Due to the use of embedded windings, the presented phase shifter offers a huge size reduction from the order of cm3 to mm3, making it particularly useful for mobile phased-array applications. © 2015 IEEE.

Single-cell axotomy of cultured hippocampal neurons integrated in neuronal circuits.

Science.gov (United States)

Gomis-Rüth, Susana; Stiess, Michael; Wierenga, Corette J; Meyn, Liane; Bradke, Frank

2014-05-01

An understanding of the molecular mechanisms of axon regeneration after injury is key for the development of potential therapies. Single-cell axotomy of dissociated neurons enables the study of the intrinsic regenerative capacities of injured axons. This protocol describes how to perform single-cell axotomy on dissociated hippocampal neurons containing synapses. Furthermore, to axotomize hippocampal neurons integrated in neuronal circuits, we describe how to set up coculture with a few fluorescently labeled neurons. This approach allows axotomy of single cells in a complex neuronal network and the observation of morphological and molecular changes during axon regeneration. Thus, single-cell axotomy of mature neurons is a valuable tool for gaining insights into cell intrinsic axon regeneration and the plasticity of neuronal polarity of mature neurons. Dissociation of the hippocampus and plating of hippocampal neurons takes ∼2 h. Neurons are then left to grow for 2 weeks, during which time they integrate into neuronal circuits. Subsequent axotomy takes 10 min per neuron and further imaging takes 10 min per neuron.

The drift-flux correlation package MDS

International Nuclear Information System (INIS)

Hoeld, A.

2001-01-01

Based on the SONNENBURG drift-flux correlation, developed at GRS/Garching (Germany), a comprehensive drift-flux correlation package (MDS) has been established. Its aim is to support thermal-hydraulic mixture-fluid models, models being used for the simulation of the steady state and transient behaviour of characteristic thermal-hydraulic parameters of single- or two-phase fluids flowing along coolant channels of different types (being, e.g., parts of NPP-s, steam generators etc.). The characteristic properties of this package with respect to the behaviour at co- and counter-current flow, its inverse solutions needed for steady state simulations, its behaviour when approaching the lower or upper boundary of a two-phase region, its verification and behaviour with respect to other correlations will be discussed. An adequate driver code, MDSDRI, has been established too, allowing to test the package very thoroughly out of the complex thermal-hydraulic codes. (author)

The drift-flux correlation package MDS

Energy Technology Data Exchange (ETDEWEB)

Hoeld, A. [Bernaysstr. 16A, Munich, F.R. (Germany)

2001-07-01

Based on the SONNENBURG drift-flux correlation, developed at GRS/Garching (Germany), a comprehensive drift-flux correlation package (MDS) has been established. Its aim is to support thermal-hydraulic mixture-fluid models, models being used for the simulation of the steady state and transient behaviour of characteristic thermal-hydraulic parameters of single- or two-phase fluids flowing along coolant channels of different types (being, e.g., parts of NPP-s, steam generators etc.). The characteristic properties of this package with respect to the behaviour at co- and counter-current flow, its inverse solutions needed for steady state simulations, its behaviour when approaching the lower or upper boundary of a two-phase region, its verification and behaviour with respect to other correlations will be discussed. An adequate driver code, MDSDRI, has been established too, allowing to test the package very thoroughly out of the complex thermal-hydraulic codes. (author)

LEVERAGING AGING MATERIALS DATA TO SUPPORT EXTENSION OF TRANSPORTATION SHIPPING PACKAGES SERVICE LIFE

Energy Technology Data Exchange (ETDEWEB)

Dunn, K. [Savannah River National Laboratory; Bellamy, S. [Savannah River National Laboratory; Daugherty, W. [Savannah River National Laboratory; Sindelar, R. [Savannah River National Laboratory; Skidmore, E. [Savannah River National Laboratory

2013-08-18

Nuclear material inventories are increasingly being transferred to interim storage locations where they may reside for extended periods of time. Use of a shipping package to store nuclear materials after the transfer has become more common for a variety of reasons. Shipping packages are robust and have a qualified pedigree for performance in normal operation and accident conditions but are only certified over an approved transportation window. The continued use of shipping packages to contain nuclear material during interim storage will result in reduced overall costs and reduced exposure to workers. However, the shipping package materials of construction must maintain integrity as specified by the safety basis of the storage facility throughout the storage period, which is typically well beyond the certified transportation window. In many ways, the certification processes required for interim storage of nuclear materials in shipping packages is similar to life extension programs required for dry cask storage systems for commercial nuclear fuels. The storage of spent nuclear fuel in dry cask storage systems is federally-regulated, and over 1500 individual dry casks have been in successful service up to 20 years in the US. The uncertainty in final disposition will likely require extended storage of this fuel well beyond initial license periods and perhaps multiple re-licenses may be needed. Thus, both the shipping packages and the dry cask storage systems require materials integrity assessments and assurance of continued satisfactory materials performance over times not considered in the original evaluation processes. Test programs for the shipping packages have been established to obtain aging data on materials of construction to demonstrate continued system integrity. The collective data may be coupled with similar data for the dry cask storage systems and used to support extending the service life of shipping packages in both transportation and storage.

Food packaging materials and radiation processing of food: a brief review

International Nuclear Information System (INIS)

Chuaqui-Offermanns, N.

1989-01-01

Food is usually packaged to prevent microbial contamination and spoilage. Ionizing radiation can be applied to food-packaging materials in two ways: (i) sterilization of packaging materials for aseptic packaging, and (ii) radiation processing of prepackaged food. In aseptic packaging, a sterile package is filled with a sterile product in a microbiologically controlled environment. In irradiation of prepackaged food, the food and the packaging material are irradiated simultaneously. For both applications, the radiation stability of the packaging material is a key consideration if the technology is to be used successfully. To demonstrate the radiation stability of the packaging material, it must be shown that irradiation does not significantly alter the physical and chemical properties of the material. The irradiated material must protect the food from environmental contamination while maintaining its organoleptic and toxicological properties. Single-layer plastics cannot meet the requirements of either application. Multilayered structures produced by coextrusion would likely satisfy the demands of radiation processing prepackaged food. In aseptic packaging, the package is irradiated prior to filling, making demands on toxicological safety less stringent. Therefore, multilayered structures produced by coextrusion, lamination or co-injection moulding could satisfy the requirements. (author)

How to evaluate multichannel communication packages: a case study on mortgage information

NARCIS (Netherlands)

Herijgers, M.L.C.; Pander Maat, H.L.W.

2015-01-01

Complex decision-making is often supported not by single messages but by multichannel communication packages that need to be evaluated in their own right. The purpose of this paper is to present a new analytic approach to this package evaluation task combining textual analysis, functionalanalysis

XLOOPS - a package calculating one- and two-loop diagrams

International Nuclear Information System (INIS)

Bruecher, L.

1997-01-01

A program package for calculating massive one- and two-loop diagrams is introduced. It consists of five parts: - a graphical user interface, - routines for generating diagrams from particle input, - procedures for calculating one-loop integrals both analytically and numerically, - routines for massive two-loop integrals, - programs for numerical integration of two-loop diagrams. Here the graphical user interface and the text interface to Maple are presented. (orig.)

Examination of Shipping Packages 9975-02694 and 9975-02729

Energy Technology Data Exchange (ETDEWEB)

Daugherty, W. [Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL)

2016-11-09

SRNL has assisted in the examination of two 9975 shipping packages (9975-02694 and 9975-02729) following their use for storage of nuclear material in K-Area Complex (KAC). Both of these were targeted for examination because they were exposed to water from a leaking expansion joint during storage. When first opened in KAC, the axial gap was found to be in excess of the 1 inch maximum criterion, signaling the potential for degradation of the fiberboard overpack and drum. Within each package the highest fiberboard moisture levels were observed in the bottom layers, but no mold was observed in either package. The fiberboard in each package appeared to retain good integrity consistent with non-degraded material. Minor corrosion was also observed on these drums along the lower stitch welds and on several closure bolts.

Integrated LTCC Pressure/Flow/Temperature Multisensor for Compressed Air Diagnostics†

Directory of Open Access Journals (Sweden)

Nicolas Craquelin

2010-12-01

Full Text Available We present a multisensor designed for industrial compressed air diagnostics and combining the measurement of pressure, flow, and temperature, integrated with the corresponding signal conditioning electronics in a single low-temperature co-fired ceramic (LTCC package. The developed sensor may be soldered onto an integrated electro-fluidic platform by using standard surface mount device (SMD technology, e.g., as a standard electronic component would be on a printed circuit board, obviating the need for both wires and tubes and thus paving the road towards low-cost integrated electro-fluidic systems. Several performance aspects of this device are presented and discussed, together with electronics design issues.

Integrated LTCC pressure/flow/temperature multisensor for compressed air diagnostics.

Science.gov (United States)

Fournier, Yannick; Maeder, Thomas; Boutinard-Rouelle, Grégoire; Barras, Aurélie; Craquelin, Nicolas; Ryser, Peter

2010-01-01

We present a multisensor designed for industrial compressed air diagnostics and combining the measurement of pressure, flow, and temperature, integrated with the corresponding signal conditioning electronics in a single low-temperature co-fired ceramic (LTCC) package. The developed sensor may be soldered onto an integrated electro-fluidic platform by using standard surface mount device (SMD) technology, e.g., as a standard electronic component would be on a printed circuit board, obviating the need for both wires and tubes and thus paving the road towards low-cost integrated electro-fluidic systems. Several performance aspects of this device are presented and discussed, together with electronics design issues.

Integrated LTCC Pressure/Flow/Temperature Multisensor for Compressed Air Diagnostics†

Science.gov (United States)

Fournier, Yannick; Maeder, Thomas; Boutinard-Rouelle, Grégoire; Barras, Aurélie; Craquelin, Nicolas; Ryser, Peter

2010-01-01

We present a multisensor designed for industrial compressed air diagnostics and combining the measurement of pressure, flow, and temperature, integrated with the corresponding signal conditioning electronics in a single low-temperature co-fired ceramic (LTCC) package. The developed sensor may be soldered onto an integrated electro-fluidic platform by using standard surface mount device (SMD) technology, e.g., as a standard electronic component would be on a printed circuit board, obviating the need for both wires and tubes and thus paving the road towards low-cost integrated electro-fluidic systems. Several performance aspects of this device are presented and discussed, together with electronics design issues. PMID:22163518

Experimental protocol for packaging and encrypting multiple data

International Nuclear Information System (INIS)

Barrera, John Fredy; Trejos, Sorayda; Tebaldi, Myrian; Torroba, Roberto

2013-01-01

We present a novel single optical packaging and encryption (SOPE) procedure for multiple inputs. This procedure is based on a merging of a 2f scheme with a digital holographic technique to achieve efficient handling of multiple data. Through the 2f system with a random phase mask attached in its input plane, and the holographic technique, we obtain each processed input. A posteriori filtering and repositioning protocol on each hologram followed by an addition of all processed data, allows storing these data to form a single package. The final package is digitally multiplied by a second random phase mask acting as an encryption mask. In this way, the final user receives only one encrypted information unit and a single key, instead of a conventional multiple-image collecting method and several keys. Processing of individual images is cast into an optimization problem. The proposed optimization aims to simplify the handling and recovery of images while packing all of them into a single unit. The decoding process does not have the usual cross-talk or noise problems involved in other methods, as filtering and repositioning precedes the encryption step. All data are recovered in just one step at the same time by applying a simple Fourier transform operation and the decoding key. The proposed protocol takes advantage of optical processing and the versatility of the digital format. Experiments have been conducted using a Mach–Zehnder interferometer. An application is subsequently demonstrated to illustrate the feasibility of the SOPE procedure. (paper)

Eddylicious: A Python package for turbulent inflow generation

Science.gov (United States)

Mukha, Timofey; Liefvendahl, Mattias

2018-01-01

A Python package for generating inflow for scale-resolving computer simulations of turbulent flow is presented. The purpose of the package is to unite existing inflow generation methods in a single code-base and make them accessible to users of various Computational Fluid Dynamics (CFD) solvers. The currently existing functionality consists of an accurate inflow generation method suitable for flows with a turbulent boundary layer inflow and input/output routines for coupling with the open-source CFD solver OpenFOAM.

Pre-asymptotic behavior of single-particle overlap integrals of non-Borromean two-neutron halos

International Nuclear Information System (INIS)

Timofeyuk, N.K.; Tostevin, J.A.; Blokhintsev, L.D.

2003-01-01

For non-Borromean two-neutron halo nuclei, modifications to the behavior of single-particle overlap integrals will arise due to the correlations of the two interacting nucleons in the halo. An additional contribution to the overlap integral can be obtained using the Feynman diagram approach. This additional term is modeled using a simple local potential model. We show that these modifications may play a role in detailed interpretations of experimental results from single-nucleon knockout, transfer, and other reactions that probe the single-nucleon overlap functions

NOVA integrated alignment/diagnostic sensors

International Nuclear Information System (INIS)

1978-01-01

Under Contract 3772003 to the Lawrence Livermore Laboratory, Aerojet ElectroSystems Company has investigated a number of alignment system design topics for the NOVA and SHIVA upgrade lasers. Prior reports dealt with the Main Beam Alignment System, and with Multipass Amplifier Alignment Concepts. This report, which completes the contract, examines ways in which the Return Beam Diagnostic (RBD) package and Incident Beam Diagnostic (IBD) packages may be reconfigured to a more integrated package. In particular, the report shows that the RBD optics may be directly integrated in the Pointing Focus and Centering (PFC) sensor, and that the IBD optics may use the same basic common configuration as the PFC/RBD package

Destructive examination of shipping package 9975-02101

Energy Technology Data Exchange (ETDEWEB)

Daugherty, W. L. [Savannah River Site (SRS), Aiken, SC (United States)

2016-05-01

Destructive and non-destructive examinations have been performed on the components of shipping package 9975-02101 as part of the comprehensive Model 9975 package surveillance program. This package is one of ten high-wattage packages that were selected for field surveillance in FY15, and was identified to contain several non-conforming conditions. Most of these conditions (mold, stains, drum corrosion, calculated fiberboard dimensions and fiberboard damage) relate to the accumulation of water in the outer and lower portions of the cane fiberboard assembly. In the short term, this causes local but reversible changes in the fiberboard properties. Long-term effects can include the permanent loss of fiberboard properties (thus far observed only in the bottom fiberboard layers) and reduced drum integrity due to corrosion. The observed conditions must be fully evaluated by KAC to ensure the safety function of the package is being maintained. Three of the other nine FY15 high-wattage packages examined in the K-Area Complex showed similar behavior. Corrosion of the overpack drum has been seen primarily in those packages with relatively severe fiberboard degradation. Visual examination of the drums in storage for external corrosion should be considered as a screening tool to identify additional packages with potential fiberboard degradation. Where overpack drum corrosion has been observed, it is typically heaviest adjacent to the stitch welds along the bottom edge. It is possible that changes to the stitch weld design would reduce the degree of corrosion in this area, but would not eliminate it. Several factors can contribute to the concentration of moisture in the fiberboard, including higher than average initial moisture content, higher internal temperature (due to internal heat load and placement with the array of packages), and the creation of additional moisture as the fiberboard begins to degrade.

Qualification of A type package for transport and final disposal of radium-226 needles

International Nuclear Information System (INIS)

Rodrigues, D.L.; Vicente, R.

1988-01-01

One of the objectives of the Fuel Cycle Department is to develop packages for radioactive wastes, including discarded industrial and radiotherapy sources. This paper describes the work undertaken to qualify a package for transport and final disposal of radium needles, and gives a detailed description of the tests carried out to verify shielding integrity and contaiment system before and after free drop test according to IAEA recomendations for type A, non-especial form packages. Shielding integrity was verified by gamma field scanning over the package surface, using a Geiger-Muller detector and a 60 Co gamma source. Containment system was verified by pressurizing the specimen with helium and by searching for leaks a He-leak detector, with sensitivity of 3 x 10 -10 atm x cm 3 /s, air equivalent. The package is described in detail along with the apparatus for the safe handling and packing of the radium needles. (author) [pt

Documentation package for the RFID temperature monitoring system (Model 9977 packages at NTS)

International Nuclear Information System (INIS)

Chen, K.; Tsai, H.

2009-01-01

The technical basis for extending the Model 9977 shipping package periodic maintenance beyond the one-year interval to a maximum of five years is based on the performance of the O-ring seals and the environmental conditions. The DOE Packaging Certification Program (PCP) has tasked Argonne National Laboratory to develop a Radio-Frequency Identification (RFID) temperature monitoring system for use by the facility personnel at DAF/NTS. The RFID temperature monitoring system, depicted in the figure below, consists of the Mk-1 RFId tags, a reader, and a control computer mounted on a mobile platform that can operate as a stand-alone system, or it can be connected to the local IT network. As part of the Conditions of Approval of the CoC, the user must complete the prescribed training to become qualified and be certified for operation of the RFID temperature monitoring system. The training course will be administered by Argonne National Laboratory on behalf of the Headquarters Certifying Official. This is a complete documentation package for the RFID temperature monitoring system of the Model 9977 packagings at NTS. The documentation package will be used for training and certification. The table of contents are: Acceptance Testing Procedure of MK-1 RFID Tags for DOE/EM Nuclear Materials Management Applications; Acceptance Testing Result of MK-1 RFID Tags for DOE/EM Nuclear Materials Management Applications; Performance Test of the Single Bolt Seal Sensor for the Model 9977 Packaging; Calibration of Built-in Thermistors in RFID Tags for Nevada Test Site; Results of Calibration of Built-in Thermistors in RFID Tags; Results of Thermal Calibration of Second Batch of MK-I RFID Tags; Procedure for Installing and Removing MK-1 RFID Tag on Model 9977 Drum; User Guide for RFID Reader and Software for Temperature Monitoring of Model 9977 Drums at NTS; Software Quality Assurance Plan (SQAP) for the ARG-US System; Quality Category for the RFID Temperature Monitoring System; The

Report revision master: an energy analysis of consumer products packaging

Energy Technology Data Exchange (ETDEWEB)

1980-03-01

This report serves as a foundation for quantifying the potential for energy conservation in the Canadian consumer products packaging sector. Investigation was made of energy consumption, waste management, and energy conservation potential in the various stages of the packaging and consumption process: raw material acquisition, material and packaging manufacture, package filling and distribution, consumer use, post-consumption options (energy recovery, disposal, recycling), and cleaning and transportation (if applicable) between each stage. The food and beverage industry was singled out as the most important sector because of its large consumption of packaging. Significant opportunities for energy conservation were found, although any savings accomplished through packaging changes appear to be difficult to implement. Packaging energy savings seem to be able to be achieved only through a product-by-product, industry-by-industry initiative by means of product and package standardization. An efficient example of this is the milk distribution system, where refillable plastic jugs require only 1.4 MBtu per 3000 quarts delivered (as compared with, for example, 68.9 MBtu for disposable aluminium soft drink cans). Other conclusions are made concerning the optimization of packaging energy, with respect to types of packaging, energy requirements related to use of packaged products, impact of government policies and of retailing techiques, consumer lifestyles, and the like. 95 refs., 3 figs., 54 tabs.

Fifth Single-Shell Tank Integrity Project Expert Panel Meeting August 28-29, 2014

Energy Technology Data Exchange (ETDEWEB)

Martin, Todd M. [Washington River Protection Solutions, LLC, Richland, WA (United States; Gunter, Jason R. [Washington River Protection Solutions, LLC, Richland, WA (United States); Boomer, Kayle D. [Washington River Protection Solutions, LLC, Richland, WA (United States)

2015-01-07

On August 28th and 29th, 2014 the Single-Shell Tank Integrity Project (SSTIP) Expert Panel (Panel) convened in Richland, Washington. This was the Panel’s first meeting since 2011 and, as a result, was focused primarily on updating the Panel on progress in response to the past recommendations (Single-Shell Tank Integrity Expert Panel Report, RPP-RPT-45921, Rev 0, May 2010). This letter documents the Panel’s discussions and feedback on Phase I activities and results.

A packaging solution utilizing adhesive-filled TSVs and flip–chip methods

International Nuclear Information System (INIS)

Benfield, David; Moussa, Walied A; Lou, Edmond

2012-01-01

A compact packaging solution for microelectromechanical systems (MEMS) devices is presented. The 3D-integrated packaging solution was designed for the instrumentation of a spinal screw with a wireless sensor array, but may be adapted for a variety of applications. To achieve the compact package size, an unobtrusive through-silicon via (TSV) design was added to the microfabrication process flow for the MEMS sensor. These TSVs allowed vertical integration of the MEMS devices onto flexible printed circuit boards (FPCBs) using a flip–chip system. Ohmic connections with resistance values below 1 Ω have been achieved for 100 µm TSVs in 300 and 500 µm substrates. This paper describes the design and microfabrication process flow for the TSVs, and provides details on the flip–chip techniques used to electrically and structurally connect the MEMS devices to the FPCBs. (paper)

A 4 × 2 switch matrix in QFN24 package for 0.5–3 GHz application

International Nuclear Information System (INIS)

Liu Yuzhe; Mu Pengfei; Gong Renjie; Wan Jing; Zhang Yulin; Yan Yuepeng

2014-01-01

This paper presents a 4 × 2 switching matrix implemented in the Win 0.5 μm GaAs pseudomorphic high electron mobility transistor process, it covers the 0.5–3 GHz frequency range. The switch matrix is composed of 4 SPDT switch whose two output ports can simultaneously select the input port and a 4 to 8 bit digital decoder, both the radio frequency (RF) part and the digital part are integrated into one single chip. The chip is packaged in a low cost QFN24 plastic package. On chip shunt, capacitors at the input ports are taken to compensate for the bonding wire inductance effect. The designed switch matrix shows a good measured performance: the insertion loss is less than 5.5 dB, the isolation is no worse than 30 dB, the return loss of input ports and output ports is better than −10 dB, the input 1 dB compression point is better than 25.6 dBm, and the OIP3 is better than 37 dBm. The chip size of the switch matrix is only 1.45 × 1.45 mm 2 . (semiconductor integrated circuits)

The CASA Software Package

Science.gov (United States)

Petry, Dirk

2018-03-01

CASA is the standard science data analysis package for ALMA and VLA but it can also be used for the analysis of data from other observatories. In this talk, I will give an overview of the structure and features of CASA, who develops it, and the present status and plans, and then show typical analysis workflows for ALMA data with special emphasis on the handling of single dish data and its combination with interferometric data.

Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy

Science.gov (United States)

Schröder, H.; Neitz, M.; Schneider-Ramelow, M.

2018-02-01

Due to its optical transparency and superior dielectric properties glass is regarded as a promising candidate for advanced applications as active photonic interposer for mid-board-optics and optical PCB waveguide integration. The concepts for multi-mode and single-mode photonic system integration are discussed and related demonstration project results will be presented. A hybrid integrated photonic glass body interposer with integrated optical lenses for multi-mode data communication wavelength of 850 nm have been realized. The paper summarizes process developments which allow cost efficient metallization of TGV. Electro-optical elements like photodiodes and VCSELs can be directly flip-chip mounted on the glass substrate according to the desired lens positions. Furthermore results for a silicon photonic based single-mode active interposer integration onto a single mode glass made EOCB will be compared in terms of packaging challenges. The board level integration strategy for both of these technological approaches and general next generation board level integration concepts for photonic interposer will be introductorily discussed.

Gain Enhanced LTCC System-on-Package for UMRR Applications

KAUST Repository

Shamim, Atif; Ghaffar, Farhan Abdul; Khalid, Muhammad Umair; Salama, Khaled N.

2014-01-01

An apparatus, system, and method for Gain Enhanced LTCC System-on-Package radar sensor. The sensor includes a substrate and an integrated circuit coupled to the substrate, where the integrated circuit is configured to transmit and receive radio frequency (RF) signals. An antenna may be coupled to the integrated circuit and a lens may be coupled to the antenna. The lens may be configured to enhance the gain of the sensor.

Gain Enhanced LTCC System-on-Package for UMRR Applications

KAUST Repository

Shamim, Atif

2014-10-14

An apparatus, system, and method for Gain Enhanced LTCC System-on-Package radar sensor. The sensor includes a substrate and an integrated circuit coupled to the substrate, where the integrated circuit is configured to transmit and receive radio frequency (RF) signals. An antenna may be coupled to the integrated circuit and a lens may be coupled to the antenna. The lens may be configured to enhance the gain of the sensor.

Initiation and termination of the bacteriophage phi X174 rolling circle DNA replication in vivo: packaging of plasmid single-stranded DNA into bacteriophage phi X174 coats

NARCIS (Netherlands)

van der Ende, A.; Teertstra, R.; Weisbeek, P. J.

1982-01-01

The bacteriophage phi X174 viral (+) origin when inserted in a plasmid can interact in vivo with the A protein produced by infecting phi X174 phages. A consequence of this interaction is packaging of single-stranded plasmid DNA into preformed phage coats resulting in infective particles (1). This

Quality control and authentication of packaged integrated circuits using enhanced-spatial-resolution terahertz time-domain spectroscopy and imaging

Science.gov (United States)

Ahi, Kiarash; Shahbazmohamadi, Sina; Asadizanjani, Navid

2018-05-01

In this paper, a comprehensive set of techniques for quality control and authentication of packaged integrated circuits (IC) using terahertz (THz) time-domain spectroscopy (TDS) is developed. By material characterization, the presence of unexpected materials in counterfeit components is revealed. Blacktopping layers are detected using THz time-of-flight tomography, and thickness of hidden layers is measured. Sanded and contaminated components are detected by THz reflection-mode imaging. Differences between inside structures of counterfeit and authentic components are revealed through developing THz transmission imaging. For enabling accurate measurement of features by THz transmission imaging, a novel resolution enhancement technique (RET) has been developed. This RET is based on deconvolution of the THz image and the THz point spread function (PSF). The THz PSF is mathematically modeled through incorporating the spectrum of the THz imaging system, the axis of propagation of the beam, and the intensity extinction coefficient of the object into a Gaussian beam distribution. As a result of implementing this RET, the accuracy of the measurements on THz images has been improved from 2.4 mm to 0.1 mm and bond wires as small as 550 μm inside the packaging of the ICs are imaged.

Thermal performance of a depleted uranium shielded storage, transportation, and disposal package

International Nuclear Information System (INIS)

Wix, S.D.; Yoshimura, H.R.

1994-01-01

The US Department of Energy (DOE) is responsible for management and disposal of large quantities of depleted uranium (DU) in the DOE complex. Viable economic options for the use and eventual disposal of the material are needed. One possible option is the use of DU as shielding material for vitrified Defense High-Level Waste (DHLW) storage, transportation, and disposal packages. Use of DU as a shielding material provides the potential benefit of disposing of significant quantities of DU during the DHLW storage and disposal process. Two DU package concepts have been developed by Sandia National Laboratories. The first concept is the Storage/Disposal plus Transportation (S/D+T) package. The S/D+T package consists of two major components: a storage/disposal (S/D) container and a transportation overpack. The second concept is the S/D/T package which is an integral storage, transportation, and disposal package. The package concept considered in this analysis is the S/D+T package with seven DHLW waste canisters

Intercomparison of alpha particle spectrometry software packages

International Nuclear Information System (INIS)

1999-08-01

Software has reached an important level as the 'logical controller' at different levels, from a single instrument to an entire computer-controlled experiment. This is also the case for software packages in nuclear instruments and experiments. In particular, because of the range of applications of alpha-particle spectrometry, software packages in this field are often used. It is the aim of this intercomparison to test and describe the abilities of four such software packages. The main objectives of the intercomparison were the ability of the programs to determine the peak areas and the peak area uncertainties, and the statistical control and stability of reported results. In this report, the task, methods and results of the intercomparison are presented in order to asist the potential users of such software and to stimulate the development of even better alpha-particle spectrum analysis software

Packaging fluency

DEFF Research Database (Denmark)

Mocanu, Ana; Chrysochou, Polymeros; Bogomolova, Svetlana

2011-01-01

Research on packaging stresses the need for packaging design to read easily, presuming fast and accurate processing of product-related information. In this paper we define this property of packaging as “packaging fluency”. Based on the existing marketing and cognitive psychology literature on pac...

R functions development for stockPortfolio package

OpenAIRE

Luo, Rui

2013-01-01

Modern portfolio theory is a statistical framework to allocate investment assets properly, with the aim of reducing risk by diversification. In the past decades, a variety of index and group models (with different covariance assumption) have been proposed to optimize the portfolio, including Single Index Model, Constant Correlation Model, Multi-Group Model, and Multi-Index Model. An R package "stockPortfolio" is developed by Drs. Christou and Diez, and fully implemented Single Index Model, Co...

Interconnections and market integration in the Irish Single Electricity Market

International Nuclear Information System (INIS)

Nepal, Rabindra; Jamasb, Tooraj

2012-01-01

Interconnections can be an effective way to increase competition and improve market integration in concentrated wholesale electricity markets with limited number of participants. This paper examines the potential for interconnections and increasing market integration in the Irish Single Electricity Market (SEM). We use a time-varying Kalman filter technique to assess the degree of market integration between SEM and other large, mature and interconnected wholesale electricity markets in Europe including Great Britain (GB). The results indicate no market integration between SEM and other European markets except for Elspot and GB. We show that the current state of market integration between SEM and GB is just 17% indicating potential to improve market integration via increased interconnector capacity. The results indicate that liquidity of wholesale markets might be a crucial factor in the market integration process while our results remain inconclusive in determining whether increased trade of renewables can improve market integration. - Highlights: ► We assess the degree of market integration between SEM and other EU electricity markets. ► Our results indicate no market integration between SEM and other European markets except for Elspot and GB. ► We show that the current state of market integration between SEM and GB is just 17%.

Review of DOE waste package program. Subtask 1.1 - National Waste Package Program, October 1983-March 1984. Volume 6

International Nuclear Information System (INIS)

Soo, P.

1985-03-01

The present effort is part of an ongoing task to review the national high-level waste package effort. It includes evaluation of reference waste form, container, and packing material components with respect to determining how they may contribute to the containment and controlled release of radionuclides after waste packages have been emplaced in salt, basalt, tuff, and granite repositories. In the current Biannual Report a review of progress in the new crystalline repository (granite) program is described. Other foreign data for this host rock have also been outlined where relevant. The use of crushed salt, and bentonite- and zeolite-containing packing materials is discussed. The effects of temperature and gamma irradiation are shown to be important with respect to defining the localized environmental conditions around a waste package and the long-term integrity of the packing

Packaging's Contribution for the Effectiveness of the Space Station's Food Service Operation

Science.gov (United States)

Rausch, B. A.

1985-01-01

Storage limitations will have a major effect on space station food service. For example: foods with low bulk density such as ice cream, bread, cake, standard type potato chips and other low density snacks, flaked cereals, etc., will exacerbate the problem of space limitations; package containers are inherently volume consuming and refuse creating; and the useful observation that the optimum package is no package at all leads to the tentative conclusion that the least amount of packaging per unit of food, consistent with storage, aesthetics, preservation, cleanliness, cost and disposal criteria, is the most practical food package for the space station. A series of trade offs may have to be made to arrive at the most appropriate package design for a particular type of food taking all the criteria into account. Some of these trade offs are: single serve vs. bulk; conventional oven vs. microwave oven; nonmetallic aseptically vs. non-aseptically packaged foods; and comparison of aseptic vs. nonaseptic food packages. The advantages and disadvantages are discussed.

A G-C-rich palindromic structural motif and a stretch of single-stranded purines are required for optimal packaging of Mason-Pfizer monkey virus (MPMV) genomic RNA.

Science.gov (United States)

Jaballah, Soumeya Ali; Aktar, Suriya J; Ali, Jahabar; Phillip, Pretty Susan; Al Dhaheri, Noura Salem; Jabeen, Aayesha; Rizvi, Tahir A

2010-09-03

During retroviral RNA packaging, two copies of genomic RNA are preferentially packaged into the budding virus particles whereas the spliced viral RNAs and the cellular RNAs are excluded during this process. Specificity towards retroviral RNA packaging is dependent upon sequences at the 5' end of the viral genome, which at times extend into Gag sequences. It has earlier been suggested that the Mason-Pfizer monkey virus (MPMV) contains packaging sequences within the 5' untranslated region (UTR) and Gag. These studies have also suggested that the packaging determinants of MPMV that lie in the UTR are bipartite and are divided into two regions both upstream and downstream of the major splice donor. However, the precise boundaries of these discontinuous regions within the UTR and the role of the intervening sequences between these dipartite sequences towards MPMV packaging have not been investigated. Employing a combination of genetic and structural prediction analyses, we have shown that region "A", immediately downstream of the primer binding site, is composed of 50 nt, whereas region "B" is composed of the last 23 nt of UTR, and the intervening 55 nt between these two discontinuous regions do not contribute towards MPMV RNA packaging. In addition, we have identified a 14-nt G-C-rich palindromic sequence (with 100% autocomplementarity) within region A that has been predicted to fold into a structural motif and is essential for optimal MPMV RNA packaging. Furthermore, we have also identified a stretch of single-stranded purines (ssPurines) within the UTR and 8 nt of these ssPurines are duplicated in region B. The native ssPurines or its repeat in region B when predicted to refold as ssPurines has been shown to be essential for RNA packaging, possibly functioning as a potential nucleocapsid binding site. Findings from this study should enhance our understanding of the steps involved in MPMV replication including RNA encapsidation process. Copyright (c) 2010 Elsevier Ltd

Advanced Space Suit Portable Life Support Subsystem Packaging Design

Science.gov (United States)

Howe, Robert; Diep, Chuong; Barnett, Bob; Thomas, Gretchen; Rouen, Michael; Kobus, Jack

2006-01-01

This paper discusses the Portable Life Support Subsystem (PLSS) packaging design work done by the NASA and Hamilton Sundstrand in support of the 3 future space missions; Lunar, Mars and zero-g. The goal is to seek ways to reduce the weight of PLSS packaging, and at the same time, develop a packaging scheme that would make PLSS technology changes less costly than the current packaging methods. This study builds on the results of NASA s in-house 1998 study, which resulted in the "Flex PLSS" concept. For this study the present EMU schematic (low earth orbit) was used so that the work team could concentrate on the packaging. The Flex PLSS packaging is required to: protect, connect, and hold the PLSS and its components together internally and externally while providing access to PLSS components internally for maintenance and for technology change without extensive redesign impact. The goal of this study was two fold: 1. Bring the advanced space suit integrated Flex PLSS concept from its current state of development to a preliminary design level and build a proof of concept mockup of the proposed design, and; 2. "Design" a Design Process, which accommodates both the initial Flex PLSS design and the package modifications, required to accommodate new technology.

Secondary Waste Cementitious Waste Form Data Package for the Integrated Disposal Facility Performance Assessment

Energy Technology Data Exchange (ETDEWEB)

Cantrell, Kirk J. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Westsik, Joseph H. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Serne, R Jeffrey [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Um, Wooyong [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Cozzi, Alex D. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States)

2016-05-16

A review of the most up-to-date and relevant data currently available was conducted to develop a set of recommended values for use in the Integrated Disposal Facility (IDF) performance assessment (PA) to model contaminant release from a cementitious waste form for aqueous wastes treated at the Hanford Effluent Treatment Facility (ETF). This data package relies primarily upon recent data collected on Cast Stone formulations fabricated with simulants of low-activity waste (LAW) and liquid secondary wastes expected to be produced at Hanford. These data were supplemented, when necessary, with data developed for saltstone (a similar grout waste form used at the Savannah River Site). Work is currently underway to collect data on cementitious waste forms that are similar to Cast Stone and saltstone but are tailored to the characteristics of ETF-treated liquid secondary wastes. Recommended values for key parameters to conduct PA modeling of contaminant release from ETF-treated liquid waste are provided.

Development of waste package designs for disposal in a salt repository

International Nuclear Information System (INIS)

Balmert, M.E.

1983-01-01

Three package design concepts were developed for CHLW and DHLW forms and spent fuel rods: (1) carbon steel overpack, borehole emplacement, (2) titanium clad, carbon steel reinforced overpack, borehole emplacement, and (3) carbon steel (self-shield) overpack, tunnel emplacement. For a DHLW canister with titanium clad overpack, the concept features a 9.5-cm-thick carbon steel overpack reinforcement supporting a 0.25-cm-thick titanium shell. The overall package dimensions are 84 cm diameter x 340 cm long weighing about 8.8 mtons. By contrast, a monolithic DHLW borehole package has a carbon steel overpack that is 10.4 cm thick, weighing about 9.3 mtons. The titanium clad/carbon steel reinforced borehole package is intended for remote emplacement in a vertical borehole in salt. The carbon steel overpack reinforcement provides structural integrity, primarily to resist external pressure, while the titanium overpack provides the necessary corrosion resistance to meet containment requirements. The carbon steel borehole package concept provides containment integrity for both external pressure and corrosion environments with a thicker carbon steel overpack in place of the titanium/carbon steel concept. A third concept utilizes an even greater thickness of cast steel or iron to resist external pressure and corrosion as well as reduce external shielding requirements. For example, a cast steel DHLW package would have overall dimensions of 125 cm diameter x 390 cm long, weighing 31 mtons. The purpose of this self-shield concept is to minimize handling and emplacement operations by reducing the package surface radiation dose to about 100 mrem/hr. In addition, it may serve as a shipping cask, thereby eliminating the need for a shielded hot cell at the repository for waste package assembly operations. 7 figures

An RNA Domain Imparts Specificity and Selectivity to a Viral DNA Packaging Motor

Science.gov (United States)

Zhao, Wei; Jardine, Paul J.

2015-01-01

ABSTRACT During assembly, double-stranded DNA viruses, including bacteriophages and herpesviruses, utilize a powerful molecular motor to package their genomic DNA into a preformed viral capsid. An integral component of the packaging motor in the Bacillus subtilis bacteriophage ϕ29 is a viral genome-encoded pentameric ring of RNA (prohead RNA [pRNA]). pRNA is a 174-base transcript comprised of two domains, domains I and II. Early studies initially isolated a 120-base form (domain I only) that retains high biological activity in vitro; hence, no function could be assigned to domain II. Here we define a role for this domain in the packaging process. DNA packaging using restriction digests of ϕ29 DNA showed that motors with the 174-base pRNA supported the correct polarity of DNA packaging, selectively packaging the DNA left end. In contrast, motors containing the 120-base pRNA had compromised specificity, packaging both left- and right-end fragments. The presence of domain II also provides selectivity in competition assays with genomes from related phages. Furthermore, motors with the 174-base pRNA were restrictive, in that they packaged only one DNA fragment into the head, whereas motors with the 120-base pRNA packaged several fragments into the head, indicating multiple initiation events. These results show that domain II imparts specificity and stringency to the motor during the packaging initiation events that precede DNA translocation. Heteromeric rings of pRNA demonstrated that one or two copies of domain II were sufficient to impart this selectivity/stringency. Although ϕ29 differs from other double-stranded DNA phages in having an RNA motor component, the function provided by pRNA is carried on the motor protein components in other phages. IMPORTANCE During virus assembly, genome packaging involves the delivery of newly synthesized viral nucleic acid into a protein shell. In the double-stranded DNA phages and herpesviruses, this is accomplished by a powerful

An RNA Domain Imparts Specificity and Selectivity to a Viral DNA Packaging Motor.

Science.gov (United States)

Zhao, Wei; Jardine, Paul J; Grimes, Shelley

2015-12-01

During assembly, double-stranded DNA viruses, including bacteriophages and herpesviruses, utilize a powerful molecular motor to package their genomic DNA into a preformed viral capsid. An integral component of the packaging motor in the Bacillus subtilis bacteriophage ϕ29 is a viral genome-encoded pentameric ring of RNA (prohead RNA [pRNA]). pRNA is a 174-base transcript comprised of two domains, domains I and II. Early studies initially isolated a 120-base form (domain I only) that retains high biological activity in vitro; hence, no function could be assigned to domain II. Here we define a role for this domain in the packaging process. DNA packaging using restriction digests of ϕ29 DNA showed that motors with the 174-base pRNA supported the correct polarity of DNA packaging, selectively packaging the DNA left end. In contrast, motors containing the 120-base pRNA had compromised specificity, packaging both left- and right-end fragments. The presence of domain II also provides selectivity in competition assays with genomes from related phages. Furthermore, motors with the 174-base pRNA were restrictive, in that they packaged only one DNA fragment into the head, whereas motors with the 120-base pRNA packaged several fragments into the head, indicating multiple initiation events. These results show that domain II imparts specificity and stringency to the motor during the packaging initiation events that precede DNA translocation. Heteromeric rings of pRNA demonstrated that one or two copies of domain II were sufficient to impart this selectivity/stringency. Although ϕ29 differs from other double-stranded DNA phages in having an RNA motor component, the function provided by pRNA is carried on the motor protein components in other phages. During virus assembly, genome packaging involves the delivery of newly synthesized viral nucleic acid into a protein shell. In the double-stranded DNA phages and herpesviruses, this is accomplished by a powerful molecular motor

Packaging health services when resources are limited: the example of a cervical cancer screening visit.

Directory of Open Access Journals (Sweden)

Jane J Kim

2006-11-01

Full Text Available Increasing evidence supporting the value of screening women for cervical cancer once in their lifetime, coupled with mounting interest in scaling up successful screening demonstration projects, present challenges to public health decision makers seeking to take full advantage of the single-visit opportunity to provide additional services. We present an analytic framework for packaging multiple interventions during a single point of contact, explicitly taking into account a budget and scarce human resources, constraints acknowledged as significant obstacles for provision of health services in poor countries.We developed a binary integer programming (IP model capable of identifying an optimal package of health services to be provided during a single visit for a particular target population. Inputs to the IP model are derived using state-transition models, which compute lifetime costs and health benefits associated with each intervention. In a simplified example of a single lifetime cervical cancer screening visit, we identified packages of interventions among six diseases that maximized disability-adjusted life years (DALYs averted subject to budget and human resource constraints in four resource-poor regions. Data were obtained from regional reports and surveys from the World Health Organization, international databases, the published literature, and expert opinion. With only a budget constraint, interventions for depression and iron deficiency anemia were packaged with cervical cancer screening, while the more costly breast cancer and cardiovascular disease interventions were not. Including personnel constraints resulted in shifting of interventions included in the package, not only across diseases but also between low- and high-intensity intervention options within diseases.The results of our example suggest several key themes: Packaging other interventions during a one-time visit has the potential to increase health gains; the shortage of

Microelectronic packaging

CERN Document Server

Datta, M; Schultze, J Walter

2004-01-01

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impac

The gRbase Package for Graphical Modelling in R

DEFF Research Database (Denmark)

Højsgaard, Søren; Dethlefsen, Claus

We have developed a package, called , consisting of a number of classes and associated methods to support the analysis of data using graphical models. It is developed for the open source language, R, and is available for several platforms. The package is intended to be widely extendible...... these building blocks can be combined and integrated with inference engines in the special cases of hierarchical log-linear models (undirected models). gRbase gRbase dynamicGraph...... and flexible so that package developers may implement further types of graphical models using the available methods. contains methods for representing data, specification of models using a formal language, and is linked to , an interactive graphical user interface for manipulating graphs. We show how...

Economic tour package model using heuristic

Science.gov (United States)

Rahman, Syariza Abdul; Benjamin, Aida Mauziah; Bakar, Engku Muhammad Nazri Engku Abu

2014-07-01

A tour-package is a prearranged tour that includes products and services such as food, activities, accommodation, and transportation, which are sold at a single price. Since the competitiveness within tourism industry is very high, many of the tour agents try to provide attractive tour-packages in order to meet tourist satisfaction as much as possible. Some of the criteria that are considered by the tourist are the number of places to be visited and the cost of the tour-packages. Previous studies indicate that tourists tend to choose economical tour-packages and aiming to visit as many places as they can cover. Thus, this study proposed tour-package model using heuristic approach. The aim is to find economical tour-packages and at the same time to propose as many places as possible to be visited by tourist in a given geographical area particularly in Langkawi Island. The proposed model considers only one starting point where the tour starts and ends at an identified hotel. This study covers 31 most attractive places in Langkawi Island from various categories of tourist attractions. Besides, the allocation of period for lunch and dinner are included in the proposed itineraries where it covers 11 popular restaurants around Langkawi Island. In developing the itinerary, the proposed heuristic approach considers time window for each site (hotel/restaurant/place) so that it represents real world implementation. We present three itineraries with different time constraints (1-day, 2-day and 3-day tour-package). The aim of economic model is to minimize the tour-package cost as much as possible by considering entrance fee of each visited place. We compare the proposed model with our uneconomic model from our previous study. The uneconomic model has no limitation to the cost with the aim to maximize the number of places to be visited. Comparison between the uneconomic and economic itinerary has shown that the proposed model have successfully achieved the objective that

qqman: an R package for visualizing GWAS results using Q-Q and manhattan plots

OpenAIRE

Turner, Stephen

2014-01-01

Summary: Genome-wide association studies (GWAS) have identified thousands of human trait-associated single nucleotide polymorphisms. Here, I describe a freely available R package for visualizing GWAS results using Q-Q and manhattan plots. The qqman package enables the flexible creation of manhattan plots, both genome-wide and for single chromosomes, with optional highlighting of SNPs of interest. Availability: qqman is released under the GNU General Public License, and is freely available on ...

Reuse and recycling of radioactive material packaging

International Nuclear Information System (INIS)

Gerulis, Eduardo; Zapparoli, Carlos Leonel; Barboza, Marycel Figols de

2009-01-01

Human development is directly linked to energy consumption. The political decisions (to this human development) result in economic, social and environmental aspects, whose magnitude should maintain the sustainability of every aspect for not to collapsing. The environmental aspect has been a target of research because of the excessive emission of gases which contributes to the greenhouse effect. The production processes emit gases due to the consumption of energy to get it, but it is necessary to maintain the environmental sustainability in order to minimize the contribution to the emission of greenhouse gases. The population control and the energetic efficiency are factors that contribute to the environmental sustainability. Besides them, the culture of consumption is another factor that, when applied to the reduction of emissions, also contributes to the sustainability of the environment. The reuse of materials is one of the sub-factors which contribute to the reduction of emissions. The Radiopharmacy Directory (DIRF) at IPEN-CNEN/SP, produces radiopharmaceuticals that are necessary to improve the Brazilian population's life quality. The radiopharmaceuticals are transported in packaging to the transport of radioactive material. These packages are considered non-biodegradable, because some metals, which make up these packages, pollute the environment. These packages have increased costs, in addition, because it must be approved in tests of integrity. The reuse of packaging in favorable situations to the same purpose is a way to help the environment degradation and costs reduction. The packaging reuse in unfavorable situations disobey rules or return logistics that become effective the transport back, but the consumption culture strengthening can change this situation. This paper describes IPEN's packaging, form and quantities distribution, and the packaging that comes back to be reused. (author)

The Packaging Handbook -- A guide to package design

International Nuclear Information System (INIS)

Shappert, L.B.

1995-01-01

The Packaging Handbook is a compilation of 14 technical chapters and five appendices that address the life cycle of a packaging which is intended to transport radioactive material by any transport mode in normal commerce. Although many topics are discussed in depth, this document focuses on the design aspects of a packaging. The Handbook, which is being prepared under the direction of the US Department of Energy, is intended to provide a wealth of technical guidance that will give designers a better understanding of the regulatory approval process, preferences of regulators in specific aspects of packaging design, and the types of analyses that should be seriously considered when developing the packaging design. Even though the Handbook is concerned with all packagings, most of the emphasis is placed on large packagings that are capable of transporting large radioactive sources that are also fissile (e.g., spent fuel). These are the types of packagings that must address the widest range of technical topics in order to meet domestic and international regulations. Most of the chapters in the Handbook have been drafted and submitted to the Oak Ridge National Laboratory for editing; the majority of these have been edited. This report summarizes the contents

Computation of integral electron storage ring beam characteristics in the application package DeCA. Version 3.3. A physical model

International Nuclear Information System (INIS)

Gladkikh, P.I.; Strelkov, M.A.; Zelinskij, A.Yu.

1993-01-01

In calculations and optimization of electron storage ring lattices, aside from solving the problem of particle motion stability in the ring and calculating ring structure functions and betatron tune, it is of great importance to determine the integral characteristics such as momentum compaction factor, chromaticity of the lattice, emittance, energy spread, bunch size, beam lifetime, etc. Knowing them, one is able to determine all most important properties which the beam would have in the storage ring, as well as to work out requirements for physical equipment of the ring. In this respect it is of importance to have a possibility of calculating rapidly all the parameters required. This paper describes convenient algorithms for calculating integral beam characteristics in electron storage rings, which are employed in the application package DeCA

Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring.

Science.gov (United States)

Halonen, Niina; Kilpijärvi, Joni; Sobocinski, Maciej; Datta-Chaudhuri, Timir; Hassinen, Antti; Prakash, Someshekar B; Möller, Peter; Abshire, Pamela; Kellokumpu, Sakari; Lloyd Spetz, Anita

2016-01-01

Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC) microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC) technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.

New generation of single-chip microcomputers focused on cost performance

Energy Technology Data Exchange (ETDEWEB)

Akao, Y.; Iwashita, H. (Hitachi, Ltd., Tokyo (Japan))

1993-06-01

A single-chip microcomputer which incorporates a CPU (central processing unit), memory, and peripheral functions in one chip has been increasingly applied to various fields as the heart of electronic equipment in terms of its economy, compactness, lightness, and suitability for mass production. In response to a wide variety of needs, a lineup must have substantial breadth with regard to performance, on-chip memory capacity, on-chip peripheral functions, operating voltage, and packaging. In particular, low-voltage high-speed operation, high integration, expanded address space, and improved software productivity, which are required for mobile communication terminals, are the common needs for single-chip microcomputers. In accordance with these needs, Hitachi has been actively developing new products. The present paper introduces Hitachi's lineup of single-chip microcomputers. 10 figs., 1 tab.

Multi-view 3D human pose estimation combining single-frame recovery, temporal integration and model adaptation

NARCIS (Netherlands)

Hofmann, K.M.; Gavrilla, D.M.

2009-01-01

We present a system for the estimation of unconstrained 3D human upper body movement from multiple cameras. Its main novelty lies in the integration of three components: single frame pose recovery, temporal integration and model adaptation. Single frame pose recovery consists of a hypothesis

TropFishR: an R package for fisheries analysis with length-frequency data

DEFF Research Database (Denmark)

Mildenberger, Tobias; Taylor, M. H.; Wolff, A.M.

2017-01-01

1. The R package TropFishR is a new analysis toolbox compiling single-species stock assessment methods specifically designed for data-limited fisheries analysis using length-frequency data. 2. It includes methods for (i) estimating biological stock characteristics such as growth and mortality par...... introduces the package and demonstrates the functionality of a selection of its core methods. 4. TropFishR modernises traditional stock assessment methods by easing application and development and by combining it with advanced statistical approaches......1. The R package TropFishR is a new analysis toolbox compiling single-species stock assessment methods specifically designed for data-limited fisheries analysis using length-frequency data. 2. It includes methods for (i) estimating biological stock characteristics such as growth and mortality...

Development in Electronic Packaging – Moving to 3D System Configuration

Directory of Open Access Journals (Sweden)

I. Szendiuch

2011-04-01

Full Text Available The electronic industry is reducing package dimensions of components as well as complete electronics systems. Surface mount device passives and semiconductor chips have to be mounted together bringing a functional system that must realize the required function with necessary reliability and acceptable price. To make up a reliable and cost effective system, the size and weight is being reduced by employing lower voltages and higher speeds. For example, the typical size of SMD passives 30 years ago was 1206 when they were first introduced. Generally, all components including electrical joints are becoming miniaturized and smaller. The industry is moving toward a reduced size of 0201 and 01005 for passives, new fine pitch packages for actives, but the PCB now feature limits for further integration. System on Package (SOP is one way to reach the three-dimensional package concept where components will be placed in three-dimensional configuration. A similar concepts are “Package on Package” (PoP or ”Package in Package” (PiP.

Transportation package design using numerical optimization

International Nuclear Information System (INIS)

Harding, D.C.; Witkowski, W.R.

1992-01-01

The design of structures and engineering systems has always been an iterative process whose complexity was dependent upon the boundary conditions, constraints and available analytical tools. Transportation packaging design is no exception with structural, thermal and radiation shielding constraints based on regulatory hypothetical accident conditions. Transportation packaging design is often accomplished by a group of specialists, each designing a single component based on one or more simple criteria, pooling results with the group, evaluating the open-quotes pooledclose quotes design, and then reiterating the entire process until a satisfactory design is reached. The manual iterative methods used by the designer/analyst can be summarized in the following steps: design the part, analyze the part, interpret the analysis results, modify the part, and re-analyze the part. The inefficiency of this design practice and the frequently conservative result suggests the need for a more structured design methodology, which can simultaneously consider all of the design constraints. Numerical optimization is a structured design methodology whose maturity in development has allowed it to become a primary design tool in many industries. The purpose of this overview is twofold: first, to outline the theory and basic elements of numerical optimization; and second, to show how numerical optimization can be applied to the transportation packaging industry and used to increase efficiency and safety of radioactive and hazardous material transportation packages. A more extensive review of numerical optimization and its applications to radioactive material transportation package design was performed previously by the authors (Witkowski and Harding 1992). A proof-of-concept Type B package design is also presented as a simplified example of potential improvements achievable using numerical optimization in the design process

CMSG - A PUBLISH/SUBSCRIBE INTERPROCESS COMMUNICATION PACKAGE

International Nuclear Information System (INIS)

Wolin, Elliott; Timmer, Carl; Gyurjyan, Vardan; Heyes, William; Jastrzembski, Edward; Lawrence, David; Abbott, David

2008-01-01

Publish/subscribe message passing is an extremely simple, flexible, and powerful interprocess communication (IPC) paradigm. It is widely used in industry, but not nearly so in High Energy and Nuclear Physics (HENP), perhaps due to the cost of commercial implementations. cMsg, developed at Jefferson Lab in the US, contains a full-featured pub/sub interprocess communication package that is simple to install and use. It is very efficient, and implements both point-to-point and pub/sub communications, server redundancy, hot server failover, and a server discovery service. In addition, for developers cMsg provides a framework within which one can deploy multiple underlying communication packages that do not necessarily need to implement the full pub/sub paradigm. This allows for unification of all communication in a control system under a single API, shortens development time, and allows for simple upgrade or replacement of underlying communication packages and protocols.

Wafer-Level Vacuum Packaging of Smart Sensors.

Science.gov (United States)

Hilton, Allan; Temple, Dorota S

2016-10-31

The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors-"low cost" for ubiquitous presence, and "smart" for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS) integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology.

Wafer-Level Vacuum Packaging of Smart Sensors

Directory of Open Access Journals (Sweden)

Allan Hilton

2016-10-01

Full Text Available The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology.

Integrated FASTBUS, VME and CAMAC diagnostic software at Fermilab

International Nuclear Information System (INIS)

Anderson, J.; Forster, R.; Franzen, J.; Wilcer, N.

1992-10-01

A fully integrated system for the diagnosis and repair of data acquisition hardware in FASTBUS, VME and CAMAC is described. A short cost/benefit analysis of using a distributed network of personal computers for diagnosis is presented. The SPUDS (Single Platform Uniting Diagnostic Software) software package developed at Fermilab by the authors is introduced. Examples of how SPUDS is currently used in the Fermilab equipment repair facility, as an evaluation tool and for field diagnostics are given

The Ettention software package.

Science.gov (United States)

Dahmen, Tim; Marsalek, Lukas; Marniok, Nico; Turoňová, Beata; Bogachev, Sviatoslav; Trampert, Patrick; Nickels, Stefan; Slusallek, Philipp

2016-02-01

We present a novel software package for the problem "reconstruction from projections" in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. Copyright © 2015 Elsevier B.V. All rights reserved.

Mechanical Assessment of the Waste Package Subject to Vibratory Motion

International Nuclear Information System (INIS)

M. Gross

2004-01-01

The purpose of this document is to provide an integrated overview of the calculation reports that define the response of the waste package and its internals to vibratory ground motion. The calculation reports for waste package response to vibratory ground motion are identified in Table 1-1. Three key calculation reports describe the potential for mechanical damage to the waste package, fuel assemblies, and cladding from a seismic event. Three supporting documents have also been published to investigate sensitivity of damage to various assumptions for the calculations. While these individual reports present information on a specific aspect of waste package and cladding response, they do not describe the interrelationship between the various calculations and the relationship of this information to the seismic scenario class for Total System Performance Assessment-License Application (TSPA-LA). This report is designed to fill this gap by providing an overview of the waste package structural response calculations

Mechanical Assessment of the Waste Package Subject to Vibratory Motion

Energy Technology Data Exchange (ETDEWEB)

M. Gross

2004-10-14

The purpose of this document is to provide an integrated overview of the calculation reports that define the response of the waste package and its internals to vibratory ground motion. The calculation reports for waste package response to vibratory ground motion are identified in Table 1-1. Three key calculation reports describe the potential for mechanical damage to the waste package, fuel assemblies, and cladding from a seismic event. Three supporting documents have also been published to investigate sensitivity of damage to various assumptions for the calculations. While these individual reports present information on a specific aspect of waste package and cladding response, they do not describe the interrelationship between the various calculations and the relationship of this information to the seismic scenario class for Total System Performance Assessment-License Application (TSPA-LA). This report is designed to fill this gap by providing an overview of the waste package structural response calculations.

Software refactoring at the package level using clustering techniques

KAUST Repository

Alkhalid, A.

2011-01-01

Enhancing, modifying or adapting the software to new requirements increases the internal software complexity. Software with high level of internal complexity is difficult to maintain. Software refactoring reduces software complexity and hence decreases the maintenance effort. However, software refactoring becomes quite challenging task as the software evolves. The authors use clustering as a pattern recognition technique to assist in software refactoring activities at the package level. The approach presents a computer aided support for identifying ill-structured packages and provides suggestions for software designer to balance between intra-package cohesion and inter-package coupling. A comparative study is conducted applying three different clustering techniques on different software systems. In addition, the application of refactoring at the package level using an adaptive k-nearest neighbour (A-KNN) algorithm is introduced. The authors compared A-KNN technique with the other clustering techniques (viz. single linkage algorithm, complete linkage algorithm and weighted pair-group method using arithmetic averages). The new technique shows competitive performance with lower computational complexity. © 2011 The Institution of Engineering and Technology.

Leveraging Available Data to Support Extension of Transportation Packages Service Life

Energy Technology Data Exchange (ETDEWEB)

Dunn, K.; Abramczyk, G.; Bellamy, S.; Daugherty, W.; Hackney, B.; Hoffman, E.; Skidmore, E.; Stefek, T.

2012-06-12

Data obtained from testing shipping package materials have been leveraged to support extending the service life of select shipping packages while in nuclear materials transportation. Increasingly, nuclear material inventories are being transferred to an interim storage location where they will reside for extended periods of time. Use of a shipping package to store nuclear materials in an interim storage location has become more attractive for a variety of reasons. Shipping packages are robust and have a qualified pedigree for their performance in normal operation and accident conditions within the approved shipment period and storing nuclear material within a shipping package results in reduced operations for the storage facility. However, the shipping package materials of construction must maintain a level of integrity as specified by the safety basis of the storage facility through the duration of the storage period, which is typically well beyond the one year transportation window. Test programs have been established to obtain aging data on materials of construction that are the most sensitive/susceptible to aging in certain shipping package designs. The collective data are being used to support extending the service life of shipping packages in both transportation and storage.

Leveraging Available Data to Support Extension of Transportation Packages Service Life

International Nuclear Information System (INIS)

Dunn, K.; Abramczyk, G.; Bellamy, S.; Daugherty, W.; Hackney, B.; Hoffman, E.; Skidmore, E.; Stefek, T.

2012-01-01

Data obtained from testing shipping package materials have been leveraged to support extending the service life of select shipping packages while in nuclear materials transportation. Increasingly, nuclear material inventories are being transferred to an interim storage location where they will reside for extended periods of time. Use of a shipping package to store nuclear materials in an interim storage location has become more attractive for a variety of reasons. Shipping packages are robust and have a qualified pedigree for their performance in normal operation and accident conditions within the approved shipment period and storing nuclear material within a shipping package results in reduced operations for the storage facility. However, the shipping package materials of construction must maintain a level of integrity as specified by the safety basis of the storage facility through the duration of the storage period, which is typically well beyond the one year transportation window. Test programs have been established to obtain aging data on materials of construction that are the most sensitive/susceptible to aging in certain shipping package designs. The collective data are being used to support extending the service life of shipping packages in both transportation and storage.

Code package {open_quotes}SVECHA{close_quotes}: Modeling of core degradation phenomena at severe accidents

Energy Technology Data Exchange (ETDEWEB)

Veshchunov, M.S.; Kisselev, A.E.; Palagin, A.V. [Nuclear Safety Institute, Moscow (Russian Federation)] [and others

1995-09-01

The code package SVECHA for the modeling of in-vessel core degradation (CD) phenomena in severe accidents is being developed in the Nuclear Safety Institute, Russian Academy of Science (NSI RAS). The code package presents a detailed mechanistic description of the phenomenology of severe accidents in a reactor core. The modules of the package were developed and validated on separate effect test data. These modules were then successfully implemented in the ICARE2 code and validated against a wide range of integral tests. Validation results have shown good agreement with separate effect tests data and with the integral tests CORA-W1/W2, CORA-13, PHEBUS-B9+.

77 FR 39735 - Certain Integrated Circuit Packages Provided With Multiple Heat-Conducting Paths and Products...

Science.gov (United States)

2012-07-05

...Notice is hereby given that a complaint was filed with the U.S. International Trade Commission on May 31, 2012, under section 337 of the Tariff Act of 1930, as amended, on behalf of Industrial Technology Research Institute of Taiwan and ITRI International of San Jose, California. The complaint alleges violations of section 337 based upon the importation into the United States, the sale for importation, and the sale within the United States after importation of certain integrated circuit packages provided with multiple heat-conducting paths and products containing same by reason of infringement of certain claims of U.S. Patent No. 5,710,459 (``the `459 patent''). The complaint further alleges that an industry in the United States exists as required by subsection (a)(2) of section 337. The complainants request that the Commission institute an investigation and, after the investigation, issue an exclusion order and cease and desist order.

500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

Science.gov (United States)

Chen, Liang-yu; Neudeck, Philip G.; Spry, David J.; Beheim, Glenn M.; Hunter, Gary W.

2016-01-01

High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

Development of a software package for solid-angle calculations using the Monte Carlo method

International Nuclear Information System (INIS)

Zhang, Jie; Chen, Xiulian; Zhang, Changsheng; Li, Gang; Xu, Jiayun; Sun, Guangai

2014-01-01

Solid-angle calculations play an important role in the absolute calibration of radioactivity measurement systems and in the determination of the activity of radioactive sources, which are often complicated. In the present paper, a software package is developed to provide a convenient tool for solid-angle calculations in nuclear physics. The proposed software calculates solid angles using the Monte Carlo method, in which a new type of variance reduction technique was integrated. The package, developed under the environment of Microsoft Foundation Classes (MFC) in Microsoft Visual C ++ , has a graphical user interface, in which, the visualization function is integrated in conjunction with OpenGL. One advantage of the proposed software package is that it can calculate the solid angle subtended by a detector with different geometric shapes (e.g., cylinder, square prism, regular triangular prism or regular hexagonal prism) to a point, circular or cylindrical source without any difficulty. The results obtained from the proposed software package were compared with those obtained from previous studies and calculated using Geant4. It shows that the proposed software package can produce accurate solid-angle values with a greater computation speed than Geant4. -- Highlights: • This software package (SAC) can give accurate solid-angle values. • SAC calculate solid angles using the Monte Carlo method and it has higher computation speed than Geant4. • A simple but effective variance reduction technique which was put forward by the authors has been applied in SAC. • A visualization function and a graphical user interface are also integrated in SAC

Solar energy heating system design package for a single-family residence at New Castle, Pennsylvania

Energy Technology Data Exchange (ETDEWEB)

1977-08-01

The design of a solar heating and hot water system for the New Castle Redevelopment Authority's single-family dwelling located at New Castle, Pennsylvania is described. Documentation submitted by the contractor for Government review of plans, specifications, cost trade studies and verification status for approval to commit the system to fabrication is presented. Also included are system integration drawings, major subsystems drawings, and architect's specifications and plans.

A Review of Patents for the Smart Packaging of Meat and Muscle-based Food Products.

Science.gov (United States)

Holman, Benjamin; Kerry, Joseph P; Hopkins, David L

2017-10-31

Meat packaging once acted primarily as an inert barrier to protect its contents against contamination and this function has shifted. Packaging now includes complementary functions that improve product quality, longevity and customer/retail appeal. The devices and methods applied to achieve these functions may be categorised as smart packaging, which includes intelligent packaging, devised to monitor and communicate packaged content status, and active packaging, to provide passive adjustment of in-pack conditions from its interactions with the packaged meat. Smart packaging examples already available from recent patents include antimicrobial and antioxidant packaging coatings and inserts; sensors or indicators that identify spoilage and freshness; functional engineering customisations; improvements to packaging integrity; leak or tamper detectors; and, environmentally sustainable options. Together, these inventions respond to industry and customer demands for meat packaging and are therefore the focus of this review, in which we discuss their applications and limitations in meat packaging. Copyright© Bentham Science Publishers; For any queries, please email at epub@benthamscience.org.

Considerations relating to different types of packaging

International Nuclear Information System (INIS)

Sousselier, Y.; Cohendy, G.

1976-01-01

The transport of radioactive materials has never given rise to a serious accident in France. This is due to the high quality of the provisions contained in the Regulations and to the conscientious manner in which the latter are applied. However, it would now seem appropriate to re-examine certain of these provisions in the light of a number of minor incidents which have occurred, or merely because problems have arisen which did not exist at the time of the last revision. This applies particularly to Type B packaging, intended for irradiated fuel shipments whose considerable bulk calls for a mock-up study. The transport of Type B packaging by sea may pose the problem of its resistance to fire on normal merchant ships, and similarly its behaviour under the effect of crushing should be examined in the context of air transport. Industrial-type packaging likewise presents problems, although these are basically of a psychological nature. This is particularly the case with consignments of uraniferous concentrates, uranium hexafluoride and plutonium-contaminated wastes. The accumulation (which sometimes reaches substantial numbers) of Type A packaging on a single vehicle may involve consequences which also call for study. (author)

Integrative NMR for biomolecular research

Energy Technology Data Exchange (ETDEWEB)

Lee, Woonghee, E-mail: whlee@nmrfam.wisc.edu; Cornilescu, Gabriel; Dashti, Hesam; Eghbalnia, Hamid R.; Tonelli, Marco; Westler, William M.; Butcher, Samuel E.; Henzler-Wildman, Katherine A.; Markley, John L., E-mail: markley@nmrfam.wisc.edu [University of Wisconsin-Madison, National Magnetic Resonance Facility at Madison and Biochemistry Department (United States)

2016-04-15

NMR spectroscopy is a powerful technique for determining structural and functional features of biomolecules in physiological solution as well as for observing their intermolecular interactions in real-time. However, complex steps associated with its practice have made the approach daunting for non-specialists. We introduce an NMR platform that makes biomolecular NMR spectroscopy much more accessible by integrating tools, databases, web services, and video tutorials that can be launched by simple installation of NMRFAM software packages or using a cross-platform virtual machine that can be run on any standard laptop or desktop computer. The software package can be downloaded freely from the NMRFAM software download page ( http://pine.nmrfam.wisc.edu/download-packages.html http://pine.nmrfam.wisc.edu/download{sub p}ackages.html ), and detailed instructions are available from the Integrative NMR Video Tutorial page ( http://pine.nmrfam.wisc.edu/integrative.html http://pine.nmrfam.wisc.edu/integrative.html ).

Inventory of data bases, graphics packages, and models in Department of Energy laboratories

International Nuclear Information System (INIS)

Shriner, C.R.; Peck, L.J.

1978-11-01

A central inventory of energy-related environmental bibliographic and numeric data bases, graphics packages, integrated hardware/software systems, and models was established at Oak Ridge National Laboratory in an effort to make these resources at Department of Energy (DOE) laboratories better known and available to researchers and managers. This inventory will also serve to identify and avoid duplication among laboratories. The data were collected at each DOE laboratory, then sent to ORNL and merged into a single file. This document contains the data from the merged file. The data descriptions are organized under major data types: data bases, graphics packages, integrated hardware/software systems, and models. The data include descriptions of subject content, documentation, and contact persons. Also provided are computer data such as media on which the item is available, size of the item, computer on which the item executes, minimum hardware configuration necessary to execute the item, software language(s) and/or data base management system utilized, and character set used. For the models, additional data are provided to define the model more accurately. These data include a general statement of algorithms, computational methods, and theories used by the model; organizations currently using the model; the general application area of the model; sources of data utilized by the model; model validation methods, sensitivity analysis, and procedures; and general model classification. Data in this inventory will be available for on-line data retrieval on the DOE/RECON system

PLA and single component silicone rubber blends for sub-zero temperature blown film packaging applications

Science.gov (United States)

Meekum, Utai; Khiansanoi, Apichart

2018-06-01

The poly(lactic acid) (PLA) blend with single component silicone rubber in the presence of reactive amino silane coupling agent and polyester polyols plasticizer were studied. The manufacturing of film packaging for sub-zero temperature applications from the PLA blend was the main objective. The mechanical properties, especially the impact strengths, of PLA/silicone blends were significantly depended on the silicone loading. The outstanding impact strengths, tested at sub-zero temperature, of the blend having silicone content of 8.0 phr was achieved. It was chosen as the best candidate for the processability improvement. Adding the talc filler into the PLA/silicone blend to enhance the rheological properties was investigated. The ductility of the talc filled blends were decreased with increasing the filler contents. However, the shear viscosity of the blend was raised with talc loading. The blend loaded with 40 phr of talc filler was justified as the optimal formula for the blown film process testing and it was successfully performed with a few difficulties. The obtained blown film showed relative good flexibility in comparison with LDPE but it has low transparency.

Solving Differential Equations in R: Package deSolve

Directory of Open Access Journals (Sweden)

Karline Soetaert

2010-02-01

Full Text Available In this paper we present the R package deSolve to solve initial value problems (IVP written as ordinary differential equations (ODE, differential algebraic equations (DAE of index 0 or 1 and partial differential equations (PDE, the latter solved using the method of lines approach. The differential equations can be represented in R code or as compiled code. In the latter case, R is used as a tool to trigger the integration and post-process the results, which facilitates model development and application, whilst the compiled code significantly increases simulation speed. The methods implemented are efficient, robust, and well documented public-domain Fortran routines. They include four integrators from the ODEPACK package (LSODE, LSODES, LSODA, LSODAR, DVODE and DASPK2.0. In addition, a suite of Runge-Kutta integrators and special-purpose solvers to efficiently integrate 1-, 2- and 3-dimensional partial differential equations are available. The routines solve both stiff and non-stiff systems, and include many options, e.g., to deal in an efficient way with the sparsity of the Jacobian matrix, or finding the root of equations. In this article, our objectives are threefold: (1 to demonstrate the potential of using R for dynamic modeling, (2 to highlight typical uses of the different methods implemented and (3 to compare the performance of models specified in R code and in compiled code for a number of test cases. These comparisons demonstrate that, if the use of loops is avoided, R code can efficiently integrate problems comprising several thousands of state variables. Nevertheless, the same problem may be solved from 2 to more than 50 times faster by using compiled code compared to an implementation using only R code. Still, amongst the benefits of R are a more flexible and interactive implementation, better readability of the code, and access to R’s high-level procedures. deSolve is the successor of package odesolve which will be deprecated in

Packaging material and aluminum. Hoso zairyo to aluminum

Energy Technology Data Exchange (ETDEWEB)

Itaya, T [Mitsubishi Aluminum Co. Ltd., Tokyo (Japan)

1992-02-01

The present paper introduces aluminum foil packaging materials among the relation between packing materials and aluminum. The characteristics of aluminum foil in the packaging area are in its barrier performance, non-toxicity, tastelessness and odorlessness. Its excellent functions and processibility suit best as functional materials for food, medicine and industrial material packaging. While an aluminum foil may be used as a single packing material as in foils used in homes, many of it as a packaging material are used in combination with adhesives, papers or plastic films, or coated or printed. It is used as composite materials laminated or coated with other materials according to their use for the purpose of complementing the aluminum foil as the base material. Representative method to laminate aluminum foils include the wet lamination, dry lamination, thermally dissolved lamination and extruded lamination. The most important quality requirement in lamination is the adhesion strength, which requires a close attention in selecting the kinds of adhesive, laminating conditions, and aging conditions. 8 figs., 6 tabs.

Integrated circuits and logic operations based on single-layer MoS2.

Science.gov (United States)

Radisavljevic, Branimir; Whitwick, Michael Brian; Kis, Andras

2011-12-27

Logic circuits and the ability to amplify electrical signals form the functional backbone of electronics along with the possibility to integrate multiple elements on the same chip. The miniaturization of electronic circuits is expected to reach fundamental limits in the near future. Two-dimensional materials such as single-layer MoS(2) represent the ultimate limit of miniaturization in the vertical dimension, are interesting as building blocks of low-power nanoelectronic devices, and are suitable for integration due to their planar geometry. Because they are less than 1 nm thin, 2D materials in transistors could also lead to reduced short channel effects and result in fabrication of smaller and more power-efficient transistors. Here, we report on the first integrated circuit based on a two-dimensional semiconductor MoS(2). Our integrated circuits are capable of operating as inverters, converting logical "1" into logical "0", with room-temperature voltage gain higher than 1, making them suitable for incorporation into digital circuits. We also show that electrical circuits composed of single-layer MoS(2) transistors are capable of performing the NOR logic operation, the basis from which all logical operations and full digital functionality can be deduced.

MEMS packaging

CERN Document Server

Hsu , Tai-Ran

2004-01-01

MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring

Directory of Open Access Journals (Sweden)

Niina Halonen

2016-11-01

Full Text Available Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.

Design and fabrication of a foldable 3D silicon based package for solid state lighting applications

International Nuclear Information System (INIS)

Sokolovskij, R; Liu, P; Van Zeijl, H W; Mimoun, B; Zhang, G Q

2015-01-01

Miniaturization of solid state lighting (SSL) luminaires as well as reduction of packaging and assembly costs are of prime interest for the SSL lighting industry. A novel silicon based LED package for lighting applications is presented in this paper. The proposed design consists of 5 rigid Si tiles connected by flexible polyimide hinges with embedded interconnects (ICs). Electrical, optical and thermal characteristics were taken into consideration during design. The fabrication process involved polyimide (PI) application and patterning, aluminium interconnect integration in the flexible hinge, LED reflector cavity formation and metalization followed by through wafer DRIE etching for chip formation and release. A method to connect chip front to backside without TSVs was also integrated into the process. Post-fabrication wafer level assembly included LED mounting and wirebond, phosphor-based colour conversion and silicone encapsulation. The package formation was finalized by vacuum assisted wrapping around an assembly structure to form a 3D geometry, which is beneficial for omnidirectional lighting. Bending tests were performed on the flexible ICs and optical performance at different temperatures was evaluated. It is suggested that 3D packages can be expanded to platforms for miniaturized luminaire applications by combining monolithic silicon integration and system-in-package (SiP) technologies. (paper)

Packaging design criteria for the Hanford Ecorok Packaging

International Nuclear Information System (INIS)

Mercado, M.S.

1996-01-01

The Hanford Ecorok Packaging (HEP) will be used to ship contaminated water purification filters from K Basins to the Central Waste Complex. This packaging design criteria documents the design of the HEP, its intended use, and the transportation safety criteria it is required to meet. This information will serve as a basis for the safety analysis report for packaging

Advanced Packaging Materials and Techniques for High Power TR Module: Standard Flight vs. Advanced Packaging

Science.gov (United States)

Hoffman, James Patrick; Del Castillo, Linda; Miller, Jennifer; Jenabi, Masud; Hunter, Donald; Birur, Gajanana

2011-01-01

The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires advances in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and compared to standard technologies.

CRISPR-Mediated Integration of Large Gene Cassettes Using AAV Donor Vectors

Directory of Open Access Journals (Sweden)

Rasmus O. Bak

2017-07-01

Full Text Available The CRISPR/Cas9 system has recently been shown to facilitate high levels of precise genome editing using adeno-associated viral (AAV vectors to serve as donor template DNA during homologous recombination (HR. However, the maximum AAV packaging capacity of ∼4.5 kb limits the donor size. Here, we overcome this constraint by showing that two co-transduced AAV vectors can serve as donors during consecutive HR events for the integration of large transgenes. Importantly, the method involves a single-step procedure applicable to primary cells with relevance to therapeutic genome editing. We use the methodology in primary human T cells and CD34+ hematopoietic stem and progenitor cells to site-specifically integrate an expression cassette that, as a single donor vector, would otherwise amount to a total of 6.5 kb. This approach now provides an efficient way to integrate large transgene cassettes into the genomes of primary human cells using HR-mediated genome editing with AAV vectors.

Package Technology for Manufacture of Caprolactam Developed by SINOPEC Commands Internationally Leading Position

Institute of Scientific and Technical Information of China (English)

无

2008-01-01

@@ In October one of SINOPEC's ten core projects to be tackled- "Development of package technology for the 140kt/a caprolactam unit" had passed the technical appraisal organized by the SINOPEC Group.This package technology integrates new techniques relating to the production of cyclohexanone via oxidation of ethylene oxide,the production of cyclohexanone-oxime through ammoximation of cyclohexanone,the triple rearrangement of cyclohexanoneoxime,and the purification ofcaprolactam.The overall package technology has reached the internationally advanced level with independent intellectual property rights,and has filed or has been granted a lot of Chinese and overseas patents.This package technology has been successfully adopted in commercial scale at the Baling Petrochemical Company.

A study of pile-up in integrated time-correlated single photon counting systems.

Science.gov (United States)

Arlt, Jochen; Tyndall, David; Rae, Bruce R; Li, David D-U; Richardson, Justin A; Henderson, Robert K

2013-10-01

Recent demonstration of highly integrated, solid-state, time-correlated single photon counting (TCSPC) systems in CMOS technology is set to provide significant increases in performance over existing bulky, expensive hardware. Arrays of single photon single photon avalanche diode (SPAD) detectors, timing channels, and signal processing can be integrated on a single silicon chip with a degree of parallelism and computational speed that is unattainable by discrete photomultiplier tube and photon counting card solutions. New multi-channel, multi-detector TCSPC sensor architectures with greatly enhanced throughput due to minimal detector transit (dead) time or timing channel dead time are now feasible. In this paper, we study the potential for future integrated, solid-state TCSPC sensors to exceed the photon pile-up limit through analytic formula and simulation. The results are validated using a 10% fill factor SPAD array and an 8-channel, 52 ps resolution time-to-digital conversion architecture with embedded lifetime estimation. It is demonstrated that pile-up insensitive acquisition is attainable at greater than 10 times the pulse repetition rate providing over 60 dB of extended dynamic range to the TCSPC technique. Our results predict future CMOS TCSPC sensors capable of live-cell transient observations in confocal scanning microscopy, improved resolution of near-infrared optical tomography systems, and fluorescence lifetime activated cell sorting.

The European Union climate and energy package. Assessment and perspectives for 2030

International Nuclear Information System (INIS)

Gautier, Celia; Loiseaux, Damien

2014-03-01

After having presented the three pillars of the climate and energy package of the European Union, this publication recalls the genesis of its adoption and its components in the 2009 package (directives on the European carbon market, on renewable energies, on CO 2 capture and storage). It indicates and comments the objectives of the package by 2020 (reduction of emissions, share of renewable energies, reduction of energy consumption, share of renewable energies in transports). It proposes an assessment of the 2009 climate and energy package in terms of objectives, presents a status of the package implementation (notably in France and in Germany), outlines its benefits (for the European society and economy, impacts at the world level, fragile development of renewable energies), and drawbacks (insufficient objective, ETS dysfunction, impact of the economic crisis, lack of integration of package policies and energy and tax policies, limitations of directives on products and sub-sectors, imported emissions as the undetected stowaway). It reports the recommendations of the Action Climat network to strengthen the action on climate before 2020 and for the package by 2030

MODEL 9977 B(M)F-96 SAFETY ANALYSIS REPORT FOR PACKAGING

Energy Technology Data Exchange (ETDEWEB)

Abramczyk, G; Paul Blanton, P; Kurt Eberl, K

2006-05-18

This Safety Analysis Report for Packaging (SARP) documents the analysis and testing performed on and for the 9977 Shipping Package, referred to as the General Purpose Fissile Package (GPFP). The performance evaluation presented in this SARP documents the compliance of the 9977 package with the regulatory safety requirements for Type B packages. Per 10 CFR 71.59, for the 9977 packages evaluated in this SARP, the value of ''N'' is 50, and the Transport Index based on nuclear criticality control is 1.0. The 9977 package is designed with a high degree of single containment. The 9977 complies with 10 CFR 71 (2002), Department of Energy (DOE) Order 460.1B, DOE Order 460.2, and 10 CFR 20 (2003) for As Low As Reasonably Achievable (ALARA) principles. The 9977 also satisfies the requirements of the Regulations for the Safe Transport of Radioactive Material--1996 Edition (Revised)--Requirements. IAEA Safety Standards, Safety Series No. TS-R-1 (ST-1, Rev.), International Atomic Energy Agency, Vienna, Austria (2000). The 9977 package is designed, analyzed and fabricated in accordance with Section III of the American Society of Mechanical Engineers (ASME) Boiler and Pressure Vessel (B&PV) Code, 1992 edition.

MAPPIX: A software package for off-line micro-pixe single particle aerosol analysis

International Nuclear Information System (INIS)

Ceccato, D.

2009-01-01

In the framework of a multiannual experiment performed at Baia Terra Nova, Antarctica, size-segregated aerosol samples were collected by using a 12-stage SDI impactor (Hillamo design). Approximately 2800 particles, belonging to the first four supermicrometric SDI stages - 8.39, 4.08, 2.68, 1.66 μm dynamic aerosol diameter cuts - were analyzed at the INFN-LNL micro-PIXE facility, a three lens Oxford Microprobe (OM) product, installed in the early nineties. Four regions on each of the 12 sub-samples were measured; 60 aerosol particles were detected on average in each of the analyzed regions. The off-line single aerosol particle (SAP) analysis of such big amount of data required software that is able to rapidly handle the acquired data, with a simple and fast area selection procedure; the subsequent automated PIXE spectra analysis with a specialized code was also needed. The MAPPIX 2.0 software was designed to make easier and faster the user jobs during the SAP analysis. The package is composed of two separate routines: the first one is devoted to data format conversion (OM-LMF file format to MAPPIX format), while the second one is devoted to micro-PIXE maps graphical presentation and aerosol particle selection procedure. The MAPPIX data format and software features will be discussed; a short report of the speed performances will be presented.

Nanosensors for a Monitoring System in Intelligent and Active Packaging

Directory of Open Access Journals (Sweden)

Guillermo Fuertes

2016-01-01

Full Text Available A theoretical wireless nanosensor network (WNSN system that gives information about the food packaging condition is proposed. The protection effectiveness is estimated by measuring many factors, such as the existence of microorganisms, bacteria, gases, and contaminants. This study is focused on the detection of an antimicrobial agent (AA attached on a polymer forming an active integrated package. All monitoring technologies for food conservation are analyzed. Nanobiosensor nanomachine (NM, which converts biological or chemical signals into electrical signals, is used. A mathematical model, which describes the constituent’s emigration from the package to food, is programmed in MatLab software. The results show three nanobiosensors forming a WNSN. The nanobiosensors are able to carry out the average concentration for different spots in the package. This monitoring system shows reading percentages in three degrees and different colors: excellent (green, good (cyan, and lacking (red. To confirm the utility of the model, different simulations are performed. Using the WNSNs, results of AA existing in food package (FP through time were successfully obtained.

Estimate the thermomechanical fatigue life of two flip chip packages

International Nuclear Information System (INIS)

Pash, R.A.; Ullah, H.S.; Khan, M.Z.

2005-01-01

The continuing demand towards high density and low profile integrated circuit packaging has accelerated the development of flip chip structures as used in direct chip attach (DCA) technology, ball grid array (BOA) and chip scale package (CSP). In such structures the most widely used flip chip interconnects are solder joints. The reliability of flip chip structures largely depends on the reliability of solder joints. In this work solder joint fatigue life prediction for two chip scale packages is carried out. Elasto-plastic deformation behavior of the solder was simulated using ANSYS. Two dimensional plain strain finite element models were developed for each package to numerically compute the stress and total strain of the solder joints under temperature cycling. These stress and strain values are then used to predict the solder joint lifetime through modified Coffin Manson equation. The effect of solder joint's distance from edge of silicon die on life of the package is explored. The solder joint fatigue response is modeled for a typical temperature cycling of -60 to 140 degree C. (author)

High-activity liquid packaging design criteria

International Nuclear Information System (INIS)

1994-05-01

In recent studies, it has been acknowledged that there is an emerging need for packaging to transport high-activity liquid off the Hanford Site to support characterization and process development activities of liquid waste stored in underground tanks. These studies have dealt with specimen testing needs primarily at the Hanford Site; however, similar needs appear to be developing at other US Department of Energy (DOE) sites. The need to ship single and multiple specimens to offsite laboratories is anticipated because it is predicted that onsite laboratories will be overwhelmed by an increasing number and size (volume) of samples. Potentially, the specimen size could range from 250 mL to greater than 50 L. Presently, no certified Type-B packagings are available for transport of high-activity liquid radioactive specimens in sizes to support Site missions

Implementation of a high performance parallel finite element micromagnetics package

International Nuclear Information System (INIS)

Scholz, W.; Suess, D.; Dittrich, R.; Schrefl, T.; Tsiantos, V.; Forster, H.; Fidler, J.

2004-01-01

A new high performance scalable parallel finite element micromagnetics package has been implemented. It includes solvers for static energy minimization, time integration of the Landau-Lifshitz-Gilbert equation, and the nudged elastic band method

The Integration of an API619 Screw Compressor Package into the Industrial Internet of Things

Science.gov (United States)

Milligan, W. J.; Poli, G.; Harrison, D. K.

2017-08-01

The Industrial Internet of Things (IIoT) is the industrial subset of the Internet of Things (IoT). IIoT incorporates big data technology, harnessing the instrumentation data, machine to machine communication and automation technologies that have existed in industrial settings for years. As industry in general trends towards the IIoT and as the screw compressor packages developed by Howden Compressors are designed with a minimum design life of 25 years, it is imperative this technology is embedded immediately. This paper provides the reader with a description on the Industrial Internet of Things before moving onto describing the scope of the problem for an organisation like Howden Compressors who deploy multiple compressor technologies across multiple locations and focuses on the critical measurements particular to high specification screw compressor packages. A brief analysis of how this differs from high volume package manufacturers deploying similar systems is offered. Then follows a description on how the measured information gets from the tip of the instrument in the process pipework or drive train through the different layers, with a description of each layer, into the final presentation layer. The functions available within the presentation layer are taken in turn and the benefits analysed with specific focus on efficiency and availability. The paper concludes with how packagers adopting the IIoT can not only optimise their package but by utilising the machine learning technology and pattern detection applications can adopt completely new business models.

Packaging microservices

DEFF Research Database (Denmark)

Montesi, Fabrizio; Thrane, Dan Sebastian

2017-01-01

We describe a first proposal for a new packaging system for microservices based on the Jolie programming language, called the Jolie Package Manager (JPM). Its main features revolve around service interfaces, which make the functionalities that a service provides and depends on explicit. For the f......We describe a first proposal for a new packaging system for microservices based on the Jolie programming language, called the Jolie Package Manager (JPM). Its main features revolve around service interfaces, which make the functionalities that a service provides and depends on explicit...

Biodegradable PLA composites with different fillers for food packaging application

OpenAIRE

Marra, Antonella

2015-01-01

The food packaging initially born as a "container" of food for the sale of quantities defined in adequate conditions of hygiene, then had to perform the function of "protection" of the food in respect of environment. Today, in fact, the most important function of the packaging, when it comes to preservation technology, is to prevent deterioration of the food, to extend the duration of use of a food and to maintain and /or to increase its quality and integrity. So the main purpose of food pa...

Copper Electrodeposition for 3D Integration

OpenAIRE

Beica , Rozalia; Sharbono , Charles; Ritzdorf , Tom

2008-01-01

Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838); International audience; Two dimensional (2D) integration has been the traditional approach for IC integration. Due to increasing demands for providing electronic devices with superior performance and functionality in more efficient and compact packages, has driven the semiconductor industry to develop more advanced packaging technologies. Three-dimensional (3D) approaches address both miniaturizatio...

Geochemical Data Package for the 2005 Hanford Integrated Disposal Facility Performance Assessment

Energy Technology Data Exchange (ETDEWEB)

Krupka, Kenneth M.; Serne, R JEFFREY.; Kaplan, D I.

2004-09-30

CH2M HILL Hanford Group, Inc. (CH2M HILL) is designing and assessing the performance of an integrated disposal facility (IDF) to receive low-level waste (LLW), mixed low-level waste (MLLW), immobilized low-activity waste (ILAW), and failed or decommissioned melters. The CH2M HILL project to assess the performance of this disposal facility is the Hanford IDF Performance Assessment (PA) activity. The goal of the Hanford IDF PA activity is to provide a reasonable expectation that the disposal of the waste is protective of the general public, groundwater resources, air resources, surface-water resources, and inadvertent intruders. Achieving this goal will require prediction of contaminant migration from the facilities. This migration is expected to occur primarily via the movement of water through the facilities, and the consequent transport of dissolved contaminants in the vadose zone to groundwater where contaminants may be re-introduced to receptors via drinking water wells or mixing in the Columbia River. Pacific Northwest National Laboratory (PNNL) assists CH2M HILL in their performance assessment activities. One of the PNNL tasks is to provide estimates of the geochemical properties of the materials comprising the IDF, the disturbed region around the facility, and the physically undisturbed sediments below the facility (including the vadose zone sediments and the aquifer sediments in the upper unconfined aquifer). The geochemical properties are expressed as parameters that quantify the adsorption of contaminants and the solubility constraints that might apply for those contaminants that may exceed solubility constraints. The common parameters used to quantify adsorption and solubility are the distribution coefficient (Kd) and the thermodynamic solubility product (Ksp), respectively. In this data package, we approximate the solubility of contaminants using a more simplified construct, called the solution concentration limit, a constant value. The Kd values and

Extension of ship accident analysis to multiple-package shipments

International Nuclear Information System (INIS)

Mills, G.S.; Neuhauser, K.S.

1997-11-01

Severe ship accidents and the probability of radioactive material release from spent reactor fuel casks were investigated previously. Other forms of RAM, e.g., plutonium oxide powder, may be shipped in large numbers of packagings rather than in one to a few casks. These smaller, more numerous packagings are typically placed in ISO containers for ease of handling, and several ISO containers may be placed in one of several holds of a cargo ship. In such cases, the size of a radioactive release resulting from a severe collision with another ship is determined not by the likelihood of compromising a single, robust package but by the probability that a certain fraction of 10's or 100's of individual packagings is compromised. The previous analysis involved a statistical estimation of the frequency of accidents which would result in damage to a cask located in one of seven cargo holds in a collision with another ship. The results were obtained in the form of probabilities (frequencies) of accidents of increasing severity and of release fractions for each level of severity. This paper describes an extension of the same general method in which the multiple packages are assumed to be compacted by an intruding ship's bow until there is no free space in the hold. At such a point, the remaining energy of the colliding ship is assumed to be dissipated by progressively crushing the RAM packagings and the probability of a particular fraction of package failures is estimated by adaptation of the statistical method used previously. The parameters of a common, well characterized packaging, the 6M with 2R inner containment vessel, were employed as an illustrative example of this analysis method. However, the method is readily applicable to other packagings for which crush strengths have been measured or can be estimated with satisfactory confidence

Extension of ship accident analysis to multiple-package shipments

International Nuclear Information System (INIS)

Mills, G.S.; Neuhauser, K.S.

1998-01-01

Severe ship accidents and the probability of radioactive material release from spent reactor fuel casks were investigated previously (Spring, 1995). Other forms of RAM, e.g., plutonium oxide powder, may be shipped in large numbers of packagings rather than in one to a few casks. These smaller, more numerous packagings are typically placed in ISO containers for ease of handling, and several ISO containers may be placed in one of several holds of a cargo ship. In such cases, the size of a radioactive release resulting from a severe collision with another ship is determined not by the likelihood of compromising a single, robust package but by the probability that a certain fraction of 10's or 100's of individual packagings is compromised. The previous analysis (Spring, 1995) involved a statistical estimation of the frequency of accidents which would result in damage to a cask located in one of seven cargo holds in a collision with another ship. The results were obtained in the form of probabilities (frequencies) of accidents of increasing severity and of release fractions for each level of severity. This paper describes an extension of the same general method in which the multiple packages are assumed to be compacted by an intruding ship's bow until there is no free space in the hold. At such a point, the remaining energy of the colliding ship is assumed to be dissipated by progressively crushing the RAM packagings and the probability of a particular fraction of package failures is estimated by adaptation of the statistical method used previously. The parameters of a common, well-characterized packaging, the 6M with 2R inner containment vessel, were employed as an illustrative example of this analysis method. However, the method is readily applicable to other packagings for which crush strengths have been measured or can be estimated with satisfactory confidence. (authors)

Influence of the shape on the consumers perception of the packaging attributes

Directory of Open Access Journals (Sweden)

Gojko Vladić

2015-12-01

Full Text Available Packaging for fast moving consumer goods (FMCG demands constant attention in order to stay competitive in modern dynamic markets. FMCG consumers do not think about the purchasing product until they enter the place of purchase. This emphasizes importance of the communication in a place of purchase. Alongside promotional banners, displays and counters, packaging can be used for this purpose. While in-store promotional banners, displays and counters represent additional cost, the packaging as the integral part of the product can be used as an important marketing tool that does not add to product cost. Thus packaging becomes an important marketing tool that does not add to product cost. Marketers, distributors and researchers as well must take into consideration the complexity of consumer behaviour to achieve desired results. Alongside graphic design, material, colour, etc. packaging shape is considered as an important tool for product differentiation and promotion. Having this in mind, it is unclear why the influence of the packaging shape on the consumer remains the least examined of all packaging characteristics. The aim of this research is to understand the influence of packaging shape design on the consumer’s perception. The survey study conducted among the consumers of the fast moving consumer goods gave clear insight into the influence of packaging shape on the perception of packaging characteristics. The results can help to improve packaging shape design in order to achieve better market impact.

A Generalized Correlation Plot Package for the CEBAF Control System

International Nuclear Information System (INIS)

D. Wu; W. Akers; S. Schaffner; H. Shoaee; W. A. Watson; D. Wetherholt

1996-01-01

The Correlation Package is a general facility for data acquisition and analysis serving as an online environment for performing a wide variety of machine physics experiments and engineering diagnostics. Typical correlation experiments consist of an initial set of actions followed by stepping one or two accelerator parameters while measuring up to several hundred control system parameters. The package utilizes the CDEV [1] device API to access accelerator systems. A variety of analysis and graphics tools are included through integration with the Matlab math modeling package. A post- acquisition script capability is available to automate the data reduction process. A callable interface allows this facility to serve as the data acquisition and analysis engine for high level applications. A planned interface to archived accelerator data will allow the same analysis and graphics tools to be used for viewing and correlating history data. The object oriented design and C++ implementation details as well as the current status of the Correlation Package will be presented

In-Package Chemistry Abstraction

Energy Technology Data Exchange (ETDEWEB)

P.S. Domski

2003-07-21

The work associated with the development of this model report was performed in accordance with the requirements established in ''Technical Work Plan for Waste Form Degradation Modeling, Testing, and Analyses in Support of SR and LA'' (BSC 2002a). The in-package chemistry model and in-package chemistry model abstraction are developed to predict the bulk chemistry inside of a failed waste package and to provide simplified expressions of that chemistry. The purpose of this work is to provide the abstraction model to the Performance Assessment Project and the Waste Form Department for development of geochemical models of the waste package interior. The scope of this model report is to describe the development and validation of the in-package chemistry model and in-package chemistry model abstraction. The in-package chemistry model will consider chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) and codisposed high-level waste glass (HLWG) and N Reactor spent fuel (CDNR). The in-package chemistry model includes two sub-models, the first a water vapor condensation (WVC) model, where water enters a waste package as vapor and forms a film on the waste package components with subsequent film reactions with the waste package materials and waste form--this is a no-flow model, the reacted fluids do not exit the waste package via advection. The second sub-model of the in-package chemistry model is the seepage dripping model (SDM), where water, water that may have seeped into the repository from the surrounding rock, enters a failed waste package and reacts with the waste package components and waste form, and then exits the waste package with no accumulation of reacted water in the waste package. Both of the submodels of the in-package chemistry model are film models in contrast to past in-package chemistry models where all of the waste package pore space was filled with water. The

In-Package Chemistry Abstraction

International Nuclear Information System (INIS)

P.S. Domski

2003-01-01

The work associated with the development of this model report was performed in accordance with the requirements established in ''Technical Work Plan for Waste Form Degradation Modeling, Testing, and Analyses in Support of SR and LA'' (BSC 2002a). The in-package chemistry model and in-package chemistry model abstraction are developed to predict the bulk chemistry inside of a failed waste package and to provide simplified expressions of that chemistry. The purpose of this work is to provide the abstraction model to the Performance Assessment Project and the Waste Form Department for development of geochemical models of the waste package interior. The scope of this model report is to describe the development and validation of the in-package chemistry model and in-package chemistry model abstraction. The in-package chemistry model will consider chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) and codisposed high-level waste glass (HLWG) and N Reactor spent fuel (CDNR). The in-package chemistry model includes two sub-models, the first a water vapor condensation (WVC) model, where water enters a waste package as vapor and forms a film on the waste package components with subsequent film reactions with the waste package materials and waste form--this is a no-flow model, the reacted fluids do not exit the waste package via advection. The second sub-model of the in-package chemistry model is the seepage dripping model (SDM), where water, water that may have seeped into the repository from the surrounding rock, enters a failed waste package and reacts with the waste package components and waste form, and then exits the waste package with no accumulation of reacted water in the waste package. Both of the submodels of the in-package chemistry model are film models in contrast to past in-package chemistry models where all of the waste package pore space was filled with water. The current in-package

New results for loop integrals. AMBRE, CSectors, hexagon

International Nuclear Information System (INIS)

Gluza, Janusz; Kajda, Krzysztof

2009-03-01

We report on the three Mathematica packages hexagon, CSectors, AMBRE. They are useful for the evaluation of one- and two-loop Feynman integrals with a dependence on several kinematical scales. These integrals are typically needed for LHC and ILC applications, but also for higher order corrections at meson factories. hexagon is a new package for the tensor reduction of one-loop 5-point and 6-point functions with rank R=3 and R=4, respectively; AMBRE is a tool for derivations of Mellin-Barnes representations; CSectors is an interface for the package sectordecomposition and allows a convenient, direct evaluation of tensor Feynman integrals. (orig.)

System on Package (SoP) Millimeter Wave Filters for 5G Applications

KAUST Repository

Showail, Jameel

2018-05-01

Bandpass filters are an essential component of wireless communication systems that only transmits frequencies corresponding to the communication band and rejects all other frequencies. As the deployment of 5G draws nearer, first deployments are expected in 2020 [1], the need for viable filters at the new frequency bands becomes more imminent. Size and performance are two critical considerations for a filter that will be used in emerging mobile communication applications. The high frequency of 5G communication, 28 GHz as opposed to sub 6 GHz for nearly all previous communication protocols, means that previously utilized lumped component based solutions cannot be implemented since they are ill-suited for mm-wave applications. The focus of this work is the miniaturization of a high-performance filter. The Substrate Integrated Waveguide (SIW) is a high performance and promising structure and Low Temperature Co-Fired Ceramic (LTCC) is a high-performance material that both can operate at higher frequencies than the technologies used for previous telecommunication generations. To miniaturize the structure, a compact folded four-cavity SIW filter is designed, implemented and tested. The feeding structure is integrated into the filter to exploit the System on Package (SoP) attributes of LTCC and further reduce the total area of the filter individually and holistically when looking at the final integrated system. Two unique three dimensional (3D) integrated SoP LTCC two-stage SIW single cavity filters and one unique four-cavity filter all with embedded planar resonators are designed, fabricated and tested. The embedded resonators create a two-stage effect in a single cavity filter. The better single cavity design provides a 15% fractional bandwidth at a center frequency of 28.12 GHz, and with an insertion loss of -0.53 dB. The fabricated four-cavity filter has a 3-dB bandwidth of .98GHz centered at 27.465 GHz, and with an insertion loss of -2.66 dB. The designs presented

Color in packaging design : Case: ZheJiang JinSheng packaging Co,Ltd

OpenAIRE

Hu, Cuicui

2010-01-01

Color occupies an important position in packaging design, with the improvement of living standard, the higher requirement of color design in packaging. The aim of this thesis was to discuss key issues concerning aesthetics of packaging design. Topics will include an overview of the packaging design, the influence factor of packaging design, and introduce the aesthetics from packaging aspect. This thesis will also identify common problems of the production process, and list the phases of ho...

Packaging for Sustainability

CERN Document Server

Lewis, Helen; Fitzpatrick, Leanne

2012-01-01

The packaging industry is under pressure from regulators, customers and other stakeholders to improve packaging’s sustainability by reducing its environmental and societal impacts. This is a considerable challenge because of the complex interactions between products and their packaging, and the many roles that packaging plays in the supply chain. Packaging for Sustainability is a concise and readable handbook for practitioners who are trying to implement sustainability strategies for packaging. Industry case studies are used throughout the book to illustrate possible applications and scenarios. Packaging for Sustainability draws on the expertise of researchers and industry practitioners to provide information on business benefits, environmental issues and priorities, environmental evaluation tools, design for environment, marketing strategies, and challenges for the future.

CDIAC catalog of numeric data packages and computer model packages

International Nuclear Information System (INIS)

Boden, T.A.; Stoss, F.W.

1993-05-01

The Carbon Dioxide Information Analysis Center acquires, quality-assures, and distributes to the scientific community numeric data packages (NDPs) and computer model packages (CMPs) dealing with topics related to atmospheric trace-gas concentrations and global climate change. These packages include data on historic and present atmospheric CO 2 and CH 4 concentrations, historic and present oceanic CO 2 concentrations, historic weather and climate around the world, sea-level rise, storm occurrences, volcanic dust in the atmosphere, sources of atmospheric CO 2 , plants' response to elevated CO 2 levels, sunspot occurrences, and many other indicators of, contributors to, or components of climate change. This catalog describes the packages presently offered by CDIAC, reviews the processes used by CDIAC to assure the quality of the data contained in these packages, notes the media on which each package is available, describes the documentation that accompanies each package, and provides ordering information. Numeric data are available in the printed NDPs and CMPs, in CD-ROM format, and from an anonymous FTP area via Internet. All CDIAC information products are available at no cost

System-level integration of active silicon photonic biosensors

Science.gov (United States)

Laplatine, L.; Al'Mrayat, O.; Luan, E.; Fang, C.; Rezaiezadeh, S.; Ratner, D. M.; Cheung, K.; Dattner, Y.; Chrostowski, L.

2017-02-01

Biosensors based on silicon photonic integrated circuits have attracted a growing interest in recent years. The use of sub-micron silicon waveguides to propagate near-infrared light allows for the drastic reduction of the optical system size, while increasing its complexity and sensitivity. Using silicon as the propagating medium also leverages the fabrication capabilities of CMOS foundries, which offer low-cost mass production. Researchers have deeply investigated photonic sensor devices, such as ring resonators, interferometers and photonic crystals, but the practical integration of silicon photonic biochips as part of a complete system has received less attention. Herein, we present a practical system-level architecture which can be employed to integrate the aforementioned photonic biosensors. We describe a system based on 1 mm2 dies that integrate germanium photodetectors and a single light coupling device. The die are embedded into a 16x16 mm2 epoxy package to enable microfluidic and electrical integration. First, we demonstrate a simple process to mimic Fan-Out Wafer-level-Packaging, which enables low-cost mass production. We then characterize the photodetectors in the photovoltaic mode, which exhibit high sensitivity at low optical power. Finally, we present a new grating coupler concept to relax the lateral alignment tolerance down to +/- 50 μm at 1-dB (80%) power penalty, which should permit non-experts to use the biochips in a"plug-and-play" style. The system-level integration demonstrated in this study paves the way towards the mass production of low-cost and highly sensitive biosensors, and can facilitate their wide adoption for biomedical and agro-environmental applications.

equateIRT: An R Package for IRT Test Equating

Directory of Open Access Journals (Sweden)

Michela Battauz

2015-12-01

Full Text Available The R package equateIRT implements item response theory (IRT methods for equating different forms composed of dichotomous items. In particular, the IRT models included are the three-parameter logistic model, the two-parameter logistic model, the one-parameter logistic model and the Rasch model. Forms can be equated when they present common items (direct equating or when they can be linked through a chain of forms that present common items in pairs (indirect or chain equating. When two forms can be equated through different paths, a single conversion can be obtained by averaging the equating coefficients. The package calculates direct and chain equating coefficients. The averaging of direct and chain coefficients that link the same two forms is performed through the bisector method. Furthermore, the package provides analytic standard errors of direct, chain and average equating coefficients.

An Improved Supplier Driven Packaging Design and Development Method for Supply Chain Efficiency

DEFF Research Database (Denmark)

Sohrabpour, Vahid; Oghazi, Pejvak; Olsson, Annika

2016-01-01

and satisfaction in interaction with the product and packaging system. It also proposes a supply chain focused packaging design and development method to better satisfy supply chain needs placed on packaging. An extensive literature review was conducted, and a Tetra Pak derived case study was developed......Packaging and the role it plays in supply chain efficiency are overlooked in most design and development research. An opportunity exists to meet the needs of supply chains to increase efficiency. This research presents three propositions on how to reduce the gap between supply chain needs....... The propositions were formulated and became the basis for improving Tetra Pak's existing packaging design and development method by better integrating supply chain needs. This was accomplished by using an expanded operational life cycle perspective that includes the entire supply chain. The resulting supply chain...

Aqueous Corrosion Rates for Waste Package Materials

Energy Technology Data Exchange (ETDEWEB)

S. Arthur

2004-10-08

The purpose of this analysis, as directed by ''Technical Work Plan for: Regulatory Integration Modeling and Analysis of the Waste Form and Waste Package'' (BSC 2004 [DIRS 171583]), is to compile applicable corrosion data from the literature (journal articles, engineering documents, materials handbooks, or standards, and national laboratory reports), evaluate the quality of these data, and use these to perform statistical analyses and distributions for aqueous corrosion rates of waste package materials. The purpose of this report is not to describe the performance of engineered barriers for the TSPA-LA. Instead, the analysis provides simple statistics on aqueous corrosion rates of steels and alloys. These rates are limited by various aqueous parameters such as temperature (up to 100 C), water type (i.e., fresh versus saline), and pH. Corrosion data of materials at pH extremes (below 4 and above 9) are not included in this analysis, as materials commonly display different corrosion behaviors under these conditions. The exception is highly corrosion-resistant materials (Inconel Alloys) for which rate data from corrosion tests at a pH of approximately 3 were included. The waste package materials investigated are those from the long and short 5-DHLW waste packages, 2-MCO/2-DHLW waste package, and the 21-PWR commercial waste package. This analysis also contains rate data for some of the materials present inside the fuel canisters for the following fuel types: U-Mo (Fermi U-10%Mo), MOX (FFTF), Thorium Carbide and Th/U Carbide (Fort Saint Vrain [FSVR]), Th/U Oxide (Shippingport LWBR), U-metal (N Reactor), Intact U-Oxide (Shippingport PWR, Commercial), aluminum-based, and U-Zr-H (TRIGA). Analysis of corrosion rates for Alloy 22, spent nuclear fuel, defense high level waste (DHLW) glass, and Titanium Grade 7 can be found in other analysis or model reports.

Aqueous Corrosion Rates for Waste Package Materials

International Nuclear Information System (INIS)

Arthur, S.

2004-01-01

The purpose of this analysis, as directed by ''Technical Work Plan for: Regulatory Integration Modeling and Analysis of the Waste Form and Waste Package'' (BSC 2004 [DIRS 171583]), is to compile applicable corrosion data from the literature (journal articles, engineering documents, materials handbooks, or standards, and national laboratory reports), evaluate the quality of these data, and use these to perform statistical analyses and distributions for aqueous corrosion rates of waste package materials. The purpose of this report is not to describe the performance of engineered barriers for the TSPA-LA. Instead, the analysis provides simple statistics on aqueous corrosion rates of steels and alloys. These rates are limited by various aqueous parameters such as temperature (up to 100 C), water type (i.e., fresh versus saline), and pH. Corrosion data of materials at pH extremes (below 4 and above 9) are not included in this analysis, as materials commonly display different corrosion behaviors under these conditions. The exception is highly corrosion-resistant materials (Inconel Alloys) for which rate data from corrosion tests at a pH of approximately 3 were included. The waste package materials investigated are those from the long and short 5-DHLW waste packages, 2-MCO/2-DHLW waste package, and the 21-PWR commercial waste package. This analysis also contains rate data for some of the materials present inside the fuel canisters for the following fuel types: U-Mo (Fermi U-10%Mo), MOX (FFTF), Thorium Carbide and Th/U Carbide (Fort Saint Vrain [FSVR]), Th/U Oxide (Shippingport LWBR), U-metal (N Reactor), Intact U-Oxide (Shippingport PWR, Commercial), aluminum-based, and U-Zr-H (TRIGA). Analysis of corrosion rates for Alloy 22, spent nuclear fuel, defense high level waste (DHLW) glass, and Titanium Grade 7 can be found in other analysis or model reports

Time-domain single-source integral equations for analyzing scattering from homogeneous penetrable objects

KAUST Repository

Valdés, Felipe

2013-03-01

Single-source time-domain electric-and magnetic-field integral equations for analyzing scattering from homogeneous penetrable objects are presented. Their temporal discretization is effected by using shifted piecewise polynomial temporal basis functions and a collocation testing procedure, thus allowing for a marching-on-in-time (MOT) solution scheme. Unlike dual-source formulations, single-source equations involve space-time domain operator products, for which spatial discretization techniques developed for standalone operators do not apply. Here, the spatial discretization of the single-source time-domain integral equations is achieved by using the high-order divergence-conforming basis functions developed by Graglia alongside the high-order divergence-and quasi curl-conforming (DQCC) basis functions of Valdés The combination of these two sets allows for a well-conditioned mapping from div-to curl-conforming function spaces that fully respects the space-mapping properties of the space-time operators involved. Numerical results corroborate the fact that the proposed procedure guarantees accuracy and stability of the MOT scheme. © 2012 IEEE.

An integrated expert system for optimum in core fuel management

International Nuclear Information System (INIS)

Abd Elmoatty, Mona S.; Nagy, M.S.; Aly, Mohamed N.; Shaat, M.K.

2011-01-01

Highlights: → An integrated expert system constructed for optimum in core fuel management. → Brief discussion of the ESOIFM Package modules, inputs and outputs. → Package was applied on the DALAT Nuclear Research Reactor (0.5 MW). → The Package verification showed good agreement. - Abstract: An integrated expert system called Efficient and Safe Optimum In-core Fuel Management (ESOIFM Package) has been constructed to achieve an optimum in core fuel management and automate the process of data analysis. The Package combines the constructed mathematical models with the adopted artificial intelligence techniques. The paper gives a brief discussion of the ESOIFM Package modules, inputs and outputs. The Package was applied on the DALAT Nuclear Research Reactor (0.5 MW). Moreover, the data of DNRR have been used as a case study for testing and evaluation of ESOIFM Package. This paper shows the comparison between the ESOIFM Package burn-up results, the DNRR experimental burn-up data, and other DNRR Codes burn-up results. The results showed good agreement.

Institutional framework for integrated Pharmaceutical Benefits Management: results from a systematic review

Directory of Open Access Journals (Sweden)

Tomasz Roman Hermanowski

2015-09-01

Full Text Available Objectives: In this paper, we emphasised that effective management of health plans beneficiaries access to reimbursed medicines requires proper institutional set-up. The main objective was to identify and recommend an institutional framework of integrated pharmaceutical care providing effective, safe and equitable access to medicines. Method: The institutional framework of drug policy was derived on the basis of publications obtained by systematic reviews. A comparative analysis concerning adaptation of coordinated pharmaceutical care services in the USA, the UK, Poland, Italy, Denmark and Germany was performed. Results: While most European Union Member States promote the implementation of selected e-Health tools, like e-Prescribing, these efforts do not necessarily implement an integrated package. There is no single agent who would manage an insured patients’ access to medicines and health care in a coordinated manner, thereby increasing the efficiency and safety of drug policy. More attention should be paid by European Union Member States as to how to integrate various e-Health tools to enhance benefits to both individuals and societies. One solution could be to implement an integrated “pharmacy benefit management” model, which is well established in the USA and Canada and provides an integrated package of cost-containment methods, implemented within a transparent institutional framework and powered by strong motivation of the agent.

Examination Of Shipping Packages 9975-01818, 9975-01903 AND 9975-02287

International Nuclear Information System (INIS)

Daugherty, W.

2009-01-01

Three 9975 shipping packages were examined to investigate the non-conforming condition of an axial air gap greater than 1 inch. This condition typically indicates the presence of excess moisture in the fiberboard overpack, and may be accompanied by degradation in the fiberboard properties. The package with the largest axial air gap (9975-01818, with an air gap of 1.437 inches) was found to contain significant excess moisture, and the lower fiberboard assembly was covered with mold and was significantly degraded in strength. This condition is very similar to that observed previously in package 9975-01819. Both packages (-1818 and -1819) appear to contain a similar amount of excess moisture, which was previously estimated for 9975-01819 as ∼2.5 liters. The condition of 9975-01818 was also evidenced by several rust spots along the bottom chime of the drum, although no significant rust was noted on the closure bolts. Packages 9975-01903 and 9975-02287 were also examined. The axial air gap in these two packages was less than in 9975-01818, but still exceeded 1 inch. These two packages contained elevated moisture levels, although not significantly higher than seen in other 'typical' packages. The fiberboard in these two packages was of sound integrity, and appeared generally consistent with undegraded material. A few small patches of mold on and near the bottom of the fiberboard in 9975-01903 appeared dormant. No mold was observed on package 9975-02287. The SPA will provide recommendations on possible follow-up activities with these three packages. This might include a demonstration in SRNL of whether removal of the caplugs from similar packages would facilitate removal of excess moisture. Future efforts should also include an assessment of using the 1 inch axial gap criterion as a valid indicator of fiberboard degradation.

High quality single crystal Ge nano-membranes for opto-electronic integrated circuitry

Energy Technology Data Exchange (ETDEWEB)

Shah, V. A., E-mail: vishal.shah@warwick.ac.uk; Gammon, P. M. [Department of Engineering, The University of Warwick, Coventry CV4 7AL (United Kingdom); Department of Physics, The University of Warwick, Coventry CV4 7AL (United Kingdom); Rhead, S. D.; Halpin, J. E.; Trushkevych, O.; Wilson, N. R.; Myronov, M.; Edwards, R. S.; Patchett, D. H.; Allred, P. S.; Prest, M. J.; Whall, T. E.; Parker, E. H. C.; Leadley, D. R. [Department of Physics, The University of Warwick, Coventry CV4 7AL (United Kingdom); Chávez-Ángel, E. [ICN2-Institut Catala de Nanociencia i Nanotecnologia, Campus UAB, 08193 Bellaterra (Barcelona) (Spain); Department of Physics, UAB, 08193 Bellaterra (Barcelona) (Spain); Shchepetov, A.; Prunnila, M. [VTT Technical Research Centre of Finland, P.O. Box 1000, FI-02044 VTT, Espoo (Finland); Kachkanov, V.; Dolbnya, I. P. [Diamond Light Source, Harwell Science and Innovation Campus, Didcot, Oxfordshire OX11 0DE (United Kingdom); Reparaz, J. S. [ICN2-Institut Catala de Nanociencia i Nanotecnologia, Campus UAB, 08193 Bellaterra (Barcelona) (Spain); and others

2014-04-14

A thin, flat, and single crystal germanium membrane would be an ideal platform on which to mount sensors or integrate photonic and electronic devices, using standard silicon processing technology. We present a fabrication technique compatible with integrated-circuit wafer scale processing to produce membranes of thickness between 60 nm and 800 nm, with large areas of up to 3.5 mm{sup 2}. We show how the optical properties change with thickness, including appearance of Fabry-Pérot type interference in thin membranes. The membranes have low Q-factors, which allow the platforms to counteract distortion during agitation and movement. Finally, we report on the physical characteristics showing sub-nm roughness and a homogenous strain profile throughout the freestanding layer, making the single crystal Ge membrane an excellent platform for further epitaxial growth or deposition of materials.

High quality single crystal Ge nano-membranes for opto-electronic integrated circuitry

International Nuclear Information System (INIS)

Shah, V. A.; Gammon, P. M.; Rhead, S. D.; Halpin, J. E.; Trushkevych, O.; Wilson, N. R.; Myronov, M.; Edwards, R. S.; Patchett, D. H.; Allred, P. S.; Prest, M. J.; Whall, T. E.; Parker, E. H. C.; Leadley, D. R.; Chávez-Ángel, E.; Shchepetov, A.; Prunnila, M.; Kachkanov, V.; Dolbnya, I. P.; Reparaz, J. S.

2014-01-01

A thin, flat, and single crystal germanium membrane would be an ideal platform on which to mount sensors or integrate photonic and electronic devices, using standard silicon processing technology. We present a fabrication technique compatible with integrated-circuit wafer scale processing to produce membranes of thickness between 60 nm and 800 nm, with large areas of up to 3.5 mm 2 . We show how the optical properties change with thickness, including appearance of Fabry-Pérot type interference in thin membranes. The membranes have low Q-factors, which allow the platforms to counteract distortion during agitation and movement. Finally, we report on the physical characteristics showing sub-nm roughness and a homogenous strain profile throughout the freestanding layer, making the single crystal Ge membrane an excellent platform for further epitaxial growth or deposition of materials

Safety evaluation for packaging for 1720-DR sodium-filled tank

International Nuclear Information System (INIS)

Mercado, M.S.

1996-01-01

Preparations are under way to sell the sodium stored in the 1720-DR tank in the 1720-DR building. This will require that the tank, as well as the 1720-DR facility, be moved to the 300 Area, so that the sodium may be melted and transferred into a railroad tanker car. Because the sodium is a hazardous material and is being shipped in a nonspecification packaging, a safety evaluation for packaging (SEP) is required. This SEP approves the sodium-filled tank for a single shipment from the 105-DR area to the 300 Area

Edible packaging materials.

Science.gov (United States)

Janjarasskul, Theeranun; Krochta, John M

2010-01-01

Research groups and the food and pharmaceutical industries recognize edible packaging as a useful alternative or addition to conventional packaging to reduce waste and to create novel applications for improving product stability, quality, safety, variety, and convenience for consumers. Recent studies have explored the ability of biopolymer-based food packaging materials to carry and control-release active compounds. As diverse edible packaging materials derived from various by-products or waste from food industry are being developed, the dry thermoplastic process is advancing rapidly as a feasible commercial edible packaging manufacturing process. The employment of nanocomposite concepts to edible packaging materials promises to improve barrier and mechanical properties and facilitate effective incorporation of bioactive ingredients and other designed functions. In addition to the need for a more fundamental understanding to enable design to desired specifications, edible packaging has to overcome challenges such as regulatory requirements, consumer acceptance, and scaling-up research concepts to commercial applications.

A restructuring of CF package for MIDAS computer code

International Nuclear Information System (INIS)

Park, S. H.; Kim, K. R.; Kim, D. H.; Cho, S. W.

2004-01-01

CF package, which evaluates user-specified 'control functions' and applies them to define or control various aspects of computation, has been restructured for the MIDAS computer code. MIDAS is being developed as an integrated severe accident analysis code with a user-friendly graphical user interface and modernized data structure. To do this, data transferring methods of current MELCOR code are modified and adopted into the CF package. The data structure of the current MELCOR code using FORTRAN77 causes a difficult grasping of meaning of the variables as well as waste of memory, difficulty is more over because its data is location information of other package's data due to characteristics of CF package. New features of FORTRAN90 make it possible to allocate the storage dynamically and to use the user-defined data type, which lead to an efficient memory treatment and an easy understanding of the code. Restructuring of the CF package addressed in this paper includes module development, subroutine modification, and treats MELGEN, which generates data file, as well as MELCOR, which is processing a calculation. The verification has been done by comparing the results of the modified code with those from the existing code. As the trends are similar to each other, it hints that the same approach could be extended to the entire code package. It is expected that code restructuring will accelerate the code domestication thanks to direct understanding of each variable and easy implementation of modified or newly developed models

Loop integration results using numerical extrapolation for a non-scalar integral

International Nuclear Information System (INIS)

Doncker, E. de; Shimizu, Y.; Fujimoto, J.; Yuasa, F.; Kaugars, K.; Cucos, L.; Van Voorst, J.

2004-01-01

Loop integration results have been obtained using numerical integration and extrapolation. An extrapolation to the limit is performed with respect to a parameter in the integrand which tends to zero. Results are given for a non-scalar four-point diagram. Extensions to accommodate loop integration by existing integration packages are also discussed. These include: using previously generated partitions of the domain and roundoff error guards

Active Packaging Coatings

Directory of Open Access Journals (Sweden)

Luis J. Bastarrachea

2015-11-01

Full Text Available Active food packaging involves the packaging of foods with materials that provide an enhanced functionality, such as antimicrobial, antioxidant or biocatalytic functions. This can be achieved through the incorporation of active compounds into the matrix of the commonly used packaging materials, or by the application of coatings with the corresponding functionality through surface modification. The latter option offers the advantage of preserving the packaging materials’ bulk properties nearly intact. Herein, different coating technologies like embedding for controlled release, immobilization, layer-by-layer deposition, and photografting are explained and their potential application for active food packaging is explored and discussed.

Nuclear criticality safety analysis for the traveller PWR fuel shipping package

Energy Technology Data Exchange (ETDEWEB)

Vescovi, P.J.; Kent, N.A.; Casado, C.A. [Westinghouse Electric Co., LLC, Columbia, SC (United States)]|[ENUSA Industrias Avanzadas SA, Madrid (Spain)

2004-07-01

The Traveller PWR fresh fuel shipping package represents a radical departure from conventional PWR fuel package designs. Two immediately noticeable features of the Traveller are that it carries a single fuel assembly instead of two as do other package designs, and that it has built-in moderator, which forms part of the flux-trap system. The criticality safety case shows that the Traveller satisfies both U.S. and IAEA licensing requirements, and demonstrates that the package remains acceptably subcritical under normal conditions and hypothetical accident conditions of transport. This paper looks at the modeling techniques that were used to analyze the several accident scenarios that were considered, including: Lattice pitch expansion; Lattice pitch expansion along the fuel assembly length; Preferential flooding (selective flooding of different cavities); Differential flooding (varying water levels inside different cavities); Partial flooding (varying water density); Axial rod displacement; o Sensitivity studies of variable foam densities and boron content in packaging; Analysis for carrying loose rods in a rodbox; The criticality safety case for the Traveller proved to be a successful cooperative effort between ENUSA and Westinghouse.

Nuclear criticality safety analysis for the traveller PWR fuel shipping package

International Nuclear Information System (INIS)

Vescovi, P.J.; Kent, N.A.; Casado, C.A.

2004-01-01

The Traveller PWR fresh fuel shipping package represents a radical departure from conventional PWR fuel package designs. Two immediately noticeable features of the Traveller are that it carries a single fuel assembly instead of two as do other package designs, and that it has built-in moderator, which forms part of the flux-trap system. The criticality safety case shows that the Traveller satisfies both U.S. and IAEA licensing requirements, and demonstrates that the package remains acceptably subcritical under normal conditions and hypothetical accident conditions of transport. This paper looks at the modeling techniques that were used to analyze the several accident scenarios that were considered, including: Lattice pitch expansion; Lattice pitch expansion along the fuel assembly length; Preferential flooding (selective flooding of different cavities); Differential flooding (varying water levels inside different cavities); Partial flooding (varying water density); Axial rod displacement; o Sensitivity studies of variable foam densities and boron content in packaging; Analysis for carrying loose rods in a rodbox; The criticality safety case for the Traveller proved to be a successful cooperative effort between ENUSA and Westinghouse

WAPDEG Analysis of Waste Package and Drip shield Degradation

International Nuclear Information System (INIS)

K. Mon

2004-01-01

As directed by ''Technical Work Plan for: Regulatory Integration Modeling and Analysis of the Waste Form and Waste Package'' (BSC 2004 [DIRS 171583]), an analysis of the degradation of the engineered barrier system (EBS) drip shields and waste packages at the Yucca Mountain repository is developed. The purpose of this activity is to provide the TSPA with inputs and methodologies used to evaluate waste package and drip shield degradation as a function of exposure time under exposure conditions anticipated in the repository. This analysis provides information useful to satisfy ''Yucca Mountain Review Plan, Final Report'' (NRC 2003 [DIRS 163274]) requirements. Several features, events, and processes (FEPs) are also discussed (Section 6.2, Table 15). The previous revision of this report was prepared as a model report in accordance with AP-SIII.10Q, Models. Due to changes in the role of this report since the site recommendation, it no longer contains model development. This revision is prepared as a scientific analysis in accordance with AP-SIII.9Q, ''Scientific Analyses'' and uses models previously validated in (1) ''Stress Corrosion Cracking of the Drip Shield, the Waste Package Outer Barrier, and the Stainless Steel Structural Material'' (BSC 2004 [DIRS 169985]); (2) ''General Corrosion and Localized Corrosion of Waste Package Outer Barrier'' (BSC 2004 [DIRS 169984]); and (3) ''General Corrosion and Localized Corrosion of Drip Shield'' (BSC 2004 [DIRS 169845]). The integrated waste package degradation (IWPD) analysis presented in this report treats several implementation-related issues, such as defining the number and size of patches per waste package that undergo stress corrosion cracking; recasting the weld flaw analysis in a form as implemented in the Closure Weld Defects (CWD) software; and, general corrosion rate manipulations (e.g., change of scale in Section 6.3.4). The weld flaw portion of this report takes input from an engineering calculation (BSC 2004

Fluidic Logic Used in a Systems Approach to Enable Integrated Single-cell Functional Analysis

Directory of Open Access Journals (Sweden)

Naveen Ramalingam

2016-09-01

Full Text Available The study of single cells has evolved over the past several years to include expression and genomic analysis of an increasing number of single cells. Several studies have demonstrated wide-spread variation and heterogeneity within cell populations of similar phenotype. While the characterization of these populations will likely set the foundation for our understanding of genomic- and expression-based diversity, it will not be able to link the functional differences of a single cell to its underlying genomic structure and activity. Currently, it is difficult to perturb single cells in a controlled environment, monitor and measure the response due to perturbation, and link these response measurements to downstream genomic and transcriptomic analysis. In order to address this challenge, we developed a platform to integrate and miniaturize many of the experimental steps required to study single-cell function. The heart of this platform is an elastomer-based Integrated Fluidic Circuit (IFC that uses fluidic logic to select and sequester specific single cells based on a phenotypic trait for downstream experimentation. Experiments with sequestered cells that have been performed include on-chip culture, exposure to a variety of stimulants, and post-exposure image-based response analysis, followed by preparation of the mRNA transcriptome for massively parallel sequencing analysis. The flexible system embodies experimental design and execution that enable routine functional studies of single cells.

Monolithically Integrated Light Feedback Control Circuit for Blue/UV LED Smart Package

NARCIS (Netherlands)

Koladouz Esfahani, Z.; Tohidian, M.; van Zeijl, H.W.; Kolahdouz, Mohammadreza; Zhang, G.Q.

2017-01-01

Given the performance decay of high-power light-emitting diode (LED) chips over time and package condition changes, having a reliable output light for sensitive applications is a point of concern. In this study, a light feedback control circuit, including blue-selective photodiodes, for

Effects of gamma irradiation on Commercial Food Packaging films

International Nuclear Information System (INIS)

Cabalar, P.J.; Abad, L.V.; Laurio, C.

2015-01-01

Gamma Radiation is a well-known technology to inactivate bacterial pathogens in food products. Currently, there is a growing interest in this technology considering its advantage of being a non-thermal process and the convenience of food being pre-packaged in its final form before treatment that prevents possible recontamination. The process of irradiating pre-packaged food requires that appropriate packaging materials are chosen as this would play a vital role in the quality assessment and safety evaluation of the irradiated products. Irradiation can cause changes to the packaging materials that might affect its integrity and functionality as a barrier e.g. to chemical or microbial contamination. Likewise, components of packaging materials that have been irradiated may migrate to food as a result of irradiation. Hence, this study was conducted to screen locally available commercial packaging films and determine its effect with radiation. Commercials packaging films made up of PET / FOIL / PE, Plain PET 12 / Foil 7 / PE 100, VMPET 12 / PE 70, OPP 20 / Foil 6.5 / PE 40, PET 12 / CPS 40, PET 12 / PE 50, Laminated PET / PE, Nylon / PE, and Nylon 15 / PE 50 were investigated for its effect with gamma radiation at 10 kGy. Their mechanical and thermal properties generally did not show any changes after irradiation except for OPP 20/ Foil 6.5 / PE 40. Gel Permeation Chromatography of leachates from water samples detected the presence of high molecular weight radiolytic products especially from laminated PET/PE films. Radiation effects were minimal for VMPET12/PE70, Nylon/PE and Nylon 15/PE 50 films. Preliminary results, using the stable isotope technique, to study the leachates in the water samples in contact with the packaging materials reveal an indicative increase in δ"1"8O"0/_0_0 and δD 0/_0_0.(author)

Safety Analysis Report for packaging (onsite) steel waste package

International Nuclear Information System (INIS)

BOEHNKE, W.M.

2000-01-01

The steel waste package is used primarily for the shipment of remote-handled radioactive waste from the 324 Building to the 200 Area for interim storage. The steel waste package is authorized for shipment of transuranic isotopes. The maximum allowable radioactive material that is authorized is 500,000 Ci. This exceeds the highway route controlled quantity (3,000 A 2 s) and is a type B packaging

Integrated Transmission Electron and Single-Molecule Fluorescence Microscopy Correlates Reactivity with Ultrastructure in a Single Catalyst Particle

OpenAIRE

Hendriks, Frank C.; Mohammadian, Sajjad; Ristanovic, Zoran; Kalirai, Samanbir; Meirer, Florian; Vogt, Eelco T. C.; Bruijnincx, Pieter C. A.; Gerritsen, Hans; Weckhuysen, Bert M.

2018-01-01

Establishing structure–activity relationships in complex, hierarchically structured nanomaterials, such as fluid catalytic cracking (FCC) catalysts, requires characterization with complementary, correlated analysis techniques. An integrated setup has been developed to perform transmission electron microscopy (TEM) and single-molecule fluorescence (SMF) microscopy on such nanostructured samples. Correlated structure–reactivity information was obtained for 100 nm thin, microtomed sections of a ...

PRIDE Surveillance Projects Data Packaging Project Information Package Specification Version 1.1

Energy Technology Data Exchange (ETDEWEB)

Kelleher, D. M.; Shipp, R. L.; Mason, J. D.

2010-08-31

Information Package Specification version 1.1 describes an XML document format called an information package that can be used to store information in information management systems and other information archives. An information package consists of package information, the context required to understand and use that information, package metadata that describes the information, and XML signatures that protect the information. The information package described in this specification was designed to store Department of Energy (DOE) and National Nuclear Security Administration (NNSA) information and includes the metadata required for that information: a unique package identifier, information marking that conforms to DOE and NNSA requirements, and access control metadata. It is an implementation of the Open Archival Information System (OAIS) Reference Model archival information package tailored to meet NNSA information storage requirements and designed to be used in the computing environments at the Y-12 National Security Complex and at other NNSA sites.

AN ADA LINEAR ALGEBRA PACKAGE MODELED AFTER HAL/S

Science.gov (United States)

Klumpp, A. R.

1994-01-01

This package extends the Ada programming language to include linear algebra capabilities similar to those of the HAL/S programming language. The package is designed for avionics applications such as Space Station flight software. In addition to the HAL/S built-in functions, the package incorporates the quaternion functions used in the Shuttle and Galileo projects, and routines from LINPAK that solve systems of equations involving general square matrices. Language conventions in this package follow those of HAL/S to the maximum extent practical and minimize the effort required for writing new avionics software and translating existent software into Ada. Valid numeric types in this package include scalar, vector, matrix, and quaternion declarations. (Quaternions are fourcomponent vectors used in representing motion between two coordinate frames). Single precision and double precision floating point arithmetic is available in addition to the standard double precision integer manipulation. Infix operators are used instead of function calls to define dot products, cross products, quaternion products, and mixed scalar-vector, scalar-matrix, and vector-matrix products. The package contains two generic programs: one for floating point, and one for integer. The actual component type is passed as a formal parameter to the generic linear algebra package. The procedures for solving systems of linear equations defined by general matrices include GEFA, GECO, GESL, and GIDI. The HAL/S functions include ABVAL, UNIT, TRACE, DET, INVERSE, TRANSPOSE, GET, PUT, FETCH, PLACE, and IDENTITY. This package is written in Ada (Version 1.2) for batch execution and is machine independent. The linear algebra software depends on nothing outside the Ada language except for a call to a square root function for floating point scalars (such as SQRT in the DEC VAX MATHLIB library). This program was developed in 1989, and is a copyrighted work with all copyright vested in NASA.

HPLOT: the graphics interface package for the HBOOK histogramming package

International Nuclear Information System (INIS)

Watkins, H.

1978-01-01

The subroutine package HPLOT described in this report, enables the CERN histogramming package HBOOK to produce high-quality pictures by means of high-resolution devices such as plotters. HPLOT can be implemented on any scientific computing system with a Fortran IV compiler and can be interfaced with any graphics package; spectral routines in addition to the basic ones enable users to embellish their histograms. Examples are also given of the use of HPLOT as a graphics package for plotting simple pictures without histograms. (Auth.)

Package

Directory of Open Access Journals (Sweden)

Arsić Zoran

2013-01-01

Full Text Available It is duty of the seller to pack the goods in a manner which assures their safe arrival and enables their handling in transit and at the place of destination. The problem of packing is relevant in two main respects. First of all the buyer is in certain circumstances entitled to refuse acceptance of the goods if they are not properly packed. Second, the package is relevant to calculation of price and freight based on weight. In the case of export trade, the package should conform to the legislation in the country of destination. The impact of package on environment is regulated by environment protection regulation of Republic if Serbia.

Time-domain single-source integral equations for analyzing scattering from homogeneous penetrable objects

KAUST Repository

Valdé s, Felipe; Andriulli, Francesco P.; Bagci, Hakan; Michielssen, Eric

2013-01-01

Single-source time-domain electric-and magnetic-field integral equations for analyzing scattering from homogeneous penetrable objects are presented. Their temporal discretization is effected by using shifted piecewise polynomial temporal basis

Integrated Spectral Energy Distributions and Absorption Feature Indices of Single Stellar Populations

OpenAIRE

Zhang, Fenghui; Han, Zhanwen; Li, Lifang; Hurley, Jarrod R.

2004-01-01

Using evolutionary population synthesis, we present integrated spectral energy distributions and absorption-line indices defined by the Lick Observatory image dissector scanner (referred to as Lick/IDS) system, for an extensive set of instantaneous burst single stellar populations (SSPs). The ages of the SSPs are in the range 1-19 Gyr and the metallicities [Fe/H] are in the range -2.3 - 0.2. Our models use the rapid single stellar evolution algorithm of Hurley, Pols and Tout for the stellar e...

Packaging-radiation disinfestation relationships

International Nuclear Information System (INIS)

Highland, H.A.

1985-01-01

Foods that are susceptible to insect infestation can be irradiated to destroy the infestation; however, the food must be kept essentially insect-free until consumed, or it must be disinfested again, perhaps repeatedly. Insect-resistant packages can be used to prevent reinfestation, but there are certain requirements that must be fulfilled before a package can be made insect resistant. These include the use of insect-light construction and packaging materials that resist boring insects. The relative insect resistance of various packages and packaging materials is discussed, as are behavior traits such as egressive boring that enables insects to escape from packages and the ability of insects to climb on various packaging materials. Some successful and unsuccessful attempts to make various types of packages insect resistant are discussed, as are factors that must be considered in the selection or development of insect-resistant packages for radiation disinfested foods. The latter factors include biological and physical environments, length of storage periods, stresses on packages during shipment, types of storage facilities, governmental regulations, health requirements, and others

Microfluidic device for continuous single cells analysis via Raman spectroscopy enhanced by integrated plasmonic nanodimers

DEFF Research Database (Denmark)

Perozziello, Gerardo; Candeloro, Patrizio; De Grazia, Antonio

2016-01-01

In this work a Raman flow cytometer is presented. It consists of a microfluidic device that takes advantages of the basic principles of Raman spectroscopy and flow cytometry. The microfluidic device integrates calibrated microfluidic channels-where the cells can flow one-by-one -, allowing single...... cell Raman analysis. The microfluidic channel integrates plasmonic nanodimers in a fluidic trapping region. In this way it is possible to perform Enhanced Raman Spectroscopy on single cell. These allow a label-free analysis, providing information about the biochemical content of membrane and cytoplasm...

Packaging Printing Today

Directory of Open Access Journals (Sweden)

Stanislav Bolanča

2015-12-01

Full Text Available Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. The possibilities of particular printing techniques for optimal production of the determined packaging were studied in the paper. The problem was viewed from the technological and economical aspect. The possible printing quality and the time necessary for the printing realization were taken as key parameters. An important segment of the production and the way of life is alocation value and it had also found its place in this paper. The events in the field of packaging printing in the whole world were analyzed. The trends of technique developments and the printing technology for packaging printing in near future were also discussed.

“Packaging Logistics” for improving performance in supply chains: the role of meta-standards implementation

Directory of Open Access Journals (Sweden)

Jesús García-Arca

2016-06-01

Full Text Available Abstract Integrated packaging design process arises as one key factor that could contribute to increasing the efficiency and sustainability of supply chains. This approach is called “packaging logistics”. Another managerial approach that is related to efficiency and sustainability is the implementation of “meta-standards” (ISO 9000 and ISO 14000. As both “packaging logistics” and “meta-standards” can contribute positively towards supply chain efficiency and sustainability, it becomes relevant to examine the relationship between them. In this study, we explore the potential relation between “meta-standards” (ISO 9000 and ISO 14000 and the implementation of the key aspects of “packaging logistics”. In addition, we explore the relation between “packaging logistics” and aspects of performance. This is accomplished through an exploratory study of the packaging design process of Spanish manufacturers in the food industry.

Safety Analysis Report for packaging (onsite) steel waste package

Energy Technology Data Exchange (ETDEWEB)

BOEHNKE, W.M.

2000-07-13

The steel waste package is used primarily for the shipment of remote-handled radioactive waste from the 324 Building to the 200 Area for interim storage. The steel waste package is authorized for shipment of transuranic isotopes. The maximum allowable radioactive material that is authorized is 500,000 Ci. This exceeds the highway route controlled quantity (3,000 A{sub 2}s) and is a type B packaging.

Utilization of Pb-free solders in MEMS packaging

Science.gov (United States)

Selvaduray, Guna S.

2003-01-01

Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

LISA - a powerful program package for LIstmode and Spectral data Analysis

International Nuclear Information System (INIS)

Oberstedt, A.; Hambsch, F.J.

1994-01-01

LISA is a graphical program package which enables both off-line listmode and spectral data evaluation as well as on-line monitoring while multi-parameter experiments are running. It can be executed on every computer with a UNIX operating system and an X-WINDOW environment, running PV-WAVE from Visual Numerics Incorporation. This package is basically written in the language PV-WAVE CL, but integration of procedures written in the C-language and execution of UNIX shell commands lead to an additional increase of performance. (orig.)

An integrated single- and two-photon non-diffracting light-sheet microscope

Science.gov (United States)

Lau, Sze Cheung; Chiu, Hoi Chun; Zhao, Luwei; Zhao, Teng; Loy, M. M. T.; Du, Shengwang

2018-04-01

We describe a fluorescence optical microscope with both single-photon and two-photon non-diffracting light-sheet excitations for large volume imaging. With a special design to accommodate two different wavelength ranges (visible: 400-700 nm and near infrared: 800-1200 nm), we combine the line-Bessel sheet (LBS, for single-photon excitation) and the scanning Bessel beam (SBB, for two-photon excitation) light sheet together in a single microscope setup. For a transparent thin sample where the scattering can be ignored, the LBS single-photon excitation is the optimal imaging solution. When the light scattering becomes significant for a deep-cell or deep-tissue imaging, we use SBB light-sheet two-photon excitation with a longer wavelength. We achieved nearly identical lateral/axial resolution of about 350/270 nm for both imagings. This integrated light-sheet microscope may have a wide application for live-cell and live-tissue three-dimensional high-speed imaging.

Packaging of structural health monitoring components

Science.gov (United States)

Kessler, Seth S.; Spearing, S. Mark; Shi, Yong; Dunn, Christopher T.

2004-07-01

Structural Health Monitoring (SHM) technologies have the potential to realize economic benefits in a broad range of commercial and defense markets. Previous research conducted by Metis Design and MIT has demonstrated the ability of Lamb waves methods to provide reliable information regarding the presence, location and type of damage in composite specimens. The present NSF funded program was aimed to study manufacturing, packaging and interface concepts for critical SHM components. The intention is to be able to cheaply manufacture robust actuating/sensing devices, and isolate them from harsh operating environments including natural, mechanical, or electrical extremes. Currently the issues related to SHM system durability have remained undressed. During the course of this research several sets of test devices were fabricated and packaged to protect the piezoelectric component assemblies for robust operation. These assemblies were then tested in hot and wet conditions, as well as in electrically noisy environments. Future work will aim to package the other supporting components such as the battery and wireless chip, as well as integrating all of these components together for operation. SHM technology will enable the reduction or complete elimination of scheduled inspections, and will allow condition-based maintenance for increased reliability and reduced overall life-cycle costs.

Packaging Printing Today

OpenAIRE

Stanislav Bolanča; Igor Majnarić; Kristijan Golubović

2015-01-01

Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. T...

Integrating single-cell transcriptomic data across different conditions, technologies, and species.

Science.gov (United States)

Butler, Andrew; Hoffman, Paul; Smibert, Peter; Papalexi, Efthymia; Satija, Rahul

2018-06-01

Computational single-cell RNA-seq (scRNA-seq) methods have been successfully applied to experiments representing a single condition, technology, or species to discover and define cellular phenotypes. However, identifying subpopulations of cells that are present across multiple data sets remains challenging. Here, we introduce an analytical strategy for integrating scRNA-seq data sets based on common sources of variation, enabling the identification of shared populations across data sets and downstream comparative analysis. We apply this approach, implemented in our R toolkit Seurat (http://satijalab.org/seurat/), to align scRNA-seq data sets of peripheral blood mononuclear cells under resting and stimulated conditions, hematopoietic progenitors sequenced using two profiling technologies, and pancreatic cell 'atlases' generated from human and mouse islets. In each case, we learn distinct or transitional cell states jointly across data sets, while boosting statistical power through integrated analysis. Our approach facilitates general comparisons of scRNA-seq data sets, potentially deepening our understanding of how distinct cell states respond to perturbation, disease, and evolution.

Overview of the RPV-2 and INTERN-1 packages: From primary damage to microplasticity

International Nuclear Information System (INIS)

Adjanor, G.; Bugat, S.; Domain, C.; Barbu, A.

2010-01-01

In the framework of the European project PERFECT, four multiscale simulation packages dedicated to the prediction of evolution of material properties were developed. Among them, the RPV-2 and INTERN-1 are two simulation sequences of similar structure dealing with radiation damage in the reactor pressure vessel and the reactor internal structures, respectively. Both start at the atomic scale, where the neutron spectrum of the specified reactor is used to determine the energy distribution of the primary knocked-on atoms (PKA). A database of molecular dynamics results is then used to integrate the instantaneous production of defect clusters resulting from the displacement cascades initiated by each PKA. Depending on the type of calculation chosen to model long-term diffusion and reactions of defect clusters, precipitates and mixed-clusters, this primary damage enters either in rate equations or in Object Kinetic Monte Carlo simulations. The later correspond to a more accurate (but also more computationally demanding) physical model for diffusion as positions of objects on a lattice are explicitly treated. Finally, the increase of critical resolved shear stress is estimated from these cluster distributions either using an analytical model, taking into account the self and mutual dipole interactions of dislocations pinned on randomly dispersed unshearable obstacles, or by simulating the glide of a single dislocation line in its main slip system. Dislocation dynamics simulations were already used to validate some of the assumptions of the latter models, and will be fully integrated in the next versions of the packages.

Assessing tobacco marketing receptivity among youth: integrating point of sale marketing, cigarette package branding and branded merchandise.

Science.gov (United States)

Braun, Sandra; Kollath-Cattano, Christy; Barrientos, Inti; Mejía, Raúl; Morello, Paola; Sargent, James D; Thrasher, James F

2016-11-01

As countries prohibit tobacco marketing through traditional channels, marketing at point of sale (PoS) and through tobacco packaging is increasingly important for promoting tobacco consumption. Assess the validity of a novel marketing receptivity index that considers frequency of PoS exposures, tobacco brand recall and ownership of branded merchandise. Data come from a cross-sectional survey of 3172 secondary school students in Argentina. Questions assessed frequency of going to stores where tobacco is often sold; cued recall of brand names for 3 cigarette packages with brand name removed and ownership of branded merchandise. A four-level marketing receptivity index was derived: low PoS exposure only; high PoS exposure or recall of 1 brand; recall of 2 or more brands; and ownership of branded merchandise. Indicators of marketing receptivity and smoking involvement were regressed on the index, including in adjusted models that controlled for sociodemographics, social influences and sensation seeking. Among never-smokers, the index had independent positive associations with smoking susceptibility (ie, adjusted OR (AOR) 2v1 =1.66; AOR 3v1 =1.64; AOR 4v1 =2.95), willingness to try a specific brand (ie, AOR 2v1 =1.45; AOR 3v1 =2.38; AOR 4v1 =2.20) and positive smoking expectancies (ie, B adj 2v1 =0.09; B adj 3v1 =0.18; B adj 4v1 =0.34). A more marked dose-response independent association was found with current smoking behaviour (ie, AOR 2v1 =2.47; AOR 3v1 =3.16; AOR 4v1 =3.62). The marketing receptivity index was associated with important variation in smoking-related perceptions, intentions and behaviour among Argentine adolescents. Future research should determine the predictive validity and generalisability of this measure to other contexts, including the explanatory power gained by integrating cigarette package brand recognition tasks. Published by the BMJ Publishing Group Limited. For permission to use (where not already granted under a licence) please go to http://www.bmj.com/company/products-services/rights-and-licensing/.

Signal Integrity Analysis in Single and Bundled Carbon Nanotube Interconnects

International Nuclear Information System (INIS)

Majumder, M.K.; Pandya, N.D.; Kaushik, B.K.; Manhas, S.K.

2013-01-01

Carbon nanotube (CN T) can be considered as an emerging interconnect material in current nano scale regime. They are more promising than other interconnect materials such as Al or Cu because of their robustness to electromigration. This research paper aims to address the crosstalk-related issues (signal integrity) in interconnect lines. Different analytical models of single- (SWCNT), double- (DWCNT), and multiwalled CNTs (MWCNT) are studied to analyze the crosstalk delay at global interconnect lengths. A capacitively coupled three-line bus architecture employing CMOS driver is used for accurate estimation of crosstalk delay. Each line in bus architecture is represented with the equivalent RLC models of single and bundled SWCNT, DWCNT, and MWCNT interconnects. Crosstalk delay is observed at middle line (victim) when it switches in opposite direction with respect to the other two lines (aggressors). Using the data predicted by ITRS 2012, a comparative analysis on the basis of crosstalk delay is performed for bundled SWCNT/DWCNT and single MWCNT interconnects. It is observed that the overall crosstalk delay is improved by 40.92% and 21.37% for single MWCNT in comparison to bundled SWCNT and bundled DWCNT interconnects, respectively.

Progress and challenges associated with halal authentication of consumer packaged goods.

Science.gov (United States)

Premanandh, Jagadeesan; Bin Salem, Samara

2017-11-01

Abusive business practices are increasingly evident in consumer packaged goods. Although consumers have the right to protect themselves against such practices, rapid urbanization and industrialization result in greater distances between producers and consumers, raising serious concerns on the supply chain. The operational complexities surrounding halal authentication pose serious challenges on the integrity of consumer packaged goods. This article attempts to address the progress and challenges associated with halal authentication. Advancement and concerns on the application of new, rapid analytical methods for halal authentication are discussed. The significance of zero tolerance policy in consumer packaged foods and its impact on analytical testing are presented. The role of halal assurance systems and their challenges are also considered. In conclusion, consensus on the establishment of one standard approach coupled with a sound traceability system and constant monitoring would certainly improve and ensure halalness of consumer packaged goods. © 2017 Society of Chemical Industry. © 2017 Society of Chemical Industry.

Monitoring and inspection techniques for long term storage of higher activity waste packages

International Nuclear Information System (INIS)

Bolton, Gary

2013-01-01

In 2009, following recent changes in United Kingdom (UK) Government Policy, the Nuclear Decommissioning Authority (NDA) identified a knowledge gap in the area of long term interim storage of waste packages. A cross-industry Integrated Project Team (IPT) for Interim Storage was created with responsibility for delivering Industry Guidance on the storage of packaged Higher Activity Waste (HAW) for the current UK civil decommissioning and clean-up programmes. This included a remit to direct research and development projects via the NDA's Direct Research Portfolio (DRP) to fill the knowledge gap. The IPT for Interim Storage published Industry Guidance in 2012 which established a method to define generic package performance criteria and made recommendations on monitoring and inspection. The package performance method consists of the following steps; identification of the package safety function, identification of evolutionary processes that may affect safety function performance, determination of measurable indicators of these evolutionary processes and calibration of the indicators into package performance zones. This article provides an overview of three projects funded by the NDA's DRP that the UK National Nuclear Laboratory (NNL) have completed to address monitoring and inspection needs of waste packages in interim storage. (orig.)

Proposed Ancestors of Phage Nucleic Acid Packaging Motors (and Cells

Directory of Open Access Journals (Sweden)

Philip Serwer

2011-07-01

Full Text Available I present a hypothesis that begins with the proposal that abiotic ancestors of phage RNA and DNA packaging systems (and cells include mobile shells with an internal, molecule-transporting cavity. The foundations of this hypothesis include the conjecture that current nucleic acid packaging systems have imprints from abiotic ancestors. The abiotic shells (1 initially imbibe and later also bind and transport organic molecules, thereby providing a means for producing molecular interactions that are links in the chain of events that produces ancestors to the first molecules that are both information carrying and enzymatically active, and (2 are subsequently scaffolds on which proteins assemble to form ancestors common to both shells of viral capsids and cell membranes. Emergence of cells occurs via aggregation and merger of shells and internal contents. The hypothesis continues by using proposed imprints of abiotic and biotic ancestors to deduce an ancestral thermal ratchet-based DNA packaging motor that subsequently evolves to integrate a DNA packaging ATPase that provides a power stroke.

Structural and Thermal Safety Analysis Report for the Type B Radioactive Waste Transport Package

Energy Technology Data Exchange (ETDEWEB)

Kim, D. H.; Seo, K. S.; Lee, J. C.; Bang, K. S

2007-09-15

We carried out structural safety evaluation for the type B radioactive waste transport package. Requirements for type B packages according to the related regulations such as IAEA Safety Standard Series No. TS-R-1, Korea Most Act. 2001-23 and US 10 CFR Part 71 were evaluated. General requirements for packages such as those for a lifting attachment, a tie-down attachment and pressure condition were considered. For the type B radioactive waste transport package, the structural, thermal and containment analyses were carried out under the normal transport conditions. Also the safety analysis were conducted under the accidental transport conditions. The 9 m drop test, 1 m puncture test, fire test and water immersion test under the accidental transport conditions were consecutively done. The type B radioactive waste transport packages were maintained the structural and thermal integrities.

Thermal Management of Power Semiconductor Packages - Matching Cooling Technologies with Packaging Technologies (Presentation)

Energy Technology Data Exchange (ETDEWEB)

Bennion, K.; Moreno, G.

2010-04-27

Heat removal for power semiconductor devices is critical for robust operation. Because there are different packaging options, different thermal management technologies, and a range of applications, there is a need for a methodology to match cooling technologies and package configurations to target applications. To meet this need, a methodology was developed to compare the sensitivity of cooling technologies on the overall package thermal performance over a range of power semiconductor packaging configurations. The results provide insight into the trade-offs associated with cooling technologies and package configurations. The approach provides a method for comparing new developments in power semiconductor packages and identifying potential thermal control technologies for the package. The results can help users select the appropriate combination of packaging configuration and cooling technology for the desired application.

Desired, Perceived, and Achieved Sustainability: Trade-Offs in Strategic and Operational Packaging Development

Directory of Open Access Journals (Sweden)

Bjorn de Koeijer

2017-10-01

Full Text Available The alignment of the strategic and the operational level of packaging development in relation to the integration of sustainability is not addressed extensively in current research. This paper aims to address this, by focusing on the decision-making interrelations of key actors (marketing and packaging development within multidisciplinary product-packaging development teams. The research is conducted by means of a qualitative approach, consisting of semi-structured interviews with individual packaging development team members, complemented with a newly developed visualization tool. The research builds upon eight cases within brand owners, packaging material suppliers and packaging development consultants. The main findings of the study include the decision-making trade-offs between sustainability considerations and other project indicators, such as costs, time-to-market and technical challenges. These trade-offs are linked to the strategic and operational roles of key actors, and to internal and external factors influencing sustainable development processes. This research’s contribution is to address the alignment of the strategic and the operational levels of sustainable packaging development, in relation to (1 decision making and interrelations within multidisciplinary development teams; and (2 the relevance of development-influencing factors. This provides opportunities for further development of sustainable packaging models and tools, in order to align the strategic and operational level of development.

NRF TRIGA packaging

International Nuclear Information System (INIS)

Clements, M.D.

1995-11-01

Training Reactor Isotopes, General Atomics (TRIGA reg-sign) Reactors are in use at four US Department of Energy (DOE) complex facilities and at least 23 university, commercial, or government facilities. The development of the Neutron Radiography Facility (NRF) TRIGA packaging system began in October 1993. The Hanford Site NRF is being shut down and requires an operationally user-friendly transportation and storage packaging system for removal of the TRIGA fuel elements. The NRF TRIGA packaging system is designed to remotely remove the fuel from the reactor and transport the fuel to interim storage (up to 50 years) on the Hanford Site. The packaging system consists of a cask and an overpack. The overpack is used only for transport and is not necessary for storage. Based upon the cask's small size and light weight, small TRIGA reactors will find it versatile for numerous refueling and fuel storage needs. The NRF TRIGA packaging design also provides the basis for developing a certifiable and economical packaging system for other TRIGA reactor facilities. The small size of the NRF TRIGA cask also accommodates placing the cask into a larger certified packaging for offsite transport. The Westinghouse Hanford Company NRF TRIGA packaging, as described herein can serve other DOE sites for their onsite use, and the design can be adapted to serve university reactor facilities, handling a variety of fuel payloads

Vision for single flux quantum very large scale integrated technology

International Nuclear Information System (INIS)

Silver, Arnold; Bunyk, Paul; Kleinsasser, Alan; Spargo, John

2006-01-01

Single flux quantum (SFQ) electronics is extremely fast and has very low on-chip power dissipation. SFQ VLSI is an excellent candidate for high-performance computing and other applications requiring extremely high-speed signal processing. Despite this, SFQ technology has generally not been accepted for system implementation. We argue that this is due, at least in part, to the use of outdated tools to produce SFQ circuits and chips. Assuming the use of tools equivalent to those employed in the semiconductor industry, we estimate the density of Josephson junctions, circuit speed, and power dissipation that could be achieved with SFQ technology. Today, CMOS lithography is at 90-65 nm with about 20 layers. Assuming equivalent technology, aggressively increasing the current density above 100 kA cm -2 to achieve junction speeds approximately 1000 GHz, and reducing device footprints by converting device profiles from planar to vertical, one could expect to integrate about 250 M Josephson junctions cm -2 into SFQ digital circuits. This should enable circuit operation with clock frequencies above 200 GHz and place approximately 20 K gates within a radius of one clock period. As a result, complete microprocessors, including integrated memory registers, could be fabricated on a single chip

Vision for single flux quantum very large scale integrated technology

Energy Technology Data Exchange (ETDEWEB)

Silver, Arnold [Northrop Grumman Space Technology, One Space Park, Redondo Beach, CA 90278 (United States); Bunyk, Paul [Northrop Grumman Space Technology, One Space Park, Redondo Beach, CA 90278 (United States); Kleinsasser, Alan [Jet Propulsion Laboratory, 4800 Oak Grove Drive, Pasadena, CA 91109-8099 (United States); Spargo, John [Northrop Grumman Space Technology, One Space Park, Redondo Beach, CA 90278 (United States)

2006-05-15

Single flux quantum (SFQ) electronics is extremely fast and has very low on-chip power dissipation. SFQ VLSI is an excellent candidate for high-performance computing and other applications requiring extremely high-speed signal processing. Despite this, SFQ technology has generally not been accepted for system implementation. We argue that this is due, at least in part, to the use of outdated tools to produce SFQ circuits and chips. Assuming the use of tools equivalent to those employed in the semiconductor industry, we estimate the density of Josephson junctions, circuit speed, and power dissipation that could be achieved with SFQ technology. Today, CMOS lithography is at 90-65 nm with about 20 layers. Assuming equivalent technology, aggressively increasing the current density above 100 kA cm{sup -2} to achieve junction speeds approximately 1000 GHz, and reducing device footprints by converting device profiles from planar to vertical, one could expect to integrate about 250 M Josephson junctions cm{sup -2} into SFQ digital circuits. This should enable circuit operation with clock frequencies above 200 GHz and place approximately 20 K gates within a radius of one clock period. As a result, complete microprocessors, including integrated memory registers, could be fabricated on a single chip.

Equilibrium moisture content of waste mixtures from post-consumer carton packaging.

Science.gov (United States)

Bacelos, M S; Freire, J T

2012-01-01

The manufacturing of boards and roof tiles is one of the routes to reuse waste from the recycled-carton-packaging process. Such a process requires knowledge of the hygroscopic behaviour of these carton-packaging waste mixtures in order to guarantee the quality of the final product (e.g. boards and roof tiles). Thus, with four carton-packaging waste mixtures of selected compositions (A, B, C and D), the sorption isotherms were obtained at air temperature of 20, 40 and 60 degrees C by using the static method. This permits one to investigate which model can relate the equilibrium moisture content of the mixture with that of a pure component through the mass fraction of each component in the mixtures. The results show that the experimental data can be well described by the weighted harmonic mean model. This suggests that the mean equilibrium moisture content of the carton-packaging mixture presents a non-linear relationship with each single, pure compound.

DESIGN PACKAGE 1E SYSTEM SAFETY ANALYSIS

Energy Technology Data Exchange (ETDEWEB)

M. Salem

1995-06-23

The purpose of this analysis is to systematically identify and evaluate hazards related to the Yucca Mountain Project Exploratory Studies Facility (ESF) Design Package 1E, Surface Facilities, (for a list of design items included in the package 1E system safety analysis see section 3). This process is an integral part of the systems engineering process; whereby safety is considered during planning, design, testing, and construction. A largely qualitative approach was used since a radiological System Safety Analysis is not required. The risk assessment in this analysis characterizes the accident scenarios associated with the Design Package 1E structures/systems/components(S/S/Cs) in terms of relative risk and includes recommendations for mitigating all identified risks. The priority for recommending and implementing mitigation control features is: (1) Incorporate measures to reduce risks and hazards into the structure/system/component design, (2) add safety devices and capabilities to the designs that reduce risk, (3) provide devices that detect and warn personnel of hazardous conditions, and (4) develop procedures and conduct training to increase worker awareness of potential hazards, on methods to reduce exposure to hazards, and on the actions required to avoid accidents or correct hazardous conditions.

dartr: An r package to facilitate analysis of SNP data generated from reduced representation genome sequencing.

Science.gov (United States)

Gruber, Bernd; Unmack, Peter J; Berry, Oliver F; Georges, Arthur

2018-05-01

Although vast technological advances have been made and genetic software packages are growing in number, it is not a trivial task to analyse SNP data. We announce a new r package, dartr, enabling the analysis of single nucleotide polymorphism data for population genomic and phylogenomic applications. dartr provides user-friendly functions for data quality control and marker selection, and permits rigorous evaluations of conformation to Hardy-Weinberg equilibrium, gametic-phase disequilibrium and neutrality. The package reports standard descriptive statistics, permits exploration of patterns in the data through principal components analysis and conducts standard F-statistics, as well as basic phylogenetic analyses, population assignment, isolation by distance and exports data to a variety of commonly used downstream applications (e.g., newhybrids, faststructure and phylogeny applications) outside of the r environment. The package serves two main purposes: first, a user-friendly approach to lower the hurdle to analyse such data-therefore, the package comes with a detailed tutorial targeted to the r beginner to allow data analysis without requiring deep knowledge of r. Second, we use a single, well-established format-genlight from the adegenet package-as input for all our functions to avoid data reformatting. By strictly using the genlight format, we hope to facilitate this format as the de facto standard of future software developments and hence reduce the format jungle of genetic data sets. The dartr package is available via the r CRAN network and GitHub. © 2017 John Wiley & Sons Ltd.

Single-Molecule FISH Reveals Non-selective Packaging of Rift Valley Fever Virus Genome Segments

NARCIS (Netherlands)

Wichgers Schreur, Paul J.; Kortekaas, Jeroen

2016-01-01

The bunyavirus genome comprises a small (S), medium (M), and large (L) RNA segment of negative polarity. Although genome segmentation confers evolutionary advantages by enabling genome reassortment events with related viruses, genome segmentation also complicates genome replication and packaging.

Towards a Single Market: A 21st Century Vision for Asia Pacific Economic Integration

Directory of Open Access Journals (Sweden)

Andrew Elek

2010-06-01

Full Text Available APEC leaders can take pride in progress towards free and open trade. There will always be more to do to integrate Asia Pacific economies. 2010 is the time to look beyond border barriers to trade and adopt a new post-Bogor vision of a single market. Traditional border barriers to trade in some sensitive products remain costly, but affect only a rapidly shrinking part of international commerce. Today, it is more efficient to concentrate on problems of communications and logistics, combined with the lack of efficiency, transparency and sometimes arbitrary implementation of economic policies in different economies. The effective constraint on collective action to deal with these problems is not political will. It is limited capacity to design and implement the necessary policy reform. Creating the necessary capacity needs a unifying vision to deal all obstacles to genuine economic integration, that is, to build a single market. In doing so, Asia Pacific governments can learn from the European Union experience. But they need to promote ever-deeper economic integration without relying on a supra-national authority. Like free and open trade, a single market is a vision which can only be approached, rather than reached by any deadline－it is a point of reference for the many things that need to be done to integrate Asia Pacific economies in a meaningful way. Asia Pacific governments should be encouraged to set their own medium-term targets for progress towards well-defined ingredients of a single market. Strict selection criteria should be used to identify options for cooperation which build on what APEC is already doing and which are in line with the priorities of most member economies. An ambitious program to enhance the efficiency of supply chains could set a successful example and generate the confidence to do more.

The Supertree Toolkit 2: a new and improved software package with a Graphical User Interface for supertree construction

Directory of Open Access Journals (Sweden)

Jon Hill

2014-03-01

Full Text Available Building large supertrees involves the collection, storage, and processing of thousands of individual phylogenies to create large phylogenies with thousands to tens of thousands of taxa. Such large phylogenies are useful for macroevolutionary studies, comparative biology and in conservation and biodiversity. No easy to use and fully integrated software package currently exists to carry out this task. Here, we present a new Python-based software package that uses well defined XML schema to manage both data and metadata. It builds on previous versions by 1 including new processing steps, such as Safe Taxonomic Reduction, 2 using a user-friendly GUI that guides the user to complete at least the minimum information required and includes context-sensitive documentation, and 3 a revised storage format that integrates both tree- and meta-data into a single file. These data can then be manipulated according to a well-defined, but flexible, processing pipeline using either the GUI or a command-line based tool. Processing steps include standardising names, deleting or replacing taxa, ensuring adequate taxonomic overlap, ensuring data independence, and safe taxonomic reduction. This software has been successfully used to store and process data consisting of over 1000 trees ready for analyses using standard supertree methods. This software makes large supertree creation a much easier task and provides far greater flexibility for further work.

The Supertree Toolkit 2: a new and improved software package with a Graphical User Interface for supertree construction.

Science.gov (United States)

Hill, Jon; Davis, Katie E

2014-01-01

Building large supertrees involves the collection, storage, and processing of thousands of individual phylogenies to create large phylogenies with thousands to tens of thousands of taxa. Such large phylogenies are useful for macroevolutionary studies, comparative biology and in conservation and biodiversity. No easy to use and fully integrated software package currently exists to carry out this task. Here, we present a new Python-based software package that uses well defined XML schema to manage both data and metadata. It builds on previous versions by 1) including new processing steps, such as Safe Taxonomic Reduction, 2) using a user-friendly GUI that guides the user to complete at least the minimum information required and includes context-sensitive documentation, and 3) a revised storage format that integrates both tree- and meta-data into a single file. These data can then be manipulated according to a well-defined, but flexible, processing pipeline using either the GUI or a command-line based tool. Processing steps include standardising names, deleting or replacing taxa, ensuring adequate taxonomic overlap, ensuring data independence, and safe taxonomic reduction. This software has been successfully used to store and process data consisting of over 1000 trees ready for analyses using standard supertree methods. This software makes large supertree creation a much easier task and provides far greater flexibility for further work.

Numerical evaluation of tensor Feynman integrals in Euclidean kinematics

Energy Technology Data Exchange (ETDEWEB)

Gluza, J.; Kajda [Silesia Univ., Katowice (Poland). Inst. of Physics; Riemann, T.; Yundin, V. [Deutsches Elektronen-Synchrotron (DESY), Zeuthen (Germany)

2010-10-15

For the investigation of higher order Feynman integrals, potentially with tensor structure, it is highly desirable to have numerical methods and automated tools for dedicated, but sufficiently 'simple' numerical approaches. We elaborate two algorithms for this purpose which may be applied in the Euclidean kinematical region and in d=4-2{epsilon} dimensions. One method uses Mellin-Barnes representations for the Feynman parameter representation of multi-loop Feynman integrals with arbitrary tensor rank. Our Mathematica package AMBRE has been extended for that purpose, and together with the packages MB (M. Czakon) or MBresolve (A. V. Smirnov and V. A. Smirnov) one may perform automatically a numerical evaluation of planar tensor Feynman integrals. Alternatively, one may apply sector decomposition to planar and non-planar multi-loop {epsilon}-expanded Feynman integrals with arbitrary tensor rank. We automatized the preparations of Feynman integrals for an immediate application of the package sectordecomposition (C. Bogner and S. Weinzierl) so that one has to give only a proper definition of propagators and numerators. The efficiency of the two implementations, based on Mellin-Barnes representations and sector decompositions, is compared. The computational packages are publicly available. (orig.)

GillesPy: A Python Package for Stochastic Model Building and Simulation.

Science.gov (United States)

Abel, John H; Drawert, Brian; Hellander, Andreas; Petzold, Linda R

2016-09-01

GillesPy is an open-source Python package for model construction and simulation of stochastic biochemical systems. GillesPy consists of a Python framework for model building and an interface to the StochKit2 suite of efficient simulation algorithms based on the Gillespie stochastic simulation algorithms (SSA). To enable intuitive model construction and seamless integration into the scientific Python stack, we present an easy to understand, action-oriented programming interface. Here, we describe the components of this package and provide a detailed example relevant to the computational biology community.

Waste Package Lifting Calculation

International Nuclear Information System (INIS)

H. Marr

2000-01-01

The objective of this calculation is to evaluate the structural response of the waste package during the horizontal and vertical lifting operations in order to support the waste package lifting feature design. The scope of this calculation includes the evaluation of the 21 PWR UCF (pressurized water reactor uncanistered fuel) waste package, naval waste package, 5 DHLW/DOE SNF (defense high-level waste/Department of Energy spent nuclear fuel)--short waste package, and 44 BWR (boiling water reactor) UCF waste package. Procedure AP-3.12Q, Revision 0, ICN 0, calculations, is used to develop and document this calculation

Enhanced thermaly managed packaging for III-nitride light emitters

Science.gov (United States)

Kudsieh, Nicolas

In this Dissertation our work on `enhanced thermally managed packaging of high power semiconductor light sources for solid state lighting (SSL)' is presented. The motivation of this research and development is to design thermally high stable cost-efficient packaging of single and multi-chip arrays of III-nitrides wide bandgap semiconductor light sources through mathematical modeling and simulations. Major issues linked with this technology are device overheating which causes serious degradation in their illumination intensity and decrease in the lifetime. In the introduction the basics of III-nitrides WBG semiconductor light emitters are presented along with necessary thermal management of high power cingulated and multi-chip LEDs and laser diodes. This work starts at chip level followed by its extension to fully packaged lighting modules and devices. Different III-nitride structures of multi-quantum well InGaN/GaN and AlGaN/GaN based LEDs and LDs were analyzed using advanced modeling and simulation for different packaging designs and high thermal conductivity materials. Study started with basic surface mounted devices using conventional packaging strategies and was concluded with the latest thermal management of chip-on-plate (COP) method. Newly discovered high thermal conductivity materials have also been incorporated for this work. Our study also presents the new approach of 2D heat spreaders using such materials for SSL and micro LED array packaging. Most of the work has been presented in international conferences proceedings and peer review journals. Some of the latest work has also been submitted to well reputed international journals which are currently been reviewed for publication. .

Cantilever-based sensor with integrated optical read-out using single mode waveguides

DEFF Research Database (Denmark)

Nordström, Maria; Zauner, Dan; Calleja, Montserrat

2007-01-01

This work presents the design, fabrication and mechanical characterisation of an integrated optical read-out scheme for cantilever-based biosensors. A cantilever can be used as a biosensor by monitoring its bending caused by the surface stress generated due to chemical reactions occurring on its...... surface. Here, we present a novel integrated optical read-out scheme based on single-mode waveguides that enables the fabrication of a compact system. The complete system is fabricated in the polymer SU-8. This manuscript shows the principle of operation and the design well as the fabrication...

Electronic equipment packaging technology

CERN Document Server

Ginsberg, Gerald L

1992-01-01

The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron­ ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod­ ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter­ mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pr...

The containment and an absorbent evaluation for a package for a liquid radioactive isotope

Energy Technology Data Exchange (ETDEWEB)

Bang, K. S.; Lee, J. C.; Kim, D. H.; Hwang, C. S.; Kim, H. J.; Seo, K. S

2005-03-01

Radioactive isotopes must be safely transported from the production centre to the point of use. The shipping package to safely transport radioactive isotopes should be able to withstand the conditions prescribed by law. A type a package, which is used to transport liquid radioactive materials, should have a containment system comprising a primary inner and a secondary outer containment or it should be provided with a sufficiently absorbent material to absorb twice the volume of the liquid contents. Accordingly, an absorbent material for use in a Type A package to transport a liquid radioactive isotope was estimated. To estimate the integrity of containment, the leakage tests for a containment system for a Type A package for domestic and abroad expert were conducted.

High-Voltage LED Light Engine with Integrated Driver

Energy Technology Data Exchange (ETDEWEB)

Soer, Wouter [Lumileds LLC, San Jose, CA (United States)

2016-02-29

LED luminaires have seen dramatic changes in cost breakdown over the past few years. The LED component cost, which until recently was the dominant portion of luminaire cost, has fallen to a level of the same order as the other luminaire components, such as the driver, housing, optics etc. With the current state of the technology, further luminaire performance improvement and cost reduction is realized most effectively by optimization of the whole system, rather than a single component. This project focuses on improving the integration between LEDs and drivers. Lumileds has developed a light engine platform based on low-cost high-power LEDs and driver topologies optimized for integration with these LEDs on a single substrate. The integration of driver and LEDs enables an estimated luminaire cost reduction of about 25% for targeted applications, mostly due to significant reductions in driver and housing cost. The high-power LEDs are based on Lumileds’ patterned sapphire substrate flip-chip (PSS-FC) technology, affording reduced die fabrication and packaging cost compared to existing technology. Two general versions of PSS-FC die were developed in order to create the desired voltage and flux increments for driver integration: (i) small single-junction die (0.5 mm²), optimal for distributed lighting applications, and (ii) larger multi-junction die (2 mm² and 4 mm²) for high-power directional applications. Two driver topologies were developed: a tapped linear driver topology and a single-stage switch-mode topology, taking advantage of the flexible voltage configurations of the new PSS-FC die and the simplification opportunities enabled by integration of LEDs and driver on the same board. A prototype light engine was developed for an outdoor “core module” application based on the multi-junction PSS-FC die and the single-stage switch-mode driver. The light engine meets the project efficacy target of 128 lm/W at a luminous flux

Transuranic package transporter (TRUPACT) system design status and operational support equipment

International Nuclear Information System (INIS)

Johanson, N.W.; Meyer, R.J.; Romesberg, L.E.; Pope, R.B.

1983-01-01

A program was initiated in the late 1970's at Sandia National Laboratories to develop an efficient, safe, reliable, and cost-effective transportation packaging system for the carriage of contact-handled transuranic (CH-TRU) waste within the Department of Energy (DOE) complex. It is anticipated that eventually a family of TRUPACT (TRansUranic PACKage Transporter) systems having varied dimensions and weight/volume capacities will be needed by the DOE to transport different CH-TRU waste forms. Each TRUPACT system will be a Type B packaging. Large quantities of CH-TRU wastes having many different forms, isotopic contents, and contained in a variety of waste containers have been, are being, and will continue to be produced and stored for ultimate disposal. Packaging design is being closely coordinated with facility designs to ensure the rapid and economic integration of the TRUPACT system. The first packaging developed for transport by truck or rail (bimodal) is designated TRUPACT-I and will become operational in 1984. This paper provides an overview of progress on the TRUPACT-I design and details of equipment to be used for interfacing with users

Development of high performance scientific components for interoperability of computing packages

Energy Technology Data Exchange (ETDEWEB)

Gulabani, Teena Pratap [Iowa State Univ., Ames, IA (United States)

2008-01-01

Three major high performance quantum chemistry computational packages, NWChem, GAMESS and MPQC have been developed by different research efforts following different design patterns. The goal is to achieve interoperability among these packages by overcoming the challenges caused by the different communication patterns and software design of each of these packages. A chemistry algorithm is hard to develop as well as being a time consuming process; integration of large quantum chemistry packages will allow resource sharing and thus avoid reinvention of the wheel. Creating connections between these incompatible packages is the major motivation of the proposed work. This interoperability is achieved by bringing the benefits of Component Based Software Engineering through a plug-and-play component framework called Common Component Architecture (CCA). In this thesis, I present a strategy and process used for interfacing two widely used and important computational chemistry methodologies: Quantum Mechanics and Molecular Mechanics. To show the feasibility of the proposed approach the Tuning and Analysis Utility (TAU) has been coupled with NWChem code and its CCA components. Results show that the overhead is negligible when compared to the ease and potential of organizing and coping with large-scale software applications.

When There Is No Welfare: The Income Packaging Strategies of Mothers Without Earnings or Cash Assistance Following an Economic Downturn

Directory of Open Access Journals (Sweden)

Kristin S. Seefeldt

2015-11-01

Full Text Available The 1996 welfare reform law sought to reformulate single mothers’ income package, replacing cash welfare checks with paychecks. However, many single mothers have not been able to do that and have neither earnings nor cash assistance. Among a sample of single mothers in Los Angeles and southeast Michigan, we find that when single mothers lose jobs and do not receive cash assistance, they package income from a variety of sources (such as other public assistance programs and informal child support, find others in their social networks to pay their bills, or move in with others. However, their income packaging strategies are fraught with challenges. Benefits from certain public programs are difficult to secure; financial assistance from friends and family members can quickly vanish, particularly if a partner is deported or jailed; and doubling up with others often leads to living in crowded and unsafe conditions.

Packaging of active fiber composites for improved sensor performance

International Nuclear Information System (INIS)

Melnykowycz, M; Barbezat, M; Koller, R; Brunner, A J

2010-01-01

Active fiber composites (AFC) composed of lead zirconate titanate (PZT) fibers embedded in an epoxy matrix and sandwiched between two interdigitated electrodes provide a thin and flexible smart material device which can act as a sensor or actuator. The thin profiles of AFC make them ideal for integration in glass or carbon fiber composite laminates. However, due to the low tensile limit of the PZT fibers, AFC can fail at strains below the tensile limit of many composites. This makes their use as a component in an active laminate design somewhat undesirable. In the current work, tensile testing of smart laminates composed of AFC integrated in glass fiber laminates was conducted to assess the effectiveness of different packaging strategies for improving AFC sensor performance at high strains relative to the tensile limit of the AFC. AFC were encased in carbon fiber, silicon, and pre-stressed carbon fiber to improve the tensile limit of the AFC when integrated in glass fiber laminates. By laminating AFC with pre-stressed carbon fiber, the tensile limit and strain sensor ability of the AFC were significantly improved. Acoustic emission monitoring was used and the results show that PZT fiber breakage was reduced due to the pre-stressed packaging process

Analysis of energy and materials utilization for packaging liquid basic and luxury foodstuffs

Energy Technology Data Exchange (ETDEWEB)

Ebersbach, K F

1981-01-01

By the help of the product 'packaging' the quantities of the energy and materials used are demonstrated analytically within the single stages of the production and utilization of these goods. Alternatives for a better utilization of energy and materials are to be demonstrated. - A methodology for setting up analyses and alternatives is to be introduced which a) is generally accepted in investigations of this kind and b) permits controlled measures for improving the energy and materials balances. Several considerations made the authors select the packagings for beer and soft drinks as the subjects of the project. The usual packagings for these beverages are dealt with.

Label-free single-cell separation and imaging of cancer cells using an integrated microfluidic system

DEFF Research Database (Denmark)

Antfolk, Maria; Kim, Soo Hyeon; Koizumi, Saori

2017-01-01

, an integrated system is presented that efficiently eliminates this risk by integrating label-free separation with single cell arraying of the target cell population, enabling direct on-chip tumor cell identification and enumeration. Prostate cancer cells (DU145) spiked into a sample with whole blood...... a fully integrated system for rapid label-free separation and on-chip phenotypic characterization of circulating tumor cells from peripheral venous blood in clinical practice....

Specifying residential retrofit packages for 30 % reductions in energy consumption in hot-humid climate zones

Energy Technology Data Exchange (ETDEWEB)

Burgett, J.M.; Chini, A.R.; Oppenheim, P. [University of Florida, 573 Rinker Hall, Newell Drive, Gainesville, FL 32611 (United States)

2013-08-15

The purpose of this research was to demonstrate the application of energy simulation as an effective tool for specifying cost-effective residential retrofit packages that will reduce energy consumption by 30 %. Single-family homes in the hot-humid climate type of the Southeastern USA were used to demonstrate the application. US census data from both state and federal studies were used to create 12 computer simulation homes representing the most common characteristics of single-family houses specific to this area. Well-recognized energy efficiency measures (EEMs) were simulated to determine their cumulative energy reduction potential. Detailed cost estimates were created for cost-to-benefit analysis. For each of the 12 simulated homes, 4 packages of EEMs were created. The four packages provided home owners options for reducing their energy by 30 % along with the estimated up-front cost and simple payback periods. The simple payback period was used to determine how cost-effective a measure was. The packages are specific to a geographic area to provide a higher degree of confidence in the projected cost and energy savings. The study provides a generic methodology to create a similar 30 % energy reduction packages for other locations and a detailed description of a case study to serve as an example. The study also highlights the value that computer simulation models can have to develop energy efficiency packages cost-effectively and specific to home owner's location and housing type.

On-Chip Magnetic Platform for Single-Particle Manipulation with Integrated Electrical Feedback.

Science.gov (United States)

Monticelli, Marco; Torti, Andrea; Cantoni, Matteo; Petti, Daniela; Albisetti, Edoardo; Manzin, Alessandra; Guerriero, Erica; Sordan, Roman; Gervasoni, Giacomo; Carminati, Marco; Ferrari, Giorgio; Sampietro, Marco; Bertacco, Riccardo

2016-02-17

Methods for the manipulation of single magnetic particles have become very interesting, in particular for in vitro biological studies. Most of these studies require an external microscope to provide the operator with feedback for controlling the particle motion, thus preventing the use of magnetic particles in high-throughput experiments. In this paper, a simple and compact system with integrated electrical feedback is presented, implementing in the very same device both the manipulation and detection of the transit of single particles. The proposed platform is based on zig-zag shaped magnetic nanostructures, where transverse magnetic domain walls are pinned at the corners and attract magnetic particles in suspension. By applying suitable external magnetic fields, the domain walls move to the nearest corner, thus causing the step by step displacement of the particles along the nanostructure. The very same structure is also employed for detecting the bead transit. Indeed, the presence of the magnetic particle in suspension over the domain wall affects the depinning field required for its displacement. This characteristic field can be monitored through anisotropic magnetoresistance measurements, thus implementing an integrated electrical feedback of the bead transit. In particular, the individual manipulation and detection of single 1-μm sized beads is demonstrated. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Influence of storage Time and Temperature on Absorption of Flavour Compounds from Solutions by Plastic Packaging Materials

NARCIS (Netherlands)

Willige, R.; Schoolmeester, D.; Ooij, van A.; Linssen, J.P.H.; Voragen, A.G.J.

2002-01-01

Food packaging, although an integral part of the food chain, has a major drawback in that, often, the packaging material interacts with the flavor constituents of the food, causing either a selective or an extensive loss of desirable food flavors or absorption of undesirable off-flavors from the

Study on retrievability of waste package in geological disposal

International Nuclear Information System (INIS)

Hasegawa, Hiroshi; Noda, Masaru

2002-02-01

Retrievability of waste packages in geological disposal of high-level radioactive waste has been investigated from a technical aspect in various foreign countries, reflecting a social concern while retrievability is not provided as a technical requirement. This study investigates the concept of reversibility and retrievability in foreign countries and a technical feasibility on retrievability of waste packages in the geological disposal concept shown in the H12 report. The conclusion obtained through this study is as follows: 1. Concept of reversibility and retrievability in foreign countries. Many organizations have reconsidered the retrievability as one option in the geological disposal to improve the reversibility of the stepwise decision-making process and provide the flexibility, even based upon the principle of the geological disposal that retrieval of waste from the repository is not intended. 2. Technical feasibility on the retrievability in disposal concept in the H12 report. It is confirmed to be able to remove the buffer and to retrieve the waste packages by currently available technologies even after the stages following emplacement of the buffer. It must be noted that a large effort and expense would be required for some activities such as the reconstruction of access route if the activities started after a stage of backfilling disposal tunnels. 3. Evaluation of feasibility on the retrievability and extraction of the issues. In the near future, it is necessary to study and confirm the practical workability and economical efficiency for the retrieving method of waste packages proposed in this study, the handling and processing method of removed buffer materials, and the retrieving method of waste packages in the case of degrading the integrity of waste packages or not emplacing the waste packages in the assumed attitude, etc. (author)

Testing and evaluation of used UF6 shipping packages

International Nuclear Information System (INIS)

Barlow, C.R.; Ziehlke, K.T.; Pryor, W.A.; Housholder, W.R.

1986-01-01

Damage to shipping packages and their components, whether due to normal environmental exposure or because of unforeseen accidents, requires occasional reevaluation and requalification to assure the suitability of the packages for continued service. Pressure tests have been conducted on used 30B cylinders that were involved in a warehouse fire to assess the possible damaging effects of the exposure. Deteriorated and mechanically damaged overpacks which had absorbed large quantities of water in service were subjected to drying tests, foam properties were evaluated, and a rehabilitation procedure was developed to allow return of such packages to service. Protective shipping packages show deterioration with extended service, principally structural damage from rough handling and rust damage from exposure to weather and from storage practices which may promote absorption of water by the insulating foam. The structural and thermal properties of the phenolic foam insulation from used shipping packages were found to be not adversely affected by absorbed water, and they were not degraded by the drying process. In order to slow or avoid continuing rust damage in renovated packages, however, a process was developed for drying the foam in commercial facilities prior to restoration work on used or damaged containers. Two 2-1/2-ton steel transport cylinders, type 30B, were involved in a warehouse fire where portions of the cylinders were estimated to have reached a temperature of 1600 0 F. The cylinders were empty at the time of the fire and thus were not in the protective packages in which full product cylinders are handled while in transit. Hydrostatic burst tests showed that the integrity of the cylinders was not degraded by the fire exposure. They withstood test pressures in excess of 10 times the design pressure, and showed a volume expansion of 30% above the original capacity before rupturing in a completely ductile fashion

Anhydrous Ammonia Training Module. Trainer's Package. Participant's Package.

Science.gov (United States)

Beaudin, Bart; And Others

This document contains a trainer's and a participant's package for teaching employees on site safe handling procedures for working with anhydrous ammonia, especially on farms. The trainer's package includes the following: a description of the module; a competency; objectives; suggested instructional aids; a training outline (or lesson plan) for…

Toward Fast and Accurate Binding Affinity Prediction with pmemdGTI: An Efficient Implementation of GPU-Accelerated Thermodynamic Integration.

Science.gov (United States)

Lee, Tai-Sung; Hu, Yuan; Sherborne, Brad; Guo, Zhuyan; York, Darrin M

2017-07-11

We report the implementation of the thermodynamic integration method on the pmemd module of the AMBER 16 package on GPUs (pmemdGTI). The pmemdGTI code typically delivers over 2 orders of magnitude of speed-up relative to a single CPU core for the calculation of ligand-protein binding affinities with no statistically significant numerical differences and thus provides a powerful new tool for drug discovery applications.

Green Packaging Development. : A way to efficient, effective and more environmental friendly packaging solutions.

OpenAIRE

Mian Muhammad, Masoud

2011-01-01

Growing pressure on the packaging design to enhance the environmental and logistics performance of a packaging system stresses the packaging designers to search new design strategies that not only fulfill logistics requirements in the supply chain, but also reduce the CO 2emissions during the packaging life cycle. This thesis focuses on the packaging design process and suggests some improvements by considering its logistics performance and CO 2emissions. A Green packaging development model wa...

FUMACS-G, a Graphical User Interface for FUMACS Code Package

International Nuclear Information System (INIS)

Trontl, K.; Gergeta, K.; Smuc, T.

2002-01-01

The FUMACS (FUel MAnagement Code System) code package has been developed at Rudjer Boskovic Institute in year 1991 with the aim to enable in-core fuel management analysis of the NPP Krsko core for nominal conditions. Due to modernization and uprating of the NPP Krsko core in year 2000 and the original 1991 FUMACS inadequacy in simulating NPP Krsko core in these uprated conditions, in the year 2001 a new version of FUMACS code package has been developed - FUMACS/FEEC 2001. The code package upgrading procedure consisted of two main aspects: modifications of master files, libraries and codes necessary for proper modeling of the uprated NPP Krsko core and development of the code package structure suitable for Windows-32 environment. The latter included upgrading the source of the code from FORTRAN F77 to F90 level and development of a graphical, user-friendly interface with fully integrated electronic help system. Since the original FUMACS code package has been developed as a DOS based application, running of the code package on a Windows operating system proved to be rather inefficient and lacking in advantages of a standard Windows application. Therefore, FUMACS-G has been developed as a user friendly environment for handling off all project input and output files, as well as for easier overall project management. The design of FUMACS-G shell has been based on Microsoft application design guidelines. (author)

Finite Element Analysis of Single Cell Stiffness Measurements Using PZT-Integrated Buckling Nanoneedles

Directory of Open Access Journals (Sweden)

Maryam Alsadat Rad

2016-12-01

Full Text Available This paper proposes a new technique for real-time single cell stiffness measurement using lead zirconate titanate (PZT-integrated buckling nanoneedles. The PZT and the buckling part of the nanoneedle have been modelled and validated using the ABAQUS software. The two parts are integrated together to function as a single unit. After calibration, the stiffness, Young’s modulus, Poisson’s ratio and sensitivity of the PZT-integrated buckling nanoneedle have been determined to be 0.7100 N·m−1, 123.4700 GPa, 0.3000 and 0.0693 V·m·N−1, respectively. Three Saccharomyces cerevisiae cells have been modelled and validated based on compression tests. The average global stiffness and Young’s modulus of the cells are determined to be 10.8867 ± 0.0094 N·m−1 and 110.7033 ± 0.0081 MPa, respectively. The nanoneedle and the cell have been assembled to measure the local stiffness of the single Saccharomyces cerevisiae cells The local stiffness, Young’s modulus and PZT output voltage of the three different size Saccharomyces cerevisiae have been determined at different environmental conditions. We investigated that, at low temperature the stiffness value is low to adapt to the change in the environmental condition. As a result, Saccharomyces cerevisiae becomes vulnerable to viral and bacterial attacks. Therefore, the proposed technique will serve as a quick and accurate process to diagnose diseases at early stage in a cell for effective treatment.