Electroless copper plating on 3-mercaptopropyltriethoxysilane modified PET fabric challenged by ultrasonic washing

International Nuclear Information System (INIS)

Lu Yinxiang

2009-01-01

Electroless deposition of Cu on poly(ethylene terephthalate) (PET) fabric modified with 3-mercaptopropyltriethoxysilane was investigated. Morphology, composition, structure, thermal decomposing behavior of copper coating PET fabric after ultrasonic washing in water for 1 h were characterized by scanning electron microscopy (SEM), energy dispersive X-ray (EDX) analysis, X-ray photoelectron spectroscopy (XPS), Raman spectrometer, X-ray diffraction (XRD), and thermogravimetric analysis (TG), respectively. Copper plating on modified fabric has good adherence stability and high electric conductivity before and after ultrasonic washing, while copper coating fabric without modification is easily destroyed during the washing process, which leads to the textile changing from conductor to dielectric. As the copper weight on the treated fabric is 28 g/m 2 , the shielding effectiveness (SE) is more than 54 dB at frequency ranging from 0.01 MHz to 18 GHz.

Selective Electroless Nickel Plating on PMMA using Chloroform Pre-Treatment

Science.gov (United States)

Sipes, Nicholas

In the past 5 years, we have discovered that chloroform promotes the adhesion of thin gold films to Poly(methyl methacrylate) surfaces. Based on this new understanding of the interaction of chloroform with PMMA and metal atoms, we were curious to see if chloroform would promote the adhesion of Nickel to PMMA deposited by electroless plating. My goal was to selectively electroless plate Nickel onto PMMA. Chloroform was spun-cast onto 1 inch square PMMA substrates. I used electrical tape to shield one half of the PMMA from the chloroform during spin-casting; this allowed for a direct comparison of treated vs. untreated. The samples were then put through hydrochloric acid and a series of baths provided by Transene Company Inc. to electrolessly deposit nickel on the sample. After many trials, there was a clear distinction in the adhesion strength of the Nickel to the plain PMMA surface vs. the chloroform pre-treated surface. Showing that it is possible to create chloroform sites via spin-casting for electroless nickel plating on PMMA opens up the challenge to better understand the chemistry taking place and to perfect the electroless plating process.

Selective Electroless Silver Deposition on Graphene Edges

DEFF Research Database (Denmark)

Durhuus, D.; Larsen, M. V.; Andryieuski, Andrei

2015-01-01

We demonstrate a method of electroless selective silver deposition on graphene edges or between graphene islands without covering the surface of graphene. Modifications of the deposition recipe allow for decoration of graphene edges with silver nanoparticles or filling holes in damaged graphene...... on silica substrate and thus potentially restoring electric connectivity with minimal influence on the overall graphene electrical and optical properties. The presented technique could find applications in graphene based transparent conductors as well as selective edge functionalization and can be extended...

Metal deposition by electroless plating on polydopamine functionalized micro- and nanoparticles.

Science.gov (United States)

Mondin, Giovanni; Wisser, Florian M; Leifert, Annika; Mohamed-Noriega, Nasser; Grothe, Julia; Dörfler, Susanne; Kaskel, Stefan

2013-12-01

A novel approach for the fabrication of metal coated micro- and nanoparticles by functionalization with a thin polydopamine layer followed by electroless plating is reported. The particles are initially coated with polydopamine via self-polymerization. The resulting polydopamine coated particles have a surface rich in catechols and amino groups, resulting in a high affinity toward metal ions. Thus, they provide an effective platform for selective electroless metal deposition without further activation and sensitization steps. The combination of a polydopamine-based functionalization with electroless plating ensures a simple, scalable, and cost-effective metal coating strategy. Silver-plated tungsten carbide microparticles, copper-plated tungsten carbide microparticles, and copper-plated alumina nanoparticles were successfully fabricated, showing also the high versatility of the method, since the polymerization of dopamine leads to the formation of an adherent polydopamine layer on the surface of particles of any material and size. The metal coated particles produced with this process are particularly well suited for the production of metal matrix composites, since the metal coating increases the wettability of the particles by the metal, promoting their integration within the matrix. Such composite materials are used in a variety of applications including electrical contacts, components for the automotive industries, magnets, and electromagnetic interference shielding. Copyright © 2013 Elsevier Inc. All rights reserved.

Electroless Plating on Plastic Induced by Selective Laser Activation

DEFF Research Database (Denmark)

Zhang, Yang; Tang, Peter Torben; Hansen, Hans Nørgaard

2009-01-01

This paper presents a new method for selective micro metallization of polymers. A Nd:YAG laser is employed to draw patterns on polymer surfaces that are submerged in a liquid (usually water). After subsequent activation with palladium chloride and followed by auto-catalytic electroless plating, c...

Electroless deposition process for zirconium and zirconium alloys

Science.gov (United States)

Donaghy, Robert E.; Sherman, Anna H.

1981-01-01

A method is disclosed for preventing stress corrosion cracking or metal embrittlement of a zirconium or zirconium alloy container that is to be coated on the inside surface with a layer of a metal such as copper, a copper alloy, nickel, or iron and used for holding nuclear fuel material as a nuclear fuel element. The zirconium material is etched in an etchant solution, desmutted mechanically or ultrasonically, oxidized to form an oxide coating on the zirconium, cleaned in an aqueous alkaline cleaning solution, activated for electroless deposition of a metal layer and contacted with an electroless metal plating solution. This method provides a boundary layer of zirconium oxide between the zirconium container and the metal layer.

Ablation, surface activation, and electroless metallization of insulating materials by pulsed excimer laser irradiation

International Nuclear Information System (INIS)

Lowndes, D.H.; Godbole, M.J.; Pedraza, A.J.

1993-01-01

Pulsed-laser irradiation of wide bandgap ceramic substrates, using photons with sub-bandgap energies, activates the ceramic surface for subsequent electroless copper deposition. The copper deposit is confined within the irradiated region when the substrate is subsequently immersed in an electroless copper bath. However, a high laser fluence (typically several j/cm 2 ) and repeated laser shots are needed to obtain uniform copper coverage by this direct-irradiation process. In contrast, by first applying an evaporated SiO x thin film (with x ∼1), laser ablation at quite low energy density (∼0.5 J/cm 2 ) results in re-deposition on the ceramic substrate of material that is catalytic for subsequent electroless copper deposition. Experiments indicate that the re-deposited material is on silicon, on which copper nucleates. Using an SiO x film on a laser-transparent substrate, quite fine (∼12 μm) copper lines can be formed at the boundary of the region that is laser-etched in SiO x . Using SiO x with an absorbing (polycrystalline) ceramic substrate, more-or-less uniform activation and subsequent copper deposition are obtained. In the later case, interactions with the ceramic substrate also may be important for uniform deposition

Process and properties of electroless Ni–Cu–P–ZrO2 nanocomposite coatings

International Nuclear Information System (INIS)

Ranganatha, S.; Venkatesha, T.V.; Vathsala, K.

2012-01-01

Highlights: ► The Ni–P and Ni–P–Cu–ZrO 2 coatings were produced by electroless technique. ► The influence of copper and ZrO 2 nanoparticles on Ni–P was studied. ► Surface morphology, structure and electrochemical behavior were evaluated. ► The Ni–Cu–P–ZrO 2 and Ni–P–ZrO 2 coatings are more resistant to corrosion than Ni–P. ► Introduction of Cu and ZrO 2 in the matrix aids to the enhancement of microhardness. -- Abstract: Electroless Ni–Cu–P–ZrO 2 composite coating was successfully obtained on low carbon steel matrix by electroless plating technique. Coatings with different compositions were obtained by varying copper as ternary metal and nano sized zirconium oxide particles so as to obtain elevated corrosion resistant Ni–P coating. Microstructure, crystal structure and composition of deposits were analyzed by SEM, EDX and XRD techniques. The corrosion behavior of the deposits was studied by anodic polarization, Tafel plots and electrochemical impedance spectroscopy (EIS) in 3.5% sodium chloride solution. The ZrO 2 incorporated Ni–P coating showed higher corrosion resistance than plain Ni–P. The introduction of copper metal into Ni–P–ZrO 2 enhanced the protection ability against corrosion. The influence of copper metal and nanoparticles on microhardness of coatings was evaluated.

Site-selective electroless nickel plating on patterned thin films of macromolecular metal complexes.

Science.gov (United States)

Kimura, Mutsumi; Yamagiwa, Hiroki; Asakawa, Daisuke; Noguchi, Makoto; Kurashina, Tadashi; Fukawa, Tadashi; Shirai, Hirofusa

2010-12-01

We demonstrate a simple route to depositing nickel layer patterns using photocross-linked polymer thin films containing palladium catalysts, which can be used as adhesive interlayers for fabrication of nickel patterns on glass and plastic substrates. Electroless nickel patterns can be obtained in three steps: (i) the pattern formation of partially quaterized poly(vinyl pyridine) by UV irradiation, (ii) the formation of macromolecular metal complex with palladium, and (iii) the nickel metallization using electroless plating bath. Metallization is site-selective and allows for a high resolution. And the resulting nickel layered structure shows good adhesion with glass and plastic substrates. The direct patterning of metallic layers onto insulating substrates indicates a great potential for fabricating micro/nano devices.

Effects of Two Purification Pretreatments on Electroless Copper Coating over Single-Walled Carbon Nano tubes

International Nuclear Information System (INIS)

Zheng, Z.; Li, L.; Dong, Sh.; Li, Sh.; Xiao, A.; Sun, Sh.

2014-01-01

To achieve the reinforcement of copper matrix composite by single-walled carbon nano tubes, a three-step-refluxing purification of carbon nano tubes sample with HNO 3 -NaOH-HCl was proposed and demonstrated. A previously reported purification process using an electromagnetic stirring with H 2 O 2 /HCl mixture was also repeated. Then, the purified carbon nano tubes were coated with copper by the same electroless plating process. At the end, the effects of the method on carbon nano tubes themselves and on copper coating were determined by transmission electron microscope spectroscopy, scanning electron microscope spectroscopy, X-ray diffractometry, thermogravimetric analysis, Fourier transformed infrared spectroscopy, and energy dispersive spectrometry. It was clearly confirmed that both of the two processes could remove most of iron catalyst particles and carbonaceous impurities without significant damage to carbon nano tubes. The thermal stability of the sample purified by H 2 O 2 /HCl treatment was slightly higher than that purified by HNO 3 -NaOH-HCl treatment. Nevertheless, the purification by HNO 3 -NaOH-HCl treatment was more effective for carboxyl functionalization on nano tubes than that by H 2 O 2 /HCl treatment. The Cu-coating on carbon nano tubes purified by both purification processes was complete, homogenous, and continuous. However, the Cu-coating on carbon nano tubes purified by H 2 O 2 /HCl was oxidized more seriously than those on carbon nano tubes purified by HNO 3 -NaOH-HCl treatment.

Laser Induced Selective Activation For Subsequent Autocatalytic Electroless Plating

DEFF Research Database (Denmark)

Zhang, Yang

. The third hypothesis is that the activation and rinsing process can be described by diffusion. This hypothesis is proved using Fick’s diffusion laws combined with the short-time-plating experiment. The influence of laser parameters on the surface structure is investigated for Nd:YAG, UV, and fiber lasers......The subject of this PhD thesis is “Laser induced selective activation for subsequent autocatalytic electroless plating.” The objective of the project is to investigate the process chains for micro structuring of polymer surfaces for selective micro metallization. Laser induced selective activation...... (LISA) is introduced and studied as a new technique for producing 3D moulded interconnect devices (3D-MIDs). This technique enables the metallization of polymer surface modified by laser and subsequently activated by a PdCl2/SnCl2 system. Various technologies exist on an industrial level...

Selected-area growth of nickel micropillars on aluminum thin films by electroless plating for applications in microbolometers

Directory of Open Access Journals (Sweden)

Do Ngoc Hieu

2017-06-01

Full Text Available An optimization process of electroless plating of nickel was carried out with NiCl2 as the nickel ion source, NaH2PO2 as the reduction agent, CH3COONa and Na3C6H5O7 as complexing agents. Electroless plated nickel layers on sputtered aluminum corning glass substrates with a resistivity of about 75.9 μΩ cm and a nickel concentration higher than 93% were obtained. This optimum process was successfully applied in growing nickel micropillars at selected areas with a well-controlled height. The microstructure of the masking layers was fabricated by means of optical photolithography for subsequent growth of nickel micropillars on selected areas. Micropillars size was defined by the opening size and the height was controlled by adjusting the plating time at a growth rate of 0.41 μm/min. This result shows that electroless nickel plating could be a good candidate for growing micropillars for applications in microbolometers.

Electroless deposition and electrical characterization of N- Cu 2 O ...

African Journals Online (AJOL)

This work describes the preparation of n-Cu2O layer by the electroless methods of boiling and immersion of copper plates in 0.001M CuSO4Electron Microscopy (SEM) have been used to characterize the oxide films deposited. XRD studies show, for the first time, that cuprous oxide (Cu2O) and cupric oxide (CuO) were ...

Magnetically Driven Micromachines Created by Two-Photon Microfabrication and Selective Electroless Magnetite Plating for Lab-on-a-Chip Applications

Directory of Open Access Journals (Sweden)

Tommaso Zandrini

2017-01-01

Full Text Available We propose a novel method to fabricate three-dimensional magnetic microparts, which can be integrated in functional microfluidic networks and lab-on-a-chip devices, by the combination of two-photon microfabrication and selective electroless plating. In our experiments, magnetic microparts could be successfully fabricated by optimizing various experimental conditions of electroless plating. In addition, energy dispersive X-ray spectrometry (EDS clarified that iron oxide nanoparticles were deposited onto the polymeric microstructure site-selectively. We also fabricated magnetic microrotors which could smoothly rotate using common laboratory equipment. Since such magnetic microparts can be remotely driven with an external magnetic field, our fabrication process can be applied to functional lab-on-a-chip devices for analytical and biological applications.

Characterization and application of selective all-wet metallization of silicon

Science.gov (United States)

Uncuer, Muhammet; Koser, Hur

2012-01-01

We demonstrate selective, two-level metallization of silicon using electroless deposition of copper and gold. In this process, adhesion between the copper and silicon is improved with the formation of intermediary copper-silicide, and the gold layer protects copper from oxidation. The resistivity and residual stress of Au/Cu is 450 Ω nm (220 Ω nm annealed) and 56 MPa (tensile), respectively. These Au/Cu films allow a truly conformal and selective coating of high-aspect-ratio Si structures with good adhesion. We demonstrate the potential of these films in microswitches/relays, accelerometers and sensors by conformally coating the sidewalls of long (up to 1 mm in length), slender microbeams (5 µm × 5 µm) without inducing curvature.

Electroless plating Cu-Co-P polyalloy on UV/ozonolysis irradiated polyethylene terephthalate film and its corrosion resistance

Energy Technology Data Exchange (ETDEWEB)

Hou, Lei; Bi, Siyi; Zhao, Hang; Xu, Yumeng; Mu, Yuhang; Lu, Yinxiang, E-mail: yxlu@fudan.edu.cn

2017-05-01

Highlights: • Electroless plating Cu-Co-P polyalloy was firstly fabricated onto polyethylene terephthalate (PET) substrate. • An etchant-free and amine-free UV/ozonolysis irradiation method UV/ozonolysis was effective for the transition from hydrophilic to hydrophobic of PET sheet. • A time-saving and cost-effective orthogonal experiment (L{sub 9}(3){sup 4}) was utilized to optimize the plating conditions. • The optimized copper polyalloy possessed high corrosion resistance in three aggressive mediums including NaCl, NaOH and HCl, respectively. • The Cu-Co-P coated PET composite showed excellent electromagnetic interference shielding effectiveness (EMI SE > 99.999% at frequency ranging from 30 MHz to 1000 MHz). - Abstract: High corrosion resistant Cu-Co-P coatings were firstly prepared on polyethylene terephthalate (PET) substrate by electroless plating in combination with UV/ozonolysis irradiation under optimized cobalt sulfate heptahydrate concentration, pH value, plating temperature and time. The copper polyalloy/PET composite can be obtained in three steps, namely: (i) the generation of oxygen-containing functionalities (carboxylic groups) onto PET surface through UV irradiation combined with ozone, (ii) Cu seeding catalysts were obtained after being immersed into cupric citrate and NaBH{sub 4} solutions subsequently, and (iii) Cu-Co-P polyalloy metallization using electroless plating bath. Attenuated total reflection fourier transformation infrared spectrometer (ATR-FTIR), X-ray photoelectron spectroscopy (XPS), water contact angle measurement and energy dispersive X-ray analysis (EDAX) were utilized to track the surface changes during the whole process. The electroless plating conditions were optimized by an orthogonal experiment (L{sub 9}(3){sup 4}) for Cu-Co-P coating as follows: CoSO{sub 4}·7H{sub 2}O addition of 0.08 M, pH value, plating temperature and time were set on 10.0, 35 °C and 25 min, respectively. Under the optimal conditions, copper

Recovery process for electroless plating baths

Science.gov (United States)

Anderson, Roger W.; Neff, Wayne A.

1992-01-01

A process for removing, from spent electroless metal plating bath solutions, accumulated byproducts and counter-ions that have deleterious effects on plating. The solution, or a portion thereof, is passed through a selected cation exchange resin bed in hydrogen form, the resin selected from strong acid cation exchangers and combinations of intermediate acid cation exchangers with strong acid cation exchangers. Sodium and nickel ions are sorbed in the selected cation exchanger, with little removal of other constituents. The remaining solution is subjected to sulfate removal through precipitation of calcium sulfate hemihydrate using, sequentially, CaO and then CaCO.sub.3. Phosphite removal from the solution is accomplished by the addition of MgO to form magnesium phosphite trihydrate. The washed precipitates of these steps can be safely discarded in nontoxic land fills, or used in various chemical industries. Finally, any remaining solution can be concentrated, adjusted for pH, and be ready for reuse. The plating metal can be removed from the exchanger with sulfuric acid or with the filtrate from the magnesium phosphite precipitation forming a sulfate of the plating metal for reuse. The process is illustrated as applied to processing electroless nickel plating baths.

Nickel Electroless Plating: Adhesion Analysis for Mono-Type Crystalline Silicon Solar Cells.

Science.gov (United States)

Shin, Eun Gu; Rehman, Atteq ur; Lee, Sang Hee; Lee, Soo Hong

2015-10-01

The adhesion of the front electrodes to silicon substrate is the most important parameters to be optimized. Nickel silicide which is formed by sintering process using a silicon substrate improves the mechanical and electrical properties as well as act as diffusion barrier for copper. In this experiment p-type mono-crystalline czochralski (CZ) silicon wafers having resistivity of 1.5 Ω·cm were used to study one step and two step nickel electroless plating process. POCl3 diffusion process was performed to form the emitter with the sheet resistance of 70 ohm/sq. The Six, layer was set down as an antireflection coating (ARC) layer at emitter surface by plasma enhanced chemical vapor deposition (PECVD) process. Laser ablation process was used to open SiNx passivation layer locally for the formation of the front electrodes. Nickel was deposited by electroless plating process by one step and two step nickel electroless deposition process. The two step nickel plating was performed by applying a second nickel deposition step subsequent to the first sintering process. Furthermore, the adhesion analysis for both one step and two steps process was conducted using peel force tester (universal testing machine, H5KT) after depositing Cu contact by light induced plating (LIP).

Solution-processed copper-nickel nanowire anodes for organic solar cells

Science.gov (United States)

Stewart, Ian E.; Rathmell, Aaron R.; Yan, Liang; Ye, Shengrong; Flowers, Patrick F.; You, Wei; Wiley, Benjamin J.

2014-05-01

This work describes a process to make anodes for organic solar cells from copper-nickel nanowires with solution-phase processing. Copper nanowire films were coated from solution onto glass and made conductive by dipping them in acetic acid. Acetic acid removes the passivating oxide from the surface of copper nanowires, thereby reducing the contact resistance between nanowires to nearly the same extent as hydrogen annealing. Films of copper nanowires were made as oxidation resistant as silver nanowires under dry and humid conditions by dipping them in an electroless nickel plating solution. Organic solar cells utilizing these completely solution-processed copper-nickel nanowire films exhibited efficiencies of 4.9%.This work describes a process to make anodes for organic solar cells from copper-nickel nanowires with solution-phase processing. Copper nanowire films were coated from solution onto glass and made conductive by dipping them in acetic acid. Acetic acid removes the passivating oxide from the surface of copper nanowires, thereby reducing the contact resistance between nanowires to nearly the same extent as hydrogen annealing. Films of copper nanowires were made as oxidation resistant as silver nanowires under dry and humid conditions by dipping them in an electroless nickel plating solution. Organic solar cells utilizing these completely solution-processed copper-nickel nanowire films exhibited efficiencies of 4.9%. Electronic supplementary information (ESI) available. See DOI: 10.1039/c4nr01024h

Facile synthesis of dendritic Cu by electroless reaction of Cu-Al alloys in multiphase solution

Energy Technology Data Exchange (ETDEWEB)

Wang, Ying; Liang, Shuhua, E-mail: liangxaut@gmail.com; Yang, Qing; Wang, Xianhui

2016-11-30

Highlights: • Nano- or micro-scale fractal dendritic copper (FDC) was synthesized by electroless immersing of Cu-Al alloys in CuCl{sub 2} + HCl. • FDC size increases with the increase of Al content in Cu-Al alloys immersed in CuCl{sub 2} + HCl solution. • Nanoscale Cu{sub 2}O was found at the edge of FDC. Nanoporous copper (NPC) can also be obtained by using Cu{sub 17}Al{sub 83} alloy. • The potential difference between CuAl{sub 2} and α-Al phase and the replacement reaction in multiphase solution are key factors. - Abstract: Two-dimensional nano- or micro-scale fractal dendritic coppers (FDCs) were synthesized by electroless immersing of Cu-Al alloys in hydrochloric acid solution containing copper chloride without any assistance of template or surfactant. The FDC size increases with the increase of Al content in Cu-Al alloys immersed in CuCl{sub 2} + HCl solution. Compared to Cu{sub 40}Al{sub 60} and Cu{sub 45}Al{sub 55} alloys, the FDC shows hierarchical distribution and homogeneous structures using Cu{sub 17}Al{sub 83} alloy as the starting alloy. The growth direction of the FDC is <110>, and all angles between the trunks and branches are 60°. Nanoscale Cu{sub 2}O was found at the edge of FDC. Interestingly, nanoporous copper (NPC) can also be obtained through Cu{sub 17}Al{sub 83} alloy. Studies showed that the formation of FDC depended on two key factors: the potential difference between CuAl{sub 2} intermetallic and α-Al phase of dual-phase Cu-Al alloys; a replacement reaction that usually occurs in multiphase solution. The electrochemical experiment further proved that the multi-branch dendritic structure is very beneficial to the proton transfer in the process of catalyzing methanol.

2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid in an Electroless Nickel-Plating Bath

OpenAIRE

Ahmet Ozan Gezerman; Burcu Didem Çorbacıoğlu

2015-01-01

The use of three different materials, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid, was investigated to improve the performance of electroless nickel-plating baths. By changing the concentrations of these materials, sample plates were coated. Optical microscope images were obtained by selecting representative coated plates. From the results of the investigations, the effects of these materials on electroless nickel plating were observed, and the most appropriate amo...

Fabrication of Three Dimensional Cu Metallic Photonic Crystal by Electroless Plating

International Nuclear Information System (INIS)

Wu, S-C; Hou, F-J; Jian, P-C Jang-; Tsai, M-S; Chen, M-C; Li, L-S; Huang, J-Y; Lin, S-Y

2007-01-01

A 3D copper (Cu) metallic photonic crystal (MPC) with 180nm line width was fabricated by electroless plating. The mold of 3D MPC for Cu replacement is poly-Si. It has been verified as an enhancing thermal photovoltaic effect while the mold was transferred into tungsten MPC by chemical vapor deposition method. The 5 layers structure of Cu MPC was clear observed with scanning electron microscopy. The photonic band-gap ranged from 1.5 to 13 μm was measured by Fourier transform infrared spectroscopy (FTIR) instrument

2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid in an Electroless Nickel-Plating Bath

Directory of Open Access Journals (Sweden)

Ahmet Ozan Gezerman

2015-01-01

Full Text Available The use of three different materials, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid, was investigated to improve the performance of electroless nickel-plating baths. By changing the concentrations of these materials, sample plates were coated. Optical microscope images were obtained by selecting representative coated plates. From the results of the investigations, the effects of these materials on electroless nickel plating were observed, and the most appropriate amounts of these materials for nickel plating were determined. Moreover, the nickel plating speed observed with the bath solution containing 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid is higher than that in the case of traditional electroless plating baths, but the nickel consumption amount in the former case is lower. In order to minimize the waste water generated from electroless nickel-plating baths, we determined the lowest amounts of the chemicals that can be used for the concentrations reported in the literature.

Refining processes of selected copper alloys

Directory of Open Access Journals (Sweden)

S. Rzadkosz

2009-04-01

Full Text Available The analysis of the refining effectiveness of the liquid copper and selected copper alloys by various micro additions and special refiningsubstances – was performed. Examinations of an influence of purifying, modifying and deoxidation operations performed in a metal bath on the properties of certain selected alloys based on copper matrix - were made. Refining substances, protecting-purifying slag, deoxidation and modifying substances containing micro additions of such elements as: zirconium, boron, phosphor, sodium, lithium, or their compounds introduced in order to change micro structures and properties of alloys, were applied in examinations. A special attention was directed to macro and micro structures of alloys, their tensile and elongation strength and hot-cracks sensitivity. Refining effects were estimated by comparing the effectiveness of micro structure changes with property changes of copper and its selected alloys from the group of tin bronzes.

Electroless atomic layer deposition

Science.gov (United States)

Robinson, David Bruce; Cappillino, Patrick J.; Sheridan, Leah B.; Stickney, John L.; Benson, David M.

2017-10-31

A method of electroless atomic layer deposition is described. The method electrolessly generates a layer of sacrificial material on a surface of a first material. The method adds doses of a solution of a second material to the substrate. The method performs a galvanic exchange reaction to oxidize away the layer of the sacrificial material and deposit a layer of the second material on the surface of the first material. The method can be repeated for a plurality of iterations in order to deposit a desired thickness of the second material on the surface of the first material.

Laser-induced selective metallization of polypropylene doped with multiwall carbon nanotubes

Energy Technology Data Exchange (ETDEWEB)

Ratautas, Karolis, E-mail: karolis.ratautas@ftmc.lt [Center for Physical Sciences and Technology, Savanoriu Ave. 231, Vilnius LT-02300 (Lithuania); Gedvilas, Mindaugas; Stankevičiene, Ina; Jagminienė, Aldona; Norkus, Eugenijus [Center for Physical Sciences and Technology, Savanoriu Ave. 231, Vilnius LT-02300 (Lithuania); Pira, Nello Li [Centro Ricerche Fiat, Strada Torino 50, Orbassano 10043 (Italy); Sinopoli, Stefano [BioAge Srl, Via Dei Glicini 25, Lamezia Terme 88046 (Italy); Račiukaitis, Gediminas [Center for Physical Sciences and Technology, Savanoriu Ave. 231, Vilnius LT-02300 (Lithuania)

2017-08-01

Highlights: • PP doped with multiwall CNT can be activated with ns laser for electroless plating. • Developed material is cheap decision for MID applications. • Activation mechanism was preliminary proposed. • Demo for automotive application has been manufactured. - Abstract: Moulded interconnect devices (MID) offer the material, weight and cost saving by integration electronic circuits directly into polymeric components used in automotive and other consumer products. Lasers are used to write circuits directly by modifying the surface of polymers followed by an electroless metal plating. A new composite material – the polypropylene doped with multiwall carbon nanotubes was developed for the laser-induced selective metallization. Mechanism of surface activation by laser irradiation was investigated in details utilising pico- and nanoseconds lasers. Deposition of copper was performed in the autocatalytic electroless plating bath. The laser-activated polymer surfaces have been studied using the Raman spectroscopy and scanning electron microscope (SEM). Microscopic images revealed that surface becomes active only after its melting by a laser. Alterations in the Raman spectra of the D and G bands indicated the clustering of carbon additives in the composite material. Optimal laser parameters for the surface activation were found by measuring a sheet resistance of the finally metal-plated samples. A spatially selective copper plating was achieved with the smallest conductor line width of 22 μm at the laser scanning speed of 3 m/s and the pulse repetition rate of 100 kHz. Finally, the technique was validated by making functional electronic circuits by this MID approach.

Laser-induced selective metallization of polypropylene doped with multiwall carbon nanotubes

International Nuclear Information System (INIS)

Ratautas, Karolis; Gedvilas, Mindaugas; Stankevičiene, Ina; Jagminienė, Aldona; Norkus, Eugenijus; Pira, Nello Li; Sinopoli, Stefano; Račiukaitis, Gediminas

2017-01-01

Highlights: • PP doped with multiwall CNT can be activated with ns laser for electroless plating. • Developed material is cheap decision for MID applications. • Activation mechanism was preliminary proposed. • Demo for automotive application has been manufactured. - Abstract: Moulded interconnect devices (MID) offer the material, weight and cost saving by integration electronic circuits directly into polymeric components used in automotive and other consumer products. Lasers are used to write circuits directly by modifying the surface of polymers followed by an electroless metal plating. A new composite material – the polypropylene doped with multiwall carbon nanotubes was developed for the laser-induced selective metallization. Mechanism of surface activation by laser irradiation was investigated in details utilising pico- and nanoseconds lasers. Deposition of copper was performed in the autocatalytic electroless plating bath. The laser-activated polymer surfaces have been studied using the Raman spectroscopy and scanning electron microscope (SEM). Microscopic images revealed that surface becomes active only after its melting by a laser. Alterations in the Raman spectra of the D and G bands indicated the clustering of carbon additives in the composite material. Optimal laser parameters for the surface activation were found by measuring a sheet resistance of the finally metal-plated samples. A spatially selective copper plating was achieved with the smallest conductor line width of 22 μm at the laser scanning speed of 3 m/s and the pulse repetition rate of 100 kHz. Finally, the technique was validated by making functional electronic circuits by this MID approach.

Electroless Plated Nanodiamond Coating for Stainless Steel Passivation

International Nuclear Information System (INIS)

Li, D.; Korinko, P.; Spencer, W.; Stein, E.

2016-01-01

Tritium gas sample bottles and manifold components require passivation surface treatments to minimize the interaction of the hydrogen isotopes with surface contamination on the stainless steel containment materials. This document summarizes the effort to evaluate electroless plated nanodiamond coatings as a passivation layer for stainless steel. In this work, we developed an electroless nanodiamond (ND)-copper (Cu) coating process to deposit ND on stainless steel parts with the diamond loadings of 0%, 25% and 50% v/v in a Cu matrix. The coated Conflat Flanged Vessel Assemblies (CFVAs) were evaluated on surface morphology, composition, ND distribution, residual hydrogen release, and surface reactivity with deuterium. For as-received Cu and ND-Cu coated CFVAs, hydrogen off-gassing is rapid, and the off-gas rates of H 2 was one to two orders of magnitude higher than that for both untreated and electropolished stainless steel CFVAs, and hydrogen and deuterium reacted to form HD as well. These results indicated that residual H 2 was entrapped in the Cu and ND-Cu coated CFVAs during the coating process, and moisture was adsorbed on the surface, and ND and/or Cu might facilitate catalytic isotope exchange reaction for HD formation. However, hydrocarbons (i.e., CH 3 ) did not form, and did not appear to be an issue for the Cu and ND-Cu coated CFVAs. After vacuum heating, residual H 2 and adsorbed H 2 O in the Cu and ND-Cu coated CFVAs were dramatically reduced. The H 2 off-gassing rate after the vacuum treatment of Cu and 50% ND-Cu coated CFVAs was on the level of 10 -14 l mbar/s cm 2 , while H 2 O off-gas rate was on the level of 10 -15 l mbar/s cm 2 , consistent with the untreated or electropolished stainless steel CFVA, but the HD formation remained. The Restek EP bottle was used as a reference for this work. The Restek Electro-Polished (EP) bottle and their SilTek coated bottles tested under a different research project exhibited very little hydrogen off-gassing and

Electroless Fabrication of Cobalt Alloys Nanowires within Alumina Template

Directory of Open Access Journals (Sweden)

Nazila Dadvand

2007-01-01

Full Text Available A new method of nanowire fabrication based on electroless deposition process is described. The method is novel compared to the current electroless procedure used in making nanowires as it involves growing nanowires from the bottom up. The length of the nanowires was controlled at will simply by adjusting the deposition time. The nanowires were fabricated within the nanopores of an alumina template. It was accomplished by coating one side of the template by a thin layer of palladium in order to activate the electroless deposition within the nanopores from bottom up. However, prior to electroless deposition process, the template was pretreated with a suitable wetting agent in order to facilitate the penetration of the plating solution through the pores. As well, the electroless deposition process combined with oblique metal evaporation process within a prestructured silicon wafer was used in order to fabricate long nanowires along one side of the grooves within the wafer.

Processing of aluminum matrix composites by electroless plating and melt infiltration

International Nuclear Information System (INIS)

Leon, C.A.; Bourassa, A.-M.; Drew, R.A.L.

2000-01-01

Reduction of the SiC/ Al interaction and enhancement of wetting between reinforcements and molten aluminum was obtained by modifying the ceramic surface with deposition of nickel and copper coatings. The preparation of nickel- and copper-coated ceramic particles as precursors for MMC fabrication was studied. Al 2 O 3 and SiC powders were successfully coated with Ni and Cu using electroless metal plating. Uniform and continuous metal films were deposited on both, alumina and silicon carbide powders XRD showed that the Ni-P deposit was predominantly amorphous, while the copper deposit was essentially polycrystalline. Infiltration results showed that the use of the coated powders enhances the wettability between the matrix and ceramic phase when processing particulate MMCs by a vacuum infiltration technique, giving a porosity-free composite with a homogeneously distributed reinforcing phase. The coating promoted easy metal flow through the preform, compared to the non-infiltration behavior of the uncoated counterpart samples XRD microstructural analysis of the composites indicates the formation of intermetallic phases such as CuAl 2 , in the case of copper coating, and NiAl and NiAl 3 when nickel-coated powders are infiltrated. Metallization of the ceramics minimizes the interfacial reaction of the SiC/Al composites and promotes wetting of Al 2 O 3 reinforcements with liquid aluminum. Copyright (2000) AD-TECH - International Foundation for the Advancement of Technology Ltd

Laser-induced selective metallization of polypropylene doped with multiwall carbon nanotubes

Science.gov (United States)

Ratautas, Karolis; Gedvilas, Mindaugas; Stankevičiene, Ina; Jagminienė, Aldona; Norkus, Eugenijus; Pira, Nello Li; Sinopoli, Stefano; Račiukaitis, Gediminas

2017-08-01

Moulded interconnect devices (MID) offer the material, weight and cost saving by integration electronic circuits directly into polymeric components used in automotive and other consumer products. Lasers are used to write circuits directly by modifying the surface of polymers followed by an electroless metal plating. A new composite material - the polypropylene doped with multiwall carbon nanotubes was developed for the laser-induced selective metallization. Mechanism of surface activation by laser irradiation was investigated in details utilising pico- and nanoseconds lasers. Deposition of copper was performed in the autocatalytic electroless plating bath. The laser-activated polymer surfaces have been studied using the Raman spectroscopy and scanning electron microscope (SEM). Microscopic images revealed that surface becomes active only after its melting by a laser. Alterations in the Raman spectra of the D and G bands indicated the clustering of carbon additives in the composite material. Optimal laser parameters for the surface activation were found by measuring a sheet resistance of the finally metal-plated samples. A spatially selective copper plating was achieved with the smallest conductor line width of 22 μm at the laser scanning speed of 3 m/s and the pulse repetition rate of 100 kHz. Finally, the technique was validated by making functional electronic circuits by this MID approach.

Electroless nickel plating on stainless steels and aluminum

Science.gov (United States)

1966-01-01

Procedures for applying an adherent electroless nickel plating on 303 SE, 304, and 17-7 PH stainless steels, and 7075 aluminum alloy was developed. When heat treated, the electroless nickel plating provides a hard surface coating on a high strength, corrosion resistant substrate.

Electrochemical studies on electroless ternary and quaternary Ni-P based alloys

International Nuclear Information System (INIS)

Balaraju, J.N.; Selvi, V. Ezhil; Grips, V.K. William; Rajam, K.S.

2006-01-01

The autocatalytic (electroless) deposition of Ni-P based alloys is a well-known commercial process that has found numerous applications because of their excellent anticorrosive, wear, magnetic, solderable properties, etc. It is a barrier coating, protecting the substrate by sealing it off from the corrosive environments, rather than by sacrificial action. The corrosion resistance varies with the phosphorus content of the deposit: relatively high for a high-phosphorus electroless nickel deposit but low for a low-phosphorus electroless nickel deposit. In the present investigation ternary Ni-W-P alloy films were prepared using alkaline citrate-based bath. Quaternary Ni-W-Cu-P films were deposited by the addition of 3 mM copper ions in ternary Ni-W-P bath. X-ray diffraction (XRD) studies indicated that all the deposits were nanocrystalline, i.e. 1.2, 2.1 and 6.0 nm, respectively, for binary, ternary and quaternary alloys. Corrosion resistance of the films was evaluated in 3.5% sodium chloride solution in non-deaerated and deaerated conditions by potentiodynamic polarization and electrochemical impedance (EIS) methods. Lower corrosion current density values were obtained for the coatings tested in deaerated condition. EIS studies showed that higher charge transfer resistance values were obtained for binary Ni-P coatings compared to ternary or quaternary coatings. For all the coatings a gradual increase in the anodic current density had been observed beyond 740 mV. In deaerated condition all the reported coatings exhibited a narrow passive region and all the values of E p , E tp and i pass were very close showing no major changes in the electrochemical behavior. In the non-deaerated conditions no passivation behavior had been observed for all these coatings

Region-selective electroless gold plating on polycarbonate sheets by UV-patterning in combination with silver activating

Energy Technology Data Exchange (ETDEWEB)

Zhou Qinghua [Institute of Microanalytical Systems, Department of Chemistry, Zhejiang University, Zijin' gang Campus, Hangzhou 310058 (China); Chen Hengwu, E-mail: hwchen@zju.edu.c [Institute of Microanalytical Systems, Department of Chemistry, Zhejiang University, Zijin' gang Campus, Hangzhou 310058 (China); Wang Yi [Institute of Microanalytical Systems, Department of Chemistry, Zhejiang University, Zijin' gang Campus, Hangzhou 310058 (China)

2010-02-28

A simple, time- and cost-effective approach for region-selective metalization of polycarbonate (PC) surface has been established by combining photoresist-free UV-patterning with tin- and amine-free silver activating and electroless gold plating. The surface of PC sheets was exposed to the UV lights emitted from a low-pressure mercury lamp through a photomask, the micro pattern on the mask being transferred to the PC surface due to the photochemical generation of carboxyl groups on the UV-exposed region. The UV-exposed PC sheets were then treated with an ammoniacal AgNO{sub 3} solution, so that the silver ions were chemisorbed by the photochemically generated carboxyl groups. When the Ag{sup +}-adsorbed PC sheet was immersed into an electroless gold plating bath, shiny gold film quickly deposited on the UV-exposed region, resulting in the formation of a micro gold devices on the PC surface. The whole plating process including UV-exposure, surface activating and gold plating can be completed in about 3-4 h. Attenuated total reflection Fourier transformation infrared spectrometer (ATR-FT-IR), X-ray photoelectron spectroscopy (XPS), atomic force microscope (AFM) and scanning electron microscope (SEM) were employed to trace the surface change during the plating process. Cyclic voltammetry (CV) and Scotch-tape test were employed to characterize the electrochemical properties and adhesion strength of the prepared micro gold devices, respectively. The prepared micro gold electrodes were demonstrated for amperometric detection of hydrogen peroxide.

Direct write of copper-graphene composite using micro-cold spray

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Sameh Dardona

2016-08-01

Full Text Available Direct write of a new class of composite materials containing copper and graphene in the powder phase is described. The composite was synthesized using batch electroless plating of copper for various times onto Nano Graphene Platelets (NGP to control the amount of copper deposited within the loosely aggregated graphene powder. Copper deposition was confirmed by both Focused Ion Beam (FIB and Auger electron spectroscopic analysis. A micro-cold spray technique was used to deposit traces that are ∼230 μm wide and ∼5 μm thick of the formulated copper/graphene powder onto a glass substrate. The deposited traces were found to have good adhesion to the substrate with ∼65x the copper bulk resistivity.

Electroless Nickel-Based Catalyst for Diffusion Limited Hydrogen Generation through Hydrolysis of Borohydride

Directory of Open Access Journals (Sweden)

Shannon P. Anderson

2013-07-01

Full Text Available Catalysts based on electroless nickel and bi-metallic nickel-molybdenum nanoparticles were synthesized for the hydrolysis of sodium borohydride for hydrogen generation. The catalysts were synthesized by polymer-stabilized Pd nanoparticle-catalyzation and activation of Al2O3 substrate and electroless Ni or Ni-Mo plating of the substrate for selected time lengths. Catalytic activity of the synthesized catalysts was tested for the hydrolyzation of alkaline-stabilized NaBH4 solution for hydrogen generation. The effects of electroless plating time lengths, temperature and NaBH4 concentration on hydrogen generation rates were analyzed and discussed. Compositional analysis and surface morphology were carried out for nano-metallized Al2O3 using Scanning Electron Micrographs (SEM and Energy Dispersive X-Ray Microanalysis (EDAX. The as-plated polymer-stabilized electroless nickel catalyst plated for 10 min and unstirred in the hydrolysis reaction exhibited appreciable catalytic activity for hydrolysis of NaBH4. For a zero-order reaction assumption, activation energy of hydrogen generation using the catalyst was estimated at 104.6 kJ/mol. Suggestions are provided for further work needed prior to using the catalyst for portable hydrogen generation from aqueous alkaline-stabilized NaBH4 solution for fuel cells.

Electroless Plated Nanodiamond Coating for Stainless Steel Passivation

Energy Technology Data Exchange (ETDEWEB)

Li, D. [Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL); Korinko, P. [Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL); Spencer, W. [Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL); Stein, E. [Savannah River Site (SRS), Aiken, SC (United States). Savannah River National Lab. (SRNL)

2016-09-15

Tritium gas sample bottles and manifold components require passivation surface treatments to minimize the interaction of the hydrogen isotopes with surface contamination on the stainless steel containment materials. This document summarizes the effort to evaluate electroless plated nanodiamond coatings as a passivation layer for stainless steel. In this work, we developed an electroless nanodiamond (ND)-copper (Cu) coating process to deposit ND on stainless steel parts with the diamond loadings of 0%, 25% and 50% v/v in a Cu matrix. The coated Conflat Flanged Vessel Assemblies (CFVAs) were evaluated on surface morphology, composition, ND distribution, residual hydrogen release, and surface reactivity with deuterium. For as-received Cu and ND-Cu coated CFVAs, hydrogen off-gassing is rapid, and the off-gas rates of H₂ was one to two orders of magnitude higher than that for both untreated and electropolished stainless steel CFVAs, and hydrogen and deuterium reacted to form HD as well. These results indicated that residual H₂ was entrapped in the Cu and ND-Cu coated CFVAs during the coating process, and moisture was adsorbed on the surface, and ND and/or Cu might facilitate catalytic isotope exchange reaction for HD formation. However, hydrocarbons (i.e., CH₃) did not form, and did not appear to be an issue for the Cu and ND-Cu coated CFVAs. After vacuum heating, residual H₂ and adsorbed H₂O in the Cu and ND-Cu coated CFVAs were dramatically reduced. The H₂ off-gassing rate after the vacuum treatment of Cu and 50% ND-Cu coated CFVAs was on the level of 10^-14 l mbar/s cm², while H₂O off-gas rate was on the level of 10^-15 l mbar/s cm², consistent with the untreated or electropolished stainless steel CFVA, but the HD formation remained. The Restek EP bottle was used as a reference for this work. The Restek Electro-Polished (EP) bottle and their Sil

Mechanical characterization of copper coated carbon nanotubes reinforced aluminum matrix composites

International Nuclear Information System (INIS)

Maqbool, Adnan; Hussain, M. Asif; Khalid, F. Ahmad; Bakhsh, Nabi; Hussain, Ali; Kim, Myong Ho

2013-01-01

In this investigation, carbon nanotube (CNT) reinforced aluminum composites were prepared by the molecular-level mixing process using copper coated CNTs. The mixing of CNTs was accomplished by ultrasonic mixing and ball milling. Electroless Cu-coated CNTs were used to enhance the interfacial bonding between CNTs and aluminum. Scanning electron microscope analysis revealed the homogenous dispersion of Cu-coated CNTs in the composite samples compared with the uncoated CNTs. The samples were pressureless sintered under vacuum followed by hot rolling to promote the uniform microstructure and dispersion of CNTs. In 1.0 wt.% uncoated and Cu-coated CNT/Al composites, compared to pure Al, the microhardness increased by 44% and 103%, respectively. As compared to the pure Al, for 1.0 wt.% uncoated CNT/Al composite, increase in yield strength and ultimate tensile strength was estimated about 58% and 62%, respectively. However, in case of 1.0 wt.% Cu-coated CNT/Al composite, yield strength and ultimate tensile strength were increased significantly about 121% and 107%, respectively. - Graphical Abstract: Copper coated CNTs were synthesized by the electroless plating process. Optimizing the plating bath to (1:1) by wt CNTs with Cu, thickness of Cu-coated CNTs has been reduced to 100 nm. Cu-coated CNTs developed the stronger interfacial bonding with the Al matrix which resulted in the efficient transfer of load. Highlights: • Copper coated CNTs were synthesized by the electroless plating process. • Thickness of Cu-coated CNTs has been reduced to 100 nm by optimized plating bath. • In 1.0 wt.% Cu-coated CNT/Al composite, microhardness increased by 103%. • Cu-coated CNTs transfer load efficiently with stronger interfacial bonding. • In 1.0 wt.% Cu-coated CNT/Al composite, Y.S and UTS increased by 126% and 105%

Electroless alloy/composite coatings

Indian Academy of Sciences (India)

The market for these coatings is expanding fast as the potential applications are on the rise. In the present article, an attempt has been made to review different electroless alloy/composite coatings with respect to bath types and their composition, properties and applications. Different characterisation studies have been ...

Facile synthesis of dendritic Cu by electroless reaction of Cu-Al alloys in multiphase solution

Science.gov (United States)

Wang, Ying; Liang, Shuhua; Yang, Qing; Wang, Xianhui

2016-11-01

Two-dimensional nano- or micro-scale fractal dendritic coppers (FDCs) were synthesized by electroless immersing of Cu-Al alloys in hydrochloric acid solution containing copper chloride without any assistance of template or surfactant. The FDC size increases with the increase of Al content in Cu-Al alloys immersed in CuCl2 + HCl solution. Compared to Cu40Al60 and Cu45Al55 alloys, the FDC shows hierarchical distribution and homogeneous structures using Cu17Al83 alloy as the starting alloy. The growth direction of the FDC is , and all angles between the trunks and branches are 60°. Nanoscale Cu2O was found at the edge of FDC. Interestingly, nanoporous copper (NPC) can also be obtained through Cu17Al83 alloy. Studies showed that the formation of FDC depended on two key factors: the potential difference between CuAl2 intermetallic and α-Al phase of dual-phase Cu-Al alloys; a replacement reaction that usually occurs in multiphase solution. The electrochemical experiment further proved that the multi-branch dendritic structure is very beneficial to the proton transfer in the process of catalyzing methanol.

Tribological properties of copper-based composites with copper coated NbSe2 and CNT

International Nuclear Information System (INIS)

Chen, Beibei; Yang, Jin; Zhang, Qing; Huang, Hong; Li, Hongping; Tang, Hua; Li, Changsheng

2015-01-01

Graphical abstract: Morphology of copper coated NbSe 2 and CNT; friction coefficient and wear rate of copper-based composites. - Highlights: • NbSe 2 and CNT were coated with copper layers by the means of electroless plating. • The mechanical and tribological properties of copper composites were studied. • The enhancement mechanisms of copper coated NbSe 2 and CNT were proposed. • Copper–copper coated (12 wt.%NbSe 2 –3 wt.%CNT) composite had the best wear resistance. - Abstract: Copper-based composites with copper coated NbSe 2 and/or CNT were fabricated by the powder metallurgy technique. The morphology and phase composition of copper coated NbSe 2 and carbon nanotube (CNT) were observed using high solution transmission electronic microscope (HRTEM), scanning electronic microscope (SEM equipped with EDS) and X-ray diffraction (XRD). The density, hardness, and bending strength of as-prepared copper-based composites were measured, and their tribological properties were investigated using UMT-2 tester. Results indicated that all copper-based composites showed decreased density and bending strength, but increased hardness in comparison with copper matrix. Besides, the incorporation of copper coated NbSe 2 improved the friction-reducing and anti-wear properties of copper matrix. Addition of copper coated CNT greatly enhanced the mechanical and tribological properties. In particular, when the content of copper coated CNT was 3 wt.%, the corresponding composite exhibited the best tribological properties. This was because NbSe 2 was distributed chaotically in matrix, which greatly improved the friction-reducing property of copper, while CNT with superior mechanical strength enhanced the wear resistance by increasing the load-carrying capacity. More importantly, copper layers coated on NbSe 2 and CNT favored the good interfacial combination between fillers and copper matrix showing beneficial effect for the stresses transferring from matrix to fillers

Selective leaching process for the recovery of copper and zinc oxide from copper-containing dust.

Science.gov (United States)

Wu, Jun-Yi; Chang, Fang-Chih; Wang, H Paul; Tsai, Ming-Jer; Ko, Chun-Han; Chen, Chih-Cheng

2015-01-01

The purpose of this study was to develop a resource recovery procedure for recovering copper and zinc from dust produced by copper smelting furnaces during the manufacturing of copper-alloy wires. The concentrations of copper in copper-containing dust do not meet the regulation standards defined by the Taiwan Environmental Protection Administration; therefore, such waste is classified as hazardous. In this study, the percentages of zinc and copper in the dust samples were approximately 38.4% and 2.6%, respectively. To reduce environmental damage and recover metal resources for industrial reuse, acid leaching was used to recover metals from these inorganic wastes. In the first stage, 2 N of sulphuric acid was used to leach the dust, with pH values controlled at 2.0-3.0, and a solid-to-liquid ratio of 1:10. The results indicated that zinc extraction efficiency was higher than 95%. A selective acid leaching process was then used to recover the copper content of the residue after filtration. In the second stage, an additional 1 N of sulphuric acid was added to the suspension in the selective leaching process, and the pH value was controlled at 1.5-2.0. The reagent sodium hydroxide (2 N) was used as leachate at a pH greater than 7. A zinc hydroxide compound formed during the process and was recovered after drying. The yields for zinc and copper were 86.9-93.5% and 97.0-98.9%, respectively.

Selective LPCVD growth of graphene on patterned copper and its growth mechanism

Science.gov (United States)

Zhang, M.; Huang, B.-C.; Wang, Y.; Woo, J. C. S.

2016-12-01

Copper-catalyzed graphene low-pressure chemical-vapor deposition (LPCVD) growth has been regarded as a viable solution towards its integration to CMOS technology, and the wafer-bonding method provides a reliable alternative for transferring the selective graphene grown on a patterned metal film for IC manufacturing. In this paper, selective LPCVD graphene growth using patterned copper dots has been studied. The Raman spectra of grown films have demonstrated large dependence on the growth conditions. To explain the results, the growth mechanisms based on surface adsorption and copper-vapor-assisted growth are investigated by the comparison between the blanket copper films with/without the additional copper source. The copper vapor density is found to be critical for high-quality graphene growth. In addition, the copper-vapor-assisted growth is also evidenced by the carbon deposition on the SiO2 substrate of the patterned-copper-dot sample and chamber wall during graphene growth. This growth mechanism explains the correlation between the growth condition and Raman spectrum for films on copper dots. The study on the copper-catalyzed selective graphene growth on the hard substrate paves the way for the synthesis and integration of the 2D material in VLSI.

A smart magnetic resonance contrast agent for selective copper sensing.

Science.gov (United States)

Que, Emily L; Chang, Christopher J

2006-12-20

We describe the synthesis and properties of Copper-Gad-1 (CG1), a new type of smart magnetic resonance (MR) sensor for selective detection of copper. CG1 is composed of a gadolinium contrast agent core tethered to copper-selective recognition motif. Cu2+-induced modulation of inner-sphere water access to the Gd3+ center provides a sensing mechanism for reporting Cu2+ levels by reading out changes in longitudinal proton relaxivity values. CG1 features good selectivity for Cu2+ over abundant biological cations and a 41% increase in relaxivity upon Cu2+ binding and is capable of detecting micromolar changes in Cu2+ concentrations in aqueous media.

Electroless metal plating of plastics

International Nuclear Information System (INIS)

Krause, L.J.

1986-01-01

The product of an electroless plating process is described for plating at least one main group metal directly on a surface of a polymeric substrate comprising the steps of forming a nonaqueous solution containing a metallic salt of an alkali metal in a positive valence state and at least one main group metal in a negative valence state, the main group metal being selected from the group consisting of Ge, Sn, Pb, As, Sb, Bi, Si and Te, selecting an aromatic polymeric substrate reducible by the solublized salt and resistant to degration during the reaction, and carrying out a redox reaction between the salt in solution and the substrate by contacting the solution with the substrate for a sufficient time to oxidize and deposit the main group metal in elemental form to produce a plated substrate. The product is characterized by the plated metal being directly on the surface of the polymeric substrate and the alkali metal being retained in the plated substrate with the substrate being negatively charged with electrons transferred from the main group metal during the redox reaction

Electroless plating technology of integral hohlraum Cu target

International Nuclear Information System (INIS)

Liu Jiguang; Fu Qu; Wan Xiaobo; Zhou Lan; Xiao Jiang

2005-01-01

The electroless plating method of making integral hohlraum Cu target and corrosion-resistant technology of target's surface were researched. The actual process was as follows, choosing plexiglass (PMMA) as arbor, taking cationic activation and electroless plating Cu on the arbor surface, taking arbor surface passivation and chemical etching by C 6 H 5 N 3 solution. The technology is easy to realize and its cost is lower, so it is of great reference value for fabricating other integral hohlraum metal or alloy targets used for inertial confinement fusion study. (author)

The performance of electroless nickel deposits in oil-field environments

International Nuclear Information System (INIS)

Mack, R.; Bayes, M.

1984-01-01

An experimental study was conducted on an electroless nickel plated (represented by Enplate NI-422) C-90 steel, uncoated C-90 steel, AISI 420, 174 PH, SAF 2205, and HASTELLOY /sup R/ G-3 to determine their corrosion-performance in twelve simulated downhole oil or gas production environments during 28 day exposures. These environments were aqueous brines containing various concentrations of Cl - , H 2 S and/or CO 2 , and over a range of temperatures. The results from this study and oilfield data for electroless nickel plated low alloy steels are presented and discussed. The study demonstrates the feasibility of electroless nickel coated low alloy steels as an economical substitute for some highly alloyed materials in certain oilfield applications; the field data support this

A copper ion-selective electrode with high selectivity prepared by sol-gel and coated wire techniques.

Science.gov (United States)

Mazloum Ardakani, M; Salavati-Niasari, M; Khayat Kashani, M; Ghoreishi, S M

2004-03-01

A sol-gel electrode and a coated wire ion-selective poly(vinyl chloride) membrane, based on thiosemicarbazone as a neutral carrier, were successfully developed for the detection of Cu (II) in aqueous solutions. The sol-gel electrode and coated electrode exhibited linear response with Nernstian slopes of 29.2 and 28.1 mV per decade respectively, within the copper ion concentration ranges 1.0 x 10(-5) - 1.0 x 10(-1) M and 6.0 x 10(-6) - 1.0 x 10(-1) M for coated and sol-gel sensors. The coated and sol-gel electrodes show detection limits of 3.0 x 10(-6) and 6.0 x 10(-6) M respectively. The electrodes exhibited good selectivities for a number of alkali, alkaline earth, transition and heavy metal ions. The proposed electrodes have response times ranging from 10-50 s to achieve a 95% steady potential for Cu2+ concentration. The electrodes are suitable for use in aqueous solutions over a wide pH range (4-7.5). Applications of these electrodes for the determination of copper in real samples, and as an indicator electrode for potentiometric titration of Cu2+ ion using EDTA, are reported. The lifetimes of the electrodes were tested over a period of six months to investigate their stability. No significant change in the performance of the sol-gel electrode was observed over this period, but after two months the coated wire copper-selective electrode exhibited a gradual decrease in the slope. The selectivity of the sol-gel electrode was found to be better than that of the coated wire copper-selective electrode. Based on these results, a novel sol-gel copper-selective electrode is proposed for the determination of copper, and applied to real sample assays.

Broadband infrared absorption enhancement by electroless-deposited silver nanoparticles

Directory of Open Access Journals (Sweden)

Gritti Claudia

2016-07-01

Full Text Available Decorating semiconductor surfaces with plasmonic nanoparticles (NPs is considered a viable solution for enhancing the absorptive properties of photovoltaic and photodetecting devices. We propose to deposit silver NPs on top of a semiconductor wafer by a cheap and fast electroless plating technique. Optical characterization confirms that the random array of electroless-deposited NPs improves absorption by up to 20% in a broadband of near-infrared frequencies from the bandgap edge to 2000 nm. Due to the small filling fraction of particles, the reflection in the visible range is practically unchanged, which points to the possible applications of such deposition method for harvesting photons in nanophotonics and photovoltaics. The broadband absorption is a consequence of the resonant behavior of particles with different shapes and sizes, which strongly localize the incident light at the interface of a high-index semiconductor substrate. Our hypothesis is substantiated by examining the plasmonic response of the electroless-deposited NPs using both electron energy loss spectroscopy and numerical calculations.

Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization

Energy Technology Data Exchange (ETDEWEB)

Wang, Yuechun [School of Materials Science and Engineering, Yunnan University, Kunming (China); Chen, Xiuhua, E-mail: chenxh@ynu.edu.cn [School of Materials Science and Engineering, Yunnan University, Kunming (China); Ma, Wenhui [National Engineering Laboratory of Vacuum Metallurgy, Kunming University of Science and Technology, Kunming (China); Shang, Yudong; Lei, Zhengtao; Xiang, Fuwei [School of Materials Science and Engineering, Yunnan University, Kunming (China)

2017-02-28

Highlights: • In this paper, the electroless deposited NiCrB thin film was mainly in the form of NiB, CrB{sub 2} compounds and elementary Ni. • The sheet resistance of NiCrB thin film was 3.043 Ω/□, it is smaller than that of the widely used Ta, TaN and TiN diffusion barrier layers. • Annealing experiments showed that the failure temperature of NiCrB thin film regarding Cu diffusion was 900 °C. • NiCrB barrier layer crystallized after 900 °C annealing, Cu grains arrived at Si-substrate through grain boundaries, resulting in the formation of Cu{sub 3}Si. • Eelectroless deposited NiCrB film also had good oxidation resistance, it is expected to become an anti-oxidant layer of copper interconnection. - Abstract: NiCrB films were deposited on Si substrates using electroless deposition as a diffusion barrier layer for Cu interconnections. Samples of the prepared NiCrB/SiO{sub 2}/Si and NiCrB/Cu/NiCrB/SiO{sub 2}/Si were annealed at temperatures ranging from 500 °C to 900 °C. The reaction mechanism of the electroless deposition of the NiCrB film, the failure temperature and the failure mechanism of the NiCrB diffusion barrier layer were investigated. The prepared samples were subjected to XRD, XPS, FPP and AFM to determine the phases, composition, sheet resistance and surface morphology of samples before and after annealing. The results of these analyses indicated that the failure temperature of the NiCrB barrier film was 900 °C and the failure mechanism led to crystallization and grain growth of the NiCrB barrier layer after high temperature annealing. It was found that this process caused Cu grains to reach Si substrate through the grain boundaries, and then the reaction between Cu and Si resulted in the formation of highly resistive Cu{sub 3}Si.

Selective copper catalysed aromatic N-arylation in water

DEFF Research Database (Denmark)

Engel-Andreasen, Jens; Shimpukade, Bharat; Ulven, Trond.

2013-01-01

4,7-Dipyrrolidinyl-1,10-phenanthroline (DPPhen) was identified as an efficient ligand for copper catalyzed selective arom. N-arylation in water. N-Arylation of indoles, imidazoles and purines proceeds with moderate to excellent yields and complete selectivity over aliph. amines. Aq. medium...

Electrochemical Investigation on the Formation of Cu Nanowires by Electroless Deposition

Directory of Open Access Journals (Sweden)

Felizco Jenichi Clairvaux E.

2015-01-01

Full Text Available The growth of copper (Cu nanowires by electroless deposition in aqueous solution at 60-80 °C was studied from an electrochemical perspective using in situ mixed potential measurements and potential-pH diagrams. Scanning Electron Microscopy (SEM showed that thick and short nanowires were obtained at high temperatures, while long and thin nanowires result from low reaction temperatures. In situ mixed potential measurements reveal that Cu(II reduction is more favored at higher reaction temperatures, hastening the reduction reaction. The fast reaction leads to a high concentration of Cu atoms in the solution. As a result, Cu deposition occurs rapidly, such that they attached on both sides and ends of the primary Cu nanowires. This results to the formation of thick and short structures. On the other hand, thin and long nanowires are obtained due to the slow reduction reaction, which gives the Cu atoms more time to orderly attach in a wire-like formation.

Development of process technologies for improvement of electroless nickel coatings properties

International Nuclear Information System (INIS)

Barba-Pingarrón, A; Trujillo-Barragán, M; Hernandez-Gallegos, M A; Valdez-Navarro, R; Bolarín-Miró, A; Jesús, F Sánchez – de; Vargas-Mendoza, L; Molera-Sola, P

2013-01-01

This paper describes research and technology developments that enable to improve nickel electroless coating properties. This work deals with: (a) different methods in order to achieve Ni-P-Mo coatings. (b) Other development is related with coatings with addition of hard particles such as SiC, WC or Al 2 O 3 ,(c) Electroless nickel deposits on PBT and austempered ductile iron (ADI). (d) In addition, nickel coatings were deposited on powder metallic pieces and finally, electroless nickel coatings, in conjunction with layers from thermal spray process were formed. Characterization of all coatings by means of optical microscopy, scanning electron microscopy, micro-hardness, wear and corrosion tests were carried out. Results indicate positive increment in both mechanical and electrochemical properties which enhance field applications in Mexican industry.

Electroless alloy/composite coatings: A review

Indian Academy of Sciences (India)

M. Senthilkumar (Newgen Imaging) 1461 1996 Oct 15 13:05:22

pharmaceutical ... Four types of reducing agent have been used for electroless nickel bath including ..... coatings, however, the bath is more stable at a pH of about 9. 5. ..... ite coating by dry sliding tests with a slider-on-cylinder tribometer in ...

Review on Electroless Plating Ni-P Coatings for Improving Surface Performance of Steel

Science.gov (United States)

Zhang, Hongyan; Zou, Jiaojuan; Lin, Naiming; Tang, Bin

2014-04-01

Electroless plating has been considered as an effective approach to provide protection and enhancement for metallic materials with many excellent properties in engineering field. This paper begins with a brief introduction of the fundamental aspects underlying the technological principles and conventional process of electroless nickel-phosphorus (Ni-P) coatings. Then this paper discusses different electroless nickel plating, including binary plating, ternary composite plating and nickel plating with nanoparticles and rare earth, with the intention of improving the surface performance on steel substrate in recent years in detail. Based on different coating process, the varied features depending on the processing parameters are highlighted. Separately, diverse preparation techniques aiming at improvement of plating efficiency are summarized. Moreover, in view of the outstanding performance, such as corrosion resistance, abrasive resistance and fatigue resistance, this paper critically reviews the behaviors and features of various electroless coatings under different conditions.

ELECTROLESS NICKEL PLATING ON ABS PLASTIC BY USING ENVIRONMENTALLY FRIENDLY CHEMICALS

OpenAIRE

Uraz, Canan

2017-01-01

In this study, electroless nickel (EN) plating onacrylonitrile butadiene styrene (ABS) engineering plastic by usingenvironmentally friendly chemicals were studied. Electroless plating is afundamental step in the metal plating on the plastic. This step makes theplastic conductive and makes it possible to a homogeneous and hard platingwithout using any hazardous and unfriendly chemical such as palladium, tin,etc. In the industry there are many distinct chemical materials both catalystsand activ...

Tentative investigation on neutron mirror fabrication with electroless nickel plating

International Nuclear Information System (INIS)

Guo, Jiang; Morita, Shin-ya; Yamagata, Yutaka; Takeda, Shin; Kato, Jun-ichi; Hino, Masahiro; Furusaka, Michihiro

2013-01-01

Neutron optics becomes highly required due to the rapid development of neutron technology. In this paper, we attempt to fabricate the neutron mirror by using a metal substrate made of electroless nickel plating to take place of glass concerning about mirror's optical performance and manufacturing method. A new manufacture process chain of neutron mirror is proposed by following the steps of fast milling and precision cutting of aluminium/stainless, electroless nickel plating, ultra-precision cutting by diamond tools, super-smooth polishing and super mirror coating to obtain high form accuracy and good surface roughness time-efficiently. Some tentative investigations are carried out. A workpiece (□ 50 x 50 mm 2 ) with flat surface made of electroless nickel plating is machined by ultra-precision cutting and polishing. The surface roughness with 0.728 nm rms (0.588 nm Ra) is acquired. According to results of reflectometry, the neutron beam can be reflected effectively with high intensity and little scattering. (author)

Development and electrochemical characterization of Ni‐P coated tungsten incorporated electroless nickel coatings

Energy Technology Data Exchange (ETDEWEB)

Shibli, S.M.A., E-mail: smashibli@yahoo.com; Chinchu, K.S.

2016-08-01

Ni‐P-W alloy and composite coatings were prepared by incorporation of sodium tungstate/tungsten and Ni‐P coated tungsten into electroless nickel bath respectively. Good inter-particle interactions among the depositing elements i.e. Ni and P with the incorporating tungsten particles were achieved by means of pre-coated tungsten particle by electroless nickel covering prior to its addition into the electroless bath. The pre-coated tungsten particles got incorporated uniformly into the Ni-P matrix of the coating. The particles and the coatings were characterized at different stages by different techniques including X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy dispersive spectrometry (EDS). The electroless Ni-P coating incorporated with pre-coated tungsten exhibited considerably high hardness, thickness and deposition rate. The performance and corrosion resistance characteristics of the composite coating incorporated with the nickel coated tungsten were found to be superior over other conventional Ni-P-W ternary alloy coatings currently reported. - Highlights: • An amorphous Ni-P coating was effectively formed on tungsten particles. • Electroless ternary Ni-P-W composite coatings were successfully prepared. • Enhancement in the inter-particle interaction in the Ni-P composite matrix was achieved. • Efficient and uniform incorporation of the composite in the internal layer was evident. • The tungsten incorporated coating possessed effective barrier protection.

Electroless siliconizing Fe-3% Cr-3% Si alloy

International Nuclear Information System (INIS)

Nurlina, Enung; Darmono, Budy; Purwadaria, Sunara

2000-01-01

In this research Fe-3%Cr-3%Mo-3%Si and Fe-3%Cr-3%Cu-3%Si alloys had been coated by silicon metal without electricity current which knows as electroless siliconizing. Coating was conducted by immersed sampler into melt fluoride-chloride salt bath at temperature of 750 o C for certain period. The layer consisted of Fe3Si phase. Observation by microscope optic and EDAX showed that the silicide layer were thick enough, adherent, free for crack and had silicon content on the surface more than 15%. The growth rate of silicide layer followed parabolic rate law, where the process predominantly controlled by interdiffusion rate in the solid phase. Key words : electroless siliconizing, the melt fluoride- chloride salt mix, silicide layer

Comparison of galvanic displacement and electroless methods for ...

Indian Academy of Sciences (India)

tron microscopy, field emission scanning electron microscopy (FE–SEM) and diffuse reflectance spectroscopy (DRS) .... FE–SEM images of gold nanoparticles deposited calcite, prepared by electroless ... or Au3+ compound of oxalate. The Ag.

Development of nickel membranes deposited on ceramic materials by electroless plating: studies of the hydrogen perm-selectivity properties at elevated temperatures

International Nuclear Information System (INIS)

Amer, J.

2008-09-01

The main objective of this work was to synthesize nickel based membranes by electroless plating on materials such as alumina-α, alumina-γ and zirconia with various textures and to determine their hydrogen perm-selectivity at high temperatures. The synthesis of metal films of high purity (≥ 99% mass Ni) resulting from the choice of hydrazine with its dual role of reducing and complexing agent has revealed that the diameter of pores on the surface support has an impact on the quality of metal adherence. The various contributions of hydrogen transport through these composite membranes at low temperatures (Knudsen and surface diffusion) and at high temperatures (Knudsen and activated diffusion) was established. At its implementation in a membrane reactor (reaction of propane dehydrogenation), the layer of nickel showed a very good resistance to coking. (author)

A quick rhizobacterial selection tests for the remediation of copper contaminated soils.

Science.gov (United States)

Braud, A M; Hubert, M; Gaudin, P; Lebeau, T

2015-08-01

The main objective of the study is to develop and improve quick bacterial tests to select the best candidates for the bioaugmentation of metal-contaminated soil, coupled with phytoextraction. Bacteria isolates (181) were selected from a collection originated from a Cu-contaminated sediment, on the basis of several miniaturized biochemical tests adapted to the copper contamination. Amongst them, we used a growth soil based-medium to select metal-tolerant bacteria, and their ability to grow and mobilize metals by mean of metabolites (siderophores, organic acids) was also assessed. The result of the bacterial selection tests showed differences in presence or absence of copper, especially for phosphate-solubilizing strains which ability decreased by 53% in the presence of copper hydroxide phosphate as compared to the standard tricalcium phosphate test. A promising Pseudomonas putida was selected from the collection. The study underlined the importance of choosing significant selection tests regarding the nature of the metal occurring in the soil to be cleaned-up to assess the real potential of each bacterial strain for subsequent soil bioaugmentation purposes. © 2015 The Society for Applied Microbiology.

Voltammetric determination of copper in selected pharmaceutical preparations--validation of the method.

Science.gov (United States)

Lutka, Anna; Maruszewska, Małgorzata

2011-01-01

It were established and validated the conditions of voltammetric determination of copper in pharmaceutical preparations. The three selected preparations: Zincuprim (A), Wapń, cynk, miedź z wit. C (B), Vigor complete (V) contained different salts and different quantity of copper (II) and increasing number of accompanied ingredients. For the purpose to transfer copper into solution, the samples of powdered tablets of the first and second preparation were undergone extraction and of the third the mineralization procedures. The concentration of copper in solution was determined by differential pulse voltammetry (DP) using comparison with standard technique. In the validation process, the selectivity, accuracy, precision and linearity of DP determination of copper in three preparations were estimated. Copper was determined within the concentration range of 1-9 ppm (1-9 microg/mL): the mean recoveries approached 102% (A), 100% (B), 102% (V); the relative standard deviations of determinations (RSD) were 0.79-1.59% (A), 0.62-0.85% (B) and 1.68-2.28% (V), respectively. The mean recoveries and the RSDs of determination satisfied the requirements for the analyte concentration at the level 1-10 ppm. The statistical verification confirmed that the tested voltammetric method is suitable for determination of copper in pharmaceutical preparation.

GaN Nanowires Synthesized by Electroless Etching Method

KAUST Repository

Najar, Adel; Anjum, Dalaver H.; Ng, Tien Khee; Ooi, Boon S.; Ben Slimane, Ahmed

2012-01-01

Ultra-long Gallium Nitride Nanowires is synthesized via metal-electroless etching method. The morphologies and optical properties of GaN NWs show a single crystal GaN with hexagonal Wurtzite structure and high luminescence properties.

Electroless deposition, post annealing and characterization of nickel ...

Indian Academy of Sciences (India)

Wintec

Currently at: Department of Physics, Columbia University, New York, USA. MS received 9 ... The electroless deposition is a promising method to prepare durable metal films on both .... graphic data available in literature. The XRD patterns were ...

Comparative study of electroless nickel film on different organic acids modified cuprammonium fabric (CF)

Energy Technology Data Exchange (ETDEWEB)

Zhao, Hang; Lu, Yinxiang, E-mail: yxlu@fudan.edu.cn

2016-01-30

Graphical abstract: - Highlights: • An etchant-free and moderate surface pre-treatment process was studied. • Citric acid, malic acid and oxalic acid were selected as modification agents. • High adhesive nickel coating on cuprammonium fabric was obtained. • The electromagnetic parameters were evaluated from the experimental data. - Abstract: Nickel films were grown on citric acid (CA), malic acid (MA) and oxalic acid (OA) modified cuprammonium fabric (CF) substrates via electroless nickel deposition. The nickel films were examined using scanning electron microscopy (SEM) and X-ray diffraction (XRD). Their individual deposition rate and electromagnetic interference (EMI) shielding effectiveness (SE) were also investigated to compare the properties of electroless nickel films. SEM images illustrated that the nickel film on MA modified CF substrate was smooth and uniform, and the density of nickel nuclei was much higher. Compared with that of CA modified CF, the coverage of nickel nuclei on OA and MA modified CF substrate was very limited and the nickel particles size was too big. XRD analysis showed that the nickel films deposited on the different modified CF substrates had a structure with Ni (1 1 1) preferred orientation. All the nickel coatings via different acid modification were firmly adhered to the CF substrates, as demonstrated by an ultrasonic washing test. The result of tensile test indicated that the electroless nickel plating on CF has ability to strengthen the CF substrate while causes limited effect on tensile elongation. Moreover, the nickel film deposited on MA modified CF substrate showed more predominant in EMI SE than that deposited on CA or OA modified CF.

Development of high performance electroless Ni–P–HNT composite coatings

International Nuclear Information System (INIS)

Ranganatha, S.; Venkatesha, T.V.; Vathsala, K.

2012-01-01

Highlights: ► Novel Ni–P composites were prepared by incorporating Halloysite nanotubes. ► Mild steel specimens surface engineered by nickel using electroless technique. ► Incorporated halloysite nanotubes made nickel matrix highly corrosion resistant. ► HNT composite exhibits high hardness and largely reduces friction. - Abstract: Halloysite nanotubes (HNTs) of the dimension 50 nm × 1–3 μm (diameter × length) are utililized to fabricate the alloy composite by employing electroless/autocatalytic deposition technique. Electroless Ni–P–HNT binary alloy composite coatings are prepared successfully on low carbon steel. These nanotubes were made to get inserted/incorporated into nickel matrix and corresponding composites are examined for their electrochemical, mechanical and tribological performances and compared with that of plain Ni–P. The coatings were characterized using scanning electron microscopy (SEM) and Energy dispersive X-ray analysis (EDX) techniques to analyze surface nature and composition correspondingly. Small amount of incorporated HNTs made Ni–P deposits appreciable enhancement and betterment in corrosion resistance, hardness and friction resistance. This drastic improvement in the properties reflects the effect of addition of HNTs into Ni–P matrix leading to the development of high performance Ni–P–HNT composite coatings.

Electroless nickel plating on abs plastics from nickel chloride and nickel sulfate baths

International Nuclear Information System (INIS)

Inam-ul-haque; Ahmad, S.; Khan, A.

2005-01-01

Aqueous acid nickel chloride and alkaline nickel sulphate bath were studied for electroless nickel planting on acrylonitrile-butadiene-styrene (ABS) plastic. Before electroless nickel plating, specimens were etched, sensitized and activated. Effects of sodium hypophosphite and sodium citrate concentration on the electroless nickel plating thickness were discussed. Aqueous acid nickel chloride bath comprising, nickel chloride 10 g/L, sodium hypophosphite 40 g/L, sodium citrate 40g/L at pH 5.5, temperature 85 deg. C and density of 1 Be/ for thirty minutes gave best coating thickness in micrometer. It was found that acid nickel chloride bath had a greater stability, wide operating range and better coating thickness results than alkaline nickel sulphate bath. Acid nickel chloride bath gave better coating thickness than alkaline nickel sulfate bath

Interface structure and properties of CNTs/Cu composites fabricated by electroless deposition and spark plasma sintering

Science.gov (United States)

Wang, Hu; Zhang, Zhao-Hui; Hu, Zheng-Yang; Song, Qi; Yin, Shi-Pan

2018-01-01

In this paper, we fabricated a novel copper matrix composites reinforced by carbon nanotubes (CNTs) using electroless deposition (ED) and spark plasma sintering technique. Microstructure, mechanical, electric conductivity, and thermal properties of the CNTs/Cu composites were investigated. The results show that a favorable interface containing C-O and O-Cu bond was formed between CNTs and matrix when the CNTs were coated with nano-Cu by ED method. Thus, we accomplished the uniformly dispersed CNTs in the CNTs/Cu powders and compacted composites, which eventually leads to the enhancement of the mechanical properties of the CNTs/Cu composites in the macro-scale environment. However, the interface structure can hinder the movement of carriers and free electrons and increase the interface thermal resistance, which leads to modest decrease of electrical and thermal conductivity of the CNTs/Cu composites.

Study of electroless Ni-W-P alloy coating on martensitic stainless steel

Energy Technology Data Exchange (ETDEWEB)

Nikitasari, Arini, E-mail: arini-nikitasari@yahoo.com; Mabruri, Efendi, E-mail: efendi-lipi@yahoo.com [Research Center for Metallurgy and Materials, Indonesian Institute of Sciences (470 Building, Puspiptek, Serpong, Indonesia 15313) (Indonesia)

2016-04-19

Electroless nickel phospor (Ni-P) is widely used in many industries due to their corrosion and wear resistance, coating uniformity, and ability to coat non-conductive surfaces. The unique properties of tungsten such as high hardness, higher melting point, lower coefficient of linear thermal expansion, and high tensile strength have created a lot of interest in developing ternary Ni-W-P alloys. This article presents the study of electroless Ni-W-P alloys coating using acid or alkaline bath on martensitic stainless steel. Nickel sulfate and sodium tungstate were used as nickel and tungsten sources, respectively, and sodium hypophosphite was used as a reducing agent. Acid or alkaline bath refer to bath pH condition was adjusted by adding sulfuric acid. Martensitic stainless steel was immersed in Ni-W-P bath for 15, 30, and 60 minutes. The substrate of martensitic stainless steel was subjected to pre-treatment (polishing and cleaning) and activation prior to electroless plating. The plating characteristics were investigated for concentration ratio of nickel and hypophosphite (1:3), sodium tungstate concentration 0,1 M, immersion time (15 min, 30 min, 60 min), and bath condition (acid, alkaline). The electroless Ni-W-P plating was heat treated at 400°C for 1 hour. Deposits were characterized using scanning electron microscope (SEM) and corrosion measurement system (CMS).

Selective Recovery Of Copper From Solutions After Bioleaching Electronic Waste

Directory of Open Access Journals (Sweden)

Willner Joanna

2015-06-01

Full Text Available Research on selective extraction of copper from solution after bioleaching grounded printed circuit boards (PCBs using LIX 860N-IC were conducted. The effect of LIX 860N-IC concentration, phase ratio and influence of initial pH value of aqueous phase on the extraction of copper and iron was examined. It was found that the extraction rate of copper increases with the LIX 860N-IC concentration. Best results of Cu extraction (98 % were achieved with extractant concentration of 5 % and pH 1.9. Higher pH value of aqueous phase (pH=2.4 is conducive to the simultaneous effect of Fe co-extraction.

Some properties of copper and selected heavy metal sulfides. A limited literature review

International Nuclear Information System (INIS)

Hermansson, H.P.

1995-06-01

In the SKB proposal for a Swedish nuclear waste repository, copper canisters are used for encapsulating the spent fuel. The chemical and physical behavior of Copper in the repository environment will therefore be of critical importance for the repository integrity. The present work concerns a literature review of Copper and selected heavy metal sulfides as they are expected to play an important role in the repository environment. The interest is focused on their properties as described by crystal structure, electrical properties, atom mobility, solubility in water, mechanisms of sulfidation and selected thermodynamical data. 56 refs, 14 figs, 5 tabs

Enhanced Dissolution of Platinum Group Metals Using Electroless Iron Deposition Pretreatment

Science.gov (United States)

Taninouchi, Yu-ki; Okabe, Toru H.

2017-12-01

In order to develop a new method for efficiently recovering platinum group metals (PGMs) from catalyst scraps, the authors investigated an efficient dissolution process where the material was pretreated by electroless Fe deposition. When Rh-loaded alumina powder was kept in aqua regia at 313 K (40 °C) for 30 to 60 minutes, the Rh hardly dissolved. Meanwhile, after electroless Fe plating using a bath containing sodium borohydride and potassium sodium tartrate as the reducing and complexing agents, respectively, approximately 60 pct of Rh was extracted by aqua regia at 313 K (40 °C) after 30 minutes. Furthermore, when heat treatment was performed at 1200 K (927 °C) for 60 minutes in vacuum after electroless plating, the extraction of Rh approached 100 pct for the same leaching conditions. The authors also confirmed that the Fe deposition pretreatment enhanced the dissolution of Pt and Pd. These results indicate that an effective and environmentally friendly process for the separation and extraction of PGMs from catalyst scraps can be developed utilizing this Fe deposition pretreatment.

Fabrication and optical characterization of improved electroless ...

African Journals Online (AJOL)

Thin semi conductor films of strontium fluoride (SrF2) were successfully deposited on glass microscope slides using simple and cheap electroless chemical bath deposition methods at 320K and pH values of 9, 10 and 12. Controlled addition of ethylenediamine tetra acetate (EDTA), another complexing agent with pH to ...

Synthesis and characterization of electroless Ni–P coated graphite ...

Indian Academy of Sciences (India)

Wintec

Metallurgical and Materials Engineering Department, Indian Institute of Technology Roorkee, Roorkee 247 667, India ... the chemical composition of the bath was also reported ..... viour of electroless Ni–P films, Ph.D. Thesis, University of.

Broadband infrared absorption enhancement by electroless-deposited silver nanoparticles

DEFF Research Database (Denmark)

Gritti, Claudia; Raza, Søren; Kadkhodazadeh, Shima

2017-01-01

Decorating semiconductor surfaces with plasmonic nanoparticles (NPs) is considered a viable solution for enhancing the absorptive properties of photovoltaic and photodetecting devices. We propose to deposit silver NPs on top of a semiconductor wafer by a cheap and fast electroless plating technique....... Optical characterization confirms that the random array of electroless-deposited NPs improves absorption by up to 20% in a broadband of nearinfrared frequencies from the bandgap edge to 2000 nm. Due to the small filling fraction of particles, the reflection in the visible range is practically unchanged......, which points to the possible applications of such deposition method for harvesting photons in nanophotonics and photovoltaics. The broadband absorption is a consequence of the resonant behavior of particles with different shapes and sizes, which strongly localize the incident light at the interface...

Microwave-assisted activation for electroless nickel plating on PMMA microspheres

Energy Technology Data Exchange (ETDEWEB)

Chen, Yen-Chung [Graduate School of Defense Science, Chung Cheng Institute of Technology, National Defense University, Tao-Yuan, Taiwan 335 (China); Materials and Electro-optics Research Division, Chung Shan Institute of Science and Technology, Tao-Yuan, Taiwan 325 (China); Liu, Robert Lian-Huey [Graduate School of Defense Science, Chung Cheng Institute of Technology, National Defense University, Tao-Yuan, Taiwan 335 (China); Department of Chemical and Materials Engineering, Minghsin University of Science and Technology, Hsinchu Taiwan 304 (China); Chen, Xin-Liang [Graduate School of Defense Science, Chung Cheng Institute of Technology, National Defense University, Tao-Yuan, Taiwan 335 (China); Shu, Hsiou-Jeng [Materials and Electro-optics Research Division, Chung Shan Institute of Science and Technology, Tao-Yuan, Taiwan 325 (China); Ger, Ming-Der, E-mail: mingderger@gmail.com [Department of Chemical and Materials Engineering, Chung Cheng Institute of Technology, National Defense University, Tao-Yuan, Taiwan 335 (China)

2011-05-15

A novel microwave-assisted activation method for electroless plating on PMMA microspheres is presented in this study. When the microwave irradiation was applied during the activation step, the amount of the Pd species adsorbed on PMMA surfaces was much higher than that of sample pretreated with a conventional activation process without microwave irradiation. With this activation method, it was also shown that the adsorbed Pd species with a size of 4-6 nm were uniformly distributed on the surfaces of the PMMA microspheres, thus a smooth and uniform nickel-phosphorus coating on the PMMA microspheres was obtained by subsequent electroless plating. The samples after each step were characterized by XPS, TEM, ICP and SEM.

Development of high performance electroless Ni-P-HNT composite coatings

Energy Technology Data Exchange (ETDEWEB)

Ranganatha, S., E-mail: kamath.ranganath@gmail.com [Department of studies in chemistry, School of chemical sciences, Kuvempu university, Shankaraghatta-577451, Shimoga, Karnataka (India); Venkatesha, T.V., E-mail: drtvvenkatesha@yahoo.co.uk [Department of studies in chemistry, School of chemical sciences, Kuvempu university, Shankaraghatta-577451, Shimoga, Karnataka (India); Vathsala, K., E-mail: vathsala.mahesh@gmail.com [Nanotribology Laboratory, Mechanical engineering department, Indian Institute of Science, Bangalore 560012, Karnataka (India)

2012-12-15

Highlights: Black-Right-Pointing-Pointer Novel Ni-P composites were prepared by incorporating Halloysite nanotubes. Black-Right-Pointing-Pointer Mild steel specimens surface engineered by nickel using electroless technique. Black-Right-Pointing-Pointer Incorporated halloysite nanotubes made nickel matrix highly corrosion resistant. Black-Right-Pointing-Pointer HNT composite exhibits high hardness and largely reduces friction. - Abstract: Halloysite nanotubes (HNTs) of the dimension 50 nm Multiplication-Sign 1-3 {mu}m (diameter Multiplication-Sign length) are utililized to fabricate the alloy composite by employing electroless/autocatalytic deposition technique. Electroless Ni-P-HNT binary alloy composite coatings are prepared successfully on low carbon steel. These nanotubes were made to get inserted/incorporated into nickel matrix and corresponding composites are examined for their electrochemical, mechanical and tribological performances and compared with that of plain Ni-P. The coatings were characterized using scanning electron microscopy (SEM) and Energy dispersive X-ray analysis (EDX) techniques to analyze surface nature and composition correspondingly. Small amount of incorporated HNTs made Ni-P deposits appreciable enhancement and betterment in corrosion resistance, hardness and friction resistance. This drastic improvement in the properties reflects the effect of addition of HNTs into Ni-P matrix leading to the development of high performance Ni-P-HNT composite coatings.

Enhancement of porous silicon photoluminescence by electroless deposition of nickel

Energy Technology Data Exchange (ETDEWEB)

Amdouni, S. [Unité de nanomatériaux et photonique, Université El Manar, Faculté des Sciences de Tunis, Département de Physique, 2092 El Manar, Tunis Tunisia (Tunisia); Rahmani, M., E-mail: rahmanimehdi79@yahoo.com [Unité de nanomatériaux et photonique, Université El Manar, Faculté des Sciences de Tunis, Département de Physique, 2092 El Manar, Tunis Tunisia (Tunisia); Zaïbi, M.-A [Unité de nanomatériaux et photonique, Université El Manar, Faculté des Sciences de Tunis, Département de Physique, 2092 El Manar, Tunis Tunisia (Tunisia); Ecole Nationale Supérieure des Ingénieurs de Tunis, Université de Tunis, 5 Avenue Taha Hussein, 1008 Tunis (Tunisia); Oueslati, M. [Unité de nanomatériaux et photonique, Université El Manar, Faculté des Sciences de Tunis, Département de Physique, 2092 El Manar, Tunis Tunisia (Tunisia)

2015-01-15

Nickel-porous silicon nanocomposites (PS/Ni) are elaborated by an electroless deposition method using NiCl{sub 2} aqueous solution. The presence of nickel ions in the porous layer is confirmed by Fourier Transformed InfraRed spectroscopy (FTIR) and Raman spectroscopy. The photoluminescence (PL) spectra of PS/Ni, prepared at different electroless durations (t{sub edp}), are analyzed. A remarkable enhancement in the integrated PL intensity of PS containing nickel was observed. The lower t{sub edp} favor the deposition of nickel in PS, hence the silicon dangling bonds at the porous surface are quenched and this was increased the PL intensity. However, for the longer t{sub edp}, the PL intensity has been considerably decreased due to the destruction of some Si nanocrystallites. The PL spectra of PS/Ni, for t{sub edp} less than 8 min, show a multiband profile indicating the creation of new luminescent centers by Ni elements which induces a strong modification in the emission mechanisms. - Highlights: • Deposition of Ni ions into porous silicon (PS) layer using the electroless method. • Formation of Ni–O bonds on the porous layer. • The photoluminescence (PL) intensity of PS is enhanced after Ni deposition. • The increase of the PL is due to the contribution of radiative centers related to Ni.

Electroless plating apparatus for discrete microsized particles

International Nuclear Information System (INIS)

Mayer, A.

1978-01-01

Method and apparatus are disclosed for producing very uniform coatings of a desired material on discrete microsized particles by electroless techniques. Agglomeration or bridging of the particles during the deposition process is prevented by imparting a sufficiently random motion to the particles that they are not in contact with each other for a time sufficient for such to occur

Aluminium or copper substrate panel for selective absorption of solar energy

Science.gov (United States)

Roberts, M. L.; Sharpe, M. H.; Krupnick, A. C. (Inventor)

1979-01-01

A method for making panels which selectively absorb solar energy is disclosed. The panels are comprised of an aluminum substrate, a layer of zinc thereon, a layer of nickel over the zinc layer and an outer layer of solar energy absorbing nickel oxide or a copper substrate with a layer of nickel thereon and a layer of solar energy absorbing nickel oxide distal from the copper substrate.

Electroless deposition, post annealing and characterization of nickel ...

Indian Academy of Sciences (India)

Electroless deposition of nickel (EN) films on -type silicon has been investigated under different process conditions. The interface between the film and substrate has been characterized for electrical properties by probing the contact resistances. X-ray diffraction and atomic force microscopy have been performed to obtain ...

Electroless silver coating of rod-like glass particles.

Science.gov (United States)

Moon, Jee Hyun; Kim, Kyung Hwan; Choi, Hyung Wook; Lee, Sang Wha; Park, Sang Joon

2008-09-01

An electroless silver coating of rod-like glass particles was performed and silver glass composite powders were prepared to impart electrical conductivity to these non-conducting glass particles. The low density Ag-coated glass particles may be utilized for manufacturing conducting inorganic materials for electromagnetic interference (EMI) shielding applications and the techniques for controlling the uniform thickness of silver coating can be employed in preparation of biosensor materials. For the surface pretreatment, Sn sensitization was performed and the coating powders were characterized by scanning electron microscopy (SEM), focused ion beam microscopy (FIB), and atomic force microscopy (AFM) along with the surface resistant measurements. In particular, the use of FIB technique for determining directly the Ag-coating thickness was very effective on obtaining the optimum conditions for coating. The surface sensitization and initial silver loading for electroless silver coating could be found and the uniform and smooth silver-coated layer with thickness of 46 nm was prepared at 2 mol/l of Sn and 20% silver loading.

Copper-assisted, anti-reflection etching of silicon surfaces

Science.gov (United States)

Toor, Fatima; Branz, Howard

2014-08-26

A method (300) for etching a silicon surface (116) to reduce reflectivity. The method (300) includes electroless deposition of copper nanoparticles about 20 nanometers in size on the silicon surface (116), with a particle-to-particle spacing of 3 to 8 nanometers. The method (300) includes positioning (310) the substrate (112) with a silicon surface (116) into a vessel (122). The vessel (122) is filled (340) with a volume of an etching solution (124) so as to cover the silicon surface (116). The etching solution (124) includes an oxidant-etchant solution (146), e.g., an aqueous solution of hydrofluoric acid and hydrogen peroxide. The silicon surface (116) is etched (350) by agitating the etching solution (124) with, for example, ultrasonic agitation, and the etching may include heating (360) the etching solution (124) and directing light (365) onto the silicon surface (116). During the etching, copper nanoparticles enhance or drive the etching process.

Electroless silver plating on PET fabric initiated by in situ reduction of polyaniline

Energy Technology Data Exchange (ETDEWEB)

Mu, Shipeng; Xie, Huayang [College of Chemistry, Chemical Engineering and Biotechnology, Donghua University, Shanghai 201620 (China); Wang, Wei [College of Chemistry, Chemical Engineering and Biotechnology, Donghua University, Shanghai 201620 (China); Key Lab of Eco-Textile, Ministry of Education, Donghua University, Shanghai 201620 (China); Yu, Dan, E-mail: yudan@dhu.edu.cn [College of Chemistry, Chemical Engineering and Biotechnology, Donghua University, Shanghai 201620 (China); Key Lab of Eco-Textile, Ministry of Education, Donghua University, Shanghai 201620 (China)

2015-10-30

Graphical abstract: - Highlights: • We propose a method to initiate electroless plating by reduction of PANI. • The shielding effective of the silver-plated fabric reaches 50–90 dB. • The silver-plated fabric has good antibacterial activity. - Abstract: Novel electroless silver plating poly(ethylene terephthalate) (PET) fabric was prepared by a two-step procedure. In the first step, the in situ polymerized polyaniline (PANI) occurred on the fabric surface in the presence of ammonium persulfate (APS). Then, Ag(0) species reduced from silver nitrate (AgNO{sub 3}) by in situ reduction of PANI were used as catalyst to initiate electroless silver plating. Hence, this composite material was prepared by conductive polymer combined with electroless plating. The silver layer on PET fabric surface was characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD) and energy dispersive spectroscopy (EDX) as well as X-ray photoelectron spectroscopy (XPS). The results showed that the silver layer was plated uniformly and compactly with surface resistance about 0.1 Ω/sq on average. The shielding effectiveness (SE) of silver-plated PET fabric was around 50–90 dB, which was considered to have potential applications in electromagnetic shielding materials. Thermogravimetric (TG) analysis was carried out to study thermal stability. The antibacterial tests demonstrated that the silver-plated fabric exhibited excellent antibacterial activity against Staphylococcus aureus and Escherichia coli both with 100%.

Ductile electroless Ni-P coating onto flexible printed circuit board

Science.gov (United States)

Wang, Wenchang; Zhang, Weiwei; Wang, Yurong; Mitsuzak, Naotoshi; Chen, Zhidong

2016-03-01

In this study, a ductile electroless Ni-P coating on the flexible printed circuit board (FPCB) was prepared in an acidic nickel plating bath. The addition of dipropylamine (DPA) in electroless plating not only improves the ductility of the Ni-P coating, but also enhances the corrosion resistance. The further analysis reveals that the ductility improvement and enhancement of corrosion resistance for the Ni-P coating may be due to the fact that the addition of DPA significantly refines the volume of columnar nodule and reduce the porosity, thus leading to the released internal stress. In addition, it was found that the nodule within the Ni-P coating grew into a columnar structure, which may be also contribute to the improvement of ductility.

Evaluation of Electroless-Nickel Plated Polypropylene under Thermal Cycling and Mechanical Tests

Directory of Open Access Journals (Sweden)

O.O. Ajibola

2016-09-01

Full Text Available The electroless-nickel composite (ENC consisting of bright metallic electroless-nickel (EN and dull electroless-nickel-phosphorus (EN-P were deposited on the polypropylene (PP substrate from the sodium hypophosphite baths. The ENC plated specimens were subjected to abrasive wear-adhesion test of 1750, 3500, 7000 and 14000 cycles; thermal cycle-adhesion tests, and tensile strength and creep tests. The deposition of ENC influenced the strength and creep strain properties of the PP. The maximum stress σ of 118 (MPa was obtained from EN-PP specimen at strain  of 0.1 mm/mm as compared with the PP having stress σ of 36 (MPa at strain  of 0.07 mm/mm before failure The surface appearances and microstructures of ENC film on PP substrates were examined under the higher resolution metallurgical microscope with digital camera and microscopic camera. The composition of ENC film was characterized using Scanning Electron Microscopy and Energy Dispersive X-Ray analyses (Jeol JSM-7600F Field Emission SEM/EDX, The micrographs and spectra lines data generated were used to interpret the results.

Selection and application of C18200 chrome copper for the OHTE confinement test helical coil

International Nuclear Information System (INIS)

Puhn, F.A.; Graumann, D.W.

1981-01-01

The selection and qualification of copper for the OHTE confinement test helical coil (H-coil) was a crucial step in the success of this new experiment. Previous problems encountered at General Atomic Company with close tolerance machined parts made from high strength copper were identified. The design criteria included selecting a material with minimal warpage during machining, an electrical conductivity >80% IACS, and a yield strength of at least 241 Mpa (35 ksi). The investigation of candidate materials and testing samples led to selection of a material that fully met all requirements. The C18200 chrome copper forged plates were supplied by the Ampco Metal Division of Ampco-Pittsburgh Corporation

Adhesion enhancement between electroless nickel and polyester fabric by a palladium-free process

Energy Technology Data Exchange (ETDEWEB)

Lu Yinxiang, E-mail: yxlu@fudan.edu.cn [Department of Materials Science, Fudan University, 220 Handan Road, Shanghai 200433 (China); Xue Longlong; Li Feng [Department of Materials Science, Fudan University, 220 Handan Road, Shanghai 200433 (China)

2011-01-15

A new, efficient, palladium- and etchant-free process for the electroless nickel plating of poly(ethylene terephthalate) (PET) fabric has been developed. PET electroless plating can be prepared in three steps, namely: (i) the grafting of thiol group onto PET, (ii) the silver Ag{sup 0} seeding of the PET surface, and (iii) the nickel metallization using electroless plating bath. Scanning electron microscopy (SEM), energy dispersive X-ray (EDX) analysis, X-ray photoelectron spectroscopy (XPS), Raman spectrometer, X-ray diffraction (XRD), and thermogravimetric analysis (TG) were used to characterize the samples in the process, and the nickel loading was quantified by weighing. This process successfully compares with the traditional one based on KMnO{sub 4}/H{sub 2}SO{sub 4} etching and palladium-based seed layer. The nickel coating obtained in this palladium-free process can pass through ultrasonic washing challenge, and shows excellent adhesion with the PET substrate. However, the sample with Pd catalyst via traditional process was damaged during the testing experiment.

A novel Ag catalyzation process using swelling impregnation method for electroless Ni deposition on Kevlar® fiber

Science.gov (United States)

Pang, Hongwei; Bai, Ruicheng; Shao, Qinsi; Gao, Yufang; Li, Aijun; Tang, Zhiyong

2015-12-01

A novel Ag catalyzation process using swelling impregnation pretreatment method was developed for electroless nickel (EN) deposition on Kevlar fiber. Firstly, the fiber was immersed into an aqueous dimethylsulfoxide (DMSO) solution of silver nitrate to impart silver nitrate into the inner part of the fiber near the surface. Subsequently silver nitrate was reduced to metal silver nanoparticles on the fiber surface by treatment with aqueous solution of sodium borohydride. After electroless plating, a dense and homogeneous nickel coating was obtained on the fiber surface. The silver nanoparticles formed at the fiber surface functioned as a catalyst for electroless deposition as well as an anchor for the plated layer. The study also revealed that the incorporation of surfactant sodium dodecyl sulfate (SDS) in electroless nickel plating bath can enhance the adhesion strength of EN layer with the fiber surface and minimize the surface roughness of the EN coating. The Ni plated Kevlar fiber possessed excellent corrosion resistance and high tensile strength.

Synthesis of dense nano cobalt-hydroxyapatite by modified electroless deposition technique

Energy Technology Data Exchange (ETDEWEB)

Mohd Zaheruddin, K., E-mail: zaheruddin@unimap.edu.my; Rahmat, A., E-mail: azmirahmat@unimap.edu.my; Shamsul, J. B., E-mail: sbaharin@unimap.edu.my; Mohd Nazree, B. D., E-mail: nazree@unimap.edu.my; Aimi Noorliyana, H., E-mail: aimiliyana@unimap.edu.my [School of Materials Engineering, Universiti Malaysia Perlis, Kompleks Pusat Pengajian Jejawi Universiti Malaysia Perlis, Taman Muhibbah, Jejawi 02600 Arau Perlis (Malaysia)

2016-07-19

Cobalt-hydroxyapatite (Co-HA) composites was successfully prepared by simple electroless deposition process of Co on the surface of hydroxyapatite (HA) particles. Co deposition was carried out in an alkaline bath with sodium hypophosphite as a reducing agent. The electroless process was carried out without sensitization and activation steps. The deposition of Co onto HA was characterized by scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDX). The Co-HA composite powder was compacted and sintered at 1250°C. The Co particles were homogeneously dispersed in the HA matrix after sintering and the mechanical properties of composites was enhanced to 100 % with 3 % wt Co and gradually decreased at higher Co content.

The importance of surface morphology in controlling the selectivity of polycrystalline copper for CO(2) electroreduction

DEFF Research Database (Denmark)

Tang, Wei; Peterson, Andrew A; Varela Gasque, Ana Sofia

2012-01-01

This communication examines the effect of the surface morphology of polycrystalline copper on electroreduction of CO(2). We find that a copper nanoparticle covered electrode shows better selectivity towards hydrocarbons compared with the two other studied surfaces, an electropolished copper elect...

Optimizing growth conditions for electroless deposition of Au films ...

Indian Academy of Sciences (India)

Unknown

Optimizing growth conditions for electroless deposition of Au films on. Si(111) substrates. BHUVANA and G U KULKARNI*. Chemistry and Physics of Materials Unit and DST Unit on Nanoscience, Jawaharlal Nehru Centre for. Advanced Scientific Research, Jakkur PO, Bangalore 560 064, India. MS received 24 March 2006.

SOURCES OF COPPER IONS AND SELECTED METHODS OF THEIR REMOVAL FROM WASTEWATER FROM THE PRINTED CIRCUITS BOARD PRODUCTION

Directory of Open Access Journals (Sweden)

Maciej Thomas

2014-10-01

Full Text Available This paper presents the issues related to the presence and removal of copper compounds from industrial effluents with including wastewater from plants involved in the production of printed circuit boards. Characterized the toxicological properties of selected copper compounds, described the applicable technological processes, sources of copper ions in the effluents and selected methods for their removal.

Electroless Sliver-Plating Process in the Preparation of 103Pd-125I Hybrid Brachytherapy Seed Cores

Directory of Open Access Journals (Sweden)

LI Zhong-yong1,2;CHEN Bin-da1;Lv Xiao-zhou1;LU Jin-hui1;CUI Hai-ping1,2

2014-02-01

Full Text Available Electroless 103Pd plating and electroless Ag plating and chemical 125I depositing were took place on the surface of carbon rods in turn, which was a reliable method for the preparation of 103Pd-125I hybrid brachytherapy seed cores. 103Pd and 125I were deposited on the same substrate effectively through silver coating as a bridge. The process of electroless Ag plating was a novel and important step in the preparation of 103Pd-125I hybrid seed. In this work, the process of electroless Ag plating was studied using 0.5×3.0 mm carbon rods with palladium coating as substrate, silver-ammino complex as precursor, 110mAg as radioactive tracer, and hydrazine as reductant. The optimum conditions were AgNO3 2g/L，Na2EDTA 40 g/L，NH3•H2O 16.25%，H4N2•H2O 5‰，pH=10，t=60 min，and T=35 ℃. Sliver deposited on each carbon rod was uniform, and sliver-coating was white and smooth.

Electroless plating of PVC plastic through new surface modification method applying a semi-IPN hydrogel film

International Nuclear Information System (INIS)

Wang, Ming-Qiu; Yan, Jun; Du, Shi-Guo; Li, Hong-Guang

2013-01-01

A novel palladium-free surface activation process for electroless nickel plating was developed. This method applied a semi-Interpenetrating Polymer Network (semi-IPN) hydrogel film to modify the poly(vinyl chloride) (PVC) surface by chemical bonds. The activation process involved the formation of semi-IPN hydrogel film on the PVC surface and the immobilization of catalyst for electroless plating linking to the pretreated substrate via N-Ni chemical bond. The hydrogel layer was used as the chemisorption sites for nickel ions, and the catalyst could initiate the subsequent electroless nickel plating onto the PVC surface. Finally, a Ni–P layer was deposited on the nickel-activated PVC substrate by electroless plating technique. The composition and morphology of nickel-plated PVC foils were characterized by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), energy dispersive X-ray spectroscopy (EDS) and X-ray diffraction (XRD). The results of SEM and XRD show that a compact and continuous Ni–P layer with amorphous nickel phase is formed on the PVC surface. EDS shows that the content of the nickel and the phosphorus in the deposits is 89.4 wt.% and 10.6 wt.%, respectively.

Electroless plating of PVC plastic through new surface modification method applying a semi-IPN hydrogel film

Energy Technology Data Exchange (ETDEWEB)

Wang, Ming-Qiu, E-mail: mqwang1514@163.com; Yan, Jun; Du, Shi-Guo; Li, Hong-Guang

2013-07-15

A novel palladium-free surface activation process for electroless nickel plating was developed. This method applied a semi-Interpenetrating Polymer Network (semi-IPN) hydrogel film to modify the poly(vinyl chloride) (PVC) surface by chemical bonds. The activation process involved the formation of semi-IPN hydrogel film on the PVC surface and the immobilization of catalyst for electroless plating linking to the pretreated substrate via N-Ni chemical bond. The hydrogel layer was used as the chemisorption sites for nickel ions, and the catalyst could initiate the subsequent electroless nickel plating onto the PVC surface. Finally, a Ni–P layer was deposited on the nickel-activated PVC substrate by electroless plating technique. The composition and morphology of nickel-plated PVC foils were characterized by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), energy dispersive X-ray spectroscopy (EDS) and X-ray diffraction (XRD). The results of SEM and XRD show that a compact and continuous Ni–P layer with amorphous nickel phase is formed on the PVC surface. EDS shows that the content of the nickel and the phosphorus in the deposits is 89.4 wt.% and 10.6 wt.%, respectively.

Electroless plating of PVC plastic through new surface modification method applying a semi-IPN hydrogel film

Science.gov (United States)

Wang, Ming-Qiu; Yan, Jun; Du, Shi-Guo; Li, Hong-Guang

2013-07-01

A novel palladium-free surface activation process for electroless nickel plating was developed. This method applied a semi-Interpenetrating Polymer Network (semi-IPN) hydrogel film to modify the poly(vinyl chloride) (PVC) surface by chemical bonds. The activation process involved the formation of semi-IPN hydrogel film on the PVC surface and the immobilization of catalyst for electroless plating linking to the pretreated substrate via Nsbnd Ni chemical bond. The hydrogel layer was used as the chemisorption sites for nickel ions, and the catalyst could initiate the subsequent electroless nickel plating onto the PVC surface. Finally, a Ni-P layer was deposited on the nickel-activated PVC substrate by electroless plating technique. The composition and morphology of nickel-plated PVC foils were characterized by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), energy dispersive X-ray spectroscopy (EDS) and X-ray diffraction (XRD). The results of SEM and XRD show that a compact and continuous Ni-P layer with amorphous nickel phase is formed on the PVC surface. EDS shows that the content of the nickel and the phosphorus in the deposits is 89.4 wt.% and 10.6 wt.%, respectively.

Study on the nano-composite electroless coating of Ni-P/Ag

International Nuclear Information System (INIS)

Ma Hongfang; Tian Fang; Li Dan; Guo Qiang

2009-01-01

The nano-composite coating of Ni-P/Ag was obtained by adding silver nanoparticles to the Ni-P electroless plating solutions. The properties of the coating were tested by scanning electron microscopy (SEM), energy dispersive spectrometry (EDS), differential scanning calorimeter (DSC), X-ray diffraction (XRD) and microsclerometer. Silver nanoparticles changed the properties of the composite coating. The Ni-P electroless coating contains 12.23 wt.% P while the composite coating of Ni-P/Ag contains 11.17 wt.% P and 0.24 wt.% Ag. The hardness of the composite coating is bigger than that of Ni-P alloy coating. Differential scanning calorimeter studies showed the amorphous to crystalline transition with precipitation of Ni 3 P and Ni around 335 deg. C

Fabrication of micro-Ni arrays by electroless and electrochemical ...

Indian Academy of Sciences (India)

Administrator

in electroless solution. With the help of the membrane, nickel micro-columns of about 1–2 µm diameter were obtained. The surface-deposited nickel layer served as a substrate for the nickel micro-columns, and the resulting material possessed strong mechanical strength. Electrochemical deposition was operated without ...

The Effects of Electroless Nickel Plating Bath Conditions on Stability of Solution and Properties of Deposit

International Nuclear Information System (INIS)

Huh, Jin; Lee, Jae Ho

2000-01-01

Electroless depositions of nickel were conducted in different bath conditions to find optimum conditions of electroless nickel plating at low operating temperature and pH. The effect of complexing reagent on stability of plating solution was investigated. Sodium citrate complexed plating solution is more stable than sodium pyrophosphate complexed solution. The effects of nickel salt concentration, reducing agent, complexing agent and inhibitor on deposition rate was investigated. The effects of pH on deposition rate and content of phosphorous in deposited nickel were also analyzed. Electroless deposited nickel become crystallized with increasing pH due to lower phosphorous content. In optimum operating bath condition, deposition rate was 7 μm/hr at 60 .deg. C and pH 10.0 without stabilizer. The rate was decreased with stabilizer concentration

Selective Laser Melting of Pure Copper

Science.gov (United States)

Ikeshoji, Toshi-Taka; Nakamura, Kazuya; Yonehara, Makiko; Imai, Ken; Kyogoku, Hideki

2018-03-01

Appropriate building parameters for selective laser melting of 99.9% pure copper powder were investigated at relatively high laser power of 800 W for hatch pitch in the range from 0.025 mm to 0.12 mm. The highest relative density of the built material was 99.6%, obtained at hatch pitch of 0.10 mm. Building conditions were also studied using transient heat analysis in finite element modeling of the liquidation and solidification of the powder layer. The estimated melt pool length and width were comparable to values obtained by observations using a thermoviewer. The trend for the melt pool width versus the hatch pitch agreed with experimental values.

Enhancement in the Tribological and Mechanical Properties of Electroless Nickel-Nanodiamond Coatings Plated on Iron

Directory of Open Access Journals (Sweden)

Z. Karaguiozova

2017-12-01

Full Text Available A technology to improve the tribological and mechanical surface properties of iron alloys is developed based on the electroless nickel plating. The technology combines sol-gel and electroless deposition technique. Novel nanocomposite coatings are obtained consisting of Nickel-phosphorus-nanodiamond (Ni-P-ND. The ND sol is added directly to the electroless Ni-P solution. A suitable surfactant is added to achieve well-dispersed ND particles in the electroless solution to facilitate their embodiment and equal distribution in the coating. Substrates of steel 17CrNiMo6 and spheroidal graphite cast irons are used for the manufacture of the iron alloys specimens. The surface morphology and microstructure observation performed by scanning electron microscopy (SEM and optical metallography confirms the influence of ND particles on the coating structure. The structural phase investigation by X Ray analysis indicates a transformation of the amorphous phase to a crystalline one such as Ni, Ni3P after coatings' heat treatment. The microhardness investigation by Knoop Method and wear resistance measurement in accordance with the Polish Standard PN-83/H-04302 of Ni-P and Ni-P-ND composite coatings are evaluated and compared with each other. The increase in the value of hardness and wear resistance of Ni-P composite coatings in the presence of ND particles and after heat treatment is obtained.

Fabrication of Hydrophobic Surface on Wood Veneer via Electroless Nickel Plating Combined with Chemical Corrosion

Directory of Open Access Journals (Sweden)

Zhaojun Tang

2015-12-01

Full Text Available Birch veneers were coated with Ni-P films by a combined process of KBH4 activation and electroless plating. The plated veneers were further chemically corroded to obtain hydrophobic surfaces on wood. The effect of chemical corrosion on the contact angle of the veneers was investigated. The hydrophobic veneers were characterized by X-ray photo electron spectroscopy (XPS, scanning electron microscopy (SEM, and X-ray diffraction (XRD. The surface contact angle of birch veneer before and after it was plated with Ni-P alloy coating was 41º and 121º, respectively. The contact angle reached 136.7º when the nickel-coated veneers were corroded in CuSO4 aqueous solution for 30 min. XPS analysis showed that Cu0 cluster doped with little CuO formed on the corroded surface of Ni-P alloy film after chemical corrosion. SEM and XRD showed that rough copper clusters formed on the surface of the wood veneer and revealed the reason of the surface hydrophobicity. This study provides a new pathway for fabricating hydrophobic wood.

Development of high performance electroless Ni-P-HNT composite coatings

Science.gov (United States)

Ranganatha, S.; Venkatesha, T. V.; Vathsala, K.

2012-12-01

Halloysite nanotubes (HNTs) of the dimension 50 nm × 1-3 μm (diameter × length) are utililized to fabricate the alloy composite by employing electroless/autocatalytic deposition technique. Electroless Ni-P-HNT binary alloy composite coatings are prepared successfully on low carbon steel. These nanotubes were made to get inserted/incorporated into nickel matrix and corresponding composites are examined for their electrochemical, mechanical and tribological performances and compared with that of plain Ni-P. The coatings were characterized using scanning electron microscopy (SEM) and Energy dispersive X-ray analysis (EDX) techniques to analyze surface nature and composition correspondingly. Small amount of incorporated HNTs made Ni-P deposits appreciable enhancement and betterment in corrosion resistance, hardness and friction resistance. This drastic improvement in the properties reflects the effect of addition of HNTs into Ni-P matrix leading to the development of high performance Ni-P-HNT composite coatings.

A pyrazolyl-based thiolato single-source precursor for the selective synthesis of isotropic copper-deficient copper(I) sulfide nanocrystals: synthesis, optical and photocatalytic activity

Energy Technology Data Exchange (ETDEWEB)

Mondal, Gopinath; Santra, Ananyakumari; Bera, Pradip; Acharjya, Moumita [Vidyasagar University, Post Graduate Department of Chemistry, Panskura Banamali College (India); Jana, Sumanta [Indian Institute of Engineering Science and Technology (IIEST), Department of Chemistry (India); Chattopadhyay, Dipankar [University of Calcutta, Department of Polymer Science and Technology (India); Mondal, Anup [Indian Institute of Engineering Science and Technology (IIEST), Department of Chemistry (India); Seok, Sang Il [Korea Research Institute of Chemical Technology, KRICT-EPFL Global Research Laboratory, Division of Advanced Materials (Korea, Republic of); Bera, Pulakesh, E-mail: pbera.pbc.chem@gmail.com [Vidyasagar University, Post Graduate Department of Chemistry, Panskura Banamali College (India)

2016-10-15

Hexagonal copper-deficient copper(I) sulfide (Cu{sub 2-x}S, x = 0.03, 0.2) nanocrystals (NCs) are synthesized from a newly prepared single-source precursor (SP), [Cu(bdpa){sub 2}][CuCl{sub 2}], where bdpa is benzyl 3,5-dimethyl-pyrazole-1-carbodithioate. The SP is crystallized with space group Pī and possesses a distorted tetrahedron structure with a CuN{sub 2}S{sub 2} chromophore where the central copper is in +1 oxidation state. Distortion in copper(I) structure and the low decomposition temperature of SP make it favorable for the low-temperature solvent-assisted selective growth of high-copper content sulfides. The nucleation and growth of Cu{sub 2-x}S (x = 0.03, 0.2) are effectively controlled by the SP and the solvent in the solvothermal decomposition process. During decomposition, fragment benzyl thiol (PhCH{sub 2}SH) from SP effectively passivates the nucleus leading to spherical nanocrystals. Further, solvent plays an important role in the selective thermochemical transformation of Cu{sup I}-complex to Cu{sub 2-x}S (x = 0.03, 0.2) NCs. The chelating binders (solvent) like ethylene diamine (EN) and ethylene glycol (EG) prefer to form spherical Cu{sub 1.97}S nanoparticles (djurleite), whereas nonchelating hydrazine hydrate (HH) shows the tendency to furnish hexagonal platelets of copper-deficient Cu{sub 1.8}S. The optical band gap values (2.25–2.50 eV) show quantum confinement effect in the structure. The synthesized NCs display excellent catalytic activity (~87 %) toward photodegradation of organic dyes like Congo Red (CR) and Methylene Blue (MB).Graphical abstractA pyrazolyl-based thiolato single-source precursor for the selective synthesis of isotropic copper-deficient copper(I) sulfide nanocrystals: Synthesis, optical and photocatalytic activity.Gopinath Mondal, Ananyakumari Santra, Pradip Bera, Moumita Acharjya, Sumanta Jana, Dipankar Chattopadhyay, Anup Mondal, Sang Il Seok, Pulakesh Bera.

Preparation and characterization of electroless Ni–B/nano-SiO2 ...

Indian Academy of Sciences (India)

tance, lubricity, good ductility and corrosion resistance and excellent solderability and electrical properties.1 To enhance the properties of electroless ..... ingly porous Ni–B nanolayer structures and the nodule size grows with the nanolayer ...

Electroless silver plating on PET fabric initiated by in situ reduction of polyaniline

Science.gov (United States)

Mu, Shipeng; Xie, Huayang; Wang, Wei; Yu, Dan

2015-10-01

Novel electroless silver plating poly(ethylene terephthalate) (PET) fabric was prepared by a two-step procedure. In the first step, the in situ polymerized polyaniline (PANI) occurred on the fabric surface in the presence of ammonium persulfate (APS). Then, Ag(0) species reduced from silver nitrate (AgNO3) by in situ reduction of PANI were used as catalyst to initiate electroless silver plating. Hence, this composite material was prepared by conductive polymer combined with electroless plating. The silver layer on PET fabric surface was characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD) and energy dispersive spectroscopy (EDX) as well as X-ray photoelectron spectroscopy (XPS). The results showed that the silver layer was plated uniformly and compactly with surface resistance about 0.1 Ω/sq on average. The shielding effectiveness (SE) of silver-plated PET fabric was around 50-90 dB, which was considered to have potential applications in electromagnetic shielding materials. Thermogravimetric (TG) analysis was carried out to study thermal stability. The antibacterial tests demonstrated that the silver-plated fabric exhibited excellent antibacterial activity against Staphylococcus aureus and Escherichia coli both with 100%.

Electroless nickel-plating for the PWSCC mitigation of nickel-base alloys in nuclear power plants

International Nuclear Information System (INIS)

Kim, Ji Hyun; Hwang, Il Soon

2008-01-01

The feasibility study has been performed as an effort to apply the electroless nickel-plating method for a proposed countermeasure to mitigate primary water stress corrosion cracking (PWSCC) of nickel-base alloys in nuclear power plants. In order to understand the corrosion behavior of nickel-plating at high temperature water, the electrochemical properties of electroless nickel-plated alloy 600 specimens exposed to simulated pressurized water reactor (PWR) primary water were experimentally characterized in high temperature and high pressure water condition. And, the resistance to the flow accelerated corrosion (FAC) test was investigated to check the durability of plated layers in high-velocity water-flowing environment at high temperature. The plated surfaces were examined by using both scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) after exposures to the condition. From this study, it is found that the corrosion resistance of electroless nickel-plated Alloy 600 is higher than that of electrolytic plating in 290 deg. C water

Tribological and corrosion behaviour of electroless Ni-B coating possessing a blackberry like structure

Science.gov (United States)

Bülbül, Ferhat; Altun, Hikmet; Küçük, Özkan; Ezirmik, Vefa

2012-08-01

This study aims to evaluate the tribological and corrosion properties of the electroless Ni-B coating deposited on AISI 304 stainless steels. The microstructure of the coating was characterized using x-ray diffraction (XRD) and scanning electron microscopy-energy dispersive spectrometry (SEM-EDS). XRD analysis revealed that the prepared coating possessed an amorphous character. SEM-EDS investigation also indicated that a non-stoichiometric Ni-B coating was deposited with a columnar growth mechanism on the stainless steel substrate and the morphology of the growth surface was blackberry-like. The hardness and tribological properties were characterized by microhardness and a pin-on-disc wear test. The electroless Ni-B coated sample had a higher degree of hardness, a lower friction coefficient and a lower wear rate than the uncoated substrate. The electrochemical potentiodynamic polarization method was used to evaluate the corrosion resistance of the coating. The electroless Ni-B coating offered cathodic protection on the substrate by acting as a sacrificial anode although it was electrochemically more reactive than the stainless steel substrate.

High performance fuel electrodes fabricated by electroless plating of copper on BaZr0.8Ce0.1Y0.1O3-δ proton-conducting ceramic

Science.gov (United States)

Patki, Neil S.; Way, J. Douglas; Ricote, Sandrine

2017-10-01

The stability of copper at high temperatures in reducing and hydrocarbon-containing atmospheres makes it a good candidate for fabricating fuel electrodes on proton-conducting ceramics, such as BaZr0.9-xCexY0.1O3-δ (BZCY). In this work, the electrochemical performance of Cu-based electrodes fabricated by electroless plating (ELP) on BaZr0.8Ce0.1Y0.1O3-δ is studied with impedance spectroscopy. Three activation catalysts (Pd, Ru, and Cu) are investigated and ELP is compared to a commercial Cu paste (ESL 2312-G) for electrode fabrication. The area specific resistances (ASR) for Pd, Ru, and Cu activations at 700 °C in moist 5% H2 in Ar are 2.1, 3.2, and 13.4 Ω cm2, respectively. That is a 1-2 orders of magnitude improvement over the commercial Cu paste (192 Ω cm2). Furthermore, the ASR has contributions from electrode processes and charge transfer at the electrode/electrolyte interface. Additionally, the morphology of the as-fabricated electrode is unaffected by the activation catalyst. However, heat treatment at 750 °C in H2 for 24 h leads to sintering and large reorganization of the electrode fabricated with Cu activation (micron sized pores seen in the tested sample), while Pd and Ru activations are immune to such reorganization. Thus, Pd and Ru are identified as candidates for future work with improvements to charge transfer required for the former, and better electrode processes required for the latter.

Influence of electroless coatings of Cu, Ni-P and Co-P on MmNi3.25Al0.35Mn0.25Co0.66 alloy used as anodes in Ni-MH batteries

International Nuclear Information System (INIS)

Raju, M.; Ananth, M.V.; Vijayaraghavan, L.

2009-01-01

Electroless coatings of Ni-P, Co-P and Cu were applied on the surface of non-stoichiometric MmNi 3.25 Al 0.35 Mn 0.25 Co 0.66 (Mm: misch metal) metal hydride alloy. Elemental analysis was made with Energy Dispersive X-ray Analysis (EDAX). The structural analysis of bare and coated alloys was done by X-ray diffraction (XRD) whereas surface morphology was examined with scanning electron microscope (SEM) and transmission electron microscope (TEM). The electrode characteristics inclusive of electrochemical capacity and cycle life were studied at C/5 rate. Superior performance is obtained with copper coated alloy. Microstructure observations indicate that the observed excellent performance could be attributed to uniform and efficient surface coverage with copper. Also, lanthanum surface enrichment in samples during Cu coating leads to improvement in performance. It is inferred from electro analytical investigations that copper coatings act as microcurrent collectors with alterations in hydrogen transport mechanism and facilitate charge transfer reaction on the alloy surface without altering battery properties. Moreover, supportive first time TEM evidence of existence of such copper nano current collectors (about 8 nm in diameter and length about 20 nm) is reported.

Copper-catalysed selective hydroamination reactions of alkynes

Science.gov (United States)

Shi, Shi-Liang; Buchwald, Stephen L.

2015-01-01

The development of selective reactions that utilize easily available and abundant precursors for the efficient synthesis of amines is a long-standing goal of chemical research. Despite the centrality of amines in a number of important research areas, including medicinal chemistry, total synthesis and materials science, a general, selective and step-efficient synthesis of amines is still needed. Here, we describe a set of mild catalytic conditions utilizing a single copper-based catalyst that enables the direct preparation of three distinct and important amine classes (enamines, α-chiral branched alkylamines and linear alkylamines) from readily available alkyne starting materials with high levels of chemo-, regio- and stereoselectivity. This methodology was applied to the asymmetric synthesis of rivastigmine and the formal synthesis of several other pharmaceutical agents, including duloxetine, atomoxetine, fluoxetine and tolterodine.

Copper-catalyzed selective hydroamination reactions of alkynes

Science.gov (United States)

Shi, Shi-Liang; Buchwald, Stephen L.

2014-01-01

The development of selective reactions that utilize easily available and abundant precursors for the efficient synthesis of amines is a longstanding goal of chemical research. Despite the centrality of amines in a number of important research areas, including medicinal chemistry, total synthesis and materials science, a general, selective, and step-efficient synthesis of amines is still needed. In this work we describe a set of mild catalytic conditions utilizing a single copper-based catalyst that enables the direct preparation of three distinct and important amine classes (enamines, α-chiral branched alkylamines, and linear alkylamines) from readily available alkyne starting materials with high levels of chemo-, regio-, and stereoselectivity. This methodology was applied to the asymmetric synthesis of rivastigmine and the formal synthesis of several other pharmaceutical agents, including duloxetine, atomoxetine, fluoxetine, and tolterodine. PMID:25515888

Fabrication of a micro-porous Ti–Zr alloy by electroless reduction with a calcium reductant for electrolytic capacitor applications

International Nuclear Information System (INIS)

Kikuchi, Tatsuya; Yoshida, Masumi; Taguchi, Yoshiaki; Habazaki, Hiroki; Suzuki, Ryosuke O.

2014-01-01

Highlights: • A metallic Ti–Zr alloy was obtained by electroless reduction for capacitor applications. • The reduction mechanisms were studied by SEM, XRD, EPMA, and an oxygen analyzer. • The alloy was obtained by electroless reduction in the presence of excess calcium reductant. • A micro-porous Ti–Zr alloy was successfully obtained. • The alloy has a low oxygen content and a large surface area. -- Abstract: A metallic titanium and zirconium micro-porous alloy for electrolytic capacitor applications was produced by electroless reduction with a calcium reductant in calcium chloride molten salt at 1173 K. Mixed TiO 2 –70 at%ZrO 2 oxides, metallic calcium, and calcium chloride were placed in a titanium crucible and heated under argon atmosphere to reduce the oxides with the calcium reductant. A metallic Ti–Zr alloy was obtained by electroless reduction in the presence of excess calcium reductant and showed a micro-porous morphology due to the sintering of each of the reduced particles during the reduction. The residual oxygen content and surface area of the reduced Ti–Zr alloy decreased over time during the electroless reduction. The element distributions were slightly different at the positions of the alloy and were in the composition range of Ti-69.3 at% to 74.3 at%Zr. A micro-porous Ti–Zr alloy with low oxygen content (0.20 wt%) and large surface area (0.55 m 2 g −1 ) was successfully fabricated by electroless reduction under optimal conditions. The reduction mechanisms of the mixed and pure oxides by the calcium reductant are also discussed

The partitioning of copper among selected phases of geologic media of two porphyry copper districts, Puerto Rico

Science.gov (United States)

Learned, R.E.; Chao, T.T.; Sanzolone, R.F.

1981-01-01

In experiments designed to determine the manner in which copper is partitioned among selected phases that constitute geologic media, we have applied the five-step sequential extraction procedure of Chao and Theobald to the analysis of drill core, soils, and stream sediments of the Rio Vivi and Rio Tanama porphyry copper districts of Puerto Rico. The extraction procedure affords a convenient means of determining the trace-metal content of the following fractions: (1) Mn oxides and "reactive" Fe oxides; (2) "amorphous" Fe oxides; (3) "crystalline" Fe oxides; (4) sulfides and magnetite; and (5) silicates. An additional extraction between steps (1) and (2) was performed to determine organic-related copper in stream sediments. The experimental results indicate that apportionment of copper among phases constituting geologic media is a function of geochemical environment. Distinctive partitioning patterns were derived from the analysis of drill core from each of three geochemical zones: (a) the supergene zone of oxidation; (b) the supergene zone of enrichment; and (c) the hypogene zone; and similarly, from the analysis of; (d) soils on a weakly leached capping; (e) soils on a strongly leached capping; and (f) active stream sediment. The experimental results also show that geochemical contrasts (anomaly-to-background ratios) vary widely among the five fractions of each sampling medium investigated, and that at least one fraction of each medium provides substantially stronger contrast than does the bulk medium. Fraction (1) provides optimal contrast for stream sediments of the district; fraction (2) provides optimal contrast for soils on a weakly leached capping; fraction (3) provides optimal contrast for soils on a strongly leached capping. Selective extraction procedures appear to have important applications to the orientation and interpretive stages of geochemical exploration. Further investigation and testing of a similar nature are recommended. ?? 1981.

Study of Nd:YAG laser annealing of electroless Ni-P film on spiegel-iron plate by Taguchi method and grey system theory

Energy Technology Data Exchange (ETDEWEB)

Liu, W.L. [Department of Materials Science and Engineering, National Formosa University, 64, Wunhua Road, Huwei, Yunlin 632, Taiwan (China); Chien, W.T.; Jiang, M.H. [Department of Mechanical Engineering, National Pingtung University of Science and Technology, 1, Shuehfu Road, Neipu, Pingtung 912, Taiwan (China); Chen, W.J., E-mail: chenwjau@yuntech.edu.t [Graduate School of Materials Science, National Yunlin University of Science and Technology, 123 University Road, Section 3, Douliou, Yunlin 64002, Taiwan (China)

2010-04-09

An electroless Ni-P film was first deposited on a spiegel-iron plate and then annealed by an Nd:YAG pulsed wave laser. In order to obtain the optimal laser annealing parameters for maximizing the hardness and minimizing the surface roughness of electroless Ni-P films, the Taguchi method and grey system theory were used to analyze the experimental data. The electroless Ni-P film was also characterized by scanning electron microscopy for the morphology, and transmission electron microscopy for the microstructure and crystal structure. The results showed that the hardness and the surface roughness of electroless Ni-P films can be, at the same time, improved to 50.8% and 68%, respectively, by the laser annealing with the optimal parameters.

Study of Nd:YAG laser annealing of electroless Ni-P film on spiegel-iron plate by Taguchi method and grey system theory

International Nuclear Information System (INIS)

Liu, W.L.; Chien, W.T.; Jiang, M.H.; Chen, W.J.

2010-01-01

An electroless Ni-P film was first deposited on a spiegel-iron plate and then annealed by an Nd:YAG pulsed wave laser. In order to obtain the optimal laser annealing parameters for maximizing the hardness and minimizing the surface roughness of electroless Ni-P films, the Taguchi method and grey system theory were used to analyze the experimental data. The electroless Ni-P film was also characterized by scanning electron microscopy for the morphology, and transmission electron microscopy for the microstructure and crystal structure. The results showed that the hardness and the surface roughness of electroless Ni-P films can be, at the same time, improved to 50.8% and 68%, respectively, by the laser annealing with the optimal parameters.

A qualitative exploration of emergency contraception users' willingness to select the copper IUD.

Science.gov (United States)

Wright, Rachel L; Frost, Caren J; Turok, David K

2012-01-01

The copper T intrauterine device (IUD) is an effective but underutilized method of emergency contraception (EC). This study investigates the factors influencing a woman's decision around which method of EC to select. In-depth interviews with 14 IUD and 14 oral EC users aged 18-30 years accessing public health clinics. Emergency contraception users associated long-term methods of contraception with long-term sexual relationships. Women were not aware of the possibility of using the copper IUD for EC. Cost was identified as a major barrier to accessing IUDs. Perceived side effects and impact on future pregnancies further influenced the EC method a participant selected. Women think about contraception in the context of each separate relationship and not as a long-term individual plan. Most women were unaware of the copper IUD for EC. Furthermore, there is little discussion between women and their health-care providers around EC. Copyright © 2012 Elsevier Inc. All rights reserved.

The contact heat conductance at diamond-OFHC copper interface with GaIn eutectic as a heat transfer medium

International Nuclear Information System (INIS)

Assoufid, L.; Khounsary, A.M.

1996-01-01

Results of an experimental study of the contact heat conductance across a single diamond crystal interface with OFHC copper (Cu) are reported. Gallium-indium (GaIn) eutectic was used as an interstitial material. Contact conductance data are important in the design and the prediction of the performance of x-ray diamond monochromators under high-heat-load conditions. Two sets of experiments were carried out. In one, the copper surface in contact with diamond was polished and then electroless plated with 1 μm of nickel, while in the other, the copper contact surface was left as machined. Measured average interface heat conductances are 44.7 ±8 W/cm 2 -K for nonplated copper and 23.0 ±3 W/cm 2 -K for nickel-plated copper. For reference, the thermal contact conductances at a copper-copper interface (without diamond) were also measured, and the results are reported. A typical diamond monochromator, 0.2 mm thick, will absorb about 44 W under a standard undulator beam at the Advanced Photon Source. The measured conductance for nickel-plated copper suggests that the temperature drop across the interface of diamond and nickel-plated copper, with a 20 mm 2 contact area, will be about 10 degree C. Therefore temperature rises are rather modest, and the accuracy of the measured contact conductances presented here are sufficient for design purposes

Study of Selected Composites Copper Concentrate-Plastic Waste Using Thermal Analysis

Science.gov (United States)

Szyszka, Danuta

2017-12-01

The paper presents thermal analysis of selected composites (copper concentrate, plastic waste) in two stages. The first stage consisted in thermogravimetric analysis and differential thermal analysis on the applied plastic waste and copper concentrate, and subsequently, a comparative study has been carried out on products obtained, constituting composites of those materials. As a result of analyses, it was found that up to ca. 400 °C composites show high thermal stability, whereas above that temperature, a thermal decomposition of the composite occurs, resulting in emissions of organic compounds, i.e. hydrocarbon compounds and organic oxygenate derivatives.

Electroless Ni–B Coating of Pure Titanium Surface for Enhanced Tribocorrosion Performance in Artificial Saliva and Antibacterial Activity

Directory of Open Access Journals (Sweden)

F. Mindivan

2017-05-01

Full Text Available In the present study, the surface of commercial pure (Grade 2 titanium was coated with electroless Ni–B. The surface morphology, microstructure and phase identification were analysed by X-Ray Diffraction (XRD and Field Emission Gun Scanning Electron Microscope (FEG-SEM equipped with Energy Dispersive X-ray Spectroscopy (EDS. The tribocorrosion performance in a laboratory simulated artificial saliva was investigated using a reciprocating ball-on-plate tribometer coupled to an electrochemical cell. The antibacterial property of the electroless Ni–B film coated on pure titanium was basically investigated. From this study, it may be concluded that this electroless Ni–B coating process cannot only improve the hardness and tribocorrosion performance of the pure titanium, but can also provide antimicrobial activity.

A fine surface roughness electroless Ni–P–PTFE composite modified stamper for light guide plate application

International Nuclear Information System (INIS)

Pan, K; Fu, C

2010-01-01

Electroless Ni–P–PTFE composite coating technology takes advantage of the beneficial properties from both Ni–P alloy and PTFE, such as good wear resistance, good anti-adhesion, dry lubrication, low coefficient of friction and good corrosion resistance. It has been applied in many mold industries. However, the Ni–P–PTFE composite coating suffers from bad surface roughness, when the PTFE particles incorporate into a Ni–P matrix. This severely hampers the technology to be applied to optical grade applications. In this paper, we propose a trick to generate a fine surface roughness (FSR) electroless Ni–P–PTFE composite to modify a nickel stamper. Using this new method, the nickel stamper can be covered by a Ni–P–PTFE functional layer and can keep the original surface property at the same time, namely the optical properties. We have chosen 4.5 inch (97 mm × 59 mm × 0.6 mm) light guide plates (LGPs) to demonstrate the effectiveness of the procedure. For the sake of comparison, the LGPs were produced by injection molding with three kinds of stampers including an original SUS430 master, an electroless Ni–P–PTFE composite coated nickel stamper and an FSR electroless Ni–P–PTFE composite modified stamper. We measured and discussed the optical performances at both the element level and system level, namely complete back light units.

Electroless or autocatalytic coating of microparticles for laser fusion targets

International Nuclear Information System (INIS)

Mayer, A.; Catlett, D.S.

1977-04-01

Use of a novel device for applying uniform metallic coatings to spherical microparticles is described. The apparatus deposits electroless metal coatings on hollow, thin-walled metal or sensitized nonmetallic micromandrels. The apparatus and process were developed for fabrication of microsphere pressure vessels for use as targets in laser-initiated fusion research

Young Investigator Proposal, Research Area 7.4 Reactive Chemical Systems: Multifunctional, Bimetallic Nanomaterials Prepared by Atomic Layer Electroless Deposition

Science.gov (United States)

2017-09-30

Report: Young Investigator Proposal, Research Area 7.4 Reactive Chemical Systems: Multifunctional, Bimetallic Nanomaterials Prepared by Atomic Layer ...Chemical Systems: Multifunctional, Bimetallic Nanomaterials Prepared by Atomic Layer Electroless Deposition Report Term: 0-Other Email: pcappillino... Layer Electroless Deposition (ALED, Figure 1) is the ability to tune growth mechanism, hence growth morphology, by altering conditions. In this

Electroless plating and magnetic properties of Co–Zn–P coating on ...

Indian Academy of Sciences (India)

Electroless plating; magnetic properties; Co–Zn–P coating; short carbon fibres. 1. Introduction. Since carbon ... high temperature resistance, corrosion resistance, fatigue and ... achieved in the production process of carbon fibres prepared from organic ... and a variety of functional applications (Fitzer et al 1984;. Abraham et ...

Tribological behavior of dual-layer electroless-plated Ag–carbon nanotube coatings

International Nuclear Information System (INIS)

Lee, Hyun-Dai; Penkov, Oleksiy V.; Kim, Dae-Eun

2013-01-01

The tribological behavior of electroless Ag-plated carbon nanotube (CNT) dual-layer coatings was assessed and compared to that of the pure CNT coating. The motivation was to protect the surface of CNT coatings from wear by depositing a thin, soft Ag coating. The methods used for coating CNTs and Ag were spin coating and electroless plating, respectively. These coating methods were selected based on their simplicity and cost effectiveness. Wear tests were conducted by sliding the coatings against a stainless steel ball under a 10–30 mN applied load. Results showed that the wear rate of the dual-layer coating was strongly dependent on the thickness of the Ag layer as well as the applied load. At a 10 mN load and an Ag thickness of 65 nm, the wear rate of the dual-layer coating was about 10 times less than that of the pure CNT coating. However, when the thickness of the Ag was decreased to 11.5 nm, the wear rate was significantly higher. Also, the steady-state friction coefficients of the CNT and the dual-layer Ag–CNT coatings were in the range of 0.65–0.73 for all loads. A model of the wear reduction mechanism of the dual-layer Ag–CNT coating was proposed. - Highlights: ► Dual-layer Ag–carbon nanotube (CNT) coatings were deposited on silicon wafer. ► Friction coefficient of the Ag–CNT coatings was about 0.65. ► Wear of Ag–CNT coatings depended on the thickness of Ag layer and the applied load. ► Wear rate of the Ag–CNT coating was 10-fold less than that of the pure CNT coating

Electroless nickel plating of arc discharge synthesized carbon nanotubes for metal matrix composites

International Nuclear Information System (INIS)

Jagannatham, M.; Sankaran, S.; Prathap, Haridoss

2015-01-01

Highlights: • Electroless Ni coatings have been performed on CNTs for various deposition times. • The deposition of nickel increased with increase in deposition time. • A deposition time of 60 min has been optimum for uniform coating of Ni on CNTs. • The CNTs with uniform coating of Ni are potential for reinforcements in composites. • Electroless nickel coatings are determined to be super paramagnetic behavior. - Abstract: Electroless nickel (EN) plating was performed on arc discharge synthesized multiwalled carbon nanotubes for various deposition times. X-ray diffraction (XRD), Transmission electron microscopy (TEM), and Raman spectroscopy characterization techniques are used to identify the presence of nickel deposition on the carbon nanotubes (CNTs) and the degree of graphitization. The results indicate that impurities are less in the purified CNTs as compared to raw carbon soot. Increasing deposition time up to 60 min increases uniform deposition of nickel throughout the length of the CNTs. However, for deposition time longer than 60 min, nickel particles are seen separated from the surface of the CNTs. Uniformly coated nickel CNTs throughout their length are potential candidates for reinforcements in composite materials. Magnetic properties of the nickel coated CNTs, with deposition time of 30 and 60 min were also evaluated. The magnetic saturation of nickel coated CNTs with deposition time of 30 min is less compared to nickel coated CNTs with deposition time of 60 min

Electroless nickel plating of arc discharge synthesized carbon nanotubes for metal matrix composites

Energy Technology Data Exchange (ETDEWEB)

Jagannatham, M.; Sankaran, S.; Prathap, Haridoss, E-mail: prathap@iitm.ac.in

2015-01-01

Highlights: • Electroless Ni coatings have been performed on CNTs for various deposition times. • The deposition of nickel increased with increase in deposition time. • A deposition time of 60 min has been optimum for uniform coating of Ni on CNTs. • The CNTs with uniform coating of Ni are potential for reinforcements in composites. • Electroless nickel coatings are determined to be super paramagnetic behavior. - Abstract: Electroless nickel (EN) plating was performed on arc discharge synthesized multiwalled carbon nanotubes for various deposition times. X-ray diffraction (XRD), Transmission electron microscopy (TEM), and Raman spectroscopy characterization techniques are used to identify the presence of nickel deposition on the carbon nanotubes (CNTs) and the degree of graphitization. The results indicate that impurities are less in the purified CNTs as compared to raw carbon soot. Increasing deposition time up to 60 min increases uniform deposition of nickel throughout the length of the CNTs. However, for deposition time longer than 60 min, nickel particles are seen separated from the surface of the CNTs. Uniformly coated nickel CNTs throughout their length are potential candidates for reinforcements in composite materials. Magnetic properties of the nickel coated CNTs, with deposition time of 30 and 60 min were also evaluated. The magnetic saturation of nickel coated CNTs with deposition time of 30 min is less compared to nickel coated CNTs with deposition time of 60 min.

Effects of Pretreatment on the Structure And Properties of Electroless Nickel Coatings

DEFF Research Database (Denmark)

Møller, Per; Deng, Hong

1994-01-01

The pretreatment process can significantly affect the corrosion resistance of electroless nickel (EN) coatings One of the most important reasons is that different pretreatment processes can give different surface morphologies of the substrate. The scanning electron microscope (SEM) and the scanni...

Preparation and characterization of CuO nanostructures on copper substrate as selective solar absorbers

International Nuclear Information System (INIS)

Karthick Kumar, S.; Murugesan, S.; Suresh, S.

2014-01-01

Selective solar absorber coatings of copper oxide (CuO) on copper substrates are prepared by room temperature oxidation of copper at different alkaline conditions. The surface morphology and structural analyses of the CuO coatings are carried out by scanning electron microscopy (SEM), X-ray diffraction (XRD), energy dispersive spectroscopy (EDS) and Raman spectroscopy techniques. XRD and Raman studies indicated the single phase nature and high crystallinity of the prepared CuO nanostructures. Different CuO nanostructures, viz., nanoneedles, nanofibers and nanoparticles are formed at different alkaline conditions. The influence of reaction time on morphology of the CuO nanostructures is also studied. The thermal emittance values of these nanostructured CuO samples are found to be in the range of 6–7% and their solar absorptances are ranged between 84 and 90%. The observed high solar selectivity values (>12.7) suggest that these coatings can be used as selective absorbers in solar thermal gadgets. - Highlights: • Nanostructured CuO thin films on Cu substrate have been prepared by a facile method. • Morphology of the CuO nanostructures varies with reaction pH. • The thin films show high absorptance in the visible region and low thermal emittance. • Multiple absorption in the porous structure leads to high solar absorptance. • Nanostructures posses solar selectivity values >12

Selective growth of gold onto copper indium sulfide selenide nanoparticles

Energy Technology Data Exchange (ETDEWEB)

Witt, Elena; Parisi, Juergen; Kolny-Olesiak, Joanna [Oldenburg Univ. (Germany). Inst. of Physics, Energy and Semiconductor Research

2013-05-15

Hybrid nanostructures are interesting materials for numerous applications in chemistry, physics, and biology, due to their novel properties and multiple functionalities. Here, we present a synthesis of metal-semiconductor hybrid nanostructures composed of nontoxic I-III-VI semiconductor nanoparticles and gold. Copper indium sulfide selenide (CuInSSe) nanocrystals with zinc blende structure and trigonal pyramidal shape, capped with dodecanethiol, serve as an original semiconductor part of a new hybrid nanostructure. Metallic gold nanocrystals selectively grow onto vertexes of these CuInSSe pyramids. The hybrid nanostructures were studied by transmission electron microscopy, energy dispersive X-ray analysis, X-ray diffraction, and UV-Vis-absorption spectroscopy, which allowed us conclusions about their growth mechanism. Hybrid nanocrystals are generated by replacement of a sacrificial domain in the CuInSSe part. At the same time, small selenium nanocrystals form that stay attached to the remaining CuInSSe/Au particles. Additionally, we compare the synthesis and properties of CuInSSe-based hybrid nanostructures with those of copper indium disulfide (CuInS{sub 2}). CuInS{sub 2}/Au nanostructures grow by a different mechanism (surface growth) and do not show any selectivity. (orig.)

Comparative study of electroless nickel film on different organic acids modified cuprammonium fabric (CF)

Science.gov (United States)

Zhao, Hang; Lu, Yinxiang

2016-01-01

Nickel films were grown on citric acid (CA), malic acid (MA) and oxalic acid (OA) modified cuprammonium fabric (CF) substrates via electroless nickel deposition. The nickel films were examined using scanning electron microscopy (SEM) and X-ray diffraction (XRD). Their individual deposition rate and electromagnetic interference (EMI) shielding effectiveness (SE) were also investigated to compare the properties of electroless nickel films. SEM images illustrated that the nickel film on MA modified CF substrate was smooth and uniform, and the density of nickel nuclei was much higher. Compared with that of CA modified CF, the coverage of nickel nuclei on OA and MA modified CF substrate was very limited and the nickel particles size was too big. XRD analysis showed that the nickel films deposited on the different modified CF substrates had a structure with Ni (1 1 1) preferred orientation. All the nickel coatings via different acid modification were firmly adhered to the CF substrates, as demonstrated by an ultrasonic washing test. The result of tensile test indicated that the electroless nickel plating on CF has ability to strengthen the CF substrate while causes limited effect on tensile elongation. Moreover, the nickel film deposited on MA modified CF substrate showed more predominant in EMI SE than that deposited on CA or OA modified CF.

Electroless Ni-P/Ni-B duplex coatings: preparation and evaluation of microhardness, wear and corrosion resistance

International Nuclear Information System (INIS)

Narayanan, T.S.N. Sankara; Krishnaveni, K.; Seshadri, S.K.

2003-01-01

The present work deals with the formation of Ni-P/Ni-B duplex coatings by electroless plating process and evaluation of their hardness, wear resistance and corrosion resistance. The Ni-P/Ni-B duplex coatings were prepared using dual baths (acidic hypophosphite- and alkaline borohydride-reduced electroless nickel baths) with both Ni-P and Ni-B as inner layers and with varying single layer thickness. Scanning electron microscopy (SEM) was used to assess the duplex interface. The microhardness, wear resistance and corrosion resistance of electroless nickel duplex coatings were compared with electroless Ni-P and Ni-B coatings of similar thickness. The study reveals that the Ni-P and Ni-B coatings are amorphous in their as-plated condition and upon heat-treatment at 450 deg. C for 1 h, both Ni-P and Ni-B coatings crystallize and produce nickel, nickel phosphide and nickel borides in the respective coatings. All the three phases are formed when Ni-P/Ni-B and Ni-B/Ni-P duplex coatings are heat-treated at 450 deg. C for 1 h. The duplex coatings are uniform and the compatibility between the layers is good. The microhardness, wear resistance and corrosion resistance of the duplex coating is higher than Ni-P and Ni-B coatings of similar thickness. Among the two types of duplex coatings studied, hardness and wear resistance is higher for coatings having Ni-B coating as the outer layer whereas better corrosion resistance is offered by coatings having Ni-P coating as the outer layer

Preparation and corrosion resistance of electroless Ni-P/SiC functionally gradient coatings on AZ91D magnesium alloy

Science.gov (United States)

Wang, Hui-Long; Liu, Ling-Yun; Dou, Yong; Zhang, Wen-Zhu; Jiang, Wen-Feng

2013-12-01

In this paper, the protective electroless Ni-P/SiC gradient coatings on AZ91D magnesium alloy substrate were successfully prepared. The prepared Ni-P/SiC gradient coatings were characterized for its microstructure, morphology, microhardness and adhesion to the substrate. The deposition reaction kinetics was investigated and an empirical rate equation for electroless Ni-P/SiC plating on AZ91D magnesium alloy was developed. The anticorrosion properties of the Ni-P/SiC gradient coatings in 3.5 wt.% NaCl solution were evaluated by potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) studies. The potentiodynamic polarization measurements revealed that the SiC concentration in the bath and heat treatment can influence the corrosion protection performance of electroless deposited Ni-P/SiC gradient coatings. EIS studies indicated that higher charge transfer resistance and slightly lower capacitance values were obtained for Ni-P/SiC gradient coatings compared to Ni-P coatings. The corrosion resistance of the Ni-P/SiC gradient coatings increases initially and decreases afterwards with the sustained increasing of immersion time in the aggressive medium. The electroless Ni-P/SiC gradient coatings can afford better corrosion protection for magnesium alloy substrate compared with Ni-P coatings.

Characteristics of La0.7Ca0.3MnO3-Cu composites fabricated by an electroless process

International Nuclear Information System (INIS)

Xiong, Y H; Song, S J; Xu, W; Pi, H L; Ren, Z M; Zhang, J; Bao, X C; Xiong, J; Li, D G; Huang, W H; Sun, C L; Cheng, X W; Xiong, C S

2007-01-01

Ferromagnet-metal-type composites, La 0.7 Ca 0.3 MnO 3 (LCMO)-Cu, have been fabricated by a three-step route. We got LCMO powder using the conventional solid state method. Then, LCMO powders coated by Cu are obtained using a novel electroless plating technique, in which the contents of copper are controlled by changing the plating time. Finally these powders are pelletized and then sintered at different temperatures in argon. The powders coated by Cu are characterized by x-ray powder diffraction and scanning electron microscope. The temperature dependence of resistivity and the magnetoresistance in the applied field of 3000 Oe are measured. It is observed that the metal-insulator transition temperature (Tp) is improved above 20 K approximately up to 280 K compared with that of LCMO powder using the conventional solid state method without being coated by Cu; meanwhile, a second broad peak occurs in low temperature in the resistivity-temperature curve when sintering temperature is changed. Also an anisotropic magnetoresistance effect is observed

Friction Stir Processing of Copper-Coated SiC Particulate-Reinforced Aluminum Matrix Composite

Directory of Open Access Journals (Sweden)

Chih-Wei Huang

2018-04-01

Full Text Available In the present work, we proposed a novel friction stir processing (FSP to produce a locally reinforced aluminum matrix composite (AMC by stirring copper-coated SiC particulate reinforcement into Al6061 alloy matrix. Electroless-plating process was applied to deposit the copper surface coating on the SiC particulate reinforcement for the purpose of improving the interfacial adhesion between SiC particles and Al matrix. The core-shell SiC structure provides a layer for the atomic diffusion between aluminum and copper to enhance the cohesion between reinforcing particles and matrix on one hand, the dispersion of fine copper in the Al matrix during FSP provides further dispersive strengthening and solid solution strengthening, on the other hand. Hardness distribution and tensile results across the stir zone validated the novel concept in improving the mechanical properties of AMC that was realized via FSP. Optical microscope (OM and Transmission Electron Microscopy (TEM investigations were conducted to investigate the microstructure. Energy dispersive spectrometer (EDS, electron probe micro-analyzer (EPMA, and X-ray diffraction (XRD were explored to analyze the atomic inter-diffusion and the formation of intermetallic at interface. The possible strengthening mechanisms of the AMC containing Cu-coated SiC particulate reinforcement were interpreted. The concept of strengthening developed in this work may open a new way of fabricating of particulate reinforced metal matrix composites.

Electrolytic Recovery of Nickel from Spent Electroless Nickel Bath Solution

Directory of Open Access Journals (Sweden)

R. Idhayachander

2010-01-01

Full Text Available Plating industry is one of the largest polluting small scale industries and nickel plating is among the important surface finishing process in this industry. The waste generated during this operation contains toxic nickel. Nickel removal and recovery is of great interest from spent bath for environmental and economic reasons. Spent electroless nickel solution from a reed relay switch manufacturing industry situated in Chennai was taken for electrolytic recovery of nickel. Electrolytic experiment was carried out with mild steel and gold coated mild steel as cathode and the different parameters such as current density, time, mixing and pH of the solution were varied and recovery and current efficiency was studied. It was noticed that there was an increase in current efficiency up to 5 A/dm2 and after that it declines. There is no significant improvement with mixing but with modified cathode there was some improvement. Removal of nickel from the spent electroless nickel bath was 81.81% at 5 A/dm2 and pH 4.23. Under this condition, the content of nickel was reduced to 0.94 g/L from 5.16 g/L. with 62.97% current efficiency.

Electroless Ni-P/Nano-SiO2 Composite Plating on Dual Phase Magnesium-Lithium Alloy

Science.gov (United States)

Zou, Y.; Zhang, Z. W.; Zhang, M. L.

The application of Mg-Li alloys is restricted in practice due to mainly poor corrosion resistance and wear resistance. Electroless nickel plating is one of the common and effective ways to protect alloys from corrosion. In this study, nano-SiO2 particles with Ni-P matrix have been successfully co-deposited onto dual phase Mg-8Li base alloy through electroless plating, generating homogeneously Ni-P/nano-SiO2 composite coating. The morphology, elemental composition and structures of coatings were investigated. Coating performances were evaluated using hardness tests and electrochemical analysis. The results indicate that the Ni-P/nano-SiO2 composite coating can significantly improve the wear and corrosion resistance.

Co-selection of antibiotic resistance via copper shock loading on bacteria from a drinking water bio-filter.

Science.gov (United States)

Zhang, Menglu; Chen, Lihua; Ye, Chengsong; Yu, Xin

2018-02-01

Heavy metal contamination of source water frequently occurred in developing countries as a result of accidents. To address the problems, most of the previous studies have focused on engineering countermeasures. In this study, we investigated the effects of heavy metals, particularly copper, on the development of antibiotic resistance by establishing a copper shock loading test. Results revealed that co-selection occurred rapidly within 6 h. Copper, at the levels of 10 and 100 mg/L, significantly increased bacterial resistance to the antibiotics tested, including rifampin, erythromycin, kanamycin, and a few others. A total of 117 antimicrobial-resistance genes were detected from 12 types of genes, and the relative abundance of most genes (particularly mobile genetic elements intⅠand transposons) was markedly enriched by at least one fold. Furthermore, the copper shock loading altered the bacterial community. Numerous heavy metal and antibiotic resistant strains were screened out and enriched. These strains are expected to enhance the overall level of resistance. More noticeably, the majority of the co-selected antibiotic resistance could sustain for at least 20 h in the absence of copper and antimicrobial drugs. Resistance to vancomycin, erythromycin and lincomycin even could remain for 7 days. The prominent selection pressure by the copper shock loading implies that a real accident most likely poses similar impacts on the water environment. An accidental release of heavy metals would not only cause harm to the ecological environment, but also contribute to the development of bacterial antibiotic resistance. Broader concerns should be raised about the biological risks caused by sudden releases of pollutants by accidents. Copyright © 2017. Published by Elsevier Ltd.

Method of stabilizing Nb3Sn superconducting foils

International Nuclear Information System (INIS)

Kruzliak, J.; Lences, P.; Allarova, H.

1982-01-01

The stabilization of niobium-tin Nb 3 Sn superconducting foils with copper is carried out by deposition or by diffusion in pure copper or in a tin bath containing different copper levels, with the surface etched or unetched. The foils are covered with a copper film at a temperature of 300 to 5O0 degC using a tin solder, spread on a copper, silver or nickel layer deposited on the foil surface from solutions for electroless plating. The bond between the surface of the superconducting foil and the electroless plated metal layer is annealed in a controlled atmosphere or in a vacuum at a temperature of 200 to 500 degC for over 20 to 60 minutes. The copper stabilization layer can also be produced electrolytically. (J.B.)

Electroless plating of Cu-Ni-P alloy on PET fabrics and effect of plating parameters on the properties of conductive fabrics

International Nuclear Information System (INIS)

Gan Xueping; Wu Yating; Liu Lei; Shen Bin; Hu Wenbin

2008-01-01

Electroless plating of Cu-Ni-P alloy on polyethylene terephthalate (PET) fabrics and effect of plating parameters on the properties of alloy-coated fabrics were investigated. The deposition rate increased with the increase of temperature, pH and nickel ion concentration. The addition of K 4 Fe(CN) 6 to the solution could reduce the deposition rate and make the deposits become more compact. The color of the deposits also had a corresponding improvement, changing from dark-brown to copper-bright with the addition of K 4 Fe(CN) 6 to the plating solution. The deposits have an intensified copper (1 1 1) plane orientation with the addition of K 4 Fe(CN) 6 to the plating bath. The surface electrical resistance of alloy-coated fabrics increased with increase of nickel ions concentration in the solution. The addition of K 4 Fe(CN) 6 to the solution reduced significantly the surface resistance of alloy-coated fabrics. The conductive fabrics with high shielding effectiveness could be prepared at the optimum condition with 0.0038 M nickel ions and 2 ppm K 4 Fe(CN) 6 . As the deposit weight on the fabric was 40 g/m 2 , the shielding effectiveness of alloy-coated fabrics was more than 85 dB at frequency ranging from 100 MHz to 20 GHz

Application of electroless Ni-P coating on magnesium alloy via CrO3/HF free titanate pretreatment

Science.gov (United States)

Rajabalizadeh, Z.; Seifzadeh, D.

2017-11-01

The titanate conversion coating was applied as CrO3/HF free pretreatment for the electroless Ni-P plating on AM60B magnesium alloy. The microscopic images revealed that the alloy surface was completely covered by a cracked conversion film after titanate pretreatment which was mainly composed of Mg(OH)2/MgO, MgF2, TiO2, SiO2, and Al2O3/Al(OH)3. The microscopic images also revealed that numerous Ni nucleation centers were formed over the titanate film after short electroless plating times. The nucleation centers were created not only on the cracked area but also over the whole pretreated surface due to the catalytic action of the titanate film. Also, uniform, dense, and defect-free Ni-P coating with fine structure was achieved after 3 h plating. The Ni-P coating showed mixed crystalline-amorphous structure due to its moderate phosphorus content. The results of two traditional corrosion monitoring methods indicated that the Ni-P coating significantly increases the corrosion resistance of the magnesium alloy. Moreover, Electrochemical Noise (EN) method was used as a non-polarized technique to study the corrosion behavior of the electroless coating at different immersion times. The results of the EN tests were clearly showed the localized nature of the corrosion process. Micro-hardness value of the magnesium alloy was remarkably enhanced after the electroless plating. Finally, suitable adhesion between the Ni-P coating and the magnesium alloy substrate was confirmed by thermal shock and pull-off-adhesion tests.

Experimental study on the formation and growth of electroless nickel-boron coatings from borohydride-reduced bath on mild steel

Energy Technology Data Exchange (ETDEWEB)

Vitry, Veronique, E-mail: veronique.vitry@umons.ac.be [Service de Metallurgie, Universite de Mons, Rue de l' Epargne 56, 7000 Mons (Belgium); Sens, Adeline [Service de Metallurgie, Universite de Mons, Rue de l' Epargne 56, 7000 Mons (Belgium); Kanta, Abdoul-Fatah [Service de Sciences des Materiaux, Universite de Mons, Rue de l' Epargne 56, 7000 Mons (Belgium); Delaunois, Fabienne [Service de Metallurgie, Universite de Mons, Rue de l' Epargne 56, 7000 Mons (Belgium)

2012-12-15

Highlights: Black-Right-Pointing-Pointer Initiation mechanism of electroless Ni-B on St-37 steel has been identified. Black-Right-Pointing-Pointer Different phases of the plating process were observed and identified. Black-Right-Pointing-Pointer Influence of chemical heterogeneity on coating morphology was revealed. Black-Right-Pointing-Pointer Batch replenishment of the plating bath induces new germination phase. - Abstract: Quality and homogeneity of electroless nickel-boron coatings are very important for applications in corrosion and electronics and are completely dependent on the formation of the deposit. The growth and formation process of electroless nickel-boron was investigated by immersing mild steel (St-37) samples in an un-replenished bath for various periods of time (from 5 s to 1 h). The coatings obtained at the different stages of the process were then characterized: thickness was measured by SEM, morphology was observed, weight gain was recorded and top composition of the coatings was obtained from XPS. Three main phases were identified during the coating formation and links between plating time, instantaneous deposition rate, chemistry of last formed deposit and morphology were established. The mechanism for initial deposition on steel substrate for borohydride-reduced electroless nickel bath was also observed. Those results were confronted with chemistry evolution in the unreplenished plating bath during the process. This allowed getting insight about phenomena occurring in the plating bath and their influence on coating formation.

A Study on Characterization of Light-Induced Electroless Plated Ni Seed Layer and Silicide Formation for Solar Cell Application

Science.gov (United States)

Takaloo, Ashkan Vakilipour; Joo, Seung Ki; Es, Firat; Turan, Rasit; Lee, Doo Won

2018-03-01

Light-induced electroless plating (LIEP) is an easy and inexpensive method that has been widely used for seed layer deposition of Nickel/Copper (Ni/Cu)-based metallization in the solar cell. In this study, material characterization aspects of the Ni seed layer and Ni silicide formation at different bath conditions and annealing temperatures on the n-side of a silicon diode structure have been examined to achieve the optimum cell contacts. The effects of morphology and chemical composition of Ni film on its electrical conductivity were evaluated and described by a quantum mechanical model. It has been found that correlation exists between the theoretical and experimental conductivity of Ni film. Residual stress and phase transformation of Ni silicide as a function of annealing temperature were evaluated using Raman and XRD techniques. Finally, transmission line measurement (TLM) technique was employed to determine the contact resistance of Ni/Si stack after thermal treatment and to understand its correlation with the chemical-structural properties. Results indicated that low electrical resistive mono-silicide (NiSi) phase as low as 5 mΩ.cm2 was obtained.

Initial deposition mechanism of electroless nickel plating on AZ91D magnesium alloys

International Nuclear Information System (INIS)

Song, Y.; Shan, D.; Han, E.

2006-01-01

The pretreatment processes and initial deposition mechanism of electroless nickel plating on AZ91D magnesium alloy were investigated by scanning electron microscopy (SEM) and energy dispersive X-ray (EDX). The results showed that alkaline cleaning could remove the greases and oils from the substrate surface. Acid etching could wipe off the metal chippings and oxides. The hydrofluoric acid activating process which could improve the adhesion of coating to substrate played a key role in the subsequent process of electroless nickel plating. The nickel coating was deposited preferentially on the primary α phase and then spread to the eutectic α phase and β phase. The nickel initially nucleated on the primary α phase by a replacement reaction, then grew depending on the autocatalysis function of nickel. The coating on the β phase displayed better adhesion than that on the α phase due to the nails fixing effect. (author)

Fabrication of copper-selective PVC membrane electrode based on newly synthesized copper complex of Schiff base as carrier

Directory of Open Access Journals (Sweden)

Sulekh Chandra

2016-09-01

Full Text Available The newly synthesized copper(II complex of Schiff base p-hydroxyacetophenone semicarbazone was explored as neutral ionophore for the fabrication of poly(vinylchloride (PVC based membrane electrode selective to Cu(II ions. The electrode shows a Nernstian slope of 29.8 ± 0.3 mV/decade with improved linear range of 1.8 × 10−7 to 1.0 × 10−1 M, comparatively lower detection limit 5.7 × 10−8 M between pH range of 2.0–8.0, giving a relatively fast response within 5s and can be used for at least 16 weeks without any divergence in potential. The selectivity coefficient was calculated using the fixed interference method (FIM. The electrode can also be used in partially non-aqueous media having up to 25% (v/v methanol, ethanol or acetone content with no significant change in the value of slope or working concentration range. It was successfully applied for the direct determination of copper content in water and tea samples with satisfactory results. The electrode has been used in the potentiometric titration of Cu2+ with EDTA.

The effect of inducing uniform Cu growth on formation of electroless Cu seed layer

International Nuclear Information System (INIS)

Lim, Taeho; Kim, Myung Jun; Park, Kyung Ju; Kim, Kwang Hwan; Choe, Seunghoe; Lee, Young-Soo; Kim, Jae Jeong

2014-01-01

The uniformity of Cu growth on Pd nanocatalysts was controlled by using organic additives in the formation of electroless Cu seed layers. Polyethylene glycol (PEG, Mw. 8000) not only reduced the deposition rate but also improved the uniformity of Cu growth on each Pd nanocatalyst during the seed layer formation. The stronger suppression effect of PEG on Cu than on Pd reduced the difference in the deposition rate between the two surfaces, resulting in the uniform deposition. Meanwhile, bis(3-sulfopropyl) disulfide degraded the uniformity by strong and nonselective suppression. The sheet resistance measurement and atomic force microscopy imaging revealed that the uniform Cu growth by PEG was more advantageous for the formation of a thin and smooth Cu seed layer than the non-uniform growth. The uniform Cu growth also had a positive influence on the subsequent Cu electrodeposition: the 60-nm-thick electrodeposited Cu film on the Cu seed layer showed low resistivity (2.70 μΩ·cm), low surface roughness (6.98 nm), and good adhesion strength. - Highlights: • Uniform Cu growth on Pd was achieved in formation of electroless Cu seed layer. • PEG addition to electroless bath improved the uniformity of Cu growth on Pd. • A thin, smooth and continuous Cu seed layer was obtained with PEG. • Adhesion strength of the Cu seed layer was also improved with PEG. • The uniformity improvement positively affected subsequent Cu electrodeposition

Hypoxia targeting copper complexes

International Nuclear Information System (INIS)

Dearling, J.L.

1998-11-01

The importance and incidence of tumour hypoxia, its measurement and current treatments available, including pharmacological and radiopharmacological methods of targeting hypoxia, are discussed. A variety of in vitro and in vivo methods for imposing hypoxia have been developed and are reviewed. Copper, its chemistry, biochemistry and radiochemistry, the potential for use of copper radionuclides and its use to date in this field is considered with particular reference to the thiosemicarbazones. Their biological activity, metal chelation, in vitro and in vivo studies of their radiocopper complexes and the potential for their use as hypoxia targeting radiopharmaceuticals is described. The reduction of the copper(II) complex to copper(l), its pivotal importance in their biological behaviour, and the potential for manipulation of this to effect hypoxia selectivity are described. An in vitro method for assessing the hypoxia selectivity of radiopharmaceuticals is reported. The rapid deoxygenation and high viability of a mammalian cell culture in this system is discussed and factors which may affect the cellular uptake of a radiopharmaceutical are described. The design, synthesis and complexation with copper and radiocopper of a range of bis(thiosemicarbazones) is reported. Synthesis of these compounds is simple giving high yields of pure products. The characteristics of the radiocopper complexes ( 64 Cu) including lipophilicity and redox activity are reported (reduction potentials in the range -0.314 - -0.590 V). High cellular uptakes of the radiocopper complexes of the ligands, in hypoxic and normoxic EMT6 and CHO320 cells, were observed. Extremes of selectivity are shown ranging from the hypoxia selective 64 Cu(II)ATSM to normoxic cell selective 64 Cu(II)GTS. The selectivities observed are compared with the physico chemical characteristics of the complexes. A good correlation exists between selectivity of the complex and its Cu(II)/Cu(I) reduction potential, with hypoxia

Enhancement of seeding for electroless Cu plating of metallic barrier layers by using alkyl self-assembled monolayers

Energy Technology Data Exchange (ETDEWEB)

Chen, Sung-Te [Department of Electronic Engineering, Hsiuping University of Science and Technology, Dali 412, Taichung, Taiwan (China); Chung, Yu-Cheng [Department of Materials Science and Engineering, Feng Chia University, Taichung 407, Taiwan (China); Fang, Jau-Shiung [Department of Materials Science and Engineering, National Formosa University, Huwei 632, Taiwan (China); Cheng, Yi-Lung [Department of Electrical Engineering, National Chi-Nan University, Puli, Nantou 545, Taiwan (China); Chen, Giin-Shan, E-mail: gschen@fcu.edu.tw [Department of Materials Science and Engineering, Feng Chia University, Taichung 407, Taiwan (China)

2017-05-31

Highlights: • Ta barrier layers are used as model substrates for seeding of electroless plating. • Ta layers seeded with Ta-OH yield seeds with limited density and large size (>10 nm). • Substantial improvement of seeding is obtained with functionalized SAMs. • The mechanism of seeding improvement by functionalized SAMs is clearly clarified. - Abstract: Tethering a self-assembled monolayer (SAM) on ultralow-k (porous) dielectric materials as a seed-trapping layer for electroless Cu plating has been extensively studied. By contrast, literature on direct electroless Cu plating of metallic barrier layers assisted by SAMs is scarce. Therefore, Ta, a crucial component of barrier materials for Cu interconnect metallization, was investigated as a model substrate for a new seeding (Ni catalyst formation) process of electroless Cu plating. Transmission and scanning electron microscopies indicated that catalytic particles formed on Ta films through Ta−OH groups tend to become aggregates with an average size of 14 nm and density of 2 × 10{sup 15} m{sup −2}. By contrast, Ta films with a plasma-functionalized SAM tightly bound catalytic particles without agglomeration, thus yielding a markedly smaller size (3 nm) and higher density (3 × 10{sup 16} m{sup −2}; one order greater than those formed by other novel methods). X-ray photoelectron spectroscopy clearly identified the types of material species and functional groups induced at each step of the seeding process. Moreover, the phase of the catalytic particles, either nickel alkoxide, Ni(OH){sub 2}, or metallic Ni, along with the seed-bonding mechanism, was also unambiguously distinguished. The enhancement of film-formation quality of Cu by the new seeding process was thus demonstrated.

Laser-induced selective copper plating of polypropylene surface

Science.gov (United States)

Ratautas, K.; Gedvilas, M.; Stankevičiene, I.; JagminienÄ--, A.; Norkus, E.; Li Pira, N.; Sinopoli, S.; Emanuele, U.; Račiukaitis, G.

2016-03-01

Laser writing for selective plating of electro-conductive lines for electronics has several significant advantages, compared to conventional printed circuit board technology. Firstly, this method is faster and cheaper at the prototyping stage. Secondly, material consumption is reduced, because it works selectively. However, the biggest merit of this method is potentiality to produce moulded interconnect device, enabling to create electronics on complex 3D surfaces, thus saving space, materials and cost of production. There are two basic techniques of laser writing for selective plating on plastics: the laser-induced selective activation (LISA) and laser direct structuring (LDS). In the LISA method, pure plastics without any dopant (filler) can be used. In the LDS method, special fillers are mixed in the polymer matrix. These fillers are activated during laser writing process, and, in the next processing step, the laser modified area can be selectively plated with metals. In this work, both methods of the laser writing for the selective plating of polymers were investigated and compared. For LDS approach, new material: polypropylene with carbon-based additives was tested using picosecond and nanosecond laser pulses. Different laser processing parameters (laser pulse energy, scanning speed, the number of scans, pulse durations, wavelength and overlapping of scanned lines) were applied in order to find out the optimal regime of activation. Areal selectivity tests showed a high plating resolution. The narrowest width of a copper-plated line was less than 23 μm. Finally, our material was applied to the prototype of the electronic circuit board on a 2D surface.

Improvement of the Wear Resistance of Ferrous Alloys by Electroless Plating of Nickel

Science.gov (United States)

Kaleicheva, J. K.; Karaguiozova, Z.

2018-01-01

The electroless nickel (Ni) and composite nickel - nanodiamond (Ni+DND) coatings are investigated in this study. The method EFTTOM-NICKEL for electroless nickel plating with nanosized strengthening particles (DND 4-6 nm) is applied for the coating deposition. The coatings are deposited on ferrous alloys samples. The wear resistance of the coatings is performed by friction wear tests under 50-400 MPa loading conditions - in accordance with a Polish Standard PN-83/H-04302. The microstructure observations are made by optic metallographic microscope GX41 OLIMPUS and the microhardness is determined by Vickers Method. Tests for wear resistance, thickness and microhardness measurements of the coatings without heat treatment and heat treatment are performed. The heat treatment regime is investigated with the aim to optimize the thermal process control of the coated samples without excessive tempering of the substrate material. The surface fatigue failure is determined by contact fatigue test with the purpose to establish suitable conditions for production of high performance materials.

Production of hard hydrophilic Ni-B coatings on hydrophobic Ni-Ti and Ti-6Al-4V alloys by electroless deposition

Energy Technology Data Exchange (ETDEWEB)

Buelbuel, Ferhat; Karabudak, Filiz; Yesildal, Ruhi [Ataturk Univ., Erzurum (Turkey). Mechanical Engineering Dept.

2017-07-01

This paper is mainly focused on the wetting state of liquid droplets on Ni-Ti and Ti-6Al-4V hierarchical structured hydrophobic surfaces in micro/nanoscale. Electroless Ni-B deposition as a surface coating treatment has recently drawn considerable attention of researchers owing to remarkable advantages when compared with other techniques such as low price, conformal ability to coat substrates, good bath stability and relatively easier plating process control. The Ni-Ti and Ti-6Al-4V substrates were plated by electroless Ni-B plating process. The coated films were characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD), hardness testing and static contact angle measurement. Results obtained from the analyses show that electroless Ni-B deposition may improve the hardness and wettability of the Ni-Ti and Ti-6Al-4V alloy surfaces.

Broadband infrared absorption enhancement by electroless-deposited silver nanoparticles

DEFF Research Database (Denmark)

Gritti, Claudia; Raza, Søren; Kadkhodazadeh, Shima

2017-01-01

Decorating semiconductor surfaces with plasmonic nanoparticles (NPs) is considered a viable solution for enhancing the absorptive properties of photovoltaic and photodetecting devices. We propose to deposit silver NPs on top of a semiconductor wafer by a cheap and fast electroless plating technique......, which points to the possible applications of such deposition method for harvesting photons in nanophotonics and photovoltaics. The broadband absorption is a consequence of the resonant behavior of particles with different shapes and sizes, which strongly localize the incident light at the interface...

Design, fabrication, and characterization of electroless Ni–P alloy films for micro heating devices

International Nuclear Information System (INIS)

Liu, Bernard Haochih; Liao, Fang-Yi; Chen, Jian-Hong

2013-01-01

In this work electroless nickel–phosphorous coatings were used as the micro heaters for scanning thermal microscopy. The deposition of Ni–P alloys not only simplified the microelectromechanical system fabrication steps but also provided flexibility in the tuning of the resistance of the heating elements. Ni–P films were plated on patterned silicon substrates and silicon with a silicon nitride film. The pre-deposition reactive ion etch (RIE) treatment caused a change in surface roughness that enhanced the adhesion of Ni–P coatings. Optimization of RIE parameters and pH values could achieve selective deposition of Ni–P, thus helped the lift-off of a serpentine circuit pattern. The chemical composition and microstructure of Ni–P films affect the electrical properties of micro heaters. Energy-dispersive X-ray spectroscopy identified the Ni–P composition and confirmed its insignificant level of oxidation. The high-temperature X-ray diffraction indicated that the as-deposited film was crystalline Ni, which later transformed into Ni 3 P at higher temperature. The resistivity of Ni–P films was tailored between 10 −5 and 10 −7 Ω m via a post-deposition annealing, which also obtained a stable temperature coefficient of resistance. Consequently, the performance of micro heaters could be designed with a high degree of flexibility. - Highlights: • We developed a process to fabricate micro heater by Ni–P electroless plating. • Reactive ion etch caused oscillating surface roughness and affected Ni–P adhesion. • Ni 3 P phase precipitates during annealing and reduces resistivity of Ni–P alloys. • Resistivity of Ni–P is tunable from 10 −5 to 10 −7 Ω m by plating and annealing

Selective electrochemical sensor for copper (II) ion based on chelating ionophores

International Nuclear Information System (INIS)

Singh, Ashok Kumar; Mehtab, Sameena; Jain, Ajay Kumar

2006-01-01

Plasticized membranes using 3-(2-pyridinyl)-2H-pyrido[1,2,-a]-1,3,5-triazine-2,4(3H)-dithione (L 1 ) and acetoacetanilide (L 2 ) have been prepared and explored as Cu 2+ -selective sensors. Effect of various plasticizers, viz. chloronaphthalene (China), benzyl acetate (BA), o-nitrophenyloctyl ether (o-NPOE), and anion excluders, sodium tetraphenylborate (NaTPB) and oleic acid (OA) was studied in detail and improved performance was observed at several instances. Optimum performance was observed with dithione derivative (L 1 ) having a membrane composition of L 1 (5):PVC (120):o-NPOE (240):OA (10). The sensor works satisfactorily in the concentration range 5.0 x 10 -8 to 1.0 x 10 -2 M (detection limit 4.0 x 10 -8 M) with a Nernstian slope of 29.5 mV decade -1 of activity. Wide pH range (3.0-9.5), fast response time (12 s), non-aqueous tolerance (up to 20%) and adequate shelf life (4 months) indicate the vital utility of the proposed sensor. The potentiometric selectivity coefficient values as determined by match potential method (MPM) indicate good response for Cu 2+ in presence of interfering ions. The proposed electrode comparatively shows good selectivity with respect to alkali, alkaline earth, transition and some rare earth metals ions. The electrode was used for the determination of copper in different milk powder, water samples and as indicator electrode in potentiometric titration of copper ion with EDTA

Review of Supported Pd-Based Membranes Preparation by Electroless Plating for Ultra-Pure Hydrogen Production.

Science.gov (United States)

Alique, David; Martinez-Diaz, David; Sanz, Raul; Calles, Jose A

2018-01-23

In the last years, hydrogen has been considered as a promising energy vector for the oncoming modification of the current energy sector, mainly based on fossil fuels. Hydrogen can be produced from water with no significant pollutant emissions but in the nearest future its production from different hydrocarbon raw materials by thermochemical processes seems to be more feasible. In any case, a mixture of gaseous compounds containing hydrogen is produced, so a further purification step is needed to purify the hydrogen up to required levels accordingly to the final application, i.e., PEM fuel cells. In this mean, membrane technology is one of the available separation options, providing an efficient solution at reasonable cost. Particularly, dense palladium-based membranes have been proposed as an ideal chance in hydrogen purification due to the nearly complete hydrogen selectivity (ideally 100%), high thermal stability and mechanical resistance. Moreover, these membranes can be used in a membrane reactor, offering the possibility to combine both the chemical reaction for hydrogen production and the purification step in a unique device. There are many papers in the literature regarding the preparation of Pd-based membranes, trying to improve the properties of these materials in terms of permeability, thermal and mechanical resistance, poisoning and cost-efficiency. In this review, the most relevant advances in the preparation of supported Pd-based membranes for hydrogen production in recent years are presented. The work is mainly focused in the incorporation of the hydrogen selective layer (palladium or palladium-based alloy) by the electroless plating, since it is one of the most promising alternatives for a real industrial application of these membranes. The information is organized in different sections including: (i) a general introduction; (ii) raw commercial and modified membrane supports; (iii) metal deposition insights by electroless-plating; (iv) trends in

Extremely superhydrophobic surfaces with micro- and nanostructures fabricated by copper catalytic etching.

Science.gov (United States)

Lee, Jung-Pil; Choi, Sinho; Park, Soojin

2011-01-18

We demonstrate a simple method for the fabrication of rough silicon surfaces with micro- and nanostructures, which exhibited superhydrophobic behaviors. Hierarchically rough silicon surfaces were prepared by copper (Cu)-assisted chemical etching process where Cu nanoparticles having particle size of 10-30 nm were deposited on silicon surface, depending on the period of time of electroless Cu plating. Surface roughness was controlled by both the size of Cu nanoparticles and etching conditions. As-synthesized rough silicon surfaces showed water contact angles ranging from 93° to 149°. Moreover, the hierarchically rough silicon surfaces were chemically modified by spin-coating of a thin layer of Teflon precursor with low surface energy. And thus it exhibited nonsticky and enhanced hydrophobic properties with extremely high contact angle of nearly 180°.

Comparison of the surfaces and interfaces formed for sputter and electroless deposited gold contacts on CdZnTe

Science.gov (United States)

Bell, Steven J.; Baker, Mark A.; Duarte, Diana D.; Schneider, Andreas; Seller, Paul; Sellin, Paul J.; Veale, Matthew C.; Wilson, Matthew D.

2018-01-01

Cadmium zinc telluride (CdZnTe) is a leading sensor material for spectroscopic X/γ-ray imaging in the fields of homeland security, medical imaging, industrial analysis and astrophysics. The metal-semiconductor interface formed during contact deposition is of fundamental importance to the spectroscopic performance of the detector and is primarily determined by the deposition method. A multi-technique analysis of the metal-semiconductor interface formed by sputter and electroless deposition of gold onto (111) aligned CdZnTe is presented. Focused ion beam (FIB) cross section imaging, X-ray photoelectron spectroscopy (XPS) depth profiling and current-voltage (IV) analysis have been applied to determine the structural, chemical and electronic properties of the gold contacts. In a novel approach, principal component analysis has been employed on the XPS depth profiles to extract detailed chemical state information from different depths within the profile. It was found that electroless deposition forms a complicated, graded interface comprised of tellurium oxide, gold/gold telluride particulates, and cadmium chloride. This compared with a sharp transition from surface gold to bulk CdZnTe observed for the interface formed by sputter deposition. The electronic (IV) response for the detector with electroless deposited contacts was symmetric, but was asymmetric for the detector with sputtered gold contacts. This is due to the electroless deposition degrading the difference between the Cd- and Te-faces of the CdZnTe (111) crystal, whilst these differences are maintained for the sputter deposited gold contacts. This work represents an important step in the optimisation of the metal-semiconductor interface which currently is a limiting factor in the development of high resolution CdZnTe detectors.

Effect of heat treatment, top coatings and conversion coatings on the corrosion properties of black electroless Ni-P films

Energy Technology Data Exchange (ETDEWEB)

Liu, Y., E-mail: liu_yunli@hotmail.com [R and D Department, MacDermid plc, 198 Golden Hillock Road, Birmingham B11 2PN (United Kingdom); Beckett, D.; Hawthorne, D. [R and D Department, MacDermid plc, 198 Golden Hillock Road, Birmingham B11 2PN (United Kingdom)

2011-02-15

Electroless black nickel-phosphorus plating is an advanced electroless nickel plating process formulated to deposit a black finish when processed through an oxidizing acid solution. Heat treatment, five types of top organic coating techniques and one conversion coating technique with three different experimental conditions were investigated to stabilize the black film and increase the hardness and corrosion resistance. Morphology and compositions of electroless nickel-phosphorous films with or without heat treatment, with five types of top organic coatings, and with three conversion coatings were compared to examine nickel, phosphorus, oxygen, carbon, silicon and chrome contents on the corrosion resistance of black surfaces by energy dispersive X-ray microanalysis and scanning electron microscope. Corrosion resistance of black electroless nickel-phosphorus coatings with or without heat treatment, with five types of top organic coatings, and with three conversion coatings was investigated by the polarization measurements and the salt spray test in 5% NaCl solution, respectively. HydroLac as the top organic coating from MacDermid showed the excellent corrosion resistance and the black EN film did not lose the black color after 48 h salt spray test. Electrotarnil B process with 0.5 ASD for 1 min stabilized the black Ni-P film immediately and increased the hardness and corrosion performance of the black Ni-P film. The black Ni-P coating with Electroarnil B process passed the 5% NaCl salt spray test for 3000 h in the black color and had a minimal corrosion current 0.8547 {mu}A/cm{sup 2} by the polarization measurement.

Enhancement of the corrosion protection of electroless Ni–P coating by deposition of sonosynthesized ZnO nanoparticles

Energy Technology Data Exchange (ETDEWEB)

Sharifalhoseini, Zahra [Sonochemical Research Center, Department of Chemistry, Faculty of Science, Ferdowsi University of Mashhad, 91779 Mashhad (Iran, Islamic Republic of); Entezari, Mohammad H., E-mail: entezari@um.ac.ir [Sonochemical Research Center, Department of Chemistry, Faculty of Science, Ferdowsi University of Mashhad, 91779 Mashhad (Iran, Islamic Republic of); Environmental Chemistry Research Center, Department of Chemistry, Faculty of Science, Ferdowsi University of Mashhad, 91779 Mashhad (Iran, Islamic Republic of)

2015-10-01

Graphical abstract: Enhancement of the corrosion protection of electroless Ni–P layer by ZnO nanoparticles deposition and the comparison with the classical and sonochemical Ni–P coatings. - Highlights: • Unique effects of ultrasound were investigated on the anticorrosive performance of electroless Ni–P coating. • Sonoynthesis of ZnO NPs and its deposition were performed on the surface of Ni–P coating. • ZnO as an anticorrosive has a critical role in the multifunctional surfaces. • Electrochemical properties of all fabricated samples were compared with each other. - Abstract: Ni–P coatings were deposited through electroless nickel plating in the presence and absence of ultrasound. The simultaneous synthesis of ZnO nanoparticle and its deposition under ultrasound were also carried out on the surface of Ni–P layer prepared by the classical method. The morphology of the surfaces and the chemical composition were determined by scanning electron microscopy(SEM) and energy dispersive spectroscopy (EDS), respectively. Electrochemical techniques were applied for the corrosion behavior studies. The Ni–P layer deposited by ultrasound showed a higher anticorrosive property than the layer deposited by the classical method. The ZnO nanoparticles deposited on the surface of Ni–P layer significantly improved the corrosion resistance.

Selectivity in extraction of copper and indium with chelate extractants

International Nuclear Information System (INIS)

Zivkovic, D.

2003-01-01

Simultaneous extraction of copper and indium with chelate extractants (LIX84 and D2E11PA) was described. Stechiometry of metal-organic complexes examined using the method of equimolar ratios resulted in CuR 2 and InR 3 forms of hydrophobic extracting species. A linear correlation was obtained between logarithm of distribution coefficients and chelate agents and pH, respectively. Selectivity is generally higher with higher concentrations of chelate agents in the organic phase, and is decreased with increase of concentration of hydrogen ions in feeding phase. (Original)

Sintering behavior and thermal conductivity of nickel-coated graphite flake/copper composites fabricated by spark plasma sintering

Science.gov (United States)

Xu, Hui; Chen, Jian-hao; Ren, Shu-bin; He, Xin-bo; Qu, Xuan-hui

2018-04-01

Nickel-coated graphite flakes/copper (GN/Cu) composites were fabricated by spark plasma sintering with the surface of graphite flakes (GFs) being modified by Ni-P electroless plating. The effects of the phase transition of the amorphous Ni-P plating and of Ni diffusion into the Cu matrix on the densification behavior, interfacial microstructure, and thermal conductivity (TC) of the GN/Cu composites were systematically investigated. The introduction of Ni-P electroless plating efficiently reduced the densification temperature of uncoated GF/Cu composites from 850 to 650°C and slightly increased the TC of the X-Y basal plane of the GF/Cu composites with 20vol%-30vol% graphite flakes. However, when the graphite flake content was greater than 30vol%, the TC of the GF/Cu composites decreased with the introduction of Ni-P plating as a result of the combined effect of the improved heat-transfer interface with the transition layer, P generated at the interface, and the diffusion of Ni into the matrix. Given the effect of the Ni content on the TC of the Cu matrix and on the interface thermal resistance, a modified effective medium approximation model was used to predict the TC of the prepared GF/Cu composites.

High corrosion resistance of electroless composite plating coatings on AZ91D magnesium alloys

International Nuclear Information System (INIS)

Song, Y.W.; Shan, D.Y.; Han, E.H.

2008-01-01

The process of electroless plating Ni-P on AZ91D magnesium alloys was improved. The Ni-P-ZrO 2 composite coatings and multilayer coatings were investigated based on the new electroless plating process. The coatings surface and cross-section morphologies were observed with scanning electron microscopy (SEM). The chemical compositions were analyzed by EDXS. The corrosion behaviors were evaluated by immersion, salt spray and electrochemical tests. The experimental results indicated that the Ni-P-ZrO 2 composite coatings suffered attack in NaCl solution but displayed passivation characteristics in NaOH and Na 2 SO 4 solutions. The corrosion resistance of Ni-P-ZrO 2 coatings was superior to Ni-P coatings due to the effect of ZrO 2 nano-particle. The multilayer coatings consisting of Ni-P-ZrO 2 /electroplating nickel/Ni-P (from substrate to surface) can protect magnesium alloys from corroding more than 1000 h for the salt spray test

Selective and Efficient Solvent Extraction of Copper(II Ions from Chloride Solutions by Oxime Extractants

Directory of Open Access Journals (Sweden)

Zahra Kaboli Tanha

2016-06-01

Full Text Available Oxime extractants 3-tert-butyl-2-hydroxy-5-methyl benzaldehyde oxime (HL1 and 3-tert-butyl-2-hydroxy-5-methoxy benzaldehyde oxime (HL2 were synthesized and characterized by conventional spectroscopic methods. Suitable lipophilic nature of the prepared extractants allowed examining the ability of these molecules for extraction-separation of copper from its mixture with normally associated metal ions by performing competitive extraction experiments of Cu(II, Co(II, Ni(II, Zn(II, Cd(II and Pb(II ions from chloride solutions. Both ligands transfer selectively the copper ions into dichloromethane by a cation exchange mechanism. Conventional log-log analysis and isotherm curves showed that Cu(II ions are extracted as the complexes with 1:2 metal to ligand ratio by both extractants. Verification of the effect of the organic diluent used in the extraction of copper ions by HL1 and HL2 demonstrated that the extraction efficiency varies as: dichloromethane ~ dichloroethane > toluene > xylene > ethylacetate. Time dependency investigation of the extraction processes revealed that the kinetics of the extraction of copper by HL2 is more rapid than that of HL1. The application of the ligands for extraction-separation of copper ions from leach solutions of cobalt and nickel-cadmium filter-cakes of a zinc production plants was evaluated.

Design, fabrication, and characterization of electroless Ni–P alloy films for micro heating devices

Energy Technology Data Exchange (ETDEWEB)

Liu, Bernard Haochih, E-mail: hcliu@mail.ncku.edu.tw [Department of Materials Science and Engineering, National Cheng Kung University, Taiwan (China); Promotion Center for Global Materials Research, National Cheng Kung University, Taiwan (China); Research Center for Energy Technology and Strategy, National Cheng Kung University, Taiwan (China); Liao, Fang-Yi; Chen, Jian-Hong [Department of Materials Science and Engineering, National Cheng Kung University, Taiwan (China)

2013-06-30

In this work electroless nickel–phosphorous coatings were used as the micro heaters for scanning thermal microscopy. The deposition of Ni–P alloys not only simplified the microelectromechanical system fabrication steps but also provided flexibility in the tuning of the resistance of the heating elements. Ni–P films were plated on patterned silicon substrates and silicon with a silicon nitride film. The pre-deposition reactive ion etch (RIE) treatment caused a change in surface roughness that enhanced the adhesion of Ni–P coatings. Optimization of RIE parameters and pH values could achieve selective deposition of Ni–P, thus helped the lift-off of a serpentine circuit pattern. The chemical composition and microstructure of Ni–P films affect the electrical properties of micro heaters. Energy-dispersive X-ray spectroscopy identified the Ni–P composition and confirmed its insignificant level of oxidation. The high-temperature X-ray diffraction indicated that the as-deposited film was crystalline Ni, which later transformed into Ni{sub 3}P at higher temperature. The resistivity of Ni–P films was tailored between 10{sup −5} and 10{sup −7} Ω m via a post-deposition annealing, which also obtained a stable temperature coefficient of resistance. Consequently, the performance of micro heaters could be designed with a high degree of flexibility. - Highlights: • We developed a process to fabricate micro heater by Ni–P electroless plating. • Reactive ion etch caused oscillating surface roughness and affected Ni–P adhesion. • Ni{sub 3}P phase precipitates during annealing and reduces resistivity of Ni–P alloys. • Resistivity of Ni–P is tunable from 10{sup −5} to 10{sup −7} Ω m by plating and annealing.

Simple Copper Catalysts for the Aerobic Oxidation of Amines: Selectivity Control by the Counterion.

Science.gov (United States)

Xu, Boran; Hartigan, Elizabeth M; Feula, Giancarlo; Huang, Zheng; Lumb, Jean-Philip; Arndtsen, Bruce A

2016-12-19

We describe the use of simple copper-salt catalysts in the selective aerobic oxidation of amines to nitriles or imines. These catalysts are marked by their exceptional efficiency, operate at ambient temperature and pressure, and allow the oxidation of amines without expensive ligands or additives. This study highlights the significant role counterions can play in controlling selectivity in catalytic aerobic oxidations. © 2016 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

Controlled Ag electroless deposition in bulk structures with complex three-dimensional profiles

DEFF Research Database (Denmark)

Malureanu, Radu; Zalkovskij, Maksim; Andryieuski, Andrei

2010-01-01

are of high uniformity, having an average roughness of about 4 nm. The characterization of the metal deposition is done using both the scanning electron microscopy technique as well as by atomic force microscope measurements. The electroless technique can be easily implemented, providing the effective...... and reliable metal deposition for fabrication of 3D samples in the broad range of plasmonics and photonics applications....

Adhesion of electrolessly deposited nickel-phosphorus on alumina ceramic : an assessment of the current status

NARCIS (Netherlands)

Severin, J.W.; With, de G.

1993-01-01

Literature data on the adhesion of electrolessly deposited Ni(P) films on alumina ceramic substrates are reviewed in this paper. The influences of conditions of successive etching, nucleation and metallization processes on adhesion are discussed as well as the effect of subsequent annealing

Laboratory procedure for sizing and electroless nickel plating assembled steel bearings

International Nuclear Information System (INIS)

Wright, R.R.; Petit, G.S.

1976-01-01

The bearing is placed in a holder and degreased in methyl chloroform. The entire bearing is etched in hydrochloric acid and sized in an ammonium bifluoride-hydrogen peroxide solution (NH 4 F.HF--H 2 O 2 ). The bearing is removed from the holder, activated in hydrochloric acid and plated with 0.001 in. of nickel in a plating tumbler immersed in a heated electroless nickel plating bath. The bearing is water-rinsed and air-dried

Genetic variation of Lymnaea stagnalis tolerance to copper: A test of selection hypotheses and its relevance for ecological risk assessment

International Nuclear Information System (INIS)

Côte, Jessica; Bouétard, Anthony; Pronost, Yannick; Besnard, Anne-Laure; Coke, Maïra; Piquet, Fabien; Caquet, Thierry; Coutellec, Marie-Agnès

2015-01-01

The use of standardized monospecific testing to assess the ecological risk of chemicals implicitly relies on the strong assumption that intraspecific variation in sensitivity is negligible or irrelevant in this context. In this study, we investigated genetic variation in copper sensitivity of the freshwater snail Lymnaea stagnalis, using lineages stemming from eight natural populations or strains found to be genetically differentiated at neutral markers. Copper-induced mortality varied widely among populations, as did the estimated daily death rate and time to 50% mortality (LT50). Population genetic divergence in copper sensitivity was compared to neutral differentiation using the Q ST -F ST approach. No evidence for homogenizing selection could be detected. This result demonstrates that species-level extrapolations from single population studies are highly unreliable. The study provides a simple example of how evolutionary principles could be incorporated into ecotoxicity testing in order to refine ecological risk assessment. - Highlights: • Genetic variation in copper tolerance occurs between Lymnaea stagnalis populations. • We used the Q ST -F ST approach to test evolutionary patterns in copper tolerance. • No evidence for uniform selection was found. • Results suggest that extrapolations to the species level are not safe. • A method is proposed to refine ecological risk assessment using genetic parameters. - Genetic variation in copper tolerance occurs in Lymnaea stagnalis. A method is proposed for considering evolutionary parameters in ecological risk assessment

Room temperature synthesis of indium tin oxide nanotubes with high precision wall thickness by electroless deposition

Directory of Open Access Journals (Sweden)

Mario Boehme

2011-02-01

Full Text Available Conductive nanotubes consisting of indium tin oxide (ITO were fabricated by electroless deposition using ion track etched polycarbonate templates. To produce nanotubes (NTs with thin walls and small surface roughness, the tubes were generated by a multi-step procedure under aqueous conditions. The approach reported below yields open end nanotubes with well defined outer diameter and wall thickness. In the past, zinc oxide films were mostly preferred and were synthesized using electroless deposition based on aqueous solutions. All these methods previously developed, are not adaptable in the case of ITO nanotubes, even with modifications. In the present work, therefore, we investigated the necessary conditions for the growth of ITO-NTs to achieve a wall thickness of around 10 nm. In addition, the effects of pH and reductive concentrations for the formation of ITO-NTs are also discussed.

Corrosion protection of ENIG surface finishing using electrochemical methods

International Nuclear Information System (INIS)

Bui, Q.V.; Nam, N.D.; Choi, D.H.; Lee, J.B.; Lee, C.Y.; Kar, A.; Kim, J.G.; Jung, S.B.

2010-01-01

Four types of thin film coating were carried out on copper for electronic materials by the electroless plating method at a pH range from 3 to 9. The coating performance was evaluated by electrochemical impedance spectroscopy and potentiodynamic polarization testing in a 3.5 wt.% NaCl solution. In addition, atomic force microscopy and X-ray diffraction were also used to analyze the coating surfaces. The electrochemical behavior of the coatings was improved using the electroless nickel plating solution of pH 5. The electroless nickel/immersion gold on the copper substrate exhibited high protective efficiency, charge transfer resistance and very low porosity, indicating an increase in corrosion resistance. Atomic force microscopy and X-ray diffraction analyses confirmed the surface uniformity and the formation of the crystalline-refined NiP {1 2 2} phase at pH 5.

Selective Sensing of Methanol by Poly( m-aminophenol)/Copper Nanocomposite

Science.gov (United States)

Bhuyan, Madhusmita; Samanta, Siddhartha; Kar, Pradip

2018-03-01

The nanocomposite film of conducting poly( m-aminophenol) with copper nanoparticles (PmAP/Cu) prepared by a single-step process has been demonstrated as the sensor material for selective detection of methanol vapor. Different techniques like Fourier transform infrared spectroscopy, ultraviolet-visible spectroscopy, X-ray diffraction spectroscopy, scanning electron microscopy (SEM) and transmission electron microscopy (TEM) were used to evaluate the interfacial interactions between PmAP and Cu nanoparticles within their conducting nanocomposites. The induced doping interaction through fluctuating electrostatic charge transfer between free -OH groups of the PmAP and Cu nanoparticles was confirmed from the spectral characterizations. About 3 wt% of Cu nanoparticles having average size of around 30-50 nm confirmed by the SEM and TEM analysis, was optimized inside the PmAP matrix in terms of better dispersion as well as achieving the highest conductivity (1.05 × 10-6 S/cm). The sensing performances, viz., % response, response time, recovery time, selectivity and reproducibility of the nanocomposites were studied towards methanol vapor at different concentrations. The mechanism of selective methanol vapor sensing by PmAP/Cu nanocomposite film has been explained on the basis of selective dipole interaction characterized by zeta potential measurement.

Improved electroless plating method through ultrasonic spray atomization for depositing silver nanoparticles on multi-walled carbon nanotubes

Energy Technology Data Exchange (ETDEWEB)

Zhao, Qi [School of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093 (China); Xie, Ming [Kunming Institute of Precious Metals, Kunming 650106 (China); Liu, Yichun, E-mail: liuyichun@kmust.edu.cn [School of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093 (China); Yi, Jianhong [School of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093 (China)

2017-07-01

Highlights: • Electroless plating method assisted by ultrasonic spray atomization was developed. • This method leads to much more uniform silver coatings on MWCNTs. • The plating parameters affect the layer morphologies a lot. - Abstract: A novel method was developed to deposit nanosized silver particles on multi-walled carbon nanotubes (MWCNTs). The electroless plating of silver on MWCNTs accomplished in small solution drops generated by ultrasonic spray atomization, which inhibited excessive growth of silver particles and led to much more uniform nanometer grain-sized coatings. The results showed that pretreatment was essential for silver particles to deposit on the MWCNTs, and the electrolyte concentration and reaction temperature were important parameters which had a great influence on the morphology and structure of the silver coatings. Possible mechanisms of this method are also discussed in the paper.

Improved electroless plating method through ultrasonic spray atomization for depositing silver nanoparticles on multi-walled carbon nanotubes

International Nuclear Information System (INIS)

Zhao, Qi; Xie, Ming; Liu, Yichun; Yi, Jianhong

2017-01-01

Highlights: • Electroless plating method assisted by ultrasonic spray atomization was developed. • This method leads to much more uniform silver coatings on MWCNTs. • The plating parameters affect the layer morphologies a lot. - Abstract: A novel method was developed to deposit nanosized silver particles on multi-walled carbon nanotubes (MWCNTs). The electroless plating of silver on MWCNTs accomplished in small solution drops generated by ultrasonic spray atomization, which inhibited excessive growth of silver particles and led to much more uniform nanometer grain-sized coatings. The results showed that pretreatment was essential for silver particles to deposit on the MWCNTs, and the electrolyte concentration and reaction temperature were important parameters which had a great influence on the morphology and structure of the silver coatings. Possible mechanisms of this method are also discussed in the paper.

The large magnetoelectric effect in Ni-lead zirconium titanate-Ni trilayers derived by electroless deposition

International Nuclear Information System (INIS)

Bi, K; Wang, Y G; Wu, W; Pan, D A

2010-01-01

Magnetoelectric (ME) Ni-lead zirconium titanate-Ni trilayers with neither electrodes nor bonding layers have been derived by electroless deposition. The structure and magnetic properties of the electroless deposited Ni layers with different pH values are characterized by x-ray diffraction and vibrating sample magnetometer. The influence of the bias magnetic field and the magnetic field frequency (f) on ME coupling is discussed. It is seen that α E,31 depends strongly on H dc and f. The value of the ME coefficient increases as the thickness of the Ni layer and the pH of the bath increase. A maximum of the ME voltage coefficient α E,31 = 5.77 V cm -1 Oe -1 at resonance frequency with a deposited Ni layer thickness t Ni = 302 μm is obtained. The large ME coefficient makes these Ni-PZT-Ni trilayers suitable for applications in sensors, actuators and transducers. (fast track communication)

Copper as a target for prostate cancer therapeutics: copper-ionophore pharmacology and altering systemic copper distribution

Science.gov (United States)

Denoyer, Delphine; Pearson, Helen B.; Clatworthy, Sharnel A.S.; Smith, Zoe M.; Francis, Paul S.; Llanos, Roxana M.; Volitakis, Irene; Phillips, Wayne A.; Meggyesy, Peter M.; Masaldan, Shashank; Cater, Michael A.

2016-01-01

Copper-ionophores that elevate intracellular bioavailable copper display significant therapeutic utility against prostate cancer cells in vitro and in TRAMP (Transgenic Adenocarcinoma of Mouse Prostate) mice. However, the pharmacological basis for their anticancer activity remains unclear, despite impending clinical trails. Herein we show that intracellular copper levels in prostate cancer, evaluated in vitro and across disease progression in TRAMP mice, were not correlative with copper-ionophore activity and mirrored the normal levels observed in patient prostatectomy tissues (Gleason Score 7 & 9). TRAMP adenocarcinoma cells harbored markedly elevated oxidative stress and diminished glutathione (GSH)-mediated antioxidant capacity, which together conferred selective sensitivity to prooxidant ionophoric copper. Copper-ionophore treatments [CuII(gtsm), disulfiram & clioquinol] generated toxic levels of reactive oxygen species (ROS) in TRAMP adenocarcinoma cells, but not in normal mouse prostate epithelial cells (PrECs). Our results provide a basis for the pharmacological activity of copper-ionophores and suggest they are amendable for treatment of patients with prostate cancer. Additionally, recent in vitro and mouse xenograft studies have suggested an increased copper requirement by prostate cancer cells. We demonstrated that prostate adenocarcinoma development in TRAMP mice requires a functional supply of copper and is significantly impeded by altered systemic copper distribution. The presence of a mutant copper-transporting Atp7b protein (tx mutation: A4066G/Met1356Val) in TRAMP mice changed copper-integration into serum and caused a remarkable reduction in prostate cancer burden (64% reduction) and disease severity (grade), abrogating adenocarcinoma development. Implications for current clinical trials are discussed. PMID:27175597

Efficacy of reducing agent and surfactant contacting pattern on the performance characteristics of nickel electroless plating baths coupled with and without ultrasound.

Science.gov (United States)

Agarwal, Amrita; Pujari, Murali; Uppaluri, Ramgopal; Verma, Anil

2014-07-01

This article addresses furthering the role of sonication for the optimal fabrication of nickel ceramic composite membranes using electroless plating. Deliberating upon process modifications for surfactant induced electroless plating (SIEP) and combined surfactant and sonication induced electroless plating (SSOEP), this article highlights a novel method of contacting of the reducing agent and surfactant to the conventional electroless nickel plating baths. Rigorous experimental investigations indicated that the combination of ultrasound (in degas mode), surfactant and reducing agent pattern had a profound influence in altering the combinatorial plating characteristics. For comparison purpose, purely surfactant induced nickel ELP baths have also been investigated. These novel insights consolidate newer research horizons for the role of ultrasound to achieve dense metal ceramic composite membranes in a shorter span of total plating time. Surface and physical characterizations were carried out using BET, FTIR, XRD, FESEM and nitrogen permeation experiments. It has been analyzed that the SSOEP baths provided maximum ratio of percent pore densification per unit metal film thickness (PPDδ) and hold the key for further fine tuning of the associated degrees of freedom. On the other hand SIEP baths provided lower (PPDδ) ratio but higher PPD. For SSOEP baths with dropwise reducing agent and bulk surfactant, the PPD and metal film thickness values were 73.4% and 8.4 μm which varied to 66.9% and 13.3 μm for dropwise reducing agent and drop surfactant case. Copyright © 2014 Elsevier B.V. All rights reserved.

Electrochemical behavior of low phosphorus electroless Ni-P-Si3N4 composite coatings

International Nuclear Information System (INIS)

Balaraju, J.N.; Ezhil Selvi, V.; Rajam, K.S.

2010-01-01

In the present investigation the electroless Ni-P-Si 3 N 4 composite coatings were prepared by using a low phosphorus bath containing submicron size silicon nitride particles. Plain Ni-P deposits were also prepared for comparison. The phosphorus contents present in electroless plain Ni-P and Ni-P-Si 3 N 4 coatings are 3.7 and 3.4 wt.%, respectively. Scanning electron microscope (SEM) images obtained for composite coatings (cross-sections) showed that the second phase particles are uniformly distributed throughout the thickness of the deposits. It was found that nodularity increased with particle codeposition in Ni-P matrix. To find out the electrochemical behavior of plain Ni-P and composite coatings, potentiodynamic polarization and electrochemical impedance (EIS) studies were carried out in 3.5 wt.% sodium chloride solution in non-deaerated condition. Second phase particle incorporation in Ni-P matrix indicated a marginal decrease in corrosion current density compared to the plain Ni-P deposits. This was further confirmed by EIS studies and SEM analysis of the corroded samples.

The influence of mechanical activation of chalcopyrite on the selective leaching of copper by sulphuric acid

Directory of Open Access Journals (Sweden)

Achimovičová, M.

2006-01-01

Full Text Available In this paper chalcopyrite, CuFeS2, has been selective leached by H2SO4 as leaching agent (170 g/dm3 in procedure of hydrometallurgical production of copper. Mechanical activation of the chalcopyrite resulted in mechanochemical surface oxidation as well as in the mineral surface and bulk disordering. Furthermore, the formation of agglomerates during grinding was also occured. Surface changes of the samples using infrared spectroscopy and scanning electron microscopy methods were investigated before and after leaching. The leaching rate, specific surface area, structural disorder as well as copper extraction increased with the mechanical activation of mineral.

Electroless deposition of metal nanoparticle clusters: Effect of pattern distance

KAUST Repository

Gentile, Francesco

2014-04-03

Electroless plating is a deposition technique in which metal ions are reduced as atoms on specific patterned sites of a silicon surface to form metal nanoparticles (NPs) aggregates with the desired characteristics. Those NPs, in turn, can be used as constituents of surface enhanced Raman spectroscopy substrates, which are devices where the electromagnetic field and effects thereof are giantly amplified. Here, the electroless formation of nanostructures was studied as a function of the geometry of the substrate. High resolution, electron beam lithography techniques were used to obtain nonperiodic arrays of circular patterns, in which the spacing of patterns was varied over a significant range. In depositing silver atoms in those circuits, the authors found that the characteristics of the aggregates vary with the pattern distance. When the patterns are in close proximity, the interference of different groups of adjacent aggregates cannot be disregarded and the overall growth is reduced. Differently from this, when the patterns are sufficiently distant, the formation of metal clusters of NPs is independent on the spacing of the patterns. For the particular subset of parameters used here, this critical correlation distance is about three times the pattern diameter. These findings were explained within the framework of a diffusion limited aggregation model, which is a simulation method that can decipher the formation of nanoaggregates at an atomic level. In the discussion, the authors showed how this concept can be used to fabricate ordered arrays of silver nanospheres, where the size of those spheres may be regulated on varying the pattern distance, for applications in biosensing and single molecule detection.

Electroless deposition of metal nanoparticle clusters: Effect of pattern distance

KAUST Repository

Gentile, Francesco; Laura Coluccio, Maria; Candeloro, Patrizio; Barberio, Marianna; Perozziello, Gerardo; Francardi, Marco; Di Fabrizio, Enzo M.

2014-01-01

Electroless plating is a deposition technique in which metal ions are reduced as atoms on specific patterned sites of a silicon surface to form metal nanoparticles (NPs) aggregates with the desired characteristics. Those NPs, in turn, can be used as constituents of surface enhanced Raman spectroscopy substrates, which are devices where the electromagnetic field and effects thereof are giantly amplified. Here, the electroless formation of nanostructures was studied as a function of the geometry of the substrate. High resolution, electron beam lithography techniques were used to obtain nonperiodic arrays of circular patterns, in which the spacing of patterns was varied over a significant range. In depositing silver atoms in those circuits, the authors found that the characteristics of the aggregates vary with the pattern distance. When the patterns are in close proximity, the interference of different groups of adjacent aggregates cannot be disregarded and the overall growth is reduced. Differently from this, when the patterns are sufficiently distant, the formation of metal clusters of NPs is independent on the spacing of the patterns. For the particular subset of parameters used here, this critical correlation distance is about three times the pattern diameter. These findings were explained within the framework of a diffusion limited aggregation model, which is a simulation method that can decipher the formation of nanoaggregates at an atomic level. In the discussion, the authors showed how this concept can be used to fabricate ordered arrays of silver nanospheres, where the size of those spheres may be regulated on varying the pattern distance, for applications in biosensing and single molecule detection.

Electrochemical supercapacitor application of electroless surface polymerization of polyaniline nanostructures

International Nuclear Information System (INIS)

Amarnath, Chellachamy A.; Chang, Jin Ho; Kim, Doyoung; Mane, Rajaram S.; Han, Sung-Hwan; Sohn, Daewon

2009-01-01

Electrochemical supercapacitive behaviour of polyaniline nanostructures, i.e., nanorods and nanospheres fabricated on aniline-primed conducting indium-tin oxide substrate via electroless surface polymerization using ammonium persulfate as initiator and selenious acid as efficient dopant is investigated. The self-assembled monolayer of urea derivative in presence of 3-(triethoxysilyl)-propyl isocyanate and aniline plays role of aniline-primed substrate. Polyaniline electrode composed of nanorods of excess surface area responsible for large redox reactions has shown 592 F g -1 specific capacitance which is significantly greater than closely compact polyaniline nanospheres, i.e., 214 F g -1

Morphology of one-time coated palladium-alumina composite membrane prepared by sol-gel process and electroless plating technique

Science.gov (United States)

Sari, R.; Dewi, R.; Pardi; Hakim, L.; Diana, S.

2018-03-01

Palladium coated porous alumina ceramic membrane tube was obtained using a combination of sol-gel process and electroless plating technique. The thickness, structure and composition of palladium-alumina composite membrane were analyzed by transmission electron microscopy (TEM), scanning electron microscopy (SEM), energy-dispersive X-ray (EDX), and atomic force microscopy (AFM). Palladium particle size was 6.18 to 7.64 nm. Palladium membrane with thickness of approximately 301.5 to 815.1 nm was formed at the outer surface of the alumina layer. EDX data confirmed the formation of palladium-alumina membrane containing 45% of palladium. From this research it shows the combination of sol-gel process and electroless plating technique with one-time coating can produce a homogeneous and smoother palladium nano layer film on alumina substrate.

Hall Measurements on Carbon Nanotube Paper Modified With Electroless Deposited Platinum

Directory of Open Access Journals (Sweden)

Iwuoha Emmanuel

2009-01-01

Full Text Available Abstract Carbon nanotube paper, sometimes referred to as bucky paper, is a random arrangement of carbon nanotubes meshed into a single robust structure, which can be manipulated with relative ease. Multi-walled carbon nanotubes were used to make the nanotube paper, and were subsequently modified with platinum using an electroless deposition method based on substrate enhanced electroless deposition. This involves the use of a sacrificial metal substrate that undergoes electro-dissolution while the platinum metal deposits out of solution onto the nanotube paper via a galvanic displacement reaction. The samples were characterized using SEM/EDS, and Hall-effect measurements. The SEM/EDS analysis clearly revealed deposits of platinum (Pt distributed over the nanotube paper surface, and the qualitative elemental analysis revealed co-deposition of other elements from the metal substrates used. When stainless steel was used as sacrificial metal a large degree of Pt contamination with various other metals was observed. Whereas when pure sacrificial metals were used bimetallic Pt clusters resulted. The co-deposition of a bimetallic system upon carbon nanotubes was a function of the metal type and the time of exposure. Hall-effect measurements revealed some interesting fluctuations in sheet carrier density and the dominant carrier switched from N- to P-type when Pt was deposited onto the nanotube paper. Perspectives on the use of the nanotube paper as a replacement to traditional carbon cloth in water electrolysis systems are also discussed.

Synthesis of gold nano-catalysts supported on carbon nanotubes by using electroless plating technique

International Nuclear Information System (INIS)

Ma Xicheng; Li Xia; Lun Ning; Wen Shulin

2006-01-01

Gold nanoparticles supported on carbon nanotubes were prepared by using electroless plating technique. High-resolution transmission electron microscopy (HRTEM) has shown that spherical gold nanoparticles were homogeneously dispersed on the surfaces of the carbon nanotubes with a distribution of particle sizes sharply at around 3-4 nm in diameter. The results presented in this work will probably provide new catalysts with better performances

The Effect of Adding Corrosion Inhibitors into an Electroless Nickel Plating Bath for Magnesium Alloys

Science.gov (United States)

Hu, Rong; Su, Yongyao; Liu, Hongdong; Cheng, Jiang; Yang, Xin; Shao, Zhongcai

2016-10-01

In this work, corrosion inhibitors were added into an electroless nickel plating bath to realize nickel-phosphorus (Ni-P) coating deposition on magnesium alloy directly. The performance of five corrosion inhibitors was evaluated by inhibition efficiency. The results showed that only ammonium hydrogen fluoride (NH4HF2) and ammonium molybdate ((NH4)2MoO4) could be used as corrosion inhibitors for magnesium alloy in the bath. Moreover, compounding NH4HF2 and (NH4)2MoO4, the optimal concentrations were both at 1.5 ~ 2%. The deposition process of Ni-P coating was observed by using a scanning electron microscope (SEM). It showed corrosion inhibitors inhibited undesired dissolution of magnesium substrate during the electroless plating process. In addition, SEM observation indicated that the corrosion inhibition reaction and the Ni2+ replacement reaction were competitive at the initial deposition time. Both electrochemical analysis and thermal shock test revealed that the Ni-P coating exhibited excellent corrosion resistance and adhesion properties in protecting the magnesium alloy.

Blue emitting copper nanoclusters as colorimetric and fluorescent probe for the selective detection of bilirubin

Science.gov (United States)

R. S., Aparna; J. S., Anjali Devi; John, Nebu; Abha, K.; S. S., Syamchand; George, Sony

2018-06-01

Hurdles to develop point of care diagnostic methods restrict the translation of progress in the health care sector from bench side to bedside. In this article a simple, cost effective fluorescent as well as colorimetric nanosensor was developed for the early and easy detection of hyperbilirubinemia. A stable, water soluble bovine serum albumin stabilised copper nanocluster (BSA CuNC) was used as the fluorescent probe which exhibited strong blue emission (404 nm) upon 330 nm excitation. The fluorescence of the BSA CuNC can be effectively quenched by the addition of bilirubin by the formation of copper-bilirubin complex. Meanwhile the copper-bilirubin complex resulted in an observable colour change from pale violet to green facilitating colorimetric detection. The prepared sensor displayed good selectivity and sensitivity over other co-existing molecules, and can be used for quantifying bilirubin with a detection limit down to 257 fM. Additionally, the as-prepared probe was coated on a paper strip to develop a portable paper strip sensor of bilirubin. Moreover, the method was successfully applied in real sample analysis and obtained promising result.

A laser printing based approach for printed electronics

Energy Technology Data Exchange (ETDEWEB)

Zhang, T.; Hu, M.; Guo, Q.; Zhang, W.; Yang, J., E-mail: jyang@eng.uwo.ca [Department of Mechanical and Materials Engineering, Western University, London N6A 3K7 (Canada); Liu, Y.; Lau, W. [Chengdu Green Energy and Green Manufacturing Technology R& D Center, 355 Tengfei Road, 620107 Chengdu (China); Wang, X. [Department of Mechanical and Materials Engineering, Western University, London N6A 3K7 (Canada); Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000 (China)

2016-03-07

Here we report a study of printing of electronics using an office use laser printer. The proposed method eliminates those critical disadvantages of solvent-based printing techniques by taking the advantages of electroless deposition and laser printing. The synthesized toner acts as a catalyst for the electroless copper deposition as well as an adhesion-promoting buffer layer between the substrate and deposited copper. The easy metallization of printed patterns and strong metal-substrate adhesion make it an especially effective method for massive production of flexible printed circuits. The proposed process is a high throughput, low cost, efficient, and environmentally benign method for flexible electronics manufacturing.

A laser printing based approach for printed electronics

International Nuclear Information System (INIS)

Zhang, T.; Hu, M.; Guo, Q.; Zhang, W.; Yang, J.; Liu, Y.; Lau, W.; Wang, X.

2016-01-01

Here we report a study of printing of electronics using an office use laser printer. The proposed method eliminates those critical disadvantages of solvent-based printing techniques by taking the advantages of electroless deposition and laser printing. The synthesized toner acts as a catalyst for the electroless copper deposition as well as an adhesion-promoting buffer layer between the substrate and deposited copper. The easy metallization of printed patterns and strong metal-substrate adhesion make it an especially effective method for massive production of flexible printed circuits. The proposed process is a high throughput, low cost, efficient, and environmentally benign method for flexible electronics manufacturing.

Characterization and Properties of Electroless Nickel Plated Poly (ethylene terephthalate) Nonwoven Fabric Enhanced by Dielectric Barrier Discharge Plasma Pretreatment

International Nuclear Information System (INIS)

Geng Yamin; Lu Canhui; Liang Mei; Zhang Wei

2010-01-01

In order to develop a more economical pretreatment method for electroless nickel plating, a dielectric barrier discharge (DBD) plasma at atmospheric pressure was used to improve the hydrophilicity and adhesion of poly (ethylene terephthalate) (PET) nonwoven fabric. The properties of the PET nonwoven fabric including its liquid absorptive capacity (W A ), aging behavior, surface chemical composition, morphology of the surface, adhesion strength, surface electrical resistivity and electromagnetic interference (EMI)- shielding effectiveness (SE) were studied. The liquid absorptive capacity (W A ) increased due to the incorporation of oxygen-containing and nitrogen-containing functional groups on the surface of PET nonwoven fabric after DBD air-plasma treatment. The surface morphology of the nonwoven fibers became rougher after plasma treatment. Therefore, the surface was more prone to absorb tin sensitizer and palladium catalyst to form an active layer for the deposition of electroless nickel. SEM and X-ray diffraction (XRD) measurements indicated that a uniform coating of nickel was formed on the PET nonwoven fabric. The average EMI-SE of Ni-plating of PET nonwoven fabric maintained a relatively stable value (38.2 dB to 37.3 dB) in a frequency range of 50 MHz to 1500 MHz. It is concluded that DBD is feasible for pretreatment of nonwoven fabric for electroless nickel plating to prepare functional material with good EMI-SE properties.

Study of electroless nickel plating on PerFactoryTM rapid prototype model

OpenAIRE

J.C. Rajaguru; C. Au, M. Duke

2012-01-01

This paper presents an investigation of electroless nickel plating on PerFactoryTM rapid prototype model built on PerFactoryTM R05 material. PerFactoryTM R05 is acrylic based photo sensitive resin. It is a popular material in rapid prototyping using PerFactoryTM method which employs addictive manufacturing technique to build prototypes for visual inspection, assembly etc. Metallization of such a prototype can extend the application envelop of the rapid prototyping technique as they can be use...

Effect of heat treatment duration on tribological behavior of electroless Ni-(high)P coatings

Science.gov (United States)

Biswas, A.; Das, S. K.; Sahoo, P.

2016-09-01

Electroless nickel coating occurs through an autocatalytic chemical reaction and without the aid of electricity. From tribological perspective, it is recommended due to its high hardness, wear resistance, lubricity and corrosion resistance properties. In this paper electroless Ni-P coatings with high phosphorous weight percentages are developed on mild steel (AISI 1040) substrates. The coatings are subjected to heat treatment at 300°C and 500°C for time durations up to 4 hours. The effect of heat treatment duration on the hardness as well as tribological properties is discussed in detail. Hardness is measured in a micro hardness tester while the tribological tests are carried out on a pin-on-disc tribotester. Wear is reported in the form of wear rates of the sample subjected to the test. As expected, heat treatment of electroless Ni-P coating results in enhancement in its hardness which in turn increases its wear resistance. The present study also finds that duration of heat treatment has quite an effect on the properties of the coating. Increase in heat treatment time in general results in increase in the hardness of the coating. Coefficient of friction is also found to be lesser for the samples heat treated for longer durations (4 hour). However, in case of wear, similar trend is not observed. Instead samples heat treated for 2 to 3 hour display better wear resistance compared to the same heat treated for 4 hour duration. The microstructure of the coating is also carried out to ensure about its proper development. From scanning electron microscopy (SEM), the coating is found to possess the conventional nodular structure while energy dispersive X-ray analysis (EDX) shows that the phosphorous content in the coating to be greater than 9%. This means that the current coating belongs to the high phosphorous category. From X-ray diffraction analysis (XRD), it is found that coating is amorphous in as-deposited condition but transforms into a crystalline structure with

Electrochromism of the electroless deposited cuprous oxide films

International Nuclear Information System (INIS)

Neskovska, R.; Ristova, M.; Velevska, J.; Ristov, M.

2007-01-01

Thin cuprous oxide films were prepared by a low cost, chemical deposition (electroless) method onto glass substrates pre-coated with fluorine doped tin oxide. The X-ray diffraction pattern confirmed the Cu 2 O composition of the films. Visible transmittance spectra of the cuprous oxide films were studied for the as-prepared, colored and bleached films. The cyclic voltammetry study showed that those films exhibited cathode coloring electrochromism, i.e. the films showed change of color from yellowish to black upon application of an electric field. The transmittance across the films for laser light of 670 nm was found to change due to the voltage change for about 50%. The coloration memory of those films was also studied during 6 h, ex-situ. The coloration efficiency at 670 nm was calculated to be 37 cm 2 /C

Nuclear fuel element and container

International Nuclear Information System (INIS)

Grubb, W.T.; King, L.H.

1981-01-01

The invention is based on the discovery that a substantial reduction in metal embrittlement or stress corrosion cracking from fuel pellet-cladding interaction can be achieved by the use of a copper layer or liner in proximity to the nuclear fuel, and an intermediate zirconium oxide barrier layer between the copper layer and the zirconium cladding substrate. The intermediate zirconia layer is a good copper diffusion barrier; also, if the zirconium cladding surface is modified prior to oxidation, copper can be deposited by electroless plating. A nuclear fuel element is described which comprises a central core of fuel material and an elongated container using the system outlined above. The method for making the container is again described. It comprises roughening or etching the surface of the zirconium or zirconium alloy container, oxidizing the resulting container, activating the oxidized surface to allow for the metallic coating of such surfaces by electroless deposition and further coating the activated-oxidized surface of the zirconium or zirconium alloy container with copper, iron or nickel or an alloy thereof. (U.K.)

Corrosion of AZ91D magnesium alloy with a chemical conversion coating and electroless nickel layer

International Nuclear Information System (INIS)

Huo Hongwei; Li Ying; Wang Fuhui

2004-01-01

A chemical conversion treatment and an electroless nickel plating were applied to AZ91D alloy to improve its corrosion resistance. By conversion treatment in alkaline stannate solution, the corrosion resistance of the alloy was improved to some extent as verified by immersion test and potentiodynamic polarization test in 3.5 wt.% NaCl solution at pH 7.0. X-ray diffraction patterns of the stannate treated AZ91D alloy showed the presence of MgSnO 3 · H 2 O, and SEM images indicated a porous structure, which provided advantage for the adsorption during sensitisation treatment prior to electroless nickel plating. A nickel coating with high phosphorus content was successfully deposited on the chemical conversion coating pre-applied to AZ91D alloy. The presence of the conversion coating between the nickel coating and the substrate reduced the potential difference between them and enhanced the corrosion resistance of the alloy. An obvious passivation occurred for the nickel coating during anodic polarization in 3.5 wt.% NaCl solution

Thin and flexible Ni-P based current collectors developed by electroless deposition for energy storage devices

International Nuclear Information System (INIS)

Wu, Haoran; Susanto, Amelia; Lian, Keryn

2017-01-01

Highlights: • A PET metallized by electroless nickel was developed as flexible current collector. • The Ni-PET current collector showed good conductivity and chemical stability. • The flexible nanocarbon electrodes with Ni-PET exhibited capacitive behavior. • The Ni-PET enabled electrodes performed nicely in liquid and solid supercapacitors. - Abstract: A PET film metalized by electroless nickel deposition was demonstrated as thin and flexible current collector for energy storage devices. The resultant nickel-on-PET film (Ni-PET) can be used both as current collector for electrochemical capacitors and as electrode for thin film batteries. The composition of Ni-PET was characterized by EDX and XPS. The electrochemical performance of the Ni-PET current collector was similar to Ni foil but with less hydrogen evolution at low potential. The Ni-PET film exhibited better flexibility than a metallic Ni foil. Carbon nanotubes were coated on a Ni-PET substrate to form an electrochemical capacitor electrode which exhibited high chemical stability in both liquid and solid electrolytes, showing strong promise for solid energy storage devices.

Study on the poisoning resistance of Pd-coated ZrCo alloy prepared by electroless plating method

Energy Technology Data Exchange (ETDEWEB)

Guo, Xiumei, E-mail: xiumei418@163.com; Wang, Shumao; Li, Zhinian; Yuan, Baolong; Ye, Jianhua; Qiu, Haochen; Wu, Yuanfang; Liu, Xiaopeng; Jiang, Lijun

2016-12-15

Highlights: • The Pd membrane was prepared by electroless plating method. • The Pd membrane was compact and uniform. • The effectiveness of Pd membranes was affected by impurity contents and temperatures. - Abstract: To improve the poisoning resistance of ZrCo alloy, Pd membranes have been prepared over the surface of the alloy substrates by using electroless plating method. The characteristics of Pd membranes have been examined by XRD, SEM, EDS and EPMA technologies. From SEM images, the uniform and compact thin Pd film was revealed. The effect of this Pd film was evaluated by comparing the hydrogen absorption properties of bare and Pd-coated ZrCo specimens in contaminated hydrogen gas. The degradation of hydrogen absorption of Pd-coated ZrCo induced by poisoning was less than that of bare ZrCo sample obviously, meaning that the Pd membranes over the surface of substrates appeared to be effective in improving the poisoning resistance of ZrCo alloy. Furthermore, the effect became more significant with the increasing of impurity contents in the experimental gas and the operation temperatures.

Thin and flexible Ni-P based current collectors developed by electroless deposition for energy storage devices

Energy Technology Data Exchange (ETDEWEB)

Wu, Haoran, E-mail: haoran.wu@mail.utoronto.ca; Susanto, Amelia; Lian, Keryn

2017-02-01

Highlights: • A PET metallized by electroless nickel was developed as flexible current collector. • The Ni-PET current collector showed good conductivity and chemical stability. • The flexible nanocarbon electrodes with Ni-PET exhibited capacitive behavior. • The Ni-PET enabled electrodes performed nicely in liquid and solid supercapacitors. - Abstract: A PET film metalized by electroless nickel deposition was demonstrated as thin and flexible current collector for energy storage devices. The resultant nickel-on-PET film (Ni-PET) can be used both as current collector for electrochemical capacitors and as electrode for thin film batteries. The composition of Ni-PET was characterized by EDX and XPS. The electrochemical performance of the Ni-PET current collector was similar to Ni foil but with less hydrogen evolution at low potential. The Ni-PET film exhibited better flexibility than a metallic Ni foil. Carbon nanotubes were coated on a Ni-PET substrate to form an electrochemical capacitor electrode which exhibited high chemical stability in both liquid and solid electrolytes, showing strong promise for solid energy storage devices.

Towards a selective adsorbent for arsenate and selenite in the presence of phosphate: Assessment of adsorption efficiency, mechanism, and binary separation factors of the chitosan-copper complex.

Science.gov (United States)

Yamani, Jamila S; Lounsbury, Amanda W; Zimmerman, Julie B

2016-01-01

The potential for a chitosan-copper polymer complex to select for the target contaminants in the presence of their respective competitive ions was evaluated by synthesizing chitosan-copper beads (CCB) for the treatment of (arsenate:phosphate), (selenite:phosphate), and (selenate:sulfate). Based on work by Rhazi et al., copper (II) binds to the amine moiety on the chitosan backbone as a monodentate complex (Type I) and as a bidentate complex crosslinking two polymer chains (Type II), depending on pH and copper loading. In general, the Type I complex exists alone; however, beyond threshold conditions of pH 5.5 during synthesis and a copper loading of 0.25 mol Cu(II)/mol chitosan monomer, the Type I and Type II complexes coexist. Subsequent chelation of this chitosan-copper ligand to oxyanions results in enhanced and selective adsorption of the target contaminants in complex matrices with high background ion concentrations. With differing affinities for arsenate, selenite, and phosphate, the Type I complex favors phosphate chelation while the Type II complex favors arsenate chelation due to electrostatic considerations and selenite chelation due to steric effects. No trend was exhibited for the selenate:sulfate system possibly due to the high Ksp of the corresponding copper salts. Binary separation factors, α12, were calculated for the arsenate-phosphate and selenite-phosphate systems, supporting the mechanistic hypothesis. While, further research is needed to develop a synthesis method for the independent formation of the Type II complexes to select for target contaminants in complex matrices, this work can provide initial steps in the development of a selective adsorbent. Copyright © 2015 Elsevier Ltd. All rights reserved.

Bis(trialkylsilyl) peroxides as alkylating agents in the copper-catalyzed selective mono-N-alkylation of primary amides.

Science.gov (United States)

Sakamoto, Ryu; Sakurai, Shunya; Maruoka, Keiji

2017-06-13

The copper-catalyzed selective mono-N-alkylation of primary amides with bis(trialkylsilyl) peroxides as alkylating agents was reported. The results of a mechanistic study suggest that this reaction should proceed via a free radical process that includes the generation of alkyl radicals from bis(trialkylsilyl) peroxides.

Synthesis, optical properties and residual strain effect of GaN nanowires generated via metal-assisted photochemical electroless etching

KAUST Repository

Najar, Adel; Shafa, Muhammad; Anjum, Dalaver H.

2017-01-01

Herein, we report on the studies of GaN nanowires (GaN NWs) prepared via a metal-assisted photochemical electroless etching method with Pt as the catalyst. It has been found that etching time greatly influences the growth of GaN NWs. The density

Surface coating Zr or Zr alloy nuclear fuel elements

International Nuclear Information System (INIS)

Donaghy, R.E.; Sherman, A.H.

1980-01-01

A method is disclosed for preventing stress corrosion cracking or metal embrittlement of a zirconium or zirconium alloy container that is to be coated on the inside surface with a layer of a metal such as copper, a copper alloy, nickel, or iron and used for holding nuclear fuel material as a nuclear fuel element. The zirconium material is etched in an etchant solution, desmutted mechanically or ultrasonically, oxidized to form an oxide coating on the zirconium, cleaned in an aqueous alkaline cleaning solution, activated for electroless deposition of a metal layer and contacted with an electroless metal plating solution. This method provides a boundary layer of zirconium oxide between the zirconium container and the metal layer. (author)

Self-optimized metal coatings for fiber plasmonics by electroless deposition.

Science.gov (United States)

Bialiayeu, A; Caucheteur, C; Ahamad, N; Ianoul, A; Albert, J

2011-09-26

We present a novel method to prepare optimized metal coatings for infrared Surface Plasmon Resonance (SPR) sensors by electroless plating. We show that Tilted Fiber Bragg grating sensors can be used to monitor in real-time the growth of gold nano-films up to 70 nm in thickness and to stop the deposition of the gold at a thickness that maximizes the SPR (near 55 nm for sensors operating in the near infrared at wavelengths around 1550 nm). The deposited films are highly uniform around the fiber circumference and in spite of some nanoscale roughness (RMS surface roughness of 5.17 nm) the underlying gratings show high quality SPR responses in water. © 2011 Optical Society of America

Improving the Response of Copper(II) Selective PVC Membrane Electrode by Modification of N2S2 Donor Ligand.

Science.gov (United States)

Brinić, Slobodan; Buzuk, Marijo; Generalić, Eni; Bralić, Marija

2010-06-01

S,S'-bis(2-aminophenyl)ethanebis(thioate), (APhET), is reported as N2S2 ligand which form chelate with copper of high stability as compared to the other metals. Two modification of APhET, simpler 1,2-di-(o-aminophenylthio)ethane (DAPhTE), and the complex one 1,2-di-(o-salicylaldiminophenylthio)ethane (SAPhTE), were examined as the active material for copper(II) ion selective PVC membrane electrodes, and observed results are correlated. The obtained results with DAPhTE based electrodes show that only coordination abilities of ligand are insufficient for preparing the efficient membrane material. On the other hand, the results that are achieved with electrodes based on SAPhTE actuate interaction of ligand with polymer membrane matrix and necessity of ionophore immobilization in membrane. Optimized SAPhTE based membrane electrode has a linear range down to 10-6 mol L-1, with slope of 27.0 mV per decade, very rapid response time (under 5 seconds) and detection limit of 5.1 × 10-7 mol L-1. Such electrode is suitable for determination of copper(II) in analytical measurements by direct potentiometry and in potentiometric titrations, within pH between 2 and 7. The electrode is selective for copper(II) ions over a large number of metal ions, with the exception on Hg2+ ion when is present in concentrations above 2 × 10-5 mol L-1.

Method for regeneration of electroless nickel plating solution

Science.gov (United States)

Eisenmann, E.T.

1997-03-11

An electroless nickel(EN)/hypophosphite plating bath is provided employing acetic acid/acetate as a buffer and which is, as a result, capable of perpetual regeneration while avoiding the production of hazardous waste. A regeneration process is provided to process the spent EN plating bath solution. A concentrated starter and replenishment solution is provided for ease of operation of the plating bath. The regeneration process employs a chelating ion exchange system to remove nickel cations from spent EN plating solution. Phosphites are then removed from the solution by precipitation. The nickel cations are removed from the ion exchange system by elution with hypophosphorus acid and the nickel concentration of the eluate adjusted by addition of nickel salt. The treated solution and adjusted eluate are combined, stabilizer added, and the volume of resulting solution reduced by evaporation to form the bath starter and replenishing solution. 1 fig.

Method for regeneration of electroless nickel plating solution

Science.gov (United States)

Eisenmann, Erhard T.

1997-01-01

An electroless nickel(EN)/hypophosphite plating bath is provided employing acetic acid/acetate as a buffer and which is, as a result, capable of perpetual regeneration while avoiding the production of hazardous waste. A regeneration process is provided to process the spent EN plating bath solution. A concentrated starter and replenishment solution is provided for ease of operation of the plating bath. The regeneration process employs a chelating ion exchange system to remove nickel cations from spent EN plating solution. Phosphites are then removed from the solution by precipitation. The nickel cations are removed from the ion exchange system by elution with hypophosphorous acid and the nickel concentration of the eluate adjusted by addition of nickel salt. The treated solution and adjusted eluate are combined, stabilizer added, and the volume of resulting solution reduced by evaporation to form the bath starter and replenishing solution.

Bath temperature effect on magnetoelectric performance of Ni-lead zirconate titanate-Ni laminated composites synthesized by electroless deposition

Energy Technology Data Exchange (ETDEWEB)

Wu, W. [College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016 (China); Wang, Y.G., E-mail: yingang.wang@nuaa.edu.c [College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016 (China); Bi, K. [College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016 (China)

2011-03-15

Magnetoelectric (ME) Ni-lead zirconate titanate-Ni laminated composites have been prepared by electroless deposition at various bath temperatures. The structure of the Ni layers deposited at various bath temperatures was characterized by X-ray diffraction, and microstructures were investigated by transmission electron microscopy. The magnetostrictive coefficients were measured by means of a resistance strain gauge. The transverse ME voltage coefficient {alpha}{sub E,31} was measured with the magnetic field applied parallel to the sample plane. The deposition rate of Ni increases with bath temperature. Ni layer with smaller grain size is obtained at higher bath temperature and shows higher piezomagnetic coefficient, promoting the ME effect of corresponding laminated composites. It is advantageous to increase the bath temperature, while trying to avoid the breaking of bath constituents. - Research Highlights: Laminated composites without interlayer are prepared by electroless deposition. Bath temperature affects the grain size of the deposited Ni layers. Higher bath temperature is beneficial to obtain stronger ME response.

The cardiac copper chaperone proteins Sco1 and CCS are up-regulated, but Cox 1 and Cox4 are down-regulated, by copper deficiency.

Science.gov (United States)

Getz, Jean; Lin, Dingbo; Medeiros, Denis M

2011-10-01

Copper is ferried in a cell complexed to chaperone proteins, and in the heart much copper is required for cytochrome c oxidase (Cox). It is not completely understood how copper status affects the levels of these proteins. Here we determined if dietary copper deficiency could up- or down-regulate select copper chaperone proteins and Cox subunits 1 and 4 in cardiac tissue of rats. Sixteen weanling male Long-Evans rats were randomized into treatment groups, one group receiving a copper-deficient diet (CCS, Sco1, Ctr1, Cox17, Cox1, and Cox4 by SDS-PAGE and Western blotting. No changes were observed in the concentrations of CTR1 and Cox17 between copper-adequate and copper-deficient rats. CCS and Sco1 were up-regulated and Cox1 and Cox4 were both down-regulated as a result of copper deficiency. These data suggest that select chaperone proteins and may be up-regulated, and Cox1 and 4 down-regulated, by a dietary copper deficiency, whereas others appear not to be affected by copper status.

Mechanically robust silver coatings prepared by electroless plating on thermoplastic polyurethane

Science.gov (United States)

Vasconcelos, B.; Vediappan, K.; Oliveira, J. C.; Fonseca, C.

2018-06-01

A simple and low-cost surface functionalization method is proposed to activate a thermoplastic polyurethane (TPU) for the electroless deposition of a silver coating with excellent adhesion and low resistivity. The TPU surface functionalization was performed in solution and consisted in forming a physical interpenetrating network at the TPU surface, involving TPU and polyvinylpyrrolidone (PVP), a polymer displaying a strong affinity for metals. The presence of PVP on the TPU surface and its stability in aqueous solution were assessed by ATR-FTIR and contact angle measurements as a function of the PVP concentration and treatment time. A modified Tollens solution was used to grow a silver film on the TPU substrate, by using the electroless plating method. Compact silver films with an average thickness of 12.5 μm and a resistivity of 8.57 mΩ·cm were obtained for a 24 h plating time. The adhesion strength of the silver film proved to be higher than 8.5 N/cm. The resistance to fatigue of the silver films was studied by performing series of compression/stretching tests (150 cycles). It was concluded that the films kept low resistance values, although displaying a higher sensitivity to compression than to stretching. Furthermore, the films keep a good conductivity for strains up to 400%. The excellent electrical and mechanical properties of the films make them suitable candidates for the coating of multipin dry bioelectrodes. Owing to the high affinity of many metals for PVP, this activation technique has the potential to be extended to the deposition of other metals and other polymers as well, provided a suitable solvent is used.

Chronic copper exposure causes spatial memory impairment, selective loss of hippocampal synaptic proteins, and activation of PKR/eIF2α pathway in mice.

Science.gov (United States)

Ma, Quan; Ying, Ming; Sui, Xiaojing; Zhang, Huimin; Huang, Haiyan; Yang, Linqing; Huang, Xinfeng; Zhuang, Zhixiong; Liu, Jianjun; Yang, Xifei

2015-01-01

Copper is an essential element for human growth and development; however, excessive intake of copper could contribute to neurotoxicity. Here we show that chronic exposure to copper in drinking water impaired spatial memory with simultaneous selective loss of hippocampal pre-synaptic protein synapsin 1, and post-synaptic density protein (PSD)-93/95 in mice. Copper exposure was shown to elevate the levels of nitrotyrosine and 8-hydroxydeoxyguanosine (8-OHdG) in hippocampus, two markers of oxidative stress. Concurrently, we also found that copper exposure activated double stranded RNA-dependent protein kinase (PKR) as evidenced by increased ratio of phosphorylated PKR at Thr451 and total PKR and increased the phosphorylation of its downstream signaling molecule eukaryotic initiation factor 2α (eIF2α) at Ser51 in hippocampus. Consistent with activation of PKR/eIF2α signaling pathway which was shown to mediate synaptic deficit and cognitive impairment, the levels of activating transcription factor 4 (ATF-4), a downstream signaling molecule of eIF2α and a repressor of CREB-mediated gene expression, were significantly increased, while the activity of cAMP response elements binding protein (CREB) was inactivated as suggested by decreased phosphorylation of CREB at Ser133 by copper exposure. In addition, the expression of the pro-apoptotic target molecule C/EBP homology protein (CHOP) of ATF-4 was upregulated and hippocampal neuronal apoptosis was induced by copper exposure. Taken together, we propose that chronic copper exposure might cause spatial memory impairment, selective loss of synaptic proteins, and neuronal apoptosis through the mechanisms involving activation of PKR/eIF2α signaling pathway.

Green and selective synthesis of N-substituted amides using water soluble porphyrazinato copper(II) catalyst

International Nuclear Information System (INIS)

Ghodsinia, Sara S.E.; Akhlaghinia, Batool; Eshghi, Hossein; Safaei, Elham

2013-01-01

N, N',N , N ' -Tetramethyl tetra-2,3-pyridinoporphyrazinato copper(II) methyl sulfate ([Cu(2,3-tmtppa)](MeSO 4 ) 4 ) efficiently catalyzed the direct conversion of nitriles to N-substituted amides. The one pot selective synthesis of the N-substituted amides from nitriles and primary amines was performed in refluxing H 2 O. The catalyst was recovered and reused at least four times, maintaining its efficiency. (author)

Crystal structures of copper(II) chloride, copper(II) bromide, and copper(II) nitrate complexes with pyridine-2-carbaldehyde thiosemicarbazone

Science.gov (United States)

Chumakov, Yu. M.; Tsapkov, V. I.; Jeanneau, E.; Bairac, N. N.; Bocelli, G.; Poirier, D.; Roy, J.; Gulea, A. P.

2008-09-01

The crystal structures of chloro-(2-formylpyridinethiosemicarbazono)copper dimethyl sulfoxide solvate ( I), bromo-(2-formylpyridinethiosemicarbazono)copper ( II), and (2-formylpyridinethiosemicarbazono)copper(II) nitrate dimethyl sulfoxide solvate ( III) are determined using X-ray diffraction. In the crystals, complexes I and II form centrosymmetric dimers in which the thiosemicarbazone sulfur atom serves as a bridge and occupies the fifth coordination site of the copper atom of the neighboring complex related to the initial complex through the center of symmetry. In both cases, the coordination polyhedron of the complexing ion is a distorted tetragonal bipyramid. Complex III in the crystal structure forms polymer chains in which the copper atom of one complex forms the coordination bond with the thicarbamide nitrogen atom of the neighboring complex. In this structure, the coordination polyhedron of the central atom is an elongated tetragonal bipyramid. It is established that complexes I III at a concentration of 10-5 mol/l selectively inhibit the growth of 60 to 90 percent of the cancer tumor cells of the human myeloid leukemia (HL-60).

Crystal structures of copper(II) chloride, copper(II) bromide, and copper(II) nitrate complexes with pyridine-2-carbaldehyde thiosemicarbazone

International Nuclear Information System (INIS)

Chumakov, Yu. M.; Tsapkov, V. I.; Jeanneau, E.; Bairac, N. N.; Bocelli, G.; Poirier, D.; Roy, J.; Gulea, A. P.

2008-01-01

The crystal structures of chloro-(2-formylpyridinethiosemicarbazono)copper dimethyl sulfoxide solvate (I), bromo-(2-formylpyridinethiosemicarbazono)copper (II), and (2-formylpyridinethiosemicarbazono)copper(II) nitrate dimethyl sulfoxide solvate (III) are determined using X-ray diffraction. In the crystals, complexes I and II form centrosymmetric dimers in which the thiosemicarbazone sulfur atom serves as a bridge and occupies the fifth coordination site of the copper atom of the neighboring complex related to the initial complex through the center of symmetry. In both cases, the coordination polyhedron of the complexing ion is a distorted tetragonal bipyramid. Complex III in the crystal structure forms polymer chains in which the copper atom of one complex forms the coordination bond with the thicarbamide nitrogen atom of the neighboring complex. In this structure, the coordination polyhedron of the central atom is an elongated tetragonal bipyramid. It is established that complexes I-III at a concentration of 10 -5 mol/l selectively inhibit the growth of 60 to 90 percent of the cancer tumor cells of the human myeloid leukemia (HL-60).

Crystal structures of copper(II) chloride, copper(II) bromide, and copper(II) nitrate complexes with pyridine-2-carbaldehyde thiosemicarbazone

Energy Technology Data Exchange (ETDEWEB)

Chumakov, Yu. M., E-mail: chumakov.xray@phys.asm.md [Academy of Sciences of Moldova, Institute of Applied Physics (Moldova, Republic of); Tsapkov, V. I. [State University of Moldova (Moldova, Republic of); Jeanneau, E. [Universite Claude Bernard, Laboratoire des Multimateriaux et Interfaces (France); Bairac, N. N. [State University of Moldova (Moldova, Republic of); Bocelli, G. [National Research Council (IMEM-CNR), Institute of Materials for Electronics and Magnetism (Italy); Poirier, D.; Roy, J. [Centre Hospitalier Universitaire de Quebec (CHUQ) (Canada); Gulea, A. P. [State University of Moldova (Moldova, Republic of)

2008-09-15

The crystal structures of chloro-(2-formylpyridinethiosemicarbazono)copper dimethyl sulfoxide solvate (I), bromo-(2-formylpyridinethiosemicarbazono)copper (II), and (2-formylpyridinethiosemicarbazono)copper(II) nitrate dimethyl sulfoxide solvate (III) are determined using X-ray diffraction. In the crystals, complexes I and II form centrosymmetric dimers in which the thiosemicarbazone sulfur atom serves as a bridge and occupies the fifth coordination site of the copper atom of the neighboring complex related to the initial complex through the center of symmetry. In both cases, the coordination polyhedron of the complexing ion is a distorted tetragonal bipyramid. Complex III in the crystal structure forms polymer chains in which the copper atom of one complex forms the coordination bond with the thicarbamide nitrogen atom of the neighboring complex. In this structure, the coordination polyhedron of the central atom is an elongated tetragonal bipyramid. It is established that complexes I-III at a concentration of 10{sup -5} mol/l selectively inhibit the growth of 60 to 90 percent of the cancer tumor cells of the human myeloid leukemia (HL-60).

A review of the fundamental studies of the copper activation mechanisms for selective flotation of the sulfide minerals, sphalerite and pyrite.

Science.gov (United States)

Chandra, A P; Gerson, A R

2009-01-30

A review of the considerable, but often contradictory, literature examining the specific surface reactions associated with copper adsorption onto the common metal sulfide minerals sphalerite, (Zn,Fe)S, and pyrite (FeS(2)), and the effect of the co-location of the two minerals is presented. Copper "activation", involving the surface adsorption of copper species from solution onto mineral surfaces to activate the surface for hydrophobic collector attachment, is an important step in the flotation and separation of minerals in an ore. Due to the complexity of metal sulfide mineral containing systems this activation process and the emergence of activation products on the mineral surfaces are not fully understood for most sulfide minerals even after decades of research. Factors such as copper concentration, activation time, pH, surface charge, extent of pre-oxidation, water and surface contaminants, pulp potential and galvanic interactions are important factors affecting copper activation of sphalerite and pyrite. A high pH, the correct reagent concentration and activation time and a short time delay between reagent additions is favourable for separation of sphalerite from pyrite. Sufficient oxidation potential is also needed (through O(2) conditioning) to maintain effective galvanic interactions between sphalerite and pyrite. This ensures pyrite is sufficiently depressed while sphalerite floats. Good water quality with low concentrations of contaminant ions, such as Pb(2+)and Fe(2+), is also needed to limit inadvertent activation and flotation of pyrite into zinc concentrates. Selectivity can further be increased and reagent use minimised by opting for inert grinding and by carefully choosing selective pyrite depressants such as sulfoxy or cyanide reagents. Studies that approximate plant conditions are essential for the development of better separation techniques and methodologies. Improved experimental approaches and surface sensitive techniques with high spatial

Effect of strontium tantalate surface texture on nickel nanoparticle dispersion by electroless deposition

Energy Technology Data Exchange (ETDEWEB)

Compean-González, C.L. [Universidad Autónoma de Nuevo León, Facultad de Ingeniería Civil, Departamento de Ecomateriales y Energía, Av. Universidad s/n, Ciudad Universitaria, San Nicolás de los Garza, Nuevo León C.P. 66451 (Mexico); Arredondo-Torres, V.M. [Facultad de Químico Farmacobiología, Universidad Michoacana de San Nicolás de Hidalgo, Tzintzuntzan #173, Col. Matamoros, Morelia, Michoacán C.P. 58240 (Mexico); Zarazúa-Morin, M.E. [Universidad Autónoma de Nuevo León, Facultad de Ingeniería Civil, Departamento de Ecomateriales y Energía, Av. Universidad s/n, Ciudad Universitaria, San Nicolás de los Garza, Nuevo León C.P. 66451 (Mexico); Figueroa-Torres, M.Z., E-mail: m.zyzlila@gmail.com [Universidad Autónoma de Nuevo León, Facultad de Ingeniería Civil, Departamento de Ecomateriales y Energía, Av. Universidad s/n, Ciudad Universitaria, San Nicolás de los Garza, Nuevo León C.P. 66451 (Mexico)

2015-09-15

Highlights: • Efficient short-time procedure for nickel nanoparticles dispersion by electroless. • Nanoparticles are spherical in shape with an average size of 15 nm. • Influence of surface texture on deposition temperature and time was observed. • Nickel deposition can be done below 50 °C. - Abstract: The present work studies the effect of smooth and porous texture of Sr{sub 2}Ta{sub 2}O{sub 7} on its surface modification with nickel nanoparticles through electroless deposition technique. The influence of temperature to control Ni nanoparticles loading amount and dispersion were analyzed. Nitrogen adsorption isotherms were used to examine surface texture characteristics. The morphology was observed by scanning electron microscopy (MEB) equipped with an energy dispersive spectrometry system (EDS), which was used to determine the amount of deposited Ni. The material with smooth texture (SMT) consists of big agglomerates of semispherical shape particles of 400 nm. Whilst the porous texture (PRT) exhibit a pore-wall formed of needles shape particles of around 200 nm in size. Results indicated that texture characteristics strongly influence the deposition reaction rate; for PRT oxide, Ni deposition can be done from 20 °C while for SMT oxide deposition begins at 40 °C. Analysis of Sr{sub 2}Ta{sub 2}O{sub 7} surface indicated that in both textures, Ni nanoparticles with spherical shape in the range of 10–20 nm were obtained.

Catalysts characteristics of Ni/YSZ core-shell according to plating conditions using electroless plating

Science.gov (United States)

Park, Hyun-Wook; Jang, Jae-Won; Lee, Young-Jin; Kim, Jin-Ho; Jeon, Dae-Woo; Lee, Jong-Heun; Hwang, Hae-jin; Lee, Mi-Jai

2017-11-01

This study aims to develop an anode catalyst for a solid oxide fuel cell (SOFC) using electroless nickel plating. We have proposed a new method for electroless plating of Ni metal on yttria-stabilized zirconia (YSZ) particles. We examine the uniformity of the Ni layer on the plated core-shell powder, in addition to the content of Ni and the reproducibility of the plating. We have also evaluated the carbon deposition rate and characteristics of the SOFC anode catalyst. To synthesize Ni-plated YSZ particles, the plated powder is heat-treated at 1200 °C. The resultant particles, which have an average size of 50 μm, were subsequently used in the experiment. The size of the Ni particles and the Ni content both increase with increasing plating temperature and plating time. The X-ray diffraction pattern reveals the growth of Ni particles. After heat-treatment, Ni is oxidized to NiO, leading to the co-existence of Ni and NiO; Ni3P is also observed due to the presence of phosphorous in the plating solution. Following heat treatment for 1 h at 1200 °C, Ni is mostly oxidized to NiO. The carbon deposition rate of the reference YSZ powder is 135%, while that of the Ni-plated YSZ is 1%-6%.

Green and selective synthesis of N-substituted amides using water soluble porphyrazinato copper(II) catalyst

Energy Technology Data Exchange (ETDEWEB)

Ghodsinia, Sara S.E.; Akhlaghinia, Batool; Eshghi, Hossein, E-mail: akhlaghinia@um.ac.ir [Ferdowsi University of Mashhad (Iran, Islamic Republic of). Faculty of Sciences. Department of Chemistry; Safaei, Elham [Institute for Advanced Studies in Basic Sciences (IASBS), Zanjan (Iran, Islamic Republic of). Department of Chemistry

2013-06-15

N, N',N{sup ,} N{sup '}-Tetramethyl tetra-2,3-pyridinoporphyrazinato copper(II) methyl sulfate ([Cu(2,3-tmtppa)](MeSO{sub 4}){sub 4}) efficiently catalyzed the direct conversion of nitriles to N-substituted amides. The one pot selective synthesis of the N-substituted amides from nitriles and primary amines was performed in refluxing H{sub 2}O. The catalyst was recovered and reused at least four times, maintaining its efficiency. (author)

Self-organized synthesis of silver dendritic nanostructures via an electroless metal deposition method

Science.gov (United States)

Qiu, T.; Wu, X. L.; Mei, Y. F.; Chu, P. K.; Siu, G. G.

2005-09-01

Unique silver dendritic nanostructures, with stems, branches, and leaves, were synthesized with self-organization via a simple electroless metal deposition method in a conventional autoclave containing aqueous HF and AgNO3 solution. Their growth mechanisms are discussed in detail on the basis of a self-assembled localized microscopic electrochemical cell model. A process of diffusion-limited aggregation is suggested for the formation of the silver dendritic nanostructures. This nanostructured material is of great potential to be building blocks for assembling mini-functional devices of the next generation.

Effects of TiN nanoparticles on the microstructure and properties of W–30Cu composites prepared via electroless plating and powder metallurgy

International Nuclear Information System (INIS)

Huang, Li-Mei; Luo, Lai-Ma; Zhao, Mei-Ling; Luo, Guang-Nan; Zhu, Xiao-Yong; Cheng, Ji-Gui; Zan, Xiang; Wu, Yu-Cheng

2015-01-01

Highlights: • TiN-doped W–Cu composite was successfully prepared by electroless plating and powder metallurgy. • TiN-doped W–Cu significantly affected the microstructure and properties of the composites. • W–Cu composite with 0.25 wt.% TiN possesses the best comprehensive performance. - Abstract: W–30Cu/(0, 0.25, 0.5, 1, and 2) wt.% TiN composites were prepared via electroless plating with simplified pretreatment and powder metallurgy. The phase and morphology of W–Cu/TiN composite powders and sintered W–Cu/TiN samples were characterized via X-ray diffraction and field emission scanning electron microscopy. Transmission electron microscopy was performed to characterize the microstructure of the sintered W–Cu/TiN samples. The relative density, hardness, electrical conductivity, and compressive strength of the sintered samples were examined. Results showed that W–30Cu composite powders with a uniform structure can be obtained using W powder pretreated with nitric acid, ammonium fluoride, and hydrofluoric acid followed by electroless Cu plating. The addition of TiN nanoparticles significantly affected the microstructure and properties of the W–30Cu composites. A good combination of the compressive strength and hardness of the W–30Cu composite material can be obtained by incorporating the TiN additive at 0.25 wt.%. However, the relative density and electrical conductivity slightly decreased

A Study of Protection of Copper Alloys

International Nuclear Information System (INIS)

Kim, E. A.; Kim, S. H.; Kim, C. R.

1974-01-01

Volatile treatment of high capacity boiler water with hydrazine and ammonia is studied. Ammonia comes from the decomposition of excess hydrazine injected to treat dissolved oxygen. Ammonia is also injected for the control of pH. To find an effect of such ammonia on the copper alloy, the relations between pH and iron, and ammonia and copper are studied. Since the dependence of corrosion of iron on pH differs from that of copper, a range of pH was selected experimentally to minimize the corrosion rates of both copper and iron. Corrosion rates of various copper alloys are also compared

XRD studies on solid state amorphisation in electroless Ni/P and Ni/B deposits

International Nuclear Information System (INIS)

Sampath Kumar, P.; Kesavan Nair, P.

1996-01-01

The decomposition of electroless Ni-P and Ni-B deposits on annealing at various temperature is studied using x-ray diffraction techniques employing profile deconvolution and line profile analysis. It appears that solid state amorphisation takes place in the Ni-B deposits in a narrow temperature range just prior to the onset of crystallization of amorphous phase. In the case of Ni-P deposits no evidence for solid state amorphisation could be obtained. Thermodynamic and kinetic considerations also support such a conclusion

Synthesis, characterization and application of electroless metal assisted silicon nanowire arrays

Energy Technology Data Exchange (ETDEWEB)

Sahoo, Sumanta Kumar [Centre for Nanoscience & Technology, Department of Mechanical Engineering, Mepco Schlenk Engineering College, Sivakasi 626 005, Tamilnadu (India); Marikani, Arumugam, E-mail: amari@mepcoeng.ac.in [Department of Physics, Mepco Schlenk Engineering College, Sivakasi 626 005, Tamilnadu (India)

2015-12-01

Highlights: • Preparation of Silicon nanowire arrays (SiNWs) by electroless metal deposition technique. • From analysis, it has been found that the as-prepared SiNWs are of 3.5–4.0 μm and 75 nm of length and diameter in average respectively. Further a characteristic Raman peak at 520 cm{sup −1} also has been observed. • It exhibits good electron field-emission properties with turn-on field (E{sub 0}) of about 8.26 V μm{sup −1} at current density (J) of 4.9 μA cm{sup −2}. • Functionalized SiNWs have been used for electrochemical detection bovine serum albumin protein bio-molecules. - Abstract: Vertically aligned silicon nanowire arrays (SiNWs) have been synthesized by electroless metal deposition process. The fabricated SiNWs have an average diameter of 75 nm and 3.5–4.0 μm length, as confirmed from scanning electron microscopy. A characteristic asymmetric peak broadening at 520 cm{sup −1} from Raman spectroscopy was obtained for the SiNWs as compared to the bulk silicon crystal due to phonon confinement. The as-prepared SiNWs exhibit good electron field-emission properties with turn-on field of about 8.26 V μm{sup −1} at a current density of 4.9 μA cm{sup −2}. The SiNWs was functionalized by coating with a thin gold metallic film for 60 s, and then used as bio-probe for the detection of bovine serum albumin (BSA) protein molecules. From the linear sweep voltammetry analysis, the Au coated SiNWs, exhibit linear response to the BSA analyte with increase in concentration. The minimum detection limit of the protein molecule was calculated of about 1.16 μM by the as-synthesized SiNWs probe.

Electroless preparation and characterization of Ni-B nanoparticles supported on multi-walled carbon nanotubes and their catalytic activity towards hydrogenation of styrene

Energy Technology Data Exchange (ETDEWEB)

Liu, Zheng; Li, Zhilin [State Key Laboratory of Chemical Resource Engineering, Beijing University of Chemical Technology, Beijing 100029 (China); Institute of Carbon Fibers and Composites, Beijing University of Chemical Technology, Beijing 100029 (China); Wang, Feng, E-mail: wangf@mail.buct.edu.cn [State Key Laboratory of Chemical Resource Engineering, Beijing University of Chemical Technology, Beijing 100029 (China); Institute of Carbon Fibers and Composites, Beijing University of Chemical Technology, Beijing 100029 (China); Liu, Jingjun; Ji, Jing [State Key Laboratory of Chemical Resource Engineering, Beijing University of Chemical Technology, Beijing 100029 (China); Institute of Carbon Fibers and Composites, Beijing University of Chemical Technology, Beijing 100029 (China); Park, Ki Chul [Institute of Carbon Science and Technology (ICST), Shinshu University, 4-17-1 Wakasato, Nagano-shi, Nagano 380-8553 (Japan); Endo, Morinobu [Department of Electrical and Electronic Engineering, Faculty of Engineering, Shinshu University, 4-17-1 Wakasato, Nagano-shi, Nagano 380-8553 (Japan)

2012-02-15

Graphical abstract: The MWCNT/Ni-B catalyst has been successfully prepared by an electroless deposition process. The Ni-B nanoparticles on the supporter are amorphous and are well-distributed. The catalytic conversion towards hydrogenation of styrene shows excellent catalytic activity of the obtained materials. Highlights: Black-Right-Pointing-Pointer A two-step treatment of MWCNTs enabled the homogeneous growth of Ni-B nanoparticles. Black-Right-Pointing-Pointer Ni-B nanoparticles were amorphous with an average size of 60 nm. Black-Right-Pointing-Pointer There were electron transfer between Ni and B. Black-Right-Pointing-Pointer The catalyst had excellent catalytic activity towards hydrogenation of styrene. -- Abstract: Nickel-boron (Ni-B) nanoparticles supported on multi-walled carbon nanotubes (MWCNTs) were successfully synthesized through an electroless deposition process using the plating bath with sodium borohydride as a reducing agent. The structural and morphological analyses using field-emission scanning electron microscopy, X-ray diffractometry and high-resolution transmission electron microscopy have shown that the Ni-B nanoparticles deposited on the sidewalls of MWCNTs are fine spheres comprised of amorphous structure with the morphologically unique fine-structure like flowers, and homogenously dispersed with a narrow particle size distribution centered at around 60 nm diameter. The catalytic activity of MWCNT/Ni-B nanoparticles was evaluated with respect to hydrogenation of styrene. The hydrogenation catalyzed by MWCNT-supported Ni-B nanoparticles has been found to make styrene selectively converted into ethylbenzene. The highest conversion reaches 99.8% under proper reaction conditions, which demonstrates the high catalytic activity of MWCNT/Ni-B nanoparticles.

Analytical application of solid contact ion-selective electrodes for determination of copper and nitrate in various food products and drinking water.

Science.gov (United States)

Wardak, Cecylia; Grabarczyk, Malgorzata

2016-08-02

A simple, fast and cheap method for monitoring copper and nitrate in drinking water and food products using newly developed solid contact ion-selective electrodes is proposed. Determination of copper and nitrate was performed by application of multiple standard additions technique. The reliability of the obtained results was assessed by comparing them using the anodic stripping voltammetry or spectrophotometry for the same samples. In each case, satisfactory agreement of the results was obtained, which confirms the analytical usefulness of the constructed electrodes.

Potentiodynamic studies of Ni-P-TiO2 nano-composited coating on the mild steel deposited by electroless plating method

Science.gov (United States)

Uttam, Vibha; Duchaniya, R. K.

2016-05-01

Now a days, corrosion studies are important for reducing the wastage of metals. The importance of corrosion studies is two folds i.e. first is economic, including the reduction of material losses resulting from the wasting away or sudden failure of materials and second is conservation Electroless process is an autocatalytic reduction method in which metallic ions are reduced in the solution. Nanocomposite coatings of Ni-P-TiO2 on mild steel are deposited by varying volume of TiO2 nano-powder by electroless method from Ni-P plating bath containing Nickel Sulphate as a source of nickel ions, sodium hypophosphite as the reducing agent, lactic acid as a complexing agents and TiO2 nano powder. Electroless Ni-P-TiO2 coating have been widely used in the chemical process industries, mechanical industries, electronic industries and chloroalkali industries due to their excellent corrosion with mechanical properties. In the present work, deposition of Ni-P alloy coating and Ni-P-TiO2 nanocomposited coatings were done on the mild steel and corrosion properties were studied with Potentio-dynamic polarization measurements method in 3.5 wt% sodium chloride solution. It showed in the experiments that Ni-P-TiO2 nanocomposited coating has better corrosion resistance as comparedthan Ni-P alloy coating. Morphological studies were done by field emission scanning electron microscopy (FESEM), energy-dispersive analysis of X-ray (EDAX) and X-ray diffraction (XRD). These studies confirmed the deposition of Ni-P alloy coating and Ni-P-TiO2 nanocomposited coating.

Copper-Multiwall Carbon Nanotubes and Copper-Diamond Composites for Advanced Rocket Engines

Science.gov (United States)

Bhat, Biliyar N.; Ellis, Dave L.; Smelyanskiy, Vadim; Foygel, Michael; Rape, Aaron; Singh, Jogender; Vohra, Yogesh K.; Thomas, Vinoy; Otte, Kyle G.; Li, Deyu

2013-01-01

This paper reports on the research effort to improve the thermal conductivity of the copper-based alloy NARloy-Z (Cu-3 wt.%Ag-0.5 wt.% Zr), the state-of-the-art alloy used to make combustion chamber liners in regeneratively-cooled liquid rocket engines, using nanotechnology. The approach was to embed high thermal conductivity multiwall carbon nanotubes (MWCNTs) and diamond (D) particles in the NARloy-Z matrix using powder metallurgy techniques. The thermal conductivity of MWCNTs and D have been reported to be 5 to 10 times that of NARloy-Z. Hence, 10 to 20 vol. % MWCNT finely dispersed in NARloy-Z matrix could nearly double the thermal conductivity, provided there is a good thermal bond between MWCNTs and copper matrix. Quantum mechanics-based modeling showed that zirconium (Zr) in NARloy-Z should form ZrC at the MWCNT-Cu interface and provide a good thermal bond. In this study, NARloy-Z powder was blended with MWCNTs in a ball mill, and the resulting mixture was consolidated under high pressure and temperature using Field Assisted Sintering Technology (FAST). Microstructural analysis showed that the MWCNTs, which were provided as tangles of MWCNTs by the manufacturer, did not detangle well during blending and formed clumps at the prior particle boundaries. The composites made form these powders showed lower thermal conductivity than the base NARloy-Z. To eliminate the observed physical agglomeration, tangled multiwall MWCNTs were separated by acid treatment and electroless plated with a thin layer of chromium to keep them separated during further processing. Separately, the thermal conductivities of MWCNTs used in this work were measured, and the results showed very low values, a major factor in the low thermal conductivity of the composite. On the other hand, D particles embedded in NARloy-Z matrix showed much improved thermal conductivity. Elemental analysis showed migration of Zr to the NARloy-Z-D interface to form ZrC, which appeared to provide a low contact

Copper Multiwall Carbon Nanotubes and Copper-Diamond Composites for Advanced Rocket Engines

Science.gov (United States)

Bhat, Biliyar N.; Ellis, Dave L.; Smelyanskiy, Vadim; Foygel, Michael; Singh, Jogender; Rape, Aaron; Vohra, Yogesh; Thomas, Vinoy; Li, Deyu; Otte, Kyle

2013-01-01

This paper reports on the research effort to improve the thermal conductivity of the copper-based alloy NARloy-Z (Cu-3 wt.%Ag-0.5 wt.% Zr), the state-of-the-art alloy used to make combustion chamber liners in regeneratively-cooled liquid rocket engines, using nanotechnology. The approach was to embed high thermal conductivity multiwall carbon nanotubes (MWCNTs) and diamond (D) particles in the NARloy-Z matrix using powder metallurgy techniques. The thermal conductivity of MWCNTs and D have been reported to be 5 to 10 times that of NARloy-Z. Hence, 10 to 20 vol. % MWCNT finely dispersed in NARloy-Z matrix could nearly double the thermal conductivity, provided there is a good thermal bond between MWCNTs and copper matrix. Quantum mechanics-based modeling showed that zirconium (Zr) in NARloy-Z should form ZrC at the MWCNT-Cu interface and provide a good thermal bond. In this study, NARloy-Z powder was blended with MWCNTs in a ball mill, and the resulting mixture was consolidated under high pressure and temperature using Field Assisted Sintering Technology (FAST). Microstructural analysis showed that the MWCNTs, which were provided as tangles of MWCNTs by the manufacturer, did not detangle well during blending and formed clumps at the prior particle boundaries. The composites made form these powders showed lower thermal conductivity than the base NARloy-Z. To eliminate the observed physical agglomeration, tangled multiwall MWCNTs were separated by acid treatment and electroless plated with a thin layer of chromium to keep them separated during further processing. Separately, the thermal conductivities of MWCNTs used in this work were measured, and the results showed very low values, a major factor in the low thermal conductivity of the composite. On the other hand, D particles embedded in NARloy-Z matrix showed much improved thermal conductivity. Elemental analysis showed migration of Zr to the NARloy-Z-D interface to form ZrC, which appeared to provide a low contact

Effect of hydrofluoric acid concentration on the evolution of photoluminescence characteristics in porous silicon nanowires prepared by Ag-assisted electroless etching method

KAUST Repository

Najar, Adel; Anjum, Dalaver H.; Hedhili, Mohamed N.; Ng, Tien Khee; Ooi, Boon S.; Ben Slimane, Ahmed; Sougrat, Rachid

2012-01-01

We report on the structural and optical properties of porous silicon nanowires (PSiNWs) fabricated using silver (Ag) ions assisted electroless etching method. Silicon nanocrystallites with sizes <5 nm embedded in amorphous silica have been

Molybdenum extraction from copper-molybdenum ores

International Nuclear Information System (INIS)

Nevaeva, L.M.

1982-01-01

Molybdenum extraction from copper-molybdenum ores as practised in different countries is reviewed. In world practice the production process including depression of copper and iron sulfides and flotation of molybdenite is widely spread. At two USA factories the process of a selective flotation with molybdenite depression by dextrin is used

Immunotoxicity of copper nanoparticle and copper sulfate in a common Indian earthworm.

Science.gov (United States)

Gautam, Arunodaya; Ray, Abhishek; Mukherjee, Soumalya; Das, Santanu; Pal, Kunal; Das, Subhadeep; Karmakar, Parimal; Ray, Mitali; Ray, Sajal

2018-02-01

Copper oxide nanoparticles and copper sulfate are established contaminants of water and soil. Metaphire posthuma is a common variety of earthworm distributed in moist soil of Indian subcontinent. Comparative toxicity of copper nanoparticles and copper sulfate were investigated with reference to selected immune associated parameters of earthworm. Total count, phagocytic response, generation of cytotoxic molecules (superoxide anion, nitric oxide), activities of enzymes like phenoloxidase, superoxide dismutase, catalase, acid phosphatase, alkaline phosphatase and total protein of coelomocytes were estimated under the exposures of 100, 500, 1000mg of copper oxide nanoparticles and copper sulfate per kg of soil for 7 and 14 d. A significant decrease in the total coelomocyte count were recorded with maximum depletion as 15.45 ± 2.2 and 12.5 ± 2 × 10 4 cells/ml under the treatment of 1000mg/kg of copper nanoparticles and copper sulfate for 14 d respectively. A significant decrease in generation of nitric oxide and activity of phenoloxidase were recorded upon exposure of both toxins for 7 and 14 d indicating possible decline in cytotoxic status of the organism. A maximum inhibition of superoxide dismutase activity was recorded as 0.083 ± 0.0039 and 0.055 ± 0.0057 unit/mg protein/minute against 1000mg/kg of copper nanoparticles and copper sulfate treatment for 14 d respectively. Activities of catalase and alkaline phosphatase were inhibited by all experimental concentrations of both toxins in the coelomocytes of earthworm. These toxins were recorded to be modifiers of the major immune associated parameters of M. posthuma. Unrestricted contamination of soil by sulfate and oxide nanoparticles of copper may lead to an undesirable shift in the innate immunological status of earthworm leading to a condition of immune compromisation and shrinkage in population density of this species in its natural habitat. This article is the first time report of immunological toxicity of

Moulded interconnect device fabrication by two shot molding and lasert induced selective activation

DEFF Research Database (Denmark)

Sun, Jie; Hansen, Hans Nørgaard

material combinations such as PEI (GE Ultem 1000) +PPO (GTX 810) and PEEK (Victrex 150GL30) +PPO (GTX 810) were investgated which can be selected electroless plating for metallization. Several plastics such as PC (GE Lexan 500R) and PEEK (Victrex 150GL30) were applied to the laser induced activation...

Electroless Ni-B plating on SiO2 with 3-aminopropyl-triethoxysilane as a barrier layer against Cu diffusion for through-Si via interconnections in a 3-dimensional multi-chip package

International Nuclear Information System (INIS)

Ikeda, Akihiro; Sakamoto, Atsushi; Hattori, Reiji; Kuroki, Yukinori

2009-01-01

Electroless Ni-B was plated on SiO 2 as a barrier layer against Cu diffusion for through-Si via (TSV) interconnections in a 3-dimensional multi-chip package. The electroless Ni-B was deposited on the entire area of the SiO 2 side wall of a deep via with vapor phase pre-deposition of 3-aminopropyl-triethoxysilane on the SiO 2 . The carrier lifetimes in the Si substrates plated with Ni-B/Cu did not decrease with an increase in annealing temperature up to 400 deg. C . The absence of degradation of carrier lifetimes indicates that Cu atoms did not diffuse into the Si through the Ni-B. The advantages of electroless Ni-B (good conformal deposition and forming an effective diffusion barrier against Cu) make it useful as a barrier layer for TSV interconnections in a 3-dimensional multi-chip package

Improved Plasticity of Ti-Based Bulk Metallic Glass at Room Temperature by Electroless Thin Nickel Coating

Directory of Open Access Journals (Sweden)

Xin Wang

2017-12-01

Full Text Available By restricting the dilated deformation, surface modification can stimulate multiple shear banding and improve the plasticity of bulk metallic glasses (BMGs. Aimed at modifying the surface of BMGs by thin layers, a crystalline Ni coating with ultrafine grains was coated on the surface of a Ti-based BMG by electroless plating. With a thickness of about 10 μm, the prepared thin coating could effectively limit the fast propagation of primary shear bands and stimulate the nucleation of multiple shear bands. As a result, the compression plasticity of the coated Ti-based BMG was improved to about 3.7% from near 0% of the non-coated BMG. Except for a small amount of Ni coating was adhered to the BMG substrate after fracture, most of the coatings were peeled off from the surface. It can be attributed to the abnormal growth of some coarse grains/particles in local region of the coating, which induces a large tensile stress at the interface between the coating and the BMG substrate. It is suggested that, for electroless nickel plating, improving the adhesive bonding strength between the coating and the substrate has a better geometric restriction effect than simply increasing the thickness of the coating.

Study on Selective Removal of Impurity Iron from Leached Copper-Bearing Solution Using a Chelating Resin

Directory of Open Access Journals (Sweden)

Yubiao Li

2016-10-01

Full Text Available In order to selectively remove iron from copper laden solution after leaching but prior to electrowinning, equilibrium, kinetic, and thermodynamic studies have been conducted on an a chelating resin of Rexp-501 at pH 1.0 and at various temperatures. Both Langmuir and Freundlich models were investigated, with the Langmuir model proving to be more suitable for fitting iron removal performance, with little influence from copper concentration. Compared with the pseudo first order kinetic model, the pseudo second order kinetic model fitted the dynamic adsorption process better, indicating a chemisorption mechanism. Fourier transform infrared spectroscopy (FT-IR results indicated that C=O from carbonyl group played a key role in combining with iron and can be regenerated and reused. However, the C=O of the acylamino group combining with iron was not able to be released after oxalic acid was applied.

Reduction of core loss in non-oriented (NO) electrical steel by electroless-plated magnetic coating

International Nuclear Information System (INIS)

Chivavibul, Pornthep; Enoki, Manabu; Konda, Shigeru; Inada, Yasushi; Tomizawa, Tamotsu; Toda, Akira

2011-01-01

An important issue in development of electrical steels for core-laminated products is to reduce core loss to improve energy conversion efficiency. This is usually obtained by tailoring the composition, microstructure, and texture of electrical steels themselves. A new technique to reduce core loss in electrical steel has been investigated. This technique involves electroless plating of magnetic thin coating onto the surface of electrical steel. The material system was electroless Ni-Co-P coatings with different thicknesses (1, 5, and 10 μm) deposited onto the surface of commercially available Fe-3% Si electrical steel. Characterization of deposited Ni-Co-P coating was carried out using X-ray diffraction (XRD), scanning electron microscope (SEM), and energy dispersive X-ray (EDX) spectrometer. The deposited Ni-Co-P coatings were amorphous and composed of 56-59% Ni, 32-35% Co, and 8-10% P by mass. The effect of coatings on core loss of the electrical steel was determined using single sheet test. A core loss reduction of 4% maximum was achieved with the Ni-Co-P coating of 1 μm thickness at 400 Hz and 0.3 T. - Research Highlights: → New approach to reduce core loss of electrical steel by magnetic coating. → Ni-Co-P coating influences core loss of NO electrical steel. → Core loss increases in RD direction but reduces in TD direction.

Diffusion barrier characteristics and shear fracture behaviors of eutectic PbSn solder/electroless Co(W,P) samples

International Nuclear Information System (INIS)

Pan, Hung-Chun; Hsieh, Tsung-Eong

2012-01-01

Highlights: ► Diffusion barrier features, activation energies of IMC growth and mechanical behaviors of electroless Co(W,P)/PbSn joints. ► Amorphous Co(W,P) is a sacrificial- plus stuffed-type barrier while polycrystalline Co(W,P) is a sacrificial-type barrier. ► Ductile mode dominates the failure of Co(W,P)/PbSn joints. ► Phosphorus content of Co(W,P) is crucial to the barrier capability and microstructure evolution at Co(W,P)/PbSn interface. ► Diffusion barrier capability is governed by the nature of chemical bonds, rather than the crystallinity of materials. - Abstract: Diffusion barrier characteristics, activation energy (E a ) of IMC growth and bonding properties of amorphous and polycrystalline electroless Co(W,P) (termed as α-Co(W,P) and poly-Co(W,P)) to eutectic PbSn solder are presented. Intermetallic compound (IMC) spallation and an nano-crystalline P-rich layer were observed in PbSn/α-Co(W,P) samples subjected to liquid-state aging at 250 °C. In contrast, IMCs resided on the P-rich layer in PbSn/α-Co(W,P) samples subjected to solid-state aging at 150 °C. Thick IMCs neighboring to an amorphous W-rich layer was seen in PbSn/poly-Co(W,P) samples regardless of the aging type. α-Co(W,P) was found to be a sacrificial- plus stuffed-type barrier while poly-Co(W,P) is mainly a sacrificial-type barrier. The values of E a 's for PbSn/α-Co(W,P) and PbSn/poly-Co(W,P) systems were 338.6 and 167.5 kJ/mol, respectively. Shear test revealed the ductile mode dominates the failure in both α- and poly-Co(W,P) samples. Analytical results indicated the high P content in electroless layer might enhance the barrier capability but degrade the bonding strength.

Microstructural Evolution and Mechanical Property Development of Selective Laser Melted Copper Alloys

Science.gov (United States)

Ventura, Anthony Patrick

Selective Laser Melting (SLM) is an additive manufacturing technology that utilizes a high-power laser to melt metal powder and form a part layer-by-layer. Over the last 25 years, the technology has progressed from prototyping polymer parts to full scale production of metal component. SLM offers several advantages over traditional manufacturing techniques; however, the current alloy systems that are researched and utilized for SLM do not address applications requiring high electrical and thermal conductivity. This work presents a characterization of the microstructural evolution and mechanical property development of two copper alloys fabricated via SLM and post-process heat treated to address this gap in knowledge. Tensile testing, conductivity measurement, and detailed microstructural characterization was carried out on samples in the as-printed and heat treated conditions. A single phase solid solution strengthened binary alloy, Cu-4.3Sn, was the first alloy studied. Components were selectively laser melted from pre-alloyed Cu-4.3Sn powder and heat treated at 873 K (600 °C) and 1173 K (900 °C) for 1 hour. As-printed samples were around 97 percent dense with a yield strength of 274 MPa, an electrical conductivity of 24.1 %IACS, and an elongation of 5.6%. Heat treatment resulted in lower yield strength with significant increases in ductility due to recrystallization and a decrease in dislocation density. Tensile sample geometry and surface finish also showed a significant effect on measured yield strength but a negligible change in measured ductility. Microstructural characterization indicated that grains primarily grow epitaxially with a sub-micron cellular solidification sub-structure. Nanometer scale tin dioxide particles identified via XRD were found throughout the structure in the tin-rich intercellular regions. The second alloy studied was a high-performance precipitation hardening Cu-Ni-Si alloy, C70250. Pre-alloyed powder was selectively laser melted to

Potentiodynamic studies of Ni-P-TiO{sub 2} nano-composited coating on the mild steel deposited by electroless plating method

Energy Technology Data Exchange (ETDEWEB)

Uttam, Vibha, E-mail: vibhauttam74@gmail.com; Duchaniya, R. K., E-mail: rkduchaniya.meta@mnit.ac.in [Department of Metallurgical and Materials Engineering, MNIT Jaipur (India)

2016-05-06

Now a days, corrosion studies are important for reducing the wastage of metals. The importance of corrosion studies is two folds i.e. first is economic, including the reduction of material losses resulting from the wasting away or sudden failure of materials and second is conservation Electroless process is an autocatalytic reduction method in which metallic ions are reduced in the solution. Nanocomposite coatings of Ni-P-TiO{sub 2} on mild steel are deposited by varying volume of TiO{sub 2} nano-powder by electroless method from Ni-P plating bath containing Nickel Sulphate as a source of nickel ions, sodium hypophosphite as the reducing agent, lactic acid as a complexing agents and TiO{sub 2} nano powder. Electroless Ni-P-TiO{sub 2} coating have been widely used in the chemical process industries, mechanical industries, electronic industries and chloroalkali industries due to their excellent corrosion with mechanical properties. In the present work, deposition of Ni-P alloy coating and Ni-P-TiO{sub 2} nanocomposited coatings were done on the mild steel and corrosion properties were studied with Potentio-dynamic polarization measurements method in 3.5 wt% sodium chloride solution. It showed in the experiments that Ni-P-TiO{sub 2} nanocomposited coating has better corrosion resistance as comparedthan Ni-P alloy coating. Morphological studies were done by field emission scanning electron microscopy (FESEM), energy–dispersive analysis of X-ray (EDAX) and X-ray diffraction (XRD). These studies confirmed the deposition of Ni-P alloy coating and Ni-P-TiO{sub 2} nanocomposited coating.

Qualitative assessment of selected areas of the world for undiscovered sediment-hosted stratabound copper deposits: Chapter Y in Global mineral resource assessment

Science.gov (United States)

Zientek, Michael L.; Wintzer, Niki E.; Hayes, Timothy S.; Parks, Heather L.; Briggs, Deborah A.; Causey, J. Douglas; Hatch, Shyla A.; Jenkins, M. Christopher; Williams, David J.; Zientek, Michael L.; Hammarstrom, Jane M.; Johnson, Kathleen M.

2015-12-14

A qualitative mineral resource assessment of sediment-hosted stratabound copper mineralized areas for undiscovered copper deposits was performed for 10 selected areas of the world. The areas, in alphabetical order, are (1) Belt-Purcell Basin, United States and Canada; (2) Benguela and Cuanza Basins, Angola; (3) Chuxiong Basin, China; (4) Dongchuan Group rocks, China; (5) Egypt–Israel–Jordan Rift, Egypt, Israel, and Jordan; (6) Maritimes Basin, Canada; (7) Neuquén Basin, Argentina; (8) Northwest Botswana Rift, Botswana and Namibia; (9) Redstone Copperbelt, Canada; and (10) Salta Rift System, Argentina. This assessment (1) outlines the main characteristics of the areas, (2) classifies known deposits by deposit model subtypes, and (3) ranks the areas according to their potential to contain undiscovered copper deposits.

Electromagnetic properties of core–shell particles by way of electroless Ni–Fe–P alloy plating on flake-shaped diatomite

Energy Technology Data Exchange (ETDEWEB)

Zhang, Deyuan [Bionic and Micro/Nano/Bio Manufacturing Technology Research Center, School of Mechanical Engineering and Automation, Beihang University, Beijing 100191 (China); Yuan, Liming, E-mail: lming_y@163.com [Bionic and Micro/Nano/Bio Manufacturing Technology Research Center, School of Mechanical Engineering and Automation, Beihang University, Beijing 100191 (China); Lan, Mingming; Hu, Yanyan; Cai, Jun [Bionic and Micro/Nano/Bio Manufacturing Technology Research Center, School of Mechanical Engineering and Automation, Beihang University, Beijing 100191 (China); Zhang, Wenqiang [College of Engineering, China Agricultural University, Beijing 100083 (China); Li, Haiyang [China Aerospace Science and Technology Corporation, Beijing 100854 (China)

2013-11-15

Flake-shaped diatomite particles coated by Ni–Fe–P alloy were prepared by electroless plating technique and processed by heat treatment. The samples were characterized by SEM, EDS and XRD. The results indicated that the magnetic diatomite particles had continuous and homogeneous Ni–Fe–P coating, and the phase constitution of the Ni–Fe–P coating was transformed from an amorphous structure to a crystalline structure during heat treatment. The measured electromagnetic parameters and the calculated reflection loss suggested that heat treatment was able to enhance the microwave absorption performance of the paraffin wax based composites. In a word, the Ni–Fe–P coated diatomite particle obtained in this paper is a promising candidate for lightweight microwave absorbing inclusions. - Highlights: • We used the flake-shaped diatomite particles as forming template to fabricate the core–shell ferromagnetic particles. • The diatomite particles were deposited Ni–Fe–P alloy by way of electroless plating methods. • The coated diatomite particles were lightweight ferromagnetic fillers. • The composites containing coated diatomite particles with heat treatment exhibited great potential in the field of electromagnetic absorbing.

Electromagnetic properties of core–shell particles by way of electroless Ni–Fe–P alloy plating on flake-shaped diatomite

International Nuclear Information System (INIS)

Zhang, Deyuan; Yuan, Liming; Lan, Mingming; Hu, Yanyan; Cai, Jun; Zhang, Wenqiang; Li, Haiyang

2013-01-01

Flake-shaped diatomite particles coated by Ni–Fe–P alloy were prepared by electroless plating technique and processed by heat treatment. The samples were characterized by SEM, EDS and XRD. The results indicated that the magnetic diatomite particles had continuous and homogeneous Ni–Fe–P coating, and the phase constitution of the Ni–Fe–P coating was transformed from an amorphous structure to a crystalline structure during heat treatment. The measured electromagnetic parameters and the calculated reflection loss suggested that heat treatment was able to enhance the microwave absorption performance of the paraffin wax based composites. In a word, the Ni–Fe–P coated diatomite particle obtained in this paper is a promising candidate for lightweight microwave absorbing inclusions. - Highlights: • We used the flake-shaped diatomite particles as forming template to fabricate the core–shell ferromagnetic particles. • The diatomite particles were deposited Ni–Fe–P alloy by way of electroless plating methods. • The coated diatomite particles were lightweight ferromagnetic fillers. • The composites containing coated diatomite particles with heat treatment exhibited great potential in the field of electromagnetic absorbing

Electroless nickel – phosphorus coating on crab shell particles and its characterization

Energy Technology Data Exchange (ETDEWEB)

Arulvel, S., E-mail: gs.arulvel.research@gmail.com; Elayaperumal, A.; Jagatheeshwaran, M.S.

2017-04-15

Being hydrophilic material, crab shell particles have only a limited number of applications. It is, therefore, necessary to modify the surface of the crab shell particles. To make them useful ever for the applications, the main theme we proposed in this article is to utilize crab shell particles (CSP) with the core coated with nickel phosphorus (NiP) as a shell using the electroless coating process. For dealing with serious environmental problems, utilization of waste bio-shells is always an important factor to be considered. Chelating ability of crab shell particles eliminates the surface activation in this work proceeding to the coating process. The functional group, phase structure, microstructure, chemical composition and thermal analysis of CSP and NiP/CSP were characterized using Fourier transform infra-red spectroscopy (FTIR), x-ray diffraction analyzer (XRD), scanning electron microscope (SEM), energy-dispersive x-ray spectroscopy (EDS), and thermogravimetric analysis (TGA). The combination of an amorphous and crystalline structure was exhibited by CSP and NiP/CSP. NiP/CSP has shown a better thermal stability when compared to uncoated CSP. Stability test, adsorption test, and conductivity test were conducted for the study of adsorption behavior and conductivity of the particles. CSP presented a hydrophilic property in contrast to hydrophobic NiP/CSP. NiP/CSP presented a conductivity of about 44% greater compared to the CSP without any fluctuations. - Highlights: • Utilization of crab shell waste is focused on. • NiP coating on crab shell particle is fabricated using electroless process. • Thermal analysis, stability test, adsorption test and conductivity test were done. • Organic matrix of crab shell particle favors the coating process. • Results demonstrate the characterization of CSP core – NiP shell structure.

Synthesis and application of a highly selective copper ions fluorescent probe based on the coumarin group

Science.gov (United States)

He, Guangjie; Liu, Xiangli; Xu, Jinhe; Ji, Liguo; Yang, Linlin; Fan, Aiying; Wang, Songjun; Wang, Qingzhi

2018-02-01

A highly selective copper ions fluorescent probe based on the coumarin-type Schiff base derivative 1 (probe) was produced by condensation reaction between coumarin carbohydrazide and 1H-indazole-3-carbaldehyde. The UV-vis spectroscopy showed that the maximum absorption peak of compound 1 appeared at 439 nm. In the presence of Cu2 + ions, the maximum peak decreased remarkably compared with other physiological important metal ions and a new absorption peak at 500 nm appeared. The job's plot experiments showed that complexes of 1:2 binding mode were formed in CH3CN:HEPES (3:2, v/v) solution. Compound 1 exhibited a strong blue fluorescence. Upon addition of copper ions, the fluorescence gradually decreased and reached a plateau with the fluorescence quenching rate up to 98.73%. The detection limit for Cu2 + ions was estimated to 0.384 ppm. Fluorescent microscopy experiments demonstrated that probe 1 had potential to be used to investigate biological processes involving Cu2 + ions within living cells.

Selective extraction of copper, mercury, silver and palladium ionsfrom water using hydrophobic ionic liquids.

Energy Technology Data Exchange (ETDEWEB)

Papaiconomou, Nicolas; Lee, Jong-Min; Salminen, Justin; VonStosch, Moritz; Prausnitz, John M.

2007-06-25

Extraction of dilute metal ions from water was performed near room temperature with a variety of ionic liquids. Distribution coefficients are reported for fourteen metal ions extracted with ionic liquids containing cations 1-octyl-4-methylpyridinium [4MOPYR]{sup +}, 1-methyl-1-octylpyrrolidinium [MOPYRRO]{sup +} or 1-methyl-1-octylpiperidinium [MOPIP]{sup +}, and anions tetrafluoroborate [BF{sub 4}]{sup +}, trifluoromethyl sulfonate [TfO]{sup +} or nonafluorobutyl sulfonate [NfO]{sup +}. Ionic liquids containing octylpyridinium cations are very good for extracting mercury ions. However, other metal ions were not significantly extracted by any of these ionic liquids. Extractions were also performed with four new task-specific ionic liquids. Such liquids containing a disulfide functional group are efficient and selective for mercury and copper, whereas those containing a nitrile functional group are efficient and selective for silver and palladium.

Genetic variation of Lymnaea stagnalis tolerance to copper: A test of selection hypotheses and its relevance for ecological risk assessment.

Science.gov (United States)

Côte, Jessica; Bouétard, Anthony; Pronost, Yannick; Besnard, Anne-Laure; Coke, Maïra; Piquet, Fabien; Caquet, Thierry; Coutellec, Marie-Agnès

2015-10-01

The use of standardized monospecific testing to assess the ecological risk of chemicals implicitly relies on the strong assumption that intraspecific variation in sensitivity is negligible or irrelevant in this context. In this study, we investigated genetic variation in copper sensitivity of the freshwater snail Lymnaea stagnalis, using lineages stemming from eight natural populations or strains found to be genetically differentiated at neutral markers. Copper-induced mortality varied widely among populations, as did the estimated daily death rate and time to 50% mortality (LT50). Population genetic divergence in copper sensitivity was compared to neutral differentiation using the QST-FST approach. No evidence for homogenizing selection could be detected. This result demonstrates that species-level extrapolations from single population studies are highly unreliable. The study provides a simple example of how evolutionary principles could be incorporated into ecotoxicity testing in order to refine ecological risk assessment. Copyright © 2015 Elsevier Ltd. All rights reserved.

Tunable and selective conversion of 5-HMF to 2,5-furandimethanol and 2,5-dimethylfuran over copper-doped porous metal oxides

NARCIS (Netherlands)

Kumalaputri, Angela J; Bottari, Giovanni; Erne, Petra M; Heeres, Hero J; Barta, Katalin

Tunable and selective hydrogenation of the platform chemical 5-hydroxymethylfurfural into valuable C-6 building blocks and liquid fuel additives is achieved with copper-doped porous metal oxides in ethanol. A new catalyst composition with improved hydrogenation/hydrogenolysis activity is obtained by

Environmentally benign electroless nickel plating using supercritical carbon-dioxide on hydrophilically modified acrylonitrile-butadiene-styrene

Science.gov (United States)

Tengsuwan, Siwach; Ohshima, Masahiro

2014-08-01

Electroless Ni-P plating using supercritical carbon dioxide (scCO2) in conjunction with copolymer-based hydrophilic modification was applied to an acrylonitrile-butadiene-styrene (ABS) substrate. The surface of ABS substrate was hydrophilically modified by blending with a multi-block copolymer, poly(ether-ester-amide)s (PEEA), in injection molding process. The substrate was then impregnated with Pd(II)-hexafluoroacetylacetonate, Pd(hfa)2, using scCO2, followed by the electroless plating reaction. ABS/PEEA substrates with different PEEA to ABS blend ratios and different volume ratios of butadiene to the styrene-acrylonitrile copolymer (SAN) matrix were prepared to investigate how the dispersed PEEA and butadiene domains affected the blend morphology and the adhesive strength of the plating metal-to-polymer contact. Increasing the PEEA copolymer to ABS blend ratio increased the mass transfer rate of the plating solution in the ABS substrate. Consequently, the metal-polymer composite layer became thicker, which increased the adhesive strength of the metal-to-polymer contact because of the anchoring effect. The butadiene domains appeared to attract the Pd catalyst precursor, and thus, the proportion of butadiene in the ABS matrix also affected the adhesive strength of the contact between the metal layer and the substrate. The ABS substrate was successfully plated with a Ni-P metal layer with an average adhesive strength of 9.1 ± 0.5 N cm-1 by choosing appropriate ABS/PEEA blend ratios and a Pd(hfa)2 concentration.

Thermal conductivity of glass copper-composite

International Nuclear Information System (INIS)

Kinoshita, Makoto; Terai, Ryohei; Haidai, Haruki

1980-01-01

Glass-metal composites are to be one of the answers for promoting thermal conduction in the glassy solids containing high-level radioactive wastes. In order to investigate the effect of metal addition on thermal conductivity of glasses, glass-copper composites were selected, and the conductivities of the composites were measured and discussed in regards to copper content and microstructure. Fully densified composites were successfully prepared by pressure sintering of the powder mixtures of glass and copper at temperatures above the yield points of the constituent glasses if the copper content was not so much. The conductivity was measured by means of a comparative method, in which the thermal gradient of the specimen was compared with that of quartz glass as standard under thermally steady state. Measurements were carried out at around 50 0 C. The thermal conductivity increased with increasing content of copper depending on the kind of copper powder used. The conductivities of the composites of the same copper content differed considerably each another. Fine copper powder was effective on increasing conductivity, and the conductivity became about threefold of that of glass by mixing the fine copper powder about 10 vol%. For the composites containing the fine copper powder less than 5 vol%, the conductivity obeyed so-called logarithmic rule, one of the mixture rules of conductivity, whereas for composites containing more than 5 vol%, the conductivity remarkably increased apart from the rule. This fact suggests that copper becomes continuous in the composite when the copper content increased beyond 5 vol%. For the composites containing coarse copper powder, the conductivity was increased not significantly, and obeyed an equation derived from the model in which conductive material dispersed in less conductive one. (author)

Copper hexacyanoferrate functionalized single-walled carbon nano-tubes for selective cesium extraction

International Nuclear Information System (INIS)

Draouil, H.; Alvarez, L.; Bantignies, J.L.; Causse, J.; Cambedouzou, J.; Flaud, V.; Zaibi, M.A.; Oueslati, M.

2017-01-01

Single-walled carbon nano-tubes (SWCNTs) are functionalized with copper hexacyanoferrate (CuHCF) nanoparticles to prepare solid substrates for sorption of cesium ions (Cs + ) from liquid outflows. The high mechanical resistance and large electrical conductivity of SWCNTs are associated with the ability of CuHCF nanoparticles to selectively complex Cs + ions in order to achieve membrane-like buckypapers presenting high loading capacity of cesium. The materials are thoroughly characterized using electron microscopy, Raman scattering, X-ray photoelectron spectroscopy and thermogravimetric analyses. Cs sorption isotherms are plotted after having measured the Cs + concentration by liquid phase ionic chromatography in the solution before and after exposure to the materials. It is found that the total sorption capacity of the material reaches 230 mg.g -1 , and that about one third of the sorbed Cs (80 mg.g -1 ) is selectively complexed in the CuHCF nanoparticles grafted on SWCNTs. The quantification of Cs + ions on different sorption sites is made for the first time, and the high sorption rates open interesting outlooks in the integration of such materials in devices for the controlled sorption and desorption of these ions. (authors)

Parameters Selection for Electropolishing Process of Products Made of Copper and Its Alloys

Directory of Open Access Journals (Sweden)

Maciąg T.

2017-09-01

Full Text Available Electropolishing is electrochemical method used in metal working that has a vital role in production of medical apparatus, in food or electric industry. The purpose of this paper is to determine optimal current parameters and time required for conducting electropolishing process from the perspective of changes of surface microgeometry. Furthermore, effect of different types of mechanical working used before electropolishing on final surface state was evaluated by observation in changes of topography. Research was conducted on electrolytic copper and brass. Analysis of surface geometry and its parameters (Ra, Sa was used as criterion describing efficiency of chemical electropolishing. Results of the experiment allow for current parameter optimization of electrochemical polishing process for selected non-ferrous alloys with preliminary mechanical preparation of the surface.

Use of cation selective membrane and acid addition for PH control in two-dimensional electrokinetic remediation of copper

Energy Technology Data Exchange (ETDEWEB)

Chan, M.S.M.; Lynch, R.J. [Cambridge Univ., Engineering Dept. (United Kingdom); Ilett, D.J. [AEA Technology, Harwell, Oxfordshire (United Kingdom)

2001-07-01

The feasibility of using a combination of a cation selective membrane and acid addition for pH control in electrokinetic remediation to toxic and heavy metals from low-permeability soil has been investigated. The high pH generated during the remediation process, as a result of surplus OH{sup -} ions, may cause metal ions to precipitate as hydroxides at or near the cathodes. This region of high pH is known to be associated with high electrical resistance, which limits the remediation efficiency by inhibiting current flow through the soil. One way to control pH is by adding acid to neutralize the OH{sup -} ions. However, preliminary work showed that addition of acid to the cathodic region was not effective in preventing the spread of the alkaline zone from cathodes toward anodes. Precipitates were formed before metal ions reached the cathodic region. Therefore, another method of pH control was investigated, using a cation selective membrane to enhance the electrokinetic process. The membrane was placed in front of the cathodes to contain the OH{sup -} ions generated, and confine the precipitates of metal hydroxide to a small cathodic region. The clean-up of a contaminated site was modelled in a rectangular tank, using silt as the low permeability soul and copper to simulate the contamination. The objective was to redistribute the contaminant so as to concentrate it into a small area. Three experiments were performed with the following methods of pH control: (1) acid addition, (2) use of a cation selective membrane and (3) a combination of acid addition and a cation selective membrane. Using the combined approach, it was found that 75% of the target clean-up section (bounded by the cation selective membrane and the anodes) had more than 40% of the initial copper removed. The general efficiency of remediation increased in the following order. (orig.)

Comparative study of electroless Co-Ni-P plating on Tencel fabric by Co0-based and Ni0-based activation for electromagnetic interference shielding

Science.gov (United States)

Bi, Siyi; Zhao, Hang; Hou, Lei; Lu, Yinxiang

2017-10-01

The primary objective of this research work was to develop high-performance conductive fabrics with desired electromagnetic interference (EMI) shielding effectiveness (SE), excellent durability and improved corrosion resistance. Such conductive fabrics were fabricated by combining an ultra-low-cost electroless plating method with an alkoxy silane self-assembly technology, which involved successive steps of modification, activation, Co-Ni-P coating deposition and 3-aminopropyltrimethoxysilane (APTMS) thin coatings assembling. Malic acid (MA) was selected to modify the pristine Tencel (TS) substrates, and the probably interaction mechanism was investigated by FT-IR measurement. Co0 and Ni0 nanoparticles (NPs) were used as the activators to initiate electroless plating, respectively, and thereby two categories of Co-Ni-P coatings with different Co/Ni atomic ratio were obtained. Both of them presented compact morphologies and preferential (1 1 1) crystal orientation, which were validated by FE-SEM and XRD measurements. Owing to the lower square resistance and higher magnetic properties, the Co-Ni-P coated fabric activated by Co0 activator showed a higher EMI SE (18.2-40.1 dB) at frequency of 30-1000 MHz. APTMS thin coatings were then assembled on the top of alloy coated fabrics to act as anti-corrosion barriers. Electrochemical polarization measurement in 3.5 wt.% NaCl solution showed that top-APTMS coated conductive fabric exhibited a higher corrosion resistance than the one in absence of APTMS assembly. Overall, the whole process of fabrication could be performed in several hours (or less) without any specialized equipment, which shows a great potential as EMI shielding fabrics in mass-production.

Antimicrobial Properties of Selected Copper Alloys on Staphylococcus aureus and Escherichia coli in Different Simulations of Environmental Conditions: With vs. without Organic Contamination.

Science.gov (United States)

Różańska, Anna; Chmielarczyk, Agnieszka; Romaniszyn, Dorota; Sroka-Oleksiak, Agnieszka; Bulanda, Małgorzata; Walkowicz, Monika; Osuch, Piotr; Knych, Tadeusz

2017-07-20

Background: Hospital equipment made from copper alloys can play an important role in complementing traditional methods of disinfection. Aims of the study: The aim of this study was to assess the dynamics of the antimicrobial properties of selected copper alloys in different simulations of environmental conditions (with organic contamination vs. without organic contamination), and to test alternatives to the currently used testing methods. Materials and Methods: A modification of Japanese standard JIS Z 2801 as well as Staphylococcus aureus (SA) and Escherichia coli (EC) suspended in NaCl vs. tryptic soy broth (TSB) were used in tests performed on seven commonly used copper alloys, copper, and stainless steel. Results: A much faster reduction of the bacterial suspension was observed for the inoculum prepared in NaCl than in TSB. A faster reduction for EC than for SA was observed in the inoculum prepared in NaCl. The opposite results were found for the inoculum based on TSB. A significant correlation between the copper concentration in the copper alloys and the time and degree of bacterial suspension reduction was only observed in the case of EC. Conclusions: This study confirmed the antimicrobial properties of copper alloys, and additionally showed that Staphylococcus aureus was more resistant than Escherichia coli in the variant of the experiment without organic contamination. However, even for SA, a total reduction of the bacterial inoculum's density took no longer than 2 h. Under conditions simulating organic contamination, all of the tested alloys were shown to have bactericidal or bacteriostatic properties, which was contrary to the results from stainless steel.

Copper Tolerance and Biosorption of Saccharomyces cerevisiae during Alcoholic Fermentation

Science.gov (United States)

Liu, Ling-ling; Jia, Bo; Zhao, Fang; Huang, Wei-dong; Zhan, Ji-cheng

2015-01-01

At high levels, copper in grape mash can inhibit yeast activity and cause stuck fermentations. Wine yeast has limited tolerance of copper and can reduce copper levels in wine during fermentation. This study aimed to understand copper tolerance of wine yeast and establish the mechanism by which yeast decreases copper in the must during fermentation. Three strains of Saccharomyces cerevisiae (lab selected strain BH8 and industrial strains AWRI R2 and Freddo) and a simple model fermentation system containing 0 to 1.50 mM Cu2+ were used. ICP-AES determined Cu ion concentration in the must decreasing differently by strains and initial copper levels during fermentation. Fermentation performance was heavily inhibited under copper stress, paralleled a decrease in viable cell numbers. Strain BH8 showed higher copper-tolerance than strain AWRI R2 and higher adsorption than Freddo. Yeast cell surface depression and intracellular structure deformation after copper treatment were observed by scanning electron microscopy and transmission electron microscopy; electronic differential system detected higher surface Cu and no intracellular Cu on 1.50 mM copper treated yeast cells. It is most probably that surface adsorption dominated the biosorption process of Cu2+ for strain BH8, with saturation being accomplished in 24 h. This study demonstrated that Saccharomyces cerevisiae strain BH8 has good tolerance and adsorption of Cu, and reduces Cu2+ concentrations during fermentation in simple model system mainly through surface adsorption. The results indicate that the strain selected from China’s stress-tolerant wine grape is copper tolerant and can reduce copper in must when fermenting in a copper rich simple model system, and provided information for studies on mechanisms of heavy metal stress. PMID:26030864

Copper Tolerance and Biosorption of Saccharomyces cerevisiae during Alcoholic Fermentation.

Directory of Open Access Journals (Sweden)

Xiang-Yu Sun

Full Text Available At high levels, copper in grape mash can inhibit yeast activity and cause stuck fermentations. Wine yeast has limited tolerance of copper and can reduce copper levels in wine during fermentation. This study aimed to understand copper tolerance of wine yeast and establish the mechanism by which yeast decreases copper in the must during fermentation. Three strains of Saccharomyces cerevisiae (lab selected strain BH8 and industrial strains AWRI R2 and Freddo and a simple model fermentation system containing 0 to 1.50 mM Cu2+ were used. ICP-AES determined Cu ion concentration in the must decreasing differently by strains and initial copper levels during fermentation. Fermentation performance was heavily inhibited under copper stress, paralleled a decrease in viable cell numbers. Strain BH8 showed higher copper-tolerance than strain AWRI R2 and higher adsorption than Freddo. Yeast cell surface depression and intracellular structure deformation after copper treatment were observed by scanning electron microscopy and transmission electron microscopy; electronic differential system detected higher surface Cu and no intracellular Cu on 1.50 mM copper treated yeast cells. It is most probably that surface adsorption dominated the biosorption process of Cu2+ for strain BH8, with saturation being accomplished in 24 h. This study demonstrated that Saccharomyces cerevisiae strain BH8 has good tolerance and adsorption of Cu, and reduces Cu2+ concentrations during fermentation in simple model system mainly through surface adsorption. The results indicate that the strain selected from China's stress-tolerant wine grape is copper tolerant and can reduce copper in must when fermenting in a copper rich simple model system, and provided information for studies on mechanisms of heavy metal stress.

Electroless silver plating of the surface of organic semiconductors.

Science.gov (United States)

Campione, Marcello; Parravicini, Matteo; Moret, Massimo; Papagni, Antonio; Schröter, Bernd; Fritz, Torsten

2011-10-04

The integration of nanoscale processes and devices demands fabrication routes involving rapid, cost-effective steps, preferably carried out under ambient conditions. The realization of the metal/organic semiconductor interface is one of the most demanding steps of device fabrication, since it requires mechanical and/or thermal treatments which increment costs and are often harmful in respect to the active layer. Here, we provide a microscopic analysis of a room temperature, electroless process aimed at the deposition of a nanostructured metallic silver layer with controlled coverage atop the surface of single crystals and thin films of organic semiconductors. This process relies on the reaction of aqueous AgF solutions with the nonwettable crystalline surface of donor-type organic semiconductors. It is observed that the formation of a uniform layer of silver nanoparticles can be accomplished within 20 min contact time. The electrical characterization of two-terminal devices performed before and after the aforementioned treatment shows that the metal deposition process is associated with a redox reaction causing the p-doping of the semiconductor. © 2011 American Chemical Society

Synthesis, optical properties and residual strain effect of GaN nanowires generated via metal-assisted photochemical electroless etching

KAUST Repository

Najar, Adel

2017-04-18

Herein, we report on the studies of GaN nanowires (GaN NWs) prepared via a metal-assisted photochemical electroless etching method with Pt as the catalyst. It has been found that etching time greatly influences the growth of GaN NWs. The density and the length of nanowires increased with longer etching time, and excellent substrate coverage was observed. The average nanowire width and length are around 35 nm and 10 μm, respectively. Transmission electron microscopy (TEM) shows a single-crystalline wurtzite structure and is confirmed by X-ray measurements. The synthesis mechanism of GaN NWs using the metal-assisted photochemical electroless etching method was presented. Photoluminescence (PL) measurements of GaN NWs show red-shift PL peaks compared to the as-grown sample associated with the relaxation of compressive stress. Furthermore, a shift of the E2 peak to the lower frequency in the Raman spectra for the samples etched for a longer time confirms such a stress relaxation. Based on Raman measurements, the compressive stress σxx and the residual strain εxx were evaluated to be 0.23 GPa and 2.6 × 10−4, respectively. GaN NW synthesis using a low cost method might be used for the fabrication of power optoelectronic devices and gas sensors.

Copper nanoparticle ensembles for selective electroreduction of CO2 to C2–C3 products

Science.gov (United States)

Kley, Christopher S.; Li, Yifan; Yang, Peidong

2017-01-01

Direct conversion of carbon dioxide to multicarbon products remains as a grand challenge in electrochemical CO2 reduction. Various forms of oxidized copper have been demonstrated as electrocatalysts that still require large overpotentials. Here, we show that an ensemble of Cu nanoparticles (NPs) enables selective formation of C2–C3 products at low overpotentials. Densely packed Cu NP ensembles underwent structural transformation during electrolysis into electrocatalytically active cube-like particles intermixed with smaller nanoparticles. Ethylene, ethanol, and n-propanol are the major C2–C3 products with onset potential at −0.53 V (vs. reversible hydrogen electrode, RHE) and C2–C3 faradaic efficiency (FE) reaching 50% at only −0.75 V. Thus, the catalyst exhibits selective generation of C2–C3 hydrocarbons and oxygenates at considerably lowered overpotentials in neutral pH aqueous media. In addition, this approach suggests new opportunities in realizing multicarbon product formation from CO2, where the majority of efforts has been to use oxidized copper-based materials. Robust catalytic performance is demonstrated by 10 h of stable operation with C2–C3 current density 10 mA/cm2 (at −0.75 V), rendering it attractive for solar-to-fuel applications. Tafel analysis suggests reductive CO coupling as a rate determining step for C2 products, while n-propanol (C3) production seems to have a discrete pathway. PMID:28923930

Tribological characteristics of electroless Ni–P–MoS2 composite coatings at elevated temperatures

International Nuclear Information System (INIS)

Li Zhen; Wang Jingbo; Lu Jinjun; Meng Junhu

2013-01-01

Highlights: ► Uniform Ni–P–MoS 2 composite coatings are deposited by electroless plating. ► Friction coefficient of composite coating decreases with the increase of temperature. ► Formation of lubricious oxide film leads to excellent tribological property. - Abstract: Ni–P–MoS 2 composite coatings were deposited on AISI-1045 steel plate by electroless plating followed by a heat treatment at 300 °C for 2 h. The high-temperature tribological characteristics of the composite coatings were evaluated under dry sliding conditions in a tribometer with ball-on-disk configuration. The effect of the co-deposition of MoS 2 on the friction and wear behaviors of composite coatings at elevated temperature was investigated. Scanning electron microscopy was used to determine the morphology of the worn surface of composite coating. The chemical states of some typical elements on the worn surfaces were determined by X-ray photoelectron spectroscope. The results indicate that friction coefficient of the composite coatings decreases with the increase of test temperature up to 500 °C, and the best tribological properties of Ni–P–MoS 2 composite coatings are achieved at 400 °C. The worn surface of Ni–P–MoS 2 composite coatings are characterized by mild scuffing and deformation. The improvement of tribological properties of the composite coatings was attributed to the formation of the lubricious oxide film composed of oxides of Ni and Mo at high temperatures. With the test temperature increasing to 600 °C, the tribological properties of the composite coating begin to deteriorate due to softening of the coating.

The removal of hydrogen sulfide from gas streams using an aqueous metal sulfate absorbent : Part II. the regeneration of copper sulfide to copper oxide - An experimental study

NARCIS (Netherlands)

Ter Maat, H.; Hogendoorn, J. A.; Versteeg, G. F.

2005-01-01

Aim of this study was to investigate the possibilities for a selective and efficient method to convert copper(II) sulfide (CuS) into copper(II) oxide (CuO). The oxidation of copper sulfide has been studied experimentally using a thermogravimetric analyzer (TGA) at temperatures ranging from 450 to

Thermodynamic data for copper. Implications for the corrosion of copper under repository conditions

International Nuclear Information System (INIS)

Puigdomenech, I.; Taxen, C.

2000-08-01

The stability of copper canisters has a central role in the safety concept for the planned nuclear spent fuel repository in Sweden. The corrosion of copper canisters will be influenced by the chemical and physical environment in the near-field of the repository, and thermodynamic equilibrium calculations provide the basis for understanding this system. Thermodynamic data have been selected in this work for solids and aqueous species in the system: Cu - H 2 O - H + - H 2 - F - - Cl - - S 2- - SO 4 2- - NO 3 - - NO 2 - - NH 4 + PO 4 3- - CO 3 2+ . For some reactions and compounds, for which no experimental information on temperature effects was available, entropy and heat capacity values have been estimated. The compiled data were used to calculate thermodynamic equilibria for copper systems up to 100 deg C. The stability of copper in contact with granitic groundwaters has been illustrated using chemical equilibrium diagrams, with he following main conclusions: Dissolved sulphide and O 2 in groundwater are the most damaging components for copper corrosion. If available, HS - will react quantitatively with copper to form a variety of sulphides. However, sulphide concentrations in natural waters are usually low, because it forms sparingly soluble solids with transition metals, including Fe(II), which is wide-spread in reducing environments. Chloride can affect negatively copper corrosion. High concentrations (e.g., [Cl - ]TOT > 60 g/l) may be unfavourable for the general corrosion of copper in combination with in the following circumstances: Low pH ( + . The negative effects of Cl - are emphasised at higher temperatures. The chloride-enhancement of general corrosion may be beneficial for localised corrosion: pitting and stress corrosion cracking. The concept of redox potential, E H , has been found to be inadequate to describe copper corrosion in a nuclear repository. The available amounts of oxidants/reductants, and the stoichiometry of the corrosion reactions are

Copper hazards to fish, wildlife and invertebrates: a synoptic review

Science.gov (United States)

Eisler, Ronald

1998-01-01

Selective review and synthesis of the technical literature on copper and copper salts in the environment and their effects primarily on fishes, birds, mammals, terrestrial and aquatic invertebrates, and other natural resources. The subtopics include copper sources and uses; chemical and biochemical properties; concentrations of copper in field collections of abiotic materials and living organisms; effects of copper deficiency; lethal and sublethal effects on terrestrial plants and invertebrates, aquatic organisms, birds and mammals, including effects on survival, growth, reproduction, behavior, metabolism, carcinogenicity, matagenicity, and teratogenicity; proposed criteria for the protection of human health and sensitive natural resources; and recommendations for additional research.

Catalytic selective reduction of NO with ethylene over a series of copper catalysts on amorphous silicas

International Nuclear Information System (INIS)

Carniti, P.; Gervasini, A.; Modica, V.H.; Ravasio, N.

2000-01-01

Catalytic selective reduction of NO to N 2 was studied comparing a series of Cu-based catalysts (ca. 8wt.%) supported over amorphous pure and modified silicas: SiO 2 , SiO 2 -Al 2 O 3 , SiO 2 -TiO 2 , SiO 2 -ZrO 2 . The catalysts were prepared by the chemisorption-hydrolysis method which ensured the formation of a unique copper phase well dispersed over all supports, as confirmed by scanning electron micrographs (SEMs). Temperature-programmed reduction (TPR) analyses confirmed the presence of dispersed copper species which underwent complete reduction at a temperature of about 220C, independently of the support. It was found that the support affects the extent of NO reduction as well as the selectivity to N 2 formation. Maximum N 2 yield was found in the range 275-300C. The catalyst prepared over SiO 2 -Al 2 O 3 was the most active and selective with respect to the other silicas. Competitiveness factors (c.f.'s) as high as 13-20% in the temperature range 200-250C could be calculated. For all catalysts, the temperature of the N 2 peak maximum did not correspond to that of the maximum C 2 H 4 oxidation to CO 2 , suggesting the presence of two different sites for the oxidation and the reduction activity. On the catalyst prepared on SiO 2 -Al 2 O 3 , a kinetic interpretation of catalytic data collected at different contact times and temperatures permitted evaluating the ratio between kinetic coefficients as well as the difference between activation energies of NO reduction by C 2 H 4 and C 2 H 4 oxidation by O 2

REMOVAL OF COPPER ELECTROLYTE CONTAMINANTS BY ADSORPTION

Directory of Open Access Journals (Sweden)

B Gabai

1997-09-01

Full Text Available Abstract - Selective adsorbents have become frequently used in industrial processes. Recent studies have shown the possibility of using adsorption to separate copper refinery electrolyte contaminants, with better results than those obtained with conventional techniques. During copper electrorefinning, many impurities may be found as dissolved metals present in the anode slime which forms on the electrode surface, accumulated in the electrolyte or incorporated into the refined copper on the cathode by deposition. In this study, synthetic zeolites, chelating resins and activated carbons were tested as adsorbents to select the best adsorbent performance, as well as the best operating temperature for the process. The experimental method applied was the finite bath, which consists in bringing the adsorbent into contact with a finite volume of electrolyte while controlling the temperature. The concentration of metals in the liquid phase was continuously monitored by atomic absorption spectrophotometry (AAS

Quantitative Determination of NTA and Other Chelating Agents in Detergents by Potentiometric Titration with Copper Ion Selective Electrode.

Science.gov (United States)

Ito, Sana; Morita, Masaki

2016-01-01

Quantitative analysis of nitrilotriacetate (NTA) in detergents by titration with Cu 2+ solution using a copper ion selective electrode was achieved. This method tolerates a wide range of pH and ingredients in detergents. In addition to NTA, other chelating agents, having relatively lower stability constants toward Cu 2+ , were also qualified with sufficient accuracy by this analytical method for model detergent formulations. The titration process was automated by automatic titrating systems available commercially.

Supersonic copper clusters

International Nuclear Information System (INIS)

Powers, D.E.; Hansen, S.G.; Geusic, M.E.; Michalopoulos, D.L.; Smalley, R.E.

1983-01-01

Copper clusters ranging in size from 1 to 29 atoms have been prepared in a supersonic beam by laser vaporization of a rotating copper target rod within the throat of a pulsed supersonic nozzle using helium for the carrier gas. The clusters were cooled extensively in the supersonic expansion [T(translational) 1 to 4 K, T(rotational) = 4 K, T(vibrational) = 20 to 70 K]. These clusters were detected in the supersonic beam by laser photoionization with time-of-flight mass analysis. Using a number of fixed frequency outputs of an exciplex laser, the threshold behavior of the photoionization cross section was monitored as a function of cluster size.nce two-photon ionization (R2PI) with mass selective detection allowed the detection of five new electronic band systems in the region between 2690 and 3200 A, for each of the three naturally occurring isotopic forms of Cu 2 . In the process of scanning the R2PI spectrum of these new electronic states, the ionization potential of the copper dimer was determined to be 7.894 +- 0.015 eV

Photostructured coating on a voltage degrader for a Time Projection Chamber (TPC)

CERN Document Server

Manaranche, C; Loquet, J L; Serdiouk, V; Scandurra, M; Zucchelli, P

2002-01-01

Fibreglass-reinforced epoxy (Stesalit) tubes and rods were coated with a photostructured metal layer system of copper, nickel and gold for a voltage degrader built in a particle detector at CERN, Geneva. The metal layers were applied with galvanotechnical processes involving an original photolithographic exposure in three dimensions to produce a complex electrical circuit design able to provide the correct potential to 420 different conductors. The Stesalit substrate material, even after a first layer of electroless copper, is electrically quite resistive, creating problems for the electrodeposition of the subsequent nickel layer. A mathematical simulation of the plating thickness distribution showed that the electrolytic nickel deposition was suitable for short rods but electroless nickel was needed for the long rods. The functional properties of the metallized Stesalit components are satisfactory: no degradation of the gas quality within the Time Projection Chamber is observed; the potential distribution al...

Copper content in blood of Uzbek population

International Nuclear Information System (INIS)

Mikhol'skaya, I.N.; Agzamova, S.S.; Kutyakova, T.Yu.; Osinskaya, N.S.

1990-01-01

The content of copper in blood of Uzbekistan population, depending on place of residence, sex and age was studied to solve certain medicobiological problems. The method of neutron activation with radiochemcial isolation was employed for the analysis. According to the data obtained average content of copper for the points in the republic selected for men and women of different age groups were calculated. 5 refs

Antimicrobial Properties of Selected Copper Alloys on Staphylococcus aureus and Escherichia coli in Different Simulations of Environmental Conditions: With vs. without Organic Contamination

Directory of Open Access Journals (Sweden)

Anna Różańska

2017-07-01

Full Text Available Background: Hospital equipment made from copper alloys can play an important role in complementing traditional methods of disinfection. Aims of the study: The aim of this study was to assess the dynamics of the antimicrobial properties of selected copper alloys in different simulations of environmental conditions (with organic contamination vs. without organic contamination, and to test alternatives to the currently used testing methods. Materials and Methods: A modification of Japanese standard JIS Z 2801 as well as Staphylococcus aureus (SA and Escherichia coli (EC suspended in NaCl vs. tryptic soy broth (TSB were used in tests performed on seven commonly used copper alloys, copper, and stainless steel. Results: A much faster reduction of the bacterial suspension was observed for the inoculum prepared in NaCl than in TSB. A faster reduction for EC than for SA was observed in the inoculum prepared in NaCl. The opposite results were found for the inoculum based on TSB. A significant correlation between the copper concentration in the copper alloys and the time and degree of bacterial suspension reduction was only observed in the case of EC. Conclusions: This study confirmed the antimicrobial properties of copper alloys, and additionally showed that Staphylococcus aureus was more resistant than Escherichia coli in the variant of the experiment without organic contamination. However, even for SA, a total reduction of the bacterial inoculum’s density took no longer than 2 h. Under conditions simulating organic contamination, all of the tested alloys were shown to have bactericidal or bacteriostatic properties, which was contrary to the results from stainless steel.

Development of Nano-Particles Within Polymeric Materials Prepared by Gamma Radiation and their Possible Practical Applications

Energy Technology Data Exchange (ETDEWEB)

Hegazy, E. S.A.; Ali, A. E.; AbdEl-Rehim, H.; Mohammady, M.; Abdel Aal, A. S. [National Center for Radiation Research and Technology, Atomic Energy Authority, Cairo (Egypt)

2009-07-01

Nanoparticles can be used in biomedical applications, where they facilitate laboratory diagnostics, or in medical drug targeting nanoparticles based on a core consisting of iron oxides that can be targeted through external magnets. Polyvinyl alcohol/Polyacrylic acid nanoparticles were prepared using gamma rays. The prepared PVA/AAc nano copolymers were treated with Fe{sup 2+}/ Fe{sup 3+} solution followed by ammonia solution to obtain PVA/AAc-Fe{sub 3}O{sub 4} nanoparticle ferrogel. Characterization of the PVA/AAc-Fe{sub 3}O{sub 4} nanoparticle ferrogel was carried out using XRD, TGA, DSc , TEM and AFM. The use of magnetic field sensitive nano-ferrogels as a drug carrier was investigated. It was found that the release of drug in absence of the effect of magnetic field is mostly slow than that under the influence of magnetic field. On the other hand, development of nanoparticles within radiation grafted polymeric surfaces using electroless plating technique was investigated. Surface modification of polypropylene films (PP) was carried out via radiation induced graft copolymerization of 4-vinyl pyridine (4VP) and acrylamide (AAm) to enhance the adhesion ability of the PP surface for electroless deposition of copper. The produced grafted films were characterized by studying their FTIR and thermal stability. The prepared grafted films were copper-plated by electroless deposition using the Pd as a catalyst to initiate the redox reaction. The influences of catalytic activation method parameters on the plating rate have been studied. The electrical characteristics of the copper plated films in comparison with grafted films were studied. The results showed the high adhesion of the deposited copper film to the grafted PP film as well as high electrical conductivity. (author)

Preparation of single-crystal copper ferrite nanorods and nanodisks

International Nuclear Information System (INIS)

Du Jimin; Liu Zhimin; Wu Weize; Li Zhonghao; Han Buxing; Huang Ying

2005-01-01

This article, for the first time, reports the preparation of single-crystal copper ferrite nanorods and nanodisks. Using amorphous copper ferrite nanoparticles synthesized by reverse micelle as reaction precursor, single-crystal copper ferrite nanorods were synthesized via hydrothermal method in the presence of surfactant polyethylene glycol (PEG), however, copper ferrite nanodisks were prepared through the same procedures except the surfactant PEG. The resulting nanomaterials have been characterized by powder X-ray diffraction (XRD), selected electron area diffraction (SEAD), and transmission electron microscopy (TEM). The bulk composition of the samples was determined by means of X-ray photoelectron spectroscopy (XPS)

Direct electroplating of plastic for advanced electrical applications

DEFF Research Database (Denmark)

Islam, Aminul; Hansen, Hans Nørgaard; Tang, Peter Torben

2017-01-01

Electrodeposition or electroplating is predominantly applied to metallic components. Electroplating of plastics is possible in some cases where an initial electroless plating layer of nickel or copper is made to provide a conductive surface on the plastic part. This paper proposes a method...... for direct electroplating of plastic eliminating the need for slow and expensive processes like electroless metal deposition, PVD coating, painting with conductive inks etc. The results obtained from the test demonstrate the potential of direct electroplating of plastic to enhance the electrical conductivity...... and the use of electroplated plastics for advanced applications like Moulded Interconnect Devices (MIDs)....

Copper and Copper Proteins in Parkinson's Disease

Science.gov (United States)

Rivera-Mancia, Susana; Diaz-Ruiz, Araceli; Tristan-Lopez, Luis; Rios, Camilo

2014-01-01

Copper is a transition metal that has been linked to pathological and beneficial effects in neurodegenerative diseases. In Parkinson's disease, free copper is related to increased oxidative stress, alpha-synuclein oligomerization, and Lewy body formation. Decreased copper along with increased iron has been found in substantia nigra and caudate nucleus of Parkinson's disease patients. Copper influences iron content in the brain through ferroxidase ceruloplasmin activity; therefore decreased protein-bound copper in brain may enhance iron accumulation and the associated oxidative stress. The function of other copper-binding proteins such as Cu/Zn-SOD and metallothioneins is also beneficial to prevent neurodegeneration. Copper may regulate neurotransmission since it is released after neuronal stimulus and the metal is able to modulate the function of NMDA and GABA A receptors. Some of the proteins involved in copper transport are the transporters CTR1, ATP7A, and ATP7B and the chaperone ATOX1. There is limited information about the role of those biomolecules in the pathophysiology of Parkinson's disease; for instance, it is known that CTR1 is decreased in substantia nigra pars compacta in Parkinson's disease and that a mutation in ATP7B could be associated with Parkinson's disease. Regarding copper-related therapies, copper supplementation can represent a plausible alternative, while copper chelation may even aggravate the pathology. PMID:24672633

The effects of copper oxy chloride waste contamination on selected soil biochemical properties at disposal site

International Nuclear Information System (INIS)

Masaka, J.; Muunganirwa, M.

2007-01-01

A study was carried out at a sanitary waste disposal site for Kutsaga Tobacco Research Station, Zimbabwe, which uses large amounts of copper oxy chloride for sterilization of recycled float trays in flooded bench tobacco seedling production systems. Soil samples randomly collected from six stream bank zones (bands up the valley slope) varying in their distance ranges from the centre of both the wastewater-free and wastewater-affected paths [0-5 m (B1); 6-10 m (B2); 11-15 m (B3); 16-20 m (B4); 21-25 m (B5) and 26-30 m (B6)] in two sample depths (0-15; 15-30 cm) were analysed for metal copper, organic matter contents, and soil pH and subjected to agarized incubation for microbial counts. Results suggest that the repeated disposals of copper oxy chloride waste from tobacco float tray sanitation sinks into a creek amplify metal copper loads in the soil by 500 fold. The greatest concentrations of copper in both the topsoil and upper subsoil were recorded in the B3, B4 and B5 stream bank zones of the wastewater path. The concentration of copper was significantly lower in the middle of the waste-affected creek than that in the stream bank zones. This trend in the copper concentration coincided with the lowest acidity of the soil. Overloading the soil with copper, surprisingly, enhances the content of soil organic matter. The repeated release of copper oxy chloride waste into a stream causes an accelerated build-up of metal copper and soil acidity in the stream bank on-site while contamination is translocated to either underground water reserve or surface stream water flow in the middle of the wastewater path

Separation of copper-64 from copper phthalocyanine

International Nuclear Information System (INIS)

Battaglin, R.I.M.

1979-01-01

The separation of copper-64 from irradiated copper phthalocyanine by Szilard-Chalmers effect is studied. Two methods of separation are used: one of them is based on the dissolution of the irradiated dry compound in concentrated sulfuric acid following its precipitation in water. In the other one the compound is irradiated with water in paste form following treatment with water and hydrochloric acid. The influence of the crystal form of the copper phthalocyanine on the separation yield of copper-64 is shown. Preliminary tests using the ionic exchange technique for purification and changing of copper-64 sulfate to chloride form are carried out. The specific activity using the spectrophotometric technique, after the determination of the copper concentration in solution of copper-64, is calculated. (Author) [pt

Methods of making copper selenium precursor compositions with a targeted copper selenide content and precursor compositions and thin films resulting therefrom

Science.gov (United States)

Curtis, Calvin J [Lakewood, CO; Miedaner, Alexander [Boulder, CO; van Hest, Marinus Franciscus Antonius Maria; Ginley, David S [Evergreen, CO; Leisch, Jennifer [Denver, CO; Taylor, Matthew [West Simsbury, CT; Stanbery, Billy J [Austin, TX

2011-09-20

Precursor compositions containing copper and selenium suitable for deposition on a substrate to form thin films suitable for semi-conductor applications. Methods of forming the precursor compositions using primary amine solvents and methods of forming the thin films wherein the selection of temperature and duration of heating controls the formation of a targeted species of copper selenide.

Ultrasonic preparation of nano-nickel/activated carbon composite using spent electroless nickel plating bath and application in degradation of 2,6-dichlorophenol.

Science.gov (United States)

Su, Jingyu; Jin, Guanping; Li, Changyong; Zhu, Xiaohui; Dou, Yan; Li, Yong; Wang, Xin; Wang, Kunwei; Gu, Qianqian

2014-11-01

Ni was effectively recovered from spent electroless nickel (EN) plating baths by forming a nano-nickel coated activated carbon composite. With the aid of ultrasonication, melamine-formaldehyde-tetraoxalyl-ethylenediamine chelating resins were grafted on activated carbon (MFT/AC). PdCl2 sol was adsorbed on MFT/AC, which was then immersed in spent electroless nickel plating bath; then nano-nickel could be reduced by ascorbic acid to form a nano-nickel coating on the activated carbon composite (Ni/AC) in situ. The materials present were carefully examined by Fourier transform infrared spectroscopy, X-ray diffraction, field emission scanning electron microscopy, X-ray photoelectron spectroscopy and electrochemistry techniques. The resins were well distributed on the inside and outside surfaces of activated carbon with a size of 120 ± 30 nm in MFT/AC, and a great deal of nano-nickel particles were evenly deposited with a size of 3.8 ± 1.1 nm in Ni/MFT. Moreover, Ni/AC was successfully used as a catalyst for ultrasonic degradation of 2,6-dichlorophenol. Copyright © 2014. Published by Elsevier B.V.

Preparation and structure of carbon encapsulated copper nanoparticles

International Nuclear Information System (INIS)

Hao Chuncheng; Xiao Feng; Cui Zuolin

2008-01-01

Carbon-encapsulated copper nanoparticles were synthesized by a modified arc plasma method using methane as carbon source. The particles were characterized in detail by transmission electron microscope, high-resolution transmission electron microscopy, selected-area electron diffraction, X-ray diffraction, thermogravimetric and differential scanning calorimetry. The encapsulated copper nanoparticles were about 30 nm in diameter with 3-5 nm graphitic carbon shells. The outside graphitic carbon layers effectively prevented unwanted oxidation of the copper inside. The effect of the ratio of He/CH 4 on the morphologies and the formation of the carbon shell were investigated

Fabrication of Stretchable Copper Coated Carbon Nanotube Conductor for Non-Enzymatic Glucose Detection Electrode with Low Detection Limit and Selectivity

Directory of Open Access Journals (Sweden)

Dawei Jiang

2018-03-01

Full Text Available The increasing demand for wearable glucose sensing has stimulated growing interest in stretchable electrodes. The development of the electrode materials having large stretchability, low detection limit, and good selectivity is the key component for constructing high performance wearable glucose sensors. In this work, we presented fabrication of stretchable conductor based on the copper coated carbon nanotube sheath-core fiber, and its application as non-enzymatic electrode for glucose detection with high stretchability, low detection limit, and selectivity. The sheath-core fiber was fabricated by coating copper coated carbon nanotube on a pre-stretched rubber fiber core followed by release of pre-stretch, which had a hierarchically buckled structure. It showed a small resistance change as low as 27% as strain increasing from 0% to 500% strain, and a low resistance of 0.4 Ω·cm−1 at strain of 500%. This electrode showed linear glucose concentration detection in the range between 0.05 mM and 5 mM and good selectivity against sucrose, lactic acid, uric acid, acrylic acid in phosphate buffer saline solution, and showed stable signal in high salt concentration. The limit of detection (LOD was 0.05 mM, for the range of 0.05–5 mM, the sensitivity is 46 mA·M−1. This electrode can withstand large strain of up to 60% with negligible influence on its performance.

Study of Nickel Silicide as a Copper Diffusion Barrier in Monocrystalline Silicon Solar Cells

Energy Technology Data Exchange (ETDEWEB)

Kale, Abhijit; Beese, Emily; Saenz, Theresa; Warren, Emily; Nemeth, William; Young, David; Marshall, Alexander; Florent, Karine; Kurinec, Santosh K.; Agarwal, Sumit; Stradins, Pauls

2016-11-21

NiSi as a conductive diffusion barrier to silicon has been studied. We demonstrate that the NiSi films formed using the single step annealing process are as good as the two step process using XRD and Raman. Quality of NiSi films formed using e-beam Ni and electroless Ni process has been compared. Incomplete surface coverage and presence of constituents other than Ni are the main challenges with electroless Ni. We also demonstrate that Cu reduces the thermal stability of NiSi films. The detection of Cu has proven to be difficult due to temperature limitations.

Electroless Ni-B plating for electrical contact applications

Directory of Open Access Journals (Sweden)

Dervos, C. T.

2005-12-01

Full Text Available Electroless Ni-B plating has been tried on steel substrate in an effort to employ low-cost starting materials for electrical contacts or connectors. By selected conditions of heat treatment in a high vacuum environment the plating can acquire Cr-equivalent hardness without the effluents of the hard chromium plating process. The surfaces were characterized under scanning electron microscope and by XRD. The fabricated materials were tested under corrosion conditions by polarization measurements. Semispherical nickel plated steel joints were tested in a computer controlled contact make-break apparatus, under simultaneous application of a mechanical and a low-voltage electrical load for 20,000 cycles. After heat treatment the plating acquires a crystalline structure with very good adhesion to the substrate material. Corrosion decreases and increased hardness is obtained. The surface is also characterized by good electrical properties during aging accelerated tests.

Se ha investigado la deposición de Ni-B por vía química sobre un substrato de acero, con el fin de poder emplear materiales de bajo coste para los contactos o conectores eléctricos. Mediante condiciones específicas de tratamiento térmico en un ambiente de alto vacío, la deposición puede alcanzar durezas equivalentes al cromo (Cr sin los efluentes del proceso de cromado duro. Las superficies se caracterizaron en el microscopio electrónico de barrido y mediante DRX. Los materiales fabricados se ensayaron bajo condiciones de corrosión utilizando mediciones de polarización. Se ensayaron las juntas semiesféricas de acero niquelado en un equipo de contactos controlado por ordenador bajo la aplicación simultánea de una carga mecánica y de una carga eléctrica de bajo voltaje durante 20.000 ciclos. Después del tratamiento térmico, el recubrimiento adquiere una estructura cristalina con muy buena adherencia al material del substrato. Se consigue una menor corrosión y mayor

Thermodynamic data for copper. Implications for the corrosion of copper under repository conditions

Energy Technology Data Exchange (ETDEWEB)

Puigdomenech, I. [Royal Inst. of Tech., Stockholm (Sweden); Taxen, C. [Swedish Corrosion Inst., Stockholm (Sweden)

2000-08-01

The stability of copper canisters has a central role in the safety concept for the planned nuclear spent fuel repository in Sweden. The corrosion of copper canisters will be influenced by the chemical and physical environment in the near-field of the repository, and thermodynamic equilibrium calculations provide the basis for understanding this system. Thermodynamic data have been selected in this work for solids and aqueous species in the system: Cu - H{sub 2}O - H{sup +} - H{sub 2} - F{sup -} - Cl{sup -} - S{sup 2-} - SO{sub 4}{sup 2-} - NO{sub 3}{sup -} - NO{sub 2}{sup -} - NH{sub 4}{sup +} PO{sub 4}{sup 3-} - CO{sub 3}{sup 2+} . For some reactions and compounds, for which no experimental information on temperature effects was available, entropy and heat capacity values have been estimated. The compiled data were used to calculate thermodynamic equilibria for copper systems up to 100 deg C. The stability of copper in contact with granitic groundwaters has been illustrated using chemical equilibrium diagrams, with he following main conclusions: Dissolved sulphide and O{sub 2} in groundwater are the most damaging components for copper corrosion. If available, HS{sup -} will react quantitatively with copper to form a variety of sulphides. However, sulphide concentrations in natural waters are usually low, because it forms sparingly soluble solids with transition metals, including Fe(II), which is wide-spread in reducing environments. Chloride can affect negatively copper corrosion. High concentrations (e.g., [Cl{sup -}]TOT > 60 g/l) may be unfavourable for the general corrosion of copper in combination with in the following circumstances: Low pH (< 4 at 25 deg C, or < 5 at 100 deg C). The presence of other oxidants than H{sup +}. The negative effects of Cl{sup -} are emphasised at higher temperatures. The chloride-enhancement of general corrosion may be beneficial for localised corrosion: pitting and stress corrosion cracking. The concept of redox potential, E

Electroless deposition and nanolithography can control the formation of materials at the nano-scale for plasmonic applications

KAUST Repository

Coluccio, Maria Laura; Gentile, Francesco; Francardi, Marco; Perozziello, Gerardo; Malara, Natalia; Candeloro, Patrizio; Di Fabrizio, Enzo M.

2014-01-01

The new revolution in materials science is being driven by our ability to manipulate matter at the molecular level to create structures with novel functions and properties. The aim of this paper is to explore new strategies to obtain plasmonic metal nanostructures through the combination of a top down method, that is electron beam lithography, and a bottom up technique, that is the chemical electroless deposition. This technique allows a tight control over the shape and size of bi- and three-dimensional metal patterns at the nano scale. The resulting nanostructures can be used as constituents of Surface Enhanced Raman Spectroscopy (SERS) substrates, where the electromagnetic field is strongly amplified. Our results indicate that, in electroless growth, high quality metal nanostructures with sizes below 50 nm may be easily obtained. These findings were explained within the framework of a diffusion limited aggregation (DLA) model, that is a simulation model that makes it possible to decipher, at an atomic level, the rules governing the evolution of the growth front; moreover, we give a description of the physical echanisms of growth at a basic level. In the discussion, we show how these findings can be utilized to fabricate dimers of silver nanospheres where the size and shape of those spheres is controlled with extreme precision and can be used for very large area SERS substrates and nano-optics, for single molecule detection. 2014 by the authors; licensee MDPI, Basel, Switzerland.

Electroless deposition and nanolithography can control the formation of materials at the nano-scale for plasmonic applications

KAUST Repository

Coluccio, Maria Laura

2014-03-27

The new revolution in materials science is being driven by our ability to manipulate matter at the molecular level to create structures with novel functions and properties. The aim of this paper is to explore new strategies to obtain plasmonic metal nanostructures through the combination of a top down method, that is electron beam lithography, and a bottom up technique, that is the chemical electroless deposition. This technique allows a tight control over the shape and size of bi- and three-dimensional metal patterns at the nano scale. The resulting nanostructures can be used as constituents of Surface Enhanced Raman Spectroscopy (SERS) substrates, where the electromagnetic field is strongly amplified. Our results indicate that, in electroless growth, high quality metal nanostructures with sizes below 50 nm may be easily obtained. These findings were explained within the framework of a diffusion limited aggregation (DLA) model, that is a simulation model that makes it possible to decipher, at an atomic level, the rules governing the evolution of the growth front; moreover, we give a description of the physical echanisms of growth at a basic level. In the discussion, we show how these findings can be utilized to fabricate dimers of silver nanospheres where the size and shape of those spheres is controlled with extreme precision and can be used for very large area SERS substrates and nano-optics, for single molecule detection. 2014 by the authors; licensee MDPI, Basel, Switzerland.

Electroless Deposition and Nanolithography Can Control the Formation of Materials at the Nano-Scale for Plasmonic Applications

Directory of Open Access Journals (Sweden)

Maria Laura Coluccio

2014-03-01

Full Text Available The new revolution in materials science is being driven by our ability to manipulate matter at the molecular level to create structures with novel functions and properties. The aim of this paper is to explore new strategies to obtain plasmonic metal nanostructures through the combination of a top down method, that is electron beam lithography, and a bottom up technique, that is the chemical electroless deposition. This technique allows a tight control over the shape and size of bi- and three-dimensional metal patterns at the nano scale. The resulting nanostructures can be used as constituents of Surface Enhanced Raman Spectroscopy (SERS substrates, where the electromagnetic field is strongly amplified. Our results indicate that, in electroless growth, high quality metal nanostructures with sizes below 50 nm may be easily obtained. These findings were explained within the framework of a diffusion limited aggregation (DLA model, that is a simulation model that makes it possible to decipher, at an atomic level, the rules governing the evolution of the growth front; moreover, we give a description of the physical mechanisms of growth at a basic level. In the discussion, we show how these findings can be utilized to fabricate dimers of silver nanospheres where the size and shape of those spheres is controlled with extreme precision and can be used for very large area SERS substrates and nano-optics, for single molecule detection.

Anodic photodissolution of n-InP, under electroless conditions

International Nuclear Information System (INIS)

Debiemme-Chouvy, Catherine; Quennoy, Anne

2004-01-01

In the presence of α-SiMo 12 O 40 4- ions dissolved in acidic solution and under laser irradiation, the electroless photoetching of n-type InP is achieved. At the laser impact, the semiconductor is oxidized while SiMo 12 O 40 4- species are reduced. The shape of the pit formed, due to the photoanodic dissolution of the material, depends on the experimental conditions, notably on the presence or not of Cl - ions in the medium. It can have either a Gaussian shape or a flat bottom. To specify the charge transfer which occurs at the n-InP/solution illuminated interface, some electrochemical studies were performed on n- and p-type InP electrodes. In fact, the reduction of SiMo 12 O 40 4- ions occurs by capture of electrons from the InP conduction band. Considering the energetic situation at the InP/electrolyte interface and some electrochemical results, it is concluded that the electron transfer from InP to SiMo 12 is mediated by surface states. The influence of Cl - ions on the n-InP photodissolution process is also discussed

Electroless synthesis of 3 nm wide alloy nanowires inside Tobacco mosaic virus

International Nuclear Information System (INIS)

Balci, Sinan; Kern, Klaus; Bittner, Alexander M; Hahn, Kersten; Kopold, Peter; Kadri, Anan; Wege, Christina

2012-01-01

We show that 3 nm wide cobalt–iron alloy nanowires can be synthesized by simple wet chemical electroless deposition inside tubular Tobacco mosaic virus particles. The method is based on adsorption of Pd(II) ions, formation of a Pd catalyst, and autocatalytic deposition of the alloy from dissolved metal salts, reduced by a borane compound. Extensive energy-filtering TEM investigations at the nanoscale revealed that the synthesized wires are alloys of Co, Fe, and Ni. We confirmed by high-resolution TEM that our alloy nanowires are at least partially crystalline, which is compatible with typical Co-rich alloys. Ni traces bestow higher stability, presumably against corrosion, as also known from bulk CoFe. Alloy nanowires, as small as the ones presented here, might be used for a variety of applications including high density data storage, imaging, sensing, and even drug delivery. (paper)

Search of a plant hiperacumuladora of copper

International Nuclear Information System (INIS)

Hernandez Colorado, R.R.

2003-01-01

The objective of this investigation was to find inside the flora of Costa Rica, a plant copper hiperacumuladora. Once identified the species, you would proceed to cultivate it in vitro, stops later to make experiments of copper absorption in vitro. If the selected species was capable of hiperacumular the metal, the influence of the agents quelantes sour etilendiaminotetraacetico would be investigated (EDTA) and citric acid, in the absorption of the metal. To carry out the investigation, vegetable species were collected inside the banana property Probana located in Limon and inside a coffee plantation in Carrizal de Alajuela. The dried vegetable samples were analyzed the copper content and in the same way, with collected floor samples of the surrounding area to the plants. As satisfactory results were not obtained, the species Tagetes foetidissima and Coccosypselum hirsutum were selected. The first one was selected with base in their metabolism, which allowed to synthesize sulfurated compounds. The second were selected with base in the available information in the literature about the aluminum hiperacumulation on the part of species belonging to the family Rubiaceae, to which it belongs. The species T. foetidissima and C. hirsutum, were cultivated in vitro stops later to make experiments of copper absorption. The results obtained starting from the experiments of copper absorption for T. foetidissima were of 3626 - 7402 mg kg -1 it has more than enough it bases dry, for an environment of concentration of the metal in the means of cultivation of 20-30 mg L -1 for a lapse of fifteen days. For this species an environment of accumulation of 4251 was obtained - 6481 mg kg -1 it has more than enough it bases dry, to 20 mg L -1 of the metal, when adding him EDTA to an experimentation group and citric acid to another. In the case of C. hirsutum, hiperacumulo gets paid in concentrations of 7648 - 8786 mg kg -1 it has more than enough it bases dry, for an environment of

Copper and copper-nickel alloys as zebra mussel antifoulants

Energy Technology Data Exchange (ETDEWEB)

Dormon, J.M.; Cottrell, C.M.; Allen, D.G.; Ackerman, J.D.; Spelt, J.K. [Univ. of Toronto, Ontario (Canada)

1996-04-01

Copper has been used in the marine environment for decades as cladding on ships and pipes to prevent biofouling by marine mussels (Mytilus edulis L.). This motivated the present investigation into the possibility of using copper to prevent biofouling in freshwater by both zebra mussels and quagga mussels (Dreissena polymorpha and D. bugensis collectively referred to as zebra mussels). Copper and copper alloy sheet proved to be highly effective in preventing biofouling by zebra mussels over a three-year period. Further studies were conducted with copper and copper-nickel mesh (lattice of expanded metal) and screen (woven wire with a smaller hole size), which reduced the amount of copper used. Copper screen was also found to be strongly biofouling-resistant with respect to zebra mussels, while copper mesh reduced zebra mussel biofouling in comparison to controls, but did not prevent it entirely. Preliminary investigations into the mechanism of copper antifouling, using galvanic couples, indicated that the release of copper ions from the surface of the exposed metal into the surrounding water is directly or indirectly responsible for the biofouling resistance of copper.

Gallium and copper radiopharmaceutical chemistry

International Nuclear Information System (INIS)

Green, M.A.; John, E.K.; Barnhart, A.J.

1990-01-01

Several isotopes of gallium and copper exhibit nuclear properties that make them attractive for applications in nuclear medicine, most notably Ga-67, Ga-68, Cu-67 and Cu-62. Of these, gamma-emitting Ga-67 has historically found the greatest clinical use, based on the observation that tracer gallium(III) citrate rapidly produces Ga-67 transferrin upon intravenous injection and then slowly affords selective Ga-67 localization in sites of abscess and certain tumors. Copper-67 has received attention as a potential label for tissue-selective monoclonal antibodies, since its associated γ-photons can be used for external imaging and its β - -emissions could be used for radiation therapy. Positron-emitting gallium-68 and copper-62, being available from parent/daughter generator systems, have attracted interest as potential labels for radiopharmaceuticals used in positron emission tomography (PET) because they could reduce the dependence of this imaging technology on hospital-based cyclotrons. The 10 min. half-life of Cu-62 is particularly well-suited to the time frame of PET studies of tissue perfusion, an application for which Cu(II)-bis(thiosemicarbazone) derivatives appear promising. The 68 min. half-life of Ga-68 makes it appropriate for PET studies over longer imaging time spans

Alkylsilyl Peroxides as Alkylating Agents in the Copper-Catalyzed Selective Mono-N-Alkylation of Primary Amides and Arylamines.

Science.gov (United States)

Sakamoto, Ryu; Sakurai, Shunya; Maruoka, Keiji

2017-07-06

The copper-catalyzed selective mono-N-alkylation of primary amides or arylamines using alkylsilyl peroxides as alkylating agents is reported. The reaction proceeds under mild reaction conditions and exhibits a broad substrate scope with respect to the alkylsilyl peroxides, as well as to the primary amides and arylamines. Mechanistic studies suggest that the present reaction should proceed through a free-radical process that includes alkyl radicals generated from the alkylsilyl peroxides. © 2017 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

Effectiveness acidic pre-cleaning for copper-gold ore

Directory of Open Access Journals (Sweden)

Antonio Clareti Pereira

Full Text Available Abstract The presence of copper-bearing minerals is known to bring on many challenges during the cyanidation of gold ore, like high consumption of cyanide and low extraction of metal, which are undesirable impacts on the auriferous recovery in the subsequent process step. The high copper solubility in cyanide prevents the direct use of classical hydrometallurgical processes for the extraction of gold by cyanidation. Additionally, the application of a conventional flotation process to extract copper is further complicated when it is oxidized. As a result, an acid pre-leaching process was applied in order to clean the ore of these copper minerals that are cyanide consumers. The objective was to evaluate the amount of soluble copper in cyanide before and after acidic cleaning. From a gold ore containing copper, the study selected four samples containing 0.22%, 0.55%, 1.00% and 1.36% of copper. For direct cyanidation of the ore without pre-treatment, copper extraction by cyanide complexing ranged from 8 to 83%. In contrast, the pre-treatment carried out with sulfuric acid extracted 24% to 99% of initial copper and subsequent cyanidation extracted 0.13 to 1.54% of initial copper. The study also showed that the copper contained in the secondary minerals is more easily extracted by cyanide (83%, being followed by the copper oxy-hydroxide minerals (60%, while the copper contained in the manganese oxide is less complexed by cyanide (8% a 12%. It was possible to observe that minerals with low acid solubility also have low solubility in cyanide. Cyanide consumption decreased by about 2.5 times and gold recovery increased to above 94% after acidic pre-cleaning.

Copper and Copper Proteins in Parkinson’s Disease

Directory of Open Access Journals (Sweden)

Sergio Montes

2014-01-01

Full Text Available Copper is a transition metal that has been linked to pathological and beneficial effects in neurodegenerative diseases. In Parkinson’s disease, free copper is related to increased oxidative stress, alpha-synuclein oligomerization, and Lewy body formation. Decreased copper along with increased iron has been found in substantia nigra and caudate nucleus of Parkinson’s disease patients. Copper influences iron content in the brain through ferroxidase ceruloplasmin activity; therefore decreased protein-bound copper in brain may enhance iron accumulation and the associated oxidative stress. The function of other copper-binding proteins such as Cu/Zn-SOD and metallothioneins is also beneficial to prevent neurodegeneration. Copper may regulate neurotransmission since it is released after neuronal stimulus and the metal is able to modulate the function of NMDA and GABA A receptors. Some of the proteins involved in copper transport are the transporters CTR1, ATP7A, and ATP7B and the chaperone ATOX1. There is limited information about the role of those biomolecules in the pathophysiology of Parkinson’s disease; for instance, it is known that CTR1 is decreased in substantia nigra pars compacta in Parkinson’s disease and that a mutation in ATP7B could be associated with Parkinson’s disease. Regarding copper-related therapies, copper supplementation can represent a plausible alternative, while copper chelation may even aggravate the pathology.

Roles of Ag in fabricating Si nanowires by the electroless chemical etching technique

International Nuclear Information System (INIS)

Wan, X.; Wang, Q. K.; Wangyang, P. H.; Tao, H.

2012-01-01

Silicon wafers coated with a film of Ag pattern are used for investigating roles of Ag in the fabrication of silicon nanowire arrays (SiNWs) by the electroless chemical etching technique. The diameter of SiNWs grown in the mixed AgNO 3 /HF solution ranges from 20 to 250 nm. A growth mechanism for such obtained SiNWs is proposed and further experimentally verified. As a comparison as well as to better understand this chemical process, another popular topic on growing SiNWs in the H 2 O 2 /HF solution is also studied. Originating from different chemical reaction mechanisms, Ag film could protect the underneath Si in the AgNO 3 /HF solution and it could, on the contrary, accelerate etching of the underneath Si in the H 2 O 2 /HF solution.

Laser sintering of copper nanoparticles

International Nuclear Information System (INIS)

Zenou, Michael; Saar, Amir; Ermak, Oleg; Kotler, Zvi

2014-01-01

Copper nanoparticle (NP) inks serve as an attractive potential replacement to silver NP inks in functional printing applications. However their tendency to rapidly oxidize has so far limited their wider use. In this work we have studied the conditions for laser sintering of Cu-NP inks in ambient conditions while avoiding oxidation. We have determined the regime for stable, low-resistivity copper (< ×3 bulk resistivity value) generation in terms of laser irradiance and exposure duration and have indicated the limits on fast processing. The role of pre-drying conditions on sintering outcome has also been studied. A method, based on spectral reflectivity measurements, was used for non-contact monitoring of the sintering process evolution. It also indicates preferred spectral regions for sintering. Finally, we illustrated how selective laser sintering can generate high-quality, fine line (<5 µm wide) and dense copper circuits. (paper)

Copper carrier protein in copper toxic sheep liver

Energy Technology Data Exchange (ETDEWEB)

Harris, A L; Dean, P D.G.

1973-01-01

The livers of copper-toxic sheep have been analyzed by gel electrophoresis followed by staining the gels for copper with diethyldithiocarbamate and for protein with amido schwartz. These gels were compared with similar gels obtained from the livers of normal and copper-deficient animals. The copper-toxic livers contained an extra protein band which possessed relatively weakly bound copper. Possible origins of this protein are discussed. 8 references, 1 figure, 2 tables.

Body of Knowledge (BOK) for Copper Wire Bonds

Science.gov (United States)

Rutkowski, E.; Sampson, M. J.

2015-01-01

Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications

Remediation of copper in vineyards – A mini review

International Nuclear Information System (INIS)

Mackie, K.A.; Müller, T.; Kandeler, E.

2012-01-01

Viticulturists use copper fungicide to combat Downy Mildew. Copper, a non-degradable heavy metal, can accumulate in soil or leach into water sources. Its accumulation in topsoil has impacted micro and macro organisms, spurring scientists to research in situ copper removal methods. Recent publications suggest that microorganism assisted phytoextraction, using plants and bacteria to actively extract copper, is most promising. As vineyards represent moderately polluted sites this technique has great potential. Active plant extraction and chelate assisted remediation extract too little copper or risk leaching, respectively. However, despite interesting pot experiment results using microorganism assisted phytoextraction, it remains a challenge to find plants that primarily accumulate copper in their shoots, a necessity in vineyards where whole plant removal would be time consuming and financially cumbersome. Vineyard remediation requires a holistic approach including sustainable soil management, proper plant selection, increasing biodiversity and microorganisms. - Highlights: ► We describe copper distribution and availability in vineyards. ► We explain the environmental impact of copper on organisms, plants and processes. ► We detail possible remediation methods within vineyards. ► Microbially assisted phytoremediation is the most promising remediation method. ► A solution requires an interdisciplinary approach between plants, soil and vines. - This review is significant because it highlights prospective remediation methods usable in copper contaminated vineyards.

Low-cost optical fabrication of flexible copper electrode via laser-induced reductive sintering and adhesive transfer

Science.gov (United States)

Back, Seunghyun; Kang, Bongchul

2018-02-01

Fabricating copper electrodes on heat-sensitive polymer films in air is highly challenging owing to the need of expensive copper nanoparticles, rapid oxidation of precursor during sintering, and limitation of sintering temperature to prevent the thermal damage of the polymer film. A laser-induced hybrid process of reductive sintering and adhesive transfer is demonstrated to cost-effectively fabricate copper electrode on a polyethylene film with a thermal resistance below 100 °C. A laser-induced reductive sintering process directly fabricates a high-conductive copper electrode onto a glass donor from copper oxide nanoparticle solution via photo-thermochemical reduction and agglomeration of copper oxide nanoparticles. The sintered copper patterns were transferred in parallel to a heat-sensitive polyethylene film through self-selective surface adhesion of the film, which was generated by the selective laser absorption of the copper pattern. The method reported here could become one of the most important manufacturing technologies for fabricating low-cost wearable and disposable electronics.

NiCo-lead zirconium titanate-NiCo trilayered magnetoelectric composites prepared by electroless deposition

International Nuclear Information System (INIS)

Zhou, M. H.; Wang, Y. G.; Bi, K.; Fan, H. P.; Zhao, Z. S.

2015-01-01

The NiCo layers with various Ni/Co atomic ratio have been successfully electroless deposited on PZT layers by varying the bath composition. As the cobalt atomic ratio in the deposited layer increases from 17.2 to 54.8 wt%, the magnetostrictive coefficient decreases. The magnetoelectric effect depends strongly on the magnetostrictive properties of magnetostrictive phase. The magnetoelectric coefficient of NiCo/PZT/NiCo trilayers increases with Ni/Co atomic ratio of the deposited NiCo layers increasing from 45:55 to 83:17. A maximum ME voltage coefficient of α E,31 = 2.8 V ⋅ cm −1 ⋅ Oe −1 is obtained at a frequency of about 88 kHz, which makes these trilayers suitable for applications in actuators, transducers and sensors

Electroless porous silicon formation applied to fabrication of boron-silica-glass cantilevers

DEFF Research Database (Denmark)

Teva, Jordi; Davis, Zachary James; Hansen, Ole

2010-01-01

This work describes the characterization and optimization of anisotropic formation of porous silicon in large volumes (0.5-1 mm3) of silicon by an electroless wet etching technique. The main goal is to use porous silicon as a sacrificial volume for bulk micromachining processes, especially in cases...... where etching of the full wafer thickness is needed. The porous silicon volume is formed by a metal-assisted etching in a wet chemical solution composed of hydrogen peroxide (30%), hydrofluoric acid (40%) and ethanol. This paper focuses on optimizing the etching conditions in terms of maximizing...... for bio-chemical sensors. The porous silicon volume is formed in an early step of the fabrication process, allowing easy handling of the wafer during all of the micromachining processes in the process flow. In the final process step, the porous silicon is quickly etched by immersing the wafer in a KOH...

Copper imbalances in ruminants and humans: unexpected common ground.

Science.gov (United States)

Suttle, Neville F

2012-09-01

Ruminants are more vulnerable to copper deficiency than humans because rumen sulfide generation lowers copper availability from forage, increasing the risk of conditions such as swayback in lambs. Molybdenum-rich pastures promote thiomolybdate (TM) synthesis and formation of unabsorbable Cu-TM complexes, turning risk to clinical reality (hypocuprosis). Selection pressures created ruminant species with tolerance of deficiency but vulnerability to copper toxicity in alien environments, such as specific pathogen-free units. By contrast, cases of copper imbalance in humans seemed confined to rare genetic aberrations of copper metabolism. Recent descriptions of human swayback and the exploratory use of TM for the treatment of Wilson's disease, tumor growth, inflammatory diseases, and Alzheimer's disease have created unexpected common ground. The incidence of pre-hemolytic copper poisoning in specific pathogen-free lambs was reduced by an infection with Mycobacterium avium that left them more responsive to treatment with TM but vulnerable to long-term copper depletion. Copper requirements in ruminants and humans may need an extra allowance for the "copper cost" of immunity to infection. Residual cuproenzyme inhibition in TM-treated lambs and anomalies in plasma copper composition that appeared to depend on liver copper status raise this question "can chelating capacity be harnessed without inducing copper-deficiency in ruminants or humans?" A model of equilibria between exogenous (TM) and endogenous chelators (e.g., albumin, metallothionein) is used to predict risk of exposure and hypocuprosis; although risk of natural exposure in humans is remote, vulnerability to TM-induced copper deficiency may be high. Biomarkers of TM impact are needed, and copper chaperones for inhibited cuproenzymes are prime candidates.

Characterization of electroless Au, Pt and Pd contacts on CdTe and ZnTe by RBS and SIMS techniques

Energy Technology Data Exchange (ETDEWEB)

Roumie, M. E-mail: mroumie@cnrs.edu.lb; Hageali, M.; Zahraman, K.; Nsouli, B.; Younes, G

2004-06-01

Rutherford backscattering spectrometry (RBS) was applied to characterize Au, Pt and Pd contacts on II-VI semiconductor materials, CdTe and ZnTe, used as nuclear detectors. Electroless thin film depositions were prepared by changing the concentration of the reaction solution. Contrary to the deposition reaction time, it was observed that the amount of solution dilution degree had a considerable effect on increasing the thickness of the metal layer. Furthermore, PICTS electrical measurements confirmed the depth profile analysis performed by RBS and SIMS.

Preparation of Stable Superhydrophobic Coatings on Wood Substrate Surfaces via Mussel-Inspired Polydopamine and Electroless Deposition Methods

Directory of Open Access Journals (Sweden)

Kaili Wang

2017-06-01

Full Text Available Mussel-inspired polydopamine (PDA chemistry and electroless deposition approaches were used to prepare stable superhydrophobic coatings on wood surfaces. The as-formed PDA coating on a wood surface exhibited a hierarchical micro/nano roughness structure, and functioned as an “adhesive layer” between the substrate and a metallic film by the metal chelating ability of the catechol moieties on PDA, allowing for the formation of a well-developed micro/nanostructure hierarchical roughness. Additionally, the coating acted as a stable bridge between the substrate and hydrophobic groups. The morphology and chemical components of the prepared superhydrophobic wood surfaces were characterized by scanning electron microscopy (SEM, Fourier transform infrared (FT-IR spectroscopy, and X-ray photoelectron spectroscopy (XPS. The PDA and octadecylamine (OA modified surface showed excellent superhydrophobicity with a water contact angle (CA of about 153° and a rolling angle (RA of about 9°. The CA further increased to about 157° and RA reduced to about 5° with the Cu metallization. The superhydrophobic material exhibited outstanding stability in harsh conditions including ultraviolet aging, ultrasonic washing, strong acid-base and organic solvent immersion, and high-temperature water boiling. The results suggested that the PDA/OA layers were good enough to confer robust, degradation-resistant superhydrophobicity on wood substrates. The Cu metallization was likely unnecessary to provide significant improvements in superhydrophobic property. However, due to the amazing adhesive capacity of PDA, the electroless deposition technique may allow for a wide range of potential applications in biomimetic materials.

Effect of physicochemical form on copper availability to aquatic organisms

International Nuclear Information System (INIS)

Harrison, F.L.

1983-11-01

Copper concentration and speciation were determined in influent and effluent waters collected from eight power stations that used copper alloys in their cooling systems. Quantities of copper associated with particles, colloids, and organic and inorganic ligands differed with the site, season, and mode of operation of the station. Under normal operating conditions, the differences between influent and effluent waters were generally small, and most of the copper was in bound (complexed) species. However, copper was high in concentration and present in labile species during start-up of water circulation through some cooling systems and during changeover from an open- to closed-cycle operation. Copper sensitivity of selected ecologically and economically important aquatic organisms was also evaluted. Our primary emphasis was on acute effects and most of the testing was performed under controlled laboratory conditions. However, sublethal effects of copper on a population of bluegills living in a power station cooling lake containing water of low pH were also assessed. The toxic response to copper differed with the species and life stage of the animal and with the chemical form of copper in the water

The Optimization of Copper Sulfate and Tincalconite Molar Ratios on the Hydrothermal Synthesis of Copper Borates

OpenAIRE

E. Moroydor Derun; N. Tugrul; F. T. Senberber; A. S. Kipcak; S. Piskin

2014-01-01

In this research, copper borates are synthesized by the reaction of copper sulfate pentahydrate (CuSO4.5H2O) and tincalconite (Na2O4B7.10H2O). The experimental parameters are selected as 80oC reaction temperature and 60 of reaction time. The effect of mole ratio of CuSO4.5H2O to Na2O4B7.5H2O is studied. For the identification analyses X-Ray Diffraction (XRD) and Fourier Transform Infrared Spectroscopy (FT-IR) techniques are used. At the end of the experiments, synthesized...

A highly selective copper-indium bimetallic electrocatalyst for the electrochemical reduction of aqueous CO2to CO

KAUST Repository

Rasul, Shahid

2014-12-23

The challenge in the electrochemical reduction of aqueous carbon dioxide is in designing a highly selective, energy-efficient, and non-precious-metal electrocatalyst that minimizes the competitive reduction of proton to form hydrogen during aqueous CO2 conversion. A non-noble metal electrocatalyst based on a copper-indium (Cu-In) alloy that selectively converts CO2 to CO with a low overpotential is reported. The electrochemical deposition of In on rough Cu surfaces led to Cu-In alloy surfaces. DFT calculations showed that the In preferentially located on the edge sites rather than on the corner or flat sites and that the d-electron nature of Cu remained almost intact, but adsorption properties of neighboring Cu was perturbed by the presence of In. This preparation of non-noble metal alloy electrodes for the reduction of CO2 provides guidelines for further improving electrocatalysis.

Selective recovery of pure copper nanopowder from indium-tin-oxide etching wastewater by various wet chemical reduction process: Understanding their chemistry and comparisons of sustainable valorization processes

Energy Technology Data Exchange (ETDEWEB)

Swain, Basudev, E-mail: swain@iae.re.kr [Institute for Advanced Engineering, Advanced Materials & Processing Center, Yongin, 449-863 (Korea, Republic of); Mishra, Chinmayee [Institute for Advanced Engineering, Advanced Materials & Processing Center, Yongin, 449-863 (Korea, Republic of); Hong, Hyun Seon [Sungshin University, Dept. of Interdisciplinary ECO Science, Seoul, 142-732 (Korea, Republic of); Cho, Sung-Soo [Institute for Advanced Engineering, Advanced Materials & Processing Center, Yongin, 449-863 (Korea, Republic of)

2016-05-15

Sustainable valorization processes for selective recovery of pure copper nanopowder from Indium-Tin-Oxide (ITO) etching wastewater by various wet chemical reduction processes, their chemistry has been investigated and compared. After the indium recovery by solvent extraction from ITO etching wastewater, the same is also an environmental challenge, needs to be treated before disposal. After the indium recovery, ITO etching wastewater contains 6.11 kg/m{sup 3} of copper and 1.35 kg/m{sup 3} of aluminum, pH of the solution is very low converging to 0 and contain a significant amount of chlorine in the media. In this study, pure copper nanopowder was recovered using various reducing reagents by wet chemical reduction and characterized. Different reducing agents like a metallic, an inorganic acid and an organic acid were used to understand reduction behavior of copper in the presence of aluminum in a strong chloride medium of the ITO etching wastewater. The effect of a polymer surfactant Polyvinylpyrrolidone (PVP), which was included to prevent aggregation, to provide dispersion stability and control the size of copper nanopowder was investigated and compared. The developed copper nanopowder recovery techniques are techno-economical feasible processes for commercial production of copper nanopowder in the range of 100–500 nm size from the reported facilities through a one-pot synthesis. By all the process reported pure copper nanopowder can be recovered with>99% efficiency. After the copper recovery, copper concentration in the wastewater reduced to acceptable limit recommended by WHO for wastewater disposal. The process is not only beneficial for recycling of copper, but also helps to address environment challenged posed by ITO etching wastewater. From a complex wastewater, synthesis of pure copper nanopowder using various wet chemical reduction route and their comparison is the novelty of this recovery process. - Highlights: • From the Indium-Tin-Oxide etching

Selective recovery of pure copper nanopowder from indium-tin-oxide etching wastewater by various wet chemical reduction process: Understanding their chemistry and comparisons of sustainable valorization processes

International Nuclear Information System (INIS)

Swain, Basudev; Mishra, Chinmayee; Hong, Hyun Seon; Cho, Sung-Soo

2016-01-01

Sustainable valorization processes for selective recovery of pure copper nanopowder from Indium-Tin-Oxide (ITO) etching wastewater by various wet chemical reduction processes, their chemistry has been investigated and compared. After the indium recovery by solvent extraction from ITO etching wastewater, the same is also an environmental challenge, needs to be treated before disposal. After the indium recovery, ITO etching wastewater contains 6.11 kg/m 3 of copper and 1.35 kg/m 3 of aluminum, pH of the solution is very low converging to 0 and contain a significant amount of chlorine in the media. In this study, pure copper nanopowder was recovered using various reducing reagents by wet chemical reduction and characterized. Different reducing agents like a metallic, an inorganic acid and an organic acid were used to understand reduction behavior of copper in the presence of aluminum in a strong chloride medium of the ITO etching wastewater. The effect of a polymer surfactant Polyvinylpyrrolidone (PVP), which was included to prevent aggregation, to provide dispersion stability and control the size of copper nanopowder was investigated and compared. The developed copper nanopowder recovery techniques are techno-economical feasible processes for commercial production of copper nanopowder in the range of 100–500 nm size from the reported facilities through a one-pot synthesis. By all the process reported pure copper nanopowder can be recovered with>99% efficiency. After the copper recovery, copper concentration in the wastewater reduced to acceptable limit recommended by WHO for wastewater disposal. The process is not only beneficial for recycling of copper, but also helps to address environment challenged posed by ITO etching wastewater. From a complex wastewater, synthesis of pure copper nanopowder using various wet chemical reduction route and their comparison is the novelty of this recovery process. - Highlights: • From the Indium-Tin-Oxide etching wastewater

Copper and copper-nickel-alloys - An overview

Energy Technology Data Exchange (ETDEWEB)

Klassert, Anton; Tikana, Ladji [Deutsches Kupferinstitut e.V. Am Bonneshof 5, 40474 Duesseldorf (Germany)

2004-07-01

With the increasing level of industrialization the demand for and the number of copper alloys rose in an uninterrupted way. Today, the copper alloys take an important position amongst metallic materials due to the large variety of their technological properties and applications. Nowadays there exist over 3.000 standardized alloys. Copper takes the third place of all metals with a worldwide consumption of over 15 millions tons per year, following only to steel and aluminum. In a modern industrial society we meet copper in all ranges of the life (electro-technology, building and construction industry, mechanical engineering, automotive, chemistry, offshore, marine engineering, medical applications and others.). Copper is the first metal customized by humanity. Its name is attributed to the island Cyprus, which supplied in the antiquity copper to Greece, Rome and the other Mediterranean countries. The Romans called it 'ore from Cyprus' (aes cyprium), later cuprum. Copper deposited occasionally also dapper and could be processed in the recent stone age simply by hammering. Already in early historical time copper alloys with 20 to 50 percent tin was used for the production of mirrors because of their high reflecting power. Although the elementary nickel is an element discovered only recently from a historical perspective, its application in alloys - without any knowledge of the alloy composition - occurred at least throughout the last 2.000 years. The oldest copper-nickel coin originates from the time around 235 B.C.. Only around 1800 AD nickel was isolated as a metallic element. In particular in the sea and offshore technology copper nickel alloys found a broad field of applications in piping systems and for valves and armatures. The excellent combination of characteristics like corrosion resistance, erosion stability and bio-fouling resistance with excellent mechanical strength are at the basis of this success. An experience of many decades supports the use

Rapid determination of trace level copper in tea infusion samples by solid contact ion selective electrode

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Aysenur Birinci

2016-07-01

Full Text Available A new solid contact copper selective electrode with a poly (vinyl chloride (PVC membrane consisting of o-xylylenebis(N,N-diisobutyldithiocarbamate as ionophore has been prepared. The main novelties of constructed ion selective electrode concept are the enhanced robustness, cheapness, and fastness due to the use of solid contacts. The electrode exhibits a rapid (< 10 seconds and near-Nernstian response to Cu2+ activity from 10−1 to 10−6 mol/L at the pH range of 4.0–6.0. No serious interference from common ions was found. The electrode characterizes by high potential stability, reproducibility, and full repeatability. The electrode was used as an indicator electrode in potentiometric titration of Cu(II ions with EDTA and for the direct assay of tea infusion samples by means of the calibration graph technique. The results compared favorably with those obtained by the atomic absorption spectroscopy (AAS.

A multidimensional analysis and modelling of flotation process for selected Polish lithological copper ore types

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Niedoba Tomasz

2017-01-01

Full Text Available The flotation of copper ore is a complex technological process that depends on many parameters. Therefore, it is necessary to take into account the complexity of this phenomenon by choosing a multidimensional data analysis. The paper presents the results of modelling and analysis of beneficiation process of sandstone copper ore. Considering the implementation of multidimensional statistical methods it was necessary to carry out a multi-level experiment, which included 4 parameters (size fraction, collector type and dosage, flotation time. The main aim of the paper was the preparation of flotation process models for the recovery and the content of the metal in products. A MANOVA was implemented to explore the relationship between dependent (β, ϑ, ε, η and independent (d, t, cd, ct variables. The design of models was based on linear and nonlinear regression. The results of the variation analysis indicated the high significance of all parameters for the process. The average degree of matching of linear models to experimental data was set at 49% and 33% for copper content in the concentrate and tailings and 47% for the recovery of copper minerals in the both. The results confirms the complexity and stochasticity of the Polish copper ore flotation.

Precursors for formation of copper selenide, indium selenide, copper indium diselenide, and/or copper indium gallium diselenide films

Science.gov (United States)

Curtis, Calvin J; Miedaner, Alexander; Van Hest, Maikel; Ginley, David S

2014-11-04

Liquid-based precursors for formation of Copper Selenide, Indium Selenide, Copper Indium Diselenide, and/or copper Indium Galium Diselenide include copper-organoselenides, particulate copper selenide suspensions, copper selenide ethylene diamine in liquid solvent, nanoparticulate indium selenide suspensions, and indium selenide ethylene diamine coordination compounds in solvent. These liquid-based precursors can be deposited in liquid form onto substrates and treated by rapid thermal processing to form crystalline copper selenide and indium selenide films.

The Morphology of Silver Layers on SU8 polymers prepared by Electroless Deposition

Science.gov (United States)

Dutta, Aniruddha; Yuan, Biao; Heinrich, Helge; Grabill, Chris; Williams, Henry; Kuebler, Stephen; Bhattacharya, Aniket

2010-03-01

Silver was deposited onto the functionalized surface of polymeric SU-8 where gold nanoparticles (Au-NPs) act as nucleation sites using electroless metallization chemistry. Here we report on the evolution of the nanoscale morphology of deposited Ag studied by Transmission Electron Microscopy (TEM). In TEM of sample cross sections correlations between the original gold and the silver nanoparticles were obtained while plan-view TEM results showed the distribution of nanoparticles on the surface. Scanning TEM with a high-angle annular dark field detector was used to obtain atomic number contrast. The morphology of the deposited Ag was controlled through the presence and absence of gum Arabic. The thickness and height fluctuations of the Ag layer were determined as a function of time and a statistical analysis of the growth process was conducted for the initial deposition periods.

Advanced Copper Composites Against Copper-Tolerant Xanthomonas perforans and Tomato Bacterial Spot.

Science.gov (United States)

Strayer-Scherer, A; Liao, Y Y; Young, M; Ritchie, L; Vallad, G E; Santra, S; Freeman, J H; Clark, D; Jones, J B; Paret, M L

2018-02-01

Bacterial spot, caused by Xanthomonas spp., is a widespread and damaging bacterial disease of tomato (Solanum lycopersicum). For disease management, growers rely on copper bactericides, which are often ineffective due to the presence of copper-tolerant Xanthomonas strains. This study evaluated the antibacterial activity of the new copper composites core-shell copper (CS-Cu), multivalent copper (MV-Cu), and fixed quaternary ammonium copper (FQ-Cu) as potential alternatives to commercially available micron-sized copper bactericides for controlling copper-tolerant Xanthomonas perforans. In vitro, metallic copper from CS-Cu and FQ-Cu at 100 μg/ml killed the copper-tolerant X. perforans strain within 1 h of exposure. In contrast, none of the micron-sized copper rates (100 to 1,000 μg/ml) from Kocide 3000 significantly reduced copper-tolerant X. perforans populations after 48 h of exposure compared with the water control (P copper-based treatments killed the copper-sensitive X. perforans strain within 1 h. Greenhouse studies demonstrated that all copper composites significantly reduced bacterial spot disease severity when compared with copper-mancozeb and water controls (P copper composites significantly reduced disease severity when compared with water controls, using 80% less metallic copper in comparison with copper-mancozeb in field studies (P copper composites have the potential to manage copper-tolerant X. perforans and tomato bacterial spot.

Preparation and pattern recognition of metallic Ni ultrafine powders by electroless plating

International Nuclear Information System (INIS)

Zhang, H.J.; Zhang, H.T.; Wu, X.W.; Wang, Z.L.; Jia, Q.L.; Jia, X.L.

2006-01-01

Using hydrazine hydrate as reductant, metallic Ni ultrafine powders were prepared from NiSO 4 aqueous solution by electroless plating method. The factors including concentration of NiSO 4 , bathing temperature, ratio of hydrazine hydrate to NiSO 4 , the pH of the solution, etc., on influence of the yield and average particle size of metallic Ni ultrafine powders were studied in detail. X-ray powders diffraction patterns show that the nickel powders are cubic crystallite. The average crystalline size of the ultrafine nickel powders is about 30 nm. The dielectric and magnetic loss of ultrafine Ni powders-paraffin wax composites were measured by the rectangle waveguide method in the range 8.2-12.4 GHz. The factors for Ni ultrafine powders preparation are optimized by computer pattern recognition program based on principal component analysis, the optimum factors regions with higher yield of metallic Ni ultrafine powders are indicated by this way

Biokinetics of copper in black-banded rainbowfish (Melanotaenia nigrans) tolerant to elevated copper concentrations, using the radioisotope 64Cu

International Nuclear Information System (INIS)

Gale, S.; Jeffree, R.; Smith, S.; Lim, R.

2000-01-01

Full text: For over 40 years black-banded rainbowfish (Melanotaenia nigrans) living in the East Branch of the Finniss River, Northern Territory have been exposed to elevated copper concentrations due to mine waste from the Rum Jungle uranium/copper mine. In the 1970s prior to remediation of the mine, fish kills were observed along the length of the East Branch. While copper concentrations remain comparatively high (up to 2000 μg/L) in the East Branch since remediation of the mine site, M. nigrans have been observed in the area. It was, therefore, hypothesised that due to selective pressure of lethal exposure, the population of black-banded rainbowfish in the East Branch have developed a tolerance to elevated copper concentrations. This project aimed to demonstrate copper tolerance and evaluate possible mechanism(s). In May 2000, fish were collected from the East Branch (exposed fish) and from a catchment previously unexposed to elevated metal concentrations (reference fish). The 96-hour EC 50 , fish imbalance (i.e. the concentration of copper that affects 50% of fish over 96 hours) for the exposed fish was over 8 times higher than the reference fish. Using the radioisotope, 64 Cu, the biokinetics of newly accumulated copper was traced in exposed and reference fish at low and elevated copper concentrations. The uptake rate, and therefore body burden, were significantly (p=0.000) lower in exposed fish, at both low and elevated copper concentrations compared to reference fish. Possible mechanisms of reducing copper uptake will be discussed. Tolerance was not lost when fish were maintained in relatively low copper concentrations in the laboratory. Also, the two populations of fish were genetically dissimilar based on allozyme analysis, which suggests that the mechanism is genetically mediated. The outcome of this project will be important in assisting accurate risk assessment and the development of environmental management strategies for the conservation of biota. The

Native copper as a natural analogue for copper canisters

International Nuclear Information System (INIS)

Marcos, N.

1989-12-01

This paper discusses the occurrence of native copper as found in geological formations as a stability analogue of copper canisters that are planned to be used for the disposal of spent nuclear fuel in the Finnish bedrock. A summary of several publications on native copper occurrences is presented. The present geochemical and geohydrological conditions in which copper is met with in its metallic state show that metallic copper is stable in a wide range of temperatures. At low temperatures native copper is found to be stable where groundwater has moderate pH (about 7), low Eh (< +100 mV), and low total dissolved solids, especially chloride. Microscopical and microanalytical studies were carried out on a dozen of rock samples containing native copper. The results reveal that the metal shows no significant alteration. Only the surface of copper grains is locally coated. In the oldest samples there exist small corrosion cracks; the age of the oldest samples is over 1,000 million years. A review of several Finnish groundwater studies suggests that there are places in Finland where the geohydrological conditions are favourable for native copper stability. (orig.)

Electroless Formation of Hybrid Lithium Anodes for Fast Interfacial Ion Transport

KAUST Repository

Choudhury, Snehashis; Tu, Zhengyuan; Stalin, Sanjuna; Vu, Duylinh; Fawole, Kristen; Gunceler, Deniz; Sundararaman, Ravishankar; Archer, Lynden A.

2017-01-01

Rechargeable batteries based on metallic anodes are of interest for fundamental and application-focused studies of chemical and physical kinetics of liquids at solid interfaces. Approaches that allow facile creation of uniform coatings on these metals to prevent physical contact with liquid electrolytes, while enabling fast ion transport, are essential to address chemical instability of the anodes. Here, we report a simple electroless ion-exchange chemistry for creating coatings of indium on lithium. By means of joint density functional theory and interfacial characterization experiments, we show that In coatings stabilize Li by multiple processes, including exceptionally fast surface diffusion of lithium ions and high chemical resistance to liquid electrolytes. Indium coatings also undergo reversible alloying reactions with lithium ions, facilitating design of high-capacity hybrid In-Li anodes that use both alloying and plating approaches for charge storage. By means of direct visualization, we further show that the coatings enable remarkably compact and uniform electrodeposition. The resultant In-Li anodes are shown to exhibit minimal capacity fade in extended galvanostatic cycling when paired with commercial-grade cathodes.

Electroless Formation of Hybrid Lithium Anodes for Fast Interfacial Ion Transport

KAUST Repository

Choudhury, Snehashis

2017-08-17

Rechargeable batteries based on metallic anodes are of interest for fundamental and application-focused studies of chemical and physical kinetics of liquids at solid interfaces. Approaches that allow facile creation of uniform coatings on these metals to prevent physical contact with liquid electrolytes, while enabling fast ion transport, are essential to address chemical instability of the anodes. Here, we report a simple electroless ion-exchange chemistry for creating coatings of indium on lithium. By means of joint density functional theory and interfacial characterization experiments, we show that In coatings stabilize Li by multiple processes, including exceptionally fast surface diffusion of lithium ions and high chemical resistance to liquid electrolytes. Indium coatings also undergo reversible alloying reactions with lithium ions, facilitating design of high-capacity hybrid In-Li anodes that use both alloying and plating approaches for charge storage. By means of direct visualization, we further show that the coatings enable remarkably compact and uniform electrodeposition. The resultant In-Li anodes are shown to exhibit minimal capacity fade in extended galvanostatic cycling when paired with commercial-grade cathodes.

NiCo-lead zirconium titanate-NiCo trilayered magnetoelectric composites prepared by electroless deposition

Energy Technology Data Exchange (ETDEWEB)

Zhou, M. H.; Wang, Y. G.; Bi, K., E-mail: bike@bupt.edu.cn [State Key Laboratory of Information Photonics and Optical Communications and School of Science, Beijing University of Posts and Telecommunications, Beijing 100876 (China); Fan, H. P. [School of Mechanical and Electrical Engineering, Qingdao Technological University Qindao College, Qingdao 266106 (China); Zhao, Z. S. [Shandong Engineering Consulting Institute, Jinan 250013 (China)

2015-04-15

The NiCo layers with various Ni/Co atomic ratio have been successfully electroless deposited on PZT layers by varying the bath composition. As the cobalt atomic ratio in the deposited layer increases from 17.2 to 54.8 wt%, the magnetostrictive coefficient decreases. The magnetoelectric effect depends strongly on the magnetostrictive properties of magnetostrictive phase. The magnetoelectric coefficient of NiCo/PZT/NiCo trilayers increases with Ni/Co atomic ratio of the deposited NiCo layers increasing from 45:55 to 83:17. A maximum ME voltage coefficient of α{sub E,31} = 2.8 V ⋅ cm{sup −1} ⋅ Oe{sup −1} is obtained at a frequency of about 88 kHz, which makes these trilayers suitable for applications in actuators, transducers and sensors.

The oxidation of copper catalysts during ethylene epoxidation.

Science.gov (United States)

Greiner, M T; Jones, T E; Johnson, B E; Rocha, T C R; Wang, Z J; Armbrüster, M; Willinger, M; Knop-Gericke, A; Schlögl, R

2015-10-14

The oxidation of copper catalysts during ethylene epoxidation was characterized using in situ photoemission spectroscopy and electron microscopy. Gas chromatography, proton-transfer reaction mass spectrometry and electron-ionization mass spectrometry were used to characterize the catalytic properties of the oxidized copper. We find that copper corrodes during epoxidation in a 1 : 1 mixture of oxygen and ethylene. The catalyst corrosion passes through several stages, beginning with the formation of an O-terminated surface, followed by the formation of Cu2O scale and eventually a CuO scale. The oxidized catalyst exhibits measurable activity for ethylene epoxidation, but with a low selectivity of 8/2500) Cu2O forms and eventually covers the surface.

A thiourea derivative as potential ionophore for copper sensing

Science.gov (United States)

Ying, Kook Shih; Heng, Lee Yook; Hassan, Nurul Izzaty; Hasbullah, Siti Aishah

2018-04-01

A new thiourea derivative, N1,N3-bis[[3,5-bis(trifluoromethyl)phenyl]carbamothioyl]isophthalamide (TPC), as a potential copper ionophore was investigated. TPC was immobilized via drop casting method into poly(n-butyl acrylate) pBA membrane and the sensor was characterized by potentiometric method. The sensor fabricated based on TPC showed a Nernstian response towards copper ion with the slope of 27.07±2.84 mV/decade in the range of 1.0×10-6 - 1.0-10-4 M and limit of detection of 6.24 × 10-7 M. In addition, based on the separate solution method (SSM), the logarithm selectivity coefficients were less than -3.00 for monovalent, divalent and trivalent cations that are present in the environmental water samples such as K+, Ca2+, Mg2+ and Fe3+. This confirmed that the sensor fabricated with TPC exhibited good sensitivity and selectivity towards copper ion.

Formation of copper-indium-selenide and/or copper-indium-gallium-selenide films from indium selenide and copper selenide precursors

Science.gov (United States)

Curtis, Calvin J [Lakewood, CO; Miedaner, Alexander [Boulder, CO; Van Hest, Maikel [Lakewood, CO; Ginley, David S [Evergreen, CO; Nekuda, Jennifer A [Lakewood, CO

2011-11-15

Liquid-based indium selenide and copper selenide precursors, including copper-organoselenides, particulate copper selenide suspensions, copper selenide ethylene diamine in liquid solvent, nanoparticulate indium selenide suspensions, and indium selenide ethylene diamine coordination compounds in solvent, are used to form crystalline copper-indium-selenide, and/or copper indium gallium selenide films (66) on substrates (52).

COPPER AND COPPER-CONTAINING PESTICIDES: METABOLISM, TOXICITY AND OXIDATIVE STRESS

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Viktor Husak

2015-05-01

Full Text Available The purpose of this paper is to provide a brief review of the current knowledge regarding metabolism and toxicity of copper and copper-based pesticides in living organisms. Copper is an essential trace element in all living organisms (bacteria, fungi, plants, and animals, because it participates in different metabolic processes and maintain functions of organisms. The transport and metabolism of copper in living organisms is currently the subject of many studies. Copper is absorbed, transported, distributed, stored, and excreted in the body via the complex of homeostatic processes, which provide organisms with a needed constant level of this micronutrient and avoid excessive amounts. Many aspects of copper homeostasis were studied at the molecular level. Copper based-pesticides, in particularly fungicides, bacteriocides and herbicides, are widely used in agricultural practice throughout the world. Copper is an integral part of antioxidant enzymes, particularly copper-zinc superoxide dismutase (Cu,Zn-SOD, and plays prominent roles in iron homeostasis. On the other hand, excess of copper in organism has deleterious effect, because it stimulates free radical production in the cell, induces lipid peroxidation, and disturbs the total antioxidant capacity of the body. The mechanisms of copper toxicity are discussed in this review also.

Selective flotation-spectrophotometric determination of trace copper(II) in natural waters, human blood and drug samples using phenanthraquinone monophenylthiosemicarbazone.

Science.gov (United States)

Khalifa, M E; Akl, M A; Ghazy, S E

2001-06-01

Copper(II) forms 1:1 and 1:2 intense red complexes with phenanthraquinone monophenylthiosemicarbazone (PPT) at pH 3-3.5 and > or =6.5, respectively. These complexes exhibit maximal absorbance at 545 and 517 nm, the molar absorptivity being 2.3 x 10(4) and 4.8 x 10(4) l mol(-1) cm(-1), respectively. However, the 1:1 complex was quantitatively floated with oleic acid (HOL) surfactant in the pH range 4.5-5.5, providing a highly selective and sensitive procedure for the spectrophotometric determination of CuII. The molar absorptivity of the floated Cu-PPT complex was 1.5 x 10(5) l mol)(-1) cm(-1). Beer's law was obeyed over the range 3-400 ppb at 545 nm. The analytical parameters affecting the flotation process and hence the determination of copper traces were reported. Also, the structure of the isolated solid complex and the mechanism of flotation were suggested. Moreover, the procedure was successfully applied to the analysis of CuII in natural waters, serum blood and some drug samples.

Uptake and internalisation of copper by three marine microalgae: comparison of copper-sensitive and copper-tolerant species.

Science.gov (United States)

Levy, Jacqueline L; Angel, Brad M; Stauber, Jennifer L; Poon, Wing L; Simpson, Stuart L; Cheng, Shuk Han; Jolley, Dianne F

2008-08-29

Although it has been well established that different species of marine algae have different sensitivities to metals, our understanding of the physiological and biochemical basis for these differences is limited. This study investigated copper adsorption and internalisation in three algal species with differing sensitivities to copper. The diatom Phaeodactylum tricornutum was particularly sensitive to copper, with a 72-h IC50 (concentration of copper to inhibit growth rate by 50%) of 8.0 microg Cu L(-1), compared to the green algae Tetraselmis sp. (72-h IC50 47 microg Cu L(-1)) and Dunaliella tertiolecta (72-h IC50 530 microg Cu L(-1)). At these IC50 concentrations, Tetraselmis sp. had much higher intracellular copper (1.97+/-0.01 x 10(-13)g Cu cell(-1)) than P. tricornutum (0.23+/-0.19 x 10(-13)g Cu cell(-1)) and D. tertiolecta (0.59+/-0.05 x 10(-13)g Cu cell(-1)), suggesting that Tetraselmis sp. effectively detoxifies copper within the cell. By contrast, at the same external copper concentration (50 microg L(-1)), D. tertiolecta appears to better exclude copper than Tetraselmis sp. by having a slower copper internalisation rate and lower internal copper concentrations at equivalent extracellular concentrations. The results suggest that the use of internal copper concentrations and net uptake rates alone cannot explain differences in species-sensitivity for different algal species. Model prediction of copper toxicity to marine biota and understanding fundamental differences in species-sensitivity will require, not just an understanding of water quality parameters and copper-cell binding, but also further knowledge of cellular detoxification mechanisms.

Low Temperature Steam Methane Reforming Over Ni Based Catalytic Membrane Prepared by Electroless Palladium Plating.

Science.gov (United States)

Lee, Sang Moon; Hong, Sung Chang; Kim, Sung Su

2018-09-01

A Pd/Ni-YSZ porous membrane with different palladium loadings and hydrazine as a reducing reagent was prepared by electroless plating and evaluated for the steam methane reforming activity. The steam-reforming activity of a Ni-YSZ porous membrane was greatly increased by the deposition of 4 g/L palladium in the low-temperature range (600 °C). With an increasing amount of reducing reagent, the Pd clusters were well dispersed on the Ni-YSZ surface and were uniform in size (∼500 nm). The Pd/Ni-YSZ catalytic porous membrane prepared by 1 of Pd/hydrazine ratio possessed an abundant amount of metallic Pd. The optimal palladium loadings and Pd/hydrazine ratio increased the catalytic activity in both the steam-reforming reaction and the Pd dispersion.

Ultraviolet light and ozone surface modification of poly-alpha α-methylstyrene using electroless nickel plating

International Nuclear Information System (INIS)

Chi Fangting; Sichuan Univ., Chengdu; Li Bo; Liu Yiyang; Chen Sufen; Jiang Bo

2009-01-01

The deposition capability of nickel on the surface of poly-α-methylstyrene microspheres was improved by combined treatment of ozone aeration and UV irradiation in aqueous ammonia. Surface properties of the treated film were investigated by X-ray photoelectron spectroscopy(XPS) and Fourier transform infrared(FT-TR) measurements. The samples were characterized by SEM. The results indicate that after ultraviolet joint ozone treatment, the surfaces of microspheres were oxidized, and the amine and amide groups are introduced on their surface. The images of SEM show the adhesion between microspheres and nickel-phosphorus films was improved after surface modification. This was attributed to amide which could chemisorb palladium ions to catalyze electroless nickel plating on the pretreated surface of microspheres. (authors)

The commercialization of the FENIX iron control system for purifying copper electrowinning electrolytes

Science.gov (United States)

Shaw, D. R.; Dreisinger, D. B.; Lancaster, T.; Richmond, G. D.; Tomlinson, M.

2004-07-01

The FENIX Hydromet Iron Control System was installed at Western Metals Copper Ltd.’s Mt. Gordon Operations in Queensland, Australia. The system uses a novel and patented ion-exchange resin to selectively remove iron from copper electrolyte at the solvent extraction/electrowinning plant. At Mt. Gordon, the system delivered significant savings in reagent consumption (acid and cobalt sulfate for electrowinning and lime for neutralization of the raffinate bleed) and has the potential to deliver higher current efficiencies in copper electrowinning, leading to increased copper production.

Metallization on FDM Parts Using the Chemical Deposition Technique

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Azhar Equbal

2014-08-01

Full Text Available Metallization of ABS (acrylonitrile-butadiene-styrene parts has been studied on flat part surfaces. These parts are fabricated on an FDM (fused deposition modeling machine using the layer-wise deposition principle using ABS as a part material. Electroless copper deposition on ABS parts was performed using two different surface preparation processes, namely ABS parts prepared using chromic acid for etching and ABS parts prepared using a solution mixture of sulphuric acid and hydrogen peroxide (H2SO4/H2O2 for etching. After surface preparations using these routes, copper (Cu is deposited electrolessly using four different acidic baths. The acidic baths used are 5 wt% CuSO4 (copper sulfate with 15 wt% of individual acids, namely HF (hydrofluoric acid, H2SO4 (sulphuric acid, H3PO4 (phosphoric acid and CH3COOH (acetic acid. Cu deposition under different acidic baths used for both the routes is presented and compared based on their electrical performance, scanning electron microscopy (SEM and energy dispersive X-ray spectrometry (EDS. The result shows that chromic acid etched samples show better electrical performance and Cu deposition in comparison to samples etched via H2SO4/H2O2.

Effect of hydrofluoric acid concentration on the evolution of photoluminescence characteristics in porous silicon nanowires prepared by Ag-assisted electroless etching method

KAUST Repository

Najar, Adel

2012-01-01

We report on the structural and optical properties of porous silicon nanowires (PSiNWs) fabricated using silver (Ag) ions assisted electroless etching method. Silicon nanocrystallites with sizes <5 nm embedded in amorphous silica have been observed from PSiNW samples etched using the optimum hydrofluoric acid (HF) concentration. The strongest photoluminescence (PL) signal has been measured from samples etched with 4.8 M of HF, beyond which a significant decreasing in PL emission intensity has been observed. A qualitative model is proposed for the formation of PSiNWs in the presence of Ag catalyst. This model affirms our observations in PL enhancement for samples etched using HF <4.8 M and the eventual PL reduction for samples etched beyond 4.8 M of HF concentration. The enhancement in PL signals has been associated to the formation of PSiNWs and the quantum confinement effect in the Si nanocrystallites. Compared to PSiNWs without Si-O x, the HF treated samples exhibited significant blue PL peak shift of 100 nm. This effect has been correlated to the formation of defect states in the surface oxide. PSiNWs fabricated using the electroless etching method can find useful applications in optical sensors and as anti-reflection layer in silicon-based solar cells. © 2012 American Institute of Physics.

Cancer risk in relation to serum copper levels.

Science.gov (United States)

Coates, R J; Weiss, N S; Daling, J R; Rettmer, R L; Warnick, G R

1989-08-01

A nested, matched case-control study was conducted to assess the relationship between serum levels of copper and the subsequent risk of cancer. One hundred thirty-three cases of cancer were identified during 1974-1984 among 5000 members of a northwest Washington State employee cohort from whom serum specimens had been previously obtained and stored. Two hundred forty-one controls were selected at random from the cohort and were matched to the cases on the basis of age, sex, race, and date of blood draw. Serum copper levels were measured by atomic absorption spectrometry. Risk of a subsequent diagnosis of cancer was positively associated with serum copper levels, but only among those cases diagnosed within 4 years of the time the serum specimens were collected. Among cases diagnosed more than 4 years after specimen collection, there was no consistent association between serum copper levels and risk. Adjustment for age, sex, race, occupational status, cigarette smoking, family history of cancer, alcohol consumption, and, among females, use of exogenous hormones had no appreciable effect on these relationships. The findings suggest that the presence of cancer may increase serum copper levels several years prior to its diagnosis. They are less supportive of the hypothesis that serum copper levels affect cancer risk.

Mixed complex combinations with a new schiff base used as membranes ion-selective for copper and nickel ions, analytical applications)

International Nuclear Information System (INIS)

Mitu, L.; Tigae, C.

2009-01-01

Four electrodes with liquid membrane, Cu/sup 2+/ -selective and Ni/sup 2+/ -selective, not previously described in the literature, were prepared and characterized. Electrodes 1 and 2 are based on mixed complexes of Cu(II) and Ni(II) with isonicotinoylhydrazone-2-aldehyde pyrrole (INH2AP= HL/sup 1/) as ligand and electrodes 3 and 4 are based on the mixed complexes with isonicotinoyl- hydrazone-2-hydroxy-l-naphthaldehyde (INH2HNA = H/sub 2/L/sup 2/ ) Cu/sup 2+/. selective and Ni/sup 2+/ -selective electrodes have been used to determine the copper and nickel ions in aqueous solutions, by both direct potentiometric and potentiometric titration with EDTA. They have also been used for determining the Cu/sup 2+/ and Ni/sup 2+/ ions in industrial waters by direct potentiometry. The analytical results obtained have been checked by the standard addition method and by comparison with determinations through atomic absorption spectrometry. (author)

A selective potentiometric copper (II) ion sensor based on the functionalized ZnO nanorods.

Science.gov (United States)

Khun, K; Ibupoto, Z H; Liu, X; Nur, O; Willander, M; Danielsson, B

2014-09-01

In this work, ZnO nanorods were hydrothermally grown on the gold-coated glass substrate and characterized by field emission scanning electron microscopy (FESEM) and X-ray diffraction (XRD) techniques. The ZnO nanorods were functionalized by two different approaches and performance of the sensor electrode was monitored. Fourier transform infrared spectroscopy (FTIR) was carried out for the confirmation of interaction between the ionophore molecules and ZnO nanorods. In addition to this, the surface of the electrode was characterized by X-ray photoelectron spectroscopy (XPS) showing the chemical and electronic state of the ionophore and ZnO nanorod components. The ionophore solution was prepared in the stabilizer, poly vinyl chloride (PVC) and additives, and then functionalized on the ZnO nanorods that have shown the Nernstian response with the slope of 31 mV/decade. However, the Cu2+ ion sensor was fabricated only by immobilizing the selective copper ion ionophore membrane without the use of PVC, plasticizers, additives and stabilizers and the sensor electrode showed a linear potentiometric response with a slope of 56.4 mV/decade within a large dynamic concentration range (from 1.0 x 10(-6) to 1.0 x 10(-1) M) of copper (II) nitrate solutions. The sensor showed excellent repeatability and reproducibility with response time of less than 10 s. The negligible response to potentially interfering metal ions such as calcium (Ca2+), magnesium (Mg2+), potassium (K+), iron (Fe3+), zinc (Zn2+), and sodium (Na+) allows this sensor to be used in biological studies. It may also be used as an indicator electrode in the potentiometric titration.

Copper removal from acid mine drainage-polluted water using glutaraldehyde-polyethyleneimine modified diatomaceous earth particles

Directory of Open Access Journals (Sweden)

Mikael Larsson

2018-02-01

Full Text Available Mine waters and tailings generated from mining and mineral processing activities often have detrimental impact on the local environment. One example is acid mine drainage, in which sulphides in the mining waste react with water and oxygen to produce an acidic environment that subsequently dissolves host rock minerals from the waste containing toxic metals and trace elements. Copper is one such metal of significance, as it is mined at large volumes in sulphide containing ores. It has strong biocidal activity that greatly affects ecosystems. We have previously reported that glutaraldehyde (GA-crosslinked polyethyleneimine (PEI has strong affinity and selectivity for copper and that diatomaceous earth (DE particles can be modified with the material to form a copper-extraction resin. In this study, the copper uptake of GA-PEI-DE particles was investigated from synthetic and real acid mine drainage samples under different pHs and their copper removal performance was compared with that of selected commercial resins. The results revealed that copper could effectively and preferentially bind to the material at pH 4, and that the copper could be completely eluted by lowering of the pH. In addition, effective copper uptake and elution was demonstrated using real legacy acid mine drainage water from Mount Lyell in Tasmania.

Removal of brownish-black tarnish on silver–copper alloy objects with sodium glycinate

Energy Technology Data Exchange (ETDEWEB)

Cura D’Ars de Figueiredo, João, E-mail: joaoc@ufmg.br; Asevedo, Samara Santos, E-mail: samaranix@hotmail.com; Barbosa, João Henrique Ribeiro, E-mail: joaohrb@yahoo.com.br

2014-10-30

Highlights: • The use of glycinate to remove brownish-black tarnish on silver–copper alloy objects is studied. • The method is easy to use and harmless. It is based in the coordination of Ag and Cu in tarnish with glycinate. • The surface of corroded silver objects and products of reaction were studied and glycinate showed to be very selective for Ag(I) and Cu(II). The selectivity for Ag(I) was studied by means of quantum chemical calculations. - Abstract: This article has the principal aim of presenting a new method of chemical cleaning of tarnished silver–copper alloy objects. The chemical cleaning must be harmless to the health, selective to tarnish removal, and easy to use. Sodium glycinate was selected for the study. The reactions of sodium glycinate with tarnish and the silver–copper alloy were evaluated. Products of the reaction, the lixiviated material, and the esthetics of silver–copper alloy coins (used as prototypes) were studied to evaluate if the proposed method can be applied to the cleaning of silver objects. Silver–copper alloys can be deteriorated through a uniform and superficial corrosion process that produces brownish-black tarnish. This tarnish alters the esthetic of the object. The cleaning of artistic and archeological objects requires more caution than regular cleaning, and it must take into account the procedures for the conservation and restoration of cultural heritage. There are different methods for cleaning silver–copper alloy objects, chemical cleaning is one of them. We studied two chemical cleaning methods that use sodium glycinate and sodium acetylglycinate solutions. Silver–copper alloy coins were artificially corroded in a basic thiourea solution and immersed in solutions of sodium glycinate and sodium acetylglycinate. After immersion, optical microscopy and scanning electron microscopy of the surfaces were studied. The sodium glycinate solution was shown to be very efficient in removing the brownish

Removal of brownish-black tarnish on silver–copper alloy objects with sodium glycinate

International Nuclear Information System (INIS)

Cura D’Ars de Figueiredo, João; Asevedo, Samara Santos; Barbosa, João Henrique Ribeiro

2014-01-01

Highlights: • The use of glycinate to remove brownish-black tarnish on silver–copper alloy objects is studied. • The method is easy to use and harmless. It is based in the coordination of Ag and Cu in tarnish with glycinate. • The surface of corroded silver objects and products of reaction were studied and glycinate showed to be very selective for Ag(I) and Cu(II). The selectivity for Ag(I) was studied by means of quantum chemical calculations. - Abstract: This article has the principal aim of presenting a new method of chemical cleaning of tarnished silver–copper alloy objects. The chemical cleaning must be harmless to the health, selective to tarnish removal, and easy to use. Sodium glycinate was selected for the study. The reactions of sodium glycinate with tarnish and the silver–copper alloy were evaluated. Products of the reaction, the lixiviated material, and the esthetics of silver–copper alloy coins (used as prototypes) were studied to evaluate if the proposed method can be applied to the cleaning of silver objects. Silver–copper alloys can be deteriorated through a uniform and superficial corrosion process that produces brownish-black tarnish. This tarnish alters the esthetic of the object. The cleaning of artistic and archeological objects requires more caution than regular cleaning, and it must take into account the procedures for the conservation and restoration of cultural heritage. There are different methods for cleaning silver–copper alloy objects, chemical cleaning is one of them. We studied two chemical cleaning methods that use sodium glycinate and sodium acetylglycinate solutions. Silver–copper alloy coins were artificially corroded in a basic thiourea solution and immersed in solutions of sodium glycinate and sodium acetylglycinate. After immersion, optical microscopy and scanning electron microscopy of the surfaces were studied. The sodium glycinate solution was shown to be very efficient in removing the brownish

Yeast Starter as a Biotechnological Tool for Reducing Copper Content in Wine

Directory of Open Access Journals (Sweden)

Angela Capece

2018-01-01

Full Text Available Copper is widely used in agriculture as a traditional fungicide in organic farming to control downy mildew on grapes, consequently it is possible to find this metal during all stages of the vinification process. Low amounts of copper play a key role on the function of key cell enzymes, whereas excess quantities can exert amount-dependent cytotoxicity, resulting in general cellular damage. Nowadays the excessive copper ions in wines is removed by addition of adsorbents, but these additives can influence the sensory characteristics of wine, as well as detrimental to the health of consumers. It is well known that high concentrations of Cu2+ can be toxic to yeasts, inhibiting growth and activity, causing sluggish fermentation and reducing alcohol production. In this study, 47 S. cerevisiae strains were tested for copper tolerance by two different tests, growth on copper added medium and fermentative activity in copper added grape must. The results obtained by the two different tests were comparable and the high strain variability found was used to select four wild strains, possessing this characteristic at the highest (PP1-13 and A20 and the lowest level (MPR2-24 and A13. The selected strains were tested in synthetic and natural grape must fermentation for ability to reduce copper content in wine. The determination of copper content in wines and yeast cells revealed that at the lowest copper residual in wine corresponded the highest content in yeast cells, indicating a strong strain ability to reduce the copper content in wine. This effect was inversely correlated with strain copper resistance and the most powerful strain in copper reduction was the most sensitive strain, MPR2-24. This wild strain was finally tested as starter culture in cellar pilot scale fermentation in comparison to a commercial starter, confirming the behavior exhibited at lab scale. The use of this wild strain to complete the alcoholic fermentation and remove the copper from

An experimental study on the effect of aqueous hypophosphite pre-treatment used on an Al-alloy substrate before electroless Ni plating

International Nuclear Information System (INIS)

Szirmai, G.; Toeroek, T.I.

2009-01-01

Complete text of publication follows. A new surface pre-treatment method is under development for electroless nickel plating, which appears to be an effective and environmentally benign treatment for the following deposition of a sound and high quality surface nickel coating with good adhesion. The aluminium substrate is immersed in a mildly acidic solution (lactic acid) of sodium hypophosphite in order to modify the passive surface and make it suitable for the reductive chemical precipitation of the nickel-phosphorus nuclei from the electroless nickel plating bath. During this novel pre-treatment procedure the surface adsorption of the hypophosphite anions might play an important role, therefore, several advanced surface testing and analytical techniques (SEM-EPMA-EDXRS, TEM, XPS) were applied in order to monitor and characterize the surface reactions and adsorption phenomena taking place during the pre-treatment. For the XPS study a home built XPS machine was applied.The Al excited XPS (studying P 2s, P 2p, O 1s, C 1s, Al 2p, Ni 2p photoelectron lines) proved to be one of the most powerful technique in the identification of the chemical species formed and present on the surfaces examined in this study. Acknowledgements One of the authors J.T. is indebted for the support of the Hungarian Science Foundation OTKA: (No K67873).

Design of hypoxia-targeting radiopharmaceuticals: selective uptake of copper-64 complexes in hypoxic cells in vitro

International Nuclear Information System (INIS)

Dearling, J.L.J.; Lewis, J.S.; Mullen, G.E.D.; Rae, M.T.; Zweit, J.; Blower, P.J.

1998-01-01

The well-known perfusion tracer CuPTSM, labelled with 62 Cu or 64 Cu, is believed to be trapped in cells non-selectively by a bioreductive mechanism. It is proposed that by modifying the ligand to increase its electron donor strength (for example by adding alkyl functionality or replacing sulphur ligands with oxygen ligands), the copper complexes will become less easily reduced and tracers with selectivity for hypoxic tissues could thus be developed. The aim of this work was to prepare 64 Cu-labelled complexes of two series of ligands, based on the bis(thiosemicarbazone) (13 ligands) and bis(salicylaldimine) (3 ligands) skeletons, and to evaluate the hypoxia dependence of their uptake in cells. The complexes were incubated with Chinese hamster ovary cells under normoxic and hypoxic conditions, and the cells isolated by centrifugation to determine radioactivity uptake at various time points up to 90 min. Several members of both series demonstrated significant (P 60 Cu, 61 Cu, 62 Cu, 64 Cu) and targeted radiotherapy ( 64 Cu, 67 Cu). (orig.)

Electrical conduction in composites containing copper core-copper

Indian Academy of Sciences (India)

Composites of nanometre-sized copper core-copper oxide shell with diameters in the range 6.1 to 7.3 nm dispersed in a silica gel were synthesised by a technique comprising reduction followed by oxidation of a suitably chosen precursor gel. The hot pressed gel powders mixed with nanometre-sized copper particles ...

Selective adsorption of silver(I) ions over copper(II) ions on a sulfoethyl derivative of chitosan.

Science.gov (United States)

Petrova, Yulia S; Pestov, Alexandr V; Usoltseva, Maria K; Neudachina, Ludmila K

2015-12-15

This study presents a simple and effective method of preparation of N-(2-sulfoethyl) chitosan (NSE-chitosan) that allows obtaining a product with a degree of modification up to 1.0. The chemical structure of the obtained polymers was confirmed by FT-IR and 1H NMR spectroscopies. Cross-linking of N-(2-sulfoethyl) chitosans by glutaraldehyde allows preparation of sorbents for removal and concentration of metal ions. Capacity of sorbents towards hydroxide ions was determined depending on the degree of sulfoethylation under static and dynamic conditions. Dissociation constants of functional amino groups of the analyzed sorbents were determined by potentiometric titration. It was shown that basicity of the amino groups decreased (wherein pKa decreased from 6.53 to 5.67) with increase in degree of sulfoethylation. It explains the significant influence of sulfo groups on selectivity of sorption of metal ions on N-(2-sulfoethyl) chitosan-based sorbents. The investigated substances selectively remove copper(II) and silver(I) ions from solutions of complex composition. Wherein the selectivity coefficient KAg/Cu increased to 20 (pH 6.5, ammonium acetate buffer solution) with increase in degree of sulfoethylation of the sorbent up to 1.0. Copyright © 2015 Elsevier B.V. All rights reserved.

Development of Copper Canister through Cold Sprayed Coating Method

Energy Technology Data Exchange (ETDEWEB)

Lee, Min Soo; Choi, Jong Won; Choi, Heui Joo; Lee, Jong Youl; Jeong, Jong Tae; Kim, Sung Ki; Cho, Dong Keun

2007-12-15

General thickness of a copper canister is 5 cm for a underground disposal application. The lower limit of a thickness is determined by a forging technology. But many experts in this area agrees that the thickness 1 cm is enough at the underground disposal for the life time of 1,000,000 years. Thus new technology is suggested for the making 1 cm thickness copper canister, that is a cold spray coating method(CSC). In this report, the CSC is examined and the technical possibility for making copper canister is measured. The overview of CSC and its characteristics are discussed. Various copper particles for the CSC are analyzed and the formed coating layers are examined to find their porosity and uniformity. A Tafa copper particle and Chang-sung copper particle are selected for making 1 cm thick test specimen. Using the CSC specimens, tensile test and XRD analysis are performed. As a corrosion evaluation, a electrochemical test such as a polarization test is done, together with humid corrosion test and chloric acid immersion test. Through the corrosion tests, it is tried to confirm that the CSC is valuable method for making a copper canister. Consequently, it is confirmed that the CSC method is very usful for making 1 cm thick copper canister. the porosity of CSC layer is very low at 0.3 in case of Tafa copper layer. In corrosion tests, the CSC layers are very stable in active environments. It is hard to say that the difference of processing method but the purity of copper is important for the corrosion rate evaluation. The CSC method is very effective method for making 1 cm thick copper canister, It is hoped that the CSC method is applied in a HLW underground disposal system in the future.

Development of Copper Canister through Cold Sprayed Coating Method

International Nuclear Information System (INIS)

Lee, Min Soo; Choi, Jong Won; Choi, Heui Joo; Lee, Jong Youl; Jeong, Jong Tae; Kim, Sung Ki; Cho, Dong Keun

2007-12-01

General thickness of a copper canister is 5 cm for a underground disposal application. The lower limit of a thickness is determined by a forging technology. But many experts in this area agrees that the thickness 1 cm is enough at the underground disposal for the life time of 1,000,000 years. Thus new technology is suggested for the making 1 cm thickness copper canister, that is a cold spray coating method(CSC). In this report, the CSC is examined and the technical possibility for making copper canister is measured. The overview of CSC and its characteristics are discussed. Various copper particles for the CSC are analyzed and the formed coating layers are examined to find their porosity and uniformity. A Tafa copper particle and Chang-sung copper particle are selected for making 1 cm thick test specimen. Using the CSC specimens, tensile test and XRD analysis are performed. As a corrosion evaluation, a electrochemical test such as a polarization test is done, together with humid corrosion test and chloric acid immersion test. Through the corrosion tests, it is tried to confirm that the CSC is valuable method for making a copper canister. Consequently, it is confirmed that the CSC method is very usful for making 1 cm thick copper canister. the porosity of CSC layer is very low at 0.3 in case of Tafa copper layer. In corrosion tests, the CSC layers are very stable in active environments. It is hard to say that the difference of processing method but the purity of copper is important for the corrosion rate evaluation. The CSC method is very effective method for making 1 cm thick copper canister, It is hoped that the CSC method is applied in a HLW underground disposal system in the future

Fabrication and characterization of Ni-decorated h-BN powders with ChCl-EG ionic liquid as addition by electroless deposition

Science.gov (United States)

Yang, Qionglian; Ru, Juanjian; Song, Peng; Hu, Mingyu; Feng, Jing

2018-05-01

Ni-decorated h-BN powders are fabricated with ChCl-EG as additive via electroless plating in the paper. As comparison, the different additive concentration of choline chloride-ethylene glycol (ChCl-EG) ionic liquid (0 g l-1, 30 g l-1, 60 g l-1, 90 g l-1) is presented. The effects of ChCl-EG concentration are studied, including the surface morphologies, phase analysis of Ni-decorated h-BN powders and the residual Ni2+ concentration is measured in electroless plating bath. It is demonstrated that the deposition phenomena of nickel particles on h-BN surface is changed with the addition of ChCl-EG. When the concentration of ChCl-EG is 30 g l-1, the Ni particles on h-BN surface are in dispersed and spheroid state with the average size of 10-1000 nm. It can be found that 30 g l-1 ChCl-EG is conducive to the arise of deposition phenomena, which is the formation of the single nickel particle on h-BN surface. Besides, more Ni particles are deposited on h-BN surface with the increase of nickel plating times, which is characterized with scanning electron microscope and transmission electron microscope. Furthermore, the deposition phenomenon and growth mechanism are proposed without and with ChCl-EG as additive to further elaborate the formation of Ni particles on h-BN surface.

Fabrication and characterization of Ni-decorated h-BN powders with ChCl-EG ionic liquid as addition by electroless deposition.

Science.gov (United States)

Yang, Qionglian; Ru, Juanjian; Song, Peng; Hu, Mingyu; Feng, Jing

2018-05-01

Ni-decorated h-BN powders are fabricated with ChCl-EG as additive via electroless plating in the paper. As comparison, the different additive concentration of choline chloride-ethylene glycol (ChCl-EG) ionic liquid (0 g l -1 , 30 g l -1 , 60 g l -1 , 90 g l -1 ) is presented. The effects of ChCl-EG concentration are studied, including the surface morphologies, phase analysis of Ni-decorated h-BN powders and the residual Ni 2+ concentration is measured in electroless plating bath. It is demonstrated that the deposition phenomena of nickel particles on h-BN surface is changed with the addition of ChCl-EG. When the concentration of ChCl-EG is 30 g l -1 , the Ni particles on h-BN surface are in dispersed and spheroid state with the average size of 10-1000 nm. It can be found that 30 g l -1 ChCl-EG is conducive to the arise of deposition phenomena, which is the formation of the single nickel particle on h-BN surface. Besides, more Ni particles are deposited on h-BN surface with the increase of nickel plating times, which is characterized with scanning electron microscope and transmission electron microscope. Furthermore, the deposition phenomenon and growth mechanism are proposed without and with ChCl-EG as additive to further elaborate the formation of Ni particles on h-BN surface.

Quantitative Mineral Resource Assessment of Copper, Molybdenum, Gold, and Silver in Undiscovered Porphyry Copper Deposits in the Andes Mountains of South America

Science.gov (United States)

Cunningham, Charles G.; Zappettini, Eduardo O.; Vivallo S., Waldo; Celada, Carlos Mario; Quispe, Jorge; Singer, Donald A.; Briskey, Joseph A.; Sutphin, David M.; Gajardo M., Mariano; Diaz, Alejandro; Portigliati, Carlos; Berger, Vladimir I.; Carrasco, Rodrigo; Schulz, Klaus J.

2008-01-01

Quantitative information on the general locations and amounts of undiscovered porphyry copper resources of the world is important to exploration managers, land-use and environmental planners, economists, and policy makers. This publication contains the results of probabilistic estimates of the amounts of copper (Cu), molybdenum (Mo), gold (Au), and silver (Ag) in undiscovered porphyry copper deposits in the Andes Mountains of South America. The methodology used to make these estimates is called the 'Three-Part Form'. It was developed to explicitly express estimates of undiscovered resources and associated uncertainty in a form that allows economic analysis and is useful to decisionmakers. The three-part form of assessment includes: (1) delineation of tracts of land where the geology is permissive for porphyry copper deposits to form; (2) selection of grade and tonnage models appropriate for estimating grades and tonnages of the undiscovered porphyry copper deposits in each tract; and (3) estimation of the number of undiscovered porphyry copper deposits in each tract consistent with the grade and tonnage model. A Monte Carlo simulation computer program (EMINERS) was used to combine the probability distributions of the estimated number of undiscovered deposits, the grades, and the tonnages of the selected model to obtain the probability distributions for undiscovered metals in each tract. These distributions of grades and tonnages then can be used to conduct economic evaluations of undiscovered resources in a format usable by decisionmakers. Economic evaluations are not part of this report. The results of this assessment are presented in two principal parts. The first part identifies 26 regional tracts of land where the geology is permissive for the occurrence of undiscovered porphyry copper deposits of Phanerozoic age to a depth of 1 km below the Earth's surface. These tracts are believed to contain most of South America's undiscovered resources of copper. The

Copper-based nanoparticles prepared from copper (II acetate bipyridine complex

Directory of Open Access Journals (Sweden)

Lastovina Tatiana A.

2016-01-01

Full Text Available We report the synthesis of CuO, Cu/Cu2O and Cu2O/CuO nanoparticles (NPs from the single copper (II acetate bipyridine complex by three different methods:microwave-assisted, solvothermal and borohydride. Presence of bipyridine ligand in the copper complex would impose no need in additional stabilization during synthesis. The phases of formed NPs were identified by X-ray diffraction. CuO NPs of ~11 nm were obtained via solvothermal synthesis from alkaline solution at 160°C. The Cu/Cu2O NPs of ~80 nm were produced via microwave-assisted polyol procedure at 185-200°C, where ethylene glycol can play a triple role as a solvent, a reducing agent and a surfactant. The Cu2O/CuO NPs of ~16 nm were synthesized by a borohydride method at room temperature. Interplanar spacing calculated from the selected-area electron diffraction data confirmed the formation of Cu, CuO and Cu2O phases in respective samples. All NPs are stable and can be used for various applications including biomedicine.

Microwave-Assisted Selective Hydrogenation of Furfural to Furfuryl Alcohol Employing a Green and Noble Metal-Free Copper Catalyst.

Science.gov (United States)

Romano, Pedro N; de Almeida, João M A R; Carvalho, Yuri; Priecel, Peter; Falabella Sousa-Aguiar, Eduardo; Lopez-Sanchez, Jose A

2016-12-20

Green, inexpensive, and robust copper-based heterogeneous catalysts achieve 100 % conversion and 99 % selectivity in the conversion of furfural to furfuryl alcohol when using cyclopentyl-methyl ether as green solvent and microwave reactors at low H 2 pressures and mild temperatures. The utilization of pressurized microwave reactors produces a 3-4 fold increase in conversion and an unexpected enhancement in selectivity as compared to the reaction carried out at the same conditions using conventional autoclave reactors. The enhancement in catalytic rate produced by microwave irradiation is temperature dependent. This work highlights that using microwave irradiation in the catalytic hydrogenation of biomass-derived compounds is a very strong tool for biomass upgrade that offers immense potential in a large number of transformations where it could be a determining factor for commercial exploitation. © 2016 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

Reagent conditions of the flotation of copper, copper - molybdenum and copper -zinc ores in foreing countries

International Nuclear Information System (INIS)

Nevaeva, L.M.

1983-01-01

Reagents-collectors and frothers, used abroad in reagent regimes of flotation of copper, copper-molybdenum and copper zinc ores, have been considered. Xanthogenates, aerofloats, xanthogenformiates, thionocarbamates are mainly used as reagents-collectors. Methylizobutylcarbinol and Daufros are used as reagents-frothers

Electroless nickel plating of arc discharge synthesized carbon nanotubes for metal matrix composites

Science.gov (United States)

Jagannatham, M.; Sankaran, S.; Prathap, Haridoss

2015-01-01

Electroless nickel (EN) plating was performed on arc discharge synthesized multiwalled carbon nanotubes for various deposition times. X-ray diffraction (XRD), Transmission electron microscopy (TEM), and Raman spectroscopy characterization techniques are used to identify the presence of nickel deposition on the carbon nanotubes (CNTs) and the degree of graphitization. The results indicate that impurities are less in the purified CNTs as compared to raw carbon soot. Increasing deposition time up to 60 min increases uniform deposition of nickel throughout the length of the CNTs. However, for deposition time longer than 60 min, nickel particles are seen separated from the surface of the CNTs. Uniformly coated nickel CNTs throughout their length are potential candidates for reinforcements in composite materials. Magnetic properties of the nickel coated CNTs, with deposition time of 30 and 60 min were also evaluated. The magnetic saturation of nickel coated CNTs with deposition time of 30 min is less compared to nickel coated CNTs with deposition time of 60 min.

Performance comparison of small-pixel CdZnTe radiation detectors with gold contacts formed by sputter and electroless deposition

Science.gov (United States)

Bell, S. J.; Baker, M. A.; Duarte, D. D.; Schneider, A.; Seller, P.; Sellin, P. J.; Veale, M. C.; Wilson, M. D.

2017-06-01

Recent improvements in the growth of wide-bandgap semiconductors, such as cadmium zinc telluride (CdZnTe or CZT), has enabled spectroscopic X/γ-ray imaging detectors to be developed. These detectors have applications covering homeland security, industrial analysis, space science and medical imaging. At the Rutherford Appleton Laboratory (RAL) a promising range of spectroscopic, position sensitive, small-pixel Cd(Zn)Te detectors have been developed. The challenge now is to improve the quality of metal contacts on CdZnTe in order to meet the demanding energy and spatial resolution requirements of these applications. The choice of metal deposition method and fabrication process are of fundamental importance. Presented is a comparison of two CdZnTe detectors with contacts formed by sputter and electroless deposition. The detectors were fabricated with a 74 × 74 array of 200 μm pixels on a 250 μm pitch and bump-bonded to the HEXITEC ASIC. The X/γ-ray emissions from an 241Am source were measured to form energy spectra for comparison. It was found that the detector with contacts formed by electroless deposition produced the best uniformity and energy resolution; the best pixel produced a FWHM of 560 eV at 59.54 keV and 50% of pixels produced a FWHM better than 1.7 keV . This compared with a FWHM of 1.5 keV for the best pixel and 50% of pixels better than 4.4 keV for the detector with sputtered contacts.

F F Sun

Indian Academy of Sciences (India)

Home; Journals; Bulletin of Materials Science. F F Sun. Articles written in Bulletin of Materials Science. Volume 37 Issue 1 February 2014 pp 71-76. Study of electroless copper plating on ABS resin surface modified by heterocyclic organosilane self-assembled film · H N Zhang J Wang F F Sun D Liu H Y Wang F Wang.

Printed circuit board recycling: Physical processing and copper extraction by selective leaching.

Science.gov (United States)

Silvas, Flávia P C; Correa, Mónica M Jiménez; Caldas, Marcos P K; de Moraes, Viviane T; Espinosa, Denise C R; Tenório, Jorge A S

2015-12-01

Global generation of waste electrical and electronic equipment (WEEE) is about 40 million tons per year. Constant increase in WEEE generation added to international legislations has improved the development of processes for materials recovery and sustainability of electrical and electronic industry. This paper describes a new hydrometallurgical route (leaching process) to recycle printed circuit boards (PCBs) from printers to recover copper. Methodology included PCBs characterization and a combined route of physical and hydrometallurgical processing. Magnetic separation, acid digestion and chemical analysis by ICP-OES were performed. On leaching process were used two stages: the first one in a sulfuric media and the second in an oxidant media. The results showed that the PCBs composition was 74.6 wt.% of non-magnetic material and 25.4 wt.% of magnetic one. The metallic fraction corresponded to 44.0 wt.%, the polymeric to 28.5 wt.% and the ceramic to 27.5 wt.%. The main metal was copper and its initial content was 32.5 wt.%. On sulfuric leaching 90 wt.% of Al, 40 wt.% of Zn and 8.6 wt.% of Sn were extracted, whereas on oxidant leaching tests the extraction percentage of Cu was 100 wt.%, of Zn 60 wt.% and of Al 10 wt.%. At the end of the hydrometallurgical processing was obtained 100% of copper extraction and the recovery factor was 98.46%, which corresponds to a 32 kg of Cu in 100 kg of PCB. Copyright © 2015 Elsevier Ltd. All rights reserved.

Copper solubility in DWPF, Batch 1 waste glass: Update report

International Nuclear Information System (INIS)

Schumacker, R.F.

1992-01-01

The ''Late Washing'' Step in the processing of precipitate will require the use of additional copper formate in the Precipitate Reactor to catalyze the hydrolysis reaction. The increased copper concentration in the melter feed increases the potential for metal precipitation during the vitrification of the melter feed. This report describes recent results with a conservative glass selected from the DWPF acceptable region in the Batch 1 Variability Study

Is Copper Immune to Corrosion When in Contact With Water and Aqueous Solutions?

International Nuclear Information System (INIS)

Macdonald, Digby D.; Sharifi-Asl, Samin

2011-03-01

Objectives The aim of this project has been to increase knowledge and to contribute to the research community in the area of copper corrosion in a repository environment. For SSM, the most important subject is to provide better conditions for a science based evaluation of a repository for spent nuclear fuel. In this respect, this project aimed at conducting a comprehensive theoretical study on corrosion of copper in repository environment based on an expected composition of dissolved species in the groundwater in the Forsmark area. In addition the thermodynamic immunity of copper in pure anoxic water has been especially addressed as this was one of the initial conditions made by SKB for selecting copper as canister material. Results The authors have shown, in so-called corrosion Domain Diagrams, that copper in a thermodynamic sense can be considered as immune in pure anoxic water (without dissolved oxygen) only under certain conditions. It is shown that copper will corrode in pure anoxic water with very low concentrations of [Cu + ] and very low partial pressures of hydrogen gas. At higher concentrations of [Cu + ] and partial pressures of hydrogen, copper is found to be thermodynamically immune and will not corrode. The rate of copper corrosion in the repository water environment will thus depend on the transport of corrosion products away from the copper surface or the transport of corroding species to the copper surface. The degree to which this affects the corrosion of copper canisters in the repository environment has not been further studied. Still, the result shows that copper cannot be considered as thermodynamically immune in the presence of pure anoxic water, this implicate that one of SKB:s initial conditions for selecting copper as a canister material can be questioned. To what degree this may influence the corrosion of copper canisters in the repository environment still needs to be investigated. Of other species present in the water at repository

Is Copper Immune to Corrosion When in Contact With Water and Aqueous Solutions?

Energy Technology Data Exchange (ETDEWEB)

Macdonald, Digby D.; Sharifi-Asl, Samin (Pennsylvania State Univ., PA (United States). Center for Electrochemical Science and Technology, Dept. of Materials Science and Engineering)

2011-03-15

Objectives The aim of this project has been to increase knowledge and to contribute to the research community in the area of copper corrosion in a repository environment. For SSM, the most important subject is to provide better conditions for a science based evaluation of a repository for spent nuclear fuel. In this respect, this project aimed at conducting a comprehensive theoretical study on corrosion of copper in repository environment based on an expected composition of dissolved species in the groundwater in the Forsmark area. In addition the thermodynamic immunity of copper in pure anoxic water has been especially addressed as this was one of the initial conditions made by SKB for selecting copper as canister material. Results The authors have shown, in so-called corrosion Domain Diagrams, that copper in a thermodynamic sense can be considered as immune in pure anoxic water (without dissolved oxygen) only under certain conditions. It is shown that copper will corrode in pure anoxic water with very low concentrations of [Cu+] and very low partial pressures of hydrogen gas. At higher concentrations of [Cu+] and partial pressures of hydrogen, copper is found to be thermodynamically immune and will not corrode. The rate of copper corrosion in the repository water environment will thus depend on the transport of corrosion products away from the copper surface or the transport of corroding species to the copper surface. The degree to which this affects the corrosion of copper canisters in the repository environment has not been further studied. Still, the result shows that copper cannot be considered as thermodynamically immune in the presence of pure anoxic water, this implicate that one of SKB:s initial conditions for selecting copper as a canister material can be questioned. To what degree this may influence the corrosion of copper canisters in the repository environment still needs to be investigated. Of other species present in the water at repository depth in

Electroless deposition of nickel-boron coatings using low frequency ultrasonic agitation: Effect of ultrasonic frequency on the coatings.

Science.gov (United States)

Bonin, L; Bains, N; Vitry, V; Cobley, A J

2017-05-01

The effect of ultrasound on the properties of Nickel-Boron (NiB) coatings was investigated. NiB coatings were fabricated by electroless deposition using either ultrasonic or mechanical agitation. The deposition of Ni occurred in an aqueous bath containing a reducible metal salt (nickel chloride), reducing agent (sodium borohydride), complexing agent (ethylenediamine) and stabilizer (lead tungstate). Due to the instability of the borohydride in acidic, neutral and slightly alkaline media, pH was controlled at pH 12±1 in order to avoid destabilizing the bath. Deposition was performed in three different configurations: one with a classical mechanical agitation at 300rpm and the other two employing ultrasound at a frequency of either 20 or 35kHz. The microstructures of the electroless coatings were characterized by a combination of optical Microscopy and Scanning Electron Microscope (SEM). The chemistry of the coatings was determined by ICP-AES (Inductively Coupled Plasma - Atomic Emission Spectrometry) after dissolution in aqua regia. The mechanical properties of the coatings were established by a combination of roughness measurements, Vickers microhardness and pin-on-disk tribology tests. Lastly, the corrosion properties were analysed by potentiodynamic polarization. The results showed that low frequency ultrasonic agitation could be used to produce coatings from an alkaline NiB bath and that the thickness of coatings obtained could be increased by over 50% compared to those produced using mechanical agitation. Although ultrasonic agitation produced a smoother coating and some alteration of the deposit morphology was observed, the mechanical and corrosion properties were very similar to those found when using mechanical agitation. Copyright © 2017 Elsevier B.V. All rights reserved.

Electroless plating of low-resistivity Cu–Mn alloy thin films with self-forming capacity and enhanced thermal stability

Energy Technology Data Exchange (ETDEWEB)

Chen, Sung-Te, E-mail: stchen@mail.hust.edu.tw [Department of Electronic Engineering, Hsiuping University of Science and Technology, Dali 412, Taichung, Taiwan (China); Chen, Giin-Shan [Department of Materials Science and Engineering, Feng Chia University, Seatwen 407, Taichung, Taiwan (China)

2015-11-05

Previous studies have typically used sputter deposition to fabricate Cu–Mn alloy thin films with concentrated solute additions which have exceeded several atomic percentages, and the electrical resistivity values of the resultant films from previous studies are relatively high, ranging from 2.5 to 3.5 μΩ-cm. Herein, we proposed a different approach by using electroless process to plate dilute Cu–Mn (0.1 at.%) alloy thin films on dielectric layers (SiO{sub 2}). Upon forming-gas annealing, the Mn incorporated into Cu–Mn films was segregated toward the SiO{sub 2} side, eventually converting itself into a few atomic layer thickness at the Cu/SiO{sub 2} interface, and forming films with a low level of resistivity the same as that of pure Cu films (2.0 μΩ-cm). The interfacial layer served as not only a diffusion barrier, but also an adhesion promoter that prevented the film’s agglomeration during annealing at elevated temperatures. The mechanism for the dual-function performance by the Mn addition was elucidated by interfacial bonding analysis, as well as dynamic (adhesive strength) and thermodynamic (surface-tension) measurements. - Highlights: • Electroless plating is proposed to grow dilute (0.1%) Cu–Mn films on SiO{sub 2} layers. • Adequate annealing results in a self-forming of MnO{sub x} at the Cu/SiO{sub 2} interface. • The role of interfacial MnO{sub x} as a barrier and adhesion promoter is demonstrated. • The treated dilute film has a low ρ level of pure Cu, in contrast to concentrated films. • Its potential as a single entity replacement of Cu interconnect is presented.

Preparation of metal nanoband microelectrode on poly(dimethylsiloxane) for chip-based amperometric detection

Energy Technology Data Exchange (ETDEWEB)

Chen Shaopeng; Wu Jian; Yu Xiaodong [Key Laboratory of Analytical Chemistry for Life Science, Ministry of Education of China, School of Chemistry and Chemical Engineering, Nanjing University, Nanjing 210093 (China); Xu Jingjuan, E-mail: xujj@nju.edu.cn [Key Laboratory of Analytical Chemistry for Life Science, Ministry of Education of China, School of Chemistry and Chemical Engineering, Nanjing University, Nanjing 210093 (China); Chen Hongyuan [Key Laboratory of Analytical Chemistry for Life Science, Ministry of Education of China, School of Chemistry and Chemical Engineering, Nanjing University, Nanjing 210093 (China)

2010-04-30

We proposed herein a novel approach for fabricating nanoband microelectrodes for electrochemical detection on an electrophoresis microchip. The metal films were first obtained via region-selective electroless deposition of gold or copper films on PDMS substrates by selective region plasma oxidation through shadow masking. Both metal films show uniform surfaces with the thickness at the level of 100 nm. By casting another PDMS layer on the metal films, the cross section of the sandwich structures can be used as nanoband microelectrodes, which can be renewed just by cutting. These nanoband microelectrodes are successfully used as electrochemical detectors in microchip electrophoresis for the detection of amino acids, proteins and neurotransmitter molecules. Moreover, integrating an Au-Cu double-metal detector with a double-channel electrophoresis system, we can easily distinguish electroactive amino acids from that of non-electroactive amino acids.

Electroless formation of hybrid lithium anodes for fast interfacial ion transport

Energy Technology Data Exchange (ETDEWEB)

Choudhury, Snehashis; Stalin, Sanjuna; Vu, Duylinh; Fawole, Kristen; Archer, Lynden A. [School of Chemical and Biomolecular Engineering, Cornell University, Ithaca, NY (United States); Tu, Zhengyuan [Department of Material Science and Engineering, Cornell University, Ithaca, NY (United States); Gunceler, Deniz [Department of Physics, Cornell University, Ithaca, NY (United States); Sundararaman, Ravishankar [Material Science and Engineering, Rensselaer Polytechnic Institute, Troy, NY (United States)

2017-10-09

Rechargeable batteries based on metallic anodes are of interest for fundamental and application-focused studies of chemical and physical kinetics of liquids at solid interfaces. Approaches that allow facile creation of uniform coatings on these metals to prevent physical contact with liquid electrolytes, while enabling fast ion transport, are essential to address chemical instability of the anodes. Here, we report a simple electroless ion-exchange chemistry for creating coatings of indium on lithium. By means of joint density functional theory and interfacial characterization experiments, we show that In coatings stabilize Li by multiple processes, including exceptionally fast surface diffusion of lithium ions and high chemical resistance to liquid electrolytes. Indium coatings also undergo reversible alloying reactions with lithium ions, facilitating design of high-capacity hybrid In-Li anodes that use both alloying and plating approaches for charge storage. By means of direct visualization, we further show that the coatings enable remarkably compact and uniform electrodeposition. The resultant In-Li anodes are shown to exhibit minimal capacity fade in extended galvanostatic cycling when paired with commercial-grade cathodes. (copyright 2017 Wiley-VCH Verlag GmbH and Co. KGaA, Weinheim)

Electrical resistivity and dielectric properties of helical microorganism cells coated with silver by electroless plating

Energy Technology Data Exchange (ETDEWEB)

Cai, Jun, E-mail: jun_cai@buaa.edu.cn [Bionic and Micro/Nano/Bio Manufacturing Technology Research Center, School of Mechanical Engineering and Automation, Beihang University, Beijing 100191 (China); Lan, Mingming; Zhang, Deyuan; Zhang, Wenqiang [Bionic and Micro/Nano/Bio Manufacturing Technology Research Center, School of Mechanical Engineering and Automation, Beihang University, Beijing 100191 (China)

2012-09-01

Highlights: Black-Right-Pointing-Pointer We use the microorganism cells as forming templates to fabricate the bio-based conductive particles. Black-Right-Pointing-Pointer The microorganism cells selected as forming templates are Spirulina platens, which are of natural helical shape and high aspect ratio. Black-Right-Pointing-Pointer The sliver-coated Spirulina cells are a kind of lightweight conductive particles. Black-Right-Pointing-Pointer The composites containing sliver-coated Spirulina cells exhibit a lower percolation value. - Abstract: In this paper, microorganism cells (Spirulina platens) were used as forming templates for the fabrication of the helical functional particles by electroless silver plating process. The morphologies and ingredients of the coated Spirulina cells were analyzed with scanning electron microscopy and energy dispersive spectrometer. The crystal structures were characterized by employing the X-ray diffraction. The electrical resistivity and dielectric properties of samples containing different volume faction of sliver-coated Spirulina cells were measured and investigated by four-probe meter and vector network analyzer. The results showed that the Spirulina cells were successfully coated with a uniform silver coating and their initial helical shapes were perfectly kept. The electrical resistivity and dielectric properties of the samples had a strong dependence on the volume content of sliver-coated Spirulina cells and the samples could achieve a low percolation value owing to high aspect ratio and preferable helical shape of Spirulina cells. Furthermore, the conductive mechanism was analyzed with the classic percolation theory, and the values of {phi}{sub c} and t were obtained.

Storing drinking-water in copper pots kills contaminating diarrhoeagenic bacteria.

Science.gov (United States)

Sudha, V B Preethi; Ganesan, Sheeba; Pazhani, G P; Ramamurthy, T; Nair, G B; Venkatasubramanian, Padma

2012-03-01

Microbially-unsafe water is still a major concern in most developing countries. Although many water-purification methods exist, these are expensive and beyond the reach of many people, especially in rural areas. Ayurveda recommends the use of copper for storing drinking-water. Therefore, the objective of this study was to evaluate the effect of copper pot on microbially-contaminated drinking-water. The antibacterial effect of copper pot against important diarrhoeagenic bacteria, including Vibrio cholerae O1, Shigella flexneri 2a, enterotoxigenic Escherichia coli, enteropathogenic E. coli, Salmonella enterica Typhi, and Salmonella Paratyphi is reported. When drinking-water (pH 7.83 +/- 0.4; source: ground) was contaminated with 500 CFU/mL of the above bacteria and stored in copper pots for 16 hours at room temperature, no bacteria could be recovered on the culture medium. Recovery failed even after resuscitation in enrichment broth, followed by plating on selective media, indicating loss of culturability. This is the first report on the effect of copper on S. flexneri 2a, enteropathogenic E. coli, and Salmonella Paratyphi. After 16 hours, there was a slight increase in the pH of water from 7.83 to 7.93 in the copper pots while the other physicochemical parameters remained unchanged. Copper content (177 +/- 16 ppb) in water stored in copper pots was well within the permissible limits of the World Health Organization. Copper holds promise as a point-of-use solution for microbial purification of drinking-water, especially in developing countries.

Improving Beneficiation of Copper and Iron from Copper Slag by Modifying the Molten Copper Slag

Directory of Open Access Journals (Sweden)

Zhengqi Guo

2016-04-01

Full Text Available In the paper, a new technology was developed to improve the beneficiation of copper and iron components from copper slag, by modifying the molten slag to promote the mineralization of valuable minerals and to induce the growth of mineral grains. Various parameters, including binary basicity, dosage of compound additive, modification temperature, cooling rate and the end point temperature of slow cooling were investigated. Meanwhile, optical microscope, scanning electron microscope and energy dispersive spectrometer (SEM-EDS was employed to determine the mineralogy of the modified and unmodified slag, as well as to reveal the mechanisms of enhancing beneficiation. The results show that under the proper conditions, the copper grade of rougher copper concentrate was increased from 6.43% to 11.04%, iron recovery of magnetic separation was increased significantly from 32.40% to 63.26%, and other evaluation indexes were changed slightly, in comparison with unmodified copper slag. Moreover, matte and magnetite grains in the modified slag aggregated together and grew obviously to the mean size of over 50 μm, resulting in an improvement of beneficiation of copper and iron.

Influence of load and temperature on tribological behaviour of electroless Ni-P deposits

Science.gov (United States)

Kundu, S.; Das, S. K.; Sahoo, P.

2016-09-01

Electroless Ni-P coatings have shown tremendous potential as tribology material at room temperature. However, the performance of the same in high temperature field needs to be evaluated as investigation reveals the softening of most of the coating materials. In the current study, both as-deposited as well as heat treated samples are developed for the performance evaluation. Coatings are tested under different loads with a constant speed and at temperatures ranging from room temperature (R.T.) to 500°C. Tribological tests are carried out on a pin-on- disc tribotester by selecting a wear track diameter of 60 mm for 5 minutes. Wear is reported in the form of wear rate by following Archard's equation. The microstructure characterization of the coating is performed using SEM (Scanning Electron Microscopy), EDX (Energy Dispersive X-Ray Analysis) and XRD (X-Ray Diffraction Analysis). Coating is developed with phosphorous weight percentages around 9% on cylindrical mild steel samples and the deposition thickness is observed to be around 50 μm. The as-deposited coating is found to be amorphous in nature and hardness of the as-deposited coating is found to be around 585HV01. Friction coefficient increases initially with the increase in temperature from room temperature up to 100°C but thereafter gradually decrease with the increase in temperature. Initial increase in temperature (up to 100°C) provides higher rate of wear compared to room temperature but with further increase it drops in most of the cases. Wear rate increases with the increase in temperature but as it crosses or nears the phase transformation temperature (around 340°C), the scenario gets reversed. From X-ray diffraction analysis, it is found that coating is amorphous in as-deposited condition but transforms into a crystalline structure with heat treatment.

21 CFR 73.1125 - Potassium sodium copper chloropyhllin (chlorophyllin-copper complex).

Science.gov (United States)

2010-04-01

... 21 Food and Drugs 1 2010-04-01 2010-04-01 false Potassium sodium copper chloropyhllin (chlorophyllin-copper complex). 73.1125 Section 73.1125 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT....1125 Potassium sodium copper chloropyhllin (chlorophyllin-copper complex). (a) Identity. (1) The color...

21 CFR 73.2125 - Potassium sodium copper chlorophyllin (chlorophyllin-copper complex).

Science.gov (United States)

2010-04-01

... 21 Food and Drugs 1 2010-04-01 2010-04-01 false Potassium sodium copper chlorophyllin (chlorophyllin-copper complex). 73.2125 Section 73.2125 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT... § 73.2125 Potassium sodium copper chlorophyllin (chlorophyllin-copper complex). (a) Identity and...

Experimental determinations of soil copper toxicity to lettuce (Lactuca sativa) growth in highly different copper spiked and aged soils

DEFF Research Database (Denmark)

Christiansen, Karen Søgaard; Borggaard, Ole K.; Holm, Peter Engelund

2015-01-01

Accurate knowledge about factors and conditions determining copper (Cu) toxicity in soil is needed for predicting plant growth in various Cu-contaminated soils. Therefore, effects of Cu on growth (biomass production) of lettuce (Lactuca sativa) were tested on seven selected, very different soils...

A study on the corrosion and erosion behavior of electroless nickel and TiAlN/ZrN duplex coatings on ductile iron

Energy Technology Data Exchange (ETDEWEB)

Lin, Chung-Kwei [School of Dental Technology, Taipei Medical University, Taipei 110, Taiwan (China); Hsu, Cheng-Hsun, E-mail: chhsu@ttu.edu.tw [Department of Materials Engineering, Tatung University, Taipei 104, Taiwan (China); College of Oral Medicine, Taipei Medical University, Taipei 110, Taiwan (China); Cheng, Yin-Hwa [Department of Materials Engineering, Tatung University, Taipei 104, Taiwan (China); Ou, Keng-Liang [College of Oral Medicine, Taipei Medical University, Taipei 110, Taiwan (China); Department of Mechanical Engineering, National Central University, Taoyuan 320, Taiwan (China); Lee, Sheng-Long [Research Center for Biomedical Devices and Prototyping Production, Taipei Medical University, Taipei 110, Taiwan (China)

2015-01-01

Highlights: • Electroless nickel was used as an interlayer for TiAlZrN-coated ductile iron. • The duplex coatings evidently improved corrosion resistance of ductile iron. • The duplex coated ductile iron showed a good erosion resistance. - Abstract: This study utilized electroless nickel (EN) and cathodic arc evaporation (CAE) technologies to deposit protective coatings onto ductile iron. Polarization corrosion tests were performed in 3.5 wt.% sodium chloride, and also erosion tests were carried out by using Al{sub 2}O{sub 3} particles (∼177 μm in size and Mohr 7 scale) of about 5 g. Surface morphologies of the corroded and eroded specimens were observed separately. To further understand the coating effects on both the corrosive and erosive behavior of ductile iron, coating structure, morphology, and adhesion were analyzed using X-ray diffractormeter, scanning electron microscopy, and Rockwell-C indenter, respectively. The results showed that the EN exhibited an amorphous structure while the CAE-TiAlN/ZrN coating was a multilayered nanocrystalline. When the TiAlN/ZrN coated specimen with EN interlayer could effectively increase the adhesion strength between the CAE coating and substrate. Consequently, the combination of TiAlN/ZrN and EN delivered a better performance than did the monolithic EN or TiAlN/ZrN for both corrosion and erosion protection.

A study on the corrosion and erosion behavior of electroless nickel and TiAlN/ZrN duplex coatings on ductile iron

International Nuclear Information System (INIS)

Lin, Chung-Kwei; Hsu, Cheng-Hsun; Cheng, Yin-Hwa; Ou, Keng-Liang; Lee, Sheng-Long

2015-01-01

Highlights: • Electroless nickel was used as an interlayer for TiAlZrN-coated ductile iron. • The duplex coatings evidently improved corrosion resistance of ductile iron. • The duplex coated ductile iron showed a good erosion resistance. - Abstract: This study utilized electroless nickel (EN) and cathodic arc evaporation (CAE) technologies to deposit protective coatings onto ductile iron. Polarization corrosion tests were performed in 3.5 wt.% sodium chloride, and also erosion tests were carried out by using Al 2 O 3 particles (∼177 μm in size and Mohr 7 scale) of about 5 g. Surface morphologies of the corroded and eroded specimens were observed separately. To further understand the coating effects on both the corrosive and erosive behavior of ductile iron, coating structure, morphology, and adhesion were analyzed using X-ray diffractormeter, scanning electron microscopy, and Rockwell-C indenter, respectively. The results showed that the EN exhibited an amorphous structure while the CAE-TiAlN/ZrN coating was a multilayered nanocrystalline. When the TiAlN/ZrN coated specimen with EN interlayer could effectively increase the adhesion strength between the CAE coating and substrate. Consequently, the combination of TiAlN/ZrN and EN delivered a better performance than did the monolithic EN or TiAlN/ZrN for both corrosion and erosion protection

Coordination Environment of Copper Sites in Cu-CHA Zeolite Investigated by Electron Paramagnetic Resonance

DEFF Research Database (Denmark)

Godiksen, Anita; Stappen, Frederick N.; Vennestrøm, Peter N. R.

2014-01-01

Cu-CHA combines high activity for the selective catalytic reduction (SCR) reaction with better hydrothermal stability and selectivity compared to other copper-substituted zeolites. At the same time Cu-CHA offers an opportunity for unraveling the coordination environment of the copper centers since...... the zeolite framework is very simple with only one crystallographically independent tetrahedral site (T-site). In this study the results of an X-band electron paramagnetic resonance (EPR) investigation of ion-exchanged Cu-CHA zeolite with a Si/Al ratio of 14 ± 1 is presented. Different dehydration treatments...... of the EPR silent monomeric Cu2+ in copper-substituted zeolites is suggested to be copper species with an approximate trigonal coordination sphere appearing during the dehydration. After complete dehydration at 250 °C the majority of the EPR silent Cu2+ is suggested to exist as Cu2+–OH– coordinated to two...

Influence of solutes on heavy ion induced void-swelling in binary copper alloys

International Nuclear Information System (INIS)

Leister, K.H.

1983-05-01

As radiation induced swelling of metals depends on their constitution, swelling of copper and copper alloys with low solute concentration is studied. Diffusion coefficients and solubility of solute in copper were used as criteria of selection of the alloys. The samples were irradiated by 200keV copper ions. Swelling and void densities were measured by transmission electron microscopy. The measurements show low dependence of swelling upon the diffusibility of the solute in the solvent and a strong dependence on their concentration. Alloys of 0.1at% solute show more swelling than pure copper, and alloys of 1at% show less swelling under the irradiation conditions. The different swelling behavior in Cu-Ni alloys is due to the different void densities. (orig.) [de

Thermal Properties of Polymethyl Methacrylate Composite Containing Copper Nanoparticles.

Science.gov (United States)

Yu, Wei; Xie, Huaqing; Xin, Sha; Yin, Junshan; Jiang, Yitong; Wang, Mingzhu

2015-04-01

Thermal functional Materials have wide applications in thermal management fields, and inserting highly thermal conductive materials is effective in enhancing thermal conductivity of matrix. In this paper, copper nanoparticles were selected as the additive to prepare polymethyl methacrylate (PMMA) based nanocomposite with enhanced thermal properties. Uniform copper nanoparticles with pure face-centered lattice were prepared by liquid phase reduction method. Then, they were added into PMMA/N, N-Dimethylmethanamide (DMF) solution according to the different mass fraction for uniform dispersion. After DMF was evaporated, Cu-PMMA nanocomposites were gained. The thermal analysis measurement results showed that the decomposition temperature of nanocomposites decreased gradually with the increasing particle loadings. The thermal conductivity of the Cu-PMMA nanocomposites rose with the increasing contents of copper nanoparticles. With a 20 vol.% addition, the thermal conductivity was up to 1.2 W/m · K, a 380.5% increase compared to the pure PMMA. The results demonstrate that copper nanoparticles have great potential in enhancing thermal transport properties of polymer.

Copper metabolism and its interactions with dietary iron, zinc, tin and selenium in rats

NARCIS (Netherlands)

Yu, S.

1993-01-01

This thesis describes various studies on copper metabolism and its interactions with selected dietary trace elements in rats. The rats were fed purified diets throughout. High intakes of iron or tin reduced copper concentrations in plasma, liver and kidneys. The dietary treatments also

Nickel, copper and cobalt coalescence in copper cliff converter slag

Directory of Open Access Journals (Sweden)

Wolf A.

2016-01-01

Full Text Available The aim of this investigation is to assess the effect of various additives on coalescence of nickel, copper and cobalt from slags generated during nickel extraction. The analyzed fluxes were silica and lime while examined reductants were pig iron, ferrosilicon and copper-silicon compound. Slag was settled at the different holding temperatures for various times in conditions that simulated the industrial environment. The newly formed matte and slag were characterized by their chemical composition and morphology. Silica flux generated higher partition coefficients for nickel and copper than the addition of lime. Additives used as reducing agents had higher valuable metal recovery rates and corresponding partition coefficients than fluxes. Microstructural studies showed that slag formed after adding reductants consisted of primarily fayalite, with some minute traces of magnetite as the secondary phase. Addition of 5 wt% of pig iron, ferrosilicon and copper-silicon alloys favored the formation of a metallized matte which increased Cu, Ni and Co recoveries. Addition of copper-silicon alloys with low silicon content was efficient in copper recovery but coalescence of the other metals was low. Slag treated with the ferrosilicon facilitated the highest cobalt recovery while copper-silicon alloys with silicon content above 10 wt% resulted in high coalescence of nickel and copper, 87 % and 72 % respectively.

Effects of copper on CHO cells: cellular requirements and product quality considerations.

Science.gov (United States)

Yuk, Inn H; Russell, Stephen; Tang, Yun; Hsu, Wei-Ting; Mauger, Jacob B; Aulakh, Rigzen P S; Luo, Jun; Gawlitzek, Martin; Joly, John C

2015-01-01

Recent reports highlight the impact of copper on lactate metabolism: CHO cell cultures with higher initial copper levels shift to net lactate consumption and yield lower final lactate and higher titers. These studies investigated the effects of copper on metabolite and transcript profiles, but did not measure in detail the dependences of cell culture performance and product quality on copper concentrations. To more thoroughly map these dependences, we explored the effects of various copper treatments on four recombinant CHO cell lines. In the first cell line, when extracellular copper remained above the limit of detection (LOD), cultures shifted to net lactate consumption and yielded comparable performances irrespective of the differences in copper levels; when extracellular copper dropped below LOD (∼13 nM), cultures failed to shift to net lactate consumption, and yielded significantly lower product titers. Across the four cell lines, the ability to grow and consume lactate seemed to depend on the presence of a minimum level of copper, beyond which there were no further gains in culture performance. Although this minimum cellular copper requirement could not be directly quantified, we estimated its probable range for the first cell line by applying several assumptions. Even when different copper concentrations did not affect cell culture performance, they affected product quality profiles: higher initial copper concentrations increased the basic variants in the recombinant IgG1 products. Therefore, in optimizing chemically defined media, it is important to select a copper concentration that is adequate and achieves desired product quality attributes. © 2014 American Institute of Chemical Engineers.

Antwerp Copper Plates

DEFF Research Database (Denmark)

Wadum, Jørgen

1999-01-01

In addition to presenting a short history of copper paintings, topics detail artists’ materials and techniques, as well as aspects of the copper industry, including mining, preparation and trade routes.......In addition to presenting a short history of copper paintings, topics detail artists’ materials and techniques, as well as aspects of the copper industry, including mining, preparation and trade routes....

Copper Mountain conference on iterative methods: Proceedings: Volume 2

Energy Technology Data Exchange (ETDEWEB)

NONE

1996-10-01

This volume (the second of two) contains information presented during the last two days of the Copper Mountain Conference on Iterative Methods held April 9-13, 1996 at Copper Mountain, Colorado. Topics of the sessions held these two days include domain decomposition, Krylov methods, computational fluid dynamics, Markov chains, sparse and parallel basic linear algebra subprograms, multigrid methods, applications of iterative methods, equation systems with multiple right-hand sides, projection methods, and the Helmholtz equation. Selected papers indexed separately for the Energy Science and Technology Database.

A statistical approach to the experimental design of the sulfuric acid leaching of gold-copper ore

Directory of Open Access Journals (Sweden)

Mendes F.D.

2003-01-01

Full Text Available The high grade of copper in the Igarapé Bahia (Brazil gold-copper ore prevents the direct application of the classic cyanidation process. Copper oxides and sulfides react with cyanides in solution, causing a high consumption of leach reagent and thereby raising processing costs and decreasing recovery of gold. Studies have showm that a feasible route for this ore would be a pretreatment for copper minerals removal prior to the cyanidation stage. The goal of this experimental work was to study the experimental conditions required for copper removal from Igarapé Bahia gold-copper ore by sulfuric acid leaching by applying a statistical approach to the experimental design. By using the Plackett Burman method, it was possible to select the variables that had the largest influence on the percentage of copper extracted at the sulfuric acid leaching stage. These were temperature of leach solution, stirring speed, concentration of sulfuric acid in the leach solution and particle size of the ore. The influence of the individual effects of these variables and their interactions on the experimental response were analyzed by applying the replicated full factorial design method. Finally, the selected variables were optimized by the ascending path statistical method, which determined the best experimental conditions for leaching to achieve the highest percentage of copper extracted. Using the optimized conditions, the best leaching results showed a copper extraction of 75.5%.

Material Selection and Characterization for High Gradient RF Applications

CERN Document Server

Arnau-Izquierdo, G; Heikkinen, S; Ramsvik, T; Sgobba, Stefano; Taborelli, M; Wuensch, W

2007-01-01

The selection of candidate materials for the accelerating cavities of the Compact Linear Collider (CLIC) is carried out in parallel with high power RF testing. The maximum DC breakdown field of copper, copper alloys, refractory metals, aluminium and titanium have been measured with a dedicated setup. Higher maximum fields are obtained for refractory metals and for titanium, which exhibits, however, important damages after conditioning. Fatigue behaviour of copper alloys has been studied for surface and bulk by pulsed laser irradiation and ultrasonic excitation, respectively. The selected copper alloys show consistently higher fatigue resistance than copper in both experiments. In order to obtain the best local properties in the device a possible solution is a bi-metallic assembly. Junctions of molybdenum and copper-zirconium UNS C15000 alloy, achieved by HIP (Hot Isostatic Pressing) diffusion bonding or explosion bonding were evaluated for their mechanical strength. The reliability of the results obtained wit...

Speciation and leachability of copper in mine tailings from porphyry copper mining

DEFF Research Database (Denmark)

Hansen, Henrik K.; Yianatos, Juan B; Ottosen, Lisbeth M.

2005-01-01

Mine tailing from the El Teniente-Codelco copper mine situated in VI Region of Chile was analysed in order to evaluate the mobility and speciation of copper in the solid material. Mine tailing was sampled after the rougher flotation circuits, and the copper content was measured to 1150mgkg^-^1 dry...... matter. This tailing was segmented into fractions of different size intervals: 0-38, 38-45, 45-53, 53-75, 75-106, 106-150, 150-212, and >212@mm, respectively. Copper content determination, sequential chemical extraction, and desorption experiments were carried out for each size interval in order...... to evaluate the speciation of copper. It was found that the particles of smallest size contained 50-60% weak acid leachable copper, whereas only 32% of the copper found in largest particles could be leached in weak acid. Copper oxides and carbonates were the dominating species in the smaller particles...

Copper and Anesthesia: Clinical Relevance and Management of Copper Related Disorders

OpenAIRE

Langley, Adrian; Dameron, Charles T.

2013-01-01

Recent research has implicated abnormal copper homeostasis in the underlying pathophysiology of several clinically important disorders, some of which may be encountered by the anesthetist in daily clinical practice. The purpose of this narrative review is to summarize the physiology and pharmacology of copper, the clinical implications of abnormal copper metabolism, and the subsequent influence of altered copper homeostasis on anesthetic management.

Industrial Tests to Modify Molten Copper Slag for Improvement of Copper Recovery

Science.gov (United States)

Guo, Zhengqi; Zhu, Deqing; Pan, Jian; Zhang, Feng; Yang, Congcong

2018-04-01

In this article, to improve the recovery of copper from copper slag by flotation process, industrial tests of the modification process involving addition of a composite additive into molten copper slag were conducted, and the modified slag was subjected to the flotation process to confirm the modification effect. The phase evolution of the slag in the modification process was revealed by thermodynamic calculations, x-ray diffraction, optical microscopy and scanning electron microscopy. The results show that more copper was transformed and enriched in copper sulfide phases. The magnetite content in the modified slag decreased, and that of "FeO" increased correspondingly, leading to a better fluidity of the molten slag, which improved the aggregation and growth of fine particles of the copper sulfide minerals. Closed-circuit flotation tests of the original and modified slags were conducted, and the results show that the copper recovery increased obviously from 69.15% to 73.38%, and the copper grade of concentrates was elevated slightly from 20.24% to 21.69%, further confirming that the industrial tests of the modification process were successful. Hence, the modification process has a bright future in industrial applications for enhancing the recovery of copper from the copper slag.

Corrosion of the copper canister in the repository environment

Energy Technology Data Exchange (ETDEWEB)

Hermansson, H.P.; Eriksson, Sture [Studsvik Material AB, Nykoeping (Sweden)

1999-12-01

The present report accounts for studies on copper corrosion performed at Studsvik Material AB during 1997-1999 on commission by SKI. The work has been focused on localised corrosion and electrochemistry of copper in the repository environment. The current theory of localised copper corrosion is not consistent with recent practical experiences. It is therefore desired to complete and develop the theory based on knowledge about the repository environment and evaluations of previous as well as recent experimental and field results. The work has therefore comprised a thorough compilation and up-date of literature on copper corrosion and on the repository environment. A selection of a 'working environment', defining the chemical parameters and their ranges of variation has been made and is used as a fundament for the experimental part of the work. Experiments have then been performed on the long-range electrochemical behaviour of copper in selected environments simulating the repository. Another part of the work has been to further develop knowledge about the thermodynamic limits for corrosion in the repository environment. Some of the thermodynamic work is integrated here. Especially thermodynamics for the system Cu-Cl-H-O up to 150 deg C and high chloride concentrations are outlined. However, there is also a rough overview of the whole system Cu-Fe-Cl-S-C-H-O as a fundament for the discussion. Data are normally accounted as Pourbaix diagrams. Some of the conclusions are that general corrosion on copper will probably not be of significant importance in the repository as far as transportation rates are low. However, if such rates were high, general corrosion could be disastrous, as there is no passivation of copper in the highly saline environment. The claim on knowledge of different kinds of localised corrosion and pitting is high, as pitting damages can shorten the lifetime of a canister dramatically. Normal pitting can happen in oxidising environment, but

Corrosion of the copper canister in the repository environment

International Nuclear Information System (INIS)

Hermansson, H.P.; Eriksson, Sture

1999-12-01

The present report accounts for studies on copper corrosion performed at Studsvik Material AB during 1997-1999 on commission by SKI. The work has been focused on localised corrosion and electrochemistry of copper in the repository environment. The current theory of localised copper corrosion is not consistent with recent practical experiences. It is therefore desired to complete and develop the theory based on knowledge about the repository environment and evaluations of previous as well as recent experimental and field results. The work has therefore comprised a thorough compilation and up-date of literature on copper corrosion and on the repository environment. A selection of a 'working environment', defining the chemical parameters and their ranges of variation has been made and is used as a fundament for the experimental part of the work. Experiments have then been performed on the long-range electrochemical behaviour of copper in selected environments simulating the repository. Another part of the work has been to further develop knowledge about the thermodynamic limits for corrosion in the repository environment. Some of the thermodynamic work is integrated here. Especially thermodynamics for the system Cu-Cl-H-O up to 150 deg C and high chloride concentrations are outlined. However, there is also a rough overview of the whole system Cu-Fe-Cl-S-C-H-O as a fundament for the discussion. Data are normally accounted as Pourbaix diagrams. Some of the conclusions are that general corrosion on copper will probably not be of significant importance in the repository as far as transportation rates are low. However, if such rates were high, general corrosion could be disastrous, as there is no passivation of copper in the highly saline environment. The claim on knowledge of different kinds of localised corrosion and pitting is high, as pitting damages can shorten the lifetime of a canister dramatically. Normal pitting can happen in oxidising environment, but there is

Antibiotic resistance, ability to form biofilm and susceptibility to copper alloys of selected staphylococcal strains isolated from touch surfaces in Polish hospital wards

Directory of Open Access Journals (Sweden)

Anna Różańska

2017-08-01

strain selected for comparison. Conclusions Coagulase-negative staphylococci, the most commonly isolated in Polish hospital wards, should not be neglected as an infection risk factor due their high antibiotic resistance. Our experiments confirmed that touch surfaces made of copper alloys may play an important role in eliminating bacteria from the hospital environment.

Tribological Performance Optimization of Electroless Ni-P-W Coating Using Weighted Principal Component Analysis

Directory of Open Access Journals (Sweden)

S. Roy

2013-12-01

Full Text Available The present investigation is an experimental approach to deposit electroless Ni-P-W coating on mild steel substrate and find out the optimum combination of various tribological performances on the basis of minimum friction and wear, using weighted principal component analysis (WPCA. In this study three main tribological parameters are chosen viz. load (A, speed (B and time(C. The responses are coefficient of friction and wear depth. Here Weighted Principal Component Analysis (WPCA method is adopted to convert the multi-responses into single performance index called multiple performance index (MPI and Taguchi L27 orthogonal array is used to design the experiment and to find the optimum combination of tribological parameters for minimum coefficient of friction and wear depth. ANOVA is performed to find the significance of the each tribological process parameters and their interactions. The EDX analysis, SEM and XRD are performed to study the composition and structural aspects.

Bacterial consortium for copper extraction from sulphide ore consisting mainly of chalcopyrite

Directory of Open Access Journals (Sweden)

E. Romo

2013-01-01

Full Text Available The mining industry is looking forward for bacterial consortia for economic extraction of copper from low-grade ores. The main objective was to determine an optimal bacterial consortium from several bacterial strains to obtain copper from the leach of chalcopyrite. The major native bacterial species involved in the bioleaching of sulphide ore (Acidithiobacillus ferrooxidans, Acidithiobacillus thiooxidans, Leptospirillum ferrooxidans and Leptospirillum ferriphilum were isolated and the assays were performed with individual bacteria and in combination with At. thiooxidans. In conclusion, it was found that the consortium integrated by At. ferrooxidans and At. thiooxidans removed 70% of copper in 35 days from the selected ore, showing significant differences with the other consortia, which removed only 35% of copper in 35 days. To validate the assays was done an escalation in columns, where the bacterial consortium achieved a higher percentage of copper extraction regarding to control.

Copper Mountain conference on iterative methods: Proceedings: Volume 1

Energy Technology Data Exchange (ETDEWEB)

NONE

1996-10-01

This volume (one of two) contains information presented during the first three days of the Copper Mountain Conference on Iterative Methods held April 9-13, 1996 at Copper Mountain, Colorado. Topics of the sessions held these three days included nonlinear systems, parallel processing, preconditioning, sparse matrix test collections, first-order system least squares, Arnoldi`s method, integral equations, software, Navier-Stokes equations, Euler equations, Krylov methods, and eigenvalues. The top three papers from a student competition are also included. Selected papers indexed separately for the Energy Science and Technology Database.

Copper nitrate redispersion to arrive at highly active silica-supported copper catalysts

NARCIS (Netherlands)

Munnik, P.|info:eu-repo/dai/nl/328228524; Wolters, M.|info:eu-repo/dai/nl/304829560; Gabrielsson, A.; Pollington, S.D.; Headdock, G.; Bitter, J.H.|info:eu-repo/dai/nl/160581435; de Jongh, P.E.|info:eu-repo/dai/nl/186125372; de Jong, K.P.|info:eu-repo/dai/nl/06885580X

2011-01-01

In order to obtain copper catalysts with high dispersions at high copper loadings, the gas flow rate and gas composition was varied during calcination of silica gel impregnated with copper nitrate to a loading of 18 wt % of copper. Analysis by X-ray diffraction (XRD), N2O chemisorption, and

Copper economy in Chlamydomonas: Prioritized allocation and reallocation of copper to respiration vs. photosynthesis

Science.gov (United States)

Kropat, Janette; Gallaher, Sean D.; Urzica, Eugen I.; Nakamoto, Stacie S.; Strenkert, Daniela; Tottey, Stephen; Mason, Andrew Z.; Merchant, Sabeeha S.

2015-01-01

Inorganic elements, although required only in trace amounts, permit life and primary productivity because of their functions in catalysis. Every organism has a minimal requirement of each metal based on the intracellular abundance of proteins that use inorganic cofactors, but elemental sparing mechanisms can reduce this quota. A well-studied copper-sparing mechanism that operates in microalgae faced with copper deficiency is the replacement of the abundant copper protein plastocyanin with a heme-containing substitute, cytochrome (Cyt) c6. This switch, which is dependent on a copper-sensing transcription factor, copper response regulator 1 (CRR1), dramatically reduces the copper quota. We show here that in a situation of marginal copper availability, copper is preferentially allocated from plastocyanin, whose function is dispensable, to other more critical copper-dependent enzymes like Cyt oxidase and a ferroxidase. In the absence of an extracellular source, copper allocation to Cyt oxidase includes CRR1-dependent proteolysis of plastocyanin and quantitative recycling of the copper cofactor from plastocyanin to Cyt oxidase. Transcriptome profiling identifies a gene encoding a Zn-metalloprotease, as a candidate effecting copper recycling. One reason for the retention of genes encoding both plastocyanin and Cyt c6 in algal and cyanobacterial genomes might be because plastocyanin provides a competitive advantage in copper-depleted environments as a ready source of copper. PMID:25646490

Nature and Distribution of Stable Subsurface Oxygen in Copper Electrodes During Electrochemical CO2 Reduction

DEFF Research Database (Denmark)

Cavalca, Filippo Carlo; Ferragut, Rafael; Aghion, Stefano

2017-01-01

Oxide-derived copper (OD-Cu) electrodes exhibit higher activity than pristine copper during the carbon dioxide reduction reaction (CO2RR) and higher selectivity towards ethylene. The presence of residual subsurface oxygen in OD-Cu has been proposed to be responsible for such improvements, although...

Role of the adsorbed oxygen species in the selective electrochemical reduction of CO_2 to alcohols and carbonyls on copper electrodes

International Nuclear Information System (INIS)

Le Duff, Cecile S.; Lawrence, Matthew J.; Rodriguez, Paramaconi

2017-01-01

The electrochemical reduction of CO_2 into fuels has gained significant attention recently as source of renewable carbon-based fuels. The unique high selectivity of copper in the electrochemical reduction of CO_2 to hydrocarbons has called much interest in discovering its mechanism. In order to provide significant information about the role of oxygen in the electrochemical reduction of CO_2 on Cu electrodes, the conditions of the surface structure and the composition of the Cu single crystal electrodes were controlled over time. This was achieved using pulsed voltammetry, since the pulse sequence can be programmed to guarantee reproducible initial conditions for the reaction at every fraction of time and at a given frequency. In contrast to the selectivity of CO_2 reduction using cyclic voltammetry and chronoamperometric methods, a large selection of oxygenated hydrocarbons was found under alternating voltage conditions. Product selectivity towards the formation of oxygenated hydrocarbon was associated to the coverage of oxygen species, which is surface-structure- and potential-dependent. (copyright 2017 Wiley-VCH Verlag GmbH and Co. KGaA, Weinheim)

Electroless formation of silver nanoaggregates: An experimental and molecular dynamics approach

KAUST Repository

Gentile, Francesco T.

2014-02-20

The ability to manipulate matter to create non-conventional structures is one of the key issues of material science. The understanding of assembling mechanism at the nanoscale allows us to engineer new nanomaterials, with physical properties intimately depending on their structure.This paper describes new strategies to obtain and characterise metal nanostructures via the combination of a top-down method, such as electron beam lithography, and a bottom-up technique, such as the chemical electroless deposition. We realised silver nanoparticle aggregates within well-defined patterned holes created by electron beam lithography on silicon substrates. The quality characteristics of the nanoaggregates were verified by using scanning electron microscopy and atomic force microscopy imaging. Moreover, we compared the experimental findings to molecular dynamics simulations of nanoparticles growth. We observed a very high dependence of the structure characteristics on the pattern nanowell aspect ratio. We found that high-quality metal nanostructures may be obtained in patterns with well aspect ratio close to one, corresponding to a maximum diameter of 50 nm, a limit above which the fabricated structures become less regular and discontinuous. When regular shapes and sizes are necessary, as in nanophotonics, these results suggest the pattern characteristics to obtain isolated, uniform and reproducible metal nanospheres. © 2014 Taylor & Francis.

Canine Copper-Associated Hepatitis

NARCIS (Netherlands)

Dirksen, Karen; Fieten, Hille

2017-01-01

Copper-associated hepatitis is recognized with increasing frequency in dogs. The disease is characterized by centrolobular hepatic copper accumulation, leading to hepatitis and eventually cirrhosis. The only way to establish the diagnosis is by histologic assessment of copper distribution and copper

Preparation of graphene-enhanced nickel-phosphorus composite films by ultrasonic-assisted electroless plating

Science.gov (United States)

Yu, Qian; Zhou, Tianfeng; Jiang, Yonggang; Yan, Xing; An, Zhonglie; Wang, Xibin; Zhang, Deyuan; Ono, Takahito

2018-03-01

To improve the mechanical properties of nickel-phosphorus (Ni-P) mold material for glass molding, an ultrasonic-assisted electroless plating method is proposed for the synthesis of graphene-enhanced nickel-phosphorus (G-Ni-P) composite films on heat-resistant stainless steel (06Cr25Ni20). Graphene flakes are prepared by an electrochemical exfoliation method. The surface roughness of the as-plated G-Ni-P composite plating is Ra 2.84 μm, which is higher than that of the Ni-P plating deposited using the same method. After annealing at 400 ºC for 2 h, the main phase of the G-Ni-P composite is transformed to crystalline Ni3P with an average grain size of 32.8 nm. The Vickers hardness and Young's modulus of the G-Ni-P composite are increased by 8.0% and 8.2% compared with the values of Ni-P, respectively. The detailed plating process is of great significance for the fabrication of G-Ni-P mold materials with enhanced mechanical properties.

Investigation on cell biocompatible behaviors of polyaniline film fabricated via electroless surface polymerization

International Nuclear Information System (INIS)

Liu Sheng; Wang Jinqing; Zhang Dong; Zhang Puliang; Ou Junfei; Liu Bin; Yang Shengrong

2010-01-01

Considering for the potential application in tissue engineering, polyaniline (PANi) film was fabricated via a two-step route: a self-assembled monolayer of C 6 H 5 NHC 3 H 6 Si(OMe) 3 was firstly formed on the single-crystal Si substrate; the conducting PANi film was then prepared through electroless surface polymerization of the aniline molecules on the aniline monolayer-bearing silane surface in an acidic aqueous solution. The formation of PANi film on Si surface was confirmed by characterizations of X-ray photoelectron spectroscope (XPS) and specular reflectance Fourier transform infrared (SR-FTIR) spectrum, etc. At last, the proliferation behaviors of PC-12 cells on the PANi film surface were studied by the [3-(4,5-dimethyldiazol-2-yl)-2,5-diphenyl tetrazolium bromide] (MTT) colorimetric assays, acridine orange fluorometric staining, and scanning electron microscope (SEM) observation, etc. The results demonstrate that the as-prepared PANi film provides high ability for cell proliferation, exhibiting promising potentials as surface coating to cultivate neuronal cells for applications in the tissue engineering.

Earth's copper resources estimated from tectonic diffusion of porphyry copper deposits

Science.gov (United States)

Kesler, Stephen E.; Wilkinson, Bruce H.

2008-03-01

Improved estimates of global mineral endowments are relevantto issues ranging from strategic planning to global geochemicalcycling. We have used a time-space model for the tectonic migrationof porphyry copper deposits vertically through the crust tocalculate Earth's endowment of copper in mineral deposits. Themodel relies only on knowledge of numbers and ages of porphyrycopper deposits, Earth's most widespread and important sourceof copper, in order to estimate numbers of eroded and preserveddeposits in the crust. Model results indicate that 125,895 porphyrycopper deposits were formed during Phanerozoic time, that only47,789 of these remain at various crustal depths, and that thesecontain 1.7 x 1011 tonnes (t) of copper. Assuming that othertypes of copper deposits behave similarly in the crust and haveabundances proportional to their current global production yieldsan estimate of 3 x 1011 t for total global copper resourcesat all levels in Earth's crust. Thus, 0.25% of the copper inthe crust has been concentrated into deposits through Phanerozoictime, and about two-thirds of this has been recycled by upliftand erosion. The amount of copper in deposits above 3.3 km,a likely limit of future mining, could supply current worldmine production for 5500 yr, thus quantifying the highly unusualand nonrenewable nature of mineral deposits.

Copper recovery from slag by indirect bio leaching

International Nuclear Information System (INIS)

Mazuelos, A.; Iglesias, N.; Romero, R.; Forcat, O.; Carranza, F.

2009-01-01

The main source of copper loss from a smelter is copper in discard slag. Slag can contain Cu in concentrations very much higher than those of many ores. Cu is present in slag entrained in very small drops of matte, white metal and blister copper occluded in fayalitic phase. In this work, the technical viability of the BRISA process, that is based on the indirect bio leaching, for this residue has been proved. A sample of slag, containing 2 % of copper, has been chemical, granulometric and metallographic characterized and it has been leached with ferric sulphate solutions in agitated reactors. The influence of several variables have been investigated. Once the best operating conditions had been selecting and an economic estimation had been done (with very really attractive results), the leaching stage has been designed for a plant of 30 tonnes per hour capacity. Cu extractions higher than 70% can be achieved with a residence time of only five hours. Despite of Cu(II) concentration in fed is as high as 30 g/l, bio oxidation stage can supply Fe(III) demanded by ferric leaching stage. (Author) 17 refs

Preparation methods of copper-ferrocyanide functionalized magnetic nanoparticles for selective removal of cesium in aqueous solution

Energy Technology Data Exchange (ETDEWEB)

Hee-Man Yang; Kune Woo Lee; Bum-Kyoung Seo; Jei Kwon Moon [KAERI, Daejeon (Korea, Republic of)

2013-07-01

Copper ferrocyanide functionalized magnetite nanoparticles (Cu-FC-MNPs) were successfully synthesized by the immobilization of copper and ferrocyanide on the surface of [1-(2 amino-ethyl)-3-aminopropyl] trimethoxysilane modified magnetite nanoparticles. A radioactive cesium (Cs) adsorption test was carried out to investigate the effectiveness of Cu-FC-MNPS for the removal of radioactive Cs. Furthermore, the Cu-FC-MNPs showed excellent separation ability by an external magnet in an aqueous solution. (authors)

EFFECT OF pH ON ELECTROLESS Ni-P COATING OF CONDUCTIVE AND NON-CONDUCTIVE MATERIALS

Directory of Open Access Journals (Sweden)

Subrata Roy

2011-12-01

Full Text Available Electroless nickel-phosphorus (Ni-P coating of carbon steel as well as a polypropylene substrate was conducted using sodium hypophosphite as a reducing agent in alkaline media. The influence of pH on coating appearances and the properties of the coatings for both steel and the polypropylene substrate were studied. A nickel-phosphorus coating of good appearance was obtained in the pH range between 5.5 and 12.5 on the carbon steel substrate and between 8.5 and 12 on the polypropylene substrate. The percentage of Ni content in the coating increased with increasing pH of the bath solution. A smooth, uniform microstructure was found in the coating deposited in relatively lower pH solutions compared to higher pH baths. The microhardness of the Ni-P coating decreased with an increasing percentage Ni content in the deposit.

Stage specific effects of soluble copper and copper oxide nanoparticles during sea urchin embryo development and their relation to intracellular copper uptake.

Science.gov (United States)

Torres-Duarte, Cristina; Ramos-Torres, Karla M; Rahimoff, René; Cherr, Gary N

2017-08-01

The effects of exposure to either soluble copper (copper sulfate) or copper oxide nanoparticles (nano-CuO) during specific early developmental stages of sea urchin embryos were analyzed. Soluble copper caused significant malformations in embryos (skeletal malformations, delayed development or gut malformations) when present at any given stage, while cleavage stage was the most sensitive to nano-CuO exposure causing skeletal malformations and decreased total antioxidant capacity. The stage specificity was linked to higher endocytic activity during the first hours of development that leads to higher accumulation of copper in specific cells critical for development. Results indicate that nano-CuO results in higher accumulation of copper inside of embryos and this intracellular copper is more persistent as compared to soluble copper. The possible implications later in development are discussed. Copyright © 2017 Elsevier B.V. All rights reserved.

Copper nanoparticle modified carbon electrode for determination of dopamine

International Nuclear Information System (INIS)

Oztekin, Yasemin; Tok, Mutahire; Bilici, Esra; Mikoliunaite, Lina; Yazicigil, Zafer; Ramanaviciene, Almira; Ramanavicius, Arunas

2012-01-01

This paper reports the synthesis and characterization of copper nanoparticles (CuNPs) and application of copper nanoparticle-modified glassy carbon electrode for the electrochemical determination of dopamine. Electrochemical measurements were performed using differently modified glassy carbon (GC) electrodes. Bare, oxidized before modification and copper nanoparticle-modified glassy carbon electrodes (bare-GC, ox-GC and CuNP/GC electrodes, respectively) were characterized by cyclic voltammetry and electrochemical impedance spectroscopy in the presence of redox probes. Atomic force microscopy was used for the visualization of electrode surfaces. The CuNP/GC electrode was found to be suitable for the selective determination of dopamine even in the presence of ascorbic acid, uric acid, and p-acetamidophenol. The observed linear range of CuNP/GC for dopamine was from 0.1 nM to 1.0 μM while the detection limit was estimated to be 50 pM. It was demonstrated that here reported glassy carbon electrode modified by copper nanoparticles is suitable for the determination of dopamine in real samples such as human blood serum.

Genome Sequences of Two Copper-Resistant Escherichia coli Strains Isolated from Copper-Fed Pigs

DEFF Research Database (Denmark)

Lüthje, Freja L.; Hasman, Henrik; Aarestrup, Frank Møller

2014-01-01

The draft genome sequences of two copper-resistant Escherichia coli strains were determined. These had been isolated from copper-fed pigs and contained additional putative operons conferring copper and other metal and metalloid resistances.......The draft genome sequences of two copper-resistant Escherichia coli strains were determined. These had been isolated from copper-fed pigs and contained additional putative operons conferring copper and other metal and metalloid resistances....

Local density measurement of additive manufactured copper parts by instrumented indentation

Science.gov (United States)

Santo, Loredana; Quadrini, Fabrizio; Bellisario, Denise; Tedde, Giovanni Matteo; Zarcone, Mariano; Di Domenico, Gildo; D'Angelo, Pierpaolo; Corona, Diego

2018-05-01

Instrumented flat indentation has been used to evaluate local density of additive manufactured (AM) copper samples with different relative density. Indentations were made by using tungsten carbide (WC) flat pins with 1 mm diameter. Pure copper powders were used in a selective laser melting (SLM) machine to produce samples to test. By changing process parameters, samples density was changed from the relative density of 63% to 71%. Indentation tests were performed on the xy surface of the AM samples. In order to make a correlation between indentation test results and sample density, the indentation pressure at fixed displacement was selected. Results show that instrumented indentation is a valid technique to measure density distribution along the geometry of an SLM part. In fact, a linear trend between indentation pressure and sample density was found for the selected density range.

Copper uptake and retention in liver parenchymal cells isolated from nutritionally copper-deficient rats

NARCIS (Netherlands)

Berg, van den G.J.; de Goeij, J.J.M.; Bock, I.; Gijbels, M.J.J.; Brouwer, A.; Lei, K.Y.; Hendriks, H.F.J.

1991-01-01

Copper uptake and retention were studied in primary cultures of liver parenchymal cells isolated from copper-deficient rats. Male Sprague-Dawley rats were fed a copper-deficient diet (<1 mg Cu/kg) for 10 wk. Copper-deficient rats were characterized by low copper concentrations in plasma and liver,

Copper uptake and retention in liver parenchymal cells isolated from nutritionally copper-deficient rats

NARCIS (Netherlands)

Berg, G.J. van den; Goeij, J.J.M. de; Bock, I.; Gijbels, M.J.J.; Brouwer, A.; Lei, K.Y.; Hendruiks, H.F.J.

1991-01-01

Copper uptake and retention were studied in primary cultures of liver parenchymal cells isolated from copper-deficient rats. Male Sprague-Dawley rats were fed a copper-deficient diet (< 1 mg Cu/kg) for 10 wk. Copper-deficient rats were characterized by low copper concentrations in plasma and liver,

Annual Copper Mountain Conferences on Multigrid and Iterative Methods, Copper Mountain, Colorado

International Nuclear Information System (INIS)

McCormick, Stephen F.

2016-01-01

This project supported the Copper Mountain Conference on Multigrid and Iterative Methods, held from 2007 to 2015, at Copper Mountain, Colorado. The subject of the Copper Mountain Conference Series alternated between Multigrid Methods in odd-numbered years and Iterative Methods in even-numbered years. Begun in 1983, the Series represents an important forum for the exchange of ideas in these two closely related fields. This report describes the Copper Mountain Conference on Multigrid and Iterative Methods, 2007-2015. Information on the conference series is available at http://grandmaster.colorado.edu/~copper/

Annual Copper Mountain Conferences on Multigrid and Iterative Methods, Copper Mountain, Colorado

Energy Technology Data Exchange (ETDEWEB)

McCormick, Stephen F. [Front Range Scientific, Inc., Lake City, CO (United States)

2016-03-25

This project supported the Copper Mountain Conference on Multigrid and Iterative Methods, held from 2007 to 2015, at Copper Mountain, Colorado. The subject of the Copper Mountain Conference Series alternated between Multigrid Methods in odd-numbered years and Iterative Methods in even-numbered years. Begun in 1983, the Series represents an important forum for the exchange of ideas in these two closely related fields. This report describes the Copper Mountain Conference on Multigrid and Iterative Methods, 2007-2015. Information on the conference series is available at http://grandmaster.colorado.edu/~copper/.

Inhibition of human copper trafficking by a small molecule significantly attenuates cancer cell proliferation

Science.gov (United States)

Wang, Jing; Luo, Cheng; Shan, Changliang; You, Qiancheng; Lu, Junyan; Elf, Shannon; Zhou, Yu; Wen, Yi; Vinkenborg, Jan L.; Fan, Jun; Kang, Heebum; Lin, Ruiting; Han, Dali; Xie, Yuxin; Karpus, Jason; Chen, Shijie; Ouyang, Shisheng; Luan, Chihao; Zhang, Naixia; Ding, Hong; Merkx, Maarten; Liu, Hong; Chen, Jing; Jiang, Hualiang; He, Chuan

2015-12-01

Copper is a transition metal that plays critical roles in many life processes. Controlling the cellular concentration and trafficking of copper offers a route to disrupt these processes. Here we report small molecules that inhibit the human copper-trafficking proteins Atox1 and CCS, and so provide a selective approach to disrupt cellular copper transport. The knockdown of Atox1 and CCS or their inhibition leads to a significantly reduced proliferation of cancer cells, but not of normal cells, as well as to attenuated tumour growth in mouse models. We show that blocking copper trafficking induces cellular oxidative stress and reduces levels of cellular ATP. The reduced level of ATP results in activation of the AMP-activated protein kinase that leads to reduced lipogenesis. Both effects contribute to the inhibition of cancer cell proliferation. Our results establish copper chaperones as new targets for future developments in anticancer therapies.

Copper wire bonding

CERN Document Server

Chauhan, Preeti S; Zhong, ZhaoWei; Pecht, Michael G

2014-01-01

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material.  However, copper wire bonding has several process and reliability concerns due to its material properties.  Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation.  In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed.  The book also discusses best practices and re...

Nearly 60% Copper Rod & Wire Companies Neutral about Future Copper Price

Institute of Scientific and Technical Information of China (English)

2012-01-01

<正>How about the trend of copper price recently? According to the survey result of Shanghai Metals Market, amongst 21 domestic copper rod & wire companies, 57% of the companies are neutral about the future copper price, while 14% and 19% of the companies consider that

Quantitative Transmission Electron Microscopy of Nanoparticles and Thin-Film Formation in Electroless Metallization of Polymeric Surfaces

Science.gov (United States)

Dutta, Aniruddha; Heinrich, Helge; Kuebler, Stephen; Grabill, Chris; Bhattacharya, Aniket

2011-03-01

Gold nanoparticles(Au-NPs) act as nucleation sites for electroless deposition of silver on functionalized SU8 polymeric surfaces. Here we report the nanoscale morphology of Au and Ag nanoparticles as studied by Transmission Electron Microscopy (TEM). Scanning TEM with a high-angle annular dark-field detector is used to obtain atomic number contrast. From the intensity-calibrated plan-view scanning TEM images we determine the mean thickness and the volume distribution of the Au-NPs on the surface of the functionalized polymer. We also report the height and the radius distribution of the gold nanoparticles obtained from STEM images taking into consideration the experimental errors. The cross sectional TEM images yield the density and the average distance of the Au and Ag nanoparticles on the surface of the polymer. Supported by grant NSF, Chemistry Division.

[Leaching of nonferrous metals from copper-smelting slag with acidophilic microorganisms].

Science.gov (United States)

Murav'ev, M I; Fomchenko, N V

2013-01-01

The leaching process of copper and zinc from copper converter slag with sulphuric solutions of trivalent iron sulphate obtained using the association of acidophilic chemolithotrophic microorganisms was investigated. The best parameters of chemical leaching (temperature 70 degrees C, an initial concentration of trivalent iron in the leaching solution of 10.1 g/L, and a solid-phase content in the suspension of 10%) were selected. Carrying out the process under these parameters resulted in the recovery of 89.4% of copper and 39.3% of zinc in the solution. The possibility of the bioregeneration of trivalent iron in the solution obtained after the chemical leaching of slag by iron-oxidizingacidophilic chemolithotrophic microorganisms without inhibiting their activity was demonstrated.

The influence of copper in dealloyed binary platinum–copper electrocatalysts on methanol electroxidation catalytic activities

Energy Technology Data Exchange (ETDEWEB)

Poochai, Chatwarin [Department of Chemistry, Faculty of Science, Mahidol University, Bangkok 10400 (Thailand); Center of Excellence for Innovation in Chemistry, Faculty of Science, Mahidol University, Bangkok 10400 (Thailand); Veerasai, Waret, E-mail: waret.vee@mahidol.ac.th [Department of Chemistry, Faculty of Science, Mahidol University, Bangkok 10400 (Thailand); Center of Excellence for Innovation in Chemistry, Faculty of Science, Mahidol University, Bangkok 10400 (Thailand); Somsook, Ekasith [Department of Chemistry, Faculty of Science, Mahidol University, Bangkok 10400 (Thailand); Center of Excellence for Innovation in Chemistry, Faculty of Science, Mahidol University, Bangkok 10400 (Thailand); Dangtip, Somsak [Department of Physics, and NANOTEC COE at Mahidol University, Faculty of Science, Mahidol University, Bangkok 10400 (Thailand)

2015-08-01

In this study, we prepared and characterized carbon paper-supported dealloyed binary Pt–Cu core–shell electrocatalysts (denoted as Pt{sub x}Cu{sub (100−x)/}CP) by cyclic co-electrodeposition and selective copper dealloying in an acidic medium, and we investigated the effect of the copper content in the samples on the catalytic activities toward methanol electroxidation reaction (MOR). X-ray photo-emission spectroscopy (XPS) and inductively coupled plasma atomic emission spectroscopy (ICP-AES) indicated that the structure of dealloyed binary Pt–Cu catalysts possessed a Pt-rich shell and a Cu rich core. X-ray absorption near edge spectroscopy (XANES) displayed that the oxidation states of Pt and Cu were zero and one, respectively, implying the formation of metallic Pt and Cu{sub 2}O, respectively. X-ray diffraction spectroscopy (XRD) confirmed that Cu was inserted into a face-centered cubic Pt structure forming Pt–Cu alloys. Scanning electron microscopy (SEM) and transmission electron microscope (TEM) displayed a cubic shape of Pt/CP and a spherical shape of Pt{sub x}Cu{sub (100−x)/}CP with several hundred nanometer sizes of agglomeration that depended on the Cu content. Cyclic voltammetry, chronoamperometry, and electrochemical impedance spectroscopy were performed to confirm that the sample of Pt{sub 70}Cu{sub 30}/CP exhibited the best catalytic activities in terms of the specific current, current density, catalytic poisoning tolerance, and stability. - Graphical abstract: Display Omitted - Highlights: • Binary electrocatalysts of Pt{sub x}Cu{sub (100−x)}/CP were prepared by cyclic co-electrodeposition and selective copper dealloying. • The structures of Pt{sub x}Cu{sub (100−x)}/CP were a Pt rich shell and a Cu rich core. • The Pt{sub 70}Cu{sub 30}/CP was the excellent catalytic activity towards methanol electrooxidation and CO{sub ads} tolerance.

Biliary copper excretion by hepatocyte lysosomes in the rat. Major excretory pathway in experimental copper overload

International Nuclear Information System (INIS)

Gross, J.B. Jr.; Myers, B.M.; Kost, L.J.; Kuntz, S.M.; LaRusso, N.F.

1989-01-01

We investigated the hypothesis that lysosomes are the main source of biliary copper in conditions of hepatic copper overload. We used a rat model of oral copper loading and studied the relationship between the biliary output of copper and lysosomal hydrolases. Male Sprague-Dawley rats were given tap water with or without 0.125% copper acetate for up to 36 wk. Copper loading produced a 23-fold increase in the hepatic copper concentration and a 30-65% increase in hepatic lysosomal enzyme activity. Acid phosphatase histochemistry showed that copper-loaded livers contained an increased number of hepatocyte lysosomes; increased copper concentration of these organelles was confirmed directly by both x ray microanalysis and tissue fractionation. The copper-loaded rats showed a 16-fold increase in biliary copper output and a 50-300% increase in biliary lysosomal enzyme output. In the basal state, excretory profiles over time were similar for biliary outputs of lysosomal enzymes and copper in the copper-loaded animals but not in controls. After pharmacologic stimulation of lysosomal exocytosis, biliary outputs of copper and lysosomal hydrolases in the copper-loaded animals remained coupled: injection of colchicine or vinblastine produced an acute rise in the biliary output of both lysosomal enzymes and copper to 150-250% of baseline rates. After these same drugs, control animals showed only the expected increase in lysosomal enzyme output without a corresponding increase in copper output. We conclude that the hepatocyte responds to an increased copper load by sequestering excess copper in an increased number of lysosomes that then empty their contents directly into bile. The results provide direct evidence that exocytosis of lysosomal contents into biliary canaliculi is the major mechanism for biliary copper excretion in hepatic copper overload

Underwater explosive compaction-sintering of tungsten-copper coating on a copper surface

Science.gov (United States)

Chen, Xiang; Li, Xiaojie; Yan, Honghao; Wang, Xiaohong; Chen, Saiwei

2018-01-01

This study investigated underwater explosive compaction-sintering for coating a high-density tungsten-copper composite on a copper surface. First, 50% W-50% Cu tungsten-copper composite powder was prepared by mechanical alloying. The composite powder was pre-compacted and sintered by hydrogen. Underwater explosive compaction was carried out. Finally, a high-density tungsten-copper coating was obtained by diffusion sintering of the specimen after explosive compaction. A simulation of the underwater explosive compaction process showed that the peak value of the pressure in the coating was between 3.0 and 4.8 GPa. The hardness values of the tungsten-copper layer and the copper substrate were in the range of 87-133 and 49 HV, respectively. The bonding strength between the coating and the substrate was approximately 100-105 MPa.

Formation Process of Eosin Y-Adsorbing ZnO Particles by Electroless Deposition and Their Photoelectric Conversion Properties.

Science.gov (United States)

Nagaya, Satoshi; Nishikiori, Hiromasa; Mizusaki, Hideaki; Wagata, Hajime; Teshima, Katsuya

2015-06-03

The thin films consisting of crystalline ZnO particles were prepared on fluorine-doped tin oxide electrodes by electroless deposition. The particles were deposited from an aqueous solution containing zinc nitrate, dimethyamine-borane, and eosin Y at 328 K. As the Pd particles were adsorbed on the substrate, not only the eosin Y monomer but also the dimer and debrominated species were rapidly adsorbed on the spherical ZnO particles, which were aggregated and formed secondary particles. On the other hand, in the absence of the Pd particles, the monomer was adsorbed on the flake-shaped ZnO particles, which vertically grew on the substrate surface and had a high crystallinity. The photoelectric conversion efficiency was higher for the ZnO electrodes containing a higher amount of the monomer during light irradiation.

Characterisation of phase composition, microstructure and microhardness of electroless nickel composite coating co-deposited with SiC on casting aluminium LM24 alloy substrate

OpenAIRE

Franco, M.; Sha, Wei; Malinov, Savko

2013-01-01

Electroless Ni-P (EN) and composite Ni-P-SiC (ENC) coatings were developed on cast aluminium alloy, LM24. The coating phase composition, microstructure and microhardness were investigated using X-ray diffraction (XRD), scanning electron microscopy (SEM) and microhardness tester, respectively, on as-plated and heat-treated specimens. The original microstructure of the Ni-P matrix is not affected by the inclusion of the hard particles SiC. No formation of Ni-Si phase was observed upto 500°C of ...

Detention of copper by sulfur nanoparticles inhibits the proliferation of A375 malignant melanoma and MCF-7 breast cancer cells

Energy Technology Data Exchange (ETDEWEB)

Liu, Hao [Department of Chemistry, Jinan University, Guangzhou (China); Zhang, Yikai [Institute of Hematology, Jinan University, Guangzhou (China); Zheng, Shanyuan [School of Life Sciences, The Chinese University of Hong Kong, Hong Kong (China); Weng, Zeping; Ma, Jun [First Affiliated Hospital, Jinan University, Guangzhou (China); Li, Yangqiu [Institute of Hematology, Jinan University, Guangzhou (China); First Affiliated Hospital, Jinan University, Guangzhou (China); Key Laboratory for Regenerative Medicine of Ministry of Education, Jinan University, Guangzhou, 510632 (China); Xie, Xinyuan [Department of Chemistry, Jinan University, Guangzhou (China); Zheng, Wenjie, E-mail: tzhwj@jnu.edu.cn [Department of Chemistry, Jinan University, Guangzhou (China)

2016-09-02

Selective induction of cell death or growth inhibition of cancer cells is the future of chemotherapy. Clinical trials have found that cancer tissues are enriched with copper. Based on this finding, many copper-containing compounds and complexes have been designed to “copper” cancer cells using copper as bait. However, recent studies have demonstrated that copper boosts tumor development, and copper deprivation from serum was shown to effectively inhibit the promotion of cancer. Mechanistically, copper is an essential cofactor for mitogen-activated protein kinase (MAPK)/extracellular activating kinase (ERK) kinase (MEK), a central molecule in the BRAF/MEK/ERK pathway. Therefore, depleting copper from cancer cells by directly sequestering copper has a wider field for research and potential for combination therapy. Based on the affinity between sulfur and copper, we therefore designed sulfur nanoparticles (Nano-S) that detain copper, achieving tumor growth restriction. We found that spherical Nano-S could effectively bind copper and form a tighter surficial structure. Moreover, this Nano-S detention of copper effectively inhibited the proliferation of A375 melanoma and MCF-7 breast cancer cells with minimum toxicity to normal cells. Mechanistic studies revealed that Nano-S triggered inactivation of the MEK-ERK pathway followed by inhibition of the proliferation of the A375 and MCF-7 cells. In addition, lower Nano-S concentrations and shorter exposure stimulated the expression of a copper transporter as compensation, which further increased the cellular uptake and anticancer activities of cisplatin. Collectively, our results highlight the potential of Nano-S as an anticancer agent or adjuvant through its detention of copper. - Highlights: • Nano-S selectively inhibited the mitosis of A375 and MCF-7 cells by depleting copper. • Nano-S inactivated MEK/ERK pathway through the detention of copper. • Nano-S improved the cellular uptake and anticancer activities

Detention of copper by sulfur nanoparticles inhibits the proliferation of A375 malignant melanoma and MCF-7 breast cancer cells

International Nuclear Information System (INIS)

Liu, Hao; Zhang, Yikai; Zheng, Shanyuan; Weng, Zeping; Ma, Jun; Li, Yangqiu; Xie, Xinyuan; Zheng, Wenjie

2016-01-01

Selective induction of cell death or growth inhibition of cancer cells is the future of chemotherapy. Clinical trials have found that cancer tissues are enriched with copper. Based on this finding, many copper-containing compounds and complexes have been designed to “copper” cancer cells using copper as bait. However, recent studies have demonstrated that copper boosts tumor development, and copper deprivation from serum was shown to effectively inhibit the promotion of cancer. Mechanistically, copper is an essential cofactor for mitogen-activated protein kinase (MAPK)/extracellular activating kinase (ERK) kinase (MEK), a central molecule in the BRAF/MEK/ERK pathway. Therefore, depleting copper from cancer cells by directly sequestering copper has a wider field for research and potential for combination therapy. Based on the affinity between sulfur and copper, we therefore designed sulfur nanoparticles (Nano-S) that detain copper, achieving tumor growth restriction. We found that spherical Nano-S could effectively bind copper and form a tighter surficial structure. Moreover, this Nano-S detention of copper effectively inhibited the proliferation of A375 melanoma and MCF-7 breast cancer cells with minimum toxicity to normal cells. Mechanistic studies revealed that Nano-S triggered inactivation of the MEK-ERK pathway followed by inhibition of the proliferation of the A375 and MCF-7 cells. In addition, lower Nano-S concentrations and shorter exposure stimulated the expression of a copper transporter as compensation, which further increased the cellular uptake and anticancer activities of cisplatin. Collectively, our results highlight the potential of Nano-S as an anticancer agent or adjuvant through its detention of copper. - Highlights: • Nano-S selectively inhibited the mitosis of A375 and MCF-7 cells by depleting copper. • Nano-S inactivated MEK/ERK pathway through the detention of copper. • Nano-S improved the cellular uptake and anticancer activities

Sulfidation treatment of copper-containing plating sludge towards copper resource recovery.

Science.gov (United States)

Kuchar, D; Fukuta, T; Onyango, M S; Matsuda, H

2006-11-02

The present study is concerned with the sulfidation treatment of copper-containing plating sludge towards copper resource recovery by flotation of copper sulfide from treated sludge. The sulfidation treatment was carried out by contacting simulated or real copper plating sludge with Na(2)S solution for a period of 5 min to 24 h. The initial molar ratio of S(2-) to Cu(2+) (S(2-) to Me(2+) in the case of real sludge) was adjusted to 1.00, 1.25 or 1.50, while the solid to liquid ratio was set at 1:50. As a result, it was found that copper compounds were converted to various copper sulfides within the first 5 min. In the case of simulated copper sludge, CuS was identified as the main sulfidation product at the molar ratio of S(2-) to Cu(2+) of 1.00, while Cu(7)S(4) (Roxbyite) was mainly found at the molar ratios of S(2-) to Cu(2+) of 1.50 and 1.25. Based on the measurements of oxidation-reduction potential, the formation of either CuS or Cu(7)S(4) at different S(2-) to Cu(2+) molar ratios was attributed to the changes in the oxidation-reduction potential. By contrast, in the case of sulfidation treatment of real copper sludge, CuS was predominantly formed, irrespective of S(2-) to Me(2+) molar ratio.

Influence of layer compositions and annealing conditions on complete formation of ternary PdAgCu alloys prepared by sequential electroless and electroplating methods

Energy Technology Data Exchange (ETDEWEB)

Sumrunronnasak, Sarocha [Graduate Program of Petrochemistry and Polymer Science, Faculty of Science, Chulalongkorn University, Bangkok 10330 (Thailand); Tantayanon, Supawan, E-mail: supawan.t@chula.ac.th [Green Chemistry Research Laboratory, Department of Chemistry, Faculty of Science, Chulalongkorn University, Bangkok 10330 (Thailand); Kiatgamolchai, Somchai [Department of Physics, Faculty of Science, Chulalongkorn University, Bangkok 10330 (Thailand)

2017-01-01

PdAgCu ternary alloy membranes were synthesized by the sequential electroless plating of Pd following by electroplating of Ag and Cu onto stainless steel substrate. The composition of the composite was varied by changing the deposition times. The fabricated layers were annealed at the temperatures between 500 and 600 °C for 20–60 h. The Energy Dispersive X-ray spectroscopy (EDX) and X-ray diffraction (XRD) were employed to investigate the element distribution in the membrane which provided the insight on membrane alloying process. Complete formation of the alloy could be obtained when the Pd composition was greater than a critical value of 60 wt%, and Ag and Cu contents were in the range of 18–30 wt% and 2–13 wt%, respectively. Deposition times of Ag and Cu were found to affect the completion of alloy formation. Excess amount of the deposited Cu particularly tended to segregate on the surface of the membrane. - Highlights: • Ternary PdAgCu alloy membranes were successfully prepared by the sequential electroless and electroplating methods. • The average Pd composition required to form alloy was found to be approximately at least 60%wt. • The alloy region was achieved for f Pd 60–73 wt%, Cu 18–30 wt% and Ag 2–13 wt%. • Suitable annealing temperature in the range of 500–600 °C for an adequate period of treating time (20–60 h).

Critical review: Copper runoff from outdoor copper surfaces at atmospheric conditions.

Science.gov (United States)

Hedberg, Yolanda S; Hedberg, Jonas F; Herting, Gunilla; Goidanich, Sara; Odnevall Wallinder, Inger

2014-01-01

This review on copper runoff dispersed from unsheltered naturally patinated copper used for roofing and facades summarizes and discusses influencing factors, available literature, and predictive models, and the importance of fate and speciation for environmental risk assessment. Copper runoff from outdoor surfaces is predominantly governed by electrochemical and chemical reactions and is highly dependent on given exposure conditions (size, inclination, geometry, degree of sheltering, and orientation), surface parameters (age, patina composition, and thickness), and site-specific environmental conditions (gaseous pollutants, chlorides, rainfall characteristics (amount, intensity, pH), wind direction, temperature, time of wetness, season). The corrosion rate cannot be used to assess the runoff rate. The extent of released copper varies largely between different rain events and is related to dry and wet periods, dry deposition prior to the rain event and prevailing rain and patina characteristics. Interpretation and use of copper runoff data for environmental risk assessment and management need therefore to consider site-specific factors and focus on average data of long-term studies (several years). Risk assessments require furthermore that changes in copper speciation, bioavailability aspects, and potential irreversible retention on solid surfaces are considered, factors that determine the environmental fate of copper runoff from outdoor surfaces.

Role of the adsorbed oxygen species in the selective electrochemical reduction of CO{sub 2} to alcohols and carbonyls on copper electrodes

Energy Technology Data Exchange (ETDEWEB)

Le Duff, Cecile S.; Lawrence, Matthew J.; Rodriguez, Paramaconi [School of Chemistry, University of Birmingham, Edgbaston (United Kingdom)

2017-10-09

The electrochemical reduction of CO{sub 2} into fuels has gained significant attention recently as source of renewable carbon-based fuels. The unique high selectivity of copper in the electrochemical reduction of CO{sub 2} to hydrocarbons has called much interest in discovering its mechanism. In order to provide significant information about the role of oxygen in the electrochemical reduction of CO{sub 2} on Cu electrodes, the conditions of the surface structure and the composition of the Cu single crystal electrodes were controlled over time. This was achieved using pulsed voltammetry, since the pulse sequence can be programmed to guarantee reproducible initial conditions for the reaction at every fraction of time and at a given frequency. In contrast to the selectivity of CO{sub 2} reduction using cyclic voltammetry and chronoamperometric methods, a large selection of oxygenated hydrocarbons was found under alternating voltage conditions. Product selectivity towards the formation of oxygenated hydrocarbon was associated to the coverage of oxygen species, which is surface-structure- and potential-dependent. (copyright 2017 Wiley-VCH Verlag GmbH and Co. KGaA, Weinheim)

Copper hypersensitivity

DEFF Research Database (Denmark)

Fage, Simon W; Faurschou, Annesofie; Thyssen, Jacob P

2014-01-01

hypersensitivity, a database search of PubMed was performed with the following terms: copper, dermatitis, allergic contact dermatitis, contact hypersensitivity, contact sensitization, contact allergy, patch test, dental, IUD, epidemiology, clinical, and experimental. Human exposure to copper is relatively common...

A cytosolic copper storage protein provides a second level of copper tolerance in Streptomyces lividans.

Science.gov (United States)

Straw, Megan L; Chaplin, Amanda K; Hough, Michael A; Paps, Jordi; Bavro, Vassiliy N; Wilson, Michael T; Vijgenboom, Erik; Worrall, Jonathan A R

2018-01-24

Streptomyces lividans has a distinct dependence on the bioavailability of copper for its morphological development. A cytosolic copper resistance system is operative in S. lividans that serves to preclude deleterious copper levels. This system comprises of several CopZ-like copper chaperones and P 1 -type ATPases, predominantly under the transcriptional control of a metalloregulator from the copper sensitive operon repressor (CsoR) family. In the present study, we discover a new layer of cytosolic copper resistance in S. lividans that involves a protein belonging to the newly discovered family of copper storage proteins, which we have named Ccsp (cytosolic copper storage protein). From an evolutionary perspective, we find Ccsp homologues to be widespread in Bacteria and extend through into Archaea and Eukaryota. Under copper stress Ccsp is upregulated and consists of a homotetramer assembly capable of binding up to 80 cuprous ions (20 per protomer). X-ray crystallography reveals 18 cysteines, 3 histidines and 1 aspartate are involved in cuprous ion coordination. Loading of cuprous ions to Ccsp is a cooperative process with a Hill coefficient of 1.9 and a CopZ-like copper chaperone can transfer copper to Ccsp. A Δccsp mutant strain indicates that Ccsp is not required under initial copper stress in S. lividans, but as the CsoR/CopZ/ATPase efflux system becomes saturated, Ccsp facilitates a second level of copper tolerance.

Effect of hierarchical meso–macroporous alumina-supported copper catalyst for methanol synthesis from CO2 hydrogenation

International Nuclear Information System (INIS)

Witoon, Thongthai; Bumrungsalee, Sittisut; Chareonpanich, Metta; Limtrakul, Jumras

2015-01-01

Highlights: • CO 2 hydrogenation over Cu-loaded unimodal and hierarchical alumina catalysts. • Cu-loaded hierarchical catalyst exhibited higher methanol selectivity and stability. • The presence of macropores reduced the probability of side reaction. - Abstract: Effects of pore structures of alumina on the catalytic performance of copper catalysts for CO 2 hydrogenation were investigated. Copper-loaded hierarchical meso–macroporous alumina (Cu/HAl) catalyst exhibited no significant difference in terms of CO 2 conversion with copper-loaded unimodal mesoporous alumina (Cu/UAl) catalyst. However, the selectivity to methanol and dimethyl ether of the Cu/HAl catalyst was much higher than that of the Cu/UAl catalyst. This was attributed to the presence of macropores which diminished the occurrence of side reaction by the shortening the mesopores diffusion path length. The Cu/HAl catalyst also exhibited much higher stability than the Cu/UAl catalyst due to the fast diffusion of water out from the catalyst pellets, alleviating the oxidation of metallic copper to CuO

Fabricating Copper Nanotubes by Electrodeposition

Science.gov (United States)

Yang, E. H.; Ramsey, Christopher; Bae, Youngsam; Choi, Daniel

2009-01-01

Copper tubes having diameters between about 100 and about 200 nm have been fabricated by electrodeposition of copper into the pores of alumina nanopore membranes. Copper nanotubes are under consideration as alternatives to copper nanorods and nanowires for applications involving thermal and/or electrical contacts, wherein the greater specific areas of nanotubes could afford lower effective thermal and/or electrical resistivities. Heretofore, copper nanorods and nanowires have been fabricated by a combination of electrodeposition and a conventional expensive lithographic process. The present electrodeposition-based process for fabricating copper nanotubes costs less and enables production of copper nanotubes at greater rate.

Effect of Rake Angle During Machining of Micro Grooves on Electroless Nickel Plated Die Materials

International Nuclear Information System (INIS)

Rezaur Rahman, K.M.; Rahman, M.

2005-01-01

This study attempts to evaluate the performance of two single crystal diamond tools with different rake angle (0 0 and -15 0 ) during micro grooving on electroless nickel plated die materials. It was found that the 0 0 rake diamond tool has superior performance compared to the -15 0 rake angle tool. The negative rake tool experienced very high thrust force, and severe chipping on the flank face was evident after a short cutting distance of 3.13 km. On the other hand, the 0 0 rake tool machined satisfactorily up to 50 km without any significant tool wear. While machining with the -15 0 rake tool, significant change in surface roughness with spindle speed was observed compared to the 0 0 rake tool. With increasing infeed rate variation in surface roughness was evident only with the -15 0 rake tool. Steep change in roughness with machining distance was also observed while machining with the negative rake tool. (authors)

Fabrication of biomimetic superhydrophobic surface on engineering materials by a simple electroless galvanic deposition method.

Science.gov (United States)

Xu, Xianghui; Zhang, Zhaozhu; Yang, Jin

2010-03-02

We have reported an easy means in this paper to imitate the "lotus leaf" by constructing a superhydrophobic surface through a process combining both electroless galvanic deposition and self-assembly of n-octadecanethiol. Superhydrophobicity with a static water contact angle of about 169 +/- 2 degrees and a sliding angle of 0 +/- 2 degrees was achieved. Both the surface chemical compositions and morphological structures were analyzed. We have obtained a feather-like surface structure, and the thickness of the Ag film is about 10-30 microm. The stability of the superhydrophobic surface was tested under the following three conditions: (1) pH value from 1 to 13; (2) after freezing treatment at -20 degrees C; (3) at ambient temperature. It shows a notable stability in that the contact angle of the sample still remained higher than 150 degrees in different conditions. It can be concluded that our approach can provide an alternative way to fabricate stable superhydrophobic materials.

SELECTIVE HYDROGENOLYSIS OF GLYCEROL TO PROPYLENE GLYCOL IN A CONTINUOUS FLOW TRICKLE BED REACTOR USING COPPER CHROMITE AND Cu/Al2O3 CATALYSTS

Directory of Open Access Journals (Sweden)

Jorge Sepúlveda

Full Text Available The glycerol hydrogenolysis reaction was performed in a continuous flow trickle bed reactor using a water glycerol feed and both copper chromite and Cu/Al2O3 catalysts. The commercial copper chromite had a higher activity than the laboratory prepared Cu/Al2O3 and was used for most of the tests. Propylene glycol was the main product with both catalysts, acetol being the main by-product. It was found that temperature is the main variable influencing the conversion of glycerol. When the state of the glycerol-water reactant mixture was completely liquid, at temperatures lower than 190 ºC, conversion was low and deactivation was observed. At reaction temperatures of 210-230 ºC the conversion of glycerol was complete and the selectivity to propylene glycol was stable at about 60-80% all throughout the reaction time span of 10 h, regardless of the hydrogen pressure level (1 to 20 atm. These optimal values could not be improved significantly by using other different reaction conditions or increasing the catalyst acidity. At higher temperatures (245-250 ºC the conversion was also 100%. Under reaction conditions at which copper chromite suffered deactivation, light by-products and surface deposits were formed. The deposits could be completely burned at 250 ºC and the catalyst activity fully recovered.

Surface characteristics, copper release, and toxicity of nano- and micrometer-sized copper and copper(II) oxide particles: a cross-disciplinary study.

OpenAIRE

Midander, Klara; Cronholm, Pontus; Karlsson, Hanna L.; Elihn, Karine; Moller, Lennart; Leygraf, Christofer; Wallinder, Inger Odnevall

2009-01-01

An interdisciplinary and multianalytical research effort is undertaken to assess the toxic aspects of thoroughly characterized nano- and micrometer-sized particles of oxidized metallic copper and copper(II) oxide in contact with cultivated lung cells, as well as copper release in relevant media. All particles, except micrometer-sized Cu, release more copper in serum-containing cell medium (supplemented Dulbecco's minimal essential medium) compared to identical exposures in phosphate-buffered ...

Method for extracting copper, silver and related metals

Science.gov (United States)

Moyer, Bruce A.; McDowell, W. J.

1990-01-01

A process for selectively extracting precious metals such as silver and gold concurrent with copper extraction from aqueous solutions containing the same. The process utilizes tetrathiamacrocycles and high molecular weight organic acids that exhibit a synergistic relationship when complexing with certain metal ions thereby removing them from ore leach solutions.

Horseradish peroxidase immobilized on copper surfaces and applications in selective electrocatalysis of p-dihydroxybenzene

Energy Technology Data Exchange (ETDEWEB)

Wang, Chuntao, E-mail: tsyj1992@126.com [Department of Chemistry, Taiyuan Normal University, Taiyuan 030031 (China); Institute of Energy and Environmental Electrochemistry, Taiyuan Normal University, Taiyuan 030031 (China); Luo, Xiaoxiao [Department of Natural Science, Michigan State University, MI 48823,USA (United States); Jia, Zehui [Department of Chemistry, Taiyuan Normal University, Taiyuan 030031 (China); Institute of Energy and Environmental Electrochemistry, Taiyuan Normal University, Taiyuan 030031 (China); Shi, Qinghua; Zhu, Ritao [Department of Chemistry, Taiyuan Normal University, Taiyuan 030031 (China)

2017-06-01

Abstract: Horseradish Peroxidase (HRP) was immobilized on copper surfaces with the linker of L-Cysteine (L-Cys) self-assembled films to form Cu/L-Cys/HRP electrodes. The activity of HRP can be preserved by the Cu/L-Cys self-assembled films. The Cu/L-Cys/HRP electrodes can be used for the selective electrocatalytic oxidase of p-dihydroxybenzen in absent of H{sub 2}O{sub 2}. The optimum pH for electrocatalyzing p-dihydroxybenzen was 5.5 or 7.0, which corresponds to the isoelectric points of L-Cys and HRP, respectively. X-ray photoelectron spectroscopy (XPS) provided the evidence that L-Cys linked with Cu surface by the Cu− S bond. Fourier transform infrared spectroscopy (FTIR) analyses indicated that aromatic plane of p-dihydroxybenzen was connected parallel to porphyrin ring of heme in HRP. Quantum chemical calculation of density functional theory (DFT) revealed that symmetry of molecular structure and minimum space steric hindrance for p-dihydroxybenzen were benefit to combination with HRP. Moreover, the lowest energy of LUMO and most negative charges of oxygen atom on hydroxyl group of p-dihydroxybenzen were advantage to lose the hydrogen atom of hydroxyl group to be oxided.

Selective Production of 2-Methylfuran by Gas-Phase Hydrogenation of Furfural on Copper Incorporated by Complexation in Mesoporous Silica Catalysts.

Science.gov (United States)

Jiménez-Gómez, Carmen Pilar; Cecilia, Juan A; Moreno-Tost, Ramón; Maireles-Torres, Pedro

2017-04-10

Copper species have been incorporated in mesoporous silica (MS) through complexation with the amine groups of dodecylamine, which was used as a structure-directing agent in the synthesis. A series of Cu/SiO 2 catalysts (xCu-MS) with copper loadings (x) from 2.5 to 20 wt % was synthesized and evaluated in the gas-phase hydrogenation of furfural (FUR). The most suitable catalytic performance in terms of 2-methylfuran yield was obtained with an intermediate copper content (10 wt %). This 10Cu-MS catalyst exhibits a 2-methylfuran yield higher than 95 mol % after 5 h time-on-stream (TOS) at a reaction temperature of 210 °C with a H 2 /FUR molar ratio of 11.5 and a weight hourly space velocity (WHSV) of 1.5 h -1 . After 14 h TOS, this catalyst still showed a yield of 80 mol %. In all cases, carbonaceous deposits on the external surface were the cause of the catalyst deactivation, although sintering of the copper particles was observed for higher copper loadings. This intermediate copper loading (10 wt %) offered a suitable balance between resistance to sintering and tendency to form carbonaceous deposits. © 2017 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

Electrochemical in-situ impregnation of wood using a copper nail as source for copper

DEFF Research Database (Denmark)

Ottosen, Lisbeth M.; Block, Thomas; Nymark, Morten

2011-01-01

A new method for copper impregnation of wood in structures was suggested and tested in laboratory scale with specimen of new pine sapwood. A copper nail and a steel screw were placed in the wood, and an electric direct current field was applied, so the copper nail was anode and the screw...... was cathode. At the anode, copper ions were generated. The copper ions were transported into the wood by electromigration (movement of ions in an applied electric field) towards the cathode, and a volume between the two electrodes was thereby impregnated. Copper also moved to a lesser degree in the opposite...

Copper plasmonics and catalysis: role of electron-phonon interactions in dephasing localized surface plasmons

Science.gov (United States)

Sun, Qi-C.; Ding, Yuchen; Goodman, Samuel M.; H. Funke, Hans; Nagpal, Prashant

2014-10-01

Copper metal can provide an important alternative for the development of efficient, low-cost and low-loss plasmonic nanoparticles, and selective nanocatalysts. However, poor chemical stability and lack of insight into photophysics and plasmon decay mechanisms has impeded study. Here, we use smooth conformal ALD coating on copper nanoparticles to prevent surface oxidation, and study dephasing time for localized surface plasmons on different sized copper nanoparticles. Using dephasing time as a figure of merit, we elucidate the role of electron-electron, electron-phonon, impurity, surface and grain boundary scattering on the decay of localized surface plasmon waves. Using our quantitative analysis and different temperature dependent measurements, we show that electron-phonon interactions dominate over other scattering mechanisms in dephasing plasmon waves. While interband transitions in copper metal contributes substantially to plasmon losses, tuning surface plasmon modes to infrared frequencies leads to a five-fold enhancement in the quality factor. These findings demonstrate that conformal ALD coatings can improve the chemical stability for copper nanoparticles, even at high temperatures (>300 °C) in ambient atmosphere, and nanoscaled copper is a good alternative material for many potential applications in nanophotonics, plasmonics, catalysis and nanoscale electronics.Copper metal can provide an important alternative for the development of efficient, low-cost and low-loss plasmonic nanoparticles, and selective nanocatalysts. However, poor chemical stability and lack of insight into photophysics and plasmon decay mechanisms has impeded study. Here, we use smooth conformal ALD coating on copper nanoparticles to prevent surface oxidation, and study dephasing time for localized surface plasmons on different sized copper nanoparticles. Using dephasing time as a figure of merit, we elucidate the role of electron-electron, electron-phonon, impurity, surface and grain

Mechanical properties and microstructure of copper alloys and copper alloy-stainless steel laminates for fusion reactor high heat flux applications

Science.gov (United States)

Leedy, Kevin Daniel

A select group of copper alloys and bonded copper alloy-stainless steel panels are under consideration for heat sink applications in first wall and divertor structures of a planned thermonuclear fusion reactor. Because these materials must retain high strengths and withstand high heat fluxes, their material properties and microstructures must be well understood. Candidate copper alloys include precipitate strengthened CuNiBe and CuCrZr and dispersion strengthened Cu-Alsb2Osb3 (CuAl25). In this study, uniaxial mechanical fatigue tests were conducted on bulk copper alloy materials at temperatures up to 500sp°C in air and vacuum environments. Based on standardized mechanical properties measurement techniques, a series of tests were also implemented to characterize copper alloy-316L stainless steel joints produced by hot isostatic pressing or by explosive bonding. The correlation between mechanical properties and the microstructure of fatigued copper alloys and the interface of copper alloy-stainless steel laminates was examined. Commercial grades of these alloys were used to maintain a degree of standardization in the materials testing. The commercial alloys used were OMG Americas Glidcop CuAl25 and CuAl15; Brush Wellman Hycon 3HP and Trefimetaux CuNiBe; and Kabelmetal Elbrodur and Trefimetaux CuCrZr. CuAl25 and CuNiBe alloys possessed the best combination of fatigue resistance and microstructural stability. The CuAl25 alloy showed only minimal microstructural changes following fatigue while the CuNiBe alloy consistently exhibited the highest fatigue strength. Transmission electron microscopy observations revealed that small matrix grain sizes and high densities of submicron strengthening phases promoted homogeneous slip deformation in the copper alloys. Thus, highly organized fatigue dislocation structure formation, as commonly found in oxygen-free high conductivity Cu, was inhibited. A solid plate of CuAl25 alloy hot isostatically pressed to a 316L stainless steel

Copper Leaching from Copper-ethanolamine Treated Wood: Comparison of Field Test Studies and Laboratory Standard Procedures

OpenAIRE

Nejc Thaler; Miha Humar

2014-01-01

Copper-based compounds are some of the most important biocides for the protection of wood in heavy duty applications. In the past, copper was combined with chromium compounds to reduce copper leaching, but a recent generation of copper-based preservatives uses ethanolamine as a fixative. To elucidate the leaching of copper biocides from wood, Norway spruce (Picea abies) wood was treated with a commercial copper-ethanolamine solution with two different copper concentrations (cCu = 0.125% and 0...

Copper metabolism: a multicompartmental model of copper kinetics in the rat

International Nuclear Information System (INIS)

Dunn, M.A.

1985-01-01

A qualitative multicompartmental model was developed that describes the whole-body kinetics of copper metabolism in the adult rat. The model was developed from radiocopper percent dose vs. time data measured over a three day period in plasma, liver, skin, skeletal muscle, bile and feces after the intravenous injection of 10 μg copper labeled with 64 Cu. Plasma radiocopper was separated into ceruloplasmin (Cp) and nonceruloplasmin (NCp) fractions. Liver cytosolic radiocopper was fractionated into void volume superoxide dismutase (SOD) containing and metallothionein fractions by gel filtration. Liver particulate fractions were isolated by differential centrifugation. The SAAM and CONSAM modeling programs were used to develop the model. The sizes of compartments, fractional rate constants and mass transfer rates between compartments were evaluated. The intracellular metabolism of copper was similar in hepatic and extrahepatic tissues being comprised of a faster turning over compartment (FTC) exchanging copper with NCp and a slower turning over compartment (STC) with input from Cp. Output from the STC was into the FTC. In the liver the STC was postulated to represent SOD copper which unlike the extrahepatic tissues received much of its input from the FTC. A small amount of biliary copper (9%) was postulated to return to plasma NCp by enterohepatic recycling. The model developed was contrasted and compared with two previous models of copper metabolism

Copper surfaces are associated with significantly lower concentrations of bacteria on selected surfaces within a pediatric intensive care unit.

Science.gov (United States)

Schmidt, Michael G; von Dessauer, Bettina; Benavente, Carmen; Benadof, Dona; Cifuentes, Paulina; Elgueta, Alicia; Duran, Claudia; Navarrete, Maria S

2016-02-01

Health care-associated infections result in significant patient morbidity and mortality. Although cleaning can remove pathogens present on hospital surfaces, those surfaces may be inadequately cleaned or recontaminated within minutes. Because of copper's inherent and continuous antimicrobial properties, copper surfaces offer a solution to complement cleaning. The objective of this study was to quantitatively assess the bacterial microbial burden coincident with an assessment of the ability of antimicrobial copper to limit the microbial burden associated with 3 surfaces in a pediatric intensive care unit. A pragmatic trial was conducted enrolling 1,012 patients from 2 high acuity care units within a 249-bed tertiary care pediatric hospital over 12 months. The microbial burden was determined from 3 frequently encountered surfaces, regardless of room occupancy, twice monthly, from 16 rooms, 8 outfitted normally and 8 outfitted with antimicrobial copper. Copper surfaces were found to be equivalently antimicrobial in pediatric settings to activities reported for adult medical intensive care units. The log10 reduction to the microbial burden from antimicrobial copper surfaced bed rails was 1.996 (99%). Surprisingly, introduction of copper objects to 8 study rooms was found to suppress the microbial burden recovered from objects assessed in control rooms by log10 of 1.863 (73%). Copper surfaces warrant serious consideration when contemplating the introduction of no-touch disinfection technologies for reducing burden to limit acquisition of HAIs. Copyright © 2016 Association for Professionals in Infection Control and Epidemiology, Inc. Published by Elsevier Inc. All rights reserved.

Natural reducing agents for electroless nanoparticle deposition: Mild synthesis of metal/carbon nanostructured microspheres

International Nuclear Information System (INIS)

Duffy, Paul; Reynolds, Lyndsey A.; Sanders, Stephanie E.; Metz, Kevin M.; Colavita, Paula E.