WorldWideScience

Sample records for repairable chip-to-board interconnect

  1. Chip-to-board interconnects for high-performance computing

    Science.gov (United States)

    Riester, Markus B. K.; Houbertz-Krauss, Ruth; Steenhusen, Sönke

    2013-02-01

    Super computing is reaching out to ExaFLOP processing speeds, creating fundamental challenges for the way that computing systems are designed and built. One governing topic is the reduction of power used for operating the system, and eliminating the excess heat generated from the system. Current thinking sees optical interconnects on most interconnect levels to be a feasible solution to many of the challenges, although there are still limitations to the technical solutions, in particular with regard to manufacturability. This paper explores drivers for enabling optical interconnect technologies to advance into the module and chip level. The introduction of optical links into High Performance Computing (HPC) could be an option to allow scaling the manufacturing technology to large volume manufacturing. This will drive the need for manufacturability of optical interconnects, giving rise to other challenges that add to the realization of this type of interconnection. This paper describes a solution that allows the creation of optical components on module level, integrating optical chips, laser diodes or PIN diodes as components much like the well known SMD components used for electrical components. The paper shows the main challenges and potential solutions to this challenge and proposes a fundamental paradigm shift in the manufacturing of 3-dimensional optical links for the level 1 interconnect (chip package).

  2. Repairable chip bonding/interconnect process

    Science.gov (United States)

    Bernhardt, Anthony F.; Contolini, Robert J.; Malba, Vincent; Riddle, Robert A.

    1997-01-01

    A repairable, chip-to-board interconnect process which addresses cost and testability issues in the multi-chip modules. This process can be carried out using a chip-on-sacrificial-substrate technique, involving laser processing. This process avoids the curing/solvent evolution problems encountered in prior approaches, as well is resolving prior plating problems and the requirements for fillets. For repairable high speed chip-to-board connection, transmission lines can be formed on the sides of the chip from chip bond pads, ending in a gull wing at the bottom of the chip for subsequent solder.

  3. Last electrical interconnections

    CERN Multimedia

    CERN audiovisual service

    2009-01-01

    Sector 3-4 was closely followed by Sector 5-6, where interconnections were completely closed two days later. All the helium pressure release ports were installed in the sector back in April, but the sector remained open so that tests and repairs could be made on the copper stabilized busbar interconnections: in total ten busbar interconnections were repaired.

  4. Transurban interconnectivities

    DEFF Research Database (Denmark)

    Jørgensen, Claus Møller

    2012-01-01

    This essay discusses the interpretation of the revolutionary situations of 1848 in light of recent debates on interconnectivity in history. The concept of transurban interconnectivities is proposed as the most precise concept to capture the nature of interconnectivity in 1848. It is argued......, radicalism and nationalism in 1848. In the concluding paragraph, the limitations of the notion of urban–rural nterconnectivity are discussed in order to clarify the nature of transurban interconnectivity. 1848 revolutions; European history; interconnectivity; transurban; urban political movements...

  5. Optical interconnects

    CERN Document Server

    Chen, Ray T

    2006-01-01

    This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical

  6. Interconnected networks

    CERN Document Server

    2016-01-01

    This volume provides an introduction to and overview of the emerging field of interconnected networks which include multi layer or multiplex networks, as well as networks of networks. Such networks present structural and dynamical features quite different from those observed in isolated networks. The presence of links between different networks or layers of a network typically alters the way such interconnected networks behave – understanding the role of interconnecting links is therefore a crucial step towards a more accurate description of real-world systems. While examples of such dissimilar properties are becoming more abundant – for example regarding diffusion, robustness and competition – the root of such differences remains to be elucidated. Each chapter in this topical collection is self-contained and can be read on its own, thus making it also suitable as reference for experienced researchers wishing to focus on a particular topic.

  7. In-memory interconnect protocol configuration registers

    Energy Technology Data Exchange (ETDEWEB)

    Cheng, Kevin Y.; Roberts, David A.

    2017-09-19

    Systems, apparatuses, and methods for moving the interconnect protocol configuration registers into the main memory space of a node. The region of memory used for storing the interconnect protocol configuration registers may also be made cacheable to reduce the latency of accesses to the interconnect protocol configuration registers. Interconnect protocol configuration registers which are used during a startup routine may be prefetched into the host's cache to make the startup routine more efficient. The interconnect protocol configuration registers for various interconnect protocols may include one or more of device capability tables, memory-side statistics (e.g., to support two-level memory data mapping decisions), advanced memory and interconnect features such as repair resources and routing tables, prefetching hints, error correcting code (ECC) bits, lists of device capabilities, set and store base address, capability, device ID, status, configuration, capabilities, and other settings.

  8. In-memory interconnect protocol configuration registers

    Science.gov (United States)

    Cheng, Kevin Y.; Roberts, David A.

    2017-09-19

    Systems, apparatuses, and methods for moving the interconnect protocol configuration registers into the main memory space of a node. The region of memory used for storing the interconnect protocol configuration registers may also be made cacheable to reduce the latency of accesses to the interconnect protocol configuration registers. Interconnect protocol configuration registers which are used during a startup routine may be prefetched into the host's cache to make the startup routine more efficient. The interconnect protocol configuration registers for various interconnect protocols may include one or more of device capability tables, memory-side statistics (e.g., to support two-level memory data mapping decisions), advanced memory and interconnect features such as repair resources and routing tables, prefetching hints, error correcting code (ECC) bits, lists of device capabilities, set and store base address, capability, device ID, status, configuration, capabilities, and other settings.

  9. Interconnections 180

    CERN Multimedia

    180

    2013-01-01

    The LHC's main magnets operate at a temperature of 1.9 K (-271.3°C), colder than the 2.7 K (-270.5°C) of outer space. This ensures that the cables supplying power to the magnets operate in a superconducting state; they conduct electricity with no resistance. The cold magnets are insulated from the surrounding tunnel – kept at room temperature – with multiple layers of thermal insulation. Over the next 18 months, 1695 interconnections between LHC magnets will be opened and their insulation consolidated. In the video above, narrated by Jean-Philippe Tock of the Technology department, technicians demonstrate the process on an interconnection between spare LHC magnets. A "W bellows" system slides out of the way to reveal accelerator components inside. The technicians add aluminium sheeting and further insulating material before closing the W bellows for a leak-proof connection. The section is then brought to a pressure of 10-6 mbar, to further limit the possibility of heat leaks from the cold magnets. Insul...

  10. Electrical interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Frost, John S.; Brandt, Randolph J.; Hebert, Peter; Al Taher, Omar

    2015-10-06

    An interconnect includes a first set of connector pads, a second set of connector pads, and a continuous central portion. A first plurality of legs extends at a first angle from the continuous central portion. Each leg of the first plurality of legs is connected to a connector pad of a first set of connector pads. A second plurality of legs extends at a second angle from the continuous central portion. Each leg of the second plurality of legs is connected to a connector pad of the second set of connector pads. Gaps are defined between legs. The gaps enable movement of the first set of connector pads relative to the second set of connector pads.

  11. Interconnections 180

    CERN Multimedia

    CERN Visual Media Office; Noemi Caraban Gonzales

    2013-01-01

    Throughout the LS1 (Long Shutdown 1 planned for 2013-14), the consolidation of the 13 kA splices consists of the opening of M sleeves to access the bus-bars and install the consolidation system features (shunt, electrical insulation and mechanical restraint system). Once the features are installed, the sleeves are rewelded (10000 welds in total). The interconnect regions between adjacent cryomagnets consist of a number of lines spanning from one machine element to another. Within a magnet-to-magnet connection several welds are made. An automatic orbital weld without filler material closes the three main bus-bar lines M1, M2 and M3 (M1 and M2 for the main quadrupole bus-bars and M3 for the main dipole bus-bars). These welds are performed in a radial clearance of only 45 mm. A very reliable weld process is required. The weld configuration shall also ease future interventions. Automatic orbital TIG welding associated to specific weld geometry meets all these requirements. Edge weld preparation has the following ...

  12. Interconnection networks

    Science.gov (United States)

    Faber, V.; Moore, J.W.

    1988-06-20

    A network of interconnected processors is formed from a vertex symmetric graph selected from graphs GAMMA/sub d/(k) with degree d, diameter k, and (d + 1)exclamation/ (d /minus/ k + 1)exclamation processors for each d greater than or equal to k and GAMMA/sub d/(k, /minus/1) with degree d /minus/ 1, diameter k + 1, and (d + 1)exclamation/(d /minus/ k + 1)exclamation processors for each d greater than or equal to k greater than or equal to 4. Each processor has an address formed by one of the permutations from a predetermined sequence of letters chosen a selected number of letters at a time, and an extended address formed by appending to the address the remaining ones of the predetermined sequence of letters. A plurality of transmission channels is provided from each of the processors, where each processor has one less channel than the selected number of letters forming the sequence. Where a network GAMMA/sub d/(k, /minus/1) is provided, no processor has a channel connected to form an edge in a direction delta/sub 1/. Each of the channels has an identification number selected from the sequence of letters and connected from a first processor having a first extended address to a second processor having a second address formed from a second extended address defined by moving to the front of the first extended address the letter found in the position within the first extended address defined by the channel identification number. The second address is then formed by selecting the first elements of the second extended address corresponding to the selected number used to form the address permutations. 9 figs.

  13. Optical Backplane Interconnection

    Science.gov (United States)

    Hendricks, Herbert D.

    1991-01-01

    Optical backplane interconnection (OBIT), method of optically interconnecting many parallel outputs from data processor to many parallel inputs of other data processors by optically changing wavelength of output optical beam. Requires only one command: exact wavelength necessary to make connection between two desired processors. Many features, including smallness advantageous to incorporate OBIT into integrated optical device. Simplifies or eliminates wiring and speeds transfer of data over existing electrical or optical interconnections. Computer hookups and fiber-optical communication networks benefit from concept.

  14. Thin film interconnect processes

    Science.gov (United States)

    Malik, Farid

    Interconnects and associated photolithography and etching processes play a dominant role in the feature shrinkage of electronic devices. Most interconnects are fabricated by use of thin film processing techniques. Planarization of dielectrics and novel metal deposition methods are the focus of current investigations. Spin-on glass, polyimides, etch-back, bias-sputtered quartz, and plasma-enhanced conformal films are being used to obtain planarized dielectrics over which metal films can be reliably deposited. Recent trends have been towards chemical vapor depositions of metals and refractory metal silicides. Interconnects of the future will be used in conjunction with planarized dielectric layers. Reliability of devices will depend to a large extent on the quality of the interconnects.

  15. Zee electrical interconnect

    Science.gov (United States)

    Rust, Thomas M. (Inventor); Gaddy, Edward M. (Inventor); Herriage, Michael J. (Inventor); Patterson, Robert E. (Inventor); Partin, Richard D. (Inventor)

    2001-01-01

    An interconnect, having some length, that reliably connects two conductors separated by the length of the interconnect when the connection is made but in which one length if unstressed would change relative to the other in operation. The interconnect comprises a base element an intermediate element and a top element. Each element is rectangular and formed of a conducting material and has opposed ends. The elements are arranged in a generally Z-shape with the base element having one end adapted to be connected to one conductor. The top element has one end adapted to be connected to another conductor and the intermediate element has its ends disposed against the other end of the base and the top element. Brazes mechanically and electrically interconnect the intermediate element to the base and the top elements proximate the corresponding ends of the elements. When the respective ends of the base and the top elements are connected to the conductors, an electrical connection is formed therebetween, and when the conductors are relatively moved or the interconnect elements change length the elements accommodate the changes and the associated compression and tension forces in such a way that the interconnect does not mechanically fatigue.

  16. Welded solar cell interconnection

    Science.gov (United States)

    Stofel, E. J.; Browne, E. R.; Meese, R. A.; Vendura, G. J.

    1982-01-01

    The efficiency of the welding of solar-cell interconnects is compared with the efficiency of soldering such interconnects, and the cases in which welding may be superior are examined. Emphasis is placed on ultrasonic welding; attention is given to the solar-cell welding machine, the application of the welding process to different solar-cell configurations, producibility, and long-life performance of welded interconnects. Much of the present work has been directed toward providing increased confidence in the reliability of welding using conditions approximating those that would occur with large-scale array production. It is concluded that there is as yet insufficient data to determine which of three methods (soldering, parallel gap welding, and ultrasonic welding) provides the longest-duration solar panel life.

  17. Low power interconnect design

    CERN Document Server

    Saini, Sandeep

    2015-01-01

    This book provides practical solutions for delay and power reduction for on-chip interconnects and buses.  It provides an in depth description of the problem of signal delay and extra power consumption, possible solutions for delay and glitch removal, while considering the power reduction of the total system.  Coverage focuses on use of the Schmitt Trigger as an alternative approach to buffer insertion for delay and power reduction in VLSI interconnects. In the last section of the book, various bus coding techniques are discussed to minimize delay and power in address and data buses.   ·         Provides practical solutions for delay and power reduction for on-chip interconnects and buses; ·         Focuses on Deep Sub micron technology devices and interconnects; ·         Offers in depth analysis of delay, including details regarding crosstalk and parasitics;  ·         Describes use of the Schmitt Trigger as a versatile alternative approach to buffer insertion for del...

  18. Interconnecting with VIPs

    Science.gov (United States)

    Collins, Robert

    2013-01-01

    Interconnectedness changes lives. It can even save lives. Recently the author got to witness and be part of something in his role as a teacher of primary science that has changed lives: it may even have saved lives. It involved primary science teaching--and the climate. Robert Collins describes how it is all interconnected. The "Toilet…

  19. QCD Interconnection Effects

    CERN Document Server

    Sjöstrand, Torbjörn

    1999-01-01

    Heavy objects like the W, Z and t are short-lived compared with typical hadronization times. When pairs of such particles are produced, the subsequent hadronic decay systems may therefore become interconnected. We study such potential effects at Linear Collider energies.

  20. Coplanar interconnection module

    Science.gov (United States)

    Steward, R. D.; Windsor, H. F.

    1970-01-01

    Module for interconnecting a semiconductor array to external leads or components incorporates a metal external heat sink for cooling the array. Heat sink, extending down from the molded block that supports the array, is immersed in a liquid nitrogen bath which is designed to maintain the desired array temperature.

  1. Fuel cell system with interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Zhien; Goettler, Richard; Delaforce, Philip Mark

    2016-03-08

    The present invention includes a fuel cell system having an interconnect that reduces or eliminates diffusion (leakage) of fuel and oxidant by providing an increased densification, by forming the interconnect as a ceramic/metal composite.

  2. Photovoltaic sub-cell interconnects

    Energy Technology Data Exchange (ETDEWEB)

    van Hest, Marinus Franciscus Antonius Maria; Swinger Platt, Heather Anne

    2017-05-09

    Photovoltaic sub-cell interconnect systems and methods are provided. In one embodiment, a photovoltaic device comprises a thin film stack of layers deposited upon a substrate, wherein the thin film stack layers are subdivided into a plurality of sub-cells interconnected in series by a plurality of electrical interconnection structures; and wherein the plurality of electrical interconnection structures each comprise no more than two scribes that penetrate into the thin film stack layers.

  3. Interconnection of Distributed Energy Resources

    Energy Technology Data Exchange (ETDEWEB)

    Reiter, Emerson [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2017-04-19

    This is a presentation on interconnection of distributed energy resources, including the relationships between different aspects of interconnection, best practices and lessons learned from different areas of the U.S., and an update on technical advances and standards for interconnection.

  4. Electromagnetism and interconnections

    CERN Document Server

    Charruau, S

    2009-01-01

    This book covers the theoretical problems of modeling electrical behavior of the interconnections encountered in everyday electronic products. The coverage shows the theoretical tools of waveform prediction at work in the design of a complex and high-speed digital electronic system. Scientists, research engineers, and postgraduate students interested in electromagnetism, microwave theory, electrical engineering, or the development of simulation tools software for high speed electronic system design automation will find this book an illuminating resource.

  5. Interconnectivity: Benefits and Challenges

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2010-09-15

    Access to affordable and reliable electricity supplies is a basic prerequisite for economic and social development, prosperity, health, education and all other aspects of modern society. Electricity can be generated both near and far from the consumption areas as transmission lines, grid interconnections and distribution systems can transport it to the final consumer. In the vast majority of countries, the electricity sector used to be owned and run by the state. The wave of privatisation and market introduction in a number of countries and regions which started in the late 1980's has in many cases involved unbundling of generation from transmission and distribution (T and D). This has nearly everywhere exposed transmission bottlenecks limiting the development of well-functioning markets. Transmission on average accounts for about 10-15% of total final kWh cost paid by the end-user but it is becoming a key issue for effective operation of liberalised markets and for their further development. An integrated and adequate transmission infrastructure is of utmost importance for ensuring the delivery of the most competitively priced electricity, including externalities, to customers, both near and far from the power generating facilities. In this report, the role of interconnectivity in the development of energy systems is examined with the associated socio-economic, environmental, financial and regulatory aspects that must be taken into account for successful interconnection projects.

  6. Interconnected network of cameras

    Science.gov (United States)

    Hosseini Kamal, Mahdad; Afshari, Hossein; Leblebici, Yusuf; Schmid, Alexandre; Vandergheynst, Pierre

    2013-02-01

    The real-time development of multi-camera systems is a great challenge. Synchronization and large data rates of the cameras adds to the complexity of these systems as well. The complexity of such system also increases as the number of their incorporating cameras increases. The customary approach to implementation of such system is a central type, where all the raw stream from the camera are first stored then processed for their target application. An alternative approach is to embed smart cameras to these systems instead of ordinary cameras with limited or no processing capability. Smart cameras with intra and inter camera processing capability and programmability at the software and hardware level will offer the right platform for distributed and parallel processing for multi- camera systems real-time application development. Inter camera processing requires the interconnection of smart cameras in a network arrangement. A novel hardware emulating platform is introduced for demonstrating the concept of the interconnected network of cameras. A methodology is demonstrated for the interconnection network of camera construction and analysis. A sample application is developed and demonstrated.

  7. Interconnection policy: a theoretical survey

    Directory of Open Access Journals (Sweden)

    César Mattos

    2003-01-01

    Full Text Available This article surveys the theoretical foundations of interconnection policy. The requirement of an interconnection policy should not be taken for granted in all circumstances, even considering the issue of network externalities. On the other hand, when it is required, an encompassing interconnection policy is usually justified. We provide an overview of the theory on interconnection pricing that results in several different prescriptions depending on which problem the regulator aims to address. We also present a survey on the literature on two-way interconnection.

  8. Printed interconnects for photovoltaic modules

    Energy Technology Data Exchange (ETDEWEB)

    Fields, J. D.; Pach, G.; Horowitz, K. A. W.; Stockert, T. R.; Woodhouse, M.; van Hest, M. F. A. M.

    2017-01-01

    Film-based photovoltaic modules employ monolithic interconnects to minimize resistance loss and enhance module voltage via series connection. Conventional interconnect construction occurs sequentially, with a scribing step following deposition of the bottom electrode, a second scribe after deposition of absorber and intermediate layers, and a third following deposition of the top electrode. This method produces interconnect widths of about 300 um, and the area comprised by interconnects within a module (generally about 3%) does not contribute to power generation. The present work reports on an increasingly popular strategy capable of reducing the interconnect width to less than 100 um: printing interconnects. Cost modeling projects a savings of about $0.02/watt for CdTe module production through the use of printed interconnects, with savings coming from both reduced capital expense and increased module power output. Printed interconnect demonstrations with copper-indium-gallium-diselenide and cadmium-telluride solar cells show successful voltage addition and miniaturization down to 250 um. Material selection guidelines and considerations for commercialization are discussed.

  9. Graph theory and interconnection networks

    CERN Document Server

    Hsu, Lih-Hsing

    2008-01-01

    The advancement of large scale integrated circuit technology has enabled the construction of complex interconnection networks. Graph theory provides a fundamental tool for designing and analyzing such networks. Graph Theory and Interconnection Networks provides a thorough understanding of these interrelated topics. After a brief introduction to graph terminology, the book presents well-known interconnection networks as examples of graphs, followed by in-depth coverage of Hamiltonian graphs. Different types of problems illustrate the wide range of available methods for solving such problems. The text also explores recent progress on the diagnosability of graphs under various models.

  10. Renewable Systems Interconnection: Executive Summary

    Energy Technology Data Exchange (ETDEWEB)

    Kroposki, B.; Margolis, R.; Kuswa, G.; Torres, J.; Bower, W.; Key, T.; Ton, D.

    2008-02-01

    The U.S. Department of Energy launched the Renewable Systems Interconnection (RSI) study in 2007 to address the challenges to high penetrations of distributed renewable energy technologies. The RSI study consists of 14 additional reports.

  11. Fuel cell system with interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Zhien; Goettler, Richard

    2016-12-20

    The present invention includes an integrated planar, series connected fuel cell system having electrochemical cells electrically connected via interconnects, wherein the anodes of the electrochemical cells are protected against Ni loss and migration via an engineered porous anode barrier layer.

  12. SU-8 cantilever chip interconnection

    DEFF Research Database (Denmark)

    Johansson, Alicia Charlotte; Janting, Jakob; Schultz, Peter;

    2006-01-01

    the electrodes on the SU-8 chip to a printed circuit board. Here, we present two different methods of electrically connecting an SU-8 chip, which contains a microfluidic network and free-hanging mechanical parts. The tested electrical interconnection techniques are flip chip bonding using underfill or flip chip...... bonding using an anisotropic conductive film (ACF). These are both widely used in the Si industry and might also be used for the large scale interconnection of SU-8 chips. The SU-8 chip, to which the interconnections are made, has a microfluidic channel with integrated micrometer-sized cantilevers...... that can be used for label-free biochemical detection. All the bonding tests are compared with results obtained using similar Si chips. It is found that it is significantly more complicated to interconnect SU-8 than Si cantilever chips primarily due to the softness of SU-8....

  13. Misalignment corrections in optical interconnects

    Science.gov (United States)

    Song, Deqiang

    Optical interconnects are considered a promising solution for long distance and high bitrate data transmissions, outperforming electrical interconnects in terms of loss and dispersion. Due to the bandwidth and distance advantage of optical interconnects, longer links have been implemented with optics. Recent studies show that optical interconnects have clear advantages even at very short distances---intra system interconnects. The biggest challenge for such optical interconnects is the alignment tolerance. Many free space optical components require very precise assembly and installation, and therefore the overall cost could be increased. This thesis studied the misalignment tolerance and possible alignment correction solutions for optical interconnects at backplane or board level. First the alignment tolerance for free space couplers was simulated and the result indicated the most critical alignments occur between the VCSEL, waveguide and microlens arrays. An in-situ microlens array fabrication method was designed and experimentally demonstrated, with no observable misalignment with the waveguide array. At the receiver side, conical lens arrays were proposed to replace simple microlens arrays for a larger angular alignment tolerance. Multilayer simulation models in CodeV were built to optimized the refractive index and shape profiles of the conical lens arrays. Conical lenses fabricated with micro injection molding machine and fiber etching were characterized. Active component VCSOA was used to correct misalignment in optical connectors between the board and backplane. The alignment correction capability were characterized for both DC and AC (1GHz) optical signal. The speed and bandwidth of the VCSOA was measured and compared with a same structure VCSEL. Based on the optical inverter being studied in our lab, an all-optical flip-flop was demonstrated using a pair of VCSOAs. This memory cell with random access ability can store one bit optical signal with set or

  14. 47 CFR 64.1401 - Expanded interconnection.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 3 2010-10-01 2010-10-01 false Expanded interconnection. 64.1401 Section 64...) MISCELLANEOUS RULES RELATING TO COMMON CARRIERS Expanded Interconnection § 64.1401 Expanded interconnection. (a... 69, subpart G of this chapter, shall offer expanded interconnection for interstate special...

  15. Data Interconnection Exploration

    Science.gov (United States)

    Iniguez, Alfredo Bravo

    2011-01-01

    This project involves innovating the way the Quality Assurance organization at the Jet Propulsion Laboratory (JPL) tracks the receiving inspection of JPL Critical Items (JCI) procured from suppliers. The Quality Assurance organization uses a Microsoft Access based front-end to enter items into an inspection queue. The current design has grown to be much more than was expected when the inspection queue system was created in 2007. The goal is to migrate to a web based solution that will allow the handling of more data, multiple input interfaces, and customizable display options. This has been achieved by implementing a divided tables scheme, the use of ColdFusion programming language, and the usage of Web 2.0 technologies such as AJAX and jQuery. These updates will allow for future expansion as well as the standardization of inspection queues for the Quality Assurance organization. When engineers and scientists order flight hardware, they cannot use it straight away. After a spacecraft or a satellite has been launched, it will be impossible to repair; therefore, the parts used must be inspected to make sure they are operating correctly and within the required specifications. The task of inspecting these JPL Critical Items (JCI) falls on the Quality Assurance organization. One of the tools the receiving inspection group uses is a database to maintain a queue of inspections that need to be done and of inspections that have been completed. The current Access interface has worked well but increased amounts of data, multiple input interfaces, and changes to how data is handled have made it necessary to seek a new way of organizing items for inspection. In addition, the different inspection groups have recently been merged and each has different ways of keeping track of inspection information. The ultimate goal is for the new group to have one shared inspection queue and website. To achieve this goal, I have been working with Ian Luczon of Procurement Quality Assurance and

  16. Centrality in Interconnected Multilayer Networks

    CERN Document Server

    De Domenico, Manlio; Omodei, Elisa; Gómez, Sergio; Arenas, Alex

    2013-01-01

    Real-world complex systems exhibit multiple levels of relationships. In many cases, they require to be modeled by interconnected multilayer networks, characterizing interactions on several levels simultaneously. It is of crucial importance in many fields, from economics to biology, from urban planning to social sciences, to identify the most (or the less) influent nodes in a network. However, defining the centrality of actors in an interconnected structure is not trivial. In this paper, we capitalize on the tensorial formalism, recently proposed to characterize and investigate this kind of complex topologies, to show how several centrality measures -- well-known in the case of standard ("monoplex") networks -- can be extended naturally to the realm of interconnected multiplexes. We consider diagnostics widely used in different fields, e.g., computer science, biology, communication and social sciences, to cite only some of them. We show, both theoretically and numerically, that using the weighted monoplex obta...

  17. Manufacturing of planar ceramic interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Armstrong, B.L.; Coffey, G.W.; Meinhardt, K.D.; Armstrong, T.R. [Pacific Northwest National Lab., Richland, WA (United States)

    1996-12-31

    The fabrication of ceramic interconnects for solid oxide fuel cells (SOFC) and separator plates for electrochemical separation devices has been a perennial challenge facing developers. Electrochemical vapor deposition (EVD), plasma spraying, pressing, tape casting and tape calendering are processes that are typically utilized to fabricate separator plates or interconnects for the various SOFC designs and electrochemical separation devices. For sake of brevity and the selection of a planar fuel cell or gas separation device design, pressing will be the only fabrication technique discussed here. This paper reports on the effect of the characteristics of two doped lanthanum manganite powders used in the initial studies as a planar porous separator for a fuel cell cathode and as a dense interconnect for an oxygen generator.

  18. High-speed photonics interconnects

    CERN Document Server

    Chrostowski, Lukas

    2013-01-01

    Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the amount of data communicated between chips, so as not to limit overall system performance. To meet the increasing demand for interchip communication bandwidth, researchers are investigating the use of high-speed optical interconnect architectures. Unlike their electrical counterparts, optical interconnects offer high bandwidth and negligible frequency-dependent loss, making possible per-channel data rates of more than 10 Gb/s. High-Speed

  19. Interconnection blocks: a method for providing reusable, rapid, multiple, aligned and planar microfluidic interconnections

    DEFF Research Database (Denmark)

    Sabourin, David; Snakenborg, Detlef; Dufva, Hans Martin

    2009-01-01

    In this paper a method is presented for creating 'interconnection blocks' that are re-usable and provide multiple, aligned and planar microfluidic interconnections. Interconnection blocks made from polydimethylsiloxane allow rapid testing of microfluidic chips and unobstructed microfluidic...

  20. On interconnections, control, and feedback

    NARCIS (Netherlands)

    Willems, JC

    1997-01-01

    The purpose of this paper is to study interconnections and control of dynamical systems in a behavioral context. We start with an extensive physical example which serves to illustrate that the familiar input-output feedback loop structure is not as universal as we have been taught to believe, This l

  1. Regulatory Issues Surrounding Merchant Interconnection

    Energy Technology Data Exchange (ETDEWEB)

    Kuijlaars, Kees-Jan; Zwart, Gijsbert [Office for Energy Regulation (DTe), The Hague (Netherlands)

    2003-11-01

    We discussed various issues concerning the regulatory perspective on private investment in interconnectors. One might claim that leaving investment in transmission infrastructure to competing market parties is more efficient than relying on regulated investment only (especially in the case of long (DC) lines connecting previously unconnected parts of the grids, so that externalities from e.g. loop flows do not play a significant role). We considered that some aspects of interconnection might reduce these market benefits. In particular, the large fixed costs of interconnection construction may lead to significant under investment (due to both first mover monopoly power and the fact that part of generation cost efficiencies realised by interconnection are not captured by the investor itself, and remain external to the investment decision). Second, merchant ownership restricts future opportunities for adaptation of regulation, as would be required e.g. for introduction of potentially more sophisticated methods of congestion management or market splitting. Some of the disadvantages of merchant investment may be mitigated however by a suitable regulatory framework, and we discussed some views in this direction. The issues we discussed are not intended to give a complete framework, and detailed regulation will certainly involve many more specific requirements. Areas we did not touch upon include e.g. the treatment of deep connection costs, rules for operation and maintenance of the line, and impact on availability of capacity on other interconnections.

  2. On interconnections, control, and feedback

    NARCIS (Netherlands)

    Willems, JC

    The purpose of this paper is to study interconnections and control of dynamical systems in a behavioral context. We start with an extensive physical example which serves to illustrate that the familiar input-output feedback loop structure is not as universal as we have been taught to believe, This

  3. Nanophotonic Devices for Optical Interconnect

    DEFF Research Database (Denmark)

    Van Thourhout, D.; Spuesens, T.; Selvaraja, S.K.;

    2010-01-01

    We review recent progress in nanophotonic devices for compact optical interconnect networks. We focus on microdisk-laser-based transmitters and discuss improved design and advanced functionality including all-optical wavelength conversion and flip-flops. Next we discuss the fabrication uniformity...... of the passive routing circuits and their thermal tuning. Finally, we discuss the performance of a wavelength selective detector....

  4. Local Network Wideband Interconnection Alternatives.

    Science.gov (United States)

    1984-01-01

    greater than 1.5 Mbps and two standard televison channels. 1.1 SCOPE Interconnection of local area networks within the continental United States is...may influence : a. Media selection, b. Interface design, c. The use of the 1.5 Mbps data transmission capacity, and d. Adherence to the full-motion video

  5. Immortality of Cu damascene interconnects

    Science.gov (United States)

    Hau-Riege, Stefan P.

    2002-04-01

    We have studied short-line effects in fully-integrated Cu damascene interconnects through electromigration experiments on lines of various lengths and embedded in different dielectric materials. We compare these results with results from analogous experiments on subtractively-etched Al-based interconnects. It is known that Al-based interconnects exhibit three different behaviors, depending on the magnitude of the product of current density, j, and line length, L: For small values of (jL), no void nucleation occurs, and the line is immortal. For intermediate values, voids nucleate, but the line does not fail because the current can flow through the higher-resistivity refractory-metal-based shunt layers. Here, the resistance of the line increases but eventually saturates, and the relative resistance increase is proportional to (jL/B), where B is the effective elastic modulus of the metallization system. For large values of (jL/B), voiding leads to an unacceptably high resistance increase, and the line is considered failed. By contrast, we observed only two regimes for Cu-based interconnects: Either the resistance of the line stays constant during the duration of the experiment, and the line is considered immortal, or the line fails due to an abrupt open-circuit failure. The absence of an intermediate regime in which the resistance saturates is due to the absence of a shunt layer that is able to support a large amount of current once voiding occurs. Since voids nucleate much more easily in Cu- than in Al-based interconnects, a small fraction of short Cu lines fails even at low current densities. It is therefore more appropriate to consider the probability of immortality in the case of Cu rather than assuming a sharp boundary between mortality and immortality. The probability of immortality decreases with increasing amount of material depleted from the cathode, which is proportional to (jL2/B) at steady state. By contrast, the immortality of Al-based interconnects is

  6. 47 CFR 101.519 - Interconnection.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 5 2010-10-01 2010-10-01 false Interconnection. 101.519 Section 101.519... SERVICES 24 GHz Service and Digital Electronic Message Service § 101.519 Interconnection. (a) All DEMS... the public all information necessary to allow interconnection of DEMS networks....

  7. 47 CFR 51.305 - Interconnection.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 3 2010-10-01 2010-10-01 false Interconnection. 51.305 Section 51.305 Telecommunication FEDERAL COMMUNICATIONS COMMISSION (CONTINUED) COMMON CARRIER SERVICES (CONTINUED) INTERCONNECTION Additional Obligations of Incumbent Local Exchange Carriers § 51.305 Interconnection. (a) An incumbent...

  8. 18 CFR 292.306 - Interconnection costs.

    Science.gov (United States)

    2010-04-01

    ... 18 Conservation of Power and Water Resources 1 2010-04-01 2010-04-01 false Interconnection costs... § 292.306 Interconnection costs. (a) Obligation to pay. Each qualifying facility shall be obligated to pay any interconnection costs which the State regulatory authority (with respect to any...

  9. 14 CFR 23.701 - Flap interconnection.

    Science.gov (United States)

    2010-01-01

    ... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Flap interconnection. 23.701 Section 23.701... Systems § 23.701 Flap interconnection. (a) The main wing flaps and related movable surfaces as a system must— (1) Be synchronized by a mechanical interconnection between the movable flap surfaces that...

  10. 47 CFR 69.124 - Interconnection charge.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 3 2010-10-01 2010-10-01 false Interconnection charge. 69.124 Section 69.124... Computation of Charges § 69.124 Interconnection charge. (a) Until December 31, 2001, local exchange carriers not subject to price cap regulation shall assess an interconnection charge expressed in dollars...

  11. Driving Interconnected Networks to Supercriticality

    Directory of Open Access Journals (Sweden)

    Filippo Radicchi

    2014-04-01

    Full Text Available Networks in the real world do not exist as isolated entities, but they are often part of more complicated structures composed of many interconnected network layers. Recent studies have shown that such mutual dependence makes real networked systems potentially exposed to atypical structural and dynamical behaviors, and thus there is an urgent necessity to better understand the mechanisms at the basis of these anomalies. Previous research has mainly focused on the emergence of atypical properties in relation to the moments of the intra- and interlayer degree distributions. In this paper, we show that an additional ingredient plays a fundamental role for the possible scenario that an interconnected network can face: the correlation between intra- and interlayer degrees. For sufficiently high amounts of correlation, an interconnected network can be tuned, by varying the moments of the intra- and interlayer degree distributions, in distinct topological and dynamical regimes. When instead the correlation between intra- and interlayer degrees is lower than a critical value, the system enters in a supercritical regime where dynamical and topological phases are no longer distinguishable.

  12. Interconnects for nanoscale MOSFET technology: a review

    Institute of Scientific and Technical Information of China (English)

    Amit Chaudhry

    2013-01-01

    In this paper,a review of Cu/low-k,carbon nanotube (CNT),graphene nanoribbon (GNR) and optical based interconnect technologies has been done.Interconnect models,challenges and solutions have also been discussed.Of all the four technologies,CNT interconnects satisfy most of the challenges and they are most suited for nanometer scale technologies,despite some minor drawbacks.It is concluded that beyond 32 nm technology,a paradigm shift in the interconnect material is required as Cu/low-k interconnects are approaching fundamental limits.

  13. Interconnects for nanoscale MOSFET technology: a review

    Science.gov (United States)

    Chaudhry, Amit

    2013-06-01

    In this paper, a review of Cu/low-k, carbon nanotube (CNT), graphene nanoribbon (GNR) and optical based interconnect technologies has been done. Interconnect models, challenges and solutions have also been discussed. Of all the four technologies, CNT interconnects satisfy most of the challenges and they are most suited for nanometer scale technologies, despite some minor drawbacks. It is concluded that beyond 32 nm technology, a paradigm shift in the interconnect material is required as Cu/low-k interconnects are approaching fundamental limits.

  14. Interconnectivity structure of a general interdependent network.

    Science.gov (United States)

    Van Mieghem, P

    2016-04-01

    A general two-layer network consists of two networks G_{1} and G_{2}, whose interconnection pattern is specified by the interconnectivity matrix B. We deduce desirable properties of B from a dynamic process point of view. Many dynamic processes are described by the Laplacian matrix Q. A regular topological structure of the interconnectivity matrix B (constant row and column sum) enables the computation of a nontrivial eigenmode (eigenvector and eigenvalue) of Q. The latter eigenmode is independent from G_{1} and G_{2}. Such a regularity in B, associated to equitable partitions, suggests design rules for the construction of interconnected networks and is deemed crucial for the interconnected network to show intriguing behavior, as discovered earlier for the special case where B=wI refers to an individual node to node interconnection with interconnection strength w. Extensions to a general m-layer network are also discussed.

  15. Tendon repair

    Science.gov (United States)

    Repair of tendon ... Tendon repair can be performed using: Local anesthesia (the immediate area of the surgery is pain-free) ... a cut on the skin over the injured tendon. The damaged or torn ends of the tendon ...

  16. Data base for Interconnect welds

    CERN Document Server

    Wildner, E

    2007-01-01

    The interconnect work for the LHC equipment involves a large amount of data and files generated by the machines and the tooling. Different kinds of technologies for different kinds of interconnections result in different data, file types and file formats. This data should normally be stored in the MTF, file by file. This was too time consuming and error prone. In order to free time for quality control to improve the correct handling of the data files and information a data-base system was developed to organize and handle as automatically as possible dataflow and checks. This was the first goal set up. This is now in operation and is giving satisfaction in industry and at CERN. An important bonus of a data base system is that we can get an overview of the quality of the data and make possible feed back to the process. For the moment we cannot see clear correlation between data and non conformities which means that the tuning of the tooling is satisfactory. It is important to have efficient access to the data t...

  17. Multi-net optimization of VLSI interconnect

    CERN Document Server

    Moiseev, Konstantin; Wimer, Shmuel

    2015-01-01

    This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.  • Describes the evolution of interconnect scaling and provides new techniques for layout migration and optimization, focusing on multi-net optimization; • Presents research results that provide a level of design optimization which does not exist in commercially-available design automation software tools; • Includes mathematical properties and conditions for optimal...

  18. Dynamic interconnection component using wireless infrared technology

    Institute of Scientific and Technical Information of China (English)

    JIA Dagong; WANG Guanghui; ZHANG Yimo; ZHANG Yinxin; JING Wencai; ZHOU Ge

    2007-01-01

    An efficient dynamic interconnection model using wireless infrared technology and the theory of optical interconnections was constructed to design a dual-channel interconnection component.There were three conditions between the rotating optical field and the stationary optical field:end separation,angle misalignment and lateral misalignment.The calculation formulas were given for these three conditions.A dual-channel optical interconnection component was designed based on the dynamic interconnection model and the data transmission rate of the component was measured.The experimental result showed that the dualchannel optical interconnection component could transmit optical signals across the rotating interface.The maximum transmission rate can reach 2.14 Mb/s.

  19. Integrated Optical Interconnect Architectures for Embedded Systems

    CERN Document Server

    Nicolescu, Gabriela

    2013-01-01

    This book provides a broad overview of current research in optical interconnect technologies and architectures. Introductory chapters on high-performance computing and the associated issues in conventional interconnect architectures, and on the fundamental building blocks for integrated optical interconnect, provide the foundations for the bulk of the book which brings together leading experts in the field of optical interconnect architectures for data communication. Particular emphasis is given to the ways in which the photonic components are assembled into architectures to address the needs of data-intensive on-chip communication, and to the performance evaluation of such architectures for specific applications.   Provides state-of-the-art research on the use of optical interconnects in Embedded Systems; Begins with coverage of the basics for high-performance computing and optical interconnect; Includes a variety of on-chip optical communication topologies; Features coverage of system integration and opti...

  20. Bladder exstrophy repair

    Science.gov (United States)

    Bladder birth defect repair; Everted bladder repair; Exposed bladder repair; Repair of bladder exstrophy ... Bladder exstrophy repair involves two surgeries. The first surgery is to repair the bladder and the second one is to attach ...

  1. Statistical Elmore delay of RC interconnect tree

    Institute of Scientific and Technical Information of China (English)

    Dong Gang; Yang Yang; Chai Chang-Chun; Yang Yin-Tang

    2010-01-01

    As feature size keeps scaling down, process variations can dramatically reduce the accuracy in the estimation of interconnect performance. This paper proposes a statistical Elmore delay model for RC interconnect tree in the presence of process variations. The suggested method translates the process variations into parasitic parameter extraction and statistical Elmore delay evaluation. Analytical expressions of mean and standard deviation of interconnect delay can be obtained in a given fluctuation range of interconnect geometric parameters. Experimental results demonstrate that the approach matches well with Monte Carlo simulations. The errors of proposed mean and standard deviation are less than 1% and 7%, respectively. Simulations prove that our model is efficient and accurate.

  2. Visualizing interconnections among climate risks

    Science.gov (United States)

    Tanaka, K.; Yokohata, T.; Nishina, K.; Takahashi, K.; Emori, S.; Kiguchi, M.; Iseri, Y.; Honda, Y.; Okada, M.; Masaki, Y.; Yamamoto, A.; Shigemitsu, M.; Yoshimori, M.; Sueyoshi, T.; Hanasaki, N.; Ito, A.; Sakurai, G.; Iizumi, T.; Nishimori, M.; Lim, W. H.; Miyazaki, C.; Kanae, S.; Oki, T.

    2015-12-01

    It is now widely recognized that climate change is affecting various sectors of the world. Climate change impact on one sector may spread out to other sectors including those seemingly remote, which we call "interconnections of climate risks". While a number of climate risks have been identified in the Intergovernmental Panel on Climate Change (IPCC) Fifth Assessment Report (AR5), there has been no attempt to explore their interconnections comprehensively. Here we present a first and most exhaustive visualization of climate risks drawn based on a systematic literature survey. Our risk network diagrams depict that changes in the climate system impact natural capitals (terrestrial water, crop, and agricultural land) as well as social infrastructures, influencing the socio-economic system and ultimately our access to food, water, and energy. Our findings suggest the importance of incorporating climate risk interconnections into impact and vulnerability assessments and call into question the widely used damage function approaches, which address a limited number of climate change impacts in isolation. Furthermore, the diagram is useful to educate decision makers, stakeholders, and general public about cascading risks that can be triggered by the climate change. Socio-economic activities today are becoming increasingly more inter-dependent because of the rapid technological progress, urbanization, and the globalization among others. Equally complex is the ecosystem that is susceptible to climate change, which comprises interwoven processes affecting one another. In the context of climate change, a number of climate risks have been identified and classified according to regions and sectors. These reports, however, did not fully address the inter-relations among risks because of the complexity inherent in this issue. Climate risks may ripple through sectors in the present inter-dependent world, posing a challenge ahead of us to maintain the resilience of the system. It is

  3. Interconnection blocks with minimal dead volumes permitting planar interconnection to thin microfluidic devices

    DEFF Research Database (Denmark)

    Sabourin, David; Snakenborg, Detlef; Dufva, Martin

    2010-01-01

    We have previously described 'Interconnection Blocks' which are re-usable, non-integrated PDMS blocks which allowing multiple, aligned and planar microfluidic interconnections. Here, we describe Interconnection Block versions with zero dead volumes that allow fluidic interfacing to flat or thin s...

  4. Interconnections in ULSI: Correlation and Crosstalk

    Science.gov (United States)

    1992-12-31

    cide interconnects. Finally. in Section V. we present the 2L conclusions. -_-. - ax, II. THEORY + A"- a- ) A. Coupling Between Optical Interconnects - To... TesIs . Note that the circulating urrent pattems hardly carry any net current in the x.direction. Therefore, the conductance of the stmctue will be very

  5. Interconnection of J-lossless behaviours

    NARCIS (Netherlands)

    Rao, S.

    In this paper, motivated by the phenomenon of the interconnection of lossless electrical networks, a class of behaviours known as J-lossless behaviours is introduced, where J is a symmetric two-variable polynomial matrix. It is shown that for certain values of J, interconnection of J-lossless

  6. Colligation or, The Logical Inference of Interconnection

    DEFF Research Database (Denmark)

    Franksen, Ole Immanuel; Falster, Peter

    2000-01-01

    laws or assumptions. Yet interconnection as an abstract concept seems to be without scientific underpinning in oure logic. Adopting a historical viewpoint, our aim is to show that the reasoning of interconnection may be identified with a neglected kind of logical inference, called "colligation...

  7. Epidemics in interconnected small-world networks

    NARCIS (Netherlands)

    Liu, M.; Li, D.; Qin, P.; Liu, C.; Wang, H.; Wang, F.

    2015-01-01

    Networks can be used to describe the interconnections among individuals, which play an important role in the spread of disease. Although the small-world effect has been found to have a significant impact on epidemics in single networks, the small-world effect on epidemics in interconnected networks

  8. Interconnection of J-lossless behaviours

    NARCIS (Netherlands)

    Rao, Shodhan

    2010-01-01

    In this paper, motivated by the phenomenon of the interconnection of lossless electrical networks, a class of behaviours known as J-lossless behaviours is introduced, where J is a symmetric two-variable polynomial matrix. It is shown that for certain values of J, interconnection of J-lossless behav

  9. Interconnection of systems : the network paradigm

    NARCIS (Netherlands)

    Maschke, B.M.; Schaft, A.J. van der

    1996-01-01

    In this paper we propose first to recall the different interconnection structures appearing in network models and to show their exact correspondence with Dirac structures. This definition of interconnection is purely implicit hence does not discriminate between inputs and outputs among the interconn

  10. 47 CFR 95.141 - Interconnection prohibited.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 5 2010-10-01 2010-10-01 false Interconnection prohibited. 95.141 Section 95.141 Telecommunication FEDERAL COMMUNICATIONS COMMISSION (CONTINUED) SAFETY AND SPECIAL RADIO SERVICES PERSONAL RADIO SERVICES General Mobile Radio Service (GMRS) § 95.141 Interconnection prohibited. No...

  11. Updating Technical Screens for PV Interconnection: Preprint

    Energy Technology Data Exchange (ETDEWEB)

    Coddington, M.; Ellis, A.; Lynn, K.; Razon, A.; Key, T.; Kroposki, B.; Mather, B.; Hill, R.; Nicole, K.; Smith, J.

    2012-08-01

    Solar photovoltaics (PV) is the dominant type of distributed generation (DG) technology interconnected to electric distribution systems in the United States, and deployment of PV systems continues to increase rapidly. Considering the rapid growth and widespread deployment of PV systems in United States electric distribution grids, it is important that interconnection procedures be as streamlined as possible to avoid unnecessary interconnection studies, costs, and delays. Because many PV interconnection applications involve high penetration scenarios, the process needs to allow for a sufficiently rigorous technical evaluation to identify and address possible system impacts. Existing interconnection procedures are designed to balance the need for efficiency and technical rigor for all DG. However, there is an implicit expectation that those procedures will be updated over time in order to remain relevant with respect to evolving standards, technology, and practical experience. Modifications to interconnection screens and procedures must focus on maintaining or improving safety and reliability, as well as accurately allocating costs and improving expediency of the interconnection process. This paper evaluates the origins and usefulness of the capacity penetration screen, offers potential short-term solutions which could effectively allow fast-track interconnection to many PV system applications, and considers longer-term solutions for increasing PV deployment levels in a safe and reliable manner while reducing or eliminating the emphasis on the penetration screen.

  12. 47 CFR 90.477 - Interconnected systems.

    Science.gov (United States)

    2010-10-01

    ...) Applicants for new land stations to be interconnected with the public switched telephone network must... switched telephone network only after modifying their license. See § 1.929 of this chapter. In all cases a..., 896-901 MHz, and 935-940 MHz, interconnection with the public switched telephone network is...

  13. Modeling interconnect corners under double patterning misalignment

    Science.gov (United States)

    Hyun, Daijoon; Shin, Youngsoo

    2016-03-01

    Publisher's Note: This paper, originally published on March 16th, was replaced with a corrected/revised version on March 28th. If you downloaded the original PDF but are unable to access the revision, please contact SPIE Digital Library Customer Service for assistance. Interconnect corners should accurately reflect the effect of misalingment in LELE double patterning process. Misalignment is usually considered separately from interconnect structure variations; this incurs too much pessimism and fails to reflect a large increase in total capacitance for asymmetric interconnect structure. We model interconnect corners by taking account of misalignment in conjunction with interconnect structure variations; we also characterize misalignment effect more accurately by handling metal pitch at both sides of a target metal independently. Identifying metal space at both sides of a target metal.

  14. Decentralized Control for a Class of Similar Composite Systems with Interconnections with Unsatisfying Interconnection Condition

    Institute of Scientific and Technical Information of China (English)

    WANG Zheng; LI Zhong-hai; ZHANG Si-ying; HOU Xue-zhang

    2001-01-01

    In this paper, a class of similar composite systems is discussed, whose interconnections areasymmetrical and mismatched. The interconnection condition is proposed. Based on it, the interconnectionsare divided into two parts. One satisfies the interconnection condition, by means of the two--step method,the decentralized controllers are designed. The other does not satisfy the interconnection condition, but thisis offsetted by good quality of the system itself. Based on these, a sufficient condition is given by some linearmatrix inequalities, which makes the studied systems quadratic stabile via linear decentralized controllers bymaking use of the information of interconnections better.

  15. Large data centers interconnect bottlenecks.

    Science.gov (United States)

    Ghiasi, Ali

    2015-02-09

    Large data centers interconnect bottlenecks are dominated by the switch I/O BW and the front panel BW as a result of pluggable modules. To overcome the front panel BW and the switch ASIC BW limitation one approach is to either move the optics onto the mid-plan or integrate the optics into the switch ASIC. Over the last 4 years, VCSEL based optical engines have been integrated into the packages of large-scale HPC routers, moderate size Ethernet switches, and even FPGA's. Competing solutions based on Silicon Photonics (SiP) have also been proposed for integration into HPC and Ethernet switch packages but with better integration path through the use of TSV (Through Silicon Via) stack dies. Integrating either VCSEL or SiP based optical engines into complex ASIC package that operates at high temperatures, where the required reliability is not trivial, one should ask what is the technical or the economic advantage before embarking on such a complex integration. High density Ethernet switches addressing data centers currently in development are based on 25G NRZ signaling and QSFP28 optical module that can support up to 3.6 Tb of front panel bandwidth.

  16. Vocabulary of interconnections. Vocabulaire des interconnexions

    Energy Technology Data Exchange (ETDEWEB)

    1990-03-01

    A French vocabulary of terms used in the field of interconnection of electric power systems, is provided in order to standardize terminology at Hydro-Quebec. The vocabulary encompasses many subfields directly or indirectly related to interconnections, such as overhead lines, load forecasting, network operation, and interconnection contracts and conventions. International French terminology is adopted throughout, except for specifically North American realities for which new terms have been proposed. English equivalents of terms are provided for informative purposes and are not standardized. An index of the English terms is included. 128 refs.

  17. MFT - Muon Forward Tracker Sensor Interconnection Techniques

    CERN Document Server

    Catania, Alessandro

    2016-01-01

    Most detectors nowadays take the form of an active pixel sensor, which enables the detection and characterization of particles. This pixel sensor needs to be interconnected to some circuit board in order for this data to be read out and analyzed. Therefore various interconnection techniques are being tested out to assess the read out performance and data validity. One of these interconnection techniques is conductive gluing which is being tested in order to observe if it is a viable solution for this project and other project.

  18. Partial Synchronization of Interconnected Boolean Networks.

    Science.gov (United States)

    Chen, Hongwei; Liang, Jinling; Lu, Jianquan

    2017-01-01

    This paper addresses the partial synchronization problem for the interconnected Boolean networks (BNs) via the semi-tensor product (STP) of matrices. First, based on an algebraic state space representation of BNs, a necessary and sufficient criterion is presented to ensure the partial synchronization of the interconnected BNs. Second, by defining an induced digraph of the partial synchronized states set, an equivalent graphical description for the partial synchronization of the interconnected BNs is established. Consequently, the second partial synchronization criterion is derived in terms of adjacency matrix of the induced digraph. Finally, two examples (including an epigenetic model) are provided to illustrate the efficiency of the obtained results.

  19. Uniform wire segmentation algorithm of distributed interconnects

    Institute of Scientific and Technical Information of China (English)

    Yin Guoli; Lin Zhenghui

    2007-01-01

    A uniform wire segmentation algorithm for performance optimization of distributed RLC interconnects was proposed in this paper. The optimal wire length for identical segments and buffer size for buffer insertion are obtained through computation and derivation, based on a 2-pole approximation model of distributed RLC interconnect. For typical inductance value and long wires under 180nm technology, experiments show that the uniform wire segmentation technique proposed in the paper can reduce delay by about 27% ~ 56% , while requires 34%~69% less total buffer usage and thus 29% to 58% less power consumption. It is suitable for long RLC interconnect performance optimization.

  20. Pressure activated interconnection of micro transfer printed components

    Science.gov (United States)

    Prevatte, Carl; Guven, Ibrahim; Ghosal, Kanchan; Gomez, David; Moore, Tanya; Bonafede, Salvatore; Raymond, Brook; Trindade, António Jose; Fecioru, Alin; Kneeburg, David; Meitl, Matthew A.; Bower, Christopher A.

    2016-05-01

    Micro transfer printing and other forms of micro assembly deterministically produce heterogeneously integrated systems of miniaturized components on non-native substrates. Most micro assembled systems include electrical interconnections to the miniaturized components, typically accomplished by metal wires formed on the non-native substrate after the assembly operation. An alternative scheme establishing interconnections during the assembly operation is a cost-effective manufacturing method for producing heterogeneous microsystems, and facilitates the repair of integrated microsystems, such as displays, by ex post facto addition of components to correct defects after system-level tests. This letter describes pressure-concentrating conductor structures formed on silicon (1 0 0) wafers to establish connections to preexisting conductive traces on glass and plastic substrates during micro transfer printing with an elastomer stamp. The pressure concentrators penetrate a polymer layer to form the connection, and reflow of the polymer layer bonds the components securely to the target substrate. The experimental yield of series-connected test systems with >1000 electrical connections demonstrates the suitability of the process for manufacturing, and robustness of the test systems against exposure to thermal shock, damp heat, and mechanical flexure shows reliability of the resulting bonds.

  1. Hypospadias repair

    Science.gov (United States)

    ... the problem. If the repair is not done, problems may occur later on such as: Difficulty controlling and directing urine stream A curve in the penis during erection Decreased fertility Embarrassment about appearance of penis Surgery ...

  2. Recent Development of SOFC Metallic Interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Wu JW, Liu XB

    2010-04-01

    Interest in solid oxide fuel cells (SOFC) stems from their higher e±ciencies and lower levels of emitted pollu- tants, compared to traditional power production methods. Interconnects are a critical part in SOFC stacks, which connect cells in series electrically, and also separate air or oxygen at the cathode side from fuel at the anode side. Therefore, the requirements of interconnects are the most demanding, i:e:, to maintain high elec- trical conductivity, good stability in both reducing and oxidizing atmospheres, and close coe±cient of thermal expansion (CTE) match and good compatibility with other SOFC ceramic components. The paper reviewed the interconnect materials, and coatings for metallic interconnect materials.

  3. Variation Tolerant On-Chip Interconnects

    CERN Document Server

    Nigussie, Ethiopia Enideg

    2012-01-01

    This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects.  Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next generation, high-performance electronics systems. Provides comprehensive, circuit-level explanation of high-performance, energy-efficient, variation-tolerant on-chip interconnect; Describes design techniques to mitigate problems caused by variation; Includes techniques for design and implementation of self-timed on-chip interconnect, delay variation insensitive communication protocols, high speed signaling techniques and circuits, bit-width independent completion detection and process, voltage and temperature variation tolerance.                          

  4. Optical Interconnects for Future Data Center Networks

    CERN Document Server

    Bergman, Keren; Tomkos, Ioannis

    2013-01-01

    Optical Interconnects for Future Data Center Networks covers optical networks and how they can provide high bandwidth, energy efficient interconnects with increased communication bandwidth. This volume, with contributions from leading researchers in the field, presents an integrated view of the expected future requirements of data centers and serves as a reference for some of the most advanced and promising solutions proposed by researchers from leading universities, research labs, and companies. The work also includes several novel architectures, each demonstrating different technologies such as optical circuits, optical switching, MIMO optical OFDM, and others. Additionally, Optical Interconnects for Future Data Center Networks provides invaluable insights into the benefits and advantages of optical interconnects and how they can be a promising alternative for future data center networks.

  5. Traffic congestion in interconnected complex networks.

    Science.gov (United States)

    Tan, Fei; Wu, Jiajing; Xia, Yongxiang; Tse, Chi K

    2014-06-01

    Traffic congestion in isolated complex networks has been investigated extensively over the last decade. Coupled network models have recently been developed to facilitate further understanding of real complex systems. Analysis of traffic congestion in coupled complex networks, however, is still relatively unexplored. In this paper, we try to explore the effect of interconnections on traffic congestion in interconnected Barabási-Albert scale-free networks. We find that assortative coupling can alleviate traffic congestion more readily than disassortative and random coupling when the node processing capacity is allocated based on node usage probability. Furthermore, the optimal coupling probability can be found for assortative coupling. However, three types of coupling preferences achieve similar traffic performance if all nodes share the same processing capacity. We analyze interconnected Internet autonomous-system-level graphs of South Korea and Japan and obtain similar results. Some practical suggestions are presented to optimize such real-world interconnected networks accordingly.

  6. The Interconnections of the LHC Cryomagnets

    CERN Document Server

    Jacquemod, A; Skoczen, Blazej; Tock, J P

    2001-01-01

    The main components of the LHC, the next world-class facility in high-energy physics, are the twin-aperture high-field superconducting cryomagnets to be installed in the existing 26.7-km long tunnel. After installation and alignment, the cryomagnets have to be interconnected. The interconnections must ensure the continuity of several functions: vacuum enclosures, beam pipe image currents (RF contacts), cryogenic circuits, electrical power supply, and thermal insulation. In the machine, about 1700 interconnections between cryomagnets are necessary. The interconnections constitute a unique system that is nearly entirely assembled in the tunnel. For each of them, various operations must be done: TIG welding of cryogenic channels (~ 50 000 welds), induction soldering of main superconducting cables (~ 10 000 joints), ultrasonic welding of auxiliary superconducting cables (~ 20 000 welds), mechanical assembly of various elements, and installation of the multi-layer insulation (~ 200 000 m2). Defective junctions cou...

  7. Traffic congestion in interconnected complex networks

    CERN Document Server

    Tan, Fei; Xia, Yongxiang; Tse, Chi K

    2014-01-01

    Traffic congestion in isolated complex networks has been investigated extensively over the last decade. Coupled network models have recently been developed to facilitate further understanding of real complex systems. Analysis of traffic congestion in coupled complex networks, however, is yet to come. In this paper, we try to explore the effect of interconnections on traffic congestion in interconnected BA scale-free networks. We find that assortative coupling can alleviate traffic congestion better than disassortative and random coupling when the node processing capacity is allocated based on node usage probability. Furthermore, the optimal coupling probability can be found for assortative coupling. However, three types of coupling preferences achieve similar traffic performance if all nodes share the same processing capacity. We analyze interconnected Internet AS-level graphs of Japan and South Korea and obtain similar results. Some practical suggestions are presented to optimize such real-world interconnect...

  8. One-dimensional nano-interconnection formation.

    Science.gov (United States)

    Ji, Jianlong; Zhou, Zhaoying; Yang, Xing; Zhang, Wendong; Sang, Shengbo; Li, Pengwei

    2013-09-23

    Interconnection of one-dimensional nanomaterials such as nanowires and carbon nanotubes with other parts or components is crucial for nanodevices to realize electrical contacts and mechanical fixings. Interconnection has been being gradually paid great attention since it is as significant as nanomaterials properties, and determines nanodevices performance in some cases. This paper provides an overview of recent progress on techniques that are commonly used for one-dimensional interconnection formation. In this review, these techniques could be categorized into two different types: two-step and one-step methods according to their established process. The two-step method is constituted by assembly and pinning processes, while the one-step method is a direct formation process of nano-interconnections. In both methods, the electrodeposition approach is illustrated in detail, and its potential mechanism is emphasized.

  9. Fluidic interconnections for microfluidic systems: A new integrated fluidic interconnection allowing plug 'n' play functionality

    DEFF Research Database (Denmark)

    Perozziello, Gerardo; Bundgaard, Frederik; Geschke, Oliver

    2008-01-01

    A crucial challenge in packaging of microsystems is microfluidic interconnections. These have to seal the ports of the system, and have to provide the appropriate interface to other devices or the external environment. Integrated fluidic interconnections appear to be a good solution...... for interconnecting polymer microsystems in terms of cost, space and performance. Following this path we propose a new reversible, integrated fluidic interconnection composed of custom-made cylindrical rings integrated in a polymer house next to the fluidic network. This allows plug 'n' play functionality between...... external metal ferrules and the system. Theoretical calculations are made to dimension and model the integrated fluidic interconnection. Leakage tests are performed on the interconnections, in order to experimentally confirm the model, and detect its limits....

  10. Types of solutions improving passenger transport interconnectivity

    Directory of Open Access Journals (Sweden)

    Monika BĄK

    2012-01-01

    Full Text Available The objective of the paper is to present different types of solutions which could improve interconnectivity of passenger transport especially within interconnections between long and short transport distance. The topic has particular relevance at the European level because the European transport networks’ role as integrated international networks is compromised by poor interconnectivity and because the next generation of European transport policies will have to be sensitive to the differences between short, medium and long-term transport markets and the market advantages of each transport mode. In this context, a realistic assessment of intermodal opportunities is a key ingredient to future policy development.Effective interconnection requires the provision of integrated networks and services which are attractive to potential users and this is likely to require co-operation between a range of authorities and providers in the public and private sectors and may necessitate a wider vision than might otherwise prevail.The paper is based on the results of the project realised by the team of the University of Gdansk in the EU funded 7 Framework Programme - INTERCONNECT (Interconnection between short- and long-distance transport networks with partners in the UK, Germany, Denmark, Poland, Spain and Italy. Different types of solutions will be summarized in the paper including e.g. local link infrastructure solutions, improved local public transport services, improvements at the interchange, solutions involving improved procedures for check-in or luggage transfer & documentation, pricing and ticketing solutions, solutions involving marketing, information and sales.

  11. Epidemics spreading in interconnected complex networks

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Y. [School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798 (Singapore); Institute of High Performance Computing, Agency for Science, Technology and Research (A-STAR), Singapore 138632 (Singapore); Xiao, G., E-mail: egxxiao@ntu.edu.sg [School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798 (Singapore)

    2012-09-03

    We study epidemic spreading in two interconnected complex networks. It is found that in our model the epidemic threshold of the interconnected network is always lower than that in any of the two component networks. Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. Theoretical analysis and simulation results show that, generally speaking, the epidemic size is not significantly affected by the inter-network correlation. In interdependent networks which can be viewed as a special case of interconnected networks, however, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant. -- Highlights: ► We study epidemic spreading in two interconnected complex networks. ► The epidemic threshold is lower than that in any of the two networks. And Interconnection correlation has impacts on threshold and average outbreak size. ► Detailed theoretical analysis is proposed which allows quick and accurate calculations of epidemic threshold and average outbreak/epidemic size. ► We demonstrated and proved that Interconnection correlation does not affect epidemic size significantly. ► In interdependent networks, impacts of inter-network correlation on the epidemic threshold and outbreak size are more significant.

  12. Navigability of interconnected networks under random failures

    Science.gov (United States)

    De Domenico, Manlio; Solé-Ribalta, Albert; Gómez, Sergio; Arenas, Alex

    2014-01-01

    Assessing the navigability of interconnected networks (transporting information, people, or goods) under eventual random failures is of utmost importance to design and protect critical infrastructures. Random walks are a good proxy to determine this navigability, specifically the coverage time of random walks, which is a measure of the dynamical functionality of the network. Here, we introduce the theoretical tools required to describe random walks in interconnected networks accounting for structure and dynamics inherent to real systems. We develop an analytical approach for the covering time of random walks in interconnected networks and compare it with extensive Monte Carlo simulations. Generally speaking, interconnected networks are more resilient to random failures than their individual layers per se, and we are able to quantify this effect. As an application––which we illustrate by considering the public transport of London––we show how the efficiency in exploring the multiplex critically depends on layers’ topology, interconnection strengths, and walk strategy. Our findings are corroborated by data-driven simulations, where the empirical distribution of check-ins and checks-out is considered and passengers travel along fastest paths in a network affected by real disruptions. These findings are fundamental for further development of searching and navigability strategies in real interconnected systems. PMID:24912174

  13. Femoral hernia repair

    Science.gov (United States)

    Femorocele repair; Herniorrhaphy; Hernioplasty - femoral ... During surgery to repair the hernia, the bulging tissue is pushed back in. The weakened area is sewn closed or strengthened. This repair ...

  14. Undescended testicle repair

    Science.gov (United States)

    Orchidopexy; Inguinal orchidopexy; Orchiopexy; Repair of undescended testicle; Cryptorchidism repair ... first year of life without treatment. Undescended testicle repair surgery is recommended for patients whose testicles do ...

  15. Advancement of photonic interconnects for spaceborne systems

    Science.gov (United States)

    Bristow, Julian P.; Lehman, John A.; Morgan, Robert A.; Deruiter, John L.

    1997-07-01

    Optical interconnects have long promised significant advantages over their electrical counterparts. Specific advantages include increased bandwidths at long (ten meters or more) interconnection distances, immunity to EMI effects, negligible crosstalk, reduced size, and lower weight. Optical interconnects have been developed for, and are being used in, a range of ground based and aircraft applications, however they are only now beginning to gain acceptance in spaceborne systems. In addition to the maturity demanded from components destined for ground-based applications and the wider temperature excursions characteristic of airborne applications, spaceborne components must also be able to survive the radiation environments associated with their intended applications. The additional qualification required has resulted in delayed introduction of photonic interconnects. We describe the tradeoffs involved in implementing for the first time a spaceborne fiber optic data bus with a clock speed of 1.2 Gbps. The tradeoffs include emitter, detectors, fiber, connectors and packaging. We have selected a series of commercial grade optoelectronic devices which were then qualified for use in spaceborne environments and have developed a space quantifiable packaging scheme. We have designed and implemented the optoelectronic subsystem of the data bus and have simulated its operation. We also describe recent advances in Vertical Cavity Surface Emitting Lasers (VCSELs) for spaceborne databuses. VCSELs also offer advantages in simplicity of packaging and electronic control. We summarize available initial radiation data on these devices and project their impact on spaceborne photonic interconnects.

  16. Intestinal obstruction repair

    Science.gov (United States)

    Repair of volvulus; Intestinal volvulus - repair; Bowel obstruction - repair ... Intestinal obstruction repair is done while you are under general anesthesia . This means you are asleep and DO NOT feel pain. ...

  17. Aortic aneurysm repair - endovascular

    Science.gov (United States)

    EVAR; Endovascular aneurysm repair - aorta; AAA repair - endovascular; Repair - aortic aneurysm - endovascular ... Endovascular aortic repair is done because your aneurysm is very large, growing quickly, or is leaking or bleeding. You may have ...

  18. Motorcycle Repair.

    Science.gov (United States)

    Hein, Jim; Bundy, Mike

    This motorcycle repair curriculum guide contains the following ten areas of study: brake systems, clutches, constant mesh transmissions, final drives, suspension, mechanical starting mechanisms, electrical systems, fuel systems, lubrication systems, and overhead camshafts. Each area consists of one or more units of instruction. Each instructional…

  19. Optical transceivers for interconnections in satellite payloads

    Science.gov (United States)

    Karppinen, Mikko; Heikkinen, Veli; Juntunen, Eveliina; Kautio, Kari; Ollila, Jyrki; Sitomaniemi, Aila; Tanskanen, Antti

    2013-02-01

    The increasing data rates and processing on board satellites call for the use of photonic interconnects providing high-bitrate performance as well as valuable savings in mass and volume. Therefore, optical transmitter and receiver technology is developed for aerospace applications. The metal-ceramic-packaging with hermetic fiber pigtails enables robustness for the harsh spacecraft environment, while the 850-nm VCSEL-based transceiver technology meets the high bit-rate and low power requirements. The developed components include 6 Gbps SpaceFibre duplex transceivers for intra-satellite data links and 40 Gbps parallel optical transceivers for board-to-board interconnects. Also, integration concept of interchip optical interconnects for onboard processor ICs is presented.

  20. Random walk centrality in interconnected multilayer networks

    CERN Document Server

    Solé-Ribalta, Albert; Gómez, Sergio; Arenas, Alex

    2015-01-01

    Real-world complex systems exhibit multiple levels of relationships. In many cases they require to be modeled as interconnected multilayer networks, characterizing interactions of several types simultaneously. It is of crucial importance in many fields, from economics to biology and from urban planning to social sciences, to identify the most (or the less) influential nodes in a network using centrality measures. However, defining the centrality of actors in interconnected complex networks is not trivial. In this paper, we rely on the tensorial formalism recently proposed to characterize and investigate this kind of complex topologies, and extend two well known random walk centrality measures, the random walk betweenness and closeness centrality, to interconnected multilayer networks. For each of the measures we provide analytical expressions that completely agree with numerically results.

  1. Turbine repair process, repaired coating, and repaired turbine component

    Energy Technology Data Exchange (ETDEWEB)

    Das, Rupak; Delvaux, John McConnell; Garcia-Crespo, Andres Jose

    2015-11-03

    A turbine repair process, a repaired coating, and a repaired turbine component are disclosed. The turbine repair process includes providing a turbine component having a higher-pressure region and a lower-pressure region, introducing particles into the higher-pressure region, and at least partially repairing an opening between the higher-pressure region and the lower-pressure region with at least one of the particles to form a repaired turbine component. The repaired coating includes a silicon material, a ceramic matrix composite material, and a repaired region having the silicon material deposited on and surrounded by the ceramic matrix composite material. The repaired turbine component a ceramic matrix composite layer and a repaired region having silicon material deposited on and surrounded by the ceramic matrix composite material.

  2. Laser printing of 3D metallic interconnects

    Science.gov (United States)

    Beniam, Iyoel; Mathews, Scott A.; Charipar, Nicholas A.; Auyeung, Raymond C. Y.; Piqué, Alberto

    2016-04-01

    The use of laser-induced forward transfer (LIFT) techniques for the printing of functional materials has been demonstrated for numerous applications. The printing gives rise to patterns, which can be used to fabricate planar interconnects. More recently, various groups have demonstrated electrical interconnects from laser-printed 3D structures. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or of pastes containing dispersed metallic particles. However, the generated 3D structures do not posses the same metallic conductivity as a bulk metal interconnect of the same cross-section and length as those formed by wire bonding or tab welding. An alternative is to laser transfer entire 3D structures using a technique known as lase-and-place. Lase-and-place is a LIFT process whereby whole components and parts can be transferred from a donor substrate onto a desired location with one single laser pulse. This paper will describe the use of LIFT to laser print freestanding, solid metal foils or beams precisely over the contact pads of discrete devices to interconnect them into fully functional circuits. Furthermore, this paper will also show how the same laser can be used to bend or fold the bulk metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief for the circuits under flexing or during motion from thermal mismatch. These interconnect "ridges" can span wide gaps (on the order of a millimeter) and accommodate height differences of tens of microns between adjacent devices. Examples of these laser printed 3D metallic bridges and their role in the development of next generation electronics by additive manufacturing will be presented.

  3. An Improved Interconnection Network Based on NIN

    Institute of Scientific and Technical Information of China (English)

    Li Fei; Li Zhi-tang

    2004-01-01

    The Novel Interconnection Network (NIN)based on inverted-graph topology and crossbar switch is a kind of lower latency and higher throughput interconnection network. But it bas a vital disadvantage, high hardware complexity. In order to reduce system hardware cost, an improved NIN (ININ) structure is proposed. As same as NIN,ININ has constant network diameter. Besides of keeping ad vantages of NIN, hardware cost of ININ is lower than NIN.Furthermore, we design a new deadlock-free routing algorithm for the improved NIN.

  4. A Thermal Model for Carbon Nanotube Interconnects

    Science.gov (United States)

    Mohsin, Kaji Muhammad; Srivastava, Ashok; Sharma, Ashwani K.; Mayberry, Clay

    2013-01-01

    In this work, we have studied Joule heating in carbon nanotube based very large scale integration (VLSI) interconnects and incorporated Joule heating influenced scattering in our previously developed current transport model. The theoretical model explains breakdown in carbon nanotube resistance which limits the current density. We have also studied scattering parameters of carbon nanotube (CNT) interconnects and compared with the earlier work. For 1 µm length single-wall carbon nanotube, 3 dB frequency in S12 parameter reduces to ~120 GHz from 1 THz considering Joule heating. It has been found that bias voltage has little effect on scattering parameters, while length has very strong effect on scattering parameters.

  5. Packaging considerations for planar optical interconnection systems.

    Science.gov (United States)

    Acklin, B; Jahns, J

    1994-03-10

    We discuss various aspects of building an integrated optoelectronic system that is based on the concept of planar optics. A particular optical interconnection system has been fabricated and demonstrated. It provides parallel interconnections with 1024 optical channels that could be useful as an optical backplane in an optoelectronic multichip module. We consider the design and the fabrication of the optical system, schemes for the hybrid integration with optoelectronic device arrays, and the thermal management of an integrated system. The proposed hybrid integration scheme is based on mature technologies such as thermal anodic bonding and flip-chip bonding. Possibilities for efficient heat sinking are described.

  6. Generalized Interconnect Delay Time and Crosstalk Models: I. Applications of Interconnect Optimization Design

    Science.gov (United States)

    Lee, Trent Gwo-Yann; Tseng, Tseung-Yuen; Wong, Shyh-Chyi; Yang, Cheng-Jer; Liang, Mong Song; Cheng, Huang-Chung

    2001-12-01

    New analytical models for estimating the delay time of single line and coupled interconnect for ramp input waveform are derived. The accuracy of the signal delay time and crosstalk noise voltage models for various driver resistances, loading capacitances, and input-ramping rates has also been verified by simulation program with integrated circuit emphasis (SPICE) simulation. Based on the delay and crosstalk models, interconnect optimization design can be discussed thoroughly. The proposed guaranteed-performance interconnect design method is also discussed. These models are useful for performance estimation and layout optimization in VLSI synthesis as well as process optimization in technology development.

  7. Electromigration of damascene copper of IC interconnect

    Science.gov (United States)

    Meyer, William Kevin

    Copper metallization patterned with multi-level damascene process is prone to electromigration failure, which affects the reliability and performance of IC interconnect. In typical products, interconnect that is not already constrained by I·R drop or Joule self-heating operates at 'near threshold' conditions. Measurement of electromigration damage near threshold is very difficult due to slow degradation requiring greatly extended stress times, or high currents that cause thermal anomalies. Software simulations of the electromigration mechanism combined with characterization of temperature profiles allows extracting material parameters and calculation of design rules to ensure reliable interconnect. Test structures capable of demonstrating Blech threshold effects while allowing thermal characterization were designed and processed. Electromigration stress tests at various conditions were performed to extract both shortline (threshold) and long-line (above threshold) performance values. The resistance increase time constant shows immortality below Je·L (product of current density and segment length) of 3200 amp/cm. Statistical analysis of times-to-failure show that long lines last 105 hours at 3.1 mA/mum2 (120°C). While this is more robust than aluminum interconnect, the semiconductor industry will be challenged to improve that performance as future products require.

  8. Systems theory of interconnected port contact systems

    NARCIS (Netherlands)

    Eberard, D.; Maschke, B.M.; Schaft, A.J. van der

    2005-01-01

    Port-based network modeling of a large class of complex physical systems leads to dynamical systems known as port-Hamiltonian systems. The key ingredient of any port-Hamiltonian system is a power-conserving interconnection structure (mathematically formalized by the geometric notion of a Dirac struc

  9. Optical interconnections to focal plane arrays

    Energy Technology Data Exchange (ETDEWEB)

    Rienstra, J.L.; Hinckley, M.K.

    2000-11-01

    The authors have successfully demonstrated an optical data interconnection from the output of a focal plane array to the downstream data acquisition electronics. The demonstrated approach included a continuous wave laser beam directed at a multiple quantum well reflectance modulator connected to the focal plane array analog output. The output waveform from the optical interconnect was observed on an oscilloscope to be a replica of the input signal. They fed the output of the optical data link to the same data acquisition system used to characterize focal plane array performance. Measurements of the signal to noise ratio at the input and output of the optical interconnection showed that the signal to noise ratio was reduced by a factor of 10 or more. Analysis of the noise and link gain showed that the primary contributors to the additional noise were laser intensity noise and photodetector receiver noise. Subsequent efforts should be able to reduce these noise sources considerably and should result in substantially improved signal to noise performance. They also observed significant photocurrent generation in the reflectance modulator that imposes a current load on the focal plane array output amplifier. This current loading is an issue with the demonstrated approach because it tends to negate the power saving feature of the reflectance modulator interconnection concept.

  10. Patterned electrodeposition of interconnects using microcontact printing

    NARCIS (Netherlands)

    Hovestad, A.; Rendering, H.; Maijenburg, A.W.

    2012-01-01

    Microcontact printing combined with electroless deposition is a potential low cost technique to make electrical interconnects for opto-electronic devices. Microcontact printed inhibitors locally prevent electroless deposition resulting in a pre-defined pattern of metal tracks. The inhibition of elec

  11. Vector Lyapunov Functions for Stochastic Interconnected Systems

    Science.gov (United States)

    Boussalis, D.

    1985-01-01

    Theoretical paper presents set of sufficient conditions for asymptotic and exponential stability with probability 1 for class of stochastic interconnected systems. Theory applicable to complicated, large-scale mechanical or electrical systems, and, for several design problems, it reduces computational difficulty by relating stability criteria to fundamental structural features of system.

  12. Adapting Memory Hierarchies for Emerging Datacenter Interconnects

    Institute of Scientific and Technical Information of China (English)

    江涛; 董建波; 侯锐; 柴琳; 张立新; 孙凝晖; 田斌

    2015-01-01

    Efficient resource utilization requires that emerging datacenter interconnects support both high performance communication and efficient remote resource sharing. These goals require that the network be more tightly coupled with the CPU chips. Designing a new interconnection technology thus requires considering not only the interconnection itself, but also the design of the processors that will rely on it. In this paper, we study memory hierarchy implications for the design of high-speed datacenter interconnects—particularly as they affect remote memory access—and we use PCIe as the vehicle for our investigations. To that end, we build three complementary platforms: a PCIe-interconnected prototype server with which we measure and analyze current bottlenecks; a software simulator that lets us model microarchitectural and cache hierarchy changes;and an FPGA prototype system with a streamlined switchless customized protocol Thunder with which we study hardware optimizations outside the processor. We highlight several architectural modifications to better support remote memory access and communication, and quantify their impact and limitations.

  13. Colligation or, The Logical Inference of Interconnection

    DEFF Research Database (Denmark)

    Franksen, Ole Immanuel; Falster, Peter

    2000-01-01

    The concept of interconnection is fundamental to the modelling of disrete physical systems. On the bais of centuries of scientific experience, everyone will agree that the concept is part of a logically consistent approach, permitting us to draw conclusions, verifiable by observations, from basic......" by Charles Sanders Peirce....

  14. QCD Interconnection Studies at Linear Colliders

    CERN Document Server

    Khoze, V A; Khoze, Valery A.; Sjöstrand, Torbjörn

    1999-01-01

    Heavy objects like the W, Z and t are short-lived compared with typical hadronization times. When pairs of such particles are produced, the subsequent hadronic decay systems may therefore become interconnected. We study such potential effects at Linear Collider energies.

  15. Impulse free interconnection of dynamical systems

    NARCIS (Netherlands)

    Vinjamoor, Harsh; Belur, Madhu N.

    2010-01-01

    In this paper we address the problem that impulses might occur when a to-be-controlled plant is connected to a suitable controller. In the behavioral literature this issue is dealt when studying the so-called 'regular feedback interconnection' (RFI) of the plant and the controller behaviors. We addr

  16. An new representation for interconnection network structures

    Institute of Scientific and Technical Information of China (English)

    刘丽华; 陈建二; 陈松乔; 贾维嘉

    2002-01-01

    An important theoretic interest is to study the relations between different interconnection networks, and to compare the capability and performance of the network structures. The most popular way to do the investigation is network emulation. Based on the classical voltage graph theory, the authors develop a new representation scheme for interconnection network structures. The new approach is a combination of algebraic methods and combinatorial methods. The results demonstrate that the voltage graph theory is a powerful tool for representing well-known interconnection networks and in implementing optimal network emulation algorithms, and in particular, show that all popular interconnection networks have very simple and intuitive representations under the new scheme. The new representation scheme also offers powerful tools for the study of network routings and emulations. For example, we present very simple constructions for optimal network emulations from the cube-connected cycles networks to the butterfly networks, and from the butterfly networks to the hypercube networks. Compared with the most popular way of network emulation, this new scheme is intuitive and easy to realize, and easy to apply to other network structures.

  17. Vector Lyapunov Functions for Stochastic Interconnected Systems

    Science.gov (United States)

    Boussalis, D.

    1985-01-01

    Theoretical paper presents set of sufficient conditions for asymptotic and exponential stability with probability 1 for class of stochastic interconnected systems. Theory applicable to complicated, large-scale mechanical or electrical systems, and, for several design problems, it reduces computational difficulty by relating stability criteria to fundamental structural features of system.

  18. Some LCP Decompositions of Multistage Interconnection Networks

    Institute of Scientific and Technical Information of China (English)

    2006-01-01

    Some useful layered cross product decompositons are derived both for general bit permutation networks and for(2n-1)-stage multistage interconnection networks. Several issues in related works are clarified and the rearrangeability of some interesting networks are considered. In particular, the rearrangeability of one class of networks is formulated as a new type of combinatorial design problmes.

  19. Impulse free interconnection of dynamical systems

    NARCIS (Netherlands)

    Vinjamoor, Harsh; Belur, Madhu N.

    2010-01-01

    In this paper we address the problem that impulses might occur when a to-be-controlled plant is connected to a suitable controller. In the behavioral literature this issue is dealt when studying the so-called 'regular feedback interconnection' (RFI) of the plant and the controller behaviors. We addr

  20. Colligation, Or the Logical Inference of Interconnection

    DEFF Research Database (Denmark)

    Falster, Peter

    1998-01-01

    The concept of interconnection is fundamental to the modelling of discrete, physical systems. On the basis of centuries of scientific experience, everyone will agree that the concept is part of a logically consistent approach, permitting us to draw conclusions, verifiable by observation, from bas...

  1. 47 CFR 95.1313 - Interconnection prohibited.

    Science.gov (United States)

    2010-10-01

    ... facilities of the public switched telephone network to permit the transmission of messages or signals between points in the wireline or radio network of a public telephone company and persons served by multi-use... prohibited. MURS stations are prohibited from interconnection with the public switched...

  2. Laser printed interconnects for flexible electronics

    Science.gov (United States)

    Pique, Alberto; Beniam, Iyoel; Mathews, Scott; Charipar, Nicholas

    Laser-induced forward transfer (LIFT) can be used to generate microscale 3D structures for interconnect applications non-lithographically. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or dispersed metallic nanoparticles. However, the resulting 3D structures do not achieve the bulk conductivity of metal interconnects of the same cross-section and length as those formed by wire bonding or tab welding. It is possible, however, to laser transfer entire structures using a LIFT technique known as lase-and-place. Lase-and-place allows whole components and parts to be transferred from a donor substrate onto a desired location with one single laser pulse. This talk will present the use of LIFT to laser print freestanding solid metal interconnects to connect individual devices into functional circuits. Furthermore, the same laser can bend or fold the thin metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief due to flexing or thermal mismatch. Examples of these laser printed 3D metallic bridges and their role in the development of next generation flexible electronics by additive manufacturing will be presented. This work was funded by the Office of Naval Research (ONR) through the Naval Research Laboratory Basic Research Program.

  3. Probabilistic immortality of Cu damascene interconnects

    Science.gov (United States)

    Hau-Riege, Stefan P.

    2002-02-01

    We have studied electromigration short-line effects in Cu damascene interconnects through experiments on lines of various lengths L, stressed at a variety of current densities j, and embedded in different dielectric materials. We observed two modes of resistance evolution: Either the resistance of the lines remains constant for the duration of the test, so that the lines are considered immortal, or the lines fail due to abrupt open-circuit failure. The resistance was not observed to gradually increase and then saturate, as commonly observed in Al-based interconnects, because the barrier is too thin and resistive to serve as a redundant current path should voiding occur. The critical stress for void nucleation was found to be smaller than 41 MPa, since voiding occurred even under the mildest test conditions of j=2 MA/cm2 and L=10.5 μm at 300 °C. A small fraction of short Cu lines failed even at low current densities, which deems necessary a concept of probabilistic immortality rather than deterministic immortality. Experiments and modeling suggest that the probability of immortality is described by (jL2/B), where B is the effective elastic modulus of the metallization scheme. By contrast, the immortality of Al-based interconnects with shunt layers is described by (jL) if no voids nucleate, and (jL/B) if voids do nucleate. Even though the phenomenology of short-line effects differs for Al- and Cu-based interconnects, the immortality of interconnects of either materials system can be explained by the phenomena of nucleation barriers for void formation and void-growth saturation. The differences are due solely to the absence of a shunt layer and the low critical stress for void nucleation in the case of Cu.

  4. National Offshore Wind Energy Grid Interconnection Study Executive Summary

    Energy Technology Data Exchange (ETDEWEB)

    Daniel, John P. [ABB, Inc., Cary, NC (United States); Liu, Shu [ABB, Inc., Cary, NC (United States); Ibanez, Eduardo [National Renewable Energy Lab. (NREL), Golden, CO (United States); Pennock, Ken [AWS Truepower, Albany, NY (United States); Reed, Gregory [Univ. of Pittsburgh, PA (United States); Hanes, Spencer [Duke Energy, Charlotte, NC (United States)

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States.

  5. National Offshore Wind Energy Grid Interconnection Study Full Report

    Energy Technology Data Exchange (ETDEWEB)

    Daniel, John P. [ABB, Inc., Cary, NC (United States); Liu, Shu [ABB, Inc., Cary, NC (United States); Ibanez, Eduardo [National Renewable Energy Lab. (NREL), Golden, CO (United States); Pennock, Ken [AWS Truepower, Albany, NY (United States); Reed, Gregory [Univ. of Pittsburgh, PA (United States); Hanes, Spencer [Duke Energy, Charlotte, NC (United States)

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States.

  6. BALANCED TRUNCATED MODELS OF RC INTERCONNECT CIRCUITS AND THEIR SIMULATION

    Institute of Scientific and Technical Information of China (English)

    Yuan Baoguo; Wang Ben; Wang Shengguo

    2005-01-01

    The Balanced Truncation Method (BTM) is applied to an even distributed RC interconnect case by using Wang's closed-forms of even distributed RC interconnect models. The results show that extremely high order RC interconnect can be high-accurately approximated by only third order balanced model. Related simulations are executed in both time domain and frequency domain. The results may be applied to VLSI interconnect model reduction and design.

  7. Characterization of a Cobalt-Tungsten Interconnect

    DEFF Research Database (Denmark)

    Harthøj, Anders; Holt, Tobias; Caspersen, Michael

    2012-01-01

    A ferritic steel interconnect for a solid oxide fuel cell must be coated in order to prevent chromium evaporation from the steel substrate. The Technical University of Denmark and Topsoe Fuel Cell have developed an interconnect coating based on a cobalt-tungsten alloy. The purpose of the coating...... is to act both as a diffusion barrier for chromium and provide better protection against high temperature oxidation than a pure cobalt coating. This work presents a characterization of a cobalt-tungsten alloy coating electrodeposited on the ferritic steel Crofer 22 H which subsequently was oxidized in air...... of oxidation time. The coating had completely oxidized during the 300 h oxidation time. GDOES measurements showed that the tungsten was located in an inner zone in the coating/substrate interface. The outer layer of the coating did not contain any tungsten after oxidation but consisted mainly of cobalt...

  8. Development of Interconnect Technologies for Particle Detectors

    Energy Technology Data Exchange (ETDEWEB)

    Tripathi, Mani [Univ. of California, Davis, CA (United States)

    2015-01-29

    This final report covers the three years of this grant, for the funding period 9/1/2010 - 8/31/2013. The project consisted of generic detector R&D work at UC Davis, with an emphasis on developing interconnect technologies for applications in HEP. Much of the work is done at our Facility for Interconnect Technologies (FIT) at UC Davis. FIT was established using ARRA funds, with further studies supported by this grant. Besides generic R&D work at UC Davis, FIT is engaged in providing bump bonding help to several DOE supported detector R&D efforts. Some of the developmental work was also supported by funding from other sources: continuing CMS project funds and the Linear Collider R&D funds. The latter program is now terminated. The three year program saw a good deal of progress on several fronts, which are reported here.

  9. A Thermal Model for Carbon Nanotube Interconnects

    Directory of Open Access Journals (Sweden)

    Clay Mayberry

    2013-04-01

    Full Text Available In this work, we have studied Joule heating in carbon nanotube based very large scale integration (VLSI interconnects and incorporated Joule heating influenced scattering in our previously developed current transport model. The theoretical model explains breakdown in carbon nanotube resistance which limits the current density. We have also studied scattering parameters of carbon nanotube (CNT interconnects and compared with the earlier work. For 1 µm length single-wall carbon nanotube, 3 dB frequency in S12 parameter reduces to ~120 GHz from 1 THz considering Joule heating. It has been found that bias voltage has little effect on scattering parameters, while length has very strong effect on scattering parameters.

  10. Interconnection of bundled solid oxide fuel cells

    Science.gov (United States)

    Brown, Michael; Bessette, II, Norman F; Litka, Anthony F; Schmidt, Douglas S

    2014-01-14

    A system and method for electrically interconnecting a plurality of fuel cells to provide dense packing of the fuel cells. Each one of the plurality of fuel cells has a plurality of discrete electrical connection points along an outer surface. Electrical connections are made directly between the discrete electrical connection points of adjacent fuel cells so that the fuel cells can be packed more densely. Fuel cells have at least one outer electrode and at least one discrete interconnection to an inner electrode, wherein the outer electrode is one of a cathode and and anode and wherein the inner electrode is the other of the cathode and the anode. In tubular solid oxide fuel cells the discrete electrical connection points are spaced along the length of the fuel cell.

  11. Architecture for on-die interconnect

    Science.gov (United States)

    Khare, Surhud; More, Ankit; Somasekhar, Dinesh; Dunning, David S.

    2016-03-15

    In an embodiment, an apparatus includes: a plurality of islands configured on a semiconductor die, each of the plurality of islands having a plurality of cores; and a plurality of network switches configured on the semiconductor die and each associated with one of the plurality of islands, where each network switch includes a plurality of output ports, a first set of the output ports are each to couple to the associated network switch of an island via a point-to-point interconnect and a second set of the output ports are each to couple to the associated network switches of a plurality of islands via a point-to-multipoint interconnect. Other embodiments are described and claimed.

  12. 14 CFR 23.957 - Flow between interconnected tanks.

    Science.gov (United States)

    2010-01-01

    ... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Flow between interconnected tanks. 23.957... Fuel System § 23.957 Flow between interconnected tanks. (a) It must be impossible, in a gravity feed system with interconnected tank outlets, for enough fuel to flow between the tanks to cause an...

  13. 14 CFR 25.701 - Flap and slat interconnection.

    Science.gov (United States)

    2010-01-01

    ... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Flap and slat interconnection. 25.701....701 Flap and slat interconnection. (a) Unless the airplane has safe flight characteristics with the... sides of the plane of symmetry must be synchronized by a mechanical interconnection or...

  14. 47 CFR 69.121 - Connection charges for expanded interconnection.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 3 2010-10-01 2010-10-01 false Connection charges for expanded interconnection... interconnection. (a) Appropriate connection charge subelements shall be established for the use of equipment and facilities that are associated with offerings of expanded interconnection for special access and...

  15. Algorithms for interconnection and decomposition problems with multidimensional systems

    NARCIS (Netherlands)

    Napp Avelli, Diego; Trentelman, Harry L.

    2007-01-01

    The notion of interconnection is the basis of control in the behavioral approach. In this setting, feedback interconnection of systems is based on the still more fundamental concept of regular interconnection, which has been introduced previously. In this paper, the following problem is addressed: g

  16. Viewing Integrated-Circuit Interconnections By SEM

    Science.gov (United States)

    Lawton, Russel A.; Gauldin, Robert E.; Ruiz, Ronald P.

    1990-01-01

    Back-scattering of energetic electrons reveals hidden metal layers. Experiment shows that with suitable operating adjustments, scanning electron microscopy (SEM) used to look for defects in aluminum interconnections in integrated circuits. Enables monitoring, in situ, of changes in defects caused by changes in temperature. Gives truer picture of defects, as etching can change stress field of metal-and-passivation pattern, causing changes in defects.

  17. Market Based Analysis of Power System Interconnections

    Science.gov (United States)

    Obushevs, Artjoms; Turcik, Mario; Oleinikova, Irina; Junghans, Gatis

    2011-01-01

    Analysis in this Article is focused on usage of transmission grid under liberalized market with implicit transmission capacity allocation method, e.g. Nordic market. Attention is paid on fundamental changes in transmission utilization and its economical effective operation. For interconnection and power flow analysis and losses calculation model of Nordic grid was developed and transmission losses calculation method was created. Given approach will improve economical efficiency of system operation in electricity market conditions.

  18. Stackable Electronic Computer Modules And Interconnections

    Science.gov (United States)

    Bolotin, Gary S.

    1996-01-01

    Design concept for multiprocessor computer system calls for digital electronic processing circuits of various functionalities contained within identically shaped and sized regular polygonal modules interconnected and stacked by use of rings around edges. Rings contain wide-band bus circuits configured to provide connections to adjacent modules in same layer of stack and/or to modules in different layers. Provides flexibility of configuration to implement any of large variety of designs.

  19. High Performance Interconnect Network for Tianhe System

    Institute of Scientific and Technical Information of China (English)

    廖湘科; 庞征斌; 王克非; 卢宇彤; 谢旻; 夏军; 董德尊; 所光

    2015-01-01

    In this paper, we present the Tianhe-2 interconnect network and message passing services. We describe the architecture of the router and network interface chips, and highlight a set of hardware and software features effectively supporting high performance communications, ranging over remote direct memory access, collective optimization, hardware-enable reliable end-to-end communication, user-level message passing services, etc. Measured hardware performance results are also presented.

  20. Hybrid silicon evanescent approach to optical interconnects

    OpenAIRE

    Liang, Di; Fang, Alexander W.; Chen, Hui-Wen; Sysak, Matthew N; Koch, Brian R.; Lively, Erica; Raday, Omri; Kuo, Ying-hao; Jones, Richard; Bowers, John E

    2009-01-01

    We discuss the recently developed hybrid silicon evanescent platform (HSEP), and its application as a promising candidate for optical interconnects in silicon. A number of key discrete components and a wafer-scale integration process are reviewed. The motivation behind this work is to realize silicon-based photonic integrated circuits possessing unique advantages of III–V materials and silicon-on-insulator waveguides simultaneously through a complementary metal-oxide semiconductor fabrication...

  1. Reconfigurable Optical Interconnections Using Dynamic Optoelectronic Holograms

    Science.gov (United States)

    Schulze, Elmar

    1988-04-01

    Increasing complexity and processing speed of electronic circuits and a high device density have led to serious problems in electrical interconnections. Their limitations arise from their signal transmission capacity. power consumption. crosstalk. and reliability. Optical links may solve such problems by offering high data rates of several gigabits per second. large fanouts of up to 100 loads. good reliability and less power expenditure. Optical fibers, integrated optical waveguides or free-space transmission links may be applicable. For the free-space links, lenses. mirrors and holograms can be used to guide the light waves. In this paper, reconfigurable optical interconnection schemes are proposed and described which are based on optoelectronic holograms. Their interference patterns can be changed dynamically. To establish connections as free-space links, the light beams emitted from even hundreds of light sources are imaged onto an array of small dynamic holograms. Their interference patterns are optically and electronically controllable. These holograms diffract and focus each of the incident light beams individually onto the receiving photo-diodes. By changing the hologram interference patterns dynamically. an optical switch is obtained. It renders the establishment of reconfigurable optical interconnections. As optoelectronic holograms very-high-resolution spatial light modulators are proposed.

  2. The first LHC sector is fully interconnected

    CERN Multimedia

    2006-01-01

    Sector 7-8 is the first sector of the LHC to become fully operational. All the magnets, cryogenic line, vacuum chambers and services are interconnected. The cool down of this sector can soon commence. LHC project leader Lyn Evans, the teams from CERN's AT/MCS, AT/VAC and AT/MEL groups, and the members of the IEG consortium celebrate the completion of the first LHC sector. The 10th of November was a red letter day for the LHC accelerator teams, marking the completion of the first sector of the machine. The magnets of sector 7-8, together with the cryogenic line, the vacuum chambers and the distribution feedboxes (DFBs) are now all completely interconnected. Sector 7-8 has thus been closed and is the first LHC sector to become operational. The interconnection work required several thousand electrical, cryogenic and insulating connections to be made on the 210 interfaces between the magnets in the arc, the 30 interfaces between the special magnets and the interfaces with the cryogenic line. 'This represent...

  3. Eye muscle repair - discharge

    Science.gov (United States)

    ... Lazy eye repair - discharge; Strabismus repair - discharge; Extraocular muscle surgery - discharge ... You or your child had eye muscle repair surgery to correct eye muscle ... term for crossed eyes is strabismus. Children most often ...

  4. Ventral hernia repair

    Science.gov (United States)

    ... page: //medlineplus.gov/ency/article/007661.htm Ventral hernia repair To use the sharing features on this page, please enable JavaScript. Ventral hernia repair is surgery to repair a ventral hernia. ...

  5. Brain aneurysm repair

    Science.gov (United States)

    ... aneurysm repair; Dissecting aneurysm repair; Endovascular aneurysm repair - brain; Subarachnoid hemorrhage - aneurysm ... Your scalp, skull, and the coverings of the brain are opened. A metal clip is placed at ...

  6. Potential roles of optical interconnections within broadband switching modules

    Science.gov (United States)

    Lalk, Gail R.; Habiby, Sarry F.; Hartman, Davis H.; Krchnavek, Robert R.; Wilson, Donald K.; Young, Kenneth C., Jr.

    1991-04-01

    An investigation of potential physical design bottlenecks in future broadband telecommunication switches has led to the identification of several areas where optical interconnections may play a role in the practical realization of required system performance. In the model used the speed and interconnection densities as well as requirements for ease-of-access and efficient power utilization challenge conventional partitioning and packaging strategies. Potential areas where optical interconnections may relieve some of the physical design bottlenecks include fiber management at the customer interface to the switch routing and distribution of high-density interconnections within the fabric of the switch and backplane interconnections to increase system throughput.

  7. Compact Models and Measurement Techniques for High-Speed Interconnects

    CERN Document Server

    Sharma, Rohit

    2012-01-01

    Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.

  8. Parallel Interconnection of Broadcast Systems with Multiple FIFO Channels

    Science.gov (United States)

    de Juan Marín, Ruben; Cholvi, Vicent; Jiménez, Ernesto; Muñoz-Escoí, Francesc D.

    This paper proposes new protocols for the interconnection of FIFO- and causal-ordered broadcast systems, thus increasing their scalability. They use several interconnection links between systems, which avoids bottleneck problems due to the network traffic, since messages are not forced to go throughout a single link but instead through the several links we establish. General architectures to interconnect FIFO- and causal-ordered systems are proposed. Failure management is also discussed and a performance analysis is given, detailing the benefits introduced by these interconnection approaches that are able to easily increase the resulting interconnection bandwidth.

  9. Economic and environmental benefits of interconnected systems. The Spanish example

    Energy Technology Data Exchange (ETDEWEB)

    Chicharro, A.S.; Dios Alija, R. de [Red Electrica de Espana, Madrid (Spain)

    1996-12-31

    The interconnected systems provide large technical and economic benefits which, evaluated and contrasted with the associated network investment cost, usually produce important net savings. There are continental electrical systems formed by many interconnected subsystems. The optimal size of an interconnection should be defined within an economic background. It is necessary to take into account the global environmental effects. The approach and results of studies carried out by Red Electrica is presented, in order to analyse both economic and environmental benefits resulting from an increase in the present Spanish interconnection capacities. From both economic and environmental points of view, the development of the interconnected systems is highly positive. (author). 4 refs.

  10. Crosstalk in modern on-chip interconnects a FDTD approach

    CERN Document Server

    Kaushik, B K; Patnaik, Amalendu

    2016-01-01

    The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the ...

  11. Carbon nanotubes for interconnects process, design and applications

    CERN Document Server

    Dijon, Jean; Maffucci, Antonio

    2017-01-01

    This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes c...

  12. Supramolecular Organic Nanowires as Plasmonic Interconnects.

    Science.gov (United States)

    Armao, Joseph J; Domoto, Yuya; Umehara, Teruhiko; Maaloum, Mounir; Contal, Christophe; Fuks, Gad; Moulin, Emilie; Decher, Gero; Javahiraly, Nicolas; Giuseppone, Nicolas

    2016-02-23

    Metallic nanostructures are able to interact with an incident electromagnetic field at subwavelength scales by plasmon resonance which involves the collective oscillation of conduction electrons localized at their surfaces. Among several possible applications of this phenomenon, the theoretical prediction is that optical circuits connecting multiple plasmonic elements will surpass classical electronic circuits at nanoscale because of their much faster light-based information processing. However, the placement and coupling of metallic elements smaller than optical wavelengths currently remain a formidable challenge by top-down manipulations. Here, we show that organic supramolecular triarylamine nanowires of ≈1 nm in diameter are able to act as plasmonic waveguides. Their self-assembly into plasmonic interconnects between arrays of gold nanoparticles leads to the bottom-up construction of basic optical nanocircuits. When the resonance modes of these metallic nanoparticles are coupled through the organic nanowires, the optical conductivity of the plasmonic layer dramatically increases from 259 to 4271 Ω(-1)·cm(-1). We explain this effect by the coupling of a hot electron/hole pair in the nanoparticle antenna with the half-filled polaronic band of the organic nanowire. We also demonstrate that the whole hybrid system can be described by using the abstraction of the lumped circuit theory, with a far field optical response which depends on the number of interconnects. Overall, our supramolecular bottom-up approach opens the possibility to implement processable, soft, and low cost organic plasmonic interconnects into a large number of applications going from sensing to metamaterials and information technologies.

  13. Updating Interconnection Screens for PV System Integration

    Energy Technology Data Exchange (ETDEWEB)

    Coddington, M.; Mather, B.; Kroposki, B.; Lynn, K.; Razon, A.; Ellis, A.; Hill, R.; Key, T.; Nicole, K.; Smith, J.

    2012-02-01

    This white paper evaluates the origins and usefulness of the capacity penetration screen, offer short-term solutions which could effectively allow fast-track interconnection to many PV system applications, and considers longer-term solutions for increasing PV deployment levels in a safe and reliable manner while reducing or eliminating the emphasis on the penetration screen. Short-term and longer-term alternatives approaches are offered as examples; however, specific modifications to screening procedures should be discussed with stakeholders and must ultimately be adopted by state and federal regulatory bodies.

  14. Environmental Regulation Impacts on Eastern Interconnection Performance

    Energy Technology Data Exchange (ETDEWEB)

    Markham, Penn N [ORNL; Liu, Yilu [ORNL; Young II, Marcus Aaron [ORNL

    2013-07-01

    In the United States, recent environmental regulations will likely result in the removal of nearly 30 GW of oil and coal-fired generation from the power grid, mostly in the Eastern Interconnection (EI). The effects of this transition on voltage stability and transmission line flows have previously not been studied from a system-wide perspective. This report discusses the results of power flow studies designed to simulate the evolution of the EI over the next few years as traditional generation sources are replaced with environmentally friendlier ones such as natural gas and wind.

  15. Cryogenic microstripline-on-Kapton microwave interconnects

    CERN Document Server

    Harris, A I; Lau, J M; Church, S E; Samoska, L A; Cleary, K

    2012-01-01

    Simple broadband microwave interconnects are needed for increasing the size of focal plane heterodyne radiometer arrays. We have measured loss and cross-talk for arrays of microstrip transmission lines in flex circuit technology at 297 and 77 K, finding good performance to at least 20 GHz. The dielectric constant of Kapton substrates changes very little from 297 to 77 K, and the electrical loss drops. The small cross-sectional area of metal in a printed circuit structure yields overall thermal conductivities similar to stainless steel coaxial cable. Operationally, the main performance tradeoffs are between crosstalk and thermal conductivity. We tested a patterned ground plane to reduce heat flux.

  16. Manipulating Multistage Interconnection Networks Using Fundamental Arrangements

    Directory of Open Access Journals (Sweden)

    E. Gur

    2010-12-01

    Full Text Available Optimizing interconnection networks is a prime object in switching schemes. In this work the authors present a novel approach for obtaining a required channel arrangement in a multi-stage interconnectionnetwork, using a new concept – a fundamental arrangement. The fundamental arrangement is an initial N-1 stage switch arrangement that allows obtaining any required output channel arrangement given an input arrangement, using N/2 binary switches at each stage. The paper demonstrates how a fundamental arrangement can be achieved and how, once this is done, any required arrangement may be obtained within 2(N-1 steps.

  17. NITINOL Interconnect Device for Optical Fiber Waveguides

    Science.gov (United States)

    1981-07-01

    LE EL,~NAVSEA REPORT NO. S27L~kV-NL 4P fNSWNC TR 81-129 1 JULY 1981 0 NITINOL INTERC&INECT DEVICE FOR OPTICAL FIBER WAVEGUIDES FINAL REPORT A...ACCESSION NO. 3. RECIPIENT’S CATALOG NUMBER NSWC TR 81-129I 1-19 -A )ci , ’ 4 TI TL E (and Sbtitle) S. TYPE OF REPORT & PERIOD COVERED NITINOL ... NITINOL Optical Fibers 20. ABSTRACT (Continue on reverse side if neceeewy and identify by block number) Two different interconnect devices for optical

  18. Traversing and labeling interconnected vascular tree structures from 3D medical images

    Science.gov (United States)

    O'Dell, Walter G.; Govindarajan, Sindhuja Tirumalai; Salgia, Ankit; Hegde, Satyanarayan; Prabhakaran, Sreekala; Finol, Ender A.; White, R. James

    2014-03-01

    Purpose: Detailed characterization of pulmonary vascular anatomy has important applications for the diagnosis and management of a variety of vascular diseases. Prior efforts have emphasized using vessel segmentation to gather information on the number or branches, number of bifurcations, and branch length and volume, but accurate traversal of the vessel tree to identify and repair erroneous interconnections between adjacent branches and neighboring tree structures has not been carefully considered. In this study, we endeavor to develop and implement a successful approach to distinguishing and characterizing individual vascular trees from among a complex intermingling of trees. Methods: We developed strategies and parameters in which the algorithm identifies and repairs false branch inter-tree and intra-tree connections to traverse complicated vessel trees. A series of two-dimensional (2D) virtual datasets with a variety of interconnections were constructed for development, testing, and validation. To demonstrate the approach, a series of real 3D computed tomography (CT) lung datasets were obtained, including that of an anthropomorphic chest phantom; an adult human chest CT; a pediatric patient chest CT; and a micro-CT of an excised rat lung preparation. Results: Our method was correct in all 2D virtual test datasets. For each real 3D CT dataset, the resulting simulated vessel tree structures faithfully depicted the vessel tree structures that were originally extracted from the corresponding lung CT scans. Conclusion: We have developed a comprehensive strategy for traversing and labeling interconnected vascular trees and successfully implemented its application to pulmonary vessels observed using 3D CT images of the chest.

  19. An interconnecting bus power optimization method combining interconnect wire spacing with wire ordering

    Institute of Scientific and Technical Information of China (English)

    Zhu Zhang-Ming; Hao Bao-Tian; En Yun-Fei; Yang Yin-Tang; Li Yue-Jin

    2011-01-01

    On-chip interconnect buses consume tens of percents of dynamic power in a nanometer scale integrated circuit and they will consume more power with the rapid scaling down of technology size and continuously rising clock frequency,therefore it is meaningful to lower the interconnecting bus power in design. In this paper, a simple yet accurate interconnect parasitic capacitance model is presented first and then, based on this model, a novel interconnecting bus optimization method is proposed. Wire spacing is a process for spacing wires for minimum dynamic power, while wire ordering is a process that searches for wire orders that maximally enhance it. The method, i.e., combining wire spacing with wire ordering, focuses on bus dynamic power optimization with a consideration of bus performance requirements.The optimization method is verified based on various nanometer technology parameters, showing that with 50% slack of routing space, 25.71% and 32.65% of power can be saved on average by the proposed optimization method for a globalbus and an intermediate bus, respectively, under a 65-nm technology node, compared with 21.78% and 27.68% of power saved on average by uniform spacing technology. The proposed method is especially suitable for computer-aided designof nanometer scale on-chip buses.

  20. National Offshore Wind Energy Grid Interconnection Study

    Energy Technology Data Exchange (ETDEWEB)

    Daniel, John P. [ABB Inc; Liu, Shu [ABB Inc; Ibanez, Eduardo [National Renewable Energy Laboratory; Pennock, Ken [AWS Truepower; Reed, Greg [University of Pittsburgh; Hanes, Spencer [Duke Energy

    2014-07-30

    The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States. A total of 54GW of offshore wind was assumed to be the target for the analyses conducted. A variety of issues are considered including: the anticipated staging of offshore wind; the offshore wind resource availability; offshore wind energy power production profiles; offshore wind variability; present and potential technologies for collection and delivery of offshore wind energy to the onshore grid; potential impacts to existing utility systems most likely to receive large amounts of offshore wind; and regulatory influences on offshore wind development. The technologies considered the reliability of various high-voltage ac (HVAC) and high-voltage dc (HVDC) technology options and configurations. The utility system impacts of GW-scale integration of offshore wind are considered from an operational steady-state perspective and from a regional and national production cost perspective.

  1. Message Passing Framework for Globally Interconnected Clusters

    Science.gov (United States)

    Hafeez, M.; Asghar, S.; Malik, U. A.; Rehman, A.; Riaz, N.

    2011-12-01

    In prevailing technology trends it is apparent that the network requirements and technologies will advance in future. Therefore the need of High Performance Computing (HPC) based implementation for interconnecting clusters is comprehensible for scalability of clusters. Grid computing provides global infrastructure of interconnecting clusters consisting of dispersed computing resources over Internet. On the other hand the leading model for HPC programming is Message Passing Interface (MPI). As compared to Grid computing, MPI is better suited for solving most of the complex computational problems. MPI itself is restricted to a single cluster. It does not support message passing over the internet to use the computing resources of different clusters in an optimal way. We propose a model that provides message passing capabilities between parallel applications over the internet. The proposed model is based on Architecture for Java Universal Message Passing (A-JUMP) framework and Enterprise Service Bus (ESB) named as High Performance Computing Bus. The HPC Bus is built using ActiveMQ. HPC Bus is responsible for communication and message passing in an asynchronous manner. Asynchronous mode of communication offers an assurance for message delivery as well as a fault tolerance mechanism for message passing. The idea presented in this paper effectively utilizes wide-area intercluster networks. It also provides scheduling, dynamic resource discovery and allocation, and sub-clustering of resources for different jobs. Performance analysis and comparison study of the proposed framework with P2P-MPI are also presented in this paper.

  2. DNA repair. [UV radiation

    Energy Technology Data Exchange (ETDEWEB)

    Setlow, R.

    1978-01-01

    Some topics discussed are as follows: difficulty in extrapolating data from E. coli to mammalian systems; mutations caused by UV-induced changes in DNA; mutants deficient in excision repair; other postreplication mechanisms; kinds of excision repair systems; detection of repair by biochemical or biophysical means; human mutants deficient in repair; mutagenic effects of UV on XP cells; and detection of UV-repair defects among XP individuals. (HLW)

  3. SIP Trunking — General Requirements for Interconnecting Enterprise Networks

    Directory of Open Access Journals (Sweden)

    Stephan Massner

    2013-10-01

    Full Text Available Based on defined User-to-Network Interconnection (UNI as well as Network-to-Network Interconnection (NNI types various interconnection modes are practicable. These modes allow a further description of interconnection models as well as architecture models including interconnection functions and related interfaces. Topics covered in this article comprise functional entities and related interfaces interconnecting Internet Protocol (IP network domains as well as interfaces between these border functions. Mainly focussed functionalities are Session Border Controllers (SBC from various vendors handling Voice over IP (VoIP session control traffic, SIP traffic specifically. Furthermore, partial and not standardised topics belonging to sub-functions and reference points are disclosed. Prerequisites in view of the continuous work are treated of beyond analyses and classifications of standardisation even if not all open-end questions can be answered completely in subsequent studies 

  4. IP Telephony Interconnection Reference Challenges, Models, and Engineering

    CERN Document Server

    Boucadair, Mohamed; Neves, Pedro Miguel; Einarsson, Olafur Pall

    2011-01-01

    Addressing the growth of IP telephony service offerings within the corporate and residential realm, IP Telephony Interconnection Reference: Challenges, Models, and Engineering examines the technical and regulatory issues related to IP telephony interconnection at the large scale. It describes business and interconnection models, reviews emerging architectures such as IMS and TISPAN, identifies commonly-encountered issues, and supplies solutions to technical issues. The authors offer a detailed overview of SPEERMINT activity and proposed architecture, the current work undertaken in i3 Forum, an

  5. Probability density function modeling for sub-powered interconnects

    Science.gov (United States)

    Pater, Flavius; Amaricǎi, Alexandru

    2016-06-01

    This paper proposes three mathematical models for reliability probability density function modeling the interconnect supplied at sub-threshold voltages: spline curve approximations, Gaussian models,and sine interpolation. The proposed analysis aims at determining the most appropriate fitting for the switching delay - probability of correct switching for sub-powered interconnects. We compare the three mathematical models with the Monte-Carlo simulations of interconnects for 45 nm CMOS technology supplied at 0.25V.

  6. Research on optical multistage butterfly interconnection and optoelectronic logic operations

    Science.gov (United States)

    Sun, De-Gui; Wang, Na-Xin; He, Li-Ming; Xu, Mai; Liang, Guo-Dong; Zheng, Jie

    We briefly study butterfly interconnection construction and propose an experimental approach to implementing multistage butterfly interconnection networks by using a special interconnection grating with the reflection ladder structure and liquid crystal light valves (LCLVs), and implementing the optical butterfly interconnections and primary optical digital logic operations. With this foundation, we analyse and discuss the features of the approach by computer simulations. In terms of our theoretical analyses, we improve the ring-circuit approach, based on the reflection ladder structure gratings, into a more suitable form based on transmission gratings, and we substitute the LCLVs with optoelectronic switches. Finally we give the experimental results of both the transmission grating and optoelectronic switches.

  7. 78 FR 73239 - Small Generator Interconnection Agreements and Procedures

    Science.gov (United States)

    2013-12-05

    ... technologies. (Institute of Electrical and Electronics Engineers (IEEE) Standard 1547 for Interconnecting... Electricity Consumers Resource Council, American Chemistry Council, American Forest & Paper...

  8. Cost based interconnection charges as a way to induce competition

    DEFF Research Database (Denmark)

    Falch, Morten

    The objective of this paper is to analyse the relationship between regulation of interconnection charges and the level of competition. One of the most important issues in the debate on interconnect regulation has been use of forward looking costs for setting of interconnection charges. This debate...... has been ongoing within the EU as well as in US. This paper discusses the European experiences and in particular the Danish experiences with use of cost based interconnection charges, and their impact on competition in the telecom market....

  9. Electrical Properties of Graphene for Interconnect Applications

    Directory of Open Access Journals (Sweden)

    Antonio Maffucci

    2014-05-01

    Full Text Available A semi-classical electrodynamical model is derived to describe the electrical transport along graphene, based on the modified Boltzmann transport equation. The model is derived in the typical operating conditions predicted for future integrated circuits nano-interconnects, i.e., a low bias condition and an operating frequency up to 1 THz. A generalized non-local dispersive Ohm’s law is derived, which can be regarded as the constitutive equation for the material. The behavior of the electrical conductivity is studied with reference to a 2D case (the infinite graphene layer and a 1D case (the graphene nanoribbons. The modulation effects of the nanoribbons’ size and chirality are highlighted, as well as the spatial dispersion introduced in the 2D case by the dyadic nature of the conductivity.

  10. Functionality Inspection of Interconnected Fire Protection Systems

    DEFF Research Database (Denmark)

    Kærup, René; Jomaas, Grunde

    2014-01-01

    systems, such as a smoke detection system, sprinkler system, warning system and fire ventilation system. However, only smoke detections systems and sprinkler systems require inspection from an independent accredited company, whereas the other systems’ functionality is entirely up to the professionals...... that install them and the owner’s maintenance schedule, both of which do not require any supervision from the authorities. Herein, 12 complex buildings, in which all fire protections systems were inspected by an independent accredited company, were studied to see whether or not the buildings adhere to the fire...... safety design in their operational phase. The results showed that the functionality of the interconnected fire protection systems was not as designed in the performance-based analysis. Furthermore, due to the lack of this functionality the fire safety level is not at high as the authorities’ demand...

  11. Virtual interconnection platform initiative scoping study

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Yong [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Kou, Gefei [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Pan, Zuohong [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Liu, Yilu [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); King Jr., Thomas J. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2016-01-01

    Due to security and liability concerns, the research community has limited access to realistic large-scale power grid models to test and validate new operation and control methodologies. It is also difficult for industry to evaluate the relative value of competing new tools without a common platform for comparison. This report proposes to develop a large-scale virtual power grid model that retains basic features and represents future trends of major U.S. electric interconnections. This model will include realistic power flow and dynamics information as well as a relevant geospatial distribution of assets. This model will be made widely available to the research community for various power system stability and control studies and can be used as a common platform for comparing the efficacies of various new technologies.

  12. Multimode siloxane polymer components for optical interconnects

    Science.gov (United States)

    Bamiedakis, Nikolaos; Beals, Joseph, IV; Penty, Richard V.; White, Ian H.; DeGroot, Jon v., Jr.; Clapp, Terry V.; De Shazer, David

    2009-02-01

    This paper presents an overview of multimode waveguides and waveguide components formed from siloxane polymer materials which are suitable for use in optical interconnection applications. The components can be cost-effectively integrated onto conventional PCBs and offer increased functionality in optical transmission. The multimode waveguides exhibit low loss (0.04 dB/cm at 850 nm) and low crosstalk (benefit from the multimode nature of the waveguides allowing low loss combining (4 dB for an 8×1 device). A large range of power splitting ratios between 30% and 75% is achieved with multimode coupler devices. Examples of system applications benefiting from the use of these components are briefly presented including a terabit capacity optical backplane, a radio-over-fibre multicasting system and a SCM passive optical network.

  13. Tomographic reconstruction of an integrated circuit interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Levine, Z.H. [National Institute of Standards and Technology, Gaithersburg, Maryland 20899 (United States); Kalukin, A.R. [Physics Department, Rensselaer Polytechnic Institute, Troy, New York 12180-3590 (United States); Frigo, S.P.; McNulty, I. [Advanced Photon Source, Argonne National Laboratory, Argonne, Illinois 60439 (United States); Kuhn, M. [Digital Equipment Corporation, Hudson, Massachusetts 01749 (United States)

    1999-01-01

    An Al{endash}W-silica integrated circuit interconnect sample was thinned to several {mu}m and scanned across a 200 nm focal spot of a Fresnel zone plate operating at photon energy of 1573 eV. The experiment was performed on beamline 2-ID-B of the Advanced Photon Source, a third-generation synchrotron facility. Thirteen scanned projections of the sample were acquired over the angular range {plus_minus}69.2{degree}. At least 301{times}301 pixels were acquired at each angle with a step size of 77{times}57 nm. A three-dimensional image with an approximate uncertainty of 400 nm was reconstructed from projection data using a standard algorithm. The two layers of the integrated circuit and the presence of the focused ion beam markers on the surface of the sample are clearly shown in the reconstruction. {copyright} {ital 1999 American Institute of Physics.}

  14. New transmission interconnection reduces consumer costs

    Energy Technology Data Exchange (ETDEWEB)

    Anon.

    2008-09-15

    The Central American electric interconnection system (SIEPAC) project will involve the construction of a 1830 km 230 kV transmission system that will link Guatemala, El Salvador, Honduras, Costa Rica, Nicaragua, and Panama. The system is expected to alleviate the region's power shortages and reduce electricity costs for consumers. Costs for the SIEPAC project have been estimated at $370 million. The system will serve approximately 37 million customers, and will include 15 substations. The contract for building the electrical equipment has been awarded to Schweitzer Engineering Laboratories (SEL) who plan to manufacture components at a plant in Mexico. The equipment will include high speed line protection, automation, and control systems. Line current differential systems and satellite-synchronized clocks will also be used. The new transmission system is expected to be fully operational by 2009. 1 fig.

  15. Electric currents in networks of interconnected memristors.

    Science.gov (United States)

    Nedaaee Oskoee, Ehsan; Sahimi, Muhammad

    2011-03-01

    Chua [IEEE Trans. Circuit Theory 1, 507 (1971).] argued that, in addition to the standard resistors, capacitors, and inductors, there must be a fourth fundamental element in electrical circuits, which he called a memory resistor or memristor. Strukov et al. [Nature (London) 453, 80 (2008)] showed how memristive behavior arises in some thin semiconducting films. Unlike other passive elements, however, a memristor with large sizes cannot be fabricated, because scale up of a memristor to dimensions of the order of microns causes loss of the memristive effect by decreasing the width of the doped region relative to the overall size of the memristor. A microscale memristor is, however, essential to most of the potential applications. One way of fabricating such a microscale memristor without losing the memristive effect is to make a network of very small interconnected memristors. We report the results of numerical simulations of electrical currents in such networks of interconnected memristors, as well as memristors and Ohmic conductors. The memristor networks exhibit a rich variety of interesting properties, including weakly and strongly memristive regimes, a possible first-order transition at the connectivity threshold, generation of second harmonics in the strongly memristive regime, and the universal dependence of the network's strength on the frequency. Moreover, we show that the polarity of the memristors can play an important role in the overall properties of the memristor network, in particular its speed of switching, which may have a potentially important application to faster computers. None of these properties are exhibited by linear resistor networks, or even by nonlinear resistor networks without a memory effect.

  16. Very Large Scale Optical Interconnect Systems For Different Types of Optical Interconnection Networks

    Directory of Open Access Journals (Sweden)

    Ahmed Nabih Zaki Rashed

    2012-04-01

    Full Text Available The need for scalable systems in market demands in terms of lower computing costs and protection of customer investment in computing: scaling up the system to quickly meet business growth is obviously a better way of protecting investment: hardware, software, and human resources. A scalable system should be incrementally expanded, delivering linear incremental performance with a near linear cost increase, and with minimal system redesign (size scalability, additionally, it should be able to use successive, faster processors with minimal additional costs and redesign (generation scalability. On the architecture side, the key design element is the interconnection network. The interconnection network must be able to increase in size using few building blocks and with minimum redesign, deliver a bandwidth that grows linearly with the increase in system size, maintain a low or (constant latency, incur linear cost increase, and readily support the use of new faster processors. The major problem is the ever-increasing speed of the processors themselves and the growing performance gap between processor technology and interconnect technology. Increased central processing unit (CPU speeds and effectiveness of memory latency-tolerating techniques.

  17. Circuit and interconnect design for high bit-rate applications

    NARCIS (Netherlands)

    Veenstra, H.

    2006-01-01

    This thesis presents circuit and interconnect design techniques and design flows that address the most difficult and ill-defined aspects of the design of ICs for high bit-rate applications. Bottlenecks in interconnect design, circuit design and on-chip signal distribution for high bit-rate applicati

  18. Updating Small Generator Interconnection Procedures for New Market Conditions

    Energy Technology Data Exchange (ETDEWEB)

    Coddington, M.; Fox, K.; Stanfield, S.; Varnado, L.; Culley, T.; Sheehan, M.

    2012-12-01

    Federal and state regulators are faced with the challenge of keeping interconnection procedures updated against a backdrop of evolving technology, new codes and standards, and considerably transformed market conditions. This report is intended to educate policymakers and stakeholders on beneficial reforms that will keep interconnection processes efficient and cost-effective while maintaining a safe and reliable power system.

  19. 76 FR 35210 - Peetz Logan Interconnect, LLC; Notice of Filing

    Science.gov (United States)

    2011-06-16

    ... From the Federal Register Online via the Government Publishing Office ] DEPARTMENT OF ENERGY Federal Energy Regulatory Commission Peetz Logan Interconnect, LLC; Notice of Filing Take notice that on June 3, 2011, Peetz Logan Interconnect, LLC (PLI) filed a response to a staff deficiency letter...

  20. Perspectives on the metallic interconnects for solid oxide fuel cells

    Institute of Scientific and Technical Information of China (English)

    ZHU Wei-zhong; YAN Mi

    2004-01-01

    The various stages and progress in the development of interconnect materials for solid oxide fuel cells (SOFCs) over the last two decades are reviewed. The criteria for the application of materials as interconnects are highlighted. Interconnects based on lanthanum chromite ceramics demonstrate many inherent drawbacks and therefore are only useful for SOFCs operating around 1000 ℃. The advance in the research of anode-supported flat SOFCs facilitates the replacement of ceramic interconnects with metallic ones due to their significantly lowered working temperature. Besides, interconnects made of metals or alloys offer many advantages as compared to their ceramic counterpart. The oxidation response and thermal expansion behaviors of various prospective metallic interconnects are examined and evaluated. The minimization of contact resistance to achieve desired and reliable stack performance during their projected lifetime still remains a highly challenging issue with metallic interconnects. Inexpensive coating materials and techniques may play a key role in pro moting the commercialization of SOFC stack whose interconnects are constructed of some current commercially available alloys. Alternatively, development of new metallic materials that are capable of forming stable oxide scales with sluggish growth rate and sufficient electrical conductivity is called for.

  1. High Speed Global On-Chip Interconnects and Transceivers

    NARCIS (Netherlands)

    Mensink, E.

    2007-01-01

    The data rate of global on-chip interconnects (up to 10 mm) is limited by a large distributed resistance and capacitance. This thesis describes methods to increase the achievable data rate of global on-chip interconnects with minimal chip area and power consumption, while maintaining data integrity.

  2. Interconnection of Dirac structures via kernel/image representation

    NARCIS (Netherlands)

    Iftime, Orest V.; Sandovici, Adrian

    2011-01-01

    Dirac structures are used to mathematically formalize the power-conserving interconnection structure of physical systems. For finite-dimensional systems several representations are available and it is known that the composition (or interconnection) of two Dirac structures is again a Dirac structure.

  3. Interconnection of subsystems in closed-loop systems

    DEFF Research Database (Denmark)

    Niemann, Hans Henrik; Poulsen, Niels Kjølstad

    2009-01-01

    The focus in this paper is analysis of stability and controller design for interconnected systems. This includes both the case with known and unknown interconnected sub-system. The key element in both the stability analysis and controller design is the application of the Youla-Jabr-Bongiorno-Kuce...

  4. Laser induced forward transfer of interconnects for 3D integration

    NARCIS (Netherlands)

    Oosterhuis, G.; Prenen, A.; Huis in 't veld, A.J.

    2011-01-01

    Interconnects are an important cost driver in advanced 3D chip packaging. This holds for Through Silicon Vias (TSVs) for chip stacking, but also for other interconnect steps like re-distribution layers and solder bumps. Especially in applications with a low number (<100 mm-2) of relatively large

  5. Pectus excavatum repair

    Science.gov (United States)

    ... this page: //medlineplus.gov/ency/article/002949.htm Pectus excavatum repair To use the sharing features on this page, please enable JavaScript. Pectus excavatum repair is surgery to correct pectus excavatum . This ...

  6. Solar-cell interconnect design for terrestrial photovoltaic modules

    Science.gov (United States)

    Mon, G. R.; Moore, D. M.; Ross, R. G., Jr.

    1984-01-01

    Useful solar cell interconnect reliability design and life prediction algorithms are presented, together with experimental data indicating that the classical strain cycle (fatigue) curve for the interconnect material does not account for the statistical scatter that is required in reliability predictions. This shortcoming is presently addressed by fitting a functional form to experimental cumulative interconnect failure rate data, which thereby yields statistical fatigue curves enabling not only the prediction of cumulative interconnect failures during the design life of an array field, but also the quantitative interpretation of data from accelerated thermal cycling tests. Optimal interconnect cost reliability design algorithms are also derived which may allow the minimization of energy cost over the design life of the array field.

  7. Fuel cell electrode interconnect contact material encapsulation and method

    Science.gov (United States)

    Derose, Anthony J.; Haltiner, Jr., Karl J.; Gudyka, Russell A.; Bonadies, Joseph V.; Silvis, Thomas W.

    2016-05-31

    A fuel cell stack includes a plurality of fuel cell cassettes each including a fuel cell with an anode and a cathode. Each fuel cell cassette also includes an electrode interconnect adjacent to the anode or the cathode for providing electrical communication between an adjacent fuel cell cassette and the anode or the cathode. The interconnect includes a plurality of electrode interconnect protrusions defining a flow passage along the anode or the cathode for communicating oxidant or fuel to the anode or the cathode. An electrically conductive material is disposed between at least one of the electrode interconnect protrusions and the anode or the cathode in order to provide a stable electrical contact between the electrode interconnect and the anode or cathode. An encapsulating arrangement segregates the electrically conductive material from the flow passage thereby, preventing volatilization of the electrically conductive material in use of the fuel cell stack.

  8. Optimum intermediate fibers for reducing interconnection loss: exact solution.

    Science.gov (United States)

    Yablon, Andrew D; Sumetsky, M

    2007-03-15

    We derive an exact analytical solution for a transmission line of N single-mode intermediate optical fibers that minimize the interconnection loss between any two dissimilar fiber modes that are well described by that paraxial scalar wave equation. Our solution shows that N optimum intermediate fibers reduce the original interconnection loss by a factor of least 1/(N+1) and that the total interconnection loss is only a function of N and the original direct interconnection loss. Our solution is not restricted to axisymmetric fibers or mode fields and therefore could be useful for reducing the interconnection loss between microstructured optical fibers, between certain slab waveguides, or between fibers and optical sources or detectors.

  9. When "Other" Initiate Repair.

    Science.gov (United States)

    Schegloff, Emanuel A.

    2000-01-01

    Elaborates on the locus of other-initiated repair, and reports on a number of environments in which others initiate repair turns later than the one directly following the trouble-source turn. Describes several ways that other initiation of repair, which occurs in next-turn position, may be delayed within that position. (Author/VWL)

  10. 76 FR 39870 - PJM Interconnection, LLC; PJM Power Providers Group v. PJM Interconnection, LLC; Notice of Date...

    Science.gov (United States)

    2011-07-07

    ... Energy Regulatory Commission PJM Interconnection, LLC; PJM Power Providers Group v. PJM Interconnection... presents an opportunity to exercise buyer market power; (2) whether the Fixed Resource Requirement (FRR... FRR option that allow parties to self-supply while deterring buyer market power. Parties will have...

  11. Thermal Runaways in LHC Interconnections: Experiments

    CERN Document Server

    Willering, G P; Bottura, L; Scheuerlein, C; Verweij, A P

    2011-01-01

    The incident in the LHC in September 2008 occurred in an interconnection between two magnets of the 13 kA dipole circuit. This event was traced to a defect in one of the soldered joints between two superconducting cables stabilized by a copper busbar. Further investigation revealed defective joints of other types. A combination of (1) a poor contact between the superconducting cable and the copper stabilizer and (2) an electrical discontinuity in the stabilizer at the level of the connection can lead to an unprotected quench of the busbar. Once the heating power in the unprotected superconducting cable exceeds the heat removal capacity a thermal run-away occurs, resulting in a fast melt-down of the non-stabilized cable. We have performed a thorough investigation of the conditions upon which a thermal run-away in the defect can occur. To this aim, we have prepared heavily instrumented samples with well-defined and controlled defects. In this paper we describe the experiment, and the analysis of the data, and w...

  12. Maximizing Algebraic Connectivity in Interconnected Networks

    CERN Document Server

    Shakeri, Heman; Sahneh, Faryad Darabi; Poggi-Corradini, Pietro; Scoglio, Caterina

    2015-01-01

    Algebraic connectivity, the second eigenvalue of the Laplacian matrix, is a measure of node and link connectivity on networks. When studying interconnected networks it is useful to consider a multiplex model, where the component networks operate together with inter-layer links among them. In order to have a well-connected multilayer structure, it is necessary to optimally design these inter-layer links considering realistic constraints. In this work, we solve the problem of finding an optimal weight distribution for one-to-one inter-layer links under budget constraint. We show that for the special multiplex configurations with identical layers, the uniform weight distribution is always optimal. On the other hand, when the two layers are arbitrary, increasing the budget reveals the existence of two different regimes. Up to a certain threshold budget, the second eigenvalue of the supra-Laplacian is simple, the optimal weight distribution is uniform, and the Fiedler vector is constant on each layer. Increasing t...

  13. Percutaneous mitral valve repair.

    Science.gov (United States)

    Gillinov, A Marc; Liddicoat, John R

    2006-01-01

    Surgical mitral valve repair is the procedure of choice to treat mitral regurgitation of all etiologies. Whereas annuloplasty is the cornerstone of mitral valve repair, a variety of other surgical techniques are utilized to correct dysfunction of the leaflets and subvalvular apparatus; in most cases, surgical repair entails application of multiple repair techniques in each patient. Preclinical studies and early human experience have demonstrated that some of these surgical repair techniques can be performed using percutaneous approaches. Specifically, there has been great progress in the development of novel technology to facilitate percutaneous annuloplasty and percutaneous edge-to-edge repair. The objectives of this report were to (1) discuss the surgical foundations for these percutaneous approaches; (2) review device design and experimental and clinical results of percutaneous valve repair; and (3) address future directions, including the key challenges of patient selection and clinical trial design.

  14. Effect of the Interconnected Network Structure on the Epidemic Threshold

    CERN Document Server

    Wang, Huijuan; D'Agostino, Gregorio; Havlin, Shlomo; Stanley, H Eugene; Van Mieghem, Piet

    2013-01-01

    Most real-world networks are not isolated. In order to function fully, they are interconnected with other networks, and this interconnection influences their dynamic processes. For example, when the spread of a disease involves two species, the dynamics of the spread within each species (the contact network) differs from that of the spread between the two species (the interconnected network). We model two generic interconnected networks using two adjacency matrices, A and B, in which A is a 2N*2N matrix that depicts the connectivity within each of two networks of size N, and B a 2N*2N matrix that depicts the interconnections between the two. Using an N-intertwined mean-field approximation, we determine that a critical susceptable-infected-susceptable (SIS) epidemic threshold in two interconnected networks is 1/{\\lambda}1(A+\\alpha B), where the infection rate is \\beta within each of the two individual networks and \\alpha\\beta in the interconnected links between the two networks and {\\lambda}1(A+\\alpha B) is th...

  15. Architectural evaluation of beam-steered shuffle optical interconnect

    Science.gov (United States)

    Murdocca, Miles J.; Batchu, Ravi V.; Dennison, Michael

    1996-06-01

    We report on a reconfigurable optical interconnection approach in which static communication graphs are extracted from high level programs and are mapped onto a two stage optical beam-steered/perfect shuffle interconnect. An array of processing elements (PEs) is partitioned into functional units of equal size that are served by one optical input/output (I/O) port per PE. PEs within a functional unit can use any of the optical I/O ports served by that functional unit. An optical beam-steering mechanism in conjunction with an optical perfect shuffle interconnects the functional units. At the highest level, computer programs are written in the Id dataflow programming language. At the next level, dataflow graphs (communication graphs that represent the natural parallelism in a computation) are automatically extracted from the high-level programs. At the lowest level, the dataflow graphs are mapped onto the optical beam-steered/perfect shuffle interconnect. This mapping step is facilitated by a mechanism that redirects optical beams to that the physical interconnect takes the form of the dataflow graph. An intended application is to create low latency realizations of specialized hardware on-the-fly, such as for rapid prototyping. An advantage of this approach over competing all-electronic or static free-space optical interconnection approaches is that the optical interconnect has low depth (two stages) with low fan-out (typically 1 to 3). In previous work, the behaviors of the mappings are studied for randomly generated dataflow graphs. In the work reported here, the behaviors of the mappings are studied for extracted dataflow graphs. We conclude that this interconnection approach is effective for extracted dataflow graphs, using only a single pass through the network, if the interconnect is augmented with a small crossbar within each functional unit.

  16. On-chip photonic interconnects a computer architect's perspective

    CERN Document Server

    Nitta, Christopher J; Akella, Venkatesh

    2013-01-01

    As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to the interconnection network. Electrical interconnects are not likely to scale well to a large number of processors for energy efficiency reasons, and the problem is compounded by the fact that there is a fixed total power budget for a die, dictated by the amount of heat that can be dissipated without special (and expensive) cooling and packaging techniques. Thus, there is a need to seek alternatives to electrical signaling for on-chip interconnection appli

  17. Robust decentralized adaptive stabilization for a class of interconnected systems

    Institute of Scientific and Technical Information of China (English)

    Zhaojing WU; Xuejun XIE; Siying ZHANG

    2004-01-01

    The robust decentralized adaptive output-feedback stabilization for a class of interconnected systems with static and dynamic interconnections by using the MT-filters and backstepping design method is studied. By introducing a new filtered tramformation, the adaptive laws were derived for measurement. Under the assumption of the nonlinear growth conditions imposed on the nonlinear interconnections and by constructing the error system and using a new proof method, the global stability of the closed-loop system was effectively analyzed, and the exponential convergence of all the signals except for parameter estimates were guaranteed.

  18. Disturbance Attenuation State-Feedback Control for Uncertain Interconnected Systems

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    This paper studies the problem of robust H∞ control design for a class of uncertain interconnected systems viastate feedback. This class of systems are described by a state space model, which contains unknown nonlinear interactionand time-varying norm-bounded parametric uncertainties in state equation. Using the Riccati-equation-based approach wedesign state feedback control laws, which guarantee the decentralized stability with disturbance attenuation for the inter-connected uncertain systems. A simple example of an interconnected uncertain linear system is presented to illustrate theresults.

  19. Interconnectivity analysis of supercritical CO₂-foamed scaffolds.

    Science.gov (United States)

    Lemon, Greg; Reinwald, Yvonne; White, Lisa J; Howdle, Steven M; Shakesheff, Kevin M; King, John R

    2012-06-01

    This paper describes a computer algorithm for the determination of the interconnectivity of the pore space inside scaffolds used for tissue engineering. To validate the algorithm and its computer implementation, the algorithm was applied to a computer-generated scaffold consisting of a set of overlapping spherical pores, for which the interconnectivity was calculated exactly. The algorithm was then applied to micro-computed X-ray tomography images of supercritical CO(2)-foamed scaffolds made from poly(lactic-co-glycolic acid) (PLGA), whereby the effect of using different weight average molecular weight polymer on the interconnectivity was investigated.

  20. Hybrid silicon evanescent approach to optical interconnects

    Science.gov (United States)

    Liang, Di; Fang, Alexander W.; Chen, Hui-Wen; Sysak, Matthew N.; Koch, Brian R.; Lively, Erica; Raday, Omri; Kuo, Ying-Hao; Jones, Richard; Bowers, John E.

    2009-06-01

    We discuss the recently developed hybrid silicon evanescent platform (HSEP), and its application as a promising candidate for optical interconnects in silicon. A number of key discrete components and a wafer-scale integration process are reviewed. The motivation behind this work is to realize silicon-based photonic integrated circuits possessing unique advantages of III-V materials and silicon-on-insulator waveguides simultaneously through a complementary metal-oxide semiconductor fabrication process. Electrically pumped hybrid silicon distributed feedback and distributed Bragg reflector lasers with integrated hybrid silicon photodetectors are demonstrated coupled to SOI waveguides, serving as the reliable on-chip single-frequency light sources. For the external signal processing, Mach-Zehnder interferometer modulators are demonstrated, showing a resistance-capacitance-limited, 3 dB electrical bandwidth up to 8 GHz and a modulation efficiency of 1.5 V mm. The successful implementation of quantum well intermixing technique opens up the possibility to realize multiple III-V bandgaps in this platform. Sampled grating DBR devices integrated with electroabsorption modulators (EAM) are fabricated, where the bandgaps in gain, mirror, and EAM regions are 1520, 1440 and 1480 nm, respectively. The high-temperature operation characteristics of the HSEP are studied experimentally and theoretically. An overall characteristic temperature ( T 0) of 51°C, an above threshold characteristic temperature ( T 1) of 100°C, and a thermal impedance ( Z T ) of 41.8°C/W, which agrees with the theoretical prediction of 43.5°C/W, are extracted from the Fabry-Perot devices. Scaling this platform to larger dimensions is demonstrated up to 150 mm wafer diameter. A vertical outgassing channel design is developed to accomplish high-quality III-V epitaxial transfer to silicon in a timely and dimension-independent fashion.

  1. Interacting Social Processes on Interconnected Networks

    Science.gov (United States)

    Alvarez-Zuzek, Lucila G.; La Rocca, Cristian E.; Vazquez, Federico; Braunstein, Lidia A.

    2016-01-01

    We propose and study a model for the interplay between two different dynamical processes –one for opinion formation and the other for decision making– on two interconnected networks A and B. The opinion dynamics on network A corresponds to that of the M-model, where the state of each agent can take one of four possible values (S = −2,−1, 1, 2), describing its level of agreement on a given issue. The likelihood to become an extremist (S = ±2) or a moderate (S = ±1) is controlled by a reinforcement parameter r ≥ 0. The decision making dynamics on network B is akin to that of the Abrams-Strogatz model, where agents can be either in favor (S = +1) or against (S = −1) the issue. The probability that an agent changes its state is proportional to the fraction of neighbors that hold the opposite state raised to a power β. Starting from a polarized case scenario in which all agents of network A hold positive orientations while all agents of network B have a negative orientation, we explore the conditions under which one of the dynamics prevails over the other, imposing its initial orientation. We find that, for a given value of β, the two-network system reaches a consensus in the positive state (initial state of network A) when the reinforcement overcomes a crossover value r*(β), while a negative consensus happens for r βc. We develop an analytical mean-field approach that gives an insight into these regimes and shows that both dynamics are equivalent along the crossover line (r*, β*). PMID:27689698

  2. Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards

    Energy Technology Data Exchange (ETDEWEB)

    Nair, Aswathi; Raghunandan, Karthik; Yaswant, Vaddi; Sambandan, Sanjiv, E-mail: sanjiv@iap.iisc.ernet.in, E-mail: ssanjiv@isu.iisc.ernet.in [Department of Instrumentation and Applied Physics, Indian Institute of Science, Malleswaram, Bangalore 560012 (India); Pillai, Sreelal S. [Vikram Sarabhai Space Center, Indian Space Research Organization, Trivandrum 695022 (India)

    2015-03-23

    We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10 μm/s with healed route having mean resistance of 8 kΩ across a 200 micron gap and depending on the materials and concentrations used.

  3. An electro-optic waveform interconnect based on quantum interference

    CERN Document Server

    Qin, Li-Guo; Gong, Shang-Qing

    2016-01-01

    The ability to modulate an optical field via an electric field is regarded as a key function of electro-optic interconnects, which are used in optical communications and information processing systems. One of the main required devices for such interconnects is the electro-optic modulator (EOM). Current EOM based on the electro-optic effect and the electro-absorption effect often is bulky and power inefficient due to the weak electro-optic properties of its constituent materials. Here we propose a new mechanism to produce an arbitrary-waveform EOM based on the quantum interference, in which both the real and imaginary parts of the susceptibility are engineered coherently with the superhigh efficiency. Based on this EOM, a waveform interconnect from the voltage to the modulated optical absorption is realised. We expect that such a new type of electro-optic interconnect will have a broad range of applications including the optical communications and network.

  4. Extraction of ULSI Interconnect Resistance at High Frequencies

    Institute of Scientific and Technical Information of China (English)

    XIAO Xia; JIAN Duanduan; YAO Suying; ZHANG Shengcai; RUAN Gang

    2005-01-01

    Correct extraction of the ultra-large-scale integrated (ULSI) interconnect components at hight frequencies is very important for evaluating electrical performances of high-speed ULSI circuits.In this paper, the extraction of the interconnect resistance at high frequencies is derived from the Ohm′s law and verified by the software FastHenry.The results are also compared with those of another resistance formula originated from the effective area of the current flowing. The applicability of these two formulae is discussed.The influence of the interconnect geometry on the resistance at high frequencies is studied.The computation indicates that the effect of frequency on the resistance is weak when the skin depth is larger than half of the short side of the rectangular interconnect cross section.With further increase of frequency, the resistance increases obviously. Results imply that conductor with a square cross section exhibits the largest resistance for rectangular conductors of constant cross section area.

  5. Bus Encoder for Crosstalk Avoidance in RLC Modeled Interconnects

    Directory of Open Access Journals (Sweden)

    G. Nagendra Babu

    2012-02-01

    Full Text Available Most of the encoding methods proposed in recent years have dealt with only RC modeled VLSI interconnects. For deep sub micron technologies (DSM, on-chip inductive effects have increased due to faster clock speeds, smaller signal rise times and longer length of on-chip interconnects. All these issues raise the concern for cross talk, propagation delay and power dissipation of overall. Therefore, this research work introduces an efficient Bus Encoder using Bus Inverting (BI method. The proposed design dramatically reduces both cross talk and power dissipation in RLC modeled interconnects which makes it suitable for current high-speed low-power VLSI interconnects. The proposed model demonstrates an overall reduction of power dissipation and cross talk induced delay by 55.43% and 45.87%, respectively.

  6. 78 FR 7523 - Small Generator Interconnection Agreements and Procedures

    Science.gov (United States)

    2013-02-01

    ... explored methods to address then current queue management challenges in a manner consistent with..., e.g., IEEE Standard 1547 for Interconnecting Distributed Resources with Electric Power Systems and...

  7. Lightweight Metal RubberTM Sensors and Interconnects Project

    Data.gov (United States)

    National Aeronautics and Space Administration — The objective of the proposed program is to develop lightweight and highly elastic electrically conducting interconnects and strain sensor arrays for next generation...

  8. Free-Space Optical Interconnect Employing VCSEL Diodes

    Science.gov (United States)

    Simons, Rainee N.; Savich, Gregory R.; Torres, Heidi

    2009-01-01

    Sensor signal processing is widely used on aircraft and spacecraft. The scheme employs multiple input/output nodes for data acquisition and CPU (central processing unit) nodes for data processing. To connect 110 nodes and CPU nodes, scalable interconnections such as backplanes are desired because the number of nodes depends on requirements of each mission. An optical backplane consisting of vertical-cavity surface-emitting lasers (VCSELs), VCSEL drivers, photodetectors, and transimpedance amplifiers is the preferred approach since it can handle several hundred megabits per second data throughput.The next generation of satellite-borne systems will require transceivers and processors that can handle several Gb/s of data. Optical interconnects have been praised for both their speed and functionality with hopes that light can relieve the electrical bottleneck predicted for the near future. Optoelectronic interconnects provide a factor of ten improvement over electrical interconnects.

  9. In-plane biocompatible microfluidic interconnects for implantable microsystems.

    Science.gov (United States)

    Johnson, Dean G; Frisina, Robert D; Borkholder, David A

    2011-04-01

    Small mammals, particularly mice, are very useful animal models for biomedical research. Extremely small anatomical dimensions, however, make design of implantable microsystems quite challenging. A method for coupling external fluidic systems to microfluidic channels via in-plane interconnects is presented. Capillary tubing is inserted into channels etched in the surface of a Si wafer with a seal created by Parylene-C deposition. Prediction of Parylene-C deposition into tapered channels based on Knudsen diffusion and deposition characterizations allows for design optimization. Low-volume interconnects using biocompatible, chemical resistant materials have been demonstrated and shown to withstand pressure as high as 827 kPa (120 psi) with an average pull test strength of 2.9 N. Each interconnect consumes less than 0.018 mm3 (18 nL) of volume. The low added volume makes this an ideal interconnect technology for medical applications where implant volume is critical.

  10. Developing Generic Dynamic Models for the 2030 Eastern Interconnection Grid

    Energy Technology Data Exchange (ETDEWEB)

    Kou, Gefei [ORNL; Hadley, Stanton W [ORNL; Markham, Penn N [ORNL; Liu, Yilu [ORNL

    2013-12-01

    The Eastern Interconnection Planning Collaborative (EIPC) has built three major power flow cases for the 2030 Eastern Interconnection (EI) based on various levels of energy/environmental policy conditions, technology advances, and load growth. Using the power flow cases, this report documents the process of developing the generic 2030 dynamic models using typical dynamic parameters. The constructed model was validated indirectly using the synchronized phasor measurements by removing the wind generation temporarily.

  11. Performance evaluation of interconnected logistics networks confronted to hub disruptions

    OpenAIRE

    2016-01-01

    International audience; This paper investigates performance of interconnected logistics networks confronted to disruptions at hub level. With traditional supply chain network design, companies define and optimize their own logistics networks, resulting in current logistics systems being a set of independent heterogeneous logistics networks. The concept of PI aims to integrate independent logistics networks into a global, open, interconnected system. Prior research has shown that the new organ...

  12. Interconnection Optimization for Multi-Cluster Avionics Networks

    OpenAIRE

    2013-01-01

    National audience; The increasing complexity and heterogeneity of avionics networks make resource optimization a challenging task. In contrast to many previous approaches pursuing the optimization of traffic-source mapping and backbone network analysis, our work presented herein mainly focuses on the optimization of interconnection devices for multi-cluster avionics networks. In this paper, we introduce an optimized interconnection device, integrating novel frame packing strategies and schedu...

  13. WDM Nanoscale Laser Diodes for Si Photonic Interconnects

    Science.gov (United States)

    2016-07-25

    IEEE , (12 2012): 0. doi: TOTAL: 1 Number of Papers published in non peer-reviewed journals: 0.00 (c) Presentations Number of Presentations: Non Peer...out: Integration of VCSELs with Si, IEEE OPTICAL INTERCONNECTS CONFERENCE 2014. 06-MAY-14, Coronado, CA. : , G. Zhou, D.G. Deppe, X. Yang, Y. Zhang...SC. : , Dennis Deppe, Mingxin Li, Guowei Zhao, Xu Yang. Impact of VCSEL Scaling on Speed and BIt Energy for High Speed Interconnects, IEEE Summer

  14. Optimality in DNA repair.

    Science.gov (United States)

    Richard, Morgiane; Fryett, Matthew; Miller, Samantha; Booth, Ian; Grebogi, Celso; Moura, Alessandro

    2012-01-07

    DNA within cells is subject to damage from various sources. Organisms have evolved a number of mechanisms to repair DNA damage. The activity of repair enzymes carries its own risk, however, because the repair of two nearby lesions may lead to the breakup of DNA and result in cell death. We propose a mathematical theory of the damage and repair process in the important scenario where lesions are caused in bursts. We use this model to show that there is an optimum level of repair enzymes within cells which optimises the cell's response to damage. This optimal level is explained as the best trade-off between fast repair and a low probability of causing double-stranded breaks. We derive our results analytically and test them using stochastic simulations, and compare our predictions with current biological knowledge.

  15. Repair Pathway Choices and Consequences at the Double-Strand Break.

    Science.gov (United States)

    Ceccaldi, Raphael; Rondinelli, Beatrice; D'Andrea, Alan D

    2016-01-01

    DNA double-strand breaks (DSBs) are cytotoxic lesions that threaten genomic integrity. Failure to repair a DSB has deleterious consequences, including genomic instability and cell death. Indeed, misrepair of DSBs can lead to inappropriate end-joining events, which commonly underlie oncogenic transformation due to chromosomal translocations. Typically, cells employ two main mechanisms to repair DSBs: homologous recombination (HR) and classical nonhomologous end joining (C-NHEJ). In addition, alternative error-prone DSB repair pathways, namely alternative end joining (alt-EJ) and single-strand annealing (SSA), have been recently shown to operate in many different conditions and to contribute to genome rearrangements and oncogenic transformation. Here, we review the mechanisms regulating DSB repair pathway choice, together with the potential interconnections between HR and the annealing-dependent error-prone DSB repair pathways.

  16. On Maintenance of Inter-connectivity Among Multi-representations

    Institute of Scientific and Technical Information of China (English)

    WANG Yan-hui; MENG Hao; LIU Xiao-meng

    2006-01-01

    As the problems of conceptual and representational differences will arise among multi-representations, inter-connectivity maintenance among multi-representations exists as a foundational task in building multi-scale data model. Since the existing methods are still not satisfactory in practice, the inter-connectivity among multiple representations can be only achieved if the multi-scale model is capable of explicitly inter-relating them and dealing with their differences. So, this paper firstly explores the relation among multiple representations from the same entity, such as multi-semantic, multi-geometry, multi-attributes, hierarchical semantic relations and so on. Based on these, this paper proposes aggregation-based semantic hierarchical matching rules (ASHMR) as the basis of tackling inter-connectivity among multi-representations, and defines the available hierarchical semantic knowledge, namely semantically equal, semantically related and semantically irrelevant. According to different change among multi-representations from different types of objects, the applications and techniques of the corresponding hierarchy inter-connectivity matching criterion are explored. And taken the road intersections as examples, a case in point is given in details for describing the strategies of inter-connectivity maintenance, showing that this method is feasible to deal with inter-connectivity.

  17. About message routing in different hypercube interconnection network types

    Directory of Open Access Journals (Sweden)

    M. Popa

    1999-10-01

    Full Text Available The paper treats the problem of message routing in different hypercube interconnection network types. Because the communication algorithms frequently use a few basic communication operations, the purpose was to optain relationships for the total communication time at the implementation of these basic operations in different hypercube interconnection types. The basic communication operations considered were: simple message transfer between two processors, one to all broadcast, all to all broadcast, one to all personalized communication, and all to all personalized communication. For establishing the desired relationships, the starting point were the relationships for the total communication time for the above mentioned operations implemented on three basic interconnection networks: classical hypercube, ring and mesh. The different hypercube interconnection network types considered were: the cube connected cycles network, the extended hypercube, the hypernet network, the k array n hypercube and the composed hypercube. The obtained relationships are useful to establish the performances of the considered networks, from the total communication time point of view, making comparisons between them and between them and the classical hypercube interconnection network with the same number of nodes. The most advantageous interconnection network from the above mentioned point of view, is the composed hypercube with the dynamic position of the nodes.

  18. Isothermal test as a WLR monitor for Cu interconnects

    Science.gov (United States)

    Marathe, Amit P.; Pham, Van; Chan, Jay; Weidner, Jorg-Oliver; Heinig, Volker; Thierbach, Steffi

    2000-08-01

    The need for higher interconnect current densities has been increasing rapidly for advanced integrated circuits. Cu interconnects have emerged as viable candidates to replace Aluminium due to the lower sheet resistivity and increased electro migration lifetime of Cu. Previously, we had reported the use of the isothermal test as a WLR monitor for detecting process defects such as voids in the Aluminium interconnects. This paper further extends the application of the isothermal test methodology for detecting and characterizing process defects in Cu interconnect technology. Package electro migration test are time consuming and may be impractical in detecting process defects in a timely manner. Isothermal test, on the other hand, can be effectively used as a fast WLR process monitor. This paper reports the influence of direction of test current as well as different types of test structures, such as a single level NIST structure and a via chain structure and a via chain structure, on the isothermal test results for Cu interconnects. The isothermal test data has been shown to be helpful in evaluating the location and severity of the process defects through a proper choice of test structures. Joule heating due to high current density is found to be the major driving force for the sensitivity of isothermal test failures. A good correlation is also seen with the package electro migration data. A simple wafer level isothermal test has thus been successfully demonstrated as a reliability tool for process monitoring in Cu VLSI interconnects.

  19. Repairs of composite structures

    Science.gov (United States)

    Roh, Hee Seok

    Repair on damaged composite panels was conducted. To better understand adhesively bonded repair, the study investigates the effect of design parameters on the joint strength. The design parameters include bondline length, thickness of adherend and type of adhesive. Adhesives considered in this study were tested to measure their tensile material properties. Three types of adhesively bonded joints, single strap, double strap, and single lap joint were considered under changing bondline lengths, thickness of adherend and type of adhesive. Based on lessons learned from bonded joints, a one-sided patch repair method for composite structures was conducted. The composite patch was bonded to the damaged panel by either film adhesive FM-73M or paste adhesive EA-9394 and the residual strengths of the repaired specimens were compared under varying patch sizes. A new repair method using attachments has been suggested to enhance the residual strength. Results obtained through experiments were analyzed using finite element analysis to provide a better repair design and explain the experimental results. It was observed that the residual strength of the repaired specimen was affected by patch length. Method for rapid repairs of damaged composite structures was investigated. The damage was represented by a circular hole in a composite laminated plate. Pre-cured composite patches were bonded with a quick-curing commercial adhesive near (rather than over) the hole. Tensile tests were conducted on specimens repaired with various patch geometries. The test results showed that, among the methods investigated, the best repair method restored over 90% of the original strength of an undamaged panel. The interfacial stresses in the adhesive zone for different patches were calculated in order to understand the efficiencies of the designs of these patch repairs. It was found that the composite patch that yielded the best strength had the lowest interfacial peel stress between the patch and

  20. Workshop on DNA repair.

    NARCIS (Netherlands)

    A.R. Lehmann (Alan); J.H.J. Hoeijmakers (Jan); A.A. van Zeeland (Albert); C.M.P. Backendorf (Claude); B.A. Bridges; A. Collins; R.P.D. Fuchs; G.P. Margison; R. Montesano; E. Moustacchi; A.T. Natarajan; M. Radman; A. Sarasin; E. Seeberg; C.A. Smith; M. Stefanini (Miria); L.H. Thompson; G.P. van der Schans; C.A. Weber (Christine); M.Z. Zdzienika

    1992-01-01

    textabstractA workshop on DNA repair with emphasis on eukaryotic systems was held, under the auspices of the EC Concerted Action on DNA Repair and Cancer, at Noordwijkerhout (The Netherlands) 14-19 April 1991. The local organization of the meeting was done under the auspices of the Medical Genetic C

  1. Laparoscopic lumbar hernia repair.

    Science.gov (United States)

    Madan, Atul K; Ternovits, Craig A; Speck, Karen E; Pritchard, F Elizabeth; Tichansky, David S

    2006-04-01

    Lumbar hernias are rare clinical entities that often pose a challenge for repair. Because of the surrounding anatomy, adequate surgical herniorraphy is often difficult. Minimally invasive surgery has become an option for these hernias. Herein, we describe two patients with lumbar hernias (one with a recurrent traumatic hernia and one with an incisional hernia). Both of these hernias were successfully repaired laparoscopically.

  2. Electronic interconnects and devices with topological surface states and methods for fabricating same

    Energy Technology Data Exchange (ETDEWEB)

    Yazdani, Ali; Ong, N. Phuan; Cava, Robert J.

    2017-04-04

    An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

  3. Electronic interconnects and devices with topological surface states and methods for fabricating same

    Energy Technology Data Exchange (ETDEWEB)

    Yazdani, Ali; Ong, N. Phuan; Cava, Robert J.

    2016-05-03

    An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

  4. DNA repair protocols

    DEFF Research Database (Denmark)

    Bjergbæk, Lotte

    In its 3rd edition, this Methods in Molecular Biology(TM) book covers the eukaryotic response to genomic insult including advanced protocols and standard techniques in the field of DNA repair. Offers expert guidance for DNA repair, recombination, and replication. Current knowledge of the mechanisms...... that regulate DNA repair has grown significantly over the past years with technology advances such as RNA interference, advanced proteomics and microscopy as well as high throughput screens. The third edition of DNA Repair Protocols covers various aspects of the eukaryotic response to genomic insult including...... recent advanced protocols as well as standard techniques used in the field of DNA repair. Both mammalian and non-mammalian model organisms are covered in the book, and many of the techniques can be applied with only minor modifications to other systems than the one described. Written in the highly...

  5. INTERNAL REPAIR OF PIPELINES

    Energy Technology Data Exchange (ETDEWEB)

    Bill Bruce; Nancy Porter; George Ritter; Matt Boring; Mark Lozev; Ian Harris; Bill Mohr; Dennis Harwig; Robin Gordon; Chris Neary; Mike Sullivan

    2005-07-20

    The two broad categories of fiber-reinforced composite liner repair and deposited weld metal repair technologies were reviewed and evaluated for potential application for internal repair of gas transmission pipelines. Both are used to some extent for other applications and could be further developed for internal, local, structural repair of gas transmission pipelines. Principal conclusions from a survey of natural gas transmission industry pipeline operators can be summarized in terms of the following performance requirements for internal repair: (1) Use of internal repair is most attractive for river crossings, under other bodies of water, in difficult soil conditions, under highways, under congested intersections, and under railway crossings. (2) Internal pipe repair offers a strong potential advantage to the high cost of horizontal direct drilling when a new bore must be created to solve a leak or other problem. (3) Typical travel distances can be divided into three distinct groups: up to 305 m (1,000 ft.); between 305 m and 610 m (1,000 ft. and 2,000 ft.); and beyond 914 m (3,000 ft.). All three groups require pig-based systems. A despooled umbilical system would suffice for the first two groups which represents 81% of survey respondents. The third group would require an onboard self-contained power unit for propulsion and welding/liner repair energy needs. (4) The most common size range for 80% to 90% of operators surveyed is 508 mm (20 in.) to 762 mm (30 in.), with 95% using 558.8 mm (22 in.) pipe. Evaluation trials were conducted on pipe sections with simulated corrosion damage repaired with glass fiber-reinforced composite liners, carbon fiber-reinforced composite liners, and weld deposition. Additional un-repaired pipe sections were evaluated in the virgin condition and with simulated damage. Hydrostatic failure pressures for pipe sections repaired with glass fiber-reinforced composite liner were only marginally greater than that of pipe sections without

  6. Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

    Science.gov (United States)

    Strickland, S. M.; Hester, J. D.; Gowan, A. K.; Montgomery, R. K.; Geist, D. L.; Blanche, J. F.; McGuire, G. D.; Nash, T. S.

    2011-01-01

    As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

  7. Electrochemical Migration of Fine-Pitch Nanopaste Ag Interconnects

    Science.gov (United States)

    Tsou, Chia-Hung; Liu, Kai-Ning; Lin, Heng-Tien; Ouyang, Fan-Yi

    2016-12-01

    With the development of intelligent electronic products, usage of fine-pitch interconnects has become mainstream in high performance electronic devices. Electrochemical migration (ECM) of interconnects would be a serious reliability problem under temperature, humidity and biased voltage environments. In this study, ECM behavior of nanopaste Ag interconnects with pitch size from 20 μm to 50 μm was evaluated by thermal humidity bias (THB) and water drop (WD) tests with deionized water through in situ leakage current-versus-time (CVT) curve. The results indicate that the failure time of ECM in fine-pitch samples occurs within few seconds under WD testing and it increases with increasing pitch size. The microstructure examination indicated that intensive dendrite formation of Ag through the whole interface was found to bridge the two electrodes. In the THB test, the CVT curve exhibited two stages, incubation and ramp-up; failure time of ECM was about 173.7 min. In addition, intensive dendrite formation was observed only at the protrusion of the Ag interconnects due to the concentration of the electric field at the protrusion of the Ag interconnects.

  8. Polyguide polymeric technology for optical interconnect circuits and components

    Science.gov (United States)

    Booth, Bruce L.; Marchegiano, Joseph E.; Chang, Catherine T.; Furmanak, Robert J.; Graham, Douglas M.; Wagner, Richard G.

    1997-04-01

    The expanding information revolution has been made possible by the development of optical communication technology. To meet the escalating demand for information transmitted and processed at high data rates and the need to circumvent the growing electronic circuit bottlenecks, mass deployment of not only optical fiber networks but manufacturable optical interconnect circuits, components and connectors for interfacing fibers and electronics that meet economic and performance constraints are absolutely necessary. Polymeric waveguide optical interconnection are considered increasingly important to meet these market needs. DuPont's polyguide polymeric integrated optic channel waveguide system is thought by many to have considerable potential for a broad range of passive optical interconnect applications. In this paper the recent advances, status, and unique attributes of the technology are reviewed. Product and technology developments currently in progress including parallel optical ink organization and polymer optical interconnect technology developments funded by DARPA are used as examples to describe polyguide breadth and potential for manufacture and deployment of optical interconnection products for single and multimode telecom and datacom waveguide applications.

  9. INTERNAL REPAIR OF PIPELINES

    Energy Technology Data Exchange (ETDEWEB)

    Robin Gordon; Bill Bruce; Ian Harris; Dennis Harwig; George Ritter; Bill Mohr; Matt Boring; Nancy Porter; Mike Sullivan; Chris Neary

    2004-12-31

    The two broad categories of fiber-reinforced composite liner repair and deposited weld metal repair technologies were reviewed and evaluated for potential application for internal repair of gas transmission pipelines. Both are used to some extent for other applications and could be further developed for internal, local, structural repair of gas transmission pipelines. Principal conclusions from a survey of natural gas transmission industry pipeline operators can be summarized in terms of the following performance requirements for internal repair: (1) Use of internal repair is most attractive for river crossings, under other bodies of water, in difficult soil conditions, under highways, under congested intersections, and under railway crossings. (2) Internal pipe repair offers a strong potential advantage to the high cost of horizontal direct drilling when a new bore must be created to solve a leak or other problem. (3) Typical travel distances can be divided into three distinct groups: up to 305 m (1,000 ft.); between 305 m and 610 m (1,000 ft. and 2,000 ft.); and beyond 914 m (3,000 ft.). All three groups require pig-based systems. A despooled umbilical system would suffice for the first two groups which represents 81% of survey respondents. The third group would require an onboard self-contained power unit for propulsion and welding/liner repair energy needs. (4) The most common size range for 80% to 90% of operators surveyed is 508 mm (20 in.) to 762 mm (30 in.), with 95% using 558.8 mm (22 in.) pipe. Evaluation trials were conducted on pipe sections with simulated corrosion damage repaired with glass fiber-reinforced composite liners, carbon fiber-reinforced composite liners, and weld deposition. Additional un-repaired pipe sections were evaluated in the virgin condition and with simulated damage. Hydrostatic failure pressures for pipe sections repaired with glass fiber-reinforced composite liner were only marginally greater than that of pipe sections without

  10. High temperature corrosion of metallic interconnects in solid oxide fuel cells

    OpenAIRE

    Martínez Bastidas, David

    2006-01-01

    Research and development has made it possible to use metallic interconnects in solid oxide fuel cells (SOFC) instead of ceramic materials. The use of metallic interconnects was formerly hindered by the high operating temperature, which made the interconnect degrade too much and too fast to be an efficient alternative. When the operating temperature was lowered, the use of metallic interconnects proved to be favourable since they are easier and cheaper to produce than ceramic interconnects....

  11. INTERNAL REPAIR OF PIPELINES

    Energy Technology Data Exchange (ETDEWEB)

    Robin Gordon; Bill Bruce; Ian Harris; Dennis Harwig; George Ritter; Bill Mohr; Matt Boring; Nancy Porter; Mike Sullivan; Chris Neary

    2004-08-17

    The two broad categories of fiber-reinforced composite liner repair and deposited weld metal repair technologies were reviewed and evaluated for potential application for internal repair of gas transmission pipelines. Both are used to some extent for other applications and could be further developed for internal, local, structural repair of gas transmission pipelines. Principal conclusions from a survey of natural gas transmission industry pipeline operators can be summarized in terms of the following performance requirements for internal repair: (1) Use of internal repair is most attractive for river crossings, under other bodies of water, in difficult soil conditions, under highways, under congested intersections, and under railway. (2) Internal pipe repair offers a strong potential advantage to the high cost of horizontal direct drilling when a new bore must be created to solve a leak or other problem. (3) Typical travel distances can be divided into three distinct groups: up to 305 m (1,000 ft.); between 305 m and 610 m (1,000 ft. and 2,000 ft.); and beyond 914 m (3,000 ft.). All three groups require pig-based systems. A despooled umbilical system would suffice for the first two groups which represents 81% of survey respondents. The third group would require an onboard self-contained power unit for propulsion and welding/liner repair energy needs. (4) The most common size range for 80% to 90% of operators surveyed is 508 mm (20 in.) to 762 mm (30 in.), with 95% using 558.8 mm (22 in.) pipe. Evaluation trials were conducted on pipe sections with simulated corrosion damage repaired with glass fiber-reinforced composite liners, carbon fiber-reinforced composite liners, and weld deposition. Additional un-repaired pipe sections were evaluated in the virgin condition and with simulated damage. Hydrostatic failure pressures for pipe sections repaired with glass fiber-reinforced composite liner were only marginally greater than that of pipe sections without liners

  12. Crosstalk Model and Estimation Formula for VLSI Interconnect Wires

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    We develop an interconnect crosstalk estimation model on the assumption of linearity for CMOS device. First, we analyze the terminal response of RC model on the worst condition from the S field to the time domain. The exact 3 order coefficients in S field are obtained due to the interconnect tree model. Based on this, a crosstalk peak estimation formula is presented. Unlike other crosstalk equations in the literature, this formula is only used coupled capacitance and grand capacitance as parameter. Experimental results show that, compared with the SPICE results, the estimation formulae are simple and accurate. So the model is expected to be used in such fields as layout-driven logic and high level synthesis, performance-driven floorplanning and interconnect planning.

  13. Spontaneous synchronization driven by energy transport in interconnected networks

    CERN Document Server

    Nicosia, Vincenzo; Latora, Vito; Arenas, Alex

    2014-01-01

    The existence of intertwined dynamical processes in interconnected networks is a distinctive aspect of complex systems. For example, cerebral circulation delivers oxygenated blood to the brain through blood vessels, and in turn the neural system in the brain is responsible, through neural network connections, for mediating changes in cerebral blood flow. To understand the effects of the coupling between different processes we study the case of two interconnected networks, one accounting for energy transport and the other for a synchronization dynamics. We observe the emergence of switch-like spontaneous synchronization, similar to that seen in the transition between resting-state and cognitive activity in the human brain, for a wide range of control parameters and for different network topologies. We suggest that similarly interconnected dynamical processes could be responsible for spontaneous synchronization transitions observed in natural systems.

  14. Communication issues in parallel systems with optical interconnections

    Science.gov (United States)

    Berthome, Pascal; Ferreira, A.

    1995-02-01

    In classical massively parallel computers, the complexity of the interconnection networks is much higher than the complexity of the processing elements themselves. Optical interconnections may provide a way to reconsider very large parallel architectures. We compare some optically interconnected parallel multicomputer models with regard to their communication capabilities. We first establish a distinction of such systems, based on the independence of the communication elements embedded in the processors (transmitters and receivers). Then, motivated by the fact that in multicomputers some communication operations have to be very efficiently performed, we study two fundamental communication problems, namely, one-to-all and all-to-all, under the hypothesis of bounded fanout. Our results take also into account a bounded number of available wavelengths.

  15. Generation adequacy and transmission interconnection in regional electricity markets

    Energy Technology Data Exchange (ETDEWEB)

    Cepeda, Mauricio [EDF R and D Division and LARSEN, 27 Avenue Lombart, 92260 Fontenay-aux-Roses (France); Saguan, Marcelo [University of Paris XI-GRJM Group, 27 Avenue Lombart, 92260 Fontenay-aux-Roses (France); Finon, Dominique [CIRED and CNRS, 45 bis avenue de La Belle Gabrielle, 94736 Nogent sur Marne-cedex (France); Pignon, Virginie [EDF R and D Division, 2 avenue du General de Gaulle, 92127 Clamart-cedex (France)

    2009-12-15

    The power system capacity adequacy has public good features that cannot be entirely solved by electricity markets. Regulatory intervention is then necessary and established methods have been used to assess adequacy and help regulators to fix this market failure. In regional electricity markets, transmission interconnections play an important role in contributing to adequacy. However, the adequacy problem and related policy are typically considered at a national level. This paper presents a simple model to study how the interconnection capacity interacts with generation adequacy. First results indicate that increasing interconnection capacity between systems improves adequacy up to a certain level; further increases do not procure additional adequacy improvements. Furthermore, besides adequacy improvement, increasing transmission capacity under asymmetric adequacy criteria or national system characteristics could create several concerns about externalities. These results imply that regional coordination of national adequacy policies is essential to internalise adequacy of cross-border effects. (author)

  16. Carbon nanotube based VLSI interconnects analysis and design

    CERN Document Server

    Kaushik, Brajesh Kumar

    2015-01-01

    The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.

  17. Distributed Robustness Analysis of Interconnected Uncertain Systems Using Chordal Decomposition

    DEFF Research Database (Denmark)

    Pakazad, Sina Khoshfetrat; Hansson, Anders; Andersen, Martin Skovgaard

    2014-01-01

    Large-scale interconnected uncertain systems commonly have large state and uncertainty dimensions. Aside from the heavy computational cost of performing robust stability analysis in a centralized manner, privacy requirements in the network can also introduce further issues. In this paper, we...... utilize IQC analysis for analyzing large-scale interconnected uncertain systems and we evade these issues by describing a decomposition scheme that is based on the interconnection structure of the system. This scheme is based on the so-called chordal decomposition and does not add any conservativeness...... to the analysis approach. The decomposed problem can be solved using distributed computational algorithms without the need for a centralized computational unit. We further discuss the merits of the proposed analysis approach using a numerical experiment....

  18. Modeling Interconnect Variability Using Efficient Parametric Model Order Reduction

    CERN Document Server

    Li, Peng; Li, Xin; Pileggi, Lawrence T; Nassif, Sani R

    2011-01-01

    Assessing IC manufacturing process fluctuations and their impacts on IC interconnect performance has become unavoidable for modern DSM designs. However, the construction of parametric interconnect models is often hampered by the rapid increase in computational cost and model complexity. In this paper we present an efficient yet accurate parametric model order reduction algorithm for addressing the variability of IC interconnect performance. The efficiency of the approach lies in a novel combination of low-rank matrix approximation and multi-parameter moment matching. The complexity of the proposed parametric model order reduction is as low as that of a standard Krylov subspace method when applied to a nominal system. Under the projection-based framework, our algorithm also preserves the passivity of the resulting parametric models.

  19. Beam Vacuum Interconnects for the LHC Cold Arcs

    CERN Document Server

    Veness, R J M; Gröbner, Oswald; Lepeule, P; Reymermier, C; Schneider, G; Skoczen, Blazej; Kleimenok, V; Nikitin, I N

    1999-01-01

    The design of the beam vacuum interconnect is described in this paper. Features include a novel RF bridge design to maximise lateral flexibility during cryostat Cold arcs of the LHC will consist of twin aperture dipole, quadrupole and corrector magnets in cryostats, operating at 1.9 K. Beam vacuum chambers, along with all connecting elements require flexible 'interconnects' between adjacent cryostats to allow for thermal and mechanical offsets foreseen during machine operation and alignment. In addition, the beam vacuum chambers contain perforated beam screens to intercept beam induced heat loads at an intermediate temperature. These must also be connected with low impedance RF bridges in the interconnect zones.alignment and so-called 'nested' bellows to minimise the required length of the assembly.

  20. Parallel optical interconnects utilizing VLSI/FLC spatial light modulators

    Science.gov (United States)

    Genco, Sheryl M.

    1991-12-01

    Interconnection architectures are a cornerstone of parallel computing systems. However, interconnections can be a bottleneck in conventional computer architectures because of queuing structures that are necessary to handle the traffic through a switch at very high data rates and bandwidths. These issues must find new solutions to advance the state of the art in computing beyond the fundamental limit of silicon logic technology. Today's optoelectronic (OE) technology in particular VLSI/FLC spatial light modulators (SLMs) can provide a unique and innovative solution to these issues. This paper reports on the motivations for the system, describes the major areas of architectural requirements, discusses interconnection topologies and processor element alternatives, and documents an optical arbitration (i.e., control) scheme using `smart' SLMs and optical logic gates. The network topology is given in section 2.1 `Architectural Requirements -- Networks,' but it should be noted that the emphasis is on the optical control scheme (section 2.4) and the system.

  1. Net Metering and Interconnection Procedures-- Incorporating Best Practices

    Energy Technology Data Exchange (ETDEWEB)

    Jason Keyes, Kevin Fox, Joseph Wiedman, Staff at North Carolina Solar Center

    2009-04-01

    State utility commissions and utilities themselves are actively developing and revising their procedures for the interconnection and net metering of distributed generation. However, the procedures most often used by regulators and utilities as models have not been updated in the past three years, in which time most of the distributed solar facilities in the United States have been installed. In that period, the Interstate Renewable Energy Council (IREC) has been a participant in more than thirty state utility commission rulemakings regarding interconnection and net metering of distributed generation. With the knowledge gained from this experience, IREC has updated its model procedures to incorporate current best practices. This paper presents the most significant changes made to IREC’s model interconnection and net metering procedures.

  2. Salvage hypospadias repairs

    Directory of Open Access Journals (Sweden)

    Sripathi V

    2008-01-01

    Full Text Available Aim: Review of our experience and to develop an algorithm for salvage procedures in the management of hypospadias cripples and treatment of urethral strictures following hypospadias repair. Methods: This is a retrospective review of hypospadias surgeries over a 41-month period. Out of a total 168 surgeries, 20 were salvage/re-operative repairs. In three children a Duplay repair was feasible, while in four others a variety of single-stage repairs could be done. The repair was staged in seven children - buccal mucosal grafts (BMGs in five, buccal mucosal tube in one, and skin graft in one. Five children with dense strictures were managed by dorsal BMG inlay grafting in one, vascularized tunical onlay grafting on the ventrum in one, and a free tunical patch in one. Three children were treated by internal urethrotomy and stenting for four weeks with a poor outcome. Results: The age of children ranged from 1.5-15 years (mean 4.5. Follow-up ranged from 3 months to 3.5 years. Excellent results were obtained in 10 children (50% with a well-surfaced erect penis and a slit-like meatus. Glans closure could not be achieved and meatus was coronal in three. Two children developed fistulae following a Duplay repair and following a staged BMG. Three repairs failed completely - a composite repair broke down, a BMG tube stenosed with a proximal leak, and a stricture recurred with loss of a ventral free tunical graft. Conclusions: In salvage procedures performed on hypospadias cripples, a staged repair with buccal mucosa as an inlay in the first stage followed by tubularization 4-6 months later provides good results. A simple algorithm to plan corrective surgery in failed hypospadias cases and obtain satisfactory results is devised.

  3. A one-semester course in modeling of VSLI interconnections

    CERN Document Server

    Goel, Ashok

    2014-01-01

    Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-i

  4. Real-time synthesis of sparsely interconnected neural associative memories.

    Science.gov (United States)

    Chan, Hubert Y.; Zak, Stanislaw H.

    1998-06-01

    The problem of implementing associative memories using sparsely interconnected generalized Brain-State-in-a-Box (gBSB) network is addressed in this paper. In particular, a "designer" neural network that synthesizes the associative memories is proposed. An upper bound on the time required for the designer network to reach a solution is determined. A neighborhood criterion with toroidal geometry for the cellular gBSB network is analyzed, in which the number of adjacent cells is independent of the generic cell location. A design method of neural associative memories with prespecified interconnecting weights is presented. The effectiveness of the proposed synthesis method is demonstrated with numerical examples.

  5. Compact models and performance investigations for subthreshold interconnects

    CERN Document Server

    Dhiman, Rohit

    2014-01-01

    The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wi

  6. Interconnect Challenges in Highly Integrated MEMS/ASIC Subsystems

    CERN Document Server

    Marenco, N; Reinert, W

    2008-01-01

    Micromechanical devices like accelerometers or rotation sensors form an increasing segment beneath the devices supplying the consumer market. A hybrid integration approach to build smart sensor clusters for the precise detection of movements in all spatial dimensions requires a large toolbox of interconnect technologies, each with its own constraints regarding the total process integration. Specific challenges described in this paper are post-CMOS feedthroughs, front-to-front die contact arrays, vacuum-compliant lateral interconnect and fine-pitch solder balling to finally form a Chip-Scale System-in-Package (CSSiP).

  7. Decentralized impulsive control for a class of uncertain interconnected systems

    Institute of Scientific and Technical Information of China (English)

    成新明; 关治洪; 刘新芝

    2004-01-01

    A great deal of stabilization criteria has been obtained from study of stabilizing interconnected systems. The results obtained are usually based on continuous systems by state feedback. In this paper, decentralized impulsive control is presented to stabilize a class of uncertain interconnected systems based on Lyapunov theory. The system under consideration involves parameter uncertainties and unknown nonlinear interactions among subsystems. Some new criteria of stabilization under impulsive control are established. Two numerical examples are offered to prove the effectiveness and practicality of the proposed method.

  8. EEG simulation by 2D interconnected chaotic oscillators

    Energy Technology Data Exchange (ETDEWEB)

    Kubany, Adam, E-mail: adamku@bgu.ac.i [Department of Industrial Engineering and Management, Ben-Gurion University of the Negev, P.O. Box 653, Beer-Sheva 84105 (Israel); Mhabary, Ziv; Gontar, Vladimir [Department of Industrial Engineering and Management, Ben-Gurion University of the Negev, P.O. Box 653, Beer-Sheva 84105 (Israel)

    2011-01-15

    Research highlights: ANN of 2D interconnected chaotic oscillators is explored for EEG simulation. An inverse problem solution (PRCGA) is proposed. Good matching between the simulated and experimental EEG signals has been achieved. - Abstract: An artificial neuronal network composed by 2D interconnected chaotic oscillators is explored for brain waves (EEG) simulation. For the inverse problem solution a parallel real-coded genetic algorithm (PRCGA) is proposed. In order to conduct thorough comparison between the simulated and target signal characteristics, a spectrum analysis of the signals is undertaken. A good matching between the theoretical and experimental EEG signals has been achieved. Numerical results of calculations are presented and discussed.

  9. Fundamentals of reliability engineering applications in multistage interconnection networks

    CERN Document Server

    Gunawan, Indra

    2014-01-01

    This book presents fundamentals of reliability engineering with its applications in evaluating reliability of multistage interconnection networks. In the first part of the book, it introduces the concept of reliability engineering, elements of probability theory, probability distributions, availability and data analysis.  The second part of the book provides an overview of parallel/distributed computing, network design considerations, and more.  The book covers a comprehensive reliability engineering methods and its practical aspects in the interconnection network systems. Students, engineers, researchers, managers will find this book as a valuable reference source.

  10. Interconnects for intermediate temperature solid oxide fuel cells

    Science.gov (United States)

    Huang, Wenhua

    Presently, one of the principal goals of solid oxide fuel cells (SOFCs) research is to reduce the stack operating temperature to between 600 and 800°C. However, one of the principal technological barriers is the non-availability of a suitable material satisfying all of the stability requirements for the interconnect. In this work two approaches for intermediate temperature SOFC interconnects have been explored. The first approach comprises an interconnect consisting of a bi-layer structure, a p-type oxide (La0.96Sr0.08MnO 2.001/LSM) layer exposed to a cathodic environment, and an n-type oxide (Y0.08Sr0.88Ti0.95Al0.05O 3-delta/YSTA) layer exposed to anodic conditions. Theoretical analysis based on the bi-layer structure has established design criteria to implement this approach. The analysis shows that the interfacial oxygen partial pressure, which determines the interconnect stability, is independent of the electronic conductivities of both layers but dependent on the oxygen ion layer interconnects, the oxygen ion conductivities of LSM and YSTA were measured as a function of temperature and oxygen partial pressure. Based on the measured data, it has been determined that if the thickness of YSTA layer is around 0.1cm, the thickness of LSM layer should be around 0.6 mum in order to maintain the stability of LSM. In a second approach, a less expensive stainless steel interconnect has been studied. However, one of the major concerns associated with the use of metallic interconnects is the development of a semi-conducting or insulating oxide scale and chromium volatility during extended exposure to the SOFC operating environment. Dense and well adhered Mn-Cu spinet oxide coatings were successfully deposited on stainless steel by an electrophoretic deposition (EPD) technique. It was found that the Mn-Cu-O coating significantly reduced the oxidation rate of the stainless steel and the volatility of chromium. The area specific resistance (ASR) of coated Crofer 22 APU is

  11. DECENTRALIZED STABILIZATION OF A CLASS OF INTERCONNECTED SYSTEMS

    Institute of Scientific and Technical Information of China (English)

    2001-01-01

    This paper is concerned with the decentralized stabilization of continuous and discrete linear interconnected systems with the structural constraints about the interconnection matrices. For the continuous case,the main improvement in the paper as compared with the corresponding results in the literature is to extend the considered class of systems from S to S*(both will be defined in the paper)without resulting in high decentralized gain and difficult numerical computation. The algorithm for obtaining decentralized state feedback control to stable the overall system is presented. The discrete case and some very useful results are discussed as well.

  12. Testing Interconnections using Conductive Adhesives for Application in PV Modules

    Energy Technology Data Exchange (ETDEWEB)

    Broek, K.M.; De Jong, P.C.; Kloos, M.J.H. [ECN Solar Energy, Petten (Netherlands); Van den Nieuwenhof, M.A.C.J.; Bots, T.L.; Meuwissen, M.H.H.; Steijvers, H.L.A.H. [TNO Science and Industry, Eindhoven (Netherlands)

    2006-09-15

    In current module production the electrical interconnections are soldered to the solar cells. For current modules with thin cells and new module concepts with back contact cells, the replacement of solder by conductive adhesives can be advantageous. However, the current IEC tests were developed for soldered interconnections, which have other failure mechanisms. Therefore, three additional tests have been developed for the testing of conductive adhesives to be used in solar modules. In combination with computer simulation techniques developed in the same project, the tests will contribute to a better understanding of failure mechanisms of PV modules with conductive adhesives.

  13. Novel paradigm for integrated photonics circuits: transient interconnection network

    Science.gov (United States)

    Fazio, Eugenio; Belardini, Alessandro; Bastiani, Lorenzo; Alonzo, Massimo; Chauvet, Mathieu; Zheludev, Nikolay I.; Soci, Cesare

    2017-01-01

    Self-confined beams and spatial solitons were always investigated for a purely academic point of view, describing their formation and cross-interaction. We propose a novel paradigm for integrated photonics circuits based on self-confined interconnections. We consider that circuits are not designed since beginning; a network of writing lasers provide the circuit configuration inside which information at a different wavelength travels. we propose new designs for interconnections and both digital and analog switching gates somehow inspired by Nature, following analog decision routes used in biological networks like brain synapsis or animal path finding.

  14. Progress of peripheral nerve repair

    Institute of Scientific and Technical Information of China (English)

    陈峥嵘

    2002-01-01

    Study on repair of peripheral nerve injury has been proceeding over a long period of time. With the use of microsurgery technique since 1960s,the quality of nerve repair has been greatly improved. In the past 40 years, with the continuous increase of surgical repair methods, more progress has been made on the basic research of peripheral nerve repair.

  15. Achilles tendon repair

    Science.gov (United States)

    Achilles tendon rupture-surgery; Percutaneous Achilles tendon rupture repair ... To fix your torn Achilles tendon, the surgeon will: Make a cut down the back of your heel Make several small cuts rather than one large cut ...

  16. Diaphragmatic hernia repair - slideshow

    Science.gov (United States)

    ... presentations/100014.htm Diaphragmatic hernia repair - series—Normal anatomy To use the sharing ... Overview The chest cavity includes the heart and lungs. The abdominal cavity includes the liver, the stomach, ...

  17. Eye muscle repair - slideshow

    Science.gov (United States)

    ... page: //medlineplus.gov/ency/presentations/100062.htm Eye muscle repair - series—Normal anatomy To use the sharing ... the eyeball to the eye socket. The external muscles of the eye are found behind the conjunctiva. ...

  18. Tracheoesophageal fistula repair - slideshow

    Science.gov (United States)

    ... page: //medlineplus.gov/ency/presentations/100103.htm Tracheoesophageal fistula repair - series—Normal anatomy To use the sharing ... Editorial team. Related MedlinePlus Health Topics Esophagus Disorders Fistulas Tracheal Disorders A.D.A.M., Inc. is ...

  19. Inguinal hernia repair - slideshow

    Science.gov (United States)

    ... page: //medlineplus.gov/ency/presentations/100027.htm Inguinal hernia repair - series—Normal anatomy To use the sharing ... to slide 4 out of 4 Overview A hernia occurs when part of an organ protrudes through ...

  20. INTERNAL REPAIR OF PIPELINES

    Energy Technology Data Exchange (ETDEWEB)

    Robin Gordon; Bill Bruce; Ian Harris; Dennis Harwig; Nancy Porter; Mike Sullivan; Chris Neary

    2004-04-12

    The two broad categories of deposited weld metal repair and fiber-reinforced composite liner repair technologies were reviewed for potential application for internal repair of gas transmission pipelines. Both are used to some extent for other applications and could be further developed for internal, local, structural repair of gas transmission pipelines. Preliminary test programs were developed for both deposited weld metal repair and for fiber-reinforced composite liner repair. Evaluation trials have been conducted using a modified fiber-reinforced composite liner provided by RolaTube and pipe sections without liners. All pipe section specimens failed in areas of simulated damage. Pipe sections containing fiber-reinforced composite liners failed at pressures marginally greater than the pipe sections without liners. The next step is to evaluate a liner material with a modulus of elasticity approximately 95% of the modulus of elasticity for steel. Preliminary welding parameters were developed for deposited weld metal repair in preparation of the receipt of Pacific Gas & Electric's internal pipeline welding repair system (that was designed specifically for 559 mm (22 in.) diameter pipe) and the receipt of 559 mm (22 in.) pipe sections from Panhandle Eastern. The next steps are to transfer welding parameters to the PG&E system and to pressure test repaired pipe sections to failure. A survey of pipeline operators was conducted to better understand the needs and performance requirements of the natural gas transmission industry regarding internal repair. Completed surveys contained the following principal conclusions: (1) Use of internal weld repair is most attractive for river crossings, under other bodies of water, in difficult soil conditions, under highways, under congested intersections, and under railway crossings. (2) Internal pipe repair offers a strong potential advantage to the high cost of horizontal direct drilling (HDD) when a new bore must be created

  1. Pectus excavatum repair - slideshow

    Science.gov (United States)

    ... this page: //medlineplus.gov/ency/presentations/100035.htm Pectus excavatum repair - series—Normal anatomy To use the sharing ... Go to slide 4 out of 4 Overview Pectus excavatum is a deformity of the front of the ...

  2. Hiatal hernia repair - slideshow

    Science.gov (United States)

    ... presentations/100028.htm Hiatal hernia repair - series—Normal anatomy To use the sharing features on ... Overview The esophagus runs through the diaphragm to the stomach. It functions to carry food from the mouth ...

  3. Repairing ceramic insulating tiles

    Science.gov (United States)

    Dunn, B. R.; Laymance, E. L.

    1980-01-01

    Fused-silica tiles containing large voids or gauges are repaired without adhesives by plug insertion method. Tiles are useful in conduits for high-temperature gases, in furnaces, and in other applications involving heat insulation.

  4. Rotator cuff repair - slideshow

    Science.gov (United States)

    ... this page: //medlineplus.gov/ency/presentations/100229.htm Rotator cuff repair - series—Normal anatomy To use the sharing ... to slide 4 out of 4 Overview The rotator cuff is a group of muscles and tendons that ...

  5. Cleft lip repair - slideshow

    Science.gov (United States)

    ... this page: //medlineplus.gov/ency/presentations/100010.htm Cleft lip repair - series—Normal anatomy To use the sharing ... abnormal opening in the middle of the upper lip. A cleft palate is an opening in the roof of ...

  6. Grey Repairable System Analysis

    Institute of Scientific and Technical Information of China (English)

    Renkuan Guo; Charles Ernie Love

    2006-01-01

    In this paper, we systematically discuss the basic concepts of grey theory, particularly the grey differential equation and its mathematical foundation, which is essentially unknown in the reliability engineering community. Accordingly,we propose a small-sample based approach to estimate repair improvement effects by partitioning system stopping times into intrinsic functioning times and repair improvement times. An industrial data set is used for illustrative purposes in a stepwise manner.

  7. Early resistance change and stress/electromigrationmodeling in aluminium interconnects

    NARCIS (Netherlands)

    Petrescu, V.; Mouthaan, A.J.; Schoenmaker, W.

    1997-01-01

    A complete description for early resistance change and two dimensional simulation of mechanical stress evolution in confined Al interconnects, related to the electromigration, is given in this paper. The model, combines the stress/ vacancy concentration evolution with the early resistance change of

  8. Fast wafer-level detection and control of interconnect reliability

    Science.gov (United States)

    Foley, Sean; Molyneaux, James; Mathewson, Alan

    2000-08-01

    Many of the technological advances in the semiconductor industry have led to dramatic increases in device density and performance in conjunction with enhanced circuit reliability. As reliability is improved, the time taken to characterize particular failure modes with traditional test methods is getting substantially longer. Furthermore, semiconductor customers expect low product cost and fast time-to-market. The limits of traditional reliability testing philosophies are being reached and new approaches need to be investigated to enable the next generation of highly reliable products to be tested. This is especially true in the area of IC interconnect, where significant challenges are predicted for the next decade. A number of fast, wafer level test methods exist for interconnect reliability evaluation. The relative abilities of four such methods to detect the quality and reliability of IC interconnect over very short test times are evaluated in this work. Four different test structure designs are also evaluated and the results are bench-marked against conventional package level Median Time to Failure results. The Isothermal test method combine with SWEAT-type test structures is shown to be the most suitable combination for defect detection and interconnect reliability control over very short test times.

  9. 100 GHz Externally Modulated Laser for Optical Interconnects Applications

    DEFF Research Database (Denmark)

    Ozolins, Oskars; Pang, Xiaodan; Iglesias Olmedo, Miguel

    2017-01-01

    We report on a 116 Gb/s on-off keying (OOK), four pulse amplitude modulation (PAM) and 105-Gb/s 8-PAM optical transmitter using an InP-based integrated and packaged externally modulated laser for high-speed optical interconnects with up to 30 dB static extinction ratio and over 100-GHz 3-d...

  10. Toward Interpreting Failure in Sintered-Silver Interconnection Systems

    Energy Technology Data Exchange (ETDEWEB)

    Wereszczak, Andrew A [ORNL; Waters, Shirley B [ORNL

    2016-01-01

    The mechanical strength and subsequent reliability of a sintered-silver interconnection system is a function of numerous independent parameters. That system is still undergoing process development. Most of those parameters (e.g., choice of plating) are arguably and unfortunately taken for granted and are independent of the silver s cohesive strength. To explore such effects, shear strength testing and failure analyses were completed on a simple, mock sintered-silver interconnection system consisting of bonding two DBC ceramic substrates. Silver and gold platings were part of the test matrix, as was pre-drying strategies, and the consideration of stencil-printing vs. screen-printing. Shear strength of sintered-silver interconnect systems was found to be was insensitive to the choice of plating, drying practice, and printing method provided careful and consistent processing of the sintered-silver are practiced. But if the service stress in sintered silver interconnect systems is anticipated to exceed ~ 60 MPa, then the system will likely fail.

  11. Democracy and Spiritual Awareness: Interconnections and Implications for Educational Leadership

    Science.gov (United States)

    Woods, Glenys J.; Woods, Philip A.

    2008-01-01

    This article sets out theorisations of developmental democracy and spiritual awareness formulated in previous work by the authors. These are used to explore collegial leadership in a case study Steiner school, with the aim of illuminating and illustrating the transformative demands of developmental democracy and its interconnection with spiritual…

  12. Parallel optical interconnects - Implementation of optoelectronics in multiprocessor architectures

    Science.gov (United States)

    Frietman, E. E. E.; Dekker, L.; van Nifterick, W.; Jongeling, T. J. M.

    1990-03-01

    Optoelectronic logic element circuitries are described which can be used for the implementation of a wide variety of interconnection schemes. Particular attention is given to the design, construction, and application of an electrooptic communication system (EOCS) using dedicated free space multiple data distributors and integrated optically writable input buffer arrays with fully parallel access. Some experimental results obtained on the complete EOCS are presented.

  13. Integrated interconnect technologies for 3D nanoelectronic systems

    CERN Document Server

    Bakir, Muhannad S

    2008-01-01

    This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source.

  14. Interconnecting Microgrids via the Energy Router with Smart Energy Management

    Directory of Open Access Journals (Sweden)

    Yingshu Liu

    2017-08-01

    Full Text Available A novel and flexible interconnecting framework for microgrids and corresponding energy management strategies are presented, in response to the situation of increasing renewable-energy penetration and the need to alleviate dependency on energy storage equipment. The key idea is to establish complementary energy exchange between adjacent microgrids through a multiport electrical energy router, according to the consideration that adjacent microgrids may differ substantially in terms of their patterns of energy production and consumption, which can be utilized to compensate for each other’s instant energy deficit. Based on multiport bidirectional voltage source converters (VSCs and a shared direct current (DC power line, the energy router serves as an energy hub, and enables flexible energy flow among the adjacent microgrids and the main grid. The analytical model is established for the whole system, including the energy router, the interconnected microgrids and the main grid. Various operational modes of the interconnected microgrids, facilitated by the energy router, are analyzed, and the corresponding control strategies are developed. Simulations are carried out on the Matlab/Simulink platform, and the results have demonstrated the validity and reliability of the idea for microgrid interconnection as well as the corresponding control strategies for flexible energy flow.

  15. Novel interconnect methodologies for ultra-thin chips on foils

    NARCIS (Netherlands)

    Sridhar, A.; Cauwe, M.; Fledderus, H.; Kusters, R.H.L.; Brand, J. van den

    2012-01-01

    Reliable interconnection technology is key to the realization of reliable hybrid microelectronic systems that combine printed electronics and silicon technology. Flexible hybrid electronic systems-in-foil (SiF) that are typically suited for roll-to-roll (R2R) manufacturing place additional requireme

  16. On the Computation of Lyapunov Functions for Interconnected Systems

    DEFF Research Database (Denmark)

    Sloth, Christoffer

    2016-01-01

    This paper addresses the computation of additively separable Lyapunov functions for interconnected systems. The presented results can be applied to reduce the complexity of the computations associated with stability analysis of large scale systems. We provide a necessary and sufficient condition...

  17. Bandwidth Analysis of Functional Interconnects Used as Test Access Mechanism

    NARCIS (Netherlands)

    Van den Berg, A.; Ren, P.; Marinissen, E.J.; Gaydadjiev, G.; Goossens, K.

    2010-01-01

    Test data travels through a System on Chip (SOC) from the chip pins to the Core-Under-Test (CUT) and vice versa via a Test Access Mechanism (TAM). Conventionally, a TAM is implemented using dedicated communication infrastructure. However, also existing functional interconnect, such as a bus or Netwo

  18. Additive interconnect fabrication by picosecond Laser Induced Forward Transfer

    NARCIS (Netherlands)

    Oosterhuis, G.; Veld, B.H. in 't; Ebberink, G.; Del Cerro, D.A.; Eijnden, E. van den; Chall, P.; Zon, B. van der

    2010-01-01

    Laser Induced Forward Transfer (LIFT) is a single step, dry deposition process which shows great potential for interconnect fabrication. TNO, in cooperation with ALSI and University of Twente have studied the feature size and resistivity of copper structures deposited using picosecond (ps) LIFT. Sma

  19. Use of Fiber Optic Interconnects for Signal Integrity

    Science.gov (United States)

    Phal, Yamuna D.; Phal, Deovrat D.

    2016-05-01

    Signal integrity (SI) is always a concern when it comes to high-speed data transmission. Even in space, there is a need for high-speed data transmission such as in the communication systems, monitoring various sub- systems and for other on-board experiments and applications.From Electromagneticperspective, using fiber-optic interconnect is highly recommended to avoid interference issues. This field has been explored for quite some time now, but mostly limited to applications that are on earth. Using these interconnects for harsh and extreme environments i.e. in space, requires reliability and ruggedness of interconnects and the system.This study suggests methods for optical fiber based communication systems for internal unit communication, communication within various instruments, as well as inter-board communication. A conclusion in terms of what areas need to be explored for enabling high-speed data transmission for space applications would be discussed in details. This study also explores and compares the existing technologies in the fiber-optic interconnects for space applications.

  20. Cascaded wavelength division multiplexing for byte-wide optical interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Deri, R. J.; Garrett, H. E.; Germelos, S.; Haigh,R. E.; Henderer, B. D.; Lowry, M. E.; Walker, J.D.

    1997-11-17

    We demonstrate a wavelength division multiplexing approach for byte-wide optical interconnects over multimode fiber optic ribbon cable using filters based on common plastic ferrules. A dual wavelength link with eight cascaded filter stages exhibits bit error rates {le}l0{sup -l4}.

  1. Ultra-Stretchable Interconnects for High-Density Stretchable Electronics

    Directory of Open Access Journals (Sweden)

    Salman Shafqat

    2017-09-01

    Full Text Available The exciting field of stretchable electronics (SE promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for proven standardized (complementary metal-oxide semiconductor (CMOS-type process recipes using bulk integrated circuit (IC microfabrication tools and fine-pitch photolithography patterning. Here, we address this combined challenge of microfabrication with extreme stretchability for high-density SE devices by introducing CMOS-enabled, free-standing, miniaturized interconnect structures that fully exploit their 3D kinematic freedom through an interplay of buckling, torsion, and bending to maximize stretchability. Integration with standard CMOS-type batch processing is assured by utilizing the Flex-to-Rigid (F2R post-processing technology to make the back-end-of-line interconnect structures free-standing, thus enabling the routine microfabrication of highly-stretchable interconnects. The performance and reproducibility of these free-standing structures is promising: an elastic stretch beyond 2000% and ultimate (plastic stretch beyond 3000%, with <0.3% resistance change, and >10 million cycles at 1000% stretch with <1% resistance change. This generic technology provides a new route to exciting highly-stretchable miniature devices.

  2. Additive interconnect fabrication by picosecond Laser Induced Forward Transfer

    NARCIS (Netherlands)

    Oosterhuis, G.; Veld, B.H. in 't; Ebberink, G.; Del Cerro, D.A.; Eijnden, E. van den; Chall, P.; Zon, B. van der

    2010-01-01

    Laser Induced Forward Transfer (LIFT) is a single step, dry deposition process which shows great potential for interconnect fabrication. TNO, in cooperation with ALSI and University of Twente have studied the feature size and resistivity of copper structures deposited using picosecond (ps) LIFT. Sma

  3. Interconnects and On-Chip Data Communication Techniques

    NARCIS (Netherlands)

    Mensink, E.; Schinkel, Daniel; Klumperink, Eric A.M.; van Tuijl, Adrianus Johannes Maria

    Global on-chip communication is rapidly becoming a speed and power bottleneck in CMOS circuits. In this paper, a ‘mixed-signal’ approach is taken to analyze on-chip interconnects and it is investigated how data-rates can be improved. It is shown that complex signaling schemes such as OFDM and CDMA

  4. Two Component Injection Moulding for Moulded Interconnect Devices

    DEFF Research Database (Denmark)

    Islam, Aminul

    The moulded interconnect devices (MIDs) contain huge possibilities for many applications in micro electro-mechanical-systems because of their potential in reducing the number of components, process steps and finally in miniaturization of the product. Among the available MID process chains, two...

  5. 78 FR 14532 - Small Generator Interconnection Agreements and Procedures; Workshop

    Science.gov (United States)

    2013-03-06

    ...,049 (2013), 78 FR 7524 (2013). This workshop is not intended to address the substance of any... Energy Regulatory Commission Small Generator Interconnection Agreements and Procedures; Workshop Take... workshop is to discuss certain topics related to the proposals in the Small Generator...

  6. 78 FR 29672 - Small Generator Interconnection Agreements and Procedures

    Science.gov (United States)

    2013-05-21

    ... Federal Register of Friday, February 1, 2013 (78 FR 7524). The regulations revised the pro forma Small....'' In FR Doc. 2013-01366 appearing on page 7523 in the Federal Register of Friday, February 1, 2013, the... Energy Regulatory Commission 18 CFR Part 35 Small Generator Interconnection Agreements and...

  7. Crosstalk in dynamic optical interconnects in photorefractive crystals

    DEFF Research Database (Denmark)

    Andersen, Peter E.; Petersen, Paul Michael; Buchhave, Preben

    1994-01-01

    We have investigated the crosstalk between two neighboring gratings in photorefractive Bi12SiO20 optical interconnects. The gratings are induced by the interference between one reference beam and two object beams. By applying a suitable phase shift in one of the object beams, we can selectively...

  8. Optical interconnection networks for high-performance computing systems.

    Science.gov (United States)

    Biberman, Aleksandr; Bergman, Keren

    2012-04-01

    Enabled by silicon photonic technology, optical interconnection networks have the potential to be a key disruptive technology in computing and communication industries. The enduring pursuit of performance gains in computing, combined with stringent power constraints, has fostered the ever-growing computational parallelism associated with chip multiprocessors, memory systems, high-performance computing systems and data centers. Sustaining these parallelism growths introduces unique challenges for on- and off-chip communications, shifting the focus toward novel and fundamentally different communication approaches. Chip-scale photonic interconnection networks, enabled by high-performance silicon photonic devices, offer unprecedented bandwidth scalability with reduced power consumption. We demonstrate that the silicon photonic platforms have already produced all the high-performance photonic devices required to realize these types of networks. Through extensive empirical characterization in much of our work, we demonstrate such feasibility of waveguides, modulators, switches and photodetectors. We also demonstrate systems that simultaneously combine many functionalities to achieve more complex building blocks. We propose novel silicon photonic devices, subsystems, network topologies and architectures to enable unprecedented performance of these photonic interconnection networks. Furthermore, the advantages of photonic interconnection networks extend far beyond the chip, offering advanced communication environments for memory systems, high-performance computing systems, and data centers.

  9. Process chains for the manufacturing of moulded interconnect devices

    DEFF Research Database (Denmark)

    Islam, Mohammad Aminul; Hansen, Hans Nørgaard; Tang, Peter Torben

    2009-01-01

    Moulded interconnect device (MID) can be defined as an injection-molded plastic part that incorporates both electrical and mechanical functionalities in a single device. It is a relatively new area with enormous potential for industrial applications. At present, there are a number of available pr...

  10. An Intra-Server Interconnect Fabric for Heterogeneous Computing

    Institute of Scientific and Technical Information of China (English)

    曹政; 刘小丽; 李强; 刘小兵; 王展; 安学军

    2014-01-01

    With the increasing diversity of application needs and computing units, the server with heterogeneous pro-cessors is more and more widespread. However, conventional SMP/ccNUMA server architecture introduces communication bottleneck between heterogeneous processors and only uses heterogeneous processors as coprocessors, which limits the efficiency and flexibility of using heterogeneous processors. To solve this problem, this paper proposes an intra-server inter-connect fabric that supports both intra-server peer-to-peer interconnection and I/O resource sharing among heterogeneous processors. By connecting processors and I/O devices with the proposed fabric, heterogeneous processors can perform direct communication with each other and run in stand-alone mode with shared intra-server resources. We design the proposed fabric by extending the de-facto system I/O bus protocol PCIe (Peripheral Computer Interconnect Express) and implement it with a single chip cZodiac. By making full use of PCIe’s original advantages, the interconnection and the I/O sharing mechanism are light weight and efficient. Evaluations that have been carried out on both the FPGA (Field Programmable Gate Array) prototype and the cycle-accurate simulator demonstrate that our design is feasible and scalable. In addition, our design is suitable for not only the heterogeneous server but also the high density server.

  11. At the speed of light? electricity interconnections for Europe

    Energy Technology Data Exchange (ETDEWEB)

    Nies, S.

    2010-07-01

    Electricity moves almost at the speed of light: 273,000 km per second. The speed of electricity makes it the ultimate 'just in time' commodity. A problem anywhere can be transmitted every where in a nanosecond. Electricity interconnection is a prominent issue in the news, sometimes even featured as a panacea for the shortcomings of the European electricity market - a panacea that will ensure security o supply, solidarity and pave the way for a promising use of renewables in the future. The present study is devoted to electricity interconnections in Europe, their current state and the projects concerning them. The study addresses the following questions: - What is the role of interconnections in the development of a sustainable grid that can emerge from the existing pieces, make optimum use of existing generation capacity, ensure energy security, and offer economies of scales? What is their role in the process of building a different energy concept, one that would be concerned with climate change and thus in favour of the use of renewables? - How are existing interconnections exploited and governed, and how can their exploitation be improved? Does the EU need more and new interconnections; and if so, where and why, and who is going to finance them? Prominent projects as such as Desertec, the debate on DC or AC lines, or the limits of synchronization, as well as the state of a potential East-West electricity linkage between Former Soviet Union and EU, termed UCTE-UPS/IPS, are discussed in the volume. Part I develops definitions and basic notions necessary for the understanding of the subject. It also addresses the independent variables that influence interconnections (here the dependent variable), and recounts the historical legacies and their enduring impact on today's grid. Part II is devoted to the EU legal framework and to the complex landscape of governance and its current state of transition. Part III addresses the management of existing

  12. Compact models for nanophotonic structures and on-chip interconnects

    Science.gov (United States)

    Alam, Mehboob

    Over the last few years, scaling in deep submicron technologies has shifted the paradigm from device-dominated to interconnect-dominated design methodology. Consequently, there is an increasing interest towards the miniaturization of the guiding medium in nanoscale integrated circuits by exploring plasmon-based waveguides to alleviate the scaling issues associated with today's copper interconnect. In this thesis, we seek short and long-term solutions of on-chip interconnect by developing accurate compact models of on-chip interconnects and impedance characterization of nanophotonic structures. The developed system models are compact and accurate over the operating frequency range and the adopted approach have provided many critical insights and produced many important results. This thesis first presents a new modeling strategy that represents the nanostructure by its equivalent impedance. By applying either quasistatic approximation or separately solving for voltage and current for dominant mode, we reduce the field problem to a circuit problem. The impedance expressed in terms of circuit components is dependent on the material constant as well as the operating frequency. The modeling methodology is successfully applied to nanoparticles and oscillating nanosphere. The proposed model characterizes plasmon resonance in these nanostructures, thereby providing basic building block to develop spice models of complex plasmon-based waveguide for sub-wavelength propagation. We also presented several techniques to develop compact models of on-chip interconnects and passive components for accurate estimation of power, noise and delay of high speed integrated circuits. The automated method generates reduced order models that are accurate across either a narrow or a wide-range of frequencies. The proposed methods are based on Krylov subspace method with interpolation points dynamically selected using either spline based algorithm or discrete wavelet transform. Narrow and

  13. Fatigue properties of Graphene interconnects on flexible substrates

    Science.gov (United States)

    Paradee, Gary

    This thesis represents the first determination of the fatigue behavior of Graphene as interconnect material electronic components on flexible substrates. The potential application of this interconnect material is for displays on flexible substrates where fatigue resistance is required due to the stress placed on the interconnect during mechanical bending. As the display is cyclically deformed (fatigued) during normal operation, cracks in the interconnect layer initiate and propagate leading to the lineout failure condition. The major contribution of this work is to show that Graphene is a superior interconnect material to the present state of the art Indium Tin Oxide (ITO) due to its electrical, optical and mechanical properties. The experimental approach in this thesis is based on Graphene samples which were fabricated on Silicon Nitrite (Si3N4)/Polyethylene Naphthalate (PEN) substrates. For comparison, both patterned and uniform ITO films ITO films on Si3N4/PEN were fabricated. The results of the in-depth characterization of Graphene are reported and based on Atomic Force Microscopy (AFM), Raman Spectroscopy and Scanning Electron Microscopy (SEM) are reported. The fatigue characteristics of ITO were determined at stress amplitudes ranging from 2000 MPa to 400 MPa up to 5000 cycles. The fatigue characteristics of Graphene were determined at stress amplitudes ranging from 80 GPa to 40 GPa up to 5000 cycles. The fatigue S-N curves were determined and showed that Graphene's endurance limit is 40 GPa. Beyond the endurance limit, there is no observable high cycle or low cycle fatigue indication for Graphene on a flexible substrate such as PEN. The microstructural analysis by SEM and AFM did not reveal normal fatigue crack growth and propagation. This thesis presents the first comprehensive behavior of Graphene in a bending fatigue stress environment present in numerous flexible electronic applications. The design and stress environments for safe operation has been

  14. Metal Interconnects for Solid Oxide Fuel Cell Power Systems

    Energy Technology Data Exchange (ETDEWEB)

    S. Elangovan

    2006-04-01

    Interconnect development is identified by the US Department of energy as a key technical area requiring focused research to meet the performance and cost goals under the Solid State Energy Conversion Alliance initiative. In the Phase I SECA Core Technology Program, Ceramatec investigated a commercial ferritic stainless steel composition for oxidation resistance properties by measuring the weight gain when exposed to air at the fuel cell operating temperature. A pre-treatment process that results in a dense, adherent scale was found to reduce the oxide scale growth rate significantly. A process for coating the surface of the alloy in order to reduce the in-plane resistance and potentially inhibit chromium oxide evaporation was also identified. The combination of treatments provided a very low resistance through the scale. The resistance measured was as low as 10 milliohm-cm2 at 750 C in air. The oxide scale was also found to be stable in humidified air at 750 C. The resistance value was stable over several thermal cycles. A similar treatment and coating for the fuel side of the interconnect also showed an exceptionally low resistance of one milliohm-cm2 in humidified hydrogen at 750 c, and was stable through multiple thermal cycles. Measurement of interconnect resistance when it was exposed to both air and humidified hydrogen on opposite sides also showed low, stable resistance after additional modification to the pre-treatment process. Resistance stacks, using an interconnect stack with realistic gas flows, also provided favorable results. Chromium evaporation issue however requires testing of fuel stacks and was outside of the scope of this project. based on results to-date, the alloy selection and the treatment processes appear to be well suited for SOFC interconnect application.

  15. Role of bone marrow macrophages in controlling homeostasis and repair in bone and bone marrow niches.

    Science.gov (United States)

    Kaur, Simranpreet; Raggatt, Liza Jane; Batoon, Lena; Hume, David Arthur; Levesque, Jean-Pierre; Pettit, Allison Robyn

    2017-01-01

    Macrophages, named for their phagocytic ability, participate in homeostasis, tissue regeneration and inflammatory responses. Bone and adjacent marrow contain multiple functionally unique resident tissue macrophage subsets which maintain and regulate anatomically distinct niche environments within these interconnected tissues. Three subsets of bone-bone marrow resident tissue macrophages have been characterised; erythroblastic island macrophages, haematopoietic stem cell niche macrophages and osteal macrophages. The role of these macrophages in controlling homeostasis and repair in bone and bone marrow niches is reviewed in detail.

  16. 76 FR 45248 - PJM Interconnection, L.L.C., PJM Power Providers Group v. PJM Interconnection, L.L.C...

    Science.gov (United States)

    2011-07-28

    ... Energy Regulatory Commission PJM Interconnection, L.L.C., PJM Power Providers Group v. PJM... Load Group, PJM Power Providers Group, and PSEG Companies. All interested parties are invited to attend... Load Group Dr. Roy Shanker, Consultant, PJM Power Providers Group Dr. William Hogan, Professor,...

  17. 78 FR 73112 - Monitoring System Conditions-Transmission Operations Reliability Standards; Interconnection...

    Science.gov (United States)

    2013-12-05

    ..., performance, and maintenance of real-time monitoring and analysis capabilities for reliability coordinators... Reliability Standards; Interconnection Reliability Operations and Coordination Reliability Standards AGENCY... Transmission Operations and Interconnection Reliability Operations and Coordination Reliability Standards...

  18. 76 FR 16240 - Mandatory Reliability Standards for Interconnection Reliability Operating Limits

    Science.gov (United States)

    2011-03-23

    ... Reliability Operating Limits AGENCY: Federal Energy Regulatory Commission, DOE. ACTION: Final rule. SUMMARY... instances of exceeding Interconnection Reliability. Operating Limits. The Commission also approves the... system operating limits other than interconnection reliability operating limits. DATES: Effective...

  19. 77 FR 6110 - Bishop Hill Interconnection LLC; Supplemental Notice that Initial Market-Based Rate Filing...

    Science.gov (United States)

    2012-02-07

    ... From the Federal Register Online via the Government Publishing Office DEPARTMENT OF ENERGY Federal Energy Regulatory Commission Bishop Hill Interconnection LLC; Supplemental Notice that Initial Market... in the above-referenced proceeding of Bishop Hill Interconnection LLC's application for...

  20. 75 FR 12536 - Midwest Independent Transmission System Operator, Inc. Complainant v PJM Interconnection, LLC...

    Science.gov (United States)

    2010-03-16

    ... Interconnection, LLC Respondent; Notice of Complaint March 9, 2010. Take notice that on March 8, 2010, pursuant to... System Operator, Inc. (Complainant) filed a formal complaint against PJM Interconnection, LLC...

  1. 77 FR 5008 - Minco Wind Interconnection Services, LLC; Supplemental Notice That Initial Market-Based Rate...

    Science.gov (United States)

    2012-02-01

    ... From the Federal Register Online via the Government Publishing Office DEPARTMENT OF ENERGY Federal Energy Regulatory Commission Minco Wind Interconnection Services, LLC; Supplemental Notice That Initial... notice in the above-referenced proceeding of Minco Wind Interconnection Services, LLC's application...

  2. 75 FR 32458 - Virginia Electric and Power Company v. PJM Interconnection, LLC; Notice of Complaint

    Science.gov (United States)

    2010-06-08

    ... From the Federal Register Online via the Government Publishing Office DEPARTMENT OF ENERGY Federal Energy Regulatory Commission Virginia Electric and Power Company v. PJM Interconnection, LLC; Notice of... Power Company (Complainant) filed a formal complaint against PJM Interconnection, LLC...

  3. 75 FR 12535 - Midwest Independent Transmission System Operator, Inc., Complainant v. PJM Interconnection, LLC...

    Science.gov (United States)

    2010-03-16

    ... Interconnection, LLC Respondent; Notice of Complaint March 9, 2010. Take notice that on March 8, 2010, pursuant to... complaint against PJM Interconnection, LLC (Respondent) alleging that the Respondent is in violation of...

  4. 78 FR 69664 - Notice of Intent To Prepare a Supplemental Draft Environmental Impact Statement-Interconnection...

    Science.gov (United States)

    2013-11-20

    ... Statement--Interconnection of the Proposed Wilton IV Wind Energy Center Project, North Dakota (DOE/EIS-0469...), intends to prepare a Supplemental Draft Environmental Impact Statement (SDEIS) for the interconnection...

  5. Detecting and Correcting Speech Repairs

    CERN Document Server

    Heeman, P A; Heeman, Peter; Allen, James

    1994-01-01

    Interactive spoken dialog provides many new challenges for spoken language systems. One of the most critical is the prevalence of speech repairs. This paper presents an algorithm that detects and corrects speech repairs based on finding the repair pattern. The repair pattern is built by finding word matches and word replacements, and identifying fragments and editing terms. Rather than using a set of prebuilt templates, we build the pattern on the fly. In a fair test, our method, when combined with a statistical model to filter possible repairs, was successful at detecting and correcting 80\\% of the repairs, without using prosodic information or a parser.

  6. CRISIS AND THE INTERCONNECTIONS BETWEEN WORLD’S ECONOMIES

    Directory of Open Access Journals (Sweden)

    Emilia Ungureanu

    2010-12-01

    Full Text Available This paper has like primary objective to present the crisis that hit the global economy since 1929 and the interconnections between different regions and countries. We will present also the big financial crisis that struck countries all around the world in the 21 century and the effects on the Romanian Economy. Each time when a develop country has passed through a turning point (crisis, even if the determinant factors were of a different nature, this thing led to a negative influence of the countries from the region and not only, showing by this the strong existing interconnection between the countries of the modern world (Asian crisis example, and especially the big financial crisis of the 21 century.

  7. Monolithic interconnected modules (MIMs) for thermophotovoltaic energy conversion

    Science.gov (United States)

    Wilt, David; Wehrer, Rebecca; Palmisiano, Marc; Wanlass, Mark; Murray, Christopher

    2003-05-01

    Monolithic interconnected modules (MIMs) are under development for thermophotovoltaic (TPV) energy conversion applications. MIM devices are typified by series-interconnected photovoltaic cells on a common, semi-insulating substrate and generally include rear-surface infrared (IR) reflectors. The MIM architecture is being implemented in InGaAsSb materials without semi-insulating substrates through the development of alternative isolation methodologies. Motivations for developing the MIM structure include: reduced resistive losses, higher output power density than for systems utilizing front surface spectral control, improved thermal coupling and ultimately higher system efficiency. Numerous design and material changes have been investigated since the introduction of the MIM concept in 1994. These developments as well as the current design strategies are addressed.

  8. Advanced Modulation Techniques for High-Performance Computing Optical Interconnects

    DEFF Research Database (Denmark)

    Karinou, Fotini; Borkowski, Robert; Zibar, Darko

    2013-01-01

    We experimentally assess the performance of a 64 × 64 optical switch fabric used for ns-speed optical cell switching in supercomputer optical interconnects. More specifically, we study four alternative modulation formats and detection schemes, namely, 10-Gb/s nonreturn-to-zero differential phase......-shift keying with balanced direct detection, 10-Gb/s polarization division multiplexed (PDM) quadrature phase-shift keying, 40-Gb/s single-polarization 16-ary quadrature amplitude modulation (16QAM), and 80-Gb/s PDM-16QAM, with coherent intradyne detection, in conjunction with an optimized version...... of the optical shared memory supercomputer interconnect system switch fabric. In particular, we investigate the resilience of the aforementioned advanced modulation formats to the nonlinearities of semiconductor optical amplifiers, used as ON/OFF gates in the supercomputer optical switch fabric under study...

  9. Fractal Characteristics Analysis of Blackouts in Interconnected Power Grid

    DEFF Research Database (Denmark)

    Wang, Feng; Li, Lijuan; Li, Canbing

    2017-01-01

    The power failure models are a key to understand the mechanism of large scale blackouts. In this letter, the similarity of blackouts in interconnected power grids (IPGs) and their sub-grids is discovered by the fractal characteristics analysis to simplify the failure models of the IPG. The distri......The power failure models are a key to understand the mechanism of large scale blackouts. In this letter, the similarity of blackouts in interconnected power grids (IPGs) and their sub-grids is discovered by the fractal characteristics analysis to simplify the failure models of the IPG....... The distribution characteristics of blackouts in various sub-grids are demonstrated based on the Kolmogorov-Smirnov (KS) test. The fractal dimensions (FDs) of the IPG and its sub-grids are then obtained by using the KS test and the maximum likelihood estimation (MLE). The blackouts data in China were used...

  10. Evaluation of Global Wind Power and Interconnected Wind Farms

    Science.gov (United States)

    Archer, C. L.; Jacobson, M. Z.

    2005-12-01

    The world wind power potential is evaluated in this study. Wind speeds are calculated at 80 m, the hub height of modern, 77-m diameter, 1500 W turbines. Since relatively few observations are available at 80 m, the Least Square extrapolation technique is utilized to obtain estimates of wind speeds at 80 m given observed wind speeds at 10 m (widely available) and a network of sounding stations. Globally, about 13% of all reporting stations experience annual mean wind speeds >= 6.9 m/s at 80 m (i.e., wind power class 3 or greater) and can therefore be considered suitable for low-cost wind power generation. This estimate is believed to be conservative. Of all continents, North America has the largest number of stations in class >= 3 (453). Areas with great potential are found in Northern Europe along the North Sea, the southern tip of the South American continent, the island of Tasmania in Australia, the Great Lakes region, and the northeastern and northwestern coasts of North America. Assuming that statistics generated from all stations analyzed here are representative of the global distribution of winds, global wind power generated at locations with mean annual wind speeds >= 6.9 m/s at 80 m is found to be approximately 72 TW (54,000 Mtoe) for the year 2000. Even if only 20% of this power could be captured, it could satisfy 100% of the world's energy demand for all purposes (6,995-10,177 Mtoe) and over seven times the world electricity needs (1.6-1.8 TW). Several practical barriers need to be overcome to fully realize this potential. Wind intermittency could be perceived as one of them. However, interconnecting wind farms through the transmission grid, also known as distributed wind power, is a simple and effective way of reducing deliverable wind power swings caused by wind intermittency. As more farms are interconnected in an array, wind speed correlation among sites decreases and so does the probability that all sites experience the same wind regime at the same

  11. Prediction of interconnect delay variations using pattern matching

    Science.gov (United States)

    Chin, Eric Y.; Holwill, Juliet A.; Neureuther, Andrew R.

    2007-03-01

    An exploratory Process Variation Net Scanning (PVNS) approach to estimate interconnect delay variations is presented. It is shown that the geometrical response of lithographic nonidealities can be quickly predicted to first order with Pattern Matching. This concept can be extended to other process nonidealities by developing Maximum Lateral Impact Functions to capture the effects of variations in conductor sidewall angle and thickness from etch and CMP processes. The geometrical response for each variation can then be used to model the effective change in resistance and capacitance and perturb the corresponding values in the extracted netlist. The impact of PVNS is demonstrated using a 90nm digital design, and the runtime analysis indicates that this approach may potentially be twice as fast as traditional extraction. This allows for fast electrical analysis of independent process variations on different interconnect layers instead of traditional best and worst case corner analyses.

  12. Exploiting the Capabilities of the Interconnection Network on Dawning-1000

    Institute of Scientific and Technical Information of China (English)

    XIAO Limin; ZHU Mingfa

    1999-01-01

    On Dawning-1000, the two-dimension mesh interconnection network enables low-latency, high-bandwidth communication, however, these capabilities have not been realized because of the high processing overhead imposed by existing communication software. Active Messages provide an efficient communication mechanism with small overhead, which may expose the raw capabilities of the underlying hardware. In addition, one of the most promising techniques, user-level communication, is often used to improve the performance of the traditional protocols such as TCP and UDP, andis also adopted in implementing the novel abstractions like Active Messages. Thus a user-level Active Messages model is designed and implemented on Dawning-1000. Preliminary experiments show that the combination of Active Messages mechanism and user-level communication technique is quite efficient in reducing software overhead associated with sending and receiving messages, and in exploiting the capabilitiesof the interconnection network.

  13. A Prototype Embedded Microprocessor Interconnect for Distributed and Parallel Computing

    Directory of Open Access Journals (Sweden)

    Bryan Hughes

    2008-08-01

    Full Text Available Parallel computing is currently undergoing a transition from a niche use to widespread acceptance due to new, computationally intensive applications and multi-core processors. While parallel processing is an invaluable tool for increasing performance, more time and expertise are required to develop a parallel system than are required for sequential systems. This paper discusses a toolkit currently in development that will simplify both the hardware and software development of embedded distributed and parallel systems. The hardware interconnection mechanism uses the Serial Peripheral Interface as a physical medium and provides routing and management services for the system. The topics in this paper are primarily limited to the interconnection aspect of the toolkit.

  14. Optimal interconnection trees in the plane theory, algorithms and applications

    CERN Document Server

    Brazil, Marcus

    2015-01-01

    This book explores fundamental aspects of geometric network optimisation with applications to a variety of real world problems. It presents, for the first time in the literature, a cohesive mathematical framework within which the properties of such optimal interconnection networks can be understood across a wide range of metrics and cost functions. The book makes use of this mathematical theory to develop efficient algorithms for constructing such networks, with an emphasis on exact solutions.  Marcus Brazil and Martin Zachariasen focus principally on the geometric structure of optimal interconnection networks, also known as Steiner trees, in the plane. They show readers how an understanding of this structure can lead to practical exact algorithms for constructing such trees.  The book also details numerous breakthroughs in this area over the past 20 years, features clearly written proofs, and is supported by 135 colour and 15 black and white figures. It will help graduate students, working mathematicians, ...

  15. Interconnection and Competition Among Asymmetric Networks in the Internet Backbone Market

    NARCIS (Netherlands)

    Jahn, E.; Prüfer, J.

    2006-01-01

    We examine the interrelation between interconnection and competition in the internet backbone market.Networks asymmetric in size choose among different interconnection regimes and compete for end-users.We show that a direct interconnection regime, Peering, softens competition compared to indirect in

  16. Integration of a waveguide self-electrooptic effect device and a vertically coupled interconnect waveguide

    Science.gov (United States)

    Vawter, G. Allen

    2008-02-26

    A self-electrooptic effect device ("SEED") is integrated with waveguide interconnects through the use of vertical directional couplers. Light initially propagating in the interconnect waveguide is vertically coupled to the active waveguide layer of the SEED and, if the SEED is in the transparent state, the light is coupled back to the interconnect waveguide.

  17. 76 FR 45249 - PJM Interconnection, L.L.C.; Supplemental Notice of Staff Technical Conference

    Science.gov (United States)

    2011-07-28

    ... Energy Regulatory Commission PJM Interconnection, L.L.C.; Supplemental Notice of Staff Technical... President--Market Operations and Demand Resources, PJM Interconnection, L.L.C. 11:15 a.m.-11:30 p.m. Break... Interconnection, L.L.C. Robert A. Weishaar, Jr., Counsel to PJM Industrial Customer Coalition, McNees,...

  18. 47 CFR 69.155 - Per-minute residual interconnection charge.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 3 2010-10-01 2010-10-01 false Per-minute residual interconnection charge. 69... Per-minute residual interconnection charge. (a) Local exchange carriers may recover a per-minute residual interconnection charge on originating access. The maximum such charge shall be the lower of:...

  19. 77 FR 34378 - PJM Interconnection, L.L.C.; Notice of Complaint

    Science.gov (United States)

    2012-06-11

    ... Energy Regulatory Commission PJM Interconnection, L.L.C.; Notice of Complaint Take notice that on June 1, 2012, pursuant to section 206 of the Federal Power Act (FPA), 16 U.S.C. 824(e), PJM Interconnection, L... Interconnection L.L.C. (Operating Agreement) to base the calculation of marginal transmission line losses on...

  20. 75 FR 40815 - PJM Interconnection, L.L.C.; Notice of Filing

    Science.gov (United States)

    2010-07-14

    ... Energy Regulatory Commission PJM Interconnection, L.L.C.; Notice of Filing July 7, 2010. Take notice that on July 1, 2010, PJM Interconnection, L.L.C. (PJM) filed revised sheets to Schedule 1 of the Amended and Restated Operating Agreement of PJM Interconnection, L.L.C. (Operating Agreement) and the...

  1. 77 FR 3766 - PJM Interconnection, L.L.C.; Notice of Staff Technical Conference

    Science.gov (United States)

    2012-01-25

    ... Energy Regulatory Commission PJM Interconnection, L.L.C.; Notice of Staff Technical Conference On... explore the issues presented by PJM Interconnection, L.L.C.'s (PJM) filing.\\1\\ Take notice that the... Commission's questions by February 10, 2012. \\1\\ PJM Interconnection, L.L.C., 137 FERC ] 61,204...

  2. 75 FR 22773 - PJM Interconnection, L.L.C.; Notice of Filing

    Science.gov (United States)

    2010-04-30

    ... Energy Regulatory Commission PJM Interconnection, L.L.C.; Notice of Filing April 23, 2010. Take notice that on April 22, 2010, PJM Interconnection, L.L.C. (PJM) filed revised tariff sheets to its Schedule 1... Interconnection, L.L.C., 130 FERC ] 61,230 (2010). Any person desiring to intervene or to protest this filing...

  3. 47 CFR 90.476 - Interconnection of fixed stations and certain mobile stations.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 5 2010-10-01 2010-10-01 false Interconnection of fixed stations and certain... Systems § 90.476 Interconnection of fixed stations and certain mobile stations. (a) Fixed stations and...)(11), 90.35(c)(42), and 90.267 are not subject to the interconnection provisions of §§ 90.477 and...

  4. 78 FR 19259 - Notice of Attendance at PJM Interconnection, L.L.C. Meetings

    Science.gov (United States)

    2013-03-29

    ... Energy Regulatory Commission Notice of Attendance at PJM Interconnection, L.L.C. Meetings The Federal... Commission staff may attend upcoming PJM Interconnection, L.L.C. (PJM) Members Committee and Markets and... Interconnection, L.L.C. Docket No. EL08-14, Black Oak Energy LLC, et al., v. FERC Docket No. EL10-52,...

  5. 76 FR 16405 - Notice of Attendance at PJM INterconnection, L.L.C., Meetings

    Science.gov (United States)

    2011-03-23

    ... Energy Regulatory Commission Notice of Attendance at PJM INterconnection, L.L.C., Meetings The Federal... Commission staff may attend upcoming PJM Interconnection, L.L.C., (PJM) meetings, as well as other... proceedings before the Commission including the following: Docket No. EL05-121, PJM Interconnection,...

  6. 77 FR 24646 - Open Access and Priority Rights on Interconnection Facilities

    Science.gov (United States)

    2012-04-25

    ... Energy Regulatory Commission 18 CFR Part 40 Open Access and Priority Rights on Interconnection Facilities... Inquiry, the Commission seeks comment on open access and priority rights for capacity on interconnection... ] 61,051 Docket Nos. Open Access and Priority Rights on Interconnection AD12-14-000 Facilities...

  7. Groin hernia repair in young males: mesh or sutured repair?

    DEFF Research Database (Denmark)

    Bisgaard, T; Bay-Nielsen, M; Kehlet, H

    2010-01-01

    Large-scale data for the optimal inguinal hernia repair in younger men with an indirect hernia is not available. We analysed nationwide data for risk of reoperation in younger men after a primary repair using a Lichtenstein operation or a conventional non-mesh hernia repair....

  8. Interconnection France-England; Interconnexion France-Angleterre

    Energy Technology Data Exchange (ETDEWEB)

    NONE

    2001-07-01

    These documents defines the interconnection France-England rules for the 2000 MW DC submarine cable directly linking the transmission networks of England and Wales and France. Rights to use Interconnector capacity from 1 April 2001 are to be offered through competitive tenders and auctions, full details of which are set out in the Rules. The contract and a guide to the application form are provided. (A.L.B.)

  9. Nonlinear H∞ filtering for interconnected Markovian jump systems

    Institute of Scientific and Technical Information of China (English)

    Zhang Xiaomei; Zheng Yufan

    2006-01-01

    The problem of nonlinear H∞ filtering for interconnected Markovian jump systems is discussed. The aim of this note is the design of a nonlinear Markovian jump filter such that the resulting error system is exponentially meansquare stable and ensures a prescribed H∞ performance. A sufficient condition for the solvability of this problem is given in terms of linear matrix inequalities(LMIs). A simulation example is presented to demonstrate the effectiveness of the proposed design approach.

  10. A Unified Access Model for Interconnecting Heterogeneous Wireless Networks

    Science.gov (United States)

    2015-05-01

    with each other via a central controller. The 2 access technologies used were 802.11 ( WiFi ) and a Carrier-Sense Multiple Access (CSMA) protocol ...wireless subnets could communicate with each other. 3. Results and Discussion Using the 3-VM LTE/ WiFi configuration, we placed a User Datagram Protocol ...control plane protocols . A network model that can abstract disparate MAC layers in heterogeneous networks and interconnect them using a unified and

  11. Vertically aligned multiwalled carbon nanotubes as electronic interconnects.

    OpenAIRE

    Gopee, Vimal C.

    2017-01-01

    The drive for miniaturisation of electronic circuits provides new materials challenges for the electronics industry. Indeed, the continued downscaling of transistor dimensions, described by Moore’s Law, has led to a race to find suitable replacements for current interconnect materials to replace copper. Carbon nanotubes have been studied as a suitable replacement for copper due to its superior electrical, thermal and mechanical properties. One of the advantages of using carbon nanotubes is th...

  12. Analytical delay models for RLC interconnects under ramp input

    Institute of Scientific and Technical Information of China (English)

    REN Yinglei; MAO Junfa; LI Xiaochun

    2007-01-01

    Analytical delay models for Resistance Inductance Capacitance (RLC)interconnects with ramp input are presented for difierent situations,which include overdamped,underdamped and critical response cases.The errors of delay estimation using the analytical models proposed in this paper are less bv 3%in comparison to the SPICE-computed delay.These models are meaningful for the delay analysis of actual circuits in which the input signal is ramp but not ideal step input.

  13. A 3D bus interconnect for network line cards

    OpenAIRE

    Engel, J; Kocak, T

    2004-01-01

    In this paper, we propose a 3D bus architecture as a processor-memory interconnection system to increase the throughput of the memory system currently used on line cards. The 3D bus architecture allows multiple processing elements on a line card to access a shared memory. The main advantage of the proposed architecture is to increase the network processor off-chip memory bandwidth while diminishing the latency otherwise caused by the single bus competition.

  14. Synthesis of micro-sized interconnected Si-C composites

    Energy Technology Data Exchange (ETDEWEB)

    Wang, Donghai; Yi, Ran; Dai, Fang

    2016-02-23

    Embodiments provide a method of producing micro-sized Si--C composites or doped Si--C and Si alloy-C with interconnected nanoscle Si and C building blocks through converting commercially available SiO.sub.x (0

  15. Performance evaluation of two highly interconnected Data Center networks

    DEFF Research Database (Denmark)

    Andrus, Bogdan-Mihai; Mihai Poncea, Ovidiu; Vegas Olmos, Juan José;

    2015-01-01

    In this paper we present the analysis of highly interconnected topologies like hypercube and torus and how they can be implemented in data centers in order to cope with the rapid increase and demands for performance of the internal traffic. By replicating the topologies and subjecting them...... of the network was increased by a factor of 32. The performance measurements are supported by abstract metrics that also give a cost and complexity indication in choosing the right topology for the required application....

  16. Overvoltages related to distributed generation-power system interconnection transformer

    Energy Technology Data Exchange (ETDEWEB)

    Zamanillo, G.R.; Gomez, J.C.; Florena, E.F. [Rio Cuarto National University (IPSEP/UNRC), Cordoba (Argentina). Electric Power Systems Protection Institute], Email: jcgomez@ing.unrc.edu.ar

    2009-07-01

    The energy crisis that experiences the world drives to carry to an extreme, the use of all energy sources which are available. The sources need to be connected to the electric network in their next point, requiring of electric-electronic interfaces. The traditional electric power systems are changing their characteristics, in what concerns to structure, operation and on overvoltage generation. This change is not taking place in coordinated form among the involved sectors. The interconnection of a Distributed Generator (DG) directly with the power system is objectionable and risky. It is required of an interconnection transformer which performs several functions. Rigid specifications do not exist in this respect, for the variety of systems in use in the world, nevertheless there are utilities recommendations. Overvoltages caused by the DG, which arise due to the change of structure of the electric system, are explained. The transformer connection selection, presents positive and negative aspects that impact the utility and the user in a different or many times in an antagonistic way. The phenomenon of balanced and unbalanced ferroresonance overvoltage is studied. This phenomenon can takes place when using DG, either with synchronous or asynchronous generator, and for any type of connection of the transformer. The necessary conditions so that the phenomenon appears are presented. Eight interconnection transformer connection ways were studied. It is concluded that the solutions to reach by means of the employment of the DG, offer technical-economic advantages so much to the utility as to the user. It is also concluded in this work that the more advisable interconnection type is function of the system connection type. (author)

  17. EUROPEAN ENERGY INTERCONNECTION EFFECTS ON THE ROMANIAN ECONOMY

    Directory of Open Access Journals (Sweden)

    Ionescu Mihaela

    2014-07-01

    Full Text Available In this paper the author wants to exemplify the extent to which economic growth in Romania is influenced by the current power system infrastructure investments in Europe. Electricity transmission infrastructure in Romania is at a turning point. The high level of security of supply, delivery efficiency in a competitive internal market are dependent on significant investment, both within the country and across borders. Since the economic crisis makes investment financing is increasingly difficult, it is necessary that they be targeted as well. The European Union has initiated the “Connecting Europe” through which investments are allocated to European energy network interconnection of energy. The action plan for this strategy will put a greater emphasis on investments that require hundreds of billions of euro in new technologies, infrastructure, improve energy intensity, low carbon energy technologies. Romania's energy challenge will depend on the new interconnection modern and smart, both within the country and other European countries, energy saving practices and technologies. This challenge is particularly important as Romania has recovered severe gaps in the level of economic performance compared to developed countries. Such investment will have a significant impact on transmission costs, especially electricity, while network tariffs will rise slightly. Some costs will be higher due to support programs in renewable energy nationwide.Measures are more economically sustainable to maintain or even reinforce the electricity market, which system can be flexible in order to address any issues of adequacy. These measures include investments in border infrastructure (the higher the network, so it is easier to evenly distribute energy from renewable sources, to measure demand response and energy storage solutions.An integrated European infrastructure will ensure economic growth in countries interconnected and thus Romania. Huge energy potential of

  18. Thin Film Compound Semiconductor Devices for Photonic Interconnects

    Science.gov (United States)

    Calhoun, Kenneth Harold

    The research conducted for this doctoral dissertation involved the experimental investigation of thin film compound devices for use as photonic interconnection components in both external and direct modulated interconnection configurations. The devices were fabricated using a modified epitaxial liftoff procedure developed at Georgia Tech. This technique, by which single crystal semiconductor layers were separated from their growth substrate and subsequently deposited onto host substrates, allowed the development of novel photonic interconnection elements. It also facilitated the investigation of fundamental optical phenomena in compound semiconductors. Specifically, this work focused on an experimental study of the Franz-Keldysh electrorefractive effect in thin film semiconductor structures. This aspect of the research resulted in the first reported direct measurement of electrorefraction in GaAs at large electric fields (10 ^5 V/cm) and at photon energies within several meV of the band edge of GaAs. Related to this effort was the investigation of thin film, surface-normal optical modulators based on the bulk Franz-Keldysh effect. The novel modulators fabricated for this research demonstrated the largest contrast ratios ever reported for surface-normal Franz-Keldysh devices. Further investigation indicated that, with additional optimization, these thin film elements can achieve further improvements in performance. Such devices would present a low cost, easily manufactured alternative to conventional modulators, which are typically quite complex and expensive to fabricate. Finally, as an alternative to externally modulated interconnection schemes, a novel stacked wafer architecture was demonstrated. This configuration, which facilitated through-wafer optical communication, utilized thin film InP/InGaAsP emitters and detectors which were quasi-monolithically integrated onto silicon substrates using the modified epitaxial liftoff process. This through-wafer scheme is

  19. Interconnection of the speech and socio-emotional development

    OpenAIRE

    Gamser, Jana

    2013-01-01

    The following thesis researches the relation between a child's speech and his socio-emotional development and their interconnection. Theoretical part of the paper serves to present some characteristics of development in the childhood stage and the influence of the child's entire life array on it. I continue by exposing important topics within speech and socio-emotional development. First, I present different phases of speech development, the process of acquiring communication skills and d...

  20. Enhancing Ecoefficiency in Shrimp Farming through Interconnected Ponds

    Directory of Open Access Journals (Sweden)

    Ramón Héctor Barraza-Guardado

    2015-01-01

    Full Text Available The future development of shrimp farming needs to improve its ecoefficiency. The purpose of this study was to evaluate water quality, flows, and nitrogen balance and production parameters on a farm with interconnected pond design to improve the efficiency of the semi-intensive culture of Litopenaeus vannamei ponds. The study was conducted in 21 commercial culture ponds during 180 days at densities of 30–35 ind m−2 and daily water exchange <2%. Our study provides evidence that by interconnecting ponds nutrient recycling is favored by promoting the growth of primary producers of the pond as chlorophyll a. Based on the mass balance and flow of nutrients this culture system reduces the flow of solid, particulate organic matter, and nitrogen compounds to the environment and significantly increases the efficiency of water (5 to 6.5 m3 kg−1 cycle−1, when compared with traditional culture systems. With this culture system it is possible to recover up to 34% of the total nitrogen entering the system, with production in excess of 4,000 kg ha−1 shrimp. We believe that the production system with interconnected ponds is a technically feasible model to improve ecoefficiency production of shrimp farming.

  1. Reusable, adhesiveless and arrayed in-plane microfluidic interconnects

    Science.gov (United States)

    Lo, R.; Meng, E.

    2011-05-01

    A reusable, arrayed interconnect capable of providing multiple simultaneous connections to and from a microfluidic device in an in-plane manner without the use of adhesives is presented. This method uses a 'pin-and-socket' design in which an SU-8 anchor houses multiple polydimethysiloxane septa (the socket) that each receive a syringe needle (the pin). A needle array containing multiple commercially available 33G (203 µm outer diameter) needles (up to eight) spaced either 2.54 or 1 mm (center-to-center) pierces the septa to access the microfluidic device interior. Finite element modeling and photoelastic stress experiments were used to determine the stress distribution during needle insertion; these results guided the SU-8 septa housing and septa design. The impact of needle diameter, needle tip style, insertion rate and number of needles on pre-puncture, post-puncture and removal forces was characterized. Pressurized connections to SU-8 channel systems withstood up to 62 kPa of pressurized water and maintained 25 kPa of pressurized water for over 24 h. The successful integration and functionality of the interconnect design with surface micromachined Parylene C microchannels was verified using Rhodamine B dye. Dual septa systems to access a single microchannel were demonstrated. Arrayed interconnects were compatible with integrated microfluidic systems featuring electrochemical sensors and actuators.

  2. Power System Study for Renewable Energy Interconnection in Malaysia

    Science.gov (United States)

    Askar, O. F.; Ramachandaramurthy, V. K.

    2013-06-01

    The renewable energy (RE) sector has grown exponentially in Malaysia with the introduction of the Feed-In-Tariff (FIT) by the Ministry of Energy, Green Technology and Water. Photovoltaic, biogas, biomass and mini hydro are among the renewable energy sources which offer a lucrative tariff to incite developers in taking the green technology route. In order to receive the FIT, a developer is required by the utility company to perform a power system analysis which will determine the technical feasibility of an RE interconnection to the utility company's existing grid system. There are a number of aspects which the analysis looks at, the most important being the load flow and fault levels in the network after the introduction of an RE source. The analysis is done by modelling the utility company's existing network and simulating the network with the interconnection of an RE source. The results are then compared to the values before an interconnection is made as well as ensuring the voltage rise or the increase in fault levels do not violate any pre-existing regulations set by the utility company. This paper will delve into the mechanics of performing a load flow analysis and examining the results obtained.

  3. Method to Determine Maximum Allowable Sinterable Silver Interconnect Size

    Energy Technology Data Exchange (ETDEWEB)

    Wereszczak, A. A.; Modugno, M. C.; Waters, S. B.; DeVoto, D. J.; Paret, P. P.

    2016-05-01

    The use of sintered-silver for large-area interconnection is attractive for some large-area bonding applications in power electronics such as the bonding of metal-clad, electrically-insulating substrates to heat sinks. Arrays of different pad sizes and pad shapes have been considered for such large area bonding; however, rather than arbitrarily choosing their size, it is desirable to use the largest size possible where the onset of interconnect delamination does not occur. If that is achieved, then sintered-silver's high thermal and electrical conductivities can be fully taken advantage of. Toward achieving this, a simple and inexpensive proof test is described to identify the largest achievable interconnect size with sinterable silver. The method's objective is to purposely initiate failure or delamination. Copper and invar (a ferrous-nickel alloy whose coefficient of thermal expansion (CTE) is similar to that of silicon or silicon carbide) disks were used in this study and sinterable silver was used to bond them. As a consequence of the method's execution, delamination occurred in some samples during cooling from the 250 degrees C sintering temperature to room temperature and bonding temperature and from thermal cycling in others. These occurrences and their interpretations highlight the method's utility, and the herein described results are used to speculate how sintered-silver bonding will work with other material combinations.

  4. Improving pore interconnectivity in polymeric scaffolds for tissue engineering.

    Science.gov (United States)

    Aydin, H M; El Haj, A J; Pişkin, E; Yang, Y

    2009-08-01

    A new scaffold fabrication technique aiming to enhance pore interconnectivity for tissue engineering has been developed. Medical grade poly(lactic acid) was utilized to generate scaffolds by a solvent-evaporating/particulate-leaching technique, using a new dual-porogen system. Water-soluble sodium chloride particles were used to control macro-pore size in the range 106-255 microm, while organic naphthalene was utilized as a porogen to increase pore interconnections. The three-dimensional (3D) morphology of the scaffolds manufactured with and without naphthalene was examined by optical coherence tomography and scanning electron microscopy. The mechanical properties of the scaffolds were characterized by compression tests. MG63 osteoblast cells were seeded in the scaffolds to study the cell attachment and viability evaluated by confocal microscopy. It was revealed that introducing naphthalene as the second porogen in the solvent-evaporating/particulate-leaching process resulted in improvement of the pore interconnectivity. Cells grew in both scaffolds fabricated with and without naphthalene. They exhibited strong green fluorescence when using a live/dead fluorescent dye kit, indicating that the naphthalene in the scaffold process did not affect cell viability.

  5. High-bandwidth remote flat panel display interconnect system

    Science.gov (United States)

    Peterson, Darrel G.

    1999-08-01

    High performance electronic displays (CRT, AMLCD, TFEL, plasma, etc.) require wide bandwidth electrical drive signals to produce the desired display images. When the image generation and/or image processing circuitry is located within the same line replaceable unit (LRU) as the display media, the transmission of the display drive signals to the display media presents no unusual design problems. However, many aircraft cockpits are severely constrained for available space behind the instrument panel. This often forces the system designer to specify that only the display media and its immediate support circuitry are to be mounted in the instrument panel. A wide bandwidth interconnect system is then required to transfer image data from the display generation circuitry to the display unit. Image data transfer rates of nearly 1.5 Gbits/second may be required when displaying full motion video at a 60 Hz field rate. In addition to wide bandwidth, this interconnect system must exhibit several additional key characteristics: (1) Lossless transmission of image data; (2) High reliability and high integrity; (3) Ease of installation and field maintenance; (4) High immunity to HIRF and electrical noise; (5) Low EMI emissions; (6) Long term supportability; and (7) Low acquisition and maintenance cost. Rockwell Collins has developed an avionics grade remote display interconnect system based on the American National Standards Institute Fibre Channel standard which meets these requirements. Readily available low cost commercial off the shelf (COTS) components are utilized, and qualification tests have confirmed system performance.

  6. Fabrication of interconnected microporous biomaterials with high hydroxyapatite nanoparticle loading

    Energy Technology Data Exchange (ETDEWEB)

    Zhang Wei; Yao Donggang [School of Polymer Textile and Fiber Engineering, Georgia Institute of Technology, Atlanta, GA (United States); Zhang Qingwei; Lelkes, Peter I [School of Biomedical Engineering, Science, and Health Systems, Drexel University, Philadelphia, PA 19104 (United States); Zhou, Jack G, E-mail: yao@gatech.ed [Department of Mechanical Engineering and Mechanics, Drexel University, Philadelphia, PA 19104 (United States)

    2010-09-15

    Hydroxyapatite (HA) is known to promote osteogenicity and enhance the mechanical properties of biopolymers. However, incorporating a large amount of HA into a porous biopolymer still remains a challenge. In the present work, a new method was developed to produce interconnected microporous poly(glycolic-co-lactic acid) (PLGA) with high HA nanoparticle loading. First, a ternary blend comprising PLGA/PS (polystyrene)/HA (40/40/20 wt%) was prepared by melt blending under conditions for formation of a co-continuous phase structure. Next, a dynamic annealing stage under small-strain oscillation was applied to the blend to facilitate nanoparticle redistribution. Finally, the PS phase was sacrificially extracted, leaving a porous matrix. The results from different characterizations suggested that the applied small-strain oscillation substantially accelerated the migration of HA nanoparticles during annealing from the PS phase to the PLGA phase; nearly all HA particles were uniformly presented in the PLGA phase after a short period of annealing. After dissolution of the PS phase, a PLGA material with interconnected microporous structure was successfully produced, with a high HA loading above 30 wt%. The mechanisms beneath the experimental observations, particularly on the enhanced particle migration process, were discussed, and strategies for producing highly particle loaded biopolymers with interconnected microporous structures were proposed.

  7. Cleft lip and palate repair

    Science.gov (United States)

    ... this page: //medlineplus.gov/ency/article/002979.htm Cleft lip and palate repair To use the sharing features on this page, please enable JavaScript. Cleft lip and cleft palate repair is surgery to fix birth defects ...

  8. Abdominal aortic aneurysm repair - open

    Science.gov (United States)

    ... this page: //medlineplus.gov/ency/article/007392.htm Abdominal aortic aneurysm repair - open To use the sharing features on this page, please enable JavaScript. Open abdominal aortic aneurysm repair is surgery to fix a widened part ...

  9. Nanomaterials promise better bone repair

    OpenAIRE

    Qifei Wang; Jianhua Yan; Junlin Yang; Bingyun Li

    2016-01-01

    Nanomaterials mimicking the nano-features of bones and offering unique smart functions are promising for better bone fracture repair. This review provides an overview of the current state-of-the-art research in developing and using nanomaterials for better bone fracture repair. This review begins with a brief introduction of bone fracture repair processes, then discusses the importance of vascularization, the role of growth factors in bone fracture repair, and the failure of bone fracture rep...

  10. Laparoscopic repair of femoral hernia

    OpenAIRE

    Yang, Xue-Fei; Liu, Jia-Lin

    2016-01-01

    Laparoscopic repair of inguinal hernia is mini-invasive and has confirmed effects. Femoral hernia could be repaired through the laparoscopic procedures for inguinal hernia. These procedures have clear anatomic view in the operation and preoperatively undiagnosed femoral hernia could be confirmed and treated. Lower recurrence ratio was reported in laparoscopic procedures compared with open procedures for repair of femoral hernia. The technical details of laparoscopic repair of femoral hernia, ...

  11. Aircraft Propeller Hub Repair

    Energy Technology Data Exchange (ETDEWEB)

    Muth, Thomas R. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Peter, William H. [Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

    2015-02-13

    The team performed a literature review, conducted residual stress measurements, performed failure analysis, and demonstrated a solid state additive manufacturing repair technique on samples removed from a scrapped propeller hub. The team evaluated multiple options for hub repair that included existing metal buildup technologies that the Federal Aviation Administration (FAA) has already embraced, such as cold spray, high velocity oxy-fuel deposition (HVOF), and plasma spray. In addition the team helped Piedmont Propulsion Systems, LLC (PPS) evaluate three potential solutions that could be deployed at different stages in the life cycle of aluminum alloy hubs, in addition to the conventional spray coating method for repair. For new hubs, a machining practice to prevent fretting with the steel drive shaft was recommended. For hubs that were refurbished with some material remaining above the minimal material condition (MMC), a silver interface applied by an electromagnetic pulse additive manufacturing method was recommended. For hubs that were at or below the MMC, a solid state additive manufacturing technique using ultrasonic welding (UW) of thin layers of 7075 aluminum to the hub interface was recommended. A cladding demonstration using the UW technique achieved mechanical bonding of the layers showing promise as a viable repair method.

  12. Next Generation Space Interconnect Standard (NGSIS): a modular open standards approach for high performance interconnects for space

    Science.gov (United States)

    Collier, Charles Patrick

    2017-04-01

    The Next Generation Space Interconnect Standard (NGSIS) effort is a Government-Industry collaboration effort to define a set of standards for interconnects between space system components with the goal of cost effectively removing bandwidth as a constraint for future space systems. The NGSIS team has selected the ANSI/VITA 65 OpenVPXTM standard family for the physical baseline. The RapidIO protocol has been selected as the basis for the digital data transport. The NGSIS standards are developed to provide sufficient flexibility to enable users to implement a variety of system configurations, while meeting goals for interoperability and robustness for space. The NGSIS approach and effort represents a radical departure from past approaches to achieve a Modular Open System Architecture (MOSA) for space systems and serves as an exemplar for the civil, commercial, and military Space communities as well as a broader high reliability terrestrial market.

  13. A metallic interconnect for a solid oxide fuel cell stack

    Science.gov (United States)

    England, Diane Mildred

    A solid oxide fuel cell (SOFC) electrochemically converts the chemical energy of reaction into electrical energy. The commercial success of planar, SOFC stack technology has a number of challenges, one of which is the interconnect that electrically and physically connects the cathode of one cell to the anode of an adjacent cell in the SOFC stack and in addition, separates the anodic and cathodic gases. An SOFC stack operating at intermediate temperatures, between 600°C and 800°C, can utilize a metallic alloy as an interconnect material. Since the interconnect of an SOFC stack must operate in both air and fuel environments, the oxidation kinetics, adherence and electronic resistance of the oxide scales formed on commercial alloys were investigated in air and wet hydrogen under thermal cycling conditions to 800°C. The alloy, Haynes 230, exhibited the slowest oxidation kinetics and the lowest area-specific resistance as a function of oxidation time of all the alloys in air at 800°C. However, the area-specific resistance of the oxide scale formed on Haynes 230 in wet hydrogen was unacceptably high after only 500 hours of oxidation, which was attributed to the high resistivity of Cr2O3 in a reducing atmosphere. A study of the electrical conductivity of the minor phase manganese chromite, MnXCr3-XO4, in the oxide scale of Haynes 230, revealed that a composition closer to Mn2CrO4 had significantly higher electrical conductivity than that closer to MnCr 2O4. Haynes 230 was coated with Mn to form a phase closer to the Mn2CrO4 composition for application on the fuel side of the interconnect. U.S. Patent No. 6,054,231 is pending. Although coating a metallic alloy is inexpensive, the stringent economic requirements of SOFC stack technology required an alloy without coating for production applications. As no commercially available alloy, among the 41 alloys investigated, performed to the specifications required, a new alloy was created and designated DME-A2. The oxide scale

  14. A novel analytical thermal model for multilevel nano-scale interconnects considering the via effect

    Institute of Scientific and Technical Information of China (English)

    Zhu Zhang-Ming; Li Ru; Hao Bao-Tian; Yang Yin-Tang

    2009-01-01

    Based on the heat diffusion equation of multilevel interconnects, a novel analytical thermal model for multilevel nano-scale interconnects considering the via effect is presented, which can compute quickly the temperature of multilevel interconnects, with substrate temperature given. Based on the proposed model and the 65 nm complementary metal oxide semiconductor (CMOS) process parameter, the temperature of nano-scale interconnects is computed. The computed results show that the via effect has a great effect on local interconnects, but the reduction of thermal conductivity has little effect on local interconnects. With the reduction of thermal conductivity or the increase of current density, however, the temperature of global interconnects rises greatly, which can result in a great deterioration in their performance. The proposed model can be applied to computer aided design (CAD) of very large-scale integrated circuits (VLSIs) in nano-scale technologies.

  15. When Will Interconnection Go Smoothly?%互联互通何时畅通无阻?

    Institute of Scientific and Technical Information of China (English)

    钱静

    2003-01-01

    At the beginning of this year, Mll placed great emphasis on the regulation of interconnection and decided to introduce some new regulation methods to settle the disputes on interconnection. The year of 2003 is thus called interconnection year'. In early this June Mll announced the punishment to three companies who had violated the rule of interconnection, which indicated great determinacy of Mll to solve the problem of interconnection. What makes interconnection so difficult to carry on? In this issue the "New Telecom Salon" focuses on the subject of interconnection. We invited the vice president of China Netcom Group, the director of China Telecom Group and the director of Policy Research Department at China Academy of Telecom Research of MII to be our guests.

  16. Nanomaterials promise better bone repair

    Directory of Open Access Journals (Sweden)

    Qifei Wang

    2016-10-01

    Full Text Available Nanomaterials mimicking the nano-features of bones and offering unique smart functions are promising for better bone fracture repair. This review provides an overview of the current state-of-the-art research in developing and using nanomaterials for better bone fracture repair. This review begins with a brief introduction of bone fracture repair processes, then discusses the importance of vascularization, the role of growth factors in bone fracture repair, and the failure of bone fracture repair. Next, the review discusses the applications of nanomaterials for bone fracture repair, with a focus on the recent breakthroughs such as nanomaterials leading to precise immobilization of growth factors at the molecular level, promoting vascularization without the use of growth factors, and re-loading therapeutic agents after implantation. The review concludes with perspectives on challenges and future directions for developing nanomaterials for improved bone fracture repair.

  17. 76 FR 46793 - PJM Interconnection, L.L.C.; PJM Power Providers Group v. PJM Interconnection, L.L.C.; Notice...

    Science.gov (United States)

    2011-08-03

    ... From the Federal Register Online via the Government Publishing Office DEPARTMENT OF ENERGY Federal Energy Regulatory Commission PJM Interconnection, L.L.C.; PJM Power Providers Group v. PJM Interconnection, L.L.C.; Notice Establishing Post-Technical Comment Period As indicated in the June 29,...

  18. Exploring the interconnections between gender, health and nature.

    Science.gov (United States)

    MacBride-Stewart, S; Gong, Y; Antell, J

    2016-12-01

    Public health has recognized that nature is good for health but there are calls for a review of its gendered aspects. This review attempts to develop and explore a broad analytical theme - the differing interconnections between gender, health and nature. The paper summarizes the interconnections that have been subject to extensive academic enquiry between gender and health, health and space, and gender and space. A combination of key terms including place; gender; health; outdoor space; green space; natural environment; national parks; femininity; masculinity; recreation; physical activity; sustainability; ecofeminism; feminism; environmental degradation; and environmental justice were used to search the electronic databases Sociological Abstracts, Web of Science and Scopus to identify relevant articles. We took two approaches for this review to provide an overview and analysis of the range of research in the field, and to present a framework of research that is an analysis of the intersection of gender, health and nature. Four dimensions are distinguished: (1) evaluations of health benefits and 'toxicities' of nature; (2) dimensions and qualities of nature/space; (3) environmental justice including accessibility, availability and usability; and (4) identification of boundaries (symbolic/material) that construct differential relationships between nature, gender and health. This paper offers an understanding of how environmental and social conditions may differentially shape the health of women and men. The dimensions direct analytical attention to the diverse linkages that constitute overlapping and inseparable domains of knowledge and practice, to identify complex interconnections between gender, health and nature. This review therefore analyses assumptions about the health benefits of nature, and its risks, for gender from an in-depth, analytical perspective that can be used to inform policy. Copyright © 2016 The Royal Society for Public Health. Published by

  19. Materials for high-density electronic packaging and interconnection

    Science.gov (United States)

    1990-01-01

    Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production.

  20. Production process for advanced space satellite system cables/interconnects.

    Energy Technology Data Exchange (ETDEWEB)

    Mendoza, Luis A.

    2007-12-01

    This production process was generated for the satellite system program cables/interconnects group, which in essences had no well defined production process. The driver for the development of a formalized process was based on the set backs, problem areas, challenges, and need improvements faced from within the program at Sandia National Laboratories. In addition, the formal production process was developed from the Master's program of Engineering Management for New Mexico Institute of Mining and Technology in Socorro New Mexico and submitted as a thesis to meet the institute's graduating requirements.

  1. A New Family of Interconnection Networks of Fixed Degree Three

    Institute of Scientific and Technical Information of China (English)

    Shu-Ming Zhou; Wen-Jun Xiao

    2004-01-01

    A new family of interconnection networks WGn is proposed, that is constant degree 3 Cayley graph,and is isomorphic to a Cayley graph of the wreath product Z2lSn when the generator set is chosen properly. Its different algebraic properties is investigated and a routing algorithm is given with the diameter upper bounded by 3n2 - 6n + 4. The embedding properties and the fault tolerance are devired. In conclusion, we present a comparison of some familiar networks with constant degree 3.

  2. Review And Update Of Fiber Optic Interconnect Standardization

    Science.gov (United States)

    Makuch, John A.

    1980-09-01

    An unofficial discussion of the status of interconnect standardization is presented. It includes an over-view of U.S. and international status in such groups as the EIA P-6 and IEC SC-46E committees. The rationale for choosing the 4 tier system is explained, along with a table showing the structure of the system, as Basic, Generic, Sectional and Detail specifications. The implications of the recent OMB Circular A-119 on Federal Participation in the Development and Use of Voluntary Standards is discussed, particularly as it amplifies the already pressing question of adequate level of resource commitment to the standards question activity.

  3. On some interconnections between combinatorial optimization and extremal graph theory

    Directory of Open Access Journals (Sweden)

    Cvetković Dragoš M.

    2004-01-01

    Full Text Available The uniting feature of combinatorial optimization and extremal graph theory is that in both areas one should find extrema of a function defined in most cases on a finite set. While in combinatorial optimization the point is in developing efficient algorithms and heuristics for solving specified types of problems, the extremal graph theory deals with finding bounds for various graph invariants under some constraints and with constructing extremal graphs. We analyze by examples some interconnections and interactions of the two theories and propose some conclusions.

  4. Parallel optical interconnects: implementation of optoelectronics in multiprocessor architectures.

    Science.gov (United States)

    Frietman, E E; van Nifterick, W; Dekker, L; Jongeling, T J

    1990-03-10

    Performance and efficiency of multiple processor computers depend strongly on the network that interconnects the distinct collaborating processors. Constrained connectivity forces much of the potential computing speed to be used to compensate for the limitation in connections. The availability of a multiple parallel I/O connections allows full unrestricted connectivity and is an essential prerequisite for an interprocessor network that is able to meet the ever growing communication demands. This paper emphasizes the design, building and application of an electrooptic communication system [EOCS]. The EOCS uses dedicated free space multiple data distributors and integrated optically writable inputbuffer arrays with fully parallel access.

  5. Two component micro injection moulding for moulded interconnect devices

    DEFF Research Database (Denmark)

    Islam, Aminul

    2008-01-01

    Moulded interconnect devices (MIDs) contain huge possibilities for many applications in micro electro-mechanical-systems because of their capability of reducing the number of components, process steps and finally in miniaturization of the product. Among the available MID process chains, two...... and a reasonable adhesion between them. • Selective metallization of the two component plastic part (coating one polymer with metal and leaving the other one uncoated) To overcome these two main issues in MID fabrication for micro applications, the current Ph.D. project explores the technical difficulties...

  6. Power economy using point-to-point optical interconnect links

    Science.gov (United States)

    Hartman, Davis H.; Reith, Leslie A.; Habiby, Sarry F.; Lalk, Gail R.; Booth, Bruce L.; Marchegiano, Joseph E.; Hohman, James L.

    1991-04-01

    Future communications networks will be required to provide the switching of very broad-band digita'' channels (typically 155. 52 Mb/s or higher) for as many as 60 customers. Power consumption and cable management are a major factor in the systems level design considerations. It is shown that through the use of ultra-low threshold laser diode arrays optical fiber ribbon cables and a thoughtful packaging strategy significant electrical power advantage can be accrued over conventional electrical interconnection approaches. 1_a

  7. A reconfigurable optoelectronic interconnect technology for multi-processor networks

    Energy Technology Data Exchange (ETDEWEB)

    Lu, Y.C.; Cheng, J. [Univ. of New Mexico, Albuquerque, NM (United States). Center for High Technology Materials; Zolper, J.C.; Klem, J. [Sandia National Labs., Albuquerque, NM (United States)

    1995-05-01

    This paper describes a new optical interconnect architecture and the integrated optoelectronic circuit technology for implementing a parallel, reconfigurable, multiprocessor network. The technology consists of monolithic array`s of optoelectronic switches that integrate vertical-cavity surface-emitting lasers with three-terminal heterojunction phototransistors, which effectively combined the functions of an optical transceiver and an optical spatial routing switch. These switches have demonstrated optical switching at 200 Mb/s, and electrical-to-optical data conversion at > 500 Mb/s, with a small-signal electrical-to-optical modulation bandwidth of {approximately} 4 GHz.

  8. JOULE HEATING INDUCED INTERCONNECT FAILURE IN 3D IC TECHNOLOGY

    OpenAIRE

    Li, Menglu

    2016-01-01

    With the slow-down of Moore’s law of scaling transistors, the industry is looking for 3D IC technology to extend the Moore’s law by stacking chips vertically. In the 3D IC technology, Joule heating is the most serious reliability concern because of increased power density. Moreover, there are new interconnects in the package to support vertical stacking, including the Through Silicon Via (TSV) inside silicon die, μ-bumps between different dies, and redistribution layer (RDL) to fan out the cu...

  9. NIRVANA GOSIP (Government Open Systems Interconnect Profile) requirements

    Energy Technology Data Exchange (ETDEWEB)

    Wood, B.J.

    1990-08-01

    NIRVANA is an effort to standardize electrical computer-aided design workstations at Sandia National Laboratories in Albuquerque, New Mexico. The early effect of this project will be the introduction of at least 60 new engineering workstations at Sandia National Laboratories, Albuquerque, and at Allied Signal, Kansas City Division. These workstations are expected to begin arriving in September 1990. This paper outlines the requirements that a NIRVANA Network must satisfy to comply with the Government Open Systems Interconnect Profile (GOSIP). The author also identifies several issues involved in achieving GOSIP compliance. 4 refs., 1 fig.

  10. Ferroelectric devices, interconnects, and methods of manufacture thereof

    KAUST Repository

    Alshareef, Husam N.

    2013-12-12

    A doped electroconductive organic polymer is used for forming the electrode of a ferroelectric device or an interconnect. An exemplary ferroelectric device is a ferrelectric capacitor comprising: a substrate (101); a first electrode (106) disposed on the substrate; a ferroelectric layer (112) disposed on and in contact with the first electrode; and a second electrode (116) disposed on and in contact with the ferroelectric layer, wherein at least one of the first electrode and the second electrode is an organic electrode comprising a doped electroconductive organic polymer, for example DMSO-doped PEDOT-PSS.

  11. Decentralized control and filtering in interconnected dynamical systems

    CERN Document Server

    Mahmoud, Magdi S

    2011-01-01

    Based on the many approaches available for dealing with large-scale systems (LSS), Decentralized Control and Filtering in Interconnected Dynamical Systems supplies a rigorous framework for studying the analysis, stability, and control problems of LSS. Providing an overall assessment of LSS theories, it addresses model order reduction, parametric uncertainties, time delays, and control estimator gain perturbations. Taking readers on a guided tour through LSS, the book examines recent trends and approaches and reviews past methods and results from a contemporary perspective. It traces the progre

  12. Substrate-facilitated nanoparticle sintering and component interconnection procedure.

    Science.gov (United States)

    Allen, Mark; Leppäniemi, Jaakko; Vilkman, Marja; Alastalo, Ari; Mattila, Tomi

    2010-11-26

    Room temperature substrate-facilitated sintering of nanoparticles is demonstrated using commercially available silver nanoparticle ink and inkjet printing substrates. The sintering mechanism is based on the chemical removal of the nanoparticle stabilizing ligand and is shown to provide conductivity above one-fourth that of bulk silver. A novel approach to attach discrete components to printed conductors is presented, where the sintered silver provides the metallic interconnects with good electrical and mechanical properties. A process for printing and chip-on-demand assembly is suggested.

  13. Novel Composite Materials for SOFC Cathode-Interconnect Contact

    Energy Technology Data Exchange (ETDEWEB)

    J. H. Zhu

    2009-07-31

    This report summarized the research efforts and major conclusions of our University Coal Research Project, which focused on developing a new class of electrically-conductive, Cr-blocking, damage-tolerant Ag-perovksite composite materials for the cathode-interconnect contact of intermediate-temperature solid oxide fuel cell (SOFC) stacks. The Ag evaporation rate increased linearly with air flow rate initially and became constant for the air flow rate {ge} {approx} 1.0 cm {center_dot} s{sup -1}. An activation energy of 280 KJ.mol{sup -1} was obtained for Ag evaporation in both air and Ar+5%H{sub 2}+3%H{sub 2}O. The exposure environment had no measurable influence on the Ag evaporation rate as well as its dependence on the gas flow rate, while different surface morphological features were developed after thermal exposure in the oxidizing and reducing environments. Pure Ag is too volatile at the SOFC operating temperature and its evaporation rate needs to be reduced to facilitate its application as the cathode-interconnect contact. Based on extensive evaporation testing, it was found that none of the alloying additions reduced the evaporation rate of Ag over the long-term exposure, except the noble metals Au, Pt, and Pd; however, these noble elements are too expensive to justify their practical use in contact materials. Furthermore, the addition of La{sub 0.8}Sr{sub 0.2}MnO{sub 3} (LSM) into Ag to form a composite material also did not significantly modify the Ag evaporation rate. The Ag-perovskite composites with the perovskite being either (La{sub 0.6}Sr{sub 0.4})(Co{sub 0.8}Fe{sub 0.2})O{sub 3} (LSCF) or LSM were systematically evaluated as the contact material between the ferritic interconnect alloy Crofer 22 APU and the LSM cathode. The area specific resistances (ASRs) of the test specimens were shown to be highly dependent on the volume percentage and the type of the perovskite present in the composite contact material as well as the amount of thermal cycling

  14. Shield Insertion to Minimize Noise Amplitude in Global Interconnects

    Directory of Open Access Journals (Sweden)

    Kalpana.A.B

    2012-09-01

    Full Text Available Shield insertion is an effective technique for minimise crosstalk noise and signal delay uncertainty .To reduce the effects of coupling uniform or simultaneous shielding may be used on either or both sides of a signal line. Shields are ground or power lines placed between two signal wires to prevent direct coupling between them as the shield width increases, the noise amplitude decreases, in this paper inserting a shield line between two coupled interconnects is shown to be more effective in reducing crosstalk noise for different technology nodes .

  15. Addendum to the 2015 Eastern Interconnect Baselining and Analysis Report

    Energy Technology Data Exchange (ETDEWEB)

    Amidan, Brett G. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States); Follum, James D. [Pacific Northwest National Lab. (PNNL), Richland, WA (United States)

    2016-06-30

    This report serves as an addendum to the report 2015 Eastern Interconnect Baselining and Analysis Report (Amidan, Follum, and Freeman, 2015). This addendum report investigates the following: the impact of shorter record lengths and of adding a daily regularization term to the date/time models for angle pair measurements, additional development of a method to monitor the trend in phase angle pairs, the effect of changing the length of time to determine a baseline, when calculating atypical events, and a comparison between quantitatively discovered atypical events and actual events.

  16. Regenerative polymeric bus architecture for board-level optical interconnects.

    Science.gov (United States)

    Bamiedakis, N; Hashim, A; Penty, R V; White, I H

    2012-05-21

    A scalable multi-channel optical regenerative bus architecture based on the use of polymer waveguides is presented for the first time. The architecture offers high-speed interconnection between electrical cards allowing regenerative bus extension with multiple segments and therefore connection of an arbitrary number of cards onto the bus. In a proof-of-principle demonstration, a 4-channel 3-card polymeric bus module is designed and fabricated on standard FR4 substrates. Low insertion losses (≤ -15 dB) and low crosstalk values (bus modules using a prototype 3R regenerator.

  17. Monolithically interconnected GaAs solar cells: A new interconnection technology for high voltage solar cell output

    Science.gov (United States)

    Dinetta, L. C.; Hannon, M. H.

    1995-01-01

    Photovoltaic linear concentrator arrays can benefit from high performance solar cell technologies being developed at AstroPower. Specifically, these are the integration of thin GaAs solar cell and epitaxial lateral overgrowth technologies with the application of monolithically interconnected solar cell (MISC) techniques. This MISC array has several advantages which make it ideal for space concentrator systems. These are high system voltage, reliable low cost monolithically formed interconnections, design flexibility, costs that are independent of array voltage, and low power loss from shorts, opens, and impact damage. This concentrator solar cell will incorporate the benefits of light trapping by growing the device active layers over a low-cost, simple, PECVD deposited silicon/silicon dioxide Bragg reflector. The high voltage-low current output results in minimal 12R losses while properly designing the device allows for minimal shading and resistance losses. It is possible to obtain open circuit voltages as high as 67 volts/cm of solar cell length with existing technology. The projected power density for the high performance device is 5 kW/m for an AMO efficiency of 26% at 1 5X. Concentrator solar cell arrays are necessary to meet the power requirements of specific mission platforms and can supply high voltage power for electric propulsion systems. It is anticipated that the high efficiency, GaAs monolithically interconnected linear concentrator solar cell array will enjoy widespread application for space based solar power needs. Additional applications include remote man-portable or ultra-light unmanned air vehicle (UAV) power supplies where high power per area, high radiation hardness and a high bus voltage or low bus current are important. The monolithic approach has a number of inherent advantages, including reduced cost per interconnect and increased reliability of array connections. There is also a high potential for a large number of consumer products. Dual

  18. Security analysis of interconnected AC/DC systems

    DEFF Research Database (Denmark)

    Eriksson, Robert

    2015-01-01

    This paper analyses N-1 security in an interconnected ac/dc transmission system using power transfer distribution factors (PTDFs). In the case of a dc converter outage the power needs to be redistributed among the remaining converter to maintain power balance and operation of the dc grid. The red......This paper analyses N-1 security in an interconnected ac/dc transmission system using power transfer distribution factors (PTDFs). In the case of a dc converter outage the power needs to be redistributed among the remaining converter to maintain power balance and operation of the dc grid...... voltage control design consider the power distribution for a converter outage. By proper design and utilizing the proposed method increases the N-1 security and the secure transfer limits. This article proposes a method which minimizes the 2-norm of the sum of the PTDFs with constraints of not violating...... any line or transformer limits. Simulations were performed in a model of the Nordic power system where a dc grid is placed on top. The simulation supports the method as a tool to consider transfer limits in the grid to avoid violate the same and increase the security after a converter outage....

  19. Zooplankton structure in two interconnected ponds: similarities and differences

    Directory of Open Access Journals (Sweden)

    Špoljar Maria

    2016-03-01

    Full Text Available The research of zooplankton diversity, abundance and trophic structure was conducted during the summer period in pelagial zone on the longitudinal profile of the Sutla River Backwater. Investigated site consists of two interconnected basins: transparent Upper Basin with submerged macrophytes and turbid Lower Basin without macrophytes in the littoral zone. In the Upper Basin, abundance and diversity of zooplankton in the pelagial was higher in comparison to the Lower Basin, with prevailing species of genus Keratella as microfilter-feeder, and genera of Polyartha and Trihocerca as macrofilter-feeder rotifers. On the contrary, in the Lower Basin, crustaceans dominated in abundance. Microfilter-feeder cladoceran (Bosmina longirostris and larval and adult stages of macrofilter-feeder copepod (Macrocyclops albidus prevailed in the Lower Basin. Fish predation pressure was more pronounced in the pelagial of the Upper Basin, indicated by low cladoceran abundance in the surface layer. Although the studied basins were interconnected, results indicate significant (Mann-Whitney U test, p < 0.05 differences in the zooplankton structure as a potential result of the macrophyte impact on environmental conditions and fish predation pressure.

  20. Synthesis of lanthanum tungstate interconnecting nanoparticles by high voltage electrospinning

    Energy Technology Data Exchange (ETDEWEB)

    Keereeta, Yanee, E-mail: ynkeereeta@gmail.com [Department of Physics and Materials Science, Faculty of Science, Chiang Mai University, Chiang Mai 50200 (Thailand); Thongtem, Titipun, E-mail: ttpthongtem@yahoo.com [Department of Chemistry, Faculty of Science, Chiang Mai University, Chiang Mai 50200 (Thailand); Materials Science Research Center, Faculty of Science, Chiang Mai University, Chiang Mai 50200 (Thailand); Thongtem, Somchai [Department of Physics and Materials Science, Faculty of Science, Chiang Mai University, Chiang Mai 50200 (Thailand); Materials Science Research Center, Faculty of Science, Chiang Mai University, Chiang Mai 50200 (Thailand)

    2015-10-01

    Graphical abstract: - Highlights: • La{sub 2}(WO{sub 4}){sub 3} as one of semiconducting materials. • H.V. electrospinning was used to synthesize La{sub 2}(WO{sub 4}){sub 3} interconnecting nanoparticles. • A promising material for photoemission. - Abstract: Lanthanum tungstate (La{sub 2}(WO{sub 4}){sub 3}) interconnecting nanoparticles in the shape of fibers were successfully synthesized by electrospinning in combination with high temperature calcination. In this research, calcination temperature for the synthesis of the fibers evidently influenced the diameter, morphology and crystalline degree. The crystalline monoclinic La{sub 2}(WO{sub 4}){sub 3} fibers with 200–700 nm in diameter, two main Raman peaks at 945 and 927 cm{sup −1}, FTIR stretching modes at 936 and 847 cm{sup −1}, 2.02 eV energy gap and 415–430 nm blue emission were synthesized by calcination of inorganic/organic hybrid fibers at 750 °C for 5 h, characterized by X-ray diffraction, scanning electron microscopy (SEM), transmission electron microscopy (TEM), selected area electron diffraction (SAED), thermogravimetric analysis (TGA), Fourier transform infrared spectroscopy (FTIR), Raman spectroscopy, UV–visible spectroscopy and photoluminescence (PL) spectroscopy. The surface of the composite fibers before calcination was very smooth. Upon calcination the composite fibers at 750 °C for 5 h, they were transformed into nanoparticles join together in the shape of fibers with rough surface.

  1. Advanced methodology for generation expansion planning including interconnected systems

    Energy Technology Data Exchange (ETDEWEB)

    Zhao, M.; Yokoyama, R.; Yasuda, K. [Tokyo Metropolitan Univ. (Japan); Sasaki, H. [Hiroshima Univ. (Japan); Ogimoto, K. [Electric Power Development Co. Ltd., Tokyo (Japan)

    1994-12-31

    This paper reviews advanced methodology for generation expansion planning including interconnected systems developed in Japan, putting focus on flexibility and efficiency in a practical application. First, criteria for evaluating flexibility of generation planning considering uncertainties are introduced. Secondly, the flexible generation mix problem is formulated as a multi-objective optimization with more than two objective functions. The multi-objective optimization problem is then transformed into a single objective problem by using the weighting method, to obtain the Pareto optimal solution, and solved by a dynamics programming technique. Thirdly, a new approach for electric generation expansion planning of interconnected systems is presented, based on the Benders Decomposition technique. That is, large scale generation problem constituted by the general economic load dispatch problem, and several sub problems which are composed of smaller scale isolated system generation expansion plans. Finally, the generation expansion plan solved by an artificial neural network is presented. In conclusion, the advantages and disadvantages of this method from the viewpoint of flexibility and applicability to practical generation expansion planning are presented. (author) 29 refs., 10 figs., 4 tabs.

  2. Scaling silicon photonic switch fabrics for data center interconnection networks.

    Science.gov (United States)

    Nikolova, Dessislava; Rumley, Sébastien; Calhoun, David; Li, Qi; Hendry, Robert; Samadi, Payman; Bergman, Keren

    2015-01-26

    With the rapidly increasing aggregate bandwidth requirements of data centers there is a growing interest in the insertion of optically interconnected networks with high-radix transparent optical switch fabrics. Silicon photonics is a particularly promising and applicable technology due to its small footprint, CMOS compatibility, high bandwidth density, and the potential for nanosecond scale dynamic connectivity. In this paper we analyze the feasibility of building silicon photonic microring based switch fabrics for data center scale optical interconnection networks. We evaluate the scalability of a microring based switch fabric for WDM signals. Critical parameters including crosstalk, insertion loss and switching speed are analyzed, and their sensitivity with respect to device parameters is examined. We show that optimization of physical layer parameters can reduce crosstalk and increase switch fabric scalability. Our analysis indicates that with current state-of-the-art devices, a high radix 128 × 128 silicon photonic single chip switch fabric with tolerable power penalty is feasible. The applicability of silicon photonic microrings for data center switching is further supported via review of microring operations and control demonstrations. The challenges and opportunities for this technology platform are discussed.

  3. Are the fish of the upper and lower Mekong interconnected?

    Institute of Scientific and Technical Information of China (English)

    KANG Bin; PERRETT Lisa; LI Yungang; HE Daming

    2009-01-01

    The Mekong supports one of the richest inland fisheries in the world, with many of the fish migrating long distance to spawn. Little is known about the fisheries and migration strategies of the Upper Mekong whilst it is supposed that many fish species move between the Lower and Upper Mekong. Most likely, natural fish migration in the fiver has been altered by dam construction across the mainstream of the Upper Mekong. In this paper, the interconnectivity of fish species between different sections of the Mekong and negative impacts of dams on migratory fish are studied. Of the 162 fish species in the Upper Mekong and the 869 species in the Lower Mekong, 61 species are common. Results show that there is no significant difference at order level between the UM and LM. Similarity coefficients are used to evaluate interconnectivity at species, genus and family levels among four different sections of the Upper Mekong with each other and with the Lower Mekong as a whole. The highest similarity is found between the middle and lower reach of the Upper Mekong at species and genus levels and the middle and upper reach at family level. Of the eight cascade dams, Mengsong Dam in planning is considered as the biggest threat to migratory fish from the Lower Mekong and should be particularly concerned.

  4. A high-speed interconnect network using ternary logic

    DEFF Research Database (Denmark)

    Madsen, Jens Kargaard; Long, S. I.

    1995-01-01

    This paper describes the design and implementation of a high-speed interconnect network (ICN) for a multiprocessor system using ternary logic. By using ternary logic and a fast point-to-point communication technique called STARI (Self-Timed At Receiver's Input), the communication between the proc......This paper describes the design and implementation of a high-speed interconnect network (ICN) for a multiprocessor system using ternary logic. By using ternary logic and a fast point-to-point communication technique called STARI (Self-Timed At Receiver's Input), the communication between...... the processors is free of clock skew and insensitive to any delay differences in buffers and wires. In addition, the number of signal wires and pins are reduced by 50 percent in comparison with a similar binary implementation. The ICN architecture is based on a crossbar topology and the high-speed part consists...... of two LSI GaAs chips, Interface and Crossbar, which were implemented in a 0.8 μm MESFET process. In a 4×4 ICN, communication at 300 Mbit/s per wire was demonstrated, which is twice as fast as pure synchronous and four times faster than pure asynchronous communication in the specific test set-up...

  5. Synthesis of Planar Reflective Gratings for Silicon Interconnects

    Directory of Open Access Journals (Sweden)

    Serge Bidnyk

    2008-05-01

    Full Text Available The design and simulations of planar reflective gratings for building optical interconnects in silicon-on-insulator (SOI were studied for a range of silicon core thicknesses of 0.1 to 10 μm. The verticality of the grating facets has been shown to be the main contributing factor to the cumulative crosstalk in thick silicon cores. The dispersion property of the slab was found to limit the minimal thickness of the core for polarization-insensitive gratings. The effects of polarization-dependent confinement on optical crosstalk were studied. The findings were used to design and simulate a polarization-insensitive 18-channel coarse wavelength division demultiplexer (CWDM with a free spectral range of over 600 nm. The CWDM demultiplexer uses a 1.7 μm silicon core and combines a shallow-etch tapered rib structure and multimode silicon channels to produce box-like passbands for integrated receiver applications. The diffraction grating was constructed using double astigmatic point design with phase-corrected grating facets to reduce astigmatism. Optical properties of the planar gratings have been simulated using quasivectorial diffraction grating theory. The simulation results confirm that there is high diffraction efficiency and low optical crosstalk over the entire range of operation. Applications of planar silicon gratings to the synthesis of silicon interconnects are discussed.

  6. Tomography of integrated circuit interconnect with an electromigration void

    Energy Technology Data Exchange (ETDEWEB)

    Levine, Zachary H. [National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8410 (United States); Rensselaer Polytechnic Institute, Troy, New York 12180-3590 (United States); Kalukin, Andrew R. [National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8410 (United States); Kuhn, Markus [Intel Corporation RA1-329, 5200 Northeast Elam Young Parkway, Hillsboro, Oregon 74124 (United States); Frigo, Sean P. [Advanced Photon Source, Argonne National Laboratory, 9700 South Cass Avenue, Argonne, Illinois 60439 (United States); McNulty, Ian [Advanced Photon Source, Argonne National Laboratory, 9700 South Cass Avenue, Argonne, Illinois 60439 (United States); Retsch, Cornelia C. [Advanced Photon Source, Argonne National Laboratory, 9700 South Cass Avenue, Argonne, Illinois 60439 (United States); Wang, Yuxin [Advanced Photon Source, Argonne National Laboratory, 9700 South Cass Avenue, Argonne, Illinois 60439 (United States); Arp, Uwe [National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8410 (United States); Lucatorto, Thomas B. [National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8410 (United States); Ravel, Bruce D. [National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8410 (United States)] (and others)

    2000-05-01

    An integrated circuit interconnect was subject to accelerated-life test conditions to induce an electromigration void. The silicon substrate was removed, leaving only the interconnect test structure encased in silica. We imaged the sample with 1750 eV photons using the 2-ID-B scanning transmission x-ray microscope at the Advanced Photon Source, a third-generation synchrotron facility. Fourteen views through the sample were obtained over a 170 degree sign range of angles (with a 40 degree sign gap) about a single rotation axis. Two sampled regions were selected for three-dimensional reconstruction: one of the ragged end of a wire depleted by the void, the other of the adjacent interlevel connection (or ''via''). We applied two reconstruction techniques: the simultaneous iterative reconstruction technique and a Bayesian reconstruction technique, the generalized Gaussian Markov random field method. The stated uncertainties are total, with one standard deviation, which resolved the sample to 200{+-}70 and 140{+-}30 nm, respectively. The tungsten via is distinguished from the aluminum wire by higher absorption. Within the void, the aluminum is entirely depleted from under the tungsten via. The reconstructed data show the applicability of this technique to three-dimensional imaging of buried defects in submicrometer structures relevant to the microelectronics industry. (c) 2000 American Institute of Physics.

  7. Electromigration-induced plasticity and texture in Cu interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Advanced Light Source; Tamura, Nobumichi; Budiman, A. S.; Hau-Riege, C.S.; Besser, P. R.; Marathe, A.; Joo, Y.-C.; Tamura, N.; Patel, J. R.; Nix, W. D.

    2007-10-31

    Plastic deformation has been observed in damascene Cu interconnect test structures during an in-situ electromigration experiment and before the onset of visible microstructural damage (ie. voiding) using a synchrotron technique of white beam X-ray microdiffraction. We show here that the extent of this electromigration-induced plasticity is dependent on the texture of the Cu grains in the line. In lines with strong <111> textures, the extent of plastic deformation is found to be relatively large compared to our plasticity results in the previous study [1] using another set of Cu lines with weaker textures. This is consistent with our earlier observation that the occurrence of plastic deformation in a given grain can be strongly correlated with the availability of a <112> direction of the crystal in the proximity of the direction of the electron flow in the line (within an angle of 10{sup o}). In <111> out-of-plane oriented grains in a damascene interconnect scheme, the crystal plane facing the sidewall tends to be a {l_brace}110{r_brace} plane,[2-4] so as to minimize interfacial energy. Therefore, it is deterministic rather than probabilistic that the <111> grains will have a <112> direction nearly parallel to the direction of electron flow. Thus, strong <111> textures lead to more plasticity, as we observe.

  8. Multimode fiber for high-density optical interconnects

    Science.gov (United States)

    Bickham, Scott R.; Ripumaree, Radawan; Chalk, Julie A.; Paap, Mark T.; Hurley, William C.; McClure, Randy L.

    2017-02-01

    Data centers (DCs) are facing the challenge of delivering more capacity over longer distances. As line rates increase to 25 Gb/s and higher, DCs are being challenged with signal integrity issues due to the long electrical traces that require retiming. In addition, the density of interconnects on the front panel is limited by the size and power dissipation requirements of the pluggable modules. One proposal to overcome these issues is to use embedded optical transceivers in which optical fibers are used to transport data to and from the front panel. These embedded modules will utilize arrays of VCSEL or silicon-photonic transceivers, and in both cases, the capacity may be limited by the density of the optical connections on the chip. To address this constraint, we have prototyped optical fibers in which the glass and coating diameters are reduced to 80 and 125 microns, respectively. These smaller diameters enable twice as many optical interconnects in the same footprint, and this in turn will allow the transceiver arrays to be collinearly located on small chips with dimensions on the order of (5x5mm2)1,2. We have also incorporated these reduced diameter fibers into small, flexible 8-fiber ribbon cables which can simplify routing constraints inside modules and optical backplanes.

  9. Silicon resonant-cavity-enhanced photodetector arrays for optical interconnects

    Science.gov (United States)

    Emsley, Matthew K.; Dosunmu, Olufemi I.; Muller, Paul; Unlu, M. Selim; Leblebici, Yusuf

    2003-08-01

    High bandwidth short distance communications standards are being developed based on parallel optical interconnect fiber arrays to meet the needs of increasing data rates of inter-chip communication in modern computer architecture. To ensure that this standard becomes an attractive option for computer systems, low cost components must be implemented on both the transmitting and receiving end of the fibers. To meet this low cost requirement silicon based receiver circuits are the most viable option, however, manufacturing high speed, high efficiency silicon photodetectors presents a technical challenge. Resonant cavity enhanced (RCE) Si photodetectors have been shown to provide the required bandwidth-efficiency product and we have recently developed a method to reproduce them through commercially available fabrication techniques. In this work, commercially reproducible silicon wafers with a 90% reflectance buried distributed Bragg reflector (DBR) are used to create Si-RCE photodetector arrays for optical interconnects. The Si-RCE photodetectors have 40% quantum efficiency at 860 nm, a FWHM of 25 ps, and a 3dB bandwidth in excess of 10 GHz. We also demonstrate Si-RCE 12×1 photodetector arrays that have been fabricated and packaged with silicon based amplifiers to demonstrate the feasibility of a low cost monolithic silicon photoreceiver array.

  10. Germanium electroabsorption devices on silicon for optical interconnects

    Science.gov (United States)

    Kuo, Yu-Hsuan; Miller, David A. B.; Harris, James S.

    2006-02-01

    Monolithic integration of both electronic and optic components into a silicon-based platform will provide high-speed optical interconnects and solve the power-bandwidth limitations. However, the lack of strong optical effects in silicon has limited the progress in the transmitter-end applications. Recently our research had demonstrated strong quantum-confined Stark effect (QCSE) in germanium quantum-well modulators on silicon. This first strong physical mechanism for group-IV photonics has a comparable behavior to III-V material systems. With proper quantum well structure design, we also demonstrated QCSE in C-band for long distance communications with CMOS-operational temperatures. The device fabrication is also compatible with standard silicon chip processes. Since the QCSE, a type of electroabsorption effect, requires much shorter optical length, it is suitable for device miniaturizations and possible for use in both lateral and vertical modulator configurations. Moreover, silicon-germanium electroabsorption modulators are inherently photodetectors, this advantage will enable efficient transmitter/receiver applications for optical interconnects.

  11. Electromigration of intergranular voids in metal films for microelectronic interconnects

    CERN Document Server

    Averbuch, A; Ravve, I

    2003-01-01

    Voids and cracks often occur in the interconnect lines of microelectronic devices. They increase the resistance of the circuits and may even lead to a fatal failure. Voids may occur inside a single grain, but often they appear on the boundary between two grains. In this work, we model and analyze numerically the migration and evolution of an intergranular void subjected to surface diffusion forces and external voltage applied to the interconnect. The grain-void interface is considered one-dimensional, and the physical formulation of the electromigration and diffusion model results in two coupled fourth-order one-dimensional time-dependent PDEs. The boundary conditions are specified at the triple points, which are common to both neighboring grains and the void. The solution of these equations uses a finite difference scheme in space and a Runge-Kutta integration scheme in time, and is also coupled to the solution of a static Laplace equation describing the voltage distribution throughout the grain. Since the v...

  12. Rescue of endemic states in interconnected networks with adaptive coupling

    CERN Document Server

    Vazquez, F; Miguel, M San

    2015-01-01

    We study the Susceptible-Infected-Susceptible model of epidemic spreading on two layers of networks interconnected by adaptive links, which are rewired at random to avoid contacts between infected and susceptible nodes at the interlayer. We find that the rewiring reduces the effective connectivity for the transmission of the disease between layers, and may even totally decouple the networks. Weak endemic states, in which the epidemics spreads only if the two layers are interconnected, show a transition from the endemic to the healthy phase when the rewiring overcomes a threshold value that depends on the infection rate, the strength of the coupling and the mean connectivity of the networks. In the strong endemic scenario, in which the epidemics is able to spread on each separate network, the prevalence in each layer decreases when increasing the rewiring, arriving to single network values only in the limit of infinitely fast rewiring. We also find that finite-size effects are amplified by the rewiring, as the...

  13. Winner-Take-All Neural Network with Massively Optoelectronic Interconnections

    Directory of Open Access Journals (Sweden)

    Wissam H. Ali

    2009-01-01

    Full Text Available The increased interconnection density, bandwidth, nonlocality and fan-out-fan-in offered by optics over conventional electronic technologies make it a very attractive medium for a variety of application particularity in the field of communication system implementation for all types of computing engines is achieved. This is especially true for neural networks in which the demand for communication resources is extremely high. In this study, the implementation of a neural network that exploits an optical interconnect to perform a real task is described. A pnpn semiconductor device has been connected in parallel with a common load resistance for optical switching. When illuminated, only this device with maximum input will turn on. The voltages across the other devices drop and inhibit their switching ability. With suitable biasing, the winning device can be recall at any time. The result shows, a much faster response (<10ns can be obtained from thyristors made of III-V compound semiconductors, because their carrier lifetime is considerably shorter than in silicon. With III-V photothyristor, it is possible to combine light emission (even lasing and photothyristor action in the same unit.

  14. Middleware Architecture for the Interconnection of Distributed and Parallel Systems

    Directory of Open Access Journals (Sweden)

    Ovidiu Gherman

    2012-01-01

    Full Text Available Grid computing is a fast evolving technology, bringing more computing power to its users. Two main directions are observable: creating dedicated supercomputers for scientific and commercial tasks and creating distributed commodity-based systems. The first ones are usually much expensive, but have the advantage of performance, better control and uniformity in platforms. The second one is more affordable but lacks in flexibility and easy maintenance. The computing necessities that often require supplementary computing power for certain time periods are better satisfied by interconnecting available resources than buying new, expensive ones. But interconnecting platforms – sometimes radically different – can be a difficult task. The proliferation of hybrid parallel computing systems can be even more complicated because it puts in contact systems with various operating flows at the parallelism level. In this frame, the present article proposes a new middleware architecture that can connect multiple parallel or distributed resources, of different types, allowing unitary resource utilization and reservation for the user’s jobs. The new architecture is described functionally and structurally.

  15. A Privacy-Preserving Distributed Optimal Scheduling for Interconnected Microgrids

    Directory of Open Access Journals (Sweden)

    Nian Liu

    2016-12-01

    Full Text Available With the development of microgrids (MGs, interconnected operation of multiple MGs is becoming a promising strategy for the smart grid. In this paper, a privacy-preserving distributed optimal scheduling method is proposed for the interconnected microgrids (IMG with a battery energy storage system (BESS and renewable energy resources (RESs. The optimal scheduling problem is modeled to minimize the coalitional operation cost of the IMG, including the fuel cost of conventional distributed generators and the life loss cost of BESSs. By using the framework of the alternating direction method of multipliers (ADMM, a distributed optimal scheduling model and an iteration solution algorithm for the IMG is introduced; only the expected exchanging power (EEP of each MG is required during the iterations. Furthermore, a privacy-preserving strategy for the sharing of the EEP among MGs is designed to work with the mechanism of the distributed algorithm. According to the security analysis, the EEP can be delivered in a cooperative and privacy-preserving way. A case study and numerical results are given in terms of the convergence of the algorithm, the comparison of the costs and the implementation efficiency.

  16. A Quality-of-Service Mechanism for Interconnection Networks in System-on-Chips

    CERN Document Server

    Weber, Wolf-Dietrich; Swarbrick, Ian; Wingard, Drew

    2011-01-01

    As Moore's Law continues to fuel the ability to build ever increasingly complex system-on-chips (SoCs), achieving performance goals is rising as a critical challenge to completing designs. In particular, the system interconnect must efficiently service a diverse set of data flows with widely ranging quality-of-service (QoS) requirements. However, the known solutions for off-chip interconnects such as large-scale networks are not necessarily applicable to the on-chip environment. Latency and memory constraints for on-chip interconnects are quite different from larger-scale interconnects. This paper introduces a novel on-chip interconnect arbitration scheme. We show how this scheme can be distributed across a chip for high-speed implementation. We compare the performance of the arbitration scheme with other known interconnect arbitration schemes. Existing schemes typically focus heavily on either low latency of service for some initiators, or alternatively on guaranteed bandwidth delivery for other initiators. ...

  17. Fast process flow, on-wafer interconnection and singulation for MEPV

    Energy Technology Data Exchange (ETDEWEB)

    Okandan, Murat; Nielson, Gregory N.; Cruz-Campa, Jose Luis; Sanchez, Carlos Anthony

    2017-08-29

    A method including providing a substrate comprising a device layer on which a plurality of device cells are defined; depositing a first dielectric layer on the device layer and metal interconnect such that the deposited interconnect is electrically connected to at least two of the device cells; depositing a second dielectric layer over the interconnect; and exposing at least one contact point on the interconnect through the second dielectric layer. An apparatus including a substrate having defined thereon a device layer including a plurality of device cells; a first dielectric layer disposed directly on the device layer; a plurality of metal interconnects, each of which is electrically connected to at least two of the device cells; and a second dielectric layer disposed over the first dielectric layer and over the interconnects, wherein the second dielectric layer is patterned in a positive or negative planar spring pattern.

  18. Fast process flow, on-wafer interconnection and singulation for MEPV

    Energy Technology Data Exchange (ETDEWEB)

    Okandan, Murat; Nielson, Gregory N.; Cruz-Campa, Jose Luis; Sanchez, Carlos Anthony

    2017-01-31

    A method including providing a substrate comprising a device layer on which a plurality of device cells are defined; depositing a first dielectric layer on the device layer and metal interconnect such that the deposited interconnect is electrically connected to at least two of the device cells; depositing a second dielectric layer over the interconnect; and exposing at least one contact point on the interconnect through the second dielectric layer. An apparatus including a substrate having defined thereon a device layer including a plurality of device cells; a first dielectric layer disposed directly on the device layer; a plurality of metal interconnects, each of which is electrically connected to at least two of the device cells; and a second dielectric layer disposed over the first dielectric layer and over the interconnects, wherein the second dielectric layer is patterned in a positive or negative planar spring pattern.

  19. Laparoscopic Repair of Morgagni Hernia

    Directory of Open Access Journals (Sweden)

    ilker murat arer

    2015-03-01

    Full Text Available Morgagni hernia is a congenital herniation of abdominal contents into the thoracic cavity through a retrosternal diaphragmatic defect and make up about 1 % - 5 % of all types of congenital diaphragmatic hernias. Surgical repair of Morgagni hernias is usually indicated when patients are symptomatic and have a high risk of strangulation or incarceration of the contained viscera. 71-year-old male patient admitted to emergency department with a 2-day history of abdominal pain, vomiting and obstipation. Laparoscopic repair for Morgagni hernia was performed. Laparoscopic repair for Morgagni hernia with mesh repair is secure, satisfactory and easily performed. [Cukurova Med J 2015; 40(Suppl 1: 71-74

  20. Decentralized Output-Feedback Stabilization of Linear Time-invariant Interconnected Systems with Delays

    Energy Technology Data Exchange (ETDEWEB)

    Shim, D.S. [Chung-Ang University, Seoul (Korea, Republic of)

    1998-04-01

    We study the decentralized stabilization problem of linear time-invariant large-scale interconnected systems with delays without any system structure. We obtain sufficient stability conditions for interconnected systems which are equivalent to disturbance attenuation of some scaled system. A decentralized output-feedback controller is obtained using standard H{infinity} control theory. The obtained controller is delay-independent. We also obtain an observer for the interconnected system. (author). 9 refs.

  1. Combinatorial Reliability and Repair

    Science.gov (United States)

    1992-07-01

    Press, Oxford, 1987. [2] G. Gordon and L. Traldi, Generalized activities and the Tutte polynomial , Discrete Math. 85 (1990), 167-176. [3] A. B. Huseby, A...particular, Satyanarayana and Tindell introduced a notion of (K,j)-domination in their study of a K-terminal version of the chromatic polynomial [6], and it...G)) graphs. He also intends to look into the properties of the polynomial that gives the expected number of needed repairs of a K-terminal network

  2. Mammalian mismatch repair

    DEFF Research Database (Denmark)

    Pena Diaz, Javier; Jiricny, Josef

    2012-01-01

    A considerable surge of interest in the mismatch repair (MMR) system has been brought about by the discovery of a link between Lynch syndrome, an inherited predisposition to cancer of the colon and other organs, and malfunction of this key DNA metabolic pathway. This review focuses on recent...... advances in our understanding of the molecular mechanisms of canonical MMR, which improves replication fidelity by removing misincorporated nucleotides from the nascent DNA strand. We also discuss the involvement of MMR proteins in two other processes: trinucleotide repeat expansion and antibody maturation...

  3. Exact Output Response Computation of RC Interconnects Under General Polynomial Input Waveforms

    Directory of Open Access Journals (Sweden)

    L. M. Patnaik

    2000-01-01

    Full Text Available Accurate output response computation of RC interconnects under various input excitations is a key issue in deep submicron delay analysis. In this paper, we present an exact analysis of output response computation of a distributed RC interconnect under input signals that are polynomial in time (tn. A simple, recursive equation that helps us to calculate the interconnect response under higher order polynomial inputs in terms of the lower order polynomial responses is derived. To the best of our knowledge, this is the first exact output response analysis of RC interconnects under generalized polynomial inputs.

  4. Superconducting Thin-Film Interconnects for Cryogenic Photon Detector Arrays Project

    Data.gov (United States)

    National Aeronautics and Space Administration — Next generation astrophysical observatories need improvements in readout electronics and associated high density interconnects. In particular, advanced imaging...

  5. A Design of ABC95 Array Computer Multi-function Interconnection Chips

    Institute of Scientific and Technical Information of China (English)

    2002-01-01

    ABC95 array computer is a multi-function network computer based on FPGA technology. A notable feature of ABC95 array computer is the support of complex interconnection, which determines that the computer must have enough I/O band and flexible communications between Pes. The authors designed the interconnecting network chips of ABC95 and realized a form of multi-function interconnection. The multi-function interconnecting network supports conflict-free access from processors to memory matrix and the MESH network of enhanced processors to processor communications. The design scheme has been proved feasible by experiment.

  6. Investigation of performance degradation of SOFC using chromium-containing alloy interconnects

    DEFF Research Database (Denmark)

    Beeaff, D.R.; Dinesen, A.; Hendriksen, Peter Vang

    2007-01-01

    -side interconnect plate and the other sample containing a similar fuel cell but no steel interconnect. The interconnect-bearing sample was evaluated for thermochemical compatibility of cell components, including interconnect materials, under conditions typical of and/or expected during the lifetime of an installed......O filler. Longterm degradation of each sample was determined using a current density of 250 mA.cm(-2) using humidified hydrogen as the fuel and air as the oxygen source. Additionally, the stack element was cycled and an investigation into the effect of cathode atmosphere was undertaken to elucidate...

  7. Electric Current-induced Failure of 200-nm-thick Gold Interconnects

    Institute of Scientific and Technical Information of China (English)

    Bin ZHANG; Qingyuan YU; Jun TAN; Guangping ZHANG

    2008-01-01

    200-nm-thick Au interconnects on a quartz substrate were tested in-situ inside a dual-beam microscope by applying direct current,alternating current and alternating current with a small direct current component.The failure behavior of the Au interconnects under three kinds of electric currents were characterized in-situ by scanning electron microscopy.It is found that the formation of voids and subsequent growth perpendicular to the interconnect direction is the fatal failure mode for all the Au interconnects under three kinds of electric currents.The failure mechanism of the ultrathin metal lines induced by the electric currents was analyzed.

  8. Silicon photonics for high-performance interconnection networks

    Science.gov (United States)

    Biberman, Aleksandr

    2011-12-01

    We assert in the course of this work that silicon photonics has the potential to be a key disruptive technology in computing and communication industries. The enduring pursuit of performance gains in computing, combined with stringent power constraints, has fostered the ever-growing computational parallelism associated with chip multiprocessors, memory systems, high-performance computing systems, and data centers. Sustaining these parallelism growths introduces unique challenges for on- and off-chip communications, shifting the focus toward novel and fundamentally different communication approaches. This work showcases that chip-scale photonic interconnection networks, enabled by high-performance silicon photonic devices, enable unprecedented bandwidth scalability with reduced power consumption. We demonstrate that the silicon photonic platforms have already produced all the high-performance photonic devices required to realize these types of networks. Through extensive empirical characterization in much of this work, we demonstrate such feasibility of waveguides, modulators, switches, and photodetectors. We also demonstrate systems that simultaneously combine many functionalities to achieve more complex building blocks. Furthermore, we leverage the unique properties of available silicon photonic materials to create novel silicon photonic devices, subsystems, network topologies, and architectures to enable unprecedented performance of these photonic interconnection networks and computing systems. We show that the advantages of photonic interconnection networks extend far beyond the chip, offering advanced communication environments for memory systems, high-performance computing systems, and data centers. Furthermore, we explore the immense potential of all-optical functionalities implemented using parametric processing in the silicon platform, demonstrating unique methods that have the ability to revolutionize computation and communication. Silicon photonics

  9. Optical Filters, Modulators and Interconnects for Optical Communication Systems

    Science.gov (United States)

    Han, Sang-Kook

    This dissertation describes the theoretical and experimental studies on the guided wave optical devices in the InGaAlAs/InP material system and the integration of the optical devices which utilize single quantum well (SQW) as well as multi-quantum well (MQW) structures. This study encompasses the fabrication and characterization of passive ridge waveguides, efficient phase modulators using the quadratic electro-optic effect, as well as efficient, narrow bandwidth wavelength filters. For the purpose of the monolithic integration of an SQW laser diode with an MQW modulator in GaAs/AlGaAs without a complex regrowth process, an impurity-induced layer disordering (IILD) technique is used to facilitate a novel tapered waveguide interconnect structure. The narrow bandwidth and widely tunable wavelength filters are essential for the implementation of highly dense wavelength-division-multiplexers/demultiplexers (WDM) in multi-wavelength optical networks and systems. The vertically stacked directional coupler structure wavelength filter device operating at 1.55 μm which permits the maximum asymmetry possible in directional coupler devices to achieve a narrow bandwidth is presented. The quaternary InGaAlAs layers grown on InP substrate are used and it facilitates larger tunability due to material dispersion. The spectral index method and coupled mode theory are used for theoretical calculations of the filter response. The characteristics of the filter are measured and the tunability of the device is discussed. An array of many filters with different center wavelength in a single chip is studied and a relatively broad range of center wavelength is easily obtained by a small variation in the design of the structure. To achieve an integration of a high gain SQW laser diode and an MQW electroabsorption intensity modulator with a high on/off ratio, we utilize a tapered waveguide interconnect using an IILD technique which permits transfer of the energy generated in an SQW laser

  10. DNA replication, repair, and repair tests. [Rat; human leukocytes

    Energy Technology Data Exchange (ETDEWEB)

    Lambert, B.

    1980-09-01

    The rate of inhibition and recovery of DNA synthesis can be used in a rapid assay system to detect genotoxic potentials of chemicals. Also, the observation that an agent stimulates DNA repair in a test system indicates its ability to cause damage in DNA. Different experimental approaches to the study of repair synthesis are discussed.

  11. Multiple Tipping Points and Optimal Repairing in Interacting Networks

    CERN Document Server

    Majdandzic, Antonio; Curme, Chester; Vodenska, Irena; Levy-Carciente, Sary; Stanley, H Eugene; Havlin, Shlomo

    2015-01-01

    Systems that comprise many interacting dynamical networks, such as the human body with its biological networks or the global economic network consisting of regional clusters, often exhibit complicated collective dynamics. To understand the collective behavior of these systems, we investigate a model of interacting networks exhibiting the fundamental processes of failure, damage spread, and recovery. We find a very rich phase diagram that becomes exponentially more complex as the number of networks is increased. In the simplest example of $n=2$ interacting networks we find two critical points, 4 triple points, 10 allowed transitions, and two "forbidden" transitions, as well as a manifold of metastable regions represented by complex hysteresis. Knowing and understanding the phase diagram have an immediate practical implication; it enables us to find the optimal strategy for repairing partially or fully damaged interconnected networks. To support our model, we analyze an example of real interacting financial net...

  12. Biologics for tendon repair.

    Science.gov (United States)

    Docheva, Denitsa; Müller, Sebastian A; Majewski, Martin; Evans, Christopher H

    2015-04-01

    Tendon injuries are common and present a clinical challenge to orthopedic surgery mainly because these injuries often respond poorly to treatment and require prolonged rehabilitation. Therapeutic options used to repair ruptured tendons have consisted of suture, autografts, allografts, and synthetic prostheses. To date, none of these alternatives has provided a successful long-term solution, and often the restored tendons do not recover their complete strength and functionality. Unfortunately, our understanding of tendon biology lags far behind that of other musculoskeletal tissues, thus impeding the development of new treatment options for tendon conditions. Hence, in this review, after introducing the clinical significance of tendon diseases and the present understanding of tendon biology, we describe and critically assess the current strategies for enhancing tendon repair by biological means. These consist mainly of applying growth factors, stem cells, natural biomaterials and genes, alone or in combination, to the site of tendon damage. A deeper understanding of how tendon tissue and cells operate, combined with practical applications of modern molecular and cellular tools could provide the long awaited breakthrough in designing effective tendon-specific therapeutics and overall improvement of tendon disease management.

  13. Kvitebjoern gas pipeline repair - baptism of remote pipeline repair system

    Energy Technology Data Exchange (ETDEWEB)

    Gjertveit, Erling

    2010-07-01

    On the 1st of November 2007, severe anchor damage was discovered on the 30 inch Kvitebjoern gas export pipeline. The damage constituted a localised dent and a 17deg buckle, but no leakage. Statoil has invested in building an effective repair contingency structure for the large pipeline network on the Norwegian Continental shelf, with particular focus on the large gas export pipelines. The repair method for the Kvitebjoern pipeline was remotely operated using two Morgrip couplings and a spool. The installation used the purpose built Pipeline Repair System stored at Killingoey and couplings produced and tested back in 2005. This presentation will cover the initial damage investigations, the temporary operational phase, the repair preparations, the actual repair and lessons learned. (Author)

  14. Efficient dual layer interconnect coating for high temperature electrochemical devices

    DEFF Research Database (Denmark)

    Palcut, Marián; Mikkelsen, Lars; Neufeld, Kai

    2012-01-01

    Effects of novel dual layer coatings Co3O4/La0.85Sr0.15MnO3−δ on high temperature oxidation behaviour of candidate steels for interconnects are studied at 1123 K in flowing simulated ambient air (air + 1% H2O) and oxygen. Four alloys are investigated: Crofer 22 APU, Crofer 22 H, E-Brite and AL 29......-4C. The reaction kinetics is followed by measuring the mass increase of the samples over time. The oxide scale microstructure and chemical composition are investigated by scanning electron microscopy/energy dispersive spectroscopy. The kinetic data follow the parabolic rate law. It is found...... that the oxidation reaction is limited by outward Cr3+ diffusion in the chromia scale. The coating effectively reduces the oxidation rate. Reactions and cation inter-diffusion between the coating and the oxide scale are observed. Long term effects of these interactions are discussed and practical implications...

  15. Operational Plan Ontology Model for Interconnection and Interoperability

    Science.gov (United States)

    Long, F.; Sun, Y. K.; Shi, H. Q.

    2017-03-01

    Aiming at the assistant decision-making system’s bottleneck of processing the operational plan data and information, this paper starts from the analysis of the problem of traditional expression and the technical advantage of ontology, and then it defines the elements of the operational plan ontology model and determines the basis of construction. Later, it builds up a semi-knowledge-level operational plan ontology model. Finally, it probes into the operational plan expression based on the operational plan ontology model and the usage of the application software. Thus, this paper has the theoretical significance and application value in the improvement of interconnection and interoperability of the operational plan among assistant decision-making systems.

  16. Geothermal Power and Interconnection: The Economics of Getting to Market

    Energy Technology Data Exchange (ETDEWEB)

    Hurlbut, D.

    2012-04-01

    This report provides a baseline description of the transmission issues affecting geothermal technologies. The report begins with a comprehensive overview of the grid, how it is planned, how it is used, and how it is paid for. The report then overlays onto this 'big picture' three types of geothermal technologies: conventional hydrothermal systems; emerging technologies such as enhanced engineered geothermal systems (EGS) and geopressured geothermal; and geothermal co-production with existing oil and gas wells. Each category of geothermal technology has its own set of interconnection issues, and these are examined separately for each. The report draws conclusions about each technology's market affinities as defined by factors related to transmission and distribution infrastructure. It finishes with an assessment of selected markets with known geothermal potential, identifying those that offer the best prospects for near-term commercial development and for demonstration projects.

  17. Sensorless speed control of PMSM via adaptive interconnected observer

    Science.gov (United States)

    Ezzat, Marwa; de Leon, Jesus; Glumineau, Alain

    2011-11-01

    In this article, a robust sensorless speed observer-controller scheme for a surface permanent magnet synchronous motor (PMSM) is proposed. First-of-all, following preliminary results in the framework of the induction motor that is less sensible to the position estimation error, an adaptive high gain interconnected observer is designed. It is only supplied by the electrical measurement: the motor currents and voltages. This observer estimates the rotor speed and position, the stator resistance and the load torque. A nonlinear backstepping controller is developed. The above observer is associated with this controller and the complete scheme practical stability proof is given. The overall system is tested by simulation in the framework of an industrial benchmark with a trajectory that particularly checks the motor unobservability condition. Some robustness tests have been carried out. The controller-observer scheme shows good performances in spite of the uncertainties and the unknown load torque.

  18. Fixed Orientation Interconnection Problems: Theory, Algorithms and Applications

    DEFF Research Database (Denmark)

    Zachariasen, Martin

    that electrically independent nets do not intersect each other. Traditional manufacturing technology limits the orientations of the wires to be either horizontal or vertical — and is known as Manhattan architecture. Over the last decade there has been a growing interest in general architectures, where more than two...... perpendicular orientations can be used for routing. This development has made fixed orientation interconnection problems (where an arbitrary set of fixed orientations can be used) interesting from a research point of view. In particular, the problem of computing minimum length networks with fixed orientations...... a significant step forward, both concerning theory and algorithms, for the fixed orientation Steiner tree problem. In addition, the work maintains a close link to applications and generalizations motivated by chip design....

  19. Security Constrained Distributed Optimal Power Flow of Interconnected Power Systems

    Institute of Scientific and Technical Information of China (English)

    BINKOU Alhabib; YU Yixin

    2008-01-01

    The security constrained distributed optimal power flow (DOPF) of interconnected power systems is presented. The centralized OPF problem of the multi-area power systems is decomposed into independent DOPF subproblems, one for each area. The dynamic security region (DSR) to guarantee the transient stability constraints and static voltage stability region (SVSR) constraints, and line current limits are included as constraints. The solutions to the DOPF subproblems of the different areas are coordinated through a pricing mechanism until they converge to the centralized OPF solution. The nonlinear DOPF subproblem is solved by predictor-corrector interior point method (PCIPM). The IEEE three-area RTS-96 system is worked out in order to demonstrate the effectiveness of the proposed method.

  20. Two Component Injection Moulding for Moulded Interconnect Devices

    DEFF Research Database (Denmark)

    Islam, Aminul

    The moulded interconnect devices (MIDs) contain huge possibilities for many applications in micro electro-mechanical-systems because of their potential in reducing the number of components, process steps and finally in miniaturization of the product. Among the available MID process chains, two...... component (2k) injection moulding is one of the most industrially adaptive processes. However, the use of two component injection moulding for MID fabrication, with circuit patterns in sub-millimeter range, is still a big challenge. This book searches for the technical difficulties associated...... with the process and makes attempts to overcome those challenges. In search of suitable polymer materials for MID applications, potential materials are characterized in terms of polymer-polymer bond strength, polymer-polymer interface quality and selective metallization. The experimental results find the factors...

  1. Fixed Orientation Interconnection Problems: Theory, Algorithms and Applications

    DEFF Research Database (Denmark)

    Zachariasen, Martin

    Interconnection problems have natural applications in the design of integrated circuits (or chips). A modern chip consists of billions of transistors that are connected by metal wires on the surface of the chip. These metal wires are routed on a (fairly small) number of layers in such a way that ...... a significant step forward, both concerning theory and algorithms, for the fixed orientation Steiner tree problem. In addition, the work maintains a close link to applications and generalizations motivated by chip design....... paradigm for routing a chip using a general architecture is implemented and tested on a set of benchmark instances; the approach documents the advantages of using more than two fixed orientations in chip design. The last part of the dissertation is concerned with generalizations that are motivated by chip...

  2. A Cost-Effective Architecture For Optical Multistage Interconnection Network

    Directory of Open Access Journals (Sweden)

    Mehrnaz Moudi

    2013-02-01

    Full Text Available In this paper a new architecture for Optical Multistage Interconnection Networks (OMINs has been proposed to avoid crosstalk problem. At the same time, the probablity of losing pass through an optical long connection path is reduced in this architecture. The new architecture is inherent form the standard OMIN by converting two switches of the network to one switch in each row. By reducing the number of switches in new architecture, the reduction in the execution time is considered. The modifying in the number of passes via the same low stage transformation is negligible. The ability of the new architecture to decrease cost and avoid crosstalk has been validated through simulations that show improvement in the network performance in terms of approximately 30% reduction in the execution time.

  3. Health systems in an interconnected world: a view from Nigeria.

    Science.gov (United States)

    Abimbola, Seye

    2011-07-01

    The benefits of an interconnected world for health care remain untapped. As a result of the politics of inequality between rich and poor countries, one or a few health systems are set up as models. Every country, irrespective of political or economic status, should be open to learning from others to build relevant and cost-effective systems. To combat the current global challenge of chronic non-communicable diseases, poor countries have the advantage of flexible health systems that are veritable laboratories of health systems research. Not only can research conducted in these health systems help harness the potential of mobile communication technologies and informal health providers, it can also help rich country health systems adapt to meet the chronic disease challenge.

  4. Asymptotic Stability of Interconnected Passive Non-Linear Systems

    Science.gov (United States)

    Isidori, A.; Joshi, S. M.; Kelkar, A. G.

    1999-01-01

    This paper addresses the problem of stabilization of a class of internally passive non-linear time-invariant dynamic systems. A class of non-linear marginally strictly passive (MSP) systems is defined, which is less restrictive than input-strictly passive systems. It is shown that the interconnection of a non-linear passive system and a non-linear MSP system is globally asymptotically stable. The result generalizes and weakens the conditions of the passivity theorem, which requires one of the systems to be input-strictly passive. In the case of linear time-invariant systems, it is shown that the MSP property is equivalent to the marginally strictly positive real (MSPR) property, which is much simpler to check.

  5. Framework structures of interconnected layers in calcium iron arsenides.

    Science.gov (United States)

    Stürzer, Tobias; Hieke, Christine; Löhnert, Catrin; Nitsche, Fabian; Stahl, Juliane; Maak, Christian; Pobel, Roman; Johrendt, Dirk

    2014-06-16

    The new calcium iron arsenide compounds Ca(n(n+1)/2)(Fe(1-x)M(x))(2+3n)M'(n(n-1)/2)As((n+1)(n+2)/2) (n = 1-3; M = Nb, Pd, Pt; M' = □, Pd, Pt) were synthesized and their crystal structures determined by single-crystal X-ray diffraction. The series demonstrates the structural flexibility of iron arsenide materials, which otherwise prefer layered structures, as is known from the family of iron-based superconductors. In the new compounds, iron arsenide tetrahedral layers are bridged by iron-centered pyramids, giving rise to so far unknown frameworks of interconnected FeAs layers. Channels within the structures are occupied with calcium and palladium or platinum, respectively. Common basic building blocks are identified that lead to a better understanding of the building principles of these structures and their relation to CaFe4As3.

  6. New clustering algorithm for interconnection of MANET and internet

    Institute of Scientific and Technical Information of China (English)

    万象; 姚尹雄; 王豪行

    2004-01-01

    This paper presents core-agent based clustering (CBC) algorithm, a novel heuristic clustering scheme for interconnection of MANET and Internet using power, movement probability and hop length as constraints. CBC includes two phases as cluster initialization and cluster maintenance. In phase one, the selection of clusterheads obeys the first two constraints, whereas the father node of each clustering node is chosen according to above three ones. Phase two concerns the case of node insertion or removal. Easy access and little alteration of conventional mobile IP are some characters of this algorithm. Simulation results demonstrate that CBC has many advantages as less average hop length, good robustness and less overheads, and the clustered network architecture behaves stably when topology changes.

  7. A self-assembled synthesis of carbon nanotubes for interconnects.

    Science.gov (United States)

    Chen, Zexiang; Cao, Guichuan; Lin, Zulun; Koehler, Irmgard; Bachmann, Peter K

    2006-02-28

    We report a novel approach to grow highly oriented, freestanding and structured carbon nanotubes (CNTs) between two substrates, using microwave plasma chemical vapour deposition. Sandwiched, multi-layered catalyst structures are employed to generate such structures. The as-grown CNTs adhere well to both the substrate and the top contact, and provide a low-resistance electric contact between the two. High-resolution scanning electron microscope (SEM) images show that the CNTs grow perpendicular to these surfaces. This presents a simple way to grow CNTs in different, predetermined directions in a single growth step. The overall resistance of a CNT bundle and two CNT-terminal contacts is measured to be about 14.7 k Ω. The corresponding conductance is close to the quantum limit conductance G(0). This illustrates that our new approach is promising for the direct assembly of CNT-based interconnects in integrated circuits (ICs) or other micro-electronic devices.

  8. Perineural tumor spread - Interconnection between spinal and cranial nerves.

    Science.gov (United States)

    Kozić, Duško; Njagulj, Vesna; Gaćeša, Jelena Popadić; Semnic, Robert; Prvulović, Nataša

    2012-12-15

    The secondary neoplastic involvement of the cervical plexus in patients with head and neck malignancies is extremely rare. MR examination of the neck revealed the diffuse neoplastic infiltration of the right C2 root, in a 57-year-old patient with several months long pain in the right ear region and a history of the tongue squamous cell carcinoma. Associated perineural tumor spread and consequent distal involvement of great auricular nerve and vagus nerve were evident. Best of our knowledge, this is the first reported involvement of the cervical plexus in patients with head and neck cancers, associated with the clearly documented interconnection between the cervical plexus and cranial nerves via great auricular nerve.

  9. Interconnecting Multidiscilinary Data Infrastructures: From Federation to Brokering Framework

    Science.gov (United States)

    Nativi, S.

    2014-12-01

    Standardization and federation activities have been played an essential role to push interoperability at the disciplinary and cross-disciplinary level. However, they demonstrated not to be sufficient to resolve important interoperability challenges, including: disciplinary heterogeneity, cross-organizations diversities, cultural differences. Significant international initiatives like GEOSS, IODE, and CEOS demonstrated that a federation system dealing with global and multi-disciplinary domain turns out to be rater complex, raising more the already high entry level barriers for both Providers and Users. In particular, GEOSS demonstrated that standardization and federation actions must be accompanied and complemented by a brokering approach. Brokering architecture and its implementing technologies are able to implement an effective interoperability level among multi-disciplinary systems, lowering the entry level barriers for both data providers and users. This presentation will discuss the brokering philosophy as a complementary approach for standardization and federation to interconnect existing and heterogeneous infrastructures and systems. The GEOSS experience will be analyzed, specially.

  10. Communication Synthesis for Interconnect Minimization in Multicycle Communication Architecture

    Science.gov (United States)

    Huang, Ya-Shih; Hong, Yu-Ju; Huang, Juinn-Dar

    In deep-submicron technology, several state-of-the-art architectural synthesis flows have already adopted the distributed register architecture to cope with the increasing wire delay by allowing multicycle communication. In this article, we regard communication synthesis targeting a refined regular distributed register architecture, named RDR-GRS, as a problem of simultaneous data transfer routing and scheduling for global interconnect resource minimization. We also present an innovative algorithm with regard of both spatial and temporal perspectives. It features both a concentration-oriented path router gathering wire-sharable data transfers and a channel-based time scheduler resolving contentions for wires in a channel, which are in spatial and temporal domain, respectively. The experimental results show that the proposed algorithm can significantly outperform existing related works.

  11. Optimal Multilevel Control for Large Scale Interconnected Systems

    Directory of Open Access Journals (Sweden)

    Ahmed M. A. Alomar,

    2014-04-01

    Full Text Available A mathematical model of the finishing mill as an example of a large scale interconnected dynamical system is represented. First the system response due to disturbance only is presented. Then,the control technique applied to the finishing hot rolling steel mill is the optimal multilevel control using state feedback. An optimal controller is developed based on the integrated system model, but due to the complexity of the controllers and tremendous computational efforts involved, a multilevel technique is used in designing and implementing the controllers .The basis of the multilevel technique is described and a computational algorithm is discussed for the control of the finishing mill system . To reduce the mass storage , memory requirements and the computational time of the processor, a sub-optimal multilevel technique is applied to design the controllers of the finishing mill . Comparison between these controllers and conclusion is presented.

  12. Results on 3D interconnection from AIDA WP3

    Energy Technology Data Exchange (ETDEWEB)

    Moser, Hans-Günther, E-mail: hgm@hll.mpg.de

    2016-09-21

    From 2010 to 2014 the EU funded AIDA project established in one of its work packages (WP3) a network of groups working collaboratively on advanced 3D integration of electronic circuits and semiconductor sensors for applications in particle physics. The main motivation came from the severe requirements on pixel detectors for tracking and vertexing at future Particle Physics experiments at LHC, super-B factories and linear colliders. To go beyond the state-of-the-art, the main issues were studying low mass, high bandwidth applications, with radiation hardness capabilities, with low power consumption, offering complex functionality, with small pixel size and without dead regions. The interfaces and interconnects of sensors to electronic readout integrated circuits are a key challenge for new detector applications.

  13. Results on 3D interconnection from AIDA WP3

    Science.gov (United States)

    Moser, Hans-Günther

    2016-09-01

    From 2010 to 2014 the EU funded AIDA project established in one of its work packages (WP3) a network of groups working collaboratively on advanced 3D integration of electronic circuits and semiconductor sensors for applications in particle physics. The main motivation came from the severe requirements on pixel detectors for tracking and vertexing at future Particle Physics experiments at LHC, super-B factories and linear colliders. To go beyond the state-of-the-art, the main issues were studying low mass, high bandwidth applications, with radiation hardness capabilities, with low power consumption, offering complex functionality, with small pixel size and without dead regions. The interfaces and interconnects of sensors to electronic readout integrated circuits are a key challenge for new detector applications.

  14. Epidemic spreading in interconnected networks: a continuous time approach

    CERN Document Server

    de Arruda, Guilherme Ferraz; Peixoto, Tiago P; Rodrigues, Francisco A; Moreno, Yamir

    2015-01-01

    We present a continuous formulation of epidemic spreading on interconnected networks using a tensorial notation, extending the models of monoplex networks to this context. We derive analytical expressions for the epidemic threshold on the SIS and SIR dynamics, as well as upper and lower bounds for the steady-state. Using the quasi-stationary state (QS) method we show the emergence of two or more phase transitions, and propose an analytical and numerical analysis based on the inverse participation ratio. Furthermore, when mapping the critical epidemic dynamics to the eigenvalue problem, we observe a characteristic transition in the eigenvalue spectra of the supra-contact tensor as a function of the ratio of spreading rates: If the spreading rate within each layer is comparable to the rate across layers, the individual spectra of each layer merge with the coupling between layers. Our formalism provides a mathematical approach to epidemic spreading in multiplex systems and our results reinforce the importance of...

  15. Oxygen assisted interconnection of silver nanoparticles with femtosecond laser radiation

    Energy Technology Data Exchange (ETDEWEB)

    Huang, H.; Zhou, Y., E-mail: nzhou@uwaterloo.ca [Centre for Advanced Materials Joining, University of Waterloo, Waterloo, Ontario N2L 3G1 (Canada); Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, Ontario N2L 3G1 (Canada); Duley, W. W. [Centre for Advanced Materials Joining, University of Waterloo, Waterloo, Ontario N2L 3G1 (Canada); Department of Physics and Astronomy, University of Waterloo, Waterloo, Ontario N2L 3G1 (Canada)

    2015-12-14

    Ablation of silver (Ag) nanoparticles in the direction of laser polarization is achieved by utilizing femtosecond laser irradiation in air at laser fluence ranging from ∼2 mJ/cm{sup 2} to ∼14 mJ/cm{sup 2}. This directional ablation is attributed to localized surface plasmon induced localized electric field enhancement. Scanning electron microscopy observations of the irradiated particles in different gases and at different pressures indicate that the ablation is further enhanced by oxygen in the air. This may be due to the external heating via the reactions of its dissociation product, atomic oxygen, with the surface of Ag particles, while the ablated Ag is not oxidized. Further experimental observations show that the ablated material re-deposits near the irradiated particles and results in the extension of the particles in laser polarization direction, facilitating the interconnection of two well-separated nanoparticles.

  16. Weaves as an Interconnection Fabric for ASIM's and Nanosatellites

    Science.gov (United States)

    Gorlick, Michael M.

    1995-01-01

    Many of the micromachines under consideration require computer support, indeed, one of the appeals of this technology is the ability to intermix mechanical, optical, analog, and digital devices on the same substrate. The amount of computer power is rarely an issue, the sticking point is the complexity of the software required to make effective use of these devices. Micromachines are the nano-technologist's equivalent of 'golden screws'. In other words, they will be piece parts in larger assemblages. For example, a nano-satellite may be composed of stacked silicon wafers where each wafer contains hundreds to thousands of micromachines, digital controllers, general purpose computers, memories, and high-speed bus interconnects. Comparatively few of these devices will be custom designed, most will be stock parts selected from libraries and catalogs. The novelty will lie in the interconnections. For example, a digital accelerometer may be a component part in an adaptive suspension, a monitoring element embedded in the wrapper of a package, or a portion of the smart skin of a launch vehicle. In each case, this device must inter-operate with other devices and probes for the purposes of command, control, and communication. We propose a software technology called 'weaves' that will permit large collections of micromachines and their attendant computers to freely intercommunicate while preserving modularity, transparency, and flexibility. Weaves are composed of networks of communicating software components. The network, and the components comprising it, may be changed even while the software, and the devices it controls, are executing. This unusual degree of software plasticity permits micromachines to dynamically adapt the software to changing conditions and allows system engineers to rapidly and inexpensively develop special purpose software by assembling stock software components in custom configurations.

  17. Initial results for the silicon monolithically interconnected solar cell product

    Science.gov (United States)

    Dinetta, L. C.; Shreve, K. P.; Cotter, J. E.; Barnett, A. M.

    1995-01-01

    This proprietary technology is based on AstroPower's electrostatic bonding and innovative silicon solar cell processing techniques. Electrostatic bonding allows silicon wafers to be permanently attached to a thermally matched glass superstrate and then thinned to final thicknesses less than 25 micron. These devices are based on the features of a thin, light-trapping silicon solar cell: high voltage, high current, light weight (high specific power) and high radiation resistance. Monolithic interconnection allows the fabrication costs on a per watt basis to be roughly independent of the array size, power or voltage, therefore, the cost effectiveness to manufacture solar cell arrays with output powers ranging from milliwatts up to four watts and output voltages ranging from 5 to 500 volts will be similar. This compares favorably to conventionally manufactured, commercial solar cell arrays, where handling of small parts is very labor intensive and costly. In this way, a wide variety of product specifications can be met using the same fabrication techniques. Prototype solar cells have demonstrated efficiencies greater than 11%. An open-circuit voltage of 5.4 volts, fill factor of 65%, and short-circuit current density of 28 mA/sq cm at AM1.5 illumination are typical. Future efforts are being directed to optimization of the solar cell operating characteristics as well as production processing. The monolithic approach has a number of inherent advantages, including reduced cost per interconnect and increased reliability of array connections. These features make this proprietary technology an excellent candidate for a large number of consumer products.

  18. Giga bit per second Differential Scheme for High Speed Interconnect

    Directory of Open Access Journals (Sweden)

    Mandeep Singh Narula

    2012-02-01

    Full Text Available The performance of many digital systems today is limited by the interconnection bandwidth between chips. Although the processing performance of a single chip has increased dramatically since the inception of the integrated circuit technology, the communication bandwidth between chips has not enjoyed as much benefit. Most CMOS chips, when communicating off-chip, drive un terminated lines with full-swing CMOS drivers. Such full-swing CMOS interconnect ring-up the line, and hence has a bandwidth that is limited by the length of the line rather than the performance of the semiconductor technology. Thus, as VLSI technology scales, the pin bandwidth does not improve with the technology, but rather remains limited by board and cable geometry, making off-chip bandwidth an even more critical bottleneck. In order to increase the I/O Bandwidth, some efficient high speed signaling standard must be used which considers the line termination, signal integrity, power dissipation, noise immunity etc In this work, a transmitter has been developed for high speed off chip communication. It consists of low speed input buffer, serializer which converts parallel input data into serial data and a current mode driver which converts the voltage mode input signals into current over the transmission line. Output of 32 low speed input buffers is fed to two serializer, each serializer converting 16 bit parallel data into serial data stream. Output of two serializers is fed to LVDS current mode driver. The serial link technique used in this work is the time division multiplex (TDM and point-to-point technique. It means that the low-speed parallel signals are transferred to the high-speed serial signal at the transmitter end and the high-speed serial signal is transferred to the low-speed parallel signals at the receiver end. Serial link is the design of choice in any application where the cost of the communication channel is high and duplicating the links in large numbers is

  19. Giga bit per second Differential Scheme for High Speed Interconnect

    Directory of Open Access Journals (Sweden)

    Mandeep Singh Narula

    2012-03-01

    Full Text Available The performance of many digital systems today is limited by the interconnection bandwidth between chips. Although the processing performance of a single chip has increased dramatically since the inception of the integrated circuit technology, the communication bandwidth between chips has not enjoyed as much benefit. Most CMOS chips, when communicating off-chip, drive unterminated lines with full-swing CMOS drivers. Such full-swing CMOS interconnect ring-up the line, and hence has a bandwidth that is limited by the length of the line rather than the performance of the semiconductor technology. Thus, as VLSI technology scales, the pin bandwidth does not improve with the technology, but rather remains limited by board and cable geometry, making off-chip bandwidth an even more critical bottleneck. In order to increase the I/O Bandwidth, some efficient high speed signaling standard must be used which considers the line termination, signal integrity, power dissipation, noise immunity etc In this work, a transmitter has been developed for high speed offchip communication. It consists of low speed input buffer, serializer which converts parallel input data into serial data and a current mode driver which converts the voltage mode input signals into current over the transmission line. Output of 32 low speed input buffers is fed to two serializer, each serializer converting 16 bit parallel data into serial data stream. Output of two serializers is fed to LVDS current mode driver. The serial link technique used in this work is the time division multiplex (TDM and point-to-point technique. It means that the low-speed parallel signals are transferred to the high-speed serial signal at the transmitter end and the high-speed serial signal is transferred to the low-speed parallel signals at the receiver end. Serial link is the design of choice in any application where the cost of the communication channel is high and duplicating the links in large numbers is

  20. Handbook of adhesive bonded structural repair

    CERN Document Server

    Wegman, Raymond F

    1992-01-01

    Provides repair methods for adhesive bonded and composite structures; identifies suitable materials and equipment for repairs; describes damage evaluation criteria and techniques, and methods of inspection before and after repair.

  1. Clamp wins pipe repair prize

    Energy Technology Data Exchange (ETDEWEB)

    Anon.

    2001-04-01

    This paper describes the permanent pipeline repair system, developed by Tekmar, which is powered by seawater hydraulics and is easily installed and tested by any workclass remotely operated vehicle (rov). Details are given of the two main components of the system, namely, the diverless high pressure split repair clamp and the rov-operated tool to install it.

  2. The journey of DNA repair

    OpenAIRE

    Saini, Natalie

    2015-01-01

    21 years ago, the DNA Repair Enzyme was declared “Molecule of the Year”. Today, we are celebrating another “year of repair”, with the 2015 Nobel Prize in Chemistry being awarded to Aziz Sancar, Tomas Lindahl and Paul Modrich for their collective work on the different DNA repair pathways.

  3. Nucleotide excision repair in yeast

    NARCIS (Netherlands)

    Eijk, Patrick van

    2012-01-01

    Nucleotide Excision Repair (NER) is a conserved DNA repair pathway capable of removing a broad spectrum of DNA damage. In human cells a defect in NER leads to the disorder Xeroderma pigmentosum (XP). The yeast Saccharomyces cerevisiae is an excellent model organism to study the mechanism of NER. The

  4. Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects

    Energy Technology Data Exchange (ETDEWEB)

    Meyer, M.A.

    2007-07-12

    This thesis provides a methodology for the investigation of electromigration (EM) in Cu-based interconnects. An experimental framework based on in-situ scanning electron microscopy (SEM) investigations was developed for that purpose. It is capable to visualize the EM-induced void formation and evolution in multi-level test structures in real time. Different types of interconnects were investigated. Furthermore, stressed and unstressed samples were studied applying advanced physical analysis techniques in order to obtain additional information about the microstructure of the interconnects as well as interfaces and grain boundaries. These data were correlated to the observed degradation phenomena. Correlations of the experimental results to recently established theoretical models were highlighted. Three types of Cu-based interconnects were studied. Pure Cu interconnects were compared to Al-alloyed (CuAl) and CoWP-coated interconnects. The latter two represent potential approaches that address EM-related reliability concerns. It was found that in such interconnects the dominant diffusion path is no longer the Cu/capping layer interface for interconnects as in pure Cu interconnects. Instead, void nucleation occurs at the bottom Cu/barrier interface with significant effects from grain boundaries. Moreover, the in-situ investigations revealed that the initial void nucleation does not occur at the cathode end of the lines but several micrometers away from it. The mean times-to-failure of CuAl and CoWP-coated interconnects were increased by at least one order of magnitude compared to Cu interconnects. The improvements were attributed to the presence of foreign metal atoms at the Cu/capping layer interface. Post-mortem EBSD investigations were used to reveal the microstructure of the tested samples. The data were correlated to the in-situ observations. (orig.)

  5. Rethinking transcription coupled DNA repair.

    Science.gov (United States)

    Kamarthapu, Venu; Nudler, Evgeny

    2015-04-01

    Nucleotide excision repair (NER) is an evolutionarily conserved, multistep process that can detect a wide variety of DNA lesions. Transcription coupled repair (TCR) is a subpathway of NER that repairs the transcribed DNA strand faster than the rest of the genome. RNA polymerase (RNAP) stalled at DNA lesions mediates the recruitment of NER enzymes to the damage site. In this review we focus on a newly identified bacterial TCR pathway in which the NER enzyme UvrD, in conjunction with NusA, plays a major role in initiating the repair process. We discuss the tradeoff between the new and conventional models of TCR, how and when each pathway operates to repair DNA damage, and the necessity of pervasive transcription in maintaining genome integrity. Copyright © 2015 Elsevier Ltd. All rights reserved.

  6. Reward optimization of a repairable system

    Energy Technology Data Exchange (ETDEWEB)

    Castro, I.T. [Departamento de Matematicas, Facultad de Veterinaria, Universidad de Extremadura, Avenida de la Universidad, s/n. 10071 Caceres (Spain)]. E-mail: inmatorres@unex.es; Perez-Ocon, R. [Departamento de Estadistica e Investigacion Operativa, Facultad de Ciencias, Universidad de Granada, Avenida de Severo Ochoa, s/n. 18071 Granada (Spain)]. E-mail: rperezo@ugr.es

    2006-03-15

    This paper analyzes a system subject to repairable and non-repairable failures. Non-repairable failures lead to replacement of the system. Repairable failures, first lead to repair but they lead to replacement after a fixed number of repairs. Operating and repair times follow phase type distributions (PH-distributions) and the pattern of the operating times is modelled by a geometric process. In this context, the problem is to find the optimal number of repairs, which maximizes the long-run average reward per unit time. To this end, the optimal number is determined and it is obtained by efficient numerical procedures.

  7. Wound repair in Pocillopora

    Science.gov (United States)

    Rodríguez-Villalobos, Jenny Carolina; Work, Thierry M.; Calderon-Aguileraa, Luis Eduardo

    2016-01-01

    Corals routinely lose tissue due to causes ranging from predation to disease. Tissue healing and regeneration are fundamental to the normal functioning of corals, yet we know little about this process. We described the microscopic morphology of wound repair in Pocillopora damicornis. Tissue was removed by airbrushing fragments from three healthy colonies, and these were monitored daily at the gross and microscopic level for 40 days. Grossly, corals healed by Day 30, but repigmentation was not evident at the end of the study (40 d). On histology, from Day 8 onwards, tissues at the lesion site were microscopically indistinguishable from adjacent normal tissues with evidence of zooxanthellae in gastrodermis. Inflammation was not evident. P. damicornis manifested a unique mode of regeneration involving projections of cell-covered mesoglea from the surface body wall that anastomosed to form gastrovascular canals.

  8. Groin hernia repair

    DEFF Research Database (Denmark)

    Kehlet, Henrik; Aasvang, Eske

    2005-01-01

    The choice of anesthesia for groin hernia repair is between general, regional (epidural or spinal), and local anesthesia. Existing data from large consecutive patient series and randomized studies have shown local anesthesia to be the method of choice because it can be performed by the surgeon......, does not necessarily require an attending anesthesiologist, translates into the shortest recovery (bypassing the postanesthesia care unit), has the lowest cost, and has the lowest postoperative morbidity regarding risk of urinary retention. Spinal anesthesia has no documented benefits for this small...... scientific data to support the choice of anesthesia, large epidemiologic and nationwide information from databases show an undesirable high (about 10-20%) use of spinal anesthesia and low (about 10%) use of local infiltration anesthesia. Surgeons and anesthesiologists should therefore adjust their anesthesia...

  9. Interconnection of the power systems of the far east by using line HVDC transmission

    Directory of Open Access Journals (Sweden)

    Ilya Dydchenko

    2014-04-01

    Full Text Available The possibility of the interconnection continental part of the Russian Far East with the energy systems of Sakhalin and Japan. Indicate the technical possibility of this decision. The comparative analysis of the prospects for the construction of transmission lines of AC and DC. Proved the advantage of applying the lines of direct current for the interconnection of the Far East.

  10. Review: Perspectives on the metallic interconnects for solid oxide fuel cells

    Institute of Scientific and Technical Information of China (English)

    ZHUWei-zhong; YANMi

    2004-01-01

    The various stages and progress in the development of interconnect materials for solid oxide fuel cells (SOFCs )over the last two decades are reviewed. The criteria for the application of materials as interconnects are highlighted. Interconnects based on lanthanum chromite ceramics demonstrate many inherent drawbacks and therefore are only useful for SOFCs operating around 1000℃. The advance in the research of anode-supported flat SOFCs facilitates the replacement of ceramic interconnects with metallic ones due to their significantly lowered working temperature. Besides, interconnects made of metals or alloys offer many advantages as compared to their ceramic counterpart. The oxidation response and thermal expansion behaviors of various prospective metallic interconnects are examined and evaluated. The minimization of contact resistance to achieve desired and reliable stack performance during their projected lifetime still remains a highly challenging issue with metallic interconnects. Inexpensive coating materials and techniques may play a key role in promoting the commercialization of SOFC stack whose interconnects are constructed of some current commercially available alloys. Alternatively, development of new metallic materials that are capable of forming stable oxide scales with sluggish growth rate and sufficient electrical conductivity is called for.

  11. Technology alternatives towards low-cost and high-speed interconnect manufacturing

    NARCIS (Netherlands)

    Roozeboom, F.; Kniknie, B.; Lankhorst, A.M.; Winands, G.; Poodt, P.; Dingemans, G.; Keuning, W.; Kessels, W.M.M.; Bullema, J.E.; Bressers, P.M.M.C.; Oosterhuis, G.; Mueller, M.; Huis in 't Veld, Bert

    2012-01-01

    In this work we will review our recent work on novel alternative and disruptive technology concepts with industrial potential for cost-effective and high-speed interconnect manufacturing, in particular on the creation (drilling and filling) of advanced interconnects like TSVs. These technologies are

  12. 77 FR 25088 - Extension of the Commission's Rules Regarding Outage Reporting to Interconnected Voice Over...

    Science.gov (United States)

    2012-04-27

    ... reporting requirements of the Commission's rules to interconnected Voice over Internet Protocol (VoIP... service. Unlike other outages of voice service, VoIP outages are not reported to the Commission because... clearly imposes a ``duty'' on ``each IP-enabled voice service [interconnected VoIP] provider to provide 9...

  13. Linear State-Space Identification of Interconnected Systems: A structured approach

    NARCIS (Netherlands)

    Torres Tapia, P.I.

    2014-01-01

    In this thesis, three novel state-space identification algorithms for linear interconnected systems are proposed. The computational complexity and the topology reconstruction of the interconnected system are addressed. Possible applications of this theory can be found in Biology, Economics, Transpor

  14. 14 CFR 121.1111 - Electrical wiring interconnection systems (EWIS) maintenance program.

    Science.gov (United States)

    2010-01-01

    ... Airworthiness and Safety Improvements § 121.1111 Electrical wiring interconnection systems (EWIS) maintenance... unless the maintenance program for that airplane includes inspections and procedures for electrical... 14 Aeronautics and Space 3 2010-01-01 2010-01-01 false Electrical wiring interconnection...

  15. 78 FR 62360 - PJM Interconnection, L.L.C.; Notice of Technical Conference

    Science.gov (United States)

    2013-10-21

    ... From the Federal Register Online via the Government Publishing Office DEPARTMENT OF ENERGY Federal Energy Regulatory Commission PJM Interconnection, L.L.C.; Notice of Technical Conference Federal Energy.... to approximately 1:00 p.m., to consider issues related to PJM Interconnection, L.L.C.'s...

  16. 49 CFR 236.514 - Interconnection of cab signal system with roadway signal system.

    Science.gov (United States)

    2010-10-01

    ... 49 Transportation 4 2010-10-01 2010-10-01 false Interconnection of cab signal system with roadway signal system. 236.514 Section 236.514 Transportation Other Regulations Relating to Transportation... Interconnection of cab signal system with roadway signal system. The automatic cab signal system shall...

  17. 75 FR 45626 - PJM Interconnection, L.L.C.; Notice of Petition for Declaratory Order

    Science.gov (United States)

    2010-08-03

    ... From the Federal Register Online via the Government Publishing Office DEPARTMENT OF ENERGY Federal Energy Regulatory Commission PJM Interconnection, L.L.C.; Notice of Petition for Declaratory Order July... Commission's (Commission) Rules of Practice and Procedure (18 CFR 385.207), PJM Interconnection, L.L.C....

  18. Interconnection of nanoparticles within 2D superlattices of PbS/oleic acid thin films.

    Science.gov (United States)

    Simon, Paul; Bahrig, Lydia; Baburin, Igor A; Formanek, Petr; Röder, Falk; Sickmann, Jan; Hickey, Stephen G; Eychmüller, Alexander; Lichte, Hannes; Kniep, Rüdiger; Rosseeva, Elena

    2014-05-21

    Make it connected! 2D close-packed layers of inorganic nanoparticles are interconnected by organic fibrils of oleic acid as clearly visualized by electron holography. These fibrils can be mineralised by PbS to transform an organic-inorganic framework to a completely interconnected inorganic semiconducting 2D array.

  19. 75 FR 20590 - PJM Interconnection, L.L.C., Complainant, v. Midwest Independent Transmission, System Operator...

    Science.gov (United States)

    2010-04-20

    ... From the Federal Register Online via the Government Publishing Office DEPARTMENT OF ENERGY Federal Energy Regulatory Commission PJM Interconnection, L.L.C., Complainant, v. Midwest Independent....S.C. 824(e), 825(e) and 825(h), PJM Interconnection, L.L.C. (PJM or Complainant) filed a...

  20. 77 FR 30002 - Primary Power, LLC v. PJM Interconnection, LLC; Notice of Complaint

    Science.gov (United States)

    2012-05-21

    ... From the Federal Register Online via the Government Publishing Office DEPARTMENT OF ENERGY Federal Energy Regulatory Commission Primary Power, LLC v. PJM Interconnection, LLC; Notice of Complaint Take... against PJM Interconnection, LLC (PJM or Respondent) for the Respondent's failure to designate...

  1. 77 FR 52320 - Notice of Cancellation of Environmental Impact Statement for the Proposed Interconnection of the...

    Science.gov (United States)

    2012-08-29

    ... the EIS in the Federal Register on November 27, 2009 (74 FR 62298), and started the EIS process. A... Interconnection of the Buffalo Ridge III Wind Project, Brookings and Deuel Counties, SD (DOE/EIS-0437) AGENCY... (EIS) under the National Environmental Policy Act (NEPA) on an interconnection request by...

  2. 77 FR 16218 - Notice of Petition for Declaratory Order: PJM Interconnection, L.L.C.

    Science.gov (United States)

    2012-03-20

    ... From the Federal Register Online via the Government Publishing Office DEPARTMENT OF ENERGY Federal Energy Regulatory Commission Notice of Petition for Declaratory Order: PJM Interconnection, L.L.C. Take... (Commission) Rules of Practice and Procedure, 18 CFR 385.207, PJM Interconnection, L.L.C. (PJM) filed...

  3. 77 FR 21094 - Viridity Energy, Inc. v. PJM Interconnection, L.L.C.; Notice of Complaint

    Science.gov (United States)

    2012-04-09

    ... From the Federal Register Online via the Government Publishing Office DEPARTMENT OF ENERGY Federal Energy Regulatory Commission Viridity Energy, Inc. v. PJM Interconnection, L.L.C.; Notice of Complaint... Interconnection, L.L.C. (Respondent) alleging that a portion of a provision in the Respondent's Open...

  4. 76 FR 72699 - PJM Interconnection, LLC; Notice of Petition for Declaratory Order

    Science.gov (United States)

    2011-11-25

    ... From the Federal Register Online via the Government Publishing Office DEPARTMENT OF ENERGY Federal Energy Regulatory Commission PJM Interconnection, LLC; Notice of Petition for Declaratory Order Take... Federal Energy Regulatory Commission (Commission), 18 CFR 385.207(a)(2) (2011), PJM Interconnection,...

  5. 47 CFR 101.137 - Interconnection of private operational fixed point-to-point microwave stations.

    Science.gov (United States)

    2010-10-01

    ... 47 Telecommunication 5 2010-10-01 2010-10-01 false Interconnection of private operational fixed point-to-point microwave stations. 101.137 Section 101.137 Telecommunication FEDERAL COMMUNICATIONS....137 Interconnection of private operational fixed point-to-point microwave stations....

  6. 75 FR 16449 - Central Transmission, LLC v. PJM Interconnection L.L.C.; Notice of Complaint

    Science.gov (United States)

    2010-04-01

    ... From the Federal Register Online via the Government Publishing Office DEPARTMENT OF ENERGY Federal Energy Regulatory Commission Central Transmission, LLC v. PJM Interconnection L.L.C.; Notice of Complaint...) filed a complaint against the PJM Interconnection L.L.C. (PJM) pursuant to section 206 of the...

  7. 76 FR 57733 - Notice of Cancellation of Environmental Impact Statement for the Interconnection of the Hualapai...

    Science.gov (United States)

    2011-09-16

    ... Register on September 15, 2009 (74 FR 47245). Public scoping meetings were held subsequent to the Notice of... Interconnection of the Hualapai Valley Solar Project, Mohave County, AZ (DOE/EIS-0434) AGENCY: Western Area Power... National Environmental Policy Act (NEPA) on an interconnection request by the Hualapai Valley Solar,...

  8. Technology alternatives towards low-cost and high-speed interconnect manufacturing

    NARCIS (Netherlands)

    Roozeboom, F.; Kniknie, B.; Lankhorst, A.M.; Winands, G.; Poodt, P.; Dingemans, G.; Keuning, W.; Kessels, W.M.M.; Bullema, J.E.; Bressers, P.M.M.C.; Oosterhuis, G.; Mueller, M.; Huis in 't Veld, A.J.

    2012-01-01

    In this work we will review our recent work on novel alternative and disruptive technology concepts with industrial potential for cost-effective and high-speed interconnect manufacturing, in particular on the creation (drilling and filling) of advanced interconnects like TSVs. These technologies are

  9. One-step fabrication of microfluidic chips with in-plane, adhesive-free interconnections

    DEFF Research Database (Denmark)

    Sabourin, David; Dufva, Martin; Jensen, Thomas Glasdam

    2010-01-01

    by direct micromilling. Upon UV-assisted bonding the tubing is trapped in the ports of the PMMA chip and forms an integrated, in-plane and adhesive-free interconnection. The interconnections support the average pressure of 6.1 bar and can be made with small dead volumes. A comparison is made to a similar...

  10. 76 FR 42534 - Mandatory Reliability Standards for Interconnection Reliability Operating Limits; System...

    Science.gov (United States)

    2011-07-19

    ... Reliability Operating Limits; System Restoration Reliability Standards AGENCY: Federal Energy Regulatory... necessary to analyze and monitor Interconnection Reliability Operating Limits (IROL) within its Wide-Area... Interconnection Reliability Operating Limits, Order No. 748, 134 FERC ] 61,213 (2011). \\2\\ The term...

  11. Method and apparatus for interconnecting processors in a hyper-dimensional array

    Energy Technology Data Exchange (ETDEWEB)

    Thiel, T.; Clayton, R.; Feyman, C.; Kahle, B.

    1989-02-14

    This patent describes a parallel processor having an array of integrated circuits, each being addressed by a multibit binary address and comprising at least one processor and being interconnected to each of its nearest neighbors in a pattern of a Boolean cube of more than three dimensions, apparatus for interconnecting the integrated circuits on boards and backplanes comprising: means for interconnecting on each circuit board the integrated circuits which are nearest neighbors in dimensions one through L; means for interconnecting on each backplane the integrated circuits which are nearest neighbors in dimensions L+1 through M; means for interconnecting from one backplane to another the integrated circuits which are nearest neighbors in dimensions M+1 through N; and means for adjusting the clock cycle during the routing of messages between processors in accordance with the dimension of the processors between which the message is being routed.

  12. An approach to the optical interconnect made in standard CMOS process

    Institute of Scientific and Technical Information of China (English)

    Yu Changliang; Mao Luhong; Xiao Xindong; Xie Sheng; Zhang Shilin

    2009-01-01

    A standard CMOS optical interconnect is proposed, including an octagonal-annular emitter, a field oxide,metal 1-PSG/BPSG-metal 2 dual waveguide, and an ultra high-sensitivity optical receiver integrated with a fingered P/N-well/P-sub dual photodiode detector. The optical interconnect is implemented in a Chartered 3.3-V 0.35-μm standard analog CMOS process with two schemes for the research of the substrate noise coupling effect on the optical interconnect performance: with or without a GND-guardring around the emitter. The experiment results show that the optical interconnect can work at 100 kHz, and it is feasible to implement optical interconnects in standard CMOS processes.

  13. One-step fabrication of microfluidic chips with in-plane, adhesive-free interconnections

    DEFF Research Database (Denmark)

    Sabourin, David; Dufva, Martin; Jensen, Thomas Glasdam;

    2010-01-01

    by direct micromilling. Upon UV-assisted bonding the tubing is trapped in the ports of the PMMA chip and forms an integrated, in-plane and adhesive-free interconnection. The interconnections support the average pressure of 6.1 bar and can be made with small dead volumes. A comparison is made to a similar......A simple method for creating interconnections to a common microfluidic device material, poly(methyl methacrylate) (PMMA), is presented. A press-fit interconnection is created between oversized, deformable tubing and complementary, undersized semi-circular ports fabricated into PMMA bonding surfaces...... interconnection approach which uses tubing to act as a gasket between a needle and port on the microfluidic chip....

  14. Non-fragile guaranteed cost control for uncertain neutral large-scale interconnected systems

    Institute of Scientific and Technical Information of China (English)

    Dan Zhao; Qingling Zhang; Heli Hu; Chunyuan Zhao

    2010-01-01

    This paper focuses on the problem of non-fragile decentralized guaranteed cost control for uncertain neutral large-scale interconnected systems with time-varying delays in state,control input and interconnections.A novel scheme,viewing the interconnections with time-varying delays as effective information but not disturbances,is developed.Based on Lyapunov stability theory,using various techniques of decomposing and magnifying matrices,a design method of the non-fragile decentralized guaranteed cost controller for unperturbed neutral large-scale interconnected systems is proposed and the guaranteed cost is presented.The further results are derived for the uncertain case from the criterion of unperturbed neutral large-scale interconnected systems.Finally,an illustrative example shows that the results are significantly better than the existing results in the literatures.

  15. CRAIS:A Crossbar-Based Interconnection Scheme on FPGA for Big Data

    Institute of Scientific and Technical Information of China (English)

    王超; 李曦; 周学海

    2015-01-01

    On-chip interconnection has posed significant challenges in multiprocessor system on chip (MPSoC) design paradigm, especially in big data era. With respect to the state-of-the-art, crossbar-based interconnection methodologies are still efficient for FPGA-based small-scale heterogeneous MPSoCs. This paper proposes a crossbar-based on-chip inter-connection scheme, named CRAIS. CRAIS utilizes reconfigurable crossbar interconnections between microprocessors and intellectual property (IP) cores in MPSoC. The hardware interconnection can be dynamically reconfigured during execution. Empirical results on FPGA prototype demonstrate that CRAIS can achieve more than 7X speedup compared with the state-of-the-art StarNet approach, while it only utilizes 21%∼35%hardware resources of StarNet.

  16. Thermo-electric Analysis of the Interconnection of the LHC main Superconducting Bus Bars

    CERN Document Server

    Granieri, P P; Casali, M; Bottura, L; Siemko, A

    2013-01-01

    Spurred by the question of the maximum allowable energy for the operation of the Large Hadron Collider (LHC), we have progressed in the understanding of the thermo-electric behavior of the 13 kA superconducting bus bars interconnecting its main magnets. A deep insight of the underlying mechanisms is required to ensure the protection of the accelerator against undesired effects of resistive transitions. This is especially important in case of defective interconnections which can jeopardize the operation of the whole LHC. In this paper we present a numerical model of the interconnections between the main dipole and quadrupole magnets, validated against experimental tests of an interconnection sample with a purposely built-in defect. We consider defective interconnections featuring a lack of bonding among the superconducting cables and the copper stabilizer components, such as those that could be present in the machine. We evaluate the critical defect length limiting the maximum allowable current for powering th...

  17. SEMICONDUCTOR DEVICES: A novel closed-form resistance model for trapezoidal interconnects

    Science.gov (United States)

    Baojun, Chen; Zhen'an, Tang; Tiejun, Yu

    2010-08-01

    A closed-form model for the frequency-dependent per-unit-length resistance of trapezoidal cross-sectional interconnects is presented. The frequency-dependent per-unit-length resistance R(f) of a trapezoidal interconnect line is first obtained by a numerical method. Using the method we quantify the trapezoid edge effect on the resistance of the interconnect and the current density distribution in the cross section. Based on this strict numerical result, a novel closed-form model R(f) for a single trapezoidal interconnect is fitted out using the Levenberg-Marquardt method. This R(f) can be widely used for analyzing on-chip interconnects when the frequency is changing. The model is computationally very efficient with respect to the numerical method, and the results are found to be accurate.

  18. How to repair an episiotomy.

    Science.gov (United States)

    Steen, Mary; Cummins, Bernie

    2016-02-17

    Rationale and key points Skilful repair of an episiotomy is an important aspect of maternal health care. It is essential that midwives and doctors have the knowledge and skills to undertake this procedure in a safe and effective manner. ▶ An episiotomy should be repaired promptly to reduce blood loss and prevent infection. ▶ Repair of an episiotomy is undertaken in three stages: repair of the vaginal mucosa, repair of the muscle layer and repair of the skin layer. ▶ Adequate pain relief should be provided before suturing. Reflective activity Clinical skills articles can help update your practice and ensure it remains evidence based. Apply this article to your practice. Reflect on and write a short account of: 1. Why a rectal examination is recommended before and following repair of an episiotomy. 2. What you would do to improve your suturing skills. 3. The factors that may prevent or delay an episiotomy from healing. Subscribers can upload their reflective accounts at rcni.com/portfolio .

  19. DNA repair in Chromobacterium violaceum.

    Science.gov (United States)

    Duarte, Fábio Teixeira; Carvalho, Fabíola Marques de; Bezerra e Silva, Uaska; Scortecci, Kátia Castanho; Blaha, Carlos Alfredo Galindo; Agnez-Lima, Lucymara Fassarella; Batistuzzo de Medeiros, Silvia Regina

    2004-03-31

    Chromobacterium violaceum is a Gram-negative beta-proteobacterium that inhabits a variety of ecosystems in tropical and subtropical regions, including the water and banks of the Negro River in the Brazilian Amazon. This bacterium has been the subject of extensive study over the last three decades, due to its biotechnological properties, including the characteristic violacein pigment, which has antimicrobial and anti-tumoral activities. C. violaceum promotes the solubilization of gold in a mercury-free process, and has been used in the synthesis of homopolyesters suitable for the production of biodegradable polymers. The complete genome sequence of this organism has been completed by the Brazilian National Genome Project Consortium. The aim of our group was to study the DNA repair genes in this organism, due to their importance in the maintenance of genomic integrity. We identified DNA repair genes involved in different pathways in C. violaceum through a similarity search against known sequences deposited in databases. The phylogenetic analyses were done using programs of the PHILYP package. This analysis revealed various metabolic pathways, including photoreactivation, base excision repair, nucleotide excision repair, mismatch repair, recombinational repair, and the SOS system. The similarity between the C. violaceum sequences and those of Neisserie miningitidis and Ralstonia solanacearum was greater than that between the C. violaceum and Escherichia coli sequences. The peculiarities found in the C. violaceum genome were the absence of LexA, some horizontal transfer events and a large number of repair genes involved with alkyl and oxidative DNA damage.

  20. Anisotropy of low dielectric constant materials and reliability of copper/low-k interconnects

    Science.gov (United States)

    Cho, Taiheui

    2000-10-01

    Cu/low-k material interconnects are a solution to overcome problems that occur in deep submicron Al/SiO2 based interconnects. Several challenges have to be resolved before successfully integrating copper and low-k dielectric materials into interconnects. In this work, Cu and several low-k polymers were used for interconnect applications and their effects on interconnect performance were investigated. Dielectric anisotropy is one of the factors that affect interconnect performance. Two fluorinated polymers, a rigid rod-like polyimide (Dupont FPI-136M) and a flexible poly(aryl ether) (Allied Signal FLARE 1.51) were used to investigate the relationship between dielectric anisotropy and molecular orientation. The dielectric anisotropy of the rigid rod-like polyimide was reduced relative to that in blanket films when it was confined in submicron trenches. Such a reduction was not observed in the flexible polymer. Polarized FTIR experiments showed that when rigid rod-like polymer was confined in submicron trenches polymer chains preferentially oriented parallel to metal lines. The preferential orientation reduced the in-plane dielectric constant of the polymer. A barrier layer has to be used to prevent Cu diffusion into an interlayer dielectric material. Ta, TaN, and TaSiN were used to investigate the relationship between barrier capability and microstructures using a bias temperature stress. TaSiN performed best because TaSiN was amorphous, followed by TaN then Ta because TaN had impurities segregated in grain boundaries. When Cu/BCB interconnects were fabricated and their reliability was investigated with the bias temperature stress, some of the interconnect structures performed properly and their life times were comparable to those of Cu/SiO2 interconnects, while other interconnect structures rapidly failed because the Cu readily diffused through defects in the barrier. The defects were introduced during chemical-mechanical polishing and plasma etching processes.

  1. 40 CFR 798.5500 - Differential growth inhibition of repair proficient and repair deficient bacteria: “Bacterial DNA...

    Science.gov (United States)

    2010-07-01

    ... repair proficient and repair deficient bacteria: âBacterial DNA damage or repair tests.â 798.5500 Section... inhibition of repair proficient and repair deficient bacteria: “Bacterial DNA damage or repair tests.” (a... killing or growth inhibition of repair deficient bacteria in a set of repair proficient and deficient...

  2. Bone repair and stem cells.

    Science.gov (United States)

    Ono, Noriaki; Kronenberg, Henry M

    2016-10-01

    Bones are an important component of vertebrates; they grow explosively in early life and maintain their strength throughout life. Bones also possess amazing capabilities to repair-the bone is like new without a scar after complete repair. In recent years, a substantial progress has been made in our understanding on mammalian bone stem cells. Mouse genetic models are powerful tools to understand the cell lineage, giving us better insights into stem cells that regulate bone growth, maintenance and repair. Recent findings about these stem cells raise new questions that require further investigations.

  3. Repairing and Upgrading Your PC

    CERN Document Server

    Thompson, Robert

    2009-01-01

    Repairing and Upgrading Your PC delivers start-to-finish instructions, simple enough for even the most inexperienced PC owner, for troubleshooting, repairing, and upgrading your computer. Written by hardware experts Robert Bruce Thompson and Barbara Fritchman Thompson, this book covers it all: how to troubleshoot a troublesome PC, how to identify which components make sense for an upgrade, and how to tear it all down and put it back together. This book shows how to repair and upgrade all of your PC's essential components.

  4. Laparoscopic repair of incisional hernia.

    Science.gov (United States)

    Lau, H; Lee, F; Patil, N G

    2001-09-01

    A 75-year-old man developed an incisional hernia over the upper abdomen following a wedge resection of a gastric stromal tumour in 1996. This is the first published report of a successful repair of an incisional hernia via a laparoscopic intraperitoneal on-lay technique using GORE-TEX DualMesh material in Hong Kong. Compared with conventional open repair of incisional hernia, long incisions and wound tension are avoided using the laparoscopic approach. This translates into a reduced risk of wound-related complications and facilitates recovery. In selected cases, minimally invasive surgery is a safe technique for the repair of incisional hernias.

  5. [Inguinal and femoral hernia repair].

    Science.gov (United States)

    Geissler, B; Anthuber, M

    2011-05-01

    With an incidence of 200,000 new cases per year in Germany, inguinal hernia has a significant socioeconomic impact. The 2009 guidelines from the European Hernia Society established treatment recommendations. Hernia repair is based on reinforcing the posterior wall of the inguinal canal by suture or mesh repair by an anterior or posterior approach. Lightweight mesh reduces recurrence rates and is the treatment of choice even in primary hernias. Laparoscopic hernia repair is associated with specific risks but is superior in postoperative pain and earlier return to work.

  6. Large myelomeningocele repair

    Directory of Open Access Journals (Sweden)

    Farideh Nejat

    2011-01-01

    Full Text Available Background: Wound closure is accomplished in most cases of myelomeningocele (MMC by undermining of the skin edges surrounding the defect. However, large defects cannot be closed reliably by this simple technique. Due to the technical challenge associated with large MMC, surgeons have devised different methods for repairing large defects. In this paper, we report our experience of managing large defects, which we believe bears a direct relationship to decrease the incidence of wound complications. Materials and Methods: Forty children with large MMCs underwent surgical repair and represent our experience. We recommend using all hairy skin around the defect as a way to decrease the tension on the edges of the wound and the possible subsequent necrosis. It is our experience that vertical incision on one or two flanks parallel to the midline can decrease the tension of the wound. Moreover, ventriculo-peritoneal shunting for children who developed hydrocephalus was performed simultaneously, which constitutes another recommendation for preventing fluid collection and build up of pressure on the wound. Results: Patients in this study were in the age range of 2 days to 8 years. The most common location of MMC was in the thoracolumbar area. All but four patients had severe weakness in lower extremities. We used as much hairy skin around the MMC sac as possible in all cases. Vertical incisions on one or both flanks and simultaneous shunt procedure were performed in 36 patients. We treated children with large MMC defects with acceptable tension-free closure. Nonetheless, three patients developed superficial skin infection and partial wound dehiscence, and they were managed conservatively. Conclusions: We recommend using all hairy skin around the MMC defect for closure of large defects. In cases that were expected to be at a higher risk to develop dehiscence release incisions on one or two flanks towards the fascia were found to be useful. Simultaneous

  7. Assessment of Industrial Load for Demand Response across Western Interconnect

    Energy Technology Data Exchange (ETDEWEB)

    Alkadi, Nasr E [ORNL; Starke, Michael R [ORNL; Ma, Ookie [United States Department of Energy (DOE), Office of Efficiency and Renewable Energy (EERE)

    2013-11-01

    Demand response (DR) has the ability to both increase power grid reliability and potentially reduce operating system costs. Understanding the role of demand response in grid modeling has been difficult due to complex nature of the load characteristics compared to the modeled generation and the variation in load types. This is particularly true of industrial loads, where hundreds of different industries exist with varying availability for demand response. We present a framework considering industrial loads for the development of availability profiles that can provide more regional understanding and can be inserted into analysis software for further study. The developed framework utilizes a number of different informational resources, algorithms, and real-world measurements to perform a bottom-up approach in the development of a new database with representation of the potential demand response resource in the industrial sector across the U.S. This tool houses statistical values of energy and demand response (DR) potential by industrial plant and geospatially locates the information for aggregation for different territories without proprietary information. This report will discuss this framework and the analyzed quantities of demand response for Western Interconnect (WI) in support of evaluation of the cost production modeling with power grid modeling efforts of demand response.

  8. Simulation Study on Quantum Capacitances of Graphene Nanoribbon VLSI Interconnects

    Science.gov (United States)

    Dutta, Arin; Rahman, Silvia; Nandy, Turja; Mahmood, Zahid Hasan

    2016-03-01

    In this paper, study on the capacitive effects of Graphene nanoribbon (GNR) in VLSI interconnect has been studied as a function of GNR width, Fermi function and gate voltage. The quantum capacitance of GNR has been simulated in terms of Fermi function for three different values of insulator thickness — 1.5nm, 2nm and 2.5nm. After that, quantum capacitance is studied in both degenerate and nondegenerate region with respect to Fermi function and gate voltage of range 1-5V. Then, the total capacitance of GNR is studied as a function of gate voltage of -2-5V range at degenerate and nondegenerate regions, where width of GNR is considered 4nm. Finally, the total capacitance of GNR is studied in both regions with varying GNR width, considering fixed gate voltage of 3V. After analyzing these simulations, it has been found that GNR in degenerate region shows nearly steady capacitance under a certain applied gate voltage.

  9. Geothermal Power and Interconnection: The Economics of Getting to Market

    Energy Technology Data Exchange (ETDEWEB)

    Hurlbut, David [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2012-04-23

    This report provides a baseline description of the transmission issues affecting geothermal technologies. It is intended for geothermal experts in either the private or public sector who are less familiar with how the electricity system operates beyond the geothermal plant. The report begins with a comprehensive overview of the grid, how it is planned, how it is used, and how it is paid for. The report then overlays onto this "big picture" three types of geothermal technologies: conventional hydrothermal systems; emerging technologies such as enhanced engineered geothermal systems (EGS) and geopressured geothermal; and geothermal co-production with existing oil and gas wells. Each category of geothermal technology has its own set of interconnection issues, and these are examined separately for each. The report draws conclusions about each technology’s market affinities as defined by factors related to transmission and distribution infrastructure. It finishes with an assessment of selected markets with known geothermal potential, identifying those that offer the best prospects for near-term commercial development and for demonstration projects.

  10. Fabrication of Ultralow Density Interconnected Pure Metal Foams

    Science.gov (United States)

    Burks, Edward C.; Gilbert, Dustin A.; Liu, Kai; Kucheyev, Sergei O.; Colvin, Jeffrey D.; Felter, Thomas E.

    Ultra-low density metallic nanostructures have been shown to possess interesting thermal, electrical, magnetic, chemical and mechanical properties due to their extremely high surface areas, nanoscale geometries and high porosities. Here we report the synthesis of pure metal foams using interconnected metallic nanowires with densities as low as 0.1% of their bulk density that are still mechanically stable. The highly porous monoliths are macroscopic in size (several mm) and can be created in a wide variety of shapes for application-specific needs. Preliminary studies of such metal foams have already revealed fascinating mechanical and magnetic properties, since the physical dimensions of the foams are below some of the basic length scales that govern the material properties. These foams have been used as targets for ultrabright x-ray sources. They also have a wide variety of other potential applications such as photovoltaic devices, supercapacitors, catalysts, coatings, fuel cells, etc. This work has been supported by DTRA #BRCALL08-Per3-C-2-0006, and in part by NSF DMR-1008791 and DMR-1543582. Work at LLNL was performed under the auspices of the U.S. DOE by LLNL under Contract DE-AC52-07NA27344.

  11. Printed polymer photonic devices for optical interconnect systems

    Science.gov (United States)

    Subbaraman, Harish; Pan, Zeyu; Zhang, Cheng; Li, Qiaochu; Guo, L. J.; Chen, Ray T.

    2016-03-01

    Polymer photonic device fabrication usually relies on the utilization of clean-room processes, including photolithography, e-beam lithography, reactive ion etching (RIE) and lift-off methods etc, which are expensive and are limited to areas as large as a wafer. Utilizing a novel and a scalable printing process involving ink-jet printing and imprinting, we have fabricated polymer based photonic interconnect components, such as electro-optic polymer based modulators and ring resonator switches, and thermo-optic polymer switch based delay networks and demonstrated their operation. Specifically, a modulator operating at 15MHz and a 2-bit delay network providing up to 35.4ps are presented. In this paper, we also discuss the manufacturing challenges that need to be overcome in order to make roll-to-roll manufacturing practically viable. We discuss a few manufacturing challenges, such as inspection and quality control, registration, and web control, that need to be overcome in order to realize true implementation of roll-to-roll manufacturing of flexible polymer photonic systems. We have overcome these challenges, and currently utilizing our inhouse developed hardware and software tools, communication, sensing, medicine, security, imaging, energy, lighting etc.

  12. A robust decentralized load frequency controller for interconnected power systems.

    Science.gov (United States)

    Dong, Lili; Zhang, Yao; Gao, Zhiqiang

    2012-05-01

    A novel design of a robust decentralized load frequency control (LFC) algorithm is proposed for an inter-connected three-area power system, for the purpose of regulating area control error (ACE) in the presence of system uncertainties and external disturbances. The design is based on the concept of active disturbance rejection control (ADRC). Estimating and mitigating the total effect of various uncertainties in real time, ADRC is particularly effective against a wide range of parameter variations, model uncertainties, and large disturbances. Furthermore, with only two tuning parameters, the controller provides a simple and easy-to-use solution to complex engineering problems in practice. Here, an ADRC-based LFC solution is developed for systems with turbines of various types, such as non-reheat, reheat, and hydraulic. The simulation results verified the effectiveness of the ADRC, in comparison with an existing PI-type controller tuned via genetic algorithm linear matrix inequalities (GALMIs). The comparison results show the superiority of the proposed solution. Moreover, the stability and robustness of the closed-loop system is studied using frequency-domain analysis.

  13. Hot Chips and Hot Interconnects for High End Computing Systems

    Science.gov (United States)

    Saini, Subhash

    2005-01-01

    I will discuss several processors: 1. The Cray proprietary processor used in the Cray X1; 2. The IBM Power 3 and Power 4 used in an IBM SP 3 and IBM SP 4 systems; 3. The Intel Itanium and Xeon, used in the SGI Altix systems and clusters respectively; 4. IBM System-on-a-Chip used in IBM BlueGene/L; 5. HP Alpha EV68 processor used in DOE ASCI Q cluster; 6. SPARC64 V processor, which is used in the Fujitsu PRIMEPOWER HPC2500; 7. An NEC proprietary processor, which is used in NEC SX-6/7; 8. Power 4+ processor, which is used in Hitachi SR11000; 9. NEC proprietary processor, which is used in Earth Simulator. The IBM POWER5 and Red Storm Computing Systems will also be discussed. The architectures of these processors will first be presented, followed by interconnection networks and a description of high-end computer systems based on these processors and networks. The performance of various hardware/programming model combinations will then be compared, based on latest NAS Parallel Benchmark results (MPI, OpenMP/HPF and hybrid (MPI + OpenMP). The tutorial will conclude with a discussion of general trends in the field of high performance computing, (quantum computing, DNA computing, cellular engineering, and neural networks).

  14. Financial Economy and Financial System: Basis of Structural Interconnection

    Directory of Open Access Journals (Sweden)

    Khorosheva Olena I.

    2014-02-01

    Full Text Available The goal of the article lies in identification of grounds of interconnection of the financial economy and financial system. The study was conducted with consideration of main provisions of the theory of finance and concept of financial economy, which is a set of means used in the process of reproduction of finance by their owner for formation and / or maintenance of the own system of values in the viable state. For the first time ever the structure of the financial system is identified as an aggregate of financial economies and financial market. The article justifies a necessity of expansion of boundaries of perception of the state financial economy, which is offered to include public financial economy of the state level and the set of financial economies of the state as a subject of economic activity. Such an approach forms a base for justification of the synthesis of participation of the state in financial relations as the owner and as the basic macro-economic regulator. Prospects of further study in this direction are: development of classification of financial economies; revelation of specific features of impact of shadow finance on development of the national financial economy; and assessment of possibilities of inclusion of structured financial products into the system of values of financial economies in Ukraine.

  15. Laser welding of copper and aluminium battery interconnections

    Science.gov (United States)

    De Bono, Paola; Blackburn, Jon

    2015-07-01

    The adoption of lithium-ion and/or super-capacitor battery technologies is a current hot topic in the automotive industry. For both battery types, the terminals and busbars are manufactured from copper (Cu) and/or aluminium-based (Al-based) alloys, as a result of their high electrical and thermal conductivities. Laser welding is considered an attractive process to industry due to its easy automotability, high processing speed and highly repeatable cost-effective processing. However, laser welding of Cu-Cu and Al-Al joints presents several difficulties due to the high surface reflectivity at infrared (IR) wavelengths. This behaviour becomes even more critical when processing thin sheets and foils.This paper summarises recent work performed to develop laser welding techniques suitable for monometallic joining of Cu-Cu and Al-Al electrical interconnections. Laser welding of multiple overlapped foils (with thickness in the range of 17μm-100μm) were investigated.

  16. Silicon resonant cavity enhanced photodetector arrays for optical interconnects

    Science.gov (United States)

    Emsley, Matthew Kent

    High bandwidth short distance communications standards are being developed based on parallel optical interconnect fiber arrays to meet the needs of increasing data rates of inter-chip communication in modern computer architecture. To ensure that this standard becomes an attractive option for computer systems, low cost components must be implemented on both the transmitting and receiving end of the fibers. To meet this low cost requirement silicon based receiver circuits are the most viable option, however, manufacturing high speed, high efficiency silicon photodetectors presents a technical challenge. Resonant cavity enhanced photodetectors have been shown to provide the required bandwidth-efficiency product but have remained a challenge to reproduce through commercially available fabrication techniques. In this work, commercially reproducible silicon wafers with a high reflectance buried distributed Bragg reflector (DBR) have been designed and fabricated. The substrates consist of a two-period, 90% reflecting, DBR fabricated using a double silicon-on-insulator (SOI) process. Resonant-cavity-enhanced (RCE) Si photodetectors have been fabricated with 40% quantum efficiency at 860 nm, a FWHM of 25 ps, and a 3dB bandwidth in excess of 10 GHz. Si RCE 12 x 1 photodetector arrays have been fabricated and packaged with silicon based amplifiers to demonstrate the feasibility of a low cost monolithic silicon photoreceiver array.

  17. Building an organic computing device with multiple interconnected brains

    Science.gov (United States)

    Pais-Vieira, Miguel; Chiuffa, Gabriela; Lebedev, Mikhail; Yadav, Amol; Nicolelis, Miguel A. L.

    2015-01-01

    Recently, we proposed that Brainets, i.e. networks formed by multiple animal brains, cooperating and exchanging information in real time through direct brain-to-brain interfaces, could provide the core of a new type of computing device: an organic computer. Here, we describe the first experimental demonstration of such a Brainet, built by interconnecting four adult rat brains. Brainets worked by concurrently recording the extracellular electrical activity generated by populations of cortical neurons distributed across multiple rats chronically implanted with multi-electrode arrays. Cortical neuronal activity was recorded and analyzed in real time, and then delivered to the somatosensory cortices of other animals that participated in the Brainet using intracortical microstimulation (ICMS). Using this approach, different Brainet architectures solved a number of useful computational problems, such as discrete classification, image processing, storage and retrieval of tactile information, and even weather forecasting. Brainets consistently performed at the same or higher levels than single rats in these tasks. Based on these findings, we propose that Brainets could be used to investigate animal social behaviors as well as a test bed for exploring the properties and potential applications of organic computers. PMID:26158615

  18. Interconnected operations services in a vertically integrated utility

    Energy Technology Data Exchange (ETDEWEB)

    Hoffman, S.P. [ComEd, Lombard, IL (United States)

    1999-11-01

    The North American electric industry has historically been composed of regulated Vertically Integrated Utilities (VIU). Vertical integration means that the same company owns generation, transmission, and distribution facilities. Regulated utilities were ensured cost recovery for all justifiable expenses. The entire industry is in the process of deregulation. The industry-wide trend is to competitive generation, while transmission and distribution remain regulated. Many variations, in both timing and structure, exist in states that have enacted deregulation and retail choice legislation. Some have combined retail choice with an ISO and power exchange; others have opted for retail choice without either. In the past, Interconnected Operations Services (IOS) were obtained by informal means within the same company. Generation is now being actively bought and sold as companies align their strategic direction with different sectors of the emerging electric industry. In the future, these IOS will have to be obtained by formal arrangements. The formal arrangements will need to encompass parameters including service definitions, compensation, performance measurement, and performance incentives. These formal arrangements are presently taking different forms in the industry depending on the stage of deregulation in each area, and on the particular agreements made by each Control Area. This paper describes how VIUs obtained and dispatched the IOS needed for reliability, and what challenges will be faced with respect to these services.

  19. A Two-Unit Cold Standby Repairable System with One Replaceable Repair Facility and Delay Repair:Some Reliability Problems

    Institute of Scientific and Technical Information of China (English)

    WEI Ying-yuan; TANG Ying-hui

    2004-01-01

    This paper considers a two-unit same cold standby repairable system with a replaceable repair facility and delay repair .The failure time of unit is assumed to follow exponential distribution , and the repair time and delay time of failed unit are assumed to follow arbitrary distributions , whereas the failure and replacement time distributions of the repair facility are exponential and arbitrary . By using the Markov renewal process theory, some primary reliability quantities of the system are obtained.

  20. 40 CFR 63.1024 - Leak repair.

    Science.gov (United States)

    2010-07-01

    ... 40 Protection of Environment 10 2010-07-01 2010-07-01 false Leak repair. 63.1024 Section 63.1024... Standards for Equipment Leaks-Control Level 2 Standards § 63.1024 Leak repair. (a) Leak repair schedule. The owner or operator shall repair each leak detected as soon as practical, but not later than 15...