HIGH-DENSITY, BIO-COMPATIBLE, AND HERMETIC ELECTRICAL FEEDTHROUGHS USING EXTRUDED METAL VIAS

Energy Technology Data Exchange (ETDEWEB)

Shah, K G; Delima, T; Felix, S; Sheth, H; Tolosa, V; Tooker, A; Pannu, S S

2012-03-28

Implanted medical devices such as pacemakers and neural prosthetics require that the electronic components that power these devices are protected from the harsh chemical and biological environment of the body. Typically, the electronics are hermetically sealed inside a bio-compatible package containing feedthroughs that transmit electrical signals, while being impermeable to particles or moisture. We present a novel approach for fabricating one of the highest densities of biocompatible hermetic feedthroughs in alumina (Al{sub 2}O{sub 3}). Alumina substrates with laser machined vias of 200 {micro}m pitch were conformally metallized and lithographically patterned. Hermetic electrical feedthroughs were formed by extruding metal stud-bumps partially through the vias. Hermeticity testing showed leak rates better than 9 x 10{sup -10} torr-l/s. Based on our preliminary results and process optimization, this extruded metal via approach is a high-density, low temperature, cost-effective, and robust method of miniaturizing electrical feedthroughs for a wide range of implantable bio-medical device applications.

HIGH-DENSITY, BIO-COMPATIBLE, AND HERMETIC ELECTRICAL FEEDTHROUGHS USING EXTRUDED METAL VIAS

Energy Technology Data Exchange (ETDEWEB)

Tooker, A; Shah, K; Tolosa, V; Sheth, H; Felix, S; Delima, T; Pannu, S

2012-03-29

Implanted medical devices such as pacemakers and neural prosthetics require that the electronic components that power these devices are protected from the harsh chemical and biological environment of the body. Typically, the electronics are hermetically sealed inside a bio-compatible package containing feedthroughs that transmit electrical signals, while being impermeable to particles or moisture. We present a novel approach for fabricating one of the highest densities of biocompatible hermetic feedthroughs in alumina (Al{sub 2}O{sub 3}). Alumina substrates with laser machined vias of 200 {mu}m pitch were conformally metallized and lithographically patterned. Hermetic electrical feedthroughs were formed by extruding metal studbumps partially through the vias. Hermeticity testing showed leak rates better than 9x10{sup -10} torr-l/s. Based on our preliminary results and process optimization, this extruded metal via approach is a high-density, low temperature, cost-effective, and robust method of miniaturizing electrical feedthroughs for a wide range of implantable bio-medical device applications.

Study of gas generation in drum L/ILW packages using hermetic containers

International Nuclear Information System (INIS)

Molnar, M.; Palcsu, L.; Svingor, E.; Futo, I.; Major, Z.; Veres, M.

2005-01-01

Complete text of publication follows. During the storage of low and intermediate level radioactive waste (L/ILW) significant quantities of gas may be produced. It is likely that a small proportion of the generated gas will be radioactive as a result of the incorporation of the isotopes 3 H and 14 C that are present within the waste. To obtain reliable estimates of the quantities and rates of the gas production in L/ILWa series of measurements was carried out of waste packages produced and temporarily stored at the site of Paks Nuclear Power Plant (NPP). Ten drums filled with selected original L/ILW were placed into hermetic containers equipped with sampling valves for repeated sampling. These hermetic containers were stored at the same site where the L/ILW is stored primarily in the Paks NPP. The pressure and the temperature of the headspace gas in the containers were monitored continuously. Qualitative gas component analyses of headspace gases of drums and their containers were executed by quadrupole mass spectrometer. The gas generation rate in the stored L/ILW was calculated by the measured state parameters and the composition variation of the gas in the closed containers. Stable isotope measurements were executed from the CO 2 , CH 4 and N 2 fractions by stable isotope ratio mass spectrometer. Helium measurements were done by noble gas mass spectrometer. The tritium content of the vapour, H 2 and CH 4 fractions was measured by a low background liquid scintillation counter. 14 C content of the CO 2 and CH 4 fractions was measured by a low background gas proportional counter system (ATOMKI). Our results showed that the main generated gases in L/ILW are carbon dioxide, methane, hydrogen and nitrogen. The typical rates were 0.05-0.2 normal litre gas/day for CO 2 and CH 4 generation, and less than 0.02 normal litre gas/day for H 2 . Because of the typical vanishing of the O 2 from the headspace gases no explosive gas mixture was indicated in the L/ILW drums during

Electric motor-transformer aggregate in hermetic objects of transport vehicles

Science.gov (United States)

Zabora, Igor

2017-10-01

The construction and features of operation for new electrical unit - electric motor-transformer aggregate (DTA) are considered. Induction motors are intended for operation in hermetic plants with extreme conditions surrounding gas, steam-to-gas and liquid environment at a high temperature (to several hundred of degrees). Main objective of spent researches is the substantiation of possibility reliable and effective electric power transform with electric machine means directly in hermetic objects with extreme conditions environment by means of new DTA. The principle and job analysis of new disk induction motors of block-module type are observed.

Hermetic compartments leak-tightness enhancement

International Nuclear Information System (INIS)

Murani, J.

2000-01-01

In connection with the enhancement of the nuclear safety of the Jaslovske Bohunice V-1 NPP actions for the increase of the leak tightness are performed. The reconstruction has been done in the following directions: hermetic compartments leak tightness enhancement; air lock installation; installation of air lock in SP 4 vent system; integrated leakage rate test to hermetic compartments with leak detection. After 'major' leaks on the hermetic boundary components had been eliminated, since 1994 works on a higher qualitative level began. The essence of the works consists in the detection and identification of leaks in the structural component of the hermetic boundary during the planned refueling outages. The results of the Small Reconstruction and gradual enhancement of leak tightness are presented

Characterization of integrated circuit packaging materials

CERN Document Server

Moore, Thomas

1993-01-01

Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.

Power Electronic Packaging Design, Assembly Process, Reliability and Modeling

CERN Document Server

Liu, Yong

2012-01-01

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can d...

Standard semiconductor packaging for high-reliability low-cost MEMS applications

Science.gov (United States)

Harney, Kieran P.

2005-01-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

49 CFR 172.312 - Liquid hazardous materials in non-bulk packagings.

Science.gov (United States)

2010-10-01

... offered or intended for transportation by aircraft, packages containing flammable liquids in inner... offered or intended for transportation by aircraft, packages containing flammable liquids in inner... hermetically sealed inner packagings. (6) Packages containing liquid infectious substances in primary...

Reliability test and failure analysis of high power LED packages

International Nuclear Information System (INIS)

Chen Zhaohui; Zhang Qin; Wang Kai; Luo Xiaobing; Liu Sheng

2011-01-01

A new type application specific light emitting diode (LED) package (ASLP) with freeform polycarbonate lens for street lighting is developed, whose manufacturing processes are compatible with a typical LED packaging process. The reliability test methods and failure criterions from different vendors are reviewed and compared. It is found that test methods and failure criterions are quite different. The rapid reliability assessment standards are urgently needed for the LED industry. 85 0 C/85 RH with 700 mA is used to test our LED modules with three other vendors for 1000 h, showing no visible degradation in optical performance for our modules, with two other vendors showing significant degradation. Some failure analysis methods such as C-SAM, Nano X-ray CT and optical microscope are used for LED packages. Some failure mechanisms such as delaminations and cracks are detected in the LED packages after the accelerated reliability testing. The finite element simulation method is helpful for the failure analysis and design of the reliability of the LED packaging. One example is used to show one currently used module in industry is vulnerable and may not easily pass the harsh thermal cycle testing. (semiconductor devices)

Selenide isotope generator for the Galileo Mission: SIG/Galileo hermetic receptable test program final report

International Nuclear Information System (INIS)

Roedel, S.

1979-06-01

The purpose of the receptacle test program was to test various types of hermetically sealed electrical receptacles and to select one model as the spaceflight hardware item for SIG/Galileo thermoelectric generators. The design goal of the program was to qualify a hermetic seal integrity of less than or equal to 1 x 10 -9 std cc He/sec -atm at 400 0 F (204 0 C) and verify a reliability of 0.95 at a 50% confidence level for a flight mission in excess of 7 years

Design and production of a hermetic bayonet isolation valve

International Nuclear Information System (INIS)

Fuerst, J.

1993-05-01

Fermilab is upgrading the Tevatron for lower temperature/higher beam energy operation. Portions of the satellite refrigeration system will operate below atmospheric pressure after the upgrade is complete. Contamination must be prevented by hermetically sealing the subatmospheric helium to air interfaces. Bayonet connections in the low pressure flow path require a reliable, leak tight isolation valve instead of the standard quarter turn ball valve. Design, development, and production of a new valve are described

Modular packaging concept for MEMS and MOEMS

Science.gov (United States)

Stenchly, Vanessa; Reinert, Wolfgang; Quenzer, Hans-Joachim

2017-11-01

Wherever technical systems detect objects in their environment or interact with people, optical devices may play an important role. Light can be relatively easily produced and spatially and temporally modulated. Laser can project sharp images over long distances or cut materials in short distances. Depending on the wavelength an invisible scanning in near infrared for gesture recognition is possible as well as a projection of brilliant colour images. For several years, the Fraunhofer ISIT develops Opto-Packaging processes based on the viscous reshaping of glass wafers: First, hermetically sealed laser micro-mirror scanners WLP with inclined windows deflect in the central light reflex of the window out of the image area. Second, housing with lateral light exit permits hermetic sealing of edge-emitting lasers for highest reliability and durability. Such systems are currently experiencing an extremely high interest of the industry in all segments, from consumer to automotive through to materials processing. Our modular Opto-Packaging platform enables fast product developments. Housing for opto mechanical MEMS devices are equipped with inclined windows to minimize distortion, stray light and reflection losses. The hot viscous glass forming technology is also applied to functionalized substrate wafers which possess areas with high heat dissipation in addition to thermally insulating areas. Electrical contacts may be realized with metal filled vias or TGV (Through Glass Vias). The modular system reduces the development times for new, miniaturized optical systems so that manufacturers can focus on the essentials in their development, namely their product functionalities.

Hermetic Seal Leak Detection Apparatus

Science.gov (United States)

Kelley, Anthony R. (Inventor)

2013-01-01

The present invention is a hermetic seal leak detection apparatus, which can be used to test for hermetic seal leaks in instruments and containers. A vacuum tight chamber is created around the unit being tested to minimize gas space outside of the hermetic seal. A vacuum inducing device is then used to increase the gas chamber volume inside the device, so that a slight vacuum is pulled on the unit being tested. The pressure in the unit being tested will stabilize. If the stabilized pressure reads close to a known good seal calibration, there is not a leak in the seal. If the stabilized pressure reads closer to a known bad seal calibration value, there is a leak in the seal. The speed of the plunger can be varied and by evaluating the resulting pressure change rates and final values, the leak rate/size can be accurately calculated.

Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

Science.gov (United States)

Ghaffaroam. Reza

2014-01-01

Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

Mortality of insects and quality of maize grains in hermetic and non-hermetic storage

Directory of Open Access Journals (Sweden)

Priscila C. Viebrantz

2016-05-01

Full Text Available ABSTRACT Due to the need to improve the quality and safety of foods, chemical methods used to control grain pests have been replaced by alternative methods. For example, modified atmosphere within the storage units has been used. Therefore, the objective was to evaluate maize grain quality and mortality of insects of the species Sitophilus zeamais and Tribolium castaneum in hermetic and non-hermetic environments for 50 days of storage. The hermetic units consisted of polyethylene "bags" with capacity for 60 kg. A cage with 20 adults of each species and 200 g of maize was placed inside each unit. The oxygen level was quantified every five days. Evaluations of insect mortality and survival occurred at 10, 20, 30, 40 and 50 days of storage. At 0, 30 and 50 days, density, moisture and fungal incidence analyses were conducted. The airtight system is efficient in the control of insects, with satisfactory mortality values for both species. Insects favor the development of fungi during the storage, regardless of the storage system.

DESIGN OF WATER-COOLED PACKAGED AIR-CONDITIONING SYSTEMS BASED ON RELIABILITY ASSESSMENT

OpenAIRE

関口, 圭輔; 中尾, 正喜; 藁谷, 至誠; 植草, 常雄; 羽山, 広文

2007-01-01

Water-cooled packaged air-conditioning systems are reevaluated in terms of alleviating the heat island phenomenon in cities and effectively utilizing building rooftops. Up to now, such reliability assessment has been insufficient, and this has limited the use of this kind of air-conditioning system in the information and communications sectors that demand a high reliability. This work has led to the development of a model for evaluating the reliability of water-cooled package air-conditioning...

Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cutting

Science.gov (United States)

Farisi, Muhammad Salman Al; Hirano, Hideki; Frömel, Jörg; Tanaka, Shuji

2017-01-01

In this paper, a novel wafer-level hermetic packaging technology for heterogeneous device integration is presented. Hermetic sealing is achieved by low-temperature thermo-compression bonding using electroplated Au micro-sealing frame planarized by single-point diamond fly-cutting. The proposed technology has significant advantages compared to other established processes in terms of integration of micro-structured wafer, vacuum encapsulation and electrical interconnection, which can be achieved at the same time. Furthermore, the technology is also achievable for a bonding frame width as narrow as 30 μm, giving it an advantage from a geometry perspective, and bonding temperatures as low as 300 °C, making it advantageous for temperature-sensitive devices. Outgassing in vacuum sealed cavities is studied and a cavity pressure below 500 Pa is achieved by introducing annealing steps prior to bonding. The pressure of the sealed cavity is measured by zero-balance method utilizing diaphragm-structured bonding test devices. The leak rate into the packages is determined by long-term sealed cavity pressure measurement for 1500 h to be less than 2.0× {{10}-14} Pa m3s-1. In addition, the bonding shear strength is also evaluated to be higher than 100 MPa.

High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

Science.gov (United States)

Shalkhauser, K. A.; Li, K.; Shih, Y. C.

1992-01-01

Packaging schemes are developed that provide low-loss, hermetic enclosure for enhanced monolithic microwave and millimeter-wave integrated circuits. These package schemes are based on a fused quartz substrate material offering improved RF performance through 44 GHz. The small size and weight of the packages make them useful for a number of applications, including phased array antenna systems. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices.

Plastic packaged microcircuits: Quality, reliability, and cost issues

Science.gov (United States)

Pecht, Michael G.; Agarwal, Rakesh; Quearry, Dan

1993-12-01

Plastic encapsulated microcircuits (PEMs) find their main application in commercial and telecommunication electronics. The advantages of PEMs in cost, size, weight, performance, and market lead-time, have attracted 97% of the market share of worldwide microcircuit sales. However, PEMs have always been resisted in US Government and military applications due to the perception that PEM reliability is low. This paper surveys plastic packaging with respect to the issues of reliability, market lead-time, performance, cost, and weight as a means to guide part-selection and system-design.

Challenges in the Packaging of MEMS

Energy Technology Data Exchange (ETDEWEB)

Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O' Neal, C.; Brown, W.D.; Miller, W.M.

1999-03-26

The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application specific and greatly affected by its environment and packaging techniques such as die handling, die attach processes, and lid sealing. Many of these aspects are directly related to the materials used in the packaging processes. MEMS devices that are functional in wafer form can be rendered inoperable after packaging. MEMS dies must be handled only from the chip sides so features on the top surface are not damaged. This eliminates most current die pick-and-place fixtures. Die attach materials are key to MEMS packaging. Using hard die attach solders can create high stresses in the MEMS devices, which can affect their operation greatly. Low-stress epoxies can be high-outgassing, which can also affect device performance. Also, a low modulus die attach can allow the die to move during ultrasonic wirebonding resulting to low wirebond strength. Another source of residual stress is the lid sealing process. Most MEMS based sensors and devices require a hermetically sealed package. This can be done by parallel seam welding the package lid, but at the cost of further induced stress on the die. Another issue of MEMS packaging is the media compatibility of the packaged device. MEMS unlike ICS often interface with their environment, which could be high pressure or corrosive. The main conclusion we can draw about MEMS packaging is that the package affects the performance and reliability of the MEMS devices. There is a

Hermetic Seal Leak Detection Apparatus with Variable Size Test Chamber

Science.gov (United States)

Kelley, Anthony R. (Inventor)

2015-01-01

The present invention is a versatile hermetic seal leak detection apparatus for testing hermetically sealed containers and devices for leaks without the need to create a custom or specially manufactured testing chamber conforming to the dimensions of the specific object under test. The size of the testing chamber may be mechanically adjusted by the novel use of bellows to reduce and optimize the amount of gas space in a test chamber which surrounds the hermetically sealed object under test. The present invention allows the size of the test chamber to be selectively adjusted during testing to provide an optimum test chamber gas space. The present invention may be further adapted to isolate and test specific portions of the hermetically sealed object under test for leaks.

Method for hermetic electrical connections

Science.gov (United States)

Monroe, Saundra L [Tijeras, NM; Glass, S Jill [Albuquerque, NM; Stone, Ronnie G [Albuquerque, NM; Bond, Jamey T [Albuquerque, NM; Susan, Donald F [Albuquerque, NM

2011-12-27

A method of providing a hermetic, electrical connection between two electrical components by mating at least one metal pin in a glass-ceramic to metal seal connector to two electrical components, wherein the glass-ceramic to metal seal connector incorporates at least one metal pin encased (sealed) in a glass-ceramic material inside of a metal housing, with the glass-ceramic material made from 65-80% SiO.sub.2, 8-16% Li.sub.2O, 2-8% Al.sub.2O.sub.3, 1-5% P.sub.2O.sub.5, 1-8% K.sub.2O, 0.5-7% B.sub.2O.sub.3, and 0-5% ZnO. The connector retains hermeticity at temperatures as high as 700.degree. C. and pressures as high as 500 psi.

THE ROLE OF POSTHARVEST MACHINERIES AND PACKAGING IN MINIMIZING AFLATOXIN CONTAMINATION IN PEANUT

Directory of Open Access Journals (Sweden)

Raffi Paramawati

2016-10-01

Full Text Available As a tropical country with relatively high humidity and temperature, Indonesia is struggling with aflatoxin which frequently contaminates peanut. Aflatoxin is a carcinogenic toxic substance that could cause liver cancer. Due to the increasing concern on food safety, the Indonesian Drugs and Foods Agency specifies the maximum aflatoxin allowed in peanut as much as 20 ppb. However, researches showed that aflatoxin contamination in peanut in Indonesia is much higher than the threshold. The study was carried out to observe the effect of using postharvest machineries and packaging  treatments on aflatoxin contamination in peanut. Reduction of postharvest processes was conducted by using series of machineries, e.g. thresher, dryer, and sheller. Packaging treatments, e.g. vacuum plastic pack, hermetic glass chamber, and polyethylene (PE plastic wrap were carried out during storage at ambient temperature (25-27°C. The results showed that using machineries in postharvest handling produced peanut free from aflatoxin contamination. However, without effective packaging, the aflatoxin level would increase during storage. Hermetic packaging could protect peanut from the mold as indicated by low level of aflatoxin contamination.

The Effect of Epoxy Molding Compound Floor Life to Reliability Performance and mold ability for QFN Package

Science.gov (United States)

Peanpunga, Udom; Ugsornrat, Kessararat; Thorlor, Panakamol; Sumithpibul, Chalermsak

2017-09-01

This research studied about an epoxy molding compound (EMC) floor life to reliability performance of integrated circuit (IC) package. Molding is the process for protecting the die of IC package form mechanical and chemical reaction from external environment by shaping EMC. From normal manufacturing process, the EMC is stored in the frozen at 5oC and left at around room temperature for aging time or floor life before molding process. The EMC floor life effect to its properties and reliability performance of IC package. Therefore, this work interested in varied the floor life of EMC before molding process to analyze properties of EMC such as spiral flow length, gelation time, and viscosity. In experiment, the floor life of EMC was varied to check the effect of its property to reliability performance. The EMC floor life were varied from 0 hours to 60 hours with a step of 12 hours and observed wire sweep, incomplete EMC, and delamination inside the packages for 3x3, 5x5 and 8x8 mm2 of QFN packages. The evaluation showed about clearly effect of EMC floor life to IC packaging reliability. EMC floor life is not any concern for EMC property, moldabilty, and reliability from 0 hours to 48 hours for molding process of 3x3,5x5 and 8x8 mm2 QFN packaging manufacturing

Hermetically Sealed Compressor

Science.gov (United States)

Holtzapple, Mark T.

1994-01-01

Proposed hermetically sealed pump compresses fluid to pressure up to 4,000 atm (400 MPa). Pump employs linear electric motor instead of rotary motor to avoid need for leakage-prone rotary seals. In addition, linear-motor-powered pump would not require packings to seal its piston. Concept thus eliminates major cause of friction and wear. Pump is double-ended diaphragm-type compressor. All moving parts sealed within compressor housing.

Standard high-reliability integrated circuit logic packaging. [for deep space tracking stations

Science.gov (United States)

Slaughter, D. W.

1977-01-01

A family of standard, high-reliability hardware used for packaging digital integrated circuits is described. The design transition from early prototypes to production hardware is covered and future plans are discussed. Interconnections techniques are described as well as connectors and related hardware available at both the microcircuit packaging and main-frame level. General applications information is also provided.

Glass-ceramic composition for hermetic seals

International Nuclear Information System (INIS)

Ballard, C.P. Jr.

1979-01-01

The invention relates to a glass-ceramic composition having a high fracture strength adaptable for hermetically sealing to chromium bearing iron or nickel base alloys at temperatures of between about 950 0 C to about 1100 0 C to form a hermetically sealed insulator body, comprising from about 55 to about 65 weight percent SiO 2 , from about 0 to about 5 weight percent Al 2 O 3 , from about 6 to about 11 weight % Li 2 O, from about 25 to about 32 weight percent BaO, from about 0.5 to about 1.0 weight percent CoO and from about 1.5 to about 3.5 weight percent P 2 O 5

Comprehensive 3D-elastohydrodynamic simulation of hermetic compressor crank drive

Science.gov (United States)

Posch, S.; Hopfgartner, J.; Berger, E.; Zuber, B.; Almbauer, R.; Schöllauf, P.

2017-08-01

Mechanical, electrical and thermodynamic losses form the major loss mechanisms of hermetic compressors for refrigeration application. The present work deals with the investigation of the mechanical losses of a hermetic compressor crank drive. Focus is on 3d-elastohydrodynamic (EHD) modelling of the journal bearings, piston-liner contact and piston secondary motion in combination with multi-body and structural dynamics of the crank drive elements. A detailed description of the model development within the commercial software AVL EXCITE Power Unit is given in the work. The model is used to create a comprehensive analysis of the mechanical losses of a hermetic compressor. Further on, a parametric study concerning oil viscosity and compressor speed is carried out which shows the possibilities of the usage of the model in the development process of hermetic compressors for refrigeration application. Additionally, the usage of the results in an overall thermal network for the determination of the thermal compressor behaviour is discussed.

Highly-hermetic feedthrough fiber pigtailed circular TO-can electro-optic sensor for avionics applications

Science.gov (United States)

Lauzon, Jocelyn; Leduc, Lorrain; Bessette, Daniel; Bélanger, Nicolas

2012-06-01

Electro-optic sensors made of lasers or photodetectors assemblies can be associated with a window interface. In order to use these sensors in an avionics application, this interface has to be set on the periphery of the aircraft. This creates constraints on both the position/access of the associated electronics circuit card and the aircraft fuselage. Using an optical fiber to guide the light signal to a sensor being situated inside the aircraft where electronics circuit cards are deployed is an obvious solution that can be readily available. Fiber collimators that adapt to circular TO-can type window sensors do exist. However, they are bulky, add weight to the sensor and necessitate regular maintenance of the optical interface since both the sensor window and the collimator end-face are unprotected against contamination. Such maintenance can be complex since the access to the electronics circuit card, where the sensor is sitting, is usually difficult. This interface alignment can also be affected by vibrations and mechanical shocks, thus impacting sensor performances. As a solution to this problem, we propose a highly-hermetic feedthrough fiber pigtailed circular TO-can package. The optical element to optical fiber interface being set inside the hermetic package, there is no risk of contamination and thus, such a component does not require any maintenance. The footprint of these sensors being identical to their window counterparts, they offer drop-in replacement opportunities. Moreover, we have validated such packaged electro-optic sensors can be made to operate between -55 to 115°C, sustain 250 temperature cycles, 1500G mechanical shocks, 20Grms random vibrations without any performance degradations. Their water content is much smaller than the 0.5% limit set by MIL-STD-883, Method 1018. They have also been verified to offer a fiber pigtail strain relief resistance over 400g. Depending on the electronics elements inside these sensors, they can be made to have a

Assessment of microelectronics packaging for high temperature, high reliability applications

Energy Technology Data Exchange (ETDEWEB)

Uribe, F.

1997-04-01

This report details characterization and development activities in electronic packaging for high temperature applications. This project was conducted through a Department of Energy sponsored Cooperative Research and Development Agreement between Sandia National Laboratories and General Motors. Even though the target application of this collaborative effort is an automotive electronic throttle control system which would be located in the engine compartment, results of this work are directly applicable to Sandia`s national security mission. The component count associated with the throttle control dictates the use of high density packaging not offered by conventional surface mount. An enabling packaging technology was selected and thermal models defined which characterized the thermal and mechanical response of the throttle control module. These models were used to optimize thick film multichip module design, characterize the thermal signatures of the electronic components inside the module, and to determine the temperature field and resulting thermal stresses under conditions that may be encountered during the operational life of the throttle control module. Because the need to use unpackaged devices limits the level of testing that can be performed either at the wafer level or as individual dice, an approach to assure a high level of reliability of the unpackaged components was formulated. Component assembly and interconnect technologies were also evaluated and characterized for high temperature applications. Electrical, mechanical and chemical characterizations of enabling die and component attach technologies were performed. Additionally, studies were conducted to assess the performance and reliability of gold and aluminum wire bonding to thick film conductor inks. Kinetic models were developed and validated to estimate wire bond reliability.

Glass-ceramic composition for hermetic seals

Science.gov (United States)

Ballard, Jr., Clifford P.

1979-01-01

The invention relates to a glass-ceramic composition having a high fracture strength adaptable for hermetically sealing to chromium bearing iron or nickel base alloys at temperatures of between about 950.degree. C to about 1100.degree. C to form a hermetically sealed insulator body, comprising from about 55 to about 65 weight percent SiO.sub.2, from about 0 to about 5 weight percent Al.sub.2 O.sub.3, from about 6 to about 11 weight % Li.sub.2 O, from about 25 to about 32 weight percent BaO, from about 0.5 to about 1.0 weight percent CoO and from about 1.5 to about 3.5 weight percent P.sub.2 O.sub.5.

Molding compound trends in a denser packaging world: Qualification tests and reliability concerns

Science.gov (United States)

Nguyen, L. T.; Lo, R. H. Y.; Chen, A. S.; Belani, J. G.

1993-12-01

Molding compound development has traditionally been driven by the memory market, then subsequent applications filter down to other IC technologies such as logic, analog, and ASIC. However, this strategy has changed lately with the introduction of thin packages such as PQFP & TSOP. Rather than targeting a compound for a family of IC such as DRAM or SRAM, compound development efforts are now focused at specific classes of packages. The configurations of these thin packages impose new functional requirements that need to be revisited to provide the optimized combination of properties. The evolution of qualification tests mirrors the advances in epoxy and compounding technologies. From the first standard novolac-based epoxies of the 1970s to the latest 3(sup rd)-generation ultra-low stress materials, longer test times at increasingly harsher environments were achieved. This paper benchmarks the current reliability tests used by the electronic industry, examines those tests that affect and are affected by the molding compounds, discusses the relevance of accelerated testing, and addresses the major reliability issues facing current molding compound development efforts. Six compound-related reliability concerns were selected: moldability, package stresses, package cracking, halogen-induced intermetallic growth at bond pads, moisture-induced corrosion, and interfacial delamination. Causes of each failure type are surveyed and remedies are recommended. Accelerated tests are designed to apply to a limited quantity of devices, bias, or environmental conditions larger than usual ratings, to intensify failure mechanisms that would occur under normal operating conditions. The observed behavior is then extrapolated from the lot to the entire population. Emphasis is on compressing the time necessary to obtain reliability data. This approach has two main drawbacks. With increasingly complex devices, even accelerated tests are expensive. And with new technologies, it becomes

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing

CERN Document Server

Liu, Sheng

2011-01-01

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming ""test and try out"" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development.  In this book, Liu and Liu allow people

Evaluation of Polymer Hermetically Sealed Tantalum Capacitors

Science.gov (United States)

Teverovsky, Alexander A.

2014-01-01

Polymer cathode tantalum capacitors have lower ESR (equivalent series resistance) compared to other types of tantalum capacitors and for this reason have gained popularity in the electronics design community. Their use allows improved performance of power supply systems along with substantial reduction of size and weight of the components used. However, these parts have poor thermal stability and can degrade in humid environments. Polymer hermetically sealed (PHS) capacitors avoid problems related to environmental degradation of molded case parts and can potentially replace current wet and solid hermetically sealed capacitors. In this work, PHS capacitors manufactured per DLA LAM DWG#13030 are evaluated for space applications. Several lots of capacitors manufactured over period from 2010 to 2014 were tested for the consistency of performance, electrical and thermal characteristics, highly accelerated life testing, and robustness under reverse bias and random vibration conditions. Special attention was given to analysis of leakage currents and the effect of long-term high temperature storage on capacitors in as is condition and after hermeticity loss. The results show that PHS capacitors might be especially effective for low-temperature applications or for system requiring a cold start-up. Additional screening and qualification testing have been recommended to assure the necessary quality of capacitors for space projects.

How reliable does the waste package containment have to be

International Nuclear Information System (INIS)

Wick, E.A.

1985-01-01

The final rule (10 CFR Part 60) for Disposal of High-Level Radioactive Wastes in Geologic Repositories specifies that the engineered barrier system shall be designed so that, assuming anticipated processes and events, containment of high-level radioactive wastes (HLW) will be substantially complete during the period when radiation and thermal conditions in the engineered barrier system are dominated by fission product decay. This requirement leads to the Nuclear Regulatory Commission (NRC) being asked the following questions: What is meant by ''substantially complete''. How reliable does waste package containment have to be. How many waste packages can fail. Although the NRC has not defined quantitatively the term ''substantially complete'', a numerical concept for acceptable release during the containment period is discussed. The number of containment failures that could be tolerated under the rule would depend upon the acceptable release, the time at which failure occurs and the rate of release from a failed package

Integrated microsystems packaging approach with LCP

Science.gov (United States)

Jaynes, Paul; Shacklette, Lawrence W.

2006-05-01

Within the government communication market there is an increasing push to further miniaturize systems with the use of chip-scale packages, flip-chip bonding, and other advances over traditional packaging techniques. Harris' approach to miniaturization includes these traditional packaging advances, but goes beyond this level of miniaturization by combining the functional and structural elements of a system, thus creating a Multi-Functional Structural Circuit (MFSC). An emerging high-frequency, near hermetic, thermoplastic electronic substrate material, Liquid Crystal Polymer (LCP), is the material that will enable the combination of the electronic circuit and the physical structure of the system. The first embodiment of this vision for Harris is the development of a battlefield acoustic sensor module. This paper will introduce LCP and its advantages for MFSC, present an example of the work that Harris has performed, and speak to LCP MFSCs' potential benefits to miniature communications modules and sensor platforms.

Performance and Reliability of Bonded Interfaces for High-Temperature Packaging. Annual Report

Energy Technology Data Exchange (ETDEWEB)

DeVoto, Douglas [National Renewable Energy Lab. (NREL), Golden, CO (United States)

2016-04-01

Current generation automotive power electronics packages utilize silicon devices and lead-free solder alloys. To meet stringent technical targets for 2020 and beyond (for cost, power density, specific power, efficiency and reliability), wide-bandgap devices are being considered since they offer advantages such as operation at higher frequencies, voltages, and temperatures. Traditional power electronics packages must be redesigned to utilize the full potential of wide-bandgap devices, and the die- and substrate-attach layers are key areas where new material development and validation is required. Present solder alloys do not meet the performance requirements for these new package designs while also meeting cost and hazardous substance restrictions. Sintered silver (Ag) promises to meet the needs for die- and substrate-attach interfaces but synthesis optimization and reliability evaluation must be completed. Sintered Ag material was proposed as an alternative solution in power electronics packages almost 20 years back. However, synthesis pressure requirements up 40 MPa caused a higher complexity in the production process and more stringent flatness specifications for the substrates. Recently, several manufacturers have developed sintered Ag materials that require lower (3-5 MPa) or even no bonding pressures. Degradation mechanisms for these sintered Ag materials are not well known and need to be addressed. We are addressing these aspects to some extent in this project. We are developing generalized (i.e., independent of geometry) stress intensity factor versus cycles-to-failure relations for sintered Ag. Because sintered Ag is a relatively new material for automotive power electronics, the industry currently does not have a good understanding of recommended synthesis parameters or expected reliability under prescribed conditions. It is an important deliverable of this project to transfer findings to industry to eliminate barriers to using sintered Ag as a viable and

Device for hermetically sealing the mouth of a well

Energy Technology Data Exchange (ETDEWEB)

Rastorguyev, M.A.; Prokopov, O.I.; Sharafutdinov, I.G.

1982-01-01

The device for hermetically sealing the mouth of a well, which contains a body installed between upper and lower flanges with a preventer, which includes a shut off element and hydraulic drive cylinders and a mechanism for automatic operation of the preventer. In order to ensure the reliable closure of the well with destruction of the above ground equipment, the mechanism for automatic operation of the preventer is made in the form of a branch pipe, linked withthe cavity of the upper flange, in which a spring loaded piston with a rod is installed, and a slide installed in the cylinder, whichis rigidly linked with the rod and is made with turnings. Here, the cylinder has communication with the atmosphere, while the cavity of the lower flange through the turnings of the slide is linked with the above piston and below piston spaces of the preventer's hydraulic cylinders.

Hermetically sealed superconducting magnet motor

Science.gov (United States)

DeVault, Robert C.; McConnell, Benjamin W.; Phillips, Benjamin A.

1996-01-01

A hermetically sealed superconducting magnet motor includes a rotor separated from a stator by either a radial gap, an axial gap, or a combined axial and radial gap. Dual conically shaped stators are used in one embodiment to levitate a disc-shaped rotor made of superconducting material within a conduit for moving cryogenic fluid. As the rotor is caused to rotate when the field stator is energized, the fluid is pumped through the conduit.

Thermocouple and controlling cables of electric penetrations for nuclear power stations. hermetization with glass-ceramic and glass-fiber materials

International Nuclear Information System (INIS)

Kostyukov, N.S.; Golovko, T.A.; Okhotnikova, G.G.

1996-01-01

New perspective technology for hermetization of cable ends for fabrication of hermetical inlets for NPPs with inorganic materials is developed. On the basis of the studies dielectric inorganic materials, resistive to γ-radiation and fire, are selected for creation of hermetically sealed inlets. Principally new methods for fabrication of hermoinlets is developed on the basis of metallic modules with fibre circuitously and ceramic hermetization units

The Hermetic Synchronous Engines for Pumping the Aggressive Liquids

Directory of Open Access Journals (Sweden)

Tudor Ambros

2014-09-01

Full Text Available The paper covers brief information about asynchronous and synchronous engines used for driving centrifugal pumps. It is argued the fact that asynchronous engines do not, actually, satisfy the requirements for hermetic engines designed for pumping radioactive and chemical liquids, because they possess low technical and economic indexes. Modification of rotor construction of these engines gives the possibility to increase these indexes. The shortcut rotor was replaced with a ferromagnetic rotor in hermetic asynchronous engine serially produced and permanent magnets had been inserted into its body. Different synchronous engine constructions with permanent magnets had been analyzed and developed, which operating characteristics had been compared with those of the asynchronous one.

Enabling More than Moore: Accelerated Reliability Testing and Risk Analysis for Advanced Electronics Packaging

Science.gov (United States)

Ghaffarian, Reza; Evans, John W.

2014-01-01

For five decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in miniaturization of electronics products-Moore's Law. Now, scaling hits a brick wall, a paradigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or ak.a "More than Moore". This paper presents packaging technology trends and accelerated reliability testing methods currently being practiced. Then, it presents industry status on key advanced electronic packages, factors affecting accelerated solder joint reliability of area array packages, and IPC/JEDEC/Mil specifications for characterizations of assemblies under accelerated thermal and mechanical loading. Finally, it presents an examples demonstrating how Accelerated Testing and Analysis have been effectively employed in the development of complex spacecraft thereby reducing risk. Quantitative assessments necessarily involve the mathematics of probability and statistics. In addition, accelerated tests need to be designed which consider the desired risk posture and schedule for particular project. Such assessments relieve risks without imposing additional costs. and constraints that are not value added for a particular mission. Furthermore, in the course of development of complex systems, variances and defects will inevitably present themselves and require a decision concerning their disposition, necessitating quantitative assessments. In summary, this paper presents a comprehensive view point, from technology to systems, including the benefits and impact of accelerated testing in offsetting risk.

Variable speed hermetic reciprocating compressors for domestic refrigerators

DEFF Research Database (Denmark)

Rasmussen, Bjarne D.

1998-01-01

This article describes the results of a both theoretical and experimental investigation of the performance of variable speed hermetic reciprocating compressors for domestic refrigerators. The investigation was performed as a part of a larger research project with the objective of reducing...

Determination of the oil distribution in a hermetic compressor using numerical simulation

Science.gov (United States)

Posch, S.; Hopfgartner, J.; Berger, E.; Zuber, B.; Almbauer, R.; Schöllauf, P.

2017-08-01

In addition to the reduction of friction the oil in a hermetic compressor is very important for the transfer of heat from hot parts to the compressor shell. The simulation of the oil distribution in a hermetic reciprocating compressor for refrigeration application is shown in the present work. Using the commercial Computational Fluid Dynamics (CFD) software ANSYS Fluent, the oil flow inside the compressor shell from the oil pump outlet to the oil sump is calculated. A comprehensive overview of the used models and the boundary conditions is given. After reaching steady-state conditions the oil covered surfaces are analysed concerning heat transfer coefficients. The gained heat transfer coefficients are used as input parameters for a thermal model of a hermetic compressor. An increase in accuracy of the thermal model with the simulated heat transfer coefficients compared to values from literature is shown by model validation with experimental data.

Reliability of Ceramic Column Grid Array Interconnect Packages Under Extreme Temperatures

Science.gov (United States)

Ramesham, Rajeshuni

2011-01-01

A paper describes advanced ceramic column grid array (CCGA) packaging interconnects technology test objects that were subjected to extreme temperature thermal cycles. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide were assembled, inspected nondestructively, and, subsequently, subjected to ex - treme-temperature thermal cycling to assess reliability for future deep-space, short- and long-term, extreme-temperature missions. The test hardware consisted of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The package is 33 33 mm with a 27 27 array of 80%/20% Pb/Sn columns on a 1.27-mm pitch. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of the increasing number of thermal cycles. Several catastrophic failures were observed after 137 extreme-temperature thermal cycles, as per electrical resistance measurements, and then the tests were continued through 1,058 thermal cycles to corroborate and understand the test results. X-ray and optical inspection have been made after thermal cycling. Optical inspections were also conducted on the CCGA vs. thermal cycles. The optical inspections were conclusive; the x-ray images were not. Process qualification and assembly is required to optimize the CCGA assembly, which is very clear from the x-rays. Six daisy chains were open out of seven daisy chains, as per experimental test data reported. The daisy chains are open during the cold cycle, and then recover during the hot cycle, though some of them also opened during the hot thermal cycle..

Reliability and accuracy of three imaging software packages used for 3D analysis of the upper airway on cone beam computed tomography images.

Science.gov (United States)

Chen, Hui; van Eijnatten, Maureen; Wolff, Jan; de Lange, Jan; van der Stelt, Paul F; Lobbezoo, Frank; Aarab, Ghizlane

2017-08-01

The aim of this study was to assess the reliability and accuracy of three different imaging software packages for three-dimensional analysis of the upper airway using CBCT images. To assess the reliability of the software packages, 15 NewTom 5G ® (QR Systems, Verona, Italy) CBCT data sets were randomly and retrospectively selected. Two observers measured the volume, minimum cross-sectional area and the length of the upper airway using Amira ® (Visage Imaging Inc., Carlsbad, CA), 3Diagnosys ® (3diemme, Cantu, Italy) and OnDemand3D ® (CyberMed, Seoul, Republic of Korea) software packages. The intra- and inter-observer reliability of the upper airway measurements were determined using intraclass correlation coefficients and Bland & Altman agreement tests. To assess the accuracy of the software packages, one NewTom 5G ® CBCT data set was used to print a three-dimensional anthropomorphic phantom with known dimensions to be used as the "gold standard". This phantom was subsequently scanned using a NewTom 5G ® scanner. Based on the CBCT data set of the phantom, one observer measured the volume, minimum cross-sectional area, and length of the upper airway using Amira ® , 3Diagnosys ® , and OnDemand3D ® , and compared these measurements with the gold standard. The intra- and inter-observer reliability of the measurements of the upper airway using the different software packages were excellent (intraclass correlation coefficient ≥0.75). There was excellent agreement between all three software packages in volume, minimum cross-sectional area and length measurements. All software packages underestimated the upper airway volume by -8.8% to -12.3%, the minimum cross-sectional area by -6.2% to -14.6%, and the length by -1.6% to -2.9%. All three software packages offered reliable volume, minimum cross-sectional area and length measurements of the upper airway. The length measurements of the upper airway were the most accurate results in all software packages. All

Performance and Reliability of Bonded Interfaces for High-Temperature Packaging (Presentation)

Energy Technology Data Exchange (ETDEWEB)

Devoto, D.

2014-11-01

The thermal performance and reliability of sintered-silver is being evaluated for power electronics packaging applications. This will be experimentally accomplished by the synthesis of large-area bonded interfaces between metalized substrates that will be subsequently subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)-stress intensity factor (K) analysis. The experiment is outlined, and the modeling approach is discussed.

Impact of storage environment on the efficacy of hermetic storage bags.

Science.gov (United States)

Lane, Brett; Woloshuk, Charles

2017-05-01

Small hermetic bags (50 and 100 kg capacities) used by smallholder farmers in several African countries have proven to be a low-cost solution for preventing storage losses due to insects. The complexity of postharvest practices and the need for ideal drying conditions, especially in the Sub-Sahara, has led to questions about the efficacy of the hermetic bags for controlling spoilage by fungi and the potential for mycotoxin accumulation. This study compared the effects of environmental temperature and relative humidity at two locations (Indiana and Arkansas) on dry maize (14% moisture content) in woven polypropylene bags and Purdue Improved Crop Storage (PICS) hermetic bags. Temperature and relative humidity data loggers placed in the middle of each bag provided profiles of environmental influences on stored grain at the two locations. The results indicated that the PICS bags prevented moisture penetration over the three-month storage period. In contrast, maize in the woven bags increased in moisture content. For both bag types, no evidence was obtained indicating the spread of Aspergillus flavus from colonized maize to adjacent non-colonized maize. However, other storage fungi did increase during storage. The number of infected kernels did not increase in the PICS bags, but the numbers in the woven bags increased significantly. The warmer environment in Arkansas resulted in significantly higher insect populations in the woven bags than in Indiana. Insects in the PICS bags remained low at both locations. This study demonstrates that the PICS hermetic bags are effective at blocking the effects of external humidity fluctuations as well as the spread of fungi to non-infected kernels.

Small variable speed hermetic reciprocating compressors for domestic refrigerators

DEFF Research Database (Denmark)

Rasmussen, Bjarne D.

1996-01-01

This paper contains both a theoretical and experimental investigation of some of the fundamental characteristics of a smal variable speed hermetic reciprocating compressor intended for application in domestic refrigeration. The results of a previously published simulation model for variable speed...

Hermetic diamond capsules for biomedical implants enabled by gold active braze alloys.

Science.gov (United States)

Lichter, Samantha G; Escudié, Mathilde C; Stacey, Alastair D; Ganesan, Kumaravelu; Fox, Kate; Ahnood, Arman; Apollo, Nicholas V; Kua, Dunstan C; Lee, Aaron Z; McGowan, Ceara; Saunders, Alexia L; Burns, Owen; Nayagam, David A X; Williams, Richard A; Garrett, David J; Meffin, Hamish; Prawer, Steven

2015-01-01

As the field of biomedical implants matures the functionality of implants is rapidly increasing. In the field of neural prostheses this is particularly apparent as researchers strive to build devices that interact with highly complex neural systems such as vision, hearing, touch and movement. A retinal implant, for example, is a highly complex device and the surgery, training and rehabilitation requirements involved in deploying such devices are extensive. Ideally, such devices will be implanted only once and will continue to function effectively for the lifetime of the patient. The first and most pivotal factor that determines device longevity is the encapsulation that separates the sensitive electronics of the device from the biological environment. This paper describes the realisation of a free standing device encapsulation made from diamond, the most impervious, long lasting and biochemically inert material known. A process of laser micro-machining and brazing is described detailing the fabrication of hermetic electrical feedthroughs and laser weldable seams using a 96.4% gold active braze alloy, another material renowned for biochemical longevity. Accelerated ageing of the braze alloy, feedthroughs and hermetic capsules yielded no evidence of corrosion and no loss of hermeticity. Samples of the gold braze implanted for 15 weeks, in vivo, caused minimal histopathological reaction and results were comparable to those obtained from medical grade silicone controls. The work described represents a first account of a free standing, fully functional hermetic diamond encapsulation for biomedical implants, enabled by gold active alloy brazing and laser micro-machining. Copyright © 2015 Elsevier Ltd. All rights reserved.

Reliability of radioactive waste packages in ground repositories; Confiabilidade de embalados de rejeitos radioativos em repositorios proximos a superficie

Energy Technology Data Exchange (ETDEWEB)

Aguiar, Lais A.; Melo, P.F. Frutuoso e [Universidade Federal, Rio de Janeiro, RJ (Brazil). Coordenacao dos Programas de Pos-graduacao de Engenharia. Programa de Engenharia Nuclear]. E-mail: lais@con.ufrj.br; frutuoso@con.ufrj.br; Passos, Erivaldo; Alves, Antonio Sergio [ELETROBRAS Termonuclear S.A. (ELETRONUCLEAR), Rio de Janeiro, RJ (Brazil). Div. de Seguranca Nuclear]. E-mail: epassos@eletronuclear.gov.br; asergi@eletronuclear.gov.br

2005-07-01

This work aims to discuss the reliability of a great amount of radioactive packages containing low and medium activity material, due to the significance of these latter in the whole safe performance of a final disposal facility (repository). The package is an engineering barrier designed to retain the radioactive material during long time periods. The discussion is based on the use of a probability distribution allowing the best representation of the failure times of the packages, since this type of information is unavailable. Here, the model uses the exponential, normal, lognormal and Weibull distributions published data and existing, related designs in order to obtain estimated values for the reliability function. The study was developed for a radioactive package system by considering the retaining capacity of the solid matrix plus the metallic container. The results indicate that these packages, as a whole, are not enough to perform the safe retaining of the radioactive material for the envisaged time period. The conclusions of the study lead to the necessary use of a system of multiple engineering barriers for the safe containing of the radioactive material. (author)

New hermetic sealing material for vacuum brazing of stainless steels

International Nuclear Information System (INIS)

Hildebrandt, S; Wiehl, G; Silze, F

2016-01-01

For vacuum brazing applications such as in vacuum interrupter industry Hermetic Sealing Materials (HSM) with low partial pressure are widely used. AgCu28 dominates the hermetic sealing market, as it has a very good wetting behavior on copper and metallized ceramics. Within recent decades wetting on stainless steel has become more and more important. However, today the silver content of HSMs is more in focus than in the past decades, because it has the biggest impact on the material prices. Umicore Technical Materials has developed a new copper based HSM, CuAg40Ga10. The wettability on stainless steel is significantly improved compared to AgCu28 and the total silver content is reduced by almost 44%. In this article the physical properties of the alloy and its brazed joints will be presented compared to AgCu28. (paper)

Highly-reliable laser diodes and modules for spaceborne applications

Science.gov (United States)

Deichsel, E.

2017-11-01

Laser applications become more and more interesting in contemporary missions such as earth observations or optical communication in space. One of these applications is light detection and ranging (LIDAR), which comprises huge scientific potential in future missions. The Nd:YAG solid-state laser of such a LIDAR system is optically pumped using 808nm emitting pump sources based on semiconductor laser-diodes in quasi-continuous wave (qcw) operation. Therefore reliable and efficient laser diodes with increased output powers are an important requirement for a spaceborne LIDAR-system. In the past, many tests were performed regarding the performance and life-time of such laser-diodes. There were also studies for spaceborne applications, but a test with long operation times at high powers and statistical relevance is pending. Other applications, such as science packages (e.g. Raman-spectroscopy) on planetary rovers require also reliable high-power light sources. Typically fiber-coupled laser diode modules are used for such applications. Besides high reliability and life-time, designs compatible to the harsh environmental conditions must be taken in account. Mechanical loads, such as shock or strong vibration are expected due to take-off or landing procedures. Many temperature cycles with high change rates and differences must be taken in account due to sun-shadow effects in planetary orbits. Cosmic radiation has strong impact on optical components and must also be taken in account. Last, a hermetic sealing must be considered, since vacuum can have disadvantageous effects on optoelectronics components.

Wafer-level vacuum packaged resonant micro-scanning mirrors for compact laser projection displays

Science.gov (United States)

Hofmann, Ulrich; Oldsen, Marten; Quenzer, Hans-Joachim; Janes, Joachim; Heller, Martin; Weiss, Manfred; Fakas, Georgios; Ratzmann, Lars; Marchetti, Eleonora; D'Ascoli, Francesco; Melani, Massimiliano; Bacciarelli, Luca; Volpi, Emilio; Battini, Francesco; Mostardini, Luca; Sechi, Francesco; De Marinis, Marco; Wagner, Bernd

2008-02-01

Scanning laser projection using resonant actuated MEMS scanning mirrors is expected to overcome the current limitation of small display size of mobile devices like cell phones, digital cameras and PDAs. Recent progress in the development of compact modulated RGB laser sources enables to set up very small laser projection systems that become attractive not only for consumer products but also for automotive applications like head-up and dash-board displays. Within the last years continuous progress was made in increasing MEMS scanner performance. However, only little is reported on how mass-produceability of these devices and stable functionality even under harsh environmental conditions can be guaranteed. Automotive application requires stable MEMS scanner operation over a wide temperature range from -40° to +85°Celsius. Therefore, hermetic packaging of electrostatically actuated MEMS scanning mirrors becomes essential to protect the sensitive device against particle contamination and condensing moisture. This paper reports on design, fabrication and test of a resonant actuated two-dimensional micro scanning mirror that is hermetically sealed on wafer level. With resonant frequencies of 30kHz and 1kHz, an achievable Theta-D-product of 13mm.deg and low dynamic deformation <20nm RMS it targets Lissajous projection with SVGA-resolution. Inevitable reflexes at the vacuum package surface can be seperated from the projection field by permanent inclination of the micromirror.

Reliability of industrial packaging for microsystems

DEFF Research Database (Denmark)

Reus, Roger De; Christensen, Carsten; Weichel, Steen

1998-01-01

. Protective coatings of amorphous silicon carbide and tantalum oxide are suitable candidates with etch rates below 0.1 Angstrom/h in aqueous solutions with pH II at temperatures up to 140 degrees C. Si-Ta-N films exhibit etch rates around 1 Angstrom/h. Parylene C coatings did not etch but peeled off after......Packaging concepts for silicon-based micromachined sensors exposed to harsh environments are explored. By exposing the sensors directly to the media and applying protection at the wafer level the packaging and assembly will be simplified as compared to conventional methods of fabrication...

Built-in unit with short-circuit insulation for hermetic cable ducts

International Nuclear Information System (INIS)

Tschacher, B.; Gurr, W.; Kusserow, J.; Katzmarek, W.

1984-01-01

The invention concerns a built-in unit with short-circuit insulation for hermetic cable ducts, especially for containments of nuclear power reactors. The short-circuit insulation is achieved by an insulation plate made from radiation-resistant insulating materials of high mechanical strength

Performance enhancement of hermetic compressor using phase change materials

Science.gov (United States)

Mahmoud, I. M.; Rady, M. A.; Huzayyin, A. S.

2015-08-01

The present study is motivated by the need for the research of simple measures for increasing energy efficiency of hermetic compressor. The measure is the application of phase change materials for performance enhancement. The first experimental study should be guide for choice of PCM. It has been performed to investigate the effects of thermostat setting temperature on the performance of hermetic compressor. The effects of thermostat setting temperature with and without load on power consumption have been analyzed. Performance enhancement using phase change materials (PCMs) has been studied by employing a phase change material Rubitherm-42 (RT-42) on the top surface of compressor. Choice of PCM material is based on basic compressor performance measured in the first part of the present study. Experiments have been carried out for different load values and different quantities of PCM. The quantity and phase change characteristic of PCM are essential parameters that determine the percentage of performance enhancement in term of energy consumption. Reduction of energy consumption of about 10% has been achieved in the present study by using PCM. The present study shows that how to reduce the electrical power consumption to enhance compressor heat dissipation method to improve efficiency.

Increasing of leak-tightness of hermetic zone and other important components in NPPs

International Nuclear Information System (INIS)

Murani, J.

2001-01-01

The performed by VUEZ resealing works in the hermetic compartments/containment of WWER 440 and WWER 1000 NPPs in Slovakia (Jaslovske Bohunice V-1 NPP, Jaslovske Bohunice V-2 NPP, Mochovce NPP), the Czech Republic (Dukovany NPP, Temelin NPP) and Hungary (Pask NPP) are presented. The leakage rate from hermetic compartments at individual NPP reactor units are shown.The VUEZ activities in field of resealing of weld joints in pools and tanks in the Jaslovske Bohunice V-1 NPP and innovation of the seal of reactor pit protective hood (kolpak) are described. The principle of operation and practical experience of the SMU-V system implemented in the Jaslovske Bohunice V-1 NPP (WWER 440 - V 230) for NPP primary circuit leakage monitoring are also given

A new glass option for parenteral packaging.

Science.gov (United States)

Schaut, Robert A; Peanasky, John S; DeMartino, Steven E; Schiefelbein, Susan L

2014-01-01

Glass is the ideal material for parenteral packaging because of its chemical durability, hermeticity, strength, cleanliness, and transparency. Alkali borosilicate glasses have been used successfully for a long time, but they do have some issues relating to breakage, delamination, and variation in hydrolytic performance. In this paper, alkali aluminosilicate glasses are introduced as a possible alternative to alkali borosilicate glasses. An example alkali aluminosilicate glass is shown to meet the compendial requirements, and to have similar thermal, optical, and mechanical attributes as the current alkali borosilicate glasses. In addition, the alkali aluminosilicate performed as well or better than the current alkali borosilicates in extractables tests and stability studies, which suggests that it would be suitable for use with the studied liquid product formulation. The physical, mechanical, and optical properties of glass make it an ideal material for packaging injectable drugs and biologics. Alkali borosilicate glasses have been used successfully for a long time for these applications, but there are some issues. In this paper, alkali aluminosilicate glasses are introduced as a possible alternative to alkali borosilicate glasses. An example alkali aluminosilicate glass is shown to meet the requirements for packaging injectable drugs and biologics, and to be suitable for use with a particular liquid drug. © PDA, Inc. 2014.

Performance and Reliability of Bonded Interfaces for High-Temperature Packaging

Energy Technology Data Exchange (ETDEWEB)

Paret, Paul P [National Renewable Energy Laboratory (NREL), Golden, CO (United States)

2017-08-02

Sintered silver has proven to be a promising candidate for use as a die-attach and substrate-attach material in automotive power electronics components. It holds promise of greater reliability than lead-based and lead-free solders, especially at higher temperatures (>200 degrees C). Accurate predictive lifetime models of sintered silver need to be developed and its failure mechanisms thoroughly characterized before it can be deployed as a die-attach or substrate-attach material in wide-bandgap device-based packages. Mechanical characterization tests that result in stress-strain curves and accelerated tests that produce cycles-to-failure result will be conducted. Also, we present a finite element method (FEM) modeling methodology that can offer greater accuracy in predicting the failure of sintered silver under accelerated thermal cycling. A fracture mechanics-based approach is adopted in the FEM model, and J-integral/thermal cycle values are computed.

Death by desiccation: Effects of hermetic storage on cowpea bruchids

KAUST Repository

Murdock, Larry L.

2012-04-01

When cowpea grain is stored in airtight containers, destructive populations of the cowpea bruchid (. Callosobruchus maculatus) don\\'t develop even though the grain put into the store is already infested with sufficient . C. maculatus to destroy the entire store within a few months. The surprising effectiveness of hermetic storage for preserving grain against insect pests has long been linked with the depletion of oxygen in the hermetic container and with the parallel rise in carbon dioxide. With . C. maculatus, low oxygen (hypoxia) leads to cessation of larval feeding activity, whereas elevated levels of carbon dioxide (hypercarbia) have little or no effect on feeding. Cessation of feeding arrests the growth of the insects, which don\\'t mature and don\\'t reproduce. As a result, population growth ceases and damaging infestations don\\'t develop. . C. maculatus eggs, larvae, and pupae subjected to hypoxia eventually die after exposures of various duration. The cause of death is desiccation resulting from an inadequate supply of water. We demonstrate that blocking the supply of oxygen interdicts the main supply of water for . C. maculatus. This leads to inactivity, cessation of population growth, desiccation and eventual death. © 2012 Elsevier Ltd.

320 x 240 uncooled IRFPA with pixel wise thin film vacuum packaging

Science.gov (United States)

Yon, J.-J.; Dumont, G.; Rabaud, W.; Becker, S.; Carle, L.; Goudon, V.; Vialle, C.; Hamelin, A.; Arnaud, A.

2012-10-01

Silicon based vacuum packaging is a key enabling technology for achieving affordable uncooled Infrared Focal Plane Arrays (IRFPA) as required by the promising mass market for very low cost IR applications, such as automotive driving assistance, energy loss monitoring in buildings, motion sensors… Among the various approaches studied worldwide, the CEA, LETI is developing a unique technology where each bolometer pixel is sealed under vacuum at the wafer level, using an IR transparent thin film deposition. This technology referred to as PLP (Pixel Level Packaging), leads to an array of hermetic micro-caps each containing a single microbolometer. Since the successful demonstration that the PLP technology, when applied on a single microbolometer pixel, can provide the required vacuum noise and NETD distributions, the paper also puts emphasis on additional key features such as thermal time constant, image quality, and ageing properties.

Selenide isotope generators for the Galileo Mission: SIG hermetic bimetal weld transition joint

International Nuclear Information System (INIS)

Barnett, W.J.

1979-08-01

The successful development of the commercial 6061-T651/Silver/304L explosive clad plate material as a bimetal weld transition joint material, as described herein, satisfies all SIG Galileo design requirements for hermetic weld attachment of stainless steel subassemblies to aluminum alloy generator housing or end cover structures. The application of this type weld transition joint to the hermetic attachment of stainless steel shell connectors is well-developed and tested. Based on on-going life tests of stainless steel receptacle/bimetal ring attachment assemblies and metallurgical characterization studies of this transition joint material, it appears evident that this transition joint material has more than adequate capability to meet the 250 to 300 0 F and 50,000 hr. design life of the SIG/Galileo mission. Its extended life temperture capability may well approach 350 to 400 0 F

Hermetizing ability of the new obturating material for root canals «Real Seal» with «Resilon» technology

Directory of Open Access Journals (Sweden)

Makedonova Y.A.

2012-03-01

Full Text Available Simple, reliable and predictable obturation of root canals side by side with their cleaning and forming is an essential part of the endodontic treatment. The aim of this research is investigation of obturation density of root canals. Canals filled by means of lateral condensation of the new obturative system «Real Seal/Resilon» and by means of traditional method of canals obturation with the help of gutta-percha and sealer АН-plus. The results of the research proved a ligher hermetizing ability of the new experimental material «Real Seal» in comparison with obturation by means of gutta-percha pins. The obtained data reflects an objective picture and can be applied as a unique quality monitoring obturation of root canals.

Wafer-Level Vacuum Packaging of Smart Sensors.

Science.gov (United States)

Hilton, Allan; Temple, Dorota S

2016-10-31

The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors-"low cost" for ubiquitous presence, and "smart" for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS) integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology.

Wafer-Level Vacuum Packaging of Smart Sensors

Directory of Open Access Journals (Sweden)

Allan Hilton

2016-10-01

Full Text Available The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology.

The manufacturing engineering of a hermetic cast fiber calorimeter

International Nuclear Information System (INIS)

Coan, T.; Higby, D.; Sulak, L.; Worstell, W.; Winn, D.; Ayer, F.; Elder, C.; Sullivan, D.

1990-01-01

The authors have made the first pass at designing and engineering a cast lead calorimeter with a rapidity coverage to η = 5.5. The design preserves detector hermeticity. Plastic scintillating fibers provide a fast, hadronically compensated, high-resolution device. A lead-eutectic, which melts below the softening point of the plastic, provides an easily manufactured high Z absorber. This calorimeter, designed with the TEXAS SSC detector as a baseline, is easily scaled in size and in segmentation without major design changes

THE STATE AND PERSPECTIVE OF HERMETIZATION OF UNDERGROUND STRUCTURES WITH USE OF RUBBER SEALANTS

Directory of Open Access Journals (Sweden)

V. I. Leshchenko

2010-03-01

Full Text Available The works on creation of effective rubber sealants for hermetic sealing of joints of underground structures from modular ferroconcrete and pig-iron, including tunnel elements for the underground, are carried out.

Material and design considerations of FBGA reliability performance

International Nuclear Information System (INIS)

Lee, Teck Kheng; Ng, T.C.; Chai, Y.M.

2004-01-01

FBGA package reliability is usually assessed through the conventional approaches of die attach and mold compound material optimization. However, with the rapid changes and fast-moving pace of electronic packaging and the introduction of new soldermask and core materials, substrate design has also become a critical factor in determining overall package reliability. The purpose of this paper is to understand the impact design and soldermask material of a rigid substrate on overall package reliability. Three different soldermask patterns with a matrix of different die attach, mold compound, and soldermask materials are assessed using the moisture sensitivity test (MST). Package reliability is also assessed through the use of temperature cycling (T/C) at conditions 'B' and 'C'. For material optimization, three different mold compounds and die attach materials are used. Material adhesion between different die attach materials and soldermask materials are obtained through die shear performed at various temperatures and preset moisture conditions. A study correlating the different packaging material properties and their relative adhesion strengths with overall package reliability in terms of both MST and T/C performance was performed. Soldermask design under the die pads was found to affect package reliability. For example, locating vias at the edge of the die is not desirable because the vias acts as initiation point for delamination and moisture-induced failure. Through die shear testing, soldermask B demonstrated higher adhesion properties compared to soldermask A across several packaging materials and enhanced the overall package reliability in terms of both MST and T/C performance. Both MST JEDEC level 1 and the T/C of 'B' and 'C' at 1000 cycles have been achieved through design and package material optimization

Survival and vigour of ultra-dry seeds after ten years of hermetic storage

NARCIS (Netherlands)

Hong, T.D.; Ellis, R.H.; Astley, D.; Pinnegar, A.E.; Groot, S.P.C.; Kraak, H.L.

2005-01-01

Seeds of carrot, groundnut, lettuce, oilseed rape and onion were stored hermetically in laminated aluminium foil packets in four environments (dry or ultra-dry moisture contents combined factorially with temperatures of 20 degrees C or -20 degrees C), replicated at several sites. After ten years'

Blowfly puparia in a hermetic container: survival under decreasing oxygen conditions.

Science.gov (United States)

Mądra-Bielewicz, Anna; Frątczak-Łagiewska, Katarzyna; Matuszewski, Szymon

2017-09-01

Despite widely accepted standards for sampling and preservation of insect evidence, unrepresentative samples or improperly preserved evidence are encountered frequently in forensic investigations. Here, we report the results of laboratory studies on the survival of Lucilia sericata and Calliphora vomitoria (Diptera: Calliphoridae) intra-puparial forms in hermetic containers, which were stimulated by a recent case. It is demonstrated that the survival of blowfly intra-puparial forms inside airtight containers is dependent on container volume, number of puparia inside, and their age. The survival in both species was found to increase with an increase in the volume of air per 1 mg of puparium per day of development in a hermetic container. Below 0.05 ml of air, no insect survived, and above 0.2 ml of air per 1 mg of puparium per day, survival reached its maximum. These results suggest that blowflies reveal a single, general pattern of survival under decreasing oxygen conditions and that this pattern is a product of number of developing insects, their age and the initial amount of available air. Implications for forensic entomology are discussed.

Material and design considerations of FBGA reliability performance

Energy Technology Data Exchange (ETDEWEB)

Lee, Teck Kheng; Ng, T.C.; Chai, Y.M

2004-09-01

FBGA package reliability is usually assessed through the conventional approaches of die attach and mold compound material optimization. However, with the rapid changes and fast-moving pace of electronic packaging and the introduction of new soldermask and core materials, substrate design has also become a critical factor in determining overall package reliability. The purpose of this paper is to understand the impact design and soldermask material of a rigid substrate on overall package reliability. Three different soldermask patterns with a matrix of different die attach, mold compound, and soldermask materials are assessed using the moisture sensitivity test (MST). Package reliability is also assessed through the use of temperature cycling (T/C) at conditions 'B' and 'C'. For material optimization, three different mold compounds and die attach materials are used. Material adhesion between different die attach materials and soldermask materials are obtained through die shear performed at various temperatures and preset moisture conditions. A study correlating the different packaging material properties and their relative adhesion strengths with overall package reliability in terms of both MST and T/C performance was performed. Soldermask design under the die pads was found to affect package reliability. For example, locating vias at the edge of the die is not desirable because the vias acts as initiation point for delamination and moisture-induced failure. Through die shear testing, soldermask B demonstrated higher adhesion properties compared to soldermask A across several packaging materials and enhanced the overall package reliability in terms of both MST and T/C performance. Both MST JEDEC level 1 and the T/C of 'B' and 'C' at 1000 cycles have been achieved through design and package material optimization.

Demands placed on waste package performance testing and modeling by some general results on reliability analysis

International Nuclear Information System (INIS)

Chesnut, D.A.

1991-09-01

Waste packages for a US nuclear waste repository are required to provide reasonable assurance of maintaining substantially complete containment of radionuclides for 300 to 1000 years after closure. The waiting time to failure for complex failure processes affecting engineered or manufactured systems is often found to be an exponentially-distributed random variable. Assuming that this simple distribution can be used to describe the behavior of a hypothetical single barrier waste package, calculations presented in this paper show that the mean time to failure (the only parameter needed to completely specify an exponential distribution) would have to be more than 10 7 years in order to provide reasonable assurance of meeting this requirement. With two independent barriers, each would need to have a mean time to failure of only 10 5 years to provide the same reliability. Other examples illustrate how multiple barriers can provide a strategy for not only achieving but demonstrating regulatory compliance

Design and Performance Evaluation of a 200 deg C Interleaved Boost Converter (Preprint)

Science.gov (United States)

2012-09-01

applications in which longer life operation is desired, SiC die are brazed in metal TO-257 hermetic packages, which do provide superior high temperature ...reliability. Optimization of a high temperature X-perm core based coupled inductor architecture, in terms of ac flux balancing and dc flux cancellation...by ~60% due to the rapid decline in X7R capacitance at the high temperature extreme. The results obtained during this study suggest that the

Harsh-Environment Packaging for Downhole Gas and Oil Exploration

Energy Technology Data Exchange (ETDEWEB)

Shubhra Bansal; Junghyun Cho; Kevin Durocher; Chris Kapusta; Aaron Knobloch; David Shaddock; Harry Schoeller; Hua Xia

2007-08-31

This research into new packaging materials and methods for elevated temperatures and harsh environment electronics focused on gaining a basic understanding of current state-of-the-art in electronics packaging used in industry today, formulating the thermal-mechanical models of the material interactions and developing test structures to confirm these models. Discussions were initiated with the major General Electric (GE) businesses that currently sell into markets requiring high temperature electronics and packaging. They related the major modes of failure they encounter routinely and the hurdles needed to be overcome in order to improve the temperature specifications of these products. We consulted with our GE business partners about the reliability specifications and investigated specifications and guidelines that from IPC and the SAE body that is currently developing guidelines for electronics package reliability. Following this, a risk analysis was conducted for the program to identify the critical risks which need to be mitigated in order to demonstrate a flex-based packaging approach under these conditions. This process identified metal/polyimide adhesion, via reliability for flex substrates and high temperature interconnect as important technical areas for reliability improvement.

Comprehensive model of a hermetic reciprocating compressor

Science.gov (United States)

Yang, B.; Ziviani, D.; Groll, E. A.

2017-08-01

A comprehensive simulation model is presented to predict the performance of a hermetic reciprocating compressor and to reveal the underlying mechanisms when the compressor is running. The presented model is composed of sub-models simulating the in-cylinder compression process, piston ring/journal bearing frictional power loss, single phase induction motor and the overall compressor energy balance among different compressor components. The valve model, leakage through piston ring model and in-cylinder heat transfer model are also incorporated into the in-cylinder compression process model. A numerical algorithm solving the model is introduced. The predicted results of the compressor mass flow rate and input power consumption are compared to the published compressor map values. Future work will focus on detailed experimental validation of the model and parametric studies investigating the effects of structural parameters, including the stroke-to-bore ratio, on the compressor performance.

3D microelectronic packaging from fundamentals to applications

CERN Document Server

Goyal, Deepak

2017-01-01

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future resea...

[Encapsulation of a mechatronic implant that restores the ability to accommodate].

Science.gov (United States)

Rheinschmitt, L; Gengenbach, U; Bretthauer, G

2010-12-01

In order to restore the ability of accommodation of the human eye, a lens implant manufactured by micro system technology can be used. This highly integrated Artificial Accommodation System contains sensitive electronics as well as moving components in order to adapt its refractive power. One challenge of the production of this system is the encapsulation. It has to be a biocompatible and long-term reliable package. In this paper the advantages of a hermetic glass package over other approaches of encapsulation are introduced. Concepts of production for a glass package are presented. The package is thereby optimised to be placed in the optical path of the eye, but it can also be used for the encapsulation of other implants. © Georg Thieme Verlag KG Stuttgart · New York.

Advanced organics for electronic substrates and packages

CERN Document Server

Fletcher, Andrew E

1992-01-01

Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet pre

Experimental and theoretical analyses of package-on-package structure under three-point bending loading

International Nuclear Information System (INIS)

Jia Su; Wang Xi-Shu; Ren Huai-Hui

2012-01-01

High density packaging is developing toward miniaturization and integration, which causes many difficulties in designing, manufacturing, and reliability testing. Package-on-Package (PoP) is a promising three-dimensional high-density packaging method that integrates a chip scale package (CSP) in the top package and a fine-pitch ball grid array (FBGA) in the bottom package. In this paper, in-situ scanning electron microscopy (SEM) observation is carried out to detect the deformation and damage of the PoP structure under three-point bending loading. The results indicate that the cracks occur in the die of the top package, then cause the crack deflection and bridging in the die attaching layer. Furthermore, the mechanical principles are used to analyse the cracking process of the PoP structure based on the multi-layer laminating hypothesis and the theoretical analysis results are found to be in good agreement with the experimental results. (condensed matter: structural, mechanical, and thermal properties)

Hybrid Wafer-Level Packaging for RF-MEMS and Optoelectronic Applications

NARCIS (Netherlands)

Tian, J.

2013-01-01

The current trend in electronic packaging research is to integrate more functions into one package, reduce electrical path parasitic, and increase the heat conduction in order to make the final packaged system smaller, more reliable, more functional and more complete, while keeping the packaging

Development of High Temperature Capacitor Technology and Manufacturing Capability

Energy Technology Data Exchange (ETDEWEB)

None, None

2011-05-15

The goal of the Development of High Temperature Capacitor Technology and Manufacturing Capability program was to mature a production-ready supply chain for reliable 250°C FPE (fluorinated polyester) film capacitors by 2011. These high-temperature film capacitors enable both the down hole drilling and aerospace industries by enabling a variety of benefits including: - Deeper oil exploration in higher temperature and pressure environments - Enabling power electronic and control equipment to operate in higher temperature environments - Enabling reduced cooling requirements of electronics - Increasing reliability and life of capacitors operating below rated temperature - Enabling capacitors to handle higher electrical losses without overheating. The key challenges to bringing the FPE film capacitors to market have been manufacturing challenges including: - FPE Film is difficult to handle and wind, resulting in poor yields - Voltage breakdown strength decreases when the film is wound into capacitors (~70% decrease) - Encapsulation technologies must be improved to enable higher perature operation - Manufacturing and test cycle time is very long As a direct result of this program most of the manufacturing challenges have been met. The FPE film production metalization and winding yield has increased to over 82% from 70%, and the voltage breakdown strength of the wound capacitors has increased 270% to 189 V/μm. The high temperature packaging concepts are showing significant progress including promising results for lead attachments and hermetic packages at 200°C and non-hermetic packages at 250°C. Manufacturing and test cycle time will decrease as the market for FPE capacitors develops.

9 CFR 355.25 - Canning with heat processing and hermetically sealed containers; closures; code marking; heat...

Science.gov (United States)

2010-01-01

... 9 Animals and Animal Products 2 2010-01-01 2010-01-01 false Canning with heat processing and hermetically sealed containers; closures; code marking; heat processing; incubation. 355.25 Section 355.25... IDENTIFICATION AS TO CLASS, QUALITY, QUANTITY, AND CONDITION Inspection Procedure § 355.25 Canning with heat...

Reliability and degradation of oxide VCSELs due to reaction to atmospheric water vapor

Science.gov (United States)

Dafinca, Alexandru; Weidberg, Anthony R.; McMahon, Steven J.; Grillo, Alexander A.; Farthouat, Philippe; Ziolkowski, Michael; Herrick, Robert W.

2013-03-01

850nm oxide-aperture VCSELs are susceptible to premature failure if operated while exposed to atmospheric water vapor, and not protected by hermetic packaging. The ATLAS detector in CERN's Large Hadron Collider (LHC) has had approximately 6000 channels of Parallel Optic VCSELs fielded under well-documented ambient conditions. Exact time-to-failure data has been collected on this large sample, providing for the first time actual failure data at use conditions. In addition, the same VCSELs were tested under a variety of accelerated conditions to allow us to construct a more accurate acceleration model. Failure analysis information will also be presented to show what we believe causes corrosion-related failure for such VCSELs.

Ceramic ball grid array package stress analysis

Science.gov (United States)

Badri, S. H. B. S.; Aziz, M. H. A.; Ong, N. R.; Sauli, Z.; Alcain, J. B.; Retnasamy, V.

2017-09-01

The ball grid array (BGA), a form of chip scale package (CSP), was developed as one of the most advanced surface mount devices, which may be assembled by an ordinary surface ball bumps are used instead of plated nickel and gold (Ni/Au) bumps. Assembly and reliability of the BGA's printed circuit board (PCB), which is soldered by conventional surface mount technology is considered in this study. The Ceramic Ball Grid Array (CBGA) is a rectangular ceramic package or square-shaped that will use the solder ball for external electrical connections instead of leads or wire for connections. The solder balls will be arranged in an array or grid at the bottom of the ceramic package body. In this study, ANSYS software is used to investigate the stress on the package for 2 balls and 4 balls of the CBGA package with the various force range of 1-3 Newton applied to the top of the die, top of the substrate and side of the substrate. The highest maximum stress was analyzed and the maximum equivalent stress was observed on the solder ball and the die. From the simulation result, the CBGA package with less solder balls experience higher stress compared to the package with many solder balls. Therefore, less number of solder ball on the CBGA package results higher stress and critically affect the reliability of the solder balls itself, substrate and die which can lead to the solder crack and also die crack.

WASTE PACKAGE TRANSPORTER DESIGN

International Nuclear Information System (INIS)

Weddle, D.C.; Novotny, R.; Cron, J.

1998-01-01

The purpose of this Design Analysis is to develop preliminary design of the waste package transporter used for waste package (WP) transport and related functions in the subsurface repository. This analysis refines the conceptual design that was started in Phase I of the Viability Assessment. This analysis supports the development of a reliable emplacement concept and a retrieval concept for license application design. The scope of this analysis includes the following activities: (1) Assess features of the transporter design and evaluate alternative design solutions for mechanical components. (2) Develop mechanical equipment details for the transporter. (3) Prepare a preliminary structural evaluation for the transporter. (4) Identify and recommend the equipment design for waste package transport and related functions. (5) Investigate transport equipment interface tolerances. This analysis supports the development of the waste package transporter for the transport, emplacement, and retrieval of packaged radioactive waste forms in the subsurface repository. Once the waste containers are closed and accepted, the packaged radioactive waste forms are termed waste packages (WP). This terminology was finalized as this analysis neared completion; therefore, the term disposal container is used in several references (i.e., the System Description Document (SDD)) (Ref. 5.6). In this analysis and the applicable reference documents, the term ''disposal container'' is synonymous with ''waste package''

Solid-liquid interdiffusion (SLID) bonding in the Au-In system: experimental study and 1D modelling

Science.gov (United States)

Deillon, Léa; Hessler-Wyser, Aïcha; Hessler, Thierry; Rappaz, Michel

2015-12-01

Au-In bonds with a nominal composition of about 60 at.% In were fabricated for use in wafer-level packaging of MEMS. The microstructure of the bonds was studied by scanning electron microscopy. The bond hermeticity was then assessed using oxidation of Cu thin discs predeposited within the sealed packages. The three intermetallic compounds AuIn2, AuIn and Au7In3 were observed. Their thickness evolution during bonding and after subsequent heat treatment was successfully modelled using a finite difference model of diffusion, thermodynamic data and diffusion coefficients calibrated from isothermal diffusion couples. 17% of the packages were hermetic and, although the origin of the leaks could not be clearly identified, it appeared that hermeticity was correlated with the unevenness of the metallisation and/or wafer and the fact that the bonds shrink due to density differences as the relative fractions of the various phases gradually evolve.

Solid-liquid interdiffusion (SLID) bonding in the Au–In system: experimental study and 1D modelling

International Nuclear Information System (INIS)

Deillon, Léa; Hessler-Wyser, Aïcha; Hessler, Thierry; Rappaz, Michel

2015-01-01

Au–In bonds with a nominal composition of about 60 at.% In were fabricated for use in wafer-level packaging of MEMS. The microstructure of the bonds was studied by scanning electron microscopy. The bond hermeticity was then assessed using oxidation of Cu thin discs predeposited within the sealed packages. The three intermetallic compounds AuIn 2 , AuIn and Au 7 In 3 were observed. Their thickness evolution during bonding and after subsequent heat treatment was successfully modelled using a finite difference model of diffusion, thermodynamic data and diffusion coefficients calibrated from isothermal diffusion couples. 17% of the packages were hermetic and, although the origin of the leaks could not be clearly identified, it appeared that hermeticity was correlated with the unevenness of the metallisation and/or wafer and the fact that the bonds shrink due to density differences as the relative fractions of the various phases gradually evolve. (paper)

Ceramic/metal seals. [refractory materials for hermetic seals for lighium-metal sulfide batteries

Science.gov (United States)

Bredbenner, A. M.

1977-01-01

Design criteria are discussed for a hermetic seal capable of withstanding the 450 C operating temperature of a lithium-metal sulfide battery system. A mechanical seal consisting of two high strength alloy metal sleeves welded or brazed to a conductor assembly and pressed onto a ceramic is described. The conductor center passes through the ceramic but is not sealed to it. The seal is effected on the outside of the taper where the tubular part is pressed down over and makes contact.

WASTE PACKAGE TRANSPORTER DESIGN

Energy Technology Data Exchange (ETDEWEB)

D.C. Weddle; R. Novotny; J. Cron

1998-09-23

The purpose of this Design Analysis is to develop preliminary design of the waste package transporter used for waste package (WP) transport and related functions in the subsurface repository. This analysis refines the conceptual design that was started in Phase I of the Viability Assessment. This analysis supports the development of a reliable emplacement concept and a retrieval concept for license application design. The scope of this analysis includes the following activities: (1) Assess features of the transporter design and evaluate alternative design solutions for mechanical components. (2) Develop mechanical equipment details for the transporter. (3) Prepare a preliminary structural evaluation for the transporter. (4) Identify and recommend the equipment design for waste package transport and related functions. (5) Investigate transport equipment interface tolerances. This analysis supports the development of the waste package transporter for the transport, emplacement, and retrieval of packaged radioactive waste forms in the subsurface repository. Once the waste containers are closed and accepted, the packaged radioactive waste forms are termed waste packages (WP). This terminology was finalized as this analysis neared completion; therefore, the term disposal container is used in several references (i.e., the System Description Document (SDD)) (Ref. 5.6). In this analysis and the applicable reference documents, the term ''disposal container'' is synonymous with ''waste package''.

Development of a selective thin film and of a hermetically sealed flat plate solar collector with gas filling

Science.gov (United States)

Zernial, W.

1982-12-01

The industrial productibility of a selective absorbing thin film was investigated on the basis of reactive cathodic sputtering of Ni. On substrates of 1.8 sq m of Al, Cu, steel and stainless steel, solar absorption values up to 97% were achieved at emissivities of 5 to 10%. A prototype flat plate collector for high temperatures with two covers and hermetical sealing was developed. The technical data of the collector were measured, dependent on the selectivity of the absorber, gas fillings of dry air, argon or SF6 and the geometry and were compared with those of an evacuated flat plate collector. A hermetical sealed double flat plate collector for low temperatures was developed which has the advantage of lower no load temperatures and higher energy gain for heating swimming pool water compared with a conventional flat plate collector. The insolation values on collectors were measured and were used for a calculation of the energy gains of different collector types.

Hermeticity control system for the BMS/BMF-MDT chambers of the muon spectrometer of ATLAS experiment

International Nuclear Information System (INIS)

Barashkov, A.V.; Glonti, G.L.; Gongadze, A.L.; Dedovich, D.V.; Demichev, M.A.; Zhemchugov, A.S.; Il'yushenko, E.N.; Korolevich, Ya.V.; Kruchonok, V.G.; Lomidze, D.D.; Nikolaev, K.V.; Kharchenko, D.V.; Tskhadadze, Eh.G.; Chepurnov, V.F.; Shelkov, G.A.; Shcherbakov, A.A.

2005-01-01

Description of hermeticity certification of the JINR made muon chambers for the ATLAS experiment is presented. A high precision stand was installed in the production area of the DLNP, JINR. The description of the stand and results of the measurements and the description and results of the second testing of the drift chambers carried out after transportation to CERN are presented

Effecting aging time of epoxy molding compound to molding process for integrated circuit packaging

Science.gov (United States)

Tachapitunsuk, Jirayu; Ugsornrat, Kessararat; Srisuwitthanon, Warayoot; Thonglor, Panakamon

2017-09-01

This research studied about effecting aging time of epoxy molding compound (EMC) that effect to reliability performance of integrated circuit (IC) package in molding process. Molding process is so important of IC packaging process for protecting IC chip (or die) from temperature and humidity environment using encapsulated EMC. For general molding process, EMC are stored in the frozen at 5°C and left at room temperature at 25 °C for aging time on self before molding of die onto lead frame is 24 hours. The aging time effect to reliability performance of IC package due to different temperature and humidity inside the package. In experiment, aging time of EMC were varied from 0 to 24 hours for molding process of SOIC-8L packages. For analysis, these packages were tested by x-ray and scanning acoustic microscope to analyze properties of EMC with an aging time and also analyzed delamination, internal void, and wire sweep inside the packages with different aging time. The results revealed that different aging time of EMC effect to properties and reliability performance of molding process.

Development in Electronic Packaging – Moving to 3D System Configuration

Directory of Open Access Journals (Sweden)

I. Szendiuch

2011-04-01

Full Text Available The electronic industry is reducing package dimensions of components as well as complete electronics systems. Surface mount device passives and semiconductor chips have to be mounted together bringing a functional system that must realize the required function with necessary reliability and acceptable price. To make up a reliable and cost effective system, the size and weight is being reduced by employing lower voltages and higher speeds. For example, the typical size of SMD passives 30 years ago was 1206 when they were first introduced. Generally, all components including electrical joints are becoming miniaturized and smaller. The industry is moving toward a reduced size of 0201 and 01005 for passives, new fine pitch packages for actives, but the PCB now feature limits for further integration. System on Package (SOP is one way to reach the three-dimensional package concept where components will be placed in three-dimensional configuration. A similar concepts are “Package on Package” (PoP or ”Package in Package” (PiP.

Reliability analysis techniques for the design engineer

International Nuclear Information System (INIS)

Corran, E.R.; Witt, H.H.

1982-01-01

This paper describes a fault tree analysis package that eliminates most of the housekeeping tasks involved in proceeding from the initial construction of a fault tree to the final stage of presenting a reliability analysis in a safety report. It is suitable for designers with relatively little training in reliability analysis and computer operation. Users can rapidly investigate the reliability implications of various options at the design stage and evolve a system which meets specified reliability objectives. Later independent review is thus unlikely to reveal major shortcomings necessitating modification and project delays. The package operates interactively, allowing the user to concentrate on the creative task of developing the system fault tree, which may be modified and displayed graphically. For preliminary analysis, system data can be derived automatically from a generic data bank. As the analysis proceeds, improved estimates of critical failure rates and test and maintenance schedules can be inserted. The technique is applied to the reliability analysis of the recently upgraded HIFAR Containment Isolation System. (author)

Estimate the thermomechanical fatigue life of two flip chip packages

International Nuclear Information System (INIS)

Pash, R.A.; Ullah, H.S.; Khan, M.Z.

2005-01-01

The continuing demand towards high density and low profile integrated circuit packaging has accelerated the development of flip chip structures as used in direct chip attach (DCA) technology, ball grid array (BOA) and chip scale package (CSP). In such structures the most widely used flip chip interconnects are solder joints. The reliability of flip chip structures largely depends on the reliability of solder joints. In this work solder joint fatigue life prediction for two chip scale packages is carried out. Elasto-plastic deformation behavior of the solder was simulated using ANSYS. Two dimensional plain strain finite element models were developed for each package to numerically compute the stress and total strain of the solder joints under temperature cycling. These stress and strain values are then used to predict the solder joint lifetime through modified Coffin Manson equation. The effect of solder joint's distance from edge of silicon die on life of the package is explored. The solder joint fatigue response is modeled for a typical temperature cycling of -60 to 140 degree C. (author)

Column Grid Array Rework for High Reliability

Science.gov (United States)

Mehta, Atul C.; Bodie, Charles C.

2008-01-01

Due to requirements for reduced size and weight, use of grid array packages in space applications has become common place. To meet the requirement of high reliability and high number of I/Os, ceramic column grid array packages (CCGA) were selected for major electronic components used in next MARS Rover mission (specifically high density Field Programmable Gate Arrays). ABSTRACT The probability of removal and replacement of these devices on the actual flight printed wiring board assemblies is deemed to be very high because of last minute discoveries in final test which will dictate changes in the firmware. The questions and challenges presented to the manufacturing organizations engaged in the production of high reliability electronic assemblies are, Is the reliability of the PWBA adversely affected by rework (removal and replacement) of the CGA package? and How many times can we rework the same board without destroying a pad or degrading the lifetime of the assembly? To answer these questions, the most complex printed wiring board assembly used by the project was chosen to be used as the test vehicle, the PWB was modified to provide a daisy chain pattern, and a number of bare PWB s were acquired to this modified design. Non-functional 624 pin CGA packages with internal daisy chained matching the pattern on the PWB were procured. The combination of the modified PWB and the daisy chained packages enables continuity measurements of every soldered contact during subsequent testing and thermal cycling. Several test vehicles boards were assembled, reworked and then thermal cycled to assess the reliability of the solder joints and board material including pads and traces near the CGA. The details of rework process and results of thermal cycling are presented in this paper.

Recent trends and future of pharmaceutical packaging technology

Directory of Open Access Journals (Sweden)

Nityanand Zadbuke

2013-01-01

Full Text Available The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future.

Recent trends and future of pharmaceutical packaging technology.

Science.gov (United States)

Zadbuke, Nityanand; Shahi, Sadhana; Gulecha, Bhushan; Padalkar, Abhay; Thube, Mahesh

2013-04-01

The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS) vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD) coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future.

Recent trends and future of pharmaceutical packaging technology

Science.gov (United States)

Zadbuke, Nityanand; Shahi, Sadhana; Gulecha, Bhushan; Padalkar, Abhay; Thube, Mahesh

2013-01-01

The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS) vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD) coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future. PMID:23833515

Shielding Calculations on Waste Packages – The Limits and Possibilities of different Calculation Methods by the example of homogeneous and inhomogeneous Waste Packages

OpenAIRE

Adams Mike; Smalian Silva

2017-01-01

For nuclear waste packages the expected dose rates and nuclide inventory are beforehand calculated. Depending on the package of the nuclear waste deterministic programs like MicroShield® provide a range of results for each type of packaging. Stochastic programs like “Monte-Carlo N-Particle Transport Code System” (MCNP®) on the other hand provide reliable results for complex geometries. However this type of program requires a fully trained operator and calculations are time consuming. The prob...

Effects Of Environmental And Operational Stresses On RF MEMS Switch Technologies For Space Applications

Science.gov (United States)

Jah, Muzar; Simon, Eric; Sharma, Ashok

2003-01-01

Micro Electro Mechanical Systems (MEMS) have been heralded for their ability to provide tremendous advantages in electronic systems through increased electrical performance, reduced power consumption, and higher levels of device integration with a reduction of board real estate. RF MEMS switch technology offers advantages such as low insertion loss (0.1- 0.5 dB), wide bandwidth (1 GHz-100 GHz), and compatibility with many different process technologies (quartz, high resistivity Si, GaAs) which can replace the use of traditional electronic switches, such as GaAs FETS and PIN Diodes, in microwave systems for low signal power (x technologies, the unknown reliability, due to the lack of information concerning failure modes and mechanisms inherent to MEMS devices, create an obstacle to insertion of MEMS technology into high reliability applications. All MEMS devices are sensitive to moisture and contaminants, issues easily resolved by hermetic or near-hermetic packaging. Two well-known failure modes of RF MEMS switches are charging in the dielectric layer of capacitive membrane switches and contact interface stiction of metal-metal switches. Determining the integrity of MEMS devices when subjected to the shock, vibration, temperature extremes, and radiation of the space environment is necessary to facilitate integration into space systems. This paper will explore the effects of different environmental stresses, operational life cycling, temperature, mechanical shock, and vibration on the first commercially available RF MEMS switches to identify relevant failure modes and mechanisms inherent to these device and packaging schemes for space applications. This paper will also describe RF MEMS Switch technology under development at NASA GSFC.

Pengaruh Beberapa Kemasan Plastik Terhadap Kualitas Benih Kedelai Selama Penyimpanan

Directory of Open Access Journals (Sweden)

Irna Dwi Destiana

2016-04-01

Full Text Available Soybean seed var. Argomulyo has been processed and dried to < 10% moisture content. Seeds were stored in 3 different kinds of plastic packaging ie. HDPE, hermetic plastic and vacuum plastic for a period of 6 months at room temperature. The research aims to determine the best type of plastic packaging for soybean seed. The experimental design was arranged in RBD consisting of 2 block and 1 factor; different engine rotation n speed (rpm threshing and packaging material. Sample was carried out every month until 6 months of storage. The following analyses were carried out: moisture content, germination, damaged grains, additional weight and free fatty acid (FFA. Result show that kinds of packaging significantly affect moisture content and additional weights. It was found that seed moisture contentin HDPE packaging was increase and showed positive correlation with additional weight. Engine rotation speed (rpm threshing was significantly affect damaged grains that high rpm showed positively corelation with increasing damaged grain. Percent of FFA < 0.4% untill 6 months of storage. From this research, soybean seed was stored in hermetic plastic observed have the ability to maintain moisture content and hold up additional weight followed by vacuum plastic and HDPE. Soybean seed were stored in HDPE, hermetic plastic and vacuum plastic have percent of germination ≥70% after 6 months stored and moisture content < 10%.

Glass-ceramic hermetic seals to high thermal expansion metals

Science.gov (United States)

Kramer, D.P.; Massey, R.T.

1987-04-28

A process for forming glass-ceramic materials from an alkaline silica-lithia glass composition comprising 60-72 mole-% SiO/sub 2/, 18-27 mole-% Li/sub 2/O, 0-5 mole-% Al/sub 2/O/sub 3/, 0-6 mole-% K/sub 2/O, 0-3 mole-% B/sub 2/O/sub 3/, and 0.5-2.5 mole-% P/sub 2/O/sub 5/, which comprises heating said glass composition at a first temperature within the 950-1050/degree/C range for 5-60 minutes, and then at a devitrification temperature within the 700-900/degree/C range for about 5-300 minutes to obtain a glass-ceramic having a thermal expansion coefficient of up to 210 x 10/sup /minus/7///degree/C. These ceramics form strong, hermetic seals with high expansion metals such as stainless steel alloys. An intermediate nucleation heating step conducted at a temperature within the range of 675-750/degree/C for 10-120 minutes may be employed between the first stage and the devitrification stage. 1 fig., 2 tabs.

System-in-package RF design and applications

CERN Document Server

Gaynor, Michael P

2006-01-01

In the past few years, System in Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. Here's the first comprehensive resource on SiP design techniques that offers designers state-of-the-art packaging know-how. Moreover, the book provides numerous examples that illustrate real-world capabilities, constraints, trade-offs, and options at every step.

Oxygen Consumption and Acoustic Activity of Adult Callosobruchus maculatus (F.) (Coleoptera: Chrysomelidae: Bruchinae) during Hermetic Storage.

Science.gov (United States)

Njoroge, Anastasia W; Mankin, Richard W; Smith, Bradley W; Baributsa, Dieudonne

2018-04-20

Acoustic monitoring was applied to consider hermetic exposure durations and oxygen levels required to stop adult Callosobruchus maculatus activity and economic damage on cowpea. A 15-d study was conducted with six treatments of 25, 50, and 100 C. maculatus adults in 500 and 1000 mL jars using acoustic probes inserted through stoppers sealing the jars. Acoustic activity as a result of locomotion, mating, and egg-laying was measured by identifying sound impulses with frequency spectra representative of known insect sounds, and counting trains (bursts) of impulses separated by intervals of <200 ms, that typically are produced only by insects. By the end of the first week of storage in all treatments, oxygen levels declined to levels below 4%, which has been demonstrated to cause mortality in previous studies. Concomitantly, insect sound burst rates dropped below an acoustic detection threshold of 0.02 bursts s −1 , indicating that the insects had ceased feeding. Statistically significant relationships were obtained between two different measures of the acoustic activity and the residual oxygen level. Based on the experimental results, a simple equation can be used to estimate the time needed for oxygen to decline to levels that limit insect feeding damage and thus grain losses in hermetic storage containers of different insect population levels and various volumes.

Packaging of photodetector modules for 100 Gbit/s applications using electromagnetic simulations

DEFF Research Database (Denmark)

Jiang, Chenhui; Krozer, Viktor; Bach, H.-G.

2009-01-01

In this paper we demonstrate ultra-broadband packaging and interconnection designs for photodetector (PD) modules for 100 Gbit/s data transmission applications. The design of packaging and interconnection structures is based on accurate and reliable 3D electromagnetic (EM) simulations. Mode...... conversion loss due to mode mismatch is identified as the dominant effect of limiting bandwidth of packaged modules. Finally, PD chips are successfully packaged by using wire-bonding technology and conventional coplanar waveguide (CPW) for avoiding mode mismatch. The new packaged PD module demonstrates...

Thermal Cycle Reliability and Failure Mechanisms of CCGA and PBGA Assemblies with and without Corner Staking

Science.gov (United States)

Ghaffarian, Reza

2008-01-01

Area array packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now starting to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic ball grid array (PBGA) and chip scale package assemblies, because of their wide usage for commercial applications, have been extensively reported on in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.However, very limited data is available for thermal cycling behavior of ceramic packages commonly used for the aerospace applications. For high reliability applications, numerous AAPs are available with an identical design pattern both in ceramic and plastic packages. This paper compares assembly reliability of ceramic and plastic packages with the identical inputs/outputs(I/Os) and pattern. The ceramic package was in the form of ceramic column grid array (CCGA) with 560 I/Os peripheral array with the identical pad design as its plastic counterpart.

2014 NREL Photovoltaic Reliability Workshops | Photovoltaic Research | NREL

Science.gov (United States)

Failure Field Imaging Inverter Reliability Thin Film Technologies Packaging Materials and Accelerated . Introduction and Plenary Welcome-Bill Tumas, National Renewable Energy Laboratory (NREL) Welcome-Shubhra Bansal Reliability Analysis of Microinverters-Paul Parker, SolarBridge Technologies Back to top Thin Film

Automated packaging platform for low-cost high-performance optical components manufacturing

Science.gov (United States)

Ku, Robert T.

2004-05-01

(LOS), its subsequent automated testing and burn/in process; and the placement of the LOS into a package body and hermetically sealing the package. The LOS and Package automated assembler robots have achieved a metrics of less than 1 um accuracy and 0.1 um resolution. The paper also discusses a method for the critical alignment of a single-mode fiber as the last step of the manufacturing process. This approach is in contrast to the conventional manual assembly where sub-micron fiber alignment and fixation steps are performed much earlier during the assembly process. Finally the paper discusses the value of this automated platform manufacturing approach as a key enabler for low cost small form factor optical components for the new XFP MSA class of transceiver modules.

Novel SU-8 based vacuum wafer-level packaging for MEMS devices

DEFF Research Database (Denmark)

Murillo, Gonzalo; Davis, Zachary James; Keller, Stephan Urs

2010-01-01

This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability and versa......This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability...

Packaging of structural health monitoring components

Science.gov (United States)

Kessler, Seth S.; Spearing, S. Mark; Shi, Yong; Dunn, Christopher T.

2004-07-01

Structural Health Monitoring (SHM) technologies have the potential to realize economic benefits in a broad range of commercial and defense markets. Previous research conducted by Metis Design and MIT has demonstrated the ability of Lamb waves methods to provide reliable information regarding the presence, location and type of damage in composite specimens. The present NSF funded program was aimed to study manufacturing, packaging and interface concepts for critical SHM components. The intention is to be able to cheaply manufacture robust actuating/sensing devices, and isolate them from harsh operating environments including natural, mechanical, or electrical extremes. Currently the issues related to SHM system durability have remained undressed. During the course of this research several sets of test devices were fabricated and packaged to protect the piezoelectric component assemblies for robust operation. These assemblies were then tested in hot and wet conditions, as well as in electrically noisy environments. Future work will aim to package the other supporting components such as the battery and wireless chip, as well as integrating all of these components together for operation. SHM technology will enable the reduction or complete elimination of scheduled inspections, and will allow condition-based maintenance for increased reliability and reduced overall life-cycle costs.

Reliability databases: State-of-the-art and perspectives

DEFF Research Database (Denmark)

Akhmedjanov, Farit

2001-01-01

The report gives a history of development and an overview of the existing reliability databases. This overview also describes some other (than computer databases) sources of reliability and failures information, e.g. reliability handbooks, but the mainattention is paid to standard models...... and software packages containing the data mentioned. The standards corresponding to collection and exchange of reliability data are observed too. Finally, perspective directions in such data sources development areshown....

Comprehensive Die Shear Test of Silicon Packages Bonded by Thermocompression of Al Layers with Thin Sn Capping or Insertions

Directory of Open Access Journals (Sweden)

Shiro Satoh

2018-04-01

Full Text Available Thermocompression bonding for wafer-level hermetic packaging was demonstrated at the lowest temperature of 370 to 390 °C ever reported using Al films with thin Sn capping or insertions as bonding layer. For shrinking the chip size of MEMS (micro electro mechanical systems, a smaller size of wafer-level packaging and MEMS–ASIC (application specific integrated circuit integration are of great importance. Metal-based bonding under the temperature of CMOS (complementary metal-oxide-semiconductor backend process is a key technology, and Al is one of the best candidates for bonding metal in terms of CMOS compatibility. In this study, after the thermocompression bonding of two substrates, the shear fracture strength of dies was measured by a bonding tester, and the shear-fractured surfaces were observed by SEM (scanning electron microscope, EDX (energy dispersive X-ray spectrometry, and a surface profiler to clarify where the shear fracture took place. We confirmed two kinds of fracture mode. One mode is Si bulk fracture mode, where the die shear strength is 41.6 to 209 MPa, proportionally depending on the area of Si fracture. The other mode is bonding interface fracture mode, where the die shear strength is 32.8 to 97.4 MPa. Regardless of the fracture modes, the minimum die shear strength is practical for wafer-level MEMS packaging.

NASA EEE Parts and NASA Electronic Parts and Packaging (NEPP) Program Update 2018

Science.gov (United States)

Label, Kenneth A.; Sampson, Michael J.; Pellish, Jonathan A.; Majewicz, Peter J.

2018-01-01

NASA Electronic Parts and Packaging (NEPP) Program and NASA Electronic Parts Assurance Group (NEPAG) are NASAs point-of-contacts for reliability and radiation tolerance of EEE parts and their packages. This presentation includes an FY18 program overview.

Status report on an engineering design study of hermetic liquid argon calorimetry for the SSC [Superconducting Super Collider

International Nuclear Information System (INIS)

Adams, T.; Davis, M.; DiGiacomo, N.J.

1989-01-01

There is general recognition that engineering issues are critical to the viability of liquid argon calorimetry (LAC) at the Superconducting Super Collider (SSC). We have undertaken to quantitatively address these issues and, if possible, perform a preliminary design of a ''proof of principle'' LAC for SSC. To establish LAC as viable at SSC, we must demonstrate that the physics performance of the device is acceptable, despite the presence of dead material due to vessels and support structure. Our approach involves the construction, by a team of physicists and engineers, of one three dimensional model of the LAC system, built as a hierarchy of components and structures, from which we directly perform interferences checks, mechanical, thermal and magnetic analyses, particle tracking, hermeticity evaluation, physics simulation and assembly. This study, begun in February 1989 as part of the SSC generic detector R and D program, was immediately preceded by a workshop at which engineering details of existing and planned LAC systems were thoroughly examined. We describe below the status of our work, beginning with short descriptions of the tools used, the study requirements and LAC configuration baseline. We then detail the LAC design as it presently stands, including assembly considerations, and conclude with a quantitative assessment of the LAC hermeticity. 19 refs., 12 figs

Reliability of thermal interface materials: A review

International Nuclear Information System (INIS)

Due, Jens; Robinson, Anthony J.

2013-01-01

Thermal interface materials (TIMs) are used extensively to improve thermal conduction across two mating parts. They are particularly crucial in electronics thermal management since excessive junction-to-ambient thermal resistances can cause elevated temperatures which can negatively influence device performance and reliability. Of particular interest to electronic package designers is the thermal resistance of the TIM layer at the end of its design life. Estimations of this allow the package to be designed to perform adequately over its entire useful life. To this end, TIM reliability studies have been performed using accelerated stress tests. This paper reviews the body of work which has been performed on TIM reliability. It focuses on the various test methodologies with commentary on the results which have been obtained for the different TIM materials. Based on the information available in the open literature, a test procedure is proposed for TIM selection based on beginning and end of life performance. - Highlights: ► This paper reviews the body of work which has been performed on TIM reliability. ► Test methodologies for reliability testing are outlined. ► Reliability results for the different TIM materials are discussed. ► A test procedure is proposed for TIM selection BOLife and EOLife performance.

Reliability of Power Electronic Converter Systems

DEFF Research Database (Denmark)

-link capacitance in power electronic converter systems; wind turbine systems; smart control strategies for improved reliability of power electronics system; lifetime modelling; power module lifetime test and state monitoring; tools for performance and reliability analysis of power electronics systems; fault...... for advancing the reliability, availability, system robustness, and maintainability of PECS at different levels of complexity. Drawing on the experience of an international team of experts, this book explores the reliability of PECS covering topics including an introduction to reliability engineering in power...... electronic converter systems; anomaly detection and remaining-life prediction for power electronics; reliability of DC-link capacitors in power electronic converters; reliability of power electronics packaging; modeling for life-time prediction of power semiconductor modules; minimization of DC...

Measurement system for the integrated tightness tests of the hermetically sealed rooms at the Paks nuclear power plant

Energy Technology Data Exchange (ETDEWEB)

Taubner, R.; Techy, Zs.; Voeroes, L. (Villamosenergiaipari Kutato Intezet, Budapest (Hungary))

1982-01-01

One condition for granting start-up permission is the performance of integrated tightness. The testing method agrees with that developed by the Soviet partner in 1979. The measuring principle is based on the temporal change in the quantity of a medium contained in a hermetically sealed space determined from the value of the absolute pressure. In this study the preliminary investigations on the installation of the testing system and the measurement program are presented.

High-speed high-efficiency 500-W cw CO2 laser hermetization of metal frames of microelectronics devices

Science.gov (United States)

Levin, Andrey V.

1996-04-01

High-speed, efficient method of laser surface treatment has been developed using (500 W) cw CO2 laser. The principal advantages of CO2 laser surface treatment in comparison with solid state lasers are the basis of the method. It has been affirmed that high efficiency of welding was a consequence of the fundamental properties of metal-IR-radiation (10,6 mkm) interaction. CO2 laser hermetization of metal frames of microelectronic devices is described as an example of the proposed method application.

Reliability of CCGA and PBGA assemblies

Science.gov (United States)

Ghaffarian, Reza

2005-01-01

Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of the choice for commercial applications; they are now started to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic BGA (PBGA) and CSP assemblies, because of their wide usage for commercial applications, have been extensively reported in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.

Monolithic microwave integrated circuits: Interconnections and packaging considerations

Science.gov (United States)

Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.

1984-01-01

Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

Monolithic microwave integrated circuits: Interconnections and packaging considerations

Science.gov (United States)

Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.

Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

Wafer-level chip-scale packaging analog and power semiconductor applications

CERN Document Server

Qu, Shichun

2015-01-01

This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials, and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical, and stress modeling methodologies is also provided. This book also: ·         Covers the development of wafer-level power discrete packaging with regular wafer-level design concepts and directly bumping technology ·    �...

3D packaging of a microfluidic system with sensory applications

Science.gov (United States)

Morrissey, Anthony; Kelly, Gerard; Alderman, John C.

1997-09-01

Among the main benefits of microsystem technology are its contributions to cost reductio, reliability and improved performance. however, the packaging of microsystems, and particularly microsensor, has proven to be one of the biggest limitations to their commercialization and the packaging of silicon sensor devices can be the most costly part of their fabrication. This paper describes the integration of 3D packaging of a microsystem. Central to the operation of the 3D demonstrator is a micromachined silicon membrane pump to supply fluids to a sensing chamber constructed about the active area of a sensor chip. This chip carries ISFET based chemical sensors, pressure sensors and thermal sensors. The electronics required for controlling and regulating the activity of the various sensors ar also available on this chip and as other chips in the 3D assembly. The demonstrator also contains a power supply module with optical fiber interconnections. All of these modules are integrated into a single plastic- encapsulated 3D vertical multichip module. The reliability of such a structure, initially proposed by Val was demonstrated by Barrett et al. An additional module available for inclusion in some of our assemblies is a test chip capable of measuring the packaging-induced stress experienced during and after assembly. The packaging process described produces a module with very high density and utilizes standard off-the-shelf components to minimize costs. As the sensor chip and micropump include micromachined silicon membranes and microvalves, the packaging of such structures has to allow consideration for the minimization of the packaging-induced stresses. With this in mind, low stress techniques, including the use of soft glob-top materials, were employed.

Destructive testing of transport packaging. Quality assurance applied to transport packaging in the USA

International Nuclear Information System (INIS)

Barker, R.F.

1976-01-01

This paper discusses several aspects of quality assurance as applied to packaging, including such requirements for an adequate quality assurance program as assignment of responsibilities, inspections, and audits. In certain cases, we have determined the margin of safety inherent in specific package designs. Testing of packaging to destruction, by subjecting it to conditions far beyond the present accident criteria, was carried out to establish the levels of impact, puncture, crush, and fire at which present designs would fail. A second area in which the Nuclear Regulatory Commission has applied quality assurance is qualification testing. The standards for testing prototypes require essentially no loss of contents under the specified accident test conditions. Qualifying a design with an acceptable degree of reliability by testing it at the specified stress levels with no measurable effect requires large numbers of samples to be tested. Testing the prototype under conditions well above the criteria is shown to offer one of the most effective means of demonstrating the adequacy of a design. Scenario tests, i.e., staged accidents or full-scale tests in which vehicles with samples of packages on board are crashed under specified conditions, in most cases present singular points on a curve. One-point tests in most cases will disprove a package design if it fails but may not confirm that a design will not fail. At the same time, much information and some public assurances can be obtained from such tests. (author)

Mathematical and Simulation Modelling of Moisture Diffusion Mechanism during Plastic IC Packages Disassembly

OpenAIRE

Peng Mou; Dong Xiang; Guanghong Duan

2013-01-01

Reuse of plastic IC packages disassembled from printed circuit boards (PCBs) has significant environmental benefits and economic value. The interface delamination caused by moisture diffusion is the main failure mode of IC packages during the disassembling process, which greatly reduces the reusability and reliability of disassembled IC packages. Exploring moisture diffusion mechanism is a prerequisite to optimize prebaking processes before disassembling that is an effective way to avoid the ...

High pressure, high current, low inductance, high reliability sealed terminals

Science.gov (United States)

Hsu, John S [Oak Ridge, TN; McKeever, John W [Oak Ridge, TN

2010-03-23

The invention is a terminal assembly having a casing with at least one delivery tapered-cone conductor and at least one return tapered-cone conductor routed there-through. The delivery and return tapered-cone conductors are electrically isolated from each other and positioned in the annuluses of ordered concentric cones at an off-normal angle. The tapered cone conductor service can be AC phase conductors and DC link conductors. The center core has at least one service conduit of gate signal leads, diagnostic signal wires, and refrigerant tubing routed there-through. A seal material is in direct contact with the casing inner surface, the tapered-cone conductors, and the service conduits thereby hermetically filling the interstitial space in the casing interior core and center core. The assembly provides simultaneous high-current, high-pressure, low-inductance, and high-reliability service.

Fast Qualification of Solder Reliability in Solid-state Lighting System

NARCIS (Netherlands)

Zhang, J.

2015-01-01

Solid-state lighting (SSL), which is based 0n semiconductor Lighting Emitting Diode (LED), is the most promising and reliable energy saving solution for future lighting applications. Since a bare LED die can hardly survive without a package, one of the most import function of the LED package is to

Interface analysis of embedded chip resistor device package and its effect on drop shock reliability.

Science.gov (United States)

Park, Se-Hoon; Kim, Sun Kyoung; Kim, Young-Ho

2012-04-01

In this study, the drop reliability of an embedded passive package is investigated under JESD22-B111 condition. Chip resistors were buried in a PCB board, and it was electrically interconnected by electroless and electrolytic copper plating on a tin pad of a chip resistor without intermetallic phase. However tin, nickel, and copper formed a complex intermetallic phase, such as (Cu, Ni)6Sn5, (Cu, Ni)3Sn, and (Ni, Cu)3Sn2, at the via interface and via wall after reflow and aging. Since the amount of the tin layer was small compared with the solder joint, excessive intermetallic layer growth was not observed during thermal aging. Drop failures are always initiated at the IMC interface, and as aging time increases Cu-Sn-Ni IMC phases are transformed continuously due to Cu diffusion. We studied the intermetallic formation of the Cu via interface and simulated the stress distribution of drop shock by using material properties and board structure of embedded passive boards. The drop simulation was conducted according to the JEDEC standard. It was revealed that the crack starting point related to failure fracture changed due to intermetallic phase transformation along the via interface, and the position where failure occurs experimentally agrees well with our simulation results.

Advanced Packaging Technology Used in Fabricating a High-Temperature Silicon Carbide Pressure Sensor

Science.gov (United States)

Beheim, Glenn M.

2003-01-01

The development of new aircraft engines requires the measurement of pressures in hot areas such as the combustor and the final stages of the compressor. The needs of the aircraft engine industry are not fully met by commercially available high-temperature pressure sensors, which are fabricated using silicon. Kulite Semiconductor Products and the NASA Glenn Research Center have been working together to develop silicon carbide (SiC) pressure sensors for use at high temperatures. At temperatures above 850 F, silicon begins to lose its nearly ideal elastic properties, so the output of a silicon pressure sensor will drift. SiC, however, maintains its nearly ideal mechanical properties to extremely high temperatures. Given a suitable sensor material, a key to the development of a practical high-temperature pressure sensor is the package. A SiC pressure sensor capable of operating at 930 F was fabricated using a newly developed package. The durability of this sensor was demonstrated in an on-engine test. The SiC pressure sensor uses a SiC diaphragm, which is fabricated using deep reactive ion etching. SiC strain gauges on the surface of the diaphragm sense the pressure difference across the diaphragm. Conventionally, the SiC chip is mounted to the package with the strain gauges outward, which exposes the sensitive metal contacts on the chip to the hostile measurement environment. In the new Kulite leadless package, the SiC chip is flipped over so that the metal contacts are protected from oxidation by a hermetic seal around the perimeter of the chip. In the leadless package, a conductive glass provides the electrical connection between the pins of the package and the chip, which eliminates the fragile gold wires used previously. The durability of the leadless SiC pressure sensor was demonstrated when two 930 F sensors were tested in the combustor of a Pratt & Whitney PW4000 series engine. Since the gas temperatures in these locations reach 1200 to 1300 F, the sensors were

Joint interval reliability for Markov systems with an application in transmission line reliability

International Nuclear Information System (INIS)

Csenki, Attila

2007-01-01

We consider Markov reliability models whose finite state space is partitioned into the set of up states U and the set of down states D . Given a collection of k disjoint time intervals I l =[t l ,t l +x l ], l=1,...,k, the joint interval reliability is defined as the probability of the system being in U for all time instances in I 1 union ... union I k . A closed form expression is derived here for the joint interval reliability for this class of models. The result is applied to power transmission lines in a two-state fluctuating environment. We use the Linux versions of the free packages Maxima and Scilab in our implementation for symbolic and numerical work, respectively

21 CFR 113.40 - Equipment and procedures.

Science.gov (United States)

2010-04-01

... FOR HUMAN CONSUMPTION THERMALLY PROCESSED LOW-ACID FOODS PACKAGED IN HERMETICALLY SEALED CONTAINERS... temperature recorder-control bulb shall be located between the water surface and the horizontal plane passing...

Reliability analysis techniques for the design engineer

International Nuclear Information System (INIS)

Corran, E.R.; Witt, H.H.

1980-01-01

A fault tree analysis package is described that eliminates most of the housekeeping tasks involved in proceeding from the initial construction of a fault tree to the final stage of presenting a reliability analysis in a safety report. It is suitable for designers with relatively little training in reliability analysis and computer operation. Users can rapidly investigate the reliability implications of various options at the design stage, and evolve a system which meets specified reliability objectives. Later independent review is thus unlikely to reveal major shortcomings necessitating modification and projects delays. The package operates interactively allowing the user to concentrate on the creative task of developing the system fault tree, which may be modified and displayed graphically. For preliminary analysis system data can be derived automatically from a generic data bank. As the analysis procedes improved estimates of critical failure rates and test and maintenance schedules can be inserted. The computations are standard, - identification of minimal cut-sets, estimation of reliability parameters, and ranking of the effect of the individual component failure modes and system failure modes on these parameters. The user can vary the fault trees and data on-line, and print selected data for preferred systems in a form suitable for inclusion in safety reports. A case history is given - that of HIFAR containment isolation system. (author)

Thermal Performance and Reliability Characterization of Bonded Interface Materials (BIMs): Preprint

Energy Technology Data Exchange (ETDEWEB)

DeVoto, D.; Paret, P.; Mihalic, M.; Narumanchi, S.; Bar-Cohen, A.; Matin, K.

2014-08-01

Thermal interface materials are an important enabler for low thermal resistance and reliable electronics packaging for a wide array of applications. There is a trend towards bonded interface materials (BIMs) because of their potential for low thermal resistivity (< 1 mm2K/W). However, BIMs induce thermomechanical stresses in the package and can be prone to failures and integrity risks. Deteriorated interfaces can result in high thermal resistance in the package and degradation and/or failure of the electronics. DARPA's Thermal Management Technologies program has addressed this challenge, supporting the development of mechanically-compliant, low resistivity nano-thermal interface (NTI) materials. In this work, we describe the testing procedure and report the results of NREL's thermal performance and reliability characterization of an initial sample of four different NTI-BIMs.

SCALE criticality safety verification and validation package

International Nuclear Information System (INIS)

Bowman, S.M.; Emmett, M.B.; Jordan, W.C.

1998-01-01

Verification and validation (V and V) are essential elements of software quality assurance (QA) for computer codes that are used for performing scientific calculations. V and V provides a means to ensure the reliability and accuracy of such software. As part of the SCALE QA and V and V plans, a general V and V package for the SCALE criticality safety codes has been assembled, tested and documented. The SCALE criticality safety V and V package is being made available to SCALE users through the Radiation Safety Information Computational Center (RSICC) to assist them in performing adequate V and V for their SCALE applications

The application of hydrocarbon refrigerant mixtures in a hermetic reciprocating compressor for high back pressure conditions

Energy Technology Data Exchange (ETDEWEB)

Kim, K.M.; Pak, H.Y. [Hanyang University, Seoul (Korea)

1999-03-01

The application of hydrocarbon refrigerant mixtures in a hermetic reciprocating compressor for dehumidifier is investigated. The selected refrigerants are R12, R134a, HC-Blend(R290/R600a), CX(R152a/R600a) and OS-12a. Both theoretical and experimental investigations have been performed for the selected refrigerants. The test results of hydrocarbon refrigerants have been compared to traditional refrigerant(R12) and R134a. The results show that hydrocarbon refrigerant mixtures(HC-Blend, CX and OS-12a) are very good alternatives in the refrigeration system for R12 and R134a. 11 refs., 3 fig., 12 tabs.

Joint interval reliability for Markov systems with an application in transmission line reliability

Energy Technology Data Exchange (ETDEWEB)

Csenki, Attila [School of Computing and Mathematics, University of Bradford, Bradford, West Yorkshire, BD7 1DP (United Kingdom)]. E-mail: a.csenki@bradford.ac.uk

2007-06-15

We consider Markov reliability models whose finite state space is partitioned into the set of up states {sub U} and the set of down states {sub D}. Given a collection of k disjoint time intervals I{sub l}=[t{sub l},t{sub l}+x{sub l}], l=1,...,k, the joint interval reliability is defined as the probability of the system being in {sub U} for all time instances in I{sub 1} union ... union I{sub k}. A closed form expression is derived here for the joint interval reliability for this class of models. The result is applied to power transmission lines in a two-state fluctuating environment. We use the Linux versions of the free packages Maxima and Scilab in our implementation for symbolic and numerical work, respectively.

Advanced Packaging Materials and Techniques for High Power TR Module: Standard Flight vs. Advanced Packaging

Science.gov (United States)

Hoffman, James Patrick; Del Castillo, Linda; Miller, Jennifer; Jenabi, Masud; Hunter, Donald; Birur, Gajanana

2011-01-01

The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires advances in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and compared to standard technologies.

Influence of interconnection on the long-term reliability of UV LED packages

Science.gov (United States)

Nieland, S.; Mitrenga, D.; Karolewski, D.; Brodersen, O.; Ortlepp, T.

2017-02-01

High power LEDs have conquered the mass market in recent years. Besides the main development focus to achieve higher productivity in the field of visible semiconductor LED processing, the wavelength range is further enhanced by active research and development in the direction of UVA / UVB / UVC. UVB and UVC LEDs are new and promising due to their numerous advantages. UV LEDs emit in a near range of one single emission peak with a width (FWHM) below 15 nm compared to conventional mercury discharge lamps and xenon sources, which show broad spectrums with many emission peaks over a wide range of wavelengths. Furthermore, the UV LED size is in the range of a few hundred microns and offers a high potential of significant system miniaturization. Of course, LED efficiency, lifetime and output power have to be increased [1]. Lifetime limiting issues of UVB/UVC-LED are the very high thermal stress in the chip resulting from the higher forward voltages (6-10 V @ 350 mA), the lower external quantum efficiency, below 10 % (most of the power disappears as heat), and the thermal resistance Rth of conventional LED packages being not able to dissipate these large amounts of heat for spreading. Beside the circuit boards and submounts which should have maximum thermal conductivity, the dimension of contacts as well as the interconnection of UV LED to the submount/package determinates the resolvable amount of heat [2]. In the paper different innovative interconnection techniques for UVC-LED systems will be discussed focused on the optimization of thermal conductivity in consideration of the assembly costs. Results on thermal simulation for the optimal contact dimensions and interconnections will be given. In addition, these theoretical results will be compared with results on electrical characterization as well as IR investigations on real UV LED packages in order to give recommendations for optimal UV LED assembly.

Interconnect mechanisms in microelectronic packaging

Science.gov (United States)

Roma, Maria Penafrancia C.

alloy showed differences in adhesion strength and IMC formation. Bond strength by wire pull testing showed the 95Ag alloy with higher values while shear bond testing showed the 88Ag higher bond strength. Use of Cu pillars in flip chips and eutectic bonding in wafer level chip scale packages are direct consequences of diminishing interconnect dimension as a result of the drive for miniaturization. The combination of Cu-Sn interdiffusion, Kirkendall mechanism and heterogeneous vacancy precipitation are the main causes of IMC and void formation in Cu pillar - Sn solder - Cu lead frame sandwich structure. However, adding a Ni barrier agent showed less porous IMC layer as well as void formation as a result of the modified Cu and Sn movement well as the void formation. Direct die to die bonding using Al-Ge eutectic bonds is necessary when 3D integration is needed to reduce the footprint of a package. Hermeticity and adhesion strength are a function of the Al/Ge thickness ratio, bonding pressure, temperature and time. Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) allowed imaging of interfacial microstructures, porosity, grain morphology while Scanning Transmission Electron microscope (STEM) provided diffusion profile and confirmed interdiffusion. Ion polishing technique provided information on porosity and when imaged using backscattered mode, grain structure confirmed mechanical deformation of the bonds. Measurements of the interfacial bond strength are made by wire pull tests and ball shear tests based on existing industry standard tests. However, for the Al-Ge eutectic bonds, no standard strength is available so a test is developed using the stud pull test method using the Dage 4000 Plus to yield consistent results. Adhesion strengths of 30-40 MPa are found for eutectic bonded packages however, as low as 20MPa was measured in low temperature bonded areas.

Wafer level packaging of MEMS

International Nuclear Information System (INIS)

Esashi, Masayoshi

2008-01-01

Wafer level packaging plays many important roles for MEMS (micro electro mechanical systems), including cost, yield and reliability. MEMS structures on silicon chips are encapsulated between bonded wafers or by surface micromachining, and electrical interconnections are made from the cavity. Bonding at the interface, such as glass–Si anodic bonding and metal-to-metal bonding, requires electrical interconnection through the lid vias in many cases. On the other hand, lateral electrical interconnections on the surface of the chip are used for bonding with intermediate melting materials, such as low melting point glass and solder. The cavity formed by surface micromachining is made using sacrificial etching, and the openings needed for the sacrificial etching are plugged using deposition sealing methods. Vacuum packaging methods and the structures for electrical feedthrough for the interconnection are discussed in this review. (topical review)

The NASA Electronic Parts and Packaging (NEPP) Program: Overview and Update FY15 and Beyond

Science.gov (United States)

LaBel, Kenneth A.; Sampson, Michael J.

2016-01-01

The NASA Electronic Parts and Packaging (NEPP) program, and its subset the NASA Electronic Parts Assurance Group (NEPAG), are NASA's point-of-contacts for reliability and radiation tolerance of electrical, electronic, and electromechanical (EEE) parts and their packages. This presentation includes a Fiscal Year 2015 program overview.

Hermetic conditions for the gas-in-oil analysis. Testing of transformer oil; Hermetische Bedingungen fuer die Gas-in-Oel-Analyse. Pruefung von Transformatorenoel

Energy Technology Data Exchange (ETDEWEB)

Braesel, Eckhard; Braesel, Olaf [Gatron GmbH, Greifswald (Germany); Sasum, Ute [Forschungszentrum Sensorik Greifswald e.V., Greifswald (Germany)

2012-06-25

The protection of hermetic conditions for the gas-in-oil analysis is performed as an innovative method of sampling with integrated gas extraction. It also is controllable with a criterion derived from online monitoring. The importance is in the utilization of all individual gases in the diagnosis and in the determination of the accuracy of DGA results as well as the laboratory control.

Research and Analysis of MEMS Switches in Different Frequency Bands

Directory of Open Access Journals (Sweden)

Wenchao Tian

2018-04-01

Full Text Available Due to their high isolation, low insertion loss, high linearity, and low power consumption, microelectromechanical systems (MEMS switches have drawn much attention from researchers in recent years. In this paper, we introduce the research status of MEMS switches in different bands and several reliability issues, such as dielectric charging, contact failure, and temperature instability. In this paper, some of the following methods to improve the performance of MEMS switches in high frequency are summarized: (1 utilizing combinations of several switches in series; (2 covering a float metal layer on the dielectric layer; (3 using dielectric layer materials with high dielectric constants and conductor materials with low resistance; (4 developing MEMS switches using T-match and π-match; (5 designing MEMS switches based on bipolar complementary metal–oxide–semiconductor (BiCMOS technology and reconfigurable MEMS’ surfaces; (6 employing thermal compensation structures, circularly symmetric structures, thermal buckle-beam actuators, molybdenum membrane, and thin-film packaging; (7 selecting Ultra-NanoCrystalline diamond or aluminum nitride dielectric materials and applying a bipolar driving voltage, stoppers, and a double-dielectric-layer structure; and (8 adopting gold alloying with carbon nanotubes (CNTs, hermetic and reliable packaging, and mN-level contact.

Clinical information in drug package inserts in India

Directory of Open Access Journals (Sweden)

Shivkar Y

2009-01-01

Full Text Available Background: It is widely recognized that accurate and reliable product information is essential for the safe and effective use of medications. Pharmaceutical companies are the primary source of most drug information, including package inserts. Package inserts are printed leaflets accompanying marketed drug products and contain information approved by the regulatory agencies. Studies on package inserts in India, in 1996, had shown that crucial information was often missing and they lacked uniformity. Aim: To assess the presentation and completeness of clinically important information provided in the currently available package inserts in India. Materials and Methods: Package inserts accompanying allopathic drug products marketed by pharmaceutical companies in India were collected. These package inserts were analyzed for the content of clinically important information in various sections. Statistical Analysis: The results were expressed as absolute numbers and percentages. Results: Preliminary analyses revealed that most package inserts did contain information under headings, such as, therapeutic indications, contraindications, undesirable effects, etc., listed in the Drugs and Cosmetics Rules 1945. The findings indicated considerable improvement in package inserts since 1996. However, on critical evaluation it was revealed that clinically important information was not well presented and was often incomplete. Information with regard to pediatric and geriatric use was present in only 44% and 13% of the package inserts, respectively. Only five of the inserts had information on the most frequent adverse drug reactions associated with the drug. Also, information on interactions and overdosage was often missing. Conclusion: Although the package inserts appear to have improved over the past decade there is still a definite need to further refine the clinical information contained, to minimize the risks to patients. This could be brought about by self

Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

Science.gov (United States)

Strickland, S. M.; Hester, J. D.; Gowan, A. K.; Montgomery, R. K.; Geist, D. L.; Blanche, J. F.; McGuire, G. D.; Nash, T. S.

2011-01-01

As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

Continuously Operating Biosensor and Its Integration into a Hermetically Sealed Medical Implant

Directory of Open Access Journals (Sweden)

Mario Birkholz

2016-10-01

Full Text Available An integration concept for an implantable biosensor for the continuous monitoring of blood sugar levels is presented. The system architecture is based on technical modules used in cardiovascular implants in order to minimize legal certification efforts for its perspective usage in medical applications. The sensor chip operates via the principle of affinity viscometry, which is realized by a fully embedded biomedical microelectromechanical systems (BioMEMS prepared in 0.25-µm complementary metal–oxide–semiconductor (CMOS/BiCMOS technology. Communication with a base station is established in the 402–405 MHz band used for medical implant communication services (MICS. The implant shall operate within the interstitial tissue, and the hermetical sealing of the electronic system against interaction with the body fluid is established using titanium housing. Only the sensor chip and the antenna are encapsulated in an epoxy header closely connected to the metallic housing. The study demonstrates that biosensor implants for the sensing of low-molecular-weight metabolites in the interstitial may successfully rely on components already established in cardiovascular implantology.

Packaged solar water heating technology: twenty years of progress

International Nuclear Information System (INIS)

Morrison, Graham; Wood, Byard

2000-01-01

The world market for packaged solar water heaters is reviewed, and descriptions are given of the different types of solar domestic water heaters (SDWH), design concepts for packaged SDWH, thermosyphon SDWH, evacuated insulation and excavated tube collectors, seasonally biased solar collectors, heat pump water heaters, and photovoltaic water heaters. The consumer market value for SDWHs is explained, and the results of a survey of solar water heating are summarised covering advantages, perceived disadvantages, the relative importance of purchase decision factors, experience with system components, and the most frequent maintenance problems. The durability, reliability, and performance of SDWHs are discussed

Application of electron irradiation to food containers and packaging materials

International Nuclear Information System (INIS)

Ueno, Koji

2010-01-01

Problems caused by microbial contamination and hazardous chemicals have attracted much attention in the food industry. The number of systems such as hygienic management systems and Hazard Analysis Critical Control Point (HACCP) systems adopted in the manufacturing process is increasing. As manufacturing process control has become stricter, stricter control is also required for microbial control for containers and packaging materials (from disinfection to sterilization). Since safe and reliable methods for sterilizing food containers and packaging materials that leave no residue are required, electron beam sterilization used for medical equipment has attracted attention from the food industry. This paper describes an electron irradiation facility, methods for applying electron beams to food containers and packaging materials, and products irradiated with electron beams. (author)

Failure database and tools for wind turbine availability and reliability analyses. The application of reliability data for selected wind turbines

DEFF Research Database (Denmark)

Kozine, Igor; Christensen, P.; Winther-Jensen, M.

2000-01-01

The objective of this project was to develop and establish a database for collecting reliability and reliability-related data, for assessing the reliability of wind turbine components and subsystems and wind turbines as a whole, as well as for assessingwind turbine availability while ranking the ...... similar safety systems. The database was established with Microsoft Access DatabaseManagement System, the software for reliability and availability assessments was created with Visual Basic....... the contributions at both the component and system levels. The project resulted in a software package combining a failure database with programs for predicting WTB availability and the reliability of all thecomponents and systems, especially the safety system. The report consists of a description of the theoretical......The objective of this project was to develop and establish a database for collecting reliability and reliability-related data, for assessing the reliability of wind turbine components and subsystems and wind turbines as a whole, as well as for assessingwind turbine availability while ranking...

Technique development for modulus, microcracking, hermeticity, and coating evaluation capability characterization of SiC/SiC tubes

Energy Technology Data Exchange (ETDEWEB)

Hu, Xunxiang [Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States); Ang, Caen K. [Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States); Singh, Gyanender P. [Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States); Katoh, Yutai [Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)

2016-08-01

Driven by the need to enlarge the safety margins of nuclear fission reactors in accident scenarios, research and development of accident-tolerant fuel has become an important topic in the nuclear engineering and materials community. A continuous-fiber SiC/SiC composite is under consideration as a replacement for traditional zirconium alloy cladding owing to its high-temperature stability, chemical inertness, and exceptional irradiation resistance. An important task is the development of characterization techniques for SiC/SiC cladding, since traditional work using rectangular bars or disks cannot directly provide useful information on the properties of SiC/SiC composite tubes for fuel cladding applications. At Oak Ridge National Laboratory, experimental capabilities are under development to characterize the modulus, microcracking, and hermeticity of as-fabricated, as-irradiated SiC/SiC composite tubes. Resonant ultrasound spectroscopy has been validated as a promising technique to evaluate the elastic properties of SiC/SiC composite tubes and microcracking within the material. A similar technique, impulse excitation, is efficient in determining the basic mechanical properties of SiC bars prepared by chemical vapor deposition; it also has potential for application in studying the mechanical properties of SiC/SiC composite tubes. Complete evaluation of the quality of the developed coatings, a major mitigation strategy against gas permeation and hydrothermal corrosion, requires the deployment of various experimental techniques, such as scratch indentation, tensile pulling-off tests, and scanning electron microscopy. In addition, a comprehensive permeation test station is being established to assess the hermeticity of SiC/SiC composite tubes and to determine the H/D/He permeability of SiC/SiC composites. This report summarizes the current status of the development of these experimental capabilities.

Packaged Capacitive Pressure Sensor System for Aircraft Engine Health Monitoring

Science.gov (United States)

Scardelletti, Maximilian C.; Zorman, Christian A.

2016-01-01

This paper describes the development of a packaged silicon carbide (SiC) based MEMS pressure sensor system designed specifically for a conventional turbofan engine. The electronic circuit is based on a Clapp-type oscillator that incorporates a 6H-SiC MESFET, a SiCN MEMS capacitive pressure sensor, titanate MIM capacitors, wirewound inductors, and thick film resistors. The pressure sensor serves as the capacitor in the LC tank circuit, thereby linking pressure to the resonant frequency of the oscillator. The oscillator and DC bias circuitry were fabricated on an alumina substrate and secured inside a metal housing. The packaged sensing system reliably operates at 0 to 350 psi and 25 to 540C. The system has a pressure sensitivity of 6.8 x 10E-2 MHzpsi. The packaged system shows negligible difference in frequency response between 25 and 400C. The fully packaged sensor passed standard benchtop acceptance tests and was evaluated on a flight-worthy engine.

DMD reliability: a MEMS success story

Science.gov (United States)

Douglass, Michael

2003-01-01

The Digital Micromirror Device (DMD) developed by Texas Instruments (TI) has made tremendous progress in both performance and reliability since it was first invented in 1987. From the first working concept of a bistable mirror, the DMD is now providing high-brightness, high-contrast, and high-reliability in over 1,500,000 projectors using Digital Light Processing technology. In early 2000, TI introduced the first DMD chip with a smaller mirror (14-micron pitch versus 17-micron pitch). This allowed a greater number of high-resolution DMD chips per wafer, thus providing an increased output capacity as well as the flexibility to use existing package designs. By using existing package designs, subsequent DMDs cost less as well as met our customers' demand for faster time to market. In recent years, the DMD achieved the status of being a commercially successful MEMS device. It reached this status by the efforts of hundreds of individuals working toward a common goal over many years. Neither textbooks nor design guidelines existed at the time. There was little infrastructure in place to support such a large endeavor. The knowledge we gained through our characterization and testing was all we had available to us through the first few years of development. Reliability was only a goal in 1992 when production development activity started; a goal that many throughout the industry and even within Texas Instruments doubted the DMD could achieve. The results presented in this paper demonstrate that we succeeded by exceeding the reliability goals.

Non-Destructive Testing for Control of Radioactive Waste Package

Science.gov (United States)

Plumeri, S.; Carrel, F.

2015-10-01

Characterization and control of radioactive waste packages are important issues in the management of a radioactive waste repository. Therefore, Andra performs quality control inspection on radwaste package before disposal to ensure the compliance of the radwast characteristics with Andra waste disposal specifications and to check the consistency between Andra measurements results and producer declared properties. Objectives of this quality control are: assessment and improvement of producer radwaste packages quality mastery, guarantee of the radwaste disposal safety, maintain of the public confidence. To control radiological characteristics of radwaste package, non-destructive passive methods (gamma spectrometry and neutrons counting) are commonly used. These passive methods may not be sufficient, for instance to control the mass of fissile material contained inside radwaste package. This is particularly true for large concrete hull of heterogeneous radwaste containing several actinides mixed with fission products like 137Cs. Non-destructive active methods, like measurement of photofission delayed neutrons, allow to quantify the global mass of actinides and is a promising method to quantify mass of fissile material. Andra has performed different non-destructive measurements on concrete intermediate-level short lived nuclear waste (ILW-SL) package to control its nuclear material content. These tests have allowed Andra to have a first evaluation of the performance of photofission delayed neutron measurement and to identify development needed to have a reliable method, especially for fissile material mass control in intermediate-level long lived waste package.

Assembly reliability of CSPs with various chiip sizes by accelerated thermal and mechanical cycling test

Science.gov (United States)

Ghaffarian, R.

2000-01-01

A JPL-led chip scale package (CSP) Consortium, composed of team members representing government agencies and private companies, recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.

Comparative evaluations of the Monte Carlo-based light propagation simulation packages for optical imaging

Directory of Open Access Journals (Sweden)

Lin Wang

2018-01-01

Full Text Available Monte Carlo simulation of light propagation in turbid medium has been studied for years. A number of software packages have been developed to handle with such issue. However, it is hard to compare these simulation packages, especially for tissues with complex heterogeneous structures. Here, we first designed a group of mesh datasets generated by Iso2Mesh software, and used them to cross-validate the accuracy and to evaluate the performance of four Monte Carlo-based simulation packages, including Monte Carlo model of steady-state light transport in multi-layered tissues (MCML, tetrahedron-based inhomogeneous Monte Carlo optical simulator (TIMOS, Molecular Optical Simulation Environment (MOSE, and Mesh-based Monte Carlo (MMC. The performance of each package was evaluated based on the designed mesh datasets. The merits and demerits of each package were also discussed. Comparative results showed that the TIMOS package provided the best performance, which proved to be a reliable, efficient, and stable MC simulation package for users.

Safety Analysis Report - Packages, 9965, 9968, 9972-9975 Packages

International Nuclear Information System (INIS)

Blanton, P.

2000-01-01

This Safety Analysis Report for Packaging (SARP) documents the analysis and testing performed on four type B Packages: the 9972, 9973, 9974, and 9975 packages. Because all four packages have similar designs with very similar performance characteristics, all of them are presented in a single SARP. The performance evaluation presented in this SARP documents the compliance of the 9975 package with the regulatory safety requirements. Evaluations of the 9972, 9973, and 9974 packages support that of the 9975. To avoid confusion arising from the inclusion of four packages in a single document, the text segregates the data for each package in such a way that the reader interested in only one package can progress from Chapter 1 through Chapter 9. The directory at the beginning of each chapter identifies each section that should be read for a given package. Sections marked ''all'' are generic to all packages

Isothermal solidification based packaging of biosensors at low temperatures

International Nuclear Information System (INIS)

Sharma, R.P.; Khanna, P.K.; Kumar, D.

2010-01-01

Thick film Au printed square contact pads are interconnected to Cu substrates at constant pressure and temperature using the isothermal solidification of Bi-In alloy on the joining surfaces. The effect of reaction time on the mechanical strength of the package has been analyzed. Thermal stability of the fabricated specimens have been measured and discussed. The delaminated surfaces examined optically reveal the morphology of the metallization zones on the joining substrates. The scanning electron microscopy of these surfaces is reported in this paper. Tests for thermal shock, pH resistivity and shelf life have been carried out to predict the reliability of the packaging for long term applications.

Sensors and packages based on LTCC and thick-film technology for ...

Indian Academy of Sciences (India)

Reliable operation in harsh environments such as high temperatures, high pressures, aggressive media and space, poses special requirements for sensors and packages, which usually cannot be met using polymer-based technologies. Ceramic technologies, especially LTCC (Low-Temperature Cofired Ceramic), offer a ...

Electronic packaging: new results in singulation by Laser Microjet

Science.gov (United States)

Wagner, Frank; Sibailly, Ochelio; Richerzhagen, Bernold

2004-07-01

Cutting electronic packages that are produced in a matrix array fashion is an important process and deals with the ready-to-use devices. Thus an increase in the singulation yield is directly correlated to an increase in benefit. Due to the usage of different substrate materials, the saws encounter big problems in terms of lifetime and constancy of cut quality in these applications. Today"s equipment manufacturers are not yet in the position to propose an adequate solution for all types of packages. Compared to classical laser cutting, the water-jet guided laser technology minimizes the heat damages in any kind of sample. This new material processing method consists in guiding a laser beam inside a hair thin, lowpressure water-jet by total internal reflection, and is applied to package singulation since two years approximately. Using a frequency doubled Nd:YAG laser guided by a water jet, an LTCC-ceramics based package is singulated according to a scribe and break process. Speeds of 2-10 mm/s are reached in the LTTC and 40 mm/s in the mold compound. The process is wear-free and provides very good edge quality of the LTCC and the mold compound as well as reliable separation of the packages.

Chip-package nano-structured copper and nickel interconnections with metallic and polymeric bonding interfaces

Science.gov (United States)

Aggarwal, Ankur

With the semiconductor industry racing toward a historic transition, nano chips with less than 45 nm features demand I/Os in excess of 20,000 that support computing speed in terabits per second, with multi-core processors aggregately providing highest bandwidth at lowest power. On the other hand, emerging mixed signal systems are driving the need for 3D packaging with embedded active components and ultra-short interconnections. Decreasing I/O pitch together with low cost, high electrical performance and high reliability are the key technological challenges identified by the 2005 International Technology Roadmap for Semiconductors (ITRS). Being able to provide several fold increase in the chip-to-package vertical interconnect density is essential for garnering the true benefits of nanotechnology that will utilize nano-scale devices. Electrical interconnections are multi-functional materials that must also be able to withstand complex, sustained and cyclic thermo-mechanical loads. In addition, the materials must be environmentally-friendly, corrosion resistant, thermally stable over a long time, and resistant to electro-migration. A major challenge is also to develop economic processes that can be integrated into back end of the wafer foundry, i.e. with wafer level packaging. Device-to-system board interconnections are typically accomplished today with either wire bonding or solders. Both of these are incremental and run into either electrical or mechanical barriers as they are extended to higher density of interconnections. Downscaling traditional solder bump interconnect will not satisfy the thermo-mechanical reliability requirements at very fine pitches of the order of 30 microns and less. Alternate interconnection approaches such as compliant interconnects typically require lengthy connections and are therefore limited in terms of electrical properties, although expected to meet the mechanical requirements. A novel chip-package interconnection technology is

Design for reliability of solid state lighting systems

NARCIS (Netherlands)

Perpiñà, X.; Werkhoven, R.J.; Jakovenko, J.; Formánek, J.; Vellvehi, M.; Jordà, X.; Kunen, J.M.G.; Bancken, P.; Bolt, P.J.

2012-01-01

This work presents a methodology to design an SSL system for reliability. An LED lamp is thermally characterised and its model thermally simulated, indicating that the LED board (FR4 board with thermal vias, copper tracks and LED package) is the thermally most stressed part. Therefore, a

Packaging Solutions : Delivering customer value through Logistical Packaging: A Case Study at Stora Enso Packaging

OpenAIRE

Shan, Kun; Julius, Joezer

2015-01-01

AbstractBackground;Despite of the significant role of packaging within logistics and supply chain management, packaging is infrequently studied as focal point in supply chain. Most of the previous logistics research studies tend to explain the integration between packaging and logistics through logistical packaging. In very rare cases, the studies mentioned about customer value. Therefore the major disadvantage of these studies is that, they didn’t consider logistical packaging and customer v...

Utilization of Pb-free solders in MEMS packaging

Science.gov (United States)

Selvaduray, Guna S.

2003-01-01

Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

Reliability and validity enhancement: a treatment package for increasing fidelity of self-report.

Science.gov (United States)

Bornstein, P H; Hamilton, S B; Miller, R K; Quevillon, R P; Spitzform, M

1977-07-01

This study investigated the effects of reliability and validity "enhancers" on fidelity of self-report data in an analogue therapy situation. Under the guise of a Concentration Skills Training Program, 57 Ss were assigned randomly to one of the following conditions: (a) Reliability Enhancement; (b) Truth Talk; (c) No Comment Control. Results indicated significant differences among groups (p less than .05). In addition, tests of multiple comparisons revealed that Reliability Enhancement was significantly different from Truth Talk in occurrences of unreliability (p less than .05). These findings are discussed in light of the increased reliance on self-report data in behavioral intervention, and recommendations are made for future research.

Packaging of silicon sensors for microfluidic bio-analytical applications

International Nuclear Information System (INIS)

Wimberger-Friedl, Reinhold; Prins, Menno; Megens, Mischa; Dittmer, Wendy; Witz, Christiane de; Nellissen, Ton; Weekamp, Wim; Delft, Jan van; Ansems, Will; Iersel, Ben van

2009-01-01

A new industrial concept is presented for packaging biosensor chips in disposable microfluidic cartridges to enable medical diagnostic applications. The inorganic electronic substrates, such as silicon or glass, are integrated in a polymer package which provides the electrical and fluidic interconnections to the world and provides mechanical strength and protection for out-of-lab use. The demonstrated prototype consists of a molded interconnection device (MID), a silicon-based giant magneto-resistive (GMR) biosensor chip, a flex and a polymer fluidic part with integrated tubing. The various processes are compatible with mass manufacturing and run at a high yield. The devices show a reliable electrical interconnection between the sensor chip and readout electronics during extended wet operation. Sandwich immunoassays were carried out in the cartridges with surface functionalized sensor chips. Biological response curves were determined for different concentrations of parathyroid hormone (PTH) on the packaged biosensor, which demonstrates the functionality and biocompatibility of the devices. The new packaging concept provides a platform for easy further integration of electrical and fluidic functions, as for instance required for integrated molecular diagnostic devices in cost-effective mass manufacturing

Packaging fluency

DEFF Research Database (Denmark)

Mocanu, Ana; Chrysochou, Polymeros; Bogomolova, Svetlana

2011-01-01

Research on packaging stresses the need for packaging design to read easily, presuming fast and accurate processing of product-related information. In this paper we define this property of packaging as “packaging fluency”. Based on the existing marketing and cognitive psychology literature on pac...

Packaging - Materials review

Energy Technology Data Exchange (ETDEWEB)

Herrmann, Matthias [Hoppecke Advanced Battery Technology GmbH, 08056 Zwickau (Germany)

2014-06-16

Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

Packaging - Materials review

Science.gov (United States)

Herrmann, Matthias

2014-06-01

Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

Packaging - Materials review

International Nuclear Information System (INIS)

Herrmann, Matthias

2014-01-01

Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

Microelectronic packaging

CERN Document Server

Datta, M; Schultze, J Walter

2004-01-01

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impac

Quality assurance requirements in the testing of packages to be used for safe transportation of RAM

International Nuclear Information System (INIS)

Vieru, Gheorghe; Nistor, Viorica; Mihaiu, Ramona

2010-01-01

The quality of the Type A, B or C packages used for transport and storage of Radioactive Material (RAM) has to be proved by performing qualification tests in accordance with the Transport Regulations, within the Reliability and Testing Laboratory, Institute for Nuclear Research (INR) Pitesti, where has designed and developed a new Romanian Testing Facility. The qualifications testing are performed under a strict quality assurance programme based on the specific procedures prior approved by the Romanian Nuclear Regulatory Body CNCAN (National Commission for Nuclear Activity Control). This paper describe the quality assurance programme in accordance with the quality management system developed in order to meet the requirements provided by the national regulations as well as to the requirements of the IAEA's safety standard TS-R-1 related to testing of packages to be used for transport of RAM and also provides an overview of the new Romanian Testing Facilities for RAM Packages, developed by the INR's Reliability and Testing Laboratory within an Excellence Scientific Contract. (authors)

Transuranic package transporter (TRUPACT) system design status and operational support equipment

International Nuclear Information System (INIS)

Johanson, N.W.; Meyer, R.J.; Romesberg, L.E.; Pope, R.B.

1983-01-01

A program was initiated in the late 1970's at Sandia National Laboratories to develop an efficient, safe, reliable, and cost-effective transportation packaging system for the carriage of contact-handled transuranic (CH-TRU) waste within the Department of Energy (DOE) complex. It is anticipated that eventually a family of TRUPACT (TRansUranic PACKage Transporter) systems having varied dimensions and weight/volume capacities will be needed by the DOE to transport different CH-TRU waste forms. Each TRUPACT system will be a Type B packaging. Large quantities of CH-TRU wastes having many different forms, isotopic contents, and contained in a variety of waste containers have been, are being, and will continue to be produced and stored for ultimate disposal. Packaging design is being closely coordinated with facility designs to ensure the rapid and economic integration of the TRUPACT system. The first packaging developed for transport by truck or rail (bimodal) is designated TRUPACT-I and will become operational in 1984. This paper provides an overview of progress on the TRUPACT-I design and details of equipment to be used for interfacing with users

Análisis del comportamiento de la capacidad frigorífica en compresores herméticos en Cuba. // Behaviour of the refrigeration capacity in hermetic compressors.

Directory of Open Access Journals (Sweden)

K. Arencibia Avila

2004-09-01

Full Text Available El índice de roturas de los compresores herméticos en Cuba (4 % se encuentra muy por encima de los estándaresinternacionales de calidad (0, 04 %. El objetivo del trabajo que se presenta fue la determinación de la capacidad frigoríficaa tres tipos de compresores herméticos diferentes en condiciones ambientales como las existentes en el país. Las pruebasexperimentales se realizaron en laboratorios certificados por las normas ISO 9002 e ISO 14 000.El análisis muestra que se pierde más del 10 % de la capacidad frigorífica del compresor. De ello se deduce que la simpletransferencia de tecnología no puede ser una solución para las necesidades crecientes de equipos de refrigeración en el país.Los equipos y sistemas de este tipo tienen que ser diseñados especialmente para las condiciones cubanas con el objetivo delograr eficiencias aceptables, equivalentes a la media mundial y acorde a la situación energética que afronta el mundoactualmente.Palabras claves: Compresores herméticos, refrigeración.___________________________________________________________________________Abstract.The break rate of hermetic compressors in Cuba (4% is well over the international standards of quality (0. 04 %. Thepurpose of this word was to determine the refrigeration capacity to three kinds of hermetic compressors in environmentalconditions like the ones existing in the country. The experimental test were carried out in laboratories certified by ISO 9002and ISO 14 000.The analysis shows that more than 10 % of the refrigeration capacity of the compressors is lost. We can say that a simpletransference of technology cannot be a solution to the increasing needs of refrigeration equipment. The systems andequipment of this kind have to be specially designed to meet our conditions, with the aim of achieving acceptableefficiencies, similar to those of the world average, and according to the energy situation that the world is facing nowadays.Key Words: Hermetic

Monolithically Integrated Light Feedback Control Circuit for Blue/UV LED Smart Package

NARCIS (Netherlands)

Koladouz Esfahani, Z.; Tohidian, M.; van Zeijl, H.W.; Kolahdouz, Mohammadreza; Zhang, G.Q.

2017-01-01

Given the performance decay of high-power light-emitting diode (LED) chips over time and package condition changes, having a reliable output light for sensitive applications is a point of concern. In this study, a light feedback control circuit, including blue-selective photodiodes, for

Reliability of spring interconnects for high channel-count polyimide electrode arrays

Science.gov (United States)

Khan, Sharif; Ordonez, Juan Sebastian; Stieglitz, Thomas

2018-05-01

Active neural implants with a high channel-count need robust and reliable operational assembly for the targeted environment in order to be classified as viable fully implantable systems. The discrete functionality of the electrode array and the implant electronics is vital for intact assembly. A critical interface exists at the interconnection sites between the electrode array and the implant electronics, especially in hybrid assemblies (e.g. retinal implants) where electrodes and electronics are not on the same substrate. Since the interconnects in such assemblies cannot be hermetically sealed, reliable protection against the physiological environment is essential for delivering high insulation resistance and low defusibility of salt ions, which are limited in complexity by current assembly techniques. This work reports on a combination of spring-type interconnects on a polyimide array with silicone rubber gasket insulation for chronically active implantable systems. The spring design of the interconnects on the backend of the electrode array compensates for the uniform thickness of the sandwiched gasket during bonding in assembly and relieves the propagation of extrinsic stresses to the bulk polyimide substrate. The contact resistance of the microflex-bonded spring interconnects with the underlying metallized ceramic test vehicles and insulation through the gasket between adjacent contacts was investigated against the MIL883 standard. The contact and insulation resistances remained stable in the exhausting environmental conditions.

The Packaging Handbook -- A guide to package design

International Nuclear Information System (INIS)

Shappert, L.B.

1995-01-01

The Packaging Handbook is a compilation of 14 technical chapters and five appendices that address the life cycle of a packaging which is intended to transport radioactive material by any transport mode in normal commerce. Although many topics are discussed in depth, this document focuses on the design aspects of a packaging. The Handbook, which is being prepared under the direction of the US Department of Energy, is intended to provide a wealth of technical guidance that will give designers a better understanding of the regulatory approval process, preferences of regulators in specific aspects of packaging design, and the types of analyses that should be seriously considered when developing the packaging design. Even though the Handbook is concerned with all packagings, most of the emphasis is placed on large packagings that are capable of transporting large radioactive sources that are also fissile (e.g., spent fuel). These are the types of packagings that must address the widest range of technical topics in order to meet domestic and international regulations. Most of the chapters in the Handbook have been drafted and submitted to the Oak Ridge National Laboratory for editing; the majority of these have been edited. This report summarizes the contents

Development of prediction system of dose equivalent rate around a package

International Nuclear Information System (INIS)

Nakao, Tetsuya; Minakami, Goro; Taniuchi, Hiroaki; Fujisawa, Kyosuke; Matsukawa, Yukio; Mimura, Shigemi.

1993-01-01

A new system is developed that can evaluate the radiation strength of the source in detail, on the basis of the irradiation history of each fuel assembly in a TN-12 or 12A package, and then to determine the best way to organize the assemblies in the package so that the dose equivalent rate around a package is kept to a minimum. This system for minimizing the danger of radiation for operators involved in packaging and transporting spent fuel was developed for personal computer use, to offer ease in handling and high adaptability. The data input is done in dialogue style, with a variety of check functions. In checks to verify the accuracy of the shielding calculation data in this system by comparing the calculated values with several kinds of measured values, the reliability of this new system has been shown to be very high. Since its high utility has been recognized, the system has already been put into use in actual transportation situations. (J.P.N.)

Evaluation of finite element codes for demonstrating the performance of radioactive material packages in hypothetical accident drop scenarios

International Nuclear Information System (INIS)

Tso, C.F.; Hueggenberg, R.

2004-01-01

Drop testing and analysis are the two methods for demonstrating the performance of packages in hypothetical drop accident scenarios. The exact purpose of the tests and the analyses, and the relative prominence of the two in the license application, may depend on the Competent Authority and will vary between countries. The Finite Element Method (FEM) is a powerful analysis tool. A reliable finite element (FE) code when used correctly and appropriately, will allow a package's behaviour to be simulated reliably. With improvements in computing power, and in sophistication and reliability of FE codes, it is likely that FEM calculations will increasingly be used as evidence of drop test performance when seeking Competent Authority approval. What is lacking at the moment, however, is a standardised method of assessing a FE code in order to determine whether it is sufficiently reliable or pessimistic. To this end, the project Evaluation of Codes for Analysing the Drop Test Performance of Radioactive Material Transport Containers, funded by the European Commission Directorate-General XVII (now Directorate-General for Energy and Transport) and jointly performed by Arup and Gesellschaft fuer Nuklear-Behaelter mbH, was carried out in 1998. The work consisted of three components: Survey of existing finite element software, with a view to finding codes that may be capable of analysing drop test performance of radioactive material packages, and to produce an inventory of them. Develop a set of benchmark problems to evaluate software used for analysing the drop test performance of packages. Evaluate the finite element codes by testing them against the benchmarks This paper presents a summary of this work

Evaluation of finite element codes for demonstrating the performance of radioactive material packages in hypothetical accident drop scenarios

Energy Technology Data Exchange (ETDEWEB)

Tso, C.F. [Arup (United Kingdom); Hueggenberg, R. [Gesellschaft fuer Nuklear-Behaelter mbH (Germany)

2004-07-01

Drop testing and analysis are the two methods for demonstrating the performance of packages in hypothetical drop accident scenarios. The exact purpose of the tests and the analyses, and the relative prominence of the two in the license application, may depend on the Competent Authority and will vary between countries. The Finite Element Method (FEM) is a powerful analysis tool. A reliable finite element (FE) code when used correctly and appropriately, will allow a package's behaviour to be simulated reliably. With improvements in computing power, and in sophistication and reliability of FE codes, it is likely that FEM calculations will increasingly be used as evidence of drop test performance when seeking Competent Authority approval. What is lacking at the moment, however, is a standardised method of assessing a FE code in order to determine whether it is sufficiently reliable or pessimistic. To this end, the project Evaluation of Codes for Analysing the Drop Test Performance of Radioactive Material Transport Containers, funded by the European Commission Directorate-General XVII (now Directorate-General for Energy and Transport) and jointly performed by Arup and Gesellschaft fuer Nuklear-Behaelter mbH, was carried out in 1998. The work consisted of three components: Survey of existing finite element software, with a view to finding codes that may be capable of analysing drop test performance of radioactive material packages, and to produce an inventory of them. Develop a set of benchmark problems to evaluate software used for analysing the drop test performance of packages. Evaluate the finite element codes by testing them against the benchmarks This paper presents a summary of this work.

JTEC Panel report on electronic manufacturing and packaging in Japan

Science.gov (United States)

Kelly, Michael J.; Boulton, William R. (Editor); Kukowski, John; Meieran, Gene; Pecht, Michael; Peeples, John; Tummala, Rao; Dehaemer, Michael J.; Holdridge, Geoff (Editor); Gamota, George

1995-01-01

This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies.

CGHnormaliter: a bioconductor package for normalization of array CGH data with many CNAs.

NARCIS (Netherlands)

van Houte, B.P.P.; Binsl, T.W.; Hettling, H.; Heringa, J.

2010-01-01

Summary: CGHnormaliter is a package for normalization of array comparative genomic hybridization (aCGH) data. It uses an iterative procedure that effectively eliminates the influence of imbalanced copy numbers. This leads to a more reliable assessment of copy number alterations (CNAs). CGHnormaliter

The development of an enhanced strain measurement device to support testing of radioactive material packages

International Nuclear Information System (INIS)

Uncapkher, W.L.; Arviso, M.

1995-01-01

Radioactive material package designers use structural testing to verify and demonstrate package performance. A major part of evaluating structural response is the collection of reliable instrumentation measurement data. Over the last four decades, Sandia National Laboratories (SNL) has been actively involved in the development, testing, and evaluation of measurement devices for a broad range of applications, resulting in the commercialization of several measurement devices commonly used today. SNL maintains an ongoing program sponsored by the US Department of Energy (DOE) to develop and evaluate measurement devices to support testing of packages used to transport radioactive or hazardous materials. The development of the enhanced strain measurement device is part of this program

Through-glass copper via using the glass reflow and seedless electroplating processes for wafer-level RF MEMS packaging

International Nuclear Information System (INIS)

Lee, Ju-Yong; Lee, Sung-Woo; Lee, Seung-Ki; Park, Jae-Hyoung

2013-01-01

We present a novel method for the fabrication of void-free copper-filled through-glass-vias (TGVs), and their application to the wafer-level radio frequency microelectromechanical systems (RF MEMS) packaging scheme. By using the glass reflow process with a patterned silicon mold, a vertical TGV with smooth sidewall and fine pitch could be achieved. Bottom-up void-free filling of the TGV is successfully demonstrated through the seedless copper electroplating process. In addition, the proposed process allows wafer-level packaging with glass cap encapsulation using the anodic bonding process, since the reflowed glass interposer is only formed in the device area surrounded with silicon substrate. A simple coplanar waveguide (CPW) line was employed as the packaged device to evaluate the electrical characteristics and thermo-mechanical reliability of the proposed packaging structure. The fabricated packaging structure showed a low insertion loss of 0.116 dB and a high return loss of 35.537 dB at 20 GHz, which were measured through the whole electrical path, including the CPW line, TGVs and contact pads. An insertion loss lower than 0.1 dB and a return loss higher than 30 dB could be achieved at frequencies of up to 15 GHz, and the resistance of the single copper via was measured to be 36 mΩ. Furthermore, the thermo-mechanical reliability of the proposed packaging structure was also verified through thermal shock and pressure cooker test. (paper)

MEMS packaging

CERN Document Server

Hsu , Tai-Ran

2004-01-01

MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

Packaging design criteria for the Hanford Ecorok Packaging

International Nuclear Information System (INIS)

Mercado, M.S.

1996-01-01

The Hanford Ecorok Packaging (HEP) will be used to ship contaminated water purification filters from K Basins to the Central Waste Complex. This packaging design criteria documents the design of the HEP, its intended use, and the transportation safety criteria it is required to meet. This information will serve as a basis for the safety analysis report for packaging

Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring.

Science.gov (United States)

Halonen, Niina; Kilpijärvi, Joni; Sobocinski, Maciej; Datta-Chaudhuri, Timir; Hassinen, Antti; Prakash, Someshekar B; Möller, Peter; Abshire, Pamela; Kellokumpu, Sakari; Lloyd Spetz, Anita

2016-01-01

Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC) microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC) technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.

Packaging of high-power bars for optical pumping and direct applications

Science.gov (United States)

Heinemann, Stefan; An, Haiyan; Barnowski, Tobias; Jiang, John; Negoita, Viorel; Roff, Robert; Vethake, Thilo; Boucke, Konstantin; Treusch, Georg

2015-03-01

Continuous cost reduction, improved reliability and modular platform guide the design of our next generation heatsink and packaging process. Power scaling from a single device effectively lowers the cost, while electrical insulation of the heatsink, low junction temperature and hard solder enable high reliability. We report on the latest results for scaling the output power of bars for optical pumping and materials processing. The epitaxial design and geometric structures are specific for the application, while packaging with minimum thermal impedance, low stress and low smile are generic features. The isolated heatsink shows a thermal impedance of 0.2 K/W and the maximum output power is limited by the requirement of a junction temperature of less than 68oC for high reliability. Low contact impedance are addressed for drive currents of 300 A. For pumping applications, bars with a fill factor of 60% are deployed emitting more than 300 W of output power with an efficiency of about 55% and 8 bars are arranged in a compact pump module emitting 2 kW of collimated power suitable for pumping disk lasers. For direct applications we target coupling kilowatts of output powers into fibers of 100 μm diameter with 0.1 NA based on dense wavelength multiplexing. Low fill factor bars with large optical waveguide and specialized coating also emit 300 W.

21 CFR 113.60 - Containers.

Science.gov (United States)

2010-04-01

... 21 Food and Drugs 2 2010-04-01 2010-04-01 false Containers. 113.60 Section 113.60 Food and Drugs... CONSUMPTION THERMALLY PROCESSED LOW-ACID FOODS PACKAGED IN HERMETICALLY SEALED CONTAINERS Control of Components, Food Product Containers, Closures, and In-Process Materials § 113.60 Containers. (a) Closures...

Gastight Hydrodynamic Electrochemistry: Design for a Hermetically Sealed Rotating Disk Electrode Cell.

Science.gov (United States)

Jung, Suho; Kortlever, Ruud; Jones, Ryan J R; Lichterman, Michael F; Agapie, Theodor; McCrory, Charles C L; Peters, Jonas C

2017-01-03

Rotating disk electrodes (RDEs) are widely used in electrochemical characterization to analyze the mechanisms of various electrocatalytic reactions. RDE experiments often make use of or require collection and quantification of gaseous products. The combination of rotating parts and gaseous analytes makes the design of RDE cells that allow for headspace analysis challenging due to gas leaks at the interface of the cell body and the rotator. In this manuscript we describe a new, hermetically sealed electrochemical cell that allows for electrode rotation while simultaneously providing a gastight environment. Electrode rotation in this new cell design is controlled by magnetically coupling the working electrode to a rotating magnetic driver. Calibration of the RDE using a tachometer shows that the rotation speed of the electrode is the same as that of the magnetic driver. To validate the performance of this cell for hydrodynamic measurements, limiting currents from the reduction of a potassium ferrocyanide (K 4 [Fe(CN) 6 ]·3H 2 O) were measured and shown to compare favorably with calculated values from the Levich equation and with data obtained using more typical, nongastight RDE cells. Faradaic efficiencies of ∼95% were measured in the gas phase for oxygen evolution in alkaline media at an Inconel 625 alloy electrocatalyst during rotation at 1600 rpm. These data verify that a gastight environment is maintained even during rotation.

Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices

Science.gov (United States)

Michaelides, Stylianos

Flip Chip on Board (FCOB) and Chip-Scale Packages (CSPs) are relatively new technologies that are being increasingly used in the electronic packaging industry. Compared to the more widely used face-up wirebonding and TAB technologies, flip-chips and most CSPs provide the shortest possible leads, lower inductance, higher frequency, better noise control, higher density, greater input/output (I/O), smaller device footprint and lower profile. However, due to the short history and due to the introduction of several new electronic materials, designs, and processing conditions, very limited work has been done to understand the role of material, geometry, and processing parameters on the reliability of flip-chip devices. Also, with the ever-increasing complexity of semiconductor packages and with the continued reduction in time to market, it is too costly to wait until the later stages of design and testing to discover that the reliability is not satisfactory. The objective of the research is to develop integrated process-reliability models that will take into consideration the mechanics of assembly processes to be able to determine the reliability of face-down devices under thermal cycling and long-term temperature dwelling. The models incorporate the time and temperature-dependent constitutive behavior of various materials in the assembly to be able to predict failure modes such as die cracking and solder cracking. In addition, the models account for process-induced defects and macro-micro features of the assembly. Creep-fatigue and continuum-damage mechanics models for the solder interconnects and fracture-mechanics models for the die have been used to determine the reliability of the devices. The results predicted by the models have been successfully validated against experimental data. The validated models have been used to develop qualification and test procedures for implantable medical devices. In addition, the research has helped develop innovative face

Composition and activity variations in bulk gas of drum waste packages of Paks NPP

International Nuclear Information System (INIS)

Molnar, M.; Palcsu, L.; Svingor, E.; Szanto, Zs.; Futo, I.; Ormai, P.

2001-01-01

To obtain reliable estimates of the quantities and rates of the gas production a series of measurements was carried out in drum waste packages generated and temporarily stored at the site of Paks Nuclear Power Plant (Paks NPP). Ten drum waste packages were equipped with sampling valves for repeated sampling. Nine times between 04/02/2000 and 19/07/2001 qualitative gas component analyses of bulk gases of drums were executed. Gas samples were delivered to the laboratory of the ATOMKI for tritium and radiocarbon content measurements.(author)

Packaging microservices

DEFF Research Database (Denmark)

Montesi, Fabrizio; Thrane, Dan Sebastian

2017-01-01

We describe a first proposal for a new packaging system for microservices based on the Jolie programming language, called the Jolie Package Manager (JPM). Its main features revolve around service interfaces, which make the functionalities that a service provides and depends on explicit. For the f......We describe a first proposal for a new packaging system for microservices based on the Jolie programming language, called the Jolie Package Manager (JPM). Its main features revolve around service interfaces, which make the functionalities that a service provides and depends on explicit...

Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging

Directory of Open Access Journals (Sweden)

C. L. Gan

2012-01-01

Full Text Available Bondpad cratering, Cu ball bond interface corrosion, IMD (intermetal dielectric cracking, and uncontrolled post-wirebond staging are the key technical barriers in Cu wire development. This paper discusses the UHAST (unbiased HAST reliability performance of Cu wire used in fine-pitch BGA package. In-depth failure analysis has been carried out to identify the failure mechanism under various assembly conditions. Obviously green mold compound, low-halogen substrate, optimized Cu bonding parameters, assembly staging time after wirebonding, and anneal baking after wirebonding are key success factors for Cu wire development in nanoelectronic packaging. Failure mechanisms of Cu ball bonds after UHAST test and CuAl IMC failure characteristics have been proposed and discussed in this paper.

Evaluation of criticality criteria for fissile class II packages in transportation

International Nuclear Information System (INIS)

Thomas, J.T.

1976-01-01

The nuclear criticality safety of packages in transportation is explored systematically by a surface density representation of reflected array criticality of air-spaced units. Typical perturbations to arrays are shown to be related analytically to the corresponding reactivity changes they produce. The reactivity change associated with the removal of three reflecting surfaces from a totally water reflected array is shown to depend upon the fissile material loading of the packages. For U(93.2) metal, the expected reactivity loss can range from 2 to 21%. Replacement of a three-sided reflector of water on a critical array by one of concrete results in a reactivity increase ranging from 0 to 6%. Mass limits established by criticality data for reflected arrays of air-spaced units can provide a minimum, uniform margin of safety, expressible in terms of reactivity, to more reliably specify subcriticality in transport. Mass limits less than those defined by air-spaced units in water-reflected arrays are unnecessary for Fissile Class II packages. (author)

Shielding Calculations on Waste Packages - The Limits and Possibilities of different Calculation Methods by the example of homogeneous and inhomogeneous Waste Packages

Science.gov (United States)

Adams, Mike; Smalian, Silva

2017-09-01

For nuclear waste packages the expected dose rates and nuclide inventory are beforehand calculated. Depending on the package of the nuclear waste deterministic programs like MicroShield® provide a range of results for each type of packaging. Stochastic programs like "Monte-Carlo N-Particle Transport Code System" (MCNP®) on the other hand provide reliable results for complex geometries. However this type of program requires a fully trained operator and calculations are time consuming. The problem here is to choose an appropriate program for a specific geometry. Therefore we compared the results of deterministic programs like MicroShield® and stochastic programs like MCNP®. These comparisons enable us to make a statement about the applicability of the various programs for chosen types of containers. As a conclusion we found that for thin-walled geometries deterministic programs like MicroShield® are well suited to calculate the dose rate. For cylindrical containers with inner shielding however, deterministic programs hit their limits. Furthermore we investigate the effect of an inhomogeneous material and activity distribution on the results. The calculations are still ongoing. Results will be presented in the final abstract.

Reliability Assessment of SiC Power MOSFETs From The End User's Perspective

DEFF Research Database (Denmark)

Karaventzas, Vasilios Dimitris; Nawaz, Muhammad; Iannuzzo, Francesco

2016-01-01

The reliability of commercial Silicon Carbide (SiC) Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) is investigated, and comparative assessment is performed under various test environments. The MOSFETs are tested both regarding the electrical properties of the dies and the packaging...

PRIDE Surveillance Projects Data Packaging Project, Information Package Specification Version 1.0

Energy Technology Data Exchange (ETDEWEB)

Kelleher, D.M.; Shipp, R. L.; Mason, J. D.

2009-09-28

This document contains a specification for a standard XML document format called an information package that can be used to store information and the context required to understand and use that information in information management systems and other types of information archives. An information package consists of packaged information, a set of information metadata that describes the packaged information, and an XML signature that protects the packaged information. The information package described in this specification was designed to be used to store Department of Energy (DOE) and National Nuclear Security Administration (NNSA) information and includes the metadata required for that information: a unique package identifier, information marking that conforms to DOE and NNSA requirements, and access control metadata. Information package metadata can also include information search terms, package history, and notes. Packaged information can be text content, binary content, and the contents of files and other containers. A single information package can contain multiple types of information. All content not in a text form compatible with XML must be in a text encoding such as base64. Package information is protected by a digital XML signature that can be used to determine whether the information has changed since it was signed and to identify the source of the information. This specification has been tested but has not been used to create production information packages. The authors expect that gaps and unclear requirements in this specification will be identified as this specification is used to create information packages and as information stored in information packages is used. The authors expect to issue revised versions of this specification as needed to address these issues.

Deposition and Characterization of Hermetic, Biocompatible Thin Film Coatings for Implantable, Electrically Active Devices

Science.gov (United States)

Sweitzer, Robyn K.

Retinal prostheses may be used to support patients suffering from Age-related macular degeneration or retinitis pigmentosa. A hermetic encapsulation of the poly(imide )-based prosthesis is important in order to prevent the leakage of water and ions into the electric circuitry embedded in the poly(imide) matrix. The deposition of amorphous aluminum oxide (by sputtering) and diamond like carbon (by pulsed laser ablation and vacuum arc vapor deposition) were studied for the application in retinal prostheses. The resulting thin films were characterized for composition, thickness, adhesion and smoothness by scanning electron microscopy-energy dispersive spectroscopy, atomic force microscopy, profilometry and light microscopy. Electrical stability was evaluated and found to be good. The as-deposited films prevented incursion of salinated fluids into the implant over two (2) three month trials soaking in normal saline at body temperature, Biocompatibility was tested in vivo by implanting coated specimen subretinally in the eye of Yucatan pigs. While amorphous aluminum oxide is more readily deposited with sufficient adhesion quality, biocompatibility studies showed a superior behavior of diamond-like carbon. Amorphous aluminum oxide had more adverse effects and caused more severe damage to the retinal tissue.

Mechanical Robustness and Hermeticity Monitoring for MEMS Thin Film Encapsulation

NARCIS (Netherlands)

Santagata, F.

2011-01-01

Many Micro-Electro-Mechanical-Systems (MEMS) require encapsulation, to prevent delicate sensor structures being exposed to external perturbations such as dust, humidity, touching, and gas pressure. An upcoming and cost-effective way of encapsulation is zero-level packaging or thin-film

Structural performance of an IP2 package in free drop test conditions: Numerical and experimental evaluations

International Nuclear Information System (INIS)

Lo Frano, Rosa; Pugliese, Giovanni; Nasta, Marco

2014-01-01

Highlights: • Vertical free drop test. • Qualification of an IP2 type Italian packaging. • Numerical and experimental investigation of the package integrity. • Demonstration the Italian packaging meets safety requirements. - Abstract: The casks or packaging systems used for the transportation of nuclear materials, especially spent fuel elements, have to be designed according to rigorous acceptance requirements, like the IAEA ones, in order to provide protection to human beings and environment against radiation exposure and contamination. This study deals with the free drop test of an Italian design packaging system to be used for the transportation of low and intermediate level radioactive wastes. Impact drop experiments were performed in the Lab. Scalbatraio of the DICI – University of Pisa. Dynamic analyses too have been carried out, by refined models of both the cask and target surface to predict the effects of the impact shock (vertical drop) on the package. The experimental tests and numerical analyses are thoroughly compared, presented and discussed. The numerical approach shows to be suitable to reproduce with good reliability the test situations and results

In-Package Chemistry Abstraction

Energy Technology Data Exchange (ETDEWEB)

P.S. Domski

2003-07-21

The work associated with the development of this model report was performed in accordance with the requirements established in ''Technical Work Plan for Waste Form Degradation Modeling, Testing, and Analyses in Support of SR and LA'' (BSC 2002a). The in-package chemistry model and in-package chemistry model abstraction are developed to predict the bulk chemistry inside of a failed waste package and to provide simplified expressions of that chemistry. The purpose of this work is to provide the abstraction model to the Performance Assessment Project and the Waste Form Department for development of geochemical models of the waste package interior. The scope of this model report is to describe the development and validation of the in-package chemistry model and in-package chemistry model abstraction. The in-package chemistry model will consider chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) and codisposed high-level waste glass (HLWG) and N Reactor spent fuel (CDNR). The in-package chemistry model includes two sub-models, the first a water vapor condensation (WVC) model, where water enters a waste package as vapor and forms a film on the waste package components with subsequent film reactions with the waste package materials and waste form--this is a no-flow model, the reacted fluids do not exit the waste package via advection. The second sub-model of the in-package chemistry model is the seepage dripping model (SDM), where water, water that may have seeped into the repository from the surrounding rock, enters a failed waste package and reacts with the waste package components and waste form, and then exits the waste package with no accumulation of reacted water in the waste package. Both of the submodels of the in-package chemistry model are film models in contrast to past in-package chemistry models where all of the waste package pore space was filled with water. The

In-Package Chemistry Abstraction

International Nuclear Information System (INIS)

P.S. Domski

2003-01-01

The work associated with the development of this model report was performed in accordance with the requirements established in ''Technical Work Plan for Waste Form Degradation Modeling, Testing, and Analyses in Support of SR and LA'' (BSC 2002a). The in-package chemistry model and in-package chemistry model abstraction are developed to predict the bulk chemistry inside of a failed waste package and to provide simplified expressions of that chemistry. The purpose of this work is to provide the abstraction model to the Performance Assessment Project and the Waste Form Department for development of geochemical models of the waste package interior. The scope of this model report is to describe the development and validation of the in-package chemistry model and in-package chemistry model abstraction. The in-package chemistry model will consider chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) and codisposed high-level waste glass (HLWG) and N Reactor spent fuel (CDNR). The in-package chemistry model includes two sub-models, the first a water vapor condensation (WVC) model, where water enters a waste package as vapor and forms a film on the waste package components with subsequent film reactions with the waste package materials and waste form--this is a no-flow model, the reacted fluids do not exit the waste package via advection. The second sub-model of the in-package chemistry model is the seepage dripping model (SDM), where water, water that may have seeped into the repository from the surrounding rock, enters a failed waste package and reacts with the waste package components and waste form, and then exits the waste package with no accumulation of reacted water in the waste package. Both of the submodels of the in-package chemistry model are film models in contrast to past in-package chemistry models where all of the waste package pore space was filled with water. The current in-package

Advancements in meat packaging.

Science.gov (United States)

McMillin, Kenneth W

2017-10-01

Packaging of meat provides the same or similar benefits for raw chilled and processed meats as other types of food packaging. Although air-permeable packaging is most prevalent for raw chilled red meat, vacuum and modified atmosphere packaging offer longer shelf life. The major advancements in meat packaging have been in the widely used plastic polymers while biobased materials and their integration into composite packaging are receiving much attention for functionality and sustainability. At this time, active and intelligent packaging are not widely used for antioxidant, antimicrobial, and other functions to stabilize and enhance meat properties although many options are being developed and investigated. The advances being made in nanotechnology will be incorporated into food packaging and presumably into meat packaging when appropriate and useful. Intelligent packaging using sensors for transmission of desired information and prompting of subsequent changes in packaging materials, environments or the products to maintain safety and quality are still in developmental stages. Copyright © 2017 Elsevier Ltd. All rights reserved.

Scientific investigation plan for NNWSI WBS element 1.2.2.5.L: NNWSI waste package performance assessment: Revision 1

International Nuclear Information System (INIS)

Eggert, K.G.; O'Connell, W.J.; Lappa, D.A.

1986-01-01

Waste package performance assessment contains three broad categories of activities. These activities are: (1) development of a hydrothermal flow and transport model to test concepts to be used in establishing boundary conditions for performance calculations, and to interface EBS release calculations with total system performance calculations; (2) development of a waste package systems model to provide integrated deterministic assessments of performance and analyses of waste package designs; and (3) development of an uncertainty methodology for combination with the system model to perform probabilistic reliability and performance analysis waste package designs. The first category contains activities that aid in determining the scope of a separate, simplified set of hydrologic calculations needed to characterize the waste package environment for performance assessment calculations. The last two activity categories are directly concerned with waste package performance calculations. A rationale for each activity under these groups is presented. All of the activities of performance assessment are either code development or analyses of waste package problems

Color in packaging design : Case: ZheJiang JinSheng packaging Co,Ltd

OpenAIRE

Hu, Cuicui

2010-01-01

Color occupies an important position in packaging design, with the improvement of living standard, the higher requirement of color design in packaging. The aim of this thesis was to discuss key issues concerning aesthetics of packaging design. Topics will include an overview of the packaging design, the influence factor of packaging design, and introduce the aesthetics from packaging aspect. This thesis will also identify common problems of the production process, and list the phases of ho...

Packaging for Sustainability

CERN Document Server

Lewis, Helen; Fitzpatrick, Leanne

2012-01-01

The packaging industry is under pressure from regulators, customers and other stakeholders to improve packaging’s sustainability by reducing its environmental and societal impacts. This is a considerable challenge because of the complex interactions between products and their packaging, and the many roles that packaging plays in the supply chain. Packaging for Sustainability is a concise and readable handbook for practitioners who are trying to implement sustainability strategies for packaging. Industry case studies are used throughout the book to illustrate possible applications and scenarios. Packaging for Sustainability draws on the expertise of researchers and industry practitioners to provide information on business benefits, environmental issues and priorities, environmental evaluation tools, design for environment, marketing strategies, and challenges for the future.

CDIAC catalog of numeric data packages and computer model packages

International Nuclear Information System (INIS)

Boden, T.A.; Stoss, F.W.

1993-05-01

The Carbon Dioxide Information Analysis Center acquires, quality-assures, and distributes to the scientific community numeric data packages (NDPs) and computer model packages (CMPs) dealing with topics related to atmospheric trace-gas concentrations and global climate change. These packages include data on historic and present atmospheric CO 2 and CH 4 concentrations, historic and present oceanic CO 2 concentrations, historic weather and climate around the world, sea-level rise, storm occurrences, volcanic dust in the atmosphere, sources of atmospheric CO 2 , plants' response to elevated CO 2 levels, sunspot occurrences, and many other indicators of, contributors to, or components of climate change. This catalog describes the packages presently offered by CDIAC, reviews the processes used by CDIAC to assure the quality of the data contained in these packages, notes the media on which each package is available, describes the documentation that accompanies each package, and provides ordering information. Numeric data are available in the printed NDPs and CMPs, in CD-ROM format, and from an anonymous FTP area via Internet. All CDIAC information products are available at no cost

Shielding Calculations on Waste Packages – The Limits and Possibilities of different Calculation Methods by the example of homogeneous and inhomogeneous Waste Packages

Directory of Open Access Journals (Sweden)

Adams Mike

2017-01-01

Full Text Available For nuclear waste packages the expected dose rates and nuclide inventory are beforehand calculated. Depending on the package of the nuclear waste deterministic programs like MicroShield® provide a range of results for each type of packaging. Stochastic programs like “Monte-Carlo N-Particle Transport Code System” (MCNP® on the other hand provide reliable results for complex geometries. However this type of program requires a fully trained operator and calculations are time consuming. The problem here is to choose an appropriate program for a specific geometry. Therefore we compared the results of deterministic programs like MicroShield® and stochastic programs like MCNP®. These comparisons enable us to make a statement about the applicability of the various programs for chosen types of containers. As a conclusion we found that for thin-walled geometries deterministic programs like MicroShield® are well suited to calculate the dose rate. For cylindrical containers with inner shielding however, deterministic programs hit their limits. Furthermore we investigate the effect of an inhomogeneous material and activity distribution on the results. The calculations are still ongoing. Results will be presented in the final abstract.

Reliable predictions of waste performance in a geologic repository

International Nuclear Information System (INIS)

Pigford, T.H.; Chambre, P.L.

1985-08-01

Establishing reliable estimates of long-term performance of a waste repository requires emphasis upon valid theories to predict performance. Predicting rates that radionuclides are released from waste packages cannot rest upon empirical extrapolations of laboratory leach data. Reliable predictions can be based on simple bounding theoretical models, such as solubility-limited bulk-flow, if the assumed parameters are reliably known or defensibly conservative. Wherever possible, performance analysis should proceed beyond simple bounding calculations to obtain more realistic - and usually more favorable - estimates of expected performance. Desire for greater realism must be balanced against increasing uncertainties in prediction and loss of reliability. Theoretical predictions of release rate based on mass-transfer analysis are bounding and the theory can be verified. Postulated repository analogues to simulate laboratory leach experiments introduce arbitrary and fictitious repository parameters and are shown not to agree with well-established theory. 34 refs., 3 figs., 2 tabs

Fungal Spoilage in Food Processing.

Science.gov (United States)

Snyder, Abigail B; Worobo, Randy W

2018-06-01

Food processing, packaging, and formulation strategies are often specifically designed to inhibit or control microbial growth to prevent spoilage. Some of the most restrictive strategies rely solely or on combinations of pH reduction, preservatives, water activity limitation, control of oxygen tension, thermal processing, and hermetic packaging. In concert, these strategies are used to inactivate potential spoilage microorganisms or inhibit their growth. However, for select microbes that can overcome these controls, the lack of competition from additional background microbiota helps facilitate their propagation.

Waste package performance assessment

International Nuclear Information System (INIS)

Lester, D.H.

1981-01-01

This paper describes work undertaken to assess the life-expectancy and post-failure nuclide release behavior of high-level and waste packages in a geologic repository. The work involved integrating models of individual phenomena (such as heat transfer, corrosion, package deformation, and nuclide transport) and using existing data to make estimates of post-emplacement behavior of waste packages. A package performance assessment code was developed to predict time to package failure in a flooded repository and subsequent transport of nuclides out of the leaking package. The model has been used to evaluate preliminary package designs. The results indicate, that within the limitation of model assumptions and data base, packages lasting a few hundreds of years could be developed. Very long lived packages may be possible but more comprehensive data are needed to confirm this

Edible packaging materials.

Science.gov (United States)

Janjarasskul, Theeranun; Krochta, John M

2010-01-01

Research groups and the food and pharmaceutical industries recognize edible packaging as a useful alternative or addition to conventional packaging to reduce waste and to create novel applications for improving product stability, quality, safety, variety, and convenience for consumers. Recent studies have explored the ability of biopolymer-based food packaging materials to carry and control-release active compounds. As diverse edible packaging materials derived from various by-products or waste from food industry are being developed, the dry thermoplastic process is advancing rapidly as a feasible commercial edible packaging manufacturing process. The employment of nanocomposite concepts to edible packaging materials promises to improve barrier and mechanical properties and facilitate effective incorporation of bioactive ingredients and other designed functions. In addition to the need for a more fundamental understanding to enable design to desired specifications, edible packaging has to overcome challenges such as regulatory requirements, consumer acceptance, and scaling-up research concepts to commercial applications.

Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring

Directory of Open Access Journals (Sweden)

Niina Halonen

2016-11-01

Full Text Available Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.

Active Packaging Coatings

Directory of Open Access Journals (Sweden)

Luis J. Bastarrachea

2015-11-01

Full Text Available Active food packaging involves the packaging of foods with materials that provide an enhanced functionality, such as antimicrobial, antioxidant or biocatalytic functions. This can be achieved through the incorporation of active compounds into the matrix of the commonly used packaging materials, or by the application of coatings with the corresponding functionality through surface modification. The latter option offers the advantage of preserving the packaging materials’ bulk properties nearly intact. Herein, different coating technologies like embedding for controlled release, immobilization, layer-by-layer deposition, and photografting are explained and their potential application for active food packaging is explored and discussed.

Safety Analysis Report for packaging (onsite) steel waste package

International Nuclear Information System (INIS)

BOEHNKE, W.M.

2000-01-01

The steel waste package is used primarily for the shipment of remote-handled radioactive waste from the 324 Building to the 200 Area for interim storage. The steel waste package is authorized for shipment of transuranic isotopes. The maximum allowable radioactive material that is authorized is 500,000 Ci. This exceeds the highway route controlled quantity (3,000 A 2 s) and is a type B packaging

PRIDE Surveillance Projects Data Packaging Project Information Package Specification Version 1.1

Energy Technology Data Exchange (ETDEWEB)

Kelleher, D. M.; Shipp, R. L.; Mason, J. D.

2010-08-31

Information Package Specification version 1.1 describes an XML document format called an information package that can be used to store information in information management systems and other information archives. An information package consists of package information, the context required to understand and use that information, package metadata that describes the information, and XML signatures that protect the information. The information package described in this specification was designed to store Department of Energy (DOE) and National Nuclear Security Administration (NNSA) information and includes the metadata required for that information: a unique package identifier, information marking that conforms to DOE and NNSA requirements, and access control metadata. It is an implementation of the Open Archival Information System (OAIS) Reference Model archival information package tailored to meet NNSA information storage requirements and designed to be used in the computing environments at the Y-12 National Security Complex and at other NNSA sites.

HPLOT: the graphics interface package for the HBOOK histogramming package

International Nuclear Information System (INIS)

Watkins, H.

1978-01-01

The subroutine package HPLOT described in this report, enables the CERN histogramming package HBOOK to produce high-quality pictures by means of high-resolution devices such as plotters. HPLOT can be implemented on any scientific computing system with a Fortran IV compiler and can be interfaced with any graphics package; spectral routines in addition to the basic ones enable users to embellish their histograms. Examples are also given of the use of HPLOT as a graphics package for plotting simple pictures without histograms. (Auth.)

Increasing the reliability of production schedules in a pharmaceutical packaging department.

Science.gov (United States)

Pacciarelli, Dario; D'Ariano, Andrea

2012-12-01

This paper studies quantitative methods for evaluating the potential benefits of introducing new advanced tracking technologies in the pharmaceutical industry with special reference to radio frequency identification (RFID). RFID technology is an effective way for increasing the quality of the data that are used to generate production schedules, but there is a lack of scientific research to quantify the return on investment that can be achieved in practice. In this work, we distinguish two major sources of data unreliability: one is the inherent stochasticity of operations, which cannot be reduced by RFID, and the other one is the data estimation error, which can be significantly reduced by RFID. We focus on the marginal contribution of the latter quantity to the productivity of the packaging department of a pharmaceutical plant, propose a systematic method for assessing this impact and discuss its implementation in a practical test case. Our results confirm that advanced tracking technologies in combination with effective scheduling procedures show a significant potential for improving productivity. Extensions to other production environments and their issues associated with scheduling problems are also discussed.

Package

Directory of Open Access Journals (Sweden)

Arsić Zoran

2013-01-01

Full Text Available It is duty of the seller to pack the goods in a manner which assures their safe arrival and enables their handling in transit and at the place of destination. The problem of packing is relevant in two main respects. First of all the buyer is in certain circumstances entitled to refuse acceptance of the goods if they are not properly packed. Second, the package is relevant to calculation of price and freight based on weight. In the case of export trade, the package should conform to the legislation in the country of destination. The impact of package on environment is regulated by environment protection regulation of Republic if Serbia.

Reliability analysis of the auxiliary feedwater system; Analiza zanesljivosti sistema pomozne napajalne vode

Energy Technology Data Exchange (ETDEWEB)

Susnik, J; Dusic, M [Institut Jozef Stefan, Ljubljana (Yugoslavia)

1984-07-01

The reliability of a NPP auxiliary feedwater system is evaluated using the fault tree analysis. The system is analyzed during the time interval 0 to 6 hours with the computer package program PREP/KITT which is described in more detail. (author)

Packaging-radiation disinfestation relationships

International Nuclear Information System (INIS)

Highland, H.A.

1985-01-01

Foods that are susceptible to insect infestation can be irradiated to destroy the infestation; however, the food must be kept essentially insect-free until consumed, or it must be disinfested again, perhaps repeatedly. Insect-resistant packages can be used to prevent reinfestation, but there are certain requirements that must be fulfilled before a package can be made insect resistant. These include the use of insect-light construction and packaging materials that resist boring insects. The relative insect resistance of various packages and packaging materials is discussed, as are behavior traits such as egressive boring that enables insects to escape from packages and the ability of insects to climb on various packaging materials. Some successful and unsuccessful attempts to make various types of packages insect resistant are discussed, as are factors that must be considered in the selection or development of insect-resistant packages for radiation disinfested foods. The latter factors include biological and physical environments, length of storage periods, stresses on packages during shipment, types of storage facilities, governmental regulations, health requirements, and others

Packaging Printing Today

Directory of Open Access Journals (Sweden)

Stanislav Bolanča

2015-12-01

Full Text Available Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. The possibilities of particular printing techniques for optimal production of the determined packaging were studied in the paper. The problem was viewed from the technological and economical aspect. The possible printing quality and the time necessary for the printing realization were taken as key parameters. An important segment of the production and the way of life is alocation value and it had also found its place in this paper. The events in the field of packaging printing in the whole world were analyzed. The trends of technique developments and the printing technology for packaging printing in near future were also discussed.

Packaged die heater

Science.gov (United States)

Spielberger, Richard; Ohme, Bruce Walker; Jensen, Ronald J.

2011-06-21

A heater for heating packaged die for burn-in and heat testing is described. The heater may be a ceramic-type heater with a metal filament. The heater may be incorporated into the integrated circuit package as an additional ceramic layer of the package, or may be an external heater placed in contact with the package to heat the die. Many different types of integrated circuit packages may be accommodated. The method provides increased energy efficiency for heating the die while reducing temperature stresses on testing equipment. The method allows the use of multiple heaters to heat die to different temperatures. Faulty die may be heated to weaken die attach material to facilitate removal of the die. The heater filament or a separate temperature thermistor located in the package may be used to accurately measure die temperature.

Wafer level hermetic packaging based on Cu-Sn isothermal solidification technology

International Nuclear Information System (INIS)

Cao Yuhan; Luo Le

2009-01-01

A novel wafer level bonding method based on Cu-Sn isothermal solidification technology is established. A multi-layer sealing ring and the bonding processing are designed, and the amount of solder and the bonding parameters are optimized based on both theoretical and experimental results. Verification shows that oxidation of the solder layer, voids and the scalloped-edge appearance of the Cu 6 Sn 5 phase are successfully avoided. An average shear strength of 19.5 MPa and an excellent leak rate of around 1.9 x 10 -9 atm cc/s are possible, meeting the demands of MIL-STD-883E. (semiconductor technology)

Safety Analysis Report for packaging (onsite) steel waste package

Energy Technology Data Exchange (ETDEWEB)

BOEHNKE, W.M.

2000-07-13

The steel waste package is used primarily for the shipment of remote-handled radioactive waste from the 324 Building to the 200 Area for interim storage. The steel waste package is authorized for shipment of transuranic isotopes. The maximum allowable radioactive material that is authorized is 500,000 Ci. This exceeds the highway route controlled quantity (3,000 A{sub 2}s) and is a type B packaging.

Packaging Printing Today

OpenAIRE

Stanislav Bolanča; Igor Majnarić; Kristijan Golubović

2015-01-01

Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. T...

Overview of NASA Langley's Piezoelectric Ceramic Packaging Technology and Applications

Science.gov (United States)

Bryant, Robert G.

2007-01-01

Over the past decade, NASA Langley Research Center (LaRC) has developed several actuator packaging concepts designed to enhance the performance of commercial electroactive ceramics. NASA LaRC focused on properly designed actuator and sensor packaging for the following reasons, increased durability, protect the working material from the environment, allow for proper mechanical and electrical contact, afford "ready to use" mechanisms that are scalable, and develop fabrication methodology applicable to any active material of the same physical class. It is more cost effective to enhance or tailor the performance of existing systems, through innovative packaging, than to develop, test and manufacture new materials. This approach led to the development of several solid state actuators that include THUNDER, the Macrofiber Composite or (MFC) and the Radial Field Diaphragm or (RFD). All these actuators are fabricated using standard materials and processes derived from earlier concepts. NASA s fabrication and packaging technology as yielded, piezoelectric actuators and sensors that are easy to implement, reliable, consistent in properties, and of lower cost to manufacture in quantity, than their predecessors (as evidenced by their continued commercial availability.) These piezoelectric actuators have helped foster new research and development in areas involving computational modeling, actuator specific refinements, and engineering system redesign which led to new applications for piezo-based devices that replace traditional systems currently in use.

Design of Control System for Flexible Packaging Bags Palletizing Production Line Based on PLC

Science.gov (United States)

Zheng, Huiping; Chen, Lin; Zhao, Xiaoming; Liu, Zhanyang

Flexible packaging bags palletizing production line is to put the bags in the required area according to particular order and size, in order to finish handling, storage, loading and unloading, transportation and other logistics work of goods. Flexible packaging bags palletizing line is composed of turning bags mechanism, shaping mechanism, indexing mechanism, marshalling mechanism, pushing bags mechanism, pressing bags mechanism, laminating mechanism, elevator, tray warehouse, tray conveyor and loaded tray conveyor. Whether the whole production line can smoothly run depends on each of the above equipment and precision control among them. In this paper the technological process and the control logic of flexible packaging bags palletizing production line is introduced. Palletizing process of the production line realized automation by means of a control system based on programmable logic controller (PLC). It has the advantages of simple structure, reliable and easy maintenance etc.

Application of in silico modelling to estimate toxicity of migrating substances from food packaging.

Science.gov (United States)

Price, Nicholas; Chaudhry, Qasim

2014-09-01

This study derived toxicity estimates for a set of 136 chemical migrants from food packaging materials using in silico (computational) modelling and read across approaches. Where available, the predicted results for mutagenicity and carcinogenicity were compared with published experimental data. As the packaging compounds are subject to safety assessment, the migrating substances were more likely to be negative for both the endpoints. A set of structural analogues with positive experimental data for carcinogenicity and/or mutagenicity was therefore used as a positive comparator. The results showed that a weight of evidence assembled from different in silico models and read-across from already-tested structurally similar compounds can provide a rapid and reliable means for rapid screening of new yet-untested intentional or unintentional chemical compounds that may migrate to packaged foodstuffs. Crown Copyright © 2014. Published by Elsevier Ltd. All rights reserved.

Thermal Management of Power Semiconductor Packages - Matching Cooling Technologies with Packaging Technologies (Presentation)

Energy Technology Data Exchange (ETDEWEB)

Bennion, K.; Moreno, G.

2010-04-27

Heat removal for power semiconductor devices is critical for robust operation. Because there are different packaging options, different thermal management technologies, and a range of applications, there is a need for a methodology to match cooling technologies and package configurations to target applications. To meet this need, a methodology was developed to compare the sensitivity of cooling technologies on the overall package thermal performance over a range of power semiconductor packaging configurations. The results provide insight into the trade-offs associated with cooling technologies and package configurations. The approach provides a method for comparing new developments in power semiconductor packages and identifying potential thermal control technologies for the package. The results can help users select the appropriate combination of packaging configuration and cooling technology for the desired application.

Flash Memory Reliability: Read, Program, and Erase Latency Versus Endurance Cycling

Science.gov (United States)

Heidecker, Jason

2010-01-01

This report documents the efforts and results of the fiscal year (FY) 2010 NASA Electronic Parts and Packaging Program (NEPP) task for nonvolatile memory (NVM) reliability. This year's focus was to measure latency (read, program, and erase) of NAND Flash memories and determine how these parameters drift with erase/program/read endurance cycling.

NRF TRIGA packaging

International Nuclear Information System (INIS)

Clements, M.D.

1995-11-01

Training Reactor Isotopes, General Atomics (TRIGA reg-sign) Reactors are in use at four US Department of Energy (DOE) complex facilities and at least 23 university, commercial, or government facilities. The development of the Neutron Radiography Facility (NRF) TRIGA packaging system began in October 1993. The Hanford Site NRF is being shut down and requires an operationally user-friendly transportation and storage packaging system for removal of the TRIGA fuel elements. The NRF TRIGA packaging system is designed to remotely remove the fuel from the reactor and transport the fuel to interim storage (up to 50 years) on the Hanford Site. The packaging system consists of a cask and an overpack. The overpack is used only for transport and is not necessary for storage. Based upon the cask's small size and light weight, small TRIGA reactors will find it versatile for numerous refueling and fuel storage needs. The NRF TRIGA packaging design also provides the basis for developing a certifiable and economical packaging system for other TRIGA reactor facilities. The small size of the NRF TRIGA cask also accommodates placing the cask into a larger certified packaging for offsite transport. The Westinghouse Hanford Company NRF TRIGA packaging, as described herein can serve other DOE sites for their onsite use, and the design can be adapted to serve university reactor facilities, handling a variety of fuel payloads

Packaging for Food Service

Science.gov (United States)

Stilwell, E. J.

1985-01-01

Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.

Waste Package Lifting Calculation

International Nuclear Information System (INIS)

H. Marr

2000-01-01

The objective of this calculation is to evaluate the structural response of the waste package during the horizontal and vertical lifting operations in order to support the waste package lifting feature design. The scope of this calculation includes the evaluation of the 21 PWR UCF (pressurized water reactor uncanistered fuel) waste package, naval waste package, 5 DHLW/DOE SNF (defense high-level waste/Department of Energy spent nuclear fuel)--short waste package, and 44 BWR (boiling water reactor) UCF waste package. Procedure AP-3.12Q, Revision 0, ICN 0, calculations, is used to develop and document this calculation

Certification of packagings: compliance with DOT specification 7A packaging requirements

International Nuclear Information System (INIS)

Edling, D.A.

1976-01-01

A study was conducted to determine which of the packagings currently listed in CFR 49 Section 173.395 a.1-5, meet the Specification 7A requirements (CFR 49 Section 173.350). According to DOT HM-111 the present listing of various authorized DOT specifications in Section 173.394 and Section 173.395 (Type A containers) of ICC Tariff No. 27 would be deleted with complete reliance being placed on the use of DOT 7A, Type A general packaging specification. Each user of a Specification 7A package would be required to document and maintain on file for one year a written record of his determination of compliance with the DOT Specification 7A performance requirements. All the specification packagings listed in CFR 49 Section 173.395a.1-5 were tested and shown to meet the Specification 7A criteria; however, in many cases qualifications were placed on their use. Forty-nine specification packagings were tested and shown to meet the DOT Specification 7A performance requirements and since there were several styles of some specific packagings, this amounts to greater than 80 packagings. The extensive testing generally indicated a high degree of containment integrity in the packagings tested and the documentation discussed is a valuable tool for shippers of Type A quantities of radioactive materials

“Who Began This Art? From Whence Did It Emerge?”: A Hermetic Frame Story on the Origins of Alchemy in Pseudo-Ibn Waḥshīya’s The Book of the Ziziphus Tree of the Furthest Boundary

Directory of Open Access Journals (Sweden)

Christopher Braun

2017-03-01

Full Text Available This paper explores the context of a Hermetic frame story in the pseudepigraphical alchemical treatise The Book of the Ziziphus Tree of the Furthest Boundary (Kitāb Sidrat almuntahā. The treatise is attributed to a prominent figure in the Arabic occult sciences, Abū Bakr b. Waḥshīya (fl. first half of the 4th/10th century. It was written in the form of a dialogue between the protagonist, Ibn Waḥshīya, and an alchemist from the Islamic West, al-Maghribī al-Qamarī. The last section of the introductory dialogue between these two characters consists of a frame story on the origins of alchemy and a legend of discovery (Fundlegende that introduces a cosmogony and an allegorical depiction of the process of transmutation. Both the frame story and the legend of discovery abound in Hermetic motifs and topoi known from other Greek and Arabic alchemical treatises. The exposition of the different prevailing theories on the beginnings of alchemy reflects, moreover, historical phenomena, such as the Graeco-Arabic translation movement and the shu‘ūbīya controversy. Consistent with the literary tradition of the Arabic Hermetica, Ancient Egypt emerges in this treatise as the cradle of alchemy; however, I suggest that more than merely literary convention, such evocations express a genuine fascination with Ancient Egypt and its surviving material culture. In this respect, the littleknown genre of Arabic books on hidden treasure might shed new light on common Hermetic narratives and their circulation in Arabic occult literature.

Automated Work Package: Initial Wireless Communication Platform Design, Development, and Evaluation

Energy Technology Data Exchange (ETDEWEB)

Al Rashdan, Ahmad Yahya Mohammad [Idaho National Laboratory; Agarwal, Vivek [Idaho National Laboratory

2016-03-01

The Department of Energy’s Light Water Reactor Sustainability Program is developing the scientific basis to ensure long-term reliability, productivity, safety, and security of the nuclear power industry in the United States. The Instrumentation, Information, and Control (II&C) pathway of the program aims to increase the role of advanced II&C technologies to achieve this objective. One of the pathway efforts at Idaho National Laboratory (INL) is to improve the work packages execution process by replacing the expensive, inefficient, bulky, complex, and error-prone paper-based work orders with automated work packages (AWPs). An AWP is an automated and dynamic presentation of the work package designed to guide the user through the work process. It is loaded on a mobile device, such as a tablet, and is capable of communicating with plant equipment and systems to acquire plant and procedure states. The AWP replaces those functions where a computer is more efficient and reliable than a human. To enable the automatic acquisition of plant data, it is necessary to design and develop a prototype platform for data exchange between the field instruments and the AWP mobile devices. The development of the platform aims to reveal issues and solutions generalizable to large-scale implementation of a similar system. Topics such as bandwidth, robustness, response time, interference, and security are usually associated with wireless communication. These concerns, along with other requirements, are listed in an earlier INL report. Specifically, the targeted issues and performance aspects in this work are relevant to the communication infrastructure from the perspective of promptness, robustness, expandability, and interoperability with different technologies.

Next-generation avionics packaging and cooling 'test results from a prototype system'

Science.gov (United States)

Seals, J. D.

The author reports on the design, material characteristics, and test results obtained under the US Air Force's advanced aircraft avionics packaging technologies (AAAPT) program, whose charter is to investigate new designs and technologies for reliable packaging, interconnection, and thermal management. Under this program, AT&T Bell Laboratories has completed the preliminary testing of and is evaluating a number of promising materials and technologies, including conformal encapsulation, liquid flow-through cooling, and a cyanate ester backplane. A fifty-two module system incorporating these and and other technologies has undergone preliminary cooling efficiency, shock, sine and random vibration, and maintenance testing. One of the primary objectives was to evaluate the interaction compatibility of new materials and designs with other components in the system.

Anhydrous Ammonia Training Module. Trainer's Package. Participant's Package.

Science.gov (United States)

Beaudin, Bart; And Others

This document contains a trainer's and a participant's package for teaching employees on site safe handling procedures for working with anhydrous ammonia, especially on farms. The trainer's package includes the following: a description of the module; a competency; objectives; suggested instructional aids; a training outline (or lesson plan) for…

Green Packaging Development. : A way to efficient, effective and more environmental friendly packaging solutions.

OpenAIRE

Mian Muhammad, Masoud

2011-01-01

Growing pressure on the packaging design to enhance the environmental and logistics performance of a packaging system stresses the packaging designers to search new design strategies that not only fulfill logistics requirements in the supply chain, but also reduce the CO 2emissions during the packaging life cycle. This thesis focuses on the packaging design process and suggests some improvements by considering its logistics performance and CO 2emissions. A Green packaging development model wa...

Practical application of HgI2 detectors to a space-flight scanning electron microscope

Science.gov (United States)

Bradley, J. G.; Conley, J. M.; Albee, A. L.; Iwanczyk, J. S.; Dabrowski, A. J.

1989-01-01

Mercuric iodide X-ray detectors have been undergoing tests in a prototype scanning electron microscope system being developed for unmanned space flight. The detector program addresses the issues of geometric configuration in the SEM, compact packaging that includes separate thermoelectric coolers for the detector and FET, X-ray transparent hermetic encapsulation and electrical contacts, and a clean vacuum environment.

[Electrochemical methods of control of iodine contents in drinks].

Science.gov (United States)

Zakharova, E A; Slepchenko, G B; Kolpakova, E Iu

2001-01-01

The simple and express methods of determination of iodide ions (0.01-0.20 mg/decimeter3) in iodine-enriched drinks by potentiometry and inversion voltamperometry were developed. The studies on influencing a storage time hermetically packaged carbonated beverages, a storage time of the depressurized drinks, stuff of ware on the contents of iodine in drinks are held.

Centralized disassembly and packaging of spent fuel in the DOE spent fuel management system

International Nuclear Information System (INIS)

Johnson, E.R.

1986-01-01

In October 1984, E.R. Johnson Associates, Inc. (JAI) initiated a study of the prospective use of a centralized facility for the disassembly and packaging of spent fuel to support the various elements of the US Dept. of Energy (DOE) spent fuel management system, including facilities for monitored retrievable storage (MRS) and repositories. It was DOE's original plan to receive spent fuel at each repository where it would be disassembled and packaged (overpacked) for disposal purposes. Subsequently, DOE considered the prospective use of MRS of spent fuel as an option for providing safe and reliable management of spent fuel. This study was designed to consider possible advantages of the use of centralized facilities for disassembly and packaging of spent fuel at whose location storage facilities could be added as required. The study was divided into three principal technical tasks that covered: (a) development of requirements and criteria for the central disassembly and packaging facility and associated systems. (2) Development of conceptual designs for the central disassembly and packaging facility and associated systems. (3) Estimation of capital and operating costs involved for all system facilities and determination of life cycle costs for various scenarios of operation - for comparison with the reference system

IN-PACKAGE CHEMISTRY ABSTRACTION

Energy Technology Data Exchange (ETDEWEB)

E. Thomas

2005-07-14

This report was developed in accordance with the requirements in ''Technical Work Plan for Postclosure Waste Form Modeling'' (BSC 2005 [DIRS 173246]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as a function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model, which uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model, which is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials, and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed (CDSP) waste packages containing high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor diffusing into the waste package, and (2) seepage water entering the waste package as a liquid from the drift. (1) Vapor-Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H{sub 2}O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Liquid-Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package.

IN-PACKAGE CHEMISTRY ABSTRACTION

International Nuclear Information System (INIS)

E. Thomas

2005-01-01

This report was developed in accordance with the requirements in ''Technical Work Plan for Postclosure Waste Form Modeling'' (BSC 2005 [DIRS 173246]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as a function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model, which uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model, which is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials, and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed (CDSP) waste packages containing high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor diffusing into the waste package, and (2) seepage water entering the waste package as a liquid from the drift. (1) Vapor-Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H 2 O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Liquid-Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package

Accuracy, reliability, and timing of visual evaluations of decay in fresh-cut lettuce

Science.gov (United States)

Visual assessments are used for evaluating the quality of food products, such as fresh-cut lettuce packaged in bags with modified atmosphere. We have compared the accuracy and the reliability of visual evaluations of decay on fresh-cut lettuce performed with experienced and inexperienced raters. In ...

Hazardous materials package performance regulations

International Nuclear Information System (INIS)

Russell, N.A.; Glass, R.E.; McClure, J.D.; Finley, N.C.

1992-01-01

The hazardous materials (hazmat) packaging development and certification process is currently defined by two different regulatory philosophies, one based on specification packagings and the other based on performance standards. With specification packagings, a packaging is constructed according to an agreed set of design specifications. In contrast, performance standards do not specify the packaging design; they specify performance standards that a packaging design must be able to pass before it can be certified for transport. The packaging can be designed according to individual needs as long as it meets these performance standards. Performance standards have been used nationally and internationally for about 40 years to certify radioactive materials (RAM) packagings. It is reasonable to state that for RAM transport, performance specifications have maintained transport safety. A committee of United Nation's experts recommended the performance standard philosophy as the preferred regulation method for hazmat packaging. Performance standards for hazmat packagings smaller than 118 gallons have been adopted in 49CFR178. Packagings for materials that are classified as toxic-by-inhalation must comply with the performance standards by October 1, 1993, and packagings for all other classes of hazardous materials covered must comply by October 1, 1996. For packages containing bulk (in excess of 188 gallons) quantities of materials that are extremely toxic by inhalation, there currently are no performance requirements. This paper discusses a Hazmat Packaging Performance Evaluation (HPPE) project to look at the subset of bulk packagings that are larger than 2000 gallons. The objectives of this project are the evaluate current hazmat specification packagings and develop supporting documentation for determining performance requirements for packagings in excess of 2000 gallons that transport hazardous materials that have been classified as extremely toxic by inhalation (METBI)

Lithium niobate packaging challenges

International Nuclear Information System (INIS)

Murphy, E.J.; Holmes, R.J.; Jander, R.B.; Schelling, A.W.

1988-01-01

The use of lithium niobate integrated optic devices outside of the research laboratory is predicated on the development of a sound packaging method. The authors present a discussion of the many issues that face the development of a viable, robust packaging technology. The authors emphasize the interaction of lithium niobate's physical properties with available packaging materials and technologies. The broad range of properties (i.e. electro-optic, piezo-electric, pyro-electric, photorefractive...) that make lithium niobate an interesting material in many device applications also make it a packaging challenge. The package design, materials and packaging technologies must isolate the device from the environment so that lithium niobate's properties do not adversely affect the device performance

User friendly packaging

DEFF Research Database (Denmark)

Geert Jensen, Birgitte

2010-01-01

Most consumers have experienced occasional problems with opening packaging. Tomato sauce from the tinned mackerel splattered all over the kitchen counter, the unrelenting pickle jar lid, and the package of sliced ham that cannot be opened without a knife or a pair of scissors. The research project...... “User-friendly Packaging” aims to create a platform for developing more user-friendly packaging. One intended outcome of the project is a guideline that industry can use in development efforts. The project also points the way for more extended collaboration between companies and design researchers. How...... can design research help industry in packaging innovation?...

Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects

DEFF Research Database (Denmark)

Brincker, Mads; Söhl, Stefan; Eisele, Ronald

2017-01-01

As power electronic devices have tendencies to operate at higher temperatures and current densities, the demand for reliable and efficient packaging technologies are ever increasing. This paper reports the studies on application of transient liquid phase (TLP) bonding of CuSnCu systems...

Reliability of IGBT-based power devices in the viewpoint of applications in future power supply systems

International Nuclear Information System (INIS)

Lutz, J.

2011-01-01

IGBT-based high-voltage power devices will be key components for future renewable energy base of the society. Windmills in the range up to 10 MW use converters with IGBTs. HVDC systems with IGBT-based voltage source converters have the advantage of a lower level of harmonics, less efforts for filters and more possibilities for control. The power devices need a lifetime expectation of several ten years. The lifetime is determined by the reliability of the packaging technology. IGBTs are offered packaged in presspacks and modules. The presentation will have the focus on IGBT high power modules. Accelerated power cycling tests for to determine the end-of-life at given conditions and their results are shown. models to calculate the lifetime, and actual work in research for systems with increased reliability.

Packaging Review Guide for Reviewing Safety Analysis Reports for Packagings

Energy Technology Data Exchange (ETDEWEB)

DiSabatino, A; Biswas, D; DeMicco, M; Fisher, L E; Hafner, R; Haslam, J; Mok, G; Patel, C; Russell, E

2007-04-12

This Packaging Review Guide (PRG) provides guidance for Department of Energy (DOE) review and approval of packagings to transport fissile and Type B quantities of radioactive material. It fulfills, in part, the requirements of DOE Order 460.1B for the Headquarters Certifying Official to establish standards and to provide guidance for the preparation of Safety Analysis Reports for Packagings (SARPs). This PRG is intended for use by the Headquarters Certifying Official and his or her review staff, DOE Secretarial offices, operations/field offices, and applicants for DOE packaging approval. This PRG is generally organized at the section level in a format similar to that recommended in Regulatory Guide 7.9 (RG 7.9). One notable exception is the addition of Section 9 (Quality Assurance), which is not included as a separate chapter in RG 7.9. Within each section, this PRG addresses the technical and regulatory bases for the review, the manner in which the review is accomplished, and findings that are generally applicable for a package that meets the approval standards. This Packaging Review Guide (PRG) provides guidance for DOE review and approval of packagings to transport fissile and Type B quantities of radioactive material. It fulfills, in part, the requirements of DOE O 460.1B for the Headquarters Certifying Official to establish standards and to provide guidance for the preparation of Safety Analysis Reports for Packagings (SARPs). This PRG is intended for use by the Headquarters Certifying Official and his review staff, DOE Secretarial offices, operations/field offices, and applicants for DOE packaging approval. The primary objectives of this PRG are to: (1) Summarize the regulatory requirements for package approval; (2) Describe the technical review procedures by which DOE determines that these requirements have been satisfied; (3) Establish and maintain the quality and uniformity of reviews; (4) Define the base from which to evaluate proposed changes in scope

DNA Packaging by λ-Like Bacteriophages: Mutations Broadening the Packaging Specificity of Terminase, the λ-Packaging Enzyme

OpenAIRE

Feiss, Michael; Reynolds, Erin; Schrock, Morgan; Sippy, Jean

2010-01-01

The DNA-packaging specificities of phages λ and 21 depend on the specific DNA interactions of the small terminase subunits, which have support helix-turn-recognition helix-wing DNA-binding motifs. λ-Terminase with the recognition helix of 21 preferentially packages 21 DNA. This chimeric terminase's ability to package λDNA is reduced ∼20-fold. Phage λ with the chimeric terminase is unable to form plaques, but pseudorevertants are readily obtained. Some pseudorevertants have trans-acting suppre...

The paradox of packaging optimization – a characterization of packaging source reduction in the Netherlands

NARCIS (Netherlands)

van Sluisveld, M.A.E.; Worrell, E.

2013-01-01

The European Council Directive 94/62/EC for Packaging and Packaging Waste requires that Member States implement packaging waste prevention measures. However, consumption and subsequently packaging waste figures are still growing annually. It suggests that policies to accomplish packaging waste

NASA Electronic Parts and Packaging (NEPP) Program - Update

Science.gov (United States)

LaBel, Kenneth A.; Sampson, Michael J.

2010-01-01

This slide presentation reviews the goals and mission of the NASA Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs. The program has been supporting NASA for over 20 years. The focus is on the reliability aspects of electronic devices. In this work the program also supports the electronics industry. There are several areas that the program is involved in: Memories, systems on a chip (SOCs), data conversion devices, power MOSFETS, power converters, scaled CMOS, capacitors, linear devices, fiber optics, and other electronics such as sensors, cryogenic and SiGe that are used in space systems. Each of these area are reviewed with the work that is being done in reliability and effects of radiation on these technologies.

Triple bag hermetic technology for controlling a bruchid (Spermophagus sp.) (Coleoptera, Chrysomelidae) in stored Hibiscus sabdariffa grain.

Science.gov (United States)

Amadou, L; Baoua, I B; Baributsa, D; Williams, S B; Murdock, L L

2016-10-01

We assessed the performance of hermetic triple layer Purdue Improved Crop Storage (PICS) bags for protecting Hibiscus sabdariffa grain against storage insects. The major storage pest in the grain was a bruchid, Spermophagus sp.. When we stored infested H. sabdariffa grain for six months in the woven polypropylene bags typically used by farmers, the Spermophagus population increased 33-fold over that initially present. The mean number of emergence holes per 100 seeds increased from 3.3 holes to 35.4 holes during this time period, while grain held for the same length of time in PICS bags experienced no increase in the numbers of holes. Grain weight loss in the woven control bags was 8.6% while no weight loss was observed in the PICS bags. Seed germination rates of grain held in woven bags for six months dropped significantly while germination of grain held in PICS bags did not change from the initial value. PICS bags can be used to safely store Hibiscus grain after harvest to protect against a major insect pest.

Prevention policies addressing packaging and packaging waste: Some emerging trends.

Science.gov (United States)

Tencati, Antonio; Pogutz, Stefano; Moda, Beatrice; Brambilla, Matteo; Cacia, Claudia

2016-10-01

Packaging waste is a major issue in several countries. Representing in industrialized countries around 30-35% of municipal solid waste yearly generated, this waste stream has steadily grown over the years even if, especially in Europe, specific recycling and recovery targets have been fixed. Therefore, an increasing attention starts to be devoted to prevention measures and interventions. Filling a gap in the current literature, this explorative paper is a first attempt to map the increasingly important phenomenon of prevention policies in the packaging sector. Through a theoretical sampling, 11 countries/states (7 in and 4 outside Europe) have been selected and analyzed by gathering and studying primary and secondary data. Results show evidence of three specific trends in packaging waste prevention policies: fostering the adoption of measures directed at improving packaging design and production through an extensive use of the life cycle assessment; raising the awareness of final consumers by increasing the accountability of firms; promoting collaborative efforts along the packaging supply chains. Copyright © 2016 Elsevier Ltd. All rights reserved.

Food packages for Space Shuttle

Science.gov (United States)

Fohey, M. F.; Sauer, R. L.; Westover, J. B.; Rockafeller, E. F.

1978-01-01

The paper reviews food packaging techniques used in space flight missions and describes the system developed for the Space Shuttle. Attention is directed to bite-size food cubes used in Gemini, Gemini rehydratable food packages, Apollo spoon-bowl rehydratable packages, thermostabilized flex pouch for Apollo, tear-top commercial food cans used in Skylab, polyethylene beverage containers, Skylab rehydratable food package, Space Shuttle food package configuration, duck-bill septum rehydration device, and a drinking/dispensing nozzle for Space Shuttle liquids. Constraints and testing of packaging is considered, a comparison of food package materials is presented, and typical Shuttle foods and beverages are listed.

Waste package transfer, emplacement and retrievability in the French deep geological repository

Energy Technology Data Exchange (ETDEWEB)

Roulet, Alain; Delort, Daniel; Herve, Jean Francois; Bosgiraud, Jean Michel; Guenin, Jean Jacques [Technical Department ANDRA (France)

2009-06-15

Safe, reliable and reversible handling of waste is a significant issue related to the design and safety assessment of deep geological repository in France. The first step taken was to study various waste handling solutions. ANDRA also decided to fabricate and demonstrate industrial scale handling equipment for HLW (since 2003) and for ILW-LL wastes (since 2008). We will review the main equipment developed for the transfer process in the repository, for both types of waste, and underline the benefits of developing industrial demonstrators within the framework of international cooperation agreements. Waste retrieval capability will be simultaneously examined. Two types of waste have to be handled underground in Andra's repository. The HLW disposal package for vitrified waste is a 2 ton carbon steel cylindrical canister with a diameter of 600 mm. The weight of ILW-LL concrete disposal packages range from a minimum of 6 tonnes to over 20 tonnes, and their volume from approximately 5 to 10 m3. The underground transfer to the disposal drift requires moving the disposal package within a shielded transfer cask placed on a trailer. Transfer cask design has evolved since 2005, due to optimisation studies and as a result of industrial feedback from SKB. For HLW handling equipment two design options have been studied. In the first solution (Andra's Dossier 2005), the waste package are emplaced, one at a time, in the disposal drift by a pushing robot. Successive steps in design and proto-typing have lead to improve the design of the equipment and to gain confidence. Recently a fully integrated process has been successfully demonstrated, at full scale, (in a 100 m long mock up drift) as part of the EC funded ESDRED Project. This demonstrator is now on display in Andra's Technology Centre at Saudron, near the Bure Underground Laboratory. The second disposal option which has been investigated is based on a concept of utilising an external apparatus to push a row of

In-Package Chemistry Abstraction

Energy Technology Data Exchange (ETDEWEB)

E. Thomas

2004-11-09

This report was developed in accordance with the requirements in ''Technical Work Plan for: Regulatory Integration Modeling and Analysis of the Waste Form and Waste Package'' (BSC 2004 [DIRS 171583]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model that uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model that is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed waste packages that contain both high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor that diffuses into the waste package, and (2) seepage water that enters the waste package from the drift as a liquid. (1) Vapor Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H2O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Water Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package. TSPA-LA uses the vapor influx case for the nominal scenario for simulations where the waste

In-Package Chemistry Abstraction

International Nuclear Information System (INIS)

E. Thomas

2004-01-01

This report was developed in accordance with the requirements in ''Technical Work Plan for: Regulatory Integration Modeling and Analysis of the Waste Form and Waste Package'' (BSC 2004 [DIRS 171583]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model that uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model that is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed waste packages that contain both high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor that diffuses into the waste package, and (2) seepage water that enters the waste package from the drift as a liquid. (1) Vapor Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H2O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Water Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package. TSPA-LA uses the vapor influx case for the nominal scenario for simulations where the waste package has been

Radioactive material packaging performance testing

International Nuclear Information System (INIS)

Romano, T.; Cruse, J.M.

1991-02-01

To provide uniform packaging of hazardous materials on an international level, the United Nations has developed packaging recommendations that have been implemented worldwide. The United Nations packaging recommendations are performance oriented, allowing for a wide variety of package materials and systems. As a result of this international standard, efforts in the United States are being directed toward use of performance-oriented packaging and elimination of specification (designed) packaging. This presentation will focus on trends, design evaluation, and performance testing of radioactive material packaging. The impacts of US Department of Transportation Dockets HM-181 and HM-169A on specification and low-specific activity radioactive material packaging requirements are briefly discussed. The US Department of Energy's program for evaluating radioactive material packings per US Department of Transportation Specification 7A Type A requirements, is used as the basis for discussing low-activity packaging performance test requirements. High-activity package testing requirements are presented with examples of testing performed at the Hanford Site that is operated by Westinghouse Hanford Company for the US Department of Energy. 5 refs., 2 tabs

Lead free solder mechanics and reliability

CERN Document Server

Pang, John Hock Lye

2012-01-01

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical prope...

Packaging a liquid metal ESD with micro-scale Mercury droplet.

Energy Technology Data Exchange (ETDEWEB)

Barnard, Casey Anderson

2011-08-01

A liquid metal ESD is being developed to provide electrical switching at different acceleration levels. The metal will act as both proof mass and electric contact. Mercury is chosen to comply with operation parameters. There are many challenges surrounding the deposition and containment of micro scale mercury droplets. Novel methods of micro liquid transfer are developed to deliver controllable amounts of mercury to the appropriate channels in volumes under 1 uL. Issues of hermetic sealing and avoidance of mercury contamination are also addressed.

Report on geotechnical tests with model structures Work Package - Deliverable number: WP 7.2 – D72.2

DEFF Research Database (Denmark)

Gintautas, Tomas; Sørensen, John Dalsgaard

2017-01-01

This report aims to give a comprehensive summary of the geotechnical tests with model structures that have been performed in work package 7.2 task 7.2.2 within the IRPWIND project. The large-scale tests are intended to determine soil-structure interaction effects in order to support probabilistic...... calculations of the reliability of offshore wind turbine support structures. These calculations are mainly performed in work package 7.4 of the IRPWIND project. However, this report already includes the development of a probabilistic model for the axial bearing capacity / resistance that is obtained using...

Components of Adenovirus Genome Packaging

Science.gov (United States)

Ahi, Yadvinder S.; Mittal, Suresh K.

2016-01-01

Adenoviruses (AdVs) are icosahedral viruses with double-stranded DNA (dsDNA) genomes. Genome packaging in AdV is thought to be similar to that seen in dsDNA containing icosahedral bacteriophages and herpesviruses. Specific recognition of the AdV genome is mediated by a packaging domain located close to the left end of the viral genome and is mediated by the viral packaging machinery. Our understanding of the role of various components of the viral packaging machinery in AdV genome packaging has greatly advanced in recent years. Characterization of empty capsids assembled in the absence of one or more components involved in packaging, identification of the unique vertex, and demonstration of the role of IVa2, the putative packaging ATPase, in genome packaging have provided compelling evidence that AdVs follow a sequential assembly pathway. This review provides a detailed discussion on the functions of the various viral and cellular factors involved in AdV genome packaging. We conclude by briefly discussing the roles of the empty capsids, assembly intermediates, scaffolding proteins, portal vertex and DNA encapsidating enzymes in AdV assembly and packaging. PMID:27721809

HEAT Sensor: Harsh Environment Adaptable Thermionic Sensor

Energy Technology Data Exchange (ETDEWEB)

Limb, Scott J. [Palo Alto Research Center, Palo Alto, CA (United States)

2016-05-31

This document is the final report for the “HARSH ENVIRONMENT ADAPTABLE THERMIONIC SENSOR” project under NETL’s Crosscutting contract DE-FE0013062. This report addresses sensors that can be made with thermionic thin films along with the required high temperature hermetic packaging process. These sensors can be placed in harsh high temperature environments and potentially be wireless and self-powered.

Mathematical and Simulation Modelling of Moisture Diffusion Mechanism during Plastic IC Packages Disassembly

Directory of Open Access Journals (Sweden)

Peng Mou

2013-01-01

Full Text Available Reuse of plastic IC packages disassembled from printed circuit boards (PCBs has significant environmental benefits and economic value. The interface delamination caused by moisture diffusion is the main failure mode of IC packages during the disassembling process, which greatly reduces the reusability and reliability of disassembled IC packages. Exploring moisture diffusion mechanism is a prerequisite to optimize prebaking processes before disassembling that is an effective way to avoid the interface delamination. To this end, a computational model with variable boundary conditions is developed based on the different combination state of water in IC packages. The distribution characteristics and mechanism of moisture diffusion behavior are analyzed including the humidity distribution field and the relation among baking temperature, water loss rate, and baking time during baking process, and then the results are validated by FEA simulation based on the improved definition of relative moisture concentration. Baking under variable temperature is proposed and compared with the baking process and baking efficiency under constant temperature to find out the optimized baking parameters. Finally, a set of curves which indicate the relation between baking energy consumption and temperature are determined under actual industrial baking experiments, which could be used as references to develop industrial standards for PCB disassembling process.

The IRSN experience feedback for the transport package design safety appraisals

International Nuclear Information System (INIS)

Sert, G.

2007-01-01

The activity of transportation of radioactive materials is in constant evolution; air transport of radio elements for medical use is growing rapidly as well as transport of instruments equipped with radioactive sources for inspections of buildings (controls of presence of lead in paintings) and in industry (non destructive examination of welding by gammagraphy, controls of density on building sites). Transports associated with the recycling of plutonium for the production of electricity by nuclear energy are now accomplished in routine. Globally, 900.000 packages are shipped each year in France; among them, approximately 100.000 packages belong to the category for which design approval is required. To maintain a high level of safety for this activity by limiting the probability of occurrence, the severity and consequences of the incidents and accidents, strict rules are implemented by users under the control of the Safety Authority According to the systematic approach of defence in depth, which is defined by the three principles of safety in design, of operational reliability and of effectiveness of emergency response, the robustness of the design of the package is of primary importance. It is based on regulatory requirements relating to the functions of safety (containment of radioactivity, protection against radiation and prevention of the risks of criticality) that must be ensured by the package in conditions of transport as well as in accident conditions. These rules and the way of applying them evolve with time. Indeed, on the one hand the regulation is reexamined periodically; on the other hand, the technical knowledge on the behaviour of the packages subject to the above mentioned conditions and the means of evaluation of this behaviour progress permanently

Genome packaging in viruses

OpenAIRE

Sun, Siyang; Rao, Venigalla B.; Rossmann, Michael G.

2010-01-01

Genome packaging is a fundamental process in a viral life cycle. Many viruses assemble preformed capsids into which the genomic material is subsequently packaged. These viruses use a packaging motor protein that is driven by the hydrolysis of ATP to condense the nucleic acids into a confined space. How these motor proteins package viral genomes had been poorly understood until recently, when a few X-ray crystal structures and cryo-electron microscopy structures became available. Here we discu...

Food packaging history and innovations.

Science.gov (United States)

Risch, Sara J

2009-09-23

Food packaging has evolved from simply a container to hold food to something today that can play an active role in food quality. Many packages are still simply containers, but they have properties that have been developed to protect the food. These include barriers to oxygen, moisture, and flavors. Active packaging, or that which plays an active role in food quality, includes some microwave packaging as well as packaging that has absorbers built in to remove oxygen from the atmosphere surrounding the product or to provide antimicrobials to the surface of the food. Packaging has allowed access to many foods year-round that otherwise could not be preserved. It is interesting to note that some packages have actually allowed the creation of new categories in the supermarket. Examples include microwave popcorn and fresh-cut produce, which owe their existence to the unique packaging that has been developed.

Trends in Food Packaging.

Science.gov (United States)

Ott, Dana B.

1988-01-01

This article discusses developments in food packaging, processing, and preservation techniques in terms of packaging materials, technologies, consumer benefits, and current and potential food product applications. Covers implications due to consumer life-style changes, cost-effectiveness of packaging materials, and the ecological impact of…

Reliability studies of high operating temperature MCT photoconductor detectors

Science.gov (United States)

Wang, Wei; Xu, Jintong; Zhang, Yan; Li, Xiangyang

2010-10-01

This paper concerns HgCdTe (MCT) infrared photoconductor detectors with high operating temperature. The near room temperature operation of detectors have advantages of light weight, less cost and convenient usage. Their performances are modest and they suffer from reliable problems. These detectors face with stability of the package, chip bonding area and passivation layers. It's important to evaluate and improve the reliability of such detectors. Defective detectors were studied with SEM(Scanning electron microscope) and microscopy. Statistically significant differences were observed between the influence of operating temperature and the influence of humidity. It was also found that humility has statistically significant influence upon the stability of the chip bonding and passivation layers, and the amount of humility isn't strongly correlated to the damage on the surface. Considering about the commonly found failures modes in detectors, special test structures were designed to improve the reliability of detectors. An accelerated life test was also implemented to estimate the lifetime of the high operating temperature MCT photoconductor detectors.

Development of high impedance measurement system for water leakage detection in implantable neuroprosthetic devices.

Science.gov (United States)

Yousif, Aziz; Kelly, Shawn K

2016-08-01

There has been a push for a greater number of channels in implantable neuroprosthetic devices; but, that number has largely been limited by current hermetic packaging technology. Microfabricated packaging is becoming reality, but a standard testing system is needed to prepare these devices for clinical trials. Impedance measurements of electrodes built into the packaging layers may give an early warning of device failure and predict device lifetime. Because the impedance magnitudes of such devices can be on the order of gigaohms, a versatile system was designed to accommodate ultra-high impedances and allow future integrated circuit implementation in current neural prosthetic technologies. Here we present the circuitry, control software, and preliminary testing results of our designed system.

The Innovative Approaches to Packaging – Comparison Analysis of Intelligent and Active Packaging Perceptions in Slovakia

Directory of Open Access Journals (Sweden)

Loucanova Erika

2017-06-01

Full Text Available Packaging has always served a practical function - to hold goods together and protect it when moving toward the customer through distribution channel. Today packaging is also a container for promoting the product and making it easier and safer to use. The sheer importance of packaging functions is still growing and consequently the interest of the company is to access to the packaging more innovative and creative. The paper deals with the innovative approaches to packaging resulting in the creation of packaging with interactive active features in the form of active and intelligent packaging. Using comparative analysis, we monitored the perception of the active packaging functions in comparison to intelligent packaging function among different age categories. We identified the age categories which are most interested in these functions.

Applications of Active Packaging in Breads

Directory of Open Access Journals (Sweden)

Ali Göncü

2017-10-01

Full Text Available Changes on consumer preferences lead to innovations and improvements in new packaging technologies. With these new developments passive packaging technologies aiming to protect food nowadays have left their place to active and intelligent packaging technologies that have other various functions beside protection of food. Active packaging is defined as an innovative packaging type and its usage increases the shelf life of food significantly. Applications of active packaging have begun to be used for packaging of breads. In this study active packaging applications in breads have been reviewed.

Food Packaging Materials

Science.gov (United States)

1978-01-01

The photos show a few of the food products packaged in Alure, a metallized plastic material developed and manufactured by St. Regis Paper Company's Flexible Packaging Division, Dallas, Texas. The material incorporates a metallized film originally developed for space applications. Among the suppliers of the film to St. Regis is King-Seeley Thermos Company, Winchester, Ma'ssachusetts. Initially used by NASA as a signal-bouncing reflective coating for the Echo 1 communications satellite, the film was developed by a company later absorbed by King-Seeley. The metallized film was also used as insulating material for components of a number of other spacecraft. St. Regis developed Alure to meet a multiple packaging material need: good eye appeal, product protection for long periods and the ability to be used successfully on a wide variety of food packaging equipment. When the cost of aluminum foil skyrocketed, packagers sought substitute metallized materials but experiments with a number of them uncovered problems; some were too expensive, some did not adequately protect the product, some were difficult for the machinery to handle. Alure offers a solution. St. Regis created Alure by sandwiching the metallized film between layers of plastics. The resulting laminated metallized material has the superior eye appeal of foil but is less expensive and more easily machined. Alure effectively blocks out light, moisture and oxygen and therefore gives the packaged food long shelf life. A major packaging firm conducted its own tests of the material and confirmed the advantages of machinability and shelf life, adding that it runs faster on machines than materials used in the past and it decreases product waste; the net effect is increased productivity.

Implementation of a spark plasma sintering facility in a hermetic glovebox for compaction of toxic, radiotoxic, and air sensitive materials

Energy Technology Data Exchange (ETDEWEB)

Tyrpekl, V., E-mail: vaclav.tyrpekl@ec.europa.eu, E-mail: vaclav.tyrpekl@gmail.com; Berkmann, C.; Holzhäuser, M.; Köpp, F.; Cologna, M.; Somers, J. [European Commission, Joint Research Centre (JRC), Institute for Transuranium Elements (ITU), Postfach 2340, 76125 Karlsruhe (Germany); Wangle, T. [European Commission, Joint Research Centre (JRC), Institute for Transuranium Elements (ITU), Postfach 2340, 76125 Karlsruhe (Germany); Faculty of Nuclear Sciences and Physical Engineering, Czech Technical University in Prague, Břehová 7, Praha 1, 115 19 (Czech Republic)

2015-02-15

Spark plasma sintering (SPS) is a rapidly developing method for densification of powders into compacts. It belongs to the so-called “field assisted sintering techniques” that enable rapid sintering at much lower temperatures than the classical approaches of pressureless sintering of green pellets or hot isostatic pressing. In this paper, we report the successful integration of a SPS device into a hermetic glovebox for the handling of highly radioactive material containing radioisotopes of U, Th, Pu, Np, and Am. The glovebox implantation has been facilitated by the replacement of the hydraulic system to apply pressure with a compact electromechanical unit. The facility has been successfully tested using UO{sub 2} powder. Pellets with 97% of the theoretical density were obtained at 1000 °C for 5 min, significantly lower than the ∼1600 °C for 5-10 h used in conventional pellet sintering.

Plasma physics plotting package

International Nuclear Information System (INIS)

Hyman, D.H.

1981-02-01

We describe a package of plotting routines that do up to six two- or three-dimensional plots on a frame with minimal loss of resolution. The package now runs on a PDP-10 with PLOT-10 TCS primitives and on a Control Data Corporation-7600 and a Cray-1 with TV80LIB primitives on the National Magnetic Fusion Energy Computer Center network. The package is portable to other graphics systems because only the primitive plot calls are used from the underlying system's graphics package

Active food packaging technologies.

Science.gov (United States)

Ozdemir, Murat; Floros, John D

2004-01-01

Active packaging technologies offer new opportunities for the food industry, in the preservation of foods. Important active packaging systems currently known to date, including oxygen scavengers, carbon dioxide emitters/absorbers, moisture absorbers, ethylene absorbers, ethanol emitters, flavor releasing/absorbing systems, time-temperature indicators, and antimicrobial containing films, are reviewed. The principle of operation of each active system is briefly explained. Recent technological advances in active packaging are discussed, and food related applications are presented. The effects of active packaging systems on food quality and safety are cited.

Naval Waste Package Design Report

International Nuclear Information System (INIS)

M.M. Lewis

2004-01-01

A design methodology for the waste packages and ancillary components, viz., the emplacement pallets and drip shields, has been developed to provide designs that satisfy the safety and operational requirements of the Yucca Mountain Project. This methodology is described in the ''Waste Package Design Methodology Report'' Mecham 2004 [DIRS 166168]. To demonstrate the practicability of this design methodology, four waste package design configurations have been selected to illustrate the application of the methodology. These four design configurations are the 21-pressurized water reactor (PWR) Absorber Plate waste package, the 44-boiling water reactor (BWR) waste package, the 5-defense high-level waste (DHLW)/United States (U.S.) Department of Energy (DOE) spent nuclear fuel (SNF) Co-disposal Short waste package, and the Naval Canistered SNF Long waste package. Also included in this demonstration is the emplacement pallet and continuous drip shield. The purpose of this report is to document how that design methodology has been applied to the waste package design configurations intended to accommodate naval canistered SNF. This demonstrates that the design methodology can be applied successfully to this waste package design configuration and support the License Application for construction of the repository

49 CFR 173.24 - General requirements for packagings and packages.

Science.gov (United States)

2010-10-01

... identifiable (without the use of instruments) release of hazardous materials to the environment; (2) The effectiveness of the package will not be substantially reduced; for example, impact resistance, strength... significant chemical or galvanic reaction between the materials and contents of the package. (3) Plastic...

IAEA's experience in compiling a generic component reliability data base

International Nuclear Information System (INIS)

Tomic, B.; Lederman, L.

1991-01-01

Reliability data are essential in probabilistic safety assessment, with component reliability parameters being particularly important. Component failure data which is plant specific would be most appropriate but this is rather limited. However, similar components are used in different designs. Generic data, that is all data that is not plant specific to the plant being analyzed but which relates to components more generally, is important. The International Atomic Energy Agency has compiled the Generic Component Reliability Data Base from data available in the open literature. It is part of the IAEA computer code package for fault/event tree analysis. The Data Base contains 1010 different records including most of the components used in probabilistic safety analyses of nuclear power plants. The data base input was quality controlled and data sources noted. The data compilation procedure and problems associated with using generic data are explained. (UK)

Packaging systems for animal origin food

Directory of Open Access Journals (Sweden)

2011-03-01

Full Text Available The main task of food packaging is to protect the product during storage and transport against the action of biological, chemical and mechanical factors. The paper presents packaging systems for food of animal origin. Vacuum and modified atmosphere packagings were characterised together with novel types of packagings, referred to as intelligent packaging and active packaging. The aim of this paper was to present all advantages and disadvantages of packaging used for meat products. Such list enables to choose the optimal type of packaging for given assortment of food and specific conditions of the transport and storing.

Merganser Download Package

Data.gov (United States)

U.S. Environmental Protection Agency — This data download package contains an Esri 10.0 MXD, file geodatabase and copy of this FGDC metadata record. The data in this package are used in support of the...

Modular assembly of chimeric phi29 packaging RNAs that support DNA packaging.

Science.gov (United States)

Fang, Yun; Shu, Dan; Xiao, Feng; Guo, Peixuan; Qin, Peter Z

2008-08-08

The bacteriophage phi29 DNA packaging motor is a protein/RNA complex that can produce strong force to condense the linear-double-stranded DNA genome into a pre-formed protein capsid. The RNA component, called the packaging RNA (pRNA), utilizes magnesium-dependent inter-molecular base-pairing interactions to form ring-shaped complexes. The pRNA is a class of non-coding RNA, interacting with phi29 motor proteins to enable DNA packaging. Here, we report a two-piece chimeric pRNA construct that is fully competent in interacting with partner pRNA to form ring-shaped complexes, in packaging DNA via the motor, and in assembling infectious phi29 virions in vitro. This is the first example of a fully functional pRNA assembled using two non-covalently interacting fragments. The results support the notion of modular pRNA architecture in the phi29 packaging motor.

German competent authority guidance in FE methods applications for package design assessment

Energy Technology Data Exchange (ETDEWEB)

Voelzke, H.; Wieser, G.; Zencker, U.; Qiao Linan; Ballheimer, V. [Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin (Germany)

2004-07-01

The development of new methods in analysing package designs by using the finite element method (FEM) is of increasing importance. Package designers are more and more applying the growing opportunities of numerical methods to perform safety assessments for their products which requires suited methods also for competent authorities like BAM to verify the applicants' results. This presentation gives an topical overview of the experiences and tendencies within the complex field of finite element design testing. There are at first some general and more formal aspects concerning the correct finite element program selection and documentation of modelling, material properties, boundaries and calculation results including their interpretation. To give a reliable basis to the applicants in Germany BAM has drawn up and published a Finite Element Guideline recently. Secondly, the paper discusses actual technical questions which are of a wide interest and range from mechanical reflections on cask drop and extreme impact scenarios to thermal reflections on decay heat removal and fire scenarios. Examples from BAM work on FE-development activities are shown to demonstrate the great opportunities as well as the difficulties of using finite element methods for package safety analysis and design testing.

German competent authority guidance in FE methods applications for package design assessment

International Nuclear Information System (INIS)

Voelzke, H.; Wieser, G.; Zencker, U.; Qiao Linan; Ballheimer, V.

2004-01-01

The development of new methods in analysing package designs by using the finite element method (FEM) is of increasing importance. Package designers are more and more applying the growing opportunities of numerical methods to perform safety assessments for their products which requires suited methods also for competent authorities like BAM to verify the applicants' results. This presentation gives an topical overview of the experiences and tendencies within the complex field of finite element design testing. There are at first some general and more formal aspects concerning the correct finite element program selection and documentation of modelling, material properties, boundaries and calculation results including their interpretation. To give a reliable basis to the applicants in Germany BAM has drawn up and published a Finite Element Guideline recently. Secondly, the paper discusses actual technical questions which are of a wide interest and range from mechanical reflections on cask drop and extreme impact scenarios to thermal reflections on decay heat removal and fire scenarios. Examples from BAM work on FE-development activities are shown to demonstrate the great opportunities as well as the difficulties of using finite element methods for package safety analysis and design testing

Novel high-density packaging of solid state diode pumped eye-safe laser for LIBS

Science.gov (United States)

Bares, Kim; Torgerson, Justin; McNeil, Laine; Maine, Patrick; Patterson, Steve

2018-02-01

Laser-Induced Breakdown Spectroscopy (LIBS) has proven to be a useful research tool for material analysis for decades. However, because of the amount of energy required in a few nanosecond pulse to generate a stable and reliable LIBS signal, the lasers are often large and inefficient, relegating their implementation to research facilities, factory floors, and assembly lines. Small portable LIBS systems are now possible without having to compromise on energy needs by leveraging off of advances in high-density packaging of electronics, opto-mechanics, and highly efficient laser resonator architecture. This paper explores the integration of these techniques to achieve a mJ class eye-safe LIBS laser source, while retaining a small, light-weight package suitable for handheld systems.

The art of packaging: An investigation into the role of color in packaging, marketing, and branding

Directory of Open Access Journals (Sweden)

Behzad Mohebbi

2014-12-01

Full Text Available The purpose of this study is to contribute to the existing research in the field of packaging and marketing and shed more light on the psychology of colors and their effect on packaging and marketing. Nowadays, packaging is proved to be one of the significant factors in the success of promoting product sale. However, there is a perceived gap with respect to the different aspects of packaging, in particular the graphics, design, and color of packaging. The current study provides a comprehensive overview of packaging. It elaborates on different aspects of packaging and summarizes the findings of the most recent research conducted to date probing into packaging from different perspectives. It also discusses the role of color, i.e., the psychology of colors, and graphics in packaging and product sale. It is argued that graphics and color play key roles in promoting product sale and designers and marketers should attach a great deal of importance to color in packaging. The implications for producers, marketers, practitioners, and researchers are discussed in detail and suggestions for future research are provided.

MINUIT package parallelization and applications using the RooFit package

International Nuclear Information System (INIS)

Lazzaro, Alfio; Moneta, Lorenzo

2010-01-01

The fitting procedures are based on numerical minimization of functions. The MINUIT package is the most common package used for such procedures in High Energy Physics community. The main algorithm in this package, MIGRAD, searches the minimum of a function using the gradient information. For each minimization iteration, MIGRAD requires the calculation of the derivative for each free parameter of the function to be minimized. Minimization is required for data analysis problems based on the maximum likelihood technique. The calculation of complex likelihood functions, with several free parameters, many independent variables and large data samples, can be very CPU-time consuming. Then, the minimization process requires the calculation of the likelihood functions several times for each minimization iteration. In this paper we will show how MIGRAD algorithm and the likelihood function calculation can be easily parallelized using Message Passing Interface techniques. We will present the speed-up improvements obtained in typical physics applications such as complex maximum likelihood fits using the RooFit package.

Waste package performance analysis

International Nuclear Information System (INIS)

Lester, D.H.; Stula, R.T.; Kirstein, B.E.

1982-01-01

A performance assessment model for multiple barrier packages containing unreprocessed spent fuel has been applied to several package designs. The resulting preliminary assessments were intended for use in making decisions about package development programs. A computer model called BARIER estimates the package life and subsequent rate of release of selected nuclides. The model accounts for temperature, pressure (and resulting stresses), bulk and localized corrosion, and nuclide retardation by the backfill after water intrusion into the waste form. The assessment model assumes a post-closure, flooded, geologic repository. Calculations indicated that, within the bounds of model assumptions, packages could last for several hundred years. Intact backfills of appropriate design may be capable of nuclide release delay times on the order of 10 7 yr for uranium, plutonium, and americium. 8 references, 6 figures, 9 tables

Comparative Packaging Study

Science.gov (United States)

Perchonok, Michele H.; Oziomek, Thomas V.

2009-01-01

Future long duration manned space flights beyond low earth orbit will require the food system to remain safe, acceptable and nutritious. Development of high barrier food packaging will enable this requirement by preventing the ingress and egress of gases and moisture. New high barrier food packaging materials have been identified through a trade study. Practical application of this packaging material within a shelf life test will allow for better determination of whether this material will allow the food system to meet given requirements after the package has undergone processing. The reason to conduct shelf life testing, using a variety of packaging materials, stems from the need to preserve food used for mission durations of several years. Chemical reactions that take place during longer durations may decrease food quality to a point where crew physical or psychological well-being is compromised. This can result in a reduction or loss of mission success. The rate of chemical reactions, including oxidative rancidity and staling, can be controlled by limiting the reactants, reducing the amount of energy available to drive the reaction, and minimizing the amount of water available. Water not only acts as a media for microbial growth, but also as a reactant and means by which two reactants may come into contact with each other. The objective of this study is to evaluate three packaging materials for potential use in long duration space exploration missions.

Reliability analysis of microcomputer boards and computer based systems important to safety of nuclear plants

International Nuclear Information System (INIS)

Shrikhande, S.V.; Patil, V.K.; Ganesh, G.; Biswas, B.; Patil, R.K.

2010-01-01

Computer Based Systems (CBS) are employed in Indian nuclear plants for protection, control and monitoring purpose. For forthcoming CBS, Reactor Control Division has designed and developed a new standardized family of microcomputer boards qualified to stringent requirements of nuclear industry. These boards form the basic building blocks of CBS. Reliability analysis of these boards is being carried out using analysis package based on MIL-STD-217Plus methodology. The estimated failure rate values of these standardized microcomputer boards will be useful for reliability assessment of these systems. The paper presents reliability analysis of microcomputer boards and case study of a CBS system built using these boards. (author)

Semiconductor measurement technology: reliability technology for cardiac pacemakers 2: a workshop report, 1976

International Nuclear Information System (INIS)

Schafft, H.A.

1977-01-01

Summaries are presented of 12 invited talks on the following topics: the procurement and assurance of high reliability electronic parts, leak rate and moisture measurements, pacemaker batteries, and pacemaker leads. The workshop, second in a series, was held in response to strong interest expressed by the pacemaker community to address technical questions relevant to the enhancement and assurance of cardiac pacemaker reliability. Discussed at the workshop were a process validation wafer concept for assuring process uniformity in device chips; screen tests for assuring reliable electronic parts; reliability prediction; reliability comparison of semiconductor technologies; mechanisms of short-circuiting dendritic growths; details of helium and radioisotope leak test methods; a study to correlate package leak rates, as measured with test gasses, and actual moisture infusion; battery life prediction; microcalorimetric measurements to nondestructively evaluate batteries for pacemakers; and an engineer's and a physician's view of the present status of pacemaker leads. References are included with most of the reports

Intelligent food packaging - research and development

Directory of Open Access Journals (Sweden)

Renata Dobrucka

2015-03-01

Full Text Available Packaging also fosters effective marketing of the food through distribution and sale channels. It is of the utmost importance to optimize the protection of the food, a great quality and appearance - better than typical packaged foods. In recent years, intelligent packaging became very popular. Intelligent packaging is becoming more and more widely used for food products. Application of this type of solution contributes to improvement of the quality consumer life undoubtedly. Intelligent packaging refers to a package that can sense environmental changes, and in turn, informs the users about the changes. These packaging systems contain devices that are capable of sensing and providing information about the functions and properties of the packaged foods. Also, this paper will review intelligent packaging technologies and describe different types of indicators (time-temperature indicators, freshness indicators.

Creative Thinking Package

Science.gov (United States)

Jones, Clive

1972-01-01

A look at the latest package from a British managment training organization, which explains and demonstrates creative thinking techniques, including brainstorming. The package, designed for groups of twelve or more, consists of tapes, visuals, and associated exercises. (Editor/JB)

Evaluation and improvement of sour property packages in UniSim design

Energy Technology Data Exchange (ETDEWEB)

Yang, J.; Zhao, E.; Wang, L.; Saha, S. [Honeywell, Calgary, AB (Canada)

2010-07-01

This presentation described specialty fluid packages for modeling oil and gas process systems involving sour gases in contact with aqueous phase. UniSim Design is a popular process simulation tool in the oil and gas industry. The sour Peng-Robinson (PR) and sour Soave-Redlich-Kwong (SRK) models are commonly used for handling sour system where hydrogen sulphide (H{sub 2}S), carbon dioxide (CO{sub 2}) or ammonia (NH{sub 3}) are in contact with an aqueous phase. These sour options combine the PR/SRK equation of state and Wilson's API-sour model where the equation of state is used to determine the fugacities of the vapor and liquid hydrocarbon phases, plus the enthalpy for all 3 phases. The Wilson's API-sour method is used for the aqueous phase calculations, which accounts for the ionization of H{sub 2}S, CO{sub 2} and NH{sub 3} in the aqueous phase. The efficiency of these 2 thermodynamic property packages were evaluated in this study by comparing industrial and experimental data and the results from other similar models. The purpose of this study was to improve these property packages for more accurate and reliable modeling of sour systems. tabs., figs.

Perspectives on the Elements of Packaging Design : A Qualitative Study on the Communication of Packaging

OpenAIRE

Alervall, Viktoria; Saied, Juan Sdiq

2013-01-01

Background: In today’s markets almost all products we buy come packaged. We use packaging to protect, contain and identify products. Furthermore if this is executed in a skillful way consumers often choose products based on packaging. The work of a designer and marketer is therefore extremely valuable when it comes to the design of a package. Problem: How are packages used to communicate marketing information? Purpose: The focus of this thesis is to identify differences and similarities of a ...

21 CFR 355.20 - Packaging conditions.

Science.gov (United States)

2010-04-01

... conditions. (a) Package size limitation. Due to the toxicity associated with fluoride active ingredients, the... (toothpastes and tooth powders) packages shall not contain more than 276 milligrams (mg) total fluorine per... packages shall not contain more than 120 mg total fluorine per package. (3) Exception. Package size...

19 CFR 191.13 - Packaging materials.

Science.gov (United States)

2010-04-01

... 19 Customs Duties 2 2010-04-01 2010-04-01 false Packaging materials. 191.13 Section 191.13 Customs... (CONTINUED) DRAWBACK General Provisions § 191.13 Packaging materials. (a) Imported packaging material... packaging material when used to package or repackage merchandise or articles exported or destroyed pursuant...

Warpage of QFN Package in Post Mold Cure Process of integrated circuit packaging

Science.gov (United States)

Sriwithoon, Nattha; Ugsornrat, Kessararat; Srisuwitthanon, Warayoot; Thonglor, Panakamon

2017-09-01

This research studied about warpage of QFN package in post mold cure process of integrated circuit (IC) packages using pre-plated (PPF) leadframe. For IC package, epoxy molding compound (EMC) are molded by cross linking of compound stiffness but incomplete crosslinked network and leading the fully cured thermoset by post mold cure (PMC) process. The cure temperature of PMC can change microstructure of EMC in term of stress inside the package and effect to warpage of the package due to coefficient of thermal expansion (CTE) between EMC and leadframe. In experiment, cure temperatures were varied to check the effect of internal stress due to different cure temperature after completed post mold cure for TDFN 2×3 8L. The cure temperature were varied with 180 °C, 170 °C, 160 °C, and 150°C with cure time 4 and 6 hours, respectively. For analysis, the TDFN 2×3 8L packages were analyzed the warpage by thickness gauge and scanning acoustic microscope (SAM) after take the test samples out from the oven cure. The results confirmed that effect of different CTE between EMC and leadframe due to different cure temperature resulting to warpage of the TDFN 2×3 8L packages.

CYPROS - Cybernetic Program Packages

Directory of Open Access Journals (Sweden)

Arne Tyssø

1980-10-01

Full Text Available CYPROS is an interactive program system consisting of a number of special purpose packages for simulation, identification, parameter estimation and control system design. The programming language is standard FORTRAN IV and the system is implemented on a medium size computer system (Nord-10. The system is interactive and program control is obtained by the use of numeric terminals. Output is rapidly examined by extensive use of video colour graphics. The subroutines included in the packages are designed and documented according to standardization rules given by the SCL (Scandinavian Control Library organization. This simplifies the exchange of subroutines throughout the SCL system. Also, this makes the packages attractive for implementation by industrial users. In the simulation package, different integration methods are available and it can be easily used for off-line, as well as real time, simulation problems. The identification package consists of programs for single-input/single-output and multivariablc problems. Both transfer function models and state space models can be handled. Optimal test signals can be designed. The control package consists of programs based on multivariable time domain and frequency domain methods for analysis and design. In addition, there is a package for matrix and time series manipulation. CYPROS has been applied successfully to industrial problems of various kinds, and parts of the system have already been implemented on different computers in industry. This paper will, in some detail, describe the use and the contents of the packages and some examples of application will be discussed.

LAr calorimeter for SCC with a common vacuum bulkhead---a concept to improve hermeticity

International Nuclear Information System (INIS)

Pope, W.L.; Watt, R.D.

1989-11-01

A new concept for a Barrel/Endcap LAr Calorimeter (LAC) is described in which the Barrel and Endcaps are in separate vacuum enclosures but share a common vacuum bulkhead (CVB). We explore 2 possible bulkhead construction types; welded plate sandwich panels, and brazed sandwich panels in which the core is an isotropic cellular solid--foamed aluminum. Gas lines and electric cables from he innermost Drift Chamber pass through radial holes in the core of the sandwich bulkhead. The CVB concept offers the potential to obtain a more hermetic calorimeter with significantly reduced dead material and/or space in the interface region common to conventional design LAr detectors for the SSC with Endcap features. To utilize a common additional steps to remove the Drift Chamber, a large increase in Endcap standby heat leak, and perhaps, new cryogenic safety issues. We find that significant amount of dead mass can be removed from critical regions of the vacuum shells when compared to a promising SSC LAC reference design. It is also shown that the increased standby heat leak of this concept can be easily removed by existing cooling capacity in another large LAr calorimeter. It is further shown that shut-downs need not be appreciably longer. Finally, it is argued that cryogen spill hazards can be avoided if the Endcap's LAr is removed during Drift chamber maintenance shutdowns, and that cryogenic safety is not compromised

A Natural Component-Based Oxygen Indicator with In-Pack Activation for Intelligent Food Packaging.

Science.gov (United States)

Won, Keehoon; Jang, Nan Young; Jeon, Junsu

2016-12-28

Intelligent food packaging can provide consumers with reliable and correct information on the quality and safety of packaged foods. One of the key constituents in intelligent packaging is a colorimetric oxygen indicator, which is widely used to detect oxygen gas involved in food spoilage by means of a color change. Traditional oxygen indicators consisting of redox dyes and strong reducing agents have two major problems: they must be manufactured and stored under anaerobic conditions because air depletes the reductant, and their components are synthetic and toxic. To address both of these serious problems, we have developed a natural component-based oxygen indicator characterized by in-pack activation. The conventional oxygen indicator composed of synthetic and artificial components was redesigned using naturally occurring compounds (laccase, guaiacol, and cysteine). These natural components were physically separated into two compartments by a fragile barrier. Only when the barrier was broken were all of the components mixed and the function as an oxygen indicator was begun (i.e., in-pack activation). Depending on the component concentrations, the natural component-based oxygen indicator exhibited different response times and color differences. The rate of the color change was proportional to the oxygen concentration. This novel colorimetric oxygen indicator will contribute greatly to intelligent packaging for healthier and safer foods.

The ZOOM minimization package

International Nuclear Information System (INIS)

Fischler, Mark S.; Sachs, D.

2004-01-01

A new object-oriented Minimization package is available for distribution in the same manner as CLHEP. This package, designed for use in HEP applications, has all the capabilities of Minuit, but is a re-write from scratch, adhering to modern C++ design principles. A primary goal of this package is extensibility in several directions, so that its capabilities can be kept fresh with as little maintenance effort as possible. This package is distinguished by the priority that was assigned to C++ design issues, and the focus on producing an extensible system that will resist becoming obsolete

Reduction of the suction losses through reed valves in hermetic reciprocating compressors using a magnet coil

Science.gov (United States)

Hopfgartner, J.; Posch, S.; Zuber, B.; Almbauer, R.; Krischan, K.; Stangl, S.

2017-08-01

Reed valves are widely used in hermetic reciprocating compressors and are responsible for a large part of the thermodynamic losses. Especially, the suction valve, which is opened nearly during the whole suction stroke, has a big potential for improvement. Usually, suction valves are opened only by vacuum created by the moving piston and should be closed before the compression stroke starts to avoid a reversed mass-flow through the valve. Therefore, the valves are prestressed, which results on the other hand in a higher flow resistance. In this work, a suction valve is investigated, which is not closed by the preload of the valve but by an electromagnetic coil located in the suction muffler neck. Shortly before the piston reaches its bottom dead centre, voltage is applied to the coil and a magnetic force is generated which pulls the valve shut. Thereby, the flow resistance through the valve can be reduced by changing the preload on the reed valve because it is no longer needed to close the valve. The investigation of this adapted valve and the electromagnetic coil is firstly done by numerical simulations including fluid structure interactions of the reed valves of a reciprocating compressor and secondly by experiments made on a calorimeter test bench.

Packaging and transport of radioisotopes

International Nuclear Information System (INIS)

Taylor, C.B.G.

1976-01-01

The importance of radioisotope traffic is emphasized. More than a million packages are being transported each year, mostly for medical uses. The involvement of public transport services and the incidental dose to the public (which is very small) are appreciably greater than for movements connected with the nuclear fuel cycle. Modern isotope packages are described, and an outline given of the problems of a large radioisotope manufacturer who has to package many different types of product. Difficulties caused by recent uncoordinated restrictions on the use of passenger aircraft are mentioned. Some specific problems relating to radioisotope packaging are discussed. These include the crush resistance of Type A packages, the closure of steel drums, the design of secure closures for large containers, the Type A packaging of liquids, leak tightness criteria of Type B packages, and the use of 'unit load' overpacks to consign a group of individually approved packages together as a single shipment. Reference is made to recent studies of the impact of radioisotope shipments on the environment. Cost/benefit analysis is important in this field - an important public debate is only just beginning. (author)

Safety Analysis Report - Packages, 9965, 9968, 9972-9975 Packages

International Nuclear Information System (INIS)

Van Alstine, M.N.

1999-01-01

This Safety Analysis Report for Packaging (SARP) documents the performance of the 9965 B, 9968 B, 9972 B(U), 9973 B(U), 9974 B(U), and 9975 B(U) packages in satisfying the regulatory safety requirements of the Code of Federal Regulations (CFR) 711 and the International Atomic Energy Agency (IAEA) Safety Series No. 6, Regulations for the Safe Transport of Radioactive Material, 1985 edition2. Results of the analysis and testing performed on the 9965 B, 9968 B, 9972 B(U), 9973 B(U), 9974 B(U), and 9975 B(U) packages are presented in this SARP, which was prepared in accordance with U.S. Department of energy (DOE) Order 5480.33 and in the format specified in the Nuclear Regulatory Commission (NRC) Regulatory Guides 7.94 and 7.10.5

Safety analysis report - packages 9965, 9968, 9972-9975 packages

International Nuclear Information System (INIS)

Van Alstine, M.N.

1997-10-01

This Safety Analysis Report for Packaging (SARP) documents the performance of the 9965 B( ), 9968 B( ), 9972 B(U), 9973 B(U), 9974 B(U), and 9975 B(U) packages in satisfying the regulatory safety requirements of the Code of Federal Regulations (CFR) 10 CFR 71 and the International Atomic Energy Agency (IAEA) Safety Series No. 6, Regulations for the Safe Transport of Radioactive Material, 1985 edition. Results of the analysis and testing performed on the 9965 B(), 9968 B(), 9972 B(U), 9973 B(U), and 9975 B(U) packages are presented in this SARP, which was prepared in accordance with U.S. Department of Energy (DOE) Order 5480.3 and in the format specified in the Nuclear Regulatory Commission (NRC) Regulatory Guides 7.9 and 7.10

Healthy package, healthy product? Effects of packaging design as a function of purchase setting

NARCIS (Netherlands)

van Rompay, Thomas Johannes Lucas; Deterink, Florien; Fenko, Anna

2016-01-01

Inspired by research testifying to the influence of visual packaging appearance and meaning portrayal on food evaluation, here it is argued that effects of packaging design vary depending on purchase context. Realistic packaging variants for a fictitious yoghurt brand varying in health connotation

Integrated Approach to Industrial Packaging Design

Science.gov (United States)

Vorobeva, O.

2017-11-01

The article reviews studies in the field of industrial packaging design. The major factors which influence technological, ergonomic, economic and ecological features of packaging are established. The main modern trends in packaging design are defined, the principles of marketing communications and their influence on consumers’ consciousness are indicated, and the function of packaging as a transmitter of brand values is specified. Peculiarities of packaging technology and printing techniques in modern printing industry are considered. The role of designers in the stage-by-stage development of the construction, form and graphic design concept of packaging is defined. The examples of authentic packaging are given and the mention of the tetrahedron packaging history is made. At the end of the article, conclusions on the key research aspects are made.

Directory of certificates of compliance for radioactive materials packages. Summary report of NRC approved packages

International Nuclear Information System (INIS)

1979-10-01

This directory contains a Summary Report of NRC Approved Packages for radioactive material packages effective September 14, 1979. Purpose of this directory is to make available a convenient source of information on packagings which have been approved by the US Nuclear Regulatory Commission. To assist in identifying packaging, an index by Model Number and corresponding Certificate of Compliance number is included at the back of each volume of the directory. The Summary Report includes a listing of all users of each package design prior to the publication date of the directory

Directory of certificates of compliance for radioactive materials packages. Summary report of NRC approved packages

Energy Technology Data Exchange (ETDEWEB)

None

1979-10-01

This directory contains a Summary Report of NRC Approved Packages for radioactive material packages effective September 14, 1979. Purpose of this directory is to make available a convenient source of information on packagings which have been approved by the US Nuclear Regulatory Commission. To assist in identifying packaging, an index by Model Number and corresponding Certificate of Compliance number is included at the back of each volume of the directory. The Summary Report includes a listing of all users of each package design prior to the publication date of the directory.

Directory of Certificates of Compliance for Radioactive Materials Packages: Report of NRC approved packages

International Nuclear Information System (INIS)

1988-12-01

This directory contains a Report of the US Nuclear Regulatory Commission's Approved Packages (Volume 1), all Certificates of Compliance (Volume 2), and a Report of NRC Approved Quality Assurance Programs (Volume 3) for Radioactive Material Packages effective October 1, 1988. The purpose of this directory is to make available a convenient source of information on packagings which have been approved by the US Nuclear Regulatory Commission. To assist in identifying packaging, an index by Model Number and corresponding Certificate of Compliance Number is included at the front of Volume 2 of the directory. A listing by packaging types is included in the back of Volume 2. An alphabetical listing by Company name is included in the back of Volume 3 for approved QA programs. The Reports include a listing of all users of each package design and approved QA programs prior to the publication date of the directory

Directory of certificates of compliance for radioactive materials packages, Report of NRC approved packages

International Nuclear Information System (INIS)

1990-10-01

This directory contains a Report of the US Nuclear Regulatory Commission's Approved Packages (Volume 1), Certificates of Compliance (Volume 2), and a Report of NRC Approved Quality Assurance Programs (Volume 3) for Radioactive Materials Packages effective October 1, 1990. The purpose of this directory is to make available a convenient source of information on packagings which have been approved by the US Nuclear Regulatory Commission. To assist in identifying packaging, an index by Model Number and corresponding Certificate of Compliance Number is included at the front of Volume 2 of the directory. A listing by packaging types is included in the back of Volume 2. An alphabetical listing by Company name is included in the back of Volume 3 for approved QA programs. The Reports include a listing of all users of each package design and approved QA programs prior to the publication date of the directory

Safety analysis report for packages: packaging of fissile and other radioactive materials. Final report

International Nuclear Information System (INIS)

Chalfant, G.G.

1984-01-01

The 9965, 9966, 9967, and 9968 packages are designed for surface shipment of fissile and other radioactive materials where a high degree of containment (either single or double) is required. Provisions are made to add shielding material to the packaging as required. The package was physically tested to demonstrate that it meets the criteria specified in USDOE Order No. 5480.1, chapter III, dated 5/1/81, which invokes Title 10, Code of Federal Regulations, Part 71 (10 CFR 71), Packing and Transportation of Radioactive Material, and Title 49, Code of Federal Regulations, Part 100-179, Transportation. By restricting the maximum normal operating pressure of the packages to less than 7 kg/cm 2 (gauge) (99 to 54 psig), the packages will comply with Type B(U) regulations of the International Atomic Energy Agency (IAEA) in its Regulations for the Safe Transport of Radioactive Materials, Safety Series No. 6, 1973 Revised Edition, and may be used for export and import shipments. These packages have been assessed for transport of up to 14.5 kilograms of uranium, excluding uranium-233, or 4.4 kilograms of plutonium metal, oxides, or scrap having a maximum radioactive decay energy of 30 watts. Specific maximum package contents are given. This quantity and the configuration of uranium or plutonium metal cannot be made critical by any combination of hydrogeneous reflection and moderation regardless of the condition of the package. For a uranium-233 shipment, a separate criticality evaluation for the specific package is required

Ensuring socially responsible packaging design

DEFF Research Database (Denmark)

Geert Jensen, Birgitte

Most consumers have experienced occasional problems with opening packaging. Tomato sauce from the tinned mackerel splattered all over the kitchen counter, the unrelenting pickle jar lid, and the package of sliced ham that cannot be opened without a knife or a pair of scissors. The research project...... "User‐friendly Packaging" aims to create a platform for developing more user‐friendly packaging. One intended outcome of the project is a guideline that industry can use in development efforts. The project also points the way for more extended collaboration between companies and design researchers. How...... can design research help industry in packaging innovation?...

Packaging based on polymeric materials

Directory of Open Access Journals (Sweden)

Jovanović Slobodan M.

2005-01-01

Full Text Available In the past two years the consumption of common in the developed countries world wide (high tonnage polymers for packaging has approached a value of 50 wt.%. In the same period more than 50% of the packaging units on the world market were made of polymeric materials despite the fact that polymeric materials present 17 wt.% of all packaging materials. The basic properties of polymeric materials and their environmental and economical advantages, providing them such a position among packaging materials, are presented in this article. Recycling methods, as well as the development trends of polymeric packaging materials are also presented.

Investigations into High Temperature Components and Packaging

Energy Technology Data Exchange (ETDEWEB)

Marlino, L.D.; Seiber, L.E.; Scudiere, M.B.; M.S. Chinthavali, M.S.; McCluskey, F.P.

2007-12-31

The purpose of this report is to document the work that was performed at the Oak Ridge National Laboratory (ORNL) in support of the development of high temperature power electronics and components with monies remaining from the Semikron High Temperature Inverter Project managed by the National Energy Technology Laboratory (NETL). High temperature electronic components are needed to allow inverters to operate in more extreme operating conditions as required in advanced traction drive applications. The trend to try to eliminate secondary cooling loops and utilize the internal combustion (IC) cooling system, which operates with approximately 105 C water/ethylene glycol coolant at the output of the radiator, is necessary to further reduce vehicle costs and weight. The activity documented in this report includes development and testing of high temperature components, activities in support of high temperature testing, an assessment of several component packaging methods, and how elevated operating temperatures would impact their reliability. This report is organized with testing of new high temperature capacitors in Section 2 and testing of new 150 C junction temperature trench insulated gate bipolar transistor (IGBTs) in Section 3. Section 4 addresses some operational OPAL-GT information, which was necessary for developing module level tests. Section 5 summarizes calibration of equipment needed for the high temperature testing. Section 6 details some additional work that was funded on silicon carbide (SiC) device testing for high temperature use, and Section 7 is the complete text of a report funded from this effort summarizing packaging methods and their reliability issues for use in high temperature power electronics. Components were tested to evaluate the performance characteristics of the component at different operating temperatures. The temperature of the component is determined by the ambient temperature (i.e., temperature surrounding the device) plus the

Advanced flip chip packaging

CERN Document Server

Lai, Yi-Shao; Wong, CP

2013-01-01

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

Test setup for long term reliability investigation of Silicon Carbide MOSFETs

DEFF Research Database (Denmark)

Baker, Nick; Munk-Nielsen, Stig; Beczkowski, Szymon

2013-01-01

Silicon Carbide MOSFETs are now widely available and have frequently been demonstrated to offer numerous advantages over Silicon based devices. However, reliability issues remain a significant concern in their realisation in commercial power electronic systems. In this paper, a test bench...... is designed that enables an accelerated power cycling test to be performed on packaged Silicon Carbide MOSFETs (TO-247) under realistic operating conditions. An accelerated power cycling test is then performed, with on-state resistance selected as the observed parameter to detect degradation. On......-state resistance is routinely monitored online through the use of an innovative voltage measurement system. The packaged Silicon Carbide MOSFET is shown to exhibit a 25% increase in on-state resistance as the device ages throughout its lifetime, with the test still on-going....

Robust design and thermal fatigue life prediction of anisotropic conductive film flip chip package

International Nuclear Information System (INIS)

Nam, Hyun Wook

2004-01-01

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF(Anisotropic Conductive Film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue life of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear bi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design Of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2 nd DOE was conducted to obtain RSM equation for the choose 3 design parameter. The coefficient of determination (R 2 ) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for Feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430μm, and 78μm, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter

CH Packaging Program Guidance

International Nuclear Information System (INIS)

2006-01-01

The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' They further state: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant| (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations(CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations

CH Packaging Program Guidance

International Nuclear Information System (INIS)

2007-01-01

The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' They further state: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations

User friendly packaging

DEFF Research Database (Denmark)

Geert Jensen, Birgitte

2010-01-01

Most consumers have experienced occasional problems with opening packaging. Tomato sauce from the tinned mackerel splattered all over the kitchen counter, the unrelenting pickle jar lid, and the package of sliced ham that cannot be opened without a knife or a pair of scissors. The research project...

Operating Experiences with a Small-scale CHP Pilot Plant based on a 35 kWel Hermetic Four Cylinder Stirling Engine for Biomass Fuels

DEFF Research Database (Denmark)

Biedermann, F.; Carlsen, Henrik; Schoech, M.

2003-01-01

Within the scope of the RD&D project presented a small-scale CHP plant with a hermetic four cylinder Stirling engine for biomass fuels was developed and optimised in cooperation with the Technical University of Denmark, MAWERA Holzfeuerungsanlagen GesmbH, an Austrian biomass furnace and boiler...... exchanger of the Stirling engine, of the air preheater and of the entire combustion system. Furthermore, the optimisation of the pneumatic cleaning system to reduce ash deposition in the hot heat exchanger is of great relevance....... manufacturer, and BIOS BIOENERGIESYSTEME GmbH, an Austrian development and engineering company. Based on the technology developed, a pilot plant was designed and erected in Austria. The nominal electric power output of the plant is 35 kWel and the nominal thermal output amounts to approx. 220 kWth. The plant...

Metallic-packaging fiber Bragg grating sensor based on ultrasonic welding for strain-insensitive temperature measurement

Science.gov (United States)

Zhu, Lianqing; Yang, Runtao; Zhang, Yumin; Dong, Mingli; Lou, Xiaoping

2018-04-01

In this paper, a metallic-packaging fiber Bragg grating temperature sensor characterized by a strain insensitive design is demonstrated. The sensor is fabricated by the one-step ultrasonic welding technique using type-II fiber Bragg grating combined with an aluminum alloy substrate. Finite element analysis is used to perform theoretical evaluation. The result of the experiment illustrates that the metallic-packaging temperature sensor is insensitive to longitudinal strain. The sensor's temperature sensitivity is 36 pm/°C over the range of 50-110 °C, with the correlation coefficient (R2) being 0.999. The sensor's temporal response is 40 s at a sudden temperature change from 21 °C to 100 °C. The proposed sensor can be applied on reliable and precise temperature measurement.

A New Method of Reliability Evaluation Based on Wavelet Information Entropy for Equipment Condition Identification

International Nuclear Information System (INIS)

He, Z J; Zhang, X L; Chen, X F

2012-01-01

Aiming at reliability evaluation of condition identification of mechanical equipment, it is necessary to analyze condition monitoring information. A new method of reliability evaluation based on wavelet information entropy extracted from vibration signals of mechanical equipment is proposed. The method is quite different from traditional reliability evaluation models that are dependent on probability statistics analysis of large number sample data. The vibration signals of mechanical equipment were analyzed by means of second generation wavelet package (SGWP). We take relative energy in each frequency band of decomposed signal that equals a percentage of the whole signal energy as probability. Normalized information entropy (IE) is obtained based on the relative energy to describe uncertainty of a system instead of probability. The reliability degree is transformed by the normalized wavelet information entropy. A successful application has been achieved to evaluate the assembled quality reliability for a kind of dismountable disk-drum aero-engine. The reliability degree indicates the assembled quality satisfactorily.

Packaging of control system software

International Nuclear Information System (INIS)

Zagar, K.; Kobal, M.; Saje, N.; Zagar, A.; Sabjan, R.; Di Maio, F.; Stepanov, D.

2012-01-01

Control system software consists of several parts - the core of the control system, drivers for integration of devices, configuration for user interfaces, alarm system, etc. Once the software is developed and configured, it must be installed to computers where it runs. Usually, it is installed on an operating system whose services it needs, and also in some cases dynamically links with the libraries it provides. Operating system can be quite complex itself - for example, a typical Linux distribution consists of several thousand packages. To manage this complexity, we have decided to rely on Red Hat Package Management system (RPM) to package control system software, and also ensure it is properly installed (i.e., that dependencies are also installed, and that scripts are run after installation if any additional actions need to be performed). As dozens of RPM packages need to be prepared, we are reducing the amount of effort and improving consistency between packages through a Maven-based infrastructure that assists in packaging (e.g., automated generation of RPM SPEC files, including automated identification of dependencies). So far, we have used it to package EPICS, Control System Studio (CSS) and several device drivers. We perform extensive testing on Red Hat Enterprise Linux 5.5, but we have also verified that packaging works on CentOS and Scientific Linux. In this article, we describe in greater detail the systematic system of packaging we are using, and its particular application for the ITER CODAC Core System. (authors)

Portable Radiation Package (PRP) Instrument Handbook

Energy Technology Data Exchange (ETDEWEB)

Reynolds, R Michael [Remote Measurements and Research Company, Seattle, WA (United States)

2017-08-03

The Portable Radiation Package (PRP) was developed to provide basic radiation information in locations such as ships at sea where proper exposure is remote and difficult, the platform is in motion, and azimuth alignment is not fixed. Development of the PRP began at Brookhaven National Laboratory (BNL) in the mid-1990s and versions of it were deployed on ships in the U.S. Department of Energy (DOE) Atmospheric Radiation Measurement (ARM) Climate Research Facility’s Nauru-99 project. The PRP was deployed on ships in support of the National Aeronautics and Space Administration (NASA) Sensor Intercomparison for Marine Biological and Interdisciplinary Ocean Studies (SIMBIOS) program. Over the years the measurements have remained the same while the post-processing data analysis, especially for the FRSR, has evolved. This document describes the next-generation Portable Radiation Package (PRP2) that was developed for the DOE ARM Facility, under contract no. 9F-31462 from Argonne National Laboratory (ANL). The PRP2 has the same scientific principles that were well validated in prior studies, but has upgraded electronic hardware. The PRP2 approach is completely modular, both in hardware and software. Each sensor input is treated as a separate serial stream into the data collection computer. In this way the operator has complete access to each component of the system for purposes of error checking, calibration, and maintenance. The resulting system is more reliable, easier to install in complex situations, and more amenable to upgrade.

Electronic manufacturing and packaging in Japan

Science.gov (United States)

Kelly, Michael J.; Boulton, William R. (Editor); Kukowski, John A.; Meieran, Eugene S.; Pecht, Michael; Peeples, John W.; Tummala, Rao R.

1995-01-01

This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies. Japan has established this marked competitive advantage in electronics as a consequence of developing low-cost, high-volume consumer products. Japan's infrastructure, and the remarkable cohesiveness of vision and purpose in government and industry, are key factors in the success of Japan's electronics industry. Although Japan will continue to dominate consumer electronics in the foreseeable future, opportunities exist for the United States and other industrial countries to capture an increasingly large part of the market. The JTEC panel has identified no insurmountable barriers that would prevent the United States from regaining a significant share of the consumer electronics market; in fact, there is ample evidence that the United States needs to aggressively pursue high-volume, low-cost electronic assembly, because it is a critical path leading to high-performance electronic systems.

Sensory impacts of food-packaging interactions.

Science.gov (United States)

Duncan, Susan E; Webster, Janet B

2009-01-01

Sensory changes in food products result from intentional or unintentional interactions with packaging materials and from failure of materials to protect product integrity or quality. Resolving sensory issues related to plastic food packaging involves knowledge provided by sensory scientists, materials scientists, packaging manufacturers, food processors, and consumers. Effective communication among scientists and engineers from different disciplines and industries can help scientists understand package-product interactions. Very limited published literature describes sensory perceptions associated with food-package interactions. This article discusses sensory impacts, with emphasis on oxidation reactions, associated with the interaction of food and materials, including taints, scalping, changes in food quality as a function of packaging, and examples of material innovations for smart packaging that can improve sensory quality of foods and beverages. Sensory evaluation is an important tool for improved package selection and development of new materials.

Plutonium stabilization and packaging system

International Nuclear Information System (INIS)

1996-01-01

This document describes the functional design of the Plutonium Stabilization and Packaging System (Pu SPS). The objective of this system is to stabilize and package plutonium metals and oxides of greater than 50% wt, as well as other selected isotopes, in accordance with the requirements of the DOE standard for safe storage of these materials for 50 years. This system will support completion of stabilization and packaging campaigns of the inventory at a number of affected sites before the year 2002. The package will be standard for all sites and will provide a minimum of two uncontaminated, organics free confinement barriers for the packaged material

RH Packaging Operations Manual

International Nuclear Information System (INIS)

Washington TRU Solutions LLC

2003-01-01

This procedure provides operating instructions for the RH-TRU 72-B Road Cask, Waste Shipping Package. In this document, ''Packaging'' refers to the assembly of components necessary to ensure compliance with the packaging requirements (not loaded with a payload). ''Package'' refers to a Type B packaging that, with its radioactive contents, is designed to retain the integrity of its containment and shielding when subject to the normal conditions of transport and hypothetical accident test conditions set forth in 10 CFR Part 71. Loading of the RH 72-B cask can be done two ways, on the RH cask trailer in the vertical position or by removing the cask from the trailer and loading it in a facility designed for remote-handling (RH). Before loading the 72-B cask, loading procedures and changes to the loading procedures for the 72-B cask must be sent to CBFO at sitedocuments at wipp.ws for approval

MARS software package status

International Nuclear Information System (INIS)

Azhgirej, I.L.; Talanov, V.V.

2000-01-01

The MARS software package is intended for simulating the nuclear-electromagnetic cascades and the secondary neutrons and muons transport in the heterogeneous medium of arbitrary complexity in the magnetic fields presence. The inclusive approach to describing the particle production in the nuclear and electromagnetic interactions and by the unstable particles decay is realized in the package. The MARS software package was actively applied for solving various radiation physical problems [ru

CH Packaging Program Guidance

International Nuclear Information System (INIS)

Washington TRU Solutions LLC

2003-01-01

The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: ''each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.'' They further state: ''each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SARP charges the WIPP management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with 10 CFR 71.11. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. This document provides the instructions to be followed to operate, maintain, and test the TRUPACT-II and HalfPACT packaging. The intent of these instructions is to standardize operations. All users will follow these instructions or equivalent instructions that assure operations are safe and meet the requirements of the SARPs

CH Packaging Program Guidance

International Nuclear Information System (INIS)

Washington TRU Solutions LLC

2002-01-01

The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT Shipping Package, and directly related components. This document complies with the minimum requirements as specified in TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event there is a conflict between this document and the SARP or C of C, the SARP and/or C of C shall govern. C of Cs state: ''each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.'' They further state: ''each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SAR P charges the WIPP Management and Operation (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with 10 CFR 71.11. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. This document details the instructions to be followed to operate, maintain, and test the TRUPACT-II and HalfPACT packaging. The intent of these instructions is to standardize these operations. All users will follow these instructions or equivalent instructions that assure operations are safe and meet the requirements of the SARPs

Consumer response to packaging design

NARCIS (Netherlands)

Steenis, Nigel D.; Herpen, van Erica; Lans, van der Ivo A.; Ligthart, Tom N.; Trijp, van Hans C.M.

2017-01-01

Building on theories of cue utilization, this paper investigates whether and how packaging sustainability influences consumer perceptions, inferences and attitudes towards packaged products. A framework is tested in an empirical study among 249 students using soup products varying in packaging

Natural biopolimers in organic food packaging

Science.gov (United States)

Wieczynska, Justyna; Cavoski, Ivana; Chami, Ziad Al; Mondelli, Donato; Di Donato, Paola; Di Terlizzi, Biagio

2014-05-01

Concerns on environmental and waste problems caused by use of non-biodegradable and non-renewable based plastic packaging have caused an increase interest in developing biodegradable packaging using renewable natural biopolymers. Recently, different types of biopolymers like starch, cellulose, chitosan, casein, whey protein, collagen, egg white, soybean protein, corn zein, gelatin and wheat gluten have attracted considerable attention as potential food packaging materials. Recyclable or biodegradable packaging material in organic processing standards is preferable where possible but specific principles of packaging are not precisely defined and standards have to be assessed. There is evidence that consumers of organic products have specific expectations not only with respect to quality characteristics of processed food but also in social and environmental aspects of food production. Growing consumer sophistication is leading to a proliferation in food eco-label like carbon footprint. Biopolymers based packaging for organic products can help to create a green industry. Moreover, biopolymers can be appropriate materials for the development of an active surfaces designed to deliver incorporated natural antimicrobials into environment surrounding packaged food. Active packaging is an innovative mode of packaging in which the product and the environment interact to prolong shelf life or enhance safety or sensory properties, while maintaining the quality of the product. The work will discuss the various techniques that have been used for development of an active antimicrobial biodegradable packaging materials focusing on a recent findings in research studies. With the current focus on exploring a new generation of biopolymer-based food packaging materials with possible applications in organic food packaging. Keywords: organic food, active packaging, biopolymers , green technology

Physical and chemical characteristics of cashew nut flour stored and packaged with different packages

Directory of Open Access Journals (Sweden)

Bruna Carolina GADANI

Full Text Available Abstract The aim of this study was to evaluate the physical and chemical changes in cashew nut flour under different packaging and storage conditions. The flour samples were characterized according to their chemical composition, packaged in polystyrene trays associated with covering chloride polyvinyl (PVC, plastic pot of polyethylene terephthalate (PET, plastic packaging polyethylene (POL and without coating polystyrene trays (CON. All packages were stored for 225 days, evaluating every 45 days the moisture content of the flour as well as extracting their oil by the cold method for characterization on the following indexes: acidity, saponification, iodine, peroxide and refraction. There was slight and gradual increase in the moisture content from the 45th to the 225th day, especially for products packaged in PVC and without coating polystyrene trays (CON. The oil saponification indexes showed gradual decrease during storage, especially in flour without packaging (CON. There was a gradual increase in the iodine index until the 135th day, followed by decay. The acidity and peroxide indexes increased along with the storage time. However packages with lower oxygen and moisture permeability, such as PET and POL, minimized such changes, being therefore the most suitable for long-term storage.

CH Packaging Program Guidance

International Nuclear Information System (INIS)

2008-01-01

The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the pplication.' They further state: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations

CH Packaging Program Guidance

International Nuclear Information System (INIS)

2009-01-01

The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' They further state: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations

RH Packaging Program Guidance

International Nuclear Information System (INIS)

2008-01-01

The purpose of this program guidance document is to provide the technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package (also known as the 'RH-TRU 72-B cask') and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the C of C shall govern. The C of C states: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' It further states: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M and O) Contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8, 'Deliberate Misconduct.' Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the U.S. Department of Energy (DOE) Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, 'Packaging and Transportation of Radioactive Material,' certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21, 'Reporting of Defects and Noncompliance,' regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous

RH Packaging Program Guidance

International Nuclear Information System (INIS)

2006-01-01

The purpose of this program guidance document is to provide the technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the C of C shall govern. The C of C states: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' It further states: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M and O) Contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with 10 Code of Federal Regulations (CFR) 1.8, 'Deliberate Misconduct.' Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the U.S. Department of Energy (DOE) Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, 'Packaging and Transportation of Radioactive Material,' certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21, 'Reporting of Defects and Noncompliance,' regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these

Safety analysis report: packages. LP-12 tritium package (packaging of fissile and other radioactive materials). Final report

International Nuclear Information System (INIS)

Gates, A.A.; McCarthy, P.G.; Edl, J.W.

1975-05-01

Elemental tritium is shipped at low pressure in a stainless steel container (LP-12) within an aluminum vessel and surrounded by 3.9 in.-thick Celotex insulation in a steel drum. Information is presented on the packaging design, evaluation of the structural, thermal, containment, shielding, and criticality characteristics of the package, procedures for loading, unloading, transporting, and testing the LP-12, and quality assurance requirements. (U.S.)

The results of pre-design studies on the development of a new design of gas turbine compressor package of GPA-C-16 type

Science.gov (United States)

Smirnov, A. V.; Chobenko, V. M.; Shcherbakov, O. M.; Ushakov, S. M.; Parafiynyk, V. P.; Sereda, R. M.

2017-08-01

The article summarizes the results of analysis of data concerning the operation of turbocompressor packages at compressor stations for the natural gas transmission system of Ukraine. The basic requirements for gas turbine compressor packages used for modernization and reconstruction of compressor stations are considered. Using a 16 MW gas turbine package GPA-C-16S/76-1,44M1 as an example, the results of pre-design studies and some technical solutions that improve the energy efficiency of gas turbine compressor packages and their reliability, as well as its environmental performance are given. In particular, the article deals with the matching of performance characteristics of a centrifugal compressor (hereinafter compressor) and gas turbine drive to reduce fuel gas consumption; as well as application of energy efficient technologies, in particular, exhaust gas heat recovery units and gas-oil heat exchangers in turbocompressor packages oil system; as well as reducing emissions of carbon monoxide into the atmosphere using a catalytic exhaust system. Described technical solutions can be used for development of other types of gas turbine compressor packages.

40 CFR 157.27 - Unit packaging.

Science.gov (United States)

2010-07-01

... 40 Protection of Environment 23 2010-07-01 2010-07-01 false Unit packaging. 157.27 Section 157.27 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) PESTICIDE PROGRAMS PACKAGING REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.27 Unit packaging. Pesticide products...

CH Packaging Program Guidance

International Nuclear Information System (INIS)

2005-01-01

The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: ''each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.'' They further state: ''each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SARP charges the Waste Isolation Pilot Plant (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.

System safety and reliability using object-oriented programming techniques

International Nuclear Information System (INIS)

Patterson-Hine, F.A.; Koen, B.V.

1987-01-01

Direct evaluation fault tree codes have been written in recursive, list-processing computer languages such as PL/1 (PATREC-I) and LISP (PATREC-L). The pattern-matching strategy implemented in these codes has been used extensively in France to evaluate system reliability. Recent reviews of the risk management process suggest that a data base containing plant-specific information be integrated with a package of codes used for probabilistic risk assessment (PRA) to alleviate some of the difficulties that make a PRA so costly and time-intensive. A new programming paradigm, object-oriented programming, is uniquely suited for the development of such a software system. A knowledge base and fault tree evaluation algorithm, based on previous experience with PATREC-L, have been implemented using object-oriented techniques, resulting in a reliability assessment environment that is easy to develop, modify, and extend

Diamond-based heat spreaders for power electronic packaging applications

Science.gov (United States)

Guillemet, Thomas

As any semiconductor-based devices, power electronic packages are driven by the constant increase of operating speed (higher frequency), integration level (higher power), and decrease in feature size (higher packing density). Although research and innovation efforts have kept these trends continuous for now more than fifty years, the electronic packaging technology is currently facing a challenge that must be addressed in order to move toward any further improvements in terms of performances or miniaturization: thermal management. Thermal issues in high-power packages strongly affect their reliability and lifetime and have now become one of the major limiting factors of power modules development. Thus, there is a strong need for materials that can sustain higher heat flux levels while safely integrating into the electronic package architecture. In such context, diamond is an attractive candidate because of its outstanding thermal conductivity, low thermal expansion, and high electrical resistivity. Its low heat capacity relative to metals such as aluminum or copper makes it however preferable for heat spreading applications (as a heat-spreader) rather than for dissipating the heat flux itself (as a heat sink). In this study, a dual diamond-based heat-spreading solution is proposed. Polycrystalline diamond films were grown through laser-assisted combustion synthesis on electronic substrates (in the U.S) while, in parallel, diamond-reinforced copper-matrix composite films were fabricated through tape casting and hot pressing (in France). These two types of diamond-based heat-spreading films were characterized and their microstructure and chemical composition were related to their thermal performances. Particular emphasize was put on the influence of interfaces on the thermal properties of the materials, either inside a single material (grain boundaries) or between dissimilar materials (film/substrate interface, matrix/reinforcement interface). Finally, the packaging

GammaCHI: a package for the inversion and computation of the gamma and chi-square cumulative distribution functions (central and noncentral)

NARCIS (Netherlands)

A. Gil (Amparo); J. Segura (Javier); N.M. Temme (Nico)

2015-01-01

textabstractA Fortran 90 module GammaCHI for computing and inverting the gamma and chi-square cumulative distribution functions (central and noncentral) is presented. The main novelty of this package is the reliable and accurate inversion routines for the noncentral cumulative distribution

40 CFR 262.30 - Packaging.

Science.gov (United States)

2010-07-01

... 40 Protection of Environment 25 2010-07-01 2010-07-01 false Packaging. 262.30 Section 262.30... APPLICABLE TO GENERATORS OF HAZARDOUS WASTE Pre-Transport Requirements § 262.30 Packaging. Before... the waste in accordance with the applicable Department of Transportation regulations on packaging...

Conformal Thin Film Packaging for SiC Sensor Circuits in Harsh Environments

Science.gov (United States)

Scardelletti, Maximilian C.; Karnick, David A.; Ponchak, George E.; Zorman, Christian A.

2011-01-01

In this investigation sputtered silicon carbide annealed at 300 C for one hour is used as a conformal thin film package. A RF magnetron sputterer was used to deposit 500 nm silicon carbide films on gold metal structures on alumina wafers. To determine the reliability and resistance to immersion in harsh environments, samples were submerged in gold etchant for 24 hours, in BOE for 24 hours, and in an O2 plasma etch for one hour. The adhesion strength of the thin film was measured by a pull test before and after the chemical immersion, which indicated that the film has an adhesion strength better than 10(exp 8) N/m2; this is similar to the adhesion of the gold layer to the alumina wafer. MIM capacitors are used to determine the dielectric constant, which is dependent on the SiC anneal temperature. Finally, to demonstrate that the SiC, conformal, thin film may be used to package RF circuits and sensors, an LC resonator circuit was fabricated and tested with and without the conformal SiC thin film packaging. The results indicate that the SiC coating adds no appreciable degradation to the circuits RF performance. Index Terms Sputter, silicon carbide, MIM capacitors, LC resonators, gold etchants, BOE, O2 plasma

Project monitoring package (PMP) : A package for project activity monitoring

International Nuclear Information System (INIS)

Vyas, K.N.; Kannan, A.; Susandhi, R.; Basu, S.

1987-01-01

A package for preparing PERT/CPM network diagrams has been written for PDP-11/34. The program uses PLOT-10 library calls for device interfacing. The package is essentially non-interactive in nature, and reads input data in the form of activity description and duration. It calculates the critical path time and performs time scaling of the events. The report gives a brief outline of the logic used, a sample plot and tabular output for reference. An additional facility for performing project activity monitoring has also been implemented. Activity monitoring generally requires various reports such as feed back reports from various group co-ordinators, information report for project co-ordinator and brief periodical reports for management. A package 'DATATRIEVE' (DTR) on PDP-11/34 system is utilized for generating the above mentioned reports. As DTR can also use normal sequential files, an interfacing program has been written which reformats the files accepted by PERT program acceptable to DTR. Various types of reports as generated by DTR are included. However this part of the package is not transportable and can be implemented only on systems having DTR. 6 figures. (author)

Perfume Packaging, Seduction and Gender

Directory of Open Access Journals (Sweden)

Magdalena Petersson McIntyre

2013-06-01

Full Text Available This article examines gender and cultural sense-making in relation to perfumes and their packaging. Gendered meanings of seduction, choice, consumption and taste are brought to the fore with the use of go-along interviews with consumers in per-fume stores. Meeting luxury packages in this feminized environment made the interviewed women speak of bottles as objects to fall in love with and they de-scribed packages as the active part in an act of seduction where they were expect-ing packages to persuade them into consumption. The interviewed men on the other hand portrayed themselves as active choice-makers and stressed that they were always in control and not seduced by packaging. However, while their ways of explaining their relationship with packaging on the surface seems to confirm cultural generalizations in relation to gender and seduction, the article argues that letting oneself be seduced is no less active than seducing. Based on a combination of actor network theories and theories of gender performativity the article points to the agency of packaging for constructions of gender and understands the inter-viewees as equally animated by the flows of passion which guide their actions.

Naval Waste Package Design Sensitivity

International Nuclear Information System (INIS)

T. Schmitt

2006-01-01

The purpose of this calculation is to determine the sensitivity of the structural response of the Naval waste packages to varying inner cavity dimensions when subjected to a comer drop and tip-over from elevated surface. This calculation will also determine the sensitivity of the structural response of the Naval waste packages to the upper bound of the naval canister masses. The scope of this document is limited to reporting the calculation results in terms of through-wall stress intensities in the outer corrosion barrier. This calculation is intended for use in support of the preliminary design activities for the license application design of the Naval waste package. It examines the effects of small changes between the naval canister and the inner vessel, and in these dimensions, the Naval Long waste package and Naval Short waste package are similar. Therefore, only the Naval Long waste package is used in this calculation and is based on the proposed potential designs presented by the drawings and sketches in References 2.1.10 to 2.1.17 and 2.1.20. All conclusions are valid for both the Naval Long and Naval Short waste packages

Radioactive material packaging performance testing

International Nuclear Information System (INIS)

Romano, T.

1992-06-01

In an effort to provide uniform packaging of hazardous material on an international level, recommendations for the transport of dangerous goods have been developed by the United Nations. These recommendations are performance oriented and contrast with a large number of packaging specifications in the US Department of Transportation's hazard materials regulations. This dual system presents problems when international shipments enter the US Department of Transportation's system. Faced with the question of continuing a dual system or aligning with the international system, the Research and Special Programs Administration of the US Department of Transportation responded with Docket HM-181. This began the transition toward the international transportation system. Following close behind is Docket HM-169A, which addressed low specific activity radioactive material packaging. This paper will discuss the differences between performance-oriented and specification packaging, the transition toward performance-oriented packaging by the US Department of Transportation, and performance-oriented testing of radioactive material packaging by Westinghouse Hanford Company. Dockets HM-181 and HM-169A will be discussed along with Type A (low activity) and Type B (high activity) radioactive material packaging evaluations

RASPLAV package

International Nuclear Information System (INIS)

1990-01-01

The RASPLAV package for investigation of post-accident mass transport and heat transfer processes is presented. The package performs three dimensional thermal conduction calculations in space nonuniform and temperature dependent conductivities and variable heat sources, taking into account phase transformations. The processes of free-moving bulk material, mixing of melting fuel due to advection and dissolution, and also evaporation/adsorption are modelled. Two-dimensional hydrodynamics with self-consistent heat transfer are also performed. The paper briefly traces the ways the solution procedures are carried out in the program package and outlines the major results of the simulation of reactor vessel melting after a core meltdown. The theoretical analysis and the calculations in this case were carried out in order to define the possibility of localization of the zone reminders. The interactions between the reminders and the concrete are simulated and evaluation of the interaction parameters is carried out. 4 refs. (R.Ts)

7 CFR 58.640 - Packaging.

Science.gov (United States)

2010-01-01

... 7 Agriculture 3 2010-01-01 2010-01-01 false Packaging. 58.640 Section 58.640 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards... Procedures § 58.640 Packaging. The packaging of the semifrozen product shall be done by means which will in...

Users Guide on Scaled CMOS Reliability: NASA Electronic Parts and Packaging (NEPP) Program Office of Safety and Mission Assurance

Science.gov (United States)

White, Mark; Cooper, Mark; Johnston, Allan

2011-01-01

Reliability of advanced CMOS technology is a complex problem that is usually addressed from the standpoint of specific failure mechanisms rather than overall reliability of a finished microcircuit. A detailed treatment of CMOS reliability in scaled devices can be found in Ref. 1; it should be consulted for a more thorough discussion. The present document provides a more concise treatment of the scaled CMOS reliability problem, emphasizing differences in the recommended approach for these advanced devices compared to that of less aggressively scaled devices. It includes specific recommendations that can be used by flight projects that use advanced CMOS. The primary emphasis is on conventional memories, microprocessors, and related devices.

Emergency response packaging: A conceptual outline

International Nuclear Information System (INIS)

Luna, R.E.; McClure, J.D.; Bennett, P.C.; Wheeler, T.A.

1992-01-01

The Packaging and Transportation Needs in the 1990's (PATN) component of the Transportation Assessment and Integration (TRAIN) program (DOE Nov. 1991) was designed to survey United States Department of Energy programs, both ongoing and planned, to identify needs for packaging and transportation services over the next decade. PATN also identified transportation elements that should be developed by the DOE Office of Environmental Restoration and Waste Management (DOE EM) Transportation Management Program (TMP). As a result of the predominant involvement of the TMP in radioactive material shipment issues and DOE EM's involvement with waste management issues, the primary focus of PATN was on waste packaging issues. Pending DOE regulations will formalize federal guidelines and regulations for transportation of hazardous and radioactive materials within the boundaries of DOE reservations and facilities and reflect a growing awareness of concern regarding safety environmental responsibility activities on DOE reservations. Future practices involving the transportation of radioactive material within DOE reservations will closely parallel those used for commercial and governmental transportation across the United States. This has added to the perceived need for emergency recovery packaging and emergency response features on primary packaging, for both on-site shipments and shipments between DOE facilities (off-site). Historically, emergency response and recovery functions of packaging have not been adequately considered in packaging design and construction concepts. This paper develops the rationale for emergency response packaging, including both overpack concepts for repackaging compromised packaging and primary packaging redesign to facilitate the recovery of packages via mobile remote handling equipment. The rationale will examine concepts for determination of likely use patterns to identify types of shipments where recovery packaging may have the most favorable payoff

Sustainable packaging. Packaging for a circular economy; Duurzaam verpakken. Verpakken voor de circulaire economie

Energy Technology Data Exchange (ETDEWEB)

Haffmans, S. [Partners for Innovation, Amsterdam (Netherlands); Standhardt, G. [Nederlands Verpaskkingscentrum NVC, Gouda (Netherlands); Hamer, A. [Agentschap NL, Utrecht (Netherlands)

2013-10-15

What is Sustainable Packaging? And what is the most sustainable packaging for a product? The publication is intended for anyone who wants to take into account the environment in the design of a product and packaging. It offers concrete suggestions and inspiring examples to bring sustainable packaging into practice [Dutch] Wat is Duurzaam Verpakken? En wat is de duurzaamste verpakking voor mijn product? De publicatie is bestemd voor iedereen die rekening wil houden met het milieu bij het ontwerp van een product-verpakkingscombinatie. Ze biedt concrete aanknopingspunten en inspirerende voorbeelden om hier praktisch mee aan de slag te gaan.

Effects of voids on thermal-mechanical reliability of lead-free solder joints

Directory of Open Access Journals (Sweden)

Benabou Lahouari

2014-06-01

Full Text Available Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

The role of multiple barriers in assuring waste package reliability

International Nuclear Information System (INIS)

Bradford, R.M.

1993-08-01

Yucca Mountain in southwestern Nevada is being studied as a potential repository site for the permanent storage of high-level nuclear waste. Regulators have set performance standards that the potential repository must meet in order to obtain regulatory approval. Nuclear Regulatory Commission (NRC) regulations state that containment of radioactivity must be ''substantially complete'' for the first 1000 years after closure of the facility. Thereafter, the acceptable annual limit on releases is 1/100,000 of each radionuclide remaining in the inventory after 1000 years. To demonstrate that the potential facility is in compliance with the regulations, it is necessary to obtain some understanding of the probability distribution of the cumulative quantity of releases by certain time points. This paper will discuss the probability distribution of waste container lifetimes and how the understanding of this distribution will play a role in finding the distribution of the release quantities over time. It will be shown that, for reasonable assumptions about the process of barrier failure, the reliability of a multiple-barrier container can be achieved and demonstrated much more readily than a container consisting of a single barrier. The discussion will focus primarily on the requirement of substantially complete containment for the first 1000 years

Alternative ceramic circuit constructions for low cost, high reliability applications

International Nuclear Information System (INIS)

Modes, Ch.; O'Neil, M.

1997-01-01

The growth in the use of hybrid circuit technology has recently been challenged by recent advances in low cost laminate technology, as well as the continued integration of functions into IC's. Size reduction of hybrid 'packages' has turned out to be a means to extend the useful life of this technology. The suppliers of thick film materials technology have responded to this challenge by developing a number of technology options to reduce circuit size, increase density, and reduce overall cost, while maintaining or increasing reliability. This paper provides an overview of the processes that have been developed, and, in many cases are used widely to produce low cost, reliable microcircuits. Comparisons of each of these circuit fabrication processes are made with a discussion of advantages and disadvantages of each technology. (author)

AN ADA NAMELIST PACKAGE

Science.gov (United States)

Klumpp, A. R.

1994-01-01

The Ada Namelist Package, developed for the Ada programming language, enables a calling program to read and write FORTRAN-style namelist files. A namelist file consists of any number of assignment statements in any order. Features of the Ada Namelist Package are: the handling of any combination of user-defined types; the ability to read vectors, matrices, and slices of vectors and matrices; the handling of mismatches between variables in the namelist file and those in the programmed list of namelist variables; and the ability to avoid searching the entire input file for each variable. The principle user benefits of this software are the following: the ability to write namelist-readable files, the ability to detect most file errors in the initialization phase, a package organization that reduces the number of instantiated units to a few packages rather than to many subprograms, a reduced number of restrictions, and an increased execution speed. The Ada Namelist reads data from an input file into variables declared within a user program. It then writes data from the user program to an output file, printer, or display. The input file contains a sequence of assignment statements in arbitrary order. The output is in namelist-readable form. There is a one-to-one correspondence between namelist I/O statements executed in the user program and variables read or written. Nevertheless, in the input file, mismatches are allowed between assignment statements in the file and the namelist read procedure statements in the user program. The Ada Namelist Package itself is non-generic. However, it has a group of nested generic packages following the nongeneric opening portion. The opening portion declares a variety of useraccessible constants, variables and subprograms. The subprograms are procedures for initializing namelists for reading, reading and writing strings. The subprograms are also functions for analyzing the content of the current dataset and diagnosing errors. Two nested

Reliability and results, but little room to manoeuvre

International Nuclear Information System (INIS)

Atkinson, Ian

1994-01-01

A wide variety of research programs to produce cost-effective and reliable inspection techniques have arisen following the discovery of stress corrosion cracks in the control rod drive mechanism of pressurized water reactors, notably in France, Belgium and Spain. This article describes the research program results from a cooperative partnership between Comex Nucleaire, Westinghouse Electric and AEA Technology. The package developed offers techniques to provide complete capability in virtually all the design configurations used world-wide. After extensive acceptance trials in France and the United States the techniques are now being used on site at Bugey 3. (UK)

21 CFR 820.130 - Device packaging.

Science.gov (United States)

2010-04-01

... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Device packaging. 820.130 Section 820.130 Food and... QUALITY SYSTEM REGULATION Labeling and Packaging Control § 820.130 Device packaging. Each manufacturer shall ensure that device packaging and shipping containers are designed and constructed to protect the...

76 FR 30551 - Specifications for Packagings

Science.gov (United States)

2011-05-26

... design qualification test and each periodic retest on a packaging, a test report must be prepared. The... where the design qualification tests are conducted, for as long as the packaging is produced and for at... report; (5) Manufacturer of the packaging; (6) Description of the packaging design type (e.g. dimensions...

PLACE: an open-source python package for laboratory automation, control, and experimentation.

Science.gov (United States)

Johnson, Jami L; Tom Wörden, Henrik; van Wijk, Kasper

2015-02-01

In modern laboratories, software can drive the full experimental process from data acquisition to storage, processing, and analysis. The automation of laboratory data acquisition is an important consideration for every laboratory. When implementing a laboratory automation scheme, important parameters include its reliability, time to implement, adaptability, and compatibility with software used at other stages of experimentation. In this article, we present an open-source, flexible, and extensible Python package for Laboratory Automation, Control, and Experimentation (PLACE). The package uses modular organization and clear design principles; therefore, it can be easily customized or expanded to meet the needs of diverse laboratories. We discuss the organization of PLACE, data-handling considerations, and then present an example using PLACE for laser-ultrasound experiments. Finally, we demonstrate the seamless transition to post-processing and analysis with Python through the development of an analysis module for data produced by PLACE automation. © 2014 Society for Laboratory Automation and Screening.

Numerical Analysis of Warpage Induced by Thermo-Compression Bonding Process of Cu Pillar Bump Flip Chip Package

Energy Technology Data Exchange (ETDEWEB)

Kwon, Oh Young; Jung, Hoon Sun; Lee, Jung Hoon; Choa, Sung-Hoon [Seoul Nat’l Univ. of Science and Technology, Seoul (Korea, Republic of)

2017-06-15

In flip chip technology, the conventional solder bump has been replaced with a copper (Cu) pillar bump owing to its higher input/output (I/O) density, finer pitch, and higher reliability. However, Cu pillar bump technology faces several issues, such as interconnect shorting and higher low-k stress due to stiffer Cu pillar structure when the conventional reflow process is used. Therefore, the thermal compression bonding (TCB) process has been adopted in the flip chip attachment process in order to reduce the package warpage and stress. In this study, we investigated the package warpage induced during the TCB process using a numerical analysis. The warpage of the TCB process was compared with that of the reflow process.

Package Formats for Preserved Digital Material

DEFF Research Database (Denmark)

Zierau, Eld

2012-01-01

This paper presents an investigation of the best suitable package formats for long term digital preservation. The choice of a package format for preservation is crucial for future access, thus a thorough analysis of choice is important. The investigation presented here covers setting up requireme......This paper presents an investigation of the best suitable package formats for long term digital preservation. The choice of a package format for preservation is crucial for future access, thus a thorough analysis of choice is important. The investigation presented here covers setting up...... requirements for package formats used for long term preserved digital material, and using these requirements as the basis for analysing a range of package formats. The result of the concrete investigation is that the WARC format is the package format best suited for the listed requirements. Fulfilling...

Directory of Certificates of Compliance for Radioactive-Materials Packages. Summary report of NRC approved packages

International Nuclear Information System (INIS)

1983-01-01

This directory contains a Summary Report of the US Nuclear Regulatory Commission's Approved Packages (Volume I), all Certificates of Compliance (Volume 2), and Summary Report of NRC Approved Quality Assurance Programs (Volume 3) for Radioactive Material Packages effective December 31, 1982. The purpose of this directory is to make available a convenient source of information on packagings which have been approved by the US Nuclear Regulatory Commission. To assist in identifying packaging, an index by Model Number and corresponding Certificate of Compliance Number is included at the back of Volumes 1 and 2 of the directory. A listing by packaging types is included in the back of Volume 2. An alphabetical listing by company name is included in the back of Volume 3 for approved QA programs. The Summary Reports include a listing of all users of each package design and approved QA programs prior to the publication date of the directory

9 CFR 354.72 - Packaging.

Science.gov (United States)

2010-01-01

... 9 Animals and Animal Products 2 2010-01-01 2010-01-01 false Packaging. 354.72 Section 354.72... CERTIFICATION VOLUNTARY INSPECTION OF RABBITS AND EDIBLE PRODUCTS THEREOF Supervision of Marking and Packaging § 354.72 Packaging. No container which bears or may bear any official identification or any abbreviation...

Antimicrobial packaging with natural compunds - a review

Directory of Open Access Journals (Sweden)

Renata Dobrucka

2016-12-01

Full Text Available Background:  Packaging problems are an integral part of logistics and the implementation of packaging significantly affects the effectiveness of logistics processes, as a factor which increases the safety and the quality of products being transported. Active packaging is an area of technology needed to meet the requirements of the contemporary consumer. Active packaging creates additional opportunities in systems for packing goods, as well as offering a solution in which the packaging, the product and surroundings interact. Furthermore, active packaging allows packaging to interact with food and the environment and play a dynamic role in food preservation. The main role of antimicrobial packaging is to inhibit the growth of microorganisms that reduce the quality of the packaged product. Methods: The application of natural antimicrobial agents appears to be safe for food products. Also, these compounds have potential applications as a natural preservative in the food packaging industry. This study presents some antibacterial agents, namely chitosan, nisin and pectins. Results and conclusion: Natural substances used in active packaging can eliminate the danger of chemical substances migrating to food.

Overview of the DOE packaging certification process

Energy Technology Data Exchange (ETDEWEB)

Liu, Y.Y.; Carlson, R.D. [Argonne National Lab., IL (United States); Carlson, R.W. [Lawrence Livermore National Lab., CA (United States); Kapoor, A. [USDOE, Washington, DC (United States)

1995-12-31

This paper gives an overview of the DOE packaging certification process, which is implemented by the Office of Facility Safety Analysis, under the Assistance Secretary for Environment, Safety and Health, for packagings that are not used for weapons and weapons components, nor for naval nuclear propulsion. The overview will emphasize Type B packagings and the Safety Analysis Report for Packaging (SARP) review that parallels the NRC packaging review. Other important elements in the DOE packaging certification program, such as training, methods development, data bases, and technical assistance, are also emphasized, because they have contributed significantly to the improvement of the certification process since DOE consolidated its packaging certification function in 1985. The paper finishes with a discussion of the roles and functions of the DOE Packaging Safety Review Steering Committee, which is chartered to address issues and concerns of interest to the DOE packaging and transportation safety community. Two articles related to DOE packaging certification were published earlier on the SARP review procedures and the DOE Packaging Review Guide. These articles may be consulted for additional information.

Design and characterization of a 3D encapsulation with silicon vias for radio frequency micro-electromechanical system resonator

International Nuclear Information System (INIS)

Zhao Ji-Cong; Yuan Quan; Wang Feng-Xiang; Kan Xiao; Han Guo-Wei; Yang Jin-Ling; Yang Fu-Hua; Sun Ling; Sun Hai-Yan

2017-01-01

In this paper, we present a three-dimensional (3D) vacuum packaging technique at a wafer level for a radio frequency micro-electromechanical system (RF MEMS) resonator, in which low-loss silicon vias is used to transmit RF signals. Au–Sn solder bonding is adopted to provide a vacuum encapsulation as well as electrical conductions. A RF model of the encapsulation cap is established to evaluate the parasitic effect of the packaging, which provides an effective design solution of 3D RF MEMS encapsulation. With the proposed packaging structure, the signal-to-background ratio (SBR) of 24 dB is achieved, as well as the quality factor ( Q -factor) of the resonator increases from 8000 to 10400 after packaging. The packaged resonator has a linear frequency–temperature ( f – T ) characteristic in a temperature range between 0 °C and 100 °C. And the package shows favorable long-term stability of the Q -factor over 200 days, which indicates that the package has excellent hermeticity. Furthermore, the average shear strength is measured to be 43.58 MPa among 10 samples. (paper)

Safety analysis report: packages. LP-50 tritium package (packaging of fissile and other radioactive materials). Final report

International Nuclear Information System (INIS)

Gates, A.A.; McCarthy, P.G.; Edl, J.W.

1975-04-01

Elemental tritium is shipped at low pressure in a stainless steel container (LP-50) sealed within an aluminum vessel and surrounded by a minimum of 4-in. thick Celotex insulation in a steel drum. The structural, thermal, containment, shielding, and criticality safety aspects of this package are evaluated. Procedures for loading and unloading, empty cask transport, acceptance testing and maintenance, and quality assurance requirements for the LP-50 package are described in detail. (U.S.)

Safety analysis report; packages LP-50 tritium package. (Packaging of fissile and other radioactive materials). Final report

International Nuclear Information System (INIS)

Gates, A.A.; McCarthy, P.G.; Edl, J.W.; Chalfant, G.G.

1975-05-01

Elemental tritium is shipped at low pressure in a stainless steel container (LP-50) surrounded by an aluminum vessel and Celotex insulation at least 4 in. thick in a steel drum. The total weight of the package is 260 lbs maximum. The various components that constitute the package are described and are shown in 7 figures. The safety analysis includes: structural evaluations; thermal evaluations; containment; operating procedures; acceptance tests and maintenance program; and design review

Performance and Reliability of Bonded Interfaces for High-temperature Packaging: Annual Progress Report

Energy Technology Data Exchange (ETDEWEB)

DeVoto, Douglas J. [National Renewable Energy Laboratory (NREL), Golden, CO (United States)

2017-10-19

As maximum device temperatures approach 200 °Celsius, continuous operation, sintered silver materials promise to maintain bonds at these high temperatures without excessive degradation rates. A detailed characterization of the thermal performance and reliability of sintered silver materials and processes has been initiated for the next year. Future steps in crack modeling include efforts to simulate crack propagation directly using the extended finite element method (X-FEM), a numerical technique that uses the partition of unity method for modeling discontinuities such as cracks in a system.

Large transport packages for decommissioning waste

International Nuclear Information System (INIS)

Price, M.S.T.

1988-08-01

This document reports progress on a study of large transport packages for decommissioning waste and is the semi-annual report for the period 1 January - 30 June 1988. The main tasks performed during the period related to the assembly of package design criteria ie those aspects of manufacture, handling, storage, transport and disposal which impose constraints on design. This work was synthesised into a design specification for packages which formed the conclusion of that task and was the entry into the final task - the development of package design concepts. The design specifications, which concentrated on the Industrial Package category of the IAEA Transport Regulations, has been interpreted for the two main concepts (a) a self-shielded package disposed of in its entirety and (b) a package with returnable shielding. Preliminary information has been prepared on the cost of providing the package as well as transport to a repository and disposal. There is considerable uncertainty about the cost of disposal and variations of over a factor of 10 are possible. Under these circumstances there is merit in choosing a design concept which is relatively insensitive to disposal cost variations. The initial results indicate that on these grounds the package with returnable shielding is preferred. (author)

Innovative Approaches to Large Component Packaging

International Nuclear Information System (INIS)

Freitag, A.; Hooper, M.; Posivak, E.; Sullivan, J.

2006-01-01

Radioactive waste disposal often times requires creative approaches in packaging design, especially for large components. Innovative design techniques are required to meet the needs for handling, transporting, and disposing of these large packages. Large components (i.e., Reactor Pressure Vessel (RPV) heads and even RPVs themselves) require special packaging for shielding and contamination control, as well as for transport and disposal. WMG Inc designed and used standard packaging for RPV heads without control rod drive mechanisms (CRDMs) attached for five RPV heads and has also more recently met an even bigger challenge and developed the innovative Intact Vessel Head Transport System (IVHTS) for RPV heads with CRDMs intact. This packaging system has been given a manufacturer's exemption by the United States Department of Transportation (USDOT) for packaging RPV heads. The IVHTS packaging has now been successfully used at two commercial nuclear power plants. Another example of innovative packaging is the large component packaging that WMG designed, fabricated, and utilized at the West Valley Demonstration Project (WVDP). In 2002, West Valley's high-level waste vitrification process was shut down in preparation for D and D of the West Valley Vitrification Facility. Three of the major components of concern within the Vitrification Facility were the Melter, the Concentrate Feed Makeup Tank (CFMT), and the Melter Feed Holdup Tank (MFHT). The removal, packaging, and disposition of these three components presented significant radiological and handling challenges for the project. WMG designed, fabricated, and installed special packaging for the transport and disposal of each of these three components, which eliminated an otherwise time intensive and costly segmentation process that WVDP was considering. Finally, WMG has also designed and fabricated special packaging for both the Connecticut Yankee (CY) and San Onofre Nuclear Generating Station (SONGS) RPVs. This paper

RF and microwave microelectronics packaging II

CERN Document Server

Sturdivant, Rick

2017-01-01

Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in underst...

49 CFR 173.3 - Packaging and exceptions.

Science.gov (United States)

2010-10-01

... 49 Transportation 2 2010-10-01 2010-10-01 false Packaging and exceptions. 173.3 Section 173.3... SHIPMENTS AND PACKAGINGS General § 173.3 Packaging and exceptions. (a) The packaging of hazardous materials.... standard packaging must be open to inspection by a representative of the Department. (b) The regulations...

Multi-bundle shashlik calorimeter prototypes beam-test results

International Nuclear Information System (INIS)

Badier, J.; Bloch, P.; Bityukov, S.; Bordalo, P.; Busson, P.; Charlot, C.; Dobrzynski, L.; Golutvin, I.; Guschin, E.; Issakov, V.; Ivanchenko, I.; Klimenko, V.; Marin, V.; Moissenz, P.; Obraztsov, V.; Ostankov, A.; Popov, V.; Puljak, I.; Ramos, S.; Seez, C.; Sergueev, S.; Soushkov, V.; Tanaka, R.; Varela, J.; Virdee, T.S.; Zaitchenko, A.; Zamiatin, N.

1995-01-01

The first beam-test results for two- and three-bundle shashlik tower prototypes are described. We found that the spatial resolution, the uniformity of energy response, the calorimeter reliability and hermeticity and also two showers separation are improved in multi-bundle design approach. ((orig.))

Multidisciplinary Inverse Reliability Analysis Based on Collaborative Optimization with Combination of Linear Approximations

Directory of Open Access Journals (Sweden)

Xin-Jia Meng

2015-01-01

Full Text Available Multidisciplinary reliability is an important part of the reliability-based multidisciplinary design optimization (RBMDO. However, it usually has a considerable amount of calculation. The purpose of this paper is to improve the computational efficiency of multidisciplinary inverse reliability analysis. A multidisciplinary inverse reliability analysis method based on collaborative optimization with combination of linear approximations (CLA-CO is proposed in this paper. In the proposed method, the multidisciplinary reliability assessment problem is first transformed into a problem of most probable failure point (MPP search of inverse reliability, and then the process of searching for MPP of multidisciplinary inverse reliability is performed based on the framework of CLA-CO. This method improves the MPP searching process through two elements. One is treating the discipline analyses as the equality constraints in the subsystem optimization, and the other is using linear approximations corresponding to subsystem responses as the replacement of the consistency equality constraint in system optimization. With these two elements, the proposed method realizes the parallel analysis of each discipline, and it also has a higher computational efficiency. Additionally, there are no difficulties in applying the proposed method to problems with nonnormal distribution variables. One mathematical test problem and an electronic packaging problem are used to demonstrate the effectiveness of the proposed method.

A computer code package for electron transport Monte Carlo simulation

International Nuclear Information System (INIS)

Popescu, Lucretiu M.

1999-01-01

A computer code package was developed for solving various electron transport problems by Monte Carlo simulation. It is based on condensed history Monte Carlo algorithm. In order to get reliable results over wide ranges of electron energies and target atomic numbers, specific techniques of electron transport were implemented such as: Moliere multiscatter angular distributions, Blunck-Leisegang multiscatter energy distribution, sampling of electron-electron and Bremsstrahlung individual interactions. Path-length and lateral displacement corrections algorithms and the module for computing collision, radiative and total restricted stopping powers and ranges of electrons are also included. Comparisons of simulation results with experimental measurements are finally presented. (author)

Materials for advanced packaging

CERN Document Server

Wong, CP

2017-01-01

This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including: Lead-free solders Flip chip underfills Epoxy molding compounds Conductive adhesives Die attach adhesives/films Thermal interface materials (TIMS) Materials for fabricating embedded passives including capacitors, inductors, and resistors Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS) Contributors also review new and emerging technologies such as Light ...

Biobased Packaging - Application in Meat Industry

Directory of Open Access Journals (Sweden)

S. Wilfred Ruban

2009-04-01

Full Text Available Because of growing problems of waste disposal and because petroleum is a nonrenewable resource with diminishing quantities, renewed interest in packaging research is underway to develop and promote the use of “bio-plastics.” In general, compared to conventional plastics derived from petroleum, bio-based polymers have more diverse stereochemistry and architecture of side chains which enable research scientists a greater number of opportunities to customize the properties of the final packaging material. The primary challenge facing the food (Meat industry in producing bio-plastic packaging, currently, is to match the durability of the packaging with product shelf-life. Notable advances in biopolymer production, consumer demand for more environmentally-friendly packaging, and technologies that allow packaging to do more than just encompass the food are driving new and novel research and developments in the area of packaging for muscle foods. [Vet. World 2009; 2(2.000: 79-82

Directory of certificates of compliance for radioactive materials packages; Summary Report of NRC Approved Packages

International Nuclear Information System (INIS)

1980-12-01

This directory contains a Summary Report of NRC approved Packages (Volume 1), Certificates of Compliance (Volume 2), and a Summary Report of NRC Approved Quality Assurance Programs for Radioactive Material Packages (Volume 3). The purpose of this directory is to make available a convenient source of information on packagings which have been approved by the U.S. Nuclear Regulatory Commission. To assist in identifying packaging, and index by Model Number and corresponding Certificate of Compliance number is included at the back of each volume of the directory. The Summary Report includes a listing of all users of each package design prior to the publication date of the directory. Shipments of radioactive material using these packagings must be in accordance with the provisions of 49 CFR 173.393a and 10 CFR Part 71, as applicable. In satisfying the requirements of Section 71.12, it is the responsibility of the licensees to insure them--that they have a copy of the current approval and conduct their transportation activities in accordance with an NRC approved quality assurance program

Verification, validation, and reliability of predictions

International Nuclear Information System (INIS)

Pigford, T.H.; Chambre, P.L.

1987-04-01

The objective of predicting long-term performance should be to make reliable determinations of whether the prediction falls within the criteria for acceptable performance. Establishing reliable predictions of long-term performance of a waste repository requires emphasis on valid theories to predict performance. The validation process must establish the validity of the theory, the parameters used in applying the theory, the arithmetic of calculations, and the interpretation of results; but validation of such performance predictions is not possible unless there are clear criteria for acceptable performance. Validation programs should emphasize identification of the substantive issues of prediction that need to be resolved. Examples relevant to waste package performance are predicting the life of waste containers and the time distribution of container failures, establishing the criteria for defining container failure, validating theories for time-dependent waste dissolution that depend on details of the repository environment, and determining the extent of congruent dissolution of radionuclides in the UO 2 matrix of spent fuel. Prediction and validation should go hand in hand and should be done and reviewed frequently, as essential tools for the programs to design and develop repositories. 29 refs

Energy and packaging

Energy Technology Data Exchange (ETDEWEB)

Boustead, I; Hancock, G F

1981-01-01

Information is given on the energy and raw materials required in the production and use of containers used to package beer, cider, and carbonated soft drinks in the United Kingdom. Topics covered include: methodology of energy analysis, primary and secondary fuels, transport, packaging materials, including glass, aluminum, iron, steel, and tinplate, container production, including plastic bottles, distribution of empty containers, filling and packing, distribution, and disposal. (LEW)

Power cycling test of a 650 V discrete GaN-on-Si power device with a laminated packaging embedding technology

DEFF Research Database (Denmark)

Song, Sungyoung; Munk-Nielsen, Stig; Uhrenfeldt, Christian

2017-01-01

A GaN-on-Si power device is a strong candidate to replace power components based on silicon in high-end market for low-voltage applications, thanks to its electrical characteristics. To maximize opportunities of the GaN device in field applications, a package technology plays an important role...... in a discrete GaN power device. A few specialized package technologies having very lower stray inductance and higher thermal conductivity have been proposed for discrete GaN-on-Si power devices. Despite their superior performance, there has been little discussion of their reliability. The paper presents a power...... cycling test of a discrete GaN power device employing a laminated embedded packaging technology subjected to 125 degrees Celsius junction temperature swing. Failure modes are described with collected electrical characteristics and measured temperature data under the test. In conclusion, physical...

Signalling product healthiness through symbolic package cues: Effects of package shape and goal congruence on consumer behaviour.

Science.gov (United States)

van Ooijen, Iris; Fransen, Marieke L; Verlegh, Peeter W J; Smit, Edith G

2017-02-01

Three studies show that product packaging shape serves as a cue that communicates healthiness of food products. Inspired by embodiment accounts, we show that packaging that simulates a slim body shape acts as a symbolic cue for product healthiness (e.g., low in calories), as opposed to packaging that simulates a wide body shape. Furthermore, we show that the effect of slim package shape on consumer behaviour is goal dependent. Whereas simulation of a slim (vs. wide) body shape increases choice likelihood and product attitude when consumers have a health-relevant shopping goal, packaging shape does not affect these outcomes when consumers have a hedonic shopping goal. In Study 3, we adopt a realistic shopping paradigm using a shelf with authentic products, and find that a slim (as opposed to wide) package shape increases on-shelf product recognition and increases product attitude for healthy products. We discuss results and implications regarding product positioning and the packaging design process. Copyright © 2016 Elsevier Ltd. All rights reserved.

ACTIVE PACKAGING SYSTEM FOR MEAT AND MEAT PRODUCTS

Directory of Open Access Journals (Sweden)

Adriana Pavelková

2012-10-01

Full Text Available In the recent past, food packaging was used to enable marketing of products and to provide passive protection against environmental contaminations or influences that affect the shelf life of the products. However, unlike traditional packaging, which must be totally inert, active packaging is designed to interact with the contents and/or the surrounding environment. Interest in the use of active packaging systems for meat and meat products has increased in recent years. Active packaging systems are developed with the goal of extending shelf life for foods and increasing the period of time that the food is high quality. Developments in active packaging have led to advances in many areas, including delayed oxidation and controlled respiration rate, microbial growth, and moisture migration. Active packaging technologies include some physical, chemical, or biological action which changes interactions between a package, product, and/or headspace of the package in order to get a desired outcome. Active packaging systems discussed include oxygen scavengers, carbon dioxide scavengers and emitters, moisture control agents, flavour/odour absorbers and releasers  and antimicrobial packaging technologies. Active packaging is typically found in two types of systems; sachets and pads which are placed inside of packages, and active ingredients that are incorporated directly into packaging materials.  Recognition of the benefits of active packaging technologies by the food industry, development of economically viable packaging systems and increased consumer acceptance is necessary for commercial realisation of these packaging technologies.doi:10.5219/205

Development of waste packages for TRU-disposal. 5. Development of cylindrical metal package for TRU wastes

International Nuclear Information System (INIS)

Mine, Tatsuya; Mizubayashi, Hiroshi; Asano, Hidekazu; Owada, Hitoshi; Otsuki, Akiyoshi

2005-01-01

Development of the TRU waste package for hulls and endpieces compression canisters, which include long-lived and low sorption nuclides like C-14 is essential and will contribute a lot to a reasonable enhancement of safety and economy of the TRU-disposal system. The cylindrical metal package made of carbon steel for canisters to enhance the efficiency of the TRU-disposal system and to economically improve their stacking conditions was developed. The package is a welded cylindrical construction with a deep drawn upper cover and a disc plate for a bottom cover. Since the welding is mainly made only for an upper cover and a bottom disc plate, this package has a better containment performance for radioactive nuclide and can reduce the cost for construction and manufacturing including its welding control. Furthermore, this package can be laid down in pile for stacking in the circular cross section disposal tunnel for the sedimentary rock, which can drastically minimize the space for disposal tunnel as mentioned previously in TRU report. This paper reports the results of the study for application of newly developed metal package into the previous TRU-disposal system and for the stacking equipment for the package. (author)

The development of a digital signal processing and plotting package to support testing of hazardous and radioactive material packages

International Nuclear Information System (INIS)

Ludwigsen, J.S.; Uncapher, W.L.; Arviso, M.; Lattier, C.N.; Hankinson, M.; Cannone, D.J.

1995-01-01

Federal regulations allow package designers to use analysis, testing, or a combination of analysis and testing to support certification of packages used to transport hazardous or radioactive materials. In recent years, many certified packages were subjected to a combination of analysis and testing. A major part of evaluating structural or thermal package response is the collection, reduction and presentation of instrumentation measurement data. Sandia National Laboratories, under the sponsorship of the US Department of Energy, has developed a comprehensive analysis and plotting package (known as KAPP) that performs digital signal processing of both transient structural and thermal data integrated with a comprehensive plotting package designed to support radioactive material package testing

The development of a packaging handbook

International Nuclear Information System (INIS)

Shappert, L.B.

1994-01-01

The Packaging Handbook, dealing with the development of packagings designed to carry radioactive material, is being written for DOE's Transportation and Packaging Safety Division. The primary goal of the Handbook is to provide sufficient technical information and guidance to improve the quality of Safety Analysis Reports on Type B Packagings (SARPs) that are submitted to DOE for certification. This paper provides an update on the status of the Handbook

Mechanistic model coupling gas exchange dynamics and Listeria monocytogenes growth in modified atmosphere packaging of non respiring food.

Science.gov (United States)

Chaix, E; Broyart, B; Couvert, O; Guillaume, C; Gontard, N; Guillard, V

2015-10-01

A mechanistic model coupling O2 and CO2 mass transfer (namely diffusion and solubilisation in the food itself and permeation through the packaging material) to microbial growth models was developed aiming at predicting the shelf life of modified atmosphere packaging (MAP) systems. It was experimentally validated on a non-respiring food by investigating concomitantly the O2/CO2 partial pressure in packaging headspace and the growth of Listeria monocytogenes (average microbial count) within the food sample. A sensitivity analysis has revealed that the reliability of the prediction by this "super-parametrized" model (no less than 47 parameters were required for running one simulation) was strongly dependent on the accuracy of the microbial input parameters. Once validated, this model was used to decipher the role of O2/CO2 mass transfer on microbial growth and as a MAP design tool: an example of MAP dimensioning was provided in this paper as a proof of concept. Copyright © 2015 Elsevier Ltd. All rights reserved.

Smart packaging systems for food applications: a review.

Science.gov (United States)

Biji, K B; Ravishankar, C N; Mohan, C O; Srinivasa Gopal, T K

2015-10-01

Changes in consumer preference for safe food have led to innovations in packaging technologies. This article reviews about different smart packaging systems and their applications in food packaging, packaging research with latest innovations. Active and intelligent packing are such packaging technologies which offer to deliver safer and quality products. Active packaging refers to the incorporation of additives into the package with the aim of maintaining or extending the product quality and shelf life. The intelligent systems are those that monitor the condition of packaged food to give information regarding the quality of the packaged food during transportation and storage. These technologies are designed to the increasing demand for safer foods with better shelf life. The market for active and intelligent packaging systems is expected to have a promising future by their integration into packaging materials or systems.

Development directions of packaging made from polymer materials

Directory of Open Access Journals (Sweden)

Jovanović Slobodan

2011-01-01

Full Text Available World packaging market achieves turnover of about $620 billion per year with one third of this amount being associated to packaging made from polymer materials. It is expected that this kind of packaging consumption will hold at least 3% of world packaging market share in the next five years and that it will surpass the consumption of all other materials used in the packaging production. This can be contributed to product quality, low production costs as well as significant investments made in the development of polymer materials, packaging technology and packaging. This paper presents some development directions for packaging made from polymer materials, such as: packaging in the protective atmosphere, the use of active and intelligent packaging, and the use of biopolymers and recycled polymers for packaging production that come into direct contact with the packed product.

49 CFR 178.915 - General Large Packaging standards.

Science.gov (United States)

2010-10-01

... 49 Transportation 2 2010-10-01 2010-10-01 false General Large Packaging standards. 178.915 Section... PACKAGINGS Large Packagings Standards § 178.915 General Large Packaging standards. (a) Each Large Packaging.... Large Packagings intended for solid hazardous materials must be sift-proof and water-resistant. (b) All...

Directory of certificates of compliance for radioactive materials packages: Summary report of NRC approved packages

International Nuclear Information System (INIS)

1987-11-01

This directory contains a Summary Report of the US Nuclear Regulatory Commission's Approved Packages (Volume 1). This directory makes available a convenient source of information on packagings which have been approved by the US Nuclear Regulatory Commission. To assist in identifying packaging, an index by Model Number and corresponding Certificate of Compliance Number is included at the back of Volume 1

Interim storage of radioactive waste packages

International Nuclear Information System (INIS)

1998-01-01

This report covers all the principal aspects of production and interim storage of radioactive waste packages. The latest design solutions of waste storage facilities and the operational experiences of developed countries are described and evaluated in order to assist developing Member States in decision making and design and construction of their own storage facilities. This report is applicable to any category of radioactive waste package prepared for interim storage, including conditioned spent fuel, high level waste and sealed radiation sources. This report addresses the following issues: safety principles and requirements for storage of waste packages; treatment and conditioning methods for the main categories of radioactive waste; examples of existing interim storage facilities for LILW, spent fuel and high level waste; operational experience of Member States in waste storage operations including control of storage conditions, surveillance of waste packages and observation of the behaviour of waste packages during storage; retrieval of waste packages from storage facilities; technical and administrative measures that will ensure optimal performance of waste packages subject to various periods of interim storage

Design aspects of plutonium air-transportable packages

International Nuclear Information System (INIS)

Allen, G.C.; Moya, J.L.; Pierce, J.D.; Attaway, S.W.

1989-01-01

Recent worldwide interest in transporting plutonium powders by air has created a need for expanding the packaging technology base as well as improving their understanding of how plutonium air transport (PAT) packagings perform during severe accident tests. Historically it has not been possible to establish design rules for individual package components because of the complex way parts interacted in forming a successful whole unit. Also, computer analyses were only considered valid for very limited portions of the design effort because of large deformations, localized tearing occurring in the package during accident testing, and extensive use of orthotropic materials. Consequently, iterative design and experimentation has historically been used to develop plutonium air-transportable packages. Full-scale prototypes have been tested since scaling of packages utilizing wood as an energy absorber and thermal insulator has not proven to be very successful. This is because the wood grain and dynamic performance of the wood during crush do not always scale. The high cost of full-scale testing of large packages has certainly hindered obtaining additional data and development new designs. The testing criteria for PAT packages, as described in the US Nuclear Regulatory Commission's Qualification Criteria to Certify a Package for Air Transport of Plutonium, NUREG-0360, 1978, are summarized. Computer modeling techniques have greatly improved over the last ten years, and there are some areas of opportunity for future applications to plutonium air-transportable package design problems. Having developed a better understanding of the performance of current packages, they have the opportunity to make major improvements in new packaging concepts. Each of these areas is explored in further depth to establish their impact on design practices for air-transportable packages

Best Practice in Policy Package Design

DEFF Research Database (Denmark)

Kessler, Florian; Vesela, Jirina; Vencl, Vaclav

2010-01-01

This deliverable focuses on the identification and analysis of best practice examples of policy package design. For this purpose a methodology is developed that allows the systematic analysis of both national and EU policy packages. Eight packages were selected and analysed, highlighting...... the factors which supported the design and implementation process in each case. The results of the analysis show which factors led to these cases to be considered best practice. In addition, factors are identified which are not yet part of the generic policy packaging framework presented in earlier OPTIC...... Deliverables. The consideration of these factors will help to further improve the framework in the subsequent work packages....

Residual strain sensor using Al-packaged optical fiber and Brillouin optical correlation domain analysis.

Science.gov (United States)

Choi, Bo-Hun; Kwon, Il-Bum

2015-03-09

We propose a distributed residual strain sensor that uses an Al-packaged optical fiber for the first time. The residual strain which causes Brillouin frequency shifts in the optical fiber was measured using Brillouin optical correlation domain analysis with 2 cm spatial resolution. We quantified the Brillouin frequency shifts in the Al-packaged optical fiber by the tensile stress and compared them for a varying number of Al layers in the optical fiber. The Brillouin frequency shift of an optical fiber with one Al layer had a slope of 0.038 MHz/με with respect to tensile stress, which corresponds to 78% of that for an optical fiber without Al layers. After removal of the stress, 87% of the strain remained as residual strain. When different tensile stresses were randomly applied, the strain caused by the highest stress was the only one detected as residual strain. The residual strain was repeatedly measured for a time span of nine months for the purpose of reliability testing, and there was no change in the strain except for a 4% reduction, which is within the error tolerance of the experiment. A composite material plate equipped with our proposed Al-packaged optical fiber sensor was hammered for impact experiment and the residual strain in the plate was successfully detected. We suggest that the Al-packaged optical fiber can be adapted as a distributed strain sensor for smart structures, including aerospace structures.

Intelligent food packaging - research and development

OpenAIRE

Renata Dobrucka; Ryszard Cierpiszewski; Andrzej Korzeniowski

2015-01-01

Packaging also fosters effective marketing of the food through distribution and sale channels. It is of the utmost importance to optimize the protection of the food, a great quality and appearance - better than typical packaged foods. In recent years, intelligent packaging became very popular. Intelligent packaging is becoming more and more widely used for food products. Application of this type of solution contributes to improvement of the quality consumer life undoubtedly. Intelligent packa...

Unit-of-Use Versus Traditional Bulk Packaging

Directory of Open Access Journals (Sweden)

Tiffany So

2012-01-01

Full Text Available Background: The choice between unit-of-use versus traditional bulk packaging in the US has long been a continuous debate for drug manufacturers and pharmacies in order to have the most efficient and safest practices. Understanding the benefits of using unit-of-use packaging over bulk packaging by US drug manufacturers in terms of workflow efficiency, economical costs and medication safety in the pharmacy is sometimes challenging.Methods: A time-saving study comparing the time saved using unit-of-use packaging versus bulk packaging, was examined. Prices between unit-of-use versus bulk packages were compared by using the Red Book: Pharmacy’s Fundamental Reference. Other articles were reviewed on the topics of counterfeiting, safe labeling, and implementation of unit-of-use packaging. Lastly, a cost-saving study was reviewed showing how medication adherence, due to improved packaging, could be cost-effective for patients.Results: When examining time, costs, medication adherence, and counterfeiting arguments, unit-of-use packaging proved to be beneficial for patients in all these terms.

Unit-of-Use Versus Traditional Bulk Packaging

Directory of Open Access Journals (Sweden)

Tiffany So

2012-01-01

Full Text Available Background: The choice between unit-of-use versus traditional bulk packaging in the US has long been a continuous debate for drug manufacturers and pharmacies in order to have the most efficient and safest practices. Understanding the benefits of using unit-of-use packaging over bulk packaging by US drug manufacturers in terms of workflow efficiency, economical costs and medication safety in the pharmacy is sometimes challenging. Methods: A time-saving study comparing the time saved using unit-of-use packaging versus bulk packaging, was examined. Prices between unit-of-use versus bulk packages were compared by using the Red Book: Pharmacy's Fundamental Reference. Other articles were reviewed on the topics of counterfeiting, safe labeling, and implementation of unit-of-use packaging. Lastly, a cost-saving study was reviewed showing how medication adherence, due to improved packaging, could be cost-effective for patients. Results: When examining time, costs, medication adherence, and counterfeiting arguments, unit-of-use packaging proved to be beneficial for patients in all these terms.   Type: Student Project

Fresh meat packaging: consumer acceptance of modified atmosphere packaging including carbon monoxide.

Science.gov (United States)

Grebitus, Carola; Jensen, Helen H; Roosen, Jutta; Sebranek, Joseph G

2013-01-01

Consumers' perceptions and evaluations of meat quality attributes such as color and shelf life influence purchasing decisions, and these product attributes can be affected by the type of fresh meat packaging system. Modified atmosphere packaging (MAP) extends the shelf life of fresh meat and, with the inclusion of carbon monoxide (CO-MAP), achieves significant color stabilization. The objective of this study was to assess whether consumers would accept specific packaging technologies and what value consumers place on ground beef packaged under various atmospheres when their choices involved the attributes of color and shelf life. The study used nonhypothetical consumer choice experiments to determine the premiums that consumers are willing to pay for extended shelf life resulting from MAP and for the "cherry red" color in meat resulting from CO-MAP. The experimental design allowed determination of whether consumers would discount foods with MAP or CO-MAP when (i) they are given more detailed information about the technologies and (ii) they have different levels of individual knowledge and media exposure. The empirical analysis was conducted using multinomial logit models. Results indicate that consumers prefer an extension of shelf life as long as the applied technology is known and understood. Consumers had clear preferences for brighter (aerobic and CO) red color and were willing to pay $0.16/lb ($0.35/kg) for each level of change to the preferred color. More information on MAP for extending the shelf life and on CO-MAP for stabilizing color decreased consumers' willingness to pay. An increase in personal knowledge and media exposure influenced acceptance of CO-MAP negatively. The results provide quantitative measures of how packaging affects consumers' acceptance and willingness to pay for products. Such information can benefit food producers and retailers who make decisions about investing in new packaging methods.

16 CFR 503.6 - Packagers' duty to withhold availability of packages imprinted with retail sale price...

Science.gov (United States)

2010-01-01

... THE FAIR PACKAGING AND LABELING ACT STATEMENTS OF GENERAL POLICY OR INTERPRETATION § 503.6 Packagers... reason to know that it will be used as an instrumentality for deception or for frustration of value... fully passes on to the purchasers the represented savings or sale price advantage. (b) A packager or...

Analysis of Type A packaging systems based on greater than 400 individual packaging tests

International Nuclear Information System (INIS)

Edling, D.A.

1976-01-01

Type A packagings commonly used within the U.S. were studied to determine their performance with respect to, ''Tests for demonstrating ability to withstand normal conditions of transport,'' (e.g., water spray, free drop (4 ft), penetration, corner drop, and compression). There are several differences in U.S. and IAEA Type A packaging requirements and these are outlined. For purposes of this study, U. S. requirements were used. More than 100 separate packagings (greater than 400 individual tests) were studied and evaluated. Most of these packagings can be divided into four basic groups: steel drums, wooden boxes, fiberboard containers, and steel boxes. The steel drums met all the requirements with a minimum of qualification and restrictions on use. The wooden boxes performed well, with three-way corner construction providing the best results. The Type A performance requirements had a much greater effect on fiberboard packagings (boxes and drums). In most cases penetration of the fiberboard container did occur, but this was dependent on the inner packagings and materials used. Steel boxes offer a wide flexibility in types of construction, materials usable, volumes, and authorized gross weights. Material usage and construction for wooden and fiberboard containers, such as use of plywood in box construction, banding of boxes, and use of ''firm'' cushioning materials within fiberboard containers, are also discussed

Component reliability data for use in probabilistic safety assessment

International Nuclear Information System (INIS)

1988-10-01

Generic component reliability data is indispensable in any probabilistic safety analysis. It is not realistic to assume that all possible component failures and failure modes modeled in a PSA would be available from the operating experience of a specific plant in a statistically meaningful way. The degree that generic data is used in PSAs varies from case to case. Some studies are totally based on generic data while others use generic data as prior information to be specialized by plant specific data. Most studies, however, finally use a combination where data for certain components come from generic data sources and others from Bayesian updating. The IAEA effort to compile a generic component reliability data base aimed at facilitating the use of data available in the literature and at highlighting pitfalls which deserve special consideration. It was also intended to complement the fault tree and event tree package (PSAPACK) and to facilitate its use. Moreover, it should be noted, that the IAEA has recently initiated a Coordinated Research Program in Reliability Data Collection, Retrieval and Analysis. In this framework the issues identified as most affecting the quality of existing data bases would be addressed. This report presents the results of a compilation made from the specialized literature and includes reliability data for components usually considered in PSA

Type B Drum packages

International Nuclear Information System (INIS)

Edwards, W.S.

1995-11-01

The Type B Drum package is a container in which a single drum containing Type B quantities of radioactive material will be packaged for shipment. The Type B Drum containers are being developed to fill a void in the packaging and transportation capabilities of the US Department of Energy (DOE), as no double containment packaging for single drums of Type B radioactive material is currently available. Several multiple-drum containers and shielded casks presently exist. However, the size and weight of these containers present multiple operational challenges for single-drum shipments. The Type B Drum containers will offer one unshielded version and, if needed, two shielded versions, and will provide for the option of either single or double containment. The primary users of the Type B Drum container will be any organization with a need to ship single drums of Type B radioactive material. Those users include laboratories, waste retrieval facilities, emergency response teams, and small facilities

49 CFR 173.23 - Previously authorized packaging.

Science.gov (United States)

2010-10-01

... 49 Transportation 2 2010-10-01 2010-10-01 false Previously authorized packaging. 173.23 Section... REQUIREMENTS FOR SHIPMENTS AND PACKAGINGS Preparation of Hazardous Materials for Transportation § 173.23 Previously authorized packaging. (a) When the regulations specify a packaging with a specification marking...

Watermarking spot colors in packaging

Science.gov (United States)

Reed, Alastair; Filler, TomáÅ.¡; Falkenstern, Kristyn; Bai, Yang

2015-03-01

In January 2014, Digimarc announced Digimarc® Barcode for the packaging industry to improve the check-out efficiency and customer experience for retailers. Digimarc Barcode is a machine readable code that carries the same information as a traditional Universal Product Code (UPC) and is introduced by adding a robust digital watermark to the package design. It is imperceptible to the human eye but can be read by a modern barcode scanner at the Point of Sale (POS) station. Compared to a traditional linear barcode, Digimarc Barcode covers the whole package with minimal impact on the graphic design. This significantly improves the Items per Minute (IPM) metric, which retailers use to track the checkout efficiency since it closely relates to their profitability. Increasing IPM by a few percent could lead to potential savings of millions of dollars for retailers, giving them a strong incentive to add the Digimarc Barcode to their packages. Testing performed by Digimarc showed increases in IPM of at least 33% using the Digimarc Barcode, compared to using a traditional barcode. A method of watermarking print ready image data used in the commercial packaging industry is described. A significant proportion of packages are printed using spot colors, therefore spot colors needs to be supported by an embedder for Digimarc Barcode. Digimarc Barcode supports the PANTONE spot color system, which is commonly used in the packaging industry. The Digimarc Barcode embedder allows a user to insert the UPC code in an image while minimizing perceptibility to the Human Visual System (HVS). The Digimarc Barcode is inserted in the printing ink domain, using an Adobe Photoshop plug-in as the last step before printing. Since Photoshop is an industry standard widely used by pre-press shops in the packaging industry, a Digimarc Barcode can be easily inserted and proofed.

Hanford Site radioactive hazardous materials packaging directory

International Nuclear Information System (INIS)

McCarthy, T.L.

1995-12-01

The Hanford Site Radioactive Hazardous Materials Packaging Directory (RHMPD) provides information concerning packagings owned or routinely leased by Westinghouse Hanford Company (WHC) for offsite shipments or onsite transfers of hazardous materials. Specific information is provided for selected packagings including the following: general description; approval documents/specifications (Certificates of Compliance and Safety Analysis Reports for Packaging); technical information (drawing numbers and dimensions); approved contents; areas of operation; and general information. Packaging Operations ampersand Development (PO ampersand D) maintains the RHMPD and may be contacted for additional information or assistance in obtaining referenced documentation or assistance concerning packaging selection, availability, and usage

Hanford Site radioactive hazardous materials packaging directory

Energy Technology Data Exchange (ETDEWEB)

McCarthy, T.L.

1995-12-01

The Hanford Site Radioactive Hazardous Materials Packaging Directory (RHMPD) provides information concerning packagings owned or routinely leased by Westinghouse Hanford Company (WHC) for offsite shipments or onsite transfers of hazardous materials. Specific information is provided for selected packagings including the following: general description; approval documents/specifications (Certificates of Compliance and Safety Analysis Reports for Packaging); technical information (drawing numbers and dimensions); approved contents; areas of operation; and general information. Packaging Operations & Development (PO&D) maintains the RHMPD and may be contacted for additional information or assistance in obtaining referenced documentation or assistance concerning packaging selection, availability, and usage.

Development of reliability and probabilistic safety assessment program RiskA

International Nuclear Information System (INIS)

Wu, Yican

2015-01-01

Highlights: • There are four parts in the structure of RiskA. User input part lets users input the PSA model and some necessary data by GUI or model transformation tool. In calculation engine part, fault tree analysis, event tree analysis, uncertainty analysis, sensitivity analysis, importance analysis and failure mode and effects analysis are supplied. User output part outputs the analysis results, user customized reports and some other data. The last part includes reliability database, some other common tools and help documents. • RiskA has several advanced features. Extensible framework makes it easy to add any new functions, making RiskA to be a large platform of reliability and probabilistic safety assessment. It is very fast to analysis fault tree in RiskA because many advanced algorithm improvement were made. Many model formats can be imported and exported, which made the PSA model in the commercial software can be easily transformed to adapt RiskA platform. Web-based co-modeling let several users in different places work together whenever they are online. • The comparison between RiskA and other mature PSA codes (e.g. CAFTA, RiskSpectrum, XFTA) has demonstrated that the calculation and analysis of RiskA is correct and efficient. Based on the development of this code package, many applications of safety and reliability analysis of some research reactors and nuclear power plants were performed. The development of RiskA appears to be of realistic and potential value for academic research and practical operation safety management of nuclear power plants in China and abroad. - Abstract: PSA (probabilistic safety assessment) software, the indispensable tool in nuclear safety assessment, has been widely used. An integrated reliability and PSA program named RiskA has been developed by FDS Team. RiskA supplies several standard PSA modules including fault tree analysis, event tree analysis, uncertainty analysis, failure mode and effect analysis and reliability

Grandfathering of competent authority approved packages

International Nuclear Information System (INIS)

Osgood, N.L.

2004-01-01

International Atomic Energy Agency transportation regulations are reviewed and revised on a periodic basis as new technical and scientific information becomes available. The 1996 Edition of the Regulations for the Safe Transport of Radioactive Materials in TS-R-1 includes provisions for the use of package designs approved to previous editions of the regulations. This assures that there is no disruption of transport when the regulations are updated and revised. The revision of package design standards may make certain designs obsolete, though not necessarily unsafe. The U.S. Nuclear Regulatory Commission is the agency in the United States that certifies transportation packages for Type B and fissile materials. NRC regulations include grandfathering provisions that are comparable to and compatible with the IAEA standards. NRC staff is promoting a new system that would eliminate the need to grandfather package designs. Under the new method, any new or revised provision of the regulations that affects package standards would include its own transitional arrangements. In this way, each change would be evaluated for its safety importance. Changes in the package standards that are important to safety would be implemented immediately upon the regulations coming into force. Other changes, that do not significantly affect safety, would have longer implementation periods. In this way, all packages in use would be compatible with the regulations in force, and no specific grandfathering provisions for older designs would be needed. NRC staff has concluded that the package design standards are mature and have been shown to be protective over the past 40 years of shipping experience. We predict that future changes in package design standards will not be substantive in terms of resulting in significant changes in physical performance of a package in transport, including actual transportation accidents. The benefits of the new system would be a more predictable regulatory structure

Reliability evaluation methodologies for ensuring container integrity of stored transuranic (TRU) waste

International Nuclear Information System (INIS)

Smith, K.L.

1995-06-01

This report provides methodologies for providing defensible estimates of expected transuranic waste storage container lifetimes at the Radioactive Waste Management Complex. These methodologies can be used to estimate transuranic waste container reliability (for integrity and degradation) and as an analytical tool to optimize waste container integrity. Container packaging and storage configurations, which directly affect waste container integrity, are also addressed. The methodologies presented provide a means for demonstrating Resource Conservation and Recovery Act waste storage requirements

Package testing capabilities at the Pacific Northwest Laboratory

International Nuclear Information System (INIS)

Taylor, J.M.

1993-01-01

The purpose of this paper is to describe the package testing capabilities at the Pacific Northwest Laboratory (PNL). In the past all of the package testing that was performed at PNL was done on prototype or mocked up radioactive material packaging. Presently, we are developing the capability to perform testing on non-radioactive material packaging. The testing on the non-radioactive material packaging will be done to satisfy the new performance oriented packaging requirements (DOT Docket HM-181, 1991). This paper describes the equipment used to perform the performance oriented packaging tests and also describes some testing capability for testing radioactive material packaging

RECENT TRENDS IN PACKAGING SYSTEMS FOR PHARMACEUTICAL PRODUCTS

Directory of Open Access Journals (Sweden)

Renata Dobrucka

2014-12-01

Full Text Available Background:  In recent years, pharmaceutical packaging market was one of the fastest growing areas of the packaging industry. At the same time the packaging manufacturers put high demands on quality and safety. Methods: Review of innovations in packaging systems for pharmaceutical products was made including newest information of researches and achievements of recent years. Results and conclusion: Observed in recent years the development of pharmaceutical packaging market expanded due to with the huge technological advances that allow introduction of new packaging. Also, in this study presented intelligent packaging in pharmacy and innovation in child-resistance packaging.

K Basin sludge packaging design criteria (PDC) and safety analysis report for packaging (SARP) approval plan

International Nuclear Information System (INIS)

Brisbin, S.A.

1996-01-01

This document delineates the plan for preparation, review, and approval of the Packaging Design Crieteria for the K Basin Sludge Transportation System and the Associated on-site Safety Analysis Report for Packaging. The transportation system addressed in the subject documents will be used to transport sludge from the K Basins using bulk packaging

The impact of packaging on product competition

Directory of Open Access Journals (Sweden)

Maryam Masoumi

2012-09-01

Full Text Available The primary objective of this paper is to detect important factors, which are influencing competitive advantage. The proposed model of this paper uses sampling technique to measure characteristics of society. There are eight independent variables for the proposed study of this paper including packaging endurance, easy distribution, customer promotion through packaging, packaging structure, packaging as silent advertiser, diversity of packaging, clean and healthy packaging and innovation in packaging. The proposed study uses structural equation modeling to either accept or reject all hypotheses associated with the proposed study of this paper. The population of this study includes all managers and experts who are involved in packaging products. We used simple sampling technique and chooses 300 from a population of 450 people who are considered as the population of this survey. Cronbach alpha was determined as 0.732, which is above the minimum acceptable level. The results confirm that all mentioned factors influence competitiveness, effectively.

Migration and sorption phenomena in packaged foods.

Science.gov (United States)

Gnanasekharan, V; Floros, J D

1997-10-01

Rapidly developing analytical capabilities and continuously evolving stringent regulations have made food/package interactions a subject of intense research. This article focuses on: (1) the migration of package components such as oligomers and monomers, processing aids, additives, and residual reactants in to packaged foods, and (2) sorption of food components such as flavors, lipids, and moisture into packages. Principles of diffusion and thermodynamics are utilized to describe the mathematics of migration and sorption. Mathematical models are developed from first principles, and their applicability is illustrated using numerical simulations and published data. Simulations indicate that available models are system (polymer-penetrant) specific. Furthermore, some models best describe the early stages of migration/sorption, whereas others should be used for the late stages of these phenomena. Migration- and/or sorption-related problems with respect to glass, metal, paper-based and polymeric packaging materials are discussed, and their importance is illustrated using published examples. The effects of migrating and absorbed components on food safety, quality, and the environment are presented for various foods and packaging materials. The impact of currently popular packaging techniques such as microwavable, ovenable, and retortable packaging on migration and sorption are discussed with examples. Analytical techniques for investigating migration and sorption phenomena in food packaging are critically reviewed, with special emphasis on the use and characteristics of food-simulating liquids (FSLs). Finally, domestic and international regulations concerning migration in packaged foods, and their impact on food packaging is briefly presented.

Young people's perceptions of cigarette packaging and plain packaging: an online survey.

Science.gov (United States)

Moodie, Crawford; Ford, Allison; Mackintosh, Anne Marie; Hastings, Gerard

2012-01-01

In the United Kingdom, with most marketing channels prohibited, packaging is one of the few remaining ways that tobacco companies can promote their products. An online survey with young people aged 10-17 years (N = 658) was used to explore why youth choose cigarettes, perceptions of pack color, and perceptions of plain (nonbranded) cigarette packaging. Young people were also shown an image of 3 plain packs, which differed by shape and method of opening, and asked which they liked most and thought others their age would smoke. Price and what significant others smoke were key factors for choosing cigarettes, with packaging also an important influence. More than a third of the sample associated lighter pack color with weak tasting and less harmful cigarettes. Plain packs were rated negatively as were perceptions of plain pack users. One in 3 showed a preference for either a narrow "perfume type" plain pack or a plain "slide" pack that opened from the side, and 1 in 3 also thought that young people would smoke these packs. Packaging appears to both attract young people and mislead them about product strength and relative harm. Innovative pack construction (novel pack shape and method of opening) and the use of color are instrumental in these effects. The findings therefore suggest that any move to plain packaging should not only consider the benefits of removing branding (including color) but also of standardizing pack construction in terms of shape and method of opening.

Safety Analysis Report for Packaging (SARP): ATMX-500 Railcar nuclear packaging

International Nuclear Information System (INIS)

Griffin, J.F.; Peterson, J.B.; Edling, D.A.; Blauvelt, R.K.

1977-01-01

A Safety Analysis Report for Packaging (SARP) is described that makes available to all potential users the technical specifications and limits pertinent to the modification and use of the ATMX Railcars for which the Department of Transportation has issued Special Permit No. 5948. The SARP includes discussions of structural integrity, thermal resistance, radiation shielding and radiological safety, nuclear criticality safety, and quality control. Much of the information was previously published in a similar report. A complte physical and technical description of the package is presented. The packaging cnsists of a specially modified ATMX Series 500 Railcar loaded with DOT Specification steel drums or fiberglass coated plywood boxes. The results of the nuclear criticality safety analysis provide the maximum quantities of each fissile isotope which may be shipped as Fissile Class I in 30- and 55-gal drums. A limit of 5 g/ft 3 was established for wooden boxes. Design and development considerations regarding the packaging concept and modification of the ATMX-500 Railcar are presented. Tables, dimensional sketches, sequential photographs of the structural modifications, technical references, loading and shipping guidelines, and results of Mound Laboratory's experience in using this container are included. An internal review of this SARP was performed in compliance with the requirements of ERDA Manual Chapter 5201-Part V

New seismic instrumentation packaged for all terrestrial environments (including the quietest observatories!).

Science.gov (United States)

Parker, Tim; Devanney, Peter; Bainbridge, Geoff; Townsend, Bruce

2017-04-01

The march to make every type of seismometer, weak to strong motion, reliable and economically deployable in any terrestrial environment continues with the availability of three new sensors and seismic systems including ones with over 200dB of dynamic range. Until recently there were probably 100 pier type broadband sensors for every observatory type pier, not the types of deployments geoscientists are needing to advance science and monitoring capability. Deeper boreholes are now the recognized quieter environments for best observatory class instruments and these same instruments can now be deployed in direct burial environments which is unprecedented. The experiences of facilities in large deployments of broadband seismometers in continental scale rolling arrays proves the utility of packaging new sensors in corrosion resistant casings and designing in the robustness needed to work reliably in temporary deployments. Integrating digitizers and other sensors decreases deployment complexity, decreases acquisition and deployment costs, increases reliability and utility. We'll discuss the informed evolution of broadband pier instruments into the modern integrated field tools that enable economic densification of monitoring arrays along with supporting new ways to approach geoscience research in a field environment.

7 CFR 58.151 - Packaging and repackaging.

Science.gov (United States)

2010-01-01

... 7 Agriculture 3 2010-01-01 2010-01-01 false Packaging and repackaging. 58.151 Section 58.151... Specifications for Dairy Plants Approved for USDA Inspection and Grading Service 1 Packaging and General Identification § 58.151 Packaging and repackaging. (a) Packaging dairy products or cutting and repackaging all...

Dual Use Packaging, Phase I

Data.gov (United States)

National Aeronautics and Space Administration — NASA seeks down-weighted packaging compatible with microwave preparation and perhaps high hydrostatic pressure processing. New packaging must satisfy NASA's 3-year...

Safety analysis report: packages. DOT specification 7A - Type A container Mark 15 sludge shipping package

International Nuclear Information System (INIS)

Zeh, C.W.

1985-03-01

Sludge or filter cake containing 1.1 wt % 235 U enriched uranium from Mark 15 fabrication will be packaged in 55-gallon containers and shipped from SRP to NLO, Fernald, Ohio for recovery of product. About 7 Metric Tons (MT) of filter cake will be produced from fabricating Mark 15 slugs each reactor charge. Packaged shipments of this material, consigned as exclusive use, will be shipped to NLO in Department of Transportation (DOT) Specification 7A - Type A packages under a DOE Certificate of Compliance for Fissile Class III shipments. ''Type A packaging'' is designed to retain containment and shielding integrity under normal conditions of transport. This report documents compliance of the package design, construction methods, material and test performance with DOT Specification 7A. This DOT 7A Type A package contains a carbon steel outer container which is a 0.060-in.-thick 55-gal, galvanized drum equipped with a gasketed closure. The outer container encloses a 0.090-in.-thick, open head, polyethylene liner with lid

K east encapsulation packager modifications

International Nuclear Information System (INIS)

Jensen, M.A.

1994-01-01

This Supporting Document analyzes a proposal for reducing the under-packager volume to decrease the amount of fissile material that could accumulate there. The analysis shows that restricting the under packager volume to no more than 4080 in 3 will assure that if accumulated fissile material beneath the packager is added to the worst-case mass of fissile material in the discharge chute, a k eff of 0.98 will not be exceeded

System issues for multichip packaging

Science.gov (United States)

Sage, Maurice G.; Hartley, Neil

1991-04-01

It is now generally recognised that the performance of an electronic system is governed by the choice of packaging technology. Never before have the technical and financial implications of a packaging technology choice been more critical and never before has technology interdependence or industry globalisation made the choice more difficult. This paper is aimed at examining the choices available and the system issues resulting from the move from single chip to multichip packaging.

APPLICATION OF NANOTECHNOLOGY IN FOOD PACKAGING

Directory of Open Access Journals (Sweden)

Renata Dobrucka

2014-04-01