WorldWideScience

Sample records for reliable hermetic packages

  1. Hermeticity of electronic packages

    CERN Document Server

    Greenhouse, Hal; Romenesco, Bruce

    2011-01-01

    This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the packageùespecially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to so

  2. Hermeticity of electronic packages

    CERN Document Server

    Greenhouse, Hal

    2000-01-01

    This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package-especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to so

  3. Hermeticity testing of MEMS and microelectronic packages

    CERN Document Server

    Costello, Suzanne

    2013-01-01

    Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required.This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book in

  4. Wafer-level vacuum/hermetic packaging technologies for MEMS

    Science.gov (United States)

    Lee, Sang-Hyun; Mitchell, Jay; Welch, Warren; Lee, Sangwoo; Najafi, Khalil

    2010-02-01

    An overview of wafer-level packaging technologies developed at the University of Michigan is presented. Two sets of packaging technologies are discussed: (i) a low temperature wafer-level packaging processes for vacuum/hermeticity sealing, and (ii) an environmentally resistant packaging (ERP) technology for thermal and mechanical control as well as vacuum packaging. The low temperature wafer-level encapsulation processes are implemented using solder bond rings which are first patterned on a cap wafer and then mated with a device wafer in order to encircle and encapsulate the device at temperatures ranging from 200 to 390 °C. Vacuum levels below 10 mTorr were achieved with yields in an optimized process of better than 90%. Pressures were monitored for more than 4 years yielding important information on reliability and process control. The ERP adopts an environment isolation platform in the packaging substrate. The isolation platform is designed to provide low power oven-control, vibration isolation and shock protection. It involves batch flip-chip assembly of a MEMS device onto the isolation platform wafer. The MEMS device and isolation structure are encapsulated at the wafer-level by another substrate with vertical feedthroughs for vacuum/hermetic sealing and electrical signal connections. This technology was developed for high performance gyroscopes, but can be applied to any type of MEMS device.

  5. Micro packaging of hermetic seal mini dual in line laser diode module for aerospace applications

    Science.gov (United States)

    Kazemi, Alex A.; Chan, Eric; Koshinz, Dennis

    2014-09-01

    Normally, reliable, reproducible, high-yield packaging technologies are essential for meeting the cost, performance, and service objectives for the harsh environment of space applications. This paper describes a new improved micro packaging method of hermetic seal mini-DIL (dual in line) laser diode module. The problem of using a softer solder resulted in failure mechanisms observed in the mini-DIL laser diode module based laser firing unit (LFU) for ordinance ignition of a missile system. These failures included: (1) failure in light output pulse power, (2) fiber pigtail damage inside the package snout which caused low LFU production yield. Our distinctive challenge for this project is the micro packaging of mini-DIL. For this package a new technique for the hermetic sealing using a micro-soldering process was developed. The process is able to confine the solder seal to a small region inside the snout near the fiber feed-through hole on the wall of the mini-DIL package. After completing the development, which included temperature and thermal cycling, X-rays analysis showed the new method had no fiber damage after the microsoldering seal. The new process resulted in 100% success in the packaging design and was granted a patent for the innovative development.

  6. Reliable, Low-Cost, Low-Weight, Non-Hermetic Coating for MCM Applications

    Science.gov (United States)

    Jones, Eric W.; Licari, James J.

    2000-01-01

    Through an Air Force Research Laboratory sponsored STM program, reliable, low-cost, low-weight, non-hermetic coatings for multi-chip-module(MCK applications were developed. Using the combination of Sandia Laboratory ATC-01 test chips, AvanTeco's moisture sensor chips(MSC's), and silicon slices, we have shown that organic and organic/inorganic overcoatings are reliable and practical non-hermetic moisture and oxidation barriers. The use of the MSC and unpassivated ATC-01 test chips provided rapid test results and comparison of moisture barrier quality of the overcoatings. The organic coatings studied were Parylene and Cyclotene. The inorganic coatings were Al2O3 and SiO2. The choice of coating(s) is dependent on the environment that the device(s) will be exposed to. We have defined four(4) classes of environments: Class I(moderate temperature/moderate humidity). Class H(high temperature/moderate humidity). Class III(moderate temperature/high humidity). Class IV(high temperature/high humidity). By subjecting the components to adhesion, FTIR, temperature-humidity(TH), pressure cooker(PCT), and electrical tests, we have determined that it is possible to reduce failures 50-70% for organic/inorganic coated components compared to organic coated components. All materials and equipment used are readily available commercially or are standard in most semiconductor fabrication lines. It is estimated that production cost for the developed technology would range from $1-10/module, compared to $20-200 for hermetically sealed packages.

  7. Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication.

    Science.gov (United States)

    Schuettler, Martin; Kohler, Fabian; Ordonez, Juan S; Stieglitz, Thomas

    2012-01-01

    Future brain-computer-interfaces (BCIs) for severely impaired patients are implanted to electrically contact the brain tissue. Avoiding percutaneous cables requires amplifier and telemetry electronics to be implanted too. We developed a hermetic package that protects the electronic circuitry of a BCI from body moisture while permitting infrared communication through the package wall made from alumina ceramic. The ceramic package is casted in medical grade silicone adhesive, for which we identified MED2-4013 as a promising candidate.

  8. 76 FR 81363 - Temperature-Indicating Devices; Thermally Processed Low-Acid Foods Packaged in Hermetically...

    Science.gov (United States)

    2011-12-28

    ... amended FDA's regulations for thermally processed low-acid foods packaged in hermetically sealed... DEPARTMENT OF HEALTH AND HUMAN SERVICES Food and Drug Administration 21 CFR Part 113 [Docket No. FDA-2007-N-0265] (formerly 2007N-0026) Temperature-Indicating Devices; Thermally Processed Low-Acid...

  9. Waste package reliability analysis

    International Nuclear Information System (INIS)

    Pescatore, C.; Sastre, C.

    1983-01-01

    Proof of future performance of a complex system such as a high-level nuclear waste package over a period of hundreds to thousands of years cannot be had in the ordinary sense of the word. The general method of probabilistic reliability analysis could provide an acceptable framework to identify, organize, and convey the information necessary to satisfy the criterion of reasonable assurance of waste package performance according to the regulatory requirements set forth in 10 CFR 60. General principles which may be used to evaluate the qualitative and quantitative reliability of a waste package design are indicated and illustrated with a sample calculation of a repository concept in basalt. 8 references, 1 table

  10. Wafer-level hermetic vacuum packaging by bonding with a copper-tin thin film sealing ring

    Science.gov (United States)

    Akashi, Teruhisa; Funabashi, Hirofumi; Takagi, Hideki; Omura, Yoshiteru; Hata, Yoshiyuki

    2018-04-01

    A wafer-level hermetic vacuum packaging technology intended for use with MEMS devices was developed based on a copper-tin (CuSn) thin film sealing ring. To allow hermetic packaging, the shear strength of the CuSn thin film bond was improved by optimizing the pretreatment conditions. As a result, an average shear strength of 72.3 MPa was obtained and a cavity that had been hermetically sealed using wafer-level packaging (WLP) maintained its vacuum for 1.84 years. The total pressures in the cavities and the partial pressures of residual gases were directly determined with an ultra-low outgassing residual gas analyzer (RGA) system. Hermeticity was evaluated based on helium leak rates, which were calculated from helium pressures determined with the RGA system. The resulting data showed that a vacuum cavity following 1.84 years storage had a total pressure of 83.1 Pa, contained argon as the main residual gas and exhibited a helium leak rate as low as 1.67  ×  10-17 Pa · m3 s-1, corresponding to an air leak rate of 6.19  ×  10-18 Pa · m3 s-1. The RGA data demonstrate that WLP using a CuSn thin film sealing ring permits ultra-high hermeticity in conjunction with long-term vacuum packaging that is applicable to MEMS devices.

  11. Study of gas generation in drum L/ILW packages using hermetic containers

    International Nuclear Information System (INIS)

    Molnar, M.; Palcsu, L.; Svingor, E.; Futo, I.; Major, Z.; Veres, M.

    2005-01-01

    Complete text of publication follows. During the storage of low and intermediate level radioactive waste (L/ILW) significant quantities of gas may be produced. It is likely that a small proportion of the generated gas will be radioactive as a result of the incorporation of the isotopes 3 H and 14 C that are present within the waste. To obtain reliable estimates of the quantities and rates of the gas production in L/ILWa series of measurements was carried out of waste packages produced and temporarily stored at the site of Paks Nuclear Power Plant (NPP). Ten drums filled with selected original L/ILW were placed into hermetic containers equipped with sampling valves for repeated sampling. These hermetic containers were stored at the same site where the L/ILW is stored primarily in the Paks NPP. The pressure and the temperature of the headspace gas in the containers were monitored continuously. Qualitative gas component analyses of headspace gases of drums and their containers were executed by quadrupole mass spectrometer. The gas generation rate in the stored L/ILW was calculated by the measured state parameters and the composition variation of the gas in the closed containers. Stable isotope measurements were executed from the CO 2 , CH 4 and N 2 fractions by stable isotope ratio mass spectrometer. Helium measurements were done by noble gas mass spectrometer. The tritium content of the vapour, H 2 and CH 4 fractions was measured by a low background liquid scintillation counter. 14 C content of the CO 2 and CH 4 fractions was measured by a low background gas proportional counter system (ATOMKI). Our results showed that the main generated gases in L/ILW are carbon dioxide, methane, hydrogen and nitrogen. The typical rates were 0.05-0.2 normal litre gas/day for CO 2 and CH 4 generation, and less than 0.02 normal litre gas/day for H 2 . Because of the typical vanishing of the O 2 from the headspace gases no explosive gas mixture was indicated in the L/ILW drums during

  12. High Performance Microaccelerometer with Wafer-level Hermetic Packaged Sensing Element and Continuous-time BiCMOS Interface Circuit

    International Nuclear Information System (INIS)

    Ko, Hyoungho; Park, Sangjun; Paik, Seung-Joon; Choi, Byoung-doo; Park, Yonghwa; Lee, Sangmin; Kim, Sungwook; Lee, Sang Chul; Lee, Ahra; Yoo, Kwangho; Lim, Jaesang; Cho, Dong-il

    2006-01-01

    A microaccelerometer with highly reliable, wafer-level packaged MEMS sensing element and fully differential, continuous time, low noise, BiCMOS interface circuit is fabricated. The MEMS sensing element is fabricated on a (111)-oriented SOI wafer by using the SBM (Sacrificial/Bulk Micromachining) process. To protect the silicon structure of the sensing element and enhance the reliability, a wafer level hermetic packaging process is performed by using a silicon-glass anodic bonding process. The interface circuit is fabricated using 0.8 μm BiCMOS process. The capacitance change of the MEMS sensing element is amplified by the continuous-time, fully-differential transconductance input amplifier. A chopper-stabilization architecture is adopted to reduce low-frequency noise including 1/f noise. The fabricated microaccelerometer has the total noise equivalent acceleration of 0.89 μg/√Hz, the bias instability of 490 μg, the input range of ±10 g, and the output nonlinearity of ±0.5 %FSO

  13. Power Electronics Packaging Reliability | Transportation Research | NREL

    Science.gov (United States)

    Packaging Reliability Power Electronics Packaging Reliability A photo of a piece of power electronics laboratory equipment. NREL power electronics packaging reliability research investigates the electronics packaging around a semiconductor switching device determines the electrical, thermal, and

  14. Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects

    Science.gov (United States)

    Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter

    2011-02-01

    The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

  15. Power Electronic Packaging Design, Assembly Process, Reliability and Modeling

    CERN Document Server

    Liu, Yong

    2012-01-01

    Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can d...

  16. Reliability of industrial packaging for microsystems

    DEFF Research Database (Denmark)

    Reus, Roger De; Christensen, Carsten; Weichel, Steen

    1998-01-01

    . Protective coatings of amorphous silicon carbide and tantalum oxide are suitable candidates with etch rates below 0.1 Angstrom/h in aqueous solutions with pH II at temperatures up to 140 degrees C. Si-Ta-N films exhibit etch rates around 1 Angstrom/h. Parylene C coatings did not etch but peeled off after......Packaging concepts for silicon-based micromachined sensors exposed to harsh environments are explored. By exposing the sensors directly to the media and applying protection at the wafer level the packaging and assembly will be simplified as compared to conventional methods of fabrication...

  17. 7 CFR 201.36c - Hermetically-sealed containers.

    Science.gov (United States)

    2010-01-01

    ... 7 Agriculture 3 2010-01-01 2010-01-01 false Hermetically-sealed containers. 201.36c Section 201... ACT FEDERAL SEED ACT REGULATIONS Advertising § 201.36c Hermetically-sealed containers. The 5-month... been met: (a) The seed was packaged within 9 months after harvest; (b) The container used does not...

  18. Reliability test and failure analysis of high power LED packages

    International Nuclear Information System (INIS)

    Chen Zhaohui; Zhang Qin; Wang Kai; Luo Xiaobing; Liu Sheng

    2011-01-01

    A new type application specific light emitting diode (LED) package (ASLP) with freeform polycarbonate lens for street lighting is developed, whose manufacturing processes are compatible with a typical LED packaging process. The reliability test methods and failure criterions from different vendors are reviewed and compared. It is found that test methods and failure criterions are quite different. The rapid reliability assessment standards are urgently needed for the LED industry. 85 0 C/85 RH with 700 mA is used to test our LED modules with three other vendors for 1000 h, showing no visible degradation in optical performance for our modules, with two other vendors showing significant degradation. Some failure analysis methods such as C-SAM, Nano X-ray CT and optical microscope are used for LED packages. Some failure mechanisms such as delaminations and cracks are detected in the LED packages after the accelerated reliability testing. The finite element simulation method is helpful for the failure analysis and design of the reliability of the LED packaging. One example is used to show one currently used module in industry is vulnerable and may not easily pass the harsh thermal cycle testing. (semiconductor devices)

  19. Packaging Concerns/Techniques for Large Devices

    Science.gov (United States)

    Sampson, Michael J.

    2009-01-01

    This slide presentation reviews packaging challenges and options for electronic parts. The presentation includes information about non-hermetic packages, space challenges for packaging and complex package variations.

  20. How reliable does the waste package containment have to be

    International Nuclear Information System (INIS)

    Wick, E.A.

    1985-01-01

    The final rule (10 CFR Part 60) for Disposal of High-Level Radioactive Wastes in Geologic Repositories specifies that the engineered barrier system shall be designed so that, assuming anticipated processes and events, containment of high-level radioactive wastes (HLW) will be substantially complete during the period when radiation and thermal conditions in the engineered barrier system are dominated by fission product decay. This requirement leads to the Nuclear Regulatory Commission (NRC) being asked the following questions: What is meant by ''substantially complete''. How reliable does waste package containment have to be. How many waste packages can fail. Although the NRC has not defined quantitatively the term ''substantially complete'', a numerical concept for acceptable release during the containment period is discussed. The number of containment failures that could be tolerated under the rule would depend upon the acceptable release, the time at which failure occurs and the rate of release from a failed package

  1. Plastic packaged microcircuits: Quality, reliability, and cost issues

    Science.gov (United States)

    Pecht, Michael G.; Agarwal, Rakesh; Quearry, Dan

    1993-12-01

    Plastic encapsulated microcircuits (PEMs) find their main application in commercial and telecommunication electronics. The advantages of PEMs in cost, size, weight, performance, and market lead-time, have attracted 97% of the market share of worldwide microcircuit sales. However, PEMs have always been resisted in US Government and military applications due to the perception that PEM reliability is low. This paper surveys plastic packaging with respect to the issues of reliability, market lead-time, performance, cost, and weight as a means to guide part-selection and system-design.

  2. Packaging and Embedded Electronics for the Next Generation

    Science.gov (United States)

    Sampson, Michael J.

    2010-01-01

    This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

  3. Assessment of microelectronics packaging for high temperature, high reliability applications

    Energy Technology Data Exchange (ETDEWEB)

    Uribe, F.

    1997-04-01

    This report details characterization and development activities in electronic packaging for high temperature applications. This project was conducted through a Department of Energy sponsored Cooperative Research and Development Agreement between Sandia National Laboratories and General Motors. Even though the target application of this collaborative effort is an automotive electronic throttle control system which would be located in the engine compartment, results of this work are directly applicable to Sandia`s national security mission. The component count associated with the throttle control dictates the use of high density packaging not offered by conventional surface mount. An enabling packaging technology was selected and thermal models defined which characterized the thermal and mechanical response of the throttle control module. These models were used to optimize thick film multichip module design, characterize the thermal signatures of the electronic components inside the module, and to determine the temperature field and resulting thermal stresses under conditions that may be encountered during the operational life of the throttle control module. Because the need to use unpackaged devices limits the level of testing that can be performed either at the wafer level or as individual dice, an approach to assure a high level of reliability of the unpackaged components was formulated. Component assembly and interconnect technologies were also evaluated and characterized for high temperature applications. Electrical, mechanical and chemical characterizations of enabling die and component attach technologies were performed. Additionally, studies were conducted to assess the performance and reliability of gold and aluminum wire bonding to thick film conductor inks. Kinetic models were developed and validated to estimate wire bond reliability.

  4. The Assurance Challenges of Advanced Packaging Technologies for Electronics

    Science.gov (United States)

    Sampson, Michael J.

    2010-01-01

    Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

  5. Hermetically Sealed Compressor

    Science.gov (United States)

    Holtzapple, Mark T.

    1994-01-01

    Proposed hermetically sealed pump compresses fluid to pressure up to 4,000 atm (400 MPa). Pump employs linear electric motor instead of rotary motor to avoid need for leakage-prone rotary seals. In addition, linear-motor-powered pump would not require packings to seal its piston. Concept thus eliminates major cause of friction and wear. Pump is double-ended diaphragm-type compressor. All moving parts sealed within compressor housing.

  6. DESIGN OF WATER-COOLED PACKAGED AIR-CONDITIONING SYSTEMS BASED ON RELIABILITY ASSESSMENT

    OpenAIRE

    関口, 圭輔; 中尾, 正喜; 藁谷, 至誠; 植草, 常雄; 羽山, 広文

    2007-01-01

    Water-cooled packaged air-conditioning systems are reevaluated in terms of alleviating the heat island phenomenon in cities and effectively utilizing building rooftops. Up to now, such reliability assessment has been insufficient, and this has limited the use of this kind of air-conditioning system in the information and communications sectors that demand a high reliability. This work has led to the development of a model for evaluating the reliability of water-cooled package air-conditioning...

  7. Standard high-reliability integrated circuit logic packaging. [for deep space tracking stations

    Science.gov (United States)

    Slaughter, D. W.

    1977-01-01

    A family of standard, high-reliability hardware used for packaging digital integrated circuits is described. The design transition from early prototypes to production hardware is covered and future plans are discussed. Interconnections techniques are described as well as connectors and related hardware available at both the microcircuit packaging and main-frame level. General applications information is also provided.

  8. Hermetic Seal Leak Detection Apparatus

    Science.gov (United States)

    Kelley, Anthony R. (Inventor)

    2013-01-01

    The present invention is a hermetic seal leak detection apparatus, which can be used to test for hermetic seal leaks in instruments and containers. A vacuum tight chamber is created around the unit being tested to minimize gas space outside of the hermetic seal. A vacuum inducing device is then used to increase the gas chamber volume inside the device, so that a slight vacuum is pulled on the unit being tested. The pressure in the unit being tested will stabilize. If the stabilized pressure reads close to a known good seal calibration, there is not a leak in the seal. If the stabilized pressure reads closer to a known bad seal calibration value, there is a leak in the seal. The speed of the plunger can be varied and by evaluating the resulting pressure change rates and final values, the leak rate/size can be accurately calculated.

  9. Standard semiconductor packaging for high-reliability low-cost MEMS applications

    Science.gov (United States)

    Harney, Kieran P.

    2005-01-01

    Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

  10. Physics of Failure Analysis of Xilinx Flip Chip CCGA Packages: Effects of Mission Environments on Properties of LP2 Underfill and ATI Lid Adhesive Materials

    Science.gov (United States)

    Suh, Jong-ook

    2013-01-01

    The Xilinx Virtex 4QV and 5QV (V4 and V5) are next-generation field-programmable gate arrays (FPGAs) for space applications. However, there have been concerns within the space community regarding the non-hermeticity of V4/V5 packages; polymeric materials such as the underfill and lid adhesive will be directly exposed to the space environment. In this study, reliability concerns associated with the non-hermeticity of V4/V5 packages were investigated by studying properties and behavior of the underfill and the lid adhesvie materials used in V4/V5 packages.

  11. The role of multiple barriers in assuring waste package reliability

    International Nuclear Information System (INIS)

    Bradford, R.M.

    1993-08-01

    Yucca Mountain in southwestern Nevada is being studied as a potential repository site for the permanent storage of high-level nuclear waste. Regulators have set performance standards that the potential repository must meet in order to obtain regulatory approval. Nuclear Regulatory Commission (NRC) regulations state that containment of radioactivity must be ''substantially complete'' for the first 1000 years after closure of the facility. Thereafter, the acceptable annual limit on releases is 1/100,000 of each radionuclide remaining in the inventory after 1000 years. To demonstrate that the potential facility is in compliance with the regulations, it is necessary to obtain some understanding of the probability distribution of the cumulative quantity of releases by certain time points. This paper will discuss the probability distribution of waste container lifetimes and how the understanding of this distribution will play a role in finding the distribution of the release quantities over time. It will be shown that, for reasonable assumptions about the process of barrier failure, the reliability of a multiple-barrier container can be achieved and demonstrated much more readily than a container consisting of a single barrier. The discussion will focus primarily on the requirement of substantially complete containment for the first 1000 years

  12. Method for hermetic electrical connections

    Science.gov (United States)

    Monroe, Saundra L [Tijeras, NM; Glass, S Jill [Albuquerque, NM; Stone, Ronnie G [Albuquerque, NM; Bond, Jamey T [Albuquerque, NM; Susan, Donald F [Albuquerque, NM

    2011-12-27

    A method of providing a hermetic, electrical connection between two electrical components by mating at least one metal pin in a glass-ceramic to metal seal connector to two electrical components, wherein the glass-ceramic to metal seal connector incorporates at least one metal pin encased (sealed) in a glass-ceramic material inside of a metal housing, with the glass-ceramic material made from 65-80% SiO.sub.2, 8-16% Li.sub.2O, 2-8% Al.sub.2O.sub.3, 1-5% P.sub.2O.sub.5, 1-8% K.sub.2O, 0.5-7% B.sub.2O.sub.3, and 0-5% ZnO. The connector retains hermeticity at temperatures as high as 700.degree. C. and pressures as high as 500 psi.

  13. Hermetically sealed superconducting magnet motor

    Science.gov (United States)

    DeVault, Robert C.; McConnell, Benjamin W.; Phillips, Benjamin A.

    1996-01-01

    A hermetically sealed superconducting magnet motor includes a rotor separated from a stator by either a radial gap, an axial gap, or a combined axial and radial gap. Dual conically shaped stators are used in one embodiment to levitate a disc-shaped rotor made of superconducting material within a conduit for moving cryogenic fluid. As the rotor is caused to rotate when the field stator is energized, the fluid is pumped through the conduit.

  14. Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

    Science.gov (United States)

    Ghaffaroam. Reza

    2014-01-01

    Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

  15. Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing

    CERN Document Server

    Liu, Sheng

    2011-01-01

    Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming ""test and try out"" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development.  In this book, Liu and Liu allow people

  16. Design and production of a hermetic bayonet isolation valve

    International Nuclear Information System (INIS)

    Fuerst, J.

    1993-05-01

    Fermilab is upgrading the Tevatron for lower temperature/higher beam energy operation. Portions of the satellite refrigeration system will operate below atmospheric pressure after the upgrade is complete. Contamination must be prevented by hermetically sealing the subatmospheric helium to air interfaces. Bayonet connections in the low pressure flow path require a reliable, leak tight isolation valve instead of the standard quarter turn ball valve. Design, development, and production of a new valve are described

  17. Molding compound trends in a denser packaging world: Qualification tests and reliability concerns

    Science.gov (United States)

    Nguyen, L. T.; Lo, R. H. Y.; Chen, A. S.; Belani, J. G.

    1993-12-01

    Molding compound development has traditionally been driven by the memory market, then subsequent applications filter down to other IC technologies such as logic, analog, and ASIC. However, this strategy has changed lately with the introduction of thin packages such as PQFP & TSOP. Rather than targeting a compound for a family of IC such as DRAM or SRAM, compound development efforts are now focused at specific classes of packages. The configurations of these thin packages impose new functional requirements that need to be revisited to provide the optimized combination of properties. The evolution of qualification tests mirrors the advances in epoxy and compounding technologies. From the first standard novolac-based epoxies of the 1970s to the latest 3(sup rd)-generation ultra-low stress materials, longer test times at increasingly harsher environments were achieved. This paper benchmarks the current reliability tests used by the electronic industry, examines those tests that affect and are affected by the molding compounds, discusses the relevance of accelerated testing, and addresses the major reliability issues facing current molding compound development efforts. Six compound-related reliability concerns were selected: moldability, package stresses, package cracking, halogen-induced intermetallic growth at bond pads, moisture-induced corrosion, and interfacial delamination. Causes of each failure type are surveyed and remedies are recommended. Accelerated tests are designed to apply to a limited quantity of devices, bias, or environmental conditions larger than usual ratings, to intensify failure mechanisms that would occur under normal operating conditions. The observed behavior is then extrapolated from the lot to the entire population. Emphasis is on compressing the time necessary to obtain reliability data. This approach has two main drawbacks. With increasingly complex devices, even accelerated tests are expensive. And with new technologies, it becomes

  18. Enabling More than Moore: Accelerated Reliability Testing and Risk Analysis for Advanced Electronics Packaging

    Science.gov (United States)

    Ghaffarian, Reza; Evans, John W.

    2014-01-01

    For five decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in miniaturization of electronics products-Moore's Law. Now, scaling hits a brick wall, a paradigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or ak.a "More than Moore". This paper presents packaging technology trends and accelerated reliability testing methods currently being practiced. Then, it presents industry status on key advanced electronic packages, factors affecting accelerated solder joint reliability of area array packages, and IPC/JEDEC/Mil specifications for characterizations of assemblies under accelerated thermal and mechanical loading. Finally, it presents an examples demonstrating how Accelerated Testing and Analysis have been effectively employed in the development of complex spacecraft thereby reducing risk. Quantitative assessments necessarily involve the mathematics of probability and statistics. In addition, accelerated tests need to be designed which consider the desired risk posture and schedule for particular project. Such assessments relieve risks without imposing additional costs. and constraints that are not value added for a particular mission. Furthermore, in the course of development of complex systems, variances and defects will inevitably present themselves and require a decision concerning their disposition, necessitating quantitative assessments. In summary, this paper presents a comprehensive view point, from technology to systems, including the benefits and impact of accelerated testing in offsetting risk.

  19. Packaging-induced failure of semiconductor lasers and optical telecommunications components

    Energy Technology Data Exchange (ETDEWEB)

    Sharps, J.A. [Corning Inc., NY (United States)

    1996-12-31

    Telecommunications equipment for field deployment generally have specified lifetimes of > 100,000 hr. To achieve this high reliability, it is common practice to package sensitive components in hermetic, inert gas environments. The intent is to protect components from particulate and organic contamination, oxidation, and moisture. However, for high power density 980 nm diode lasers used in optical amplifiers, the authors found that hermetic, inert gas packaging induced a failure mode not observed in similar, unpackaged lasers. They refer to this failure mode as packaging-induced failure, or PIF. PIF is caused by nanomole amounts of organic contamination which interact with high intensity 980 nm light to form solid deposits over the emitting regions of the lasers. These deposits absorb 980 nm light, causing heating of the laser, narrowing of the band gap, and eventual thermal runaway. The authors have found PIF is averted by packaging with free O{sub 2} and/or a getter material that sequesters organics.

  20. Demands placed on waste package performance testing and modeling by some general results on reliability analysis

    International Nuclear Information System (INIS)

    Chesnut, D.A.

    1991-09-01

    Waste packages for a US nuclear waste repository are required to provide reasonable assurance of maintaining substantially complete containment of radionuclides for 300 to 1000 years after closure. The waiting time to failure for complex failure processes affecting engineered or manufactured systems is often found to be an exponentially-distributed random variable. Assuming that this simple distribution can be used to describe the behavior of a hypothetical single barrier waste package, calculations presented in this paper show that the mean time to failure (the only parameter needed to completely specify an exponential distribution) would have to be more than 10 7 years in order to provide reasonable assurance of meeting this requirement. With two independent barriers, each would need to have a mean time to failure of only 10 5 years to provide the same reliability. Other examples illustrate how multiple barriers can provide a strategy for not only achieving but demonstrating regulatory compliance

  1. The Effect of Epoxy Molding Compound Floor Life to Reliability Performance and mold ability for QFN Package

    Science.gov (United States)

    Peanpunga, Udom; Ugsornrat, Kessararat; Thorlor, Panakamol; Sumithpibul, Chalermsak

    2017-09-01

    This research studied about an epoxy molding compound (EMC) floor life to reliability performance of integrated circuit (IC) package. Molding is the process for protecting the die of IC package form mechanical and chemical reaction from external environment by shaping EMC. From normal manufacturing process, the EMC is stored in the frozen at 5oC and left at around room temperature for aging time or floor life before molding process. The EMC floor life effect to its properties and reliability performance of IC package. Therefore, this work interested in varied the floor life of EMC before molding process to analyze properties of EMC such as spiral flow length, gelation time, and viscosity. In experiment, the floor life of EMC was varied to check the effect of its property to reliability performance. The EMC floor life were varied from 0 hours to 60 hours with a step of 12 hours and observed wire sweep, incomplete EMC, and delamination inside the packages for 3x3, 5x5 and 8x8 mm2 of QFN packages. The evaluation showed about clearly effect of EMC floor life to IC packaging reliability. EMC floor life is not any concern for EMC property, moldabilty, and reliability from 0 hours to 48 hours for molding process of 3x3,5x5 and 8x8 mm2 QFN packaging manufacturing

  2. Reliability of Ceramic Column Grid Array Interconnect Packages Under Extreme Temperatures

    Science.gov (United States)

    Ramesham, Rajeshuni

    2011-01-01

    A paper describes advanced ceramic column grid array (CCGA) packaging interconnects technology test objects that were subjected to extreme temperature thermal cycles. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide were assembled, inspected nondestructively, and, subsequently, subjected to ex - treme-temperature thermal cycling to assess reliability for future deep-space, short- and long-term, extreme-temperature missions. The test hardware consisted of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The package is 33 33 mm with a 27 27 array of 80%/20% Pb/Sn columns on a 1.27-mm pitch. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of the increasing number of thermal cycles. Several catastrophic failures were observed after 137 extreme-temperature thermal cycles, as per electrical resistance measurements, and then the tests were continued through 1,058 thermal cycles to corroborate and understand the test results. X-ray and optical inspection have been made after thermal cycling. Optical inspections were also conducted on the CCGA vs. thermal cycles. The optical inspections were conclusive; the x-ray images were not. Process qualification and assembly is required to optimize the CCGA assembly, which is very clear from the x-rays. Six daisy chains were open out of seven daisy chains, as per experimental test data reported. The daisy chains are open during the cold cycle, and then recover during the hot cycle, though some of them also opened during the hot thermal cycle..

  3. 49 CFR 172.312 - Liquid hazardous materials in non-bulk packagings.

    Science.gov (United States)

    2010-10-01

    ... offered or intended for transportation by aircraft, packages containing flammable liquids in inner... offered or intended for transportation by aircraft, packages containing flammable liquids in inner... hermetically sealed inner packagings. (6) Packages containing liquid infectious substances in primary...

  4. Performance and Reliability of Bonded Interfaces for High-Temperature Packaging (Presentation)

    Energy Technology Data Exchange (ETDEWEB)

    Devoto, D.

    2014-11-01

    The thermal performance and reliability of sintered-silver is being evaluated for power electronics packaging applications. This will be experimentally accomplished by the synthesis of large-area bonded interfaces between metalized substrates that will be subsequently subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)-stress intensity factor (K) analysis. The experiment is outlined, and the modeling approach is discussed.

  5. Hermetic compartments leak-tightness enhancement

    International Nuclear Information System (INIS)

    Murani, J.

    2000-01-01

    In connection with the enhancement of the nuclear safety of the Jaslovske Bohunice V-1 NPP actions for the increase of the leak tightness are performed. The reconstruction has been done in the following directions: hermetic compartments leak tightness enhancement; air lock installation; installation of air lock in SP 4 vent system; integrated leakage rate test to hermetic compartments with leak detection. After 'major' leaks on the hermetic boundary components had been eliminated, since 1994 works on a higher qualitative level began. The essence of the works consists in the detection and identification of leaks in the structural component of the hermetic boundary during the planned refueling outages. The results of the Small Reconstruction and gradual enhancement of leak tightness are presented

  6. Performance and Reliability of Bonded Interfaces for High-Temperature Packaging. Annual Report

    Energy Technology Data Exchange (ETDEWEB)

    DeVoto, Douglas [National Renewable Energy Lab. (NREL), Golden, CO (United States)

    2016-04-01

    Current generation automotive power electronics packages utilize silicon devices and lead-free solder alloys. To meet stringent technical targets for 2020 and beyond (for cost, power density, specific power, efficiency and reliability), wide-bandgap devices are being considered since they offer advantages such as operation at higher frequencies, voltages, and temperatures. Traditional power electronics packages must be redesigned to utilize the full potential of wide-bandgap devices, and the die- and substrate-attach layers are key areas where new material development and validation is required. Present solder alloys do not meet the performance requirements for these new package designs while also meeting cost and hazardous substance restrictions. Sintered silver (Ag) promises to meet the needs for die- and substrate-attach interfaces but synthesis optimization and reliability evaluation must be completed. Sintered Ag material was proposed as an alternative solution in power electronics packages almost 20 years back. However, synthesis pressure requirements up 40 MPa caused a higher complexity in the production process and more stringent flatness specifications for the substrates. Recently, several manufacturers have developed sintered Ag materials that require lower (3-5 MPa) or even no bonding pressures. Degradation mechanisms for these sintered Ag materials are not well known and need to be addressed. We are addressing these aspects to some extent in this project. We are developing generalized (i.e., independent of geometry) stress intensity factor versus cycles-to-failure relations for sintered Ag. Because sintered Ag is a relatively new material for automotive power electronics, the industry currently does not have a good understanding of recommended synthesis parameters or expected reliability under prescribed conditions. It is an important deliverable of this project to transfer findings to industry to eliminate barriers to using sintered Ag as a viable and

  7. Package

    Directory of Open Access Journals (Sweden)

    Arsić Zoran

    2013-01-01

    Full Text Available It is duty of the seller to pack the goods in a manner which assures their safe arrival and enables their handling in transit and at the place of destination. The problem of packing is relevant in two main respects. First of all the buyer is in certain circumstances entitled to refuse acceptance of the goods if they are not properly packed. Second, the package is relevant to calculation of price and freight based on weight. In the case of export trade, the package should conform to the legislation in the country of destination. The impact of package on environment is regulated by environment protection regulation of Republic if Serbia.

  8. Performance and Reliability of Bonded Interfaces for High-Temperature Packaging

    Energy Technology Data Exchange (ETDEWEB)

    Paret, Paul P [National Renewable Energy Laboratory (NREL), Golden, CO (United States)

    2017-08-02

    Sintered silver has proven to be a promising candidate for use as a die-attach and substrate-attach material in automotive power electronics components. It holds promise of greater reliability than lead-based and lead-free solders, especially at higher temperatures (>200 degrees C). Accurate predictive lifetime models of sintered silver need to be developed and its failure mechanisms thoroughly characterized before it can be deployed as a die-attach or substrate-attach material in wide-bandgap device-based packages. Mechanical characterization tests that result in stress-strain curves and accelerated tests that produce cycles-to-failure result will be conducted. Also, we present a finite element method (FEM) modeling methodology that can offer greater accuracy in predicting the failure of sintered silver under accelerated thermal cycling. A fracture mechanics-based approach is adopted in the FEM model, and J-integral/thermal cycle values are computed.

  9. Electric motor-transformer aggregate in hermetic objects of transport vehicles

    Science.gov (United States)

    Zabora, Igor

    2017-10-01

    The construction and features of operation for new electrical unit - electric motor-transformer aggregate (DTA) are considered. Induction motors are intended for operation in hermetic plants with extreme conditions surrounding gas, steam-to-gas and liquid environment at a high temperature (to several hundred of degrees). Main objective of spent researches is the substantiation of possibility reliable and effective electric power transform with electric machine means directly in hermetic objects with extreme conditions environment by means of new DTA. The principle and job analysis of new disk induction motors of block-module type are observed.

  10. Selenide isotope generator for the Galileo Mission: SIG/Galileo hermetic receptable test program final report

    International Nuclear Information System (INIS)

    Roedel, S.

    1979-06-01

    The purpose of the receptacle test program was to test various types of hermetically sealed electrical receptacles and to select one model as the spaceflight hardware item for SIG/Galileo thermoelectric generators. The design goal of the program was to qualify a hermetic seal integrity of less than or equal to 1 x 10 -9 std cc He/sec -atm at 400 0 F (204 0 C) and verify a reliability of 0.95 at a 50% confidence level for a flight mission in excess of 7 years

  11. Interface analysis of embedded chip resistor device package and its effect on drop shock reliability.

    Science.gov (United States)

    Park, Se-Hoon; Kim, Sun Kyoung; Kim, Young-Ho

    2012-04-01

    In this study, the drop reliability of an embedded passive package is investigated under JESD22-B111 condition. Chip resistors were buried in a PCB board, and it was electrically interconnected by electroless and electrolytic copper plating on a tin pad of a chip resistor without intermetallic phase. However tin, nickel, and copper formed a complex intermetallic phase, such as (Cu, Ni)6Sn5, (Cu, Ni)3Sn, and (Ni, Cu)3Sn2, at the via interface and via wall after reflow and aging. Since the amount of the tin layer was small compared with the solder joint, excessive intermetallic layer growth was not observed during thermal aging. Drop failures are always initiated at the IMC interface, and as aging time increases Cu-Sn-Ni IMC phases are transformed continuously due to Cu diffusion. We studied the intermetallic formation of the Cu via interface and simulated the stress distribution of drop shock by using material properties and board structure of embedded passive boards. The drop simulation was conducted according to the JEDEC standard. It was revealed that the crack starting point related to failure fracture changed due to intermetallic phase transformation along the via interface, and the position where failure occurs experimentally agrees well with our simulation results.

  12. Reliability of radioactive waste packages in ground repositories; Confiabilidade de embalados de rejeitos radioativos em repositorios proximos a superficie

    Energy Technology Data Exchange (ETDEWEB)

    Aguiar, Lais A.; Melo, P.F. Frutuoso e [Universidade Federal, Rio de Janeiro, RJ (Brazil). Coordenacao dos Programas de Pos-graduacao de Engenharia. Programa de Engenharia Nuclear]. E-mail: lais@con.ufrj.br; frutuoso@con.ufrj.br; Passos, Erivaldo; Alves, Antonio Sergio [ELETROBRAS Termonuclear S.A. (ELETRONUCLEAR), Rio de Janeiro, RJ (Brazil). Div. de Seguranca Nuclear]. E-mail: epassos@eletronuclear.gov.br; asergi@eletronuclear.gov.br

    2005-07-01

    This work aims to discuss the reliability of a great amount of radioactive packages containing low and medium activity material, due to the significance of these latter in the whole safe performance of a final disposal facility (repository). The package is an engineering barrier designed to retain the radioactive material during long time periods. The discussion is based on the use of a probability distribution allowing the best representation of the failure times of the packages, since this type of information is unavailable. Here, the model uses the exponential, normal, lognormal and Weibull distributions published data and existing, related designs in order to obtain estimated values for the reliability function. The study was developed for a radioactive package system by considering the retaining capacity of the solid matrix plus the metallic container. The results indicate that these packages, as a whole, are not enough to perform the safe retaining of the radioactive material for the envisaged time period. The conclusions of the study lead to the necessary use of a system of multiple engineering barriers for the safe containing of the radioactive material. (author)

  13. Challenges in the Packaging of MEMS

    Energy Technology Data Exchange (ETDEWEB)

    Malshe, A.P.; Singh, S.B.; Eaton, W.P.; O' Neal, C.; Brown, W.D.; Miller, W.M.

    1999-03-26

    The packaging of Micro-Electro-Mechanical Systems (MEMS) is a field of great importance to anyone using or manufacturing sensors, consumer products, or military applications. Currently much work has been done in the design and fabrication of MEMS devices but insufficient research and few publications have been completed on the packaging of these devices. This is despite the fact that packaging is a very large percentage of the total cost of MEMS devices. The main difference between IC packaging and MEMS packaging is that MEMS packaging is almost always application specific and greatly affected by its environment and packaging techniques such as die handling, die attach processes, and lid sealing. Many of these aspects are directly related to the materials used in the packaging processes. MEMS devices that are functional in wafer form can be rendered inoperable after packaging. MEMS dies must be handled only from the chip sides so features on the top surface are not damaged. This eliminates most current die pick-and-place fixtures. Die attach materials are key to MEMS packaging. Using hard die attach solders can create high stresses in the MEMS devices, which can affect their operation greatly. Low-stress epoxies can be high-outgassing, which can also affect device performance. Also, a low modulus die attach can allow the die to move during ultrasonic wirebonding resulting to low wirebond strength. Another source of residual stress is the lid sealing process. Most MEMS based sensors and devices require a hermetically sealed package. This can be done by parallel seam welding the package lid, but at the cost of further induced stress on the die. Another issue of MEMS packaging is the media compatibility of the packaged device. MEMS unlike ICS often interface with their environment, which could be high pressure or corrosive. The main conclusion we can draw about MEMS packaging is that the package affects the performance and reliability of the MEMS devices. There is a

  14. HIGH-DENSITY, BIO-COMPATIBLE, AND HERMETIC ELECTRICAL FEEDTHROUGHS USING EXTRUDED METAL VIAS

    Energy Technology Data Exchange (ETDEWEB)

    Shah, K G; Delima, T; Felix, S; Sheth, H; Tolosa, V; Tooker, A; Pannu, S S

    2012-03-28

    Implanted medical devices such as pacemakers and neural prosthetics require that the electronic components that power these devices are protected from the harsh chemical and biological environment of the body. Typically, the electronics are hermetically sealed inside a bio-compatible package containing feedthroughs that transmit electrical signals, while being impermeable to particles or moisture. We present a novel approach for fabricating one of the highest densities of biocompatible hermetic feedthroughs in alumina (Al{sub 2}O{sub 3}). Alumina substrates with laser machined vias of 200 {micro}m pitch were conformally metallized and lithographically patterned. Hermetic electrical feedthroughs were formed by extruding metal stud-bumps partially through the vias. Hermeticity testing showed leak rates better than 9 x 10{sup -10} torr-l/s. Based on our preliminary results and process optimization, this extruded metal via approach is a high-density, low temperature, cost-effective, and robust method of miniaturizing electrical feedthroughs for a wide range of implantable bio-medical device applications.

  15. HIGH-DENSITY, BIO-COMPATIBLE, AND HERMETIC ELECTRICAL FEEDTHROUGHS USING EXTRUDED METAL VIAS

    Energy Technology Data Exchange (ETDEWEB)

    Tooker, A; Shah, K; Tolosa, V; Sheth, H; Felix, S; Delima, T; Pannu, S

    2012-03-29

    Implanted medical devices such as pacemakers and neural prosthetics require that the electronic components that power these devices are protected from the harsh chemical and biological environment of the body. Typically, the electronics are hermetically sealed inside a bio-compatible package containing feedthroughs that transmit electrical signals, while being impermeable to particles or moisture. We present a novel approach for fabricating one of the highest densities of biocompatible hermetic feedthroughs in alumina (Al{sub 2}O{sub 3}). Alumina substrates with laser machined vias of 200 {mu}m pitch were conformally metallized and lithographically patterned. Hermetic electrical feedthroughs were formed by extruding metal studbumps partially through the vias. Hermeticity testing showed leak rates better than 9x10{sup -10} torr-l/s. Based on our preliminary results and process optimization, this extruded metal via approach is a high-density, low temperature, cost-effective, and robust method of miniaturizing electrical feedthroughs for a wide range of implantable bio-medical device applications.

  16. Packaging Concerns and Techniques for Large Devices: Challenges for Complex Electronics

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2010-01-01

    NASA is going to have to accept the use of non-hermetic packages for complex devices. There are a large number of packaging options available. Space application subjects the packages to stresses that they were probably not designed for (vacuum for instance). NASA has to find a way of having assurance in the integrity of the packages. There are manufacturers interested in qualifying non-hermetic packages to MIL-PRF-38535 Class V. Government space users are agreed that Class V should be for hermetic packages only. NASA is working on a new Class for non-hermetic packages for M38535 Appendix B, "Class Y". Testing for package integrity will be required but can be package specific as described by a Package Integrity Test Plan. The plan is developed by the manufacturer and approved by DSCC and government space.

  17. Characterization of integrated circuit packaging materials

    CERN Document Server

    Moore, Thomas

    1993-01-01

    Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.

  18. Glass-ceramic composition for hermetic seals

    International Nuclear Information System (INIS)

    Ballard, C.P. Jr.

    1979-01-01

    The invention relates to a glass-ceramic composition having a high fracture strength adaptable for hermetically sealing to chromium bearing iron or nickel base alloys at temperatures of between about 950 0 C to about 1100 0 C to form a hermetically sealed insulator body, comprising from about 55 to about 65 weight percent SiO 2 , from about 0 to about 5 weight percent Al 2 O 3 , from about 6 to about 11 weight % Li 2 O, from about 25 to about 32 weight percent BaO, from about 0.5 to about 1.0 weight percent CoO and from about 1.5 to about 3.5 weight percent P 2 O 5

  19. Glass-ceramic composition for hermetic seals

    Science.gov (United States)

    Ballard, Jr., Clifford P.

    1979-01-01

    The invention relates to a glass-ceramic composition having a high fracture strength adaptable for hermetically sealing to chromium bearing iron or nickel base alloys at temperatures of between about 950.degree. C to about 1100.degree. C to form a hermetically sealed insulator body, comprising from about 55 to about 65 weight percent SiO.sub.2, from about 0 to about 5 weight percent Al.sub.2 O.sub.3, from about 6 to about 11 weight % Li.sub.2 O, from about 25 to about 32 weight percent BaO, from about 0.5 to about 1.0 weight percent CoO and from about 1.5 to about 3.5 weight percent P.sub.2 O.sub.5.

  20. Evaluation of Polymer Hermetically Sealed Tantalum Capacitors

    Science.gov (United States)

    Teverovsky, Alexander A.

    2014-01-01

    Polymer cathode tantalum capacitors have lower ESR (equivalent series resistance) compared to other types of tantalum capacitors and for this reason have gained popularity in the electronics design community. Their use allows improved performance of power supply systems along with substantial reduction of size and weight of the components used. However, these parts have poor thermal stability and can degrade in humid environments. Polymer hermetically sealed (PHS) capacitors avoid problems related to environmental degradation of molded case parts and can potentially replace current wet and solid hermetically sealed capacitors. In this work, PHS capacitors manufactured per DLA LAM DWG#13030 are evaluated for space applications. Several lots of capacitors manufactured over period from 2010 to 2014 were tested for the consistency of performance, electrical and thermal characteristics, highly accelerated life testing, and robustness under reverse bias and random vibration conditions. Special attention was given to analysis of leakage currents and the effect of long-term high temperature storage on capacitors in as is condition and after hermeticity loss. The results show that PHS capacitors might be especially effective for low-temperature applications or for system requiring a cold start-up. Additional screening and qualification testing have been recommended to assure the necessary quality of capacitors for space projects.

  1. Device for hermetically sealing the mouth of a well

    Energy Technology Data Exchange (ETDEWEB)

    Rastorguyev, M.A.; Prokopov, O.I.; Sharafutdinov, I.G.

    1982-01-01

    The device for hermetically sealing the mouth of a well, which contains a body installed between upper and lower flanges with a preventer, which includes a shut off element and hydraulic drive cylinders and a mechanism for automatic operation of the preventer. In order to ensure the reliable closure of the well with destruction of the above ground equipment, the mechanism for automatic operation of the preventer is made in the form of a branch pipe, linked withthe cavity of the upper flange, in which a spring loaded piston with a rod is installed, and a slide installed in the cylinder, whichis rigidly linked with the rod and is made with turnings. Here, the cylinder has communication with the atmosphere, while the cavity of the lower flange through the turnings of the slide is linked with the above piston and below piston spaces of the preventer's hydraulic cylinders.

  2. Modular packaging concept for MEMS and MOEMS

    Science.gov (United States)

    Stenchly, Vanessa; Reinert, Wolfgang; Quenzer, Hans-Joachim

    2017-11-01

    Wherever technical systems detect objects in their environment or interact with people, optical devices may play an important role. Light can be relatively easily produced and spatially and temporally modulated. Laser can project sharp images over long distances or cut materials in short distances. Depending on the wavelength an invisible scanning in near infrared for gesture recognition is possible as well as a projection of brilliant colour images. For several years, the Fraunhofer ISIT develops Opto-Packaging processes based on the viscous reshaping of glass wafers: First, hermetically sealed laser micro-mirror scanners WLP with inclined windows deflect in the central light reflex of the window out of the image area. Second, housing with lateral light exit permits hermetic sealing of edge-emitting lasers for highest reliability and durability. Such systems are currently experiencing an extremely high interest of the industry in all segments, from consumer to automotive through to materials processing. Our modular Opto-Packaging platform enables fast product developments. Housing for opto mechanical MEMS devices are equipped with inclined windows to minimize distortion, stray light and reflection losses. The hot viscous glass forming technology is also applied to functionalized substrate wafers which possess areas with high heat dissipation in addition to thermally insulating areas. Electrical contacts may be realized with metal filled vias or TGV (Through Glass Vias). The modular system reduces the development times for new, miniaturized optical systems so that manufacturers can focus on the essentials in their development, namely their product functionalities.

  3. Reliability and validity enhancement: a treatment package for increasing fidelity of self-report.

    Science.gov (United States)

    Bornstein, P H; Hamilton, S B; Miller, R K; Quevillon, R P; Spitzform, M

    1977-07-01

    This study investigated the effects of reliability and validity "enhancers" on fidelity of self-report data in an analogue therapy situation. Under the guise of a Concentration Skills Training Program, 57 Ss were assigned randomly to one of the following conditions: (a) Reliability Enhancement; (b) Truth Talk; (c) No Comment Control. Results indicated significant differences among groups (p less than .05). In addition, tests of multiple comparisons revealed that Reliability Enhancement was significantly different from Truth Talk in occurrences of unreliability (p less than .05). These findings are discussed in light of the increased reliance on self-report data in behavioral intervention, and recommendations are made for future research.

  4. Comprehensive model of a hermetic reciprocating compressor

    Science.gov (United States)

    Yang, B.; Ziviani, D.; Groll, E. A.

    2017-08-01

    A comprehensive simulation model is presented to predict the performance of a hermetic reciprocating compressor and to reveal the underlying mechanisms when the compressor is running. The presented model is composed of sub-models simulating the in-cylinder compression process, piston ring/journal bearing frictional power loss, single phase induction motor and the overall compressor energy balance among different compressor components. The valve model, leakage through piston ring model and in-cylinder heat transfer model are also incorporated into the in-cylinder compression process model. A numerical algorithm solving the model is introduced. The predicted results of the compressor mass flow rate and input power consumption are compared to the published compressor map values. Future work will focus on detailed experimental validation of the model and parametric studies investigating the effects of structural parameters, including the stroke-to-bore ratio, on the compressor performance.

  5. Influence of interconnection on the long-term reliability of UV LED packages

    Science.gov (United States)

    Nieland, S.; Mitrenga, D.; Karolewski, D.; Brodersen, O.; Ortlepp, T.

    2017-02-01

    High power LEDs have conquered the mass market in recent years. Besides the main development focus to achieve higher productivity in the field of visible semiconductor LED processing, the wavelength range is further enhanced by active research and development in the direction of UVA / UVB / UVC. UVB and UVC LEDs are new and promising due to their numerous advantages. UV LEDs emit in a near range of one single emission peak with a width (FWHM) below 15 nm compared to conventional mercury discharge lamps and xenon sources, which show broad spectrums with many emission peaks over a wide range of wavelengths. Furthermore, the UV LED size is in the range of a few hundred microns and offers a high potential of significant system miniaturization. Of course, LED efficiency, lifetime and output power have to be increased [1]. Lifetime limiting issues of UVB/UVC-LED are the very high thermal stress in the chip resulting from the higher forward voltages (6-10 V @ 350 mA), the lower external quantum efficiency, below 10 % (most of the power disappears as heat), and the thermal resistance Rth of conventional LED packages being not able to dissipate these large amounts of heat for spreading. Beside the circuit boards and submounts which should have maximum thermal conductivity, the dimension of contacts as well as the interconnection of UV LED to the submount/package determinates the resolvable amount of heat [2]. In the paper different innovative interconnection techniques for UVC-LED systems will be discussed focused on the optimization of thermal conductivity in consideration of the assembly costs. Results on thermal simulation for the optimal contact dimensions and interconnections will be given. In addition, these theoretical results will be compared with results on electrical characterization as well as IR investigations on real UV LED packages in order to give recommendations for optimal UV LED assembly.

  6. Mortality of insects and quality of maize grains in hermetic and non-hermetic storage

    Directory of Open Access Journals (Sweden)

    Priscila C. Viebrantz

    2016-05-01

    Full Text Available ABSTRACT Due to the need to improve the quality and safety of foods, chemical methods used to control grain pests have been replaced by alternative methods. For example, modified atmosphere within the storage units has been used. Therefore, the objective was to evaluate maize grain quality and mortality of insects of the species Sitophilus zeamais and Tribolium castaneum in hermetic and non-hermetic environments for 50 days of storage. The hermetic units consisted of polyethylene "bags" with capacity for 60 kg. A cage with 20 adults of each species and 200 g of maize was placed inside each unit. The oxygen level was quantified every five days. Evaluations of insect mortality and survival occurred at 10, 20, 30, 40 and 50 days of storage. At 0, 30 and 50 days, density, moisture and fungal incidence analyses were conducted. The airtight system is efficient in the control of insects, with satisfactory mortality values for both species. Insects favor the development of fungi during the storage, regardless of the storage system.

  7. Performance and Reliability of Bonded Interfaces for High-temperature Packaging: Annual Progress Report

    Energy Technology Data Exchange (ETDEWEB)

    DeVoto, Douglas J. [National Renewable Energy Laboratory (NREL), Golden, CO (United States)

    2017-10-19

    As maximum device temperatures approach 200 °Celsius, continuous operation, sintered silver materials promise to maintain bonds at these high temperatures without excessive degradation rates. A detailed characterization of the thermal performance and reliability of sintered silver materials and processes has been initiated for the next year. Future steps in crack modeling include efforts to simulate crack propagation directly using the extended finite element method (X-FEM), a numerical technique that uses the partition of unity method for modeling discontinuities such as cracks in a system.

  8. Hermetic Seal Leak Detection Apparatus with Variable Size Test Chamber

    Science.gov (United States)

    Kelley, Anthony R. (Inventor)

    2015-01-01

    The present invention is a versatile hermetic seal leak detection apparatus for testing hermetically sealed containers and devices for leaks without the need to create a custom or specially manufactured testing chamber conforming to the dimensions of the specific object under test. The size of the testing chamber may be mechanically adjusted by the novel use of bellows to reduce and optimize the amount of gas space in a test chamber which surrounds the hermetically sealed object under test. The present invention allows the size of the test chamber to be selectively adjusted during testing to provide an optimum test chamber gas space. The present invention may be further adapted to isolate and test specific portions of the hermetically sealed object under test for leaks.

  9. Small variable speed hermetic reciprocating compressors for domestic refrigerators

    DEFF Research Database (Denmark)

    Rasmussen, Bjarne D.

    1996-01-01

    This paper contains both a theoretical and experimental investigation of some of the fundamental characteristics of a smal variable speed hermetic reciprocating compressor intended for application in domestic refrigeration. The results of a previously published simulation model for variable speed...

  10. Increasing the reliability of production schedules in a pharmaceutical packaging department.

    Science.gov (United States)

    Pacciarelli, Dario; D'Ariano, Andrea

    2012-12-01

    This paper studies quantitative methods for evaluating the potential benefits of introducing new advanced tracking technologies in the pharmaceutical industry with special reference to radio frequency identification (RFID). RFID technology is an effective way for increasing the quality of the data that are used to generate production schedules, but there is a lack of scientific research to quantify the return on investment that can be achieved in practice. In this work, we distinguish two major sources of data unreliability: one is the inherent stochasticity of operations, which cannot be reduced by RFID, and the other one is the data estimation error, which can be significantly reduced by RFID. We focus on the marginal contribution of the latter quantity to the productivity of the packaging department of a pharmaceutical plant, propose a systematic method for assessing this impact and discuss its implementation in a practical test case. Our results confirm that advanced tracking technologies in combination with effective scheduling procedures show a significant potential for improving productivity. Extensions to other production environments and their issues associated with scheduling problems are also discussed.

  11. Reliability and accuracy of three imaging software packages used for 3D analysis of the upper airway on cone beam computed tomography images.

    Science.gov (United States)

    Chen, Hui; van Eijnatten, Maureen; Wolff, Jan; de Lange, Jan; van der Stelt, Paul F; Lobbezoo, Frank; Aarab, Ghizlane

    2017-08-01

    The aim of this study was to assess the reliability and accuracy of three different imaging software packages for three-dimensional analysis of the upper airway using CBCT images. To assess the reliability of the software packages, 15 NewTom 5G ® (QR Systems, Verona, Italy) CBCT data sets were randomly and retrospectively selected. Two observers measured the volume, minimum cross-sectional area and the length of the upper airway using Amira ® (Visage Imaging Inc., Carlsbad, CA), 3Diagnosys ® (3diemme, Cantu, Italy) and OnDemand3D ® (CyberMed, Seoul, Republic of Korea) software packages. The intra- and inter-observer reliability of the upper airway measurements were determined using intraclass correlation coefficients and Bland & Altman agreement tests. To assess the accuracy of the software packages, one NewTom 5G ® CBCT data set was used to print a three-dimensional anthropomorphic phantom with known dimensions to be used as the "gold standard". This phantom was subsequently scanned using a NewTom 5G ® scanner. Based on the CBCT data set of the phantom, one observer measured the volume, minimum cross-sectional area, and length of the upper airway using Amira ® , 3Diagnosys ® , and OnDemand3D ® , and compared these measurements with the gold standard. The intra- and inter-observer reliability of the measurements of the upper airway using the different software packages were excellent (intraclass correlation coefficient ≥0.75). There was excellent agreement between all three software packages in volume, minimum cross-sectional area and length measurements. All software packages underestimated the upper airway volume by -8.8% to -12.3%, the minimum cross-sectional area by -6.2% to -14.6%, and the length by -1.6% to -2.9%. All three software packages offered reliable volume, minimum cross-sectional area and length measurements of the upper airway. The length measurements of the upper airway were the most accurate results in all software packages. All

  12. Reliability

    OpenAIRE

    Condon, David; Revelle, William

    2017-01-01

    Separating the signal in a test from the irrelevant noise is a challenge for all measurement. Low test reliability limits test validity, attenuates important relationships, and can lead to regression artifacts. Multiple approaches to the assessment and improvement of reliability are discussed. The advantages and disadvantages of several different approaches to reliability are considered. Practical advice on how to assess reliability using open source software is provided.

  13. The Hermetic Synchronous Engines for Pumping the Aggressive Liquids

    Directory of Open Access Journals (Sweden)

    Tudor Ambros

    2014-09-01

    Full Text Available The paper covers brief information about asynchronous and synchronous engines used for driving centrifugal pumps. It is argued the fact that asynchronous engines do not, actually, satisfy the requirements for hermetic engines designed for pumping radioactive and chemical liquids, because they possess low technical and economic indexes. Modification of rotor construction of these engines gives the possibility to increase these indexes. The shortcut rotor was replaced with a ferromagnetic rotor in hermetic asynchronous engine serially produced and permanent magnets had been inserted into its body. Different synchronous engine constructions with permanent magnets had been analyzed and developed, which operating characteristics had been compared with those of the asynchronous one.

  14. Variable speed hermetic reciprocating compressors for domestic refrigerators

    DEFF Research Database (Denmark)

    Rasmussen, Bjarne D.

    1998-01-01

    This article describes the results of a both theoretical and experimental investigation of the performance of variable speed hermetic reciprocating compressors for domestic refrigerators. The investigation was performed as a part of a larger research project with the objective of reducing...

  15. New hermetic sealing material for vacuum brazing of stainless steels

    International Nuclear Information System (INIS)

    Hildebrandt, S; Wiehl, G; Silze, F

    2016-01-01

    For vacuum brazing applications such as in vacuum interrupter industry Hermetic Sealing Materials (HSM) with low partial pressure are widely used. AgCu28 dominates the hermetic sealing market, as it has a very good wetting behavior on copper and metallized ceramics. Within recent decades wetting on stainless steel has become more and more important. However, today the silver content of HSMs is more in focus than in the past decades, because it has the biggest impact on the material prices. Umicore Technical Materials has developed a new copper based HSM, CuAg40Ga10. The wettability on stainless steel is significantly improved compared to AgCu28 and the total silver content is reduced by almost 44%. In this article the physical properties of the alloy and its brazed joints will be presented compared to AgCu28. (paper)

  16. Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cutting

    Science.gov (United States)

    Farisi, Muhammad Salman Al; Hirano, Hideki; Frömel, Jörg; Tanaka, Shuji

    2017-01-01

    In this paper, a novel wafer-level hermetic packaging technology for heterogeneous device integration is presented. Hermetic sealing is achieved by low-temperature thermo-compression bonding using electroplated Au micro-sealing frame planarized by single-point diamond fly-cutting. The proposed technology has significant advantages compared to other established processes in terms of integration of micro-structured wafer, vacuum encapsulation and electrical interconnection, which can be achieved at the same time. Furthermore, the technology is also achievable for a bonding frame width as narrow as 30 μm, giving it an advantage from a geometry perspective, and bonding temperatures as low as 300 °C, making it advantageous for temperature-sensitive devices. Outgassing in vacuum sealed cavities is studied and a cavity pressure below 500 Pa is achieved by introducing annealing steps prior to bonding. The pressure of the sealed cavity is measured by zero-balance method utilizing diaphragm-structured bonding test devices. The leak rate into the packages is determined by long-term sealed cavity pressure measurement for 1500 h to be less than 2.0× {{10}-14} Pa m3s-1. In addition, the bonding shear strength is also evaluated to be higher than 100 MPa.

  17. Users Guide on Scaled CMOS Reliability: NASA Electronic Parts and Packaging (NEPP) Program Office of Safety and Mission Assurance

    Science.gov (United States)

    White, Mark; Cooper, Mark; Johnston, Allan

    2011-01-01

    Reliability of advanced CMOS technology is a complex problem that is usually addressed from the standpoint of specific failure mechanisms rather than overall reliability of a finished microcircuit. A detailed treatment of CMOS reliability in scaled devices can be found in Ref. 1; it should be consulted for a more thorough discussion. The present document provides a more concise treatment of the scaled CMOS reliability problem, emphasizing differences in the recommended approach for these advanced devices compared to that of less aggressively scaled devices. It includes specific recommendations that can be used by flight projects that use advanced CMOS. The primary emphasis is on conventional memories, microprocessors, and related devices.

  18. The manufacturing engineering of a hermetic cast fiber calorimeter

    International Nuclear Information System (INIS)

    Coan, T.; Higby, D.; Sulak, L.; Worstell, W.; Winn, D.; Ayer, F.; Elder, C.; Sullivan, D.

    1990-01-01

    The authors have made the first pass at designing and engineering a cast lead calorimeter with a rapidity coverage to η = 5.5. The design preserves detector hermeticity. Plastic scintillating fibers provide a fast, hadronically compensated, high-resolution device. A lead-eutectic, which melts below the softening point of the plastic, provides an easily manufactured high Z absorber. This calorimeter, designed with the TEXAS SSC detector as a baseline, is easily scaled in size and in segmentation without major design changes

  19. Improvement of level-1 PSA computer code package - Modeling and analysis for dynamic reliability of nuclear power plants

    Energy Technology Data Exchange (ETDEWEB)

    Lee, Chang Hoon; Baek, Sang Yeup; Shin, In Sup; Moon, Shin Myung; Moon, Jae Phil; Koo, Hoon Young; Kim, Ju Shin [Seoul National University, Seoul (Korea, Republic of); Hong, Jung Sik [Seoul National Polytechnology University, Seoul (Korea, Republic of); Lim, Tae Jin [Soongsil University, Seoul (Korea, Republic of)

    1996-08-01

    The objective of this project is to develop a methodology of the dynamic reliability analysis for NPP. The first year`s research was focused on developing a procedure for analyzing failure data of running components and a simulator for estimating the reliability of series-parallel structures. The second year`s research was concentrated on estimating the lifetime distribution and PM effect of a component from its failure data in various cases, and the lifetime distribution of a system with a particular structure. Computer codes for performing these jobs were also developed. The objectives of the third year`s research is to develop models for analyzing special failure types (CCFs, Standby redundant structure) that were nor considered in the first two years, and to complete a methodology of the dynamic reliability analysis for nuclear power plants. The analysis of failure data of components and related researches for supporting the simulator must be preceded for providing proper input to the simulator. Thus this research is divided into three major parts. 1. Analysis of the time dependent life distribution and the PM effect. 2. Development of a simulator for system reliability analysis. 3. Related researches for supporting the simulator : accelerated simulation analytic approach using PH-type distribution, analysis for dynamic repair effects. 154 refs., 5 tabs., 87 figs. (author)

  20. Death by desiccation: Effects of hermetic storage on cowpea bruchids

    KAUST Repository

    Murdock, Larry L.

    2012-04-01

    When cowpea grain is stored in airtight containers, destructive populations of the cowpea bruchid (. Callosobruchus maculatus) don\\'t develop even though the grain put into the store is already infested with sufficient . C. maculatus to destroy the entire store within a few months. The surprising effectiveness of hermetic storage for preserving grain against insect pests has long been linked with the depletion of oxygen in the hermetic container and with the parallel rise in carbon dioxide. With . C. maculatus, low oxygen (hypoxia) leads to cessation of larval feeding activity, whereas elevated levels of carbon dioxide (hypercarbia) have little or no effect on feeding. Cessation of feeding arrests the growth of the insects, which don\\'t mature and don\\'t reproduce. As a result, population growth ceases and damaging infestations don\\'t develop. . C. maculatus eggs, larvae, and pupae subjected to hypoxia eventually die after exposures of various duration. The cause of death is desiccation resulting from an inadequate supply of water. We demonstrate that blocking the supply of oxygen interdicts the main supply of water for . C. maculatus. This leads to inactivity, cessation of population growth, desiccation and eventual death. © 2012 Elsevier Ltd.

  1. Performance enhancement of hermetic compressor using phase change materials

    Science.gov (United States)

    Mahmoud, I. M.; Rady, M. A.; Huzayyin, A. S.

    2015-08-01

    The present study is motivated by the need for the research of simple measures for increasing energy efficiency of hermetic compressor. The measure is the application of phase change materials for performance enhancement. The first experimental study should be guide for choice of PCM. It has been performed to investigate the effects of thermostat setting temperature on the performance of hermetic compressor. The effects of thermostat setting temperature with and without load on power consumption have been analyzed. Performance enhancement using phase change materials (PCMs) has been studied by employing a phase change material Rubitherm-42 (RT-42) on the top surface of compressor. Choice of PCM material is based on basic compressor performance measured in the first part of the present study. Experiments have been carried out for different load values and different quantities of PCM. The quantity and phase change characteristic of PCM are essential parameters that determine the percentage of performance enhancement in term of energy consumption. Reduction of energy consumption of about 10% has been achieved in the present study by using PCM. The present study shows that how to reduce the electrical power consumption to enhance compressor heat dissipation method to improve efficiency.

  2. Reliability of offshore wind power production under extreme wind conditions. Deliverable D 9.5. Work Package 9: Electrical grid

    DEFF Research Database (Denmark)

    Cutululis, Nicolaos Antonio; Zeni, Lorenzo

    years, with each year simulated with five random seeds, leading to a total of 25 annual wind power time series for six large offshore wind farms, summing up to a little over 330 wind turbines. Two storm control strategies were used. The analysis involved several aspects inspired from reliability studies....... The aspects investigated are storm events occurrences and durations, storm control strategy impact on the capacity factor (lost production), the loss of production (power produced from wind drops below a certain threshold due to high wind speeds and storm controller) and finally, the wind power production......Reliability of offshore wind production under extreme wind conditions was investigated in this report. The wind power variability from existing and future large offshore wind farms in Western Denmark were simulated using the Correlated Wind model developed at Risø. The analysis was done for five...

  3. reliability reliability

    African Journals Online (AJOL)

    eobe

    Corresponding author, Tel: +234-703. RELIABILITY .... V , , given by the code of practice. However, checks must .... an optimization procedure over the failure domain F corresponding .... of Concrete Members based on Utility Theory,. Technical ...

  4. 76 FR 11891 - Temperature-Indicating Devices; Thermally Processed Low-Acid Foods Packaged in Hermetically...

    Science.gov (United States)

    2011-03-03

    ... and electronic instruments. According to the comment, moisture is an important environmental concern with electronic instruments. The comment noted that condensation on a computer board or wiring...

  5. Wafer level hermetic packaging based on Cu-Sn isothermal solidification technology

    International Nuclear Information System (INIS)

    Cao Yuhan; Luo Le

    2009-01-01

    A novel wafer level bonding method based on Cu-Sn isothermal solidification technology is established. A multi-layer sealing ring and the bonding processing are designed, and the amount of solder and the bonding parameters are optimized based on both theoretical and experimental results. Verification shows that oxidation of the solder layer, voids and the scalloped-edge appearance of the Cu 6 Sn 5 phase are successfully avoided. An average shear strength of 19.5 MPa and an excellent leak rate of around 1.9 x 10 -9 atm cc/s are possible, meeting the demands of MIL-STD-883E. (semiconductor technology)

  6. THE STATE AND PERSPECTIVE OF HERMETIZATION OF UNDERGROUND STRUCTURES WITH USE OF RUBBER SEALANTS

    Directory of Open Access Journals (Sweden)

    V. I. Leshchenko

    2010-03-01

    Full Text Available The works on creation of effective rubber sealants for hermetic sealing of joints of underground structures from modular ferroconcrete and pig-iron, including tunnel elements for the underground, are carried out.

  7. Comprehensive 3D-elastohydrodynamic simulation of hermetic compressor crank drive

    Science.gov (United States)

    Posch, S.; Hopfgartner, J.; Berger, E.; Zuber, B.; Almbauer, R.; Schöllauf, P.

    2017-08-01

    Mechanical, electrical and thermodynamic losses form the major loss mechanisms of hermetic compressors for refrigeration application. The present work deals with the investigation of the mechanical losses of a hermetic compressor crank drive. Focus is on 3d-elastohydrodynamic (EHD) modelling of the journal bearings, piston-liner contact and piston secondary motion in combination with multi-body and structural dynamics of the crank drive elements. A detailed description of the model development within the commercial software AVL EXCITE Power Unit is given in the work. The model is used to create a comprehensive analysis of the mechanical losses of a hermetic compressor. Further on, a parametric study concerning oil viscosity and compressor speed is carried out which shows the possibilities of the usage of the model in the development process of hermetic compressors for refrigeration application. Additionally, the usage of the results in an overall thermal network for the determination of the thermal compressor behaviour is discussed.

  8. High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

    Science.gov (United States)

    Shalkhauser, K. A.; Li, K.; Shih, Y. C.

    1992-01-01

    Packaging schemes are developed that provide low-loss, hermetic enclosure for enhanced monolithic microwave and millimeter-wave integrated circuits. These package schemes are based on a fused quartz substrate material offering improved RF performance through 44 GHz. The small size and weight of the packages make them useful for a number of applications, including phased array antenna systems. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices.

  9. Glass-ceramic hermetic seals to high thermal expansion metals

    Science.gov (United States)

    Kramer, D.P.; Massey, R.T.

    1987-04-28

    A process for forming glass-ceramic materials from an alkaline silica-lithia glass composition comprising 60-72 mole-% SiO/sub 2/, 18-27 mole-% Li/sub 2/O, 0-5 mole-% Al/sub 2/O/sub 3/, 0-6 mole-% K/sub 2/O, 0-3 mole-% B/sub 2/O/sub 3/, and 0.5-2.5 mole-% P/sub 2/O/sub 5/, which comprises heating said glass composition at a first temperature within the 950-1050/degree/C range for 5-60 minutes, and then at a devitrification temperature within the 700-900/degree/C range for about 5-300 minutes to obtain a glass-ceramic having a thermal expansion coefficient of up to 210 x 10/sup /minus/7///degree/C. These ceramics form strong, hermetic seals with high expansion metals such as stainless steel alloys. An intermediate nucleation heating step conducted at a temperature within the range of 675-750/degree/C for 10-120 minutes may be employed between the first stage and the devitrification stage. 1 fig., 2 tabs.

  10. Highly-hermetic feedthrough fiber pigtailed circular TO-can electro-optic sensor for avionics applications

    Science.gov (United States)

    Lauzon, Jocelyn; Leduc, Lorrain; Bessette, Daniel; Bélanger, Nicolas

    2012-06-01

    Electro-optic sensors made of lasers or photodetectors assemblies can be associated with a window interface. In order to use these sensors in an avionics application, this interface has to be set on the periphery of the aircraft. This creates constraints on both the position/access of the associated electronics circuit card and the aircraft fuselage. Using an optical fiber to guide the light signal to a sensor being situated inside the aircraft where electronics circuit cards are deployed is an obvious solution that can be readily available. Fiber collimators that adapt to circular TO-can type window sensors do exist. However, they are bulky, add weight to the sensor and necessitate regular maintenance of the optical interface since both the sensor window and the collimator end-face are unprotected against contamination. Such maintenance can be complex since the access to the electronics circuit card, where the sensor is sitting, is usually difficult. This interface alignment can also be affected by vibrations and mechanical shocks, thus impacting sensor performances. As a solution to this problem, we propose a highly-hermetic feedthrough fiber pigtailed circular TO-can package. The optical element to optical fiber interface being set inside the hermetic package, there is no risk of contamination and thus, such a component does not require any maintenance. The footprint of these sensors being identical to their window counterparts, they offer drop-in replacement opportunities. Moreover, we have validated such packaged electro-optic sensors can be made to operate between -55 to 115°C, sustain 250 temperature cycles, 1500G mechanical shocks, 20Grms random vibrations without any performance degradations. Their water content is much smaller than the 0.5% limit set by MIL-STD-883, Method 1018. They have also been verified to offer a fiber pigtail strain relief resistance over 400g. Depending on the electronics elements inside these sensors, they can be made to have a

  11. Mechanical Robustness and Hermeticity Monitoring for MEMS Thin Film Encapsulation

    NARCIS (Netherlands)

    Santagata, F.

    2011-01-01

    Many Micro-Electro-Mechanical-Systems (MEMS) require encapsulation, to prevent delicate sensor structures being exposed to external perturbations such as dust, humidity, touching, and gas pressure. An upcoming and cost-effective way of encapsulation is zero-level packaging or thin-film

  12. Determination of the oil distribution in a hermetic compressor using numerical simulation

    Science.gov (United States)

    Posch, S.; Hopfgartner, J.; Berger, E.; Zuber, B.; Almbauer, R.; Schöllauf, P.

    2017-08-01

    In addition to the reduction of friction the oil in a hermetic compressor is very important for the transfer of heat from hot parts to the compressor shell. The simulation of the oil distribution in a hermetic reciprocating compressor for refrigeration application is shown in the present work. Using the commercial Computational Fluid Dynamics (CFD) software ANSYS Fluent, the oil flow inside the compressor shell from the oil pump outlet to the oil sump is calculated. A comprehensive overview of the used models and the boundary conditions is given. After reaching steady-state conditions the oil covered surfaces are analysed concerning heat transfer coefficients. The gained heat transfer coefficients are used as input parameters for a thermal model of a hermetic compressor. An increase in accuracy of the thermal model with the simulated heat transfer coefficients compared to values from literature is shown by model validation with experimental data.

  13. Interconnect mechanisms in microelectronic packaging

    Science.gov (United States)

    Roma, Maria Penafrancia C.

    alloy showed differences in adhesion strength and IMC formation. Bond strength by wire pull testing showed the 95Ag alloy with higher values while shear bond testing showed the 88Ag higher bond strength. Use of Cu pillars in flip chips and eutectic bonding in wafer level chip scale packages are direct consequences of diminishing interconnect dimension as a result of the drive for miniaturization. The combination of Cu-Sn interdiffusion, Kirkendall mechanism and heterogeneous vacancy precipitation are the main causes of IMC and void formation in Cu pillar - Sn solder - Cu lead frame sandwich structure. However, adding a Ni barrier agent showed less porous IMC layer as well as void formation as a result of the modified Cu and Sn movement well as the void formation. Direct die to die bonding using Al-Ge eutectic bonds is necessary when 3D integration is needed to reduce the footprint of a package. Hermeticity and adhesion strength are a function of the Al/Ge thickness ratio, bonding pressure, temperature and time. Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) allowed imaging of interfacial microstructures, porosity, grain morphology while Scanning Transmission Electron microscope (STEM) provided diffusion profile and confirmed interdiffusion. Ion polishing technique provided information on porosity and when imaged using backscattered mode, grain structure confirmed mechanical deformation of the bonds. Measurements of the interfacial bond strength are made by wire pull tests and ball shear tests based on existing industry standard tests. However, for the Al-Ge eutectic bonds, no standard strength is available so a test is developed using the stud pull test method using the Dage 4000 Plus to yield consistent results. Adhesion strengths of 30-40 MPa are found for eutectic bonded packages however, as low as 20MPa was measured in low temperature bonded areas.

  14. Integrated microsystems packaging approach with LCP

    Science.gov (United States)

    Jaynes, Paul; Shacklette, Lawrence W.

    2006-05-01

    Within the government communication market there is an increasing push to further miniaturize systems with the use of chip-scale packages, flip-chip bonding, and other advances over traditional packaging techniques. Harris' approach to miniaturization includes these traditional packaging advances, but goes beyond this level of miniaturization by combining the functional and structural elements of a system, thus creating a Multi-Functional Structural Circuit (MFSC). An emerging high-frequency, near hermetic, thermoplastic electronic substrate material, Liquid Crystal Polymer (LCP), is the material that will enable the combination of the electronic circuit and the physical structure of the system. The first embodiment of this vision for Harris is the development of a battlefield acoustic sensor module. This paper will introduce LCP and its advantages for MFSC, present an example of the work that Harris has performed, and speak to LCP MFSCs' potential benefits to miniature communications modules and sensor platforms.

  15. Thermocouple and controlling cables of electric penetrations for nuclear power stations. hermetization with glass-ceramic and glass-fiber materials

    International Nuclear Information System (INIS)

    Kostyukov, N.S.; Golovko, T.A.; Okhotnikova, G.G.

    1996-01-01

    New perspective technology for hermetization of cable ends for fabrication of hermetical inlets for NPPs with inorganic materials is developed. On the basis of the studies dielectric inorganic materials, resistive to γ-radiation and fire, are selected for creation of hermetically sealed inlets. Principally new methods for fabrication of hermoinlets is developed on the basis of metallic modules with fibre circuitously and ceramic hermetization units

  16. Built-in unit with short-circuit insulation for hermetic cable ducts

    International Nuclear Information System (INIS)

    Tschacher, B.; Gurr, W.; Kusserow, J.; Katzmarek, W.

    1984-01-01

    The invention concerns a built-in unit with short-circuit insulation for hermetic cable ducts, especially for containments of nuclear power reactors. The short-circuit insulation is achieved by an insulation plate made from radiation-resistant insulating materials of high mechanical strength

  17. Survival and vigour of ultra-dry seeds after ten years of hermetic storage

    NARCIS (Netherlands)

    Hong, T.D.; Ellis, R.H.; Astley, D.; Pinnegar, A.E.; Groot, S.P.C.; Kraak, H.L.

    2005-01-01

    Seeds of carrot, groundnut, lettuce, oilseed rape and onion were stored hermetically in laminated aluminium foil packets in four environments (dry or ultra-dry moisture contents combined factorially with temperatures of 20 degrees C or -20 degrees C), replicated at several sites. After ten years'

  18. Packaging fluency

    DEFF Research Database (Denmark)

    Mocanu, Ana; Chrysochou, Polymeros; Bogomolova, Svetlana

    2011-01-01

    Research on packaging stresses the need for packaging design to read easily, presuming fast and accurate processing of product-related information. In this paper we define this property of packaging as “packaging fluency”. Based on the existing marketing and cognitive psychology literature on pac...

  19. Microelectronic packaging

    CERN Document Server

    Datta, M; Schultze, J Walter

    2004-01-01

    Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impac

  20. WASTE PACKAGE TRANSPORTER DESIGN

    International Nuclear Information System (INIS)

    Weddle, D.C.; Novotny, R.; Cron, J.

    1998-01-01

    The purpose of this Design Analysis is to develop preliminary design of the waste package transporter used for waste package (WP) transport and related functions in the subsurface repository. This analysis refines the conceptual design that was started in Phase I of the Viability Assessment. This analysis supports the development of a reliable emplacement concept and a retrieval concept for license application design. The scope of this analysis includes the following activities: (1) Assess features of the transporter design and evaluate alternative design solutions for mechanical components. (2) Develop mechanical equipment details for the transporter. (3) Prepare a preliminary structural evaluation for the transporter. (4) Identify and recommend the equipment design for waste package transport and related functions. (5) Investigate transport equipment interface tolerances. This analysis supports the development of the waste package transporter for the transport, emplacement, and retrieval of packaged radioactive waste forms in the subsurface repository. Once the waste containers are closed and accepted, the packaged radioactive waste forms are termed waste packages (WP). This terminology was finalized as this analysis neared completion; therefore, the term disposal container is used in several references (i.e., the System Description Document (SDD)) (Ref. 5.6). In this analysis and the applicable reference documents, the term ''disposal container'' is synonymous with ''waste package''

  1. WASTE PACKAGE TRANSPORTER DESIGN

    Energy Technology Data Exchange (ETDEWEB)

    D.C. Weddle; R. Novotny; J. Cron

    1998-09-23

    The purpose of this Design Analysis is to develop preliminary design of the waste package transporter used for waste package (WP) transport and related functions in the subsurface repository. This analysis refines the conceptual design that was started in Phase I of the Viability Assessment. This analysis supports the development of a reliable emplacement concept and a retrieval concept for license application design. The scope of this analysis includes the following activities: (1) Assess features of the transporter design and evaluate alternative design solutions for mechanical components. (2) Develop mechanical equipment details for the transporter. (3) Prepare a preliminary structural evaluation for the transporter. (4) Identify and recommend the equipment design for waste package transport and related functions. (5) Investigate transport equipment interface tolerances. This analysis supports the development of the waste package transporter for the transport, emplacement, and retrieval of packaged radioactive waste forms in the subsurface repository. Once the waste containers are closed and accepted, the packaged radioactive waste forms are termed waste packages (WP). This terminology was finalized as this analysis neared completion; therefore, the term disposal container is used in several references (i.e., the System Description Document (SDD)) (Ref. 5.6). In this analysis and the applicable reference documents, the term ''disposal container'' is synonymous with ''waste package''.

  2. MEMS packaging

    CERN Document Server

    Hsu , Tai-Ran

    2004-01-01

    MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

  3. Selenide isotope generators for the Galileo Mission: SIG hermetic bimetal weld transition joint

    International Nuclear Information System (INIS)

    Barnett, W.J.

    1979-08-01

    The successful development of the commercial 6061-T651/Silver/304L explosive clad plate material as a bimetal weld transition joint material, as described herein, satisfies all SIG Galileo design requirements for hermetic weld attachment of stainless steel subassemblies to aluminum alloy generator housing or end cover structures. The application of this type weld transition joint to the hermetic attachment of stainless steel shell connectors is well-developed and tested. Based on on-going life tests of stainless steel receptacle/bimetal ring attachment assemblies and metallurgical characterization studies of this transition joint material, it appears evident that this transition joint material has more than adequate capability to meet the 250 to 300 0 F and 50,000 hr. design life of the SIG/Galileo mission. Its extended life temperture capability may well approach 350 to 400 0 F

  4. Increasing of leak-tightness of hermetic zone and other important components in NPPs

    International Nuclear Information System (INIS)

    Murani, J.

    2001-01-01

    The performed by VUEZ resealing works in the hermetic compartments/containment of WWER 440 and WWER 1000 NPPs in Slovakia (Jaslovske Bohunice V-1 NPP, Jaslovske Bohunice V-2 NPP, Mochovce NPP), the Czech Republic (Dukovany NPP, Temelin NPP) and Hungary (Pask NPP) are presented. The leakage rate from hermetic compartments at individual NPP reactor units are shown.The VUEZ activities in field of resealing of weld joints in pools and tanks in the Jaslovske Bohunice V-1 NPP and innovation of the seal of reactor pit protective hood (kolpak) are described. The principle of operation and practical experience of the SMU-V system implemented in the Jaslovske Bohunice V-1 NPP (WWER 440 - V 230) for NPP primary circuit leakage monitoring are also given

  5. Impact of storage environment on the efficacy of hermetic storage bags.

    Science.gov (United States)

    Lane, Brett; Woloshuk, Charles

    2017-05-01

    Small hermetic bags (50 and 100 kg capacities) used by smallholder farmers in several African countries have proven to be a low-cost solution for preventing storage losses due to insects. The complexity of postharvest practices and the need for ideal drying conditions, especially in the Sub-Sahara, has led to questions about the efficacy of the hermetic bags for controlling spoilage by fungi and the potential for mycotoxin accumulation. This study compared the effects of environmental temperature and relative humidity at two locations (Indiana and Arkansas) on dry maize (14% moisture content) in woven polypropylene bags and Purdue Improved Crop Storage (PICS) hermetic bags. Temperature and relative humidity data loggers placed in the middle of each bag provided profiles of environmental influences on stored grain at the two locations. The results indicated that the PICS bags prevented moisture penetration over the three-month storage period. In contrast, maize in the woven bags increased in moisture content. For both bag types, no evidence was obtained indicating the spread of Aspergillus flavus from colonized maize to adjacent non-colonized maize. However, other storage fungi did increase during storage. The number of infected kernels did not increase in the PICS bags, but the numbers in the woven bags increased significantly. The warmer environment in Arkansas resulted in significantly higher insect populations in the woven bags than in Indiana. Insects in the PICS bags remained low at both locations. This study demonstrates that the PICS hermetic bags are effective at blocking the effects of external humidity fluctuations as well as the spread of fungi to non-infected kernels.

  6. Ceramic/metal seals. [refractory materials for hermetic seals for lighium-metal sulfide batteries

    Science.gov (United States)

    Bredbenner, A. M.

    1977-01-01

    Design criteria are discussed for a hermetic seal capable of withstanding the 450 C operating temperature of a lithium-metal sulfide battery system. A mechanical seal consisting of two high strength alloy metal sleeves welded or brazed to a conductor assembly and pressed onto a ceramic is described. The conductor center passes through the ceramic but is not sealed to it. The seal is effected on the outside of the taper where the tubular part is pressed down over and makes contact.

  7. Hermetic diamond capsules for biomedical implants enabled by gold active braze alloys.

    Science.gov (United States)

    Lichter, Samantha G; Escudié, Mathilde C; Stacey, Alastair D; Ganesan, Kumaravelu; Fox, Kate; Ahnood, Arman; Apollo, Nicholas V; Kua, Dunstan C; Lee, Aaron Z; McGowan, Ceara; Saunders, Alexia L; Burns, Owen; Nayagam, David A X; Williams, Richard A; Garrett, David J; Meffin, Hamish; Prawer, Steven

    2015-01-01

    As the field of biomedical implants matures the functionality of implants is rapidly increasing. In the field of neural prostheses this is particularly apparent as researchers strive to build devices that interact with highly complex neural systems such as vision, hearing, touch and movement. A retinal implant, for example, is a highly complex device and the surgery, training and rehabilitation requirements involved in deploying such devices are extensive. Ideally, such devices will be implanted only once and will continue to function effectively for the lifetime of the patient. The first and most pivotal factor that determines device longevity is the encapsulation that separates the sensitive electronics of the device from the biological environment. This paper describes the realisation of a free standing device encapsulation made from diamond, the most impervious, long lasting and biochemically inert material known. A process of laser micro-machining and brazing is described detailing the fabrication of hermetic electrical feedthroughs and laser weldable seams using a 96.4% gold active braze alloy, another material renowned for biochemical longevity. Accelerated ageing of the braze alloy, feedthroughs and hermetic capsules yielded no evidence of corrosion and no loss of hermeticity. Samples of the gold braze implanted for 15 weeks, in vivo, caused minimal histopathological reaction and results were comparable to those obtained from medical grade silicone controls. The work described represents a first account of a free standing, fully functional hermetic diamond encapsulation for biomedical implants, enabled by gold active alloy brazing and laser micro-machining. Copyright © 2015 Elsevier Ltd. All rights reserved.

  8. Advanced organics for electronic substrates and packages

    CERN Document Server

    Fletcher, Andrew E

    1992-01-01

    Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet pre

  9. Hermetizing ability of the new obturating material for root canals «Real Seal» with «Resilon» technology

    Directory of Open Access Journals (Sweden)

    Makedonova Y.A.

    2012-03-01

    Full Text Available Simple, reliable and predictable obturation of root canals side by side with their cleaning and forming is an essential part of the endodontic treatment. The aim of this research is investigation of obturation density of root canals. Canals filled by means of lateral condensation of the new obturative system «Real Seal/Resilon» and by means of traditional method of canals obturation with the help of gutta-percha and sealer АН-plus. The results of the research proved a ligher hermetizing ability of the new experimental material «Real Seal» in comparison with obturation by means of gutta-percha pins. The obtained data reflects an objective picture and can be applied as a unique quality monitoring obturation of root canals.

  10. Highly-reliable laser diodes and modules for spaceborne applications

    Science.gov (United States)

    Deichsel, E.

    2017-11-01

    Laser applications become more and more interesting in contemporary missions such as earth observations or optical communication in space. One of these applications is light detection and ranging (LIDAR), which comprises huge scientific potential in future missions. The Nd:YAG solid-state laser of such a LIDAR system is optically pumped using 808nm emitting pump sources based on semiconductor laser-diodes in quasi-continuous wave (qcw) operation. Therefore reliable and efficient laser diodes with increased output powers are an important requirement for a spaceborne LIDAR-system. In the past, many tests were performed regarding the performance and life-time of such laser-diodes. There were also studies for spaceborne applications, but a test with long operation times at high powers and statistical relevance is pending. Other applications, such as science packages (e.g. Raman-spectroscopy) on planetary rovers require also reliable high-power light sources. Typically fiber-coupled laser diode modules are used for such applications. Besides high reliability and life-time, designs compatible to the harsh environmental conditions must be taken in account. Mechanical loads, such as shock or strong vibration are expected due to take-off or landing procedures. Many temperature cycles with high change rates and differences must be taken in account due to sun-shadow effects in planetary orbits. Cosmic radiation has strong impact on optical components and must also be taken in account. Last, a hermetic sealing must be considered, since vacuum can have disadvantageous effects on optoelectronics components.

  11. Packaging microservices

    DEFF Research Database (Denmark)

    Montesi, Fabrizio; Thrane, Dan Sebastian

    2017-01-01

    We describe a first proposal for a new packaging system for microservices based on the Jolie programming language, called the Jolie Package Manager (JPM). Its main features revolve around service interfaces, which make the functionalities that a service provides and depends on explicit. For the f......We describe a first proposal for a new packaging system for microservices based on the Jolie programming language, called the Jolie Package Manager (JPM). Its main features revolve around service interfaces, which make the functionalities that a service provides and depends on explicit...

  12. The application of hydrocarbon refrigerant mixtures in a hermetic reciprocating compressor for high back pressure conditions

    Energy Technology Data Exchange (ETDEWEB)

    Kim, K.M.; Pak, H.Y. [Hanyang University, Seoul (Korea)

    1999-03-01

    The application of hydrocarbon refrigerant mixtures in a hermetic reciprocating compressor for dehumidifier is investigated. The selected refrigerants are R12, R134a, HC-Blend(R290/R600a), CX(R152a/R600a) and OS-12a. Both theoretical and experimental investigations have been performed for the selected refrigerants. The test results of hydrocarbon refrigerants have been compared to traditional refrigerant(R12) and R134a. The results show that hydrocarbon refrigerant mixtures(HC-Blend, CX and OS-12a) are very good alternatives in the refrigeration system for R12 and R134a. 11 refs., 3 fig., 12 tabs.

  13. 21 CFR 108.35 - Thermal processing of low-acid foods packaged in hermetically sealed containers.

    Science.gov (United States)

    2010-04-01

    ... FDA 2541 (food canning establishment registration) information including (but not limited to) his name... FDA 2541a (food canning establishment process filing for all methods except aseptic), or Form FDA 2541c (food canning establishment process filing for aseptic systems). These forms are available from...

  14. Oxygen Consumption and Acoustic Activity of Adult Callosobruchus maculatus (F.) (Coleoptera: Chrysomelidae: Bruchinae) during Hermetic Storage.

    Science.gov (United States)

    Njoroge, Anastasia W; Mankin, Richard W; Smith, Bradley W; Baributsa, Dieudonne

    2018-04-20

    Acoustic monitoring was applied to consider hermetic exposure durations and oxygen levels required to stop adult Callosobruchus maculatus activity and economic damage on cowpea. A 15-d study was conducted with six treatments of 25, 50, and 100 C. maculatus adults in 500 and 1000 mL jars using acoustic probes inserted through stoppers sealing the jars. Acoustic activity as a result of locomotion, mating, and egg-laying was measured by identifying sound impulses with frequency spectra representative of known insect sounds, and counting trains (bursts) of impulses separated by intervals of <200 ms, that typically are produced only by insects. By the end of the first week of storage in all treatments, oxygen levels declined to levels below 4%, which has been demonstrated to cause mortality in previous studies. Concomitantly, insect sound burst rates dropped below an acoustic detection threshold of 0.02 bursts s −1 , indicating that the insects had ceased feeding. Statistically significant relationships were obtained between two different measures of the acoustic activity and the residual oxygen level. Based on the experimental results, a simple equation can be used to estimate the time needed for oxygen to decline to levels that limit insect feeding damage and thus grain losses in hermetic storage containers of different insect population levels and various volumes.

  15. Blowfly puparia in a hermetic container: survival under decreasing oxygen conditions.

    Science.gov (United States)

    Mądra-Bielewicz, Anna; Frątczak-Łagiewska, Katarzyna; Matuszewski, Szymon

    2017-09-01

    Despite widely accepted standards for sampling and preservation of insect evidence, unrepresentative samples or improperly preserved evidence are encountered frequently in forensic investigations. Here, we report the results of laboratory studies on the survival of Lucilia sericata and Calliphora vomitoria (Diptera: Calliphoridae) intra-puparial forms in hermetic containers, which were stimulated by a recent case. It is demonstrated that the survival of blowfly intra-puparial forms inside airtight containers is dependent on container volume, number of puparia inside, and their age. The survival in both species was found to increase with an increase in the volume of air per 1 mg of puparium per day of development in a hermetic container. Below 0.05 ml of air, no insect survived, and above 0.2 ml of air per 1 mg of puparium per day, survival reached its maximum. These results suggest that blowflies reveal a single, general pattern of survival under decreasing oxygen conditions and that this pattern is a product of number of developing insects, their age and the initial amount of available air. Implications for forensic entomology are discussed.

  16. RASPLAV package

    International Nuclear Information System (INIS)

    1990-01-01

    The RASPLAV package for investigation of post-accident mass transport and heat transfer processes is presented. The package performs three dimensional thermal conduction calculations in space nonuniform and temperature dependent conductivities and variable heat sources, taking into account phase transformations. The processes of free-moving bulk material, mixing of melting fuel due to advection and dissolution, and also evaporation/adsorption are modelled. Two-dimensional hydrodynamics with self-consistent heat transfer are also performed. The paper briefly traces the ways the solution procedures are carried out in the program package and outlines the major results of the simulation of reactor vessel melting after a core meltdown. The theoretical analysis and the calculations in this case were carried out in order to define the possibility of localization of the zone reminders. The interactions between the reminders and the concrete are simulated and evaluation of the interaction parameters is carried out. 4 refs. (R.Ts)

  17. 9 CFR 355.25 - Canning with heat processing and hermetically sealed containers; closures; code marking; heat...

    Science.gov (United States)

    2010-01-01

    ... 9 Animals and Animal Products 2 2010-01-01 2010-01-01 false Canning with heat processing and hermetically sealed containers; closures; code marking; heat processing; incubation. 355.25 Section 355.25... IDENTIFICATION AS TO CLASS, QUALITY, QUANTITY, AND CONDITION Inspection Procedure § 355.25 Canning with heat...

  18. Hermeticity control system for the BMS/BMF-MDT chambers of the muon spectrometer of ATLAS experiment

    International Nuclear Information System (INIS)

    Barashkov, A.V.; Glonti, G.L.; Gongadze, A.L.; Dedovich, D.V.; Demichev, M.A.; Zhemchugov, A.S.; Il'yushenko, E.N.; Korolevich, Ya.V.; Kruchonok, V.G.; Lomidze, D.D.; Nikolaev, K.V.; Kharchenko, D.V.; Tskhadadze, Eh.G.; Chepurnov, V.F.; Shelkov, G.A.; Shcherbakov, A.A.

    2005-01-01

    Description of hermeticity certification of the JINR made muon chambers for the ATLAS experiment is presented. A high precision stand was installed in the production area of the DLNP, JINR. The description of the stand and results of the measurements and the description and results of the second testing of the drift chambers carried out after transportation to CERN are presented

  19. A new glass option for parenteral packaging.

    Science.gov (United States)

    Schaut, Robert A; Peanasky, John S; DeMartino, Steven E; Schiefelbein, Susan L

    2014-01-01

    Glass is the ideal material for parenteral packaging because of its chemical durability, hermeticity, strength, cleanliness, and transparency. Alkali borosilicate glasses have been used successfully for a long time, but they do have some issues relating to breakage, delamination, and variation in hydrolytic performance. In this paper, alkali aluminosilicate glasses are introduced as a possible alternative to alkali borosilicate glasses. An example alkali aluminosilicate glass is shown to meet the compendial requirements, and to have similar thermal, optical, and mechanical attributes as the current alkali borosilicate glasses. In addition, the alkali aluminosilicate performed as well or better than the current alkali borosilicates in extractables tests and stability studies, which suggests that it would be suitable for use with the studied liquid product formulation. The physical, mechanical, and optical properties of glass make it an ideal material for packaging injectable drugs and biologics. Alkali borosilicate glasses have been used successfully for a long time for these applications, but there are some issues. In this paper, alkali aluminosilicate glasses are introduced as a possible alternative to alkali borosilicate glasses. An example alkali aluminosilicate glass is shown to meet the requirements for packaging injectable drugs and biologics, and to be suitable for use with a particular liquid drug. © PDA, Inc. 2014.

  20. Microgrids: Reliable power in a small package

    International Nuclear Information System (INIS)

    Krotz, D.

    2003-01-01

    A new approach to power generation in which a cluster of small, on-site generators serve office buildings, industrial parks and homes, is being developed by scientists at the University of California's Berkeley Campus. Called microgrid, the system may well be the answer to satisfying the growing thirst for electricity without the danger of overburdening the aging transmission lines, or building 1,000 new power plants that would be required to meet the ever-growing demand. The new approach relies on small generators such as ordinary reciprocating engines, microturbines, fuel cells, and photovoltaic systems. This microgrid of small generators appears to the main grid as just an ordinary customer. When the grid offers cheap electricity, the microgrid can purchase it, but when prices rise, or when there is a power failure, the microgrid can isolate itself, ensuring uninterrupted power to critical equipment such as computers, communications infrastructure and control systems. The idea is that if sensitive equipment can be powered locally, the vulnerable centralized power system becomes much less critical. The microgrid could be powered by recovered waste heat, a currently wasted by-product of power generation. Waste heat could also cool and dehumidify buildings using thermally activated processes. Microgrids also have the potential to introduce real competition into the electricity market by offering customers a choice; this is expected to have the effect of imposing competitive discipline on power companies. To extend the potential even farther, it is considered well within the realm of possibility that by introducing fuel cell-powered cars into the microgrid, the car could be used as a source of power by simply parking it and plugging it in to supply electricity to the home or the office

  1. Reliability engineering

    International Nuclear Information System (INIS)

    Lee, Chi Woo; Kim, Sun Jin; Lee, Seung Woo; Jeong, Sang Yeong

    1993-08-01

    This book start what is reliability? such as origin of reliability problems, definition of reliability and reliability and use of reliability. It also deals with probability and calculation of reliability, reliability function and failure rate, probability distribution of reliability, assumption of MTBF, process of probability distribution, down time, maintainability and availability, break down maintenance and preventive maintenance design of reliability, design of reliability for prediction and statistics, reliability test, reliability data and design and management of reliability.

  2. Development of a selective thin film and of a hermetically sealed flat plate solar collector with gas filling

    Science.gov (United States)

    Zernial, W.

    1982-12-01

    The industrial productibility of a selective absorbing thin film was investigated on the basis of reactive cathodic sputtering of Ni. On substrates of 1.8 sq m of Al, Cu, steel and stainless steel, solar absorption values up to 97% were achieved at emissivities of 5 to 10%. A prototype flat plate collector for high temperatures with two covers and hermetical sealing was developed. The technical data of the collector were measured, dependent on the selectivity of the absorber, gas fillings of dry air, argon or SF6 and the geometry and were compared with those of an evacuated flat plate collector. A hermetical sealed double flat plate collector for low temperatures was developed which has the advantage of lower no load temperatures and higher energy gain for heating swimming pool water compared with a conventional flat plate collector. The insolation values on collectors were measured and were used for a calculation of the energy gains of different collector types.

  3. THE ROLE OF POSTHARVEST MACHINERIES AND PACKAGING IN MINIMIZING AFLATOXIN CONTAMINATION IN PEANUT

    Directory of Open Access Journals (Sweden)

    Raffi Paramawati

    2016-10-01

    Full Text Available As a tropical country with relatively high humidity and temperature, Indonesia is struggling with aflatoxin which frequently contaminates peanut. Aflatoxin is a carcinogenic toxic substance that could cause liver cancer. Due to the increasing concern on food safety, the Indonesian Drugs and Foods Agency specifies the maximum aflatoxin allowed in peanut as much as 20 ppb. However, researches showed that aflatoxin contamination in peanut in Indonesia is much higher than the threshold. The study was carried out to observe the effect of using postharvest machineries and packaging  treatments on aflatoxin contamination in peanut. Reduction of postharvest processes was conducted by using series of machineries, e.g. thresher, dryer, and sheller. Packaging treatments, e.g. vacuum plastic pack, hermetic glass chamber, and polyethylene (PE plastic wrap were carried out during storage at ambient temperature (25-27°C. The results showed that using machineries in postharvest handling produced peanut free from aflatoxin contamination. However, without effective packaging, the aflatoxin level would increase during storage. Hermetic packaging could protect peanut from the mold as indicated by low level of aflatoxin contamination.

  4. Lively package

    International Nuclear Information System (INIS)

    Jaremko, G.

    1997-01-01

    Progress on the Lloydminster Heavy Oil Interpretive Centre, sponsored by the Lloydminster Oilfield Technical Society and expected to open in late 1998, was discussed. Some $150,000 of the $750,000 budget is already in the bank, and another $150,000 is in the pipeline. The Centre will be added to an existing and well-established visitor's site. It is reported to contain a lively and imaginatively-designed exhibit package, and promises to become a combination of educational tool and tourist attraction for the town of Lloydminster, Saskatchewan, in the heart of heavy oil country

  5. Reflective Packaging

    Science.gov (United States)

    1994-01-01

    The aluminized polymer film used in spacecraft as a radiation barrier to protect both astronauts and delicate instruments has led to a number of spinoff applications. Among them are aluminized shipping bags, food cart covers and medical bags. Radiant Technologies purchases component materials and assembles a barrier made of layers of aluminized foil. The packaging reflects outside heat away from the product inside the container. The company is developing new aluminized lines, express mailers, large shipping bags, gel packs and insulated panels for the building industry.

  6. Measurement system for the integrated tightness tests of the hermetically sealed rooms at the Paks nuclear power plant

    Energy Technology Data Exchange (ETDEWEB)

    Taubner, R.; Techy, Zs.; Voeroes, L. (Villamosenergiaipari Kutato Intezet, Budapest (Hungary))

    1982-01-01

    One condition for granting start-up permission is the performance of integrated tightness. The testing method agrees with that developed by the Soviet partner in 1979. The measuring principle is based on the temporal change in the quantity of a medium contained in a hermetically sealed space determined from the value of the absolute pressure. In this study the preliminary investigations on the installation of the testing system and the measurement program are presented.

  7. Continuously Operating Biosensor and Its Integration into a Hermetically Sealed Medical Implant

    Directory of Open Access Journals (Sweden)

    Mario Birkholz

    2016-10-01

    Full Text Available An integration concept for an implantable biosensor for the continuous monitoring of blood sugar levels is presented. The system architecture is based on technical modules used in cardiovascular implants in order to minimize legal certification efforts for its perspective usage in medical applications. The sensor chip operates via the principle of affinity viscometry, which is realized by a fully embedded biomedical microelectromechanical systems (BioMEMS prepared in 0.25-µm complementary metal–oxide–semiconductor (CMOS/BiCMOS technology. Communication with a base station is established in the 402–405 MHz band used for medical implant communication services (MICS. The implant shall operate within the interstitial tissue, and the hermetical sealing of the electronic system against interaction with the body fluid is established using titanium housing. Only the sensor chip and the antenna are encapsulated in an epoxy header closely connected to the metallic housing. The study demonstrates that biosensor implants for the sensing of low-molecular-weight metabolites in the interstitial may successfully rely on components already established in cardiovascular implantology.

  8. LAr calorimeter for SCC with a common vacuum bulkhead---a concept to improve hermeticity

    International Nuclear Information System (INIS)

    Pope, W.L.; Watt, R.D.

    1989-11-01

    A new concept for a Barrel/Endcap LAr Calorimeter (LAC) is described in which the Barrel and Endcaps are in separate vacuum enclosures but share a common vacuum bulkhead (CVB). We explore 2 possible bulkhead construction types; welded plate sandwich panels, and brazed sandwich panels in which the core is an isotropic cellular solid--foamed aluminum. Gas lines and electric cables from he innermost Drift Chamber pass through radial holes in the core of the sandwich bulkhead. The CVB concept offers the potential to obtain a more hermetic calorimeter with significantly reduced dead material and/or space in the interface region common to conventional design LAr detectors for the SSC with Endcap features. To utilize a common additional steps to remove the Drift Chamber, a large increase in Endcap standby heat leak, and perhaps, new cryogenic safety issues. We find that significant amount of dead mass can be removed from critical regions of the vacuum shells when compared to a promising SSC LAC reference design. It is also shown that the increased standby heat leak of this concept can be easily removed by existing cooling capacity in another large LAr calorimeter. It is further shown that shut-downs need not be appreciably longer. Finally, it is argued that cryogen spill hazards can be avoided if the Endcap's LAr is removed during Drift chamber maintenance shutdowns, and that cryogenic safety is not compromised

  9. Reduction of the suction losses through reed valves in hermetic reciprocating compressors using a magnet coil

    Science.gov (United States)

    Hopfgartner, J.; Posch, S.; Zuber, B.; Almbauer, R.; Krischan, K.; Stangl, S.

    2017-08-01

    Reed valves are widely used in hermetic reciprocating compressors and are responsible for a large part of the thermodynamic losses. Especially, the suction valve, which is opened nearly during the whole suction stroke, has a big potential for improvement. Usually, suction valves are opened only by vacuum created by the moving piston and should be closed before the compression stroke starts to avoid a reversed mass-flow through the valve. Therefore, the valves are prestressed, which results on the other hand in a higher flow resistance. In this work, a suction valve is investigated, which is not closed by the preload of the valve but by an electromagnetic coil located in the suction muffler neck. Shortly before the piston reaches its bottom dead centre, voltage is applied to the coil and a magnetic force is generated which pulls the valve shut. Thereby, the flow resistance through the valve can be reduced by changing the preload on the reed valve because it is no longer needed to close the valve. The investigation of this adapted valve and the electromagnetic coil is firstly done by numerical simulations including fluid structure interactions of the reed valves of a reciprocating compressor and secondly by experiments made on a calorimeter test bench.

  10. Gastight Hydrodynamic Electrochemistry: Design for a Hermetically Sealed Rotating Disk Electrode Cell.

    Science.gov (United States)

    Jung, Suho; Kortlever, Ruud; Jones, Ryan J R; Lichterman, Michael F; Agapie, Theodor; McCrory, Charles C L; Peters, Jonas C

    2017-01-03

    Rotating disk electrodes (RDEs) are widely used in electrochemical characterization to analyze the mechanisms of various electrocatalytic reactions. RDE experiments often make use of or require collection and quantification of gaseous products. The combination of rotating parts and gaseous analytes makes the design of RDE cells that allow for headspace analysis challenging due to gas leaks at the interface of the cell body and the rotator. In this manuscript we describe a new, hermetically sealed electrochemical cell that allows for electrode rotation while simultaneously providing a gastight environment. Electrode rotation in this new cell design is controlled by magnetically coupling the working electrode to a rotating magnetic driver. Calibration of the RDE using a tachometer shows that the rotation speed of the electrode is the same as that of the magnetic driver. To validate the performance of this cell for hydrodynamic measurements, limiting currents from the reduction of a potassium ferrocyanide (K 4 [Fe(CN) 6 ]·3H 2 O) were measured and shown to compare favorably with calculated values from the Levich equation and with data obtained using more typical, nongastight RDE cells. Faradaic efficiencies of ∼95% were measured in the gas phase for oxygen evolution in alkaline media at an Inconel 625 alloy electrocatalyst during rotation at 1600 rpm. These data verify that a gastight environment is maintained even during rotation.

  11. Deposition and Characterization of Hermetic, Biocompatible Thin Film Coatings for Implantable, Electrically Active Devices

    Science.gov (United States)

    Sweitzer, Robyn K.

    Retinal prostheses may be used to support patients suffering from Age-related macular degeneration or retinitis pigmentosa. A hermetic encapsulation of the poly(imide )-based prosthesis is important in order to prevent the leakage of water and ions into the electric circuitry embedded in the poly(imide) matrix. The deposition of amorphous aluminum oxide (by sputtering) and diamond like carbon (by pulsed laser ablation and vacuum arc vapor deposition) were studied for the application in retinal prostheses. The resulting thin films were characterized for composition, thickness, adhesion and smoothness by scanning electron microscopy-energy dispersive spectroscopy, atomic force microscopy, profilometry and light microscopy. Electrical stability was evaluated and found to be good. The as-deposited films prevented incursion of salinated fluids into the implant over two (2) three month trials soaking in normal saline at body temperature, Biocompatibility was tested in vivo by implanting coated specimen subretinally in the eye of Yucatan pigs. While amorphous aluminum oxide is more readily deposited with sufficient adhesion quality, biocompatibility studies showed a superior behavior of diamond-like carbon. Amorphous aluminum oxide had more adverse effects and caused more severe damage to the retinal tissue.

  12. Performance of triple bagging hermetic technology for postharvest storage of cowpea grain in Niger

    KAUST Repository

    Baoua, Ibrahim B.

    2012-10-01

    Triple bagging technology for protecting postharvest cowpea grain from losses to the bruchid, Callosobruchus maculatus Fabricius (Coleoptera: Chrysomelidae: Bruchinae) is currently being adopted on a fairly large scale in ten West and Central African countries, including Niger. The triple bag consists of two inner high-density polyethylene bags acting as oxygen barriers, which in turn are encased in an outer woven polypropylene bag that serves primarily for mechanical strength. These hermetic bags, available in either 50 or 100 kg capacity, are called Purdue Improved Cowpea Storage (PICS) bags. Adoption of PICS technology in West and Central Africa has been driven by its effectiveness, simplicity, low cost, durability, and manufacture within the region. From surveys on adoption we discovered that farmers have begun to re-use bags they had used the previous year or even the previous two years. In the present study, we compared the performance of three different types of PICS bags: (1) new 50 kg (2) new 100 kg bags and (3) once-used 50 kg bags, all filled with naturally infested untreated cowpeas. In these PICS bags the O 2 levels within the bags initially fell to about 3 percent (v/v) while the CO 2 rose to nearly 5 percent (v/v). After five months of storage, new and used 50 kg bags and new 100 kg bags preserved the grain equally well. There were greatly reduced numbers of adults and larvae in the PICS bags versus the controls, which consisted of grain stored in single layer woven bags. The proportion of grain having C. maculatus emergence holes after five months of storage in PICS bags was little changed from that found when the grain was first put into the bags. The PICS technology is practical and useful in Sahelian conditions and can contribute to improved farmers\\' incomes as well as increase availability of high quality, insecticide-free cowpea grain as food. © 2012 Elsevier Ltd.

  13. Reliability Engineering

    International Nuclear Information System (INIS)

    Lee, Sang Yong

    1992-07-01

    This book is about reliability engineering, which describes definition and importance of reliability, development of reliability engineering, failure rate and failure probability density function about types of it, CFR and index distribution, IFR and normal distribution and Weibull distribution, maintainability and movability, reliability test and reliability assumption in index distribution type, normal distribution type and Weibull distribution type, reliability sampling test, reliability of system, design of reliability and functionality failure analysis by FTA.

  14. Science packages

    Science.gov (United States)

    1997-01-01

    Primary science teachers in Scotland have a new updating method at their disposal with the launch of a package of CDi (Compact Discs Interactive) materials developed by the BBC and the Scottish Office. These were a response to the claim that many primary teachers felt they had been inadequately trained in science and lacked the confidence to teach it properly. Consequently they felt the need for more in-service training to equip them with the personal understanding required. The pack contains five disks and a printed user's guide divided up as follows: disk 1 Investigations; disk 2 Developing understanding; disks 3,4,5 Primary Science staff development videos. It was produced by the Scottish Interactive Technology Centre (Moray House Institute) and is available from BBC Education at £149.99 including VAT. Free Internet distribution of science education materials has also begun as part of the Global Schoolhouse (GSH) scheme. The US National Science Teachers' Association (NSTA) and Microsoft Corporation are making available field-tested comprehensive curriculum material including 'Micro-units' on more than 80 topics in biology, chemistry, earth and space science and physics. The latter are the work of the Scope, Sequence and Coordination of High School Science project, which can be found at http://www.gsh.org/NSTA_SSandC/. More information on NSTA can be obtained from its Web site at http://www.nsta.org.

  15. Packaging - Materials review

    Energy Technology Data Exchange (ETDEWEB)

    Herrmann, Matthias [Hoppecke Advanced Battery Technology GmbH, 08056 Zwickau (Germany)

    2014-06-16

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  16. Packaging - Materials review

    Science.gov (United States)

    Herrmann, Matthias

    2014-06-01

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  17. Packaging - Materials review

    International Nuclear Information System (INIS)

    Herrmann, Matthias

    2014-01-01

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  18. High-speed high-efficiency 500-W cw CO2 laser hermetization of metal frames of microelectronics devices

    Science.gov (United States)

    Levin, Andrey V.

    1996-04-01

    High-speed, efficient method of laser surface treatment has been developed using (500 W) cw CO2 laser. The principal advantages of CO2 laser surface treatment in comparison with solid state lasers are the basis of the method. It has been affirmed that high efficiency of welding was a consequence of the fundamental properties of metal-IR-radiation (10,6 mkm) interaction. CO2 laser hermetization of metal frames of microelectronic devices is described as an example of the proposed method application.

  19. Ceramic ball grid array package stress analysis

    Science.gov (United States)

    Badri, S. H. B. S.; Aziz, M. H. A.; Ong, N. R.; Sauli, Z.; Alcain, J. B.; Retnasamy, V.

    2017-09-01

    The ball grid array (BGA), a form of chip scale package (CSP), was developed as one of the most advanced surface mount devices, which may be assembled by an ordinary surface ball bumps are used instead of plated nickel and gold (Ni/Au) bumps. Assembly and reliability of the BGA's printed circuit board (PCB), which is soldered by conventional surface mount technology is considered in this study. The Ceramic Ball Grid Array (CBGA) is a rectangular ceramic package or square-shaped that will use the solder ball for external electrical connections instead of leads or wire for connections. The solder balls will be arranged in an array or grid at the bottom of the ceramic package body. In this study, ANSYS software is used to investigate the stress on the package for 2 balls and 4 balls of the CBGA package with the various force range of 1-3 Newton applied to the top of the die, top of the substrate and side of the substrate. The highest maximum stress was analyzed and the maximum equivalent stress was observed on the solder ball and the die. From the simulation result, the CBGA package with less solder balls experience higher stress compared to the package with many solder balls. Therefore, less number of solder ball on the CBGA package results higher stress and critically affect the reliability of the solder balls itself, substrate and die which can lead to the solder crack and also die crack.

  20. Status report on an engineering design study of hermetic liquid argon calorimetry for the SSC [Superconducting Super Collider

    International Nuclear Information System (INIS)

    Adams, T.; Davis, M.; DiGiacomo, N.J.

    1989-01-01

    There is general recognition that engineering issues are critical to the viability of liquid argon calorimetry (LAC) at the Superconducting Super Collider (SSC). We have undertaken to quantitatively address these issues and, if possible, perform a preliminary design of a ''proof of principle'' LAC for SSC. To establish LAC as viable at SSC, we must demonstrate that the physics performance of the device is acceptable, despite the presence of dead material due to vessels and support structure. Our approach involves the construction, by a team of physicists and engineers, of one three dimensional model of the LAC system, built as a hierarchy of components and structures, from which we directly perform interferences checks, mechanical, thermal and magnetic analyses, particle tracking, hermeticity evaluation, physics simulation and assembly. This study, begun in February 1989 as part of the SSC generic detector R and D program, was immediately preceded by a workshop at which engineering details of existing and planned LAC systems were thoroughly examined. We describe below the status of our work, beginning with short descriptions of the tools used, the study requirements and LAC configuration baseline. We then detail the LAC design as it presently stands, including assembly considerations, and conclude with a quantitative assessment of the LAC hermeticity. 19 refs., 12 figs

  1. Hybrid Wafer-Level Packaging for RF-MEMS and Optoelectronic Applications

    NARCIS (Netherlands)

    Tian, J.

    2013-01-01

    The current trend in electronic packaging research is to integrate more functions into one package, reduce electrical path parasitic, and increase the heat conduction in order to make the final packaged system smaller, more reliable, more functional and more complete, while keeping the packaging

  2. Wafer-Level Vacuum Packaging of Smart Sensors

    Directory of Open Access Journals (Sweden)

    Allan Hilton

    2016-10-01

    Full Text Available The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology.

  3. Wafer-Level Vacuum Packaging of Smart Sensors.

    Science.gov (United States)

    Hilton, Allan; Temple, Dorota S

    2016-10-31

    The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors-"low cost" for ubiquitous presence, and "smart" for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS) integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology.

  4. Waste package performance assessment

    International Nuclear Information System (INIS)

    Lester, D.H.

    1981-01-01

    This paper describes work undertaken to assess the life-expectancy and post-failure nuclide release behavior of high-level and waste packages in a geologic repository. The work involved integrating models of individual phenomena (such as heat transfer, corrosion, package deformation, and nuclide transport) and using existing data to make estimates of post-emplacement behavior of waste packages. A package performance assessment code was developed to predict time to package failure in a flooded repository and subsequent transport of nuclides out of the leaking package. The model has been used to evaluate preliminary package designs. The results indicate, that within the limitation of model assumptions and data base, packages lasting a few hundreds of years could be developed. Very long lived packages may be possible but more comprehensive data are needed to confirm this

  5. Wafer-level vacuum packaged resonant micro-scanning mirrors for compact laser projection displays

    Science.gov (United States)

    Hofmann, Ulrich; Oldsen, Marten; Quenzer, Hans-Joachim; Janes, Joachim; Heller, Martin; Weiss, Manfred; Fakas, Georgios; Ratzmann, Lars; Marchetti, Eleonora; D'Ascoli, Francesco; Melani, Massimiliano; Bacciarelli, Luca; Volpi, Emilio; Battini, Francesco; Mostardini, Luca; Sechi, Francesco; De Marinis, Marco; Wagner, Bernd

    2008-02-01

    Scanning laser projection using resonant actuated MEMS scanning mirrors is expected to overcome the current limitation of small display size of mobile devices like cell phones, digital cameras and PDAs. Recent progress in the development of compact modulated RGB laser sources enables to set up very small laser projection systems that become attractive not only for consumer products but also for automotive applications like head-up and dash-board displays. Within the last years continuous progress was made in increasing MEMS scanner performance. However, only little is reported on how mass-produceability of these devices and stable functionality even under harsh environmental conditions can be guaranteed. Automotive application requires stable MEMS scanner operation over a wide temperature range from -40° to +85°Celsius. Therefore, hermetic packaging of electrostatically actuated MEMS scanning mirrors becomes essential to protect the sensitive device against particle contamination and condensing moisture. This paper reports on design, fabrication and test of a resonant actuated two-dimensional micro scanning mirror that is hermetically sealed on wafer level. With resonant frequencies of 30kHz and 1kHz, an achievable Theta-D-product of 13mm.deg and low dynamic deformation <20nm RMS it targets Lissajous projection with SVGA-resolution. Inevitable reflexes at the vacuum package surface can be seperated from the projection field by permanent inclination of the micromirror.

  6. Packaging for Food Service

    Science.gov (United States)

    Stilwell, E. J.

    1985-01-01

    Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.

  7. Waste Package Lifting Calculation

    International Nuclear Information System (INIS)

    H. Marr

    2000-01-01

    The objective of this calculation is to evaluate the structural response of the waste package during the horizontal and vertical lifting operations in order to support the waste package lifting feature design. The scope of this calculation includes the evaluation of the 21 PWR UCF (pressurized water reactor uncanistered fuel) waste package, naval waste package, 5 DHLW/DOE SNF (defense high-level waste/Department of Energy spent nuclear fuel)--short waste package, and 44 BWR (boiling water reactor) UCF waste package. Procedure AP-3.12Q, Revision 0, ICN 0, calculations, is used to develop and document this calculation

  8. NASA EEE Parts and NASA Electronic Parts and Packaging (NEPP) Program Update 2018

    Science.gov (United States)

    Label, Kenneth A.; Sampson, Michael J.; Pellish, Jonathan A.; Majewicz, Peter J.

    2018-01-01

    NASA Electronic Parts and Packaging (NEPP) Program and NASA Electronic Parts Assurance Group (NEPAG) are NASAs point-of-contacts for reliability and radiation tolerance of EEE parts and their packages. This presentation includes an FY18 program overview.

  9. Hermetic conditions for the gas-in-oil analysis. Testing of transformer oil; Hermetische Bedingungen fuer die Gas-in-Oel-Analyse. Pruefung von Transformatorenoel

    Energy Technology Data Exchange (ETDEWEB)

    Braesel, Eckhard; Braesel, Olaf [Gatron GmbH, Greifswald (Germany); Sasum, Ute [Forschungszentrum Sensorik Greifswald e.V., Greifswald (Germany)

    2012-06-25

    The protection of hermetic conditions for the gas-in-oil analysis is performed as an innovative method of sampling with integrated gas extraction. It also is controllable with a criterion derived from online monitoring. The importance is in the utilization of all individual gases in the diagnosis and in the determination of the accuracy of DGA results as well as the laboratory control.

  10. Merganser Download Package

    Data.gov (United States)

    U.S. Environmental Protection Agency — This data download package contains an Esri 10.0 MXD, file geodatabase and copy of this FGDC metadata record. The data in this package are used in support of the...

  11. Creative Thinking Package

    Science.gov (United States)

    Jones, Clive

    1972-01-01

    A look at the latest package from a British managment training organization, which explains and demonstrates creative thinking techniques, including brainstorming. The package, designed for groups of twelve or more, consists of tapes, visuals, and associated exercises. (Editor/JB)

  12. 320 x 240 uncooled IRFPA with pixel wise thin film vacuum packaging

    Science.gov (United States)

    Yon, J.-J.; Dumont, G.; Rabaud, W.; Becker, S.; Carle, L.; Goudon, V.; Vialle, C.; Hamelin, A.; Arnaud, A.

    2012-10-01

    Silicon based vacuum packaging is a key enabling technology for achieving affordable uncooled Infrared Focal Plane Arrays (IRFPA) as required by the promising mass market for very low cost IR applications, such as automotive driving assistance, energy loss monitoring in buildings, motion sensors… Among the various approaches studied worldwide, the CEA, LETI is developing a unique technology where each bolometer pixel is sealed under vacuum at the wafer level, using an IR transparent thin film deposition. This technology referred to as PLP (Pixel Level Packaging), leads to an array of hermetic micro-caps each containing a single microbolometer. Since the successful demonstration that the PLP technology, when applied on a single microbolometer pixel, can provide the required vacuum noise and NETD distributions, the paper also puts emphasis on additional key features such as thermal time constant, image quality, and ageing properties.

  13. Wafer level packaging of MEMS

    International Nuclear Information System (INIS)

    Esashi, Masayoshi

    2008-01-01

    Wafer level packaging plays many important roles for MEMS (micro electro mechanical systems), including cost, yield and reliability. MEMS structures on silicon chips are encapsulated between bonded wafers or by surface micromachining, and electrical interconnections are made from the cavity. Bonding at the interface, such as glass–Si anodic bonding and metal-to-metal bonding, requires electrical interconnection through the lid vias in many cases. On the other hand, lateral electrical interconnections on the surface of the chip are used for bonding with intermediate melting materials, such as low melting point glass and solder. The cavity formed by surface micromachining is made using sacrificial etching, and the openings needed for the sacrificial etching are plugged using deposition sealing methods. Vacuum packaging methods and the structures for electrical feedthrough for the interconnection are discussed in this review. (topical review)

  14. Packaging Printing Today

    OpenAIRE

    Stanislav Bolanča; Igor Majnarić; Kristijan Golubović

    2015-01-01

    Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. T...

  15. Genome packaging in viruses

    OpenAIRE

    Sun, Siyang; Rao, Venigalla B.; Rossmann, Michael G.

    2010-01-01

    Genome packaging is a fundamental process in a viral life cycle. Many viruses assemble preformed capsids into which the genomic material is subsequently packaged. These viruses use a packaging motor protein that is driven by the hydrolysis of ATP to condense the nucleic acids into a confined space. How these motor proteins package viral genomes had been poorly understood until recently, when a few X-ray crystal structures and cryo-electron microscopy structures became available. Here we discu...

  16. Implementation of a spark plasma sintering facility in a hermetic glovebox for compaction of toxic, radiotoxic, and air sensitive materials

    Energy Technology Data Exchange (ETDEWEB)

    Tyrpekl, V., E-mail: vaclav.tyrpekl@ec.europa.eu, E-mail: vaclav.tyrpekl@gmail.com; Berkmann, C.; Holzhäuser, M.; Köpp, F.; Cologna, M.; Somers, J. [European Commission, Joint Research Centre (JRC), Institute for Transuranium Elements (ITU), Postfach 2340, 76125 Karlsruhe (Germany); Wangle, T. [European Commission, Joint Research Centre (JRC), Institute for Transuranium Elements (ITU), Postfach 2340, 76125 Karlsruhe (Germany); Faculty of Nuclear Sciences and Physical Engineering, Czech Technical University in Prague, Břehová 7, Praha 1, 115 19 (Czech Republic)

    2015-02-15

    Spark plasma sintering (SPS) is a rapidly developing method for densification of powders into compacts. It belongs to the so-called “field assisted sintering techniques” that enable rapid sintering at much lower temperatures than the classical approaches of pressureless sintering of green pellets or hot isostatic pressing. In this paper, we report the successful integration of a SPS device into a hermetic glovebox for the handling of highly radioactive material containing radioisotopes of U, Th, Pu, Np, and Am. The glovebox implantation has been facilitated by the replacement of the hydraulic system to apply pressure with a compact electromechanical unit. The facility has been successfully tested using UO{sub 2} powder. Pellets with 97% of the theoretical density were obtained at 1000 °C for 5 min, significantly lower than the ∼1600 °C for 5-10 h used in conventional pellet sintering.

  17. Trends in Food Packaging.

    Science.gov (United States)

    Ott, Dana B.

    1988-01-01

    This article discusses developments in food packaging, processing, and preservation techniques in terms of packaging materials, technologies, consumer benefits, and current and potential food product applications. Covers implications due to consumer life-style changes, cost-effectiveness of packaging materials, and the ecological impact of…

  18. Technique development for modulus, microcracking, hermeticity, and coating evaluation capability characterization of SiC/SiC tubes

    Energy Technology Data Exchange (ETDEWEB)

    Hu, Xunxiang [Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States); Ang, Caen K. [Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States); Singh, Gyanender P. [Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States); Katoh, Yutai [Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)

    2016-08-01

    Driven by the need to enlarge the safety margins of nuclear fission reactors in accident scenarios, research and development of accident-tolerant fuel has become an important topic in the nuclear engineering and materials community. A continuous-fiber SiC/SiC composite is under consideration as a replacement for traditional zirconium alloy cladding owing to its high-temperature stability, chemical inertness, and exceptional irradiation resistance. An important task is the development of characterization techniques for SiC/SiC cladding, since traditional work using rectangular bars or disks cannot directly provide useful information on the properties of SiC/SiC composite tubes for fuel cladding applications. At Oak Ridge National Laboratory, experimental capabilities are under development to characterize the modulus, microcracking, and hermeticity of as-fabricated, as-irradiated SiC/SiC composite tubes. Resonant ultrasound spectroscopy has been validated as a promising technique to evaluate the elastic properties of SiC/SiC composite tubes and microcracking within the material. A similar technique, impulse excitation, is efficient in determining the basic mechanical properties of SiC bars prepared by chemical vapor deposition; it also has potential for application in studying the mechanical properties of SiC/SiC composite tubes. Complete evaluation of the quality of the developed coatings, a major mitigation strategy against gas permeation and hydrothermal corrosion, requires the deployment of various experimental techniques, such as scratch indentation, tensile pulling-off tests, and scanning electron microscopy. In addition, a comprehensive permeation test station is being established to assess the hermeticity of SiC/SiC composite tubes and to determine the H/D/He permeability of SiC/SiC composites. This report summarizes the current status of the development of these experimental capabilities.

  19. Software reliability

    CERN Document Server

    Bendell, A

    1986-01-01

    Software Reliability reviews some fundamental issues of software reliability as well as the techniques, models, and metrics used to predict the reliability of software. Topics covered include fault avoidance, fault removal, and fault tolerance, along with statistical methods for the objective assessment of predictive accuracy. Development cost models and life-cycle cost models are also discussed. This book is divided into eight sections and begins with a chapter on adaptive modeling used to predict software reliability, followed by a discussion on failure rate in software reliability growth mo

  20. Active Packaging Coatings

    Directory of Open Access Journals (Sweden)

    Luis J. Bastarrachea

    2015-11-01

    Full Text Available Active food packaging involves the packaging of foods with materials that provide an enhanced functionality, such as antimicrobial, antioxidant or biocatalytic functions. This can be achieved through the incorporation of active compounds into the matrix of the commonly used packaging materials, or by the application of coatings with the corresponding functionality through surface modification. The latter option offers the advantage of preserving the packaging materials’ bulk properties nearly intact. Herein, different coating technologies like embedding for controlled release, immobilization, layer-by-layer deposition, and photografting are explained and their potential application for active food packaging is explored and discussed.

  1. Advancements in meat packaging.

    Science.gov (United States)

    McMillin, Kenneth W

    2017-10-01

    Packaging of meat provides the same or similar benefits for raw chilled and processed meats as other types of food packaging. Although air-permeable packaging is most prevalent for raw chilled red meat, vacuum and modified atmosphere packaging offer longer shelf life. The major advancements in meat packaging have been in the widely used plastic polymers while biobased materials and their integration into composite packaging are receiving much attention for functionality and sustainability. At this time, active and intelligent packaging are not widely used for antioxidant, antimicrobial, and other functions to stabilize and enhance meat properties although many options are being developed and investigated. The advances being made in nanotechnology will be incorporated into food packaging and presumably into meat packaging when appropriate and useful. Intelligent packaging using sensors for transmission of desired information and prompting of subsequent changes in packaging materials, environments or the products to maintain safety and quality are still in developmental stages. Copyright © 2017 Elsevier Ltd. All rights reserved.

  2. Edible packaging materials.

    Science.gov (United States)

    Janjarasskul, Theeranun; Krochta, John M

    2010-01-01

    Research groups and the food and pharmaceutical industries recognize edible packaging as a useful alternative or addition to conventional packaging to reduce waste and to create novel applications for improving product stability, quality, safety, variety, and convenience for consumers. Recent studies have explored the ability of biopolymer-based food packaging materials to carry and control-release active compounds. As diverse edible packaging materials derived from various by-products or waste from food industry are being developed, the dry thermoplastic process is advancing rapidly as a feasible commercial edible packaging manufacturing process. The employment of nanocomposite concepts to edible packaging materials promises to improve barrier and mechanical properties and facilitate effective incorporation of bioactive ingredients and other designed functions. In addition to the need for a more fundamental understanding to enable design to desired specifications, edible packaging has to overcome challenges such as regulatory requirements, consumer acceptance, and scaling-up research concepts to commercial applications.

  3. Human reliability

    International Nuclear Information System (INIS)

    Embrey, D.E.

    1987-01-01

    Concepts and techniques of human reliability have been developed and are used mostly in probabilistic risk assessment. For this, the major application of human reliability assessment has been to identify the human errors which have a significant effect on the overall safety of the system and to quantify the probability of their occurrence. Some of the major issues within human reliability studies are reviewed and it is shown how these are applied to the assessment of human failures in systems. This is done under the following headings; models of human performance used in human reliability assessment, the nature of human error, classification of errors in man-machine systems, practical aspects, human reliability modelling in complex situations, quantification and examination of human reliability, judgement based approaches, holistic techniques and decision analytic approaches. (UK)

  4. Reliability Calculations

    DEFF Research Database (Denmark)

    Petersen, Kurt Erling

    1986-01-01

    Risk and reliability analysis is increasingly being used in evaluations of plant safety and plant reliability. The analysis can be performed either during the design process or during the operation time, with the purpose to improve the safety or the reliability. Due to plant complexity and safety...... and availability requirements, sophisticated tools, which are flexible and efficient, are needed. Such tools have been developed in the last 20 years and they have to be continuously refined to meet the growing requirements. Two different areas of application were analysed. In structural reliability probabilistic...... approaches have been introduced in some cases for the calculation of the reliability of structures or components. A new computer program has been developed based upon numerical integration in several variables. In systems reliability Monte Carlo simulation programs are used especially in analysis of very...

  5. Lithium niobate packaging challenges

    International Nuclear Information System (INIS)

    Murphy, E.J.; Holmes, R.J.; Jander, R.B.; Schelling, A.W.

    1988-01-01

    The use of lithium niobate integrated optic devices outside of the research laboratory is predicated on the development of a sound packaging method. The authors present a discussion of the many issues that face the development of a viable, robust packaging technology. The authors emphasize the interaction of lithium niobate's physical properties with available packaging materials and technologies. The broad range of properties (i.e. electro-optic, piezo-electric, pyro-electric, photorefractive...) that make lithium niobate an interesting material in many device applications also make it a packaging challenge. The package design, materials and packaging technologies must isolate the device from the environment so that lithium niobate's properties do not adversely affect the device performance

  6. Packaged die heater

    Science.gov (United States)

    Spielberger, Richard; Ohme, Bruce Walker; Jensen, Ronald J.

    2011-06-21

    A heater for heating packaged die for burn-in and heat testing is described. The heater may be a ceramic-type heater with a metal filament. The heater may be incorporated into the integrated circuit package as an additional ceramic layer of the package, or may be an external heater placed in contact with the package to heat the die. Many different types of integrated circuit packages may be accommodated. The method provides increased energy efficiency for heating the die while reducing temperature stresses on testing equipment. The method allows the use of multiple heaters to heat die to different temperatures. Faulty die may be heated to weaken die attach material to facilitate removal of the die. The heater filament or a separate temperature thermistor located in the package may be used to accurately measure die temperature.

  7. Packaging for Sustainability

    CERN Document Server

    Lewis, Helen; Fitzpatrick, Leanne

    2012-01-01

    The packaging industry is under pressure from regulators, customers and other stakeholders to improve packaging’s sustainability by reducing its environmental and societal impacts. This is a considerable challenge because of the complex interactions between products and their packaging, and the many roles that packaging plays in the supply chain. Packaging for Sustainability is a concise and readable handbook for practitioners who are trying to implement sustainability strategies for packaging. Industry case studies are used throughout the book to illustrate possible applications and scenarios. Packaging for Sustainability draws on the expertise of researchers and industry practitioners to provide information on business benefits, environmental issues and priorities, environmental evaluation tools, design for environment, marketing strategies, and challenges for the future.

  8. MARS software package status

    International Nuclear Information System (INIS)

    Azhgirej, I.L.; Talanov, V.V.

    2000-01-01

    The MARS software package is intended for simulating the nuclear-electromagnetic cascades and the secondary neutrons and muons transport in the heterogeneous medium of arbitrary complexity in the magnetic fields presence. The inclusive approach to describing the particle production in the nuclear and electromagnetic interactions and by the unstable particles decay is realized in the package. The MARS software package was actively applied for solving various radiation physical problems [ru

  9. Experimental and theoretical analyses of package-on-package structure under three-point bending loading

    International Nuclear Information System (INIS)

    Jia Su; Wang Xi-Shu; Ren Huai-Hui

    2012-01-01

    High density packaging is developing toward miniaturization and integration, which causes many difficulties in designing, manufacturing, and reliability testing. Package-on-Package (PoP) is a promising three-dimensional high-density packaging method that integrates a chip scale package (CSP) in the top package and a fine-pitch ball grid array (FBGA) in the bottom package. In this paper, in-situ scanning electron microscopy (SEM) observation is carried out to detect the deformation and damage of the PoP structure under three-point bending loading. The results indicate that the cracks occur in the die of the top package, then cause the crack deflection and bridging in the die attaching layer. Furthermore, the mechanical principles are used to analyse the cracking process of the PoP structure based on the multi-layer laminating hypothesis and the theoretical analysis results are found to be in good agreement with the experimental results. (condensed matter: structural, mechanical, and thermal properties)

  10. User friendly packaging

    DEFF Research Database (Denmark)

    Geert Jensen, Birgitte

    2010-01-01

    Most consumers have experienced occasional problems with opening packaging. Tomato sauce from the tinned mackerel splattered all over the kitchen counter, the unrelenting pickle jar lid, and the package of sliced ham that cannot be opened without a knife or a pair of scissors. The research project...... “User-friendly Packaging” aims to create a platform for developing more user-friendly packaging. One intended outcome of the project is a guideline that industry can use in development efforts. The project also points the way for more extended collaboration between companies and design researchers. How...... can design research help industry in packaging innovation?...

  11. The ZOOM minimization package

    International Nuclear Information System (INIS)

    Fischler, Mark S.; Sachs, D.

    2004-01-01

    A new object-oriented Minimization package is available for distribution in the same manner as CLHEP. This package, designed for use in HEP applications, has all the capabilities of Minuit, but is a re-write from scratch, adhering to modern C++ design principles. A primary goal of this package is extensibility in several directions, so that its capabilities can be kept fresh with as little maintenance effort as possible. This package is distinguished by the priority that was assigned to C++ design issues, and the focus on producing an extensible system that will resist becoming obsolete

  12. Plasma physics plotting package

    International Nuclear Information System (INIS)

    Hyman, D.H.

    1981-02-01

    We describe a package of plotting routines that do up to six two- or three-dimensional plots on a frame with minimal loss of resolution. The package now runs on a PDP-10 with PLOT-10 TCS primitives and on a Control Data Corporation-7600 and a Cray-1 with TV80LIB primitives on the National Magnetic Fusion Energy Computer Center network. The package is portable to other graphics systems because only the primitive plot calls are used from the underlying system's graphics package

  13. Active food packaging technologies.

    Science.gov (United States)

    Ozdemir, Murat; Floros, John D

    2004-01-01

    Active packaging technologies offer new opportunities for the food industry, in the preservation of foods. Important active packaging systems currently known to date, including oxygen scavengers, carbon dioxide emitters/absorbers, moisture absorbers, ethylene absorbers, ethanol emitters, flavor releasing/absorbing systems, time-temperature indicators, and antimicrobial containing films, are reviewed. The principle of operation of each active system is briefly explained. Recent technological advances in active packaging are discussed, and food related applications are presented. The effects of active packaging systems on food quality and safety are cited.

  14. 3D microelectronic packaging from fundamentals to applications

    CERN Document Server

    Goyal, Deepak

    2017-01-01

    This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future resea...

  15. SCALE criticality safety verification and validation package

    International Nuclear Information System (INIS)

    Bowman, S.M.; Emmett, M.B.; Jordan, W.C.

    1998-01-01

    Verification and validation (V and V) are essential elements of software quality assurance (QA) for computer codes that are used for performing scientific calculations. V and V provides a means to ensure the reliability and accuracy of such software. As part of the SCALE QA and V and V plans, a general V and V package for the SCALE criticality safety codes has been assembled, tested and documented. The SCALE criticality safety V and V package is being made available to SCALE users through the Radiation Safety Information Computational Center (RSICC) to assist them in performing adequate V and V for their SCALE applications

  16. Reliability Engineering

    CERN Document Server

    Lazzaroni, Massimo

    2012-01-01

    This book gives a practical guide for designers and users in Information and Communication Technology context. In particular, in the first Section, the definition of the fundamental terms according to the international standards are given. Then, some theoretical concepts and reliability models are presented in Chapters 2 and 3: the aim is to evaluate performance for components and systems and reliability growth. Chapter 4, by introducing the laboratory tests, puts in evidence the reliability concept from the experimental point of view. In ICT context, the failure rate for a given system can be

  17. Reliability training

    Science.gov (United States)

    Lalli, Vincent R. (Editor); Malec, Henry A. (Editor); Dillard, Richard B.; Wong, Kam L.; Barber, Frank J.; Barina, Frank J.

    1992-01-01

    Discussed here is failure physics, the study of how products, hardware, software, and systems fail and what can be done about it. The intent is to impart useful information, to extend the limits of production capability, and to assist in achieving low cost reliable products. A review of reliability for the years 1940 to 2000 is given. Next, a review of mathematics is given as well as a description of what elements contribute to product failures. Basic reliability theory and the disciplines that allow us to control and eliminate failures are elucidated.

  18. CYPROS - Cybernetic Program Packages

    Directory of Open Access Journals (Sweden)

    Arne Tyssø

    1980-10-01

    Full Text Available CYPROS is an interactive program system consisting of a number of special purpose packages for simulation, identification, parameter estimation and control system design. The programming language is standard FORTRAN IV and the system is implemented on a medium size computer system (Nord-10. The system is interactive and program control is obtained by the use of numeric terminals. Output is rapidly examined by extensive use of video colour graphics. The subroutines included in the packages are designed and documented according to standardization rules given by the SCL (Scandinavian Control Library organization. This simplifies the exchange of subroutines throughout the SCL system. Also, this makes the packages attractive for implementation by industrial users. In the simulation package, different integration methods are available and it can be easily used for off-line, as well as real time, simulation problems. The identification package consists of programs for single-input/single-output and multivariablc problems. Both transfer function models and state space models can be handled. Optimal test signals can be designed. The control package consists of programs based on multivariable time domain and frequency domain methods for analysis and design. In addition, there is a package for matrix and time series manipulation. CYPROS has been applied successfully to industrial problems of various kinds, and parts of the system have already been implemented on different computers in industry. This paper will, in some detail, describe the use and the contents of the packages and some examples of application will be discussed.

  19. User friendly packaging

    DEFF Research Database (Denmark)

    Geert Jensen, Birgitte

    2010-01-01

    Most consumers have experienced occasional problems with opening packaging. Tomato sauce from the tinned mackerel splattered all over the kitchen counter, the unrelenting pickle jar lid, and the package of sliced ham that cannot be opened without a knife or a pair of scissors. The research project...

  20. NRF TRIGA packaging

    International Nuclear Information System (INIS)

    Clements, M.D.

    1995-11-01

    Training Reactor Isotopes, General Atomics (TRIGA reg-sign) Reactors are in use at four US Department of Energy (DOE) complex facilities and at least 23 university, commercial, or government facilities. The development of the Neutron Radiography Facility (NRF) TRIGA packaging system began in October 1993. The Hanford Site NRF is being shut down and requires an operationally user-friendly transportation and storage packaging system for removal of the TRIGA fuel elements. The NRF TRIGA packaging system is designed to remotely remove the fuel from the reactor and transport the fuel to interim storage (up to 50 years) on the Hanford Site. The packaging system consists of a cask and an overpack. The overpack is used only for transport and is not necessary for storage. Based upon the cask's small size and light weight, small TRIGA reactors will find it versatile for numerous refueling and fuel storage needs. The NRF TRIGA packaging design also provides the basis for developing a certifiable and economical packaging system for other TRIGA reactor facilities. The small size of the NRF TRIGA cask also accommodates placing the cask into a larger certified packaging for offsite transport. The Westinghouse Hanford Company NRF TRIGA packaging, as described herein can serve other DOE sites for their onsite use, and the design can be adapted to serve university reactor facilities, handling a variety of fuel payloads

  1. The BINSYN Program Package

    Directory of Open Access Journals (Sweden)

    Albert P. Linnell

    2012-06-01

    Full Text Available The BINSYN program package, recently expanded to calculate synthetic spectra of cataclysmic variables, is being further extended to include synthetic photometry of ordinary binary stars in addition to binary stars with optically thick accretion disks. The package includes a capability for differentials correction optimization of eclipsing binary systems using synthetic photometry.

  2. The LCDROOT Analysis Package

    International Nuclear Information System (INIS)

    Abe, Toshinori

    2001-01-01

    The North American Linear Collider Detector group has developed simulation and analysis program packages. LCDROOT is one of the packages, and is based on ROOT and the C++ programing language to maximally benefit from object oriented programming techniques. LCDROOT is constantly improved and now has a new topological vertex finder, ZVTOP3. In this proceeding, the features of the LCDROOT simulation are briefly described

  3. Grooming. Learning Activity Package.

    Science.gov (United States)

    Stark, Pamela

    This learning activity package on grooming for health workers is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics are…

  4. Triple bag hermetic technology for controlling a bruchid (Spermophagus sp.) (Coleoptera, Chrysomelidae) in stored Hibiscus sabdariffa grain.

    Science.gov (United States)

    Amadou, L; Baoua, I B; Baributsa, D; Williams, S B; Murdock, L L

    2016-10-01

    We assessed the performance of hermetic triple layer Purdue Improved Crop Storage (PICS) bags for protecting Hibiscus sabdariffa grain against storage insects. The major storage pest in the grain was a bruchid, Spermophagus sp.. When we stored infested H. sabdariffa grain for six months in the woven polypropylene bags typically used by farmers, the Spermophagus population increased 33-fold over that initially present. The mean number of emergence holes per 100 seeds increased from 3.3 holes to 35.4 holes during this time period, while grain held for the same length of time in PICS bags experienced no increase in the numbers of holes. Grain weight loss in the woven control bags was 8.6% while no weight loss was observed in the PICS bags. Seed germination rates of grain held in woven bags for six months dropped significantly while germination of grain held in PICS bags did not change from the initial value. PICS bags can be used to safely store Hibiscus grain after harvest to protect against a major insect pest.

  5. Waste package performance analysis

    International Nuclear Information System (INIS)

    Lester, D.H.; Stula, R.T.; Kirstein, B.E.

    1982-01-01

    A performance assessment model for multiple barrier packages containing unreprocessed spent fuel has been applied to several package designs. The resulting preliminary assessments were intended for use in making decisions about package development programs. A computer model called BARIER estimates the package life and subsequent rate of release of selected nuclides. The model accounts for temperature, pressure (and resulting stresses), bulk and localized corrosion, and nuclide retardation by the backfill after water intrusion into the waste form. The assessment model assumes a post-closure, flooded, geologic repository. Calculations indicated that, within the bounds of model assumptions, packages could last for several hundred years. Intact backfills of appropriate design may be capable of nuclide release delay times on the order of 10 7 yr for uranium, plutonium, and americium. 8 references, 6 figures, 9 tables

  6. RH Packaging Operations Manual

    International Nuclear Information System (INIS)

    Washington TRU Solutions LLC

    2003-01-01

    This procedure provides operating instructions for the RH-TRU 72-B Road Cask, Waste Shipping Package. In this document, ''Packaging'' refers to the assembly of components necessary to ensure compliance with the packaging requirements (not loaded with a payload). ''Package'' refers to a Type B packaging that, with its radioactive contents, is designed to retain the integrity of its containment and shielding when subject to the normal conditions of transport and hypothetical accident test conditions set forth in 10 CFR Part 71. Loading of the RH 72-B cask can be done two ways, on the RH cask trailer in the vertical position or by removing the cask from the trailer and loading it in a facility designed for remote-handling (RH). Before loading the 72-B cask, loading procedures and changes to the loading procedures for the 72-B cask must be sent to CBFO at sitedocuments at wipp.ws for approval

  7. Advanced flip chip packaging

    CERN Document Server

    Lai, Yi-Shao; Wong, CP

    2013-01-01

    Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

  8. Reliability calculations

    International Nuclear Information System (INIS)

    Petersen, K.E.

    1986-03-01

    Risk and reliability analysis is increasingly being used in evaluations of plant safety and plant reliability. The analysis can be performed either during the design process or during the operation time, with the purpose to improve the safety or the reliability. Due to plant complexity and safety and availability requirements, sophisticated tools, which are flexible and efficient, are needed. Such tools have been developed in the last 20 years and they have to be continuously refined to meet the growing requirements. Two different areas of application were analysed. In structural reliability probabilistic approaches have been introduced in some cases for the calculation of the reliability of structures or components. A new computer program has been developed based upon numerical integration in several variables. In systems reliability Monte Carlo simulation programs are used especially in analysis of very complex systems. In order to increase the applicability of the programs variance reduction techniques can be applied to speed up the calculation process. Variance reduction techniques have been studied and procedures for implementation of importance sampling are suggested. (author)

  9. High-inertia hermetically sealed main coolant pump for next generation passive nuclear power plants

    International Nuclear Information System (INIS)

    Kujawski, Joseph M.; Nair, Bala R.; Vijuk, Ronald P.

    2003-01-01

    The main coolant pump for the Westinghouse AP1000 advanced passive nuclear power plant represents a significant scale-up in power, flow capacity, and physical size from its predecessor designed for the smaller AP600 power plant. More importantly, the AP1000 pump incorporates several innovative features that contribute to improved efficiency, operational reliability, and plant safety. The features include an internals design which provides the highest hydraulic efficiency achieved in commercial nuclear power plant applications. Another feature is the use of a distributed inertial mass system in the rotating assembly to develop the high rotational inertia to meet the extended system flow coastdown requirement for core heat removal in the event of loss of power to the pumps. This advanced canned motor pump also incorporates the latest development in higher operating voltage, providing plant designers with the ability to eliminate plant transformers and operate directly on the site electrical bus in many cases. The salient features of the pump design and performance data are presented in this paper. (author)

  10. Recent trends and future of pharmaceutical packaging technology.

    Science.gov (United States)

    Zadbuke, Nityanand; Shahi, Sadhana; Gulecha, Bhushan; Padalkar, Abhay; Thube, Mahesh

    2013-04-01

    The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS) vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD) coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future.

  11. Recent trends and future of pharmaceutical packaging technology

    Directory of Open Access Journals (Sweden)

    Nityanand Zadbuke

    2013-01-01

    Full Text Available The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future.

  12. Recent trends and future of pharmaceutical packaging technology

    Science.gov (United States)

    Zadbuke, Nityanand; Shahi, Sadhana; Gulecha, Bhushan; Padalkar, Abhay; Thube, Mahesh

    2013-01-01

    The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS) vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD) coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future. PMID:23833515

  13. Systems reliability/structural reliability

    International Nuclear Information System (INIS)

    Green, A.E.

    1980-01-01

    The question of reliability technology using quantified techniques is considered for systems and structures. Systems reliability analysis has progressed to a viable and proven methodology whereas this has yet to be fully achieved for large scale structures. Structural loading variants over the half-time of the plant are considered to be more difficult to analyse than for systems, even though a relatively crude model may be a necessary starting point. Various reliability characteristics and environmental conditions are considered which enter this problem. The rare event situation is briefly mentioned together with aspects of proof testing and normal and upset loading conditions. (orig.)

  14. Material and design considerations of FBGA reliability performance

    International Nuclear Information System (INIS)

    Lee, Teck Kheng; Ng, T.C.; Chai, Y.M.

    2004-01-01

    FBGA package reliability is usually assessed through the conventional approaches of die attach and mold compound material optimization. However, with the rapid changes and fast-moving pace of electronic packaging and the introduction of new soldermask and core materials, substrate design has also become a critical factor in determining overall package reliability. The purpose of this paper is to understand the impact design and soldermask material of a rigid substrate on overall package reliability. Three different soldermask patterns with a matrix of different die attach, mold compound, and soldermask materials are assessed using the moisture sensitivity test (MST). Package reliability is also assessed through the use of temperature cycling (T/C) at conditions 'B' and 'C'. For material optimization, three different mold compounds and die attach materials are used. Material adhesion between different die attach materials and soldermask materials are obtained through die shear performed at various temperatures and preset moisture conditions. A study correlating the different packaging material properties and their relative adhesion strengths with overall package reliability in terms of both MST and T/C performance was performed. Soldermask design under the die pads was found to affect package reliability. For example, locating vias at the edge of the die is not desirable because the vias acts as initiation point for delamination and moisture-induced failure. Through die shear testing, soldermask B demonstrated higher adhesion properties compared to soldermask A across several packaging materials and enhanced the overall package reliability in terms of both MST and T/C performance. Both MST JEDEC level 1 and the T/C of 'B' and 'C' at 1000 cycles have been achieved through design and package material optimization

  15. Material and design considerations of FBGA reliability performance

    Energy Technology Data Exchange (ETDEWEB)

    Lee, Teck Kheng; Ng, T.C.; Chai, Y.M

    2004-09-01

    FBGA package reliability is usually assessed through the conventional approaches of die attach and mold compound material optimization. However, with the rapid changes and fast-moving pace of electronic packaging and the introduction of new soldermask and core materials, substrate design has also become a critical factor in determining overall package reliability. The purpose of this paper is to understand the impact design and soldermask material of a rigid substrate on overall package reliability. Three different soldermask patterns with a matrix of different die attach, mold compound, and soldermask materials are assessed using the moisture sensitivity test (MST). Package reliability is also assessed through the use of temperature cycling (T/C) at conditions 'B' and 'C'. For material optimization, three different mold compounds and die attach materials are used. Material adhesion between different die attach materials and soldermask materials are obtained through die shear performed at various temperatures and preset moisture conditions. A study correlating the different packaging material properties and their relative adhesion strengths with overall package reliability in terms of both MST and T/C performance was performed. Soldermask design under the die pads was found to affect package reliability. For example, locating vias at the edge of the die is not desirable because the vias acts as initiation point for delamination and moisture-induced failure. Through die shear testing, soldermask B demonstrated higher adhesion properties compared to soldermask A across several packaging materials and enhanced the overall package reliability in terms of both MST and T/C performance. Both MST JEDEC level 1 and the T/C of 'B' and 'C' at 1000 cycles have been achieved through design and package material optimization.

  16. Packaging Printing Today

    Directory of Open Access Journals (Sweden)

    Stanislav Bolanča

    2015-12-01

    Full Text Available Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. The possibilities of particular printing techniques for optimal production of the determined packaging were studied in the paper. The problem was viewed from the technological and economical aspect. The possible printing quality and the time necessary for the printing realization were taken as key parameters. An important segment of the production and the way of life is alocation value and it had also found its place in this paper. The events in the field of packaging printing in the whole world were analyzed. The trends of technique developments and the printing technology for packaging printing in near future were also discussed.

  17. Consumer response to packaging design

    NARCIS (Netherlands)

    Steenis, Nigel D.; Herpen, van Erica; Lans, van der Ivo A.; Ligthart, Tom N.; Trijp, van Hans C.M.

    2017-01-01

    Building on theories of cue utilization, this paper investigates whether and how packaging sustainability influences consumer perceptions, inferences and attitudes towards packaged products. A framework is tested in an empirical study among 249 students using soup products varying in packaging

  18. Safety Analysis Report - Packages, 9965, 9968, 9972-9975 Packages

    International Nuclear Information System (INIS)

    Blanton, P.

    2000-01-01

    This Safety Analysis Report for Packaging (SARP) documents the analysis and testing performed on four type B Packages: the 9972, 9973, 9974, and 9975 packages. Because all four packages have similar designs with very similar performance characteristics, all of them are presented in a single SARP. The performance evaluation presented in this SARP documents the compliance of the 9975 package with the regulatory safety requirements. Evaluations of the 9972, 9973, and 9974 packages support that of the 9975. To avoid confusion arising from the inclusion of four packages in a single document, the text segregates the data for each package in such a way that the reader interested in only one package can progress from Chapter 1 through Chapter 9. The directory at the beginning of each chapter identifies each section that should be read for a given package. Sections marked ''all'' are generic to all packages

  19. Human reliability

    International Nuclear Information System (INIS)

    Bubb, H.

    1992-01-01

    This book resulted from the activity of Task Force 4.2 - 'Human Reliability'. This group was established on February 27th, 1986, at the plenary meeting of the Technical Reliability Committee of VDI, within the framework of the joint committee of VDI on industrial systems technology - GIS. It is composed of representatives of industry, representatives of research institutes, of technical control boards and universities, whose job it is to study how man fits into the technical side of the world of work and to optimize this interaction. In a total of 17 sessions, information from the part of ergonomy dealing with human reliability in using technical systems at work was exchanged, and different methods for its evaluation were examined and analyzed. The outcome of this work was systematized and compiled in this book. (orig.) [de

  20. Microelectronics Reliability

    Science.gov (United States)

    2017-01-17

    inverters  connected in a chain. ................................................. 5  Figure 3  Typical graph showing frequency versus square root of...developing an experimental  reliability estimating methodology that could both illuminate the  lifetime  reliability of advanced devices,  circuits and...or  FIT of the device. In other words an accurate estimate of the device  lifetime  was found and thus the  reliability  that  can  be  conveniently

  1. Reliability of CCGA and PBGA assemblies

    Science.gov (United States)

    Ghaffarian, Reza

    2005-01-01

    Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of the choice for commercial applications; they are now started to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic BGA (PBGA) and CSP assemblies, because of their wide usage for commercial applications, have been extensively reported in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.

  2. London 2012 packaging guidelines

    OpenAIRE

    2013-01-01

    These guidelines are intended to provide supplemental advice to suppliers and licensees regarding the provisions of the LOCOG Sustainable Sourcing Code that relate to packaging design and materials selection.

  3. Type B Drum packages

    International Nuclear Information System (INIS)

    Edwards, W.S.

    1995-11-01

    The Type B Drum package is a container in which a single drum containing Type B quantities of radioactive material will be packaged for shipment. The Type B Drum containers are being developed to fill a void in the packaging and transportation capabilities of the US Department of Energy (DOE), as no double containment packaging for single drums of Type B radioactive material is currently available. Several multiple-drum containers and shielded casks presently exist. However, the size and weight of these containers present multiple operational challenges for single-drum shipments. The Type B Drum containers will offer one unshielded version and, if needed, two shielded versions, and will provide for the option of either single or double containment. The primary users of the Type B Drum container will be any organization with a need to ship single drums of Type B radioactive material. Those users include laboratories, waste retrieval facilities, emergency response teams, and small facilities

  4. Materials for advanced packaging

    CERN Document Server

    Wong, CP

    2017-01-01

    This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including: Lead-free solders Flip chip underfills Epoxy molding compounds Conductive adhesives Die attach adhesives/films Thermal interface materials (TIMS) Materials for fabricating embedded passives including capacitors, inductors, and resistors Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS) Contributors also review new and emerging technologies such as Light ...

  5. Food irradiation and packaging

    International Nuclear Information System (INIS)

    Kilcast, David

    1988-01-01

    This outline review was written for 'Food Manufacture'. It deals with the known effects of irradiation on current packaging materials (glass, cellulosics, organic polymers and metals), and their implications for the effective application of the process. (U.K.)

  6. FLEXIBLE FOOD PACKAGING LABORATORY

    Data.gov (United States)

    Federal Laboratory Consortium — This laboratory contains equipment to fabricate and test prototype packages of many types and sizes (e.g., bags, pouches, trays, cartons, etc.). This equipment can...

  7. BCRA R Package

    Science.gov (United States)

    BCRA is an R package that projects absolute risk of invasive breast cancer according to NCI’s Breast Cancer Risk Assessment Tool (BCRAT) algorithm for specified race/ethnic groups and age intervals.

  8. The ENSDF Java Package

    International Nuclear Information System (INIS)

    Sonzogni, A.A.

    2005-01-01

    A package of computer codes has been developed to process and display nuclear structure and decay data stored in the ENSDF (Evaluated Nuclear Structure Data File) library. The codes were written in an object-oriented fashion using the java language. This allows for an easy implementation across multiple platforms as well as deployment on web pages. The structure of the different java classes that make up the package is discussed as well as several different implementations

  9. Energy and packaging

    Energy Technology Data Exchange (ETDEWEB)

    Boustead, I; Hancock, G F

    1981-01-01

    Information is given on the energy and raw materials required in the production and use of containers used to package beer, cider, and carbonated soft drinks in the United Kingdom. Topics covered include: methodology of energy analysis, primary and secondary fuels, transport, packaging materials, including glass, aluminum, iron, steel, and tinplate, container production, including plastic bottles, distribution of empty containers, filling and packing, distribution, and disposal. (LEW)

  10. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    Washington TRU Solutions LLC

    2003-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: ''each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.'' They further state: ''each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SARP charges the WIPP management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with 10 CFR 71.11. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. This document provides the instructions to be followed to operate, maintain, and test the TRUPACT-II and HalfPACT packaging. The intent of these instructions is to standardize operations. All users will follow these instructions or equivalent instructions that assure operations are safe and meet the requirements of the SARPs

  11. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    Washington TRU Solutions LLC

    2002-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT Shipping Package, and directly related components. This document complies with the minimum requirements as specified in TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event there is a conflict between this document and the SARP or C of C, the SARP and/or C of C shall govern. C of Cs state: ''each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.'' They further state: ''each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SAR P charges the WIPP Management and Operation (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with 10 CFR 71.11. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. This document details the instructions to be followed to operate, maintain, and test the TRUPACT-II and HalfPACT packaging. The intent of these instructions is to standardize these operations. All users will follow these instructions or equivalent instructions that assure operations are safe and meet the requirements of the SARPs

  12. Comparative Packaging Study

    Science.gov (United States)

    Perchonok, Michele H.; Oziomek, Thomas V.

    2009-01-01

    Future long duration manned space flights beyond low earth orbit will require the food system to remain safe, acceptable and nutritious. Development of high barrier food packaging will enable this requirement by preventing the ingress and egress of gases and moisture. New high barrier food packaging materials have been identified through a trade study. Practical application of this packaging material within a shelf life test will allow for better determination of whether this material will allow the food system to meet given requirements after the package has undergone processing. The reason to conduct shelf life testing, using a variety of packaging materials, stems from the need to preserve food used for mission durations of several years. Chemical reactions that take place during longer durations may decrease food quality to a point where crew physical or psychological well-being is compromised. This can result in a reduction or loss of mission success. The rate of chemical reactions, including oxidative rancidity and staling, can be controlled by limiting the reactants, reducing the amount of energy available to drive the reaction, and minimizing the amount of water available. Water not only acts as a media for microbial growth, but also as a reactant and means by which two reactants may come into contact with each other. The objective of this study is to evaluate three packaging materials for potential use in long duration space exploration missions.

  13. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2008-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the pplication.' They further state: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations

  14. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2009-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' They further state: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations

  15. RH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2006-01-01

    The purpose of this program guidance document is to provide the technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the C of C shall govern. The C of C states: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' It further states: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M and O) Contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with 10 Code of Federal Regulations (CFR) 1.8, 'Deliberate Misconduct.' Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the U.S. Department of Energy (DOE) Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, 'Packaging and Transportation of Radioactive Material,' certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21, 'Reporting of Defects and Noncompliance,' regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these

  16. RH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2008-01-01

    The purpose of this program guidance document is to provide the technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package (also known as the 'RH-TRU 72-B cask') and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the C of C shall govern. The C of C states: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' It further states: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M and O) Contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8, 'Deliberate Misconduct.' Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the U.S. Department of Energy (DOE) Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, 'Packaging and Transportation of Radioactive Material,' certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21, 'Reporting of Defects and Noncompliance,' regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous

  17. Application of GA package in functional packaging

    Science.gov (United States)

    Belousova, D. A.; Noskova, E. E.; Kapulin, D. V.

    2018-05-01

    The approach to application program for the task of configuration of the elements of the commutation circuit for design of the radio-electronic equipment on the basis of the genetic algorithm is offered. The efficiency of the used approach for commutation circuits with different characteristics for computer-aided design on radio-electronic manufacturing is shown. The prototype of the computer-aided design subsystem on the basis of a package GA for R with a set of the general functions for optimization of multivariate models is programmed.

  18. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2005-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: ''each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.'' They further state: ''each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SARP charges the Waste Isolation Pilot Plant (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.

  19. Food Packaging Materials

    Science.gov (United States)

    1978-01-01

    The photos show a few of the food products packaged in Alure, a metallized plastic material developed and manufactured by St. Regis Paper Company's Flexible Packaging Division, Dallas, Texas. The material incorporates a metallized film originally developed for space applications. Among the suppliers of the film to St. Regis is King-Seeley Thermos Company, Winchester, Ma'ssachusetts. Initially used by NASA as a signal-bouncing reflective coating for the Echo 1 communications satellite, the film was developed by a company later absorbed by King-Seeley. The metallized film was also used as insulating material for components of a number of other spacecraft. St. Regis developed Alure to meet a multiple packaging material need: good eye appeal, product protection for long periods and the ability to be used successfully on a wide variety of food packaging equipment. When the cost of aluminum foil skyrocketed, packagers sought substitute metallized materials but experiments with a number of them uncovered problems; some were too expensive, some did not adequately protect the product, some were difficult for the machinery to handle. Alure offers a solution. St. Regis created Alure by sandwiching the metallized film between layers of plastics. The resulting laminated metallized material has the superior eye appeal of foil but is less expensive and more easily machined. Alure effectively blocks out light, moisture and oxygen and therefore gives the packaged food long shelf life. A major packaging firm conducted its own tests of the material and confirmed the advantages of machinability and shelf life, adding that it runs faster on machines than materials used in the past and it decreases product waste; the net effect is increased productivity.

  20. Redefining reliability

    International Nuclear Information System (INIS)

    Paulson, S.L.

    1995-01-01

    Want to buy some reliability? The question would have been unthinkable in some markets served by the natural gas business even a few years ago, but in the new gas marketplace, industrial, commercial and even some residential customers have the opportunity to choose from among an array of options about the kind of natural gas service they need--and are willing to pay for. The complexities of this brave new world of restructuring and competition have sent the industry scrambling to find ways to educate and inform its customers about the increased responsibility they will have in determining the level of gas reliability they choose. This article discusses the new options and the new responsibilities of customers, the needed for continuous education, and MidAmerican Energy Company's experiment in direct marketing of natural gas

  1. Food packages for Space Shuttle

    Science.gov (United States)

    Fohey, M. F.; Sauer, R. L.; Westover, J. B.; Rockafeller, E. F.

    1978-01-01

    The paper reviews food packaging techniques used in space flight missions and describes the system developed for the Space Shuttle. Attention is directed to bite-size food cubes used in Gemini, Gemini rehydratable food packages, Apollo spoon-bowl rehydratable packages, thermostabilized flex pouch for Apollo, tear-top commercial food cans used in Skylab, polyethylene beverage containers, Skylab rehydratable food package, Space Shuttle food package configuration, duck-bill septum rehydration device, and a drinking/dispensing nozzle for Space Shuttle liquids. Constraints and testing of packaging is considered, a comparison of food package materials is presented, and typical Shuttle foods and beverages are listed.

  2. Design for Reliability of Wafer Level MEMS packaging

    NARCIS (Netherlands)

    Zaal, J.J.M.

    2012-01-01

    The world has seen an unrivaled spread of semiconductor technology into virtually any part of society. The main enablers of this semiconductor rush are the decreasing feature size and the constantly decreasing costs of semiconductors. The decreasing costs of semiconductors in general are caused by

  3. Microsystem reliability: Polymer adhesive and coating materials for packaging

    DEFF Research Database (Denmark)

    Janting, Jakob

    aggressive surroundings. Focus is on how the adhesion of protective polymer adhesives and coatings can be characterized theoretically and practically and optimized regarding intrinsic properties, the surroundings and their mutual influences. The main conclusion is that the mutual influences make a system...

  4. On the epoxy moulding compound aging effect on package reliability

    NARCIS (Netherlands)

    Noijen, S.P.M.; Engelen, R.A.B.; Martens, J.; Opran, A.; Sluis, van der O.

    2009-01-01

    Most semi-conductor devices are encapsulated by epoxy moulding compound (EMC) material. Even after curing at the prescribed temperature and time in accordance with the supplier's curing specifications often the product is not yet 100% fully cured. As a consequence, the curing process of a product

  5. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2006-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' They further state: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant| (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations(CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations

  6. CH Packaging Program Guidance

    International Nuclear Information System (INIS)

    2007-01-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: 'each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application.' They further state: 'each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application.' Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M and O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) 71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations

  7. Welding robot package; Arc yosetsu robot package

    Energy Technology Data Exchange (ETDEWEB)

    Nishikawa, S. [Yaskawa Electric Corp., Kitakyushu (Japan)

    1998-09-01

    For the conventional high-speed welding robot, the welding current was controlled mainly for reducing the spatters during short circuits and for stabilizing the beads by the periodic short circuits. However, an increase of deposition amount in response to the speed is required for the high-speed welding. Large-current low-spatter welding current region control was added. Units were integrated into a package by which the arc length is kept in short without dispersion of arc length for welding without defects such as undercut and unequal beads. In automobile industry, use of aluminum parts is extended for the light weight. The welding is very difficult, and automation is not so progressing in spite of the poor environment. Buckling of welding wire is easy to occur, and supply of wire is obstructed by the deposition of chipped powders on the torch cable, which stay within the contact chip resulting in the deposition. Dislocation of locus is easy to occur at the corner of rectangular pipe during the welding. By improving these troubles, an aluminum MIG welding robot package has been developed. 13 figs.

  8. High pressure, high current, low inductance, high reliability sealed terminals

    Science.gov (United States)

    Hsu, John S [Oak Ridge, TN; McKeever, John W [Oak Ridge, TN

    2010-03-23

    The invention is a terminal assembly having a casing with at least one delivery tapered-cone conductor and at least one return tapered-cone conductor routed there-through. The delivery and return tapered-cone conductors are electrically isolated from each other and positioned in the annuluses of ordered concentric cones at an off-normal angle. The tapered cone conductor service can be AC phase conductors and DC link conductors. The center core has at least one service conduit of gate signal leads, diagnostic signal wires, and refrigerant tubing routed there-through. A seal material is in direct contact with the casing inner surface, the tapered-cone conductors, and the service conduits thereby hermetically filling the interstitial space in the casing interior core and center core. The assembly provides simultaneous high-current, high-pressure, low-inductance, and high-reliability service.

  9. Monolithic microwave integrated circuits: Interconnections and packaging considerations

    Science.gov (United States)

    Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.

    1984-01-01

    Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

  10. Monolithic microwave integrated circuits: Interconnections and packaging considerations

    Science.gov (United States)

    Bhasin, K. B.; Downey, A. N.; Ponchak, G. E.; Romanofsky, R. R.; Anzic, G.; Connolly, D. J.

    Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance.

  11. Reliability of Power Electronic Converter Systems

    DEFF Research Database (Denmark)

    -link capacitance in power electronic converter systems; wind turbine systems; smart control strategies for improved reliability of power electronics system; lifetime modelling; power module lifetime test and state monitoring; tools for performance and reliability analysis of power electronics systems; fault...... for advancing the reliability, availability, system robustness, and maintainability of PECS at different levels of complexity. Drawing on the experience of an international team of experts, this book explores the reliability of PECS covering topics including an introduction to reliability engineering in power...... electronic converter systems; anomaly detection and remaining-life prediction for power electronics; reliability of DC-link capacitors in power electronic converters; reliability of power electronics packaging; modeling for life-time prediction of power semiconductor modules; minimization of DC...

  12. Waste package characterisation

    Energy Technology Data Exchange (ETDEWEB)

    Sannen, L.; Bruggeman, M.; Wannijn, J.P

    1998-09-01

    Radioactive wastes originating from the hot labs of the Belgian Nuclear Research Centre SCK-CEN contain a wide variety of radiotoxic substances. The accurate characterisation of the short- and long-term radiotoxic components is extremely difficult but required in view of geological disposal. This paper describes the methodology which was developed and adopted to characterise the high- and medium-level waste packages at the SCK-CEN hot laboratories. The proposed method is based on the estimation of the fuel inventory evacuated in a particular waste package; a calculation of the relative fission product contribution on the fuel fabrication and irradiation footing; a comparison of the calculated, as expected, dose rate and the real measured dose rate of the waste package. To cope with the daily practice an appropriate fuel inventory estimation route, a user friendly computer programme for fission product and corresponding dose rate calculation, and a simple dose rate measurement method have been developed and implemented.

  13. Waste package characterisation

    International Nuclear Information System (INIS)

    Sannen, L.; Bruggeman, M.; Wannijn, J.P.

    1998-09-01

    Radioactive wastes originating from the hot labs of the Belgian Nuclear Research Centre SCK-CEN contain a wide variety of radiotoxic substances. The accurate characterisation of the short- and long-term radiotoxic components is extremely difficult but required in view of geological disposal. This paper describes the methodology which was developed and adopted to characterise the high- and medium-level waste packages at the SCK-CEN hot laboratories. The proposed method is based on the estimation of the fuel inventory evacuated in a particular waste package; a calculation of the relative fission product contribution on the fuel fabrication and irradiation footing; a comparison of the calculated, as expected, dose rate and the real measured dose rate of the waste package. To cope with the daily practice an appropriate fuel inventory estimation route, a user friendly computer programme for fission product and corresponding dose rate calculation, and a simple dose rate measurement method have been developed and implemented

  14. SPHINX experimenters information package

    International Nuclear Information System (INIS)

    Zarick, T.A.

    1996-08-01

    This information package was prepared for both new and experienced users of the SPHINX (Short Pulse High Intensity Nanosecond X-radiator) flash X-Ray facility. It was compiled to help facilitate experiment design and preparation for both the experimenter(s) and the SPHINX operational staff. The major areas covered include: Recording Systems Capabilities,Recording System Cable Plant, Physical Dimensions of SPHINX and the SPHINX Test cell, SPHINX Operating Parameters and Modes, Dose Rate Map, Experiment Safety Approval Form, and a Feedback Questionnaire. This package will be updated as the SPHINX facilities and capabilities are enhanced

  15. Nirex - The complete package

    International Nuclear Information System (INIS)

    Carr, N.A.; Rarok, M.

    2002-01-01

    Through continuous interaction with its customers, Nirex had identified the need for a comprehensive range of waste containers, reflecting the variety of wastes and operational undertakings. The current range consists of five standard containers. Standardisation is introduced across all waste packages to enable the safe and efficient operation of future waste management facilities. The practical lessons learned during the development of standard containers are in turn reflected in the container design work that Nirex has undertaken. They are also fed into the advice given to customers during evaluation of waste packaging proposals. (author)

  16. Ada Namelist Package

    Science.gov (United States)

    Klumpp, Allan R.

    1991-01-01

    Ada Namelist Package, developed for Ada programming language, enables calling program to read and write FORTRAN-style namelist files. Features are: handling of any combination of types defined by user; ability to read vectors, matrices, and slices of vectors and matrices; handling of mismatches between variables in namelist file and those in programmed list of namelist variables; and ability to avoid searching entire input file for each variable. Principle benefits derived by user: ability to read and write namelist-readable files, ability to detect most file errors in initialization phase, and organization keeping number of instantiated units to few packages rather than to many subprograms.

  17. Packaging Solutions : Delivering customer value through Logistical Packaging: A Case Study at Stora Enso Packaging

    OpenAIRE

    Shan, Kun; Julius, Joezer

    2015-01-01

    AbstractBackground;Despite of the significant role of packaging within logistics and supply chain management, packaging is infrequently studied as focal point in supply chain. Most of the previous logistics research studies tend to explain the integration between packaging and logistics through logistical packaging. In very rare cases, the studies mentioned about customer value. Therefore the major disadvantage of these studies is that, they didn’t consider logistical packaging and customer v...

  18. AN ADA NAMELIST PACKAGE

    Science.gov (United States)

    Klumpp, A. R.

    1994-01-01

    The Ada Namelist Package, developed for the Ada programming language, enables a calling program to read and write FORTRAN-style namelist files. A namelist file consists of any number of assignment statements in any order. Features of the Ada Namelist Package are: the handling of any combination of user-defined types; the ability to read vectors, matrices, and slices of vectors and matrices; the handling of mismatches between variables in the namelist file and those in the programmed list of namelist variables; and the ability to avoid searching the entire input file for each variable. The principle user benefits of this software are the following: the ability to write namelist-readable files, the ability to detect most file errors in the initialization phase, a package organization that reduces the number of instantiated units to a few packages rather than to many subprograms, a reduced number of restrictions, and an increased execution speed. The Ada Namelist reads data from an input file into variables declared within a user program. It then writes data from the user program to an output file, printer, or display. The input file contains a sequence of assignment statements in arbitrary order. The output is in namelist-readable form. There is a one-to-one correspondence between namelist I/O statements executed in the user program and variables read or written. Nevertheless, in the input file, mismatches are allowed between assignment statements in the file and the namelist read procedure statements in the user program. The Ada Namelist Package itself is non-generic. However, it has a group of nested generic packages following the nongeneric opening portion. The opening portion declares a variety of useraccessible constants, variables and subprograms. The subprograms are procedures for initializing namelists for reading, reading and writing strings. The subprograms are also functions for analyzing the content of the current dataset and diagnosing errors. Two nested

  19. Harsh-Environment Packaging for Downhole Gas and Oil Exploration

    Energy Technology Data Exchange (ETDEWEB)

    Shubhra Bansal; Junghyun Cho; Kevin Durocher; Chris Kapusta; Aaron Knobloch; David Shaddock; Harry Schoeller; Hua Xia

    2007-08-31

    This research into new packaging materials and methods for elevated temperatures and harsh environment electronics focused on gaining a basic understanding of current state-of-the-art in electronics packaging used in industry today, formulating the thermal-mechanical models of the material interactions and developing test structures to confirm these models. Discussions were initiated with the major General Electric (GE) businesses that currently sell into markets requiring high temperature electronics and packaging. They related the major modes of failure they encounter routinely and the hurdles needed to be overcome in order to improve the temperature specifications of these products. We consulted with our GE business partners about the reliability specifications and investigated specifications and guidelines that from IPC and the SAE body that is currently developing guidelines for electronics package reliability. Following this, a risk analysis was conducted for the program to identify the critical risks which need to be mitigated in order to demonstrate a flex-based packaging approach under these conditions. This process identified metal/polyimide adhesion, via reliability for flex substrates and high temperature interconnect as important technical areas for reliability improvement.

  20. Shielding Calculations on Waste Packages – The Limits and Possibilities of different Calculation Methods by the example of homogeneous and inhomogeneous Waste Packages

    OpenAIRE

    Adams Mike; Smalian Silva

    2017-01-01

    For nuclear waste packages the expected dose rates and nuclide inventory are beforehand calculated. Depending on the package of the nuclear waste deterministic programs like MicroShield® provide a range of results for each type of packaging. Stochastic programs like “Monte-Carlo N-Particle Transport Code System” (MCNP®) on the other hand provide reliable results for complex geometries. However this type of program requires a fully trained operator and calculations are time consuming. The prob...

  1. Radioactive waste disposal package

    Science.gov (United States)

    Lampe, Robert F.

    1986-11-04

    A radioactive waste disposal package comprising a canister for containing vitrified radioactive waste material and a sealed outer shell encapsulating the canister. A solid block of filler material is supported in said shell and convertible into a liquid state for flow into the space between the canister and outer shell and subsequently hardened to form a solid, impervious layer occupying such space.

  2. ROBATEL RS 24 packaging

    International Nuclear Information System (INIS)

    Robatel, M.; Bochard, C.

    1986-01-01

    The ROBATEL RS 24 packaging for light-water reactor fuel assemblies is discussed. The cask uses a strength frame of carbon steel sheets, lead gamma ray shielding, neutron shielding of aluminous concrete, a thermal protection system for the gamma shielding, and a natural convection thermal transfer system

  3. The Swarm Magnetometry Package

    DEFF Research Database (Denmark)

    Merayo, José M.G.; Jørgensen, John Leif; Friis-Christensen, Eigil

    2008-01-01

    The Swarm mission under the ESA's Living Planet Programme is planned for launch in 2010 and consists of a constellation of three satellites at LEO. The prime objective of Swarm is to measure the geomagnetic field with unprecedented accuracy in space and time. The magnetometry package consists...

  4. Learning Activity Package, Algebra.

    Science.gov (United States)

    Evans, Diane

    A set of ten teacher-prepared Learning Activity Packages (LAPs) in beginning algebra and nine in intermediate algebra, these units cover sets, properties of operations, number systems, open expressions, solution sets of equations and inequalities in one and two variables, exponents, factoring and polynomials, relations and functions, radicals,…

  5. Geothermal Greenhouse Information Package

    Energy Technology Data Exchange (ETDEWEB)

    Rafferty, K. [P.E.; Boyd, T. [ed.

    1997-01-01

    This package of information is intended to provide a foundation of background information for developers of geothermal greenhouses. The material is divided into seven sections covering such issues as crop culture and prices, operating costs for greenhouses, heating system design, vendors and a list of other sources of information.

  6. Openability of tamperproof packaging

    NARCIS (Netherlands)

    Del Castillo C., A.; Wever, R.; Buijs, P.J.; Stevels, A.

    2007-01-01

    Communication, product protection and presentation are three key aspects in the world of packaging nowadays. Due to a retail landscape consisting of large stores, displaying packed products on the shelves in self-service environments, these aspects become increasingly important, not only for Fast

  7. Packaging LLW and ILW

    International Nuclear Information System (INIS)

    Flowers, R.H.; Owen, R.G.

    1991-01-01

    Low level waste (LLW) accounts for 70-80% by volume of all radioactive wastes produced by the nuclear industry. It has low specific activity, negligible actinide content and requires little, if any, shielding to protect workers. Volume reduction for LLW of high volume but low density may be achieved by incineration and compaction as appropriate, before packaging for disposal by near surface burial. Intermediate level waste (ILW) is treated and packed to convert it into a stable form to minimize any release of activity and make handling easier. The matrix chosen for immobilization, usually cement, polymers or bitumen, depends on the nature of the waste and the acceptance criteria of the disposal facility. The special case of LLW and ILW which will arise from reactor decommissioning is discussed. Packaging methods adopted by individual countries are reviewed. The range of costs involved for packaging ILW is indicated. There is no international consensus on the performance required from packaged waste to ensure its suitability both for interim storage and final disposal. (UK)

  8. Aquaculture Information Package

    Energy Technology Data Exchange (ETDEWEB)

    Boyd, T.; Rafferty, K. [editors

    1998-01-01

    This package of information is intended to provide background to developers of geothermal aquaculture projects. The material is divided into eight sections and includes information on market and price information for typical species, aquaculture water quality issues, typical species culture information, pond heat loss calculations, an aquaculture glossary, regional and university aquaculture offices and state aquaculture permit requirements.

  9. CH Packaging Maintenance Manual

    International Nuclear Information System (INIS)

    Washington TRU Solutions

    2002-01-01

    This procedure provides instructions for performing inner containment vessel (ICV) and outer containment vessel (OCV) maintenance and periodic leakage rate testing on the following packaging seals and corresponding seal surfaces using a nondestructive helium (He) leak test. In addition, this procedure provides instructions for performing ICV and OCV structural pressure tests

  10. Printer Graphics Package

    Science.gov (United States)

    Blanchard, D. C.

    1986-01-01

    Printer Graphics Package (PGP) is tool for making two-dimensional symbolic plots on line printer. PGP created to support development of Heads-Up Display (HUD) simulation. Standard symbols defined with HUD in mind. Available symbols include circle, triangle, quadrangle, window, line, numbers, and text. Additional symbols easily added or built up from available symbols.

  11. Type B drum packages

    International Nuclear Information System (INIS)

    McCoy, J.C.

    1994-08-01

    The Type B drum packages (TBD) are conceptualized as a family of containers in which a single 208 L or 114 L (55 gal or 30 gal) drum containing Type B quantities of radioactive material (RAM) can be packaged for shipment. The TBD containers are being developed to fill a void in the packaging and transportation capabilities of the U.S. Department of Energy as no container packaging single drums of Type B RAM exists offering double containment. Several multiple-drum containers currently exist, as well as a number of shielded casks, but the size and weight of these containers present many operational challenges for single-drum shipments. As an alternative, the TBD containers will offer up to three shielded versions (light, medium, and heavy) and one unshielded version, each offering single or optional double containment for a single drum. To reduce operational complexity, all versions will share similar design and operational features where possible. The primary users of the TBD containers are envisioned to be any organization desiring to ship single drums of Type B RAM, such as laboratories, waste retrieval activities, emergency response teams, etc. Currently, the TBD conceptual design is being developed with the final design and analysis to be completed in 1995 to 1996. Testing and certification of the unshielded version are planned to be completed in 1996 to 1997 with production to begin in 1997 to 1998

  12. Waste disposal package

    Science.gov (United States)

    Smith, M.J.

    1985-06-19

    This is a claim for a waste disposal package including an inner or primary canister for containing hazardous and/or radioactive wastes. The primary canister is encapsulated by an outer or secondary barrier formed of a porous ceramic material to control ingress of water to the canister and the release rate of wastes upon breach on the canister. 4 figs.

  13. Packaging of structural health monitoring components

    Science.gov (United States)

    Kessler, Seth S.; Spearing, S. Mark; Shi, Yong; Dunn, Christopher T.

    2004-07-01

    Structural Health Monitoring (SHM) technologies have the potential to realize economic benefits in a broad range of commercial and defense markets. Previous research conducted by Metis Design and MIT has demonstrated the ability of Lamb waves methods to provide reliable information regarding the presence, location and type of damage in composite specimens. The present NSF funded program was aimed to study manufacturing, packaging and interface concepts for critical SHM components. The intention is to be able to cheaply manufacture robust actuating/sensing devices, and isolate them from harsh operating environments including natural, mechanical, or electrical extremes. Currently the issues related to SHM system durability have remained undressed. During the course of this research several sets of test devices were fabricated and packaged to protect the piezoelectric component assemblies for robust operation. These assemblies were then tested in hot and wet conditions, as well as in electrically noisy environments. Future work will aim to package the other supporting components such as the battery and wireless chip, as well as integrating all of these components together for operation. SHM technology will enable the reduction or complete elimination of scheduled inspections, and will allow condition-based maintenance for increased reliability and reduced overall life-cycle costs.

  14. Reliability databases: State-of-the-art and perspectives

    DEFF Research Database (Denmark)

    Akhmedjanov, Farit

    2001-01-01

    The report gives a history of development and an overview of the existing reliability databases. This overview also describes some other (than computer databases) sources of reliability and failures information, e.g. reliability handbooks, but the mainattention is paid to standard models...... and software packages containing the data mentioned. The standards corresponding to collection and exchange of reliability data are observed too. Finally, perspective directions in such data sources development areshown....

  15. Packaging of photodetector modules for 100 Gbit/s applications using electromagnetic simulations

    DEFF Research Database (Denmark)

    Jiang, Chenhui; Krozer, Viktor; Bach, H.-G.

    2009-01-01

    In this paper we demonstrate ultra-broadband packaging and interconnection designs for photodetector (PD) modules for 100 Gbit/s data transmission applications. The design of packaging and interconnection structures is based on accurate and reliable 3D electromagnetic (EM) simulations. Mode...... conversion loss due to mode mismatch is identified as the dominant effect of limiting bandwidth of packaged modules. Finally, PD chips are successfully packaged by using wire-bonding technology and conventional coplanar waveguide (CPW) for avoiding mode mismatch. The new packaged PD module demonstrates...

  16. Hazardous materials package performance regulations

    International Nuclear Information System (INIS)

    Russell, N.A.; Glass, R.E.; McClure, J.D.; Finley, N.C.

    1992-01-01

    The hazardous materials (hazmat) packaging development and certification process is currently defined by two different regulatory philosophies, one based on specification packagings and the other based on performance standards. With specification packagings, a packaging is constructed according to an agreed set of design specifications. In contrast, performance standards do not specify the packaging design; they specify performance standards that a packaging design must be able to pass before it can be certified for transport. The packaging can be designed according to individual needs as long as it meets these performance standards. Performance standards have been used nationally and internationally for about 40 years to certify radioactive materials (RAM) packagings. It is reasonable to state that for RAM transport, performance specifications have maintained transport safety. A committee of United Nation's experts recommended the performance standard philosophy as the preferred regulation method for hazmat packaging. Performance standards for hazmat packagings smaller than 118 gallons have been adopted in 49CFR178. Packagings for materials that are classified as toxic-by-inhalation must comply with the performance standards by October 1, 1993, and packagings for all other classes of hazardous materials covered must comply by October 1, 1996. For packages containing bulk (in excess of 188 gallons) quantities of materials that are extremely toxic by inhalation, there currently are no performance requirements. This paper discusses a Hazmat Packaging Performance Evaluation (HPPE) project to look at the subset of bulk packagings that are larger than 2000 gallons. The objectives of this project are the evaluate current hazmat specification packagings and develop supporting documentation for determining performance requirements for packagings in excess of 2000 gallons that transport hazardous materials that have been classified as extremely toxic by inhalation (METBI)

  17. In-Package Chemistry Abstraction

    Energy Technology Data Exchange (ETDEWEB)

    P.S. Domski

    2003-07-21

    The work associated with the development of this model report was performed in accordance with the requirements established in ''Technical Work Plan for Waste Form Degradation Modeling, Testing, and Analyses in Support of SR and LA'' (BSC 2002a). The in-package chemistry model and in-package chemistry model abstraction are developed to predict the bulk chemistry inside of a failed waste package and to provide simplified expressions of that chemistry. The purpose of this work is to provide the abstraction model to the Performance Assessment Project and the Waste Form Department for development of geochemical models of the waste package interior. The scope of this model report is to describe the development and validation of the in-package chemistry model and in-package chemistry model abstraction. The in-package chemistry model will consider chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) and codisposed high-level waste glass (HLWG) and N Reactor spent fuel (CDNR). The in-package chemistry model includes two sub-models, the first a water vapor condensation (WVC) model, where water enters a waste package as vapor and forms a film on the waste package components with subsequent film reactions with the waste package materials and waste form--this is a no-flow model, the reacted fluids do not exit the waste package via advection. The second sub-model of the in-package chemistry model is the seepage dripping model (SDM), where water, water that may have seeped into the repository from the surrounding rock, enters a failed waste package and reacts with the waste package components and waste form, and then exits the waste package with no accumulation of reacted water in the waste package. Both of the submodels of the in-package chemistry model are film models in contrast to past in-package chemistry models where all of the waste package pore space was filled with water. The

  18. In-Package Chemistry Abstraction

    International Nuclear Information System (INIS)

    P.S. Domski

    2003-01-01

    The work associated with the development of this model report was performed in accordance with the requirements established in ''Technical Work Plan for Waste Form Degradation Modeling, Testing, and Analyses in Support of SR and LA'' (BSC 2002a). The in-package chemistry model and in-package chemistry model abstraction are developed to predict the bulk chemistry inside of a failed waste package and to provide simplified expressions of that chemistry. The purpose of this work is to provide the abstraction model to the Performance Assessment Project and the Waste Form Department for development of geochemical models of the waste package interior. The scope of this model report is to describe the development and validation of the in-package chemistry model and in-package chemistry model abstraction. The in-package chemistry model will consider chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) and codisposed high-level waste glass (HLWG) and N Reactor spent fuel (CDNR). The in-package chemistry model includes two sub-models, the first a water vapor condensation (WVC) model, where water enters a waste package as vapor and forms a film on the waste package components with subsequent film reactions with the waste package materials and waste form--this is a no-flow model, the reacted fluids do not exit the waste package via advection. The second sub-model of the in-package chemistry model is the seepage dripping model (SDM), where water, water that may have seeped into the repository from the surrounding rock, enters a failed waste package and reacts with the waste package components and waste form, and then exits the waste package with no accumulation of reacted water in the waste package. Both of the submodels of the in-package chemistry model are film models in contrast to past in-package chemistry models where all of the waste package pore space was filled with water. The current in-package

  19. Packaging design criteria for the Hanford Ecorok Packaging

    International Nuclear Information System (INIS)

    Mercado, M.S.

    1996-01-01

    The Hanford Ecorok Packaging (HEP) will be used to ship contaminated water purification filters from K Basins to the Central Waste Complex. This packaging design criteria documents the design of the HEP, its intended use, and the transportation safety criteria it is required to meet. This information will serve as a basis for the safety analysis report for packaging

  20. An Introduction To Reliability

    International Nuclear Information System (INIS)

    Park, Kyoung Su

    1993-08-01

    This book introduces reliability with definition of reliability, requirement of reliability, system of life cycle and reliability, reliability and failure rate such as summary, reliability characteristic, chance failure, failure rate which changes over time, failure mode, replacement, reliability in engineering design, reliability test over assumption of failure rate, and drawing of reliability data, prediction of system reliability, conservation of system, failure such as summary and failure relay and analysis of system safety.

  1. Advanced Packaging Materials and Techniques for High Power TR Module: Standard Flight vs. Advanced Packaging

    Science.gov (United States)

    Hoffman, James Patrick; Del Castillo, Linda; Miller, Jennifer; Jenabi, Masud; Hunter, Donald; Birur, Gajanana

    2011-01-01

    The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires advances in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and compared to standard technologies.

  2. Dual Use Packaging, Phase I

    Data.gov (United States)

    National Aeronautics and Space Administration — NASA seeks down-weighted packaging compatible with microwave preparation and perhaps high hydrostatic pressure processing. New packaging must satisfy NASA's 3-year...

  3. Food packaging history and innovations.

    Science.gov (United States)

    Risch, Sara J

    2009-09-23

    Food packaging has evolved from simply a container to hold food to something today that can play an active role in food quality. Many packages are still simply containers, but they have properties that have been developed to protect the food. These include barriers to oxygen, moisture, and flavors. Active packaging, or that which plays an active role in food quality, includes some microwave packaging as well as packaging that has absorbers built in to remove oxygen from the atmosphere surrounding the product or to provide antimicrobials to the surface of the food. Packaging has allowed access to many foods year-round that otherwise could not be preserved. It is interesting to note that some packages have actually allowed the creation of new categories in the supermarket. Examples include microwave popcorn and fresh-cut produce, which owe their existence to the unique packaging that has been developed.

  4. Destructive testing of transport packaging. Quality assurance applied to transport packaging in the USA

    International Nuclear Information System (INIS)

    Barker, R.F.

    1976-01-01

    This paper discusses several aspects of quality assurance as applied to packaging, including such requirements for an adequate quality assurance program as assignment of responsibilities, inspections, and audits. In certain cases, we have determined the margin of safety inherent in specific package designs. Testing of packaging to destruction, by subjecting it to conditions far beyond the present accident criteria, was carried out to establish the levels of impact, puncture, crush, and fire at which present designs would fail. A second area in which the Nuclear Regulatory Commission has applied quality assurance is qualification testing. The standards for testing prototypes require essentially no loss of contents under the specified accident test conditions. Qualifying a design with an acceptable degree of reliability by testing it at the specified stress levels with no measurable effect requires large numbers of samples to be tested. Testing the prototype under conditions well above the criteria is shown to offer one of the most effective means of demonstrating the adequacy of a design. Scenario tests, i.e., staged accidents or full-scale tests in which vehicles with samples of packages on board are crashed under specified conditions, in most cases present singular points on a curve. One-point tests in most cases will disprove a package design if it fails but may not confirm that a design will not fail. At the same time, much information and some public assurances can be obtained from such tests. (author)

  5. Fair Package Assignment

    Science.gov (United States)

    Lahaie, Sébastien; Parkes, David C.

    We consider the problem of fair allocation in the package assignment model, where a set of indivisible items, held by single seller, must be efficiently allocated to agents with quasi-linear utilities. A fair assignment is one that is efficient and envy-free. We consider a model where bidders have superadditive valuations, meaning that items are pure complements. Our central result is that core outcomes are fair and even coalition-fair over this domain, while fair distributions may not even exist for general valuations. Of relevance to auction design, we also establish that the core is equivalent to the set of anonymous-price competitive equilibria, and that superadditive valuations are a maximal domain that guarantees the existence of anonymous-price competitive equilibrium. Our results are analogs of core equivalence results for linear prices in the standard assignment model, and for nonlinear, non-anonymous prices in the package assignment model with general valuations.

  6. Anticounterfeit packaging technologies

    Directory of Open Access Journals (Sweden)

    Ruchir Y Shah

    2010-01-01

    Full Text Available Packaging is the coordinated system that encloses and protects the dosage form. Counterfeit drugs are the major cause of morbidity, mortality, and failure of public interest in the healthcare system. High price and well-known brands make the pharma market most vulnerable, which accounts for top priority cardiovascular, obesity, and antihyperlipidemic drugs and drugs like sildenafil. Packaging includes overt and covert technologies like barcodes, holograms, sealing tapes, and radio frequency identification devices to preserve the integrity of the pharmaceutical product. But till date all the available techniques are synthetic and although provide considerable protection against counterfeiting, have certain limitations which can be overcome by the application of natural approaches and utilization of the principles of nanotechnology.

  7. Package materials, waste form

    International Nuclear Information System (INIS)

    Anon.

    1980-01-01

    The schedules for waste package development for the various host rocks were presented. The waste form subtask activities were reviewed, with the papers focusing on high-level waste, transuranic waste, and spent fuel. The following ten papers were presented: (1) Waste Package Development Approach; (2) Borosilicate Glass as a Matrix for Savannah River Plant Waste; (3) Development of Alternative High-Level Waste Forms; (4) Overview of the Transuranic Waste Management Program; (5) Assessment of the Impacts of Spent Fuel Disassembly - Alternatives on the Nuclear Waste Isolation System; (6) Reactions of Spent Fuel and Reprocessing Waste Forms with Water in the Presence of Basalt; (7) Spent Fuel Stabilizer Screening Studies; (8) Chemical Interactions of Shale Rock, Prototype Waste Forms, and Prototype Canister Metals in a Simulated Wet Repository Environment; (9) Impact of Fission Gas and Volatiles on Spent Fuel During Geologic Disposal; and (10) Spent Fuel Assembly Decay Heat Measurement and Analysis

  8. RH Packaging Program Guidance

    International Nuclear Information System (INIS)

    Washington TRU Solutions, LLC

    2003-01-01

    The purpose of this program guidance document is to provide technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the SARP and/or C of C shall govern. The C of C states: ''...each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, ''Operating Procedures,'' of the application.'' It further states: ''...each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, ''Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M and O) contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC approved, users need to be familiar with 10 CFR (section) 71.11, ''Deliberate Misconduct.'' Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. This document details the instructions to be followed to operate, maintain, and test the RH-TRU 72-B packaging. This Program Guidance standardizes instructions for all users. Users shall follow these instructions. Following these instructions assures that operations are safe and meet the requirements of the SARP. This document is available on the Internet at: ttp://www.ws/library/t2omi/t2omi.htm. Users are responsible for ensuring they are using the current revision and change notices. Sites may prepare their own document using the word

  9. Irradiation of packaged food

    International Nuclear Information System (INIS)

    Kilcast, D.

    1990-01-01

    Food irradiation is used to improve the safety of food by killing insects and microorganisms, to inhibit sprouting in crops such as onions and potatoes and to control ripening in agricultural produce. In order to prevent re-infestation and re-contamination it is essential that the food is suitably packed. Consequently, the packaging material is irradiated whilst in contact with the food, and it is important that the material is resistant to radiation-induced changes. In this paper the nature of the irradiation process is reviewed briefly, together with the known effects of irradiation on packaging materials and their implications for the effective application of food irradiation. Recent research carried out at the Leatherhead Food RA on the possibility of taint transfer into food is described. (author)

  10. Technology transfer packages

    International Nuclear Information System (INIS)

    Mizon, G.A.; Bleasdale, P.A.

    1994-01-01

    Nuclear power is firmly established in many developed countries'energy policies and is being adopted by emerging nations as an attractive way of gaining energy self sufficiency. The early users of nuclear power had to develop the technology that they needed, which now, through increasing world wide experience, has been rationalised to meet demanding economic and environmental pressures. These justifiable pressures, can lead to existing suppliers of nuclear services to consider changing to more appropriate technologies and for new suppliers to consider licensing proven technology rather then incurring the cost of developing new alternatives. The transfer of technology, under license, is made more straight forward if the owner conveniently groups appropriate technology into packages. This paper gives examples of 'Technology Packages' and suggests criteria for the specification, selection and contractual requirements to ensure successful licensing

  11. Amdahl 470 Chip Package

    CERN Multimedia

    1975-01-01

    In the late 70s the larger IBM computers were water cooled. Amdahl, an IBM competitor, invented an air cooling technology for it's computers. His company worked hard, developing a computer that was faster and less expensive than the IBM System/360 mainframe computer systems. This object contains an actual Amdahl series 470 computer logic chip with an air cooling device mounted on top. The package leads and cooling tower are gold-plated.

  12. Aquaculture information package

    Energy Technology Data Exchange (ETDEWEB)

    Boyd, T.; Rafferty, K.

    1998-08-01

    This package of information is intended to provide background information to developers of geothermal aquaculture projects. The material is divided into eight sections and includes information on market and price information for typical species, aquaculture water quality issues, typical species culture information, pond heat loss calculations, an aquaculture glossary, regional and university aquaculture offices and state aquaculture permit requirements. A bibliography containing 68 references is also included.

  13. The CASA Software Package

    Science.gov (United States)

    Petry, Dirk

    2018-03-01

    CASA is the standard science data analysis package for ALMA and VLA but it can also be used for the analysis of data from other observatories. In this talk, I will give an overview of the structure and features of CASA, who develops it, and the present status and plans, and then show typical analysis workflows for ALMA data with special emphasis on the handling of single dish data and its combination with interferometric data.

  14. The Ettention software package

    International Nuclear Information System (INIS)

    Dahmen, Tim; Marsalek, Lukas; Marniok, Nico; Turoňová, Beata; Bogachev, Sviatoslav; Trampert, Patrick; Nickels, Stefan; Slusallek, Philipp

    2016-01-01

    We present a novel software package for the problem “reconstruction from projections” in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. - Highlights: • Novel software package for “reconstruction from projections” in electron microscopy. • Support for high-resolution reconstructions on iterative reconstruction algorithms. • Support for CPU, GPU and Xeon Phi. • Integration in the IMOD software. • Platform for algorithm researchers: object oriented, modular design.

  15. The Ettention software package

    Energy Technology Data Exchange (ETDEWEB)

    Dahmen, Tim, E-mail: Tim.Dahmen@dfki.de [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Saarland University, 66123 Saarbrücken (Germany); Marsalek, Lukas [Eyen SE, Na Nivách 1043/16, 141 00 Praha 4 (Czech Republic); Saarland University, 66123 Saarbrücken (Germany); Marniok, Nico [Saarland University, 66123 Saarbrücken (Germany); Turoňová, Beata [Saarland University, 66123 Saarbrücken (Germany); IMPRS-CS, Max-Planck Institute for Informatics, Campus E 1.4, 66123 Saarbrücken (Germany); Bogachev, Sviatoslav [Saarland University, 66123 Saarbrücken (Germany); Trampert, Patrick; Nickels, Stefan [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Slusallek, Philipp [German Research Center for Artificial Intelligence GmbH (DFKI), 66123 Saarbrücken (Germany); Saarland University, 66123 Saarbrücken (Germany)

    2016-02-15

    We present a novel software package for the problem “reconstruction from projections” in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. - Highlights: • Novel software package for “reconstruction from projections” in electron microscopy. • Support for high-resolution reconstructions on iterative reconstruction algorithms. • Support for CPU, GPU and Xeon Phi. • Integration in the IMOD software. • Platform for algorithm researchers: object oriented, modular design.

  16. Ensuring socially responsible packaging design

    DEFF Research Database (Denmark)

    Geert Jensen, Birgitte

    Most consumers have experienced occasional problems with opening packaging. Tomato sauce from the tinned mackerel splattered all over the kitchen counter, the unrelenting pickle jar lid, and the package of sliced ham that cannot be opened without a knife or a pair of scissors. The research project...... "User‐friendly Packaging" aims to create a platform for developing more user‐friendly packaging. One intended outcome of the project is a guideline that industry can use in development efforts. The project also points the way for more extended collaboration between companies and design researchers. How...... can design research help industry in packaging innovation?...

  17. Packaging based on polymeric materials

    Directory of Open Access Journals (Sweden)

    Jovanović Slobodan M.

    2005-01-01

    Full Text Available In the past two years the consumption of common in the developed countries world wide (high tonnage polymers for packaging has approached a value of 50 wt.%. In the same period more than 50% of the packaging units on the world market were made of polymeric materials despite the fact that polymeric materials present 17 wt.% of all packaging materials. The basic properties of polymeric materials and their environmental and economical advantages, providing them such a position among packaging materials, are presented in this article. Recycling methods, as well as the development trends of polymeric packaging materials are also presented.

  18. Plutonium stabilization and packaging system

    International Nuclear Information System (INIS)

    1996-01-01

    This document describes the functional design of the Plutonium Stabilization and Packaging System (Pu SPS). The objective of this system is to stabilize and package plutonium metals and oxides of greater than 50% wt, as well as other selected isotopes, in accordance with the requirements of the DOE standard for safe storage of these materials for 50 years. This system will support completion of stabilization and packaging campaigns of the inventory at a number of affected sites before the year 2002. The package will be standard for all sites and will provide a minimum of two uncontaminated, organics free confinement barriers for the packaged material

  19. Mathematical and Simulation Modelling of Moisture Diffusion Mechanism during Plastic IC Packages Disassembly

    OpenAIRE

    Peng Mou; Dong Xiang; Guanghong Duan

    2013-01-01

    Reuse of plastic IC packages disassembled from printed circuit boards (PCBs) has significant environmental benefits and economic value. The interface delamination caused by moisture diffusion is the main failure mode of IC packages during the disassembling process, which greatly reduces the reusability and reliability of disassembled IC packages. Exploring moisture diffusion mechanism is a prerequisite to optimize prebaking processes before disassembling that is an effective way to avoid the ...

  20. Clinical information in drug package inserts in India

    Directory of Open Access Journals (Sweden)

    Shivkar Y

    2009-01-01

    Full Text Available Background: It is widely recognized that accurate and reliable product information is essential for the safe and effective use of medications. Pharmaceutical companies are the primary source of most drug information, including package inserts. Package inserts are printed leaflets accompanying marketed drug products and contain information approved by the regulatory agencies. Studies on package inserts in India, in 1996, had shown that crucial information was often missing and they lacked uniformity. Aim: To assess the presentation and completeness of clinically important information provided in the currently available package inserts in India. Materials and Methods: Package inserts accompanying allopathic drug products marketed by pharmaceutical companies in India were collected. These package inserts were analyzed for the content of clinically important information in various sections. Statistical Analysis: The results were expressed as absolute numbers and percentages. Results: Preliminary analyses revealed that most package inserts did contain information under headings, such as, therapeutic indications, contraindications, undesirable effects, etc., listed in the Drugs and Cosmetics Rules 1945. The findings indicated considerable improvement in package inserts since 1996. However, on critical evaluation it was revealed that clinically important information was not well presented and was often incomplete. Information with regard to pediatric and geriatric use was present in only 44% and 13% of the package inserts, respectively. Only five of the inserts had information on the most frequent adverse drug reactions associated with the drug. Also, information on interactions and overdosage was often missing. Conclusion: Although the package inserts appear to have improved over the past decade there is still a definite need to further refine the clinical information contained, to minimize the risks to patients. This could be brought about by self

  1. Reliability and degradation of oxide VCSELs due to reaction to atmospheric water vapor

    Science.gov (United States)

    Dafinca, Alexandru; Weidberg, Anthony R.; McMahon, Steven J.; Grillo, Alexander A.; Farthouat, Philippe; Ziolkowski, Michael; Herrick, Robert W.

    2013-03-01

    850nm oxide-aperture VCSELs are susceptible to premature failure if operated while exposed to atmospheric water vapor, and not protected by hermetic packaging. The ATLAS detector in CERN's Large Hadron Collider (LHC) has had approximately 6000 channels of Parallel Optic VCSELs fielded under well-documented ambient conditions. Exact time-to-failure data has been collected on this large sample, providing for the first time actual failure data at use conditions. In addition, the same VCSELs were tested under a variety of accelerated conditions to allow us to construct a more accurate acceleration model. Failure analysis information will also be presented to show what we believe causes corrosion-related failure for such VCSELs.

  2. 2014 NREL Photovoltaic Reliability Workshops | Photovoltaic Research | NREL

    Science.gov (United States)

    Failure Field Imaging Inverter Reliability Thin Film Technologies Packaging Materials and Accelerated . Introduction and Plenary Welcome-Bill Tumas, National Renewable Energy Laboratory (NREL) Welcome-Shubhra Bansal Reliability Analysis of Microinverters-Paul Parker, SolarBridge Technologies Back to top Thin Film

  3. The NASA Electronic Parts and Packaging (NEPP) Program: Overview and Update FY15 and Beyond

    Science.gov (United States)

    LaBel, Kenneth A.; Sampson, Michael J.

    2016-01-01

    The NASA Electronic Parts and Packaging (NEPP) program, and its subset the NASA Electronic Parts Assurance Group (NEPAG), are NASA's point-of-contacts for reliability and radiation tolerance of electrical, electronic, and electromechanical (EEE) parts and their packages. This presentation includes a Fiscal Year 2015 program overview.

  4. Non-Destructive Testing for Control of Radioactive Waste Package

    Science.gov (United States)

    Plumeri, S.; Carrel, F.

    2015-10-01

    Characterization and control of radioactive waste packages are important issues in the management of a radioactive waste repository. Therefore, Andra performs quality control inspection on radwaste package before disposal to ensure the compliance of the radwast characteristics with Andra waste disposal specifications and to check the consistency between Andra measurements results and producer declared properties. Objectives of this quality control are: assessment and improvement of producer radwaste packages quality mastery, guarantee of the radwaste disposal safety, maintain of the public confidence. To control radiological characteristics of radwaste package, non-destructive passive methods (gamma spectrometry and neutrons counting) are commonly used. These passive methods may not be sufficient, for instance to control the mass of fissile material contained inside radwaste package. This is particularly true for large concrete hull of heterogeneous radwaste containing several actinides mixed with fission products like 137Cs. Non-destructive active methods, like measurement of photofission delayed neutrons, allow to quantify the global mass of actinides and is a promising method to quantify mass of fissile material. Andra has performed different non-destructive measurements on concrete intermediate-level short lived nuclear waste (ILW-SL) package to control its nuclear material content. These tests have allowed Andra to have a first evaluation of the performance of photofission delayed neutron measurement and to identify development needed to have a reliable method, especially for fissile material mass control in intermediate-level long lived waste package.

  5. Operating Experiences with a Small-scale CHP Pilot Plant based on a 35 kWel Hermetic Four Cylinder Stirling Engine for Biomass Fuels

    DEFF Research Database (Denmark)

    Biedermann, F.; Carlsen, Henrik; Schoech, M.

    2003-01-01

    Within the scope of the RD&D project presented a small-scale CHP plant with a hermetic four cylinder Stirling engine for biomass fuels was developed and optimised in cooperation with the Technical University of Denmark, MAWERA Holzfeuerungsanlagen GesmbH, an Austrian biomass furnace and boiler...... exchanger of the Stirling engine, of the air preheater and of the entire combustion system. Furthermore, the optimisation of the pneumatic cleaning system to reduce ash deposition in the hot heat exchanger is of great relevance....... manufacturer, and BIOS BIOENERGIESYSTEME GmbH, an Austrian development and engineering company. Based on the technology developed, a pilot plant was designed and erected in Austria. The nominal electric power output of the plant is 35 kWel and the nominal thermal output amounts to approx. 220 kWth. The plant...

  6. Automated packaging platform for low-cost high-performance optical components manufacturing

    Science.gov (United States)

    Ku, Robert T.

    2004-05-01

    (LOS), its subsequent automated testing and burn/in process; and the placement of the LOS into a package body and hermetically sealing the package. The LOS and Package automated assembler robots have achieved a metrics of less than 1 um accuracy and 0.1 um resolution. The paper also discusses a method for the critical alignment of a single-mode fiber as the last step of the manufacturing process. This approach is in contrast to the conventional manual assembly where sub-micron fiber alignment and fixation steps are performed much earlier during the assembly process. Finally the paper discusses the value of this automated platform manufacturing approach as a key enabler for low cost small form factor optical components for the new XFP MSA class of transceiver modules.

  7. Column Grid Array Rework for High Reliability

    Science.gov (United States)

    Mehta, Atul C.; Bodie, Charles C.

    2008-01-01

    Due to requirements for reduced size and weight, use of grid array packages in space applications has become common place. To meet the requirement of high reliability and high number of I/Os, ceramic column grid array packages (CCGA) were selected for major electronic components used in next MARS Rover mission (specifically high density Field Programmable Gate Arrays). ABSTRACT The probability of removal and replacement of these devices on the actual flight printed wiring board assemblies is deemed to be very high because of last minute discoveries in final test which will dictate changes in the firmware. The questions and challenges presented to the manufacturing organizations engaged in the production of high reliability electronic assemblies are, Is the reliability of the PWBA adversely affected by rework (removal and replacement) of the CGA package? and How many times can we rework the same board without destroying a pad or degrading the lifetime of the assembly? To answer these questions, the most complex printed wiring board assembly used by the project was chosen to be used as the test vehicle, the PWB was modified to provide a daisy chain pattern, and a number of bare PWB s were acquired to this modified design. Non-functional 624 pin CGA packages with internal daisy chained matching the pattern on the PWB were procured. The combination of the modified PWB and the daisy chained packages enables continuity measurements of every soldered contact during subsequent testing and thermal cycling. Several test vehicles boards were assembled, reworked and then thermal cycled to assess the reliability of the solder joints and board material including pads and traces near the CGA. The details of rework process and results of thermal cycling are presented in this paper.

  8. Frontiers of reliability

    CERN Document Server

    Basu, Asit P; Basu, Sujit K

    1998-01-01

    This volume presents recent results in reliability theory by leading experts in the world. It will prove valuable for researchers, and users of reliability theory. It consists of refereed invited papers on a broad spectrum of topics in reliability. The subjects covered include Bayesian reliability, Bayesian reliability modeling, confounding in a series system, DF tests, Edgeworth approximation to reliability, estimation under random censoring, fault tree reduction for reliability, inference about changes in hazard rates, information theory and reliability, mixture experiment, mixture of Weibul

  9. Components of Adenovirus Genome Packaging

    Science.gov (United States)

    Ahi, Yadvinder S.; Mittal, Suresh K.

    2016-01-01

    Adenoviruses (AdVs) are icosahedral viruses with double-stranded DNA (dsDNA) genomes. Genome packaging in AdV is thought to be similar to that seen in dsDNA containing icosahedral bacteriophages and herpesviruses. Specific recognition of the AdV genome is mediated by a packaging domain located close to the left end of the viral genome and is mediated by the viral packaging machinery. Our understanding of the role of various components of the viral packaging machinery in AdV genome packaging has greatly advanced in recent years. Characterization of empty capsids assembled in the absence of one or more components involved in packaging, identification of the unique vertex, and demonstration of the role of IVa2, the putative packaging ATPase, in genome packaging have provided compelling evidence that AdVs follow a sequential assembly pathway. This review provides a detailed discussion on the functions of the various viral and cellular factors involved in AdV genome packaging. We conclude by briefly discussing the roles of the empty capsids, assembly intermediates, scaffolding proteins, portal vertex and DNA encapsidating enzymes in AdV assembly and packaging. PMID:27721809

  10. Packaging-radiation disinfestation relationships

    International Nuclear Information System (INIS)

    Highland, H.A.

    1985-01-01

    Foods that are susceptible to insect infestation can be irradiated to destroy the infestation; however, the food must be kept essentially insect-free until consumed, or it must be disinfested again, perhaps repeatedly. Insect-resistant packages can be used to prevent reinfestation, but there are certain requirements that must be fulfilled before a package can be made insect resistant. These include the use of insect-light construction and packaging materials that resist boring insects. The relative insect resistance of various packages and packaging materials is discussed, as are behavior traits such as egressive boring that enables insects to escape from packages and the ability of insects to climb on various packaging materials. Some successful and unsuccessful attempts to make various types of packages insect resistant are discussed, as are factors that must be considered in the selection or development of insect-resistant packages for radiation disinfested foods. The latter factors include biological and physical environments, length of storage periods, stresses on packages during shipment, types of storage facilities, governmental regulations, health requirements, and others

  11. Radioactive material packaging performance testing

    International Nuclear Information System (INIS)

    Romano, T.; Cruse, J.M.

    1991-02-01

    To provide uniform packaging of hazardous materials on an international level, the United Nations has developed packaging recommendations that have been implemented worldwide. The United Nations packaging recommendations are performance oriented, allowing for a wide variety of package materials and systems. As a result of this international standard, efforts in the United States are being directed toward use of performance-oriented packaging and elimination of specification (designed) packaging. This presentation will focus on trends, design evaluation, and performance testing of radioactive material packaging. The impacts of US Department of Transportation Dockets HM-181 and HM-169A on specification and low-specific activity radioactive material packaging requirements are briefly discussed. The US Department of Energy's program for evaluating radioactive material packings per US Department of Transportation Specification 7A Type A requirements, is used as the basis for discussing low-activity packaging performance test requirements. High-activity package testing requirements are presented with examples of testing performed at the Hanford Site that is operated by Westinghouse Hanford Company for the US Department of Energy. 5 refs., 2 tabs

  12. Safety Analysis Report for packaging (onsite) steel waste package

    Energy Technology Data Exchange (ETDEWEB)

    BOEHNKE, W.M.

    2000-07-13

    The steel waste package is used primarily for the shipment of remote-handled radioactive waste from the 324 Building to the 200 Area for interim storage. The steel waste package is authorized for shipment of transuranic isotopes. The maximum allowable radioactive material that is authorized is 500,000 Ci. This exceeds the highway route controlled quantity (3,000 A{sub 2}s) and is a type B packaging.

  13. Safety Analysis Report for packaging (onsite) steel waste package

    International Nuclear Information System (INIS)

    BOEHNKE, W.M.

    2000-01-01

    The steel waste package is used primarily for the shipment of remote-handled radioactive waste from the 324 Building to the 200 Area for interim storage. The steel waste package is authorized for shipment of transuranic isotopes. The maximum allowable radioactive material that is authorized is 500,000 Ci. This exceeds the highway route controlled quantity (3,000 A 2 s) and is a type B packaging

  14. HPLOT: the graphics interface package for the HBOOK histogramming package

    International Nuclear Information System (INIS)

    Watkins, H.

    1978-01-01

    The subroutine package HPLOT described in this report, enables the CERN histogramming package HBOOK to produce high-quality pictures by means of high-resolution devices such as plotters. HPLOT can be implemented on any scientific computing system with a Fortran IV compiler and can be interfaced with any graphics package; spectral routines in addition to the basic ones enable users to embellish their histograms. Examples are also given of the use of HPLOT as a graphics package for plotting simple pictures without histograms. (Auth.)

  15. The Ettention software package.

    Science.gov (United States)

    Dahmen, Tim; Marsalek, Lukas; Marniok, Nico; Turoňová, Beata; Bogachev, Sviatoslav; Trampert, Patrick; Nickels, Stefan; Slusallek, Philipp

    2016-02-01

    We present a novel software package for the problem "reconstruction from projections" in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. Copyright © 2015 Elsevier B.V. All rights reserved.

  16. CH Packaging Operations Manual

    International Nuclear Information System (INIS)

    2008-01-01

    This document provides the user with instructions for assembling a payload. All the steps in Subsections 1.2, Preparing 55-Gallon Drum Payload Assembly; 1.3, Preparing 'Short' 85-Gallon Drum Payload Assembly (TRUPACT-II and HalfPACT); 1.4, Preparing 'Tall' 85-gallon Drum Payload Assembly (HalfPACT only); 1.5, Preparing 100-Gallon Drum Payload Assembly; 1.6, Preparing SWB Payload Assembly; and 1.7, Preparing TDOP Payload Assembly, must be completed, but may be performed in any order as long as radiological control steps are not bypassed. Transport trailer operations, package loading and unloading from transport trailers, hoisting and rigging activities such as ACGLF operations, equipment checkout and shutdown, and component inspection activities must be performed, but may be performed in any order and in parallel with other activities as long as radiological control steps are not bypassed. Steps involving OCA/ICV lid removal/installation and payload removal/loading may be performed in parallel if there are multiple operators working on the same packaging. Steps involving removal/installation of OCV/ICV upper and lower main O-rings must be performed in sequence.

  17. CH Packaging Operations Manual

    International Nuclear Information System (INIS)

    2009-01-01

    This document provides the user with instructions for assembling a payload. All the steps in Subsections 1.2, Preparing 55-Gallon Drum Payload Assembly; 1.3, Preparing 'Short' 85-Gallon Drum Payload Assembly (TRUPACT-II and HalfPACT); 1.4, Preparing 'Tall' 85-Gallon Drum Payload Assembly (HalfPACT only); 1.5, Preparing 100-Gallon Drum Payload Assembly; 1.6, Preparing Shielded Container Payload Assembly; 1.7, Preparing SWB Payload Assembly; and 1.8, Preparing TDOP Payload Assembly, must be completed, but may be performed in any order as long as radiological control steps are not bypassed. Transport trailer operations, package loading and unloading from transport trailers, hoisting and rigging activities such as ACGLF operations, equipment checkout and shutdown, and component inspection activities must be performed, but may be performed in any order and in parallel with other activities as long as radiological control steps are not bypassed. Steps involving OCA/ICV lid removal/installation and payload removal/loading may be performed in parallel if there are multiple operators working on the same packaging. Steps involving removal/installation of OCV/ICV upper and lower main O-rings must be performed in sequence, except as noted.

  18. CH Packaging Operations Manual

    Energy Technology Data Exchange (ETDEWEB)

    None, None

    2009-05-27

    This document provides the user with instructions for assembling a payload. All the steps in Subsections 1.2, Preparing 55-Gallon Drum Payload Assembly; 1.3, Preparing "Short" 85-Gallon Drum Payload Assembly (TRUPACT-II and HalfPACT); 1.4, Preparing "Tall" 85-Gallon Drum Payload Assembly (HalfPACT only); 1.5, Preparing 100-Gallon Drum Payload Assembly; 1.6, Preparing Shielded Container Payload Assembly; 1.7, Preparing SWB Payload Assembly; and 1.8, Preparing TDOP Payload Assembly, must be completed, but may be performed in any order as long as radiological control steps are not bypassed. Transport trailer operations, package loading and unloading from transport trailers, hoisting and rigging activities such as ACGLF operations, equipment checkout and shutdown, and component inspection activities must be performed, but may be performed in any order and in parallel with other activities as long as radiological control steps are not bypassed. Steps involving OCA/ICV lid removal/installation and payload removal/loading may be performed in parallel if there are multiple operators working on the same packaging. Steps involving removal/installation of OCV/ICV upper and lower main O-rings must be performed in sequence, except as noted.

  19. Packaging supplier inspection guide

    International Nuclear Information System (INIS)

    Stromberg, H.M.; Gregg, R.E.; Kido, C.; Boyle, C.D.

    1991-05-01

    This is document is a guide for conducting quality assurance inspections of transportations packaging suppliers, where suppliers are defined as designers, fabricators, distributors, users, or owners of transportation packaging. This document can be used during an inspection to determine regulatory compliance within the requirements of 10 Code of Federal Regulations, Part 71, Subpart H (10 CFR 71.101--71.135). The guidance described in this document provides a framework for an inspection. It provides the inspector with the flexibility to adapt the methods and concepts presented here to meet the needs of the particular facility being inspected. The guide was developed to ensure a structured and consistent approach for inspections. The method treats each activity at a supplier facility as a separate entity (or functional element), and combines the activities within the framework of an ''inspection tree.'' The method separates each functional element into several areas of performance and then identifies guidelines, based on regulatory requirements, to be used to qualitatively rate each area. This document was developed to serve as a field manual to facilitate the work of inspectors. 1 ref., 1 fig., 5 tabs

  20. Tamper indicating packaging

    International Nuclear Information System (INIS)

    Baumann, M.J.; Bartberger, J.C.; Welch, T.D.

    1994-01-01

    Protecting sensitive items from undetected tampering in an unattended environment is crucial to the success of non-proliferation efforts relying on the verification of critical activities. Tamper Indicating Packaging (TIP) technologies are applied to containers, packages, and equipment that require an indication of a tamper attempt. Examples include: the transportation and storage of nuclear material, the operation and shipment of surveillance equipment and monitoring sensors, and the retail storage of medicine and food products. The spectrum of adversarial tampering ranges from attempted concealment of a pin-hole sized penetration to the complete container replacement, which would involve counterfeiting efforts of various degrees. Sandia National Laboratories (SNL) has developed a technology base for advanced TIP materials, sensors, designs, and processes which can be adapted to various future monitoring systems. The purpose of this technology base is to investigate potential new technologies, and to perform basic research of advanced technologies. This paper will describe the theory of TIP technologies and recent investigations of TIP technologies at SNL

  1. Japan's electronic packaging technologies

    Science.gov (United States)

    Tummala, Rao R.; Pecht, Michael

    1995-02-01

    The JTEC panel found Japan to have significant leadership over the United States in the strategic area of electronic packaging. Many technologies and products once considered the 'heart and soul' of U.S. industry have been lost over the past decades to Japan and other Asian countries. The loss of consumer electronics technologies and products is the most notable of these losses, because electronics is the United States' largest employment sector and is critical for growth businesses in consumer products, computers, automobiles, aerospace, and telecommunications. In the past there was a distinction between consumer and industrial product technologies. While Japan concentrated on the consumer market, the United States dominated the industrial sector. No such distinction is anticipated in the future; the consumer-oriented technologies Japan has dominated are expected to characterize both domains. The future of U.S. competitiveness will, therefore, depend on the ability of the United States to rebuild its technological capabilities in the area of portable electronic packaging.

  2. Reliability of thermal interface materials: A review

    International Nuclear Information System (INIS)

    Due, Jens; Robinson, Anthony J.

    2013-01-01

    Thermal interface materials (TIMs) are used extensively to improve thermal conduction across two mating parts. They are particularly crucial in electronics thermal management since excessive junction-to-ambient thermal resistances can cause elevated temperatures which can negatively influence device performance and reliability. Of particular interest to electronic package designers is the thermal resistance of the TIM layer at the end of its design life. Estimations of this allow the package to be designed to perform adequately over its entire useful life. To this end, TIM reliability studies have been performed using accelerated stress tests. This paper reviews the body of work which has been performed on TIM reliability. It focuses on the various test methodologies with commentary on the results which have been obtained for the different TIM materials. Based on the information available in the open literature, a test procedure is proposed for TIM selection based on beginning and end of life performance. - Highlights: ► This paper reviews the body of work which has been performed on TIM reliability. ► Test methodologies for reliability testing are outlined. ► Reliability results for the different TIM materials are discussed. ► A test procedure is proposed for TIM selection BOLife and EOLife performance.

  3. K east encapsulation packager modifications

    International Nuclear Information System (INIS)

    Jensen, M.A.

    1994-01-01

    This Supporting Document analyzes a proposal for reducing the under-packager volume to decrease the amount of fissile material that could accumulate there. The analysis shows that restricting the under packager volume to no more than 4080 in 3 will assure that if accumulated fissile material beneath the packager is added to the worst-case mass of fissile material in the discharge chute, a k eff of 0.98 will not be exceeded

  4. System issues for multichip packaging

    Science.gov (United States)

    Sage, Maurice G.; Hartley, Neil

    1991-04-01

    It is now generally recognised that the performance of an electronic system is governed by the choice of packaging technology. Never before have the technical and financial implications of a packaging technology choice been more critical and never before has technology interdependence or industry globalisation made the choice more difficult. This paper is aimed at examining the choices available and the system issues resulting from the move from single chip to multichip packaging.

  5. IN-PACKAGE CHEMISTRY ABSTRACTION

    Energy Technology Data Exchange (ETDEWEB)

    E. Thomas

    2005-07-14

    This report was developed in accordance with the requirements in ''Technical Work Plan for Postclosure Waste Form Modeling'' (BSC 2005 [DIRS 173246]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as a function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model, which uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model, which is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials, and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed (CDSP) waste packages containing high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor diffusing into the waste package, and (2) seepage water entering the waste package as a liquid from the drift. (1) Vapor-Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H{sub 2}O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Liquid-Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package.

  6. IN-PACKAGE CHEMISTRY ABSTRACTION

    International Nuclear Information System (INIS)

    E. Thomas

    2005-01-01

    This report was developed in accordance with the requirements in ''Technical Work Plan for Postclosure Waste Form Modeling'' (BSC 2005 [DIRS 173246]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as a function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model, which uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model, which is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials, and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed (CDSP) waste packages containing high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor diffusing into the waste package, and (2) seepage water entering the waste package as a liquid from the drift. (1) Vapor-Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H 2 O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Liquid-Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package

  7. Packaging of control system software

    International Nuclear Information System (INIS)

    Zagar, K.; Kobal, M.; Saje, N.; Zagar, A.; Sabjan, R.; Di Maio, F.; Stepanov, D.

    2012-01-01

    Control system software consists of several parts - the core of the control system, drivers for integration of devices, configuration for user interfaces, alarm system, etc. Once the software is developed and configured, it must be installed to computers where it runs. Usually, it is installed on an operating system whose services it needs, and also in some cases dynamically links with the libraries it provides. Operating system can be quite complex itself - for example, a typical Linux distribution consists of several thousand packages. To manage this complexity, we have decided to rely on Red Hat Package Management system (RPM) to package control system software, and also ensure it is properly installed (i.e., that dependencies are also installed, and that scripts are run after installation if any additional actions need to be performed). As dozens of RPM packages need to be prepared, we are reducing the amount of effort and improving consistency between packages through a Maven-based infrastructure that assists in packaging (e.g., automated generation of RPM SPEC files, including automated identification of dependencies). So far, we have used it to package EPICS, Control System Studio (CSS) and several device drivers. We perform extensive testing on Red Hat Enterprise Linux 5.5, but we have also verified that packaging works on CentOS and Scientific Linux. In this article, we describe in greater detail the systematic system of packaging we are using, and its particular application for the ITER CODAC Core System. (authors)

  8. Naval Waste Package Design Report

    International Nuclear Information System (INIS)

    M.M. Lewis

    2004-01-01

    A design methodology for the waste packages and ancillary components, viz., the emplacement pallets and drip shields, has been developed to provide designs that satisfy the safety and operational requirements of the Yucca Mountain Project. This methodology is described in the ''Waste Package Design Methodology Report'' Mecham 2004 [DIRS 166168]. To demonstrate the practicability of this design methodology, four waste package design configurations have been selected to illustrate the application of the methodology. These four design configurations are the 21-pressurized water reactor (PWR) Absorber Plate waste package, the 44-boiling water reactor (BWR) waste package, the 5-defense high-level waste (DHLW)/United States (U.S.) Department of Energy (DOE) spent nuclear fuel (SNF) Co-disposal Short waste package, and the Naval Canistered SNF Long waste package. Also included in this demonstration is the emplacement pallet and continuous drip shield. The purpose of this report is to document how that design methodology has been applied to the waste package design configurations intended to accommodate naval canistered SNF. This demonstrates that the design methodology can be applied successfully to this waste package design configuration and support the License Application for construction of the repository

  9. Estimate the thermomechanical fatigue life of two flip chip packages

    International Nuclear Information System (INIS)

    Pash, R.A.; Ullah, H.S.; Khan, M.Z.

    2005-01-01

    The continuing demand towards high density and low profile integrated circuit packaging has accelerated the development of flip chip structures as used in direct chip attach (DCA) technology, ball grid array (BOA) and chip scale package (CSP). In such structures the most widely used flip chip interconnects are solder joints. The reliability of flip chip structures largely depends on the reliability of solder joints. In this work solder joint fatigue life prediction for two chip scale packages is carried out. Elasto-plastic deformation behavior of the solder was simulated using ANSYS. Two dimensional plain strain finite element models were developed for each package to numerically compute the stress and total strain of the solder joints under temperature cycling. These stress and strain values are then used to predict the solder joint lifetime through modified Coffin Manson equation. The effect of solder joint's distance from edge of silicon die on life of the package is explored. The solder joint fatigue response is modeled for a typical temperature cycling of -60 to 140 degree C. (author)

  10. System Reliability Engineering

    International Nuclear Information System (INIS)

    Lim, Tae Jin

    2005-02-01

    This book tells of reliability engineering, which includes quality and reliability, reliability data, importance of reliability engineering, reliability and measure, the poisson process like goodness of fit test and the poisson arrival model, reliability estimation like exponential distribution, reliability of systems, availability, preventive maintenance such as replacement policies, minimal repair policy, shock models, spares, group maintenance and periodic inspection, analysis of common cause failure, and analysis model of repair effect.

  11. Comprehensive Die Shear Test of Silicon Packages Bonded by Thermocompression of Al Layers with Thin Sn Capping or Insertions

    Directory of Open Access Journals (Sweden)

    Shiro Satoh

    2018-04-01

    Full Text Available Thermocompression bonding for wafer-level hermetic packaging was demonstrated at the lowest temperature of 370 to 390 °C ever reported using Al films with thin Sn capping or insertions as bonding layer. For shrinking the chip size of MEMS (micro electro mechanical systems, a smaller size of wafer-level packaging and MEMS–ASIC (application specific integrated circuit integration are of great importance. Metal-based bonding under the temperature of CMOS (complementary metal-oxide-semiconductor backend process is a key technology, and Al is one of the best candidates for bonding metal in terms of CMOS compatibility. In this study, after the thermocompression bonding of two substrates, the shear fracture strength of dies was measured by a bonding tester, and the shear-fractured surfaces were observed by SEM (scanning electron microscope, EDX (energy dispersive X-ray spectrometry, and a surface profiler to clarify where the shear fracture took place. We confirmed two kinds of fracture mode. One mode is Si bulk fracture mode, where the die shear strength is 41.6 to 209 MPa, proportionally depending on the area of Si fracture. The other mode is bonding interface fracture mode, where the die shear strength is 32.8 to 97.4 MPa. Regardless of the fracture modes, the minimum die shear strength is practical for wafer-level MEMS packaging.

  12. Anhydrous Ammonia Training Module. Trainer's Package. Participant's Package.

    Science.gov (United States)

    Beaudin, Bart; And Others

    This document contains a trainer's and a participant's package for teaching employees on site safe handling procedures for working with anhydrous ammonia, especially on farms. The trainer's package includes the following: a description of the module; a competency; objectives; suggested instructional aids; a training outline (or lesson plan) for…

  13. The Packaging Handbook -- A guide to package design

    International Nuclear Information System (INIS)

    Shappert, L.B.

    1995-01-01

    The Packaging Handbook is a compilation of 14 technical chapters and five appendices that address the life cycle of a packaging which is intended to transport radioactive material by any transport mode in normal commerce. Although many topics are discussed in depth, this document focuses on the design aspects of a packaging. The Handbook, which is being prepared under the direction of the US Department of Energy, is intended to provide a wealth of technical guidance that will give designers a better understanding of the regulatory approval process, preferences of regulators in specific aspects of packaging design, and the types of analyses that should be seriously considered when developing the packaging design. Even though the Handbook is concerned with all packagings, most of the emphasis is placed on large packagings that are capable of transporting large radioactive sources that are also fissile (e.g., spent fuel). These are the types of packagings that must address the widest range of technical topics in order to meet domestic and international regulations. Most of the chapters in the Handbook have been drafted and submitted to the Oak Ridge National Laboratory for editing; the majority of these have been edited. This report summarizes the contents

  14. Electronic equipment packaging technology

    CERN Document Server

    Ginsberg, Gerald L

    1992-01-01

    The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron­ ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod­ ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter­ mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pr...

  15. ORNL's DCAL software package

    International Nuclear Information System (INIS)

    Eckerman, K.F.

    2007-01-01

    Oak Ridge National Laboratory has released its Dose and Risk Calculation software, DCAL. DCAL, developed with the support of the U.S. Environmental Protection Agency, consists of a series of computational modules, driven in either an interactive or a batch mode for computation of dose and risk coefficients from intakes of radionuclides or exposure to radionuclides in environmental media. The software package includes extensive libraries of biokinetic and dosimetric data that represent the current state of the art. The software has unique capability for addressing intakes of radionuclides by non-adults. DCAL runs as 32-bit extended DOS and console applications under Windows 98/NT/2000/XP. It is intended for users familiar with the basic elements of computational radiation dosimetry. Components of DCAL have been used to prepare U.S. Environmental Protection Agency's Federal Guidance Reports 12 and 13 and several publications of the International Commission on Radiological Protection. (author)

  16. Blasting agent package

    Energy Technology Data Exchange (ETDEWEB)

    Fox, R.

    1971-03-17

    A protected preassembled package for blasting agents susceptible to desensitization by water consists of, in combination: (1) an inner rigid and self-supporting tube, the upper end of which is suited to be connected, or attached, to the discharge end of a loading hose for a blasting agent and the lower end of which is open; and (2) a flexible tubular liner made of water-resistant film, having a diameter greater than that of the inner tube and a length at least equal to the desired depth of its insertion into the borehole, the liner being sleeved over the length of the inner tube, the upper end of the liner being attached to the inner tube and the lower end of the liner being closed so as to prevent substantial discharge of the explosive mixture therefrom when the latter is pumped into it. (24 claims)

  17. Tritium waste package

    Science.gov (United States)

    Rossmassler, Rich; Ciebiera, Lloyd; Tulipano, Francis J.; Vinson, Sylvester; Walters, R. Thomas

    1995-01-01

    A containment and waste package system for processing and shipping tritium xide waste received from a process gas includes an outer drum and an inner drum containing a disposable molecular sieve bed (DMSB) seated within outer drum. The DMSB includes an inlet diffuser assembly, an outlet diffuser assembly, and a hydrogen catalytic recombiner. The DMSB absorbs tritium oxide from the process gas and converts it to a solid form so that the tritium is contained during shipment to a disposal site. The DMSB is filled with type 4A molecular sieve pellets capable of adsorbing up to 1000 curies of tritium. The recombiner contains a sufficient amount of catalyst to cause any hydrogen add oxygen present in the process gas to recombine to form water vapor, which is then adsorbed onto the DMSB.

  18. 3D packaging of a microfluidic system with sensory applications

    Science.gov (United States)

    Morrissey, Anthony; Kelly, Gerard; Alderman, John C.

    1997-09-01

    Among the main benefits of microsystem technology are its contributions to cost reductio, reliability and improved performance. however, the packaging of microsystems, and particularly microsensor, has proven to be one of the biggest limitations to their commercialization and the packaging of silicon sensor devices can be the most costly part of their fabrication. This paper describes the integration of 3D packaging of a microsystem. Central to the operation of the 3D demonstrator is a micromachined silicon membrane pump to supply fluids to a sensing chamber constructed about the active area of a sensor chip. This chip carries ISFET based chemical sensors, pressure sensors and thermal sensors. The electronics required for controlling and regulating the activity of the various sensors ar also available on this chip and as other chips in the 3D assembly. The demonstrator also contains a power supply module with optical fiber interconnections. All of these modules are integrated into a single plastic- encapsulated 3D vertical multichip module. The reliability of such a structure, initially proposed by Val was demonstrated by Barrett et al. An additional module available for inclusion in some of our assemblies is a test chip capable of measuring the packaging-induced stress experienced during and after assembly. The packaging process described produces a module with very high density and utilizes standard off-the-shelf components to minimize costs. As the sensor chip and micropump include micromachined silicon membranes and microvalves, the packaging of such structures has to allow consideration for the minimization of the packaging-induced stresses. With this in mind, low stress techniques, including the use of soft glob-top materials, were employed.

  19. System-in-package RF design and applications

    CERN Document Server

    Gaynor, Michael P

    2006-01-01

    In the past few years, System in Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. Here's the first comprehensive resource on SiP design techniques that offers designers state-of-the-art packaging know-how. Moreover, the book provides numerous examples that illustrate real-world capabilities, constraints, trade-offs, and options at every step.

  20. Isothermal solidification based packaging of biosensors at low temperatures

    International Nuclear Information System (INIS)

    Sharma, R.P.; Khanna, P.K.; Kumar, D.

    2010-01-01

    Thick film Au printed square contact pads are interconnected to Cu substrates at constant pressure and temperature using the isothermal solidification of Bi-In alloy on the joining surfaces. The effect of reaction time on the mechanical strength of the package has been analyzed. Thermal stability of the fabricated specimens have been measured and discussed. The delaminated surfaces examined optically reveal the morphology of the metallization zones on the joining substrates. The scanning electron microscopy of these surfaces is reported in this paper. Tests for thermal shock, pH resistivity and shelf life have been carried out to predict the reliability of the packaging for long term applications.

  1. Packaged solar water heating technology: twenty years of progress

    International Nuclear Information System (INIS)

    Morrison, Graham; Wood, Byard

    2000-01-01

    The world market for packaged solar water heaters is reviewed, and descriptions are given of the different types of solar domestic water heaters (SDWH), design concepts for packaged SDWH, thermosyphon SDWH, evacuated insulation and excavated tube collectors, seasonally biased solar collectors, heat pump water heaters, and photovoltaic water heaters. The consumer market value for SDWHs is explained, and the results of a survey of solar water heating are summarised covering advantages, perceived disadvantages, the relative importance of purchase decision factors, experience with system components, and the most frequent maintenance problems. The durability, reliability, and performance of SDWHs are discussed

  2. Packaging and transport of radioisotopes

    International Nuclear Information System (INIS)

    Taylor, C.B.G.

    1976-01-01

    The importance of radioisotope traffic is emphasized. More than a million packages are being transported each year, mostly for medical uses. The involvement of public transport services and the incidental dose to the public (which is very small) are appreciably greater than for movements connected with the nuclear fuel cycle. Modern isotope packages are described, and an outline given of the problems of a large radioisotope manufacturer who has to package many different types of product. Difficulties caused by recent uncoordinated restrictions on the use of passenger aircraft are mentioned. Some specific problems relating to radioisotope packaging are discussed. These include the crush resistance of Type A packages, the closure of steel drums, the design of secure closures for large containers, the Type A packaging of liquids, leak tightness criteria of Type B packages, and the use of 'unit load' overpacks to consign a group of individually approved packages together as a single shipment. Reference is made to recent studies of the impact of radioisotope shipments on the environment. Cost/benefit analysis is important in this field - an important public debate is only just beginning. (author)

  3. Ensuring socially responsible packaging design

    DEFF Research Database (Denmark)

    Geert Jensen, Birgitte

    Most consumers have experienced occasional problems with opening packaging. Tomato sauce from the tinned mackerel splattered all over the kitchen counter, the unrelenting pickle jar lid, and the package of sliced ham that cannot be opened without a knife or a pair of scissors. The research project...

  4. Oral Hygiene. Learning Activity Package.

    Science.gov (United States)

    Hime, Kirsten

    This learning activity package on oral hygiene is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, a list of definitions, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics…

  5. Solar water heater design package

    Science.gov (United States)

    1981-01-01

    Package describes commercial domestic-hot-water heater with roof or rack mounted solar collectors. System is adjustable to pre-existing gas or electric hot-water house units. Design package includes drawings, description of automatic control logic, evaluation measurements, possible design variations, list of materials and installation tools, and trouble-shooting guide and manual.

  6. 19 CFR 191.13 - Packaging materials.

    Science.gov (United States)

    2010-04-01

    ... 19 Customs Duties 2 2010-04-01 2010-04-01 false Packaging materials. 191.13 Section 191.13 Customs... (CONTINUED) DRAWBACK General Provisions § 191.13 Packaging materials. (a) Imported packaging material... packaging material when used to package or repackage merchandise or articles exported or destroyed pursuant...

  7. 21 CFR 355.20 - Packaging conditions.

    Science.gov (United States)

    2010-04-01

    ... conditions. (a) Package size limitation. Due to the toxicity associated with fluoride active ingredients, the... (toothpastes and tooth powders) packages shall not contain more than 276 milligrams (mg) total fluorine per... packages shall not contain more than 120 mg total fluorine per package. (3) Exception. Package size...

  8. CDIAC catalog of numeric data packages and computer model packages

    International Nuclear Information System (INIS)

    Boden, T.A.; Stoss, F.W.

    1993-05-01

    The Carbon Dioxide Information Analysis Center acquires, quality-assures, and distributes to the scientific community numeric data packages (NDPs) and computer model packages (CMPs) dealing with topics related to atmospheric trace-gas concentrations and global climate change. These packages include data on historic and present atmospheric CO 2 and CH 4 concentrations, historic and present oceanic CO 2 concentrations, historic weather and climate around the world, sea-level rise, storm occurrences, volcanic dust in the atmosphere, sources of atmospheric CO 2 , plants' response to elevated CO 2 levels, sunspot occurrences, and many other indicators of, contributors to, or components of climate change. This catalog describes the packages presently offered by CDIAC, reviews the processes used by CDIAC to assure the quality of the data contained in these packages, notes the media on which each package is available, describes the documentation that accompanies each package, and provides ordering information. Numeric data are available in the printed NDPs and CMPs, in CD-ROM format, and from an anonymous FTP area via Internet. All CDIAC information products are available at no cost

  9. Reliability analysis techniques for the design engineer

    International Nuclear Information System (INIS)

    Corran, E.R.; Witt, H.H.

    1980-01-01

    A fault tree analysis package is described that eliminates most of the housekeeping tasks involved in proceeding from the initial construction of a fault tree to the final stage of presenting a reliability analysis in a safety report. It is suitable for designers with relatively little training in reliability analysis and computer operation. Users can rapidly investigate the reliability implications of various options at the design stage, and evolve a system which meets specified reliability objectives. Later independent review is thus unlikely to reveal major shortcomings necessitating modification and projects delays. The package operates interactively allowing the user to concentrate on the creative task of developing the system fault tree, which may be modified and displayed graphically. For preliminary analysis system data can be derived automatically from a generic data bank. As the analysis procedes improved estimates of critical failure rates and test and maintenance schedules can be inserted. The computations are standard, - identification of minimal cut-sets, estimation of reliability parameters, and ranking of the effect of the individual component failure modes and system failure modes on these parameters. The user can vary the fault trees and data on-line, and print selected data for preferred systems in a form suitable for inclusion in safety reports. A case history is given - that of HIFAR containment isolation system. (author)

  10. Reliability analysis techniques for the design engineer

    International Nuclear Information System (INIS)

    Corran, E.R.; Witt, H.H.

    1982-01-01

    This paper describes a fault tree analysis package that eliminates most of the housekeeping tasks involved in proceeding from the initial construction of a fault tree to the final stage of presenting a reliability analysis in a safety report. It is suitable for designers with relatively little training in reliability analysis and computer operation. Users can rapidly investigate the reliability implications of various options at the design stage and evolve a system which meets specified reliability objectives. Later independent review is thus unlikely to reveal major shortcomings necessitating modification and project delays. The package operates interactively, allowing the user to concentrate on the creative task of developing the system fault tree, which may be modified and displayed graphically. For preliminary analysis, system data can be derived automatically from a generic data bank. As the analysis proceeds, improved estimates of critical failure rates and test and maintenance schedules can be inserted. The technique is applied to the reliability analysis of the recently upgraded HIFAR Containment Isolation System. (author)

  11. AMSAA Reliability Growth Guide

    National Research Council Canada - National Science Library

    Broemm, William

    2000-01-01

    ... has developed reliability growth methodology for all phases of the process, from planning to tracking to projection. The report presents this methodology and associated reliability growth concepts.

  12. Advanced Packaging Technology Used in Fabricating a High-Temperature Silicon Carbide Pressure Sensor

    Science.gov (United States)

    Beheim, Glenn M.

    2003-01-01

    The development of new aircraft engines requires the measurement of pressures in hot areas such as the combustor and the final stages of the compressor. The needs of the aircraft engine industry are not fully met by commercially available high-temperature pressure sensors, which are fabricated using silicon. Kulite Semiconductor Products and the NASA Glenn Research Center have been working together to develop silicon carbide (SiC) pressure sensors for use at high temperatures. At temperatures above 850 F, silicon begins to lose its nearly ideal elastic properties, so the output of a silicon pressure sensor will drift. SiC, however, maintains its nearly ideal mechanical properties to extremely high temperatures. Given a suitable sensor material, a key to the development of a practical high-temperature pressure sensor is the package. A SiC pressure sensor capable of operating at 930 F was fabricated using a newly developed package. The durability of this sensor was demonstrated in an on-engine test. The SiC pressure sensor uses a SiC diaphragm, which is fabricated using deep reactive ion etching. SiC strain gauges on the surface of the diaphragm sense the pressure difference across the diaphragm. Conventionally, the SiC chip is mounted to the package with the strain gauges outward, which exposes the sensitive metal contacts on the chip to the hostile measurement environment. In the new Kulite leadless package, the SiC chip is flipped over so that the metal contacts are protected from oxidation by a hermetic seal around the perimeter of the chip. In the leadless package, a conductive glass provides the electrical connection between the pins of the package and the chip, which eliminates the fragile gold wires used previously. The durability of the leadless SiC pressure sensor was demonstrated when two 930 F sensors were tested in the combustor of a Pratt & Whitney PW4000 series engine. Since the gas temperatures in these locations reach 1200 to 1300 F, the sensors were

  13. In-Package Chemistry Abstraction

    Energy Technology Data Exchange (ETDEWEB)

    E. Thomas

    2004-11-09

    This report was developed in accordance with the requirements in ''Technical Work Plan for: Regulatory Integration Modeling and Analysis of the Waste Form and Waste Package'' (BSC 2004 [DIRS 171583]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model that uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model that is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed waste packages that contain both high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor that diffuses into the waste package, and (2) seepage water that enters the waste package from the drift as a liquid. (1) Vapor Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H2O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Water Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package. TSPA-LA uses the vapor influx case for the nominal scenario for simulations where the waste

  14. In-Package Chemistry Abstraction

    International Nuclear Information System (INIS)

    E. Thomas

    2004-01-01

    This report was developed in accordance with the requirements in ''Technical Work Plan for: Regulatory Integration Modeling and Analysis of the Waste Form and Waste Package'' (BSC 2004 [DIRS 171583]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model that uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model that is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed waste packages that contain both high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor that diffuses into the waste package, and (2) seepage water that enters the waste package from the drift as a liquid. (1) Vapor Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H2O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Water Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package. TSPA-LA uses the vapor influx case for the nominal scenario for simulations where the waste package has been

  15. Perfume Packaging, Seduction and Gender

    Directory of Open Access Journals (Sweden)

    Magdalena Petersson McIntyre

    2013-06-01

    Full Text Available This article examines gender and cultural sense-making in relation to perfumes and their packaging. Gendered meanings of seduction, choice, consumption and taste are brought to the fore with the use of go-along interviews with consumers in per-fume stores. Meeting luxury packages in this feminized environment made the interviewed women speak of bottles as objects to fall in love with and they de-scribed packages as the active part in an act of seduction where they were expect-ing packages to persuade them into consumption. The interviewed men on the other hand portrayed themselves as active choice-makers and stressed that they were always in control and not seduced by packaging. However, while their ways of explaining their relationship with packaging on the surface seems to confirm cultural generalizations in relation to gender and seduction, the article argues that letting oneself be seduced is no less active than seducing. Based on a combination of actor network theories and theories of gender performativity the article points to the agency of packaging for constructions of gender and understands the inter-viewees as equally animated by the flows of passion which guide their actions.

  16. Naval Waste Package Design Sensitivity

    International Nuclear Information System (INIS)

    T. Schmitt

    2006-01-01

    The purpose of this calculation is to determine the sensitivity of the structural response of the Naval waste packages to varying inner cavity dimensions when subjected to a comer drop and tip-over from elevated surface. This calculation will also determine the sensitivity of the structural response of the Naval waste packages to the upper bound of the naval canister masses. The scope of this document is limited to reporting the calculation results in terms of through-wall stress intensities in the outer corrosion barrier. This calculation is intended for use in support of the preliminary design activities for the license application design of the Naval waste package. It examines the effects of small changes between the naval canister and the inner vessel, and in these dimensions, the Naval Long waste package and Naval Short waste package are similar. Therefore, only the Naval Long waste package is used in this calculation and is based on the proposed potential designs presented by the drawings and sketches in References 2.1.10 to 2.1.17 and 2.1.20. All conclusions are valid for both the Naval Long and Naval Short waste packages

  17. Radioactive material packaging performance testing

    International Nuclear Information System (INIS)

    Romano, T.

    1992-06-01

    In an effort to provide uniform packaging of hazardous material on an international level, recommendations for the transport of dangerous goods have been developed by the United Nations. These recommendations are performance oriented and contrast with a large number of packaging specifications in the US Department of Transportation's hazard materials regulations. This dual system presents problems when international shipments enter the US Department of Transportation's system. Faced with the question of continuing a dual system or aligning with the international system, the Research and Special Programs Administration of the US Department of Transportation responded with Docket HM-181. This began the transition toward the international transportation system. Following close behind is Docket HM-169A, which addressed low specific activity radioactive material packaging. This paper will discuss the differences between performance-oriented and specification packaging, the transition toward performance-oriented packaging by the US Department of Transportation, and performance-oriented testing of radioactive material packaging by Westinghouse Hanford Company. Dockets HM-181 and HM-169A will be discussed along with Type A (low activity) and Type B (high activity) radioactive material packaging evaluations

  18. Safety evaluation for packaging (onsite) concrete-lined waste packaging

    Energy Technology Data Exchange (ETDEWEB)

    Romano, T.

    1997-09-25

    The Pacific Northwest National Laboratory developed a package to ship Type A, non-transuranic, fissile excepted quantities of liquid or solid radioactive material and radioactive mixed waste to the Central Waste Complex for storage on the Hanford Site.

  19. A reliability simulation language for reliability analysis

    International Nuclear Information System (INIS)

    Deans, N.D.; Miller, A.J.; Mann, D.P.

    1986-01-01

    The results of work being undertaken to develop a Reliability Description Language (RDL) which will enable reliability analysts to describe complex reliability problems in a simple, clear and unambiguous way are described. Component and system features can be stated in a formal manner and subsequently used, along with control statements to form a structured program. The program can be compiled and executed on a general-purpose computer or special-purpose simulator. (DG)

  20. Application of electron irradiation to food containers and packaging materials

    International Nuclear Information System (INIS)

    Ueno, Koji

    2010-01-01

    Problems caused by microbial contamination and hazardous chemicals have attracted much attention in the food industry. The number of systems such as hygienic management systems and Hazard Analysis Critical Control Point (HACCP) systems adopted in the manufacturing process is increasing. As manufacturing process control has become stricter, stricter control is also required for microbial control for containers and packaging materials (from disinfection to sterilization). Since safe and reliable methods for sterilizing food containers and packaging materials that leave no residue are required, electron beam sterilization used for medical equipment has attracted attention from the food industry. This paper describes an electron irradiation facility, methods for applying electron beams to food containers and packaging materials, and products irradiated with electron beams. (author)

  1. Emotional response towards food packaging

    DEFF Research Database (Denmark)

    Liao, Lewis Xinwei; Corsi, Armando M.; Chrysochou, Polymeros

    2015-01-01

    In this paper we investigate consumers’ emotional responses to food packaging. More specifically, we use self-report and physiological measures to jointly assess emotional responses to three typical food packaging elements: colours (lowwavelength vs. high-wavelength), images (positive vs. negative...... response that can only be measured by self-report measures. We propose that a joint application of selfreport and physiological measures can lead to richer information and wider interpretation of consumer emotional responses to food packaging elements than using either measure alone....

  2. Packaging the product

    International Nuclear Information System (INIS)

    Newson, Roy; Lewis, Meriel

    1993-01-01

    Full text: Traditionally, when the nuclear industry produces a brochure or video programme, the platform of our arguments is reasoned, factual, abstract, far-sighted and convoluted. It is all about things and processes: energy plants, machinery, numbers and percentages. Yet we know that people are interested only in people, in emotions, in reality, and in basic values about next week or next month. And this is probably the biggest incongruity. Our painstaking, in-depth research backed by technical evidence and statistics is no match for the other side's anecdotal speech making. Our perfectly designed graphics cannot compete against those visual cliches that can give instant life to an abstract idea. In the UK, pioneering work for the British Nuclear Forum's, the Nuclear Industry Education Programme (NIEP) breaks through the traditional approach, allowing passion and feeling to stimulate debate. Material about nuclear power produced for young people often promotes knowledge acquisition about particular aspects of the nuclear fuel cycle without conceptual or value change. NIEP materials build on the experience of developing packages that fully meet curriculum objectives, follow educational best practice, and place nuclear power in a real energy context. But they also make a positive contribution to the meaning a young person attaches to a concept such as radiation. Essentially, the materials are in tune with the way young people make sense of their experience of the real world and the issues in it. For further information about AEA Technology's public acceptance programmes, contact: Roy Newson or Meriel Lewis on +44 235 433650, fax +44 235 432123. (author)

  3. Packaging systems for animal origin food

    Directory of Open Access Journals (Sweden)

    2011-03-01

    Full Text Available The main task of food packaging is to protect the product during storage and transport against the action of biological, chemical and mechanical factors. The paper presents packaging systems for food of animal origin. Vacuum and modified atmosphere packagings were characterised together with novel types of packagings, referred to as intelligent packaging and active packaging. The aim of this paper was to present all advantages and disadvantages of packaging used for meat products. Such list enables to choose the optimal type of packaging for given assortment of food and specific conditions of the transport and storing.

  4. Applications of Active Packaging in Breads

    Directory of Open Access Journals (Sweden)

    Ali Göncü

    2017-10-01

    Full Text Available Changes on consumer preferences lead to innovations and improvements in new packaging technologies. With these new developments passive packaging technologies aiming to protect food nowadays have left their place to active and intelligent packaging technologies that have other various functions beside protection of food. Active packaging is defined as an innovative packaging type and its usage increases the shelf life of food significantly. Applications of active packaging have begun to be used for packaging of breads. In this study active packaging applications in breads have been reviewed.

  5. Effecting aging time of epoxy molding compound to molding process for integrated circuit packaging

    Science.gov (United States)

    Tachapitunsuk, Jirayu; Ugsornrat, Kessararat; Srisuwitthanon, Warayoot; Thonglor, Panakamon

    2017-09-01

    This research studied about effecting aging time of epoxy molding compound (EMC) that effect to reliability performance of integrated circuit (IC) package in molding process. Molding process is so important of IC packaging process for protecting IC chip (or die) from temperature and humidity environment using encapsulated EMC. For general molding process, EMC are stored in the frozen at 5°C and left at room temperature at 25 °C for aging time on self before molding of die onto lead frame is 24 hours. The aging time effect to reliability performance of IC package due to different temperature and humidity inside the package. In experiment, aging time of EMC were varied from 0 to 24 hours for molding process of SOIC-8L packages. For analysis, these packages were tested by x-ray and scanning acoustic microscope to analyze properties of EMC with an aging time and also analyzed delamination, internal void, and wire sweep inside the packages with different aging time. The results revealed that different aging time of EMC effect to properties and reliability performance of molding process.

  6. New Packaging for Amplifier Slabs

    Energy Technology Data Exchange (ETDEWEB)

    Riley, M. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Thorsness, C. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Suratwala, T. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Steele, R. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States); Rogowski, G. [Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

    2015-03-18

    The following memo provides a discussion and detailed procedure for a new finished amplifier slab shipping and storage container. The new package is designed to maintain an environment of <5% RH to minimize weathering.

  7. Dual Use Packaging, Phase II

    Data.gov (United States)

    National Aeronautics and Space Administration — NASA calculation that over a kg of packaging waste are generated per day for a 6 member crew. This represents over 1.5 metric tons of waste during a Mars mission....

  8. Nested Cohort - R software package

    Science.gov (United States)

    NestedCohort is an R software package for fitting Kaplan-Meier and Cox Models to estimate standardized survival and attributable risks for studies where covariates of interest are observed on only a sample of the cohort.

  9. CompareTests-R package

    Science.gov (United States)

    CompareTests is an R package to estimate agreement and diagnostic accuracy statistics for two diagnostic tests when one is conducted on only a subsample of specimens. A standard test is observed on all specimens.

  10. Packages for radiactive waste disposal

    International Nuclear Information System (INIS)

    Oliveira, R. de.

    1983-01-01

    The development of multi-stage type package for sea disposal of compactable nuclear wastes, is presented. The basic requirements for the project followed the NEA and IAEA recommendations and observations of the solutions adopted by others countries. The packages of preliminary design was analysed, by computer, under several conditions arising out of its nature, as well as their conditions descent, dumping and durability in the deep of sea. The designed pressure equalization mechanic and the effect compacting on the package, by prototypes and specific tests, were studied. These prototypes were also submitted to the transport tests of the 'Regulament for the Safe Transport of Radioactive Materials'. Based on results of the testes and the re-evaluation of the preliminary design, final indications and specifications for excuting the package design, are presented. (M.C.K.) [pt

  11. Objectives for radioactive waste packaging

    International Nuclear Information System (INIS)

    Flowers, R.H.

    1982-04-01

    The report falls under the headings: introduction; the nature of radioactive wastes; how to manage radioactive wastes; packaging of radioactive wastes (supervised storage; disposal); waste form evaluation and test requirements (supervised storage; disposal); conclusions. (U.K.)

  12. Packaging Review Guide for Reviewing Safety Analysis Reports for Packagings

    Energy Technology Data Exchange (ETDEWEB)

    DiSabatino, A; Biswas, D; DeMicco, M; Fisher, L E; Hafner, R; Haslam, J; Mok, G; Patel, C; Russell, E

    2007-04-12

    This Packaging Review Guide (PRG) provides guidance for Department of Energy (DOE) review and approval of packagings to transport fissile and Type B quantities of radioactive material. It fulfills, in part, the requirements of DOE Order 460.1B for the Headquarters Certifying Official to establish standards and to provide guidance for the preparation of Safety Analysis Reports for Packagings (SARPs). This PRG is intended for use by the Headquarters Certifying Official and his or her review staff, DOE Secretarial offices, operations/field offices, and applicants for DOE packaging approval. This PRG is generally organized at the section level in a format similar to that recommended in Regulatory Guide 7.9 (RG 7.9). One notable exception is the addition of Section 9 (Quality Assurance), which is not included as a separate chapter in RG 7.9. Within each section, this PRG addresses the technical and regulatory bases for the review, the manner in which the review is accomplished, and findings that are generally applicable for a package that meets the approval standards. This Packaging Review Guide (PRG) provides guidance for DOE review and approval of packagings to transport fissile and Type B quantities of radioactive material. It fulfills, in part, the requirements of DOE O 460.1B for the Headquarters Certifying Official to establish standards and to provide guidance for the preparation of Safety Analysis Reports for Packagings (SARPs). This PRG is intended for use by the Headquarters Certifying Official and his review staff, DOE Secretarial offices, operations/field offices, and applicants for DOE packaging approval. The primary objectives of this PRG are to: (1) Summarize the regulatory requirements for package approval; (2) Describe the technical review procedures by which DOE determines that these requirements have been satisfied; (3) Establish and maintain the quality and uniformity of reviews; (4) Define the base from which to evaluate proposed changes in scope

  13. AliPDU Package Upgrade

    CERN Document Server

    "Martin, Michael

    2015-01-01

    "AliPDU Package" is a set of script, panels, and datapoints designed in WinCC to manage and monitor PDU's. PDU is an essential component in the data center, in order to make data center working properly through the monitoring of power distribution and environmental condition of the data center. In this project "AliPDU Package" is upgraded so it can be used to monitor environmental condition of data center using PDU's and external environmental sensor connected to PDU.

  14. AliPDU Package Upgrade

    CERN Document Server

    Martin, Michael

    2015-01-01

    AliPDU Package is a set of script, panels, and datapoints designed in WinCC to manage and monitor PDU's. PDU is an essential component in the data center, in order to make data center working properly through the monitoring of power distribution and environmental condition of the data center. In this project "AliPDU Package" is upgraded so it can be used to monitor environmental condition of data center using PDU's and external environmental sensor connected to PDU.

  15. Watermarking spot colors in packaging

    Science.gov (United States)

    Reed, Alastair; Filler, TomáÅ.¡; Falkenstern, Kristyn; Bai, Yang

    2015-03-01

    In January 2014, Digimarc announced Digimarc® Barcode for the packaging industry to improve the check-out efficiency and customer experience for retailers. Digimarc Barcode is a machine readable code that carries the same information as a traditional Universal Product Code (UPC) and is introduced by adding a robust digital watermark to the package design. It is imperceptible to the human eye but can be read by a modern barcode scanner at the Point of Sale (POS) station. Compared to a traditional linear barcode, Digimarc Barcode covers the whole package with minimal impact on the graphic design. This significantly improves the Items per Minute (IPM) metric, which retailers use to track the checkout efficiency since it closely relates to their profitability. Increasing IPM by a few percent could lead to potential savings of millions of dollars for retailers, giving them a strong incentive to add the Digimarc Barcode to their packages. Testing performed by Digimarc showed increases in IPM of at least 33% using the Digimarc Barcode, compared to using a traditional barcode. A method of watermarking print ready image data used in the commercial packaging industry is described. A significant proportion of packages are printed using spot colors, therefore spot colors needs to be supported by an embedder for Digimarc Barcode. Digimarc Barcode supports the PANTONE spot color system, which is commonly used in the packaging industry. The Digimarc Barcode embedder allows a user to insert the UPC code in an image while minimizing perceptibility to the Human Visual System (HVS). The Digimarc Barcode is inserted in the printing ink domain, using an Adobe Photoshop plug-in as the last step before printing. Since Photoshop is an industry standard widely used by pre-press shops in the packaging industry, a Digimarc Barcode can be easily inserted and proofed.

  16. TRU waste transportation package development

    International Nuclear Information System (INIS)

    Eakes, R.G.; Lamoreaux, G.H.; Romesberg, L.E.; Sutherland, S.H.; Duffey, T.A.

    1980-01-01

    Inventories of the transuranic wastes buried or stored at various US DOE sites are tabulated. The leading conceptual design of Type-B packaging for contact-handled transuranic waste is the Transuranic Package Transporter (TRUPACT), a large metal container comprising inner and outer tubular steel frameworks which are separated by rigid polyurethane foam and sheathed with steel plate. Testing of TRUPACT is reported. The schedule for its development is given. 6 figures

  17. Food Packaging for Sustainable Development

    OpenAIRE

    Williams, Helén

    2011-01-01

    Packaging has been on the environmental agenda for decades. It has been discussed and debated within the society mainly as an environmental problem. Production, distribution and consumption of food and drinks contribute significant to the environmental impact. However, consumers in the EU waste about 20% of the food they buy. The function of packaging in reducing the amount of food losses is an important but often neglected environmental issue. This thesis focuses on the functions of packagin...

  18. Electronic manufacturing and packaging in Japan

    Science.gov (United States)

    Kelly, Michael J.; Boulton, William R. (Editor); Kukowski, John A.; Meieran, Eugene S.; Pecht, Michael; Peeples, John W.; Tummala, Rao R.

    1995-01-01

    This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies. Japan has established this marked competitive advantage in electronics as a consequence of developing low-cost, high-volume consumer products. Japan's infrastructure, and the remarkable cohesiveness of vision and purpose in government and industry, are key factors in the success of Japan's electronics industry. Although Japan will continue to dominate consumer electronics in the foreseeable future, opportunities exist for the United States and other industrial countries to capture an increasingly large part of the market. The JTEC panel has identified no insurmountable barriers that would prevent the United States from regaining a significant share of the consumer electronics market; in fact, there is ample evidence that the United States needs to aggressively pursue high-volume, low-cost electronic assembly, because it is a critical path leading to high-performance electronic systems.

  19. Portable Radiation Package (PRP) Instrument Handbook

    Energy Technology Data Exchange (ETDEWEB)

    Reynolds, R Michael [Remote Measurements and Research Company, Seattle, WA (United States)

    2017-08-03

    The Portable Radiation Package (PRP) was developed to provide basic radiation information in locations such as ships at sea where proper exposure is remote and difficult, the platform is in motion, and azimuth alignment is not fixed. Development of the PRP began at Brookhaven National Laboratory (BNL) in the mid-1990s and versions of it were deployed on ships in the U.S. Department of Energy (DOE) Atmospheric Radiation Measurement (ARM) Climate Research Facility’s Nauru-99 project. The PRP was deployed on ships in support of the National Aeronautics and Space Administration (NASA) Sensor Intercomparison for Marine Biological and Interdisciplinary Ocean Studies (SIMBIOS) program. Over the years the measurements have remained the same while the post-processing data analysis, especially for the FRSR, has evolved. This document describes the next-generation Portable Radiation Package (PRP2) that was developed for the DOE ARM Facility, under contract no. 9F-31462 from Argonne National Laboratory (ANL). The PRP2 has the same scientific principles that were well validated in prior studies, but has upgraded electronic hardware. The PRP2 approach is completely modular, both in hardware and software. Each sensor input is treated as a separate serial stream into the data collection computer. In this way the operator has complete access to each component of the system for purposes of error checking, calibration, and maintenance. The resulting system is more reliable, easier to install in complex situations, and more amenable to upgrade.

  20. DMD reliability: a MEMS success story

    Science.gov (United States)

    Douglass, Michael

    2003-01-01

    The Digital Micromirror Device (DMD) developed by Texas Instruments (TI) has made tremendous progress in both performance and reliability since it was first invented in 1987. From the first working concept of a bistable mirror, the DMD is now providing high-brightness, high-contrast, and high-reliability in over 1,500,000 projectors using Digital Light Processing technology. In early 2000, TI introduced the first DMD chip with a smaller mirror (14-micron pitch versus 17-micron pitch). This allowed a greater number of high-resolution DMD chips per wafer, thus providing an increased output capacity as well as the flexibility to use existing package designs. By using existing package designs, subsequent DMDs cost less as well as met our customers' demand for faster time to market. In recent years, the DMD achieved the status of being a commercially successful MEMS device. It reached this status by the efforts of hundreds of individuals working toward a common goal over many years. Neither textbooks nor design guidelines existed at the time. There was little infrastructure in place to support such a large endeavor. The knowledge we gained through our characterization and testing was all we had available to us through the first few years of development. Reliability was only a goal in 1992 when production development activity started; a goal that many throughout the industry and even within Texas Instruments doubted the DMD could achieve. The results presented in this paper demonstrate that we succeeded by exceeding the reliability goals.

  1. Packagings in the silicon era

    International Nuclear Information System (INIS)

    Beone, G.; Mione, A.; Orsini, A.; Forasassi, G.

    1993-01-01

    ENEA is studying, with the collaboration of the DCMN of the Pisa University, a new packaging to collect wastes in various facilities while proceeding to find a final disposal. Following a survey on the wastes that could be transported in the future, it was agreed to design a packaging able to contain an industrial drum, with a maximum capacity of 220 litres and a total weight less than 4000 N, previously filled with solid wastes in bulk or in a solid binding material. The packaging, to be approved as a Type B in agreement with the IAEA Regulations, will be useful to transport not only radioactive wastes but any kind of dangerous goods and also those not in agreement with the UNO Regulations. The 1/2 scale model of the packaging is formed by two concentric vessels of mild steel obtained by welding commercial shells to cylindrical walls and joined through a flange. The new packaging under development presents features that seem to be proper for its envisaged waste collection main use such as construction simplicity, relatively low cost, time and use endurance, low maintenance requirements. The design analysis and testing program ongoing at present allowed for the preliminary definition of the packaging geometry and confirmed the necessity of further investigations in some key areas as the determination of actual behaviour of the silicon foam, used as energy absorbing/thermal insulating material, in the specific conditions of interest. (J.P.N.)

  2. Electronic packaging: new results in singulation by Laser Microjet

    Science.gov (United States)

    Wagner, Frank; Sibailly, Ochelio; Richerzhagen, Bernold

    2004-07-01

    Cutting electronic packages that are produced in a matrix array fashion is an important process and deals with the ready-to-use devices. Thus an increase in the singulation yield is directly correlated to an increase in benefit. Due to the usage of different substrate materials, the saws encounter big problems in terms of lifetime and constancy of cut quality in these applications. Today"s equipment manufacturers are not yet in the position to propose an adequate solution for all types of packages. Compared to classical laser cutting, the water-jet guided laser technology minimizes the heat damages in any kind of sample. This new material processing method consists in guiding a laser beam inside a hair thin, lowpressure water-jet by total internal reflection, and is applied to package singulation since two years approximately. Using a frequency doubled Nd:YAG laser guided by a water jet, an LTCC-ceramics based package is singulated according to a scribe and break process. Speeds of 2-10 mm/s are reached in the LTTC and 40 mm/s in the mold compound. The process is wear-free and provides very good edge quality of the LTCC and the mold compound as well as reliable separation of the packages.

  3. Reliability data banks

    International Nuclear Information System (INIS)

    Cannon, A.G.; Bendell, A.

    1991-01-01

    Following an introductory chapter on Reliability, what is it, why it is needed, how it is achieved and measured, the principles of reliability data bases and analysis methodologies are the subject of the next two chapters. Achievements due to the development of data banks are mentioned for different industries in the next chapter, FACTS, a comprehensive information system for industrial safety and reliability data collection in process plants are covered next. CREDO, the Central Reliability Data Organization is described in the next chapter and is indexed separately, as is the chapter on DANTE, the fabrication reliability Data analysis system. Reliability data banks at Electricite de France and IAEA's experience in compiling a generic component reliability data base are also separately indexed. The European reliability data system, ERDS, and the development of a large data bank come next. The last three chapters look at 'Reliability data banks, - friend foe or a waste of time'? and future developments. (UK)

  4. Suncor maintenance and reliability

    Energy Technology Data Exchange (ETDEWEB)

    Little, S. [Suncor Energy, Calgary, AB (Canada)

    2006-07-01

    Fleet maintenance and reliability at Suncor Energy was discussed in this presentation, with reference to Suncor Energy's primary and support equipment fleets. This paper also discussed Suncor Energy's maintenance and reliability standard involving people, processes and technology. An organizational maturity chart that graphed organizational learning against organizational performance was illustrated. The presentation also reviewed the maintenance and reliability framework; maintenance reliability model; the process overview of the maintenance and reliability standard; a process flow chart of maintenance strategies and programs; and an asset reliability improvement process flow chart. An example of an improvement initiative was included, with reference to a shovel reliability review; a dipper trip reliability investigation; bucket related failures by type and frequency; root cause analysis of the reliability process; and additional actions taken. Last, the presentation provided a graph of the results of the improvement initiative and presented the key lessons learned. tabs., figs.

  5. Scientific investigation plan for NNWSI WBS element 1.2.2.5.L: NNWSI waste package performance assessment: Revision 1

    International Nuclear Information System (INIS)

    Eggert, K.G.; O'Connell, W.J.; Lappa, D.A.

    1986-01-01

    Waste package performance assessment contains three broad categories of activities. These activities are: (1) development of a hydrothermal flow and transport model to test concepts to be used in establishing boundary conditions for performance calculations, and to interface EBS release calculations with total system performance calculations; (2) development of a waste package systems model to provide integrated deterministic assessments of performance and analyses of waste package designs; and (3) development of an uncertainty methodology for combination with the system model to perform probabilistic reliability and performance analysis waste package designs. The first category contains activities that aid in determining the scope of a separate, simplified set of hydrologic calculations needed to characterize the waste package environment for performance assessment calculations. The last two activity categories are directly concerned with waste package performance calculations. A rationale for each activity under these groups is presented. All of the activities of performance assessment are either code development or analyses of waste package problems

  6. Prevention policies addressing packaging and packaging waste: Some emerging trends.

    Science.gov (United States)

    Tencati, Antonio; Pogutz, Stefano; Moda, Beatrice; Brambilla, Matteo; Cacia, Claudia

    2016-10-01

    Packaging waste is a major issue in several countries. Representing in industrialized countries around 30-35% of municipal solid waste yearly generated, this waste stream has steadily grown over the years even if, especially in Europe, specific recycling and recovery targets have been fixed. Therefore, an increasing attention starts to be devoted to prevention measures and interventions. Filling a gap in the current literature, this explorative paper is a first attempt to map the increasingly important phenomenon of prevention policies in the packaging sector. Through a theoretical sampling, 11 countries/states (7 in and 4 outside Europe) have been selected and analyzed by gathering and studying primary and secondary data. Results show evidence of three specific trends in packaging waste prevention policies: fostering the adoption of measures directed at improving packaging design and production through an extensive use of the life cycle assessment; raising the awareness of final consumers by increasing the accountability of firms; promoting collaborative efforts along the packaging supply chains. Copyright © 2016 Elsevier Ltd. All rights reserved.

  7. Assembly reliability of CSPs with various chiip sizes by accelerated thermal and mechanical cycling test

    Science.gov (United States)

    Ghaffarian, R.

    2000-01-01

    A JPL-led chip scale package (CSP) Consortium, composed of team members representing government agencies and private companies, recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.

  8. Fast Qualification of Solder Reliability in Solid-state Lighting System

    NARCIS (Netherlands)

    Zhang, J.

    2015-01-01

    Solid-state lighting (SSL), which is based 0n semiconductor Lighting Emitting Diode (LED), is the most promising and reliable energy saving solution for future lighting applications. Since a bare LED die can hardly survive without a package, one of the most import function of the LED package is to

  9. The Accelerator Reliability Forum

    CERN Document Server

    Lüdeke, Andreas; Giachino, R

    2014-01-01

    A high reliability is a very important goal for most particle accelerators. The biennial Accelerator Reliability Workshop covers topics related to the design and operation of particle accelerators with a high reliability. In order to optimize the over-all reliability of an accelerator one needs to gather information on the reliability of many different subsystems. While a biennial workshop can serve as a platform for the exchange of such information, the authors aimed to provide a further channel to allow for a more timely communication: the Particle Accelerator Reliability Forum [1]. This contribution will describe the forum and advertise it’s usage in the community.

  10. 21 CFR 820.130 - Device packaging.

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Device packaging. 820.130 Section 820.130 Food and... QUALITY SYSTEM REGULATION Labeling and Packaging Control § 820.130 Device packaging. Each manufacturer shall ensure that device packaging and shipping containers are designed and constructed to protect the...

  11. 40 CFR 157.27 - Unit packaging.

    Science.gov (United States)

    2010-07-01

    ... 40 Protection of Environment 23 2010-07-01 2010-07-01 false Unit packaging. 157.27 Section 157.27 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) PESTICIDE PROGRAMS PACKAGING REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.27 Unit packaging. Pesticide products...

  12. 76 FR 30551 - Specifications for Packagings

    Science.gov (United States)

    2011-05-26

    ... design qualification test and each periodic retest on a packaging, a test report must be prepared. The... where the design qualification tests are conducted, for as long as the packaging is produced and for at... report; (5) Manufacturer of the packaging; (6) Description of the packaging design type (e.g. dimensions...

  13. Safety Analysis Report - Packages, 9965, 9968, 9972-9975 Packages

    International Nuclear Information System (INIS)

    Van Alstine, M.N.

    1999-01-01

    This Safety Analysis Report for Packaging (SARP) documents the performance of the 9965 B, 9968 B, 9972 B(U), 9973 B(U), 9974 B(U), and 9975 B(U) packages in satisfying the regulatory safety requirements of the Code of Federal Regulations (CFR) 711 and the International Atomic Energy Agency (IAEA) Safety Series No. 6, Regulations for the Safe Transport of Radioactive Material, 1985 edition2. Results of the analysis and testing performed on the 9965 B, 9968 B, 9972 B(U), 9973 B(U), 9974 B(U), and 9975 B(U) packages are presented in this SARP, which was prepared in accordance with U.S. Department of energy (DOE) Order 5480.33 and in the format specified in the Nuclear Regulatory Commission (NRC) Regulatory Guides 7.94 and 7.10.5

  14. Safety analysis report - packages 9965, 9968, 9972-9975 packages

    International Nuclear Information System (INIS)

    Van Alstine, M.N.

    1997-10-01

    This Safety Analysis Report for Packaging (SARP) documents the performance of the 9965 B( ), 9968 B( ), 9972 B(U), 9973 B(U), 9974 B(U), and 9975 B(U) packages in satisfying the regulatory safety requirements of the Code of Federal Regulations (CFR) 10 CFR 71 and the International Atomic Energy Agency (IAEA) Safety Series No. 6, Regulations for the Safe Transport of Radioactive Material, 1985 edition. Results of the analysis and testing performed on the 9965 B(), 9968 B(), 9972 B(U), 9973 B(U), and 9975 B(U) packages are presented in this SARP, which was prepared in accordance with U.S. Department of Energy (DOE) Order 5480.3 and in the format specified in the Nuclear Regulatory Commission (NRC) Regulatory Guides 7.9 and 7.10

  15. Human Reliability Program Overview

    Energy Technology Data Exchange (ETDEWEB)

    Bodin, Michael

    2012-09-25

    This presentation covers the high points of the Human Reliability Program, including certification/decertification, critical positions, due process, organizational structure, program components, personnel security, an overview of the US DOE reliability program, retirees and academia, and security program integration.

  16. Power electronics reliability analysis.

    Energy Technology Data Exchange (ETDEWEB)

    Smith, Mark A.; Atcitty, Stanley

    2009-12-01

    This report provides the DOE and industry with a general process for analyzing power electronics reliability. The analysis can help with understanding the main causes of failures, downtime, and cost and how to reduce them. One approach is to collect field maintenance data and use it directly to calculate reliability metrics related to each cause. Another approach is to model the functional structure of the equipment using a fault tree to derive system reliability from component reliability. Analysis of a fictitious device demonstrates the latter process. Optimization can use the resulting baseline model to decide how to improve reliability and/or lower costs. It is recommended that both electric utilities and equipment manufacturers make provisions to collect and share data in order to lay the groundwork for improving reliability into the future. Reliability analysis helps guide reliability improvements in hardware and software technology including condition monitoring and prognostics and health management.

  17. Reliability of software

    International Nuclear Information System (INIS)

    Kopetz, H.

    1980-01-01

    Common factors and differences in the reliability of hardware and software; reliability increase by means of methods of software redundancy. Maintenance of software for long term operating behavior. (HP) [de

  18. Reference waste package environment report

    International Nuclear Information System (INIS)

    Glassley, W.E.

    1986-01-01

    One of three candidate repository sites for high-level radioactive waste packages is located at Yucca Mountain, Nevada, in rhyolitic tuff 700 to 1400 ft above the static water table. Calculations indicate that the package environment will experience a maximum temperature of ∼230 0 C at 9 years after emplacement. For the next 300 years the rock within 1 m of the waste packages will remain dehydrated. Preliminary results suggest that the waste package radiation field will have very little effect on the mechanical properties of the rock. Radiolysis products will have a negligible effect on the rock even after rehydration. Unfractured specimens of repository rock show no change in hydrologic characteristics during repeated dehydration-rehydration cycles. Fractured samples with initially high permeabilities show a striking permeability decrease during dehydration-rehydration cycling, which may be due to fracture healing via deposition of silica. Rock-water interaction studies demonstrate low and benign levels of anions and most cations. The development of sorptive secondary phases such as zeolites and clays suggests that anticipated rock-water interaction may produce beneficial changes in the package environment

  19. Hazardous materials package performance regulations

    International Nuclear Information System (INIS)

    Russell, N.A.; Glass, R.E.; McClure, J.D.; Finley, N.C.

    1993-01-01

    Two regulatory philosophies, one based on 'specification' packaging standards and the other based on 'performance' packaging standards, currently define the hazmat packaging certification process. A main concern when setting performance standards is determining the appropriate standards necessary to assure adequate public protection. This paper discusses a Hazmat Packaging Performance Evaluation (HPPE) project being conducted at Sandia National Laboratories for the U.S. Department of Transportation Research and Special Programs Administration. In this project, the current bulk packagings (larger than 2000 gallons) for transporting Materials Extremely Toxic By Inhalation (METBI) are being evaluated and performance standards will be recommended. A computer software system, HazCon, has been developed which can calculate the dispersion of dense, neutral, and buoyant gases. HazCon also has a database of thermodynamic and toxicity data for the METBI materials, a user-friendly menu-driven format for creating input data sets for calculating dispersion of the METBI in the event of an accidental release, and a link between the METBI database and the dense gas dispersion code (which requires thermodynamic properties). The primary output of HazCon is a listing of mass concentrations of the released material at distances downwind from the release point. (J.P.N.)

  20. Nanocellulose in green food packaging.

    Science.gov (United States)

    Vilarinho, Fernanda; Sanches Silva, Ana; Vaz, M Fátima; Farinha, José Paulo

    2017-01-26

    The development of packaging materials with new functionalities and lower environmental impact is now an urgent need of our society. On one hand, the shelf-life extension of packaged products can be an answer to the exponential increase of worldwide demand for food. On the other hand, uncertainty of crude oil prices and reserves has imposed the necessity to find raw materials to replace oil-derived polymers. Additionally, consumers' awareness toward environmental issues increasingly pushes industries to look with renewed interest to "green" solutions. In response to these issues, numerous polymers have been exploited to develop biodegradable food packaging materials. Although the use of biopolymers has been limited due to their poor mechanical and barrier properties, these can be enhanced by adding reinforcing nanosized components to form nanocomposites. Cellulose is probably the most used and well-known renewable and sustainable raw material. The mechanical properties, reinforcing capabilities, abundance, low density, and biodegradability of nanosized cellulose make it an ideal candidate for polymer nanocomposites processing. Here we review the potential applications of cellulose based nanocomposites in food packaging materials, highlighting the several types of biopolymers with nanocellulose fillers that have been used to form bio-nanocomposite materials. The trends in nanocellulose packaging applications are also addressed.

  1. Development of ZL400 Mine Cooling Unit Using Semi-Hermetic Screw Compressor and Its Application on Local Air Conditioning in Underground Long-Wall Face

    Science.gov (United States)

    Chu, Zhaoxiang; Ji, Jianhu; Zhang, Xijun; Yan, Hongyuan; Dong, Haomin; Liu, Junjie

    2016-12-01

    Aiming at heat injuries occurring in the process of deep coal mining in China, a ZL400 mine-cooling unit employing semi-hermetic screw compressor with a cooling capacity of 400 kW is developed. This paper introduced its operating principle, structural characteristics and technical indexes. By using the self-built testing platform, some parameters for indication of its operation conditions were tested on the ground. The results show that the aforementioned cooling unit is stable in operation: cooling capacity of the unit was 420 kW underground-test conditions, while its COP (coefficient of performance) reached 3.4. To address the issue of heat injuries existing in No. 16305 U-shaped long-wall ventilation face of Jining No. 3 coal mine, a local air conditioning system was developed with ZL400 cooling unit as the system's core. The paper presented an analysis of characteristics of the air current flowing in the air-mixing and cooling mode of ZL400 cooling unit used in air intake way. Through i-d patterns we described the process of the airflow treatment, such as cooling, mixing and heating, etc. The cooling system decreased dry bulb temperature on working face by 3°C on average and 3.8°C at most, while lowered the web bulb temperature by 3.6°C on average and 4.8°C at most. At the same time, it reduced relative humidity by 5% on average and 8.6% at most. The field application of the ZL400 cooling unit had gain certain effects in air conditioning and provided support for the solution of mine heat injuries in China in terms of technology and equipment.

  2. Investigation of molecular metabolites in expired air of healthy man in condition of long-term isolation in hermetical confined environment

    Science.gov (United States)

    Tsarkov, Dmitriy; Mardanov, Robert; Markin, Andrey; Moukhamedieva, Lana

    Investigation of intermediary metabolites, produced in cells, in expired air of healthy man is directed on determination of molecular markers which are reflecting normal physiological pro-cesses in an organism, as well as on determination and validation of biomarkers for objective screening and non-invasive prenosological diagnostics of disorders in metabolic processes caused by negative effect of live environment. Investigation of influence of long-term isolation in her-metical confined environment on composition of healthy human expired air was made during experiment with 105 days isolation in condition of controlled environment and standard food ra-tion. Expired air samples were analyzed on gas chromatograph associated with the quadrupole mass spectrometer. The investigation results show that at rest hydroxy ketones, mostly 1-hydroxy-prorapanone-2 (acetol), aldehydes (decenal, benzaldehyde), acetophenone, phenol and fatty acids were determined. After physical performance (oxidative stress) the content of ke-tones (heptanone-2, heptanone-3), phenol, determined aldehydes (decenal, octadecenal) and acetol in expired air of volunteers decreased. It can be concerned with prevailing of alternative -methylglyoxalic metabolic pathway and caused by oxidative stress. Analysis of expired air samples taken on 30, 60 and 90 day of isolation showed that in conditions of long-term iso-lation concentration of heptanone-2, heptanone-3, 2,3-butadione, acetol, furanones, aldehydes (decenal, benzaldehyde) and acetophenone is increasing while concentration of phenol and fatty acids is decreasing as compared to samples taken before isolation. It was shown that dynamics of concentration of saturated hydrocarbons in expired air can be informative marker for estima-tion of organism response to oxidative stress, while the level of acetol can be used as indicator of man's training status, validity of exercise load and as a marker of hypoxic state.

  3. Function Package for Computing Quantum Resource Measures

    Science.gov (United States)

    Huang, Zhiming

    2018-05-01

    In this paper, we present a function package for to calculate quantum resource measures and dynamics of open systems. Our package includes common operators and operator lists, frequently-used functions for computing quantum entanglement, quantum correlation, quantum coherence, quantum Fisher information and dynamics in noisy environments. We briefly explain the functions of the package and illustrate how to use the package with several typical examples. We expect that this package is a useful tool for future research and education.

  4. Reliable Design Versus Trust

    Science.gov (United States)

    Berg, Melanie; LaBel, Kenneth A.

    2016-01-01

    This presentation focuses on reliability and trust for the users portion of the FPGA design flow. It is assumed that the manufacturer prior to hand-off to the user tests FPGA internal components. The objective is to present the challenges of creating reliable and trusted designs. The following will be addressed: What makes a design vulnerable to functional flaws (reliability) or attackers (trust)? What are the challenges for verifying a reliable design versus a trusted design?

  5. Pocket Handbook on Reliability

    Science.gov (United States)

    1975-09-01

    exponencial distributions Weibull distribution, -xtimating reliability, confidence intervals, relia- bility growth, 0. P- curves, Bayesian analysis. 20 A S...introduction for those not familiar with reliability and a good refresher for those who are currently working in the area. LEWIS NERI, CHIEF...includes one or both of the following objectives: a) prediction of the current system reliability, b) projection on the system reliability for someI future

  6. The paradox of packaging optimization – a characterization of packaging source reduction in the Netherlands

    NARCIS (Netherlands)

    van Sluisveld, M.A.E.; Worrell, E.

    2013-01-01

    The European Council Directive 94/62/EC for Packaging and Packaging Waste requires that Member States implement packaging waste prevention measures. However, consumption and subsequently packaging waste figures are still growing annually. It suggests that policies to accomplish packaging waste

  7. Principles of Bridge Reliability

    DEFF Research Database (Denmark)

    Thoft-Christensen, Palle; Nowak, Andrzej S.

    The paper gives a brief introduction to the basic principles of structural reliability theory and its application to bridge engineering. Fundamental concepts like failure probability and reliability index are introduced. Ultimate as well as serviceability limit states for bridges are formulated......, and as an example the reliability profile and a sensitivity analyses for a corroded reinforced concrete bridge is shown....

  8. Reliability in engineering '87

    International Nuclear Information System (INIS)

    Tuma, M.

    1987-01-01

    The participants heard 51 papers dealing with the reliability of engineering products. Two of the papers were incorporated in INIS, namely ''Reliability comparison of two designs of low pressure regeneration of the 1000 MW unit at the Temelin nuclear power plant'' and ''Use of probability analysis of reliability in designing nuclear power facilities.''(J.B.)

  9. Waste package materials selection process

    International Nuclear Information System (INIS)

    Roy, A.K.; Fish, R.L.; McCright, R.D.

    1994-01-01

    The office of Civilian Radioactive Waste Management (OCRWM) of the United States Department of Energy (USDOE) is evaluating a site at Yucca Mountain in Southern Nevada to determine its suitability as a mined geologic disposal system (MGDS) for the disposal of high-level nuclear waste (HLW). The B ampersand W Fuel Company (BWFC), as a part of the Management and Operating (M ampersand O) team in support of the Yucca Mountain Site Characterization Project (YMP), is responsible for designing and developing the waste package for this potential repository. As part of this effort, Lawrence Livermore National Laboratory (LLNL) is responsible for testing materials and developing models for the materials to be used in the waste package. This paper is aimed at presenting the selection process for materials needed in fabricating the different components of the waste package

  10. Radiation sterilization and food packaging

    International Nuclear Information System (INIS)

    Harrison, N.

    1991-01-01

    Food irradiation by gamma radiation or electron beams offers a number of benefits to be consumer and to the food industry. Low doses can delay fruit ripening while higher doses can reduce or eliminate pathrogenic microorganisms and control insect infestation. However, ionizing radiations are known to have an effect on the plastics used for food packaging, especially PVC and polyethylene. This chapter looks at food irradiation generally, including legislation on the irradiation of food packaging materials. The effect on specific polymers (PVC, polyethylenes, polypropylene, polystyrene, polyamides and flexible laminates) is then considered. It is concluded that few of the plastics used for food packaging are significantly affected by an overall average dose of 10KGy, the maximum likely for the irradiation of prepackaged food in the United Kingdom. (UK)

  11. Investigations into High Temperature Components and Packaging

    Energy Technology Data Exchange (ETDEWEB)

    Marlino, L.D.; Seiber, L.E.; Scudiere, M.B.; M.S. Chinthavali, M.S.; McCluskey, F.P.

    2007-12-31

    The purpose of this report is to document the work that was performed at the Oak Ridge National Laboratory (ORNL) in support of the development of high temperature power electronics and components with monies remaining from the Semikron High Temperature Inverter Project managed by the National Energy Technology Laboratory (NETL). High temperature electronic components are needed to allow inverters to operate in more extreme operating conditions as required in advanced traction drive applications. The trend to try to eliminate secondary cooling loops and utilize the internal combustion (IC) cooling system, which operates with approximately 105 C water/ethylene glycol coolant at the output of the radiator, is necessary to further reduce vehicle costs and weight. The activity documented in this report includes development and testing of high temperature components, activities in support of high temperature testing, an assessment of several component packaging methods, and how elevated operating temperatures would impact their reliability. This report is organized with testing of new high temperature capacitors in Section 2 and testing of new 150 C junction temperature trench insulated gate bipolar transistor (IGBTs) in Section 3. Section 4 addresses some operational OPAL-GT information, which was necessary for developing module level tests. Section 5 summarizes calibration of equipment needed for the high temperature testing. Section 6 details some additional work that was funded on silicon carbide (SiC) device testing for high temperature use, and Section 7 is the complete text of a report funded from this effort summarizing packaging methods and their reliability issues for use in high temperature power electronics. Components were tested to evaluate the performance characteristics of the component at different operating temperatures. The temperature of the component is determined by the ambient temperature (i.e., temperature surrounding the device) plus the

  12. Design for reliability of solid state lighting systems

    NARCIS (Netherlands)

    Perpiñà, X.; Werkhoven, R.J.; Jakovenko, J.; Formánek, J.; Vellvehi, M.; Jordà, X.; Kunen, J.M.G.; Bancken, P.; Bolt, P.J.

    2012-01-01

    This work presents a methodology to design an SSL system for reliability. An LED lamp is thermally characterised and its model thermally simulated, indicating that the LED board (FR4 board with thermal vias, copper tracks and LED package) is the thermally most stressed part. Therefore, a

  13. Flexible packaging for PV modules

    Science.gov (United States)

    Dhere, Neelkanth G.

    2008-08-01

    Economic, flexible packages that provide needed level of protection to organic and some other PV cells over >25-years have not yet been developed. However, flexible packaging is essential in niche large-scale applications. Typical configuration used in flexible photovoltaic (PV) module packaging is transparent frontsheet/encapsulant/PV cells/flexible substrate. Besides flexibility of various components, the solder bonds should also be flexible and resistant to fatigue due to cyclic loading. Flexible front sheets should provide optical transparency, mechanical protection, scratch resistance, dielectric isolation, water resistance, UV stability and adhesion to encapsulant. Examples are Tefzel, Tedlar and Silicone. Dirt can get embedded in soft layers such as silicone and obscure light. Water vapor transmittance rate (WVTR) of polymer films used in the food packaging industry as moisture barriers are ~0.05 g/(m2.day) under ambient conditions. In comparison, light emitting diodes employ packaging components that have WVTR of ~10-6 g/(m2.day). WVTR of polymer sheets can be improved by coating them with dense inorganic/organic multilayers. Ethylene vinyl acetate, an amorphous copolymer used predominantly by the PV industry has very high O2 and H2O diffusivity. Quaternary carbon chains (such as acetate) in a polymer lead to cleavage and loss of adhesional strength at relatively low exposures. Reactivity of PV module components increases in presence of O2 and H2O. Adhesional strength degrades due to the breakdown of structure of polymer by reactive, free radicals formed by high-energy radiation. Free radical formation in polymers is reduced when the aromatic rings are attached at regular intervals. This paper will review flexible packaging for PV modules.

  14. The development of an enhanced strain measurement device to support testing of radioactive material packages

    International Nuclear Information System (INIS)

    Uncapkher, W.L.; Arviso, M.

    1995-01-01

    Radioactive material package designers use structural testing to verify and demonstrate package performance. A major part of evaluating structural response is the collection of reliable instrumentation measurement data. Over the last four decades, Sandia National Laboratories (SNL) has been actively involved in the development, testing, and evaluation of measurement devices for a broad range of applications, resulting in the commercialization of several measurement devices commonly used today. SNL maintains an ongoing program sponsored by the US Department of Energy (DOE) to develop and evaluate measurement devices to support testing of packages used to transport radioactive or hazardous materials. The development of the enhanced strain measurement device is part of this program

  15. Reliable computer systems.

    Science.gov (United States)

    Wear, L L; Pinkert, J R

    1993-11-01

    In this article, we looked at some decisions that apply to the design of reliable computer systems. We began with a discussion of several terms such as testability, then described some systems that call for highly reliable hardware and software. The article concluded with a discussion of methods that can be used to achieve higher reliability in computer systems. Reliability and fault tolerance in computers probably will continue to grow in importance. As more and more systems are computerized, people will want assurances about the reliability of these systems, and their ability to work properly even when sub-systems fail.

  16. Human factor reliability program

    International Nuclear Information System (INIS)

    Knoblochova, L.

    2017-01-01

    The human factor's reliability program was at Slovenske elektrarne, a.s. (SE) nuclear power plants. introduced as one of the components Initiatives of Excellent Performance in 2011. The initiative's goal was to increase the reliability of both people and facilities, in response to 3 major areas of improvement - Need for improvement of the results, Troubleshooting support, Supporting the achievement of the company's goals. The human agent's reliability program is in practice included: - Tools to prevent human error; - Managerial observation and coaching; - Human factor analysis; -Quick information about the event with a human agent; -Human reliability timeline and performance indicators; - Basic, periodic and extraordinary training in human factor reliability(authors)

  17. CRRES microelectronics test package (MEP)

    International Nuclear Information System (INIS)

    Mullen, E.G.; Ray, K.P.

    1993-01-01

    The Microelectronics Test Package (MEP) flown on board the Combined Release and Radiation Effects Satellite (CRRES) contained over 60 device types and approximately 400 total devices which were tested for both single event upset (SEU) and total dose (parametric degradation and annealing). A description of the experiment, the method of testing devices, and the structure of data acquisition are presented. Sample flight data are shown. These included SEUs from a GaAs 1 K RAM during the March 1991 solar flare, and a comparison between passive shielding and a specially designed spot shielding package

  18. Project monitoring package (PMP) : A package for project activity monitoring

    International Nuclear Information System (INIS)

    Vyas, K.N.; Kannan, A.; Susandhi, R.; Basu, S.

    1987-01-01

    A package for preparing PERT/CPM network diagrams has been written for PDP-11/34. The program uses PLOT-10 library calls for device interfacing. The package is essentially non-interactive in nature, and reads input data in the form of activity description and duration. It calculates the critical path time and performs time scaling of the events. The report gives a brief outline of the logic used, a sample plot and tabular output for reference. An additional facility for performing project activity monitoring has also been implemented. Activity monitoring generally requires various reports such as feed back reports from various group co-ordinators, information report for project co-ordinator and brief periodical reports for management. A package 'DATATRIEVE' (DTR) on PDP-11/34 system is utilized for generating the above mentioned reports. As DTR can also use normal sequential files, an interfacing program has been written which reformats the files accepted by PERT program acceptable to DTR. Various types of reports as generated by DTR are included. However this part of the package is not transportable and can be implemented only on systems having DTR. 6 figures. (author)

  19. Intelligent food packaging - research and development

    Directory of Open Access Journals (Sweden)

    Renata Dobrucka

    2015-03-01

    Full Text Available Packaging also fosters effective marketing of the food through distribution and sale channels. It is of the utmost importance to optimize the protection of the food, a great quality and appearance - better than typical packaged foods. In recent years, intelligent packaging became very popular. Intelligent packaging is becoming more and more widely used for food products. Application of this type of solution contributes to improvement of the quality consumer life undoubtedly. Intelligent packaging refers to a package that can sense environmental changes, and in turn, informs the users about the changes. These packaging systems contain devices that are capable of sensing and providing information about the functions and properties of the packaged foods. Also, this paper will review intelligent packaging technologies and describe different types of indicators (time-temperature indicators, freshness indicators.

  20. Green Packaging Development. : A way to efficient, effective and more environmental friendly packaging solutions.

    OpenAIRE

    Mian Muhammad, Masoud

    2011-01-01

    Growing pressure on the packaging design to enhance the environmental and logistics performance of a packaging system stresses the packaging designers to search new design strategies that not only fulfill logistics requirements in the supply chain, but also reduce the CO 2emissions during the packaging life cycle. This thesis focuses on the packaging design process and suggests some improvements by considering its logistics performance and CO 2emissions. A Green packaging development model wa...

  1. Color in packaging design : Case: ZheJiang JinSheng packaging Co,Ltd

    OpenAIRE

    Hu, Cuicui

    2010-01-01

    Color occupies an important position in packaging design, with the improvement of living standard, the higher requirement of color design in packaging. The aim of this thesis was to discuss key issues concerning aesthetics of packaging design. Topics will include an overview of the packaging design, the influence factor of packaging design, and introduce the aesthetics from packaging aspect. This thesis will also identify common problems of the production process, and list the phases of ho...

  2. Novel SU-8 based vacuum wafer-level packaging for MEMS devices

    DEFF Research Database (Denmark)

    Murillo, Gonzalo; Davis, Zachary James; Keller, Stephan Urs

    2010-01-01

    This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability and versa......This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability...

  3. Annual Symposium in Electronics Packaging

    CERN Document Server

    1991-01-01

    Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be cle...

  4. A Computerized Petroleum Geology Package.

    Science.gov (United States)

    Moser, Louise E.

    1983-01-01

    Describes a package of computer programs developed to implement an oil exploration game that gives undergraduate students practical experience in applying theoretical principles of petroleum geology. The programs facilitate management of the game by the instructor and enhance the learning experience. (Author/MBR)

  5. The taste of desserts' packages.

    Science.gov (United States)

    Overbeeke, C J; Peters, M E

    1991-10-01

    This article reports an experiment on expressing the behavioural meaning of designed objects. Can a designer express the taste of a desert in the form of its packaging and can consumers match these forms when tasting the desserts? Analysis of responses of 12 adults indicates positive answers to these questions.

  6. Food Nanotechnology - Food Packaging Applications

    Science.gov (United States)

    Astonishing growth in the market for nanofoods is predicted in the future, from the current market of $2.6 billion to $20.4 billion in 2010. The market for nanotechnology in food packaging alone is expected to reach $360 million in 2008. In large part, the impetus for this predicted growth is the ...

  7. Improved switch-resistor packaging

    Science.gov (United States)

    Redmerski, R. E.

    1980-01-01

    Packaging approach makes resistors more accessible and easily identified with specific switches. Failures are repaired more quickly because of improved accessibility. Typical board includes one resistor that acts as circuit breaker, and others are positioned so that their values can be easily measured when switch is operated. Approach saves weight by using less wire and saves valuable panel space.

  8. Hanford Site radioactive hazardous materials packaging directory

    International Nuclear Information System (INIS)

    McCarthy, T.L.

    1995-12-01

    The Hanford Site Radioactive Hazardous Materials Packaging Directory (RHMPD) provides information concerning packagings owned or routinely leased by Westinghouse Hanford Company (WHC) for offsite shipments or onsite transfers of hazardous materials. Specific information is provided for selected packagings including the following: general description; approval documents/specifications (Certificates of Compliance and Safety Analysis Reports for Packaging); technical information (drawing numbers and dimensions); approved contents; areas of operation; and general information. Packaging Operations ampersand Development (PO ampersand D) maintains the RHMPD and may be contacted for additional information or assistance in obtaining referenced documentation or assistance concerning packaging selection, availability, and usage

  9. Hanford Site radioactive hazardous materials packaging directory

    Energy Technology Data Exchange (ETDEWEB)

    McCarthy, T.L.

    1995-12-01

    The Hanford Site Radioactive Hazardous Materials Packaging Directory (RHMPD) provides information concerning packagings owned or routinely leased by Westinghouse Hanford Company (WHC) for offsite shipments or onsite transfers of hazardous materials. Specific information is provided for selected packagings including the following: general description; approval documents/specifications (Certificates of Compliance and Safety Analysis Reports for Packaging); technical information (drawing numbers and dimensions); approved contents; areas of operation; and general information. Packaging Operations & Development (PO&D) maintains the RHMPD and may be contacted for additional information or assistance in obtaining referenced documentation or assistance concerning packaging selection, availability, and usage.

  10. SMART PACKAGING FOR FOOD PRESERVATION

    Directory of Open Access Journals (Sweden)

    Raquel Rodríguez-Sauceda

    2014-07-01

    Full Text Available One of the biggest challenges of the food industry is the preservation of its products, that is, to prevent them from being attacked by microorganisms that decompose them hauling economic losses and severe health damage to the consumer. Today, competition in the food industry is very high and any company that does not offer the quality products is doomed to fail. Consumers demand more and the industry still stands offering what is asked: quality, security and safety. The package, in addition to fulfilling its core functions is becoming a means of sophisticated interactions with content and a record of relevant information for both the end consumer and intermediate players in the value chain and concepts are born of active and intelligent packaging. A smart container is defined as a system that monitors the condition of the packaged product, being able to register and provide information about product quality or condition of the container, showing the possible "abnormal" practices that have suffered the product or the container during the entire supply chain, such as transportation or storage. These systems monitor the mechanisms of altered food due to physiological, chemical and biological processes that respond and communicate changes in the status of the product as time-temperature, Oxygen, Carbon dioxide, microbial growth, etc. There are different types of smart packaging such as time-temperature indicators, color indicators, indicators of pathogens and indicators of leaks, to name a few. Through literature review, arguments that demonstrate the usefulness and necessity of the use of smart packaging to preserve the quality and safety of the product it contains, from manufacturing to the time it is used by consumers were found, as these besides communicating or providing information about their state, acting as a marketing tool.

  11. Plastic food packaging and health

    Directory of Open Access Journals (Sweden)

    Raika Durusoy

    2011-02-01

    Full Text Available Plastics have a wide usage in our daily lives. One of their uses is for food packaging and food containers. The aim of this review is to introduce different types of chemicals that can leach from food packaging plastics into foods and cause human exposure and to mention their effects on health. The types of plastics were reviewed under the 13 headings in Turkish Codex Alimentarius and plastics recycling symbols were provided to enable the recognition of the type of plastic when applicable. Chemicals used during the production and that can cause health risks are investigated under the heading of the relevant type of plastic. The most important chemicals from plastic food packaging that can cause toxicity are styrene, 1,3-butadiene, melamine, formaldehyde, acrylamide, di-2-ethylhexyl phthalate, di-2-ethylhexyl adipate, vinyl chloride and bisphenol A. These chemicals have endocrine disrupting, carcinogenic and/or development disrupting effects. These chemicals may leach into foods depending on the chemical properties of the plastic or food, temperature during packaging, processing and storage, exposure to UV and duration of storage. Contact with fatty/oily or acidic foods, heating of the food inside the container, or drinking hot drinks from plastic cups, use of old and scratched plastics and some detergents increase the risk of leaching. The use of plastic containers and packaging for food and beveradges should be avoided whenever possible and when necessary, less harmful types of plastic should be preferred. [TAF Prev Med Bull 2011; 10(1.000: 87-96

  12. Packaged Capacitive Pressure Sensor System for Aircraft Engine Health Monitoring

    Science.gov (United States)

    Scardelletti, Maximilian C.; Zorman, Christian A.

    2016-01-01

    This paper describes the development of a packaged silicon carbide (SiC) based MEMS pressure sensor system designed specifically for a conventional turbofan engine. The electronic circuit is based on a Clapp-type oscillator that incorporates a 6H-SiC MESFET, a SiCN MEMS capacitive pressure sensor, titanate MIM capacitors, wirewound inductors, and thick film resistors. The pressure sensor serves as the capacitor in the LC tank circuit, thereby linking pressure to the resonant frequency of the oscillator. The oscillator and DC bias circuitry were fabricated on an alumina substrate and secured inside a metal housing. The packaged sensing system reliably operates at 0 to 350 psi and 25 to 540C. The system has a pressure sensitivity of 6.8 x 10E-2 MHzpsi. The packaged system shows negligible difference in frequency response between 25 and 400C. The fully packaged sensor passed standard benchtop acceptance tests and was evaluated on a flight-worthy engine.

  13. Packaging of silicon sensors for microfluidic bio-analytical applications

    International Nuclear Information System (INIS)

    Wimberger-Friedl, Reinhold; Prins, Menno; Megens, Mischa; Dittmer, Wendy; Witz, Christiane de; Nellissen, Ton; Weekamp, Wim; Delft, Jan van; Ansems, Will; Iersel, Ben van

    2009-01-01

    A new industrial concept is presented for packaging biosensor chips in disposable microfluidic cartridges to enable medical diagnostic applications. The inorganic electronic substrates, such as silicon or glass, are integrated in a polymer package which provides the electrical and fluidic interconnections to the world and provides mechanical strength and protection for out-of-lab use. The demonstrated prototype consists of a molded interconnection device (MID), a silicon-based giant magneto-resistive (GMR) biosensor chip, a flex and a polymer fluidic part with integrated tubing. The various processes are compatible with mass manufacturing and run at a high yield. The devices show a reliable electrical interconnection between the sensor chip and readout electronics during extended wet operation. Sandwich immunoassays were carried out in the cartridges with surface functionalized sensor chips. Biological response curves were determined for different concentrations of parathyroid hormone (PTH) on the packaged biosensor, which demonstrates the functionality and biocompatibility of the devices. The new packaging concept provides a platform for easy further integration of electrical and fluidic functions, as for instance required for integrated molecular diagnostic devices in cost-effective mass manufacturing

  14. Overview of NASA Langley's Piezoelectric Ceramic Packaging Technology and Applications

    Science.gov (United States)

    Bryant, Robert G.

    2007-01-01

    Over the past decade, NASA Langley Research Center (LaRC) has developed several actuator packaging concepts designed to enhance the performance of commercial electroactive ceramics. NASA LaRC focused on properly designed actuator and sensor packaging for the following reasons, increased durability, protect the working material from the environment, allow for proper mechanical and electrical contact, afford "ready to use" mechanisms that are scalable, and develop fabrication methodology applicable to any active material of the same physical class. It is more cost effective to enhance or tailor the performance of existing systems, through innovative packaging, than to develop, test and manufacture new materials. This approach led to the development of several solid state actuators that include THUNDER, the Macrofiber Composite or (MFC) and the Radial Field Diaphragm or (RFD). All these actuators are fabricated using standard materials and processes derived from earlier concepts. NASA s fabrication and packaging technology as yielded, piezoelectric actuators and sensors that are easy to implement, reliable, consistent in properties, and of lower cost to manufacture in quantity, than their predecessors (as evidenced by their continued commercial availability.) These piezoelectric actuators have helped foster new research and development in areas involving computational modeling, actuator specific refinements, and engineering system redesign which led to new applications for piezo-based devices that replace traditional systems currently in use.

  15. Utilization of Pb-free solders in MEMS packaging

    Science.gov (United States)

    Selvaduray, Guna S.

    2003-01-01

    Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

  16. Reliability and safety engineering

    CERN Document Server

    Verma, Ajit Kumar; Karanki, Durga Rao

    2016-01-01

    Reliability and safety are core issues that must be addressed throughout the life cycle of engineering systems. Reliability and Safety Engineering presents an overview of the basic concepts, together with simple and practical illustrations. The authors present reliability terminology in various engineering fields, viz.,electronics engineering, software engineering, mechanical engineering, structural engineering and power systems engineering. The book describes the latest applications in the area of probabilistic safety assessment, such as technical specification optimization, risk monitoring and risk informed in-service inspection. Reliability and safety studies must, inevitably, deal with uncertainty, so the book includes uncertainty propagation methods: Monte Carlo simulation, fuzzy arithmetic, Dempster-Shafer theory and probability bounds. Reliability and Safety Engineering also highlights advances in system reliability and safety assessment including dynamic system modeling and uncertainty management. Cas...

  17. Human reliability analysis

    International Nuclear Information System (INIS)

    Dougherty, E.M.; Fragola, J.R.

    1988-01-01

    The authors present a treatment of human reliability analysis incorporating an introduction to probabilistic risk assessment for nuclear power generating stations. They treat the subject according to the framework established for general systems theory. Draws upon reliability analysis, psychology, human factors engineering, and statistics, integrating elements of these fields within a systems framework. Provides a history of human reliability analysis, and includes examples of the application of the systems approach

  18. Reliability of electronic systems

    International Nuclear Information System (INIS)

    Roca, Jose L.

    2001-01-01

    Reliability techniques have been developed subsequently as a need of the diverse engineering disciplines, nevertheless they are not few those that think they have been work a lot on reliability before the same word was used in the current context. Military, space and nuclear industries were the first ones that have been involved in this topic, however not only in these environments it is that it has been carried out this small great revolution in benefit of the increase of the reliability figures of the products of those industries, but rather it has extended to the whole industry. The fact of the massive production, characteristic of the current industries, drove four decades ago, to the fall of the reliability of its products, on one hand, because the massively itself and, for other, to the recently discovered and even not stabilized industrial techniques. Industry should be changed according to those two new requirements, creating products of medium complexity and assuring an enough reliability appropriated to production costs and controls. Reliability began to be integral part of the manufactured product. Facing this philosophy, the book describes reliability techniques applied to electronics systems and provides a coherent and rigorous framework for these diverse activities providing a unifying scientific basis for the entire subject. It consists of eight chapters plus a lot of statistical tables and an extensive annotated bibliography. Chapters embrace the following topics: 1- Introduction to Reliability; 2- Basic Mathematical Concepts; 3- Catastrophic Failure Models; 4-Parametric Failure Models; 5- Systems Reliability; 6- Reliability in Design and Project; 7- Reliability Tests; 8- Software Reliability. This book is in Spanish language and has a potentially diverse audience as a text book from academic to industrial courses. (author)

  19. Operational safety reliability research

    International Nuclear Information System (INIS)

    Hall, R.E.; Boccio, J.L.

    1986-01-01

    Operating reactor events such as the TMI accident and the Salem automatic-trip failures raised the concern that during a plant's operating lifetime the reliability of systems could degrade from the design level that was considered in the licensing process. To address this concern, NRC is sponsoring the Operational Safety Reliability Research project. The objectives of this project are to identify the essential tasks of a reliability program and to evaluate the effectiveness and attributes of such a reliability program applicable to maintaining an acceptable level of safety during the operating lifetime at the plant

  20. Circuit design for reliability

    CERN Document Server

    Cao, Yu; Wirth, Gilson

    2015-01-01

    This book presents physical understanding, modeling and simulation, on-chip characterization, layout solutions, and design techniques that are effective to enhance the reliability of various circuit units.  The authors provide readers with techniques for state of the art and future technologies, ranging from technology modeling, fault detection and analysis, circuit hardening, and reliability management. Provides comprehensive review on various reliability mechanisms at sub-45nm nodes; Describes practical modeling and characterization techniques for reliability; Includes thorough presentation of robust design techniques for major VLSI design units; Promotes physical understanding with first-principle simulations.

  1. The impact of packaging on product competition

    Directory of Open Access Journals (Sweden)

    Maryam Masoumi

    2012-09-01

    Full Text Available The primary objective of this paper is to detect important factors, which are influencing competitive advantage. The proposed model of this paper uses sampling technique to measure characteristics of society. There are eight independent variables for the proposed study of this paper including packaging endurance, easy distribution, customer promotion through packaging, packaging structure, packaging as silent advertiser, diversity of packaging, clean and healthy packaging and innovation in packaging. The proposed study uses structural equation modeling to either accept or reject all hypotheses associated with the proposed study of this paper. The population of this study includes all managers and experts who are involved in packaging products. We used simple sampling technique and chooses 300 from a population of 450 people who are considered as the population of this survey. Cronbach alpha was determined as 0.732, which is above the minimum acceptable level. The results confirm that all mentioned factors influence competitiveness, effectively.

  2. GRIP LIGHTNING INSTRUMENT PACKAGE (LIP) V1

    Data.gov (United States)

    National Aeronautics and Space Administration — The GRIP Lightning Instrument Package (LIP) dataset was collected by the Lightning Instrument Package (LIP), which consists of 6 rotating vane type electric field...

  3. Sensory impacts of food-packaging interactions.

    Science.gov (United States)

    Duncan, Susan E; Webster, Janet B

    2009-01-01

    Sensory changes in food products result from intentional or unintentional interactions with packaging materials and from failure of materials to protect product integrity or quality. Resolving sensory issues related to plastic food packaging involves knowledge provided by sensory scientists, materials scientists, packaging manufacturers, food processors, and consumers. Effective communication among scientists and engineers from different disciplines and industries can help scientists understand package-product interactions. Very limited published literature describes sensory perceptions associated with food-package interactions. This article discusses sensory impacts, with emphasis on oxidation reactions, associated with the interaction of food and materials, including taints, scalping, changes in food quality as a function of packaging, and examples of material innovations for smart packaging that can improve sensory quality of foods and beverages. Sensory evaluation is an important tool for improved package selection and development of new materials.

  4. 7 CFR 33.6 - Package.

    Science.gov (United States)

    2010-01-01

    ... the Department of Agriculture AGRICULTURAL MARKETING SERVICE (Standards, Inspections, Marketing... ISSUED UNDER AUTHORITY OF THE EXPORT APPLE ACT Definitions § 33.6 Package. Package means any container of apples. ...

  5. Containers and Packaging: Product-Specific Data

    Science.gov (United States)

    This web page provide numbers on the different containers and packaging products in our municipal solid waste. These include containers of all types, such as glass, steel, plastic, aluminum, wood, and other types of packaging

  6. Integrated Approach to Industrial Packaging Design

    Science.gov (United States)

    Vorobeva, O.

    2017-11-01

    The article reviews studies in the field of industrial packaging design. The major factors which influence technological, ergonomic, economic and ecological features of packaging are established. The main modern trends in packaging design are defined, the principles of marketing communications and their influence on consumers’ consciousness are indicated, and the function of packaging as a transmitter of brand values is specified. Peculiarities of packaging technology and printing techniques in modern printing industry are considered. The role of designers in the stage-by-stage development of the construction, form and graphic design concept of packaging is defined. The examples of authentic packaging are given and the mention of the tetrahedron packaging history is made. At the end of the article, conclusions on the key research aspects are made.

  7. Packaging glass with hierarchically nanostructured surface

    KAUST Repository

    He, Jr-Hau

    2017-08-03

    An optical device includes an active region and packaging glass located on top of the active region. A top surface of the packaging glass includes hierarchical nanostructures comprised of honeycombed nanowalls (HNWs) and nanorod (NR) structures extending from the HNWs.

  8. 27 CFR 6.93 - Combination packaging.

    Science.gov (United States)

    2010-04-01

    ..., DEPARTMENT OF THE TREASURY LIQUORS âTIED-HOUSEâ Exceptions § 6.93 Combination packaging. The act by an industry member of packaging and distributing distilled spirits, wine, or malt beverages in combination...

  9. Multimedia package for LRFD concrete bridge design.

    Science.gov (United States)

    2009-02-01

    This Project developed a Load and Resistance Factor Design (LRFD) multimedia package to provide a practical introduction and an in-depth understanding of the technological advances in the design of concrete bridges. This package can be used to train ...

  10. Packaging glass with hierarchically nanostructured surface

    KAUST Repository

    He, Jr-Hau; Fu, Hui-Chun

    2017-01-01

    An optical device includes an active region and packaging glass located on top of the active region. A top surface of the packaging glass includes hierarchical nanostructures comprised of honeycombed nanowalls (HNWs) and nanorod (NR) structures

  11. Transport packages for nuclear material and waste

    International Nuclear Information System (INIS)

    1997-01-01

    The regulations and responsibilities concerning the transport packages of nuclear materials and waste are given in the guide. The approval procedure, control of manufacturing, commissioning of the packaging and the control of use are specified. (13 refs.)

  12. Joint interval reliability for Markov systems with an application in transmission line reliability

    International Nuclear Information System (INIS)

    Csenki, Attila

    2007-01-01

    We consider Markov reliability models whose finite state space is partitioned into the set of up states U and the set of down states D . Given a collection of k disjoint time intervals I l =[t l ,t l +x l ], l=1,...,k, the joint interval reliability is defined as the probability of the system being in U for all time instances in I 1 union ... union I k . A closed form expression is derived here for the joint interval reliability for this class of models. The result is applied to power transmission lines in a two-state fluctuating environment. We use the Linux versions of the free packages Maxima and Scilab in our implementation for symbolic and numerical work, respectively

  13. Joint interval reliability for Markov systems with an application in transmission line reliability

    Energy Technology Data Exchange (ETDEWEB)

    Csenki, Attila [School of Computing and Mathematics, University of Bradford, Bradford, West Yorkshire, BD7 1DP (United Kingdom)]. E-mail: a.csenki@bradford.ac.uk

    2007-06-15

    We consider Markov reliability models whose finite state space is partitioned into the set of up states {sub U} and the set of down states {sub D}. Given a collection of k disjoint time intervals I{sub l}=[t{sub l},t{sub l}+x{sub l}], l=1,...,k, the joint interval reliability is defined as the probability of the system being in {sub U} for all time instances in I{sub 1} union ... union I{sub k}. A closed form expression is derived here for the joint interval reliability for this class of models. The result is applied to power transmission lines in a two-state fluctuating environment. We use the Linux versions of the free packages Maxima and Scilab in our implementation for symbolic and numerical work, respectively.

  14. JTEC Panel report on electronic manufacturing and packaging in Japan

    Science.gov (United States)

    Kelly, Michael J.; Boulton, William R. (Editor); Kukowski, John; Meieran, Gene; Pecht, Michael; Peeples, John; Tummala, Rao; Dehaemer, Michael J.; Holdridge, Geoff (Editor); Gamota, George

    1995-01-01

    This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies.

  15. The development of a packaging handbook

    International Nuclear Information System (INIS)

    Shappert, L.B.

    1994-01-01

    The Packaging Handbook, dealing with the development of packagings designed to carry radioactive material, is being written for DOE's Transportation and Packaging Safety Division. The primary goal of the Handbook is to provide sufficient technical information and guidance to improve the quality of Safety Analysis Reports on Type B Packagings (SARPs) that are submitted to DOE for certification. This paper provides an update on the status of the Handbook

  16. Intelligent food packaging - research and development

    OpenAIRE

    Renata Dobrucka; Ryszard Cierpiszewski; Andrzej Korzeniowski

    2015-01-01

    Packaging also fosters effective marketing of the food through distribution and sale channels. It is of the utmost importance to optimize the protection of the food, a great quality and appearance - better than typical packaged foods. In recent years, intelligent packaging became very popular. Intelligent packaging is becoming more and more widely used for food products. Application of this type of solution contributes to improvement of the quality consumer life undoubtedly. Intelligent packa...

  17. 40 CFR 262.30 - Packaging.

    Science.gov (United States)

    2010-07-01

    ... 40 Protection of Environment 25 2010-07-01 2010-07-01 false Packaging. 262.30 Section 262.30... APPLICABLE TO GENERATORS OF HAZARDOUS WASTE Pre-Transport Requirements § 262.30 Packaging. Before... the waste in accordance with the applicable Department of Transportation regulations on packaging...

  18. 7 CFR 58.640 - Packaging.

    Science.gov (United States)

    2010-01-01

    ... 7 Agriculture 3 2010-01-01 2010-01-01 false Packaging. 58.640 Section 58.640 Agriculture Regulations of the Department of Agriculture (Continued) AGRICULTURAL MARKETING SERVICE (Standards... Procedures § 58.640 Packaging. The packaging of the semifrozen product shall be done by means which will in...

  19. 9 CFR 354.72 - Packaging.

    Science.gov (United States)

    2010-01-01

    ... 9 Animals and Animal Products 2 2010-01-01 2010-01-01 false Packaging. 354.72 Section 354.72... CERTIFICATION VOLUNTARY INSPECTION OF RABBITS AND EDIBLE PRODUCTS THEREOF Supervision of Marking and Packaging § 354.72 Packaging. No container which bears or may bear any official identification or any abbreviation...

  20. READDATA: a FORTRAN 77 codeword input package

    International Nuclear Information System (INIS)

    Lander, P.A.

    1983-07-01

    A new codeword input package has been produced as a result of the incompatibility between different dialects of FORTRAN, especially when character variables are passed as parameters. This report is for those who wish to use a codeword input package with FORTRAN 77. The package, called ''Readdata'', attempts to combine the best features of its predecessors such as BINPUT and pseudo-BINPUT. (author)

  1. ICT and the paperboard and packaging industry

    Science.gov (United States)

    Peter Ince; Sanna Kallioranta; Richard Vlosky

    2005-01-01

    The purpose of this chapter is to describe the reasons for the development of ICT and e-business systems in the paper and paperboard packaging industry and to discuss future scenarios that may serve to guide forest- sector research in this topical area. The paper and paperboard packaging industry encompasses producers of primary paper and paperboard packaging materials...

  2. 19 CFR 134.53 - Examination packages.

    Science.gov (United States)

    2010-04-01

    ... 19 Customs Duties 1 2010-04-01 2010-04-01 false Examination packages. 134.53 Section 134.53... TREASURY COUNTRY OF ORIGIN MARKING Articles Found Not Legally Marked § 134.53 Examination packages. (a) Site of marking—(1) Customs custody. Articles (or containers) in examination packages may be marked by...

  3. Developments in the active packaging of foods

    NARCIS (Netherlands)

    Vermeiren, L.; Devlieghere, F.; Beest, M. van; Kruijf, N. de; Debevere, J.

    1999-01-01

    Active packaging is one of the innovative food packaging concepts that has been introduced as a response to the continuous changes in current consumer demands and market trends. Major active packaging techniques are concerned with substances that absorb oxygen, ethylene, moisture, carbon dioxide,

  4. 9 CFR 381.144 - Packaging materials.

    Science.gov (United States)

    2010-01-01

    ... to health. All packaging materials must be safe for the intended use within the meaning of section..., from the packaging supplier under whose brand name and firm name the material is marketed to the... distinguishing brand name or code designation appearing on the packaging material shipping container; must...

  5. 7 CFR 905.140 - Gift packages.

    Science.gov (United States)

    2010-01-01

    ... 7 Agriculture 8 2010-01-01 2010-01-01 false Gift packages. 905.140 Section 905.140 Agriculture... TANGELOS GROWN IN FLORIDA Rules and Regulations Non-Regulated Fruit § 905.140 Gift packages. Any handler..., ship any varieties for the following purpose and types of shipment: (a) To any person gift packages...

  6. Packaging of Sin Goods - Commitment or Exploitation?

    DEFF Research Database (Denmark)

    Nafziger, Julia

    to such self-control problems, and possibly exploit them, by offering different package sizes. In a competitive market, either one or three (small, medium and large) packages are offered. In contrast to common intuition, the large, and not the small package is a commitment device. The latter serves to exploit...

  7. 21 CFR 610.61 - Package label.

    Science.gov (United States)

    2010-04-01

    ... 21 Food and Drugs 7 2010-04-01 2010-04-01 false Package label. 610.61 Section 610.61 Food and... GENERAL BIOLOGICAL PRODUCTS STANDARDS Labeling Standards § 610.61 Package label. The following items shall appear on the label affixed to each package containing a product: (a) The proper name of the product; (b...

  8. Best practices and recommendations on policy packaging

    DEFF Research Database (Denmark)

    Fearnley, Nils; Longva, Frode; Ramjerdi, Farideh

    2011-01-01

    . This report gives practical and general advice for each of these stages: 1. Define objectives and targets 2. Create an inventory of measures, identify potential primary measures and detect causal relationships 3. Assess policy package 4. Modify package 5. Package implementation 6. Evaluate effects, introduce...

  9. Hawaii Electric System Reliability

    Energy Technology Data Exchange (ETDEWEB)

    Loose, Verne William [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Silva Monroy, Cesar Augusto [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

    2012-08-01

    This report addresses Hawaii electric system reliability issues; greater emphasis is placed on short-term reliability but resource adequacy is reviewed in reference to electric consumers’ views of reliability “worth” and the reserve capacity required to deliver that value. The report begins with a description of the Hawaii electric system to the extent permitted by publicly available data. Electrical engineering literature in the area of electric reliability is researched and briefly reviewed. North American Electric Reliability Corporation standards and measures for generation and transmission are reviewed and identified as to their appropriateness for various portions of the electric grid and for application in Hawaii. Analysis of frequency data supplied by the State of Hawaii Public Utilities Commission is presented together with comparison and contrast of performance of each of the systems for two years, 2010 and 2011. Literature tracing the development of reliability economics is reviewed and referenced. A method is explained for integrating system cost with outage cost to determine the optimal resource adequacy given customers’ views of the value contributed by reliable electric supply. The report concludes with findings and recommendations for reliability in the State of Hawaii.

  10. Hawaii electric system reliability.

    Energy Technology Data Exchange (ETDEWEB)

    Silva Monroy, Cesar Augusto; Loose, Verne William

    2012-09-01

    This report addresses Hawaii electric system reliability issues; greater emphasis is placed on short-term reliability but resource adequacy is reviewed in reference to electric consumers' views of reliability %E2%80%9Cworth%E2%80%9D and the reserve capacity required to deliver that value. The report begins with a description of the Hawaii electric system to the extent permitted by publicly available data. Electrical engineering literature in the area of electric reliability is researched and briefly reviewed. North American Electric Reliability Corporation standards and measures for generation and transmission are reviewed and identified as to their appropriateness for various portions of the electric grid and for application in Hawaii. Analysis of frequency data supplied by the State of Hawaii Public Utilities Commission is presented together with comparison and contrast of performance of each of the systems for two years, 2010 and 2011. Literature tracing the development of reliability economics is reviewed and referenced. A method is explained for integrating system cost with outage cost to determine the optimal resource adequacy given customers' views of the value contributed by reliable electric supply. The report concludes with findings and recommendations for reliability in the State of Hawaii.

  11. Improving machinery reliability

    CERN Document Server

    Bloch, Heinz P

    1998-01-01

    This totally revised, updated and expanded edition provides proven techniques and procedures that extend machinery life, reduce maintenance costs, and achieve optimum machinery reliability. This essential text clearly describes the reliability improvement and failure avoidance steps practiced by best-of-class process plants in the U.S. and Europe.

  12. LED system reliability

    NARCIS (Netherlands)

    Driel, W.D. van; Yuan, C.A.; Koh, S.; Zhang, G.Q.

    2011-01-01

    This paper presents our effort to predict the system reliability of Solid State Lighting (SSL) applications. A SSL system is composed of a LED engine with micro-electronic driver(s) that supplies power to the optic design. Knowledge of system level reliability is not only a challenging scientific

  13. Integrated system reliability analysis

    DEFF Research Database (Denmark)

    Gintautas, Tomas; Sørensen, John Dalsgaard

    Specific targets: 1) The report shall describe the state of the art of reliability and risk-based assessment of wind turbine components. 2) Development of methodology for reliability and risk-based assessment of the wind turbine at system level. 3) Describe quantitative and qualitative measures...

  14. Reliability of neural encoding

    DEFF Research Database (Denmark)

    Alstrøm, Preben; Beierholm, Ulrik; Nielsen, Carsten Dahl

    2002-01-01

    The reliability with which a neuron is able to create the same firing pattern when presented with the same stimulus is of critical importance to the understanding of neuronal information processing. We show that reliability is closely related to the process of phaselocking. Experimental results f...

  15. Fire testing for package approval

    International Nuclear Information System (INIS)

    Burgess, M.H.; Fry, C.J.

    1990-01-01

    The IAEA Transport Regulations require packaging systems for radioactive material to survive transport accidents without a significant increase in hazard to members of the public. Tests used to demonstrate this include a fire or 'thermal' test which may be a practical demonstration or based on calculations. Work at Winfrith, involving the development of computer models and pool fire techniques, has given an improved understanding of physical processes. This has been used to improve computer models and pool fire techniques. The paper covers the regulatory requirements for fire testing, the basic physics of fires, practical tests, computer modelling and their applications to package design. We have confidence in our ability to predict temperatures and other conditions in accident situations and can illustrate the important features of fires with experimental evidence. (author)

  16. The particle tracking package Kassiopeia

    Energy Technology Data Exchange (ETDEWEB)

    Groh, Stefan [Karlsruhe Institute of Technology (Germany); Collaboration: KATRIN-Collaboration

    2016-07-01

    The Kassiopeia particle tracking framework is an object-oriented software package utilizing modern C++ techniques, written originally to meet the needs of the Katrin collaboration. Kassiopeia's target consists of simulating particle trajectories governed by arbitrarily complex differential equations of motion, continuous physics processes that may in part be modeled as terms perturbing that equation of motion, stochastic processes that occur in flight such as bulk scattering and decay, and potentially stochastic surface processes occurring at interfaces, including transmission and reflection effects. This entire set of computations takes place against the backdrop of a fully-featured geometry package which serves a variety of roles, including initialization of electromagnetic field simulations, gas flow simulations, and the support of state-dependent algorithm-swapping and behavioral changes. Kassiopeia has been well validated and widely used within the Katrin collaboration, playing a primary role in many theses and refereed publications.

  17. Introduction of SCIENCE code package

    International Nuclear Information System (INIS)

    Lu Haoliang; Li Jinggang; Zhu Ya'nan; Bai Ning

    2012-01-01

    The SCIENCE code package is a set of neutronics tools based on 2D assembly calculations and 3D core calculations. It is made up of APOLLO2F, SMART and SQUALE and used to perform the nuclear design and loading pattern analysis for the reactors on operation or under construction of China Guangdong Nuclear Power Group. The purpose of paper is to briefly present the physical and numerical models used in each computation codes of the SCIENCE code pack age, including the description of the general structure of the code package, the coupling relationship of APOLLO2-F transport lattice code and SMART core nodal code, and the SQUALE code used for processing the core maps. (authors)

  18. Magnetic Package data quality overview

    DEFF Research Database (Denmark)

    Qamili, Enkelejda; Ottavianelli, Giuseppe; Olsen, Nils

    The ESA Swarm satellites, launched in November 2013, carry on-board instuments devoted to measure extremely accurate data necessary to improve our understanding of Earth’s magnetic field. The Swarm instrument package is made by two magnetometers (one vector and one scalar), one Electric field...... Instrument (EFI), one Accelerometer and one GPS reciever. This presentation aims at providing an extensive overview of the magnetic instrument status, magnetic data availability and quality....

  19. Transportation and packaging resource guide

    International Nuclear Information System (INIS)

    Arendt, J.W.; Gove, R.M.; Welch, M.J.

    1994-12-01

    The purpose of this resource guide is to provide a convenient reference document of information that may be useful to the U.S. Department of Energy (DOE) and DOE contractor personnel involved in packaging and transportation activities. An attempt has been made to present the terminology of DOE community usage as it currently exists. DOE's mission is changing with emphasis on environmental cleanup. The terminology or nomenclature that has resulted from this expanded mission is included for the packaging and transportation user for reference purposes. Older terms still in use during the transition have been maintained. The Packaging and Transportation Resource Guide consists of four sections: Sect. 1, Introduction; Sect. 2, Abbreviations and Acronyms; Sect. 3, Definitions; and Sect. 4, References for packaging and transportation of hazardous materials and related activities, and Appendices A and B. Information has been collected from DOE Orders and DOE documents; U.S Department of Transportation (DOT), U.S. Environmental Protection Agency (EPA), and U.S. Nuclear Regulatory Commission (NRC) regulations; and International Atomic Energy Agency (IAEA) standards and other international documents. The definitions included in this guide may not always be a regulatory definition but are the more common DOE usage. In addition, the definitions vary among regulatory agencies. It is, therefore, suggested that if a definition is to be used in a regulatory or a legal compliance issue, the definition should be verified with the appropriate regulation. To assist in locating definitions in the regulations, a listing of all definition sections in the regulations are included in Appendix B. In many instances, the appropriate regulatory reference is indicated in the right-hand margin

  20. Transportation and packaging resource guide

    Energy Technology Data Exchange (ETDEWEB)

    Arendt, J.W.; Gove, R.M.; Welch, M.J.

    1994-12-01

    The purpose of this resource guide is to provide a convenient reference document of information that may be useful to the U.S. Department of Energy (DOE) and DOE contractor personnel involved in packaging and transportation activities. An attempt has been made to present the terminology of DOE community usage as it currently exists. DOE`s mission is changing with emphasis on environmental cleanup. The terminology or nomenclature that has resulted from this expanded mission is included for the packaging and transportation user for reference purposes. Older terms still in use during the transition have been maintained. The Packaging and Transportation Resource Guide consists of four sections: Sect. 1, Introduction; Sect. 2, Abbreviations and Acronyms; Sect. 3, Definitions; and Sect. 4, References for packaging and transportation of hazardous materials and related activities, and Appendices A and B. Information has been collected from DOE Orders and DOE documents; U.S Department of Transportation (DOT), U.S. Environmental Protection Agency (EPA), and U.S. Nuclear Regulatory Commission (NRC) regulations; and International Atomic Energy Agency (IAEA) standards and other international documents. The definitions included in this guide may not always be a regulatory definition but are the more common DOE usage. In addition, the definitions vary among regulatory agencies. It is, therefore, suggested that if a definition is to be used in a regulatory or a legal compliance issue, the definition should be verified with the appropriate regulation. To assist in locating definitions in the regulations, a listing of all definition sections in the regulations are included in Appendix B. In many instances, the appropriate regulatory reference is indicated in the right-hand margin.

  1. Food packaging and radiation sterilization

    International Nuclear Information System (INIS)

    Kawamura, Yoko

    1998-01-01

    Radiation sterilization has several merits that it is a positively effective sterilization method, it can be used to sterilize low heat-resistant containers and high gas barrier films, and there is no possibility of residual chemicals being left in the packages. It has been commercially used in 'Bag in a Box' and some food containers. The γ ray and an electron beam are commonly used in radiation sterilization. The γ ray can sterilize large size containers and containers with complex shapes or sealed containers due to its strong transmission capability. However, since the equipment tends to be large and expensive, it is generally used in off production lines. On the other hand, it is possible to install and electron beam system on food production lines since the food can be processed in a short time due to its high beam coefficient and its ease of maintenance, even though an electron beam has limited usage such as sterilizing relatively thin materials and surface sterilization due to the weak transmission. A typical sterilization dose is approximately 10-30 kGy. Direct effects impacting packaging materials, particularly plastics, include scission of polymer links, cross-linkage between polymers, and generating radiolysis products such as hydrogen, methane, aliphatic hydrocarbons, etc. Furthermore, under the existence of oxygen, the oxygen radicals generated by the radiation will oxidize and peroxidize polymer chains and will generate alcohol and carbonyl groups, which shear polymer links, and generate oxygen containing low molecular compounds. As a result, degradation of physical strength such as elongation and seal strength, generating foreign odor, and an increase in global migration values shown in an elution test are sometimes evident. The food packages have different shapes, materials, additives, number of microorganisms and purpose. Therefor the effects of radiation, the optimum dose and so on must be investigated on the individual package. (J.P.N.)

  2. Design reliability engineering

    International Nuclear Information System (INIS)

    Buden, D.; Hunt, R.N.M.

    1989-01-01

    Improved design techniques are needed to achieve high reliability at minimum cost. This is especially true of space systems where lifetimes of many years without maintenance are needed and severe mass limitations exist. Reliability must be designed into these systems from the start. Techniques are now being explored to structure a formal design process that will be more complete and less expensive. The intent is to integrate the best features of design, reliability analysis, and expert systems to design highly reliable systems to meet stressing needs. Taken into account are the large uncertainties that exist in materials, design models, and fabrication techniques. Expert systems are a convenient method to integrate into the design process a complete definition of all elements that should be considered and an opportunity to integrate the design process with reliability, safety, test engineering, maintenance and operator training. 1 fig

  3. Bayesian methods in reliability

    Science.gov (United States)

    Sander, P.; Badoux, R.

    1991-11-01

    The present proceedings from a course on Bayesian methods in reliability encompasses Bayesian statistical methods and their computational implementation, models for analyzing censored data from nonrepairable systems, the traits of repairable systems and growth models, the use of expert judgment, and a review of the problem of forecasting software reliability. Specific issues addressed include the use of Bayesian methods to estimate the leak rate of a gas pipeline, approximate analyses under great prior uncertainty, reliability estimation techniques, and a nonhomogeneous Poisson process. Also addressed are the calibration sets and seed variables of expert judgment systems for risk assessment, experimental illustrations of the use of expert judgment for reliability testing, and analyses of the predictive quality of software-reliability growth models such as the Weibull order statistics.

  4. Generalized waste package containment model

    International Nuclear Information System (INIS)

    Liebetrau, A.M.; Apted, M.J.

    1985-02-01

    The US Department of Energy (DOE) is developing a performance assessment strategy to demonstrate compliance with standards and technical requirements of the Environmental Protection Agency (EPA) and the Nuclear Regulatory Commission (NRC) for the permanent disposal of high-level nuclear wastes in geologic repositories. One aspect of this strategy is the development of a unified performance model of the entire geologic repository system. Details of a generalized waste package containment (WPC) model and its relationship with other components of an overall repository model are presented in this paper. The WPC model provides stochastically determined estimates of the distributions of times-to-failure of the barriers of a waste package by various corrosion mechanisms and degradation processes. The model consists of a series of modules which employ various combinations of stochastic (probabilistic) and mechanistic process models, and which are individually designed to reflect the current state of knowledge. The WPC model is designed not only to take account of various site-specific conditions and processes, but also to deal with a wide range of site, repository, and waste package configurations. 11 refs., 3 figs., 2 tabs

  5. Package and Assisted Travel Arrangement

    Directory of Open Access Journals (Sweden)

    Ivan Tot

    2015-01-01

    Full Text Available In the ordinary legislative procedure before the European Parliament and the Council, there is a proposal of the European Commission for the adoption of a new directive that would bring the regulation of the contract on organized tours into line with current market development of organized trips. The proposal is intended to regulate the various combinations of travel services that are today offered to passengers, particularly online, which are identical or comparable to the travel services provided in a classic pre-arranged package. The subject of the paper are the provisions of the proposal of the directive which govern the field of application of the proposed directive, in particular the proposed changes regarding the concept of "package" contained in the European Commission proposal and amendments of the European Parliament, as well as the analysis of the proposed new concept of "assisted travel arrangements." The paper also critically refers to the method of targeted maximum harmonization as a proposed new intensity of the harmonization. The conclusion is that, despite the welcome updating of an outdated text of the directive on package travel which is line with the current market needs, the proposed text of the new directive is burdened with technical and complex definitions that could lead to significant difficulties in their transposition into the provisions of national law of the Member States.

  6. Solidified package-storage device

    International Nuclear Information System (INIS)

    Takakura, Masahide

    1998-01-01

    Vitrification products such as high level radioactive liquid wastes are contained in a solidification package. A containing tube for vertically containing the solidification packages in multi-stages is disposed such that it passes through a ceiling slab. A shielding plug for preventing leakage of radiation from the solidification packages is fitted to an upper opening thereof. A lid of the containing tube is fitted above the plug. The lid is a carbon steel plate having a thickness of 10cm or more. A heat insulation layer comprising glass wool or rock wool is formed on the lower surface of the ceiling slab. A radiation shielding layer comprising such as an iron plate is formed on the lower surface of the heat insulation layer. Then, deterioration of the ceiling slug by heat can be prevented by the heat insulation layer even if high temperature cooling air flown from the upper opening of a ventilation tube should reach the lower surface of the ceiling slab. (I.N.)

  7. Glass packages in interim storage

    International Nuclear Information System (INIS)

    Jacquet-Francillon, N.

    1994-10-01

    This report summarize the current state of knowledge concerning the behavior of type C waste packages consisting of vitrified high-level solutions produced by reprocessing spent fuel. The composition and the physical and chemical properties of the feed solutions are reviewed, and the vitrification process is described. Sodium alumino-borosilicate glass compositions are generally employed - the glass used at la Hague for LWR fuel solutions, for example, contains 45 % SiO 2 . The major physical, chemical, mechanical and thermal properties of the glass are reviewed. In order to allow their thermal power to diminish, the 3630 glass packages produced (as of January 1993) in the vitrification facilities at Marcoule and La Hague are placed in interim storage for several decades. The actual interim storage period has not been defined, as it is closely related to the concept and organization selected for the final destination of the packages: a geological repository. The glass behavior under irradiation is described. Considerable basic and applied research has been conducted to assess the aqueous leaching behavior of nuclear containment glass. The effects of various repository parameters (temperature, flow rate, nature of the environmental materials) have been investigated. The experimental findings have been used to specify a model describing the kinetics of aqueous corrosion of the glass. More generally all the ''source term'' models developed in France by the CEA or by ANDRA are summarized. (author). 152 refs., 33 figs

  8. Radioactive material package seal tests

    International Nuclear Information System (INIS)

    Madsen, M.M.; Humphreys, D.L.; Edwards, K.R.

    1990-01-01

    General design or test performance requirements for radioactive materials (RAM) packages are specified in Title 10 of the US Code of Federal Regulations Part 71 (US Nuclear Regulatory Commission, 1983). The requirements for Type B packages provide a broad range of environments under which the system must contain the RAM without posing a threat to health or property. Seals that provide the containment system interface between the packaging body and the closure must function in both high- and low-temperature environments under dynamic and static conditions. A seal technology program, jointly funded by the US Department of Energy Office of Environmental Restoration and Waste Management (EM) and the Office of Civilian Radioactive Waste Management (OCRWM), was initiated at Sandia National Laboratories. Experiments were performed in this program to characterize the behavior of several static seal materials at low temperatures. Helium leak tests on face seals were used to compare the materials. Materials tested include butyl, neoprene, ethylene propylene, fluorosilicone, silicone, Eypel, Kalrez, Teflon, fluorocarbon, and Teflon/silicone composites. Because most elastomer O-ring applications are for hydraulic systems, manufacturer low-temperature ratings are based on methods that simulate this use. The seal materials tested in this program with a fixture similar to a RAM cask closure, with the exception of silicone S613-60, are not leak tight (1.0 x 10 -7 std cm 3 /s) at manufacturer low-temperature ratings. 8 refs., 3 figs., 1 tab

  9. Waste Package Design Methodology Report

    Energy Technology Data Exchange (ETDEWEB)

    D.A. Brownson

    2001-09-28

    The objective of this report is to describe the analytical methods and processes used by the Waste Package Design Section to establish the integrity of the various waste package designs, the emplacement pallet, and the drip shield. The scope of this report shall be the methodology used in criticality, risk-informed, shielding, source term, structural, and thermal analyses. The basic features and appropriateness of the methods are illustrated, and the processes are defined whereby input values and assumptions flow through the application of those methods to obtain designs that ensure defense-in-depth as well as satisfy requirements on system performance. Such requirements include those imposed by federal regulation, from both the U.S. Department of Energy (DOE) and U.S. Nuclear Regulatory Commission (NRC), and those imposed by the Yucca Mountain Project to meet repository performance goals. The report is to be used, in part, to describe the waste package design methods and techniques to be used for producing input to the License Application Report.

  10. Waste Package Design Methodology Report

    International Nuclear Information System (INIS)

    D.A. Brownson

    2001-01-01

    The objective of this report is to describe the analytical methods and processes used by the Waste Package Design Section to establish the integrity of the various waste package designs, the emplacement pallet, and the drip shield. The scope of this report shall be the methodology used in criticality, risk-informed, shielding, source term, structural, and thermal analyses. The basic features and appropriateness of the methods are illustrated, and the processes are defined whereby input values and assumptions flow through the application of those methods to obtain designs that ensure defense-in-depth as well as satisfy requirements on system performance. Such requirements include those imposed by federal regulation, from both the U.S. Department of Energy (DOE) and U.S. Nuclear Regulatory Commission (NRC), and those imposed by the Yucca Mountain Project to meet repository performance goals. The report is to be used, in part, to describe the waste package design methods and techniques to be used for producing input to the License Application Report

  11. Hazardous Material Packaging and Transportation

    Energy Technology Data Exchange (ETDEWEB)

    Hypes, Philip A. [Los Alamos National Lab. (LANL), Los Alamos, NM (United States)

    2016-02-04

    This is a student training course. Some course objectives are to: recognize and use standard international and US customary units to describe activities and exposure rates associated with radioactive material; determine whether a quantity of a single radionuclide meets the definition of a class 7 (radioactive) material; determine, for a given single radionuclide, the shipping quantity activity limits per 49 Code of Federal Regulations (CFR) 173.435; determine the appropriate radioactive material hazard class proper shipping name for a given material; determine when a single radionuclide meets the DOT definition of a hazardous substance; determine the appropriate packaging required for a given radioactive material; identify the markings to be placed on a package of radioactive material; determine the label(s) to apply to a given radioactive material package; identify the entry requirements for radioactive material labels; determine the proper placement for radioactive material label(s); identify the shipping paper entry requirements for radioactive material; select the appropriate placards for a given radioactive material shipment or vehicle load; and identify allowable transport limits and unacceptable transport conditions for radioactive material.

  12. Development in Electronic Packaging – Moving to 3D System Configuration

    Directory of Open Access Journals (Sweden)

    I. Szendiuch

    2011-04-01

    Full Text Available The electronic industry is reducing package dimensions of components as well as complete electronics systems. Surface mount device passives and semiconductor chips have to be mounted together bringing a functional system that must realize the required function with necessary reliability and acceptable price. To make up a reliable and cost effective system, the size and weight is being reduced by employing lower voltages and higher speeds. For example, the typical size of SMD passives 30 years ago was 1206 when they were first introduced. Generally, all components including electrical joints are becoming miniaturized and smaller. The industry is moving toward a reduced size of 0201 and 01005 for passives, new fine pitch packages for actives, but the PCB now feature limits for further integration. System on Package (SOP is one way to reach the three-dimensional package concept where components will be placed in three-dimensional configuration. A similar concepts are “Package on Package” (PoP or ”Package in Package” (PiP.

  13. Best Practice in Policy Package Design

    DEFF Research Database (Denmark)

    Kessler, Florian; Vesela, Jirina; Vencl, Vaclav

    2010-01-01

    This deliverable focuses on the identification and analysis of best practice examples of policy package design. For this purpose a methodology is developed that allows the systematic analysis of both national and EU policy packages. Eight packages were selected and analysed, highlighting...... the factors which supported the design and implementation process in each case. The results of the analysis show which factors led to these cases to be considered best practice. In addition, factors are identified which are not yet part of the generic policy packaging framework presented in earlier OPTIC...... Deliverables. The consideration of these factors will help to further improve the framework in the subsequent work packages....

  14. The environmental effects of taxes on packages

    International Nuclear Information System (INIS)

    Schroten, A.; Nelissen, D.; Bergsma, G.C.; Blom, M.J.

    2010-08-01

    The results of an evaluation of the environmental impacts of taxes for packages are presented, differentiated for greenhouse gas emissions. The evaluation used a qualitative analysis of information from eighteen depth-interviews with experts in the packaging market, foreign experiences, relevant price elasticities and 'expert guesses'. It appears that tax package so far had a limited effect on the packaging market. For the longer term (ten years) larger, but probably also limited, effects are expected. The environmental impact of packaging tax can be increased if the taxes are substantially increased. [nl

  15. Perspectives on the Elements of Packaging Design : A Qualitative Study on the Communication of Packaging

    OpenAIRE

    Alervall, Viktoria; Saied, Juan Sdiq

    2013-01-01

    Background: In today’s markets almost all products we buy come packaged. We use packaging to protect, contain and identify products. Furthermore if this is executed in a skillful way consumers often choose products based on packaging. The work of a designer and marketer is therefore extremely valuable when it comes to the design of a package. Problem: How are packages used to communicate marketing information? Purpose: The focus of this thesis is to identify differences and similarities of a ...

  16. Migration and sorption phenomena in packaged foods.

    Science.gov (United States)

    Gnanasekharan, V; Floros, J D

    1997-10-01

    Rapidly developing analytical capabilities and continuously evolving stringent regulations have made food/package interactions a subject of intense research. This article focuses on: (1) the migration of package components such as oligomers and monomers, processing aids, additives, and residual reactants in to packaged foods, and (2) sorption of food components such as flavors, lipids, and moisture into packages. Principles of diffusion and thermodynamics are utilized to describe the mathematics of migration and sorption. Mathematical models are developed from first principles, and their applicability is illustrated using numerical simulations and published data. Simulations indicate that available models are system (polymer-penetrant) specific. Furthermore, some models best describe the early stages of migration/sorption, whereas others should be used for the late stages of these phenomena. Migration- and/or sorption-related problems with respect to glass, metal, paper-based and polymeric packaging materials are discussed, and their importance is illustrated using published examples. The effects of migrating and absorbed components on food safety, quality, and the environment are presented for various foods and packaging materials. The impact of currently popular packaging techniques such as microwavable, ovenable, and retortable packaging on migration and sorption are discussed with examples. Analytical techniques for investigating migration and sorption phenomena in food packaging are critically reviewed, with special emphasis on the use and characteristics of food-simulating liquids (FSLs). Finally, domestic and international regulations concerning migration in packaged foods, and their impact on food packaging is briefly presented.

  17. Antimicrobial packaging with natural compunds - a review

    Directory of Open Access Journals (Sweden)

    Renata Dobrucka

    2016-12-01

    Full Text Available Background:  Packaging problems are an integral part of logistics and the implementation of packaging significantly affects the effectiveness of logistics processes, as a factor which increases the safety and the quality of products being transported. Active packaging is an area of technology needed to meet the requirements of the contemporary consumer. Active packaging creates additional opportunities in systems for packing goods, as well as offering a solution in which the packaging, the product and surroundings interact. Furthermore, active packaging allows packaging to interact with food and the environment and play a dynamic role in food preservation. The main role of antimicrobial packaging is to inhibit the growth of microorganisms that reduce the quality of the packaged product. Methods: The application of natural antimicrobial agents appears to be safe for food products. Also, these compounds have potential applications as a natural preservative in the food packaging industry. This study presents some antibacterial agents, namely chitosan, nisin and pectins. Results and conclusion: Natural substances used in active packaging can eliminate the danger of chemical substances migrating to food.

  18. Overview of the DOE packaging certification process

    Energy Technology Data Exchange (ETDEWEB)

    Liu, Y.Y.; Carlson, R.D. [Argonne National Lab., IL (United States); Carlson, R.W. [Lawrence Livermore National Lab., CA (United States); Kapoor, A. [USDOE, Washington, DC (United States)

    1995-12-31

    This paper gives an overview of the DOE packaging certification process, which is implemented by the Office of Facility Safety Analysis, under the Assistance Secretary for Environment, Safety and Health, for packagings that are not used for weapons and weapons components, nor for naval nuclear propulsion. The overview will emphasize Type B packagings and the Safety Analysis Report for Packaging (SARP) review that parallels the NRC packaging review. Other important elements in the DOE packaging certification program, such as training, methods development, data bases, and technical assistance, are also emphasized, because they have contributed significantly to the improvement of the certification process since DOE consolidated its packaging certification function in 1985. The paper finishes with a discussion of the roles and functions of the DOE Packaging Safety Review Steering Committee, which is chartered to address issues and concerns of interest to the DOE packaging and transportation safety community. Two articles related to DOE packaging certification were published earlier on the SARP review procedures and the DOE Packaging Review Guide. These articles may be consulted for additional information.

  19. Thermal Cycle Reliability and Failure Mechanisms of CCGA and PBGA Assemblies with and without Corner Staking

    Science.gov (United States)

    Ghaffarian, Reza

    2008-01-01

    Area array packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now starting to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic ball grid array (PBGA) and chip scale package assemblies, because of their wide usage for commercial applications, have been extensively reported on in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.However, very limited data is available for thermal cycling behavior of ceramic packages commonly used for the aerospace applications. For high reliability applications, numerous AAPs are available with an identical design pattern both in ceramic and plastic packages. This paper compares assembly reliability of ceramic and plastic packages with the identical inputs/outputs(I/Os) and pattern. The ceramic package was in the form of ceramic column grid array (CCGA) with 560 I/Os peripheral array with the identical pad design as its plastic counterpart.

  20. A computer code package for electron transport Monte Carlo simulation

    International Nuclear Information System (INIS)

    Popescu, Lucretiu M.

    1999-01-01

    A computer code package was developed for solving various electron transport problems by Monte Carlo simulation. It is based on condensed history Monte Carlo algorithm. In order to get reliable results over wide ranges of electron energies and target atomic numbers, specific techniques of electron transport were implemented such as: Moliere multiscatter angular distributions, Blunck-Leisegang multiscatter energy distribution, sampling of electron-electron and Bremsstrahlung individual interactions. Path-length and lateral displacement corrections algorithms and the module for computing collision, radiative and total restricted stopping powers and ranges of electrons are also included. Comparisons of simulation results with experimental measurements are finally presented. (author)

  1. Reliability of construction materials

    International Nuclear Information System (INIS)

    Merz, H.

    1976-01-01

    One can also speak of reliability with respect to materials. While for reliability of components the MTBF (mean time between failures) is regarded as the main criterium, this is replaced with regard to materials by possible failure mechanisms like physical/chemical reaction mechanisms, disturbances of physical or chemical equilibrium, or other interactions or changes of system. The main tasks of the reliability analysis of materials therefore is the prediction of the various failure reasons, the identification of interactions, and the development of nondestructive testing methods. (RW) [de

  2. Structural Reliability Methods

    DEFF Research Database (Denmark)

    Ditlevsen, Ove Dalager; Madsen, H. O.

    The structural reliability methods quantitatively treat the uncertainty of predicting the behaviour and properties of a structure given the uncertain properties of its geometry, materials, and the actions it is supposed to withstand. This book addresses the probabilistic methods for evaluation...... of structural reliability, including the theoretical basis for these methods. Partial safety factor codes under current practice are briefly introduced and discussed. A probabilistic code format for obtaining a formal reliability evaluation system that catches the most essential features of the nature...... of the uncertainties and their interplay is the developed, step-by-step. The concepts presented are illustrated by numerous examples throughout the text....

  3. Reliability and mechanical design

    International Nuclear Information System (INIS)

    Lemaire, Maurice

    1997-01-01

    A lot of results in mechanical design are obtained from a modelisation of physical reality and from a numerical solution which would lead to the evaluation of needs and resources. The goal of the reliability analysis is to evaluate the confidence which it is possible to grant to the chosen design through the calculation of a probability of failure linked to the retained scenario. Two types of analysis are proposed: the sensitivity analysis and the reliability analysis. Approximate methods are applicable to problems related to reliability, availability, maintainability and safety (RAMS)

  4. RTE - 2013 Reliability Report

    International Nuclear Information System (INIS)

    Denis, Anne-Marie

    2014-01-01

    RTE publishes a yearly reliability report based on a standard model to facilitate comparisons and highlight long-term trends. The 2013 report is not only stating the facts of the Significant System Events (ESS), but it moreover underlines the main elements dealing with the reliability of the electrical power system. It highlights the various elements which contribute to present and future reliability and provides an overview of the interaction between the various stakeholders of the Electrical Power System on the scale of the European Interconnected Network. (author)

  5. Package Formats for Preserved Digital Material

    DEFF Research Database (Denmark)

    Zierau, Eld

    2012-01-01

    This paper presents an investigation of the best suitable package formats for long term digital preservation. The choice of a package format for preservation is crucial for future access, thus a thorough analysis of choice is important. The investigation presented here covers setting up requireme......This paper presents an investigation of the best suitable package formats for long term digital preservation. The choice of a package format for preservation is crucial for future access, thus a thorough analysis of choice is important. The investigation presented here covers setting up...... requirements for package formats used for long term preserved digital material, and using these requirements as the basis for analysing a range of package formats. The result of the concrete investigation is that the WARC format is the package format best suited for the listed requirements. Fulfilling...

  6. RF and microwave microelectronics packaging II

    CERN Document Server

    Sturdivant, Rick

    2017-01-01

    Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in underst...

  7. Biobased Packaging - Application in Meat Industry

    Directory of Open Access Journals (Sweden)

    S. Wilfred Ruban

    2009-04-01

    Full Text Available Because of growing problems of waste disposal and because petroleum is a nonrenewable resource with diminishing quantities, renewed interest in packaging research is underway to develop and promote the use of “bio-plastics.” In general, compared to conventional plastics derived from petroleum, bio-based polymers have more diverse stereochemistry and architecture of side chains which enable research scientists a greater number of opportunities to customize the properties of the final packaging material. The primary challenge facing the food (Meat industry in producing bio-plastic packaging, currently, is to match the durability of the packaging with product shelf-life. Notable advances in biopolymer production, consumer demand for more environmentally-friendly packaging, and technologies that allow packaging to do more than just encompass the food are driving new and novel research and developments in the area of packaging for muscle foods. [Vet. World 2009; 2(2.000: 79-82

  8. CGHnormaliter: a bioconductor package for normalization of array CGH data with many CNAs.

    NARCIS (Netherlands)

    van Houte, B.P.P.; Binsl, T.W.; Hettling, H.; Heringa, J.

    2010-01-01

    Summary: CGHnormaliter is a package for normalization of array comparative genomic hybridization (aCGH) data. It uses an iterative procedure that effectively eliminates the influence of imbalanced copy numbers. This leads to a more reliable assessment of copy number alterations (CNAs). CGHnormaliter

  9. Monolithically Integrated Light Feedback Control Circuit for Blue/UV LED Smart Package

    NARCIS (Netherlands)

    Koladouz Esfahani, Z.; Tohidian, M.; van Zeijl, H.W.; Kolahdouz, Mohammadreza; Zhang, G.Q.

    2017-01-01

    Given the performance decay of high-power light-emitting diode (LED) chips over time and package condition changes, having a reliable output light for sensitive applications is a point of concern. In this study, a light feedback control circuit, including blue-selective photodiodes, for

  10. Sensors and packages based on LTCC and thick-film technology for ...

    Indian Academy of Sciences (India)

    Reliable operation in harsh environments such as high temperatures, high pressures, aggressive media and space, poses special requirements for sensors and packages, which usually cannot be met using polymer-based technologies. Ceramic technologies, especially LTCC (Low-Temperature Cofired Ceramic), offer a ...

  11. Approach to reliability assessment

    International Nuclear Information System (INIS)

    Green, A.E.; Bourne, A.J.

    1975-01-01

    Experience has shown that reliability assessments can play an important role in the early design and subsequent operation of technological systems where reliability is at a premium. The approaches to and techniques for such assessments, which have been outlined in the paper, have been successfully applied in variety of applications ranging from individual equipments to large and complex systems. The general approach involves the logical and systematic establishment of the purpose, performance requirements and reliability criteria of systems. This is followed by an appraisal of likely system achievment based on the understanding of different types of variational behavior. A fundamental reliability model emerges from the correlation between the appropriate Q and H functions for performance requirement and achievement. This model may cover the complete spectrum of performance behavior in all the system dimensions

  12. Comparative evaluations of the Monte Carlo-based light propagation simulation packages for optical imaging

    Directory of Open Access Journals (Sweden)

    Lin Wang

    2018-01-01

    Full Text Available Monte Carlo simulation of light propagation in turbid medium has been studied for years. A number of software packages have been developed to handle with such issue. However, it is hard to compare these simulation packages, especially for tissues with complex heterogeneous structures. Here, we first designed a group of mesh datasets generated by Iso2Mesh software, and used them to cross-validate the accuracy and to evaluate the performance of four Monte Carlo-based simulation packages, including Monte Carlo model of steady-state light transport in multi-layered tissues (MCML, tetrahedron-based inhomogeneous Monte Carlo optical simulator (TIMOS, Molecular Optical Simulation Environment (MOSE, and Mesh-based Monte Carlo (MMC. The performance of each package was evaluated based on the designed mesh datasets. The merits and demerits of each package were also discussed. Comparative results showed that the TIMOS package provided the best performance, which proved to be a reliable, efficient, and stable MC simulation package for users.

  13. Qualification of package units; Qualifizierung von Package Units

    Energy Technology Data Exchange (ETDEWEB)

    Brombacher, M.; Walter, U. [Bayer AG, Leverkusen (Germany)

    1999-07-01

    The use of package units in pharmaceutical plants is increasing. If they are involved in the manufacture of pharmaceuticals and have an influence on the quality of the end product, the user is required to validate the processes used. Parallel to the growing demands with respect to the automation of these units, the importance of PCS equipment has increased and with this the necessity for its qualification. Experience to date shows that the manufacturer's awareness of these requirements can be heightened still further. This paper describes approaches for improving the present situation and should be interpreted not as criticism but as providing an opportunity to increase the knowledge base and work together to define solutions which satisfy the guidelines. (orig.) [German] Der Einsatz von Package Units in Pharma-Anlagen erfaehrt zunehmende Verbreitung. Wenn sie an der Herstellung von Arzneimitteln beteiligt sind und auf die Qualitaet des Endprodukts Einfluss nehmen, unterliegen sie der Validierungspflicht, die der Anwender zu gewaehrleisten hat. Entsprechend den wachsenden Anforderungen an die Automatisierung dieser Einheiten ist auch der Stellenwert der PLT-Ausruestung angestiegen und mit ihm die Notwendigkeit von deren Qualifizierung. Die bisherige Praxis zeigt, dass die Sensbilitaet der Hersteller diesen Anforderungen gegenueber noch besser entwickelt werden kann. Der Beitrag zeigt Wege auf, um die derzeitige Situation zu verbessern und sollte nicht als Kritik sondern als Chance aufgefasst werden, den Wissensstand auszugleichen und gemeinsam zu richtliniengerechten Loesungen zu kommen. (orig.)

  14. The rating reliability calculator

    Directory of Open Access Journals (Sweden)

    Solomon David J

    2004-04-01

    Full Text Available Abstract Background Rating scales form an important means of gathering evaluation data. Since important decisions are often based on these evaluations, determining the reliability of rating data can be critical. Most commonly used methods of estimating reliability require a complete set of ratings i.e. every subject being rated must be rated by each judge. Over fifty years ago Ebel described an algorithm for estimating the reliability of ratings based on incomplete data. While his article has been widely cited over the years, software based on the algorithm is not readily available. This paper describes an easy-to-use Web-based utility for estimating the reliability of ratings based on incomplete data using Ebel's algorithm. Methods The program is available public use on our server and the source code is freely available under GNU General Public License. The utility is written in PHP, a common open source imbedded scripting language. The rating data can be entered in a convenient format on the user's personal computer that the program will upload to the server for calculating the reliability and other statistics describing the ratings. Results When the program is run it displays the reliability, number of subject rated, harmonic mean number of judges rating each subject, the mean and standard deviation of the averaged ratings per subject. The program also displays the mean, standard deviation and number of ratings for each subject rated. Additionally the program will estimate the reliability of an average of a number of ratings for each subject via the Spearman-Brown prophecy formula. Conclusion This simple web-based program provides a convenient means of estimating the reliability of rating data without the need to conduct special studies in order to provide complete rating data. I would welcome other researchers revising and enhancing the program.

  15. Structural systems reliability analysis

    International Nuclear Information System (INIS)

    Frangopol, D.

    1975-01-01

    For an exact evaluation of the reliability of a structure it appears necessary to determine the distribution densities of the loads and resistances and to calculate the correlation coefficients between loads and between resistances. These statistical characteristics can be obtained only on the basis of a long activity period. In case that such studies are missing the statistical properties formulated here give upper and lower bounds of the reliability. (orig./HP) [de

  16. Reliability and maintainability

    International Nuclear Information System (INIS)

    1994-01-01

    Several communications in this conference are concerned with nuclear plant reliability and maintainability; their titles are: maintenance optimization of stand-by Diesels of 900 MW nuclear power plants; CLAIRE: an event-based simulation tool for software testing; reliability as one important issue within the periodic safety review of nuclear power plants; design of nuclear building ventilation by the means of functional analysis; operation characteristic analysis for a power industry plant park, as a function of influence parameters

  17. Reliability data book

    International Nuclear Information System (INIS)

    Bento, J.P.; Boerje, S.; Ericsson, G.; Hasler, A.; Lyden, C.O.; Wallin, L.; Poern, K.; Aakerlund, O.

    1985-01-01

    The main objective for the report is to improve failure data for reliability calculations as parts of safety analyses for Swedish nuclear power plants. The work is based primarily on evaluations of failure reports as well as information provided by the operation and maintenance staff of each plant. In the report are presented charts of reliability data for: pumps, valves, control rods/rod drives, electrical components, and instruments. (L.E.)

  18. Multidisciplinary System Reliability Analysis

    Science.gov (United States)

    Mahadevan, Sankaran; Han, Song; Chamis, Christos C. (Technical Monitor)

    2001-01-01

    The objective of this study is to develop a new methodology for estimating the reliability of engineering systems that encompass multiple disciplines. The methodology is formulated in the context of the NESSUS probabilistic structural analysis code, developed under the leadership of NASA Glenn Research Center. The NESSUS code has been successfully applied to the reliability estimation of a variety of structural engineering systems. This study examines whether the features of NESSUS could be used to investigate the reliability of systems in other disciplines such as heat transfer, fluid mechanics, electrical circuits etc., without considerable programming effort specific to each discipline. In this study, the mechanical equivalence between system behavior models in different disciplines are investigated to achieve this objective. A new methodology is presented for the analysis of heat transfer, fluid flow, and electrical circuit problems using the structural analysis routines within NESSUS, by utilizing the equivalence between the computational quantities in different disciplines. This technique is integrated with the fast probability integration and system reliability techniques within the NESSUS code, to successfully compute the system reliability of multidisciplinary systems. Traditional as well as progressive failure analysis methods for system reliability estimation are demonstrated, through a numerical example of a heat exchanger system involving failure modes in structural, heat transfer and fluid flow disciplines.

  19. PORTABLE ACOUSTIC MONITORING PACKAGE (PAMP)

    Energy Technology Data Exchange (ETDEWEB)

    John l. Loth; Gary J. Morris; George M. Palmer; Richard Guiler; Deepak Mehra

    2003-07-01

    The 1st generation acoustic monitoring package was designed to detect and analyze weak acoustic signals inside natural gas transmission lines. Besides a microphone it housed a three-inch diameter aerodynamic acoustic signal amplifier to maximize sensitivity to leak induced {Delta}p type signals. The theory and test results of this aerodynamic signal amplifier was described in the master's degree thesis of our Research Assistant Deepak Mehra who is about to graduate. To house such a large three-inch diameter sensor required the use of a steel 300-psi rated 4 inch weld neck flange, which itself weighed already 29 pounds. The completed 1st generation Acoustic Monitoring Package weighed almost 100 pounds. This was too cumbersome to mount in the field, on an access port at a pipeline shut-off valve. Therefore a 2nd generation and truly Portable Acoustic Monitor was built. It incorporated a fully self-contained {Delta}p type signal sensor, rated for line pressures up to 1000 psi with a base weight of only 6 pounds. This is the Rosemont Inc. Model 3051CD-Range 0, software driven sensor, which is believed to have industries best total performance. Its most sensitive unit was purchased with a {Delta}p range from 0 to 3 inch water. This resulted in the herein described 2nd generation: Portable Acoustic Monitoring Package (PAMP) for pipelines up to 1000 psi. Its 32-pound total weight includes an 18-volt battery. Together with a 3 pound laptop with its 4-channel data acquisition card, completes the equipment needed for field acoustic monitoring of natural gas transmission pipelines.

  20. 49 CFR 178.915 - General Large Packaging standards.

    Science.gov (United States)

    2010-10-01

    ... 49 Transportation 2 2010-10-01 2010-10-01 false General Large Packaging standards. 178.915 Section... PACKAGINGS Large Packagings Standards § 178.915 General Large Packaging standards. (a) Each Large Packaging.... Large Packagings intended for solid hazardous materials must be sift-proof and water-resistant. (b) All...