Copper plasmonics and catalysis: role of electron-phonon interactions in dephasing localized surface plasmons

Science.gov (United States)

Sun, Qi-C.; Ding, Yuchen; Goodman, Samuel M.; H. Funke, Hans; Nagpal, Prashant

2014-10-01

Copper metal can provide an important alternative for the development of efficient, low-cost and low-loss plasmonic nanoparticles, and selective nanocatalysts. However, poor chemical stability and lack of insight into photophysics and plasmon decay mechanisms has impeded study. Here, we use smooth conformal ALD coating on copper nanoparticles to prevent surface oxidation, and study dephasing time for localized surface plasmons on different sized copper nanoparticles. Using dephasing time as a figure of merit, we elucidate the role of electron-electron, electron-phonon, impurity, surface and grain boundary scattering on the decay of localized surface plasmon waves. Using our quantitative analysis and different temperature dependent measurements, we show that electron-phonon interactions dominate over other scattering mechanisms in dephasing plasmon waves. While interband transitions in copper metal contributes substantially to plasmon losses, tuning surface plasmon modes to infrared frequencies leads to a five-fold enhancement in the quality factor. These findings demonstrate that conformal ALD coatings can improve the chemical stability for copper nanoparticles, even at high temperatures (>300 °C) in ambient atmosphere, and nanoscaled copper is a good alternative material for many potential applications in nanophotonics, plasmonics, catalysis and nanoscale electronics.Copper metal can provide an important alternative for the development of efficient, low-cost and low-loss plasmonic nanoparticles, and selective nanocatalysts. However, poor chemical stability and lack of insight into photophysics and plasmon decay mechanisms has impeded study. Here, we use smooth conformal ALD coating on copper nanoparticles to prevent surface oxidation, and study dephasing time for localized surface plasmons on different sized copper nanoparticles. Using dephasing time as a figure of merit, we elucidate the role of electron-electron, electron-phonon, impurity, surface and grain

Surface modification of calcium–copper hydroxyapatites using polyaspartic acid

International Nuclear Information System (INIS)

Othmani, Masseoud; Aissa, Abdallah; Bachoua, Hassen; Debbabi, Mongi

2013-01-01

Highlights: ► The reaction of polyaspartic acid with calcium hydroxyapatite and mixed calcium–copper hydroxyapatite is tested. ► Chemical analysis shows that the presence of copper in the apatitic structure increases the reactivity of the apatite surface. ► X-ray powder analysis shows the conservation of unique crystalline phase of hydroxyapatite after copper incorporation and/or PASP acid reacting. ► IR spectra show the formation of the formation of organometallic bond M-O-C (M=Ca or Cu) on the apatitic surface. ► Transmission electron microscopy (TEM) micrographs and atomic force microscopy (AFM) indicated that the texture surface was changed by the grafting. - Abstract: Mixed calcium–copper hydroxyapatite (Ca–CuHAp), with general formula Ca (10−x) Cu x (PO 4 ) 6 (OH) 2 , where 0 ≤ x ≤ 0.75 was prepared in aqueous medium in the presence of different concentrations of poly-L-aspartic acid (PASP). XRD, IR, TG-DTA, TEM-EDX, AFM and chemical analyses were used to characterize the structure, morphology and composition of the products. All techniques show the formation of new hybrid compounds Ca–CuHAp–PASP. The presence of the grafting moiety on the apatitic material is more significant with increasing of copper amount and/or organic concentration in the starting solution. These increases lead to the affectation of apatite crystallinity. The IR spectroscopy shows the conservation of (P-OH) band of (HPO 4 ) 2− groups, suggesting that PASP acid was interacted only with metallic cations of hydroxyapatite.

Effect of Physical Property and Surface Morphology of Copper Foil at Electrodeposition Parameter

Energy Technology Data Exchange (ETDEWEB)

Woo, Tae Gyu; Park, Il Song; Lee, Man Hyung; Seol, Kyeong Won [Chonbuk National University, Jeonju (Korea, Republic of)

2014-06-15

The effect of additives, current density and plated temperature on the surface morphology and physical property, during copper electrodeposition on polyimide (PI) film was investigated. Two kinds of additives, Cl and leveler (additive B), were used in this study. Electrochemical experiments were performed in conjunction with SEM, XRD and four-point probe to characterize the morphology and mechanical characteristics of copper electrodeposited in the presence of the additives. The surface roughness, crystal growth orientation and resistivity was controlled by the concentration of additive B. High resistivity and lower peel strength were observed on the surface of the copper layer electroplated in the electrolyte without additive B. However, a uniform surface, lower resistivity and high flexibility were obtained with a combination of 20 ppm Cl and 100 ppm additive B. Large particles were observed on the surface of the copper layer electroplated using a current density of 25 mA/cm{sup 2}, but a uniform surface and lower resistivity were obtained using a current density of 10 mA/cm{sup 2}. One of the required important properties of FCCL is flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density, rather than a high current density. Moreover, a reasonable current density is 20 mA/cm{sup 2}, considering the productivity and mechanical properties of copper foil.

Copper surfaces are associated with significantly lower concentrations of bacteria on selected surfaces within a pediatric intensive care unit.

Science.gov (United States)

Schmidt, Michael G; von Dessauer, Bettina; Benavente, Carmen; Benadof, Dona; Cifuentes, Paulina; Elgueta, Alicia; Duran, Claudia; Navarrete, Maria S

2016-02-01

Health care-associated infections result in significant patient morbidity and mortality. Although cleaning can remove pathogens present on hospital surfaces, those surfaces may be inadequately cleaned or recontaminated within minutes. Because of copper's inherent and continuous antimicrobial properties, copper surfaces offer a solution to complement cleaning. The objective of this study was to quantitatively assess the bacterial microbial burden coincident with an assessment of the ability of antimicrobial copper to limit the microbial burden associated with 3 surfaces in a pediatric intensive care unit. A pragmatic trial was conducted enrolling 1,012 patients from 2 high acuity care units within a 249-bed tertiary care pediatric hospital over 12 months. The microbial burden was determined from 3 frequently encountered surfaces, regardless of room occupancy, twice monthly, from 16 rooms, 8 outfitted normally and 8 outfitted with antimicrobial copper. Copper surfaces were found to be equivalently antimicrobial in pediatric settings to activities reported for adult medical intensive care units. The log10 reduction to the microbial burden from antimicrobial copper surfaced bed rails was 1.996 (99%). Surprisingly, introduction of copper objects to 8 study rooms was found to suppress the microbial burden recovered from objects assessed in control rooms by log10 of 1.863 (73%). Copper surfaces warrant serious consideration when contemplating the introduction of no-touch disinfection technologies for reducing burden to limit acquisition of HAIs. Copyright © 2016 Association for Professionals in Infection Control and Epidemiology, Inc. Published by Elsevier Inc. All rights reserved.

Development of highly faceted reduced graphene oxide-coated copper oxide and copper nanoparticles on a copper foil surface

Directory of Open Access Journals (Sweden)

Rebeca Ortega-Amaya

2016-07-01

Full Text Available This work describes the formation of reduced graphene oxide-coated copper oxide and copper nanoparticles (rGO-Cu2ONPs, rGO-CuNPs on the surface of a copper foil supporting graphene oxide (GO at annealing temperatures of 200–1000 °C, under an Ar atmosphere. These hybrid nanostructures were developed from bare copper oxide nanoparticles which grew at an annealing temperature of 80 °C under nitrogen flux. The predominant phase as well as the particle size and shape strongly depend on the process temperature. Characterization with transmission electron microscopy and scanning electron microscopy indicates that Cu or Cu2O nanoparticles take rGO sheets from the rGO network to form core–shell Cu–rGO or Cu2O–rGO nanostructures. It is noted that such ones increase in size from 5 to 800 nm as the annealing temperature increases in the 200–1000 °C range. At 1000 °C, Cu nanoparticles develop a highly faceted morphology, displaying arm-like carbon nanorods that originate from different facets of the copper crystal structure.

Copper in the sediment and sea surface microlayer near a fallowed, open-net fish farm.

Science.gov (United States)

Loucks, Ronald H; Smith, Ruth E; Fisher, Clyde V; Fisher, E Brian

2012-09-01

Sediment and sea surface microlayer samples near an open-net salmon farm in Nova Scotia, were analysed for copper. Copper is a constituent of the feed and is an active ingredient of anti-foulants. The salmon farm was placed in fallow after 15 years of production. Sampling was pursued over 27 months. Elevated copper concentrations in the sediments indicated the farm site as a source. Bubble flotation due to gas-emitting sediments from eutrophication is a likely process for accumulating copper in the sea surface microlayer at enriched concentrations. Elevated and enriched concentrations in the sea surface microlayer over distance from the farm site led, as a result of wind-drift, to an enlarged farm footprint. The levels of copper in both sediments and sea surface microlayer exceeded guidelines for protection of marine life. Over the 27 months period, copper levels persisted in the sediments and decreased gradually in the sea surface microlayer. Copyright © 2012 Elsevier Ltd. All rights reserved.

Surface modification of calcium-copper hydroxyapatites using polyaspartic acid

Energy Technology Data Exchange (ETDEWEB)

Othmani, Masseoud; Aissa, Abdallah; Bachoua, Hassen [Laboratoire de Physico-Chimie des Materiaux, Faculte des Sciences de Monastir, 5019 Monastir (Tunisia); Debbabi, Mongi, E-mail: m.debbabi@yahoo.fr [Laboratoire de Physico-Chimie des Materiaux, Faculte des Sciences de Monastir, 5019 Monastir (Tunisia)

2013-01-01

Highlights: Black-Right-Pointing-Pointer The reaction of polyaspartic acid with calcium hydroxyapatite and mixed calcium-copper hydroxyapatite is tested. Black-Right-Pointing-Pointer Chemical analysis shows that the presence of copper in the apatitic structure increases the reactivity of the apatite surface. Black-Right-Pointing-Pointer X-ray powder analysis shows the conservation of unique crystalline phase of hydroxyapatite after copper incorporation and/or PASP acid reacting. Black-Right-Pointing-Pointer IR spectra show the formation of the formation of organometallic bond M-O-C (M=Ca or Cu) on the apatitic surface. Black-Right-Pointing-Pointer Transmission electron microscopy (TEM) micrographs and atomic force microscopy (AFM) indicated that the texture surface was changed by the grafting. - Abstract: Mixed calcium-copper hydroxyapatite (Ca-CuHAp), with general formula Ca{sub (10-x)}Cu{sub x}(PO{sub 4}){sub 6}(OH){sub 2}, where 0 {<=} x {<=} 0.75 was prepared in aqueous medium in the presence of different concentrations of poly-L-aspartic acid (PASP). XRD, IR, TG-DTA, TEM-EDX, AFM and chemical analyses were used to characterize the structure, morphology and composition of the products. All techniques show the formation of new hybrid compounds Ca-CuHAp-PASP. The presence of the grafting moiety on the apatitic material is more significant with increasing of copper amount and/or organic concentration in the starting solution. These increases lead to the affectation of apatite crystallinity. The IR spectroscopy shows the conservation of (P-OH) band of (HPO{sub 4}){sup 2-} groups, suggesting that PASP acid was interacted only with metallic cations of hydroxyapatite.

Effects of combinative surface modification on the stability and conductivity of the copper particles

International Nuclear Information System (INIS)

Zeng, Yike; Li, Tongtong; Fu, Ming; Jiang, Shenglin; Zhang, Guangzu

2014-01-01

Highlights: • A combinative method is used to improve the performance of the copper powder. • The method integrates passivation, silver-coating, and coupling agent treatment. • The stability of the copper powder has been improved after the modification. • The sheet resistance of the conductive film is reduced to 15 mΩ. -- Abstract: The specific goal of the present study is to evaluate the surface performance of the copper particles and get excellent copper powder by surface modification. This paper proposes a combinative modification method integrating passivation, silver-coated, and coupling agent. As a result, after 600 h at room temperature the copper powder has the stabilization improved and is well combined with organic matters, and the sheet resistance of the film fabricated by the copper conductive filler is reduced to 15 mΩ. The performance of the copper powder has been greatly enhanced by the combinative modification, and the cost of the copper conductive filler is decreased significantly by this method. The results indicate that the combinative surface modification method can be used for practical electronic application

Stability of metallic copper in the near surface environment

International Nuclear Information System (INIS)

Amcoff, Oe.; Holenyi, K.

1992-03-01

The present study was initiated by the National Board for Spent Nuclear Fuel (SKN). It may be regarded as a review of the state of the art of copper stability - copper mobility in a low temperature - near surface environment. In the discussion, we have emphasized geological - geochemical milieus that have a direct bearing on the problem of final storage of spent nuclear fuel in copper canisters. The literature review has concentrated on copper in connection with: a. low-temperature environments, and b. Stability-mobility, with particular emphasis on a chloride-rich, sulphur-rich milieu. The possible influence on the present processes of radiolysis and engineered barriers besides copper is not discussed in this report. In order to faciliate the discussion, a number of examples on copper mineral stabilities and copper solubility etc. are given below, based on thermodynamic calculations. These calculations are simplified to a certain degree and the discussion is based on differences in orders of magnitude rather than on exact figures. The thermodynamic foundation for the calculations is given in an appendix. Conclusions and recommendations are outlined in general terms in a separate report. (59 refs.) (au)

Investigation of surface resistance of copper in classical and anomalous skin-effect region

International Nuclear Information System (INIS)

Kutovoj, V.A.; Egorov, A.M.

2008-01-01

The surface resistance of copper in classical and anomalous skin-effect region has been investigated, and the surface resistance improvement factor equal to the ratio of the surface resistance of copper at room temperature to that of helium temperature, depending on the electromagnetic field frequency, has been determined. The improvement factor has been shown to have inverse power law dependence on frequency. The frequencies at which the improvement factor of copper equals 10 have been determined. It has been found that the quality factor of a resonance high-frequency system made of copper, operating at temperature T ≥ 4.2 K can be increased 10 times or more as against a quality factor of a resonance high-frequency system operating at room temperature

The effect of iron and copper impurities on the wettability of sphalerite (110) surface.

Science.gov (United States)

Simpson, Darren J; Bredow, Thomas; Chandra, Anand P; Cavallaro, Giuseppe P; Gerson, Andrea R

2011-07-15

The effect of impurities in the zinc sulfide mineral sphalerite on surface wettability has been investigated theoretically to shed light on previously reported conflicting results on sphalerite flotation. The effect of iron and copper impurities on the sphalerite (110) surface energy and on the water adsorption energy was calculated with the semi-empirical method modified symmetrically orthogonalized intermediate neglect of differential overlap (MSINDO) using the cyclic cluster model. The effect of impurities or dopants on surface energies is small but significant. The surface energy increases with increasing surface iron concentration while the opposite effect is reported for increasing copper concentration. The effect on adsorption energies is much more pronounced with water clearly preferring to adsorb on an iron site followed by a zinc site, and copper site least favorable. The theoretical results indicate that a sphalerite (110) surface containing iron is more hydrophilic than the undoped zinc sulfide surface. In agreement with the literature, the surface containing copper (either naturally or by activation) is more hydrophobic than the undoped surface. Copyright © 2011 Wiley Periodicals, Inc.

Surface Functionalization of Thin-Film Composite Membranes with Copper Nanoparticles for Antimicrobial Surface Properties

KAUST Repository

Ben-Sasson, Moshe

2014-01-07

Biofouling is a major operational challenge in reverse osmosis (RO) desalination, motivating a search for improved biofouling control strategies. Copper, long known for its antibacterial activity and relatively low cost, is an attractive potential biocidal agent. In this paper, we present a method for loading copper nanoparticles (Cu-NPs) on the surface of a thin-film composite (TFC) polyamide RO membrane. Cu-NPs were synthesized using polyethyleneimine (PEI) as a capping agent, resulting in particles with an average radius of 34 nm and a copper content between 39 and 49 wt.%. The positive charge of the Cu-NPs imparted by the PEI allowed a simple electrostatic functionalization of the negatively charged RO membrane. We confirmed functionalization and irreversible binding of the Cu-NPs to the membrane surface with SEM and XPS after exposing the membrane to bath sonication. We also demonstrated that Cu-NP functionalization can be repeated after the Cu-NPs dissolve from the membrane surface. The Cu-NP functionalization had minimal impact on the intrinsic membrane transport parameters. Surface hydrophilicity and surface roughness were also maintained, and the membrane surface charge became positive after functionalization. The functionalized membrane exhibited significant antibacterial activity, leading to an 80-95% reduction in the number of attached live bacteria for three different model bacterial strains. Challenges associated with this functionalization method and its implementation in RO desalination are discussed. © 2013 American Chemical Society.

Surface Functionalization of Thin-Film Composite Membranes with Copper Nanoparticles for Antimicrobial Surface Properties

KAUST Repository

Ben-Sasson, Moshe; Zodrow, Katherine R.; Genggeng, Qi; Kang, Yan; Giannelis, Emmanuel P.; Elimelech, Menachem

2014-01-01

Biofouling is a major operational challenge in reverse osmosis (RO) desalination, motivating a search for improved biofouling control strategies. Copper, long known for its antibacterial activity and relatively low cost, is an attractive potential biocidal agent. In this paper, we present a method for loading copper nanoparticles (Cu-NPs) on the surface of a thin-film composite (TFC) polyamide RO membrane. Cu-NPs were synthesized using polyethyleneimine (PEI) as a capping agent, resulting in particles with an average radius of 34 nm and a copper content between 39 and 49 wt.%. The positive charge of the Cu-NPs imparted by the PEI allowed a simple electrostatic functionalization of the negatively charged RO membrane. We confirmed functionalization and irreversible binding of the Cu-NPs to the membrane surface with SEM and XPS after exposing the membrane to bath sonication. We also demonstrated that Cu-NP functionalization can be repeated after the Cu-NPs dissolve from the membrane surface. The Cu-NP functionalization had minimal impact on the intrinsic membrane transport parameters. Surface hydrophilicity and surface roughness were also maintained, and the membrane surface charge became positive after functionalization. The functionalized membrane exhibited significant antibacterial activity, leading to an 80-95% reduction in the number of attached live bacteria for three different model bacterial strains. Challenges associated with this functionalization method and its implementation in RO desalination are discussed. © 2013 American Chemical Society.

The importance of surface morphology in controlling the selectivity of polycrystalline copper for CO(2) electroreduction

DEFF Research Database (Denmark)

Tang, Wei; Peterson, Andrew A; Varela Gasque, Ana Sofia

2012-01-01

This communication examines the effect of the surface morphology of polycrystalline copper on electroreduction of CO(2). We find that a copper nanoparticle covered electrode shows better selectivity towards hydrocarbons compared with the two other studied surfaces, an electropolished copper elect...

Study of fine films nature on the surface of copper band by photoelectron spectroscopy method

International Nuclear Information System (INIS)

Reznichenko, K.N.; Fedorov, V.N.; Shevakin, Yu.F.

1983-01-01

The composition of surface films formed on the copper band of industrial production under atmospheric conditions, its changes in thickness and determination of chemical state of the above films are studied. It has been found by the methods of X-ray photoelectronic and Auger-spectroscopy that defect formations on the surface of the copper band of industrial production represent copper oxides in the form of fine films, their change in colour from blue to dark blue probably is determined by different thickness of these defects. The said films on copper have practically identical chemical composition characterized by the presence of unequally valent copper, oxygen in various states (adsorbed and in the form of oxides), carbon and iron. By means of chemical shifts of the line Cu 2psub(3/2) and Ol s the presence in the external part of the film of CuO copper oxide is established and nearer to the interface surface film-metal-of Cu 2 O cuprous oxide which indicates a two-layer surface film structure. The presence of adsorbed carbon and iron in the film composition is a result of surface contamination

X-ray in-situ study of copper electrodeposition on UHV prepared GaAs(001) surfaces

Energy Technology Data Exchange (ETDEWEB)

Gruender, Yvonne

2008-06-02

For this work a unique setup for in-situ electrochemical studies was employed and improved. This setup permits UHV preparation of the GaAs(001) surface with a defined surface termination (arsenic-rich or gallium-rich) and its characterization by SXRD in UHV, under ambient pressure in inert gas and in electrolyte under potential control without passing through air. The GaAs(001) surfaces were capped by amorphous arsenic. This permitted to ship them through ambient air. Afterwards smooth well defined GaAs(001) surfaces could be recovered by thermal annealing in UHV. A first investigation of the arsenic capped sample was done by atomic force microscopy (AFM) and Surface X-Ray Diffraction (SXRD). The non bulk like termination of the arsenic buried GaAs(001) surface was revealed. For the electrochemical metal deposition, arsenic terminated (2 x 4) reconstructed and gallium terminated (4 x 2) reconstructed GaAs(001) surfaces were employed. These surfaces were characterized by STM, LEED and a first time by SXRD. The surfaces are smooth, however, a higher degree of disorder than for MBE prepared reconstructed GaAs(001) is found. After exposure of the sample to nitrogen, the surfaces were then again studied by SXRD. These two steps characterizing the bare GaAs(001) surfaces permitted us to get a better knowledge of the starting surface and its influence on the later electrodeposited copper. At ambient pressure both reconstructions are lifted, but the surface is not bulk-like terminated as can be deduced from the crystal truncation rods. Epitaxial copper clusters grow upon electrodeposition on the UHV prepared GaAs(001) surface. The copper lattice is rotated and inclined with respect to the GaAs substrate lattice, leading to eight symmetry equivalent domains. The influence of the surface termination as well as the nucleation potential on the structure of the electrodeposited copper were investigated. The tilt and rotation angles do not depend on the deposition potential but

Auger electron spectroscopy study of surface segregation in the binary alloys copper-1 atomic percent indium, copper-2 atomic percent tin, and iron-6.55 atomic percent silicon

Science.gov (United States)

Ferrante, J.

1973-01-01

Auger electron spectroscopy was used to examine surface segregation in the binary alloys copper-1 at. % indium, copper-2 at. % tin and iron-6.55 at. % silicon. The copper-tin and copper-indium alloys were single crystals oriented with the /111/ direction normal to the surface. An iron-6.5 at. % silicon alloy was studied (a single crystal oriented in the /100/ direction for study of a (100) surface). It was found that surface segregation occurred following sputtering in all cases. Only the iron-silicon single crystal alloy exhibited equilibrium segregation (i.e., reversibility of surface concentration with temperature) for which at present we have no explanation. McLean's analysis for equilibrium segregation at grain boundaries did not apply to the present results, despite the successful application to dilute copper-aluminum alloys. The relation of solute atomic size and solubility to surface segregation is discussed. Estimates of the depth of segregation in the copper-tin alloy indicate that it is of the order of a monolayer surface film.

Antimicrobial copper alloys decreased bacteria on stethoscope surfaces.

Science.gov (United States)

Schmidt, Michael G; Tuuri, Rachel E; Dharsee, Arif; Attaway, Hubert H; Fairey, Sarah E; Borg, Keith T; Salgado, Cassandra D; Hirsch, Bruce E

2017-06-01

Stethoscopes may serve as vehicles for transmission of bacteria among patients. The aim of this study was to assess the efficacy of antimicrobial copper surfaces to reduce the bacterial concentration associated with stethoscope surfaces. A structured prospective trial involving 21 health care providers was conducted at a pediatric emergency division (ED) (n = 14) and an adult medical intensive care unit located in tertiary care facilities (n = 7). Four surfaces common to a stethoscope and a facsimile instrument fabricated from U.S. Environmental Protection Agency-registered antimicrobial copper alloys (AMCus) were assessed for total aerobic colony counts (ACCs), methicillin-resistant Staphylococcus aureus, gram-negative bacteria, and vancomycin-resistant enterococci for 90 days. The mean ACCs collectively recovered from all stethoscope surfaces fabricated from the AMCus were found to carry significantly lower concentrations of bacteria (pediatric ED, 11.7 vs 127.1 colony forming units [CFU]/cm 2 , P stethoscopes was the most heavily burdened surface; mean concentrations exceeded the health care-associated infection acquisition concentration (5 CFU/cm 2 ) by at least 25×, supporting that the stethoscope warrants consideration in plans mitigating microbial cross-transmission during patient care. Stethoscope surfaces fabricated with AMCus were consistently found to harbor fewer bacteria. Copyright © 2017 Association for Professionals in Infection Control and Epidemiology, Inc. Published by Elsevier Inc. All rights reserved.

Surface modification of an epoxy resin with polyamines and polydopamine: Adhesion toward electroless deposited copper

Energy Technology Data Exchange (ETDEWEB)

Schaubroeck, David, E-mail: David.Schaubroeck@elis.ugent.be [Center for Microsystems Technology (CMST), IMEC and Ghent University, Technologiepark 914A, B-9052 Ghent (Belgium); Mader, Lothar [Center for Microsystems Technology (CMST), IMEC and Ghent University, Technologiepark 914A, B-9052 Ghent (Belgium); Dubruel, Peter [Polymer Chemistry and Biomaterials Research Group, Ghent University, Krijgslaan 281 S4 bis, B-9000 Ghent (Belgium); Vanfleteren, Jan [Center for Microsystems Technology (CMST), IMEC and Ghent University, Technologiepark 914A, B-9052 Ghent (Belgium)

2015-10-30

Highlights: • Surface modifications of epoxy resins with polydopamine and grafted polyamines can significantly increase the adhesion toward electroless deposited copper. • A clear characterization of the copper/epoxy interphase is provided by SEM analyses of cross sections. • Tailored conditions such as etching time (roughness) and electroless deposition temperature are needed to increase the adhesion of the modified surfaces. - Abstract: In this paper the influence of the epoxy roughness, surface modifications and ELD (electroless copper deposition) temperatures on the adhesive strength of the copper is studied. Good adhesion at low roughness values is targeted due to their applicability in high density electronic circuits. Roughened epoxy surfaces are modified with adsorbed polyamines, polydopamine and polyamines grafted to polydopamine. Next the, adhesive strength of ELD copper is determined with peel strength measurements and the interphases are examined with SEM (scanning electron microscopy). Polydopamine and polyamines grafted to polydopamine can lead to increased adhesive strength at lower roughness values compared to the non-modified samples at specific plating temperatures.

Voltage breakdown on niobium and copper surfaces

International Nuclear Information System (INIS)

Werner, G.R.; Padamsee, H.; Betzwieser, J.C.; Liu, Y.G.; Rubin, K.H.R.; Shipman, J.E.; Ying, L.T.

2003-01-01

Experiments have shown that voltage breakdown in superconducting niobium RF cavities is in many ways similar to voltage breakdown on niobium cathodes in DC voltage gaps; most striking are the distinctive starburst patterns and craters that mark the site of voltage breakdown in both superconducting cavities and DC vacuum gaps. Therefore, we can learn much about RF breakdown from simpler, faster DC experiments. We have direct evidence, in the form of before'' and ''after'' pictures, that breakdown events caused by high surface electric fields occur with high probability at contaminant particles on surfaces. Although the pre-breakdown behavior (field emission) seems to depend mostly on the contaminant particles present and little on the substrate, the breakdown event itself is greatly affected by the substrate-niobium, heavily oxidized niobium, electropolished copper, and diamond-machined copper cathodes lead to different kinds of breakdown events. By studying DC voltage breakdown we hope to learn more details about the processes involved in the transition from field emission to catastrophic arcing and the cratering of the surface; as well as learning how to prevent breakdown, we would like to learn how to cause breakdown, which could be important when ''processing'' cavities to reduce field emission. (author)

Mechanisms and energetics of surface reactions at the copper-water interface. A critical literature review with implications for the debate on corrosion of copper in anoxic water

Energy Technology Data Exchange (ETDEWEB)

Johansson, Adam Johannes; Brinck, Tore [Applied Physical Chemistry, KTH Royal Inst. of Technology, Stockholm (Sweden)

2012-06-15

In order to make a critical analysis of the discussion of corrosion of copper in pure anoxic water it is necessary to understand the chemical reactivity at the copper-water interface. Even though the most fundamental issue, i.e. the nature and existence of a hypothetical product that is thermodynamically stable, is still under debate, it is clear that if anoxic corrosion really exists, it must be initiated through oxidative surface reactions at the copper-water interface. This report presents a survey of the peer reviewed literature on the reactivity of copper surfaces in water. Reactions discussed involve molecular adsorption of water, dissociation of the OH-bonds in adsorbed water molecules and hydroxyl groups, the disproportionation/synproportionation equilibrium between hydroxyl groups/hydroxide ions, water molecules and atomic oxygen, the surface diffusion of adsorbed species, and the formation of hydrogen gas (molecular hydrogen). Experimental, as well as theoretical (quantum chemical) studies are reviewed. It is concluded that a limited amount of hydrogen gas (H{sub 2}) should be formed as the result of dissociative water adsorption at certain copper surfaces. Quantitative estimates of the amounts of H2 that could form at the copper-water interface are made. Assuming that the water-cleavage/hydrogen-formation reaction proceeds on an ideal [110] or [100] surface until a hydroxyl monolayer (ML) is reached, the amount of H{sub 2} formed is {approx} 2.4 ng cm{sup -2} copper surface. Based on the literature cited, this is most likely possible, thermodynamically as well as kinetically. Although not proven, it is not unlikely that the reaction can proceed until an oxide ML is formed, which would give 4.8 ng cm{sup -2}. If the formation of an oxide ML is thermodynamically feasible the surface will probably react further, since Cu{sub 2}O(s) is known to activate and cleave the water molecule when it adsorbs at the Cu{sub 2}O(s) surface. Assuming the formation of a

Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates

International Nuclear Information System (INIS)

Xiang, Jing; Wang, Chong; Chen, Yuanming; Wang, Shouxu; Hong, Yan; Zhang, Huaiwu; Gong, Lijun; He, Wei

2017-01-01

Highlights: • Air atmosphere plasmacould generatehydrophilic groups of photo-resistive film. • Better wettability of photo-resistive filmled tohigher plating uniformity of copper pillars. • New flow isreduced cost, simplified process and elevated productivity. - Abstract: The wettability of the photo-resistive film (PF) surfaces undergoing different pretreatments including the O_2−CF_4 low-pressure plasma (OCLP) and air plasma (AP), is investigated by water contact angle measurement instrument (WCAMI) before the bottom-up copper pillar plating. Chemical groups analysis performed by attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR) and X-ray photoelectron spectra (XPS) shows that after the OCLP and wash treatment, the wettability of PF surface is attenuated, because embedded fluorine and decreased oxygen content both enhance hydrophobicity. Compared with OCLP treatment, the PF surface treatment by non-toxic air plasma displays features of C−O, O−C=O, C=O and −NO_2 by AIR-FTIR and XPS, and a promoted wettability by WCAM. Under the identical electroplating condition, the surface with a better wettability allows electrolyte to spontaneously soak all the places of vias, resulting in improved copper pillar uniformity. Statistical analysis of metallographic data shows that more coplanar and flat copper pillars are achieved with the PF treatment of air plasma. Such modified copper-pillar-plating technology meets the requirement of accurate impedance, the high density interconnection for IC substrates.

Step driven competitive epitaxial and self-limited growth of graphene on copper surface

Directory of Open Access Journals (Sweden)

Lili Fan

2011-09-01

Full Text Available The existence of surface steps was found to have significant function and influence on the growth of graphene on copper via chemical vapor deposition. The two typical growth modes involved were found to be influenced by the step morphologies on copper surface, which led to our proposed step driven competitive growth mechanism. We also discovered a protective role of graphene in preserving steps on copper surface. Our results showed that wide and high steps promoted epitaxial growth and yielded multilayer graphene domains with regular shape, while dense and low steps favored self-limited growth and led to large-area monolayer graphene films. We have demonstrated that controllable growth of graphene domains of specific shape and large-area continuous graphene films are feasible.

Field dependent surface resistance of niobium on copper cavities

Directory of Open Access Journals (Sweden)

T. Junginger

2015-07-01

Full Text Available The surface resistance R_{S} of superconducting cavities prepared by sputter coating a niobium film on a copper substrate increases significantly stronger with the applied rf field compared to cavities of bulk material. A possible cause is that the thermal boundary resistance between the copper substrate and the niobium film induces heating of the inner cavity wall, resulting in a higher R_{S}. Introducing helium gas in the cavity, and measuring its pressure as a function of applied field allowed to conclude that the inner surface of the cavity is heated up by less than 120 mK when R_{S} increases with E_{acc} by 100  nΩ. This is more than one order of magnitude less than what one would expect from global heating. Additionally, the effects of cooldown speed and low temperature baking have been investigated in the framework of these experiments. It is shown that for the current state of the art niobium on copper cavities there is only a detrimental effect of low temperature baking. A fast cooldown results in a lowered R_{S}.

Comparative study on the copper activation and xanthate adsorption on sphalerite and marmatite surfaces

Science.gov (United States)

Liu, Jian; Wang, Yu; Luo, Deqiang; Chen, Luzheng; Deng, Jiushuai

2018-05-01

The copper activation and potassium butyl xanthate (PBX) adsorption on sphalerite and marmatite surfaces were comparatively investigated using in situ local electrochemical impedance spectroscopy (LEIS), time-of-flight secondary ion mass spectrometry (ToF-SIMS) and surface adsorption tests. Comparing the LEIS and surface adsorption results, it was found that the activation time is a key factor influencing the copper activation and PBX adsorption on marmatite surface, but it has a negligible influence on sphalerite. For a short activation time within 10 min, the Fe impurity in marmatite shows an adverse influence on the speed of Cu adsorption and ion exchange as well as on the subsequent PBX adsorption. For a long activation time of 30 min, the LEIS, ToF-SIMS and surface adsorption results suggested that the Fe impurity in marmatite enhances the copper adsorption, whereas such enhanced copper adsorption of marmatite cannot result in corresponding enhancing of PBX adsorption. DFT result showed that the Fe impurity in marmatite has harmful influence on the PBX interaction with the Cu-activated surface by increasing the interaction energy. ToF-SIMS result further indicated that the Cu distribution in the outermost surface of marmatite is less than that of the sphalerite, which also results in the less PBX adsorption for the marmatite.

Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates

Science.gov (United States)

Xiang, Jing; Wang, Chong; Chen, Yuanming; Wang, Shouxu; Hong, Yan; Zhang, Huaiwu; Gong, Lijun; He, Wei

2017-07-01

The wettability of the photo-resistive film (PF) surfaces undergoing different pretreatments including the O2sbnd CF4 low-pressure plasma (OCLP) and air plasma (AP), is investigated by water contact angle measurement instrument (WCAMI) before the bottom-up copper pillar plating. Chemical groups analysis performed by attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR) and X-ray photoelectron spectra (XPS) shows that after the OCLP and wash treatment, the wettability of PF surface is attenuated, because embedded fluorine and decreased oxygen content both enhance hydrophobicity. Compared with OCLP treatment, the PF surface treatment by non-toxic air plasma displays features of Csbnd O, Osbnd Cdbnd O, Cdbnd O and sbnd NO2 by AIR-FTIR and XPS, and a promoted wettability by WCAM. Under the identical electroplating condition, the surface with a better wettability allows electrolyte to spontaneously soak all the places of vias, resulting in improved copper pillar uniformity. Statistical analysis of metallographic data shows that more coplanar and flat copper pillars are achieved with the PF treatment of air plasma. Such modified copper-pillar-plating technology meets the requirement of accurate impedance, the high density interconnection for IC substrates.

Fabrication of a wettability-gradient surface on copper by screen-printing techniques

International Nuclear Information System (INIS)

Huang, Ding-Jun; Leu, Tzong-Shyng

2015-01-01

In this study, a screen-printing technique is utilized to fabricate a wettability-gradient surface on a copper substrate. The pattern definitions on the copper surface were freely fabricated to define the regions with different wettabilities, for which the printing definition technique was developed as an alternative to the existing costly photolithography techniques. This fabrication process using screen printing in tandem with chemical modification methods can easily realize an excellent wettability-gradient surface with superhydrophobicity and superhydrophilicity. Surface analyses were performed to characterize conditions in some fabrication steps. A water droplet movement sequence is provided to clearly demonstrate the droplet-driving effectiveness of the fabricated gradient surface. The droplet-driving efficiency offers a promising solution for condensation heat transfer applications in the foreseeable future. (paper)

Protection of copper surface with phytic acid against corrosion in chloride solution.

Science.gov (United States)

Peca, Dunja; Pihlar, Boris; Ingrid, Milošev

2014-01-01

Phytic acid (inositol hexaphosphate) was tested as a corrosion inhibitor for copper in 3% sodium chloride. Phytic acid is a natural compound derived from plants, it is not toxic and can be considered as a green inhibitor. Electrochemical methods of linear polarization and potentiodynamic polarization were used to study the electrochemical behaviour and evaluate the inhibition effectiveness. To obtain the optimal corrosion protection the following experimental conditions were investigated: effect of surface pre-treatment (abrasion and three procedures of surface roughening), pre-formation of the layer of phytic acid, time of immersion and concentration of phytic acid. To evaluate the surface pre-treatment procedures the surface roughness and contact angle were measured. Optimal conditions for formation of phytic layer were selected resulting in the inhibition effectiveness of nearly 80%. Morphology and composition of the layer were further studied by scanning electron microscopy, energy dispersive X-ray spectroscopy and X-ray photoelectron spectroscopy. The layer of phytic acid with thickness in the nanometer range homogeneously covers the copper surface. The obtained results show that this natural compound can be used as a mildly effective corrosion inhibitor for copper in chloride solution.

Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates

Energy Technology Data Exchange (ETDEWEB)

Xiang, Jing; Wang, Chong; Chen, Yuanming; Wang, Shouxu; Hong, Yan; Zhang, Huaiwu [State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054 (China); Gong, Lijun [Research and Development Department, Guangzhou Fastprint Circuit Tech Co., Ltd., Guangzhou 510663 (China); He, Wei, E-mail: heweiz@uestc.edu.cn [State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054 (China); Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd., Shantou 515000 (China)

2017-07-31

Highlights: • Air atmosphere plasmacould generatehydrophilic groups of photo-resistive film. • Better wettability of photo-resistive filmled tohigher plating uniformity of copper pillars. • New flow isreduced cost, simplified process and elevated productivity. - Abstract: The wettability of the photo-resistive film (PF) surfaces undergoing different pretreatments including the O{sub 2}−CF{sub 4} low-pressure plasma (OCLP) and air plasma (AP), is investigated by water contact angle measurement instrument (WCAMI) before the bottom-up copper pillar plating. Chemical groups analysis performed by attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR) and X-ray photoelectron spectra (XPS) shows that after the OCLP and wash treatment, the wettability of PF surface is attenuated, because embedded fluorine and decreased oxygen content both enhance hydrophobicity. Compared with OCLP treatment, the PF surface treatment by non-toxic air plasma displays features of C−O, O−C=O, C=O and −NO{sub 2} by AIR-FTIR and XPS, and a promoted wettability by WCAM. Under the identical electroplating condition, the surface with a better wettability allows electrolyte to spontaneously soak all the places of vias, resulting in improved copper pillar uniformity. Statistical analysis of metallographic data shows that more coplanar and flat copper pillars are achieved with the PF treatment of air plasma. Such modified copper-pillar-plating technology meets the requirement of accurate impedance, the high density interconnection for IC substrates.

Durable and Washable Antibacterial Copper Nanoparticles Bridged by Surface Grafting Polymer Brushes on Cotton and Polymeric Materials

Directory of Open Access Journals (Sweden)

Chufeng Sun

2018-01-01

Full Text Available To increase the durability of antibacterial coating on cotton and polymeric substrates, surface initiated grafting polymer brushes are introduced onto the substrates surface to bridge copper nanoparticles coatings and substrate. The morphologies of the composites consisting of the copper nanoparticles and polymer brushes were characterized with scanning electron microscopy (SEM. It was found that copper nanoparticles were uniformly and firmly distributed on the surfaces of the substrates by the polymer brushes; meanwhile, the reinforced concrete-like structures were formed in the composite materials. The substrates coated by the copper nanoparticles showed the efficient antibacterial activity against Staphylococcus aureus (S. aureus and Escherichia coli (E. coli even after washing by 30 cycles. The copper nanoparticles were tethered on the substrates by the strong chemical bonds, which led to the excellent washable fitness and durability. The change of the phase structure of the copper was analyzed to investigate the release mechanism of copper ions.

Quantum chemical molecular dynamical investigation of alkyl nitrite photo-dissociated on copper surfaces

International Nuclear Information System (INIS)

Wang Xiaojing; Wang Wei; Han Peilin; Kubo, Momoji; Miyamoto, Akira

2008-01-01

An accelerated quantum chemical molecular dynamical code 'Colors-Excite' was used to investigate the photolysis of alkyl nitrites series, RONO (R=CH 3 and C(CH 3 ) 3 ) on copper surfaces. Our calculations showed that the photo-dissociated processes are associated with the alkyl substituents of RONO when adsorbed on copper surfaces. For R=CH 3 , a two-step photolysis reaction occurred, yielding diverse intermediate products including RO radical, NO, and HNO, consistent with those reported in gas phase. While for R=C(CH 3 ) 3 , only one-step photolysis reaction occurred and gave intermediate products of RO radical and NO. Consequently, pure RO species were achieved to adsorb on metal surfaces by removing the NO species in photolysis reaction. The detailed photo-dissociated behaviors of RONO on copper surfaces with different alkyl substituents which are uncovered by the present simulation can be extended to explain the diverse dissociative mechanism experimentally observed. The quantum chemical molecular dynamical code 'Colors-Excite' is proved to be highly applicable to the photo-dissociations on metal surfaces

Surface and near surface defect detection in thick copper EB-welds using eddy current testing

International Nuclear Information System (INIS)

Pitkaenen, J.; Lipponen, A.

2010-01-01

The surface inspection of thick copper electron beam (EB) welds plays an important role in the acceptance of nuclear fuel disposal. The main reasons to inspect these components are related to potential manufacturing and handling defects. In this work the data acquisition software, visualising tools for eddy current (EC) measurements and eddy current sensors were developed for detection of unwanted defects. The eddy current equipment was manufactured by IZFP and the visualising software in active co-operation with Posiva and IZFP for the inspections. The inspection procedure was produced during the development of the inspection techniques. The inspection method development aims to qualify the method for surface and near surface defect detection and sizing according to ENIQ. The study includes technical justification to be carried out, and compilation of a defect catalogue and experience from measurements within the Posiva's research on issues related to manufacturing. The depth of penetration in copper components in eddy current testing is rather small. To detect surface breaking defects the eddy current inspection is a good solution. A simple approach was adopted using two techniques: higher frequency was used to detect surface defects and to determine the dimensions of the defects except depth, lower frequency was used to detect defects having a ligament and for sizing of deeper surface breaking defects. The higher frequency was 30 kHz and the lower frequency was 200 Hz. The higher frequency probes were absolute bobbing coils and lower frequency probes combined transmitter - several receiver coils. To evaluate both methods, calibration blocks were manufactured by FNS for weld inspections. These calibration specimens mainly consisted of electron discharge machined notches and holes of varying shapes, lengths and diameters in the range of 1 mm to 20 mm of depth. Also one copper lid specimen with 152 defects was manufactured and used for evaluation of weld inspection

Studies on the influence of surface pre-treatments on electroless copper coating of boron carbide particles

International Nuclear Information System (INIS)

Deepa, J.P.; Resmi, V.G.; Rajan, T.P.D.; Pavithran, C.; Pai, B.C.

2011-01-01

Boron carbide is one of the hard ceramic particles which find application as structural materials and neutron shielding material due to its high neutron capture cross section. Copper coating on boron carbide particle is essential for the synthesis of metal-ceramic composites with enhanced sinterability and dispersibility. Surface characteristics of the substrate and the coating parameters play a foremost role in the formation of effective electroless coating. The effect of surface pre-treatment conditions and pH on electroless copper coating of boron carbide particles has been studied. Surface pre-treatement of B 4 C when compared to acid treated and alkali treated particles were carried out. Uniform copper coating was observed at pH 12 in alkali treated particles when compared to others due to the effective removal of inevitable impurities during the production and processing of commercially available B 4 C. A threshold pH 11 was required for initiation of copper coating on boron carbide particles. The growth pattern of the copper coating also varies depending on the surface conditions from acicular to spherical morphology.

Effects of phosphourus addition on the physical properties and surface condition of tungsten-copper composites

International Nuclear Information System (INIS)

Akiyoshi, N.; Nakada, K.; Nakayama, M.; Kohda, K.

2001-01-01

Tungsten-copper composites containing a small amount of phosphorus prepared using conventional P/M method. Cu 3 P powder was used as phosphorous source. The effects of phosphorus addition on the physical properties and the surface condition were investigated and the existing form of phosphorus was specified on the tungsten-copper composites The results are summarized as follows. The tungsten-copper composite containing 10 % copper, for example, demonstrated optimum thermal conductivity at the phosphorus addition of 0.02 %. The density of the composites was almost 100 % and the surface of the sintered body was flat and smooth after sintering at a temperature between 1100 and 1150 o C. It was shown that phosphorus exists as Co 2 P. (author)

Nanoscale surface characterization of aqueous copper corrosion: Effects of immersion interval and orthophosphate concentration

Energy Technology Data Exchange (ETDEWEB)

Daniels, Stephanie L. [Department of Chemistry, Louisiana State University, Baton Rouge, LA 70803 (United States); United States Environmental Protection Agency, National Risk Management Research Laboratory (NRMRL), Water Supply and Water Resource Division (WSWRD), Cincinnati, OH 45268 (United States); Sprunger, Phillip T. [Department of Physics and Astronomy, Louisiana State University, Baton Rouge, LA 70803 (United States); Center for Advanced Microstructures and Devices, Synchrotron Radiation Facility of Louisiana State University, Baton Rouge, LA 70803 (United States); Kizilkaya, Orhan [Center for Advanced Microstructures and Devices, Synchrotron Radiation Facility of Louisiana State University, Baton Rouge, LA 70803 (United States); Lytle, Darren A. [United States Environmental Protection Agency, National Risk Management Research Laboratory (NRMRL), Water Supply and Water Resource Division (WSWRD), Cincinnati, OH 45268 (United States); Garno, Jayne C., E-mail: jgarno@lsu.edu [Department of Chemistry, Louisiana State University, Baton Rouge, LA 70803 (United States)

2013-11-15

Morphology changes for copper surfaces exposed to different water parameters were investigated at the nanoscale with atomic force microscopy (AFM), as influenced by changes in pH and the levels of orthophosphate ions. Synthetic water samples were designed to mimic physiological chemistries for drinking water, both with and without addition of orthophosphate over a pH range 6.5–9. Copper surfaces treated with orthophosphate as a corrosion inhibitor after 6 and 24 h were evaluated. Tapping mode AFM images revealed dosing of the water with 6 mg/L of orthophosphate was beneficial in retarding the growth of copper by-products. The chemical composition and oxidation state of the surface deposits were characterized with X-ray diffraction (XRD), near edge X-ray absorption fine structure (NEXAFS) spectroscopy and Fourier transform infrared spectroscopy (FTIR).

Removal of copper and nickel contaminants from Si surface by use of cyanide solutions

International Nuclear Information System (INIS)

Fujiwara, N.; Liu, Y.-L.; Nakamura, T.; Maida, O.; Takahashi, M.; Kobayashi, H.

2004-01-01

The cleaning method using cyanide solutions has been developed to remove heavy metals such as copper (Cu) and nickel (Ni) from Si surfaces. Immersion of Si wafers with both Cu and Ni contaminants in potassium cyanide (KCN) solutions of methanol at room temperature decreases these surface concentrations below the detection limit of total reflection X-ray fluorescence spectroscopy of ∼3x10 9 atoms/cm 2 . UV spectra of the KCN solutions after cleaning of the Cu-contaminated Si surface show that stable copper-cyanide complexes are formed in the solution, leading to the prevention of the re-adsorption of copper in the solutions. From the complex stability constants, it is concluded that the Cu(CN) 4 3- is the most dominant species in the KCN solutions

Surface functionalization of copper via oxidative graft polymerization of 2,2'-bithiophene and immobilization of silver nanoparticles for combating biocorrosion.

Science.gov (United States)

Wan, Dong; Yuan, Shaojun; Neoh, K G; Kang, E T

2010-06-01

An environmentally benign approach to surface modification was developed to impart copper surface with enhanced resistance to corrosion, bacterial adhesion and biocorrosion. Oxidative graft polymerization of 2,2'-bithiophene from the copper surface with self-assembled 2,2'-bithiophene monolayer, and subsequent reduction of silver ions to silver nanoparticles (Ag NPs) on the surface, give rise to a homogeneous bithiophene polymer (PBT) film with densely coupled Ag NPs on the copper surface (Cu-g-PBT-Ag NP surface). The immobilized Ag NPs were found to significantly inhibit bacterial adhesion and enhance the antibacterial properties of the PBT modified copper surface. The corrosion inhibition performance of the functionalized copper substrates was evaluated by Tafel polarization curves and electrochemical impedance spectroscopy. Arising from the chemical affinity of thiols for the noble and coinage metals, the copper surface functionalized with both PBT brushes and Ag NPs also exhibits long-term stability, and is thus potentially useful for combating the combined problems of corrosion and biocorrosion in harsh marine and aquatic environments.

Molecular dynamic simulations of the high-speed copper nanoparticles collision with the aluminum surface

Science.gov (United States)

Pogorelko, V. V.; Mayer, A. E.

2016-11-01

With the use of the molecular dynamic simulations, we investigated the effect of the high-speed (500 m/s, 1000 m/s) copper nanoparticle impact on the mechanical properties of an aluminum surface. Dislocation analysis shows that a large number of dislocations are formed in the impact area; the total length of dislocations is determined not only by the speed and size of the incoming copper nanoparticle (kinetic energy of the nanoparticle), but by a temperature of the system as well. The dislocations occupy the whole area of the aluminum single crystal at high kinetic energy of the nanoparticle. With the decrease of the nanoparticle kinetic energy, the dislocation structures are formed in the near-surface layer; formation of the dislocation loops takes place. Temperature rise of the system (aluminum substrate + nanoparticle) reduces the total dislocation length in the single crystal of aluminum; there is deeper penetration of the copper atoms in the aluminum at high temperatures. Average energy of the nanoparticles and room temperature of the system are optimal for production of high-quality layers of copper on the aluminum surface.

Surface Impedance of Copper MOB Depending on the Annealing Temperature and Deformation Degree

International Nuclear Information System (INIS)

Kutovoj, V.A.; Nikolaenko, A.A.; Stoev, P.I.; Vinogradov, D.V.

2006-01-01

Results of researches of influence of annealing temperature and deformation degree on mechanical features of copper MOB are presented. It is shown that minimal surface resistance is observed in copper samples that were subject to pre-deformation and were annealed in the range of temperatures 873...923 K

On the field dependent surface resistance of niobium on copper cavities

CERN Document Server

Junginger, Tobias

2015-01-01

The surface resistance Rs of superconducting cavities prepared by sputter coating a thin niobium film on a copper substrate increases significantly stronger with the applied RF field compared to cavities of bulk material. A possible cause is that due to the thermal boundary resistance between the copper substrate and the niobium film Rs is enhanced due to global heating of the inner cavity wall. Introducing helium gas in the cavity and measuring its pressure as a function of applied field allowed to conclude that the inner surface of the cavity is heated up by only 60+/-60 mK when Rs increases with Eacc by 100 nOhm. This is more than one order of magnitude less than what one would expect from global heating. Additionally the effect of cooldown speed and low temperature baking have been investigated in the framework of these experiments. It is shown that for current state of the art niobium on copper cavities there is only a detrimental effect of low temperature baking. A fast cooldown results in a lowered Rs.

Fabrication of long-term stable superoleophobic surface based on copper oxide/cobalt oxide with micro-nanoscale hierarchical roughness

Science.gov (United States)

Barthwal, Sumit; Lim, Si-Hyung

2015-02-01

We have demonstrated a simple and cost-effective technique for the large-area fabrication of a superoleophobic surface using copper as a substrate. The whole process included three simple steps: First, the copper substrate was oxidized under hot alkaline conditions to fabricate flower-like copper oxide microspheres by heating at a particular temperature for an interval of time. Second, the copper-oxide-covered copper substrate was further heated in a solution of cobalt nitrate and ammonium nitrate in the presence of an ammonia solution to fabricate cobalt oxide nanostructures. We applied this second step to increase the surface roughness because it is an important criterion for improved superoleophobicity. Finally, to reduce the surface energy of the fabricated structures, the surfaces were chemically modified with perfluorooctyltrichlorosilane. Contact-angle measurements indicate that the micro-nano binary (MNB) hierarchical structures fabricated on the copper substrate became super-repellent toward a broad range of liquids with surface tension in the range of 21.5-72 mN/m. In an attempt to significantly improve the superoleophobic property of the surface, we also examined and compared the role of nanostructures in MNB hierarchical structures with only micro-fabricated surfaces. The fabricated MNB hierarchical structures also displays thermal stability and excellent long-term stability after exposure in air for more than 9 months. Our method might provide a general route toward the preparation of novel hierarchical films on metal substrates for various industrial applications.

Surface modification of an epoxy resin with polyamines and polydopamine: The effect on the initial electroless copper deposition

Energy Technology Data Exchange (ETDEWEB)

Schaubroeck, David, E-mail: David.Schaubroeck@elis.ugent.be [Center for Microsystems Technology (CMST), imec and Ghent University, Technologiepark 914A, B-9052 Ghent (Belgium); Mader, Lothar [Center for Microsystems Technology (CMST), imec and Ghent University, Technologiepark 914A, B-9052 Ghent (Belgium); De Geyter, Nathalie; Morent, Rino [Research Unit Plasma Technology (RUPT), Department of Applied Physics, Faculty of Engineering, Ghent University, Sint-Pietersnieuwstraat 41, B-9000 Ghent (Belgium); Dubruel, Peter [Polymer Chemistry and Biomaterials Research Group, Ghent University, Krijgslaan 281 S4 bis, B-9000 Ghent (Belgium); Vanfleteren, Jan [Center for Microsystems Technology (CMST), imec and Ghent University, Technologiepark 914A, B-9052 Ghent (Belgium)

2014-06-01

This paper describes the influence of polydopamine and polyamine surface modifications of an etched epoxy cresol novolak (ECN) resin on the initial electroless copper deposition. Three different strategies to introduce polyamines on a surface in aqueous environment are applied: via polyethyleneimine adsorption (PEI), via polydopamine and via polyamines grafted to polydopamine. Next, the influence of these surface modifications on the catalytic palladium activation is investigated through X-ray photoelectron spectroscopy (XPS) analysis. Finally, the initial electroless copper deposition on modified epoxy surfaces is evaluated using SEM and Energy Dispersive Spectroscopy (EDS). Grafted polyamines on polydopamine surface modifications result in a large increase of the initial deposited copper.

Laser cladding of stainless steel with a copper-silver alloy to generate surfaces of high antimicrobial activity

Science.gov (United States)

Hans, Michael; Támara, Juan Carlos; Mathews, Salima; Bax, Benjamin; Hegetschweiler, Andreas; Kautenburger, Ralf; Solioz, Marc; Mücklich, Frank

2014-11-01

Copper and silver are used as antimicrobial agents in the healthcare sector in an effort to curb infections caused by bacteria resistant to multiple antibiotics. While the bactericidal potential of copper and silver alone are well documented, not much is known about the antimicrobial properties of copper-silver alloys. This study focuses on the antibacterial activity and material aspects of a copper-silver model alloy with 10 wt% Ag. The alloy was generated as a coating with controlled intermixing of copper and silver on stainless steel by a laser cladding process. The microstructure of the clad was found to be two-phased and in thermal equilibrium with minor Cu2O inclusions. Ion release and killing of Escherichia coli under wet conditions were assessed with the alloy, pure silver, pure copper and stainless steel. It was found that the copper-silver alloy, compared to the pure elements, exhibited enhanced killing of E. coli, which correlated with an up to 28-fold increased release of copper ions. The results show that laser cladding with copper and silver allows the generation of surfaces with enhanced antimicrobial properties. The process is particularly attractive since it can be applied to existing surfaces.

The polymeric nanofilm of triazinedithiolsilane fabricated by self-assembled technique on copper surface. Part 2: Characterization of composition and morphology

Science.gov (United States)

Wang, Yabin; Liu, Zhong; Huang, Yudong; Qi, Yutai

2015-11-01

In the first part, a novel design route for metal protection against corrosion was proposed, and a class of triazinedithiolsilane compounds was conceived as protector for copper. The protective capability of the polymeric nanofilm, fabricated by self-assembling one representative (abbreviated as TESPA) of triazinedithiolsilane compounds onto copper surface, has been investigated and evaluated by electrochemical tests. The results show that the polymeric nanofilm significantly inhibits copper corrosion. This study, on the one hand, concentrates on the chemical composition of the TESPA polymeric nanofilm by means of X-ray photoelectron spectroscopy (XPS). The XPS results reveal that the chemical bonds between copper and TESPA monomers, three dimensional disulfide units and siloxane networks are responsible for the satisfactory protection of TESPA polymeric nanofilm against copper corrosion. On the other hand, scanning electron microscope (SEM) and energy-dispersive spectroscopy (EDS) are utilized to reveal the morphology and the uniformity of the TESPA polymeric nanofilm. The SEM-EDS results demonstrate that the copper surfaces are uniformly covered with TESPA self-assembled monolayer and the polymeric nanofilm. The TESPA-covered copper surfaces turn out to be smoother than that of the bare copper surface.

Measurement of the specific surface area of loose copper deposit by electrochemical methods

Directory of Open Access Journals (Sweden)

E. A. Dolmatova

2016-07-01

Full Text Available In the work the surface area of the electrode with dispersed copper deposit obtained within 30 seconds was evaluated by techniques of chronopotentiometry (CPM and impedance spectroscopy. In method CPM the electrode surface available for measurement depends on the value of the polarizing current. At high currents during the transition time there is a change of surface relief that can not determine the full surface of loose deposit. The electrochemical impedance method is devoid of this shortcoming since the measurements are carried out in indifferent electrolyte in the absence of current. The area measured by the impedance is tens of times higher than the value obtained by chronopotentiometry. It is found that from a solution containing sulfuric acid the deposits form with a high specific surface area. Based on these data it was concluded that the method of impedance spectroscopy can be used to measure in situ the surface area of the dispersed copper deposits.

Effect of Mo Ion Implantation on Stability of Nanocrystalline Copper Surface Layers

Directory of Open Access Journals (Sweden)

XI Yang

2016-08-01

Full Text Available The surface of pure copper was modified using the surface mechanical attrition treatment (SMAT method, and molybdenum ions were implanted in the nanosurface using a metal vapor vacuum arc (MEVVA. The results of the SMAT were observed by optical microscopy (OM, X-ray diffraction (XRD and scanning electron microscopy (SEM. An obvious nanocrystalline layer and a deformation region exist on the surface. The size of the nanocrystalline layer was characterized using atomic force microscopy (AFM. The results indicate remarkable suppression on grain size, the nanocrystalline layer grows to 163nm after annealing and reduces to only 72nm due to the Mo ion implantation. In addition, the hardness of the topmost surface of the material is 3.5 times that of the SMATed copper, which is about 7 times of the value of the matrix. The above improvements most likely result from the dispersion of the Mo ions and the reactions of the crystal defects due to the SMAT and ion implantation.

The polymeric nanofilm of triazinedithiolsilane fabricated by self-assembled technique on copper surface. Part 2: Characterization of composition and morphology

International Nuclear Information System (INIS)

Wang, Yabin; Liu, Zhong; Huang, Yudong; Qi, Yutai

2015-01-01

Highlights: • The chemical reactions between copper and triazinedithiolsilane were revealed. • The structure of triazinedithiolsilane's polymeric nanofilm was demonstrated. • The morphology and microstructure of the polymeric nanofilm was observed. - Abstract: In the first part, a novel design route for metal protection against corrosion was proposed, and a class of triazinedithiolsilane compounds was conceived as protector for copper. The protective capability of the polymeric nanofilm, fabricated by self-assembling one representative (abbreviated as TESPA) of triazinedithiolsilane compounds onto copper surface, has been investigated and evaluated by electrochemical tests. The results show that the polymeric nanofilm significantly inhibits copper corrosion. This study, on the one hand, concentrates on the chemical composition of the TESPA polymeric nanofilm by means of X-ray photoelectron spectroscopy (XPS). The XPS results reveal that the chemical bonds between copper and TESPA monomers, three dimensional disulfide units and siloxane networks are responsible for the satisfactory protection of TESPA polymeric nanofilm against copper corrosion. On the other hand, scanning electron microscope (SEM) and energy-dispersive spectroscopy (EDS) are utilized to reveal the morphology and the uniformity of the TESPA polymeric nanofilm. The SEM-EDS results demonstrate that the copper surfaces are uniformly covered with TESPA self-assembled monolayer and the polymeric nanofilm. The TESPA-covered copper surfaces turn out to be smoother than that of the bare copper surface.

New configuration for efficient and durable copper coating on the outer surface of a tube

Directory of Open Access Journals (Sweden)

Irfan Ahmad

2017-03-01

Full Text Available A well-adhered copper coating on stainless steel power coupler parts is required in superconducting radio frequency (SRF accelerators. Radio frequency power coupler parts are complex, tubelike stainless steel structures, which require copper coating on their outer and inner surfaces. Conventional copper electroplating sometimes produces films with inadequate adhesion strength for SRF applications. Electroplating also requires a thin nickel strike layer under the copper coating, whose magnetic properties can be detrimental to SRF applications. Coaxial energetic deposition (CED and sputtering methods have demonstrated efficient conformal coating on the inner surfaces of tubes but coating the outer surface of a tube is challenging because these coating methods are line of sight. When the substrate is off axis and the plasma source is on axis, only a small section of the substrate’s outer surface is exposed to the source cathode. The conventional approach is to rotate the tube to achieve uniformity across the outer surface. This method results in poor film thickness uniformity and wastes most of the source plasma. Alameda Applied Sciences Corporation (AASC has developed a novel configuration called hollow external cathode CED (HEC-CED to overcome these issues. HEC-CED produces a film with uniform thickness and efficiently uses all eroded source material. The Cu film deposited on the outside of a stainless steel tube using the new HEC-CED configuration survived a high pressure water rinse adhesion test. HEC-CED can be used to coat the outside of any cylindrical structure.

Bacterial Killing by Dry Metallic Copper Surfaces▿

OpenAIRE

Santo, Christophe Espírito; Lam, Ee Wen; Elowsky, Christian G.; Quaranta, Davide; Domaille, Dylan W.; Chang, Christopher J.; Grass, Gregor

2010-01-01

Metallic copper surfaces rapidly and efficiently kill bacteria. Cells exposed to copper surfaces accumulated large amounts of copper ions, and this copper uptake was faster from dry copper than from moist copper. Cells suffered extensive membrane damage within minutes of exposure to dry copper. Further, cells removed from copper showed loss of cell integrity. Acute contact with metallic copper surfaces did not result in increased mutation rates or DNA lesions. These findings are important fir...

Fabrication of superhydrophobic copper surface on various substrates for roll-off, self-cleaning, and water/oil separation.

Science.gov (United States)

Sasmal, Anup Kumar; Mondal, Chanchal; Sinha, Arun Kumar; Gauri, Samiran Sona; Pal, Jaya; Aditya, Teresa; Ganguly, Mainak; Dey, Satyahari; Pal, Tarasankar

2014-12-24

Superhydrophobic surfaces prevent percolation of water droplets and thus render roll-off, self-cleaning, corrosion protection, etc., which find day-to-day and industrial applications. In this work, we developed a facile, cost-effective, and free-standing method for direct fabrication of copper nanoparticles to engender superhydrophobicity for various flat and irregular surfaces such as glass, transparency sheet (plastic), cotton wool, textile, and silicon substrates. The fabrication of as-prepared superhydrophobic surfaces was accomplished using a simple chemical reduction of copper acetate by hydrazine hydrate at room temperature. The surface morphological studies demonstrate that the as-prepared surfaces are rough and display superhydrophobic character on wetting due to generation of air pockets (The Cassie-Baxter state). Because of the low adhesion of water droplets on the as-prepared surfaces, the surfaces exhibited not only high water contact angle (164 ± 2°, 5 μL droplets) but also superb roll-off and self-cleaning properties. Superhydrophobic copper nanoparticle coated glass surface uniquely withstands water (10 min), mild alkali (5 min in saturated aqueous NaHCO3 of pH ≈ 9), acids (10 s in dilute HNO3, H2SO4 of pH ≈ 5) and thiol (10 s in neat 1-octanethiol) at room temperature (25-35 °C). Again as-prepared surface (cotton wool) was also found to be very effective for water-kerosene separation due to its superhydrophobic and oleophilic character. Additionally, the superhydrophobic copper nanoparticle (deposited on glass surface) was found to exhibit antibacterial activity against both Gram-negative and Gram-positive bacteria.

Effect of ion irradiation on the optical properties and room temperature oxidation of copper surface

Energy Technology Data Exchange (ETDEWEB)

Poperenko, L.V.; Ramadan Shaaban, Essam; Khanh, N.Q.; Stashchuk, V.S.; Vinnichenko, M.V.; Yurgelevich, I.V.; Nosach, D.V.; Lohner, T

2004-05-01

Ex situ and in situ spectroellipsometric investigation of room temperature oxidation of ion-implanted copper surface was performed. The ellipsometer is capable to measure simultaneously the ellipsometric parameters {psi} and {delta} at 88 different wavelength values in the range of 280-760 nm within a few minutes in the high precision operation mode using two zone averaging and within a fraction of a second in the one zone operation mode. The native oxide layer formed earlier on the surface of the copper was sputtered off during the aluminum ion implantation. In situ study of the growth of the newly formed native oxide layer on the ion implanted surface was carried out. Ion beam analytical measurements were performed to gain further information on the native oxide layer. The absolute number of the oxygen atoms in the native copper oxide layer was determined. The depth distribution of the implanted aluminum was extracted from Rutherford backscattering spectra. It is found that Al implantation enhanced the oxidation resistance.

Effect of ion irradiation on the optical properties and room temperature oxidation of copper surface

International Nuclear Information System (INIS)

Poperenko, L.V.; Ramadan Shaaban, Essam; Khanh, N.Q.; Stashchuk, V.S.; Vinnichenko, M.V.; Yurgelevich, I.V.; Nosach, D.V.; Lohner, T.

2004-01-01

Ex situ and in situ spectroellipsometric investigation of room temperature oxidation of ion-implanted copper surface was performed. The ellipsometer is capable to measure simultaneously the ellipsometric parameters Ψ and Δ at 88 different wavelength values in the range of 280-760 nm within a few minutes in the high precision operation mode using two zone averaging and within a fraction of a second in the one zone operation mode. The native oxide layer formed earlier on the surface of the copper was sputtered off during the aluminum ion implantation. In situ study of the growth of the newly formed native oxide layer on the ion implanted surface was carried out. Ion beam analytical measurements were performed to gain further information on the native oxide layer. The absolute number of the oxygen atoms in the native copper oxide layer was determined. The depth distribution of the implanted aluminum was extracted from Rutherford backscattering spectra. It is found that Al implantation enhanced the oxidation resistance

Self-assembled monolayer of ammonium pyrrolidine dithiocarbamate on copper detected using electrochemical methods, surface enhanced Raman scattering and quantum chemistry calculations

Energy Technology Data Exchange (ETDEWEB)

Liao, Q.-Q., E-mail: liaoqq1971@yahoo.com.cn [Key Lab of Shanghai Colleges and Universities for Electric Power Corrosion Control and Applied Electrochemistry, Shanghai Engineering Research Center of Energy-Saving in Heat Exchange Systems, Shanghai University of Electric Power, Shanghai 200090 (China); Yue, Z.-W.; Yang, D. [Key Lab of Shanghai Colleges and Universities for Electric Power Corrosion Control and Applied Electrochemistry, Shanghai Engineering Research Center of Energy-Saving in Heat Exchange Systems, Shanghai University of Electric Power, Shanghai 200090 (China); Wang, Z.-H. [Department of Chemistry, Tongji University, Shanghai 200092 (China); Li, Z.-H. [Department of Chemistry, Fudan University, Shanghai 200433 (China); Ge, H.-H. [Key Lab of Shanghai Colleges and Universities for Electric Power Corrosion Control and Applied Electrochemistry, Shanghai Engineering Research Center of Energy-Saving in Heat Exchange Systems, Shanghai University of Electric Power, Shanghai 200090 (China); Li, Y.-J. [Department of Chemistry, Tongji University, Shanghai 200092 (China)

2011-07-29

Ammonium pyrrolidine dithiocarbamate (APDTC) monolayer was self-assembled on fresh copper surface obtained after oxidation-reduction cycle treatment in 0.1 mol L{sup -1} potassium chloride solution at ambient temperature. The APDTC self-assembled monolayer (SAM) on copper surface was investigated by surface enhanced Raman scattering spectroscopy and the results show that APDTC SAM is chemisorbed on copper surface by its sulfur atoms with perpendicular orientation. The optimum immersing period for SAM formation is 4 h at 0.01 mol L{sup -1} concentration of APDTC. The impedance results indicate that APDTC SAM has good corrosion inhibition effects for copper in 0.5 mol L{sup -1} hydrochloric acid solution and its maximum inhibition efficiency could reach 95%. Quantum chemical calculations show that APDTC has relatively small {Delta}E between the highest occupied molecular orbital and the lowest unoccupied molecular orbital and large negative charge in its two sulfur atoms, which facilitate formation of an insulating Cu/APDTC film on copper surface.

Research surface resistance of copper normal and abnormal skin-effects depending on the frequency of electromagnetic field

International Nuclear Information System (INIS)

Kutovyi, V.A.; Komir, A.I.

2013-01-01

The results of the frequency dependence of surface resistance of copper in diffuse and specular reflection of electrons from the conductive surface of the high-frequency resonance of the system depending on the frequency of the electromagnetic field in the normal and anomalous skin effect. Found, the surface resistance of copper is reduced by more than 10 times at the temperature of liquid helium, as compared with a surface resistivity at room temperature, at frequencies f ≤ 173 MHz, for diffuse reflection of conduction electrons from the surface of the conductive layer, and the specular reflection - at frequencies f ≤ 346 MHz

Breakdown conditioning of copper, CuZr and GlidCop® : effect of mechanical surface treatments

CERN Document Server

Ramsvik, T; Calatroni, S; Taborelli, M; CERN. Geneva. TS Department

2007-01-01

Motivated by the need of novel materials for the CLIC accelerating structures to resist mechanical fatigue, the copper based metals Copper Zirconium C15000 (CuZr) and GlidCop® Al-15 C15715 have been investigated by DC breakdown measurements, and compared with commercially pure Oxygen-free Copper C10100 (Cu-OFE). In all three cases the saturated breakdown fields (Esat) are similar, despite significant differences in their tensile strengths. In addition, the choice of mechanical surface preparation techniques influences the final breakdown characteristics. For both CuZr and GlidCop® immediate conditioning takes place when the surfaces are prepared by milling. For electro discharge machined (EDM) surfaces, however, several breakdown events are needed to obtain saturation. Specifically, for EDM treated CuZr and GlidCop®, ~50 and ~200 breakdown events are required to reach Esat.

Dry Etching of Copper Phthalocyanine Thin Films: Effects on Morphology and Surface Stoichiometry

Directory of Open Access Journals (Sweden)

Michael J. Brett

2012-08-01

Full Text Available We investigate the evolution of copper phthalocyanine thin films as they are etched with argon plasma. Significant morphological changes occur as a result of the ion bombardment; a planar surface quickly becomes an array of nanopillars which are less than 20 nm in diameter. The changes in morphology are independent of plasma power, which controls the etch rate only. Analysis by X-ray photoelectron spectroscopy shows that surface concentrations of copper and oxygen increase with etch time, while carbon and nitrogen are depleted. Despite these changes in surface stoichiometry, we observe no effect on the work function. The absorbance and X-ray diffraction spectra show no changes other than the peaks diminishing with etch time. These findings have important implications for organic photovoltaic devices which seek nanopillar thin films of metal phthalocyanine materials as an optimal structure.

Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

Science.gov (United States)

Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

2010-09-15

As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

Metallic copper corrosion rates, moisture content, and growth medium influence survival of copper ion-resistant bacteria

DEFF Research Database (Denmark)

Elguindi, J; Moffitt, S; Hasman, Henrik

2010-01-01

of both copper ion-resistant E. coli and E. faecium strains when samples in rich medium were spread in a thin, moist layer on copper alloys with 85% or greater copper content. E. coli strains were rapidly killed under dry conditions, while E. faecium strains were less affected. Electroplated copper...... on electroplated copper surfaces with benzotriazole coating and thermal oxide coating compared to surfaces without anti-corrosion treatment. Control of surface corrosion affected the level of copper ion influx into bacterial cells, which contributed directly to bacterial killing....

DFT study of ethyl xanthate interaction with sphalerite (1 1 0) surface in the absence and presence of copper

Energy Technology Data Exchange (ETDEWEB)

Liu, Jian [State Key Laboratory of Complex Nonferrous Metal Resources Clean Utilization , Kunming University of Science and Technology, Kunming 650093 (China); Wen, Shuming, E-mail: shmwen@126.com [State Key Laboratory of Complex Nonferrous Metal Resources Clean Utilization , Kunming University of Science and Technology, Kunming 650093 (China); Deng, Jiushuai [State Key Laboratory of Complex Nonferrous Metal Resources Clean Utilization , Kunming University of Science and Technology, Kunming 650093 (China); Chen, Xiumin [National Engineering Laboratory of Vacuum Metallurgy, Kunming University of Science and Technology, Kunming 650093 (China); Feng, Qicheng [State Key Laboratory of Complex Nonferrous Metal Resources Clean Utilization , Kunming University of Science and Technology, Kunming 650093 (China)

2014-08-30

Highlights: • Interaction among sphalerite surface, copper and ethyl xanthate (EX) was simulated. • Results show that four stable interaction models exist among them. • The four models can result in the activation flotation of sphalerite. - Abstract: The interaction among sphalerite (1 1 0) surface, copper and ethyl xanthate (EX) was simulated using the density functional theory (DFT). The results of DFT indicate that four types of stable interaction models exist among sphalerite surface, copper and EX, i.e., EX interacts with the Cu substituted for Zn, Cu adsorbed on the top site of S, Cu adsorbed on the bridge site of S and Cu(OH){sub 2} adsorbed on the sphalerite surface. The four interaction models can result in the activation flotation of sphalerite. Density of states (DOS) analysis shows that the energy level discrepancy of the Zn 3d orbital in ZnS and the bonding S 3p orbital in EX results in the weak adsorption of EX on un-activated sphalerite surface. However, after copper activation, the Cu 3d orbital peak and bonding S 3p orbital peak are just maximally overlapped nearby the Fermi level. This study provides an insight into the nature that sphalerite responds not well to EX and also a comprehensive understanding on the possible interaction cases existing among sphalerite surface, copper and EX.

DFT study of ethyl xanthate interaction with sphalerite (1 1 0) surface in the absence and presence of copper

International Nuclear Information System (INIS)

Liu, Jian; Wen, Shuming; Deng, Jiushuai; Chen, Xiumin; Feng, Qicheng

2014-01-01

Highlights: • Interaction among sphalerite surface, copper and ethyl xanthate (EX) was simulated. • Results show that four stable interaction models exist among them. • The four models can result in the activation flotation of sphalerite. - Abstract: The interaction among sphalerite (1 1 0) surface, copper and ethyl xanthate (EX) was simulated using the density functional theory (DFT). The results of DFT indicate that four types of stable interaction models exist among sphalerite surface, copper and EX, i.e., EX interacts with the Cu substituted for Zn, Cu adsorbed on the top site of S, Cu adsorbed on the bridge site of S and Cu(OH) 2 adsorbed on the sphalerite surface. The four interaction models can result in the activation flotation of sphalerite. Density of states (DOS) analysis shows that the energy level discrepancy of the Zn 3d orbital in ZnS and the bonding S 3p orbital in EX results in the weak adsorption of EX on un-activated sphalerite surface. However, after copper activation, the Cu 3d orbital peak and bonding S 3p orbital peak are just maximally overlapped nearby the Fermi level. This study provides an insight into the nature that sphalerite responds not well to EX and also a comprehensive understanding on the possible interaction cases existing among sphalerite surface, copper and EX

Effect of Ammonium Chloride on the Efficiency with Which Copper Sulfate Activates Marmatite: Change in Solution Composition and Regulation of Surface Composition

Directory of Open Access Journals (Sweden)

Shengdong Zhang

2018-06-01

Full Text Available Zinc sulfide minerals are the primary choice for zinc extraction and marmatite is one of the two most common zinc sulphide minerals (sphalerite and marmatite, therefore it is of great significance to study and optimize the flotation of marmatite. To improve the activation of copper sulfate on marmatite, a method involving the addition of ammonium chloride is devised. The method has been proven to be an effective way of improving the activation efficiency of copper sulfate towards marmatite under alkaline conditions. The strengthening mechanism was studied using micro-flotation, adsorption test, X-ray photoelectron spectroscopy, and by analyzing changes in solution composition. Flotation test results show that the activation effect of the copper sulfate towards marmatite is enhanced with the addition of ammonium chloride. According to the results of the adsorption measurements and X-ray photoelectron spectroscopy analysis, when the marmatite surface is activated using copper sulfate with added ammonia chloride, it adsorbs more copper sulfide and less copper hydroxide and zinc hydroxide. These changes in surface composition are believed to occur via the following process: NH3(aq promotes the dissolution of zinc hydroxide and then facilitates the conversion of surface copper hydroxide to copper sulfide. In addition, the occurrence of Cu(NH3n2+ can promote the adsorption of copper ions (Cu2+ can be stored as Cu(NH3n2+ via complexation, and then, when the concentration of copper ions decreases, Cu2+ can be released through the decompositionof Cu(NH3n2+. Hence, the copper ion concentration can be maintained and this can facilitate the adsorption of Cu2+ on marmatite. Based on a comprehensive analysis of all our results, we propose that adding ammonium chloride to the copper sulfate changes the solution components (i.e., the presence of NH3(aq and Cu(NH3n2+ and then regulates the surface composition of marmatite. The change in surface composition

Sulfur-induced structural motifs on copper and gold surfaces

Energy Technology Data Exchange (ETDEWEB)

Walen, Holly [Iowa State Univ., Ames, IA (United States)

2016-01-01

The interaction of sulfur with copper and gold surfaces plays a fundamental role in important phenomena that include coarsening of surface nanostructures, and self-assembly of alkanethiols. Here, we identify and analyze unique sulfur-induced structural motifs observed on the low-index surfaces of these two metals. We seek out these structures in an effort to better understand the fundamental interactions between these metals and sulfur that lends to the stability and favorability of metal-sulfur complexes vs. chemisorbed atomic sulfur. The experimental observations presented here—made under identical conditions—together with extensive DFT analyses, allow comparisons and insights into factors that favor the existence of metal-sulfur complexes, vs. chemisorbed atomic sulfur, on metal terraces. We believe this data will be instrumental in better understanding the complex phenomena occurring between the surfaces of coinage metals and sulfur.

Deformation, oxidation and embrittlement of PWB fuel cladding in a loss-of-coolant accident

Energy Technology Data Exchange (ETDEWEB)

Parsons, P.D.; Hindle, E.D.; Mann, C.A.

1986-09-01

The scope of this report is limited to the oxidation, embrittlement and deformation of PWB fuel in a loss of coolant accident in which the emergency core coolant systems operate in accordance with the design, ie accidents within the design basis of the plant. A brief description is given of the thermal hydraulic events during large and small breaks of the primary circuit, followed by the correct functioning and remedial action of the emergency core cooling systems. The possible damage to the fuel cladding during these events is also described. The basic process of oxidation of zircaloy-4 fuel cladding by steam, and the reaction kinetics of the oxidation are reviewed in detail. Variables having a possible influence on the oxidation kinetics are also considered. The embrittlement of zircaloy-4 cladding by oxidation is also reviewed in detail. It is related to fracture during the thermal shock of rewetting or by the ambient impact forces as a result of post-accident fuel handling. Criteria based both on total oxidation and on the detailed distribution of oxygen through the oxidised cladding wall are considered. The published computer codes for the calculation of oxygen concentration are reviewed in terms of the model employed and the limitations apparent in these models when calculating oxygen distribution in cladding in the actual conditions of a loss of coolant accident. The factors controlling the deformation and rupture of cladding in a loss of coolant accident are reviewed in detail.

Surface Structures Formed by a Copper(II Complex of Alkyl-Derivatized Indigo

Directory of Open Access Journals (Sweden)

Akinori Honda

2016-10-01

Full Text Available Assembled structures of dyes have great influence on their coloring function. For example, metal ions added in the dyeing process are known to prevent fading of color. Thus, we have investigated the influence of an addition of copper(II ion on the surface structure of alkyl-derivatized indigo. Scanning tunneling microscope (STM analysis revealed that the copper(II complexes of indigo formed orderly lamellar structures on a HOPG substrate. These lamellar structures of the complexes are found to be more stable than those of alkyl-derivatized indigos alone. Furthermore, 2D chirality was observed.

Determination of the surface area and sizes of supported copper nanoparticles through organothiol adsorption—ñhemisorption

Energy Technology Data Exchange (ETDEWEB)

Ndolomingo, Matumuene Joe; Meijboom, Reinout, E-mail: rmeijboom@uj.ac.za

2016-12-30

Highlights: • Cu on γ-Al{sub 2}O{sub 3} catalysts were prepared and characterized. • The ligand sorption-based technique was used for the determination of specific surface area and particle sizes. • The ligand packing density on Cu nanoparticles was quantified. • A fair agreement was found between the Cu particle sizes obtained from ligand adsorption and TEM methods. • The oxidation of morin by hydrogen peroxide was used to evaluate the catalytic activities of the Cu supported catalysts. - Abstract: The mechanisms involving the nanoparticle surfaces in catalytic reactions are more difficult to elucidate due to the nanoparticle surface unevenness, size distributions, and morphological irregularity. True surface area and particle sizes determination are key aspects of the activity of metal nanoparticle catalysts. Here we report on the organothiol adsorption-based technique for the determination of specific surface area of Cu nanoparticles, and their resultant sizes on γ-Al{sub 2}O{sub 3} supports. Quantification of ligand packing density on copper nanoparticles is also reported. The concentration of the probe ligand, 2-mercaptobenzimidazole (2-MBI) before and after immersion of supported copper catalysts was determined by ultraviolet-visible spectrometry (UV–vis). The amount of ligand adsorbed was found to be proportional to the copper nanoparticles surface area. Atomic absorption spectrometry (AAS), N{sub 2}-physisorption (BET), transmission electron microscopy (TEM), scanning electron microscopy (SEM) and thermogravimetric analysis (TGA) were used for the characterization of the catalysts. A fair agreement was found between particle sizes obtained from ligand adsorption and TEM methods. The catalytic activity of the copper nanoparticles related to their inherent surface area was evaluated using the model reaction of the oxidation of morin by hydrogen peroxide.

Silver surface enrichment of silver-copper alloys: a limitation for the analysis of ancient silver coins by surface techniques

International Nuclear Information System (INIS)

Beck, L.; Bosonnet, S.; Reveillon, S.; Eliot, D.; Pilon, F.

2004-01-01

The surface enrichment of archaeological silver-copper alloys has been recognized for many years. However, the origin of this enrichment is not well defined and many hypotheses have been put forward to account for this behaviour: segregation of the components during casting, deliberate thermal and/or chemical post-treatment, abrasion or corrosion. Among the hypotheses mentioned above, we have focused our study on the first step of coin manufacturing. Replications of silver-copper standards of various compositions ranging from 30% to 80% Ag, reflecting the composition of silver blanks, have been produced. Metallographic examination, PIXE and SEM-EDS have been used for the characterization of each sample. A model of the direct enrichment has been established. This model allows us to propose a relationship between the surface composition and the silver content of the core. Comparison with data of Roman coins from the Roman site of Cha-hat teaubleau (France) and from the literature and consequences for the analyses of ancient coins by surface methods are presented

DFT study of ethyl xanthate interaction with sphalerite (1 1 0) surface in the absence and presence of copper

Science.gov (United States)

Liu, Jian; Wen, Shuming; Deng, Jiushuai; Chen, Xiumin; Feng, Qicheng

2014-08-01

The interaction among sphalerite (1 1 0) surface, copper and ethyl xanthate (EX) was simulated using the density functional theory (DFT). The results of DFT indicate that four types of stable interaction models exist among sphalerite surface, copper and EX, i.e., EX interacts with the Cu substituted for Zn, Cu adsorbed on the top site of S, Cu adsorbed on the bridge site of S and Cu(OH)2 adsorbed on the sphalerite surface. The four interaction models can result in the activation flotation of sphalerite. Density of states (DOS) analysis shows that the energy level discrepancy of the Zn 3d orbital in ZnS and the bonding S 3p orbital in EX results in the weak adsorption of EX on un-activated sphalerite surface. However, after copper activation, the Cu 3d orbital peak and bonding S 3p orbital peak are just maximally overlapped nearby the Fermi level. This study provides an insight into the nature that sphalerite responds not well to EX and also a comprehensive understanding on the possible interaction cases existing among sphalerite surface, copper and EX.

Mass spectrum of secondary ions knocked-out from copper surface by argon ion beam

International Nuclear Information System (INIS)

Koval', A.G.; Bobkov, V.V.; Klimovskij, Yu.A.; Fogel', Ya.M.

1976-01-01

The mass-spectrum of secondary ions was studied within a mass range of 1-400. The ions were knocked-out by the beam of ions Ar + from the copper surface with different content of oxygen and sulphur solved in the volume. The studies were conducted at three temperatures of the target. The atomic and molecular ions of the metal matrix, volumetric impurities of metal and ions of chemical compounds molecules of the metal under study with gas particles adsorbed on its surface and atoms of the metal volumetric admixtures may be observed in the mass spectrum. Detection of secondary ions of the copper multi-atomic complexes and ions of these complexes compounds with the adsorbed molecules is of interest

Intrinsically water-repellent copper oxide surfaces; An electro-crystallization approach

Science.gov (United States)

Akbari, Raziyeh; Ramos Chagas, Gabriela; Godeau, Guilhem; Mohammadizadeh, Mohammadreza; Guittard, Frédéric; Darmanin, Thierry

2018-06-01

Use of metal oxide thin layers is increased due to their good durability under environmental conditions. In this work, the repeatable nanostructured crystalite Cu2O thin films, developed by electrodeposition method without any physical and chemical modifications, demonstrate good hydrophobicity. Copper (I) oxide (Cu2O) layers were fabricated on gold/Si(1 0 0) substrates by different electrodeposition methods i.e. galvanostatic deposition, cyclic voltammetry, and pulse potentiostatic deposition and using copper sulfate (in various concentrations) as a precursor. The greatest crystalline face on prepared Cu2O samples is (1 1 1) which is the most hydrophobic facet of Cu2O cubic structure. Indeed, different crystallite structures such as nanotriangles and truncated octahedrons were formed on the surface for various electrodeposition methods. The increase of the contact angle (θw) measured by the rest time, reaching to about 135°, was seen at different rates and electrodeposition methods. In addition, two-step deposition surfaces were also prepared by applying two of the mentioned methods, alternatively. In general, the morphology of the two-step deposition surfaces showed some changes compared to that of one-step samples, allowing the formation of different crystallite shapes. Moreover, the wettability behavior showd the larger θw of the two-step deposition layers compared to the related one-step deposition layers. Therefore, the highest observed θw was related to the one of two-step deposition layers due to the creation of small octahedral structures on the surface, having narrow and deep valleys. However, there was an exception which was due to the resulted big structures and broad valleys on the surface. So, it is possible to engineer different crystallites shapes using the proposed two-step deposition method. It is expected that hydrophobic crystallite thin films can be used in environmental and electronic applications to save energy and materials properties.

Copper and copper-nickel alloys as zebra mussel antifoulants

Energy Technology Data Exchange (ETDEWEB)

Dormon, J.M.; Cottrell, C.M.; Allen, D.G.; Ackerman, J.D.; Spelt, J.K. [Univ. of Toronto, Ontario (Canada)

1996-04-01

Copper has been used in the marine environment for decades as cladding on ships and pipes to prevent biofouling by marine mussels (Mytilus edulis L.). This motivated the present investigation into the possibility of using copper to prevent biofouling in freshwater by both zebra mussels and quagga mussels (Dreissena polymorpha and D. bugensis collectively referred to as zebra mussels). Copper and copper alloy sheet proved to be highly effective in preventing biofouling by zebra mussels over a three-year period. Further studies were conducted with copper and copper-nickel mesh (lattice of expanded metal) and screen (woven wire with a smaller hole size), which reduced the amount of copper used. Copper screen was also found to be strongly biofouling-resistant with respect to zebra mussels, while copper mesh reduced zebra mussel biofouling in comparison to controls, but did not prevent it entirely. Preliminary investigations into the mechanism of copper antifouling, using galvanic couples, indicated that the release of copper ions from the surface of the exposed metal into the surrounding water is directly or indirectly responsible for the biofouling resistance of copper.

Damage caused by a nanosecond UV laser on a heated copper surface

Energy Technology Data Exchange (ETDEWEB)

Henč-Bartolić, V., E-mail: visnja.henc@fer.hr [University of Zagreb, Faculty of Electrical Engineering and Computing, Unska 3, 10000 Zagreb (Croatia); Bončina, T. [University of Maribor, Faculty of Mechanical Engineering, Smetanova 17, 2000 Maribor (Slovenia); Jakovljević, S., E-mail: suzana.jakovljevic@fsb.hr [University of Zagreb, Faculty of Mechanical Engineering and Naval Architecture, Ivana Lučića 5, 10002 Zagreb (Croatia); Panjan, P. [Jožef Stefan Institute, Jamova 39, 1000 Ljubljana (Slovenia); Zupanič, F. [University of Maribor, Faculty of Mechanical Engineering, Smetanova 17, 2000 Maribor (Slovenia)

2016-08-15

Highlights: • A Cu-plate was exposed to nanosecond UV laser with max. energy 1.1 J/cm{sup 2}. • Surface topography was studied on the cold and heated copper plate. • At room temperature, a crater formed, the melt was ejected from it. • Capillary waves formed in the vicinity of the crater at 360 °C. - Abstract: This work studied the effect of thin copper plate temperature on its surface morphology after irradiation using a pulsed nanosecond UV laser. The surface characteristics were investigated using scanning electron microscopy, energy dispersive X-ray spectroscopy, focused ion beam and stylus profilometry. When a target was at room temperature, a crater and the radial flow of molten Cu from the crater was observed. When the thin target was warm (about 360 °C ± 20 °C), a crater was smaller, and quasi-semicircular waves with the periodicity of around 3 μm appeared in its vicinity. The origin of the waves is Marangoni effect, causing thermocapillary waves, which in same occasions had a structure of final states of chaos in Rayleigh–Bénard convection.

Effects of organic matters coming from Chinese tea on soluble copper release from copper teapot

International Nuclear Information System (INIS)

Ni Lixiao; Li Shiyin

2008-01-01

The morphology and elemental composition of the corrosion products of copper teapot's inner-surface were characterized by the scanning electron microscopy and energy dispersive X-ray surface analysis (SEM/EDS), X-ray powder diffraction (XRD) and X-ray photon spectroscopy (XPS) analysis. It was revealed that Cu, Fe, Ca, P, Si and Al were the main elements of corrosion by-products, and the α-SiO 2 , Cu 2 O and CaCO 3 as the main mineral components on the inner-surface of copper teapot. The effects of organic matters coming from Chinese tea on soluble copper release from copper teapots in tap water were also investigated. The results showed that the doses of organic matter (as TOC), temperate and stagnation time have significant effects on the concentration of soluble copper released from copper teapots in tap water

Study of the influence of surface-active substances on the initial stage of copper electrodeposition

Directory of Open Access Journals (Sweden)

Amantay Dalbanbay

2017-12-01

Full Text Available In this research, the effect of surface-active substances (CMC and DFP on the electrolysis of copper by cyclic voltammetry (CVA and chronoamperometric methods was studied. The working electrode was a glassy carbon electrode. Studies show that in the acid solution of copper sulfate (10-2 M CuSO4 + 0.5 M H2SO4, the three-dimensional electrochemical deposition of copper occurs by the mechanism of instantaneous nucleation. The added surface active substances affect the dischargeionization process, the standard electroreduction potential is shifted to the negative side. The added DFP reduces the cathodic peak current, and the addition of CMC results in its increase. At the deposition potentials corresponding to the regions up to the CVA peak current (here, still, the mixed electrodeposition kinetics, the number of nuclei formed is greater for a pure solution, but at current decay potentials, where the diffusion regime takes place, the nuclei population density (NPD is higher for solutions with surfactants. The most powerful effect here is caused by the addition of DFP. In the case of mixed additives, the NPD values are close to those of the CMC, obviously indicating the preferential adsorption of CMC, whereas the DFP as complexes with copper ions is closer to the near-electrode region.

Preparation of copper and silicon/copper powders by a gas ...

Indian Academy of Sciences (India)

Administrator

aCentre for Materials Research, Department of Imaging and Applied Physics, ... Copper powder; Si/Cu composite particle; gas evaporation–condensation method; characteriza- tion. .... from the liquid metal surface, the mixed vapour of copper.

High-speed collision of copper nanoparticle with aluminum surface: Molecular dynamics simulation

Science.gov (United States)

Pogorelko, Victor V.; Mayer, Alexander E.; Krasnikov, Vasiliy S.

2016-12-01

We investigate the effect of the high-speed collision of copper nanoparticles with aluminum surface by means of molecular dynamic simulations. Studied diameter of nanoparticles is varied within the range 7.2-22 nm and the velocity of impact is equal to 500 or 1000 m/s. Dislocation analysis shows that a large quantity of dislocations is formed within the impact area. Overall length of dislocations is determined, first of all, by the impact velocity and by the size of incident copper nanoparticle, in other words, by the kinetic energy of the nanoparticle. Dislocations occupy the total volume of the impacted aluminum single crystal layer (40.5 nm in thickness) in the form of intertwined structure in the case of large kinetic energy of the incident nanoparticle. Decrease in the initial kinetic energy or increase in the layer thickness lead to restriction of the penetration depth of the dislocation net; formation of separate dislocation loops is observed in this case. Increase in the initial system temperature slightly raises the dislocation density inside the bombarded layer and considerably decreases the dislocation density inside the nanoparticle. The temperature increase also leads to a deeper penetration of the copper atoms inside the aluminum. Additional molecular dynamic simulations show that the deposited particles demonstrate a very good adhesion even in the case of the considered relatively large nanoparticles. Medium energy of the nanoparticles corresponding to velocity of about 500 m/s and elevated temperature of the system about 700-900 K are optimal parameters for production of high-quality layers of copper on the aluminum surface. These conditions provide both a good adhesion and a less degree of the plastic deformation. At the same time, higher impact velocities can be used for combined treatment consisting of both the plastic deformation and the coating.

Superhydrophobic copper surfaces fabricated by fatty acid soaps in aqueous solution for excellent corrosion resistance

Energy Technology Data Exchange (ETDEWEB)

Xu, Wenlong; Hu, Yuanyuan; Bao, Wenda; Xie, Xiaoyu; Liu, Yiran; Song, Aixin, E-mail: songaixin@sdu.edu.cn; Hao, Jingcheng

2017-03-31

Highlights: • The superhydrophobic property can be realized in a much quicker process (7.5 min) in aqueous solution than in ethanol. • The fabrication process of superhydrophobic metal surfaces greatly increases the safety in industrial manufacture in commercial scale. • The superhydrophobic copper surfaces show excellent corrosion resistance. - Abstract: A simple and safe one-step immersion method was developed to obtain the stable superhydrophobic copper surfaces with excellent corrosion resistance ability using fatty acids in water-medium instead of ethanol. An organic alkali, N,N-dimethylcyclohexylamine (DMCHA), was chosen to solve the poor solubility of fatty acids in water and the high Krafft point of carboxylate salts with inorganic counterions. The superhydrophobic property can be realized in a much quicker process (7.5 min) in aqueous solution than in ethanol (more than 2 d), which is universally feasible for the fabrication of superhydrophobic metal surfaces in industry scale, thereby greatly increasing the safety in industrial manufacture.

The deformation, oxidation and embrittlement of PWB fuel cladding in a loss-of-coolant accident

International Nuclear Information System (INIS)

Parsons, P.D.; Hindle, E.D.; Mann, C.A.

1986-09-01

The scope of this report is limited to the oxidation, embrittlement and deformation of PWB fuel in a loss of coolant accident in which the emergency core coolant systems operate in accordance with the design, ie accidents within the design basis of the plant. A brief description is given of the thermal hydraulic events during large and small breaks of the primary circuit, followed by the correct functioning and remedial action of the emergency core cooling systems. The possible damage to the fuel cladding during these events is also described. The basic process of oxidation of zircaloy-4 fuel cladding by steam, and the reaction kinetics of the oxidation are reviewed in detail. Variables having a possible influence on the oxidation kinetics are also considered. The embrittlement of zircaloy-4 cladding by oxidation is also reviewed in detail. It is related to fracture during the thermal shock of rewetting or by the ambient impact forces as a result of post-accident fuel handling. Criteria based both on total oxidation and on the detailed distribution of oxygen through the oxidised cladding wall are considered. The published computer codes for the calculation of oxygen concentration are reviewed in terms of the model employed and the limitations apparent in these models when calculating oxygen distribution in cladding in the actual conditions of a loss of coolant accident. The factors controlling the deformation and rupture of cladding in a loss of coolant accident are reviewed in detail. (author)

Extremely superhydrophobic surfaces with micro- and nanostructures fabricated by copper catalytic etching.

Science.gov (United States)

Lee, Jung-Pil; Choi, Sinho; Park, Soojin

2011-01-18

We demonstrate a simple method for the fabrication of rough silicon surfaces with micro- and nanostructures, which exhibited superhydrophobic behaviors. Hierarchically rough silicon surfaces were prepared by copper (Cu)-assisted chemical etching process where Cu nanoparticles having particle size of 10-30 nm were deposited on silicon surface, depending on the period of time of electroless Cu plating. Surface roughness was controlled by both the size of Cu nanoparticles and etching conditions. As-synthesized rough silicon surfaces showed water contact angles ranging from 93° to 149°. Moreover, the hierarchically rough silicon surfaces were chemically modified by spin-coating of a thin layer of Teflon precursor with low surface energy. And thus it exhibited nonsticky and enhanced hydrophobic properties with extremely high contact angle of nearly 180°.

Performance of Grass Filter Strip in Copper and Zinc Removal in Surface and Subsurface Runoff

Directory of Open Access Journals (Sweden)

Huo Weijie

2017-01-01

Full Text Available Three filter strips were conducted on self-designed soil bins. Taking a filter strip with no vegetation as contrast, the effectiveness of vegetation and soil conditions on heavy metals (including copper and zinc removal efficiencies were investigated by simulated runoff experiment. The results showed that the adsorbed state is the main existing form of heavy metal. For surface runoff, most of total copper and total zinc are trapped in first 4m and it is ineffective to increase the distance beyond 4m for removal. Vegetation has no significant effect on total copper and total zinc removal, while the soil with higher content of organic matter is contributing to total Zn interception. For subsurface runoff, the removal efficiencies of total copper and total zinc can reach to above 95.38% and both vegetation and soil conditions have no significant effects. Vegetation is contributing to copper ion and zinc ion removal significantly. Soil condition is only a significant factor to zinc ion, with higher content of organic matter as a contributing factor.

Surface characteristics, copper release, and toxicity of nano- and micrometer-sized copper and copper(II) oxide particles: a cross-disciplinary study.

OpenAIRE

Midander, Klara; Cronholm, Pontus; Karlsson, Hanna L.; Elihn, Karine; Moller, Lennart; Leygraf, Christofer; Wallinder, Inger Odnevall

2009-01-01

An interdisciplinary and multianalytical research effort is undertaken to assess the toxic aspects of thoroughly characterized nano- and micrometer-sized particles of oxidized metallic copper and copper(II) oxide in contact with cultivated lung cells, as well as copper release in relevant media. All particles, except micrometer-sized Cu, release more copper in serum-containing cell medium (supplemented Dulbecco's minimal essential medium) compared to identical exposures in phosphate-buffered ...

Target surface condition during reactive glow discharge sputtering of copper

International Nuclear Information System (INIS)

Depla, D; Haemers, J; Gryse, R De

2002-01-01

During reactive glow discharge sputtering of copper in an argon/nitrogen plasma, we noticed an abrupt change of the target voltage and the deposition rate when the nitrogen concentration in the plasma exceeds a critical value. To explain this behaviour, the target surface after reactive glow discharge sputtering was examined by x-ray photoelectron spectroscopy (XPS). An experimental arrangement was constructed that allows direct transfer of the glow discharge cathode to the XPS analysis chamber without air exposure. These XPS measurements revealed that several different chemical states of nitrogen are present in the layer that forms on the target surface. The relative concentration of these different states changes when the critical nitrogen concentration in the plasma is exceeded

Copper hexacyanoferrate formation on the modified silica surface with DAB-Am-16 dendrimer

International Nuclear Information System (INIS)

Carmo, Devaney R. do; Gabriel Junior, Suelino; Bicalho, Urquisa O.; Paim, Leonardo L.

2009-01-01

The dendrimer hexadecamine poly(propylene)imine (DAB-Am-16) of third generation (G-3) was anchored on the silica gel surface. The modified silica interact easily with Cu 2+ and then with hexacyanoferrate to form copper hexacyanoferrate. The modified silica was characterized by following techniques: nuclear magnetic resonance (NMR), infrared (FTIR), energy dispersive X-ray (EDX) and cyclic voltammetry. As application of the composite obtained, the modified silica containing copper hexacyanoferrate (CuHCFSD) was tested for a voltammetric determination of nitrite using a graphite paste modified electrode. The modified graphite paste electrode can be applied also to the determination of others biological substances with success. (author)

X-ray spectrum microanalysis of copper and stainless steel surface layer after electroerosion machining

International Nuclear Information System (INIS)

Abdukarimov, Eh.T.; Saidinov, S.Ya.

1989-01-01

The results of experimental investigations of the surface layer of copper and steel 12Kh18N10T after electroerrosion treatment by a rotating tungsten electrode in natural and distilled water are presented. It is established that the quantity of electrode material transferred to the surface of the steel treated grows with the spark discharge energy increase. Tungsten concentration in the surface layer reaches 5-10% with the average depth of penetration 40-50 μm

Re-examination of the threshold energy surface in copper

International Nuclear Information System (INIS)

King, W.E.; Benedek, R.; Merkle, K.L.; Meshii, M.

1981-01-01

Radiation-induced defect production in copper has been studied using in-situ electrical resistivity damage-rate measurements in the HVEM and molecular dynamics simulations. Analysis of the results yields a threshold energy surface characterized by two isolated pockets of low threshold energy centered at and surrounded by regions of much higher threshold energy; the corresponding damage function exhibits a plateau at 0.65 Frenkel pairs. A Frenkel pair resistivity of (2.75/sub -0.2/ + 0 6 ) x 10 - 4 Ω-cm is proposed. A model damage function is constructed and compared to results from ion irradiation damage-rate measurements. 7 figures

Construction of wettability gradient surface on copper substrate by controlled hydrolysis of poly(methyl methacrylate–butyl acrylate) films

Energy Technology Data Exchange (ETDEWEB)

Zhang, Yong, E-mail: Yong.Z@mail.scut.edu.cn [Guangzhou Panyu Polytechnic, Guangzhou 511483 (China); Cheng, Jiang; Yang, Zhuo-ru [School of Chemistry and Chemical Engineering, South China University of Technology, Guangzhou 510640 (China)

2014-10-01

We report a gradient wettability surface on copper slide prepared by a simple controlled ester group hydrolysis procedure of poly(methyl methacrylate–butyl acrylate) [P (MMA-BA)] films coated on the copper substrate. In the method, sodium hydroxide solutions are selected to prepare surface gradient wettability on P (MMA-BA) films. The P (MMA-BA) copolymers with different MMA contents are first synthesized by a conventional free atom radical solution polymerization method. The transfer of surface chemical composition from the ester group to acid salt is achieved by hydrolysis in NaOH solution. The effects of different concentrations of NaOH solution and reaction times on the physicochemical properties of the resulting surfaces are studied. The field-emission scanning electron microscopy (FESEM), atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS) results show that the varying concentration along the substrate length is only attributed to the hydrolysis reaction of ester groups. The hydrolysis causes insignificant change on the morphology of the original film on the copper substrate. In addition, it is found that the MMA copolymer content has a significant influence on the concentration of ester groups on the outermost surface and thus important for forming the slope gradients.

Native copper as a natural analogue for copper canisters

International Nuclear Information System (INIS)

Marcos, N.

1989-12-01

This paper discusses the occurrence of native copper as found in geological formations as a stability analogue of copper canisters that are planned to be used for the disposal of spent nuclear fuel in the Finnish bedrock. A summary of several publications on native copper occurrences is presented. The present geochemical and geohydrological conditions in which copper is met with in its metallic state show that metallic copper is stable in a wide range of temperatures. At low temperatures native copper is found to be stable where groundwater has moderate pH (about 7), low Eh (< +100 mV), and low total dissolved solids, especially chloride. Microscopical and microanalytical studies were carried out on a dozen of rock samples containing native copper. The results reveal that the metal shows no significant alteration. Only the surface of copper grains is locally coated. In the oldest samples there exist small corrosion cracks; the age of the oldest samples is over 1,000 million years. A review of several Finnish groundwater studies suggests that there are places in Finland where the geohydrological conditions are favourable for native copper stability. (orig.)

Corrosion of copper in oxygen-deficient groundwater with and without deep bedrock micro-organisms: Characterisation of microbial communities and surface processes

Energy Technology Data Exchange (ETDEWEB)

Huttunen-Saarivirta, E., E-mail: elina.huttunen-saarivirta@vtt.fi [VTT Technical Research Centre of Finland, Materials Performance, Kemistintie 3, FI-02044 VTT (Finland); Rajala, P. [VTT Technical Research Centre of Finland, Materials Performance, Kemistintie 3, FI-02044 VTT (Finland); Bomberg, M. [VTT Technical Research Centre of Finland, Geobiotechnology, Tietotie 2, FI-02044 VTT (Finland); Carpén, L. [VTT Technical Research Centre of Finland, Materials Performance, Kemistintie 3, FI-02044 VTT (Finland)

2017-02-28

Highlights: • Copper was exposed to groundwater with and without deep bedrock micro-organisms. • Biofilm composition was determined and correlated with the behaviour of copper. • Under biotic conditions, the film of Cu{sub 2}S formed on copper surfaces. • Bacterial pool was in a key role for the morphology and properties of Cu{sub 2}S film. • Under abiotic conditions, Cu{sub 2}O systematically developed on copper surfaces. - Abstract: Copper specimens were exposed to oxygen-deficient artificial groundwater in the presence and absence of micro-organisms enriched from the deep bedrock of the planned nuclear waste repository site at Olkiluoto island on the western coast of Finland. During the exposure periods of 4 and 10 months, the copper specimens were subjected to electrochemical measurements. The biofilm developed on the specimens and the water used in the exposures were subjected to microbiological analyses. Changes in the water chemistry were also determined and surfaces of the copper specimens were characterized with respect to the morphology and composition of the formed corrosion products. The results showed that under biotic conditions, redox of the water and open circuit potential (OCP) of the copper specimens were generally negative and resulted in the build-up of a copper sulphide, Cu{sub 2}S, layer due to the activity of sulphate-reducing bacteria (SRB) that were included in the system. In the 4-month test, the electrochemical behaviour of the specimens changed during the exposure and alphaproteobactria Rhizobiales were the dominant bacterial group in the biofilm where the highest corrosion rate was observed. In the 10-month test, however, deltaproteobacteria SRB flourished and the initial electrochemical behaviour and the low corrosion rate of the copper were retained until the end of the test period. Under abiotic conditions, the positive water redox potential and specimen OCP correlated with the formation of copper oxide, Cu{sub 2}O

Corrosion of copper in oxygen-deficient groundwater with and without deep bedrock micro-organisms: Characterisation of microbial communities and surface processes

International Nuclear Information System (INIS)

Huttunen-Saarivirta, E.; Rajala, P.; Bomberg, M.; Carpén, L.

2017-01-01

Highlights: • Copper was exposed to groundwater with and without deep bedrock micro-organisms. • Biofilm composition was determined and correlated with the behaviour of copper. • Under biotic conditions, the film of Cu_2S formed on copper surfaces. • Bacterial pool was in a key role for the morphology and properties of Cu_2S film. • Under abiotic conditions, Cu_2O systematically developed on copper surfaces. - Abstract: Copper specimens were exposed to oxygen-deficient artificial groundwater in the presence and absence of micro-organisms enriched from the deep bedrock of the planned nuclear waste repository site at Olkiluoto island on the western coast of Finland. During the exposure periods of 4 and 10 months, the copper specimens were subjected to electrochemical measurements. The biofilm developed on the specimens and the water used in the exposures were subjected to microbiological analyses. Changes in the water chemistry were also determined and surfaces of the copper specimens were characterized with respect to the morphology and composition of the formed corrosion products. The results showed that under biotic conditions, redox of the water and open circuit potential (OCP) of the copper specimens were generally negative and resulted in the build-up of a copper sulphide, Cu_2S, layer due to the activity of sulphate-reducing bacteria (SRB) that were included in the system. In the 4-month test, the electrochemical behaviour of the specimens changed during the exposure and alphaproteobactria Rhizobiales were the dominant bacterial group in the biofilm where the highest corrosion rate was observed. In the 10-month test, however, deltaproteobacteria SRB flourished and the initial electrochemical behaviour and the low corrosion rate of the copper were retained until the end of the test period. Under abiotic conditions, the positive water redox potential and specimen OCP correlated with the formation of copper oxide, Cu_2O. Furthermore, in the absence of

Anti-corrosion film formed on HAl77-2 copper alloy surface by aliphatic polyamine in 3 wt.% NaCl solution

Energy Technology Data Exchange (ETDEWEB)

Yu, Yinzhe; Yang, Dong; Zhang, Daquan, E-mail: zhdq@sh163.net; Wang, Yizhen; Gao, Lixin

2017-01-15

Highlights: • Properties of ADDD meet environment-friendly requirements. • ADDD’s inhibition efficiency is better than BTA at the low concentration. • ADDD adsorbs on the copper alloy surface by via the N atom in its amino group using flat mode. - Abstract: The corrosion inhibition of a polyamine compound, N-(4-amino-2, 3-dimethylbutyl)-2, 3-dimethylbutane-1, 4-diamine (ADDD), was investigated for HAl77-2 copper alloy in 3 wt.% NaCl solution. Electrochemical measurements, scanning electron microscopy (SEM), atomic force microscope (AFM) and Fourier transform infrared spectroscopy (FT-IR) techniques were employed for this research. The results show that ADDD strongly suppresses the corrosion of HAl77-2 alloy. The inhibition efficiency of ADDD is 98.6% at 0.5 mM, which is better than benzotriazole (BTAH) at the same concentration. Polarization curves indicate that ADDD is an anodic type inhibitor. Surface analysis suggests that a protective film is formed via the interaction of ADDD and copper. FT-IR reveals that the inhibition mechanism of ADDD is dominated by chemisorption onto the copper alloy surface to form an inhibition film. Furthermore, quantum chemical calculation and molecular dynamics (MD) simulations methods show that ADDD adsorbs on HAl77-2 surface via amino group in its molecule.

Photocatalytic disinfection of surfaces with copper doped Ti02 nanotube coatings illuminated by ceiling mounted fluorescent light

Science.gov (United States)

Koklic, Tilen; Pintarič, Štefan; Zdovc, Irena; Golob, Majda; Umek, Polona; Mehle, Alma; Dobeic, Martin; Štrancar, Janez

2018-01-01

High economic burden is associated with foodborne illnesses. Different disinfection methods are therefore employed in food processing industry; such as use of ultraviolet light or usage of surfaces with copper-containing alloys. However, all the disinfection methods currently in use have some shortcomings. In this work we show that copper doped TiO2 nanotubes deposited on existing surfaces and illuminated with ceiling mounted fluorescent lights can retard the growth of Listeria Innocua by 80% in seven hours of exposure to the fluorescent lights at different places in a food processing plant or in the laboratory conditions with daily reinocuation and washing. The disinfection properties of the surfaces seem to depend mainly on the temperature difference of the surface and the dew point, where for the maximum effectiveness the difference should be about 3 degrees celsius. The TiO2 nanotubes have a potential to be employed for an economical and continuous disinfection of surfaces. PMID:29768464

Calculation of the surface free energy of fcc copper nanoparticles

International Nuclear Information System (INIS)

Jia Ming; Lai Yanqing; Tian Zhongliang; Liu Yexiang

2009-01-01

Using molecular dynamics simulations with the modified analytic embedded-atom method we calculate the Gibbs free energy and surface free energy for fcc Cu bulk, and further obtain the Gibbs free energy of nanoparticles. Based on the Gibbs free energy of nanoparticles, we have investigated the heat capacity of copper nanoparticles. Calculation results indicate that the Gibbs free energy and the heat capacity of nanoparticles can be divided into two parts: bulk quantity and surface quantity. The molar heat capacity of the bulk sample is lower compared with the molar heat capacity of nanoparticles, and this difference increases with the decrease in the particle size. It is also observed that the size effect on the thermodynamic properties of Cu nanoparticles is not really significant until the particle is less than about 20 nm. It is the surface atoms that decide the size effect on the thermodynamic properties of nanoparticles

Morphological features of the copper surface layer under sliding with high density electric current

Energy Technology Data Exchange (ETDEWEB)

Fadin, V. V., E-mail: fvv@ispms.ru [Institute of Strength Physics and Materials Science SB RAS, Tomsk, 634055 (Russian Federation); Aleutdinova, M. I., E-mail: aleut@ispms.ru [Institute of Strength Physics and Materials Science SB RAS, Tomsk, 634055 (Russian Federation); Seversk Technological Institute, Branch of State Autonomous Educational Institution of Higher Professional Education “National Research Nuclear University “MEPhI”, Seversk, 636036 (Russian Federation); Rubtsov, V. Ye., E-mail: rvy@ispms.ru [Institute of Strength Physics and Materials Science SB RAS, Tomsk, 634055 (Russian Federation); National Research Tomsk Polytechnic University, Tomsk, 634050 (Russian Federation); Aleutdinova, V. A., E-mail: valery-aleut@yandex.ru [National Research St. Petersburg State Polytechnical University, St. Petersburg, 195251 (Russian Federation)

2015-10-27

Conductivity and wear intensity of copper under the influence of dry friction and electric current with contact density higher 100 A/cm{sup 2} are presented. It is shown that an increase in hardness and heat outflow from a friction zone leads to the reduction of wear intensity and current contact density increase corresponding to the beginning of catastrophic wear. Structural changes, such as the formation of FeO oxide and α-Fe particles in the copper surface layer, have also been found. It is observed that a worn surface is deformed according to a viscous liquid mechanism. Such singularity is explained in terms of appearance of high-excited atomic states in deforming micro-volumes near contact spots that lead to easy stress relaxation by local plastic shears in the vicinity of stress concentrators. In common this effect allows to achieve high wear resistance.

Environmental and risk screening for prioritizing pollution prevention opportunities in the U.S. printed wiring board manufacturing industry.

Science.gov (United States)

Lam, Carl W; Lim, Seong-Rin; Schoenung, Julie M

2011-05-15

Modern manufacturing of printed wiring boards (PWBs) involves extensive use of various hazardous chemicals in different manufacturing steps such as board preparation, circuit design transfer, etching and plating processes. Two complementary environmental screening methods developed by the U.S. EPA, namely: (i) the Tool for the Reduction and Assessment of Chemical and Other Environmental Impacts (TRACI) and (ii) Risk-Screening Environmental Indicators (RSEI), are used to quantify geographic and chemical environmental impacts in the U.S. PWB manufacturing industry based on Toxics Release Inventory (TRI) data. Although the release weight percentages of industrial chemicals such as methanol, glycol ethers and dimethylformamide comprise the larger fraction of reported air and water emissions, results indicate that lead, copper and their compounds' releases correspond to the highest environmental impact from toxicity potentials and risk-screening scores. Combining these results with further knowledge of PWB manufacturing, select alternative chemical processes and materials for pollution prevention are discussed. Examples of effective pollution prevention options in the PWB industry include spent etchant recovery technologies, and process and material substitutions. In addition, geographic assessment of environmental burden highlights states where promotion of pollution prevention strategies and emissions regulations can have the greatest effect to curb the PWB industry's toxic release impacts. Copyright © 2011 Elsevier B.V. All rights reserved.

Exposure of metallic copper surface on Cu-Al2O3-carbon catalysts

NARCIS (Netherlands)

Menon, P.G.; Prasad, J.

1970-01-01

The bifunctional nature of Cu---Al2O3-on-carbon catalysts, used in the direct catalytic conversion of ethanol to ethyl acetate, prompted an examination of the dispersion of Cu on the composite catalyst. For this, the N2O-method of Osinga et al. for estimation of bare metallic copper surface on

Direct measurement of the adsorption kinetics of 2-Mercaptobenzothiazole on a microcrystalline copper surface

Energy Technology Data Exchange (ETDEWEB)

Ramirez-Cano, J. A.; Veleva, L.

2016-05-01

The adsorption on copper of 2-Mercaptobenzothiazole (2-MBT), a heterocyclic compound member of the tiazole family, has been investigated at different concentrations (1x10{sup -}1 to 1x10{sup -}6 M) in water, employing the Electrochemical Quartz Crystal Microbalance (EQCM). The frequency response over time was obtained for each concentration, showing a defined exponential behavior at higher concentrations (1x10{sup -}1, 1x10{sup -}2 and 1x10{sup -}3 M), which was filed to the Langmuir adsorption isotherm with a good correlation coefficients (R{sup 2}=0.91 to 0.98) Surface coverage (θ) was calculated and found to be in the order of 0.50 to 0.01 for 2-MBT high concentrations. The free energy of adsorption was ΔG{sub a}ds=-5.59 kJ mol{sup -}1, corresponding to physisorption process, probably of electrostatic nature of the interaction between 2-MBT and copper surface in aqueous solution. (Author)

Evolution of surface topography in dependence on the grain orientation during surface thermal fatigue of polycrystalline copper

CERN Document Server

Aicheler, M; Taborelli, M; Calatroni, S; Neupert, H; Wuensch, W; Sgobba, S

2011-01-01

Surface degradation due to cyclic thermal loading plays a major role in the Accelerating Structures (AS) of the future Compact Linear Collider (CLIC) In this article results on surface degradation of thermally cycled polycrystalline copper as a function of the orientation of surface grains are presented Samples with different grain sizes were subjected to thermal fatigue using two different methods and were then characterized using roughness measurements and Orientation Imaging Scanning-Electron-Microscopy (OIM-SEM) Samples fatigued by a pulsed laser show the same trend in the orientation-fatigue damage accumulation as the sample fatigued by pulsed Radio-Frequency-heating (RF) it is clearly shown that 11 1 1] surface grains develop significantly more damage than the surface grains oriented in {[}100] and three reasons for this behaviour are pointed out Based on observations performed near grain boundaries their role in the crack initiation process is discussed The results are in good agreement with previous f...

Diffuse emission and control of copper in urban surface runoff.

Science.gov (United States)

Boller, M A; Steiner, M

2002-01-01

Copper washed off from roofs and roads is considered to be a major contribution to diffuse copper pollution of urban environments. In order to guarantee sustainable protection of soils and water, the long-term strategy is to avoid or replace copper containing materials on roofs and fagades. Until achievement of this goal, a special adsorber system is suggested to control the diffuse copper fluxes by retention of copper by a mixture of granulated iron-hydroxide (GEH) and calcium carbonate. Since future stormwater runoff concepts are based on decentralised runoff infiltration into the underground, solutions are proposed which provide for copper retention in infiltration sites using GEH adsorption layers. The example of a large copper façade of which the runoff is treated in an adsorption trench reveals the first full-scale data on façade runoff and adsorber performance. During the first year of investigation average façade runoff concentrations in the range of 1-10 mg Cu/l are reduced by 96-99% in the adsorption ditch.

High sensitive detection of copper II ions using D-penicillamine-coated gold nanorods based on localized surface plasmon resonance

Science.gov (United States)

Hong, Yoochan; Jo, Seongjae; Park, Joohyung; Park, Jinsung; Yang, Jaemoon

2018-05-01

In this paper, we describe the development of a nanoplasmonic biosensor based on the localized surface plasmon resonance (LSPR) effect that enables a sensitive and selective recognition of copper II ions. First, we fabricated the nanoplasmonics as LSPR substrates using gold nanorods (GNR) and the nano-adsorption method. The LSPR sensitivity of the nanoplasmonics was evaluated using various solvents with different refractive indexes. Subsequently, D-penicillamine (DPA)—a chelating agent of copper II ions—was conjugated to the surface of the GNR. The limit of detection (LOD) for the DPA-conjugated nanoplasmonics was 100 pM. Furthermore, selectivity tests were conducted using various divalent cations, and sensitivity tests were conducted on the nanoplasmonics under blood-like environments. Finally, the developed nanoplasmonic biosensor based on GNR shows great potential for the effective recognition of copper II ions, even in human blood conditions.

High-speed collision of copper nanoparticle with aluminum surface: Molecular dynamics simulation

Energy Technology Data Exchange (ETDEWEB)

Pogorelko, Victor V., E-mail: vik_ko83@mail.ru [Chelyabinsk State University, Bratiev Kashirinykh 129, 454001 Chelyabinsk (Russian Federation); South Ural State University (National Research University), Lenin Prospect 76, 454080 Chelyabinsk (Russian Federation); Mayer, Alexander E., E-mail: mayer@csu.ru [Chelyabinsk State University, Bratiev Kashirinykh 129, 454001 Chelyabinsk (Russian Federation); South Ural State University (National Research University), Lenin Prospect 76, 454080 Chelyabinsk (Russian Federation); Krasnikov, Vasiliy S., E-mail: vas.krasnikov@gmail.com [Chelyabinsk State University, Bratiev Kashirinykh 129, 454001 Chelyabinsk (Russian Federation); South Ural State University (National Research University), Lenin Prospect 76, 454080 Chelyabinsk (Russian Federation)

2016-12-30

Highlights: • High-speed nanoparticle impact induces shock waves and intensive plastic deformation. • Lattice orientation strongly influences on the deformation degree. • Plastic deformation goes through nucleation, growth and separation of semi-loops. • Medium impact energy and elevated temperature are optimal for high-quality coating. • High impact velocity and room temperature lead to plastic deformation and coating. - Abstract: We investigate the effect of the high-speed collision of copper nanoparticles with aluminum surface by means of molecular dynamic simulations. Studied diameter of nanoparticles is varied within the range 7.2–22 nm and the velocity of impact is equal to 500 or 1000 m/s. Dislocation analysis shows that a large quantity of dislocations is formed within the impact area. Overall length of dislocations is determined, first of all, by the impact velocity and by the size of incident copper nanoparticle, in other words, by the kinetic energy of the nanoparticle. Dislocations occupy the total volume of the impacted aluminum single crystal layer (40.5 nm in thickness) in the form of intertwined structure in the case of large kinetic energy of the incident nanoparticle. Decrease in the initial kinetic energy or increase in the layer thickness lead to restriction of the penetration depth of the dislocation net; formation of separate dislocation loops is observed in this case. Increase in the initial system temperature slightly raises the dislocation density inside the bombarded layer and considerably decreases the dislocation density inside the nanoparticle. The temperature increase also leads to a deeper penetration of the copper atoms inside the aluminum. Additional molecular dynamic simulations show that the deposited particles demonstrate a very good adhesion even in the case of the considered relatively large nanoparticles. Medium energy of the nanoparticles corresponding to velocity of about 500 m/s and elevated temperature of the

High-speed collision of copper nanoparticle with aluminum surface: Molecular dynamics simulation

International Nuclear Information System (INIS)

Pogorelko, Victor V.; Mayer, Alexander E.; Krasnikov, Vasiliy S.

2016-01-01

Highlights: • High-speed nanoparticle impact induces shock waves and intensive plastic deformation. • Lattice orientation strongly influences on the deformation degree. • Plastic deformation goes through nucleation, growth and separation of semi-loops. • Medium impact energy and elevated temperature are optimal for high-quality coating. • High impact velocity and room temperature lead to plastic deformation and coating. - Abstract: We investigate the effect of the high-speed collision of copper nanoparticles with aluminum surface by means of molecular dynamic simulations. Studied diameter of nanoparticles is varied within the range 7.2–22 nm and the velocity of impact is equal to 500 or 1000 m/s. Dislocation analysis shows that a large quantity of dislocations is formed within the impact area. Overall length of dislocations is determined, first of all, by the impact velocity and by the size of incident copper nanoparticle, in other words, by the kinetic energy of the nanoparticle. Dislocations occupy the total volume of the impacted aluminum single crystal layer (40.5 nm in thickness) in the form of intertwined structure in the case of large kinetic energy of the incident nanoparticle. Decrease in the initial kinetic energy or increase in the layer thickness lead to restriction of the penetration depth of the dislocation net; formation of separate dislocation loops is observed in this case. Increase in the initial system temperature slightly raises the dislocation density inside the bombarded layer and considerably decreases the dislocation density inside the nanoparticle. The temperature increase also leads to a deeper penetration of the copper atoms inside the aluminum. Additional molecular dynamic simulations show that the deposited particles demonstrate a very good adhesion even in the case of the considered relatively large nanoparticles. Medium energy of the nanoparticles corresponding to velocity of about 500 m/s and elevated temperature of the

Oxidation-assisted graphene heteroepitaxy on copper foil.

Science.gov (United States)

Reckinger, Nicolas; Tang, Xiaohui; Joucken, Frédéric; Lajaunie, Luc; Arenal, Raul; Dubois, Emmanuel; Hackens, Benoît; Henrard, Luc; Colomer, Jean-François

2016-11-10

We propose an innovative, easy-to-implement approach to synthesize aligned large-area single-crystalline graphene flakes by chemical vapor deposition on copper foil. This method doubly takes advantage of residual oxygen present in the gas phase. First, by slightly oxidizing the copper surface, we induce grain boundary pinning in copper and, in consequence, the freezing of the thermal recrystallization process. Subsequent reduction of copper under hydrogen suddenly unlocks the delayed reconstruction, favoring the growth of centimeter-sized copper (111) grains through the mechanism of abnormal grain growth. Second, the oxidation of the copper surface also drastically reduces the nucleation density of graphene. This oxidation/reduction sequence leads to the synthesis of aligned millimeter-sized monolayer graphene domains in epitaxial registry with copper (111). The as-grown graphene flakes are demonstrated to be both single-crystalline and of high quality.

Evolution of the Copper Surface in the Course of Oxidation by CCl4-L (L=THF, Dmf, Dmso): Scanning Probe Microscope Study

Science.gov (United States)

Panteleev, S. V.; Maslennikov, S. V.; Ignatov, S. K.; Spirina, I. V.; Kruglova, M. V.; Gribkov, B. A.; Vdovichev, S. N.

2013-04-01

The evolution of compact surface of the 100 nm copper film deposited on the glass-ceramics doped with vanadium coating in the course of the oxidation by the CCl4-L (L = dimethylformamide (DMF), tetrahydrofuran (THF), dimethylsulfoxide (DMSO), CCl4 concentration ≈ 1 mol/L) was studied by atomic force microscopy (AFM) in contact mode. The dynamics of active centers formation and destruction was investigated in the course of the oxidation process. The metallic sample dissolution rate was estimated as a function of the coordinating solvent nature. The development of the metal surface oxidation was established to lead to a significant increase of surface roughness. This phenomenon can be explained by the fact that different parts of the surface react at different rates. Further course of the reaction leads to a significant decrease of the surface roughness of copper films. The amount of the metal reacted has an almost linear dependence on the reaction time. AFM scans indicate that there is the same mechanism of the reaction between copper and carbon tetrachloride for all solvents.

Effects of copper amine treatments on mechanical, biological and surface/interphase properties of poly (vinyl chloride)/wood composites

Science.gov (United States)

Jiang, Haihong

2005-11-01

The copper ethanolamine (CuEA) complex was used as a wood surface modifier and a coupling agent for wood-PVC composites. Mechanical properties of composites, such as unnotched impact strength, flexural strength and flexural toughness, were significantly increased, and fungal decay weight loss was dramatically decreased by wood surface copper amine treatments. It is evident that copper amine was a very effective coupling agent and decay inhibitor for PVC/wood flour composites, especially in high wood flour loading level. A DSC study showed that the heat capacity differences (DeltaCp) of composites before and after PVC glass transition were reduced by adding wood particles. A DMA study revealed that the movements of PVC chain segments during glass transition were limited and obstructed by the presence of wood molecule chains. This restriction effect became stronger by increasing wood flour content and by using Cu-treated wood flour. Wood flour particles acted as "physical cross-linking points" inside the PVC matrix, resulting in the absence of the rubbery plateau of PVC and higher E', E'' above Tg, and smaller tan delta peaks. Enhanced mechanical performances were attributed to the improved wetting condition between PVC melts and wood surfaces, and the formation of a stronger interphase strengthened by chemical interactions between Cu-treated wood flour and the PVC matrix. Contact angles of PVC solution drops on Cu-treated wood surfaces were decreased dramatically compared to those on the untreated surfaces. Acid-base (polar), gammaAB, electron-acceptor (acid) (gamma +), electron-donor (base) (gamma-) surface energy components and the total surface energies increased after wood surface Cu-treatments, indicating a strong tendency toward acid-base or polar interactions. Improved interphase and interfacial adhesion were further confirmed by measuring interfacial shear strength between wood and the PVC matrix.

Copper wire bonding

CERN Document Server

Chauhan, Preeti S; Zhong, ZhaoWei; Pecht, Michael G

2014-01-01

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material.  However, copper wire bonding has several process and reliability concerns due to its material properties.  Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation.  In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed.  The book also discusses best practices and re...

Facile Fabrication of Durable Copper-Based Superhydrophobic Surfaces via Electrodeposition.

Science.gov (United States)

Jain, R; Pitchumani, R

2018-03-13

Superhydrophobic surfaces have myriad industrial applications, yet their practical utilization has been limited by their poor mechanical durability and longevity. We present a low-cost, facile process to develop superhydrophobic copper-based coatings via an electrodeposition route, that addresses this limitation. Through electrodeposition, a stable, multiscale, cauliflower shaped fractal morphology was obtained and upon modification by stearic acid, the prepared coatings show extreme water repellency with contact angle of 162 ± 2° and roll-off angle of about 3°. Systematic studies are presented on coatings fabricated under different processing conditions to demonstrate good durability, mechanical and underwater stability, corrosion resistance, and self-cleaning effect. The study also presents an approach for rejuvenation of slippery superhydrophobic nature (roll-off angle <10°) on the surfaces after long-term water immersion. The presented process can be scaled to larger, durable coatings with controllable wettability for diverse applications.

Role of copper oxides in contact killing of bacteria.

Science.gov (United States)

Hans, Michael; Erbe, Andreas; Mathews, Salima; Chen, Ying; Solioz, Marc; Mücklich, Frank

2013-12-31

The potential of metallic copper as an intrinsically antibacterial material is gaining increasing attention in the face of growing antibiotics resistance of bacteria. However, the mechanism of the so-called "contact killing" of bacteria by copper surfaces is poorly understood and requires further investigation. In particular, the influences of bacteria-metal interaction, media composition, and copper surface chemistry on contact killing are not fully understood. In this study, copper oxide formation on copper during standard antimicrobial testing was measured in situ by spectroscopic ellipsometry. In parallel, contact killing under these conditions was assessed with bacteria in phosphate buffered saline (PBS) or Tris-Cl. For comparison, defined Cu2O and CuO layers were thermally generated and characterized by grazing incidence X-ray diffraction. The antibacterial properties of these copper oxides were tested under the conditions used above. Finally, copper ion release was recorded for both buffer systems by inductively coupled plasma atomic absorption spectroscopy, and exposed copper samples were analyzed for topographical surface alterations. It was found that there was a fairly even growth of CuO under wet plating conditions, reaching 4-10 nm in 300 min, but no measurable Cu2O was formed during this time. CuO was found to significantly inhibit contact killing, compared to pure copper. In contrast, thermally generated Cu2O was essentially as effective in contact killing as pure copper. Copper ion release from the different surfaces roughly correlated with their antibacterial efficacy and was highest for pure copper, followed by Cu2O and CuO. Tris-Cl induced a 10-50-fold faster copper ion release compared to PBS. Since the Cu2O that primarily forms on copper under ambient conditions is as active in contact killing as pure copper, antimicrobial objects will retain their antimicrobial properties even after oxide formation.

The Hyrkkoelae native copper mineralization as a natural analogue for copper canisters

International Nuclear Information System (INIS)

Marcos, N.

1996-10-01

The Hyrkkoelae U-Cu mineralization is located in southwestern Finland, near the Palmottu analogue site. The age of the mineralization is estimated to be between 1.8 and 1.7 Ga. Petrological and mineralogical studies have demonstrated that this mineralization has many geological features that parallel those of the sites being considered for nuclear waste disposal in Finland. A particular feature is the existence of native copper and copper sulfides in open fractures in the near-surface zone. This allows us to study the native copper corrosion process in analogous conditions as expected to dominate in the nuclear fuel waste repository. The occurrence of uranyl compounds at these fractures permits also considerations about the sorption properties of the engineered barrier material (metallic copper) and its corrosion products. From the study of mineral assemblages or paragenesis, it appears that the formation of copper sulfide (djurleite, Cu 1.934 ) after native copper (Cu 0 ) under anoxic (reducing) conditions is enhanced by the availability of dissolved HS - in the groundwater circulating in open fractures in the near-surface zone. The minimum concentration of HS - in the groundwater is estimated to be of the order of 10 -5 M (∼ 10 -4 g/l) and the minimum pH value not lower than about 7.8 as indicated by the presence of calcite crystals in the same fracture. The present study is the first one that has been performed on findings of native copper in reducing, neutral to slightly alkaline groundwaters. Thus, the data obtained is of most relevance in improving models of anoxic corrosion of copper canisters. (orig.)

Crystallization of copper metaphosphate glass

Science.gov (United States)

Bae, Byeong-Soo; Weinberg, Michael C.

1993-01-01

The effect of the valence state of copper in copper metaphosphate glass on the crystallization behavior and glass transition temperature has been investigated. The crystallization of copper metaphosphate is initiated from the surface and its main crystalline phase is copper metaphosphate (Cu(PO)3),independent of the (Cu sup 2+)/(Cu(total)). However, the crystal morphology, the relative crystallization rates, and their temperature dependences are affected by the (Cu sup 2+)/(Cu (total)) ratio in the glass. On the other hand, the totally oxidized glass crystallizes from all over the surface. The relative crystallization rate of the reduced glass to the totally oxidized glass is large at low temperature, but small at high temperature. The glass transition temperature of the glass increases as the (Cu sup 2+)/(Cu(total)) ratio is raised. It is also found that the atmosphere used during heat treatment does not influence the crystallization of the reduced glass, except for the formation of a very thin CuO surface layer when heated in air.

Polystyrene films as barrier layers for corrosion protection of copper and copper alloys.

Science.gov (United States)

Románszki, Loránd; Datsenko, Iaryna; May, Zoltán; Telegdi, Judit; Nyikos, Lajos; Sand, Wolfgang

2014-06-01

Dip-coated polystyrene layers of sub-micrometre thickness (85-500nm) have been applied on copper and copper alloys (aluminium brass, copper-nickel 70/30), as well as on stainless steel 304, and produced an effective barrier against corrosion and adhesion of corrosion-relevant microorganisms. According to the dynamic wettability measurements, the coatings exhibited high advancing (103°), receding (79°) and equilibrium (87°) contact angles, low contact angle hysteresis (6°) and surface free energy (31mJ/m(2)). The corrosion rate of copper-nickel 70/30 alloy samples in 3.5% NaCl was as low as 3.2μm/a (44% of that of the uncoated samples), and in artificial seawater was only 0.9μm/a (29% of that of the uncoated samples). Cell adhesion was studied by fluorescence microscopy, using monoculture of Desulfovibrio alaskensis. The coatings not only decreased the corrosion rate but also markedly reduced the number of bacterial cells adhered to the coated surfaces. The PS coating on copper gave the best result, 2×10(3)cells/cm(2) (1% of that of the uncoated control). © 2013 Elsevier B.V. All rights reserved.

An important atomic process in the CVD growth of graphene: Sinking and up-floating of carbon atom on copper surface

International Nuclear Information System (INIS)

Li, Yingfeng; Li, Meicheng; Gu, TianSheng; Bai, Fan; Yu, Yue; Trevor, Mwenya; Yu, Yangxin

2013-01-01

By density functional theory (DFT) calculations, the early stages of the growth of graphene on copper (1 1 1) surface are investigated. At the very first time of graphene growth, the carbon atom sinks into subsurface. As more carbon atoms are adsorbed nearby the site, the sunken carbon atom will spontaneously form a dimer with one of the newly adsorbed carbon atoms, and the formed dimer will up-float on the top of the surface. We emphasize the role of the co-operative relaxation of the co-adsorbed carbon atoms in facilitating the sinking and up-floating of carbon atoms. In detail: when two carbon atoms are co-adsorbed, their co-operative relaxation will result in different carbon–copper interactions for the co-adsorbed carbon atoms. This difference facilitates the sinking of a single carbon atom into the subsurface. As a third carbon atom is co-adsorbed nearby, it draws the sunken carbon atom on top of the surface, forming a dimer. Co-operative relaxations of the surface involving all adsorbed carbon atoms and their copper neighbors facilitate these sinking and up-floating processes. This investigation is helpful for the deeper understanding of graphene synthesis and the choosing of optimal carbon sources or process.

High temperature oxidation of copper and copper aluminium alloys: Impact on furnace side wall cooling systems

Science.gov (United States)

Plascencia Barrera, Gabriel

The high temperature oxidation behaviours of copper and dilute Cu-Al alloys were investigated. Experiments were carried out by: (i) Oxidizing under various oxygen potentials at different temperatures using a combined TG-DTA apparatus. (ii) Oxidizing in a muffle furnace (in air) at different temperatures for extended periods of time. The oxidation mechanisms were evaluated based upon the kinetic data obtained as well as by X-ray diffraction and microscopical (SEM and optical) analyses. It was found that oxidation of copper strongly depends on the temperature. Two distinct mechanisms were encountered. Between 300 and 500°C, the oxidation rate is controlled by lateral growth of the oxide on the metal surface, whereas between 600 and 1000°C oxidation is controlled by lattice diffusion of copper ions through the oxide scale. On the other hand, the partial pressure of oxygen only has a small effect on the oxidation of copper. Alloy oxidation is also dependent on the temperature. As temperature increases, more aluminium is required to protect copper from being oxidized. It was shown that if the amount of oxygen that dissolves in the alloy exceeds the solubility limit of oxygen in copper, an internal oxidation layer will develop, leading to the formation of a tarnishing scale. On the other hand if the oxygen content in the alloy lies below the solubility limit of oxygen in copper, no oxidation products will form since a tight protective alumina layer will form on the alloy surface. Surface phenomena may affect the oxidation behaviour of dilute Cu-Al alloys. Immersion tests in molten copper matte and copper converting slag, using laboratory scale cooling elements with various copper based materials, were conducted. Results from these tests showed that alloying copper with 3 to 4 wt% Al decreases the oxidation rate of pure copper by 4 orders of magnitude; however due to a significant drop in thermal conductivity, the ability to extract heat is compromised, leading to

Copper circuit patterning on polymer using selective surface modification and electroless plating

Energy Technology Data Exchange (ETDEWEB)

Park, Sang Jin [Department of Materials Science and Engineering, Chungnam National University, Daejeon 305-764 (Korea, Republic of); Ko, Tae-Jun [Institute for Multidisciplinary Convergence of Materials, Korea Institute of Science and Technology, Seoul 130-650 (Korea, Republic of); Department of Materials Science and Engineering, Seoul National University, Seoul 151-742 (Korea, Republic of); Yoon, Juil [Department of Mechanical Systems Engineering, Hansung University, Seoul 136-792 (Korea, Republic of); Moon, Myoung-Woon [Institute for Multidisciplinary Convergence of Materials, Korea Institute of Science and Technology, Seoul 130-650 (Korea, Republic of); Oh, Kyu Hwan [Department of Materials Science and Engineering, Seoul National University, Seoul 151-742 (Korea, Republic of); Han, Jun Hyun, E-mail: jhhan@cnu.ac.kr [Department of Materials Science and Engineering, Chungnam National University, Daejeon 305-764 (Korea, Republic of)

2017-02-28

Highlights: • A new simple two step method for the pattering of Cu circuits on PET substrate was proposed. • The simple patterning of the high adhesive Cu circuits was achieved by plasma treatment using a patterned mask coated with a catalyst material. • The high adhesive strength of Cu circuits was due to the nanostructure formed by oxygen plasma treatment. - Abstract: We have examined a potential new and simple method for patterning a copper circuit on PET substrate by copper electroless plating, without the pretreatment steps (i.e., sensitization and activation) for electroless plating as well as the etching processes of conventional circuit patterning. A patterned mask coated with a catalyst material, Ag, for the reduction of Cu ions, is placed on a PET substrate. Subsequent oxygen plasma treatment of the PET substrate covered with the mask promotes the selective generation of anisotropic pillar- or hair-like nanostructures coated with co-deposited nanoparticles of the catalyst material on PET. After oxygen plasma treatment, a Cu circuit is well formed just by dipping the plasma-treated PET into a Cu electroless plating solution. By increasing the oxygen gas pressure in the chamber, the height of the nanostructures increases and the Ag catalyst particles are coated on not only the top but also the side surfaces of the nanostructures. Strong mechanical interlocking between the Cu circuit and PET substrate is produced by the large surface area of the nanostructures, and enhances peel strength. Results indicate this new simple two step (plasma surface modification and pretreatment-free electroless plating) method can be used to produce a flexible Cu circuit with good adhesion.

Colloidal and electrochemical aspects of copper-CMP

Science.gov (United States)

Sun, Yuxia

Copper based interconnects with low dielectric constant layers are currently used to increase interconnect densities and reduce interconnect time delays in integrated circuits. The technology used to develop copper interconnects involves Chemical Mechanical Planarization (CMP) of copper films deposited on low-k layers (silica or silica based films), which is carried out using slurries containing abrasive particles. One issue using such a structure is copper contamination over dielectric layers (SiO2 film), if not reduced, this contamination will cause current leakage. In this study, the conditions conducive to copper contamination onto SiO2 films during Cu-CMP process were studied, and a post-CMP cleaning technique was discussed based on experimental results. It was found that the adsorption of copper onto a silica surface is kinetically fast (electrocoagulation was investigated to remove both copper and abrasive slurry particles simultaneously. For effluent containing ˜40 ppm dissolved copper, it was found that ˜90% dissolved copper was removed from the waste streams through electroplating and in-situ chemical precipitation. The amount of copper removed through plating is impacted by membrane surface charge, type/amount of complexing agents, and solid content in the slurry suspension. The slurry particles can be removed ˜90% within 2 hours of EC through multiple mechanisms.

Effect of Copper and Iron Ions on the Sulphidizing Flotation of Copper Oxide in Copper Smelting Slag

Directory of Open Access Journals (Sweden)

Qing-qing Pan

2018-01-01

Full Text Available The treatment of smelting slag has attracted much attention nowadays. This study investigates the influence of Na2S, CuSO4, and FeCl3 on sulphidizing flotation of copper oxide. The results show that a proper Cu2+ concentration can increase the sulphidizing effect of copper oxide, while Fe3+ inhibits the sulphidizing effect. Further analysis shows that Cu2+ ions can reduce the surface potential, increase the S2− adsorption, then generate more polysulfide, and therefore promote the sulphidizing flotation. However, Fe3+ ions would increase the surface potential, reduce the S2− adsorption, generate more sulfur element, and therefore inhibit the sulphidizing flotation.

Modification of polycrystalline copper by proton irradiation

International Nuclear Information System (INIS)

Garcia S, F.; Cabral P, A.; Saniger B, J.M.; Banuelos, J.G.; Barragan V, A.

1997-01-01

Polished copper samples were irradiated with proton beams of 300 and 700 keV at room temperature and at -150 Centigrade. In this work the obtained results are reported when such copper irradiated samples are analysed with Sem, Tem, AFM. The Sem micrographs showed evident changes in surface of these copper samples, therefore an EDAX microanalysis was done for its characterization. additionally, the Tem micrographs showed heaps formation until 200 nm. Its electron diffraction spectra indicated that these heaps consist of a copper compound. Finally with AFM were observed changes in coloration of the irradiated sample surface, as well as changes in texture and rugosity of them. These results show in general that irradiation process with protons which is known as an innocuo process produces changes in the copper properties. (Author)

The surface topography of Inconel, stainless steel and copper after argon ion bombardment

International Nuclear Information System (INIS)

Vogelbruch, K.; Vietzke, E.

1983-01-01

Energetic particle bombardment of metals is known to change the surface topography. To simulate the behaviour of the first wall of a fusion device under real plasma conditions, we have investigated the surface topography of rotating targets after 30 keV argon ion bombardment at 70deg incident angle by electron scanning micrographs. Under these conditions Inconel 600, 601, 625, stainless steel, and copper showed no cones, pyramids or cliffs, but only etching figures and at higher ion doses relatively flat hills. Thus, it can be concluded, that the influence of energetic particles on the first wall of a fusion reactor is smaller than expected from the results of such sputtering experiments, which have dealt with the formation of surface structures under ion bombardment at constant incident direction. (author)

Microstructural characterization of copper corrosion in aqueous and soil environments

International Nuclear Information System (INIS)

Srivastava, A.; Balasubramaniam, R.

2005-01-01

Scanning electron microscopy has been used to investigate the surface films on pure copper after exposure to different aqueous and soil environments, containing chloride, sulfide and ammonium salts. The morphology of the films formed on copper surface in aqueous and soil environments was different for the same amount of pollutants. The surface films formed in soil environments were not homogenous in contrast to the films formed in aqueous environments. The damaging effect of chloride ions and the benign role of sulfide ions were revealed in both the environments. Local compositional analysis confirmed that the surface films formed on copper consisted predominantly of copper and oxygen

The role of surface preparation in corrosion protection of copper with nanometer-thick ALD alumina coatings

Energy Technology Data Exchange (ETDEWEB)

Mirhashemihaghighi, Shadi; Światowska, Jolanta [PSL Research University, CNRS – Chimie ParisTech, Institut de Recherche de Chimie Paris (IRCP), 11 rue Pierre et Marie Curie, 75005 Paris (France); Maurice, Vincent, E-mail: vincent.maurice@chimie-paristech.fr [PSL Research University, CNRS – Chimie ParisTech, Institut de Recherche de Chimie Paris (IRCP), 11 rue Pierre et Marie Curie, 75005 Paris (France); Seyeux, Antoine; Klein, Lorena H. [PSL Research University, CNRS – Chimie ParisTech, Institut de Recherche de Chimie Paris (IRCP), 11 rue Pierre et Marie Curie, 75005 Paris (France); Salmi, Emma; Ritala, Mikko [Laboratory of Inorganic Chemistry, Department of Chemistry, University of Helsinki, P.O. Box 55, FIN-00014 Helsinki (Finland); Marcus, Philippe [PSL Research University, CNRS – Chimie ParisTech, Institut de Recherche de Chimie Paris (IRCP), 11 rue Pierre et Marie Curie, 75005 Paris (France)

2016-11-30

Highlights: • 10–50 nm thick alumina coatings were grown on copper by atomic layer deposition. • Surface smoothening by substrate annealing was studied as pre-deposition treatment. • Corrosion protection is promoted by pre-treatment for 10 nm but not for thicker films. • Local adhesion failure is assigned to the stresses accumulated in the thicker films. • Surface smoothening decreases the interfacial strength bearing the film stresses. - Abstract: Surface smoothening by substrate annealing was studied as a pre-treatment for improving the corrosion protection provided to copper by 10, 20 and 50 nm thick alumina coatings deposited by atomic layer deposition. The interplay between substrate surface state and deposited film thickness for controlling the corrosion protection provided by ultrathin barrier films is demonstrated. Pre-annealing at 750 °C heals out the dispersed surface heterogeneities left by electropolishing and reduces the surface roughness to less than 2 nm independently of the deposited film thickness. For 10 nm coatings, substrate surface smoothening promotes the corrosion resistance. However, for 20 and 50 nm coatings, it is detrimental to the corrosion protection due to local detachment of the deposited films. The weaker adherence of the thicker coatings is assigned to the stresses accumulated in the films with increasing deposited thickness. Healing out the local heterogeneities on the substrate surface diminishes the interfacial strength that is bearing the stresses of the deposited films, thereby increasing adhesion failure for the thicker films. Pitting corrosion occurs at the local sites of adhesion failure. Intergranular corrosion occurs at the initially well coated substrate grain boundaries because of the growth of a more defective and permeable coating at grain boundaries.

Nucleation and growth of copper phthalocyanine aggregates deposited from solution on planar surfaces

Energy Technology Data Exchange (ETDEWEB)

Ghani, Fatemeh [Department of Theory & Bio-Systems, Max Planck Institute of Colloids and Interfaces, Am Mühlenberg 1 Golm, 14476 Potsdam (Germany); Gojzewski, Hubert, E-mail: hubert.gojzewski@put.poznan.pl [Department of Theory & Bio-Systems, Max Planck Institute of Colloids and Interfaces, Am Mühlenberg 1 Golm, 14476 Potsdam (Germany); Institute of Physics, Poznan University of Technology, Piotrowo 3, 60-965 Poznan (Poland); Riegler, Hans [Department of Theory & Bio-Systems, Max Planck Institute of Colloids and Interfaces, Am Mühlenberg 1 Golm, 14476 Potsdam (Germany)

2015-10-01

Graphical abstract: - Highlights: • Copper phthalocyanine deposited on planar surfaces by 3 solution process methods. • Aggregate morphology examined for coverage extending over 3 orders of magnitude. • Morphologies vary from small individual domains to mesh-like multilayers. • Nucleation and growth model explains the observed deposit morphologies. - Abstract: Copper phthalocyanine (CuPc) dissolved in trifluoroacetic acid (TFA) is deposited on solid SiO{sub 2} surfaces by solvent evaporation. The deposited CuPc aggregates are investigated by atomic force microscopy (AFM). The CuPc deposits were prepared by spin casting, dip coating, and spray deposition. Depending on the amount of deposited CuPc the aggregate morphology ranges from small individual domains to mesh-like multilayers. Each domain/layer consists of many parallel stacks of CuPc molecules with the square, plate-like molecules piled face-wise within each stack. The parallel stacks are attached sideways (i.e., edgewise attachment molecularly) to the substrate forming “nanoribbons” with uniform thickness of about 1 nm and varying width. The thickness reflects the length of a molecular edge, the width the number of stacks. A nucleation and growth model is presented that explains the observed aggregate and multilayer morphologies as result of the combination of nucleation, transport processes and a consequence of the anisotropic intermolecular interactions due to the shape of the CuPc molecule.

Effect of Copper and Iron Ions on the Sulphidizing Flotation of Copper Oxide in Copper Smelting Slag

OpenAIRE

Qing-qing Pan; Hui-qing Peng

2018-01-01

The treatment of smelting slag has attracted much attention nowadays. This study investigates the influence of Na2S, CuSO4, and FeCl3 on sulphidizing flotation of copper oxide. The results show that a proper Cu2+ concentration can increase the sulphidizing effect of copper oxide, while Fe3+ inhibits the sulphidizing effect. Further analysis shows that Cu2+ ions can reduce the surface potential, increase the S2− adsorption, then generate more polysulfide, and therefore promote the sulphidizing...

Copper Tolerance and Biosorption of Saccharomyces cerevisiae during Alcoholic Fermentation

Science.gov (United States)

Liu, Ling-ling; Jia, Bo; Zhao, Fang; Huang, Wei-dong; Zhan, Ji-cheng

2015-01-01

At high levels, copper in grape mash can inhibit yeast activity and cause stuck fermentations. Wine yeast has limited tolerance of copper and can reduce copper levels in wine during fermentation. This study aimed to understand copper tolerance of wine yeast and establish the mechanism by which yeast decreases copper in the must during fermentation. Three strains of Saccharomyces cerevisiae (lab selected strain BH8 and industrial strains AWRI R2 and Freddo) and a simple model fermentation system containing 0 to 1.50 mM Cu2+ were used. ICP-AES determined Cu ion concentration in the must decreasing differently by strains and initial copper levels during fermentation. Fermentation performance was heavily inhibited under copper stress, paralleled a decrease in viable cell numbers. Strain BH8 showed higher copper-tolerance than strain AWRI R2 and higher adsorption than Freddo. Yeast cell surface depression and intracellular structure deformation after copper treatment were observed by scanning electron microscopy and transmission electron microscopy; electronic differential system detected higher surface Cu and no intracellular Cu on 1.50 mM copper treated yeast cells. It is most probably that surface adsorption dominated the biosorption process of Cu2+ for strain BH8, with saturation being accomplished in 24 h. This study demonstrated that Saccharomyces cerevisiae strain BH8 has good tolerance and adsorption of Cu, and reduces Cu2+ concentrations during fermentation in simple model system mainly through surface adsorption. The results indicate that the strain selected from China’s stress-tolerant wine grape is copper tolerant and can reduce copper in must when fermenting in a copper rich simple model system, and provided information for studies on mechanisms of heavy metal stress. PMID:26030864

Copper Tolerance and Biosorption of Saccharomyces cerevisiae during Alcoholic Fermentation.

Directory of Open Access Journals (Sweden)

Xiang-Yu Sun

Full Text Available At high levels, copper in grape mash can inhibit yeast activity and cause stuck fermentations. Wine yeast has limited tolerance of copper and can reduce copper levels in wine during fermentation. This study aimed to understand copper tolerance of wine yeast and establish the mechanism by which yeast decreases copper in the must during fermentation. Three strains of Saccharomyces cerevisiae (lab selected strain BH8 and industrial strains AWRI R2 and Freddo and a simple model fermentation system containing 0 to 1.50 mM Cu2+ were used. ICP-AES determined Cu ion concentration in the must decreasing differently by strains and initial copper levels during fermentation. Fermentation performance was heavily inhibited under copper stress, paralleled a decrease in viable cell numbers. Strain BH8 showed higher copper-tolerance than strain AWRI R2 and higher adsorption than Freddo. Yeast cell surface depression and intracellular structure deformation after copper treatment were observed by scanning electron microscopy and transmission electron microscopy; electronic differential system detected higher surface Cu and no intracellular Cu on 1.50 mM copper treated yeast cells. It is most probably that surface adsorption dominated the biosorption process of Cu2+ for strain BH8, with saturation being accomplished in 24 h. This study demonstrated that Saccharomyces cerevisiae strain BH8 has good tolerance and adsorption of Cu, and reduces Cu2+ concentrations during fermentation in simple model system mainly through surface adsorption. The results indicate that the strain selected from China's stress-tolerant wine grape is copper tolerant and can reduce copper in must when fermenting in a copper rich simple model system, and provided information for studies on mechanisms of heavy metal stress.

Oxidation-assisted graphene heteroepitaxy on copper foil

OpenAIRE

Reckinger, Nicolas; Tang, Xiaohui; Joucken, Frédéric; Lajaunie, Luc; Arenal, Raul; Dubois, Emmanuel; Hackens, Benoît; Henrard, Luc; Colomer, Jean-François

2016-01-01

We propose an innovative, easy-to-implement approach to synthesize large-area singlecrystalline graphene sheets by chemical vapor deposition on copper foil. This method doubly takes advantage of residual oxygen present in the gas phase. First, by slightly oxidizing the copper surface, we induce grain boundary pinning in copper and, in consequence, the freezing of the thermal recrystallization process. Subsequent reduction of copper under hydrogen suddenly unlocks the delayed reconstruction, f...

Genotoxicity of copper oxide nanoparticles with different surface chemistry on rat bone marrow mesenchymal stem cells

DEFF Research Database (Denmark)

Zhang, Wenjing; Jiang, Pengfei; Chen, Wei

2016-01-01

The surface chemistry of nanoparticles (NPs) is one of the critical factors determining their cellular responses. In this study, the cytotoxicity and genotoxicity of copper oxide (CuO) NPs with a similar size but different surface chemistry to rat bone marrow mesenchymal stem cells (MSCs) were......V and showed a similar tendency to form agglomerates with a size of ∼200 nm in cell culture environment. The cytotoxicity of CuO NPs to MSCs at various concentrations and incubation periods were firstly evaluated. The CuO NPs showed dose-dependent and time-dependent toxicity to MSCs, and their surface...

A Study of the Surface Quality of High Purity Copper after Heat Treatment

CERN Document Server

Aicheler, M; Atieh, S; Calatroni, S; Riddone, G; Lebet, S; Samoshkin, A

2011-01-01

Themanufacturing flow of accelerating structures for the compact linear collider, based on diamond-machined high purity copper components, include several thermal cycles (diffusion bonding, brazing of cooling circuits, baking in vacuum, etc.). The high temperature cycles may be carried out following different schedules and environments (vacuum, reducing hydrogen atmosphere, argon, etc.) and develop peculiar surface topographies which have been the object of extended observations. This study presents and discusses the results of scanning electron microscopy (SEM) and optical microscopy investigations.

A novel compound cleaning solution for benzotriazole removal after copper CMP

International Nuclear Information System (INIS)

Gu Zhangbing; Liu Yuling; Gao Baohong; Wang Chenwei; Deng Haiwen

2015-01-01

After the chemical mechanical planarization (CMP) process, the copper surface is contaminated by a mass of particles (e.g. silica) and organic residues (e.g. benzotriazole), which could do great harm to the integrated circuit, so post-CMP cleaning is essential. In particular, benzotriazole (BTA) forms a layer of Cu-BTA film with copper on the surface, which leads to a hydrophobic surface of copper. So an effective cleaning solution is needed to remove BTA from the copper surface. In this work, a new compound cleaning solution is designed to solve two major problems caused by BTA: one is removing BTA and the other is copper surface corrosion that is caused by the cleaning solution. The cleaning solution is formed of alkaline chelating agent (FA/O II type), which is used to remove BTA, and a surfactant (FA/O I type), which is used as a corrosion inhibitor. BTA removal is characterized by contact angle measurements and electrochemical techniques. The inhibiting corrosion ability of the surfactant is also characterized by electrochemical techniques. The proposed compound cleaning solution shows advantages in removing BTA without corroding the copper surface. (paper)

Active screen cage pulsed dc discharge for implanting copper in polytetrafluoroethylene (PTFE)

Science.gov (United States)

Zaka-ul-Islam, Mujahid; Naeem, Muhammad; Shafiq, Muhammad; Sitara; Jabbar Al-Rajab, Abdul; Zakaullah, Muhammad

2017-07-01

Polymers such as polytetrafluoroethylene (PTFE) are widely used in artificial organs where long-term anti-bacterial properties are required to avoid bacterial proliferation. Copper or silver ion implantation on the polymer surface is known as a viable method to generate long-term anti-bacterial properties. Here, we have tested pulsed DC plasma with copper cathodic cage for the PTFE surface treatment. The surface analysis of the treated specimens suggests that the surface, structural properties, crystallinity and chemical structure of the PTFE have been changed, after the plasma treatment. The copper release tests show that copper ions are released from the polymer at a slow rate and quantity of the released copper increases with the plasma treatment time.

Model of thermal fatigue of a copper surface under the action of high-power microwaves

Science.gov (United States)

Kuzikov, S. V.; Plotkin, M. E.

2007-10-01

The accelerating structures of modern supercolliders, as well as the components of high-power microwave electron devices operated in strong cyclic electromagnetic fields should have long lifetimes. Along with the electric breakdown, the surfaces of these microwave components deteriorate and their lifetimes decrease due to thermal strains and subsequent mechanical loads on the surface metal layer. The elementary theory of thermal fatigue was developed in the 1970s. In particular, a model of metal as a continuous medium was considered. Within the framework of this model, thermal fatigue is caused by the strains arising between the hot surface layer and the cold internal layer of the metal. However, this theory does not describe all the currently available experimental data. In particular, the notion of “safe temperature” of the heating, i.e., temperature at which the surface is not destroyed during an arbitrarily long series of pulses, which was proposed in the theoretical model, is in poor agreement with the experiment performed in the Stanford Linear Accelerator Center (SLAC, USA). In this work, the thermal-fatigue theory is developed on the basis of consideration of the copper polycrystalline structure. The necessity to take it into account was demonstrated by the results of the SLAC experiment, in which a change in the mutual orientation of copper grains and the formation of cracks at their boundaries was recorded for the first time. The developed theory makes it possible to use the experimental data to refine the coefficients in the obtained formulas for the lifetime of the metal surface and to predict the number of microwave pulses before its destruction as a function of the radiation power, the surface-temperature increase at the pulse peak, and the pulse duration.

Efficient electron-induced removal of oxalate ions and formation of copper nanoparticles from copper(II oxalate precursor layers

Directory of Open Access Journals (Sweden)

Kai Rückriem

2016-06-01

Full Text Available Copper(II oxalate grown on carboxy-terminated self-assembled monolayers (SAM using a step-by-step approach was used as precursor for the electron-induced synthesis of surface-supported copper nanoparticles. The precursor material was deposited by dipping the surfaces alternately in ethanolic solutions of copper(II acetate and oxalic acid with intermediate thorough rinsing steps. The deposition of copper(II oxalate and the efficient electron-induced removal of the oxalate ions was monitored by reflection absorption infrared spectroscopy (RAIRS. Helium ion microscopy (HIM reveals the formation of spherical nanoparticles with well-defined size and X-ray photoelectron spectroscopy (XPS confirms their metallic nature. Continued irradiation after depletion of oxalate does not lead to further particle growth giving evidence that nanoparticle formation is primarily controlled by the available amount of precursor.

Copper alloys deterioration due to anthropogenic action

Energy Technology Data Exchange (ETDEWEB)

Duran, A.; Perez-Rodriguez, J. L.; Herrera, L. K.; Jimenez-de-Haro, M. C.; Robador, M. D.; Justo, A.; Blanes, J. M.; Perez-Ferrer, J. C.

2008-07-01

Results are presented from several samples taken from leaves of the Pardon Portico of Mosque-Cathedral or Cordoba, where an alteration on their surface was detected. Metal samples analyzed using X-ray microanalysis and powder x-ray diffraction were predominantly constituted by copper with some amounts of zinc attributed to brass, whereas other samples were also constituted by copper, tin and lead attributed to bronze. surface samples were analyzed using the same techniques. In addition Fourier transform infrared spectroscopy was also used. The main compound identified in all the surface of the leaves is copper chloride hydroxide (atacamite). Lead chlorides have also been found. These data show that the sudden alteration that appears may be attributed to the use of some cleaning product containing chloride. Other compounds detected in the surface were gypsum, quartz and oxalates coming from environmental contamination. (Author) 17 refs.

As-grown graphene/copper nanoparticles hybrid nanostructures for enhanced intensity and stability of surface plasmon resonance

Science.gov (United States)

Li, Yun-Fei; Dong, Feng-Xi; Chen, Yang; Zhang, Xu-Lin; Wang, Lei; Bi, Yan-Gang; Tian, Zhen-Nan; Liu, Yue-Feng; Feng, Jing; Sun, Hong-Bo

2016-11-01

The transfer-free fabrication of the high quality graphene on the metallic nanostructures, which is highly desirable for device applications, remains a challenge. Here, we develop the transfer-free method by direct chemical vapor deposition of the graphene layers on copper (Cu) nanoparticles (NPs) to realize the hybrid nanostructures. The graphene as-grown on the Cu NPs permits full electric contact and strong interactions, which results in a strong localization of the field at the graphene/copper interface. An enhanced intensity of the localized surface plasmon resonances (LSPRs) supported by the hybrid nanostructures can be obtained, which induces a much enhanced fluorescent intensity from the dye coated hybrid nanostructures. Moreover, the graphene sheets covering completely and uniformly on the Cu NPs act as a passivation layer to protect the underlying metal surface from air oxidation. As a result, the stability of the LSPRs for the hybrid nanostructures is much enhanced compared to that of the bare Cu NPs. The transfer-free hybrid nanostructures with enhanced intensity and stability of the LSPRs will enable their much broader applications in photonics and optoelectronics.

Study of the surface resistance of niobium sputter-coated copper cavities

CERN Document Server

Benvenuti, Cristoforo; Campisi, I E; Darriulat, Pierre; Peck, M A; Russo, R; Valente, A M

1999-01-01

A systematic study of the superconducting properties of niobium films deposited on the inner wall of copper radiofrequency cavities is presented. Films are grown by sputtering with different discharge gases (Xe, Kr, Ar and Ar/Ne mixtures) on substrates prepared under different conditions. The measured quantities include the surface resistance at 1.5 GHz, the critical temperature and the penetration depth. The surface resistance is analyzed in terms of its dependence on temperature, RF field and the density of trapped fluxons. Once allowance for electron scattering is made by means of a single mean free path parameter, good agreement with BCS theory is observed. The residual resistance is observed to be essentially noncorrelated with the superconducting properties, although influenced by specific coating conditions. On occasions, very low residual resistances, in the nano-ohm range, have been maintained over a broad range of RF field, indicating the absence of fundamental limitations specific to the film techn...

Superhydrophobic properties induced by sol-gel routes on copper surfaces

Science.gov (United States)

Raimondo, M.; Veronesi, F.; Boveri, G.; Guarini, G.; Motta, A.; Zanoni, R.

2017-11-01

Superhydrophobic surfaces are attracting increasing attention in different fields such as energy, transportation, building industry and electronics, as they exhibit many interesting properties such as high water repellence, anti-fogging, anti-corrosion, anti-fouling and self-cleaning abilities. Here, superhydrophobic nanostructured hybrid materials obtained by depositing alumina nanoparticles on copper surfaces via dip coating in Al2O3 sol are presented. Two different preparation routes were explored, based on either an alcoholic or an aqueous Al2O3 sol, and the resulting wetting properties were compared. Wettability measurements showed that when the alcoholic sol is used superhydrophobicity is attained, with values of water contact angle very close to the upper limit of 180°, while highly hydrophobic coatings are obtained with the aqueous sol. These findings were further supported by electron microscopy and X-ray photoelectron spectroscopy, which revealed that the surface layer deposited on Cu is more homogenous and richer in alumina nanoparticles when the alcoholic sol was used. Durability of the superhydrophobic coating was assessed by performing ageing tests in chemically aggressive environments. A remarkable resistance is displayed by the superhydrophobic coating in acid environment, while alkaline conditions severely affect its properties. Such behaviors were investigated by XPS and FE-SEM measurements, which disclosed the nature of the surface reactions under the different conditions tested. The present results underline that a thorough investigation of surface morphology, chemical composition and wetting properties reveals their strongly connection and helps optimizing the combination of substrate nanostructuring and suitable chemical coating for an improved durability in different aggressive environments.

An experimental study of the composite CNT/copper coating

Science.gov (United States)

Panarin, Valentin Ye.; Svavil‧nyi, Nikolai Ye.; Khominich, Anastasiya I.

2018-03-01

This paper presents experimental results on the preparation and investigation of the carbon nanotubes-copper composite material. Carbon nanotubes (CNTs) were synthesized on silicon substrates by the chemical vapor deposition (CVD) method and then filled with copper by evaporation from a melting pot in a vacuum. Copper evenly covered both the surface of the entangled tubes and the free substrate surface between the tubes. To improve the adhesion of tubes and matrix material, a carbon substructure was grown on the surface of tubes by adding working gas plasma to the CNT synthesis area. It is proposed to use a copper coating as a diffusion barrier upon subsequent filling of the reinforcing CNT frame by a carbide-forming materials matrix with predetermined physico-mechanical and tribological properties.

Transpassive Dissolution of Copper and Rapid Formation of Brilliant Colored Copper Oxide Films

Science.gov (United States)

Fredj, Narjes; Burleigh, T. David; New Mexico Tech Team

2014-03-01

This investigation describes an electrochemical technique for growing adhesive copper oxide films on copper with attractive colors ranging from gold-brown to pearl with intermediate colors from red violet to gold green. The technique consists of anodically dissolving copper at transpassive potentials in hot sodium hydroxide, and then depositing brilliant color films of Cu2O onto the surface of copper after the anodic potential has been turned off. The color of the copper oxide film depends on the temperature, the anodic potential, the time t1 of polarization, and the time t2, which is the time of immersion after potential has been turned off. The brilliant colored films were characterized using glancing angle x-ray diffraction, and the film was found to be primarily Cu2O. Cyclic voltammetry, chronopotentiometry, scanning electron microscopy, and x-ray photoelectron spectroscopy were also used to characterize these films.

Functional recovery of biofilm bacterial communities after copper exposure

International Nuclear Information System (INIS)

Boivin, Marie-Elene Y.; Massieux, Boris; Breure, Anton M.; Greve, Gerdit D.; Rutgers, Michiel; Admiraal, Wim

2006-01-01

Potential of bacterial communities in biofilms to recover after copper exposure was investigated. Biofilms grown outdoor in shallow water on glass dishes were exposed in the laboratory to 0.6, 2.1, 6.8 μmol/l copper amended surface water and a reference and subsequently to un-amended surface water. Transitions of bacterial communities were characterised with denaturing gradient gel electrophoresis (DGGE) and community-level physiological profiles (CLPP). Exposure to 6.8 μmol/l copper provoked distinct changes in DGGE profiles of bacterial consortia, which did not reverse upon copper depuration. Exposure to 2.1 and 6.8 μmol/l copper was found to induce marked changes in CLPP of bacterial communities that proved to be reversible during copper depuration. Furthermore, copper exposure induced the development of copper-tolerance, which was partially lost during depuration. It is concluded that bacterial communities exposed to copper contaminated water for a period of 26 days are capable to restore their metabolic attributes after introduction of unpolluted water in aquaria for 28 days. - Genetically different bacterial communities can have similar functions and tolerance to copper

Modification of surface layers of copper under the action of the volumetric discharge initiated by an avalanche electron beam in nitrogen and CO2 at atmospheric pressure

Science.gov (United States)

Shulepov, M. A.; Akhmadeev, Yu. Kh.; Tarasenko, V. F.; Kolubaeva, Yu. A.; Krysina, O. V.; Kostyrya, I. D.

2011-05-01

The results of experimental investigations of the action of the volumetric discharge initiated by an avalanche electron beam on the surface of copper specimens are presented. The volumetric (diffuse) discharge in nitrogen and CO2 at atmospheric pressure was initiated by applying high voltage pulses of nanosecond duration to a tubular foil cathode. It has been found that the treatment of a copper surface by this type of discharge increases the hardness of the surface layer due to oxidation.

Influence of nano-size inclusions on spall fracture of copper single crystals

International Nuclear Information System (INIS)

Razorenov, S. V.; Ivanchihina, G. E.; Kanel, G. I.; Herrmann, B.; Zaretsky, E. B.

2007-01-01

Spall experiments have been carried out for copper in different structural states. The samples were copper single crystals, crystals of Cu+0.1% Si, copper crystals with silica particles of 180 nm average size, and polycrystalline copper. In experiments, the free surface velocity histories were recorded with the VISAR. The recovered samples were studied using optical microscopy and SEM. Solid solution Cu+0.1% Si demonstrates slower spall process than pure copper crystals. At longer pulse durations its spall strength is slightly less than that of pure crystals but approaches the latter with decreasing pulse duration. Fracture of copper with silica inclusions is completed much faster. The spall strength of this material is close to that of Cu+0.1% Si crystals at longer pulse duration and approaches the strength of polycrystalline copper with decreasing the load duration. Fractography of the spall surfaces correlates with the free surface velocity histories. The main fracture surface of the Cu+0.1% Si grains consists of net of dimples ∼4 μm to 40 μm mean diameter. The fracture surfaces of copper with silica inclusions is covered by a net of dimples of 1 μm to 5 μm size

Characterization of boron carbide particulate reinforced in situ copper surface composites synthesized using friction stir processing

Energy Technology Data Exchange (ETDEWEB)

Sathiskumar, R., E-mail: sathiscit2011@gmail.com [Department of Mechanical Engineering, Coimbatore Institute of Technology, Coimbatore, 641 014 Tamil Nadu (India); Murugan, N., E-mail: murugan@cit.edu.in [Department of Mechanical Engineering, Coimbatore Institute of Technology, Coimbatore, 641 014 Tamil Nadu (India); Dinaharan, I., E-mail: dinaweld2009@gmail.com [Department of Mechanical Engineering, V V College of Engineering, Tisaiyanvilai, 627 657 Tamil Nadu (India); Vijay, S.J., E-mail: vijayjoseph@karunya.edu [Centre for Research in Metallurgy (CRM), School of Mechanical Sciences, Karunya University, Coimbatore, 641 114 Tamil Nadu (India)

2013-10-15

Friction stir processing has evolved as a novel solid state technique to fabricate surface composites. The objective of this work is to apply the friction stir processing technique to fabricate boron carbide particulate reinforced copper surface composites and investigate the effect of B{sub 4}C particles and its volume fraction on microstructure and sliding wear behavior of the same. A groove was prepared on 6 mm thick copper plates and packed with B{sub 4}C particles. The dimensions of the groove was varied to result in five different volume fractions of B{sub 4}C particles (0, 6, 12, 18 and 24 vol.%). A single pass friction stir processing was done using a tool rotational speed of 1000 rpm, travel speed of 40 mm/min and an axial force of 10 kN. Metallurgical characterization of the Cu/B{sub 4}C surface composites was carried out using optical microscope and scanning electron microscope. The sliding wear behavior was evaluated using a pin-on-disk apparatus. Results indicated that the B{sub 4}C particles significantly influenced the area, dispersion, grain size, microhardness and sliding wear behavior of the Cu/B{sub 4}C surface composites. When the volume fraction of B{sub 4}C was increased, the wear mode changed from microcutting to abrasive wear and wear debris was found to be finer. Highlights: • Fabrication of Cu/B{sub 4}C surface composite by friction stir processing • Analyzing the effect of B{sub 4}C particles on the properties of Cu/B4C surface composite • Increased volume fraction of B{sub 4}C particles reduced the area of surface composite. • Increased volume fraction of B{sub 4}C particles enhanced the microhardness and wear rate. • B{sub 4}C particles altered the wear mode from microcutting to abrasive.

Surface-plasmon resonance-enhanced multiphoton emission of high-brightness electron beams from a nanostructured copper cathode.

Science.gov (United States)

Li, R K; To, H; Andonian, G; Feng, J; Polyakov, A; Scoby, C M; Thompson, K; Wan, W; Padmore, H A; Musumeci, P

2013-02-15

We experimentally investigate surface-plasmon assisted photoemission to enhance the efficiency of metallic photocathodes for high-brightness electron sources. A nanohole array-based copper surface was designed to exhibit a plasmonic response at 800 nm, fabricated using the focused ion beam milling technique, optically characterized and tested as a photocathode in a high power radio frequency photoinjector. Because of the larger absorption and localization of the optical field intensity, the charge yield observed under ultrashort laser pulse illumination is increased by more than 100 times compared to a flat surface. We also present the first beam characterization results (intrinsic emittance and bunch length) from a nanostructured photocathode.

Recovery of Copper from Cyanidation Tailing by Flotation

Science.gov (United States)

Qiu, Tingsheng; Huang, Xiong; Yang, Xiuli

2016-02-01

In this work, sodium hypochlorite, hydrogen peroxide, sodium metabisulfite and copper sulfate as activators were investigated to lessen the depression effect of cyanide for deep-depressing chalcopyrite. The experimental results indicate that the copper recovery exceeded 94%, 84% and 97% at the dosage: sodium hypochlorite 3 mL/L, hydrogen peroxide 2 mL/L, sodium metabisulfite 2 × 10-3 mol/L and copper sulfate 1.67 × 10-4 mol/L, respectively. According to the results of zeta potential and Fourier transform infrared spectrum, it is suggested that chalcopyrite was depressed because of the chemical adsorption of cyanide on the chalcopyrite surfaces. Sodium hypochlorite, hydrogen peroxide and sodium metabisulfite can destroy Cu-C bond on the deep-depressing chalcopyrite surface by chemical reaction. Copper sulfate can activate deep-depressing chalcopyrite by copper ion adsorption.

Electrical Characterization of Spherical Copper Oxide Memristive Array Sensors

Science.gov (United States)

2014-03-27

47 4.2 A 47 µm flake reaching between two spheres . . . . . . . . . . . . . . . . . . 47 x Figure Page 4.3 The XRD pattern shows the copper spheres...image of the copper sphere surface and a zoomed view of emphasizing the flaking feature on the surface. These images depict just one sphere to...spheres. Placed next to one-another, a copper flake extending 47 µm such as that shown in Figure 4.1 can result in an electrical short, which may

Effect of glutamic acid on copper sorption onto kaolinite. Batch experiments and surface complexation modeling

Energy Technology Data Exchange (ETDEWEB)

Karimzadeh, Lotfallah; Barthen, Robert; Gruendig, Marion; Franke, Karsten; Lippmann-Pipke, Johanna [Helmholtz-Zentrum Dresden-Rossendorf e.V., Dresden (Germany). Reactive Transport; Stockmann, Madlen [Helmholtz-Zentrum Dresden-Rossendorf e.V., Dresden (Germany). Surface Processes

2017-06-01

In this work, we study the mobility behavior of Cu(II) under conditions related to an alternative, neutrophile biohydrometallurgical Cu(II) leaching approach. Sorption of copper onto kaolinite influenced by glutamic acid (Glu) was investigated in the presence of 0.01 M NaClO{sub 4} by means of binary and ternary batch adsorption measurements over a pH range of 4 to 9 and surface complexation modeling.

Effect of glutamic acid on copper sorption onto kaolinite. Batch experiments and surface complexation modeling

International Nuclear Information System (INIS)

Karimzadeh, Lotfallah; Barthen, Robert; Gruendig, Marion; Franke, Karsten; Lippmann-Pipke, Johanna; Stockmann, Madlen

2017-01-01

In this work, we study the mobility behavior of Cu(II) under conditions related to an alternative, neutrophile biohydrometallurgical Cu(II) leaching approach. Sorption of copper onto kaolinite influenced by glutamic acid (Glu) was investigated in the presence of 0.01 M NaClO_4 by means of binary and ternary batch adsorption measurements over a pH range of 4 to 9 and surface complexation modeling.

Adsorption behavior of caffeine as a green corrosion inhibitor for copper

International Nuclear Information System (INIS)

Souza, Fernando Sílvio de; Giacomelli, Cristiano; Gonçalves, Reinaldo Simões; Spinelli, Almir

2012-01-01

Electrochemical and impedance experiments were carried out to evaluate the corrosion behavior of copper in aerated 0.1 mol L −1 H 2 SO 4 solutions in the presence of three xanthine derivatives with similar chemical structures. The corrosion rate of copper was found to increase in the presence of theophylline and theobromine and decrease in the presence of caffeine. The adsorption and inhibitory effect of caffeine on copper surfaces in aerated 0.1 mol L −1 H 2 SO 4 solutions were then investigated in detail by potentiodynamic polarization, electrochemical impedance spectroscopy (EIS), contact angle measurements, scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS) and fluorescence experiments. The data obtained indicate that caffeine behaves as a cathodic-type inhibitor adsorbing onto the copper surface according to the Temkin isotherm, with the negative ∆G° ads value of − 31.1 kJ mol −1 signifying a spontaneous adsorption process. The corrosion inhibition efficiency increased with caffeine concentration in the range of 1.0–10.0 mmol L −1 . Furthermore, the EIS results obtained at the open-circuit potential and surface analysis (SEM, EDS and fluorescence) clearly demonstrated the adsorption of the organic compound onto the copper electrode. The contact angle measurements revealed the formation of a hydrophobic protective film. This film covers up to 72% of the total active surface, acts as a protective barrier and prevents interaction between the metal, water and oxygen molecules. - Highlights: ► We have investigated the adsorption and corrosion inhibition of caffeine on copper surfaces. ► Caffeine behaves as a cathodic-type inhibitor. ► Caffeine adsorbs onto copper surface according to Temkin isotherm. ► There exists the formation of a hydrophobic film that acts as a protective barrier. ► This corrosion inhibitor covers up to 72% of the total active surface of copper.

Albumin has no role in the uptake of copper by human fibroblasts

International Nuclear Information System (INIS)

McArdle, H.J.; Guthrie, J.R.; Ackland, M.L.; Danks, D.M.

1987-01-01

The mechanism of copper uptake by cells has been the subject of controversy for some time. This paper examines the possibility of a role for albumin in the uptake of copper by fibroblasts. Although the cells could accumulate copper from a copper-albumin complex, there was no evidence for either copper-albumin or albumin receptors on the cell surface. The possibility of a surface exchange mechanism for copper was examined. While copper uptake showed saturation with increasing concentrations of labelled copper-albumin, adding unlabelled copper to the incubation medium did not inhibit uptake. Adding albumin or histidine to the copper-albumin complex resulted in an inhibition of copper uptake. The results can only be explained by the cell taking up free copper from the incubation medium, with the albumin then releasing its copper to maintain the equilibrium between free and bound metal. Since, in vivo there is essentially no free copper in serum, it is concluded that albumin is most unlikely to play a role in the uptake of copper by fibroblasts

Voltammetry and Electrocatalysis of Achrornobacter Xylosoxidans Copper Nitrite Reductase on Functionalized Au(111)-Electrode Surfaces

DEFF Research Database (Denmark)

Welinder, Anna C.; Zhang, Jingdong; Hansen, Allan G.

2007-01-01

A long-standing issue in protein film voltammetry (PFV), particularly electrocatalytic voltammetry of redox enzyme monolayers, is the variability of protein adsorption modes, reflected in distributions of catalytic activity of the adsorbed protein/enzyme molecules. Use of well-defined, atomically...... planar electrode surfaces is a step towards the resolution of this central issue. We report here the voltammetry of copper nitrite reductase (CNiR, Achromobacter xylosoxidons) on Au(111)-electrode surfaces modified by monolayers of a broad variety of thiol-based linker molecules. These represent......NiR thus shows highly efficient, close to ideal reversible electrocatalytic voltammetry on cysteamine-covered Au(111)-electrode surfaces, most likely due to two cysteamine orientations previously disclosed by in situ scanning tunnelling microscopy. Such a dual orientation exposes both a hydrophobic...

Surface-Enhanced Resonance Raman Scattering and Visible Extinction Spectroscopy of Copper Chlorophyllin: An Upper Level Chemistry Experiment

Science.gov (United States)

Schnitzer, Cheryl S.; Reim, Candace Lawson; Sirois, John J.; House, Paul G.

2010-01-01

Advanced chemistry students are introduced to surface-enhanced resonance Raman scattering (SERRS) by studying how sodium copper chlorophyllin (CuChl) adsorbs onto silver colloids (CuChl/Ag) as a function of pH. Using both SERRS and visible extinction spectroscopy, the extent of CuChl adsorption and colloidal aggregation are monitored. Initially at…

Role of surface on the size-dependent mechanical properties of copper nanowire under tensile load: A molecular dynamics simulation

International Nuclear Information System (INIS)

Liu, Wei-Ting; Hsiao, Chun-I.; Hsu, Wen-Dung

2014-01-01

In this study we have used atomistic simulations to investigate the role of surface on the size-dependent mechanical properties of nanowires. In particular, we have performed computational investigation on single crystal face-centered cubic copper nano-wires with diameters ranging from 2 to 20 nm. The wire axis for all the nanowires are considered along the [0 0 1] direction. Characterization of the initial optimized structures revealed clear differences in interatomic spacing, stress, and potential energy in all the nanowires. The mechanical properties with respect to wire diameter are evaluated by applying tension along the [0 0 1] direction until yielding. We have discussed the stress–strain relationships, Young's modulus, and the variation in potential energy from surface to the center of the wire for all the cases. Our results indicate that the mechanical response (including yield strain, Young's modulus, and resilience) is directly related to the proportion of surface to bulk type atoms present in each nanowire. Thus the size-dependent mechanical properties of single crystal copper nanowire within elastic region are attributed to the surface to volume ratio (surface effect). Using the calculated response, we have formulated a mathematical relationship, which predicts the nonlinear correlation between the mechanical properties and the diameter of the wire.

Role of surface on the size-dependent mechanical properties of copper nanowire under tensile load: A molecular dynamics simulation

Energy Technology Data Exchange (ETDEWEB)

Liu, Wei-Ting [Department of Materials Science and Engineering, National Cheng Kung University, Tainan City 70101 Taiwan (China); Hsiao, Chun-I. [Department of Materials Science and Engineering, National Cheng Kung University, Tainan City 70101 Taiwan (China); Promotion Center for Global Materials Research, National Cheng Kung University, Tainan City 70101 Taiwan (China); Hsu, Wen-Dung, E-mail: wendung@mail.ncku.edu.tw [Department of Materials Science and Engineering, National Cheng Kung University, Tainan City 70101 Taiwan (China); Research Center for Energy Technology and Strategy, National Cheng Kung University, Tainan City 70101 Taiwan (China); Promotion Center for Global Materials Research, National Cheng Kung University, Tainan City 70101 Taiwan (China)

2014-01-15

In this study we have used atomistic simulations to investigate the role of surface on the size-dependent mechanical properties of nanowires. In particular, we have performed computational investigation on single crystal face-centered cubic copper nano-wires with diameters ranging from 2 to 20 nm. The wire axis for all the nanowires are considered along the [0 0 1] direction. Characterization of the initial optimized structures revealed clear differences in interatomic spacing, stress, and potential energy in all the nanowires. The mechanical properties with respect to wire diameter are evaluated by applying tension along the [0 0 1] direction until yielding. We have discussed the stress–strain relationships, Young's modulus, and the variation in potential energy from surface to the center of the wire for all the cases. Our results indicate that the mechanical response (including yield strain, Young's modulus, and resilience) is directly related to the proportion of surface to bulk type atoms present in each nanowire. Thus the size-dependent mechanical properties of single crystal copper nanowire within elastic region are attributed to the surface to volume ratio (surface effect). Using the calculated response, we have formulated a mathematical relationship, which predicts the nonlinear correlation between the mechanical properties and the diameter of the wire.

Local thermal property analysis by scanning thermal microscopy of an ultrafine-grained copper surface layer produced by surface mechanical attrition treatment

Energy Technology Data Exchange (ETDEWEB)

Guo, F.A. [Suzhou Institute for Nonferrous Metals Processing Technology, No. 200 Shenxu Road, Suzhou Industrial Park, Suzhou 215021 (China) and Unite de Thermique et d' Analyse Physique, Laboratoire d' Energetique et d' Optique, Universite de Reims, BP 1039, 51687 Reims Cedex 2 (France)]. E-mail: guofuan@yahoo.com; JI, Y.L. [Suzhou Institute for Nonferrous Metals Processing Technology, No. 200 Shenxu Road, Suzhou Industrial Park, Suzhou 215021 (China); Trannoy, N. [Unite de Thermique et d' Analyse Physique, Laboratoire d' Energetique et d' Optique, Universite de Reims, BP 1039, 51687 Reims Cedex 2 (France); Lu, J. [LASMIS, Universite de Technologie de Troyes, 12 Rue Marie Curie, Troyes 10010 (France)

2006-06-15

Scanning thermal microscopy (SThM) was used to map thermal conductivity images in an ultrafine-grained copper surface layer produced by surface mechanical attrition treatment (SMAT). It is found that the deformed surface layer shows different thermal conductivities that strongly depend on the grain size of the microstructure: the thermal conductivity of the nanostructured surface layer decreases obviously when compared with that of the coarse-grained matrix of the sample. The role of the grain boundaries in thermal conduction is analyzed in correlation with the heat conduction mechanism in pure metal. A theoretical approach, based on this investigation, was used to calculate the heat flow from the probe tip to the sample and then estimate the thermal conductivities at different scanning positions. Experimental results and theoretical calculation demonstrate that SThM can be used as a tool for the thermal property and microstructural analysis of ultrafine-grained microstructures.

Studies on Cementation of Tin on Copper and Tin Stripping from Copper Substrate

Directory of Open Access Journals (Sweden)

Rudnik E.

2016-06-01

Full Text Available Cementation of tin on copper in acid chloride-thiourea solutions leads to the formation of porous layers with a thickness dependent on the immersion time. The process occurs via Sn(II-Cu(I mechanism. Chemical stripping of tin was carried out in alkaline and acid solutions in the presence of oxidizing agents. It resulted in the dissolution of metallic tin, but refractory Cu3Sn phase remained on the copper surface. Electrochemical tin stripping allows complete tin removal from the copper substrate, but porosity and complex phase composition of the tin coating do not allow monitoring the process in unambiguous way.

Deposition and characterisation of copper for high density interconnects

International Nuclear Information System (INIS)

McCusker, N.

1999-09-01

Copper has been deposited by sputtering and investigated for application as high density interconnects, with a view to maximising its performance and reliability. A sputter deposition process using gettering has been developed, which produces consistently pure, low resistivity films. A relationship between film thickness and resistivity has been explained by studying the grain growth process in copper films using atomic force microscopy. The Maydas-Shatzkes model has been used to separate the contributions of grain boundary and surface scattering to thin film resistivity, in copper and gold. Stress and texture in copper film have been studied. Annealing has been used to promote grain growth and texture development. Electromigration has been studied in copper and aluminium interconnects using a multi-line accelerated test set-up. A difference in failure distributions and void morphologies has been explained by an entirely different damage mechanism. The importance of surface/interface migration in electromigration damage of copper lines has been established and explained using a grain boundary-grooving model. A tantalum overlayer was found to extend the lifetime of copper lines. A composite sputtering target has been used to deposit copper/zirconium alloy films. The composition of the alloys was studied by Rutherford backscattering, Auger and secondary neutral mass spectrometry. The alloy films had an improved electromigration lifetime. A surface controlled mechanism is proposed to explain the advantage. A metal oxide semiconductor (MOS) capacitor technique is used to investigate barrier reliability. Tungsten is shown to be an effective diffusion barrier for copper, up to 700 deg. C. (author)

Surface-Bound Intermediates in Low-Temperature Methanol Synthesis on Copper. Participants and Spectators

Energy Technology Data Exchange (ETDEWEB)

Yang, Yong; Mei, Donghai; Peden, Charles HF; Campbell, Charles T.; Mims, Charles A.

2015-11-03

The reactivity of surface adsorbed species present on copper catalysts during methanol synthesis at low temperatures was studied by simultaneous infrared spectroscopy (IR) and mass spectroscopy (MS) measurements during “titration” (transient surface reaction) experiments with isotopic tracing. The results show that adsorbed formate is a major bystander species present on the surface under steady-state methanol synthesis reaction conditions, but it cannot be converted to methanol by reaction with pure H₂, nor with H₂ plus added water. Formate-containing surface adlayers for these experiments were produced during steady state catalysis in (a) H₂:CO₂ (with substantial formate coverage) and (b) moist H₂:CO (with no IR visible formate species). Both these reaction conditions produce methanol at steady state with relatively high rates. Adlayers containing formate were also produced by (c) formic acid adsorption. Various "titration" gases were used to probe these adlayers at modest temperatures (T = 410-450K) and 6 bar total pressure. Methanol gas (up to ~1% monolayer equivalent) was produced in "titration" from the H₂:CO₂ catalytic adlayers by H₂ plus water, but not by dry hydrogen. The decay in the formate IR features accelerated in the presence of added water vapor. The H₂:CO:H₂O catalytic adlayer produced similar methanol titration yields in H₂ plus water but showed no surface formate features in IR (less than 0.2% monolayer coverage). Finally, formate from formic acid chemisorption produced no methanol under any titration conditions. Even under (H₂:CO₂) catalytic reaction conditions, isotope tracing showed that pre-adsorbed formate from formic acid did not contribute to the methanol produced. Although non-formate intermediates exist during low temperature methanol synthesis on copper which can be converted to methanol gas

Synthesis of carbon nanotubes and nanotube forests on copper catalyst

International Nuclear Information System (INIS)

Kruszka, Bartosz; Terzyk, Artur P; Wiśniewski, Marek; Gauden, Piotr A; Szybowicz, Mirosław

2014-01-01

The growth of carbon nanotubes on bulk copper is studied. We show for the first time, that super growth chemical vapor deposition method can be successfully applied for preparation of nanotubes on copper catalyst, and the presence of hydrogen is necessary. Next, different methods of copper surface activation are studied, to improve catalyst efficiency. Among them, applied for the first time for copper catalyst in nanotubes synthesis, sulfuric acid activation is the most promising. Among tested samples the surface modified for 10 min is the most active, causing the growth of vertically aligned carbon nanotube forests. Obtained results have potential importance in application of nanotubes and copper in electronic chips and nanodevices. (paper)

Growth graphene on silver-copper nanoparticles by chemical vapor deposition for high-performance surface-enhanced Raman scattering

Science.gov (United States)

Zhang, Xiumei; Xu, Shicai; Jiang, Shouzhen; Wang, Jihua; Wei, Jie; Xu, Shida; Gao, Shoubao; Liu, Hanping; Qiu, Hengwei; Li, Zhen; Liu, Huilan; Li, Zhenhua; Li, Hongsheng

2015-10-01

We present a graphene/silver-copper nanoparticle hybrid system (G/SCNPs) to be used as a high-performance surface-enhanced Raman scattering (SERS) substrate. The silver-copper nanoparticles wrapped by a monolayer graphene layer are directly synthesized on SiO2/Si substrate by chemical vapor deposition in a mixture of methane and hydrogen. The G/SCNPs shows excellent SERS enhancement activity and high reproducibility. The minimum detected concentration of R6G is as low as 10-10 M and the calibration curve shows a good linear response from 10-6 to 10-10 M. The date fluctuations from 20 positions of one SERS substrate are less than 8% and from 20 different substrates are less than 10%. The high reproducibility of the enhanced Raman signals could be due to the presence of an ultrathin graphene layer and uniform morphology of silver-copper nanoparticles. The use of G/SCNPs for detection of nucleosides extracted from human urine demonstrates great potential for the practical applications on a variety of detection in medicine and biotechnology field.

ELECTROCHEMICAL BEHAVIOR OF POLYCRYSTALLINE COPPER DURING THE ADSORPTION OF CO ABSTRACT

Directory of Open Access Journals (Sweden)

J. Salimon

2017-12-01

Full Text Available The electrochemical properties of electrode copper in carbon monoxide-saturated phosphate buffered solution were investigated. The electrochemistry of copper surface was sufficiently changed after the supporting electrolyte solution was saturated with CO. The hydrogen evolution region was depressed and shifted cathodically due to the adsorption process of CO on the copper surface in a linear or terminally bonded manner, Cu-CO . The oxidation and the reduction peaks of copper were significantly changed with two couple of redox peaks. This is due to the subsequent formation and the corresponding reduction of copper(I and the copper carbon monoxides species. Further changed in electrochemical properties occurred when the electrode surface was polarized at high cathodic potential (-1.4 V for a period of time (15 min. The hydrogen evolution region was further depressed due to the adsorption of CO process in multiple bonding sites as adsorbed bridge bonded CO, Cu-CO B L that occurred predominantly.

In situ QCM and TM-AFM investigations of the early stages of degradation of silver and copper surfaces

International Nuclear Information System (INIS)

Kleber, Ch.; Hilfrich, U.; Schreiner, M.

2007-01-01

The early stages of atmospheric corrosion of pure copper and pure silver specimens were investigated performing in situ tapping mode atomic force microscopy (TM-AFM), in situ quartz crystal microbalance (QCM) and X-ray photoelectron spectroscopy (XPS). The information obtained by TM-AFM is the change of the topography of the sample surfaces with emphasis on the shape and lateral distribution of the corrosion products grown within the first hours of weathering. The simultaneously performed in situ QCM measurements are indicating the mass changes due to possibly occurring corrosive processes on the surface during weathering and are therefore a valuable tool for the determination of corrosion rates. Investigations were carried out in synthetic air at different levels of relative humidity (RH) with and without addition of 250 ppb SO 2 as acidifying agent. On a polished copper surface the growth of corrosion products could be observed by TM-AFM analysis at 60% RH without any addition of acidifying gases [M. Wadsak, M. Schreiner, T. Aastrup, C. Leygraf, Surf. Sci. 454-456 (2000) 246-250]. On a weathered copper surface the addition of SO 2 to the moist air stream leads to the formation of additional features as already described in the literature [M. Wadsak, M. Schreiner, T. Aastrup, C. Leygraf, Surf. Sci. 454-456 (2000) 246-250; Ch. Kleber, J. Weissenrieder, M. Schreiner, C. Leygraf, Appl. Surf. Sci. 193 (2002) 245-253]. Exposing a silver specimen to humidity leads to the degradation of the surface structure as well as to a formation of corrosion products, which could be detected by in situ QCM measurements. After addition of 250 ppb SO 2 to the moist gas stream an increase of the formed feature's volume on the silver surface could be observed by TM-AFM measurements. The results obtained additionally from the in situ QCM measurements confirm the influence of SO 2 due to a further increase of the mass of the formed corrosion layer (and therefore an increase of the

Laser-induced selective copper plating of polypropylene surface

Science.gov (United States)

Ratautas, K.; Gedvilas, M.; Stankevičiene, I.; JagminienÄ--, A.; Norkus, E.; Li Pira, N.; Sinopoli, S.; Emanuele, U.; Račiukaitis, G.

2016-03-01

Laser writing for selective plating of electro-conductive lines for electronics has several significant advantages, compared to conventional printed circuit board technology. Firstly, this method is faster and cheaper at the prototyping stage. Secondly, material consumption is reduced, because it works selectively. However, the biggest merit of this method is potentiality to produce moulded interconnect device, enabling to create electronics on complex 3D surfaces, thus saving space, materials and cost of production. There are two basic techniques of laser writing for selective plating on plastics: the laser-induced selective activation (LISA) and laser direct structuring (LDS). In the LISA method, pure plastics without any dopant (filler) can be used. In the LDS method, special fillers are mixed in the polymer matrix. These fillers are activated during laser writing process, and, in the next processing step, the laser modified area can be selectively plated with metals. In this work, both methods of the laser writing for the selective plating of polymers were investigated and compared. For LDS approach, new material: polypropylene with carbon-based additives was tested using picosecond and nanosecond laser pulses. Different laser processing parameters (laser pulse energy, scanning speed, the number of scans, pulse durations, wavelength and overlapping of scanned lines) were applied in order to find out the optimal regime of activation. Areal selectivity tests showed a high plating resolution. The narrowest width of a copper-plated line was less than 23 μm. Finally, our material was applied to the prototype of the electronic circuit board on a 2D surface.

Encapsulation of electroless copper patterns into diamond films

Energy Technology Data Exchange (ETDEWEB)

Pimenov, S.M.; Shafeev, G.A.; Lavrischev, S.V. [General Physics Institute, Moscow (Russian Federation)] [and others

1995-12-31

The results are reported on encapsulating copper lines into diamond films grown by a DC plasma CVD. The process includes the steps of (i) laser activation of diamond for electroless metal plating, (ii) electroless copper deposition selectively onto the activated surface regions, and (iii) diamond regrowth on the Cu-patterned diamond films. The composition and electrical properties of the encapsulated copper lines were examined, revealing high purity and low electrical resistivity of the encapsulated electroless copper.

Seeding of silicon by copper ion implantation for selective electroless copper plating

Energy Technology Data Exchange (ETDEWEB)

Bhansali, S.; Sood, D.K.; Zmood, R.B. [Microelectronic and Materials Technology Centre, Royal Melbourne Institute of Technolgy, Melbourne, VIC (Australia)

1993-12-31

We report on the successful use of copper(self) ion implantation into silicon to seed the electroless plating of copper on silicon (100) surfaces. Copper ions have been implanted to doses of 5E14-6.4E16 ions/cm{sup 2} using a MEEVA ion implanter at extraction voltage of 40kV. Dose was varied in fine steps to determine the threshold dose of 2E15 Cu ions/cm{sup 2} for `seed` formation of copper films on silicon using a commercial electroless plating solution. Plated films were studied with Rutherford backscattering spectrometry, scanning electron microscopy, EDX and profilometry . The adhesion of films was measured by `scotch tape test`. The adhesion was found to improve with increasing dose. However thicker films exhibited rather poor adhesion and high internal stress. SEM results show that the films grow first as isolated islands which become larger and eventually impinge into a continuous film as the plating time is increased. (authors). 5 refs., 1 tab., 3 figs.

Seeding of silicon by copper ion implantation for selective electroless copper plating

Energy Technology Data Exchange (ETDEWEB)

Bhansali, S; Sood, D K; Zmood, R B [Microelectronic and Materials Technology Centre, Royal Melbourne Institute of Technolgy, Melbourne, VIC (Australia)

1994-12-31

We report on the successful use of copper(self) ion implantation into silicon to seed the electroless plating of copper on silicon (100) surfaces. Copper ions have been implanted to doses of 5E14-6.4E16 ions/cm{sup 2} using a MEEVA ion implanter at extraction voltage of 40kV. Dose was varied in fine steps to determine the threshold dose of 2E15 Cu ions/cm{sup 2} for `seed` formation of copper films on silicon using a commercial electroless plating solution. Plated films were studied with Rutherford backscattering spectrometry, scanning electron microscopy, EDX and profilometry . The adhesion of films was measured by `scotch tape test`. The adhesion was found to improve with increasing dose. However thicker films exhibited rather poor adhesion and high internal stress. SEM results show that the films grow first as isolated islands which become larger and eventually impinge into a continuous film as the plating time is increased. (authors). 5 refs., 1 tab., 3 figs.

Seeding of silicon by copper ion implantation for selective electroless copper plating

International Nuclear Information System (INIS)

Bhansali, S.; Sood, D.K.; Zmood, R.B.

1993-01-01

We report on the successful use of copper(self) ion implantation into silicon to seed the electroless plating of copper on silicon (100) surfaces. Copper ions have been implanted to doses of 5E14-6.4E16 ions/cm 2 using a MEEVA ion implanter at extraction voltage of 40kV. Dose was varied in fine steps to determine the threshold dose of 2E15 Cu ions/cm 2 for 'seed' formation of copper films on silicon using a commercial electroless plating solution. Plated films were studied with Rutherford backscattering spectrometry, scanning electron microscopy, EDX and profilometry . The adhesion of films was measured by 'scotch tape test'. The adhesion was found to improve with increasing dose. However thicker films exhibited rather poor adhesion and high internal stress. SEM results show that the films grow first as isolated islands which become larger and eventually impinge into a continuous film as the plating time is increased. (authors). 5 refs., 1 tab., 3 figs

Dependence of the surface resistance of niobium coated copper cavities on the coating temperature

International Nuclear Information System (INIS)

Darriulat, P.; Durand, C.; Janot, P.; Rensing, N.; Weingarten, W.; Bosland, P.; Gobin, J.; Martignac, J.

1996-01-01

Six hydro-formed copper 1.5 GHz cavities have been baked and coated with niobium at different temperatures between 100 deg C and 200 deg C, while keeping the other discharge parameters unchanged. Their surface resistance has been measured as a function RF field and trapped magnetic field. Its dependence on deposition temperature confirms earlier indications obtained using 350 MHz LEP cavities that 150 deg C leads to optimal performances. The critical temperatures of Nb/Cu and bulk niobium cavities have also been measured. (author)

Copper Resistance of the Emerging Pathogen Acinetobacter baumannii

Science.gov (United States)

Williams, Caitlin L.; Neu, Heather M.; Gilbreath, Jeremy J.; Michel, Sarah L. J.; Zurawski, Daniel V.

2016-01-01

ABSTRACT Acinetobacter baumannii is an important emerging pathogen that is capable of causing many types of severe infection, especially in immunocompromised hosts. Since A. baumannii can rapidly acquire antibiotic resistance genes, many infections are on the verge of being untreatable, and novel therapies are desperately needed. To investigate the potential utility of copper-based antibacterial strategies against Acinetobacter infections, we characterized copper resistance in a panel of recent clinical A. baumannii isolates. Exposure to increasing concentrations of copper in liquid culture and on solid surfaces resulted in dose-dependent and strain-dependent effects; levels of copper resistance varied broadly across isolates, possibly resulting from identified genotypic variation among strains. Examination of the growth-phase-dependent effect of copper on A. baumannii revealed that resistance to copper increased dramatically in stationary phase. Moreover, A. baumannii biofilms were more resistant to copper than planktonic cells but were still susceptible to copper toxicity. Exposure of bacteria to subinhibitory concentrations of copper allowed them to better adapt to and grow in high concentrations of copper; this copper tolerance response is likely achieved via increased expression of copper resistance mechanisms. Indeed, genomic analysis revealed numerous putative copper resistance proteins that share amino acid homology to known proteins in Escherichia coli and Pseudomonas aeruginosa. Transcriptional analysis revealed significant upregulation of these putative copper resistance genes following brief copper exposure. Future characterization of copper resistance mechanisms may aid in the search for novel antibiotics against Acinetobacter and other highly antibiotic-resistant pathogens. IMPORTANCE Acinetobacter baumannii causes many types of severe nosocomial infections; unfortunately, some isolates have acquired resistance to almost every available antibiotic

Copper Resistance of the Emerging Pathogen Acinetobacter baumannii.

Science.gov (United States)

Williams, Caitlin L; Neu, Heather M; Gilbreath, Jeremy J; Michel, Sarah L J; Zurawski, Daniel V; Merrell, D Scott

2016-10-15

Acinetobacter baumannii is an important emerging pathogen that is capable of causing many types of severe infection, especially in immunocompromised hosts. Since A. baumannii can rapidly acquire antibiotic resistance genes, many infections are on the verge of being untreatable, and novel therapies are desperately needed. To investigate the potential utility of copper-based antibacterial strategies against Acinetobacter infections, we characterized copper resistance in a panel of recent clinical A. baumannii isolates. Exposure to increasing concentrations of copper in liquid culture and on solid surfaces resulted in dose-dependent and strain-dependent effects; levels of copper resistance varied broadly across isolates, possibly resulting from identified genotypic variation among strains. Examination of the growth-phase-dependent effect of copper on A. baumannii revealed that resistance to copper increased dramatically in stationary phase. Moreover, A. baumannii biofilms were more resistant to copper than planktonic cells but were still susceptible to copper toxicity. Exposure of bacteria to subinhibitory concentrations of copper allowed them to better adapt to and grow in high concentrations of copper; this copper tolerance response is likely achieved via increased expression of copper resistance mechanisms. Indeed, genomic analysis revealed numerous putative copper resistance proteins that share amino acid homology to known proteins in Escherichia coli and Pseudomonas aeruginosa Transcriptional analysis revealed significant upregulation of these putative copper resistance genes following brief copper exposure. Future characterization of copper resistance mechanisms may aid in the search for novel antibiotics against Acinetobacter and other highly antibiotic-resistant pathogens. Acinetobacter baumannii causes many types of severe nosocomial infections; unfortunately, some isolates have acquired resistance to almost every available antibiotic, and treatment options

Native copper in Permian Mudstones from South Devon: A natural analogue of copper canisters for high-level radioactive waste

International Nuclear Information System (INIS)

Milodowski, A.E.; Styles, M.T.; Werme, L.; Oversby, V.M.

2001-01-01

Native copper (>99.9% Cu) sheets associated with complex uraniferous and vanadiferous concretions in Upper Permian Mudstones from south Devon (United Kingdom) have been studied as a 'natural analogue' for copper canisters designed to be used in the isolation of spent fuel and high-level radioactive wastes (HLW) for deep geological disposal. Detailed analysis demonstrates that the copper formed before the mudstones were compacted. The copper displays complex corrosion and alteration. The earliest alteration was to copper oxides, followed sequentially by the formation of copper arsenides, nickel arsenide and copper sulphide, and finally nickel arsenide accompanied by nickel-copper arsenide, copper arsenide and uranium silicates. Petrographic observations demonstrate that these alteration products also formed prior to compaction. Consideration of the published history for the region indicates that maximum compaction of the rocks will have occurred by at least the Lower Jurassic (i.e. over 176 Ma ago). Since that time the copper sheets have remained isolated by the compacted mudstones and were unaffected by further corrosion until uplift and exposure to present-day surface weathering

Superhydrophobic Cu{sub 2}S@Cu{sub 2}O film on copper surface fabricated by a facile chemical bath deposition method and its application in oil-water separation

Energy Technology Data Exchange (ETDEWEB)

Pi, Pihui, E-mail: phpi@scut.edu.cn; Hou, Kun; Zhou, Cailong; Li, Guidong; Wen, Xiufang; Xu, Shouping; Cheng, Jiang; Wang, Shuangfeng

2017-02-28

Highlights: • A superhydrophobic film with macro/nano structure was fabricated on copper surface. • The as-prepared film shows outstanding water repellency and long-term storage stability. • The same method was used to fabricate superhydrophobic/superoleophilic copper mesh. • The obtained mesh could realize separation of various oily sewages with separation efficiency above 94%. - Abstract: Cu{sub 2}S and Cu{sub 2}O composite (Cu{sub 2}S@Cu{sub 2}O) film with micro/nano binary structure was created on copper surface using the mixing solution of sodium thiosulphate and copper sulfate by a facile chemical bath deposition method. After modification with low-cost polydimethylsioxane (PDMS), the superhydrophobic Cu{sub 2}S@Cu{sub 2}O film was obtained. The as-prepared film shows outstanding water repellency with a water contact angle larger than 150° and long-term storage stability. The geometric morphology and chemical composition of the film were characterized by scanning electron microscope (SEM), energy dispersive spectrometer (EDS) and attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR), respectively. Moreover, the same method was used to fabricate superhydrophobic/superoleophilic copper mesh, and it could realize separation of various oily sewages with separation efficiency above 94%. This strategy has potential to fabricate the practical superhydrophobic Cu{sub 2}S@Cu{sub 2}O film on copper surface on a large scale due to its simplicity and low cost.

Copper-catalyzed azide–alkyne cycloaddition (CuAAC) and beyond: new reactivity of copper(i) acetylides†

OpenAIRE

Hein, Jason E.; Fokin, Valery V.

2010-01-01

Copper-catalyzed azide–alkyne cycloaddition (CuAAC) is a widely utilized, reliable, and straightforward way for making covalent connections between building blocks containing various functional groups. It has been used in organic synthesis, medicinal chemistry, surface and polymer chemistry, and bioconjugation applications. Despite the apparent simplicity of the reaction, its mechanism involves multiple reversible steps involving coordination complexes of copper(i) acetylides of varying nucle...

Interaction of dimethylamine with clean and partially oxidized copper surfaces

Science.gov (United States)

Kelber, J. A.; Rogers, J. W.; Banse, B. A.; Koel, B. E.

1990-05-01

The interaction of dimethylamine (DMA) with partially oxidized polycrystalline copper [Cu(poly)] and clean and partially oxidized Cu(110) between 110 and 500 K has been examined using electron stimulated desorption (ESD), high resolution electron energy loss spectroscopy (HREELS) and temperature programmed desorption (TPD). ESD mass spectra of the DMA adsorbed on O/Cu(poly) between 112 and 230 K consistently display peaks at 44 amu [(CH 3) 2N] + and 46 amu [(CH 3) 2NH-H] +, but no significant parent peak at 45 amu [(CH 3) 2NH] +, even though this last feature is prominent in the gas-phase mass spectrum. OH - is not observed at temperatures below 184 K and the yield at higher temperatures is much less than that of O +. HREELS of DMA on clean and oxygen covered Cu(110) obtained at temperatures between 100 and 320 K show characteristic vibrational spectra for molecular DMA and no OH(a) vibrational modes. TPD results show that the desorption profiles of all the major peaks in the DMA mass spectrum follow that of the parent peak with no evidence for production of H 2O. The ESD, HREELS and TPD results all indicate that DMA is molecularly and reversibly adsorbed, with no significant formation of surface hydroxyl species. The results indicate that preferential adsorption of amines from amine/epoxy mixtures onto metal oxide surfaces could passivate the surface and prevent subsequent bonding to the epoxy resin.

Photochemical Copper Coating on 3D Printed Thermoplastics

Science.gov (United States)

Yung, Winco K. C.; Sun, Bo; Huang, Junfeng; Jin, Yingdi; Meng, Zhengong; Choy, Hang Shan; Cai, Zhixiang; Li, Guijun; Ho, Cheuk Lam; Yang, Jinlong; Wong, Wai Yeung

2016-08-01

3D printing using thermoplastics has become very popular in recent years, however, it is challenging to provide a metal coating on 3D objects without using specialized and expensive tools. Herein, a novel acrylic paint containing malachite for coating on 3D printed objects is introduced, which can be transformed to copper via one-step laser treatment. The malachite containing pigment can be used as a commercial acrylic paint, which can be brushed onto 3D printed objects. The material properties and photochemical transformation processes have been comprehensively studied. The underlying physics of the photochemical synthesis of copper was characterized using density functional theory calculations. After laser treatment, the surface coating of the 3D printed objects was transformed to copper, which was experimentally characterized by XRD. 3D printed prototypes, including model of the Statue of Liberty covered with a copper surface coating and a robotic hand with copper interconnections, are demonstrated using this painting method. This composite material can provide a novel solution for coating metals on 3D printed objects. The photochemical reduction analysis indicates that the copper rust in malachite form can be remotely and photo-chemically reduced to pure copper with sufficient photon energy.

Adsorption behavior of caffeine as a green corrosion inhibitor for copper

Energy Technology Data Exchange (ETDEWEB)

Souza, Fernando Silvio de [Grupo de Estudos de Processos Eletroquimicos e Eletroanaliticos, Departamento de Quimica, Universidade Federal de Santa Catarina, 88040-900, Florianopolis, SC (Brazil); Giacomelli, Cristiano [Departamento de Quimica, Universidade Federal de Santa Maria, Av. Roraima 1000, 97119-900, Santa Maria, RS (Brazil); Goncalves, Reinaldo Simoes [Universidade Federal do Rio Grande do Sul, Av. Bento Goncalves 9500, 91501-970, Porto Alegre, RS (Brazil); Spinelli, Almir, E-mail: almir.spinelli@ufsc.br [Grupo de Estudos de Processos Eletroquimicos e Eletroanaliticos, Departamento de Quimica, Universidade Federal de Santa Catarina, 88040-900, Florianopolis, SC (Brazil)

2012-12-01

Electrochemical and impedance experiments were carried out to evaluate the corrosion behavior of copper in aerated 0.1 mol L{sup -1} H{sub 2}SO{sub 4} solutions in the presence of three xanthine derivatives with similar chemical structures. The corrosion rate of copper was found to increase in the presence of theophylline and theobromine and decrease in the presence of caffeine. The adsorption and inhibitory effect of caffeine on copper surfaces in aerated 0.1 mol L{sup -1} H{sub 2}SO{sub 4} solutions were then investigated in detail by potentiodynamic polarization, electrochemical impedance spectroscopy (EIS), contact angle measurements, scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS) and fluorescence experiments. The data obtained indicate that caffeine behaves as a cathodic-type inhibitor adsorbing onto the copper surface according to the Temkin isotherm, with the negative Increment G Degree-Sign {sub ads} value of - 31.1 kJ mol{sup -1} signifying a spontaneous adsorption process. The corrosion inhibition efficiency increased with caffeine concentration in the range of 1.0-10.0 mmol L{sup -1}. Furthermore, the EIS results obtained at the open-circuit potential and surface analysis (SEM, EDS and fluorescence) clearly demonstrated the adsorption of the organic compound onto the copper electrode. The contact angle measurements revealed the formation of a hydrophobic protective film. This film covers up to 72% of the total active surface, acts as a protective barrier and prevents interaction between the metal, water and oxygen molecules. - Highlights: Black-Right-Pointing-Pointer We have investigated the adsorption and corrosion inhibition of caffeine on copper surfaces. Black-Right-Pointing-Pointer Caffeine behaves as a cathodic-type inhibitor. Black-Right-Pointing-Pointer Caffeine adsorbs onto copper surface according to Temkin isotherm. Black-Right-Pointing-Pointer There exists the formation of a hydrophobic film that acts as a

Copper contamination in thin stainless steel sheet

International Nuclear Information System (INIS)

Holbert, R.K. Jr.; Dobbins, A.G.; Bennett, R.K. Jr.

1986-01-01

The standard welding technique used at Oak Ridge Y-12 Plant for joining thin stainless sheet is the gas tungsten arc (GTA) welding process. One of the reoccurring problems with the sheet welds is surface cracking in the heat-affected zone (HAZ). Metallography shows that the cracks are only about 0.05 mm (0.002 in.) deep which is significant in a 0.25 mm (0.01 in.) thick sheet. Thus, welding requirements do not permit any surfacing cracking as detected by a fluorescent dye penetrant test conducted on every part after welding. Surface cracks have been found in both of the two most common weld designs in the thin sheet fabricated at the Oak Ridge Y-12 Plant. These butt joints are welded between two 0.25 mm thick stainless steel sheets and a tube with eyelet welded to a 25 mm (0.98 in.) thick sheet. The weld between the two sheets is made on a semiautomatic seam welding unit, whereas the tube-to-eyelet-to-sheet welds are done manually. The quality of both welds is very dependent on the welding procedure and the way the parts are placed in the weld fixturing. Metallographic examination has indicated that some welded parts with surface cracking in the weld region had copper particles on the surface, and the question of copper contamination has been raised. With the aid of a scanning electron microscope and an electron microprobe, the existence of copper in an around the surface cracks has been verified. The copper is on the surface of the parts prior to welding in the form of small dust particles

Role of surface on the size-dependent mechanical properties of copper nano-wire under tensile load: A molecular dynamics simulation

Science.gov (United States)

Liu, Wei-Ting; Hsiao, Chun-I.; Hsu, Wen-Dung

2014-01-01

In this study we have used atomistic simulations to investigate the role of surface on the size-dependent mechanical properties of nano-wires. In particular, we have performed computational investigation on single crystal face-centered cubic copper nano-wires with diameters ranging from 2 to 20 nm. The wire axis for all the nano-wires are considered along the [0 0 1] direction. Characterization of the initial optimized structures revealed clear differences in interatomic spacing, stress, and potential energy in all the nano-wires. The mechanical properties with respect to wire diameter are evaluated by applying tension along the [0 0 1] direction until yielding. We have discussed the stress-strain relationships, Young's modulus, and the variation in potential energy from surface to the center of the wire for all the cases. Our results indicate that the mechanical response (including yield strain, Young's modulus, and resilience) is directly related to the proportion of surface to bulk type atoms present in each nano-wire. Thus the size-dependent mechanical properties of single crystal copper nano-wire within elastic region are attributed to the surface to volume ratio (surface effect). Using the calculated response, we have formulated a mathematical relationship, which predicts the nonlinear correlation between the mechanical properties and the diameter of the wire.

Evolution effects of the copper surface morphology on the nucleation density and growth of graphene domains at different growth pressures

Energy Technology Data Exchange (ETDEWEB)

Hedayat, Seyed Mahdi [Transport Phenomena & Nanotechnology Lab., School of Chemical Engineering, College of Engineering, University of Tehran (Iran, Islamic Republic of); Karimi-Sabet, Javad, E-mail: j_karimi@alum.sharif.edu [NFCRS, Nuclear Science and Technology Research Institute, Tehran (Iran, Islamic Republic of); Shariaty-Niassar, Mojtaba, E-mail: mshariat@ut.ac.ir [Transport Phenomena & Nanotechnology Lab., School of Chemical Engineering, College of Engineering, University of Tehran (Iran, Islamic Republic of)

2017-03-31

Highlights: • Manipulation of the Cu surface morphology in a wide range by electropolishing treatment. • Comparison of the nucleation density of graphene at low pressure and atmospheric pressure CVD processes. • Controlling the evolution of the Cu surface morphology inside a novel confined space. • Growth of large-size graphene domains. - Abstract: In this work, we study the influence of the surface morphology of the catalytic copper substrate on the nucleation density and the growth rate of graphene domains at low and atmospheric pressure chemical vapor deposition (LPCVD and APCVD) processes. In order to obtain a wide range of initial surface morphology, precisely controlled electropolishing methods were developed to manipulate the roughntreess value of the as-received Cu substrate (RMS = 30 nm) to ultra-rough (RMS = 130 nm) and ultra-smooth (RMS = 2 nm) surfaces. The nucleation and growth of graphene domains show obviously different trends at LPCVD and APCVD conditions. In contrast to APCVD condition, the nucleation density of graphene domains is almost equal in substrates with different initial roughness values at LPCVD condition. We show that this is due to the evolution of the surface morphology of the Cu substrate during the graphene growth steps. By stopping the surface sublimation of copper substrate in a confined space saturated with Cu atoms, the evolution of the Cu surface was impeded. This results in the reduction of the nucleation density of graphene domains up to 24 times in the pre-smoothed Cu substrates at LPCVD condition.

Evolution effects of the copper surface morphology on the nucleation density and growth of graphene domains at different growth pressures

International Nuclear Information System (INIS)

Hedayat, Seyed Mahdi; Karimi-Sabet, Javad; Shariaty-Niassar, Mojtaba

2017-01-01

Highlights: • Manipulation of the Cu surface morphology in a wide range by electropolishing treatment. • Comparison of the nucleation density of graphene at low pressure and atmospheric pressure CVD processes. • Controlling the evolution of the Cu surface morphology inside a novel confined space. • Growth of large-size graphene domains. - Abstract: In this work, we study the influence of the surface morphology of the catalytic copper substrate on the nucleation density and the growth rate of graphene domains at low and atmospheric pressure chemical vapor deposition (LPCVD and APCVD) processes. In order to obtain a wide range of initial surface morphology, precisely controlled electropolishing methods were developed to manipulate the roughntreess value of the as-received Cu substrate (RMS = 30 nm) to ultra-rough (RMS = 130 nm) and ultra-smooth (RMS = 2 nm) surfaces. The nucleation and growth of graphene domains show obviously different trends at LPCVD and APCVD conditions. In contrast to APCVD condition, the nucleation density of graphene domains is almost equal in substrates with different initial roughness values at LPCVD condition. We show that this is due to the evolution of the surface morphology of the Cu substrate during the graphene growth steps. By stopping the surface sublimation of copper substrate in a confined space saturated with Cu atoms, the evolution of the Cu surface was impeded. This results in the reduction of the nucleation density of graphene domains up to 24 times in the pre-smoothed Cu substrates at LPCVD condition.

An Investigation of Low Biofouling Copper-charged Membranes

Science.gov (United States)

Asapu, Sunitha

Water is essential for the survival of life on Earth, but pollutants in water can cause dangerous diseases and fatalities. The need for purified water has been increasing with increasing world population; however, natural sources of water such as rivers, lakes and streams, are progressively falling shorter and shorter of meeting water needs. The provision of clean, drinkable water to people is a key factor for the development of novel and alternative water purification technologies, such as membrane separations. Nanofiltration (NF) is a membrane separations technology that purifies water from lower quality sources, such as brackish water, seawater and wastewater. During the filtration of such sources, materials that are rejected by the membrane may accumulate on the surface of the membrane to foul it. Such materials include organic and inorganic matter, colloids, salts and microorganisms. The former four can often be controlled via pretreatment; however, the accumulation of microorganisms is more problematic to membranes. Biofouling is the accumulation and growth of microorganisms on the surface of membranes and on feed spacers. After attachment, microorganisms excrete extracellular polymeric substances (EPS), which form a matrix around the organism's outer surface as biofilm. These biofilms are detrimental and result in irreversible membrane fouling. Copper and silver ions inactivate the bacterial cells and prevent the DNA replication in microbial cells. Previous studies using copper-charged feed spacers have shown the ability of copper to control biofouling without a significant amount of copper leaching from copper-charged polypropylene (PP) feed spacers during crossflow filtration. Also, filtration using unmodified speed facers experienced almost 70% flux decline, while filtration using copper-charged feed spacers displayed only 25% flux decline. These intriguing results led to the hypothesis that the polymer chemistry could be extrapolated to produce membranes

Chemical durability of copper canisters under crystalline bedrock repository conditions

International Nuclear Information System (INIS)

Sjoeblom, R.; Hermansson, H.P.; Amcoff, Oe.

1995-01-01

In the Swedish waste management programme, the copper canister is expected to provide containment of the radionuclides for a very long time, perhaps million of years. The purpose of the present paper is to analyze prerequisites for assessments of corrosion lifetimes for copper canisters. The analysis is based on compilations of literature from the following areas: chemical literature on copper and copper corrosion, mineralogical literature with emphasis on the stability of copper in near surface environments, and chemical and mineralogical literature with emphasis on the stabilities and thermodynamics of species and phases that may exist in a repository environment. Three main types of situations are identified: (1) under oxidizing and low chloride conditions, passivating oxide type of layers may form on the copper surface; (2) under oxidizing and high chloride conditions, the species formed may all be dissolved; and (3) under reducing conditions, non-passivating sulfide type layers may form on the copper surface. Considerable variability and uncertainty exists regarding the chemical environment for the canister, especially in certain scenarios. Thus, the mechanisms for corrosion can be expected to differ greatly for different situations. The lifetime of a thick-walled copper canister subjected to general corrosion appears to be long for most reasonable chemistries. Localized corrosion may appear for types (1) and (3) above but the mechanisms are widely different in character. The penetration caused by localized corrosion can be expected to be very sensitive to details in the chemistry. 20 refs, 3 figs, 1 tab

Method for providing uranium with a protective copper coating

Science.gov (United States)

Waldrop, Forrest B.; Jones, Edward

1981-01-01

The present invention is directed to a method for providing uranium metal with a protective coating of copper. Uranium metal is subjected to a conventional cleaning operation wherein oxides and other surface contaminants are removed, followed by etching and pickling operations. The copper coating is provided by first electrodepositing a thin and relatively porous flash layer of copper on the uranium in a copper cyanide bath. The resulting copper-layered article is then heated in an air or inert atmosphere to volatilize and drive off the volatile material underlying the copper flash layer. After the heating step an adherent and essentially non-porous layer of copper is electro-deposited on the flash layer of copper to provide an adherent, multi-layer copper coating which is essentially impervious to corrosion by most gases.

Ammonia, phosphate, phenol, and copper(II) removal from aqueous solution by subsurface and surface flow constructed wetland.

Science.gov (United States)

Mojiri, Amin; Ahmad, Zakiah; Tajuddin, Ramlah Mohd; Arshad, Mohd Fadzil; Gholami, Ali

2017-07-01

Water pollution is a global problem. During current study, ammonia, phosphate, phenol, and copper(II) were removed from aqueous solution by subsurface and surface flow constructed wetland. In current investigation, distilled water was polluted with four contaminants including ammonia, phosphate, copper (Cu), and phenol. Response surface methodology and central composite design were applied to optimize pollutant removal during treatment by subsurface flow constructed wetland (SSFCW). Contact time (12 to 80 h) and initial pollutant concentration (20 to 85 mg/L) were selected as independent factors; some upper and lower ranges were also monitored for accuracy. In SSFCW, water hyacinth transplanted in two substrate layers, namely zeolite and cockle shell. SSFCW removed 87.7, 81.4, 74.7, and 54.9% of ammonia, phosphate, Cu, and phenol, respectively, at optimum contact time (64.5 h) and initial pollutant concentration (69.2 mg/L). Aqueous solution was moved to a surface flow constructed wetland (SFCW) after treating via SSFCW at optimum conditions. In SFCW, Typha was transplanted to a fixed powdered substrate layer, including bentonite, zeolite, and cockle shell. SFCW could develop performance of this combined system and could improve elimination efficacy of the four contaminants to 99.99%. So this combined CW showed a good performance in removing pollutants. Graphical abstract Wetlands arrangement for treating aqueous solution in current study.

Stress corrosion cracking and dealloying of copper-gold alloy in iodine vapor

International Nuclear Information System (INIS)

Galvez, M.F.; Bianchi, G.L.; Galvele, J.R.

1993-01-01

The susceptibility to stress corrosion cracking of copper-gold alloy in iodine vapor was studied and the results were analyzed under the scope of the surface mobility stress corrosion cracking mechanism. The copper-gold alloy undergoes stress corrosion cracking in iodine. Copper iodide was responsible of that behavior. The copper-gold alloy shows two processes in parallel: stress corrosion cracking and dealloying. As was predicted by the surface mobility stress corrosion cracking mechanism, the increase in strain rate induces an increase in the crack propagation rate. (Author)

Thermal effects in equilibrium surface segregation in a copper/10-atomic-percent-aluminum alloy using Auger electron spectroscopy

Science.gov (United States)

Ferrante, J.

1972-01-01

Equilibrium surface segregation of aluminum in a copper-10-atomic-percent-aluminum single crystal alloy oriented in the /111/ direction was demonstrated by using Auger electron spectroscopy. This crystal was in the solid solution range of composition. Equilibrium surface segregation was verified by observing that the aluminum surface concentration varied reversibly with temperature in the range 550 to 850 K. These results were curve fitted to an expression for equilibrium grain boundary segregation and gave a retrieval energy of 5780 J/mole (1380 cal/mole) and a maximum frozen-in surface coverage three times the bulk layer concentration. Analyses concerning the relative merits of sputtering calibration and the effects of evaporation are also included.

Deposition of Antimicrobial Copper-Rich Coatings on Polymers by Atmospheric Pressure Jet Plasmas

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Jana Kredl

2016-04-01

Full Text Available Inanimate surfaces serve as a permanent reservoir for infectious microorganisms, which is a growing problem in areas in everyday life. Coating of surfaces with inorganic antimicrobials, such as copper, can contribute to reduce the adherence and growth of microorganisms. The use of a DC operated air plasma jet for the deposition of copper thin films on acrylonitrile butadiene styrene (ABS substrates is reported. ABS is a widespread material used in consumer applications, including hospitals. The influence of gas flow rate and input current on thin film characteristics and its bactericidal effect have been studied. Results from X-ray photoelectron spectroscopy (XPS and atomic force microscopy confirmed the presence of thin copper layers on plasma-exposed ABS and the formation of copper particles with a size in the range from 20 to 100 nm, respectively. The bactericidal properties of the copper-coated surfaces were tested against Staphylococcus aureus. A reduction in growth by 93% compared with the attachment of bacteria on untreated samples was observed for coverage of the surface with 7 at. % copper.

Potassium sorbate-A new aqueous copper corrosion inhibitor

International Nuclear Information System (INIS)

Abelev, Esta; Starosvetsky, David; Ein-Eli, Yair

2007-01-01

This work presents the novel nature of 2,4-hexadienoic acid potassium salt (potassium sorbate (KCH 3 CH=CHCH=CHCO 2 )) as an effective copper aqueous corrosion inhibitor. The influence of pH and potassium sorbate concentration on copper corrosion in aerated sulfate and chloride solutions is reported. Degree of copper protection was found to increase with an increase in potassium sorbate concentration; an optimum concentration of this inhibitor in sulfate solutions was found to be 10 g/L. Copper is highly resistant to corrosion attacks by chloride ions in the presence of potassium sorbate. X-ray photoelectron spectroscopy (XPS) studies suggest that copper protection is achieved via the formation of a mixed layer of cuprous oxide, cupric hydroxide and copper(II)-sorbate at the metal surface

Solution-processed copper-nickel nanowire anodes for organic solar cells

Science.gov (United States)

Stewart, Ian E.; Rathmell, Aaron R.; Yan, Liang; Ye, Shengrong; Flowers, Patrick F.; You, Wei; Wiley, Benjamin J.

2014-05-01

This work describes a process to make anodes for organic solar cells from copper-nickel nanowires with solution-phase processing. Copper nanowire films were coated from solution onto glass and made conductive by dipping them in acetic acid. Acetic acid removes the passivating oxide from the surface of copper nanowires, thereby reducing the contact resistance between nanowires to nearly the same extent as hydrogen annealing. Films of copper nanowires were made as oxidation resistant as silver nanowires under dry and humid conditions by dipping them in an electroless nickel plating solution. Organic solar cells utilizing these completely solution-processed copper-nickel nanowire films exhibited efficiencies of 4.9%.This work describes a process to make anodes for organic solar cells from copper-nickel nanowires with solution-phase processing. Copper nanowire films were coated from solution onto glass and made conductive by dipping them in acetic acid. Acetic acid removes the passivating oxide from the surface of copper nanowires, thereby reducing the contact resistance between nanowires to nearly the same extent as hydrogen annealing. Films of copper nanowires were made as oxidation resistant as silver nanowires under dry and humid conditions by dipping them in an electroless nickel plating solution. Organic solar cells utilizing these completely solution-processed copper-nickel nanowire films exhibited efficiencies of 4.9%. Electronic supplementary information (ESI) available. See DOI: 10.1039/c4nr01024h

The oxidation of copper catalysts during ethylene epoxidation.

Science.gov (United States)

Greiner, M T; Jones, T E; Johnson, B E; Rocha, T C R; Wang, Z J; Armbrüster, M; Willinger, M; Knop-Gericke, A; Schlögl, R

2015-10-14

The oxidation of copper catalysts during ethylene epoxidation was characterized using in situ photoemission spectroscopy and electron microscopy. Gas chromatography, proton-transfer reaction mass spectrometry and electron-ionization mass spectrometry were used to characterize the catalytic properties of the oxidized copper. We find that copper corrodes during epoxidation in a 1 : 1 mixture of oxygen and ethylene. The catalyst corrosion passes through several stages, beginning with the formation of an O-terminated surface, followed by the formation of Cu2O scale and eventually a CuO scale. The oxidized catalyst exhibits measurable activity for ethylene epoxidation, but with a low selectivity of 8/2500) Cu2O forms and eventually covers the surface.

In-situ x-ray absorption study of copper films in ground water solutions

International Nuclear Information System (INIS)

Kvashnina, K.O.; Butorin, S.M.; Modin, A.; Soroka, I.; Marcellini, M.; Nordgren, J.; Guo, J.-H.; Werme, L.

2007-01-01

This study illustrates how the damage from copper corrosion can be reduced by modifying the chemistry of the copper surface environment. The surface modification of oxidized copper films induced by chemical reaction with Cl - and HCO 3 - in aqueous solutions was monitored by in situ X-ray absorption spectroscopy. The results show that corrosion of copper can be significantly reduced by adding even a small amount of sodium bicarbonate. The studied copper films corroded quickly in chloride solutions, whereas the same solution containing 1.1 mM HCO 3 - prevented or slowed down the corrosion processes

Patterned self-assembled monolayers of alkanethiols on copper nanomembranes by submerged laser ablation

Science.gov (United States)

Rhinow, Daniel; Hampp, Norbert A.

2012-06-01

Self-assembled monolayers (SAMs) of alkanethiols are major building blocks for nanotechnology. SAMs provide a functional interface between electrodes and biomolecules, which makes them attractive for biochip fabrication. Although gold has emerged as a standard, copper has several advantages, such as compatibility with semiconductors. However, as copper is easily oxidized in air, patterning SAMs on copper is a challenging task. In this work we demonstrate that submerged laser ablation (SLAB) is well-suited for this purpose, as thiols are exchanged in-situ, avoiding air exposition. Using different types of ω-substituted alkanethiols we show that alkanethiol SAMs on copper surfaces can be patterned using SLAB. The resulting patterns were analyzed by atomic force microscopy (AFM) and scanning electron microscopy (SEM). Both methods indicate that the intense laser beam promotes the exchange of thiols at the copper surface. Furthermore, we present a procedure for the production of free-standing copper nanomembranes, oxidation-protected by alkanethiol SAMs. Incubation of copper-coated mica in alkanethiol solutions leads to SAM formation on both surfaces of the copper film due to intercalation of the organic molecules. Corrosion-protected copper nanomembranes were floated onto water, transferred to electron microscopy grids, and subsequently analyzed by electron energy loss spectroscopy (EELS).

Synthesis of nanoscale copper nitride thin film and modification of the surface under high electronic excitation.

Science.gov (United States)

Ghosh, S; Tripathi, A; Ganesan, V; Avasthi, D K

2008-05-01

Nanoscale (approximately 90 nm) Copper nitride (Cu3N) films are deposited on borosilicate glass and Si substrates by RF sputtering technique in the reactive environment of nitrogen gas. These films are irradiated with 200 MeV Au15+ ions from Pelletron accelerator in order to modify the surface by high electronic energy deposition of heavy ions. Due to irradiation (i) at incident ion fluence of 1 x 10(12) ions/cm2 enhancement of grains, (ii) at 5 x 10912) ions/cm2 mass transport on the films surface, (iii) at 2 x 10(13) ions/cm2 line-like features on Cu3N/glass and nanometallic structures on Cu3N/Si surface are observed. The surface morphology is examined by atomic force microscope (AFM). All results are explained on the basis of a thermal spike model of ion-solid interaction.

Experimental and numerical study of the high-temperature structure of copper single crystal surfaces

International Nuclear Information System (INIS)

Loisel, Bertrand

1989-01-01

The structure of copper single crystal surfaces has been investigated on an atomic scale using two complementary tools: helium beam diffraction experiments and computer simulations by molecular dynamics. In the case of stepped surfaces, the roughening transition occurs at low temperature. Our helium beam diffraction experiments in the range 70-1000 K reveal this transition at 650±50 K and 150±50 K respectively on the (331) and (310) surfaces. We emphasize the role of the terrace and step structure on the thermal roughness, which is ruled by microscopic energies related to the creation and interaction of defects on the step edges. Adsorbing oxygen on a rough (310) surface gives rise to ordered superstructures. In our computer simulations, the interatomic forces are derived from an empiric N-body potential which leads to a realistic description of the static and dynamical properties of the bulk metal and its surfaces. We analyze the results of high-temperature simulations on the (110) surface. Two types of disorder are distinguished: the creation of adatom-vacancy pairs and the enhancement of the vibrational amplitudes of the atoms near their equilibrium site. We establish that both phenomena take place in the same temperature range. These simulations also indicate the very anisotropic behaviour of the surface at high temperatures (> 1000 K). (author) [fr

Antibiotic resistance, ability to form biofilm and susceptibility to copper alloys of selected staphylococcal strains isolated from touch surfaces in Polish hospital wards

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Anna Różańska

2017-08-01

Full Text Available Abstract Background Despite the employment of sanitary regimes, contact transmission of the aetiological agents of hospital infections is still exceedingly common. The issue of microbe transmission becomes particularly important when facing multidrug-resistant microorganisms such as methicillin-resistant staphylococci. In the case of deficiencies in cleaning and disinfection procedures, hospital equipment made of copper alloys can play an important role, complementing traditional hospital hygiene procedures. The objective of this study was to characterize staphylococcal strains isolated from touch surfaces in Polish hospital wards in terms of their drug resistance, ability to form biofilm and susceptibility to antimicrobial activity of copper alloys. Methods The materials for the study were 95 staphylococcal strains isolated from touch surfaces in 13 different hospital wards from Małopolska province (the south of Poland. Phenotypic and genotypic antibiotic resistance were checked for erythromycin, clindamycin, gentamycin, ciprofloxacin, trimethoprim/sulfamethoxazole and mupirocin. Biofilm formation ability for the tested strains was checked with the use of culture on Congo red agar. Susceptibility to copper, tin bronze, brass and new silver was tested using a modification of the Japanese standard. Results Over 67% of the analysed staphylococcal strains were methicillin-resistant (MR. Four strains were resistant to all of the tested antibiotics, and 14 were resistant to all except mupirocin. Strains classified as MR had significantly increased resistance to the remaining antibiotic groups. About one-third of the analysed strains revealed biofilm-forming ability. Among the majority of species, biofilm-forming and non-biofilm-forming strains were distributed evenly; in the case of S. haemolyticus only, negative strains accounted for 92.8%. Susceptibility to copper alloys was different between strains and rather lower than in the case of the SA

Influences of Corrosive Sulfur on Copper Wires and Oil-Paper Insulation in Transformers

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Jian Li

2011-10-01

Full Text Available Oil-impregnated paper is widely used in power transmission equipment as a reliable insulation. However, copper sulphide deposition on oil-paper insulation can lead to insulation failures in power transformers. This paper presents the influences of copper sulfur corrosion and copper sulphide deposition on copper wires and oil-paper insulation in power transformers. Thermal aging tests of paper-wrapped copper wires and bare copper wires in insulating oil were carried out at 130 °C and 150 °C in laboratory. The corrosive characteristics of paper-wrapped copper wires and bare copper wires were analyzed. Dielectric properties of insulation paper and insulating oil were also analyzed at different stages of the thermal aging tests using a broadband dielectric spectrometer. Experiments and analysis results show that copper sulfide deposition on surfaces of copper wires and insulation paper changes the surface structures of copper wires and insulation paper. Copper sulfur corrosion changes the dielectric properties of oil-paper insulation, and the copper sulfide deposition greatly reduces the electrical breakdown strength of oil-paper insulation. Metal passivator is capable of preventing copper wires from sulfur corrosion. The experimental results are helpful for investigations for fault diagnosis of internal insulation in power transformers.

Easy route to superhydrophobic copper-based wire-guided droplet microfluidic systems.

Science.gov (United States)

Mumm, Florian; van Helvoort, Antonius T J; Sikorski, Pawel

2009-09-22

Droplet-based microfluidic systems are an expansion of the lab on a chip concept toward flexible, reconfigurable setups based on the modification and analysis of individual droplets. Superhydrophobic surfaces are one suitable candidate for the realization of droplet-based microfluidic systems as the high mobility of aqueous liquids on such surfaces offers possibilities to use novel or more efficient approaches to droplet movement. Here, copper-based superhydrophobic surfaces were produced either by the etching of polycrystalline copper samples along the grain boundaries using etchants common in the microelectronics industry, by electrodeposition of copper films with subsequent nanowire decoration based on thermal oxidization, or by a combination of both. The surfaces could be easily hydrophobized with thiol-modified fluorocarbons, after which the produced surfaces showed a water contact angle as high as 171 degrees +/- 2 degrees . As copper was chosen as the base material, established patterning techniques adopted from printed circuit board fabrication could be used to fabricate macrostructures on the surfaces with the intention to confine the droplets and, thus, to reduce the system's sensitivity to tilting and vibrations. A simple droplet-based microfluidic chip with inlets, outlets, sample storage, and mixing areas was produced. Wire guidance, a relatively new actuation method applicable to aqueous liquids on superhydrophobic surfaces, was applied to move the droplets.

Preparation of copper and silicon/copper powders by a gas ...

Indian Academy of Sciences (India)

Pure and silicon-coated metal copper nano to submicron-sized powders were prepared by gas evaporation and condensation. This powder was synthesized by using an industrial electron accelerator, ELV-6, with Ar as the carrier gas. Vapour from the liquefied metal surface was transferred to the cold zone by the carrier ...

Cold spray copper coatings for used fuel containers

Energy Technology Data Exchange (ETDEWEB)

Keech, P. [Nuclear Waste Management Organization, Toronto, ON (Canada); Vo, P.; Poirier, D.; Legoux, J-G [National Research Council, Boucherville QC, (Canada)

2015-07-01

Recently, the Nuclear Waste Management Organization has been developing copper coatings as a method of protecting steel used fuel containers (UFCs) from corrosion within a deep geological repository. The corrosion barrier design is based on the application of a copper coating bonded directly to the exterior surface of the UFC structural core. Copper coating technologies amendable to supply of pre-coated UFC vessel components and application to the weld zone following UFC closure within the radiological environment have been investigated. Copper cold spray has been assessed for both operations; this paper outlines the research and development to date of this technique. (author)

He bubble sites in implanted copper alloy

International Nuclear Information System (INIS)

Moreno, D.; Eliezer, D.

1996-01-01

Structural materials in fusion reactors will be exposed to helium implantation over a broad range of energies. The deformation and partial exfoliation of surface layers due to hydrogen isotopes and helium contribute to the total erosion of the first wall. For this reason, one of the most important criteria in the choice of materials for the first wall of fusion reactors is the material's damage resistance. Recent advances in developing nuclear fusion reactors reveal that efficient heat removal from plasma-facing components is very important. Copper and copper alloys are considered an attractive choice for transporting such a high heat flux without thermal damage as they have high thermal conductivity. In the present study the authors report on the structural changes in a copper alloy, due to the helium implantation on the very near surface area, observed by transmission electron microscopy

Specific anion effects on copper surface through electrochemical treatment: Enhanced photoelectrochemical CO2 reduction activity of derived nanostructures induced by chaotropic anions

Science.gov (United States)

Navaee, Aso; Salimi, Abdollah

2018-05-01

Copper derivatives are the most prominent CO2 reduction electrocatalyst. Herein, the metallic copper has been electrochemically treated with some of common ionic salts such as N3bar, HPO2bar, S2bar, Fbar, Clbar, Brbar and Ibar based on the dissolution of a metallic working electrode in an aqueous solution to derive the surface roughness incorporated with nanostructures. Diverse surface morphology can be obtained when the ionic radii of anions are changed. Surface study reveals various roughness shapes based on the size and polarity of the anions, where the ions with higher ionic radii have higher impact on the Cu surface. In comparison, polyatomic oxyanion such as HPO2bar even with large ionic radii do not have enough strength to create the surface roughness than that of oxygen-free anions with large ionic radii. The photoelectrochemical behavior of the modified surfaces toward CO2 reduction is studied at a wide potential window in bicarbonate aqueous solution. Based on our investigations, treated surfaces by Ibar, Clbar and S2bargive a more surface roughness, while Ibar and N3bar offer higher catalytic activity toward CO2 reduction due to possible complexing ability of these anions with Cu cations, followed by formation of the co-catalyst semiconductor and facilitate electron transfer. This methodology can be applied to investigate the effect of ions on transition metals along with obtaining different surface morphologies tailored to different applications.

Copper-polymer nanocomposites: An excellent and cost-effective biocide for use on antibacterial surfaces.

Science.gov (United States)

Tamayo, Laura; Azócar, Manuel; Kogan, Marcelo; Riveros, Ana; Páez, Maritza

2016-12-01

The development of polymer nanocomposites with antimicrobial properties has been a key factor for controlling or inhibiting the growth of microorganisms and preventing foodborne diseases and nosocomial infections. Commercially available antibacterial products based on silver-polymer are the most widely used despite the fact that copper is considerably less expensive. The incorporation of copper nanoparticles as antibacterial agents in polymeric matrices to generate copper-polymer nanocomposites have presented excellent results in inhibiting the growth of a broad spectrum of microorganisms. The potential applications in food packaging, medical devices, textiles and pharmaceuticals and water treatment have generated an increasing number of investigations on preparing copper based nanocomposites and alternative polymeric matrices, as potential hosts of nano-modifiers. This review presents a comprehensive compilation of previous published work on the subject, mainly related to the antimicrobial activity of copper polymer nanocomposites. Within all the phenomenology associated to antibacterial effects we highlight the possible mechanisms of action. We discuss the differences in the susceptibility of Gram negative and positive bacteria to the antibacterial activity of nanocomposites, and influencing factors. As well, the main applications of copper polymer-metal nanocomposites are described, considering their physical and chemical characteristics. Finally, some commercially available copper-polymer nanocomposites are described. Copyright © 2016 Elsevier B.V. All rights reserved.

XPS studies of short pulse laser interaction with copper

International Nuclear Information System (INIS)

Stefanov, P.; Minkovski, N.; Balchev, I.; Avramova, I.; Sabotinov, N.; Marinova, Ts.

2006-01-01

The effect of laser ablation on copper foil irradiated by a short 30 ns laser pulse was investigated by X-ray photoelectron spectroscopy. The laser fluence was varied from 8 to 16.5 J/cm 2 and the velocity of the laser beam from 10 to 100 mm/s. This range of laser fluence is characterized by a different intensity of laser ablation. The experiments were done in two kinds of ambient atmosphere: air and argon jet gas. The chemical state and composition of the irradiated copper surface were determined using the modified Auger parameter (α') and O/Cu intensity ratio. The ablation atmosphere was found to influence the size and chemical state of the copper particles deposited from the vapor plume. During irradiation in air atmosphere the copper nanoparticles react with oxygen and water vapor from the air and are deposited in the form of a CuO and Cu(OH) 2 thin film. In argon atmosphere the processed copper surface is oxidized after exposure to air

Facile synthesis of gold coated copper(II) hydroxide pine-needle-like micro/nanostructures for surface-enhanced Raman scattering

Science.gov (United States)

Long, Kailin; Du, Deyang; Luo, Xiaoguang; Zhao, Weiwei; Wu, Zhangting; Si, Lifang; Qiu, Teng

2014-08-01

This work reports a facile method to fabricate gold coated copper(II) hydroxide pine-needle-like micro/nanostructures for surface-enhanced Raman scattering (SERS) application. The effects of reaction parameters on the shape, size and surface morphology of the products are systematically investigated. The as-prepared 3D hierarchical structures have the advantage of a large surface area available for the formation of hot spots and the adsorption of target analytes, thus dramatically improving the Raman signals. The finite difference time domain calculations indicate that the pine-needle-like model pattern may demonstrate a high quality SERS property owing to the high density and abundant hot spot characteristic in closely spaced needle-like arms.

Hydrophobic pinning with copper nanowhiskers leads to bactericidal properties.

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Ajay Vikram Singh

Full Text Available The considerable morbidity associated with hospitalized patients and clinics in developed countries due to biofilm formation on biomedical implants and surgical instruments is a heavy economic burden. An alternative to chemically treated surfaces for bactericidal activity started emerging from micro/nanoscale topographical cues in the last decade. Here, we demonstrate a putative antibacterial surface using copper nanowhiskers deposited by molecular beam epitaxy. Furthermore, the control of biological response is based on hydrophobic pinning of water droplets in the Wenzel regime, causing mechanical injury and cell death. Scanning electron microscopy images revealed the details of the surface morphology and non-contact mode laser scanning of the surface revealed the microtopography-associated quantitative parameters. Introducing the bacterial culture over nanowhiskers produces mechanical injury to cells, leading to a reduction in cell density over time due to local pinning of culture medium to whisker surfaces. Extended culture to 72 hours to observe biofilm formation revealed biofilm inhibition with scattered microcolonies and significantly reduced biovolume on nanowhiskers. Therefore, surfaces patterned with copper nanowhiskers can serve as potential antibiofilm surfaces. The topography-based antibacterial surfaces introduce a novel prospect in developing mechanoresponsive nanobiomaterials to reduce the risk of medical device biofilm-associated infections, contrary to chemical leaching of copper as a traditional bactericidal agent.

Evaluation of the energetics of copper-vacancy clusters in Fe

Energy Technology Data Exchange (ETDEWEB)

Morishita, Kazunori, E-mail: morishita@iae.kyoto-u.ac.jp; Nakasuji, Toshiki; Ruan, Xiaoyong

2017-02-15

Highlights: • Thermodynamics evaluation of the nucleation process of copper-vacancy clusters in Fe is performed. • Nucleation free energy of copper-vacancy clusters in Fe is formulated. • With this energetics, two different nucleation paths of clusters are found as a function of the damage rate. - Abstract: A theoretical study is conducted to evaluate the nucleation free energy of copper-vacancy clusters in Fe as a function of the numbers of copper atoms and of vacancies in a cluster. Using this free energy value, cluster nucleation processes during irradiation are investigated. The results clearly show that there are two different types of cluster nucleation paths on the free energy surface; one is the formation of empty voids by jumping over the ridge of the free energy surface, and the other corresponds to a path for the formation of copper clusters by going around the ridge. The dependence of easy nucleation paths on the damage rate is discussed.

In vitro studies of copper release from powder particles in synthetic biological media

International Nuclear Information System (INIS)

Midander, Klara; Wallinder, Inger Odnevall; Leygraf, Christofer

2007-01-01

The aim of this paper is to provide quantitative data on copper release from powder particles of different copper materials, including artificial copper patina, Cu 2 O and metallic Cu, when exposed to different synthetic biological media to simulate an inhalation scenario and/or skin contact. Generated data may contribute in risk assessment of potential health effects following exposure to and handling of various copper materials. All tests were performed in vitro to determine total copper concentrations, release rates of total copper, and to elucidate its time-dependence. The copper release process was interpreted in terms of specific surface area, surface morphology-, and composition. All powder materials show a time-dependent release process with total copper release rates less than 3 μg/cm 2 per hour at steady state conditions, for all media investigated. The importance of using relevant test media when simulating different interstitial lung conditions and difficulties encountered when comparing powder particles of essentially different properties are thoroughly discussed. - Copper release rates from particles are essential to assess potential health aspects

Influence of branched quaternary ammonium surfactant molecules as levelers for copper electroplating from acidic sulfate bath

International Nuclear Information System (INIS)

Wang, An-yin; Chen, Biao; Fang, Lei; Yu, Jian-jun; Wang, Li-min

2013-01-01

A family of branched quaternary ammonium surfactants (compounds 1a–1c) with different carbon chains were synthesized for levelers applied in copper electroplating. Their inhibitory actions on copper electroplating were characterized by cyclic voltammetry (CV). Compound 1b, as representative structure type, was tested by means of different electrochemical methods including CV, polarization curve and electrochemical impedance spectroscopy (EIS) with different concentrations. The interaction between compound 1b and copper surface was investigated using atomic force microscope (AFM) and X-ray photoelectron spectra (XPS). The results indicated that our newly synthesized compounds, particular 1b, were effective levelers used for copper electroplating. Compound 1b could adsorb on copper surface to form an adsorption layer. The adsorption behavior of compound 1b on copper surface indicated that compound 1b could inhibit the copper electrodeposition, which provided favorable conditions used as a leveler. Moreover, the addition of compound 1b could increase the cathodic polarization, which was attributed to the adsorption of compound 1b during copper electroplating process. In addition, various surface morphologies and crystalline orientation of the plated copper films caused by different concentrations of compound 1b were characterized by scanning electron microscope (SEM) and X-ray diffraction (XRD) respectively. Effects of compound 1b on refining the grain size and changing the preferential orientation of the plated copper films were exhibited

Bioinspired conical copper wire with gradient wettability for continuous and efficient fog collection.

Science.gov (United States)

Ju, Jie; Xiao, Kai; Yao, Xi; Bai, Hao; Jiang, Lei

2013-11-06

Inspired by the efficient fog collection on cactus spines, conical copper wires with gradient wettability are fabricated through gradient electrochemical corrosion and subsequent gradient chemical modification. These dual-gradient copper wires' fog-collection ability is demonstrated to be higher than that of conical copper wires with pure hydrophobic surfaces or pure hydrophilic surfaces, and the underlying mechanism is also analyzed. © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

The effects of grooming on a copper ablative coating: a six year study.

Science.gov (United States)

Tribou, Melissa; Swain, Geoffrey

2017-07-01

More than 90% of US Navy Ships are coated with copper ablative paint. These ships may spend long periods of time pier-side, which makes them vulnerable to fouling. Hull grooming has been proposed as a means of maintaining the coatings in an operational condition. This study investigated the effect of grooming on a copper ablative coating exposed statically for six years. Grooming was performed weekly or monthly with controls left ungroomed. The fouling community was visually assessed, dry film thickness measurements were taken to monitor coating loss, and the copper leaching rates were measured. It was found that weekly and monthly groomed surfaces reduced fouling, and the ungroomed surfaces became fully fouled. Coating loss was similar for weekly, monthly and ungroomed surfaces. The results suggest that grooming is a viable method for maintaining copper ablative coatings in a fouling-free condition without adverse increases in the total copper output.

Electrochemical synthesis of highly ordered polypyrrole on copper modified aluminium substrates

International Nuclear Information System (INIS)

Siddaramanna, Ashoka; Saleema, N.; Sarkar, D.K.

2014-01-01

Fabrication of highly ordered conducting polymers on metal surfaces has received a significant interest owing to their potential applications in organic electronic devices. In this context, we have developed a simple method for the synthesis of highly ordered polypyrrole (PPy) on copper modified aluminium surfaces via electrochemical polymerization process. A series of characteristic peaks of PPy evidenced on the infrared spectra of these surfaces confirm the formation of PPy. The X-ray diffraction (XRD) pattern of PPy deposited on copper modified aluminium surfaces also confirmed the deposition of PPy as a sharp and intense peak at 2θ angle of 23° attributable to PPy is observed while this peak is absent on PPy deposited on as-received aluminium surfaces. An atomic model of the interface of PPy/Cu has been presented based on the inter-atomic distance of copper–copper of (1 0 0) plane and the inter-monomer distance of PPy, to describe the ordering of PPy on Cu modified Al surfaces.

Inhibition of copper corrosion in sodium chloride solution by the self-assembled monolayer of sodium diethyldithiocarbamate

Energy Technology Data Exchange (ETDEWEB)

Liao, Q.Q., E-mail: liaoqq1971@yahoo.com.c [Key Lab of Shanghai Colleges and Universities for Electric Power Corrosion Control and Applied Electrochemistry, Shanghai Engineering Research Center of Energy - Saving in Heat Exchange Systems, Shanghai University of Electric Power, Shanghai 200090 (China); Yue, Z.W.; Yang, D. [Key Lab of Shanghai Colleges and Universities for Electric Power Corrosion Control and Applied Electrochemistry, Shanghai Engineering Research Center of Energy - Saving in Heat Exchange Systems, Shanghai University of Electric Power, Shanghai 200090 (China); Wang, Z.H. [Department of Chemistry, Tongji University, Shanghai 200092 (China); Li, Z.H. [Department of Chemistry, Fudan University, Shanghai 200433 (China); Ge, H.H. [Key Lab of Shanghai Colleges and Universities for Electric Power Corrosion Control and Applied Electrochemistry, Shanghai Engineering Research Center of Energy - Saving in Heat Exchange Systems, Shanghai University of Electric Power, Shanghai 200090 (China); Li, Y.J. [Department of Chemistry, Tongji University, Shanghai 200092 (China)

2011-05-15

Research highlights: DDTC is of low toxicity. DDTC SAM had good corrosion inhibition effects on copper in 3% NaCl solution. DDTC SAM was chemisorbed on copper surface by its S atoms. - Abstract: Sodium diethyldithiocarbamate (DDTC) self-assembled monolayer (SAM) on copper surface has been investigated by SERS and EDS and the results show that DDTC SAM is chemisorbed on copper surface by its S atoms with tilted orientation. Corrosion inhibition ability of DDTC SAM was measured in 3% NaCl solution using electrochemical methods. The impedance results indicate that the maximum inhibition efficiency of DDTC SAM can reach 99%. Quantum chemical calculations show that DDTC has relatively small {Delta}E between HOMO and LUMO and large negative charge in its two sulfur atoms, which facilitates the formation of a DDTC SAM on copper surface.

Thermally modified bentonite clay for copper removal

International Nuclear Information System (INIS)

Bertagnolli, C.; Kleinübing, S.J.; Silva, M.G.C.

2011-01-01

Bentonite clay coming from Pernambuco was thermally modified in order to increase its affinity and capacity in the copper removal in porous bed. The application of this procedure is justified by the low cost of clay, their abundance and affinity for various metal ions. Thermally treatment modifies the clay adsorption properties enables its use in porous bed system, with the increase in surface area and mechanical strength. The material was characterized by x-ray diffraction, thermogravimetric analysis and N_2 physisorption. Then tests were carried out for adsorption of copper in various experimental conditions and evaluated the mass transfer zone, useful and total adsorbed removal amounts and total copper removal percentage. The results showed that the clay treated at higher temperature showed higher copper removal. (author)

Brake wear from vehicles as an important source of diffuse copper pollution

NARCIS (Netherlands)

Hulskotte, J.H.J.; Gon, H.A.C.D. van der; Visschedijk, A.J.H.; Schaap, M.

2007-01-01

In this article we show that brake wear from road traffic vehicles is an important source of atmospheric (participate) copper concentrations in Europe. Consequently, brake wear also contributes significantly to deposition fluxes of copper to surface waters. We estimated the copper emission due to

Bulk Copper Electrodeposition on Gold Imaged by In Situ STM

DEFF Research Database (Denmark)

Andersen, Jens Enevold Thaulov; Bech-Nielsen, Gregers; Møller, Per

1996-01-01

Electrochemical measurements were carried out simultaneously with acquisition of in situ STM images of copper electrodeposition at low cathodic overpotentials and subsequent dissolution from the underlying polycrystalline gold surfaces. The morphologies of the copper deposits were examined...

Surface modification of calcium-copper hydroxyapatites using polyaspartic acid

Science.gov (United States)

Othmani, Masseoud; Aissa, Abdallah; Bachoua, Hassen; Debbabi, Mongi

2013-01-01

Mixed calcium-copper hydroxyapatite (Ca-CuHAp), with general formula Ca(10-x)Cux(PO4)6(OH)2, where 0 ≤ x ≤ 0.75 was prepared in aqueous medium in the presence of different concentrations of poly-L-aspartic acid (PASP). XRD, IR, TG-DTA, TEM-EDX, AFM and chemical analyses were used to characterize the structure, morphology and composition of the products. All techniques show the formation of new hybrid compounds Ca-CuHAp-PASP. The presence of the grafting moiety on the apatitic material is more significant with increasing of copper amount and/or organic concentration in the starting solution. These increases lead to the affectation of apatite crystallinity. The IR spectroscopy shows the conservation of (Psbnd OH) band of (HPO4)2- groups, suggesting that PASP acid was interacted only with metallic cations of hydroxyapatite.

Effect of acrylonitrile on the electrode processes ivolving copper cations

Directory of Open Access Journals (Sweden)

Viktor F. Vargalyuk

2016-03-01

Full Text Available Based on the results of cyclic voltammetry and study of deposits morphology, it has been shown that acrylonitrile does not have significant effect on the mechanism of Cu2+ + 2ē → Cu0 reaction. This distinguishes acrylonitrile from the unsaturated polyfunctional organic substances (acrylic acid, acrylamide which forms stable complexes with Cu2+ ions. Acrylonitrile just inhibits cathodic process by adsorbing on the surface of electrode thus blocking its active sites. But the presence of acrylonitrile significantly changes the mechanism of the anodic process. It has been found that acrylonitrile interacts with surface copper atoms thus forming thermodynamically stable [Cu π-AN]0 π‑complexes. Ionization potential of these π‑complexes is more negative if compare to copper atoms. As the result acceleration of anodic process takes place in the low polarization area. However, since the chemisorption is a slow process the presence of acrylonitrile mainly affects dissolution of the first surface layers of copper atoms. Further ionization of copper atoms runs out directly and requires higher polarization.

Corrosion of copper under Canadian nuclear fuel waste disposal conditions

International Nuclear Information System (INIS)

King, F.; Litke, C.D.

1990-01-01

The corrosion of copper was studied under Canadian nuclear fuel waste disposal conditions. The groundwater in a Canadian waste vault is expected to be saline, with chloride concentrations from 0.1 to 1.0 mol/l. The container would be packed in a sand/clay buffer, and the maximum temperature on the copper surface would be 100C; tests were performed up to 150C. Radiation fields will initially be around 500 rad/h, and conditions will be oxidizing. Sulfides may be present. The minimum design lifetime for the container is 500 years. Most work has been done on uniform corrosion, although pitting has been considered. It was found that the rate of uniform corrosion in aerated NaCl at room temperature is limited by the rate of the anodic reaction, which is controlled mainly by the rate of transport of dissolved metal species away from the copper surface. The rate of corrosion should become controlled by the transport of oxygen to the copper surface only at very low oxygen concentrations. In the presence of gamma radiation the corrosion rate may never become cathodically transport limited. In compacted buffer material, the corrosion rate appears to be limited by the rate of transport of copper species away from the corroding surface. The authors recommend that long-term predictions of container lifetime should be based on the known rate-determining step for the overall corrosion process. 8 refs

Nonlinear dynamic response of cantilever beam tip during atomic force microscopy (AFM) nanolithography of copper surface

International Nuclear Information System (INIS)

Yeh, Y-L; Jang, M-J; Wang, C-C; Lin, Y-P; Chen, K-S

2008-01-01

This paper investigates the nonlinear dynamic response of an atomic force microscope (AFM) cantilever beam tip during the nanolithography of a copper (Cu) surface using a high-depth feed. The dynamic motion of the tip is modeled using a combined approach based on Newton's law and empirical observations. The cutting force is determined from experimental observations of the piling height on the Cu surface and the rotation angle of the cantilever beam tip. It is found that the piling height increases linearly with the cantilever beam carrier velocity. Furthermore, the cantilever beam tip is found to execute a saw tooth motion. Both this motion and the shear cutting force are nonlinear. The elastic modulus in the y direction is variable. Finally, the velocity of the cantilever beam tip as it traverses the specimen surface has a discrete characteristic rather than a smooth, continuous profile

Reaction and nucleation mechanisms of copper electrodeposition on disposable pencil graphite electrode

Energy Technology Data Exchange (ETDEWEB)

Majidi, M.R. [Department of Analytical Chemistry, Faculty of Chemistry, University of Tabriz, 29th Bahman Bolvard, Tabriz 51664 (Iran, Islamic Republic of)], E-mail: sr.majidi@gmail.com; Asadpour-Zeynali, K.; Hafezi, B. [Department of Analytical Chemistry, Faculty of Chemistry, University of Tabriz, 29th Bahman Bolvard, Tabriz 51664 (Iran, Islamic Republic of)

2009-01-01

The reaction and nucleation mechanism of copper electrodeposition on disposable pencil graphite electrode (PGE) in acidic sulphate solution were investigated using cyclic voltammetry (CV) and chronoamperometry (CA) techniques, respectively. Electrochemical experiments were followed by morphological studies with scanning electron microscopy (SEM). The effect of some experimental parameters, namely copper concentration, pH, scan rate, background electrolyte, deposition potential, and conditioning surface of the electrode were described. At the surface of PGE, Cu{sup 2+} ions were reduced at -250 mV vs. SCE. It was found that electrodeposition of copper is affected by rough surface of PGE. The nucleation mechanisms were examined by fitting the experimental CA data into Scharifker-Hills nucleation models. The nuclei population densities were also determined by means of two common fitting models developed for three-dimensional nucleation and growth (Scharifker-Mostany and Mirkin-Nilov-Herrman-Tarallo). It was found that deposition potential and background electrolyte affect the distribution of the deposited copper. The morphology of the deposited copper is affected by background electrolyte.

Laser ablated copper plasmas in liquid and gas ambient

Science.gov (United States)

Kumar, Bhupesh; Thareja, Raj K.

2013-05-01

The dynamics of copper ablated plasma plumes generated using laser ablation of copper targets in both liquid (de-ionized water) and gas (air) ambients is reported. Using time and space resolved visible emission spectroscopy (450-650 nm), the plasma plumes parameters are investigated. The electron density (ne) determined using Stark broadening of the Cu I (3d104d1 2D3/2-3d104p1 2P3/2 at 521.8 nm) line is estimated and compared for both plasma plumes. The electron temperature (Te) was estimated using the relative line emission intensities of the neutral copper transitions. Field emission scanning electron microscopy and energy dispersive x-ray spectral analysis of the ablated copper surface indicated abundance of spherical nanoparticles in liquid while those in air are amalgamates of irregular shapes. The nanoparticles suspended in the confining liquid form aggregates and exhibit a surface plasmon resonance at ˜590 nm.

Synergistic Effect of L-Methionine and KI on Copper Corrosion Inhibition in HNO3 (1M

Directory of Open Access Journals (Sweden)

Amel SEDIK

2014-05-01

Full Text Available L-Methionine (L-Met efficiency as a non-toxic corrosion inhibitor for copper in 1M HNO3 has been studied by using electrochemical impedance spectroscopy (EIS and potentiodynamic polarization. Copper corrosion rate significant decrease was observed in the presence of L-Met at 10-4M. The Obtained Results from potentiodynamic polarization and impedance measurements are in good agreement. L-Methionine adsorption on copper surface follows Langmuir isotherm. L-Met free energy adsorption on copper (-30 KJ mol-1 reveals an inhibition strong physical adsorption on copper surface. In order to evaluate the L-Met effect, L-Met and iodide ion’synergistic effect was used to prevent copper corrosion in nitric acid. It was found that inhibitor efficiency (IE reached 98.27 % in 1M solution containing 10-4M L-Met and 10- 3 M KI. The synergistic effect was attributed to iodide ions adsorption on copper surface, which facilitated the L-Met adsorption and an inhibitive film formation.

Development of pits and cones on ion bombarded copper

International Nuclear Information System (INIS)

Tanovic, L.A.; Carter, G.; Nobes, M.J.; Whitton, I.L.; Williams, J.S.

1980-01-01

The formation of pits and cones on Ar ion bombarded copper has been studied. Carefully polished surfaces of large grained 99.999% pure copper crystals have been bombarded at normal incidence with 40 keV argon ions. The cone formation has been investigated for annealed and non-annealed crystals at room temperature and at 30 K and in the case of monocrystal and polycrystal samples. Although in the most other studies the presence of impurities is as a necessary condition for generation of cones and pits the obtained experimental results show that under certain conditions these features are formed on clean surfaces. It is shown that the dominant parameter in the production of cones on copper is the crystal orientation [ru

Fabrication of free-standing copper foils covered with highly-ordered copper nanowire arrays

Science.gov (United States)

Zaraska, Leszek; Sulka, Grzegorz D.; Jaskuła, Marian

2012-07-01

The through-hole nanoporous anodic aluminum oxide (AAO) membranes with relatively large surface area (ca. 2 cm2) were employed for fabrication of free-standing and mechanically stable copper foils covered with close-packed and highly-ordered copper nanowire arrays. The home-made AAO membranes with different pore diameters and interpore distances were fabricated via a two-step self-organized anodization of aluminum performed in sulfuric acid, oxalic acid and phosphoric acid followed by the pore opening/widening procedure. The direct current (DC) electrodeposition of copper was performed efficiently on both sides of AAO templates. The bottom side of the AAO templates was not insulated and consequently Cu nanowire arrays on thick Cu layers were obtained. The proposed template-assisted fabrication of free-standing copper nanowire array electrodes is a promising method for synthesis of nanostructured current collectors. The composition of Cu nanowires was confirmed by energy dispersive X-Ray spectroscopy (EDS) and X-ray diffraction (XRD) analyses. The structural features of nanowires were evaluated from field emission scanning electron microscopy (FE-SEM) images and compared with the characteristic parameters of anodic alumina membranes.

Fabrication of free-standing copper foils covered with highly-ordered copper nanowire arrays

International Nuclear Information System (INIS)

Zaraska, Leszek; Sulka, Grzegorz D.; Jaskuła, Marian

2012-01-01

The through-hole nanoporous anodic aluminum oxide (AAO) membranes with relatively large surface area (ca. 2 cm 2 ) were employed for fabrication of free-standing and mechanically stable copper foils covered with close-packed and highly-ordered copper nanowire arrays. The home-made AAO membranes with different pore diameters and interpore distances were fabricated via a two-step self-organized anodization of aluminum performed in sulfuric acid, oxalic acid and phosphoric acid followed by the pore opening/widening procedure. The direct current (DC) electrodeposition of copper was performed efficiently on both sides of AAO templates. The bottom side of the AAO templates was not insulated and consequently Cu nanowire arrays on thick Cu layers were obtained. The proposed template-assisted fabrication of free-standing copper nanowire array electrodes is a promising method for synthesis of nanostructured current collectors. The composition of Cu nanowires was confirmed by energy dispersive X-Ray spectroscopy (EDS) and X-ray diffraction (XRD) analyses. The structural features of nanowires were evaluated from field emission scanning electron microscopy (FE-SEM) images and compared with the characteristic parameters of anodic alumina membranes.

Copper-silver ionization at a US hospital: interaction of treated ...

Science.gov (United States)

Tap water sampling and surface analysis of copper pipe/bathroom porcelain were performed to explore the fate of copper and silver during the first nine months of copper-silver ionization (CSI) applied to cold and hot water at a hospital in Cincinnati, Ohio. Ions dosed by CSI into the water at its point of entry to the hospital were inadvertently removed from hot water by a cation-exchange softener in one building (average removal of 72% copper and 51% silver). Copper at the tap was replenished from corrosion of the building’s copper pipes but was typically unable to reach 200 µg/L in first-draw and flushed hot and cold water samples. Unlike copper, silver solubility was not restricted by the incoming water’s high pH of 8.5. Cold water lines had >20 µg/L silver at most of the taps that were sampled, which further increased after flushing. However, silver plating onto copper pipe surfaces (particularly in the hot water line) prevented reaching 20 µg/L silver in hot water of many taps. Aesthetically displeasing purple/grey stains in bathroom porcelain were attributed to chlorargyrite [AgCl(s)], an insoluble precipitate that formed when CSI-dosed Ag+ ions combined with Cl- ions that were present in the incoming water. Overall, CSI aims to control Legionella bacteria in drinking water, but plumbing material interactions, aesthetics and other implications also deserve consideration to holistically evaluate in-building drinking water disinfection. To inform the

Copper and Copper Proteins in Parkinson's Disease

Science.gov (United States)

Rivera-Mancia, Susana; Diaz-Ruiz, Araceli; Tristan-Lopez, Luis; Rios, Camilo

2014-01-01

Copper is a transition metal that has been linked to pathological and beneficial effects in neurodegenerative diseases. In Parkinson's disease, free copper is related to increased oxidative stress, alpha-synuclein oligomerization, and Lewy body formation. Decreased copper along with increased iron has been found in substantia nigra and caudate nucleus of Parkinson's disease patients. Copper influences iron content in the brain through ferroxidase ceruloplasmin activity; therefore decreased protein-bound copper in brain may enhance iron accumulation and the associated oxidative stress. The function of other copper-binding proteins such as Cu/Zn-SOD and metallothioneins is also beneficial to prevent neurodegeneration. Copper may regulate neurotransmission since it is released after neuronal stimulus and the metal is able to modulate the function of NMDA and GABA A receptors. Some of the proteins involved in copper transport are the transporters CTR1, ATP7A, and ATP7B and the chaperone ATOX1. There is limited information about the role of those biomolecules in the pathophysiology of Parkinson's disease; for instance, it is known that CTR1 is decreased in substantia nigra pars compacta in Parkinson's disease and that a mutation in ATP7B could be associated with Parkinson's disease. Regarding copper-related therapies, copper supplementation can represent a plausible alternative, while copper chelation may even aggravate the pathology. PMID:24672633

Experimental investigation of thermal emittance components of copper photocathode

Directory of Open Access Journals (Sweden)

H. J. Qian

2012-04-01

Full Text Available With progress of photoinjector technology, thermal emittance has become the primary limitation of electron beam brightness. Extensive efforts have been devoted to study thermal emittance, but experiment results differ between research groups and few can be well interpreted. Besides the ambiguity of photoemission mechanism, variations of cathode surface conditions during cathode preparation, such as work function, field enhancement factor, and surface roughness, will cause thermal emittance differences. In this paper, we report an experimental study of electric field dependence of copper cathode quantum efficiency (QE and thermal emittance in a radio frequency (rf gun, through which in situ cathode surface parameters and thermal emittance contributions from photon energy, Schottky effect, and surface roughness are extracted. It is found the QE of a copper cathode illuminated by a 266 nm UV laser increased substantially to 1.5×10^{-4} after cathode cleaning during rf conditioning, and a copper work function of 4.16 eV, which is much lower than nominal value (4.65 eV, was measured. Experimental results also show a thermal emittance growth as much as 0.92  mm mrad/mm at 50  MV/m due to the cathode surface roughness effect, which is consistent with cathode surface morphology measurements.

Separation of copper-64 from copper phthalocyanine

International Nuclear Information System (INIS)

Battaglin, R.I.M.

1979-01-01

The separation of copper-64 from irradiated copper phthalocyanine by Szilard-Chalmers effect is studied. Two methods of separation are used: one of them is based on the dissolution of the irradiated dry compound in concentrated sulfuric acid following its precipitation in water. In the other one the compound is irradiated with water in paste form following treatment with water and hydrochloric acid. The influence of the crystal form of the copper phthalocyanine on the separation yield of copper-64 is shown. Preliminary tests using the ionic exchange technique for purification and changing of copper-64 sulfate to chloride form are carried out. The specific activity using the spectrophotometric technique, after the determination of the copper concentration in solution of copper-64, is calculated. (Author) [pt

Nanosecond laser ablated copper superhydrophobic surface with tunable ultrahigh adhesion and its renewability with low temperature annealing

Science.gov (United States)

He, An; Liu, Wenwen; Xue, Wei; Yang, Huan; Cao, Yu

2018-03-01

Recently, metallic superhydrophobic surfaces with ultrahigh adhesion have got plentiful attention on account of their significance in scientific researches and industrial applications like droplet transport, drug delivery and novel microfluidic devices. However, the long lead time and transience hindered its in-depth development and industrial application. In this work, nanosecond laser ablation was carried out to construct grid of micro-grooves on copper surface, whereafter, by applying fast ethanol assisted low-temperature annealing, we obtained surface with superhydrophobicity and ultrahigh adhesion within hours. And the ultrahigh adhesion force was found tunable by varying the groove spacing. Using ultrasonic cleaning as the simulation of natural wear and tear in service, the renewability of superhydrophobicity was also investigated, and the result shows that the contact angle can rehabilitate promptly by the processing of ethanol assisted low-temperature annealing, which gives a promising fast and cheap circuitous strategy to realize the long wish durable metallic superhydrophobic surfaces in practical applications.

Fabrication of friction-reducing texture surface by selective laser melting of ink-printed (SLM-IP) copper (Cu) nanoparticles(NPs)

Science.gov (United States)

Wang, Xinjian; Liu, Junyan; Wang, Yang; Fu, Yanan

2017-02-01

This paper reports a process of selective laser melting of ink-printed (SLM-IP) copper (Cu) nanoparticles(NPs) for the fabrication of full dense Cu friction-reducing texture on the metallic surface in ambient condition. This technique synthesizes pure Cu by chemical reduction route using an organic solvent during laser melting in the atmosphere environment, and provides a flexible additive manufacture approach to form complex friction-reduction texture on the metallic surface. Microtextures of ring and disc arrays have been fabricated on the stainless steel surface by SLM-IP Cu NPs. The friction coefficient has been measured under the lubricating condition of the oil. Disc texture surface (DTS) has a relatively low friction coefficient compared with ring texture surface (RTS), Cu film surface (Cu-FS) and the untreated substrate. The study suggests a further research on SLM-IP approach for complex microstructure or texture manufacturing, possibly realizing its advantage of flexibility.

Eco-Friendly Inhibitors for Copper Corrosion in Nitric Acid: Experimental and Theoretical Evaluation

Science.gov (United States)

Savita; Mourya, Punita; Chaubey, Namrata; Singh, V. K.; Singh, M. M.

2016-02-01

The inhibitive performance of Vitex negundo, Adhatoda vasica, and Saraka asoka leaf extracts on corrosion of copper in 3M HNO3 solution was investigated using gravimetric, potentiodynamic polarization, and electrochemical impedance spectroscopic techniques. Potentiodynamic polarization studies indicated that these extracts act as efficient and predominantly cathodic mixed inhibitor. Thermodynamic parameters revealed that the adsorption of these inhibitors on copper surface was spontaneous, controlled by physiochemical processes and occurred according to the Langmuir adsorption isotherm. AFM examination of copper surface confirmed that the inhibitor prevented corrosion by forming protective layer on its surface. The correlation between inhibitive effect and molecular structure was ascertained by density functional theory data.

Electrochemical impedance study of copper in phosphate buffered solution

International Nuclear Information System (INIS)

Salimon, J.; Mohamad, M.; Yamin, B.M.; Kalaji, M.

2003-01-01

The processes occurring on the copper electrode surface in phosphate buffered solution were investigated using the Electrochemical Impedance Spectroscopy. The electrochemical behaviors of copper through their charge transfer resistance and double-layer capacitance at the onset of the hydrogen evolution region and the anodic passivation layer formation and diffusion of copper species at anodic potential regions are discussed. The specific adsorption of anions (hydroxide and/or H/sub 2/PO/sub 4/) occurred at potential less negative than -0.9V. Adsorbed hydrogen appeared at hydrogen evolution region at potential range of -1.5 to -1.0 V. The deposition of insoluble copper species occurred at anodic potential regions. (author)

Copper foliar sorption: study of cuticular uptake and penetration

International Nuclear Information System (INIS)

Chamel, Andre; Bougie, Bernadette

1977-01-01

Results show that copper is easily retained by enzymatically isolated cuticles from pear leaves discs. The sorption is very rapid during the first hour, then progressively slower with increasing time. Upper and lower cuticles exhibit the same sorption when immersed, but the sorption by the upper internal surface is greater than that by the external surface. Sorption depends on the dates of sampling of the leaves and vegetal species. The variation of the process with concentrations is hyperbolic. The retained copper may be partially exchanged: from 16 to 95% after 24 hours of exchange in a cupric solution, as the Cu concentration increases from 10 -6 to 10 -2 M. The penetration of copper through astomatous cuticular discs is extremely reduced if there is pure water in the receiver unit [fr

Using remote sensing imagery to monitoring sea surface pollution cause by abandoned gold-copper mine

Science.gov (United States)

Kao, H. M.; Ren, H.; Lee, Y. T.

2010-08-01

The Chinkuashih Benshen mine was the largest gold-copper mine in Taiwan before the owner had abandoned the mine in 1987. However, even the mine had been closed, the mineral still interacts with rain and underground water and flowed into the sea. The polluted sea surface had appeared yellow, green and even white color, and the pollutants had carried by the coast current. In this study, we used the optical satellite images to monitoring the sea surface. Several image processing algorithms are employed especial the subpixel technique and linear mixture model to estimate the concentration of pollutants. The change detection approach is also applied to track them. We also conduct the chemical analysis of the polluted water to provide the ground truth validation. By the correlation analysis between the satellite observation and the ground truth chemical analysis, an effective approach to monitoring water pollution could be established.

Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives

International Nuclear Information System (INIS)

Pasquale, M.A.; Gassa, L.M.; Arvia, A.J.

2008-01-01

Copper electrodeposition on copper from still plating solutions of different compositions was investigated utilising electrochemical impedance spectroscopy (EIS), cyclic voltammetry, and scanning electron microscopy (SEM). An acid copper sulphate plating base solution was employed either with or without sodium chloride in the presence of a single additive, either polyethylene glycol (PEG) or 3-mercapto-2-propanesulphonic acid (MPSA), and their mixture. Thallium underpotential deposition/anodic stripping was employed to determine the adsorption capability of additives on copper. In the absence of chloride ions, MPSA shows a moderate adsorption on copper, whereas PEG is slightly adsorbed. At low cathodic overpotentials, the simultaneous presence of MPSA and chloride ions accelerates copper electrodeposition through the formation of an MPSA-chloride ion complex in the solution, particularly for about 220 μM sodium chloride. The reverse effect occurs in PEG-sodium chloride plating solutions. In this case, from EIS data the formation of a film that interferes with copper electrodeposition can be inferred. At higher cathodic overpotentials, when copper electrodeposition is under mass transport control, the cathode coverage by a PEG-copper chloride-mediated film becomes either partially or completely detached as the concentration of chloride ions at the negatively charged copper surface diminishes. The copper cathode grain topography at the μm scale depends on the cathodic overpotential, plating solution composition and average current density. Available data about the solution constituents and their adsorption on copper make it possible to propose a likely complex mechanism to understand copper electrodeposition from these media, including the accelerating effect of MPSA and the dynamics of PEG-copper chloride complex adsorbate interfering with the surface mobility of depositing copper ad-ions/ad-atoms

Corrosion of copper and copper alloys in a basaltic repository environment

International Nuclear Information System (INIS)

Brehm, W.F.

1990-01-01

Corrosion testing done on copper and copper alloys in support of the basalt repository program is discussed. Tests were performed under anoxic conditions at 50C, 100C, 150C and 200C in the presence of a saturated basalt-bentonite packing. Tests were also performed in an air/steam mixture at temperatures between 150C and 200C. Some tests, particularly those in air/steam mixtures, were done in the presence of radiation fields of 10 2 , 10 3 or 10 4 rad/h. Exposure periods were up to 28 months. A synthetic groundwater, Grande Ronde ≠4, was used. The materials studied were ASTM B402μm·a for copper and 17 μm·a for cupronickel, but the average rates were muμm·a was obtained. The rates at longer times were less than a third of this value. Corrosion increased monotonically with time and temperature. Chalcocite (Cu 2 S) was the corrosion product at 200C. There was no detectable radiation effect, and no pitting was observed. In air/steam corrosion was uniform with no pitting. Linear corrosion was observed for pure copper. The maximum corrosion penetration after 25 months was 0.13 mm at 300C; cupronickel corroded more slowly, with a maximum penetration of 0.045mm after 25 months. Cuprite (Cu 2 O) and tenorite (CuO) were identified on cupronickel, but only Cu 2 O on copper. A pronounced radiation effect was seen at 250C, but not at 150C; the surface film morphology was different under irradiation. In the short term the presence of packing increased the corrosion rate. 5 refs

Synthesis of Quaternary Ammonium Salts Based on Diketopyrrolopyrroles Skeletons and Their Applications in Copper Electroplating.

Science.gov (United States)

Chen, Biao; Xu, Jie; Wang, Limin; Song, Longfeng; Wu, Shengying

2017-03-01

A series of DPP derivatives bearing quaternary ammonium salt centers with different lengths of carbon chains have been designed and synthesized. Their inhibition actions on copper electroplating were first investigated. A total of four diketopyrrolopyrrole (DPP) derivatives showed different inhibition capabilities on copper electroplating. To investigate interactions between metal surface and additives, we used quantum chemical calculations. Static and dynamic surface tension of four DPP derivatives had been measured, and the results showed DPP-10C (1c) with a faster-decreasing rate of dynamic surface tension among the four derivatives, which indicated higher adsorption rate of additive on the cathode surface and gives rise to stronger inhibiting effect of copper electrodeposition. Then, DPP-10C (1c) as the representative additive, was selected for the systematic study of the leveling influence during microvia filling through comprehensive electroplating tests. In addition, field-emission scanning electron microscope images and X-ray diffraction results showed the surface morphology, which indicated that addition of DPP derivative (1c) could lead a fine copper deposit and cause the preferential orientations of copper deposits to change from [220] to [111], which happened in particular at higher concentrations.

Smoothing an isolated interface of cobalt-copper under irradiation by low-energy argon ions

International Nuclear Information System (INIS)

Stognij, A.I.; Novitskij, N.N.; Stukalov, O.M.

2003-01-01

Multilayer film structures, i.e. gold layer-copper-cobalt, are considered. It is shown that the structure, where cobalt surface prior to copper layer deposition was subjected to additional irradiation by a flow of argon ions, features the smoothest surface. The conclusion is made about smoothing out of cobalt-copper interface as a result of multiple collisions of argon slow ions and cobalt atoms during braking within two or three upper atomic rows of the cobalt layer [ru

Influences of Au ion radiation on microstructure and surface-enhanced Raman scattering of nanoporous copper

Science.gov (United States)

Wang, Jing; Hu, Zhaoyi; Li, Rui; Liu, Xiongjun; Xu, Chuan; Wang, Hui; Wu, Yuan; Fu, Engang; Lu, Zhaoping

2018-05-01

In this work, effects of Au ion irradiation on microstructure and surface-enhanced Raman scattering (SERS) performance of nanoporous copper (NPC) were investigated. It is found that the microstructure of NPC could be tailored by the ion irradiation dose, i.e., the pore size decreases while the ligament size significantly coarsens with the increase of the irradiation dose. In addition, the SERS enhancement for rhodamine 6G molecules was improved by Au ions irradiation at an appropriate dose. The underlying mechanism of the increase of SERS enhancement resulted from ion irradiation was discussed. Our findings could provide a new way to tune nanoporosity of nanoporous metals and improve their SERS performance.

Determination of the threshold-energy surface for copper using in-situ electrical-resistivity measurements in the high-voltage electron microscope

International Nuclear Information System (INIS)

King, W.E.; Merkle, K.L.; Meshii, M.

1981-01-01

A detailed study of the anisotropy of the threshold energy for Frenkel-pair production in copper was carried out experimentally, using in-situ electrical-resistivity measurements in the high-voltage electron microscope. These electrical-resistivity measurements, which are sensitive to small changes in point-defect concentration, were used to determine the damage or defect production rate. Damage-rate measurements in copper single crystals were carried out for approx.40 incident electron-beam directions and six electron energies from 0.4 to 1.1 MeV. The total cross section for Frenkel-pair production is proportional to the measured damage rate and can be theoretically calculated if the form of the threshold-energy surface is known. Trial threshold-energy surfaces were systematically altered until a ''best fit'' of the calculated to the measured total cross sections for Frenkel-pair production was obtained. The average threshold energy of this surface is 28.5 eV. The minimum threshold energy is 18 +- 2 eV and is located near . A ring of very high threshold energy (>50 eV) surrounds the direction. A damage function for single-defect production was derived from this surface and was applied to defect-production calculations at higher recoil energies. This function rises rather sharply from a value of zero at 17 eV to 0.8 at 42 eV. It has the value of 0.5 at 24.5 eV. Above 30 eV the slope of the curve begins to decrease, reflecting the presence of the high-energy regions of the threshold-energy surface. Both topographical and quantitative comparisons of the present surface with those in the literature were presented. Based on a chi 2 goodness-of-fit test, the present surface was found to predict the experimentally observed total cross sections for Frenkel-pair production significantly better than the other available surfaces. Also, the goodness of fit varied substantially less with energy and direction for the present surface

Silane pre-treatments on copper and aluminium

International Nuclear Information System (INIS)

Deflorian, F.; Rossi, S.; Fedrizzi, L.

2006-01-01

A large part of aluminium products are coated with an organic layer in order to improve the corrosion resistance. Copper surfaces are also sometimes protected with an organic coating to improve the durability or the aesthetic properties. Examples of industrial applications are household appliances and heat exchanger components. For these applications it is not rare to have the industrial need to treat at the same time components made of aluminium and copper. In order to extend the service life of the organic coated copper a specific surface pre-treatment is often required. Nevertheless, probably because of the limited market of this application, no specific pre-treatments for copper are industrially developed, with the exception of cleaning procedures, but simply extensions of existing pre-treatments optimised for other metals (aluminium, zinc) are used. The application of silane pre-treatments as adhesion promoters for organic coated metals is remarkably increasing in the last decade, because silanes offer very good performance together with high environmental compatibility. The idea is therefore to try to develop a specific silane based pre-treatment for copper. The starting point is the existing silane products for aluminium, optimising the composition and the application conditions (concentration, temperature, pH of the bath, etc.) in order to develop a high performance copper alloy pre-treatment increasing the protective properties and the adhesion of a successively applied organic coating. Moreover these pre-treatments could be used for aluminium alloys too and therefore could be suggested for multi-metals components. The deposits were analysed using FTIR spectroscopy and optical and electron microscopic observations. A careful electrochemical characterisation, mainly by electrochemical impedance spectroscopy measurements (EIS) was carried out to highlight the presence of silane and to evaluate the performance of the different deposits. In order to study an

Laser ablated copper plasmas in liquid and gas ambient

Energy Technology Data Exchange (ETDEWEB)

Kumar, Bhupesh; Thareja, Raj K. [Department of Physics, Indian Institute of Technology Kanpur, Kanpur 208 016 (India)

2013-05-15

The dynamics of copper ablated plasma plumes generated using laser ablation of copper targets in both liquid (de-ionized water) and gas (air) ambients is reported. Using time and space resolved visible emission spectroscopy (450-650 nm), the plasma plumes parameters are investigated. The electron density (n{sub e}) determined using Stark broadening of the Cu I (3d{sup 10}4d{sup 1} {sup 2}D{sub 3/2}-3d{sup 10}4p{sup 1} {sup 2}P{sub 3/2} at 521.8 nm) line is estimated and compared for both plasma plumes. The electron temperature (T{sub e}) was estimated using the relative line emission intensities of the neutral copper transitions. Field emission scanning electron microscopy and energy dispersive x-ray spectral analysis of the ablated copper surface indicated abundance of spherical nanoparticles in liquid while those in air are amalgamates of irregular shapes. The nanoparticles suspended in the confining liquid form aggregates and exhibit a surface plasmon resonance at ∼590 nm.

[Biomineralization of copper in Candida fukuyamaensis RCL-3].

Science.gov (United States)

Irazusta, Verónica; Michel, Lucas; de Figueroa, Lucía I C

2016-01-01

Candida fukuyamaensis RCL-3 yeast has the ability to decrease copper concentration in a culture medium. High copper concentrations change the cell color from white/cream to brown. The effect of color change ceases with the addition of KCN or when cells are grown in a culture medium without sulfate ions. These results could be associated with CuS bioaccumulation in the cell surface. This report revealed that mineralization would be a mechanism used by this yeast for copper bioremediation. Copyright © 2016 Asociación Argentina de Microbiología. Publicado por Elsevier España, S.L.U. All rights reserved.

Experimenting with a Visible Copper-Aluminum Displacement Reaction in Agar Gel and Observing Copper Crystal Growth Patterns to Engage Student Interest and Inquiry

Science.gov (United States)

Xu, Xinhua; Wu, Meifen; Wang, Xiaogang; Yang, Yangyiwei; Shi, Xiang; Wang, Guoping

2016-01-01

The reaction process of copper-aluminum displacement in agar gel was observed at the microscopic level with a stereomicroscope; pine-like branches of copper crystals growing from aluminum surface into gel at a constant rate were observed. Students were asked to make hypotheses on the pattern formation and design new research approaches to prove…

Tuning of structural, light emission and wetting properties of nanostructured copper oxide-porous silicon matrix formed on electrochemically etched copper-coated silicon substrates

Science.gov (United States)

Naddaf, M.

2017-01-01

Matrices of copper oxide-porous silicon nanostructures have been formed by electrochemical etching of copper-coated silicon surfaces in HF-based solution at different etching times (5-15 min). Micro-Raman, X-ray diffraction and X-ray photoelectron spectroscopy results show that the nature of copper oxide in the matrix changes from single-phase copper (I) oxide (Cu2O) to single-phase copper (II) oxide (CuO) on increasing the etching time. This is accompanied with important variation in the content of carbon, carbon hydrides, carbonyl compounds and silicon oxide in the matrix. The matrix formed at the low etching time (5 min) exhibits a single broad "blue" room-temperature photoluminescence (PL) band. On increasing the etching time, the intensity of this band decreases and a much stronger "red" PL band emerges in the PL spectra. The relative intensity of this band with respect to the "blue" band significantly increases on increasing the etching time. The "blue" and "red" PL bands are attributed to Cu2O and porous silicon of the matrix, respectively. In addition, the water contact angle measurements reveal that the hydrophobicity of the matrix surface can be tuned from hydrophobic to superhydrophobic state by controlling the etching time.

Incorporation of copper nanoparticles into paper for point-of-use water purification

OpenAIRE

Dankovich, Theresa A.; Smith, James A.

2014-01-01

As a cost-effective alternative to silver nanoparticles, we have investigated the use of copper nanoparticles in paper filters for point-of-use water purification. This work reports an environmentally benign method for the direct in situ preparation of copper nanoparticles (CuNPs) in paper by reducing sorbed copper ions with ascorbic acid. Copper nanoparticles were quickly formed in less than 10 minutes and were well distributed on the paper fiber surfaces. Paper sheets were characterized by ...

Copper effects on bacterial activity of estuarine silty sediments

Science.gov (United States)

Almeida, Adelaide; Cunha, Ângela; Fernandes, Sandra; Sobral, Paula; Alcântara, Fernanda

2007-07-01

Bacteria of silty estuarine sediments were spiked with copper to 200 μg Cu g -1 dry weight sediment in order to assess the impact of copper on bacterial degradation of organic matter and on bacterial biomass production. Bacterial density was determined by direct counting under epifluorescence microscopy and bacterial production by the incorporation of 3H-Leucine. Leucine turnover rate was evaluated by 14C-leucine incorporation and ectoenzymatic activities were estimated as the hydrolysis rate of model substrates for β-glucosidase and leucine-aminopeptidase. The presence of added copper in the microcosms elicited, after 21 days of incubation, generalised anoxia and a decrease in organic matter content. The non-eroded surface of the copper-spiked sediment showed, when compared to the control, a decrease in bacterial abundance and significant lower levels of bacterial production and of leucine turnover rate. Bacterial production and leucine turnover rate decreased to 1.4% and 13% of the control values, respectively. Ectoenzymatic activities were also negatively affected but by smaller factors. After erosion by the water current in laboratory flume conditions, the eroded surface of the control sediment showed a generalised decline in all bacterial activities. The erosion of the copper-spiked sediment showed, however, two types of responses with respect to bacterial activities at the exposed surface: positive responses of bacterial production and leucine turnover rate contrasting with slight negative responses of ectoenzymatic activities. The effects of experimental erosion in the suspended cells were also different in the control and in the copper-spiked sediment. Bacterial cells in the control microcosm exhibited, when compared to the non-eroded sediment cells, decreases in all activities after the 6-h suspension. The response of the average suspended copper-spiked sediment cell differed from the control by a less sharp decrease in ectoenzymatic activities and

Copper and Copper Proteins in Parkinson’s Disease

Directory of Open Access Journals (Sweden)

Sergio Montes

2014-01-01

Full Text Available Copper is a transition metal that has been linked to pathological and beneficial effects in neurodegenerative diseases. In Parkinson’s disease, free copper is related to increased oxidative stress, alpha-synuclein oligomerization, and Lewy body formation. Decreased copper along with increased iron has been found in substantia nigra and caudate nucleus of Parkinson’s disease patients. Copper influences iron content in the brain through ferroxidase ceruloplasmin activity; therefore decreased protein-bound copper in brain may enhance iron accumulation and the associated oxidative stress. The function of other copper-binding proteins such as Cu/Zn-SOD and metallothioneins is also beneficial to prevent neurodegeneration. Copper may regulate neurotransmission since it is released after neuronal stimulus and the metal is able to modulate the function of NMDA and GABA A receptors. Some of the proteins involved in copper transport are the transporters CTR1, ATP7A, and ATP7B and the chaperone ATOX1. There is limited information about the role of those biomolecules in the pathophysiology of Parkinson’s disease; for instance, it is known that CTR1 is decreased in substantia nigra pars compacta in Parkinson’s disease and that a mutation in ATP7B could be associated with Parkinson’s disease. Regarding copper-related therapies, copper supplementation can represent a plausible alternative, while copper chelation may even aggravate the pathology.

Electrodeposited porous and amorphous copper oxide film for application in supercapacitor

Energy Technology Data Exchange (ETDEWEB)

Patake, V.D. [Thin Film Physics Laboratory, Department of Physics, Shivaji University, Kolhapur 416004, (M.S.) (India); Joshi, S.S. [Clean Energy Research Center, Korea Institute of Science and Technology, Cheongryang, Seoul 130-650 (Korea, Republic of); Lokhande, C.D. [Thin Film Physics Laboratory, Department of Physics, Shivaji University, Kolhapur 416004, (M.S.) (India); Clean Energy Research Center, Korea Institute of Science and Technology, Cheongryang, Seoul 130-650 (Korea, Republic of)], E-mail: l_chandrakant@yahoo.com; Joo, Oh-Shim [Clean Energy Research Center, Korea Institute of Science and Technology, Cheongryang, Seoul 130-650 (Korea, Republic of)], E-mail: joocat@kist.rre.kr

2009-03-15

In present study, the porous amorphous copper oxide thin films have been deposited from alkaline sulphate bath. The cathodic electrodeposition method was employed to deposit copper oxide film at room temperature on stainless steel substrate. Their structural and surface morphological properties were investigated by means of X-ray diffraction (XRD) and scanning electron micrograph (SEM), respectively. To propose this as a new material for possible application in the supercapacitor, its electrochemical properties have been studied in aqueous 1 M Na{sub 2}SO{sub 4} electrolyte using cyclic voltammetry. The structural analysis from XRD pattern showed the formation of amorphous copper oxide film on the substrate. The surface morphological studies from scanning electron micrographs revealed the formation of porous cauliflower-like copper oxide film. The cyclic voltammetric curves showed symmetric nature and increase in capacitance with increase in film thickness. The maximum specific capacitance of 36 F g{sup -1} was exhibited for the 0.6959 mg cm{sup -2} film thickness. This shows that low-cost copper oxide electrode will be a potential application in supercapacitor.

One-pot production of copper ferrite nanoparticles using a chemical method

Energy Technology Data Exchange (ETDEWEB)

Nishida, Naoki, E-mail: nnishida@rs.tus.ac.jp; Amagasa, Shota [Tokyo University of Science, Department of Chemistry (Japan); Kobayashi, Yoshio [The University of Electro-Communications, Department of Engineering Science (Japan); Yamada, Yasuhiro [Tokyo University of Science, Department of Chemistry (Japan)

2016-12-15

Copper ferrite nanoparticles were synthesized via the oxidation of precipitates obtained from the reaction of FeCl{sub 2}, CuSO{sub 4} and N{sub 2}H{sub 4} in the presence of gelatin. These copper ferrite particles were subsequently examined using powder X-ray diffraction (XRD), transmission electron microscopy (TEM), and Mössbauer spectroscopy. The average size of the copper ferrite nanoparticles was less than 5 nm, and they exhibited superparamagnetic behavior as a result of their small size. The low temperature Mössbauer spectrum exhibited three sets of sextets, two corresponding to the tetrahedral and octahedral sites of the copper spinel structure and one with small hyperfine magnetic field corresponding to the surface or defects of the nanoparticles. When the ratio of copper salt was increased, the tetrahedral site became preferable for copper, and metallic copper and copper ferrite were both present in a single nanoparticle.

Normal macrophage function in copper deficient mice

International Nuclear Information System (INIS)

Lukasewycz, O.A.; Kolquist, K.L.; Prohaska, J.R.

1986-01-01

Copper deficiency (-Cu) was produced in C57 BL and C58 mice by feeding a low copper diet (modified AIN-76A) from birth. Mice given supplemental copper in the drinking water (+Cu) served as controls. Copper status was monitored by assay of ceruloplasmin (CP) activity. Macrophages (M0) were obtained from matched +Cu and -Cu male 7 week-old mice by peritoneal lavage 3 days after thioglycollate stimulation. M0 were assayed in terms of lipopolysaccharide-induced hexose monophosphate shunt activity by monitoring 14 CO 2 production from [1- 14 C]-glucose and by the determination of phagocytic index using fluorescein labelled latex bead ingestion. M0 from -Cu mice were equivalent to those of +Cu mice in both these parameters. However, superoxide dismutase and cytochrome oxidase activities were both significantly lower in -Cu M0, confirming a functional copper deficiency. Previous results from this laboratory have shown that -Cu mice have a decreased antibody response to sheep erythrocyte antigens and a diminished reactivity to B and T cell mitogens. These immunological insufficiencies appear to be proportional to the severity of copper depletion as determined by CP levels. Furthermore, -Cu lymphocytes exhibit depressed mixed lymphocyte reactivity consistent with alterations at the membrane surface. The present results suggest that M0/monocytes are less severely affected than lymphocytes in copper deficiency states

A Facile Fabrication of Silver-Coated Copper Nanowires by Galvanic Replacement

Directory of Open Access Journals (Sweden)

Xin He

2016-01-01

Full Text Available We demonstrated a general strategy to fabricate silver-coated copper nanowires by a galvanic replacement, which is guided by the chemical principle that metal ions (silver ions with a relatively high reduction potential can galvanically etch nanostructure made from a less metal (copper. Well-dispersed and high-yielded copper nanowires were initially synthesized and then introduced into silver-ammonia solution for the growth of silver nanocrystals on the nanowire surfaces under vigorous oscillation. The results of X-ray diffraction, scanning electron microscope, and transmission electron microscope revealed that the silver nanocrystals were uniformly distributed on the copper nanowire surfaces to form Cu-Ag heterostructures. The concentration of silver-ammonia solution and the time of replacement reaction determine the size and density of the silver nanocrystals. Our investigation might pave the way to the synthesis of other bimetallic nanostructures via a facile, fast, and economical route.

Copper carrier protein in copper toxic sheep liver

Energy Technology Data Exchange (ETDEWEB)

Harris, A L; Dean, P D.G.

1973-01-01

The livers of copper-toxic sheep have been analyzed by gel electrophoresis followed by staining the gels for copper with diethyldithiocarbamate and for protein with amido schwartz. These gels were compared with similar gels obtained from the livers of normal and copper-deficient animals. The copper-toxic livers contained an extra protein band which possessed relatively weakly bound copper. Possible origins of this protein are discussed. 8 references, 1 figure, 2 tables.

Bioflotation of sulfide minerals with Acidithiobacillus ferrooxidans in relation to copper activation and surface oxidation.

Science.gov (United States)

Pecina-Treviño, E T; Ramos-Escobedo, G T; Gallegos-Acevedo, P M; López-Saucedo, F J; Orrantia-Borunda, E

2012-09-01

Surface oxidation of sulfides and copper (Cu) activation are 2 of the main processes that determine the efficiency of flotation. The present study was developed with the intention to ascertain the role of the phenomena in the biomodification of sulfides by Acidithiobacillus ferrooxidans culture (cells and growth media) and their impact in bioflotation. Surface characteristics of chalcopyrite, sphalerite, and pyrrhotite, alone and in mixtures, after interaction with A. ferrooxidans were evaluated. Chalcopyrite floatability was increased substantially by biomodification, while bacteria depressed pyrrhotite floatability, favoring separation. The results showed that elemental sulfur concentration increased because of the oxidation generated by bacterial cells, the effect is intensified by the Fe(III) left in the culture and by galvanic contact. Acidithiobacillus ferrooxidans culture affects the Cu activation of sphalerite. The implications of elemental sulfur concentration and Cu activation of sphalerite are key factors that must be considered for the future development of sulfide bioflotation processes, since the depressive effect of cells could be counteracted by elemental sulfur generation.

Electronic and magnetic coupling of iron and copper phthalocyanine to ferromagnetic Co(100) surfaces

Energy Technology Data Exchange (ETDEWEB)

Schmidt, Felix; Sauther, Jens; Lach, Stefan; Ziegler, Christiane [Department of Physics, University of Kaiserslautern, Erwin Schroedinger Str. 56, D-67663 Kaiserslautern (Germany); Ali, Ehesan; Oppeneer, Peter [Department of Physics and Materials Science, Box 530, Uppsala University, S-75121 Uppsala (Sweden)

2009-07-01

Metallo-phthalocyanines are organic semiconductors which show in certain cases promising magnetic properties, advertising them for use in organic spintronics. Here, copper (CuPc) and iron phthalocyanine (FePc) were grown on ultra thin layers of Co(100) substrates with well known highly spin-polarized electron injection capability. Photoelectron spectroscopy (XPS) reveals different interactions between the pyrolytic nitrogen atoms and the cobalt surface for the two phthalocyanines. The analysis of the different multiplet structures appearing for the nitrogen core levels in the submonolayer regime and UPS investigations of the valence band electronic structure of the Co dominated region near the Fermi level indicates a particularly electronic coupling and a rehybridisation of the molecular orbitals with the cobalt orbitals. In order to clarify the influence of the two different central atoms on the electronic- and subsequently the magnetic coupling to the Co substrate, theoretical calculations using the GGA and GGA+U methodologies on a structure of Fe/Cu-phthalocyanine adsorbed on a 3-layered cobalt surface were performed indicating a ferromagnetic coupling between FePc and Co.

Tendency of the 18-8 type corrosion-resistant steel to cracking in automatic building-up of copper and copper base alloys in argon

International Nuclear Information System (INIS)

Abramovich, V.R.; Andronik, V.A.

1978-01-01

Studied was the tendency of the 18-8 type corrosion-resistant steel to cracking during automatic building-up of copper and bronze in argon. The investigation was carried out on the 0kh18n10t steel in argon. It had been established, that the degree of copper penetration into the steel inceases with the increase in the time of the 0Kh18n10t steel contact with liquid copper. Liquid copper and copper base alloys have a detrimental effect on mechanical properties of the steel under external tensile load during intercontant. It is shown that in building-up of copper base alloys on the steel-0Kh18n10t, tendency of the steel to cracking decreases with increase in stiffness of a surfaced weld metal plate and with decrease in building-up energy per unit length. The causes of macrocracking in steel at building-up non-ferrous metals are explained. The technological procedures to avoid cracking are suggested

Fabrication of stable and durable superhydrophobic surface on copper substrates for oil-water separation and ice-over delay.

Science.gov (United States)

Guo, Jie; Yang, Fuchao; Guo, Zhiguang

2016-03-15

We report a simple and rapid method to fabricate superhydrophobic films on copper substrates via Fe(3+) etching and octadecanethiol (ODT) modification. The etching process can be as short as 5 min and the ODT treatment only takes several seconds. In addition, the whole process is quite flexible in reaction time. The superhydrophobicity of as-prepared surfaces is mechanically durable and chemically stable, which have great performance in oil-water separation and ice-over resistance. Copyright © 2015 Elsevier Inc. All rights reserved.

Infrared spectroscopic and voltammetric study of adsorbed CO on stepped surfaces of copper monocrystalline electrodes

International Nuclear Information System (INIS)

Koga, O.; Teruya, S.; Matsuda, K.; Minami, M.; Hoshi, N.; Hori, Y.

2005-01-01

Voltammetric and infrared (IR) spectroscopic measurements were carried out to study adsorbed CO on two series of copper single crystal electrodes n(111)-(111) and n(111)-(100) in 0.1M KH 2 PO 4 +0.1M K 2 HPO 4 at 0 o C. Reversible voltammetric waves were observed below -0.55V versus SHE for adsorption of CO which displaces preadsorbed phosphate anions. The electric charge of the redox waves is proportional to the step atom density for both single crystal series. This fact indicates that phosphate anions are specifically adsorbed on the step sites below -0.55V versus SHE. Voltammetric measurements indicated that (111) terrace of Cu is covered with adsorbed CO below -0.5V versus SHE. Nevertheless, no IR absorption band of adsorbed CO is detected from (111) terrace. Presence of adsorbed CO on (111) terrace is presumed which is not visible by the potential difference spectroscopy used in the present work. IR spectroscopic measurements showed that CO is reversibly adsorbed with an on-top manner on copper single crystal electrodes of n(111)-(111) and n(111)-(100) with approximately same wavenumber of C?O stretching vibration of 2070cm -1 . The IR band intensity is proportional to the step atom density. Thus CO is adsorbed on (111) or (100) steps on the single crystal surfaces. An analysis of the IR band intensity suggested that one CO molecule is adsorbed on every two or more Cu step atom of the monocrystalline surface. The spectroscopic data were compared with those reported for uhv system. The C-O stretching wavenumber of adsorbed CO in the electrode-electrolyte system is 30-40cm -1 lower than those in uhv system

Surface structure of ultrathin metal films deposited on copper single crystals

International Nuclear Information System (INIS)

Butterfield, M.T.

2000-04-01

Ultrathin films of Cobalt, Iron and Manganese have been thermally evaporated onto an fcc Copper (111) single crystal substrate and investigated using a variety of surface structural techniques. The small lattice mismatch between these metals and the Cu (111) substrate make them an ideal candidate for the study of the phenomena of pseudomorphic film growth. This is important for the understanding of the close relationship between film structure and magnetic properties. Growing films with the structure of their substrate rather than their bulk phase may provide an opportunity to grow materials with novel physical and magnetic properties, and hence new technological applications. Both Cobalt and Iron have been found to initially maintain a registry with the fcc Cu (111) surface in a manner consistent with pseudomorphic growth. This growth is complicated by island rather than layer by layer growth in the initials stages of the film. In both cases a change in the structure of the film seems to occur at a point where the coalescence of islands in the film may be expected to occur. When the film does change structure they do not form a perfect overlayer with the structure of their bulk counterpart. The films do contain a number of features representative of the bulk phase but also contain considerable disorder and possibly remnants of fcc (111) structure. The order present in these films can be greatly improved by annealing. Manganese appears to grow with an fcc Mn (111) lattice spacing and there is no sign of a change in structure in films of up to 4.61 ML thick. The gradual deposition and annealing of a film to 300 deg. C, with a total deposition time the same as that for a 1 ML thick film, causes a surface reconstruction to occur that is apparent in a R30 deg. (√3 x √3) LEED pattern. This is attributed to the formation of a surface alloy, which is also supported by the local expansion of the Cu lattice in the (111) direction. (author)

Support Functionalization To Retard Ostwald Ripening in Copper Methanol Synthesis Catalysts

NARCIS (Netherlands)

van den Berg, Roy; Parmentier, Tanja E.; Elkjaer, Christian F.; Gommes, Cedric J.; Sehested, Jens; Helveg, Stig; de Jongh, Petra E.; de Jong, Krijn P.

A main reason for catalyst deactivation in supported catalysts for methanol synthesis is copper particle growth. We have functionalized the support surface in order to suppress the formation and/or transport of mobile copper species and thereby catalyst deactivation. A Stober silica support was

Optimization of copper electroplating process applied for microfabrication on flexible polyethylene terephthalate substrate

International Nuclear Information System (INIS)

Le, Nguyen Ngan; Hue Phan, Thi Cam; Le, Anh Duy; Dung Dang, Thi My; Dang, Mau Chien

2015-01-01

Electroplating is an important step in microfabrication in order to increase thickness of undersized parts up to a few micrometers with a low-cost, fast method that is easy to carry out, especially for metals such as copper, nickel, and silver. This important step promotes the development of the fabrication technology of electronic devices on a flexible substrate, also known as flexible electronic devices. Nevertheless, this technology has some disadvantages such as low surface uniformity and high resistivity. In this paper, parameters of copper electroplating were studied, such as the ratio of copper (II) sulfate (CuSO_4) concentration to sulfuric acid (H_2SO_4) concentration and electroplating current density, in order to obtain low resistivity and high surface uniformity of the copper layer. Samples were characterized by scanning electron microscopy (SEM), four-point probe, and surface profiler. The results showed that the sample resistivity could be controlled from about 2.0 to about 3.5 μΩ · cm, and the lowest obtained resistivity was 1.899 μΩ · cm. In addition, surface uniformity of the electroplated copper layer was also acceptable. The thickness of the copper layer was about 10 μm with an error of about 0.5 μm. The most suitable conditions for the electroplating process were CuSO_4 concentration of 0.4 mol l"−"1, H_2SO_4 concentration of 1.0 mol l"−"1, and low electroplating current density of 10–20 mA cm"−"2. All experiments were performed on a flexible polyethylene terephthalate (PET) substrate. (paper)

Surface Modification of C17200 Copper-Beryllium Alloy by Plasma Nitriding of Cu-Ti Gradient Film

Science.gov (United States)

Zhu, Y. D.; Yan, M. F.; Zhang, Y. X.; Zhang, C. S.

2018-03-01

In the present work, a copper-titanium film of gradient composition was firstly fabricated by the dual magnetron sputtering through power control and plasma nitriding of the film was then conducted to modify C17200 Cu alloy. The results showed that the prepared gradient Cu-Ti film by magnetron sputtering was amorphous. After plasma nitriding at 650 °C, crystalline Cu-Ti intermetallics appeared in the multi-phase coating, including CuTi2, Cu3Ti, Cu3Ti2 and CuTi. Moreover, even though the plasma nitriding duration of the gradient Cu-Ti film was only 0.5 h, the mechanical properties of the modified Cu surface were obviously improved, with the surface hardness enhanced to be 417 HV0.01, the wear rate to be 0.32 × 10-14 m3/Nm and the friction coefficient to be 0.075 at the load of 10 N, which are all more excellent than the C17200 Cu alloy. In addition, the wear mechanism also changed from adhesion wear for C17200 Cu substrate to abrasive wear for the modified surface.

Psychological well-being in out-patients with eating disorders: a controlled study.

Science.gov (United States)

Tomba, Elena; Offidani, Emanuela; Tecuta, Lucia; Schumann, Romana; Ballardini, Donatella

2014-04-01

Positive functioning is widely neglected in research on eating disorders (EDs). The aim of this exploratory study was to assess psychological well-being (PWB) in out-patients with ED and in controls. The authors assessed PWB in 245 out-patients with EDs [105 with bulimia nervosa (BN), 57 with anorexia nervosa (AN), and 83 with binge eating disorder (BED) who met DSM-IV-TR] and 60 controls. They tested whether PWB was associated with eating attitude test (EAT) scores and if such associations differed among ED groups while taking into account confounding variables. Significant differences between groups in all PWB scales were found. While individuals with BN reported significantly lower scores in all PWB dimensions than healthy controls, patients with BED scored significantly lower than controls in PWB autonomy, environmental mastery, and self-acceptance scales. Patients with AN showed similar scores to controls in all PWB dimensions, except for positive relationships and self-acceptance. In all ED groups, most PWB dimensions resulted significantly and negatively associated with EAT scales, except for AN where oral control was found to positively correlate with a high sense of purpose in life. All results were maintained even after adjusting for possible confounding variables. Patients with EDs reported an impairment in PWB. The paucity of PWB was not necessarily dependent on the presence of high levels of psychological distress and on the severity of the disorder. Such assessments may therefore yield a more comprehensive evaluation in this clinical population. Copyright © 2013 Wiley Periodicals, Inc.

Family routines within the ecological niche: An analysis of the psychological well-being of U.S. caregivers of children with disabilities

Directory of Open Access Journals (Sweden)

Elizabeth Ann Larson

2014-05-01

Full Text Available Using mixed methods, this study examined the relationship of caregivers of children with disabilities’ psychological well-being and their orchestration of daily routines within their ecological niche. Thirty-nine U.S. caregivers completed in-depth interviews, Psychological Well-being Scales (PWB, and Family Time and Routines Index (FTRI. We used a multi-step analysis. Interview data was coded and vignettes created without knowledge of PWB and FTRI ratings. Next, the relationship of quantitative measures was analyzed. Four groups were created using FTRI-extent and PWB means: (1 low routine-low PWB, (2 low routine-high PWB, (3 high routine-low PWB, and (4 high routine-high PWB. We examined qualitative differences in key features between groups. Findings: Total PWB and FTRI scores were not significantly correlated, PWB Purpose in Life and FTRI-extent scores were moderately positively correlated, and PWB Environmental Mastery and FTRI-extent correlation approached significance. Qualitative findings describe caregivers’ structuring of routines, intensity of oversight, support in routines, management of dinner, paid work, and needs for respite. The four groups differed in paid work, household support, degree the child could self-occupy, Environmental Mastery, and opportunities to recuperate. Caregivers with higher levels of well-being and more regular routines did paid work, had supportive spouses, had children who more often could follow routines, had higher Environmental Mastery, could orchestrate a family meal, and had breaks from care in either work or leisure. All Native American caregivers and Mexican American caregivers with spouses were in the high routine-high PWB group. Insight into this complex negotiation between family members within daily routines may provide practitioners a better understanding of how to work within family circles to foster therapeutic alliances, identify focused intervention targets, and promote positive family

Copper and copper-nickel-alloys - An overview

Energy Technology Data Exchange (ETDEWEB)

Klassert, Anton; Tikana, Ladji [Deutsches Kupferinstitut e.V. Am Bonneshof 5, 40474 Duesseldorf (Germany)

2004-07-01

With the increasing level of industrialization the demand for and the number of copper alloys rose in an uninterrupted way. Today, the copper alloys take an important position amongst metallic materials due to the large variety of their technological properties and applications. Nowadays there exist over 3.000 standardized alloys. Copper takes the third place of all metals with a worldwide consumption of over 15 millions tons per year, following only to steel and aluminum. In a modern industrial society we meet copper in all ranges of the life (electro-technology, building and construction industry, mechanical engineering, automotive, chemistry, offshore, marine engineering, medical applications and others.). Copper is the first metal customized by humanity. Its name is attributed to the island Cyprus, which supplied in the antiquity copper to Greece, Rome and the other Mediterranean countries. The Romans called it 'ore from Cyprus' (aes cyprium), later cuprum. Copper deposited occasionally also dapper and could be processed in the recent stone age simply by hammering. Already in early historical time copper alloys with 20 to 50 percent tin was used for the production of mirrors because of their high reflecting power. Although the elementary nickel is an element discovered only recently from a historical perspective, its application in alloys - without any knowledge of the alloy composition - occurred at least throughout the last 2.000 years. The oldest copper-nickel coin originates from the time around 235 B.C.. Only around 1800 AD nickel was isolated as a metallic element. In particular in the sea and offshore technology copper nickel alloys found a broad field of applications in piping systems and for valves and armatures. The excellent combination of characteristics like corrosion resistance, erosion stability and bio-fouling resistance with excellent mechanical strength are at the basis of this success. An experience of many decades supports the use

Impact of chlorinated disinfection on copper corrosion in hot water systems

Energy Technology Data Exchange (ETDEWEB)

Montes, J. Castillo [Centre Scientifique et Technique du Bâtiment Nantes, 11 rue Henri Picherit, BP 82341, 44323 Nantes Cedex 03 (France); Laboratoire des Sciences de l’Ingénieur pour l’Environnement, UMR-CNRS 7356, Université de La Rochelle, Avenue Michel Crépeau, 17042 La Rochelle Cedex 1 (France); Hamdani, F. [Laboratoire des Sciences de l’Ingénieur pour l’Environnement, UMR-CNRS 7356, Université de La Rochelle, Avenue Michel Crépeau, 17042 La Rochelle Cedex 1 (France); Creus, J., E-mail: jcreus@univ-lr.fr [Laboratoire des Sciences de l’Ingénieur pour l’Environnement, UMR-CNRS 7356, Université de La Rochelle, Avenue Michel Crépeau, 17042 La Rochelle Cedex 1 (France); Touzain, S. [Laboratoire des Sciences de l’Ingénieur pour l’Environnement, UMR-CNRS 7356, Université de La Rochelle, Avenue Michel Crépeau, 17042 La Rochelle Cedex 1 (France); Correc, O. [Centre Scientifique et Technique du Bâtiment Nantes, 11 rue Henri Picherit, BP 82341, 44323 Nantes Cedex 03 (France)

2014-09-30

Highlights: • Impact of disinfectant treatment on the durability of copper pipes. • Synergy between disinfectant concentration and temperature. • Pitting corrosion of copper associated to the corrosion products formation on copper. - Abstract: In France, hot water quality control inside buildings is occasionally ensured by disinfection treatments using temperature increases or addition of sodium hypochlorite (between 0.5 ppm and 1 ppm residual free chlorine). This disinfectant is a strong oxidiser and it could interact with metallic pipes usually used in hot water systems. This work deals with the study of the impact of these treatments on the durability of copper pipes. The objective of this work was to investigate the influence of sodium hypochlorite concentration and temperature on the copper corrosion mechanism. Copper samples were tested under dynamic and static conditions of ageing with sodium hypochlorite solutions ranging from 0 to 100 ppm with temperature at 50 °C and 70 °C. The efficiency of a corrosion inhibitor was investigated in dynamic conditions. Visual observations and analytical analyses of the internal surface of samples was studied at different ageing duration. Corrosion products were characterised by X-ray diffraction and Raman spectroscopy. Temperature and disinfectant were found to considerably affect the copper corrosion mechanism. Surprisingly, the corrosiveness of the solution was higher at lower temperatures. The temperature influences the nature of corrosion products. The protection efficiency is then strongly depend on the nature of the corrosion products formed at the surface of copper samples exposed to the aggressive solutions containing different concentration of disinfectant.

Electric and electrochemical properties of surface films formed on copper in the presence of bicarbonate anions

International Nuclear Information System (INIS)

Sirkiae, P.; Saario, T.; Maekelae, K.; Laitinen, T.; Bojinov, M.

1999-01-01

Copper is used as an outer shield of cast iron canisters planned for storage of spent nuclear fuel. The copper shield is responsible for the corrosion protection of the canister. The aim of the present work was to study the influence of bicarbonate (HCO 3 - ) anions on the stability of the copper oxide film. The work consists of a brief literature survey and an experimental part, in which voltammetry, electrochemical impedance spectroscopy and dc resistance measurements via the Contact Electric Resistance (CER) technique were used. The studies reported in the literature indicated that HCO 3 - ions increase the solubility of copper in the stability region of Cu(II). Thus they render the oxide film formed on copper susceptible to local damage and to localised corrosion at high potentials. Unfortunately, despite the great importance of bicarbonates in copper corrosion, most of the environments used in the electrochemical and corrosion studies are not comparable with repository conditions. In the existing studies either the bicarbonate concentrations or pH of the solutions were too high. In addition, no such studies were available, in which not only the effect of carbonate ions, but also possible synergetic effects of them with other aggressive ions would have been clarified. The voltammetric results of the experimental part of this work point to a bilayer structure of the anodic film on copper in neutral solutions containing HCO 3 - ions. The transport of ionic defects through a thin continuous p-type semiconductor layer was concluded to be the rate limiting step of the anodic oxidation of copper in the stability region of monovalent copper and in the mixed oxide (Cu(I)/Cu(II) oxide) region. Films formed in the divalent copper region did not show well-pronounced semiconductor behaviour. Substantial evidence was found in the voltammetric, CER and impedance results for the increased defectiveness of the anodic film in the Cu(II) region. The oxidation rate of copper in

Electric and electrochemical properties of surface films formed on copper in the presence of bicarbonate anions

Energy Technology Data Exchange (ETDEWEB)

Sirkiae, P.; Saario, T.; Maekelae, K.; Laitinen, T.; Bojinov, M. [VTT Manufacturing Technology, Espoo (Finland)

1999-11-01

Copper is used as an outer shield of cast iron canisters planned for storage of spent nuclear fuel. The copper shield is responsible for the corrosion protection of the canister. The aim of the present work was to study the influence of bicarbonate (HCO{sub 3}{sup -}) anions on the stability of the copper oxide film. The work consists of a brief literature survey and an experimental part, in which voltammetry, electrochemical impedance spectroscopy and dc resistance measurements via the Contact Electric Resistance (CER) technique were used. The studies reported in the literature indicated that HCO{sub 3}{sup -} ions increase the solubility of copper in the stability region of Cu(II). Thus they render the oxide film formed on copper susceptible to local damage and to localised corrosion at high potentials. Unfortunately, despite the great importance of bicarbonates in copper corrosion, most of the environments used in the electrochemical and corrosion studies are not comparable with repository conditions. In the existing studies either the bicarbonate concentrations or pH of the solutions were too high. In addition, no such studies were available, in which not only the effect of carbonate ions, but also possible synergetic effects of them with other aggressive ions would have been clarified. The voltammetric results of the experimental part of this work point to a bilayer structure of the anodic film on copper in neutral solutions containing HCO{sub 3}{sup -}ions. The transport of ionic defects through a thin continuous p-type semiconductor layer was concluded to be the rate limiting step of the anodic oxidation of copper in the stability region of monovalent copper and in the mixed oxide (Cu(I)/Cu(II) oxide) region. Films formed in the divalent copper region did not show well-pronounced semiconductor behaviour. Substantial evidence was found in the voltammetric, CER and impedance results for the increased defectiveness of the anodic film in the Cu(II) region. The

Control of biofouling on titanium condenser tubes with the use of electroless copper plating

International Nuclear Information System (INIS)

Anandkumar, B.; George, R.P.; Kamachi Mudali, U.; Ramachandran, D.

2015-01-01

In sea water environments titanium condenser tubes face serious issues of biofouling and biomineralization. Electroless plating of nanocopper film is attempted inside the tubes for the control of biofilm formation. Using advanced techniques like AFM, SEM, and XPS, electroless copper plated flat Ti specimens were characterized. Examination of Cu coated Ti surfaces using AFM and SEM showed more reduction in the microroughness compared to anodized Ti surface. Cu 2p 3/2 peak in XPS spectral analysis showed the shift in binding energy inferring the reduction of the hydroxide to metallic copper. Tubular specimens were exposed to sea water up to three months and withdrawn at monthly intervals to evaluate antibacterial activity and long term stability of the coating. Total viable counts and epifluorescence microscopy analyses showed two orders decrease in bacterial counts on copper coated Ti specimens when compared to as polished control Ti specimens. Molecular biology techniques like DGGE and protein expression analysis system were done to get insight into the community diversity and copper tolerance of microorganisms. DGGE gel bands clearly showed the difference in the bacterial diversity inferring from the 16S rRNA gene fragments (V3 regions). Protein analysis showed distinct protein spots appearing in electroless copper coated Ti biofilm protein samples in addition to protein spots common to both the biofilms of Cu coated and as polished Ti. The results indicated copper accumulating proteins in copper resistant bacterial species of biofilm. Reduced microroughness of the surface and toxic copper ions resulted in good biofouling control even after three months exposure to sea water. (author)

Characterization of copper oxides, iron oxides, and zinc copper ferrite desulfurization sorbents by X-ray photoelectron spectroscopy and scanning electron microscopy

Science.gov (United States)

Siriwardane, Ranjani V.; Poston, James A.

1993-05-01

Characterization of copper oxides, iron oxides, and zinc copper ferrite desulfurization sorbents was performed by X-ray photoelectron spectroscopy and scanning electron microscopy/energy-dispersive spectroscopy at temperatures of 298 to 823 K. Analysis of copper oxides indicated that the satellite structure of the Cu22p region was absent in the Cu(I) state but was present in the Cu(II) state. Reduction of CuO at room temperature was observed when the ion gauge was placed close to the sample. The satellite structure was absent in all the copper oxides at 823 K in vacuum. Differentiation of the oxidation state of copper utilizing both Cu(L 3M 4,5M 4,5) X-ray-induced Auger lines and Cu2p satellite structure, indicated that the copper in zinc copper ferrite was in the + 1 oxidation state at 823 K. This + 1 state of copper was not significantly changed after exposure to H 2, CO, and H 2O. There was an increase in Cu/Zn ratio and a decrease in Fe/Zn ratio on the surface of zinc copper ferrite at 823 K compared to that at room temperature. These conditions of copper offered the best sulfidation equilibrium for the zinc copper ferrite desulfurization sorbent. Analysis of iron oxides indicated that there was some reduction of both Fe 2O 3 and FeO at 823K. The iron in zinc copper ferrite was similar to that of Fe 2O 3 at room temperature but there was some reduction of this Fe(III) state to Fe(II) at 823 K. This reduction was more enhanced in the presence of H 2 and CO. Reduction to Fe(II) may not be desirable for the lifetime of the sorbent.

On the question of how the natural migration of copper in Lake Onega

Directory of Open Access Journals (Sweden)

Belkina Natalia Alexandrovna

2012-03-01

Full Text Available Features of the natural migration of copper in Lake Onega studied. It is shown that under conditions of surface water the copper is present in a state of Cu (II in ionic form. The forms of migration are change depending on the physic-chemical characteristics of the environment. The main part of the copper enters the lake from river runoff, the proportion of rainfall and ground water in total coming of copper is low.

Influence of titanium oxide films on copper nucleation during electrodeposition

International Nuclear Information System (INIS)

Chang, Hyun K.; Choe, Byung-Hak; Lee, Jong K.

2005-01-01

Copper electrodeposition has an important industrial role because of various interconnects used in electronic devices such as printed wire boards. With an increasing trend in device miniaturization, in demand are void-free, thin copper foils of 10 μm thick or less with a very low surface profile. In accordance, nucleation kinetics of copper was studied with titanium cathodes that were covered with thin, passive oxide films of 2-3 nm. Such an insulating oxide layer with a band gap of 3 eV is supposed to nearly block charge transfer from the cathode to the electrolyte. However, significant nucleation rates of copper were observed. Pipe tunneling mechanism along a dislocation core is reasoned to account for the high nucleation kinetics. A dislocation core is proposed to be a high electron tunneling path with a reduced energy barrier and a reduced barrier thickness. In supporting the pipe tunneling mechanism, both 'in situ' and 'ex situ' scratch tests were performed to introduce extra dislocations into the cathode surface, that is, more high charge paths via tunneling, before electrodeposition

Condensation on Superhydrophobic Copper Oxide Nanostructures

OpenAIRE

Enright, Ryan; Miljkovic, Nenad; Dou, Nicholas; Nam, Youngsuk; Wang, Evelyn N.

2013-01-01

Condensation is an important process in both emerging and traditional power generation and water desalination technologies. Superhydrophobic nanostructures promise enhanced condensation heat transfer by reducing the characteristic size of departing droplets via a surface-tension-driven mechanism [1]. In this work, we investigated a scalable synthesis technique to produce oxide nanostructures on copper surfaces capable of sustaining superhydrophobic condensation and characterized the growth an...

Modification of polycrystalline copper by proton irradiation; Modificacion de cobre policristalino por irradiacion con protones

Energy Technology Data Exchange (ETDEWEB)

Garcia S, F.; Cabral P, A. [Instituto Nacional de Investigaciones Nucleares, Hipodromo Condesa, 06100 Mexico D.F. (Mexico); Saniger B, J.M.; Banuelos, J.G. [UNAM Centro de Instrumentos, Mexico D.F. (Mexico); Barragan V, A. [UNAM Instituto de Fisica, Mexico D.F. (Mexico)

1997-07-01

Polished copper samples were irradiated with proton beams of 300 and 700 keV at room temperature and at -150 Centigrade. In this work the obtained results are reported when such copper irradiated samples are analysed with Sem, Tem, AFM. The Sem micrographs showed evident changes in surface of these copper samples, therefore an EDAX microanalysis was done for its characterization. additionally, the Tem micrographs showed heaps formation until 200 nm. Its electron diffraction spectra indicated that these heaps consist of a copper compound. Finally with AFM were observed changes in coloration of the irradiated sample surface, as well as changes in texture and rugosity of them. These results show in general that irradiation process with protons which is known as an innocuo process produces changes in the copper properties. (Author)

Precursors for formation of copper selenide, indium selenide, copper indium diselenide, and/or copper indium gallium diselenide films

Science.gov (United States)

Curtis, Calvin J; Miedaner, Alexander; Van Hest, Maikel; Ginley, David S

2014-11-04

Liquid-based precursors for formation of Copper Selenide, Indium Selenide, Copper Indium Diselenide, and/or copper Indium Galium Diselenide include copper-organoselenides, particulate copper selenide suspensions, copper selenide ethylene diamine in liquid solvent, nanoparticulate indium selenide suspensions, and indium selenide ethylene diamine coordination compounds in solvent. These liquid-based precursors can be deposited in liquid form onto substrates and treated by rapid thermal processing to form crystalline copper selenide and indium selenide films.

Effect of Reaction Temperature on Carbon Yield and Morphology of CNTs on Copper Loaded Nickel Nanoparticles

Directory of Open Access Journals (Sweden)

Hu Ming

2016-01-01

Full Text Available This investigation was attempted to introduce carbon nanotubes (CNTs onto surface of copper powders in order to improve heat transfer performance of copper matrix for engineering application of electrical packaging materials. The Ni/MgO catalyst was formed on the copper powders surface by means of codeposition method. CVD technique was executed to fabricate uniform CNTs on copper powders and effect of reaction temperature on the morphology of CNTs was surveyed. The results showed that CNTs products on the copper powder surface were distributed uniformly even if reaction temperature was different. The diameter dimension of CNTs was within the scope of 30~60 nm. Growth behaviors of CNTs by CVD method were considered to be “tip-growth” mechanism. Raman spectra of CNTs proved that intensity ratio of D-band to G-band (ID/IG increased as deposition reaction temperature increased, which implied that order degree of graphitic structure in synthesized CNTs improved.

Characterization of nanocrystalline products prepared by mechanochemical reduction of copper sulphide

DEFF Research Database (Denmark)

Balaz, P.; Godocikova, E.; Boldizarova, E.

2002-01-01

The mechanochemical processing of the copper sulphide with iron in a high-energy mill was studied. The nanosized copper of 10 nm crystallite size and the hexagonal pyrrhotite 1C were identified among products of the reaction by methods of XRD and Mossbauer spectroscopy. In the surface layer...

Biodiesel production over copper vanadium phosphate

International Nuclear Information System (INIS)

Chen, Lei; Yin, Ping; Liu, Xiguang; Yang, Lixia; Yu, Zhongxi; Guo, Xin; Xin, Xinquan

2011-01-01

In the present study, copper vanadium phosphate (CuVOP) with three-dimensional network structure was synthesized by hydrothermal method, and was characterized by Infrared spectrum (IR), elemental analysis (EA), EDXRF (energy dispersive X ray fluorescence) etc. Moreover, soybean oil was used as feedstock for producing biodiesel, and biodiesel was produced by CuVOP-catalyzed transesterification process. Response surface methodology was employed to statistically evaluate and optimize the conditions for the maximum conversion to biodiesel, and the effects of amount of catalyst, ratio of methanol to oil, reaction time and reaction temperature were investigated by the 2 4 full-factorial central composite design. The maximum conversion is obtained at amount of catalyst of 1.5%, methanol/oil molar ratio of 6.75, reaction temperature of 65 o C and reaction time of 5 h. Copper vanadium phosphate CuVOP resulted very active in the transesterification reaction for biodiesel production. -- Research highlights: → Copper vanadium phosphate CuVOP with three-dimensional network structure was prepared successfully. Moreover, for the transesterification reaction of soybean oil with methanol under atmospheric pressure, CuVOP had higher catalytic activity and the effects of production conditions such as amount of catalysts etc. were analyzed by response surface methodology.

Advanced Copper Composites Against Copper-Tolerant Xanthomonas perforans and Tomato Bacterial Spot.

Science.gov (United States)

Strayer-Scherer, A; Liao, Y Y; Young, M; Ritchie, L; Vallad, G E; Santra, S; Freeman, J H; Clark, D; Jones, J B; Paret, M L

2018-02-01

Bacterial spot, caused by Xanthomonas spp., is a widespread and damaging bacterial disease of tomato (Solanum lycopersicum). For disease management, growers rely on copper bactericides, which are often ineffective due to the presence of copper-tolerant Xanthomonas strains. This study evaluated the antibacterial activity of the new copper composites core-shell copper (CS-Cu), multivalent copper (MV-Cu), and fixed quaternary ammonium copper (FQ-Cu) as potential alternatives to commercially available micron-sized copper bactericides for controlling copper-tolerant Xanthomonas perforans. In vitro, metallic copper from CS-Cu and FQ-Cu at 100 μg/ml killed the copper-tolerant X. perforans strain within 1 h of exposure. In contrast, none of the micron-sized copper rates (100 to 1,000 μg/ml) from Kocide 3000 significantly reduced copper-tolerant X. perforans populations after 48 h of exposure compared with the water control (P copper-based treatments killed the copper-sensitive X. perforans strain within 1 h. Greenhouse studies demonstrated that all copper composites significantly reduced bacterial spot disease severity when compared with copper-mancozeb and water controls (P copper composites significantly reduced disease severity when compared with water controls, using 80% less metallic copper in comparison with copper-mancozeb in field studies (P copper composites have the potential to manage copper-tolerant X. perforans and tomato bacterial spot.

Etching of Copper Coated Mylar Tubes With CF-4 Gas

International Nuclear Information System (INIS)

Ecklund, Karl M.; Hartman, Keith W.; Hebert, Michael J.; Wojcicki, Stanley G.

1996-01-01

Using 5 mm diameter copper coated mylar straw tubes at a potential of 2.30 KV relative to a concentric 20 (mu)m diameter gold-plated tungsten anode, it has been observed that with very low flow rates of CF4-based gases the conductive copper cathode material may be removed entirely from the mylar surface

Copper-decorated carbon nanotubes-based composite electrodes for nonenzymatic detection of glucose

NARCIS (Netherlands)

Pop, A.; Manea, F.; Orha, C.; Motoc, S.; Llinoiu, E.; Vaszilcsin, N.; Schoonman, J.

2012-01-01

The aim of this study was to prepare three types of multiwall carbon nanotubes (CNT)-based composite electrodes and to modify their surface by copper electrodeposition for nonenzymatic oxidation and determination of glucose from aqueous solution. Copper-decorated multiwall carbon nanotubes composite

Copper as a target for prostate cancer therapeutics: copper-ionophore pharmacology and altering systemic copper distribution

Science.gov (United States)

Denoyer, Delphine; Pearson, Helen B.; Clatworthy, Sharnel A.S.; Smith, Zoe M.; Francis, Paul S.; Llanos, Roxana M.; Volitakis, Irene; Phillips, Wayne A.; Meggyesy, Peter M.; Masaldan, Shashank; Cater, Michael A.

2016-01-01

Copper-ionophores that elevate intracellular bioavailable copper display significant therapeutic utility against prostate cancer cells in vitro and in TRAMP (Transgenic Adenocarcinoma of Mouse Prostate) mice. However, the pharmacological basis for their anticancer activity remains unclear, despite impending clinical trails. Herein we show that intracellular copper levels in prostate cancer, evaluated in vitro and across disease progression in TRAMP mice, were not correlative with copper-ionophore activity and mirrored the normal levels observed in patient prostatectomy tissues (Gleason Score 7 & 9). TRAMP adenocarcinoma cells harbored markedly elevated oxidative stress and diminished glutathione (GSH)-mediated antioxidant capacity, which together conferred selective sensitivity to prooxidant ionophoric copper. Copper-ionophore treatments [CuII(gtsm), disulfiram & clioquinol] generated toxic levels of reactive oxygen species (ROS) in TRAMP adenocarcinoma cells, but not in normal mouse prostate epithelial cells (PrECs). Our results provide a basis for the pharmacological activity of copper-ionophores and suggest they are amendable for treatment of patients with prostate cancer. Additionally, recent in vitro and mouse xenograft studies have suggested an increased copper requirement by prostate cancer cells. We demonstrated that prostate adenocarcinoma development in TRAMP mice requires a functional supply of copper and is significantly impeded by altered systemic copper distribution. The presence of a mutant copper-transporting Atp7b protein (tx mutation: A4066G/Met1356Val) in TRAMP mice changed copper-integration into serum and caused a remarkable reduction in prostate cancer burden (64% reduction) and disease severity (grade), abrogating adenocarcinoma development. Implications for current clinical trials are discussed. PMID:27175597

Comparative study on the passivation layers of copper sulphide minerals during bioleaching

Science.gov (United States)

Fu, Kai-bin; Lin, Hai; Mo, Xiao-lan; Wang, Han; Wen, Hong-wei; Wen, Zi-long

2012-10-01

The bioleaching of copper sulphide minerals was investigated by using A. ferrooxidans ATF6. The result shows the preferential order of the minerals bioleaching as djurleite>bornite>pyritic chalcopyrite>covellite>porphyry chalcopyrite. The residues were characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM). It is indicated that jarosite may not be responsible for hindered dissolution. The elemental sulfur layer on the surface of pyritic chalcopyrite residues is cracked. The compact surface layer of porphyry chalcopyrite may strongly hinder copper extraction. X-ray photoelectron spectroscopy (XPS) further confirms that the passivation layers of covellite, pyritic chalcopyrite, and porphyry chalcopyrite are copper-depleted sulphide Cu4S11, S8, and copper-rich iron-deficient polysulphide Cu4Fe2S9, respectively. The ability of these passivation layers was found as Cu4Fe2S9>Cu4S11>S8>jarosite.

Optimization of chemical displacement deposition of copper on porous silicon.

Science.gov (United States)

Bandarenka, Hanna; Redko, Sergey; Nenzi, Paolo; Balucani, Marco; Bondarenko, Vitaly

2012-11-01

Copper (II) sulfate was used as a source of copper to achieve uniform distribution of Cu particles deposited on porous silicon. Layers of the porous silicon were formed by electrochemical anodization of Si wafers in a mixture of HF, C3H7OH and deionized water. The well-known chemical displacement technique was modified to grow the copper particles of specific sizes. SEM and XRD analysis revealed that the outer surface of the porous silicon was covered with copper particles of the crystal orientation inherited from the planes of porous silicon skeleton. The copper crystals were found to have the cubic face centering elementary cell. In addition, the traces of Cu2O cubic primitive crystalline phases were identified. The dimensions of Cu particles were determined by the Feret's analysis of the SEM images. The sizes of the particles varied widely from a few to hundreds of nanometers. A phenomenological model of copper deposition was proposed.

Adsorption of copper ions of natural montmorillonite clay

Directory of Open Access Journals (Sweden)

Pimneva Ludmila

2017-01-01

Full Text Available The prospects of montmorillonite clay using for the extraction of copper ions from natural and waste waters were determined. Specified chemical and phase composition of natural forms of the montmorillonite clay are shown in the article. Quantitative characteristics of adsorption process of copper ions, the statistical exchange capacity is 1,21 (298 К, 1,25 (313 К, 1,43 (333 К. The authors have studied the balance of copper ions by the method of constructing the isotherms. The description of the adsorption process was carried out by the Langmuir, Freundlich and Temkin models. The calculations showed that the best data for the sorption described by Langmuir model. The nature of the interaction of copper ions with montmorillonite clay in natural form is presented. The calculated thermodynamic parameters of the adsorption process, the obtained values of the Gibbs energy have a negative sign -11,5 (298 К, -15,6 (313 К, -16,2 (333 К кJ/mol, that corresponds to a sustainable consolidation of copper ions on the surface of the montmorillonite clay.

Decomposition of poly(amide-imide) film enameled on solid copper wire using atmospheric pressure non-equilibrium plasma.

Science.gov (United States)

Sugiyama, Kazuo; Suzuki, Katsunori; Kuwasima, Shusuke; Aoki, Yosuke; Yajima, Tatsuhiko

2009-01-01

The decomposition of a poly(amide-imide) thin film coated on a solid copper wire was attempted using atmospheric pressure non-equilibrium plasma. The plasma was produced by applying microwave power to an electrically conductive material in a gas mixture of argon, oxygen, and hydrogen. The poly(amide-imide) thin film was easily decomposed by argon-oxygen mixed gas plasma and an oxidized copper surface was obtained. The reduction of the oxidized surface with argon-hydrogen mixed gas plasma rapidly yielded a metallic copper surface. A continuous plasma heat-treatment process using a combination of both the argon-oxygen plasma and argon-hydrogen plasma was found to be suitable for the decomposition of the poly(amide-imide) thin film coated on the solid copper wire.

Surface phenomena associated with thermal cycling of copper and their impact on the service life of particle accelerator structures

CERN Document Server

Aicheler, Markus; Theisen, Werner; Sgobba, Stefano

2010-01-01

The performance of accelerating structures (AS) in the Compact LInear Collider (CLIC) is sensitive to a variety of parameters, including the surface quality of key elements of the AS. Processes which affect the surface quality are therefore of particular concern. The present work addresses surface modifications associated with thermal cycling during operation. This type of operating condition represents a specific type of fatigue loading. Four fatigue test procedures were used in the present study in order to investigate the fatigue behaviour of oxygen{free{electronic (OFE) copper, the candidate material of the CLIC-AS: conventional fatigue (CVF), ultrasonic swinger (USS), laser fatigue (LAF) and radio{frequency fatigue (RFF). During operation of the accelerator the material of the AS will be subjected to cyclic temperature changes of approx. Delta T = 56 K, from about 40° C to about 100° C. These temperature changes will result in cyclic biaxial strains in the surface of the order of epsilon(biax) = 9.2 x ...

Comparative performance of aluminium copper and iron solar stills

International Nuclear Information System (INIS)

Dioha, I.J.; Nwagbo, E.E.; Gulma, N.A.

1990-12-01

Three different metal sheets have been used in the fabrication of three different single sloping solar stills of the same surface geometry. The metals were galvanized iron, aluminium and copper. This paper presents the performance of the different stills operating under the same environmental conditions. The observed distillate yields was greatest for copper, then aluminium and lastly, iron still. The differences in the yields is attributed to the differences in the thermal conductivities of the metals. The equivalent local costs for the fabrication of the copper, aluminium and iron stills are respectively $160, $95 and $60. Taking the long run costs into consideration, the copper still is preferred because of its availability, durability, weldability and relatively higher conductivity of 380Wm -1 K -1 value. (author). 9 refs, 2 figs, 2 tabs

Action of Antimicrobial Copper on Bacteria and Fungi Isolated from Commercial Poultry Hatcheries

Directory of Open Access Journals (Sweden)

RFR Depner

Full Text Available ABSTRACT Since 2008, when the US Environmental Protection Agency (EPA registered copper and its alloys as an antimicrobial agent for contact surfaces, research has demonstrated their antimicrobial activity. The aim of this study was to evaluate the efficacy of antimicrobial copper against bacteria and fungi isolated from commercial poultry hatcheries in order to develop a microbiological control alternative in these environments. Samples were collected from the surfaces of hatcher baskets from two hatcheries. Mesophilic microorganisms and fungi/yeasts were isolated and standardized in concentration of 105 cells/mL. Four copper plates and four stainless steel plates were completely immersed for one minute in bacteria and fungi/yeasts solutions and left to dry for a day at room temperature. Subsequently, samples were collected from the metal plates with the aid of sterile swab and delimiter. These samples were planted onto Plate Count Agar (for mesophilic culture and Sabouraud Dextrose Agar (for fungi and yeast culture and incubated at 36°C for 48 hours and at 25°C for 5-7 days, respectively. After incubation, the colonies recovered from the plates were counted according to IN 62 of the Brazilian Ministry of Agriculture. Almost all contamination was eliminated from the surface of copper plates in a single day, while the stainless steel plates proved to be innocuous to the screened microorganisms. Copper, as a contact surface, proved to have important antimicrobial action on bacteria, fungi and yeasts common to hatcheries.

Controlled assembly of high-order nanoarray metal structures on bulk copper surface by femtosecond laser pulses

Science.gov (United States)

Qin, Wanwan; Yang, Jianjun

2017-07-01

We report a new one-step maskless method to fabricate high-order nanoarray metal structures comprising periodic grooves and particle chains on a single-crystal Cu surface using femtosecond laser pulses at the central wavelength of 400 nm. Remarkably, when a circularly polarized infrared femtosecond laser pulse (spectrally centered at 800 nm) pre-irradiates the sample surface, the geometric dimensions of the composite structure can be well controlled. With increasing the energy fluence of the infrared laser pulse, both the groove width and particle diameter are observed to reduce, while the measured spacing-to-diameter ratio of the nanoparticles tends to present an increasing tendency. A physical scenario is proposed to elucidate the underlying mechanisms: as the infrared femtosecond laser pulse pre-irradiates the target, the copper surface is triggered to display anomalous transient physical properties, on which the subsequently incident Gaussian blue laser pulse is spatially modulated into fringe-like energy depositions via the excitation of ultrafast surface plasmon. During the following relaxation processes, the periodically heated thin-layer regions can be transferred into the metastable liquid rivulets and then they break up into nanodroplet arrays owing to the modified Rayleigh-like instability. This investigation indicates a simple integrated approach for active designing and large-scale assembly of complexed functional nanostructures on bulk materials.

Copper complexation capacity in surface waters of the Venice Lagoon.

Science.gov (United States)

Delgadillo-Hinojosa, Francisco; Zirino, Alberto; Nasci, Cristina

2008-10-01

Total copper (Cu(T)), copper ion activity (pCu) and the copper complexation capacity (CuCC) were determined in samples of seawater collected in July 2003 from the Venice Lagoon. Cu(T) and CuCC showed considerable spatial variability: Cu(T) ranged from 1.8 to 70.0nM, whereas the CuCC varied from 195 to 573nM. pCu values varied from 11.6 to 12.6 and are consistent with those previously reported in estuarine and coastal areas (10.9-14.1). The range of Cu(T) values compares well with those reported in the past in the lagoon and in the adjacent Adriatic Sea. The highest concentrations of Cu(T) were found in samples collected near the industrial area of Porto Marghera, whereas the lowest were measured near the Chioggia and Malamocco inlets, where an intense tidally-driven renewal of seawater takes place. Although CuCC showed a high degree of spatial variability, the values recorded in the Venice Lagoon are comparable to those reported in other estuarine systems. In addition, CuCC was positively correlated with dissolved organic carbon (DOC), suggesting that organic ligands responsible for Cu complexation are part of the bulk organic matter pool in the lagoon. The CuCC:Cu(T) molar ratio was, on average 55:1, indicating that a large excess of complexation capacity exists in the Venice Lagoon. The high levels of CuCC and the narrow range of pCu indicates the importance of the role played by organic ligands in controlling the free ion Cu concentrations in the lagoon, and as a consequence, regulating its availability and/or toxicity.

Horseradish peroxidase immobilized on copper surfaces and applications in selective electrocatalysis of p-dihydroxybenzene

Energy Technology Data Exchange (ETDEWEB)

Wang, Chuntao, E-mail: tsyj1992@126.com [Department of Chemistry, Taiyuan Normal University, Taiyuan 030031 (China); Institute of Energy and Environmental Electrochemistry, Taiyuan Normal University, Taiyuan 030031 (China); Luo, Xiaoxiao [Department of Natural Science, Michigan State University, MI 48823,USA (United States); Jia, Zehui [Department of Chemistry, Taiyuan Normal University, Taiyuan 030031 (China); Institute of Energy and Environmental Electrochemistry, Taiyuan Normal University, Taiyuan 030031 (China); Shi, Qinghua; Zhu, Ritao [Department of Chemistry, Taiyuan Normal University, Taiyuan 030031 (China)

2017-06-01

Abstract: Horseradish Peroxidase (HRP) was immobilized on copper surfaces with the linker of L-Cysteine (L-Cys) self-assembled films to form Cu/L-Cys/HRP electrodes. The activity of HRP can be preserved by the Cu/L-Cys self-assembled films. The Cu/L-Cys/HRP electrodes can be used for the selective electrocatalytic oxidase of p-dihydroxybenzen in absent of H{sub 2}O{sub 2}. The optimum pH for electrocatalyzing p-dihydroxybenzen was 5.5 or 7.0, which corresponds to the isoelectric points of L-Cys and HRP, respectively. X-ray photoelectron spectroscopy (XPS) provided the evidence that L-Cys linked with Cu surface by the Cu− S bond. Fourier transform infrared spectroscopy (FTIR) analyses indicated that aromatic plane of p-dihydroxybenzen was connected parallel to porphyrin ring of heme in HRP. Quantum chemical calculation of density functional theory (DFT) revealed that symmetry of molecular structure and minimum space steric hindrance for p-dihydroxybenzen were benefit to combination with HRP. Moreover, the lowest energy of LUMO and most negative charges of oxygen atom on hydroxyl group of p-dihydroxybenzen were advantage to lose the hydrogen atom of hydroxyl group to be oxided.

Formation of copper-indium-selenide and/or copper-indium-gallium-selenide films from indium selenide and copper selenide precursors

Science.gov (United States)

Curtis, Calvin J [Lakewood, CO; Miedaner, Alexander [Boulder, CO; Van Hest, Maikel [Lakewood, CO; Ginley, David S [Evergreen, CO; Nekuda, Jennifer A [Lakewood, CO

2011-11-15

Liquid-based indium selenide and copper selenide precursors, including copper-organoselenides, particulate copper selenide suspensions, copper selenide ethylene diamine in liquid solvent, nanoparticulate indium selenide suspensions, and indium selenide ethylene diamine coordination compounds in solvent, are used to form crystalline copper-indium-selenide, and/or copper indium gallium selenide films (66) on substrates (52).

In situ surface X-ray diffraction studies of the copper-electrolyte interface. Atomic structure and homoepitaxial grwoth

Energy Technology Data Exchange (ETDEWEB)

Golks, Frederik

2011-05-19

Copper electrodeposition is the predominantly used technique for on-chip wiring in the fabrication of ultra-large scale integrated (ULSI) microchips. In this 'damascene copper electroplating' process, multicomponent electrolytes containing organic additives realize void-free filling of trenches with high aspect ratio ('superconformal deposition'). Despite manifold studies, motivated by the continuous trend to shrink wiring dimensions and thus the demand of optimized plating baths, detailed knowledge on the growth mechanism - in presence and absence of additives - is still lacking. Using a recently developed hanging meniscus X-ray transmission cell, brilliant synchrotron x-rays and a fast, one-dimensional detector system, unique real-time in situ surface X-ray diffraction studies of copper electrodeposition were performed under realistic reaction conditions, approaching rates of technological relevance. Preparatory measurements of the electrochemical dissolution of Au(001) in chloride-containing electrolyte demonstrated the capability of this powerful technique, specifically the possibility to follow atomic-scale deposition or dissolution processes with a time resolution down to five milliseconds. The electrochemical as well as structural characterization of the Cu(001)- and Cu(111)-electrolyte interfaces provided detailed insight into the complex atomic-scale structures in presence of specifically adsorbed chloride on these surfaces. The interface of Cu(001) in chloride-containing electrolyte exhibits a continuous surface phase transition of a disordered Cl adlayer to a c(2 x 2) Cl adlayer with increasing potential. The latter was found to induce a small vertical corrugation of substrate atoms, which can be ascribed to lattice relaxations induced by the presence of coadsorbed water molecules and cations in the outer part of the electrochemical double layer. The study of the specific adsorption of chloride on Cu(111) from acidic aqueous

In situ surface X-ray diffraction studies of the copper-electrolyte interface. Atomic structure and homoepitaxial grwoth

Energy Technology Data Exchange (ETDEWEB)

Golks, Frederik

2011-05-19

Copper electrodeposition is the predominantly used technique for on-chip wiring in the fabrication of ultra-large scale integrated (ULSI) microchips. In this 'damascene copper electroplating' process, multicomponent electrolytes containing organic additives realize void-free filling of trenches with high aspect ratio ('superconformal deposition'). Despite manifold studies, motivated by the continuous trend to shrink wiring dimensions and thus the demand of optimized plating baths, detailed knowledge on the growth mechanism - in presence and absence of additives - is still lacking. Using a recently developed hanging meniscus X-ray transmission cell, brilliant synchrotron x-rays and a fast, one-dimensional detector system, unique real-time in situ surface X-ray diffraction studies of copper electrodeposition were performed under realistic reaction conditions, approaching rates of technological relevance. Preparatory measurements of the electrochemical dissolution of Au(001) in chloride-containing electrolyte demonstrated the capability of this powerful technique, specifically the possibility to follow atomic-scale deposition or dissolution processes with a time resolution down to five milliseconds. The electrochemical as well as structural characterization of the Cu(001)- and Cu(111)-electrolyte interfaces provided detailed insight into the complex atomic-scale structures in presence of specifically adsorbed chloride on these surfaces. The interface of Cu(001) in chloride-containing electrolyte exhibits a continuous surface phase transition of a disordered Cl adlayer to a c(2 x 2) Cl adlayer with increasing potential. The latter was found to induce a small vertical corrugation of substrate atoms, which can be ascribed to lattice relaxations induced by the presence of coadsorbed water molecules and cations in the outer part of the electrochemical double layer. The study of the specific adsorption of chloride on Cu(111) from acidic aqueous electrolyte revealed a

COPPER AND COPPER-CONTAINING PESTICIDES: METABOLISM, TOXICITY AND OXIDATIVE STRESS

Directory of Open Access Journals (Sweden)

Viktor Husak

2015-05-01

Full Text Available The purpose of this paper is to provide a brief review of the current knowledge regarding metabolism and toxicity of copper and copper-based pesticides in living organisms. Copper is an essential trace element in all living organisms (bacteria, fungi, plants, and animals, because it participates in different metabolic processes and maintain functions of organisms. The transport and metabolism of copper in living organisms is currently the subject of many studies. Copper is absorbed, transported, distributed, stored, and excreted in the body via the complex of homeostatic processes, which provide organisms with a needed constant level of this micronutrient and avoid excessive amounts. Many aspects of copper homeostasis were studied at the molecular level. Copper based-pesticides, in particularly fungicides, bacteriocides and herbicides, are widely used in agricultural practice throughout the world. Copper is an integral part of antioxidant enzymes, particularly copper-zinc superoxide dismutase (Cu,Zn-SOD, and plays prominent roles in iron homeostasis. On the other hand, excess of copper in organism has deleterious effect, because it stimulates free radical production in the cell, induces lipid peroxidation, and disturbs the total antioxidant capacity of the body. The mechanisms of copper toxicity are discussed in this review also.

Colloidal copper in aqueous solutions: radiation-chemical reduction, mechanism of formation and properties

International Nuclear Information System (INIS)

Ershov, B.G.

1994-01-01

Colloidal copper was obtained upon γ-irradiation of aqueous solutions of divalent copper perchlorate in the presence of alcohol and polyethyleneimine (PEI). The sols were in the form of spherical particles 4 nm in diameter, which were promptly oxidized by oxygen or other oxidants. The copper ions were reduced on the surface of silver sols. The optical parameters of the obtained bimetallic particles were studied. The copper ions led to the broadening and shift of the absorption bands of the silver sols to the UV region

Indirect photopatterning of functionalized organic monolayers via copper-catalyzed "click chemistry"

Science.gov (United States)

Williams, Mackenzie G.; Teplyakov, Andrew V.

2018-07-01

Solution-based lithographic surface modification of an organic monolayer on a solid substrate is attained based on selective area photo-reduction of copper (II) to copper (I) to catalyze the azide-alkyne dipolar cycloaddition "click" reaction. X-ray photoelectron spectroscopy is used to confirm patterning, and spectroscopic results are analyzed and supplemented with computational models to confirm the surface chemistry. It is determined that this surface modification approach requires irradiation of the solid substrate with all necessary components present in solution. This method requires only minutes of irradiation to result in spatial and temporal control of the covalent surface functionalization of a monolayer and offers the potential for wavelength tunability that may be desirable in many applications utilizing organic monolayers.

Uptake and internalisation of copper by three marine microalgae: comparison of copper-sensitive and copper-tolerant species.

Science.gov (United States)

Levy, Jacqueline L; Angel, Brad M; Stauber, Jennifer L; Poon, Wing L; Simpson, Stuart L; Cheng, Shuk Han; Jolley, Dianne F

2008-08-29

Although it has been well established that different species of marine algae have different sensitivities to metals, our understanding of the physiological and biochemical basis for these differences is limited. This study investigated copper adsorption and internalisation in three algal species with differing sensitivities to copper. The diatom Phaeodactylum tricornutum was particularly sensitive to copper, with a 72-h IC50 (concentration of copper to inhibit growth rate by 50%) of 8.0 microg Cu L(-1), compared to the green algae Tetraselmis sp. (72-h IC50 47 microg Cu L(-1)) and Dunaliella tertiolecta (72-h IC50 530 microg Cu L(-1)). At these IC50 concentrations, Tetraselmis sp. had much higher intracellular copper (1.97+/-0.01 x 10(-13)g Cu cell(-1)) than P. tricornutum (0.23+/-0.19 x 10(-13)g Cu cell(-1)) and D. tertiolecta (0.59+/-0.05 x 10(-13)g Cu cell(-1)), suggesting that Tetraselmis sp. effectively detoxifies copper within the cell. By contrast, at the same external copper concentration (50 microg L(-1)), D. tertiolecta appears to better exclude copper than Tetraselmis sp. by having a slower copper internalisation rate and lower internal copper concentrations at equivalent extracellular concentrations. The results suggest that the use of internal copper concentrations and net uptake rates alone cannot explain differences in species-sensitivity for different algal species. Model prediction of copper toxicity to marine biota and understanding fundamental differences in species-sensitivity will require, not just an understanding of water quality parameters and copper-cell binding, but also further knowledge of cellular detoxification mechanisms.

Observation of diamond turned OFHC copper using Scanning Tunneling Microscopy

Energy Technology Data Exchange (ETDEWEB)

Grigg, D.A.; Russell, P.E.; Dow, T.A.

1988-12-01

Diamond turned OFHC copper samples have been observed within the past few months using the Scanning Tunneling Microscope. Initial results have shown evidence of artifacts which may be used to better understand the diamond turning process. The STM`s high resolution capability and three dimensional data representation allows observation and study of surface features unobtainable with conventional profilometry systems. Also, the STM offers a better quantitative means by which to analyze surface structures than the SEM. This paper discusses findings on several diamond turned OFHC copper samples having different cutting conditions. Each sample has been cross referenced using STM and SEM.

Microwave attenuation with composite of copper microwires

International Nuclear Information System (INIS)

Gorriti, A.G.; Marin, P.; Cortina, D.; Hernando, A.

2010-01-01

It is shown that copper microwires composite media attenuates microwave reflection of metallic surfaces. We show how the distance to the metallic surface, as well as the length and volume fraction of microwires, determine the frequency of maximum absorption and the return loss level. Furthermore, we were able to fit the experimental results with a theoretical model based on Maxwell-Garnett mixing formula.

Microwave attenuation with composite of copper microwires

Energy Technology Data Exchange (ETDEWEB)

Gorriti, A.G.; Marin, P. [Instituto de Magnetismo Aplicado, (UCM-ADIF-CSIC) and Departamento de Fisica de Materiales (UCM). P.O. Box 155, Las Rozas, Madrid 28230 (Spain); Cortina, D. [Micromag S.L., Las Rozas, Madrid 28230 (Spain); Hernando, A., E-mail: antonio.hernando@adif.e [Instituto de Magnetismo Aplicado, (UCM-ADIF-CSIC) and Departamento de Fisica de Materiales (UCM). P.O. Box 155, Las Rozas, Madrid 28230 (Spain); Micromag S.L., Las Rozas, Madrid 28230 (Spain)

2010-05-15

It is shown that copper microwires composite media attenuates microwave reflection of metallic surfaces. We show how the distance to the metallic surface, as well as the length and volume fraction of microwires, determine the frequency of maximum absorption and the return loss level. Furthermore, we were able to fit the experimental results with a theoretical model based on Maxwell-Garnett mixing formula.

A natural analogue for copper waste canisters: The copper-uranium mineralised concretions in the Permian mudrocks of south Devon, United Kingdom

International Nuclear Information System (INIS)

Milodowski, A.E.; Styles, M.T.; Hards, V.L.

2000-08-01

mineralisation and alteration that can be related to the burial and diagenetic history of the Permian strata. The native copper mineralisation exhibits close temporal association with the formation of uraniferous and vanadiferous concretions (known as 'fish-eyes') in the same rocks. Petrographical relationships indicate that both the copper and the 'fish-eye' concretions formed during burial diagenesis but before the maximum compaction of the host mudstone and siltstone. The regional burial history Wessex Basin, indicates that the maximum compaction of the Permian strata would have been achieved by at least the end of the Lower Jurassic (possibly even in the Triassic). Therefore, the native copper mineralisation is older than 176 Ma. The native copper sheets display a complex sequence of alteration and subsequent mineral growth of minerals on their surfaces. The earliest alteration was to copper oxides - principally cuprite with minor tenorite, indicating a change to more oxidising groundwater conditions. The dissolution of native silver and the growth of fringes of copper arsenides followed this. Nickel arsenides and chalcocite, associated with the precipitation of uranium silicates occurred in the later stages of alteration. This suggests a return to a more reducing pore water environment. Again, petrographical relationships indicate that this alteration and subsequent mineralisation is geologically old (i.e. Lower Jurassic or older). Secondary malachite, intimately intergrown copper sulphate and copper oxides, copper chloride, copper-uranium arsenate and uranium vanadates have formed as late-stage alteration products of the native copper and earlier diagenetic cuprite, chalcocite, copper-nickel arsenide and uranium silicate alteration and mineralisation. This latest stage alteration is most probably attributable to near-surface weathering processes. Although the native copper is affected by corrosion, the study has shown that a significant proportion (30-80% of the original

A natural analogue for copper waste canisters: The copper-uranium mineralised concretions in the Permian mudrocks of south Devon, United Kingdom

Energy Technology Data Exchange (ETDEWEB)

Milodowski, A.E.; Styles, M.T.; Hards, V.L. [Natural Environment Research Council (United Kingdom). British Geological Survey

2000-08-01

mineralisation and alteration that can be related to the burial and diagenetic history of the Permian strata. The native copper mineralisation exhibits close temporal association with the formation of uraniferous and vanadiferous concretions (known as 'fish-eyes') in the same rocks. Petrographical relationships indicate that both the copper and the 'fish-eye' concretions formed during burial diagenesis but before the maximum compaction of the host mudstone and siltstone. The regional burial history Wessex Basin, indicates that the maximum compaction of the Permian strata would have been achieved by at least the end of the Lower Jurassic (possibly even in the Triassic). Therefore, the native copper mineralisation is older than 176 Ma. The native copper sheets display a complex sequence of alteration and subsequent mineral growth of minerals on their surfaces. The earliest alteration was to copper oxides - principally cuprite with minor tenorite, indicating a change to more oxidising groundwater conditions. The dissolution of native silver and the growth of fringes of copper arsenides followed this. Nickel arsenides and chalcocite, associated with the precipitation of uranium silicates occurred in the later stages of alteration. This suggests a return to a more reducing pore water environment. Again, petrographical relationships indicate that this alteration and subsequent mineralisation is geologically old (i.e. Lower Jurassic or older). Secondary malachite, intimately intergrown copper sulphate and copper oxides, copper chloride, copper-uranium arsenate and uranium vanadates have formed as late-stage alteration products of the native copper and earlier diagenetic cuprite, chalcocite, copper-nickel arsenide and uranium silicate alteration and mineralisation. This latest stage alteration is most probably attributable to near-surface weathering processes. Although the native copper is affected by corrosion, the study has shown that a significant proportion (30

Grain boundary corrosion of copper canister material

International Nuclear Information System (INIS)

Fennell, P.A.H.; Graham, A.J.; Smart, N.R.; Sofield, C.J.

2001-03-01

The proposed design for a final repository for spent fuel and other long-lived residues in Sweden is based on the multi-barrier principle. The waste will be encapsulated in sealed cylindrical canisters, which will then be placed in granite bedrock and surrounded by compacted bentonite clay. The canister design is based on a thick cast inner container fitted inside a corrosion-resistant copper canister. During fabrication of the outer copper canisters there will be some unavoidable grain growth in the welded areas. As grains grow they will tend to concentrate impurities within the copper at the new grain boundaries. The work described in this report was undertaken to determine whether there is any possibility of enhanced corrosion at grain boundaries within the copper canister. The potential for grain boundary corrosion was investigated by exposing copper specimens, which had undergone different heat treatments and hence had different grain sizes, to aerated artificial bentonite-equilibrated groundwater with two concentrations of chloride, for increasing periods of time. The degree of grain boundary corrosion was determined by atomic force microscopy (AFM) and optical microscopy. AFM showed no increase in grain boundary 'ditching' for low chloride groundwater. In high chloride groundwater the surface was covered uniformly with a fine-grained oxide. No increases in oxide thickness were observed. No significant grain boundary attack was observed using optical microscopy either. The work suggests that in aerated artificial groundwaters containing chloride ions, grain boundary corrosion of copper is unlikely to adversely affect SKB's copper canisters

Development of Copper Corrosion Products and Relation between Surface Appearance and Corrosion Rate

International Nuclear Information System (INIS)

Lan, Tran Thi Ngoc; Binh, Nguyen Thi Thanh; Tru, Nguyen Nhi; Yoshino, Tsujino; Yasuki, Maeda

2008-01-01

Copper was exposed unsheltered and sheltered in four humid tropical sites, representing urban, urban-industrial, urban-marine and rural environments. The corrosion rates and the sequence of corrosion product formation are presented and discussed in relation with climatic and atmospheric pollution parameters. Chemical compositions of corrosion products were found to depend on environments and duration of exposure. In all environments, cuprite was the predominating corrosion product that formed first and continuously increased during the exposure. Among the sulphur-containing corrosion products, posnjakite and brochantite were more frequently found and the first formed earlier. Nantokite was the most common chlorine-containing products for most cases, except the high-chloride environment, where atacamite was detected instead. The corrosion rate of copper was well indicated by the colour of patina. The red-purple colour corresponded to the high corrosion rate and the greenish grey colour corresponded to the low corrosion rate. Corrosion rate of sheltered copper in urban-marine environment increased with the exposure time

The effect of surfactants on the electropolishing behavior of copper in orthophosphoric acid

Energy Technology Data Exchange (ETDEWEB)

Taha, A.A., E-mail: asia_taha@yahoo.com; Ahmed, A.M.; Rahman, H.H. Abdel; Abouzeid, F.M.

2013-07-15

The electropolishing behavior of copper was studied in orthophosphoric acid with Triton X-100, sodium dodecyl sulphate and cetyl pyridinium chloride as additives for improving the finish obtained on copper surface. This was investigated by measuring and comparing anode potential-limiting current relationships in solutions of gradually increasing concentration of surfactants. The addition of surfactants to the electropolishing solution results in a lower limiting current. This confirms the mass transport of dissolved species from the anode surface to the bulk of solution as the rate-determining step in the presence of three surfactants in all concentrations investigated. Scanning electron microscope (SEM), atomic force microscope (AFM) and measured brightness values were used to investigate the copper surface after electropolishing and the results were compared to polishing done in absence of surfactants. According to SEM images and brightness values, addition of Triton X-100 was effective to enhance levelling and brightening more than sodium dodecyl sulphate and cetyl pyridinium chloride. AFM analysis showed that the roughness values (R{sub a}) for an electropolished copper surface, in presence of surfactants, is significantly lower than in absence of surfactants. Different reaction conditions and the physical properties of solutions are studied to obtain dimensionless correlation among all these parameters.

Synthesis of Zn-Cu-Cd sulfide nanospheres with controlled copper locations and their effects on photocatalytic activities for H{sub 2} production

Energy Technology Data Exchange (ETDEWEB)

Wang, Yabo; Xu, Rong [School of Chemical and Biomedical Engineering, Nanyang Technological University, 62 Nanyang Drive, Singapore 637459 (Singapore); Wang, Yongsheng [School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798 (Singapore)

2010-06-15

In this work, a two-step solvothermal method was used to synthesize Zn-Cu-Cd sulfide nanospheres with controlled copper locations. The structural and other physical properties of the nanospheres were investigated by XRD, FESEM, TEM, energy-filtered TEM, XPS, ICP and UV-vis DRS methods. By varying the addition of the copper precursor during the two synthesis steps, Zn-Cu-Cd sulfide nanospheres with three distinctive copper distribution patterns can be obtained with copper (i) only in the core, (ii) only on the surface shell, and (iii) both in the core and on the surface shell. The influence of the location and concentration of copper on the photocatalytic activity for hydrogen production from water under visible light was investigated. It was found that the activity of the sample with copper only on the surface shell is about two times of that with copper only in the core. The highest hydrogen production rate was obtained on the nanosphere sample with copper both in the core and on the surface shell. The possible mechanism was discussed. The findings from this study are important for the development of efficient photocatalysts based on ternary or multinary systems. (author)

Ring structures and copper mineralization in Kerman porphyry copper belt, SE Iran

Directory of Open Access Journals (Sweden)

Gholamreza Mirzababaei

2012-10-01

Full Text Available The role of some ring structures in the distribution of porphyry copper deposits in south Kerman porphyry copper belt is discussed. In the study area, ring structures are circular or elliptical shaped features which are partly recognized on satellite images. In this study, Landsat multispectral images were used to identify ring structures in the area. The rudimentary identification stages of the circles were mainly based on their circular characteristics on the images. These structures match with the regional tectonic features and can be seen mainly in two types; namely, large-magnitude and small scale circles. The associated mineralization in the study area is mainly porphyry Cu and vein type base metal sulfide deposits. There is a sensible relationship between the large circles and mineralization. These circles have encompassed almost entire Cu deposits and prospects in south part of Kerman porphyry copper belt. The small circles seem to be external traces of (porphyritic intrusive bodies that appear on surface as small circles. Formation of the large circular structures do not appear to be related to the external processes and there is no clear indication of how they came into existence but, their arrangement around the edges of a positive residual anomaly area shows the probable role of this anomaly in their formation. This matter is also recognized on the generalized crustal thickness map of the region in which an updoming of the upper mantle is observed. This study can improve our collective knowledge for copper exploration in this region.

Prayer, Attachment to God, and Changes in Psychological Well-Being in Later Life.

Science.gov (United States)

Bradshaw, Matt; Kent, Blake Victor

2018-06-01

The aim of this study was to investigate the effects of prayer and attachment to God on psychological well-being (PWB) in later life. Using data from two waves of the nationwide Religion, Aging, and Health Survey, we estimate the associations between frequency of prayer and attachment to God at baseline with cross-wave changes in three measures of PWB: self-esteem, optimism, and life satisfaction. Prayer does not have a main effect on PWB. Secure attachment to God is associated with improvements in optimism but not self-esteem or life satisfaction. The relationship between prayer and PWB is moderated by attachment to God; prayer is associated with improvements in PWB among securely attached individuals but not those who are insecurely attached to God. These findings shed light on the complex relationship between prayer and PWB by showing that the effects of prayer are contingent upon one's perceived relationship with God.

Copper chelators: chemical properties and bio-medical applications.

Science.gov (United States)

Tegoni, M; Valensin, D; Toso, L; Remelli, M

2014-01-01

Copper is present in different concentrations and chemical forms throughout the earth crust, surface and deep water and even, in trace amounts, in the atmosphere itself. Copper is one of the first metals used by humans, the first artifacts dating back 10,000 years ago. Currently, the world production of refined copper exceeds 16,000 tons/year. Copper is a micro-element essential to life, principally for its red-ox properties that make it a necessary cofactor for many enzymes, like cytochrome-c oxidase and superoxide dismutase. In some animal species (e.g. octopus, snails, spiders, oysters) copper-hemocyanins also act as carriers of oxygen instead of hemoglobin. However, these red-ox properties also make the pair Cu(+)/Cu(2+) a formidable catalyst for the formation of reactive oxygen species, when copper is present in excess in the body or in tissues. The treatment of choice in cases of copper overloading or intoxication is the chelation therapy. Different molecules are already in clinical use as chelators or under study or clinical trial. It is worth noting that chelation therapy has also been suggested to treat some neurodegenerative diseases or cardiovascular disorders. In this review, after a brief description of the homeostasis and some cases of dyshomeostasis of copper, the main (used or potential) chelators are described; their properties in solution, even in relation to the presence of metal or ligand competitors, under physiological conditions, are discussed. The legislation of the most important Western countries, regarding both the use of chelating agents and the limits of copper in foods, drugs and cosmetics, is also outlined.

Assessment of the anti-biofouling potentials of a copper iodide-doped nylon mesh.

Science.gov (United States)

Sato, Tetsuya; Fujimori, Yoshie; Nakayama, Tsuruo; Gotoh, Yasuo; Sunaga, Yoshihiko; Nemoto, Michiko; Matsunaga, Tadashi; Tanaka, Tsuyoshi

2012-08-01

We propose a copper iodide (CuI)-doped nylon mesh prepared using polyiodide ions as a precursor toward anti-biofouling polymer textile. The CuI-doped nylon mesh was subjected to the prevention of biofouling in marine environments. The attachment of the marine organisms was markedly inhibited on the CuI-doped nylon mesh surface until 249 days. Scanning electron microscopy-energy dispersive X-ray analysis indicated that copper compounds were maintained in the nylon mesh after the field experiment, although copper content in the nylon mesh was reduced. Therefore, the copper ions slowly dissolved from nylon mesh will contribute to the long-term prevention of biofouling. Furthermore, electron spin resonance analysis revealed the generation of reactive oxygen species (ROS) from CuI-doped nylon mesh after the field experiment. One of the possibilities for toxic action of copper ions will be the direct effect of Cu+ -induced ROS on biofilm forming on nylon mesh surface. The proposed polymer textile can be applied to fishing and aquafarming nets, mooring rope for ship, or silt fence to restrict polluted water in marine environments.

Ion bombardment effect on surface state of metal

International Nuclear Information System (INIS)

Vaulin, E.P.; Georgieva, N.E.; Martynenko, T.P.

1990-01-01

The effect of slow argon ion bombardment on the surface microstructure of polycrystalline copper as well as the effect of surface state on sputtering of D-16 polycrystalline alloy are experimentally studied. Reduction of copper surface roughness is observed. It is shown that the D-16 alloy sputtering coefficient is sensitive to the surface state within the limits of the destructed surface layer

Electrodeposition of Copper/Carbonous Nanomaterial Composite Coatings for Heat-Dissipation Materials

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Yasuki Goto

2017-12-01

Full Text Available Carbonous nanomaterials are promising additives for composite coatings for heat-dissipation materials because of their excellent thermal conductivity. Here, copper/carbonous nanomaterial composite coatings were prepared using nanodiamond (ND as the carbonous nanomaterial. The copper/ND composite coatings were electrically deposited onto copper substrates from a continuously stirred copper sulfate coating bath containing NDs. NDs were dispersed by ultrasonic treatment, and the initial bath pH was adjusted by adding sodium hydroxide solution or sulfuric acid solution before electrodeposition. The effects of various coating conditions—the initial ND concentration, initial bath pH, stirring speed, electrical current density, and the amount of electricity—on the ND content of the coatings were investigated. Furthermore, the surface of the NDs was modified by hydrothermal treatment to improve ND incorporation. A higher initial ND concentration and a higher stirring speed increased the ND content of the coatings, whereas a higher initial bath pH and a greater amount of electricity decreased it. The electrical current density showed a minimum ND content at approximately 5 A/dm2. Hydrothermal treatment, which introduced carboxyl groups onto the ND surface, improved the ND content of the coatings. A copper/ND composite coating with a maximum of 3.85 wt % ND was obtained.

[Personal resources relevant to psychological well-being in nursing].

Science.gov (United States)

Arrogante, O; Pérez-García, A M; Aparicio-Zaldívar, E G

2016-01-01

To determine differences in social support, resilience, coping, and psychological well-being (PWB) among intensive care nursing and nursing staff of other hospital services, as well as to establish a structural model in these professionals where relevant personal resources to PWB were included. Correlational and cross-sectional study. A sample of 208 nursing professionals from University Hospital of Fuenlabrada (Madrid) took part in the study. This sample consisted of nurses (n=133), nursing assistants (n=61), and midwives (n=14), of whom 44 worked in intensive care unit, 50 in other special units, and 114 in wards. Social Support Subscale, 10-Item CD-RISC (resilience), Brief-Cope (coping), Scales of PWB, and sociodemographic variables. No differences were found in any assessed psychological variables as regards hospital service worked in. A structural model was found and showed that social support, resilience, and coping determined PWB of nursing professionals. The most important personal resource was coping strategies, which determined PWB directly (β=0.68). Social support influenced PWB directly (β=0.33), and indirectly (β=0.32), whereas resilience influenced it indirectly (β=0.57). Differences in PWB, coping, social support and resilience are not determined by hospital service. Coping strategies focused on engagement (or adaptive), social support, and resilience, constitute three relevant personal resources that determine the PWB of nursing staff, which can be developed and improved by specific programs. The most important PWB dimensions are self-acceptance and environment mastery. Copyright © 2015 Elsevier España, S.L.U. y SEEIUC. All rights reserved.

Influence of copper on the by-products of different oil-paper insulations

International Nuclear Information System (INIS)

Hao Jian; Liao Ruijin; Chen, George; Ma Chao

2011-01-01

Transformer failure caused by the corrosion of copper material in transformer attracts great attention of researchers and engineers. In this paper, Karamay No. 25 naphthenic mineral oil, Karamay No. 25 paraffinic mineral oil, Kraft paper and copper were used to compose four combinations of oil-paper insulation samples. The ageing by-products and dielectric properties of the four combinations of oil-paper insulation samples were compared after they were thermally aged at 130 deg. C. The influence of copper on the by-products and dielectric properties of different oil-paper insulations was obtained. The results show that copper can accelerate the ageing rate of insulation oils and reduce their AC breakdown voltage. The content of copper substance dissolved in insulating oil increases with ageing time at first and then decreases. The paper aged in the oil-paper insulation sample with copper has higher moisture content than the one without copper. Results of energy dispersive spectroscopy (EDS) in the scanning electron microscope (SEM) show that there is copper product deposited on the surface of insulation paper. The insulation oil and paper aged in the oil-paper insulation sample with copper have higher dielectric loss and conductivity than that without copper.

Selective LPCVD growth of graphene on patterned copper and its growth mechanism

Science.gov (United States)

Zhang, M.; Huang, B.-C.; Wang, Y.; Woo, J. C. S.

2016-12-01

Copper-catalyzed graphene low-pressure chemical-vapor deposition (LPCVD) growth has been regarded as a viable solution towards its integration to CMOS technology, and the wafer-bonding method provides a reliable alternative for transferring the selective graphene grown on a patterned metal film for IC manufacturing. In this paper, selective LPCVD graphene growth using patterned copper dots has been studied. The Raman spectra of grown films have demonstrated large dependence on the growth conditions. To explain the results, the growth mechanisms based on surface adsorption and copper-vapor-assisted growth are investigated by the comparison between the blanket copper films with/without the additional copper source. The copper vapor density is found to be critical for high-quality graphene growth. In addition, the copper-vapor-assisted growth is also evidenced by the carbon deposition on the SiO2 substrate of the patterned-copper-dot sample and chamber wall during graphene growth. This growth mechanism explains the correlation between the growth condition and Raman spectrum for films on copper dots. The study on the copper-catalyzed selective graphene growth on the hard substrate paves the way for the synthesis and integration of the 2D material in VLSI.

Influence of copper on the by-products of different oil-paper insulations

Energy Technology Data Exchange (ETDEWEB)

Hao Jian; Liao Ruijin [State Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University (China); Chen, George [School of Electronics and Computer Science, University of Southampton (United Kingdom); Ma Chao, E-mail: cquhaojian@126.com [Gansu Electric Power Research Institute (China)

2011-08-12

Transformer failure caused by the corrosion of copper material in transformer attracts great attention of researchers and engineers. In this paper, Karamay No. 25 naphthenic mineral oil, Karamay No. 25 paraffinic mineral oil, Kraft paper and copper were used to compose four combinations of oil-paper insulation samples. The ageing by-products and dielectric properties of the four combinations of oil-paper insulation samples were compared after they were thermally aged at 130 deg. C. The influence of copper on the by-products and dielectric properties of different oil-paper insulations was obtained. The results show that copper can accelerate the ageing rate of insulation oils and reduce their AC breakdown voltage. The content of copper substance dissolved in insulating oil increases with ageing time at first and then decreases. The paper aged in the oil-paper insulation sample with copper has higher moisture content than the one without copper. Results of energy dispersive spectroscopy (EDS) in the scanning electron microscope (SEM) show that there is copper product deposited on the surface of insulation paper. The insulation oil and paper aged in the oil-paper insulation sample with copper have higher dielectric loss and conductivity than that without copper.

New data on the Hyrkkoelae U-Cu mineralization: the behaviour of native copper in a natural environment

Energy Technology Data Exchange (ETDEWEB)

Marcos, N. [Helsinki Univ. of Technology, Espoo (Finland); Ahonen, L. [Geological Survey of Finland, Helsinki (Finland)

1999-05-01

The Hyrkkoelae Cu-U mineralisation (SW Finland) is studied as an analogue to the behaviour of copper canister in crystalline bedrock. Uranium-native copper and uranium-copper corrosion products interactions are also addressed in this study. The integration of uranium series disequilibrium (USD) studies gives an estimate of the time-scales of the corrosion processes. The mineral assemblages native copper-copper sulfide, copper sulfides - copper iron sulfides, and native copper-copper oxide (cuprite) occur in open fractures at several depth intervals within granite pegmatites (GP). The surfaces of these open fractures have accumulations of uranophane crystals and other unidentified uranyl compounds. The secondary uranium minerals are mainly distributed around copper sulfide grains. Microscopic intergrowths of copper sulfides and uranyl compounds also have been observed. The surface of the fracture where native copper and cuprite occur is covered with uranium-rich smectite. The very low {sup 234}U/{sup 238}U activity ratio (0.29 - 0.39) in the main uranium fraction in smectite indicates chemical stable conditions (e.g., oxidising) during at least a time period comparable to the half-life of the {sup 234}U isotope (T{sub 1/2} = 2.44 x 10{sup 5} a). Groundwater samples were collected from intervals where copper minerals occur within open fractures. The Eh and pH conditions were measured during long-term pumping (2-4 weeks per sample). Eh was measured both in situ and an the surface using three electrodes (Pt, Au, C). The actual groundwater conditions are oxidising and would not allow the sulfidization of native copper. Sulfidization may be considered as on old phenomenon, older than the precipitation of uranyl phases in the samples. The end of sulfidization may be earlier than the precipitation and/or remobilisation of U(VI) phases in a time span from about 2 x 10{sup 5} years (precipitation of uranophane) to 2.44 x 10{sup 5} (remobilisation of U from smectite). (orig.)

New data on the Hyrkkoelae U-Cu mineralization: the behaviour of native copper in a natural environment

International Nuclear Information System (INIS)

Marcos, N.; Ahonen, L.

1999-05-01

The Hyrkkoelae Cu-U mineralisation (SW Finland) is studied as an analogue to the behaviour of copper canister in crystalline bedrock. Uranium-native copper and uranium-copper corrosion products interactions are also addressed in this study. The integration of uranium series disequilibrium (USD) studies gives an estimate of the time-scales of the corrosion processes. The mineral assemblages native copper-copper sulfide, copper sulfides - copper iron sulfides, and native copper-copper oxide (cuprite) occur in open fractures at several depth intervals within granite pegmatites (GP). The surfaces of these open fractures have accumulations of uranophane crystals and other unidentified uranyl compounds. The secondary uranium minerals are mainly distributed around copper sulfide grains. Microscopic intergrowths of copper sulfides and uranyl compounds also have been observed. The surface of the fracture where native copper and cuprite occur is covered with uranium-rich smectite. The very low 234 U/ 238 U activity ratio (0.29 - 0.39) in the main uranium fraction in smectite indicates chemical stable conditions (e.g., oxidising) during at least a time period comparable to the half-life of the 234 U isotope (T 1/2 = 2.44 x 10 5 a). Groundwater samples were collected from intervals where copper minerals occur within open fractures. The Eh and pH conditions were measured during long-term pumping (2-4 weeks per sample). Eh was measured both in situ and an the surface using three electrodes (Pt, Au, C). The actual groundwater conditions are oxidising and would not allow the sulfidization of native copper. Sulfidization may be considered as on old phenomenon, older than the precipitation of uranyl phases in the samples. The end of sulfidization may be earlier than the precipitation and/or remobilisation of U(VI) phases in a time span from about 2 x 10 5 years (precipitation of uranophane) to 2.44 x 10 5 (remobilisation of U from smectite). (orig.)

Recovery of copper ion by flotation with potassium amylxanthate

International Nuclear Information System (INIS)

Ramirez-Serrano, B.; Coello-Velazquez, A. L.; Bernardo, A.; Afif, E.; Menendez-Aguado, J. M.

2012-01-01

In this paper a study about the column flotation process of copper ion employing potassium amylxanthate as collector reagent is carried out. The effect on the recovery of copper ion by the modification of variables such as collector/metal relation and surface velocity of gas and liquid was determined experimentally by the analysis of the statistic-mathematical model of the copper flotation process, as well as the physico-chemical phenomena that take place, showing the effect of the collector/metal relation in the process. The effect of pH as the main properties of the chemical system in the recovery and the kinetic of the flotation process is made too. The experimental results shows that the recovery of copper in the pH range of 4,5 - 12 is possible with prevalence of precipitate flotation. (Author) 43 refs.

Psychological well-being in people with multiple sclerosis in an Iranian population

Directory of Open Access Journals (Sweden)

Sedigheh Rezaei Dehnavi

2015-01-01

Full Text Available Background: To date, few results on well-being in individuals with neurological disease have been published, while several studies in other groups have indicated that well-being may not be the only absence of psychological distress, but also positive psychological function. The aim of the present study was to compare the psychological well-being (PWB between the people with Multiple sclerosis (MS and normal individuals and identify correlated demographic factors to PWB in people with MS disorder. Materials and Methods: A case-control study was performed in July 2012 on 55 people with MS who were referred to MS clinic (located at the Kashani Hospital, Isfahan Neurosciences Research Centre and 83 normal individuals with matched mean of age, level of education, and gender. The participants filled up the 18-item Ryff′s PWB and demographic profile. The data were analyzed by SPSS software based on the independent t-test, and ANOVA. Results: There is significant different in all PWB dimensions between people with MS and normal groups. There were no significant differences in PWB in people with MS in relation to gender and marital status, but individuals with higher level of education scored higher in total PWB, positive relationship with others and purpose in life. Conclusion: People with MS are at risk of lower level of PWB. Interventional programs for improving PWB are strongly recommended.

Controlled Synthesis of Carbon-Encapsulated Copper Nanostructures by Using Smectite Clays as Nanotemplates

NARCIS (Netherlands)

Tsoufis, Theodoros; Colomer, Jean-Francois; Maccallini, Enrico; Jankovic, Lubos; Rudolf, Petra; Gournis, Dimitrios; Jankovič, Lubos

Rhomboidal and spherical metallic-copper nanostructures were encapsulated within well-formed graphitic shells by using a simple chemical method that involved the catalytic decomposition of acetylene over a copper catalyst that was supported on different smectite clays surfaces by ion-exchange. These

Synthesis of copper nanocolloids using a continuous flow based microreactor

Energy Technology Data Exchange (ETDEWEB)

Xu, Lei, E-mail: xulei_kmust@aliyun.com [State Key Laboratory of Complex Nonferrous Metal Resources Clean Utilization, Faculty of Metallurgical and Energy Engineering, Kunming University of Science and Technology, Kunming 650093 (China); Mechanical Engineering, University of Washington, Seattle 98195 (United States); Peng, Jinhui [State Key Laboratory of Complex Nonferrous Metal Resources Clean Utilization, Faculty of Metallurgical and Energy Engineering, Kunming University of Science and Technology, Kunming 650093 (China); Srinivasakannan, C. [Chemical Engineering Program, The petroleum Institute, Abu Dhabi, P.O. Box 253 (United Arab Emirates); Chen, Guo [State Key Laboratory of Complex Nonferrous Metal Resources Clean Utilization, Faculty of Metallurgical and Energy Engineering, Kunming University of Science and Technology, Kunming 650093 (China); Shen, Amy Q., E-mail: amy.shen@oist.jp [Mechanical Engineering, University of Washington, Seattle 98195 (United States); Micro/Bio/Nanofluidics Unit, Okinawa Institute of Technology Graduate University, Okinawa (Japan)

2015-11-15

Highlights: • The copper nanocolloidal were synthesized in a T-shaped microreactor at room temperature. • The morphology of copper nanocolloidal are spherical, and with good size distribution. • The mean particle diameter increased with decreases the NaBH{sub 4} molar concentration. • With increasing particle size, the more obvious localized surface plasmon resonance absorption. - Abstract: The copper (Cu) nanocolloids were prepared by sodium borohydride (NaBH{sub 4}) reduction of metal salt solutions in a T-shaped microreactor at room temperature. The influence of NaBH{sub 4} molar concentrations on copper particle's diameter, morphology, size distribution, and elemental compositions has been investigated by transmission electron microscopy (TEM) and X-ray diffraction (XRD). The ultraviolet–visible spectroscopy (UV–vis) was used to verify the chemical compounds of nanocolloids and estimate the average size of copper nanocolloids. The synthesized copper nanocolloids were uniform in size and non-oxidized. A decrease in the mean diameter of copper nanocolloids was observed with increasing NaBH{sub 4} molar concentrations. The maximum mean diameter (4.25 nm) occurred at the CuSO{sub 4}/NaBH{sub 4} molar concentration ratio of 1:2.

Evaluation of planarization performance for a novel alkaline copper slurry under a low abrasive concentration

International Nuclear Information System (INIS)

Jiang Mengting; Liu Yuling; Yuan Haobo; Chen Guodong; Liu Weijuan

2014-01-01

A novel alkaline copper slurry that possesses a relatively high planarization performance is investigated under a low abrasive concentration. Based on the action mechanism of CMP, the feasibility of using one type of slurry in copper bulk elimination process and residual copper elimination process, with different process parameters, was analyzed. In addition, we investigated the regular change of abrasive concentration effect on copper and tantalum removal rate and within wafer non-uniformity (WIWNU) in CMP process. When the abrasive concentration is 3 wt%, in bulk elimination process, the copper removal rate achieves 6125 Å/min, while WIWNU is 3.5%, simultaneously. In residual copper elimination process, the copper removal rate is approximately 2700 Å/min, while WIWNU is 2.8%. Nevertheless, the tantalum removal rate is 0 Å/min, which indicates that barrier layer isn't eliminated in residual copper elimination process. The planarization experimental results show that an excellent planarization performance is obtained with a relatively high copper removal rate in bulk elimination process. Meanwhile, after residual copper elimination process, the dishing value increased inconspicuously, in a controllable range, and the wafer surface roughness is only 0.326 nm (sq < 1 nm) after polishing. By comparison, the planarization performance and surface quality of alkaline slurry show almost no major differences with two kinds of commercial acid slurries after polishing. All experimental results are conducive to research and improvement of alkaline slurry in the future. (semiconductor technology)

Facile fabrication of superhydrophobic surface with excellent mechanical abrasion and corrosion resistance on copper substrate by a novel method.

Science.gov (United States)

Su, Fenghua; Yao, Kai

2014-06-11

A novel method for controllable fabrication of a superhydrophobic surface with a water contact angle of 162 ± 1° and a sliding angle of 3 ± 0.5° on copper substrate is reported in this Research Article. The facile and low-cost fabrication process is composed from the electrodeposition in traditional Watts bath and the heat-treatment in the presence of (heptadecafluoro-1,1,2,2-tetradecyl) triethoxysilane (AC-FAS). The superhydrophobicity of the fabricated surface results from its pine-cone-like hierarchical micro-nanostructure and the assembly of low-surface-energy fluorinated components on it. The superhydrophobic surface exhibits high microhardness and excellent mechanical abrasion resistance because it maintains superhydrophobicity after mechanical abrasion against 800 grit SiC sandpaper for 1.0 m at the applied pressure of 4.80 kPa. Moreover, the superhydrophobic surface has good chemical stability in both acidic and alkaline environments. The potentiodynamic polarization and electrochemical impedance spectroscopy test shows that the as-prepared superhydrophobic surface has excellent corrosion resistance that can provide effective protection for the bare Cu substrate. In addition, the as-prepared superhydrophobic surface has self-cleaning ability. It is believed that the facile and low-cost method offer an effective strategy and promising industrial applications for fabricating superhydrophobic surfaces on various metallic materials.

Influence of grain orientation on evolution of surface features in fatigued polycrystalline copper: A comparison of thermal and uniaxial mechanical fatigue results

International Nuclear Information System (INIS)

Aicheler, Markus

2010-01-01

Surface state plays a major role in the crack nucleation process of pure metals in the High-Cycle-Fatigue (HCF) as well as in the Ultra-High-Cycle-Fatigue (UHCF) regime. Therefore, in studies dealing with HCF or UHCF, special attention is paid to the evolution of surface degradation during fatigue life. The accelerating structures of the future Compact Linear Collider (CLIC) under study at CERN will be submitted to a high number of thermal-mechanical fatigue cycles, arising from Radio Frequency (RF) induced eddy currents, causing local superficial cyclic heating. The number of cycles during the foreseen lifetime of CLIC reaches 2x10 11 . Fatigue may limit the lifetime of CLIC structures. In order to assess the effects of superficial fatigue, specific tests are defined and performed on polycrystalline Oxygen Free Electronic (OFE) grade Copper, a candidate material for the structures. Surface degradation depends on the orientation of near-surface grains. Copper samples thermally fatigued in two different fatigue experiments, pulsed laser and pulsed RF-heating, underwent postmortem Electron Backscattered Diffraction measurements. Samples fatigued by pulsed laser show the same trend in the orientation-fatigue damage behavior as samples fatigued by pulsed RF-heating. It is clearly observed that surface grains, oriented [1 1 1] with respect to the surface, show significantly more damage than surface grains oriented [1 0 0]. Results arising from a third fatigue experiment, the ultrasound (US) swinger, are compared to the results of the mentioned experiments. The US swinger is an uniaxial mechanical fatigue test enabling to apply within several days a total number of cycles representative of the life of the CLIC structures, thanks to a high repetition rate of 24 kHz. For comparison, laser fatigue experiments have much lower repetition rates. The dependence of surface degradation on grain orientation of samples tested by the US swinger was monitored during the fatigue life

Studies on use of Copper Slag as Replacement Material for River Sand in Building Constructions

Science.gov (United States)

Madheswaran, C. K.; Ambily, P. S.; Dattatreya, J. K.; Rajamane, N. P.

2014-09-01

This work focuses on the use of copper slag, as a partial replacement of sand for use in cement concrete and building construction. Cement mortar mixtures prepared with fine aggregate made up of different proportions of copper slag and sand were tested for use as masonry mortars and plastering. Three masonry wall panels of dimensions 1 × 1 m were plastered. The studies showed that although copper slag based mortar is suitable for plastering, with the increase in copper slag content, the wastage due to material rebounding from the plastered surfaces increases. It is therefore suggested that the copper slag can be used for plastering of floorings and horizontal up to 50 % by mass of the fine aggregate, and for vertical surfaces, such as, brick/block walls it can be used up to 25 %. In this study on concrete mixtures were prepared with two water cement ratios and different proportions of copper slag ranging from 0 % (for the control mix) to 100 % of fine aggregate. The Concrete mixes were evaluated for workability, density, and compressive strength.

Physical characterization and recovery of corroded fingerprint impressions from postblast copper pipe bomb fragments.

Science.gov (United States)

Bond, John W; Brady, Thomas F

2013-05-01

Pipe bombs made from 1 mm thick copper pipe were detonated with a low explosive power powder. Analysis of the physical characteristics of fragments revealed that the copper had undergone work hardening with an increased Vickers Hardness of 107HV1 compared with 80HV1 for unexploded copper pipe. Mean plastic strain prior to fracture was calculated at 0.28 showing evidence of both plastic deformation and wall thinning. An examination of the external surface showed microfractures running parallel with the length of the pipe at approximately 100 μm intervals and 1-2 μm in width. Many larger fragments had folded "inside out" making the original outside surface inaccessible and difficult to fold back through work hardening. A visual examination for fingerprint corrosion revealed ridge details on several fragments that were enhanced by selective digital mapping of colors reflected from the surface of the copper. One of these fingerprints was identified partially to the original donor. © 2013 American Academy of Forensic Sciences.

Copper-Containing Anti-Biofilm Nanofiber Scaffolds as a Wound Dressing Material.

Directory of Open Access Journals (Sweden)

Jayesh J Ahire

Full Text Available Copper particles were incorporated into nanofibers during the electrospinning of poly-D,L-lactide (PDLLA and poly(ethylene oxide (PEO. The ability of the nanofibers to prevent Pseudomonas aeruginosa PA01 and Staphylococcus aureus (strain Xen 30 to form biofilms was tested. Nanofibers containing copper particles (Cu-F were thinner (326 ± 149 nm in diameter, compared to nanofibers without copper (CF; 445 ± 93 nm in diameter. The crystalline structure of the copper particles in Cu-F was confirmed by X-ray diffraction (XRD. Copper crystals were encapsulated, but also attached to the surface of Cu-F, as shown scanning transmission electron microscopy (STEM and transmission electron microscopy (TEM, respectively. The copper particles had no effect on the thermal degradation and thermal behaviour of Cu-F, as shown by thermogravimetric analysis (TGA and differential scanning calorimeter (DSC. After 48 h in the presence of Cu-F, biofilm formation by P. aeruginosa PA01 and S. aureus Xen 30 was reduced by 41% and 50%, respectively. Reduction in biofilm formation was ascribed to copper released from the nanofibers. Copper-containing nanofibers may be incorporated into wound dressings.

Nitrogen-doped graphene network supported copper nanoparticles encapsulated with graphene shells for surface-enhanced Raman scattering

Science.gov (United States)

Zhang, Xiang; Shi, Chunsheng; Liu, Enzuo; Li, Jiajun; Zhao, Naiqin; He, Chunnian

2015-10-01

In this study, we demonstrated nitrogen-doped graphene network supported few-layered graphene shell encapsulated Cu nanoparticles (NPs) (Cu@G-NGNs) as a sensing platform, which were constructed by a simple and scalable in situ chemical vapor deposition (CVD) technique with the assistance of a self-assembled three-dimensional (3D) NaCl template. Compared with pure Cu NPs and graphene decorated Cu NPs, the graphene shells can strengthen the plasmonic coupling between graphene and Cu, thereby contributing to an obvious improvement in the local electromagnetic field that was validated by finite element numerical simulations, while the 3D nitrogen-doped graphene walls with a large surface area facilitated molecule adsorption and the doped nitrogen atoms embedded in the graphene lattice can reduce the surface energy of the system. With these merits, a good surface enhanced Raman spectroscopy (SERS) activity of the 3D Cu@G-NGN painting film on glass was demonstrated using rhodamine 6G and crystal violet as model analytes, exhibiting a satisfactory sensitivity, reproducibility and stability. As far as we know, this is the first report on the in situ synthesis of nitrogen-doped graphene/copper nanocomposites and this facile and low-cost Cu-based strategy tends to be a good supplement to Ag and Au based substrates for SERS applications.In this study, we demonstrated nitrogen-doped graphene network supported few-layered graphene shell encapsulated Cu nanoparticles (NPs) (Cu@G-NGNs) as a sensing platform, which were constructed by a simple and scalable in situ chemical vapor deposition (CVD) technique with the assistance of a self-assembled three-dimensional (3D) NaCl template. Compared with pure Cu NPs and graphene decorated Cu NPs, the graphene shells can strengthen the plasmonic coupling between graphene and Cu, thereby contributing to an obvious improvement in the local electromagnetic field that was validated by finite element numerical simulations, while the 3D nitrogen

Relationships Between Career Indecision, Search for Work Self-Efficacy, and Psychological Well-Being in Italian Never-Employed Young Adults

Directory of Open Access Journals (Sweden)

Maria Maddalena Viola

2017-05-01

Full Text Available Although different studies have investigated career choices as cognitive acts of decision-making, non-cognitive components also play an important role. The study tries to develop an empirically based model of career decision-making process linking cognitive (search for work self-efficacy - SWSE and non-cognitive (psychological well-being - PWB components. In particular, the study investigates, among 148 never-employed Italian young adults, to what extent the relationship between SWSE and career indecision in terms of lack of readiness (LoR can be explained by their common relationship with PWB. Results highlighted that SWSE is negatively associated with LoR when considered in absence of PWB. However, when PWB was included in one comprehensive model, it was positively associated with SWSE and negatively related to LoR. Moreover, the presence of PWB nullified the negative association between SWSE and LoR, meaning that PWB shares a large extent of variance with these variables. Implications are discussed in the light of theoretical expectations and limitations.

Positive correlation of employment and psychological well-being for veterans with major abdominal surgery.

Science.gov (United States)

Horner, David J; Wendel, Christopher S; Skeps, Raymond; Rawl, Susan M; Grant, Marcia; Schmidt, C Max; Ko, Clifford Y; Krouse, Robert S

2010-11-01

Intestinal stomas (ostomies) have been associated negatively with multiple aspects of health-related quality of life. This article examines the relationship between employment status and psychological well-being (PWB) in veterans who underwent major bowel procedures with or without ostomy. Veterans from 3 Veterans Affairs (VA) medical centers were surveyed using the City of Hope ostomy-specific questionnaire and the Short Form 36 item Veteran's version (SF-36V). Response rate was 48% (511 of 1,063). Employment and PWB relationship was assessed using multiple regression with age, income, SF-36V physical component summary (PCS), and employment status as independent variables. Employed veterans reported higher PWB compared with unemployed veterans (P = .003). Full-time workers also reported higher PWB than part-time or unemployed workers (P = .001). Ostomy was not an independent predictor of PWB. Employment among veterans after major abdominal surgery may have intrinsic value for PWB. Patients should be encouraged to return to work, or do volunteer work after recovery. Published by Elsevier Inc.

Validation of the Danish-language psychological well-being-post-traumatic changes questionnaire

DEFF Research Database (Denmark)

la Cour, Peter; Sternhagen Nielsen, Anni Brit; Andersen, Soren Bo

2016-01-01

The Psychological Well-Being–Post-Traumatic Changes Questionnaire (PWB-PTCQ) is an 18-item self-report measure for assessing perceived changes in psychological well-being following traumatic events. The aim of the study was to translate, adapt, and test a Danish-language version of the questionna...... with the psychological distress measures; the PWB-PTCQ did not correlate, whereas the PTGI correlated positively. The Danish-language version of the PWB-PTCQ is found valid and reliable.......The Psychological Well-Being–Post-Traumatic Changes Questionnaire (PWB-PTCQ) is an 18-item self-report measure for assessing perceived changes in psychological well-being following traumatic events. The aim of the study was to translate, adapt, and test a Danish-language version...... of the questionnaire and to compare the measure with the Posttraumatic Growth Inventory (PTGI). The PWB-PTCQ, the PTGI, and scales measuring psychological distress were administered to 290 soldiers a mean of 8 months after they returned from deployment. The psychometric properties of the PWB-PTCQ were satisfactory...

Electrical conduction in composites containing copper core-copper

Indian Academy of Sciences (India)

Composites of nanometre-sized copper core-copper oxide shell with diameters in the range 6.1 to 7.3 nm dispersed in a silica gel were synthesised by a technique comprising reduction followed by oxidation of a suitably chosen precursor gel. The hot pressed gel powders mixed with nanometre-sized copper particles ...

Copper corrosion in irradiated environments: The influence of H2O2 on the electrochemistry of copper dissolution in HCl electrolyte

International Nuclear Information System (INIS)

Smyrl, W.H.; Bell, B.T.; Atanasoski, R.T.; Glass, R.S.

1986-12-01

The anodic dissolution of copper was examined in deaerated, 0.1 M HCl aqueous solution in the presence of H 2 O 2 . Concentrations of H 2 O 2 up to 0.2 M were studied at a rotating copper disk-platinum ring electrode. The open circuit potential (OCP) of copper was found to depend on both peroxide concentration and rotation rate. The OCP shifts towards more positive values with increasing H 2 O 2 concentration (C) and decreasing rotation rate. The current-voltage curves for anodic dissolution of copper were also influenced by the presence of peroxide. The curves recorded with the potential scanned in the positive direction showed the expected 60 mV slope, but the reverse scans showed significant departures. At a given potential scan rate, hysteresis was observed which was larger for higher H 2 O 2 concentrations, lower rotation rates, and more positive anodic potential limits. Monitoring the cuprous ions at the outer Pt ring revealed that there was a complex set of events taking place at the copper surface, including film formation and the appearance of cupric ions. 13 refs., 7 figs

Study of sorption processes of copper on synthetic hydroxyapatite

International Nuclear Information System (INIS)

Rosskopfova, O.; Galambos, M.; Ometakova, J.; Rajec, P.; Caplovicova, M.

2012-01-01

The sorption of copper on synthetic hydroxyapatite was investigated using a batch method and radiotracer technique. The hydroxyapatite sample prepared by a wet precipitation process was of high crystallinity with Ca/P ratio of 1.688. The sorption of copper on hydroxyapatite was pH independent ranging from 4 to 6 as a result of buffering properties of hydroxyapatite. The adsorption of copper was rapid and the percentage of Cu sorption was >98% during the first 15-30 min of the contact time. The experimental data for sorption of copper have been interpreted in the term of Langmuir isotherm. The sorption of Cu 2+ ions was performed by ion-exchange with Ca 2+ cations on the crystal surface of hydroxyapatite under experimental conditions. The competition effect of Zn 2+ , Fe 2+ and Pb 2+ towards Cu 2+ sorption was stronger than that of Co 2+ , Ni 2+ and Ca 2+ ions. The ability of the bivalent cations to depress the sorption of copper on hydroxyapatite was in the following order Pb 2+ > Fe 2+ > Zn 2+ > Co 2+ ∼ Ni 2+ . (author)

Structural changes in a copper alloy due to helium implantation

International Nuclear Information System (INIS)

Moreno, D.; Eliezer, D.

1996-01-01

The most suitable nuclear fusion reaction for energy production occurs between the two heavy hydrogen isotopes, deuterium and tritium. Structural materials in fusion reactors will be exposed to helium implantation over a broad range of energies. The deformation and partial exfoliation of surface layers due to hydrogen isotopes and helium contribute to the total erosion of the first wall. For this reason, one of the most important criteria in the choice of materials for the first wall of fusion reactors is the material's damage resistance. Recent advances in developing nuclear fusion reactors reveal that efficient heat removal from plasma-facing components is very important. Copper and copper alloys are considered an attractive choice for transporting such a high heat flux without thermal damage as they have high thermal conductivity. In the present study the authors report on the structural changes in a copper alloy, due to the helium implantation on the very near surface area, observed by transmission electron microscopy

Direct measurement of the adsorption kinetics of 2-Mercaptobenzothiazole on a microcrystalline copper surface

Directory of Open Access Journals (Sweden)

Ramírez-Cano, Jorge A.

2016-03-01

Full Text Available The adsorption on copper of 2-Mercaptobenzothiazole (2-MBT, a eterocyclic compound member of the tiazole family, has been investigated at different concentrations (1×10−1 to 1×10−6 M in water, employing the Electrochemical Quartz Crystal Microbalance (EQCM. The frequency response over time was obtained for each concentration, showing a defined exponential behavior at higher concentrations (1×10−1, 1×10−2 and 1×10−3 M, which was fitted to the Langmuir adsorption isotherm with a good correlation coefficients (R2=0.91 to 0.98. Surface coverage (θ was calculated and found to be in the order of 0.50 to 0.01 for 2-MBT high concentrations. The free energy of adsorption was ΔGads=−5.59 kJ mol−1, corresponding to physisorption process, probably of electrostatic nature of the interaction between 2-MBT and copper surface in aqueous solution.En el presente trabajo se ha investigado la adsorción del 2-Mercaptobenzotiazol (2-MBT en cobre, un compuesto heterocíclico miembro de la familia de los tiazoles, en solución acuosa a diferentes concentraciones (1×10−1 a 1×10−6 M, empleando la Balanza Electroquímica de Cristal de Cuarzo (BECC. Se midió y analizó el cambio de frecuencia con respecto al tiempo para cada concentración, mostrando un comportamiento exponencial definido en el rango de concentraciones altas (1×10−1, 1×10−2 y 1×10−3 M, los cambios de frecuencia registrados se ajustaron usando la isoterma de adsorción de Langmuir obteniendo buenos coeficientes de correlación (R2=0,91 a 0,98. Se calculó también la fracción de superficie recubierta y se halló que se encuentra en el orden de 0,50 a 0,01 para las concentraciones altas de 2-MBT. La energía libre de adsorción calculada fue de ΔGads=−5,59 kJ mol−1, lo cual corresponde a un proceso de fisisorción.

Copper-coated laser-fusion targets using molecular-beam levitation

International Nuclear Information System (INIS)

Rocke, M.J.

1981-01-01

A series of diagnostic experiments at the Shiva laser fusion facility required targets of glass microspheres coated with 1.5 to 3.0 μm of copper. Previous batch coating efforts using vibration techniques gave poor results due to microsphere sticking and vacuum welding. Molecular Beam Levitation (MBL) represented a noncontact method to produce a sputtered copper coating on a single glassmicrosphere. The coating specifications that were achieved resulted in a copper layer up to 3 μm thick with the allowance of a maximum variation of 10 nm in surface finish and thickness. These techniques developed with the MBL may be applied to sputter coat many soft metals for fusion target applications

Synthesis and characterization of αzirconium (IV) hydrogenphosphate containing metallic copper clusters

International Nuclear Information System (INIS)

Souza, Alexilda Oliveira de; Rangel, Maria do Carmo; Alves, Oswaldo Luiz

2005-01-01

The α-zirconium (IV) hydrogenphosphate (α-ZrP) has received great attention in the last years due to its properties like ion exchange, intercalation, ionic conductivity and catalytic activity. This work reports a method to produce metallic copper clusters on α-ZrP to be used as catalysts in petrochemical processes. It was found that the solids were non-crystalline regardless of the uptake of copper and the reduction. The specific surface area increased as a consequence of the increase of the interlayer distance to accept the copper ions between the layers. During the reduction, big clusters of copper (0,5-11μ) with different sizes and shapes were produced. (author)

Antimicrobial activity of copper against organisms in aqueous solution: a case for copper-based water pipelines in hospitals?

Science.gov (United States)

Cervantes, Hilda I; Alvarez, Jose A; Muñoz, Juan M; Arreguín, Virginia; Mosqueda, Juan L; Macías, Alejandro E

2013-12-01

An association exists between water of poor quality and health care-associated infections. Copper shows microbiocidal action on dry surfaces; it is necessary to evaluate its antimicrobial effect against organisms in aqueous solution. The objective was to determine the in vitro antimicrobial activity of copper against common nosocomial pathogens in aqueous solution. Copper and polyvinyl chloride containers were used. Glass was used as control material. Fourteen organisms isolated from hospital-acquired infections, and 3 control strains were tested. Inocula were prepared by direct suspension of colonies in saline solution and water in each container tested. Bacterial counts in colony-forming units (CFU)/mL were determined at the beginning of the experiment; at 30 minutes; and at 1, 2, 24, and 48 hours. Organisms in glass and polyvinyl chloride remained viable until the end of the experiment. Organisms in copper showed a reduction from more than 100,000 CFU/mL to 0 CFU/mL within the first 2 hours of contact (F > 4.29, P water for human use, particularly in hospitals. Copyright © 2013 Association for Professionals in Infection Control and Epidemiology, Inc. Published by Mosby, Inc. All rights reserved.

A mechanistic study of the uniform corrosion of copper in compacted clay-sand soil

International Nuclear Information System (INIS)

Litke, C.D.; Ryan, S.R.; King, F.

1992-08-01

The results of a study of the mechanism of uniform corrosion of copper under simulated nuclear fuel waste disposal conditions are presented. Evidence is given that suggests that the rate-controlling process is the transport of copper corrosion products away from the corroding surface. In the experiments described here, the copper diffused through a column of compacted clay-sand buffer. The properties of the buffer material, especially its ability to sorb copper species, are significant in determining the rate of uniform corrosion of copper. The evidence that copper diffusion is rate-controlling stems from the effect of γ-radiation on the tests. In the presence of γ-radiation, copper diffused farther along the column of compacted buffer material than in the unirradiated tests, but the corrosion rate was lower. These two effects can be best explained in terms of a slow copper-diffusion process. Irradiation is thought to reduce the extent of sorption of copper by the clay component of the buffer. This results in a more mobile copper species and a smaller interfacial flux of copper (i.e., a lower corrosion rate)

Dependence of stability of metastable superconductors on copper fraction

International Nuclear Information System (INIS)

Elrod, S.A.; Lue, J.W.; Miller, J.R.; Dresner, L.

1980-12-01

The stability of composite superconductors operating in the metastable regime depends upon such factors as matrix resistivity, cooled surface dimensions, fraction of critical current, and volume fraction of stabilizer. By assuming constant thermophysical properties, we developed analytic expressions for the energy and voltage of the minimum propagating zone (MPZ). With other factors held constant, these expressions have been used to predict composite superconductor stability as a function of copper fraction: lower copper fractions lead to higher MPZ energies. MPZ voltages have been measured for three NbTi/Cu composites having different copper fractions and different critical current densities for several magnetic fields and transport currents. Experimental MPZ voltages have been used to calculate an effective heat transfer coefficient, which is subsequently used to calculate the MPZ energy. The experimental MPZ energies support the theoretical expectation that lower copper fractions lead to higher stability in the metastable regime

Surface Chemistry and Tribology of Copper Surfaces in Carbon Dioxide and Water Vapor Environments

Science.gov (United States)

2011-02-23

state that the copper brushes in the superconducting homopolar motor experience wear at rates greater than 3X10" wear /distance traveled when biased...positively. It has been found the motor operates best in an atmosphere of carbon dioxide and water vapor. The objective of our research therefore is...possible to prepare different chemical states of the Cu, as those produced in the motor electrodes under positive and negative bias. In situ XAS

Reagent conditions of the flotation of copper, copper - molybdenum and copper -zinc ores in foreing countries

International Nuclear Information System (INIS)

Nevaeva, L.M.

1983-01-01

Reagents-collectors and frothers, used abroad in reagent regimes of flotation of copper, copper-molybdenum and copper zinc ores, have been considered. Xanthogenates, aerofloats, xanthogenformiates, thionocarbamates are mainly used as reagents-collectors. Methylizobutylcarbinol and Daufros are used as reagents-frothers

Is Copper Immune to Corrosion When in Contact With Water and Aqueous Solutions?

International Nuclear Information System (INIS)

Macdonald, Digby D.; Sharifi-Asl, Samin

2011-03-01

Objectives The aim of this project has been to increase knowledge and to contribute to the research community in the area of copper corrosion in a repository environment. For SSM, the most important subject is to provide better conditions for a science based evaluation of a repository for spent nuclear fuel. In this respect, this project aimed at conducting a comprehensive theoretical study on corrosion of copper in repository environment based on an expected composition of dissolved species in the groundwater in the Forsmark area. In addition the thermodynamic immunity of copper in pure anoxic water has been especially addressed as this was one of the initial conditions made by SKB for selecting copper as canister material. Results The authors have shown, in so-called corrosion Domain Diagrams, that copper in a thermodynamic sense can be considered as immune in pure anoxic water (without dissolved oxygen) only under certain conditions. It is shown that copper will corrode in pure anoxic water with very low concentrations of [Cu + ] and very low partial pressures of hydrogen gas. At higher concentrations of [Cu + ] and partial pressures of hydrogen, copper is found to be thermodynamically immune and will not corrode. The rate of copper corrosion in the repository water environment will thus depend on the transport of corrosion products away from the copper surface or the transport of corroding species to the copper surface. The degree to which this affects the corrosion of copper canisters in the repository environment has not been further studied. Still, the result shows that copper cannot be considered as thermodynamically immune in the presence of pure anoxic water, this implicate that one of SKB:s initial conditions for selecting copper as a canister material can be questioned. To what degree this may influence the corrosion of copper canisters in the repository environment still needs to be investigated. Of other species present in the water at repository

Is Copper Immune to Corrosion When in Contact With Water and Aqueous Solutions?

Energy Technology Data Exchange (ETDEWEB)

Macdonald, Digby D.; Sharifi-Asl, Samin (Pennsylvania State Univ., PA (United States). Center for Electrochemical Science and Technology, Dept. of Materials Science and Engineering)

2011-03-15

Objectives The aim of this project has been to increase knowledge and to contribute to the research community in the area of copper corrosion in a repository environment. For SSM, the most important subject is to provide better conditions for a science based evaluation of a repository for spent nuclear fuel. In this respect, this project aimed at conducting a comprehensive theoretical study on corrosion of copper in repository environment based on an expected composition of dissolved species in the groundwater in the Forsmark area. In addition the thermodynamic immunity of copper in pure anoxic water has been especially addressed as this was one of the initial conditions made by SKB for selecting copper as canister material. Results The authors have shown, in so-called corrosion Domain Diagrams, that copper in a thermodynamic sense can be considered as immune in pure anoxic water (without dissolved oxygen) only under certain conditions. It is shown that copper will corrode in pure anoxic water with very low concentrations of [Cu+] and very low partial pressures of hydrogen gas. At higher concentrations of [Cu+] and partial pressures of hydrogen, copper is found to be thermodynamically immune and will not corrode. The rate of copper corrosion in the repository water environment will thus depend on the transport of corrosion products away from the copper surface or the transport of corroding species to the copper surface. The degree to which this affects the corrosion of copper canisters in the repository environment has not been further studied. Still, the result shows that copper cannot be considered as thermodynamically immune in the presence of pure anoxic water, this implicate that one of SKB:s initial conditions for selecting copper as a canister material can be questioned. To what degree this may influence the corrosion of copper canisters in the repository environment still needs to be investigated. Of other species present in the water at repository depth in

Water requirements of the copper industry

Science.gov (United States)

Mussey, Orville Durey

1961-01-01

The copper industry in 1955 used about 330 million gallons of water per day in the mining and manufacturing of primary copper. This amount is about 0.3 percent of the total estimated withdrawals of industrial water in the United States in 1955. These facts were determined by a survey, in 1956, of the amount and chemical quality of the water used by the copper industry. A large part of this water was used in Arizona, Nevada, New Mexico, and Utah, where about five-sixths of the domestic copper is mined. Much of the remaining water use was near New York City where most of the electrolytic refineries are located, and the rest of the water was used in widely scattered places. A little more than 100,000 gallons of water per ton of copper was used in the production of copper from domestic ores. Of this amount about 70,000 gallons per ton was used in mining and concentrating the ore, and about 30,000 gallons per ton was used to reduce the concentrate to refined copper. In areas where water was scarce or expensive, the unit water use was a little more than half the average. About 60 mgd (million gallons per day) or 18 percent of the water was used consumptively, and nearly all of the consumptive use occurred in the water-short areas of the West. Of the water used in mining and manufacturing primary copper 75 percent was surface water and 25 percent was ground water, 89 percent of this water was self-supplied by the copper companies and 11 percent came from public supplies. Much of the water used in producing primary copper was of comparatively poor quality; about 46 percent was saline containing 1,000 ppm (parts per million) or more of dissolved solids and 54 percent was fresh. Water that is used for concentration of copper ores by flotation or even any water that comes in contact with the ore at any time before it reaches the flotation plant must be free of petroleum products because they interfere with the flotation process. The water used in mining and ore concentration

Stress corrosion cracking of copper canisters

Energy Technology Data Exchange (ETDEWEB)

King, Fraser (Integrity Corrosion Consulting Limited (Canada)); Newman, Roger (Univ. of Toronto (Canada))

2010-12-15

A critical review is presented of the possibility of stress corrosion cracking (SCC) of copper canisters in a deep geological repository in the Fennoscandian Shield. Each of the four main mechanisms proposed for the SCC of pure copper are reviewed and the required conditions for cracking compared with the expected environmental and mechanical loading conditions within the repository. Other possible mechanisms are also considered, as are recent studies specifically directed towards the SCC of copper canisters. The aim of the review is to determine if and when during the evolution of the repository environment copper canisters might be susceptible to SCC. Mechanisms that require a degree of oxidation or dissolution are only possible whilst oxidant is present in the repository and then only if other environmental and mechanical loading conditions are satisfied. These constraints are found to limit the period during which the canisters could be susceptible to cracking via film rupture (slip dissolution) or tarnish rupture mechanisms to the first few years after deposition of the canisters, at which time there will be insufficient SCC agent (ammonia, acetate, or nitrite) to support cracking. During the anaerobic phase, the supply of sulphide ions to the free surface will be transport limited by diffusion through the highly compacted bentonite. Therefore, no HS. will enter the crack and cracking by either of these mechanisms during the long term anaerobic phase is not feasible. Cracking via the film-induced cleavage mechanism requires a surface film of specific properties, most often associated with a nano porous structure. Slow rates of dissolution characteristic of processes in the repository will tend to coarsen any nano porous layer. Under some circumstances, a cuprous oxide film could support film-induced cleavage, but there is no evidence that this mechanism would operate in the presence of sulphide during the long-term anaerobic period because copper sulphide

Stress corrosion cracking of copper canisters

International Nuclear Information System (INIS)

King, Fraser; Newman, Roger

2010-12-01

A critical review is presented of the possibility of stress corrosion cracking (SCC) of copper canisters in a deep geological repository in the Fennoscandian Shield. Each of the four main mechanisms proposed for the SCC of pure copper are reviewed and the required conditions for cracking compared with the expected environmental and mechanical loading conditions within the repository. Other possible mechanisms are also considered, as are recent studies specifically directed towards the SCC of copper canisters. The aim of the review is to determine if and when during the evolution of the repository environment copper canisters might be susceptible to SCC. Mechanisms that require a degree of oxidation or dissolution are only possible whilst oxidant is present in the repository and then only if other environmental and mechanical loading conditions are satisfied. These constraints are found to limit the period during which the canisters could be susceptible to cracking via film rupture (slip dissolution) or tarnish rupture mechanisms to the first few years after deposition of the canisters, at which time there will be insufficient SCC agent (ammonia, acetate, or nitrite) to support cracking. During the anaerobic phase, the supply of sulphide ions to the free surface will be transport limited by diffusion through the highly compacted bentonite. Therefore, no HS. will enter the crack and cracking by either of these mechanisms during the long term anaerobic phase is not feasible. Cracking via the film-induced cleavage mechanism requires a surface film of specific properties, most often associated with a nano porous structure. Slow rates of dissolution characteristic of processes in the repository will tend to coarsen any nano porous layer. Under some circumstances, a cuprous oxide film could support film-induced cleavage, but there is no evidence that this mechanism would operate in the presence of sulphide during the long-term anaerobic period because copper sulphide

Enhanced electrochemical oxidation of methanol on copper electrodes modified by electrocorrosion and electrodeposition

Energy Technology Data Exchange (ETDEWEB)

Carugno, Sofía [INQUIMAE – DQIAQF, Facultad de Ciencias, Exactas y Naturales, Universidad de Buenos Aires, Consejo Nacional de Investigaciones Científicas y Técnicas, 1428 Buenos Aires (Argentina); Chassaing, Elisabeth [IRDEP (UMR7174), EDF R and D, 6 Quai Watier, 78401 Chatou (France); Rosso, Michel [LPMC (UMR7643), CNRS, Ecole Polytechnique, F91128 Palaiseau Cedex (France); González, Graciela A., E-mail: graciela@qi.fcen.uba.ar [INQUIMAE – DQIAQF, Facultad de Ciencias, Exactas y Naturales, Universidad de Buenos Aires, Consejo Nacional de Investigaciones Científicas y Técnicas, 1428 Buenos Aires (Argentina)

2014-02-14

In this paper, we report a study of electrocatalytic oxidation of methanol on copper electrodes subjected to different surface treatments, either electrocorrosion or electrodeposition in the absence of strong hydrogen co-deposition. The surface morphology of treated electrodes was examined by Field Emission Scanning Electron Microscopy (FE-SEM). The effect of different treatment conditions and the methanol concentration dependence were evaluated by cyclic voltammetric technique. The results indicate that the oxidation of methanol can be enhanced by a suitable micro and nano structure generated by these treatments. This enhanced electrode activity is related to an increase of the effective surface area and/or to an increase of the surface concentration of electroactive molecules or intermediates. - Highlights: • We presented simple treatments to increase the response of copper electrodes. • Copper electrodes were modified by electrocorrosion and electrodeposition. • Scanning Electron Microscopy images reveal the effects of the different treatments. • The response is enhanced by an area increase and/or intermediates concentration. • For each treatment the concentration range of the diffusion control is analyzed.

Detachment of sprayed colloidal copper oxychloride-metalaxyl fungicides by a shallow water flow.

Science.gov (United States)

Pose-Juan, Eva; Paradelo-Pérez, Marcos; Rial-Otero, Raquel; Simal-Gándara, Jesus; López-Periago, José E

2009-06-01

Flow shear stress induced by rainfall promotes the loss of the pesticides sprayed on crops. Some of the factors influencing the losses of colloidal-size particulate fungicides are quantified by using a rotating shear system model. With this device it was possible to analyse the flow shear influencing washoff of a commercial fungicide formulation based on a copper oxychloride-metalaxyl mixture that was sprayed on a polypropylene surface. A factor plan with four variables, i.e. water speed and volume (both variables determining flow boundary stress in the shear device), formulation dosage and drying temperature, was set up to monitor colloid detachment. This experimental design, together with sorption experiments of metalaxyl on copper oxychloride, and the study of the dynamics of metalaxyl and copper oxychloride washoff, made it possible to prove that metalaxyl washoff from a polypropylene surface is controlled by transport in solution, whereas that of copper oxychloride occurs by particle detachment and transport of particles. Average losses for metalaxyl and copper oxychloride were, respectively, 29 and 50% of the quantity applied at the usual recommended dosage for crops. The key factors affecting losses were flow shear and the applied dosage. Empirical models using these factors provided good estimates of the percentage of fungicide loss. From the factor analysis, the main mechanism for metalaxyl loss induced by a shallow water flow is solubilisation, whereas copper loss is controlled by erosion of copper oxychloride particles.

REMOVAL OF COPPER ELECTROLYTE CONTAMINANTS BY ADSORPTION

Directory of Open Access Journals (Sweden)

B Gabai

1997-09-01

Full Text Available Abstract - Selective adsorbents have become frequently used in industrial processes. Recent studies have shown the possibility of using adsorption to separate copper refinery electrolyte contaminants, with better results than those obtained with conventional techniques. During copper electrorefinning, many impurities may be found as dissolved metals present in the anode slime which forms on the electrode surface, accumulated in the electrolyte or incorporated into the refined copper on the cathode by deposition. In this study, synthetic zeolites, chelating resins and activated carbons were tested as adsorbents to select the best adsorbent performance, as well as the best operating temperature for the process. The experimental method applied was the finite bath, which consists in bringing the adsorbent into contact with a finite volume of electrolyte while controlling the temperature. The concentration of metals in the liquid phase was continuously monitored by atomic absorption spectrophotometry (AAS

"Life-like" assessment of antimicrobial surfaces by a new touch transfer assay displays strong superiority of a copper alloy compared to silver containing surfaces.

Directory of Open Access Journals (Sweden)

Johannes Karl-Mark Knobloch

Full Text Available Transmission of bacteria from inanimate surfaces in healthcare associated environments is an important source of hospital acquired infections. A number of commercially available medical devices promise to fulfill antibacterial activity to reduce environmental contamination. In this study we developed a touch transfer assay modeling fingerprint transmission to investigate the antibacterial activity of surfaces, with confirmed antibacterial activity by a modified ISO 22196 (JIS Z 2801 assay to test such surfaces under more realistic conditions. Bacteria were taken up from a dry standardized primary contaminated surface (PCS with disinfected fingers or fingers covered with sterile and moistened cotton gloves. Subsequently, bacteria were transferred by pressing on secondary contaminated surfaces (SCS with or without potential antibacterial activity and the relative reduction rate was determined after 24 h. A stable transmission rate between PCS and SCS was observed using moistened sterile gloves. A copper containing alloy displayed at least a tenfold reduction of the bacterial load consistently reaching less than 2.5 cfu/cm2. In contrast, no significant reduction of bacterial contamination by silver containing surfaces and matured pure silver was observed in the touch transfer assay. With the touch transfer assay we successfully established a new reproducible method modeling cross contamination. Using the new method we were able to demonstrate that several surfaces with confirmed antimicrobial activity in a modified ISO 22196 (JIS Z 2801 assay lacked effectiveness under defined ambient conditions. This data indicate that liquid based assays like the ISO 22196 should be critically reviewed before claiming antibacterial activity for surfaces in the setting of contamination of dry surfaces by contact to the human skin. We suggest the newly developed touch transfer assay as a new additional tool for the assessment of potential antimicrobial surfaces

Controllable synthesis and characterization of novel copper-carbon core-shell structured nanoparticles

International Nuclear Information System (INIS)

Zhai, Jing; Tao, Xia; Pu, Yuan; Zeng, Xiao-Fei; Chen, Jian-Feng

2011-01-01

Highlights: → We reported a facile, green and cheap hydrothermal method to obtain novel copper-carbon core-shell nanoparticles. → The as-formed particles with controllable size and morphology are antioxidant. → The particles with organic-group-loaded surfaces and protective shells are expected to be applied in fields of medicine, electronics, sensors and lubricant. -- Abstract: A facile hydrothermal method was developed for preparing copper-carbon core-shell structured particles through a reaction at 160 o C in which glucose, copper sulfate pentahydrate and cetyltrimethylammonium bromide were used as starting materials. The original copper-carbon core-shell structured particles obtained were sized of 100-250 nm. The thickness of carbonaceous shells was controlled ranging from 25 to 100 nm by adjusting the hydrothermal duration time and the concentrations of glucose in the process. Products were characterized with transmission electron microscopy, X-ray diffraction, energy dispersive spectroscopy, Fourier transform infrared spectroscopy. Since no toxic materials were involved in the preparation, particles with stable carbonaceous framework and reactive surface also showed promising applications in medicine, electronics, sensors, lubricant, etc.

Controllable synthesis and characterization of novel copper-carbon core-shell structured nanoparticles

Energy Technology Data Exchange (ETDEWEB)

Zhai, Jing [Sin-China Nano Technology Center, Key Lab for Nanomaterials, Ministry of Education, Beijing University of Chemical Technology, Beijing 100029 (China); Research Center of the Ministry of Education for High Gravity Engineering and Technology, Beijing University of Chemical Technology, No. 15 Beisanhuan Dong Lu, Beijing 100029 (China); Tao, Xia; Pu, Yuan; Zeng, Xiao-Fei [Sin-China Nano Technology Center, Key Lab for Nanomaterials, Ministry of Education, Beijing University of Chemical Technology, Beijing 100029 (China); Chen, Jian-Feng, E-mail: chenjf@mail.buct.edu.cn [Research Center of the Ministry of Education for High Gravity Engineering and Technology, Beijing University of Chemical Technology, No. 15 Beisanhuan Dong Lu, Beijing 100029 (China)

2011-06-15

Highlights: {yields} We reported a facile, green and cheap hydrothermal method to obtain novel copper-carbon core-shell nanoparticles. {yields} The as-formed particles with controllable size and morphology are antioxidant. {yields} The particles with organic-group-loaded surfaces and protective shells are expected to be applied in fields of medicine, electronics, sensors and lubricant. -- Abstract: A facile hydrothermal method was developed for preparing copper-carbon core-shell structured particles through a reaction at 160 {sup o}C in which glucose, copper sulfate pentahydrate and cetyltrimethylammonium bromide were used as starting materials. The original copper-carbon core-shell structured particles obtained were sized of 100-250 nm. The thickness of carbonaceous shells was controlled ranging from 25 to 100 nm by adjusting the hydrothermal duration time and the concentrations of glucose in the process. Products were characterized with transmission electron microscopy, X-ray diffraction, energy dispersive spectroscopy, Fourier transform infrared spectroscopy. Since no toxic materials were involved in the preparation, particles with stable carbonaceous framework and reactive surface also showed promising applications in medicine, electronics, sensors, lubricant, etc.

Copper corrosion in pure oxygen-free water

International Nuclear Information System (INIS)

Moeller, K.

1995-12-01

The study was initiated following reports on corrosion of Copper in water in absence of Oxygen. Quartz glass tubes containing pure water and Copper plates were sealed in two different ways, using Palladium or Platinum foils, respectively. Tests were also performed with Copper wires. The insulated systems contained Oxygen initially. The Oxygen was dissolved in the water, and in the air column between the water surface and the Palladium/Platinum foils. The tubes were kept in a hot cabinet at 50 C for a total of two years. The exposed plates were analyzed in different ways, e g using reflectance FTIR. The amounts of oxide formed were also weighed. The following conclusions could be drawn: No difference in color was observed for the Pd and Pt seals except in one case for the Copper wire, where only a slight difference was noticed. No significant difference in oxidation between the plates with Pd or Pt seals in quartz glass tubes. No oxide growth was observed during the last year. The corrosion rate at 50 C is below 2.3 micrograms Copper/cm 2 /year. A certain imbalance was noted between the amounts of oxides formed, and expected amount estimated from the original amount of oxygen in the system. A significant amount of water has 'disappeared' from the tubes. 17 refs, 10 figs, 3 tabs

Improving Beneficiation of Copper and Iron from Copper Slag by Modifying the Molten Copper Slag

Directory of Open Access Journals (Sweden)

Zhengqi Guo

2016-04-01

Full Text Available In the paper, a new technology was developed to improve the beneficiation of copper and iron components from copper slag, by modifying the molten slag to promote the mineralization of valuable minerals and to induce the growth of mineral grains. Various parameters, including binary basicity, dosage of compound additive, modification temperature, cooling rate and the end point temperature of slow cooling were investigated. Meanwhile, optical microscope, scanning electron microscope and energy dispersive spectrometer (SEM-EDS was employed to determine the mineralogy of the modified and unmodified slag, as well as to reveal the mechanisms of enhancing beneficiation. The results show that under the proper conditions, the copper grade of rougher copper concentrate was increased from 6.43% to 11.04%, iron recovery of magnetic separation was increased significantly from 32.40% to 63.26%, and other evaluation indexes were changed slightly, in comparison with unmodified copper slag. Moreover, matte and magnetite grains in the modified slag aggregated together and grew obviously to the mean size of over 50 μm, resulting in an improvement of beneficiation of copper and iron.

Adsorption of copper to different biogenic oyster shell structures

Energy Technology Data Exchange (ETDEWEB)

Wu, Qiong; Chen, Jie [College of Materials Science and Engineering, Fuzhou University, New Campus, Minhou, Fujian Province 350108 (China); Clark, Malcolm [Marine Ecology Research Centre, School of Environment, Science and Engineering, Southern Cross University, P.O. Box 157, Lismore, NSW 2480 (Australia); Yu, Yan, E-mail: yuyan_1972@126.com [College of Materials Science and Engineering, Fuzhou University, New Campus, Minhou, Fujian Province 350108 (China)

2014-08-30

Graphical abstract: - Highlights: • Adsorption of copper to waste oyster shell occurs rapidly at pH 5.5. • Copper adsorbs to the different structures of oyster shell at different rates. • The prismatic layer dominates copper sorption rather than the nacreous layer. • SEM analysis shows a porous open network structure to the prismatic layer. • Surface ζ-potentials establish electrostatic attraction to drive copper sorption. - Abstract: The removal of copper from solution by oyster shell powder was investigated for potential wastewater treatment uses. In particular, adsorption behavior differences between the prismatic (PP) and nacreous (NP) shell layers, and how this affects copper removal, were investigated. Experimental results indicated that copper adsorption was highly pH-dependent with optimal copper removal at pH 5.5, where the powdered whole raw shell (RP) removed up to 99.9% of the copper within 24 h at a 10 mg/L initial copper concentration. Langmuir and Freundlich models were used to analyze the isotherm PP, NP and RP data. These results showed a strong homogeneous Langmuir model for low initial copper concentrations (5–30 mg/L) to both RP and PP layer, while strong agreement with a heterogeneous Freundlich model for high initial copper concentrations (30–200 mg/L); nevertheless, a homogeneous Langmuir model provided the best fit for the more dense NP layer across the initial concentration range (5–200 mg/L). The distribution coefficient (K{sub d}) value of PP layer for each initial concentration investigated was substantially higher than the NP layer and it was also found that the PP layer dominated the adsorption process with an adsorption capacity of 8.9 mg/g, while the adsorption capacity of the NP layer was 2.6 mg/g. These differences are believed to be because of the more porous structure of the PP layer, which was confirmed by scanning electron microscopy, infrared spectroscopy, energy-dispersive X-ray spectroscopy, and

Adsorption of copper to different biogenic oyster shell structures

International Nuclear Information System (INIS)

Wu, Qiong; Chen, Jie; Clark, Malcolm; Yu, Yan

2014-01-01

Graphical abstract: - Highlights: • Adsorption of copper to waste oyster shell occurs rapidly at pH 5.5. • Copper adsorbs to the different structures of oyster shell at different rates. • The prismatic layer dominates copper sorption rather than the nacreous layer. • SEM analysis shows a porous open network structure to the prismatic layer. • Surface ζ-potentials establish electrostatic attraction to drive copper sorption. - Abstract: The removal of copper from solution by oyster shell powder was investigated for potential wastewater treatment uses. In particular, adsorption behavior differences between the prismatic (PP) and nacreous (NP) shell layers, and how this affects copper removal, were investigated. Experimental results indicated that copper adsorption was highly pH-dependent with optimal copper removal at pH 5.5, where the powdered whole raw shell (RP) removed up to 99.9% of the copper within 24 h at a 10 mg/L initial copper concentration. Langmuir and Freundlich models were used to analyze the isotherm PP, NP and RP data. These results showed a strong homogeneous Langmuir model for low initial copper concentrations (5–30 mg/L) to both RP and PP layer, while strong agreement with a heterogeneous Freundlich model for high initial copper concentrations (30–200 mg/L); nevertheless, a homogeneous Langmuir model provided the best fit for the more dense NP layer across the initial concentration range (5–200 mg/L). The distribution coefficient (K d ) value of PP layer for each initial concentration investigated was substantially higher than the NP layer and it was also found that the PP layer dominated the adsorption process with an adsorption capacity of 8.9 mg/g, while the adsorption capacity of the NP layer was 2.6 mg/g. These differences are believed to be because of the more porous structure of the PP layer, which was confirmed by scanning electron microscopy, infrared spectroscopy, energy-dispersive X-ray spectroscopy, and

Morphology of micro- and nanoparticles emitted by copper plants in Western Poland

International Nuclear Information System (INIS)

Konarski, P.; Cwil, M.; Iwanejko, I.; Mierzejewska, A.; Diduszko, R.

2004-01-01

Aerosol particles were collected in the vicinity of copper plants in Western Poland and analysed by mass spectrometry methods like secondary ion mass spectrometry (SIMS), spark source mass spectrometry (SSMS) and X-ray diffraction to characterise the possible dangers for the environment and health. The motivation of the work was to approach the toxicological mechanisms that are triggered when aerosol nanoparticles enter the human body. Different analytical techniques were used in order to compare bulk and surface properties of particles. The particle collection was performed with nine-stage cascade impactor with rotating plates and also with micro-fibre quartz filter collector. SSMS bulk analysis of copper plant emitted particles shows the presence of over 30 elements, the concentration in wt.% of Cu, Pb, Zn and Cl is 30, 5, 2 and 1, respectively. XRD analysis of these particles shows crystalline phases of quartz and probable phases containing copper CuS 2 , lead Pb 2 SiO 4 , PbO - massicot, Pb 5 [OH][PO 4 ] 3 , Pb 3 SiO 5 , iron and calcium Ca[Mg 0.67 Fe 0.33 ][CO 3 ] - dolomite, ferroan, Ca[FeMg][CO 3 ] 2 - ankerite, Ca[MgFe]Si 2 O 6 - augite. Surface sensitive SIMS depth profile analysis revealed the core-shell structure of copper plant emitted particles. The obtained structure of these particles shows that surfaces of the particles are enriched in elements like chlorine, fluorine, lead and chromium with respect to the core concentrations of these elements. The cores are composed mainly of copper, oxygen and carbon containing compounds. Lead concentration is nearly two times greater at the surface layers of particles than in the cores. SIMS analysis of urban aerosol particles collected in Legnica shows compositional dependence with size. Surface shell layer concentration of lead is three times greater for coarse 6-15 μm particles than for tiny 300 nm-1 μm particles. Such non-uniform particle morphology may enhance the toxic properties of particles suspended in

21 CFR 73.1125 - Potassium sodium copper chloropyhllin (chlorophyllin-copper complex).

Science.gov (United States)

2010-04-01

... 21 Food and Drugs 1 2010-04-01 2010-04-01 false Potassium sodium copper chloropyhllin (chlorophyllin-copper complex). 73.1125 Section 73.1125 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT....1125 Potassium sodium copper chloropyhllin (chlorophyllin-copper complex). (a) Identity. (1) The color...

21 CFR 73.2125 - Potassium sodium copper chlorophyllin (chlorophyllin-copper complex).

Science.gov (United States)

2010-04-01

... 21 Food and Drugs 1 2010-04-01 2010-04-01 false Potassium sodium copper chlorophyllin (chlorophyllin-copper complex). 73.2125 Section 73.2125 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT... § 73.2125 Potassium sodium copper chlorophyllin (chlorophyllin-copper complex). (a) Identity and...

Corrosion behavior of copper-base materials in a gamma-irradiated environment

International Nuclear Information System (INIS)

Yunker, W.H.

1990-09-01

Specimens of three copper-base materials were corrosion tested with gamma radiation exposure dose rates in the range of 1.9 x 10 3 R/h to 4.9 x 10 5 R/h. Materials used were pure copper, 7% aluminum bronze and 30% copper-nickel. Exposures were performed in moist air at 95 degree C and 150 degree C and liquid Well J-13 water at 95 degree C, for periods of up to 16 months. Specimens were monitored for uniform weight loss, stress-induced corrosion and crevice corrosion. Specimen surfaces were examined visually at 10X magnification as well as by Auger Electron Spectroscopy, x-ray diffraction and metallography. Corrosion was not severe in any of the cases. In general, the pure copper was corroded most uniformly while the copper-nickel was the least reproducibly corroded. 11 refs, 40 figs., 15 tabs

SERS and in situ SERS spectroscopy of riboflavin adsorbed on silver, gold and copper substrates. Elucidation of variability of surface orientation based on both experimental and theoretical approach

Science.gov (United States)

Dendisová-Vyškovská, Marcela; Kokaislová, Alžběta; Ončák, Milan; Matějka, Pavel

2013-04-01

Surface-enhanced Raman scattering and in situ surface-enhanced Raman scattering spectra have been collected to study influences of (i) used metal and (ii) applied electrode potential on orientation of adsorbed riboflavin molecules. Special in situ SERS spectroelectrochemical cell was used to obtain in situ SERS spectra of riboflavin adsorbed on silver, gold and copper nanostructured surfaces. Varying electrode potential was applied in discrete steps forming a cycle from positive values to negative and backward. Observed spectral features in in situ SERS spectra, measured at alternate potentials, have been changing very significantly and the spectra have been compared with SERS spectra of riboflavin measured ex situ. Raman spectra of single riboflavin molecule in the vicinity to metal (Ag, Au and Cu) clusters have been calculated for different mutual positions. The results demonstrate significant changes of bands intensities which can be correlated with experimental spectra measured at different potentials. Thus, the orientation of riboflavin molecules adsorbed on metal surfaces can be elucidated. It is influenced definitely by the value of applied potential. Furthermore, the riboflavin adsorption orientation on the surface depends on the used metal. Adsorption geometries on the copper substrates are more diverse in comparison with the orientations on silver and gold substrates.

Galvanic corrosion of copper-cast iron couples

International Nuclear Information System (INIS)

Smart, N.R.; Rance, A.P.; Fennell, P.A.H.

2005-01-01

To ensure the safe encapsulation of spent nuclear fuel rods for geological disposal, SKB are considering using the Copper-Cast Iron Canister, which consists of an outer copper canister and an inner cast iron container. The canister will be placed into boreholes in the bedrock of a geologic repository and surrounded by bentonite clay. In the unlikely event of the outer copper canister being breached, water would enter the annulus between the inner and outer canister and at points of contact between the two metals there would be the possibility of galvanic interactions. Although this subject has been considered previously from both a theoretical standpoint and by experimental investigations there was a need for further experimental studies in support of information provided by SKB to the Swedish regulators (SKI). In the work reported here copper-cast iron galvanic couples were set up in a number of different environments representing possible conditions in the SKB repository. The tests investigated two artificial porewaters at 30 deg C and 50 deg C, under aerated and deaerated conditions. Tests were also carried out in a 30 wt% bentonite slurry made up in artificial groundwater. The potential of the couples and the currents passing between the coupled electrodes were monitored for several months. The effect of growing an oxide film on the surface of the cast iron prior to coupling it with copper was investigated. In addition, some crevice specimens based on the multi-crevice assembly (MCA) design were used to simulate the situation where the copper canister will be in direct contact with the cast iron inner vessel. The electrochemical results are presented graphically in the form of electrode potentials and galvanic corrosion currents as a function of time. The galvanic currents in aerated conditions were much higher than in deaerated conditions. For example, at 30 deg C, galvanic corrosion rates as low as 0.02 μm/year for iron were observed after deaeration, but

Nutrition and psychological well-being among long-term care residents with dementia.

Science.gov (United States)

Muurinen, S; Savikko, N; Soini, H; Suominen, M; Pitkälä, K

2015-02-01

To examine the relationship between nutritional status of service housing and nursing home residents with dementia and their psychological well-being (PWB), and the associations of nutritional care and PWB. This cross-sectional nutrition study was carried out in 2011. The study included all older long-term care residents (N=4966) living in nursing homes and service housing units (N=61) in Helsinki. The response rate of was 72%. Of the respondents, only persons who had a diagnosis of dementia were included in this analysis (N=2379). The Mini Nutritional Assessment (MNA) tool and a structured questionnaire were used in assessing the residents. Six dimensions of PWB were included in the questionnaire. Information was also retrieved from medical records. Of residents 9% were well-nourished and 28% malnourished according to the MNA. PWB was good in 50% (score ≥ 0.80) and poor in 10% (score snacks were associated with poor PWB. Mild cognitive impairment was more often associated with poor PWB, whereas moderate or severe impairment was more often associated with good PWB. Nutritional status and nutritional care of residents with dementia were significantly associated with their psychological well-being. The residents suffering from malnutrition had the poorest psychological well-being.

SITE-94. CAMEO: A model of mass-transport limited general corrosion of copper canisters

International Nuclear Information System (INIS)

Worgan, K.J.; Apted, M.J.

1996-12-01

This report describes the technical basis for the CAMEO code, which models the general, uniform corrosion of a copper canister either by transport of corrodants to the canister, or by transport of corrosion products away from the canister. According to the current Swedish concept for final disposal of spent nuclear fuels, extremely long containment times are achieved by thick (60-100 mm) copper canisters. Each canister is surrounded by a compacted bentonite buffer, located in a saturated, crystalline rock at a depth of around 500 m below ground level. Three diffusive transport-limited cases are identified for general, uniform corrosion of copper: General corrosion rate-limited by diffusive mass-transport of sulphide to the canister surface under reducing conditions; General corrosion rate-limited by diffusive mass-transport of oxygen to the canister surface under mildly oxidizing conditions; General corrosion rate-limited by diffusive mass-transport of copper chloride away from the canister surface under highly oxidizing conditions. The CAMEO code includes general corrosion models for each of the above three processes. CAMEO is based on the well-tested CALIBRE code previously developed as a finite-difference, mass-transfer analysis code for the SKI to evaluate long-term radionuclide release and transport in the near-field. A series of scoping calculations for the general, uniform corrosion of a reference copper canister are presented

Effect of sulfide on the corrosion behavior of pure copper under anaerobic condition and possibility of super long lifetime for copper overpacks

International Nuclear Information System (INIS)

Taniguchi, Naoki; Naitou, Morimasa; Kawasaki, Manabu

2007-03-01

In general, copper is thermodynamically stable under anaerobic condition, so that corrosion due to water reduction can not be occurred on copper. In the presence of sulfide, however, this property of immunity to corrosion is lost and corrosion as copper sulfide is occurred. Therefore, it is necessary to understand the effect of sulfide on the corrosion behavior of copper for using the copper as a material for overpacks. In this study, immersion tests and stress corrosion cracking tests were carried out using synthetic seawater containing sodium sulfide. Based on the experimental results, the possibility of super long lifetime for copper overpacks was discussed. The results were summarized as follows; 1) As the results of the immersion tests of copper in buffer material for 2 years, the corrosion rates became large with increase in the concentration of sodium sulfide. The corrosion rates of copper in sodium sulfide of 0.001M, 0.005M and 0.1M were estimated to be 0.55μm/y, 2.2μm/y, 15μm/y respectively. 2) Corrosion product film with black or dark-gray was formed on the surface of copper specimens, and it was identified as Cu 2 S(Chalcocite) by the X-ray diffraction. 3) As the results of stress corrosion cracking experiments by means of slow strain rate technique, copper has little susceptibility to crack initiation for the specimen of the experiment under 0.001M-Na 2 S condition. Obvious cracks were observed for the specimens of the experiment over 0.005M Na 2 S condition. 4) According to the results of immersion tests and stress corrosion cracking tests, copper overpacks have a potential to accomplish super long lifetime far over 1000 years owing to very low corrosion rate and no stress corrosion cracking if the sulfide concentration in repository environment is promised to be less than 0.001M. (author)

Low cost chemical oxygen demand sensor based on electrodeposited nano-copper film

Directory of Open Access Journals (Sweden)

Hamdy H. Hassan

2018-02-01

Full Text Available A commercially available copper electrical cable and pure Cu disk were used as substrates for the electrodeposition of copper nanoparticles (nano-Cu. The surface morphology of the prepared nano-Cu/Cu electrodes was investigated by scanning electron microscope (SEM and energy dispersive X-ray spectrometer (EDX. The bare copper substrates and the nano-copper modified electrodes were utilized and optimized for electrochemical assay of chemical oxygen demand (COD using glycine as a standard. A comparison was made among the four electrodes (i.e., bare and nano-Cu coated copper cable and pure copper disk as potential COD sensors. The oxidation behavior of glycine was investigated on the surface of the prepared sensors using linear sweep voltammetry (LSV. The results indicate significant enhancement of the electrochemical oxidation of glycine by the deposited nano-Cu. The effects of different deposition parameters, such as Cu2+ concentration, deposition potential, deposition time, pH, and scan rate on the response of the prepared sensors were investigated. Under optimized conditions, the optimal nano-Cu based COD sensor exhibited a linear range of 2–595 mg/L, lower limit of detection (LOD as low as 1.07 mg/L (S/N = 3. The developed method exhibited high tolerance level to Cl− ion where 1.0 M Cl− exhibited minimal influence. The sensor was utilized for the detection of COD in different real water samples. The results obtained were validated using the standard dichromate method.

Facial Skin Lifting and Brightening Following Sleep on Copper Oxide Containing Pillowcases

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Gadi Borkow

2016-07-01

Full Text Available Copper plays a key role in many of the physiological processes that occur in the skin. Previously it was found that sleeping on pillowcases impregnated with microscopic copper oxide particles results in reduction of wrinkles and fine lines. In the current study, it was examined if sleeping on copper oxide impregnated pillowcases results also in skin lifting and skin brightness. A four week, double blind, randomized study was performed, during which 45 women, aged 37–54, slept on copper oxide containing pillowcases (test group, n = 23 or on control pillowcases without copper oxide (control group, n = 22. Facial and eye skin surface was measured using an F-ray 3D measurement system and surface analysis was conducted using Image-pro® plus. Skin brightness was measured using a tristimulus colorimeter. Sleeping on the test pillowcases resulted in statistically significant skin lifting on the cheek area (p = 0.039 and eye area (p = 0.001 after four weeks of use as compared to baseline. The mean skin brightness in those sleeping on the test pillowcases increased after two (p = 0.024 and four weeks (p = 0.008. No statistically significant changes occurred during the study in the study participants using the control pillowcases. Statistically significant differences between both groups were recorded at two and four weeks for skin brightness and skin lifting, respectively. In conclusion, sleeping on copper oxide containing pillowcases results in facial skin lifting and brightness of the skin.

Lewis basicity, adhesion thermodynamic work and coordinating ability on aminated silicon surfaces

International Nuclear Information System (INIS)

Sánchez, M. Alejandra; Paniagua, Sergio A.; Borge, Ignacio; Viales, Christian; Montero, Mavis L.

2014-01-01

Highlights: • Silicon(1 0 0) surfaces with diamines followed by anchoring of copper complexes over the diamine layer, an approach that could be used for advanced functionalization of semiconducting surfaces. • Lewis basicity (using Fowkes–van Oss–Chaudhury–Good surface tension model) and adhesion thermodynamic work (using chemical force microscopy) were determined. • Higher basicity and thermodynamic work correlate with selective copper acetate monolayer grow. The cyclic voltammetry studies confirm the confined copper redox activity. - Abstract: Silicon(1 0 0) surfaces have been modified with three different amines (aniline, benzylamine and dodecylamine) and diamines (4-aminopyridine, 4-aminomethylpyridine, 1,12-dodecyldiamine). The surface energy was measured by contact angle technique. For Si-diamine surfaces, Lewis basicity (using Fowkes–van Oss–Chaudhury–Good surface tension model) and adhesion thermodynamic work (using chemical force microscopy) were determined. We related these data, the amine/diamine nature and their geometry on the surface (via DFT calculations) with the consequent ability to coordinate copper(II) acetate. Finally, copper(II) acetate monolayers behavior was studied by cyclic voltammetry

Copper Tube Pitting in Santa Fe Municipal Water Caused by Microbial Induced Corrosion.

Science.gov (United States)

Burleigh, Thomas D; Gierke, Casey G; Fredj, Narjes; Boston, Penelope J

2014-06-05

Many copper water lines for municipal drinking water in Santa Fe, New Mexico USA, have developed pinhole leaks. The pitting matches the description of Type I pitting of copper, which has historically been attributed to water chemistry and to contaminants on the copper tubing surface. However, more recent studies attribute copper pitting to microbial induced corrosion (MIC). In order to test for microbes, the copper tubing was fixed in hexamethyldisilazane (HMDS), then the tops of the corrosion mounds were broken open, and the interior of the corrosion pits were examined with scanning electron microscopy (SEM). The analysis found that microbes resembling actinobacteria were deep inside the pits and wedged between the crystallographic planes of the corroded copper grains. The presence of actinobacteria confirms the possibility that the cause of this pitting corrosion was MIC. This observation provides better understanding and new methods for preventing the pitting of copper tubing in municipal water.

Copper Tube Pitting in Santa Fe Municipal Water Caused by Microbial Induced Corrosion

Directory of Open Access Journals (Sweden)

Thomas D. Burleigh

2014-06-01

Full Text Available Many copper water lines for municipal drinking water in Santa Fe, New Mexico USA, have developed pinhole leaks. The pitting matches the description of Type I pitting of copper, which has historically been attributed to water chemistry and to contaminants on the copper tubing surface. However, more recent studies attribute copper pitting to microbial induced corrosion (MIC. In order to test for microbes, the copper tubing was fixed in hexamethyldisilazane (HMDS, then the tops of the corrosion mounds were broken open, and the interior of the corrosion pits were examined with scanning electron microscopy (SEM. The analysis found that microbes resembling actinobacteria were deep inside the pits and wedged between the crystallographic planes of the corroded copper grains. The presence of actinobacteria confirms the possibility that the cause of this pitting corrosion was MIC. This observation provides better understanding and new methods for preventing the pitting of copper tubing in municipal water.

Composition of Whiskers Grown on Copper in Repository Environment

International Nuclear Information System (INIS)

Hermansson, Hans-Peter; Tarkpea, Peeter; Holgersson, Stellan

2001-11-01

There is a hypothesis that a special family of local attack on copper based on growth of whiskers of sulfide, oxide/hydroxide and also carbonate/malachite could appear in the repository environment. It was earlier demonstrated that such whiskers could grow in a laboratory simulated repository environment, containing sulfide. A suggested composition of whiskers has earlier been forwarded but was not demonstrated. In the present work whiskers and their substrates were grown and characterized by investigations with a combination of SEM-EDS, XRD and LRS (Laser Raman Spectroscopy) techniques. SEM-EDS was used to determine the morphology and an elemental composition and distribution of whiskers and their substrate. A special effort was made to find out if the whisker growth is of a local or global character. The phase status could be determined locally and globally by combining XRD and LRS techniques on whiskers and substrates. Ideally, LRS gives a phase resolution down to a radius of 1 μm on the sample surface. This is of great value as it is of interest to study if there are phase differences in different parts of a whisker. Such information is important to understand the whisker growth mechanism. Cylindrical samples of pure copper were prepared and exposed to the selected de-aerated model groundwater containing, among other ions, chloride and sulfide. Exposure was performed in sealed glass flasks under de-aerated conditions. After exposure the copper sample was investigated on the surface, in cross section and on whiskers using the mentioned techniques. The results show that a black, easily detached layer of corrosion products is formed on the sample surface. The corrosion layer was subdivided into at least five parallel strata (probably more) of different composition. Numerous small pits and shallow pitting attacks with a larger radius were observed in the copper metal and the metal surface was in general very rough. A multitude of very easily detached whiskers or

A New Type of Inscribed Copper Plate from Indus Valley (Harappan Civilisation

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Vasant Shinde

2014-10-01

Full Text Available A group of nine Indus Valley copper plates (c. 2600–2000 BC, discovered from private collections in Pakistan, appear to be of an important type not previously described. The plates are significantly larger and more robust than those comprising the corpus of known copper plates or tablets, and most significantly differ in being inscribed with mirrored characters. One of the plates bears 34 characters, which is the longest known single Indus script inscription. Examination of the plates with x-ray fluorescence (XRF spectrophotometry indicates metal compositions, including arsenical copper, consistent with Indus Valley technology. Microscopy of the metal surface and internal structure reveals detail such as pitting, microcrystalline structure, and corrosion, consistent with ancient cast copper artifacts. Given the relative fineness of the engraving, it is hypothesised that the copper plates were not used as seals, but have characteristics consistent with use in copper plate printing. As such, it is possible that these copper plates are by far the earliest known printing devices, being at least 4000 years old.