Influence of Parameters of a Printing Plate on Photoluminescence of Nanophotonic Printed Elements of Novel Packaging

Directory of Open Access Journals (Sweden)

Olha Sarapulova

2015-01-01

Full Text Available In order to produce nanophotonic elements for smart packaging, we investigated the influence of the parameters of screen and offset gravure printing plates on features of printed application of coatings with nanophotonic components and on parameters of their photoluminescence. To determine the dependence of luminescence intensity on the thickness of solid coating, we carried out the formation of nanophotonic solid surfaces by means of screen printing with different layer thickness on polypropylene film. The obtained analytical dependencies were used to confirm the explanation of the processes that occur during the fabrication of nanophotonic coverings with offset gravure printing plates. As a result of experimental studies, it was determined that the different character of the dependency of total luminescence intensity of nanophotonic elements from the percentage of a pad is explained by the use of different types of offset gravure printing plates, where the size of raster points remains constant in one case and changes in the other case, while the depth of the printing elements accordingly changes or remains constant. To obtain nanophotonic areas with predetermined photoluminescent properties, the influence of investigated factors on changes of photoluminescent properties of nanophotonic printed surfaces should be taken into consideration.

Biocompatibility of Bespoke 3D-Printed Titanium Alloy Plates for Treating Acetabular Fractures

Directory of Open Access Journals (Sweden)

Xuezhi Lin

2018-01-01

Full Text Available Treatment of acetabular fractures is challenging, not only because of its complicated anatomy but also because of the lack of fitting plates. Personalized titanium alloy plates can be fabricated by selective laser melting (SLM but the biocompatibility of these three-dimensional printing (3D-printed plates remains unknown. Plates were manufactured by SLM and their cytocompatibility was assessed by observing the metabolism of L929 fibroblasts incubated with culture medium extracts using a CCK-8 assay and their morphology by light microscopy. Allergenicity was tested using a guinea pig maximization test. In addition, acute systemic toxicity of the 3D-printed plates was determined by injecting extracts from the implants into the tail veins of mice. Finally, the histocompatibility of the plates was investigated by implanting them into the dorsal muscles of rabbits. The in vitro results suggested that cytocompatibility of the 3D-printed plates was similar to that of conventional plates. The in vivo data also demonstrated histocompatibility that was comparable between the two manufacturing techniques. In conclusion, both in vivo and in vitro experiments suggested favorable biocompatibility of 3D-printed titanium alloy plates, indicating that it is a promising option for treatment of acetabular fractures.

Printing low-melting-point alloy ink to directly make a solidified circuit or functional device with a heating pen.

Science.gov (United States)

Wang, Lei; Liu, Jing

2014-12-08

A new method to directly print out a solidified electronic circuit through low-melting-point metal ink is proposed. A functional pen with heating capability was fabricated. Several typical thermal properties of the alloy ink Bi 35 In 48.6 Sn 16 Zn 0.4 were measured and evaluated. Owing to the specifically selected melting point of the ink, which is slightly higher than room temperature, various electronic devices, graphics or circuits can be manufactured in a short period of time and then rapidly solidified by cooling in the surrounding air. The liquid-solid phase change mechanism of the written lines was experimentally characterized using a scanning electron microscope. In order to determine the matching substrate, wettability between the metal ink Bi 35 In 48.6 Sn 16 Zn 0.4 and several materials, including mica plate and silicone rubber, was investigated. The resistance-temperature curve of a printed resistor indicated its potential as a temperature control switch. Furthermore, the measured reflection coefficient of a printed double-diamond antenna accords well with the simulated result. With unique merits such as no pollution, no requirement for encapsulation and easy recycling, the present printing approach is an important supplement to current printed electronics and has enormous practical value in the future.

Fabrication of a capacitive relative humidity sensor using aluminum thin films deposited on etched printed circuit board

Directory of Open Access Journals (Sweden)

Lee Jacqueline Ann L.

2016-01-01

Full Text Available A capacitive humidity-sensing device was created by thermal evaporation of 99.999% aluminum. The substrate used for the coating was etched double-sided printed circuit board. The etched printed circuit board serves as the dielectric of the capacitor while the aluminum thin films deposited on either side serve as the plates of the capacitor. The capacitance was measured before and after exposure to humidity. The device was then calibrated by comparing the readings of capacitance with that of the relative humidity sensor of the Vernier LabQuest2. It was found that there is a linear relationship between the capacitance and relative humidity given by the equation C=1.418RH+29.139 where C is the capacitance and RH is the relative humidity. The surface of the aluminum films is porous and it is through these pores that water is adsorbed and capillary condensation occurs, thereby causing the capacitance to change upon exposure to humidity.

PUZZLE - A program for computer-aided design of printed circuit artwork

Science.gov (United States)

Harrell, D. A. W.; Zane, R.

1971-01-01

Program assists in solving spacing problems encountered in printed circuit /PC/ design. It is intended to have maximum use for two-sided PC boards carrying integrated circuits, and also aids design of discrete component circuits.

Organic printed photonics: From microring lasers to integrated circuits.

Science.gov (United States)

Zhang, Chuang; Zou, Chang-Ling; Zhao, Yan; Dong, Chun-Hua; Wei, Cong; Wang, Hanlin; Liu, Yunqi; Guo, Guang-Can; Yao, Jiannian; Zhao, Yong Sheng

2015-09-01

A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 10(5), which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices.

Influence of Parameters of a Printing Plate on Photoluminescence of Nano photonic Printed Elements of Novel Packaging

International Nuclear Information System (INIS)

Sarapulova, O.; Sherstiuk, V.

2015-01-01

In order to produce nano photonic elements for smart packaging, we investigated the influence of the parameters of screen and offset gravure printing plates on features of printed application of coatings with nano photonic components and on parameters of their photoluminescence. To determine the dependence of luminescence intensity on the thickness of solid coating, we carried out the formation of nano photonic solid surfaces by means of screen printing with different layer thickness on polypropylene film. The obtained analytical dependencies were used to confirm the explanation of the processes that occur during the fabrication of nano photonic coverings with offset gravure printing plates. As a result of experimental studies, it was determined that the different character of the dependency of total luminescence intensity of nano photonic elements from the percentage of a pad is explained by the use of different types of offset gravure printing plates, where the size of raster points remains constant in one case and changes in the other case, while the depth of the printing elements accordingly changes or remains constant. To obtain nano photonic areas with predetermined photo luminescent properties, the influence of investigated factors on changes of photo luminescent properties of nano photonic printed surfaces should be taken into consideration

Offset Printing Plate Quality Sensor on a Low-Cost Processor

Directory of Open Access Journals (Sweden)

Francisco Tirado

2013-10-01

Full Text Available The aim of this work is to develop a microprocessor-based sensor that measures the quality of the offset printing plate through the introduction of different image analysis applications. The main features of the presented system are the low cost, the low amount of power consumption, its modularity and easy integration with other industrial modules for printing plates, and its robustness against noise environments. For the sake of clarity, a viability analysis of previous software is presented through different strategies, based on dynamic histogram and Hough transform. This paper provides performance and scalability data compared with existing costly commercial devices. Furthermore, a general overview of quality control possibilities for printing plates is presented and could be useful to a system where such controls are regularly conducted.

Development and verification of printed circuit board toroidal transformer model

DEFF Research Database (Denmark)

Pejtersen, Jens; Mønster, Jakob Døllner; Knott, Arnold

2013-01-01

An analytical model of an air core printed circuit board embedded toroidal transformer configuration is presented. The transformer has been developed for galvanic isolation of very high frequency switch-mode dc-dc power converter applications. The theoretical model is developed and verified...... by comparing calculated parameters with 3D finite element simulations and experimental measurement results. The developed transformer model shows good agreement with the simulated and measured results. The model can be used to predict the parameters of printed circuit board toroidal transformer configurations...

Highly Conductive Nano-Silver Circuits by Inkjet Printing

Science.gov (United States)

Zhu, Dongbin; Wu, Minqiang

2018-06-01

Inkjet technology has become popular in the field of printed electronics due to its superior properties such as simple processes and printable complex patterns. Electrical conductivity of the circuits is one of the key factors in measuring the performance of printed electronics, which requires great material properties and a manufactured process. With excellent conductivity and ductility, silver is an ideal material as the wire connecting components. This review summarizes the progress of conductivity studies on inkjet printed nano-silver lines, including ink composition and nanoparticle morphology, deposition of nano-silver lines with uniform and high aspect ratios, sintering mechanisms and alternative methods of thermal sintering. Finally, the research direction on inkjet printed electronics is proposed.

Development of a miniaturized watch-type dosimeter using a silicon printed-circuit board

International Nuclear Information System (INIS)

Ishikura, Takeshi; Sakamaki, Tsuyoshi; Matsumoto, Iwao; Aoyama, Kei; Nakamura, Takashi

2008-01-01

The electrical personal dosimeter using a silicon semiconductor sensor has the advantage of real time response and alarm function, which can prevent unexpected over-exposure. We tried to develop a miniaturized watch-type dosimeter by incorporating the silicon semiconductor sensor on a silicon printed-circuit board. Thin film resistors, capacitors and wiring patterns are formed on a downsized printed-circuit board. Electronic parts including transistors are mounted by soldering on the silicon printed-circuit board. The dosimeter is further miniaturized by downsizing the amplifier circuit, the semiconductor radiation sensor, the power supply circuit, setting parts and alarm part. The performance of the developed dosimeter was evaluated with respect to the gamma-ray spectra, angular dependence and linearity to dose equivalent rate, and it was confirmed that this dosimeter has the performance equivalent to a commercially available electrical personal dosimeter. (author)

A study of liberation and separation process of metals from printed circuit boards (PCBs) scrap

International Nuclear Information System (INIS)

Noorliyana, H.A.; Zaheruddin, K.; Mohd Fazlul Bari; M. Sri Asliza; Nurhidayah, A.Z.; Kamarudin, H.

2009-01-01

Since the metallic elements are covered with or encapsulated by various plastic or ceramic materials on printed circuit boards, a mechanical pre-treatment process allowing their liberation and separation is first needed in order to facilitate their efficient extraction with hydrometallurgy route. Even though many studies have been performed on the mechanical pre-treatment processing for the liberation and separation of the metallic components of printed circuit boards scrap, further studies are required to pave the way for efficient recycling of waste printed circuit boards through a combination of mechanical pre-treatment and hydrometallurgical technology. In this work, a fundamental study has been carried out on the mechanical pre-treatment that is necessary to recover metallic concentrates from printed circuit boards scraps. The most important problem is to separate or release particles from the associated gangue minerals at the possible liberation particle size. The distribution of metallic elements has been also investigated in relation to the particle size of the milled printed circuit boards. The samples of printed circuit boards were separated into the magnetic and non-magnetic fractions by Rare-earth Roll Magnetic separator. Thereafter, the magnetic and non-magnetic fractions were separated to heavy fraction (metallic elements) and light fraction (plastic) by Mozley Laboratory Table Separator. The recovery ratios and the evaluation of the metallic concentrates recovered by each separation process were also investigated. This study is expected to provide useful data for the efficient mechanical separation of metallic components from printed circuit boards scraps. (author)

CAD-CAM printed circuit board design

Science.gov (United States)

Agy, W. E.

A step-by-step procedure for a printed circuit design achieved by CAD is presented. The operator at the interactive CRT station moves a stylus across a graphics tablet and intersperses commands which result in computer-generated pictorial forms on the screen that were drawn on the pad. Standard symbols are used for commands allowing, for instance, connections to be made of specific types in certain locations, which can be automatically edited from a materials list. An entire network of drawn lines can be referenced by a signal name for recall, and a finished circuit schematic can be checked for designs rules compliance, including fault reporting in terms of designator/pin number. A map may be present delineating the boundaries of the circuitry area, and previously completed circuitry segments can be recalled for piece-by-piece assembly of the circuit board.

Assembling surface mounted components on ink-jet printed double sided paper circuit board

International Nuclear Information System (INIS)

Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Sidén, Johan; Nilsson, Hans-Erik; Hummelgård, Magnus; Olin, Håkan; Hummelgård, Christine

2014-01-01

Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed. (paper)

Assembling surface mounted components on ink-jet printed double sided paper circuit board.

Science.gov (United States)

Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

2014-03-07

Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

Assembling surface mounted components on ink-jet printed double sided paper circuit board

Energy Technology Data Exchange (ETDEWEB)

Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Sidén, Johan; Nilsson, Hans-Erik [Department of Electronics Design, Mid Sweden University, SE-851 70 Sundsvall (Sweden); Hummelgård, Magnus; Olin, Håkan [Department of Natural Science, Mid Sweden University, SE-851 70 Sundsvall (Sweden); Hummelgård, Christine [Acreo Swedish ICT AB, Håstaholmen 4, SE-824 42 Hudiksvall (Sweden)

2014-03-07

Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed. (paper)

A Printed Organic Circuit System for Wearable Amperometric Electrochemical Sensors.

Science.gov (United States)

Shiwaku, Rei; Matsui, Hiroyuki; Nagamine, Kuniaki; Uematsu, Mayu; Mano, Taisei; Maruyama, Yuki; Nomura, Ayako; Tsuchiya, Kazuhiko; Hayasaka, Kazuma; Takeda, Yasunori; Fukuda, Takashi; Kumaki, Daisuke; Tokito, Shizuo

2018-04-23

Wearable sensor device technologies, which enable continuous monitoring of biological information from the human body, are promising in the fields of sports, healthcare, and medical applications. Further thinness, light weight, flexibility and low-cost are significant requirements for making the devices attachable onto human tissues or clothes like a patch. Here we demonstrate a flexible and printed circuit system consisting of an enzyme-based amperometric sensor, feedback control and amplification circuits based on organic thin-film transistors. The feedback control and amplification circuits based on pseudo-CMOS inverters were successfuly integrated by printing methods on a plastic film. This simple system worked very well like a potentiostat for electrochemical measurements, and enabled the quantitative and real-time measurement of lactate concentration with high sensitivity of 1 V/mM and a short response time of a hundred seconds.

Customization of flexographic printing plates related to uvc-induced changes in the crosslinking degree

Directory of Open Access Journals (Sweden)

Tamara Tomašegović

2016-11-01

Full Text Available In this paper, the swelling properties of photopolymer flexographic printing plates related to the variations of UVC post-treatment have been analysed. The aim of the research was to interconnect the changes in the crosslinking degree of the photopolymer material occurring due to the modified UVC radiation of the printing plate and the changes of its surface free energy crucial in the graphic reproduction process. Changes in the crosslinking degree in the photopolymer materials have been analysed by the swelling experiments. Results have proven that the partial dissolution of the photopolymer material caused by the immersion of the printing plates in various solvents is in the direct relation with the changes of the dispersive surface free energy. UVC post-treatment, used for the crosslinking termination and the definition of the surface properties of printing plates, is therefore directly affecting the resistivity of the printing plate in the solvent environment. By calculating the correlation coefficients for the weight loss of the photopolymer material in solvents and the dispersive surface free energy, the relation between the crosslinking degree and the UVC post-treatment has been established.

Modelling, analysis, and acceleration of a printed circuit board ...

Indian Academy of Sciences (India)

Springer Verlag Heidelberg #4 2048 1996 Dec 15 10:16:45

discuss lead time reduction in a qualitative way with illustrative case studies. Krishnan ... industry practices, and research questions that should drive new methods and computer ... There are three types of printed circuit boards available today.

Merging polygons on two-layer printed circuit board

Directory of Open Access Journals (Sweden)

Murov S. Yu.

2011-12-01

Full Text Available A method is proposed for solving the problem of connection of maximum number of isolated islands of metallized areas of the same chain, located on different layers of the printed circuit board. The method can be used in the automatic tracing of the boards.

Analytical Study on Thermal and Mechanical Design of Printed Circuit Heat Exchanger

Energy Technology Data Exchange (ETDEWEB)

Yoon, Su-Jong [Idaho National Lab. (INL), Idaho Falls, ID (United States); Sabharwall, Piyush [Idaho National Lab. (INL), Idaho Falls, ID (United States); Kim, Eung-Soo [Idaho National Lab. (INL), Idaho Falls, ID (United States)

2013-09-01

The analytical methodologies for the thermal design, mechanical design and cost estimation of printed circuit heat exchanger are presented in this study. In this study, three flow arrangements of parallel flow, countercurrent flow and crossflow are taken into account. For each flow arrangement, the analytical solution of temperature profile of heat exchanger is introduced. The size and cost of printed circuit heat exchangers for advanced small modular reactors, which employ various coolants such as sodium, molten salts, helium, and water, are also presented.

Ultrafast Laser Engraving Method to Fabricate Gravure Plate for Printed Metal-Mesh Touch Panel

Directory of Open Access Journals (Sweden)

Weiyuan Chen

2015-10-01

Full Text Available In order to engrave gravure plate with fine lines structures, conventional art used lithography with dry/wet etching. Lithography with dry/wet etching method allows to engrave lines with smooth concave shape, but its disadvantages include difficulty in controlling aspect ratio, high and uniform in large size process, substrate material limitation due to etching solution availability, and process complexity. We developed ultra-fast laser technology to directly engrave a stainless plate, a gravure plate, to be used for fabricating 23 in. metal-mesh touch panel by gravure offset printing process. The technology employs high energy pulse to ablate materials from a substrate. Because the ultra-fast laser pulse duration is shorter than the energy dissipation time between material lattices, there is no heating issue during the ablation process. Therefore, no volcano-type protrusion on the engraved line edges occurs, leading to good printing quality. After laser engraving, we then reduce surface roughness of the gravure plate using electro-polishing process. Diamond like carbon (DLC coating layer is then added onto the surface to increase scratch resistance. We show that this procedure can fabricate gravure plate for gravure offset printing process with minimum printing linewidth 10.7 μm. A 23 in. metal-mesh pattern was printed using such gravure plate and fully functional touch panel was demonstrated in this work.

RECYCLING OF PRINTED CIRCUIT BOARDS AIMING SILVER RECOVERY: A HYDROMETALLURGICAL ROUTE STUDY

Directory of Open Access Journals (Sweden)

Marcos Paulo Kohler Caldas

2015-06-01

Full Text Available The aim of this paper is characterize printed circuit board of computers and propose a hydrometallurgical route for silver recovery present in its composition. Initially, the printed circuit board was comminuted in both knife and hammer mills. The comminuted material was characterized by sieve analysis, chemical analysis by inductively coupled plasma optical emission spectrometry (ICP-OES and loss on ignition. Leaching tests were conducted in sulfuric acid, sulfuric acid in an oxidizing medium and nitric acid. The results indicated that the printed circuit board is mainly composed of copper (19.42%. Silver content of 0.045% was found. The route for silver recovery was leaching in sulfuric acid at 75°C for 18 hours. Then, leaching in sulfuric acid at 75°C in an oxidizing medium for 6 hours and nitric acid leaching at room temperature for 2 hours. Through of this route, 96.6% of silver was recovered.

Analysis of the Optical Properties of Screen-Printed and Aerosol-Printed and Plated Fingers of Silicon Solar Cells

Directory of Open Access Journals (Sweden)

R. Woehl

2008-01-01

Full Text Available One main efficiency loss in industrial solar cells is the shading of the cell caused by the metal front side contacts. With the aerosol-printing technique plus an additional light-induced plating (LIP step, not only is the geometrical contact width narrowed compared to screen-printed contacts but also the shape of the finger changes. In this work, the effective shading of different finger types is analysed with two different measurement methods. The essential parameter for characterising the finger is the effective width which can be reduced drastically compared to the geometrical width due to total internal reflection at the glass-air layer and the reflection from the roundish edges of the contact fingers into the cell. This parameter was determined with different methods. It could be shown that for aerosol-printed fingers the effective (optical width is only 38% of its geometrical width, while for standard screen-printed fingers it is 47%. The measured values are compared to a theoretical model for an aerosol-printed and plated finger and are in good agreement.

Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

Energy Technology Data Exchange (ETDEWEB)

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad bin Khalifa University, Doha (Qatar)

2015-01-15

Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced.

Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

International Nuclear Information System (INIS)

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S.K.; McKay, Gordon

2015-01-01

Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced

Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill

International Nuclear Information System (INIS)

Yoo, Jae-Min; Jeong, Jinki; Yoo, Kyoungkeun; Lee, Jae-chun; Kim, Wonbaek

2009-01-01

Printed circuit boards incorporated in most electrical and electronic equipment contain valuable metals such as Cu, Ni, Au, Ag, Pd, Fe, Sn, and Pb. In order to employ a hydrometallurgical route for the recycling of valuable metals from printed circuit boards, a mechanical pre-treatment step is needed. In this study, the metallic components from waste printed circuit boards have been enriched using a mechanical separation process. Waste printed circuit boards shredded to 5.0 mm. The fractions of milled printed circuit boards of size 5.0 mm fraction and the heavy fraction were subjected to two-step magnetic separation. Through the first magnetic separation at 700 Gauss, 83% of the nickel and iron, based on the whole printed circuit boards, was recovered in the magnetic fraction, and 92% of the copper was recovered in the non-magnetic fraction. The cumulative recovery of nickel-iron concentrate was increased by a second magnetic separation at 3000 Gauss, but the grade of the concentrate decreased remarkably from 76% to 56%. The cumulative recovery of copper concentrate decreased, but the grade increased slightly from 71.6% to 75.4%. This study has demonstrated the feasibility of the mechanical separation process consisting of milling/size classification/gravity separation/two-step magnetic separation for enriching metallic components such as Cu, Ni, Al, and Fe from waste printed circuit boards

Fabrication of Ultra-Thin Printed Organic TFT CMOS Logic Circuits Optimized for Low-Voltage Wearable Sensor Applications.

Science.gov (United States)

Takeda, Yasunori; Hayasaka, Kazuma; Shiwaku, Rei; Yokosawa, Koji; Shiba, Takeo; Mamada, Masashi; Kumaki, Daisuke; Fukuda, Kenjiro; Tokito, Shizuo

2016-05-09

Ultrathin electronic circuits that can be manufactured by using conventional printing technologies are key elements necessary to realize wearable health sensors and next-generation flexible electronic devices. Due to their low level of power consumption, complementary (CMOS) circuits using both types of semiconductors can be easily employed in wireless devices. Here, we describe ultrathin CMOS logic circuits, for which not only the source/drain electrodes but also the semiconductor layers were printed. Both p-type and n-type organic thin film transistor devices were employed in a D-flip flop circuit in the newly developed stacked structure and exhibited excellent electrical characteristics, including good carrier mobilities of 0.34 and 0.21 cm(2) V(-1) sec(-1), and threshold voltages of nearly 0 V with low operating voltages. These printed organic CMOS D-flip flop circuits exhibit operating frequencies of 75 Hz and demonstrate great potential for flexible and printed electronics technology, particularly for wearable sensor applications with wireless connectivity.

Development of an Economical Interfacing Circuit for Upgrading of SEM Data Printing System

International Nuclear Information System (INIS)

Punnachaiya, S.; Thong-Aram, D.

2002-01-01

The operating conditions of a Scanning Electron Microscope (SEM) i.e., magnification, accelerating voltage, micron mark and film identification labeling, are very important for the accurate interpretation of a micrograph picture. In the old model SEM, the built-in data printing system for film identification can be inputted only the numerical number. This will be made a confusing problems when various operating conditions were applied in routine work. An economical interfacing circuit, therefore, was developed to upgrade the data printing system for capable of alphanumerical labeling. The developed circuit was tested on both data printing systems of JSM-T220 and JSM-T330 (JEOL SEM). It was found that the interfacing function worked properly and easily installed

Gas microstrip detectors based on flexible printed circuit

International Nuclear Information System (INIS)

Salomon, M.; Crowe, K.; Faszer, W.; Lindsay, P.; Curran Maier, J.M.

1995-09-01

We have studied the properties of a new type of Gas Microstrip Counter built using flexible printed circuit technology. We describe the manufacturing procedures, the assembly of the device, as well as its operation under a variety of conditions, gases and types of radiation. We also describe two new passivation materials, Tantalum and Niobium, which produce effective surfaces. (author)

Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating

International Nuclear Information System (INIS)

Chen, Jin-Ju; Lin, Guo-Qiang; Wang, Yan; Sowade, Enrico; Baumann, Reinhard R.; Feng, Zhe-Sheng

2017-01-01

Highlights: • Copper patterns were fabricated by reactive inkjet printing and two-step electroless plating. • Cu particles produced via reactive inkjet printing act as catalyst for copper electroless plating. • High conductivity can be obtained without many printing passes and high temperature sintering. • This approach can largely avoid nozzle-clogging problems. • This approach presents a potential way in the flexible printed electronics with simple process. - Abstract: A simple and low-cost process for fabricating conductive copper patterns on flexible polyimide substrates was demonstrated. Copper catalyst patterns were first produced on polyimide substrates using reactive inkjet printing of Cu (II)-bearing ink and reducing ink, and then the conductive copper patterns were generated after a two-step electroless plating procedure. The copper layers were characterized by optical microscope, SEM, XRD and EDS. Homogeneously distributed copper nanoclusters were found in the catalyst patterns. A thin copper layer with uniform particle size was formed after first-step electroless plating, and a thick copper layer of about 14.3 μm with closely packed structure and fine crystallinity was produced after second-step electroless plating. This resulting copper layer had good solderability, reliable adhesion strength and a low resistivity of 5.68 μΩ cm without any sintering process.

Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating

Energy Technology Data Exchange (ETDEWEB)

Chen, Jin-Ju; Lin, Guo-Qiang; Wang, Yan [State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054 (China); Sowade, Enrico; Baumann, Reinhard R. [Digital Printing and Imaging Technology, Technische Universität Chemnitz, Chemnitz, 09126 (Germany); Feng, Zhe-Sheng, E-mail: fzs@uestc.edu.cn [State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054 (China)

2017-02-28

Highlights: • Copper patterns were fabricated by reactive inkjet printing and two-step electroless plating. • Cu particles produced via reactive inkjet printing act as catalyst for copper electroless plating. • High conductivity can be obtained without many printing passes and high temperature sintering. • This approach can largely avoid nozzle-clogging problems. • This approach presents a potential way in the flexible printed electronics with simple process. - Abstract: A simple and low-cost process for fabricating conductive copper patterns on flexible polyimide substrates was demonstrated. Copper catalyst patterns were first produced on polyimide substrates using reactive inkjet printing of Cu (II)-bearing ink and reducing ink, and then the conductive copper patterns were generated after a two-step electroless plating procedure. The copper layers were characterized by optical microscope, SEM, XRD and EDS. Homogeneously distributed copper nanoclusters were found in the catalyst patterns. A thin copper layer with uniform particle size was formed after first-step electroless plating, and a thick copper layer of about 14.3 μm with closely packed structure and fine crystallinity was produced after second-step electroless plating. This resulting copper layer had good solderability, reliable adhesion strength and a low resistivity of 5.68 μΩ cm without any sintering process.

Use of 3D Printed Bone Plate in Novel Technique to Surgically Correct Hallux Valgus Deformities

Science.gov (United States)

Smith, Kathryn E.; Dupont, Kenneth M.; Safranski, David L.; Blair, Jeremy; Buratti, Dawn; Zeetser, Vladimir; Callahan, Ryan; Lin, Jason; Gall, Ken

2016-01-01

Three-dimensional (3-D) printing offers many potential advantages in designing and manufacturing plating systems for foot and ankle procedures that involve small, geometrically complex bony anatomy. Here, we describe the design and clinical use of a Ti-6Al-4V ELI bone plate (FastForward™ Bone Tether Plate, MedShape, Inc., Atlanta, GA) manufactured through 3-D printing processes. The plate protects the second metatarsal when tethering suture tape between the first and second metatarsals and is a part of a new procedure that corrects hallux valgus (bunion) deformities without relying on doing an osteotomy or fusion procedure. The surgical technique and two clinical cases describing the use of this procedure with the 3-D printed bone plate are presented within. PMID:28337049

Innovation-Prototype. Making hydraulic and/or pneumatic plates using 3D printing technology

Science.gov (United States)

Alexa, V.; Rațiu, S. A.; Kiss, I.; Cioată, V. G.; Rackov, M.

2018-01-01

Start 3D printing allows hydraulic and/or pneumatic plates to be obtained from a single technological process without requiring further post-production operations. 3D printing with innovative materials in a rich colour range has several advantages such as: time-saving, cost is the same for any type of plate and its reported just to volume, fast and impossible realization of hydraulic and/or pneumatic links compared to traditional and high accuracy technologies.

Inkjet printed large-area flexible circuits: a simple methodology for optimizing the printing quality

Science.gov (United States)

Cheng, Tao; Wu, Youwei; Shen, Xiaoqin; Lai, Wenyong; Huang, Wei

2018-01-01

In this work, a simple methodology was developed to enhance the patterning resolution of inkjet printing, involving process optimization as well as substrate modification and treatment. The line width of the inkjet-printed silver lines was successfully reduced to 1/3 of the original value using this methodology. Large-area flexible circuits with delicate patterns and good morphology were thus fabricated. The resultant flexible circuits showed excellent electrical conductivity as low as 4.5 Ω/□ and strong tolerance to mechanical bending. The simple methodology is also applicable to substrates with various wettability, which suggests a general strategy to enhance the printing quality of inkjet printing for manufacturing high-performance large-area flexible electronics. Project supported by the National Key Basic Research Program of China (Nos. 2014CB648300, 2017YFB0404501), the National Natural Science Foundation of China (Nos. 21422402, 21674050), the Natural Science Foundation of Jiangsu Province (Nos. BK20140060, BK20130037, BK20140865, BM2012010), the Program for Jiangsu Specially-Appointed Professors (No. RK030STP15001), the Program for New Century Excellent Talents in University (No. NCET-13-0872), the NUPT "1311 Project" and Scientific Foundation (Nos. NY213119, NY213169), the Synergetic Innovation Center for Organic Electronics and Information Displays, the Priority Academic Program Development of Jiangsu Higher Education Institutions (PAPD), the Leading Talent of Technological Innovation of National Ten-Thousands Talents Program of China, the Excellent Scientific and Technological Innovative Teams of Jiangsu Higher Education Institutions (No. TJ217038), the Program for Graduate Students Research and Innovation of Jiangsu Province (No. KYZZ16-0253), and the 333 Project of Jiangsu Province (Nos. BRA2017402, BRA2015374).

Investigation of printed circuit heat exchanger for VHTRs - HTR2008-58097

International Nuclear Information System (INIS)

Mylavarapu, S. K.; Sun, X.; Figley, J.; Needler, N. J.; Christensen, R. N.

2008-01-01

Very High Temperature Reactors (VHTRs) require high temperature (900-950 deg. C), high integrity, and high efficiency heat exchangers during normal and off-normal conditions. A class of compact heat exchangers, namely, the Printed Circuit Heat Exchangers (PCHEs), made of high temperature materials, found to have the above characteristics, are being increasingly pursued for heavy duty applications. A high-temperature helium experimental test facility, primarily aimed at investigating the heat transfer and pressure drop characteristics of the PCHEs, was designed and is being built at the Ohio State Univ.. The test facility was designed for a maximum operating temperature and pressure of 900 deg. C and 3 MPa, respectively. Owing to the high operating conditions, a detailed investigation various high temperature materials was carried out to aid in design of the test facility and the heat exchangers. The study showed that alloy 617 is the leading candidate material for high temperature heat exchangers. Two PCHEs, each having 10 hot 10 cold plates with 12 channels in each plate, are currently being fabricated from alloy 617 plates and will be tested once test facility is constructed. To supplement the experiments, computational fluid dynamics modeling of a simplified PCHE model is being performed and the results for three flow rate cases of 15, 40, and 90 kg/h and a system pressure of 3 MPa are discussed. In summary, this paper focuses on the study of the high-temperature materials, the design of the helium test facility, the design and fabrication of the PCHEs, and the computational modeling of a simplified PCHE model. (authors)

Copper circuit patterning on polymer using selective surface modification and electroless plating

Energy Technology Data Exchange (ETDEWEB)

Park, Sang Jin [Department of Materials Science and Engineering, Chungnam National University, Daejeon 305-764 (Korea, Republic of); Ko, Tae-Jun [Institute for Multidisciplinary Convergence of Materials, Korea Institute of Science and Technology, Seoul 130-650 (Korea, Republic of); Department of Materials Science and Engineering, Seoul National University, Seoul 151-742 (Korea, Republic of); Yoon, Juil [Department of Mechanical Systems Engineering, Hansung University, Seoul 136-792 (Korea, Republic of); Moon, Myoung-Woon [Institute for Multidisciplinary Convergence of Materials, Korea Institute of Science and Technology, Seoul 130-650 (Korea, Republic of); Oh, Kyu Hwan [Department of Materials Science and Engineering, Seoul National University, Seoul 151-742 (Korea, Republic of); Han, Jun Hyun, E-mail: jhhan@cnu.ac.kr [Department of Materials Science and Engineering, Chungnam National University, Daejeon 305-764 (Korea, Republic of)

2017-02-28

Highlights: • A new simple two step method for the pattering of Cu circuits on PET substrate was proposed. • The simple patterning of the high adhesive Cu circuits was achieved by plasma treatment using a patterned mask coated with a catalyst material. • The high adhesive strength of Cu circuits was due to the nanostructure formed by oxygen plasma treatment. - Abstract: We have examined a potential new and simple method for patterning a copper circuit on PET substrate by copper electroless plating, without the pretreatment steps (i.e., sensitization and activation) for electroless plating as well as the etching processes of conventional circuit patterning. A patterned mask coated with a catalyst material, Ag, for the reduction of Cu ions, is placed on a PET substrate. Subsequent oxygen plasma treatment of the PET substrate covered with the mask promotes the selective generation of anisotropic pillar- or hair-like nanostructures coated with co-deposited nanoparticles of the catalyst material on PET. After oxygen plasma treatment, a Cu circuit is well formed just by dipping the plasma-treated PET into a Cu electroless plating solution. By increasing the oxygen gas pressure in the chamber, the height of the nanostructures increases and the Ag catalyst particles are coated on not only the top but also the side surfaces of the nanostructures. Strong mechanical interlocking between the Cu circuit and PET substrate is produced by the large surface area of the nanostructures, and enhances peel strength. Results indicate this new simple two step (plasma surface modification and pretreatment-free electroless plating) method can be used to produce a flexible Cu circuit with good adhesion.

An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards

Directory of Open Access Journals (Sweden)

Bruno de Castro Braz

Full Text Available Abstract Aerospace vehicles are mostly exposed to random vibration loads during its operational lifetime. These harsh conditions excites vibration responses in the vehicles printed circuit boards, what can cause failure on mission functionality due to fatigue damage of electronic components. A novel analytical model to evaluate the useful life of embedded electronic components (capacitors, chips, oscillators etc. mounted on Printed Circuit Boards (PCB is presented. The fatigue damage predictions are calculated by the relative displacement between the PCB and the component, the lead stiffness, as well the natural vibration modes of the PCB and the component itself. Statistical methods are used for fatigue cycle counting. The model is applied to experimental fatigue tests of PCBs available on literature. The analytical results are of the same magnitude order of the experimental findings.

Printed circuit board permittivity measurement using waveguide and resonator rings

NARCIS (Netherlands)

Op 't Land, Sjoerd; Tereshchenko, O.V.; Ramdani, Mohamed; Leferink, Frank Bernardus Johannes; Perdriau, Richard

2014-01-01

Knowing the frequency dependent complex permittivity of Printed Circuit Board (PCB) substrates is important in modern electronics. In this paper, two methods for measuring the permittivity are applied to the same Flame Resistant (FR4) substrate and the results are compared. The reference measurement

[Use of four kinds of three-dimensional printing guide plate in bone tumor resection and reconstruction operation].

Science.gov (United States)

Fu, Jun; Guo, Zheng; Wang, Zhen; Li, Xiangdong; Fan, Hongbin; Li, Jing; Pei, Yanjun; Pei, Guoxian; Li, Dan

2014-03-01

To explore the effectiveness of excision and reconstruction of bone tumor by using operation guide plate made by variety of three-dimensional (3-D) printing techniques, and to compare the advantages and disadvantages of different 3-D printing techniques in the manufacture and application of operation guide plate. Between September 2012 and January 2014, 31 patients with bone tumor underwent excision and reconstruction of bone tumor by using operation guide plate. There were 19 males and 12 females, aged 6-67 years (median, 23 years). The disease duration ranged from 15 days to 12 months (median, 2 months). There were 13 cases of malignant tumor and 18 cases of benign tumor. The tumor located in the femur (9 cases), the spine (7 cases), the tibia (6 cases), the pelvis (5 cases), the humerus (3 cases), and the fibula (1 case). Four kinds of 3-D printing technique were used in processing operation guide plate: fused deposition modeling (FDM) in 9 cases, stereo lithography appearance (SLA) in 14 cases, 3-D printing technique in 5 cases, and selective laser sintering (SLS) in 3 cases; the materials included ABS resin, photosensitive resin, plaster, and aluminum alloy, respectively. Before operation, all patients underwent thin layer CT scanning (0.625 mm) in addition to conventional imaging. The data were collected for tumor resection design, and operation guide plate was designed on the basis of excision plan. Preoperatively, the operation guide plates were made by 3-D printing equipment. After sterilization, the guide plates were used for excision and reconstruction of bone tumor. The time of plates processing cycle was recorded to analyse the efficiency of 4 kinds of 3-D printing techniques. The time for design and operation and intraoperative fluoroscopy frequency were recorded. Twenty-eight patients underwent similar operations during the same period as the control group. The processing time of operation guide plate was (19.3 +/- 6.5) hours in FDM, (5.2 +/- 1

Toward printed integrated circuits based on unipolar or ambipolar polymer semiconductors.

Science.gov (United States)

Baeg, Kang-Jun; Caironi, Mario; Noh, Yong-Young

2013-08-21

For at least the past ten years printed electronics has promised to revolutionize our daily life by making cost-effective electronic circuits and sensors available through mass production techniques, for their ubiquitous applications in wearable components, rollable and conformable devices, and point-of-care applications. While passive components, such as conductors, resistors and capacitors, had already been fabricated by printing techniques at industrial scale, printing processes have been struggling to meet the requirements for mass-produced electronics and optoelectronics applications despite their great potential. In the case of logic integrated circuits (ICs), which constitute the focus of this Progress Report, the main limitations have been represented by the need of suitable functional inks, mainly high-mobility printable semiconductors and low sintering temperature conducting inks, and evoluted printing tools capable of higher resolution, registration and uniformity than needed in the conventional graphic arts printing sector. Solution-processable polymeric semiconductors are the best candidates to fulfill the requirements for printed logic ICs on flexible substrates, due to their superior processability, ease of tuning of their rheology parameters, and mechanical properties. One of the strongest limitations has been mainly represented by the low charge carrier mobility (μ) achievable with polymeric, organic field-effect transistors (OFETs). However, recently unprecedented values of μ ∼ 10 cm(2) /Vs have been achieved with solution-processed polymer based OFETs, a value competing with mobilities reported in organic single-crystals and exceeding the performances enabled by amorphous silicon (a-Si). Interestingly these values were achieved thanks to the design and synthesis of donor-acceptor copolymers, showing limited degree of order when processed in thin films and therefore fostering further studies on the reason leading to such improved charge

A novel and simple method of printing flexible conductive circuits on PET fabrics

International Nuclear Information System (INIS)

Wang, Zehong; Wang, Wei; Jiang, Zhikang; Yu, Dan

2017-01-01

Highlights: • A simple preparation of nano-silver conductive ink was proposed. • Conductive pattern was printed on PET fabrics without heat sintering. • The surface resistivity of printed pattern is low to 0.197 Ω cm. - Abstract: Flexible conductive circuits on PET fabrics were fabricated by a simple approach. Firstly, well dispersed nano-silver colloids with average size of 87 nm were synthesized with poly (vinyl pyrrolidone). Then, by adding polyurethane and thickening agent into these colloids, Ag NP-based ink was produced and printed on PET fabrics by screen printing. Conductive patterns were achieved through the swelling process of polyurethane and the decrease of contact resistance between nano-silver particles when immersed in dichloromethane (DCM) and diallyldimethylammonium chloride (DMDAAC) mixed solution. After it was dried at 40 °C,the surface resistivity was about 0.197 Ω cm with width 1.9 mm, and thickness 20 μm. Moreover, the effects of different DCM contents on the conductivity and the film forming ability have been investigated. We believe these foundings will provide some important analysis for printing flexible conductive circuits on textiles.

A novel and simple method of printing flexible conductive circuits on PET fabrics

Energy Technology Data Exchange (ETDEWEB)

Wang, Zehong; Wang, Wei [College of Chemistry, Chemical Engineering and Biotechnology, Donghua University, Shanghai 201620 (China); Key Laboratory of Textile Science & Technology, Ministry of Education (China); Jiang, Zhikang [Saintyear Holding Group Co., Ltd. (China); Yu, Dan, E-mail: vchtian@163.com [College of Chemistry, Chemical Engineering and Biotechnology, Donghua University, Shanghai 201620 (China); Key Laboratory of Textile Science & Technology, Ministry of Education (China); Saintyear Holding Group Co., Ltd. (China)

2017-02-28

Highlights: • A simple preparation of nano-silver conductive ink was proposed. • Conductive pattern was printed on PET fabrics without heat sintering. • The surface resistivity of printed pattern is low to 0.197 Ω cm. - Abstract: Flexible conductive circuits on PET fabrics were fabricated by a simple approach. Firstly, well dispersed nano-silver colloids with average size of 87 nm were synthesized with poly (vinyl pyrrolidone). Then, by adding polyurethane and thickening agent into these colloids, Ag NP-based ink was produced and printed on PET fabrics by screen printing. Conductive patterns were achieved through the swelling process of polyurethane and the decrease of contact resistance between nano-silver particles when immersed in dichloromethane (DCM) and diallyldimethylammonium chloride (DMDAAC) mixed solution. After it was dried at 40 °C,the surface resistivity was about 0.197 Ω cm with width 1.9 mm, and thickness 20 μm. Moreover, the effects of different DCM contents on the conductivity and the film forming ability have been investigated. We believe these foundings will provide some important analysis for printing flexible conductive circuits on textiles.

Effects of the Particle Size and the Solvent in Printing Inks on the Capacitance of Printed Parallel-Plate Capacitors

Directory of Open Access Journals (Sweden)

Sungsik Park

2016-02-01

Full Text Available Parallel-plate capacitors were fabricated using a printed multi-layer structure in order to determine the effects of particle size and solvent on the capacitance. The conductive-dielectric-conductive layers were sequentially spun using commercial inks and by intermediate drying with the aid of a masking polymeric layer. Both optical and scanning electron microscopy were used to characterize the morphology of the printed layers. The measured capacitance was larger than the theoretically calculated value when ink with small-sized particles was used as the top plate. Furthermore, the use of a solvent whose polarity was similar to that of the underlying dielectric layer enhanced the penetration and resulted in an increase in capacitance. The functional resistance-capacitance low-pass filter was implemented using printed resistors and capacitors, a process that may be scalable in the future.

Soft-Matter Printed Circuit Board with UV Laser Micropatterning.

Science.gov (United States)

Lu, Tong; Markvicka, Eric J; Jin, Yichu; Majidi, Carmel

2017-07-05

When encapsulated in elastomer, micropatterned traces of Ga-based liquid metal (LM) can function as elastically deformable circuit wiring that provides mechanically robust electrical connectivity between solid-state elements (e.g., transistors, processors, and sensor nodes). However, LM-microelectronics integration is currently limited by challenges in rapid fabrication of LM circuits and the creation of vias between circuit terminals and the I/O pins of packaged electronics. In this study, we address both with a unique layup for soft-matter electronics in which traces of liquid-phase Ga-In eutectic (EGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically aligned columns of EGaIn-coated Ag-Fe 2 O 3 microparticles that are embedded within an interfacial elastomer layer. The processing technique is compatible with conventional UVLM printed circuit board (PCB) prototyping and exploits the photophysical ablation of EGaIn on an elastomer substrate. Potential applications to wearable computing and biosensing are demonstrated with functional implementations in which soft-matter PCBs are populated with surface-mounted microelectronics.

[Flexible print circuit technology application in biomedical engineering].

Science.gov (United States)

Jiang, Lihua; Cao, Yi; Zheng, Xiaolin

2013-06-01

Flexible print circuit (FPC) technology has been widely applied in variety of electric circuits with high precision due to its advantages, such as low-cost, high specific fabrication ability, and good flexibility, etc. Recently, this technology has also been used in biomedical engineering, especially in the development of microfluidic chip and microelectrode array. The high specific fabrication can help making microelectrode and other micro-structure equipment. And good flexibility allows the micro devices based on FPC technique to be easily packaged with other parts. In addition, it also reduces the damage of microelectrodes to the tissue. In this paper, the application of FPC technology in biomedical engineering is introduced. Moreover, the important parameters of FPC technique and the development trend of prosperous applications is also discussed.

Pressure drop and heat transfer characteristics of a high-temperature printed circuit heat exchanger

International Nuclear Information System (INIS)

Chen, Minghui; Sun, Xiaodong; Christensen, Richard N.; Skavdahl, Isaac; Utgikar, Vivek; Sabharwall, Piyush

2016-01-01

Highlights: • Pressure drop and heat transfer characteristics of a high-temperature printed circuit heat exchanger have been obtained. • Comparisons of experimental data and available correlations have been performed. • New Fanning friction factor and heat transfer correlations for the test PCHE are developed. - Abstract: Printed circuit heat exchanger (PCHE) is one of the leading intermediate heat exchanger (IHX) candidates to be employed in the very-high-temperature gas-cooled reactors (VHTRs) due to its capability for high-temperature, high-pressure applications. In the current study, a reduced-scale zigzag-channel PCHE was fabricated using Alloy 617 plates for the heat exchanger core and Alloy 800H pipes for the headers. The pressure drop and heat transfer characteristics of the PCHE were investigated experimentally in a high-temperature helium test facility (HTHF) at The Ohio State University. The PCHE helium inlet temperatures and pressures were varied up to 464 °C/2.7 MPa for the cold side and 802 °C/2.7 MPa for the hot side, respectively, while the maximum helium mass flow rates on both sides of the PCHE reached 39 kg/h. The corresponding maximum channel Reynolds number was approximately 3558, covering the laminar flow and laminar-to-turbulent flow transition regimes. New pressure drop and heat transfer correlations for the current zigzag channels with rounded bends were developed based on the experimental data. Comparisons between the experimental data and the results obtained from the available PCHE and straight circular pipe correlations were conducted. Compared to the heat transfer performance in straight circular pipes, the zigzag channels provided little advantage in the laminar flow regime but significant advantage near the transition flow regime.

Gas microstrip detectors based on flexible printed circuit

International Nuclear Information System (INIS)

Salomon, M.; Crowe, K.; Faszer, W.; Lindsay, P.; Curran Maier, J.M.

1995-09-01

Microstrip Gas Detectors (MSGC's) were introduced some years ago as position sensitive detectors capable of operating at very high rates. The authors have studied the properties of a new type of Gas Microstrip Counter built using flexible printed circuit technology. They describe the manufacturing procedures, the assembly of the device, as well as its operation under a variety of conditions, gases and types of radiation. They also describe two new passivation materials, tantalum and niobium, which produce effective surfaces

Plated copper front side metallization on printed seed-layers for silicon solar cells

OpenAIRE

Kraft, Achim

2015-01-01

A novel copper front side metallization architecture for silicon solar cells based on a fine printed silver seed-layer, plated with nickel, copper and silver, is investigated. The work focuses on the printing of fine seed-layers with low silver consumption, the corrosion of the printed seed-layers by the interaction with electrolyte solutions and the encapsulation material on module level and on the long term stability of the cells due to copper migration. The investigation of the correlation...

Study of the computer-aided implantation and layout of printed circuits

International Nuclear Information System (INIS)

Baudry, Marc

1973-01-01

This research thesis reports the design and implementation of a software aimed at a computer-aided implantation and layout of printed circuits. This work comprises the use of heuristic algorithms and the search for a minimum cost by reduction of computing time and of memory size. The software comprises four independent parts which respectively address data analysis and control, circuit implantation, connection layout, and the exploitation of the obtained results. These four parts and their subroutines are presented. Two examples are reported in appendix

A 3D-Printed Oxygen Control Insert for a 24-Well Plate.

Directory of Open Access Journals (Sweden)

Martin D Brennan

Full Text Available 3D printing has emerged as a method for directly printing complete microfluidic devices, although printing materials have been limited to oxygen-impermeable materials. We demonstrate the addition of gas permeable PDMS (Polydimethylsiloxane membranes to 3D-printed microfluidic devices as a means to enable oxygen control cell culture studies. The incorporation of a 3D-printed device and gas-permeable membranes was demonstrated on a 24-well oxygen control device for standard multiwell plates. The direct printing allows integrated distribution channels and device geometries not possible with traditional planar lithography. With this device, four different oxygen conditions were able to be controlled, and six wells were maintained under each oxygen condition. We demonstrate enhanced transcription of the gene VEGFA (vascular endothelial growth factor A with decreasing oxygen levels in human lung adenocarcinoma cells. This is the first 3D-printed device incorporating gas permeable membranes to facilitate oxygen control in cell culture.

Research on Toxicity Evaluation of Waste Incineration Residues of Printed Circuit Boards

Directory of Open Access Journals (Sweden)

Rasa Volungevičienė

2014-10-01

Full Text Available Recycling waste printed circuit boards (PCB is an extremely complicated process, because PCBs consist of a number of complex components – hazardous and non-hazardous materials sets. Pyrolysis and combustion are currently the most effective treatment technologies for waste printed circuit boards. Pyrolysis can be used for thermally decomposing PCBs allowing for the simultaneous recovery of valuable materials. Following the extraction of valuable materials, the problem of residual ash utilization is encountered. Determining the qualitative and quantitative characteristics of incineration residue helps with choosing effective ash management technologies. This paper analyzes PCB ash generated at three different temperatures of 400 °C, 500 °C and 600 °C. Ash residues have been analysed to determine the quantity and type of metals present. Furthermore, the experiment of leaching heavy metals from ash has been described.

Ruggedizing Printed Circuit Boards Using a Wideband Dynamic Absorber

Directory of Open Access Journals (Sweden)

V.C. Ho

2003-01-01

Full Text Available The existing approaches to ruggedizing inherently fragile and sensitive critical components of electronic equipment such as printed circuit boards (PCB for use in hostile industrial and military environment are either insufficient or expensive. This paper addresses a novel approach towards ruggedizing commercial-off-the-shelf PCBs using a miniature wideband dynamic absorber. The optimisation technique used relies on the experimentally measured vibration spectra and complex receptance of the original PCB.

Inkjet-printed conductive features for rapid integration of electronic circuits in centrifugal microfluidics

CSIR Research Space (South Africa)

Kruger, J

2015-05-01

Full Text Available This work investigates the properties of conductive circuits inkjet-printed onto the polycarbonate discs used in CD-based centrifugal microfluidics, contributing towards rapidly prototyped electronic systems in smart ubiquitous biosensors, which...

Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

International Nuclear Information System (INIS)

Karwowska, Ewa; Andrzejewska-Morzuch, Dorota; Łebkowska, Maria; Tabernacka, Agnieszka; Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka

2014-01-01

Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment

Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria

Energy Technology Data Exchange (ETDEWEB)

Karwowska, Ewa, E-mail: ewa.karwowska@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Andrzejewska-Morzuch, Dorota; Łebkowska, Maria [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Tabernacka, Agnieszka, E-mail: agnieszka.tabernacka@is.pw.edu.pl [Warsaw University of Technology, Faculty of Environmental Engineering, Biology Division, Nowowiejska 20, 00-653 Warsaw (Poland); Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka [Warsaw University of Technology, Faculty of Environmental Engineering, Nowowiejska 20, 00-653 Warsaw (Poland)

2014-01-15

Highlights: • Bioleaching of metals from printed circuit boards by BSAC-producing bacteria was estimated. • Aeration increased the release of all metals in medium with sulphur and biosurfactant. • Increase in Cu, Pb, Ni and Cr removal rate was observed at 37 °C in acidic medium. -- Abstract: This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37 °C) had a more significant impact in the acidic environment than in the neutral environment.

Integrated digital printing of flexible circuits for wireless sensing (Conference Presentation)

Science.gov (United States)

Mei, Ping; Whiting, Gregory L.; Schwartz, David E.; Ng, Tse Nga; Krusor, Brent S.; Ready, Steve E.; Daniel, George; Veres, Janos; Street, Bob

2016-09-01

Wireless sensing has broad applications in a wide variety of fields such as infrastructure monitoring, chemistry, environmental engineering and cold supply chain management. Further development of sensing systems will focus on achieving light weight, flexibility, low power consumption and low cost. Fully printed electronics provide excellent flexibility and customizability, as well as the potential for low cost and large area applications, but lack solutions for high-density, high-performance circuitry. Conventional electronics mounted on flexible printed circuit boards provide high performance but are not digitally fabricated or readily customizable. Incorporation of small silicon dies or packaged chips into a printed platform enables high performance without compromising flexibility or cost. At PARC, we combine high functionality c-Si CMOS and digitally printed components and interconnects to create an integrated platform that can read and process multiple discrete sensors. Our approach facilitates customization to a wide variety of sensors and user interfaces suitable for a broad range of applications including remote monitoring of health, structures and environment. This talk will describe several examples of printed wireless sensing systems. The technologies required for these sensor systems are a mix of novel sensors, printing processes, conventional microchips, flexible substrates and energy harvesting power solutions.

Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

DEFF Research Database (Denmark)

Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

2017-01-01

A majority of printed circuit board surfaces are covered with tin, therefore tin corrosion under humid conditions and movement of tin ions under the influence of an electric field plays an important role in the corrosion failure development. Tracking tin corrosion products spread on the printed c...

Fast optoelectric printing of plasmonic nanoparticles into tailored circuits

Science.gov (United States)

Rodrigo, José A.

2017-04-01

Plasmonic nanoparticles are able to control light at nanometre-scale by coupling electromagnetic fields to the oscillations of free electrons in metals. Deposition of such nanoparticles onto substrates with tailored patterns is essential, for example, in fabricating plasmonic structures for enhanced sensing. This work presents an innovative micro-patterning technique, based on optoelectic printing, for fast and straightforward fabrication of curve-shaped circuits of plasmonic nanoparticles deposited onto a transparent electrode often used in optoelectronics, liquid crystal displays, touch screens, etc. We experimentally demonstrate that this kind of plasmonic structure, printed by using silver nanoparticles of 40 nm, works as a plasmonic enhanced optical device allowing for polarized-color-tunable light scattering in the visible. These findings have potential applications in biosensing and fabrication of future optoelectronic devices combining the benefits of plasmonic sensing and the functionality of transparent electrodes.

Application of parallel processing for automatic inspection of printed circuits

International Nuclear Information System (INIS)

Lougheed, R.M.

1986-01-01

Automated visual inspection of printed electronic circuits is a challenging application for image processing systems. Detailed inspection requires high speed analysis of gray scale imagery along with high quality optics, lighting, and sensing equipment. A prototype system has been developed and demonstrated at the Environmental Research Institute of Michigan (ERIM) for inspection of multilayer thick-film circuits. The central problem of real-time image processing is solved by a special-purpose parallel processor which includes a new high-speed Cytocomputer. In this chapter the inspection process and the algorithms used are summarized, along with the functional requirements of the machine vision system. Next, the parallel processor is described in detail and then performance on this application is given

Effect of ionic contamination on climatic reliability of printed circuit board assemblies

DEFF Research Database (Denmark)

Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

2012-01-01

The effect of NaCl and weak organic acids (WOAs) in “no-clean” wave solder flux residues was studied on electrochemical migration (ECM), leakage current, and corrosion on surface mount chip capacitors using a test printed circuit board assembly (PCBA) substrate having known chip components...

Improving intrinsic corrosion reliability of printed circuit board assembly

DEFF Research Database (Denmark)

Ambat, Rajan; Conseil, Helene

2016-01-01

conditions, therefore the protection of electronic devices is becoming a critical factor in system design. Humidity and local condensation inside electronic enclosures can significantly alter the performance of electronic devices. The presence of moisture in a PCB alters its quality, functionality, thermal...... performance, and thermo-mechanical properties, while condensation on the surface of printed circuit board assemblies (PCBAs) can lead to electrical failures, like electrochemical migration. The result is reduced life span for electronic products and heavy economic loss due to failures....

Impact of NaCl Contamination and Climatic Conditions on the Reliability of Printed Circuit Board Assemblies

DEFF Research Database (Denmark)

Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

The effect of climatic conditions and ionic contamination on the reliability of printed circuit board assembly has been investigated in terms of leakage current (LC) and electrochemical migration susceptibility. The change in LC as a function of relative humidity (RH) and temperature was measured...... and 15 $^{\\circ}\\hbox{C}$ –65 $^{\\circ}\\hbox{C}$. The variation of RH at the surface of the test specimens was imposed by 1) increasing the RH of the surrounding air and 2) reducing the temperature of the printed circuit boards using a cooling stage, while maintaining a constant climatic condition...

Chemically programmed ink-jet printed resistive WORM memory array and readout circuit

International Nuclear Information System (INIS)

Andersson, H; Manuilskiy, A; Sidén, J; Gao, J; Kunninmel, G V; Nilsson, H-E; Hummelgård, M

2014-01-01

In this paper an ink-jet printed write once read many (WORM) resistive memory fabricated on paper substrate is presented. The memory elements are programmed for different resistance states by printing triethylene glycol monoethyl ether on the substrate before the actual memory element is printed using silver nano particle ink. The resistance is thus able to be set to a broad range of values without changing the geometry of the elements. A memory card consisting of 16 elements is manufactured for which the elements are each programmed to one of four defined logic levels, providing a total of 4294 967 296 unique possible combinations. Using a readout circuit, originally developed for resistive sensors to avoid crosstalk between elements, a memory card reader is manufactured that is able to read the values of the memory card and transfer the data to a PC. Such printed memory cards can be used in various applications. (paper)

Preliminary Study of Printed Circuit Heat Exchanger (PCHE) for various power conversion systems for SMART

Energy Technology Data Exchange (ETDEWEB)

Kwon, Jinsu; Baik, Seungjoon; Lee, Jeong Ik [KAIST, Daejeon (Korea, Republic of)

2016-10-15

The steam-Rankine cycle was the most widely used power conversion system for a nuclear power plant. The size of the heat exchanger is important for the modulation. Such a challenge was conducted by Kang et al. They change the steam generator type for the SMART from helical type heat exchanger to Printed Circuit Heat Exchanger (PCHE). Recently, there has been a growing interest in the supercritical carbon dioxide (S-CO{sub 2}) Brayton cycle as the most promising power conversion system. The reason is high efficiency with simple layout and compact power plant due to small turbomachinery and compact heat exchanger technology. That is why the SCO{sub 2} Brayton cycle can enhance the existing advantages of Small Modular Reactor (SMR) like SMART, such as reduction in size, capital cost, and construction period. Thermal hydraulic and geometric parameters of a PCHE for the S-CO{sub 2} power cycle coupled to SMART. The results show that the water - CO{sub 2} printed circuit heat exchanger size is smaller than printed circuit steam generator for the superheated steam Rankine cycle. This results show the potential benefit of using the S-CO-2 Brayton power cycle to a water-cooled small modular reactor.

Study of Photosensitive Dry Films Absorption for Printed Circuit Boards by Photoacoustic Technique

Science.gov (United States)

Hernández, R.; Zaragoza, J. A. Barrientos; Jiménez-Pérez, J. L.; Orea, A. Cruz; Correa-Pacheco, Z. N.

2017-08-01

In this work, the study of photosensitive dry-type films by photoacoustic technique is proposed. The dry film photoresist is resistant to chemical etching for printed circuit boards such as ferric chloride, sodium persulfate or ammonium, hydrochloric acid. It is capable of faithfully reproducing circuit pattern exposed to ultraviolet light (UV) through a negative. Once recorded, the uncured portion is removed with alkaline solution. It is possible to obtain good results in surface mount circuits with tracks of 5 mm. Furthermore, the solid resin films are formed by three layers, two protective layers and a UV-sensitive optical absorption layer in the range of 325 nm to 405 nm. By means of optical absorption of UV-visible rays emitted by a low-power Xe lamp, the films transform this energy into thermal waves generated by the absorption of optical radiation and subsequently no-radiative de-excitation occurs. The photoacoustic spectroscopy is a useful technique to measure the transmittance and absorption directly. In this study, the optical absorption spectra of the three layers of photosensitive dry-type films were obtained as a function of the wavelength, in order to have a knowledge of the absorber layer and the protective layers. These analyses will give us the physical properties of the photosensitive film, which are very important in curing the dry film for applications in printed circuit boards.

Printed Circuit Board Embedded Inductors for Very High Frequency Switch-Mode Power Supplies

DEFF Research Database (Denmark)

Madsen, Mickey Pierre; Knott, Arnold; Andersen, Michael A. E.

2013-01-01

The paper describes the design of three different structures for printed circuit board embedded inductors. Direct comparison of spirals, solenoids and toroids are made with regard to inductance, dc and ac resistance, electromagnetic field and design flexibility. First the equations for the impeda...

Development of high-performance printed organic field-effect transistors and integrated circuits.

Science.gov (United States)

Xu, Yong; Liu, Chuan; Khim, Dongyoon; Noh, Yong-Young

2015-10-28

Organic electronics is regarded as an important branch of future microelectronics especially suited for large-area, flexible, transparent, and green devices, with their low cost being a key benefit. Organic field-effect transistors (OFETs), the primary building blocks of numerous expected applications, have been intensively studied, and considerable progress has recently been made. However, there are still a number of challenges to the realization of high-performance OFETs and integrated circuits (ICs) using printing technologies. Therefore, in this perspective article, we investigate the main issues concerning developing high-performance printed OFETs and ICs and seek strategies for further improvement. Unlike many other studies in the literature that deal with organic semiconductors (OSCs), printing technology, and device physics, our study commences with a detailed examination of OFET performance parameters (e.g., carrier mobility, threshold voltage, and contact resistance) by which the related challenges and potential solutions to performance development are inspected. While keeping this complete understanding of device performance in mind, we check the printed OFETs' components one by one and explore the possibility of performance improvement regarding device physics, material engineering, processing procedure, and printing technology. Finally, we analyze the performance of various organic ICs and discuss ways to optimize OFET characteristics and thus develop high-performance printed ICs for broad practical applications.

Flexible integrated diode-transistor logic (DTL) driving circuits based on printed carbon nanotube thin film transistors with low operation voltage.

Science.gov (United States)

Liu, Tingting; Zhao, Jianwen; Xu, Weiwei; Dou, Junyan; Zhao, Xinluo; Deng, Wei; Wei, Changting; Xu, Wenya; Guo, Wenrui; Su, Wenming; Jie, Jiansheng; Cui, Zheng

2018-01-03

Fabrication and application of hybrid functional circuits have become a hot research topic in the field of printed electronics. In this study, a novel flexible diode-transistor logic (DTL) driving circuit is proposed, which was fabricated based on a light emitting diode (LED) integrated with printed high-performance single-walled carbon nanotube (SWCNT) thin-film transistors (TFTs). The LED, which is made of AlGaInP on GaAs, is commercial off-the-shelf, which could generate free electrical charges upon white light illumination. Printed top-gate TFTs were made on a PET substrate by inkjet printing high purity semiconducting SWCNTs (sc-SWCNTs) ink as the semiconductor channel materials, together with printed silver ink as the top-gate electrode and printed poly(pyromellitic dianhydride-co-4,4'-oxydianiline) (PMDA/ODA) as gate dielectric layer. The LED, which is connected to the gate electrode of the TFT, generated electrical charge when illuminated, resulting in biased gate voltage to control the TFT from "ON" status to "OFF" status. The TFTs with a PMDA/ODA gate dielectric exhibited low operating voltages of ±1 V, a small subthreshold swing of 62-105 mV dec -1 and ON/OFF ratio of 10 6 , which enabled DTL driving circuits to have high ON currents, high dark-to-bright current ratios (up to 10 5 ) and good stability under repeated white light illumination. As an application, the flexible DTL driving circuit was connected to external quantum dot LEDs (QLEDs), demonstrating its ability to drive and to control the QLED.

In-situ fabrication of flexible vertically integrated electronic circuits by inkjet printing

International Nuclear Information System (INIS)

Wang Zhuo; Wu Wenwen; Yang Qunbao; Li Yongxiang; Noh, Chang-Ho

2009-01-01

In this paper, a facile approach for fabricating flexible vertically integrated electronic circuits is demonstrated. A desktop inkjet printer was modified and employed to print silver precursor on a polymer-coated buffer substrates. In-situ reaction was taken place and a conducting line was formed without need of a high temperature treatment. Through this process, several layers of metal integrated circuits were deposited sequentially with polymer buffer layers sandwiched between each layer. Hence, vertically integrated electronic components of diodes, solar cells, flexible flat panel displays, and electrochromic devices can be built with this simple and low-cost technique.

Design of a CMOS readout circuit on ultra-thin flexible silicon chip for printed strain gauges

Directory of Open Access Journals (Sweden)

M. Elsobky

2017-09-01

Full Text Available Flexible electronics represents an emerging technology with features enabling several new applications such as wearable electronics and bendable displays. Precise and high-performance sensors readout chips are crucial for high quality flexible electronic products. In this work, the design of a CMOS readout circuit for an array of printed strain gauges is presented. The ultra-thin readout chip and the printed sensors are combined on a thin Benzocyclobutene/Polyimide (BCB/PI substrate to form a Hybrid System-in-Foil (HySiF, which is used as an electronic skin for robotic applications. Each strain gauge utilizes a Wheatstone bridge circuit, where four Aerosol Jet® printed meander-shaped resistors form a full-bridge topology. The readout chip amplifies the output voltage difference (about 5 mV full-scale swing of the strain gauge. One challenge during the sensor interface circuit design is to compensate for the relatively large dc offset (about 30 mV at 1 mA in the bridge output voltage so that the amplified signal span matches the input range of an analog-to-digital converter (ADC. The circuit design uses the 0. 5 µm mixed-signal GATEFORESTTM technology. In order to achieve the mechanical flexibility, the chip fabrication is based on either back thinned wafers or the ChipFilmTM technology, which enables the manufacturing of silicon chips with a thickness of about 20 µm. The implemented readout chip uses a supply of 5 V and includes a 5-bit digital-to-analog converter (DAC, a differential difference amplifier (DDA, and a 10-bit successive approximation register (SAR ADC. The circuit is simulated across process, supply and temperature corners and the simulation results indicate excellent performance in terms of circuit stability and linearity.

Investigation, development and verification of printed circuit board embedded air-core solenoid transformers

DEFF Research Database (Denmark)

Mønster, Jakob Døllner; Madsen, Mickey Pierre; Pedersen, Jeppe Arnsdorf

2015-01-01

A new printed circuit board embedded air-core transformer/coupled inductor is proposed and presented. The transformer is intended for use in power converter applications operating at very high frequency between 30 MHz to 300 MHz. The transformer is based on two or more solenoid structures...

Application to printed resistors

International Nuclear Information System (INIS)

Hachiyanagi, Yoshimi; Uraki, Hisatsugu; Sawamura, Masashi

1989-01-01

Most of printed circuit boards are made at present by etching copper foils which are laminated on insulating composite boards of paper/phenol resin or glass nonwoven fabric/epoxy rein. This is called subtractive process, and since this is a wet process, the problem of coping with the pollution due to etching solution, plating solution and others is involved. As the method of solving this problem, attention has been paid to the dry process which forms conductor patterns by screen printing using electro-conductive paste. For such resin substrates, generally polymer thick films (PTF) using thermosetting resin as the binder are used. Also the research on the formation of resistors, condensers and other parts by printing using the technology of cermet thick films (CTF) and PTF is active, and it is partially put in practical use. The problems are the deformation and deterioration of substrates, therefore, as the countermeasures, electron beam hardening type PTF has been studied, and various pastes have been developed. In this paper, electron beam hardening type printed resistors are reported. The features, resistance paste, and a number of the experiments on printed resistors are described. (K.I.)

Apparent Polar Wander of the Pacific Plate Since the Cretaeous and Implications for True Polar Wander and for the Plate Motion Circuit Through Antarctica

Science.gov (United States)

Gordon, R. G.; Woodworth, D.

2017-12-01

In this presentation we review prior work on Pacific plate apparent polar wander and its implications (1) for true polar wander since ≈125 Ma and (2) for testing the global plate motion circuit through Antarctica. We furthermore update prior analyses using our recently improved and expanded apparent polar wander path for the Pacific plate [Woodworth et al., this meeting]. Three episodes of rapid motion of Pacific hotspots relative to the spin axis have occurred in the past ≈125 Ma: a ≈15° shift near 85 Ma [Gordon, 1983; Sager and Koppers, 2000], an ≈8° shift near the age of the Hawaiian-Emperor Bend [Petronotis et al., 1994; Woodworth et al., this meeting], and a 3°-°4 shift since 12 Ma [Woodworth et al., this meeting]. These shifts are in general agreement with the shifts of Indo-Atlantic hotspots relative to the spin axis. It has long been recognized that paleomagnetic poles from the continents, when rotated into the Pacific plate reference frame through plate motion circuits through Antarctica, are inconsistent with indigenous Pacific plate paleomagnetic poles and paleolatitudes [Suárez and Molnar, 1980; Gordon and Cox, 1980; Acton and Gordon, 1994]. We update such tests using our new and improved Pacific apparent polar wander path and show that the plate motion circuit through Antarctica still fails such paleomagnetic tests of consistency. Implications for global plate reconstructions and the hotspot reference frame will be discussed.

Preparing printed circuit boards for rapid turn-around time on a protomat plotter

International Nuclear Information System (INIS)

Hawtree, J.

1998-01-01

This document describes the use of the LPKF ProtoMat mill/drill unit circuit board Plotter, with the associated CAD/CAM software BoardMaster and CircuitCAM. At present its primarily use here at Fermilab's Particle Physics Department is for rapid-turnover of prototype PCBs double-sided and single-sided copper clad printed circuit boards (PCBs). (The plotter is also capable of producing gravure films and engraving aluminum or plastic although we have not used it for this.) It has the capability of making traces 0.004 inch wide with 0.004 inch spacings which is appropriate for high density surface mount circuits as well as other through-mounted discrete and integrated components. One of the primary benefits of the plotter is the capability to produce double-sided drilled boards from CAD files in a few hours. However to achieve this rapid turn-around time, some care must be taken in preparing the files. This document describes how to optimize the process of PCB fabrication. With proper preparation, researchers can often have a completed circuit board in a day's time instead of a week or two wait with usual procedures. It is assumed that the software and hardware are properly installed and that the machinist is acquainted with the Win95 operating system and the basics of the associated software. This paper does not describe its use with pen plotters, lasers or rubouts. The process of creating a PCB (printed circuit board) begins with the CAD (computer-aided design) software, usually PCAD or VeriBest. These files are then moved to CAM (computer-aided machining) where they are edited and converted to put them into the proper format for running on the ProtoMat plotter. The plotter then performs the actual machining of the board. This document concentrates on the LPKF programs CircuitCam BASIS and BoardMaster for the CAM software. These programs run on a Windows 95 platform to run an LPKF ProtoMat 93s plotter

Design analysis of a lead–lithium/supercritical CO2 Printed Circuit Heat Exchanger for primary power recovery

International Nuclear Information System (INIS)

Fernández, Iván; Sedano, Luis

2013-01-01

Highlights: • A design for a PbLi/CO 2 (SC) Printed Circuit Heat Exchanger which optimizes the pressure drop performance is proposed. • Numerical analyses have been performed to optimize the airfoil fins shape and arrangement. • SiC is proposed as structural material and tritium permeation barrier for the PCHE. • The integrated flux is larger than expected and allows reducing the CO 2 mass flow in this sector of the power cycle. • A transport model has been developed to evaluate the permeation of tritium from the liquid metal to the secondary CO 2 . -- Abstract: One of the key issues for fusion power plant technology is the efficient, reliable and safe recovery of the power extracted by the primary coolants. An interesting design option for power conversion cycles based on Dual Coolant Breeding Blankets (DCBB) is a Printed Circuit Heat Exchanger, which is supported by the advantages of its compactness, thermal effectiveness, high temperature and pressure capability and corrosion resistance. This work presents a design analysis of a silicon carbide Printed Circuit Heat Exchanger for lead–lithium/supercritical CO 2 at DEMO ranges (4× segmentation)

An interactive system for the automatic layout of printed circuit boards (ARAIGNEE)

International Nuclear Information System (INIS)

Combet, M.; Eder, J.; Pagny, C.

1974-12-01

A software package for the automatic layout of printed circuit boards is presented. The program permits an interaction of the user during the layout process. The automatic searching of paths can be interrupted at any step and convenient corrections can be inserted. This procedure improves strongly the performance of the program as far as the number of unresolved connections is concerned

A Method for Automatic Inspection of Printed Circuit Boards by Using the Thermal Signature

International Nuclear Information System (INIS)

Amer, H.H.; Zekry, A.A.; Elaraby, S.; Ghareeb, K.E.

2012-01-01

This paper aims to design a system for automating inspection of the printed circuit boards (PCBs) by using the thermal signature of the different integrated circuits (I.C). The proposed inspection system consists of the inspection circuit, data acquisition system (DAS) and personal computer. Inspection is done by comparing the thermal signature of normally operated circuit with the thermal signature of circuit under test. One thermistor is assigned to each component in the circuit. The thermistor must touch tightly the surface of the I.C. to sense its temperature during the inspection process. Matlab software is used to represent the thermal signature through different colors. The Turbo C software is used to develop a program for acquiring and comparing the thermal signature of the circuit under the test with the reference circuit. If the colors of the two thermal signatures for the same I.C. are same then the circuit under test is fault free and does not contain any defect. On the other side, if the colors of the two thermal signatures for the same I.C. are different then the circuit under test is defective

Integration of f-MWCNT Sensor and Printed Circuits on Paper Substrate

OpenAIRE

Xie, Li; Feng, Yi; Mantysalo, Matti; Chen, Qiang; Zheng, Li-Rong

2013-01-01

The integration of sensors endows the packages with intelligence and interactivity. This paper is considered the most suitable substrate of smart packages because it is cost-effective, light, flexible, and recyclable. However, common concern exists regarding the reliability of paper-based system against bending and folding. In this paper, inkjet-printing of silver nanoparticles is used to form circuit pattern as well as interconnections for system integration on paper substrate. A humidity se...

3D printed flexible capacitive force sensor with a simple micro-controller based readout

NARCIS (Netherlands)

Schouten, Martijn G.; Sanders, Remco; Krijnen, Gijs

2017-01-01

This paper describes the development of a proof of principle of a flexible force sensor and the corresponding readout circuit. The flexible force sensor consists of a parallel plate capacitor that is 3D printed using regular and conductive thermoplastic poly-urethane (TPU). The capacitance change

Radiation evaluation method of commercial off-the-shelf (COTS) electronic printed circuit boards (PCBs)

International Nuclear Information System (INIS)

LaBel, K.A.; Gruner, T.D.; Reed, R.A.; Settles, B.; Wilmot, J.; Dougherty, L.F.; Russo, A.; Yuknis, W.; Foster, M.G.; Garrisson-Darrin, A.; Marshall, P.W.

1999-01-01

We present a radiation evaluation methodology and proton ground test results for candidate COTS PCBs (commercial off-the-shelf electronic printed circuit boards) and their associated electronics for low-altitude, low-inclination orbits. We will also discuss the implications associated with mission orbit and duration. (authors)

Natural printed silk substrate circuit fabricated via surface modification using one step thermal transfer and reduction graphene oxide

Science.gov (United States)

Cao, Jiliang; Huang, Zhan; Wang, Chaoxia

2018-05-01

Graphene conductive silk substrate is a preferred material because of its biocompatibility, flexibility and comfort. A flexible natural printed silk substrate circuit was fabricated by one step transfer of graphene oxide (GO) paste from transfer paper to the surface of silk fabric and reduction of the GO to reduced graphene oxide (RGO) using a simple hot press treatment. The GO paste was obtained through ultrasonic stirring exfoliation under low temperature, and presented excellent printing rheological properties at high concentration. The silk fabric was obtained a surface electric resistance as low as 12.15 KΩ cm-1, in the concentration of GO 50 g L-1 and hot press at 220 °C for 120 s. Though the whiteness and strength decreased with the increasing of hot press temperature and time slowly, the electric conductivity of RGO surface modification silk substrate improved obviously. The surface electric resistance of RGO/silk fabrics increased from 12.15 KΩ cm-1 to 18.05 KΩ cm-1, 28.54 KΩ cm-1 and 32.53 KΩ cm-1 after 10, 20 and 30 washing cycles, respectively. The results showed that the printed silk substrate circuit has excellent washability. This process requires no chemical reductant, and the reduction efficiency and reduction degree of GO is high. This time-effective and environmentally-friendly one step thermal transfer and reduction graphene oxide onto natural silk substrate method can be easily used to production of reduced graphene oxide (RGO) based flexible printed circuit.

Packaging printed circuit boards: A production application of interactive graphics

Science.gov (United States)

Perrill, W. A.

1975-01-01

The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

Checking a printed board

CERN Multimedia

1977-01-01

An 'Interactive Printed Circuit Board Design System' has been developed by a company in a Member-State. Printed circuits are now produced at the SB's surface treatment workshop using a digitized photo-plotter.

Optimized circuit design for flexible 8-bit RFID transponders with active layer of ink-jet printed small molecule semiconductors

NARCIS (Netherlands)

Kjellander, B.K.C.; Smaal, W.T.T.; Myny, K.; Genoe, J.; Dehaene, W.; Heremans, P.; Gelinck, G.H.

2013-01-01

We ink-jet print a blend of 6,13-bis(triisopropyl-silylethynyl)pentacene and polystyrene as the active layer for flexible circuits. The discrete ink-jet printed transistors exhibit a saturation mobility of 0.5 cm2 V -1 s-1. The relative spread in transistor characteristics can be very large. This

Contamination profile on typical printed circuit board assemblies vs soldering process

DEFF Research Database (Denmark)

Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue...... structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried...

Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment

International Nuclear Information System (INIS)

Zou, Shiwen; Li, Xiaogang; Dong, Chaofang; Ding, Kangkang; Xiao, Kui

2013-01-01

Highlights: •The electrochemical migration, whisker formation, and corrosion behavior of PCB under wet H 2 S environment were observed and studied systematically. •The process of electrochemical migration of solder joints is explained. •The corrosion mechanism of PCB interconnectors induced by micro pores under wet H 2 S environment is discussed, and the corrosion reaction model is proposed. -- Abstract: Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board (PCB) under wet H 2 S environment were analyzed by environment scanning electron microscope (ESEM), Energy dispersive X-ray spectroscopy (EDS) with mapping and element phase cluster (EPC) techniques, Raman Spectrum analysis and electrochemical impedance spectroscopy (EIS) technology. The results showed that nonuniform corrosion behavior occurred on PCB surfaces under 1 ppm wet H 2 S at 40 °C; whiskers formed on the inner sidewall of via-holes with a growth rate of 1.2 Å/s; numerous corrosion products migrated through the pore of plated gold layer, which broke off the protective layer. The corrosion rate was accelerated according to the big-cathode-small-anode model

Leaching of gold and silver from printed circuit board of mobile phones

OpenAIRE

Petter,Patrícia Melo Halmenschlager; Veit,Hugo Marcelo; Bernardes,Andréa Moura

2015-01-01

Nowadays there is a wide variety of models, sizes and configurations of mobile phones available for consumption. After the life cycle of this equipment, the recycling and reuse of the precious metals found in the printed circuit boards (PCB) of the mobile phones are principal objectives. Thus, the objective of this work was to characterize the gold and silver present in a PCB and develop a recycling route using alternative reagents for cyanide, such as sodium and ammonium thiosulfate. These r...

EMC and the printed circuit board design theory and layout made simple

CERN Document Server

Montrose, Mark I

1999-01-01

"This reference text shows how and why RF energy is created within a printed circuit board, and the manner in which propagation occurs. With thorough explanations, this book enables engineers to grasp both the fundamentals of EMC theory and signal integrity, along with the mitigation process needed to prevent an EMC event while maintaining optimal functionality for low- and high-technology products. Mr. Montrose also shows the relationship between time and frequency domains, helping one meet mandatory compliance requirements."--Jacket.

Towards Practical Application of Paper based Printed Circuits: Capillarity Effectively Enhances Conductivity of the Thermoplastic Electrically Conductive Adhesives

Science.gov (United States)

Wu, Haoyi; Chiang, Sum Wai; Lin, Wei; Yang, Cheng; Li, Zhuo; Liu, Jingping; Cui, Xiaoya; Kang, Feiyu; Wong, Ching Ping

2014-09-01

Direct printing nanoparticle-based conductive inks onto paper substrates has encountered difficulties e.g. the nanoparticles are prone to penetrate into the pores of the paper and become partially segmented, and the necessary low-temperature-sintering process is harmful to the dimension-stability of paper. Here we prototyped the paper-based circuit substrate in combination with printed thermoplastic electrically conductive adhesives (ECA), which takes the advantage of the capillarity of paper and thus both the conductivity and mechanical robustness of the printed circuitsweredrastically improved without sintering process. For instance, the electrical resistivity of the ECA specimen on a pulp paper (6 × 10-5Ω.cm, with 50 wt% loading of Ag) was only 14% of that on PET film than that on PET film. This improvement has been found directly related to the sizing degree of paper, in agreement with the effective medium approximation simulation results in this work. The thermoplastic nature also enables excellent mechanical strength of the printed ECA to resist repeated folding. Considering the generality of the process and the wide acceptance of ECA technique in the modern electronic packages, this method may find vast applications in e.g. circuit boards, capacitive touch pads, and radio frequency identification antennas, which have been prototyped in the manuscript.

The application of PS printing plate with Biimidazole photosensitive initiating systems

International Nuclear Information System (INIS)

Li Lidong; Xu Jinqi; Gao Fang; Yang Yongyuan

1999-01-01

The ultraviolet photosensitive initiating system is composed of 4,4'-bis(N,N'-dimethyl-amino)benzophenone(MK), 2-chlorohexaarylbiimidazole(o-C1-HABI) and a hydrogen donor co-initiator n-dodecyl mercaptan(SH). Under the irradiation by high pressure mercury lamp, the relationship between the photo-polymerization rate of MMA and the concentration of each component of the system, including MK, o-C1-HABI and SH, was studied. The excellent results have been obtained through studying the system's application on PS lithographic printing plate

Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

Science.gov (United States)

Ivǎnuş, R. C.; ǎnuş, D., IV; Cǎlmuc, F.

2010-06-01

Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE) contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste - PCBs) leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L). The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

Electroless Cu Plating on Anodized Al Substrate for High Power LED.

Science.gov (United States)

Rha, Sa-Kyun; Lee, Youn-Seoung

2015-03-01

Area-selective copper deposition on screen printed Ag pattern/anodized Al/Al substrate was attempted using a neutral electroless plating processes for printed circuit boards (PCBs), according to a range of variation of pH 6.5-pH 8 at 70 °C. The utilized basic electroless solution consisted of copper(II) sulfate pentahydrate, sodium phosphinate monohydrate, sodium citrate tribasic dihydrate, ammonium chloride, and nickel(II) sulfate hexahydrate. The pH of the copper plating solutions was adjusted from pH 6.5 to pH 8 using NH4OH. Using electroless plating in pH 6.5 and pH 7 baths, surface damage to the anodized Al layer hardly occurred; the structure of the plated Cu-rich films was a typical fcc-Cu, but a small Ni component was co-deposited. In electroless plating at pH 8, the surface of the anodized Al layer was damaged and the Cu film was composed of a lot of Ni and P which were co-deposited with Cu. Finally, in a pH 7 bath, we can make a selectively electroless plated Cu film on a PCB without any lithography and without surface damage to the anodized Al layer.

A FPGA implementation of solder paste deposit on printed circuit boards errors detector based in a bright and contrast algorithm

OpenAIRE

De Luca-Pennacchia, A.; Sánchez-Martínez, M. Á.

2007-01-01

Solder paste deposit on printed circuit boards (PCB) is a critical stage. It is known that about 60% of functionality defects in this type of boards are due to poor solder paste printing. These defects can be diminished by means of automatic optical inspection of this printing. Actually, this process is implemented by image processing software with its inherent high computational time cost. In this paper we propose to implement a high parallel degree image comparison algorithm suitable to be ...

Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies

DEFF Research Database (Denmark)

Rathinavelu, Umadevi; Jellesen, Morten Stendahl; Ambat, Rajan

2013-01-01

Conformal coatings are applied on printed circuit board assemblies (PCBAs) in order to protect the assembly from environmental influence and silicone-based coating is commonly used. A systematic study on the performance of silicone conformal coating in connection with process-related contaminants...

Field analysis and enhancement of multi-pole magnetic components fabricated on printed circuit board

International Nuclear Information System (INIS)

Chiu, K.-C.; Chen, C.-S.

2007-01-01

A multi-pole magnetic component magnetized with a fine magnetic pole pitch of less than 1 mm is very difficult to achieve by using traditional methods. Moreover, it requires a precise mechanical process and a complicated magnetization system. Different fine magnetic pole pitches of 300, 350 and 400 μm have been accomplished on 9-pole magnetic components through the printed circuit board (PCB) manufacturing technology. Additionally, another fine magnetic pole pitch of 500 μm was also fabricated on a dual-layered (DL) wire circuit structure to investigate the field enhancement. After measurements, a gain factor of 1.37 was obtained in the field strength. The field variations among different magnetic pole pitches were analyzed in this paper

Evaluation of the substitution of PMMA plates by PLA 3D printed in TL response of CaSO_4:Dy

International Nuclear Information System (INIS)

Almeida, Shirlane Barbosa de; Valeriano, Caio Cesar Santos; Campos, Leticia Lucente

2016-01-01

The CaSO_4:Dy is a dosimetric material that is nationally produced, which presents high sensibility but a high energy dependence of its thermoluminescent (TL) response at the photoelectric effect region. This study aims to compare the TL response of the CaSO_4:Dy when irradiated, with different energies, at the presence of 3D printed plates of polylactic acid (PLA) and polymethylmethacrylate (PMMA). Results show that the PLA has a different attenuation of the radiation, when compared to PMMA, indicating that it should be taken into account the quality of the print used on PLA plates manufacture. (author)

Hydrothermal modification and recycling of nonmetallic particles from waste print circuit boards.

Science.gov (United States)

Gao, Xuehua; Li, Qisheng; Qiu, Jun

2018-04-01

Nonmetallic particles recycled from waste print circuit boards (NPRPs) were modified by a hydrothermal treatment method and the catalysts, solvents, temperature and time were investigated, which affected the modification effect of NPRPs. The mild hydrothermal treatment method does not need high temperature, and would not cause secondary pollution. Further, the modified NPRPs were used as the raw materials for the epoxy resin and glass fibers/epoxy resin composites, which were prepared by pouring and hot-pressing method. The mechanical properties and morphology of the composites were discussed. The results showed that relative intensity of the hydroxyl bonds on the surface of NPRPs increased 58.9% after modification. The mechanical tests revealed that both flexural and impact properties of the composites can be significantly improved by adding the modified NPRPs. Particularly, the maximum increment of flexural strength, flexural modulus and impact strength of the epoxy matrix composites with 30% modified NPRPs is 40.1%, 80.0% and 79.0%, respectively. Hydrothermal treatment can modify surface of NPRPs successfully and modified NPRPs can not only improve the properties of the composites, but also reduce the production cost of the composites and environmental pollution. Thus, we develop a new way to recycle nonmetallic materials of waste print circuit boards and the highest level of waste material recycling with the raw materials-products-raw materials closed cycle can be realized through the hydrothermal modification and reuse of NPRPs. Copyright © 2018 Elsevier Ltd. All rights reserved.

SPRINT - An Interactive System for Printed Circuit Board Design User’s Guide.

Science.gov (United States)

1977-06-01

effect as decreasing the time limit - your priority and turnaround time are improved. B) You have a very large circuit and an error message says...previous segment. If no path is found, a message is printed to that effect . If HIWIRE thinks the failure may have been due to too small a value of...USAF Academy, Colorado 80840 AUL/LSE-9663 Maxwell AFB, Alabama 36112 AFETR Technical Library P.O. Box 4608, MU 5650 Patrick AFB

Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

Directory of Open Access Journals (Sweden)

Ivănuş R.C.

2010-06-01

Full Text Available Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste – PCBs leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L. The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

Effects of mould on electrochemical migration behaviour of immersion silver finished printed circuit board.

Science.gov (United States)

Yi, Pan; Xiao, Kui; Dong, Chaofang; Zou, Shiwen; Li, Xiaogang

2018-02-01

The role played by mould in the electrochemical migration (ECM) behaviour of an immersion silver finished printed circuit board (PCB-ImAg) under a direct current (DC) bias was investigated. An interesting phenomenon is found whereby mould, especially Aspergillus niger, can preferentially grow well on PCB-ImAg under electrical bias and then bridge integrated circuits and form a migration path. The cooperation of the mould and DC bias aggravates the ECM process occurring on PCB-ImAg. When the bias voltage is below 15V, ECM almost does not occur for Ag coating. Mechanisms that explain the ECM processes of PCB-ImAg in the presence of mould and DC bias are proposed. Copyright © 2017. Published by Elsevier B.V.

Avoiding short circuits from zinc metal dendrites in anode by backside-plating configuration

Science.gov (United States)

Higashi, Shougo; Lee, Seok Woo; Lee, Jang Soo; Takechi, Kensuke; Cui, Yi

2016-01-01

Portable power sources and grid-scale storage both require batteries combining high energy density and low cost. Zinc metal battery systems are attractive due to the low cost of zinc and its high charge-storage capacity. However, under repeated plating and stripping, zinc metal anodes undergo a well-known problem, zinc dendrite formation, causing internal shorting. Here we show a backside-plating configuration that enables long-term cycling of zinc metal batteries without shorting. We demonstrate 800 stable cycles of nickel–zinc batteries with good power rate (20 mA cm−2, 20 C rate for our anodes). Such a backside-plating method can be applied to not only zinc metal systems but also other metal-based electrodes suffering from internal short circuits. PMID:27263471

Search for the optimal size of printed circuit boards for mechanical structures for electronic equipment

Directory of Open Access Journals (Sweden)

Yefimenko A. A.

2014-12-01

Full Text Available The authors present a method, an algorithm and a program, designed to determine the optimal size of printed circuit boards (PCB of mechanical structures and different kinds of electronic equipment. The PCB filling factor is taken as an optimization criterion. The method allows one to quickly determine the dependence of the filling factor on the size of the PCB for various components.

Homogenization on Multi-Materials’ Elements: Application to Printed Circuit Boards and Warpage Analysis

Directory of Open Access Journals (Sweden)

Araújo Manuel

2016-01-01

Full Text Available Multi-material domains are often found in industrial applications. Modelling them can be computationally very expensive due to meshing requirements. The finite element properties comprising different materials are hardly accurate. In this work, a new homogenization method that simplifies the computation of the homogenized Young modulus, Poisson ratio and thermal expansion coefficient is proposed, and applied to composite-like material on a printed circuit board. The results show a good properties correspondence between the homogenized domain and the real geometry simulation.

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

International Nuclear Information System (INIS)

Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia

2014-01-01

Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

Energy Technology Data Exchange (ETDEWEB)

Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia, E-mail: silvia.serranti@uniroma1.it

2014-11-15

Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.

Comparative study of electromagnetic compatibility methods in printed circuit board design tools

International Nuclear Information System (INIS)

Marinova, Galia

2002-01-01

The paper considers the state-of-the art in electromagnetic compatibility (EMC) oriented printed circuit board (PCB) design. A general methodology of EMC oriented PCB design is synthesized. The main CAD tools available today are estimated and compared for their abilities to treat EMC oriented design. To help non experts a knowledge-base containing more than 50 basic rules for EMC-oriented PCB design is proposed. It can be applied in the PCB design CAD tools that possess rule-builders or it can help interactive design. Trends in this area of EMC-oriented PCB design are deduced. (Author)

Closure of the Africa-Eurasia-North America plate motion circuit and tectonics of the Gloria fault

Science.gov (United States)

Argus, Donald F.; Gordon, Richard G.; Demets, Charles; Stein, Seth

1989-01-01

The current motions of the African, Eurasian, and North American plates are examined. The problems addressed include whether there is resolvable motion of a Spitsbergen microplate, the direction of motion between the African and North American plates, whether the Gloria fault is an active transform fault, and the implications of plate circuit closures for rates of intraplate deformation. Marine geophysical data and magnetic profiles are used to construct a model which predicts about 4 mm/yr slip across the Azores-Gibraltar Ridge, and west-northwest convergence near Gibraltar. The analyzed data are consistent with a rigid plate model with the Gloria fault being a transform fault.

Laser-induced selective copper plating of polypropylene surface

Science.gov (United States)

Ratautas, K.; Gedvilas, M.; Stankevičiene, I.; JagminienÄ--, A.; Norkus, E.; Li Pira, N.; Sinopoli, S.; Emanuele, U.; Račiukaitis, G.

2016-03-01

Laser writing for selective plating of electro-conductive lines for electronics has several significant advantages, compared to conventional printed circuit board technology. Firstly, this method is faster and cheaper at the prototyping stage. Secondly, material consumption is reduced, because it works selectively. However, the biggest merit of this method is potentiality to produce moulded interconnect device, enabling to create electronics on complex 3D surfaces, thus saving space, materials and cost of production. There are two basic techniques of laser writing for selective plating on plastics: the laser-induced selective activation (LISA) and laser direct structuring (LDS). In the LISA method, pure plastics without any dopant (filler) can be used. In the LDS method, special fillers are mixed in the polymer matrix. These fillers are activated during laser writing process, and, in the next processing step, the laser modified area can be selectively plated with metals. In this work, both methods of the laser writing for the selective plating of polymers were investigated and compared. For LDS approach, new material: polypropylene with carbon-based additives was tested using picosecond and nanosecond laser pulses. Different laser processing parameters (laser pulse energy, scanning speed, the number of scans, pulse durations, wavelength and overlapping of scanned lines) were applied in order to find out the optimal regime of activation. Areal selectivity tests showed a high plating resolution. The narrowest width of a copper-plated line was less than 23 μm. Finally, our material was applied to the prototype of the electronic circuit board on a 2D surface.

Nuclear code case development of printed-circuit heat exchangers with thermal and mechanical performance testing

Energy Technology Data Exchange (ETDEWEB)

Aakre, Shaun R. [Univ. of Wisconsin, Madison, WI (United States). Dept. of Mechanical Engineering; Jentz, Ian W. [Univ. of Wisconsin, Madison, WI (United States). Dept. of Mechanical Engineering; Anderson, Mark H. [Univ. of Wisconsin, Madison, WI (United States). Dept. of Mechanical Engineering

2018-03-27

The U.S. Department of Energy has agreed to fund a three-year integrated research project to close technical gaps involved with compact heat exchangers to be used in nuclear applications. This paper introduces the goals of the project, the research institutions, and industrial partners working in collaboration to develop a draft Boiler and Pressure Vessel Code Case for this technology. Heat exchanger testing, as well as non-destructive and destructive evaluation, will be performed by researchers across the country to understand the performance of compact heat exchangers. Testing will be performed using coolants and conditions proposed for Gen IV Reactor designs. Preliminary observations of the mechanical failure mechanisms of the heat exchangers using destructive and non-destructive methods is presented. Unit-cell finite element models assembled to help predict the mechanical behavior of these high-temperature components are discussed as well. Performance testing methodology is laid out in this paper along with preliminary modeling results, an introduction to x-ray and neutron inspection techniques, and results from a recent pressurization test of a printed-circuit heat exchanger. The operational and quality assurance knowledge gained from these models and validation tests will be useful to developers of supercritical CO₂ systems, which commonly employ printed-circuit heat exchangers.

Modelling the transient analysis of flat miniature heat pipes in printed circuit boards using a control volume approacht

NARCIS (Netherlands)

Wits, W.W.; Kok, J.B.W.; van Steenhoven, A.A.; van der Meer, T.H.; Stoffels, G.G.M.

2008-01-01

The heat pipe is a two-phase cooling solution, offering very high thermal coefficients, for heat transport. Therefore, it is increasingly used in the design of electronic products. Flat miniature heat pipes are able to effectively remove heat from several hot spots on a Printed Circuit Board (PCB).

Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor.

Science.gov (United States)

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S K; McKay, Gordon

2015-01-01

Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced. Copyright © 2014 Elsevier Ltd. All rights reserved.

A laser printing based approach for printed electronics

Energy Technology Data Exchange (ETDEWEB)

Zhang, T.; Hu, M.; Guo, Q.; Zhang, W.; Yang, J., E-mail: jyang@eng.uwo.ca [Department of Mechanical and Materials Engineering, Western University, London N6A 3K7 (Canada); Liu, Y.; Lau, W. [Chengdu Green Energy and Green Manufacturing Technology R& D Center, 355 Tengfei Road, 620107 Chengdu (China); Wang, X. [Department of Mechanical and Materials Engineering, Western University, London N6A 3K7 (Canada); Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000 (China)

2016-03-07

Here we report a study of printing of electronics using an office use laser printer. The proposed method eliminates those critical disadvantages of solvent-based printing techniques by taking the advantages of electroless deposition and laser printing. The synthesized toner acts as a catalyst for the electroless copper deposition as well as an adhesion-promoting buffer layer between the substrate and deposited copper. The easy metallization of printed patterns and strong metal-substrate adhesion make it an especially effective method for massive production of flexible printed circuits. The proposed process is a high throughput, low cost, efficient, and environmentally benign method for flexible electronics manufacturing.

A laser printing based approach for printed electronics

International Nuclear Information System (INIS)

Zhang, T.; Hu, M.; Guo, Q.; Zhang, W.; Yang, J.; Liu, Y.; Lau, W.; Wang, X.

2016-01-01

Here we report a study of printing of electronics using an office use laser printer. The proposed method eliminates those critical disadvantages of solvent-based printing techniques by taking the advantages of electroless deposition and laser printing. The synthesized toner acts as a catalyst for the electroless copper deposition as well as an adhesion-promoting buffer layer between the substrate and deposited copper. The easy metallization of printed patterns and strong metal-substrate adhesion make it an especially effective method for massive production of flexible printed circuits. The proposed process is a high throughput, low cost, efficient, and environmentally benign method for flexible electronics manufacturing.

Modular integration of electronics and microfluidic systems using flexible printed circuit boards.

Science.gov (United States)

Wu, Amy; Wang, Lisen; Jensen, Erik; Mathies, Richard; Boser, Bernhard

2010-02-21

Microfluidic systems offer an attractive alternative to conventional wet chemical methods with benefits including reduced sample and reagent volumes, shorter reaction times, high-throughput, automation, and low cost. However, most present microfluidic systems rely on external means to analyze reaction products. This substantially adds to the size, complexity, and cost of the overall system. Electronic detection based on sub-millimetre size integrated circuits (ICs) has been demonstrated for a wide range of targets including nucleic and amino acids, but deployment of this technology to date has been limited due to the lack of a flexible process to integrate these chips within microfluidic devices. This paper presents a modular and inexpensive process to integrate ICs with microfluidic systems based on standard printed circuit board (PCB) technology to assemble the independently designed microfluidic and electronic components. The integrated system can accommodate multiple chips of different sizes bonded to glass or PDMS microfluidic systems. Since IC chips and flex PCB manufacturing and assembly are industry standards with low cost, the integrated system is economical for both laboratory and point-of-care settings.

3-D printed 2.4 GHz rectifying antenna for wireless power transfer applications

Science.gov (United States)

Skinner, Matthew

In this work, a 3D printed rectifying antenna that operates at the 2.4GHz WiFi band was designed and manufactured. The printed material did not have the same properties of bulk material, so the printed materials needed to be characterized. The antenna and rectifying circuit was printed out of Acrylonitrile Butadiene Styrene (ABS) filament and a conductive silver paste, with electrical components integrated into the circuit. Before printing the full rectifying antenna, each component was printed and evaluated. The printed antenna operated at the desired frequency with a return loss of -16 dBm with a bandwidth of 70MHz. The radiation pattern was measured in an anechoic chamber with good matching to the model. The rectifying circuit was designed in Ansys Circuit Simulation using Schottky diodes to enable the circuit to operate at lower input power levels. Two rectifying circuits were manufactured, one by printing the conductive traces with silver ink, and one with traces made from copper. The printed silver ink is less conductive than the bulk copper and therefore the output voltage of the printed rectifier was lower than the copper circuit. The copper circuit had an efficiency of 60% at 0dBm and the printed silver circuit had an efficiency of 28.6% at 0dBm. The antenna and rectifying circuits were then connected to each other and the performance was compared to a fully printed integrated rectifying antenna. The rectifying antennas were placed in front of a horn antenna while changing the power levels at the antenna. The efficiency of the whole system was lower than the individual components but an efficiency of 11% at 10dBm was measured.

Analysis of the treatment of plastic from electrical and electronic waste in the Republic of Serbia and the testing of the recycling potential of non-metallic fractions of printed circuit boards

Directory of Open Access Journals (Sweden)

Vučinić Aleksandra S.

2017-01-01

Full Text Available This paper presents the analysis of the quantity of plastic and waste printed circuit boards obtained after the mechanical treatment of electrical and electronic waste (E-waste in the Republic of Serbia, as well as the recycling of non-metallic fractions of waste printed circuit boards. The aim is to analyze the obtained recycled material and recommendation for possible application of recyclables. The data on the quantities and treatment of plastics and printed circuit boards obtained after the mechanical treatment of WEEE, were gained through questionnaires sent to the operators who treat this type of waste. The results of the questionnaire analysis showed that in 2014 the dismantling of E-waste isolated 1,870.95 t of plastic and 499.85 t of printed circuit boards. In the Republic of Serbia, E-waste recycling is performed exclusively by using mechanical methods. Mechanical methods consist of primary crushing and separation of the materials which have a utility value as secondary raw materials, from the components and materials that have hazardous properties. Respect to that, the recycling of printed circuit boards using some of the metallurgical processes with the aim of extracting copper, precious metals and non-metallic fraction is completely absent, and the circuit boards are exported as a whole. Given the number of printed circuit boards obtained by E-waste dismantling, and the fact that from an economic point of view, hydrometallurgical methods are very suitable technological solutions in the case of a smaller capacity, there is a possibility for establishing the facilities in the Republic of Serbia for the hydrometallurgical treatment that could be used for metals extraction, and non-metallic fractions, which also have their own value. Printed circuit boards granulate obtained after the mechanical pretreatment and the selective removal of metals by hydrometallurgical processes was used for the testing of the recycling potential

Treatment of Wastewater from Electroplating, Metal Finishing and Printed Circuit Board Manufacturing. Operation of Wastewater Treatment Plants Volume 4.

Science.gov (United States)

California State Univ., Sacramento. Dept. of Civil Engineering.

One of four manuals dealing with the operation of wastewater plants, this document was designed to address the treatment of wastewater from electroplating, metal finishing, and printed circuit board manufacturing. It emphasizes how to operate and maintain facilities which neutralize acidic and basic waters; treat waters containing metals; destroy…

Simultaneous detection of lactate and glucose by integrated printed circuit board based array sensing chip

Energy Technology Data Exchange (ETDEWEB)

Li, Xuelian [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Zang, Jianfeng [Department of Mechanical Engineering and Materials Science, Duke University, Durham, NC 27708 (United States); Liu, Yingshuai; Lu, Zhisong [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China); Li, Qing, E-mail: Qli@swu.edu.cn [School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715 (China); Li, Chang Ming, E-mail: ecmli@swu.edu.cn [Institute for Clean Energy and Advanced Materials, Southwest University, Chongqing 400715 (China)

2013-04-10

Highlights: ► An integrated printed circuit board (PCB) based array sensing chip was developed. ► Simultaneous detection of lactate and glucose in serum has been demonstrated. ► The array electronic biochip has high signal to noise ratio and high sensitivity. ► Additional electrodes were designed on the chip to correct interferences. -- Abstract: An integrated printed circuit board (PCB) based array sensing chip was developed to simultaneously detect lactate and glucose in mouse serum. The novelty of the chip relies on a concept demonstration of inexpensive high-throughput electronic biochip, a chip design for high signal to noise ratio and high sensitivity by construction of positively charged chitosan/redox polymer Polyvinylimidazole-Os (PVI-Os)/carbon nanotube (CNT) composite sensing platform, in which the positively charged chitosan/PVI-Os is mediator and electrostatically immobilizes the negatively charged enzyme, while CNTs function as an essential cross-linker to network PVI-Os and chitosan due to its negative charged nature. Additional electrodes on the chip with the same sensing layer but without enzymes were prepared to correct the interferences for high specificity. Low detection limits of 0.6 μM and 5 μM were achieved for lactate and glucose, respectively. This work could be extended to inexpensive array sensing chips with high sensitivity, good specificity and high reproducibility for various sensor applications.

SOURCES OF COPPER IONS AND SELECTED METHODS OF THEIR REMOVAL FROM WASTEWATER FROM THE PRINTED CIRCUITS BOARD PRODUCTION

Directory of Open Access Journals (Sweden)

Maciej Thomas

2014-10-01

Full Text Available This paper presents the issues related to the presence and removal of copper compounds from industrial effluents with including wastewater from plants involved in the production of printed circuit boards. Characterized the toxicological properties of selected copper compounds, described the applicable technological processes, sources of copper ions in the effluents and selected methods for their removal.

Nondestructive diagnosis of multilayer electronic plates

International Nuclear Information System (INIS)

Matvienko, A.N.; Savin, D.O.; Yas'ko, A.V.

1992-01-01

Methods of non-destructive tomographic investigation into multilayer printed plates using x radiation are described. Mathematic problem setting is given, experimental facility and methods for source data ecquisition are described. A special attention is paid to the consideration of the main factors differing the actual problem setting from the idealized one. Methods for accounting and correction of these factors are described. The efficiency of the approach proposed is demonstrated using the actual problems of reducing separate layers of multilayer printed plate metallization. The method developed is useful when exersizing control over multilayer printed plate production

Pseudoisochromatic test plate colour representation dependence on printing technology

International Nuclear Information System (INIS)

Luse, K; Ozolinsh, M; Fomins, S

2012-01-01

The aim of the study is to determine best printing technology for creation of colour vision deficiency tests. Valid tests for protanopia and deuteranopia were created from perceived colour matching experiments from printed colour samples by colour deficient individuals. Calibrated EpsonStylus Pro 7800 printer for ink prints and Noritsu HD 3701 digital printer for photographic prints were used. Multispectral imagery (by tunable liquid crystal filters system CRI Nuance Vis 07) data analysis show that in case of ink prints, the measured pixel colour coordinate dispersion (in the CIExy colour diagram) of similar colour arrays is smaller than in case of photographic printing. The print quality in terms of colour coordinate dispersion for printing methods used is much higher than in case of commercially available colour vision deficiency tests.

Printing and Curing of Conductive Ink Track on Fabric using Syringe Deposition System with DLP Projector and Hot Plate

Directory of Open Access Journals (Sweden)

Khirotdin Rd. Khairilhijra

2017-01-01

Full Text Available Printing is a technique to transfer ink onto substrates to create pattern and syringe deposition system has shown some great potential in printing due to its ability to produce filamentary bead tracks which is important concerning conductivity and easily adopted on conformal surfaces which could not be realized by conventional technique. Fabrics with integrated electrical features able to create intelligent articles and may potentially open up new perspective areas of application in textile printing. However, the applicability of this technique on fabrics remains unknown which the ink used has to meet certain requirements including high electrical conductivity, resistance to oxidation, dry out without clogging, good adhesion with suitable viscosity and surface tension. Thus, there is a need to do this study which is to determine the feasibility of syringe deposition system to print a conductive ink tracks using silver epoxy-based conductive ink on fabric substrate via lycra material. This study is also aim to investigate the feasibility of using DLP projector with hot plate as another source of heat to be used in curing the ink tracks on fabric. The effect of printing and curing parameters to the characteristics and conductivity of the ink track is investigated. Several mechanical and electrical tests were also administered to determine the cure, hardness, adhesion and resistance level of the ink tracks. The results obtained were as expected which higher printing speed and lower deposition height used, a narrower and thinner ink tracks were produced. Sample with 4 mm/s of printing speed and deposition height of 1 mm resulted in dimension closer to the targeted dimension. The longer curing time and higher temperature used, a lower resistance is produced. The lowest resistance achieved is 0.9 Ω cured at 150°C for 60 minutes. The conductivity of the ink track was affected by curing process and cross-sectional area of the ink track. It is proven

Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

DEFF Research Database (Denmark)

Conseil, Helene; Jellesen, Morten Stendahl; Ambat, Rajan

2014-01-01

Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition......, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined...

Recovery of high purity precious metals from printed circuit boards

International Nuclear Information System (INIS)

Park, Young Jun; Fray, Derek J.

2009-01-01

Waste printed circuit boards (WPCB) have an inherent value because of the precious metal content. For an effective recycling of WPCB, it is essential to recover the precious metals. This paper reports a promising method to recover the precious metals. Aqua regia was used as a leachant and the ratio between metals and leachant was fixed at 1/20 (g/ml). Silver is relatively stable so the amount of about 98 wt.% of the input was recovered without an additional treatment. Palladium formed a red precipitate during dissolution, which were consisted of Pd(NH 4 ) 2 Cl 6 . The amount precipitated was 93 wt.% of the input palladium. A liquid-liquid extraction with toluene was used to extract gold selectively. Also, dodecanethiol and sodium borohydride solution were added to make gold nanoparticles. Gold of about 97 wt.% of the input was recovered as nanoparticles which was identified with a high-resolution transmission electron microscopy through selected area electron diffraction and nearest-neighbor lattice spacing.

Scalable printed electronics: an organic decoder addressing ferroelectric non-volatile memory

Science.gov (United States)

Ng, Tse Nga; Schwartz, David E.; Lavery, Leah L.; Whiting, Gregory L.; Russo, Beverly; Krusor, Brent; Veres, Janos; Bröms, Per; Herlogsson, Lars; Alam, Naveed; Hagel, Olle; Nilsson, Jakob; Karlsson, Christer

2012-01-01

Scalable circuits of organic logic and memory are realized using all-additive printing processes. A 3-bit organic complementary decoder is fabricated and used to read and write non-volatile, rewritable ferroelectric memory. The decoder-memory array is patterned by inkjet and gravure printing on flexible plastics. Simulation models for the organic transistors are developed, enabling circuit designs tolerant of the variations in printed devices. We explain the key design rules in fabrication of complex printed circuits and elucidate the performance requirements of materials and devices for reliable organic digital logic. PMID:22900143

Comparative Study of Crosstalk Reduction Techniques in RF Printed Circuit Board Using FDTD Method

Directory of Open Access Journals (Sweden)

Rajeswari Packianathan

2015-01-01

Full Text Available Miniaturization of the feature size in modern electronic circuits results from placing interconnections in close proximity with a high packing density. As a result, coupling between the adjacent lines has increased significantly, causing crosstalk to become an important concern in high-performance circuit design. In certain applications, microstriplines may be used in printed circuit boards for propagating high-speed signals, rather than striplines. Here, the electromagnetic coupling effects are analyzed for various microstrip transmission line structures, namely, microstriplines with a guard trace, double stub microstriplines, and parallel serpentine microstriplines using the finite-difference time-domain method. The numerical results are compared with simulation results, where the variants are simulated using an Ansoft high-frequency structure simulator. The analysis and simulation results are experimentally validated by fabricating a prototype and establishing a good correspondence between them. Numerical results are compared with simulation and experimental results, showing that double stub microstriplines reduce the far end crosstalk by 7 dB and increase the near end crosstalk by about 2 dB compared with the parallel microstriplines. Parallel serpentine microstriplines reduce the far end crosstalk by more than 10 dB and also reduce more than 15 mV of peak far end crosstalk voltage, compared with parallel microstriplines.

Evaluation of gold and silver leaching from printed circuit board of cellphones

Energy Technology Data Exchange (ETDEWEB)

Petter, P.M.H., E-mail: patymhp@yahoo.com.br; Veit, H.M.; Bernardes, A.M.

2014-02-15

Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na{sub 2}S{sub 2}O{sub 3} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO{sub 3}were made. The leaching of Au and Ag with alternative reagents: Na{sub 2}S{sub 2}O{sub 3,} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} in 0.1 M concentration with the addition of CuSO{sub 4}, NH{sub 4}OH, and H{sub 2}O{sub 2}, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO{sub 4} was added.

Evaluation of gold and silver leaching from printed circuit board of cellphones

International Nuclear Information System (INIS)

Petter, P.M.H.; Veit, H.M.; Bernardes, A.M.

2014-01-01

Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na 2 S 2 O 3 and (NH 4 ) 2 S 2 O 3 to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO 3 were made. The leaching of Au and Ag with alternative reagents: Na 2 S 2 O 3, and (NH 4 ) 2 S 2 O 3 in 0.1 M concentration with the addition of CuSO 4 , NH 4 OH, and H 2 O 2 , was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO 4 was added

Introduction to printed electronics

CERN Document Server

Suganuma, Katsuaki

2014-01-01

This book describes in detail modern technologies for printed electronics, explaining how nanotechnology and modern printing technology are merging to revolutionize electronics fabrication of thin, lightweight, large, and inexpensive products. Readers will benefit from the explanations of materials, devices and circuits used to design and implement the latest applications of printed electronics, such as thin flexible OLED displays, organic solar cells, OLED lighting, smart wallpaper, sensors, logic, memory and more.

Engraving Print Classification

International Nuclear Information System (INIS)

Hoelck, Daniel; Barbe, Joaquim

2008-01-01

A print is a mark, or drawing, made in or upon a plate, stone, woodblock or other material which is cover with ink and then is press usually into a paper reproducing the image on the paper. Engraving prints usually are image composed of a group of binary lines, specially those are made with relief and intaglio techniques. Varying the number and the orientation of lines, the drawing of the engraving print is conformed. For this reason we propose an application based on image processing methods to classify engraving prints

Performance Evaluation of a Printed Circuit Steam Generator for Integral Reactors: A Feasibility Test

Energy Technology Data Exchange (ETDEWEB)

Han, Hun Sik; Kang, Han-Ok; Yoon, Juhyeon; Kim, Young In; Kim, Keung Koo [KAERI, Daejeon (Korea, Republic of); Seo, Jang-won; Choi, Brain [Alfa Laval Korea Ltd., Daejeon (Korea, Republic of)

2015-05-15

SMART (System-integrated Modular Advanced ReacTor) is a small-sized integral type pressurized water reactor. It adopts advanced design features such as structural safety improvement, system simplification, and component modularization to achieve highly enhanced safety and improved economics. The design issues related to further safety enhancement and cost reduction have received significant attention to increase its competitiveness in the global small reactor market. For the cost reduction, it is important to design the reactor vessel as small as possible. Thus, it is necessary to reduce the volume of main components such as a steam generator. Its manufacturing processes of the chemical etching and diffusion bonding provide high effectiveness, high compactness, and inherent structural safety under high temperatures and high pressures. Thus, it is expected to be an alternative to the conventional shell and tube type steam generator in SMART. In this paper, simple thermal-hydraulic performance measurement of a small-scale printed circuit steam generator (PCSG) is conducted to investigate the feasibility of applying it to SMART. The simple thermal-hydraulic performance of the PCSG has been experimentally evaluated. A small-scale PCHE is employed to investigate the feasibility of operating it as a steam generator. The performance assessment reveals that the PCSG stably produces superheated steam, and the increased degree of superheat is obtained at lower water flow rate. However, the flow instability is increased with the decrease of the water flow rate. Thus, it is required to apply the orifice design into the cold side plate to suppress the density-wave oscillations. The pressure drops and heat transfer rates increase with the water flow rate.

Making PMT halftone prints

Energy Technology Data Exchange (ETDEWEB)

Corey, J.D.

1977-05-01

In the printing process for technical reports presently used at Bendix Kansas City Division, photographs are reproduced by pasting up PMT halftone prints on the artwork originals. These originals are used to make positive-working plastic plates for offset lithography. Instructions for making good-quality halftone prints using Eastman Kodak's PMT materials and processes are given in this report. 14 figures.

New technology for recovering residual metals from nonmetallic fractions of waste printed circuit boards.

Science.gov (United States)

Zhang, Guangwen; He, Yaqun; Wang, Haifeng; Zhang, Tao; Wang, Shuai; Yang, Xing; Xia, Wencheng

2017-06-01

Recycling of waste printed circuit boards is important for environmental protection and sustainable resource utilization. Corona electrostatic separation has been widely used to recycle metals from waste printed circuit boards, but it has poor separation efficiency for finer sized fractions. In this study, a new process of vibrated gas-solid fluidized bed was used to recycle residual metals from nonmetallic fractions, which were treated using the corona electrostatic separation technology. The effects of three main parameters, i.e., vibration frequency, superficial air flow velocity, and fluidizing time on gravity segregation, were investigated using a vibrating gas-solid fluidized bed. Each size fraction had its own optimum parameters. Corresponding to their optimal segregation performance, the products from each experiment were analyzed using an X-ray fluorescence (XRF) and a scanning electron microscope (SEM) equipped with an energy dispersive spectrometer (EDS). From the results, it can be seen that the metal recoveries of -1+0.5mm, -0.5+0.25mm, and -0.25mm size fractions were 86.39%, 82.22% and 76.63%, respectively. After separation, each metal content in the -1+0.5 or -0.5+0.25mm size fraction reduced to 1% or less, while the Fe and Cu contents are up to 2.57% and 1.50%, respectively, in the -0.25mm size fraction. Images of the nonmetallic fractions with a size of -0.25mm indicated that a considerable amount of clavate glass fibers existed in these nonmetallic fractions, which may explain why fine particles had the poorest segregation performance. Copyright © 2017 Elsevier Ltd. All rights reserved.

Reconciling the geological history of western Turkey with plate circuits and mantle tomography

Science.gov (United States)

Kaymakci, N.; van Hinsbergen, D. J.; Spakman, W.; Torsvik, T. H.

2010-12-01

We place the geological history since Cretaceous times in western Turkey in a context of convergence, subduction, collision and slab break-off. To this end, we compare the west Anatolian geological history with amounts of Africa-Europe convergence calculated from the Atlantic plate circuit, and the seismic tomography images of the west Anatolian mantle structure. Western Turkish geology reflects the convergence between the Sakarya continent (here treated as Eurasia) in the north and Africa in the south, with the Anatolide-Tauride Block (ATB) between two strands of the Neotethyan ocean. Convergence between the Sakarya and the ATB started at least ~95-90Myr ago, marked by ages of metamorphic soles of ophiolites that form the highest structural unit below Sakarya. These are underlain by high-pressure, low-temperature metamorphic rocks of the Tavsanli and Afyon zones, and the Ören Unit, which in turn are underlain by the Menderes Massif derived from the ATB. Underthrusting of the ATB below Sakarya was since ~50Ma, associated with high-temperature metamorphism and widespread granitic magmatism. Thrusting in the Menderes Massif continued until 35 Ma, after which there is no record of accretion in western Turkey. Plate circuits show that since 90 Ma, ~1400 km of Africa-Europe convergence occurred, of which ~700 km since 50 Ma and ~450 km since 35Ma. Seismic tomography shows that the African slab under western Turkey is decoupled from the African Plate. This detached slab is a single, coherent body, representing the lithosphere consumed since 90 Ma. There was no subduction re-initiation after slab break-off. ATB collision with Europe therefore did not immediately lead to slab break-off but instead to delamination of subducting lithospheric mantle from accreting ATB crust, while staying attached to the African Plate. This led to asthenospheric inflow below the ATB crust, high-temperature metamorphism and felsic magmatism. Slab break-off in western Turkey probably occurred

A wearable tracking device inkjet-printed on textile

KAUST Repository

Krykpayev, Bauyrzhan

2017-05-20

Despite the abundance of localization applications, the tracking devices have never been truly realized in E-textiles. Standard printed circuit board (PCB)-based devices are obtrusive and rigid and hence not suitable for textile based implementations. An attractive option would be direct printing of circuit layout on the textile itself, negating the use of rigid PCB materials. However, high surface roughness and porosity of textiles prevents efficient and reliable printing of electronics on textile. In this work, by printing an interface layer on the textile first, a complete localization circuit integrated with an antenna has been inkjet-printed on the textile for the first time. Printed conductive traces were optimized in terms of conductivity and resolution by controlling the number of over-printed layers. The tracking device determines the wearer\\'s position using WiFi and this information can be displayed on any internet-enabled device, such as smart phone. The device is compact (55mm×45mm) and lightweight (22g with 500mAh battery) for people to comfortably wear it and can be easily concealed in case discretion is required. The device operates at 2.4GHz communicated up to a distance of 55m, with localization accuracy of up to 8m.

The circuit designer's companion

CERN Document Server

Williams, Tim

1991-01-01

The Circuit Designer's Companion covers the theoretical aspects and practices in analogue and digital circuit design. Electronic circuit design involves designing a circuit that will fulfill its specified function and designing the same circuit so that every production model of it will fulfill its specified function, and no other undesired and unspecified function.This book is composed of nine chapters and starts with a review of the concept of grounding, wiring, and printed circuits. The subsequent chapters deal with the passive and active components of circuitry design. These topics are foll

Removing lead from metallic mixture of waste printed circuit boards by vacuum distillation: factorial design and removal mechanism.

Science.gov (United States)

Li, Xingang; Gao, Yujie; Ding, Hui

2013-10-01

The lead removal from the metallic mixture of waste printed circuit boards by vacuum distillation was optimized using experimental design, and a mathematical model was established to elucidate the removal mechanism. The variables studied in lead evaporation consisted of the chamber pressure, heating temperature, heating time, particle size and initial mass. The low-level chamber pressure was fixed at 0.1 Pa as the operation pressure. The application of two-level factorial design generated a first-order polynomial that agreed well with the data for evaporation efficiency of lead. The heating temperature and heating time exhibited significant effects on the efficiency, which was validated by means of the copper-lead mixture experiments. The optimized operating conditions within the region studied were the chamber pressure of 0.1 Pa, heating temperature of 1023 K and heating time of 120 min. After the conditions were employed to remove lead from the metallic mixture of waste printed circuit boards, the efficiency was 99.97%. The mechanism of the effects was elucidated by mathematical modeling that deals with evaporation, mass transfer and condensation, and can be applied to a wider range of metal removal by vacuum distillation. Copyright © 2013 Elsevier Ltd. All rights reserved.

Thermo-hydraulic Analysis of a Water-cooled Printed Circuit Heat Exchanger in a Small-scale Nitrogen Loop

International Nuclear Information System (INIS)

Kim, Chan Soo; Hong, Sung Deok; Kim, Min Hwan; Shim, Jaesool; Lee, Gyung Dong

2013-01-01

The development of high-temperature heat exchangers is very important because of its higher operation temperature and pressure than those of common light water reactors and industrial process plants. In particular, the intermediate heat exchanger is a key-challenged high temperature component in a Very High Temperature gas-cooled Reactor (VHTR). A printed circuit heat exchanger is one of the candidates for an intermediate heat exchanger in a VHTR. The printed circuit heat exchanger (PCHE) was developed and commercialized by HEATRIC. The compactness is better than any other heat exchanger types, because its core matrices are fabricated by diffusion bonding with photo-chemically etched micro-channels. Various tests and analysis have been performed to verify the performance of PCHE. The thermal stress analysis of the high temperature PCHE is necessary to endure the extremely operation condition of IHX. In this study, the thermo-hydraulic analysis for the laboratory-scale PCHE is performed to provide the input data for the boundary conditions of a structural analysis. The results from the first-principal calculation are compared with those from computational fluid dynamics code analysis. COMSOL 4.3a analysis is successfully performed at the uniform pressure drop condition in a set of flow channel stacks. The heat-exchanged region concentrated to the nitrogen inlet cause the uniform mass velocity distribution in the channels, therefore there is little difference between two analytical results

Active materials by four-dimension printing

Science.gov (United States)

Ge, Qi; Qi, H. Jerry; Dunn, Martin L.

2013-09-01

We advance a paradigm of printed active composite materials realized by directly printing glassy shape memory polymer fibers in an elastomeric matrix. We imbue the active composites with intelligence via a programmed lamina and laminate architecture and a subsequent thermomechanical training process. The initial configuration is created by three-dimension (3D) printing, and then the programmed action of the shape memory fibers creates time dependence of the configuration—the four-dimension (4D) aspect. We design and print laminates in thin plate form that can be thermomechanically programmed to assume complex three-dimensional configurations including bent, coiled, and twisted strips, folded shapes, and complex contoured shapes with nonuniform, spatially varying curvature. The original flat plate shape can be recovered by heating the material again. We also show how the printed active composites can be directly integrated with other printed functionalities to create devices; here we demonstrate this by creating a structure that can assemble itself.

Exhaust constituent emission factors of printed circuit board pyrolysis processes and its exhaust control

Energy Technology Data Exchange (ETDEWEB)

Chiang, Hung-Lung, E-mail: hlchiang@mail.cmu.edu.tw [Department of Health Risk Management, China Medical University, Taichung, Taiwan (China); Lin, Kuo-Hsiung [Department of Environmental Engineering and Science, Fooyin University, Kaohsiung, Taiwan (China)

2014-01-15

Highlights: • Recycling of waste printed circuit boards is an important issue. • Pyrolysis is an emerging technology for PCB treatment. • Emission factors of VOCs are determined for PCB pyrolysis exhaust. • Iron-Al{sub 2}O{sub 3} catalyst was employed for the exhaust control. -- Abstract: The printed circuit board (PCB) is an important part of electrical and electronic equipment, and its disposal and the recovery of useful materials from waste PCBs (WPCBs) are key issues for waste electrical and electronic equipment. Waste PCB compositions and their pyrolysis characteristics were analyzed in this study. In addition, the volatile organic compound (VOC) exhaust was controlled by an iron-impregnated alumina oxide catalyst. Results indicated that carbon and oxygen were the dominant components (hundreds mg/g) of the raw materials, and other elements such as nitrogen, bromine, and copper were several decades mg/g. Exhaust constituents of CO, H{sub 2}, CH{sub 4}, CO{sub 2}, and NOx, were 60–115, 0.4–4.0, 1.1–10, 30–95, and 0–0.7 mg/g, corresponding to temperatures ranging from 200 to 500 °C. When the pyrolysis temperature was lower than 300 °C, aromatics and paraffins were the major species, contributing 90% of ozone precursor VOCs, and an increase in the pyrolysis temperature corresponded to a decrease in the fraction of aromatic emission factors. Methanol, ethylacetate, acetone, dichloromethane, tetrachloromethane and acrylonitrile were the main species of oxygenated and chlorinated VOCs. The emission factors of some brominated compounds, i.e., bromoform, bromophenol, and dibromophenol, were higher at temperatures over 400 °C. When VOC exhaust was flowed through the bed of Fe-impregnated Al{sub 2}O{sub 3}, the emission of ozone precursor VOCs could be reduced by 70–80%.

Pencil-on-Paper Capacitors for Hand-Drawn RC Circuits and Capacitive Sensing

Directory of Open Access Journals (Sweden)

Jonathan E. Thompson

2017-01-01

Full Text Available Electronic capacitors were constructed via hand-printing on paper using pencil graphite. Graphite traces were used to draw conductive connections and capacitor plates on opposing sides of a sheet of standard notebook paper. The paper served as the dielectric separating the plates. Capacitance of the devices was generally < 1000 pF and scaled with surface area of the plate electrodes. By combining a pencil-drawn capacitor with an additional resistive pencil trace, an RC low-pass filter was demonstrated. Further utility of the pencil-on-paper devices was demonstrated through description of a capacitive force transducer and reversible chemical sensing. The latter was achieved for water vapor when the hygroscopic cellulose matrix of the paper capacitor’s dielectric adsorbed water. The construction and demonstration of pencil-on-paper capacitive elements broadens the scope of paper-based electronic circuits while allowing new opportunities in the rapidly expanding field of paper-based sensors.

A microelectromechanical accelerometer fabricated using printed circuit processing techniques

Science.gov (United States)

Rogers, J. E.; Ramadoss, R.; Ozmun, P. M.; Dean, R. N.

2008-01-01

A microelectromechanical systems (MEMS) capacitive-type accelerometer fabricated using printed circuit processing techniques is presented. A Kapton polymide film is used as the structural layer for fabricating the MEMS accelerometer. The accelerometer proof mass along with four suspension beams is defined in the Kapton polyimide film. The proof mass is suspended above a Teflon substrate using a spacer. The deflection of the proof mass is detected using a pair of capacitive sensing electrodes. The top electrode of the accelerometer is defined on the top surface of the Kapton film. The bottom electrode is defined in the metallization on the Teflon substrate. The initial gap height is determined by the distance between the bottom electrode and the Kapton film. For an applied external acceleration (normal to the proof mass), the proof mass deflects toward or away from the fixed bottom electrode due to inertial force. This deflection causes either a decrease or increase in the air-gap height thereby either increasing or decreasing the capacitance between the top and the bottom electrodes. An example PCB MEMS accelerometer with a square proof mass of membrane area 6.4 mm × 6.4 mm is reported. The measured resonant frequency is 375 Hz and the Q-factor in air is 0.52.

A microelectromechanical accelerometer fabricated using printed circuit processing techniques

International Nuclear Information System (INIS)

Rogers, J E; Ramadoss, R; Ozmun, P M; Dean, R N

2008-01-01

A microelectromechanical systems (MEMS) capacitive-type accelerometer fabricated using printed circuit processing techniques is presented. A Kapton polymide film is used as the structural layer for fabricating the MEMS accelerometer. The accelerometer proof mass along with four suspension beams is defined in the Kapton polyimide film. The proof mass is suspended above a Teflon substrate using a spacer. The deflection of the proof mass is detected using a pair of capacitive sensing electrodes. The top electrode of the accelerometer is defined on the top surface of the Kapton film. The bottom electrode is defined in the metallization on the Teflon substrate. The initial gap height is determined by the distance between the bottom electrode and the Kapton film. For an applied external acceleration (normal to the proof mass), the proof mass deflects toward or away from the fixed bottom electrode due to inertial force. This deflection causes either a decrease or increase in the air-gap height thereby either increasing or decreasing the capacitance between the top and the bottom electrodes. An example PCB MEMS accelerometer with a square proof mass of membrane area 6.4 mm × 6.4 mm is reported. The measured resonant frequency is 375 Hz and the Q-factor in air is 0.52

A miniature rigid/flex salinity measurement device fabricated using printed circuit processing techniques

International Nuclear Information System (INIS)

Broadbent, H A; Ketterl, T P; Reid, C S

2010-01-01

The design, fabrication and initial performance of a single substrate, miniature, low-cost conductivity, temperature, depth (CTD) sensor board with interconnects are presented. In combination these sensors measure ocean salinity. The miniature CTD device board was designed and fabricated as the main component of a 50 mm × 25 mm × 25 mm animal-attached biologger. The board was fabricated using printed circuit processes and consists of two distinct regions on a continuous single liquid crystal polymer substrate: an 18 mm × 28 mm rigid multi-metal sensor section and a 72 mm long flexible interconnect section. The 95% confidence intervals for the conductivity, temperature and pressure sensors were demonstrated to be ±0.083 mS cm −1 , 0.01 °C, and ±0.135 dbar, respectively.

A large-area glass-resistive plate chamber with multistrip readout

CERN Document Server

Petrovici, M; Hildenbrand, K D; Augustinski, G; Ciobanu, M; Cruceru, I; Duma, M; Hartmann, O; Koczón, P; Kress, T; Marquardt, M; Moisa, D; Petris, M; Schröder, C; Simion, V; Stoicea, G; Weinert, J

2002-01-01

A completely new configuration of a glass resistive-plate chamber (GRPC) was built and tested. It consists of a double two-gap structure of electrodes with an active area of about 400 cm sup 2 and is read out via a central multistrip printed circuit board. In measurements with a sup 6 sup 0 Co source and p, d particles of 1.5 A GeV time resolutions better than 80 ps, position resolution along the strips of 5-6 mm and efficiencies larger than 95% were obtained using available fast standard electronics. These results open the possibility of constructing compact TOF detectors of high resolution and high granularity.

3D Printing of Ball Grid Arrays

Science.gov (United States)

Sinha, Shayandev; Hines, Daniel; Dasgupta, Abhijit; Das, Siddhartha

Ball grid arrays (BGA) are interconnects between an integrated circuit (IC) and a printed circuit board (PCB), that are used for surface mounting electronic components. Typically, lead free alloys are used to make solder balls which, after a reflow process, establish a mechanical and electrical connection between the IC and the PCB. High temperature processing is required for most of these alloys leading to thermal shock causing damage to ICs. For producing flexible circuits on a polymer substrate, there is a requirement for low temperature processing capabilities (around 150 C) and for reducing strain from mechanical stresses. Additive manufacturing techniques can provide an alternative methodology for fabricating BGAs as a direct replacement for standard solder bumped BGAs. We have developed aerosol jet (AJ) printing methods to fabricate a polymer bumped BGA. As a demonstration of the process developed, a daisy chain test chip was polymer bumped using an AJ printed ultra violet (UV) curable polymer ink that was then coated with an AJ printed silver nanoparticle laden ink as a conducting layer printed over the polymer bump. The structure for the balls were achieved by printing the polymer ink using a specific toolpath coupled with in-situ UV curing of the polymer which provided good control over the shape, resulting in well-formed spherical bumps on the order of 200 um wide by 200 um tall for this initial demonstration. A detailed discussion of the AJ printing method and results from accelerated life-time testing will be presented

Computational algorithms for analysis of data from thin-film thermoresistors on a radio-electronic printed circuit board

International Nuclear Information System (INIS)

Korneeva, Anna; Shaydurov, Vladimir

2016-01-01

In the paper, the data analysis is considered for thin-film thermoresistors coated on to a radio-electronic printed circuit board to determine possible zones of its overheating. A mathematical model consists in an underdetermined system of linear algebraic equations with an infinite set of solutions. For computing a more real solution, two additional conditions are used: the smoothness of a solution and the positiveness of an increase of temperature during overheating. Computational experiments demonstrate that an overheating zone is determined exactly with a tolerable accuracy of temperature in it.

PHYSICAL CHEMISTRY CHARACTERIZATION OF PRINTED CIRCUIT BOARD OF MOBILE PHONES

Directory of Open Access Journals (Sweden)

Hellington Bastos da Silva de Sant’ana

2015-07-01

Full Text Available Nowadays, electronics industry is the leading sector in developing new technologies. These new technologies lead to cheaper products increasing the consumption. The lifetime of such products is relatively short and soon it becomes waste, known as electronic waste. Cell phone is a common electronic waste. This waste represents an interesting raw material, because it contains large amount of base metals, considerable amount of valuable metals and also those dangerous. In this work, the electronic waste was submitted to mechanical processing: initially the devices were separated into two categories, as year of release (2002 and disassembled manually. The printed circuit boards were milled below 1 mm and then submitted to density and magnetic separation processes. The fractions obtained during the mechanical processing were characterized by chemical analysis. Using mechanical processing it was possible to obtain metal fractions of 80 wt%. A leaching test was carried out to determine if a waste needs to be managed as a hazardous; so that, cell phone waste must be considered in the category of hazardous residue because the lead concentration was above the limit established by Brazilian Standards

Gravure-Offset Printed Metallization of Multi-Crystalline Silicon Solar Cells with Low Metal-Line Width for Mass Production.

Science.gov (United States)

Lee, Jonghwan; Jeong, Chaehwan

2016-05-01

The gravure offset method has been developed toward an industrially viable printing technique for electronic circuitry. In this paper, a roller type gravure offset manufacturing process was developed to fabricate fine line for using front electrode for solar cells. In order to obtain the optimum metallization printing lines, thickness of 20 μm which is narrow line is required. The main targets are the reduction of metallized area to reduce the shading loss, and a high conductivity to transport the current as loss free as possible out of the cell. However, it is well known that there is a poor contact resistance between the front Ag electrode and the n(+) emitter. Nickel plating was conducted to prevent the increase of contact resistance and the increase of fill factor (FF). The performance of n-Si/Ag (seed layer)/Ni solar cells were observed in 609 mV of open circuit voltage, 35.54 mA/cm2 of short circuit current density, 75.75% of fill factor, and 16.04% of conversion efficiency.

[Application of three-dimensional printing in the operation of distal tibia fracture involving epiphyseal plate injury for teenagers].

Science.gov (United States)

Zhao, Jingxin; Ma, Yachang; Han, Dong; Jin, Yu

2017-10-01

To investigate the application value of three-dimensional (3-D) printing technology in the operation of distal tibia fracture involving epiphyseal plate injury for teenagers. The retrospective analysis was conducted on the clinical data of 16 cases of children patients with distal tibia fracture involving epiphyseal plate injury undergoing the operation by using of 3-D printing technology between January 2014 and December 2015. There were 12 males and 4 females with an age of 9-14 years (mean, 12.8 years). The causes of injury included traffic accident injury in 9 cases, heavy pound injury in 3 cases, and sport injury in 4 cases. The time from injury to operation was 3-92 hours (mean, 25.8 hours). According to Salter-Harris typing standard, the typing for epiphyseal injury was classified as type Ⅱ in 11 cases, type Ⅲ in 4 cases, and type Ⅳ in 1 case. The thin slice CT scan on the affected limb was performed before operation, and the Mimics14.0 medical software was applied for the design and the 1∶1 fracture model was printed by the 3-D printer; the stimulation of operative reduction was made in the fracture model, and bone plate, Kirschner wire, and hollow screw with the appropriate size were chosen, then the complete operative approach and method were designed and the internal fixator regimen was chosen, then the practical operation was performed based on the preoperative design regimen. The operation time was 40-68 minutes (mean, 59.1 minutes); the intraoperative blood loss was 5-102 mL (mean, 35 mL); the intraoperative fluoroscopy times was 2-6 times (mean, 2.8 times). All the patiens were followed up 12-24 months (mean, 15 months). The fracture of 15 cases reached anatomic reduction, and 1 cases had no anatomic reduction with the displaced end less than 1 mm. All the fractures reached bony union with the healing time of 2-4 months (mean, 2.6 months). There was no deep vein thrombosis, premature epiphyseal closure and oblique, or uneven ankle surface

High-Temperature Test of 800HT Printed Circuit Heat Exchanger in HELP

International Nuclear Information System (INIS)

Kim, Chan Soo; Hong, Sung-Deok; Kim, Min Hwan; Shim, Jaesool

2014-01-01

Korea Atomic Energy Research Institute has developed high-temperature Printed Circuit Heat Exchangers (PCHE) for a Very High Temperature gas-cooled Reactor and operated a very high temperature Helium Experimental LooP (HELP) to verify the performance of the high temperature heat exchanger at the component level environment. PCHE is one of the candidates for the intermediate heat exchanger in a VHTR, because its design temperature and pressure are larger than any other compact heat exchanger types. High temperature PCHEs in HELP consist of an alloy617 PCHE and an 800HT PCHE. This study presents the high temperature test of an 800HT PCHE in HELP. The experimental data include the pressure drops, the overall heat transfer coefficients, and the surface temperature distributions under various operating conditions. The experimental data are compared with the thermo-hydraulic analysis from COMSOL. In addition, the single channel tests are performed to quantify the friction factor under normal nitrogen and helium inlet conditions. (author)

3D printing utility for surgical treatment of acetabular fractures.

Science.gov (United States)

Chana Rodríguez, F; Pérez Mañanes, R; Narbona Cárceles, F J; Gil Martínez, P

2018-05-25

Preoperative 3D modelling enables more effective diagnosis and simulates the surgical procedure. We report twenty cases of acetabular fractures with preoperative planning performed by pre-contouring synthesis plates on a 3D printed mould obtained from a computarized tomography (CT) scan. The mould impression was made with the DaVinci 1.0 printer model (XYZ Printing). After obtaining the printed hemipelvis, we proceeded to select the implant size (pelvic Matta system, Stryker ® ) that matched the characteristics of the fracture and the approach to be used. Printing the moulds took a mean of 385minutes (322-539), and 238grams of plastic were used to print the model (180-410). In all cases, anatomic reduction was obtained and intra-operative changes were not required in the initial contouring of the plates. The time needed to perform the full osteosynthesis, once the fracture had been reduced was 16.9minutes (10-24). In one case fixed with two plates, a postoperative CT scan showed partial contact of the implant with the surface of the quadrilateral plate. In the remaining cases, the contact was complete. In conclusion, our results suggest that the use of preoperative planning, by printing 3D mirror imaging models of the opposite hemipelvis and pre-contouring plates over the mould, might effectively achieve a predefined surgical objective and reduce the inherent risks in these difficult procedures. Copyright © 2018. Publicado por Elsevier España, S.L.U.

Sustainability issues in circuit board recycling

DEFF Research Database (Denmark)

Legarth, Jens Brøbech; Alting, Leo; Baldo, Gian Luca

1995-01-01

The resource recovery and environmental impact issues of printed circuit board recycling by secondary copper smelters are discussed. Guidelines concerning material selection for circuit board manufacture and concerning the recycling processes are given to enhance recovery efficiency and to lower...

Waste printed circuit board recycling techniques and product utilization

International Nuclear Information System (INIS)

Hadi, Pejman; Xu, Meng; Lin, Carol S.K.; Hui, Chi-Wai; McKay, Gordon

2015-01-01

Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined

Waste printed circuit board recycling techniques and product utilization

Energy Technology Data Exchange (ETDEWEB)

Hadi, Pejman; Xu, Meng [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Lin, Carol S.K. [School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong Special Administrative Region (Hong Kong); Hui, Chi-Wai [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); McKay, Gordon, E-mail: kemckayg@ust.hk [Chemical and Biomolecular Engineering Department, Hong Kong University of Science and Technology, Clear Water Bay Road, Hong Kong Special Administrative Region (Hong Kong); Division of Sustainable Development, College of Science, Engineering and Technology, Hamad Bin Khalifa University, Qatar Foundation, Doha (Qatar)

2015-02-11

Highlights: • There is a major environmental issue about the printed circuit boards throughout the world. • Different physical and chemical recycling techniques have been reviewed. • Nonmetallic fraction of PCBs is the unwanted face of this waste stream. • Several applications of the nonmetallic fraction of waste PCBs have been introduced. - Abstract: E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly “recycling” has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined.

Effect of fin-endwall fillet on thermal hydraulic performance of airfoil printed circuit heat exchanger

International Nuclear Information System (INIS)

Ma, Ting; Xin, Fei; Li, Lei; Xu, Xiang-yang; Chen, Yi-tung; Wang, Qiu-wang

2015-01-01

Printed circuit heat exchanger (PCHE) is recommended to be used for intermediate heat exchanger in Very High Temperature Reactor (VHTR). One of the key features is that it is manufactured by the photochemical etching in order to maintain the internal structure and metal properties. In this paper, a photochemical etching experiment is conducted to manufacture the airfoil PCHE plate. The result indicates that the airfoil fin is not an ideal airfoil profile, but has a fin-endwall fillet. For the purpose of simplifying the numerical model and saving computational time, a validated model with a single fluid is used to further study the effect of fin-endwall fillet on the thermal hydraulic performance of airfoil PCHE. It is found that the fin-endwall fillet can increase the heat transfer and pressure drop in the cases with the non-dimensional longitudinal pitch being 1.63. The effect of fin-endwall fillet on thermal hydraulic performance decreases with the increase of transverse pitch, but the longitudinal pitch has little effect when the non-dimensional longitudinal pitch is greater than 1.88. In the studied cases, the maximum difference of Nusselt number and friction factor between the two models with and without fin-endwall fillet is up to 6.7% and 6.4%. - Highlights: • Fillets are formed in the endwall of airfoil fins during the photochemical etching. • Two-fluid model can be replaced by single-fluid model to perform simulation. • Fin-endwall fillet can increase heat transfer and pressure drop at ζ_l = 1.63. • Effect of fin-endwall fillet decreases as transverse pitch increases at ζ_l = 1.63. • Longitudinal pitch has little effect at ζ_l ≥ 1.88.

Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

International Nuclear Information System (INIS)

Ortuño, Nuria; Conesa, Juan A.; Moltó, Julia; Font, Rafael

2014-01-01

The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO 2005 -TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants

ChemicalVia: a CERN-patented technology for use in high-density circuits

CERN Multimedia

Patrice Loïez

2003-01-01

High-density multilayer printed circuits such as those pictured here are found in miniaturized modern equipment from video cameras to mobile phones. Adjacent layers in these circuits are electrically connected by microvias, consisting of a small-diameter hole (usually 50 µm) with a thin metal-deposited surface covering their cylindrical walls to ensure local conductivity between the two layers. ChemicalVia is a new method, patented by CERN, to make microvias on high-density multilayer printed circuits using chemicals rather than complex laser, plasma or photoimaging technology. The process is compatible with all standard printed-circuit assembly lines, and has the advantages of low initial investment and reduced manufacturing costs. http://www.cern.ch/ttdatabase

Dramatic Advance in Quality in Flexographic Printing

Directory of Open Access Journals (Sweden)

Jochen Richter

2004-12-01

Full Text Available The enormous changes in flexography printing in recent years concerning the printing quality achievable cannot generally be ascribed to a single revolutionary invention, but are the result of continuous developments to the complete system. Thus the direct drive technology in all machine types and its associated advantages in terms of printing length corrections has become established since drupa 2000. The race for ever finer raster rolls has also been completed to the benefit of improvements in bowl geometry and in ceramic surfaces. Clearly improved colour transfer behaviour has become feasible as a result. In a closely intermeshed system such as flexography printing this naturally has to have an effect on the printing colours used. Further improvements in bonding agents and pigment concentrations now allow users to print ever thinner colour layers while maintaining all of the required authenticities.Furthermore, it has become possible to reduce additional disturbing characteristics in the UV colour area, such as the unpleasant odour. While the digital imaging of printing plates has primarily been improved in terms of economic efficiency by the use of up to eight parallel laser beams, extreme improvements in the system are noticeable especially in the area of directly engraved printing moulds. Whereas many still dismissed directly engraved polymer plates at the last drupa as a laboratory system, the first installation was recently placed on the market a mere three years later. A further noteworthy innovation of recent years that has reached market maturity is thin sleeve technology, which combines the advantages of a photopolymer plate with a round imaged printing mould. There are no high sleeve costs for each printing mould, except for one-off cost for an adapter sleeve. To conclude, it can be said that although flexography printing has experienced many new features in the time between drupa 2000 and today, it still has enormous potential for

Advanced circuit simulation using Multisim workbench

CERN Document Server

Báez-López, David; Cervantes-Villagómez, Ofelia Delfina

2012-01-01

Multisim is now the de facto standard for circuit simulation. It is a SPICE-based circuit simulator which combines analog, discrete-time, and mixed-mode circuits. In addition, it is the only simulator which incorporates microcontroller simulation in the same environment. It also includes a tool for printed circuit board design.Advanced Circuit Simulation Using Multisim Workbench is a companion book to Circuit Analysis Using Multisim, published by Morgan & Claypool in 2011. This new book covers advanced analyses and the creation of models and subcircuits. It also includes coverage of transmissi

Assessing Ink Transfer Performance of Gravure-Offset Fine-Line Circuitry Printing

Science.gov (United States)

Cheng, Hsien-Chie; Chen, You-Wei; Chen, Wen-Hwa; Lu, Su-Tsai; Lin, Shih-Ming

2018-03-01

In this study, the printing mechanism and performance of gravure-offset fine-line circuitry printing technology are investigated in terms of key printing parameters through experimental and theoretical analyses. First, the contact angles of the ink deposited on different substrates, blankets, and gravure metal plates are experimentally determined; moreover, their temperature and solvent content dependences are analyzed. Next, the ink solvent absorption and evaporation behaviors of the blankets at different temperatures, times, and numbers of printing repetitions are characterized by conducting experiments. In addition, while printing repeatedly, the surface characteristics of the blankets, such as the contact angle, vary with the amount of absorbed ink solvent, further affecting the ink transfer performance (ratio) and printing quality. Accordingly, the surface effect of the blanket due to ink solvent absorption on the ink contact angle is analyzed. Furthermore, the amount of ink transferred from the gravure plate to the blanket in the "off process" and from the blanket to the substrate in the "set process" is evaluated by conducting a simplified plate-to-plate experiment. The influences of loading rate (printing velocity), temperature, and solvent content on the ink transfer performance are addressed. Finally, the ink transfer mechanism is theoretically analyzed for different solvent contents using Surface Evolver. The calculation results are compared with those of the experiment.

Experimental and numerical study of a printed circuit heat exchanger

International Nuclear Information System (INIS)

Chen, Minghui; Sun, Xiaodong; Christensen, Richard N.; Shi, Shanbin; Skavdahl, Isaac; Utgikar, Vivek; Sabharwall, Piyush

2016-01-01

Highlights: • A dynamic model is developed for transient analysis of the straight-channel PCHE. • Transient scenarios of the straight-channel PCHE subject to helium temperature and mass flow rate variations are numerically investigated. • Steady-state temperature distribution inside the straight-channel PCHE is obtained in calculation. • Experiments are conducted to study the dynamic behavior of the straight-channel PCHE. - Abstract: Printed circuit heat exchangers (PCHEs) are promising to be employed in very-high-temperature gas-cooled reactors (VHTRs) due to their high robustness for high-temperature, high-pressure applications and high compactness. PCHEs typically serve as intermediate heat exchangers (IHXs) that isolate the secondary loop from the reactor’s primary system and hence must be sufficiently robust to maintain the system integrity during normal and off-normal conditions. In addition, the performance of the PCHE-type IHX could considerably affect the nuclear power plant overall operation since any transients on the secondary side would be propagated back to the reactor’s primary coolant system via the IHX. It is therefore imperative to understand how the PCHE would dynamically respond to a variety of transients. In the current study, experiments were first conducted to examine the steady-state thermal performance of a reduced-scale straight-channel PCHE. A dynamic model benchmarked in a previous study was then used to predict the steady-state and transient behavior of the PCHE. The steady-state temperature profiles of the working fluids on both the hot and cold sides and in the solid plates of the heat exchanger were obtained, which served as the initial condition for the transient simulations. The detailed dynamic response of the straight-channel PCHE, subject to inlet temperature variations, helium mass flow variations, and combinations of the two, was simulated and analyzed. In addition, two sets of transient tests, one for helium inlet

Chip-by-chip configurable interconnection using digital printing techniques

International Nuclear Information System (INIS)

Mashayekhi, Mohammad; Carrabina, Jordi; Winchester, Lee; Laurila, Mika-Matti; Mäntysalo, Matti; Ogier, Simon; Terés, Lluís

2017-01-01

Printed electronics technologies add new fabrication concepts to the classical set of microelectronic processes. Among these, the use of digital printing techniques such as inkjet permits the deposition of materials on top of preexisting substrates without any mask. This allows individual personalization of electronic circuits. Different proposals have been made to make use of such a property: (1) wiring new metallic layers on top of circuits to build programmable logic array-like circuits, (2) programming OTP ROM like memories, and (3) building inkjet-configurable gate arrays. The capability of building an individual circuit with technological steps simpler than photolithographic ones opens a concept similar to the successful field programmable gate array. Although nowadays the process resolution is still low, it can quickly evolve to higher wiring densities and therefore permit a greater level of transistor integration. In this paper, we propose a new structure to realize the connections only by deposition of conductive dots oriented to optimize the area needed to implement the drop-on-demand (DoD) wiring at circuit level. One important feature of this structure is that it minimizes the amount of printed material required for the connection thereby reducing failures often seen with DoD printing techniques for conductive lines. These structures have been validated by two different DoD technologies: inkjet and superfine jet, and have been compared to mask-based photolithography technology with promising results. (paper)

Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal

Energy Technology Data Exchange (ETDEWEB)

Ortuño, Nuria; Conesa, Juan A., E-mail: ja.conesa@ua.es; Moltó, Julia; Font, Rafael

2014-11-15

The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO{sub 2005}-TEQ/kg sample, corresponding to the sample with and without metals, respectively. - Highlights: • Thermal decomposition of printed circuit boards (with and without metals) is studied. • Important differences were found at the different experimental conditions. • Emission of brominated pollutants is much higher than that of chlorinated. • Metal enhances emission of halogenated compounds. • An increase in the temperature produces the destruction of pollutants.

Some studies on the pulse-height loss due to capacitive decay in the detector-circuit of parallel plate ionization chambers

International Nuclear Information System (INIS)

Sharma, S.L.; Anil Kumar, G.; Choudhury, R.K.

2006-01-01

Pulse-type ionization chambers are invariably operated in the electron-sensitive mode where the capacitive decay in the detector-circuit during the electron collection produces loss in the pulse-height. In order to understand and appreciate the effect of this capacitive decay on the detector response, we have carried out Monte Carlo simulations of the response of two-electrode parallel plate ionization chambers with and without the capacitive decay keeping shaping time so large that the ballistic deficit is negligibly small. These simulations have been carried out incorporating the physical processes, namely, emission of charged particles from a point radioactive source, the generation of charge carriers in the active volume, separation and acceleration of the charge carriers, transport of the charge carriers, induction of charges on the electrodes, pulse processing by preamplifier-amplifier network, etc. These simulations have shown that the concerned capacitive decay produces appreciable loss in the pulse-height, if the detector-circuit time constant is of the order of maximum electron collection time. We have also carried out measurements on the pulse-height loss due to the capacitive decay in the detector-circuit during the electron collection for a two-electrode parallel plate ionization chamber. The experimental data on the pulse-height loss match reasonably well with the theoretical predictions

Integration of microelectronic chips in microfluidic systems on printed circuit board

International Nuclear Information System (INIS)

Burdallo, I; Jimenez-Jorquera, C; Fernández-Sánchez, C; Baldi, A

2012-01-01

A new scheme for the integration of small semiconductor transducer chips with microfluidic structures on printed circuit board (PCB) is presented. The proposed approach is based on a packaging technique that yields a large and flat area with small and shallow (∼44 µm deep) openings over the chips. The photocurable encapsulant material used, based on a diacrylate bisphenol A polymer, enables irreversible bonding of polydimethylsiloxane microfluidic structures at moderate temperatures (80 °C). This integration scheme enables the insertion of transducer chips in microfluidic systems with a lower added volume than previous schemes. Leakage tests have shown that the bonded structures withstand more than 360 kPa of pressure. A prototype microfluidic system with two detection chips, including one inter-digitated electrode (IDE) chip for conductivity and one ion selective field effect transistor (ISFET) chip for pH, has been implemented and characterized. Good electrical insulation of the chip contacts and silicon edge surfaces from the solution in the microchannels has been achieved. This integration procedure opens the door to the low-cost fabrication of complex analytical microsystems that combine the extraordinary potential of both the microfluidics and silicon microtechnology fields. (paper)

Influence Of Used Bacterial Culture On Zinc And Aluminium Bioleaching From Printed Circuit Boards

Directory of Open Access Journals (Sweden)

Mrazikova Anna

2015-06-01

Full Text Available Bioleaching processes were used to solubilize metals (Cu, Ni, Zn and Al from printed circuit boards (PCBs. In this study, a PCBs-adapted pure culture of Acidithiobacillus ferrooxidans, pure culture of Acidithiobacillus thiooxidans and PCBs-adapted mixed culture of A. ferrooxidans and A. thiooxidans were used for recovery of the metals. The study showed that the mixed bacterial culture has the greatest potential to dissolve metals. The maximum metal bioleaching efficiencies were found to be 100, 92, 89 and 20% of Cu, Ni, Zn and Al, respectively. The mixed culture revealed higher bacterial stability. The main factor responsible for high metal recovery was the ability of the mixed culture to maintain the low pH during the whole process. The pure culture of A. thiooxidans had no significant effect on metal bioleaching from PCBs.

Kinetics and Thermodynamics of Flexographic-plate Polymer Interaction With Low-molecular Liquids

Directory of Open Access Journals (Sweden)

Akaky Dzhvarsheyshvili

2007-11-01

Full Text Available Flexographic printing plates contact solvents in the process of their production and operation: washing solvents and printing paint components. As a results of such contact plates swell. Swelling changes polymers’ elastic properties of which the plate is made, changes the scan point sizes that, in the final analysis, affects the printing product quality. The kinetics of swelling flexographic plate polymer interaction with low-molecular liquids used in the process of plate production and operation was studied. Constants of speed, parameters Flory - Huggins, diffusion coefficient D for each solvent was determined. The changes of the basic thermodynamic functions ΔG, ΔS, ΔH of swelling, are calculated. The received data allow to choose the optimum solvents for processes of polygraphic technology.

E-waste: development of recycling process and chemical characterization of circuit printed - motherboard

International Nuclear Information System (INIS)

Junior, O.L.F.; Vargas, R.A.; Andreoli, M.; Martinelli, J.R.; Seo, E.S.M.

2011-01-01

The electro-electronic industry has been regulated by the National Politic of Solid Residues Act (PNRS) and Bill no. 7.404, concerning the actions, procedures, and method to collect, recycle and promotion of environmentally acceptable final destination of residues. The present work contributes to develop recycling process of printed circuit used in microcomputers and in its chemical characterization. The experimental procedure consisted of grinding, classification, magnetic and electrostatic separation, and separation based on density difference, followed by chemical characterization of the metallic and non metallic materials in the motherboard. It was determined that the amounts of Ag, Al, Ba, Cl, Cr, Cu, Fe, Mn, Pb, and Zn in the residue are above the toxicity allowable levels, and they are in the samples of the decanted material. Among the samples of the floating material, Al, Ba, Br, Ca, Cu, Fe, Pb (in less quantity), Si (in more quantity), and Sn, Ti and Zn were detected. Those materials can be useful in the preparation of red ceramics. (author)

Quantitative Leaching of a Spent Cell Phone Printed Circuit Board by Hydrochloric acid

Directory of Open Access Journals (Sweden)

Alafara A. Baba

2014-07-01

Full Text Available This paper presents a kinetic data on the hydrometallurgical recovery of some metal ions from a printed circuit board (PCB of a spent cell phone by hydrochloric acid leaching. The effects of acid concentration, temperature and particle diameter on the dissolution efficiency at various leaching time intervals were examined. The results of the leaching investigations showed that the powdered cell phone dissolution increases with increasing acid concentration, system temperature with decreasing particle diameter at 360 rpm. With 2M HCl solution, about 88.49% of the sample was dissolved within 120 minutes using 0.075-0.112 mm particle diameter at 800 C. The results of the study indicated that the dissolution reaction could be represented by a shrinking core model with surface chemical reaction. A value of 0.61, 60.67 kJ/mol and 12.9s-1 were calculated as reaction order, activation energy and frequency factor, respectively for the dissolution process.

Estimation of Relative Permittivity of Printed Circuit Board with Fiber Glass Epoxy as Dielectric for UHF Applications

Directory of Open Access Journals (Sweden)

Ronal D. Montoya-Montoya

2013-11-01

Full Text Available This paper presents the results of measuring relative permittivity of fiber glass printed circuit board (PCB’s, using a rectangular resonant cavity. The relative permittivity is presented as function of frequency. To obtain resonant frequencies, the return loss was measured using a network analyzer. Relative permittivity was calculated by finding frequencies of resonant cavity modes. The results are presented in a frequency span of 1 to 3.5GHz. It was clearly shown the nonlinear behavior of the relative permittivity for the dielectric laminate evaluated, even what happens respect to the frequency of the resonant modes below and above to frequency of 2 GHz.

Versioning of printed products

Science.gov (United States)

Tuijn, Chris

2005-01-01

During the definition of a printed product in an MIS system, a lot of attention is paid to the production process. The MIS systems typically gather all process-related parameters at such a level of detail that they can determine what the exact cost will be to make a specific product. This information can then be used to make a quote for the customer. Considerably less attention is paid to the content of the products since this does not have an immediate impact on the production costs (assuming that the number of inks or plates is known in advance). The content management is typically carried out either by the prepress systems themselves or by dedicated workflow servers uniting all people that contribute to the manufacturing of a printed product. Special care must be taken when considering versioned products. With versioned products we here mean distinct products that have a number of pages or page layers in common. Typical examples are comic books that have to be printed in different languages. In this case, the color plates can be shared over the different versions and the black plate will be different. Other examples are nation-wide magazines or newspapers that have an area with regional pages or advertising leaflets in different languages or currencies. When considering versioned products, the content will become an important cost factor. First of all, the content management (and associated proofing and approval cycles) becomes much more complex and, therefore, the risk that mistakes will be made increases considerably. Secondly, the real production costs are very much content-dependent because the content will determine whether plates can be shared across different versions or not and how many press runs will be needed. In this paper, we will present a way to manage different versions of a printed product. First, we will introduce a data model for version management. Next, we will show how the content of the different versions can be supplied by the customer

Inkjet printing and adhesion characterisation of conductive tracks on a commercial printed circuit board material

International Nuclear Information System (INIS)

Sridhar, A.; Dijk, D.J. van; Akkerman, R.

2009-01-01

Silver nanoparticle-based conductive tracks were inkjet printed using a piezoelectric drop-on-demand inkjet printer on a commercially available electronics grade fibre glass (E-glass) reinforced substrate material, and the experimental results have been summarised. Ink jetting was done on two variants of this substrate material, viz. etched and unetched, to determine the influence of substrate surface topography on adhesion and accuracy of the printed tracks. The pull-off adhesion test method was used to quantify adhesive strength. The dependence of the pull-off test results on local geometry of the test area are illustrated with the aid of scanning electron microscope images and interferometer studies. Based on the outcomes of the experiments, conclusions concerning the suitable surface topography for inkjet printing have been arrived at.

Uniformity of fully gravure printed organic field-effect transistors

International Nuclear Information System (INIS)

Hambsch, M.; Reuter, K.; Stanel, M.; Schmidt, G.; Kempa, H.; Fuegmann, U.; Hahn, U.; Huebler, A.C.

2010-01-01

Fully mass-printed organic field-effect transistors were made completely by means of gravure printing. Therefore a special printing layout was developed in order to avoid register problems in print direction. Upon using this layout, contact pads for source-drain electrodes of the transistors are printed together with the gate electrodes in one and the same printing run. More than 50,000 transistors have been produced and by random tests a yield of approximately 75% has been determined. The principle suitability of the gravure printed transistors for integrated circuits has been shown by the realization of ring oscillators.

The challenge of screen printed Ag metallization on nano-scale poly-silicon passivated contacts for silicon solar cells

Science.gov (United States)

Jiang, Lin; Song, Lixin; Yan, Li; Becht, Gregory; Zhang, Yi; Hoerteis, Matthias

2017-08-01

Passivated contacts can be used to reduce metal-induced recombination for higher energy conversion efficiency for silicon solar cells, and are obtained increasing attentions by PV industries in recent years. The reported thicknesses of passivated contact layers are mostly within tens of nanometer range, and the corresponding metallization methods are realized mainly by plating/evaporation technology. This high cost metallization cannot compete with the screen printing technology, and may affect its market potential comparing with the presently dominant solar cell technology. Very few works have been reported on screen printing metallization on passivated contact solar cells. Hence, there is a rising demand to realize screen printing metallization technology on this topic. In this work, we investigate applying screen printing metallization pastes on poly-silicon passivated contacts. The critical challenge for us is to build low contact resistance that can be competitive to standard technology while restricting the paste penetrations within the thin nano-scale passivated contact layers. The contact resistivity of 1.1mohm-cm2 and the open circuit voltages > 660mV are achieved, and the most appropriate thickness range is estimated to be around 80 150nm.

Advances in Current Rating Techniques for Flexible Printed Circuits

Science.gov (United States)

Hayes, Ron

2014-01-01

Twist Capsule Assemblies are power transfer devices commonly used in spacecraft mechanisms that require electrical signals to be passed across a rotating interface. Flexible printed circuits (flex tapes, see Figure 2) are used to carry the electrical signals in these devices. Determining the current rating for a given trace (conductor) size can be challenging. Because of the thermal conditions present in this environment the most appropriate approach is to assume that the only means by which heat is removed from the trace is thru the conductor itself, so that when the flex tape is long the temperature rise in the trace can be extreme. While this technique represents a worst-case thermal situation that yields conservative current ratings, this conservatism may lead to overly cautious designs when not all traces are used at their full rated capacity. A better understanding of how individual traces behave when they are not all in use is the goal of this research. In the testing done in support of this paper, a representative flex tape used for a flight Solar Array Drive Assembly (SADA) application was tested by energizing individual traces (conductors in the tape) in a vacuum chamber and the temperatures of the tape measured using both fine-gauge thermocouples and infrared thermographic imaging. We find that traditional derating schemes used for bundles of wires do not apply for the configuration tested. We also determine that single active traces located in the center of a flex tape operate at lower temperatures than those on the outside edges.

Unit: Electric Circuits, Inspection Pack, National Trial Print.

Science.gov (United States)

Australian Science Education Project, Toorak, Victoria.

As a part of the unit materials in the series produced by the Australian Science Education Project, this teacher edition is primarily composed of a core relating to simple circuits, a test form, and options. Options are given under the headings: Your Invention; "How Long Does a Call Last?"; One, Two, Three Wires; Parallel Circuits; More…

Create Your Plate

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Full Text Available ... Us in the Fight for a Cure Your tax-deductible gift today can fund critical diabetes research ... Close www.diabetes.org > Food and Fitness > Food > Planning Meals > Create Your Plate Share: Print Page Text ...

Numerical Investigation on the Flow and Heat Transfer Characteristics of Supercritical Liquefied Natural Gas in an Airfoil Fin Printed Circuit Heat Exchanger

OpenAIRE

Zhongchao Zhao; Kai Zhao; Dandan Jia; Pengpeng Jiang; Rendong Shen

2017-01-01

As a new kind of highly compact and efficient micro-channel heat exchanger, the printed circuit heat exchanger (PCHE) is a promising candidate satisfying the heat exchange requirements of liquefied natural gas (LNG) vaporization at low and high pressure. The effects of airfoil fin arrangement on heat transfer and flow resistance were numerically investigated using supercritical liquefied natural gas (LNG) as working fluid. The thermal properties of supercritical LNG were tested by utilizing t...

Heat transfer and pressure drop of supercritical carbon dioxide flowing in several printed circuit heat exchanger channel patterns

International Nuclear Information System (INIS)

Carlson, M.; Kruizenga, A.; Anderson, M.; Corradini, M.

2012-01-01

Closed-loop Brayton cycles using supercritical carbon dioxide (SCO 2 ) show potential for use in high-temperature power generation applications including High Temperature Gas Reactors (HTGR) and Sodium-Cooled Fast Reactors (SFR). Compared to Rankine cycles SCO 2 Brayton cycles offer similar or improved efficiency and the potential for decreased capital costs due to a reduction in equipment size and complexity. Compact printed-circuit heat exchangers (PCHE) are being considered as part of several SCO 2 Brayton designs to further reduce equipment size with increased energy density. Several designs plan to use a gas cooler operating near the pseudo-critical point of carbon dioxide to benefit from large variations in thermophysical properties, but further work is needed to validate correlations for heat transfer and pressure-drop characteristics of SCO 2 flows in candidate PCHE channel designs for a variety of operating conditions. This paper presents work on experimental measurements of the heat transfer and pressure drop behavior of miniature channels using carbon dioxide at supercritical pressure. Results from several plate geometries tested in horizontal cooling-mode flow are presented, including a straight semi-circular channel, zigzag channel with a bend angle of 80 degrees, and a channel with a staggered array of extruded airfoil pillars modeled after a NACA 0020 airfoil with an 8.1 mm chord length facing into the flow. Heat transfer coefficients and bulk temperatures are calculated from measured local wall temperatures and local heat fluxes. The experimental results are compared to several methods for estimating the friction factor and Nusselt number of cooling-mode flows at supercritical pressures in millimeter-scale channels. (authors)

Nanosilver conductive lines made by spray coating and aerosol jet printing technique

Science.gov (United States)

Krzeminski, Jakub; Wroblewski, Grzegorz; Dybowska-Sarapuk, Lucja; Lepak, Sandra; Jakubowska, Malgorzata

2017-08-01

Printing electronics even though the printing techniques are known for a long time, are gaining in importance. The possibility of making the electronic circuits on flexible, big-area substrates with efficient and cheap technology make it attractive for the electronic industry. Spray coating, as a one of printing methods, additionally provide the chance to print on the non-flat, complicated shaped substrates. Despite the spray coating is mostly used to print a big pads, it is reachable to spray the separate conductive lines both as a quickly-produced prototype and as a fully manufactured circuit. Our work presents the directly printed lines with spray coating technique. For the printing process self-made ink was used. We tested three different approaches to line formation and compare them in the terms of line edge, resistivity and thickness. Line profiles provide the information about the roughness and the line size. In the end we showed the aerosol jet printed meander to give an overview of this similar to spray coating but more sophisticated technique.

Create Your Plate

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Full Text Available ... Planning Meals > Create Your Plate Share: Print Page Text Size: A A A Listen En Español Create ... Type 2 Education Series Hear audio clips and full recordings of past Q&A events at your ...

Create Your Plate

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Full Text Available ... for Association Events Messaging Tools Recruiting Advocates Local Market Planning Training Webinars News & Events Advocacy News Call ... Meals > Create Your Plate Share: Print Page Text Size: A A A Listen En Español Create Your ...

MyPlate Daily Checklist

Science.gov (United States)

... Price Tag Read the Food Label Kitchen Timesavers Cooking for Your Family Tasty & Low-Cost Recipes Sample 2-Week Menus Resources for Professionals MyPlate Tip Sheets Print Materials Infographics 5 Ways ...

Thiourea leaching gold and silver from the printed circuit boards of waste mobile phones.

Science.gov (United States)

Jing-ying, Li; Xiu-li, Xu; Wen-quan, Liu

2012-06-01

The present communication deals with the leaching of gold and silver from the printed circuit boards (PCBs) of waste mobile phones using an effective and less hazardous system, i.e., a thiourea leaching process as an alternative to the conventional and toxic cyanide leaching of gold. The influence of particle size, thiourea and Fe(3+) concentrations and temperature on the leaching of gold and silver from waste mobile phones was investigated. Gold extraction was found to be enhanced in a PCBs particle size of 100 mesh with the solutions containing 24 g/L thiourea and Fe(3+) concentration of 0.6% under the room temperature. In this case, about 90% of gold and 50% of silver were leached by the reaction of 2h. The obtained data will be useful for the development of processes for the recycling of gold and silver from the PCBs of waste mobile phones. Copyright © 2012 Elsevier Ltd. All rights reserved.

Heat Transfer and Pressure Drop Characteristics in Straight Microchannel of Printed Circuit Heat Exchangers

Directory of Open Access Journals (Sweden)

Jang-Won Seo

2015-05-01

Full Text Available Performance tests were carried out for a microchannel printed circuit heat exchanger (PCHE, which was fabricated with micro photo-etching and diffusion bonding technologies. The microchannel PCHE was tested for Reynolds numbers in the range of 100‒850 varying the hot-side inlet temperature between 40 °C–50 °C while keeping the cold-side temperature fixed at 20 °C. It was found that the average heat transfer rate and heat transfer performance of the countercurrrent configuration were 6.8% and 10%‒15% higher, respectively, than those of the parallel flow. The average heat transfer rate, heat transfer performance and pressure drop increased with increasing Reynolds number in all experiments. Increasing inlet temperature did not affect the heat transfer performance while it slightly decreased the pressure drop in the experimental range considered. Empirical correlations have been developed for the heat transfer coefficient and pressure drop factor as functions of the Reynolds number.

Circuit bridging of digital equipment caused by smoke from a cable fire

International Nuclear Information System (INIS)

Tanaka, T.J.; Anderson, D.J.

1997-01-01

Advanced reactor systems are likely to use protection systems with digital electronics that ideally should be resistant to environmental hazards, including smoke from possible cable fires. Previous smoke tests have shown that digital safety systems can fail even at relatively low levels of smoke density and that short-term failures are likely to be caused by circuit bridging. Experiments were performed to examine these failures, with a focus on component packaging and protection schemes. Circuit bridging, which causes increased leakage currents and arcs, was gauged by measuring leakage currents among the leads of component packages. The resistance among circuit leads typically varies over a wide range, depending on the nature of the circuitry between the pins, bias conditions, circuit board material, etc. Resistance between leads can be as low as 20 kΩ and still be good, depending on the component. For these tests, the authors chose a printed circuit board and components that normally have an interlead resistance above 10 12 Ω, but if the circuit is exposed to smoke, circuit bridging causes the resistance to fall below 10 3 Ω. Plated-through-hole (PTH) and surface-mounted (SMT) packages were exposed to a series of different smoke environments using a mixture of environmentally qualified cables for fuel. Conformal coatings and enclosures were tested as circuit protection methods. High fuel levels, high humidity, and high flaming burns were the conditions most likely to cause circuit bridging. The inexpensive conformal coating that was tested - an acrylic spray - reduced leakage currents, but enclosure in a chassis with a fan did not. PTH packages were more resistant to smoke-induced circuit bridging than SMT packages. Active components failed most often in tests where the leakage currents were high, but failure did not always accompany high leakage currents

Recent Advancements in Liquid Metal Flexible Printed Electronics: Properties, Technologies, and Applications

Directory of Open Access Journals (Sweden)

Xuelin Wang

2016-11-01

Full Text Available This article presents an overview on typical properties, technologies, and applications of liquid metal based flexible printed electronics. The core manufacturing material—room-temperature liquid metal, currently mainly represented by gallium and its alloys with the properties of excellent resistivity, enormous bendability, low adhesion, and large surface tension, was focused on in particular. In addition, a series of recently developed printing technologies spanning from personal electronic circuit printing (direct painting or writing, mechanical system printing, mask layer based printing, high-resolution nanoimprinting, etc. to 3D room temperature liquid metal printing is comprehensively reviewed. Applications of these planar or three-dimensional printing technologies and the related liquid metal alloy inks in making flexible electronics, such as electronical components, health care sensors, and other functional devices were discussed. The significantly different adhesions of liquid metal inks on various substrates under different oxidation degrees, weakness of circuits, difficulty of fabricating high-accuracy devices, and low rate of good product—all of which are challenges faced by current liquid metal flexible printed electronics—are discussed. Prospects for liquid metal flexible printed electronics to develop ending user electronics and more extensive applications in the future are given.

An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

Energy Technology Data Exchange (ETDEWEB)

Vianco, P.T.

1998-10-15

A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

Printed 2 V-operating organic inverter arrays employing a small-molecule/polymer blend.

Science.gov (United States)

Shiwaku, Rei; Takeda, Yasunori; Fukuda, Takashi; Fukuda, Kenjiro; Matsui, Hiroyuki; Kumaki, Daisuke; Tokito, Shizuo

2016-10-04

Printed organic thin-film transistors (OTFTs) are well suited for low-cost electronic applications, such as radio frequency identification (RFID) tags and sensors. Achieving both high carrier mobility and uniform electrical characteristics in printed OTFT devices is essential in these applications. Here, we report on printed high-performance OTFTs and circuits using silver nanoparticle inks for the source/drain electrodes and a blend of dithieno[2,3-d;2',3'-d']benzo[1,2-b;4,5-b']dithiophene (DTBDT-C 6 ) and polystyrene for the organic semiconducting layer. A high saturation region mobility of 1.0 cm 2  V -1  s -1 at low operation voltage of -5 V was obtained for relatively short channel lengths of 9 μm. All fifteen of the printed pseudo-CMOS inverter circuits were formed on a common substrate and operated at low operation voltage of 2 V with the total variation in threshold voltage of 0.35 V. Consequently, the printed OTFT devices can be used in more complex integrated circuit applications requiring low manufacturing cost over large areas.

Printed 2 V-operating organic inverter arrays employing a small-molecule/polymer blend

Science.gov (United States)

Shiwaku, Rei; Takeda, Yasunori; Fukuda, Takashi; Fukuda, Kenjiro; Matsui, Hiroyuki; Kumaki, Daisuke; Tokito, Shizuo

2016-10-01

Printed organic thin-film transistors (OTFTs) are well suited for low-cost electronic applications, such as radio frequency identification (RFID) tags and sensors. Achieving both high carrier mobility and uniform electrical characteristics in printed OTFT devices is essential in these applications. Here, we report on printed high-performance OTFTs and circuits using silver nanoparticle inks for the source/drain electrodes and a blend of dithieno[2,3-d2‧,3‧-d‧]benzo[1,2-b4,5-b‧]dithiophene (DTBDT-C6) and polystyrene for the organic semiconducting layer. A high saturation region mobility of 1.0 cm2 V-1 s-1 at low operation voltage of -5 V was obtained for relatively short channel lengths of 9 μm. All fifteen of the printed pseudo-CMOS inverter circuits were formed on a common substrate and operated at low operation voltage of 2 V with the total variation in threshold voltage of 0.35 V. Consequently, the printed OTFT devices can be used in more complex integrated circuit applications requiring low manufacturing cost over large areas.

Open-Source-Based 3D Printing of Thin Silica Gel Layers in Planar Chromatography.

Science.gov (United States)

Fichou, Dimitri; Morlock, Gertrud E

2017-02-07

On the basis of open-source packages, 3D printing of thin silica gel layers is demonstrated as proof-of-principle for use in planar chromatography. A slurry doser was designed to replace the plastic extruder of an open-source Prusa i3 printer. The optimal parameters for 3D printing of layers were studied, and the planar chromatographic separations on these printed layers were successfully demonstrated with a mixture of dyes. The layer printing process was fast. For printing a 0.2 mm layer on a 10 cm × 10 cm format, it took less than 5 min. It was affordable, i.e., the running costs for producing such a plate were less than 0.25 Euro and the investment costs for the modified hardware were 630 Euro. This approach demonstrated not only the potential of the 3D printing environment in planar chromatography but also opened new avenues and new perspectives for tailor-made plates, not only with regard to layer materials and their combinations (gradient plates) but also with regard to different layer shapes and patterns. As such an example, separations on a printed plane layer were compared with those obtained from a printed channeled layer. For the latter, 40 channels were printed in parallel on a 10 cm × 10 cm format for the separation of 40 samples. For producing such a channeled plate, the running costs were below 0.04 Euro and the printing process took only 2 min. All modifications of the device and software were released open-source to encourage reuse and improvements and to stimulate the users to contribute to this technology. By this proof-of-principle, another asset was demonstrated to be integrated into the Office Chromatography concept, in which all relevant steps for online miniaturized planar chromatography are performed by a single device.

Graphene-based inkjet printing of flexible bioelectronic circuits and sensors

Science.gov (United States)

Sinar, Dogan; Knopf, George K.; Nikumb, Suwas

2013-03-01

Bioelectronics involves interfacing functional biomolecules or living cells with electronic circuitry. Recent advances in electrically conductive inks and inkjet printing technologies have enabled bioelectronic devices to be fabricated on mechanically flexible polymers, paper and silk. In this research, non-conductive graphene-oxide (GO) inks are synthesized from inexpensive graphite powders. Once printed on the flexible substrate the electrical conductivity of the micro-circuitry can be restored through thermal reduction. Laser irradiation is one method being investigated for transforming the high resistance printed GO film into conductive oxygen reduced graphene-oxide (rGO). Direct laser writing is a precision fabrication process that enables the imprinting of conductive and resistive micro-features on the GO film. The mechanically flexible rGO microcircuits can be further biofunctionalized using molecular self-assembly techniques. Opportunities and challenges in exploiting these emerging technologies for developing biosensors and bioelectronic cicruits are briefly discussed.

Print Finishing: From Manual to Automated Print Finishing

Directory of Open Access Journals (Sweden)

Gareth Ward

2004-12-01

Full Text Available Meeting the demand for faster turnrounds and shorter print runs goes beyond making the printing press easier to set up and change. There is little point in producing plates and then sheets from a press if the post press area does not change to keep abreast of developments in prepress and the print room. The greatest impact is going to come from JDF, the end to end production data format which is finding wide spread acceptance in print areas. To date finishing equipment manufacturers are not as well represented within the CIP4 organisation as prepress and press vendors, but the major manufacturers are members. All are working to the goal of complete connectivity.The idea of JDF is that if the format of a print product like a magazine is known during the creation phases, the information can be used to preset machinery that is going to be used to produce it, so avoiding input errors and saving manufacturing time.A second aspect to JDF is that information about performance and progress is gathered and can be retrieved from a central point or made available to a customer. Production scheduling and costing becomes more accurate and customer relationships are deepened. However JDF to its fullest extent is not yet in use in connecting the finishing area to the rest of the printing plant. Around the world different companies are testing the idea of JDF to connect saddle stitchers, guillotines and binders with frantic work underway to be able to show results soon.

CFD Analysis on the Periodic Element of a Printed Circuit Heat Exchanger

International Nuclear Information System (INIS)

Tak, Nam-il; Kim, Min-Hwan; Lee, Won-Jae

2007-01-01

A typical printed circuit heat exchanger (PCHE) is composed of a large number of flow channels with lateral corrugations. In an effort to investigate fundamental thermo-fluid characteristics of a PCHE with corrugated channels, computational fluid dynamics (CFD) analyses were previously made in. One pair of flow channels (i.e., cold and hot channels) with the entire flow path was considered for the computational domain in the previous studies. Although only one pair of flow channels with coarse meshes was used, computational loads were found to be very high to simulate the entire flow path of the PCHE. Fortunately a recent study has shown that a simplified CFD methodology with a stream wise periodic assumption (called periodic CFD analysis) is feasible for a CFD evaluation of the thermo-fluid performance of compact heat exchangers. Since the periodic CFD analysis focuses on the periodic element of a flow channel, the required computing resources are dramatically reduced. In the present paper, the periodic CFD analysis has been applied to the periodic element of the PCHE. The results are compared with those of the full elements which have an entire flow path. Based on the periodic approach the effects of the corrugation parameters on the thermo-fluid performance of the PCHE are investigated

Prioritizing material recovery for end-of-life printed circuit boards

International Nuclear Information System (INIS)

Wang Xue; Gaustad, Gabrielle

2012-01-01

Highlights: ► Material recovery driven by composition, choice of ranking, and weighting. ► Economic potential for new recycling technologies quantified for several metrics. ► Indicators developed for materials incurring high eco-toxicity costs. ► Methodology useful for a variety of stakeholders, particularly policy-makers. - Abstract: The increasing growth in generation of electronic waste (e-waste) motivates a variety of waste reduction research. Printed circuit boards (PCBs) are an important sub-set of the overall e-waste stream due to the high value of the materials contained within them and potential toxicity. This work explores several environmental and economic metrics for prioritizing the recovery of materials from end-of-life PCBs. A weighted sum model is used to investigate the trade-offs among economic value, energy saving potentials, and eco-toxicity. Results show that given equal weights for these three sustainability criteria gold has the highest recovery priority, followed by copper, palladium, aluminum, tin, lead, platinum, nickel, zinc, and silver. However, recovery priority will change significantly due to variation in the composition of PCBs, choice of ranking metrics, and weighting factors when scoring multiple metrics. These results can be used by waste management decision-makers to quantify the value and environmental savings potential for recycling technology development and infrastructure. They can also be extended by policy-makers to inform possible penalties for land-filling PCBs or exporting to the informal recycling sector. The importance of weighting factors when examining recovery trade-offs, particularly for policies regarding PCB collection and recycling are explored further.

A Low-Power Integrated Humidity CMOS Sensor by Printing-on-Chip Technology

Directory of Open Access Journals (Sweden)

Chang-Hung Lee

2014-05-01

Full Text Available A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems.

A low-power integrated humidity CMOS sensor by printing-on-chip technology.

Science.gov (United States)

Lee, Chang-Hung; Chuang, Wen-Yu; Cowan, Melissa A; Wu, Wen-Jung; Lin, Chih-Ting

2014-05-23

A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene)/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems.

3D Printed Shock Mitigating Structures

Science.gov (United States)

Schrand, Amanda; Elston, Edwin; Dennis, Mitzi; Metroke, Tammy; Chen, Chenggang; Patton, Steven; Ganguli, Sabyasachi; Roy, Ajit

Here we explore the durability, and shock mitigating potential, of solid and cellular 3D printed polymers and conductive inks under high strain rate, compressive shock wave and high g acceleration conditions. Our initial designs include a simple circuit with 4 resistors embedded into circular discs and a complex cylindrical gyroid shape. A novel ink consisting of silver-coated carbon black nanoparticles in a thermoplastic polyurethane was used as the trace material. One version of the disc structural design has the advantage of allowing disassembly after testing for direct failure analysis. After increasing impacts, printed and traditionally potted circuits were examined for functionality. Additionally, in the open disc design, trace cracking and delamination of resistors were able to be observed. In a parallel study, we examined the shock mitigating behavior of 3D printed cellular gyroid structures on a Split Hopkinson Pressure Bar (SHPB). We explored alterations to the classic SHPB setup for testing the low impedance, cellular samples to most accurately reflect the stress state inside the sample (strain rates from 700 to 1750 s-1). We discovered that the gyroid can effectively absorb the impact of the test resulting in crushing the structure. Future studies aim to tailor the unit cell dimensions for certain frequencies, increase print accuracy and optimize material compositions for conductivity and adhesion to manufacture more durable devices.

Separation of the metallic and non-metallic fraction from printed circuit boards employing green technology

Energy Technology Data Exchange (ETDEWEB)

Estrada-Ruiz, R.H., E-mail: rhestrada@itsaltillo.edu.mx; Flores-Campos, R., E-mail: rcampos@itsaltillo.edu.mx; Gámez-Altamirano, H.A., E-mail: hgamez@itsaltillo.edu.mx; Velarde-Sánchez, E.J., E-mail: ejvelarde@itsaltillo.edu.mx

2016-07-05

Highlights: • Small sizes of particles are required in order to separate the different fractions. • Inverse flotation process is an efficient green technology to separate fractions. • Superficial air velocity is the main variable in the inverse flotation process. • Inverse flotation is a green process because the pulṕs pH is 7.0 during the test. - Abstract: The generation of electrical and electronic waste is increasing day by day; recycling is attractive because of the metallic fraction containing these. Nevertheless, conventional techniques are highly polluting. The comminution of the printed circuit boards followed by an inverse flotation process is a clean technique that allows one to separate the metallic fraction from the non-metallic fraction. It was found that particle size and superficial air velocity are the main variables in the separation of the different fractions. In this way an efficient separation is achieved by avoiding the environmental contamination coupled with the possible utilization of the different fractions obtained.

3D printed magnetic polymer composite transformers

Science.gov (United States)

Bollig, Lindsey M.; Hilpisch, Peter J.; Mowry, Greg S.; Nelson-Cheeseman, Brittany B.

2017-11-01

The possibility of 3D printing a transformer core using fused deposition modeling methods is explored. With the use of additive manufacturing, ideal transformer core geometries can be achieved in order to produce a more efficient transformer. In this work, different 3D printed settings and toroidal geometries are tested using a custom integrated magnetic circuit capable of measuring the hysteresis loop of a transformer. These different properties are then characterized, and it was determined the most effective 3D printed transformer core requires a high fill factor along with a high concentration of magnetic particulate.

A Novel Designed Bioreactor for Recovering Precious Metals from Waste Printed Circuit Boards

Science.gov (United States)

Jujun, Ruan; Jie, Zheng; Jian, Hu; Zhang, Jianwen

2015-01-01

For recovering precious metals from waste printed circuit boards (PCBs), a novel hybrid technology including physical and biological methods was developed. It consisted of crushing, corona-electrostatic separation, and bioleaching. Bioleaching process is the focus of this paper. A novel bioreactor for bioleaching was designed. Bioleaching was carried out using Pseudomonas chlororaphis. Bioleaching experiments using mixed particles of Au and Cu were performed and leachate contained 0.006 mg/L, 2823 mg/L Au+ and Cu2+ respectively. It showed when Cu existed, the concentrations of Au were extremely small. This provided the feasibility to separate Cu from Au. The method of orthogonal experimental design was employed in the simulation bioleaching experiments. Experimental results showed the optimized parameters for separating Cu from Au particles were pH 7.0, temperature 22.5 °C, and rotation speed 80 r/min. Based on the optimized parameters obtained, the bioreactor was operated for recovering mixed Au and Cu particles. 88.1 wt.% of Cu and 76.6 wt.% of Au were recovered. The paper contributed important information to recover precious metals from waste PCBs. PMID:26316021

Disposing and recycling waste printed circuit boards: disconnecting, resource recovery, and pollution control.

Science.gov (United States)

Wang, Jianbo; Xu, Zhenming

2015-01-20

Over the past decades, China has been suffering from negative environmental impacts from distempered e-waste recycling activities. After a decade of effort, disassembly and raw materials recycling of environmentally friendly e-waste have been realized in specialized companies, in China, and law enforcement for illegal activities of e-waste recycling has also been made more and more strict. So up to now, the e-waste recycling in China should be developed toward more depth and refinement to promote industrial production of e-waste resource recovery. Waste printed circuit boards (WPCBs), which are the most complex, hazardous, and valuable components of e-waste, are selected as one typical example in this article that reviews the status of related regulations and technologies of WPCBs recycling, then optimizes, and integrates the proper approaches in existence, while the bottlenecks in the WPCBs recycling system are analyzed, and some preliminary experiments of pinch technologies are also conducted. Finally, in order to provide directional guidance for future development of WPCBs recycling, some key points in the WPCBs recycling system are proposed to point towards a future trend in the e-waste recycling industry.

Numerical investigation on thermal-hydraulic performance of new printed circuit heat exchanger model

International Nuclear Information System (INIS)

Kim, Dong Eok; Kim, Moo Hwan; Cha, Jae Eun; Kim, Seong O.

2008-01-01

Three-dimensional numerical analysis was performed to investigate heat transfer and pressure drop characteristics of supercritical CO 2 flow in new Printed Circuit Heat Exchanger (PCHE) model using commercial CFD code, Fluent 6.3. First, numerical analysis for conventional zigzag channel PCHE model was performed and compared with previous experimental data. Maximum deviation of in-outlet temperature difference and pressure drop from experimental data is about 10%. A new PCHE model has been designed to optimize thermal-hydraulic performance of PCHE. The new PCHE model has several airfoil shape fins (NACA 0020 model), which are designed to streamlined shape. Simulation results showed that in the airfoil shape fin PCHE, total heat transfer rate per unit volume was almost same with zigzag channel PCHE and the pressure drop was reduced to one-twentieth of that in zigzag channel PCHE. In airfoil shape fin PCHE model, the enhancement of heat transfer area and the uniform flow configuration contributed to obtain the same heat transfer performance with zigzag channel PCHE model. And the reduction of pressure drop in airfoil shape fin PCHE model was caused by suppressing generation of separated flow owing to streamlined shape of airfoil fins

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation.

Science.gov (United States)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Arpád; Ilea, Petru

2014-05-30

The present study aims to develop an eco-friendly chemical-electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75kWh/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples. Copyright © 2014 Elsevier B.V. All rights reserved.

Synthesis of carbon nanotubes and porous carbons from printed circuit board waste pyrolysis oil

International Nuclear Information System (INIS)

Quan Cui; Li Aimin; Gao Ningbo

2010-01-01

The possibility and feasibility of using pyrolysis oil from printed circuit board (PCB) waste as a precursor for advanced carbonaceous materials is presented. The PCB waste was first pyrolyzed in a laboratory scale fixed bed reactor at 600 deg. C to prepare pyrolysis oil. The analysis of pyrolysis oil by gas chromatography-mass spectroscopy indicated that it contained a very high proportion of phenol and phenol derivatives. It was then polymerized in formaldehyde solution to synthesize pyrolysis oil-based resin which was used as a precursor to prepare carbon nanotubes (CNTs) and porous carbons. Scanning electron microscopy and transmission microscopy investigation showed that the resulting CNTs had hollow cores with outer diameter of ∼338 nm and wall thickness of ∼86 nm and most of them were filled with metal nanoparticles or nanorods. X-ray diffraction reveals that CNTs have an amorphous structure. Nitrogen adsorption isotherm analysis indicated the prepared porous carbons had a Brunauer-Emmett-Teller surface area of 1214 m 2 /g. The mechanism of the formation of the CNTs and porous carbons was discussed.

Green Plate-making Technology Based on Nanomaterials

Institute of Scientific and Technical Information of China (English)

SONG Yanlin

2011-01-01

@@ Movable type printing technology is one of the four great inventions of ancient China which played a significant role in passing down the history and civilization of human society.Today, with economic development and people's diverse needs for presswork, printing has penetrated into all spheres of life, and the printing industry has become one of the industries that have important impacts on China's national economy.Since China is now the third largest printing market in the world, the rapid development of this huge market calls for digital plate-making technologies for the sake of environmental protection.

Development of high-resolution two-dimensional magnetic field measurement system by use of printed-circuit technology

Science.gov (United States)

Akimitsu, Moe; Qinghong, Cao; Sawada, Asuka; Hatano, Hironori; Tanabe, Hiroshi; Ono, Yasushi; TS-Group Team

2017-10-01

We have developed a new-types of high-resolution magnetic probe array for our new magnetic reconnection experiments: TS-3U (ST, FRC: R =0.2m, 2017-) and TS-4U (ST, FRC: R =0.5m, 2018-), using the advanced printed-circuit technology. They are equipped with all three-components of magnetic pick-up coils whose size is 1-5mm x 3mm. Each coil is composed of two-sided coil pattern with line width of 0.05mm. We can install two or three printed arrays in a single glass (ceramic) tube for two or three component measurements. Based on this new probe technique, we started high-resolution and high-accuracy measurement of the current sheet thickness and studied its plasma parameter dependence. We found that the thickness of current sheet increases inversely with the guide toroidal field. It is probably determined by the ion gyroradius in agreement with the particle simulation by Horiuchi etc. While the reconnection speed is steady under low guide field condition, it is observed to oscillate in the specific range of guide field, suggesting transition from the quasi-steady reconnection to the intermittent reconnection. Cause and mechanism for intermittent reconnection will be discussed using the current sheet dissipation and dynamic balance between plasma inflow and outflow. This work supported by JSPS KAKENHI Grant Numbers 15H05750, 15K14279 and 17H04863.

Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

International Nuclear Information System (INIS)

Troeger, K.; Darka, R. Khanpour; Neumeyer, T.; Altstaedt, V.

2014-01-01

This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K

Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

Energy Technology Data Exchange (ETDEWEB)

Troeger, K., E-mail: altstaedt@uni-bayreuth.de; Darka, R. Khanpour, E-mail: altstaedt@uni-bayreuth.de; Neumeyer, T., E-mail: altstaedt@uni-bayreuth.de; Altstaedt, V., E-mail: altstaedt@uni-bayreuth.de [Polymer Engineering, University of Bayreuth, Germany and Polymer Engineering, Universitaetsstrasse 30, 95447 Bayreuth (Germany)

2014-05-15

This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K.

Fast copper extraction from printed circuit boards using supercritical carbon dioxide.

Science.gov (United States)

Calgaro, C O; Schlemmer, D F; da Silva, M D C R; Maziero, E V; Tanabe, E H; Bertuol, D A

2015-11-01

Technological development and intensive marketing support the growth in demand for electrical and electronic equipment (EEE), for which printed circuit boards (PCBs) are vital components. As these devices become obsolete after short periods, waste PCBs present a problem and require recycling. PCBs are composed of ceramics, polymers, and metals, particularly Cu, which is present in highest percentages. The aim of this study was to develop an innovative method to recover Cu from the PCBs of old mobile phones, obtaining faster reaction kinetics by means of leaching with supercritical CO2 and co-solvents. The PCBs from waste mobile phones were characterized, and evaluation was made of the reaction kinetics during leaching at atmospheric pressure and using supercritical CO2 with H2O2 and H2SO4 as co-solvents. The results showed that the PCBs contained 34.83 wt% of Cu. It was found that the supercritical extraction was 9 times faster, compared to atmospheric pressure extraction. After 20 min of supercritical leaching, approximately 90% of the Cu contained in the PCB was extracted using a 1:20 solid:liquid ratio and 20% of H2O2 and H2SO4 (2.5 M). These results demonstrate the efficiency of the process. Therefore the supercritical CO2 employment in the PCBs recycling is a promising alternative and the CO2 is environmentally acceptable and reusable. Copyright © 2015 Elsevier Ltd. All rights reserved.

All-printed paper memory

KAUST Repository

Lien, Derhsien

2014-08-26

We report the memory device on paper by means of an all-printing approach. Using a sequence of inkjet and screen-printing techniques, a simple metal-insulator-metal device structure is fabricated on paper as a resistive random access memory with a potential to reach gigabyte capacities on an A4 paper. The printed-paper-based memory devices (PPMDs) exhibit reproducible switching endurance, reliable retention, tunable memory window, and the capability to operate under extreme bending conditions. In addition, the PBMD can be labeled on electronics or living objects for multifunctional, wearable, on-skin, and biocompatible applications. The disposability and the high-security data storage of the paper-based memory are also demonstrated to show the ease of data handling, which are not achievable for regular silicon-based electronic devices. We envision that the PPMDs manufactured by this cost-effective and time-efficient all-printing approach would be a key electronic component to fully activate a paper-based circuit and can be directly implemented in medical biosensors, multifunctional devices, and self-powered systems. © 2014 American Chemical Society.

Laser printing of 3D metallic interconnects

Science.gov (United States)

Beniam, Iyoel; Mathews, Scott A.; Charipar, Nicholas A.; Auyeung, Raymond C. Y.; Piqué, Alberto

2016-04-01

The use of laser-induced forward transfer (LIFT) techniques for the printing of functional materials has been demonstrated for numerous applications. The printing gives rise to patterns, which can be used to fabricate planar interconnects. More recently, various groups have demonstrated electrical interconnects from laser-printed 3D structures. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or of pastes containing dispersed metallic particles. However, the generated 3D structures do not posses the same metallic conductivity as a bulk metal interconnect of the same cross-section and length as those formed by wire bonding or tab welding. An alternative is to laser transfer entire 3D structures using a technique known as lase-and-place. Lase-and-place is a LIFT process whereby whole components and parts can be transferred from a donor substrate onto a desired location with one single laser pulse. This paper will describe the use of LIFT to laser print freestanding, solid metal foils or beams precisely over the contact pads of discrete devices to interconnect them into fully functional circuits. Furthermore, this paper will also show how the same laser can be used to bend or fold the bulk metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief for the circuits under flexing or during motion from thermal mismatch. These interconnect "ridges" can span wide gaps (on the order of a millimeter) and accommodate height differences of tens of microns between adjacent devices. Examples of these laser printed 3D metallic bridges and their role in the development of next generation electronics by additive manufacturing will be presented.

Integrated bioleaching of copper metal from waste printed circuit board-a comprehensive review of approaches and challenges.

Science.gov (United States)

Awasthi, Abhishek Kumar; Zeng, Xianlai; Li, Jinhui

2016-11-01

Waste electrical and electronic equipment (e-waste) is the most rapidly growing waste stream in the world, and the majority of the residues are openly disposed of in developing countries. Waste printed circuit boards (WPCBs) make up the major portion of e-waste, and their informal recycling can cause environmental pollution and health risks. Furthermore, the conventional disposal and recycling techniques-mechanical treatments used to recover valuable metals, including copper-are not sustainable in the long term. Chemical leaching is rapid and efficient but causes secondary pollution. Bioleaching is a promising approach, eco-friendly and economically feasible, but it is slower process. This review considers the recycling potential of microbes and suggests an integrated bioleaching approach for Cu extraction and recovery from WPCBs. The proposed recycling system should be more effective, efficient and both technically and economically feasible.

Temperature Mapping of 3D Printed Polymer Plates: Experimental and Numerical Study

Directory of Open Access Journals (Sweden)

Charoula Kousiatza

2017-02-01

Full Text Available In Fused Deposition Modeling (FDM, which is a common thermoplastic Additive Manufacturing (AM method, the polymer model material that is in the form of a flexible filament is heated above its glass transition temperature (Tg to a semi-molten state in the head’s liquefier. The heated material is extruded in a rastering configuration onto the building platform where it rapidly cools and solidifies with the adjoining material. The heating and rapid cooling cycles of the work materials exhibited during the FDM process provoke non-uniform thermal gradients and cause stress build-up that consequently result in part distortions, dimensional inaccuracy and even possible part fabrication failure. Within the purpose of optimizing the FDM technique by eliminating the presence of such undesirable effects, real-time monitoring is essential for the evaluation and control of the final parts’ quality. The present work investigates the temperature distributions developed during the FDM building process of multilayered thin plates and on this basis a numerical study is also presented. The recordings of temperature changes were achieved by embedding temperature measuring sensors at various locations into the middle-plane of the printed structures. The experimental results, mapping the temperature variations within the samples, were compared to the corresponding ones obtained by finite element modeling, exhibiting good correlation.

Adhesion characterization of inkjet printed tracks

NARCIS (Netherlands)

Sridhar, Ashok; Akkerman, Remko; van Dijk, D.J.

2007-01-01

The robustness and service life of inkjet printed electronic circuit structures are highly influenced by the state of the interface between these structures and the substrate. In the case of polymeric substrate materials, surface modification is necessary to realise a favourable interface, as these

Study on characteristics of printed circuit board liberation and its crushed products.

Science.gov (United States)

Quan, Cui; Li, Aimin; Gao, Ningbo

2012-11-01

Recycling printed circuit board waste (PCBW) waste is a hot issue of environmental protection and resource recycling. Mechanical and thermo-chemical methods are two traditional recycling processes for PCBW. In the present research, a two-step crushing process combined with a coarse-crushing step and a fine-pulverizing step was adopted, and then the crushed products were classified into seven different fractions with a standard sieve. The liberation situation and particle shape in different size fractions were observed. Properties of different size fractions, such as heating value, thermogravimetric, proximate, ultimate and chemical analysis were determined. The Rosin-Rammler model was applied to analyze the particle size distribution of crushed material. The results indicated that complete liberation of metals from the PCBW was achieved at a size less than 0.59 mm, but the nonmetal particle in the smaller-than-0.15 mm fraction is liable to aggregate. Copper was the most prominent metal in PCBW and mainly enriched in the 0.42-0.25 mm particle size. The Rosin-Rammler equation adequately fit particle size distribution data of crushed PCBW with a correlation coefficient of 0.9810. The results of heating value and proximate analysis revealed that the PCBW had a low heating value and high ash content. The combustion and pyrolysis process of PCBW was different and there was an obvious oxidation peak of Cu in combustion runs.

Internet of "printed" Things: low-cost fabrication of autonomous sensing nodes by inkjet printing

Science.gov (United States)

Kawahara, Yoshihiro

2014-11-01

"What if electronics devices are printed using an inkjet printer even at home?" "What if those devices no longer need a battery?" I will introduce two enabling technologies for the Internet of Things concept. 1. Instant Inkjet Circuits: A low cost, fast and accessible technology to support the rapid prototyping of electronic devices. We demonstrated that "sintering-free" silver nano particle ink with a commodity inkjet printer can be used to fabricate printed circuit board and high-frequency applications such as antennas and sensors. The technology is now commercialized by AgIC, Inc. 2. Wireless Power: Although large amounts of data can be exchanged over a wireless communication link, mobile devices are still tethered by power cables. We are trying to solve this problem by two different approaches: energy harvesting. A simple circuitry comprised of diodes and capacitor can convert ambient radio signals into DC current. Our research revealed the signals from TV tower located 6.5km apart could be used to feed 100 microwatts to power microcontrollers.

Flexible circuits with integrated switches for robotic shape sensing

Science.gov (United States)

Harnett, C. K.

2016-05-01

Digital switches are commonly used for detecting surface contact and limb-position limits in robotics. The typical momentary-contact digital switch is a mechanical device made from metal springs, designed to connect with a rigid printed circuit board (PCB). However, flexible printed circuits are taking over from the rigid PCB in robotics because the circuits can bend while carrying signals and power through moving joints. This project is motivated by a previous work where an array of surface-mount momentary contact switches on a flexible circuit acted as an all-digital shape sensor compatible with the power resources of energy harvesting systems. Without a rigid segment, the smallest commercially-available surface-mount switches would detach from the flexible circuit after several bending cycles, sometimes violently. This report describes a low-cost, conductive fiber based method to integrate electromechanical switches into flexible circuits and other soft, bendable materials. Because the switches are digital (on/off), they differ from commercially-available continuous-valued bend/flex sensors. No amplification or analog-to-digital conversion is needed to read the signal, but the tradeoff is that the digital switches only give a threshold curvature value. Boundary conditions on the edges of the flexible circuit are key to setting the threshold curvature value for switching. This presentation will discuss threshold-setting, size scaling of the design, automation for inserting a digital switch into the flexible circuit fabrication process, and methods for reconstructing a shape from an array of digital switch states.

Influence of nonmetals recycled from waste printed circuit boards on flexural properties and fracture behavior of polypropylene composites

International Nuclear Information System (INIS)

Zheng Yanhong; Shen Zhigang; Cai Chujiang; Ma Shulin; Xing Yushan

2009-01-01

Flexural strength and flexural modulus of the composites can be successfully improved by filling nonmetals recycled from waste printed circuit boards (PCBs) into polypropylene (PP). By using scanning electron microscopy (SEM), the influence of nonmetals on fracture behavior of PP composites is investigated by in situ flexural test. Observation results show that the particles can effectively lead to mass micro cracks instead of the breaking crack. The process of the crack initiation, propagation and fiber breakage dissipate a great amount of energy. As a result, the flexural properties of the composites can be reinforced significantly. Results of the in situ SEM observation and analysis to the dynamic flexural process supply effective test evidence for the reinforcing mechanism of the nonmetals/PP composites on the basis of the energy dissipation theory

Leaching of metals from large pieces of printed circuit boards using citric acid and hydrogen peroxide.

Science.gov (United States)

Jadhav, Umesh; Su, C; Hocheng, Hong

2016-12-01

In the present study, the leaching of metals from large pieces of computer printed circuit boards (CPCBs) was studied. A combination of citric acid (0.5 M) and 1.76 M hydrogen peroxide (H 2 O 2 ) was used to leach the metals from CPCB piece. The influence of system variables such as H 2 O 2 concentration, concentration of citric acid, shaking speed, and temperature on the metal leaching process was investigated. The complete metal leaching was achieved in 4 h from a 4 × 4 cm CPCB piece. The presence of citric acid and H 2 O 2 together in the leaching solution is essential for complete metal leaching. The optimum addition amount of H 2 O 2 was 5.83 %. The citric acid concentration and shaking speed had an insignificant effect on the leaching of metals. The increase in the temperature above 30 °C showed a drastic effect on metal leaching process.

Two-step bioleaching of copper and gold from discarded printed circuit boards (PCB).

Science.gov (United States)

Işıldar, Arda; van de Vossenberg, Jack; Rene, Eldon R; van Hullebusch, Eric D; Lens, Piet N L

2016-11-01

An effective strategy for environmentally sound biological recovery of copper and gold from discarded printed circuit boards (PCB) in a two-step bioleaching process was experimented. In the first step, chemolithotrophic acidophilic Acidithiobacillus ferrivorans and Acidithiobacillus thiooxidans were used. In the second step, cyanide-producing heterotrophic Pseudomonas fluorescens and Pseudomonas putida were used. Results showed that at a 1% pulp density (10g/L PCB concentration), 98.4% of the copper was bioleached by a mixture of A. ferrivorans and A. thiooxidans at pH 1.0-1.6 and ambient temperature (23±2°C) in 7days. A pure culture of P. putida (strain WCS361) produced 21.5 (±1.5)mg/L cyanide with 10g/L glycine as the substrate. This gold complexing agent was used in the subsequent bioleaching step using the Cu-leached (by A. ferrivorans and A. thiooxidans) PCB material, 44.0% of the gold was mobilized in alkaline conditions at pH 7.3-8.6, and 30°C in 2days. This study provided a proof-of-concept of a two-step approach in metal bioleaching from PCB, by bacterially produced lixiviants. Copyright © 2015 Elsevier Ltd. All rights reserved.

The ultrasonically assisted metals recovery treatment of printed circuit board waste sludge by leaching separation.

Science.gov (United States)

Xie, Fengchun; Li, Haiying; Ma, Yang; Li, Chuncheng; Cai, Tingting; Huang, Zhiyuan; Yuan, Gaoqing

2009-10-15

This paper provides a practical technique that realized industrial scale copper and iron separation from printed circuit board (PCB) waste sludge by ultrasonically assisted acid leaching in a low cost, low energy consumption and zero discharge of wastes manner. The separation efficiencies of copper and iron from acid leaching with assistance of ultrasound were compared with the one without assistance of ultrasound and the effects of the leaching procedure, pH value, and ultrasonic strength have been investigated in the paper. With the appropriate leaching procedure, a final pH of 3.0, an ultrasonic generator power of 160 W (in 1l tank), leaching time of 60 min, leaching efficiencies of copper and iron had reached 97.83% and 1.23%, respectively. Therefore the separation of copper and iron in PCB waste sludge was virtually achieved. The lab results had been successfully applied to the industrial scaled applications in a heavy metal recovery plant in city of Huizhou, China for more than two years. It has great potentials to be used in even the broad metal recovery practices.

Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound

International Nuclear Information System (INIS)

Guo Jie; Rao Qunli; Xu Zhenming

2008-01-01

The aim of this study was to investigate the feasibility of using glass-nonmetals, a byproduct of recycling waste printed circuit boards (PCBs), to replace wood flour in production of phenolic moulding compound (PMC). Glass-nonmetals were attained by two-step crushing and corona electrostatic separating processes. Glass-nonmetals with particle size shorter than 0.07 mm were in the form of single fibers and resin powder, with the biggest portion (up to 34.6 wt%). Properties of PMC with glass-nonmetals (PMCGN) were compared with reference PMC and the national standard of PMC (PF2C3). When the adding content of glass-nonmetals was 40 wt%, PMCGN exhibited flexural strength of 82 MPa, notched impact strength of 2.4 kJ/m 2 , heat deflection temperature of 175 deg. C, and dielectric strength of 4.8 MV/m, all of which met the national standard. Scanning electron microscopy (SEM) showed strong interfacial bonding between glass fibers and the phenolic resin. All the results showed that the use of glass-nonmetals as filler in PMC represented a promising method for resolving the environmental pollutions and reducing the cost of PMC, thus attaining both environmental and economic benefits

Quality control process improvement of flexible printed circuit board by FMEA

Science.gov (United States)

Krasaephol, Siwaporn; Chutima, Parames

2018-02-01

This research focuses on the quality control process improvement of Flexible Printed Circuit Board (FPCB), centred around model 7-Flex, by using Failure Mode and Effect Analysis (FMEA) method to decrease proportion of defective finished goods that are found at the final inspection process. Due to a number of defective units that were found at the final inspection process, high scraps may be escaped to customers. The problem comes from poor quality control process which is not efficient enough to filter defective products from in-process because there is no In-Process Quality Control (IPQC) or sampling inspection in the process. Therefore, the quality control process has to be improved by setting inspection gates and IPCQs at critical processes in order to filter the defective products. The critical processes are analysed by the FMEA method. IPQC is used for detecting defective products and reducing chances of defective finished goods escaped to the customers. Reducing proportion of defective finished goods also decreases scrap cost because finished goods incur higher scrap cost than work in-process. Moreover, defective products that are found during process can reflect the abnormal processes; therefore, engineers and operators should timely solve the problems. Improved quality control was implemented for 7-Flex production lines from July 2017 to September 2017. The result shows decreasing of the average proportion of defective finished goods and the average of Customer Manufacturers Lot Reject Rate (%LRR of CMs) equal to 4.5% and 4.1% respectively. Furthermore, cost saving of this quality control process equals to 100K Baht.

Gold recovery from printed wiring board using bioleaching

Energy Technology Data Exchange (ETDEWEB)

Kita, Y. [Faculty of Engineering, Osaka Univ. (Japan); Nishikawa, H. [Center for Advanced Science and Innovation, Osaka Univ. (Japan); Takemoto, T. [Joining and Welding Research Inst., Osaka Univ. (Japan)

2004-07-01

In the electronic assembly, gold is frequently used as surface plating and a bonding wire. To recover gold from waste electronics, the dissolution process using cyan is a popular method, however, the solution is highly toxic. Accordingly, the environmentally conscious substitute process is preferable. In this study the possibility of Au dissolution from printed wiring boards using bioleaching has been investigated. Chromobacterium violaceum having ability of cyanide formation was used to dissolve Au. The printed wiring boards with gold plating of 0.07nm in thickness were immersed in synthetic medium with C. violaceum. After immersion test for 480h, the gold plating was completely dissolved. The increase in cyanide concentration gave little effect on the enhancement of dissolution of gold, however, the dissolution rate of Au was increased with increasing of dissolved oxygen in the medium. Chromobacterium violaceum produced 0.8mmol/l cyanide but it also decomposed about 60% of cyanide generated, therefore, this dissolution process could be used as an environmentally conscious method. (orig.)

A wearable tracking device inkjet-printed on textile

KAUST Repository

Krykpayev, Bauyrzhan; Farooqui, Muhammad Fahad; Bilal, Rana Muhammad; Vaseem, Mohammad; Shamim, Atif

2017-01-01

Despite the abundance of localization applications, the tracking devices have never been truly realized in E-textiles. Standard printed circuit board (PCB)-based devices are obtrusive and rigid and hence not suitable for textile based

High-Throughput Printing Process for Flexible Electronics

Science.gov (United States)

Hyun, Woo Jin

Printed electronics is an emerging field for manufacturing electronic devices with low cost and minimal material waste for a variety of applications including displays, distributed sensing, smart packaging, and energy management. Moreover, its compatibility with roll-to-roll production formats and flexible substrates is desirable for continuous, high-throughput production of flexible electronics. Despite the promise, however, the roll-to-roll production of printed electronics is quite challenging due to web movement hindering accurate ink registration and high-fidelity printing. In this talk, I will present a promising strategy for roll-to-roll production using a novel printing process that we term SCALE (Self-aligned Capillarity-Assisted Lithography for Electronics). By utilizing capillarity of liquid inks on nano/micro-structured substrates, the SCALE process facilitates high-resolution and self-aligned patterning of electrically functional inks with greatly improved printing tolerance. I will show the fabrication of key building blocks (e.g. transistor, resistor, capacitor) for electronic circuits using the SCALE process on plastics.

Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader

Directory of Open Access Journals (Sweden)

Monier-Vinard Eric

2016-01-01

Full Text Available In order to help the electronic designer to early determine the limits of the power dissipation of electronic component, an analytical model was established to allow a fast insight of relevant design parameters of a multi-layered electronic board constitution. The proposed steady-state approach based on Fourier series method promotes a practical solution to quickly investigate the potential gain of multi-layered thermal via clusters. Generally, it has been shown a good agreement between the results obtained by the proposed analytical model and those given by electronics cooling software widely used in industry. Some results highlight the fact that the conventional practices for Printed Circuit Board modeling can be dramatically underestimate source temperatures, in particular with smaller sources. Moreover, the analytic solution could be applied to optimize the heat spreading in the board structure with a local modification of the effective thermal conductivity layers.

Influence of incorporation of powder of printed circuit boards on technological properties and microstructure of triaxial ceramics

International Nuclear Information System (INIS)

Stafford, F.N.; Hotza, D.

2012-01-01

Using the methodology of experiments with mixtures, seven formulations of clay, phyllite, and printed circuit boards (PCB) were obtained to study the influence of this waste on triaxial ceramic tiles. Each formulation was processed under conditions similar to those used in the ceramic tiles industry, and characterized for fired modulus of rupture (FMoR) and water absorption (WA). The samples sintered at 1180°C were also subjected to analysis by XRD and SEM. The lowest resistance was observed in samples with 40% residue, while the highest strength occurred for samples with 14% residue, which reached average values of mechanical strength and water absorption of 35.0 MPa and 2.0%, respectively. The microstructure showed that it is possible to use waste of PCB in triaxial ceramic, which exhibits a fluxing behavior and it has an important effect on the sinterability and the development of appropriate microstructures. (author)

A New Type of Inscribed Copper Plate from Indus Valley (Harappan Civilisation

Directory of Open Access Journals (Sweden)

Vasant Shinde

2014-10-01

Full Text Available A group of nine Indus Valley copper plates (c. 2600–2000 BC, discovered from private collections in Pakistan, appear to be of an important type not previously described. The plates are significantly larger and more robust than those comprising the corpus of known copper plates or tablets, and most significantly differ in being inscribed with mirrored characters. One of the plates bears 34 characters, which is the longest known single Indus script inscription. Examination of the plates with x-ray fluorescence (XRF spectrophotometry indicates metal compositions, including arsenical copper, consistent with Indus Valley technology. Microscopy of the metal surface and internal structure reveals detail such as pitting, microcrystalline structure, and corrosion, consistent with ancient cast copper artifacts. Given the relative fineness of the engraving, it is hypothesised that the copper plates were not used as seals, but have characteristics consistent with use in copper plate printing. As such, it is possible that these copper plates are by far the earliest known printing devices, being at least 4000 years old.

3D Printing: 3D Printing of Shape Memory Polymers for Flexible Electronic Devices (Adv. Mater. 22/2016).

Science.gov (United States)

Zarek, Matt; Layani, Michael; Cooperstein, Ido; Sachyani, Ela; Cohn, Daniel; Magdassi, Shlomo

2016-06-01

On page 4449, D. Cohn, S. Magdassi, and co-workers describe a general and facile method based on 3D printing of methacrylated macromonomers to fabricate shape-memory objects that can be used in flexible and responsive electrical circuits. Such responsive objects can be used in the fabrication of soft robotics, minimal invasive medical devices, sensors, and wearable electronics. The use of 3D printing overcomes the poor processing characteristics of thermosets and enables complex geometries that are not easily accessible by other techniques. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits

Directory of Open Access Journals (Sweden)

Domenico Capriglione

2018-03-01

Full Text Available This paper deals with the electromagnetic compatibility (EMC issues related to the direct and radiated emissions from a high-speed integrated circuits (ICs. These emissions are evaluated here by means of circuital and electromagnetic models. As for the conducted emission, an equivalent circuit model is derived to describe the IC and the effect of its loads (package, printed circuit board, decaps, etc., based on the Integrated Circuit Emission Model template (ICEM. As for the radiated emission, an electromagnetic model is proposed, based on the superposition of the fields generated in the far field region by the loop currents flowing into the IC and the package pins. A custom experimental setup is designed for validating the models. Specifically, for the radiated emission measurement, a custom test board is designed and realized, able to highlight the contribution of the direct emission from the IC, usually hidden by the indirect emission coming from the printed circuit board. Measurements of the package currents and of the far-field emitted fields are carried out, providing a satisfactory agreement with the model predictions.

Superconducting power distribution structure for integrated circuits

International Nuclear Information System (INIS)

Ruby, R.C.

1991-01-01

This patent describes a superconducting power distribution structure for an integrated circuit. It comprises a first superconducting capacitor plate; a second superconducting capacitor plate provided with electrical isolation means within the second capacitor plate; dielectric means separating the first capacitor plate from the second capacitor plate; first via means coupled at a first end to the first capacitor plate and extending through the dielectric and the electrical isolation means of the second capacitor plate; first contact means coupled to a second end of the first via means; and second contact means coupled to the second capacitor plate such that the first contact means and the second contact means are accessible from the same side of the second capacitor plate

[Electric short-circuit incident observed with "Upsher" laryngoscopes].

Science.gov (United States)

Tritsch, L; Vailly, B

2006-01-01

We observed an electrical short-circuit between a fasten screw of the printed circuit and the handle of an Upsher universal laryngoscope (serial number UQ1). The isolating Silicone layer was broken above the screw. This isolation defect was found all over our Upsher laryngoscopes of the UQ1 series. No doubt that if accumulators were used instead of batteries, emitted heat would be in largest amount and perhaps dangerous.

Evolvable designs of experiments applications for circuits

CERN Document Server

Iordache, Octavian

2009-01-01

Adopting a groundbreaking approach, the highly regarded author shows how to design methods for planning increasingly complex experiments. He begins with a brief introduction to standard quality methods and the technology in standard electric circuits. The book then gives numerous examples of how to apply the proposed methodology in a series of real-life case studies. Although these case studies are taken from the printed circuit board industry, the methods are equally applicable to other fields of engineering.

Printed circuit board recycling: Physical processing and copper extraction by selective leaching.

Science.gov (United States)

Silvas, Flávia P C; Correa, Mónica M Jiménez; Caldas, Marcos P K; de Moraes, Viviane T; Espinosa, Denise C R; Tenório, Jorge A S

2015-12-01

Global generation of waste electrical and electronic equipment (WEEE) is about 40 million tons per year. Constant increase in WEEE generation added to international legislations has improved the development of processes for materials recovery and sustainability of electrical and electronic industry. This paper describes a new hydrometallurgical route (leaching process) to recycle printed circuit boards (PCBs) from printers to recover copper. Methodology included PCBs characterization and a combined route of physical and hydrometallurgical processing. Magnetic separation, acid digestion and chemical analysis by ICP-OES were performed. On leaching process were used two stages: the first one in a sulfuric media and the second in an oxidant media. The results showed that the PCBs composition was 74.6 wt.% of non-magnetic material and 25.4 wt.% of magnetic one. The metallic fraction corresponded to 44.0 wt.%, the polymeric to 28.5 wt.% and the ceramic to 27.5 wt.%. The main metal was copper and its initial content was 32.5 wt.%. On sulfuric leaching 90 wt.% of Al, 40 wt.% of Zn and 8.6 wt.% of Sn were extracted, whereas on oxidant leaching tests the extraction percentage of Cu was 100 wt.%, of Zn 60 wt.% and of Al 10 wt.%. At the end of the hydrometallurgical processing was obtained 100% of copper extraction and the recovery factor was 98.46%, which corresponds to a 32 kg of Cu in 100 kg of PCB. Copyright © 2015 Elsevier Ltd. All rights reserved.

Non-Newtonian ink transfer in gravure-offset printing

International Nuclear Information System (INIS)

Ghadiri, Fatemeh; Ahmed, Dewan Hasan; Sung, Hyung Jin; Shirani, Ebrahim

2011-01-01

The inks used in gravure-offset printing are non-Newtonian fluids with higher viscosities and lower surface tensions than Newtonian fluids. This paper examines the transfer of a non-Newtonian ink between a flat plate and a groove when the plate is moved upward with a constant velocity while the groove is held fixed. Numerical simulations were carried out with the Carreau model to explore the behavior of this non-Newtonian ink in gravure-offset printing. The volume of fluid (VOF) method was implemented to capture the interface during the ink transfer process. The effects of varying the contact angle of the ink on the flat plate and groove walls and geometrical parameters such as the groove angle and the groove depth on the breakup time of the liquid filament that forms between the plate and the groove and the ink transfer ratio were determined. Our results indicate that increasing the groove contact angle and decreasing the flat plate contact angle enhance the ink transfer ratio and the breakup time. However, increasing the groove depth and the groove angle decreases the transfer ratio and the breakup time. By optimizing these parameters, it is possible to achieve an ink transfer from the groove to the flat plate of approximately 92%. Moreover, the initial width and the vertical velocity of the neck of the ink filament have significant influences on the ink transfer ratio and the breakup time.

Evaluation of the substitution of PMMA plates by PLA 3D printed in TL response of CaSO{sub 4}:Dy; Avaliacao da substituicao de placas de PMMA por PLA impresso 3D na resposta TL do CaSO{sub 4}:Dy

Energy Technology Data Exchange (ETDEWEB)

Almeida, Shirlane Barbosa de; Valeriano, Caio Cesar Santos; Campos, Leticia Lucente, E-mail: caio144fisicamedica@gmail.com [Instituto de Pesquisas Energeticas e Nucleares (IPEN/CNEN-SP), Sao Paulo, SP (Brazil)

2016-07-01

The CaSO{sub 4}:Dy is a dosimetric material that is nationally produced, which presents high sensibility but a high energy dependence of its thermoluminescent (TL) response at the photoelectric effect region. This study aims to compare the TL response of the CaSO{sub 4}:Dy when irradiated, with different energies, at the presence of 3D printed plates of polylactic acid (PLA) and polymethylmethacrylate (PMMA). Results show that the PLA has a different attenuation of the radiation, when compared to PMMA, indicating that it should be taken into account the quality of the print used on PLA plates manufacture. (author)

Inkjet printing technology and conductive inks synthesis for microfabrication techniques

International Nuclear Information System (INIS)

Dang, Mau Chien; Dung Dang, Thi My; Fribourg-Blanc, Eric

2013-01-01

Inkjet printing is an advanced technique which reliably reproduces text, images and photos on paper and some other substrates by desktop printers and is now used in the field of materials deposition. This interest in maskless materials deposition is coupled with the development of microfabrication techniques for the realization of circuits or patterns on flexible substrates for which printing techniques are of primary interest. This paper is a review of some results obtained in inkjet printing technology to develop microfabrication techniques at Laboratory for Nanotechnology (LNT). Ink development, in particular conductive ink, study of printed patterns, as well as application of these to the realization of radio-frequency identification (RFID) tags on flexible substrates, are presented. (paper)

Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

Science.gov (United States)

Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

2018-03-01

Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

Science.gov (United States)

Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

2018-06-01

Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

Simulation of electronic circuit sensitivity towards humidity using electrochemical data on water layer

DEFF Research Database (Denmark)

Joshy, Salil; Verdingovas, Vadimas; Jellesen, Morten Stendahl

2015-01-01

Climatic conditions like temperature and humidity have direct influence on the operation of electronic circuits. The effects of temperature on the operation of electronic circuits have been widely investigated, while the effect of humidity and solder flux residues are not well understood including...... the effect on circuit and PCBA (printed circuit board assembly) layout design. This paper elucidates a methodology for analyzing the sensitivity of an electronic circuit based on parasitic circuit analysis using data on electrical property of the water layer formed under humid as well as contaminated...

Plating pulse switching power based on a CPLD

International Nuclear Information System (INIS)

Sun, Hongguo; Wu, Jun

2013-01-01

This paper presents a method of using a CPLD to generate a PWM trigger pulse to a full bridge inverter and a chopper circuit. This method results in a very good high power and low voltage large current pulse plating power supply. A single-chip microcomputer is the core of the feedback control system. A fuzzy PID algorithm with SCM and CPLD complexes precisely controls the output voltage, allowing it to maintain a constant value. The system contains a protection circuit that detects output current and output voltage and can correct the system if it enters an over-current abnormal state, ensuring that the driving circuit can effectively drive the IGBT. The circuit is also protected by setting the inverter frequency and dead time of a digital PWM chip. This method for bidirectional pulse plating power supply digital control was verified to be correct and practicable by a Matlab software simulation

Characterization of Printed Circuit Boards for Metal and Energy Recovery after Milling and Mechanical Separation

Directory of Open Access Journals (Sweden)

Waldir A. Bizzo

2014-06-01

Full Text Available The proper disposal of electrical and electronic waste is currently a concern of researchers and environmental managers not only because of the large volume of such waste generated, but also because of the heavy metals and toxic substances it contains. This study analyzed printed circuit boards (PCBs from discarded computers to determine their metal content and characterized them as solid waste and fuel. The analysis showed that PCBs consist of approximately 26% metal, made up mainly of copper, lead, aluminum, iron and tin, as well as other heavy metals such as cadmium and nickel. Comparison with the results of other studies indicated that the concentration of precious metals (gold and silver has declined over time. Analysis of the leachate revealed high concentrations of cadmium and lead, giving the residue the characteristics of hazardous waste. After milling the PCBs, we found that larger amounts of metal were concentrated in smaller fractions, while the lightest fraction, obtained by density separation, had a gross calorific value of approximately 11 MJ/kg, although with a high ash content. Milling followed by density separation proved potentially useful for recovery of metals and energy-rich fractions.

FEM-based Printhead Intelligent Adjusting Method for Printing Conduct Material

Directory of Open Access Journals (Sweden)

Liang Xiaodan

2017-01-01

Full Text Available Ink-jet printing circuit board has some advantage, such as non-contact manufacture, high manufacture accuracy, and low pollution and so on. In order to improve the and printing precision, the finite element technology is adopted to model the piezoelectric print heads, and a new bacteria foraging algorithm with a lifecycle strategy is proposed to optimize the parameters of driving waveforms for getting the desired droplet characteristics. Results of numerical simulation show such algorithm has a good performance. Additionally, the droplet jetting simulation results and measured results confirmed such method precisely gets the desired droplet characteristics.

Evaluation of gold and silver leaching from printed circuit board of cellphones.

Science.gov (United States)

Petter, P M H; Veit, H M; Bernardes, A M

2014-02-01

Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining "reference" values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2h at 60°C and 80°C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO3were made. The leaching of Au and Ag with alternative reagents: Na2S2O3, and (NH4)2S2O3 in 0.1M concentration with the addition of CuSO4, NH4OH, and H2O2, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO4 was added. Copyright © 2013 Elsevier Ltd. All rights reserved.

Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit boards

International Nuclear Information System (INIS)

Long Laishou; Sun Shuiyu; Zhong Sheng; Dai Wencan; Liu Jingyong; Song Weifeng

2010-01-01

The constant growth in generation of waste printed circuit boards (WPCB) poses a huge disposal problem because they consist of a heterogeneous mixture of organic and metallic chemicals as well as glass fiber. Also the presence of heavy metals, such as Pb and Cd turns this scrap into hazardous waste. Therefore, recycling of WPCB is an important subject not only from the recovery of valuable materials but also from the treatment of waste. The aim of this study was to present a recycling process without negative impact to the environment as an alternative for recycling WPCB. In this work, a process technology containing vacuum pyrolysis and mechanical processing was employed to recycle WPCB. At the first stage of this work, the WPCB was pyrolyzed under vacuum in a self-made batch pilot-scale fixed bed reactor to recycle organic resins contained in the WPCB. By vacuum pyrolysis the organic matter was decomposed to gases and liquids which could be used as fuels or chemical material resources, however, the inorganic WPCB matter was left unaltered as solid residues. At the second stage, the residues obtained at the first stage were investigated to separate and recover the copper through mechanical processing such as crushing, screening, and gravity separation. The copper grade of 99.50% with recovery of 99.86% based on the whole WPCB was obtained. And the glass fiber could be obtained by calcinations in a muffle furnace at 600 deg. C for 10 min. This study had demonstrated the feasibility of vacuum pyrolysis and mechanical processing for recycling WPCB.

FDM 3D printed coffee glove embedded with flexible electronic

KAUST Repository

Bahri, Meznan

2017-10-31

With the advances in 3D printing technology, Flexible Electronics can now be exploited to form the so-called “Embedded Electronics”. This paper describes experiences learned from a research project which ran during summer 2016 at KAUST, in collaboration with the Electrical and Computer Engineering Department at Effat University, and aimed at creating a heating coffee glove product operating on double alkaline batteries using Kapton© as a flexible substrate for the circuit. The circuit and its batteries are encapsulated in a 3D printed glove, designed using SolidWorks©. The proposed methodology and techniques applied during this work could be further used in implementing other technologies, such as thermoelectric coolers head patches, smart garments, and flexible smartphones. Limitation and recommendation of the present methodology are also discussed.

Elements configuration of the open lead test circuit

International Nuclear Information System (INIS)

Fukuzaki, Yumi; Ono, Akira

2016-01-01

In the field of electronics, small electronic devices are widely utilized because they are easy to carry. The devices have various functions by user’s request. Therefore, the lead’s pitch or the ball’s pitch have been narrowed and high-density printed circuit board has been used in the devices. Use of the ICs which have narrow lead pitch makes normal connection difficult. When logic circuits in the devices are fabricated with the state-of-the-art technology, some faults have occurred more frequently. It can be divided into types of open faults and short faults. We have proposed a new test method using a test circuit in the past. This paper propose elements configuration of the test circuit.

Elements configuration of the open lead test circuit

Energy Technology Data Exchange (ETDEWEB)

Fukuzaki, Yumi, E-mail: 14514@sr.kagawa-nct.ac.jp [Advanced course of Electronics, Information and Communication Engineering, National Institute of Technology, Kagawa College, 551 Koda, Mitoyo, Kagawa (Japan); Ono, Akira [Department of Communication Network Engineering, National Institute of Technology, Kagawa College, 551 Koda, Mitoyo, Kagawa (Japan)

2016-07-06

In the field of electronics, small electronic devices are widely utilized because they are easy to carry. The devices have various functions by user’s request. Therefore, the lead’s pitch or the ball’s pitch have been narrowed and high-density printed circuit board has been used in the devices. Use of the ICs which have narrow lead pitch makes normal connection difficult. When logic circuits in the devices are fabricated with the state-of-the-art technology, some faults have occurred more frequently. It can be divided into types of open faults and short faults. We have proposed a new test method using a test circuit in the past. This paper propose elements configuration of the test circuit.

Fully Printed Flexible and Stretchable Electronics

Science.gov (United States)

Zhang, Suoming

Through this thesis proposal, the author has demonstrated series of flexible or stretchable sensors including strain gauge, pressure sensors, display arrays, thin film transistors and photodetectors fabricated by a direct printing process. By adopting the novel serpentine configuration with conventional non-stretchable materials silver nanoparticles, the fully printed stretchable devices are successfully fabricated on elastomeric substrate with the demonstration of stretchable conductors that can maintain the electrical properties under strain and the strain gauge, which could be used to measure the strain in desired locations and also to monitor individual person's finger motion. And by investigating the intrinsic stretchable materials silver nanowires (AgNWs) with the conventional configuration, the fully printed stretchable conductors are achieved on various substrates including Si, glass, Polyimide, Polydimethylsiloxane (PDMS) and Very High Bond (VHB) tape with the illustration of the capacitive pressure sensor and stretchable electroluminescent displays. In addition, intrinsically stretchable thin-film transistors (TFTs) and integrated logic circuits are directly printed on elastomeric PDMS substrates. The printed devices utilize carbon nanotubes and a type of hybrid gate dielectric comprising PDMS and barium titanate (BaTiO3) nanoparticles. The BaTiO3/PDMS composite simultaneously provides high dielectric constant, superior stretchability, low leakage, as well as good printability and compatibility with the elastomeric substrate. Both TFTs and logic circuits can be stretched beyond 50% strain along either channel length or channel width directions for thousands of cycles while showing no significant degradation in electrical performance. Finally, by applying the SWNTs as the channel layer of the thin film transistor, we successfully fabricate the fully printed flexible photodetector which exhibits good electrical characteristics and the transistors exhibit

Internet of ''printed'' Things: low-cost fabrication of autonomous sensing nodes by inkjet printing

International Nuclear Information System (INIS)

Kawahara, Yoshihiro

2014-01-01

''What if electronics devices are printed using an inkjet printer even at home?'' ''What if those devices no longer need a battery?'' I will introduce two enabling technologies for the Internet of Things concept. 1. Instant Inkjet Circuits: A low cost, fast and accessible technology to support the rapid prototyping of electronic devices. We demonstrated that ''sintering-free'' silver nano particle ink with a commodity inkjet printer can be used to fabricate printed circuit board and high-frequency applications such as antennas and sensors. The technology is now commercialized by AgIC, Inc. 2. Wireless Power: Although large amounts of data can be exchanged over a wireless communication link, mobile devices are still tethered by power cables. We are trying to solve this problem by two different approaches: energy harvesting. A simple circuitry comprised of diodes and capacitor can convert ambient radio signals into DC current. Our research revealed the signals from TV tower located 6.5km apart could be used to feed 100 microwatts to power microcontrollers

A WiFi Tracking Device Printed Directly on Textile for Wearable Electronics Applications

KAUST Repository

Krykpayev, Bauyrzhan

2015-12-01

Wearable technology is quickly becoming commonplace in our everyday life - fit-ness and health monitors, smart watches, and Google Glass, just to name a few. It is very clear that in near future the wearable technology will only grow. One of the biggest wearable fields is the E-textiles. E-textiles empower clothes with new functionality by enhancing fabrics with electronics and interconnects. The main obstacle to the development of E-textile field is the relative difficulty and large tolerance in its manufacturing as compared to the standard circuit production. Current methods such as the application of conductive foils, embroidering of conductive wires and treatment with conductive coatings do not possess efficient, fast and reliable mass production traits inherent to the electronic industry. On the other hand, the method of conductive printing on textile has the potential to unlock the efficiency similar to PCB production, due to its roll-to-roll and reel-to-reel printing capabilities. Further-more, printing on textiles is a common practice to realize graphics, artwork, etc. and thus adaptability to conductive ink printing will be relatively easier. Even though conductive printing is a fully additive process, the end circuit layout is very similar to the one produced via PCB manufacture. However, due to high surface roughness and porosity of textiles, efficient and reliable printing on textile has remained elusive. Direct conductive printing on textile is possible but only on specialized dense and tightly interwoven fabrics. Such fabrics are usually uncommon and expensive. Another option is to employ an interface layer that flattens the textile surface, thus allowing printing on it. The interface layer method can be used with a variety of textiles such as polyester/cotton that can be found in any store, making this method promising for wearable electronics. Very few examples and that too of simple structures such as a line, square patch or electrode have been

Printing method for organic light emitting device lighting

Science.gov (United States)

Ki, Hyun Chul; Kim, Seon Hoon; Kim, Doo-Gun; Kim, Tae-Un; Kim, Snag-Gi; Hong, Kyung-Jin; So, Soon-Yeol

2013-03-01

Organic Light Emitting Device (OLED) has a characteristic to change the electric energy into the light when the electric field is applied to the organic material. OLED is currently employed as a light source for the lighting tools because research has extensively progressed in the improvement of luminance, efficiency, and life time. OLED is widely used in the plate display device because of a simple manufacture process and high emitting efficiency. But most of OLED lighting projects were used the vacuum evaporator (thermal evaporator) with low molecular. Although printing method has lower efficiency and life time of OLED than vacuum evaporator method, projects of printing OLED actively are progressed because was possible to combine with flexible substrate and printing technology. Printing technology is ink-jet, screen printing and slot coating. This printing method allows for low cost and mass production techniques and large substrates. In this research, we have proposed inkjet printing for organic light-emitting devices has the dominant method of thick film deposition because of its low cost and simple processing. In this research, the fabrication of the passive matrix OLED is achieved by inkjet printing, using a polymer phosphorescent ink. We are measured optical and electrical characteristics of OLED.

Performance of the electrical generator cell by the ferrous alloys of printed circuit board scrap and Iron Metal 1020

Science.gov (United States)

Sahan, Y.; Sudarsono, S.; Silviana, E.; Chairul; Wisrayetti

2018-04-01

Galvani cell is one of thealternative energy. This cell can be used as an electric resources. In this research, the generator cell was designed and builds to generate the electric. The generator cell consisted of the iron metal 1020 were used as anode, the ferrous alloys of printed circuit board scrapwas then used as chatode, and NaCl solution as an electrolyte. The aim of this research is to estimate the performance of this generator cell by using variation of NaCl concentration (i.e. 1%, 3%, 5%, 7%, and 9%) with the electrodes pair ( 1 and 8 pairs). The performance of the cell was measured with a multi tester equipment and a LED bulb (5-watt 3Volt). The Results shown that the generator cell can produce the electric power of 3.679 Volt maximally by using NaCl 9% and 8 electrode pairs applied for this condition.

Printed strain sensors for early damage detection in engineering structures

Science.gov (United States)

Zymelka, Daniel; Yamashita, Takahiro; Takamatsu, Seiichi; Itoh, Toshihiro; Kobayashi, Takeshi

2018-05-01

In this paper, we demonstrate the analysis of strain measurements recorded using a screen-printed sensors array bonded to a metal plate and subjected to high strains. The analysis was intended to evaluate the capabilities of the printed strain sensors to detect abnormal strain distribution before actual defects (cracks) in the analyzed structures appear. The results demonstrate that the developed device can accurately localize the enhanced strains at the very early stage of crack formation. The promising performance and low fabrication cost confirm the potential suitability of the printed strain sensors for applications within the framework of structural health monitoring (SHM).

Experimental Investigation of Pool Boiling for Single and Double Heaters Using Printed Circuit Board

International Nuclear Information System (INIS)

Han, Won Seok; Lee, Jae Young

2012-01-01

Over the past several decades, a considerable number of studies have been conducted on boiling heat transfer in pool boiling. Boiling heat transfer is used in a variety of cooling applications, such as heat exchangers, high powered electronics, and nuclear reactors. Nucleate boiling is one of the most efficient heat transfer mechanisms in boiling regime, but it is imperative that the critical heat flux(CHF) should not be exceeded. CHF phenomenon leads to a dramatic rise in wall temperature, decreased heat transfer, and material failure. Although numerous attempts have been made by researchers to demonstrate the CHF, there is little agreement with the CHF mechanism. In recent years, many researchers have been focusing on surface condition using nanoparticles and surface enhancements, such as a micro structure and artificial cavities, due to enhancement of the CHF point. Cooke and Kandlikar used chips etched with microchannels to prove that these structure has the most enhancement effect. They found that the most efficient boiling surface is with a larger channel size and deep etch. The purpose of this paper is to evaluate the heat transfer and CHF of double heaters on printed circuit board(PCB) in pool boiling. In addition, bubble dynamics of nucleate boiling were observed with high speed observation on single and double heaters using PCB heater

Supergravity separation of Pb and Sn from waste printed circuit boards at different temperatures

Science.gov (United States)

Meng, Long; Wang, Zhe; Zhong, Yi-wei; Chen, Kui-yuan; Guo, Zhan-cheng

2018-02-01

Printed circuit boards (PCBs) contain many toxic substances as well as valuable metals, e.g., lead (Pb) and tin (Sn). In this study, a novel technology, named supergravity, was used to separate different mass ratios of Pb and Sn from Pb-Sn alloys in PCBs. In a supergravity field, the liquid metal phase can permeate from solid particles. Hence, temperatures of 200, 280, and 400°C were chosen to separate Pb and Sn from PCBs. The results depicted that gravity coefficient only affected the recovery rates of Pb and Sn, whereas it had little effect on the mass ratios of Pb and Sn in the obtained alloys. With an increase in gravity coefficient, the recovery values of Pb and Sn in each step of the separation process increased. In the single-step separation process, the mass ratios of Pb and Sn in Pb-Sn alloys were 0.55, 0.40, and 0.64 at 200, 280, and 400°C, respectively. In the two-step separation process, the mass ratios were 0.12 and 0.55 at 280 and 400°C, respectively. Further, the mass ratio was observed to be 0.76 at 400°C in the three-step separation process. This process provides an innovative approach to the recycling mechanism of Pb and Sn from PCBs.

Effects of Volar Tilt, Wrist Extension, and Plate Position on Contact Between Flexor Pollicis Longus Tendon and Volar Plate.

Science.gov (United States)

Wurtzel, Caroline N Wolfe; Burns, Geoffrey T; Zhu, Andy F; Ozer, Kagan

2017-12-01

Volar plates positioned at, or distal to, the watershed line have been shown to have a higher incidence of attritional rupture of the flexor pollicis longus (FPL). In this study, we aimed to evaluate the effect of wrist extension and volar tilt on the contact between the plate and the FPL tendon in a cadaver model. We hypothesized that, following volar plate application, loss of native volar tilt increases the contact between the FPL and the plate at lower degrees of wrist extension. A volar locking plate was applied on 6 fresh-frozen cadavers. To determine the contact between the plate and the FPL tendon, both structures were wrapped with copper wire and circuit conductivity was monitored throughout wrist motion. A lateral wrist radiograph was obtained at each circuit closure, indicating tendon-plate contact. Baseline measurements were obtained with plate positioned at Soong grades 0, 1, and 2. An extra-articular osteotomy was made and contact was recorded at various volar tilt angles (+5°, 0°, -5°, -10°, -15°, and -20°) in 3 different plate positions. A blinded observer measured the degree of wrist extension on all lateral radiographs. Data were analyzed using linear mixed-effects regression model. Plates placed distal to the watershed line had the most contact throughout wrist range of motion. Significantly, less wrist extension was required for contact in wrists with neutral or dorsal tilt and in distally placed volar plates. Volar tilt, wrist extension, and plate position were 3 independent risk factors determining contact between plate and tendon. Loss of volar tilt, increased wrist extension, and higher Soong grade plate position result in greater contact between wire-wrapped FPL tendon and plate. The FPL/plate contact chart generated in this study may be used to assess the risk of rupture in the clinical setting. Copyright © 2017 American Society for Surgery of the Hand. Published by Elsevier Inc. All rights reserved.

Feature-Learning-Based Printed Circuit Board Inspection via Speeded-Up Robust Features and Random Forest

Directory of Open Access Journals (Sweden)

Eun Hye Yuk

2018-06-01

Full Text Available With the coming of the 4th industrial revolution era, manufacturers produce high-tech products. As the production process is refined, inspection technologies become more important. Specifically, the inspection of a printed circuit board (PCB, which is an indispensable part of electronic products, is an essential step to improve the quality of the process and yield. Image processing techniques are utilized for inspection, but there are limitations because the backgrounds of images are different and the kinds of defects increase. In order to overcome these limitations, methods based on machine learning have been used recently. These methods can inspect without a normal image by learning fault patterns. Therefore, this paper proposes a method can detect various types of defects using machine learning. The proposed method first extracts features through speeded-up robust features (SURF, then learns the fault pattern and calculates probabilities. After that, we generate a weighted kernel density estimation (WKDE map weighted by the probabilities to consider the density of the features. Because the probability of the WKDE map can detect an area where the defects are concentrated, it improves the performance of the inspection. To verify the proposed method, we apply the method to PCB images and confirm the performance of the method.

Electrical Differentiation of Mesenchymal Stem Cells into Schwann-Cell-Like Phenotypes Using Inkjet-Printed Graphene Circuits.

Science.gov (United States)

Das, Suprem R; Uz, Metin; Ding, Shaowei; Lentner, Matthew T; Hondred, John A; Cargill, Allison A; Sakaguchi, Donald S; Mallapragada, Surya; Claussen, Jonathan C

2017-04-01

Graphene-based materials (GBMs) have displayed tremendous promise for use as neurointerfacial substrates as they enable favorable adhesion, growth, proliferation, spreading, and migration of immobilized cells. This study reports the first case of the differentiation of mesenchymal stem cells (MSCs) into Schwann cell (SC)-like phenotypes through the application of electrical stimuli from a graphene-based electrode. Electrical differentiation of MSCs into SC-like phenotypes is carried out on a flexible, inkjet-printed graphene interdigitated electrode (IDE) circuit that is made highly conductive (sheet resistance electrically stimulated/treated (etMSCs) display significant enhanced cellular differentiation and paracrine activity above conventional chemical treatment strategies [≈85% of the etMSCs differentiated into SC-like phenotypes with ≈80 ng mL -1 of nerve growth factor (NGF) secretion vs. 75% and ≈55 ng mL -1 for chemically treated MSCs (ctMSCs)]. These results help pave the way for in vivo peripheral nerve regeneration where the flexible graphene electrodes could conform to the injury site and provide intimate electrical simulation for nerve cell regrowth. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Electrical and Physical Property Characterization of Single Walled Carbon Nanotube Ink for Flexible Printed Electronics

Science.gov (United States)

2015-03-01

accurately can the 2 ink be printed? How well does the ink adhere to its substrate? How does the substrate affect the adhesion properties? In what...physical characteristics, some of which may be incompatible with inkjet printing, or the Dimatix DMP 2800 specifically. 3.2.1.2 Ink Solvent...The tape test is conducted by applying a flexible adhesive -backed polymer to the fully-dried printed circuit. The tape is then removed and analyzed

Separation of Cadmium in Printing Industrial Liquid Waste by Electromagnetic Plating System

International Nuclear Information System (INIS)

Prayitno

2007-01-01

To prevent incidence of environmental contamination and its effect to society health and other mortal, poisonous and dangerous substance waste have to be managed peculiarly by minimizing or eliminating the nature of its danger. Various processing have been developed to degrade the waste rate for example sorption, flotation, flocculation, etc., but the yield of the degradation of metal rate can not fulfill permanent standard quality of liquid waste. Because of the reason explained before, its important to make a new breakthrough as one of final phase processing alternative named reductant electromagnetic plating. Waste to be degraded in this research is cadmium. In fact cadmium represent the foregain metal for human and is not require at all in human body for metabolism process. Though plenty of cadmium exploited, but during for centuries it caused the food poisoned because this metal insoluble in organic acid. Separation of cadmium rate with electromagnetic plating influenced by time process, concentration, current strength, and type of electrode plate. Result of research indicate that the optimum time processing if using plate of copper electrode is during 30 minute and using plate of aluminium electrode is during 20 minute. Optimum of strong current that used in process of electromagnetic plating is only 0.8 Ampere and concentration effective is 5 mg / L. The most effective type of electrode plate for reducing cadmium from waste by using electromagnetic plating is aluminium. Appliance of electromagnetic plating system is very compatible used for the reduction of cadmium and others metal for feed concentration (1 - 5) mg/L .at the price efficiency of reduction is (95 - 98) %, standard quality of liquid waste is (0.05 - 1) mg/L. (author)

The Use of 3D Printing in the Development of Gaseous Radiation Detectors

Directory of Open Access Journals (Sweden)

Fargher Sam

2018-01-01

The 3D printed drift tube was printed using Polylactic acid to produce a gas volume in the shape of an inverted triangular prism; base length of 28 mm, height 24.25 mm and tube length 145 mm. A stainless steel anode wire was placed in the centre of the tube, mid-print. P5 gas (95% Argon, 5% Methane was used as the drift gas and a circuit was built to capacitively decouple signals from the high voltage. The signal rate and average pulse height of cosmic ray muons were measured over a range of bias voltages to characterise and prove correct operation of the printed detector.

Advanced engineering materials and thick film hybrid circuit technology

International Nuclear Information System (INIS)

Faisal, S.; Aslam, M.; Mehmood, K.

2006-01-01

The use of Thick Film hybrid Technology to manufacture electronic circuits and passive components continues to grow at rapid rate. Thick Film Technology can be viewed as a means of packaging active devices, spanning the gap between monolithic integrated circuit chips and printed circuit boards with attached active and passive components. An advancement in engineering materials has moved from a formulating art to a base of greater understanding of relationship of material chemistry to the details of electrical and mechanical performance. This amazing advancement in the field of engineering materials has brought us up to a magnificent standard that we are able to manufacture small size, low cost and sophisticated electronic circuits of Military, Satellite systems, Robotics, Medical and Telecommunications. (author)

Integrating integrated circuit chips on paper substrates using inkjet printed electronics

CSIR Research Space (South Africa)

Bezuidenhout, Petrone H

2016-11-01

Full Text Available This paper investigates the integration of silicon and paper substrates using rapid prototyping inkjet printed electronics. Various Dimatix DMP-2831 material printer settings and adhesives are investigated. The aim is to robustly and effectively...

How useful is 3D printing in maxillofacial surgery?

Science.gov (United States)

Louvrier, A; Marty, P; Barrabé, A; Euvrard, E; Chatelain, B; Weber, E; Meyer, C

2017-09-01

to follow any regulation. Nowadays, they are easily printed with low-cost printers. They allow for better preoperative planning and training for the procedures and for pre-shaping of plates. Occlusal splints and surgical guides are intended for the smooth transfer of planning to the operating room. They are considered to be MDs and even if they are easy to print, they have to follow the regulations applying to MDs. Patient specific implants (custom-made plates and skeletal reconstruction modules) are much more demanding objects and their manufacturing remains nowadays in the hands of the industry. The main limitation of in-hospital 3D printing is the restrictive regulations applying to MDs. The main limitations of professional 3D printing are the cost and the lead time. 3D printed objects are nowadays easily available in MFS. However, they will never replace a surgeon's skill and should only be considered as useful tools. Copyright © 2017 Elsevier Masson SAS. All rights reserved.

3D inkjet printed disposable environmental monitoring wireless sensor node

KAUST Repository

Farooqui, Muhammad Fahad

2017-10-24

We propose a disposable, miniaturized, moveable, fully integrated 3D inkjet-printed wireless sensor node for large area environmental monitoring applications. As a proof of concept, we show the wireless sensing of temperature, humidity and H2S levels which are important for early warnings of two critical environmental conditions namely forest fires and industrial gas leaks. The temperature sensor has TCR of -0.018/°, the highest of any inkjet-printed sensor and the H2S sensor can detect as low as 3 ppm of gas. These sensors and an antenna have been realized on the walls of a 3D-printed cubic package which encloses the microelectronics developed on a 3D-printed circuit board. Hence, 3D printing and inkjet printing have been combined in order to realize a unique low-cost, fully integrated wireless sensor node. Field tests show that these sensor nodes can wirelessly communicate up to a distance of over 100m. Our proposed sensor node can be a part of internet of things with the aim of providing a better and safe living.

An Investigation on the Extraction and Quantitation of a Hexavalent Chromium in Acrylonitrile Butadiene Styrene Copolymer (ABS) and Printed Circuit Board (PCB) by Ion Chromatography Coupled with Inductively Coupled Plasma Atomic Emission Spectrometry

Energy Technology Data Exchange (ETDEWEB)

Nam, Sang Ho; Kim, Yu Na [Mokpo National University, Muan (Korea, Republic of)

2012-06-15

A hexavalent chromium (Cr (VI)) is one of the hazardous substances regulated by the RoHS. The determination of Cr (VI) in various polymers and printed circuit board (PCB) has been very important. In this study, the three different analytical methods were investigated for the determination of a hexavalent chromium in Acrylonitrile Butadiene Styrene copolymer (ABS) and PCB. The results by three analytical methods were obtained and compared. An analytical method by UV-Visible spectrometer has been generally used for the determination of Cr (VI) in a sample, but a hexavalent chromium should complex with diphenylcarbazide for the detection in the method. The complexation did make an adverse effect on the quantitative analysis of Cr (VI) in ABS. The analytical method using diphenylcarbazide was also not applicable to printed circuit board (PCB) because PCB contained lots of irons. The irons interfered with the analysis of hexavalent chromium because those also could complex with diphenylcarbazide. In this study, hexavalent chromiums in PCB have been separated by ion chromatography (IC), then directly and selectively detected by inductively coupled plasma atomic emission spectrometry (ICP-AES). The quantity of Cr (VI) in PCB was 0.1 mg/kg

Substrate optimization for integrated circuit antennas

OpenAIRE

Alexopoulos, N. G.; Katehi, P. B.; Rutledge, D. B.

1982-01-01

Imaging systems in microwaves, millimeter and submillimeter wave applications employ printed circuit antenna elements. The effect of substrate properties is analyzed in this paper by both reciprocity theorem as well as integral equation approach for infinitesimally short as well as finite length dipole and slot elements. Radiation efficiency and substrate surface wave guidance is studied for practical substrate materials as GaAs, Silicon, Quartz and Duroid.

OptoZIF Drive: a 3D printed implant and assembly tool package for neural recording and optical stimulation in freely moving mice

Science.gov (United States)

Freedman, David S.; Schroeder, Joseph B.; Telian, Gregory I.; Zhang, Zhengyang; Sunil, Smrithi; Ritt, Jason T.

2016-12-01

Objective. Behavioral neuroscience studies in freely moving rodents require small, light-weight implants to facilitate neural recording and stimulation. Our goal was to develop an integrated package of 3D printed parts and assembly aids for labs to rapidly fabricate, with minimal training, an implant that combines individually positionable microelectrodes, an optical fiber, zero insertion force (ZIF-clip) headstage connection, and secondary recording electrodes, e.g. for electromyography (EMG). Approach. Starting from previous implant designs that position recording electrodes using a control screw, we developed an implant where the main drive body, protective shell, and non-metal components of the microdrives are 3D printed in parallel. We compared alternative shapes and orientations of circuit boards for electrode connection to the headstage, in terms of their size, weight, and ease of wire insertion. We iteratively refined assembly methods, and integrated additional assembly aids into the 3D printed casing. Main results. We demonstrate the effectiveness of the OptoZIF Drive by performing real time optogenetic feedback in behaving mice. A novel feature of the OptoZIF Drive is its vertical circuit board, which facilities direct ZIF-clip connection. This feature requires angled insertion of an optical fiber that still can exit the drive from the center of a ring of recording electrodes. We designed an innovative 2-part protective shell that can be installed during the implant surgery to facilitate making additional connections to the circuit board. We use this feature to show that facial EMG in mice can be used as a control signal to lock stimulation to the animal’s motion, with stable EMG signal over several months. To decrease assembly time, reduce assembly errors, and improve repeatability, we fabricate assembly aids including a drive holder, a drill guide, an implant fixture for microelectode ‘pinning’, and a gold plating fixture. Significance. The

DC arc plasma disposal of printed circuit board

International Nuclear Information System (INIS)

Huang Jianjun; Shenzhen Univ., Shenzhen; Shi Jiabiao; Meng Yuedong; Liu Zhengzhi

2004-01-01

A new solid waste disposal technology setup with DC arc plasma is presented. Being different from conventional combustion or burning such as incineration, it is based on a process called controlled high-temperature pyrolysis, the thermal destruction and recovery process. The results of vitrification of the circuit board are presented. The properties of vitrified product including hardness and leaching test results are presented. The final product (vitrified material) and air emission from the plasma treatment is environmentally acceptable. (authors)

Liquid oil and residual characteristics of printed circuit board recycle by pyrolysis

Energy Technology Data Exchange (ETDEWEB)

Lin, Kuo-Hsiung [Department of Environmental Engineering and Science, Fooyin University, Kaohsiung, Taiwan (China); Chiang, Hung-Lung, E-mail: hlchiang@mail.cmu.edu.tw [Department of Health Risk Management, China Medical University, Taichung, Taiwan (China)

2014-04-01

Highlights: • Pyrolysis is a technology for recycling of the non-metal fraction of PCBs. • Liquid product constituents were analyzed for PCB pyrolysis. • Water-soluble ionic species were determined for PCB pyrolysis exhaust. - Abstract: Non-metal fractions of waste printed circuit boards (PCBs) were thermally treated (200–500 °C) under nitrogen atmosphere. Carbon, hydrogen, and nitrogen were determined by elemental analyzer, bromine by instrumental neutron activation analysis (INAA), phosphorus by energy dispersive X-ray spectrometer (EDX), and 29 trace elements by inductively coupled plasma atomic emission spectrometer (ICP-AES) and mass spectrometry (ICP-MS) for raw material and pyrolysis residues. Organic compositions of liquid oil were identified by GC (gas chromatography)–MS, trace element composition by ICP system, and 12 water-soluble ions by IC (ionic chromatography). Elemental content of carbon was >450 mg/g, oxygen 300 mg/g, bromine and hydrogen 60 mg/g, nitrogen 30 mg/g, and phosphorus 28 mg/g. Sulfur was trace in PCBs. Copper content was 25–28 mg/g, iron 1.3–1.7 mg/g, tin 0.8–1.0 mg/g and magnesium 0.4–1.0 mg/g; those were the main metals in the raw materials and pyrolytic residues. In the liquid products, carbon content was 68–73%, hydrogen was 10–14%, nitrogen was 4–5%, and sulfur was less than 0.05% at pyrolysis temperatures from 300 to 500 °C. Phenol, 3-bromophenol, 2-methylphenol and 4-propan-2-ylphenol were major species in liquid products, accounting for >50% of analyzed organic species. Bromides, ammonium and phosphate were the main species in water sorption samples for PCB pyrolysis exhaust.

Built-in unit with short-circuit insulation for hermetic cable ducts

International Nuclear Information System (INIS)

Tschacher, B.; Gurr, W.; Kusserow, J.; Katzmarek, W.

1984-01-01

The invention concerns a built-in unit with short-circuit insulation for hermetic cable ducts, especially for containments of nuclear power reactors. The short-circuit insulation is achieved by an insulation plate made from radiation-resistant insulating materials of high mechanical strength

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

Energy Technology Data Exchange (ETDEWEB)

Fogarasi, Szabolcs [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [“Babeş-Bolyai” University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [“Babeş-Bolyai” University, Faculty of Chemistry and Chemical Engineering, Department of Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

2014-05-01

Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples.

Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation

International Nuclear Information System (INIS)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Árpád; Ilea, Petru

2014-01-01

Highlights: • We developed a mediated electrochemical process for electronic waste treatment. • We achieved the simultaneous recovery of copper and gold enrichment. • Process scale up was realized based on the optimal values of operating parameters. • The waste does not require mechanical pretreatment in the scaled process. • The process proved to be efficient and eco-friendly as well. - Abstract: The present study aims to develop an eco-friendly chemical–electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04 wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75 kW h/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples

Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates

KAUST Repository

Kim, Sangkil; Shamim, Atif; Georgiadis, Apostolos; Aubert, Herve; Tentzeris, Manos M.

2016-01-01

In this paper, a novel fully inkjet-printed via fabrication technology and various inkjet-printed substrate-integrated waveguide (SIW) structures on thick polymer substrates are presented. The electrical properties of polymethyl methacrylate (PMMA) are thoroughly studied up to 8 GHz utilizing the T-resonator method, and inkjet-printable silver nanoparticle ink on PMMA is characterized. A long via fabrication process up to 1 mm utilizing inkjet-printing technology is demonstrated, and its characteristics are presented for the first time. The inkjet-printed vias on 0.8-mm-thick substrate have a resistance of ∼ 0.2~ Ω . An equivalent circuit model of the inkjet-printed stepped vias is also discussed. An inkjet-printed microstrip-to-SIW interconnect and an SIW cavity resonator utilizing the proposed inkjet-printed via fabrication process are also presented. The design of the components and the fabrication steps are discussed, and the measured performances over the microwave frequency range of the prototypes are presented.

Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates

KAUST Repository

Kim, Sangkil

2016-02-11

In this paper, a novel fully inkjet-printed via fabrication technology and various inkjet-printed substrate-integrated waveguide (SIW) structures on thick polymer substrates are presented. The electrical properties of polymethyl methacrylate (PMMA) are thoroughly studied up to 8 GHz utilizing the T-resonator method, and inkjet-printable silver nanoparticle ink on PMMA is characterized. A long via fabrication process up to 1 mm utilizing inkjet-printing technology is demonstrated, and its characteristics are presented for the first time. The inkjet-printed vias on 0.8-mm-thick substrate have a resistance of ∼ 0.2~ Ω . An equivalent circuit model of the inkjet-printed stepped vias is also discussed. An inkjet-printed microstrip-to-SIW interconnect and an SIW cavity resonator utilizing the proposed inkjet-printed via fabrication process are also presented. The design of the components and the fabrication steps are discussed, and the measured performances over the microwave frequency range of the prototypes are presented.

Maskless, parallel patterning with zone-plate array lithography

International Nuclear Information System (INIS)

Carter, D. J. D.; Gil, Dario; Menon, Rajesh; Mondol, Mark K.; Smith, Henry I.; Anderson, Erik H.

1999-01-01

Zone-plate array lithography (ZPAL) is a maskless lithography scheme that uses an array of shuttered zone plates to print arbitrary patterns on a substrate. An experimental ultraviolet ZPAL system has been constructed and used to simultaneously expose nine different patterns with a 3x3 array of zone plates in a quasidot-matrix fashion. We present exposed patterns, describe the system design and construction, and discuss issues essential to a functional ZPAL system. We also discuss another ZPAL system which operates with 4.5 nm x radiation from a point source. We present simulations which show that, with our existing x-ray zone plates and this system, we should be able to achieve 55 nm resolution. (c) 1999 American Vacuum Society

Automated inspection of intaglio plate measurement for U.S. currency

Science.gov (United States)

Grimsley, Max; Hess, James E.; Poulsen, Mark; Rankin, Ken; Curtis, David; Bayer, Donald

2002-04-01

The United States Bureau of Engraving and Printing (BEP) is tasked with the function of producing billions of banknotes each year to be used by the general public throughout the world. Individual notes must maintain uniform consistency for both security features and print quality. The quality control process necessary to assure the uniform nature of United States currency requires a significant multi-tiered approach. Based on innovative opto-electronic techniques, individual security features are examined as a critical element during each phase of the production process. Print quality standards must also be strictly maintained and monitored to assure the uniformity of the most popular printed item in the world. This presentation describes the approach and some of the techniques developed and implemented within the BEP to carry out the necessary monitoring and control of the quality of intaglio currency printing plates.

Decal electronics for printed high performance cmos electronic systems

KAUST Repository

Hussain, Muhammad Mustafa

2017-11-23

High performance complementary metal oxide semiconductor (CMOS) electronics are critical for any full-fledged electronic system. However, state-of-the-art CMOS electronics are rigid and bulky making them unusable for flexible electronic applications. While there exist bulk material reduction methods to flex them, such thinned CMOS electronics are fragile and vulnerable to handling for high throughput manufacturing. Here, we show a fusion of a CMOS technology compatible fabrication process for flexible CMOS electronics, with inkjet and conductive cellulose based interconnects, followed by additive manufacturing (i.e. 3D printing based packaging) and finally roll-to-roll printing of packaged decal electronics (thin film transistors based circuit components and sensors) focusing on printed high performance flexible electronic systems. This work provides the most pragmatic route for packaged flexible electronic systems for wide ranging applications.

Comparative study on copper leaching from waste printed circuit boards by typical ionic liquid acids.

Science.gov (United States)

Chen, Mengjun; Huang, Jinxiu; Ogunseitan, Oladele A; Zhu, Nengming; Wang, Yan-min

2015-07-01

Waste printed circuit boards (WPCBs) are attracting increasing concerns because the recovery of its content of valuable metallic resources is hampered by the presence of hazardous substances. In this study, we used ionic liquids (IL) to leach copper from WPCBs. [BSO3HPy]OTf, [BSO3HMIm]OTf, [BSO4HPy]HSO4, [BSO4HMim]HSO4 and [MIm]HSO4 were selected. Factors that affect copper leaching rate were investigated in detail and their leaching kinetics were also examined with the comparison of [Bmim]HSO4. The results showed that all six IL acids could successfully leach copper out, with near 100% recovery. WPCB particle size and leaching time had similar influences on copper leaching performance, while IL acid concentration, hydrogen peroxide addition, solid to liquid ratio, temperature, showed different influences. Moreover, IL acid with HSO4(-) was more efficient than IL acid with CF3SO3(-). These six IL acids indicate a similar behavior with common inorganic acids, except temperature since copper leaching rate of some IL acids decreases with its increase. The results of leaching kinetics studies showed that diffusion plays a more important role than surface reaction, whereas copper leaching by inorganic acids is usually controlled by surface reaction. This innovation provides a new option for recovering valuable materials such as copper from WPCBs. Copyright © 2015 Elsevier Ltd. All rights reserved.

Modeling a Printed Circuit Heat Exchanger with RELAP5-3D for the Next Generation Nuclear Plant

International Nuclear Information System (INIS)

2010-01-01

The main purpose of this report is to design a printed circuit heat exchanger (PCHE) for the Next Generation Nuclear Plant and carry out Loss of Coolant Accident (LOCA) simulation using RELAP5-3D. Helium was chosen as the coolant in the primary and secondary sides of the heat exchanger. The design of PCHE is critical for the LOCA simulations. For purposes of simplicity, a straight channel configuration was assumed. A parallel intermediate heat exchanger configuration was assumed for the RELAP5 model design. The RELAP5 modeling also required the semicircular channels in the heat exchanger to be mapped to rectangular channels. The initial RELAP5 run outputs steady state conditions which were then compared to the heat exchanger performance theory to ensure accurate design is being simulated. An exponential loss of pressure transient was simulated. This LOCA describes a loss of coolant pressure in the primary side over a 20 second time period. The results for the simulation indicate that heat is initially transferred from the primary loop to the secondary loop, but after the loss of pressure occurs, heat transfers from the secondary loop to the primary loop.

TIME CALIBRATED OSCILLOSCOPE SWEEP CIRCUIT

Science.gov (United States)

Smith, V.L.; Carstensen, H.K.

1959-11-24

An improved time calibrated sweep circuit is presented, which extends the range of usefulness of conventional oscilloscopes as utilized for time calibrated display applications in accordance with U. S. Patent No. 2,832,002. Principal novelty resides in the provision of a pair of separate signal paths, each of which is phase and amplitude adjustable, to connect a high-frequency calibration oscillator to the output of a sawtooth generator also connected to the respective horizontal deflection plates of an oscilloscope cathode ray tube. The amplitude and phase of the calibration oscillator signals in the two signal paths are adjusted to balance out feedthrough currents capacitively coupled at high frequencies of the calibration oscillator from each horizontal deflection plate to the vertical plates of the cathode ray tube.

[Application and outlook of three-dimensional printing in prosthetic dentistry].

Science.gov (United States)

Sun, Y C; Li, R; Zhou, Y S; Wang, Y

2017-06-09

At present, three-dimensional (3D) printing has been applied in many aspects in the field of prosthodontics, such as dental models, wax patterns, guide plates, dental restoration and customized implants. The common forming principles include light curing, sintering and melting-condensation, the materials include pure wax, resin, metal and ceramics. However, the printing precision and the strength of multi-material integrated forming, remains to be improved. In addition, as a technology by which the internal structure of a material can be customized manufacturing, further advantage of 3D printing used in the manufacture of dental restoration lies in the customization functional bionic micro-structures, but the related research is still in its infancy. The review briefly summarizes the commonly used 3D printing crafts in prosthetic dentistry, and details clinical applications and evaluations, provides references for clinical decision and further research.

Rapid Prototyping by 3D Printing for Advanced Radio Communications at 80 GHz and Above

DEFF Research Database (Denmark)

Salazar, Adrian Ruiz; Rommel, Simon; Anufriyev, Eldar

2016-01-01

This paper discusses the potential of 3D printing for the manufacturing of spiral phase plates for the generation of radio vortex beams for advanced radio communications. The design and prototyping of a number of phase plates for communications at 80GHz with radio vortex beams is discussed...

Review of the Potential of the Ni/Cu Plating Technique for Crystalline Silicon Solar Cells

Directory of Open Access Journals (Sweden)

Atteq ur Rehman

2014-02-01

Full Text Available Developing a better method for the metallization of silicon solar cells is integral part of realizing superior efficiency. Currently, contact realization using screen printing is the leading technology in the silicon based photovoltaic industry, as it is simple and fast. However, the problem with metallization of this kind is that it has a lower aspect ratio and higher contact resistance, which limits solar cell efficiency. The mounting cost of silver pastes and decreasing silicon wafer thicknesses encourages silicon solar cell manufacturers to develop fresh metallization techniques involving a lower quantity of silver usage and not relying pressing process of screen printing. In recent times nickel/copper (Ni/Cu based metal plating has emerged as a metallization method that may solve these issues. This paper offers a detailed review and understanding of a Ni/Cu based plating technique for silicon solar cells. The formation of a Ni seed layer by adopting various deposition techniques and a Cu conducting layer using a light induced plating (LIP process are appraised. Unlike screen-printed metallization, a step involving patterning is crucial for opening the masking layer. Consequently, experimental procedures involving patterning methods are also explicated. Lastly, the issues of adhesion, back ground plating, process complexity and reliability for industrial applications are also addressed.

Measuring the layer-average volumetric water content in the uppermost 5 cm of soil using printed circuit board TDR probes

International Nuclear Information System (INIS)

Wang, W.; Kobayashi, T.; Chikushi, J.

2000-01-01

Newly designed printed circuit board TDR probes (PCBPs) were made, and they were calibrated by indoor experiment. A regression equation for estimating the volumetric water content from the dielectric constant measured with the PCBP was determined, which is almost the same as the well-known Topp's equation when the soil is rather wet while the difference becomes larger as the soil dries. The PCBP was designed to measure the average water content over a soil layer 5 cm thick because the thickness of soil layer involved in measuring water content by microwave remote sensing is several centimeters. A comparison experiment of measurements with PCBPs and those by microwave remote sensing was conducted in an arid area in the northwest of China. The results of this experiment show that the newly designed TDR probe is promising as the sensor to get ground truth of the surface wetness. This paper describes only the calibration of probes and the observations taken using them

Evaluation of a recycling process for printed circuit board by physical separation and heat treatment

International Nuclear Information System (INIS)

Fujita, Toyohisa; Ono, Hiroyuki; Dodbiba, Gjergj; Yamaguchi, Kunihiko

2014-01-01

Highlights: • The parts mounted on printed circuit board (PCB) were liberated by underwater explosion and mechanical crushing. • The crushed PCB without surface-mounted parts was carbonized under inert atmosphere at 873 K to recover copper. • The multi-layered ceramic capacitors including nickel was carbonized at 873 K to recover nickel by the magnetic separation. • The tantalum powders were recovered from the molded resins by heat treatment at 723 and 823 K in air atmosphere and screening. • Energy and treatment cost of new process increased, however, the environmental burden decreased comparing conventional one. - Abstract: Printed circuit boards (PCBs) from discarded personal computer (PC) and hard disk drive were crushed by explosion in water or mechanical comminution in order to disintegrate the attached parts. More parts were stripped from PCB of PC, composed of epoxy resin; than from PCB of household appliance, composed of phenol resin. In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 873–1073 K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment. As one of the mounted parts, the multi-layered ceramic capacitors (MLCCs), which contain nickel, were carbonized at 873 K. The magnetic separation is carried out at a lower magnetic field strength of 0.1 T and then at 0.8 T. In the +0.5 mm size fraction the nickel grade in magnetic product was increased from 0.16% to 6.7% and the nickel recovery is 74%. The other useful mounted parts are tantalum capacitors. The tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins

The performance of silicon solar cells prepared by screen-printing technique

International Nuclear Information System (INIS)

Mursyidah; Mohamed Yahaya; Muhammad Mohd Salleh

2000-01-01

Screen-printing technique is known to produce low cost solar cells. A study has been done to prepare silicon solar cells of n + -p and n + -p-p + structures. The p-type silicon wafers were used as substrates. The phosphorous layer was deposited on top of the substrate using the screen-printing technique. The wafer was then annealed at temperature 1000 degree C for 10 minutes, so that phosphorous atoms are thermally diffused into the wafer to form an n + -p junction. Meanwhile the boron film was deposited at the back surface of the substrate and annealed at temperature 900 degree C for 10 minutes to form a p + layer in the n + -p-p + device. The back and front metal contacts were made using screen-printing technique. The performance of the devices was evaluated from I-V curves measured in the dark and under illumination. It was found that the n + -p-p + device with short circuit current, I SC = 32 mA, open circuit voltage, V OC = 0.46 volt, fill factor, FF=0.63 and efficiency, η = 2.3%, was better than that of the n + -p device. The performance of the n + -p-p + device was successfully improved by depositing titanium dioxide on top of the device as anti-reflection coating using the screen-printing technique. The improved performance was I SC = 38 mA, V OC = 0.48 volt, FF = 0.67 and η = 3. 1%. (Author)

Experiences with the ASDEX neutralizer plates and construction of water-cooled plates for long-pulse heating

International Nuclear Information System (INIS)

Rapp, H.; Niedermeyer, H.; Kornherr, M.

1987-01-01

After dismantling of the titanium neutralizer plates inspection yielded satisfactory status of flat areas whereas edges and curved shapes were heavily melted. At the inner plates of the lower divertor strongly focused melting and cutting was found which is caused by fast electrons. These electrons are continuously produced. The production mechanism is not yet clear but runaway processes can be excluded. With long-pulse additional heating of 6 MW/10s as planned for ASDEX in 1987, the total energy delivered to the plasma will increase by a factor of 30. Therefore new water-cooled neutralizer plates have been constructed which consist of a copper-steel compound. The construction principle and the topology of the cooling circuits is presented

Ink for Ink-Jet Printing of Electrically Conductive Structures on Flexible Substrates with Low Thermal Resistance

Science.gov (United States)

Mościcki, A.; Smolarek-Nowak, A.; Felba, J.; Kinart, A.

2017-07-01

The development of new technologies in electronics related to flexible polymeric substrates forces the industry to introduce suitable tools (special type of dispensers) and modern conductive materials for printing electronic circuits. Moreover, due to the wide use of inexpensive polymeric foils (polyethene, PE, or poly(ethylene terephthalate), PET), there is a need to develop materials with the lowest possible processing temperatures. The present paper presents the selection criteria of suitable components and their preparation for obtaining electrically conductive ink with a special nanosilver base. In the case of the discussed solution, all components allow to make circuits in relatively low sintering temperature (even below 130°C). Additionally, the authors show the most significant ink parameters that should be taken into consideration during Research and Development (R&D) works with electrically conductive inks. Moreover, ink stability parameters are discussed and some examples of printed circuits are presented.

Characterization and Processing Behavior of Heated Aluminum-Polycarbonate Composite Build Plates for the FDM Additive Manufacturing Process

Directory of Open Access Journals (Sweden)

Sherri L. Messimer

2018-02-01

Full Text Available One of the most essential components of the fused deposition modeling (FDM additive manufacturing (AM process is the build plate, the surface upon which the part is constructed. These are typically made from aluminum or glass, but there are clear disadvantages to both and restrictions on which materials can be processed on them successfully. This study examined the suitability of heated aluminum-polycarbonate (AL-PC composite print beds for FDM, looking particularly at the mechanical properties, thermal behavior, deformation behavior, bonding strength with deposited material, printing quality, and range of material usability. Theoretical examination and physical experiments were performed for each of these areas; the results were compared to similar experiments done using heated aluminum and aluminum-glass print beds. Ten distinct materials (ABS, PLA, PET, HIPS, PC, TPU, PVA, nylon, metal PLA, and carbon-fiber PLA were tested for printing performance. The use of a heated AL-PC print bed was found to be a practical option for most of the materials, particularly ABS and TPU, which are often challenging to process using traditional print bed types. Generally, the results were found to be equivalent to or superior to tempered glass and superior to standard aluminum build plates in terms of printing capability.

Printed Nano Cu and NiSi Contacts and Metallization for Solar Cell Modules

Energy Technology Data Exchange (ETDEWEB)

Carmody, Michael John [Intrinsiq Materials Inc., Rochester, NY (United States)

2017-10-11

There has long been a desire to replace the front-side silver contacts in silicon solar cells. There are two driving forces to do this. First, silver is an expensive precious metal. Secondly, the process to use silver requires that it be formulated into screen print pastes that need a lead-containing glass frit, and the use of lead is forbidden in many parts of the world. Because of the difficulty in replacing these pastes and the attendant processes, lead exemptions have granted to solar cells. Copper has been the replacement metal of choice because it is significantly cheaper than silver and is very close to silver in electrical conductivity. Using processes which do not use lead, obviates it as an environmental contaminant. However, copper cannot be in contact with the silicon of the cell since it migrates through the silicon and causes defects which severely damage the efficiency of the cell. Hence, a conductive barrier must be placed between the copper and silicon and nickel, and especially nickel silicide, have been shown to be materials of choice. However, nickel must be sputtered and annealed to create the nickel silicide barrier, and copper has either been sputtered or plated. All of these processes require expensive, specialized equipment and plating uses environmentally unfriendly chemicals. Therefore, Intrinsiq proposed using printed nano nickel silicide ink (which we had previously invented) and printed nano copper ink to create these electrodes and barriers. We found that nano copper ink could be readily printed and sintered under a reducing atmosphere to give highly conductive grids. We further showed that nano nickel silicide ink could be readily jetted into grids on top of the silicon cell. It could then be annealed to create a barrier. However, it was found that the combination of printed NiSi and printed Cu did not give contact resistivity good enough to produce efficient cells. Only plated copper on top of the printed NiSi gave useful contact

Modelling of CMUTs with Anisotropic Plates

DEFF Research Database (Denmark)

la Cour, Mette Funding; Christiansen, Thomas Lehrmann; Jensen, Jørgen Arendt

2012-01-01

Traditionally, CMUTs are modelled using the isotropic plate equation and this leads to deviations between analytical calculations and FEM simulations. In this paper, the deflection profile and material parameters are calculated using the anisotropic plate equation. It is shown that the anisotropic...... calculations match perfectly with FEM while an isotropic approach causes up to 10% deviations in deflection profile. Furthermore, we show how commonly used analytic modelling methods such as static calculations of the pull-in voltage and dynamic modelling through an equivalent circuit representation can...

Digital power and performance analysis of inkjet printed ring oscillators based on electrolyte-gated oxide electronics

Science.gov (United States)

Cadilha Marques, Gabriel; Garlapati, Suresh Kumar; Dehm, Simone; Dasgupta, Subho; Hahn, Horst; Tahoori, Mehdi; Aghassi-Hagmann, Jasmin

2017-09-01

Printed electronic components offer certain technological advantages over their silicon based counterparts, like mechanical flexibility, low process temperatures, maskless and additive manufacturing possibilities. However, to be compatible to the fields of smart sensors, Internet of Things, and wearables, it is essential that devices operate at small supply voltages. In printed electronics, mostly silicon dioxide or organic dielectrics with low dielectric constants have been used as gate isolators, which in turn have resulted in high power transistors operable only at tens of volts. Here, we present inkjet printed circuits which are able to operate at supply voltages as low as ≤2 V. Our transistor technology is based on lithographically patterned drive electrodes, the dimensions of which are carefully kept well within the printing resolutions; the oxide semiconductor, the electrolytic insulator and the top-gate electrodes have been inkjet printed. Our inverters show a gain of ˜4 and 2.3 ms propagation delay time at 1 V supply voltage. Subsequently built 3-stage ring oscillators start to oscillate at a supply voltage of only 0.6 V with a frequency of ˜255 Hz and can reach frequencies up to ˜350 Hz at 2 V supply voltage. Furthermore, we have introduced a systematic methodology for characterizing ring oscillators in the printed electronics domain, which has been largely missing. Benefiting from this procedure, we are now able to predict the switching capacitance and driver capability at each stage, as well as the power consumption of our inkjet printed ring oscillators. These achievements will be essential for analyzing the performance and power characteristics of future inkjet printed digital circuits.

Efficient Design of Flexible and Low Cost Paper-Based Inkjet-Printed Antenna

Directory of Open Access Journals (Sweden)

A. M. Mansour

2015-01-01

Full Text Available A new, efficient, flexible, and cheap antenna designed at 1.57 GHz microstrip patch antenna based on simple inkjet printer with improved performance using silver nanoparticles ink is developed. The antenna is printed on a kind of flexible substrate “glossy paper,” to offer the advantage of light and flexibility for different applications. The performance of silver nanoparticles ink has been studied through inkjet printing versus postsynthesis annealing and multilayer printing. The conductivity has been improved to have promising values up to 2 Ω/cm at temperatures up to 180°C. The surface morphology of the circuits has been analyzed using SEM with mean diameter of the nanoparticles around 100 nm, uniform surface distribution, and mean thickness of the printed layer around 230 microns. Also, a simple design of a coplanar waveguide (CPW monopole Z-shaped antenna has been considered as an application of fabricated printed antenna using the studied silver nanoparticles ink through a cheap printer.

Fabrication and optimisation of a fused filament 3D-printed microfluidic platform

International Nuclear Information System (INIS)

Tothill, A M; Partridge, M; James, S W; Tatam, R P

2017-01-01

A 3D-printed microfluidic device was designed and manufactured using a low cost ($2000) consumer grade fusion deposition modelling (FDM) 3D printer. FDM printers are not typically used, or are capable, of producing the fine detailed structures required for microfluidic fabrication. However, in this work, the optical transparency of the device was improved through manufacture optimisation to such a point that optical colorimetric assays can be performed in a 50 µ l device. A colorimetric enzymatic cascade assay was optimised using glucose oxidase and horseradish peroxidase for the oxidative coupling of aminoantipyrine and chromotropic acid to produce a blue quinoneimine dye with a broad absorbance peaking at 590 nm for the quantification of glucose in solution. For comparison the assay was run in standard 96 well plates with a commercial plate reader. The results show the accurate and reproducible quantification of 0–10 mM glucose solution using a 3D-printed microfluidic optical device with performance comparable to that of a plate reader assay. (paper)

Removal of organic compounds from wastewater originating from the production of printed circuit boards by UV-Fenton method

Directory of Open Access Journals (Sweden)

Thomas Maciej

2017-12-01

Full Text Available The possibility of removing organic compounds from wastewater originating from the photochemical production of printed circuit boards by use of waste acidification and disposal of precipitated photopolymer in the first stage and the UV-Fenton method in a second stage has been presented. To optimize the process of advanced oxidation, the RSM (Response Surface Methodology for three independent factors was applied, i.e. pH, the concentration of Fe(II and H2O2 concentration. The use of optimized values of individual parameters in the process of wastewater treatment caused a decrease in the concentration of the organic compounds denoted as COD by approx. 87% in the first stage and approx. 98% after application of both processes. Precipitation and the decomposition of organic compounds was associated with a decrease of wastewater COD to below 100 mg O2/L whereas the initial value was 5550 mg O2/L. Decomposition of organic compounds and verification of the developed model of photopolymers removal was also carried out with use of alternative H2O2 sources i.e. CaO2, MgO2, and Na2CO3·1,5H2O2.

Recovery of copper and lead from waste printed circuit boards by supercritical water oxidation combined with electrokinetic process

International Nuclear Information System (INIS)

Xiu Furong; Zhang Fushen

2009-01-01

An effective and benign process for copper and lead recovery from waste printed circuit boards (PCBs) was developed. In the process, the PCBs was pre-treated in supercritical water, then subjected to electrokinetic (EK) process. Experimental results showed that supercritical water oxidation (SCWO) process was strong enough to decompose the organic compounds of PCBs, and XRD spectra indicated that copper and lead were oxidized into CuO, Cu 2 O and β-PbO 2 in the process. The optimum SCWO treatment conditions were 60 min, 713 K, 30 MPa, and EK treatment time, constant current density were 11 h, 20 mA cm -2 , respectively. The recovery percentages of copper and lead under optimum SCWO + EK treatment conditions were around 84.2% and 89.4%, respectively. In the optimized EK treatment, 74% of Cu was recovered as a deposit on the cathode with a purity of 97.6%, while Pb was recovered as concentrated solutions in either anode (23.1%) or cathode (66.3%) compartments but little was deposited on the electrodes. It is believed that the process is effective and practical for Cu and Pb recovery from waste electric and electronic equipments.

Plate heat exchangers in the power plant industry

International Nuclear Information System (INIS)

Wersel, M.; Ridell, B.

1984-01-01

An increase in heat transfer and stability, small investment, high flexibility, easy maintenance and corrosion resistance are obtained by the design and construction of plate heat exchangers and by the introduction of the herringbone pattern. The plate heat exchanger can be used in nearly 90% of all secondary circuits in powerstations. Examples of its installation are the WYLFA, GENTILLY, RINGHALS and TVO Finland nuclear power-stations. (DG) [de

Water Activated Graphene Oxide Transfer Using Wax Printed Membranes for Fast Patterning of a Touch Sensitive Device.

Science.gov (United States)

Baptista-Pires, Luis; Mayorga-Martínez, Carmen C; Medina-Sánchez, Mariana; Montón, Helena; Merkoçi, Arben

2016-01-26

We demonstrate a graphene oxide printing technology using wax printed membranes for the fast patterning and water activation transfer using pressure based mechanisms. The wax printed membranes have 50 μm resolution, longtime stability and infinite shaping capability. The use of these membranes complemented with the vacuum filtration of graphene oxide provides the control over the thickness. Our demonstration provides a solvent free methodology for printing graphene oxide devices in all shapes and all substrates using the roll-to-roll automatized mechanism present in the wax printing machine. Graphene oxide was transferred over a wide variety of substrates as textile or PET in between others. Finally, we developed a touch switch sensing device integrated in a LED electronic circuit.

Packaging strategy for maximizing the performance of a screen printed piezoelectric energy harvester

International Nuclear Information System (INIS)

Zhang, Z; Zhu, D; Tudor, M J; Beeby, S P

2013-01-01

This paper reports the extended design and simulation of a screen printed piezoelectric energy harvester. The proposed design was based on a previous credit card sized smart tag sensor node, and packages the power conditioning circuit in the free space above the tungsten proof mass layer. This approach enables electronic components to be mounted onto the cantilever beam, which provides additional weight at the tip of the cantilever structure. The design structure contains a T-shape cantilever beam with size of 47 mm × 30 mm × 0.85 mm which is fabricated using screen printing. ANSYS simulation results predict the revised architecture can generate 421.9 μW approximately twice of the RMS power produced by the original design along with a higher open-circuit RMS Voltage of 8.0 V while the resonant frequency is dropped to 53.4 Hz

Improved Manufacturing Performance of Screen Printed Carbon Electrodes through Material Formulation.

Science.gov (United States)

Jewell, Eifion; Philip, Bruce; Greenwood, Peter

2016-06-27

Printed carbon graphite materials are the primary common component in the majority of screen printed sensors. Screen printing allows a scalable manufacturing solution, accelerating the means by which novel sensing materials can make the transition from laboratory material to commercial product. A common bottleneck in any thick film printing process is the controlled drying of the carbon paste material. A study has been undertaken which examines the interaction between material solvent, printed film conductivity and process consistency. The study illustrates that it is possible to reduce the solvent boiling point to significantly increase process productivity while maintaining process consistency. The lower boiling point solvent also has a beneficial effect on the conductivity of the film, reducing the sheet resistance. It is proposed that this is a result of greater film stressing increasing charge percolation through greater inter particle contact. Simulations of material performance and drying illustrate that a multi layered printing provides a more time efficient manufacturing method. The findings have implications for the volume manufacturing of the carbon sensor electrodes but also have implications for other applications where conductive carbon is used, such as electrical circuits and photovoltaic devices.

Occurrences and inventories of heavy metals and brominated flame retardants in wastes from printed circuit board production.

Science.gov (United States)

Zhou, Xiaoyu; Guo, Jie; Zhang, Wei; Zhou, Peng; Deng, Jingjing; Lin, Kuangfei

2014-09-01

Pollutants including heavy metals and brominated flame retardant were detected in 10 types of production wastes from a typical printed circuit board manufacturing plant, and their inventories were estimated. Rinsing water from etching process had the highest concentrations of copper (665.51 mg/L), lead (1.02 mg/L), nickel (3.60 mg/L), chromium (0.97 mg/L), and tin (1.79 mg/L). Powdered solid waste (SW) from the cut lamination process contained the highest tetrabromobisphenol-A (TBBPA) levels (49.86 mg/kg). Polybrominated diphenyl ethers (PBDEs) were absent in this plant, in agreement with the international regulations of PBDE phase out. The pollutant inventories in the wastes exhibited in the order of copper > > zinc > tin ≈ nickel > lead > chromium > > TBBPA. The potential environmental impact of pollutants in SW during production and disposal were further investigated. A high partitioning of pollutant concentration between the total suspended particle and SW (-0.10 < log K TS < 2.12) was observed for most pollutants, indicating the emission pathway from SW to the airborne atmosphere in the workshop. Although SW met the toxicity characteristic leaching procedure, drilling powder with the smallest particle diameter still showed high leachabilities of lead and tin which may lead to a negative environmental impact during disposal.

Preparation of hierarchical porous carbon from waste printed circuit boards for high performance electric double-layer capacitors

Science.gov (United States)

Du, Xuan; Wang, Li; Zhao, Wei; Wang, Yi; Qi, Tao; Li, Chang Ming

2016-08-01

Renewable clean energy and resources recycling have become inevitable choices to solve worldwide energy shortages and environmental pollution problems. It is a great challenge to recycle tons of waste printed circuit boards (PCB) produced every year for clean environment while creating values. In this work, low cost, high quality activated carbons (ACs) were synthesized from non-metallic fractions (NMF) of waste PCB to offer a great potential for applications of electrochemical double-layer capacitors (EDLCs). After recovering metal from waste PCB, hierarchical porous carbons were produced from NMF by carbonization and activation processes. The experimental results exhibit that some pores were formed after carbonization due to the escape of impurity atoms introduced by additives in NMF. Then the pore structure was further tailored by adjusting the activation parameters. Roles of micropores and non-micropores in charge storage were investigated when the hierarchical porous carbons were applied as electrode of EDLCs. The highest specific capacitance of 210 F g-1 (at 50 mA g-1) and excellent rate capability were achieved when the ACs possessing a proper micropores/non-micropores ratio. This work not only provides a promising method to recycle PCB, but also investigates the structure tailoring arts for a rational hierarchical porous structure in energy storage/conversion.

Novel Application of Glass Fibers Recovered From Waste Printed Circuit Boards as Sound and Thermal Insulation Material

Science.gov (United States)

Sun, Zhixing; Shen, Zhigang; Ma, Shulin; Zhang, Xiaojing

2013-10-01

The aim of this study is to investigate the feasibility of using glass fibers, a recycled material from waste printed circuit boards (WPCB), as sound absorption and thermal insulation material. Glass fibers were obtained through a fluidized-bed recycling process. Acoustic properties of the recovered glass fibers (RGF) were measured and compared with some commercial sound absorbing materials, such as expanded perlite (EP), expanded vermiculite (EV), and commercial glass fiber. Results show that RGF have good sound absorption ability over the whole tested frequency range (100-6400 Hz). The average sound absorption coefficient of RGF is 0.86, which is prior to those of EP (0.81) and EV (0.73). Noise reduction coefficient analysis indicates that the absorption ability of RGF can meet the requirement of II rating for sound absorbing material according to national standard. The thermal insulation results show that RGF has a fair low thermal conductivity (0.046 W/m K), which is comparable to those of some insulation materials (i.e., EV, EP, and rock wool). Besides, an empirical dependence of thermal conductivity on material temperature was determined for RGF. All the results showed that the reuse of RGF for sound and thermal insulation material provided a promising way for recycling WPCB and obtaining high beneficial products.

Experimental and CFD Analysis of Printed Circuit Heat Exchanger for Supercritical CO{sub 2} Power Cycle Application

Energy Technology Data Exchange (ETDEWEB)

Baik, Seungjoon; Kim, Hyeon Tae; Kim, Seong Gu; Lee, Jekyoung; Lee, Jeong Ik [KAIST, Daejeon (Korea, Republic of)

2015-10-15

The supercritical carbon dioxide (S-CO{sub 2}) power cycle has been suggested as an alternative for the SFR power generation system. First of all, relatively mild sodium-CO{sub 2} interaction can reduce the accident probability. Also the S-CO{sub 2} power conversion cycle can achieve high efficiency with SFR core thermal condition. Moreover, the S-CO{sub 2} power cycle can reduce cycle footprint due to high density of the working fluid. Recently, various compact heat exchangers have been studied for developing an optimal heat exchanger. In this paper, the printed circuit heat exchanger was selected for S-CO{sub 2} power cycle applications and was closely investigated experimentally and analytically. Recently, design and performance prediction of PCHE received attention due to its importance in high pressure power systems such as S-CO{sub 2} cycle. To evaluate a PCHE performance with CO{sub 2} to water, KAIST research team designed and tested a lab-scale PCHE. From the experimental data and CFD analysis, pressure drop and heat transfer correlations are obtained. For the CFD analysis, Ansys-CFX commercial code was utilized with RGP table implementation. In near future, the turbulence model sensitivity study will be followed.

3D-Printed Disposable Wireless Sensors with Integrated Microelectronics for Large Area Environmental Monitoring

KAUST Repository

Farooqui, Muhammad Fahad

2017-05-19

Large area environmental monitoring can play a crucial role in dealing with crisis situations. However, it is challenging as implementing a fixed sensor network infrastructure over large remote area is economically unfeasible. This work proposes disposable, compact, dispersible 3D-printed wireless sensor nodes with integrated microelectronics which can be dispersed in the environment and work in conjunction with few fixed nodes for large area monitoring applications. As a proof of concept, the wireless sensing of temperature, humidity, and H2S levels are shown which are important for two critical environmental conditions namely forest fires and industrial leaks. These inkjet-printed sensors and an antenna are realized on the walls of a 3D-printed cubic package which encloses the microelectronics developed on a 3D-printed circuit board. Hence, 3D printing and inkjet printing are uniquely combined in order to realize a low-cost, fully integrated wireless sensor node.

Eco-friendly copper recovery process from waste printed circuit boards using Fe³⁺/Fe²⁺ redox system.

Science.gov (United States)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Egedy, Attila; Imre-Lucaci, Árpád; Ilea, Petru

2015-06-01

The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe(3+) combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%. Copyright © 2015 Elsevier Ltd. All rights reserved.

Simple and Environmentally Friendly Fabrication of Superhydrophobic Alkyl Ketene Dimer Coated MALDI Concentration Plates.

Science.gov (United States)

Romson, Joakim; Jacksén, Johan; Emmer, Åsa

2017-08-01

Here we present a method to manufacture peptide-concentrating MALDI-plates with alkyl ketene dimer (AKD) as a new superhydrophobic coating. The fabrication of the hydrophobic plates included application of AKD by airbrush, and negative contact printing to generate the concentration sites. Deposited sample droplets were contained within the prestructured sites, and self-adjusted onto the site if slightly misplaced. No AKD contamination was observed, and the plates could easily be cleaned and regenerated. The S/N values for four model peptides was about twice as high compared with a standard steel plate and a commercial concentration plate. Graphical Abstract ᅟ.

Simple and Environmentally Friendly Fabrication of Superhydrophobic Alkyl Ketene Dimer Coated MALDI Concentration Plates

Science.gov (United States)

Romson, Joakim; Jacksén, Johan; Emmer, Åsa

2017-08-01

Here we present a method to manufacture peptide-concentrating MALDI-plates with alkyl ketene dimer (AKD) as a new superhydrophobic coating. The fabrication of the hydrophobic plates included application of AKD by airbrush, and negative contact printing to generate the concentration sites. Deposited sample droplets were contained within the prestructured sites, and self-adjusted onto the site if slightly misplaced. No AKD contamination was observed, and the plates could easily be cleaned and regenerated. The S/N values for four model peptides was about twice as high compared with a standard steel plate and a commercial concentration plate.

Low-Cost Manufacturing of Bioresorbable Conductors by Evaporation-Condensation-Mediated Laser Printing and Sintering of Zn Nanoparticles.

Science.gov (United States)

Shou, Wan; Mahajan, Bikram K; Ludwig, Brandon; Yu, Xiaowei; Staggs, Joshua; Huang, Xian; Pan, Heng

2017-07-01

Currently, bioresorbable electronic devices are predominantly fabricated by complex and expensive vacuum-based integrated circuit (IC) processes. Here, a low-cost manufacturing approach for bioresorbable conductors on bioresorbable polymer substrates by evaporation-condensation-mediated laser printing and sintering of Zn nanoparticle is reported. Laser sintering of Zn nanoparticles has been technically difficult due to the surface oxide on nanoparticles. To circumvent the surface oxide, a novel approach is discovered to print and sinter Zn nanoparticle facilitated by evaporation-condensation in confined domains. The printing process can be performed on low-temperature substrates in ambient environment allowing easy integration on a roll-to-roll platform for economical manufacturing of bioresorbable electronics. The fabricated Zn conductors show excellent electrical conductivity (≈1.124 × 10 6 S m -1 ), mechanical durability, and water dissolvability. Successful demonstration of strain gauges confirms the potential application in various environmentally friendly sensors and circuits. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

The resistive plate WELL detector as a single stage thick gaseous multiplier detector

Energy Technology Data Exchange (ETDEWEB)

Bressler, Shikma; Breskin, Amos; Moleri, Luca; Kumar, Ashwini; Pitt, Michael [Department of Particle Physics and Astrophysics, Weizmann Institute of Science (WIS) (Israel); Kudella, Simon [Institut fuer Experimentelle Kernphysik (IEKP), KIT (Germany)

2015-07-01

Gaseous Electron Multiplier (GEM) detector use high electric fields inside the h ole of a foil to achieve a high charge multiplication. As a thicker version of G EMs based on printed circuit board (PCB) structures, Thick Gaseous Electron Multiplier (THGEM) detectors combine the high gain of a GEM foil with the robustness, stability and low production costs of a PCB and allow a large quantity of applications that require the coverage of a large area at low cost and moderate spatial resolution. One application the Weizmann Institute of Science (WIS) develops as a member of the RD51 framework is the Resistive Plate WELL (RPWELL) detector. This single stage detector allows a very stable, discharge free operation at high gain (10{sup 5}). The single stage operation allows a low total height and make s the RPWELL a candidate for the Digital Hadronic Calorimeter (DHCAL) of the International Large Detector (ILD) at the International Linear Collider (ILC). The talk gives an insight into the way the RPWELL works and shows results from the last test beam.

Fixing a fractured arthrodesed hip with rapid prototype templating and minimal invasive plate osteosynthesis

Directory of Open Access Journals (Sweden)

Christian Fang

2015-12-01

Full Text Available CASE:: We present an elderly lady with an intertrochanteric fracture of a previously fused hip. A 3D printed model of her pelvis and femur was used for implant templating before surgery. Minimal invasive fixation was performed with a spanning reversed distal femur locking plate without the need for removal of the previous implant. Multiple long locking screws were placed in the supra-acetabular region. The patient had union in 4 months, return to function and no complication. Conclusion:: The technique allowed us to optimize implant selection and insert screws safely at difficult trajectories using minimal invasive surgery. Keywords: Hip fusion, Fracture, Plating, Minimal invasive, 3D printing

Series Resistance Analysis of Passivated Emitter Rear Contact Cells Patterned Using Inkjet Printing

Directory of Open Access Journals (Sweden)

Martha A. T. Lenio

2012-01-01

Full Text Available For higher-efficiency solar cell structures, such as the Passivated Emitter Rear Contact (PERC cells, to be fabricated in a manufacturing environment, potentially low-cost techniques such as inkjet printing and metal plating are desirable. A common problem that is experienced when fabricating PERC cells is low fill factors due to high series resistance. This paper identifies and attempts to quantify sources of series resistance in inkjet-patterned PERC cells that employ electroless or light-induced nickel-plating techniques followed by copper light-induced plating. Photoluminescence imaging is used to determine locations of series resistance losses in these inkjet-patterned and plated PERC cells.

Printing Electronic Components from Copper-Infused Ink and Thermoplastic Mediums

Science.gov (United States)

Flowers, Patrick F.

The demand for printable electronics has sharply increased in recent years and is projected to continue to rise. Unfortunately, electronic materials which are suitable for desired applications while being compatible with available printing techniques are still often lacking. This thesis addresses two such challenging areas. In the realm of two-dimensional ink-based printing of electronics, a major barrier to the realization of printable computers that can run programs is the lack of a solution-coatable non-volatile memory with performance metrics comparable to silicon-based devices. To address this deficiency, I developed a nonvolatile memory based on Cu-SiO2 core-shell nanowires that can be printed from solution and exhibits on-off ratios of 106, switching speeds of 50 ns, a low operating voltage of 2 V, and operates for at least 104 cycles without failure. Each of these metrics is similar to or better than Flash memory (the write speed is 20 times faster than Flash). Memory architectures based on the individual memory cells demonstrated here could enable the printing of the more complex, embedded computing devices that are expected to make up an internet of things. Recently, the exploration of three-dimensional printing techniques to fabricate electronic materials began. A suitable general-purpose conductive thermoplastic filament was not available, however. In this work I examine the current state of conductive thermoplastic filaments, including a newly-released highly conductive filament that my lab has produced which we call Electrifi. I focus on the use of dual-material fused filament fabrication (FFF) to 3D print electronic components (conductive traces, resistors, capacitors, inductors) and circuits (a fully-printed high-pass filter). The resistivity of traces printed from conductive thermoplastic filaments made with carbon-black, graphene, and copper as conductive fillers was found to be 12, 0.78, and 0.014 ohm cm, respectively, enabling the creation of

High-performance all-printed amorphous oxide FETs and logics with electronically compatible electrode/ channel interface.

Science.gov (United States)

Sharma, Bhupendra Kumar; Stoesser, Anna; Mondal, Sandeep Kumar; Garlapati, Suresh K; Fawey, Mohammed H; Chakravadhanula, Venkata Sai Kiran; Kruk, Robert; Hahn, Horst; Dasgupta, Subho

2018-06-12

Oxide semiconductors typically show superior device performance compared to amorphous silicon or organic counterparts, especially, when they are physical vapor deposited. However, it is not easy to reproduce identical device characteristics when the oxide field-effect transistors (FETs) are solution-processed/ printed; the level of complexity further intensifies with the need to print the passive elements as well. Here, we developed a protocol for designing the most electronically compatible electrode/ channel interface based on the judicious material selection. Exploiting this newly developed fabrication schemes, we are now able to demonstrate high-performance all-printed FETs and logic circuits using amorphous indium-gallium-zinc oxide (a-IGZO) semiconductor, indium tin oxide (ITO) as electrodes and composite solid polymer electrolyte as the gate insulator. Interestingly, all-printed FETs demonstrate an optimal electrical performance in terms of threshold voltages and device mobility and may very well be compared with devices fabricated using sputtered ITO electrodes. This observation originates from the selection of electrode/ channel materials from the same transparent semiconductor oxide family, resulting in the formation of In-Sn-Zn-O (ITZO) based diffused a-IGZO/ ITO interface that controls doping density while ensuring high electrical performance. Compressive spectroscopic studies reveal that Sn doping mediated excellent band alignment of IGZO with ITO electrodes is responsible for the excellent device performance observed. All-printed n-MOS based logic circuits have also been demonstrated towards new-generation portable electronics.

Design of organic complementary circuits and systems on foil

CERN Document Server

Abdinia, Sahel; Cantatore, Eugenio

2015-01-01

This book describes new approaches to fabricate complementary organic electronics, and focuses on the design of circuits and practical systems created using these manufacturing approaches. The authors describe two state-of-the-art, complementary organic technologies, characteristics and modeling of their transistors and their capability to implement circuits and systems on foil. Readers will benefit from the valuable overview of the challenges and opportunities that these extremely innovative technologies provide. ·         Demonstrates first circuits implemented using specific complementary organic technologies, including first printed analog to digital converter, first dynamic logic on foil and largest complementary organic circuit ·         Includes step-by-step design from single transistor level to complete systems on foil ·         Provides a platform for comparing state-of-the-art complementary organic technologies and for comparing these with other similar technologies, spec...

3D printing facilitated scaffold-free tissue unit fabrication

International Nuclear Information System (INIS)

Tan, Yu; Richards, Dylan J; Mei, Ying; Trusk, Thomas C; Visconti, Richard P; Yost, Michael J; Drake, Christopher J; Argraves, William Scott; Markwald, Roger R; Kindy, Mark S

2014-01-01

Tissue spheroids hold great potential in tissue engineering as building blocks to assemble into functional tissues. To date, agarose molds have been extensively used to facilitate fusion process of tissue spheroids. As a molding material, agarose typically requires low temperature plates for gelation and/or heated dispenser units. Here, we proposed and developed an alginate-based, direct 3D mold-printing technology: 3D printing microdroplets of alginate solution into biocompatible, bio-inert alginate hydrogel molds for the fabrication of scaffold-free tissue engineering constructs. Specifically, we developed a 3D printing technology to deposit microdroplets of alginate solution on calcium containing substrates in a layer-by-layer fashion to prepare ring-shaped 3D hydrogel molds. Tissue spheroids composed of 50% endothelial cells and 50% smooth muscle cells were robotically placed into the 3D printed alginate molds using a 3D printer, and were found to rapidly fuse into toroid-shaped tissue units. Histological and immunofluorescence analysis indicated that the cells secreted collagen type I playing a critical role in promoting cell–cell adhesion, tissue formation and maturation. (paper)

Structuring of conductive silver line by electrohydrodynamic jet printing and its electrical characterization

International Nuclear Information System (INIS)

Lee, Dae-Young; Lee, Jae-Chang; Shin, Yun-Soo; Park, Sung-Eun; Kim, Yong-Jun; Hwang, Jungho; Yu, Tae-U

2008-01-01

A set of silver lines with a few hundred nanometers in thickness and with a few hundred micrometers in width were obtained using the electrohydrodynamic jet printing. The lines exhibited about three times higher resistivity (4.8 μΩcm) than that of bulk silver after thermal sintering process. The characteristic impedance of the silver line was about 18 Ω while the value calculated was 20 Ω. This paper demonstrated the possibility of using electrohydrodynamic jet printing of silver nanoparticles to obtain conductive line onto circuit boards.

Co-recycling of acrylonitrile-butadiene-styrene waste plastic and nonmetal particles from waste printed circuit boards to manufacture reproduction composites.

Science.gov (United States)

Sun, Zhixing; Shen, Zhigang; Zhang, Xiaojing; Ma, Shulin

2015-01-01

This study investigated the feasibility of using acrylonitrile-butadiene-styrene (ABS) waste plastic and nonmetal particles from waste printed circuit boards (WPCB) to manufacture reproduction composites (RC), with the aim of co-recycling these two waste resources. The composites were prepared in a twin-crew extruder and investigated by means of mechanical testing, in situ flexural observation, thermogravimatric analysis, and dimensional stability evaluation. The results showed that the presence of nonmetal particles significantly improved the mechanical properties and the physical performance of the RC. A loading of 30 wt% nonmetal particles could achieve a flexural strength of 72.6 MPa, a flexural modulus of 3.57 GPa, and an impact strength of 15.5 kJ/m2. Moreover, it was found that the application of maleic anhydride-grafted ABS as compatilizer could effectively promote the interfacial adhesion between the ABS plastic and the nonmetal particles. This research provides a novel method to reuse waste ABS and WPCB nonmetals for manufacturing high value-added product, which represents a promising way for waste recycling and resolving the environmental problem.

Progress in 3D Printing of Carbon Materials for Energy-Related Applications.

Science.gov (United States)

Fu, Kun; Yao, Yonggang; Dai, Jiaqi; Hu, Liangbing

2017-03-01

The additive-manufacturing (AM) technique, known as three-dimensional (3D) printing, has attracted much attention in industry and academia in recent years. 3D printing has been developed for a variety of applications. Printable inks are the most important component for 3D printing, and are related to the materials, the printing method, and the structures of the final 3D-printed products. Carbon materials, due to their good chemical stability and versatile nanostructure, have been widely used in 3D printing for different applications. Good inks are mainly based on volatile solutions having carbon materials as fillers such as graphene oxide (GO), carbon nanotubes (CNT), carbon blacks, and solvent, as well as polymers and other additives. Studies of carbon materials in 3D printing, especially GO-based materials, have been extensively reported for energy-related applications. In these circumstances, understanding the very recent developments of 3D-printed carbon materials and their extended applications to address energy-related challenges and bring new concepts for material designs are becoming urgent and important. Here, recent developments in 3D printing of emerging devices for energy-related applications are reviewed, including energy-storage applications, electronic circuits, and thermal-energy applications at high temperature. To close, a conclusion and outlook are provided, pointing out future designs and developments of 3D-printing technology based on carbon materials for energy-related applications and beyond. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Integrated electric circuit CAD system in Minolta Camera Co. Ltd

Energy Technology Data Exchange (ETDEWEB)

Nakagami, Tsuyoshi; Hirata, Sumiaki; Matsumura, Fumihiko

1988-08-26

Development background, fundamental concept, details and future plan of the integrated electric circuit CAD system for OA equipment are presented. The central integrated database is basically intended to store experiences or know-hows, to cover the wide range of data required for designs, and to provide a friendly interface. This easy-to-use integrated database covers the drawing data, parts information, design standards, know-hows and system data. The system contains the circuit design function to support drawing circuit diagrams, the wiring design function to support the wiring and arrangement of printed circuit boards and various parts integratedly, and the function to verify designs, to make full use of parts or technical information, to maintain the system security. In the future, as the system will be wholly in operation, the design period reduction, quality improvement and cost saving will be attained by this integrated design system. (19 figs, 2 tabs)

3D printing in orthognathic surgery - A literature review.

Science.gov (United States)

Lin, Hsiu-Hsia; Lonic, Daniel; Lo, Lun-Jou

2018-07-01

With the recent advances in three-dimensional (3D) imaging, computer-assisted surgical planning and simulation are now regularly used for analysis of craniofacial structures and improved prediction of surgical outcomes in orthognathic surgery. A variety of patient-specific surgical guides and devices have been designed and manufactured using 3D printing technology, which rapidly gained widespread popularity to improve the outcomes. The article presents an overview of 3D printing technology for state-of-the-art application in orthognathic surgery and discusses the impacts on treatment feasibility and patient outcome. The current available literature regarding the use of 3D printing methods in orthognathic surgery including 3D computer-aided design/computer-aided manufacturing, rapid prototyping, additive manufacturing, 3D printing, 3D printed models, surgical occlusal splints, custom-made guides, templates and fixation plates is reviewed. A Medline, PubMed, ProQuest and ScienceDirect search was performed to find relevant articles over the past 10 years. A total of 318 articles were found, out of which 69 were publications addressing the topic of this study. An additional 9 hand-searched articles were added. From the review, we can conclude that the use of 3D printing methods in orthognathic surgery provide the benefit of optimal functional and aesthetic results, patient satisfaction, and precise translation of the treatment plan. Copyright © 2018. Published by Elsevier B.V.

Morphology, mechanical and thermal oxidative aging properties of HDPE composites reinforced by nonmetals recycled from waste printed circuit boards.

Science.gov (United States)

Yang, Shuangqiao; Bai, Shibing; Wang, Qi

2016-11-01

In this study nonmetals recycled from waste printed circuit boards (NPCB) is used as reinforce fillers in high-density polyethylene (HDPE) composites. The morphology, mechanical and thermal oxidative aging properties of NPCB reinforced HDPE composites are assessed and it compared with two other commercial functional filler for the first time. Mechanical test results showed that NPCB could be used as reinforcing fillers in the HDPE composites and mechanical properties especially for stiffness is better than other two commercial fillers. The improved mechanical property was confirmed by the higher aspect ratio and strong interfacial adhesion in scanning electron microscopy (SEM) studies. The heat deflection temperature (HDT) test showed the presence of fiberglass in NPCB can improve the heat resistance of composite for their potential applications. Meanwhile, the oxidation induction time (OIT) and the Fourier transform infrared (FTIR) spectroscopy results showed that NPCB has a near resistance to oxidation as two other commercial fillers used in this paper. The above results show the reuse of NPCB in the HDPE composites represents a promising way for resolving both the environmental pollution and the high-value reuse of resources. Copyright © 2015. Published by Elsevier Ltd.

Effects of smoke on functional circuits

International Nuclear Information System (INIS)

Tanaka, T.J.

1997-10-01

Nuclear power plants are converting to digital instrumentation and control systems; however, the effects of abnormal environments such as fire and smoke on such systems are not known. There are no standard tests for smoke, but previous smoke exposure tests at Sandia National Laboratories have shown that digital communications can be temporarily interrupted during a smoke exposure. Another concern is the long-term corrosion of metals exposed to the acidic gases produced by a cable fire. This report documents measurements of basic functional circuits during and up to 1 day after exposure to smoke created by burning cable insulation. Printed wiring boards were exposed to the smoke in an enclosed chamber for 1 hour. For high-resistance circuits, the smoke lowered the resistance of the surface of the board and caused the circuits to short during the exposure. These circuits recovered after the smoke was vented. For low-resistance circuits, the smoke caused their resistance to increase slightly. A polyurethane conformal coating substantially reduced the effects of smoke. A high-speed digital circuit was unaffected. A second experiment on different logic chip technologies showed that the critical shunt resistance that would cause failure was dependent on the chip technology and that the components used in the smoke exposures were some of the most smoke tolerant. The smoke densities in these tests were high enough to cause changes in high impedance (resistance) circuits during exposure, but did not affect most of the other circuits. Conformal coatings and the characteristics of chip technologies should be considered when designing circuitry for nuclear power plant safety systems, which must be highly reliable under a variety of operating and accident conditions. 10 refs., 34 figs., 18 tabs

A screen-printed circular-type paper-based glucose/O2 biofuel cell

Science.gov (United States)

Shitanda, Isao; Nohara, Saki; Hoshi, Yoshinao; Itagaki, Masayuki; Tsujimura, Seiya

2017-08-01

The printable paper-based enzymatic biofuel cell (PBFC) to directly power small devices is an important objective for realizing cost-effective and disposable energy harvesting devices. In the present study, a screen-printed circular-type PBFC, composed of a series of 5 individual cells, was constructed. The PBFC exhibited the open circuit potential of 2.65 V and maximum power of 350 μW at 1.55 V, which were sufficient to illuminate an LED without requiring a booster circuit. The output voltage of this PBFC can also be easily adjusted as required.

Real-time monitoring system for improving corona electrostatic separation in the process of recovering waste printed circuit boards.

Science.gov (United States)

Li, Jia; Zhou, Quan; Xu, Zhenming

2014-12-01

Although corona electrostatic separation is successfully used in recycling waste printed circuit boards in industrial applications, there are problems that cannot be resolved completely, such as nonmetal particle aggregation and spark discharge. Both of these problems damage the process of separation and are not easy to identify during the process of separation in industrial applications. This paper provides a systematic study on a real-time monitoring system. Weight monitoring systems were established to continuously monitor the separation process. A Virtual Instrumentation program written by LabVIEW was utilized to sample and analyse the mass increment of the middling product. It includes four modules: historical data storage, steady-state analysis, data computing and alarm. Three kinds of operating conditions were used to verify the applicability of the monitoring system. It was found that the system achieved the goal of monitoring during the separation process and realized the function of real-time analysis of the received data. The system also gave comprehensible feedback on the accidents of material blockages in the feed inlet and high-voltage spark discharge. With the warning function of the alarm system, the whole monitoring system could save the human cost and help the new technology to be more easily applied in industry. © The Author(s) 2014.

Structural assessment of intermediate printed circuit heat exchanger for sodium-cooled fast reactor with supercritical CO2 cycle

International Nuclear Information System (INIS)

Lee, Youho; Lee, Jeong Ik

2014-01-01

Highlights: • We numerically model PCHE stress arising from pressure, and thermal loadings. • Stress levels are the highest around S-CO 2 channels, due to high pressure of S-CO 2 . • The conventional analytic models for PCHE underestimate actual stress levels. • Plasticity sufficiently lowers stress levels at channel tips. • PCHE for SFR-SCO 2 is anticipated to assure compliance with ASME design standards. - Abstract: Structural integrity of intermediate Printed Circuit Heat Exchanger (PCHE) for Sodium-cooled Fast Reactor (SFR) attached to Supercritical CO 2 (S-CO 2 ) is investigated. ANSYS-Mechanical was used to simulate stress fields of representative PCHE channels, with temperature fields imported from FLUENT simulation. Mechanical stress induced by pressure loading is found to be the primary source of stress. As plasticity sufficiently lowers local stress concentration at PCHE channel tips, PCHE type intermediate heat exchangers made of SS316 are anticipated to reliably assure compliance with design standards prescribed in the ASME standards, thanks to the structure temperature that is below the effective creep inducing point. The actual life time of PCHE for SFR-SCO 2 is likely to be affected by mechanical behavior change of SS316 with reactions with S-CO 2 and fatigue

Comprehensive characterization of printed circuit boards of various end-of-life electrical and electronic equipment for beneficiation investigation.

Science.gov (United States)

Anshu Priya; Hait, Subrata

2018-05-01

Comprehensive characterization of printed circuit board (PCB) of end-of-life electrical and electronic equipment (EEE) is obligatory for prospective profitable beneficiation. In this study, beneficiation oriented comprehensive characterization of two brands of PCBs each of 16 end-of-life EEE was conducted in terms of their physicochemical characteristics with special emphasis on the content of 16 general elements, 2 precious metals and 15 rare earth elements (REEs). General elements and their highest weight percent composition found in different PCBs of the EEEs were Cu (23% in laptop), Al (6% in computer), Pb (15% in DVD player) and Ba (7% in TV). The high abundant of precious metals such as Au (316 g/ton) and Ag (636 g/ton) in mobile phone and laptop, respectively coupled with rapid obsolescence age makes waste PCBs of information technology and telecommunication equipment the most potent resource reservoir. Additionally, most of the waste PCBs were observed to contain REEs in considerable quantity with Sc up to 31 g/ton and Ce up to 13 g/ton being the major constituents. Comprehensive characterization of waste PCBs therefore will systematically help towards better understanding of e-waste recycling processes for beneficiation purpose and sustainable resource circulation and conservation. Copyright © 2018 Elsevier Ltd. All rights reserved.

3D printed System-on-Package (SoP) for environmental sensing and localization applications

KAUST Repository

Zhen, Su

2017-12-22

This paper presents for the first time an innovative 3D printed SoP sensor node with temperature, pressure and humidity sensing capabilities. It has an integrated wireless readout through a near isotropic (900MHz) GSM antenna-on-package. This sensor node is connected to the internet for remote monitoring and has the capability of localization. The paper presents the design of antenna-on-package as well as details of the communication and localization system. Fabrication challenges unique to 3D printing and integration of electronics on 3D printed circuit board are also discussed. Finally, the paper presents measurement results of antenna radiation pattern, return loss, localization accuracy and accuracy of sensing parameters.

Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

Science.gov (United States)

Mallik, S.; Bauer, R.; Hübner, F.; Ekere, N. N.

2011-01-01

Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

Laser printed interconnects for flexible electronics

Science.gov (United States)

Pique, Alberto; Beniam, Iyoel; Mathews, Scott; Charipar, Nicholas

Laser-induced forward transfer (LIFT) can be used to generate microscale 3D structures for interconnect applications non-lithographically. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or dispersed metallic nanoparticles. However, the resulting 3D structures do not achieve the bulk conductivity of metal interconnects of the same cross-section and length as those formed by wire bonding or tab welding. It is possible, however, to laser transfer entire structures using a LIFT technique known as lase-and-place. Lase-and-place allows whole components and parts to be transferred from a donor substrate onto a desired location with one single laser pulse. This talk will present the use of LIFT to laser print freestanding solid metal interconnects to connect individual devices into functional circuits. Furthermore, the same laser can bend or fold the thin metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief due to flexing or thermal mismatch. Examples of these laser printed 3D metallic bridges and their role in the development of next generation flexible electronics by additive manufacturing will be presented. This work was funded by the Office of Naval Research (ONR) through the Naval Research Laboratory Basic Research Program.

Screen printing technology applied to silicon solar cell fabrication

Science.gov (United States)

Thornhill, J. W.; Sipperly, W. E.

1980-01-01

The process for producing space qualified solar cells in both the conventional and wraparound configuration using screen printing techniques was investigated. Process modifications were chosen that could be easily automated or mechanized. Work was accomplished to optimize the tradeoffs associated with gridline spacing, gridline definition and junction depth. An extensive search for possible front contact metallization was completed. The back surface field structures along with the screen printed back contacts were optimized to produce open circuit voltages of at least an average of 600 millivolts. After all intended modifications on the process sequence were accomplished, the cells were exhaustively tested. Electrical tests at AMO and 28 C were made before and after boiling water immersion, thermal shock, and storage under conditions of high temperature and high humidity.

Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB).

Science.gov (United States)

Lee, Jaeryeong; Kim, Youngjin; Lee, Jae-chun

2012-11-30

Although printed circuit boards (PCBs) contain various elements, only the major elements (i.e., those with content levels in wt% or over grade) of and precious metals (e.g., Ag, Au, and platinum groups) contained within PCBs can be recycled. To recover other elements from PCBs, the PCBs should be properly disassembled as the first step of the recycling process. The recovery of these other elements would be beneficial for efforts to conserve scarce resources, reuse electric/electronic components (EECs), and eliminate environmental problems. This paper examines the disassembly of EECs from wasted PCBs (WPCBs) and the physical separation of these EECs using a self-designed disassembling apparatus and a 3-step separation process of sieving, magnetic separation, and dense medium separation. The disassembling efficiencies were evaluated by using the ratio of grinding area (E(area)) and the weight ratio of the detached EECs (E(weight)). In the disassembly treatment, these efficiencies were improved with an increase of grinder speed and grinder height. 97.7% (E(area)) and 98% (E(weight)) could be accomplished ultimately by 3 repetitive treatments at a grinder speed of 5500 rpm and a grinder height of 1.5mm. Through a series of physical separations, most groups of the EECs (except for the diode, transistor, and IC chip groups) could be sorted at a relatively high separation efficiency of about 75% or more. To evaluate the separation efficiency with regard to the elemental composition, the distribution ratio (R(dis)) and the concentration ratio (R(conc)) were used. 15 elements could be separated with the highest R(dis) and R(conc) in the same separated division. This result implies that the recyclability of the elements is highly feasible, even though the initial content in EECs is lower than several tens of mg/kg. Copyright © 2012 Elsevier B.V. All rights reserved.

Experimental Verification of Guided-Wave Lumped Circuits Using Waveguide Metamaterials

Science.gov (United States)

Li, Yue; Zhang, Zhijun

2018-04-01

Through the construction and characterization in microwave frequencies, we experimentally demonstrate our recently developed theory of waveguide lumped circuits, i.e., waveguide metatronics [Sci. Adv. 2, e1501790 (2016), 10.1126/sciadv.1501790], as a method to design subwavelength-scaled analog circuits. In the paradigm of waveguide metatronics, numbers of lumped inductors and capacitors are easily integrated functionally inside the waveguide, which is an irreplaceable transmission line in millimeter-wave and terahertz systems with the advantages of low radiation loss and low crosstalk. An example of multiple-ordered metatronic filters with layered structures is fabricated utilizing the technique of substrate integrated waveguides, which can be easily constructed by the printed-circuit-board process. The materials used in the construction are also typical microwave materials with positive permittivity, low loss, and negligible dispersion, imitating the plasmonic materials with negative permittivity in the optical domain. The results verify the theory of waveguide metatronics, which provides an efficient platform of functional lumped circuit design for guided-wave processing.

CMOS Imaging of Pin-Printed Xerogel-Based Luminescent Sensor Microarrays.

Science.gov (United States)

Yao, Lei; Yung, Ka Yi; Khan, Rifat; Chodavarapu, Vamsy P; Bright, Frank V

2010-12-01

We present the design and implementation of a luminescence-based miniaturized multisensor system using pin-printed xerogel materials which act as host media for chemical recognition elements. We developed a CMOS imager integrated circuit (IC) to image the luminescence response of the xerogel-based sensor array. The imager IC uses a 26 × 20 (520 elements) array of active pixel sensors and each active pixel includes a high-gain phototransistor to convert the detected optical signals into electrical currents. The imager includes a correlated double sampling circuit and pixel address/digital control circuit; the image data is read-out as coded serial signal. The sensor system uses a light-emitting diode (LED) to excite the target analyte responsive luminophores doped within discrete xerogel-based sensor elements. As a prototype, we developed a 4 × 4 (16 elements) array of oxygen (O 2 ) sensors. Each group of 4 sensor elements in the array (arranged in a row) is designed to provide a different and specific sensitivity to the target gaseous O 2 concentration. This property of multiple sensitivities is achieved by using a strategic mix of two oxygen sensitive luminophores ([Ru(dpp) 3 ] 2+ and ([Ru(bpy) 3 ] 2+ ) in each pin-printed xerogel sensor element. The CMOS imager consumes an average power of 8 mW operating at 1 kHz sampling frequency driven at 5 V. The developed prototype system demonstrates a low cost and miniaturized luminescence multisensor system.

High efficient plastic solar cells fabricated with a high-throughput gravure printing method

Energy Technology Data Exchange (ETDEWEB)

Kopola, P.; Jin, H.; Tuomikoski, M.; Maaninen, A.; Hast, J. [VTT, Kaitovaeylae 1, FIN-90571 Oulu (Finland); Aernouts, T. [IMEC, Organic PhotoVoltaics, Polymer and Molecular Electronics, Kapeldreef 75, B-3001 Leuven (Belgium); Guillerez, S. [CEA-INES RDI, 50 Avenue Du Lac Leman, 73370 Le Bourget Du Lac (France)

2010-10-15

We report on polymer-based solar cells prepared by the high-throughput roll-to-roll gravure printing method. The engravings of the printing plate, along with process parameters like printing speed and ink properties, are studied to optimise the printability of the photoactive as well as the hole transport layer. For the hole transport layer, the focus is on testing different formulations to produce thorough wetting of the indium-tin-oxide (ITO) substrate. The challenge for the photoactive layer is to form a uniform layer with optimal nanomorphology in the poly-3-hexylthiophene (P3HT) and [6,6]-phenyl-C61-butyric acid methyl ester (PCBM) blend. This results in a power conversion efficiency of 2.8% under simulated AM1.5G solar illumination for a solar cell device with gravure-printed hole transport and a photoactive layer. (author)

A flexible inkjet printed inverted-F antenna on textile

KAUST Repository

Karimi, Muhammad Akram; Shamim, Atif

2016-01-01

This is an era of wearable gadgets which demands flexible and wearer friendly wireless components. This paper presents a modified inverted-F antenna (IFA) which has seamlessly been integrated with the fabric through inkjet printing. Surface roughness of the textile has been reduced using a rapid UV curable flexible interface layer. Smooth interface layer helps achieving very fine features which may be required for complicated antenna and circuit traces.

A flexible inkjet printed inverted-F antenna on textile

KAUST Repository

Karimi, Muhammad Akram

2016-12-19

This is an era of wearable gadgets which demands flexible and wearer friendly wireless components. This paper presents a modified inverted-F antenna (IFA) which has seamlessly been integrated with the fabric through inkjet printing. Surface roughness of the textile has been reduced using a rapid UV curable flexible interface layer. Smooth interface layer helps achieving very fine features which may be required for complicated antenna and circuit traces.

3D printing in orthognathic surgery − A literature review

Directory of Open Access Journals (Sweden)

Hsiu-Hsia Lin

2018-07-01

Full Text Available With the recent advances in three-dimensional (3D imaging, computer-assisted surgical planning and simulation are now regularly used for analysis of craniofacial structures and improved prediction of surgical outcomes in orthognathic surgery. A variety of patient-specific surgical guides and devices have been designed and manufactured using 3D printing technology, which rapidly gained widespread popularity to improve the outcomes. The article presents an overview of 3D printing technology for state-of-the-art application in orthognathic surgery and discusses the impacts on treatment feasibility and patient outcome. The current available literature regarding the use of 3D printing methods in orthognathic surgery including 3D computer-aided design/computer-aided manufacturing, rapid prototyping, additive manufacturing, 3D printing, 3D printed models, surgical occlusal splints, custom-made guides, templates and fixation plates is reviewed. A Medline, PubMed, ProQuest and ScienceDirect search was performed to find relevant articles over the past 10 years. A total of 318 articles were found, out of which 69 were publications addressing the topic of this study. An additional 9 hand-searched articles were added. From the review, we can conclude that the use of 3D printing methods in orthognathic surgery provide the benefit of optimal functional and aesthetic results, patient satisfaction, and precise translation of the treatment plan. Keywords: Orthognathic surgery, 3D printing, Computer-aided design, Computer-aided manufacturing, Rapid prototyping, Additive manufacturing

INSULATION RESISTANCE OF PRINTED CIRCUIT BOARDS. BEHAVIOR OF CERTAIN TYPES AND MAKES UNDER DIFFERENT CLIMATIC CONDITIONS. En undersoegelse af en raekke typer og fabrikater under forskellige klimatiske forhold

Energy Technology Data Exchange (ETDEWEB)

Olesen, S. T.

1971-11-15

The present study embraces measurements of insulation resistance on a number of types and makes of printed-circuit boards. The insulation measurements were performed on boards just received from the manufacturer, as well as on boards exposed to humidity or to elevated temperatures. A total of 33 types from five different material categories were obtained. The test material used thus originated from a variety of independent sources. The purpose of the project was to investigate the frequency with which batches with insufficiently baked material - and consequently having a poor insulation resistance - were encountered in practice. No such batches were in fact found, and it is likely that they do not occur as often as had previously been assumed.

A 24 GHz CMOS oscillator transmitter with an inkjet printed on-chip antenna

KAUST Repository

Ghaffar, Farhan A.

2016-08-15

CMOS based RF circuits have demonstrated efficient performance over the decades. However, one bottle neck with this technology is its lossy nature for passive components such as inductors, antennas etc. Due to this drawback, passives are either implemented off chip or the designers work with the inefficient passives. This problem can be alleviated by using inkjet printing as a post process on CMOS chip. In this work, we demonstrate inkjet printing of a patterned polymer (SU8) layer on a 24 GHz oscillator chip to isolate the lossy Si substrate from the passives which are inkjet printed on top of the SU8 layer. As a proof of concept, a monopole antenna is printed on top of the SU8 layer integrating it with the oscillator through the exposed RF pads to realize an oscillator transmitter. The proposed hybrid fabrication technique can be extended to multiple dielectric and conductive printed layers to demonstrate complete RF systems on CMOS chips which are efficient, cost-effective and above all small in size. © 2016 IEEE.

The Use of 3D Printing in the Development of Gaseous Radiation Detectors

Science.gov (United States)

Fargher, Sam; Steer, Chris; Thompson, Lee

2018-01-01

Fused Deposition Modelling has been used to produce a small, single wire, Iarocci-style drift tube to demonstrate the feasibility of using the Additive Manufacturing technique to produce cheap detectors, quickly. Recent technological developments have extended the scope of Additive Manufacturing, or 3D printing, to the possibility of fabricating Gaseous Radiation Detectors, such as Single Wire Proportional Counters and Time Projection Chambers. 3D printing could allow for the production of customisable, modular detectors; that can be easily created and replaced and the possibility of printing detectors on-site in remote locations and even for outreach within schools. The 3D printed drift tube was printed using Polylactic acid to produce a gas volume in the shape of an inverted triangular prism; base length of 28 mm, height 24.25 mm and tube length 145 mm. A stainless steel anode wire was placed in the centre of the tube, mid-print. P5 gas (95% Argon, 5% Methane) was used as the drift gas and a circuit was built to capacitively decouple signals from the high voltage. The signal rate and average pulse height of cosmic ray muons were measured over a range of bias voltages to characterise and prove correct operation of the printed detector.

Preparation of solid silver nanoparticles for inkjet printed flexible electronics with high conductivity.

Science.gov (United States)

Shen, Wenfeng; Zhang, Xianpeng; Huang, Qijin; Xu, Qingsong; Song, Weijie

2014-01-01

Silver nanoparticles (NPs) which could be kept in solid form and were easily stored without degeneration or oxidation at room temperature for a long period of time were synthesized by a simple and environmentally friendly wet chemistry method in an aqueous phase. Highly stable dispersions of aqueous silver NP inks, sintered at room temperature, for printing highly conductive tracks (∼8.0 μΩ cm) were prepared simply by dispersing the synthesized silver NP powder in water. These inks are stable, fairly homogeneous and suitable for a wide range of patterning techniques. The inks were successfully printed on paper and polyethylene terephthalate (PET) substrates using a common color printer. Upon annealing at 180 °C, the resistivity of the printed silver patterns decreased to 3.7 μΩ cm, which is close to twice that of bulk silver. Various factors affecting the resistivity of the printed silver patterns, such as annealing temperature and the number of printing cycles, were investigated. The resulting high conductivity of the printed silver patterns reached over 20% of the bulk silver value under ambient conditions, which enabled the fabrication of flexible electronic devices, as demonstrated by the inkjet printing of conductive circuits of LED devices.

Recycling of non-metallic fractions from waste printed circuit boards: A review

International Nuclear Information System (INIS)

Guo Jiuyong; Guo Jie; Xu Zhenming

2009-01-01

The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70 wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

Recycling of non-metallic fractions from waste printed circuit boards: A review

Energy Technology Data Exchange (ETDEWEB)

Guo Jiuyong; Guo Jie [School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240 (China); Xu Zhenming, E-mail: zmxu@sjtu.edu.cn [School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240 (China)

2009-09-15

The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70 wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

Optimization of weld bead geometry of MS plate

Indian Academy of Sciences (India)

The considered specimen was checked to harmonize the optimum setting between input factors, for example, welding current, open circuit voltage, and thickness of plate, with respect to obtaining prosperous weld strength as well as bead geometry quality characteristics, for example, tensile strength, bead width, ...

Pad printing as a film forming technique for polymer solar cells

Energy Technology Data Exchange (ETDEWEB)

Krebs, Frederik C. [Risoe National Laboratory for Sustainable Energy, Technical University of Denmark, Frederiksborgvej 399, DK-4000 Roskilde (Denmark)

2009-04-15

Pad printing as a technique for preparing the active layer in polymer solar cells is presented. The technique employs a silicone rubber stamp to pick up the motif from a gravure plate and transfer it to the substrate. The strengths and limitations of pad printing are discussed and polymer solar cells prepared by pad printing are presented. Devices were prepared on indium tin oxide substrates but in principle the entire photovoltaic device comprising front and back electrodes, barrier layers and active layer could be printed with no need for vacuum steps. The device geometry comprises a spin coated transparent zinc oxide front electrode, a pad printed active layer based on a bulk heterojunction of the thermocleavable polymer poly(3-(2-methylhexyloxycarbonyl)thiophene-co-thiopene) (P3MHOCT) and zinc oxide nanoparticles, spin coated PEDOT:PSS and finally a manually cast thermally cured silver paste back electrode. The P3MHOCT was converted to poly(3-carboxy-dithiophene) (P3CT) in situ by heating the film to 200 C for a brief period. The entire printing and device preparation was carried out in the ambient atmosphere and the devices obtained had a good stability in air during storage and operation. (author)

Wirelessly powered microfluidic dielectrophoresis devices using printable RF circuits.

Science.gov (United States)

Qiao, Wen; Cho, Gyoujin; Lo, Yu-Hwa

2011-03-21

We report the first microfluidic device integrated with a printed RF circuit so the device can be wirelessly powered by a commercially available RFID reader. For conventional dielectrophoresis devices, electrical wires are needed to connect the electric components on the microchip to external equipment such as power supplies, amplifiers, function generators, etc. Such a procedure is unfamiliar to most clinicians and pathologists who are used to working with a microscope for examination of samples on microscope slides. The wirelessly powered device reported here eliminates the entire need for wire attachments and external instruments so the operators can use the device in essentially the same manner as they do with microscope slides. The integrated circuit can be fabricated on a flexible plastic substrate at very low cost using a roll-to-roll printing method. Electrical power at 13.56 MHz transmitted by a radio-frequency identification (RFID) reader is inductively coupled to the printed RFIC and converted into 10 V DC (direct current) output, which provides sufficient power to drive a microfluidic device to manipulate biological particles such as beads and proteins via the DC dielectrophoresis (DC-DEP) effect. To our best knowledge, this is the first wirelessly powered microfluidic dielectrophoresis device. Although the work is preliminary, the device concept, the architecture, and the core technology are expected to stimulate many efforts in the future and transform the technology to a wide range of clinical and point-of-care applications. This journal is © The Royal Society of Chemistry 2011

Digital multicolor printing: state of the art and future challenges

Science.gov (United States)

Kipphan, Helmut

1995-04-01

During the last 5 years, digital techniques have become extremely important in the graphic arts industry. All sections in the production flow for producing multicolor printed products - prepress, printing and postpress - are influenced by digitalization, in an evolutionary and revolutionary way. New equipment and network techniques bring all the sections closer together. The focus is put on high-quality multicolor printing, together with high productivity. Conventional offset printing technology is compared with the leading nonimpact printing technologies. Computer to press is contrasted with computer to print techniques. The newest available digital multicolor presses are described - the direct imaging offset printing press from HEIDELBERG with new laser imaging technique as well as the INDIGO and XEIKON presses based on electrophotography. Regarding technical specifications, economic calculations and print quality, it is worked out that each technique has its own market segments. An outlook is given for future computer to press techniques and the potential of nonimpact printing technologies for advanced high-speed multicolor computer to print equipment. Synergy effects from the NIP-technologies to the conventional printing technologies and vice versa are possible for building up innovative new products, for example hybrid printing systems. It is also shown that there is potential for improving the print quality, based on special screening algorithms, and a higher number of grey levels per pixel by using NIP-technologies. As an intermediate step in digitalization of the production flow, but also as an economical solution computer to plate equipment is described. By producing printed products totally in a digital way, digital color proofing as well as color management systems are needed. The newest high-tech equipment using NIP-technologies for producing proofs is explained. All in all it is shown that the state of the art in digital multicolor printing has reached

Performance Comparison of Cross-Like Hall Plates with Different Covering Layers

Directory of Open Access Journals (Sweden)

Fei Lyu

2014-12-01

Full Text Available This paper studies the effects of the covering layers on the performance of a cross-like Hall plate. Three different structures of a cross-like Hall plate in various sizes are designed and analyzed. The Hall plate sensitivity and offset are characterized using a self-built measurement system. The effect of the P-type region over the active area on the current-related sensitivity is studied for different Hall plate designs. In addition, the correlation between the P-type covering layer and offset is analyzed. The best structure out of three designs is determined. Besides, a modified eight-resistor circuit model for the Hall plate is presented with improved accuracy by taking the offset into account.

Vacuum-thermal-evaporation: the route for roll-to-roll production of large-area organic electronic circuits

International Nuclear Information System (INIS)

Taylor, D M

2015-01-01

Surprisingly little consideration is apparently being given to vacuum-evaporation as the route for the roll-to-roll (R2R) production of large-area organic electronic circuits. While considerable progress has been made by combining silicon lithographic approaches with solution processing, it is not obvious that these will be compatible with a low-cost, high-speed R2R process. Most efforts at achieving this ambition are directed at conventional solution printing approaches such as inkjet and gravure. This is surprising considering that vacuum-evaporation of organic semiconductors (OSCs) is already used commercially in the production of organic light emitting diode displays. Beginning from a discussion of the materials and geometrical parameters determining transistor performance and drawing on results from numerous publications, this review makes a case for vacuum-evaporation as an enabler of R2R organic circuit production. The potential of the vacuum route is benchmarked against solution approaches and found to be highly competitive. For example, evaporated small molecules tend to have higher mobility than printed OSCs. High resolution metal patterning on plastic films is already a low-cost commercial process for high-volume packaging applications. Similarly, solvent-free flash-evaporation and polymerization of thin films on plastic substrates is also a high-volume commercial process and has been shown capable of producing robust gate dielectrics. Reports of basic logic circuit elements produced in a vacuum R2R environment are reviewed and shown to be superior to all-solution printing approaches. Finally, the main issues that need to be resolved in order to fully develop the vacuum route to R2R circuit production are highlighted. (paper)

An adjustable RF tuning element for microwave, millimeter wave, and submillimeter wave integrated circuits

Science.gov (United States)

Lubecke, Victor M.; Mcgrath, William R.; Rutledge, David B.

1991-01-01

Planar RF circuits are used in a wide range of applications from 1 GHz to 300 GHz, including radar, communications, commercial RF test instruments, and remote sensing radiometers. These circuits, however, provide only fixed tuning elements. This lack of adjustability puts severe demands on circuit design procedures and materials parameters. We have developed a novel tuning element which can be incorporated into the design of a planar circuit in order to allow active, post-fabrication tuning by varying the electrical length of a coplanar strip transmission line. It consists of a series of thin plates which can slide in unison along the transmission line, and the size and spacing of the plates are designed to provide a large reflection of RF power over a useful frequency bandwidth. Tests of this structure at 1 GHz to 3 Ghz showed that it produced a reflection coefficient greater than 0.90 over a 20 percent bandwidth. A 2 GHz circuit incorporating this tuning element was also tested to demonstrate practical tuning ranges. This structure can be fabricated for frequencies as high as 1000 GHz using existing micromachining techniques. Many commercial applications can benefit from this micromechanical RF tuning element, as it will aid in extending microwave integrated circuit technology into the high millimeter wave and submillimeter wave bands by easing constraints on circuit technology.

Sound insulation performance of plates with interconnected distributed piezoelectric patches

Directory of Open Access Journals (Sweden)

Yi Kaijun

2017-02-01

Full Text Available This paper deals with the sound insulation performance of a thin plate with interconnected distributed piezoelectric patches. Piezoelectric patches are periodically bonded on the surfaces of the plate in a collocated fashion, and are interconnected via an inductive circuit network. This piezoelectric system is termed as piezo-electromechanical (PEM plate in the paper. Homogenization methods are involved under a sub-wavelength assumption to analytically develop the dynamical equations for the PEM plate. The dispersion relationships and energy densities of the wave modes propagating in the PEM plate are studied; the sub-wavelength assumption is verified for the simulations in this paper. The coincidence frequency of the PEM plate is researched, and results show that the coincidence frequency of the PEM plate will disappear at certain circumstances; mathematical and physical explanations are made for this phenomenon. The disappearance of the coincidence frequency is used to optimize the value of inductance, for the purpose of improving the sound transmission loss of the PEM plate.

Inkjet printing and inkjet infiltration of functional coatings for SOFCs fabrication

Directory of Open Access Journals (Sweden)

Tomov Rumen I.

2016-01-01

Full Text Available Inkjet printing fabrication and modification of electrodes and electrolytes of SOFCs were studied. Electromagnetic print-heads were utilized to reproducibly dispense droplets of inks at rates of several kHz on demand. Printing parameters including pressure, nozzle opening time and drop spreading were studied in order to optimize the inks jetting and delivery. Scanning electron microscopy revealed highly conformal ~ 6-10 μm thick dense electrolyte layers routinely produced on cermet and metal porous supports. Open circuit voltages ranging from 0.95 to 1.01 V, and a maximum power density of ~180 mW.cm−2 were measured at 750 °C on Ni-8YSZ/YSZ/LSM single cell 50×50 mm in size. The effect of anode and cathode microstructures on the electrochemical performance was investigated. Two - step fabrication of the electrodes using inkjet printing infiltration was implemented. In the first step the porous electrode scaffold was created printing suspension composite inks. During the second step inkjet printing infiltration was utilized for controllable loading of active elements and a formation of nano-grid decorations on the scaffolds radically reducing the activation polarization losses of both electrodes. Symmetrical cells of both types were characterized by impedance spectroscopy in order to reveal the relation between the microstructure and the electrochemical performance.

Roll-offset printed transparent conducting electrode for organic solar cells

International Nuclear Information System (INIS)

Kim, Inyoung; Kwak, Sun-Woo; Ju, Yeonkyeong; Park, Gun-Young; Lee, Taik-Min; Jang, Yunseok; Choi, Young-Man; Kang, Dongwoo

2015-01-01

Transparent conducting electrodes (TCEs) were developed through the roll-offset printing of Ag grid mesh patterns for the application of all-solution processed organic solar cells (OSCs). Due to the remarkable printability of roll-offset printing, the printed TCEs did not show the step coverage problem of subsequent thin layers, which was a chronic problem in other printing techniques. The control of ink cohesion was verified as a critical factor for the high printing quality, which was optimized by adding a polyurethane diol of 2 wt.%. The tensile strength of optimized Ag ink was 322 mN, which led to the clear patterning of Ag nanoparticles. The printed TCEs with different mesh densities of the Ag grid were designed to have a similar property of indium tin oxide (ITO). The measured sheet resistance was 13 Ω/□, and optical transmittance was 86%, including the glass substrate, which was found to be independent of wavelength in the visible spectrum, in contrast with the optical transmittance of ITO. To evaluate the TCE performance as bottom electrodes, all-solution processed OSCs were fabricated on top of the TCEs. The power conversion efficiency (PCE) of the OSCs increased with the increments of the mesh density due to the distinctive increase of the short circuit current density (J sc ), notwithstanding the similar transmittance and sheet resistance of the TCEs. In comparison with ITO, a higher PCE of OSCs was obtained because the printed TCEs with a high mesh density were able to facilitate effective current collection, leading to a significant increase of J sc . - Highlights: • Roll-offset printing provided a remarkable printability of Ag nano-ink. • Control of ink cohesion played a critical role on the patterning of Ag nano-ink. • Printed Ag mesh was used as a transparent conducting electrode. • Transparency and sheet resistance of printed Ag mesh can be designed simply. • Printed Ag mesh was effective for the current collection of organic solar

Roll-offset printed transparent conducting electrode for organic solar cells

Energy Technology Data Exchange (ETDEWEB)

Kim, Inyoung, E-mail: ikim@kimm.re.kr; Kwak, Sun-Woo; Ju, Yeonkyeong; Park, Gun-Young; Lee, Taik-Min; Jang, Yunseok; Choi, Young-Man; Kang, Dongwoo

2015-04-01

Transparent conducting electrodes (TCEs) were developed through the roll-offset printing of Ag grid mesh patterns for the application of all-solution processed organic solar cells (OSCs). Due to the remarkable printability of roll-offset printing, the printed TCEs did not show the step coverage problem of subsequent thin layers, which was a chronic problem in other printing techniques. The control of ink cohesion was verified as a critical factor for the high printing quality, which was optimized by adding a polyurethane diol of 2 wt.%. The tensile strength of optimized Ag ink was 322 mN, which led to the clear patterning of Ag nanoparticles. The printed TCEs with different mesh densities of the Ag grid were designed to have a similar property of indium tin oxide (ITO). The measured sheet resistance was 13 Ω/□, and optical transmittance was 86%, including the glass substrate, which was found to be independent of wavelength in the visible spectrum, in contrast with the optical transmittance of ITO. To evaluate the TCE performance as bottom electrodes, all-solution processed OSCs were fabricated on top of the TCEs. The power conversion efficiency (PCE) of the OSCs increased with the increments of the mesh density due to the distinctive increase of the short circuit current density (J{sub sc}), notwithstanding the similar transmittance and sheet resistance of the TCEs. In comparison with ITO, a higher PCE of OSCs was obtained because the printed TCEs with a high mesh density were able to facilitate effective current collection, leading to a significant increase of J{sub sc}. - Highlights: • Roll-offset printing provided a remarkable printability of Ag nano-ink. • Control of ink cohesion played a critical role on the patterning of Ag nano-ink. • Printed Ag mesh was used as a transparent conducting electrode. • Transparency and sheet resistance of printed Ag mesh can be designed simply. • Printed Ag mesh was effective for the current collection of organic

Synthesis of pure colloidal silver nanoparticles with high electroconductivity for printed electronic circuits: the effect of amines on their formation in aqueous media.

Science.gov (United States)

Natsuki, Jun; Abe, Takao

2011-07-01

This paper describes a practical and convenient method to prepare stable colloidal silver nanoparticles for use in printed electronic circuits. The method uses a dispersant and two kinds of reducing agents including 2-(dimethylamino) ethanol (DMAE), which play important roles in the reduction of silver ions in an aqueous medium. The effect of DMAE and dispersant, as well as the factors affecting particle size and morphology are investigated. In the formation of the silver nanoparticles, reduction occurs rapidly at room temperature and the silver particles can be separated easily from the mixture in a short time. In addition, organic solvents are not used. Pure, small and relatively uniform particles with a diameter less than 10 nm can be obtained that exhibit high electroconductivity. The silver nanoparticles are stable, and can be isolated as a dried powder that can be fully redispersed in deionized water. This method of producing colloidal silver nanoparticles will find practical use in electronics applications. Copyright © 2011 Elsevier Inc. All rights reserved.

Potentials for Improvement of Resource Efficiency in Printed Circuit Board Manufacturing: A Case Study Based on Material Flow Cost Accounting

Directory of Open Access Journals (Sweden)

Yi-Xuan Wang

2017-05-01

Full Text Available The pursuit of sustainable resource use by manufacturing companies is driven by resource scarcity, environmental awareness, and cost savings potentials. To address these issues, Material Flow Cost Accounting (MFCA has been developed and applied as an effective environmental management tool. Within MFCA’s general allocation, the accounts of products and losses are overrated by weight or volume. However, such a method is incompatible with Printed Circuit Board (PCB manufacturing because of industry characteristics in which primary inputs and products are measured by area. Based on MFCA, this case study systematically established several linear cost calculation models along the production process for capturing the actual waste flows as well as performing cost-benefit analysis. The recognition of previously ignored losses offered the incentive to find appropriate indicators to conduct cost-benefit analysis on hotspots for losses. Loss identification and analysis indicated that machining and wiring are the necessities and priorities of process optimization for resource efficiency improvement measures. Therefore, this research could not only advance the achievement of a profitable and sustainable production while improving resource efficiency at the source but could also provide support for decision making in PCB manufacturing.

MLEP-Fail calibration for 1/8 inch thick cast plate of 17-4 steel.

Energy Technology Data Exchange (ETDEWEB)

Corona, Edmundo [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

2018-02-01

The purpose of the work presented in this memo was to calibrate the Sierra material model Multilinear Elastic-Plastic Hardening Model with Failure (MLEP-Fail) for 1/8 inch thick cast plate of 17-4 steel. The calibration approach is essentially the same as that recently used in a previous memo using data from smooth and notched tensile specimens. The notched specimens were manufactured with three notch radii R = 1=8, 1/32 and 1/64 inches. The dimensions of the smooth and notched specimens are given in the prints in Appendix A. Two cast plates, Plate 3 and Plate 4, with nominally identical properties were considered.

Modelling Polymer Deformation during 3D Printing

Science.gov (United States)

McIlroy, Claire; Olmsted, Peter

Three-dimensional printing has the potential to transform manufacturing processes, yet improving the strength of printed parts, to equal that of traditionally-manufactured parts, remains an underlying issue. The fused deposition modelling technique involves melting a thermoplastic, followed by layer-by-layer extrusion to fabricate an object. The key to ensuring strength at the weld between layers is successful inter-diffusion. However, prior to welding, both the extrusion process and the cooling temperature profile can significantly deform the polymer micro-structure and, consequently, how well the polymers are able to ``re-entangle'' across the weld. In particular, polymer alignment in the flow can cause de-bonding of the layers and create defects. We have developed a simple model of the non-isothermal extrusion process to explore the effects that typical printing conditions and material rheology have on the conformation of a polymer melt. In particular, we incorporate both stretch and orientation using the Rolie-Poly constitutive equation to examine the melt structure as it flows through the nozzle, the subsequent alignment with the build plate and the resulting deformation due to the fixed nozzle height, which is typically less than the nozzle radius.

Fully inkjet-printed microwave passive electronics

KAUST Repository

McKerricher, Garret

2017-01-30

Fully inkjet-printed three-dimensional (3D) objects with integrated metal provide exciting possibilities for on-demand fabrication of radio frequency electronics such as inductors, capacitors, and filters. To date, there have been several reports of printed radio frequency components metallized via the use of plating solutions, sputtering, and low-conductivity pastes. These metallization techniques require rather complex fabrication, and do not provide an easily integrated or versatile process. This work utilizes a novel silver ink cured with a low-cost infrared lamp at only 80 °C, and achieves a high conductivity of 1×107 S m−1. By inkjet printing the infrared-cured silver together with a commercial 3D inkjet ultraviolet-cured acrylic dielectric, a multilayer process is demonstrated. By using a smoothing technique, both the conductive ink and dielectric provide surface roughness values of <500 nm. A radio frequency inductor and capacitor exhibit state-of-the-art quality factors of 8 and 20, respectively, and match well with electromagnetic simulations. These components are implemented in a lumped element radio frequency filter with an impressive insertion loss of 0.8 dB at 1 GHz, proving the utility of the process for sensitive radio frequency applications.

Fully inkjet-printed microwave passive electronics

KAUST Repository

McKerricher, Garret; Vaseem, Mohammad; Shamim, Atif

2017-01-01

Fully inkjet-printed three-dimensional (3D) objects with integrated metal provide exciting possibilities for on-demand fabrication of radio frequency electronics such as inductors, capacitors, and filters. To date, there have been several reports of printed radio frequency components metallized via the use of plating solutions, sputtering, and low-conductivity pastes. These metallization techniques require rather complex fabrication, and do not provide an easily integrated or versatile process. This work utilizes a novel silver ink cured with a low-cost infrared lamp at only 80 °C, and achieves a high conductivity of 1×107 S m−1. By inkjet printing the infrared-cured silver together with a commercial 3D inkjet ultraviolet-cured acrylic dielectric, a multilayer process is demonstrated. By using a smoothing technique, both the conductive ink and dielectric provide surface roughness values of <500 nm. A radio frequency inductor and capacitor exhibit state-of-the-art quality factors of 8 and 20, respectively, and match well with electromagnetic simulations. These components are implemented in a lumped element radio frequency filter with an impressive insertion loss of 0.8 dB at 1 GHz, proving the utility of the process for sensitive radio frequency applications.

Modelling Polymer Deformation and Welding Behaviour during 3D Printing

Science.gov (United States)

McIlroy, Claire; Olmsted, Peter

2016-11-01

3D printing has the potential to transform manufacturing processes, yet improving the strength of printed parts, to equal that of traditionally-manufactured parts, remains an underlying issue. The most common method, fused deposition modelling, involves melting a thermoplastic, followed by layer-by-layer extrusion of the material to fabricate a three-dimensional object. The key to the ensuring strength at the weld between these layers is successful inter-diffusion. However, as the printed layer cools towards the glass transition temperature, the time available for diffusion is limited. In addition, the extrusion process significantly deforms the polymer micro-structure prior to welding and consequently affects how the polymers "re-entangle" across the weld. We have developed a simple model of the non-isothermal printing process to explore the effects that typical printing conditions and amorphous polymer rheology have on the ultimate weld structure. In particular, we incorporate both the stretch and orientation of the polymer using the Rolie-Poly constitutive equation to examine how the melt flows through the nozzle and is deposited onto the build plate. We then address how this deformation relaxes and contributes to the thickness and structure of the weld. National Institute for Standards and Technology (NIST) and Georgetown University.

Control of Evaporation Behavior of an Inkjet-Printed Dielectric Layer Using a Mixed-Solvent System

Science.gov (United States)

Yang, Hak Soon; Kang, Byung Ju; Oh, Je Hoon

2016-01-01

In this study, the evaporation behavior and the resulting morphology of inkjet-printed dielectric layers were controlled using a mixed-solvent system to fabricate uniform poly-4-vinylphenol (PVP) dielectric layers without any pinholes. The mixed-solvent system consisted of two different organic solvents: 1-hexanol and ethanol. The effects of inkjet-printing variables such as overlap condition, substrate temperature, and different printing sequences (continuous and interlacing printing methods) on the inkjet-printed dielectric layer were also investigated. Increasing volume fraction of ethanol (VFE) is likely to reduce the evaporation rate gradient and the drying time of the inkjet-printed dielectric layer; this diminishes the coffee stain effect and thereby improves the uniformity of the inkjet-printed dielectric layer. However, the coffee stain effect becomes more severe with an increase in the substrate temperature due to the enhanced outward convective flow. The overlap condition has little effect on the evaporation behavior of the printed dielectric layer. In addition, the interlacing printing method results in either a stronger coffee stain effect or wavy structures of the dielectric layers depending on the VFE of the PVP solution. All-inkjet-printed capacitors without electrical short circuiting can be successfully fabricated using the optimized PVP solution (VFE = 0.6); this indicates that the mixed-solvent system is expected to play an important role in the fabrication of high-quality inkjet-printed dielectric layers in various printed electronics applications.

Customizable engineered blood vessels using 3D printed inserts.

Science.gov (United States)

Pinnock, Cameron B; Meier, Elizabeth M; Joshi, Neeraj N; Wu, Bin; Lam, Mai T

2016-04-15

Current techniques for tissue engineering blood vessels are not customizable for vascular size variation and vessel wall thickness. These critical parameters vary widely between the different arteries in the human body, and the ability to engineer vessels of varying sizes could increase capabilities for disease modeling and treatment options. We present an innovative method for producing customizable, tissue engineered, self-organizing vascular constructs by replicating a major structural component of blood vessels - the smooth muscle layer, or tunica media. We utilize a unique system combining 3D printed plate inserts to control construct size and shape, and cell sheets supported by a temporary fibrin hydrogel to encourage cellular self-organization into a tubular form resembling a natural artery. To form the vascular construct, 3D printed inserts are adhered to tissue culture plates, fibrin hydrogel is deposited around the inserts, and human aortic smooth muscle cells are then seeded atop the fibrin hydrogel. The gel, aided by the innate contractile properties of the smooth muscle cells, aggregates towards the center post insert, creating a tissue ring of smooth muscle cells. These rings are then stacked into the final tubular construct. Our methodology is robust, easily repeatable and allows for customization of cellular composition, vessel wall thickness, and length of the vessel construct merely by varying the size of the 3D printed inserts. This platform has potential for facilitating more accurate modeling of vascular pathology, serving as a drug discovery tool, or for vessel repair in disease treatment. Copyright © 2015 Elsevier Inc. All rights reserved.

Structural Integration of Silicon Solar Cells and Lithium-ion Batteries Using Printed Electronics

Science.gov (United States)

Kang, Jin Sung

Inkjet printing of electrode using copper nanoparticle ink is presented. Electrode was printed on a flexible glass epoxy composite substrate using drop on demand piezoelectric dispenser and was sintered at 200°C in N 2 gas condition. The printed electrodes were made with various widths and thicknesses. Surface morphology of electrode was analyzed using scanning electron microscope (SEM) and atomic force microscope (AFM). Reliable dimensions for printed electronics were found from this study. Single-crystalline silicon solar cells were tested under four-point bending to find the feasibility of directly integrating them onto a carbon fiber/epoxy composite laminate. These solar cells were not able to withstand 0.2% strain. On the other hand, thin-film amorphous silicon solar cells were subjected to flexural fatigue loadings. The current density-voltage curves were analyzed at different cycles, and there was no noticeable degradation on its performance up to 100 cycles. A multifunctional composite laminate which can harvest and store solar energy was fabricated using printed electrodes. The integrated printed circuit board (PCB) was co-cured with a carbon/epoxy composite laminate by the vacuum bag molding process in an autoclave; an amorphous silicon solar cell and a thin-film solid state lithium-ion (Li-ion) battery were adhesively joined and electrically connected to a thin flexible PCB; and then the passive components such as resistors and diodes were electrically connected to the printed circuit board by silver pasting. Since a thin-film solid state Li-ion battery was not able to withstand tensile strain above 0.4%, thin Li-ion polymer batteries were tested under various mechanical loadings and environmental conditions to find the feasibility of using the polymer batteries for our multifunctional purpose. It was found that the Li-ion polymer batteries were stable under pressure and tensile loading without any noticeable degradation on its charge and discharge

A novel ZVS high voltage power supply for micro-channel plate photomultiplier tubes

International Nuclear Information System (INIS)

Pei, Chengquan; Tian, Jinshou; Liu, Zhen; Qin, Hong; Wu, Shengli

2017-01-01

A novel resonant high voltage power supply (HVPS) with zero voltage switching (ZVS), to reduce the voltage stress on switching devices and improve conversion efficiency, is proposed. The proposed HVPS includes a drive circuit, a transformer, several voltage multiplying circuits, and a regulator circuit. The HVPS contains several secondary windings that can be precisely regulated. The proposed HVPS performed better than the traditional resistor voltage divider, which requires replacing matching resistors resulting in resistor dispersibility in the Micro-Channel Plate (MCP). The equivalent circuit of the proposed HVPS was established and the operational principle analyzed. The entire switching element can achieve ZVS, which was validated by a simulation and experiments. The properties of this HVPS were tested including minimum power loss (240 mW), maximum power loss (1 W) and conversion efficiency (85%). The results of this research are that the proposed HVPS was suitable for driving the micro-channel plate photomultiplier tube (MCP-PMT). It was therefore adopted to test the MCP-PMT, which will be used in Daya Bay reactor neutrino experiment II in China.

A novel ZVS high voltage power supply for micro-channel plate photomultiplier tubes

Energy Technology Data Exchange (ETDEWEB)

Pei, Chengquan [Key Laboratory for Physical Electronics and Devices of the Ministry of Education, Xi' an Jiaotong University, Xi’an 710049 (China); Tian, Jinshou [Xi’an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi' an 710119 (China); Liu, Zhen [Key Laboratory for Physical Electronics and Devices of the Ministry of Education, Xi' an Jiaotong University, Xi’an 710049 (China); Qin, Hong [School of Computer Science and Technology, Xi' an University of Science and Technology, Xi' an 710054 (China); Wu, Shengli, E-mail: slwu@mail.xjtu.edu.cn [Key Laboratory for Physical Electronics and Devices of the Ministry of Education, Xi' an Jiaotong University, Xi’an 710049 (China)

2017-04-11

A novel resonant high voltage power supply (HVPS) with zero voltage switching (ZVS), to reduce the voltage stress on switching devices and improve conversion efficiency, is proposed. The proposed HVPS includes a drive circuit, a transformer, several voltage multiplying circuits, and a regulator circuit. The HVPS contains several secondary windings that can be precisely regulated. The proposed HVPS performed better than the traditional resistor voltage divider, which requires replacing matching resistors resulting in resistor dispersibility in the Micro-Channel Plate (MCP). The equivalent circuit of the proposed HVPS was established and the operational principle analyzed. The entire switching element can achieve ZVS, which was validated by a simulation and experiments. The properties of this HVPS were tested including minimum power loss (240 mW), maximum power loss (1 W) and conversion efficiency (85%). The results of this research are that the proposed HVPS was suitable for driving the micro-channel plate photomultiplier tube (MCP-PMT). It was therefore adopted to test the MCP-PMT, which will be used in Daya Bay reactor neutrino experiment II in China.

Eco-friendly copper recovery process from waste printed circuit boards using Fe{sup 3+}/Fe{sup 2+} redox system

Energy Technology Data Exchange (ETDEWEB)

Fogarasi, Szabolcs [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Imre-Lucaci, Florica [Babeş-Bolyai University, Interdisciplinary Research Institute on Bio-Nano-Sciences, 42 Treboniu Laurian Street, Cluj-Napoca RO-400271 (Romania); Egedy, Attila [University of Pannonia, Department of Process Engineering, Egyetem Str. 10, H-8200 Veszprém (Hungary); Imre-Lucaci, Árpád, E-mail: aimre@chem.ubbcluj.ro [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania); Ilea, Petru [Babeş-Bolyai University, Faculty of Chemistry and Chemical Engineering, 11 Arany Janos Street, Cluj-Napoca RO-400028 (Romania)

2015-06-15

Highlights: • We developed an ecofriendly mediated electrochemical process for copper recovery. • The recovery of copper was achieved without mechanical pretreatment of the samples. • We identified the optimal flow rate for the leaching and electrowinning of copper. • The copper content of the obtained cathodic deposits was over 99.9%. - Abstract: The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe{sup 3+} combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%.

Application of vacuum metallurgy to separate pure metal from mixed metallic particles of crushed waste printed circuit board scraps.

Science.gov (United States)

Zhan, Lu; Xu, Zhenming

2008-10-15

The principle of separating pure metal from mixed metallic particles (MMPs) byvacuum metallurgy is that the vapor pressures of various metals at the same temperature are different As a result, the metal with high vapor pressure and low boiling point can be separated from the mixed metals through distillation or sublimation, and then it can be recycled through condensation under a certain condition. The vacuum metallurgy separation (VMS) of MMPs of crushed waste printed circuit boards (WPCBs) has been studied in this paper. Theoretical analyses show that the MMPs (copper, zinc, bismuth, lead, and indium, for example) can be separated by vacuum metallurgy. The copper particles (0.15-0.20 mm) and zinc particles (<0.30 mm) were chosen to simulate the MMPs of crushed WPCBs. Experimental results show that the separated efficiency of zinc in the copper-rich particles achieves 96.19 wt % when the vacuum pressure is 0.01-0.10 Pa, the heating temperature is 1123 K, and the heating time is 105 min. Under this operation condition, the separated efficiency of zinc in the copper-rich particles from crushed WPCBs achieves 97.00 wt % and the copper purity increases from 90.68 to 99.84 wt %.

Neuregulin 3 Mediates Cortical Plate Invasion and Laminar Allocation of GABAergic Interneurons

Directory of Open Access Journals (Sweden)

Giorgia Bartolini

2017-01-01

Full Text Available Neural circuits in the cerebral cortex consist of excitatory pyramidal cells and inhibitory interneurons. These two main classes of cortical neurons follow largely different genetic programs, yet they assemble into highly specialized circuits during development following a very precise choreography. Previous studies have shown that signals produced by pyramidal cells influence the migration of cortical interneurons, but the molecular nature of these factors has remained elusive. Here, we identified Neuregulin 3 (Nrg3 as a chemoattractive factor expressed by developing pyramidal cells that guides the allocation of cortical interneurons in the developing cortical plate. Gain- and loss-of-function approaches reveal that Nrg3 modulates the migration of interneurons into the cortical plate in a process that is dependent on the tyrosine kinase receptor ErbB4. Perturbation of Nrg3 signaling in conditional mutants leads to abnormal lamination of cortical interneurons. Nrg3 is therefore a critical mediator in the assembly of cortical inhibitory circuits.

Design of electrohydrodynamic lens for stabilizing of eletrohydrodynamic jet printing

International Nuclear Information System (INIS)

Park, Sung-Eun; Lee, Dae-Young; Kim, Sang-Yoon; Shin, Yoon-Soo; Hwang, Jungho; Yu, Tae-U

2008-01-01

The generation of micro patterns from conductive material suspensions is gaining significant interests for its usages in the fabrication of flexible display elements and flexible printed circuit boards. In this paper, we presented the results of line patterns of silver nanoparticles obtained by using various types of focusing lenses for electrohydrodynamic jet printing. The pattern widths were measured as 80∼100 μm when the electrohydrodynamic lens having a cone-type inner hole and a cone-type outer wall was used. Electric field strengths were calculated by a commercial solver packages for the four types of electrohydrodynamic lenses. A lens having a cone-type inner hole and a cone-type outer wall of thinner thickness was found to be the best design.

Water chemistry and corrosion in water-steam circuits of nuclear power plants

International Nuclear Information System (INIS)

Gardent, R.; Menet, O.

1981-01-01

The water and steam circuits of steam generators in pressurized-water nuclear power plants are described together with the mechanism of denting, and the corrosion of spacer plates that leads to cracks in tubes by constriction. The different chemical specifications applicable to the water of the secondary circuit of the generators in normal operation and on first commissioning are listed. The results obtained and the measurements of chemical values taken in operation on the water in the secondary circuits of steam generators at Fessenheim and Bugey are presented [fr

Bioleaching of Gold and Silver from Waste Printed Circuit Boards by Pseudomonas balearica SAE1 Isolated from an e-Waste Recycling Facility.

Science.gov (United States)

Kumar, Anil; Saini, Harvinder Singh; Kumar, Sudhir

2018-02-01

Indigenous bacterial strain Pseudomonas balearica SAE1, tolerant to e-waste toxicity was isolated from an e-waste recycling facility Exigo Recycling Pvt. Ltd., India. Toxicity tolerance of bacterial strain was analyzed using crushed (particle size ≤150 µm) waste computer printed circuit boards (PCBs)/liter (L) of culture medium. The EC 50 value for SAE1 was 325.7 g/L of the e-waste pulp density. Two-step bioleaching was then applied to achieve the dissolution of gold (Au) and silver (Ag) from the e-waste. To maximize precious metal dissolution, factors including pulp density, glycine concentration, pH level, and temperature were optimized. The optimization resulted in 68.5 and 33.8% of Au and Ag dissolution, respectively, at a pH of 9.0, a pulp density of 10 g/L, a temperature of 30 °C, and a glycine concentration of 5 g/L. This is the first study of Au and Ag bioleaching using indigenous e-waste bacteria and its analysis to determine e-waste toxicity tolerance.

Packaging Printing Today

OpenAIRE

Stanislav Bolanča; Igor Majnarić; Kristijan Golubović

2015-01-01

Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. T...

A position sensitive parallel plate avalanche counter

International Nuclear Information System (INIS)

Lombardi, M.; Tan Jilian; Potenza, R.; D'amico, V.

1986-01-01

A position sensitive parallel plate avalanche counter with a distributed constant delay-line-cathode (PSAC) is described. The strips formed on the printed board were served as the cathode and the delay line for readout of signals. The detector (PSAC) was operated in isobutane gas at the pressure range from 10 to 20 torr. The position resolution is better than 1 mm and the time resolution is about 350 ps, for 252 Cf fission-spectrum source

Print Quality of Ink Jet Printed PVC Foils

Directory of Open Access Journals (Sweden)

Nemanja Kašiković

2015-09-01

Full Text Available Digital printing technique is used for a wide variety of substrates, one of which are PVC foils. Samples used in this research were printed by digital ink jet printing technique using Mimaki JV22 printing machine and J-Eco Subly Nano inks. As printing substrates, two different types of materials were used (ORACAL 640 - Print Vinyl and LG Hausys LP2712. A test card consisting of fields of CMYK colours was created and printed, varying the number of ink layers applied. Samples were exposed to light after the printing process. Spectrophotometric measurements were conducted before and after the light treatment. Based on spectrophotometricaly obtained data, colour differences ΔE2000 were calculated. Results showed that increasing number of layers, as well as the right choice of substrates, can improve the behaviour of printed product during exploitation.

Packaging Printing Today

Directory of Open Access Journals (Sweden)

Stanislav Bolanča

2015-12-01

Full Text Available Printing packaging covers today about 50% of all the printing products. Among the printing products there are printing on labels, printing on flexible packaging, printing on folding boxes, printing on the boxes of corrugated board, printing on glass packaging, synthetic and metal ones. The mentioned packaging are printed in flexo printing technique, offset printing technique, intaglio halftone process, silk – screen printing, ink ball printing, digital printing and hybrid printing process. The possibilities of particular printing techniques for optimal production of the determined packaging were studied in the paper. The problem was viewed from the technological and economical aspect. The possible printing quality and the time necessary for the printing realization were taken as key parameters. An important segment of the production and the way of life is alocation value and it had also found its place in this paper. The events in the field of packaging printing in the whole world were analyzed. The trends of technique developments and the printing technology for packaging printing in near future were also discussed.

Discharge of viscous UV-curable resin droplets by screen printing for UV nanoimprint lithography

Science.gov (United States)

Tanabe, Akira; Uehara, Takuya; Nagase, Kazuro; Ikedo, Hiroaki; Hiroshiba, Nobuya; Nakamura, Takahiro; Nakagawa, Masaru

2016-06-01

We demonstrated a coating method of screen printing for discharging droplets of a high-viscosity resin on a substrate for ultraviolet (UV) nanoimprint lithography (NIL). Compared with a spin-coated resin film on a silicon substrate, discharged resin droplets on a silicon substrate were effective in terms of the uniformity of residual layer thickness (RLT) in contact with a mold with various pattern densities. Fluorescence microscope observations with a fluorescent-dye-containing UV-curable resin enabled the evaluation of the shapes of resin droplets discharged on a substrate surface. Widely used screen mesh plates composed of a stainless mesh covered with a patterned emulsion film caused defects of undischarged parts, whereas defects-free resin droplets with a narrow size distribution were discharged by mesh-free plates prepared with laser ablation. The pitch-to-diameter ratio in the configuration of 10-µm-diameter holes needs to be larger than 2.5 times for printing a resin having a viscosity of 12,800 mPa s.

Pathway to low-cost metallization of silicon solar cell through understanding of the silicon metal interface and plating chemistry

International Nuclear Information System (INIS)

Ebong, Abasifreke

2014-01-01

Metallization is crucial to silicon solar cell performance. It is the second most expensive process step in the fabrication of a solar cell. In order to reduce the cost of solar cell, the metallization cost has to be cut down by using less metal without compromising the efficiency. Screen-printing has been used in metallizing the commercial solar cell because of the high throughput and low cost at the expense of performance. However, because of the variability in the screen-printed gridlines, the amount of Ag metal used cannot be controlled. More so, the dependence of the contact resistance on doping necessitates the use of low sheet resistance emitters, which exacerbates losses in the blue response and hence the efficiency. To balance the contact resistance and improve blue response, several approaches have been undertaken including, use of Ag pastes incorporating nanoparticle glass frits that will not diffuse excessively into a lightly doped emitter, Ni plating on lightly doped emitter through SiNx dielectric plus NiSi formation followed by Cu and/or Ag plating, light induced plating (LIP) of Ag or Cu on fired through dielectric metal seed layers formed by aerosol or inkjet or screen-printing. All these approaches require excellent adhesion and gridline conductivity to minimize the total series resistance, which impedes the collection of electrons. This paper presents the issues and the pathway to achieving high efficiency using low cost metallization technology involving inkjet-printed Ag fine gridline having 38 μm width and 3 μm height fired through the SiNx followed by Ni and Cu plating. A comprehensive analysis of silicon/metal interface, using high precision microscopy, has shown that the investigated metallization technology is appropriate for the longevity of the device

Corrosion Behavior of Nickel-Plated Alloy 600 in High Temperature Water

International Nuclear Information System (INIS)

Kim, Ji Hyun; Hwang, Il Soon

2008-01-01

In this paper, electrochemical and microstructural characteristics of nickel-plated Alloy 600 wee investigated in order to identify the performance of electroless Ni-plating on Alloy 600 in high-temperature aqueous condition with the comparison of electrolytic nickel-plating. For high temperature corrosion test of nickel-plated Alloy 600, specimens were exposed for 770 hours to typical PWR primary water condition. During the test, open circuit potentials (OCP's) of all specimens were measured using a reference electrode. Also, resistance to flow accelerated corrosion (FAC) test was examined in order to check the durability of plated layers in high-velocity flow environment at high temperature. After exposures to high flow rate aqueous condition, the integrity of surfaces was confirmed by using both scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). For the field application, a remote process for electroless nickel-plating was demonstrated using a plate specimen with narrow gap on a laboratory scale. Finally, a practical seal design was suggested for more convenient application

A micro-CL system and its applications

Science.gov (United States)

Wei, Zenghui; Yuan, Lulu; Liu, Baodong; Wei, Cunfeng; Sun, Cuili; Yin, Pengfei; Wei, Long

2017-11-01

The computed laminography (CL) method is preferable to computed tomography for the non-destructive testing of plate-like objects. A micro-CL system is developed for three-dimensional imaging of plate-like objects. The details of the micro-CL system are described, including the system architecture, scanning modes, and reconstruction algorithm. The experiment results of plate-like fossils, insulated gate bipolar translator module, ball grid array packaging, and printed circuit board are also presented to demonstrate micro-CL's ability for 3D imaging of flat specimens and universal applicability in various fields.

Fused filament 3D printing of ionic polymer-metal composites (IPMCs)

International Nuclear Information System (INIS)

Carrico, James D; Traeden, Nicklaus W; Leang, Kam K; Aureli, Matteo

2015-01-01

This paper describes a new three-dimensional (3D) fused filament additive manufacturing (AM) technique in which electroactive polymer filament material is used to build soft active 3D structures, layer by layer. Specifically, the unique actuation and sensing properties of ionic polymer-metal composites (IPMCs) are exploited in 3D printing to create electroactive polymer structures for application in soft robotics and bio-inspired systems. The process begins with extruding a precursor material (non-acid Nafion precursor resin) into a thermoplastic filament for 3D printing. The filament is then used by a custom-designed 3D printer to manufacture the desired soft polymer structures, layer by layer. Since at this stage the 3D-printed samples are not yet electroactive, a chemical functionalization process follows, consisting in hydrolyzing the precursor samples in an aqueous solution of potassium hydroxide and dimethyl sulfoxide. Upon functionalization, metal electrodes are applied on the samples through an electroless plating process, which enables the 3D-printed IPMC structures to be controlled by voltage signals for actuation (or to act as sensors). This innovative AM process is described in detail and the performance of 3D printed IPMC actuators is compared to an IPMC actuator fabricated from commercially available Nafion sheet material. The experimental results show comparable performance between the two types of actuators, demonstrating the potential and feasibility of creating functional 3D-printed IPMCs. (paper)

Fused filament 3D printing of ionic polymer-metal composites (IPMCs)

Science.gov (United States)

Carrico, James D.; Traeden, Nicklaus W.; Aureli, Matteo; Leang, Kam K.

2015-12-01

This paper describes a new three-dimensional (3D) fused filament additive manufacturing (AM) technique in which electroactive polymer filament material is used to build soft active 3D structures, layer by layer. Specifically, the unique actuation and sensing properties of ionic polymer-metal composites (IPMCs) are exploited in 3D printing to create electroactive polymer structures for application in soft robotics and bio-inspired systems. The process begins with extruding a precursor material (non-acid Nafion precursor resin) into a thermoplastic filament for 3D printing. The filament is then used by a custom-designed 3D printer to manufacture the desired soft polymer structures, layer by layer. Since at this stage the 3D-printed samples are not yet electroactive, a chemical functionalization process follows, consisting in hydrolyzing the precursor samples in an aqueous solution of potassium hydroxide and dimethyl sulfoxide. Upon functionalization, metal electrodes are applied on the samples through an electroless plating process, which enables the 3D-printed IPMC structures to be controlled by voltage signals for actuation (or to act as sensors). This innovative AM process is described in detail and the performance of 3D printed IPMC actuators is compared to an IPMC actuator fabricated from commercially available Nafion sheet material. The experimental results show comparable performance between the two types of actuators, demonstrating the potential and feasibility of creating functional 3D-printed IPMCs.

Installations having pressurised fluid circuits

International Nuclear Information System (INIS)

Rigg, S.; Grant, J.

1977-01-01

Reference is made to nuclear installations having pressurised coolant flow circuits. Breaches in such circuits may quickly result in much damage to the plant. Devices such as non-return valves, orifice plates, and automatically operated shut-off valves have been provided to prevent or reduce fluid flow through a breached pipe line, but such devices have several disadvantages; they may present large restrictions to normal flow of coolant, and may depend on the operation of ancillary equipment, with consequent delay in bringing them into operation in an emergency. Other expedients that have been adopted to prevent or reduce reverse flow through an upstream breach comprise various forms of hydraulic counter flow brakes. The arrangement described has at least one variable fluid brake comprising a fluidic device connected into a duct in the pressurised circuit, the device having an inlet, an outlet, a vortex chamber between the inlet and outlet, a control jet for introducing fluid into the vortex chamber, connections communicating the inlet and the outlet into one part of the circuit and the control jet into another region at a complementary pressure so that, in the event of a breach in the circuit in one region, fluid passes from the other region to enter the vortex chamber to stimulate pressure to create a flow restricting vortex in the chamber that reduces flow through the breach. The system finds particular application to stream generating pressure tube reactors, such as the steam generating heavy water reactor at UKAEA, Winfrith. (U.K.)

The online sealing performance test of the primary circuit pressure boundary check valve in nuclear power plants

International Nuclear Information System (INIS)

Yang Yunfei; Huang Huimin

2013-01-01

The primary circuit pressure boundary check valves of 320 MW pressurized water reactor is a nuclear grade I key equipment. The sealing demand is very high, which is directly related to the internal leakage rate of the primary circuit system. After the welding check valve is repaired, the sealing performance is judged by color printing checks. If there is water or humid vapor in the pipe, it will affect the accuracy of the color printing checks. For the particularity of the online check valve tightness test, online detecting device is designed by the hydraulic pressure drop method in other nuclear power plants, but the method has some shortcomings and restrictions. In this paper, we design a reliable and portable test equipment by the low-pressure gas seal test flow measurement, which make accurate and quantitative judgment of sealing property after the pressure boundary check valves are repaired. (authors)

Logic circuits composed of flexible carbon nanotube thin-film transistor and ultra-thin polymer gate dielectric

Science.gov (United States)

Lee, Dongil; Yoon, Jinsu; Lee, Juhee; Lee, Byung-Hyun; Seol, Myeong-Lok; Bae, Hagyoul; Jeon, Seung-Bae; Seong, Hyejeong; Im, Sung Gap; Choi, Sung-Jin; Choi, Yang-Kyu

2016-05-01

Printing electronics has become increasingly prominent in the field of electronic engineering because this method is highly efficient at producing flexible, low-cost and large-scale thin-film transistors. However, TFTs are typically constructed with rigid insulating layers consisting of oxides and nitrides that are brittle and require high processing temperatures, which can cause a number of problems when used in printed flexible TFTs. In this study, we address these issues and demonstrate a method of producing inkjet-printed TFTs that include an ultra-thin polymeric dielectric layer produced by initiated chemical vapor deposition (iCVD) at room temperature and highly purified 99.9% semiconducting carbon nanotubes. Our integrated approach enables the production of flexible logic circuits consisting of CNT-TFTs on a polyethersulfone (PES) substrate that have a high mobility (up to 9.76 cm2 V-1 sec-1), a low operating voltage (less than 4 V), a high current on/off ratio (3 × 104), and a total device yield of 90%. Thus, it should be emphasized that this study delineates a guideline for the feasibility of producing flexible CNT-TFT logic circuits with high performance based on a low-cost and simple fabrication process.

Use of computational simulation for evaluation of 3D printed phantoms for application in clinical dosimetry

International Nuclear Information System (INIS)

Valeriano, Caio César Santos

2017-01-01

The purpose of a phantom is to represent the change in the radiation field caused by absorption and scattering in a given tissue or organ of interest. Its geometrical characteristics and composition should be as close as possible to the values associated with its natural analogue. Anatomical structures can be transformed into 3D virtual objects by medical imaging techniques (e.g. Computed Tomography) and printed by rapid prototyping using materials, for example, polylactic acid. Its production for specific patients requires fulfilling requirements such as geometric accuracy with the individual's anatomy and tissue equivalence, so that usable measurements can be made, and be insensitive to the radiation effects. The objective of this work was to evaluate the behavior of 3D printed materials when exposed to different photon beams, with emphasis on the quality of radiotherapy (6 MV), aiming its application in clinical dosimetry. For this, 30 thermoluminescent dosimeters of LiF:Mg,Ti were used. The equivalence between the PMMA and the printed PLA for the thermoluminescent response of 30 dosimeters of CaSO 4 : Dy was also analyzed. The irradiations with radiotherapy photon beams were simulated using the Eclipse TM treatment planning system,with the Anisotropic Analytical Algorithm and the Acuros ® XB Advanced Dose Calculation algorithm. In addition to the use of Eclipse TM and dosimetric tests, computational simulations were realized using the MCNP5 code. Simulations with the MCNP5 code were performed to calculate the attenuation coefficient of printed plates exposed to different radiodiagnosis X-rays qualities and to develop a computational model of 3D printed plates. (author)

Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing

Directory of Open Access Journals (Sweden)

Seok Young Ji

2018-02-01

Full Text Available The development of printing technologies has enabled the realization of electric circuit fabrication on a flexible substrate. However, the current technique remains restricted to single-layer patterning. In this paper, we demonstrate a fully solution-processable patterning approach for multi-layer circuits using a combined method of laser sintering and ablation. Selective laser sintering of silver (Ag nanoparticle-based ink is applied to make conductive patterns on a heat-sensitive substrate and insulating layer. The laser beam path and irradiation fluence are controlled to create circuit patterns for flexible electronics. Microvia drilling using femtosecond laser through the polyvinylphenol-film insulating layer by laser ablation, as well as sequential coating of Ag ink and laser sintering, achieves an interlayer interconnection between multi-layer circuits. The dimension of microvia is determined by a sophisticated adjustment of the laser focal position and intensity. Based on these methods, a flexible electronic circuit with chip-size-package light-emitting diodes was successfully fabricated and demonstrated to have functional operations.

Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing

Science.gov (United States)

Ji, Seok Young; Choi, Wonsuk; Jeon, Jin-Woo; Chang, Won Seok

2018-01-01

The development of printing technologies has enabled the realization of electric circuit fabrication on a flexible substrate. However, the current technique remains restricted to single-layer patterning. In this paper, we demonstrate a fully solution-processable patterning approach for multi-layer circuits using a combined method of laser sintering and ablation. Selective laser sintering of silver (Ag) nanoparticle-based ink is applied to make conductive patterns on a heat-sensitive substrate and insulating layer. The laser beam path and irradiation fluence are controlled to create circuit patterns for flexible electronics. Microvia drilling using femtosecond laser through the polyvinylphenol-film insulating layer by laser ablation, as well as sequential coating of Ag ink and laser sintering, achieves an interlayer interconnection between multi-layer circuits. The dimension of microvia is determined by a sophisticated adjustment of the laser focal position and intensity. Based on these methods, a flexible electronic circuit with chip-size-package light-emitting diodes was successfully fabricated and demonstrated to have functional operations. PMID:29425144

SU-E-T-455: Characterization of 3D Printed Materials for Proton Beam Therapy

International Nuclear Information System (INIS)

Zou, W; Siderits, R; McKenna, M; Khan, A; Yue, N; McDonough, J; Yin, L; Teo, B; Fisher, T

2014-01-01

Purpose: The widespread availability of low cost 3D printing technologies provides an alternative fabrication method for customized proton range modifying accessories such as compensators and boluses. However the material properties of the printed object are dependent on the printing technology used. In order to facilitate the application of 3D printing in proton therapy, this study investigated the stopping power of several printed materials using both proton pencil beam measurements and Monte Carlo simulations. Methods: Five 3–4 cm cubes fabricated using three 3D printing technologies (selective laser sintering, fused-deposition modeling and stereolithography) from five printers were investigated. The cubes were scanned on a CT scanner and the depth dose curves for a mono-energetic pencil beam passing through the material were measured using a large parallel plate ion chamber in a water tank. Each cube was measured from two directions (perpendicular and parallel to printing plane) to evaluate the effects of the anisotropic material layout. The results were compared with GEANT4 Monte Carlo simulation using the manufacturer specified material density and chemical composition data. Results: Compared with water, the differences from the range pull back by the printed blocks varied and corresponded well with the material CT Hounsfield unit. The measurement results were in agreement with Monte Carlo simulation. However, depending on the technology, inhomogeneity existed in the printed cubes evidenced from CT images. The effect of such inhomogeneity on the proton beam is to be investigated. Conclusion: Printed blocks by three different 3D printing technologies were characterized for proton beam with measurements and Monte Carlo simulation. The effects of the printing technologies in proton range and stopping power were studied. The derived results can be applied when specific devices are used in proton radiotherapy

A custom-built PET phantom design for quantitative imaging of printed distributions

International Nuclear Information System (INIS)

Markiewicz, P J; Angelis, G I; Kotasidis, F; Green, M; Matthews, J C; Lionheart, W R; Reader, A J

2011-01-01

This note presents a practical approach to a custom-made design of PET phantoms enabling the use of digital radioactive distributions with high quantitative accuracy and spatial resolution. The phantom design allows planar sources of any radioactivity distribution to be imaged in transaxial and axial (sagittal or coronal) planes. Although the design presented here is specially adapted to the high-resolution research tomograph (HRRT), the presented methods can be adapted to almost any PET scanner. Although the presented phantom design has many advantages, a number of practical issues had to be overcome such as positioning of the printed source, calibration, uniformity and reproducibility of printing. A well counter (WC) was used in the calibration procedure to find the nonlinear relationship between digital voxel intensities and the actual measured radioactive concentrations. Repeated printing together with WC measurements and computed radiography (CR) using phosphor imaging plates (IP) were used to evaluate the reproducibility and uniformity of such printing. Results show satisfactory printing uniformity and reproducibility; however, calibration is dependent on the printing mode and the physical state of the cartridge. As a demonstration of the utility of using printed phantoms, the image resolution and quantitative accuracy of reconstructed HRRT images are assessed. There is very good quantitative agreement in the calibration procedure between HRRT, CR and WC measurements. However, the high resolution of CR and its quantitative accuracy supported by WC measurements made it possible to show the degraded resolution of HRRT brain images caused by the partial-volume effect and the limits of iterative image reconstruction. (note)

The Scope Calculation for the Distribution of the Plate-out in the 'OGL-1' experiment using MIDAS and Its model review

International Nuclear Information System (INIS)

Park, Jong-Hwa; Kim, Dong-Ha; Lee, Won-Jae

2007-01-01

The scope calculation on the plate-out in the HTGR related OGL-1 experiment using the MIDAS code was performed in the frame of the preliminary study to develop the MIDAS/GCR for simulating the plate-out, dust and tritium in a HTGR. From this scope calculation, the user specified type of the fission product vapor species in the circuit and the distribution of the circuit surface temperature were identified as the important factors that can have a strong effect on the distribution of fission product plate out over the HTGR loop. Also the analytical solution for calculating the plate-out by considering a radioactive decay was derived for MIDAS. These identified factors and the new analytical solution will be taken into account in developing the MIDAS/GCR

Thermal cure effects on electromechanical properties of conductive wires by direct ink write for 4D printing and soft machines

Science.gov (United States)

Mu, Quanyi; Dunn, Conner K.; Wang, Lei; Dunn, Martin L.; Qi, H. Jerry; Wang, Tiejun

2017-04-01

Recent developments in soft materials and 3D printing are promoting the rapid development of novel technologies and concepts, such as 4D printing and soft machines, that in turn require new methods for fabricating conductive materials. Despite the ubiquity of silver nanoparticles (NPs) in the conducting electrodes of printed electronic devices, their potential use in stretchable conductors has not been fully explored in 4D printing and soft machines. This paper studies the effect of thermal cure conditions on conductivity and electro-mechanical behaviors of silver ink by the direct ink write (DIW) printing approach. We found that the electro-mechanical properties of silver wires can be tailored by controlling cure time and cure temperature to achieve conductivity as well as stretchability. For the silver NP ink we used in the experiments, silver wires cured at 80 °C for 10-30 min have conductivity >1% bulk silver, Young’s modulus printed silver ink patterns on the surface of 3D printed polymer parts, with the future goal of constructing fully 3D printed arbitrarily formed soft and stretchable devices and of applying them to 4D printing. We demonstrated a fully printed functional soft-matter sensor and a circuit element that can be stretched by as much as 45%.

Non-destructive and non-invasive analyses shed light on the realization technique of ancient polychrome prints

Science.gov (United States)

Striová, Jana; Coccolini, Gabriele; Micheli, Sara; Lofrumento, Cristiana; Galeotti, Monica; Cagnini, Andrea; Castellucci, Emilio Mario

2009-08-01

Five polychrome prints representing famous painters, such as Albrecht Dürer, were analyzed using a non-destructive and non-invasive methodology as required by the artwork typology. The diagnostic strategy includes X-ray fluorescence (XRF), reflectance micro-infrared (μFTIR) and micro-Raman (μRaman) spectroscopy. These prints were realized with a la poupée method that involves application of the polychrome inks on a single copper plate, before the printing process. A broad range of compounds (i.e., cinnabar, red lead, white lead, umber earth, hydrated calcium sulfate, calcium carbonate, amorphous carbon, and Prussian blue) was employed as chalcographic inks, using linseed oil as a binding medium. Gamboge was identified in the delicate finishing brush touches realized in watercolor.

Optimizing the operating parameters of corona electrostatic separation for recycling waste scraped printed circuit boards by computer simulation of electric field.

Science.gov (United States)

Li, Jia; Lu, Hongzhou; Liu, Shushu; Xu, Zhenming

2008-05-01

The printed circuit board (PCB) has a metal content of nearly 28% metal, including an abundance of nonferrous metals such as copper, lead, and tin. The purity of precious metals in PCBs is more than 10 times that of rich-content minerals. Therefore, the recycling of PCBs is an important subject, not only from the viewpoint of waste treatment, but also with respect to the recovery of valuable materials. Compared with traditional process the corona electrostatic separation (CES) had no waste water or gas during the process and it had high productivity with a low-energy cost. In this paper, the roll-type corona electrostatic separator was used to separate metals and nonmetals from scraped waste PCBs. The software MATLAB was used to simulate the distribution of electric field in separating space. It was found that, the variations of parameters of electrodes and applied voltages directly influenced the distribution of electric field. Through the correlation of simulated and experimental results, the good separation results were got under the optimized operating parameter: U=20-30 kV, L=L(1)=L(2)=0.21 m, R(1)=0.114, R(2)=0.019 m, theta(1)=20 degrees and theta(2)=60 degrees .

Use of large pieces of printed circuit boards for bioleaching to avoid 'precipitate contamination problem' and to simplify overall metal recovery.

Science.gov (United States)

Adhapure, N N; Dhakephalkar, P K; Dhakephalkar, A P; Tembhurkar, V R; Rajgure, A V; Deshmukh, A M

2014-01-01

Very recently bioleaching has been used for removing metals from electronic waste. Most of the research has been targeted to using pulverized PCBs for bioleaching where precipitate formed during bioleaching contaminates the pulverized PCB sample and making the overall metal recovery process more complicated. In addition to that, such mixing of pulverized sample with precipitate also creates problems for the final separation of non metallic fraction of PCB sample. In the present investigation we attempted the use of large pieces of printed circuit boards instead of pulverized sample for removal of metals. Use of large pieces of PCBs for bioleaching was restricted due to the chemical coating present on PCBs, the problem has been solved by chemical treatment of PCBs prior to bioleaching. In short,•Large pieces of PCB can be used for bioleaching instead of pulverized PCB sample.•Metallic portion on PCBs can be made accessible to bacteria with prior chemical treatment of PCBs.•Complete metal removal obtained on PCB pieces of size 4 cm × 2.5 cm with the exception of solder traces. The final metal free PCBs (non metallic) can be easily recycled and in this way the overall recycling process (metallic and non metallic part) of PCBs becomes simple.

Modelling of plate-out under gas-cooled reactor (GCR) accident conditions

International Nuclear Information System (INIS)

Taig, A.R.

1981-01-01

The importance of plate-out in mitigating consequences of gas-cooled reactor accidents, and its place in assessing these consequences, are discussed. The data requirements of a plate-out modelling program are discussed, and a brief description is given of parallel work programs on thermal/hydraulic reactor behaviour and fuel modelling, both of which will provide inputs to the plate-out program under development. The representation of a GCR system used in SRD studies is presented, and the equations governing iodine adsorption, desorption and transport round the circuit are derived. The status of SRD's plate-out program is described, and the type of sensitivity studies to be undertaken with the partially-developed computer program in order to identify the most useful lines for future research is discussed. (author)

3D-printing and mechanics of bio-inspired articulated and multi-material structures.

Science.gov (United States)

Porter, Michael M; Ravikumar, Nakul; Barthelat, Francois; Martini, Roberto

2017-09-01

3D-printing technologies allow researchers to build simplified physical models of complex biological systems to more easily investigate their mechanics. In recent years, a number of 3D-printed structures inspired by the dermal armors of various fishes have been developed to study their multiple mechanical functionalities, including flexible protection, improved hydrodynamics, body support, or tail prehensility. Natural fish armors are generally classified according to their shape, material and structural properties as elasmoid scales, ganoid scales, placoid scales, carapace scutes, or bony plates. Each type of dermal armor forms distinct articulation patterns that facilitate different functional advantages. In this paper, we highlight recent studies that developed 3D-printed structures not only to inform the design and application of some articulated and multi-material structures, but also to explain the mechanics of the natural biological systems they mimic. Copyright © 2017 Elsevier Ltd. All rights reserved.

Copper extraction from coarsely ground printed circuit boards using moderate thermophilic bacteria in a rotating-drum reactor

Energy Technology Data Exchange (ETDEWEB)

Rodrigues, Michael L.M., E-mail: mitchel.marques@yahoo.com.br [Bio& Hydrometallurgy Laboratory, Department of Metallurgical and Materials Engineering, Universidade Federal de Ouro Preto, Campus Morro do Cruzeiro, Ouro Preto, MG 35400-000 (Brazil); Leão, Versiane A., E-mail: versiane@demet.em.ufop.br [Bio& Hydrometallurgy Laboratory, Department of Metallurgical and Materials Engineering, Universidade Federal de Ouro Preto, Campus Morro do Cruzeiro, Ouro Preto, MG 35400-000 (Brazil); Gomes, Otavio [Centre for Mineral Technology – CETEM, Av Pedro Calmon, 900, 21941-908 Rio de Janeiro (Brazil); Lambert, Fanny; Bastin, David; Gaydardzhiev, Stoyan [Mineral Processing and Recycling, University of Liege, SartTilman, 4000 Liege (Belgium)

2015-07-15

Highlights: • Copper bioleaching from PCB (20 mm) by moderate thermophiles was demonstrated. • Larger PCB sheets enable a cost reduction due to the elimination of fine grinding. • Crushing generated cracks in PCB increasing the copper extraction. • A pre-treatment step was necessary to remove the lacquer coating. • High copper extractions (85%) were possible with pulp density of up to 25.0 g/L. - Abstract: The current work reports on a new approach for copper bioleaching from Printed Circuit Board (PCB) by moderate thermophiles in a rotating-drum reactor. Initially leaching of PCB was carried out in shake flasks to assess the effects of particle size (−208 μm + 147 μm), ferrous iron concentration (1.25–10.0 g/L) and pH (1.5–2.5) on copper leaching using mesophile and moderate thermophile microorganisms. Only at a relatively low solid content (10.0 g/L) complete copper extraction was achieved from the particle size investigated. Conversely, high copper extractions were possible from coarse-ground PCB (20 mm-long) working with increased solids concentration (up to 25.0 g/L). Because there was as the faster leaching kinetics at 50 °C Sulfobacillus thermosulfidooxidans was selected for experiments in a rotating-drum reactor with the coarser-sized PCB sheets. Under optimal conditions, copper extraction reached 85%, in 8 days and microscopic observations by SEM–EDS of the on non-leached and leached material suggested that metal dissolution from the internal layers was restricted by the fact that metal surface was not entirely available and accessible for the solution in the case of the 20 mm-size sheets.

Copper extraction from coarsely ground printed circuit boards using moderate thermophilic bacteria in a rotating-drum reactor

International Nuclear Information System (INIS)

Rodrigues, Michael L.M.; Leão, Versiane A.; Gomes, Otavio; Lambert, Fanny; Bastin, David; Gaydardzhiev, Stoyan

2015-01-01

Highlights: • Copper bioleaching from PCB (20 mm) by moderate thermophiles was demonstrated. • Larger PCB sheets enable a cost reduction due to the elimination of fine grinding. • Crushing generated cracks in PCB increasing the copper extraction. • A pre-treatment step was necessary to remove the lacquer coating. • High copper extractions (85%) were possible with pulp density of up to 25.0 g/L. - Abstract: The current work reports on a new approach for copper bioleaching from Printed Circuit Board (PCB) by moderate thermophiles in a rotating-drum reactor. Initially leaching of PCB was carried out in shake flasks to assess the effects of particle size (−208 μm + 147 μm), ferrous iron concentration (1.25–10.0 g/L) and pH (1.5–2.5) on copper leaching using mesophile and moderate thermophile microorganisms. Only at a relatively low solid content (10.0 g/L) complete copper extraction was achieved from the particle size investigated. Conversely, high copper extractions were possible from coarse-ground PCB (20 mm-long) working with increased solids concentration (up to 25.0 g/L). Because there was as the faster leaching kinetics at 50 °C Sulfobacillus thermosulfidooxidans was selected for experiments in a rotating-drum reactor with the coarser-sized PCB sheets. Under optimal conditions, copper extraction reached 85%, in 8 days and microscopic observations by SEM–EDS of the on non-leached and leached material suggested that metal dissolution from the internal layers was restricted by the fact that metal surface was not entirely available and accessible for the solution in the case of the 20 mm-size sheets

An inkjet-printed buoyant 3-D lagrangian sensor for real-time flood monitoring

KAUST Repository

Farooqui, Muhammad Fahad

2014-06-01

A 3-D (cube-shaped) Lagrangian sensor, inkjet printed on a paper substrate, is presented for the first time. The sensor comprises a transmitter chip with a microcontroller completely embedded in the cube, along with a $1.5 \\\\lambda 0 dipole that is uniquely implemented on all the faces of the cube to achieve a near isotropic radiation pattern. The sensor has been designed to operate both in the air as well as water (half immersed) for real-time flood monitoring. The sensor weighs 1.8 gm and measures 13 mm$\\\\,\\\\times\\\\,$ 13 mm$\\\\,\\\\times\\\\,$ 13 mm, and each side of the cube corresponds to only $0.1 \\\\lambda 0 (at 2.4 GHz). The printed circuit board is also inkjet-printed on paper substrate to make the sensor light weight and buoyant. Issues related to the bending of inkjet-printed tracks and integration of the transmitter chip in the cube are discussed. The Lagrangian sensor is designed to operate in a wireless sensor network and field tests have confirmed that it can communicate up to a distance of 100 m while in the air and up to 50 m while half immersed in water. © 1963-2012 IEEE.

Divertor plate for thermonuclear reactor

International Nuclear Information System (INIS)

Yamazaki, Seiichiro; Sato, Keisuke; Nishio, Satoshi.

1993-01-01

In a divertor plate for a thermonuclear reactor, adjacent cooling pipes are electrically insulated from each other and pipes made of a gradient functional material prepared by compositing ceramics having an insulation property and metals are metallurgically joined to at least one portion of each of the cooling pipes. Electric current caused upon occurrence of plasma disruption is interrupted by the insulation portion, so that a large circuit is not formed and electromagnetic force is decreased to such a extent that the divertor plate is not ruptured. Since a header of the cooling pipes can be installed at any optional position, the installation space can be reduced. Further, since inlet and exit collection headers can be disposed on both ends of the cooling pipes, it is possible to shorten the length of the cooling pipe of the divertor plate corresponded to high heat fluxes and reduce the pressure loss on the side of coolants to about 1/2. Further, turn back portions of small radius of curvature of the cooling pipes are eliminated to reduce the cost and extend the lifetime and, in addition, protection tiles can be attached easily. (N.H.)

EGaIn-Assisted Room-Temperature Sintering of Silver Nanoparticles for Stretchable, Inkjet-Printed, Thin-Film Electronics.

Science.gov (United States)

Tavakoli, Mahmoud; Malakooti, Mohammad H; Paisana, Hugo; Ohm, Yunsik; Marques, Daniel Green; Alhais Lopes, Pedro; Piedade, Ana P; de Almeida, Anibal T; Majidi, Carmel

2018-05-29

Coating inkjet-printed traces of silver nanoparticle (AgNP) ink with a thin layer of eutectic gallium indium (EGaIn) increases the electrical conductivity by six-orders of magnitude and significantly improves tolerance to tensile strain. This enhancement is achieved through a room-temperature "sintering" process in which the liquid-phase EGaIn alloy binds the AgNP particles (≈100 nm diameter) to form a continuous conductive trace. Ultrathin and hydrographically transferrable electronics are produced by printing traces with a composition of AgNP-Ga-In on a 5 µm-thick temporary tattoo paper. The printed circuit is flexible enough to remain functional when deformed and can support strains above 80% with modest electromechanical coupling (gauge factor ≈1). These mechanically robust thin-film circuits are well suited for transfer to highly curved and nondevelopable 3D surfaces as well as skin and other soft deformable substrates. In contrast to other stretchable tattoo-like electronics, the low-cost processing steps introduced here eliminate the need for cleanroom fabrication and instead requires only a commercial desktop printer. Most significantly, it enables functionalities like "electronic tattoos" and 3D hydrographic transfer that have not been previously reported with EGaIn or EGaIn-based biphasic electronics. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Digital Textile Printing

OpenAIRE

Moltchanova, Julia

2011-01-01

Rapidly evolving technology of digital printing opens new opportunities on many markets. One of them is the printed fabric market where printing companies as well as clients benefit from new printing methods. This thesis focuses on the digital textile printing technology and its implementation for fabric-on-demand printing service in Finland. The purpose of this project was to study the technology behind digital textile printing, areas of application of this technology, the requirements ...

Water cooling in nuclear reactors by using panels of integrated circuits

International Nuclear Information System (INIS)

Dominique, P.; Letissier, R.

1977-01-01

In view of the drawbacks of wet cooling towers, EDF is searching for another approach to the problem. A self-cleaning device is now envisaged, that consists in some exchanger plates, 30 to 40m height (max. 60m) capable of being hiden in the lanscape behind high trees. The plates would be rather smooth and the air circulated by natural convection. The prototype is composed of 960 aluminium panels of integrated circuits mounted on three modules made of tubular elements working as supporting and collecting means together [fr

MOCVD ZnO/Screen Printed Ag Back Reflector for Flexible Thin Film Silicon Solar Cell Application

Directory of Open Access Journals (Sweden)

Amornrat Limmanee

2014-01-01

Full Text Available We have prepared Ag back electrode by screen printing technique and developed MOCVD ZnO/screen printed Ag back reflector for flexible thin film silicon solar cell application. A discontinuity and poor contact interface between the MOCVD ZnO and screen printed Ag layers caused poor open circuit voltage (Voc and low fill factor (FF; however, an insertion of a thin sputtered ZnO layer at the interface could solve this problem. The n type hydrogenated amorphous silicon (a-Si:H film is preferable for the deposition on the surface of MOCVD ZnO film rather than the microcrystalline film due to its less sensitivity to textured surface, and this allowed an improvement in the FF. The n-i-p flexible amorphous silicon solar cell using the MOCVD ZnO/screen printed Ag back reflector showed an initial efficiency of 6.2% with Voc=0.86 V, Jsc=12.4 mA/cm2, and FF = 0.58 (1 cm2. The identical quantum efficiency and comparable performance to the cells using conventional sputtered Ag back electrode have verified the potential of the MOCVD ZnO/screen printed Ag back reflector and possible opportunity to use the screen printed Ag thick film for flexible thin film silicon solar cells.

Laser printed glass planar lightwave circuits with integrated fiber alignment structures

Science.gov (United States)

Desmet, A.; Radosavljevic, A.; Missinne, J.; Van Thourhout, D.; Van Steenberge, G.

2018-02-01

Femtosecond laser inscription allows straightforward manufacturing of glass planar lightwave circuits such as waveguides, interferometers, directional couplers, resonators and more complex structures. Fiber alignment structures are needed to facilitate communication with the glass planar lightwave circuit. In this study, a technique is described to create optical waveguides and alignment structures in the same laser exposure step. Using an industrial ytterbium-doped 1030 nm fiber laser pulses of 400 fs were focused into glass with a 0.4 NA objective causing permanent alteration of the material. Depending on laser parameters this modification allows direct writing of waveguides or the creation of channels after exposing the irradiated volumes to an etchant such as KOH. Writing of channels and waveguides with different laser powers, frequencies, polarisations, stage translation speeds and scan densities were investigated in fused silica and borosilicate glass. Waveguides with controlled dimensions were created, as well as etched U-grooves with a diameter of 126 μm and a sidewall roughness Ra of 255 nm. Cut back measurements were performed giving a waveguide propagation loss of 1.1 dB/cm in borosilicate glass. A coupling loss of 0.7 dB was measured for a transition between the waveguide and standard single mode fiber at 1550 nm, using index matching liquid. The described technique eliminates active alignment requirements and is useful for many applications such as microfluidic sensing, PLCs, fan-out connectors for multicore fibers and quantum optical networks.

Embedding electromagnetic band gap structures in printed circuit boards for electromagnetic interference reduction

NARCIS (Netherlands)

Tereshchenko, O.V.

2015-01-01

Due to the tendency of faster data rates and lower power supply voltage in the integrated circuit (IC) design, Simultaneously Switching Noise (SSN) and ground bounce become serious concerns for designers and testers. This noise can be a source of electromagnetic interference (EMI). It propagates

Thermal characterization of screen printed conductive pastes for RFID antennas

Energy Technology Data Exchange (ETDEWEB)

Janeczek, Kamil, E-mail: kamil.janeczek@itr.org.pl [Tele and Radio Research Institute, 11 Ratuszowa Street, 03-450 Warsaw (Poland); Jakubowska, Malgorzata [Institute of Electronic Materials Technology, 133 Wolczynska Street, 01-919 Warsaw (Poland); Warsaw University of Technology, Institute of Metrology and Biomedical Engineering, 8 Sankt Andrzej Bobola Street, 02-525 Warsaw (Poland); Mlozniak, Anna [Institute of Electronic Materials Technology, 133 Wolczynska Street, 01-919 Warsaw (Poland); Koziol, Grazyna [Tele and Radio Research Institute, 11 Ratuszowa Street, 03-450 Warsaw (Poland)

2012-09-01

Thermal resistance is an essential aspect of electronic circuits designing. It leads to unexpected changes in electronic components during their work. In this study, new materials for screen printed RFID tag's antennas were characterized in terms of their resistance to thermal exposure. Polymer materials containing silver flakes, silver nanopowder, carbon nanotubes or conductive polymer PEDOT:PSS were elaborated and used for antenna printing on flexible materials. In order to verify their long term susceptibility to damages caused by the changing environmental conditions, the temperature cycling test was used in three different temperature ranges: +65 Degree-Sign C, -12 Degree-Sign C, -40 Degree-Sign C/+85 Degree-Sign C (3 h in each temp., dwell time 1 h). The highest durability to thermal exposure exhibited the paste with carbon nanotubes dispersed in poly(methyl methacrylate) PMMA and the lowest one - the paste with conductive polymer PEDOT:PSS.

Thermal characterization of screen printed conductive pastes for RFID antennas

International Nuclear Information System (INIS)

Janeczek, Kamil; Jakubowska, Małgorzata; Młożniak, Anna; Kozioł, Grażyna

2012-01-01

Thermal resistance is an essential aspect of electronic circuits designing. It leads to unexpected changes in electronic components during their work. In this study, new materials for screen printed RFID tag's antennas were characterized in terms of their resistance to thermal exposure. Polymer materials containing silver flakes, silver nanopowder, carbon nanotubes or conductive polymer PEDOT:PSS were elaborated and used for antenna printing on flexible materials. In order to verify their long term susceptibility to damages caused by the changing environmental conditions, the temperature cycling test was used in three different temperature ranges: +65 °C, −12 °C, −40 °C/+85 °C (3 h in each temp., dwell time 1 h). The highest durability to thermal exposure exhibited the paste with carbon nanotubes dispersed in poly(methyl methacrylate) PMMA and the lowest one – the paste with conductive polymer PEDOT:PSS.

Direct Printing of Stretchable Elastomers for Highly Sensitive Capillary Pressure Sensors.

Science.gov (United States)

Liu, Wenguang; Yan, Chaoyi

2018-03-28

We demonstrate the successful fabrication of highly sensitive capillary pressure sensors using an innovative 3D printing method. Unlike conventional capacitive pressure sensors where the capacitance changes were due to the pressure-induced interspace variations between the parallel plate electrodes, in our capillary sensors the capacitance was determined by the extrusion and extraction of liquid medium and consequent changes of dielectric constants. Significant pressure sensitivity advances up to 547.9 KPa -1 were achieved. Moreover, we suggest that our innovative capillary pressure sensors can adopt a wide range of liquid mediums, such as ethanol, deionized water, and their mixtures. The devices also showed stable performances upon repeated pressing cycles. The direct and versatile printing method combined with the significant performance advances are expected to find important applications in future stretchable and wearable electronics.

Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

Science.gov (United States)

de la Broïse, Xavier; Le Coguie, Alain; Sauvageot, Jean-Luc; Pigot, Claude; Coppolani, Xavier; Moreau, Vincent; d'Hollosy, Samuel; Knarosovski, Timur; Engel, Andreas

2018-05-01

We have successively developed two superconducting flexible PCBs for cryogenic applications. The first one is monolayer, includes 552 tracks (10 µm wide, 20 µm spacing), and receives 24 wire-bonded integrated circuits. The second one is multilayer, with one track layer between two shielding layers interconnected by microvias, includes 37 tracks, and can be interconnected at both ends by wire bonding or by connectors. The first cold measurements have been performed and show good performances. The novelty of these products is, for the first one, the association of superconducting materials with very narrow pitch and bonded integrated circuits and, for the second one, the introduction of a superconducting multilayer structure interconnected by vias which is, to our knowledge, a world-first.

A circuit design for front-end read-out electronics of beam homogeneity measurement

International Nuclear Information System (INIS)

She Qianshun; Su Hong; Xu Zhiguo; Ma Xiaoli; Hu Zhengguo; Mao Ruishi; Xu Hushan

2011-01-01

It introduces a circuit design of beam homogeneity measurement for heavy ion beam in the monitoring needs, which convert multichannel weak current from 10 pA to 100 nA of the output of parallel plate avalanche counter (PPAC) for large area with sensitive two-dimensional position to voltage signal from -2 V to -20 mV by current-voltage-converter (IVC) circuit which composed of T-feedback resistor networks, combined with data acquisition and processing system realized the beam homogeneity measurement in heavy ion tumor therapy of the Institute of Modern Physics. Experiments have shown that the circuit with speed and high precision. This circuit can be used for read-out of the beam for the Multiwire Proportional Chamber, Faraday Cup and other weak current sources. (authors)

Method of forming electronically conducting polymers on conducting and nonconducting substrates

Science.gov (United States)

Murphy, Oliver J. (Inventor); Hitchens, G. Duncan (Inventor); Hodko, Dalibor (Inventor); Clarke, Eric T. (Inventor); Miller, David L. (Inventor); Parker, Donald L. (Inventor)

2001-01-01

The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These solutions can be used in applications including printed circuit boards and through-hole plating and enable direct metallization processes on non-conducting substrates. After forming the conductive polymer patterns, a printed wiring board can be formed by sensitizing the polymer with palladium and electrolytically depositing copper.

Design, construction and tests of the power crowbar and predischarge circuit of the SPICA II experiment

International Nuclear Information System (INIS)

Ingen, A.M. van; Manintveld, P.; Sterk, A.B.

1983-01-01

A 28 Farad, 1.8 MJ electrolytic capacitor power-crowbar battery and a flexible predischarge circuit for the SPICA II screw-pinch experiment is described. The battery is capable of delivering the toroidal and poloidal currents of more than 2.5 MA, during at least 1 ms after crowbarring of the high-voltage capacitor banks. To obtain a low short-circuit impedance a very compact construction was chosen, which resulted in seven modules of about 1 m 3 each, Rsub(i) = 100 μΩ, Lsub(i) = 7 nH, connected by plate systems to the main circuit. The predischarge circuit consists of a fast capacitor bank to start the predischarge and a slow circuit with a clamp switch to preheat the discharge. (author)

The influence of finite cavities on the sound insulation of double-plate structures.

Science.gov (United States)

Brunskog, Jonas

2005-06-01

Lightweight walls are often designed as frameworks of studs with plates on each side--a double-plate structure. The studs constitute boundaries for the cavities, thereby both affecting the sound transmission directly by short-circuiting the plates, and indirectly by disturbing the sound field between the plates. The paper presents a deterministic prediction model for airborne sound insulation including both effects of the studs. A spatial transform technique is used, taking advantage of the periodicity. The acoustic field inside the cavities is expanded by means of cosine-series. The transmission coefficient (angle-dependent and diffuse) and transmission loss are studied. Numerical examples are presented and comparisons with measurement are performed. The result indicates that a reasonably good agreement between theory and measurement can be achieved.

A new model for simulating microbial cyanide production and optimizing the medium parameters for recovering precious metals from waste printed circuit boards.

Science.gov (United States)

Yuan, Zhihui; Ruan, Jujun; Li, Yaying; Qiu, Rongliang

2018-04-10

Bioleaching is a green recycling technology for recovering precious metals from waste printed circuit boards (WPCBs). However, this technology requires increasing cyanide production to obtain desirable recovery efficiency. Luria-Bertani medium (LB medium, containing tryptone 10 g/L, yeast extract 5 g/L, NaCl 10 g/L) was commonly used in bioleaching of precious metal. In this study, results showed that LB medium did not produce highest yield of cyanide. Under optimal culture conditions (25 °C, pH 7.5), the maximum cyanide yield of the optimized medium (containing tryptone 6 g/L and yeast extract 5 g/L) was 1.5 times as high as that of LB medium. In addition, kinetics and relationship of cell growth and cyanide production was studied. Data of cell growth fitted logistics model well. Allometric model was demonstrated effective in describing relationship between cell growth and cyanide production. By inserting logistics equation into allometric equation, we got a novel hybrid equation containing five parameters. Kinetic data for cyanide production were well fitted to the new model. Model parameters reflected both cell growth and cyanide production process. Copyright © 2018 Elsevier B.V. All rights reserved.

Use of large pieces of printed circuit boards for bioleaching to avoid ‘precipitate contamination problem’ and to simplify overall metal recovery

Science.gov (United States)

Adhapure, N.N.; Dhakephalkar, P.K.; Dhakephalkar, A.P.; Tembhurkar, V.R.; Rajgure, A.V.; Deshmukh, A.M.

2014-01-01

Very recently bioleaching has been used for removing metals from electronic waste. Most of the research has been targeted to using pulverized PCBs for bioleaching where precipitate formed during bioleaching contaminates the pulverized PCB sample and making the overall metal recovery process more complicated. In addition to that, such mixing of pulverized sample with precipitate also creates problems for the final separation of non metallic fraction of PCB sample. In the present investigation we attempted the use of large pieces of printed circuit boards instead of pulverized sample for removal of metals. Use of large pieces of PCBs for bioleaching was restricted due to the chemical coating present on PCBs, the problem has been solved by chemical treatment of PCBs prior to bioleaching. In short,•Large pieces of PCB can be used for bioleaching instead of pulverized PCB sample.•Metallic portion on PCBs can be made accessible to bacteria with prior chemical treatment of PCBs.•Complete metal removal obtained on PCB pieces of size 4 cm × 2.5 cm with the exception of solder traces. The final metal free PCBs (non metallic) can be easily recycled and in this way the overall recycling process (metallic and non metallic part) of PCBs becomes simple. PMID:26150951

The best printing methods to print satellite images

Directory of Open Access Journals (Sweden)

G.A. Yousif

2011-12-01

In this paper different printing systems were used to print an image of SPOT-4 satellite, caver part of Sharm Elshekh area, Sinai, Egypt, on the same type of paper as much as possible, especially in the photography. This step is followed by measuring the experimental data, and analyzed colors to determine the best printing systems for satellite image printing data. The laser system is the more printing system where produce a wider range of color and highest densities of ink and access much color detail. Followed by the offset system which it recorded the best dot gain. Moreover, the study shows that it can use the advantages of each method according to the satellite image color and quantity to be produced.

Characterization and mechanical separation of metals from computer Printed Circuit Boards (PCBs) based on mineral processing methods.

Science.gov (United States)

Sarvar, Mojtaba; Salarirad, Mohammad Mehdi; Shabani, Mohammad Amin

2015-11-01

In this paper, a novel mechanical process is proposed for enriching metal content of computer Printed Circuit Boards (PCBs). The PCBs are crushed and divided into three different size fractions namely: -0.59, +0.59 to 1.68 and +1.68 mm. Wet jigging and froth flotation methods are selected for metal enrichment. The coarse size fraction (+1.68 mm) is processed by jigging. The plastic free product is grinded and screened. The oversized product is separated as the first concentrate. It was rich of metal because the grinding process was selective. The undersized product is processed by froth flotation. Based on the obtained results, the middle size fraction (+0.59 to 1.68 mm) and the small size fraction (-0.59 mm) are processed by wet jigging and froth flotation respectively. The wet jigging process is optimized by investigating the effect of pulsation frequency and water flow rate. The results of examining the effect of particle size, solid to liquid ratio, conditioning time and using apolar collector showed that collectorless flotation is a promising method for separating nonmetals of PCBs. 95.6%, 97.5% and 85% of metal content of coarse size, middle size and small size fraction are recovered. The grades of obtained concentrates were 63.3%, 92.5% and 75% respectively. The total recovery is calculated as 95.64% and the grade of the final concentrate was 71.26%. Determining the grade of copper and gold in the final product reveals that 4.95% of copper and 24.46% of gold are lost during the concentration. The major part of the lost gold is accumulated in froth flotation tail. Copyright © 2015 Elsevier Ltd. All rights reserved.

High-throughput shadow mask printing of passive electrical components on paper by supersonic cluster beam deposition

Energy Technology Data Exchange (ETDEWEB)

Caruso, Francesco; Bellacicca, Andrea; Milani, Paolo, E-mail: pmilani@mi.infn.it [CIMaINa and Dipartimento di Fisica, Università degli Studi di Milano, Via Celoria 16, 20133 Milano (Italy)

2016-04-18

We report the rapid prototyping of passive electrical components (resistors and capacitors) on plain paper by an additive and parallel technology consisting of supersonic cluster beam deposition (SCBD) coupled with shadow mask printing. Cluster-assembled films have a growth mechanism substantially different from that of atom-assembled ones providing the possibility of a fine tuning of their electrical conduction properties around the percolative conduction threshold. Exploiting the precise control on cluster beam intensity and shape typical of SCBD, we produced, in a one-step process, batches of resistors with resistance values spanning a range of two orders of magnitude. Parallel plate capacitors with paper as the dielectric medium were also produced with capacitance in the range of tens of picofarads. Compared to standard deposition technologies, SCBD allows for a very efficient use of raw materials and the rapid production of components with different shape and dimensions while controlling independently the electrical characteristics. Discrete electrical components produced by SCBD are very robust against deformation and bending, and they can be easily assembled to build circuits with desired characteristics. The availability of large batches of these components enables the rapid and cheap prototyping and integration of electrical components on paper as building blocks of more complex systems.

Increasing dimension of structures by 4D printing shape memory polymers via fused deposition modeling

Science.gov (United States)

Hu, G. F.; Damanpack, A. R.; Bodaghi, M.; Liao, W. H.

2017-12-01

The main objective of this paper is to introduce a 4D printing method to program shape memory polymers (SMPs) during fabrication process. Fused deposition modeling (FDM) as a filament-based printing method is employed to program SMPs during depositing the material. This method is implemented to fabricate complicated polymeric structures by self-bending features without need of any post-programming. Experiments are conducted to demonstrate feasibility of one-dimensional (1D)-to 2D and 2D-to-3D self-bending. It is shown that 3D printed plate structures can transform into masonry-inspired 3D curved shell structures by simply heating. Good reliability of SMP programming during printing process is also demonstrated. A 3D macroscopic constitutive model is established to simulate thermo-mechanical features of the printed SMPs. Governing equations are also derived to simulate programming mechanism during printing process and shape change of self-bending structures. In this respect, a finite element formulation is developed considering von-Kármán geometric nonlinearity and solved by implementing iterative Newton-Raphson scheme. The accuracy of the computational approach is checked with experimental results. It is demonstrated that the theoretical model is able to replicate the main characteristics observed in the experiments. This research is likely to advance the state of the art FDM 4D printing, and provide pertinent results and computational tool that are instrumental in design of smart materials and structures with self-bending features.

Dry aerosol jet printing of conductive silver lines on a heated silicon substrate

Science.gov (United States)

Efimov, A. A.; Arsenov, P. V.; Protas, N. V.; Minkov, K. N.; Urazov, M. N.; Ivanov, V. V.

2018-02-01

A new method for dry aerosol jet printing conductive lines on a heated substrate is presented. The method is based on the use of a spark discharge generator as a source of dry nanoparticles and a heating plate for their sintering. This method allows creating conductive silver lines on a heated silicon substrate up to 300 °C without an additional sintering step. It was found that for effective sintering lines of silver nanoparticles the temperature of the heated substrate should be about more than 200-250 °C. Average thickness of the sintered silver lines was equal to ∼20 µm. Printed lines showed electrical resistivity equal to 35 μΩ·cm, which is 23 times greater than the resistivity of bulk silver.